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Sample records for air solder leveling

  1. Age-aware solder performance models : level 2 milestone completion.

    SciTech Connect

    Neilsen, Michael K.; Vianco, Paul Thomas; Neidigk, Matthew Aaron; Holm, Elizabeth Ann

    2010-09-01

    Legislated requirements and industry standards are replacing eutectic lead-tin (Pb-Sn) solders with lead-free (Pb-free) solders in future component designs and in replacements and retrofits. Since Pb-free solders have not yet seen service for long periods, their long-term behavior is poorly characterized. Because understanding the reliability of Pb-free solders is critical to supporting the next generation of circuit board designs, it is imperative that we develop, validate and exercise a solder lifetime model that can capture the thermomechanical response of Pb-free solder joints in stockpile components. To this end, an ASC Level 2 milestone was identified for fiscal year 2010: Milestone 3605: Utilize experimentally validated constitutive model for lead-free solder to simulate aging and reliability of solder joints in stockpile components. This report documents the completion of this milestone, including evidence that the milestone completion criteria were met and a summary of the milestone Program Review.

  2. Wave soldering with Pb-free solders

    SciTech Connect

    Artaki, I.; Finley, D.W.; Jackson, A.M.; Ray, U.; Vianco, P.T.

    1995-07-01

    The manufacturing feasibility and attachment reliability of a series of newly developed lead-free solders were investigated for wave soldering applications. Some of the key assembly aspects addressed included: wettability as a function of board surface finish, flux activation and surface tension of the molten solder, solder joint fillet quality and optimization of soldering thermal profiles. Generally, all new solder formulations exhibited adequate wave soldering performance and can be considered as possible alternatives to eutectic SnPb for wave soldering applications. Further process optimization and flux development is necessary to achieve the defect levels associated with the conventional SnPb process.

  3. Solder Bonding for Power Transistors

    NASA Technical Reports Server (NTRS)

    Snytsheuvel, H. A.; Mandel, H.

    1985-01-01

    Indium solder boosts power rating and facilitates circuit changes. Efficient heat conduction from power transistor to heat sink provided by layer of indium solder. Low melting point of indium solder (141 degrees C) allows power transistor to be removed, if circuit must be reworked, without disturbing other components mounted with ordinary solder that melts at 181 degrees C. Solder allows devices operated at higher power levels than does conventional attachment by screws.

  4. Comparison of high speed impact test of solder joints with board level drop test

    NASA Astrophysics Data System (ADS)

    Guruprasad, Pradosh

    Efforts have been made in this study to evaluate the characteristics of solder joint failure by using a new high speed impact tester. First, the dynamics and characteristics of the test vehicle in a board level drop test have been evaluated. A thorough understanding of the behavior of the test vehicle is examined by characterizing its response under different test profiles and board dimensions. This is done in an attempt to optimize the test procedure used to qualify electronic products subjected to high strain rate drop/shock environment. The effects of peak acceleration and change in velocity of the impact pulse on the reliability of the test vehicle have been studied. In situ strain measurements have been used to aid us in characterizing the board response under high strain rate loading conditions. Also finite element analysis has been used to better understand the board response under different loading conditions. Based on the experimental results and analysis, ways to improvise the drop test setup have been discussed. A more thorough understanding of the solder joint behavior is examined by characterizing the behavior with respect to varying impact profiles on a new pendulum fatigue and a high speed impact tester. This is done in an attempt to address solder joint failures in actual product that may be operating under high strain rate or shock environments and to reduce the actual test time needed for a board level drop test. Comparison between the high speed pendulum impact test and drop test was primarily made by evaluating the failure modes from these two tests. Energy absorbed by the solder in a single impact has been used to predict the reliability in a board level test.

  5. Organic solderability preservation evaluation. Topical report

    SciTech Connect

    Becka, G.A.; McHenry, M.R.; Slanina, J.T.

    1997-03-01

    An evaluation was conducted to determine the possible replacement of the hot air solder leveling (HASL) process used in the Allied Signal Federal Manufacturing & Technologies (FM&T) Printed Wiring Board Facility with an organic solderability preservative (OSP). The drivers for replacing HASL include (1) Eliminating lead from PWB fabrication processes; (2) Potential legislation restricting use of lead, (3) Less expensive processing utilizing OSP rather than HASL processing; (4) Avoiding solder dross disposal inherent with HASL processing, (5) OSP provides flat, planar surface required for surface mount technology product, and (6) Trend to thinner PWB designs. A reduction in the cost of nonconformance (CONC) due to HASL defects (exposed copper, solderability, dewetting and non-wetting) would be realized with the incorporation of the OSP process. Several supplier HASL replacement candidates were initially evaluated. One supplier chemistry was chosen for potential use in the FM&T PWB and assembly areas.

  6. Lead-free solder

    DOEpatents

    Anderson, Iver E.; Terpstra, Robert L.

    2001-05-15

    A Sn--Ag--Cu eutectic alloy is modified with one or more low level and low cost alloy additions to enhance high temperature microstructural stability and thermal-mechanical fatigue strength without decreasing solderability. Purposeful fourth or fifth element additions in the collective amount not exceeding about 1 weight % (wt. %) are added to Sn--Ag--Cu eutectic solder alloy based on the ternary eutectic Sn--4.7%Ag--1.7%Cu (wt. %) and are selected from the group consisting essentially of Ni, Fe, and like-acting elements as modifiers of the intermetallic interface between the solder and substrate to improve high temperature solder joint microstructural stability and solder joint thermal-mechanical fatigue strength.

  7. Gelatin based on Power-gel.TM. as solders for Cr.sup.4+laser tissue welding and sealing of lung air leak and fistulas in organs

    DOEpatents

    Alfano, Robert R.; Tang, Jing; Evans, Jonathan M.; Ho, Peng Pei

    2006-04-25

    Laser tissue welding can be achieved using tunable Cr.sup.4+ lasers, semiconductor lasers and fiber lasers, where the weld strength follows the absorption spectrum of water. The use of gelatin and esterified gelatin as solders in conjunction with laser inducted tissue welding impart much stronger tensile and torque strengths than albumin solders. Selected NIR wavelength from the above lasers can improve welding and avoid thermal injury to tissue when used alone or with gelatin and esterified gelatin solders. These discoveries can be used to enhance laser tissue welding of tissues such as skin, mucous, bone, blood vessel, nerve, brain, liver, pancreas, spleen, kidney, lung, bronchus, respiratory track, urinary tract, gastrointestinal tract, or gynecologic tract and as a sealant for pulmonary air leaks and fistulas such as intestinal, rectal and urinary fistulas.

  8. Electroluminescence Observation of Microcrack Growth Behavior of Crystalline Silicon Solar Modules Fabricated by Hot-Air Soldering Technology

    NASA Astrophysics Data System (ADS)

    Lin, Keh-Moh; Lee, Yang-Hsien; Wang, Li-Kuo; Chen, Li-Wei; Yang, Sian-Yi; Chen, Yi-Chia; Liu, De-Chih; Huang, Ming-Yuan; Wu, Zhen-Cheng; Chen, Chien-Pin

    In this study, the quality degradation of Si-based photovoltaic (PV) modules during the aging process was observed by using electroluminescent (EL) technology and was verified by the IV curve measurements in order to find out the occurring timing of damages on solar cells. Furthermore, the influences of solder materials and soldering temperatures on the performance of the PV modules were also studied. Experiment results show that, high soldering temperatures which induce high thermal stress can easily lead to the power loss of the PV modules. Besides, the mechanical properties of the solar cells itself can also affect the degradation rate of the PV modules. On PV modules soldered with SnPb (SP) solder, more than 80% of cell damages occurred during the soldering and encapsulation processes. When SnAgPb (SAP) solder was used, a small part of the cell damages didn't emerge until the initial stage of the thermal cycling test (TC.) This phenomenon is attributed to the reduction of residual stress between the ribbon and the silver paste because of the good wettability of SAP solder.

  9. Failure Analysis of Board-Level Sn-Ag-Cu Solder Interconnections Under JEDEC Standard Drop Test

    NASA Astrophysics Data System (ADS)

    Zhang, Bo; Xi, Jing Si; Liu, Pin Kuan; Ding, Han

    2013-09-01

    This work investigates the board-level drop reliability of printed circuit boards (PCBs) assembled using three chip-size packages subjected to Joint Electron Device Engineering Council (JEDEC) standard drop test condition B. The acceleration and dynamic strain responses at several locations of the board-level package in the time and frequency domain are comprehensively investigated. The results in the time domain suggest that the dynamic response of the board-level package has two phases: forced vibration and free vibration. The maximum response occurs at the first half free vibration cycle. The acceleration response at the center of the PCB is larger than at the edges, whereas the dynamic strain response is just the opposite. The results in the frequency domain show that the first mode is fundamental. In addition, failure analysis is performed using the dye-and-pry test and cross-section test, suggesting that the brittle cracking occurs at the layer between the integrated circuit (IC) pad and the solder, not only through intermetallic compound (IMC) but also along the surface between the IC pad and IMC.

  10. Impact of 5% NaCl Salt Spray Pretreatment on the Long-Term Reliability of Wafer-Level Packages with Sn-Pb and Sn-Ag-Cu Solder Interconnects

    NASA Astrophysics Data System (ADS)

    Liu, Bo; Lee, Tae-Kyu; Liu, Kuo-Chuan

    2011-10-01

    Understanding the sensitivity of Pb-free solder joint reliability to various environmental conditions, such as corrosive gases, low temperatures, and high-humidity environments, is a critical topic in the deployment of Pb-free products in various markets and applications. The work reported herein concerns the impact of a marine environment on Sn-Pb and Sn-Ag-Cu interconnects. Both Sn-Pb and Sn-Ag-Cu solder alloy wafer-level packages, with and without pretreatment by 5% NaCl salt spray, were thermally cycled to failure. The salt spray test did not reduce the characteristic lifetime of the Sn-Pb solder joints, but it did reduce the lifetime of the Sn-Ag-Cu solder joints by over 43%. Although both materials showed strong resistance to corrosion, the localized nature of the corroded area at critical locations in the solder joint caused significant degradation in the Sn-Ag-Cu solder joints. The mechanisms leading to these results as well as the extent, microstructural evolution, and dependency of the solder alloy degradation are discussed.

  11. Testing of printed circuit board solder joints by optical correlation

    NASA Technical Reports Server (NTRS)

    Espy, P. N.

    1975-01-01

    An optical correlation technique for the nondestructive evaluation of printed circuit board solder joints was evaluated. Reliable indications of induced stress levels in solder joint lead wires are achievable. Definite relations between the inherent strength of a solder joint, with its associated ability to survive stress, are demonstrable.

  12. Soldering instrument safety improvements

    DOEpatents

    Kosslow, William J.; Giron, Ronald W.

    1996-01-01

    A safe soldering device includes a retractable heat shield which can be moved between a first position in which the solder tip of the device is exposed for soldering operation and a second position in which the solder tip is covered by the heat shield. Preferably, the heat shield is biased towards the second position and may be locked in the first position for ease of use. When the soldering device is equipped with a vacuum system, the heat shield may serve to guide the flow of gases and heat from the solder tip away from the work area. The heat shield is preferably made of non-heatsinking plastic.

  13. Ensuring Fully Soldered Through Holes

    NASA Technical Reports Server (NTRS)

    Blow, Raymond K.

    1987-01-01

    Simple differential-pressure soldering method provides visual evidence that hidden joints are fully soldered. Intended for soldering connector pins in plated through holes in circuit boards. Molten solder flows into plated through holes, drawn by vacuum in manifold over circuit board. Differential-pressure process ensures solder wets entire through hole around connector pin.

  14. Microstructural Evolution of SAC305 Solder Joints in Wafer Level Chip-Scale Packaging (WLCSP) with Continuous and Interrupted Accelerated Thermal Cycling

    NASA Astrophysics Data System (ADS)

    Zhou, Quan; Zhou, Bite; Lee, Tae-Kyu; Bieler, Thomas

    2016-06-01

    Four high-strain design wafer level chip scale packages were given accelerated thermal cycling with a 10°C/min ramp rate and 10 min hold times between 0°C and 100°C to examine the effects of continuous and interrupted thermal cycling on the number of cycles to failure. The interruptions given two of the samples were the result of periodic examinations using electron backscattered pattern mapping, leading to room temperature aging of 30 days-2.5 years after increments of about 100 cycles at several stages of the cycling history. The continuous thermal cycling resulted in solder joints with a much larger degree of recrystallization, whereas the interrupted thermal cycling tests led to much less recrystallization, which was more localized near the package side, and the crack was more localized near the interface and had less branching. The failure mode for both conditions was still the same, with cracks nucleating along the high angle grain boundaries formed during recrystallization. In conditions where there were few recrystallized grains, recovery led to formation of subgrains that strengthened the solder, and the higher strength led to a larger driving force for crack growth through the solder, leading to failure after less than half of the cycles in the continuous accelerated thermal cycling condition. This work shows that there is a critical point where sufficient strain energy accumulation will trigger recrystallization, but this point depends on the rate of strain accumulation in each cycle and various recovery processes, which further depends on local crystal orientations, stress state evolution, and specific activated slip and twinning systems.

  15. Design of Experiments to Determine Causes of Flex Cable Solder Wicking, Discoloration and Hole Location Defects

    SciTech Connect

    Wolfe, Larry

    2009-04-22

    Design of Experiments (DoE) were developed and performed in an effort to discover and resolve the causes of three different manufacturing issues; large panel voids after Hot Air Solder Leveling (HASL), cable hole locations out of tolerance after lamination and delamination/solder wicking around flat flex cable circuit lands after HASL. Results from a first DoE indicated large panel voids could be eliminated by removing the pre-HASL cleaning. It also revealed eliminating the pre-HASL bake would not be detrimental when using a hard press pad lamination stackup. A second DoE indicated a reduction in hard press pad stackup lamination pressure reduced panel stretch in the y axis approximately 70%. A third DoE illustrated increasing the pre-HASL bake temperature could reduce delamination/solder wicking when using a soft press pad lamination stackup.

  16. Use of organic solderability preservatives on solderability retention of copper after accelerated aging

    SciTech Connect

    Hernandez, C.L.; Sorensen, N.R.; Lucero, S.J.

    1997-02-01

    Organic solderability preservatives (OSP`s) have been used by the electronics industry for some time to maintain the solderability of circuit boards and components. Since solderability affects both manufacturing efficiency and product reliability, there is significant interest in maintaining good solder wettability. There is often a considerable time interval between the initial fabrication of a circuit board or component and its use at the assembly level. Parts are often stored under a variety of conditions, in many cases not well controlled. Solder wettability can deteriorate during storage, especially in harsh environments. This paper describes the ongoing efforts at Sandia National Laboratories to quantify solder watability on bare and aged copper surfaces. Benzotriazole and imidazole were applied to electronic grade copper to retard aging effects on solderability. The coupons were introduced into Sandia`s Facility for Atmospheric Corrosion Testing (FACT) to simulate aging in a typical indoor industrial environment. H{sub 2}S, NO{sub 2} and Cl{sub 2} mixed gas was introduced into the test cell and maintained at 35{degrees}C and 70% relative humidity for test periods of one day to two weeks. The OSP`s generally performed better than bare Cu, although solderability diminished with increasing exposure times.

  17. Solderability test system

    DOEpatents

    Yost, F.; Hosking, F.M.; Jellison, J.L.; Short, B.; Giversen, T.; Reed, J.R.

    1998-10-27

    A new test method to quantify capillary flow solderability on a printed wiring board surface finish. The test is based on solder flow from a pad onto narrow strips or lines. A test procedure and video image analysis technique were developed for conducting the test and evaluating the data. Feasibility tests revealed that the wetted distance was sensitive to the ratio of pad radius to line width (l/r), solder volume, and flux predry time. 11 figs.

  18. Solderability test system

    DOEpatents

    Yost, Fred; Hosking, Floyd M.; Jellison, James L.; Short, Bruce; Giversen, Terri; Reed, Jimmy R.

    1998-01-01

    A new test method to quantify capillary flow solderability on a printed wiring board surface finish. The test is based on solder flow from a pad onto narrow strips or lines. A test procedure and video image analysis technique were developed for conducting the test and evaluating the data. Feasibility tests revealed that the wetted distance was sensitive to the ratio of pad radius to line width (l/r), solder volume, and flux predry time.

  19. Reduced oxide soldering activation (ROSA) PWB solderability testing

    SciTech Connect

    Hernandez, C.L.; Hosking, F.M.; Reed, J.; Tench, D.M.; White, J.

    1996-02-01

    The effect of ROSA pretreatment on the solderability of environmentally stressed PWB test coupons was investigated. The PWB surface finish was an electroplated, reflowed solder. Test results demonstrated the ability to recover plated-through-hole fill of steam aged samples with solder after ROSA processing. ROSA offers an alternative method for restoring the solderability of aged PWB surfaces.

  20. Solder Reflow Failures in Electronic Components During Manual Soldering

    NASA Technical Reports Server (NTRS)

    Teverovsky, Alexander; Greenwell, Chris; Felt, Frederick

    2008-01-01

    This viewgraph presentation reviews the solder reflow failures in electronic components that occur during manual soldering. It discusses the specifics of manual-soldering-induced failures in plastic devices with internal solder joints. The failure analysis turned up that molten solder had squeezed up to the die surface along the die molding compound interface, and the dice were not protected with glassivation allowing solder to short gate and source to the drain contact. The failure analysis concluded that the parts failed due to overheating during manual soldering.

  1. Processing AIRS Scientific Data Through Level 3

    NASA Technical Reports Server (NTRS)

    Granger, Stephanie; Oliphant, Robert; Manning, Evan

    2010-01-01

    The Atmospheric Infra-Red Sounder (AIRS) Science Processing System (SPS) is a collection of computer programs, known as product generation executives (PGEs). The AIRS SPS PGEs are used for processing measurements received from the AIRS suite of infrared and microwave instruments orbiting the Earth onboard NASA's Aqua spacecraft. Early stages of the AIRS SPS development were described in a prior NASA Tech Briefs article: Initial Processing of Infrared Spectral Data (NPO-35243), Vol. 28, No. 11 (November 2004), page 39. In summary: Starting from Level 0 (representing raw AIRS data), the AIRS SPS PGEs and the data products they produce are identified by alphanumeric labels (1A, 1B, 2, and 3) representing successive stages or levels of processing. The previous NASA Tech Briefs article described processing through Level 2, the output of which comprises geo-located atmospheric data products such as temperature and humidity profiles among others. The AIRS Level 3 PGE samples selected information from the Level 2 standard products to produce a single global gridded product. One Level 3 product is generated for each day s collection of Level 2 data. In addition, daily Level 3 products are aggregated into two multiday products: an eight-day (half the orbital repeat cycle) product and monthly (calendar month) product.

  2. Acetabular pneumatocyst containing air-fluid level.

    PubMed

    Narváez, J A; Narváez, J; Rodríguez-Mijarro, M; Quintero, J C

    1999-01-01

    The presence of intraosseous gas most commonly occurs in osteomyelitis, vacuum phenomenon, and postsurgery or posttraumatic states. Several cases of subchondral gas-filled lesions, called pneumatocysts, have also been described in the sacroiliac joint and clavicle, none of them with intralesional air-fluid level. These pneumatocysts are innocuous lesions of uncertain origin. We describe one case of acetabular pneumatocyst containing air-fluid level in a 62-year-old man with long-standing ankylosing spondylitis involving hip joint. To our knowledge, this is the first reported case of a pneumatocyst in an acetabular location containing air-fluid level.

  3. Acid soldering flux poisoning

    MedlinePlus

    The harmful substances in soldering fluxes are called hydrocarbons. They include: Ammonium chloride Rosin Hydrochloric acid Zinc ... Lee DC. Hydrocarbons. In: Marx JA, Hockberger RS, Walls RM, et ... Rosen's Emergency Medicine: Concepts and Clinical Practice . 8th ...

  4. SOLDERING OF ALUMINUM BASE METALS

    DOEpatents

    Erickson, G.F.

    1958-02-25

    This patent deals with the soldering of aluminum to metals of different types, such as copper, brass, and iron. This is accomplished by heating the aluminum metal to be soldered to slightly above 30 deg C, rubbing a small amount of metallic gallium into the part of the surface to be soldered, whereby an aluminum--gallium alloy forms on the surface, and then heating the aluminum piece to the melting point of lead--tin soft solder, applying lead--tin soft solder to this alloyed surface, and combining the aluminum with the other metal to which it is to be soldered.

  5. Solder extrusion pressure bonding process and bonded products produced thereby

    DOEpatents

    Beavis, Leonard C.; Karnowsky, Maurice M.; Yost, Frederick G.

    1992-01-01

    Production of soldered joints which are highly reliable and capable of surviving 10,000 thermal cycles between about -40.degree. C. and 110.degree. C. Process involves interposing a thin layer of a metal solder composition between the metal surfaces of members to be bonded and applying heat and up to about 1000 psi compression pressure to the superposed members, in the presence of a reducing atmosphere, to extrude the major amount of the solder composition, contaminants including fluxing gases and air, from between the members being bonded, to form a very thin, strong intermetallic bonding layer having a thermal expansion tolerant with that of the bonded members.

  6. Solder extrusion pressure bonding process and bonded products produced thereby

    DOEpatents

    Beavis, L.C.; Karnowsky, M.M.; Yost, F.G.

    1992-06-16

    Disclosed is a process for production of soldered joints which are highly reliable and capable of surviving 10,000 thermal cycles between about [minus]40 C and 110 C. Process involves interposing a thin layer of a metal solder composition between the metal surfaces of members to be bonded and applying heat and up to about 1000 psi compression pressure to the superposed members, in the presence of a reducing atmosphere, to extrude the major amount of the solder composition, contaminants including fluxing gases and air, from between the members being bonded, to form a very thin, strong intermetallic bonding layer having a thermal expansion tolerant with that of the bonded members.

  7. Microstructural characterization and thermal cycling reliability of solders under isothermal aging and electrical current

    NASA Astrophysics Data System (ADS)

    Chauhan, Preeti Singh

    Solder joints on printed circuit boards provide electrical and mechanical connections between electronic devices and metallized patterns on boards. These solder joints are often the cause of failure in electronic packages. Solders age under storage and operational life conditions, which can include temperature, mechanical loads, and electrical current. Aging occurring at a constant temperature is called isothermal aging. Isothermal aging leads to coarsening of the bulk microstructure and increased interfacial intermetallic compounds at the solder-pad interface. The coarsening of the solder bulk degrades the creep properties of solders, whereas the voiding and brittleness of interfacial intermetallic compounds leads to mechanical weakness of the solder joint. Industry guidelines on solder interconnect reliability test methods recommend preconditioning the solder assemblies by isothermal aging before conducting reliability tests. The guidelines assume that isothermal aging simulates a "reasonable use period," but do not relate the isothermal aging levels with specific use conditions. Studies on the effect of isothermal aging on the thermal cycling reliability of tin-lead and tin-silver-copper solders are limited in scope, and results have been contradictory. The effect of electrical current on solder joints has been has mostly focused on current densities above 104A/cm2 with high ambient temperature (≥100oC), where electromigration, thermomigration, and Joule heating are the dominant failure mechanisms. The effect of current density below 104A/cm2 on temperature cycling fatigue of solders has not been established. This research provides the relation between isothermal aging and the thermal cycling reliability of select Sn-based solders. The Sn-based solders with 3%, 1%, and 0% silver content that have replaced tin-lead are studied and compared against tin-lead solder. The activation energy and growth exponents of the Arrhenius model for the intermetallic growth in

  8. Processing AIRS Scientific Data Through Level 2

    NASA Technical Reports Server (NTRS)

    Oliphant, Robert; Lee, Sung-Yung; Chahine, Moustafa; Susskind, Joel; arnet, Christopher; McMillin, Larry; Goldberg, Mitchell; Blaisdell, John; Rosenkranz, Philip; Strow, Larrabee

    2007-01-01

    The Atmospheric Infrared Spectrometer (AIRS) Science Processing System (SPS) is a collection of computer programs, denoted product generation executives (PGEs), for processing the readings of the AIRS suite of infrared and microwave instruments orbiting the Earth aboard NASA s Aqua spacecraft. AIRS SPS at an earlier stage of development was described in "Initial Processing of Infrared Spectral Data' (NPO-35243), NASA Tech Briefs, Vol. 28, No. 11 (November 2004), page 39. To recapitulate: Starting from level 0 (representing raw AIRS data), the PGEs and their data products are denoted by alphanumeric labels (1A, 1B, and 2) that signify the successive stages of processing. The cited prior article described processing through level 1B (the level-2 PGEs were not yet operational). The level-2 PGEs, which are now operational, receive packages of level-1B geolocated radiance data products and produce such geolocated geophysical atmospheric data products such as temperature and humidity profiles. The process of computing these geophysical data products is denoted "retrieval" and is quite complex. The main steps of the process are denoted microwave-only retrieval, cloud detection and cloud clearing, regression, full retrieval, and rapid transmittance algorithm.

  9. Microwave Tissue Soldering for Immediate Wound Closure

    NASA Technical Reports Server (NTRS)

    Arndt, G. Dickey; Ngo, Phong H.; Plan, Chau T.; Byerly, Diane; Dusl, John; Sognier, Marguerite A.

    2011-01-01

    equipment cannot be easily moved between operating rooms, let alone relocated to field sites where emergencies often occur. In addition, this approach is highly dependent on the uniformity and thickness of the protein solder as well as the surgeon s skills. In contrast, the use of microwave energy is highly tolerant of the thickness of the protein solder, level of fluids in and around the wound, and other parameters that can adversely affect the outcome of laser welding. However, controlling the depth of penetration of the microwave energy into the wound is critical for achieving effective wound sealing without damaging the adjacent tissue. In addition, microspheres that encapsulate metallic cores could also be incorporated into the protein solder to further control the depth of penetration of the microwave energy.

  10. Mechanical Solder Characterisation Under High Strain Rate Conditions

    NASA Astrophysics Data System (ADS)

    Meier, Karsten; Roellig, Mike; Wiese, Steffen; Wolter, Klaus-Juergen

    2010-11-01

    Using a setup for high strain rate tensile experiments the mechanical behavior of two lead-free tin based solders is investigated. The first alloy is SnAg1.3Cu0.5Ni. The second alloy has a higher silver content but no addition of Ni. Solder joints are the main electrical, thermal and mechanical interconnection technology on the first and second interconnection level. With the recent rise of 3D packaging technologies many novel interconnection ideas are proposed with innovative or visionary nature. Copper pillar, stud bump, intermetallic (SLID) and even spring like joints are presented in a number of projects. However, soldering will remain one of the important interconnect technologies. Knowing the mechanical properties of solder joints is important for any reliability assessment, especially when it comes to vibration and mechanical shock associated with mobile applications. Taking the ongoing miniaturization and linked changes in solder joint microstructure and mechanical behavior into account the need for experimental work on that issue is not satisfied. The tests are accomplished utilizing miniature bulk specimens to match the microstructure of real solder joints as close as possible. The dogbone shaped bulk specimens have a crucial diameter of 1 mm, which is close to BGA solder joints. Experiments were done in the strain rate range from 20 s-1 to 600 s-1. Solder strengthening has been observed with increased strain rate for both SAC solder alloys. The yield stress increases by about 100% in the investigated strain rate range. The yield level differs strongly. A high speed camera system was used to assist the evaluation process of the stress and strain data. Besides the stress and strain data extracted from the experiment the ultimate fracture strain is determined and the fracture surfaces are evaluated using SEM technique considering rate dependency.

  11. Board-Level Solder Joint Reliability of Edge- and Corner-Bonded Lead-Free Chip Scale Package Assemblies Subjected to Thermal Cycling

    NASA Astrophysics Data System (ADS)

    Shi, Hongbin; Tian, Cuihua; Ueda, Toshitsugu

    2012-04-01

    In this paper, we present the results of thermal cycling test for edge- and corner-bonded lead-free chip scale packages (CSPs), which was carried out on the basis of the IPC-9701 test standard. Six materials were used in this study: four edge-bond adhesives and two corner-bond adhesives. These adhesives were compared with CSPs with full capillary flow underfill (FCFU) and without adhesives. The thermal cycling test results show that corner-bond adhesive has comparable solder joint reliability performance with CSP without adhesive, and is better than edge-bond adhesive, followed by CSPs with FCFU. In addition, the adhesives with a low coefficient of thermal expansion, a high glass transition temperature and a intermediate storage modulus yielded good performance. Results of detailed failure analysis indicate that the dominant failure mode is solder bulk fatigue cracking near package and/or printed circuit board (PCB) pads, and that the location of critical solder joints change from die edges to package corners with the introduction of adhesives.

  12. Wetting in Soldering and Microelectronics

    NASA Astrophysics Data System (ADS)

    Matsumoto, T.; Nogi, K.

    2008-08-01

    Wettability of solid metals by molten solders is reviewed. The contact angle and wetting force are tabulated for various combinations of solid metals and molten solders such as Sn-Pb base alloys, Sn-Ag base alloys, Sn-Zn base alloys, Sn-Cu base alloys, and Sn-Bi base alloys. Studies on the wetting rate are also discussed.

  13. Breakthrough: Lead-free Solder

    SciTech Connect

    Anderson, Iver

    2012-01-01

    Ames Laboratory senior metallurgist Iver Anderson explains the importance of lead-free solder in taking hazardous lead out of the environment by eliminating it from discarded computers and electronics that wind up in landfills. Anderson led a team that developed a tin-silver-copper replacement for traditional lead-tin solder that has been adopted by more than 50 companies worldwide.

  14. Breakthrough: Lead-free Solder

    ScienceCinema

    Anderson, Iver

    2016-07-12

    Ames Laboratory senior metallurgist Iver Anderson explains the importance of lead-free solder in taking hazardous lead out of the environment by eliminating it from discarded computers and electronics that wind up in landfills. Anderson led a team that developed a tin-silver-copper replacement for traditional lead-tin solder that has been adopted by more than 50 companies worldwide.

  15. METHOD FOR SOLDERING NORMALLY NON-SOLDERABLE ARTICLES

    DOEpatents

    McGuire, J.C.

    1959-11-24

    Methods are presented for coating and joining materials which are considered difficult to solder by utilizing an abrasive wheel and applying a bar of a suitable coating material, such as Wood's metal, to the rotating wheel to fill the cavities of the abrasive wheel and load the wheel with the coating material. The surface of the base material is then rubbed against the loaded rotating wheel, thereby coating the surface with the soft coating metal. The coating is a cohesive bonded layer and holds the base metal as tenaciously as a solder holds to easily solderable metals.

  16. A new active solder for joining electronic components

    SciTech Connect

    SMITH,RONALD W.; VIANCO,PAUL T.; HERNANDEZ,CYNTHIA L.; LUGSCHEIDER,E.; RASS,I.; HILLEN,F.

    2000-05-11

    Electronic components and micro-sensors utilize ceramic substrates, copper and aluminum interconnect and silicon. The joining of these combinations require pre-metallization such that solders with fluxes can wet such combinations of metals and ceramics. The paper will present a new solder alloy that can bond metals, ceramics and composites. The alloy directly wets and bonds in air without the use flux or premetallized layers. The paper will present typical processing steps and joint microstructures in copper, aluminum, aluminum oxide, aluminum nitride, and silicon joints.

  17. Soldering ceramic-metal restorations.

    PubMed

    Presswood, R G

    1975-09-01

    This is a technique for soldering ceramic-metal restorations in a vacuum-fired furnace. Care must be exercised to prevent adherence of the flux to the porcelain surfaces. Low-heat solders have been used, but they do not flow any better and may result in a weak union. The various colors of impression plaster to form the key for removal of the assembly are used to prevent softening and distortion of the individual units. There are several techniques described in assembling and soldering ceramic-metal restorations. This technique is direct, accurate, and easily accomplished.

  18. Requirements for soldered electrical connections

    NASA Technical Reports Server (NTRS)

    1992-01-01

    This publication is applicable to NASA programs involving solder connections for flight hardware, mission essential support equipment, and elements thereof. This publication sets forth hand and wave soldering requirements for reliable electrical connections. The prime consideration is the physical integrity of solder connections. Special requirements may exist which are not in conformance with the requirements of this publication. Design documentation contains the detail for these requirements, and they take precedence over conflicting portions of this publication when they are approved in writing by the procuring NASA installation.

  19. 21 CFR 189.240 - Lead solders.

    Code of Federal Regulations, 2014 CFR

    2014-04-01

    ...-Contact Surfaces § 189.240 Lead solders. (a) Lead solders are alloys of metals that include lead and are used in the construction of metal food cans. (b) Food packaged in any container that makes use of...

  20. Interfacial Reactions Between ZnAl(Ge) Solders on Cu and Ni Substrates

    NASA Astrophysics Data System (ADS)

    Rautiainen, Antti; Vuorinen, Vesa; Paulasto-Kröckel, Mervi

    2017-04-01

    Reactions between zinc-aluminum-germanium solder and copper/nickel substrates were investigated after 30 min of soldering at 420°C that simulates a wafer-level bonding process, and the results were compared to a eutectic zinc-aluminum solder. The ZnAlGe system (81.4 at.% Zn, 13.1 at.% Al, 5.5 at.% Ge) was selected in order to decrease the eutectic temperature of the ZnAleut (88.7 at.% Zn, 11.3 at.% Al) for high-temperature lead-free solder applications. In addition, a standard high temperature storage test at 150°C was performed up to 3000 h in order to investigate the evolution of the interconnection microstructures. Extensive copper dissolution was discovered during the soldering process. Germanium did not participate in any of the interfacial reactions on a copper substrate. On a nickel substrate, rapid formation of intermetallic compounds was discovered with both solders, and all the aluminum from the 500 μm thick solder was consumed by the formation of the Al3Ni2 phase during bonding. Germanium was observed to dissolve in the Al3Ni2 phase, but the addition of germanium to the solder was not found to affect markedly the interfacial microstructure. Based on the results, isothermal sections at 150°C of Al-Cu-Zn and Al-Ni-Zn systems are presented with superimposed diffusion paths.

  1. Post-soldering of nonprecious alloys.

    PubMed

    Saxton, P L

    1980-05-01

    A repeatable post-soldering technique for a nonprecious alloy has been described. With proper metal design, nonprecious alloy crowns can be soldered in a standard vacuum porcelain furnace. Scanning electron micrographs and EDXA confirm that a good union has taken place between the gold solder and nickel alloy.

  2. 21 CFR 189.240 - Lead solders.

    Code of Federal Regulations, 2010 CFR

    2010-04-01

    ... 21 Food and Drugs 3 2010-04-01 2009-04-01 true Lead solders. 189.240 Section 189.240 Food and... Addition to Human Food Through Food-Contact Surfaces § 189.240 Lead solders. (a) Lead solders are alloys of metals that include lead and are used in the construction of metal food cans. (b) Food packaged in...

  3. 21 CFR 189.240 - Lead solders.

    Code of Federal Regulations, 2012 CFR

    2012-04-01

    ... 21 Food and Drugs 3 2012-04-01 2012-04-01 false Lead solders. 189.240 Section 189.240 Food and... Addition to Human Food Through Food-Contact Surfaces § 189.240 Lead solders. (a) Lead solders are alloys of metals that include lead and are used in the construction of metal food cans. (b) Food packaged in...

  4. 21 CFR 189.240 - Lead solders.

    Code of Federal Regulations, 2011 CFR

    2011-04-01

    ... 21 Food and Drugs 3 2011-04-01 2011-04-01 false Lead solders. 189.240 Section 189.240 Food and... Addition to Human Food Through Food-Contact Surfaces § 189.240 Lead solders. (a) Lead solders are alloys of metals that include lead and are used in the construction of metal food cans. (b) Food packaged in...

  5. 21 CFR 189.240 - Lead solders.

    Code of Federal Regulations, 2013 CFR

    2013-04-01

    ... 21 Food and Drugs 3 2013-04-01 2013-04-01 false Lead solders. 189.240 Section 189.240 Food and... Addition to Human Food Through Food-Contact Surfaces § 189.240 Lead solders. (a) Lead solders are alloys of metals that include lead and are used in the construction of metal food cans. (b) Food packaged in...

  6. Heat Lamps Solder Solar Array Quickly

    NASA Technical Reports Server (NTRS)

    Coyle, P. J.; Crouthamel, M. S.

    1982-01-01

    Interconnection tabs in a nine-solar-cell array have been soldered simultaneously with radiant heat. Cells and tabs are held in position for soldering by sandwiching them between compliant silicone-rubber vacuum platen and transparent polyimide sealing membrane. Heat lamps warm cells, producing smooth, flat solder joints of high quality.

  7. An Overview of Surface Finishes and Their Role in Printed Circuit Board Solderability and Solder Joint Performance

    SciTech Connect

    Vianco, P.T.

    1998-10-15

    A overview has been presented on the topic of alternative surface finishes for package I/Os and circuit board features. Aspects of processability and solder joint reliability were described for the following coatings: baseline hot-dipped, plated, and plated-and-fused 100Sn and Sn-Pb coatings; Ni/Au; Pd, Ni/Pd, and Ni/Pd/Au finishes; and the recently marketed immersion Ag coatings. The Ni/Au coatings appear to provide the all-around best option in terms of solderability protection and wire bondability. Nickel/Pal ftishes offer a slightly reduced level of performance in these areas that is most likely due to variable Pd surface conditions. It is necessmy to minimize dissolved Au or Pd contents in the solder material to prevent solder joint embrittlement. Ancillary aspects that included thickness measurement techniques; the importance of finish compatibility with conformal coatings and conductive adhesives; and the need for alternative finishes for the processing of non-Pb bearing solders were discussed.

  8. Solders in Real Electronic Joints

    NASA Astrophysics Data System (ADS)

    Rudajevová, A.; Dušek, K.

    2014-07-01

    Undercooling and recalescence were studied using the differential scanning calorimetry (DSC) method on real electronic systems. Two solder pastes, Sn62.5Pb36.5Ag1 and Sn96.5Ag3Cu0.5, were used for preparation of electronic joints. Various combinations of these solders and soldering pads with different surface finishes such as Cu, Cu-Ni-Au, Cu-Sn, and Cu-Sn99Cu1 were used. During melting of both pastes, the Sn and Sn99Cu1 surface finishes immediately dissolved in the solder and the Cu surface coating was exposed to the melt. Therefore, practically the same undercooling was found for the Cu, Cu-Sn, and Cu-Sn99Cu1 coatings. The lowest undercooling was found for the Cu-Ni-Au surface finish for both solder pastes. If two separated electronic joints were made on the sample, two separate peaks were found in the DSC signal during solidification. In the sample with only one joint, only one exothermic peak was found. These findings were observed for all paste/surface finish combinations. These data were analyzed, showing that this effect is a consequence of undercooling and recalescence: Latent heat released during solidification of the joint increases the surrounding temperature and influences all the processes taking place.

  9. Development of the Regimes of Semiautomatic Contact Soldering

    NASA Astrophysics Data System (ADS)

    Shtennikov, V. N.

    2015-01-01

    The influence of the soldering rod length on the contact soldering temperature has been studied. The results of investigations were taken as a basis for incorporating a high-speed semiautomatic regime of soldering integrated circuits with planar leads to multilayer printed circuit boards. It has been established that to ensure an optimum soldering temperature it is necessary to take account of the temperature of the soldering rod before soldering, its length and diameter, and the soldering time when the rod is short.

  10. Drinking Water Contamination Due To Lead-based Solder

    NASA Astrophysics Data System (ADS)

    Garcia, N.; Bartelt, E.; Cuff, K. E.

    2004-12-01

    The presence of lead in drinking water creates many health hazards. Exposure to lead-contaminated water can affect the brain, the central nervous system, blood cells, and kidneys, causing such problems as mental retardation, kidney disease, heart disease, stroke, and death. One way in which lead can contaminate our water supply is through the use of lead solder to join pipes. Lead solder was widely used in the past because of its ease of application as well as its low cost. Lead contamination in residential areas has previously been found to be a particularly serious problem in first-draw samples, of water that has sat stagnant in pipes overnight. To investigate the time-dependence of drinking water lead contamination, we analyzed samples taken hourly of water exposed to lead solder. While our preliminary data was insufficient to show more than a rough correlation between time of exposure and lead concentration over short periods (1-3 hours), we were able to confirm that overnight exposure of water to lead-based solder results in the presence high levels of lead. We also investigated other, external factors that previous research has indicated contribute to increased concentrations of lead. Our analysis of samples of lead-exposed water at various pH and temperatures suggests that these factors can be equally significant in terms of their contribution to elevated lead concentration levels. In particular, water that is slightly corrosive appears to severely impact the solubility of lead. As this type of water is common in much of the Northeast United States, the presence of lead-based solder in residential areas there is especially problematic. Although lead-based solder has been banned since the 1980s, it remains a serious concern, and a practical solution still requires further research.

  11. Solder Joint Health Monitoring Testbed

    NASA Technical Reports Server (NTRS)

    Delaney, Michael M.; Flynn, James G.; Browder, Mark E.

    2009-01-01

    A method of monitoring the health of selected solder joints, called SJ-BIST, has been developed by Ridgetop Group Inc. under a Small Business Innovative Research (SBIR) contract. The primary goal of this research program is to test and validate this method in a flight environment using realistically seeded faults in selected solder joints. An additional objective is to gather environmental data for future development of physics-based and data-driven prognostics algorithms. A test board is being designed using a Xilinx FPGA. These boards will be tested both in flight and on the ground using a shaker table and an altitude chamber.

  12. Solder Mounting Technologies for Electronic Packaging

    SciTech Connect

    VIANCO, PAUL T.

    1999-09-23

    Soldering provides a cost-effective means for attaching electronic packages to circuit boards using both small scale and large scale manufacturing processes. Soldering processes accommodate through-hole leaded components as well as surface mount packages, including the newer area array packages such as the Ball Grid Arrays (BGA), Chip Scale Packages (CSP), and Flip Chip Technology. The versatility of soldering is attributed to the variety of available solder alloy compositions, substrate material methodologies, and different manufacturing processes. For example, low melting temperature solders are used with temperature sensitive materials and components. On the other hand, higher melting temperature solders provide reliable interconnects for electronics used in high temperature service. Automated soldering techniques can support large-volume manufacturing processes, while providing high reliability electronic products at a reasonable cost.

  13. Soldering Technology (6th) Proceedings of Annual Seminar, 17-18 February 1982.

    DTIC Science & Technology

    1982-02-01

    hot air knife, the preheater and the solder wave at a fixed incline of 40 to achieve the optimum rela- tionship with the solder wave shape. Our design...transport IQ SCREW CHANqMD F .. Y- fingers contact the card edges along 50% of the length on both sides (1/4" grip length, 1/4" air repetitiously). Two... AIR SPU MANIFOLD- (or de-activated) in 4-inch increments to conform more closely to the width of the circuit board. Each chamber has its

  14. Investigation and analysis on the solder ball shear strength of plastic ball grid array, chip scale, and flip chip packages with eutectic lead-tin and lead-free solders

    NASA Astrophysics Data System (ADS)

    Huang, Xingjia

    shear speed in the range of 50 to 200 mum/s. The solder ball shear strength of UItraCSP 80 remains stable till 4 time reflow. After that, the strength decreases significantly. For UltraCSPs with and without Au, with high temperature storage (HTS) at 150°C the shear strengths decrease monotonically. With HTS, the electrical resistances of UltraCSPs with and without Au increase monotonically. After 1000 hours, the resistance of UltraCSPs without Au levels off, while the resistance of UltraCSPs with Au continues to increase. (Abstract shortened by UMI.)

  15. Air Assault - Rapid Response at the Operational Level.

    DTIC Science & Technology

    1988-03-30

    visualize a number of operational applications for air assault units on the European battlefield. The key to their employment at this level is for...concept, one can visualize a number of operational applications for air assault units on the European battlefield. The key to their employment at this level...combat troop carrying and fire support roles for the helicopter. In 1969, the Soviet Union realized a need for this new combat helicopter technology

  16. Microstructure of lead-free solder bumps using laser reflow soldering

    NASA Astrophysics Data System (ADS)

    Nishikawa, Hiroshi; Iwata, Noriya; Kubota, Shinya

    2014-08-01

    Compared with conventional reflow soldering using a furnace, laser reflow soldering brings advantages such as localized heating, rapid rise and fall in temperature, non-contact soldering and the fact that it is an easily automated process. In this study, to elucidate the characteristics of laser reflow soldering, we investigated the microstructures of a Sn-Ag-Cu solder bump and a Sn-Bi solder bump on a Cu pad after reflow and aging. In the as-soldered condition, we found obvious microstructural refinement and a thin intermetallic compound (IMC) layer at the interface for both the Sn-Ag-Cu solder bump and the Sn-Bi solder bump using laser reflow soldering. Also, during isothermal aging, the total thickness of the IMC layer increased, and a distinct second layer was observed at the interface between the Cu pad and the first layer, regardless of the soldering method. In particular, the growth of the IMC layer was faster in the case of the laser reflow soldering than in the case of the conventional reflow soldering.

  17. NTF: Soldering Technology Development for Cryogenics

    NASA Technical Reports Server (NTRS)

    Hall, E. T., Jr.

    1985-01-01

    The advent of the National Transonic Facility (NTF) brought about a new application for an old joining method, soldering. Soldering for use at cryogenic temperatures requires that solders remain ductile and free from tin-pest (grey tin), have toughness to withstand aerodynamic loads associated with flight research, and maintain their surface finishes. Solders are used to attach 347 Stainless-Steel tubing in surface grooves of models. The solder must fill up the gap and metallurgically bound to the tubing and model. Cryogenic temperatures require that only specific materials for models can be used, including: Vasco Max 200 CVM, lescalloy A-286 Vac Arc, pH 13-8 Mo. Solders identified for testing at this time are: 50% Sn - 49.5% Pb - 0.5% Sb, 95% Sn - 5% Sb, 50% In 50% Pb, and 37.5% Sn - 37.5% Pb - 25% In. With these materials and solders, it is necessary to determine their solderability. After solderability is determined, tube/groove specimens are fabricated and stressed under cryogenic temperatures. Compatible solders are then used for acutual models.

  18. Impact of Cooling Rate-Induced Recrystallization on High G Mechanical Shock and Thermal Cycling in Sn-Ag-Cu Solder Interconnects

    NASA Astrophysics Data System (ADS)

    Lee, Tae-Kyu; Bieler, Thomas R.; Kim, Choong-Un

    2016-01-01

    The mechanical stability and thermo-mechanical fatigue performance of solder joints with low silver content Sn-1.0Ag-0.5Cu (wt.%) (SAC105) alloy based on different cooling rates are investigated in high G level shock environment and thermal cycling conditions. The cooling rate-controlled samples ranging from 1°C/min to 75°C/min cooling rate, not only show differences in microstructure, where a fine poly-granular microstructure develops in the case of fast cooling versus normal cooling, but also show various shock performances based on the microstructure changes. The fast cooling rate improves the high G shock performance by over 90% compared to the normal cooled SAC105 alloy air-cooling environment commonly used after assembly reflow. The microstructure effect on thermal cycling performance is also discussed, which is analyzed based on the Sn grain orientation, interconnect stability, and solder joint bulk microstructure.

  19. Simulation of thermomechanical fatigue in solder joints

    SciTech Connect

    Fang, H.E.; Porter, V.L.; Fye, R.M.; Holm, E.A.

    1997-12-31

    Thermomechanical fatigue (TMF) is a very complex phenomenon in electronic component systems and has been identified as one prominent degradation mechanism for surface mount solder joints in the stockpile. In order to precisely predict the TMF-related effects on the reliability of electronic components in weapons, a multi-level simulation methodology is being developed at Sandia National Laboratories. This methodology links simulation codes of continuum mechanics (JAS3D), microstructural mechanics (GLAD), and microstructural evolution (PARGRAIN) to treat the disparate length scales that exist between the macroscopic response of the component and the microstructural changes occurring in its constituent materials. JAS3D is used to predict strain/temperature distributions in the component due to environmental variable fluctuations. GLAD identifies damage initiation and accumulation in detail based on the spatial information provided by JAS3D. PARGRAIN simulates the changes of material microstructure, such as the heterogeneous coarsening in Sn-Pb solder, when the component`s service environment varies.

  20. Computational continuum modeling of solder interconnects: Applications

    SciTech Connect

    Burchett, S.N.; Neilsen, M.K.; Frear, D.R.

    1997-04-01

    The most commonly used solder for electrical interconnections in electronic packages is the near eutectic 60Sn-40Fb alloy. This alloy has a number of processing advantages (suitable melting point of 183C and good wetting behavior). However, under conditions of cyclic strain and temperature (thermomechanical fatigue), the microstructure of this alloy undergoes a heterogeneous coarsening and failure process that makes the prediction of solder joint lifetime complex. A viscoplastic, microstructure dependent, constitutive model for solder, which is currently under development, was implemented into a finite element code. With this computational capability, the thermomechanical response of solder interconnects, including microstructural evolution, can be predicted. This capability was applied to predict the thermomechanical response of a mini ball grid array solder interconnect. In this paper, the constitutive model will first be briefly discussed. The results of computational studies to determine the thermomechanical response of a mini ball grid array solder interconnects then will be presented.

  1. [Field investigations of the air pollution level of populated territories].

    PubMed

    Vinokurov, M V

    2014-01-01

    The assessment and management of air quality of settlements is one of the priorities in the field of environmental protection. In the management of air quality the backbone factor is the methodology of the organization, performance and interpretation of data of field investigations. The present article is devoted to the analysis of the existing methodological approaches and practical aspects of their application in the organization and performance of field investigations with the aim to confirm the adequacy of the boundaries of the sanitary protection zone in the old industrial regions, hygienic evaluation of the data of field investigations of the air pollution level.

  2. Tin soldering of aluminum and its alloys

    NASA Technical Reports Server (NTRS)

    Gallo, Gino

    1921-01-01

    A method is presented for soldering aluminum to other metals. The method adopted consists of a galvanic application to the surface of the light-metal parts to be soldered, of a layer of another metal, which, without reacting electrolytically on the aluminum, adheres strongly to the surface to which it is applied, and is, on the other hand, adapted to receive the soft solder. The metal found to meet the criteria best was iron.

  3. Die Soldering in Aluminium Die Casting

    SciTech Connect

    Han, Q.; Kenik, E.A.; Viswanathan, S.

    2000-03-15

    Two types of tests, dipping tests and dip-coating tests were carried out on small steel cylinders using pure aluminum and 380 alloy to investigate the mechanism of die soldering during aluminum die casting. Optical and scanning electron microscopy were used to study the morphology and composition of the phases formed during soldering. A soldering mechanism is postulated based on experimental observations. A soldering critical temperature is postulated at which iron begins to react with aluminum to form an aluminum-rich liquid phase and solid intermetallic compounds. When the temperature at the die surface is higher than this critical temperature, the aluminum-rich phase is liquid and joins the die with the casting during the subsequent solidification. The paper discusses the mechanism of soldering for the case of pure aluminum and 380 alloy casting in a steel mold, the factors that promote soldering, and the strength of the bond formed when soldering occurs. conditions, an aluminum-rich soldering layer may also form over the intermetallic layer. Although a significant amount of research has been conducted on the nature of these intermetallics, little is known about the conditions under which soldering occurs.

  4. Laser soldering of enameled wires

    NASA Astrophysics Data System (ADS)

    Böhm, S.; Hemken, G.; Noack, K.

    2009-02-01

    In electrical connections with enameled copper wires, isolation material residue can be found in the solder area when the coating is not stripped. This residue can lead to mechanical and electrical problems. In electronic devices and MEMS, quality requirements increase with rising thermal requirements for electrical contacts made from enameled copper wire. Examples for this exist in the area of automotive electronics, consumer electronics and in the field of machine design. Typical products with electrical connecting which use enameled wires include: micro-phones and speakers (especially for mobile phones), coil forms, small transformers, relays, clock coils, and so on. Due to increasing thermal and electrical requirements, the manufacturer of enameled wires continuously develops new isolating materials for the improvement of isolation classes, thermal resistance, etc. When using current bonding and solder processes, there exist problems for contacting enameled copper wire with these insulation layers. Therefore the Institute of Joining and Welding, Department Micro Joining developed a laser based solder process with which enamels copper wires can enable high quality electrical connections without a preceding stripping process.

  5. Effects of hydration on laser soldering

    NASA Astrophysics Data System (ADS)

    Chan, Eric K.; Brown, Dennis T.; Kovach, Ian S.; Welch, Ashley J.

    1997-05-01

    Laser welding with albumin-based tissue solder has been investigated as an alternative to surgical suturing. Many surgical procedures require the soldered tissues to be in a hydrated environment. We have studied the effects of hydration on laser soldered rat dermis and baboon articular cartilage in vitro. The solder is composed of human serum albumin, sodium hyaluronate and indocyanine green. We used a micro-pipette to deposit 2 (mu) l of solder on each tissue specimen. An 808 nm cw laser beam with irradiance of 27 W/cm2 was scanned 4 times over the same solder area at a constant speed of 0.84 mm/sec. After photo-coagulation, each tissue specimen was cut into two halves at the center of the solder, perpendicular to the direction of the scanning laser beam. One half was reserved as control while the other half was soaked in phosphate buffered saline for a designated hydration period. The hydration periods were 1 hr, 1, 2, and 7 days. All tissue specimens were fixed in glutaraldahyde, then prepared for scanning electron microcopy analysis. For most of the specimens, there was non-uniform coagulation across the thickness of the solder. Closer to the laser beam, the upper solder region formed a more dense coagulum. While the region closer to solder-tissue interface, the solder aggregated into small globules. This non-uniform coagulation was likely caused by non-uniform energy distribution during photocoagulation. The protein globules and coagulum seem to be responsible for the solder attachment from the specimen surface. However, we have noted that the solder detached from the cartilage substrate as early as after 1 hr of hydration. On the other hand, the solder attached to the dermis much better than to cartilage. This may be explained by the difference in surface roughness of the two tissue types. The dermal layer of the skin is composed of collagen matrix which may provide a better entrapment of the solder than the smooth surface of articular cartilage.

  6. Effect of laser soldering irradiation on covalent bonds of pure collagen.

    PubMed

    Constantinescu, Mihai A; Alfieri, Alex; Mihalache, George; Stuker, Florian; Ducray, Angélique; Seiler, Rolf W; Frenz, Martin; Reinert, Michael

    2007-03-01

    Laser tissue welding and soldering is being increasingly used in the clinical setting for defined surgical procedures. The exact induced changes responsible for tensile strength are not yet fully investigated. To further improve the strength of the bonding, a better understanding of the laser impact at the subcellular level is necessary. The goal of this study was to analyze whether the effect of laser irradiation on covalent bonding in pure collagen using irradiances typically applied for tissue soldering. Pure rabbit and equine type I collagen were subjected to laser irradiation. In the first part of the study, rabbit and equine collagen were compared using identical laser and irradiation settings. In the second part of the study, equine collagen was irradiated at increasing laser powers. Changes in covalent bonding were studied indirectly using the sodium dodecylsulfate polyacrylamide gel electrophoresis (SDS-PAGE) technique. Tensile strengths of soldered membranes were measured with a calibrated tensile force gauge. In the first experiment, no differences between the species-specific collagen bands were noted, and no changes in banding were found on SDS-PAGE after laser irradiation. In the second experiment, increasing laser irradiation power showed no effect on collagen banding in SDS-PAGE. Finally, the laser tissue soldering of pure collagen membranes showed virtually no determinable tensile strength. Laser irradiation of pure collagen at typical power settings and exposure times generally used in laser tissue soldering does not induce covalent bonding between collagen molecules. This is true for both rabbit and equine collagen proveniences. Furthermore, soldering of pure collagen membranes without additional cellular components does not achieve the typical tensile strength reported in native, cell-rich tissues. This study is a first step in a better understanding of laser impact at the molecular level and might prove useful in engineering of combined

  7. Nano-soldering to single atomic layer

    DOEpatents

    Girit, Caglar O.; Zettl, Alexander K.

    2011-10-11

    A simple technique to solder submicron sized, ohmic contacts to nanostructures has been disclosed. The technique has several advantages over standard electron beam lithography methods, which are complex, costly, and can contaminate samples. To demonstrate the soldering technique graphene, a single atomic layer of carbon, has been contacted, and low- and high-field electronic transport properties have been measured.

  8. Experiments and Demonstrations with Soldering Guns.

    ERIC Educational Resources Information Center

    Henry, Dennis C.; Danielson, Sarah A.

    1993-01-01

    Discusses the essential electrical characteristics of a particular model of soldering gun. Presents four classroom demonstrations that utilize the soldering gun to test the following geometrics of wire loops as electromagnets: (1) the original tip; (2) a single circular loop; (3) a Helmholtz coil; and (4) the solenoid. (MDH)

  9. Higher fuel prices are associated with lower air pollution levels.

    PubMed

    Barnett, Adrian G; Knibbs, Luke D

    2014-05-01

    Air pollution is a persistent problem in urban areas, and traffic emissions are a major cause of poor air quality. Policies to curb pollution levels often involve raising the price of using private vehicles, for example, congestion charges. We were interested in whether higher fuel prices were associated with decreased air pollution levels. We examined an association between diesel and petrol prices and four traffic-related pollutants in Brisbane from 2010 to 2013. We used a regression model and examined pollution levels up to 16 days after the price change. Higher diesel prices were associated with statistically significant short-term reductions in carbon monoxide and nitrogen oxides. Changes in petrol prices had no impact on air pollution. Raising diesel taxes in Australia could be justified as a public health measure. As raising taxes is politically unpopular, an alternative political approach would be to remove schemes that put a downward pressure on fuel prices, such as industry subsidies and shopping vouchers that give fuel discounts.

  10. BOREAS AFM-5 Level-1 Upper Air Network Data

    NASA Technical Reports Server (NTRS)

    Barr, Alan; Hrynkiw, Charmaine; Newcomer, Jeffrey A. (Editor); Hall, Forrest G. (Editor); Smith, David E. (Technical Monitor)

    2000-01-01

    The Boreal Ecosystem-Atmosphere Study (BOREAS) Airborne Fluxes and Meteorology (AFM)-5 team collected and processed data from the numerous radiosonde flights during the project. The goals of the AFM-05 team were to provide large-scale definition of the atmosphere by supplementing the existing Atmospheric Environment Service (AES) aerological network, both temporally and spatially. This data set includes basic upper-air parameters collected from the network of upper-air stations during the 1993, 1994, and 1996 field campaigns over the entire study region. The data are contained in tabular ASCII files. The level-1 upper-air network data are available from the Earth Observing System Data and Information System (EOSDIS) Oak Ridge National Laboratory (ORNL) Distributed Active Archive Center (DAAC). The data files also are available on a CD-ROM (see document number 20010000884).

  11. Air quality and thermal comfort levels under extreme hot weather

    NASA Astrophysics Data System (ADS)

    Papanastasiou, D. K.; Melas, D.; Kambezidis, H. D.

    2015-01-01

    Meteorological (T and RH values) and air pollution data (PM10, NO2 and O3 concentrations) observed in Athens, Thessaloniki and Volos were analyzed to assess the air quality and the thermal comfort conditions and to study their synergy, when extreme hot weather prevailed in Greece during the period 2001-2010. The identification of a heat wave day was based on the suggestion made by the IPCC to define an extreme weather event. According to it, a heat wave day is detected when the daily maximum hourly temperature value exceeds its 90th percentile. This temperature criterion was applied to the data recorded at the cities center. Air quality was assessed at three sites in Athens (city center, near the city center, suburb), at two sites in Thessaloniki (city center, suburb) and at one site in Volos (city center), while thermal comfort conditions were assessed at the cities center. Mean pollution levels during the heat wave days and the non-heat wave days were calculated in order to examine the impact of the extreme hot weather on air quality. For this purpose, the distributions of the common air quality index and the exceedances of the air quality standards in force during the heat wave days and the non-heat wave days were also studied. Additionally, the variation of the daily maximum hourly value of Thom's discomfort index was studied in order to investigate the effect of extreme hot weather on people's thermal comfort. Moreover, the values of the common air quality index and Thom's discomfort index were comparatively assessed so as to investigate their synergy under extreme hot weather.

  12. Comparative shear tests of some low temperature lead-free solder pastes

    NASA Astrophysics Data System (ADS)

    Branzei, Mihai; Plotog, Ioan; Varzaru, Gaudentiu; Cucu, Traian C.

    2016-12-01

    The range of electronic components and as a consequence, all parts of automotive electronic equipment operating temperatures in a vehicle is given by the location of that equipment, so the maximum temperature can vary between 358K and 478K1. The solder joints could be defined as passive parts of the interconnection structure of automotive electronic equipment, at a different level, from boards of electronic modules to systems. The manufacturing costs reduction necessity and the RoHS EU Directive3, 7 consequences generate the trend to create new Low-Temperature Lead-Free (LTLF) solder pastes family9. In the paper, the mechanical strength of solder joints and samples having the same transversal section as resistor 1206 case type made using the same LTLF alloys into Vapour Phase Soldering (VPS) process characterized by different cooling rates (slow and rapid) and two types of test PCBs pads finish, were benchmarked at room temperature. The presented work extends the theoretical studies and experiments upon heat transfer in VPSP in order to optimize the technology for soldering process (SP) of automotive electronic modules and could be extended for home and modern agriculture appliances industry. The shear forces (SF) values of the LTLF alloy samples having the same transversal section as resistor 1206 case type will be considered as references values of a database useful in the new solder alloy creation processes and their qualification for automotive electronics domain.

  13. Correlation of air temperature above water-air sections with the forecasted low level clouds

    NASA Astrophysics Data System (ADS)

    Huseynov, N. Sh.; Malikov, B. M.

    2009-04-01

    As a case study approach the development of low clouds forecasting methods in correlation with air temperature transformational variations on the sections "water-air" is surveyed. It was evident, that transformational variations of air temperature mainly depend on peculiarities and value of advective variations of temperature. DT is the differences of initial temperature on section water-air in started area, from contrast temperature of water surface along a trajectory of movement of air masses and from the temperature above water surface in a final point of a trajectory. Main values of transformational variations of air temperature at advection of a cold masses is 0.530C•h, and at advection of warm masses is -0.370C•h. There was dimensionless quantity K determined and implemented into practice which was characterized with difference of water temperature in forecasting point and air temperature in an initial point in the ratio of dew-points deficiency at the forecasting area. It follows, that the appropriate increasing or decreasing of K under conditions of cold and warm air masses advection, contributes decreasing of low clouds level. References: Abramovich K.G.: Conditions of development and forecasting of low level clouds. vol. #78, 124 pp., Hydrometcenter USSR 1973. Abramovich K.G.: Variations of low clouds level // Meteorology and Hydrology, vol. # 5, 30-41, Moscow, 1968. Budiko M.I.: Empirical assessment of climatic changes toward the end of XX century // Meteorology and Hydrology, vol. #12, 5-13, Moscow, 1999. Buykov M.V.: Computational modeling of daily evolutions of boundary layer of atmosphere at the presence of clouds and fog // Meteorology and Hydrology, vol. # 4, 35-44, Moscow, 1981. Huseynov N.Sh. Transformational variations of air temperature above Caspian Sea / Proceedings of Conference On Climate And Protection of Environment, 118-120, Baku, 1999. Huseynov N.Sh.: Consideration of advective and transformational variations of air temperature in

  14. Mixing layer height and air pollution levels in urban area

    NASA Astrophysics Data System (ADS)

    Schäfer, Klaus; Wagner, Patrick; Emeis, Stefan; Jahn, Carsten; Muenkel, Christoph; Suppan, Peter

    2012-10-01

    Ceilometers are applied by KIT/IMK-IFU to detect layering of the lower atmosphere continuously. This is necessary because not only wind speed and direction but also atmospheric layering and especially the mixing layer height (MLH) influence exchange processes of ground level emissions. It will be discussed how the ceilometer monitoring information is used to interpret the air pollution near the ground. The information about atmospheric layering is continuously monitored by uninterrupted remote sensing measurements with the Vaisala ceilometer CL51 which is an eye-safe commercial mini-lidar system. Special software for this ceilometer provides routine retrievals of lower atmosphere layering from vertical profiles of laser backscatter data. An intensive measurement period during the winter 2011/2012 is studied. The meteorological influences upon air pollutant concentrations are investgated and the correlations of air pollutant concentrations with ceilometer MLH are determined. Benzene was detected by department of Applied Climatology and Landscape Ecology, University of Duisburg-Essen (UDE) with a gas chromatograph during the measurement period. The meteorological data are collected by UDE and the monitoring station Essen of the German national meteorological service DWD. The concentrations of the air pollutants NO, NO2 and PM10 are provided by the national air pollution network LANUV.

  15. Gestational Diabetes and Preeclampsia in Association with Air Pollution at Levels below Current Air Quality Guidelines

    PubMed Central

    Jakobsson, Kristina; Tinnerberg, Håkan; Rignell-Hydbom, Anna; Rylander, Lars

    2013-01-01

    Background: Several studies have estimated associations between air pollution and birth outcomes, but few have evaluated potential effects on pregnancy complications. Objective: We investigated whether low-level exposure to air pollution is associated with gestational diabetes and preeclampsia. Methods: High-quality registry information on 81,110 singleton pregnancy outcomes in southern Sweden during 1999–2005 was linked to individual-level exposure estimates with high spatial resolution. Modeled exposure to nitrogen oxides (NOx), expressed as mean concentrations per trimester, and proximity to roads of different traffic densities were used as proxy indicators of exposure to combustion-related air pollution. The data were analyzed by logistic regression, with and without adjusting for potential confounders. Results: The prevalence of gestational diabetes increased with each NOx quartile, with an adjusted odds ratio (OR) of 1.69 (95% CI: 1.41, 2.03) for the highest (> 22.7 µg/m3) compared with the lowest quartile (2.5–8.9 µg/m3) of exposure during the second trimester. The adjusted OR for acquiring preeclampsia after exposure during the third trimester was 1.51 (1.32, 1.73) in the highest quartile of NOx compared with the lowest. Both outcomes were associated with high traffic density, but ORs were significant for gestational diabetes only. Conclusion: NOx exposure during pregnancy was associated with gestational diabetes and preeclampsia in an area with air pollution levels below current air quality guidelines. PMID:23563048

  16. Laser soldering of flip-chips

    NASA Astrophysics Data System (ADS)

    Kordás, K.; Pap, A. E.; Tóth, G.; Pudas, M.; Jääskeläinen, J.; Uusimäki, A.; Vähäkangas, J.

    2006-02-01

    A novel process for laser soldering of flip-chips on transparent printed circuit board assemblies is presented. The experiments were carried out on silver test patterns printed on glass wafers using a roller-type gravure offset printing method. The contact pads, where the bumps of the flip-chips are positioned, were covered with a thin layer of additional solder paste. The aligned samples (solder pad—solder paste—chip bump) were illuminated through the glass substrate using an Ar + laser beam ( λ=488 nm, P=0.6-3.0 W, d=100 μm at 1/e) to heat the printed pad and melt the solder paste, thus forming a joint between the printed pad and the chip bump. The heat-affected zone was modeled using computer-assisted finite element method. The solder joint cross-sections were analyzed using optical and electron microscopy as well as energy dispersive X-ray element analyses. The laser-soldered joints were of good mechanical and electrical quality and the process proved to be suitable for manufacturing customized circuit prototypes.

  17. Influence of nickel-phosphorus surface roughness on wettability and pores formation in solder joints for high power electronic applications

    NASA Astrophysics Data System (ADS)

    Vivet, L.; Joudrier, A.-L.; Tan, K.-L.; Morelle, J.-M.; Etcheberry, A.; Chalumeau, L.

    2013-12-01

    Electroless nickel-high-phosphorus Ni-P plating is used as substrate coating in the electronic component technology. The ability to minimize pores formation in solder joints and the wettability of the Ni-P layer remain points of investigation. The qualities and the control of the physical and chemical properties of the deposits are essential for the reliability of the products. In this contribution it has been measured how a controlled change of one property of the Ni-P surface, its average roughness, changes the wettability of this surface before soldering completion, at ambient temperature and under ambient air, and how it contribute to change the amount and size of pores inside solder joints, after soldering completion. Before all, observations of the Ni-P surfaces using scanning electron microscopy have been achieved. Then the wettability has been measured through the determination of both the disperse and the polar fractions of the substrate surface tension, based on the measurements of the wetting angle for droplets of four different liquids, under ambient air and at room temperature (classical sessile drop technique). Finally the X-ray micro-radiography measurements of both the area fraction of pores and the size of the largest pore inside the solder joint of dice laser soldered on the studied substrate, using high melting temperature solder (300 °C, PbSnAg) have been achieved. This study clearly demonstrates that both the ability to minimize pores formation in solder joints and the wettability under ambient conditions of the Ni-P substrate decrease and become more variable when its average roughness increases. These effects can be explained considering the Cassie-Baxter model for rough surface wetting behaviour, completed by the model of heterogeneous nucleation and growth for gas bubbles inside a liquid.

  18. Laser Assisted Soldering: Effects of Hydration on Solder-Tissue Adhesion

    SciTech Connect

    Chan, E.K.; Welch, A.J.; Brown, D.T.; Kovach, I.S.

    1998-10-01

    Wound stabilization is critical in early wound healing. Other than superficial skin wounds, most tissue repair is exposed to a hydrated environment postoperatively. To simulate the stability of laser-soldered tissue in a wet environment, we studied the effects of hydration on laser soldered rat dermis and baboon articular cartilage. In this {ital in vitro} study, we used a solder composed of human serum albumin, sodium hyaluronate, and Indocyanine Green. A 2 {mu}L solder droplet was deposited on each tissue specimen and then the solder was irradiated with a scanning laser beam (808 nm and 27thinspW/cm{sup 2}). After photocoagulation, each tissue specimen was cut into two halves dividing the solder. One half was reserved as control while the other half was soaked in saline for a designated period before fixation (1 h, 1, 2, and 7 days). All tissue specimens were prepared for scanning electron microscopy (SEM). SEM examinations revealed nonuniform coagulation across the solder thickness for most of the specimens, likely a result of the temperature gradient generated by laser heating. Closer to the laser beam, the uppermost region of the solder formed a dense coagulum. The solder aggregated into small globules in the region anterior to the solder-tissue interface. All cartilage specimens soaked in saline suffered coagulum detachment from tissue surface. We noted a high concentration of the protein globules in the detached coagulum. These globules were likely responsible for solder detachment from the cartilage surface. Solder adhered better to the dermis than to cartilage. The dermal layer of the skin, composed of collagen matrix, provided a better entrapment of the solder than the smooth surface of articular cartilage. Insufficient laser heating of solder formed protein globules. Unstable solder-tissue fusion was likely a result of these globules being detached from tissue substrate when the specimen was submerged in a hydrated environment. The solder-tissue bonding

  19. Level-1C Product from AIRS: Principal Component Filtering

    NASA Technical Reports Server (NTRS)

    Manning, Evan M.; Jiang, Yibo; Aumann, Hartmut H.; Elliott, Denis A.; Hannon, Scott

    2012-01-01

    The Atmospheric Infrared Sounder (AIRS), launched on the EOS Aqua spacecraft on May 4, 2002, is a grating spectrometer with 2378 channels in the range 3.7 to 15.4 microns. In a grating spectrometer each individual radiance measurement is largely independent of all others. Most measurements are extremely accurate and have very low noise levels. However, some channels exhibit high noise levels or other anomalous behavior, complicating applications needing radiances throughout a band, such as cross-calibration with other instruments and regression retrieval algorithms. The AIRS Level-1C product is similar to Level-1B but with instrument artifacts removed. This paper focuses on the "cleaning" portion of Level-1C, which identifies bad radiance values within spectra and produces substitute radiances using redundant information from other channels. The substitution is done in two passes, first with a simple combination of values from neighboring channels, then with principal components. After results of the substitution are shown, differences between principal component reconstructed values and observed radiances are used to investigate detailed noise characteristics and spatial misalignment in other channels.

  20. Determinants of elite-level air rifle shooting performance.

    PubMed

    Ihalainen, S; Kuitunen, S; Mononen, K; Linnamo, V

    2016-03-01

    This study focused on identifying the most important factors determining performance in elite-level air rifle shooting technique. Forty international- and national-level shooters completed a simulated air rifle shooting competition series. From a total of 13 795 shots in 319 tests, shooting score and 17 aiming point trajectory variables were measured with an optoelectronic device and six postural balance variables were measured with force platform. Principal component analysis revealed six components in the air rifle shooting technique: aiming time, stability of hold, measurement time, cleanness of triggering, aiming accuracy, and timing of triggering. Multiple regression analysis identified four of those, namely stability of hold, cleanness of triggering, aiming accuracy, and timing of triggering as the most important predictors of shooting performance, accounting for 81% of the variance in shooting score. The direct effect of postural balance on performance was small, accounting for less than 1% of the variance in shooting score. Indirectly, the effect can be greater through a more stable holding ability, to which postural balance was correlated significantly (R = 0.55, P < 0.001). The results of the present study can be used in assessing athletes' technical strengths and weaknesses and in directing training programs on distinct shooting technical components.

  1. Laser soldering of Sn plated brass integrator assembly housings

    NASA Astrophysics Data System (ADS)

    Keicher, D. M.; Poulter, G. A.; Sorensen, N. R.

    1993-09-01

    The high conductivity provided by solder closure joints of component housings is sometimes required to ensure electrical shielding of the components contained within. However, using a soldering iron to produce the solder joints can lead to charring of the insulating materials within the housing. To overcome this problem, the localized heating characteristics of laser soldering can be exploited. The feasibility of laser soldering Sn plated brass housings with a CW Nd:YAG laser has been investigated. It has been determined that laser soldering of these housings using a low solids solder flux is a viable technique and will minimize the amount of heat input to the enclosed electronic components. Metallographic analysis has shown good wetting of the solder on the housing components. Accelerated aging experiments indicate that no significant corrosion potential due to solder flux residues exists. Although a low solids flux was used to make the joints, initial results indicate that a fluxless technique can be developed to eliminate fluxes completely.

  2. An air quality balance index estimating the total amount of air pollutants at ground level.

    PubMed

    Trivero, Paolo; Biamino, Walter; Borasi, Maria; Cavagnero, Marco; Musa, Maya; Rinaudo, Caterina; Sesia, Veronica

    2012-07-01

    A new index named Air Quality Balance Index (AQBI), which is able to characterise the amount of pollution level in a selected area, is proposed. This index is a function of the ratios between pollutant concentration values and their standards; it aims at identifying all situations in which there is a possible environmental risk even when several pollutants are below their limit values but air quality is reduced. AQBI is evaluated by using a high-resolution three-dimensional dispersion model: the air concentration for each substance is computed starting from detailed emissions sources: point, line and area emissions hourly modulated. This model is driven with accurate meteorological data from ground stations and remote sensing systems providing vertical profiles of temperature and wind; these data are integrated with wind and temperature profiles at higher altitudes obtained by a Local Area Model. The outputs of the dispersion model are compared with pollutant concentrations provided by measuring stations, in order to recalibrate emission data. A three-dimensional high resolution grid of AQBI data is evaluated for an industrial area close to Alessandria (Northern Italy), assessing air quality and environmental conditions. Performance of AQBI is compared with the Air Quality Index (AQI) developed by the U.S. Environmental Protection Agency. AQBI, computed taking into account all pollutants, is able to point out situations not evidenced by AQI, based on a preset limited number of substances; therefore, AQBI is a good tool for evaluating the air quality either in urban and in industrial areas. The AQBI values at ground level, in selected points, are in agreement with in situ observations.

  3. Laser ablative fluxless soldering (LAFS): 60Sn-40Pb solder wettability tests on laser cleaned OFHC copper substrates

    SciTech Connect

    Peebles, H. C.; Keicher, D. M.; Hosking, F. M.; Hlava, P. F.; Creager, N. A.

    1991-01-01

    OFHC copper substrates, cleaned by laser ablation under argon and helium gas, were tested for solder wettability by 60Sn-40Pb using an area-of-spread method. The wettability of copper surfaces cleaned under both argon and helium gas was found to equal or exceed the wettability obtained on this surface in air using a standard RMA flux. The area of spread on copper substrates cleaned under helium was eight times larger than the area of spread of substrates cleaned under argon. The enhanced spreading observed on the substrates cleaned under helium gas was found to be due to surface roughness. 11 refs., 8 figs., 2 tabs.

  4. Gram level synthesis of lead-free solder in the nanometer length scale obtained from tin and silver compounds using silicone oil.

    PubMed

    Pande, Surojit; Sarkar, Achintya Kumar; Basu, Mrinmoyee; Jana, Subhra; Sinha, Arun Kumar; Sarkar, Sougata; Pradhan, Mukul; Saha, Sandip; Pal, Anjali; Pal, Tarasankar

    2008-08-19

    A straightforward route to gram level synthesis of a pure phase of the Sn-Ag nanoalloy in an eutectic composition (Sn/Ag 96.5:3.5) in silicone oil is reported. The composition, morphology, and microstructure of the alloy were fully characterized. In a mixture of ethylene glycol and silicone oil, direct reduction of Sn(II) acetate and Ag(I) nitrate gave the Sn-Ag nanoalloy. The nanoalloy disintegrates by sonication and reforms by heating, leading to smaller particles with a melting point as low as 128 degrees C.

  5. How Many Peripheral Solder Joints in a Surface Mounted Design Experience Inelastic Strains?

    NASA Astrophysics Data System (ADS)

    Suhir, E.; Yi, S.; Ghaffarian, R.

    2017-01-01

    It has been established that it is the peripheral solder joints that are the most vulnerable in the ball-grid-array (BGA) and column-grid-array (CGA) designs and most often fail. As far as the long-term reliability of a soldered microelectronics assembly as a whole is concerned, it makes a difference, if just one or more peripheral joints experience inelastic strains. It is clear that the low cycle fatigue lifetime of the solder system is inversely proportional to the number of joints that simultaneously experience inelastic strains. A simple and physically meaningful analytical expression (formula) is obtained for the prediction, at the design stage, of the number of such joints, if any, for the given effective thermal expansion (contraction) mismatch of the package and PCB; materials and geometrical characteristics of the package/PCB assembly; package size; and, of course, the level of the yield stress in the solder material. The suggested formula can be used to determine if the inelastic strains in the solder material could be avoided by the proper selection of the above characteristics and, if not, how many peripheral joints are expected to simultaneously experience inelastic strains. The general concept is illustrated by a numerical example carried out for a typical BGA package. The suggested analytical model (formula) is applicable to any soldered microelectronics assembly. The roles of other important factors, such as, e.g., solder material anisotropy, grain size, and their random orientation within a joint, are viewed in this analysis as less important factors than the level of the interfacial stress. The roles of these factors will be accounted for in future work and considered, in addition to the location of the joint, in a more complicated, more sophisticated, and more comprehensive reliability/fatigue model.

  6. How Many Peripheral Solder Joints in a Surface Mounted Design Experience Inelastic Strains?

    NASA Astrophysics Data System (ADS)

    Suhir, E.; Yi, S.; Ghaffarian, R.

    2017-03-01

    It has been established that it is the peripheral solder joints that are the most vulnerable in the ball-grid-array (BGA) and column-grid-array (CGA) designs and most often fail. As far as the long-term reliability of a soldered microelectronics assembly as a whole is concerned, it makes a difference, if just one or more peripheral joints experience inelastic strains. It is clear that the low cycle fatigue lifetime of the solder system is inversely proportional to the number of joints that simultaneously experience inelastic strains. A simple and physically meaningful analytical expression (formula) is obtained for the prediction, at the design stage, of the number of such joints, if any, for the given effective thermal expansion (contraction) mismatch of the package and PCB; materials and geometrical characteristics of the package/PCB assembly; package size; and, of course, the level of the yield stress in the solder material. The suggested formula can be used to determine if the inelastic strains in the solder material could be avoided by the proper selection of the above characteristics and, if not, how many peripheral joints are expected to simultaneously experience inelastic strains. The general concept is illustrated by a numerical example carried out for a typical BGA package. The suggested analytical model (formula) is applicable to any soldered microelectronics assembly. The roles of other important factors, such as, e.g., solder material anisotropy, grain size, and their random orientation within a joint, are viewed in this analysis as less important factors than the level of the interfacial stress. The roles of these factors will be accounted for in future work and considered, in addition to the location of the joint, in a more complicated, more sophisticated, and more comprehensive reliability/fatigue model.

  7. Modelled air pollution levels versus EC air quality legislation - results from high resolution simulation.

    PubMed

    Chervenkov, Hristo

    2013-12-01

    An appropriate method for evaluating the air quality of a certain area is to contrast the actual air pollution levels to the critical ones, prescribed in the legislative standards. The application of numerical simulation models for assessing the real air quality status is allowed by the legislation of the European Community (EC). This approach is preferable, especially when the area of interest is relatively big and/or the network of measurement stations is sparse, and the available observational data are scarce, respectively. Such method is very efficient for similar assessment studies due to continuous spatio-temporal coverage of the obtained results. In the study the values of the concentration of the harmful substances sulphur dioxide, (SO2), nitrogen dioxide (NO2), particulate matter - coarse (PM10) and fine (PM2.5) fraction, ozone (O3), carbon monoxide (CO) and ammonia (NH3) in the surface layer obtained from modelling simulations with resolution 10 km on hourly bases are taken to calculate the necessary statistical quantities which are used for comparison with the corresponding critical levels, prescribed in the EC directives. For part of them (PM2.5, CO and NH3) this is done for first time with such resolution. The computational grid covers Bulgaria entirely and some surrounding territories and the calculations are made for every year in the period 1991-2000. The averaged over the whole time slice results can be treated as representative for the air quality situation of the last decade of the former century.

  8. Induction soldering of photovoltaic system components

    SciTech Connect

    Kumaria, Shashwat; de Leon, Briccio

    2015-11-17

    A method comprises positioning a pair of photovoltaic wafers in a side-by-side arrangement. An interconnect is placed on the pair of wafers such that the interconnect overlaps both wafers of the pair, solder material being provided between the interconnect and the respective wafers. A solder head is then located adjacent the interconnect, and the coil is energized to effect inductive heating of the solder material. The solder head comprises an induction coil shaped to define an eye, and a magnetic field concentrator located at least partially in the eye of the coil. The magnetic field concentrator defines a passage extending axially through the eye of the coil, and may be of a material with a high magnetic permeability.

  9. Air quality in Moscow megacity: basic level and extreme cases

    NASA Astrophysics Data System (ADS)

    Pankratova, N.; Skorokhod, A.; Moiseenko, K.

    2012-04-01

    Moscow is one of the largest megacities in the world. Total annual emissions of polluting substances into the atmosphere in Moscow is likely to be about 2,0 mln. t. More than 90% of pollutants are emitted by traffic. Problem of air quality assessment is very urgent for Moscow both to alarm population and to compare with other world megacities. To study contemporary structure of atmospheric pollution over Moscow megacity data on air composition (including CO, NO, NO2, O3, CH4, CO2, SO2, NMHC, aerosol) obtained since 2002 has been analyzed. The monitoring site is located at Moscow State University meteorological observatory on South-West of Moscow. All observations are provided by A.M. Obukhov Institute of Atmospheric Physics RAS. Due to these continuous measurements typical (basic) level of pollution as well as extreme cases have been studied. The relationship between O3, NOx and VOCs were analyzed as well. Due to weather conditions (cyclonic regime is dominated) concentrations of pollutants usually do not reach dangerous levels but sometimes they are high. The case of abnormal hot and dry weather in the summer of 2010 was investigated. Many Russians were suffering from the record-breaking heat and the worst drought in 40 years. The heat was caused by very intensive and stable blocking anticyclone that established in Moscow since June, 18 till August, 18. Anticyclone of such strength has been never observed before. During 33 days in succession surface air temperature exceeded 30°C. During these 2 months troposphere over ETR was almost closed for western winds. Hot weather led to numerous forest and peat fires (about 29,000 cases) with total covered area about 12,000 km2. One of aftermaths was significant change of atmospheric composition. Many cities and settlements were covered by dense haze from fires. Evident presence of high amount of aerosol in the ambient air caused anxiety and application of safeguards. Meanwhile, less obvious increase of concentrations of

  10. A comparison of X-ray fluorescence and wet chemical analysis for lead on air filters from different personal samplers used in a secondary lead smelter/solder manufacturer.

    PubMed

    Harper, Martin; Pacolay, Bruce

    2006-01-01

    Portable X-ray fluorescence (XRF) technology may provide faster turn-around without compromising accuracy when assessing personal exposures to metals such as lead, but it has only been tested in limited field environments. This study is part of a series, where various types of sampler are used to collect airborne lead in different environments for presentation to a portable XRF analyzer. In this case personal samples were taken at a manufacturer of solder alloys consisting mainly of lead and tin, using the closed-face 37 mm cassette (CFC), the 37 mm GSP or "cone" sampler, the 25 mm Institute of Occupational Medicine (IOM) inhalable sampler, the 25 mm button sampler, and the open-face 25 mm cassette. Mixed cellulose-ester filters were used in all samplers. Following XRF analysis the samples were extracted with acid and analyzed by inductively coupled plasma optical emission spectroscopy (ICP). The internal surfaces of CFC's and 25 mm open-face cassettes were also wiped, and the wipes analyzed for lead to assess wall-losses in these two samplers. Analysis of all elements present is useful to ascertain contributions to matrix interference effects. In addition to lead, other metals such as tin, copper, iron, silver, cadmium and antimony were also detected in some or all of the samples by ICP analysis, but only copper and iron could be determined using the XRF analyzer under test. After the removal of a few outliers, all five samplers gave good correlations (r(2) > 0.9) between the two analytical methods over the entire range of found lead mass, which encompassed both the action level and the permissible exposure limit enforced in the USA by the Occupational Safety and Health Administration (OSHA). Linear regression on the results from most samplers gave almost 1 ratio 1 correlations without additional correction, indicating an absence of matrix effects, particularly from tin, which was the most common element after lead. The average of three XRF readings across filters

  11. Shrink-Fit Solderable Inserts Seal Hermetically

    NASA Technical Reports Server (NTRS)

    Croucher, William C.

    1992-01-01

    Shrink-fit stainless-steel insert in aluminum equipment housing allows electrical connectors to be replaced by soldering, without degrading hermeticity of housing or connector. Welding could destroy electrostatic-sensitive components and harm housing and internal cables. Steel insert avoids problems because connector soldered directly to it rather than welded to housing. Seals between flange and housing, and between connector and flange resistant to leaks, even after mechanical overloading and thermal shocking.

  12. Microstructural influences on the mechanical properties of solder

    SciTech Connect

    Morris, J.W. Jr.; Goldstein, J.L.F.; Mei, Z.

    1993-04-01

    Intent of this book is to review analytic methods for predicting behavior of solder joints, based on continuum mechanics. The solder is treated as a continuous, homogeneous body, or composite of such bodies, whose mechanical behavior is uniform and governed by simple constitutive equations. The microstructure of a solder joint influences its mechanical properties in 3 ways: it governs deformation and failure; common solders deform inhomogeneously; and common solders are microstructurally unstable. The variety of microstructures often found in solder joints are briefly reviewed, and some of the ways are discussed in which the microstructure influences the common types of high-temperature mechanical behavior. 25 figs, 40 refs.

  13. SNL initiatives in electronic fluxless soldering

    SciTech Connect

    Hosking, F.M.; Frear, D.R.; Vianco, P.T.; Keicher, D.M.

    1991-01-01

    Conventional soldering of electronic components generally requires the application of a chemical flux to promote solder wetting and flow. Chlorofluorocarbons (CFC) and halogenated solvents are normally used to remove the resulting flux residues. While such practice has been routinely accepted throughout the electronics industry, the environmental impact of hazardous solvents on ozone depletion will eventually limit or prevent their use. Solvent substitution or alternative technologies must be developed to meet these goals. Sandia National Laboratories, Albuquerque has a comprehensive environmentally conscious electronics manufacturing program underway that is funded by the DOE Office of Technology Development. Primary elements of the integrated task are the characterization and development of alternative fluxless soldering technologies that would eliminate circuit board cleaning associated with flux residue removal. Storage and handling of hazardous solvents and mixed solvent-flux waste would be consequently reduced during electronics soldering. This paper will report on the progress of the SNL fluxless soldering initiative. Emphasis is placed on the use of controlled atmospheres, laser heating, and ultrasonic soldering.

  14. Computational continuum modeling of solder interconnects

    SciTech Connect

    Burchett, S.N.; Neilsen, M.K.; Frear, D.R.; Stephens, J.J.

    1997-03-01

    The most commonly used solder for electrical interconnections in electronic packages is the near eutectic 60Sn-40Pb alloy. This alloy has a number of processing advantages (suitable melting point of 183 C and good wetting behavior). However, under conditions of cyclic strain and temperature (thermomechanical fatigue), the microstructure of this alloy undergoes a heterogeneous coarsening and failure process that makes prediction of solder joint lifetime complex. A viscoplastic, microstructure dependent, constitutive model for solder which is currently in development was implemented into a finite element code. With this computational capability, the thermomechanical response of solder interconnects, including microstructural evolution, can be predicted. This capability was applied to predict the thermomechanical response of various leadless chip carrier solder interconnects to determine the effects of variations in geometry and loading. In this paper, the constitutive model will first be briefly discussed. The results of computational studies to determine the effect of geometry and loading variations on leadless chip carrier solder interconnects then will be presented.

  15. Air Quality Planning Unit | Ground-level Ozone | New England ...

    EPA Pesticide Factsheets

    2017-04-10

    Looking for answers about a specific air quality issue? Here's a list of topics and programs related to air quality and Air Quality Planning (AQP) staff who can answer questions and provide information about them.

  16. Air Quality Planning Unit | Ground-level Ozone | New England ...

    EPA Pesticide Factsheets

    2017-02-16

    Looking for answers about a specific air quality issue? Here's a list of topics and programs related to air quality and Air Quality Planning (AQP) staff who can answer questions and provide information about them.

  17. Survey of New Jersey schools and day care centers for lead in plumbing solder. Identification of lead solder and prevention of exposure to drinking water contaminated with lead from plumbing solder.

    PubMed

    Berkowitz, M

    1995-10-01

    Levels of lead in drinking water can be high enough to pose a potential health threat to very young children, primarily from the use of lead solder for indoor plumbing. In February 1987, New Jersey banned lead solder for use in the installation or repair of drinking water plumbing systems. However, because lead solder continued to be available for purchase in the state, New Jersey Department of Health staff sought to (i) determine the extent to which schools and day care centers were in compliance with the ban, and (ii) determine the effectiveness of a solder analysis test kit commonly used by plumbing inspectors in the field. Samples of solder were collected from 53 day care centers and 37 schools known to have been constructed or renovated after the ban took effect. Samples from 24% of those facilities constructed or renovated just after the lead ban (1987-1988) tested positive for lead content. However, for those facilities constructed or renovated in later years (1989-1992), there was a decline in the percentage of samples that tested positive for lead content. For this period of time, 13% of the samples tested positive for lead. In total, more than 10% of facilities with new plumbing installed between 1987 and 1992 had solder samples that tested positive for lead. A lead in solder test kit commonly used by inspectors proved to be an effective screening tool for the field. The New Jersey Department of Health recommends continued enforcement of the lead solder ban through inspection and encouragement of behaviors that minimize consumption of potentially lead-contaminated drinking water. In order to assess patterns of water use, staff at the day care centers were asked to complete a questionnaire. Sixty-seven percent of the respondents reported that they "always" use water from the cold tap when preparing drinks or food for the children. In addition, 57% reported that they always first flush the tap before using the water for drinking or food purposes. Posters

  18. Corrosion resistance of the soldering joint of post-soldering of palladium-based metal-ceramic alloys.

    PubMed

    Kawada, E; Sakurai, Y; Oda, Y

    1997-05-01

    To evaluate the corrosion resistance of post soldering of metal-ceramic alloys, four commercially available palladium-system metal-ceramic alloys (Pd-Cu, Pd-Ni, Pd-Ag, and Pd-Sb systems) and two types of solder (12 k gold solder and 16 k gold solder) with different compositions and melting points were used. The corrosion resistance of the soldered joint was evaluated by anodic polarization. The electrochemical characteristics of soldered surface were measured using electrochemical equipment. Declines in corrosion resistance were not detectable with Pd-Cu, Pd-Ag and Pd-Sb types, but break down at low potential occurred with Pd-Ni type.

  19. Thermomechanical fatigue life prediction for several solders

    NASA Astrophysics Data System (ADS)

    Wen, Shengmin

    Since solder connections operate at high homologous temperature, solders are high temperature materials. This feature makes their mechanical behavior and fatigue phenomena unique. Based on experimental findings, a physical damage mechanism is introduced for solders. The mechanism views the damage process as a series of independent local damage events characterized by the failure of individual grains, while the structural damage is the eventual percolation result of such local events. Fine's dislocation energy density concept and Mura's microcrack initiation theory are adopted to derive the fatigue formula for an individual grain. A physical damage metric is introduced to describe the material with damage. A unified creep and plasticity constitutive model is adopted to simulate the mechanical behavior of solders. The model is cast into a continuum damage mechanics framework to simulate material with damage. The model gives good agreement with the experimental results of 96.5Pb-3.5Sn and 96.5Sn-3.5Ag solders under uniaxial strain-controlled cyclic loading. The model is convenient for implementation into commercial computational packages. Also presented is a fatigue theory with its failure criterion for solders based on physical damage mechanism. By introducing grain orientation into the fatigue formula, an m-N curve (m is Schmid factor) at constant loading condition is suggested for fatigue of grains with different orientations. A solder structure is defined as fatigued when the damage metric reaches a critical threshold, since at this threshold the failed grains may form a cluster and percolate through the structure according to percolation theory. Fatigue data of 96.5Pb-3.5Sn solder bulk specimens under various uniaxial tension tests were analyzed. Results show that the theory gives consistent predictions under broad conditions, while inelastic strain theory does not. The theory is anisotropic with no size limitation to its application, which could be suitable for

  20. Effect of processing parameters and thermal cycling on the microstructure and strength of eutectic tin-silver solder on Cu

    NASA Astrophysics Data System (ADS)

    Chada, Srinivas

    Detailed studies to characterize the microstructural development and mechanical properties of eutectic Sn-Ag solder joints were carried out on samples reflow soldered on copper under various processing conditions. Some samples were reflow soldered at 30sp°C above the melting point and then solidified at different cooling rates. Analysis of these samples showed that increasing the cooling rate increased the volume fraction of primary Sn-dendrites, decreased the amount of eta(Cusb6Snsb5) intermetallics in the bulk solder, and resulted in finer microstructures with higher hardnesses. Subsequent isothermal annealing of some of these reflow soldered joints at 125sp°C resulted in an initially fairly rapid decrease in hardness to a given level for each cooling rate studied. However, the cooling rate had little or no effect on the shear strength of the solder joints. Studies of the effect of Cu substrate dissolution on the microstructure of solder joints were carried out using samples reflow soldered isothermally at various temperatures and times. Analysis of some of these samples showed that the Cu concentration, the volume fraction of primary Sn-dendrites and eta(Cusb6Snsb5) intermetallics in the solder increased with reflow temperature and time as a result of Cu dissolution. The isothermal growth kinetics were analyzed using the Nernst-Brunner equation and a numerical method based on it was proposed to predict the amount of Cu dissolution into molten solder for non-isothermal reflow conditions. Isothermal growth of the intermetallic layer between the solder and Cu substrate was investigated, and it was found that layer thickening with time could be described by a power law. A numerical method to predict the layer thickness for non-isothermal reflow was developed which utilized the experimental power law thickening and Nernst-Brunner dissolution kinetic parameters. The method also took into account the additional increase in layer thickness caused by precipitation of

  1. Computer simulation of solder joint failure

    SciTech Connect

    Burchett, S.N.; Frear, D.R.; Rashid, M.M.

    1997-04-01

    The thermomechanical fatigue failure of solder joints is increasingly becoming an important reliability issue for electronic packages. The purpose of this Laboratory Directed Research and Development (LDRD) project was to develop computational tools for simulating the behavior of solder joints under strain and temperature cycling, taking into account the microstructural heterogeneities that exist in as-solidified near eutectic Sn-Pb joints, as well as subsequent microstructural evolution. The authors present two computational constitutive models, a two-phase model and a single-phase model, that were developed to predict the behavior of near eutectic Sn-Pb solder joints under fatigue conditions. Unique metallurgical tests provide the fundamental input for the constitutive relations. The two-phase model mathematically predicts the heterogeneous coarsening behavior of near eutectic Sn-Pb solder. The finite element simulations with this model agree qualitatively with experimental thermomechanical fatigue tests. The simulations show that the presence of an initial heterogeneity in the solder microstructure could significantly degrade the fatigue lifetime. The single-phase model was developed to predict solder joint behavior using materials data for constitutive relation constants that could be determined through straightforward metallurgical experiments. Special thermomechanical fatigue tests were developed to give fundamental materials input to the models, and an in situ SEM thermomechanical fatigue test system was developed to characterize microstructural evolution and the mechanical behavior of solder joints during the test. A shear/torsion test sample was developed to impose strain in two different orientations. Materials constants were derived from these tests. The simulation results from the two-phase model showed good fit to the experimental test results.

  2. Characterization of tin crystal orientation evolution during thermal cycling in lead-free solder joints

    NASA Astrophysics Data System (ADS)

    Zhou, Bite

    To address the long term reliability of lead-free solder joints in electronic devices during thermal cycling, the fundamental understanding of deformation mechanisms was studied using polarized light optical microscopy (PLM), electron backscatter diffraction (EBSD) in scanning electron microscopy (SEM), and synchrotron X-ray diffraction (XRD). Near-eutectic Sn-3.0(wt %) Ag-0.5(wt %) Cu (SAC305) lead-free solder joints were assessed in three different package designs: low-strain plastic ball grid array (PBGA), medium-strain fine-pitch ball grid array (BGA), and high-strain wafer-level-chip-scale package (WLCSP). The effect of microstructure evolution on solder failure is correlated with dislocation slip activities. The major failure mode in lead-free solder joints during thermal cycling that causes the electrical failure of the device is cracking in the bulk Sn near the Si chip/solder interface. Microstructure and Sn grain orientation evolution usually precedes crack development. A combined approach of both statistical analysis of a large number of solder joints, and detailed studies of individual solder balls was used to investigate the causes of fracture. Sn crystal orientation evolution and its effect on deformation was characterized in solder joints with different thermal histories, and compared with those from other package designs with different effective strain levels. The relationship between the initial dominant and localized recrystallized Sn grain orientations on crack development was investigated. It is found that in the low-strain package design, cracking is strongly correlated with Sn grain orientations with the [001] direction (c-axis) nearly aligned with the chip/solder interface. But no cracks were observed in solder balls with dominant orientations that have the c-axis normal to the interface plane. In higher-strain packages, however, cracking occurred in a variety of Sn grain orientations, and even solder balls with dominant orientations that are

  3. Dynamic Response of Soldered Electronic Components under Impact Loading

    DTIC Science & Technology

    2011-12-01

    2   2.   Varying Strain Rates and Solder Joint Failure .................................3   3.   Drop Impact Analysis on Sn - Ag -Cu...absence of significant internal grain rotation, and that it consistent at all strain-rates. 4 3. Drop Impact Analysis on Sn - Ag -Cu Solder Joints...Pang and Che [4] discuss the complexities of drop test analysis and the dangers of over simplifying Sn - Ag -Cu solder joint deformation response. Solder

  4. 42 CFR 84.140 - Air velocity and noise levels; hoods and helmets; minimum requirements.

    Code of Federal Regulations, 2014 CFR

    2014-10-01

    ... 42 Public Health 1 2014-10-01 2014-10-01 false Air velocity and noise levels; hoods and helmets... PROTECTIVE DEVICES Supplied-Air Respirators § 84.140 Air velocity and noise levels; hoods and helmets; minimum requirements. Noise levels generated by the respirator will be measured inside the hood or...

  5. 42 CFR 84.140 - Air velocity and noise levels; hoods and helmets; minimum requirements.

    Code of Federal Regulations, 2013 CFR

    2013-10-01

    ... 42 Public Health 1 2013-10-01 2013-10-01 false Air velocity and noise levels; hoods and helmets... PROTECTIVE DEVICES Supplied-Air Respirators § 84.140 Air velocity and noise levels; hoods and helmets; minimum requirements. Noise levels generated by the respirator will be measured inside the hood or...

  6. 42 CFR 84.140 - Air velocity and noise levels; hoods and helmets; minimum requirements.

    Code of Federal Regulations, 2010 CFR

    2010-10-01

    ... 42 Public Health 1 2010-10-01 2010-10-01 false Air velocity and noise levels; hoods and helmets... PROTECTIVE DEVICES Supplied-Air Respirators § 84.140 Air velocity and noise levels; hoods and helmets; minimum requirements. Noise levels generated by the respirator will be measured inside the hood or...

  7. 42 CFR 84.140 - Air velocity and noise levels; hoods and helmets; minimum requirements.

    Code of Federal Regulations, 2011 CFR

    2011-10-01

    ... 42 Public Health 1 2011-10-01 2011-10-01 false Air velocity and noise levels; hoods and helmets... PROTECTIVE DEVICES Supplied-Air Respirators § 84.140 Air velocity and noise levels; hoods and helmets; minimum requirements. Noise levels generated by the respirator will be measured inside the hood or...

  8. 42 CFR 84.140 - Air velocity and noise levels; hoods and helmets; minimum requirements.

    Code of Federal Regulations, 2012 CFR

    2012-10-01

    ... 42 Public Health 1 2012-10-01 2012-10-01 false Air velocity and noise levels; hoods and helmets... PROTECTIVE DEVICES Supplied-Air Respirators § 84.140 Air velocity and noise levels; hoods and helmets; minimum requirements. Noise levels generated by the respirator will be measured inside the hood or...

  9. The advantages and disadvantages of centralized control of air power at operational level

    NASA Astrophysics Data System (ADS)

    Arisoy, Uǧur

    2014-05-01

    People do not want to see and hear a war. In today's world, if war is inevitable, the use of air power is seen as the preferable means of conducting operations instead of financially burdensome land battles which are more likely to cause heavy loss of life. The use of Air Power has gained importance in NATO operations in the Post-Cold War era. For example, air power has undertaken a decisive role from the beginning to the end of the operation in Libya. From this point of view, the most important issue to consider is how to direct air power more effectively at operational level. NATO's Core JFAC (Joint Force Air Command) was established in 2012 to control joint air power at operational level from a single center. US had experienced JFAC aproach in the Operation Desert Storm in 1991. UK, France, Germany, Italy and Spain are also directing their air power from their JFAC structures. Joint air power can be directed from a single center at operational level by means of JFAC. JFAC aproach provides complex planning progress of Air Power to be controled faster in a single center. An Air Power with a large number of aircrafts, long range missiles of cutting-edge technology may have difficulties in achieving results unless directed effectively. In this article, directing air power more effectively at operational level has been studied in the framework of directing air power from a single center carried out by SWOT analysis technique. "Directing Air Power at operational level from a single center similar to JFAC-like structure" is compared with "Directing Air Power at operational level from two centers similar to AC (Air Command) + CAOC (Combined Air Operations Center) structure" As a result of this study, it is assessed that directing air power at operational level from a single center would bring effectiveness to the air campaign. The study examines directing air power at operational level. Developments at political, strategic and tactical levels have been ignored.

  10. Microstructural evolution of eutectic Au-Sn solder joints

    SciTech Connect

    Song, Ho Geon

    2002-05-01

    Current trends toward miniaturization and the use of lead(Pb)-free solder in electronic packaging present new problems in the reliability of solder joints. This study was performed in order to understand the microstructure and microstructural evolution of small volumes of nominally eutectic Au-Sn solder joints (80Au-20Sn by weight), which gives insight into properties and reliability.

  11. Efforts to Develop a 300°C Solder

    SciTech Connect

    Norann, Randy A

    2015-01-25

    This paper covers the efforts made to find a 300°C electrical solder solution for geothermal well monitoring and logging tools by Perma Works LLC. This paper covers: why a high temperature solder is needed, what makes for a good solder, testing flux, testing conductive epoxy and testing intermetallic bonds. Future areas of research are suggested.

  12. The Influence of Declining Air Lead Levels on Blood Lead-Air Lead Slope Factors in Children

    EPA Science Inventory

    This presentation describes calculation of blood lead-air lead slope factor within an analysis of the relationship between blood lead levels and air lead levels among participants in the National Health and Nutrition Examination Survey (NHANES). The slope factors are compared wi...

  13. Electromigration and solid state aging of flip chip solder joints and analysis of tin whisker on lead-frame

    NASA Astrophysics Data System (ADS)

    Lee, Taekyeong

    Electromigration and solid state aging in flip chip joint, and whisker on lead frame of Pb-containing (eutectic SnPb) and Pb-free solders (SnAg 3.5, SnAg3.8Cu0.7, and SnCu0.7), have been studied systematically, using Scanning Electron Microscopy (SEM), Energy Dispersive X-ray Analysis (EDX), and synchrotron radiation. The high current density in flip chip joint drives the diffusion of atoms of eutectic SnPb and SnAgCu. A marker is used to measure the diffusion flux in a half cross-sectioned solder joint. SnAgCu shows higher resistance against electromigration than eutectic SnPb. In the half cross-sectioned solder joint, void growth is the dominant failure mechanism. However, the whole solder balls in the underfill show that the failure mechanism is a result from the dissolution of electroless Ni under bump metallization (UBM) of about 10 mum thickness. The growth rate between intermetallic compounds in molten and solid solders differed by four orders of magnitude. In liquid solder, the growth rate is about 1 mum/min; the growth rate in solid solder is only about 10 -4 mum/min. The difference is not resulting from factors of thermodynamics, which is the change of Gibbs free energy before and after intermetallic compound formation, but from kinetic factors, which is the rate of change of Gibbs free energy. Even though the difference in growth rate between eutectic SnPb and Pb-free solders during solid state aging was found, the reason behind such difference shown is unclear. The orientation and stress levels of whiskers are measured by white X-ray of synchrotron radiation. The growth direction is nearly parallel to one of the principal axes of tin. The compressive stress level is quite low because the residual stress is relaxed by the whisker growth.

  14. Fluxless laser soldering for electronic packaging

    SciTech Connect

    Hosking, F.M.; Keicher, D.M.

    1991-12-31

    Conventional soldering typically requires the use of reactive fluxes to promote wetting. The resulting flux residues are removed primarily with halogenated or chlorofluorocarbon (CFC) solvents. With the mandated phaseout of CFCs by the year 2000, there has been a concentrated effort to develop alternative, environmentally compatible manufacturing and cleaning technologies that will satisfy the restrictions placed on CFCs, but still yield high quality product. Sandia National Laboratories is currently evaluating a variety of alternative fluxless soldering technologies which can be applied to electronic packaging. Laser soldering in a controlled atmosphere has shown great potential as an environmentally compatible process. The effects of laser heating with a 100 watt CW Nd:YAG laser, joint design, and base/filler metal reactions on achieving fluxless wetting with good metallurgical bonds were examined. Satisfactory Ni-Au plated Kovar{reg_sign} solder joints were made with 80In-15Pb-5Ag and 63Sn-37Pb (wt. %) solder alloys in a slightly reducing cover gas. Wetting generally increased with increasing laser power, decreasing laser beam spot size, and decreasing part travel speed. The materials and processing interaction effects are identified and discussed.

  15. NASA-DoD Lower Process Temperature Lead-Free Solder Project Overview

    NASA Technical Reports Server (NTRS)

    Kessel, Kurt R.

    2014-01-01

    This project is a follow-on effort to the Joint Council on Aging AircraftJoint Group on Pollution Prevention (JCAAJG-PP) Pb-free Solder Project and NASA-DoD Lead-Free Electronics Project which were the first projects to test the reliability of Pb-free solder joints against the requirements of the aerospace and military community. This effort would continue to build on the results from the JCAAJG-PP Lead-Free Solder Project and NASA-DoD Lead-Free Electronics Project while focusing on a particular failure mechanism currently plaguing Pb-free assemblies, pad cratering.The NASA-DoD Lead-Free Electronics Project confirmed that pad cratering is one of the dominant failure modes that occur in various board level reliability tests, especially under dynamic loading. Pad Cratering is a latent defect that may occur during assembly, rework, and post assembly handling and testing.

  16. A novel method for direct solder bump pull testing using lead-free solders

    NASA Astrophysics Data System (ADS)

    Turner, Gregory Alan

    This thesis focuses on the design, fabrication, and evaluation of a new method for testing the adhesion strength of lead-free solders, named the Isotraction Bump Pull method (IBP). In order to develop a direct solder joint-strength testing method that did not require customization for different solder types, bump sizes, specific equipment, or trial-and-error, a combination of two widely used and accepted standards was created. First, solder bumps were made from three types of lead free solder were generated on untreated copper PCB substrates using an in-house fabricated solder bump-on-demand generator, Following this, the newly developed method made use of a polymer epoxy to encapsulate the solder bumps that could then be tested under tension using a high precision universal vertical load machine. The tests produced repeatable and predictable results for each of the three alloys tested that were in agreement with the relative behavior of the same alloys using other testing methods in the literature. The median peak stress at failure for the three solders tested were 2020.52 psi, 940.57 psi, and 2781.0 psi, and were within one standard deviation of the of all data collected for each solder. The assumptions in this work that brittle fracture occurred through the Intermetallic Compound layer (IMC) were validated with the use of Energy-Dispersive X-Ray Spectrometry and high magnification of the fractured surface of both newly exposed sides of the test specimens. Following this, an examination of the process to apply the results from the tensile tests into standard material science equations for the fracture of the systems was performed..

  17. Low temperature solder process to join a copper tube to a silicon wafer

    NASA Astrophysics Data System (ADS)

    Versteeg, Christo; Scarpim de Souza, Marcio

    2014-06-01

    With the application for wafer level packages, which could be Complementary Metal-Oxide-Semiconductor (CMOS) based, and which requires a reduced atmosphere, a copper tube connection to a vacuum pump and the package is proposed. The method evaluated uses laser assisted brazing of a solder, to join the copper tube to a silicon wafer. The method was applied to a silicon wafer coated with a metallic interface to bond to the solder. The hermeticity of the joint was tested with a helium leak rate tester and the bonding energy thermal extent was verified with a thin layer of indium that melted wherever the substrate temperature rose above its melting temperature.

  18. A metallographic evaluation of the stainless steel-silver solder joint.

    PubMed

    Rogers, O W

    1979-02-01

    A technique has been developed and described for the examination of the interface between dissimilar metals, utilizing electrolytic etching and gold electro-deposition procedures. This procedure permitted etching of both the constituents of the silver solder-stainless steel interface without differential leveling. The grain boundaries at the surface of the stainless steel interface were accentuated by the chemical action of the flux during the joining procedure and the notched grain boundaries influenced the nucleation of the silver solder. No evidence of alloying was found within the resolution of the instruments used.

  19. Voiding in lead-free soldering of components with large solder pads

    NASA Astrophysics Data System (ADS)

    Dziurdzia, Barbara; Mikołajek, Janusz

    2016-12-01

    The paper presents the quantification of void formation in lead-free solder joints underneath bottom terminated components (BTCs) through X-ray inspection. Experiments were designed to investigate how void formation is affected by using vacuum in reflow soldering on the example of light emitted diode (LED) packages on metal core printed circuit boards (PCBs). Convection and vapour phase reflow soldering were used for LED assembly. X-ray inspection system analyzed the statistical distribution, mean value, standard deviation and process capability value Cpk of thermal pads coverage for various technological versions of LEDs.

  20. Nanocopper Based Solder-Free Electronic Assembly

    NASA Astrophysics Data System (ADS)

    Schnabl, K.; Wentlent, L.; Mootoo, K.; Khasawneh, S.; Zinn, A. A.; Beddow, J.; Hauptfleisch, E.; Blass, D.; Borgesen, P.

    2014-12-01

    CuantumFuse nano copper material has been used to assemble functional LED test boards and a small camera board with a 48 pad CMOS sensor quad-flat no-lead chip and a 10 in flexible electronics demo. Drop-in replacement of solder, by use of stencil printing and standard surface mount technology equipment, has been demonstrated. Applications in space and commercial systems are currently under consideration. The stable copper-nanoparticle paste has been examined and characterized by scanning electron microscopy and high-resolution transmission electron microscopy; this has shown that the joints are nanocrystalline but with substantial porosity. Assessment of reliability is expected to be complicated by this and by the effects of thermal and strain-enhanced coarsening of pores. Strength, creep, and fatigue properties were measured and results are discussed with reference to our understanding of solder reliability to assess the potential of this nano-copper based solder alternative.

  1. Solder Joint Health Monitoring Testbed System

    NASA Technical Reports Server (NTRS)

    Delaney, Michael M.

    2009-01-01

    The density and pin count for Field Programmable Gate Arrays (FPGAs) has been increasing, and has exceeded current methods of solder joint inspection, making early detection of failures more problematic. These failures are a concern for both flight safety and maintenance in commercial aviation. Ridgetop Group, Inc. has developed a method for detecting solder joint failures in real time. The NASA Dryden Flight Research Center is developing a set of boards to test this method in ground environmental and accelerated testing as well as flight test on a Dryden F-15 or F-18 research aircraft. In addition to detecting intermittent and total solder joint failures, environmental data on the boards, such as temperature and vibration, will be collected and time-correlated to aircraft state data. This paper details the technical approach involved in the detection process, and describes the design process and products to date for Dryden s FPGA failure detection boards.

  2. Parametric study on the solderability of etched PWB copper

    SciTech Connect

    Hosking, F.M.; Stevenson, J.O.; Hernandez, C.L.

    1996-10-01

    The rapid advancement of interconnect technology has resulted in a more engineered approach to designing and fabricating printed wiring board (PWB) surface features. Recent research at Sandia National Laboratories has demonstrated the importance of surface roughness on solder flow. This paper describes how chemical etching was used to enhance the solderability of surfaces that were normally difficult to wet. The effects of circuit geometry, etch concentration, and etching time on solder flow are discussed. Surface roughness and solder flow data are presented. The results clearly demonstrate the importance of surface roughness on the solderability of fine PWB surface mount features.

  3. Lead (Pb)-Free Solder Applications

    SciTech Connect

    VIANCO,PAUL T.

    2000-08-15

    Legislative and marketing forces both abroad and in the US are causing the electronics industry to consider the use of Pb-free solders in place of traditional Sn-Pb alloys. Previous case studies have demonstrated the satisfactory manufacturability and reliability of several Pb-free compositions for printed circuit board applications. Those data, together with the results of fundamental studies on Pb-free solder materials, have indicated the general feasibility of their use in the broader range of present-day, electrical and electronic components.

  4. ESD Test Apparatus for Soldering Irons

    NASA Technical Reports Server (NTRS)

    Sancho, Jose; Esser, Robert

    2013-01-01

    ESDA (Electrostatic Discharge Association) ESD STM 13.1-2000 requires frequent testing of the voltage leakage from the tip of a soldering iron and the resistance from the tip of the soldering iron to the common point ground. Without this test apparatus, the process is time-consuming and requires several wires, alligator clips, or test probes, as well as additional equipment. Soldering iron tips must be tested for electrostatic discharge risks frequently, and this typically takes a lot of time in setup and testing. This device enables the operator to execute the full test in one minute or less. This innovation is a simple apparatus that plugs into a digital multimeter (DMM) and the Common Point Ground (CPG) reference. It enables the user to perform two of the electrostatic discharge tests required in ESD STM 13.1-2000. The device consists of a small black box with two prongs sticking out of one end, two inputs on the opposite end (one of the inputs is used to connect the reference CPG to the DMM), and a metal tab on one side. Inside the box are wires, several washers of various materials, and assembly hardware (nuts and screws/bolts). The device is a passive electronic component that is plugged into a DMM. The operator sets the DMM to read voltage. The operator places the heated tip of the soldering iron onto the metal tab with a small amount of solder to ensure a complete connection. The voltage is read and recorded. The operator switches the DMM to read resistance. The operator places the heated tip of the soldering iron onto the metal tab with a small amount of solder to ensure a complete connection. The resistance is recorded. If the recorded voltage and resistance are below a number stated in ESDA ESD STM 13.1-2000, the test is considered to pass. The device includes all the necessary wiring internal to its body so the operator does not need to do any independent wiring, except for grounding. It uses a stack of high-thermal-resistance washers to minimize the

  5. Solder flow over fine line PWB surface finishes

    SciTech Connect

    Hosking, F.M.; Hernandez, C.L.

    1998-08-01

    The rapid advancement of interconnect technology has stimulated the development of alternative printed wiring board (PWB) surface finishes to enhance the solderability of standard copper and solder-coated surfaces. These new finishes are based on either metallic or organic chemistries. As part of an ongoing solderability study, Sandia National Laboratories has investigated the solder flow behavior of two azole-based organic solderability preservations, immersion Au, immersion Ag, electroless Pd, and electroless Pd/Ni on fine line copper features. The coated substrates were solder tested in the as-fabricated and environmentally-stressed conditions. Samples were processed through an inerted reflow machine. The azole-based coatings generally provided the most effective protection after aging. Thin Pd over Cu yielded the best wetting results of the metallic coatings, with complete dissolution of the Pd overcoat and wetting of the underlying Cu by the flowing solder. Limited wetting was measured on the thicker Pd and Pd over Ni finishes, which were not completely dissolved by the molten solder. The immersion Au and Ag finishes yielded the lowest wetted lengths, respectively. These general differences in solderability were directly attributed to the type of surface finish which the solder came in contact with. The effects of circuit geometry, surface finish, stressing, and solder processing conditions are discussed.

  6. Reliability issues in Pb-free solder joint miniaturization

    NASA Astrophysics Data System (ADS)

    Huang, Zhiheng; Conway, Paul P.; Jung, Erik; Thomson, Rachel C.; Liu, Changqing; Loeher, Thomas; Minkus, Mathias

    2006-09-01

    As solder joints become increasingly miniaturized to meet the severe demands of future electronic packaging, it is vitally important to consider whether the solder joint size and geometry could become reliability issues and thereby affect implementation of the Pb-free solders. In this study, three bumping techniques, i.e., solder dipping, stencil printing followed by solder reflow, and electroplating of solders with subsequent reflow, were used to investigate the interfacial interactions of molten Sn-3.5Ag, Sn-3.8Ag-0.7Cu, and pure Sn solders on a copper pad at 240°C. The resultant interfacial microstructures, coming from a variety of Cu pads, with sizes ranging from 1 mm to 25 µm, and representing different solder bump geometries, have been investigated. In addition, a two-dimensional thermodynamic/kinetic model has been developed to assist the understanding of the kinetics of interdiffusion and the formation of interfacial intermetallic compounds. Experimental results and theoretical predictions both suggest that the solder bump size and geometry can influence the as-soldered microstructure; therefore, this factor should be taken into consideration for the design of future reliable ultrafine Pb-free solder joints.

  7. Solder for oxide layer-building metals and alloys

    DOEpatents

    Kronberg, J.W.

    1992-09-15

    A low temperature solder and method for soldering an oxide layer-building metal such as aluminum, titanium, tantalum or stainless steel is disclosed. The composition comprises tin and zinc; germanium as a wetting agent; preferably small amounts of copper and antimony; and a grit, such as silicon carbide. The grit abrades any oxide layer formed on the surface of the metal as the germanium penetrates beneath and loosens the oxide layer to provide good metal-to-metal contact. The germanium comprises less than approximately 10% by weight of the solder composition so that it provides sufficient wetting action but does not result in a melting temperature above approximately 300 C. The method comprises the steps rubbing the solder against the metal surface so the grit in the solder abrades the surface while heating the surface until the solder begins to melt and the germanium penetrates the oxide layer, then brushing aside any oxide layer loosened by the solder.

  8. Solder for oxide layer-building metals and alloys

    DOEpatents

    Kronberg, James W.

    1992-01-01

    A low temperature solder and method for soldering an oxide layer-building metal such as aluminum, titanium, tantalum or stainless steel. The comosition comprises tin and zinc; germanium as a wetting agent; preferably small amounts of copper and antimony; and a grit, such as silicon carbide. The grit abrades any oxide layer formed on the surface of the metal as the germanium penetrates beneath and loosens the oxide layer to provide good metal-to-metal contact. The germanium comprises less than aproximatley 10% by weight of the solder composition so that it provides sufficient wetting action but does not result in a melting temperature above approximately 300.degree. C. The method comprises the steps rubbing the solder against the metal surface so the grit in the solder abrades the surface while heating the surface until the solder begins to melt and the germanium penetrates the oxide layer, then brushing aside any oxide layer loosened by the solder.

  9. Mechanical and thermomechanical stability issues of 96.5SN-3.5AG solder joints in microelectronic packages

    NASA Astrophysics Data System (ADS)

    Yang, Hong

    Flip chip technology is the ultimate solution for high performance and high density chip level interconnection. This thesis describes the investigation of using eutectic 96.5Sn-3.5Ag solder for flip chip applications. The principal components of the research include mechanical characterization, bumping process development, and finite element simulation for solder joint reliability. A novel solder bumping process was developed for wafer level fabrication of 96.5Sn-3.5Ag solder bumps. As a baseline process, an electroplating method was applied to fabricate the micro-scale solder bumps with 125-mum diameter, 250-mum pitch and approximately 80-mum height. Pre-deposition of solder bumps was carried out by electroplating over a fine-pattern photoresist mask. Rapid dissolution of Ag into Sn was accomplished during reflow and chip joining process. Nickel was selected as the diffusion barrier and wetting layer in the under-the-bump metallurgy (UBM). Microstructural and compositional analyses were performed using SEM and EDS. Three different mechanical testing techniques including tensile creep, lap shear creep, and automated ball indentation tests were used to characterize the mechanical deformation behavior of 96.5Sn-3.5Ag solder and solder joints. Constant-load creep tests on bulk specimens revealed a dislocation climb mechanism with a relatively large stress exponent of n = 10 for creep strain rates ranging from 10sp{-9} to 10sp{-3} and at temperatures ranging from 298K to 453K. The apparent activation energy for creep was found to be 0.57 ev. Lap shear creep tests on 96.5Sn-7.5Ag solder bumps also revealed a dislocation climb mechanism with a stress exponent of n = 10 for creep strain rates ranging from 10sp{-7} to 10sp{-4} at room temperature. In general, the solder joints are more creep resistant than the bulk specimen due to the inclusion of solder/base metal intermetallics. The intermetallic compounds may form precipitates or dispersoids in the solder matrix and

  10. Free-electron laser tissue-soldering in vitro with an albumin solder

    NASA Astrophysics Data System (ADS)

    Sorg, Brian S.; Choi, Bernard; McNally-Heintzelman, Karen M.; Jansen, E. Duco; Welch, Ashley J.

    2000-04-01

    The purpose of this study was to explore the feasibility of using a free-electron laser (FEL) to photothermally coagulate an albumin solder for laser-assisted incision closure. A 50%(w/v) bovine serum albumin solder was used to repair an incision in bovine aorta. The solder was coagulated by targeting absorption peaks in the solder infrared absorption spectrum using the FEL. Acute breaking strengths of repaired incisions were measured and the data analyzed by one-way ANOVA (P < 0.05). Multiple comparisons of means were performed using the Newman-Keuls test. The solder absorption spectrum from 2 - 10 microns was similar to water with an additional peak at 6.45 microns (amide II) due to the albumin. Preliminary results indicated that wavelengths at or very close to the absorption peaks were excessively absorbed, resulting in only the top surface of the solder being coagulated. Using wavelengths at points of weak absorption on the water absorption curve yielded better results.

  11. Entrainment of Upper Level Dry Air Into Hurricane Earl

    NASA Technical Reports Server (NTRS)

    Guillory, Anthony R.; Jedlovec, Gary J.; Hood, Robbie E.; Atkinson, Robert J.; LaFontaine, Frank J.

    1999-01-01

    Hurricane Earl formed in the Gulf of Mexico in September 1998. It quickly was upgraded from a tropical disturbance to tropical storm status and then to a hurricane. Earl possessed hybrid (tropical and extratropical) characteristics throughout its lifetime. The system maintained and erratic track, which led to wide variability in the operational track forecasts. It eventually made landfall on the Florida panhandle on 2 September and raced northeastward. During August and September 1998, NASA conducted the third Convection and Moisture Experiment (CAMEX-3). The experiment was focused on studying hurricanes with an emphasis toward developing a better understanding of their intensification and motion. Earl provides a unique opportunity to utilize high spatial and temporal resolution data collected from the DC-8 and high altitude ER-2 NASA platforms, which flew over Earl as it made landfall. These data can also be put into broader view provided by other instruments from the Geosynchronous Operational Environmental Satellites (GOES) and the Tropical Rainfall Measuring Mission (TRMM) satellites. Hurricane Earl was affected by entrainment of dry air from the northwest. Hurricane Isis was intensifying and approaching the Mexican Pacific coast with its associated outflow potentially affecting the inflow into Earl as the storm neared Florida. In addition, a longwave synoptic trough circulation was present over the eastern U.S. Either or both of these could be responsible for the dry air into the system. This paper will focus on identifying the source of the dry by using upper-level wind and moisture fields derived from the GOES 6.7 um water vapor imagery. We will attempt to relate the large-scale observations to those from the NASA aircraft. An infrared instrument onboard the ER-2 also has a similar wavelength and may be able to confirm some of the GOES findings. In addition, a microwave radiometer with 4 channels focused on measuring precipitation and its associated ice

  12. CO2 temperature-controlled laser soldering of pig trachea incisions in vitro using flexible albumin bands

    NASA Astrophysics Data System (ADS)

    Sharvit, Dan; Vasilyev, Tamar; Vasserman, Irena; Simhon, David; Kariv, Naam; DeRowe, Ari; Katzir, Abraham

    2005-04-01

    Resection of a segment of the trachea is a procedure applied for the removal of cervical tumors invading the trachea, or for the treatment of severe tracheal stenosis. The current method of anastomosis is based on multiple sutures. The main drawbacks of this method are: 1) A long procedure time, 2) An air leakage, and 3) An inflammatory response to the sutures. In this study we evaluated the feasibility and effectiveness of the use of temperature controlled CO2 laser soldering of incisions in pig tracheas in vitro. A transverse incision was made in a separated pig trachea. A flexible albumin band was prepared and was laser soldered with albumin solder to the outer surface of the trachea, covering the incision. The soldered trachea ends were sealed and the burst pressure was measured. In a series of in vitro experiments, the mean burst pressure was found to be 230 mm Hg. These preliminary results demonstrated that laser soldering using a flexible albumin band may be a useful method for sealing an incision in the trachea.

  13. Prediction of Solder Joint Fatigue Life

    DTIC Science & Technology

    1988-04-01

    strains are in turn used to calculate Nf via a Coffin - Manson LCF curve developed from the tests on simple solder joints. This life is compared to...correlation with a = 0.52 (the Coffin - Manson LCF exponent) has been discussed previously [2]. The slope was determined from a least squares fit with a

  14. Multilead, Vaporization-Cooled Soldering Heat Sink

    NASA Technical Reports Server (NTRS)

    Rice, John

    1995-01-01

    Vaporization-cooled heat sink proposed for use during soldering of multiple electrical leads of packaged electronic devices to circuit boards. Heat sink includes compliant wicks held in grooves on edges of metal fixture. Wicks saturated with water. Prevents excessive increases in temperature at entrances of leads into package.

  15. Radiological background levels found on glass fiber filters used for low-level environmental surveillance air sampling

    SciTech Connect

    Althouse, P. E.

    1998-09-16

    Environmental surveillance of low-level radioactive particles in air requires a thorough understanding of low-level techniques and air sample collection media. High-volume air sampling for radioactive particles around Lawrence Livermore National Laboratory (LLNL) employs glass-fiber filters that are analyzed for gross alpha and gross beta activity and for specific isotopes. This study was conducted to determine the activities of radionuclides contained in blank glass-fiber filters. Data from this study provided a partial explanation of differences between current reported concentrations of radionuclides in air and those reported historically when cellulose filters were used in the LLNL monitoring effort.

  16. Microwave Tissue Soldering for Immediate Wound Closure

    NASA Technical Reports Server (NTRS)

    Arndt, G. Dickey; Ngo, Phong H.; Phan, Chau T.; Byerly, Diane; Dusl, John; Sognier, Marguerite A.; Carl, James

    2011-01-01

    A novel approach for the immediate sealing of traumatic wounds is under development. A portable microwave generator and handheld antenna are used to seal wounds, binding the edges of the wound together using a biodegradable protein sealant or solder. This method could be used for repairing wounds in emergency settings by restoring the wound surface to its original strength within minutes. This technique could also be utilized for surgical purposes involving solid visceral organs (i.e., liver, spleen, and kidney) that currently do not respond well to ordinary surgical procedures. A miniaturized microwave generator and a handheld antenna are used to deliver microwave energy to the protein solder, which is applied to the wound. The antenna can be of several alternative designs optimized for placement either in contact with or in proximity to the protein solder covering the wound. In either case, optimization of the design includes the matching of impedances to maximize the energy delivered to the protein solder and wound at a chosen frequency. For certain applications, an antenna could be designed that would emit power only when it is in direct contact with the wound. The optimum frequency or frequencies for a specific application would depend on the required depth of penetration of the microwave energy. In fact, a computational simulation for each specific application could be performed, which would then match the characteristics of the antenna with the protein solder and tissue to best effect wound closure. An additional area of interest with potential benefit that remains to be validated is whether microwave energy can effectively kill bacteria in and around the wound. Thus, this may be an efficient method for simultaneously sterilizing and closing wounds.

  17. Illinois - High-Level Commitment Key to Air Quality Success

    SciTech Connect

    Not Available

    2007-12-01

    This fact sheet highlights how renewable energy and energy efficiency technologies can and are being used to reduce air emissions and meet environmental goals, showcasing case studies and technology-specific topics.

  18. Vandenberg Air Force Base Upper Level Wind Launch Weather Constraints

    NASA Technical Reports Server (NTRS)

    Shafer, Jaclyn A.; Wheeler, Mark M.

    2012-01-01

    The 30th Operational Support Squadron Weather Flight (30 OSSWF) provides comprehensive weather services to the space program at Vandenberg Air Force Base (VAFB) in California. One of their responsibilities is to monitor upper-level winds to ensure safe launch operations of the Minuteman III ballistic missile. The 30 OSSWF tasked the Applied Meteorology Unit (AMU) to analyze VAFB sounding data with the goal of determining the probability of violating (PoV) their upper-level thresholds for wind speed and shear constraints specific to this launch vehicle, and to develop a tool that will calculate the PoV of each constraint on the day of launch. In order to calculate the probability of exceeding each constraint, the AMU collected and analyzed historical data from VAFB. The historical sounding data were retrieved from the National Oceanic and Atmospheric Administration Earth System Research Laboratory archive for the years 1994-2011 and then stratified into four sub-seasons: January-March, April-June, July-September, and October-December. The maximum wind speed and 1000-ft shear values for each sounding in each subseason were determined. To accurately calculate the PoV, the AMU determined the theoretical distributions that best fit the maximum wind speed and maximum shear datasets. Ultimately it was discovered that the maximum wind speeds follow a Gaussian distribution while the maximum shear values follow a lognormal distribution. These results were applied when calculating the averages and standard deviations needed for the historical and real-time PoV calculations. In addition to the requirements outlined in the original task plan, the AMU also included forecast sounding data from the Rapid Refresh model. This information provides further insight for the launch weather officers (LWOs) when determining if a wind constraint violation will occur over the next few hours on day of launch. The interactive graphical user interface (GUI) for this project was developed in

  19. An objective definition of air mass types affecting Athens, Greece; the corresponding atmospheric pressure patterns and air pollution levels.

    PubMed

    Sindosi, O A; Katsoulis, B D; Bartzokas, A

    2003-08-01

    This work aims at defining characteristic air mass types that dominate in the region of Athens, Greece during the cold (November-March) and the warm (May-September) period of the year and also at evaluating the corresponding concentration levels of the main air pollutants. For each air mass type, the mean atmospheric pressure distribution (composite maps) over Europe and the Mediterranean is estimated in order to reveal the association of atmospheric circulation with air pollution levels in Athens. The data basis for this work consists of daily values of thirteen meteorological and six pollutant parameters covering the period 1993-97. The definition of the characteristic air mass types is attempted objectively by using the methods of Factor Analysis and Cluster Analysis. The results show that during the cold period of the year there are six prevailing air mass types (at least 3% of the total number of days) and six infrequent ones. The examination of the corresponding air pollution concentration levels shows that the primary air pollutants appear with increased concentrations when light or southerly winds prevail. This is usually the case when a high pressure system is located over the central Mediterranean or a low pressure system lays over south Italy, respectively. Low levels of the primary pollutants are recorded under northeasterly winds, mainly caused by a high pressure system over Ukraine. During the warm period of the year, the southwestern Asia thermal low and the subtropical anticyclone of the Atlantic Ocean affect Greece. Though these synoptic systems cause almost stagnant conditions, four main air mass types are dominant and ten others, associated with extreme weather, are infrequent. Despite the large amounts of total solar radiation characterizing this period, ozone concentrations remain at low levels in central Athens because of its destruction by nitric oxide.

  20. 42 CFR 84.1139 - Air velocity and noise levels; hoods and helmets; minimum requirements.

    Code of Federal Regulations, 2010 CFR

    2010-10-01

    ... 42 Public Health 1 2010-10-01 2010-10-01 false Air velocity and noise levels; hoods and helmets... Efficiency Respirators and Combination Gas Masks § 84.1139 Air velocity and noise levels; hoods and helmets; minimum requirements. Noise levels generated by the respirator will be measured inside the hood or...

  1. 42 CFR 84.202 - Air velocity and noise levels; hoods and helmets; minimum requirements.

    Code of Federal Regulations, 2011 CFR

    2011-10-01

    ... 42 Public Health 1 2011-10-01 2011-10-01 false Air velocity and noise levels; hoods and helmets... PROTECTIVE DEVICES Chemical Cartridge Respirators § 84.202 Air velocity and noise levels; hoods and helmets; minimum requirements. Noise levels generated by the respirator will be measured inside the hood or...

  2. 42 CFR 84.1139 - Air velocity and noise levels; hoods and helmets; minimum requirements.

    Code of Federal Regulations, 2013 CFR

    2013-10-01

    ... 42 Public Health 1 2013-10-01 2013-10-01 false Air velocity and noise levels; hoods and helmets... Efficiency Respirators and Combination Gas Masks § 84.1139 Air velocity and noise levels; hoods and helmets; minimum requirements. Noise levels generated by the respirator will be measured inside the hood or...

  3. 42 CFR 84.1139 - Air velocity and noise levels; hoods and helmets; minimum requirements.

    Code of Federal Regulations, 2014 CFR

    2014-10-01

    ... 42 Public Health 1 2014-10-01 2014-10-01 false Air velocity and noise levels; hoods and helmets... Efficiency Respirators and Combination Gas Masks § 84.1139 Air velocity and noise levels; hoods and helmets; minimum requirements. Noise levels generated by the respirator will be measured inside the hood or...

  4. 42 CFR 84.202 - Air velocity and noise levels; hoods and helmets; minimum requirements.

    Code of Federal Regulations, 2012 CFR

    2012-10-01

    ... 42 Public Health 1 2012-10-01 2012-10-01 false Air velocity and noise levels; hoods and helmets... PROTECTIVE DEVICES Chemical Cartridge Respirators § 84.202 Air velocity and noise levels; hoods and helmets; minimum requirements. Noise levels generated by the respirator will be measured inside the hood or...

  5. 42 CFR 84.202 - Air velocity and noise levels; hoods and helmets; minimum requirements.

    Code of Federal Regulations, 2013 CFR

    2013-10-01

    ... 42 Public Health 1 2013-10-01 2013-10-01 false Air velocity and noise levels; hoods and helmets... PROTECTIVE DEVICES Chemical Cartridge Respirators § 84.202 Air velocity and noise levels; hoods and helmets; minimum requirements. Noise levels generated by the respirator will be measured inside the hood or...

  6. 42 CFR 84.1139 - Air velocity and noise levels; hoods and helmets; minimum requirements.

    Code of Federal Regulations, 2011 CFR

    2011-10-01

    ... 42 Public Health 1 2011-10-01 2011-10-01 false Air velocity and noise levels; hoods and helmets... Efficiency Respirators and Combination Gas Masks § 84.1139 Air velocity and noise levels; hoods and helmets; minimum requirements. Noise levels generated by the respirator will be measured inside the hood or...

  7. 42 CFR 84.202 - Air velocity and noise levels; hoods and helmets; minimum requirements.

    Code of Federal Regulations, 2010 CFR

    2010-10-01

    ... 42 Public Health 1 2010-10-01 2010-10-01 false Air velocity and noise levels; hoods and helmets... PROTECTIVE DEVICES Chemical Cartridge Respirators § 84.202 Air velocity and noise levels; hoods and helmets; minimum requirements. Noise levels generated by the respirator will be measured inside the hood or...

  8. 42 CFR 84.202 - Air velocity and noise levels; hoods and helmets; minimum requirements.

    Code of Federal Regulations, 2014 CFR

    2014-10-01

    ... 42 Public Health 1 2014-10-01 2014-10-01 false Air velocity and noise levels; hoods and helmets... PROTECTIVE DEVICES Chemical Cartridge Respirators § 84.202 Air velocity and noise levels; hoods and helmets; minimum requirements. Noise levels generated by the respirator will be measured inside the hood or...

  9. 42 CFR 84.1139 - Air velocity and noise levels; hoods and helmets; minimum requirements.

    Code of Federal Regulations, 2012 CFR

    2012-10-01

    ... 42 Public Health 1 2012-10-01 2012-10-01 false Air velocity and noise levels; hoods and helmets... Efficiency Respirators and Combination Gas Masks § 84.1139 Air velocity and noise levels; hoods and helmets; minimum requirements. Noise levels generated by the respirator will be measured inside the hood or...

  10. The Failure Models of Lead Free Sn-3.0Ag-0.5Cu Solder Joint Reliability Under Low-G and High-G Drop Impact

    NASA Astrophysics Data System (ADS)

    Gu, Jian; Lei, YongPing; Lin, Jian; Fu, HanGuang; Wu, Zhongwei

    2017-02-01

    The reliability of Sn-3.0Ag-0.5Cu (SAC 305) solder joint under a broad level of drop impacts was studied. The failure performance of solder joint, failure probability and failure position were analyzed under two shock test conditions, i.e., 1000 g for 1 ms and 300 g for 2 ms. The stress distribution on the solder joint was calculated by ABAQUS. The results revealed that the dominant reason was the tension due to the difference in stiffness between the print circuit board and ball grid array, and the maximum tension of 121.1 MPa and 31.1 MPa, respectively, under both 1000 g or 300 g drop impact, was focused on the corner of the solder joint which was located in the outmost corner of the solder ball row. The failure modes were summarized into the following four modes: initiation and propagation through the (1) intermetallic compound layer, (2) Ni layer, (3) Cu pad, or (4) Sn-matrix. The outmost corner of the solder ball row had a high failure probability under both 1000 g and 300 g drop impact. The number of failures of solder ball under the 300 g drop impact was higher than that under the 1000 g drop impact. The characteristic drop values for failure were 41 and 15,199, respectively, following the statistics.

  11. Effect of the Soldering Process on the Microstructure and Mechanical Properties of Sn-9Zn/Al Solder Joints

    NASA Astrophysics Data System (ADS)

    Yao, Yao; Feng, Xue; Jian, Zhou; Zhanying, Feng; Xu, Chen

    2015-08-01

    Tin-zinc solder alloys are considered to be appropriate for soldering of aluminum alloys at low-temperature in electronics and radiators applications. In this paper, the effects of different soldering parameters on the microstructure and interfacial reaction behaviors of 1070Al/Sn-9Zn/1070Al joints were investigated. The results show that the Al substrate was dissolved by the liquid solder, but Al-related intermetallic was not observed in the interface. Two kinds of Al-rich phases formed in the solder matrix. Large butterfly-shaped solid solution (Al)″ phases (about 10 μm) were formed in the liquid alloys, and compact-shaped precipitations (nano-size) were dissolved out from solders during solidification process. With increasing of the soldering time, Al″ phases were migrated upwards in the solders and the amount of this phase increased. In addition, with the increase of the soldering temperature, the dissolution rate of Al into the solder increased and the formation time of (Al)″ phases was reduced. Shear test results indicate when soldered at 250 °C, the shear strength increased from 48.6 MPa to a maximum 60.5 MPa and then decreased to a stable value (about 55 MPa) with increasing of the soldering time. Similar trends were also observed at 300 and 350 °C, while the soldering time needed to obtain maximum shear strength was shortened. The formation of these Al-rich phases improves the shear strength but deteriorates the ductility.

  12. Sn-Ag-Cu Nanosolders: Solder Joints Integrity and Strength

    NASA Astrophysics Data System (ADS)

    Roshanghias, Ali; Khatibi, Golta; Yakymovych, Andriy; Bernardi, Johannes; Ipser, Herbert

    2016-08-01

    Although considerable research has been dedicated to the synthesis and characterization of lead-free nanoparticle solder alloys, only very little has been reported on the reliability of the respective joints. In fact, the merit of nanoparticle solders with depressed melting temperatures close to the Sn-Pb eutectic temperature has always been challenged when compared with conventional solder joints, especially in terms of inferior solderability due to the oxide shell commonly present on the nanoparticles, as well as due to compatibility problems with common fluxing agents. Correspondingly, in the current study, Sn-Ag-Cu (SAC) nanoparticle alloys were combined with a proper fluxing vehicle to produce prototype nanosolder pastes. The reliability of the solder joints was successively investigated by means of electron microscopy and mechanical tests. As a result, the optimized condition for employing nanoparticles as a competent nanopaste and a novel procedure for surface treatment of the SAC nanoparticles to diminish the oxide shell prior to soldering are being proposed.

  13. Characterization of eutectic Sn-Bi solder joints

    NASA Astrophysics Data System (ADS)

    Mei, Z.; Morris, J. W.

    1992-06-01

    This report presents experimental results on 58Bi-42Sn solder joints, optical and SEM microstructures of their matrix and of their interface with copper, solidification behavior studied by differential scanning calorimetry, wettability to copper, creep, and low cycle fatigue. These results are discussed in comparison with 60Sn-40Pb solder, and with three low temperature solders, 52In-48Sn, 43Sn-43Pb-14Bi, and 40In-40Sn-20Pb. The 58Bi-42Sn solder paste with RMA flux wets Cu matrix with a wetting angle of 35° and had a 15° C undercooling during solidification. The constitutive equation of the steady state shear strain rate, and the Coffin-Manson relation constants for the low cycle shear fatigue life at 65° C have been determined. The test results show that this solder has the best creep resistance but the poorest fatigue strength compared with the other four solders.

  14. Issues in the replacement of lead-bearing solders

    NASA Astrophysics Data System (ADS)

    Vianco, Paul T.; Frear, Darrel R.

    1993-07-01

    The use of soft solders, particularly those containing lead, dates back nearly 5,000 years. Solders similar to the materials used to seal the aqueducts of ancient Rome are now an important building block in the manufacture of high-speed computer assemblies. This history attests to the technological versatility of soft solders and, in particular, the solder alloys that contain lead. However, the health effects of prolonged exposure to lead have also been documented; measures to limit human exposure—at the work place and indirectly through the environment—are being considered. The successful introduction of lead-free solders into future electronic products will rely heavily upon their solderability, which can be evaluated by test procedures such as the meniscometer/wetting balance technique and the capillary flow test.

  15. Comparison of lead and tin concentrations in air at a solder manufacturer from the closed-face 37-mm cassette with and without a custom cellulose-acetate cassette insert.

    PubMed

    Lee, Eun Gyung; Chisholm, William P; Burns, Dru A; Nelson, John H; Kashon, Michael L; Harper, Martin

    2014-01-01

    A polyvinyl chloride (PVC) cassette insert with PVC filter (ACCU-CAP) in a 37-mm closed-face cassette (CFC) was designed for gravimetric analysis. A customized version of the ACCU-CAP, also to be used in the CFC, was manufactured from an acid-digestible cellulose-acetate cassette insert joined to a mixed cellulose ester (MCE) filter for wet chemical analysis. The aim of this study was to compare metal particle concentrations as sampled by the customized insert (CI) in a CFC sampler with the traditional sampling method using only a MCE filter in the CFC. Thirty-nine personal and 13 area samples were taken using paired filter-based CFC and the CI in CFC samplers at a solder manufacturing plant. The CI was removed from its CFC, and digested and analyzed as a whole. The MCE filter from the typical CFC was removed for analysis and then the interior of the cassette was wiped with Ghost Wipe for a separate analysis. The MCE filter only, Ghost Wipe, and CI were separately dissolved in heated nitric acid for ICP-MS analysis. Overall, the geometric mean concentration of the filter-only (FO) samples was considerably lower than that of the CI samples, by 53% for lead and 32% for tin. However, if the FO analysis was added to the corresponding Ghost Wipe analysis, i.e., filter+interior wipe (FW), the geometric mean concentrations of the FW results were similar to those of the CI results (by 113% for lead and 98% for tin). For both lead and tin the comparison of (log-transformed) metal concentrations between the FW and CI results showed no statistically significant difference (p-value = 0.3009 for lead and 0.800 for tin), while the comparison between the FO and CI results shows statistically significant differences (all p-values < 0.05). In conclusion, incorporating the sampler internal non-filter deposits by wiping or use of an internal filter capsule gave higher results than analyzing only the filter. Close agreement between the two methods of including non-filter deposits is

  16. Fatigue of Advanced In-Situ Composite Solders

    DTIC Science & Technology

    2007-11-02

    ABSTRACT (Maximum 200 words) " ~~" Solder joints used in surface mount technology experience thermomechanical fatigue due to the mismatches in...solder joint to undergo shear strains. The purpose of this study was to examine and explain the thermomechanical fatigue damage mechanisms of various...types of solder compositions. Shear, creep, low cycle fatigue , and thermomechanical fatigue tests were conducted in this research. The development

  17. Anomalous creep in Sn-rich solder joints

    SciTech Connect

    Song, Ho Geon; Morris Jr., John W.; Hua, Fay

    2002-03-15

    This paper discusses the creep behavior of example Sn-rich solders that have become candidates for use in Pb-free solder joints. The specific solders discussed are Sn-3.5Ag, Sn-3Ag-0.5Cu, Sn-0.7Cu and Sn-10In-3.1Ag, used in thin joints between Cu and Ni-Au metallized pads.

  18. Microstructural evolution during the thermomechanical fatigue of solder joints

    SciTech Connect

    Frear, D R

    1991-01-01

    Solder joints in electronic packages are electrical interconnections that also function as mechanical bonds. The solder often constrains materials of different coefficients of thermal expansion that, when thermal fluctuations are encountered, causes the solder joint to experience cyclical deformation. Due to the catastrophic consequences of electrical or mechanical failure of solder joints, a great deal of work has been performed to develop a better understanding of the metallurgical response of solder joints subjected to thermomechanical fatigue. This work reviews the microstructural and mechanical evolution that occurs in solder joints during thermomechanical fatigue. The eutectic Sn-Pb solder alloy is highlighted. Unlike most materials that experience thermomechanical fatigue, solder is commonly used at temperatures of up to nine-tenths of its melting point. Therefore extensive creep, solid state diffusion, recrystallization and grain growth occur in this alloy resulting in the evolution of a heterogeneous coarsened band through which failure eventually takes place. Two other solder alloys are compared with the Sn-Pb eutectic, a Pb-rich Sn-Pb alloy and a ternary near eutectic (40In-40Sn-20Pb, all alloys are given in wt. %). The Pb-rich alloy is a precipitated single phase matrix that does not evolve during thermomechanical fatigue and subsequently has a shorter lifetime. Conversely, the 40In-40Sn-20Pb solder is a two phase eutectic in which the microstructures refines during thermomechanical fatigue giving it a longer lifetime than the eutectic Sn-Pb solder. The microstructural processes that occur during thermomechanical fatigue and final fracture behavior are discussed for the three solder alloys. 47 refs., 14 figs.

  19. MEASUREMENT OF LOW LEVEL AIR TOXICS WITH MODIFIED UV DOAS

    EPA Science Inventory

    To further understand near source impacts, EPA is working to develop open-path optical techniques for spatiotemporal-resolved measurement of air pollutants. Of particular interest is near real time quantification of mobile-source generated CO, Nox and hydrocarbons measured in cl...

  20. Coarsening of the Sn-Pb Solder Microstructure in Constitutive Model-Based Predictions of Solder Joint Thermal Mechanical Fatigue

    SciTech Connect

    Vianco, P.T.; Burchett, S.N.; Neilsen, M.K.; Rejent, J.A.; Frear, D.R.

    1999-04-12

    Thermal mechanical fatigue (TMF) is an important damage mechanism for solder joints exposed to cyclic temperature environments. Predicting the service reliability of solder joints exposed to such conditions requires two knowledge bases: first, the extent of fatigue damage incurred by the solder microstructure leading up to fatigue crack initiation, must be quantified in both time and space domains. Secondly, fatigue crack initiation and growth must be predicted since this metric determines, explicitly, the loss of solder joint functionality as it pertains to its mechanical fastening as well as electrical continuity roles. This paper will describe recent progress in a research effort to establish a microstructurally-based, constitutive model that predicts TMF deformation to 63Sn-37Pb solder in electronic solder joints up to the crack initiation step. The model is implemented using a finite element setting; therefore, the effects of both global and local thermal expansion mismatch conditions in the joint that would arise from temperature cycling.

  1. Solderability preservation through the use of organic inhibitors

    SciTech Connect

    Sorensen, N.R.; Hosking, F.M.

    1994-12-01

    Organic inhibitors can be used to prevent corrosion of metals and have application in the electronics industry as solderability preservatives. We have developed a model to describe the action of two inhibitors (benzotriazole and imidazole) during the environmental aging and soldering process. The inhibitors bond with the metal surface and form a barrier that prevents or retards oxidation. At soldering temperatures, the metal-organic complex breaks down leaving an oxide-free metal surface that allows excellent wetting by molten solder. The presence of the inhibitor retards the wetting rate relative to clean copper, but provides a vast improvement relative to oxidized copper.

  2. Aging, stressing and solderability of electroplated and electroless copper

    SciTech Connect

    Sorensen, N.R.; Hosking, F.M.

    1995-08-01

    Organic inhibitors can be used to prevent corrosion of metals have application in the electronics industry as solderability preservatives. We have developed a model to describe the action of two inhibitors (benzotriazole and imidazole) during the environmental aging and soldering process. The inhibitors bond with the metal surface and form a barrier that prevents or retards oxidation. At soldering temperatures, the metal-organic complex breaks down leaving an oxide-free metal surface that allows excellent wetting by the molten solder. The presence of the inhibitor retards the wetting rate relative to clean copper but provides a vast improvement relative to oxidized copper.

  3. RELATIONSHIPS BETWEEN LEVELS OF VOLATILE ORGANIC COMPOUNDS IN AIR AND BLOOD FROM THE GENERAL POPULATION

    EPA Science Inventory

    Background: The relationships between levels of volatile organic compounds (VOCs) in blood and air have not been well characterized in the general population where exposure concentrations are generally at ppb levels. Objectives: This study investigates relationships between ...

  4. Carbon Monoxide | Air Quality Planning Unit | Ground-level ...

    EPA Pesticide Factsheets

    2017-04-10

    Carbon monoxide (CO) is a colorless, odorless gas that can increase the severity of lung ailments, cause dizziness, fatigue, nausea, and even death. EPA has defined the national ambient air quality standard (NAAQS) for carbon monoxide as nine parts per million averaged over an eight-hour period, and this threshold cannot be exceeded more than once a year or an area would be violating the standard.

  5. Effect of cooling condition and Ag on the growth of intermetallic compounds in Sn-based solder joints

    NASA Astrophysics Data System (ADS)

    Ma, Haoran; Kunwar, Anil; Guo, Bingfeng; Sun, Junhao; Jiang, Chengrong; Wang, Yunpeng; Song, Xueguan; Zhao, Ning; Ma, Haitao

    2016-12-01

    The intermetallic compound growth in Sn/Cu and Sn-3.5Ag/Cu solder joints undergoing cooling has been in-situ observed using synchrotron radiation X-ray imaging technique. The overall thickness of intermetallic compound attained during cooling condition is dependent on the rates of Cu precipitation or deposition from the bulk solder and Cu diffusion from grain boundary at interface. Although the net increase in IMC thickness contributed predominantly by deposition kinetics is greater for air cooling than in furnace cooling from the start temperature of 300°C for the first 20 min, the former solidifies before 30 min and the latter stays in liquid state for 1 h due to slower cooling rate and attains a bigger IMC of size about 14.5 μm. In context of Sn-3.5Ag solders subjected to air cooling from 275°C, the presence of Ag contributes to the increment in overall IMC thickness during the cooling period. For the improvement in solder joints reliability, faster cooling rate and limiting the Ag content can be employed as the materials design and processing parameters.

  6. Shaping Transistor Leads for Better Solder Joints

    NASA Technical Reports Server (NTRS)

    Mandel, H.; Dillon, J. D.

    1982-01-01

    Special lead-forming tool puts step in leads of microwave power transistors without damaging braze joints that fasten leads to package. Stepped leads are soldered to circuit boards more reliably than straight leads, and stress on brazes is relieved. Lead-forming hand-tool has two parts: a forming die and an actuator. Spring-loaded saddle is adjusted so that when transistor package is placed on it, leads rest on forming rails.

  7. Development of Level 3 (gridded) products for the Atmospheric Infrared Sounder (AIRS)

    NASA Technical Reports Server (NTRS)

    Granger, Stephanie L.; Leroy, Stephen S.; Manning, Evan M.; Fetzer, Eric J.; Oliphant, Robert B.; Braverman, Amy; Lee, Sung-Yung; Lambrigtsen, Bjom H.

    2004-01-01

    The Atmospheric Infrared Sounder (AIRS) sounding system is a suite of infrared and microwave instruments flown as part of NASA's Earth Observing System (EOS) onboard the Aqua platform. The AIRS dataset provides a daily, global view of Earth processes at a finer vertical resolution than ever before. However, analysis of the AIRS data is a daunting task given the sheer volume and complexity of the data. The volume of data produced by the EOS project is unprecedented; the AIRS project alone will produce many terabytes of data over the lifetime of the mission. This paper describes development of AIRS Level 3 data products that will help to alleviate problems of access and usability.

  8. Air

    MedlinePlus

    ... do to protect yourself from dirty air . Indoor air pollution and outdoor air pollution Air can be polluted indoors and it can ... this chart to see what things cause indoor air pollution and what things cause outdoor air pollution! Indoor ...

  9. Evaluation of no-clean solder process designed to eliminate the use of ozone-depleting chemicals

    SciTech Connect

    Paffett, M.T.; Farr, J.D.; Rogers, Y.C.; Hutchinson, W.B.

    1993-10-01

    This paper summarizes the LANL contributions to a joint Motorola/SNLA/LANL cooperative research and development agreement study on the reliability of an alternative solder process that is intended to reduce or eliminate the use of ozone-depleting chemicals in the manufacture of printed wire boards (PWBs). This process is termed self-cleaning because of the nature of the thermal chemistry associated with the adipic and formic acid components used in place of traditional solder rosin fluxes. Traditional rosin fluxes used in military electronic hardware applications are cleaned (by requirement) using chlorofluorohydrocarbons. The LANL contribution centers around analytical determination of PWB cleanliness after soldering using the self-cleaning method. Results of these analytical determinations involving primarily surface analysis of boards following temperature, temperature and humidity, and long-term storage testing are described with representative data. It is concluded that the self-cleaning process leaves behind levels of solid residue that are visually and analytically observable using most of these surface analysis techniques. The materials compatibility of electronic components soldered using the self-cleaning soldering process is more fully described in the project report issued by SNLA that encompasses the complete project with statistical lifetime and accelerated aging studies. Analytical surface specificity and suggestions for further work are also given.

  10. Conduction and Utilization of Research: The Relationship Between Air Force Nurses’ Attitudes, Levels of Education, and Rank

    DTIC Science & Technology

    1999-05-01

    Respondents 22 Table 5. Highest Level of Non- Nursing Education of the Air Force Nurse Respondents 23 Table 6. Overall Highest Level of Education...Force Rank (Good Attitude vs Bad Attitude 41 Table 13. Air Force Nurse Respondents’ Attitudes by Highest Level of Nursing Education 44 Table 14. Air...Figure 2. Research Experience of Air Force Nurse Respondents by Highest Level of Nursing Education (Excellent, Fair or Poor Experience 38 Figure 3. Air

  11. Ground level air convection produces frost damage patterns in turfgrass.

    PubMed

    Ackerson, Bruce J; Beier, Richard A; Martin, Dennis L

    2015-11-01

    Frost injury patterns are commonly observed on the warm-season turfgrass species bermudagrass (Cynodon species Rich.), zoysiagrass (Zoysia species Willd.), and buffalograss [Bouteloua dactyloides (Nutt.) J.T. Columbus] in cool-temperate and subtropical zones. Qualitative observations of these injury patterns are presented and discussed. A model for the formation of such patterns based on thermal instability and convection of air is presented. The characteristic length scale of the observed frost pattern injury requires a temperature profile that decreases with height from the soil to the turfgrass canopy surface followed by an increase in temperature with height above the turfgrass canopy. This is justified by extending the earth temperature theory to include a turf layer with atmosphere above it. Then the theory for a thermally unstable layer beneath a stable region by Ogura and Kondo is adapted to a turf layer to include different parameter values for pure air, as well as for turf, which is treated as a porous medium. The earlier porous medium model of Thompson and Daniels proposed to explain frost injury patterns is modified to give reasonable agreement with observed patterns.

  12. Ground level air convection produces frost damage patterns in turfgrass

    NASA Astrophysics Data System (ADS)

    Ackerson, Bruce J.; Beier, Richard A.; Martin, Dennis L.

    2015-11-01

    Frost injury patterns are commonly observed on the warm-season turfgrass species bermudagrass ( Cynodon species Rich.), zoysiagrass ( Zoysia species Willd.), and buffalograss [ Bouteloua dactyloides (Nutt.) J.T. Columbus] in cool-temperate and subtropical zones. Qualitative observations of these injury patterns are presented and discussed. A model for the formation of such patterns based on thermal instability and convection of air is presented. The characteristic length scale of the observed frost pattern injury requires a temperature profile that decreases with height from the soil to the turfgrass canopy surface followed by an increase in temperature with height above the turfgrass canopy. This is justified by extending the earth temperature theory to include a turf layer with atmosphere above it. Then the theory for a thermally unstable layer beneath a stable region by Ogura and Kondo is adapted to a turf layer to include different parameter values for pure air, as well as for turf, which is treated as a porous medium. The earlier porous medium model of Thompson and Daniels proposed to explain frost injury patterns is modified to give reasonable agreement with observed patterns.

  13. Drop Reliability of Epoxy-contained Sn-58 wt.%Bi Solder Joint with ENIG and ENEPIG Surface Finish Under Temperature and Humidity Test

    NASA Astrophysics Data System (ADS)

    Myung, Woo-Ram; Kim, Yongil; Kim, Kyung-Yeol; Jung, Seung-Boo

    2016-07-01

    The influence of two kinds of surface finish, namely electroless nickel immersion gold (ENIG) and electroless nickel electroless palladium immersion gold (ENEPIG), on the interfacial reactions and drop reliability of epoxy-enhanced Sn-58 wt.%Bi solder has been investigated after temperature-humidity storage tests. The chemical composition and morphology of intermetallic compounds (IMCs) were characterized by scanning electron microscopy, energy-dispersive x-ray spectroscopy, and electron probe microanalysis. Also, the mechanical reliability of solder joints was evaluated using board-level drop tests. The Sn-Bi epoxy solder/ENEPIG joint exhibited higher IMC growth rate than the Sn-Bi epoxy solder/ENIG joint. After 500 h at 85°C/85% RH storage condition, new IMCs were formed on the Ni3Sn4 layer in samples with both surface finishes. The results of board-level drop tests showed that the number of drops was higher for the ENIG than the ENEPIG surface finish. Solder joint fracture occurred along the interface between the solder and IMC layer for the ENIG surface finish. However, with the ENEPIG surface finish, the crack propagated between the IMCs.

  14. Characterization of Solder Joint Reliability Using Cyclic Mechanical Fatigue Testing

    NASA Astrophysics Data System (ADS)

    Kim, Choong-Un; Bang, Woong-Ho; Xu, Huili; Lee, Tae-Kyu

    2013-10-01

    This article summarizes the mechanics of two mechanical fatigue methods, cyclic bending fatigue and shear fatigue, in inducing failure in solder joints in package assemblies, and it presents the characteristics of fatigue failures resulting from these methods using example cases of Sn-Pb eutectic and Sn-rich Pb-free solder alloys. Numerical simulation suggests that both testing configurations induce fatigue failure by the crack-opening mode. In the case of bending fatigue, the strain induced by the bending displacement is found to be sensitive to chip geometry, and it induces fatigue cracks mainly at the solder matrix adjacent to the printed circuit board interface. In case of shear fatigue, the failure location is firmly fixed at the solder neck, created by solder mask, where an abrupt change in the solder geometry occurs. Both methods conclude that the Coffin-Manson model is the most appropriate model for the isothermal mechanical fatigue of solder alloys. An analysis of fatigue characteristics using the frame of the Coffin-Manson model produces several insightful results, such as the reason why Pb-free alloys show higher fatigue resistance than Sn-Pb alloys even if they are generally more brittle. Our analysis suggests that it is related to higher work hardening. All these results indicate that mechanical fatigue can be an extremely useful method for fast screening of defective package structures and also in gaining a better understanding of fatigue failure mechanism and prediction of reliability in solder joints.

  15. Local and Global Properties of a Lead-Free Solder

    NASA Astrophysics Data System (ADS)

    Ma, Z.; Chalon, F.; Leroy, R.; Ranganathan, N.; Beake, B. D.

    2013-07-01

    Elastic and viscous properties including Young's modulus, hardness, creep rate sensitivity, and fatigue resistance of Sn-1.2Ag-0.5Cu-0.05Ni lead-free solder have been investigated. The properties of bulk specimens and in situ solder balls are compared. Experiments show good correlations of Young's modulus and creep rate sensitivity between conventional measurements and nanoindentation results on bulk specimens. Further mechanical properties of the beach-ball microstructure in solder balls are characterized by nanoindentation. The load-partial unload technique has been used to determine the variation in mechanical properties with increasing depth of penetration into the intermetallic inclusions in the in situ solder. The fatigue resistances of the bulk specimens and solder balls are compared by using the novel nanoimpact method. In comparison with bulk specimens, it is found that in situ solder has higher Young's modulus, lower creep strain rate sensitivity, and better fatigue resistance. The effects of soldering and the scale differences strongly affect the mechanical and fatigue properties of in situ solder.

  16. Handling fixture for soldering round wires to FCC

    NASA Technical Reports Server (NTRS)

    Loggins, R.; Martineck, H. G.

    1971-01-01

    Fixture holds flat conductor cable and wires in position until after soldering of contacting conductor ends and potting of junctions. Device provides for proper spacing of wires and adequate access for soldered joints during fabrication, and positions mold halves during potting operation.

  17. Direct-soldering 6061 aluminum alloys with ultrasonic coating.

    PubMed

    Ding, Min; Zhang, Pei-lei; Zhang, Zhen-yu; Yao, Shun

    2010-02-01

    In this study, the authors applied furnace soldering with ultrasonic coating method to solder 6061 aluminum alloy and investigated the effects of both coating time and soldering temperature on its properties. The following results were obtained: firstly, the solder region mainly composed of four kinds of microstructure zones: rich Sn zone, rich-Pb zone, Sn-Pb eutectic phase and rich Al zone. Meanwhile, the microanalysis identified a continuous reaction product at the alumina-solder interface as a rich-Pb zone. Therefore, the joint strength changed with soldering time and soldering temperature. Secondly, the tensile data had significantly greater variability, with values ranging from 13.99MPa to 24.74MPa. The highest value was obtained for the samples coated with Sn-Pb-Zn alloy for 45s. Fractures occurred along the solder-alumina interface for the 6061 aluminum alloy with its surface including hybrid tough fracture of dimple and tear ridge. The interface could initially strip at the rich Bi zone with the effect of shear stress.

  18. Factors Affecting Parent's Perception on Air Quality-From the Individual to the Community Level.

    PubMed

    Guo, Yulin; Liu, Fengfeng; Lu, Yuanan; Mao, Zongfu; Lu, Hanson; Wu, Yanyan; Chu, Yuanyuan; Yu, Lichen; Liu, Yisi; Ren, Meng; Li, Na; Chen, Xi; Xiang, Hao

    2016-05-12

    The perception of air quality significantly affects the acceptance of the public of the government's environmental policies. The aim of this research is to explore the relationship between the perception of the air quality of parents and scientific monitoring data and to analyze the factors that affect parents' perceptions. Scientific data of air quality were obtained from Wuhan's environmental condition reports. One thousand parents were investigated for their knowledge and perception of air quality. Scientific data show that the air quality of Wuhan follows an improving trend in general, while most participants believed that the air quality of Wuhan has deteriorated, which indicates a significant difference between public perception and reality. On the individual level, respondents with an age of 40 or above (40 or above: OR = 3.252; 95% CI: 1.170-9.040), a higher educational level (college and above: OR = 7.598; 95% CI: 2.244-25.732) or children with poor healthy conditions (poor: OR = 6.864; 95% CI: 2.212-21.302) have much more negative perception of air quality. On the community level, industrial facilities, vehicles and city construction have major effects on parents' perception of air quality. Our investigation provides baseline information for environmental policy researchers and makers regarding the public's perception and expectation of air quality and the benefits to the environmental policy completing and enforcing.

  19. SOSIE: A pragmatic approach to the simulation of Broad Air Defense applied to the theater level

    NASA Astrophysics Data System (ADS)

    Tanter, A.; Deas, M.

    1995-01-01

    The SOSIE concept rests on an approach consisting of using existing simulation models of various systems and subsystems and automatically integrating them with minimum modifications within a center of simulation. The defense simulation against ballistic missiles on the theater level calls upon three levels of simulation: DIAMS; TACSIT, and SPOOK. DIAMS presents a fine level system simulation of weapon ground-to-air average carry, TACSIT presents a level of site defense (base air for example), and SPOOK deals with the theater level itself. SOSIE enables users to use the same detailed simulators, developed by an originator of weapon systems or information and communications, without having to know in detail the models of the simulation. Envisioned in the future is the integration of other models of simulations relating to the air-to-air combat, in particular, the networks of command, controls and communications.

  20. Tin-silver-bismuth solders for electronics assembly

    DOEpatents

    Vianco, P.T.; Rejent, J.A.

    1995-08-08

    A lead-free solder alloy is disclosed for electronic assemblies composed of a eutectic alloy of tin and silver with a bismuth addition, x, of 0level. Melting point ranges from about 218 C down to about 205 C depending an the amount of bismuth added to the eutectic tin-silver alloy as determined by DSC analysis, 10 C/min. A preferred alloy composition is 91.84Sn-3.33Ag-4.83Bi (weight percent based on total alloy weight). 4 figs.

  1. Tin-silver-bismuth solders for electronics assembly

    DOEpatents

    Vianco, Paul T.; Rejent, Jerome A.

    1995-01-01

    A lead-free solder alloy for electronic assemblies composed of a eutectic alloy of tin and silver with a bismuth addition, x, of 0level. Melting point ranges from about 218.degree. C. down to about 205.degree. C. depending an the amount of bismuth added to the eutectic tin-silver alloy as determined by DSC analysis, 10.degree. C./min. A preferred alloy composition is 91.84Sn-3.33Ag-4.83Bi (weight percent based on total alloy weight).

  2. Hybrid microcircuit board assembly with lead-free solders

    SciTech Connect

    Vianco, P.T.; Hernandez, C.L.; Rejent, J.A.

    2000-01-11

    An assessment was made of the manufacturability of hybrid microcircuit test vehicles assembled using three Pb-free solder compositions 96.5Sn--3.5Ag (wt.%), 91.84Sn--3.33Ag--4.83Bi, and 86.85Sn--3.15Ag--5.0Bi--5.0Au. The test vehicle substrate was 96% alumina; the thick film conductor composition was 76Au--21Pt--3Pd. Excellent registration between the LCCC or chip capacitor packages and the thick film solder pads was observed. Reduced wetting of bare (Au-coated) LCCC castellations was eliminated by hot solder dipping the I/Os prior to assembly of the circuit card. The Pb-free solders were slightly more susceptible to void formation, but not to a degree that would significantly impact joint functionality. Microstructural damage, while noted in the Sn-Pb solder joints, was not observed in the Pb-free interconnects.

  3. Evaluation of soldered connectors of two base metal ceramic alloys.

    PubMed

    Lima Verde, M A; Stein, R S

    1994-04-01

    Soldered connectors for two base metal ceramic alloys (nickel-chromium and cobalt-chromium) were compared by use of four different techniques: (1) infrared preceramic soldering, (2) gas and oxygen preceramic soldering, (3) porcelain furnace postsoldering under vacuum, and (4) porcelain furnace postsoldering without vacuum. A control group was established with solid cast specimens of each alloy. No statistically significant difference was noted between infrared and torch preceramic soldering techniques for either of the two alloys. However, the joints postsoldered under vacuum were significantly superior to postsoldered connectors without vacuum (p < 0.0001). No significant differences were observed among techniques 1, 2, and 3, although the three groups were substantially superior to technique 4 for both alloys (p = 0.05). The control group for both alloys was appreciably stronger than the soldered groups (p < 0.0001), and the nickel-chromium samples within the control group were significantly stronger than the Co-Cr samples.

  4. Dry soldering with hot filament produced atomic hydrogen

    DOEpatents

    Panitz, Janda K. G.; Jellison, James L.; Staley, David J.

    1995-01-01

    A system for chemically transforming metal surface oxides to metal that is especially, but not exclusively, suitable for preparing metal surfaces for dry soldering and solder reflow processes. The system employs one or more hot, refractory metal filaments, grids or surfaces to thermally dissociate molecular species in a low pressure of working gas such as a hydrogen-containing gas to produce reactive species in a reactive plasma that can chemically reduce metal oxides and form volatile compounds that are removed in the working gas flow. Dry soldering and solder reflow processes are especially applicable to the manufacture of printed circuit boards, semiconductor chip lead attachment and packaging multichip modules. The system can be retrofitted onto existing metal treatment ovens, furnaces, welding systems and wave soldering system designs.

  5. Dry soldering with hot filament produced atomic hydrogen

    DOEpatents

    Panitz, J.K.G.; Jellison, J.L.; Staley, D.J.

    1995-04-25

    A system is disclosed for chemically transforming metal surface oxides to metal that is especially, but not exclusively, suitable for preparing metal surfaces for dry soldering and solder reflow processes. The system employs one or more hot, refractory metal filaments, grids or surfaces to thermally dissociate molecular species in a low pressure of working gas such as a hydrogen-containing gas to produce reactive species in a reactive plasma that can chemically reduce metal oxides and form volatile compounds that are removed in the working gas flow. Dry soldering and solder reflow processes are especially applicable to the manufacture of printed circuit boards, semiconductor chip lead attachment and packaging multichip modules. The system can be retrofitted onto existing metal treatment ovens, furnaces, welding systems and wave soldering system designs. 1 fig.

  6. A Study of Solder Alloy Ductility for Cryogenic Applications

    NASA Technical Reports Server (NTRS)

    Lupinacci, A.; Shapiro, A. A.; Suh, J-O.; Minor, A. M.

    2013-01-01

    For aerospace applications it is important to understand the mechanical performance of components at the extreme temperature conditions seen in service. For solder alloys used in microelectronics, cryogenic temperatures can prove problematic. At low temperatures Sn-based solders undergo a ductile to brittle transition that leads to brittle cracks, which can result in catastrophic failure of electronic components, assemblies and spacecraft payloads. As industrial processes begin to move away from Pb-Sn solder, it is even more critical to characterize the behavior of alternative Sn-based solders. Here we report on initial investigations using a modified Charpy test apparatus to characterize the ductile to brittle transformation temperature of nine different solder systems.

  7. Quantification of ozone levels in indoor environments generated by ionization and ozonolysis air purifiers.

    PubMed

    Britigan, Nicole; Alshawa, Ahmad; Nizkorodov, Sergey A

    2006-05-01

    Indoor air purifiers are advertised as safe household products for health-conscious individuals, especially for those suffering from allergies and asthma. However, certain air purifiers produce ozone (O3) during operation, either intentionally or as a byproduct of air ionization. This is a serious concern, because O3 is a criteria air pollutant regulated by health-related federal and state standards. Several types of air purifiers were tested for their ability to produce ozone in various indoor environments at 40-50% relative humidity, including office rooms, bathrooms, bedrooms, and cars. O3 levels generated by personal wearable air purifiers were also tested. In many cases, O3 concentrations were well in excess of public and/or industrial safety levels established by U.S. Environmental Protection Agency, California Air Resources Board, and Occupational Safety and Health Administration. Simple kinetic equations were obtained that can predict the steady-state level of O3 in a room from the O3 emission rate of the air purifier and the first-order decay rate of O3 in the room. The additivity of O3 levels generated by independent O3 generators was experimentally demonstrated.

  8. Source levels of northern elephant seal vocalizations in-air

    NASA Astrophysics Data System (ADS)

    Insley, Stephen J.; Southall, Brandon L.

    2005-09-01

    Accurate measurements of vocalization sound-pressure levels are necessary to determine the acoustical active space of animals in natural and human-altered ambient noise conditions. Despite this basic need, such data are limited or nonexistent for most species. Our study characterized aerial ambient noise and vocalization source levels for northern elephant seals during the breeding season. Subjects were adult males, lactating females, and dependent offspring (pups) at An~o Nuevo State Reserve. Source level measurements were made using a Type 1 sound level meter and calibrated microphones on-axis: (1) at 1 m; (2) at several known distances (laser measured); and (3) simultaneously at 1 m and a second known distance. Concurrent ambient noise conditions were measured in situ (non-weighted 5 min Leq integrated averages) and recorded for later spectral analysis. Measurements were made at two sites, one relatively noisy and the other relatively quiet, to determine whether animals compensate for higher noise conditions by increasing source levels (Lombard effect). Results indicate a wide range in signal strength, particularly for adult males whose vocalization source levels appear to be correlated with dominance rank and related to ambient noise conditions. The Lombard effect was not observed for adult females or elephant seal pups.

  9. Further Observations on Tin Pest Formation in Solder Alloys

    NASA Astrophysics Data System (ADS)

    Plumbridge, W. J.

    2010-04-01

    The most recent observations of the response of bulk samples of several commercial solder alloys, exposed to temperatures below the allotropic transition for tin (13°C) for extended periods, are reported. Damage associated with tin pest development has been arbitrarily graded into six levels, and the formation of visible α-phase warts used for comparative purposes. Since the previous examination, some 2 years ago, tin pest has been observed for the first time in the traditional Sn-37Pb solder alloy after exposure at -18°C and -40°C, and actual warts were apparent in as-cast Sn-0.5Cu stored at -40°C and in as-cast Sn-3.5Ag after exposure at -18°C. No tin pest was detected in Sn-Zn-3Bi after exposure for periods up to 6 years. Tin pest continued to develop in those lead-free alloys in which it had previously been observed, indicating the probability that all would eventually disintegrate in time. In general, prior thermal or mechanical treatment accentuated tin pest formation. The influence of exposure temperature was unclear, since some alloys (Sn-0.5Cu and Sn-3.8Ag-0.7Cu) experienced more damage at -18°C, but others (Sn-37Pb and Sn-3.5Ag) were more susceptible at -40°C. From a consideration of the findings and other published information, it is contended that impurity levels below 0.1 mass% (1000 ppm) play a vital role in determining whether tin pest develops in realistic timescales. A major factor in the absence of tin pest, to date, on actual joints may be simply the mismatch between the timescales experienced in service and those in long-duration laboratory tests.

  10. [Assessment of exposure to toxic metals released during soldering and grazing processes].

    PubMed

    Matczak, Wanda

    2002-01-01

    The aim of the study was to assess toxic metal exposure in workers performing soldering and brazing operations. The study group included workers of three plants manufacturing electronic systems, household equipment and electric motors. Membrane filters were used to collect 50 air samples, including personal 8-h samples to assess average weighed concentration of soldering and brazing fumes and their elements, and to assay respirable dust and "background" or "area" samples. After testing by gravimetry, the filter with collected sample was mineralized with concentrated HCL/HNO3 and 10 ml sample solution in 32% HCL/4% HNO3 was prepared according to OSHA ID-206. Atomic absorption spectrometry was used to assess the contents of lead (Pb), tin (Sn), copper (Cu), zinc (Zn), antimony (Sb), silver (Ag) and manganese (Mn) in the sample solution. The quantitative analysis revealed that time-weighed average (TWA) of fume concentrations were: soldering fume < 0.5-1.1 mg/m3, Cu < 0.003-0.034 mg/m3, Pb < 0.014-0.037 mg/m3, Sn < 0.15 mg/m3, Sb < 0.035 mg/m3; brazing fume < 0.5-0.8 mg/m3, Cu < 0.003-0.038 mg/m3, Zn < 0.003-0.025 mg/m3, Pb < 0.014-0.023 mg/m3, Ag < 0.014 mg/m3, Sn < 0.15 mg/m3, Mn < 0.07-0.12 mg/m3. The results show that on the day of measurements, working conditions at solderer/brazer workplaces were safe, i.e. relevant MAC values were not exceeded.

  11. Implementing an Air Force Major Command-Level EMS

    DTIC Science & Technology

    2011-05-01

    n c e 7 Required ISO Elements for AF Organizational-Level EMS  MAJCOMs Are Required to Have the Following ISO Elements:  Scope and Policy...systems - Satisfy requirements of Execut ive Orders 13423 and 13514 and the I SO 14001 environmental management standard - Integrate ESOH tools and

  12. Stress and physiological, behavioral and performance patterns of children under varied air ion levels

    NASA Astrophysics Data System (ADS)

    Fornof, K. T.; Gilbert, G. O.

    1988-12-01

    The possibility that individual differences in reactivity to stressors are a major factor underlying discordant results reported for air ion studies prompted an investigation of response patterns in school children under both normal indoor air ion levels and moderately increased negative air ion levels (4000±500/cm3). It was hypothesized that the impact of stressors is reduced with high negative air ionization, and that resultant changes in stress effects would be differentially exhibited according to the children's normal degree of stimulus reactivity. A counter-balanced, replicative, withinssubject design was selected, and the subjects were 12 environmentally sensitive, 1st 4th grade school children. In addition to monitoring stress effects on activity level, attention span, concentration to task and conceptual performance, measures were also made of urinary 5-hydroxyindole acetic acid levels and skin resistance response (SRR) to determine if changes extended to the physiological state. The cold water test was used to add physical stress and enable calculations of Lacey's autonomic lability scores (ALS) as indicators of individual reactivity. The results show main effects for air ions on both physiological parameters, with 48% less change in %SRR ( P<0.01) and 46% less change in urinary 5-HIAA levels ( P<0.055) during negative air ions, indicating increased stress tolerance. Strong interactive effects for ALS x air ion condition appeared, with high and low ALS children reacting oppositely to negative air ions in measures of skin resistance level ( P<0.01), wrist activity ( P<0.01) and digit span backwards ( P<0.004). Thus individual differences in autonomic reactivity and the presence or absence of stressors appear as critical elements for internal validity, and in preventing consequent skewed results from obscuring progress in air ion research.

  13. Variations of the ambient dose equivalent rate in the ground level air.

    PubMed

    Lebedyte, M; Butkus, D; Morkŭnas, G

    2003-01-01

    The ambient dose equivalent rate is caused by ionizing radiation of radionuclides in the atmosphere and on the ground surface as well as by cosmic radiation. Seasonal and diurnal variations of the ambient dose equivalent rate (ADER) in the ground level air are influenced by the concentration of 222Rn daughters. The 222Rn concentration in the ground level atmosphere, in turn, depends on the rate of the 222Rn exhalation from soil and turbulent air mixing. Its diurnal and seasonal variations depend on meteorological conditions. The aim of this study is to estimate the influence of variations of the rate of the 222Rn exhalation from soil and its concentrations in the ground level air on variations of ADER in the ground level air, as well as the dependence of these parameters on meteorological conditions. The 222Rn diffusion coefficient and its exhalation rate in undisturbed loamy soil have been determined. The 222Rn concentration in the soil air and its concentration in the ground level air correlate inversely (correlation coefficient is r = -0.62). The main factors determining the 222Rn exhalation from soil are: the soil temperature (r = 0.64), the difference in temperature of soil and air (r = 0.57), and the precipitation amount (r = 0.50). The intensity of gamma radiation in the ground level air is mostly related to the 222Rn concentration in the air (r = 0.62), while the effect of the exhalation rate from soil is relatively low (r = 0.36). It has been shown that ADER due to 222Rn progeny causes only 7-16% of the total ADER and influences its variation. The comparison of variations of ADER due to 222Rn progeny and the total ADER during several years shows that these parameters correlate positively.

  14. Printability Optimization For Fine Pitch Solder Bonding

    SciTech Connect

    Kwon, Sang-Hyun; Lee, Chang-Woo; Yoo, Sehoon

    2011-01-17

    Effect of metal mask and pad design on solder printability was evaluated by DOE in this study. The process parameters were stencil thickness, squeegee angle, squeegee speed, mask separating speed, and pad angle of PCB. The main process parameters for printability were stencil thickness and squeegee angle. The response surface showed that maximum printability of 1005 chip was achieved at the stencil thickness of 0.12 mm while the maximum printability of 0603 and 0402 chip was obtained at the stencil thickness of 0.05 mm. The bonding strength of the MLCC chips was also directly related with the printability.

  15. Printability Optimization For Fine Pitch Solder Bonding

    NASA Astrophysics Data System (ADS)

    Kwon, Sang-Hyun; Lee, Chang-Woo; Yoo, Sehoon

    2011-01-01

    Effect of metal mask and pad design on solder printability was evaluated by DOE in this study. The process parameters were stencil thickness, squeegee angle, squeegee speed, mask separating speed, and pad angle of PCB. The main process parameters for printability were stencil thickness and squeegee angle. The response surface showed that maximum printability of 1005 chip was achieved at the stencil thickness of 0.12 mm while the maximum printability of 0603 and 0402 chip was obtained at the stencil thickness of 0.05 mm. The bonding strength of the MLCC chips was also directly related with the printability.

  16. Fatigue life prediction of solder joints

    SciTech Connect

    Jones, W.B.

    1991-09-10

    The current status of lifetime prediction under conditions of thermomechanical creep/fatigue is reviewed. Each method is summarized and the results of the application to solder joints is shown. While each method has been applied with some success, a predictive, phenomenological approach has not been developed and validated. A method which captures the response of a crack to steady-state and cycling environments appears to hold most the most promise to provide a useful design tool. 42 refs., 14 figs., 1 tab.

  17. Use of an indoor air quality model (IAQM) to estimate indoor ozone levels.

    PubMed

    Hayes, S R

    1991-02-01

    Currently, outdoor ozone levels in many U.S. cities exceed the primary health-based national ambient air quality standard. While outdoor ozone levels are an important measure of the severity of those exceedances, people typically spend more than 80 percent of their time indoors, where ozone levels are lower. Indoor ozone levels range from 10 to 80 percent of outdoor levels, with many people receiving a substantial portion of their ozone exposure while indoors. This paper uses an indoor air quality model (IAQM) to estimate indoor ozone levels by microenvironment type (home, office, and vehicle) and configuration (windows open, windows closed, older construction, weatherized, and air conditioned). The formulation of IAQM is discussed, along with specification of model parameters for ozone. The multicompartment version of IAQM is described, with a single-compartment version used for the analyses. IAQM-calculated ozone indoor-outdoor ratios compare well with research-reported values. Results indicate that ozone peak-concentration indoor-outdoor ratios range as follows: home--0.65 (windows open), 0.36 (air conditioned), 0.23 (typical construction, windows closed), and 0.05 (energy-efficient construction, windows closed); office--0.82 (heating, ventilation and air conditioning systems supplying 100 percent outdoor air), 0.60 (typical HVAC), and 0.32 (energy-efficient HVAC); and vehicle--0.41 (85 mph), 0.33 (55 mph), and 0.21 (10 mph). Analysis results are presented to characterize IAQM's sensitivity to assumed model parameters.

  18. Interconnection of thermal parameters, microstructure and mechanical properties in directionally solidified Sn–Sb lead-free solder alloys

    SciTech Connect

    Dias, Marcelino; Costa, Thiago; Rocha, Otávio; Spinelli, José E.; Cheung, Noé; Garcia, Amauri

    2015-08-15

    Considerable effort is being made to develop lead-free solders for assembling in environmental-conscious electronics, due to the inherent toxicity of Pb. The search for substitute alloys of Pb–Sn solders has increased in order to comply with different soldering purposes. The solder must not only meet the expected levels of electrical performance but may also have appropriate mechanical strength, with the absence of cracks in the solder joints. The Sn–Sb alloy system has a range of compositions that can be potentially included in the class of high temperature solders. This study aims to establish interrelations of solidification thermal parameters, microstructure and mechanical properties of Sn–Sb alloys (2 wt.%Sb and 5.5 wt.%Sb) samples, which were directionally solidified under cooling rates similar to those of reflow procedures in industrial practice. A complete high-cooling rate cellular growth is shown to be associated with the Sn–2.0 wt.%Sb alloy and a reverse dendrite-to-cell transition is observed for the Sn–5.5 wt.%Sb alloy. Strength and ductility of the Sn–2.0 wt.%Sb alloy are shown not to be affected by the cellular spacing. On the other hand, a considerable variation in these properties is associated with the cellular region of the Sn–5.5 wt.%Sb alloy casting. - Graphical abstract: Display Omitted - Highlights: • The microstructure of the Sn–2 wt.%Sb alloy is characterized by high-cooling rates cells. • Reverse dendrite > cell transition occurs for Sn–5.5 wt.%Sb alloy: cells prevail for cooling rates > 1.2 K/s. • Sn–5.5 wt.%Sb alloy: the dendritic region occurs for cooling rates < 0.9 K/s. • Sn–5.5 wt.%Sb alloy: tensile properties are improved with decreasing cellular spacing.

  19. Soldering in a Reduced Gravity Environment (SoRGE)

    NASA Technical Reports Server (NTRS)

    Easton, John W.; Struk, Peter M.

    2012-01-01

    Future long-duration human exploration missions will be challenged by constraints on mass and volume allocations available for spare parts. Addressing this challenge will be critical to the success of these missions. As a result, it is necessary to consider new approaches to spacecraft maintenance and repair that reduce the need for large replacement components. Currently, crew members on the International Space Station (ISS) recover from faults by removing and replacing, using backup systems, or living without the function of Orbital Replacement Units (ORUs). These ORUs are returned to a depot where the root cause of the failure is determined and the ORU is repaired. The crew has some limited repair capability with the Modulation/DeModulation (MDM) ORU, where circuit cards are removed and replace in faulty units. The next step to reducing the size of the items being replaced would be to implement component-level repair. This mode of repair has been implemented by the U.S. Navy in an operational environment and is now part of their standard approach for maintenance. It is appropriate to consider whether this approach can be adapted for future spaceflight operations. To this end, the Soldering in a Reduced Gravity Environment (SoRGE) experiment studied the effect of gravity on the formation of solder joints on electronic circuit boards. This document describes the SoRGE experiment, the analysis methods, and results to date. This document will also contain comments from the crew regarding their experience conducting the SoRGE experiment as well as recommendations for future improvements. Finally, this document will discuss the plans for the SoRGE samples which remain on ISS.

  20. Reliability Evaluation of Bga Solder Joints during Accelerated Life Test

    NASA Astrophysics Data System (ADS)

    Lee, Ouk Sub; Myoung, No Hoon; Kim, Dong Hyeok; Hur, Man Jae; Hwang, Si Woon

    The use of BGA (Ball Grid Array) interconnects utilizing the lead-free solder joint has grown rapidly because of its small volume and diversity of application. Thus, it requires the continuous quantification and refinement of lead-free solder joint reliability. The lead-free solder creep and cyclically applied mechanical loads cause metal fatigue on the lead-free solder joint which inevitably leads to an electrical discontinuity. In the field application, BGA solder joints experience mechanical loads during temperature changes caused by power up/down events as the result of the CTE (Coefficient of Thermal Expansion) mismatch between the substrate and the Si die. In this paper, extremely small resistance changes at joint area corresponding to through-cracks generated by thermal fatigue were measured. In this way, the failure was defined in terms of anomalous changes in electrical resistance of the joint. Furthermore the reliability of BGA solder joints in thermal cycling is evaluated by using the modified coffin-Manson criterion which may define and distinguish failure. Any change in circuit resistance according to the accumulated damage induced by the thermal cycling in the joint was recorded and evaluated in order to quantitate reliability of solder joint.

  1. Electromigration of composite Sn-Ag-Cu solder bumps

    NASA Astrophysics Data System (ADS)

    Sharma, Ashutosh; Xu, Di Erick; Chow, Jasper; Mayer, Michael; Sohn, Heung-Rak; Jung, Jae Pil

    2015-11-01

    This study investigates the electromigration (EM) behavior of lead free Sn-Ag-Cu (SAC) solder alloys that were reinforced with different types of nanoparticles [Copper-coated carbon nanotubes (Cu/CNT), La2O3, Graphene, SiC, and ZrO2]. The composite solders were bumped on a Cu substrate at 220°C, and the resistance of the bumped solders was measured using a four wire setup. Current aging was carried out for 4 hours at a temperature of 160°C, and an increase in resistance was noted during this time. Of all the composite solders that were studied, La2O3 and SiC reinforced SAC solders exhibited the smallest resistances after current aging. However, the rate of change in the resistance at room temperature was lower for the SiC-reinforced SAC solder. The SAC and Graphene reinforced SAC solder bumps completely failed within 15 - 20 min of these tests. The SiC nanoparticles were reported to possibly entrap the SAC atoms better than other nanoparticles with a lower rate of EM. [Figure not available: see fulltext.

  2. Laser forward transfer of solder paste for microelectronics fabrication

    NASA Astrophysics Data System (ADS)

    Mathews, Scott A.; Charipar, Nicholas A.; Auyeung, Ray C.; Kim, Heungsoo; Piqué, Alberto

    2015-03-01

    The progressive miniaturization of electronic devices requires an ever-increasing density of interconnects attached via solder joints. As a consequence, the overall size and spacing (or pitch) of these solder joint interconnects keeps shrinking. When the pitch between interconnects decreases below 200 μm, current technologies, such as stencil printing, find themselves reaching their resolution limit. Laser direct-write (LDW) techniques based on laser-induced forward transfer (LIFT) of functional materials offer unique advantages and capabilities for the printing of solder pastes. At NRL, we have demonstrated the successful transfer, patterning, and subsequent reflow of commercial Pb-free solder pastes using LIFT. Transfers were achieved both with the donor substrate in contact with the receiving substrate and across a 25 μm gap, such that the donor substrate does not make contact with the receiving substrate. We demonstrate the transfer of solder paste features down to 25 μm in diameter and as large as a few hundred microns, although neither represents the ultimate limit of the LIFT process in terms of spatial dimensions. Solder paste was transferred onto circular copper pads as small as 30 μm and subsequently reflowed, in order to demonstrate that the solder and flux were not adversely affected by the LIFT process.

  3. Political Factors Affecting the Enactment of State-Level Clean Indoor Air Laws

    PubMed Central

    Vernick, Jon S.; Stuart, Elizabeth A.; Webster, Daniel W.

    2014-01-01

    Objectives. We examined the effects of key political institutional factors on the advancement of state-level clean indoor air laws. Methods. We performed an observational study of state-level clean indoor air law enactment among all 50 US states from 1993 to 2010 by using extended Cox hazard models to assess risk of enacting a relevant law. Results. During the 18-year period from 1993 to 2010, 28 states passed a law covering workplaces, 33 states passed a law covering restaurants, 29 states passed a law covering bars, and 16 states passed a law covering gaming facilities. States with term limits had a 2.15 times greater hazard (95% confidence interval [CI] = 1.27, 3.65; P = .005) of enacting clean indoor air laws. The presence of state-level preemption of local clean indoor air laws was associated with a 3.26 times greater hazard (95% CI = 1.11, 9.53; P = .031) of state-level policy enactment. In the presence of preemption, increased legislative professionalism was strongly associated (hazard ratio = 3.28; 95% CI = 1.10, 9.75; P = .033) with clean indoor air law enactment. Conclusions. Political institutional factors do influence state-level clean indoor air law enactment and may be relevant to other public health policy areas. PMID:24825239

  4. Effect of reflow and thermal aging on the microstructure and microhardness of Sn-3.7Ag-xBi solder alloys

    NASA Astrophysics Data System (ADS)

    He, M.; Acoff, V. L.

    2006-12-01

    This work investigates the effect of reflow and the thermal aging process on the microstructural evolution and microhardness of five types of Sn-Ag based lead-free solder alloys: Sn-3.7Ag, Sn-3.7Ag-1Bi, Sn-3.7Ag-2Bi, Sn-3.7Ag-3Bi, and Sn-3.7Ag-4Bi. The microhardness and microstructure of the solders for different cooling rates after reflow at 250°C and different thermal aging durations at 150°C for air-cooled samples have been studied. The effect of Bi is discussed based on the experimental results. It was found that the microhardness increases with increasing Bi addition to Sn-3.7Ag solder regardless of reflow or thermal aging process. Scanning electron microscopy images show the formation of Ag3Sn particles, Sn-rich phases, and precipitation of Bi-rich phases in different solders. The increase of microhardness with Bi addition is due to the solution strengthening and precipitation strengthening provided by Bi in the solder. The trend of decrease in microhardness with increasing duration of thermal aging was observed.

  5. Teaching minority middle-school students to solder

    NASA Astrophysics Data System (ADS)

    Reardon, James; Gates, Billy J., Jr.

    2014-03-01

    We aspired to teach minority middle school students to solder. We found that important variables affecting our ability to do so included: student-to-teacher ratio, venue of instruction, relationships with community partners, and understanding of the structure of the student's worldview. Once the effects of these variables had been understood, we found the students readily learned to solder. We now want to see whether the acquisition of the skill of soldering leads the students to be more interested in technical careers and in going to college. Supported by an APS Outreach Mini-grant.

  6. Solder technology in the manufacturing of electronic products

    SciTech Connect

    Vianco, P.T.

    1993-08-01

    The electronics industry has relied heavily upon the use of soldering for both package construction and circuit assembly. The solder attachment of devices onto printed circuit boards and ceramic microcircuits has supported the high volume manufacturing processes responsible for low cost, high quality consumer products and military hardware. Defects incurred during the manufacturing process are minimized by the proper selection of solder alloys, substrate materials and process parameters. Prototyping efforts are then used to evaluate the manufacturability of the chosen material systems. Once manufacturing feasibility has been established, service reliability of the final product is evaluated through accelerated testing procedures.

  7. Microbial counts and particulate matter levels in roadside air samples under skytrain stations, Bangkok, Thailand.

    PubMed

    Luksamijarulkul, Pipat; Kongtip, Pornpimol

    2010-05-01

    In conditions with heavy traffic and crowds of people on roadside areas under skytrain stations in Bangkok, the natural air ventilation may be insufficient and air quality may be poor. A study of 350 air samples collected from the roadside, under skytrain stations in Bangkok, was carried out to assess microbial counts (210 air samples) and particulate matter (PM10) levels (140 samples). The results reveal the mean +/- standard deviation bacterial counts and fungal counts were 406.8 +/- 302.7 cfu/m3 and 128.9 +/- 89.7 cfu/m3, respectively. The PM10 level was 186.1 +/- 188.1 microg/m3. When compared to recommended levels, 4.8% of air samples (10/210 samples) had bacterial counts more than recommended levels (> 1,000 cfu/ m3) and 27.1% (38/140 samples) had PM10 levels more than recommended levels (> 120 microg/m3). These may affect human health, especially of street venders who spend most of their working time in these areas.

  8. BOREAS AFM-5 Level-2 Upper Air Network Standard Pressure Level Data

    NASA Technical Reports Server (NTRS)

    Barr, Alan; Hrynkiw, Charmaine; Hall, Forrest G. (Editor); Newcomer, Jeffrey A. (Editor); Smith, David E. (Technical Monitor)

    2000-01-01

    The BOREAS AFM-5 team collected and processed data from the numerous radiosonde flights during the project. The goals of the AFM-05 team were to provide large-scale definition of the atmosphere by supplementing the existing AES aerological network, both temporally and spatially. This data set includes basic upper-air parameters interpolated at 0.5 kiloPascal increments of atmospheric pressure from data collected from the network of upper-air stations during the 1993, 1994, and 1996 field campaigns over the entire study region. The data are contained in tabular ASCII files. The data files are available on a CD-ROM (see document number 20010000884) or from the Oak Ridge National Laboratory (ORNL) Distributed Active Archive Center (DAAC).

  9. Effect of soldering techniques and gap distance on tensile strength of soldered Ni-Cr alloy joint

    PubMed Central

    Lee, Sang-Yeob

    2010-01-01

    PURPOSE The present study was intended to evaluate the effect of soldering techniques with infrared ray and gas torch under different gap distances (0.3 mm and 0.5 mm) on the tensile strength and surface porosity formation in Ni-Cr base metal alloy. MATERIALS AND METHODS Thirty five dumbbell shaped Ni-Cr alloy specimens were prepared and assigned to 5 groups according to the soldering method and the gap distance. For the soldering methods, gas torch (G group) and infrared ray (IR group) were compared and each group was subdivided by corresponding gap distance (0.3 mm: G3 and IR3, 0.5 mm: G5, IR5). Specimens of the experimental groups were sectioned in the middle with a diamond disk and embedded in solder blocks according to the predetermined distance. As a control group, 7 specimens were prepared without sectioning or soldering. After the soldering procedure, a tensile strength test was performed using universal testing machine at a crosshead speed 1 mm/min. The proportions of porosity on the fractured surface were calculated on the images acquired through the scanning electronic microscope. RESULTS Every specimen of G3, G5, IR3 and IR5 was fractured on the solder joint area. However, there was no significant difference between the test groups (P > .05). There was a negative correlation between porosity formation and tensile strength in all the specimens in the test groups (P < .05). CONCLUSION There was no significant difference in ultimate tensile strength of joints and porosity formations between the gas-oxygen torch soldering and infrared ray soldering technique or between the gap distance of 0.3 mm and 0.5 mm. PMID:21264189

  10. [Study on feasible emission control level of air pollutions for cement industry ].

    PubMed

    Ren, Chun; Jiang, Mei; Zou, Lan; Li, Xiao-qian; Wei, Yu-xia; Zhao, Guo-hua; Zhang, Guo-ning

    2014-09-01

    The revised National Emission Standard of Air Pollutions for Cement Industry has been issued, which will be effective for the new enterprises and the existing enterprises on Mar. 1st, 2014 and July 1st, 2015, respectively. In the process of revision, the key technical issues on determination of standard limits was how to determine the feasible emission control level of air pollutions. Feasible emission control requirements were put forward, according to air pollutants emission, technologies, environmental management requirements and foreign standards, etc. The main contents of the revised standard include expanding the scope of application, increasing the pollutants, improving the particulate and NO emissions control level, and increasing special emission limits applied to key areas of air pollutants. The standard will become the gripper of pollution prevention, total emission reduction, structural adjustment and optimization of the layout, and will promote scientific and technical progression for the cement industry.

  11. Dependence of radon levels in Postojna Cave on outside air temperature

    NASA Astrophysics Data System (ADS)

    Gregorič, A.; Zidanšek, A.; Vaupotič, J.

    2011-05-01

    Postojna Cave is the largest of 21 show caves in Slovenia. The radon concentration there was measured continuously in the Great Mountain hall from July 2005 to October 2009 and ranged from about 200 Bq m-3 in winter to about 3 kBq m-3 in summer. The observed seasonal pattern of radon concentration is governed by air movement due to the difference in external and internal air densities, controlled mainly by air temperature. The cave behaves as a large chimney and in the cold period, the warmer cave air is released vertically through cracks and fissures to the colder outside atmosphere, enabling the inflow of fresh air with low radon levels. In summer the ventilation is minimal or reversed and the air flows from the higher to the lower openings of the cave. Our calculations have shown that the effect of the difference between outside and cave air temperatures on radon concentration is delayed for four days, presumably because of the distance of the measurement point from the lower entrance (ca. 2 km). A model developed for predicting radon concentration on the basis of outside air temperature has been checked and found to be successful.

  12. Search for tachyons associated with extensive air showers in the ground level cosmic radiation

    NASA Technical Reports Server (NTRS)

    Masjed, H. F.; Ashton, F.

    1985-01-01

    Events detected in a shielded plastic scintillation counter occurring in the 26 microsec preceding the arrival of an extensive air shower at ground level with local electron density or = 20 m to the -2 power and the 240 microsec after its arrival have been studied. No significant excess of events (tachyons) arriving in the early time domain have been observed in a sample of 11,585 air shower triggers.

  13. Wafer-level vacuum packaging for an optical readout bi-material cantilever infrared FPA

    NASA Astrophysics Data System (ADS)

    Li, Shuyu; Zhou, Xiaoxiong; Yu, Xiaomei

    2013-12-01

    In this paper, we report the design and fabrication of an uncooled infrared (IR) focal plane array (FPA) on quartz substrate and the wafer-level vacuum packaging for the IR FPA in view of an optical readout method. This FPA is composed of bi-material cantilever array which fabricated by the Micro-Electro Mechanical System (MEMS) technology, and the wafer-level packaging of the IR FPA is realized based on AuSn solder bonding technique. The interface of soldering is observed by scan electron microscope (SEM), which indicates that bonding interface is smooth and with no bubbles. The air leakage rate of packaged FPA is measured to be 1.3×10-9 atm·cc/s.

  14. Solder fatigue reduction in point focus photovoltaic concentrator modules

    SciTech Connect

    Hund, T.D.; Burchett, S.N.

    1991-01-01

    Solder fatigue tests have been conducted on point focus photovoltaic concentration cell assemblies to identify a baseline fatigue life and to quantify the fatigue life improvements that result using a copper-molybdenum-copper low-expansion insert between the solar cell and copper heat spreader. Solder microstructural changes and fatigue crack growth were identified using cross sections and ultrasonic scans of the fatigue solder joints. The Coffin-Manson and Total Strain fatigue models for low-cycle fatigue were evaluated for use in fatigue life predictions. Since both of these models require strain calculations, two strain calculation methods were compared: hand-calculated shear strain and a finite element method shear strain. At present, the available theoretical models for low-cycle solder fatigue are limited in their ability to predict failure; consequently, extensive thermal cycling is continuing to define the fatigue life for point focus photovoltaic cell assemblies. 9 refs., 9 figs., 2 tabs.

  15. Microstructurally based finite element simulation of solder joint behavior

    SciTech Connect

    Frear, D.R.; Burchett, S.N.; Neilsen, M.K.; Stephens, J.J.

    1996-01-01

    The most commonly used solder for electrical interconnects in electronic packages is the near eutectic 60Sn-40Pb alloy. This alloy has a number of processing advantages (suitable melting point of 183C and good wetting behavior). However, under conditions of cyclic strain and temperature (thermomechanical fatigue) the microstructure of this alloy undergoes a heterogeneous coarsening and failure process that makes the prediction of solder joint lifetime complex. A finite element simulation methodology to predict solder joint mechanical behavior, that includes microstructural evolution, has been developed. The mechanical constitutive behavior was incorporated into the time dependent internal state variable viscoplastic model through experimental creep tests. The microstructural evolution is incorporated through a series of mathematical relations that describe mass flow in a temperature/strain environment. The model has been found to simulate observed thermomechanical fatigue behavior in solder joints.

  16. Investigation of gold embrittlement in connector solder joints

    NASA Technical Reports Server (NTRS)

    Lane, F. L.

    1972-01-01

    An investigation was performed to determine to what extent typical flight connector solder joints may be embrittled by the presence of gold. In addition to mapping of gold content in connector solder joints by an electron microprobe analyzer, metallographic examinations and mechanical tests (thermal shock, vibration, impact and tensile strength) were also conducted. A description of the specimens and tests, a discussion of the data, and some conclusions are presented.

  17. [Study on postsoldering of Ni-Cr ceramic alloys. Effect of soldering temperature and atmosphere].

    PubMed

    Ishigure, K

    1990-03-01

    The effects of soldering temperatures and atmospheres on tensile strength of solder joints were investigated for two types of Ni-Cr ceramic alloys and one type of gold solder for postsoldering. Each alloy and the gold solder were soldered with fluoride flux in an electric furnace in three different temperatures and four different atmospheres. Of the three different temperatures, one was just over the liquidus point of the solder, another 50 degrees C higher than the liquidus point and the other 100 degrees C higher than the liquidus point. Of the four different atmospheres, one was under vacuum, another under vacuum with a 6 l/h argon gas flow, another under vacuum with a 12 l/h argon gas flow and the other under vacuum with a 24 l/h argon gas flow. Tensile strength testing was performed at the solder joints. The fracture surface was observed by EPMA. Wettability of the liquid solder on each alloy was performed by the sessile drop method in high-purity argon gas. The surface tension and the contact angle of the liquid solder on MgO were determined by the sessile drop method in high-purity argon gas. The soldering was performed in the furnace used for the sessile drop method in high-purity argon gas. The results are summarized as follows. The tensile strength of UNI METAL-solder joints was significantly affected by the soldering temperature (p less than 0.01). However, the effect of the soldering atmosphere on the tensile strength was small. The effect of the soldering temperature and atmosphere on the tensile strength of Victory II-solder joints was small. Each alloy had a different adequate soldering temperature. With the increase in the soldering temperature, the diffusion layer of the solder joint interface increased, but no correlationship between the atmosphere and the diffusion layer thickness was observed. Fracture patterns of UNI METAL-solder joints were mixed adhesive-cohesive fractures with a large cohesive area. Fracture patterns of Victory II-solder

  18. Urban air quality and carboxyhemoglobin levels in a group of traffic policemen.

    PubMed

    Bono, R; Piccioni, P; Traversi, D; Degan, R; Grosa, M; Bosello, G; Gilli, G; Arossa, W; Bugiani, M

    2007-04-15

    Toxicological potential of carbon monoxide (CO) on humans is well known. Nevertheless, CO is still considered as a useful marker to detect some environmental and occupational human risk factors typical of cities. The role played by traffic pollution, indoor air quality in offices and tobacco smoke on the expression of carboxyhemoglobin (COHb%) levels was investigated in a large group of traffic policemen in Torino city (North-Western Italy). At the end of the working shift, 228 policemen responded to a questionnaire, weight and height recorded, urine spot samples collected to measure cotinine as biomarker of tobacco smoke exposure, and an arterial blood sample was taken to measure COHb levels. Data of outdoor urban air-CO were collected and to each subject a "CO outdoor air measurement" was related to his/her COHb level. Considering the annual trend of air-CO pollution from 2002 to 2004, one can assume that a general improvement of air quality in Torino was evident. Taking into account the environments where policemen work (urban outdoor and indoor), and analyzing their COHb% content, the traffic-congested areas, and, in general, the outdoor urban environment were equally risky as offices. Furthermore, if compared to CO arising from traffic-congested areas or other outdoor environments, the traffic policemen in Torino city demonstrate COHb% levels largely due to smoking habits.

  19. The Effect of Air Tourniquet on Interleukin-6 Levels in Total Knee Arthroplasty

    PubMed Central

    Tsunoda, Kenji; Sonohata, Motoki; Kugisaki, Hajime; Someya, Shinsuke; Honke, Hidefumi; Komine, Mitsunori; Izumi, Masataka; Ide, Shuya; Mawatari, Masaaki

    2017-01-01

    Background: Air tourniquet-induced skeletal muscle injury increases the concentrations of some cytokines such as interleukin-6 (IL-6) in plasma. However, the effect of an air tourniquet on the IL-6 concentrations after total knee arthroplasty (TKA) is unclear. We therefore investigated the impact of tourniquet-induced ischemia and reperfusion injury in TKA using the IL-6 level as an index. Methods: Ten patients with primary knee osteoarthrosis who underwent unilateral TKA without an air tourniquet were recruited (Non-tourniquet group). We also selected 10 age- and sex-matched control patients who underwent unilateral TKA with an air tourniquet (Tourniquet group). Venous blood samples were obtained at 3 points; before surgery, 24 h after surgery, and 7 days after surgery. The following factors were compared between the two groups; IL-6, C-reactive protein (CRP), creatine phosphokinase (CPK), the mean white blood cell (WBC) counts, and the maximum daily body temperatures. Results: The IL-6 level at 24 h after surgery was significantly higher than that at any other point (p<0.01). No significant differences were observed in the WBC count, the body temperature, or the CRP, CPK, or IL-6 levels of the two groups at any of the time points. Conclusion: The effect of ischemia and reperfusion due to the use of an air tourniquet on increasing the IL-6 level was much smaller than that induced by surgical stress in TKA. PMID:28217217

  20. GSOD Based Daily Global Mean Surface Temperature and Mean Sea Level Air Pressure (1982-2011)

    SciTech Connect

    Xuan Shi, Dali Wang

    2014-05-05

    This data product contains all the gridded data set at 1/4 degree resolution in ASCII format. Both mean temperature and mean sea level air pressure data are available. It also contains the GSOD data (1982-2011) from NOAA site, contains station number, location, temperature and pressures (sea level and station level). The data package also contains information related to the data processing methods

  1. Substrate solder barriers for semiconductor epilayer growth

    DOEpatents

    Drummond, T.J.; Ginley, D.S.; Zipperian, T.E.

    1989-05-09

    During the growth of compound semiconductors by epitaxial processes, substrates are typically mounted to a support. In modular beam epitaxy, mounting is done using indium as a solder. This method has two drawbacks: the indium reacts with the substrate, and it is difficult to uniformly wet the back of a large diameter substrate. Both of these problems have been successfully overcome by sputter coating the back of the substrate with a thin layer of tungsten carbide or tungsten carbide and gold. In addition to being compatible with the growth of high quality semiconductor epilayers this coating is also inert in all standard substrate cleaning etchants used for compound semiconductors, and provides uniform distribution of energy in radiant heating.

  2. Substrate solder barriers for semiconductor epilayer growth

    DOEpatents

    Drummond, Timothy J.; Ginley, David S.; Zipperian, Thomas E.

    1989-01-01

    During the growth of compound semiconductors by epitaxial processes, substrates are typically mounted to a support. In modular beam epitaxy, mounting is done using indium as a solder. This method has two drawbacks: the indium reacts with the substrate, and it is difficult to uniformly wet the back of a large diameter substrate. Both of these problems have been successfully overcome by sputter coating the back of the substrate with a thin layer of tungsten carbide or tungsten carbide and gold. In addition to being compatible with the growth of high quality semiconductor epilayers this coating is also inert in all standard substrate cleaning etchants used for compound semiconductors, and provides uniform distribution of energy in radiant heating.

  3. Substrate solder barriers for semiconductor epilayer growth

    DOEpatents

    Drummond, T.J.; Ginley, D.S.; Zipperian, T.E.

    1987-10-23

    During the growth of compound semiconductors by epitaxial processes, substrates are typically mounted to a support. In molecular beam epitaxy, mounting is done using indium as a solder. This method has two drawbacks: the indium reacts with the substrate, and it is difficult to uniformly wet the back of a large diameter substrate. Both of these problems have been successfully overcome by sputter coating the back of the substrate with a thin layer of tungsten carbide or tungsten carbide and gold. In addition to being compatible with the growth of high quality semiconductor epilayers this coating is also inert in all standard substate cleaning etchants used for compound semiconductors, and provides uniform distribution of energy in radiant heating. 1 tab.

  4. Determination of radionuclide concentrations in ground level air using the ASS-500 high volume sampler

    SciTech Connect

    Frenzel, E.; Arnold, D.; Wershofen, H.

    1996-06-01

    A method for determination of radionuclide concentrations in air aerosol samples collected by the high volume aerosol sampler ASS-500 was elaborated. The aerosol sampling station ASS-500 is a Stand alone, all-weather proofed instrument. It is designed for representative sampling of airborne radionuclides from ground level air at a height of about 1.5 m above ground level. The ASS-500 station enables continuous air monitoring both normal and emergency Situations. The collection of aerosols on the Petrianov FPP-15-1.5 type filter out of an air volume of about 100,000 m{sup 3} (sampling period 1 wk) or of about 250,000 m{sup 3} (sampling period 3 wk) admits accurate spectrometric low level measurements of natural and artificial radionuclides. The achieved detection limit is 0.5 {mu}Bq m{sup -3} and 0.2 {mu}Bq m{sup -3} for {sup 137}Cs, respectively. A new developed air flow Meter system allows to enhance the collected air volume to about 150,000 m{sup 3} per week and lowers the detection limit to <0.4 {mu}Bq m{sup -3} for {sup 137}Cs for weekly collected aerosol samples. In Poland the CLOR uses 9 Stations ASS-500 at different sites as atmospheric radioactivity control system. On the basis of spectrometric measurements of natural and artificial radionuclides in the collected aerosol samples at the different sites, CLOR establishes a weekly report about the radiological situation at Poland for responsible authorities. The very low achievable detection limit of the Station ASS-500 due 10 the high air flow fate and the long possible sampling period were the key argument for other government radiation protection authorities in Europe to introduce the Station ASS-500 into their low level radionuclide atmospheric monitoring programs (Austria, Belarus, France, Germany, Iceland, Spain, Switzerland, Ukraine).

  5. Characterization of eutectic Sn-Bi solder joints

    SciTech Connect

    Mei, Z.; Morris, J.W. Jr. )

    1992-06-01

    This report presents experimental results on 58Bi-42Sn solder joints, optical and SEM microstructures of their matrix and of their interface with copper, solidification behavior studied by differential scanning calorimetry, wettability to copper, creep, and low cycle fatigue. These results are discussed in comparison with 60Sn-40Pb solder, and with three low temperature solders, 52In-48Sn, 42Sn-43Pb-14Bi, and 40In-40Sn-20Pb. The 58Bi-42Sn solder paste with RMA flux wets Cu matrix with a wetting angle of 35[degree] and had a 15[degree] C undercooling during solidification. The constitutive equation of the steady state shear strain rate, and the Coffin-Manson relation constants for the low cycle shear fatigue life at 65[degree] C have been determined. The test results show that this solder has the best creep resistance but the poorest fatigue strength compared with the other four solders. 27 refs., 11 figs., 1 tab.

  6. Thermomechanical fatigue behavior of Sn-Ag solder joints

    NASA Astrophysics Data System (ADS)

    Choi, S.; Subramanian, K. N.; Lucas, J. P.; Bieler, T. R.

    2000-10-01

    Microstructural studies of thermomechanically fatigued actual electronic components consisting of metallized alumina substrate and tinned copper lead, soldered with Sn-Ag or 95.5Ag/4Ag/0.5Cu solder were carried out with an optical microscope and environmental scanning electron microscope (ESEM). Damage characterization was made on samples that underwent 250 and 1000 thermal shock cycles between -40°C and 125°C, with a 20 min hold time at each extreme. Surface roughening and grain boundary cracking were evident even in samples thermally cycled for 250 times. The cracks were found to originate on the free surface of the solder joint. With increased thermal cycles these cracks grew by grain boundary decohesion. The crack that will affect the integrity of the solder joint was found to originate from the free surface of the solder very near the alumina substrate and progress towards and continue along the solder region adjacent to the Ag3Sn intermetallic layer formed with the metallized alumina substrate. Re-examination of these thermally fatigued samples that were stored at room temperature after ten months revealed the effects of significant residual stress due to such thermal cycles. Such observations include enhanced surface relief effects delineating the grain boundaries and crack growth in regions inside the joint.

  7. Creep properties of Pb-free solder joints

    SciTech Connect

    Song, H.G.; Morris Jr., J.W.; Hua, F.

    2002-04-01

    Describes the creep behavior of three Sn-rich solders that have become candidates for use in Pb-free solder joints: Sn-3.5Ag, Sn-3Ag-0.5Cu and Sn-0.7Cu. The three solders show the same general behavior when tested in thin joints between Cu and Ni/Au metallized pads at temperatures between 60 and 130 C. Their steady-state creep rates are separated into two regimes with different stress exponents(n). The low-stress exponents range from {approx}3-6, while the high-stress exponents are anomalously high (7-12). Strikingly, the high-stress exponent has a strong temperature dependence near room temperature, increasing significantly as the temperature drops from 95 to 60 C. The anomalous creep behavior of the solders appears to be due to the dominant Sn constituent. Joints of pure Sn have stress exponents, n, that change with stress and temperature almost exactly like those of the Sn-rich solder joints. Research on creep in bulk samples of pure Sn suggests that the anomalous temperature dependence of the stress exponent may show a change in the dominant mechanism of creep. Whatever its source, it has the consequence that conventional constitutive relations for steady-state creep must be used with caution in treating Sn-rich solder joints, and qualification tests that are intended to verify performance should be carefully designed.

  8. Microsurgical anastomosis of sperm duct by laser tissue soldering

    NASA Astrophysics Data System (ADS)

    Wehner, Martin M.; Teutu-Kengne, Alain-Fleury; Brkovic, Drasko; Henning, Thomas; Klee, Doris; Poprawe, Reinhart; Jakse, Gerhard

    2005-04-01

    Connection of small vessels is usually done by suturing which is very cumbersome. Laser tissue soldering can circumvent that obstacle if a handy procedure can be defined. Our principle approach consists of a bioresorbable hollow stent with an expected degradation time of 3 weeks in combination with laser soldering. The stent is to be fed into the vessel to stabilize both ends and should allow percolation immediately after joining. The stents are made of Poly(D,L-lactid-co-glycolid) and solder is prepared from bovine serum albumin (BSA) doped with Indocyanine green (ICG) as chromophore to increase the absorption of laser light. After insertion, solder is applied onto the outer surface of the vessel and coagulated by laser radiation. The wavelength of 810 nm of a diode laser fits favorably to absorption properties of tissue and solder such that heating up of tissue is limited to prevent from necrosis and wound healing complications. In our study the preparation of stents, the consistency and doping of solder, a beam delivery instrument and the irradiation conditions are worked out. In-vitro tests are carried out on sperm ducts of Sprague-Dowlae (SD) rats. Different irradiation conditions are investigated and a micro-optical system consisting of a lens and a reflecting prism to ensure simultaneous irradiation of front and back side of the vessels tested. Under these conditions, the short-term rupture strength of laser anastomosis revealed as high as those achieved by suturing.

  9. Soldering of Thin Film-Metallized Glass Substrates

    SciTech Connect

    Hosking, F.M.; Hernandez, C.L.; Glass, S.J.

    1999-03-31

    The ability to produce reliable electrical and structural interconnections between glass and metals by soldering was investigated. Soldering generally requires premetallization of the glass. As a solderable surface finish over soda-lime-silicate glass, two thin films coatings, Cr-Pd-Au and NiCr-Sn, were evaluated. Solder nettability and joint strengths were determined. Test samples were processed with Sn60-Pb40 solder alloy at a reflow temperature of 210 C. Glass-to-cold rolled steel single lap samples yielded an average shear strength of 12 MPa. Solder fill was good. Control of the Au thickness was critical in minimizing the formation of AuSn{sub 4} intermetallic in the joint, with a resulting joint shear strength of 15 MPa. Similar glass-to-glass specimens with the Cr-Pd-Au finish failed at 16.5 MPa. The NiCr-Sn thin film gave even higher shear strengths of 20-22.5 MPa, with failures primarily in the glass.

  10. Lead-free solder technology transfer from ASE Americas

    SciTech Connect

    FTHENAKIS,V.

    1999-10-19

    To safeguard the environmental friendliness of photovoltaics, the PV industry follows a proactive, long-term environmental strategy involving a life-of-cycle approach to prevent environmental damage by its processes and products from cradle to grave. Part of this strategy is to examine substituting lead-based solder on PV modules with other solder alloys. Lead is a toxic metal that, if ingested, can damage the brain, nervous system, liver and kidneys. Lead from solder in electronic products has been found to leach out from municipal waste landfills and municipal incinerator ash was found to be high in lead also because of disposed consumer electronics and batteries. Consequently, there is a movement in Europe and Japan to ban lead altogether from use in electronic products and to restrict the movement across geographical boundaries of waste containing lead. Photovoltaic modules may contain small amounts of regulated materials, which vary from one technology to another. Environmental regulations impact the cost and complexity of dealing with end-of-life PV modules. If they were classified as hazardous according to Federal or State criteria, then special requirements for material handling, disposal, record-keeping and reporting would escalate the cost of decommissioning the modules. Fthenakis showed that several of today's x-Si modules failed the US-EPA Toxicity Characteristic Leaching Procedure (TCLP) for potential leaching of Pb in landfills and also California's standard on Total Threshold Limit Concentration (TTLC) for Pb. Consequently, such modules may be classified as hazardous waste. He highlighted potential legislation in Europe and Japan which could ban or restrict the use of lead and the efforts of the printed-circuit industries in developing Pb-free solder technologies in response to such expected legislation. Japanese firms already have introduced electronic products with Pb-free solder, and one PV manufacturer in the US, ASE Americas has used a Pb

  11. Air levels of carcinogenic polycyclic aromatic hydrocarbons after the World Trade Center disaster.

    PubMed

    Pleil, Joachim D; Vette, Alan F; Johnson, Brent A; Rappaport, Stephen M

    2004-08-10

    The catastrophic collapse of the World Trade Center (WTC) on September 11, 2001, created an immense dust cloud followed by fires that emitted soot into the air of New York City (NYC) well into December. The subsequent cleanup used diesel equipment that further polluted the air until the following June. The particulate air pollutants contained mutagenic and carcinogenic polycyclic aromatic hydrocarbons (PAHs). By using an assay developed for archived samples of fine particles, we measured nine PAHs in 243 samples collected at or near Ground Zero from September 23, 2001, to March 27, 2002. Based on temporal trends of individual PAH levels, we differentiated between fire and diesel sources and predicted PAH levels between 3 and 200 d after the disaster. Predicted PAH air concentrations on September 14, 2001, ranged from 1.3 to 15 ng/m(3); these values are among the highest reported from outdoor sources. We infer that these high initial air concentrations resulted from fires that rapidly diminished over 100 d. Diesel sources predominated for the next 100 d, during which time PAH levels declined slowly to background values. Because elevated PAH levels were transient, any elevation in cancer risk from PAH exposure should be very small among nonoccupationally exposed residents of NYC. However, the high initial levels of PAHs may be associated with reproductive effects observed in the offspring of women who were (or became) pregnant shortly after September 11, 2001. Because no PAH-specific air sampling was conducted, this work provides the only systematic measurements, to our knowledge, of ambient PAHs after the WTC disaster.

  12. Australia’s first national level quantitative environmental justice assessment of industrial air pollution

    NASA Astrophysics Data System (ADS)

    Chakraborty, Jayajit; Green, Donna

    2014-04-01

    This study presents the first national level quantitative environmental justice assessment of industrial air pollution in Australia. Specifically, our analysis links the spatial distribution of sites and emissions associated with industrial pollution sources derived from the National Pollution Inventory, to Indigenous status and social disadvantage characteristics of communities derived from Australian Bureau of Statistics indicators. Our results reveal a clear national pattern of environmental injustice based on the locations of industrial pollution sources, as well as volume, and toxicity of air pollution released at these locations. Communities with the highest number of polluting sites, emission volume, and toxicity-weighted air emissions indicate significantly greater proportions of Indigenous population and higher levels of socio-economic disadvantage. The quantities and toxicities of industrial air pollution are particularly higher in communities with the lowest levels of educational attainment and occupational status. These findings emphasize the need for more detailed analysis in specific regions and communities where socially disadvantaged groups are disproportionately impacted by industrial air pollution. Our empirical findings also underscore the growing necessity to incorporate environmental justice considerations in environmental planning and policy-making in Australia.

  13. Aging effects on the microstructure, surface characteristics and wettability of Cu pretinned with Sn-Pb solders

    SciTech Connect

    Linch, Heidi Sue

    1993-11-01

    This study investigates effects of aging in air and argon at 170 C on Cu coupons which were pretinned with 75Sn-25Pb, 8Sn-92Pb, and 5Sn-95Pb solders. Coatings were applied using electroplating or hot dipping techniques. The coating thickness was controlled between 3 to 3μm and the specimens were aged for 0 hours, 2 hours, 24 hours and 2 weeks. Wetting balance tests were used to evaluate the wettability of the test specimens. Microstructural development was evaluated using X-ray diffraction, energy dispersive X-ray and Auger spectroscopy, as well as optical and scanning electron microscopy. The wetting behavior of the test specimens is interpreted with respect to observed microstructural changes and as a function of aging time, solder composition, and processing conditions.

  14. Characterization of Low-Melting-Point Sn-Bi-In Lead-Free Solders

    NASA Astrophysics Data System (ADS)

    Li, Qin; Ma, Ninshu; Lei, YongPing; Lin, Jian; Fu, HanGuang; Gu, Jian

    2016-11-01

    Development of lead-free solders with low melting temperature is important for substitution of Pb-based solders to reduce direct risks to human health and the environment. In the present work, Sn-Bi-In solders were studied for different ratios of Bi and Sn to obtain solders with low melting temperature. The microstructure, thermal properties, wettability, mechanical properties, and reliability of joints with Cu have been investigated. The results show that the microstructures of the Sn-Bi-In solders were composed of β-Sn, Bi, and InBi phases. The intermetallic compound (IMC) layer was mainly composed of Cu6Sn5, and its thickness increased slightly as the Bi content was increased. The melting temperature of the solders was around 100°C to 104°C. However, when the Sn content exceeded 50 wt.%, the melting range became larger and the wettability became worse. The tensile strength of the solder alloys and solder joints declined with increasing Bi content. Two fracture modes (IMC layer fracture and solder/IMC mixed fracture) were found in solder joints. The fracture mechanism of solder joints was brittle fracture. In addition, cleavage steps on the fracture surface and coarse grains in the fracture structure were comparatively apparent for higher Bi content, resulting in decreased elongation for both solder alloys and solder joints.

  15. Some insights into the relationship between urban air pollution and noise levels.

    PubMed

    Kim, Ki-Hyun; Ho, Duy Xuan; Brown, Richard J C; Oh, J-M; Park, Chan Goo; Ryu, In Cheol

    2012-05-01

    The relationship between noise and air pollution was investigated in eight different districts across Seoul, Korea, between September and November 2010. The noise levels in each district were measured at both roadside and non-roadside locations. It was found that the maximum levels of noise were generally at frequencies of around 1000 Hz. The equivalent noise levels (L(eq)), over all districts, averaged 61.4 ± 7.36 dB which is slightly lower than the noise guidelines set by the World Health Organization (WHO) of 70 dB for industrial, commercial, traffic, and outdoor areas. Comparison of L(eq) levels in each district consistently indicates that noise levels are higher at roadside sites than non-roadside sites. In addition the relative dominance of noise during daytime as compared to nighttime was also apparent. Moreover, the results of an analysis relating sound levels with air pollutant levels indicate strongly that the correlation between these two parameters is the strongest at roadside sites (relative to non-roadside sites) and during nighttime (relative to daytime). The results of our data analysis point to a positive, but complex, correlation between noise levels and air pollution.

  16. Decline of Ambient Air Pollution Levels and Improved Respiratory Health in Swiss Children

    PubMed Central

    Bayer-Oglesby, Lucy; Grize, Leticia; Gassner, Markus; Takken-Sahli, Kathy; Sennhauser, Felix H.; Neu, Urs; Schindler, Christian; Braun-Fahrländer, Charlotte

    2005-01-01

    The causality of observed associations between air pollution and respiratory health in children is still subject to debate. If reduced air pollution exposure resulted in improved respiratory health of children, this would argue in favor of a causal relation. We investigated whether a rather moderate decline of air pollution levels in the 1990s in Switzerland was associated with a reduction in respiratory symptoms and diseases in school children. In nine Swiss communities, 9,591 children participated in cross-sectional health assessments between 1992 and 2001. Their parents completed identical questionnaires on health status and covariates. We assigned to each child an estimate of regional particles with an aerodynamic diameter < 10 μg/m3 (PM10) and determined change in PM10 since the first survey. Adjusted for socioeconomic, health-related, and indoor factors, declining PM10 was associated in logistic regression models with declining prevalence of chronic cough [odds ratio (OR) per 10-μg/m3 decline = 0.65, 95% confidence interval (CI), 0.54–0.79], bronchitis (OR = 0.66; 95% CI, 0.55–0.80), common cold (OR = 0.78; 95% CI, 0.68–0.89), nocturnal dry cough (OR = 0.70; 95% CI, 0.60–0.83), and conjunctivitis symptoms (OR = 0.81; 95% CI, 0.70–0.95). Changes in prevalence of sneezing during pollen season, asthma, and hay fever were not associated with the PM10 reduction. Our findings show that the reduction of air pollution exposures contributes to improved respiratory health in children. No threshold of adverse effects of PM10 was apparent because we observed the beneficial effects for relatively small changes of rather moderate air pollution levels. Current air pollution levels in Switzerland still exceed limit values of the Swiss Clean Air Act; thus, children’s health can be improved further. PMID:16263523

  17. Decline of ambient air pollution levels and improved respiratory health in Swiss children.

    PubMed

    Bayer-Oglesby, Lucy; Grize, Leticia; Gassner, Markus; Takken-Sahli, Kathy; Sennhauser, Felix H; Neu, Urs; Schindler, Christian; Braun-Fahrländer, Charlotte

    2005-11-01

    The causality of observed associations between air pollution and respiratory health in children is still subject to debate. If reduced air pollution exposure resulted in improved respiratory health of children, this would argue in favor of a causal relation. We investigated whether a rather moderate decline of air pollution levels in the 1990s in Switzerland was associated with a reduction in respiratory symptoms and diseases in school children. In nine Swiss communities, 9,591 children participated in cross-sectional health assessments between 1992 and 2001. Their parents completed identical questionnaires on health status and covariates. We assigned to each child an estimate of regional particles with an aerodynamic diameter < 10 microg/m3 (PM10) and determined change in PM10 since the first survey. Adjusted for socioeconomic, health-related, and indoor factors, declining PM10 was associated in logistic regression models with declining prevalence of chronic cough [odds ratio (OR) per 10-microg/m3 decline = 0.65, 95% confidence interval (CI), 0.54-0.79], bronchitis (OR = 0.66; 95% CI, 0.55-0.80), common cold (OR = 0.78; 95% CI, 0.68-0.89), nocturnal dry cough (OR = 0.70; 95% CI, 0.60-0.83), and conjunctivitis symptoms (OR = 0.81; 95% CI, 0.70-0.95). Changes in prevalence of sneezing during pollen season, asthma, and hay fever were not associated with the PM10 reduction. Our findings show that the reduction of air pollution exposures contributes to improved respiratory health in children. No threshold of adverse effects of PM10 was apparent because we observed the beneficial effects for relatively small changes of rather moderate air pollution levels. Current air pollution levels in Switzerland still exceed limit values of the Swiss Clean Air Act; thus, children's health can be improved further.

  18. Microorganism levels in air near spray irrigation of municipal waste water: The Lubbock Infection Surveillance Study

    SciTech Connect

    Camann, D.E.; Moore, B.E.; Harding, H.J.; Sorber, C.A.

    1988-01-01

    The Lubbock Infection Surveillance Study (LISS) investigated possible adverse effects on human health from slow-rate land application of municipal wastewater. Extensive air sampling was conducted to characterize the irrigation site as a source of infectious microbial aerosols. Spray irrigation of poor-quality waste water received directly from the treatment plant significantly elevated air densities of fecal coliforms, fecal streptococci, mycobacteria, and coliphage above ambient background levels for at least 200 m downwind. Enteroviruses were repeatedly recovered at 44 to 60 m downwind at a higher level (geometric mean = 0.05 pfu/m3) than observed at other waste water aerosol sites in the U.S. and in Israel. Waste water storage in reservoirs reduced downwind air densities of indicator organisms by two orders of magnitude.

  19. Indoor air quality levels in a University Hospital in the Eastern Province of Saudi Arabia

    PubMed Central

    El-Sharkawy, Mahmoud F.; Noweir, Mohamed E. H.

    2014-01-01

    Aim of the Study: The complex hospital environment requires special attention to ensure a healthy indoor air quality (IAQ) to protect patients and healthcare workers against hospital-acquired infections and occupational diseases. Poor hospital IAQ may cause outbreaks of building-related illness such as headaches, fatigue, eye, and skin irritations, and other symptoms. The general objective for this study was to assess IAQ inside a large University hospital at Al-Khobar City in the Eastern Province of Saudi Arabia. Materials and Methods: Different locations representing areas where most activities and tasks are performed were selected as sampling points for air pollutants in the selected hospital. In addition, several factors were studied to determine those that were most likely to affect the IAQ levels. The temperature and relative percent humidity of different air pollutants were measured simultaneously at each location. Results: The outdoor levels of all air pollutant levels, except volatile organic compounds (VOCs), were higher than the indoor levels which meant that the IAQ inside healthcare facilities (HCFs) were greatly affected by outdoor sources, particularly traffic. The highest levels of total suspended particulates (TSPs) and those less than 10 microns (PM10) inside the selected hospital were found at locations that are characterized with m4ore human activity. Conclusions: Levels of particulate matter (both PM10 and TSP) were higher than the Air Quality Guidelines (AQGs). The highest concentrations of the fungal species recorded were Cladosporium and Penicillium. Education of occupants of HCF on IAQ is critical. They must be informed about the sources and effects of contaminants and the proper operation of the ventilation system. PMID:24696632

  20. Assessment of the effects of the Japanese shift to lead-free solders and its impact on material substitution and environmental emissions by a dynamic material flow analysis.

    PubMed

    Fuse, Masaaki; Tsunemi, Kiyotaka

    2012-11-01

    Lead-free electronics has been extensively studied, whereas their adoption by society and their impact on material substitution and environmental emissions are not well understood. Through a material flow analysis (MFA), this paper explores the life cycle flows for solder-containing metals in Japan, which leads the world in the shift to lead-free solders in electronics. The results indicate that the shift has been progressing rapidly for a decade, and that substitutes for lead in solders, which include silver and copper, are still in the early life cycle stages. The results also show, however, that such substitution slows down during the late life cycle stages owing to long electronic product lifespans. This deceleration of material substitution in the solder life cycle may not only preclude a reduction in lead emissions to air but also accelerate an increase in silver emissions to air and water. As an effective measure against ongoing lead emissions, our scenario analysis suggests an aggressive recycling program for printed circuit boards that utilizes an existing recycling scheme.

  1. Air-powder polishing on self-ligating brackets after clinical use: effects on debris levels

    PubMed Central

    Aragón, Mônica L. S. Castro; Lima, Leandro Santiago; Normando, David

    2016-01-01

    ABSTRACT Introduction: Debris buildup on brackets and arch surfaces is one of the main factors that can influence the intensity of friction between bracket and orthodontic wire. Objective: This study sought to evaluate the effect of air-powder polishing cleaning on debris levels of self-ligating ceramic brackets at the end of orthodontic treatment, compared to the behavior of conventional brackets. Methods: Debris levels were evaluated in metal conventional orthodontic brackets (n = 42) and ceramic self-ligating brackets (n = 42) on canines and premolars, arranged in pairs. There were brackets with and without air-powder polishing. At the end of orthodontic treatment, a hemiarch served as control and the contralateral hemiarch underwent prophylaxis with air-powder polishing. Debris buildup in bracket slots was assessed through images, and Wilcoxon test was used to analyze the results. Results: The median debris levels were statistically lower in the conventional metal brackets compared to self-ligating ones (p = 0.02), regarding brackets not submitted to air-powder polishing. Polishing significantly reduced debris buildup to zero in both systems, without differences between groups. Conclusions: Ceramic self-ligating brackets have a higher debris buildup in comparison to conventional metal brackets in vivo, but prophylaxis with sodium bicarbonate jet was effective in reducing debris levels in self-ligating and also in conventional brackets. PMID:27901234

  2. Trends in motor neuron disease: association with latitude and air lead levels in Spain.

    PubMed

    Santurtún, Ana; Villar, Alejandro; Delgado-Alvarado, Manuel; Riancho, Javier

    2016-08-01

    Motor neuron diseases (MND) are a group of disorders characterized by motor neuron degeneration. Among them, amyotrophic lateral sclerosis (ALS) is by far the most common in adulthood. This paper assesses the trend and geographical pattern in MND incidence in Spain and the possible air lead levels effect on this pathology. To confirm this concept, we performed a retrospective analysis of the deaths due to MND in Spain during 2000 and 2013, determined the geographical differences, and explored the relationship between MND and the air levels of lead. Overall, between 2000 and 2013, 11,355 people died in Spain because of MND. Disease mortality significantly increased in recent years (2007-2013) when compared with the first time of the period. Spearman's rank correlation coefficient also showed a statistically significant positive trend (CC = 0.824, p = 0.0002). Among people over 65 years, mortality rates were higher in Northern provinces. Moreover, we found a significant association of MND mortality with higher air lead levels (CC = 0.457, p = 0.01). Our study confirms that MND mortality is increasing in Spain, with a significant latitude gradient, which suggests an important role of environmental exposures. This ecological study suggests that air lead levels may be implicated in ALS pathogenesis.

  3. Surveillance programme on dioxin levels in ambient air sites in Catalonia (Spain).

    PubMed

    Abad, Esteban; Caixach, Josep; Rivera, Josep; Gustems, Lluís; Massagué, Guillem; Puig, Oriol

    2002-11-01

    As part of a survey programme conducted by the Environment Department of the Autonomous Government of Catalonia in collaboration with the Spanish Council for Scientific Research (CSIC), dioxin concentrations in ambient air were measured in the four provinces of Catalonia (Spain). The study was also performed with the intention of providing data as a basis for future monitoring and evaluation of temporal trends in ambient air. Thus, 91 samples were collected in 25 different sites (rural, urban, suburban and industrial) between 1994 and 2000. The levels revealed a variable content of PCDDs/PCDFs depending both on the area and the contamination source. In particular, industrial areas presented levels ranging from 18 to 954 fg I-TEQ/m3. However, findings in urban and suburban sites varied between 13 and 357 fg I-TEQ/m3. As expected, the lowest levels were found in rural areas with levels between 5 and 125 fg I-TEQ/m3.

  4. Precipitation and Air Temperature Impact on Seasonal Variations of Groundwater Levels

    NASA Astrophysics Data System (ADS)

    Vitola, Ilva; Vircavs, Valdis; Abramenko, Kaspars; Lauva, Didzis; Veinbergs, Arturs

    2012-12-01

    The aim of this study is to clarify seasonal effects of precipitation and temperature on groundwater level changes in monitoring stations of the Latvia University of Agriculture - Mellupīte, Bērze and Auce. Groundwater regime and level fluctuations depend on climatic conditions such as precipitation intensity, evapotranspiration, surface runoff and drainage, as well as other hydrological factors. The relationship between precipitation, air temperature and groundwater level fluctuations could also lead and give different perspective of possible changes in groundwater quality. Using mathematical statistics and graphic-analytic methods it is concluded that autumn and winter precipitation has the dominant impact on groundwater level fluctuations, whereas spring and summer season fluctuations are more dependent on the air temperature.

  5. Development of a new Pb-free solder: Sn-Ag-Cu

    SciTech Connect

    Miller, Chad M.

    1995-02-10

    With the ever increasing awareness of the toxicity of Pb, significant pressure has been put on the electronics industry to get the Pb out of solder. This work pertains to the development and characterization of an alloy which is Pb-free, yet retains the proven positive qualities of current Sn-Pb solders while enhancing the shortcomings of Sn-Pb solder. The solder studied is the Sn-4.7Ag-1.7Cu wt% alloy. By utilizing a variety of experimental techniques the alloy was characterized. The alloy has a melting temperature of 217°C and exhibits eutectic melting behavior. The solder was examined by subjecting to different annealing schedules and examining the microstructural stability. The effect of cooling rate on the microstructure of the solder was also examined. Overall, this solder alloy shows great promise as a viable alternative to Pb-bearing solders and, as such, an application for a patent has been filed.

  6. Solder wetting behavior enhancement via laser-textured surface microcosmic topography

    NASA Astrophysics Data System (ADS)

    Chen, Haiyan; Peng, Jianke; Fu, Li; Wang, Xincheng; Xie, Yan

    2016-04-01

    In order to reduce or even replace the use of Sn-Pb solder in electronics industry, the laser-textured surface microstructures were used to enhance the wetting behavior of lead free solder during soldering. According to wetting theory and Sn-Ag-Cu lead free solder performance, we calculated and designed four microcosmic structures with the similar shape and different sizes to control the wetting behavior of lead free solder. The micro-structured surfaces with different dimensions were processed on copper plates by fiber femtosecond laser, and the effect of microstructures on wetting behavior was verified experimentally. The results showed that the wetting angle of Sn-Ag-Cu solder on the copper plate with microstructures decreased effectively compared with that on the smooth copper plate. The wetting angles had a sound fit with the theoretical values calculated by wetting model. The novel method provided a feasible route for adjusting the wetting behavior of solders and optimizing solders system.

  7. The Influence of Declining Air Lead Levels on Blood Lead–Air Lead Slope Factors in Children

    PubMed Central

    Richmond-Bryant, Jennifer; Davis, Allen; Cohen, Jonathan; Lu, Shou-En; Svendsgaard, David; Brown, James S.; Tuttle, Lauren; Hubbard, Heidi; Rice, Joann; Kirrane, Ellen; Vinikoor-Imler, Lisa C.; Kotchmar, Dennis; Hines, Erin P.; Ross, Mary

    2014-01-01

    Background: It is difficult to discern the proportion of blood lead (PbB) attributable to ambient air lead (PbA), given the multitude of lead (Pb) sources and pathways of exposure. The PbB–PbA relationship has previously been evaluated across populations. This relationship was a central consideration in the 2008 review of the Pb national ambient air quality standards. Objectives: The objectives of this study were to evaluate the relationship between PbB and PbA concentrations among children nationwide for recent years and to compare the relationship with those obtained from other studies in the literature. Methods: We merged participant-level data for PbB from the National Health and Nutrition Examination Survey (NHANES) III (1988–1994) and NHANES 9908 (1999–2008) with PbA data from the U.S. Environmental Protection Agency. We applied mixed-effects models, and we computed slope factor, d[PbB]/d[PbA] or the change in PbB per unit change in PbA, from the model results to assess the relationship between PbB and PbA. Results: Comparing the NHANES regression results with those from the literature shows that slope factor increased with decreasing PbA among children 0–11 years of age. Conclusion: These findings suggest that a larger relative public health benefit may be derived among children from decreases in PbA at low PbA exposures. Simultaneous declines in Pb from other sources, changes in PbA sampling uncertainties over time largely related to changes in the size distribution of Pb-bearing particulate matter, and limitations regarding sampling size and exposure error may contribute to the variability in slope factor observed across peer-reviewed studies. Citation: Richmond-Bryant J, Meng Q, Davis A, Cohen J, Lu SE, Svendsgaard D, Brown JS, Tuttle L, Hubbard H, Rice J, Kirrane E, Vinikoor-Imler LC, Kotchmar D, Hines EP, Ross M. 2014. The Influence of declining air lead levels on blood lead–air lead slope factors in children. Environ Health Perspect 122:754

  8. Microbial leaching of waste solder for recovery of metal.

    PubMed

    Hocheng, H; Hong, T; Jadhav, U

    2014-05-01

    This study proposes an environment-friendly bioleaching process for recovery of metals from solders. Tin-copper (Sn-Cu), tin-copper-silver (Sn-Cu-Ag), and tin-lead (Sn-Pb) solders were used in the current study. The culture supernatant of Aspergillus niger removed metals faster than the culture supernatant of Acidithiobacillus ferrooxidans. Also, the metal removal by A. niger culture supernatant is faster for Sn-Cu-Ag solder as compared to other solder types. The effect of various process parameters such as shaking speed, temperature, volume of culture supernatant, and increased solder weight on bioleaching of metals was studied. About 99 (±1.75) % metal dissolution was achieved in 60 h, at 200-rpm shaking speed, 30 °C temperature, and by using 100-ml A. niger culture supernatant. An optimum solder weight for bioleaching was found to be 5 g/l. Addition of sodium hydroxide (NaOH) and sodium chloride (NaCl) in the bioleached solution from Sn-Cu-Ag precipitated tin (85 ± 0.35 %) and silver (80 ± 0.08 %), respectively. Passing of hydrogen sulfide (H2S) gas at pH 8.1 selectively precipitated lead (57.18 ± 0.13 %) from the Sn-Pb bioleached solution. The proposed innovative bioleaching process provides an alternative technology for recycling waste solders to conserve resources and protect environment.

  9. Benzene levels in ambient air and breath of smokers and nonsmokers in urban and pristine environments

    SciTech Connect

    Wester, R.C.; Maibach, H.I.; Gruenke, L.D.; Craig, J.C.

    1986-01-01

    Benzene levels in human breath and in ambient air were compared in the urban area of San Francisco (SF) and in a more remote coastal pristine setting of Stinson Beach, Calif. (SB). Benzene analysis was done by gas chromatography-mass spectroscopy (GC-MS). Ambient benzene levels were sevenfold higher in SF (2.6 +/- 1.3 ppb, n = 25) than SB (0.38 +/- 0.39 ppb, n = 21). In SF, benzene in smokers' breath (6.8 +/- 3.0 ppb) was greater than in nonsmokers' breath (2.5 +/- 0.8 ppb) and smokers' ambient air (3.3 +/- 0.8 ppb). In SB the same pattern was observed: benzene in smokers' breath was higher than in nonsmokers' breath and ambient air. Benzene in SF nonsmokers' breath was greater than in SB nonsmokers' breath. Marijuana-only smokers had benzene breath levels between those of smokers and nonsmokers. There was little correlation between benzene in breath and number of cigarettes smoked, or with other benzene exposures such as diet. Of special interest was the finding that benzene in breath of SF nonsmokers (2.5 +/- 0.8 ppb) was greater than that in nonsmokers ambient air (1.4 +/- 0.1 ppb). The same was true in SB, where benzene in nonsmokers breath was greater than ambient air (1.8 +/- 0.2 ppb versus 1.0 +/- 0.1 ppb on d 1 and 1.3 +/- 0.3 ppb versus 0.23 +/- 0.18 ppb on d 2). This suggests an additional source of benzene other than outdoor ambient air.

  10. Effect of Ag, Ni and Bi Additions on Solderability of Lead-Free Solders

    NASA Astrophysics Data System (ADS)

    Nobari, Amir Hossein; Maalekian, Mehran; Seelig, Karl; Pekguleryuz, Mihriban

    2017-01-01

    In this study, the effects of Ag, Ni and Bi additions on the melting, solidification, fluidity and wetting behavior of Sn-0.7Cu base solder alloy are studied. The addition of a small amount of Ni reduces the undercooling and improves the feeding distance (fluidity length); however, Ni does not improve the wetting and the spreading performance. The effect of Ni on the fluidity length of Ag-containing Sn-0.7Cu (SAC alloy) is marginal. Bi and Ag both improve wetting performance and also lower the melting temperature; however, they do not improve the fluidity; instead, they reduce the maximum length of fluidity.

  11. On evaluating compliance with air pollution levels 'not to be exceeded more than once per year'

    NASA Technical Reports Server (NTRS)

    Neustadter, H. E.; Sidik, S. M.

    1974-01-01

    The point of view taken is that the Environmental Protection Agency (EPA) Air Quality Standards (AQS) represent conditions which must be made to exist in the ambient environment. The statistical techniques developed should serve as tools for measuring the closeness to achieving the desired quality of air. It is shown that the sampling frequency recommended by EPA is inadequate to meet these objectives when the standard is expressed as a level not to be exceeded more than once per year and sampling frequency is once every three days or less frequent.

  12. 77 FR 66595 - U.S. Air Force Broadcast of Consent Order, and Determination of Interest Level for a United...

    Federal Register 2010, 2011, 2012, 2013, 2014

    2012-11-06

    ... Under Secretary of the Air Force (Space). ACTION: Publicize Consent Order, and Determine Level of... Deputy Under Secretary of the Air Force (Space), as the Compliance Officer under the Federal Trade... current Compliance Officer is the Deputy Under Secretary of the Air Force (Space), Mr. Richard...

  13. Influence of air exposure and storage condition on serum ionized magnesium level.

    PubMed

    Baek, E J; Park, I K

    2005-01-01

    The aim of this study was to evaluate whether reporting serum level of ionized magnesium (iMg) is appropriate when affected by various conditions such as exposure to air and delayed measurement. Serum levels of pH, iMg and normalized magnesium (nMg, normalized or adjusted concentration of iMg to pH 7.40) from 28 inpatients were measured at intervals of 3 min after exposing the samples to air at room temperature. Serum from 30 inpatients was stored in closed tubes at 4 degrees C and -20 degrees C and iMg and nMg levels were measured after 2 days. It was found that serum iMg and nMg concentrations exposed to air were decreased by 0.0023 mmol/l and 0.0001 mmol/l per minute, respectively. nMg did not display any significant changes compared with iMg at 0 min, whereas iMg showed significant changes, which exceeded between-day precision. For the stored serum, only iMg of serum at -20 degrees C showed no statistically significant changes (p = 0.169). It is concluded that to report the result as iMg, the sample should be kept anaerobically, and if exposed to air, the result should be reported as nMg. For storage, iMg of serum kept anaerobically at -20 degrees C is reliable.

  14. Making air quality indices comparable--assessment of 10 years of air pollutant levels in western Europe.

    PubMed

    Lokys, Hanna Leona; Junk, Jürgen; Krein, Andreas

    2015-01-01

    To address the incomparability of the large number of existing air quality indices, we propose a new normalization method that is suited to directly compare air quality indices based on the common European World Health Organization (WHO) air quality guidelines for NO2, O3, and PM10. Using this method, we compared three air quality indices based on the European guidelines, related them to another air quality index based on the relative risk concept, and used them to assess the air quality and its trends in northwest central Europe. The average air quality in the area of investigation is below the recommended European guidelines. The majority of index values exceeding this threshold are caused by PM10, which is also, in most cases, responsible for the degrading trends in air quality. Eleven out of 29 stations tested showed significant trends, of which eight indicated trends towards better air quality.

  15. 30 CFR 77.1916 - Welding, cutting, and soldering; fire protection.

    Code of Federal Regulations, 2012 CFR

    2012-07-01

    ... 30 Mineral Resources 1 2012-07-01 2012-07-01 false Welding, cutting, and soldering; fire... OF UNDERGROUND COAL MINES Slope and Shaft Sinking § 77.1916 Welding, cutting, and soldering; fire protection. (a) One portable fire extinguisher shall be provided where welding, cutting, or soldering...

  16. 30 CFR 75.1106 - Welding, cutting, or soldering with arc or flame underground.

    Code of Federal Regulations, 2013 CFR

    2013-07-01

    ... 30 Mineral Resources 1 2013-07-01 2013-07-01 false Welding, cutting, or soldering with arc or... Protection § 75.1106 Welding, cutting, or soldering with arc or flame underground. All welding, cutting, or... conducted in fireproof enclosures. Welding, cutting, or soldering with arc or flame in other than...

  17. 30 CFR 77.1916 - Welding, cutting, and soldering; fire protection.

    Code of Federal Regulations, 2014 CFR

    2014-07-01

    ... 30 Mineral Resources 1 2014-07-01 2014-07-01 false Welding, cutting, and soldering; fire... OF UNDERGROUND COAL MINES Slope and Shaft Sinking § 77.1916 Welding, cutting, and soldering; fire protection. (a) One portable fire extinguisher shall be provided where welding, cutting, or soldering...

  18. 30 CFR 77.1916 - Welding, cutting, and soldering; fire protection.

    Code of Federal Regulations, 2013 CFR

    2013-07-01

    ... 30 Mineral Resources 1 2013-07-01 2013-07-01 false Welding, cutting, and soldering; fire... OF UNDERGROUND COAL MINES Slope and Shaft Sinking § 77.1916 Welding, cutting, and soldering; fire protection. (a) One portable fire extinguisher shall be provided where welding, cutting, or soldering...

  19. 30 CFR 77.1112 - Welding, cutting, or soldering with arc or flame; safeguards.

    Code of Federal Regulations, 2013 CFR

    2013-07-01

    ... 30 Mineral Resources 1 2013-07-01 2013-07-01 false Welding, cutting, or soldering with arc or... WORK AREAS OF UNDERGROUND COAL MINES Fire Protection § 77.1112 Welding, cutting, or soldering with arc or flame; safeguards. (a) When welding, cutting, or soldering with arc or flame near...

  20. 30 CFR 75.1106 - Welding, cutting, or soldering with arc or flame underground.

    Code of Federal Regulations, 2012 CFR

    2012-07-01

    ... 30 Mineral Resources 1 2012-07-01 2012-07-01 false Welding, cutting, or soldering with arc or... Protection § 75.1106 Welding, cutting, or soldering with arc or flame underground. All welding, cutting, or... conducted in fireproof enclosures. Welding, cutting, or soldering with arc or flame in other than...

  1. 30 CFR 77.1112 - Welding, cutting, or soldering with arc or flame; safeguards.

    Code of Federal Regulations, 2014 CFR

    2014-07-01

    ... 30 Mineral Resources 1 2014-07-01 2014-07-01 false Welding, cutting, or soldering with arc or... WORK AREAS OF UNDERGROUND COAL MINES Fire Protection § 77.1112 Welding, cutting, or soldering with arc or flame; safeguards. (a) When welding, cutting, or soldering with arc or flame near...

  2. 30 CFR 77.1112 - Welding, cutting, or soldering with arc or flame; safeguards.

    Code of Federal Regulations, 2012 CFR

    2012-07-01

    ... 30 Mineral Resources 1 2012-07-01 2012-07-01 false Welding, cutting, or soldering with arc or... WORK AREAS OF UNDERGROUND COAL MINES Fire Protection § 77.1112 Welding, cutting, or soldering with arc or flame; safeguards. (a) When welding, cutting, or soldering with arc or flame near...

  3. 30 CFR 75.1106 - Welding, cutting, or soldering with arc or flame underground.

    Code of Federal Regulations, 2014 CFR

    2014-07-01

    ... 30 Mineral Resources 1 2014-07-01 2014-07-01 false Welding, cutting, or soldering with arc or... Protection § 75.1106 Welding, cutting, or soldering with arc or flame underground. All welding, cutting, or... conducted in fireproof enclosures. Welding, cutting, or soldering with arc or flame in other than...

  4. 30 CFR 75.1106 - Welding, cutting, or soldering with arc or flame underground.

    Code of Federal Regulations, 2011 CFR

    2011-07-01

    ... 30 Mineral Resources 1 2011-07-01 2011-07-01 false Welding, cutting, or soldering with arc or... Protection § 75.1106 Welding, cutting, or soldering with arc or flame underground. All welding, cutting, or... conducted in fireproof enclosures. Welding, cutting, or soldering with arc or flame in other than...

  5. 30 CFR 77.1112 - Welding, cutting, or soldering with arc or flame; safeguards.

    Code of Federal Regulations, 2011 CFR

    2011-07-01

    ... 30 Mineral Resources 1 2011-07-01 2011-07-01 false Welding, cutting, or soldering with arc or... WORK AREAS OF UNDERGROUND COAL MINES Fire Protection § 77.1112 Welding, cutting, or soldering with arc or flame; safeguards. (a) When welding, cutting, or soldering with arc or flame near...

  6. 30 CFR 75.1106 - Welding, cutting, or soldering with arc or flame underground.

    Code of Federal Regulations, 2010 CFR

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, or soldering with arc or... Protection § 75.1106 Welding, cutting, or soldering with arc or flame underground. All welding, cutting, or... conducted in fireproof enclosures. Welding, cutting, or soldering with arc or flame in other than...

  7. 30 CFR 77.1916 - Welding, cutting, and soldering; fire protection.

    Code of Federal Regulations, 2010 CFR

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, and soldering; fire... OF UNDERGROUND COAL MINES Slope and Shaft Sinking § 77.1916 Welding, cutting, and soldering; fire protection. (a) One portable fire extinguisher shall be provided where welding, cutting, or soldering...

  8. 30 CFR 77.1112 - Welding, cutting, or soldering with arc or flame; safeguards.

    Code of Federal Regulations, 2010 CFR

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, or soldering with arc or... WORK AREAS OF UNDERGROUND COAL MINES Fire Protection § 77.1112 Welding, cutting, or soldering with arc or flame; safeguards. (a) When welding, cutting, or soldering with arc or flame near...

  9. Methylene blue solder re-absorption in microvascular anastomoses

    NASA Astrophysics Data System (ADS)

    Birch, Jeremy F.; Hepplewhite, J.; Frier, Malcolm; Bell, Peter R. F.

    2003-06-01

    Soldered vascular anastomoses have been reported using several chromophores but little is known of the optimal conditions for microvascular anastomosis. There are some indications of the optimal protein contents of a solder, and the effects of methylene blue on anastomotic strength. The effects of varying laser power density in vivo have also been described, showing a high rate of thrombosis with laser power over 22.9Wcm-2. However no evidence exists to describe how long the solder remains at the site of the anastomosis. Oz et al reported that the fibrin used in their study had been almost completely removed by 90 days but without objective evidence of solder removal. In order to address the issue of solder re-absorption from the site of an anastomosis we used radio-labelled albumin (I-125) incorporated into methylene blue based solder. This was investigated in both the situation of the patent and thrombosed anastomosis with anastomoses formed at high and low power. Iodine-125 (half life: 60.2 days) was covalently bonded to porcine albumin and mixed with the solder solution. Radio-iodine has been used over many years to determine protein turnover using either I-125 or I-131. Iodine-125 labelled human albumin is regularly used as a radiopharmaceutical tool for the determination of plasma volume. Radio-iodine has the advantages of not affecting protein metabolism and the label is rapidly excreted after metabolic breakdown. Labelling with chromium (Cr-51) causes protein denaturation and is lost from the protein with time. Labelled albumin has been reported in human studies over a 21-day period, with similar results reported by Matthews. Most significantly McFarlane reported a different rate of catabolism of I-131 and I-125 over a 22-day period. The conclusion from this is that the rate of iodine clearance is a good indicator of protein catabolism. In parallel with the surgery a series of blank standards were prepared with a known mass of solder to correct for isotope

  10. An evaluation of the spring finger solder joints on SA1358-10 and SA2052-4 connector assemblies (MC3617,W87).

    SciTech Connect

    Kilgo, Alice C.; Vianco, Paul Thomas; Hlava, Paul Frank; Zender, Gary L.

    2006-08-01

    remelting of the spring finger solder joint. The Cd (Cr) layer did not show signs of spalling. These results suggested that, due to the size of the SA1358-10 connector, any of the former or current soldering processes used to attach the EMR adapter ring and/or EMR shell to the connector shell, requires a level of heat energy that will always result in the remelting of the spring finger solder joint attached with either the Sn-Ag or the Sn-Sb alloy. Lastly, it was construed that the induction soldering process, which is used to attach the EMR adapter ring onto the shell, was more likely to have caused the remelting event rather than the more localized heat source of the hand soldering iron used to attach the EMR shell to the adapter ring.

  11. Microstructural evolution of eutectic gold-tin solder joints

    NASA Astrophysics Data System (ADS)

    Song, Ho Geon

    Current trends toward miniaturization and the use of lead (Pb)-free solders in electronic packaging present new problems in the reliability of solder joints. This study was performed in order to understand the microstructure and microstructural evolution of small volumes of nominally eutectic Au-Sn solder joints (80Au-20Sn by weight), which gives insight into properties and reliability. The study particularly concentrated on the effects that the joint size and the type of substrate metallization have on both the bulk and interface microstructures of the joints. The systems studied were eutectic Au-Sn on Cu and Cu/electroless Ni/Au and for each system, two sets of sample geometries were used. Eutectic Au-Sn solder joints on Cu have microstructures that are very coarse on the scale of the joint, where the microstructure is strongly affected by the amount of Cu dissolution during reflow process. During aging, steady diffusion of Cu leads to the growth of Cu-rich interfacial intermetallic layers, significant consumption of substrate Cu, and formation of Kirkendall pores along the interface. Thermal cycling of the joints caused decomposition of the thick zeta(Cu)-phase into a fine-grained multiphase microstructure. The microstructures of eutectic Au-Sn solder joints on Cu/electroless Ni/Au are also very coarse due to the dissolution of Au used as a protective layer during soldering. Electroless Ni is shown to effectively act as a diffusion barrier for Cu. The electroless Ni near the interface evolves into a complicated structure due to the interfacial reaction. The solubility characteristics and diffusional behavior of substrate metals into eutectic Au-Sn solder determines the detailed microstructure and microstructural evolution of the ultrafine eutectic Au-Sn joints. Two important things to be noted from the results are as follows: First, the overall microstructures of these joints are very coarse with respect to the size of joint, and hence the properties of the

  12. A proposed methodology for the assessment of arsenic, nickel, cadmium and lead levels in ambient air.

    PubMed

    Santos, Germán; Fernández-Olmo, Ignacio

    2016-06-01

    Air quality assessment, required by the European Union (EU) Air Quality Directive, Directive 2008/50/EC, is part of the functions attributed to Environmental Management authorities. Based on the cost and time consumption associated with the experimental works required for the air quality assessment in relation to the EU-regulated metal and metalloids, other methods such as modelling or objective estimation arise as competitive alternatives when, in accordance with the Air Quality Directive, the levels of pollutants permit their use at a specific location. This work investigates the possibility of using statistical models based on Partial Least Squares Regression (PLSR) and Artificial Neural Networks (ANNs) to estimate the levels of arsenic (As), cadmium (Cd), nickel (Ni) and lead (Pb) in ambient air and their application for policy purposes. A methodology comprising the main steps that should be taken into consideration to prepare the input database, develop the model and evaluate their performance is proposed and applied to a case of study in Santander (Spain). It was observed that even though these approaches present some difficulties in estimating the individual sample concentrations, having an equivalent performance they can be considered valid for the estimation of the mean values - those to be compared with the limit/target values - fulfilling the uncertainty requirements in the context of the Air Quality Directive. Additionally, the influence of the consideration of input variables related to atmospheric stability on the performance of the studied statistical models has been determined. Although the consideration of these variables as additional inputs had no effect on As and Cd models, they did yield an improvement for Pb and Ni, especially with regard to ANN models.

  13. Experimental Methods in Reduced-gravity Soldering Research

    NASA Technical Reports Server (NTRS)

    Pettegrew, Richard D.; Struk, Peter M.; Watson, John K.; Haylett, Daniel R.

    2002-01-01

    The National Center for Microgravity Research, NASA Glenn Research Center, and NASA Johnson Space Center are conducting an experimental program to explore the influence of reduced gravity environments on the soldering process. An improved understanding of the effects of the acceleration environment is important to application of soldering during current and future human space missions. Solder joint characteristics that are being considered include solder fillet geometry, porosity, and microstructural features. Both through-hole and surface mounted devices are being investigated. This paper focuses on the experimental methodology employed in this project and the results of macroscopic sample examination. The specific soldering process, sample configurations, materials, and equipment were selected to be consistent with those currently on-orbit. Other apparatus was incorporated to meet requirements imposed by operation onboard NASA's KC-135 research aircraft and instrumentation was provided to monitor both the atmospheric and acceleration environments. The contingent of test operators was selected to include both highly skilled technicians and less skilled individuals to provide a population cross-section that would be representative of the skill mix that might be encountered in space mission crews.

  14. Solder creep-fatigue interactions with flexible leaded parts

    NASA Technical Reports Server (NTRS)

    Ross, R. G., Jr.; Wen, L. C.; Mon, G. R.; Jetter, E.

    1992-01-01

    With flexible leaded parts, the solder-joint failure process involves a complex interplay of creep and fatigue mechanisms. To better understand the role of creep in typical multi-hour cyclic loading conditions, a specialized non-linear finite-element creep simulation computer program has been formulated. The numerical algorithm includes the complete part-lead-solder-PWB system, accounting for strain-rate dependence of creep on applied stress and temperature, and the role of the part-lead dimensions and flexibility that determine the total creep deflection (solder strain range) during stress relaxation. The computer program has been used to explore the effects of various solder creep-fatigue parameters such as lead height and stiffness, thermal-cycle test profile, and part/board differential thermal expansion properties. One of the most interesting findings is the strong presence of unidirectional creep-ratcheting that occurs during thermal cycling due to temperature dominated strain-rate effects. To corroborate the solder fatigue model predictions, a number of carefully controlled thermal-cycle tests have been conducted using special bimetallic test boards.

  15. Background information on sources of low-level radionuclide emissions to air

    SciTech Connect

    Corbit, C.D.; Herrington, W.N.; Higby, D.P.; Stout, L.A.; Corley, J.P.

    1983-09-01

    This report provides a general description and reported emissions for eight low-level radioactive source categories, including facilties that are licensed by the Nuclear Regulatory Commission (NRC) and Agreement States, and non-Department of Energy (DOE) federal facilities. The eight categories of low-level radioactive source facilities covered by this report are: research and test reactors, accelerators, the radiopharmaceutical industry, source manufacturers, medical facilities, laboratories, naval shipyards, and low-level commercial waste disposal sites. Under each category five elements are addressed: a general description, a facility and process description, the emission control systems, a site description, and the radionuclides released to air (from routine operations).

  16. Techno-Economic Analysis of Indian Draft Standard Levels for RoomAir Conditioners

    SciTech Connect

    McNeil, Michael A.; Iyer, Maithili

    2007-03-01

    The Indian Bureau of Energy Efficiency (BEE) finalized its first set of efficiency standards and labels for room air conditioners in July of 2006. These regulations followed soon after the publication of levels for frost-free refrigerators in the same year. As in the case of refrigerators, the air conditioner program introduces Minimum Efficiency Performance Standards (MEPS) and comparative labels simultaneously, with levels for one to five stars. Also like the refrigerator program, BEE defined several successive program phases of increasing stringency. In support of BEE's refrigerator program, Lawrence Berkeley National Laboratory (LBNL) produced an analysis of national impacts of standards in collaboration with the Collaborative Labeling and Standards Program (CLASP). That analysis drew on LBNL's experience with standards programs in the United States, as well as many other countries. Subsequently, as part of the process for setting optimal levels for air conditioner regulations, CLASP commissioned LBNL to provide support to BEE in the form of a techno-economic evaluation of air conditioner efficiency technologies. This report describes the methodology and results of this techno-economic evaluation. The analysis consists of three components: (1) Cost effectiveness to consumers of efficiency technologies relative to current baseline. (2) Impacts on the current market from efficiency regulations. (3) National energy and financial impacts. The analysis relied on detailed and up-to-date technical data made available by BEE and industry representatives. Technical parameters were used in conjunction with knowledge about air conditioner use patterns in the residential and commercial sectors, and prevailing marginal electricity prices, in order to give an estimate of per-unit financial impacts. In addition, the overall impact of the program was evaluated by combining unit savings with market forecasts in order to yield national impacts. LBNL presented preliminary results

  17. Nano copper based high temperature solder alternative

    NASA Astrophysics Data System (ADS)

    Sharma, Akshay

    Nano Cu an alternative to high temperature solder is developed by the Advance Technological Center at the Lockheed Martin Corporation. A printable paste of Cu nano particles is developed with an ability to fuse at 200°C in reflow oven. After reflow the deposited material has nano crystalline and nano porous structure which affects its properties. Accelerated test are performed on nano Cu deposition having nano porous and nano crystalline structure for assessment and prediction of reliability. Nano Cu assemblies with different bond layer thickness are sheared to calculate the strength of the material and are correlated with the porous and crystalline structure of nano Cu. Thermal and isothermal fatigue test are performed on nano Cu to see the dependency of life on stress and further surface of failed assemblies were observed to determine the type of failure. Creep test at RT are performed to find the type of creep mechanism and how they are affected when subjected to high temperature. TEM, SEM, X-ray, C-SAM and optical microscopy is done on the nano Cu sample for structure and surface analysis.

  18. Creep characterization of solder bumps using nanoindentation

    NASA Astrophysics Data System (ADS)

    Du, Yingjie; Liu, Xiao Hu; Fu, Boshen; Shaw, Thomas M.; Lu, Minhua; Wassick, Thomas A.; Bonilla, Griselda; Lu, Hongbing

    2016-10-01

    Current nanoindentation techniques for the measurement of creep properties are applicable to viscoplastic materials with negligible elastic deformations. A new technique for characterization of creep behavior is needed for situations where the elastic deformation plays a significant role. In this paper, the effect of elastic deformation on the determination of creep parameters using nanoindentation with a self-similar nanoindenter tip is evaluated using finite element analysis (FEA). It is found that the creep exponent measured from nanoindentation without taking into account of the contribution of elastic deformation tends to be higher than the actual value. An effective correction method is developed to consider the elastic deformation in the calculation of creep parameters. FEA shows that this method provides accurate creep exponent. The creep parameters, namely the creep exponent and activation energy, were measured for three types of reflowed solder bumps using the nanoindentation method. The measured parameters were verified using FEA. The results show that the new correction approach allows extraction of creep parameters with precision from nanoindentation data.

  19. Combining regression analysis and air quality modelling to predict benzene concentration levels

    NASA Astrophysics Data System (ADS)

    Vlachokostas, Ch.; Achillas, Ch.; Chourdakis, E.; Moussiopoulos, N.

    2011-05-01

    State of the art epidemiological research has found consistent associations between traffic-related air pollution and various outcomes, such as respiratory symptoms and premature mortality. However, many urban areas are characterised by the absence of the necessary monitoring infrastructure, especially for benzene (C 6H 6), which is a known human carcinogen. The use of environmental statistics combined with air quality modelling can be of vital importance in order to assess air quality levels of traffic-related pollutants in an urban area in the case where there are no available measurements. This paper aims at developing and presenting a reliable approach, in order to forecast C 6H 6 levels in urban environments, demonstrated for Thessaloniki, Greece. Multiple stepwise regression analysis is used and a strong statistical relationship is detected between C 6H 6 and CO. The adopted regression model is validated in order to depict its applicability and representativeness. The presented results demonstrate that the adopted approach is capable of capturing C 6H 6 concentration trends and should be considered as complementary to air quality monitoring.

  20. Effects of Solder Temperature on Pin Through-Hole during Wave Soldering: Thermal-Fluid Structure Interaction Analysis

    PubMed Central

    Abdul Aziz, M. S.; Abdullah, M. Z.; Khor, C. Y.

    2014-01-01

    An efficient simulation technique was proposed to examine the thermal-fluid structure interaction in the effects of solder temperature on pin through-hole during wave soldering. This study investigated the capillary flow behavior as well as the displacement, temperature distribution, and von Mises stress of a pin passed through a solder material. A single pin through-hole connector mounted on a printed circuit board (PCB) was simulated using a 3D model solved by FLUENT. The ABAQUS solver was employed to analyze the pin structure at solder temperatures of 456.15 K (183°C) < T < 643.15 K (370°C). Both solvers were coupled by the real time coupling software and mesh-based parallel code coupling interface during analysis. In addition, an experiment was conducted to measure the temperature difference (ΔT) between the top and the bottom of the pin. Analysis results showed that an increase in temperature increased the structural displacement and the von Mises stress. Filling time exhibited a quadratic relationship to the increment of temperature. The deformation of pin showed a linear correlation to the temperature. The ΔT obtained from the simulation and the experimental method were validated. This study elucidates and clearly illustrates wave soldering for engineers in the PCB assembly industry. PMID:25225638

  1. Isothermal fatigue of low tin lead based solder

    NASA Astrophysics Data System (ADS)

    Vayman, Semyon; Fine, Morris E.; Jeannotte, Dexter A.

    1988-04-01

    Low tin lead based solder fails by intergranular and/or transgranular modes depending upon experimental conditions. At low frequency and in tests with hold times separation of grains is the main mode of fracture. In the 5 to 100 °C temperature range at high frequency (> 10-2 Hz) and at high total strain range (0.75 pct) the failure mode is mixed transgranular-intergranular; at a low total strain range (0.3 pct) the mode of failure is intergranular. Change in failure mode leads to a bend in the Coffin-Manson plot. Tensile hold time and combined tensile and compressive hold times are found to reduce dramatically the fatigue cycles to failure of this solder. A simple mathematical relation between the fatigue life of the solder and ramp time, tensile, and compressive hold times is developed.

  2. Corrosion Issues in Solder Joint Design and Service

    SciTech Connect

    VIANCO,PAUL T.

    1999-11-24

    Corrosion is an important consideration in the design of a solder joint. It must be addressed with respect to the service environment or, as in the case of soldered conduit, as the nature of the medium being transported within piping or tubing. Galvanic-assisted corrosion is of particular concern, given the fact that solder joints are comprised of different metals or alloy compositions that are in contact with one-another. The (thermodynamic) potential for corrosion to take place in a particular environment requires the availability of the galvanic series for those conditions and which includes the metals or alloys in question. However, the corrosion kinetics, which actually determine the rate of material loss under the specified service conditions, are only available through laboratory evaluations or field data that are found in the existing literature or must be obtained by in-house testing.

  3. Development of alternatives to lead-bearing solders

    SciTech Connect

    Vianco, P.T.

    1993-07-01

    Soldering technology, using tin-lead alloys has had a significant role in the packaging of highly functional, low cost electronic devices. The elimination of lead from all manufactured products, whether through legislation or tax incentives, will impact the electronics community which uses lead-containing solders. In response to these proposed measures, the National Center for Manufacturing Sciences has established a multi-year program involving participants from industry, academia, and the national laboratories with the objective to identify potential replacements for lead-bearing solders. Selection of candidate alloys is based upon the analysis of materials properties, manufacturability, modeling codes for reliability prediction, as well as toxicological properties and resource availability, data developed in the program.

  4. Optical Path Difference Evaluation of Laser-Soldered Optical Components

    NASA Astrophysics Data System (ADS)

    Burkhardt, T.; Hornaff, M.; Burkhardt, D.; Beckert, E.

    2015-12-01

    We present Solderjet Bumping, a laser-based soldering process, as an all inorganic joining technique for optical materials and mechanical support structures. The adhesive-free bonding process enables the low-stress assembly of fragile and sensitive components for advanced optical systems. Our process addresses high demanding applications, e.g. under high energetic radiation (short wavelengths of 280 nm and below and/or high intensities), for vacuum operation, and for harsh environmental conditions. Laser-based soldering allows the low stress assembly of aligned sub-cells as key components for high quality optical systems. The evaluation of the optical path difference in fused silica and the radiation resistant LAK9G15 glass components after soldering and environmental testing shows the potential of the technique.

  5. Spatially-varying surface roughness and ground-level air quality in an operational dispersion model.

    PubMed

    Barnes, M J; Brade, T K; MacKenzie, A R; Whyatt, J D; Carruthers, D J; Stocker, J; Cai, X; Hewitt, C N

    2014-02-01

    Urban form controls the overall aerodynamic roughness of a city, and hence plays a significant role in how air flow interacts with the urban landscape. This paper reports improved model performance resulting from the introduction of variable surface roughness in the operational air-quality model ADMS-Urban (v3.1). We then assess to what extent pollutant concentrations can be reduced solely through local reductions in roughness. The model results suggest that reducing surface roughness in a city centre can increase ground-level pollutant concentrations, both locally in the area of reduced roughness and downwind of that area. The unexpected simulation of increased ground-level pollutant concentrations implies that this type of modelling should be used with caution for urban planning and design studies looking at ventilation of pollution. We expect the results from this study to be relevant for all atmospheric dispersion models with urban-surface parameterisations based on roughness.

  6. Air pollution critical levels in central México protected natural areas

    NASA Astrophysics Data System (ADS)

    Ruiz Suarez, L.; Andraca Ayala, G.; Mar Morales, B.; Garcia-reynoso, J.; Torres-JArdon, R.

    2013-05-01

    All the Natural Protected Areas (NPA) within the Central Mexico City Belt comprising five metropolitan areas including MCMA are under strong impact from air pollution. Ozone, nitrogen oxides and sulfur dioxide exceed critical levels for several types of vegetation. In this work we show the critical level maps for ozone, nitrogen oxides and sulfur dioxide for Sierra of Chichinautzin, the mountain that acts as the physical barrier to air pollution dispersion south of Mexico City Metropolitan Area, what makes of it a receptor area to MCMA pollution. Maps were made combining model outputs from WRF-Chem and passive samplers. We also describe a proposal to extend the observation network to all natural protected areas within the Central Mexico City Belt.

  7. Process characterization and control of hand-soldered printed wiring assemblies

    SciTech Connect

    Cheray, D.L.; Mandl, R.G.

    1993-09-01

    A designed experiment was conducted to characterize the hand soldering process parameters for manufacturing printed wiring assemblies (PWAs). Component tinning was identified as the most important parameter in hand soldering. After tinning, the soldering iron tip temperature of 700{degrees}F and the choice of operators influence solder joint quality more than any other parameters. Cleaning and flux/flux core have little impact on the quality of the solder joint. The need for component cleaning prior to assembly must be evaluated for each component.

  8. 5 CFR 842.811 - Deposits for second-level supervisory air traffic controller service performed before February 10...

    Code of Federal Regulations, 2014 CFR

    2014-01-01

    ... 5 Administrative Personnel 2 2014-01-01 2014-01-01 false Deposits for second-level supervisory air traffic controller service performed before February 10, 2004. 842.811 Section 842.811 Administrative... Regulations Pertaining to Noncodified Statutes § 842.811 Deposits for second-level supervisory air...

  9. 5 CFR 842.811 - Deposits for second-level supervisory air traffic controller service performed before February 10...

    Code of Federal Regulations, 2012 CFR

    2012-01-01

    ... 5 Administrative Personnel 2 2012-01-01 2012-01-01 false Deposits for second-level supervisory air traffic controller service performed before February 10, 2004. 842.811 Section 842.811 Administrative... Regulations Pertaining to Noncodified Statutes § 842.811 Deposits for second-level supervisory air...

  10. 5 CFR 842.811 - Deposits for second-level supervisory air traffic controller service performed before February 10...

    Code of Federal Regulations, 2013 CFR

    2013-01-01

    ... 5 Administrative Personnel 2 2013-01-01 2013-01-01 false Deposits for second-level supervisory air traffic controller service performed before February 10, 2004. 842.811 Section 842.811 Administrative... Regulations Pertaining to Noncodified Statutes § 842.811 Deposits for second-level supervisory air...

  11. 5 CFR 842.811 - Deposits for second-level supervisory air traffic controller service performed before February 10...

    Code of Federal Regulations, 2011 CFR

    2011-01-01

    ... 5 Administrative Personnel 2 2011-01-01 2011-01-01 false Deposits for second-level supervisory air traffic controller service performed before February 10, 2004. 842.811 Section 842.811 Administrative... Regulations Pertaining to Noncodified Statutes § 842.811 Deposits for second-level supervisory air...

  12. 5 CFR 842.811 - Deposits for second-level supervisory air traffic controller service performed before February 10...

    Code of Federal Regulations, 2010 CFR

    2010-01-01

    ... 5 Administrative Personnel 2 2010-01-01 2010-01-01 false Deposits for second-level supervisory air traffic controller service performed before February 10, 2004. 842.811 Section 842.811 Administrative... Regulations Pertaining to Noncodified Statutes § 842.811 Deposits for second-level supervisory air...

  13. Impact of natural gas extraction on Pah levels in ambient air

    PubMed Central

    Paulik, L. Blair; Donald, Carey E.; Smith, Brian W.; Tidwell, Lane G.; Hobbie, Kevin A.; Kincl, Laurel; Haynes, Erin N.; Anderson, Kim A.

    2015-01-01

    Natural gas extraction, often referred to as “fracking,” has increased rapidly in the U.S. in recent years. To address potential health impacts, passive air samplers were deployed in a rural community heavily affected by the natural gas boom. Samplers were analyzed for 62 polycyclic aromatic hydrocarbons (PAHs). Results were grouped based on distance from each sampler to the nearest active well. PAH levels were highest when samplers were closest to active wells. Additionally, PAH levels closest to natural gas activity were an order of magnitude higher than levels previously reported in rural areas. Sourcing ratios indicate that PAHs were predominantly petrogenic, suggesting that elevated PAH levels were influenced by direct releases from the earth. Quantitative human health risk assessment estimated the excess lifetime cancer risks associated with exposure to the measured PAHs. Closest to active wells, the risk estimated for maximum residential exposure was 2.9 in 10,000, which is above the U.S. EPA's acceptable risk level. Overall, risk estimates decreased 30% when comparing results from samplers closest to active wells to those farthest. This work suggests that natural gas extraction may be contributing significantly to PAHs in air, at levels that are relevant to human health. PMID:25810398

  14. Impact of natural gas extraction on PAH levels in ambient air.

    PubMed

    Paulik, L Blair; Donald, Carey E; Smith, Brian W; Tidwell, Lane G; Hobbie, Kevin A; Kincl, Laurel; Haynes, Erin N; Anderson, Kim A

    2015-04-21

    Natural gas extraction, often referred to as "fracking," has increased rapidly in the U.S. in recent years. To address potential health impacts, passive air samplers were deployed in a rural community heavily affected by the natural gas boom. Samplers were analyzed for 62 polycyclic aromatic hydrocarbons (PAHs). Results were grouped based on distance from each sampler to the nearest active well. PAH levels were highest when samplers were closest to active wells. Additionally, PAH levels closest to natural gas activity were an order of magnitude higher than levels previously reported in rural areas. Sourcing ratios indicate that PAHs were predominantly petrogenic, suggesting that elevated PAH levels were influenced by direct releases from the earth. Quantitative human health risk assessment estimated the excess lifetime cancer risks associated with exposure to the measured PAHs. Closest to active wells, the risk estimated for maximum residential exposure was 2.9 in 10 000, which is above the U.S. EPA's acceptable risk level. Overall, risk estimates decreased 30% when comparing results from samplers closest to active wells to those farthest. This work suggests that natural gas extraction may be contributing significantly to PAHs in air, at levels that are relevant to human health.

  15. Does shift in oxygen level in soil air affect the trace gases emissions?

    NASA Astrophysics Data System (ADS)

    malghani, S.; Gleixner, G.; Trumbore, S.

    2013-12-01

    Biogenic processes in soil such as, trace gasses emissions are influenced by presence or absence of oxygen as it is a dominant final acceptor of electrons for number of biochemical processes. However, it is unknown that trace gases emissions from soil are influenced by the level of oxygen or not. To understand the impact of oxygen level on CO2, CH4 and N2O emissions, five contrasting soils which differ in land use and other properties, were incubated at constant temperature and moisture in an automated chamber measurement system. Automated system continuously (30 mL/min) flushed the chambers holding soil samples with inlet air of known composition and the outlet air, sampling the headspace of the column, was connected to an automated multiport stream selection valve (Valco) that directed the air stream from different columns sequentially to instrumental part (LiCOR6262,PICARRO2101i and PICCARO2301). Other greenhouse gases and isotopes (δ13C & D) of CH4 were sampled weekly using 2L flasks. Oxygen levels in inlet air were switched weekly, started from 20% followed by 10, 5, 2.5, 1, 0%, and all levels were repeated in reverse fashion (from 1 to 20%).The results showed that soil respiration was higher in soils that were rich in soil organic matter with higher microbial biomass. Three out of five soils exhibited a gradual decrease in soil respiration while shifting higher to lower O2 levels but no such impact was recorded during gradual increase in O2 level. The lowest respiration rates in all soil types were recorded under anaerobic conditions. Forest soils were rich in soil organic carbon and respired more CO2 than grassland or cropland soils. All soils oxidized CH4, except one grassland soil which was acidic in nature (pH=4.1), in the presence of O2 at all levels. Amount of CH4 oxidized varied among soil types and was highest in forest soils. Under anaerobic condition CH4 oxidation was not observed in any soil, while two soils (cropland and one grassland) emitted

  16. Morphology and Pull Strength of Sn-Ag(-Co) Solder Joint with Copper Pad

    NASA Astrophysics Data System (ADS)

    Nishikawa, Hiroshi; Komatsu, Akira; Takemoto, Tadashi

    2007-09-01

    In order to clarify the effect of the addition of Co to the Sn-Ag solder, the formation and growth of an intermetallic compound (IMC) at the interface between Sn-Ag(-Co) solders and a Cu pad were investigated, and the joint strength of the solder with a Cu pad was also evaluated by a bump pull test. Binary Sn-3.5mass%Ag solder was used as the basic solder, and Sn-3.5mass%Ag-xCo solders (x = 0.1 mass%, 0.3 mass%, and 0.5 mass%) were specially prepared as Co-added solders. For the reflow process, specimens were heated in a radiation furnace at 523 K for 60 s. For the aging process, some specimens were then heat-treated in an oil bath at 423 K for 168 h, 504 h, and 1008 h. The results show that the addition of Co to the Sn-Ag solder strongly affected the formation and growth of the IMC at the interface. The results of the pull test clearly show that all solders had similar pull strengths, regardless of the Co addition, although the IMC morphology at the interface of the Sn-Ag-Co solder was quite different from that of the binary Sn-3.5Ag solder.

  17. Creep deformation behavior in eutectic Sn-Ag solder joints using a novel mapping technique

    SciTech Connect

    Lucas, J.P.; Guo, F.; McDougall, J.; Bieler, T.R.; Subramanian, K.N.; Park, J.K.

    1999-11-01

    Creep deformation behavior was measured for 60--100 {micro}m thick solder joints. The solder joints investigated consisted of: (1) non-composite solder joints made with eutectic Sn-Ag solder, and (2) composite solder joints with eutectic Sn-Ag solder containing 20 vol.%, 5 {micro}m diameter in-situ Cu{sub 6}Sn{sub 5} intermetallic reinforcements. All creep testing in this study was carried out at room temperature. Qualitative and quantitative assessment of creep deformation was characterized on the solder joints. Creep deformation was analyzed using a novel mapping technique where a geometrical-regular line pattern was etched over the entire solder joint using excimer laser ablation. During creep, the laser-ablation (LA) pattern becomes distorted due to deformation in the solder joint. By imaging the distortion of laser-ablation patterns using the SEM, actual deformation mapping for the entire solder joint is revealed. The technique involves sequential optical/digital imaging of the deformation versus time history during creep. By tracing and recording the deformation of the LA patterns on the solder over intervals of time, local creep data are obtained in many locations in the joint. This analysis enables global and localized creep shear strains and strain rate to be determined.

  18. Non-Radiological Air Quality Modeling for the High-Level Waste Salt Disposition

    SciTech Connect

    Hunter, C.H.

    1999-11-29

    Dispersion modeling of non-radiological airborne emissions associated with the construction and operation of three alternatives for high-level waste salt disposition at the Savannah River Site has been completed. The results will be used by Department of Energy-Savannah River in the preparation of the salt disposition supplemental environmental impact statement. Estimated maximum ground-level concentrations of applicable regulated air pollutants of the site boundary and at the distance to a hypothetical, co-located onsite worker are summarized in tables. In all cases, model estimated ambient concentrations are less than regulatory standards.

  19. Influence of microstructure on fatigue crack growth behavior of Sn-Ag solder interfaces

    NASA Astrophysics Data System (ADS)

    Liu, Pi Lin; Shang, Jian Ku

    2000-05-01

    The relationship between microstructure and fatigue crack growth behavior was examined at Sn-Ag solder interfaces on copper and electroless-nickel metallizations. On copper metallization, the solder interface was lined with a coarse Ag3Sn intermetallic phase in addition to the Cu6Sn5 intermetallic and the adjacent solder alloy contained nodular Ag3Sn phase. This interfacial microstructure was shown to result in inferior fatigue resistance, with the fatigue crack path following the interfacial Ag3Sn intermetallic phase. In contrast, the solder interface on the electroless-nickel metallization was covered with a thin layer of Ni3Sn4 intermetallic phase, and the solder microstructure was composed of fine needles of Ag3Sn phase dispersed in the Sn-rich matrix. This solder interface was found to be significantly more resistant to fatigue than the copper/Sn-Ag solder interface.

  20. Relationships between estimated flame retardant emissions and levels in indoor air and house dust.

    PubMed

    Liagkouridis, I; Cequier, E; Lazarov, B; Palm Cousins, A; Thomsen, C; Stranger, M; Cousins, I T

    2016-09-10

    A significant number of consumer goods and building materials can act as emission sources of flame retardants (FRs) in the indoor environment. We investigate the relationship between the emission source strength and the levels of 19 brominated flame retardants (BFRs) and seven organophosphate flame retardants (OPFRs) in air and dust collected in 38 indoor microenvironments in Norway. We use modeling methods to back-calculate emission rates from indoor air and dust measurements and identify possible indications of an emission-to-dust pathway. Experimentally based emission estimates provide a satisfactory indication of the relative emission strength of indoor sources. Modeling results indicate an up to two orders of magnitude enhanced emission strength for OPFRs (median emission rates of 0.083 and 0.41 μg h(-1) for air-based and dust-based estimates) compared to BFRs (0.52 and 0.37 ng h(-1) median emission rates). A consistent emission-to-dust signal, defined as higher dust-based than air-based emission estimates, was identified for four of the seven OPFRs, but only for one of the 19 BFRs. It is concluded, however, that uncertainty in model input parameters could potentially lead to the false identification of an emission-to-dust signal.

  1. Quantile-based Bayesian maximum entropy approach for spatiotemporal modeling of ambient air quality levels.

    PubMed

    Yu, Hwa-Lung; Wang, Chih-Hsin

    2013-02-05

    Understanding the daily changes in ambient air quality concentrations is important to the assessing human exposure and environmental health. However, the fine temporal scales (e.g., hourly) involved in this assessment often lead to high variability in air quality concentrations. This is because of the complex short-term physical and chemical mechanisms among the pollutants. Consequently, high heterogeneity is usually present in not only the averaged pollution levels, but also the intraday variance levels of the daily observations of ambient concentration across space and time. This characteristic decreases the estimation performance of common techniques. This study proposes a novel quantile-based Bayesian maximum entropy (QBME) method to account for the nonstationary and nonhomogeneous characteristics of ambient air pollution dynamics. The QBME method characterizes the spatiotemporal dependence among the ambient air quality levels based on their location-specific quantiles and accounts for spatiotemporal variations using a local weighted smoothing technique. The epistemic framework of the QBME method can allow researchers to further consider the uncertainty of space-time observations. This study presents the spatiotemporal modeling of daily CO and PM10 concentrations across Taiwan from 1998 to 2009 using the QBME method. Results show that the QBME method can effectively improve estimation accuracy in terms of lower mean absolute errors and standard deviations over space and time, especially for pollutants with strong nonhomogeneous variances across space. In addition, the epistemic framework can allow researchers to assimilate the site-specific secondary information where the observations are absent because of the common preferential sampling issues of environmental data. The proposed QBME method provides a practical and powerful framework for the spatiotemporal modeling of ambient pollutants.

  2. Groundwater level and nitrate concentration trends on Mountain Home Air Force Base, southwestern Idaho

    USGS Publications Warehouse

    Williams, Marshall L.

    2014-01-01

    Mountain Home Air Force Base in southwestern Idaho draws most of its drinking water from the regional aquifer. The base is located within the State of Idaho's Mountain Home Groundwater Management Area and is adjacent to the State's Cinder Cone Butte Critical Groundwater Area. Both areas were established by the Idaho Department of Water Resources in the early 1980s because of declining water levels in the regional aquifer. The base also is listed by the Idaho Department of Environmental Quality as a nitrate priority area. The U.S. Geological Survey, in cooperation with the U.S. Air Force, began monitoring wells on the base in 1985, and currently monitors 25 wells for water levels and 17 wells for water quality, primarily nutrients. This report provides a summary of water-level and nitrate concentration data collected primarily between 2001 and 2013 and examines trends in those data. A Regional Kendall Test was run to combine results from all wells to determine an overall regional trend in water level. Groundwater levels declined at an average rate of about 1.08 feet per year. Nitrate concentration trends show that 3 wells (18 percent) are increasing in nitrate concentration trend, 3 wells (18 percent) show a decreasing nitrate concentration trend, and 11 wells (64 percent) show no nitrate concentration trend. Six wells (35 percent) currently exceed the U.S. Environmental Protection Agency's maximum contaminant limit of 10 milligrams per liter for nitrate (nitrite plus nitrate, measured as nitrogen).

  3. Soldering and brazing safety guide: A handbook on space practice for those involved in soldering and brazing

    NASA Astrophysics Data System (ADS)

    This manual provides those involved in welding and brazing with effective safety procedures for use in performance of their jobs. Hazards exist in four types of general soldering and brazing processes: (1) cleaning; (2) application of flux; (3) application of heat and filler metal; and (4) residue cleaning. Most hazards during those operations can be avoided by using care, proper ventilation, protective clothing and equipment. Specific process hazards for various methods of brazing and soldering are treated. Methods to check ventilation are presented as well as a check of personal hygiene and good maintenance practices are stressed. Several emergency first aid treatments are described.

  4. Air radioactivity levels following the Fukushima reactor accident measured at the Laboratoire Souterrain de Modane, France.

    PubMed

    Loaiza, P; Brudanin, V; Piquemal, F; Reyss, J-L; Stekl, I; Warot, G; Zampaolo, M

    2012-12-01

    The radioactivity levels in the air of the radionuclides released by the Fukushima accident were measured at the Laboratoire Souterrain de Modane, in the South-East of France, during the period 25 March-18 April 2011. Air-filters from the ventilation system exposed for one or two days were measured using low-background gamma-ray spectrometry. In this paper we present the activity concentrations obtained for the radionuclides (131)I, (132)Te, (134)Cs, (137)Cs, (95)Nb, (95)Zr, (106)Ru, (140)Ba/La and (103)Ru. The activity concentration of (131)I was of the order of 100 μBq/m(3), more than 100 times higher than the activities of other fission products. The highest activities of (131)I were measured as a first peak on 30 March and a second peak on 3-4 April. The activity concentrations of (134)Cs and (137)Cs varied from 5 to 30 μBq/m(3). The highest activity concentration recorded for Cs corresponded to the same period as for (131)I, with a peak on 2-3 April. The results of the radioactivity concentration levels in grass and mushrooms exposed to the air in the Modane region were also measured. Activity concentrations of (131)I of about 100 mBq/m(2) were found in grass.

  5. Studies on in situ particulate reinforced tin-silver composite solders relevant to thermomechanical fatigue issues

    NASA Astrophysics Data System (ADS)

    Choi, Sunglak

    2001-07-01

    Global pressure based on environmental and health concerns regarding the use of Pb-bearing solder has forced the electronics industry to develop Pb-free alternative solders. Eutectic Sn-Ag solder has received much attention as a potential Pb-free candidate to replace Sn-Pb solder. Since introduction of surface mount technology, packaging density increased and the electronic devices became smaller. As a result, solders in electronic modules are forced to function as a mechanical connection as well as electrical contact. Solders are also exposed to very harsh service conditions such as automotive under-the-hood and aerospace applications. Solder joints experience thermomechanical fatigue, i.e. interaction of fatigue and creep, during thermal cycling due to temperature fluctuation in service conditions. Microstructural study on thermomechanical fatigue of the actual eutectic Sn-Ag and Sn-4Ag-0.5Cu solder joints was performed to better understand deformation and damage accumulation occurring during service. Incorporation of reinforcements has been pursued to improve the mechanical and particularly thermomechanical behavior of solders, and their service temperature capability. In-situ Sn-Ag composite solders were developed by incorporating Cu 6Sn5, Ni3Sn4, and FeSn2 particulate reinforcements in the eutectic Sn-Ag solder in an effort to enhance thermomechanical fatigue resistance. In-situ composite solders were investigated on the growth of interfacial intermetallic layer between solder and Cu substrate growth and creep properties. Solder joints exhibited significant deformation and damage on free surface and interior regions during thermomechanical fatigue. Cracks initiated on the free surface of the solder joints and propagated toward interior regions near the substrate of the solder joint. Crack grew along Sn grain boundaries by grain boundary sliding. There was significant residual stress within the solder joint causing more damage. Presence of small amount of Cu

  6. Air levels and mutagenicity of PM-10 in an indoor ice arena

    SciTech Connect

    Georghiou, P.E.; Blagden, P.A. ); Snow, D.A.; Winsor, L. ); Williams, D.T. )

    1989-12-01

    The authors report here their results from a preliminary study to evaluate a methodology for surveying air quality by measuring concentrations of PM-10 and the corresponding concentrations of mutagenic activity. The PM-10 was collected, during several hockey games at an ice arena using an Indoor Air Sampling Impactor (IASI) developed by Marple et al. During the course of the study, smoking restrictions were imposed in the stadium and the impact of these restrictions on PM-10 levels was also evaluated. The mutagenic activities of solvent extracts of the PM-10 were determined using the microsuspension modification of the Samonella typhimurium/microsome test. Mutagenic activity has often been used as a rough index of exposure to potential carcinogens and mutagens and to help define their sources.

  7. [Analysing noise levels in dental environment. Air turbine sound response to various physical factors].

    PubMed

    Oka, S

    1989-10-01

    Dental Air Turbine sound depends on the mechanical performance such as rotation and it is impossible to neglect connections of the sound with fluid mechanics and acoustics. Turbine sound must be considered from the standpoint of the sound pressure level and frequency component. In this study, the sound samples was measured and analysed in octave band spectrum. Turbine sound has three resonance bands of the frequency with the range from 0 to 1,600 Hz and the resonance band increased as air pressure increased. The frequency of the second resonance band decreased as the cutting load and cutting point diameter increased. Damping of the second resonance band frequency shifted downward by polishing point.

  8. Exposure to air pollution in critical prenatal time windows and IgE levels in newborns.

    PubMed

    Herr, Caroline E W; Ghosh, Rakesh; Dostal, Miroslav; Skokanova, Venuse; Ashwood, Paul; Lipsett, Michael; Joad, Jesse P; Pinkerton, Kent E; Yap, Poh-Sin; Frost, Joshua D; Sram, Radim; Hertz-Picciotto, Irva

    2011-02-01

    The objective of this study was to analyze the mechanisms by which exposure to ambient air pollutants influences respiratory health may include altered prenatal immune development. To analyze associations between elevated cord serum Immunoglobulin E (IgE) levels and maternal air pollution exposure during each month of gestation. Total cord serum IgE was determined by the CAP system and mothers' total IgE levels by nephelometry for 459 births in the Czech Republic from May 1994 to mid-January 1997. Concentrations of polycyclic aromatic hydrocarbons (PAHs) and particulate matter <2.5 microns in diameter (PM(2.5) ) were measured in ambient air, and arithmetic means were calculated for each gestational month. Log binomial regression models were used to estimate prevalence ratios (PR) for elevated cord serum IgE (≥0.9 IU/ml) adjusting for district of residence, year of birth, and in further models, for maternal IgE (a surrogate for atopy) and gestational season. Heterogeneity by maternal atopy status was evaluated for associations of air pollution and of cigarette smoke. In adjusted models, PAH and PM(2.5) exposures in the second month of gestation were each associated with a lower prevalence of elevated cord serum IgE. For an average increase of 100 ng/m(3) of PAHs, the PR was 0.69 (95% confidence interval (CI): 0.50, 0.95); for 25 μg/m(3) increase in PM(2.5) , the PR was 0.77 (95% CI: 0.55, 1.07). Conversely, exposures later in gestation were associated with a higher prevalence of elevated cord IgE: in the fifth month, the PR for PAH exposure was 1.64 (95% CI: 1.29, 2.08), while for PM(2.5) in the sixth month, it was 1.66 (95% CI: 1.30, 2.13). In analyses stratified by maternal atopy, air pollutants were associated with altered cord serum IgE only among neonates with non-atopic mothers. Similarly, an association of cigarette smoke with elevated cord serum IgE was found only in non-atopic mothers. PAHs and PM(2.5) , constituents of both ambient air pollution and

  9. Passive inhalation of marijuana smoke: urinalysis and room air levels of delta-9-tetrahydrocannabinol

    SciTech Connect

    Cone, E.J.; Johnson, R.E.; Darwin, W.D.; Yousefnejad, D.; Mell, L.D.; Paul, B.D.; Mitchell, J.

    1987-05-01

    In two separate studies, 5 drug-free male volunteers with a history of marijuana use were passively exposed to the sidestream smoke of 4 and 16 marijuana cigarettes (2.8% delta-9-tetrahydrocannabinol (THC)) for 1 h each day for 6 consecutive days. A third study was similarly performed with 2 marijuana-naive subjects passively exposed to the smoke of 16 marijuana cigarettes. Passive smoke exposure was conducted in a small, unventilated room. Room air levels of THC and CO were monitored frequently. All urine specimens were collected and analyzed by EMIT d.a.u. assay, Abuscreen radioimmunoassay and GC/MS. The studies show that significant amounts of THC were absorbed by all subjects at the higher level of passive smoke exposure (eg., smoke from 16 marijuana cigarettes), resulting in urinary excretion of significant amounts of cannabinoid metabolites. However, it seems improbable that subjects would unknowingly tolerate the noxious smoke conditions produced by this exposure. At the lower level of passive marijuana-smoke exposure, specimens tested positive only infrequently or were negative. Room air levels of THC during passive smoke exposure appeared to be the most critical factor in determining whether a subject produced cannabinoid-positive urine specimens.

  10. Study on particulate matter air pollution in Beijing with MODIS aerosol level 2 products

    NASA Astrophysics Data System (ADS)

    Mao, Jietai; Li, Chengcai; Lau, Alexis K.

    2004-09-01

    In the run-up to the 2008 Olympic Games in Beijing, Chinese government officials at both the central and municipal levels are keenly aware that they must transform Beijing into a world-class city. According to the Beijing Municipal Environmental Protection Bureau (BJEPB) to improve its air quality some actions are adopting, including taking steps to increase the forested area surrounding the city preventing dust storms, reducing the automotive vehicles, moving polluting factories now inside the fourth ring road ringing the inner city to locations outside of the fourth ring road, and switching the fuel of public buses and taxis from diesel to natural gas, etc. Will they eliminate most serious environmental problems in Beijing? MODIS aerosol products are helping us to answer this kind of questions. A long-term validation has been finished by sun-photometer observations, and the results proved the relative error of MODIS level 2 products was slightly larger than the estimation of Chu et al. (2002) from the results in most AERONET sites. However, the comparison between the products and moisture-corrected air pollution index (API) data, which were daily released to public by EPB, showed a high correlation coefficient. An air pollution episode in 2003 was investigated by the usage of satellite products. Our conclusion for the air pollution control strategy in Beijing is that only reducing the pollution sources from inner city can't fully solve the pollution problems in Beijing and the regional transports from the nearby southern provinces are contributing a lot to the pollution situation in Beijing.

  11. Effect of Different Levels of Pressure Relieving Air-Mattress Firmness on Cough Strength.

    PubMed

    Kamikawa, Norimichi; Taito, Shunsuke; Takahashi, Makoto; Sekikawa, Kiyokazu; Hamada, Hironobu

    2016-01-01

    Cough is an important host-defense mechanism. The elderly and patients who are severely ill cannot cough effectively when lying in the supine position. Furthermore, pressure relieving air-mattresses are recommended for preventing the development of pressure ulcers. In this study, we clarified whether or not the cough peak flow (CPF), an index of cough strength, is affected by different firmness levels of a pressure relieving air-mattress in healthy volunteers in the supine position. Fifty-two healthy young men participated. All the measurements were carried out on each participant in the supine position on a pressure relieving air-mattress. The participants were assessed at two firmness levels, a "hard" and "soft" mode. The CPF, forced vital capacity (FVC), maximal expiratory pressure (PEmax), and maximal inspiratory pressure (PImax) were determined for each mode. The sinking distance of the body into the mattress was measured without any activity and the difference between the sinking distances of the two firmness levels was determined. The CPF, FVC, PEmax, and PImax were determined for each mode. The sinking distance of the body into the mattress was measured and the difference between the sinking distances of the two firmness levels was determined. The CPF, FVC, PEmax and PImax values of the participants coughing on the mattress were significantly lower when the mattress was in "soft" than in "hard" mode. The differences between the sinking distances of the mattress in "soft" and "hard" modes were larger for the anterior superior iliac spine. A harder mattress may lead to increased CPF in healthy young men lying in the supine position, and increased CPF may be important for host defense.

  12. 28. VIEW OF THE SOLDERING NICHE FORMED WITH BRICKS. THE ...

    Library of Congress Historic Buildings Survey, Historic Engineering Record, Historic Landscapes Survey

    28. VIEW OF THE SOLDERING NICHE FORMED WITH BRICKS. THE BACK OF THE NICHE IS CEMENT FINISHED. THE BOTTOM HAS A 1 INCH THICK ASBESTOS SHELF. THIS PHOTO WAS TAKEN AT THE 3RD FLOOR. - Pacific Telephone & Telegraph Company Building, 1519 Franklin Street, Oakland, Alameda County, CA

  13. A method of damage mechanics analysis for solder material

    SciTech Connect

    Fang, H.E.; Chow, C.L.; Yang, Fan

    1997-06-01

    This paper presents as a method of damage mechanics analysis for solder joint material stressed to extensive plastic deformation. The material chosen for the current work is the 60Sn-40Pb eutectic alloy due to its wide use. The analysis is based on the thermodynamic theory of irreversible processes. With the introduction of a set of internal state variables, known as damage variables, and a damage effect tensor, a damage dissipative potential function is proposed to enable the formulation of the constitutive equations of elasticity and plasticity coupled with damage. The equations of damage evolution are also derived to monitor damage initiation and growth. Before a damage analysis can be performed with a finite element analysis, the mechanical properties of the chosen solder joint material and its damage variables must first be determined. A method of experimental analysis was developed and used to successfully measure the highly strain sensitive 60Sn-40Pb solder material. The measured properties are presented and various characteristics of the solder material are examined and discussed. 7 refs., 8 figs.

  14. A constitutive model for Sn-Pb solder.

    SciTech Connect

    Neilsen, Michael K.; Vianco, Paul Thomas; Boyce, Brad Lee

    2010-10-01

    A unified creep plasticity damage (UCPD) model for Sn-Pb solder is developed in this paper. Stephens and Frear (1999) studied the creep behavior of near-eutectic 60Sn-40Pb solder subjected to low strain rates and found that the inelastic (creep and plastic) strain rate could be accurately described using a hyperbolic Sine function of the applied effective stress. A recently developed high-rate servo-hydraulic method was employed to characterize the temperature and strain-rate dependent stress-strain behavior of eutectic Sn-Pb solder over a wide range of strain rates (10{sup -4} to 10{sup 2} per second). The steady state inelastic strain rate data from these latest experiments were also accurately captured by the hyperbolic Sine equation developed by Stephens and Frear. Thus, this equation was used as the basis for the UCPD model for Sn-Pb solder developed in this paper. Stephens, J.J., and Frear, D.R., Metallurgical and Materials Transactions A, Volume 30A, pp. 1301-1313, May 1999.

  15. Fundamentals of wetting and spreading with emphasis on soldering

    SciTech Connect

    Yost, F.G.

    1991-01-01

    Soldering is often referred to as a mature technology whose fundamentals were established long ago. Yet a multitude of soldering problems persist, not the least of which are related to the wetting and spreading of solder. The Buff-Goodrich approach to thermodynamics of capillarity is utilized in a review of basic wetting principles. These thermodynamics allow a very compact formulation of capillary phenomena which is used to calculate various meniscus shapes and wetting forces. These shapes and forces lend themselves to experimental techniques, such as the sessile drop and the Wilhelmy plate, for measuring useful surface and interfacial energies. The familiar equations of Young, Wilhelmy, and Neumann are all derived with this approach. The force-energy duality of surface energy is discussed and the force method is developed and used to derive the Herring relations for anisotropic surfaces. The importance of contact angle hysteresis which results from surface roughness and chemical inhomogeneity is presented and Young's equation is modified to reflect these ever present effects. Finally, an analysis of wetting with simultaneous metallurigical reaction is given and used to discuss solder wetting phenomena. 60 refs., 13 figs.

  16. Inelastic Strain Analysis of Solder Joint in NASA Fatigue Specimen

    NASA Technical Reports Server (NTRS)

    Dasgupta, Abhijit; Oyan, Chen

    1991-01-01

    The solder fatigue specimen designed by NASA-GSFC/UNISYS is analyzed in order to obtain the inelastic strain history during two different representative temperature cycles specified by UNISYS. In previous reports (dated July 25, 1990, and November 15, 1990), results were presented of the elastic-plastic and creep analysis for delta T = 31 C cycle, respectively. Subsequent results obtained during the current phase, from viscoplastic finite element analysis of the solder fatigue specimen for delta T = 113 C cycle are summarized. Some common information is repeated for self-completeness. Large-deformation continuum formulations in conjunction with a standard linear solid model is utilized for modeling the solder constitutive creep-plasticity behavior. Relevant material properties are obtained from the literature. Strain amplitudes, mean strains, and residual strains (as well as stresses) accumulated due to a representative complete temperature cycle are obtained as a result of this analysis. The partitioning between elastic strains, time-independent inelastic (plastic) strains, and time-dependent inelastic (creep) strains is also explicitly obtained for two representative cycles. Detailed plots are presented for two representative temperature cycles. This information forms an important input for fatigue damage models, when predicting the fatigue life of solder joints under thermal cycling

  17. Recycling of lead solder dross, Generated from PCB manufacturing

    NASA Astrophysics Data System (ADS)

    Lucheva, Biserka; Tsonev, Tsonio; Iliev, Peter

    2011-08-01

    The main purpose of this work is to analyze lead solder dross, a waste product from manufacturing of printed circuit boards by wave soldering, and to develop an effective and environmentally sound technology for its recycling. A methodology for determination of the content and chemical composition of the metal and oxide phases of the dross is developed. Two methods for recycling of lead solder dross were examined—carbothermal reduction and recycling using boron-containing substances. The influence of various factors on the metal yield was studied and the optimal parameters of the recycling process are defined. The comparison between them under the same parameters-temperature and retention time, showed that recycling of dross with a mixture of borax and boric acid in a 1:2 ratio provides higher metal yield (93%). The recycling of this hazardous waste under developed technology gets glassy slag and solder, which after correction of the chemical composition can be used again for production of PCB.

  18. Aqueous cleaning of flux residue from solder joints. Final report

    SciTech Connect

    Krska, C.M.

    1992-08-01

    Solder joints have traditionally been cleaned using chlorinated or fluorinated solvents. This study addressed alternate processing. One process involved using a saponifier/water solution to remove rosin flux residues; the other process involved using a water-soluble flux and water to remove the residues. Although both processes were satisfactory, the water-soluble flux with water cleaning proved to be the best.

  19. Aqueous cleaning of flux residue from solder joints

    SciTech Connect

    Krska, C.M.

    1992-08-01

    Solder joints have traditionally been cleaned using chlorinated or fluorinated solvents. This study addressed alternate processing. One process involved using a saponifier/water solution to remove rosin flux residues; the other process involved using a water-soluble flux and water to remove the residues. Although both processes were satisfactory, the water-soluble flux with water cleaning proved to be the best.

  20. Life prediction modeling of solder interconnects for electronic systems

    SciTech Connect

    Frear, D.R.; Burchett, S.N.; Neilsen, M.K.

    1997-02-01

    A microstructurally-based computational simulation is presented that predicts the behavior and lifetime of solder interconnects for electronic applications. This finite element simulation is based on an internal state variable constitutive model that captures both creep and plasticity, and accounts for microstructural evolution. The basis of the microstructural evolution is a simple model that captures the grain size and microstructural defects in the solder. The mechanical behavior of the solder is incorporated into the model in the form of time-dependent viscoplastic equations derived from experimental creep tests. The unique aspect of this methodology is that the constants in the constitutive relations of the model are determined from experimental tests. This paper presents the constitutive relations and the experimental means by which the constants in the equations are determined. The fatigue lifetime of the solder interconnects is predicted using a damage parameter (or grain size) that is an output of the computer simulation. This damage parameter methodology is discussed and experimentally validated.

  1. Environmental and hold time effects on fatigue of low-tin lead-based solder

    NASA Astrophysics Data System (ADS)

    Berriche, R.; Fine, M. E.; Jeannotte, D. A.

    1991-02-01

    The effect of environment on the strain-controlled fatigue resistance of a high-lead-low-tin solder was determined by comparing results in vacuum to those in air (wet and dry) and CO2 (wet and dry). At low strain amplitude, air and CO2 were shown to reduce the cycles to failure defined on the basis of the decrease in maximum cycle stress. The effect increases as the strain amplitude is reduced. Water vapor had little effect. Previously, the Coffin-Manson (C-M) relation was shown to fail for tests in air. The amount of failure is less in vacuum. The main fatigue failure mode is grain-boundary (GB) cracking, and this is accelerated by air or CO2. Auger spectroscopy showed that there is tin buildup near the surface during fatigue in air or CO2. The more rapid GB fracture was attributed to tin oxide (or tin oxide-lead oxide solid solution) buildup in the GB, where diffusion is more rapid.

  2. Correlations between health status and OralChroma™-determined volatile sulfide levels in mouth air of the elderly.

    PubMed

    Awano, Shuji; Takata, Yutaka; Soh, Inho; Yoshida, Akihiro; Hamasaki, Tomoko; Sonoki, Kazuo; Ohsumi, Tomoko; Nishihara, Tatsuji; Ansai, Toshihiro

    2011-12-01

    Dimethyl sulfide (DMS), a volatile sulfur compound (VSC) found in mouth air, is thought to be associated with systemic diseases; this in contrast to the two other VSCs found in mouth air: hydrogen sulfide and methyl mercaptan (MM). This study aimed to validate the relationship between DMS in mouth air and oral and systemic factors. The subjects were 393 elderly Japanese volunteers participating in an oral and systemic health survey. They were surveyed for the concentration of VSC components in their mouth air and for their oral and systemic health status. Using logistic regression models, the prevalence of DMS in mouth air above the organoleptic threshold level (OTL) was found to be significantly associated with high-density lipoprotein (HDL) cholesterol level, medical history of colon polyps and asthma, being female, and the presence of MM in mouth air above the OTL. Our data suggest that systemic factors, such as a high serum HDL cholesterol level and a medical history of asthma and colon polyps, might be more prominent in subjects with elevated DMS. The differences, although statistically significant, are quite small. They also indicate that an oral factor, such as a high MM mouth-air level also influences the DMS mouth-air level in addition to systemic factors.

  3. Factors Affecting Parent’s Perception on Air Quality—From the Individual to the Community Level

    PubMed Central

    Guo, Yulin; Liu, Fengfeng; Lu, Yuanan; Mao, Zongfu; Lu, Hanson; Wu, Yanyan; Chu, Yuanyuan; Yu, Lichen; Liu, Yisi; Ren, Meng; Li, Na; Chen, Xi; Xiang, Hao

    2016-01-01

    The perception of air quality significantly affects the acceptance of the public of the government’s environmental policies. The aim of this research is to explore the relationship between the perception of the air quality of parents and scientific monitoring data and to analyze the factors that affect parents’ perceptions. Scientific data of air quality were obtained from Wuhan’s environmental condition reports. One thousand parents were investigated for their knowledge and perception of air quality. Scientific data show that the air quality of Wuhan follows an improving trend in general, while most participants believed that the air quality of Wuhan has deteriorated, which indicates a significant difference between public perception and reality. On the individual level, respondents with an age of 40 or above (40 or above: OR = 3.252; 95% CI: 1.170–9.040), a higher educational level (college and above: OR = 7.598; 95% CI: 2.244–25.732) or children with poor healthy conditions (poor: OR = 6.864; 95% CI: 2.212–21.302) have much more negative perception of air quality. On the community level, industrial facilities, vehicles and city construction have major effects on parents’ perception of air quality. Our investigation provides baseline information for environmental policy researchers and makers regarding the public’s perception and expectation of air quality and the benefits to the environmental policy completing and enforcing. PMID:27187432

  4. Electromigration Behaviors of Cu Reinforced Sn-3.5Ag Composite Solder Joints

    NASA Astrophysics Data System (ADS)

    Wang, Yan; Han, Jing; Ma, Limin; Zuo, Yong; Guo, Fu

    2016-12-01

    The composite approach, by incorporating small amounts of reinforcement particles in the solder matrix, has proven to be one of the effective ways to improve the reliability of solder joints. The effects of Cu addition on electromigration were investigated in this study by incorporating 2% volume fraction Cu particles into Sn-3.5Ag eutectic solder paste by the in situ process. The one-dimensional solder joints, designed to prevent the current crowding effect, were stressed under a constant current density of 104 A/cm2 at room temperature, and the temperature of the sample could reach 105 ± 5°C due to the Joule heating effect. Doping 2 vol.% Cu was found to retard the electromigration phenomenon effectively. After electric current stressing for 528 h, the growth rate of an interfacial intermetallic compound (IMC) layer at the anode decreased 73% in contrast to that of Sn-3.5Ag solder joints, and the IMC layer at the cathode was almost unchanged. The polarization effect of Cu reinforced composite solder joints was also apparently mitigated. In addition, the surface damage of the composite solder joints was relieved by incorporating 2 vol.% Cu particles. Compared to Sn-3.5Ag solder joints, which had protruded Cu6Sn5 and wrinkles of Sn-solder matrix on the surface, the solder joints with Cu addition had a more even surface.

  5. A real time sorbent based air monitoring system for determining low level airborne exposure levels to Lewisite

    SciTech Connect

    Lattin, F.G.; Paul, D.G.; Jakubowski, E.M.

    1994-12-31

    The Real Time Analytical Platform (RTAP) is designed to provide mobile, real-time monitoring support to ensure protection of worker safety in areas where military unique compounds are used and stored, and at disposal sites. Quantitative analysis of low-level vapor concentrations in air is accomplished through sorbent-based collection with subsequent thermal desorption into a gas chromatograph (GC) equipped with a variety of detectors. The monitoring system is characterized by its sensitivity (ability to measure at low concentrations), selectivity (ability to filter out interferences), dynamic range and linearity, real time mode (versus methods requiring extensive sample preparation procedures), and ability to interface with complimentary GC detectors. This presentation describes an RTAP analytical method for analyzing lewisite, an arsenical compound, that consists of a GC screening technique with an Electron Capture Detector (ECD), and a confirmation technique using an Atomic Emission Detector (AED). Included in the presentation is a description of quality assurance objectives in the monitoring system, and an assessment of method accuracy, precision and detection levels.

  6. Genetic effects of an air discharge plasma on Staphylococcus aureus at the gene transcription level

    NASA Astrophysics Data System (ADS)

    Xu, Zimu; Wei, Jun; Shen, Jie; Liu, Yuan; Ma, Ronghua; Zhang, Zelong; Qian, Shulou; Ma, Jie; Lan, Yan; Zhang, Hao; Zhao, Ying; Xia, Weidong; Sun, Qiang; Cheng, Cheng; Chu, Paul K.

    2015-05-01

    The dynamics of gene expression regulation (at transcription level) in Staphylococcus aureus after different doses of atmospheric-pressure room-temperature air plasma treatments are investigated by monitoring the quantitative real-time polymerase chain reaction. The plasma treatment influences the transcription of genes which are associated with several important bio-molecular processes related to the environmental stress resistance of the bacteria, including oxidative stress response, biofilm formation, antibiotics resistance, and DNA damage protection/repair. The reactive species generated by the plasma discharge in the gas phase and/or induced in the liquid phase may account for these gene expression changes.

  7. Proposal for a Vehicle Level Test Procedure to Measure Air Conditioning Fuel Use

    SciTech Connect

    Rugh, J. P.

    2010-04-01

    The air-conditioning (A/C) compressor load significantly impacts the fuel economy of conventional vehicles and the fuel use/range of plug-in hybrid electric vehicles (PHEV). A National Renewable Energy Laboratory (NREL) vehicle performance analysis shows the operation of the air conditioner reduces the charge depletion range of a 40-mile range PHEV from 18% to 30% in a worst case hot environment. Designing for air conditioning electrical loads impacts PHEV and electric vehicle (EV) energy storage system size and cost. While automobile manufacturers have climate control procedures to assess A/C performance, and the U.S. EPA has the SCO3 drive cycle to measure indirect A/C emissions, there is no automotive industry consensus on a vehicle level A/C fuel use test procedure. With increasing attention on A/C fuel use due to increased regulatory activities and the development of PHEVs and EVs, a test procedure is needed to accurately assess the impact of climate control loads. A vehicle thermal soak period is recommended, with solar lamps that meet the SCO3 requirements or an alternative heating method such as portable electric heaters. After soaking, the vehicle is operated over repeated drive cycles or at a constant speed until steady-state cabin air temperature is attained. With this method, the cooldown and steady-state A/C fuel use are measured. This method can be run at either different ambient temperatures to provide data for the GREEN-MAC-LCCP model temperature bins or at a single representative ambient temperature. Vehicles with automatic climate systems are allowed to control as designed, while vehicles with manual climate systems are adjusted to approximate expected climate control settings. An A/C off test is also run for all drive profiles. This procedure measures approximate real-world A/C fuel use and assess the impact of thermal load reduction strategies.

  8. Effect of ultrasonic vibration time on the Cu/Sn-Ag-Cu/Cu joint soldered by low-power-high-frequency ultrasonic-assisted reflow soldering.

    PubMed

    Tan, Ai Ting; Tan, Ai Wen; Yusof, Farazila

    2017-01-01

    Techniques to improve solder joint reliability have been the recent research focus in the electronic packaging industry. In this study, Cu/SAC305/Cu solder joints were fabricated using a low-power high-frequency ultrasonic-assisted reflow soldering approach where non-ultrasonic-treated samples were served as control sample. The effect of ultrasonic vibration (USV) time (within 6s) on the solder joint properties was characterized systematically. Results showed that the solder matrix microstructure was refined at 1.5s of USV, but coarsen when the USV time reached 3s and above. The solder matrix hardness increased when the solder matrix was refined, but decreased when the solder matrix coarsened. The interfacial intermetallic compound (IMC) layer thickness was found to decrease with increasing USV time, except for the USV-treated sample with 1.5s. This is attributed to the insufficient USV time during the reflow stage and consequently accelerated the Cu dissolution at the joint interface during the post-ultrasonic reflow stage. All the USV-treated samples possessed higher shear strength than the control sample due to the USV-induced-degassing effect. The shear strength of the USV-treated sample with 6s was the lowest among the USV-treated samples due to the formation of plate-like Ag3Sn that may act as the crack initiation site.

  9. Using Mobile Monitoring to Assess Spatial Variability in Urban Air Pollution Levels: Opportunities and Challenges (Invited)

    NASA Astrophysics Data System (ADS)

    Larson, T.

    2010-12-01

    Measuring air pollution concentrations from a moving platform is not a new idea. Historically, however, most information on the spatial variability of air pollutants have been derived from fixed site networks operating simultaneously over space. While this approach has obvious advantages from a regulatory perspective, with the increasing need to understand ever finer scales of spatial variability in urban pollution levels, the use of mobile monitoring to supplement fixed site networks has received increasing attention. Here we present examples of the use of this approach: 1) to assess existing fixed-site fine particle networks in Seattle, WA, including the establishment of new fixed-site monitoring locations; 2) to assess the effectiveness of a regulatory intervention, a wood stove burning ban, on the reduction of fine particle levels in the greater Puget Sound region; and 3) to assess spatial variability of both wood smoke and mobile source impacts in both Vancouver, B.C. and Tacoma, WA. Deducing spatial information from the inherently spatio-temporal measurements taken from a mobile platform is an area that deserves further attention. We discuss the use of “fuzzy” points to address the fine-scale spatio-temporal variability in the concentration of mobile source pollutants, specifically to deduce the broader distribution and sources of fine particle soot in the summer in Vancouver, B.C. We also discuss the use of principal component analysis to assess the spatial variability in multivariate, source-related features deduced from simultaneous measurements of light scattering, light absorption and particle-bound PAHs in Tacoma, WA. With increasing miniaturization and decreasing power requirements of air monitoring instruments, the number of simultaneous measurements that can easily be made from a mobile platform is rapidly increasing. Hopefully the methods used to design mobile monitoring experiments for differing purposes, and the methods used to interpret those

  10. Reflow soldering and isothermal solid-state aging of Sn-Ag eutectic solder on Au/Ni surface finish

    NASA Astrophysics Data System (ADS)

    Liu, C. M.; Ho, C. E.; Chen, W. T.; Kao, C. R.

    2001-09-01

    The reaction between the eutectic Sn-3.5Ag solder and the Au/Ni surface finish during reflow as well as during isothermal aging was studied. The Au layer was electroplated and had a thickness of the one μm. The peak reflow temperature was fixed at 250 C while the reflow time was varied between 10 sec and one h. Samples that went through 90 sec reflow time were then subjected to 160 C isothermal aging for up to 875 h. It was found that during reflow the Au layer reacted very quickly with the solder to form AuSn4. One μm of Au layer was consumed in less than 10 sec. As the aging time increased, AuSn4 grains began to separate themselves from the Ni layer at the roots of the grains and started to fall into the solder. When, the reflow time reached 30 sec, all the Au intermetallic head left the interface, and Ni3Sn4 started, to form at the interface. The Ni3Sn4 growth rate followed linear kinetics initially (<240 sec), but the growth rate slowed down afterward. During the isothermal aging, only a small amount of (AuxNi1-x)Sn4 resettled back to the interface, and a continuous (Au0.45Ni0.55)Sn4 layer did not form at the interface, unlike the case for the Sn-37Pb solder. This is an important advantage for Sn-3.5 Ag over Sn-37Pb because a continuous (Au0.45Ni0.55)Sn4 layer inevitably will weaken a solder joint. Our observation indicated that many (AuxNi1-x)Sn4 particles were trapped by the Ag3Sn particles, and were hindered from resettling back to the interface.

  11. Evaluating near highway air pollutant levels and estimating emission factors: Case study of Tehran, Iran.

    PubMed

    Nayeb Yazdi, Mohammad; Delavarrafiee, Maryam; Arhami, Mohammad

    2015-12-15

    A field sampling campaign was implemented to evaluate the variation in air pollutants levels near a highway in Tehran, Iran (Hemmat highway). The field measurements were used to estimate road link-based emission factors for average vehicle fleet. These factors were compared with results of an in tunnel measurement campaign (in Resalat tunnel). Roadside and in-tunnel measurements of carbon monoxide (CO) and size-fractionated particulate matter (PM) were conducted during the field campaign. The concentration gradient diagrams showed exponential decay, which represented a substantial decay, more than 50-80%, in air pollutants level in a distance between 100 and 150meters (m) of the highway. The changes in particle size distribution by distancing from highway were also captured and evaluated. The results showed particle size distribution shifted to larger size particles by distancing from highway. The empirical emission factors were obtained by using the roadside and in tunnel measurements with a hypothetical box model, floating machine model, CALINE4, CT-EMFAC or COPERT. Average CO emission factors were estimated to be in a range of 4 to 12g/km, and those of PM10 were 0.1 to 0.2g/km, depending on traffic conditions. Variations of these emission factors under real working condition with speeds were determined.

  12. Estimation of relative rate of copper dissolution in wave soldering and through-hole rework process by designing an experiment for soldering parameters and PCB features

    NASA Astrophysics Data System (ADS)

    Nair, Vineethkumar R.

    The thesis details the study of influence of factors such as surface finish of PCB, copper content in PCB barrel, PCB thickness, type of solder alloy, type and process parameters of through-hole soldering process in determining the rates of copper dissolution in different through-hole soldering processes. The research was designed to conduct experiment in two phases. The first phase was to measure the copper dissolution that occurs during machine-based wave soldering processes and analyze the factors influencing it. The second phase was to measure the copper dissolution that occurs during a solder pot rework process and analyze the factors influencing it. The results from the experiment are used to identify the significance and magnitude of influence that each of the factors has on the rate of copper dissolution. These measurements are further used to estimate the rates of copper dissolution during through-hole rework process.

  13. 24 CFR 3280.406 - Air chamber test method for certification and qualification of formaldehyde emission levels.

    Code of Federal Regulations, 2011 CFR

    2011-04-01

    ... particleboard is produced or surface-finished, whichever is later, the panels must be dead-stacked or air-tight... with the Standard Test Method for Determining Formaldehyde Levels from Wood Products Under Defined...

  14. 24 CFR 3280.406 - Air chamber test method for certification and qualification of formaldehyde emission levels.

    Code of Federal Regulations, 2010 CFR

    2010-04-01

    ... particleboard is produced or surface-finished, whichever is later, the panels must be dead-stacked or air-tight... with the Standard Test Method for Determining Formaldehyde Levels from Wood Products Under Defined...

  15. Reducing the emission of ozone depleting chemicals through use of a self-cleaning soldering process

    SciTech Connect

    Lichtenberg, L.; Martin, G.; Van Buren, P.; Iman, R.; Paffett, M.T.

    1991-12-31

    Motorola has jointed with Sandia and Los Alamos National Laboratories to perform work under a Cooperative Research and Development Agreement (CRADA) to reduce the use of CFC`s and other ozone depleting printing wiring board (PWB) cleaning solvents. This study evaluated the use of a new soldering process that uses dilute adipic acid in lieu of rosin flux. The process consumes the adipic acid in lieu of rosin flux. The process consumes the adipic acid during the soldering process and precludes the need for subsequent cleaning with ozone depleting solvents. This paper presents results from a series of designed experiments that evaluated PWB cleanliness as a function of various levels of machine control parameters. The study included a comprehensive hardware reliability evaluation, which included environmental conditioning, cleanliness testing, surface chemical analysis, surface insulation resistance testing, along with electrical, mechanical and long term storage testing. The results of this study that the new process produces quality, reliable hardware over a wide range of processing parameters. Adoption of this process, which eliminates the need for supplemental cleaning, will have a positive impact on many environmental problems, including depletion of the ozone layer.

  16. Reducing the emission of ozone depleting chemicals through use of a self-cleaning soldering process

    SciTech Connect

    Lichtenberg, L.; Martin, G.; Van Buren, P. . Government Electronics Group); Iman, R. ); Paffett, M.T. )

    1991-01-01

    Motorola has jointed with Sandia and Los Alamos National Laboratories to perform work under a Cooperative Research and Development Agreement (CRADA) to reduce the use of CFC's and other ozone depleting printing wiring board (PWB) cleaning solvents. This study evaluated the use of a new soldering process that uses dilute adipic acid in lieu of rosin flux. The process consumes the adipic acid in lieu of rosin flux. The process consumes the adipic acid during the soldering process and precludes the need for subsequent cleaning with ozone depleting solvents. This paper presents results from a series of designed experiments that evaluated PWB cleanliness as a function of various levels of machine control parameters. The study included a comprehensive hardware reliability evaluation, which included environmental conditioning, cleanliness testing, surface chemical analysis, surface insulation resistance testing, along with electrical, mechanical and long term storage testing. The results of this study that the new process produces quality, reliable hardware over a wide range of processing parameters. Adoption of this process, which eliminates the need for supplemental cleaning, will have a positive impact on many environmental problems, including depletion of the ozone layer.

  17. Characteristics of Creep Damage for 60Sn-40Pb Solder Material

    SciTech Connect

    Wei, Y.; Chow, C.L.; Fang, H.E.; Neilsen, M.K.

    1999-08-26

    This paper presents a viscoplasticity model taking into account the effects of change in grain or phase size and damage on the characterization of creep damage in 60Sn-40Pb solder. Based on the theory of damage mechanics, a two-scalar damage model is developed for isotropic materials by introducing the free energy equivalence principle. The damage evolution equations are derived in terms of the damage energy release rates. In addition, a failure criterion is developed based on the postulation that a material element is said to have ruptured when the total damage accumulated in the element reaches a critical value. The damage coupled viscoplasticity model is discretized and coded in a general-purpose finite element program known as ABAQUS through its user-defined material subroutine UMAT. To illustrate the application of the model, several example cases are introduced to analyze, both numerically and experimentally, the tensile creep behaviors of the material at three stress levels. The model is then applied to predict the deformation of a notched specimen under monotonic tension at room temperature (22 C). The results demonstrate that the proposed model can successfully predict the viscoplastic behavior of the solder material.

  18. Kinetics of Au-containing ternary intermetallic redeposition at solder/UBM interface

    NASA Astrophysics Data System (ADS)

    Lee, Jong-Hyun; Park, Jong-Hwan; Shin, Dong-Hyuk; Lee, Yong-Ho; Kim, Yong-Seog

    2001-09-01

    In this study, the effects of the under bump metallurgy (UBM) structure and Cu content in solders on the redeposition rate of Au-containing ternary intermetallics at the solder/UBM interface were investigated. A UBM structure with a Ni diffusion barrier, Au/Ni/Cu, appeared to promote the redeposition of ternary Au-containing intermetallics at the solder/UBM interface of the ternary during the solid-state aging treatment and the Au-embrittlement of the solder interconnections. Copper added to the eutectic Sn-Pb and Sn-Ag solders was observed to be very effective in retarding the redeposition by forming the ternary intermetallics in solder matrices and preventing the Au-embrittlement. These phenomena were discussed with the microstructures observed.

  19. Root Cause Investigation of Lead-Free Solder Joint Interfacial Failures After Multiple Reflows

    NASA Astrophysics Data System (ADS)

    Li, Yan; Hatch, Olen; Liu, Pilin; Goyal, Deepak

    2016-12-01

    Solder joint interconnects in three-dimensional (3D) packages with package stacking configurations typically must undergo multiple reflow cycles during the assembly process. In this work, interfacial open joint failures between the bulk solder and the intermetallic compound (IMC) layer were found in Sn-Ag-Cu (SAC) solder joints connecting a small package to a large package after multiple reflow reliability tests. Systematic progressive 3D x-ray computed tomography experiments were performed on both incoming and assembled parts to reveal the initiation and evolution of the open failures in the same solder joints before and after the reliability tests. Characterization studies, including focused ion beam cross-sections, scanning electron microscopy, and energy-dispersive x-ray spectroscopy, were conducted to determine the correlation between IMC phase transformation and failure initiation in the solder joints. A comprehensive failure mechanism, along with solution paths for the solder joint interfacial failures after multiple reflow cycles, is discussed in detail.

  20. Evaluation of advanced microelectronic fluxless solder-bump contacts for hybrid microcircuits

    NASA Technical Reports Server (NTRS)

    Mandal, R. P.

    1976-01-01

    Technology for interconnecting monolithic integrated circuit chips with other components is investigated. The advantages and disadvantages of the current flip-chip approach as compared to other interconnection methods are outlined. A fluxless solder-bump contact technology is evaluated. Multiple solder-bump contacts were formed on silicon integrated circuit chips. The solder-bumps, comprised of a rigid nickel under layer and a compliant solder overlayer, were electroformed onto gold device pads with the aid of thick dry film photomasks. Different solder alloys and the use of conductive epoxy for bonding were explored. Fluxless solder-bump bond quality and reliability were evaluated by measuring the effects of centrifuge, thermal cycling, and high temperature storage on bond visual characteristics, bond electrical continuity, and bond shear tests. The applicability and suitability of this technology for hybrid microelectronic packaging is discussed.

  1. Root Cause Investigation of Lead-Free Solder Joint Interfacial Failures After Multiple Reflows

    NASA Astrophysics Data System (ADS)

    Li, Yan; Hatch, Olen; Liu, Pilin; Goyal, Deepak

    2017-03-01

    Solder joint interconnects in three-dimensional (3D) packages with package stacking configurations typically must undergo multiple reflow cycles during the assembly process. In this work, interfacial open joint failures between the bulk solder and the intermetallic compound (IMC) layer were found in Sn-Ag-Cu (SAC) solder joints connecting a small package to a large package after multiple reflow reliability tests. Systematic progressive 3D x-ray computed tomography experiments were performed on both incoming and assembled parts to reveal the initiation and evolution of the open failures in the same solder joints before and after the reliability tests. Characterization studies, including focused ion beam cross-sections, scanning electron microscopy, and energy-dispersive x-ray spectroscopy, were conducted to determine the correlation between IMC phase transformation and failure initiation in the solder joints. A comprehensive failure mechanism, along with solution paths for the solder joint interfacial failures after multiple reflow cycles, is discussed in detail.

  2. Pre-tinning and flux considerations on the reliability of solder surface

    SciTech Connect

    Sunwoo, A.J. ); Morris, J.W. Jr. ); Lucey, G.K. )

    1991-07-01

    The kinetics of wetting were studied on several different prepared surfaces of copper (Cu) to simulate the microstructure observed in pre-tinned Cu-clad printed circuit boards. The results illustrate the effectiveness of pre-tinning in maintaining the solderability of Cu surfaces. Pre-tinning with Pb-rich solder (95Pb-5Sn) is particularly effective since solderability is preserved even after a relatively long aging treatment. On the other hand, pre-tinning with eutectic solder risks the loss of solderability during aging or baking due to surface exposure of an {var epsilon}-phase intermetallic with poor wetting properties. The results also confirm the presence of carbon in pre-tinned specimens due to the use of flux. The effect of carbon on solderability is not yet known. 13 refs., 8 figs., 1 tab.

  3. A study on the reliability of indium solder die bonding of high power semiconductor lasers

    NASA Astrophysics Data System (ADS)

    Liu, Xingsheng; Davis, Ronald W.; Hughes, Lawrence C.; Rasmussen, Michael H.; Bhat, Rajaram; Zah, Chung-En; Stradling, Jim

    2006-07-01

    High power semiconductor lasers have found increased applications. Indium solder is one of the most widely used solders in high power laser die bonding. Indium solder has some advantages in laser die bonding. It also has some concerns, however, especially in terms of reliability. In this paper, the reliability of indium solder die bonding of high power broad area semiconductor lasers was studied. It was found that indium solder bonded lasers have much shorter lifetime than AuSn solder bonded devices. Catastrophic degradation was observed in indium solder bonded lasers. Nondestructive optical and acoustic microscopy was conducted during the lifetime testing to monitor the failure process and destructive failure analysis was performed after the lasers failed. It was found that the sudden failure was caused by electromigration of indium solder at the high testing current of up to 7A. It was shown that voids were created and gradually enlarged by indium solder electromigration, which caused local heating near the facets of the laser. The local heating induced catastrophic optical mirror damage (COMD) of the lasers. It was discussed that current crowding, localized high temperature, and large temperature gradient contributed to the fast indium solder electromigration. It was observed that some bright pattern structures appeared on the front facet of the indium solder bonded lasers after the devices failed and the bright patterns grew and spread upon further testing. Failure analysis showed that the bright pattern structure apparent on the front facet was due to crystallization of the TiOx material of the front facet coating as a result of overheating during lifetime testing. It was concluded that indium solder is not suitable for high power laser applications due to electromigration at high current densities and high temperatures.

  4. Detecting nonuniformity in small welds and solder seams using optical correlation and electronic processing.

    PubMed

    Wagner, J W

    1981-10-15

    Using holographic matched filtering and electronic processing, small variations in surface displacement along the seam of a hermetic microcircuit package can be detected when the seam is stressed. Destructive analysis of a solder-sealed package reveals a strong correlation between optical signal variations and nonuniformity of solder adhesion and wetting along the seam. The technique promises potential application as a means of nondestructively inspecting for flaws in small welded or soldered seams.

  5. Interfacial reaction of Sn-based solder joint in the package system

    NASA Astrophysics Data System (ADS)

    Gu, Huandi

    In this thesis, I report a study on the effect of the solder size on intermetallic layer formation by comparing the morphology change and growth rate of two different size solder joint aged at a same temperature for different aging time. The layer thickness and microstructure were analyzed using scanning electron microscopy (SEM). Photoshop was used to measure the thickness of intermetallic compound. Two different size of solder joints with composition of Sn-Ag-Cu (305) were used.

  6. Assessment of air pollution tolerance levels of selected plants around cement industry, Coimbatore, India.

    PubMed

    Radhapriya, P; NavaneethaGopalakrishnan, A; Malini, P; Ramachandran, A

    2012-05-01

    Being the second largest manufacturing industry in India, cement industry is one of the major contributors of suspended particulate matter (SPM). Since plants are sensitive to air pollution, introducing suitable plant species as part of the greenbelt around cement industry was the objective of the present study. Suitable plant species were selected based on the Air pollution tolerance index (APTI) calculated by analyzing ascorbic acid (AA), pH, relative water content (RWC) and total chlorophyll (TChl) of the plants occuring in the locality. Plants were selected within a 6 km radius from the industry and were graded as per their tolerance levels by analyzing the biochemical parameters. From the statistical analysis at 0.05 level of significance a difference in the APTI values among the 27 plant species was observed, but they showed homogenous results when analysed zone wise using one-way analyses of variance. Analyses of individual parameters showed variation in the different zones surrounding the cement industry, whereas the APTI value (which is a combination of the parameter viz. AA, RWC, TChl, pH) showed more or less same gradation. Significant variation in individual parameters and APTI was seen with in the species. All the plants surrounding the cement industry are indicative of high pollution exposure comparable to the results obtain for control plants. Based on the APTI value, it was observed that about 37% of the plant species were tolerant. Among them Mangifera indica, Bougainvillea species, Psidum quajava showed high APTI values. 33% of the species were highly susceptible to the adverse effects of SPM, among which Thevetia neriifolia, Saraca indica, Phyllanthus emblica and Cercocarpus ledifolius showed low APTI values. 15% each of the species were at the intermediary and moderate tolerance levels.

  7. Low-level air pollution and upper respiratory infections in children.

    PubMed Central

    Jaakkola, J J; Paunio, M; Virtanen, M; Heinonen, O P

    1991-01-01

    Effects of low-level air pollution were studied in one polluted city and two reference cities in northern Finland by comparing the frequency of upper respiratory infections over a 12-month period in 1982 as reported by parents of children ages 14 through 18 months (n = 679) and 6 years (n = 759). A similar comparison was carried out between children living in the more polluted and less polluted areas of the polluted city. The annual mean and the greatest half-hour concentrations of sulfur dioxide (23 and 807 micrograms/m3), particulates (31 and 291 micrograms/m3), nitrogen oxides (15 and 160 micrograms/m3), and hydrogen sulfide (2 and 177 micrograms/m3) in the polluted city were mainly due to industrial sources. In the reference cities, air pollution was produced mainly by traffic and heating. Adjusted odds ratios (OR) for one or more upper respiratory infections of residents in the polluted city vs those in the reference cities were 2.0 (95% confidence interval [CI] = 1.3-3.2) in the younger age group and 1.6 (95% CI = 1.1-2.1) in the older age group. Within the polluted city, OR calculated for living in more vs less polluted areas were 2.0 (95% CI = 1.0-4.0) in the younger and 1.6 (95% CI = 1.0-2.7) in the older children. The present results suggests that, for children, air pollution can be hazardous in concentrations lower than those recorded in earlier studies from Britain and central Europe. The synergistic effect of sulfur dioxide, particulates, nitrogen oxides, hydrogen sulfide, and other pollutants may be a contributing factor. PMID:1854003

  8. Sea level oscillations in coastal waters of the Buenos Aires province, Argentina

    NASA Astrophysics Data System (ADS)

    Dragani, W. C.; Mazio, C. A.; Nuñez, M. N.

    2002-03-01

    Sea level oscillations, with periods ranging from a few minutes to almost 2 h, have been observed at various tide stations located on the coast of Buenos Aires. Simultaneous records of sea level elevation measured in Mar de Ajó, Pinamar and Mar del Plata during 1982 have been spectrally analyzed. Significant spectral energy has been detected between 0.85 and 4.69 cycles per hour (cph) and the most energetic peaks have frequencies between 1.17 and 1.49 cph. Spectra, coherence, and phase difference have been analyzed for the most energetic event of the year. During that event, the most intensive spectral peak is at 1.17 cph for Mar de Ajó and Pinamar, and at 1.49 cph for Mar del Plata. Simultaneous total energy peaks at Mar de Ajó, Pinamar and Mar del Plata, and the coherence function estimated between Mar de Ajó and Pinamar suggests that sea level oscillations could be a regional phenomenon. The analyzed data suggest that sea level oscillations could be forced by atmospheric gravity waves associated with frontal passages.

  9. Indoor air pollution levels in public buildings in Thailand and exposure assessment.

    PubMed

    Klinmalee, Aungsiri; Srimongkol, Kasama; Kim Oanh, Nguyen Thi

    2009-09-01

    Levels of pollutants including PM2.5 and PM2.5 composition (black carbon and water soluble ions), SO(2), NO(2), CO, CO(2), and BTEX (benzene, toluene, ethylbenzene, xylene) were monitored for indoor and outdoor air at a university campus and a shopping center, both located in the Northern suburb of Bangkok. Sampling was done during December 2005-February 2006 on both weekdays and weekends. At the university, indoor monitoring was done in two different air conditioned classrooms which shows the I/O ratios for all pollutants to be below 0.5-0.8 during the weekends. However, on weekdays the ratios for CO(2) and most detected BTEX were above 1.0. The concept of classroom occupancy was defined using a function of the student number in a lecture hour and the number of lecture hours per day. Classroom 2, which had a higher occupancy than classroom 1, was characterized by higher concentrations of most pollutants. PM2.5 was an exception and was higher in classroom 1 (37 microg/m(3), weekdays) as compared to classroom 2 (26 microg/m(3), weekdays) which was likely linked to the dust resuspension from the carpeted floor in the former. Monitoring was also done in the shopping mall at three different sites. Indoor pollutants levels and the I/O ratios at the shopping mall were higher than at the university. Levels of all pollutants measured at the car park, except for toluene and CO(2), were the highest. I/O ratios of the pollutants at the mall were above 1.0, which indicates the relatively higher influence of the indoor sources. However, the black carbon content in PM2.5 outdoor is higher than indoor, which suggest the important contribution from outdoor combustion sources such as the traffic. Major sources of outdoor air pollution in the areas were briefly discussed. Exposure modeling was applied using the time activity and measured pollutant concentrations to assess the exposure of different groups of people in the study areas. High exposure to PM2.5, especially for the people

  10. Theater-Level Stochastic Air-to-Air Engagement Modeling via Event Occurrence Networks Using Piecewise Polynomial Approximation

    DTIC Science & Technology

    2001-09-01

    light weight low recoil machine gun developed by Samuel Neal McClean with later improvement by Colonel USA Issac In reality air combat is far from...Forecast International Radar Forecast Forecast International Newton Conn Fowler Bruce W De Physica Belli An Introduction to

  11. Interdiffusion analysis of the soldering reactions in Sn-3.5Ag/Cu couples

    NASA Astrophysics Data System (ADS)

    Bae, K. S.; Kim, S. J.

    2001-11-01

    Extensive microstructural and kinetic studies on the formation and growth of the intermetallics of Sn-rich solder/Cu couples have been reported. However, experimental data on the interdiffusion mechanisms during soldering reactions are limited and in conflict. The interdiffusion processes for soldering of Sn-3.5Ag alloy/Cu couples were investigated by using the Cr-evaporated surface as a reference line. At the beginning of soldering, Cu was observed to outdiffuse to the molten Sn-3.5Ag alloy until saturation, and the Sn-Ag solder dissolved with Cu collapsed below the reference line. As a result, the scallop-shaped Cu6Sn5 intermetallic compound was formed at the newly-formed Sn-Ag-Cu solder/Cu interface below the original Cu surface. When the soldered joint was reflowed at the lower temperature to suppress the Cu dissolution, the Cu6Sn5/Cu interface moved into the Cu substrate. Therefore, Sn is the dominant diffusing species for the intermetallic formation during the soldering process, although the extensive Cu dissolution occurs at the early stage of soldering.

  12. Wettability of electroless Ni in the under bump metallurgy with lead free solder

    NASA Astrophysics Data System (ADS)

    Young, Bi-Lian; Duh, Jenq-Gong; Chiou, Bi-Shiou

    2001-05-01

    This study investigates the wettability of several lead-free solders, including Sn, Sn-Ag, and Sn-Bi, on electroless Ni (EN) with various phosphorus content. The role of phosphorus on solder wettability is studied. Microstructure evolution in the lead-free solder/EN joint is investigated with the aid of electron probe microanalyzer (EPMA) to relate metallurgical reactions between the solder and the EN. The SN solder exhibits better wettability on EN, while the Si-Bi solder has a larger contact angle. Wettability degrades as the phosphorus content in EN decreases. The dependence of wetting angle on the phosphorous content can be attributed to the surface roughness and density of EN, along with the interfacial reaction between the solders and EN. An EPMA analysis reveals the presence of a Sn-Bi-Ni-P solid solution at the interface of solder/EN joints due to the interdiffusion of major constituent Ni and Sn. The interaction zone of the solid solution increases with increasing temperature. Wettability of Pb-free solders on EN degrades with the presence of NiO due to oxidation or the existence of Ni3P due to precipitation after annealing. For an adequate wetting behavior in the Sn (Sn-Bi, Sn-Ag)/EN joint, EN deposited with phosphorus contents in the range of 9 to 12 wt% is suggested.

  13. An Evaluation of Prototype Circuit Boards Assembled with a Sn-Ag Bi Solder

    SciTech Connect

    ARTAKI,I.; RAY,U.; REJENT,JEROME A.; VIANCO,PAUL T.

    1999-09-01

    An evaluation was performed which examined the aging of surface mount solder joints assembled with 91.84Sn-3.33Ag-4.83Bi solder. Defect analysis of the as-fabricated test vehicles revealed excellent solderability, good package alignment, and a minimum number of voids. Continuous DC electrical monitoring of the solder joints did not reveal opens during as many as 10,000 thermal cycles (0 C, 100 C). The solder joints exhibited no significant degradation through 2500 cycles, based upon an absence of microstructural damage and sustained shear and pull strengths of chip capacitors and J-leaded solder joints, respectively. Thermal cycles of 5000 and 10,000 resulted in some surface cracking of the solder fillets and coatings. In a few cases, deeper cracks were observed in the thinner reaches of several solder fillets. There was no deformation or cracking in the solder located in the gap between the package I/O and the circuit board pad nor in the interior of the fillets, both locations that would raise concerns of joint mechanical integrity. A drop in the chip capacitor shear strength was attributed to crack growth near the top of the fillet.

  14. High-power semiconductor laser array packaged on microchannel cooler using gold-tin soldering technology

    NASA Astrophysics Data System (ADS)

    Wang, Jingwei; Kang, Lijun; Zhang, Pu; Nie, Zhiqiang; Li, Xiaoning; Xiong, Lingling; Liu, Xingsheng

    2012-03-01

    High power semiconductor laser arrays have found increased applications in many fields. In this work, a hard soldering microchannel cooler (HSMCC) technology was developed for packaging high power diode laser array. Numerical simulations of the thermal behavior characteristics of hard solder and indium solder MCC-packaged diode lasers were conducted and analyzed. Based on the simulated results, a series of high power HSMCC packaged diode laser arrays were fabricated and characterized. The test and statistical results indicated that under the same output power the HSMCC packaged laser bar has lower smile and high reliability in comparison with the conventional copper MCC packaged laser bar using indium soldering technology.

  15. A Well-Mixed Computational Model for Estimating Room Air Levels of Selected Constituents from E-Vapor Product Use

    PubMed Central

    Rostami, Ali A.; Pithawalla, Yezdi B.; Liu, Jianmin; Oldham, Michael J.; Wagner, Karl A.; Frost-Pineda, Kimberly; Sarkar, Mohamadi A.

    2016-01-01

    Concerns have been raised in the literature for the potential of secondhand exposure from e-vapor product (EVP) use. It would be difficult to experimentally determine the impact of various factors on secondhand exposure including, but not limited to, room characteristics (indoor space size, ventilation rate), device specifications (aerosol mass delivery, e-liquid composition), and use behavior (number of users and usage frequency). Therefore, a well-mixed computational model was developed to estimate the indoor levels of constituents from EVPs under a variety of conditions. The model is based on physical and thermodynamic interactions between aerosol, vapor, and air, similar to indoor air models referred to by the Environmental Protection Agency. The model results agree well with measured indoor air levels of nicotine from two sources: smoking machine-generated aerosol and aerosol exhaled from EVP use. Sensitivity analysis indicated that increasing air exchange rate reduces room air level of constituents, as more material is carried away. The effect of the amount of aerosol released into the space due to variability in exhalation was also evaluated. The model can estimate the room air level of constituents as a function of time, which may be used to assess the level of non-user exposure over time. PMID:27537903

  16. Developing Community-Level Policy and Practice to Reduce Traffic-Related Air Pollution Exposure

    PubMed Central

    Brugge, Doug; Patton, Allison P.; Bob, Alex; Reisner, Ellin; Lowe, Lydia; Bright, Oliver-John M.; Durant, John L.; Newman, Jim; Zamore, Wig

    2016-01-01

    The literature consistently shows associations of adverse cardiovascular and pulmonary outcomes with residential proximity to highways and major roadways. Air monitoring shows that traffic-related pollutants (TRAP) are elevated within 200–400 m of these roads. Community-level tactics for reducing exposure include the following: 1) HEPA filtration; 2) Appropriate air-intake locations; 3) Sound proofing, insulation and other features; 4) Land-use buffers; 5) Vegetation or wall barriers; 6) Street-side trees, hedges and vegetation; 7) Decking over highways; 8) Urban design including placement of buildings; 9) Garden and park locations; and 10) Active travel locations, including bicycling and walking paths. A multidisciplinary design charrette was held to test the feasibility of incorporating these tactics into near-highway housing and school developments that were in the planning stages. The resulting designs successfully utilized many of the protective tactics and also led to engagement with the designers and developers of the sites. There is a need to increase awareness of TRAP in terms of building design and urban planning. PMID:27413416

  17. Levels and seasonal variations of organochlorine pesticides in urban and rural background air of southern Ghana.

    PubMed

    Adu-Kumi, Sam; Kareš, Radovan; Literák, Jaromír; Borůvková, Jana; Yeboah, Philip O; Carboo, Derick; Akoto, Osei; Darko, Godfred; Osae, Shiloh; Klánová, Jana

    2012-07-01

    Urban, suburban and rural background air samples were collected in southern Ghana in 2008 employing polyurethane foam disc passive air samplers (PAS). PAS were analysed for organochlorine pesticides (OCPs), namely hexachlorocyclohexanes (α-, β-, γ- and δ-hexachlorocyclohexane), dichlorodiphenyltrichloroethane including metabolites (o,p'- and p,p'-DDT, DDE and DDD), hexachlorobenzene, pentachlorobenzene, aldrin, dieldrin, endrins (endrin, endrin aldehyde and endrin ketone), isodrin, heptachlors (heptachlor, heptachlor epoxide A and heptachlor epoxide B), chlordanes (α-, β-chlordane, oxychlordane and trans-nonachlor), endosulfans (α- and β-endosulfan and endosulfan sulphate), methoxychlor and mirex using a gas chromatograph coupled to a mass spectrometer. The levels of OCPs ranged for the individual pesticides from below limit of quantification to 750 pg m(-3) (for α-endosulfan), and current agricultural application seemed to be the main primary source of most abundant pesticides. Re-volatilization of previously used pesticides from contaminated soils could not be ruled out either as potential secondary source of contamination, especially in warm and dry seasons and periods of intensive agricultural activities. Higher atmospheric concentrations were observed in November and December during the dry season compared to lower concentrations observed in June, July and August when the country experiences heavy rains. The highest seasonal variation was observed for currently used pesticides as α-endosulfan. A p,p'-DDT/p,p'-DDE ratio suggested recent inputs of fresh technical DDT.

  18. Developing Community-Level Policy and Practice to Reduce Traffic-Related Air Pollution Exposure.

    PubMed

    Brugge, Doug; Patton, Allison P; Bob, Alex; Reisner, Ellin; Lowe, Lydia; Bright, Oliver-John M; Durant, John L; Newman, Jim; Zamore, Wig

    2015-06-01

    The literature consistently shows associations of adverse cardiovascular and pulmonary outcomes with residential proximity to highways and major roadways. Air monitoring shows that traffic-related pollutants (TRAP) are elevated within 200-400 m of these roads. Community-level tactics for reducing exposure include the following: 1) HEPA filtration; 2) Appropriate air-intake locations; 3) Sound proofing, insulation and other features; 4) Land-use buffers; 5) Vegetation or wall barriers; 6) Street-side trees, hedges and vegetation; 7) Decking over highways; 8) Urban design including placement of buildings; 9) Garden and park locations; and 10) Active travel locations, including bicycling and walking paths. A multidisciplinary design charrette was held to test the feasibility of incorporating these tactics into near-highway housing and school developments that were in the planning stages. The resulting designs successfully utilized many of the protective tactics and also led to engagement with the designers and developers of the sites. There is a need to increase awareness of TRAP in terms of building design and urban planning.

  19. Association between State Assistance on the Topic of Indoor Air Quality and School District-Level Policies That Promote Indoor Air Quality in Schools

    ERIC Educational Resources Information Center

    Everett Jones, Sherry; Doroski, Brenda; Glick, Sherry

    2015-01-01

    Nationally representative data from the 2012 School Health Policies and Practices Study examined whether state assistance on indoor air quality (IAQ) was associated with district-level policies and practices related to IAQ and integrated pest management (IPM). Districts in states that provided assistance on IAQ were more likely than districts not…

  20. Low levels of air pollution induce changes of lung function in a panel of schoolchildren.

    PubMed

    Moshammer, H; Hutter, H-P; Hauck, H; Neuberger, M

    2006-06-01

    In search of sensitive screening parameters for assessing acute effects of ambient air pollutants in young schoolchildren, the impact of 8-h average air pollution before lung function testing was investigated by oscillatory measurements of resistance and spirometry with flow-volume loops. At a central elementary school in Linz, the capital of Upper Austria, 163 children aged 7-10 yrs underwent repeated examinations at the same time of day during 1 school year, yielding a total of 11-12 lung function tests per child. Associations to mass concentrations of particulate matter and nitrogen dioxide (NO(2)) measured continuously at a nearby monitoring station were tested, applying the Generalised Estimating Equations model. Reductions per 10 microg.m(-3) (both for particles and for NO(2)) were in the magnitude of 1% for most lung function parameters. The most sensitive indicator for acute effects of combustion-related pollutants was a change in maximal expiratory flow in small airways. NO(2) at concentrations below current standards reduced (in the multipollutant model) the forced expiratory volume in one second by 1.01%, maximal instantaneous forced flow when 50% of the forced vital capacity remains to be exhaled (MEF(50%)) by 1.99% and MEF(25%) by 1.96%. Peripheral resistance increased by 1.03% per 10 microg.m(-3) of particulate matter with a 50% cut-off aerodynamic diameter of 2.5 mum (PM(2.5)). Resistance is less influenced by the child's cooperation and should be utilised more often in environmental epidemiology when screening for early signs of small airway dysfunction from urban air pollution, but cannot replace the measurement of MEF(50%) and MEF(25%). In the basic model, the reduction of these parameters per 10 microg.m(-3) was highest for NO(2), followed by PM(1), PM(2.5) and PM(10), while exposure to coarse dust (PM(10)-PM(2.5)) did not change end-expiratory flow significantly. All acute effects of urban air pollution found on the lung function of healthy

  1. Solder Interconnect Predictor (SIP) Software v. 0.5

    SciTech Connect

    VIANCO, PAUL; NEILSEN, MICHAEL; & REJENT, JEROME

    2008-11-19

    This software tool was developed for predicting the fatigue damage in a wide variety of 63Sn-37Pb solder joints used in electronics applications. This tool is based upon the unified creep plasticity damage model CompSIR developed at Sandia National Laboratories. The software can be used as a design tool for predicting the long term reliability of consumer, military and space electronics. Both service as well as accelerated testing environments can be addressed by the user. The mesh generating function provides the user with the greater versatility to explore different package and I/O configurations. For example, different solder joint geometries can be investigated to determine the effects of workmanship quality on reliability. Graphical user interfaces provide the user with easy data input screens as well as results profiles.

  2. A solder sealing method for paraffin-filled microcavities

    NASA Astrophysics Data System (ADS)

    Nguyen, Hugo; Bejhed, Johan; Köhler, Johan; Thornell, Greger

    2006-11-01

    Demonstrated and investigated here is a method to seal microfluidic systems by soldering. As a particularly difficult case of growing importance, the sealing of openings contaminated with paraffin wax was studied. Solder paste, screen printed on a metallized silicon substrate, was melted locally through application of 6.5-10 V to a 5 Ω copper film resistor for a few seconds and was found able to drive an intermediate layer of paraffin away and seal a 0.2 mm diameter circular via by wetting a surrounding copper pad. Although verified to be robust, the process did result in failing seals on excessive heating because of consumption of the pads. Correctly performed, the technique provided a seal at least withstanding a pressure of 8 bar for 8 h at 85 °C.

  3. Automated inspection of solder joints for surface mount technology

    NASA Technical Reports Server (NTRS)

    Savage, Robert M.; Park, Hyun Soo; Fan, Mark S.

    1993-01-01

    Researchers at NASA/GSFC evaluated various automated inspection systems (AIS) technologies using test boards with known defects in surface mount solder joints. These boards were complex and included almost every type of surface mount device typical of critical assemblies used for space flight applications: X-ray radiography; X-ray laminography; Ultrasonic Imaging; Optical Imaging; Laser Imaging; and Infrared Inspection. Vendors, representative of the different technologies, inspected the test boards with their particular machine. The results of the evaluation showed limitations of AIS. Furthermore, none of the AIS technologies evaluated proved to meet all of the inspection criteria for use in high-reliability applications. It was found that certain inspection systems could supplement but not replace manual inspection for low-volume, high-reliability, surface mount solder joints.

  4. Constitutive modeling of viscoplastic damage in solder material

    SciTech Connect

    WEI,YONG; CHOW,C.L.; NEILSEN,MICHAEL K.; FANG,HUEI ELIOT

    2000-04-17

    This paper presents a constitutive modeling of viscoplastic damage in 63Sn-37Pb solder material taking into account the effects of microstructural change in grain coarsening. Based on the theory of damage mechanics, a two-scalar damage model is developed by introducing the damage variables and the free energy equivalence principle. An inelastic potential function based on the concept of inelastic damage energy release rate is proposed and used to derive an inelastic damage evolution equation. The validation of the model is carried out for the viscoplastic material by predicting monotonic tensile behavior and tensile creep curves at different temperatures. The softening behavior of the material under monotonic tension loading can be characterized with the model. The results demonstrate adequately the validity of the proposed viscoplastic constitutive modeling for the solder material.

  5. SPONTANEOUS CATALYTIC WET AIR OXIDATION DURING PRE-TREATMENT OF HIGH-LEVEL RADIOACTIVE WASTE SLUDGE

    SciTech Connect

    Koopman, D.; Herman, C.; Pareizs, J.; Bannochie, C.; Best, D.; Bibler, N.; Fellinger, T.

    2009-10-01

    Savannah River Remediation, LLC (SRR) operates the Defense Waste Processing Facility for the U.S. Department of Energy at the Savannah River Site. This facility immobilizes high-level radioactive waste through vitrification following chemical pretreatment. Catalytic destruction of formate and oxalate ions to carbon dioxide has been observed during qualification testing of non-radioactive analog systems. Carbon dioxide production greatly exceeded hydrogen production, indicating the occurrence of a process other than the catalytic decomposition of formic acid. Statistical modeling was used to relate the new reaction chemistry to partial catalytic wet air oxidation of both formate and oxalate ions driven by the low concentrations of palladium, rhodium, and/or ruthenium in the waste. Variations in process conditions led to increases or decreases in the total oxidative destruction, as well as partially shifting the preferred species undergoing destruction from oxalate ion to formate ion.

  6. The influence of gravity levels on soot formation for the combustion of ethylene-air mixture

    NASA Astrophysics Data System (ADS)

    Zhang, Y.; Liu, D.; Li, S.; Li, Y.; Lou, C.

    2014-12-01

    The reduced mechanism coupled with 2D flame code using CHEMKIN II to investigate the effect of gravity on flame structure and soot formation in diffusion flames. The results show that the gravity has a rather significant effect on flame structure and soot formation. The visible flame height and peak soot volume fraction in general increases with the gravity from 1 g decreased to 0 g. The peak flame temperature decreases with decreasing gravity level. Comparing the calculated results from 1 g to 0 g, the flame shape becomes wider, the high temperature zone becomes shorter, the mixture velocity has a sharp decrease, the soot volume fraction has a sharp increase and CO and unprovided species distribution becomes wider along radial direction. At normal and half gravity, the flame is buoyancy controlled and the axial velocity is largely independent of the coflow air velocity. At microgravity (0 g), the flame is momentum controlled.

  7. Solder joint fatigue analysis under low temperature Martian conditions

    NASA Technical Reports Server (NTRS)

    Tudryn, Carissa

    2006-01-01

    Electronics, without requiring heater power or enclosure in a centralized 'warm electronics box,' will need to survive mean surface temperatures of -120 degrees Celsius to +20 degrees Celsius for an extended Martian mission and an operational temperature up to 85 degrees Celsisus. Since these electronics will need to survive extended cycles under these conditions, fatigue is a significant concern. The solder joint reliability of connectors on a printed wiring board was investigated.

  8. Lead poisoning from lead-soldered electric kettles.

    PubMed Central

    Ng, R.; Martin, D. J.

    1977-01-01

    Lead poisoning occurred in two infants, causing lead encephalopathy in one but no symptoms in the other. Both infants had been fed a formula prepared with water boiled in a lead-soldered electric kettle. The diagnosis was suggested by dense metaphyseal bands in radiographs, illustrating the importance of careful examination of "routine" radiographs, particularly in asymptomatic infants. Images FIG. 1A FIG. 1B FIG. 1C FIG. 2 FIG. 3 PMID:837317

  9. Infrared Detection of Faulty Solder Joints. Phase 2.2.

    DTIC Science & Technology

    1982-03-01

    Determinations 18 3.1.6 Softening Point Determinations 24 3.2 Damage Prevention on Laminates 26 - 3.3 Laser/thermal Testing Through Conformal Coatings...possibility was conceived and implemented. The feasibility of testing solder joints covered by a conformal coat- ing was confirmed. Several...efficacy of the testing method if it had to be carried out in the presence of a conformal coating. Approximately 1,000 feed-through and lap-joints were

  10. The effect of lead content and surface roughness on wetting and spreading of low-lead and no-lead solders on copper-clad FR-4 laminates

    SciTech Connect

    Stevenson, J.O.; Roberts, J.L.; Davidson, R.N.; Yost, F.G.; Hosking, F.M.

    1997-02-01

    Environmental and health concerns pertaining to lead have encouraged research into low-lead alloys for electronic soldering. The development of solder alloys containing lower amounts of lead than Sn/Pb eutectic (37 wt.% lead), but possessing similar properties, is an industry-wide goal. To determine the wettability of low-lead solders, 21 alloys each of Sn/Ag and Sn/Cu eutectic (containing 0 to 10 wt.% lead and/or indium) were tested on as-received copper-clad FR-4. Contact angles for the alloys ranged from 12.5 to 38.9{degrees} and area of spread measurements ranged from 5.2 to 17.3 mm{sup 2} compared with 5 to 150 and {approximately}19 mm{sup 2}, respectively, for Sn/Pb eutectic. Alloys with 8 to 10 wt.% lead showed contact angles and areas of spread similar to Sn/Pb eutectic under similar conditions. The best results on the as-received substrates, compared to the Sn/Pb eutectic, were obtained from the Sn/Ag eutectic with 10 wt.% lead. The very low-lead (less than 10 wt.% lead) and lead-free alloys, however, failed to achieve the performance level of eutectic Sn/Pb solders. A desire to improve the spreading of very low-lead and lead-free solders provided the impetus for these efforts to produce {open_quotes}engineered{close_quotes} rough surfaces. In an attempt to improve the wettability and spreading behavior of very low-lead and lead-free alloys, the very low-lead and lead-free members of the Sn/Ag system were tested on roughened copper-clad FR-4. Every alloy in the test suite demonstrated improvement in area of spread on the roughened substrates. The best results on the roughened substrates, compared to the Sn/Pb eutectic, were obtained from the Sn/Ag eutectic with 8 wt.% lead. The effects of surface roughness on the wettability and flow behavior of solder alloys has provided insight into surface morphologies that lead to improved solderability.

  11. Impacts of traffic-induced lead emissions on air, soil and blood lead levels in Beirut.

    PubMed

    Hashisho, Z; El-Fadel, M

    2004-01-01

    Lead is a purely toxic heavy metal which induces a wide variety of adverse physiologic effects. Nevertheless, it has been mined and used for more than 8,000 years. Among the different contemporary sources of lead pollution, traffic-induced emissions from the combustion of leaded gasoline is of particular concern, as it can constitute more than 90 percent of total lead emissions into the atmosphere in congested urban areas where no phase-out activities have been adopted. Gasoline lead content and traffic volume are strongly correlated with concentrations of lead in various environmental media. In the absence of policies to reduce the use of lead in gasoline or to favor the use of unleaded gasoline, leaded gasoline remains the predominant grade in many countries. This paper assesses the status of lead pollution from the combustion of leaded gasoline in Beirut based on field measurements of lead in air and roadside dust of urban and rural/suburban areas and recent data on soil and blood lead levels. Average atmospheric lead concentrations was about 1.86 microg m(-3) at urban locations and 0.147 microg m(-3) at suburban locations. The analysis of roadside dust revealed an average lead level of 353 microg g(-1) along urban streets and 125 microg g(-1) along rural/suburban roads. Blood lead levels were also relatively high in comparison to countries where leaded gasoline has been phased-out.

  12. Polycyclic aromatic hydrocarbons in air on small spatial and temporal scales - I. Levels and variabilities

    NASA Astrophysics Data System (ADS)

    Lammel, Gerhard; Klánová, Jana; Ilić, Predrag; Kohoutek, Jiří; Gasić, Bojan; Kovacić, Igor; Lakić, Nataša; Radić, Ranka

    2010-12-01

    Polycyclic aromatic hydrocarbons (PAHs) were measured together with inorganic air pollutants at two urban sites and one rural background site in the Banja Luka area, Bosnia and Hercegovina, during 72 h in July 2008 using a high time resolution (5 samples per day) with the aim to study the spatial and temporal variabilities and to explore the significance of averaging effects inherent to 24 h-sampling. Measurement uncertainty was quantified on basis of three independent side-by-side samplers, deployed at one of the sites. PAH abundances in the urban and rural environments differed largely. Levels at the urban sites exceeded the levels at the rural site by >100%. The discrepancy was largely dominated by emission of 3-4 ring PAHs in the city, while 5-6 ring PAHs were more evenly distributed between city sites and the hill site. During the night a higher fraction of the semivolatile PAHs might have been stored in the soil or sorbed to surfaces. PAH patterns were undistinguishable across the three sites. However, concentrations of more particle-associated substances differed significantly between the urban sites than between one of the urban sites and the rural site (3 σ uncertainty). Time-averaging (on a 24 h-basis) would have masked the significant inter-site differences of half of the substances which were found at different levels (on a 4 h-basis).

  13. Indoor air quality in Portuguese schools: levels and sources of pollutants.

    PubMed

    Madureira, J; Paciência, I; Pereira, C; Teixeira, J P; Fernandes, E de O

    2016-08-01

    Indoor air quality (IAQ) parameters in 73 primary classrooms in Porto were examined for the purpose of assessing levels of volatile organic compounds (VOCs), aldehydes, particulate matter, ventilation rates and bioaerosols within and between schools, and potential sources. Levels of VOCs, aldehydes, PM2.5 , PM10 , bacteria and fungi, carbon dioxide (CO2 ), carbon monoxide, temperature and relative humidity were measured indoors and outdoors and a walkthrough survey was performed concurrently. Ventilation rates were derived from CO2 and occupancy data. Concentrations of CO2 exceeding 1000 ppm were often encountered, indicating poor ventilation. Most VOCs had low concentrations (median of individual species <5 μg/m(3) ) and were below the respective WHO guidelines. Concentrations of particulate matter and culturable bacteria were frequently higher than guidelines/reference values. The variability of VOCs, aldehydes, bioaerosol concentrations, and CO2 levels between schools exceeded the variability within schools. These findings indicate that IAQ problems may persist in classrooms where pollutant sources exist and classrooms are poorly ventilated; source control strategies (related to building location, occupant behavior, maintenance/cleaning activities) are deemed to be the most reliable for the prevention of adverse health consequences in children in schools.

  14. An improved mathematical model for prediction of air quantity to minimise radiation levels in underground uranium mines.

    PubMed

    Panigrahi, Durga Charan; Sahu, Patitapaban; Mishra, Devi Prasad

    2015-02-01

    Ventilation is the primary means of controlling radon and its daughter concentrations in an underground uranium mine environment. Therefore, prediction of air quantity is the vital component for planning and designing of ventilation systems to minimise the radiation exposure of miners in underground uranium mines. This paper comprehensively describes the derivation and verification of an improved mathematical model for prediction of air quantity, based on the growth of radon daughters in terms of potential alpha energy concentration (PAEC), to reduce the radiation levels in uranium mines. The model also explains the prediction of air quantity depending upon the quality of intake air to the stopes. This model can be used to evaluate the contribution of different sources to radon concentration in mine atmosphere based on the measurements of radon emanation and exhalation. Moreover, a mathematical relationship has been established for quick prediction of air quantity to achieve the desired radon daughter concentration in the mines.

  15. Urban morphology and air quality in dense residential environments in Hong Kong. Part I: District-level analysis

    NASA Astrophysics Data System (ADS)

    Edussuriya, P.; Chan, A.; Ye, A.

    2011-09-01

    The link between urban morphology and air quality in various dense residential environments of Hong Kong are investigated through field measurements and statistical analysis. With regard to the myriads of parameters available in the literature, this study aims to identify the most important urban morphological parameters in the street-level and district levels that affect air quality dispersion in Hong Kong. The study postulates that there is an association between urban morphology and urban air quality and a statistical model is developed to explain the relationship amongst urban air quality, micro-meteorology and urban morphological dimension. The study considered 20 different urban residential areas in five major districts of Hong Kong and real-time street-level air pollutant and microclimatic data are collected. 21 morphological variables are identified and calculated based on the geometry of the urban fabric. This study is the first part of a series which focuses to identify whether district demarcation is correlated with air quality. According to the findings of statistical analysis, only 6 out of 21 morphological variables (complete aspect ratio, occlusivity, roughness height, zero-plane displacement height, total building volume/number of buildings, and standard deviation of height) report distinguishable variability at the district level. Their R2 (correlation coefficient) values vary from 0.2937 (plan area index) to 0.5457 (occlusivity) which is considered moderate to high. All these parameters describe the overall feature of the site rather than the specific geometric features of the street. It translates to the fact that in spite of the large in-district variations in morphological variables amongst the five districts, air pollution variations are insignificant for most of the variables and it means that air quality in Hong Kong are distinguishable not by district-level variable but rather in-site fabrics.

  16. Morphology and Shear Strength of Lead-Free Solder Joints with Sn3.0Ag0.5Cu Solder Paste Reinforced with Ceramic Nanoparticles

    NASA Astrophysics Data System (ADS)

    Yakymovych, A.; Plevachuk, Yu.; Švec, P.; Švec, P.; Janičkovič, D.; Šebo, P.; Beronská, N.; Roshanghias, A.; Ipser, H.

    2016-12-01

    To date, additions of different oxide nanoparticles is one of the most widespread procedures to improve the mechanical properties of metals and metal alloys. This research deals with the effect of minor ceramic nanoparticle additions (SiO2, TiO2 and ZrO2) on the microstructure and mechanical properties of Cu/solder/Cu joints. The reinforced Sn3.0Ag0.5Cu (SAC305) solder alloy with 0.5 wt.% and 1.0 wt.% of ceramic nanoparticles was prepared through mechanically stirring. The microstructure of as-solidified Cu/solder/Cu joints was studied using scanning electron microscopy. The additions of ceramic nanoparticles suppressed the growth of the intermetallic compound layer Cu6Sn5 at the interface solder/Cu and improved the microstructure of the joints. Furthermore, measurements of mechanical properties showed improved shear strength of Cu/composite solder/Cu joints compared to joints with unreinforced solder. This fact related to all investigated ceramic nanoinclusions and should be attributed to the adsorption of nanoparticles on the grain surface during solidification. However, this effect is less pronounced on increasing the nanoinclusion content from 0.5 wt.% to 1.0 wt.% due to agglomeration of nanoparticles. Moreover, a comparison analysis showed that the most beneficial influence was obtained by minor additions of SiO2 nanoparticles into the SAC305 solder alloy.

  17. Cartan's soldered spaces and conservation laws in physics

    NASA Astrophysics Data System (ADS)

    Kouneiher, Joseph; Barbachoux, Cécile

    2015-06-01

    In this paper, we will introduce a generalized soldering p-forms geometry, which can be the right framework to describe many new approaches and concepts in modern physics. Here we will treat some aspects of the theory of local cohomology in fields theory or more precisely the theory of soldering-form conservation laws in physics. We provide some illustrative applications, primarily taken from the Einstein equations of general theory of relativity and Yang-Mills theory. This theory can be considered to be a generalization of Noether's theory of conserved current to differential forms of any degree. An essential result of this, is that the conservation of the energy-momentum in general relativity, is linked to the fact that the vacuum field equations are equivalent to the integrability conditions of a first-order system of differential equations. We also apply the idea of the soldered space and the integrability conditions to the case of Yang-Mills theory. The mathematical framework, where these intuitive considerations would fit naturally, can be used to describe also the dynamics of changing manifolds.

  18. Laser-assisted solder closure of bronchial stumps

    NASA Astrophysics Data System (ADS)

    Oz, Mehmet C.; Williams, Matthew R.; Moscarelli, Richard D.; Kaynar, Murat; Fras, Christian I.; Libutti, Steven K.; Smith, Hillary; Setton, Adrianne J.; Treat, Michael R.; Nowygrod, Roman

    1992-06-01

    Broncho-pleural fistula is a difficult clinical problem without a simple solution. Laser-assisted solder techniques potentially offer a means to precisely fix tissue glues into the fistulae through a bronchoscopic approach. Using a canine model, secondary bronchi were sealed with cryoprecipitate made from solvent/detergent treated plasma (treated to inactivate membrane enveloped virus) mixed with indocyanine green (absorption 805 nm). Diode laser energy (emission 808 nm, 7.3 W/cm2) was applied to the solder until desiccation was observed. Leakage pressures ranged between 18 - 86 mmHg with a mean of 46 +/- 24 mmHg. Laser-assisted solder techniques provide a reliably strong seal over leaking bronchial stumps and use of dye enhancement prevents undesired collateral thermal injury to surrounding bronchial tissue. Solvent/detergent plasma, prepared by methods shown to inactivate large quantities of HIV, HBV, and HCV, is an effective source of cyroprecipitate and should allow widespread use of pooled human material in a clinical setting.

  19. The Melting Characteristics and Interfacial Reactions of Sn-ball/Sn-3.0Ag-0.5Cu-paste/Cu Joints During Reflow Soldering

    NASA Astrophysics Data System (ADS)

    Huang, J. Q.; Zhou, M. B.; Zhang, X. P.

    2017-03-01

    In this work, the melting characteristics and interfacial reactions of Sn-ball/Sn-3.0Ag-0.5Cu-paste/Cu (Sn/SAC305-paste/Cu) structure joints were studied using differential scanning calorimetry, in order to gain a deeper and broader understanding of the interfacial behavior and metallurgical combination among the substrate (under-bump metallization), solder ball and solder paste in a board-level ball grid array (BGA) assembly process, which is often seen as a mixed assembly using solder balls and solder pastes. Results show that at the SAC305 melting temperature of 217°C, neither the SAC305-paste nor the Sn-ball coalesce, while an interfacial reaction occurs between the SAC305-paste and Cu. A slight increase in reflow temperature (from 217°C to 218°C) results in the coalescence of the SAC305-paste with the Sn-ball. The Sn-ball exhibits premelting behavior at reflow temperatures below its melting temperature, and the premelting direction is from the bottom to the top of the Sn-ball. Remarkably, at 227°C, which is nearly 5°C lower than the melting point of pure Sn, the Sn-ball melts completely, resulting from two eutectic reactions, i.e., the reaction between Sn and Cu and that between Sn and Ag. Furthermore, a large amount of bulk Cu6Sn5 phase forms in the solder due to the quick dissolution of Cu substrate when the reflow temperature is increased to 245°C. In addition, the growth of the interfacial Cu6Sn5 layer at the SAC305-paste/Cu interface is controlled mainly by grain boundary diffusion, while the growth of the interfacial Cu3Sn layer is controlled mainly by bulk diffusion.

  20. 3D FEM Simulations of Drop Test Reliability on 3D-WLP: Effects of Solder Reflow Residual Stress and Molding Resin Parameters

    NASA Astrophysics Data System (ADS)

    Belhenini, Soufyane; Tougui, Abdellah; Bouchou, Abdelhake; Mohan, Ranganathan; Dosseul, Franck

    2014-01-01

    Numerous three-dimensional (3D) packaging technologies are currently used for 3D integration. 3D-wafer level package (3D-WLP) appears to be a way to keep increasing the density of the microelectronic components. The reliability of 3D components has to be evaluated on mechanical demonstrators with daisy chains before real production. Numerical modeling is acknowledged as a very efficient tool for design optimization. In this paper, 3D finite-elements calculations are carried out to analyze the effects of molding resin's mechanical properties and thickness on the 3D component's dynamic response under drop loading conditions. Residual stress generated by solder reflow is also discussed. The influences of residual stresses on the numerical estimation of the component behavior during drop loading are studied. Solder reflow residual stresses have an impact on solder plastic strain and die equivalent stress calculations. We have compared the result of two numerical drop test models. Stress-free initial conduction is introduced for the first model. Solder reflow residual stresses are considered as the initial condition for the second drop test model. Quantitative and qualitative comparisons are carried out to show the effect of residual stress in drop test calculations. For the effect of molding resin thickness on the component behavior under drop loading, the stress-free initial condition is considered. The effect of the molding resin's thickness on critical area location is discussed. The solder bump maximum plastic shear strain and the silicon die maximum equivalent stress are used as reliability criteria. Numerical submodeling techniques are used to increase calculation accuracy. Numerical results have contributed to the design optimization of the 3D-WLP component.

  1. The Melting Characteristics and Interfacial Reactions of Sn-ball/Sn-3.0Ag-0.5Cu-paste/Cu Joints During Reflow Soldering

    NASA Astrophysics Data System (ADS)

    Huang, J. Q.; Zhou, M. B.; Zhang, X. P.

    2016-12-01

    In this work, the melting characteristics and interfacial reactions of Sn-ball/Sn-3.0Ag-0.5Cu-paste/Cu (Sn/SAC305-paste/Cu) structure joints were studied using differential scanning calorimetry, in order to gain a deeper and broader understanding of the interfacial behavior and metallurgical combination among the substrate (under-bump metallization), solder ball and solder paste in a board-level ball grid array (BGA) assembly process, which is often seen as a mixed assembly using solder balls and solder pastes. Results show that at the SAC305 melting temperature of 217°C, neither the SAC305-paste nor the Sn-ball coalesce, while an interfacial reaction occurs between the SAC305-paste and Cu. A slight increase in reflow temperature (from 217°C to 218°C) results in the coalescence of the SAC305-paste with the Sn-ball. The Sn-ball exhibits premelting behavior at reflow temperatures below its melting temperature, and the premelting direction is from the bottom to the top of the Sn-ball. Remarkably, at 227°C, which is nearly 5°C lower than the melting point of pure Sn, the Sn-ball melts completely, resulting from two eutectic reactions, i.e., the reaction between Sn and Cu and that between Sn and Ag. Furthermore, a large amount of bulk Cu6Sn5 phase forms in the solder due to the quick dissolution of Cu substrate when the reflow temperature is increased to 245°C. In addition, the growth of the interfacial Cu6Sn5 layer at the SAC305-paste/Cu interface is controlled mainly by grain boundary diffusion, while the growth of the interfacial Cu3Sn layer is controlled mainly by bulk diffusion.

  2. A microstructural analysis of solder joints from the electronic assemblies of dismantled nuclear weapons

    SciTech Connect

    Vianco, P.T.; Rejent, J.A.

    1997-05-01

    MC1814 Interconnection Boxes from dismantled B57 bombs, and MC2839 firing Sets from retired W70-1 warheads were obtained from the Pantex facility. Printed circuit boards were selected from these components for microstructural analysis of their solder joints. The analysis included a qualitative examination of the solder joints and quantitative assessments of (1) the thickness of the intermetallic compound layer that formed between the solder and circuit board Cu features, and (2) the Pb-rich phase particle distribution within the solder joint microstructure. The MC2839 solder joints had very good workmanship qualities. The intermetallic compound layer stoichiometry was determined to be that of Cu6Sn5. The mean intermetallic compound layer thickness for all solder joints was 0.885 mm. The magnitude of these values did not indicate significant growth over the weapon lifetime. The size distribution of the Pb-rich phase particles for each of the joints were represented by the mean of 9.85 {times} 10{sup {minus}6} mm{sup 2}. Assuming a spherical geometry, the mean particle diameter would be 3.54 mm. The joint-to-joint difference of intermetallic compound layer thickness and Pb-rich particle size distribution was not caused by varying thermal environments, but rather, was a result of natural variations in the joint microstructure that probably existed at the time of manufacture. The microstructural evaluation of the through-hole solder joints form the MC2839 and MC1814 components indicated that the environmental conditions to which these electronic units were exposed in the stockpile, were benign regarding solder joint aging. There was an absence of thermal fatigue damage in MC2839 circuit board, through-hole solder joints. The damage to the eyelet solder joints of the MC1814 more likely represented infant mortality failures at or very near the time of manufacture, resulting from a marginal design status of this type of solder joint design.

  3. Exploring EKC, trends of growth patterns and air pollutants concentration level in Malaysia: A Nemerow Index Approach

    NASA Astrophysics Data System (ADS)

    Bekhet, Hussain A.; >Tahira Yasmin,

    2013-06-01

    The present study examines an Environmental Kuznets Curve (EKC) hypothesis by analyzing annual data of air pollutants concentartion and per capita GDP as economic indicator over the (1996-2010) period in Malaysia. Nemerow Index Approach (I) used to generate a measures of air pollution. The results show that ambient air quality indicators supports the EKC hypothesis which stated that pollution levels increase as a country develops, but begin to decrease as rising incomes pass beyond a turning poin. Also, the I result is justifying that most pollutants are showing value less than 1.

  4. Distribution of air and serum PCDD/F levels of electric arc furnaces and secondary aluminum and copper smelters.

    PubMed

    Lee, Ching-Chang; Shih, Tung-Seng; Chen, Hsiu-Ling

    2009-12-30

    Metallurgical processes, such as smelting, can generate organic impurities such as organic chloride chemicals, polychlorinated dibenzo-p-dioxins and polychlorinated dibenzofurans (PCDD/Fs). The objective of this study was to elucidate the serum PCDD/F levels of 134 workers and ambient air levels around electric arc furnaces (EAF), secondary copper smelters and secondary aluminum smelters (ALSs) in Taiwan. The highest serum PCDD/F levels were found in the ALSs workers (21.9 pg WHO-TEQ/g lipid), with lower levels in copper smelter workers (21.5 pg WHO-TEQ/g lipid), and the lowest in the EAF plant workers (18.8 pg WHO-TEQ/g lipid). This was still higher than the levels for residents living within 5 km of municipal waste incinerators (14.0 pg WHO-TEQ/g lipid). For ambient samples, the highest ambient air PCDD/F level was in the copper smelters (12.4 pg WHO-TEQ/Nm(3)), with lower levels in ALSs (7.2 pg WHO-TEQ/Nm(3)), and the lowest in the EAF industry (1.8 pg WHO-TEQ/Nm(3)). The congener profiles were consistent in serum and in air samples collected in the copper smelters, but not for ALSs and EAF. In secondary copper smelters, the air PCDD/Fs levels might be directly linked to the PCDD/Fs accumulated in the workers due to the exceedingly stable congener pattern of the PCDD/F emission.

  5. Peak Sound Pressure Levels and Associated Auditory Risk from an H[subscript 2]-Air "Egg-Splosion"

    ERIC Educational Resources Information Center

    Dolhun, John J.

    2016-01-01

    The noise level from exploding chemical demonstrations and the effect they could have on audiences, especially young children, needs attention. Auditory risk from H[subscript 2]- O2 balloon explosions have been studied, but no studies have been done on H[subscript 2]-air "eggsplosions." The peak sound pressure level (SPL) was measured…

  6. NIST gravimetrically prepared atmospheric level methane in dry air standards suite.

    PubMed

    Rhoderick, George C; Carney, Jennifer; Guenther, Franklin R

    2012-04-17

    The Gas Metrology Group at the National Institute of Standards and Technology was tasked, by a congressional climate change act, to support the atmospheric measurement community through standards development of key greenhouse gases. This paper discusses the development of a methane (CH(4)) primary standard gas mixture (PSM) suite to support CH(4) measurement needs over a large amount-of-substance fraction range 0.3-20,000 μmol mol(-1), but with emphasis at the atmospheric level 300-4000 nmol mol(-1). Thirty-six CH(4) in dry air PSMs were prepared in 5.9 L high-pressure aluminum cylinders with use of a time-tested gravimetric technique. Ultimately 14 of these 36 PSMs define a CH(4) standard suite covering the nominal ambient atmospheric range of 300-4000 nmol mol(-1). Starting materials of pure CH(4) and cylinders of dry air were exhaustively analyzed to determine the purity and air composition. Gas chromatography with flame-ionization detection (GC-FID) was used to determine a CH(4) response for each of the 14 PSMs where the reproducibility of average measurement ratios as a standard error was typically (0.04-0.26) %. An ISO 6134-compliant generalized least-squares regression (GenLine) program was used to analyze the consistency of the CH(4) suite. All 14 PSMs passed the u-test with residuals between the gravimetric and the GenLine solution values being between -0.74 and 1.31 nmol mol(-1); (0.00-0.16)% relative absolute. One of the 14 PSMs, FF4288 at 1836.16 ± 0.75 nmol mol(-1) (k = 1) amount-of-substance fraction, was sent to the Korea Research Institute of Standards and Science (KRISS), the Republic of Korea's National Metrology Institute, for comparison. The same PSM was subsequently sent to the National Oceanic and Atmospheric Administration (NOAA) for analysis to their standards. Results show agreement between KRISS-NIST of +0.13% relative (+2.3 nmol mol(-1)) and NOAA-NIST of -0.14% relative (-2.54 nmol mol(-1)).

  7. Estimating Causal Effects of Local Air Pollution on Daily Deaths: Effect of Low Levels

    PubMed Central

    Schwartz, Joel; Bind, Marie-Abele; Koutrakis, Petros

    2016-01-01

    further control efforts. Citation: Schwartz J, Bind MA, Koutrakis P. 2017. Estimating causal effects of local air pollution on daily deaths: effect of low levels. Environ Health Perspect 125:23–29; http://dx.doi.org/10.1289/EHP232 PMID:27203595

  8. On evaluating compliance with air pollution levels not to be exceeded more than once per year

    NASA Technical Reports Server (NTRS)

    Neustadter, H. E.; Sidik, S. M.

    1974-01-01

    The adequacy is considered of currently practiced monitoring and data reduction techniques for assessing compliance with 24-hour Air Quality Standards (AQS) not to be exceeded more than once per year. The present situation for suspended particulates is discussed. The following conclusions are reached: (1) For typical less than daily sampling (i.e., 60 to 120 24-hour samples per year) the deviation from independence of the data set should not be substantial. (2) The interchange of exponentiation and expectation operations in the EPA data reduction model, underestimates the second highest level by about 4 to 8 percent for typical sigma values. (3) Estimates of the second highest pollution level have associated with them a large statistical variability arising from the finite size of the sample. The 0.95 confidence interval ranges from + or - 40 percent for 120 samples per year to + or - 84 percent for 30 samples per year. (4) The design value suggested by EPA for abatement and/or control planning purposes typically gives a margin of safety of 60 to 120 percent.

  9. Physical Activity- and Alcohol-dependent Association Between Air Pollution Exposure and Elevated Liver Enzyme Levels: An Elderly Panel Study

    PubMed Central

    Kim, Kyoung-Nam; Lee, Hyemi; Kim, Jin Hee; Jung, Kweon; Lim, Youn-Hee; Hong, Yun-Chul

    2015-01-01

    Objectives: The deleterious effects of air pollution on various health outcomes have been demonstrated. However, few studies have examined the effects of air pollution on liver enzyme levels. Methods: Blood samples were drawn up to three times between 2008 and 2010 from 545 elderly individuals who regularly visited a community welfare center in Seoul, Korea. Data regarding ambient air pollutants (particulate matter ≤2.5 μm [PM2.5], nitrogen dioxide [NO2], ozone [O3], carbon monoxide, and sulfur dioxide) from monitoring stations were used to estimate air pollution exposure. The effects of the air pollutants on the concentrations of three liver enzymes (aspartate aminotransferase [AST], alanine aminotransferase [ALT], and γ-glutamyltranspeptidase [γ-GTP)]) were evaluated using generalized additive and linear mixed models. Results: Interquartile range increases in the concentrations of the pollutants showed significant associations of PM2.5 with AST (3.0% increase, p=0.0052), ALT (3.2% increase, p=0.0313), and γ-GTP (5.0% increase, p=0.0051) levels; NO2 with AST (3.5% increase, p=0.0060) and ALT (3.8% increase, p=0.0179) levels; and O3 with γ-GTP (5.3% increase, p=0.0324) levels. Significant modification of these effects by exercise and alcohol consumption was found (p for interaction <0.05). The effects of air pollutants were greater in non-exercisers and heavy drinkers. Conclusions: Short-term exposure to air pollutants such as PM2.5, NO2, and O3 is associated with increased liver enzyme levels in the elderly. These adverse effects can be reduced by exercising regularly and abstinence from alcohol. PMID:26081652

  10. 30 CFR 77.1111 - Welding, cutting, soldering; use of fire extinguisher.

    Code of Federal Regulations, 2013 CFR

    2013-07-01

    ... 30 Mineral Resources 1 2013-07-01 2013-07-01 false Welding, cutting, soldering; use of fire... OF UNDERGROUND COAL MINES Fire Protection § 77.1111 Welding, cutting, soldering; use of fire extinguisher. One portable fire extinguisher shall be provided at each location where welding, cutting,...

  11. 30 CFR 77.1111 - Welding, cutting, soldering; use of fire extinguisher.

    Code of Federal Regulations, 2014 CFR

    2014-07-01

    ... 30 Mineral Resources 1 2014-07-01 2014-07-01 false Welding, cutting, soldering; use of fire... OF UNDERGROUND COAL MINES Fire Protection § 77.1111 Welding, cutting, soldering; use of fire extinguisher. One portable fire extinguisher shall be provided at each location where welding, cutting,...

  12. 30 CFR 77.1111 - Welding, cutting, soldering; use of fire extinguisher.

    Code of Federal Regulations, 2012 CFR

    2012-07-01

    ... 30 Mineral Resources 1 2012-07-01 2012-07-01 false Welding, cutting, soldering; use of fire... OF UNDERGROUND COAL MINES Fire Protection § 77.1111 Welding, cutting, soldering; use of fire extinguisher. One portable fire extinguisher shall be provided at each location where welding, cutting,...

  13. 30 CFR 77.1111 - Welding, cutting, soldering; use of fire extinguisher.

    Code of Federal Regulations, 2011 CFR

    2011-07-01

    ... 30 Mineral Resources 1 2011-07-01 2011-07-01 false Welding, cutting, soldering; use of fire... OF UNDERGROUND COAL MINES Fire Protection § 77.1111 Welding, cutting, soldering; use of fire extinguisher. One portable fire extinguisher shall be provided at each location where welding, cutting,...

  14. The automated system for technological process of spacecraft's waveguide paths soldering

    NASA Astrophysics Data System (ADS)

    Tynchenko, V. S.; Murygin, A. V.; Emilova, O. A.; Bocharov, A. N.; Laptenok, V. D.

    2016-11-01

    The paper solves the problem of automated process control of space vehicles waveguide paths soldering by means of induction heating. The peculiarities of the induction soldering process are analyzed and necessity of information-control system automation is identified. The developed automated system makes the control of the product heating process, by varying the power supplied to the inductor, on the basis of information about the soldering zone temperature, and stabilizing the temperature in a narrow range above the melting point of the solder but below the melting point of the waveguide. This allows the soldering process automating to improve the quality of the waveguides and eliminate burn-troughs. The article shows a block diagram of a software system consisting of five modules, and describes the main algorithm of its work. Also there is a description of the waveguide paths automated soldering system operation, for explaining the basic functions and limitations of the system. The developed software allows setting of the measurement equipment, setting and changing parameters of the soldering process, as well as view graphs of temperatures recorded by the system. There is shown the results of experimental studies that prove high quality of soldering process control and the system applicability to the tasks of automation.

  15. Assessment of circuit board surface finishes for electronic assembly with lead-free solders

    SciTech Connect

    Ray, U.; Artaki, I.; Finley, D.W.; Wenger, G.M.; Pan, T.; Blair, H.D.; Nicholson, J.M.; Vianco, P.T.

    1996-10-01

    The suitability of various metallic printed wiring board surface finishes was assessed for new technology applications that incorporate assembly with Lead-free solders. The manufacture of a lead-free product necessitates elimination of lead (Pb) from the solder, the circuit board as well as the component lead termination. It is critical however for the selected interconnect Pb-free solder and the corresponding printed wiring board (PWB) and component lead finishes to be mutually compatible. Baseline compatibility of select Pb-free solders with Pb containing PWB surface finish and components was assessed. This was followed by examining the compatibility of the commercially available CASTIN{trademark} (SnAgCuSb) Pb-free solder with a series of PWB metallic finishes: Ni/Au, Ni/Pd, and Pd/Cu. The compatibility was assessed with respect to assembly performance, solder joint integrity and long term attachment reliability. Solder joint integrity and mechanical behavior of representative 50 mil pitch 20I/O SOICs was determined before and after thermal stress. Mechanical pull test studies demonstrated that the strength of SnAgCuSb solder interconnections is notably greater than that of SnPb interconnections.

  16. New multicomponent solder alloys of low melting pointfor low-cost commercial electronic assembly

    NASA Astrophysics Data System (ADS)

    Al-Ganainy, G. S.; Sakr, M. S.

    2003-09-01

    The requirements of the telecommunications, automobile, electronics and aircraft industries for non-toxic solders with melting points close to that of near-eutectic Pb-Sn alloys has led to the development of new Sn-Zn-In solder alloys. Differential thermal analysis (DTA) shows melting points of 198, 195, 190 and 185 +/- 2 °C for the alloys Sn-9Zn, Sn-9Zn-2In, Sn-9Zn-4In and Sn-9Zn-6In, respectively. An equation that fits the data relating the melting point to the In content in the solders is derived. The X-ray diffraction patterns are analyzed to determine the phases that exist in each solder. The stress-strain curves are studied in the temperature range from 90 to 130 °C for all the solders except for those that contain 4 wt% of In, where the temperature range continues to 150 °C. The work-hardening parameters, y (the yield stress), f (the fracture stress), and the parabolic work-hardening coefficient X, increase with increasing indium content in the solders at all working temperatures. They decrease with increasing working temperature for each solder, and show two relaxation stages only for the Sn-9Zn-4In solder around a temperature of 120 °C. (

  17. 30 CFR 77.1111 - Welding, cutting, soldering; use of fire extinguisher.

    Code of Federal Regulations, 2010 CFR

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, soldering; use of fire... OF UNDERGROUND COAL MINES Fire Protection § 77.1111 Welding, cutting, soldering; use of fire extinguisher. One portable fire extinguisher shall be provided at each location where welding, cutting,...

  18. Dural reconstruction by fascia using a temperature-controlled CO2 laser soldering system

    NASA Astrophysics Data System (ADS)

    Forer, Boaz; Vasilyev, Tamar; Brosh, Tamar; Kariv, Naam; Gil, Ziv; Fliss, Dan M.; Katzir, Abraham

    2005-04-01

    Conventional methods for dura repair are normally based on sutures or stitches. These methods have several disadvantages: (1) The dura is often brittle, and the standard procedures are difficult and time consuming. (2) The seal is leaky. (3) The introduction of a foreign body (e.g. sutures) may cause an inflammatory response. In order to overcome these difficulties we used a temperature controlled fiber optic based CO2 laser soldering system. In a set of in vitro experiments we generated a hole of diameter 10 mm in the dura of a pig corpse, covered the hole with a segment of fascia, and soldered the fascia to the edges of the hole, using 47% bovine albumin as a solder. The soldering was carried out spot by spot, and each spot was heated to 65° C for 3-6 seconds. The soldered dura was removed and the burst pressure of the soldered patch was measured. The average value for microscopic muscular side soldering was 194 mm Hg. This is much higher than the maximal physiological pressure of the CSF fluid in the brain, which is 15 mm Hg. In a set of in vivo experiments, fascia patches were soldered on holes in five farm pigs. The long term results of these experiments were very promising. In conclusion, we have developed an advanced technique for dural reconstruction, which will find important clinical applications.

  19. Method and apparatus for jetting, manufacturing and attaching uniform solder balls

    DOEpatents

    Yost, Frederick G.; Frear, Darrel R.; Schmale, David T.

    1999-01-01

    An apparatus and process for jetting molten solder in the form of balls directly onto all the metallized interconnects lands for a ball grid array package in one step with no solder paste required. Molten solder is jetted out of a grid of holes using a piston attached to a piezoelectric crystal. When voltage is applied to the crystal it expands forcing the piston to extrude a desired volume of solder through holes in the aperture plate. When the voltage is decreased the piston reverses motion creating an instability in the molten solder at the aperture plate surface and thereby forming spherical solder balls that fall onto a metallized substrate. The molten solder balls land on the substrate and form a metallurgical bond with the metallized lands. The size of the solder balls is determined by a combination of the size of the holes in the aperture plate, the duration of the piston pulse, and the displacement of the piston. The layout of the balls is dictated by the location of the hooks in the grid. Changes in ball size and layout can be easily accomplished by changing the grid plate. This invention also allows simple preparation of uniform balls for subsequent supply to BGA users.

  20. Method and apparatus for jetting, manufacturing and attaching uniform solder balls

    DOEpatents

    Yost, F.G.; Frear, D.R.; Schmale, D.T.

    1999-01-05

    An apparatus and process are disclosed for jetting molten solder in the form of balls directly onto all the metallized interconnects lands for a ball grid array package in one step with no solder paste required. Molten solder is jetted out of a grid of holes using a piston attached to a piezoelectric crystal. When voltage is applied to the crystal it expands forcing the piston to extrude a desired volume of solder through holes in the aperture plate. When the voltage is decreased the piston reverses motion creating an instability in the molten solder at the aperture plate surface and thereby forming spherical solder balls that fall onto a metallized substrate. The molten solder balls land on the substrate and form a metallurgical bond with the metallized lands. The size of the solder balls is determined by a combination of the size of the holes in the aperture plate, the duration of the piston pulse, and the displacement of the piston. The layout of the balls is dictated by the location of the hooks in the grid. Changes in ball size and layout can be easily accomplished by changing the grid plate. This invention also allows simple preparation of uniform balls for subsequent supply to BGA users. 7 figs.

  1. Household-level disparities in cancer risks from vehicular air pollution in Miami

    NASA Astrophysics Data System (ADS)

    Collins, Timothy W.; Grineski, Sara E.; Chakraborty, Jayajit

    2015-09-01

    Environmental justice (EJ) research has relied on ecological analyses of socio-demographic data from areal units to determine if particular populations are disproportionately burdened by toxic risks. This article advances quantitative EJ research by (a) examining whether statistical associations found for geographic units translate to relationships at the household level; (b) testing alternative explanations for distributional injustices never before investigated; and (c) applying a novel statistical technique appropriate for geographically-clustered data. Our study makes these advances by using generalized estimating equations to examine distributive environmental inequities in the Miami (Florida) metropolitan area, based on primary household-level survey data and census block-level cancer risk estimates of hazardous air pollutant (HAP) exposure from on-road mobile emission sources. In addition to modeling determinants of on-road HAP cancer risk among all survey participants, two subgroup models are estimated to examine whether determinants of risk differ based on disadvantaged minority (Hispanic and non-Hispanic Black) versus non-Hispanic white racial/ethnic status. Results reveal multiple determinants of risk exposure disparities. In the model including all survey participants, renter-occupancy, Hispanic and non-Hispanic black race/ethnicity, the desire to live close to work/urban services or public transportation, and higher risk perception are associated with greater on-road HAP cancer risk; the desire to live in an amenity-rich environment is associated with less risk. Divergent subgroup model results shed light on the previously unexamined role of racial/ethnic status in shaping determinants of risk exposures. While lower socioeconomic status and higher risk perception predict significantly greater on-road HAP cancer risk among disadvantaged minorities, the desire to live near work/urban services or public transport predict significantly greater risk among

  2. Ground-level air pollution changes during a boreal wildland mega-fire.

    PubMed

    Bytnerowicz, Andrzej; Hsu, Yu-Mei; Percy, Kevin; Legge, Allan; Fenn, Mark E; Schilling, Susan; Frączek, Witold; Alexander, Diane

    2016-12-01

    The 2011 Richardson wildland mega-fire in the Athabasca Oil Sands Region (AOSR) in northern Alberta, Canada had large effects on air quality. At a receptor site in the center of the AOSR ambient PM2.5, O3, NO, NO2, SO2, NH3, HONO, HNO3, NH4(+) and NO3(-) were measured during the April-August 2011 period. Concentrations of NH3, HNO3, NO2, SO2 and O3 were also monitored across the AOSR with passive samplers, providing monthly summer and bi-monthly winter average values in 2010, 2011 and 2012. During the fire, hourly PM2.5 concentrations >450μgm(-3) were measured at the AMS 1 receptor site. The 24-h National Ambient Air Quality Standard (NAAQS) of 35μgm(-3) and the Canada Wide Standard (CWS) of 30μgm(-3) were exceeded on 13days in May and 7days in June. During the fire emission periods, sharp increases in NH3, HONO, HNO3, NH4(+), NO3(-) and total inorganic reactive N concentrations occurred, all closely correlated with the PM2.5 changes. There were large differences in the relative contribution of various N compounds to total inorganic N between the no-fire emission and fire emission periods. While in the absence of fires NO and NO2 dominated, their relative contribution during the fires was ~2 fold smaller, mainly due to increased NH3, NH4(+) and NO3(-). Concentrations of HONO and HNO3 also greatly increased during the fires, but their contribution to the total inorganic N pool was relatively small. Elevated NH3 and HNO3 concentrations affected large areas of northern Alberta during the Richardson Fire. While NH3 and HNO3 concentrations were not at levels considered toxic to plants, these gases contributed significantly to atmospheric N deposition. Generally, no significant changes in O3 and SO2 concentrations were detected and their ambient concentrations were below levels harmful to human health or sensitive vegetation.

  3. Modeling and Simulation - The Effects of Grain Coarsening on Local Stresses and Strains in Solder Microstructure

    SciTech Connect

    Chanchani, R.

    1999-01-21

    A critical issue in the long-term reliability of solder connections used in electronic packages is the joint failure during thermal cycling. Presently in most finite element analysis to predict the solder joint fatigue failures, solder is assumed as a homogeneous single-phase metal. However in the last decade, several metallurgical studies have shown that solder microstructure may have a role in early solder joint failures (ref 1). Investigators have observed (ref 1) that solder microstructure coarsens in local bands during aging and during thermal cycle fatigue. In a failed solder joint, the fatigue cracks are found in these bands of coarse grains. It is speculated that the grain coarsening increases the local strains within the microstructure, thereby increasing the likelihood for a crack to initiate. The objective of this study is to model and simulate the effect of grain coarsening on local stresses and strains. During solidification of eutectic Pb/Sn solder, two types of microstructure form, namely lamellar and equiaxed. In this study, I have developed a computer code to generate both types of microstructures of varying grain coarseness. This code is incorporated into the finite element (FE) code that analyzes the local stresses and strains within the computer-generated microstructure. The FE code, specifically developed for this study, uses an algorithm involving the sparse matrix and iterative solver. This code on a typical single-processor machine will allow the analyst to use over 1 million degrees of freedom. For higher number of degrees of freedom, we have also developed a code to run on a parallel machine using message passing interface. The data reported in this paper were obtained using the single-processor code. The solder microstructure, if assumed to be homogeneous single phase, has gradual variation in local stresses and strains. In 2-phase solder, von mises stresses and strains are heterogeneously distributed. In general, the maximum von mises

  4. Intermetallics Characterization of Lead-Free Solder Joints under Isothermal Aging

    NASA Astrophysics Data System (ADS)

    Choubey, Anupam; Yu, Hao; Osterman, Michael; Pecht, Michael; Yun, Fu; Yonghong, Li; Ming, Xu

    2008-08-01

    Solder interconnect reliability is influenced by environmentally imposed loads, solder material properties, and the intermetallics formed within the solder and the metal surfaces to which the solder is bonded. Several lead-free metallurgies are being used for component terminal plating, board pad plating, and solder materials. These metallurgies react together and form intermetallic compounds (IMCs) that affect the metallurgical bond strength and the reliability of solder joint connections. This study evaluates the composition and extent of intermetallic growth in solder joints of ball grid array components for several printed circuit board pad finishes and solder materials. Intermetallic growth during solid state aging at 100°C and 125°C up to 1000 h for two solder alloys, Sn-3.5Ag and Sn-3.0Ag-0.5Cu, was investigated. For Sn-3.5Ag solder, the electroless nickel immersion gold (ENIG) pad finish was found to result in the lowest IMC thickness compared to immersion tin (ImSn), immersion silver (ImAg), and organic solderability preservative (OSP). Due to the brittle nature of the IMC, a lower IMC thickness is generally preferred for optimal solder joint reliability. A lower IMC thickness may make ENIG a desirable finish for long-life applications. Activation energies of IMC growth in solid-state aging were found to be 0.54 ± 0.1 eV for ENIG, 0.91 ± 0.12 eV for ImSn, and 1.03 ± 0.1 eV for ImAg. Cu3Sn and Cu6Sn5 IMCs were found between the solder and the copper pad on boards with the ImSn and ImAg pad finishes. Ternary (Cu,Ni)6Sn5 intermetallics were found for the ENIG pad finish on the board side. On the component side, a ternary IMC layer composed of Ni-Cu-Sn was found. Along with intermetallics, microvoids were observed at the interface between the copper pad and solder, which presents some concern if devices are subject to shock and vibration loading.

  5. Effect of Lanthanum Doping on the Microstructure of Tin-Silver Solder Alloys

    NASA Astrophysics Data System (ADS)

    Pei, Min; Qu, Jianmin

    2008-03-01

    In this study, quantitative microstructure studies were performed on multiple length scales to investigate the effect of lanthanum (La) doping on Sn-Ag lead-free solder materials. Factors considered in this paper include doping amount, aging temperature, and aging time. It was found that La doping reduces the grain size significantly, and the reduced grain size remains stable during thermal aging. The size of the Ag3Sn particles is also greatly reduced by La doping, and the particles coarsen during thermal aging, albeit at a much reduced rate than in the undoped alloy. The rate of particle coarsening can be described by a cubic-root law. Another observation is that the interparticle spacing remains unaffected by the doping. Therefore, higher La doping level leads to higher volume fraction of the eutectic region due to the increased total number of Ag3Sn particles.

  6. An Investigation of Microstructure and Microhardness of Sn-Cu and Sn-Ag Solders as Functions of Alloy Composition and Cooling Rate

    NASA Astrophysics Data System (ADS)

    Seo, Sun-Kyoung; Kang, Sung K.; Shih, Da-Yuan; Lee, Hyuck Mo

    2009-02-01

    The microstructure and microhardness of Sn- xAg and Sn- xCu solders were investigated as functions of alloy composition and cooling rate. The Ag compositions examined varied from 0.5 wt.% to 3.5 wt.%, while Cu varied from 0.5 wt.% to 2.0 wt.%. Three cooling rates were employed during solidification: 0.02°C/s (furnace cooling), about 10°C/s (air cooling), and 100°C/s or higher (rapid solidification). Sn grain size and orientation were observed by cross-polarization light microscopy and electron-backscattering diffraction (EBSD) techniques. The microhardness was measured to correlate the mechanical properties with alloy compositions and cooling rates. From this study, it was found that both alloy composition and cooling rate can significantly affect the Sn grain size and hardness in Sn-rich solders. The critical factors that affect the microstructure-property relationships of Sn-rich solders are discussed, including grain size, crystal orientation, dendrite cells, twin boundaries, and intermetallic compounds (IMC).

  7. The effects of long-term storage on the solderability of immersion silver coatings.

    SciTech Connect

    Buttry, R. Wayne; Lopez, Edwin Paul; Martin, Joseph; Vianco, Paul Thomas; Lucero, Samuel J.; Rejent, Jerome Andrew

    2006-04-01

    The solderability of an immersion Ag finish was evaluated after the exposure of test specimens to a Battelle Class II environment, which accelerates the storage conditions of light industrial surroundings. The solderability metric was the contact angle, (?C), as determined by the meniscometer/wetting balance technique. Auger surface and depth profile analyses were utilized to identify changes in the coating chemistry. The solderability test results indicate that there was no appreciable loss in solderability when the immersion Ag coated coupons were packaged in vapor phase corrosion (VPC) inhibitor bags and/or inhibitor bags with VPC inhibitor paper and aged for 8 hours, 1 week or 2 weeks in the Battelle Class II environment. An increase in surface carbon concentration after aging did not appear to significantly affect solderability.

  8. Bonding nature of rare-earth-containing lead-free solders

    NASA Astrophysics Data System (ADS)

    Ramirez, Ainissa G.; Mavoori, Hareesh; Jin, Sungho

    2002-01-01

    The ability of rare-earth-containing lead-free solders to wet and bond to silica was investigated. Small additions of Lu (0.5-2 wt. %) added to eutectic Sn-Ag or Au-Sn solder render it directly solderable to a silicon oxide surface. The bonding is attributed to the migration of the rare-earth element to the solder-silica interface for chemical reaction and the creation of an interfacial layer that contains a rare-earth oxide. It was found that additions of rare-earth materials did not significantly modify the solidification microstructure or the melting point. Such oxide-bondable solders can be useful for assembly of various optical communication devices.

  9. Complex of automated equipment and technologies for waveguides soldering using induction heating

    NASA Astrophysics Data System (ADS)

    Murygin, A. V.; Tynchenko, V. S.; Laptenok, V. D.; Emilova, O. A.; Bocharov, A. N.

    2017-02-01

    The article deals with the problem of designing complex automated equipment for soldering waveguides based on induction heating technology. A theoretical analysis of the problem, allowing to form a model of the «inductor-waveguide» system and to carry out studies to determine the form of inducing wire, creating a narrow and concentrated heat zone in the area of the solder joint. Also solves the problem of the choice of the temperature control means, the information from which is used later to generate the effective management of induction soldering process. Designed hardware complex in conjunction with the developed software system is a system of automatic control, allowing to manage the process of induction heating, to prevent overheating and destruction of the soldered products, improve the stability of induction soldering process, to improve the quality of products, thereby reducing time and material costs for the production.

  10. The Resistance and Strength of Soft Solder Splices between Conductors in MICE Coils

    SciTech Connect

    Wu, Hong; Pan, Heng; Green, Michael A; Dietderich, Dan; Gartner, T. E.; Higley, Hugh C; Mentink, M.; Xu, FengYu; Trillaud, F.; Liu, X. K.; Wang, Li; Zheng, S. X.; Tam, D.G.

    2010-08-03

    Two of the three types of MICE magnets will have splices within their coils. The MICE coupling coils may have as many as fifteen one-meter long splices within them. Each of the MICE focusing coils may have a couple of 0.25-meter long conductor splices. Equations for the calculation of resistance of soldered lap splices of various types are presented. This paper presents resistance measurements of soldered lap splices of various lengths. Measured splice resistance is shown for one-meter long splices as a function of the fabrication method. Another important consideration is the strength of the splices. The measured breaking stress of splices of various lengths is presented in this paper. Tin-lead solders and tin-silver solders were used for the splices that were tested. From the data given in this report, the authors recommend that the use of lead free solders be avoided for low temperature coils.

  11. Some Observations of Solder Joint Failure Under Tensile-Compressive Stress

    NASA Technical Reports Server (NTRS)

    Winslow, J. W.

    1993-01-01

    It has long been known that solder joints under mechanical stress are subject to failure. In early electronic systems, such failures were avoided primarily by avoiding the use of solder as a mechanical structural component. The rule was to first make sound wire connections that did not depend mechanically on solder, and only then to solder them. Careful design and miniaturization in modern electronic systems limits the mechanical stresses exerted on solder joints to values less than their yield points, and these joints have become integral parts of the mechanical structures. Unfortunately, while these joints are strong enough when new, they have proven vulnerable to fatigue failures as they age.Details of the fatigue process are poorly understood, making predictions of expected lifetimes difficult.

  12. Robust solder joint attachment of coaxial cable leads to piezoelectric ceramic electrodes

    NASA Astrophysics Data System (ADS)

    Vianco, P. T.

    A technique was developed for the solder attachment of coaxial cable leads to the silver-bearing thick film electrodes on piezoelectric ceramics. Soldering the cable leads directly to the thick film caused bonds with low mechanical strength due to poor solder joint geometry. A barrier coating of 1.5 micron Cu/1.5 micron Ni/1.0 micron Sn deposited on the thick film layer improved the strength of the solder joints by eliminating the absorption of Ag from the thick film which was responsible for the improper solder joint geometry. The procedure does not require special preparation of the electrode surface and is cost effective due to the use of non-precious metal films and the batch processing capabilities of the electron beam deposition technique.

  13. Tensile properties and thermal shock reliability of Sn-Ag-Cu solder joint with indium addition.

    PubMed

    Yu, A-Mi; Jang, Jae-Won; Lee, Jong-Hyun; Kim, Jun-Ki; Kim, Mok-Soon

    2012-04-01

    The thermal shock reliability and tensile properties of a newly developed quaternary Sn-1.2Ag-0.5Cu-0.4In (wt%) solder alloy were investigated and compared to those of ternary Sn-Ag-Cu based Pb-free solder alloys. It was revealed that the Sn-1.2Ag-0.5Cu-0.4In solder alloy shows better thermal shock reliability compared to the Sn-1.0Ag-0.5Cu and Sn-3.0Ag-0.5Cu solder alloys. The quaternary alloy has higher strength than Sn-1.0Ag-0.5Cu alloy, and higher elongation than Sn-3.0Ag-0.5Cu alloy. It was also revealed that the addition of indium promotes the formation of Ag3(Sn, In) phase in the solder joint during reflow process.

  14. The Influence of Processing on Strengthening Mechanisms in Pb-Free Solder Joints

    NASA Astrophysics Data System (ADS)

    Mutuku, Francis; Arfaei, Babak; Cotts, Eric J.

    2017-04-01

    The number, and the spacing, of Ag3Sn precipitates in Sn-Ag-Cu/Cu solder joints were related to separate processing parameters. The mechanical properties of an individual solder joint were directly related to the resulting distribution of different dispersoids in the joint. As the number of Ag3Sn precipitates increased, so did solder joint strength and shear fatigue lifetime. The room-temperature shear fatigue lifetime was inversely correlated with the separation between Ag3Sn precipitates. Bi and Sb solid solution strengthening was found to result in significantly larger values of shear strength and shear fatigue lifetime for one Pb-free solder. Room-temperature shear fatigue lifetime tests were identified as a relatively straightforward, yet sensitive means to gain insight into the reliability of Sn-Ag-Cu (SAC) solder joints.

  15. A novel multi-level interconnect scheme with air as low K inter-metal dielectric for ultradeep submicron application

    NASA Astrophysics Data System (ADS)

    Chen, Chung-Hui; Fang, Yean-Kuen; Lin, Chun-Sheng; Yang, Chih-Wei; Hsieh, Jang-Cheng

    2001-01-01

    In this letter, a novel multi-level interconnect scheme with air as the low K inter-metal dielectric for ultra large scale integrated circuit (ULSI) application in ultradeep submicron (UDSM) range is proposed. The detailed process integration with copper dual damascene processing is described. The feasibility of the scheme is examined by trimethylaluminum Raphael simulation for the effective dielectric constant and the cutoff frequency in a standard divide by three counter. The simulation results are also compared with these reported air gap formation technologies. The results show the developed multi-level interconnect system is suitable for UDSM application.

  16. Effects of bleed air extraction on thrust levels on the F404-GE-400 turbofan engine

    NASA Technical Reports Server (NTRS)

    Yuhas, Andrew J.; Ray, Ronald J.

    1992-01-01

    A ground test was performed to determine the effects of compressor bleed flow extraction on the performance of F404-GE-400 afterburning turbofan engines. The two engines were installed in the F/A-18 High Alpha Research Vehicle at the NASA Dryden Flight Research Facility. A specialized bleed ducting system was installed onto the aircraft to control and measure engine bleed airflow while the aircraft was tied down to a thrust measuring stand. The test was conducted on each engine and at various power settings. The bleed air extraction levels analyzed included flow rates above the manufacturer's maximum specification limit. The measured relationship between thrust and bleed flow extraction was shown to be essentially linear at all power settings with an increase in bleed flow causing a corresponding decrease in thrust. A comparison with the F404-GE-400 steady-state engine simulation showed the estimation to be within +/- 1 percent of measured thrust losses for large increases in bleed flow rate.

  17. Effects of bleed air extraction of thrust levels on the F404-GE-400 turbofan engine

    NASA Technical Reports Server (NTRS)

    Yuhas, Andrew J.; Ray, Ronald J.

    1992-01-01

    A ground test was performed to determine the effects of compressor bleed flow extraction on the performance of F404-GE-400 afterburning turbofan engines. The two engines were installed in the F/A-18 High Alpha Research Vehicle at the NASA Dryden Flight Research Facility. A specialized bleed ducting system was installed onto the aircraft to control and measure engine bleed airflow while the aircraft was tied down to a thrust measuring stand. The test was conducted on each engine and at various power settings. The bleed air extraction levels analyzed included flow rates above the manufacturer's maximum specification limit. The measured relationship between thrust and bleed flow extraction was shown to be essentially linear at all power settings with an increase in bleed flow causing a corresponding decrease in thrust. A comparison with the F404-GE-400 steady-state engine simulation showed the estimation to be within +/- 1 percent of measured thrust losses for large increases is bleed flow rate.

  18. Respiratory Health Symptoms among Students Exposed to Different Levels of Air Pollution in a Turkish City

    PubMed Central

    Gül, Hülya; Gaga, Eftade O.; Döğeroğlu, Tuncay; Özden, Özlem; Ayvaz, Özkan; Özel, Sevda; Güngör, Günay

    2011-01-01

    In this study, we aimed to investigate the frequency of respiratory health symptoms among high school students attending schools at industrial, urban and rural areas in a Turkish city. Three schools located in different zones of the city having different pollution characteristics were chosen based on the pollutant distribution maps using Geographical Information Systems (GIS) software. A cross-sectional survey was performed among 667 high school students in the schools. Outdoor and indoor nitrogen dioxide (NO2) and ozone (O3) concentrations were also measured by passive samplers in the same schools to investigate possible routes of exposure. Chronic pulmonary disease (OR = 1.49; 95%CI: 1.11–1.99; p = 0.008), tightness in the chest (OR = 1.57; 95%CI: 1.22–2.02; p = 0.001), morning cough (OR = 1.81 95%CI: 1.19–2.75; p = 0.006) were higher among students in the industrial zone where nitrogen dioxide and ozone levels were also highest. There were no indoor sources of nitrogen dioxide and ozone exists in the schools except for the dining hall. As a conclusion, this study has noticed that air pollution and respiratory health problems among high school students are high in industrial zones and the use of passive samplers combined with GIS is an effective tool that may be used by public health researchers to identify pollutant zones and persons at risk. PMID:21695031

  19. Role of persistent low-level clouds in mitigating air quality impacts of wintertime cold pool conditions

    NASA Astrophysics Data System (ADS)

    VanReken, Timothy M.; Dhammapala, Ranil S.; Jobson, B. Thomas; Bottenus, Courtney L.; VanderSchelden, Graham S.; Kaspari, Susan D.; Gao, Zhongming; Zhu, Qiurui; Lamb, Brian K.; Liu, Heping; Johnston, Jeff

    2017-04-01

    The Yakima Air Wintertime Nitrate Study (YAWNS) was conducted in January 2013 to investigate the drivers of elevated levels of fine particulate matter (PM2.5) frequently present in the region during winter stagnation periods. An extended stagnation period occurred during the study. For the first four days of the event, skies were clear and the strong diel variation in air pollution patterns were consistent with the expected effects of strong low-level nighttime temperature inversions with moderate mixing during daylight hours. Later in the event a low-level cloud layer formed that persisted over the Yakima Valley for the next seven days while regional conditions remained stagnant. Coincident with the onset of cloud, the levels of all measured primary pollutants, including CO2, CO, NOx, particle number concentration, and black carbon, dropped dramatically and remained low with negligible diel variation for as long as the cloud layer was present. The observed patterns for these air pollutants are consistent with decreased stability and enhanced mixing associated with the cloud-topped boundary layer. Interestingly, levels of secondary pollutants, most notably particulate ammonium nitrate, did not exhibit the same decline. This difference may be due to shifts in the chemical production of secondary pollutants during cloudy conditions, or may merely reflect a further influence of mixing. The results imply that the best strategies for managing wintertime air quality during episodes of persistent cloud are likely different from those needed during clear-sky stagnation events.

  20. Air density 2.7 billion years ago limited to less than twice modern levels by fossil raindrop imprints.

    PubMed

    Som, Sanjoy M; Catling, David C; Harnmeijer, Jelte P; Polivka, Peter M; Buick, Roger

    2012-03-28

    According to the 'Faint Young Sun' paradox, during the late Archaean eon a Sun approximately 20% dimmer warmed the early Earth such that it had liquid water and a clement climate. Explanations for this phenomenon have invoked a denser atmosphere that provided warmth by nitrogen pressure broadening or enhanced greenhouse gas concentrations. Such solutions are allowed by geochemical studies and numerical investigations that place approximate concentration limits on Archaean atmospheric gases, including methane, carbon dioxide and oxygen. But no field data constraining ground-level air density and barometric pressure have been reported, leaving the plausibility of these various hypotheses in doubt. Here we show that raindrop imprints in tuffs of the Ventersdorp Supergroup, South Africa, constrain surface air density 2.7 billion years ago to less than twice modern levels. We interpret the raindrop fossils using experiments in which water droplets of known size fall at terminal velocity into fresh and weathered volcanic ash, thus defining a relationship between imprint size and raindrop impact momentum. Fragmentation following raindrop flattening limits raindrop size to a maximum value independent of air density, whereas raindrop terminal velocity varies as the inverse of the square root of air density. If the Archaean raindrops reached the modern maximum measured size, air density must have been less than 2.3 kg m(-3), compared to today's 1.2 kg m(-3), but because such drops rarely occur, air density was more probably below 1.3 kg m(-3). The upper estimate for air density renders the pressure broadening explanation possible, but it is improbable under the likely lower estimates. Our results also disallow the extreme CO(2) levels required for hot Archaean climates.

  1. Indoor Air Quality in Schools (IAQ): The Importance of Monitoring Carbon Dioxide Levels.

    ERIC Educational Resources Information Center

    Sundersingh, David; Bearg, David W.

    This article highlights indoor air quality and exposure to pollutants at school. Typical air pollutants within schools include environmental tobacco smoke, formaldehyde, volatile organic compounds, nitrogen oxides, carbon monoxide, carbon dioxide, allergens, pathogens, radon, pesticides, lead, and dust. Inadequate ventilation, inefficient…

  2. AIR LEVELS OF CARCINOGENIC POLYCYCLIC AROMATIC HYDROCARBONS FOLLOWING THE WORLD TRADE CENTER DISASTER

    EPA Science Inventory

    The catastrophic collapse of the World Trade Center (WTC) on September 11, 2001, created an immense dust cloud followed by fires that emitted soot into the air of New York City (NYC) well into December. The subsequent cleanup used diesel equipment that further polluted the air un...

  3. ANTIOXIDANT SUPPLEMENTATION AND LUNG FUNCTIONS AMONG ASTHMATIC CHILDREN EXPOSED TO HIGH LEVELS OF AIR POLLUTANTS

    EPA Science Inventory

    Abstract

    Air pollutant exposure has been related to adverse respiratory effects, in particular, in asthmatics. This effect could be the consequence of the oxidative stress caused by air pollutants on the lung. Antioxidant vitamins are free- radical scavengers, and could ha...

  4. Fast formation and growth of high-density Sn whiskers in Mg/Sn-based solder/Mg joints by ultrasonic-assisted soldering: Phenomena, mechanism and prevention

    NASA Astrophysics Data System (ADS)

    Li, M. Y.; Yang, H. F.; Zhang, Z. H.; Gu, J. H.; Yang, S. H.

    2016-06-01

    A universally applicable method for promoting the fast formation and growth of high-density Sn whiskers on solders was developed by fabricating Mg/Sn-based solder/Mg joints using ultrasonic-assisted soldering at 250 °C for 6 s and then subjected to thermal aging at 25 °C for 7 d. The results showed that the use of the ultrasonic-assisted soldering could produce the supersaturated dissolution of Mg in the liquid Sn and lead to the existence of two forms of Mg in Sn after solidification. Moreover, the formation and growth of the high-density whiskers were facilitated by the specific contributions of both of the Mg forms in the solid Sn. Specifically, interstitial Mg can provide the persistent driving force for Sn whisker growth, whereas the Mg2Sn phase can increase the formation probability of Sn whiskers. In addition, we presented that the formation and growth of Sn whiskers in the Sn-based solders can be significantly restricted by a small amount of Zn addition (≥3 wt.%), and the prevention mechanisms are attributed to the segregation of Zn atoms at grain or phase boundaries and the formation of the lamellar-type Zn-rich structures in the solder.

  5. Fast formation and growth of high-density Sn whiskers in Mg/Sn-based solder/Mg joints by ultrasonic-assisted soldering: Phenomena, mechanism and prevention

    PubMed Central

    Li, M. Y.; Yang, H. F.; Zhang, Z. H.; Gu, J. H.; Yang, S. H.

    2016-01-01

    A universally applicable method for promoting the fast formation and growth of high-density Sn whiskers on solders was developed by fabricating Mg/Sn-based solder/Mg joints using ultrasonic-assisted soldering at 250 °C for 6 s and then subjected to thermal aging at 25 °C for 7 d. The results showed that the use of the ultrasonic-assisted soldering could produce the supersaturated dissolution of Mg in the liquid Sn and lead to the existence of two forms of Mg in Sn after solidification. Moreover, the formation and growth of the high-density whiskers were facilitated by the specific contributions of both of the Mg forms in the solid Sn. Specifically, interstitial Mg can provide the persistent driving force for Sn whisker growth, whereas the Mg2Sn phase can increase the formation probability of Sn whiskers. In addition, we presented that the formation and growth of Sn whiskers in the Sn-based solders can be significantly restricted by a small amount of Zn addition (≥3 wt.%), and the prevention mechanisms are attributed to the segregation of Zn atoms at grain or phase boundaries and the formation of the lamellar-type Zn-rich structures in the solder. PMID:27273421

  6. An Approach for Impression Creep of Lead Free Microelectronic Solders

    NASA Astrophysics Data System (ADS)

    Anastasio, Onofrio A.

    2002-06-01

    Currently, the microelectronics industry is transitioning from lead-containing to lead-free solders in response to legislation in the EU and Japan. Before an alternative alloy can be designated as a replacement for current Pb-Sn extensive testing must be accomplished. One major characteristic of the alloy that must be considered is creep. Traditionally, creep testing requires numerous samples and a long tin, which thwarts the generation of comprehensive creep databases for difficult to prepare samples such as microelectronic solder joints. However, a relatively new technique, impression creep enables us to rapidly generate creep data. This test uses a cylindrical punch with a flat end to make an impression on the surface of a specimen under constant load. The steady state velocity of the indenter is found to have the same stress and temperature dependence as the conventional unidirectional creep test using bulk specimens. This thesis examines impression creep tests of eutectic Sn-Ag. A testing program and apparatus was developed constructed based on a servo hydraulic test frame. The apparatus is capable of a load resolution of 0.01N with a stability of plus/minus 0.1N, and a displacement resolution of 0.05 microns with a stability of plus/minus 0.1 microns. Samples of eutectic Sn-Ag solder were reflowed to develop the microstructure used in microelectronic packaging. Creep tests were conducted at various stresses and temperatures and showed that coarse microstructures creep more rapidly than the microstructures in the tested regime.

  7. Assessment of Solder Joint Fatigue Life Under Realistic Service Conditions

    NASA Astrophysics Data System (ADS)

    Hamasha, Sa'd.; Jaradat, Younis; Qasaimeh, Awni; Obaidat, Mazin; Borgesen, Peter

    2014-12-01

    The behavior of lead-free solder alloys under complex loading scenarios is still not well understood. Common damage accumulation rules fail to account for strong effects of variations in cycling amplitude, and random vibration test results cannot be interpreted in terms of performance under realistic service conditions. This is a result of the effects of cycling parameters on materials properties. These effects are not yet fully understood or quantitatively predictable, preventing modeling based on parameters such as strain, work, or entropy. Depending on the actual spectrum of amplitudes, Miner's rule of linear damage accumulation has been shown to overestimate life by more than an order of magnitude, and greater errors are predicted for other combinations. Consequences may be particularly critical for so-called environmental stress screening. Damage accumulation has, however, been shown to scale with the inelastic work done, even if amplitudes vary. This and the observation of effects of loading history on subsequent work per cycle provide for a modified damage accumulation rule which allows for the prediction of life. Individual joints of four different Sn-Ag-Cu-based solder alloys (SAC305, SAC105, SAC-Ni, and SACXplus) were cycled in shear at room temperature, alternating between two different amplitudes while monitoring the evolution of the effective stiffness and work per cycle. This helped elucidate general trends and behaviors that are expected to occur in vibrations of microelectronics assemblies. Deviations from Miner's rule varied systematically with the combination of amplitudes, the sequences of cycles, and the strain rates in each. The severity of deviations also varied systematically with Ag content in the solder, but major effects were observed for all the alloys. A systematic analysis was conducted to assess whether scenarios might exist in which the more fatigue-resistant high-Ag alloys would fail sooner than the lower-Ag ones.

  8. Imaging and Analysis of Void-defects in Solder Joints Formed in Reduced Gravity using High-Resolution Computed Tomography

    NASA Technical Reports Server (NTRS)

    Easton, John W.; Struk, Peter M.; Rotella, Anthony

    2008-01-01

    As a part of efforts to develop an electronics repair capability for long duration space missions, techniques and materials for soldering components on a circuit board in reduced gravity must be developed. This paper presents results from testing solder joint formation in low gravity on a NASA Reduced Gravity Research Aircraft. The results presented include joints formed using eutectic tin-lead solder and one of the following fluxes: (1) a no-clean flux core, (2) a rosin flux core, and (3) a solid solder wire with external liquid no-clean flux. The solder joints are analyzed with a computed tomography (CT) technique which imaged the interior of the entire solder joint. This replaced an earlier technique that required the solder joint to be destructively ground down revealing a single plane which was subsequently analyzed. The CT analysis technique is described and results presented with implications for future testing as well as implications for the overall electronics repair effort discussed.

  9. Levels of persistent organic pollutants in air in China and over the Yellow Sea

    NASA Astrophysics Data System (ADS)

    Lammel, Gerhard; Ghim, Young-Sung; Grados, Amélie; Gao, Huiwang; Hühnerfuss, Heinrich; Lohmann, Rainer

    The occurrence of persistent toxic substances (PTS) in China and possibly their regional transport in the Yellow and East China Seas region was studied. Organochlorines in atmospheric gas-phase and particulate matter were collected by high-volume sampling (filters and polyurethane foams) during 2 weeks in June 2003 (dry season) simultaneously at a Yellow Sea coastal site in an urban area, Qingdao, China, and a rural island site, Gosan, Jeju Island, Korea. Using GC methods, the samples were analysed for 9 persistent organic pollutants (POPs) regulated under the global POP convention, namely aldrin, chlordane ( cis- and trans-isomers CC and TC), DDT and metabolites ( o, p'-DDT, p, p'-DDD, and p, p'-DDE), dieldrin, endrin, heptachlor, hexachlorobenzene (HCB), mirex and PCB (congeners number 28, 52, 101, 153 and 180), and for hexachlorocyclohexane ( α-, β- and γ-isomers), a PTS and now considered for regulation under the convention, too. At the coastal site additionally o, p'-DDE and -DDD, β-endosulfan, isodrin, heptachlorepoxide and δ-HCH, and at the island site additionally p, p'-DDT and 12 additional PCB congeners were analysed. 9 samples were collected at the coastal and 15 (for PCBs 5) at the island site. Long-range advection pathways were determined based on analysed back-trajectory calculations. The mean concentrations of DDT and its metabolites, HCB, HCH, and PCB at the coast were in the 100-1000 pg m -3 range. Higher concentrations prevailed during nighttime. The levels were in general lower at the island site, but not for DDT. Local sources are likely. PCBs were even 2 orders of magnitude lower, suggesting that PCBs are not subject to regional transport but elevated concentrations in air are limited to the source areas. Organochlorine pesticide levels on the other hand were seemingly determined by regional transport over Mainland China rather than by emissions in the coastal area. The currently used pesticides mirex and chlordane were found at elevated

  10. Pb-free Sn-Ag-Cu ternary eutectic solder

    DOEpatents

    Anderson, I.E.; Yost, F.G.; Smith, J.F.; Miller, C.M.; Terpstra, R.L.

    1996-06-18

    A Pb-free solder includes a ternary eutectic composition consisting essentially of about 93.6 weight % Sn-about 4.7 weight % Ag-about 1.7 weight % Cu having a eutectic melting temperature of about 217 C and variants of the ternary composition wherein the relative concentrations of Sn, Ag, and Cu deviate from the ternary eutectic composition to provide a controlled melting temperature range (liquid-solid ``mushy`` zone) relative to the eutectic melting temperature (e.g. up to 15 C above the eutectic melting temperature). 5 figs.

  11. Pb-free Sn-Ag-Cu ternary eutectic solder

    DOEpatents

    Anderson, Iver E.; Yost, Frederick G.; Smith, John F.; Miller, Chad M.; Terpstra, Robert L.

    1996-06-18

    A Pb-free solder includes a ternary eutectic composition consisting essentially of about 93.6 weight % Sn-about 4.7 weight % Ag-about 1.7 weight % Cu having a eutectic melting temperature of about 217.degree. C. and variants of the ternary composition wherein the relative concentrations of Sn, Ag, and Cu deviate from the ternary eutectic composition to provide a controlled melting temperature range (liquid-solid "mushy" zone) relative to the eutectic melting temperature (e.g. up to 15.degree. C. above the eutectic melting temperature).

  12. Air pressure effects on sea level changes during the twentieth century

    NASA Astrophysics Data System (ADS)

    Piecuch, Christopher G.; Thompson, Philip R.; Donohue, Kathleen A.

    2016-10-01

    Interpretation of tide gauge data in terms sea level (η) and ocean dynamics requires estimates of air pressure (pa) to determine the ocean's isostatic response—the inverted barometer effect (ηib). Three gridded pa products (HadSLP2, NOAA-20CRv2, and ERA-20C) are used alongside meteorological station pa and tide gauge η records to evaluate the contribution of ηib to η changes over the twentieth century. Agreement between gridded products is better during more recent periods and over regions with good historical data coverage, whereas it is worse for earlier time periods or in ocean areas with poor observational data coverage. Comparison against station data reveals the presence of systematic errors in the gridded products, for example, such that uncertainties estimated through differencing the gridded products underestimate the true errors by roughly 40% on interannual and decadal time scales. Notwithstanding such correlated errors, gridded products are still useful for interpretation of tide gauge data. Removing gridded estimates of ηib from η records reduces spatial variance in centennial trends across tide gauges by 10-30%, formal errors in centennial trends from individual gauges by ˜5%, and the temporal variance in detrended records by 10-15% on average (depending on choice of gridded product). Results here advocate for making the ηib correction to tide gauge records in studies of ocean circulation and global η over long, multidecadal, and centennial time scales using an ensemble mean taken across several gridded ηib products.

  13. Influence of synoptic and local atmospheric patterns on PM10 air pollution levels: a model application to Naples (Italy)

    NASA Astrophysics Data System (ADS)

    Fortelli, Alberto; Scafetta, Nicola; Mazzarella, Adriano

    2016-10-01

    We investigate the relationship between synoptic/local meteorological patterns and PM10 air pollution levels in the metropolitan area of Naples, Italy. We found that severe air pollution crises occurred when the 850 and 500 hpa geopotential heights and their relative temperatures present maximum values above the city. The most relevant synoptic parameter was the 850 hPa geopotential height, which is located about 1500 m of altitude. We compared local meteorological conditions (specifically wind stress, rain amount and thermal inversion) against the urban air pollution levels from 2009 to 2013. We found several empirical criteria for forecasting high daily PM10 air pollution levels in Naples. Pollution crises occurred when (a) the wind stress was between 1 and 2 m/s, (b) the thermal inversion between two strategic locations was at least 3°C/200 m and (c) it did not significantly rain for at least 7 days. Beside these meteorological conditions, severe pollution crises occurred also during festivals when fireworks and bonfires are lighted, and during anomalous breeze conditions and severe fire accidents. Finally, we propose a basic model to predict PM10 concentration levels from local meteorological conditions that can be easily forecast a few days in advance. The synthetic PM10 record predicted by the model was found to correlate with the PM10 observations with a correlation coefficient close to 0.80 with a confidence level greater than 99%. The proposed model is expected to provide reliable information to city officials to carry out practical strategies to mitigate air pollution effects. Although the proposed model equation is calibrated on the topographical and meteorological conditions of Naples, it should be easily adaptable to alternative locations.

  14. The Analysis of PPM Levels of Gases in Air by Photoionization Mass Spectrometry

    ERIC Educational Resources Information Center

    Driscoll, John N.; Warneck, Peter

    1973-01-01

    Discusses analysis of trace gases in air by photoionization mass spectrometer. It is shown that the necessary sensitivity can be obtained by eliminating the UV monochromator and using direct ionization with a hydrogen light source. (JP)

  15. Energetic delayed hadrons in large air showers observed at 5200m above sea level

    NASA Technical Reports Server (NTRS)

    Kaneko, T.; Hagiwara, K.; Yoshii, H.; Martinic, N.; Siles, L.; Miranda, P.; Kakimoto, F.; Tsuchimoto, I.; Inoue, N.; Suga, K.

    1985-01-01

    Energetic delayed hadrons in air showers with electron sizes in the range 10 to the 6th power to 10 to the 9th power were studied by observing the delayed bursts produced in the shield of nine square meter scintillation detectors in the Chacaltaya air-shower array. The frequency of such delayed burst is presented as a function of electron size, core distance and sec theta.

  16. When the Balloon Goes Up: Barrage Balloons for Low-Level Air Defense.

    DTIC Science & Technology

    1988-04-01

    the British and the Argentines in the Falkland Islands War offer a fairly recent example of fast, ultra low-flying aircraft negating air defenses and...34 (11:45) Against ground targets the Argentine pilots used the same tactics, hugging the contours of the land to shield them against early warning...bottoms for the last two to three hours of daylight. . . .(25:88) The Argentine Air Force scored some noticeable victories during the war despite the long

  17. Air Force Working Capital Fund: Actions Needed to Manage Cash Balances to Required Levels

    DTIC Science & Technology

    2014-07-01

    on receiving daily cash balances. • Because airlift rates are set to compete with private sector rates , they do not cover the full cost. The...the maximum cash requirement for fiscal year 2009. Air Force headquarters officials informed us that when they set the rates to be charged to CSAG and... Rates Too High for Supply Items Monthly Cash Balances Fluctuated Because of the Cyclical Nature of Events Page 12 GAO-14-480 Air Force

  18. Simulation of Grain Growth in a Near-Eutectic Solder Alloy

    SciTech Connect

    TIKARE,VEENA; VIANCO,PAUL T.

    1999-12-16

    Microstructural evolution due to aging of solder alloys determines their long-term reliability as electrical, mechanical and thermal interconnects in electronics packages. The ability to accurately determine the reliability of existing electronic components as well as to predict the performance of proposed designs depends upon the development of reliable material models. A kinetic Monte Carlo simulation was used to simulate microstructural evolution in solder-class materials. The grain growth model simulated many of the microstructural features observed experimentally in 63Sn-37Pb, a popular near-eutectic solder alloy. The model was validated by comparing simulation results to new experimental data on coarsening of Sn-Pb solder. The computational and experimental grain growth exponent for two-phase solder was found to be much lower than that for normal, single phase grain growth. The grain size distributions of solders obtained from simulations were narrower than that of normal grain growth. It was found that the phase composition of solder is important in determining grain growth behavior.

  19. The failure analysis and lifetime prediction for the solder joint of the magnetic head

    NASA Astrophysics Data System (ADS)

    Xiao, Xianghui; Peng, Minfang; Cardoso, Jaime S.; Tang, Rongjun; Zhou, YingLiang

    2015-02-01

    Micro-solder joint (MSJ) lifetime prediction methodology and failure analysis (FA) are to assess reliability by fatigue model with a series of theoretical calculations, numerical simulation and experimental method. Due to shortened time of solder joints on high-temperature, high-frequency sampling error that is not allowed in productions may exist in various models, including round-off error. Combining intermetallic compound (IMC) growth theory and the FA technology for the magnetic head in actual production, this thesis puts forward a new growth model to predict life expectancy for solder joint of the magnetic head. And the impact of IMC, generating from interface reaction between slider (magnetic head, usually be called slider) and bonding pad, on mechanical performance during aging process is analyzed in it. By further researching on FA of solder ball bonding, thesis chooses AuSn4 growth model that affects least to solder joint mechanical property to indicate that the IMC methodology is suitable to forecast the solder lifetime. And the diffusion constant under work condition 60 °C is 0.015354; the solder lifetime t is 14.46 years.

  20. Temperature-controlled laser-soldering system and its clinical application for bonding skin incisions

    NASA Astrophysics Data System (ADS)

    Simhon, David; Gabay, Ilan; Shpolyansky, Gregory; Vasilyev, Tamar; Nur, Israel; Meidler, Roberto; Hatoum, Ossama Abu; Katzir, Abraham; Hashmonai, Moshe; Kopelman, Doron

    2015-12-01

    Laser tissue soldering is a method of repairing incisions. It involves the application of a biological solder to the approximated edges of the incision and heating it with a laser beam. A pilot clinical study was carried out on 10 patients who underwent laparoscopic cholecystectomy. Of the four abdominal incisions in each patient, two were sutured and two were laser soldered. Cicatrization, esthetical appearance, degree of pain, and pruritus in the incisions were examined on postoperative days 1, 7, and 30. The soldered wounds were watertight and healed well, with no discharge from these wounds or infection. The total closure time was equal in both methods, but the net soldering time was much shorter than suturing. There was no difference between the two types of wound closure with respect to the pain and pruritus on a follow-up of one month. Esthetically, the soldered incisions were estimated as good as the sutured ones. The present study confirmed that temperature-controlled laser soldering of human skin incisions is clinically feasible, and the results obtained were at least equivalent to those of standard suturing.

  1. Wound healing studies of skin incisions in animal models: laser soldering versus other bonding methods

    NASA Astrophysics Data System (ADS)

    Simhon, David; Vasilyev, Tamar; Brosh, Tamar; Nevo, Zvi; Tennenbaum, Tamar; Kariv, Naam; Katzir, Abraham

    2003-06-01

    In the past, we have successfully used laser soldering for bonding cuts in the skin of medium and large size animal models. In this work, we have used the same method for bonding cuts on the backs of rabbits and mature pigs model. Cuts were created in dorsally depilated skins of rabbits and mature pigs. 47% bovine serum albumin (BSA) solder was applied onto the approximated edges of each cut, using a special approximation device. An infrared fiberoptic CO2 laser system was used to heat a spot on the cut, under good temperature control, to 65°C for 10 seconds. Other glued or sutured cuts, served as controls. Immediate tensile strength measurements were done on bonded incisions in rabbit skins. We found that laser soldered incisions exhibited similar strength to one bonded by cayanoacrylate glue. No dehiscence of wound edges was found in both treatments. The laser soldering procedure was 25% faster then suturing. A 14-day follow up of the bonded pig skin incisions was carried out, using punch biopsies. We found better aesthetic appearance of the soldered incisions. We observed better and faster wound repair in the laser-soldered scars, using histological and molecular staining. The temperature controlled laser soldering offers immediate strength similar to that of cyanoacrylate glues and better aesthetic and wound healing properties, in comparison to suturing techniques. We have clearly demonstrated the potential of this novel technique, which will pave thw way for clinical studies.

  2. Fatigue Strength of BGA Type Solder Joints between Package and Printed Wiring Board of Portable Device

    NASA Astrophysics Data System (ADS)

    Nagano, Kohta; Yaguchi, Akihiro; Terasaki, Takeshi; Yamamoto, Kenichi

    Solder joints between a package and a printed wiring board (PWB) of a portable electronic device sustain heat cycling as a result of power on-off operations, cyclic bending by key pad operation, and impact bending by dropping. Therefore, heat cycling, cyclic bending, and cyclic impact bending tests were conducted on the ball grid array solder joints between a chip scale package and a PWB. The evaluated solders were Sn-3Ag-0.5Cu and Sn-37Pb. The tests showed that the life cycles of the Sn-3Ag-0.5Cu solder joints for the heat cycling and cyclic bending tests were approximately twice those of the Sn-37Pb solder joints. For the cyclic impact bending test, however, the life cycle of the Sn-3Ag-0.5Cu joint under large strain was smaller than that of the Sn-37Pb solder joint because of interfacial crack growth between the solder and the PWB. Finally, fatigue lives of the joints were compared with crack initiation and failure lives of plain specimens by calculating local strain ranges in the joints by elastic-plastic finite element analysis.

  3. Enhanced laser tissue soldering using indocyanine green chromophore and gold nanoshells combination.

    PubMed

    Khosroshahi, Mohammad E; Nourbakhsh, Mohammad S

    2011-08-01

    Gold nanoshells (GNs) are new materials that have an optical response dictated by the plasmon resonance. The wavelength at which the resonance occurs depends on the core and shell sizes. The purposes of this study were to use the combination of indocyanine green (ICG) and different concentration of gold nanoshells for skin tissue soldering and also to examine the effect of laser soldering parameters on the properties of repaired skin. Two mixtures of albumin solder and different combinations of ICG and gold nanoshells were prepared. A full thickness incision of 2 × 20 mm(2) was made on the surface and after addition of mixtures it was irradiated by an 810 nm diode laser at different power densities. The changes of tensile strength (σ(t)) due to temperature rise, number of scan (Ns), and scan velocity (Vs) were investigated. The results showed at constant laser power density (I), σ(t) of repaired incisions increases by increasing the concentration of gold nanoshells in solder, Ns, and decreasing Vs. It was demonstrated that laser soldering using combination of ICG + GNs could be practical provided the optothermal properties of the tissue are carefully optimized. Also, the tensile strength of soldered skin is higher than skins that soldered with only ICG or GNs. In our case, this corresponds to σ(t) = 1800 g cm(-2) at I ∼ 47 Wcm(-2), T ∼ 85 [ordinal indicator, masculine]C, Ns = 10, and Vs = 0.3 mms(-1).

  4. Detection of micro solder balls using active thermography and probabilistic neural network

    NASA Astrophysics Data System (ADS)

    He, Zhenzhi; Wei, Li; Shao, Minghui; Lu, Xingning

    2017-03-01

    Micro solder ball/bump has been widely used in electronic packaging. It has been challenging to inspect these structures as the solder balls/bumps are often embedded between the component and substrates, especially in flip-chip packaging. In this paper, a detection method for micro solder ball/bump based on the active thermography and the probabilistic neural network is investigated. A VH680 infrared imager is used to capture the thermal image of the test vehicle, SFA10 packages. The temperature curves are processed using moving average technique to remove the peak noise. And the principal component analysis (PCA) is adopted to reconstruct the thermal images. The missed solder balls can be recognized explicitly in the second principal component image. Probabilistic neural network (PNN) is then established to identify the defective bump intelligently. The hot spots corresponding to the solder balls are segmented from the PCA reconstructed image, and statistic parameters are calculated. To characterize the thermal properties of solder bump quantitatively, three representative features are selected and used as the input vector in PNN clustering. The results show that the actual outputs and the expected outputs are consistent in identification of the missed solder balls, and all the bumps were recognized accurately, which demonstrates the viability of the PNN in effective defect inspection in high-density microelectronic packaging.

  5. The failure analysis and lifetime prediction for the solder joint of the magnetic head

    NASA Astrophysics Data System (ADS)

    Xiao, Xianghui; Peng, Minfang; Cardoso, Jaime S.; Tang, Rongjun; Zhou, YingLiang

    2014-09-01

    Micro-solder joint (MSJ) lifetime prediction methodology and failure analysis (FA) are to assess reliability by fatigue model with a series of theoretical calculations, numerical simulation and experimental method. Due to shortened time of solder joints on high-temperature, high-frequency sampling error that is not allowed in productions may exist in various models, including round-off error. Combining intermetallic compound (IMC) growth theory and the FA technology for the magnetic head in actual production, this thesis puts forward a new growth model to predict life expectancy for solder joint of the magnetic head. And the impact of IMC, generating from interface reaction between slider (magnetic head, usually be called slider) and bonding pad, on mechanical performance during aging process is analyzed in it. By further researching on FA of solder ball bonding, thesis chooses AuSn4 growth model that affects least to solder joint mechanical property to indicate that the IMC methodology is suitable to forecast the solder lifetime. And the diffusion constant under work condition 60 °C is 0.015354; the solder lifetime t is 14.46 years.

  6. Wettability Studies of Pb-Free Soldering Materials

    NASA Astrophysics Data System (ADS)

    Moser, Z.; Gąsior, W.; Pstruś, J.; Dębski, A.

    2008-12-01

    For Pb-free soldering materials, two main substitutes are currently being considered, consisting of Sn-Ag and Sn-Ag-Cu eutectics, both with melting points higher than that of the Sn-Pb eutectic. Therefore, both will require higher soldering temperatures for industrial applications. Also, both eutectics have a higher surface tension than the Sn-Pb eutectic, requiring wettability studies on adding Bi, Sb, and In to the eutectics to decrease the melting points and surface tension. The experimental results for the surface tension were compared with thermodynamic modeling by Butler’s method and were used to create the SURDAT database, which also includes densities for pure metals, binary, ternary, quaternary, and quinary alloys. To model the surface tension, excess Gibbs energies of the molten components were taken from the ADAMIS database. For the case of the Ag-Sn system, enthalpies of formation of Ag3Sn from solution calorimetry were used for checking optimized thermodynamic parameters. In the study of Sn-Ag-Cu-Bi-Sb liquid alloys, the range of possible Bi compositions for practical applications has been used to formulate a generalized metric of wettability, which was checked by measurements of the influence of In on the Sn-Ag-Cu system.

  7. High temperature lead-free solder for microelectronics

    NASA Astrophysics Data System (ADS)

    Gayle, Frank W.; Becka, Gary; Syed, Ahmer; Badgett, Jerry; Whitten, Gordon; Pan, Tsung-Yu; Grusd, Angela; Bauer, Brian; Lathrop, Rick; Slattery, Jim; Anderson, Iver; Foley, Jim; Gickler, Alan; Napp, Duane; Mather, John; Olson, Chris

    2001-06-01

    This paper reports results of a four-year industrial consortium effort to develop lead-free solders for high-temperature applications (up to 160°C). Work included preliminary evaluations of 32 tin-based alloys, a screening of the thermomechanical fatigue performance of 13 promising alloys, and a full manufacturability and fatigue testing of the seven most promising of those alloys, namely Sn-3.5Ag, Sn-4Ag-1Cu, Sn-4Ag-0.5Cu, Sn-2.5Ag-0.8Cu-0.5Sb, Sn-4.6Ag-1.6Cu-1Sb-1Bi, Sn-3.3Ag-1Cu-3.3Bi, and Sn-3.5Ag-1.5In (compositions in weight percent). Eight different components were used on the reliability test vehicle, and the alloys were compared through Weibull analysis. In addition, the same seven experimental alloys were tested with ball grid array packages cycled up to 100°C or 125°C. All the lead-free alloys performed well, but those containing bismuth showed especially outstanding performance. In general, the ternary and higher alloys performed as well or better than the industry standard tin-silver eutectic, suggesting that solders other than the tin-silver eutectic should be considered for high-reliability, high-temperature applications.

  8. Recent Observations on Tin Pest Formation in Solder Alloys

    NASA Astrophysics Data System (ADS)

    Plumbridge, W. J.

    2008-02-01

    The most recent observations of the response of bulk samples of several lead-free solder alloys, exposed to temperatures below the allotropic transition for tin for extended periods, are reported. Tin pest has been observed in Sn-0.5Cu, Sn-3.5Ag, Sn-3.8Ag-0.7Cu, and Sn-3.0Ag-0.5Cu alloys at both -18°C and -40°C. The process is slow and inconsistent, usually requiring several years, but may eventually result in complete disintegration of the sample. No tin pest was detected in Sn-Zn-3Bi or in the traditional Sn-37Pb solder alloy after exposure for up to 4 and 10 years, respectively. It is suggested that nucleation is affected by local composition and that extremely small amounts of either intentional solute or impurity are influential. Growth of tin pest is accompanied by a large volume change, and it is likely that stress relaxation ahead of the expanding grey tin front is a controlling factor. A stronger matrix would be more resistant in this case, and at the temperatures of exposure Sn-37Pb is stronger than either Sn-3.5Ag or Sn-0.5Cu. The absence of tin pest, to date, on actual joints is attributed to their restricted free surface area and the greater strength associated with very small samples.

  9. Artificial neural networks as a useful tool to predict the risk level of Betula pollen in the air

    NASA Astrophysics Data System (ADS)

    Castellano-Méndez, M.; Aira, M. J.; Iglesias, I.; Jato, V.; González-Manteiga, W.

    2005-05-01

    An increasing percentage of the European population suffers from allergies to pollen. The study of the evolution of air pollen concentration supplies prior knowledge of the levels of pollen in the air, which can be useful for the prevention and treatment of allergic symptoms, and the management of medical resources. The symptoms of Betula pollinosis can be associated with certain levels of pollen in the air. The aim of this study was to predict the risk of the concentration of pollen exceeding a given level, using previous pollen and meteorological information, by applying neural network techniques. Neural networks are a widespread statistical tool useful for the study of problems associated with complex or poorly understood phenomena. The binary response variable associated with each level requires a careful selection of the neural network and the error function associated with the learning algorithm used during the training phase. The performance of the neural network with the validation set showed that the risk of the pollen level exceeding a certain threshold can be successfully forecasted using artificial neural networks. This prediction tool may be implemented to create an automatic system that forecasts the risk of suffering allergic symptoms.

  10. Effects of Ag on the Kirkendall void formation of Sn-xAg/Cu solder joints

    NASA Astrophysics Data System (ADS)

    Kim, Sunghwan; Yu, Jin

    2010-10-01

    Binary Sn-Ag solders with varying amounts of Ag (0.5, 2.0, and 3.5 wt %) were reacted with Cu under bump metallurgy (UBM) which was electroplated with bis-sodium sulfopropyl-disulfide additive, and the characteristics of Kirkendall void formation at the solder joints were investigated. The results indicate that the propensity to form Kirkendall voids at the solder joint decreased with the Ag content. Subsequent Auger electron spectroscopy analyses showed that Ag dissolved in the Cu UBM reduced the segregation of S to the Cu3Sn/Cu interface, which suppressed the nucleation of Kirkendall voids at the interface.

  11. Fluid Dynamics and Solidification of Molten Solder Droplets Impacting on a Substrate in Microgravity

    NASA Technical Reports Server (NTRS)

    Megardis, C. M.; Poulikakos, D.; Diversiev, G.; Boomsma, K.; Xiong, B.; Nayagam, V.

    1999-01-01

    This program investigates the fluid dynamics and simultaneous solidification of molten solder droplets impacting on a flat smooth substrate. The problem of interest is directly relevant to the printing of microscopic solder droplets in surface mounting of microelectronic devices. The study consists of a theoretical and an experimental component. The theoretical work uses axisymmetric Navier-Stokes models based on finite element techniques. The experimental work will be ultimately performed in microgravity in order to allow for the use of larger solder droplets which make feasible the performance of accurate measurements, while maintaining similitude of the relevant fluid dynamics groups (Re, We).

  12. Fluid Dynamics and Solidification of Molten Solder Droplets Impacting on a Substrate in Microgravity

    NASA Technical Reports Server (NTRS)

    Poulikakos, Dimos; Megaridis, Constantine M.; Vedha-Nayagam, M.

    1996-01-01

    This program investigates the fluid dynamics and simultaneous solidification of molten solder droplets impacting on a flat substrate. The problem of interest is directly relevant to the printing of microscopic solder droplets in surface mounting of microelectronic devices. The study consists of a theoretical and an experimental component. The theoretical work uses axisymmetric Navier-Stokes models based on finite element techniques. The experimental work is performed in microgravity to allow for the use of larger solder droplets that make feasible the performance of accurate measurements while maintaining similitude of the relevant fluid dynamics groups (Re, We) and keeping the effect of gravity negligible.

  13. Potentiodynamic polarization effect on phase and microstructure of SAC305 solder in hydrochloric acid solution

    NASA Astrophysics Data System (ADS)

    Zaini, Nurwahida Binti Mohd; Nazeri, Muhammad Firdaus Bin Mohd

    2016-07-01

    The corrosion analysis of SAC305 lead free solder was investigated in Hydrochloric acid (HCl) solution. Potentiodynamic polarization was used to polarize the SAC305. The effect of polarization on the phase and microstructure were compared to as-prepared SAC305 solder. Potentiodynamic polarization introduces mixed corrosion products on the surface of SAC305 solder. The XRD analysis confirms that the mixed corrosion products emerged on the surface after polarization by formation of SnO and SnO2 of which confirmed that dissolution of Sn was dominant during polarization. Microstructure analysis reveal the presence of gap and porosities produced limits the protection offered by the passivation film.

  14. Research on Defects Inspection of Solder Balls Based on Eddy Current Pulsed Thermography

    PubMed Central

    Zhou, Xiuyun; Zhou, Jinlong; Tian, Guiyun; Wang, Yizhe

    2015-01-01

    In order to solve tiny defect detection for solder balls in high-density flip-chip, this paper proposed feasibility study on the effect of detectability as well as classification based on eddy current pulsed thermography (ECPT). Specifically, numerical analysis of 3D finite element inductive heat model is generated to investigate disturbance on the temperature field for different kind of defects such as cracks, voids, etc. The temperature variation between defective and non-defective solder balls is monitored for defects identification and classification. Finally, experimental study is carried on the diameter 1mm tiny solder balls by using ECPT and verify the efficacy of the technique. PMID:26473871

  15. A cause of the non-solderability of ceramic capacitor terminations

    NASA Technical Reports Server (NTRS)

    Cozzolino, M. J.; Kumar, A.; Ewell, G. J.

    1981-01-01

    The results of an analysis into the cause of the non-solderability of multiple defective part lots from two capacitor manufacturers are described. This analysis consisted of visual, scanning electron microscopic, surface, and metalographic examinations and analyses. The results indicated that non-solderability results from areas of excess porosity in the termination which are caused by segregation of ink constituents during manufacturing. This segregation can be minimized by proper monitoring and control of process variables; where excess porosity does occur, solderability can be improved by proper precleaning of parts.

  16. Carbonyl levels in indoor and outdoor air in Mexico City and Xalapa, Mexico.

    PubMed

    Báez, Armando; Padilla, Hugo; García, Rocío; Torres, Ma del Carmen; Rosas, Irma; Belmont, Raúl

    2003-01-20

    Carbonyl compounds in air were measured at two houses, three museums, and two offices. All sites lacked air-conditioning systems. Although indoor and outdoor air was measured simultaneously at each site, the sites themselves were sampled in different dates. Mean concentrations were higher in indoor air. Outdoor means concentrations of acetone were the highest in all sites, ranging from 12 to 60 microg m(-3). In general, formaldehyde and acetaldehyde had similar mean concentrations, ranging from 4 to 32 and 6 to 28 microg m(-3), respectively. Formaldehyde and acetone mean indoor concentrations were the highest, ranging from 11 to 97 and 17 to 89 microg m(-3), respectively, followed by acetaldehyde with 5 to 47 microg m(-3). Formaldehyde and acetaldehyde had the highest mean concentration in the offices where there were smokers. Propionaldehyde and butyraldehyde concentrations did not show definite differences between indoor and outdoor air. In general, the highest outdoor and indoor hourly concentrations were observed from 10:00 to 15:00 h. Mean indoor/outdoor ratios of carbonyls exceeded 1. Formaldehyde and acetaldehyde risks were higher in smoking environments.

  17. Proinflammatory and anti-inflammatory cytokines in adolescents from Southeast Bulgarian cities with different levels of air pollution.

    PubMed

    Dobreva, Zlatka Georgieva; Kostadinova, Gergana Stoianova; Popov, Borislav Nikolov; Petkov, Georgi Stefanov; Stanilova, Spaska Angelova

    2015-12-01

    Epidemiological studies demonstrated that the exposure of different air pollutants including particulate matter (PM) has been related to adverse effect on immune system. Current study was designed to investigate cytokines in blood plasma of adolescent persons continuously exposed to different degrees of ambient air pollutions. Tumor necrosis factor-α (TNF-α), interleukin 6 (IL-6), IL-12p40, and IL-10 were chosen as cytokines of proinflammatory and anti-inflammatory immune response. The peripheral venous blood was taken from adolescents living in the cities of Stara Zagora region, Southeast Bulgaria, that is, in Stara Zagora, Kazanlak, and Chirpan. The quantity of cytokines in plasma samples was determined by enzyme-linked immunosorbent assay. Results demonstrated that youths living in Stara Zagora showed significantly smaller quantity of TNF-α, compared with adolescents from Kazanlak and Chirpan. Moreover, adolescents living in Stara Zagora showed significantly higher quantity of IL-10 than students from Kazanlak and Chirpan. Analysis of the data of air quality gives reason to assert that PM10 and PM2.5 have been the main atmospheric pollutants around the monitoring points. The complex air quality assessment based on these criteria determined that the highest air pollution was in the city of Stara Zagora, followed by Chirpan and the relatively unpolluted town was Kazanlak. We concluded that air pollutants, mostly PM2.5, can modulate cytokine production and can change the balance between proinflammatory TNF-α and anti-inflammatory IL-10 production. Increased levels of IL-10 combined with decreased level of TNF-α in adolescents living in Stara Zagora can serve as a biomarker for suppression of T helper 1 (Th1) cell-mediated immunity and exacerbation of Th2 humoral immune response and could be a prerequisite for the development of allergic and autoimmune diseases.

  18. A piloted simulation investigation of yaw dynamics requirements for turreted gun use in low-level helicopter air combat

    NASA Technical Reports Server (NTRS)

    Decker, William A.; Morris, Patrick M.; Williams, Jeffrey N.

    1988-01-01

    A piloted, fixed-base simulation study was conducted to investigate the handling qualities requirements for helicopter air-to-air combat using turreted guns in the near-terrain environment. The study used a version of the helicopter air combat system developed at NASA Ames Research Center for one-on-one air combat. The study focused on the potential trade-off between gun angular movement capability and required yaw axis response. Experimental variables included yaw axis response frequency and damping and the size of the gun-movement envelope. A helmet position and sighting system was used for pilot control of gun aim. Approximately 340 simulated air combat engagements were evaluated by pilots from the Army and industry. Results from the experiment indicate that a highly-damped, high frequency yaw response was desired for Level I handling qualities. Pilot preference for those characteristics became more pronounced as gun turret movement was restricted; however, a stable, slow-reacting platform could be used with a large turret envelope. Most pilots preferred to engage with the opponent near the own-ship centerline. Turret elevation restriction affected the engagement more than azimuth restrictions.

  19. Personal exposures, indoor-outdoor relationships, and breath levels of toxic air pollutants measured for 355 persons in New Jersey

    NASA Astrophysics Data System (ADS)

    Wallace, Lance A.; Pellizzari, Edo D.; Hartwell, Ty D.; Sparacino, Charles M.; Sheldon, Linda S.; Zelon, Harvey

    EPA's TEAM Study has measured exposures to 20 volatile organic compounds in personal air, outdoor air, drinking water and the breath of 355 persons in NJ, in the fall of 1981. The NJ residents were selected by a probability sampling scheme to represent 128,000 inhabitants of Elizabeth and Bayonne. Participants carried a personal monitor to collect two 12-h air samples and gave a breath sample at the end of the day. Two consecutive 12-h outdoor air samples were also collected on identical Tenax cartridges in the back yards of 90 of the participants. About 3000 samples were collected, of which 1000 were quality control samples. Eleven compounds were often present in air. Personal exposures were consistently higher than outdoor concentrations for these chemicals, and were sometimes ten times the outdoor concentrations. Indoor sources appeared responsible for much of the difference. Breath concentrations also usually exceed outdoor concentrations, and correlated more strongly with personal exposures than with outdoor concentrations. Some activities (smoking, driving, visiting dry cleaners or service stations) and occupations (chemical, paint and plastics plants) were associated with significantly elevated exposures and breath levels for certain toxic chemicals.

  20. Residential heating contribution to level of air pollutants (PAHs, major, trace, and rare earth elements): a moss bag case study.

    PubMed

    Vuković, Gordana; Aničić Urošević, Mira; Pergal, Miodrag; Janković, Milan; Goryainova, Zoya; Tomašević, Milica; Popović, Aleksandar

    2015-12-01

    In areas with moderate to continental climates, emissions from residential heating system lead to the winter air pollution peaks. The EU legislation requires only the monitoring of airborne concentrations of particulate matter, As, Cd, Hg, Ni, and B[a]P. Transition metals and rare earth elements (REEs) have also arisen questions about their detrimental health effects. In that sense, this study examined the level of extensive set of air pollutants: 16 polycyclic aromatic hydrocarbons (PAHs), and 41 major elements, trace elements, and REEs using Sphagnum girgensohnii moss bag technique. During the winter of 2013/2014, the moss bags were exposed across Belgrade (Serbia) to study the influence of residential heating system to the overall air quality. The study was set as an extension to our previous survey during the summer, i.e., non-heating season. Markedly higher concentrations of all PAHs, Sb, Cu, V, Ni, and Zn were observed in the exposed moss in comparison to the initial values. The patterns of the moss REE concentrations normalized to North American Shale Composite and Post-Archean Australian Shales were identical across the study area but enhanced by anthropogenic activities. The results clearly demonstrate the seasonal variations in the moss enrichment of the air pollutants. Moreover, the results point out a need for monitoring of air quality during the whole year, and also of various pollutants, not only those regulated by the EU Directive.

  1. Flying-qualities criteria for wings-level-turn maneuvering during an air-to-ground weapon delivery task

    NASA Technical Reports Server (NTRS)

    Sammonds, R. I.; Bunnell, J. W., Jr.

    1980-01-01

    A moving-base simulator experiment conducted at Ames Research Center demonstrated that a wings-level-turn control mode improved flying qualities for air-to-ground weapons delivery compared with those of a conventional aircraft. Evaluations of criteria for dynamic response for this system have shown that pilot ratings correlate well on the basis of equivalent time constant of the initial response. Ranges of this time constant, as well as digital-system transport delays and lateral-acceleration control authorities that encompassed Level I through Level III handling qualities, were determined.

  2. Creep Properties of Sn-1.0Ag-0.5Cu Lead-Free Solder with Ni Addition

    NASA Astrophysics Data System (ADS)

    Che, F. X.; Zhu, W. H.; Poh, Edith S. W.; Zhang, X. R.; Zhang, Xiaowu; Chai, T. C.; Gao, S.

    2011-03-01

    In this work, tensile creep tests for Sn-1.0Ag-0.5Cu-0.02Ni solder have been conducted at various temperatures and stress levels to determine its creep properties. The effects of stress level and temperature on creep strain rate were investigated. Creep constitutive models (such as the simple power-law model, hyperbolic sine model, double power-law model, and exponential model) have been reviewed, and the material constants of each model have been determined based on experimental results. The stress exponent and creep activation energy have been studied and compared with other researchers' results. These four creep constitutive models established in this paper were then implemented into a user-defined subroutine in the ANSYS™ finite-element analysis software to investigate the creep behavior of Sn-1.0Ag-0.5Cu-0.02Ni solder joints of thin fine-pitch ball grid array (TFBGA) packages for the purpose of model comparison and application. Similar simulation results of creep strain and creep strain energy density were achieved when using the different creep constitutive models, indicating that the creep models are consistent and accurate.

  3. Burden of Outdoor Air Pollution in Kerala, India—A First Health Risk Assessment at State Level.

    PubMed

    Tobollik, Myriam; Razum, Oliver; Wintermeyer, Dirk; Plass, Dietrich

    2015-08-28

    Ambient air pollution causes a considerable disease burden, particularly in South Asia. The objective of the study is to test the feasibility of applying the environmental burden of disease method at state level in India and to quantify a first set of disease burden estimates due to ambient air pollution in Kerala. Particulate Matter (PM) was used as an indicator for ambient air pollution. The disease burden was quantified in Years of Life Lost (YLL) for the population (30 + years) living in urban areas of Kerala. Scenario analyses were performed to account for uncertainties in the input parameters. 6108 (confidence interval (95% CI): 4150-7791) of 81,636 total natural deaths can be attributed to PM, resulting in 96,359 (95% CI: 65,479-122,917) YLLs due to premature mortality (base case scenario, average for 2008-2011). Depending on the underlying assumptions the results vary between 69,582 and 377,195 YLLs. Around half of the total burden is related to cardiovascular deaths. Scenario analyses show that a decrease of 10% in PM concentrations would save 15,904 (95% CI: 11,090-19,806) life years. The results can be used to raise awareness about air quality standards at a local level and to support decision-making processes aiming at cleaner and healthier environments.

  4. Lacrimal Cytokines Assessment in Subjects Exposed to Different Levels of Ambient Air Pollution in a Large Metropolitan Area

    PubMed Central

    Matsuda, Monique; Bonatti, Rodolfo; Marquezini, Mônica V.; Garcia, Maria L. B.; Santos, Ubiratan P.; Braga, Alfésio L. F.; Alves, Milton R.

    2015-01-01

    Background Air pollution is one of the most environmental health concerns in the world and has serious impact on human health, particularly in the mucous membranes of the respiratory tract and eyes. However, ocular hazardous effects to air pollutants are scarcely found in the literature. Design Panel study to evaluate the effect of different levels of ambient air pollution on lacrimal film cytokine levels of outdoor workers from a large metropolitan area. Methods Thirty healthy male workers, among them nineteen professionals who work on streets (taxi drivers and traffic controllers, high pollutants exposure, Group 1) and eleven workers of a Forest Institute (Group 2, lower pollutants exposure compared to group 1) were evaluated twice, 15 days apart. Exposure to ambient PM2.5 (particulate matter equal or smaller than 2.5 μm) was 24 hour individually collected and the collection of tears was performed to measure interleukins (IL) 2, 4, 5 and 10 and interferon gamma (IFN-γ) levels. Data from both groups were compared using Student’s t test or Mann- Whitney test for cytokines. Individual PM2.5 levels were categorized in tertiles (lower, middle and upper) and compared using one-way ANOVA. Relationship between PM2.5 and cytokine levels was evaluated using generalized estimating equations (GEE). Results PM2.5 levels in the three categories differed significantly (lower: ≤22 μg/m3; middle: 23–37.5 μg/m3; upper: >37.5 μg/m3; p<0.001). The subjects from the two groups were distributed unevenly in the lower category (Group 1 = 8%; Group 2 = 92%), the middle category (Group 1 = 89%; Group 2 = 11%) and the upper category (Group 1 = 100%). A significant relationship was found between IL-5 and IL-10 and PM2.5 levels of the group 1, with an average decrease of 1.65 pg/mL of IL-5 level and of 0.78 pg/mL of IL-10 level in tear samples for each increment of 50 μg/m3 of PM2.5 (p = 0.01 and p = 0.003, respectively). Conclusion High levels of PM2.5 exposure is associated

  5. Effect of Solder-Joint Geometry on the Low-Cycle Fatigue Behavior of Sn- xAg-0.7Cu

    NASA Astrophysics Data System (ADS)

    Lee, Hwa-Teng; Huang, Kuo-Chen

    2016-12-01

    Low-cycle fatigue tests of Sn-Ag-Cu (SAC) Pb-free solder joints under fixed displacement were performed to evaluate the influence of Ag content (0-3 wt.%) and solder-joint geometry (barrel and hourglass types) on solder-joint fatigue behavior and reliability. The solder joints were composed of fine particles of Ag3Sn and Cu6Sn5, which aggregated as an eutectic constituent at grain boundaries of the primary β-Sn phase and formed a dense network structure. A decrease in the Ag content resulted in coarsening of the β-Sn and eutectic phases, which, in turn, decreased the strength of the joint and caused earlier failure. Solder joints in the hourglass form exhibited better fatigue performance with longer life than barrel-type joints. The sharp contact angle formed between the solder and the Cu substrate by the barrel-type joints concentrated stress, which compromised fatigue reliability. The addition of Ag to the solder, however, enhanced fatigue performance because of strengthening caused by Ag3Sn formation. The cracks of the barrel-type SAC solder joints originated mostly at the contact corner and propagated along the interfacial layer between the interfacial intermetallic compound (IMC) and solder matrix. Hourglass-type solder joints, however, demonstrated both crack initiation and propagation in the solder matrix (solder mode). The addition of 1.5-2.0 wt.% Ag to SAC solder appears to enhance the fatigue performance of solder joints while maintaining sufficient strength.

  6. Occupational exposure to dioxins by thermal oxygen cutting, welding, and soldering of metals.

    PubMed

    Menzel, H M; Bolm-Audorff, U; Turcer, E; Bienfait, H G; Albracht, G; Walter, D; Emmel, C; Knecht, U; Päpke, O

    1998-04-01

    This paper focuses on one aspect of occupational dioxin exposure that is novel and unexpected. Exposures in excess of the German threshold limit value of 50 pg international toxicity equivalent (I-TEQ)/m3 are very frequent, unpredictable, and sometimes very high--up to 6612 pg I-TEQ/m3--during thermal oxygen cutting at scrap metal and demolition sites. The same procedure involving virgin steel in steel trade and mass production of steel objects gave no such evidence, even though no final conclusions can be drawn because of the low number of samples analyzed. Low dioxin exposures during inert gas electric arc welding confirm previous literature findings, whereas soldering and thermal oxygen cutting in the presence of polyvinyl chloride give rise to concern. The consequences of occupational dioxin exposure were studied by analysis of the dioxin-blood concentration, the body burden, of men performing thermal oxygen cutting at scrap metal reclamation and demolition sites, in steel trade and producing plants as well as for industrial welders and white-collar workers. The results concerning body burdens are in excellent agreement with the dioxin exposure as characterized by dioxin air concentration in the workplace. The significant positive correlation between duration and frequency of performing thermal oxygen cutting at metal reclamation and demolition sites expressed in job-years and dioxin body burden speaks for the occupational origin of the observed overload after long times. The results reported here lead to consequences for occupational health, which are discussed and require immediate attention.

  7. International comparison CCQM-K82: methane in air at ambient level (1800 to 2200) nmol/mol

    NASA Astrophysics Data System (ADS)

    Flores, Edgar; Viallon, Joële; Choteau, Tiphaine; Moussay, Philippe; Wielgosz, Robert I.; Kang, Namgoo; Kim, Byung Moon; Zalewska, Ewelina; H van der Veen, Adriaan (A. M.; Konopelko, Leonid; Wu, Hai; Han, Qiao; Rhoderick, George; Guenther, Franklin R.; Watanabe, Takuro; Shimosaka, Takuya; Kato, Kenji; Hall, Brad; Brewer, Paul

    2015-01-01

    The CCQM-K82 comparison was designed to evaluate the degrees of equivalence of NMI capabilities for methane in air primary reference mixtures in the range (1800 to 2200) nmol/mol. The balance gas for the standards was either scrubbed dry real air or synthetic air. CH4 in air standards have been produced by a number of laboratories for many years, with more recent developments focused on standards at atmospheric measurement concentrations and aimed at obtaining agreement between independently produced standards. A comparison of the differences in primary gas standards for methane in air was previously performed in 2003 (CCQM-P41 Greenhouse gases. 1 and 2) with a standard deviation of results around the reference value of 30 nmol/mol and 10 nmol/mol for a more limited set of standards. This can be contrasted with the level of agreement required from field laboratories routinely measuring atmospheric methane levels, set by Data Quality Objectives (DQO) established by the World Meteorological Organization (WMO) to reflect the scientifically desirable level of compatibility for CH4 measurements at the global scale, currently set at 2 nmol/mol (1 sigma). The measurements of this key comparison took place from May 2012 to June 2012. Eight laboratories took part in this comparison coordinated by the BIPM and NIST. Key comparison reference values were calculated based on Cavity Ring Down Spectroscopy Measurements performed at the BIPM, combined with participant's gravimetric values to identify a consistent set of standards. Regression analysis allowed predicted values for each standard to be calculated which acted as the KCRVs. In this comparison reported standard uncertainties by participants ranged from 0.50 nmol/mol to 2.4 nmol/mol and the uncertainties of individual KCRVs ranged from 0.68 nmol/mol to 0.71 nmol/mol. The standard deviation of the ensemble of standards about the KCRV value was 1.70 nmol/mol. This represents a greater than tenfold improvement in the level

  8. Understanding the Relationships between Air Pollution Levels and Human Health Outcomes

    EPA Science Inventory

    As mandated by the CAA, EPA established National Ambient Air Quality Standards (NAAQS) for criteria pollutants and conducts periodic review of the NAAQS to assess if they need to be revised. The CAA then provides for implementation of the NAAQS based on a combination of local con...

  9. Understanding the structure of hydrophobic surfactants at the air/water interface from molecular level.

    PubMed

    Zhang, Li; Liu, Zhipei; Ren, Tao; Wu, Pan; Shen, Jia-Wei; Zhang, Wei; Wang, Xinping

    2014-11-25

    Understanding the behavior of fluorocarbon surfactants at the air/water interface is crucial for many applications, such as lubricants, paints, cosmetics, and fire-fighting foams. In this study, molecular dynamics (MD) simulations were employed to investigate the microscopic properties of non-ionic fluorocarbon surfactants at the air/water interface. Several properties, including the distribution of head groups, the distribution probability of the tilt angle between hydrophobic tails with respect to the xy plane, and the order parameter of surfactants, were computed to probe the structure of hydrophobic surfactants at the air/water interface. The effects of the monomer structure on interfacial phenomena of non-ionic surfactants were investigated as well. It is observed that the structure of fluorocarbon surfactants at the air/water interface is more ordered than that of hydrocarbons, which is dominated by the van der Waals interaction between surfactants and water molecules. However, replacing one or two CF2 with one or two CH2 group does not significantly influence the interfacial structure, suggesting that hydrocarbons may be promising alternatives to perfluorinated surfactants.

  10. Air-climate-energy investigations with a state-level Integrated Assessment Model: GCAM-USA

    EPA Science Inventory

    The Global Change Assessment Model (GCAM) is a global integrated assessment model used for exploring future scenarios and examining strategies that address air pollution, climate change, and energy goals.  GCAM includes technology-rich representations of the energy, transportatio...

  11. But will I be re-elected? What happens to local level policy makers who support clean indoor air laws?

    PubMed

    Eisenberg, Merrill; McCotter, Orion; Sciacca, John

    2010-11-01

    This research was conducted to determine the impact of voting for clean indoor air ordinance on a local-level policy maker's re-election status. Secondary data were used to identify local tobacco ordinances in Arizona proposed between 2001 and 2005, score ordinance content for comprehensiveness, identify policy makers who voted and how they voted, and determine if the measure passed or failed. Participation in and outcomes of subsequent elections were documented from public records. Ninety-two local-level policy makers in 15 local jurisdictions considered clean indoor air laws between 2001 and 2005. Policy makers who voted for these ordinances were more likely to be re-elected than those who voted against them. Structured interviews revealed that policy makers did not believe the issue had an impact on re-election results and believed that although the issue may have been contentious, it was no longer salient in the community.

  12. [Noise level measurements of the air noise during drilling and grinding on the fresh isolated temporal bone (author's transl)].

    PubMed

    Paulsen, K; Vietor, K

    1975-10-01

    Aerial sound measurements with different drilling instruments were performed during dry running and preparations of the bone. Registered were the values of the small drilling instruments Sirona, Dentatus-Air, and Electro-Torque-Ritter. Also tested were the KaVo-Technique-machine, the Hall-machine, the Air-Orbit-turbine, and the Sirona-turbine. During dry running most of them already reached the allowed marginal value of noise nuisance for the ear of 85 dB (A) at a distance of 35 cm. Only the Air-Orbit-machine showed a slightly lower value of 80 dB (A). The level increases with the used handpieces. Normal handpieces 1:1 exert only a minimal influence, gear handpieces 2:1, however, markedly increase the level. The verticity is of no importance in the range of normal rotations between 10,000 r/min. and 80,000 r/min. Only rotations in the lower frequency range of 2,000 r/min. markedly decrease the noise level. During bone drilling, the kind and size of the drilling bit have an influence on the intensity of the noise level. Quadruple wing milling cutters create a very high noise level (at a distance of 15 cm still above 110 dB [A!]), big rose cutters (R 16) create noise levels of 95 dB (A) and above, and only diamond round bits create less noise (approximately 88 db [A]). Small drilling bits make such a faint noise, that it is overroared by the drilling instrument. The turbines create only slightly higher levels than during dry running. Larger drilling bits cannot be employed here on principle. Wing milling cutters can lead to persistent damages of the inner ear. The frequent use of dental drilling instruments for bone preparations can also lead to a hearing loss of the operator in the long run.

  13. Investigation of Dynamic Oxygen Adsorption in Molten Solder Jetting Technology

    NASA Technical Reports Server (NTRS)

    Megaridis, Constantine M.; Bellizia, Giulio; McNallan, Michael; Wallace, David B.

    2003-01-01

    Surface tension forces play a critical role in fluid dynamic phenomena that are important in materials processing. The surface tension of liquid metals has been shown to be very susceptible to small amounts of adsorbed oxygen. Consequently, the kinetics of oxygen adsorption can influence the capillary breakup of liquid-metal jets targeted for use in electronics assembly applications, where low-melting-point metals (such as tin-containing solders) are utilized as an attachment material for mounting of electronic components to substrates. By interpreting values of surface tension measured at various surface ages, adsorption and diffusion rates of oxygen on the surface of the melt can be estimated. This research program investigates the adsorption kinetics of oxygen on the surface of an atomizing molten-metal jet. A novel oscillating capillary jet method has been developed for the measurement of dynamic surface tension of liquids, and in particular, metal melts which are susceptible to rapid surface degradation caused by oxygen adsorption. The experimental technique captures the evolution of jet swells and necks continuously along the jet propagation axis and is used in conjunction with an existing linear, axisymmetric, constant-property model to determine the variation of the instability growth rate, and, in turn, surface tension of the liquid as a function of surface age measured from the exit orifice. The conditions investigated so far focus on a time window of 2-4ms from the jet orifice. The surface properties of the eutectic 63%Sn-37%Pb solder alloy have been investigated in terms of their variation due to O2 adsorption from a N2 atmosphere containing controlled amounts of oxygen (from 8 ppm to 1000 ppm). The method performed well for situations where the oxygen adsorption was low in that time window. The value of surface tension for the 63Sn-37Pb solder in pure nitrogen was found to be 0.49 N/m, in good agreement with previously published work. A characteristic

  14. Final report of the key comparison CCQM-K88: Determination of lead in lead-free solder containing silver and copper

    NASA Astrophysics Data System (ADS)

    Hioki, Akiharu; Nonose, Naoko; Liandi, Ma; Jingbo, Chao; Liuxing, Feng; Chao, Wei; Haeng Cho, Kyung; Suh, Jung Ki; Min, Hyung Sik; Lim, Youngran; Recknagel, Sebastian; Koenig, Maren; Vogl, Jochen; Caciano de Sena, Rodrigo; dos Reis, Lindomar Augusto; Borinsky, Mónica; Puelles, Mabel; Hatamleh, Nadia; Acosta, Osvaldo; Turk, Gregory; Rabb, Savelas; Sturgeon, Ralph; Methven, Brad; Rienitz, Olaf; Jaehrling, Reinhard; Konopelko, L. A.; Kustikov, Yu A.; Kozyreva, S. B.; Korzh, A. A.

    2013-01-01

    The CCQM-K88 key comparison was organized by the Inorganic Analysis Working Group of CCQM to test the abilities of the national metrology institutes to measure the mass fraction of lead in lead-free solder containing silver and copper. National Metrology Institute of Japan (NMIJ), National Institute of Metrology of China (NIM) and Korea Research Institute of Standards and Science (KRISS) acted as the coordinating laboratories. The participants used different measurement methods, though most of them used inductively coupled plasma optical emission spectrometry (ICP-OES) or isotope-dilution inductively coupled plasma mass spectrometry (ID-ICP-MS). Accounting for relative expanded uncertainty, comparability of measurement results was successfully demonstrated by the participating NMIs for the measurement of the mass fraction of lead in lead-free solder at the level of 200 mg/kg. It is expected that metals at mass fractions greater than approximately 100 mg/kg in lead-free solder containing silver and copper can be determined by each participant using the same technique(s) employed for this key comparison to achieve similar uncertainties mentioned in the present report. Main text. To reach the main text of this paper, click on Final Report. Note that this text is that which appears in Appendix B of the BIPM key comparison database kcdb.bipm.org/. The final report has been peer-reviewed and approved for publication by the CCQM, according to the provisions of the CIPM Mutual Recognition Arrangement (CIPM MRA).

  15. A corrosion investigation of solder candidates for high-temperature applications

    NASA Astrophysics Data System (ADS)

    Chidambaram, Vivek; Hald, John; Ambat, Rajan; Hattel, Jesper

    2009-06-01

    The step-soldering approach is being employed in the multi-chip module technology. High-lead-containing alloys are among the solders currently being used in this approach. Au-Sn and Au-Ge based candidate alloys have been proposed as alternative solders for this application. In this work, a corrosion investigation was carried out on potential ternary lead-free candidate alloys based on these binary alloys for high-temperature applications. These promising ternary candidate alloys were determined by the CALPHAD approach based on the solidification criterion and the nature of the phases predicted in the bulk solder. This work reveals that the Au-Sn-based candidate alloys close to the eutectic composition (20 wt.% Sn) are more corrosion resistant than the Au-Ge-based ones.

  16. Wetting Kinetics of Eutectic Lead and Lead-Free Solders: Spreading over the Cu Surface

    NASA Astrophysics Data System (ADS)

    Zhao, Hui; Nalagatla, Dinesh Reddy; Sekulic, Dusan P.

    2009-02-01

    Wetting kinetics of Sn, eutectic Sn-Ag, eutectic Sn-Cu, and eutectic Pb-Sn was studied using real-time in situ monitoring of the triple-line movement, facilitated by a hot-stage microscopy system under a controlled atmosphere. Significantly different kinetics of lead versus lead-free solders is documented. In case of the eutectic lead solder, four characteristic spreading stages were identified. Spreading of lead-free solders features two stages with a sharp change of the spreading rate at the early stages of rather insignificant spreading. Scanning electron microscopy and energy-dispersive x-ray spectroscopy analysis of the resolidified solder surface within a halo region is discussed.

  17. The Maximum Fluidity Length of Solidifying Sn-Cu-Ag-Ni Solder Alloys

    NASA Astrophysics Data System (ADS)

    Gourlay, C. M.; Read, J.; Nogita, K.; Dahle, A. K.

    2008-01-01

    During wave soldering, it is important that a solder is able to flow easily to fill joints and to drain away to leave tidy fillets. The maximum fluidity length ( L f) is a simple measure of the flow behavior of solidifying alloys, defined as the distance a cooling and solidifying alloy can flow in a constant cross-section before the developing microstructure arrests flow. This paper explores the influence of alloy composition on L f in Sn-rich Sn-Cu-Ag-Ni alloys with compositions relevant to wave soldering. Significant differences in L f are measured among candidate lead-free solder alloys, which are discussed with respect to the phase diagrams and the mode of solidification.

  18. Effect of grain orientation on mechanical properties and thermomechanical response of Sn-based solder interconnects

    SciTech Connect

    Chen, Hongtao; Yan, Bingbing; Yang, Ming; Ma, Xin; Li, Mingyu

    2013-11-15

    The thermomechanical response of Sn-based solder interconnects with differently oriented grains was investigated by electron backscattered diffraction technique under thermal cycling and thermal shock testing in this study. The results showed that deformation and cracking of solder interconnects have a close relationship with the unique characteristics of grain orientation and boundaries in each solder interconnect, and deformation was frequently confined within the high-angle grain boundaries. The micro Vickers hardness testing results showed that the hardness varied significantly depending on the grain orientation and structure, and deformation twins can be induced around the indents by the indentation testing. - Highlights: • Thermomechanical response shows a close relationship with the grain structure. • Deformation was frequently confined within the high-angle grain boundaries. • Different grain orientations exhibit different hardness. • Deformation twins can be induced around the indents in SAC105 solder interconnects.

  19. Long-Term Effects of Soldering By-Products on Nickel-Coated Copper Wire

    NASA Technical Reports Server (NTRS)

    Rolin, T. D.; Hodge, R. E.

    2008-01-01

    An analysis of thirty-year-old, down graded flight cables was conducted to determine the makeup of a green material on the surface of the shielded wire near soldered areas and to ascertain if the green material had corroded the nickel-coated copper wire. Two likely candidates were possible due to the handling and environments to which these cables were exposed. The flux used to solder the cables is known to contain abietic acid, a carboxylic acid found in many pine rosins used for the soldering process. The resulting material copper abietate is green in color and is formed during the application of heat during soldering operations. Copper (II) chloride, which is also green in color is known to contaminate flight parts and is corrosive. Data is presented that shows the material is copper abietate, not copper (II) chloride, and more importantly that the abietate does not aggressively attack nickel-plated copper wire.

  20. Microstructurally based thermomechanical fatigue lifetime model of solder joints for electronic applications

    SciTech Connect

    Frear, D.R.; Rashid, M.M.; Burchett, S.N.

    1993-07-01

    We present a new methodology for predicting the fatigue life of solder joints for electronics applications. This approach involves integration of experimental and computational techniques. The first stage involves correlating the manufacturing and processing parameters with the starting microstructure of the solder joint. The second stage involves a series of experiments that characterize the evolution of the microstructure during thermal cycling. The third stage consists of a computer modeling and simulation effort that utilizes the starting microstructure and experimental data to produce a reliability prediction of the solder joint. This approach is an improvement over current methodologies because it incorporates the microstructure and properties of the solder directly into the model and allows these properties to evolve as the microstructure changes during fatigue.

  1. Experimental Investigation of Solder Joint Defect Formation and Mitigation in Reduced-Gravity Environments

    NASA Technical Reports Server (NTRS)

    Watson, J. Kevin; Struk, Peter M.; Pettegrew, RIchard D.; Downs, Robert S.

    2006-01-01

    This paper documents a research effort on reduced gravity soldering of plated through hole joints which was conducted jointly by the National Center for Space Exploration Research, NASA Glenn Research Center, and NASA Johnson Space Center. Significant increases in joint porosity and changes in external geometry were observed in joints produced in reduced gravity as compared to normal gravity. Multiple techniques for mitigating the observed increase in porosity were tried, including several combinations of flux and solder application techniques, and demoisturizing the circuit board prior to soldering. Results were consistent with the hypothesis that the source of the porosity is a combination of both trapped moisture in the circuit board itself, as well as vaporized flux that is trapped in the molten solder. Other topics investigated include correlation of visual inspection results with joint porosity, pore size measurements, limited pressure effects (0.08 MPa - 0.1 MPa) on the size and number of pores, and joint cooling rate.

  2. Ultrasonic semi-solid coating soldering 6061 aluminum alloys with Sn-Pb-Zn alloys.

    PubMed

    Yu, Xin-ye; Xing, Wen-qing; Ding, Min

    2016-07-01

    In this paper, 6061 aluminum alloys were soldered without a flux by the ultrasonic semi-solid coating soldering at a low temperature. According to the analyses, it could be obtained that the following results. The effect of ultrasound on the coating which promoted processes of metallurgical reaction between the components of the solder and 6061 aluminum alloys due to the thermal effect. Al2Zn3 was obtained near the interface. When the solder was in semi-solid state, the connection was completed. Ultimately, the interlayer mainly composed of three kinds of microstructure zones: α-Pb solid solution phases, β-Sn phases and Sn-Pb eutectic phases. The strength of the joints was improved significantly with the minimum shear strength approaching 101MPa.

  3. Microstructurally based thermomechanical fatigue lifetime model of solder joints for electronic applications

    NASA Astrophysics Data System (ADS)

    Frear, D. R.; Rashid, M. M.; Burchett, S. N.

    We present a new methodology for predicting the fatigue life of solder joints for electronics applications. This approach involves integration of experimental and computational techniques. The first stage involves correlating the manufacturing and processing parameters with the starting microstructure of the solder joint. The second stage involves a series of experiments that characterize the evolution of the microstructure during thermal cycling. The third stage consists of a computer modeling and simulation effort that utilizes the starting microstructure and experimental data to produce a reliability prediction of the solder joint. This approach is an improvement over current methodologies because it incorporates the microstructure and properties of the solder directly into the model and allows these properties to evolve as the microstructure changes during fatigue.

  4. Use of optoelectronic tweezers in manufacturing—accurate solder bead positioning

    NASA Astrophysics Data System (ADS)

    Zhang, Shuailong; Liu, Yongpeng; Juvert, Joan; Tian, Pengfei; Navarro, Jean-Claude; Cooper, Jonathan M.; Neale, Steven L.

    2016-11-01

    In this work, we analyze the use of optoelectronic tweezers (OETs) to manipulate 45 μm diameter Sn62Pb36Ag2 solder beads with light-induced dielectrophoresis force and we demonstrate high positioning accuracy. It was found that the positional deviation of the solder beads increases with the increase of the trap size. To clarify the underlying mechanism, simulations based on the integration of the Maxwell stress tensor were used to study the force profiles of OET traps with different sizes. It was found that the solder beads felt a 0.1 nN static friction or stiction force due to electrical forces pulling them towards the surface and that this force is not dependent on the size of the trap. The stiction limits the positioning accuracy; however, we show that by choosing a trap that is just larger than the solder bead sub-micron positional accuracy can be achieved.

  5. Climate specific thermomechanical fatigue of flat plate photovoltaic module solder joints

    SciTech Connect

    Bosco, Nick; Silverman, Timothy J.; Kurtz, Sarah

    2016-07-01

    FEM simulations of PbSn solder fatigue damage are used to evaluate seven cities that represent a variety of climatic zones. It is shown that the rate of solder fatigue damage is not ranked with the cities' climate designations. For an accurate ranking, the mean maximum daily temperature, daily temperature change and a characteristic of clouding events are all required. A physics-based empirical equation is presented that accurately calculates solder fatigue damage according to these three factors. An FEM comparison of solder damage accumulated through service and thermal cycling demonstrates the number of cycles required for an equivalent exposure. For an equivalent 25-year exposure, the number of thermal cycles (-40 degrees C to 85 degrees C) required ranged from roughly 100 to 630 for the cities examined. It is demonstrated that increasing the maximum cycle temperature may significantly reduce the number of thermal cycles required for an equivalent exposure.

  6. The Development of a Computer-Directed Training Subsystem and Computer Operator Training Material for the Air Force Phase II Base Level System. Final Report.

    ERIC Educational Resources Information Center

    System Development Corp., Santa Monica, CA.

    The design, development, and evaluation of an integrated Computer-Directed Training Subsystem (CDTS) for the Air Force Phase II Base Level System is described in this report. The development and evaluation of a course to train computer operators of the Air Force Phase II Base Level System under CDTS control is also described. Detailed test results…

  7. Variation of annual effective dose due to radon level in indoor air in Marwar region of Rajasthan, India

    SciTech Connect

    Rani, Asha; Mittal, Sudhir; Mehra, Rohit

    2015-08-28

    In the present work, indoor radon and thoron measurements have been carried out from different locations of Jodhpur and Nagaur districts of Northern Rajasthan, India using RAD7, a solid state alpha detector. The radon and thoron concentration in indoor air varies from 8.75 to 61.25 Bq m{sup −3} and 32.7 to 147.2 Bq m{sup −3} with the mean value of 32 and 73 Bq m{sup −3} respectively. The observed indoor radon concentration values are well below the action level recommended by International Commission on Radiological Protection (200-300 Bq m{sup −3}) and Environmental Protection Agency (148 Bq m{sup −3}). The survey reveals that the thoron concentration values in the indoor air are well within the International Commission on Radiological Protection (2005). The calculated total annual effective dose due to radon level in indoor air varies from 0.22 to 1.54 mSv y{sup −1} with the mean value of 0.81 mSv y{sup −1} which is less than even the lower limit of action level 3-10 mSv y{sup −1} recommended by International Commission on Radiological Protection (2005)

  8. Soldered Contact and Current Risetime Effects on Negative Polarity Wire Array Z-pinches

    NASA Astrophysics Data System (ADS)

    Chalenski, D. A.; Kusse, B. R.; Greenly, J. B.; Blesener, I. C.; McBride, R. D.; Hammer, D. A.; Knapp, P. F.

    2009-01-01

    The Cornell University COBRA pulser is a nominal 1 MA machine, capable of driving up to 32 wire cylindrical Z-pinch arrays. COBRA can operate with variable current risetimes ranging from 100 ns to 200 ns (short and long pulse, respectively). Wires are typically strung with a "press" contact to the electrode hardware, where the wire is loosely pulled against the hardware and held there to establish electrical contact. The machine is normally negative, but a bolt-on convolute can be used to modify the current path and effectively produce positive polarity operation at the load. Previous research with single wires on a 1-5 kA pulser [1] has shown that soldering the wire, thereby improving the wire/electrode contact, and operating in positive polarity can improve the energy deposition into the wire and enhance wire core expansion. Negative polarity showed no difference. Previous experiments on the negative polarity, 20 MA, 100 ns Z accelerator [2] have shown that improving the contact improved the x-ray yield. Cornell data were collected on 16-wire Aluminum Z-pinch arrays in negative polarity. Experiments were conducted with both short and long current pulses with soldered and no-soldered wire/electrode contacts. The initiation, ablation, implosion and stagnation phases were compared for these four conditions. Time dependent x-ray signals were measured using diodes and diamond detectors. An inductive voltage monitor was used to infer minimum current radius achieved, as defined by a uniform shell of current moving radially inward, producing a time dependent inductance. Total energy data were collected with a metal-strip bolometer. Self-emission data were collected by an XUV 4-frame camera and an optical streak camera. In negative polarity and with short pulses, soldering appeared to produce a smaller radius pinch and decrease variations in the x-ray pulse shape. The bolometer, laser backlighter, 4-frame and streak cameras showed negligible differences in the initiation

  9. Fabrication of Sn-Ag/CeO2 Electro-Composite Solder by Pulse Electrodeposition

    NASA Astrophysics Data System (ADS)

    Sharma, Ashutosh; Bhattacharya, Sumit; Das, Siddhartha; Das, Karabi

    2013-12-01

    The Sn-Ag/CeO2 nanocomposite solders have been pulse electrodeposited from an aqueous citrate bath containing varying concentrations of CeO2 nanopowders (1 to 30 g/L). Microstructural characterization, hardness, melting point, electrical conductivity, wear resistance, and residual stress measurement of the composite coatings indicate that the composite deposited from an electrolyte containing 15 g/L CeO2 possesses the optimum properties and thus can have potential applications in solder joints and packaging.

  10. Joint Lead-Free Solder Test Program for High Reliability Military and Space Applications

    NASA Technical Reports Server (NTRS)

    Brown, Christina

    2004-01-01

    Current and future space and defense systems face potential risks from the continued use of tin-lead solder, including: compliance with current environmental regulations, concerns about potential environmental legislation banning lead-containing products, reduced mission readiness, and component obsolescence with lead surface finishes. For example, the United States Environmental Protection Agency (USEPA) has lowered the Toxic Chemical Release reporting threshold for lead to 100 pounds. Overseas, the Waste Electrical and Electronic Equipment (WEEE) and the Restriction on Hazardous Substances (RoHS) Dicctives in Europe and similar mandates in Japan have instilled concern that a legislative body will prohibit the use of lead in aerospace/military electronics soldering. Any potential banning of lead compounds could reduce the supplier base and adversely affect the readiness of missions led by the National Aeronautics and Space Administration (NASA) and the U.S. Department of Defense (DoD). Before considering lead-free electronics for system upgrades or future designs, however, it is important for the DoD and NASA to know whether lead-free solders can meet their systems' requirements. No single lead-free solder is likely to qualify for all defense and space applications. Therefore, it is important to validate alternative solders for discrete applications. As a result of the need for comprehensive test data on the reliability of lead-free solders, a partnership was formed between the DoD, NASA, and several original equipment manufactures (OEMs) to conduct solder-joint reliability (laboratory) testing of three lead-free solder alloys on newly manufactured and reworked circuit cards to generate performance data for high-reliability (IPC Class 3) applications.

  11. Thermomechanical Cycling Investigation of Cu and Niti Reinforced Lead-Free Solder

    DTIC Science & Technology

    2006-09-01

    heated in thermomechanical cycling (TMC) the temperature will be elevated above the austenitic transformation temperature of the SMA. At this... thermomechanical fatigue resistance [5-12]. These properties in Pb-Sn solders have been studied and modeled by numerous persons and information is readily...technologies is low cycle fatigue (LCF) of the solder balls. This LCF is induced by thermomechanical cyclic shear stresses at high homologous

  12. Soldering Technology (4th) Proceedings of Annual Seminar, 20-21 February 1980.

    DTIC Science & Technology

    1980-02-01

    es- temperature. The size of the solder 3lobule to be used is related r to wire diameter under test. Time may be measured automatically via electrical ...mo=ed on a rocating arm which carried them ino tangential contac with a dross free solder surface. An electrical contact probe allows measur mez of the...both sheet or wtre specimens but not printed circuit boards. Being the most recently inovated test it has not yet been fully integrated into

  13. Mathematical estimation of the level of microbial contamination on spacecraft surfaces by volumetric air sampling

    NASA Technical Reports Server (NTRS)

    Oxborrow, G. S.; Roark, A. L.; Fields, N. D.; Puleo, J. R.

    1974-01-01

    Microbiological sampling methods presently used for enumeration of microorganisms on spacecraft surfaces require contact with easily damaged components. Estimation of viable particles on surfaces using air sampling methods in conjunction with a mathematical model would be desirable. Parameters necessary for the mathematical model are the effect of angled surfaces on viable particle collection and the number of viable cells per viable particle. Deposition of viable particles on angled surfaces closely followed a cosine function, and the number of viable cells per viable particle was consistent with a Poisson distribution. Other parameters considered by the mathematical model included deposition rate and fractional removal per unit time. A close nonlinear correlation between volumetric air sampling and airborne fallout on surfaces was established with all fallout data points falling within the 95% confidence limits as determined by the mathematical model.

  14. Effects on Undercooling and Interfacial Reactions with Cu Substrates of Adding Bi and In to Sn-3Ag Solder

    NASA Astrophysics Data System (ADS)

    Chiang, Yu-Yan; Cheng, Robbin; Wu, Albert T.

    2010-11-01

    This study investigated the effects of adding Bi and In to Sn-3Ag Pb-free solder on undercooling, interfacial reactions with Cu substrates, and the growth kinetics of intermetallic compounds (IMCs). The amount of Sn dominates the undercooling, regardless of the amount or species of further additives. The interfacial IMC that formed in Sn-Ag-Bi-In and Sn-In-Bi solders is Cu6Sn5, while that in Sn-Ag-In solders is Cu6(Sn,In)5, since Bi enhances the solubility of In in Sn matrices. The activation energy for the growth of IMCs in Sn-Ag-Bi-In is nearly double that in Sn-Ag-In solders, because Bi in the solder promotes Cu dissolution. The bright particles that form inside the Sn-Ag-In bulk solders are the ζ-phase.

  15. The Air Force Chief of Staff Logistics Review. Improving Wing-Level Logistics

    DTIC Science & Technology

    2005-01-01

    Force CSC2 Combat Support Execution Planning and Control CSL Core Support Location CWT Customer Wait Time DCM Deputy Commander for Maintenance DIFM Due In...Deputy Commander for Main- tenance ( DCM ) days, but this was not an option.3 Thus, major reor- ganization options were not within the scope of this effort.4...improved, and course durations increased. The senior workforce and management experience increased. The Air Force F-4 Phantom series aircraft was

  16. Evaluation of low-residue soldering for military and commercial applications: A report from the Low-Residue Soldering Task Force

    SciTech Connect

    Iman, R.L.; Anderson, D.J.; Burress, R.V.

    1995-06-01

    The LRSTF combined the efforts of industry, military, and government to evaluate low-residue soldering processes for military and commercial applications. These processes were selected for evaluation because they provide a means for the military to support the presidential mandate while producing reliable hardware at a lower cost. This report presents the complete details and results of a testing program conducted by the LRSTF to evaluate low-residue soldering for printed wiring assemblies. A previous informal document provided details of the test plan used in this evaluation. Many of the details of that test plan are contained in this report. The test data are too massive to include in this report, however, these data are available on disk as Excel spreadsheets upon request. The main purpose of low-residue soldering is to eliminate waste streams during the manufacturing process.

  17. Flying-qualities criteria for wings-level-turn maneuvering during an air-to-ground weapon delivery task

    NASA Technical Reports Server (NTRS)

    Sammonds, R. I.; Bunnell, J. W.

    1981-01-01

    A moving base simulator experiment demonstrated that a wings-level-turn control mode improved flying qualities for air to ground weapon delivery compared with those of a conventionally controlled aircraft. Evaluations of criteria for dynamic response for this system have shown that pilot ratings correlate well on the basis of equivalent time constant of the initial response. Ranges of this time constant, as well as digital system transport delays and lateral acceleration control authorities that encompassed level 1 through 3 handling qualities, were determined.

  18. Air pollution and survival within the Washington University-EPRI Veterans Cohort: risks based on modelled estimates of ambient levels of hazardous and criteria air pollutants

    SciTech Connect

    Frederick W. Lipfert; Ronald E. Wyzga; Jack D. Baty; J. Philip Miller

    2009-04-15

    For this paper, we considered relationships between mortality, vehicular traffic density, and ambient levels of 12 hazardous air pollutants, elemental carbon (EC), oxides of nitrogen (NOx), sulfur dioxide (SO{sub 2}), and sulfate (SO{sub 4}{sup -2}). These pollutant species were selected as markers for specific types of emission sources, including vehicular traffic, coal combustion, smelters, and metal-working industries. Pollutant exposures were estimated using emissions inventories and atmospheric dispersion models. We analyzed associations between county ambient levels of these pollutants and survival patterns among approximately 70,000 U.S. male veterans by mortality period (1976-2001 and subsets), type of exposure model, and traffic density level. We found significant associations between all-cause mortality and traffic-related air quality indicators and with traffic density per se, with stronger associations for benzene, formaldehyde, diesel particulate, NOx, and EC. The maximum effect on mortality for all cohort subjects during the 26-yr follow-up period is approximately 10%, but most of the pollution-related deaths in this cohort occurred in the higher-traffic counties, where excess risks approach 20%. However, mortality associations with diesel particulates are similar in high- and low-traffic counties. Sensitivity analyses show risks decreasing slightly over time and minor differences between linear and logarithmic exposure models. We conclude that tailpipe emissions of both gases and particles are among the most significant and robust predictors of mortality in this cohort and that most of those associations have weakened over time. There may be concerns associated with large stationary sources burning coal, residual fuel oil and municipal solid wastes. Nickel and arsenic have been identified in coal fly ash and residual oil. 81 refs., 3 figs., 7 tabs.

  19. Dissolution rate of cadmium from dental gold solder alloys.

    PubMed

    Bergman, M; Ginstrup, O

    1975-01-01

    The dissolution rate of cadmium from six different dental gold solder alloys was determined in an in vitro potentiostatic study. The measurements were made in the potential range 740--880 mV and attempts have been made to extrapolate the results to a potential region that might in reality occur in the oral cavity. For comparison the dissolution rates of copper and zinc were also determined. Electrochemically the most interesting quantity was the logarithm of the dissolution rate because it is a linear function of the applied potential. This linear relationship was given by the Tafel equation. The dissolution rate of cadmium was shown to be rather small even under circumstances which may be said to represent very unfavourable conditions within the oral cavity.

  20. Ionic cleaning after wave solder and before conformal coat

    NASA Astrophysics Data System (ADS)

    Nguygen, Tochau N.; Sutherland, Thomas H.

    An account is given of efforts made by a military electronics manufacturer to upgrade product reliability in response to the printed writing board (PWB) ionic cleanliness requirements recently set out in MIL-P-28809 Rev. A. These requirements had to be met both after wave soldering, involving the immediate removal of ionically active RA flux, and immediately before conformal coating, in order to remove the less active RMA flux and bonding contaminants. Attention is given to the results of a test program which compared the effectiveness with which five different solvents and two (batch and conveyorized vapor degreasing) cleaning methods cleaned representative PWBs containing many components. Alcohol-containing fluorocarbon blends were adequate, but the most densely packed PWBs required a supplemental water rinse.