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Sample records for air solder leveling

  1. Age-aware solder performance models : level 2 milestone completion.

    SciTech Connect

    Neilsen, Michael K.; Vianco, Paul Thomas; Neidigk, Matthew Aaron; Holm, Elizabeth Ann

    2010-09-01

    Legislated requirements and industry standards are replacing eutectic lead-tin (Pb-Sn) solders with lead-free (Pb-free) solders in future component designs and in replacements and retrofits. Since Pb-free solders have not yet seen service for long periods, their long-term behavior is poorly characterized. Because understanding the reliability of Pb-free solders is critical to supporting the next generation of circuit board designs, it is imperative that we develop, validate and exercise a solder lifetime model that can capture the thermomechanical response of Pb-free solder joints in stockpile components. To this end, an ASC Level 2 milestone was identified for fiscal year 2010: Milestone 3605: Utilize experimentally validated constitutive model for lead-free solder to simulate aging and reliability of solder joints in stockpile components. This report documents the completion of this milestone, including evidence that the milestone completion criteria were met and a summary of the milestone Program Review.

  2. Conversion from solvent rinsable fluxes to aqueous rinsable fluxes for hot oil solder leveling

    NASA Astrophysics Data System (ADS)

    1992-03-01

    A water rinsable flux was evaluated for hot oil solder leveling of printed wiring boards. The previously used rosin-activated flux required a solvent containing a chlorinated hydrocarbon for removing the flux residues after soldering. The water rinsable flux requires hot water or a solution of hot detergent for removing flux residues after smoldering. The water rinsable flux produced an acceptable soldered surface. Flux residues were removed by either hot water (120 F) or a solution of hot detergent (120 F).

  3. Wave soldering with Pb-free solders

    SciTech Connect

    Artaki, I.; Finley, D.W.; Jackson, A.M.; Ray, U.; Vianco, P.T.

    1995-07-01

    The manufacturing feasibility and attachment reliability of a series of newly developed lead-free solders were investigated for wave soldering applications. Some of the key assembly aspects addressed included: wettability as a function of board surface finish, flux activation and surface tension of the molten solder, solder joint fillet quality and optimization of soldering thermal profiles. Generally, all new solder formulations exhibited adequate wave soldering performance and can be considered as possible alternatives to eutectic SnPb for wave soldering applications. Further process optimization and flux development is necessary to achieve the defect levels associated with the conventional SnPb process.

  4. Solder Bonding for Power Transistors

    NASA Technical Reports Server (NTRS)

    Snytsheuvel, H. A.; Mandel, H.

    1985-01-01

    Indium solder boosts power rating and facilitates circuit changes. Efficient heat conduction from power transistor to heat sink provided by layer of indium solder. Low melting point of indium solder (141 degrees C) allows power transistor to be removed, if circuit must be reworked, without disturbing other components mounted with ordinary solder that melts at 181 degrees C. Solder allows devices operated at higher power levels than does conventional attachment by screws.

  5. Lead-free solder

    DOEpatents

    Anderson, Iver E.; Terpstra, Robert L.

    2001-05-15

    A Sn--Ag--Cu eutectic alloy is modified with one or more low level and low cost alloy additions to enhance high temperature microstructural stability and thermal-mechanical fatigue strength without decreasing solderability. Purposeful fourth or fifth element additions in the collective amount not exceeding about 1 weight % (wt. %) are added to Sn--Ag--Cu eutectic solder alloy based on the ternary eutectic Sn--4.7%Ag--1.7%Cu (wt. %) and are selected from the group consisting essentially of Ni, Fe, and like-acting elements as modifiers of the intermetallic interface between the solder and substrate to improve high temperature solder joint microstructural stability and solder joint thermal-mechanical fatigue strength.

  6. Gelatin based on Power-gel.TM. as solders for Cr.sup.4+laser tissue welding and sealing of lung air leak and fistulas in organs

    DOEpatents

    Alfano, Robert R.; Tang, Jing; Evans, Jonathan M.; Ho, Peng Pei

    2006-04-25

    Laser tissue welding can be achieved using tunable Cr.sup.4+ lasers, semiconductor lasers and fiber lasers, where the weld strength follows the absorption spectrum of water. The use of gelatin and esterified gelatin as solders in conjunction with laser inducted tissue welding impart much stronger tensile and torque strengths than albumin solders. Selected NIR wavelength from the above lasers can improve welding and avoid thermal injury to tissue when used alone or with gelatin and esterified gelatin solders. These discoveries can be used to enhance laser tissue welding of tissues such as skin, mucous, bone, blood vessel, nerve, brain, liver, pancreas, spleen, kidney, lung, bronchus, respiratory track, urinary tract, gastrointestinal tract, or gynecologic tract and as a sealant for pulmonary air leaks and fistulas such as intestinal, rectal and urinary fistulas.

  7. Soldering Tested in Reduced Gravity

    NASA Technical Reports Server (NTRS)

    Struk, Peter M.; Pettegrew, Richard D.; Watson, J. Kevin; Down, Robert S.; Haylett, Daniel R.

    2005-01-01

    Whether used occasionally for contingency repair or routinely in nominal repair operations, soldering will become increasingly important to the success of future long-duration human space missions. As a result, it will be critical to have a thorough understanding of the service characteristics of solder joints produced in reduced-gravity environments. The National Center for Space Exploration Research (via the Research for Design program), the NASA Glenn Research Center, and the NASA Johnson Space Center are conducting an experimental program to explore the influence of reduced gravity environments on the soldering process. Solder joint characteristics that are being considered include solder fillet geometry, porosity, and microstructural features. Both through-hole (see the drawing and image on the preceding figure) and surface-mounted devices are being investigated. This effort (the low-gravity portion being conducted on NASA s KC-135 research aircraft) uses the soldering hardware currently available on the International Space Station. The experiment involves manual soldering by a contingent of test operators, including both highly skilled technicians and less skilled individuals to provide a skill mix that might be encountered in space mission crews. The experiment uses both flux-cored solder and solid-core solder with an externally applied flux. Other experimental parameters include the type of flux, gravitational level (nominally zero,

  8. Solder poisoning

    MedlinePlus

    ... in solder that can be harmful are: Antimony Bismuth Cadmium Copper Ethylene glycol Lead Mild acids Silver ... of the bones and kidney failure Symptoms for bismuth: Diarrhea Eye irritation Gum disease ( gingivitis ) Kidney damage ...

  9. A Novel Conditional Probability Density Distribution Surface for the Analysis of the Drop Life of Solder Joints Under Board Level Drop Impact

    NASA Astrophysics Data System (ADS)

    Gu, Jian; Lei, YongPing; Lin, Jian; Fu, HanGuang; Wu, Zhongwei

    2016-01-01

    The scattering of fatigue life data is a common problem and usually described using the normal distribution or Weibull distribution. For solder joints under drop impact, due to the complicated stress distribution, the relationship between the stress and the drop life is so far unknown. Furthermore, it is important to establish a function describing the change in standard deviation for solder joints under different drop impact levels. Therefore, in this study, a novel conditional probability density distribution surface (CPDDS) was established for the analysis of the drop life of solder joints. The relationship between the drop impact acceleration and the drop life is proposed, which comprehensively considers the stress distribution. A novel exponential model was adopted for describing the change of the standard deviation with the impact acceleration (0 → +∞). To validate the model, the drop life of Sn-3.0Ag-0.5Cu solder joints was analyzed. The probability density curve of the logarithm of the fatigue life distribution can be easily obtained for a certain acceleration level fixed on the acceleration level axis of the CPDDS. The P- A- N curve was also obtained using the functions μ( A) and σ( A), which can reflect the regularity of the life data for an overall reliability P.

  10. Electronic hidden solder joint geometry characterization

    NASA Astrophysics Data System (ADS)

    Hsieh, Sheng-Jen

    2009-05-01

    To reduce the size of electronic equipment, multi-layer printed circuit board structures have become popular in recent years. As a result, the inspection of hidden solder joints between layers of boards has become increasingly difficult. Xray machines have been used for ball grid array (BGA) and hidden solder joint inspection; however, the equipment is costly and the inspection process is time consuming. In this paper, we investigate an active thermography approach to probing solder joint geometry. A set of boards having the same number of solder joints and amount of solder paste (0.061 g) was fabricated. Each solder joint had a different geometry. A semi-automated system was built to heat and then transfer each board to a chamber where an infrared camera was used to scan the board as it was cooling down. Two-thirds of the data set was used for model development and one-third was used for model evaluation. Both artificial neural network (ANN) and binary logistic regression models were constructed. Results suggest that solder joints with more surface area cool much faster than those with less surface area. In addition, both modeling approaches are consistent in predicting solder geometry; ANN had 85% accuracy and the regression model had 80%. This approach can potentially be used to test for cold solder joints prior to BGA assembly, since cold solder joints may have air gaps between the joint and the board and air is a poor heat conductor. Therefore, a cold solder joint may have a slower cooling rate than a normal one.

  11. Soldering tool heats workpieces and applies solder in one operation

    NASA Technical Reports Server (NTRS)

    Gudkese, V. W.

    1966-01-01

    Fountain-pen type soldering iron heats workpieces and applies solder to joints in densely packed electronics assemblies. The basic soldering tool is used with different-sized orifice tips, eliminating the need for an assortment of conventional soldering guns.

  12. Testing of printed circuit board solder joints by optical correlation

    NASA Technical Reports Server (NTRS)

    Espy, P. N.

    1975-01-01

    An optical correlation technique for the nondestructive evaluation of printed circuit board solder joints was evaluated. Reliable indications of induced stress levels in solder joint lead wires are achievable. Definite relations between the inherent strength of a solder joint, with its associated ability to survive stress, are demonstrable.

  13. Soldering instrument safety improvements

    DOEpatents

    Kosslow, William J.; Giron, Ronald W.

    1996-01-01

    A safe soldering device includes a retractable heat shield which can be moved between a first position in which the solder tip of the device is exposed for soldering operation and a second position in which the solder tip is covered by the heat shield. Preferably, the heat shield is biased towards the second position and may be locked in the first position for ease of use. When the soldering device is equipped with a vacuum system, the heat shield may serve to guide the flow of gases and heat from the solder tip away from the work area. The heat shield is preferably made of non-heatsinking plastic.

  14. Advanced soldering processes

    SciTech Connect

    Jellison, J.L.; Golden, J.; Frear, D.R.; Hosking, F.M.; Keicher, D.M.; Yost, F.G.

    1993-02-20

    Advanced soldering processes are discussed in a complete manner. The ability to meet the needs of electronic manufacturing, while addressing the environmental issues are challenging goals. Government regulations mandate the elimination of most solvents in solder flux removal. Alternative approaches to promoting wetting are discussed. Inert atmosphere soldering, acid vapor fluxless soldering, atomic and ionic hydrogen as reactive atmospheres, fluxless laser soldering in a controlled atmosphere are offered as soldering mechanisms for the future. Laser are discussed as alternate heat sources. Various types of lasers, advantages of lasers, and fiber optic beam delivery are considered.

  15. Solderability of melting lead-free solder to tiny joint of electronic products

    NASA Astrophysics Data System (ADS)

    Chen, Fang; Du, Changhua; Du, Yunfei

    2005-12-01

    The behavior of melting solder has an important influence on the tiny joints of electronic products. In order to improve the properties of lead-free solder, a Sn-3.5Ag0.6Cu alloy was smelted using traditional and a modified technology, respectively. The solderability of the two alloys were investigated using a wetting balance method for the different conditions. The test results showed that the modified solder had good solderability, where the excellent flux used was rosin-ethanol or rosin-isopropanol solution. In experimental condition, when the added active agent is 0.4% of rosin mass or 0.1% of solution mass, the wetting velocity and wetting force can be improved 5 times and 1.5 times, respectively. The best soldering parameters are temperature levels less than or equal to 270°, and the soakage time in 2-3s.

  16. Soldered solar arrays

    NASA Astrophysics Data System (ADS)

    Allen, H. C.

    1982-06-01

    The ability of soldered interconnects to withstand a combination of long life and severe environmental conditions was investigated. Improvements in joint life from the use of solder mixes appropriate to low temperature conditons were studied. Solder samples were placed in a 150 C oven for 5 weeks (= 12 yr at 80 C, or 24 at 70 C according to Arrhenius's rule). Conventional and high solder melting point array samples underwent 1000 thermal cycles between -186 and 100 C. Results show that conventional and lead rich soldered arrays can survive 10 yr geostationary orbit missions.

  17. Microstructural Evolution of SAC305 Solder Joints in Wafer Level Chip-Scale Packaging (WLCSP) with Continuous and Interrupted Accelerated Thermal Cycling

    NASA Astrophysics Data System (ADS)

    Zhou, Quan; Zhou, Bite; Lee, Tae-Kyu; Bieler, Thomas

    2016-02-01

    Four high-strain design wafer level chip scale packages were given accelerated thermal cycling with a 10°C/min ramp rate and 10 min hold times between 0°C and 100°C to examine the effects of continuous and interrupted thermal cycling on the number of cycles to failure. The interruptions given two of the samples were the result of periodic examinations using electron backscattered pattern mapping, leading to room temperature aging of 30 days-2.5 years after increments of about 100 cycles at several stages of the cycling history. The continuous thermal cycling resulted in solder joints with a much larger degree of recrystallization, whereas the interrupted thermal cycling tests led to much less recrystallization, which was more localized near the package side, and the crack was more localized near the interface and had less branching. The failure mode for both conditions was still the same, with cracks nucleating along the high angle grain boundaries formed during recrystallization. In conditions where there were few recrystallized grains, recovery led to formation of subgrains that strengthened the solder, and the higher strength led to a larger driving force for crack growth through the solder, leading to failure after less than half of the cycles in the continuous accelerated thermal cycling condition. This work shows that there is a critical point where sufficient strain energy accumulation will trigger recrystallization, but this point depends on the rate of strain accumulation in each cycle and various recovery processes, which further depends on local crystal orientations, stress state evolution, and specific activated slip and twinning systems.

  18. Microstructural Evolution of SAC305 Solder Joints in Wafer Level Chip-Scale Packaging (WLCSP) with Continuous and Interrupted Accelerated Thermal Cycling

    NASA Astrophysics Data System (ADS)

    Zhou, Quan; Zhou, Bite; Lee, Tae-Kyu; Bieler, Thomas

    2016-06-01

    Four high-strain design wafer level chip scale packages were given accelerated thermal cycling with a 10°C/min ramp rate and 10 min hold times between 0°C and 100°C to examine the effects of continuous and interrupted thermal cycling on the number of cycles to failure. The interruptions given two of the samples were the result of periodic examinations using electron backscattered pattern mapping, leading to room temperature aging of 30 days-2.5 years after increments of about 100 cycles at several stages of the cycling history. The continuous thermal cycling resulted in solder joints with a much larger degree of recrystallization, whereas the interrupted thermal cycling tests led to much less recrystallization, which was more localized near the package side, and the crack was more localized near the interface and had less branching. The failure mode for both conditions was still the same, with cracks nucleating along the high angle grain boundaries formed during recrystallization. In conditions where there were few recrystallized grains, recovery led to formation of subgrains that strengthened the solder, and the higher strength led to a larger driving force for crack growth through the solder, leading to failure after less than half of the cycles in the continuous accelerated thermal cycling condition. This work shows that there is a critical point where sufficient strain energy accumulation will trigger recrystallization, but this point depends on the rate of strain accumulation in each cycle and various recovery processes, which further depends on local crystal orientations, stress state evolution, and specific activated slip and twinning systems.

  19. AIRS Level 2 Data Products

    NASA Technical Reports Server (NTRS)

    Vicente, Gilberto

    2003-01-01

    The Atmospheric InfraRed Sounder (AIRS) Standard Retrieval Product consists of retrieved cloud and surface properties; profiles of retrieved temperature, water vapor, and ozone; and a flag indicating the presence of cloud ice or water. They contain quality assessment flags in addition to retrieved quantities and are generated for all locations where atmospheric soundings are taken. An AIRS granule consists of 6 minutes of data. This corresponds to approximately 1/15 of an orbit but exactly 45 scan lines of AMSU-A data or 135 scan lines of AIRS and HSB data.

  20. Solderability test system

    DOEpatents

    Yost, Fred; Hosking, Floyd M.; Jellison, James L.; Short, Bruce; Giversen, Terri; Reed, Jimmy R.

    1998-01-01

    A new test method to quantify capillary flow solderability on a printed wiring board surface finish. The test is based on solder flow from a pad onto narrow strips or lines. A test procedure and video image analysis technique were developed for conducting the test and evaluating the data. Feasibility tests revealed that the wetted distance was sensitive to the ratio of pad radius to line width (l/r), solder volume, and flux predry time.

  1. Solderability test system

    DOEpatents

    Yost, F.; Hosking, F.M.; Jellison, J.L.; Short, B.; Giversen, T.; Reed, J.R.

    1998-10-27

    A new test method to quantify capillary flow solderability on a printed wiring board surface finish. The test is based on solder flow from a pad onto narrow strips or lines. A test procedure and video image analysis technique were developed for conducting the test and evaluating the data. Feasibility tests revealed that the wetted distance was sensitive to the ratio of pad radius to line width (l/r), solder volume, and flux predry time. 11 figs.

  2. Design of Experiments to Determine Causes of Flex Cable Solder Wicking, Discoloration and Hole Location Defects

    SciTech Connect

    Wolfe, Larry

    2009-04-22

    Design of Experiments (DoE) were developed and performed in an effort to discover and resolve the causes of three different manufacturing issues; large panel voids after Hot Air Solder Leveling (HASL), cable hole locations out of tolerance after lamination and delamination/solder wicking around flat flex cable circuit lands after HASL. Results from a first DoE indicated large panel voids could be eliminated by removing the pre-HASL cleaning. It also revealed eliminating the pre-HASL bake would not be detrimental when using a hard press pad lamination stackup. A second DoE indicated a reduction in hard press pad stackup lamination pressure reduced panel stretch in the y axis approximately 70%. A third DoE illustrated increasing the pre-HASL bake temperature could reduce delamination/solder wicking when using a soft press pad lamination stackup.

  3. Use of organic solderability preservatives on solderability retention of copper after accelerated aging

    SciTech Connect

    Hernandez, C.L.; Sorensen, N.R.; Lucero, S.J.

    1997-02-01

    Organic solderability preservatives (OSP`s) have been used by the electronics industry for some time to maintain the solderability of circuit boards and components. Since solderability affects both manufacturing efficiency and product reliability, there is significant interest in maintaining good solder wettability. There is often a considerable time interval between the initial fabrication of a circuit board or component and its use at the assembly level. Parts are often stored under a variety of conditions, in many cases not well controlled. Solder wettability can deteriorate during storage, especially in harsh environments. This paper describes the ongoing efforts at Sandia National Laboratories to quantify solder watability on bare and aged copper surfaces. Benzotriazole and imidazole were applied to electronic grade copper to retard aging effects on solderability. The coupons were introduced into Sandia`s Facility for Atmospheric Corrosion Testing (FACT) to simulate aging in a typical indoor industrial environment. H{sub 2}S, NO{sub 2} and Cl{sub 2} mixed gas was introduced into the test cell and maintained at 35{degrees}C and 70% relative humidity for test periods of one day to two weeks. The OSP`s generally performed better than bare Cu, although solderability diminished with increasing exposure times.

  4. Soldering In Space Investigation

    NASA Technical Reports Server (NTRS)

    2004-01-01

    This video captures Mike Fincke melting solder during the first set of planned In-Space Soldering Investigation (ISSI) experiments onboard the International Space Station (ISS). In the video, Fincke touches the tip of the soldering iron to a wire wrapped with rosin-core solder. Review of the experiment video revealed melting kinetics, wetting characteristics, and equilibrium shape attainment of the solder charge. The main photograph shows the results of feeding solder wire onto a heated surface. Here the solder is still attached with the spool seen floating in the foreground of the image. The inset photograph at right, shows a set of three simple melting experiments in which the solder, not affected by gravity, achieved an unexpected equilibrium football shape on the wire. Samples returned to Earth were examined for porosity and flux distribution as well as micro structural development. ISSI's purpose was to find out how solder behaves in a weightless environment and promote our knowledge of fabrication and repair techniques that might be employed during extended space exploration missions.

  5. Soldering In Space Investigation

    NASA Technical Reports Server (NTRS)

    2004-01-01

    This video captures Mike Fincke melting solder during the first set of planned In-Space Soldering Investigation (ISSI) experiments onboard the International Space Station (ISS). In the video, Fincke touches the tip of the soldering iron to a wire wrapped with rosin-core solder.Review of the experiment video revealed melting kinetics, wetting characteristics, and equilibrium shape attainment of the solder charge. The main photograph shows the results of feeding solder wire onto a heated surface. Here the solder is still attached with the spool seen floating in the foreground of the image. The inset photograph at right, shows a set of three simple melting experiments in which the solder, not affected by gravity, achieved an unexpected equilibrium football shape on the wire. Samples returned to Earth were examined for porosity and flux distribution as well as micro structural development. ISSI's purpose was to find out how solder behaves in a weightless environment and promote our knowledge of fabrication and repair techniques that might be employed during extended space exploration missions.

  6. Laser soldering of Sn-Ag solder

    SciTech Connect

    Felipe, T.S. de; O`Laughlin, D.

    1994-12-31

    In recent years, there has been pressure from federal and state environmental agencies to find substitutes for Pb-containing solders. Our research team has been studying SnAg solder as a possible alternative. in comparison to Sn-Pb solder, SnAg poses less of an environmental threat and can be used for higher temperature applications such as in avionics or under the hood in automobiles. Our study also compares the processes of laser and IR reflow soldering and their effects on microstructure, microstructure stability, and mechanical and thermomechanical properties of joints. Several laser soldered joints were produced by varying beam power and scan rate. Microhardness was measured and joint microstructure analyzed in order to find the optimum parameters. Laser soldered joints with optimum parameters were then exposed to temperatures between 40{degrees}C and 190{degrees}C for times up to 300 days along with conventional IR reflowed joints. The purpose was to determine the long term microstructural stability and mechanical reliability of the joints for the two processes. The results obtained show that there is a processing window where good quality laser solder joints can be produced. Our study also revealed that, initially, laser-produced joints differed significantly in microstructural details and were superior to IR reflowed joints in both microhardness and microstructure. As the samples were aged, it was observed that the microstructures and microhardnesses became increasingly similar. Finally, after significant aging, voids were found at the intermetallic layers formed at Cu or Cu alloy substrates and the joints began to fail.

  7. Reduced oxide soldering activation (ROSA) PWB solderability testing

    SciTech Connect

    Hernandez, C.L.; Hosking, F.M.; Reed, J.; Tench, D.M.; White, J.

    1996-02-01

    The effect of ROSA pretreatment on the solderability of environmentally stressed PWB test coupons was investigated. The PWB surface finish was an electroplated, reflowed solder. Test results demonstrated the ability to recover plated-through-hole fill of steam aged samples with solder after ROSA processing. ROSA offers an alternative method for restoring the solderability of aged PWB surfaces.

  8. Compound solder joints

    NASA Technical Reports Server (NTRS)

    Batista, R. I.; Simonson, R. B.

    1976-01-01

    Joining technique prevents contamination, may be used to join dissimilar metal tubes, minimizes fluid and gas entrapment, expedites repairs, and can yield joints having leakage rates less than 0.000001 standard cubic cm He/min. Components of joint are solder sleeve, two solder rings, Teflon sleeve, and tubing to be joined.

  9. Solder Reflow Failures in Electronic Components During Manual Soldering

    NASA Technical Reports Server (NTRS)

    Teverovsky, Alexander; Greenwell, Chris; Felt, Frederick

    2008-01-01

    This viewgraph presentation reviews the solder reflow failures in electronic components that occur during manual soldering. It discusses the specifics of manual-soldering-induced failures in plastic devices with internal solder joints. The failure analysis turned up that molten solder had squeezed up to the die surface along the die molding compound interface, and the dice were not protected with glassivation allowing solder to short gate and source to the drain contact. The failure analysis concluded that the parts failed due to overheating during manual soldering.

  10. Removing Dross From Molten Solder

    NASA Technical Reports Server (NTRS)

    Webb, Winston S.

    1990-01-01

    Automatic device helps to assure good solder connections. Machine wipes dross away from area on surface of molten solder in pot. Sweeps across surface of molten solder somewhat in manner of windshield wiper. Each cycle of operation triggered by pulse from external robot. Equipment used wherever precise, automated soldering must be done to military specifications.

  11. Stress-relieved solder joints

    NASA Technical Reports Server (NTRS)

    Zemenick, C. J.

    1980-01-01

    Mechanical stress on solder joints is reduced by procedure for soldering electronic components to circuit boards. Procedure was developed for radio-frequency (RF) strip-line circuits, for which dimensions must be carefully controlled to minimize parasitic capacitance and inductance. Procedure consists of loosening component from its mounting after each lead is soldered relieving induced stresses before next soldering step.

  12. Processing AIRS Scientific Data Through Level 3

    NASA Technical Reports Server (NTRS)

    Granger, Stephanie; Oliphant, Robert; Manning, Evan

    2010-01-01

    The Atmospheric Infra-Red Sounder (AIRS) Science Processing System (SPS) is a collection of computer programs, known as product generation executives (PGEs). The AIRS SPS PGEs are used for processing measurements received from the AIRS suite of infrared and microwave instruments orbiting the Earth onboard NASA's Aqua spacecraft. Early stages of the AIRS SPS development were described in a prior NASA Tech Briefs article: Initial Processing of Infrared Spectral Data (NPO-35243), Vol. 28, No. 11 (November 2004), page 39. In summary: Starting from Level 0 (representing raw AIRS data), the AIRS SPS PGEs and the data products they produce are identified by alphanumeric labels (1A, 1B, 2, and 3) representing successive stages or levels of processing. The previous NASA Tech Briefs article described processing through Level 2, the output of which comprises geo-located atmospheric data products such as temperature and humidity profiles among others. The AIRS Level 3 PGE samples selected information from the Level 2 standard products to produce a single global gridded product. One Level 3 product is generated for each day s collection of Level 2 data. In addition, daily Level 3 products are aggregated into two multiday products: an eight-day (half the orbital repeat cycle) product and monthly (calendar month) product.

  13. Solder dross removal apparatus

    NASA Technical Reports Server (NTRS)

    Webb, Winston S. (Inventor)

    1990-01-01

    An automatic dross removal apparatus is disclosed for removing dross from the surface of a solder bath in an automated electric component handling system. A rotatable wiper blade is positioned adjacent the solder bath which skims the dross off of the surface prior to the dipping of a robot conveyed component into the bath. An electronic control circuit causes a motor to rotate the wiper arm one full rotational cycle each time a pulse is received from a robot controller as a component approaches the solder bath.

  14. Solder dross removal apparatus

    NASA Technical Reports Server (NTRS)

    Webb, Winston S. (Inventor)

    1992-01-01

    An automatic dross removal apparatus (10) is disclosed for removing dross from the surface of a solder bath (22) in an automated electric component handling system. A rotatable wiper blade (14) is positioned adjacent the solder bath (22) which skims the dross off of the surface prior to the dipping of a robot conveyed component into the bath. An electronic control circuit (34) causes a motor (32) to rotate the wiper arm (14) one full rotational cycle each time a pulse is received from a robot controller (44) as a component approaches the solder bath (22).

  15. Acid soldering flux poisoning

    MedlinePlus

    The harmful substances in soldering fluxes are called hydrocarbons. They include: Ammonium chloride Rosin Hydrochloric acid Zinc ... Lee DC. Hydrocarbons. In: Marx JA, Hockberger RS, Walls RM, et ... Rosen's Emergency Medicine: Concepts and Clinical Practice . 8th ...

  16. Detecting Defective Solder Bonds

    NASA Technical Reports Server (NTRS)

    Paulson, R.; Barney, J.; Decker, H. J.

    1984-01-01

    Method is noncontact and nondestructive. Technique detects solder bonds in solar array of other large circuit board, using thermal-imaging camera. Board placed between heat lamp and camera. Poor joints indiated by "cold" spots on the infrared image.

  17. SOLDERING OF ALUMINUM BASE METALS

    DOEpatents

    Erickson, G.F.

    1958-02-25

    This patent deals with the soldering of aluminum to metals of different types, such as copper, brass, and iron. This is accomplished by heating the aluminum metal to be soldered to slightly above 30 deg C, rubbing a small amount of metallic gallium into the part of the surface to be soldered, whereby an aluminum--gallium alloy forms on the surface, and then heating the aluminum piece to the melting point of lead--tin soft solder, applying lead--tin soft solder to this alloyed surface, and combining the aluminum with the other metal to which it is to be soldered.

  18. Solder extrusion pressure bonding process and bonded products produced thereby

    DOEpatents

    Beavis, L.C.; Karnowsky, M.M.; Yost, F.G.

    1992-06-16

    Disclosed is a process for production of soldered joints which are highly reliable and capable of surviving 10,000 thermal cycles between about [minus]40 C and 110 C. Process involves interposing a thin layer of a metal solder composition between the metal surfaces of members to be bonded and applying heat and up to about 1000 psi compression pressure to the superposed members, in the presence of a reducing atmosphere, to extrude the major amount of the solder composition, contaminants including fluxing gases and air, from between the members being bonded, to form a very thin, strong intermetallic bonding layer having a thermal expansion tolerant with that of the bonded members.

  19. Solder extrusion pressure bonding process and bonded products produced thereby

    DOEpatents

    Beavis, Leonard C.; Karnowsky, Maurice M.; Yost, Frederick G.

    1992-01-01

    Production of soldered joints which are highly reliable and capable of surviving 10,000 thermal cycles between about -40.degree. C. and 110.degree. C. Process involves interposing a thin layer of a metal solder composition between the metal surfaces of members to be bonded and applying heat and up to about 1000 psi compression pressure to the superposed members, in the presence of a reducing atmosphere, to extrude the major amount of the solder composition, contaminants including fluxing gases and air, from between the members being bonded, to form a very thin, strong intermetallic bonding layer having a thermal expansion tolerant with that of the bonded members.

  20. Processing AIRS Scientific Data Through Level 2

    NASA Technical Reports Server (NTRS)

    Oliphant, Robert; Lee, Sung-Yung; Chahine, Moustafa; Susskind, Joel; arnet, Christopher; McMillin, Larry; Goldberg, Mitchell; Blaisdell, John; Rosenkranz, Philip; Strow, Larrabee

    2007-01-01

    The Atmospheric Infrared Spectrometer (AIRS) Science Processing System (SPS) is a collection of computer programs, denoted product generation executives (PGEs), for processing the readings of the AIRS suite of infrared and microwave instruments orbiting the Earth aboard NASA s Aqua spacecraft. AIRS SPS at an earlier stage of development was described in "Initial Processing of Infrared Spectral Data' (NPO-35243), NASA Tech Briefs, Vol. 28, No. 11 (November 2004), page 39. To recapitulate: Starting from level 0 (representing raw AIRS data), the PGEs and their data products are denoted by alphanumeric labels (1A, 1B, and 2) that signify the successive stages of processing. The cited prior article described processing through level 1B (the level-2 PGEs were not yet operational). The level-2 PGEs, which are now operational, receive packages of level-1B geolocated radiance data products and produce such geolocated geophysical atmospheric data products such as temperature and humidity profiles. The process of computing these geophysical data products is denoted "retrieval" and is quite complex. The main steps of the process are denoted microwave-only retrieval, cloud detection and cloud clearing, regression, full retrieval, and rapid transmittance algorithm.

  1. Passive alignment and soldering technique for optical components

    NASA Astrophysics Data System (ADS)

    Faidel, Heinrich; Gronloh, Bastian; Winzen, Matthias; Liermann, Erik; Esser, Dominik; Morasch, Valentin; Luttmann, Jörg; Leers, Michael; Hoffmann, Dieter

    2012-03-01

    The passive-alignment-packaging technique presented in this work provides a method for mounting tolerance-insensitive optical components e.g. non-linear crystals by means of mechanical stops. The requested tolerances for the angle deviation are +/-100 μrad and for the position tolerance +/-100 μm. Only the angle tolerances were investigated, because they are more critical. The measurements were carried out with an autocollimator. Fused silica components were used for test series. A solder investigation was carried out. Different types of solder were tested. Due to good solderability on air and low induced stress in optical components, Sn based solders were indicated as the most suitable solders. In addition several concepts of reflow soldering configuration were realized. In the first iteration a system with only the alignment of the yaw angle was implemented. The deviation for all materials after the thermal and mechanical cycling was within the tolerances. The solderability of BBO and LBO crystals was investigated and concepts for mounting were developed.

  2. Utilization of Pb-free solders in MEMS packaging

    NASA Astrophysics Data System (ADS)

    Selvaduray, Guna S.

    2003-01-01

    Soldering of components within a package plays an important role in providing electrical interconnection, mechanical integrity and thermal dissipation. MEMS packages present challenges that are more complex than microelectronic packages because they are far more sensitive to shock and vibration and also require precision alignment. Soldering is used at two major levels within a MEMS package: at the die attach level and at the component attach level. Emerging environmental regulations worldwide, notably in Europe and Japan, have targeted the elimination of Pb usage in electronic assemblies, due to the inherent toxicity of Pb. This has provided the driving force for development and deployment of Pb-free solder alloys. A relatively large number of Pb-free solder alloys have been proposed by various researchers and companies. Some of these alloys have also been patented. After several years of research, the solder alloy system that has emerged is based on Sn as a major component. The electronics industry has identified different compositions for different specific uses, such as wave soldering, surface mount reflow, etc. The factors that affect choice of an appropriate Pb-free solder can be divided into two major categories, those related to manufacturing, and those related to long term reliability and performance.

  3. Microwave Tissue Soldering for Immediate Wound Closure

    NASA Technical Reports Server (NTRS)

    Arndt, G. Dickey; Ngo, Phong H.; Plan, Chau T.; Byerly, Diane; Dusl, John; Sognier, Marguerite A.

    2011-01-01

    equipment cannot be easily moved between operating rooms, let alone relocated to field sites where emergencies often occur. In addition, this approach is highly dependent on the uniformity and thickness of the protein solder as well as the surgeon s skills. In contrast, the use of microwave energy is highly tolerant of the thickness of the protein solder, level of fluids in and around the wound, and other parameters that can adversely affect the outcome of laser welding. However, controlling the depth of penetration of the microwave energy into the wound is critical for achieving effective wound sealing without damaging the adjacent tissue. In addition, microspheres that encapsulate metallic cores could also be incorporated into the protein solder to further control the depth of penetration of the microwave energy.

  4. Mechanical Solder Characterisation Under High Strain Rate Conditions

    NASA Astrophysics Data System (ADS)

    Meier, Karsten; Roellig, Mike; Wiese, Steffen; Wolter, Klaus-Juergen

    2010-11-01

    Using a setup for high strain rate tensile experiments the mechanical behavior of two lead-free tin based solders is investigated. The first alloy is SnAg1.3Cu0.5Ni. The second alloy has a higher silver content but no addition of Ni. Solder joints are the main electrical, thermal and mechanical interconnection technology on the first and second interconnection level. With the recent rise of 3D packaging technologies many novel interconnection ideas are proposed with innovative or visionary nature. Copper pillar, stud bump, intermetallic (SLID) and even spring like joints are presented in a number of projects. However, soldering will remain one of the important interconnect technologies. Knowing the mechanical properties of solder joints is important for any reliability assessment, especially when it comes to vibration and mechanical shock associated with mobile applications. Taking the ongoing miniaturization and linked changes in solder joint microstructure and mechanical behavior into account the need for experimental work on that issue is not satisfied. The tests are accomplished utilizing miniature bulk specimens to match the microstructure of real solder joints as close as possible. The dogbone shaped bulk specimens have a crucial diameter of 1 mm, which is close to BGA solder joints. Experiments were done in the strain rate range from 20 s-1 to 600 s-1. Solder strengthening has been observed with increased strain rate for both SAC solder alloys. The yield stress increases by about 100% in the investigated strain rate range. The yield level differs strongly. A high speed camera system was used to assist the evaluation process of the stress and strain data. Besides the stress and strain data extracted from the experiment the ultimate fracture strain is determined and the fracture surfaces are evaluated using SEM technique considering rate dependency.

  5. Breakthrough: Lead-free Solder

    SciTech Connect

    Anderson, Iver

    2012-01-01

    Ames Laboratory senior metallurgist Iver Anderson explains the importance of lead-free solder in taking hazardous lead out of the environment by eliminating it from discarded computers and electronics that wind up in landfills. Anderson led a team that developed a tin-silver-copper replacement for traditional lead-tin solder that has been adopted by more than 50 companies worldwide.

  6. Breakthrough: Lead-free Solder

    ScienceCinema

    Anderson, Iver

    2013-03-01

    Ames Laboratory senior metallurgist Iver Anderson explains the importance of lead-free solder in taking hazardous lead out of the environment by eliminating it from discarded computers and electronics that wind up in landfills. Anderson led a team that developed a tin-silver-copper replacement for traditional lead-tin solder that has been adopted by more than 50 companies worldwide.

  7. Air lead exposures and blood lead levels within a large automobile manufacturing workforce, 1980-1985

    SciTech Connect

    Kononen, D.W.; Kintner, H.J.; Bivol, K.R. )

    1989-07-01

    Recent (1980-1985) trends in air lead (PbA) exposures and blood lead (PbB) levels experienced by approximately 10,000 workers employed in various stages of the automobile manufacturing process (i.e., auto assembly, lead-acid battery manufacture, foundry work, and other manufacturing-related operations) are described. Between 1980-1985, the mean PbB levels of assembly, battery, foundry, and other workers decreased by 28, 24, 3, and 27%, respectively, to 16.6, 23.6, 15.9, and 11.8 micrograms Pb/dl. Workers in the following job categories experienced the highest annual mean PbB levels: paste machine operators (battery plants), solder-grinders (assembly plants), and crane operators (foundries). During the same period, median 8-h Time Weighted Average PbA exposures (micrograms Pb/m3) in assembly plants, battery plants, and foundries decreased by 10, 12, and 20%, respectively, to 8.1, 13.6, and 10.9 micrograms/m3.

  8. Air lead exposures and blood lead levels within a large automobile manufacturing workforce, 1980-1985.

    PubMed

    Kononen, D W; Kintner, H J; Bivol, K R

    1989-01-01

    Recent (1980-1985) trends in air lead (PbA) exposures and blood lead (PbB) levels experienced by approximately 10,000 workers employed in various stages of the automobile manufacturing process (i.e., auto assembly, lead-acid battery manufacture, foundry work, and "other" manufacturing-related operations) are described. Between 1980-1985, the mean PbB levels of assembly, battery, foundry, and "other" workers decreased by 28, 24, 3, and 27%, respectively, to 16.6, 23.6, 15.9, and 11.8 micrograms Pb/dl. Workers in the following job categories experienced the highest annual mean PbB levels: paste machine operators (battery plants), solder-grinders (assembly plants), and crane operators (foundries). During the same period, median 8-h Time Weighted Average PbA exposures (micrograms Pb/m3) in assembly plants, battery plants, and foundries decreased by 10, 12, and 20%, respectively, to 8.1, 13.6, and 10.9 micrograms/m3. PMID:2782946

  9. 21 CFR 189.240 - Lead solders.

    Code of Federal Regulations, 2014 CFR

    2014-04-01

    ... 21 Food and Drugs 3 2014-04-01 2014-04-01 false Lead solders. 189.240 Section 189.240 Food and...-Contact Surfaces § 189.240 Lead solders. (a) Lead solders are alloys of metals that include lead and are... in can solder is deemed to be adulterated in violation of the Federal Food, Drug, and Cosmetic...

  10. METHOD FOR SOLDERING NORMALLY NON-SOLDERABLE ARTICLES

    DOEpatents

    McGuire, J.C.

    1959-11-24

    Methods are presented for coating and joining materials which are considered difficult to solder by utilizing an abrasive wheel and applying a bar of a suitable coating material, such as Wood's metal, to the rotating wheel to fill the cavities of the abrasive wheel and load the wheel with the coating material. The surface of the base material is then rubbed against the loaded rotating wheel, thereby coating the surface with the soft coating metal. The coating is a cohesive bonded layer and holds the base metal as tenaciously as a solder holds to easily solderable metals.

  11. Requirements for soldered electrical connections

    NASA Technical Reports Server (NTRS)

    1992-01-01

    This publication is applicable to NASA programs involving solder connections for flight hardware, mission essential support equipment, and elements thereof. This publication sets forth hand and wave soldering requirements for reliable electrical connections. The prime consideration is the physical integrity of solder connections. Special requirements may exist which are not in conformance with the requirements of this publication. Design documentation contains the detail for these requirements, and they take precedence over conflicting portions of this publication when they are approved in writing by the procuring NASA installation.

  12. Solder extrusion pressure bonding process and bonded products produced thereby

    SciTech Connect

    Beavis, L.C.; Karnowsky, M.M.; Yost, F.G.

    1990-12-31

    Production of soldiered joints which are highly reliable and capable of surviving 10,000 thermal cycles between about {minus}40{degrees}C and 110{degrees}C. Process involves interposing a thin layer of a metal solder composition between the metal surfaces of members to be bonded and applying heat and up to about 1000 psi compression pressure to the superposed members, in the presence of a reducing atmosphere, to extrude the major amount of the solder composition, contaminants including fluxing gases and air, from between the members being bonded, to form a very thin, strong intermetallic bonding layer having a thermal expansion tolerant with that of the bonded members.

  13. A new active solder for joining electronic components

    SciTech Connect

    SMITH,RONALD W.; VIANCO,PAUL T.; HERNANDEZ,CYNTHIA L.; LUGSCHEIDER,E.; RASS,I.; HILLEN,F.

    2000-05-11

    Electronic components and micro-sensors utilize ceramic substrates, copper and aluminum interconnect and silicon. The joining of these combinations require pre-metallization such that solders with fluxes can wet such combinations of metals and ceramics. The paper will present a new solder alloy that can bond metals, ceramics and composites. The alloy directly wets and bonds in air without the use flux or premetallized layers. The paper will present typical processing steps and joint microstructures in copper, aluminum, aluminum oxide, aluminum nitride, and silicon joints.

  14. Materials and mechanics issues of solder alloy applications

    NASA Astrophysics Data System (ADS)

    Kinsman, Ken; Frear, Darrel R.; Jones, Wendell B.

    1990-09-01

    The key conclusion out of the Solder Mechanics Workshop is that, overall, the technical and scientific community does not know as much quantitatively about solder behavior as we had hoped. The good news, however, is that the microelectronics user community, which is largely served by solder activities, has come to terms with the current environment through active participation in the workshop. The air has been cleared. As a technical community, we have a better idea of what our priorities for continued research are. A much more detailed overview of the workshop will be available shortly in monograph form. Individual chapters will be written by authors present at the workshop and will emphasize background material (e.g., literature critiques) and detail the technical consensus on critical issues central to the workshop. The book will be available through TMS and will be the first volume in a new series of technical monographs sponsored by the society's Electronic, Magnetic and Photonic Materials Division.

  15. Welding, brazing, and soldering handbook

    NASA Technical Reports Server (NTRS)

    Kilgore, A. B.; Koehler, M. L.; Metzler, J. W.; Sturges, S. R.

    1969-01-01

    Handbook gives information on the selection and application of welding, brazing, and soldering techniques for joining various metals. Summary descriptions of processes, criteria for process selection, and advantages of different methods are given.

  16. Reading Grade Levels of Air Force Civilian Personnel.

    ERIC Educational Resources Information Center

    Massey, Randy H.; Mathews, John J.

    A study was conducted to examine the reading levels of United States Air Force civilian employees according to occupational groupings and grade structure. Approximately 1,050 Air Force civilian subjects were tested on the Nelson-Denny Reading Test or the California Reading Test. Subjects were selected from eight Air Force bases representing the…

  17. Air pollution levels and regulations in Canada

    SciTech Connect

    Monarch, M.

    1986-08-01

    This report is one of a series of three prepared for the Office of Fossil Energy of the US Department of Energy. Each report deals with one county in which acid deposition, commonly referred to as acid rain, has been a prominent issue of public discussion. The three countries covered in this series of reports are Canada, the Federal Republic of Germany, and the United Kingdom. For each country, air pollution control regulations are trends in air quality and emissions are broadly outlined, then are compared with corresponding regulations and trends in the United States. Since acid rain is the intended field of application, the reports generally deal only with sulfur dioxide, nitrogen oxides, ozone, and total suspended particulates.

  18. Economical solder connections to thin films

    NASA Technical Reports Server (NTRS)

    Bass, J. A.; Gaddy, E. M.

    1979-01-01

    Soldering procedure, successfully tested for attaching leads to silicon solar cells, cover-glasses, is simple, inexpensive, and very effective in forming stable connection. Procedure uses solder of indium alloyed with either silver or tin.

  19. Wetting behavior of alternative solder alloys

    SciTech Connect

    Hosking, F.M.; Vianco, P.T.; Hernandez, C.L.; Rejent, J.A.

    1993-07-01

    Recent economic and environmental issues have stimulated interest in solder alloys other than the traditional Sn-Pb eutectic or near eutectic composition. Preliminary evaluations suggest that several of these alloys approach the baseline properties (wetting, mechanical, thermal, and electrical) of the Sn-Pb solders. Final alloy acceptance will require major revisions to existing industrial and military soldering specifications. Bulk alloy and solder joint properties are consequently being investigated to validate their producibility and reliability. The work reported in this paper examines the wetting behavior of several of the more promising commercial alloys on copper substrates. Solder wettability was determined by the meniscometer and wetting balance techniques. The wetting results suggest that several of the alternative solders would satisfy pretinning and surface mount soldering applications. Their use on plated through hole technology might be more difficult since the alloys generally did not spread or flow as well as the 60Sn-40Pb solder.

  20. 21 CFR 189.240 - Lead solders.

    Code of Federal Regulations, 2012 CFR

    2012-04-01

    ... 21 Food and Drugs 3 2012-04-01 2012-04-01 false Lead solders. 189.240 Section 189.240 Food and... Addition to Human Food Through Food-Contact Surfaces § 189.240 Lead solders. (a) Lead solders are alloys of... container that makes use of lead in can solder is deemed to be adulterated in violation of the Federal...

  1. 21 CFR 189.240 - Lead solders.

    Code of Federal Regulations, 2013 CFR

    2013-04-01

    ... 21 Food and Drugs 3 2013-04-01 2013-04-01 false Lead solders. 189.240 Section 189.240 Food and... Addition to Human Food Through Food-Contact Surfaces § 189.240 Lead solders. (a) Lead solders are alloys of... container that makes use of lead in can solder is deemed to be adulterated in violation of the Federal...

  2. 21 CFR 189.240 - Lead solders.

    Code of Federal Regulations, 2011 CFR

    2011-04-01

    ... 21 Food and Drugs 3 2011-04-01 2011-04-01 false Lead solders. 189.240 Section 189.240 Food and... Addition to Human Food Through Food-Contact Surfaces § 189.240 Lead solders. (a) Lead solders are alloys of... container that makes use of lead in can solder is deemed to be adulterated in violation of the Federal...

  3. Modified Spot Welder Solders Flat Cables

    NASA Technical Reports Server (NTRS)

    Haehner, Carl L.

    1992-01-01

    Soldering device, essentially modified spot welder, melts high-melting-temperature solders without damaging plastic insulation on flat electrical cables. Solder preform rests on exposed conductor of cable, under connector pin. Electrodes press pin/preform/conductor sandwich together and supply pulse of current to melt preform, bonding pin to conductor. Anvil acts as support and heat sink. Device used to solder flexible ribbon cables to subminiature pin connectors.

  4. 21 CFR 189.240 - Lead solders.

    Code of Federal Regulations, 2010 CFR

    2010-04-01

    ... 21 Food and Drugs 3 2010-04-01 2009-04-01 true Lead solders. 189.240 Section 189.240 Food and... Addition to Human Food Through Food-Contact Surfaces § 189.240 Lead solders. (a) Lead solders are alloys of metals that include lead and are used in the construction of metal food cans. (b) Food packaged in...

  5. 16 CFR 501.8 - Solder.

    Code of Federal Regulations, 2013 CFR

    2013-01-01

    ... 16 Commercial Practices 1 2013-01-01 2013-01-01 false Solder. 501.8 Section 501.8 Commercial Practices FEDERAL TRADE COMMISSION RULES, REGULATIONS, STATEMENT OF GENERAL POLICY OR INTERPRETATION AND... 500 § 501.8 Solder. Solder and brazing alloys containing precious metals when packaged and labeled...

  6. 16 CFR 501.8 - Solder.

    Code of Federal Regulations, 2011 CFR

    2011-01-01

    ... 16 Commercial Practices 1 2011-01-01 2011-01-01 false Solder. 501.8 Section 501.8 Commercial Practices FEDERAL TRADE COMMISSION RULES, REGULATIONS, STATEMENT OF GENERAL POLICY OR INTERPRETATION AND... 500 § 501.8 Solder. Solder and brazing alloys containing precious metals when packaged and labeled...

  7. 16 CFR 501.8 - Solder.

    Code of Federal Regulations, 2012 CFR

    2012-01-01

    ... 16 Commercial Practices 1 2012-01-01 2012-01-01 false Solder. 501.8 Section 501.8 Commercial Practices FEDERAL TRADE COMMISSION RULES, REGULATIONS, STATEMENT OF GENERAL POLICY OR INTERPRETATION AND... 500 § 501.8 Solder. Solder and brazing alloys containing precious metals when packaged and labeled...

  8. 16 CFR 501.8 - Solder.

    Code of Federal Regulations, 2010 CFR

    2010-01-01

    ... 16 Commercial Practices 1 2010-01-01 2010-01-01 false Solder. 501.8 Section 501.8 Commercial Practices FEDERAL TRADE COMMISSION RULES, REGULATIONS, STATEMENT OF GENERAL POLICY OR INTERPRETATION AND... 500 § 501.8 Solder. Solder and brazing alloys containing precious metals when packaged and labeled...

  9. Heat Lamps Solder Solar Array Quickly

    NASA Technical Reports Server (NTRS)

    Coyle, P. J.; Crouthamel, M. S.

    1982-01-01

    Interconnection tabs in a nine-solar-cell array have been soldered simultaneously with radiant heat. Cells and tabs are held in position for soldering by sandwiching them between compliant silicone-rubber vacuum platen and transparent polyimide sealing membrane. Heat lamps warm cells, producing smooth, flat solder joints of high quality.

  10. 16 CFR 501.8 - Solder.

    Code of Federal Regulations, 2014 CFR

    2014-01-01

    ... 16 Commercial Practices 1 2014-01-01 2014-01-01 false Solder. 501.8 Section 501.8 Commercial Practices FEDERAL TRADE COMMISSION RULES, REGULATIONS, STATEMENT OF GENERAL POLICY OR INTERPRETATION AND... 500 § 501.8 Solder. Solder and brazing alloys containing precious metals when packaged and labeled...

  11. Reliability of lead-free solders in electronic packaging technology

    NASA Astrophysics Data System (ADS)

    Choi, Woojin

    have performed synchrotron radiation micro-diffraction analysis of Sn whiskers grown on the finish of eutectic SnCu to measure the local stress level and the orientation of the grains around the whisker. Also, we examined the intermetallic compound which gives the compressive stress and the surface oxide on the solder finish by Focused Ion Beam (FIB) and Transmission Electron Microscopy (TEM).

  12. An Overview of Surface Finishes and Their Role in Printed Circuit Board Solderability and Solder Joint Performance

    SciTech Connect

    Vianco, P.T.

    1998-10-15

    A overview has been presented on the topic of alternative surface finishes for package I/Os and circuit board features. Aspects of processability and solder joint reliability were described for the following coatings: baseline hot-dipped, plated, and plated-and-fused 100Sn and Sn-Pb coatings; Ni/Au; Pd, Ni/Pd, and Ni/Pd/Au finishes; and the recently marketed immersion Ag coatings. The Ni/Au coatings appear to provide the all-around best option in terms of solderability protection and wire bondability. Nickel/Pal ftishes offer a slightly reduced level of performance in these areas that is most likely due to variable Pd surface conditions. It is necessmy to minimize dissolved Au or Pd contents in the solder material to prevent solder joint embrittlement. Ancillary aspects that included thickness measurement techniques; the importance of finish compatibility with conformal coatings and conductive adhesives; and the need for alternative finishes for the processing of non-Pb bearing solders were discussed.

  13. Drinking Water Contamination Due To Lead-based Solder

    NASA Astrophysics Data System (ADS)

    Garcia, N.; Bartelt, E.; Cuff, K. E.

    2004-12-01

    The presence of lead in drinking water creates many health hazards. Exposure to lead-contaminated water can affect the brain, the central nervous system, blood cells, and kidneys, causing such problems as mental retardation, kidney disease, heart disease, stroke, and death. One way in which lead can contaminate our water supply is through the use of lead solder to join pipes. Lead solder was widely used in the past because of its ease of application as well as its low cost. Lead contamination in residential areas has previously been found to be a particularly serious problem in first-draw samples, of water that has sat stagnant in pipes overnight. To investigate the time-dependence of drinking water lead contamination, we analyzed samples taken hourly of water exposed to lead solder. While our preliminary data was insufficient to show more than a rough correlation between time of exposure and lead concentration over short periods (1-3 hours), we were able to confirm that overnight exposure of water to lead-based solder results in the presence high levels of lead. We also investigated other, external factors that previous research has indicated contribute to increased concentrations of lead. Our analysis of samples of lead-exposed water at various pH and temperatures suggests that these factors can be equally significant in terms of their contribution to elevated lead concentration levels. In particular, water that is slightly corrosive appears to severely impact the solubility of lead. As this type of water is common in much of the Northeast United States, the presence of lead-based solder in residential areas there is especially problematic. Although lead-based solder has been banned since the 1980s, it remains a serious concern, and a practical solution still requires further research.

  14. AIRS Level 1b Algorithm Theoretical Basis Document

    NASA Technical Reports Server (NTRS)

    Aumann, H.; Gregorich, D.; Gaiser, S.; Hagan, D.; Pagano, T.; Ting, D.

    2000-01-01

    The level 1b Algorithm Theoretical Basis Document (ATBD) describes the theoretical bases of the algorithms used to convert the raw detector output (data numbers) from the Atmospheric Infrared Sounder (AIRS), the Advanced Microwave Sounding Unit (AMSU) and Humidity Sounder Brazil (HSB) to physical radiance units and, in the case of AIRS, perform in-orbit spectral calibrations.

  15. Solder Joint Health Monitoring Testbed

    NASA Technical Reports Server (NTRS)

    Delaney, Michael M.; Flynn, James G.; Browder, Mark E.

    2009-01-01

    A method of monitoring the health of selected solder joints, called SJ-BIST, has been developed by Ridgetop Group Inc. under a Small Business Innovative Research (SBIR) contract. The primary goal of this research program is to test and validate this method in a flight environment using realistically seeded faults in selected solder joints. An additional objective is to gather environmental data for future development of physics-based and data-driven prognostics algorithms. A test board is being designed using a Xilinx FPGA. These boards will be tested both in flight and on the ground using a shaker table and an altitude chamber.

  16. Application of ESEM to fluxless soldering.

    PubMed

    Koopman, N

    1993-08-01

    The ESEM is ideally suited to study soldering processes. We have used it to observe solder reflow and joining in ambient gases. It reproduces effects of atmospheric pressure reflow in a hot stage light microscope, but with much better clarity and depth of field. Compared to a regular SEM, the ESEM offers advantages of atmosphere control and ability to observe the solder samples without carbon or gold coating. These coatings could interfere with the oxidation/reduction reactions which occur at the solder/ambient gas interface. Very thin surface films, especially oxide layers, dramatically influence the flow of liquid solder and the ability of solder to wet or join to another surface. Fluxless processes in particular are ideally suited for study in the ESEM. We have used the ESEM to observe dynamic fluxless soldering and have recorded events on videotape for later stop-action still pictures and slow motion photography. Examples of these processes are shown to illustrate the ESEM capability. Included are solder deformation structure, balling reflow of eutectic solder in hydrogen, balling reflow of eutectic solder in nitrogen, joining of two solder disks in nitrogen, and dynamic melting and freezing of an off-eutectic dendritic alloy. All of these are observed in the absence of flux. PMID:8400444

  17. Solder Mounting Technologies for Electronic Packaging

    SciTech Connect

    VIANCO, PAUL T.

    1999-09-23

    Soldering provides a cost-effective means for attaching electronic packages to circuit boards using both small scale and large scale manufacturing processes. Soldering processes accommodate through-hole leaded components as well as surface mount packages, including the newer area array packages such as the Ball Grid Arrays (BGA), Chip Scale Packages (CSP), and Flip Chip Technology. The versatility of soldering is attributed to the variety of available solder alloy compositions, substrate material methodologies, and different manufacturing processes. For example, low melting temperature solders are used with temperature sensitive materials and components. On the other hand, higher melting temperature solders provide reliable interconnects for electronics used in high temperature service. Automated soldering techniques can support large-volume manufacturing processes, while providing high reliability electronic products at a reasonable cost.

  18. Effects of Bonding Conditions on Bondability Using Zn/Al/Zn Clad Solder

    NASA Astrophysics Data System (ADS)

    Yamaguchi, T.; Ikeda, O.; Oda, Y.; Hata, S.; Kuroki, K.; Kuroda, H.; Hirose, A.

    2015-12-01

    Three-layer Zn/Al/Zn clad solders have been developed for high-temperature die attachment. The clad structure is used to improve the wettability and bondability of Zn-Al eutectic solder by preventing Al oxidation. The effects of the bonding conditions on the bondability with Zn/Al/Zn clad solder were investigated. Bonding was achieved in the temperature range from 385°C to 420°C under N2 atmosphere with oxygen concentration below 100 ppm. However, the bonding strength of the joint formed under N2 + 4% H2 atmosphere was almost 0 MPa, and stripe defects and air gaps remained in the bond layer. To improve the bondability under N2 + 4% H2 and expand the application range, a five-layer Cu/Zn/Al/Zn/Cu clad solder was developed in an attempt to prevent the Zn layers from being oxidized by the outer Cu layers. Cross-sectional observation of the Cu/Zn/Al/Zn/Cu clad solder revealed that the surface was covered by a Cu layer, and that Cu5Zn8 layers grew between the Cu and Zn layers. This clad solder exhibited high shear strength of over 80 MPa when formed under N2 + 4% H2 atmosphere, and no stripe defects or air gaps were observed in the bond layer.

  19. Effect of Electromigration on the Type of Drop Failure of Sn-3.0Ag-0.5Cu Solder Joints in PBGA Packages

    NASA Astrophysics Data System (ADS)

    Huang, M. L.; Zhao, N.

    2015-10-01

    Board-level drop tests of plastic ball grid array (PBGA) packages were performed in accordance with the Joint Electron Devices Engineering Council standard to investigate the effect of electromigration (EM) on the drop reliability of Sn-3.0Ag-0.5Cu solder joints with two substrate surface finishes, organic solderability preservative (OSP) and electroless nickel electroless palladium immersion gold (ENEPIG). In the as-soldered state, drop failures occurred at the substrate sides only, with cracks propagating within the interfacial intermetallic compound (IMC) layer for OSP solder joints and along the IMC/Ni-P interface for ENEPIG solder joints. The drop lifetime of OSP solder joints was approximately twice that of ENEPIG joints. EM had an important effect on crack formation and drop lifetime of the PBGA solder joints. ENEPIG solder joints performed better in drop reliability tests after EM, that is, the drop lifetime of ENEPIG joints decreased by 43% whereas that of OSP solder joints decreased by 91%, compared with the as-soldered cases. The more serious polarity effect, i.e., excessive growth of the interfacial IMC at the anode, was responsible for the sharper decrease in drop lifetime. The different types of drop failure of PBGA solder joints before and after EM, including the position of initiation and the propagation path of cracks, are discussed on the basis of the growth behavior of interfacial IMC.

  20. Fluxless laser soldering of radar housings

    SciTech Connect

    Keicher, D.M.; Hosking, F.M.

    1990-01-01

    Laser soldering of electronic components is a rapidly maturing technology and has been found to be particularly useful in the attachment of very fine pitch surface mount devices. Conversely, very little progress has been made to extend this technology to other soldering applications. It was the intention of this study to explore the feasibility of utilizing laser soldering to produce hermetic closure joints in radar packages. In producing hermetic joints, several requirements had to be met. It was essential to have a process that would eliminate the potential for entrapment of corrosive flux residues within the radar unit. In addition, it was desirable to create higher strength solder joints than could be produced by conventional step solder techniques which require lower temperature solders to be used in the final closure process. Further, solder mixing of the closure joint solder and solders used on components inside the radar was to be avoided. To fulfill the requirements, the localized heating characteristics of laser soldering made it an obvious choice for this application.

  1. NTF: Soldering Technology Development for Cryogenics

    NASA Technical Reports Server (NTRS)

    Hall, E. T., Jr.

    1985-01-01

    The advent of the National Transonic Facility (NTF) brought about a new application for an old joining method, soldering. Soldering for use at cryogenic temperatures requires that solders remain ductile and free from tin-pest (grey tin), have toughness to withstand aerodynamic loads associated with flight research, and maintain their surface finishes. Solders are used to attach 347 Stainless-Steel tubing in surface grooves of models. The solder must fill up the gap and metallurgically bound to the tubing and model. Cryogenic temperatures require that only specific materials for models can be used, including: Vasco Max 200 CVM, lescalloy A-286 Vac Arc, pH 13-8 Mo. Solders identified for testing at this time are: 50% Sn - 49.5% Pb - 0.5% Sb, 95% Sn - 5% Sb, 50% In 50% Pb, and 37.5% Sn - 37.5% Pb - 25% In. With these materials and solders, it is necessary to determine their solderability. After solderability is determined, tube/groove specimens are fabricated and stressed under cryogenic temperatures. Compatible solders are then used for acutual models.

  2. Simulation of thermomechanical fatigue in solder joints

    SciTech Connect

    Fang, H.E.; Porter, V.L.; Fye, R.M.; Holm, E.A.

    1997-12-31

    Thermomechanical fatigue (TMF) is a very complex phenomenon in electronic component systems and has been identified as one prominent degradation mechanism for surface mount solder joints in the stockpile. In order to precisely predict the TMF-related effects on the reliability of electronic components in weapons, a multi-level simulation methodology is being developed at Sandia National Laboratories. This methodology links simulation codes of continuum mechanics (JAS3D), microstructural mechanics (GLAD), and microstructural evolution (PARGRAIN) to treat the disparate length scales that exist between the macroscopic response of the component and the microstructural changes occurring in its constituent materials. JAS3D is used to predict strain/temperature distributions in the component due to environmental variable fluctuations. GLAD identifies damage initiation and accumulation in detail based on the spatial information provided by JAS3D. PARGRAIN simulates the changes of material microstructure, such as the heterogeneous coarsening in Sn-Pb solder, when the component`s service environment varies.

  3. Laser Assisted Soldering: Effects of Hydration on Solder-Tissue Adhesion

    NASA Astrophysics Data System (ADS)

    Chan, Eric K.; Brown, Dennis T.; Kovach, Ian S.; Welch, Ashley J.

    1998-10-01

    Wound stabilization is critical in early wound healing. Other than superficial skin wounds, most tissue repair is exposed to a hydrated environment postoperatively. To simulate the stability of laser-soldered tissue in a wet environment, we studied the effects of hydration on laser soldered rat dermis and baboon articular cartilage. In this in vitro study, we used a solder composed of human serum albumin, sodium hyaluronate, and Indocyanine Green. A 2 (mu) L solder droplet was deposited on each tissue specimen and then the solder was irradiated with a scanning laser beam (808 nm and 27 W/cm2). After photocoagulation, each tissue specimen was cut into two halves dividing the solder. One half was reserved as control while the other half was soaked in saline for a designated period before fixation (1 h, 1, 2, and 7 days). All tissue specimens were prepared for scanning electron microscopy (SEM). SEM examinations revealed nonuniform coagulation across the solder thickness for most of the specimens, likely a result of the temperature gradient generated by laser heating. Closer to the laser beam, the uppermost region of the solder formed a dense coagulum. The solder aggregated into small globules in the region anterior to the solder-tissue interface. All cartilage specimens soaked in saline suffered coagulum detachment from tissue surface. We noted a high concentration of the protein globules in the detached coagulum. These globules were likely responsible for solder detachment from the cartilage surface. Solder adhered better to the dermis than to cartilage. The dermal layer of the skin, composed of collagen matrix, provided a better entrapment of the solder than the smooth surface of articular cartilage. Insufficient laser heating of solder formed protein globules. Unstable solder-tissue fusion was likely a result of these globules being detached from tissue substrate when the specimen was submerged in a hydrated environment. The solder-tissue bonding was compromised

  4. Characterization of solder flow on PWB surfaces

    SciTech Connect

    Hosking, F.M.; Yost, F.G.

    1995-07-01

    Different solderability tests have been developed to determine the wetting behavior of solder on metallic surfaces. None offer an exact measure of capillary flow associated with conventional mixed technology soldering. With shrinking package designs, increasing reliability requirements, and the emergence of new soldering technologies, there is a growing need to better understand and predict the flow of solder on printed wiring board (PWB) surfaces. Sandia National Laboratories has developed a capillary flow solderability test, through a joint effort with the National Center for Manufacturing Sciences, that considers this fundamental wetting issue for surface mount technology. The test geometry consists of a metal strip (width, {delta}) connected to a circular metal pad (radius, r{sub c}). Test methodology, experimental results, and validation of a flow model are presented in this paper.

  5. Impact of Cooling Rate-Induced Recrystallization on High G Mechanical Shock and Thermal Cycling in Sn-Ag-Cu Solder Interconnects

    NASA Astrophysics Data System (ADS)

    Lee, Tae-Kyu; Bieler, Thomas R.; Kim, Choong-Un

    2016-01-01

    The mechanical stability and thermo-mechanical fatigue performance of solder joints with low silver content Sn-1.0Ag-0.5Cu (wt.%) (SAC105) alloy based on different cooling rates are investigated in high G level shock environment and thermal cycling conditions. The cooling rate-controlled samples ranging from 1°C/min to 75°C/min cooling rate, not only show differences in microstructure, where a fine poly-granular microstructure develops in the case of fast cooling versus normal cooling, but also show various shock performances based on the microstructure changes. The fast cooling rate improves the high G shock performance by over 90% compared to the normal cooled SAC105 alloy air-cooling environment commonly used after assembly reflow. The microstructure effect on thermal cycling performance is also discussed, which is analyzed based on the Sn grain orientation, interconnect stability, and solder joint bulk microstructure.

  6. Tin soldering of aluminum and its alloys

    NASA Technical Reports Server (NTRS)

    Gallo, Gino

    1921-01-01

    A method is presented for soldering aluminum to other metals. The method adopted consists of a galvanic application to the surface of the light-metal parts to be soldered, of a layer of another metal, which, without reacting electrolytically on the aluminum, adheres strongly to the surface to which it is applied, and is, on the other hand, adapted to receive the soft solder. The metal found to meet the criteria best was iron.

  7. Die Soldering in Aluminium Die Casting

    SciTech Connect

    Han, Q.; Kenik, E.A.; Viswanathan, S.

    2000-03-15

    Two types of tests, dipping tests and dip-coating tests were carried out on small steel cylinders using pure aluminum and 380 alloy to investigate the mechanism of die soldering during aluminum die casting. Optical and scanning electron microscopy were used to study the morphology and composition of the phases formed during soldering. A soldering mechanism is postulated based on experimental observations. A soldering critical temperature is postulated at which iron begins to react with aluminum to form an aluminum-rich liquid phase and solid intermetallic compounds. When the temperature at the die surface is higher than this critical temperature, the aluminum-rich phase is liquid and joins the die with the casting during the subsequent solidification. The paper discusses the mechanism of soldering for the case of pure aluminum and 380 alloy casting in a steel mold, the factors that promote soldering, and the strength of the bond formed when soldering occurs. conditions, an aluminum-rich soldering layer may also form over the intermetallic layer. Although a significant amount of research has been conducted on the nature of these intermetallics, little is known about the conditions under which soldering occurs.

  8. Soldering of complex multilayer printed boards

    NASA Astrophysics Data System (ADS)

    Garrigue, Jean-Marie; Braun, Jean-Francois

    1990-09-01

    The soldering limits of complex multilayer printed boards used for spaceborne electronic equipment are presented. 6400 configurations related to board design, component's lead characteristics and manual and wave soldering parameters, are tested. Choices and recommendations are suggested to overcome these limits. Quality and reliability aspects of the soldered joints are broached, and research topics are proposed. Soldering problems are found to develop beyond 8 to 10 layers of circuits in components with connection conductivities of less than 1 to 2 W per cm over temperature in degrees centigrade.

  9. Compatibility of lead-free solders with lead containing surface finishes as a reliability issue in electronic assemblies

    SciTech Connect

    Vianco, P.; Rejent, J.; Artaki, I.; Ray, U.; Finley, D.; Jackson, A.

    1996-03-01

    Enhanced performance goals and environmental restrictions have heightened the consideration for use of alternative solders as replacements for the traditional tin-lead (Sn-Pb) eutectic and near-eutectic alloys. However, the implementation of non-Pb bearing surface finishes may lag behind solder alloy development. A study was performed which examined the effect(s) of Pb contamination on the performance of Sn-Ag-Bi and Sn-Ag-Cu-Sb lead-free solders by the controlled addition of 63Sn-37Pb solder at levels of 0.5 {minus} 8.0 wt.%. Thermal analysis and ring-in-plug shear strength studies were conducted on bulk solder properties. Circuit board prototype studies centered on the performance of 20I/O SOIC gull wing joints. Both alloys exhibited declines in their melting temperatures with greater Sn-Pb additions. The ring-in-plug shear strength of the Sn-Ag-Cu-Sb solder increased slightly with Sn-Pb levels while the Sn-Ag-Bi alloy experienced a strength loss. The mechanical behavior of the SOIC (Small Outline Integrated Circuit) Sn-Ag-Bi solder joints reproduced the strength levels were insensitive to 10,106 thermal cycles. The Sn-Ag-Cu-Sb solder showed a slight decrease in the gull wing joint strengths that was sensitive to the Pb content of the surface finish.

  10. Intermetallic Layers in Soldered Joints

    1998-12-10

    ILAG solves the one-dimensional partial differential equations describing the multiphase, multicomponent, solid-state diffusion-controlled growth of intermetallic layers in soldered joints. This software provides an analysis capability for materials researchers to examine intermetallic growth mechanisms in a wide variety of defense and commercial applications involving both traditional and advanced materials. ILAG calculates the interface positions of the layers, as well as the spatial distribution of constituent mass fractions, and outputs the results at user-prescribed simulation times.

  11. Solderability of surface mount devices

    NASA Astrophysics Data System (ADS)

    Holder, Nanette S.

    1993-06-01

    As electronic products become much smaller, a limiting factor in the reduction of product size has been the size of the electronic components which make up the product. The leads of the current electronic components are inserted onto a printed circuit board through holes. Due to the use of wire leads, it becomes more difficult to decrease the size of the components. A new method was created to mount components directly to the surface of the printed circuit board. This new technique is surface mount technology. A concern over the use of this is experienced by the military. Since the leads are not inserted through the board and crimped before soldering as conventional components are mounted, there is some regard as to whether the components can be mounted securely to the board. Due to the high forces that many munitions experience when dispensed, it is imperative that the electronic components be soldered to the circuits boards so they will not slip out of place or fall from the board. The military also requires many munitions to lie dormant in storage warehouses for up to 20 years. When the munition is needed, it must perform reliably. Little work has been done to study the effects of this long-term storage on these surface mount devices, particularly on the ability of different soldering techniques used to attach surface mount components to printed circuit boards to withstand damaging effects of long-term storage.

  12. Analysis of electrolyte level change in a lithium air battery

    NASA Astrophysics Data System (ADS)

    Huang, Jing; Faghri, Amir

    2016-03-01

    A two-dimensional physical model that employs the deformed mesh method to track the electrolyte level in a Li-air coin cell battery is presented and used to investigate the effects of electrolyte level drop during cell discharge. The electrolyte level drop is caused by solid phase volume decrease and electrolyte solvent evaporation. Simulation results show that by neglecting the drop in electrolyte level, a Li-air battery model would under-estimate cell discharge capacity by as much as 22.5% in the parameter range studied. This counter-intuitive result is explained by an in-depth analysis of simulation results. A more realistic prediction of Li2O2 deposit distribution is obtained, with the peak value of Li2O2 volume fraction in the middle of the cathode instead of on the top surface, as predicted by previous studies. The interaction between the battery and its surroundings is considered by incorporating the air chamber into the computation domain. The diffusion of solvent vapor and oxygen in this chamber is included. For batteries using volatile solvents such as DMF, increasing the air chamber radius from 5 cm to 15 cm would result in a 72% increase of discharge capacity at the cost of losing a large amount of electrolyte.

  13. Effects of hydration on laser soldering

    NASA Astrophysics Data System (ADS)

    Chan, Eric K.; Brown, Dennis T.; Kovach, Ian S.; Welch, Ashley J.

    1997-05-01

    Laser welding with albumin-based tissue solder has been investigated as an alternative to surgical suturing. Many surgical procedures require the soldered tissues to be in a hydrated environment. We have studied the effects of hydration on laser soldered rat dermis and baboon articular cartilage in vitro. The solder is composed of human serum albumin, sodium hyaluronate and indocyanine green. We used a micro-pipette to deposit 2 (mu) l of solder on each tissue specimen. An 808 nm cw laser beam with irradiance of 27 W/cm2 was scanned 4 times over the same solder area at a constant speed of 0.84 mm/sec. After photo-coagulation, each tissue specimen was cut into two halves at the center of the solder, perpendicular to the direction of the scanning laser beam. One half was reserved as control while the other half was soaked in phosphate buffered saline for a designated hydration period. The hydration periods were 1 hr, 1, 2, and 7 days. All tissue specimens were fixed in glutaraldahyde, then prepared for scanning electron microcopy analysis. For most of the specimens, there was non-uniform coagulation across the thickness of the solder. Closer to the laser beam, the upper solder region formed a more dense coagulum. While the region closer to solder-tissue interface, the solder aggregated into small globules. This non-uniform coagulation was likely caused by non-uniform energy distribution during photocoagulation. The protein globules and coagulum seem to be responsible for the solder attachment from the specimen surface. However, we have noted that the solder detached from the cartilage substrate as early as after 1 hr of hydration. On the other hand, the solder attached to the dermis much better than to cartilage. This may be explained by the difference in surface roughness of the two tissue types. The dermal layer of the skin is composed of collagen matrix which may provide a better entrapment of the solder than the smooth surface of articular cartilage.

  14. Solder joint reliability of indium-alloy interconnection

    NASA Astrophysics Data System (ADS)

    Shimizu, Kozo; Nakanishi, Teru; Karasawa, Kazuaki; Hashimoto, Kaoru; Niwa, Koichi

    1995-01-01

    Recent high-density very large scale integrated (VLSI) interconnections in multichip modules require high-reliability solder interconnection to enable us to achieve small interconnect size andlarge number of input/output terminals, and to minimize soft errors in VLSIs induced by α-particle emission from solder. Lead-free solders such as indium (In)-alloy solders are a possible alternative to conventional lead-tin (Pb-Sn) solders. To realize reliable interconnections using In-alloy solders, fatigue behavior, finite element method (FEM) simulations, and dissolution and reaction between solder and metallization were studied with flip-chip interconnection models. We measured the fatigue life of solder joints and the mechanical properties of solders, and compared the results with a computer simulation based on the FEM. Indium-alloy solders have better mechanical properties for solder joints, and their flip-chip interconnection models showed a longer fatigue life than that of Pb-Sn solder in thermal shock tests between liquid nitrogen and room temperatures. The fatigue characteristics obtained by experiment agree with that given by FEM analysis. Dissolution tests show that Pt film is resistant to dissolution into In solder, indicating that Pt is an adequate barrier layer material for In solder. This test also shows that Au dissolution into the In-Sn solder raises its melting point; however, Ag addition to In-Sn solder prevents melting point rise. Experimental results show that In-alloy solders are suitable for fabricating reliable interconnections.

  15. Higher fuel prices are associated with lower air pollution levels.

    PubMed

    Barnett, Adrian G; Knibbs, Luke D

    2014-05-01

    Air pollution is a persistent problem in urban areas, and traffic emissions are a major cause of poor air quality. Policies to curb pollution levels often involve raising the price of using private vehicles, for example, congestion charges. We were interested in whether higher fuel prices were associated with decreased air pollution levels. We examined an association between diesel and petrol prices and four traffic-related pollutants in Brisbane from 2010 to 2013. We used a regression model and examined pollution levels up to 16 days after the price change. Higher diesel prices were associated with statistically significant short-term reductions in carbon monoxide and nitrogen oxides. Changes in petrol prices had no impact on air pollution. Raising diesel taxes in Australia could be justified as a public health measure. As raising taxes is politically unpopular, an alternative political approach would be to remove schemes that put a downward pressure on fuel prices, such as industry subsidies and shopping vouchers that give fuel discounts. PMID:24552771

  16. Joining of melt-textured YBCO using Tm123 powder as a solder

    NASA Astrophysics Data System (ADS)

    Prikhna, T. A.; Gawalek, W.; Moshchil, V. E.; Sergienko, N. V.; Sverdun, V. B.; Surzhenko, A. B.; Wendt, M.; Litzkendorf, D.; Habisreuther, T.; Vlasenko, A. V.

    2003-04-01

    Model experiments on joining of melt-textured YBa 2Cu 3O 7- δ (MT-YBCO) using rings cut from bulk single domain give the strong proof that the critical current density through the soldered seam obtained using a Tm123 powder as a solder is at the same level as that through the MT-YBCO (34 kA/cm 2 at 77 K in the 0 T field) and that the proposed comparatively short soldering process allows us to obtain soldered bulk with the even higher jc (up to 2.5 T fields at 77 K) than that of the initial unbroken one. The seam structure (including the twinned one) slaved the structure of the jointed MT-YBCO.

  17. Nano-soldering to single atomic layer

    DOEpatents

    Girit, Caglar O.; Zettl, Alexander K.

    2011-10-11

    A simple technique to solder submicron sized, ohmic contacts to nanostructures has been disclosed. The technique has several advantages over standard electron beam lithography methods, which are complex, costly, and can contaminate samples. To demonstrate the soldering technique graphene, a single atomic layer of carbon, has been contacted, and low- and high-field electronic transport properties have been measured.

  18. Experiments and Demonstrations with Soldering Guns.

    ERIC Educational Resources Information Center

    Henry, Dennis C.; Danielson, Sarah A.

    1993-01-01

    Discusses the essential electrical characteristics of a particular model of soldering gun. Presents four classroom demonstrations that utilize the soldering gun to test the following geometrics of wire loops as electromagnets: (1) the original tip; (2) a single circular loop; (3) a Helmholtz coil; and (4) the solenoid. (MDH)

  19. BOREAS AFM-5 Level-1 Upper Air Network Data

    NASA Technical Reports Server (NTRS)

    Barr, Alan; Hrynkiw, Charmaine; Newcomer, Jeffrey A. (Editor); Hall, Forrest G. (Editor); Smith, David E. (Technical Monitor)

    2000-01-01

    The Boreal Ecosystem-Atmosphere Study (BOREAS) Airborne Fluxes and Meteorology (AFM)-5 team collected and processed data from the numerous radiosonde flights during the project. The goals of the AFM-05 team were to provide large-scale definition of the atmosphere by supplementing the existing Atmospheric Environment Service (AES) aerological network, both temporally and spatially. This data set includes basic upper-air parameters collected from the network of upper-air stations during the 1993, 1994, and 1996 field campaigns over the entire study region. The data are contained in tabular ASCII files. The level-1 upper-air network data are available from the Earth Observing System Data and Information System (EOSDIS) Oak Ridge National Laboratory (ORNL) Distributed Active Archive Center (DAAC). The data files also are available on a CD-ROM (see document number 20010000884).

  20. Predicting the Drop Performance of Solder Joints by Evaluating the Elastic Strain Energy from High-Speed Ball Pull Tests

    NASA Astrophysics Data System (ADS)

    You, Taehoon; Kim, Yunsung; Kim, Jina; Lee, Jaehong; Jung, Byungwook; Moon, Jungtak; Choe, Heeman

    2009-03-01

    Despite being expensive and time consuming, board-level drop testing has been widely used to assess the drop or impact resistance of the solder joints in handheld microelectronic devices, such as cellphones and personal digital assistants (PDAs). In this study, a new test method, which is much simpler and quicker, is proposed. The method involves evaluating the elastic strain energy and relating it to the impact resistance of the solder joint by considering the Young’s modulus of the bulk solder and the fracture stress of the solder joint during a ball pull test at high strain rates. The results show that solder joints can be ranked in order of descending elastic strain energy as follows: Sn-37Pb, Sn-1Ag-0.5Cu, Sn-3Ag-0.5Cu, and Sn-4Ag-0.5Cu. This order is consistent with the actual drop performances of the samples.

  1. Gestational Diabetes and Preeclampsia in Association with Air Pollution at Levels below Current Air Quality Guidelines

    PubMed Central

    Jakobsson, Kristina; Tinnerberg, Håkan; Rignell-Hydbom, Anna; Rylander, Lars

    2013-01-01

    Background: Several studies have estimated associations between air pollution and birth outcomes, but few have evaluated potential effects on pregnancy complications. Objective: We investigated whether low-level exposure to air pollution is associated with gestational diabetes and preeclampsia. Methods: High-quality registry information on 81,110 singleton pregnancy outcomes in southern Sweden during 1999–2005 was linked to individual-level exposure estimates with high spatial resolution. Modeled exposure to nitrogen oxides (NOx), expressed as mean concentrations per trimester, and proximity to roads of different traffic densities were used as proxy indicators of exposure to combustion-related air pollution. The data were analyzed by logistic regression, with and without adjusting for potential confounders. Results: The prevalence of gestational diabetes increased with each NOx quartile, with an adjusted odds ratio (OR) of 1.69 (95% CI: 1.41, 2.03) for the highest (> 22.7 µg/m3) compared with the lowest quartile (2.5–8.9 µg/m3) of exposure during the second trimester. The adjusted OR for acquiring preeclampsia after exposure during the third trimester was 1.51 (1.32, 1.73) in the highest quartile of NOx compared with the lowest. Both outcomes were associated with high traffic density, but ORs were significant for gestational diabetes only. Conclusion: NOx exposure during pregnancy was associated with gestational diabetes and preeclampsia in an area with air pollution levels below current air quality guidelines. PMID:23563048

  2. An Accelerated Method for Soldering Testing

    SciTech Connect

    Han, Qingyou; Xu, Hanbing; Ried, Paul; Olson, Paul

    2007-01-01

    An accelerated method for testing die soldering has been developed. High intensity ultrasonic vibrations have been applied to simulate the die casting conditions such as high pressure and high molten metal velocity on the pin. The soldering tendency of steels and coated pins has been examined. The results suggest that in the low carbon steel/Al system, the onset of soldering is 60 times faster with ultrasonic vibration than that without ultrasonic vibration. In the H13/A380 system, the onset of soldering reaction is accelerated to between 30-60 times. Coatings significantly reduce the soldering tendency. For purposes of this study, several commercial coatings from Balzers demonstrated the potential for increasing the service life of core pins between 15 and 180 times.

  3. Solderability enhancement of copper through chemical etching

    SciTech Connect

    Stevenson, J.O.; Guilinger, T.R.; Hosking, F.M.; Yost, F.G.; Sorensen, N.R.

    1995-05-01

    Sandia National Laboratories has established a Cooperative Research and Development Agreement with consortium members of the National Center for Manufacturing Sciences (NCMS) to develop fundamental generic technology in the area of printed wiring board materials and surface finishes. Improved solderability of copper substrates is an important component of the Sandia-NCMS program. The authors are investigating the effects of surface roughness on the wettability and solderability behavior of several different types of copper board finishes. In this paper, the authors present roughness and solderability characterizations for a variety of chemically-etched copper substrates. Initial testing on six chemical etches demonstrate that surface roughness can be greatly enhanced through chemical etching. Noticeable improvements in solder wettability were observed to accompany increases in roughness. A number of different algorithms and measures of roughness were used to gain insight into surface morphologies that lead to improved solderability.

  4. Properties of Cerium Containing Lead Free Solder

    NASA Astrophysics Data System (ADS)

    Xie, Huxiao

    With increasing concerns of the intrinsic toxicity of lead (Pb) in electronics, a series of tin (Sn) based alloys involving silver (Ag) and copper (Cu) have been proposed as replacements for Pb-Sn solder and widely accepted by industry. However, they have a higher melting point and often exhibit poorer damage tolerance than Pb-Sn alloys. Recently, a new class of alloys with trace amount of rare-earth (RE) elements has been discovered and investigated. In previous work from Prof. Chawla's group, it has been shown that cerium (Ce)-based Pb-free solder are less prone to oxidation and Sn whiskering, and exhibit desirable attributes of microstructural refinement and enhanced ductility relative to lanthanum (La)-based Sn-3.9Ag-0.7Cu (SAC) alloy. Although the formation of RESn3 was believed to be directly responsible for the enhanced ductility in RE-containing SAC solder by allowing microscopic voids to nucleate throughout the solder volume, this cavitation-based mechanism needs to be validated experimentally and numerically. Additionally, since the previous study has exhibited the realistic feasibility of Ce-based SAC lead-free solder alloy as a replacement to conventional SAC alloys, in this study, the proposed objective focuses on the in in-depth understanding of mechanism of enhanced ductility in Ce-based SAC alloy and possible issues associated with integration of this new class of solder into electronic industry, including: (a) study of long-term thermal and mechanical stability on industrial metallization, (b) examine the role of solder volume and wetting behavior of the new solder, relative to Sn-3.9Ag-0.7Cu alloys, (c) conduct experiments of new solder alloys in the form of mechanical shock and electromigration. The research of this new class alloys will be conducted in industrially relevant conditions, and the results would serve as the first step toward integration of these new, next generation solders into the industry.

  5. Thermophysical Characteristics of the Protective Coating of the Soldering Rod

    NASA Astrophysics Data System (ADS)

    Shtennikov, V. N.

    2015-01-01

    An analytical dependence of the change in the soldering temperature on the material, thickness of the soldering rod protective coating, and the time of soldering is obtained. The relation derived allows one to ensure the needed temperature of contact soldering of electronic and electrical-engineering components and, consequently, their high quality.

  6. Mechanical properties of Pb-free solder alloys on thick film hybrid microcircuits

    SciTech Connect

    Hernandez, C.L.; Vianco, P.T.; Rejent, J.A.; Hosking, F.M.

    1998-03-10

    The technology drivers of the electronics industry continue to be systems miniaturization and reliability, in addition to addressing a variety of important environmental issues. Although the Sn-Pb eutectic alloy is widely used as a joining material in the electronics industry, it has drawn environmental concern due to its Pb content. The solder acts both as an electrical and mechanical connection within the different packaging levels in an electronic device. New Pb-free solders are being developed at Sandia National Laboratories. The alloys are based on the Sn-Ag alloy, having Bi and Au additions. Prototype hybrid microcircuit (HMC) test vehicles have been assembled to evaluate Pb-free solders for Au-Pt-Pd thick film soldering. The test components consist of a variety of dummy chip capacitors and leadless ceramic chip carriers (LCCC`s). The mechanical properties of the joints were evaluated. The reflow profiles and the solid state intermetallic formation reaction will also be presented. Improved solder joint manufacturability and increased fatigue resistance solder alloys are the goals of these materials.

  7. Wetting studies of lead-free solders on lead-free PWB finishes

    NASA Astrophysics Data System (ADS)

    Sattiraju, Seshagirirao Venkata

    There is a universal focus for producing environmentally friendly products in many different areas of science and engineering. Pb in electronic solder has become the target recently. The shift towards Pb-free manufacturing is a complicated issue. For a successful transition to Pb-free manufacturing in electronics assembly, it is critical to understand the behavior of Pb-free solders (in bulk and paste form) and their interaction with the Pb-free printed wiring board (PWB) finishes before their implementation in high volume electronics manufacturing can be realized. In this research work, studies were performed to characterize the wetting process of some Pb-free solders and Pb-free PWB finishes. Results obtained from solder paste spread tests and wetting balance experiments with several Pb-free solder alloys and Pb-free PWB finishes are presented and conclusions are drawn on the solderability of the alloys and finishes. The solder alloys studied were Sn3.4Ag4.8Bi, Sn4.0Ag0.5 Cu, Sn3.5Ag and Sn0.7Cu. Eutectic Sn37Pb was used as a reference. The PWB surface finishes were immersion Sn, electroless Ni/immersion Au, immersion Ag and organic solderability preservative (OSP). Effects of multiple reflow cycles on solderability of the test coupons were also studied. Statistical analyses were performed on the data obtained from the wetting balance and spread tests. Wetting balance experiments were conducted in air while the spread tests were performed in air and nitrogen to understand the effect of reflow atmosphere on the spreading. Surface analyses techniques such as Auger Electron Spectroscopy (AES) and X-ray Photoelectron Spectroscopy (XPS) were applied to understand and analyze the surfaces. Conclusions were drawn based on the data obtained from the wetting balance and spread experiments and results from the surface and thermodynamic analyses were applied to augment the experimental results. Sequential Electrochemical Reduction Analysis (SERA) was also performed on the

  8. Level-1C Product from AIRS: Principal Component Filtering

    NASA Technical Reports Server (NTRS)

    Manning, Evan M.; Jiang, Yibo; Aumann, Hartmut H.; Elliott, Denis A.; Hannon, Scott

    2012-01-01

    The Atmospheric Infrared Sounder (AIRS), launched on the EOS Aqua spacecraft on May 4, 2002, is a grating spectrometer with 2378 channels in the range 3.7 to 15.4 microns. In a grating spectrometer each individual radiance measurement is largely independent of all others. Most measurements are extremely accurate and have very low noise levels. However, some channels exhibit high noise levels or other anomalous behavior, complicating applications needing radiances throughout a band, such as cross-calibration with other instruments and regression retrieval algorithms. The AIRS Level-1C product is similar to Level-1B but with instrument artifacts removed. This paper focuses on the "cleaning" portion of Level-1C, which identifies bad radiance values within spectra and produces substitute radiances using redundant information from other channels. The substitution is done in two passes, first with a simple combination of values from neighboring channels, then with principal components. After results of the substitution are shown, differences between principal component reconstructed values and observed radiances are used to investigate detailed noise characteristics and spatial misalignment in other channels.

  9. Solder flow on narrow copper strips

    SciTech Connect

    Hosking, F.M.; Yost, F.G.; Holm, E.A.; Michael, J.R.

    1996-07-01

    Various solderability tests have been developed over the years to quantify the wetting behavior of solder on metallic surfaces. None offer an exact measure of capillary flow normally associated with conventional plated-through-hole and surface mount soldering. With shrinking package designs, increasing reliability requirements, and the emergence of new soldering technologies, there is a growing need to better understand and predict the flow of solder on printed wiring board (PWB) surfaces. Sandia National Laboratories has developed a capillary flow solderability test, through a joint effort with the National Center for Manufacturing Sciences, that considers this fundamental wetting issue for surface mount technology. The test geometry consists of a metal strip (width, {delta}) connected to a circular metal pad (radius, r{sub c}). Solder flow from the pad onto the strip depends on the geometric relationship between {delta} and r{sub c}. Test methodology, experimental results, and validation of a flow model are presented in this paper. 17 refs., 11 figs., 4 tabs.

  10. An air quality balance index estimating the total amount of air pollutants at ground level.

    PubMed

    Trivero, Paolo; Biamino, Walter; Borasi, Maria; Cavagnero, Marco; Musa, Maya; Rinaudo, Caterina; Sesia, Veronica

    2012-07-01

    A new index named Air Quality Balance Index (AQBI), which is able to characterise the amount of pollution level in a selected area, is proposed. This index is a function of the ratios between pollutant concentration values and their standards; it aims at identifying all situations in which there is a possible environmental risk even when several pollutants are below their limit values but air quality is reduced. AQBI is evaluated by using a high-resolution three-dimensional dispersion model: the air concentration for each substance is computed starting from detailed emissions sources: point, line and area emissions hourly modulated. This model is driven with accurate meteorological data from ground stations and remote sensing systems providing vertical profiles of temperature and wind; these data are integrated with wind and temperature profiles at higher altitudes obtained by a Local Area Model. The outputs of the dispersion model are compared with pollutant concentrations provided by measuring stations, in order to recalibrate emission data. A three-dimensional high resolution grid of AQBI data is evaluated for an industrial area close to Alessandria (Northern Italy), assessing air quality and environmental conditions. Performance of AQBI is compared with the Air Quality Index (AQI) developed by the U.S. Environmental Protection Agency. AQBI, computed taking into account all pollutants, is able to point out situations not evidenced by AQI, based on a preset limited number of substances; therefore, AQBI is a good tool for evaluating the air quality either in urban and in industrial areas. The AQBI values at ground level, in selected points, are in agreement with in situ observations. PMID:21830066

  11. Determinants of elite-level air rifle shooting performance.

    PubMed

    Ihalainen, S; Kuitunen, S; Mononen, K; Linnamo, V

    2016-03-01

    This study focused on identifying the most important factors determining performance in elite-level air rifle shooting technique. Forty international- and national-level shooters completed a simulated air rifle shooting competition series. From a total of 13 795 shots in 319 tests, shooting score and 17 aiming point trajectory variables were measured with an optoelectronic device and six postural balance variables were measured with force platform. Principal component analysis revealed six components in the air rifle shooting technique: aiming time, stability of hold, measurement time, cleanness of triggering, aiming accuracy, and timing of triggering. Multiple regression analysis identified four of those, namely stability of hold, cleanness of triggering, aiming accuracy, and timing of triggering as the most important predictors of shooting performance, accounting for 81% of the variance in shooting score. The direct effect of postural balance on performance was small, accounting for less than 1% of the variance in shooting score. Indirectly, the effect can be greater through a more stable holding ability, to which postural balance was correlated significantly (R = 0.55, P < 0.001). The results of the present study can be used in assessing athletes' technical strengths and weaknesses and in directing training programs on distinct shooting technical components. PMID:25850700

  12. Degradation of phosphorene in air: understanding at atomic level

    NASA Astrophysics Data System (ADS)

    Wang, Gaoxue; Slough, William J.; Pandey, Ravindra; Karna, Shashi P.

    2016-06-01

    Phosphorene is a promising two-dimensional (2D) material with a direct band gap, high carrier mobility, and anisotropic electronic properties. Phosphorene-based electronic devices, however, are found to degrade upon exposure to air. In this paper, we provide an atomic level understanding of the stability of phosphorene in terms of its interaction with O2 and H2O. The results based on density functional theory together with first principles molecular dynamics calculations show that O2 could the spontaneously dissociate on phosphorene at room temperature. H2O will not strongly interact with pristine phosphorene, however, an exothermic reaction could occur if phosphorene is first oxidized. The pathway of oxidation first, followed by exothermic reaction with water is the most likely route for the chemical degradation of phosphorene-based devices in air.

  13. Laser Assisted Soldering: Effects of Hydration on Solder-Tissue Adhesion

    SciTech Connect

    Chan, E.K.; Welch, A.J.; Brown, D.T.; Kovach, I.S.

    1998-10-01

    Wound stabilization is critical in early wound healing. Other than superficial skin wounds, most tissue repair is exposed to a hydrated environment postoperatively. To simulate the stability of laser-soldered tissue in a wet environment, we studied the effects of hydration on laser soldered rat dermis and baboon articular cartilage. In this {ital in vitro} study, we used a solder composed of human serum albumin, sodium hyaluronate, and Indocyanine Green. A 2 {mu}L solder droplet was deposited on each tissue specimen and then the solder was irradiated with a scanning laser beam (808 nm and 27thinspW/cm{sup 2}). After photocoagulation, each tissue specimen was cut into two halves dividing the solder. One half was reserved as control while the other half was soaked in saline for a designated period before fixation (1 h, 1, 2, and 7 days). All tissue specimens were prepared for scanning electron microscopy (SEM). SEM examinations revealed nonuniform coagulation across the solder thickness for most of the specimens, likely a result of the temperature gradient generated by laser heating. Closer to the laser beam, the uppermost region of the solder formed a dense coagulum. The solder aggregated into small globules in the region anterior to the solder-tissue interface. All cartilage specimens soaked in saline suffered coagulum detachment from tissue surface. We noted a high concentration of the protein globules in the detached coagulum. These globules were likely responsible for solder detachment from the cartilage surface. Solder adhered better to the dermis than to cartilage. The dermal layer of the skin, composed of collagen matrix, provided a better entrapment of the solder than the smooth surface of articular cartilage. Insufficient laser heating of solder formed protein globules. Unstable solder-tissue fusion was likely a result of these globules being detached from tissue substrate when the specimen was submerged in a hydrated environment. The solder-tissue bonding

  14. Air quality in Moscow megacity: basic level and extreme cases

    NASA Astrophysics Data System (ADS)

    Pankratova, N.; Skorokhod, A.; Moiseenko, K.

    2012-04-01

    Moscow is one of the largest megacities in the world. Total annual emissions of polluting substances into the atmosphere in Moscow is likely to be about 2,0 mln. t. More than 90% of pollutants are emitted by traffic. Problem of air quality assessment is very urgent for Moscow both to alarm population and to compare with other world megacities. To study contemporary structure of atmospheric pollution over Moscow megacity data on air composition (including CO, NO, NO2, O3, CH4, CO2, SO2, NMHC, aerosol) obtained since 2002 has been analyzed. The monitoring site is located at Moscow State University meteorological observatory on South-West of Moscow. All observations are provided by A.M. Obukhov Institute of Atmospheric Physics RAS. Due to these continuous measurements typical (basic) level of pollution as well as extreme cases have been studied. The relationship between O3, NOx and VOCs were analyzed as well. Due to weather conditions (cyclonic regime is dominated) concentrations of pollutants usually do not reach dangerous levels but sometimes they are high. The case of abnormal hot and dry weather in the summer of 2010 was investigated. Many Russians were suffering from the record-breaking heat and the worst drought in 40 years. The heat was caused by very intensive and stable blocking anticyclone that established in Moscow since June, 18 till August, 18. Anticyclone of such strength has been never observed before. During 33 days in succession surface air temperature exceeded 30°C. During these 2 months troposphere over ETR was almost closed for western winds. Hot weather led to numerous forest and peat fires (about 29,000 cases) with total covered area about 12,000 km2. One of aftermaths was significant change of atmospheric composition. Many cities and settlements were covered by dense haze from fires. Evident presence of high amount of aerosol in the ambient air caused anxiety and application of safeguards. Meanwhile, less obvious increase of concentrations of

  15. Laser soldering of Sn plated brass integrator assembly housings

    SciTech Connect

    Keicher, D.M.; Poulter, G.A.; Sorensen, N.R.

    1993-09-01

    The high conductivity provided by solder closure joints of component housings is sometimes required to ensure electrical shielding of the components contained within. However, using a soldering iron to produce the solder joints can lead to charring of the insulating materials within the housing. To overcome this problem, the localized heating characteristics of laser soldering can be exploited. Feasibility of laser soldering Sn plated brass housings with a CW Nd:YAG laser has been investigated. It has been determined that laser soldering of these housings using a low solids solder flux is a viable technique and will minimize the amount of heat input to the enclosed electronic components. Metallographic analysis has shown good wetting of the solder on the housing components. Accelerated aging experiments indicate that no significant corrosion potential due to solder flux residues exists. Although a low solids flux was used to make the joints, initial results indicate that a fluxless technique can be developed to eliminate fluxes completely.

  16. Laser soldering of Sn plated brass integrator assembly housings

    NASA Astrophysics Data System (ADS)

    Keicher, D. M.; Poulter, G. A.; Sorensen, N. R.

    1993-09-01

    The high conductivity provided by solder closure joints of component housings is sometimes required to ensure electrical shielding of the components contained within. However, using a soldering iron to produce the solder joints can lead to charring of the insulating materials within the housing. To overcome this problem, the localized heating characteristics of laser soldering can be exploited. The feasibility of laser soldering Sn plated brass housings with a CW Nd:YAG laser has been investigated. It has been determined that laser soldering of these housings using a low solids solder flux is a viable technique and will minimize the amount of heat input to the enclosed electronic components. Metallographic analysis has shown good wetting of the solder on the housing components. Accelerated aging experiments indicate that no significant corrosion potential due to solder flux residues exists. Although a low solids flux was used to make the joints, initial results indicate that a fluxless technique can be developed to eliminate fluxes completely.

  17. Alining Solder Pads on a Solar Cell

    NASA Technical Reports Server (NTRS)

    Lazzery, A. G.

    1984-01-01

    Mechanism consisting of stylus and hand-operated lever incorporated into screening machine to precisely register front and back solder pads during solar-cell assembly. Technique may interest those assembling solar cells manually for research or prototype work.

  18. High temperature solder device for flat cables

    NASA Technical Reports Server (NTRS)

    Haehner, Carl L. (Inventor)

    1992-01-01

    A high temperature solder device for flat cables includes a microwelder, an anvil which acts as a heat sink and supports a flexible flat ribbon cable that is to be connected to a multiple pin connector. The microwelder is made from a modified commercially available resistance welding machine such as the Split Tip Electrode microwelder by Weltek, which consists of two separate electrode halves with a removable dielectric spacer in between. The microwelder is not used to weld the items together, but to provide a controlled compressive force on, and energy pulse to, a solder preform placed between a pin of the connector and a conductor of the flexible flat ribbon cable. When the microwelder is operated, an electric pulse will flow down one electrode, through the solder preform and back up the other electrode. This pulse of electrical energy will cause the solder preform to heat up and melt, joining the pin and conductor.

  19. Induction soldering of photovoltaic system components

    DOEpatents

    Kumaria, Shashwat; de Leon, Briccio

    2015-11-17

    A method comprises positioning a pair of photovoltaic wafers in a side-by-side arrangement. An interconnect is placed on the pair of wafers such that the interconnect overlaps both wafers of the pair, solder material being provided between the interconnect and the respective wafers. A solder head is then located adjacent the interconnect, and the coil is energized to effect inductive heating of the solder material. The solder head comprises an induction coil shaped to define an eye, and a magnetic field concentrator located at least partially in the eye of the coil. The magnetic field concentrator defines a passage extending axially through the eye of the coil, and may be of a material with a high magnetic permeability.

  20. Integrated environmentally compatible soldering technologies. Final report

    SciTech Connect

    Hosking, F.M.; Frear, D.R.; Iman, R.L.; Keicher, D.M.; Lopez, E.P.; Peebles, H.C.; Sorensen, N.R.; Vianco, P.T.

    1994-05-01

    Chemical fluxes are typically used during conventional electronic soldering to enhance solder wettability. Most fluxes contain very reactive, hazardous constituents that require special storage and handling. Corrosive flux residues that remain on soldered parts can severely degrade product reliability. The residues are removed with chlorofluorocarbon (CFC), hydrochlorofluorocarbon (HCFC), or other hazardous solvents that contribute to ozone depletion, release volatile organic compounds into the atmosphere, or add to the solvent waste stream. Alternative materials and processes that offer the potential for the reduction or elimination of cleaning are being developed to address these environmental issues. Timing of the effort is critical, since the targeted chemicals will soon be heavily taxed or banned. DOE`s Office of Environmental Restoration and Waste Management (DOE/EM) has supported Sandia National Laboratories` Environmentally Conscious Manufacturing Integrated Demonstration (ECMID). Part of the ECM program involves the integration of several environmentally compatible soldering technologies for assembling electronics devices. Fluxless or {open_quotes}low-residue/no clean{close_quotes} soldering technologies (conventional and ablative laser processing, controlled atmospheres, ultrasonic tinning, protective coatings, and environmentally compatible fluxes) have been demonstrated at Sandia (SNL/NM), the University of California at Berkeley, and Allied Signal Aerospace-Kansas City Division (AS-KCD). The university demonstrations were directed under the guidance of Sandia staff. Results of the FY93 Soldering ID are presented in this report.

  1. SNL initiatives in electronic fluxless soldering

    SciTech Connect

    Hosking, F.M.; Frear, D.R.; Vianco, P.T.; Keicher, D.M.

    1991-01-01

    Conventional soldering of electronic components generally requires the application of a chemical flux to promote solder wetting and flow. Chlorofluorocarbons (CFC) and halogenated solvents are normally used to remove the resulting flux residues. While such practice has been routinely accepted throughout the electronics industry, the environmental impact of hazardous solvents on ozone depletion will eventually limit or prevent their use. Solvent substitution or alternative technologies must be developed to meet these goals. Sandia National Laboratories, Albuquerque has a comprehensive environmentally conscious electronics manufacturing program underway that is funded by the DOE Office of Technology Development. Primary elements of the integrated task are the characterization and development of alternative fluxless soldering technologies that would eliminate circuit board cleaning associated with flux residue removal. Storage and handling of hazardous solvents and mixed solvent-flux waste would be consequently reduced during electronics soldering. This paper will report on the progress of the SNL fluxless soldering initiative. Emphasis is placed on the use of controlled atmospheres, laser heating, and ultrasonic soldering.

  2. Whisker Formation on SAC305 Soldered Assemblies

    NASA Astrophysics Data System (ADS)

    Meschter, S.; Snugovsky, P.; Bagheri, Z.; Kosiba, E.; Romansky, M.; Kennedy, J.; Snugovsky, L.; Perovic, D.

    2014-11-01

    This article describes the results of a whisker formation study on SAC305 assemblies, evaluating the effects of lead-frame materials and cleanliness in different environments: low-stress simulated power cycling (50-85°C thermal cycling), thermal shock (-55°C to 85°C), and high temperature/high humidity (85°C/85% RH). Cleaned and contaminated small outline transistors, large leaded quad flat packs (QFP), plastic leaded chip carrier packages, and solder balls with and without rare earth elements (REE) were soldered to custom designed test boards with Sn3Ag0.5Cu (SAC305) solder. After assembly, all the boards were cleaned, and half of them were recontaminated (1.56 µg/cm2 Cl-). Whisker length, diameter, and density were measured. Detailed metallurgical analysis on components before assembly and on solder joints before and after testing was performed. It was found that whiskers grow from solder joint fillets, where the thickness is less than 25 µm, unless REE was present. The influence of lead-frame and solder ball material, microstructure, cleanliness, and environment on whisker characteristics is discussed. This article provides detailed metallurgical observations and select whisker length data obtained during this multiyear testing program.

  3. PWB solder wettability after simulated storage

    SciTech Connect

    Hernandez, C.L.; Hosking, F.M.

    1996-03-01

    A new solderability test method has been developed at Sandia National Laboratories that simulates the capillary flow physics of solders on circuit board surfaces. The solderability test geometry was incorporated on a circuit board prototype that was developed for a National Center for Manufacturing Sciences (NCMS) program. The work was conducted under a cooperative research and development agreement between Sandia National Laboratories, NCMS, and several PWB fabricators (AT&T, IBM, Texas Instruments, United Technologies/Hamilton Standard and Hughes Aircraft) to advance PWB interconnect technology. The test was used to investigate the effects of environmental prestressing on the solderability of printed wiring board (PWB) copper finishes. Aging was performed in a controlled chamber representing a typical indoor industrial environment. Solderability testing on as-fabricated and exposed copper samples was performed with the Sn-Pb eutectic solder at four different reflow temperatures (215, 230, 245 and 260{degrees}C). Rosin mildly activated (RMA), low solids (LS), and citric acid-based (CA) fluxes were included in the evaluation. Under baseline conditions, capillary flow was minimal at the lowest temperatures with all fluxes. Wetting increased with temperature at both baseline and prestressing conditions. Poor wetting, however, was observed at all temperatures with the LS flux. Capillary flow is effectively restored with the CA flux.

  4. Microstructural influences on the mechanical properties of solder

    SciTech Connect

    Morris, J.W. Jr.; Goldstein, J.L.F.; Mei, Z.

    1993-04-01

    Intent of this book is to review analytic methods for predicting behavior of solder joints, based on continuum mechanics. The solder is treated as a continuous, homogeneous body, or composite of such bodies, whose mechanical behavior is uniform and governed by simple constitutive equations. The microstructure of a solder joint influences its mechanical properties in 3 ways: it governs deformation and failure; common solders deform inhomogeneously; and common solders are microstructurally unstable. The variety of microstructures often found in solder joints are briefly reviewed, and some of the ways are discussed in which the microstructure influences the common types of high-temperature mechanical behavior. 25 figs, 40 refs.

  5. Entrainment of Upper Level Dry Air into Hurricane Earl

    NASA Technical Reports Server (NTRS)

    Guillory, Anthony R.; Jedlovee, Gary J.; Hood, Robbie E.; Atkinson, Robert J.; LaFontaine, Frank J.

    2000-01-01

    Hurricane Earl developed from a tropical wave that moved into the Gulf of Mexico, which triggered abundant convection. On 1 Sept. 1998, the wave was upgraded directly to a tropical storm. Earl reached hurricane status the next morning. The system moved erratically as it interacted with an upper level short wave trough rotating around a long wave trough to the northeast. The storm made landfall near 0600 UTC on 3 September near Panama City, FL. During August and September 1998, NASA conducted the Third Convection and Moisture Experiment (CAMEX-3). It focused on studying the intensity, track, and impacts at landfall of hurricanes. On the afternoon of 2 September 1998, the NASA ER2 high-altitude aircraft flying at 65,000 feet in tandem with the NASA DC-8 flying at 35,000 feet flew over and through, respectively, the eastern rainbands of Earl near the Florida Panhandle as the storm neared landfall in the region. Two approaches to studying Earl are undertaken here: first, an examination of the source and height of the dry air region using GOES-8 water vapor data and, second, a look into the impact of the dry air entrainment on the system using aircraft remote sensing data.

  6. Prototyping lead-free solders on hand-soldered, through-hole circuit boards

    SciTech Connect

    Vianco, P.T.; Mizik, P.M.

    1993-12-31

    The lead-free solders 96.5Sn-3.5Ag (wt %), 95.5Sn-4.0Cu-0.5Ag, 91. 84Sn-3.33Ag-4.83Bi were used in the assembly of a through-hole circuit board to determine the feasibility of their suitability in hand soldering processes. Prototypes assembled with 63Sn-37Pb solder were manufactured to serve as control units. Implementation of the lead-free alloys were performed with a rosin-based, mildly activated (RMA) flux and a 700{degree}F soldering tip. A procedure was developed to remove the tin-lead finish from the leaded components and replace it with a 100Sn hot dipped coating. Assembly feasibility was demonstrated for all three lead-free solders. Defect counts were greater than observed with the tin-lead control alloy; however, the number of defects diminished with experience gained by the operator. Visual examination of the solder joints indicated satisfactory wetting of both the device leads and circuit board land with no apparent damage to the underlying laminate nor to the device packages. Cross sections of the lead-free solder joints showed that the were more susceptible to void formation within the holes than was the case with the tin-lead solder. Some cracking was observed at the interface between the Sn-Ag-Bi solder and the copper lands; the relatively high strength of this solder and fast cooling rate of the hand assembly process was believed responsible for this defect.

  7. The Influence of Declining Air Lead Levels on Blood Lead-Air Lead Slope Factors in Children

    EPA Science Inventory

    This presentation describes calculation of blood lead-air lead slope factor within an analysis of the relationship between blood lead levels and air lead levels among participants in the National Health and Nutrition Examination Survey (NHANES). The slope factors are compared wi...

  8. Computer simulation of solder joint failure

    SciTech Connect

    Burchett, S.N.; Frear, D.R.; Rashid, M.M.

    1997-04-01

    The thermomechanical fatigue failure of solder joints is increasingly becoming an important reliability issue for electronic packages. The purpose of this Laboratory Directed Research and Development (LDRD) project was to develop computational tools for simulating the behavior of solder joints under strain and temperature cycling, taking into account the microstructural heterogeneities that exist in as-solidified near eutectic Sn-Pb joints, as well as subsequent microstructural evolution. The authors present two computational constitutive models, a two-phase model and a single-phase model, that were developed to predict the behavior of near eutectic Sn-Pb solder joints under fatigue conditions. Unique metallurgical tests provide the fundamental input for the constitutive relations. The two-phase model mathematically predicts the heterogeneous coarsening behavior of near eutectic Sn-Pb solder. The finite element simulations with this model agree qualitatively with experimental thermomechanical fatigue tests. The simulations show that the presence of an initial heterogeneity in the solder microstructure could significantly degrade the fatigue lifetime. The single-phase model was developed to predict solder joint behavior using materials data for constitutive relation constants that could be determined through straightforward metallurgical experiments. Special thermomechanical fatigue tests were developed to give fundamental materials input to the models, and an in situ SEM thermomechanical fatigue test system was developed to characterize microstructural evolution and the mechanical behavior of solder joints during the test. A shear/torsion test sample was developed to impose strain in two different orientations. Materials constants were derived from these tests. The simulation results from the two-phase model showed good fit to the experimental test results.

  9. 42 CFR 84.140 - Air velocity and noise levels; hoods and helmets; minimum requirements.

    Code of Federal Regulations, 2011 CFR

    2011-10-01

    ... 42 Public Health 1 2011-10-01 2011-10-01 false Air velocity and noise levels; hoods and helmets... PROTECTIVE DEVICES Supplied-Air Respirators § 84.140 Air velocity and noise levels; hoods and helmets; minimum requirements. Noise levels generated by the respirator will be measured inside the hood or...

  10. 42 CFR 84.140 - Air velocity and noise levels; hoods and helmets; minimum requirements.

    Code of Federal Regulations, 2013 CFR

    2013-10-01

    ... 42 Public Health 1 2013-10-01 2013-10-01 false Air velocity and noise levels; hoods and helmets... PROTECTIVE DEVICES Supplied-Air Respirators § 84.140 Air velocity and noise levels; hoods and helmets; minimum requirements. Noise levels generated by the respirator will be measured inside the hood or...

  11. 42 CFR 84.140 - Air velocity and noise levels; hoods and helmets; minimum requirements.

    Code of Federal Regulations, 2014 CFR

    2014-10-01

    ... 42 Public Health 1 2014-10-01 2014-10-01 false Air velocity and noise levels; hoods and helmets... PROTECTIVE DEVICES Supplied-Air Respirators § 84.140 Air velocity and noise levels; hoods and helmets; minimum requirements. Noise levels generated by the respirator will be measured inside the hood or...

  12. 42 CFR 84.140 - Air velocity and noise levels; hoods and helmets; minimum requirements.

    Code of Federal Regulations, 2012 CFR

    2012-10-01

    ... 42 Public Health 1 2012-10-01 2012-10-01 false Air velocity and noise levels; hoods and helmets... PROTECTIVE DEVICES Supplied-Air Respirators § 84.140 Air velocity and noise levels; hoods and helmets; minimum requirements. Noise levels generated by the respirator will be measured inside the hood or...

  13. The advantages and disadvantages of centralized control of air power at operational level

    NASA Astrophysics Data System (ADS)

    Arisoy, Uǧur

    2014-05-01

    People do not want to see and hear a war. In today's world, if war is inevitable, the use of air power is seen as the preferable means of conducting operations instead of financially burdensome land battles which are more likely to cause heavy loss of life. The use of Air Power has gained importance in NATO operations in the Post-Cold War era. For example, air power has undertaken a decisive role from the beginning to the end of the operation in Libya. From this point of view, the most important issue to consider is how to direct air power more effectively at operational level. NATO's Core JFAC (Joint Force Air Command) was established in 2012 to control joint air power at operational level from a single center. US had experienced JFAC aproach in the Operation Desert Storm in 1991. UK, France, Germany, Italy and Spain are also directing their air power from their JFAC structures. Joint air power can be directed from a single center at operational level by means of JFAC. JFAC aproach provides complex planning progress of Air Power to be controled faster in a single center. An Air Power with a large number of aircrafts, long range missiles of cutting-edge technology may have difficulties in achieving results unless directed effectively. In this article, directing air power more effectively at operational level has been studied in the framework of directing air power from a single center carried out by SWOT analysis technique. "Directing Air Power at operational level from a single center similar to JFAC-like structure" is compared with "Directing Air Power at operational level from two centers similar to AC (Air Command) + CAOC (Combined Air Operations Center) structure" As a result of this study, it is assessed that directing air power at operational level from a single center would bring effectiveness to the air campaign. The study examines directing air power at operational level. Developments at political, strategic and tactical levels have been ignored.

  14. Fluxless laser soldering for electronic packaging

    SciTech Connect

    Hosking, F.M.; Keicher, D.M.

    1991-12-31

    Conventional soldering typically requires the use of reactive fluxes to promote wetting. The resulting flux residues are removed primarily with halogenated or chlorofluorocarbon (CFC) solvents. With the mandated phaseout of CFCs by the year 2000, there has been a concentrated effort to develop alternative, environmentally compatible manufacturing and cleaning technologies that will satisfy the restrictions placed on CFCs, but still yield high quality product. Sandia National Laboratories is currently evaluating a variety of alternative fluxless soldering technologies which can be applied to electronic packaging. Laser soldering in a controlled atmosphere has shown great potential as an environmentally compatible process. The effects of laser heating with a 100 watt CW Nd:YAG laser, joint design, and base/filler metal reactions on achieving fluxless wetting with good metallurgical bonds were examined. Satisfactory Ni-Au plated Kovar{reg_sign} solder joints were made with 80In-15Pb-5Ag and 63Sn-37Pb (wt. %) solder alloys in a slightly reducing cover gas. Wetting generally increased with increasing laser power, decreasing laser beam spot size, and decreasing part travel speed. The materials and processing interaction effects are identified and discussed.

  15. Fluxless laser soldering for electronic packaging

    SciTech Connect

    Hosking, F M; Keicher, D M

    1991-01-01

    Conventional soldering typically requires the use of reactive fluxes to promote wetting. The resulting flux residues are removed primarily with halogenated or chlorofluorocarbon (CFC) solvents. With the mandated phaseout of CFCs by the year 2000, there has been a concentrated effort to develop alternative, environmentally compatible manufacturing and cleaning technologies that will satisfy the restrictions placed on CFCs, but still yield high quality product. Sandia National Laboratories is currently evaluating a variety of alternative fluxless soldering technologies which can be applied to electronic packaging. Laser soldering in a controlled atmosphere has shown great potential as an environmentally compatible process. The effects of laser heating with a 100 watt CW Nd:YAG laser, joint design, and base/filler metal reactions on achieving fluxless wetting with good metallurgical bonds were examined. Satisfactory Ni-Au plated Kovar{reg sign} solder joints were made with 80In-15Pb-5Ag and 63Sn-37Pb (wt. %) solder alloys in a slightly reducing cover gas. Wetting generally increased with increasing laser power, decreasing laser beam spot size, and decreasing part travel speed. The materials and processing interaction effects are identified and discussed.

  16. Thermal resistances of solder-boss/potting compound combinations

    NASA Technical Reports Server (NTRS)

    Veilleux, E. D.

    1968-01-01

    Formulas, which can be used as a design tool, are derived to calculate the thermal resistance of solder-boss/potting compound combinations, for different depths of a solder boss, in electronic cordwood modules. Since the solder boss is the heat source, its shape and position will affect the thermal resistance of the surrounding potting compound.

  17. Efforts to Develop a 300°C Solder

    SciTech Connect

    Norann, Randy A

    2015-01-25

    This paper covers the efforts made to find a 300°C electrical solder solution for geothermal well monitoring and logging tools by Perma Works LLC. This paper covers: why a high temperature solder is needed, what makes for a good solder, testing flux, testing conductive epoxy and testing intermetallic bonds. Future areas of research are suggested.

  18. Inspection criteria ensure quality control of parallel gap soldering

    NASA Technical Reports Server (NTRS)

    Burka, J. A.

    1968-01-01

    Investigation of parallel gap soldering of electrical leads resulted in recommendation on material preparation, equipment, process control, and visual inspection criteria to ensure reliable solder joints. The recommendations will minimize problems in heat-dwell time, amount of solder, bridging conductors, and damage of circuitry.

  19. Microstructural evolution of eutectic Au-Sn solder joints

    SciTech Connect

    Song, Ho Geon

    2002-05-31

    Current trends toward miniaturization and the use of lead(Pb)-free solder in electronic packaging present new problems in the reliability of solder joints. This study was performed in order to understand the microstructure and microstructural evolution of small volumes of nominally eutectic Au-Sn solder joints (80Au-20Sn by weight), which gives insight into properties and reliability.

  20. Mechanical Shock Behavior of Environmentally-Benign Lead-free Solders

    NASA Astrophysics Data System (ADS)

    Yazzie, Kyle

    The mechanical behavior of Pb-free solder alloys is important, since they must maintain mechanical integrity under thermomechanical fatigue, creep, and mechanical shock conditions. Mechanical shock, in particular, has become an increasing concern in the electronics industry, since electronic packages can be subjected to mechanical shock by mishandling during manufacture or by accidental dropping. In this study, the mechanical shock behavior of Sn and Sn-Ag-Cu alloys was systematically analyzed over the strain rate range 10-3 -- 30 s-1 in bulk samples, and over 10-3 -- 12 s-1 on the single solder joint level. More importantly, the influences of solder microstructure and intermetallic compounds (IMC) on mechanical shock resistance were quantified. A thorough microstructural characterization of Sn-rich alloys was conducted using synchrotron x-ray computed tomography. The three-dimensional morphology and distribution of contiguous phases and precipitates was analyzed. A multiscale approach was utilized to characterize Sn-rich phases on the microscale with x-ray tomography and focused ion beam tomography to characterize nanoscale precipitates. A high strain rate servohydraulic test system was developed in conjunction with a modified tensile specimen geometry and a high speed camera for quantifying deformation. The effect of microstructure and applied strain rate on the local strain and strain rate distributions were quantified using digital image correlation. Necking behavior was analyzed using a novel mirror fixture, and the triaxial stresses associated with necking were corrected using a self-consistent method to obtain the true stress-true strain constitutive behavior. Fracture mechanisms were quantified as a function of strain rate. Finally, the relationship between solder microstructure and intermetallic compound layer thickness with the mechanical shock resistance of Sn-3.8Ag-0.7Cu solder joints was characterized. It was found that at low strain rates the dynamic

  1. A novel method for direct solder bump pull testing using lead-free solders

    NASA Astrophysics Data System (ADS)

    Turner, Gregory Alan

    This thesis focuses on the design, fabrication, and evaluation of a new method for testing the adhesion strength of lead-free solders, named the Isotraction Bump Pull method (IBP). In order to develop a direct solder joint-strength testing method that did not require customization for different solder types, bump sizes, specific equipment, or trial-and-error, a combination of two widely used and accepted standards was created. First, solder bumps were made from three types of lead free solder were generated on untreated copper PCB substrates using an in-house fabricated solder bump-on-demand generator, Following this, the newly developed method made use of a polymer epoxy to encapsulate the solder bumps that could then be tested under tension using a high precision universal vertical load machine. The tests produced repeatable and predictable results for each of the three alloys tested that were in agreement with the relative behavior of the same alloys using other testing methods in the literature. The median peak stress at failure for the three solders tested were 2020.52 psi, 940.57 psi, and 2781.0 psi, and were within one standard deviation of the of all data collected for each solder. The assumptions in this work that brittle fracture occurred through the Intermetallic Compound layer (IMC) were validated with the use of Energy-Dispersive X-Ray Spectrometry and high magnification of the fractured surface of both newly exposed sides of the test specimens. Following this, an examination of the process to apply the results from the tensile tests into standard material science equations for the fracture of the systems was performed..

  2. NASA-DoD Lower Process Temperature Lead-Free Solder Project Overview

    NASA Technical Reports Server (NTRS)

    Kessel, Kurt R.

    2014-01-01

    This project is a follow-on effort to the Joint Council on Aging AircraftJoint Group on Pollution Prevention (JCAAJG-PP) Pb-free Solder Project and NASA-DoD Lead-Free Electronics Project which were the first projects to test the reliability of Pb-free solder joints against the requirements of the aerospace and military community. This effort would continue to build on the results from the JCAAJG-PP Lead-Free Solder Project and NASA-DoD Lead-Free Electronics Project while focusing on a particular failure mechanism currently plaguing Pb-free assemblies, pad cratering.The NASA-DoD Lead-Free Electronics Project confirmed that pad cratering is one of the dominant failure modes that occur in various board level reliability tests, especially under dynamic loading. Pad Cratering is a latent defect that may occur during assembly, rework, and post assembly handling and testing.

  3. Electromigration and solid state aging of flip chip solder joints and analysis of tin whisker on lead-frame

    NASA Astrophysics Data System (ADS)

    Lee, Taekyeong

    Electromigration and solid state aging in flip chip joint, and whisker on lead frame of Pb-containing (eutectic SnPb) and Pb-free solders (SnAg 3.5, SnAg3.8Cu0.7, and SnCu0.7), have been studied systematically, using Scanning Electron Microscopy (SEM), Energy Dispersive X-ray Analysis (EDX), and synchrotron radiation. The high current density in flip chip joint drives the diffusion of atoms of eutectic SnPb and SnAgCu. A marker is used to measure the diffusion flux in a half cross-sectioned solder joint. SnAgCu shows higher resistance against electromigration than eutectic SnPb. In the half cross-sectioned solder joint, void growth is the dominant failure mechanism. However, the whole solder balls in the underfill show that the failure mechanism is a result from the dissolution of electroless Ni under bump metallization (UBM) of about 10 mum thickness. The growth rate between intermetallic compounds in molten and solid solders differed by four orders of magnitude. In liquid solder, the growth rate is about 1 mum/min; the growth rate in solid solder is only about 10 -4 mum/min. The difference is not resulting from factors of thermodynamics, which is the change of Gibbs free energy before and after intermetallic compound formation, but from kinetic factors, which is the rate of change of Gibbs free energy. Even though the difference in growth rate between eutectic SnPb and Pb-free solders during solid state aging was found, the reason behind such difference shown is unclear. The orientation and stress levels of whiskers are measured by white X-ray of synchrotron radiation. The growth direction is nearly parallel to one of the principal axes of tin. The compressive stress level is quite low because the residual stress is relaxed by the whisker growth.

  4. Nanocopper Based Solder-Free Electronic Assembly

    NASA Astrophysics Data System (ADS)

    Schnabl, K.; Wentlent, L.; Mootoo, K.; Khasawneh, S.; Zinn, A. A.; Beddow, J.; Hauptfleisch, E.; Blass, D.; Borgesen, P.

    2014-12-01

    CuantumFuse nano copper material has been used to assemble functional LED test boards and a small camera board with a 48 pad CMOS sensor quad-flat no-lead chip and a 10 in flexible electronics demo. Drop-in replacement of solder, by use of stencil printing and standard surface mount technology equipment, has been demonstrated. Applications in space and commercial systems are currently under consideration. The stable copper-nanoparticle paste has been examined and characterized by scanning electron microscopy and high-resolution transmission electron microscopy; this has shown that the joints are nanocrystalline but with substantial porosity. Assessment of reliability is expected to be complicated by this and by the effects of thermal and strain-enhanced coarsening of pores. Strength, creep, and fatigue properties were measured and results are discussed with reference to our understanding of solder reliability to assess the potential of this nano-copper based solder alternative.

  5. Intelligent laser soldering inspection and process control

    NASA Technical Reports Server (NTRS)

    Vanzetti, Riccardo

    1987-01-01

    Component assembly on printed circuitry keeps making giant strides toward denser packaging and smaller dimensions. From a single layer to multilayer, from through holes to surface mounted components and tape applied bonds, unrelenting progress results in new, difficult problems in assembling, soldering, inspecting and controlling the manufacturing process of the new electronics. Among the major problems are the variables introduced by human operators. The small dimensions and the tight assembly tolerances are now successfully met by machines which are faster and more precise than the human hand. The same is true for soldering. But visual inspection of the solder joints is now so severely limited by the ever shrinking area accessible to the human eye that the inspector's diagnosis cannot be trusted any longer. Solutions to correcting these problems are discussed.

  6. Solder Joint Health Monitoring Testbed System

    NASA Technical Reports Server (NTRS)

    Delaney, Michael M.

    2009-01-01

    The density and pin count for Field Programmable Gate Arrays (FPGAs) has been increasing, and has exceeded current methods of solder joint inspection, making early detection of failures more problematic. These failures are a concern for both flight safety and maintenance in commercial aviation. Ridgetop Group, Inc. has developed a method for detecting solder joint failures in real time. The NASA Dryden Flight Research Center is developing a set of boards to test this method in ground environmental and accelerated testing as well as flight test on a Dryden F-15 or F-18 research aircraft. In addition to detecting intermittent and total solder joint failures, environmental data on the boards, such as temperature and vibration, will be collected and time-correlated to aircraft state data. This paper details the technical approach involved in the detection process, and describes the design process and products to date for Dryden s FPGA failure detection boards.

  7. Solderability Study of RABiTS-Based YBCO Coated Conductors

    SciTech Connect

    Zhang, Yifei; Duckworth, Robert C; Ha, Tam T; Gouge, Michael J

    2011-01-01

    The solderability of commercially available YBa{sub 2}Cu{sub 3}O{sub 7-x} (YBCO) coated conductors that were made from Rolling Assisted Biaxially Textured Substrates (RABiTS)-based templates was studied. The coated conductors, also known as second-generation (2G) high temperature superconductor (HTS) wires (in the geometry of flat tapes about 4 mm wide), were laminated with copper, brass, or stainless steel strips as stabilizers. To understand the factors that influence their solderability, surface profilometry and scanning electron microscopy were used to characterize the wire surfaces. The solderability of three solders, 52In48Sn, 67Bi33In, and 100In (wt.%), was evaluated using a standard test (IPC/ECA J-STD-002) and with two different commercial fluxes. It was found that the solderability varied with the solder and flux but the three different wires showed similar solderability for a fixed combination of solder and flux. Solder joints of the 2G wires were fabricated using the tools and the procedures recommended by the HTS wire manufacturer. The solder joints were made in a lap-joint geometry and with the superconducting sides of the two wires face-to-face. The electrical resistances of the solder joints were measured at 77 K, and the results were analyzed to qualify the soldering materials and evaluate the soldering process. It was concluded that although the selection of soldering materials affected the resistance of a solder joint, the resistivity of the stabilizer was the dominant factor.

  8. Wafer-to-wafer bonding of nonplanarized MEMS surfaces using solder

    NASA Astrophysics Data System (ADS)

    Sparks, D.; Queen, G.; Weston, R.; Woodward, G.; Putty, M.; Jordan, L.; Zarabadi, S.; Jayakar, K.

    2001-11-01

    The fabrication and reliability of a solder wafer-to-wafer bonding process is discussed. Using a solder reflow process allows vacuum packaging to be accomplished with unplanarized complementary metal-oxide semiconductor (CMOS) surface topography. This capability enables standard CMOS processes, and integrated microelectromechanical systems devices to be packaged at the chip-level. Alloy variations give this process the ability to bond at lower temperatures than most alternatives. Factors affecting hermeticity, shorts, Q values, shifting cavity pressure, wafer saw cleanliness and corrosion resistance will be covered.

  9. Low temperature solder process to join a copper tube to a silicon wafer

    NASA Astrophysics Data System (ADS)

    Versteeg, Christo; Scarpim de Souza, Marcio

    2014-06-01

    With the application for wafer level packages, which could be Complementary Metal-Oxide-Semiconductor (CMOS) based, and which requires a reduced atmosphere, a copper tube connection to a vacuum pump and the package is proposed. The method evaluated uses laser assisted brazing of a solder, to join the copper tube to a silicon wafer. The method was applied to a silicon wafer coated with a metallic interface to bond to the solder. The hermeticity of the joint was tested with a helium leak rate tester and the bonding energy thermal extent was verified with a thin layer of indium that melted wherever the substrate temperature rose above its melting temperature.

  10. ESD Test Apparatus for Soldering Irons

    NASA Technical Reports Server (NTRS)

    Sancho, Jose; Esser, Robert

    2013-01-01

    ESDA (Electrostatic Discharge Association) ESD STM 13.1-2000 requires frequent testing of the voltage leakage from the tip of a soldering iron and the resistance from the tip of the soldering iron to the common point ground. Without this test apparatus, the process is time-consuming and requires several wires, alligator clips, or test probes, as well as additional equipment. Soldering iron tips must be tested for electrostatic discharge risks frequently, and this typically takes a lot of time in setup and testing. This device enables the operator to execute the full test in one minute or less. This innovation is a simple apparatus that plugs into a digital multimeter (DMM) and the Common Point Ground (CPG) reference. It enables the user to perform two of the electrostatic discharge tests required in ESD STM 13.1-2000. The device consists of a small black box with two prongs sticking out of one end, two inputs on the opposite end (one of the inputs is used to connect the reference CPG to the DMM), and a metal tab on one side. Inside the box are wires, several washers of various materials, and assembly hardware (nuts and screws/bolts). The device is a passive electronic component that is plugged into a DMM. The operator sets the DMM to read voltage. The operator places the heated tip of the soldering iron onto the metal tab with a small amount of solder to ensure a complete connection. The voltage is read and recorded. The operator switches the DMM to read resistance. The operator places the heated tip of the soldering iron onto the metal tab with a small amount of solder to ensure a complete connection. The resistance is recorded. If the recorded voltage and resistance are below a number stated in ESDA ESD STM 13.1-2000, the test is considered to pass. The device includes all the necessary wiring internal to its body so the operator does not need to do any independent wiring, except for grounding. It uses a stack of high-thermal-resistance washers to minimize the

  11. An Accelerated Method for Testing Soldering Tendency of Core Pins

    SciTech Connect

    Han, Qingyou; Xu, Hanbing; Ried, Paul; Olson, Paul

    2010-01-01

    An accelerated method for testing die soldering has been developed. High intensity ultrasonic vibrations has been used to simulate the die casting conditions such as high pressure and high impingement speed of molten metal on the pin. Soldering tendency of steels and coated pins has been examined. The results indicate that in the low carbon steel/Al system, the onset of soldering is 60 times faster with ultrasonic vibration than that without ultrasonic vibration. In the H13/A380 system, the onset of soldering reaction is accelerated to 30-60 times. Coating significantly reduces the soldering tendency of the core pins.

  12. Flexible multisensor inspection system for solder-joint analysis

    NASA Astrophysics Data System (ADS)

    Lacey, Gerard; Waldron, Ronan; Dinten, Jean-Marc; Lilley, Francis

    1993-08-01

    This paper describes the design and construction of an open, automated, solder bond verification machine for the electronics manufacturing industry. The application domain is the higher end assembly technologies, with an emphasis on fine pitch surface mount components. The system serves a measurement function, quantifying the solder bonds. It interfaces with the manufacturing process to close the manufacturing loop. A geometric model of the solder in a joint, coupled with a finite element analysis of the physical properties of solder, lead to objective measurement of the solder. Principle illumination systems are laser, X-ray and noncoherent lighting. Open, Objected Oriented design and implementation practices enable a forward looking system to be developed.

  13. Submicron accuracy optimization for laser beam soldering processes

    NASA Astrophysics Data System (ADS)

    Beckert, Erik; Burkhardt, Thomas; Hornaff, Marcel; Kamm, Andreas; Scheidig, Ingo; Stiehl, Cornelia; Eberhardt, Ramona; Tünnermann, Andreas

    2010-02-01

    Laser beam soldering is a packaging technology alternative to polymeric adhesive bonding in terms of stability and functionality. Nevertheless, when packaging especially micro optical and MOEMS systems this technology has to fulfil stringent requirements for accuracy in the micron and submicron range. Investigating the assembly of several laser optical systems it has been shown that micron accuracy and submicron reproducibility can be reached when using design-of-experiment optimized solder processes that are based on applying liquid solder drops ("Solder Bumping") onto wettable metalized joining surfaces of optical components. The soldered assemblies were subject to thermal cycles and vibration/ shock test also.

  14. Entrainment of Upper Level Dry Air Into Hurricane Earl

    NASA Technical Reports Server (NTRS)

    Guillory, Anthony R.; Jedlovec, Gary J.; Hood, Robbie E.; Atkinson, Robert J.; LaFontaine, Frank J.

    1999-01-01

    Hurricane Earl formed in the Gulf of Mexico in September 1998. It quickly was upgraded from a tropical disturbance to tropical storm status and then to a hurricane. Earl possessed hybrid (tropical and extratropical) characteristics throughout its lifetime. The system maintained and erratic track, which led to wide variability in the operational track forecasts. It eventually made landfall on the Florida panhandle on 2 September and raced northeastward. During August and September 1998, NASA conducted the third Convection and Moisture Experiment (CAMEX-3). The experiment was focused on studying hurricanes with an emphasis toward developing a better understanding of their intensification and motion. Earl provides a unique opportunity to utilize high spatial and temporal resolution data collected from the DC-8 and high altitude ER-2 NASA platforms, which flew over Earl as it made landfall. These data can also be put into broader view provided by other instruments from the Geosynchronous Operational Environmental Satellites (GOES) and the Tropical Rainfall Measuring Mission (TRMM) satellites. Hurricane Earl was affected by entrainment of dry air from the northwest. Hurricane Isis was intensifying and approaching the Mexican Pacific coast with its associated outflow potentially affecting the inflow into Earl as the storm neared Florida. In addition, a longwave synoptic trough circulation was present over the eastern U.S. Either or both of these could be responsible for the dry air into the system. This paper will focus on identifying the source of the dry by using upper-level wind and moisture fields derived from the GOES 6.7 um water vapor imagery. We will attempt to relate the large-scale observations to those from the NASA aircraft. An infrared instrument onboard the ER-2 also has a similar wavelength and may be able to confirm some of the GOES findings. In addition, a microwave radiometer with 4 channels focused on measuring precipitation and its associated ice

  15. AIRS PFM Pulse Tube Cooler System-level Performance

    NASA Technical Reports Server (NTRS)

    Ross, R.; Johnson, D.; Collins, S.; Green, K.; Wickman, H.

    1998-01-01

    JPL's Atmospheric Infrared Sounder (AIRS) instrument is being built to make precision measurements of air temperature over the surface of the Earth as a function of elevation; the flight instrument is in the final stages of assembly and checkout at this time, and uses a pair of TRW pulse tube cryocoolers operating at 55K to cool its sensitive IR focal plane.

  16. Air pollution levels and regulations in the United Kingdom

    SciTech Connect

    Monarch, M.

    1986-07-01

    Air pollution control regulations and trends in air quality and emissions are broadly outlined, then are compared with corresponding regulations and trends in the United States. Since acid rain is the intended field of application, the reports generally deal only with sulfur dioxide, nitrogen oxides, ozone, and total suspended particulates.

  17. Solder flow over fine line PWB surface finishes

    SciTech Connect

    Hosking, F.M.; Hernandez, C.L.

    1998-08-01

    The rapid advancement of interconnect technology has stimulated the development of alternative printed wiring board (PWB) surface finishes to enhance the solderability of standard copper and solder-coated surfaces. These new finishes are based on either metallic or organic chemistries. As part of an ongoing solderability study, Sandia National Laboratories has investigated the solder flow behavior of two azole-based organic solderability preservations, immersion Au, immersion Ag, electroless Pd, and electroless Pd/Ni on fine line copper features. The coated substrates were solder tested in the as-fabricated and environmentally-stressed conditions. Samples were processed through an inerted reflow machine. The azole-based coatings generally provided the most effective protection after aging. Thin Pd over Cu yielded the best wetting results of the metallic coatings, with complete dissolution of the Pd overcoat and wetting of the underlying Cu by the flowing solder. Limited wetting was measured on the thicker Pd and Pd over Ni finishes, which were not completely dissolved by the molten solder. The immersion Au and Ag finishes yielded the lowest wetted lengths, respectively. These general differences in solderability were directly attributed to the type of surface finish which the solder came in contact with. The effects of circuit geometry, surface finish, stressing, and solder processing conditions are discussed.

  18. Microsoldering using a YAG laser: on lead-free solder

    NASA Astrophysics Data System (ADS)

    Nakahara, Sumio; Kamata, Tatsuya; Yoneda, Noriyuki; Hisada, Shigeyoshi; Fujita, Takeyoshi

    2000-11-01

    Solderability of conventional Sn-37Pb solder pastes and Pb- free alloys (Sn-43Bi and Sn-2Ag-5Bi-0.5Cu) were examined on micro soldering using a YAG laser. Experiments were performed in order to determine the range of soldering parameters of a laser power density and an irradiation time for obtaining an appropriate wettability based on a visual inspection by a Japanese Industrial Standard. And the laser soldering processes were monitored by measuring temperature change inside solder joint (solder and Cu pad) and on a surface of a chip component. Next joining strength of chip components for surface mounting soldered on printed circuit board (glass epoxy) was tested on application thickness of solder paste (0.2, 0.3, and 0.4 mm). In addition, joining strength characteristics at different power density and materials were examined around thermal shock test by the gas phase method. As a result, characteristics of Sn-Ag-Bi-Cu (Pb-free) solder paste are equivalent to that of Sn-Pb solder paste.

  19. Embrittlement of surface mount solder joints by hot solder-dipped, gold-plated leads

    SciTech Connect

    Vianco, P.T.

    1993-07-01

    The detachment of beam-leaded transistors from several surface mount circuit boards following modest thermal cycling was examined. Microstructural analysis of the package leads and bonding pads from the failed units indicated that gold embrittlement was responsible for a loss of solder joint mechanical integrity that caused detachment of transistors from the circuit boards. An analysis of the hot dipping process used to remove gold from the leads prior to assembly demonstrated that the gold, although dissolved from the lead, remained in the nearby solder and was subsequently retained in the coating formed on the lead upon withdrawal from the bath. This scenario allowed gold to enter the circuit board solder joints. It was hypothesized, and later confirmed by experimental trials, that increasing the number of dips prevented gold from entering the solder coatings.

  20. Solder for oxide layer-building metals and alloys

    DOEpatents

    Kronberg, J.W.

    1992-09-15

    A low temperature solder and method for soldering an oxide layer-building metal such as aluminum, titanium, tantalum or stainless steel is disclosed. The composition comprises tin and zinc; germanium as a wetting agent; preferably small amounts of copper and antimony; and a grit, such as silicon carbide. The grit abrades any oxide layer formed on the surface of the metal as the germanium penetrates beneath and loosens the oxide layer to provide good metal-to-metal contact. The germanium comprises less than approximately 10% by weight of the solder composition so that it provides sufficient wetting action but does not result in a melting temperature above approximately 300 C. The method comprises the steps rubbing the solder against the metal surface so the grit in the solder abrades the surface while heating the surface until the solder begins to melt and the germanium penetrates the oxide layer, then brushing aside any oxide layer loosened by the solder.

  1. Solder for oxide layer-building metals and alloys

    DOEpatents

    Kronberg, James W.

    1992-01-01

    A low temperature solder and method for soldering an oxide layer-building metal such as aluminum, titanium, tantalum or stainless steel. The comosition comprises tin and zinc; germanium as a wetting agent; preferably small amounts of copper and antimony; and a grit, such as silicon carbide. The grit abrades any oxide layer formed on the surface of the metal as the germanium penetrates beneath and loosens the oxide layer to provide good metal-to-metal contact. The germanium comprises less than aproximatley 10% by weight of the solder composition so that it provides sufficient wetting action but does not result in a melting temperature above approximately 300.degree. C. The method comprises the steps rubbing the solder against the metal surface so the grit in the solder abrades the surface while heating the surface until the solder begins to melt and the germanium penetrates the oxide layer, then brushing aside any oxide layer loosened by the solder.

  2. Capillary flow of solder on chemically roughened PWB surfaces

    SciTech Connect

    Hosking, F.M.; Stevenson, J.O.; Yost, F.G.

    1996-02-01

    The Center for Solder Science and Technology at Sandia National Laboratories has developed a solderability test for evaluating fundamental solder flow over PWB (printed wiring boards) surface finishes. The work supports a cooperative research and development agreement between Sandia, the National Center for Manufacturing Sciences (NCMS), and several industrial partners. An important facet of the effort involved the ``engineering`` of copper surfaces through mechanical and chemical roughening. The roughened topography enhances solder flow, especially over very fine features. In this paper, we describe how etching with different chemical solutions can affect solder flow on a specially designed ball grid array test vehicle (BGATV). The effects of circuit geometry, solution concentration, and etching time are discussed. Surface roughness and solder flow data are presented to support the roughening premise. Noticeable improvements in solder wettability were observed on uniformly etched surfaces having relatively steep peak-to-valley slopes.

  3. Evaluation of the Bondability of the Epoxy-Enhanced Sn-58Bi Solder with ENIG and ENEPIG Surface Finishes

    NASA Astrophysics Data System (ADS)

    Myung, Woo-Ram; Kim, Yongil; Jung, Seung-Boo

    2015-11-01

    The effect of different surface finishes, electroless nickel immersion gold (ENIG) and electroless nickel electroless palladium immersion gold (ENEPIG), on the mechanical properties of Sn-58Bi bumps made with solder paste enhanced with epoxy were investigated. The microstructure and fracture surfaces were observed with scanning electron microscopy, and the compositions of the IMC and solder were measured using energy dispersive spectrometry and an electron probe micro-analyzer (EPMA). To evaluate the mechanical properties, low-speed shear tests and board-level drop tests were performed. The result of the shear tests showed that the bonding strength of the epoxy-enhanced Sn-58Bi solder bumps was higher than that of Sn-58Bi solder for all surface finishes, because of the epoxy surrounding the solder, and the fracture surfaces of epoxy-enhanced Sn-58Bi indicated ductile fracture in the solder joint. However, the result of the drop tests showed that samples with the ENIG and ENEPIG surface finishes had lower drop numbers compared to the sample without these surface finishes. The lower performance resulted from insufficient ejection of epoxy from the ENIG and ENEPIG surface finishes during reflow, which reduced the interfacial bonding area.

  4. Electromigration performance of Pb-free solder joints in terms of solder composition and joining path

    NASA Astrophysics Data System (ADS)

    Seo, Sun-Kyoung; Kang, Sung K.; Cho, Moon Gi; Lee, Hyuck Mo

    2010-07-01

    The electromigration (EM) performance of Pb-free solder joints is investigated in terms of solder composition (Sn-0.5Cu vs. Sn-1.8Ag) and joining path to Cu vs. Ni(P) under bump metallization (UBM). In the double-sided joints of Ni(P)/solder/Cu, the micro-structure of solder joints and the interfacial intermetallic compound (IMC) layers are significantly affected by solder composition and joining path. The as-reflowed microstructure of Sn-0.5Cu joints consists of small columnar grains with thin IMC layers at both UBM interfaces, independent of the joining path, while Sn-1.8Ag joints have a few large grains of low-angle grain boundaries with thick IMC layers when joined first to Ni(P) UBM, but a few 60° twins with thin IMC layers when joined first to Cu UBM. The EM stressing under high current densities at 150°C reveals that Sn-1.8Ag joints have a superior lifetime compared to Sn-0.5Cu joints. In addition, the EM lifetime of Sn-1.8Ag joints reflowed first on Ni(P) UBM is the longest among four groups of the solder joints examined.

  5. Microstructural Evolution of Lead-Free Solder Joints in Ultrasonic-Assisted Soldering

    NASA Astrophysics Data System (ADS)

    Ji, Hongjun; Wang, Qiang; Li, Mingyu

    2016-01-01

    Solder joint reliability greatly depends on the microstructure of the solder matrix and the morphology of intermetallic compounds (IMCs) in the joints. Addition of strengthening phases such as carbon nanotubes and ceramic particles to solder joints to improve their properties has been widely studied. In this work, ultrasonic vibration (USV) of casting ingots was applied to considerably improve their microstructure and properties, and the resulting influence on fluxless soldering of Cu/Sn-3.0Ag-0.5Cu/Cu joints and their microstructural evolution was investigated. It was demonstrated that USV application during reflow of Sn-based solder had favorable effects on β-Sn grain size refinement as well as the growth and distribution of various IMC phases within the joints. The β-Sn grain size was significantly refined as the ultrasound power was increased, with a reduction of almost 90% from more than 100 μm to below 10 μm. Long and large Cu6Sn5 tubes in the solder matrix of the joints were broken into tiny ones. Needle-shaped Ag3Sn was transformed into flake-shaped. These IMCs were mainly precipitated along β-Sn phase boundaries. High-temperature storage tests indicated that the growth rate of interfacial IMCs in joints formed with USV was slower than in conventional reflow joints. The mechanisms of grain refinement and IMC fragmentation are discussed and related to the ultrasonic effects.

  6. Vandenberg Air Force Base Upper Level Wind Launch Weather Constraints

    NASA Technical Reports Server (NTRS)

    Shafer, Jaclyn A.; Wheeler, Mark M.

    2012-01-01

    The 30th Operational Support Squadron Weather Flight (30 OSSWF) provides comprehensive weather services to the space program at Vandenberg Air Force Base (VAFB) in California. One of their responsibilities is to monitor upper-level winds to ensure safe launch operations of the Minuteman III ballistic missile. The 30 OSSWF tasked the Applied Meteorology Unit (AMU) to analyze VAFB sounding data with the goal of determining the probability of violating (PoV) their upper-level thresholds for wind speed and shear constraints specific to this launch vehicle, and to develop a tool that will calculate the PoV of each constraint on the day of launch. In order to calculate the probability of exceeding each constraint, the AMU collected and analyzed historical data from VAFB. The historical sounding data were retrieved from the National Oceanic and Atmospheric Administration Earth System Research Laboratory archive for the years 1994-2011 and then stratified into four sub-seasons: January-March, April-June, July-September, and October-December. The maximum wind speed and 1000-ft shear values for each sounding in each subseason were determined. To accurately calculate the PoV, the AMU determined the theoretical distributions that best fit the maximum wind speed and maximum shear datasets. Ultimately it was discovered that the maximum wind speeds follow a Gaussian distribution while the maximum shear values follow a lognormal distribution. These results were applied when calculating the averages and standard deviations needed for the historical and real-time PoV calculations. In addition to the requirements outlined in the original task plan, the AMU also included forecast sounding data from the Rapid Refresh model. This information provides further insight for the launch weather officers (LWOs) when determining if a wind constraint violation will occur over the next few hours on day of launch. The interactive graphical user interface (GUI) for this project was developed in

  7. AIRS pulse tube cooler system-level and in-space performance comparison

    NASA Technical Reports Server (NTRS)

    Ross, R. G.

    2002-01-01

    This paper presents the derivation of the test and analysis techniques as well as the measured system-level performance of the flight AIRS coolers during instrument-level, spacecraft-level, and in-space operation.

  8. Relationship between air exchange rate and indoor VOC levels

    SciTech Connect

    Otson, R.; Williams, D.T.; Fellin, P.

    1998-12-31

    It is often assumed that the air quality is better in leaky than in airtight buildings. To test this anecdotal hypothesis, data from two Canadian surveys were examined. Indoor measurements of 28 volatile organic compounds (VOCs) were made by means of a passive sampling method during the 24 to 48 h study periods in both studies, and air exchange rates were determined by the perfluorocarbon tracer approach. The air exchange rates ranged between about 0.1 to 2.5 air changes per hour in 54 test homes in the Greater Toronto Area (GTA). Other information on building age and construction, renovation activities and occupant activities that potentially influenced indoor VOC concentrations in the homes was collected by means of a questionnaire. The statistical relationships between the concentrations of VOCs and air exchange were determined. Correlation coefficients between the airborne concentrations of each VOC and the air exchange rates for the homes were all < 0.1 indicating that the relationship between the air exchange and indoor VOC concentrations is tenuous. Since the questionnaire responses did not provide quantitative estimates of indoor emissions, a quantitative correlation between responses and indoor concentrations could not be established nor was a consistent pattern evident between these responses and the occurrence of high indoor concentrations. The lack of definitive quantitative relationships is not surprising considering the complexity of indoor environments, the lack of a detailed inventory of indoor sources and their emission rates and a lack of information or understanding of indoor sinks. The findings, on the effect of air exchange rates and the value of questionnaires in studies on indoor VOCs are consistent with findings in other similar studies.

  9. Effects of Ce and La Additions on the Microstructure and Mechanical Properties of Sn-9Zn Solder Joints

    NASA Astrophysics Data System (ADS)

    Lin, Hsiu-Jen; Chuang, Tung-Han

    2010-02-01

    The effects of rare-earth elements on the microstructure and mechanical properties of Sn-9Zn alloys and solder joints in ball grid array packages with Ni/Au(ENIG) surface finishes have been investigated. Metallographic observations showed that (Ce0.8Zn0.2)Sn3 and (La0.9Zn0.1)Sn3 intermetallic compounds appeared in the solder matrix of Sn-9Zn-0.5Ce and Sn-9Zn-0.5La alloys, respectively. Both fiber- and hillock-shaped tin whiskers were inhibited in the Sn-9Zn-0.5Ce solder, while tin fibers were still observed on the surface of oxidized (La0.9Zn0.1)Sn3 intermetallics in Sn-9Zn-0.5La after air exposure at room temperature. Mechanical testing indicated that the tensile strength of Sn-9Zn alloys doped with Ce and La increased significantly, and the elongation decreased, in comparison with the undoped Sn-9Zn. The bonding strengths of the as-reflowed Sn-9Zn-0.5Ce and Sn-9Zn-0.5La solder joints were also improved. However, aging treatment at 100°C and 150°C caused degradation of ball shear strength in all specimens. During the reflowing and aging processes, AuZn8 intermetallic phases appeared at the interfaces of all solder joints. In addition, Zn-rich phases were observed to migrate from the solder matrix to the solder/pad interfaces of the aged specimens.

  10. Multilead, Vaporization-Cooled Soldering Heat Sink

    NASA Technical Reports Server (NTRS)

    Rice, John

    1995-01-01

    Vaporization-cooled heat sink proposed for use during soldering of multiple electrical leads of packaged electronic devices to circuit boards. Heat sink includes compliant wicks held in grooves on edges of metal fixture. Wicks saturated with water. Prevents excessive increases in temperature at entrances of leads into package.

  11. Arc spraying solderable tabs to glass

    NASA Technical Reports Server (NTRS)

    Lindmayer, J.

    1981-01-01

    Tabs suitable for electrical or mechanical connections in solar cells and integrated circuits are made by spraying technique. Solder wets copper, copper bonds to aluminum, and aluminum adheres to glass. Arc spraying is automated and integrated with encapsulation, eliminating hand tabbing, improving reliability, and reducing cost.

  12. 40 CFR 141.43 - Prohibition on use of lead pipes, solder, and flux.

    Code of Federal Regulations, 2012 CFR

    2012-07-01

    ..., solder, and flux. 141.43 Section 141.43 Protection of Environment ENVIRONMENTAL PROTECTION AGENCY..., solder, and flux. (a) In general—(1) Prohibition. Any pipe, solder, or flux, which is used after June 19...) When used with respect to solders and flux refers to solders and flux containing not more than...

  13. 40 CFR 141.43 - Prohibition on use of lead pipes, solder, and flux.

    Code of Federal Regulations, 2013 CFR

    2013-07-01

    ..., solder, and flux. 141.43 Section 141.43 Protection of Environment ENVIRONMENTAL PROTECTION AGENCY..., solder, and flux. (a) In general—(1) Prohibition. Any pipe, solder, or flux, which is used after June 19...) When used with respect to solders and flux refers to solders and flux containing not more than...

  14. 40 CFR 141.43 - Prohibition on use of lead pipes, solder, and flux.

    Code of Federal Regulations, 2011 CFR

    2011-07-01

    ..., solder, and flux. 141.43 Section 141.43 Protection of Environment ENVIRONMENTAL PROTECTION AGENCY..., solder, and flux. (a) In general—(1) Prohibition. Any pipe, solder, or flux, which is used after June 19...) When used with respect to solders and flux refers to solders and flux containing not more than...

  15. 40 CFR 141.43 - Prohibition on use of lead pipes, solder, and flux.

    Code of Federal Regulations, 2014 CFR

    2014-07-01

    ..., solder, and flux. 141.43 Section 141.43 Protection of Environment ENVIRONMENTAL PROTECTION AGENCY..., solder, and flux. (a) In general—(1) Prohibition. Any pipe, solder, or flux, which is used after June 19...) When used with respect to solders and flux refers to solders and flux containing not more than...

  16. 42 CFR 84.1139 - Air velocity and noise levels; hoods and helmets; minimum requirements.

    Code of Federal Regulations, 2011 CFR

    2011-10-01

    ... 42 Public Health 1 2011-10-01 2011-10-01 false Air velocity and noise levels; hoods and helmets... Efficiency Respirators and Combination Gas Masks § 84.1139 Air velocity and noise levels; hoods and helmets; minimum requirements. Noise levels generated by the respirator will be measured inside the hood or...

  17. 42 CFR 84.202 - Air velocity and noise levels; hoods and helmets; minimum requirements.

    Code of Federal Regulations, 2011 CFR

    2011-10-01

    ... 42 Public Health 1 2011-10-01 2011-10-01 false Air velocity and noise levels; hoods and helmets... PROTECTIVE DEVICES Chemical Cartridge Respirators § 84.202 Air velocity and noise levels; hoods and helmets; minimum requirements. Noise levels generated by the respirator will be measured inside the hood or...

  18. 42 CFR 84.202 - Air velocity and noise levels; hoods and helmets; minimum requirements.

    Code of Federal Regulations, 2012 CFR

    2012-10-01

    ... 42 Public Health 1 2012-10-01 2012-10-01 false Air velocity and noise levels; hoods and helmets... PROTECTIVE DEVICES Chemical Cartridge Respirators § 84.202 Air velocity and noise levels; hoods and helmets; minimum requirements. Noise levels generated by the respirator will be measured inside the hood or...

  19. 42 CFR 84.1139 - Air velocity and noise levels; hoods and helmets; minimum requirements.

    Code of Federal Regulations, 2012 CFR

    2012-10-01

    ... 42 Public Health 1 2012-10-01 2012-10-01 false Air velocity and noise levels; hoods and helmets... Efficiency Respirators and Combination Gas Masks § 84.1139 Air velocity and noise levels; hoods and helmets; minimum requirements. Noise levels generated by the respirator will be measured inside the hood or...

  20. 42 CFR 84.1139 - Air velocity and noise levels; hoods and helmets; minimum requirements.

    Code of Federal Regulations, 2014 CFR

    2014-10-01

    ... 42 Public Health 1 2014-10-01 2014-10-01 false Air velocity and noise levels; hoods and helmets... Efficiency Respirators and Combination Gas Masks § 84.1139 Air velocity and noise levels; hoods and helmets; minimum requirements. Noise levels generated by the respirator will be measured inside the hood or...

  1. 42 CFR 84.202 - Air velocity and noise levels; hoods and helmets; minimum requirements.

    Code of Federal Regulations, 2013 CFR

    2013-10-01

    ... 42 Public Health 1 2013-10-01 2013-10-01 false Air velocity and noise levels; hoods and helmets... PROTECTIVE DEVICES Chemical Cartridge Respirators § 84.202 Air velocity and noise levels; hoods and helmets; minimum requirements. Noise levels generated by the respirator will be measured inside the hood or...

  2. 42 CFR 84.1139 - Air velocity and noise levels; hoods and helmets; minimum requirements.

    Code of Federal Regulations, 2013 CFR

    2013-10-01

    ... 42 Public Health 1 2013-10-01 2013-10-01 false Air velocity and noise levels; hoods and helmets... Efficiency Respirators and Combination Gas Masks § 84.1139 Air velocity and noise levels; hoods and helmets; minimum requirements. Noise levels generated by the respirator will be measured inside the hood or...

  3. 42 CFR 84.202 - Air velocity and noise levels; hoods and helmets; minimum requirements.

    Code of Federal Regulations, 2014 CFR

    2014-10-01

    ... 42 Public Health 1 2014-10-01 2014-10-01 false Air velocity and noise levels; hoods and helmets... PROTECTIVE DEVICES Chemical Cartridge Respirators § 84.202 Air velocity and noise levels; hoods and helmets; minimum requirements. Noise levels generated by the respirator will be measured inside the hood or...

  4. Microwave Tissue Soldering for Immediate Wound Closure

    NASA Technical Reports Server (NTRS)

    Arndt, G. Dickey; Ngo, Phong H.; Phan, Chau T.; Byerly, Diane; Dusl, John; Sognier, Marguerite A.; Carl, James

    2011-01-01

    A novel approach for the immediate sealing of traumatic wounds is under development. A portable microwave generator and handheld antenna are used to seal wounds, binding the edges of the wound together using a biodegradable protein sealant or solder. This method could be used for repairing wounds in emergency settings by restoring the wound surface to its original strength within minutes. This technique could also be utilized for surgical purposes involving solid visceral organs (i.e., liver, spleen, and kidney) that currently do not respond well to ordinary surgical procedures. A miniaturized microwave generator and a handheld antenna are used to deliver microwave energy to the protein solder, which is applied to the wound. The antenna can be of several alternative designs optimized for placement either in contact with or in proximity to the protein solder covering the wound. In either case, optimization of the design includes the matching of impedances to maximize the energy delivered to the protein solder and wound at a chosen frequency. For certain applications, an antenna could be designed that would emit power only when it is in direct contact with the wound. The optimum frequency or frequencies for a specific application would depend on the required depth of penetration of the microwave energy. In fact, a computational simulation for each specific application could be performed, which would then match the characteristics of the antenna with the protein solder and tissue to best effect wound closure. An additional area of interest with potential benefit that remains to be validated is whether microwave energy can effectively kill bacteria in and around the wound. Thus, this may be an efficient method for simultaneously sterilizing and closing wounds.

  5. Particulate Matter Levels in Ambient Air Adjacent to Industrial Area

    NASA Astrophysics Data System (ADS)

    Mohamed, R. M. S. R.; Nizam, N. M. S.; Al-Gheethi, A. A.; Lajis, A.; Kassim, A. H. M.

    2016-07-01

    Air quality in the residential areas adjacent to the industrial regions is of great concern due to the association with human health risks. In this work, the concentrations of particulate matter (PM10) in the ambient air of UTHM campus was investigated tostudy the air qualityand their compliance to the Malaysian Ambient Air Quality Guidelines (AAQG). The PM10 samples were taken over 24 hours from the most significant area at UTHM including Stadium, KolejKediamanTunDr. Ismail (KKTDI) and MakmalBahan. The meteorological parameters; temperature, relative humidity, wind speed and wind direction as well as particulate matterwere estimated by using E-Sampler Particulate Matter (PM10) Collector. The highest concentrations of PM10 (55.56 µg/m3) was recorded at MakmalBahan during the working and weekend days. However, these concentrations are less than 150 pg/m3. It can be concluded that although UTHM is surrounded by the industrial area, the air quality in the campus still within the standards limits.

  6. Effect of Solder Joint Length on Fracture Under Bending

    NASA Astrophysics Data System (ADS)

    Akbari, Saeed; Nourani, Amir; Spelt, Jan K.

    2016-01-01

    Fracture tests were conducted on copper-solder-copper joints of various lengths using double-cantilever-beam (DCB) specimens under mode I loading conditions. The thickness and length of the solder joints were large enough to neglect any anisotropy associated with the solder microstructure. It was found that the critical strain energy release rate at crack initiation, G ci, was insensitive to the length of the solder joint; however, for joints shorter than a characteristic length which was a function of the thickness and the mechanical properties of the solder layer and the substrates, the fracture load increased with increasing solder joint length. A sandwich model was developed for the analysis of the stress and strain in solder joints, taking into account the influence of both the bending deformation and the shear deformation of the substrates on the solder joint stresses. Consistent with the experimental results, it was found that solder joints longer than the characteristic length have a maximum peel stress that remains unchanged with joint length, causing the joint strength to become independent of the joint length. A closed-form analytical solution was developed for the characteristic length of DCB specimens under mode I loading. The experimental results were in good agreement with the analytical model and with finite element results. The generality of the G ci failure criterion was demonstrated by comparing the experimental results and the fracture load predictions of mode I DCB solder joints with different lengths.

  7. Soldering of Carbon Materials Using Transition Metal Rich Alloys.

    PubMed

    Burda, Marek; Lekawa-Raus, Agnieszka; Gruszczyk, Andrzej; Koziol, Krzysztof K K

    2015-08-25

    Joining of carbon materials via soldering has not been possible up to now due to lack of wetting of carbons by metals at standard soldering temperatures. This issue has been a severely restricting factor for many potential electrical/electronic and mechanical applications of nanostructured and conventional carbon materials. Here we demonstrate the formation of alloys that enable soldering of these structures. By addition of several percent (2.5-5%) of transition metal such as chromium or nickel to a standard lead-free soldering tin based alloy we obtained a solder that can be applied using a commercial soldering iron at typical soldering temperatures of approximately 350 °C and at ambient conditions. The use of this solder enables the formation of mechanically strong and electrically conductive joints between carbon materials and, when supported by a simple two-step technique, can successfully bond carbon structures to any metal terminal. It has been shown using optical and scanning electron microscope images as well as X-ray diffraction patterns and energy dispersive X-ray mapping that the successful formation of carbon-solder bonds is possible, first, thanks to the uniform nonreactive dispersion of transition metals in the tin-based matrix. Further, during the soldering process, these free elements diffuse into the carbon-alloy border with no formation of brazing-like carbides, which would damage the surface of the carbon materials. PMID:26256042

  8. CO2 temperature-controlled laser soldering of pig trachea incisions in vitro using flexible albumin bands

    NASA Astrophysics Data System (ADS)

    Sharvit, Dan; Vasilyev, Tamar; Vasserman, Irena; Simhon, David; Kariv, Naam; DeRowe, Ari; Katzir, Abraham

    2005-04-01

    Resection of a segment of the trachea is a procedure applied for the removal of cervical tumors invading the trachea, or for the treatment of severe tracheal stenosis. The current method of anastomosis is based on multiple sutures. The main drawbacks of this method are: 1) A long procedure time, 2) An air leakage, and 3) An inflammatory response to the sutures. In this study we evaluated the feasibility and effectiveness of the use of temperature controlled CO2 laser soldering of incisions in pig tracheas in vitro. A transverse incision was made in a separated pig trachea. A flexible albumin band was prepared and was laser soldered with albumin solder to the outer surface of the trachea, covering the incision. The soldered trachea ends were sealed and the burst pressure was measured. In a series of in vitro experiments, the mean burst pressure was found to be 230 mm Hg. These preliminary results demonstrated that laser soldering using a flexible albumin band may be a useful method for sealing an incision in the trachea.

  9. Comparison of Lead and Tin Concentrations in Air at a Solder Manufacturer from the Closed-Face 37-mm Cassette With and Without a Custom Cellulose-Acetate Cassette Insert

    PubMed Central

    Lee, Eun Gyung; Chisholm, William P.; Burns, Dru A.; Nelson, John H.; Kashon, Michael L.; Harper, Martin

    2015-01-01

    A polyvinyl chloride (PVC) cassette insert with PVC filter (ACCU-CAP) in a 37-mm closed-face cassette (CFC) was designed for gravimetric analysis. A customized version of the ACCU-CAP, also to be used in the CFC, was manufactured from an acid-digestible cellulose-acetate cassette insert joined to a mixed cellulose ester (MCE) filter for wet chemical analysis. The aim of this study was to compare metal particle concentrations as sampled by the customized insert (CI) in a CFC sampler with the traditional sampling method using only a MCE filter in the CFC. Thirty-nine personal and 13 area samples were taken using paired filter-based CFC and the CI in CFC samplers at a solder manufacturing plant. The CI was removed from its CFC, and digested and analyzed as a whole. The MCE filter from the typical CFC was removed for analysis and then the interior of the cassette was wiped with Ghost Wipe for a separate analysis. The MCE filter only, Ghost Wipe, and CI were separately dissolved in heated nitric acid for ICP-MS analysis. Overall, the geometric mean concentration of the filter-only (FO) samples was considerably lower than that of the CI samples, by 53% for lead and 32% for tin. However, if the FO analysis was added to the corresponding Ghost Wipe analysis, i.e., filter+interior wipe (FW), the geometric mean concentrations of the FW results were similar to those of the CI results (by 113% for lead and 98% for tin). For both lead and tin the comparison of (log-transformed) metal concentrations between the FW and CI results showed no statistically significant difference (p-value = 0.3009 for lead and 0.800 for tin), while the comparison between the FO and CI results shows statistically significant differences (all p-values < 0.05). In conclusion, incorporating the sampler internal non-filter deposits by wiping or use of an internal filter capsule gave higher results than analyzing only the filter. Close agreement between the two methods of including non-filter deposits is

  10. Comparison of lead and tin concentrations in air at a solder manufacturer from the closed-face 37-mm cassette with and without a custom cellulose-acetate cassette insert.

    PubMed

    Lee, Eun Gyung; Chisholm, William P; Burns, Dru A; Nelson, John H; Kashon, Michael L; Harper, Martin

    2014-01-01

    A polyvinyl chloride (PVC) cassette insert with PVC filter (ACCU-CAP) in a 37-mm closed-face cassette (CFC) was designed for gravimetric analysis. A customized version of the ACCU-CAP, also to be used in the CFC, was manufactured from an acid-digestible cellulose-acetate cassette insert joined to a mixed cellulose ester (MCE) filter for wet chemical analysis. The aim of this study was to compare metal particle concentrations as sampled by the customized insert (CI) in a CFC sampler with the traditional sampling method using only a MCE filter in the CFC. Thirty-nine personal and 13 area samples were taken using paired filter-based CFC and the CI in CFC samplers at a solder manufacturing plant. The CI was removed from its CFC, and digested and analyzed as a whole. The MCE filter from the typical CFC was removed for analysis and then the interior of the cassette was wiped with Ghost Wipe for a separate analysis. The MCE filter only, Ghost Wipe, and CI were separately dissolved in heated nitric acid for ICP-MS analysis. Overall, the geometric mean concentration of the filter-only (FO) samples was considerably lower than that of the CI samples, by 53% for lead and 32% for tin. However, if the FO analysis was added to the corresponding Ghost Wipe analysis, i.e., filter+interior wipe (FW), the geometric mean concentrations of the FW results were similar to those of the CI results (by 113% for lead and 98% for tin). For both lead and tin the comparison of (log-transformed) metal concentrations between the FW and CI results showed no statistically significant difference (p-value = 0.3009 for lead and 0.800 for tin), while the comparison between the FO and CI results shows statistically significant differences (all p-values < 0.05). In conclusion, incorporating the sampler internal non-filter deposits by wiping or use of an internal filter capsule gave higher results than analyzing only the filter. Close agreement between the two methods of including non-filter deposits is

  11. MEASUREMENT OF LOW LEVEL AIR TOXICS WITH MODIFIED UV DOAS

    EPA Science Inventory

    To further understand near source impacts, EPA is working to develop open-path optical techniques for spatiotemporal-resolved measurement of air pollutants. Of particular interest is near real time quantification of mobile-source generated CO, Nox and hydrocarbons measured in cl...

  12. Effect of the Soldering Process on the Microstructure and Mechanical Properties of Sn-9Zn/Al Solder Joints

    NASA Astrophysics Data System (ADS)

    Yao, Yao; Feng, Xue; Jian, Zhou; Zhanying, Feng; Xu, Chen

    2015-08-01

    Tin-zinc solder alloys are considered to be appropriate for soldering of aluminum alloys at low-temperature in electronics and radiators applications. In this paper, the effects of different soldering parameters on the microstructure and interfacial reaction behaviors of 1070Al/Sn-9Zn/1070Al joints were investigated. The results show that the Al substrate was dissolved by the liquid solder, but Al-related intermetallic was not observed in the interface. Two kinds of Al-rich phases formed in the solder matrix. Large butterfly-shaped solid solution (Al)″ phases (about 10 μm) were formed in the liquid alloys, and compact-shaped precipitations (nano-size) were dissolved out from solders during solidification process. With increasing of the soldering time, Al″ phases were migrated upwards in the solders and the amount of this phase increased. In addition, with the increase of the soldering temperature, the dissolution rate of Al into the solder increased and the formation time of (Al)″ phases was reduced. Shear test results indicate when soldered at 250 °C, the shear strength increased from 48.6 MPa to a maximum 60.5 MPa and then decreased to a stable value (about 55 MPa) with increasing of the soldering time. Similar trends were also observed at 300 and 350 °C, while the soldering time needed to obtain maximum shear strength was shortened. The formation of these Al-rich phases improves the shear strength but deteriorates the ductility.

  13. Air

    MedlinePlus

    ... do to protect yourself from dirty air . Indoor air pollution and outdoor air pollution Air can be polluted indoors and it can ... this chart to see what things cause indoor air pollution and what things cause outdoor air pollution! Indoor ...

  14. Sn-Ag-Cu Nanosolders: Solder Joints Integrity and Strength

    NASA Astrophysics Data System (ADS)

    Roshanghias, Ali; Khatibi, Golta; Yakymovych, Andriy; Bernardi, Johannes; Ipser, Herbert

    2016-08-01

    Although considerable research has been dedicated to the synthesis and characterization of lead-free nanoparticle solder alloys, only very little has been reported on the reliability of the respective joints. In fact, the merit of nanoparticle solders with depressed melting temperatures close to the Sn-Pb eutectic temperature has always been challenged when compared with conventional solder joints, especially in terms of inferior solderability due to the oxide shell commonly present on the nanoparticles, as well as due to compatibility problems with common fluxing agents. Correspondingly, in the current study, Sn-Ag-Cu (SAC) nanoparticle alloys were combined with a proper fluxing vehicle to produce prototype nanosolder pastes. The reliability of the solder joints was successively investigated by means of electron microscopy and mechanical tests. As a result, the optimized condition for employing nanoparticles as a competent nanopaste and a novel procedure for surface treatment of the SAC nanoparticles to diminish the oxide shell prior to soldering are being proposed.

  15. Issues in the replacement of lead-bearing solders

    NASA Astrophysics Data System (ADS)

    Vianco, Paul T.; Frear, Darrel R.

    1993-07-01

    The use of soft solders, particularly those containing lead, dates back nearly 5,000 years. Solders similar to the materials used to seal the aqueducts of ancient Rome are now an important building block in the manufacture of high-speed computer assemblies. This history attests to the technological versatility of soft solders and, in particular, the solder alloys that contain lead. However, the health effects of prolonged exposure to lead have also been documented; measures to limit human exposure—at the work place and indirectly through the environment—are being considered. The successful introduction of lead-free solders into future electronic products will rely heavily upon their solderability, which can be evaluated by test procedures such as the meniscometer/wetting balance technique and the capillary flow test.

  16. Investigation of Solder Cracking Problems on Printed Circuit Boards

    NASA Technical Reports Server (NTRS)

    Berkebile, M. J.

    1967-01-01

    A Solder Committee designated to investigate a solder cracking phenomena occurring on the SATURN electrical/electronic hardware found the cause to be induced stress in the soldered connections rather than faulty soldering techniques. The design of the printed circuit (PC) board assemblies did not allow for thermal expansion of the boards that occurred during normal operation. The difference between the thermal expansion properties of the boards and component lead materials caused stress and cracking in the soldered connections. The failure mechanism and various PC boards component mounting configurations are examined in this report. Effective rework techniques using flanged tubelets, copper tubelets, and soft copper wiring are detailed. Future design considerations to provide adequate strain relief in mounting configurations are included to ensure successful solder terminations.

  17. Sn-Ag-Cu Nanosolders: Solder Joints Integrity and Strength

    NASA Astrophysics Data System (ADS)

    Roshanghias, Ali; Khatibi, Golta; Yakymovych, Andriy; Bernardi, Johannes; Ipser, Herbert

    2016-05-01

    Although considerable research has been dedicated to the synthesis and characterization of lead-free nanoparticle solder alloys, only very little has been reported on the reliability of the respective joints. In fact, the merit of nanoparticle solders with depressed melting temperatures close to the Sn-Pb eutectic temperature has always been challenged when compared with conventional solder joints, especially in terms of inferior solderability due to the oxide shell commonly present on the nanoparticles, as well as due to compatibility problems with common fluxing agents. Correspondingly, in the current study, Sn-Ag-Cu (SAC) nanoparticle alloys were combined with a proper fluxing vehicle to produce prototype nanosolder pastes. The reliability of the solder joints was successively investigated by means of electron microscopy and mechanical tests. As a result, the optimized condition for employing nanoparticles as a competent nanopaste and a novel procedure for surface treatment of the SAC nanoparticles to diminish the oxide shell prior to soldering are being proposed.

  18. 14 CFR 325.10 - Modification of the designated level of essential air service.

    Code of Federal Regulations, 2010 CFR

    2010-01-01

    ... 14 Aeronautics and Space 4 2010-01-01 2010-01-01 false Modification of the designated level of essential air service. 325.10 Section 325.10 Aeronautics and Space OFFICE OF THE SECRETARY, DEPARTMENT OF TRANSPORTATION (AVIATION PROCEEDINGS) PROCEDURAL REGULATIONS ESSENTIAL AIR SERVICE PROCEDURES § 325.10 Modification of the designated level...

  19. Microstructure and Solderability of Zn-6Al- xSn Solders

    NASA Astrophysics Data System (ADS)

    Yang, Xiaojun; Hu, Wei; Yan, Xin; Lei, Yongping

    2015-04-01

    The eutectic point of Zn-6Al alloy is 381°C, and the peritectic reaction of Zn-Al-Sn alloy occurs at 280°C. In order to find an alloy with an appropriate melting point between 280°C and 340°C, Zn-6Al-5Sn, Zn-6Al-10Sn, Zn-6Al-15Sn, and Zn-6Al-20Sn alloys were prepared. The microstructure, melting behavior, and wettability of the Zn-6Al- xSn solder alloys were investigated by scanning electron microscopy (SEM), differential scanning calorimetry (DSC), and the sessile drop method. The results show that the alloys were composed of Zn-rich phase, Zn-Al structure, Sn-Zn-Al peritectic structure, and Sn-Zn eutectic structure. The progressive decrease of the liquidus temperature of the Zn-6Al- xSn solders was confirmed by the DSC results in the order: Zn-6Al-5Sn, Zn-6Al-10Sn, Zn-6Al-15Sn, Zn-6Al-20Sn. A decrease of the wetting angle, selected for evaluation of the solderability of the Zn-6Al- xSn solders, was observed in the same order. The cross-section of a solder joint on a Cu substrate was examined by SEM coupled with energy-dispersive x-ray (EDS) analysis.

  20. Solder Creep-Fatigue Interactions with Flexible Leaded Part

    NASA Technical Reports Server (NTRS)

    Ross, R. G., Jr.; Wen, L. C.

    1994-01-01

    In most electronic packaging applications it is not a single high stress event that breaks a component solder joint; rather it is repeated or prolonged load applications that result in fatigue or creep failure of the solder. The principal strain in solder joints is caused by differential expansion between the part and its mounting environment due to hanges in temperature (thermal cycles) and/or due to temperature gradients between the part and the board.

  1. Capillary flow solderability test for printed wiring boards

    SciTech Connect

    Hosking, F.M.; Yost, F.G.; Hernandez, C.L.; Sackinger, S.J.

    1994-04-01

    This report describes a new technique for evaluating capillary flow solderability on printed circuit boards. The test involves the flow of molten solder from a pad onto different-sized conductor lines. It simulates the spreading dynamics of either plated-through-hole (PTH) or surface mount technology (SMT) soldering. A standard procedure has been developed for the test. Preliminary experiments were conducted and the results demonstrate test feasibility. Test procedures and results are presented in this report.

  2. Study of heating capacity of focused IR light soldering systems.

    PubMed

    Anguiano, C; Félix, M; Medel, A; Bravo, M; Salazar, D; Márquez, H

    2013-10-01

    An experimental study about four optical setups used for developing a Focused IR Light Soldering System (FILSS) for Surface Mount Technology (SMT) lead-free electronic devices specifically for Ball Grid Arrays (BGA) is presented. An analysis of irradiance and infrared thermography at BGA surface is presented, as well as heat transfer by radiation and conduction process from the surface of the BGA to the solder balls. The results of this work show that the heating provided by our proposed optical setups, measured at the BGA under soldering process, meets the high temperature and uniform thermal distribution requirements, which are defined by the reflow solder method for SMT devices. PMID:24104296

  3. High temperature solder alloys for underhood applications: Final report

    SciTech Connect

    Kern, J.A.; Drewien, C.A.; Yost, F.G.; Sackinger, S.; Weiser, M.W.

    1996-06-01

    In this continued study, the microstructural evolution and peel strength as a function of thermal aging were evaluated for four Sn-Ag solders deposited on double layered Ag-Pt metallization. Additionally, activation energies for intermetallic growth over the temperature range of 134 to 190{degrees}C were obtained through thickness measurements of the Ag-Sn intermetallic that formed at the solder-metallization interface. It was found that Bi-containing solders yielded higher activation energies for the intermetallic growth, leading to thicker intermetallic layers at 175 and 190{degrees}C for times of 542 and 20.5 hrs, respectively, than the solders free of Bi. Complete reaction of the solder with the metallization occurred and lower peel strengths were measured on the Bi-containing solders. In all solder systems, a Ag-Sn intermetallic thickness of greater than {approximately}7 {mu}m contributed to lower peel strength values. The Ag-Sn binary eutectic composition and the Ag-Sn-Cu ternary eutectic composition solders yielded lower activation energies for intermetallic formation, less microstructural change with time, and higher peel strengths; these solder systems were resilient to the effects of temperatures up to 175{degrees}C. Accelerated isothermal aging studies provide useful criteria for recommendation of materials systems. The Sn-Ag and Sn-Ag-Cu eutectic compositions should be considered for future service life and reliability studies based upon their performance in this study.

  4. Solderability preservation through the use of organic inhibitors

    SciTech Connect

    Sorensen, N.R.; Hosking, F.M.

    1994-12-01

    Organic inhibitors can be used to prevent corrosion of metals and have application in the electronics industry as solderability preservatives. We have developed a model to describe the action of two inhibitors (benzotriazole and imidazole) during the environmental aging and soldering process. The inhibitors bond with the metal surface and form a barrier that prevents or retards oxidation. At soldering temperatures, the metal-organic complex breaks down leaving an oxide-free metal surface that allows excellent wetting by molten solder. The presence of the inhibitor retards the wetting rate relative to clean copper, but provides a vast improvement relative to oxidized copper.

  5. Aging, stressing and solderability of electroplated and electroless copper

    SciTech Connect

    Sorensen, N.R.; Hosking, F.M.

    1995-08-01

    Organic inhibitors can be used to prevent corrosion of metals have application in the electronics industry as solderability preservatives. We have developed a model to describe the action of two inhibitors (benzotriazole and imidazole) during the environmental aging and soldering process. The inhibitors bond with the metal surface and form a barrier that prevents or retards oxidation. At soldering temperatures, the metal-organic complex breaks down leaving an oxide-free metal surface that allows excellent wetting by the molten solder. The presence of the inhibitor retards the wetting rate relative to clean copper but provides a vast improvement relative to oxidized copper.

  6. Coarsening of the Sn-Pb Solder Microstructure in Constitutive Model-Based Predictions of Solder Joint Thermal Mechanical Fatigue

    SciTech Connect

    Vianco, P.T.; Burchett, S.N.; Neilsen, M.K.; Rejent, J.A.; Frear, D.R.

    1999-04-12

    Thermal mechanical fatigue (TMF) is an important damage mechanism for solder joints exposed to cyclic temperature environments. Predicting the service reliability of solder joints exposed to such conditions requires two knowledge bases: first, the extent of fatigue damage incurred by the solder microstructure leading up to fatigue crack initiation, must be quantified in both time and space domains. Secondly, fatigue crack initiation and growth must be predicted since this metric determines, explicitly, the loss of solder joint functionality as it pertains to its mechanical fastening as well as electrical continuity roles. This paper will describe recent progress in a research effort to establish a microstructurally-based, constitutive model that predicts TMF deformation to 63Sn-37Pb solder in electronic solder joints up to the crack initiation step. The model is implemented using a finite element setting; therefore, the effects of both global and local thermal expansion mismatch conditions in the joint that would arise from temperature cycling.

  7. Development of Level 3 (gridded) products for the Atmospheric Infrared Sounder (AIRS)

    NASA Technical Reports Server (NTRS)

    Granger, Stephanie L.; Leroy, Stephen S.; Manning, Evan M.; Fetzer, Eric J.; Oliphant, Robert B.; Braverman, Amy; Lee, Sung-Yung; Lambrigtsen, Bjom H.

    2004-01-01

    The Atmospheric Infrared Sounder (AIRS) sounding system is a suite of infrared and microwave instruments flown as part of NASA's Earth Observing System (EOS) onboard the Aqua platform. The AIRS dataset provides a daily, global view of Earth processes at a finer vertical resolution than ever before. However, analysis of the AIRS data is a daunting task given the sheer volume and complexity of the data. The volume of data produced by the EOS project is unprecedented; the AIRS project alone will produce many terabytes of data over the lifetime of the mission. This paper describes development of AIRS Level 3 data products that will help to alleviate problems of access and usability.

  8. Shaping Transistor Leads for Better Solder Joints

    NASA Technical Reports Server (NTRS)

    Mandel, H.; Dillon, J. D.

    1982-01-01

    Special lead-forming tool puts step in leads of microwave power transistors without damaging braze joints that fasten leads to package. Stepped leads are soldered to circuit boards more reliably than straight leads, and stress on brazes is relieved. Lead-forming hand-tool has two parts: a forming die and an actuator. Spring-loaded saddle is adjusted so that when transistor package is placed on it, leads rest on forming rails.

  9. Simulation of forced convection-infrared reflow soldering with nitrogen injection

    SciTech Connect

    Son, Y.S.; Bergman, T.L.; Hyun, M.T.

    1995-12-31

    In this paper, forced convection reflow soldering is simulated using an existing numerical model which accounts for multimode effects and is capable of predicting large and small scale thermal and species concentration phenomena. Soldering is performed in an oven equipped with porous panel heaters through which air or nitrogen is introduced to the reflow environment. The gas is injected selectively through top or bottom infrared heaters in order to (1) dampen gas temperature fluctuations which can be established by thermal buoyancy forces and (2) minimize nitrogen use. The results reveal the utility of general process models of the reflow operation as applied to oven design. The effects of mixed convection on heat and gas species transport in the oven are also revealed, and the potential impact on the solidification process is discussed.

  10. Effect of Metal Bond-Pad Configurations on the Solder Microstructure Development of Flip-Chip Solder Joints

    NASA Astrophysics Data System (ADS)

    Hu, Y. J.; Hsu, Y. C.; Huang, T. S.; Lu, C. T.; Wu, Albert T.; Liu, C. Y.

    2014-01-01

    Various microstructural zones were observed in the solidified solder of flip-chip solder joints with three metal bond-pad configurations (Cu/Sn/Cu, Ni/Sn/Cu, and Cu/Sn/Ni). The developed microstructures of the solidified flip-chip solder joints were strongly related to the associated metal bond pad. A hypoeutectic microstructure always developed near the Ni bond pad, and a eutectic or hypereutectic microstructure formed near the Cu pad. The effect of the metal bond pads on the solder microstructure alters the Cu solubility in the molten solder. The Cu content (solubility) in the molten Sn(Cu) solder eventually leads to the development of particular microstructures. In addition to the effect of the associated metal bond pads, the developed microstructure of the flip-chip solder joint depends on the configuration of the metal bond pads. A hypereutectic microstructure formed near the bottom Cu pad, and a eutectic microstructure formed near the top Cu pad. Directional cooling in the flip-chip solder joint during the solidification process causes the effects of the metal bond-pad configuration. Directional cooling causes the Cu content to vary in the liquid Sn(Cu) phase, resulting in the formation of distinct microstructural zones in the developed microstructure of the flip-chip solder joint.

  11. Growth Behavior of Intermetallic Compounds in Cu/Sn3.0Ag0.5Cu Solder Joints with Different Rates of Cooling

    NASA Astrophysics Data System (ADS)

    Yang, Linmei; Zhang, Z. F.

    2015-01-01

    The growth behavior of intermetallic compounds (IMC) in Cu/Sn3.0Ag0.5Cu solder joints, including the interfacial Cu6Sn5 layer and Ag3Sn, and Cu6Sn5 in the solder, were investigated when different cooling methods—quenched water, cooling in air, and cooling in a furnace after reflow—were used. For the solder joint quenched in water, no obvious Cu6Sn5 or Ag3Sn was detected in the solder, and the thickness of interfacial Cu6Sn5 layer was slightly thinner than that of the joint cooled in air. On the basis of results from scanning electron microscopy and energy-dispersive spectrometry, a mechanism is proposed for growth of IMC in Sn3.0Ag0.5Cu solder during solidification. The rate of cooling has a substantial effect on the morphology and size of Ag3Sn, which evolved into large plate-like shapes when the joint was cooled slowly in a furnace. However, the morphology of Ag3Sn was branch-like or particle-like when the joint was cooled in air. This is attributed to re-growth of Ag3Sn grains via substantial atomic diffusion during the high-temperature stage of furnace cooling.

  12. Health effects associated with Madrid air pollution levels.

    PubMed

    Doadrio, A; Monzón, A; Moragues, A; Presas, M J

    1999-09-01

    The purpose of this study was to determine the relationship between the pollution levels recorded in Madrid and the number of hospital admissions made on the grounds of respiratory disorders. PMID:10535135

  13. Source levels of northern elephant seal vocalizations in-air

    NASA Astrophysics Data System (ADS)

    Insley, Stephen J.; Southall, Brandon L.

    2005-09-01

    Accurate measurements of vocalization sound-pressure levels are necessary to determine the acoustical active space of animals in natural and human-altered ambient noise conditions. Despite this basic need, such data are limited or nonexistent for most species. Our study characterized aerial ambient noise and vocalization source levels for northern elephant seals during the breeding season. Subjects were adult males, lactating females, and dependent offspring (pups) at An~o Nuevo State Reserve. Source level measurements were made using a Type 1 sound level meter and calibrated microphones on-axis: (1) at 1 m; (2) at several known distances (laser measured); and (3) simultaneously at 1 m and a second known distance. Concurrent ambient noise conditions were measured in situ (non-weighted 5 min Leq integrated averages) and recorded for later spectral analysis. Measurements were made at two sites, one relatively noisy and the other relatively quiet, to determine whether animals compensate for higher noise conditions by increasing source levels (Lombard effect). Results indicate a wide range in signal strength, particularly for adult males whose vocalization source levels appear to be correlated with dominance rank and related to ambient noise conditions. The Lombard effect was not observed for adult females or elephant seal pups.

  14. Personal, indoor and outdoor air pollution levels among pregnant women

    NASA Astrophysics Data System (ADS)

    Schembari, Anna; Triguero-Mas, Margarita; de Nazelle, Audrey; Dadvand, Payam; Vrijheid, Martine; Cirach, Marta; Martinez, David; Figueras, Francesc; Querol, Xavier; Basagaña, Xavier; Eeftens, Marloes; Meliefste, Kees; Nieuwenhuijsen, Mark J.

    2013-01-01

    AimThe aims of this study were to investigate the relationship between pregnant women's personal exposures to NOx, NO2, PM2.5 concentration and absorbance as a marker for black carbon and their indoor and outdoor concentration levels at their residence, and also to identify predictors of personal exposure and indoor levels using questionnaire and time activity data. MethodWe recruited 54 pregnant women in Barcelona who carried a personal PM2.5 sampler for two days and NOx/NO2 passive badges for one week, while indoor and outdoor PM2.5 and NOx/NO2 levels at their residence were simultaneously measured. Time activity and house characteristics were recorded. Gravimetry determinations for PM2.5 concentration and absorbance measurements were carried out on the PM2.5 filter samples. ResultsLevels of personal exposure to NOx, PM2.5 and absorbance were slightly higher than indoor and outdoor levels (geometric mean of personal NOx = 61.9 vs indoor NOx = 60.6 μg m-3), while for NO2 the indoor levels were slightly higher than the personal ones. Generally, there was a high statistically significant correlation between personal exposure and indoor levels (Spearman's r between 0.78 and 0.84). Women spent more than 60% of their time indoors at home. Ventilation of the house by opening the windows, the time spent cooking and indicators for traffic intensity were re-occurring statistically significant determinants of the personal and indoor pollutants levels with models for NOx explaining the 55% and 60% of the variability respectively, and models for NO2 explaining the 39% and 16% of the variability respectively. Models for PM2.5 and absorbance explained the least of the variability. ConclusionOur findings improve the current understanding of the characterization and inter-associations between personal, indoor and outdoor pollution levels among pregnant women. Variability in personal and indoor NOx and to a lesser extent NO2 levels could be explained well, but not the variability

  15. Do US Ambient Air Lead Levels Have a Significant Impact on Childhood Blood Lead Levels: Results of a National Study

    PubMed Central

    Brink, LuAnn L.; Talbott, Evelyn O.; Sharma, Ravi K.; Marsh, Gary M.; Wu, Wen Chi; Rager, Judith R.; Strosnider, Heather M.

    2013-01-01

    Introduction. Although lead paint and leaded gasoline have not been used in the US for thirty years, thousands of US children continue to have blood lead levels (BLLs) of concern. Methods. We investigated the potential association of modeled air lead levels and BLLs ≥ 10 μg/dL using a large CDC database with BLLs on children aged 0–3 years. Percent of children with BLLs ≥ 10 μg/dL (2000–2007) by county and proportion of pre-50 housing and SES variables were merged with the US EPA's National Air Toxics Assessment (NATA) modeled air lead data. Results. The proportion with BLL ≥ 10 μg/dL was 1.24% in the highest air lead counties, and the proportion with BLL ≥ 10 μg/dL was 0.36% in the lowest air lead counties, resulting in a crude prevalence ratio of 3.4. Further analysis using multivariate negative binomial regression revealed that NATA lead was a significant predictor of % BLL ≥ 10 μg/dL after controlling for percent pre-l950 housing, percent rural, and percent black. A geospatial regression revealed that air lead, percent older housing, and poverty were all significant predictors of % BLL ≥ 10 μg/dL. Conclusions. More emphasis should be given to potential sources of ambient air lead near residential areas. PMID:23983719

  16. Evaluation of no-clean solder process designed to eliminate the use of ozone-depleting chemicals

    SciTech Connect

    Paffett, M.T.; Farr, J.D.; Rogers, Y.C.; Hutchinson, W.B.

    1993-10-01

    This paper summarizes the LANL contributions to a joint Motorola/SNLA/LANL cooperative research and development agreement study on the reliability of an alternative solder process that is intended to reduce or eliminate the use of ozone-depleting chemicals in the manufacture of printed wire boards (PWBs). This process is termed self-cleaning because of the nature of the thermal chemistry associated with the adipic and formic acid components used in place of traditional solder rosin fluxes. Traditional rosin fluxes used in military electronic hardware applications are cleaned (by requirement) using chlorofluorohydrocarbons. The LANL contribution centers around analytical determination of PWB cleanliness after soldering using the self-cleaning method. Results of these analytical determinations involving primarily surface analysis of boards following temperature, temperature and humidity, and long-term storage testing are described with representative data. It is concluded that the self-cleaning process leaves behind levels of solid residue that are visually and analytically observable using most of these surface analysis techniques. The materials compatibility of electronic components soldered using the self-cleaning soldering process is more fully described in the project report issued by SNLA that encompasses the complete project with statistical lifetime and accelerated aging studies. Analytical surface specificity and suggestions for further work are also given.

  17. SOSIE: A pragmatic approach to the simulation of Broad Air Defense applied to the theater level

    NASA Astrophysics Data System (ADS)

    Tanter, A.; Deas, M.

    1995-01-01

    The SOSIE concept rests on an approach consisting of using existing simulation models of various systems and subsystems and automatically integrating them with minimum modifications within a center of simulation. The defense simulation against ballistic missiles on the theater level calls upon three levels of simulation: DIAMS; TACSIT, and SPOOK. DIAMS presents a fine level system simulation of weapon ground-to-air average carry, TACSIT presents a level of site defense (base air for example), and SPOOK deals with the theater level itself. SOSIE enables users to use the same detailed simulators, developed by an originator of weapon systems or information and communications, without having to know in detail the models of the simulation. Envisioned in the future is the integration of other models of simulations relating to the air-to-air combat, in particular, the networks of command, controls and communications.

  18. Factors Affecting Parent's Perception on Air Quality-From the Individual to the Community Level.

    PubMed

    Guo, Yulin; Liu, Fengfeng; Lu, Yuanan; Mao, Zongfu; Lu, Hanson; Wu, Yanyan; Chu, Yuanyuan; Yu, Lichen; Liu, Yisi; Ren, Meng; Li, Na; Chen, Xi; Xiang, Hao

    2016-01-01

    The perception of air quality significantly affects the acceptance of the public of the government's environmental policies. The aim of this research is to explore the relationship between the perception of the air quality of parents and scientific monitoring data and to analyze the factors that affect parents' perceptions. Scientific data of air quality were obtained from Wuhan's environmental condition reports. One thousand parents were investigated for their knowledge and perception of air quality. Scientific data show that the air quality of Wuhan follows an improving trend in general, while most participants believed that the air quality of Wuhan has deteriorated, which indicates a significant difference between public perception and reality. On the individual level, respondents with an age of 40 or above (40 or above: OR = 3.252; 95% CI: 1.170-9.040), a higher educational level (college and above: OR = 7.598; 95% CI: 2.244-25.732) or children with poor healthy conditions (poor: OR = 6.864; 95% CI: 2.212-21.302) have much more negative perception of air quality. On the community level, industrial facilities, vehicles and city construction have major effects on parents' perception of air quality. Our investigation provides baseline information for environmental policy researchers and makers regarding the public's perception and expectation of air quality and the benefits to the environmental policy completing and enforcing. PMID:27187432

  19. Organophosphate Esters in Canadian Arctic Air: Occurrence, Levels and Trends.

    PubMed

    Sühring, Roxana; Diamond, Miriam L; Scheringer, Martin; Wong, Fiona; Pućko, Monika; Stern, Gary; Burt, Alexis; Hung, Hayley; Fellin, Philip; Li, Henrik; Jantunen, Liisa M

    2016-07-19

    Fourteen organophosphate esters (OPEs) were measured in the filter fraction of 117 active air samples from yearly ship-based sampling campaigns (2007-2013) and two land-based stations in the Canadian Arctic, to assess trends and long-range transport potential of OPEs. Four OPEs were detected in up to 97% of the samples, seven in 50% or less of the samples, and three were not detected. Median concentrations of ∑OPEs were 237 and 50 pg m(-3) for ship- and land-based samples, respectively. Individual median concentrations ranged from below detection to 119 pg m(-3) for ethanol, 2-chloro-, phosphate (3:1) (TCEP). High concentrations of up to 2340 pg m(-3) were observed for Tri-n-butyl phosphate (TnBP) at a land-based sampling location in Resolute Bay from 2012, whereas it was only detected in one ship-based sample at a concentration below 100 pg m(-3). Concentrations of halogenated OPEs seemed to be driven by river discharge from the Nelson and Churchill Rivers (Manitoba) and Churchill River and Lake Melville (Newfoundland and Labrador). In contrast, nonhalogenated OPE concentrations appeared to have diffuse sources or local sources close to the land-based sampling stations. Triphenyl phosphate (TPhP) showed an apparent temporal trend with a doubling-time of 11 months (p = 0.044). The results emphasize the increasing relevance of halogenated and nonhalogenated OPEs as contaminants in the Arctic. PMID:27309668

  20. 42 CFR 84.140 - Air velocity and noise levels; hoods and helmets; minimum requirements.

    Code of Federal Regulations, 2010 CFR

    2010-10-01

    ... 42 Public Health 1 2010-10-01 2010-10-01 false Air velocity and noise levels; hoods and helmets; minimum requirements. 84.140 Section 84.140 Public Health PUBLIC HEALTH SERVICE, DEPARTMENT OF HEALTH AND HUMAN SERVICES OCCUPATIONAL SAFETY AND HEALTH RESEARCH AND RELATED ACTIVITIES APPROVAL OF RESPIRATORY PROTECTIVE DEVICES Supplied-Air...

  1. Multi-Level Information Systems. AIR Forum Paper 1978.

    ERIC Educational Resources Information Center

    Jones, Leighton D.; Trautman, DeForest L.

    To support informational needs of day-to-day and long-range decision-making, many universities have developed their own data collection devices and institutional reporting systems. Often these models only represent a single point in time and do not effectively support needs at college and departmental levels. This paper identifies some of the more…

  2. Direct-soldering 6061 aluminum alloys with ultrasonic coating.

    PubMed

    Ding, Min; Zhang, Pei-lei; Zhang, Zhen-yu; Yao, Shun

    2010-02-01

    In this study, the authors applied furnace soldering with ultrasonic coating method to solder 6061 aluminum alloy and investigated the effects of both coating time and soldering temperature on its properties. The following results were obtained: firstly, the solder region mainly composed of four kinds of microstructure zones: rich Sn zone, rich-Pb zone, Sn-Pb eutectic phase and rich Al zone. Meanwhile, the microanalysis identified a continuous reaction product at the alumina-solder interface as a rich-Pb zone. Therefore, the joint strength changed with soldering time and soldering temperature. Secondly, the tensile data had significantly greater variability, with values ranging from 13.99MPa to 24.74MPa. The highest value was obtained for the samples coated with Sn-Pb-Zn alloy for 45s. Fractures occurred along the solder-alumina interface for the 6061 aluminum alloy with its surface including hybrid tough fracture of dimple and tear ridge. The interface could initially strip at the rich Bi zone with the effect of shear stress. PMID:19900830

  3. Laser-activated protein solder for peripheral nerve repair

    NASA Astrophysics Data System (ADS)

    Trickett, Rodney I.; Lauto, Antonio; Dawes, Judith M.; Owen, Earl R.

    1995-05-01

    A 100 micrometers core optical fiber-coupled 75 mW diode laser operating at a wavelength of 800 nm has been used in conjunction with a protein solder to stripe weld severed rat tibial nerves, reducing the long operating time required for microsurgical nerve repair. Welding is produced by selective laser denaturation of the albumin based solder which contains the dye indocyanine green. Operating time for laser soldering was 10 +/- 5 min. (n equals 20) compared to 23 +/- 9 min. (n equals 10) for microsuturing. The laser solder technique resulted in patent welds with a tensile strength of 15 +/- 5 g, while microsutured nerves had a tensile strength of 40 +/- 10 g. Histopathology of the laser soldered nerves, conducted immediately after surgery, displayed solder adhesion to the outer membrane with minimal damage to the inner axons of the nerves. An in vivo study is under way comparing laser solder repaired tibial nerves to conventional microsuture repair. At the time of submission 15 laser soldered nerves and 7 sutured nerves were characterized at 3 months and showed successful regeneration with compound muscle action potentials of 27 +/- 8 mV and 29 +/- 8 mW respectively. A faster, less damaging and long lasting laser based anastomotic technique is presented.

  4. Tin-silver-bismuth solders for electronics assembly

    DOEpatents

    Vianco, P.T.; Rejent, J.A.

    1995-08-08

    A lead-free solder alloy is disclosed for electronic assemblies composed of a eutectic alloy of tin and silver with a bismuth addition, x, of 0level. Melting point ranges from about 218 C down to about 205 C depending an the amount of bismuth added to the eutectic tin-silver alloy as determined by DSC analysis, 10 C/min. A preferred alloy composition is 91.84Sn-3.33Ag-4.83Bi (weight percent based on total alloy weight). 4 figs.

  5. Tin-silver-bismuth solders for electronics assembly

    DOEpatents

    Vianco, Paul T.; Rejent, Jerome A.

    1995-01-01

    A lead-free solder alloy for electronic assemblies composed of a eutectic alloy of tin and silver with a bismuth addition, x, of 0level. Melting point ranges from about 218.degree. C. down to about 205.degree. C. depending an the amount of bismuth added to the eutectic tin-silver alloy as determined by DSC analysis, 10.degree. C./min. A preferred alloy composition is 91.84Sn-3.33Ag-4.83Bi (weight percent based on total alloy weight).

  6. Cost comparison modeling between current solder sphere attachment technology and solder jetting technology

    SciTech Connect

    Davidson, R.N.

    1996-10-01

    By predicting the total life-cycle cost of owning and operating production equipment, it becomes possible for processors to make accurate and intelligent decisions regarding major capitol equipment investments as well as determining the most cost effective manufacturing processes and environments. Cost of Ownership (COO) is a decision making technique based on inputting the total costs of acquiring, operating and maintaining production equipment. All quantitative economic and production data can be modeled and processed using COO software programs such as the Cost of Ownership Luminator program TWO COOL{trademark}. This report investigated the Cost of Ownership differences between the current state-of-the-art solder ball attachment process and a prototype solder jetting process developed by Sandia National Laboratories. The prototype jetting process is a novel and unique approach to address the anticipated high rate ball grid array (BGA) production requirements currently forecasted for the next decade. The jetting process, which is both economically and environmentally attractive eliminates the solder sphere fabrication step, the solder flux application step as well as the furnace reflow and post cleaning operations.

  7. Strength of Soldered Joints Formed under Microgravity Conditions

    NASA Astrophysics Data System (ADS)

    Thomas, B.; Atkinson, A.; Dashwood, R. J.

    2007-01-01

    Experiments have been carried out to compare the mechanical strength of joints soldered with Sn-Ag-Cu under different gravitational conditions. Joints soldered under microgravity (produced during a parabolic flight) have lower strength (by 32% in this case) than similar joints formed under normal gravity. Electron microscopy has shown that this is due to a larger volume of residual porosity (14%) in the joints formed in microgravity compared with <1% for joints formed in normal gravity. The residual porosity in joints formed in microgravity is mainly within the bulk of the solder, with some microporosity in the Cu6Sn5 intermetallic layer near the copper interfaces. The porosity not only weakens the joint, but also biases the failure path away from the intermetallic layer and into the bulk of the solder. These observations show that gravitational buoyancy is important for the expulsion of flux and flux residues from soldered joints.

  8. Development of lead-free solders for hybrid microcircuits

    SciTech Connect

    Hosking, F.M.; Vianco, P.T.; Frear, D.R.; Robinson, D.G.

    1996-01-01

    Extensive work has been conducted by industry to develop lead-free solders for electronics applications. The driving force behind this effort is pressure to ban or tax the use of lead-bearing solders. There has been further interest to reduce the use of hazardous chemical cleaners. Lead-free soldering and low-residue, ``no clean`` assembly processing are being considered as solutions to these environmental issues. Most of the work has been directed toward commercial and military printed wiring board (PWB) technology, although similar problems confront the hybrid microcircuit (HMC) industry, where the development of lead-free HMC solders is generally lagging. Sandia National Laboratories is responsible for designing a variety of critical, high reliability hybrid components for radars. Sandia has consequently initiated a project, as part of its Environmentally Conscious Manufacturing program, to develop low-residue, lead-free soldering for HMCs. This paper discusses the progress of that work.

  9. Dry soldering with hot filament produced atomic hydrogen

    DOEpatents

    Panitz, Janda K. G.; Jellison, James L.; Staley, David J.

    1995-01-01

    A system for chemically transforming metal surface oxides to metal that is especially, but not exclusively, suitable for preparing metal surfaces for dry soldering and solder reflow processes. The system employs one or more hot, refractory metal filaments, grids or surfaces to thermally dissociate molecular species in a low pressure of working gas such as a hydrogen-containing gas to produce reactive species in a reactive plasma that can chemically reduce metal oxides and form volatile compounds that are removed in the working gas flow. Dry soldering and solder reflow processes are especially applicable to the manufacture of printed circuit boards, semiconductor chip lead attachment and packaging multichip modules. The system can be retrofitted onto existing metal treatment ovens, furnaces, welding systems and wave soldering system designs.

  10. Dry soldering with hot filament produced atomic hydrogen

    DOEpatents

    Panitz, J.K.G.; Jellison, J.L.; Staley, D.J.

    1995-04-25

    A system is disclosed for chemically transforming metal surface oxides to metal that is especially, but not exclusively, suitable for preparing metal surfaces for dry soldering and solder reflow processes. The system employs one or more hot, refractory metal filaments, grids or surfaces to thermally dissociate molecular species in a low pressure of working gas such as a hydrogen-containing gas to produce reactive species in a reactive plasma that can chemically reduce metal oxides and form volatile compounds that are removed in the working gas flow. Dry soldering and solder reflow processes are especially applicable to the manufacture of printed circuit boards, semiconductor chip lead attachment and packaging multichip modules. The system can be retrofitted onto existing metal treatment ovens, furnaces, welding systems and wave soldering system designs. 1 fig.

  11. A Study of Solder Alloy Ductility for Cryogenic Applications

    NASA Technical Reports Server (NTRS)

    Lupinacci, A.; Shapiro, A. A.; Suh, J-O.; Minor, A. M.

    2013-01-01

    For aerospace applications it is important to understand the mechanical performance of components at the extreme temperature conditions seen in service. For solder alloys used in microelectronics, cryogenic temperatures can prove problematic. At low temperatures Sn-based solders undergo a ductile to brittle transition that leads to brittle cracks, which can result in catastrophic failure of electronic components, assemblies and spacecraft payloads. As industrial processes begin to move away from Pb-Sn solder, it is even more critical to characterize the behavior of alternative Sn-based solders. Here we report on initial investigations using a modified Charpy test apparatus to characterize the ductile to brittle transformation temperature of nine different solder systems.

  12. Hybrid microcircuit board assembly with lead-free solders

    SciTech Connect

    Vianco, P.T.; Hernandez, C.L.; Rejent, J.A.

    2000-01-11

    An assessment was made of the manufacturability of hybrid microcircuit test vehicles assembled using three Pb-free solder compositions 96.5Sn--3.5Ag (wt.%), 91.84Sn--3.33Ag--4.83Bi, and 86.85Sn--3.15Ag--5.0Bi--5.0Au. The test vehicle substrate was 96% alumina; the thick film conductor composition was 76Au--21Pt--3Pd. Excellent registration between the LCCC or chip capacitor packages and the thick film solder pads was observed. Reduced wetting of bare (Au-coated) LCCC castellations was eliminated by hot solder dipping the I/Os prior to assembly of the circuit card. The Pb-free solders were slightly more susceptible to void formation, but not to a degree that would significantly impact joint functionality. Microstructural damage, while noted in the Sn-Pb solder joints, was not observed in the Pb-free interconnects.

  13. The influence of microstructure on the mechanical properties of solder

    SciTech Connect

    Morris, J.W. Jr.; Reynolds, H.L.

    1996-06-01

    Solder joints in microelectronics devices consist of low-melting solder compositions that wet and join metal contacts and are, ordinarily, used at high homologous temperatures in the as-solidified condition. Differences in solidification rate and substrate interactions have the consequence that even solder joints of similar compositions exhibit a wide range of microstructures. The variation in microstructure causes a variation in properties; in particular, the high-temperature creep properties that govern much of the mechanical behavior of the solder may differ significantly from joint to joint. The present paper reviews the varieties of microstructure that are found in common solder joints, and describes some of the ways in which microstructural changes affect mechanical properties and joint reliability.

  14. Drop Reliability of Epoxy-contained Sn-58 wt.%Bi Solder Joint with ENIG and ENEPIG Surface Finish Under Temperature and Humidity Test

    NASA Astrophysics Data System (ADS)

    Myung, Woo-Ram; Kim, Yongil; Kim, Kyung-Yeol; Jung, Seung-Boo

    2016-04-01

    The influence of two kinds of surface finish, namely electroless nickel immersion gold (ENIG) and electroless nickel electroless palladium immersion gold (ENEPIG), on the interfacial reactions and drop reliability of epoxy-enhanced Sn-58 wt.%Bi solder has been investigated after temperature-humidity storage tests. The chemical composition and morphology of intermetallic compounds (IMCs) were characterized by scanning electron microscopy, energy-dispersive x-ray spectroscopy, and electron probe microanalysis. Also, the mechanical reliability of solder joints was evaluated using board-level drop tests. The Sn-Bi epoxy solder/ENEPIG joint exhibited higher IMC growth rate than the Sn-Bi epoxy solder/ENIG joint. After 500 h at 85°C/85% RH storage condition, new IMCs were formed on the Ni3Sn4 layer in samples with both surface finishes. The results of board-level drop tests showed that the number of drops was higher for the ENIG than the ENEPIG surface finish. Solder joint fracture occurred along the interface between the solder and IMC layer for the ENIG surface finish. However, with the ENEPIG surface finish, the crack propagated between the IMCs.

  15. Drop Reliability of Epoxy-contained Sn-58 wt.%Bi Solder Joint with ENIG and ENEPIG Surface Finish Under Temperature and Humidity Test

    NASA Astrophysics Data System (ADS)

    Myung, Woo-Ram; Kim, Yongil; Kim, Kyung-Yeol; Jung, Seung-Boo

    2016-07-01

    The influence of two kinds of surface finish, namely electroless nickel immersion gold (ENIG) and electroless nickel electroless palladium immersion gold (ENEPIG), on the interfacial reactions and drop reliability of epoxy-enhanced Sn-58 wt.%Bi solder has been investigated after temperature-humidity storage tests. The chemical composition and morphology of intermetallic compounds (IMCs) were characterized by scanning electron microscopy, energy-dispersive x-ray spectroscopy, and electron probe microanalysis. Also, the mechanical reliability of solder joints was evaluated using board-level drop tests. The Sn-Bi epoxy solder/ENEPIG joint exhibited higher IMC growth rate than the Sn-Bi epoxy solder/ENIG joint. After 500 h at 85°C/85% RH storage condition, new IMCs were formed on the Ni3Sn4 layer in samples with both surface finishes. The results of board-level drop tests showed that the number of drops was higher for the ENIG than the ENEPIG surface finish. Solder joint fracture occurred along the interface between the solder and IMC layer for the ENIG surface finish. However, with the ENEPIG surface finish, the crack propagated between the IMCs.

  16. Stress and physiological, behavioral and performance patterns of children under varied air ion levels

    NASA Astrophysics Data System (ADS)

    Fornof, K. T.; Gilbert, G. O.

    1988-12-01

    The possibility that individual differences in reactivity to stressors are a major factor underlying discordant results reported for air ion studies prompted an investigation of response patterns in school children under both normal indoor air ion levels and moderately increased negative air ion levels (4000±500/cm3). It was hypothesized that the impact of stressors is reduced with high negative air ionization, and that resultant changes in stress effects would be differentially exhibited according to the children's normal degree of stimulus reactivity. A counter-balanced, replicative, withinssubject design was selected, and the subjects were 12 environmentally sensitive, 1st 4th grade school children. In addition to monitoring stress effects on activity level, attention span, concentration to task and conceptual performance, measures were also made of urinary 5-hydroxyindole acetic acid levels and skin resistance response (SRR) to determine if changes extended to the physiological state. The cold water test was used to add physical stress and enable calculations of Lacey's autonomic lability scores (ALS) as indicators of individual reactivity. The results show main effects for air ions on both physiological parameters, with 48% less change in %SRR ( P<0.01) and 46% less change in urinary 5-HIAA levels ( P<0.055) during negative air ions, indicating increased stress tolerance. Strong interactive effects for ALS x air ion condition appeared, with high and low ALS children reacting oppositely to negative air ions in measures of skin resistance level ( P<0.01), wrist activity ( P<0.01) and digit span backwards ( P<0.004). Thus individual differences in autonomic reactivity and the presence or absence of stressors appear as critical elements for internal validity, and in preventing consequent skewed results from obscuring progress in air ion research.

  17. Laser beam soldering of fine-pitch technology packages with solid solder deposits

    NASA Astrophysics Data System (ADS)

    Pucher, Hans-Joerg; Glasmacher, Mathias; Geiger, Manfred

    1996-04-01

    Micro electronics is a key technology attracting the attention of information, communication, automation and data processing technologies. Ongoing miniaturization combined with an increasing number of I/Os has inevitably lead to ever finer lead geometries. Therefore the demands put upon the surface mount technology are increasing continuously. Processing of high lead count fine pitch packages, for example those which are applied in high-capacity computers, has not increased the demands put upon the assembly process only, but also on the connecting techniques. By reflow soldering with laser beam radiation the benefits from the tool `laser beam' are used extensively, for example contact and force free processing, strictly localized heating and the good controllability thereof, formation of fine crystalline and homogeneous structures, etc. Within the scope of this paper the fundamentals of laser beam soldering are discussed for fine pitch lead frames (pitch 300 micrometers ) for plastic packages, made by a modified CuFe2P alloy with a 5 micrometers Sn90Pb plating, on solid solder depths (Sn63Pb) performed by the so called High-Pad process. These investigations are unique in the field of laser beam soldering and are carried out by means of a Nd:YAG-laser. A pyrometer is used for detection of the emission of the temperature radiation of the joining area for process control. The additional use of a high-speed camera gives a detailed description of the melting and wetting process. The influence of laser beam parameters and the volume of the solid solder deposits on the joining result are presented.

  18. Printability Optimization For Fine Pitch Solder Bonding

    SciTech Connect

    Kwon, Sang-Hyun; Lee, Chang-Woo; Yoo, Sehoon

    2011-01-17

    Effect of metal mask and pad design on solder printability was evaluated by DOE in this study. The process parameters were stencil thickness, squeegee angle, squeegee speed, mask separating speed, and pad angle of PCB. The main process parameters for printability were stencil thickness and squeegee angle. The response surface showed that maximum printability of 1005 chip was achieved at the stencil thickness of 0.12 mm while the maximum printability of 0603 and 0402 chip was obtained at the stencil thickness of 0.05 mm. The bonding strength of the MLCC chips was also directly related with the printability.

  19. Political Factors Affecting the Enactment of State-Level Clean Indoor Air Laws

    PubMed Central

    Vernick, Jon S.; Stuart, Elizabeth A.; Webster, Daniel W.

    2014-01-01

    Objectives. We examined the effects of key political institutional factors on the advancement of state-level clean indoor air laws. Methods. We performed an observational study of state-level clean indoor air law enactment among all 50 US states from 1993 to 2010 by using extended Cox hazard models to assess risk of enacting a relevant law. Results. During the 18-year period from 1993 to 2010, 28 states passed a law covering workplaces, 33 states passed a law covering restaurants, 29 states passed a law covering bars, and 16 states passed a law covering gaming facilities. States with term limits had a 2.15 times greater hazard (95% confidence interval [CI] = 1.27, 3.65; P = .005) of enacting clean indoor air laws. The presence of state-level preemption of local clean indoor air laws was associated with a 3.26 times greater hazard (95% CI = 1.11, 9.53; P = .031) of state-level policy enactment. In the presence of preemption, increased legislative professionalism was strongly associated (hazard ratio = 3.28; 95% CI = 1.10, 9.75; P = .033) with clean indoor air law enactment. Conclusions. Political institutional factors do influence state-level clean indoor air law enactment and may be relevant to other public health policy areas. PMID:24825239

  20. Soldering in a Reduced Gravity Environment (SoRGE)

    NASA Technical Reports Server (NTRS)

    Easton, John W.; Struk, Peter M.

    2012-01-01

    Future long-duration human exploration missions will be challenged by constraints on mass and volume allocations available for spare parts. Addressing this challenge will be critical to the success of these missions. As a result, it is necessary to consider new approaches to spacecraft maintenance and repair that reduce the need for large replacement components. Currently, crew members on the International Space Station (ISS) recover from faults by removing and replacing, using backup systems, or living without the function of Orbital Replacement Units (ORUs). These ORUs are returned to a depot where the root cause of the failure is determined and the ORU is repaired. The crew has some limited repair capability with the Modulation/DeModulation (MDM) ORU, where circuit cards are removed and replace in faulty units. The next step to reducing the size of the items being replaced would be to implement component-level repair. This mode of repair has been implemented by the U.S. Navy in an operational environment and is now part of their standard approach for maintenance. It is appropriate to consider whether this approach can be adapted for future spaceflight operations. To this end, the Soldering in a Reduced Gravity Environment (SoRGE) experiment studied the effect of gravity on the formation of solder joints on electronic circuit boards. This document describes the SoRGE experiment, the analysis methods, and results to date. This document will also contain comments from the crew regarding their experience conducting the SoRGE experiment as well as recommendations for future improvements. Finally, this document will discuss the plans for the SoRGE samples which remain on ISS.

  1. Monitoring strategy to assessment the air pollution level in Salamanca (México)

    NASA Astrophysics Data System (ADS)

    Barrón-Adame, J. M.; Cortina-Januchs, M. G.; Andina, D.; Vega-Corona, A.

    2009-04-01

    Air pollution affects not only the quality of life and the health of the urban population but also forests and agriculture. Agricultural crops can be injured when exposed to high concentrations of various air pollutants. Air pollutants can generally be classed as either local or widespread. Local pollutants are those emitted from a specific stationary source and result in a well-defined zone of vegetation injury or contamination. Most common among the local pollutants are sulphur dioxide, fluorides, ammonia and particulate matter. The paper presents an air monitoring strategy based on data fusion and Artificial Neural Networks. The main objective is to classify automatically the air pollution level as a proposal to assessment the air pollution level affecting the agriculture in Salamanca (Mexico). Salamanca is catalogued as one of the most polluted cities in Mexico. Pollutant concentrations and meteorological variables have been consider in data fusion process in order to build a Representative Pollution Vector (RPV). Meteorological variables (Wind Direction and Wind Speed) are taken as a decision factor in the air pollutant concentration level. RPV is used to train an Artificial Neural Network in order to classify new pollutant events. In the experiments, real time series gathered from the Automatic Environmental Monitoring Network (AEMN) in Salamanca have been used.

  2. Interconnection of thermal parameters, microstructure and mechanical properties in directionally solidified Sn–Sb lead-free solder alloys

    SciTech Connect

    Dias, Marcelino; Costa, Thiago; Rocha, Otávio; Spinelli, José E.; Cheung, Noé; Garcia, Amauri

    2015-08-15

    Considerable effort is being made to develop lead-free solders for assembling in environmental-conscious electronics, due to the inherent toxicity of Pb. The search for substitute alloys of Pb–Sn solders has increased in order to comply with different soldering purposes. The solder must not only meet the expected levels of electrical performance but may also have appropriate mechanical strength, with the absence of cracks in the solder joints. The Sn–Sb alloy system has a range of compositions that can be potentially included in the class of high temperature solders. This study aims to establish interrelations of solidification thermal parameters, microstructure and mechanical properties of Sn–Sb alloys (2 wt.%Sb and 5.5 wt.%Sb) samples, which were directionally solidified under cooling rates similar to those of reflow procedures in industrial practice. A complete high-cooling rate cellular growth is shown to be associated with the Sn–2.0 wt.%Sb alloy and a reverse dendrite-to-cell transition is observed for the Sn–5.5 wt.%Sb alloy. Strength and ductility of the Sn–2.0 wt.%Sb alloy are shown not to be affected by the cellular spacing. On the other hand, a considerable variation in these properties is associated with the cellular region of the Sn–5.5 wt.%Sb alloy casting. - Graphical abstract: Display Omitted - Highlights: • The microstructure of the Sn–2 wt.%Sb alloy is characterized by high-cooling rates cells. • Reverse dendrite > cell transition occurs for Sn–5.5 wt.%Sb alloy: cells prevail for cooling rates > 1.2 K/s. • Sn–5.5 wt.%Sb alloy: the dendritic region occurs for cooling rates < 0.9 K/s. • Sn–5.5 wt.%Sb alloy: tensile properties are improved with decreasing cellular spacing.

  3. Laser forward transfer of solder paste for microelectronics fabrication

    NASA Astrophysics Data System (ADS)

    Mathews, Scott A.; Charipar, Nicholas A.; Auyeung, Ray C.; Kim, Heungsoo; Piqué, Alberto

    2015-03-01

    The progressive miniaturization of electronic devices requires an ever-increasing density of interconnects attached via solder joints. As a consequence, the overall size and spacing (or pitch) of these solder joint interconnects keeps shrinking. When the pitch between interconnects decreases below 200 μm, current technologies, such as stencil printing, find themselves reaching their resolution limit. Laser direct-write (LDW) techniques based on laser-induced forward transfer (LIFT) of functional materials offer unique advantages and capabilities for the printing of solder pastes. At NRL, we have demonstrated the successful transfer, patterning, and subsequent reflow of commercial Pb-free solder pastes using LIFT. Transfers were achieved both with the donor substrate in contact with the receiving substrate and across a 25 μm gap, such that the donor substrate does not make contact with the receiving substrate. We demonstrate the transfer of solder paste features down to 25 μm in diameter and as large as a few hundred microns, although neither represents the ultimate limit of the LIFT process in terms of spatial dimensions. Solder paste was transferred onto circular copper pads as small as 30 μm and subsequently reflowed, in order to demonstrate that the solder and flux were not adversely affected by the LIFT process.

  4. Environmentally compatible solder materials for thick film hybrid assemblies

    SciTech Connect

    Hosking, F.M.; Vianco, P.T.; Rejent, J.A.; Hernandez, C.L.

    1997-02-01

    New soldering materials and processes have been developed over the last several years to address a variety of environmental issues. One of the primary efforts by the electronics industry has involved the development of alternative solders to replace the traditional lead-containing alloys. Sandia National Laboratories is developing such alternative solder materials for printed circuit board and hybrid microcircuit (HMC) applications. This paper describes the work associated with low residue, lead-free soldering of thick film HMC`s. The response of the different materials to wetting, aging, and mechanical test conditions was investigated. Hybrid test vehicles were designed and fabricated with a variety of chip capacitors and leadless ceramic chip carriers to conduct thermal, electrical continuity, and mechanical evaluations of prototype joints. Microstructural development along the solder and thick film interface, after isothermal solid state aging over a range of elevated temperatures and times, was quantified using microanalytical techniques. Flux residues on soldered samples were stressed (temperature-humidity aged) to identify potential corrosion problems. Mechanical tests also supported the development of a solder joint lifetime prediction model. Progress of this effort is summarized.

  5. Fatigue and thermal fatigue of Pb-Sn solder joints

    SciTech Connect

    Frear, D.; Grivas, D.; McCormack, M.; Tribula, D.; Morris, J.W. Jr.

    1987-01-01

    This paper presents a fundamental investigation of the fatigue and thermal fatigue characteristics, with an emphasis on the microstructural development during fatigue, of Sn-Pb solder joints. Fatigue tests were performed in simple shear on both 60Sn-40Pb and 5Sn-95Pb solder joints. Isothermal fatigue tests show increasing fatigue life of 60Sn-40Pb solder joints with decreasing strain and temperature. In contrast, such behavior was not observed in the isothermal fatigue of 5Sn-95Pb solder joints. Thermal fatigue results on 60Sn-40Pb solder cycled between -55/sup 0/C and 125/sup 0/C show that a coarsened region develops in the center of the joint. Both Pb-rich and Sn-rich phases coarsen, and cracks form within these coarsened regions. The failure mode 60Sn-40Pb solder joints in thermal and isothermal fatigue is similar: cracks form intergranularly through the Sn-rich phase or along Sn/Pb interphase boundaries. Extensive cracking is found throughout the 5Sn-95Pb joint for both thermal and isothermal fatigue. In thermal fatigue the 5Sn-95Pb solder joints failed after fewer cycles than 60Sn-40Pb.

  6. Microbial counts and particulate matter levels in roadside air samples under skytrain stations, Bangkok, Thailand.

    PubMed

    Luksamijarulkul, Pipat; Kongtip, Pornpimol

    2010-05-01

    In conditions with heavy traffic and crowds of people on roadside areas under skytrain stations in Bangkok, the natural air ventilation may be insufficient and air quality may be poor. A study of 350 air samples collected from the roadside, under skytrain stations in Bangkok, was carried out to assess microbial counts (210 air samples) and particulate matter (PM10) levels (140 samples). The results reveal the mean +/- standard deviation bacterial counts and fungal counts were 406.8 +/- 302.7 cfu/m3 and 128.9 +/- 89.7 cfu/m3, respectively. The PM10 level was 186.1 +/- 188.1 microg/m3. When compared to recommended levels, 4.8% of air samples (10/210 samples) had bacterial counts more than recommended levels (> 1,000 cfu/ m3) and 27.1% (38/140 samples) had PM10 levels more than recommended levels (> 120 microg/m3). These may affect human health, especially of street venders who spend most of their working time in these areas. PMID:20578558

  7. BOREAS AFM-5 Level-2 Upper Air Network Standard Pressure Level Data

    NASA Technical Reports Server (NTRS)

    Barr, Alan; Hrynkiw, Charmaine; Hall, Forrest G. (Editor); Newcomer, Jeffrey A. (Editor); Smith, David E. (Technical Monitor)

    2000-01-01

    The BOREAS AFM-5 team collected and processed data from the numerous radiosonde flights during the project. The goals of the AFM-05 team were to provide large-scale definition of the atmosphere by supplementing the existing AES aerological network, both temporally and spatially. This data set includes basic upper-air parameters interpolated at 0.5 kiloPascal increments of atmospheric pressure from data collected from the network of upper-air stations during the 1993, 1994, and 1996 field campaigns over the entire study region. The data are contained in tabular ASCII files. The data files are available on a CD-ROM (see document number 20010000884) or from the Oak Ridge National Laboratory (ORNL) Distributed Active Archive Center (DAAC).

  8. Teaching minority middle-school students to solder

    NASA Astrophysics Data System (ADS)

    Reardon, James; Gates, Billy J., Jr.

    2014-03-01

    We aspired to teach minority middle school students to solder. We found that important variables affecting our ability to do so included: student-to-teacher ratio, venue of instruction, relationships with community partners, and understanding of the structure of the student's worldview. Once the effects of these variables had been understood, we found the students readily learned to solder. We now want to see whether the acquisition of the skill of soldering leads the students to be more interested in technical careers and in going to college. Supported by an APS Outreach Mini-grant.

  9. Inconsistencies in the Understanding of Solder Joint Reliability Physics

    NASA Technical Reports Server (NTRS)

    Wen, L.; Mon, G. R.; Ross, R. G., Jr.

    1997-01-01

    Over the years, many analytical and experimental research studies have aimed to improve the state-of-the-art assessment of solder joint integrity from a physics-of-failure perspective. Although much progress has been made, there still exist many inconsistent and even contradictory correlations and conclusions. Before discussing some of the prominent inconsistencies found in the literature, this paper reviews the fundamental physics underlying the nature of solder failure...Using the complex constitutive properties of solder, fundamental mechanical and thermomechanical proccesses can be modeled to demonstrate some of the inconsistencies in the literature.

  10. Solder technology in the manufacturing of electronic products

    SciTech Connect

    Vianco, P.T.

    1993-08-01

    The electronics industry has relied heavily upon the use of soldering for both package construction and circuit assembly. The solder attachment of devices onto printed circuit boards and ceramic microcircuits has supported the high volume manufacturing processes responsible for low cost, high quality consumer products and military hardware. Defects incurred during the manufacturing process are minimized by the proper selection of solder alloys, substrate materials and process parameters. Prototyping efforts are then used to evaluate the manufacturability of the chosen material systems. Once manufacturing feasibility has been established, service reliability of the final product is evaluated through accelerated testing procedures.

  11. Level 1B products from the Atmospheric Infrared Sounder (AIRS) on the EOS Aqua Spacecraft

    NASA Technical Reports Server (NTRS)

    Pagano, Thomas S.; Aumann, H. H.; Overoye, Ken

    2003-01-01

    The Atmospheric Infrared Sounder (AIRS) was launched May 4, 2002 on the EOS Aqua Spacecraft. A discussion is given of the objectives of the AIRS experiment, including requirements on the data products. We summarize the instrument characteristics, including sensitivity, noise, and spectral response, and preflight calibration results leading to the estimate of the calibration accuracy. The Level 1B calibration algorithm is presented as well as the results of in-flight stability and sensitivity measurements.

  12. Search for tachyons associated with extensive air showers in the ground level cosmic radiation

    NASA Technical Reports Server (NTRS)

    Masjed, H. F.; Ashton, F.

    1985-01-01

    Events detected in a shielded plastic scintillation counter occurring in the 26 microsec preceding the arrival of an extensive air shower at ground level with local electron density or = 20 m to the -2 power and the 240 microsec after its arrival have been studied. No significant excess of events (tachyons) arriving in the early time domain have been observed in a sample of 11,585 air shower triggers.

  13. Damage Produced in Solder Alloys during Thermal Cycling

    NASA Astrophysics Data System (ADS)

    Liu, X. W.; Plumbridge, W. J.

    2007-09-01

    The anisotropy of tin is associated with significant variations in its coefficient of thermal expansion and elastic modulus, with crystallographic direction. Under pure thermal cycling (with no externally applied stress or strain), substantial strains, in excess of 100%, may develop locally, and for very small structures, such as soldered interconnections comprising a few grains, structural integrity may be adversely affected. To examine this possibility, freestanding samples of tin, Sn-3.5wt.%Ag, Sn-0.5wt.%Cu, and Sn-3.8wt.%Ag-0.7wt.%Cu, have been subjected to thermal cycling. Temperature cycles from 30°C to 125°C or from -40°C to 55°C initially caused surface cracking, with openings up to several tens of microns after 3,000 cycles. Subsequently, the surface cracks grew into the interior of the specimens, with the maximum penetration ranging from a few microns after 100 cycles to more than 200 μm after 3,000 cycles. The cracks initiated from damage accumulated along grain boundaries. For the same temperature range, less damage resulted after the lower maximum (or mean) temperature cycle, and there appears to be a thermally activated component of cracking. The microstructure produced by rapid cooling (water quenching) was slightly more resistant than that formed by air, or furnace, cooling. Apart from microstructural coarsening, no damage accrues from isothermal exposure alone.

  14. GSOD Based Daily Global Mean Surface Temperature and Mean Sea Level Air Pressure (1982-2011)

    SciTech Connect

    Xuan Shi, Dali Wang

    2014-05-05

    This data product contains all the gridded data set at 1/4 degree resolution in ASCII format. Both mean temperature and mean sea level air pressure data are available. It also contains the GSOD data (1982-2011) from NOAA site, contains station number, location, temperature and pressures (sea level and station level). The data package also contains information related to the data processing methods

  15. Study of indoor radon levels in high-rise air-conditioned office buildings.

    PubMed

    Chao, C Y

    1999-12-01

    A series of measurements were conducted to study the indoor radon pollution in air-conditioned high-rise office buildings. Continuous monitoring of indoor radon levels in nine air-conditioned premises located in six office buildings in Hong Kong was conducted from August 1996 to February 1998. Each of the tests lasted for at least 48 hours. The measurement covered both day time monitoring while the air-conditioning was on and night time monitoring while the air-conditioning was off. The indoor radon level followed inversely the operation pattern of the mechanical ventilation systems in the buildings. During office hours when the mechanical ventilation was on, the indoor radon level decayed and after the mechanical ventilation was off during non-office hours, the radon level increased. The average indoor radon level during office hours on the nine premises varied from 87 Bq/m3 to 296 Bq/m3, and the indoor averaged radon levels over both day time and night time periods without mechanical ventilation were about 25 percent higher. The air infiltration rate and the radon emission characteristics from the building materials were estimated from the radon build-up curves which were observed after the mechanical ventilation was off. The radon decay curve observed after the mechanical ventilation system was turned on was used to calculate the total fresh air intake rate. Average radon emanation rates of the building materials in the six buildings varied from 0.0019 to 0.0033 Bq/m2s. It has been found that building infiltration rate accounted for about 10-30 percent of the total building ventilation rate in the buildings depending on building tightness. PMID:10633952

  16. Precision dispensing of small volumes of albumin solder for laser-assisted wound closure

    NASA Astrophysics Data System (ADS)

    Sorg, Brian S.; McNally-Heintzelman, Karen M.; Chan, Eric K.; Frederickson, Christopher J.; Welch, Ashley J.

    1999-06-01

    Recent laser-tissue soldering work in our lab has demonstrated the feasibility of building a solder bond from individually coagulated small droplets using a precision pipette for the deposition of the solder droplets. This method of using small, precise volumes of solder to build a bond may result in stronger and more reproducible bonds than coagulating an equivalent large volume of solder all at once. We have investigated the technique further in this study. The solder was dispensed onto the intimal side of a bovine aorta substrate and irradiated with an 808nm diode laser. A bond was created across an incision in the tissue substrate by alternately dispensing and coagulating each small volume of solder, or by coagulating a single large equivalent volume. Acute strength analysis was performed on the solder bond. Future work will concentrate on testing a bench-top solder dispensing device and investigating the feasibility of turning the deice into a prototype tool for clinical applications.

  17. Determination of radionuclide concentrations in ground level air using the ASS-500 high volume sampler

    SciTech Connect

    Frenzel, E.; Arnold, D.; Wershofen, H.

    1996-06-01

    A method for determination of radionuclide concentrations in air aerosol samples collected by the high volume aerosol sampler ASS-500 was elaborated. The aerosol sampling station ASS-500 is a Stand alone, all-weather proofed instrument. It is designed for representative sampling of airborne radionuclides from ground level air at a height of about 1.5 m above ground level. The ASS-500 station enables continuous air monitoring both normal and emergency Situations. The collection of aerosols on the Petrianov FPP-15-1.5 type filter out of an air volume of about 100,000 m{sup 3} (sampling period 1 wk) or of about 250,000 m{sup 3} (sampling period 3 wk) admits accurate spectrometric low level measurements of natural and artificial radionuclides. The achieved detection limit is 0.5 {mu}Bq m{sup -3} and 0.2 {mu}Bq m{sup -3} for {sup 137}Cs, respectively. A new developed air flow Meter system allows to enhance the collected air volume to about 150,000 m{sup 3} per week and lowers the detection limit to <0.4 {mu}Bq m{sup -3} for {sup 137}Cs for weekly collected aerosol samples. In Poland the CLOR uses 9 Stations ASS-500 at different sites as atmospheric radioactivity control system. On the basis of spectrometric measurements of natural and artificial radionuclides in the collected aerosol samples at the different sites, CLOR establishes a weekly report about the radiological situation at Poland for responsible authorities. The very low achievable detection limit of the Station ASS-500 due 10 the high air flow fate and the long possible sampling period were the key argument for other government radiation protection authorities in Europe to introduce the Station ASS-500 into their low level radionuclide atmospheric monitoring programs (Austria, Belarus, France, Germany, Iceland, Spain, Switzerland, Ukraine).

  18. Development of a soft-soldering system for aluminum

    NASA Astrophysics Data System (ADS)

    Falke, W. L.; Lee, A. Y.; Neumeier, L. A.

    1983-03-01

    The method employs application of a thin nickel copper alloy coating to the substrate, which enables the tin lead solders to wet readily and spread over the areas to be joined. The aluminum substrate is mechanically or chemically cleaned to facilitate bonding to a minute layer of zinc that is subsequently applied, with an electroless zincate solution. The nickel copper alloy (30 to 70 pct Ni) coating is then applied electrolytically over the zinc, using immersion cell or brush coating techniques. Development of acetate electrolytes has permitted deposition of the proper alloys coatings. The coated areas can then be readily joined with conventional tin lead solders and fluxs. The joints so formed are ductile, strong, and relatively corrosion resistant, and exhibit strengths equivalent to those formed on copper and brass when the same solders and fluxes are used. The method has also been employed to soft solder magnesium alloys.

  19. Robotic 3D vision solder joint verification system evaluation

    SciTech Connect

    Trent, M.A.

    1992-02-01

    A comparative performance evaluation was conducted between a proprietary inspection system using intelligent 3D vision and manual visual inspection of solder joints. The purpose was to assess the compatibility and correlation of the automated system with current visual inspection criteria. The results indicated that the automated system was more accurate (> 90%) than visual inspection (60--70%) in locating and/or categorizing solder joint defects. In addition, the automated system can offer significant capabilities to characterize and monitor a soldering process by measuring physical attributes, such as solder joint volumes and wetting angles, which are not available through manual visual inspection. A more in-depth evaluation of this technology is recommended.

  20. High temperature solder alloys for underhood applications. Progress report

    SciTech Connect

    Drewien, C.A.; Yost, F.G.; Sackinger, S.; Kern, J.; Weiser, M.W.

    1995-02-01

    Under a cooperative research and development agreement with General Motors Corporation, lead-free solder systems including the flux, metallization, and solder are being developed for high temperature, underhood applications. Six tin-rich solders, five silver-rich metallizations, and four fluxes were screened using an experimental matrix whereby every combination was used to make sessile drops via hot plate or Heller oven processing. The contact angle, sessile drop appearance, and in some instances the microstructure was evaluated to determine combinations that would yield contact angles of less than 30{degrees}, well-formed sessile drops, and fine, uniform microstructures. Four solders, one metallization, and one flux were selected and will be used for further aging and mechanical property studies.

  1. Conductance Degradation in HTS Coated Conductor Solder Joints

    NASA Astrophysics Data System (ADS)

    Canavan, Edgar R.; Leidecker, Henning; Panashchenko, Lyudmyla

    2015-12-01

    Solder joints between YBCO coated conductors and normal metal traces have been analysed as part of an effort to develop a robust HTS lead assembly for a spaceflight mission. Measurements included critical current and current transfer profiles. X-ray micrographs were used to verify proper solder flow and to determine the extent of voiding. SEM of cross-sections with EDS analysis was crucial in understanding the diffusion of the protective silver layer over the YBCO into the solder for different solder processes. The assembly must be stored for an extended period of time prior to final cool-down and operation. Measurements of the joint resistance over the course of months show a significant increase with time. Understanding the interface condition suggests an explanation for the change.

  2. Solder fatigue reduction in point focus photovoltaic concentrator modules

    SciTech Connect

    Hund, T.D.; Burchett, S.N.

    1991-01-01

    Solder fatigue tests have been conducted on point focus photovoltaic concentration cell assemblies to identify a baseline fatigue life and to quantify the fatigue life improvements that result using a copper-molybdenum-copper low-expansion insert between the solar cell and copper heat spreader. Solder microstructural changes and fatigue crack growth were identified using cross sections and ultrasonic scans of the fatigue solder joints. The Coffin-Manson and Total Strain fatigue models for low-cycle fatigue were evaluated for use in fatigue life predictions. Since both of these models require strain calculations, two strain calculation methods were compared: hand-calculated shear strain and a finite element method shear strain. At present, the available theoretical models for low-cycle solder fatigue are limited in their ability to predict failure; consequently, extensive thermal cycling is continuing to define the fatigue life for point focus photovoltaic cell assemblies. 9 refs., 9 figs., 2 tabs.

  3. Substrate solder barriers for semiconductor epilayer growth

    DOEpatents

    Drummond, T.J.; Ginley, D.S.; Zipperian, T.E.

    1987-10-23

    During the growth of compound semiconductors by epitaxial processes, substrates are typically mounted to a support. In molecular beam epitaxy, mounting is done using indium as a solder. This method has two drawbacks: the indium reacts with the substrate, and it is difficult to uniformly wet the back of a large diameter substrate. Both of these problems have been successfully overcome by sputter coating the back of the substrate with a thin layer of tungsten carbide or tungsten carbide and gold. In addition to being compatible with the growth of high quality semiconductor epilayers this coating is also inert in all standard substate cleaning etchants used for compound semiconductors, and provides uniform distribution of energy in radiant heating. 1 tab.

  4. Substrate solder barriers for semiconductor epilayer growth

    DOEpatents

    Drummond, T.J.; Ginley, D.S.; Zipperian, T.E.

    1989-05-09

    During the growth of compound semiconductors by epitaxial processes, substrates are typically mounted to a support. In modular beam epitaxy, mounting is done using indium as a solder. This method has two drawbacks: the indium reacts with the substrate, and it is difficult to uniformly wet the back of a large diameter substrate. Both of these problems have been successfully overcome by sputter coating the back of the substrate with a thin layer of tungsten carbide or tungsten carbide and gold. In addition to being compatible with the growth of high quality semiconductor epilayers this coating is also inert in all standard substrate cleaning etchants used for compound semiconductors, and provides uniform distribution of energy in radiant heating.

  5. Substrate solder barriers for semiconductor epilayer growth

    DOEpatents

    Drummond, Timothy J.; Ginley, David S.; Zipperian, Thomas E.

    1989-01-01

    During the growth of compound semiconductors by epitaxial processes, substrates are typically mounted to a support. In modular beam epitaxy, mounting is done using indium as a solder. This method has two drawbacks: the indium reacts with the substrate, and it is difficult to uniformly wet the back of a large diameter substrate. Both of these problems have been successfully overcome by sputter coating the back of the substrate with a thin layer of tungsten carbide or tungsten carbide and gold. In addition to being compatible with the growth of high quality semiconductor epilayers this coating is also inert in all standard substrate cleaning etchants used for compound semiconductors, and provides uniform distribution of energy in radiant heating.

  6. Coplanarity inspection of BGA solder balls based on laser interference structure light

    NASA Astrophysics Data System (ADS)

    Wei, Zhe; Xiao, Zexin; Zhang, Xuefei; Zhou, Haiying

    2011-11-01

    Using laser interference structure light for profilometry is a rapid, non-contact, full-field profile and high accuracy measuring method.And it has been a promising technique in complicated geometrical shape measurement. In this paper, a fast and cost-effective measurement method of coplanarity inspection of ball grid array (BGA) solder balls is proposed. Laser interference structure light can be obtained by using the principle of shearing interferometry. The collimated and beam expanded laser produced interference fringe by the high reflection rate optical flat. After laser interference fringe project on the surface of object and the structured light would modulated. The light signal pass through the image optical grabber and captured by the CCD image sensor. The height of each point on object can be demodulated by the imaging processing software.This method to construct the measurement appliance for coplanarity inspection of ball grid array (BGA) chip solder ball. Experiments have shown that the coplanarity measurement of BGA solder balls is very efficient and effective with the measurement. The measurement accuracy achieve micrometer level. The processing time of the measurement accuracy is less than 3s on a personal computer. This measurement appliance could completely meet the demand of measure.

  7. Investigation of gold embrittlement in connector solder joints

    NASA Technical Reports Server (NTRS)

    Lane, F. L.

    1972-01-01

    An investigation was performed to determine to what extent typical flight connector solder joints may be embrittled by the presence of gold. In addition to mapping of gold content in connector solder joints by an electron microprobe analyzer, metallographic examinations and mechanical tests (thermal shock, vibration, impact and tensile strength) were also conducted. A description of the specimens and tests, a discussion of the data, and some conclusions are presented.

  8. Australia’s first national level quantitative environmental justice assessment of industrial air pollution

    NASA Astrophysics Data System (ADS)

    Chakraborty, Jayajit; Green, Donna

    2014-04-01

    This study presents the first national level quantitative environmental justice assessment of industrial air pollution in Australia. Specifically, our analysis links the spatial distribution of sites and emissions associated with industrial pollution sources derived from the National Pollution Inventory, to Indigenous status and social disadvantage characteristics of communities derived from Australian Bureau of Statistics indicators. Our results reveal a clear national pattern of environmental injustice based on the locations of industrial pollution sources, as well as volume, and toxicity of air pollution released at these locations. Communities with the highest number of polluting sites, emission volume, and toxicity-weighted air emissions indicate significantly greater proportions of Indigenous population and higher levels of socio-economic disadvantage. The quantities and toxicities of industrial air pollution are particularly higher in communities with the lowest levels of educational attainment and occupational status. These findings emphasize the need for more detailed analysis in specific regions and communities where socially disadvantaged groups are disproportionately impacted by industrial air pollution. Our empirical findings also underscore the growing necessity to incorporate environmental justice considerations in environmental planning and policy-making in Australia.

  9. Eutectic Solder Bonding for Highly Manufacturable Microelectromechanical Systems Probe Card

    NASA Astrophysics Data System (ADS)

    Kim, Bonghwan

    2011-06-01

    We developed eutectic solder bonding for the microelectromechanical systems (MEMS) probe card. We tested various eutectic solder materials, such as Sn, AgSn, and AuSn, and investigated the bonding ability of Sn-based multi-element alloys and their resistance to chemical solutions. The Sn-based alloys were formed by sputtering, electroplating, and the use of solder paste. According to our experimental results, Sn-rich solders, such as Ag3.5Sn, Ag3.5Sn96Cu0.5, and Sn, were severely damaged by silicon wet etchant such as potassium hydroxide (KOH) and tetramethylammonium hydroxide (TMAH). On the other hand Au80Sn20 was resistant to those chemicals. In order to verify the joint bondability of the solders, we used a cantilever probe beam, and bump which were made of nickel and nickel alloy. After flip-chip bonding of the cantilever beam and the bump with Au80Sn20 solder paste, we measured the contact force to verify the mechanical strength. We then re-inspected it with X-rays and found no voids in the joint.

  10. Soldering of Thin Film-Metallized Glass Substrates

    SciTech Connect

    Hosking, F.M.; Hernandez, C.L.; Glass, S.J.

    1999-03-31

    The ability to produce reliable electrical and structural interconnections between glass and metals by soldering was investigated. Soldering generally requires premetallization of the glass. As a solderable surface finish over soda-lime-silicate glass, two thin films coatings, Cr-Pd-Au and NiCr-Sn, were evaluated. Solder nettability and joint strengths were determined. Test samples were processed with Sn60-Pb40 solder alloy at a reflow temperature of 210 C. Glass-to-cold rolled steel single lap samples yielded an average shear strength of 12 MPa. Solder fill was good. Control of the Au thickness was critical in minimizing the formation of AuSn{sub 4} intermetallic in the joint, with a resulting joint shear strength of 15 MPa. Similar glass-to-glass specimens with the Cr-Pd-Au finish failed at 16.5 MPa. The NiCr-Sn thin film gave even higher shear strengths of 20-22.5 MPa, with failures primarily in the glass.

  11. Thermomechanical Stress and Strain in Solder Joints During Electromigration

    NASA Astrophysics Data System (ADS)

    Zhang, J. S.; Xi, H. J.; Wu, Y. P.; Wu, F. S.

    2009-05-01

    Thermomechanical stress and strain in the solder joints of a dummy area array package were studied as electromigration occurred. A current density of 0.4 × 104 A/cm2 was applied to this package, constructed with 9 × 9 solder joints in a daisy chain, to perform the electromigration test. After 37 h, the first joint on the path of the electron flow broke off at the cathode, and the first three solder joints all exhibited a typical accumulation of intermetallic compounds at the anode. Different solder joints exhibited dissimilar electromigration states, such as steady state and nonsteady state. Finite element analysis indicated that during steady-state electromigration, although the symmetrical structure produced uniform distributions of current density and Joule heating in all solder joints, the distribution of temperature was nonuniform. This was due to the imbalanced heat dissipation, which in turn affected the distribution of thermomechanical stress and strain in the solder joints. The maximum thermomechanical stress and strain, as well the highest temperature and current crowding, appeared in the Ni/Cu layer of each joint. The strain in the Ni/Cu layer was significant along the z-axis, but was constrained in the x- y plane. The thermomechanical stress and strain increased with advancing electromigration; thus, a potential delamination between the Ni/Cu layer and the printed circuit board could occur.

  12. Thermomechanical fatigue behavior of Sn-Ag solder joints

    NASA Astrophysics Data System (ADS)

    Choi, S.; Subramanian, K. N.; Lucas, J. P.; Bieler, T. R.

    2000-10-01

    Microstructural studies of thermomechanically fatigued actual electronic components consisting of metallized alumina substrate and tinned copper lead, soldered with Sn-Ag or 95.5Ag/4Ag/0.5Cu solder were carried out with an optical microscope and environmental scanning electron microscope (ESEM). Damage characterization was made on samples that underwent 250 and 1000 thermal shock cycles between -40°C and 125°C, with a 20 min hold time at each extreme. Surface roughening and grain boundary cracking were evident even in samples thermally cycled for 250 times. The cracks were found to originate on the free surface of the solder joint. With increased thermal cycles these cracks grew by grain boundary decohesion. The crack that will affect the integrity of the solder joint was found to originate from the free surface of the solder very near the alumina substrate and progress towards and continue along the solder region adjacent to the Ag3Sn intermetallic layer formed with the metallized alumina substrate. Re-examination of these thermally fatigued samples that were stored at room temperature after ten months revealed the effects of significant residual stress due to such thermal cycles. Such observations include enhanced surface relief effects delineating the grain boundaries and crack growth in regions inside the joint.

  13. Soldering in prosthodontics--an overview, part I.

    PubMed

    Byrne, Gerard

    2011-04-01

    The fit of fixed multiunit dental prostheses (FDP), traditionally termed fixed partial dentures (FPDs), is an ongoing problem. Poorly fitting restorations may hasten mechanical failure, due to abutment caries or screw failure. Soldering and welding play an important role in trying to overcome misfit of fixed multiunit prostheses. The term FPD will be used to denote multiunit fixed dental prostheses in this review. This is the first of a series of articles that review the state of the art and science of soldering and welding in relation to the fit of cemented or screw-retained multiunit prostheses. A comprehensive archive of background information and scientific findings is presented. Texts in dental materials and prosthodontics were reviewed. Scientific data were drawn from the numerous laboratory studies up to and including 2009. The background, theory, terminology, and working principles, along with the applied research, are presented. This first article focuses on soldering principles and dimensional accuracy in soldering. There is some discussion and suggestions for future research and development. Soldering may improve dimensional accuracy or reduce the distortion of multiunit fixed prostheses. Many variables can affect the outcome in soldering technique. Research science has developed some helpful guidelines. Research projects are disconnected and limited in scope. PMID:21323788

  14. Evaluation of temperatures attained by electronic components during various manual soldering operations

    NASA Astrophysics Data System (ADS)

    Dunn, B. D.; Hilbrands, G.; Nielsen, P. J.

    1983-03-01

    After component-failure analyses showed that defective spacecraft devices were overheated during soldering, it was verified that quality-assurance personnel omitted to control pretinning-bath and soldering iron temperatures, so data were acquired under controlled processing conditions. Component temperature rises were recorded during degolding, pretinning, soldering and the reworking of soldered joints. Results show that existing ESA specifications for manual soldering and repair ensure that the maximum temperature ratings ascribed to standard spacecraft components are not exceeded. Application of heat sinks to certain delicate components during degolding is essential, and it can be advantageous to apply them during pretinning and other soldering operations.

  15. Microorganism levels in air near spray irrigation of municipal waste water: The Lubbock Infection Surveillance Study

    SciTech Connect

    Camann, D.E.; Moore, B.E.; Harding, H.J.; Sorber, C.A.

    1988-01-01

    The Lubbock Infection Surveillance Study (LISS) investigated possible adverse effects on human health from slow-rate land application of municipal wastewater. Extensive air sampling was conducted to characterize the irrigation site as a source of infectious microbial aerosols. Spray irrigation of poor-quality waste water received directly from the treatment plant significantly elevated air densities of fecal coliforms, fecal streptococci, mycobacteria, and coliphage above ambient background levels for at least 200 m downwind. Enteroviruses were repeatedly recovered at 44 to 60 m downwind at a higher level (geometric mean = 0.05 pfu/m3) than observed at other waste water aerosol sites in the U.S. and in Israel. Waste water storage in reservoirs reduced downwind air densities of indicator organisms by two orders of magnitude.

  16. Lead-free solder technology transfer from ASE Americas

    SciTech Connect

    FTHENAKIS,V.

    1999-10-19

    To safeguard the environmental friendliness of photovoltaics, the PV industry follows a proactive, long-term environmental strategy involving a life-of-cycle approach to prevent environmental damage by its processes and products from cradle to grave. Part of this strategy is to examine substituting lead-based solder on PV modules with other solder alloys. Lead is a toxic metal that, if ingested, can damage the brain, nervous system, liver and kidneys. Lead from solder in electronic products has been found to leach out from municipal waste landfills and municipal incinerator ash was found to be high in lead also because of disposed consumer electronics and batteries. Consequently, there is a movement in Europe and Japan to ban lead altogether from use in electronic products and to restrict the movement across geographical boundaries of waste containing lead. Photovoltaic modules may contain small amounts of regulated materials, which vary from one technology to another. Environmental regulations impact the cost and complexity of dealing with end-of-life PV modules. If they were classified as hazardous according to Federal or State criteria, then special requirements for material handling, disposal, record-keeping and reporting would escalate the cost of decommissioning the modules. Fthenakis showed that several of today's x-Si modules failed the US-EPA Toxicity Characteristic Leaching Procedure (TCLP) for potential leaching of Pb in landfills and also California's standard on Total Threshold Limit Concentration (TTLC) for Pb. Consequently, such modules may be classified as hazardous waste. He highlighted potential legislation in Europe and Japan which could ban or restrict the use of lead and the efforts of the printed-circuit industries in developing Pb-free solder technologies in response to such expected legislation. Japanese firms already have introduced electronic products with Pb-free solder, and one PV manufacturer in the US, ASE Americas has used a Pb

  17. Indoor air quality levels in a University Hospital in the Eastern Province of Saudi Arabia

    PubMed Central

    El-Sharkawy, Mahmoud F.; Noweir, Mohamed E. H.

    2014-01-01

    Aim of the Study: The complex hospital environment requires special attention to ensure a healthy indoor air quality (IAQ) to protect patients and healthcare workers against hospital-acquired infections and occupational diseases. Poor hospital IAQ may cause outbreaks of building-related illness such as headaches, fatigue, eye, and skin irritations, and other symptoms. The general objective for this study was to assess IAQ inside a large University hospital at Al-Khobar City in the Eastern Province of Saudi Arabia. Materials and Methods: Different locations representing areas where most activities and tasks are performed were selected as sampling points for air pollutants in the selected hospital. In addition, several factors were studied to determine those that were most likely to affect the IAQ levels. The temperature and relative percent humidity of different air pollutants were measured simultaneously at each location. Results: The outdoor levels of all air pollutant levels, except volatile organic compounds (VOCs), were higher than the indoor levels which meant that the IAQ inside healthcare facilities (HCFs) were greatly affected by outdoor sources, particularly traffic. The highest levels of total suspended particulates (TSPs) and those less than 10 microns (PM10) inside the selected hospital were found at locations that are characterized with m4ore human activity. Conclusions: Levels of particulate matter (both PM10 and TSP) were higher than the Air Quality Guidelines (AQGs). The highest concentrations of the fungal species recorded were Cladosporium and Penicillium. Education of occupants of HCF on IAQ is critical. They must be informed about the sources and effects of contaminants and the proper operation of the ventilation system. PMID:24696632

  18. The Influence of Declining Air Lead Levels on Blood Lead–Air Lead Slope Factors in Children

    PubMed Central

    Richmond-Bryant, Jennifer; Davis, Allen; Cohen, Jonathan; Lu, Shou-En; Svendsgaard, David; Brown, James S.; Tuttle, Lauren; Hubbard, Heidi; Rice, Joann; Kirrane, Ellen; Vinikoor-Imler, Lisa C.; Kotchmar, Dennis; Hines, Erin P.; Ross, Mary

    2014-01-01

    Background: It is difficult to discern the proportion of blood lead (PbB) attributable to ambient air lead (PbA), given the multitude of lead (Pb) sources and pathways of exposure. The PbB–PbA relationship has previously been evaluated across populations. This relationship was a central consideration in the 2008 review of the Pb national ambient air quality standards. Objectives: The objectives of this study were to evaluate the relationship between PbB and PbA concentrations among children nationwide for recent years and to compare the relationship with those obtained from other studies in the literature. Methods: We merged participant-level data for PbB from the National Health and Nutrition Examination Survey (NHANES) III (1988–1994) and NHANES 9908 (1999–2008) with PbA data from the U.S. Environmental Protection Agency. We applied mixed-effects models, and we computed slope factor, d[PbB]/d[PbA] or the change in PbB per unit change in PbA, from the model results to assess the relationship between PbB and PbA. Results: Comparing the NHANES regression results with those from the literature shows that slope factor increased with decreasing PbA among children 0–11 years of age. Conclusion: These findings suggest that a larger relative public health benefit may be derived among children from decreases in PbA at low PbA exposures. Simultaneous declines in Pb from other sources, changes in PbA sampling uncertainties over time largely related to changes in the size distribution of Pb-bearing particulate matter, and limitations regarding sampling size and exposure error may contribute to the variability in slope factor observed across peer-reviewed studies. Citation: Richmond-Bryant J, Meng Q, Davis A, Cohen J, Lu SE, Svendsgaard D, Brown JS, Tuttle L, Hubbard H, Rice J, Kirrane E, Vinikoor-Imler LC, Kotchmar D, Hines EP, Ross M. 2014. The Influence of declining air lead levels on blood lead–air lead slope factors in children. Environ Health Perspect 122:754

  19. Precipitation and Air Temperature Impact on Seasonal Variations of Groundwater Levels

    NASA Astrophysics Data System (ADS)

    Vitola, Ilva; Vircavs, Valdis; Abramenko, Kaspars; Lauva, Didzis; Veinbergs, Arturs

    2012-12-01

    The aim of this study is to clarify seasonal effects of precipitation and temperature on groundwater level changes in monitoring stations of the Latvia University of Agriculture - Mellupīte, Bērze and Auce. Groundwater regime and level fluctuations depend on climatic conditions such as precipitation intensity, evapotranspiration, surface runoff and drainage, as well as other hydrological factors. The relationship between precipitation, air temperature and groundwater level fluctuations could also lead and give different perspective of possible changes in groundwater quality. Using mathematical statistics and graphic-analytic methods it is concluded that autumn and winter precipitation has the dominant impact on groundwater level fluctuations, whereas spring and summer season fluctuations are more dependent on the air temperature.

  20. 42 CFR 84.1139 - Air velocity and noise levels; hoods and helmets; minimum requirements.

    Code of Federal Regulations, 2010 CFR

    2010-10-01

    ... 42 Public Health 1 2010-10-01 2010-10-01 false Air velocity and noise levels; hoods and helmets; minimum requirements. 84.1139 Section 84.1139 Public Health PUBLIC HEALTH SERVICE, DEPARTMENT OF HEALTH AND HUMAN SERVICES OCCUPATIONAL SAFETY AND HEALTH RESEARCH AND RELATED ACTIVITIES APPROVAL OF RESPIRATORY PROTECTIVE DEVICES Dust, Fume, and...

  1. 42 CFR 84.202 - Air velocity and noise levels; hoods and helmets; minimum requirements.

    Code of Federal Regulations, 2010 CFR

    2010-10-01

    ... 42 Public Health 1 2010-10-01 2010-10-01 false Air velocity and noise levels; hoods and helmets; minimum requirements. 84.202 Section 84.202 Public Health PUBLIC HEALTH SERVICE, DEPARTMENT OF HEALTH AND HUMAN SERVICES OCCUPATIONAL SAFETY AND HEALTH RESEARCH AND RELATED ACTIVITIES APPROVAL OF RESPIRATORY PROTECTIVE DEVICES Chemical...

  2. HOME AIR NICOTINE LEVELS AND URINE COTININE-CREATININE RATIOS IN PRESCHOOL CHILDREN

    EPA Science Inventory

    We studied urine cotinine excretion in 27 children who attended a research day care center to determine the extent of correlation between urine cotinine-creatinine ratios (CCR) and intensity of nicotine exposure in the home. verage nicotine levels in home air were determined by a...

  3. Wafer-level vacuum packaging for an optical readout bi-material cantilever infrared FPA

    NASA Astrophysics Data System (ADS)

    Li, Shuyu; Zhou, Xiaoxiong; Yu, Xiaomei

    2013-12-01

    In this paper, we report the design and fabrication of an uncooled infrared (IR) focal plane array (FPA) on quartz substrate and the wafer-level vacuum packaging for the IR FPA in view of an optical readout method. This FPA is composed of bi-material cantilever array which fabricated by the Micro-Electro Mechanical System (MEMS) technology, and the wafer-level packaging of the IR FPA is realized based on AuSn solder bonding technique. The interface of soldering is observed by scan electron microscope (SEM), which indicates that bonding interface is smooth and with no bubbles. The air leakage rate of packaged FPA is measured to be 1.3×10-9 atm·cc/s.

  4. Gross Alpha Beta Radioactivity in Air Filters Measured by Ultra Low Level α/β Counter

    NASA Astrophysics Data System (ADS)

    Cfarku, Florinda; Bylyku, Elida; Deda, Antoneta; Dhoqina, Polikron; Bakiu, Erjona; Perpunja, Flamur

    2010-01-01

    Study of radioactivity in air as very important for life is done regularly using different methods in every country. As a result of nuclear reactors, atomic centrals, institutions and laboratories, which use the radioactivity substances in open or closed sources, there are a lot radioactive wastes. Mixing of these wastes after treatment with rivers and lakes waters makes very important control of radioactivity. At the other side nuclear and radiological accidents are another source of the contamination of air and water. Due to their radio toxicity, especially those of Sr90, Pu239, etc. a contamination hazard for human begins exist even at low concentration levels. Measurements of radioactivity in air have been performed in many parts of the world mostly for assessment of the doses and risk resulting from consuming air. In this study we present the results of international comparison organized by IAEA Vienna, Austria for the air filters spiked with unknown Alpha and Beta Activity. For the calibration of system we used the same filters spiked: a) with Pu-239 as alpha source; b) Sr-90 as beta source and also the blank filter. The measurements of air filter samples after calibration of the system are done with Ultra Low Level α/β Counter (MPC 9604) Protean Instrument Corporation. The high sensitivity of the system for the determination of the Gross Alpha and Beta activity makes sure detection of low values activity of air filters. Our laboratory results are: Aα = (0.19±0.01) Bq/filter and Aα (IAEA) = (0.17±0.009) Bq/filter; Aβ = (0.33±0.009) Bq/filter and Aβ (IAEA) = (0.29±0.01) Bq/filter. As it seems our results are in good agreement with reference values given by IAEA (International Atomic Energy Agency).

  5. Gross Alpha Beta Radioactivity in Air Filters Measured by Ultra Low Level alpha/beta Counter

    SciTech Connect

    Cfarku, Florinda; Bylyku, Elida; Bakiu, Erjona; Perpunja, Flamur; Deda, Antoneta; Dhoqina, Polikron

    2010-01-21

    Study of radioactivity in air as very important for life is done regularly using different methods in every country. As a result of nuclear reactors, atomic centrals, institutions and laboratories, which use the radioactivity substances in open or closed sources, there are a lot radioactive wastes. Mixing of these wastes after treatment with rivers and lakes waters makes very important control of radioactivity. At the other side nuclear and radiological accidents are another source of the contamination of air and water. Due to their radio toxicity, especially those of Sr{sup 90}, Pu{sup 239}, etc. a contamination hazard for human begins exist even at low concentration levels. Measurements of radioactivity in air have been performed in many parts of the world mostly for assessment of the doses and risk resulting from consuming air. In this study we present the results of international comparison organized by IAEA Vienna, Austria for the air filters spiked with unknown Alpha and Beta Activity. For the calibration of system we used the same filters spiked: a) with Pu-239 as alpha source; b) Sr-90 as beta source and also the blank filter. The measurements of air filter samples after calibration of the system are done with Ultra Low Level alpha/beta Counter (MPC 9604) Protean Instrument Corporation. The high sensitivity of the system for the determination of the Gross Alpha and Beta activity makes sure detection of low values activity of air filters. Our laboratory results are: Aalpha = (0.19+-0.01) Bq/filter and Aalpha(IAEA) = (0.17+-0.009) Bq/filter; A{sub b}eta = (0.33+-0.009) Bq/filter and A{sub b}eta (IAEA) = (0.29+-0.01) Bq/filter. As it seems our results are in good agreement with reference values given by IAEA (International Atomic Energy Agency).

  6. Characterization of Low-Melting-Point Sn-Bi-In Lead-Free Solders

    NASA Astrophysics Data System (ADS)

    Li, Qin; Ma, Ninshu; Lei, YongPing; Lin, Jian; Fu, HanGuang; Gu, Jian

    2016-02-01

    Development of lead-free solders with low melting temperature is important for substitution of Pb-based solders to reduce direct risks to human health and the environment. In the present work, Sn-Bi-In solders were studied for different ratios of Bi and Sn to obtain solders with low melting temperature. The microstructure, thermal properties, wettability, mechanical properties, and reliability of joints with Cu have been investigated. The results show that the microstructures of the Sn-Bi-In solders were composed of β-Sn, Bi, and InBi phases. The intermetallic compound (IMC) layer was mainly composed of Cu6Sn5, and its thickness increased slightly as the Bi content was increased. The melting temperature of the solders was around 100°C to 104°C. However, when the Sn content exceeded 50 wt.%, the melting range became larger and the wettability became worse. The tensile strength of the solder alloys and solder joints declined with increasing Bi content. Two fracture modes (IMC layer fracture and solder/IMC mixed fracture) were found in solder joints. The fracture mechanism of solder joints was brittle fracture. In addition, cleavage steps on the fracture surface and coarse grains in the fracture structure were comparatively apparent for higher Bi content, resulting in decreased elongation for both solder alloys and solder joints.

  7. [Winter serum levels of 25-hydroxy-vitamin D in Ushuaia and Buenos Aires].

    PubMed

    Oliveri, M B; Ladizesky, M; Somoza, J; Martínez, L; Mautalen, C

    1990-01-01

    Public Health Annals recording diagnosis of nutritional rickets in patients admitted in Public Hospitals disclosed that from birth to age 14, in the period 1980-1981, the incidence was 2.7 higher in the Patagonia (latitude 39 degrees S to 55 degrees S) compared with the Pampeana Region and 8.5 higher than in the rest of the country. After informed parental consent 37 healthy children of Buenos Aires (34 degrees S) with an age of (Av +/- 1 SD) 7.0 +/- 1.2 years, 29 with an age of 13.1 +/- 1.5 years and 63 of Ushuaia (55 degrees S) with an age of 7.1 +/- 0.8 years were studied at the end of winter (August). Serum levels of 25-OH-D were as follows (mean +/- SE): Buenos Aires: 21.1 +/- 2.03 ng/ml (Average: seven years old), 19.0 +/- 1.18 ng/ml (children of thirteen years old) and Ushuaia: 9.3 +/- 0.64 ng/ml (p less than 0.001) (Fig. 2). Serum levels were below 8 ng/ml in 52% of the children in Ushuaia but only in 9% in Buenos Aires. Serum calcium and alkaline phosphatase levels were similar in the two groups but serum phosphate was higher in Ushuaia (Table 1). The calcium intake was greater in Ushuaia (811 +/- 49 mg/day) than in Buenos Aires (634 +/- 61 mg/day) and was correlated with 25-OH-D levels in children of Ushuaia (r = 0.50, p less than 0.001) but not in Buenos Aires (r = 0.08). The main source of calcium intake was vitamin D fortified milk. These results disclosed a significantly diminished level of serum 25-OH-D in Ushuaia.(ABSTRACT TRUNCATED AT 250 WORDS) PMID:2130224

  8. Air-soil exchange of PCBs: levels and temporal variations at two sites in Turkey.

    PubMed

    Yolsal, Didem; Salihoglu, Güray; Tasdemir, Yücel

    2014-03-01

    Seasonal distribution of polychlorinated biphenyls (PCBs) at the air-soil intersection was determined for two regions: one with urban characteristics where traffic is dense (BUTAL) and the other representing the coastal zone (Mudanya). Fifty-one air and soil samples were simultaneously collected. Total PCB (Σ82 PCB) levels in the soil samples collected during a 1-year period ranged between 105 and 7,060 pg/g dry matter (dm) (BUTAL) and 110 and 2,320 pg/g dm (Mudanya). Total PCB levels in the gaseous phase were measured to be between 100 and 910 pg/m(3) (BUTAL) and 75 and 1,025 pg/m(3) (Mudanya). Variations in the concentrations were observed depending on the season. Though the PCB concentrations measured in the atmospheres of both regions in the summer months were high, they were found to be lower in winter. However, while soil PCB levels were measured to be high at BUTAL during summer months, they were found to be high during winter months in Mudanya. The direction and amount of the PCB movement were determined by calculating the gaseous phase change fluxes at air-soil intersection. While a general PCB movement from soil to air was found for BUTAL, the PCB movement from air to soil was calculated for the Mudanya region in most of the sampling events. During the warmer seasons PCB movement towards the atmosphere was observed due to evaporation from the soil. With decreases in the temperature, both decreases in the number of PCB congeners occurring in the air and a change in the direction of some congeners were observed, possibly caused by deposition from the atmosphere to the soil. 3-CB and 4-CB congeners were found to be dominant in the atmosphere, and 4-, 5-, and 6-CBs were found to dominate in the surface soils. PMID:24293299

  9. Benzene levels in ambient air and breath of smokers and nonsmokers in urban and pristine environments

    SciTech Connect

    Wester, R.C.; Maibach, H.I.; Gruenke, L.D.; Craig, J.C.

    1986-01-01

    Benzene levels in human breath and in ambient air were compared in the urban area of San Francisco (SF) and in a more remote coastal pristine setting of Stinson Beach, Calif. (SB). Benzene analysis was done by gas chromatography-mass spectroscopy (GC-MS). Ambient benzene levels were sevenfold higher in SF (2.6 +/- 1.3 ppb, n = 25) than SB (0.38 +/- 0.39 ppb, n = 21). In SF, benzene in smokers' breath (6.8 +/- 3.0 ppb) was greater than in nonsmokers' breath (2.5 +/- 0.8 ppb) and smokers' ambient air (3.3 +/- 0.8 ppb). In SB the same pattern was observed: benzene in smokers' breath was higher than in nonsmokers' breath and ambient air. Benzene in SF nonsmokers' breath was greater than in SB nonsmokers' breath. Marijuana-only smokers had benzene breath levels between those of smokers and nonsmokers. There was little correlation between benzene in breath and number of cigarettes smoked, or with other benzene exposures such as diet. Of special interest was the finding that benzene in breath of SF nonsmokers (2.5 +/- 0.8 ppb) was greater than that in nonsmokers ambient air (1.4 +/- 0.1 ppb). The same was true in SB, where benzene in nonsmokers breath was greater than ambient air (1.8 +/- 0.2 ppb versus 1.0 +/- 0.1 ppb on d 1 and 1.3 +/- 0.3 ppb versus 0.23 +/- 0.18 ppb on d 2). This suggests an additional source of benzene other than outdoor ambient air.

  10. Aging effects on the microstructure, surface characteristics and wettability of Cu pretinned with Sn-Pb solders

    SciTech Connect

    Linch, H.S.

    1993-11-01

    This study investigates effects of aging in air and argon at 170 C on Cu coupons which were pretinned with 75Sn-25Pb, 8Sn-92Pb, and 5Sn-95Pb solders. Coatings were applied using electroplating or hot dipping techniques. The coating thickness was controlled between 3 to 3{mu}m and the specimens were aged for 0 hours, 2 hours, 24 hours and 2 weeks. Wetting balance tests were used to evaluate the wettability of the test specimens. Microstructural development was evaluated using X-ray diffraction, energy dispersive X-ray and Auger spectroscopy, as well as optical and scanning electron microscopy. The wetting behavior of the test specimens is interpreted with respect to observed microstructural changes and as a function of aging time, solder composition, and processing conditions.

  11. On evaluating compliance with air pollution levels 'not to be exceeded more than once per year'

    NASA Technical Reports Server (NTRS)

    Neustadter, H. E.; Sidik, S. M.

    1974-01-01

    The point of view taken is that the Environmental Protection Agency (EPA) Air Quality Standards (AQS) represent conditions which must be made to exist in the ambient environment. The statistical techniques developed should serve as tools for measuring the closeness to achieving the desired quality of air. It is shown that the sampling frequency recommended by EPA is inadequate to meet these objectives when the standard is expressed as a level not to be exceeded more than once per year and sampling frequency is once every three days or less frequent.

  12. Microbial leaching of waste solder for recovery of metal.

    PubMed

    Hocheng, H; Hong, T; Jadhav, U

    2014-05-01

    This study proposes an environment-friendly bioleaching process for recovery of metals from solders. Tin-copper (Sn-Cu), tin-copper-silver (Sn-Cu-Ag), and tin-lead (Sn-Pb) solders were used in the current study. The culture supernatant of Aspergillus niger removed metals faster than the culture supernatant of Acidithiobacillus ferrooxidans. Also, the metal removal by A. niger culture supernatant is faster for Sn-Cu-Ag solder as compared to other solder types. The effect of various process parameters such as shaking speed, temperature, volume of culture supernatant, and increased solder weight on bioleaching of metals was studied. About 99 (±1.75) % metal dissolution was achieved in 60 h, at 200-rpm shaking speed, 30 °C temperature, and by using 100-ml A. niger culture supernatant. An optimum solder weight for bioleaching was found to be 5 g/l. Addition of sodium hydroxide (NaOH) and sodium chloride (NaCl) in the bioleached solution from Sn-Cu-Ag precipitated tin (85 ± 0.35 %) and silver (80 ± 0.08 %), respectively. Passing of hydrogen sulfide (H2S) gas at pH 8.1 selectively precipitated lead (57.18 ± 0.13 %) from the Sn-Pb bioleached solution. The proposed innovative bioleaching process provides an alternative technology for recycling waste solders to conserve resources and protect environment. PMID:24634142

  13. Continuous atomic spectrometric measurement of ambient levels of sulfur dioxide in air by mercury displacement detection

    SciTech Connect

    Marshall, G.; Midgley, D.

    1982-08-01

    The analytical atomic spectrometric technique of mercury displacement detection has been adapted so that sulfur dioxide can be determined at natural background levels in ambient air on a continuous basis with a 90% response time of 1-2 min. Sample air is drawn into the reaction vessel containing mercury (I) ion reagent and any sulfur dioxide present reacts to form elemental mercury which is measured, after being swept out of the solution by the same flow of sample air, by a mercury vapor detector. Reagent is continuously pumped through the analyzer and the instrument is calibrated with a permeation tube calibrator. The apparatus has a linear concentration range up to 100 ppB sulfur dioxide; this is much lower than can be obtained with existing commerical instruments. The apparatus is very precise and 6, 11, and 20 ppB sulfur dioxide can be measured with coefficients of variation of 1-2%.

  14. Comparing rural ground and air emergency medical services: a level I trauma center's experience.

    PubMed

    von Recklinghausen, Friedrich Maximilian

    2011-01-01

    We sought to compare differences in patients transported by ground and air emergency medical services directly from the scenes of their injuries to a rural level I trauma facility. Variables examined included age, gender, vital signs, Glasgow Coma Scale score, discharge location, length of stay, and survival metrics. Student t tests and odds ratios were used for analysis. Demographics and vital signs differed between trauma patients transported by air versus those transported by ground. Generally, length of stay was longer in air-transported patients, who also had poorer survival metrics with negligible risk of death. Significant differences exist in the markers of physiology such as vital signs, expected survival, and degree of injury. PMID:22157533

  15. Solder wetting behavior enhancement via laser-textured surface microcosmic topography

    NASA Astrophysics Data System (ADS)

    Chen, Haiyan; Peng, Jianke; Fu, Li; Wang, Xincheng; Xie, Yan

    2016-04-01

    In order to reduce or even replace the use of Sn-Pb solder in electronics industry, the laser-textured surface microstructures were used to enhance the wetting behavior of lead free solder during soldering. According to wetting theory and Sn-Ag-Cu lead free solder performance, we calculated and designed four microcosmic structures with the similar shape and different sizes to control the wetting behavior of lead free solder. The micro-structured surfaces with different dimensions were processed on copper plates by fiber femtosecond laser, and the effect of microstructures on wetting behavior was verified experimentally. The results showed that the wetting angle of Sn-Ag-Cu solder on the copper plate with microstructures decreased effectively compared with that on the smooth copper plate. The wetting angles had a sound fit with the theoretical values calculated by wetting model. The novel method provided a feasible route for adjusting the wetting behavior of solders and optimizing solders system.

  16. Development of a new Pb-free solder: Sn-Ag-Cu

    SciTech Connect

    Miller, C.M.

    1995-02-10

    With the ever increasing awareness of the toxicity of Pb, significant pressure has been put on the electronics industry to get the Pb out of solder. This work pertains to the development and characterization of an alloy which is Pb-free, yet retains the proven positive qualities of current Sn-Pb solders while enhancing the shortcomings of Sn-Pb solder. The solder studied is the Sn-4.7Ag-1.7Cu wt% alloy. By utilizing a variety of experimental techniques the alloy was characterized. The alloy has a melting temperature of 217{degrees}C and exhibits eutectic melting behavior. The solder was examined by subjecting to different annealing schedules and examining the microstructural stability. The effect of cooling rate on the microstructure of the solder was also examined. Overall, this solder alloy shows great promise as a viable alternative to Pb-bearing solders and, as such, an application for a patent has been filed.

  17. Simulation and experiment of packaging of the fibre Bragg grating sensors using brazing/soldering methods

    NASA Astrophysics Data System (ADS)

    Wen, Changjin; Li, Yulong; Hu, Ronghua; Xu, Jianning

    2016-08-01

    To manufacture fibre Bragg grating (FBG) transducer, finite element model simulation and experimental verification of packaging of the FBG by brazing/soldering were investigated. The packaging processes and their impacts on the wavelength change of FBG were analysed. Simulation results showed that the Bragg wavelength of packaged FBG shifted down a level of ~10 nm. For experimental verification, temperature sensitivity of the packaged FBG was enhanced about twice of the bare FBG, while its spectrum was well preserved. The Bragg wavelength was shifted down a level of ~10 nm which was in accordance with the simulation.

  18. A proposed methodology for the assessment of arsenic, nickel, cadmium and lead levels in ambient air.

    PubMed

    Santos, Germán; Fernández-Olmo, Ignacio

    2016-06-01

    Air quality assessment, required by the European Union (EU) Air Quality Directive, Directive 2008/50/EC, is part of the functions attributed to Environmental Management authorities. Based on the cost and time consumption associated with the experimental works required for the air quality assessment in relation to the EU-regulated metal and metalloids, other methods such as modelling or objective estimation arise as competitive alternatives when, in accordance with the Air Quality Directive, the levels of pollutants permit their use at a specific location. This work investigates the possibility of using statistical models based on Partial Least Squares Regression (PLSR) and Artificial Neural Networks (ANNs) to estimate the levels of arsenic (As), cadmium (Cd), nickel (Ni) and lead (Pb) in ambient air and their application for policy purposes. A methodology comprising the main steps that should be taken into consideration to prepare the input database, develop the model and evaluate their performance is proposed and applied to a case of study in Santander (Spain). It was observed that even though these approaches present some difficulties in estimating the individual sample concentrations, having an equivalent performance they can be considered valid for the estimation of the mean values - those to be compared with the limit/target values - fulfilling the uncertainty requirements in the context of the Air Quality Directive. Additionally, the influence of the consideration of input variables related to atmospheric stability on the performance of the studied statistical models has been determined. Although the consideration of these variables as additional inputs had no effect on As and Cd models, they did yield an improvement for Pb and Ni, especially with regard to ANN models. PMID:26950629

  19. On-site monitoring of vinyl chloride at part per trillion levels in air

    SciTech Connect

    Linenberg, A.

    1995-12-31

    The need to measure vinyl chloride at part per trillion levels and below in the atmosphere presents a challenge for those involved with environmental monitoring. Sentex has previously reported measuring vinyl chloride in the air at 1.0 part per billion levels and above. A portable gas chromatograph equipped with a special preconcentrator was used for on-site monitoring of vinyl chloride at sub-parts per billion levels. The test was performed at a landfill adjacent to a residential area. A lap-top computer controlled the gas chromatograph`s functions including sampling, preconcentration, chromatographic parameters, and data storage. Concentrations down to .02 ppb (20 ppt) were successfully detected.

  20. Background information on sources of low-level radionuclide emissions to air

    SciTech Connect

    Corbit, C.D.; Herrington, W.N.; Higby, D.P.; Stout, L.A.; Corley, J.P.

    1983-09-01

    This report provides a general description and reported emissions for eight low-level radioactive source categories, including facilties that are licensed by the Nuclear Regulatory Commission (NRC) and Agreement States, and non-Department of Energy (DOE) federal facilities. The eight categories of low-level radioactive source facilities covered by this report are: research and test reactors, accelerators, the radiopharmaceutical industry, source manufacturers, medical facilities, laboratories, naval shipyards, and low-level commercial waste disposal sites. Under each category five elements are addressed: a general description, a facility and process description, the emission control systems, a site description, and the radionuclides released to air (from routine operations).

  1. Effects of post-reflow cooling rate and thermal aging on growth behavior of interfacial intermetallic compound between SAC305 solder and Cu substrate

    NASA Astrophysics Data System (ADS)

    Hu, Xiaowu; Xu, Tao; Jiang, Xiongxin; Li, Yulong; Liu, Yi; Min, Zhixian

    2016-04-01

    The interfacial reactions between Cu and Sn3Ag0.5Cu (SAC305) solder reflowed under various cooling rates were investigated. It is found that the cooling rate is an important parameter in solder reflow process because it influences not only microstructure of solder alloy but also the morphology and growth of intermetallic compounds (IMCs) formed between solder and Cu substrate. The experimental results indicate that only scallop-like Cu6Sn5 IMC layer is observed between solder and Cu substrate in case of water cooling and air cooling, while bilayer composed of scallop-like Cu6Sn5 and thin layer-like Cu3Sn is detected under furnace cooling due to sufficient reaction time to form Cu3Sn between Cu6Sn5 IMC and Cu substrate which resulted from slow cooling rate. Samples with different reflow cooling rates were further thermal-aged at 423 K. And it is found that the thickness of IMC increases linearly with square root of aging time. The growth constants of interfacial IMC layer during aging were obtained and compared for different cooling rates, indicating that the IMC layer thickness increased faster in samples under low cooling rate than in the high cooling rate under the same aging condition. The long prismatic grains were formed on the existing interfacial Cu6Sn5 grains to extrude deeply into solder matrix with lower cooling rate and long-term aging, and the Cu6Sn5 grains coarsened linearly with cubic root of aging time.

  2. BTEX in indoor air of waterpipe cafés: Levels and factors influencing their concentrations.

    PubMed

    Hazrati, Sadegh; Rostami, Roohollah; Fazlzadeh, Mehdi

    2015-08-15

    BTEX (benzene, toluene, ethylbenzene and xylene) concentrations, factors affecting their levels, and the exposure risks related to these compounds were studied in waterpipe (Ghalyun/Hookah) cafés of Ardabil city in Islamic Republic of Iran. 81 waterpipe cafés from different districts of Ardabil city were selected and their ambient air was monitored for BTEX compounds. Air samples were taken from standing breathing zone of employees, ~150 cm above the ground level, and were analyzed using GC-FID. In each case, the types of smoked tobacco (regular, fruit flavored), types of ventilation systems (natural/artificial), and the floor level at which the café was located were investigated. A high mean concentration of 4.96±2.63 mg/m(3) corresponding to long term exposure to benzene-related cancer risk of 4314×10(-6) was estimated. The levels of the remaining compounds were lower than the national guideline limits, but their hazard quotients (HQ) for long term exposure to ethylbenzene (1.15) and xylene (17.32) exceeded the HQ unit value. Total hazard indices (HI) of 63.23 were obtained for non-cancer risks. Type of the smoked tobacco was the most important factor influencing BTEX concentrations in the cafés. BTEX concentrations in indoor ambient air of Ardabil waterpipe cafés were noticeably high, and therefore may pose important risks for human health on both short and long term exposures. PMID:25912530

  3. Combining regression analysis and air quality modelling to predict benzene concentration levels

    NASA Astrophysics Data System (ADS)

    Vlachokostas, Ch.; Achillas, Ch.; Chourdakis, E.; Moussiopoulos, N.

    2011-05-01

    State of the art epidemiological research has found consistent associations between traffic-related air pollution and various outcomes, such as respiratory symptoms and premature mortality. However, many urban areas are characterised by the absence of the necessary monitoring infrastructure, especially for benzene (C 6H 6), which is a known human carcinogen. The use of environmental statistics combined with air quality modelling can be of vital importance in order to assess air quality levels of traffic-related pollutants in an urban area in the case where there are no available measurements. This paper aims at developing and presenting a reliable approach, in order to forecast C 6H 6 levels in urban environments, demonstrated for Thessaloniki, Greece. Multiple stepwise regression analysis is used and a strong statistical relationship is detected between C 6H 6 and CO. The adopted regression model is validated in order to depict its applicability and representativeness. The presented results demonstrate that the adopted approach is capable of capturing C 6H 6 concentration trends and should be considered as complementary to air quality monitoring.

  4. Techno-Economic Analysis of Indian Draft Standard Levels for RoomAir Conditioners

    SciTech Connect

    McNeil, Michael A.; Iyer, Maithili

    2007-03-01

    The Indian Bureau of Energy Efficiency (BEE) finalized its first set of efficiency standards and labels for room air conditioners in July of 2006. These regulations followed soon after the publication of levels for frost-free refrigerators in the same year. As in the case of refrigerators, the air conditioner program introduces Minimum Efficiency Performance Standards (MEPS) and comparative labels simultaneously, with levels for one to five stars. Also like the refrigerator program, BEE defined several successive program phases of increasing stringency. In support of BEE's refrigerator program, Lawrence Berkeley National Laboratory (LBNL) produced an analysis of national impacts of standards in collaboration with the Collaborative Labeling and Standards Program (CLASP). That analysis drew on LBNL's experience with standards programs in the United States, as well as many other countries. Subsequently, as part of the process for setting optimal levels for air conditioner regulations, CLASP commissioned LBNL to provide support to BEE in the form of a techno-economic evaluation of air conditioner efficiency technologies. This report describes the methodology and results of this techno-economic evaluation. The analysis consists of three components: (1) Cost effectiveness to consumers of efficiency technologies relative to current baseline. (2) Impacts on the current market from efficiency regulations. (3) National energy and financial impacts. The analysis relied on detailed and up-to-date technical data made available by BEE and industry representatives. Technical parameters were used in conjunction with knowledge about air conditioner use patterns in the residential and commercial sectors, and prevailing marginal electricity prices, in order to give an estimate of per-unit financial impacts. In addition, the overall impact of the program was evaluated by combining unit savings with market forecasts in order to yield national impacts. LBNL presented preliminary results

  5. Nano copper based high temperature solder alternative

    NASA Astrophysics Data System (ADS)

    Sharma, Akshay

    Nano Cu an alternative to high temperature solder is developed by the Advance Technological Center at the Lockheed Martin Corporation. A printable paste of Cu nano particles is developed with an ability to fuse at 200°C in reflow oven. After reflow the deposited material has nano crystalline and nano porous structure which affects its properties. Accelerated test are performed on nano Cu deposition having nano porous and nano crystalline structure for assessment and prediction of reliability. Nano Cu assemblies with different bond layer thickness are sheared to calculate the strength of the material and are correlated with the porous and crystalline structure of nano Cu. Thermal and isothermal fatigue test are performed on nano Cu to see the dependency of life on stress and further surface of failed assemblies were observed to determine the type of failure. Creep test at RT are performed to find the type of creep mechanism and how they are affected when subjected to high temperature. TEM, SEM, X-ray, C-SAM and optical microscopy is done on the nano Cu sample for structure and surface analysis.

  6. Solder creep-fatigue interactions with flexible leaded parts

    NASA Technical Reports Server (NTRS)

    Ross, R. G., Jr.; Wen, L. C.; Mon, G. R.; Jetter, E.

    1992-01-01

    With flexible leaded parts, the solder-joint failure process involves a complex interplay of creep and fatigue mechanisms. To better understand the role of creep in typical multi-hour cyclic loading conditions, a specialized non-linear finite-element creep simulation computer program has been formulated. The numerical algorithm includes the complete part-lead-solder-PWB system, accounting for strain-rate dependence of creep on applied stress and temperature, and the role of the part-lead dimensions and flexibility that determine the total creep deflection (solder strain range) during stress relaxation. The computer program has been used to explore the effects of various solder creep-fatigue parameters such as lead height and stiffness, thermal-cycle test profile, and part/board differential thermal expansion properties. One of the most interesting findings is the strong presence of unidirectional creep-ratcheting that occurs during thermal cycling due to temperature dominated strain-rate effects. To corroborate the solder fatigue model predictions, a number of carefully controlled thermal-cycle tests have been conducted using special bimetallic test boards.

  7. Experimental Methods in Reduced-gravity Soldering Research

    NASA Technical Reports Server (NTRS)

    Pettegrew, Richard D.; Struk, Peter M.; Watson, John K.; Haylett, Daniel R.

    2002-01-01

    The National Center for Microgravity Research, NASA Glenn Research Center, and NASA Johnson Space Center are conducting an experimental program to explore the influence of reduced gravity environments on the soldering process. An improved understanding of the effects of the acceleration environment is important to application of soldering during current and future human space missions. Solder joint characteristics that are being considered include solder fillet geometry, porosity, and microstructural features. Both through-hole and surface mounted devices are being investigated. This paper focuses on the experimental methodology employed in this project and the results of macroscopic sample examination. The specific soldering process, sample configurations, materials, and equipment were selected to be consistent with those currently on-orbit. Other apparatus was incorporated to meet requirements imposed by operation onboard NASA's KC-135 research aircraft and instrumentation was provided to monitor both the atmospheric and acceleration environments. The contingent of test operators was selected to include both highly skilled technicians and less skilled individuals to provide a population cross-section that would be representative of the skill mix that might be encountered in space mission crews.

  8. 30 CFR 77.1916 - Welding, cutting, and soldering; fire protection.

    Code of Federal Regulations, 2010 CFR

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, and soldering; fire... OF UNDERGROUND COAL MINES Slope and Shaft Sinking § 77.1916 Welding, cutting, and soldering; fire protection. (a) One portable fire extinguisher shall be provided where welding, cutting, or soldering...

  9. 30 CFR 75.1106 - Welding, cutting, or soldering with arc or flame underground.

    Code of Federal Regulations, 2013 CFR

    2013-07-01

    ... 30 Mineral Resources 1 2013-07-01 2013-07-01 false Welding, cutting, or soldering with arc or... Protection § 75.1106 Welding, cutting, or soldering with arc or flame underground. All welding, cutting, or... conducted in fireproof enclosures. Welding, cutting, or soldering with arc or flame in other than...

  10. 30 CFR 75.1106 - Welding, cutting, or soldering with arc or flame underground.

    Code of Federal Regulations, 2012 CFR

    2012-07-01

    ... 30 Mineral Resources 1 2012-07-01 2012-07-01 false Welding, cutting, or soldering with arc or... Protection § 75.1106 Welding, cutting, or soldering with arc or flame underground. All welding, cutting, or... conducted in fireproof enclosures. Welding, cutting, or soldering with arc or flame in other than...

  11. 30 CFR 77.1112 - Welding, cutting, or soldering with arc or flame; safeguards.

    Code of Federal Regulations, 2014 CFR

    2014-07-01

    ... 30 Mineral Resources 1 2014-07-01 2014-07-01 false Welding, cutting, or soldering with arc or... WORK AREAS OF UNDERGROUND COAL MINES Fire Protection § 77.1112 Welding, cutting, or soldering with arc or flame; safeguards. (a) When welding, cutting, or soldering with arc or flame near...

  12. 30 CFR 77.1916 - Welding, cutting, and soldering; fire protection.

    Code of Federal Regulations, 2013 CFR

    2013-07-01

    ... 30 Mineral Resources 1 2013-07-01 2013-07-01 false Welding, cutting, and soldering; fire... OF UNDERGROUND COAL MINES Slope and Shaft Sinking § 77.1916 Welding, cutting, and soldering; fire protection. (a) One portable fire extinguisher shall be provided where welding, cutting, or soldering...

  13. 30 CFR 77.1112 - Welding, cutting, or soldering with arc or flame; safeguards.

    Code of Federal Regulations, 2011 CFR

    2011-07-01

    ... 30 Mineral Resources 1 2011-07-01 2011-07-01 false Welding, cutting, or soldering with arc or... WORK AREAS OF UNDERGROUND COAL MINES Fire Protection § 77.1112 Welding, cutting, or soldering with arc or flame; safeguards. (a) When welding, cutting, or soldering with arc or flame near...

  14. 30 CFR 75.1106 - Welding, cutting, or soldering with arc or flame underground.

    Code of Federal Regulations, 2010 CFR

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, or soldering with arc or... Protection § 75.1106 Welding, cutting, or soldering with arc or flame underground. All welding, cutting, or... conducted in fireproof enclosures. Welding, cutting, or soldering with arc or flame in other than...

  15. 30 CFR 77.1916 - Welding, cutting, and soldering; fire protection.

    Code of Federal Regulations, 2011 CFR

    2011-07-01

    ... 30 Mineral Resources 1 2011-07-01 2011-07-01 false Welding, cutting, and soldering; fire... OF UNDERGROUND COAL MINES Slope and Shaft Sinking § 77.1916 Welding, cutting, and soldering; fire protection. (a) One portable fire extinguisher shall be provided where welding, cutting, or soldering...

  16. 30 CFR 77.1916 - Welding, cutting, and soldering; fire protection.

    Code of Federal Regulations, 2014 CFR

    2014-07-01

    ... 30 Mineral Resources 1 2014-07-01 2014-07-01 false Welding, cutting, and soldering; fire... OF UNDERGROUND COAL MINES Slope and Shaft Sinking § 77.1916 Welding, cutting, and soldering; fire protection. (a) One portable fire extinguisher shall be provided where welding, cutting, or soldering...

  17. 30 CFR 75.1106 - Welding, cutting, or soldering with arc or flame underground.

    Code of Federal Regulations, 2014 CFR

    2014-07-01

    ... 30 Mineral Resources 1 2014-07-01 2014-07-01 false Welding, cutting, or soldering with arc or... Protection § 75.1106 Welding, cutting, or soldering with arc or flame underground. All welding, cutting, or... conducted in fireproof enclosures. Welding, cutting, or soldering with arc or flame in other than...

  18. 30 CFR 77.1112 - Welding, cutting, or soldering with arc or flame; safeguards.

    Code of Federal Regulations, 2013 CFR

    2013-07-01

    ... 30 Mineral Resources 1 2013-07-01 2013-07-01 false Welding, cutting, or soldering with arc or... WORK AREAS OF UNDERGROUND COAL MINES Fire Protection § 77.1112 Welding, cutting, or soldering with arc or flame; safeguards. (a) When welding, cutting, or soldering with arc or flame near...

  19. 30 CFR 77.1112 - Welding, cutting, or soldering with arc or flame; safeguards.

    Code of Federal Regulations, 2012 CFR

    2012-07-01

    ... 30 Mineral Resources 1 2012-07-01 2012-07-01 false Welding, cutting, or soldering with arc or... WORK AREAS OF UNDERGROUND COAL MINES Fire Protection § 77.1112 Welding, cutting, or soldering with arc or flame; safeguards. (a) When welding, cutting, or soldering with arc or flame near...

  20. 30 CFR 77.1916 - Welding, cutting, and soldering; fire protection.

    Code of Federal Regulations, 2012 CFR

    2012-07-01

    ... 30 Mineral Resources 1 2012-07-01 2012-07-01 false Welding, cutting, and soldering; fire... OF UNDERGROUND COAL MINES Slope and Shaft Sinking § 77.1916 Welding, cutting, and soldering; fire protection. (a) One portable fire extinguisher shall be provided where welding, cutting, or soldering...

  1. 30 CFR 77.1112 - Welding, cutting, or soldering with arc or flame; safeguards.

    Code of Federal Regulations, 2010 CFR

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, or soldering with arc or... WORK AREAS OF UNDERGROUND COAL MINES Fire Protection § 77.1112 Welding, cutting, or soldering with arc or flame; safeguards. (a) When welding, cutting, or soldering with arc or flame near...

  2. 30 CFR 75.1106 - Welding, cutting, or soldering with arc or flame underground.

    Code of Federal Regulations, 2011 CFR

    2011-07-01

    ... 30 Mineral Resources 1 2011-07-01 2011-07-01 false Welding, cutting, or soldering with arc or... Protection § 75.1106 Welding, cutting, or soldering with arc or flame underground. All welding, cutting, or... conducted in fireproof enclosures. Welding, cutting, or soldering with arc or flame in other than...

  3. Air pollution critical levels in central México protected natural areas

    NASA Astrophysics Data System (ADS)

    Ruiz Suarez, L.; Andraca Ayala, G.; Mar Morales, B.; Garcia-reynoso, J.; Torres-JArdon, R.

    2013-05-01

    All the Natural Protected Areas (NPA) within the Central Mexico City Belt comprising five metropolitan areas including MCMA are under strong impact from air pollution. Ozone, nitrogen oxides and sulfur dioxide exceed critical levels for several types of vegetation. In this work we show the critical level maps for ozone, nitrogen oxides and sulfur dioxide for Sierra of Chichinautzin, the mountain that acts as the physical barrier to air pollution dispersion south of Mexico City Metropolitan Area, what makes of it a receptor area to MCMA pollution. Maps were made combining model outputs from WRF-Chem and passive samplers. We also describe a proposal to extend the observation network to all natural protected areas within the Central Mexico City Belt.

  4. Spatially-varying surface roughness and ground-level air quality in an operational dispersion model.

    PubMed

    Barnes, M J; Brade, T K; MacKenzie, A R; Whyatt, J D; Carruthers, D J; Stocker, J; Cai, X; Hewitt, C N

    2014-02-01

    Urban form controls the overall aerodynamic roughness of a city, and hence plays a significant role in how air flow interacts with the urban landscape. This paper reports improved model performance resulting from the introduction of variable surface roughness in the operational air-quality model ADMS-Urban (v3.1). We then assess to what extent pollutant concentrations can be reduced solely through local reductions in roughness. The model results suggest that reducing surface roughness in a city centre can increase ground-level pollutant concentrations, both locally in the area of reduced roughness and downwind of that area. The unexpected simulation of increased ground-level pollutant concentrations implies that this type of modelling should be used with caution for urban planning and design studies looking at ventilation of pollution. We expect the results from this study to be relevant for all atmospheric dispersion models with urban-surface parameterisations based on roughness. PMID:24212233

  5. Ambient Levels of Air Pollution Induce Goblet-Cell Hyperplasia in Human Conjunctival Epithelium

    PubMed Central

    Novaes, Priscila; do Nascimento Saldiva, Paulo Hilário; Kara-José, Newton; Macchione, Mariângela; Matsuda, Monique; Racca, Lourdes; Berra, Alejandro

    2007-01-01

    Background Ocular mucosa is exposed constantly to the external environment, and chronic exposure to air pollution may affect the ocular surface. Objective We assessed the effect of air pollution on the ocular surface by combining determinations of individual exposure and conjunctival impression cytology. Methods A panel study was conducted with 29 volunteers recruited in two locations with different pollution levels: São Paulo (n = 13) and Divinolândia (n = 16). We assessed mean individual levels of nitrogen dioxide (NO2) exposure for 7 days, using a passive sampler. Impression cytology samples were obtained from inferior tarsal conjunctiva. Comparisons between the two groups in terms of NO2 exposure and goblet-cell counts were performed using the Student t-test. Correlations between goblet-cells counts and corresponding individual NO2 exposure levels were determined using Spearman’s correlation. Results Individuals living in São Paulo received a significantly (p = 0.005) higher dose of NO2 (mean 32.47; SD 9.83) than those living in Divinolândia (mean 19.33; SD 5.24). There was a steady increase in goblet-cell counts, proportional to NO2 exposure (Spearman’s correlation = 0.566, p = 0.001), with a dose–response pattern. Conclusions A positive and significant association between exposure to air pollution and goblet-cell hyperplasia in human conjunctiva was detected. The combination of simple measurements of exposure and impression cytology was an effective and noninvasive approach for characterizing human response to ambient levels of air pollution. PMID:18087595

  6. Impact of natural gas extraction on Pah levels in ambient air

    PubMed Central

    Paulik, L. Blair; Donald, Carey E.; Smith, Brian W.; Tidwell, Lane G.; Hobbie, Kevin A.; Kincl, Laurel; Haynes, Erin N.; Anderson, Kim A.

    2015-01-01

    Natural gas extraction, often referred to as “fracking,” has increased rapidly in the U.S. in recent years. To address potential health impacts, passive air samplers were deployed in a rural community heavily affected by the natural gas boom. Samplers were analyzed for 62 polycyclic aromatic hydrocarbons (PAHs). Results were grouped based on distance from each sampler to the nearest active well. PAH levels were highest when samplers were closest to active wells. Additionally, PAH levels closest to natural gas activity were an order of magnitude higher than levels previously reported in rural areas. Sourcing ratios indicate that PAHs were predominantly petrogenic, suggesting that elevated PAH levels were influenced by direct releases from the earth. Quantitative human health risk assessment estimated the excess lifetime cancer risks associated with exposure to the measured PAHs. Closest to active wells, the risk estimated for maximum residential exposure was 2.9 in 10,000, which is above the U.S. EPA's acceptable risk level. Overall, risk estimates decreased 30% when comparing results from samplers closest to active wells to those farthest. This work suggests that natural gas extraction may be contributing significantly to PAHs in air, at levels that are relevant to human health. PMID:25810398

  7. Impact of natural gas extraction on PAH levels in ambient air.

    PubMed

    Paulik, L Blair; Donald, Carey E; Smith, Brian W; Tidwell, Lane G; Hobbie, Kevin A; Kincl, Laurel; Haynes, Erin N; Anderson, Kim A

    2015-04-21

    Natural gas extraction, often referred to as "fracking," has increased rapidly in the U.S. in recent years. To address potential health impacts, passive air samplers were deployed in a rural community heavily affected by the natural gas boom. Samplers were analyzed for 62 polycyclic aromatic hydrocarbons (PAHs). Results were grouped based on distance from each sampler to the nearest active well. PAH levels were highest when samplers were closest to active wells. Additionally, PAH levels closest to natural gas activity were an order of magnitude higher than levels previously reported in rural areas. Sourcing ratios indicate that PAHs were predominantly petrogenic, suggesting that elevated PAH levels were influenced by direct releases from the earth. Quantitative human health risk assessment estimated the excess lifetime cancer risks associated with exposure to the measured PAHs. Closest to active wells, the risk estimated for maximum residential exposure was 2.9 in 10 000, which is above the U.S. EPA's acceptable risk level. Overall, risk estimates decreased 30% when comparing results from samplers closest to active wells to those farthest. This work suggests that natural gas extraction may be contributing significantly to PAHs in air, at levels that are relevant to human health. PMID:25810398

  8. An evaluation of the spring finger solder joints on SA1358-10 and SA2052-4 connector assemblies (MC3617,W87).

    SciTech Connect

    Kilgo, Alice C.; Vianco, Paul Thomas; Hlava, Paul Frank; Zender, Gary L.

    2006-08-01

    remelting of the spring finger solder joint. The Cd (Cr) layer did not show signs of spalling. These results suggested that, due to the size of the SA1358-10 connector, any of the former or current soldering processes used to attach the EMR adapter ring and/or EMR shell to the connector shell, requires a level of heat energy that will always result in the remelting of the spring finger solder joint attached with either the Sn-Ag or the Sn-Sb alloy. Lastly, it was construed that the induction soldering process, which is used to attach the EMR adapter ring onto the shell, was more likely to have caused the remelting event rather than the more localized heat source of the hand soldering iron used to attach the EMR shell to the adapter ring.

  9. Effects of solder temperature on pin through-hole during wave soldering: thermal-fluid structure interaction analysis.

    PubMed

    Aziz, M S Abdul; Abdullah, M Z; Khor, C Y

    2014-01-01

    An efficient simulation technique was proposed to examine the thermal-fluid structure interaction in the effects of solder temperature on pin through-hole during wave soldering. This study investigated the capillary flow behavior as well as the displacement, temperature distribution, and von Mises stress of a pin passed through a solder material. A single pin through-hole connector mounted on a printed circuit board (PCB) was simulated using a 3D model solved by FLUENT. The ABAQUS solver was employed to analyze the pin structure at solder temperatures of 456.15 K (183(°)C) < T < 643.15 K (370(°)C). Both solvers were coupled by the real time coupling software and mesh-based parallel code coupling interface during analysis. In addition, an experiment was conducted to measure the temperature difference (ΔT) between the top and the bottom of the pin. Analysis results showed that an increase in temperature increased the structural displacement and the von Mises stress. Filling time exhibited a quadratic relationship to the increment of temperature. The deformation of pin showed a linear correlation to the temperature. The ΔT obtained from the simulation and the experimental method were validated. This study elucidates and clearly illustrates wave soldering for engineers in the PCB assembly industry. PMID:25225638

  10. Effects of Solder Temperature on Pin Through-Hole during Wave Soldering: Thermal-Fluid Structure Interaction Analysis

    PubMed Central

    Abdul Aziz, M. S.; Abdullah, M. Z.; Khor, C. Y.

    2014-01-01

    An efficient simulation technique was proposed to examine the thermal-fluid structure interaction in the effects of solder temperature on pin through-hole during wave soldering. This study investigated the capillary flow behavior as well as the displacement, temperature distribution, and von Mises stress of a pin passed through a solder material. A single pin through-hole connector mounted on a printed circuit board (PCB) was simulated using a 3D model solved by FLUENT. The ABAQUS solver was employed to analyze the pin structure at solder temperatures of 456.15 K (183°C) < T < 643.15 K (370°C). Both solvers were coupled by the real time coupling software and mesh-based parallel code coupling interface during analysis. In addition, an experiment was conducted to measure the temperature difference (ΔT) between the top and the bottom of the pin. Analysis results showed that an increase in temperature increased the structural displacement and the von Mises stress. Filling time exhibited a quadratic relationship to the increment of temperature. The deformation of pin showed a linear correlation to the temperature. The ΔT obtained from the simulation and the experimental method were validated. This study elucidates and clearly illustrates wave soldering for engineers in the PCB assembly industry. PMID:25225638

  11. 5 CFR 842.811 - Deposits for second-level supervisory air traffic controller service performed before February 10...

    Code of Federal Regulations, 2010 CFR

    2010-01-01

    ... RETIREMENT SYSTEM-BASIC ANNUITY Law Enforcement Officers, Firefighters, and Air Traffic Controllers Regulations Pertaining to Noncodified Statutes § 842.811 Deposits for second-level supervisory air traffic... 5 Administrative Personnel 2 2010-01-01 2010-01-01 false Deposits for second-level supervisory...

  12. Non-Radiological Air Quality Modeling for the High-Level Waste Salt Disposition

    SciTech Connect

    Hunter, C.H.

    1999-11-29

    Dispersion modeling of non-radiological airborne emissions associated with the construction and operation of three alternatives for high-level waste salt disposition at the Savannah River Site has been completed. The results will be used by Department of Energy-Savannah River in the preparation of the salt disposition supplemental environmental impact statement. Estimated maximum ground-level concentrations of applicable regulated air pollutants of the site boundary and at the distance to a hypothetical, co-located onsite worker are summarized in tables. In all cases, model estimated ambient concentrations are less than regulatory standards.

  13. Silver nanosintering: a lead-free alternative to soldering

    NASA Astrophysics Data System (ADS)

    Maruyama, Minoru; Matsubayashi, Ryo; Iwakuro, Hiroaki; Isoda, Seiji; Komatsu, Teruo

    2008-07-01

    We propose a lead-free silver paste as a replacement for a high-temperature lead-rich solder used for electronics. The pastes tested here contain a small amount of solvent, but primarily consist of silver powder and alkoxide-passivated silver nanoparticles that undergo nanosintering when heated. The pastes were used to connect silicon diode chips to copper bases at 350°C in nitrogen ambient without external pressure. The resulting diode packages had electrical and thermal properties about equal to those with lead-solder joints. The mechanical strengths also were comparable to the lead joint. These properties make this nanosilver paste the first viable lead-free alternative to a lead solder.

  14. Development of alternatives to lead-bearing solders

    SciTech Connect

    Vianco, P.T.

    1993-07-01

    Soldering technology, using tin-lead alloys has had a significant role in the packaging of highly functional, low cost electronic devices. The elimination of lead from all manufactured products, whether through legislation or tax incentives, will impact the electronics community which uses lead-containing solders. In response to these proposed measures, the National Center for Manufacturing Sciences has established a multi-year program involving participants from industry, academia, and the national laboratories with the objective to identify potential replacements for lead-bearing solders. Selection of candidate alloys is based upon the analysis of materials properties, manufacturability, modeling codes for reliability prediction, as well as toxicological properties and resource availability, data developed in the program.

  15. Corrosion Issues in Solder Joint Design and Service

    SciTech Connect

    VIANCO,PAUL T.

    1999-11-24

    Corrosion is an important consideration in the design of a solder joint. It must be addressed with respect to the service environment or, as in the case of soldered conduit, as the nature of the medium being transported within piping or tubing. Galvanic-assisted corrosion is of particular concern, given the fact that solder joints are comprised of different metals or alloy compositions that are in contact with one-another. The (thermodynamic) potential for corrosion to take place in a particular environment requires the availability of the galvanic series for those conditions and which includes the metals or alloys in question. However, the corrosion kinetics, which actually determine the rate of material loss under the specified service conditions, are only available through laboratory evaluations or field data that are found in the existing literature or must be obtained by in-house testing.

  16. Materials chemistry. Composition-matched molecular "solders" for semiconductors.

    PubMed

    Dolzhnikov, Dmitriy S; Zhang, Hao; Jang, Jaeyoung; Son, Jae Sung; Panthani, Matthew G; Shibata, Tomohiro; Chattopadhyay, Soma; Talapin, Dmitri V

    2015-01-23

    We propose a general strategy to synthesize largely unexplored soluble chalcogenidometallates of cadmium, lead, and bismuth. These compounds can be used as "solders" for semiconductors widely used in photovoltaics and thermoelectrics. The addition of solder helped to bond crystal surfaces and link nano- or mesoscale particles together. For example, CdSe nanocrystals with Na2Cd2Se3 solder was used as a soluble precursor for CdSe films with electron mobilities exceeding 300 square centimeters per volt-second. CdTe, PbTe, and Bi2Te3 powders were molded into various shapes in the presence of a small additive of composition-matched chalcogenidometallate or chalcogel, thus opening new design spaces for semiconductor technologies. PMID:25569110

  17. Solder wetting kinetics in narrow V-grooves

    SciTech Connect

    Yost, F.G.; Rye, R.R.; Mann, J.A. Jr.

    1997-12-01

    Experiments are performed to observe capillary flow in grooves cut into copper surfaces. Flow kinetics of two liquids, 1-heptanol and eutectic Sn-Pb solder, are modeled with modified Washburn kinetics and compared to flow data. It is shown that both liquids flow parabolically in narrow V-grooves, and the data scale as predicted by the modified Washburn model. The early portions of the flow kinetics are characterized by curvature in the length vs time relationship which is not accounted for in the modified Washburn model. This effect is interpreted in terms of a dynamic contact angle. It is concluded that under conditions of rapid flow, solder spreading can be understood as a simple fluid flow process. Slower kinetics, e.g. solder droplet spreading on flat surfaces, may be affected by subsidiary chemical processes such as reaction.

  18. Cyclic siloxanes in air, including identification of high levels in Chicago and distinct diurnal variation

    PubMed Central

    Yucuis, Rachel A.; Stanier, Charles O.; Hornbuckle, Keri C.

    2014-01-01

    The organosilicon compounds octamethylcyclotetrasiloxane (D4), decamethylcyclopentasiloxane (D5), and dodecamethylcyclohexasiloxane (D6) are high production volume chemicals that are widely used in household goods and personal care products. Due to their prevalence and chemical characteristics, cyclic siloxanes are being assessed as possible persistent organic pollutants. D4, D5, and D6 were measured in indoor and outdoor air to quantify and compare siloxane concentrations and compound ratios depending on location type. Indoor air samples had a median concentration of 2200 ng m−3 for the sum of D4, D5, and D6. Outdoor sampling locations included downtown Chicago, Cedar Rapids, IA, and West Branch, IA, and had median sum siloxane levels of 280, 73, and 29 ng m−3 respectively. A diurnal trend is apparent in the samples taken in downtown Chicago. Nighttime samples had a median 2.7 times higher on average than daytime samples, which is due, in part, to the fluctuations of the planetary boundary layer. D5 was the dominant siloxane in both indoor and outdoor air. Ratios of D5 to D4 averaged 91 and 3.2 for indoor and outdoor air respectively. PMID:23541357

  19. Groundwater level and nitrate concentration trends on Mountain Home Air Force Base, southwestern Idaho

    USGS Publications Warehouse

    Williams, Marshall L.

    2014-01-01

    Mountain Home Air Force Base in southwestern Idaho draws most of its drinking water from the regional aquifer. The base is located within the State of Idaho's Mountain Home Groundwater Management Area and is adjacent to the State's Cinder Cone Butte Critical Groundwater Area. Both areas were established by the Idaho Department of Water Resources in the early 1980s because of declining water levels in the regional aquifer. The base also is listed by the Idaho Department of Environmental Quality as a nitrate priority area. The U.S. Geological Survey, in cooperation with the U.S. Air Force, began monitoring wells on the base in 1985, and currently monitors 25 wells for water levels and 17 wells for water quality, primarily nutrients. This report provides a summary of water-level and nitrate concentration data collected primarily between 2001 and 2013 and examines trends in those data. A Regional Kendall Test was run to combine results from all wells to determine an overall regional trend in water level. Groundwater levels declined at an average rate of about 1.08 feet per year. Nitrate concentration trends show that 3 wells (18 percent) are increasing in nitrate concentration trend, 3 wells (18 percent) show a decreasing nitrate concentration trend, and 11 wells (64 percent) show no nitrate concentration trend. Six wells (35 percent) currently exceed the U.S. Environmental Protection Agency's maximum contaminant limit of 10 milligrams per liter for nitrate (nitrite plus nitrate, measured as nitrogen).

  20. The Inhibition of Tin Whiskers on the Surface of Sn-8Zn-3Bi-0.5Ce Solders

    NASA Astrophysics Data System (ADS)

    Jain, C. C.; Chen, C. L.; Lai, H. J.; Chuang, T. H.

    2011-08-01

    Through the refinement of the (Ce, Zn)Sn3 intermetallic phase, the formation of tin whiskers, previously observed on the surface of a Sn-3Ag-0.5Cu-0.5Ce solder, was prevented in a Sn-9Zn-0.5Ce alloy. However, whisker growth can still occur on the surface of Sn-8Zn-3Bi-0.5Ce solder after air storage at room temperature and at 150 °C due to the formation of large (Ce, Zn)Sn3 intermetallic clusters. Further experiments showed that decreasing the Bi-content in this Sn-8Zn-0.5Ce alloy to 1 and 2 wt.% can recover the beneficial effects of Zn additions on the refinement of the (Ce, Zn)Sn3 phase and obviously reduce the appearance of tin whiskers. In addition, alloying the Sn-8Zn-3Bi-0.5Ce solder with 0.5 wt.% Ge, which increases the oxidation resistance of the (Ce, Zn)Sn3 intermetallic clusters, can also effectively inhibit tin whisker growth.

  1. A ban on use of lead-bearing solders: Implications for the electronics industry

    SciTech Connect

    Vianco, P.T.; Yost, F.G.

    1992-04-01

    This white paper addresses the issue of banning lead from solders used in electronics manufacturing. The current efforts by legislative bodies and regulatory agencies to curtail the use of lead in manufactured goods, including solders, are described. In response to a ban on lead or the imposition of a tax which makes lead uneconomical for use in solder alloys, alternative technologies including lead-free solders and conductive epoxies are presented. The recommendation is made that both users and producers of solder materials join together as partners in a consortium to address this issue in a timely and cost-effective manner.

  2. Preparation of Sn—Ag—In ternary solder bumps by electroplating in sequence and reliability

    NASA Astrophysics Data System (ADS)

    Dongliang, Wang; Yuan, Yuan; Le, Luo

    2011-08-01

    This paper describes a technique that can obtain ternary Sn—Ag—In solder bumps with fine pitch and homogenous composition distribution. The mainfeature of this process is that tin-silver and indium are electroplated on copper under bump metallization (UBM) in sequence. After an accurate reflow process, Sn1.8Ag9.4In solder bumps are obtained. It is found that the intermetallic compounds (IMCs) between Sn—Ag—In solder and Cu grow with the reflow time, which results in an increase in Ag concentration in the solder area. So during solidification, more Ag2In nucleates and strengthens the solder.

  3. Process characterization and control of hand-soldered printed wiring assemblies

    SciTech Connect

    Cheray, D.L.; Mandl, R.G.

    1993-09-01

    A designed experiment was conducted to characterize the hand soldering process parameters for manufacturing printed wiring assemblies (PWAs). Component tinning was identified as the most important parameter in hand soldering. After tinning, the soldering iron tip temperature of 700{degrees}F and the choice of operators influence solder joint quality more than any other parameters. Cleaning and flux/flux core have little impact on the quality of the solder joint. The need for component cleaning prior to assembly must be evaluated for each component.

  4. Levels of particulate air pollution, its elemental composition, determinants and health effects in metro systems

    NASA Astrophysics Data System (ADS)

    Nieuwenhuijsen, M. J.; Gómez-Perales, J. E.; Colvile, R. N.

    The aim of this study was to review and summarise the levels of particulate air pollution, its elemental composition, its determinants, and its potential health effects in metro systems. A number of studies have been conducted to assess the levels of particulate matter and its chemical composition in metro systems. The monitoring equipment used varied and may have led to different reporting and makes it more difficult to compare results between metro systems. Some of the highest average levels of particulate matter were measured in the London metro system. Whereas some studies have reported higher levels of particulate matter in the metro system (e.g. London, Helsinki, Stockholm) compared to other modes of transport (London) and street canyons (Stockholm and Helsinki), other studies reported lower levels in the metro system (e.g. Hong Kong, Guangzhou, and Mexico City). The differences may be due to different material of the wheel, ventilation levels and breaking systems but there is no good evidence to what extent the differences may be explained by this, except perhaps for some elements (e.g. Fe, Mn). The dust in the metro system was shown to be more toxic than ambient airborne particulates, and its toxicity was compared with welding dust. The higher toxicity may be due to the higher iron content. Although the current levels of particulate matter and toxic matter are unlikely to lead to any significant excess health effects in commuters, they should be reduced where possible. It will be difficult to introduce measures to reduce the levels in older metro systems, e.g. by introducing air conditioning in London, but certainly they should be part of any new designs of metro systems.

  5. Passive inhalation of marijuana smoke: urinalysis and room air levels of delta-9-tetrahydrocannabinol.

    PubMed

    Cone, E J; Johnson, R E; Darwin, W D; Yousefnejad, D; Mell, L D; Paul, B D; Mitchell, J

    1987-01-01

    In two separate studies, 5 drug-free male volunteers with a history of marijuana use were passively exposed to the sidestream smoke of 4 and 16 marijuana cigarettes (2.8% delta-9-tetrahydrocannabinol [THC]) for 1 h each day for 6 consecutive days. A third study was similarly performed with 2 marijuana-naive subjects passively exposed to the smoke of 16 marijuana cigarettes. Passive smoke exposure was conducted in a small, unventilated room. Room air levels of THC and CO were monitored frequently. All urine specimens were collected and analyzed by EMIT d.a.u. assay, Abuscreen radioimmunoassay and GC/MS. The studies show that significant amounts of THC were absorbed by all subjects at the higher level of passive smoke exposure (eg., smoke from 16 marijuana cigarettes), resulting in urinary excretion of significant amounts of cannabinoid metabolites. However, it seems improbable that subjects would unknowingly tolerate the noxious smoke conditions produced by this exposure. At the lower level of passive marijuana-smoke exposure, specimens tested positive only infrequently or were negative. Room air levels of THC during passive smoke exposure appeared to be the most critical factor in determining whether a subject produced cannabinoid-positive urine specimens. PMID:3037193

  6. Passive inhalation of marijuana smoke: urinalysis and room air levels of delta-9-tetrahydrocannabinol

    SciTech Connect

    Cone, E.J.; Johnson, R.E.; Darwin, W.D.; Yousefnejad, D.; Mell, L.D.; Paul, B.D.; Mitchell, J.

    1987-05-01

    In two separate studies, 5 drug-free male volunteers with a history of marijuana use were passively exposed to the sidestream smoke of 4 and 16 marijuana cigarettes (2.8% delta-9-tetrahydrocannabinol (THC)) for 1 h each day for 6 consecutive days. A third study was similarly performed with 2 marijuana-naive subjects passively exposed to the smoke of 16 marijuana cigarettes. Passive smoke exposure was conducted in a small, unventilated room. Room air levels of THC and CO were monitored frequently. All urine specimens were collected and analyzed by EMIT d.a.u. assay, Abuscreen radioimmunoassay and GC/MS. The studies show that significant amounts of THC were absorbed by all subjects at the higher level of passive smoke exposure (eg., smoke from 16 marijuana cigarettes), resulting in urinary excretion of significant amounts of cannabinoid metabolites. However, it seems improbable that subjects would unknowingly tolerate the noxious smoke conditions produced by this exposure. At the lower level of passive marijuana-smoke exposure, specimens tested positive only infrequently or were negative. Room air levels of THC during passive smoke exposure appeared to be the most critical factor in determining whether a subject produced cannabinoid-positive urine specimens.

  7. Mapping Air Pollution Concentrations and Sources in China from Ground-Level Observations

    NASA Astrophysics Data System (ADS)

    Rohde, R. A.; Muller, R. A.

    2014-12-01

    China has recently established an extensive air quality monitoring system with over 1500 sites providing hourly data on airborne particulate matter (PM2.5 / PM10), sulfur dioxide (SO2), nitrogen dioxide (NO2), ozone (O3), and carbon monoxide (CO). Based on Kriging interpolation of these surface data, we derive a detailed map of air pollution across the eastern half of China. In northern and central China, the pollution is widespread; contrary to popular belief, pollution is not simply localized to major cities such as Beijing, Shanghai, or Chongqing, or in geologic basins. Pollution levels are lower in southern China, in part due to frequent rains. By incorporating wind measurements and estimating pollution transport, we also infer source distributions for key pollutants. Sources are widespread, but many of the largest sources are often situated in or near major population centers. A northeast corridor extending from near Shanghai to north of Beijing includes many of the most significant pollution sources in China. Roughly 5% of the study region accounts for 25% of observed particulate matter emissions. During the analysis period, roughly half of the population of China was subjected to a long-term average pollution level in the unhealthy range, according to standards used by the US Environmental Protection Agency. In addition, nearly all of China's population (>90%) was exposed to unhealthy levels of air pollution at least some of the time. Based on health impact estimates from the Huai River Study, we estimate that the observed levels of particulate matter pollution contribute to about 1.4 million deaths every year in China, about 3500 per day, in agreement with prior estimates. Identification of sources from pollution data was facilitated by the reporting of hourly measurements, and we encourage other nations around the world to follow China's example and provide such time-resolved data.

  8. Effect of Different Levels of Pressure Relieving Air-Mattress Firmness on Cough Strength

    PubMed Central

    Kamikawa, Norimichi; Taito, Shunsuke; Takahashi, Makoto; Sekikawa, Kiyokazu; Hamada, Hironobu

    2016-01-01

    Cough is an important host-defense mechanism. The elderly and patients who are severely ill cannot cough effectively when lying in the supine position. Furthermore, pressure relieving air-mattresses are recommended for preventing the development of pressure ulcers. In this study, we clarified whether or not the cough peak flow (CPF), an index of cough strength, is affected by different firmness levels of a pressure relieving air-mattress in healthy volunteers in the supine position. Fifty-two healthy young men participated. All the measurements were carried out on each participant in the supine position on a pressure relieving air-mattress. The participants were assessed at two firmness levels, a “hard” and “soft” mode. The CPF, forced vital capacity (FVC), maximal expiratory pressure (PEmax), and maximal inspiratory pressure (PImax) were determined for each mode. The sinking distance of the body into the mattress was measured without any activity and the difference between the sinking distances of the two firmness levels was determined. The CPF, FVC, PEmax, and PImax were determined for each mode. The sinking distance of the body into the mattress was measured and the difference between the sinking distances of the two firmness levels was determined. The CPF, FVC, PEmax and PImax values of the participants coughing on the mattress were significantly lower when the mattress was in “soft” than in “hard” mode. The differences between the sinking distances of the mattress in “soft” and “hard” modes were larger for the anterior superior iliac spine. A harder mattress may lead to increased CPF in healthy young men lying in the supine position, and increased CPF may be important for host defense. PMID:26741497

  9. Effect of Different Levels of Pressure Relieving Air-Mattress Firmness on Cough Strength.

    PubMed

    Kamikawa, Norimichi; Taito, Shunsuke; Takahashi, Makoto; Sekikawa, Kiyokazu; Hamada, Hironobu

    2016-01-01

    Cough is an important host-defense mechanism. The elderly and patients who are severely ill cannot cough effectively when lying in the supine position. Furthermore, pressure relieving air-mattresses are recommended for preventing the development of pressure ulcers. In this study, we clarified whether or not the cough peak flow (CPF), an index of cough strength, is affected by different firmness levels of a pressure relieving air-mattress in healthy volunteers in the supine position. Fifty-two healthy young men participated. All the measurements were carried out on each participant in the supine position on a pressure relieving air-mattress. The participants were assessed at two firmness levels, a "hard" and "soft" mode. The CPF, forced vital capacity (FVC), maximal expiratory pressure (PEmax), and maximal inspiratory pressure (PImax) were determined for each mode. The sinking distance of the body into the mattress was measured without any activity and the difference between the sinking distances of the two firmness levels was determined. The CPF, FVC, PEmax, and PImax were determined for each mode. The sinking distance of the body into the mattress was measured and the difference between the sinking distances of the two firmness levels was determined. The CPF, FVC, PEmax and PImax values of the participants coughing on the mattress were significantly lower when the mattress was in "soft" than in "hard" mode. The differences between the sinking distances of the mattress in "soft" and "hard" modes were larger for the anterior superior iliac spine. A harder mattress may lead to increased CPF in healthy young men lying in the supine position, and increased CPF may be important for host defense. PMID:26741497

  10. Creep deformation behavior in eutectic Sn-Ag solder joints using a novel mapping technique

    SciTech Connect

    Lucas, J.P.; Guo, F.; McDougall, J.; Bieler, T.R.; Subramanian, K.N.; Park, J.K.

    1999-11-01

    Creep deformation behavior was measured for 60--100 {micro}m thick solder joints. The solder joints investigated consisted of: (1) non-composite solder joints made with eutectic Sn-Ag solder, and (2) composite solder joints with eutectic Sn-Ag solder containing 20 vol.%, 5 {micro}m diameter in-situ Cu{sub 6}Sn{sub 5} intermetallic reinforcements. All creep testing in this study was carried out at room temperature. Qualitative and quantitative assessment of creep deformation was characterized on the solder joints. Creep deformation was analyzed using a novel mapping technique where a geometrical-regular line pattern was etched over the entire solder joint using excimer laser ablation. During creep, the laser-ablation (LA) pattern becomes distorted due to deformation in the solder joint. By imaging the distortion of laser-ablation patterns using the SEM, actual deformation mapping for the entire solder joint is revealed. The technique involves sequential optical/digital imaging of the deformation versus time history during creep. By tracing and recording the deformation of the LA patterns on the solder over intervals of time, local creep data are obtained in many locations in the joint. This analysis enables global and localized creep shear strains and strain rate to be determined.

  11. Study on particulate matter air pollution in Beijing with MODIS aerosol level 2 products

    NASA Astrophysics Data System (ADS)

    Mao, Jietai; Li, Chengcai; Lau, Alexis K.

    2004-09-01

    In the run-up to the 2008 Olympic Games in Beijing, Chinese government officials at both the central and municipal levels are keenly aware that they must transform Beijing into a world-class city. According to the Beijing Municipal Environmental Protection Bureau (BJEPB) to improve its air quality some actions are adopting, including taking steps to increase the forested area surrounding the city preventing dust storms, reducing the automotive vehicles, moving polluting factories now inside the fourth ring road ringing the inner city to locations outside of the fourth ring road, and switching the fuel of public buses and taxis from diesel to natural gas, etc. Will they eliminate most serious environmental problems in Beijing? MODIS aerosol products are helping us to answer this kind of questions. A long-term validation has been finished by sun-photometer observations, and the results proved the relative error of MODIS level 2 products was slightly larger than the estimation of Chu et al. (2002) from the results in most AERONET sites. However, the comparison between the products and moisture-corrected air pollution index (API) data, which were daily released to public by EPB, showed a high correlation coefficient. An air pollution episode in 2003 was investigated by the usage of satellite products. Our conclusion for the air pollution control strategy in Beijing is that only reducing the pollution sources from inner city can't fully solve the pollution problems in Beijing and the regional transports from the nearby southern provinces are contributing a lot to the pollution situation in Beijing.

  12. Sn-Ag-Cu and Sn-Cu solders: Interfacial reactions with platinum

    NASA Astrophysics Data System (ADS)

    Kim, Tae Hyun; Kim, Young-Ho

    2004-06-01

    The interfacial reaction and intermetallic formation at the interface between tin solders containing a small amount of copper with platinum were investigated in this study. Sn-0.7Cu and Sn-1.7Cu solders were reacted with platinum by dipping Pt/Ti/Si specimens into the molten solder at 260°C. Sn-3.8Ag-0.7Cu solder was reacted with platinum by reflowing solder paste on a Pt/Ti/Si substrate at 250°C. PtSn4 intermetallic formed in all specimens while Cu6Sn5 interfacial intermetallic was not observed at the solder/platinum interfaces in any specimens. A parabolic relationship existed between the thickness of the Pt-Sn intermetallic and reaction time, which indicates the intermetallic formation in the solder/platinum interface is diffusion controlled.

  13. Local melting induced by electromigration in flip-chip solder joints

    NASA Astrophysics Data System (ADS)

    Tsai, C. M.; Lin, Y. L.; Tsai, J. Y.; Lai, Yi-Shao; Kao, C. R.

    2006-05-01

    A new electromigration failure mechanism in flip-chip solder joints is reported. The solder joints failed by local melting of a PbSn eutectic solder. Local melting occurred due to a sequence of events induced by the microstructure changes in the flip-chip solder joint. The formation of a depression in the current-crowding region of a solder joint induced the local electrical resistance to increase. The rising local resistance resulted in a larger Joule heating, which, in turn, raised the local temperature. When the local temperature rose above the eutectic temperature of the PbSn solder, the solder joint melted and consequently failed. The results of this study suggest that a dynamic, coupled simulation that takes into account the microstructure evolution, current density distribution, and temperature distribution may be needed to fully solve this problem.

  14. Soldering and brazing safety guide: A handbook on space practice for those involved in soldering and brazing

    NASA Astrophysics Data System (ADS)

    This manual provides those involved in welding and brazing with effective safety procedures for use in performance of their jobs. Hazards exist in four types of general soldering and brazing processes: (1) cleaning; (2) application of flux; (3) application of heat and filler metal; and (4) residue cleaning. Most hazards during those operations can be avoided by using care, proper ventilation, protective clothing and equipment. Specific process hazards for various methods of brazing and soldering are treated. Methods to check ventilation are presented as well as a check of personal hygiene and good maintenance practices are stressed. Several emergency first aid treatments are described.

  15. Thermal Stress of Surface Oxide Layer on Micro Solder Bumps During Reflow

    NASA Astrophysics Data System (ADS)

    Key Chung, C.; Zhu, Z. X.; Kao, C. R.

    2015-02-01

    Micro-bumps are now being developed with diameters smaller than 10 μm. At these dimensions, only very small amounts of solder are used to form the interconnections. Surface oxidation of such small micro-bumps is a critical issue. The key question is whether the oxide film on the solder bumps acts as a barrier to formation of solder joints. In this work, the mechanical stability of the oxide layer on solder bumps was investigated. Solder bumps with 35- μm radii were heated for different times. Auger electron spectroscopy was used to determine the thickness of the oxide layer on the solder bumps. Solder bumps with known oxide layer thicknesses were then heated in a low-oxygen environment (<50 ppm) until they melted. The mechanical stability of the oxide layer was observed by use of a high-speed camera. Results showed that a 14-nm-thick oxide layer on a solder bump of radius 35 μm was able to withstand the molten solder without cracking, leading to a non-wetting solder joint. A thermal stress model of the surface oxide layer revealed that the stress varied substantially with bump size and temperature, and increased almost linearly with temperature. Upon melting, the thermal stress on the oxide increased abruptly, because of the higher thermal expansion of molten solder compared with its solid state. On the basis of the experimental results and the thermal stress model of the oxide film, the maximum oxide thickness that can be tolerated to form a solder joint was determined, e.g. 14 nm oxide can support liquid solder, and thus lead to a non-wetting condition. This work provided a new method of determination of the maximum stress of oxide film for solder joint formation.

  16. Genetic effects of an air discharge plasma on Staphylococcus aureus at the gene transcription level

    NASA Astrophysics Data System (ADS)

    Xu, Zimu; Wei, Jun; Shen, Jie; Liu, Yuan; Ma, Ronghua; Zhang, Zelong; Qian, Shulou; Ma, Jie; Lan, Yan; Zhang, Hao; Zhao, Ying; Xia, Weidong; Sun, Qiang; Cheng, Cheng; Chu, Paul K.

    2015-05-01

    The dynamics of gene expression regulation (at transcription level) in Staphylococcus aureus after different doses of atmospheric-pressure room-temperature air plasma treatments are investigated by monitoring the quantitative real-time polymerase chain reaction. The plasma treatment influences the transcription of genes which are associated with several important bio-molecular processes related to the environmental stress resistance of the bacteria, including oxidative stress response, biofilm formation, antibiotics resistance, and DNA damage protection/repair. The reactive species generated by the plasma discharge in the gas phase and/or induced in the liquid phase may account for these gene expression changes.

  17. Cosmogenic (7)Be and (22)Na in ground level air in Switzerland (1994-2011).

    PubMed

    Steinmann, Philipp; Zeller, Michael; Beuret, Pierre; Ferreri, Giovanni; Estier, Sybille

    2013-10-01

    We report monthly averages of weekly (7)Be and (22)Na concentrations in aerosol samples collected with high volume aerosol filters at 5 sampling sites in Switzerland from 1994 to 2011 ((7)Be) and from 2000 to 2011 ((22)Na). Monthly average concentrations of the two cosmogenic isotopes varied between 2600 and 4600 μBq/m(3) for (7)Be and between 0.2 μBq/m(3) and 0.5 μBq/m(3) for (22)Na. The (22)Na concentration in ground level air strongly increased from March to May, while a corresponding (7)Be increase was seen from March until July. The observed variations of the (7)Be and (22)Na activities together with the changes in the (7)Be/(22)Na ratio indicate input of stratospheric air between March and May, increased mixing of upper tropospheric air from June to August, and less exchange between the upper and lower troposphere in autumn and winter. Additionally, the 11-year solar cycle is clearly seen in the annual averages of the (7)Be concentrations. PMID:23665565

  18. Evidence of increased levels of space heat consumption and air leakage associated with forced air heating systems in houses in the Pacific Northwest

    SciTech Connect

    Parker, D.S. )

    1989-01-01

    This paper examines energy consumption and air-tightness data from 820 electrically heated houses built since 1980 in the Pacific Northwest. Half of the buildings were energy-efficient structures built to the model conservation standards (MCS) developed in the region. The rest of the sample were conventional new houses intended to be representative of current building practices. The houses were monitored for a period of one year with the structures audited to determine insulation levels and occupancy characteristics. In the analysis of the monitored data we found that heating system type plays a large role in determining the relative efficiency of electrically heated houses. Residences with electric forced-air heating systems used an average of 1.40 kWh/ft{sup 2} (15.1 kWh/m{sup 2}) more space heating energy than those without them. We also discovered through the use of fan pressurization and perfluorocarbon tracer gas tests (PFT) that houses with forced-air systems exhibited substantially higher level of air leakage. The tracer gas tests indicated an average of 70% higher levels of air change rate in the control houses with forced-air space heat as opposed to baseboard systems.

  19. Recycling of lead solder dross, Generated from PCB manufacturing

    NASA Astrophysics Data System (ADS)

    Lucheva, Biserka; Tsonev, Tsonio; Iliev, Peter

    2011-08-01

    The main purpose of this work is to analyze lead solder dross, a waste product from manufacturing of printed circuit boards by wave soldering, and to develop an effective and environmentally sound technology for its recycling. A methodology for determination of the content and chemical composition of the metal and oxide phases of the dross is developed. Two methods for recycling of lead solder dross were examined—carbothermal reduction and recycling using boron-containing substances. The influence of various factors on the metal yield was studied and the optimal parameters of the recycling process are defined. The comparison between them under the same parameters-temperature and retention time, showed that recycling of dross with a mixture of borax and boric acid in a 1:2 ratio provides higher metal yield (93%). The recycling of this hazardous waste under developed technology gets glassy slag and solder, which after correction of the chemical composition can be used again for production of PCB.

  20. IMPACT OF LEAD AND OTHER METALLIC SOLDERS ON WATER QUALITY

    EPA Science Inventory

    A study of the relationship between water quality at the consumer's taps and the corrosion of lead solder was conducted under actual field conditions in 90 homes supplied by public water in the South Huntington Water District (New York) and at l4 houses supplied by private wells ...

  1. 28. VIEW OF THE SOLDERING NICHE FORMED WITH BRICKS. THE ...

    Library of Congress Historic Buildings Survey, Historic Engineering Record, Historic Landscapes Survey

    28. VIEW OF THE SOLDERING NICHE FORMED WITH BRICKS. THE BACK OF THE NICHE IS CEMENT FINISHED. THE BOTTOM HAS A 1 INCH THICK ASBESTOS SHELF. THIS PHOTO WAS TAKEN AT THE 3RD FLOOR. - Pacific Telephone & Telegraph Company Building, 1519 Franklin Street, Oakland, Alameda County, CA

  2. Porosity in collapsible Ball Grid Array solder joints

    SciTech Connect

    Gonzalez, C.A. |

    1998-05-01

    Ball Grid Array (BGA) technology has taken off in recent years due to the increased need for high interconnect density. Opposite to all the advantages BGA packages offer, porosity in collapsible BGA solder joints is often a major concern in the reliability of such packages. The effect of pores on the strength of collapsible BGA solder-joints was studied by manufacturing samples with different degrees of porosity and testing them under a shear load. It was found that the shear strength of the solder joints decreased in a linear fashion with increasing porosity. Failure occurred by internal necking of the interpore matrix. It was confirmed that entrapment of flux residues leads to porosity by manufacturing fluxless samples in a specially made furnace, and comparing them with samples assembled using flux. Also, contamination of Au electrodeposits (in substrate metallization) was determined to cause significant porosity. It was found that hard-Au (Co hardened Au) electrodeposits produce high degrees of porosity even in the absence of flux. Finally, increasing the time the solder spends in the molten state was proven to successfully decrease porosity.

  3. Horizon shells and BMS-like soldering transformations

    NASA Astrophysics Data System (ADS)

    Blau, Matthias; O'Loughlin, Martin

    2016-03-01

    We revisit the theory of null shells in general relativity, with a particular emphasis on null shells placed at horizons of black holes. We study in detail the considerable freedom that is available in the case that one solders two metrics together across null hypersurfaces (such as Killing horizons) for which the induced metric is invariant under translations along the null generators. In this case the group of soldering transformations turns out to be infinite dimensional, and these solderings create non-trivial horizon shells containing both massless matter and impulsive gravitational wave components. We also rephrase this result in the language of Carrollian symmetry groups. To illustrate this phenomenon we discuss in detail the example of shells on the horizon of the Schwarzschild black hole (with equal interior and exterior mass), uncovering a rich classical structure at the horizon and deriving an explicit expression for the general horizon shell energy-momentum tensor. In the special case of BMS-like soldering supertranslations we find a conserved shell-energy that is strikingly similar to the standard expression for asymptotic BMS supertranslation charges, suggesting a direct relation between the physical properties of these horizon shells and the recently proposed BMS supertranslation hair of a black hole.

  4. Robot End Effector To Place and Solder Solar Cells

    NASA Technical Reports Server (NTRS)

    Hagerty, J. J.

    1982-01-01

    Encapsulated in robot end effector is RF induction-heating coil for heating solar cell while in transit. Holes in encapsulant permit end of unit to act as vacuum pickup to grip solar cell. Use of RF induction heating allows cell to be heated without requiring direct mechanical and thermal contact of bonding tool such as soldering iron.

  5. Inelastic Strain Analysis of Solder Joint in NASA Fatigue Specimen

    NASA Technical Reports Server (NTRS)

    Dasgupta, Abhijit; Oyan, Chen

    1991-01-01

    The solder fatigue specimen designed by NASA-GSFC/UNISYS is analyzed in order to obtain the inelastic strain history during two different representative temperature cycles specified by UNISYS. In previous reports (dated July 25, 1990, and November 15, 1990), results were presented of the elastic-plastic and creep analysis for delta T = 31 C cycle, respectively. Subsequent results obtained during the current phase, from viscoplastic finite element analysis of the solder fatigue specimen for delta T = 113 C cycle are summarized. Some common information is repeated for self-completeness. Large-deformation continuum formulations in conjunction with a standard linear solid model is utilized for modeling the solder constitutive creep-plasticity behavior. Relevant material properties are obtained from the literature. Strain amplitudes, mean strains, and residual strains (as well as stresses) accumulated due to a representative complete temperature cycle are obtained as a result of this analysis. The partitioning between elastic strains, time-independent inelastic (plastic) strains, and time-dependent inelastic (creep) strains is also explicitly obtained for two representative cycles. Detailed plots are presented for two representative temperature cycles. This information forms an important input for fatigue damage models, when predicting the fatigue life of solder joints under thermal cycling

  6. A constitutive model for Sn-Pb solder.

    SciTech Connect

    Neilsen, Michael K.; Vianco, Paul Thomas; Boyce, Brad Lee

    2010-10-01

    A unified creep plasticity damage (UCPD) model for Sn-Pb solder is developed in this paper. Stephens and Frear (1999) studied the creep behavior of near-eutectic 60Sn-40Pb solder subjected to low strain rates and found that the inelastic (creep and plastic) strain rate could be accurately described using a hyperbolic Sine function of the applied effective stress. A recently developed high-rate servo-hydraulic method was employed to characterize the temperature and strain-rate dependent stress-strain behavior of eutectic Sn-Pb solder over a wide range of strain rates (10{sup -4} to 10{sup 2} per second). The steady state inelastic strain rate data from these latest experiments were also accurately captured by the hyperbolic Sine equation developed by Stephens and Frear. Thus, this equation was used as the basis for the UCPD model for Sn-Pb solder developed in this paper. Stephens, J.J., and Frear, D.R., Metallurgical and Materials Transactions A, Volume 30A, pp. 1301-1313, May 1999.

  7. Fundamentals of wetting and spreading with emphasis on soldering

    SciTech Connect

    Yost, F.G.

    1991-01-01

    Soldering is often referred to as a mature technology whose fundamentals were established long ago. Yet a multitude of soldering problems persist, not the least of which are related to the wetting and spreading of solder. The Buff-Goodrich approach to thermodynamics of capillarity is utilized in a review of basic wetting principles. These thermodynamics allow a very compact formulation of capillary phenomena which is used to calculate various meniscus shapes and wetting forces. These shapes and forces lend themselves to experimental techniques, such as the sessile drop and the Wilhelmy plate, for measuring useful surface and interfacial energies. The familiar equations of Young, Wilhelmy, and Neumann are all derived with this approach. The force-energy duality of surface energy is discussed and the force method is developed and used to derive the Herring relations for anisotropic surfaces. The importance of contact angle hysteresis which results from surface roughness and chemical inhomogeneity is presented and Young's equation is modified to reflect these ever present effects. Finally, an analysis of wetting with simultaneous metallurigical reaction is given and used to discuss solder wetting phenomena. 60 refs., 13 figs.

  8. Ozone Levels in the North and South of Jordan: Effects of Transboundary Air Pollution

    NASA Astrophysics Data System (ADS)

    Alsawair, Jihad Khalaf

    The first phase of this work sought to assess the causes of air quality deterioration in the south of the region over the Red Sea near the resort areas of Eilat and Aqaba. Accordingly, a coordinated Jordanian-Israeli study was performed during the month of November 2007 along the boarder of the two countries. The Jordanian measurements were made at a fixed monitoring location in the city of Aqaba, while the Israeli measurements were made using a mobile laboratory at kibbutz Eilot some 3 km north of the coastal city of Eilat. The results indicated that pollution episodes are highly dependent on wind direction, where southerly winds carry local transportation (i.e., ship, trucks) and possibly some industrial emissions towards the north end of the Red Sea, while northerly winds are associated with the transport of regional O 3. The results revealed that under the prevailing (˜90% of the time) northerly wind flows, the quality of the air is relatively good for all primary pollutants but O3 was elevated, indicative of the downwind regional transport of this secondary species from the Mediterranean coast. However, during days with southerly air flow the air quality was significantly deteriorated with elevated levels of sulfur dioxide (SO2) and nitrogen oxides (NOx). The second phase of this work, which also involved Jordanian and Israeli scientists, was undertaken in the northern part of the region for a two-week period in May/June 2009. This part of the research was aimed at examining previous modeling results that indicated that elevated O3 levels should occur in Northern Jordan from emissions in Northern Israel that are transported a distance of more than 100 km. Ozone and other pollutants were monitored at five sites in Israel (Haifa, Neve Shanan, Kiryat Tivon, Afula, and Maoz Haim) and two in Jordan (Taiba and Irbid). The sites were located along the prevailing wind direction that presumably moves air-masses eastward from the Mediterranean coast, over the Israel

  9. Factors Affecting Parent’s Perception on Air Quality—From the Individual to the Community Level

    PubMed Central

    Guo, Yulin; Liu, Fengfeng; Lu, Yuanan; Mao, Zongfu; Lu, Hanson; Wu, Yanyan; Chu, Yuanyuan; Yu, Lichen; Liu, Yisi; Ren, Meng; Li, Na; Chen, Xi; Xiang, Hao

    2016-01-01

    The perception of air quality significantly affects the acceptance of the public of the government’s environmental policies. The aim of this research is to explore the relationship between the perception of the air quality of parents and scientific monitoring data and to analyze the factors that affect parents’ perceptions. Scientific data of air quality were obtained from Wuhan’s environmental condition reports. One thousand parents were investigated for their knowledge and perception of air quality. Scientific data show that the air quality of Wuhan follows an improving trend in general, while most participants believed that the air quality of Wuhan has deteriorated, which indicates a significant difference between public perception and reality. On the individual level, respondents with an age of 40 or above (40 or above: OR = 3.252; 95% CI: 1.170–9.040), a higher educational level (college and above: OR = 7.598; 95% CI: 2.244–25.732) or children with poor healthy conditions (poor: OR = 6.864; 95% CI: 2.212–21.302) have much more negative perception of air quality. On the community level, industrial facilities, vehicles and city construction have major effects on parents’ perception of air quality. Our investigation provides baseline information for environmental policy researchers and makers regarding the public’s perception and expectation of air quality and the benefits to the environmental policy completing and enforcing. PMID:27187432

  10. Proposal for a Vehicle Level Test Procedure to Measure Air Conditioning Fuel Use

    SciTech Connect

    Rugh, J. P.

    2010-04-01

    The air-conditioning (A/C) compressor load significantly impacts the fuel economy of conventional vehicles and the fuel use/range of plug-in hybrid electric vehicles (PHEV). A National Renewable Energy Laboratory (NREL) vehicle performance analysis shows the operation of the air conditioner reduces the charge depletion range of a 40-mile range PHEV from 18% to 30% in a worst case hot environment. Designing for air conditioning electrical loads impacts PHEV and electric vehicle (EV) energy storage system size and cost. While automobile manufacturers have climate control procedures to assess A/C performance, and the U.S. EPA has the SCO3 drive cycle to measure indirect A/C emissions, there is no automotive industry consensus on a vehicle level A/C fuel use test procedure. With increasing attention on A/C fuel use due to increased regulatory activities and the development of PHEVs and EVs, a test procedure is needed to accurately assess the impact of climate control loads. A vehicle thermal soak period is recommended, with solar lamps that meet the SCO3 requirements or an alternative heating method such as portable electric heaters. After soaking, the vehicle is operated over repeated drive cycles or at a constant speed until steady-state cabin air temperature is attained. With this method, the cooldown and steady-state A/C fuel use are measured. This method can be run at either different ambient temperatures to provide data for the GREEN-MAC-LCCP model temperature bins or at a single representative ambient temperature. Vehicles with automatic climate systems are allowed to control as designed, while vehicles with manual climate systems are adjusted to approximate expected climate control settings. An A/C off test is also run for all drive profiles. This procedure measures approximate real-world A/C fuel use and assess the impact of thermal load reduction strategies.

  11. Using Mobile Monitoring to Assess Spatial Variability in Urban Air Pollution Levels: Opportunities and Challenges (Invited)

    NASA Astrophysics Data System (ADS)

    Larson, T.

    2010-12-01

    Measuring air pollution concentrations from a moving platform is not a new idea. Historically, however, most information on the spatial variability of air pollutants have been derived from fixed site networks operating simultaneously over space. While this approach has obvious advantages from a regulatory perspective, with the increasing need to understand ever finer scales of spatial variability in urban pollution levels, the use of mobile monitoring to supplement fixed site networks has received increasing attention. Here we present examples of the use of this approach: 1) to assess existing fixed-site fine particle networks in Seattle, WA, including the establishment of new fixed-site monitoring locations; 2) to assess the effectiveness of a regulatory intervention, a wood stove burning ban, on the reduction of fine particle levels in the greater Puget Sound region; and 3) to assess spatial variability of both wood smoke and mobile source impacts in both Vancouver, B.C. and Tacoma, WA. Deducing spatial information from the inherently spatio-temporal measurements taken from a mobile platform is an area that deserves further attention. We discuss the use of “fuzzy” points to address the fine-scale spatio-temporal variability in the concentration of mobile source pollutants, specifically to deduce the broader distribution and sources of fine particle soot in the summer in Vancouver, B.C. We also discuss the use of principal component analysis to assess the spatial variability in multivariate, source-related features deduced from simultaneous measurements of light scattering, light absorption and particle-bound PAHs in Tacoma, WA. With increasing miniaturization and decreasing power requirements of air monitoring instruments, the number of simultaneous measurements that can easily be made from a mobile platform is rapidly increasing. Hopefully the methods used to design mobile monitoring experiments for differing purposes, and the methods used to interpret those

  12. Levels of selected metals in ambient air PM10 in an urban site of Zaragoza (Spain).

    PubMed

    López, J M; Callén, M S; Murillo, R; García, T; Navarro, M V; de la Cruz, M T; Mastral, A M

    2005-09-01

    An assessment of the air quality of Zaragoza (Spain) was performed by determining the trace element content in airborne PM10 in a sampling campaign from July 2001 to July 2002. Samples were collected in a heavy traffic area with a high volume air sampler provided with a PM10 cutoff inlet. The levels of 16 elements (Al, Ba, Ca, Co, Cr, Cu, Fe, K, Mg, Mn, Na, Ni, Pb, Sr, V, and Zn) were quantified after collecting the PM10 on Teflon-coated glass fiber filters (GFF). Regarding the PM10, 32% exceedance of the proposed PM10 daily limit was obtained, some of them corresponding to summer and autumn periods. The limit values of toxic trace elements from US-EPA, WHO, and EC were not exceeded, considering Zaragoza as a moderately polluted city under the current air quality guidelines. The contribution of anthropogenic sources to atmospheric elemental levels was reflected by the high values of enrichment factors for Zn, Pb, and Cu compared to the average crustal composition. Statistical analyses also determined the contribution of different sources to the PM10, finding that vehicle traffic and anthropogenic emissions related to combustion and industrial processes were the main pollutant sources as well as natural sources associated with transport of dust from Africa for specific dates. Regarding the influence of meteorological conditions on PM10 and trace elements concentrations, it was found that calm weather conditions with low wind speed favor the PM10 collection and the pollution for trace elements, suggesting the influence of local sources. PMID:16053928

  13. Evaluating near highway air pollutant levels and estimating emission factors: Case study of Tehran, Iran.

    PubMed

    Nayeb Yazdi, Mohammad; Delavarrafiee, Maryam; Arhami, Mohammad

    2015-12-15

    A field sampling campaign was implemented to evaluate the variation in air pollutants levels near a highway in Tehran, Iran (Hemmat highway). The field measurements were used to estimate road link-based emission factors for average vehicle fleet. These factors were compared with results of an in tunnel measurement campaign (in Resalat tunnel). Roadside and in-tunnel measurements of carbon monoxide (CO) and size-fractionated particulate matter (PM) were conducted during the field campaign. The concentration gradient diagrams showed exponential decay, which represented a substantial decay, more than 50-80%, in air pollutants level in a distance between 100 and 150meters (m) of the highway. The changes in particle size distribution by distancing from highway were also captured and evaluated. The results showed particle size distribution shifted to larger size particles by distancing from highway. The empirical emission factors were obtained by using the roadside and in tunnel measurements with a hypothetical box model, floating machine model, CALINE4, CT-EMFAC or COPERT. Average CO emission factors were estimated to be in a range of 4 to 12g/km, and those of PM10 were 0.1 to 0.2g/km, depending on traffic conditions. Variations of these emission factors under real working condition with speeds were determined. PMID:26318222

  14. Improving Neural Network Prediction Accuracy for PM10 Individual Air Quality Index Pollution Levels

    PubMed Central

    Feng, Qi; Wu, Shengjun; Du, Yun; Xue, Huaiping; Xiao, Fei; Ban, Xuan; Li, Xiaodong

    2013-01-01

    Abstract Fugitive dust deriving from construction sites is a serious local source of particulate matter (PM) that leads to air pollution in cities undergoing rapid urbanization in China. In spite of this fact, no study has yet been published relating to prediction of high levels of PM with diameters <10 μm (PM10) as adjudicated by the Individual Air Quality Index (IAQI) on fugitive dust from nearby construction sites. To combat this problem, the Construction Influence Index (Ci) is introduced in this article to improve forecasting models based on three neural network models (multilayer perceptron, Elman, and support vector machine) in predicting daily PM10 IAQI one day in advance. To obtain acceptable forecasting accuracy, measured time series data were decomposed into wavelet representations and wavelet coefficients were predicted. Effectiveness of these forecasters were tested using a time series recorded between January 1, 2005, and December 31, 2011, at six monitoring stations situated within the urban area of the city of Wuhan, China. Experimental trials showed that the improved models provided low root mean square error values and mean absolute error values in comparison to the original models. In addition, these improved models resulted in higher values of coefficients of determination and AHPC (the accuracy rate of high PM10 IAQI caused by nearby construction activity) compared to the original models when predicting high PM10 IAQI levels attributable to fugitive dust from nearby construction sites. PMID:24381481

  15. Reduced gene expression levels after chronic exposure to high concentrations of air pollutants.

    PubMed

    Rossner, Pavel; Tulupova, Elena; Rossnerova, Andrea; Libalova, Helena; Honkova, Katerina; Gmuender, Hans; Pastorkova, Anna; Svecova, Vlasta; Topinka, Jan; Sram, Radim J

    2015-10-01

    We analyzed the ability of particulate matter (PM) and chemicals adsorbed onto it to induce diverse gene expression profiles in subjects living in two regions of the Czech Republic differing in levels and sources of the air pollution. A total of 312 samples from polluted Ostrava region and 154 control samples from Prague were collected in winter 2009, summer 2009 and winter 2010. The highest concentrations of air pollutants were detected in winter 2010 when the subjects were exposed to: PM of aerodynamic diameter <2.5μm (PM2.5) (70 vs. 44.9μg/m(3)); benzo[a]pyrene (9.02 vs. 2.56ng/m(3)) and benzene (10.2 vs. 5.5μg/m(3)) in Ostrava and Prague, respectively. Global gene expression analysis of total RNA extracted from leukocytes was performed using Illumina Expression BeadChips microarrays. The expression of selected genes was verified by quantitative real-time PCR (qRT-PCR). Gene expression profiles differed by locations and seasons. Despite lower concentrations of air pollutants a higher number of differentially expressed genes and affected KEGG (Kyoto Encyclopedia of Genes and Genomes) pathways was found in subjects from Prague. In both locations immune response pathways were affected, in Prague also neurodegenerative diseases-related pathways. Over-representation of the latter pathways was associated with the exposure to PM2.5. The qRT-PCR analysis showed a significant decrease in expression of APEX, ATM, FAS, GSTM1, IL1B and RAD21 in subjects from Ostrava, in a comparison of winter 2010 and summer 2009. In Prague, an increase in gene expression was observed for GADD45A and PTGS2. In conclusion, high concentrations of pollutants in Ostrava were not associated with higher number of differentially expressed genes, affected KEGG pathways and expression levels of selected genes. This observation suggests that chronic exposure to air pollution may result in reduced gene expression response with possible negative health consequences. PMID:26298100

  16. Serum 2,3,7,8-tetrachlorodibenzo-p-dioxin levels in Air Force health study participants - preliminary report

    SciTech Connect

    Not Available

    1988-06-24

    In 1978, the US Air Force responded to a congressional mandate to initiate an epidemiologic study of the possible health effects of exposure to herbicides and their 2,3,7,8-tetrachlorodibenzo-p-dioxin (TCDD) contaminants in Air Force veterans who served in the Ranch Hand defoliation operation during the Vietnam conflict. Accordingly, the Air Force conducted a nonconcurrent prospective study, the Air Force Health Study, of all 1267 members of the Ranch Hand unit and a series of matched controls. This phase of the Air Force study focused on measuring serum TCDD levels in 150 Ranch Hand veterans and 50 controls. All participants were enlisted men; the Ranch Hand veterans had been either herbicide loaders or herbicide specialists in Vietnam. The demographic and health characteristics of Ranch Hand personnel and controls were similar; however, their serum TCDD levels differed markedly.

  17. Sea level oscillations in coastal waters of the Buenos Aires province, Argentina

    NASA Astrophysics Data System (ADS)

    Dragani, W. C.; Mazio, C. A.; Nuñez, M. N.

    2002-03-01

    Sea level oscillations, with periods ranging from a few minutes to almost 2 h, have been observed at various tide stations located on the coast of Buenos Aires. Simultaneous records of sea level elevation measured in Mar de Ajó, Pinamar and Mar del Plata during 1982 have been spectrally analyzed. Significant spectral energy has been detected between 0.85 and 4.69 cycles per hour (cph) and the most energetic peaks have frequencies between 1.17 and 1.49 cph. Spectra, coherence, and phase difference have been analyzed for the most energetic event of the year. During that event, the most intensive spectral peak is at 1.17 cph for Mar de Ajó and Pinamar, and at 1.49 cph for Mar del Plata. Simultaneous total energy peaks at Mar de Ajó, Pinamar and Mar del Plata, and the coherence function estimated between Mar de Ajó and Pinamar suggests that sea level oscillations could be a regional phenomenon. The analyzed data suggest that sea level oscillations could be forced by atmospheric gravity waves associated with frontal passages.

  18. Low-level air pollution and upper respiratory infections in children.

    PubMed Central

    Jaakkola, J J; Paunio, M; Virtanen, M; Heinonen, O P

    1991-01-01

    Effects of low-level air pollution were studied in one polluted city and two reference cities in northern Finland by comparing the frequency of upper respiratory infections over a 12-month period in 1982 as reported by parents of children ages 14 through 18 months (n = 679) and 6 years (n = 759). A similar comparison was carried out between children living in the more polluted and less polluted areas of the polluted city. The annual mean and the greatest half-hour concentrations of sulfur dioxide (23 and 807 micrograms/m3), particulates (31 and 291 micrograms/m3), nitrogen oxides (15 and 160 micrograms/m3), and hydrogen sulfide (2 and 177 micrograms/m3) in the polluted city were mainly due to industrial sources. In the reference cities, air pollution was produced mainly by traffic and heating. Adjusted odds ratios (OR) for one or more upper respiratory infections of residents in the polluted city vs those in the reference cities were 2.0 (95% confidence interval [CI] = 1.3-3.2) in the younger age group and 1.6 (95% CI = 1.1-2.1) in the older age group. Within the polluted city, OR calculated for living in more vs less polluted areas were 2.0 (95% CI = 1.0-4.0) in the younger and 1.6 (95% CI = 1.0-2.7) in the older children. The present results suggests that, for children, air pollution can be hazardous in concentrations lower than those recorded in earlier studies from Britain and central Europe. The synergistic effect of sulfur dioxide, particulates, nitrogen oxides, hydrogen sulfide, and other pollutants may be a contributing factor. PMID:1854003

  19. Reducing the emission of ozone depleting chemicals through use of a self-cleaning soldering process

    SciTech Connect

    Lichtenberg, L.; Martin, G.; Van Buren, P.; Iman, R.; Paffett, M.T.

    1991-12-31

    Motorola has jointed with Sandia and Los Alamos National Laboratories to perform work under a Cooperative Research and Development Agreement (CRADA) to reduce the use of CFC`s and other ozone depleting printing wiring board (PWB) cleaning solvents. This study evaluated the use of a new soldering process that uses dilute adipic acid in lieu of rosin flux. The process consumes the adipic acid in lieu of rosin flux. The process consumes the adipic acid during the soldering process and precludes the need for subsequent cleaning with ozone depleting solvents. This paper presents results from a series of designed experiments that evaluated PWB cleanliness as a function of various levels of machine control parameters. The study included a comprehensive hardware reliability evaluation, which included environmental conditioning, cleanliness testing, surface chemical analysis, surface insulation resistance testing, along with electrical, mechanical and long term storage testing. The results of this study that the new process produces quality, reliable hardware over a wide range of processing parameters. Adoption of this process, which eliminates the need for supplemental cleaning, will have a positive impact on many environmental problems, including depletion of the ozone layer.

  20. Reducing the emission of ozone depleting chemicals through use of a self-cleaning soldering process

    SciTech Connect

    Lichtenberg, L.; Martin, G.; Van Buren, P. . Government Electronics Group); Iman, R. ); Paffett, M.T. )

    1991-01-01

    Motorola has jointed with Sandia and Los Alamos National Laboratories to perform work under a Cooperative Research and Development Agreement (CRADA) to reduce the use of CFC's and other ozone depleting printing wiring board (PWB) cleaning solvents. This study evaluated the use of a new soldering process that uses dilute adipic acid in lieu of rosin flux. The process consumes the adipic acid in lieu of rosin flux. The process consumes the adipic acid during the soldering process and precludes the need for subsequent cleaning with ozone depleting solvents. This paper presents results from a series of designed experiments that evaluated PWB cleanliness as a function of various levels of machine control parameters. The study included a comprehensive hardware reliability evaluation, which included environmental conditioning, cleanliness testing, surface chemical analysis, surface insulation resistance testing, along with electrical, mechanical and long term storage testing. The results of this study that the new process produces quality, reliable hardware over a wide range of processing parameters. Adoption of this process, which eliminates the need for supplemental cleaning, will have a positive impact on many environmental problems, including depletion of the ozone layer.

  1. Thermal control by artificial vision during hf soldering of metallic tubes

    NASA Astrophysics Data System (ADS)

    Renier, Eric; Suzeau, P.; Truchetet, Frederic

    1997-04-01

    Many welding processes have been successively developed, used, and then left aside in favor of more recent ones. The current processes are welding by induction, at high or medium frequency, and welding by conduction. The procedure used during the application described herein is the high frequency soldering by induction which allows high production speed, contactless heating, and regularity and good quality of the weld, and therefore a significant advantage: the economy of electrical energy. The speed limit of the soldering is principally imposed by a good drive of the metal sheet in the profiling machine. Presently, the regulation or control parameters measured during the process are, either the voltage at the output of the H.F. power generator or the temperature measured with a bicolor pyrometer situated above the melted borders. The use of temperature as the control parameters, allows to stabilize faster the process. We propose herein a new method and approach which consists in controlling the temperature during the process with a thermal image acquisition system. Our system is composed of a CCD sensor, an acquisition card, an association of optic filters in order to capture some thermographic images. Then, applying and developing some low and high level image processings, we extract some spatial and thermal parameters which allow us to control in real time and with a low cost the welding process.

  2. Developing Community-Level Policy and Practice to Reduce Traffic-Related Air Pollution Exposure

    PubMed Central

    Brugge, Doug; Patton, Allison P.; Bob, Alex; Reisner, Ellin; Lowe, Lydia; Bright, Oliver-John M.; Durant, John L.; Newman, Jim; Zamore, Wig

    2016-01-01

    The literature consistently shows associations of adverse cardiovascular and pulmonary outcomes with residential proximity to highways and major roadways. Air monitoring shows that traffic-related pollutants (TRAP) are elevated within 200–400 m of these roads. Community-level tactics for reducing exposure include the following: 1) HEPA filtration; 2) Appropriate air-intake locations; 3) Sound proofing, insulation and other features; 4) Land-use buffers; 5) Vegetation or wall barriers; 6) Street-side trees, hedges and vegetation; 7) Decking over highways; 8) Urban design including placement of buildings; 9) Garden and park locations; and 10) Active travel locations, including bicycling and walking paths. A multidisciplinary design charrette was held to test the feasibility of incorporating these tactics into near-highway housing and school developments that were in the planning stages. The resulting designs successfully utilized many of the protective tactics and also led to engagement with the designers and developers of the sites. There is a need to increase awareness of TRAP in terms of building design and urban planning. PMID:27413416

  3. Association between State Assistance on the Topic of Indoor Air Quality and School District-Level Policies That Promote Indoor Air Quality in Schools

    ERIC Educational Resources Information Center

    Everett Jones, Sherry; Doroski, Brenda; Glick, Sherry

    2015-01-01

    Nationally representative data from the 2012 School Health Policies and Practices Study examined whether state assistance on indoor air quality (IAQ) was associated with district-level policies and practices related to IAQ and integrated pest management (IPM). Districts in states that provided assistance on IAQ were more likely than districts not…

  4. Wettability and Reaction between Solder and Silver Busbar during the Tabbing Process for Silicon Photovoltaic Modules

    NASA Astrophysics Data System (ADS)

    Lee, Beom-Yong; Hoang, Thi-Lien; Cho, Sung-Bin; Huh, Joo-Youl; Lee, Young-Sik

    2012-10-01

    The soldering quality of a Cu ribbon onto the Ag busbars of solar cells is one of the key factors affecting the cell-to-module loss and durability of a silicon photovoltaic module. In this study, we examined the effects of the surface chemistry and morphology of the screen-printed Ag busbars on the solder wettability and bonding uniformity of the Cu ribbon over the length of the busbar during the tabbing process. The surface of the as-fired Ag busbar was covered by a thin glass layer originating from the glass frit contained in the Ag paste. The presence of the thin glass layer significantly decreased the wettability of the solder, leading to the formation of voided regions at the solder/busbar interface. Although it had only a minor influence on solder wettability, increasing the roughness of the busbar surface resulted in the formation of more voided regions at the solder/busbar interface.

  5. Evaluation of advanced microelectronic fluxless solder-bump contacts for hybrid microcircuits

    NASA Technical Reports Server (NTRS)

    Mandal, R. P.

    1976-01-01

    Technology for interconnecting monolithic integrated circuit chips with other components is investigated. The advantages and disadvantages of the current flip-chip approach as compared to other interconnection methods are outlined. A fluxless solder-bump contact technology is evaluated. Multiple solder-bump contacts were formed on silicon integrated circuit chips. The solder-bumps, comprised of a rigid nickel under layer and a compliant solder overlayer, were electroformed onto gold device pads with the aid of thick dry film photomasks. Different solder alloys and the use of conductive epoxy for bonding were explored. Fluxless solder-bump bond quality and reliability were evaluated by measuring the effects of centrifuge, thermal cycling, and high temperature storage on bond visual characteristics, bond electrical continuity, and bond shear tests. The applicability and suitability of this technology for hybrid microelectronic packaging is discussed.

  6. Threshold current density of electromigration in eutectic SnPb solder

    SciTech Connect

    Yeh, Y.T.; Chou, C.K.; Hsu, Y.C.; Chen Chih; Tu, K.N.

    2005-05-16

    Electromigration has emerged as an important reliability issue in the microelectronics packaging industry since the dimension of solder joints has continued to shrink. In this letter, we report a technique that enables the precise measurement of the important parameters of solder electromigration, such as activation energy, critical length, threshold current density, effective charge numbers, and electromigration rate. Patterned Cu/Ti films in a Si trench were employed for eutectic SnPb solder to be reflowed on, and thus solder Blech specimens were fabricated. Atomic force microscope was used to measure the depletion volume caused by electromigration on the cathode end. The threshold current density is estimated to be 8.5x10{sup 3} A/cm{sup 2} at 100 deg. C, which relates directly to the maximum allowable current that a solder joint can carry without electromigration damage. This technique facilitates the scientifically systematic investigation of electromigration in solders.

  7. Effects of pre-stressing and flux on the flow of solder on PWB copper surfaces

    SciTech Connect

    Hernandez, C.L.; Hosking, F.M.

    1994-12-31

    A variety of test methods are available to evaluate the solderability of printed wiring board [PWB] surface finishes. A new test has been developed which better simulates the capillary flow physics of typical solder assembly processing, especially surface mount soldering. The work was conducted under a cooperative research and development agreement between Sandia National Laboratories, the National Center for Manufacturing Sciences, and several PWB fabricators (AT&T, IBM, Texas Instruments, and United Technologies Corporation/Hamilton Standard) to advance PWB interconnect systems technology. Particular attention has been given at Sandia to characterizing the effects of accelerated aging in a simulated indoor industrial environment on subsequent PWB solderability. The program`s baseline surface finish was copper. Solderability testing on ``as-fabricated`` and ``pre-stressed copper`` pad-strip geometries was performed with Sn-Pb eutectic solder and three different fluxes at four different reflow temperatures.

  8. A Well-Mixed Computational Model for Estimating Room Air Levels of Selected Constituents from E-Vapor Product Use

    PubMed Central

    Rostami, Ali A.; Pithawalla, Yezdi B.; Liu, Jianmin; Oldham, Michael J.; Wagner, Karl A.; Frost-Pineda, Kimberly; Sarkar, Mohamadi A.

    2016-01-01

    Concerns have been raised in the literature for the potential of secondhand exposure from e-vapor product (EVP) use. It would be difficult to experimentally determine the impact of various factors on secondhand exposure including, but not limited to, room characteristics (indoor space size, ventilation rate), device specifications (aerosol mass delivery, e-liquid composition), and use behavior (number of users and usage frequency). Therefore, a well-mixed computational model was developed to estimate the indoor levels of constituents from EVPs under a variety of conditions. The model is based on physical and thermodynamic interactions between aerosol, vapor, and air, similar to indoor air models referred to by the Environmental Protection Agency. The model results agree well with measured indoor air levels of nicotine from two sources: smoking machine-generated aerosol and aerosol exhaled from EVP use. Sensitivity analysis indicated that increasing air exchange rate reduces room air level of constituents, as more material is carried away. The effect of the amount of aerosol released into the space due to variability in exhalation was also evaluated. The model can estimate the room air level of constituents as a function of time, which may be used to assess the level of non-user exposure over time. PMID:27537903

  9. A Well-Mixed Computational Model for Estimating Room Air Levels of Selected Constituents from E-Vapor Product Use.

    PubMed

    Rostami, Ali A; Pithawalla, Yezdi B; Liu, Jianmin; Oldham, Michael J; Wagner, Karl A; Frost-Pineda, Kimberly; Sarkar, Mohamadi A

    2016-01-01

    Concerns have been raised in the literature for the potential of secondhand exposure from e-vapor product (EVP) use. It would be difficult to experimentally determine the impact of various factors on secondhand exposure including, but not limited to, room characteristics (indoor space size, ventilation rate), device specifications (aerosol mass delivery, e-liquid composition), and use behavior (number of users and usage frequency). Therefore, a well-mixed computational model was developed to estimate the indoor levels of constituents from EVPs under a variety of conditions. The model is based on physical and thermodynamic interactions between aerosol, vapor, and air, similar to indoor air models referred to by the Environmental Protection Agency. The model results agree well with measured indoor air levels of nicotine from two sources: smoking machine-generated aerosol and aerosol exhaled from EVP use. Sensitivity analysis indicated that increasing air exchange rate reduces room air level of constituents, as more material is carried away. The effect of the amount of aerosol released into the space due to variability in exhalation was also evaluated. The model can estimate the room air level of constituents as a function of time, which may be used to assess the level of non-user exposure over time. PMID:27537903

  10. SPONTANEOUS CATALYTIC WET AIR OXIDATION DURING PRE-TREATMENT OF HIGH-LEVEL RADIOACTIVE WASTE SLUDGE

    SciTech Connect

    Koopman, D.; Herman, C.; Pareizs, J.; Bannochie, C.; Best, D.; Bibler, N.; Fellinger, T.

    2009-10-01

    Savannah River Remediation, LLC (SRR) operates the Defense Waste Processing Facility for the U.S. Department of Energy at the Savannah River Site. This facility immobilizes high-level radioactive waste through vitrification following chemical pretreatment. Catalytic destruction of formate and oxalate ions to carbon dioxide has been observed during qualification testing of non-radioactive analog systems. Carbon dioxide production greatly exceeded hydrogen production, indicating the occurrence of a process other than the catalytic decomposition of formic acid. Statistical modeling was used to relate the new reaction chemistry to partial catalytic wet air oxidation of both formate and oxalate ions driven by the low concentrations of palladium, rhodium, and/or ruthenium in the waste. Variations in process conditions led to increases or decreases in the total oxidative destruction, as well as partially shifting the preferred species undergoing destruction from oxalate ion to formate ion.

  11. Air evacuation under high-level biosafety containment: the aeromedical isolation team.

    PubMed Central

    Christopher, G. W.; Eitzen, E. M.

    1999-01-01

    Military contingency operations in tropical environments and potential use of biological weapons by adversaries may place troops at risk for potentially lethal contagious infections (e.g., viral hemorrhagic fevers, plague, and zoonotic poxvirus infections). Diagnosis and treatment of such infections would be expedited by evacuating a limited number of patients to a facility with containment laboratories. To safely evacuate such patients by military aircraft and minimize the risk for transmission to air crews, caregivers, and civilians, the U.S. Army Medical Research Institute of Infectious Diseases maintains an aeromedical isolation team. This rapid response team, which has worldwide airlift capability designed to evacuate and manage patients under high-level containment, also offers a portable containment laboratory, limited environmental decontamination, and specialized consultative expertise. This article also examines technical aspects of the team's equipment, training, capabilities, and deployments. PMID:10221876

  12. Polycyclic aromatic hydrocarbons in air on small spatial and temporal scales - I. Levels and variabilities

    NASA Astrophysics Data System (ADS)

    Lammel, Gerhard; Klánová, Jana; Ilić, Predrag; Kohoutek, Jiří; Gasić, Bojan; Kovacić, Igor; Lakić, Nataša; Radić, Ranka

    2010-12-01

    Polycyclic aromatic hydrocarbons (PAHs) were measured together with inorganic air pollutants at two urban sites and one rural background site in the Banja Luka area, Bosnia and Hercegovina, during 72 h in July 2008 using a high time resolution (5 samples per day) with the aim to study the spatial and temporal variabilities and to explore the significance of averaging effects inherent to 24 h-sampling. Measurement uncertainty was quantified on basis of three independent side-by-side samplers, deployed at one of the sites. PAH abundances in the urban and rural environments differed largely. Levels at the urban sites exceeded the levels at the rural site by >100%. The discrepancy was largely dominated by emission of 3-4 ring PAHs in the city, while 5-6 ring PAHs were more evenly distributed between city sites and the hill site. During the night a higher fraction of the semivolatile PAHs might have been stored in the soil or sorbed to surfaces. PAH patterns were undistinguishable across the three sites. However, concentrations of more particle-associated substances differed significantly between the urban sites than between one of the urban sites and the rural site (3 σ uncertainty). Time-averaging (on a 24 h-basis) would have masked the significant inter-site differences of half of the substances which were found at different levels (on a 4 h-basis).

  13. Indoor air quality in Portuguese schools: levels and sources of pollutants.

    PubMed

    Madureira, J; Paciência, I; Pereira, C; Teixeira, J P; Fernandes, E de O

    2016-08-01

    Indoor air quality (IAQ) parameters in 73 primary classrooms in Porto were examined for the purpose of assessing levels of volatile organic compounds (VOCs), aldehydes, particulate matter, ventilation rates and bioaerosols within and between schools, and potential sources. Levels of VOCs, aldehydes, PM2.5 , PM10 , bacteria and fungi, carbon dioxide (CO2 ), carbon monoxide, temperature and relative humidity were measured indoors and outdoors and a walkthrough survey was performed concurrently. Ventilation rates were derived from CO2 and occupancy data. Concentrations of CO2 exceeding 1000 ppm were often encountered, indicating poor ventilation. Most VOCs had low concentrations (median of individual species <5 μg/m(3) ) and were below the respective WHO guidelines. Concentrations of particulate matter and culturable bacteria were frequently higher than guidelines/reference values. The variability of VOCs, aldehydes, bioaerosol concentrations, and CO2 levels between schools exceeded the variability within schools. These findings indicate that IAQ problems may persist in classrooms where pollutant sources exist and classrooms are poorly ventilated; source control strategies (related to building location, occupant behavior, maintenance/cleaning activities) are deemed to be the most reliable for the prevention of adverse health consequences in children in schools. PMID:26182845

  14. Impacts of traffic-induced lead emissions on air, soil and blood lead levels in Beirut.

    PubMed

    Hashisho, Z; El-Fadel, M

    2004-01-01

    Lead is a purely toxic heavy metal which induces a wide variety of adverse physiologic effects. Nevertheless, it has been mined and used for more than 8,000 years. Among the different contemporary sources of lead pollution, traffic-induced emissions from the combustion of leaded gasoline is of particular concern, as it can constitute more than 90 percent of total lead emissions into the atmosphere in congested urban areas where no phase-out activities have been adopted. Gasoline lead content and traffic volume are strongly correlated with concentrations of lead in various environmental media. In the absence of policies to reduce the use of lead in gasoline or to favor the use of unleaded gasoline, leaded gasoline remains the predominant grade in many countries. This paper assesses the status of lead pollution from the combustion of leaded gasoline in Beirut based on field measurements of lead in air and roadside dust of urban and rural/suburban areas and recent data on soil and blood lead levels. Average atmospheric lead concentrations was about 1.86 microg m(-3) at urban locations and 0.147 microg m(-3) at suburban locations. The analysis of roadside dust revealed an average lead level of 353 microg g(-1) along urban streets and 125 microg g(-1) along rural/suburban roads. Blood lead levels were also relatively high in comparison to countries where leaded gasoline has been phased-out. PMID:15074616

  15. Detecting nonuniformity in small welds and solder seams using optical correlation and electronic processing.

    PubMed

    Wagner, J W

    1981-10-15

    Using holographic matched filtering and electronic processing, small variations in surface displacement along the seam of a hermetic microcircuit package can be detected when the seam is stressed. Destructive analysis of a solder-sealed package reveals a strong correlation between optical signal variations and nonuniformity of solder adhesion and wetting along the seam. The technique promises potential application as a means of nondestructively inspecting for flaws in small welded or soldered seams. PMID:20372226

  16. Automated inspection of solder joints for surface mount technology

    NASA Technical Reports Server (NTRS)

    Savage, Robert M.; Park, Hyun Soo; Fan, Mark S.

    1993-01-01

    Researchers at NASA/GSFC evaluated various automated inspection systems (AIS) technologies using test boards with known defects in surface mount solder joints. These boards were complex and included almost every type of surface mount device typical of critical assemblies used for space flight applications: X-ray radiography; X-ray laminography; Ultrasonic Imaging; Optical Imaging; Laser Imaging; and Infrared Inspection. Vendors, representative of the different technologies, inspected the test boards with their particular machine. The results of the evaluation showed limitations of AIS. Furthermore, none of the AIS technologies evaluated proved to meet all of the inspection criteria for use in high-reliability applications. It was found that certain inspection systems could supplement but not replace manual inspection for low-volume, high-reliability, surface mount solder joints.

  17. Solder Interconnect Predictor (SIP) Software v. 0.5

    2008-11-19

    This software tool was developed for predicting the fatigue damage in a wide variety of 63Sn-37Pb solder joints used in electronics applications. This tool is based upon the unified creep plasticity damage model CompSIR developed at Sandia National Laboratories. The software can be used as a design tool for predicting the long term reliability of consumer, military and space electronics. Both service as well as accelerated testing environments can be addressed by the user. Themore » mesh generating function provides the user with the greater versatility to explore different package and I/O configurations. For example, different solder joint geometries can be investigated to determine the effects of workmanship quality on reliability. Graphical user interfaces provide the user with easy data input screens as well as results profiles.« less

  18. Solder Interconnect Predictor (SIP) Software v. 0.5

    SciTech Connect

    VIANCO, PAUL; NEILSEN, MICHAEL; & REJENT, JEROME

    2008-11-19

    This software tool was developed for predicting the fatigue damage in a wide variety of 63Sn-37Pb solder joints used in electronics applications. This tool is based upon the unified creep plasticity damage model CompSIR developed at Sandia National Laboratories. The software can be used as a design tool for predicting the long term reliability of consumer, military and space electronics. Both service as well as accelerated testing environments can be addressed by the user. The mesh generating function provides the user with the greater versatility to explore different package and I/O configurations. For example, different solder joint geometries can be investigated to determine the effects of workmanship quality on reliability. Graphical user interfaces provide the user with easy data input screens as well as results profiles.

  19. Automated inspection of solder joints for surface mount technology

    NASA Astrophysics Data System (ADS)

    Savage, Robert M.; Park, Hyun Soo; Fan, Mark S.

    1993-03-01

    Researchers at NASA/GSFC evaluated various automated inspection systems (AIS) technologies using test boards with known defects in surface mount solder joints. These boards were complex and included almost every type of surface mount device typical of critical assemblies used for space flight applications: X-ray radiography; X-ray laminography; Ultrasonic Imaging; Optical Imaging; Laser Imaging; and Infrared Inspection. Vendors, representative of the different technologies, inspected the test boards with their particular machine. The results of the evaluation showed limitations of AIS. Furthermore, none of the AIS technologies evaluated proved to meet all of the inspection criteria for use in high-reliability applications. It was found that certain inspection systems could supplement but not replace manual inspection for low-volume, high-reliability, surface mount solder joints.

  20. Application of CO2 laser for electronic components soldering

    NASA Astrophysics Data System (ADS)

    Mascorro-Pantoja, J.; Soto-Bernal, J. J.; Nieto-Pérez, M.; Gonzalez-Mota, R.; Rosales-Candelas, I.

    2011-10-01

    Laser provides a high controllable and localized spot for soldering joint formation and this is a valuable tool in Sn/Pb Soldering process on electronic industry, in recent years, laser beam welding has become an emerging welding technique, the use of laser in welding area is a high efficiency method. A 60 Watts CO2 continuous laser was used on this study, during welding experimental results indicated the laser could significantly improve speed and weld quality. In this work, the welding interactions of CO2 laser with Sn/Pb wire have been investigated in details through varying the energy ratios of laser. And at the same time, the effect of distance from laser spot to material.

  1. Urban morphology and air quality in dense residential environments in Hong Kong. Part I: District-level analysis

    NASA Astrophysics Data System (ADS)

    Edussuriya, P.; Chan, A.; Ye, A.

    2011-09-01

    The link between urban morphology and air quality in various dense residential environments of Hong Kong are investigated through field measurements and statistical analysis. With regard to the myriads of parameters available in the literature, this study aims to identify the most important urban morphological parameters in the street-level and district levels that affect air quality dispersion in Hong Kong. The study postulates that there is an association between urban morphology and urban air quality and a statistical model is developed to explain the relationship amongst urban air quality, micro-meteorology and urban morphological dimension. The study considered 20 different urban residential areas in five major districts of Hong Kong and real-time street-level air pollutant and microclimatic data are collected. 21 morphological variables are identified and calculated based on the geometry of the urban fabric. This study is the first part of a series which focuses to identify whether district demarcation is correlated with air quality. According to the findings of statistical analysis, only 6 out of 21 morphological variables (complete aspect ratio, occlusivity, roughness height, zero-plane displacement height, total building volume/number of buildings, and standard deviation of height) report distinguishable variability at the district level. Their R2 (correlation coefficient) values vary from 0.2937 (plan area index) to 0.5457 (occlusivity) which is considered moderate to high. All these parameters describe the overall feature of the site rather than the specific geometric features of the street. It translates to the fact that in spite of the large in-district variations in morphological variables amongst the five districts, air pollution variations are insignificant for most of the variables and it means that air quality in Hong Kong are distinguishable not by district-level variable but rather in-site fabrics.

  2. Role of Ag in the formation of interfacial intermetallic phases in Sn-Zn soldering

    NASA Astrophysics Data System (ADS)

    Song, Jenn-Ming; Liu, Pei-Chi; Shih, Chia-Ling; Lin, Kwang-Lung

    2005-09-01

    This study explored the effect of Ag as the substrate or alloying element of solders on the interfacial reaction in Sn-Zn soldering. Results show that instead of Ag-Sn compounds, ζ-AgZn and γ-Ag5Zn8 form at the Sn-Zn/Ag interface. The addition of Ag in Sn-Zn solders leads to the precipitation of ɛ-AgZn3 from the liquid solder on preformed interfacial intermetallics. The morphology of this additional AgZn3 is closely related to the solidification process of Ag-Zn intermetallics and the under intermetallic layer.

  3. An Evaluation of Prototype Circuit Boards Assembled with a Sn-Ag Bi Solder

    SciTech Connect

    ARTAKI,I.; RAY,U.; REJENT,JEROME A.; VIANCO,PAUL T.

    1999-09-01

    An evaluation was performed which examined the aging of surface mount solder joints assembled with 91.84Sn-3.33Ag-4.83Bi solder. Defect analysis of the as-fabricated test vehicles revealed excellent solderability, good package alignment, and a minimum number of voids. Continuous DC electrical monitoring of the solder joints did not reveal opens during as many as 10,000 thermal cycles (0 C, 100 C). The solder joints exhibited no significant degradation through 2500 cycles, based upon an absence of microstructural damage and sustained shear and pull strengths of chip capacitors and J-leaded solder joints, respectively. Thermal cycles of 5000 and 10,000 resulted in some surface cracking of the solder fillets and coatings. In a few cases, deeper cracks were observed in the thinner reaches of several solder fillets. There was no deformation or cracking in the solder located in the gap between the package I/O and the circuit board pad nor in the interior of the fillets, both locations that would raise concerns of joint mechanical integrity. A drop in the chip capacitor shear strength was attributed to crack growth near the top of the fillet.

  4. An improved mathematical model for prediction of air quantity to minimise radiation levels in underground uranium mines.

    PubMed

    Panigrahi, Durga Charan; Sahu, Patitapaban; Mishra, Devi Prasad

    2015-02-01

    Ventilation is the primary means of controlling radon and its daughter concentrations in an underground uranium mine environment. Therefore, prediction of air quantity is the vital component for planning and designing of ventilation systems to minimise the radiation exposure of miners in underground uranium mines. This paper comprehensively describes the derivation and verification of an improved mathematical model for prediction of air quantity, based on the growth of radon daughters in terms of potential alpha energy concentration (PAEC), to reduce the radiation levels in uranium mines. The model also explains the prediction of air quantity depending upon the quality of intake air to the stopes. This model can be used to evaluate the contribution of different sources to radon concentration in mine atmosphere based on the measurements of radon emanation and exhalation. Moreover, a mathematical relationship has been established for quick prediction of air quantity to achieve the desired radon daughter concentration in the mines. PMID:25461521

  5. Solder joint fatigue analysis under low temperature Martian conditions

    NASA Technical Reports Server (NTRS)

    Tudryn, Carissa

    2006-01-01

    Electronics, without requiring heater power or enclosure in a centralized 'warm electronics box,' will need to survive mean surface temperatures of -120 degrees Celsius to +20 degrees Celsius for an extended Martian mission and an operational temperature up to 85 degrees Celsisus. Since these electronics will need to survive extended cycles under these conditions, fatigue is a significant concern. The solder joint reliability of connectors on a printed wiring board was investigated.

  6. Predicted ball grid array thermal response during reflow soldering

    SciTech Connect

    Voth, T.E.; Bergman, T.L.

    1995-12-31

    A numerical model is developed to predict the detailed thermomechanical response of a BGA assembly during reflow soldering. The governing coupled solid mechanics and heat diffusion equations are solved using a commercially available finite element package. Reported predictions illustrate the system`s sensitivity to both thermal and mechanical processing conditions, as well as component thermal properties. Specifically, assemblies with components of high thermal conductivity show the greatest sensitivity to mechanical loading conditions.

  7. Mechanisms of Soldering Formation on Coated Core Pins

    NASA Astrophysics Data System (ADS)

    Song, Jie; Denouden, Tony; Han, Qingyou

    2012-02-01

    Die soldering is one of the major casting defects during the high-pressure die casting (HPDC) process, causing dimensional inaccuracy of the castings and increased downtimes of the HPDC machine. In this study, we analyzed actually failed core pins to determine the mechanism of soldering and its procedures. The results show that the soldering process starts from a local coating failure, involves a series of intermetallic phase formation from reactions between molten aluminum alloys and the H13 steel pin, and accelerates when an aluminum-rich, face-centered cubic (fcc) phase is formed between the intermetallic phases. It is the formation of the aluminum-rich fcc phase in the reaction region that joins the core pin with the casting, resulting in the sticking of the casting to the core pin. When undercuts are formed on the core pin, the ejection of castings from the die will lead to either a core pin failure or damages to the casting being ejected.

  8. Cartan's soldered spaces and conservation laws in physics

    NASA Astrophysics Data System (ADS)

    Kouneiher, Joseph; Barbachoux, Cécile

    2015-06-01

    In this paper, we will introduce a generalized soldering p-forms geometry, which can be the right framework to describe many new approaches and concepts in modern physics. Here we will treat some aspects of the theory of local cohomology in fields theory or more precisely the theory of soldering-form conservation laws in physics. We provide some illustrative applications, primarily taken from the Einstein equations of general theory of relativity and Yang-Mills theory. This theory can be considered to be a generalization of Noether's theory of conserved current to differential forms of any degree. An essential result of this, is that the conservation of the energy-momentum in general relativity, is linked to the fact that the vacuum field equations are equivalent to the integrability conditions of a first-order system of differential equations. We also apply the idea of the soldered space and the integrability conditions to the case of Yang-Mills theory. The mathematical framework, where these intuitive considerations would fit naturally, can be used to describe also the dynamics of changing manifolds.

  9. Layer growth in Au-Pb/In solder joints

    SciTech Connect

    Yost, F.G.; Ganyard, F.P.; Karnowsky, M.M.

    1986-01-01

    The solid state reaction between a Pb-In solder alloy and thin film Au has been investigated at ten aging temperatures ranging from 70 to 170/sup 0/C. Also, bulk Au-solder samples were aged at 150/sup 0/C for metallographic analysis. No significant difference was found between the aging behavior of thin and bulk Au specimens. A thin single phase layer of Au/sub 9/In/sub 4/ was found adjacent to Au while a thick two-phase layer of AuIn/sub 2/ and Pb was found between Au/sub 9/In/sub 4/ and solder. The Pb phase was shown to have considerable mobility and able to ripen at room temperature. Peculiar planar interface instabilities and voids in the Au-Au/sub 9/In/sub 4/ interface were found. The total layer thickness was found to vary linearly with aging time, indicating an interface-controlled reaction. An activation energy of 14,000 calories per mole was found by regression analysis of the kinetic data.

  10. Laser-assisted solder closure of bronchial stumps

    NASA Astrophysics Data System (ADS)

    Oz, Mehmet C.; Williams, Matthew R.; Moscarelli, Richard D.; Kaynar, Murat; Fras, Christian I.; Libutti, Steven K.; Smith, Hillary; Setton, Adrianne J.; Treat, Michael R.; Nowygrod, Roman

    1992-06-01

    Broncho-pleural fistula is a difficult clinical problem without a simple solution. Laser-assisted solder techniques potentially offer a means to precisely fix tissue glues into the fistulae through a bronchoscopic approach. Using a canine model, secondary bronchi were sealed with cryoprecipitate made from solvent/detergent treated plasma (treated to inactivate membrane enveloped virus) mixed with indocyanine green (absorption 805 nm). Diode laser energy (emission 808 nm, 7.3 W/cm2) was applied to the solder until desiccation was observed. Leakage pressures ranged between 18 - 86 mmHg with a mean of 46 +/- 24 mmHg. Laser-assisted solder techniques provide a reliably strong seal over leaking bronchial stumps and use of dye enhancement prevents undesired collateral thermal injury to surrounding bronchial tissue. Solvent/detergent plasma, prepared by methods shown to inactivate large quantities of HIV, HBV, and HCV, is an effective source of cyroprecipitate and should allow widespread use of pooled human material in a clinical setting.

  11. An objective classification system of air mass types for Szeged, Hungary, with special attention to plant pollen levels.

    PubMed

    Makra, László; Juhász, Miklós; Mika, János; Bartzokas, Aristides; Béczi, Rita; Sümeghy, Zoltán

    2006-07-01

    This paper discusses the characteristic air mass types over the Carpathian Basin in relation to plant pollen levels over annual pollination periods. Based on the European Centre for Medium-Range Weather Forecasts dataset, daily sea-level pressure fields analysed at 00 UTC were prepared for each air mass type (cluster) in order to relate sea-level pressure patterns to pollen levels in Szeged, Hungary. The database comprises daily values of 12 meteorological parameters and daily pollen concentrations of 24 species for their pollination periods from 1997 to 2001. Characteristic air mass types were objectively defined via factor analysis and cluster analysis. According to the results, nine air mass types (clusters) were detected for pollination periods of the year corresponding to pollen levels that appear with higher concentration when irradiance is moderate while wind speed is moderate or high. This is the case when an anticyclone prevails in the region west of the Carpathian Basin and when Hungary is under the influence of zonal currents (wind speed is high). The sea level pressure systems associated with low pollen concentrations are mostly similar to those connected to higher pollen concentrations, and arise when wind speed is low or moderate. Low pollen levels occur when an anticyclone prevails in the region west of the Carpathian Basin, as well as when an anticyclone covers the region with Hungary at its centre. Hence, anticyclonic or anticyclonic ridge weather situations seem to be relevant in classifying pollen levels. PMID:16575583

  12. On evaluating compliance with air pollution levels not to be exceeded more than once per year

    NASA Technical Reports Server (NTRS)

    Neustadter, H. E.; Sidik, S. M.

    1974-01-01

    The adequacy is considered of currently practiced monitoring and data reduction techniques for assessing compliance with 24-hour Air Quality Standards (AQS) not to be exceeded more than once per year. The present situation for suspended particulates is discussed. The following conclusions are reached: (1) For typical less than daily sampling (i.e., 60 to 120 24-hour samples per year) the deviation from independence of the data set should not be substantial. (2) The interchange of exponentiation and expectation operations in the EPA data reduction model, underestimates the second highest level by about 4 to 8 percent for typical sigma values. (3) Estimates of the second highest pollution level have associated with them a large statistical variability arising from the finite size of the sample. The 0.95 confidence interval ranges from + or - 40 percent for 120 samples per year to + or - 84 percent for 30 samples per year. (4) The design value suggested by EPA for abatement and/or control planning purposes typically gives a margin of safety of 60 to 120 percent.

  13. Exploring EKC, trends of growth patterns and air pollutants concentration level in Malaysia: A Nemerow Index Approach

    NASA Astrophysics Data System (ADS)

    Bekhet, Hussain A.; >Tahira Yasmin,

    2013-06-01

    The present study examines an Environmental Kuznets Curve (EKC) hypothesis by analyzing annual data of air pollutants concentartion and per capita GDP as economic indicator over the (1996-2010) period in Malaysia. Nemerow Index Approach (I) used to generate a measures of air pollution. The results show that ambient air quality indicators supports the EKC hypothesis which stated that pollution levels increase as a country develops, but begin to decrease as rising incomes pass beyond a turning poin. Also, the I result is justifying that most pollutants are showing value less than 1.

  14. Morphology and Shear Strength of Lead-Free Solder Joints with Sn3.0Ag0.5Cu Solder Paste Reinforced with Ceramic Nanoparticles

    NASA Astrophysics Data System (ADS)

    Yakymovych, A.; Plevachuk, Yu.; Švec, P.; Švec, P.; Janičkovič, D.; Šebo, P.; Beronská, N.; Roshanghias, A.; Ipser, H.

    2016-08-01

    To date, additions of different oxide nanoparticles is one of the most widespread procedures to improve the mechanical properties of metals and metal alloys. This research deals with the effect of minor ceramic nanoparticle additions (SiO2, TiO2 and ZrO2) on the microstructure and mechanical properties of Cu/solder/Cu joints. The reinforced Sn3.0Ag0.5Cu (SAC305) solder alloy with 0.5 wt.% and 1.0 wt.% of ceramic nanoparticles was prepared through mechanically stirring. The microstructure of as-solidified Cu/solder/Cu joints was studied using scanning electron microscopy. The additions of ceramic nanoparticles suppressed the growth of the intermetallic compound layer Cu6Sn5 at the interface solder/Cu and improved the microstructure of the joints. Furthermore, measurements of mechanical properties showed improved shear strength of Cu/composite solder/Cu joints compared to joints with unreinforced solder. This fact related to all investigated ceramic nanoinclusions and should be attributed to the adsorption of nanoparticles on the grain surface during solidification. However, this effect is less pronounced on increasing the nanoinclusion content from 0.5 wt.% to 1.0 wt.% due to agglomeration of nanoparticles. Moreover, a comparison analysis showed that the most beneficial influence was obtained by minor additions of SiO2 nanoparticles into the SAC305 solder alloy.

  15. The effect of lead content and surface roughness on wetting and spreading of low-lead and no-lead solders on copper-clad FR-4 laminates

    SciTech Connect

    Stevenson, J.O.; Roberts, J.L.; Davidson, R.N.; Yost, F.G.; Hosking, F.M.

    1997-02-01

    Environmental and health concerns pertaining to lead have encouraged research into low-lead alloys for electronic soldering. The development of solder alloys containing lower amounts of lead than Sn/Pb eutectic (37 wt.% lead), but possessing similar properties, is an industry-wide goal. To determine the wettability of low-lead solders, 21 alloys each of Sn/Ag and Sn/Cu eutectic (containing 0 to 10 wt.% lead and/or indium) were tested on as-received copper-clad FR-4. Contact angles for the alloys ranged from 12.5 to 38.9{degrees} and area of spread measurements ranged from 5.2 to 17.3 mm{sup 2} compared with 5 to 150 and {approximately}19 mm{sup 2}, respectively, for Sn/Pb eutectic. Alloys with 8 to 10 wt.% lead showed contact angles and areas of spread similar to Sn/Pb eutectic under similar conditions. The best results on the as-received substrates, compared to the Sn/Pb eutectic, were obtained from the Sn/Ag eutectic with 10 wt.% lead. The very low-lead (less than 10 wt.% lead) and lead-free alloys, however, failed to achieve the performance level of eutectic Sn/Pb solders. A desire to improve the spreading of very low-lead and lead-free solders provided the impetus for these efforts to produce {open_quotes}engineered{close_quotes} rough surfaces. In an attempt to improve the wettability and spreading behavior of very low-lead and lead-free alloys, the very low-lead and lead-free members of the Sn/Ag system were tested on roughened copper-clad FR-4. Every alloy in the test suite demonstrated improvement in area of spread on the roughened substrates. The best results on the roughened substrates, compared to the Sn/Pb eutectic, were obtained from the Sn/Ag eutectic with 8 wt.% lead. The effects of surface roughness on the wettability and flow behavior of solder alloys has provided insight into surface morphologies that lead to improved solderability.

  16. Household-level disparities in cancer risks from vehicular air pollution in Miami

    NASA Astrophysics Data System (ADS)

    Collins, Timothy W.; Grineski, Sara E.; Chakraborty, Jayajit

    2015-09-01

    Environmental justice (EJ) research has relied on ecological analyses of socio-demographic data from areal units to determine if particular populations are disproportionately burdened by toxic risks. This article advances quantitative EJ research by (a) examining whether statistical associations found for geographic units translate to relationships at the household level; (b) testing alternative explanations for distributional injustices never before investigated; and (c) applying a novel statistical technique appropriate for geographically-clustered data. Our study makes these advances by using generalized estimating equations to examine distributive environmental inequities in the Miami (Florida) metropolitan area, based on primary household-level survey data and census block-level cancer risk estimates of hazardous air pollutant (HAP) exposure from on-road mobile emission sources. In addition to modeling determinants of on-road HAP cancer risk among all survey participants, two subgroup models are estimated to examine whether determinants of risk differ based on disadvantaged minority (Hispanic and non-Hispanic Black) versus non-Hispanic white racial/ethnic status. Results reveal multiple determinants of risk exposure disparities. In the model including all survey participants, renter-occupancy, Hispanic and non-Hispanic black race/ethnicity, the desire to live close to work/urban services or public transportation, and higher risk perception are associated with greater on-road HAP cancer risk; the desire to live in an amenity-rich environment is associated with less risk. Divergent subgroup model results shed light on the previously unexamined role of racial/ethnic status in shaping determinants of risk exposures. While lower socioeconomic status and higher risk perception predict significantly greater on-road HAP cancer risk among disadvantaged minorities, the desire to live near work/urban services or public transport predict significantly greater risk among

  17. Physical Activity- and Alcohol-dependent Association Between Air Pollution Exposure and Elevated Liver Enzyme Levels: An Elderly Panel Study

    PubMed Central

    Kim, Kyoung-Nam; Lee, Hyemi; Kim, Jin Hee; Jung, Kweon; Lim, Youn-Hee; Hong, Yun-Chul

    2015-01-01

    Objectives: The deleterious effects of air pollution on various health outcomes have been demonstrated. However, few studies have examined the effects of air pollution on liver enzyme levels. Methods: Blood samples were drawn up to three times between 2008 and 2010 from 545 elderly individuals who regularly visited a community welfare center in Seoul, Korea. Data regarding ambient air pollutants (particulate matter ≤2.5 μm [PM2.5], nitrogen dioxide [NO2], ozone [O3], carbon monoxide, and sulfur dioxide) from monitoring stations were used to estimate air pollution exposure. The effects of the air pollutants on the concentrations of three liver enzymes (aspartate aminotransferase [AST], alanine aminotransferase [ALT], and γ-glutamyltranspeptidase [γ-GTP)]) were evaluated using generalized additive and linear mixed models. Results: Interquartile range increases in the concentrations of the pollutants showed significant associations of PM2.5 with AST (3.0% increase, p=0.0052), ALT (3.2% increase, p=0.0313), and γ-GTP (5.0% increase, p=0.0051) levels; NO2 with AST (3.5% increase, p=0.0060) and ALT (3.8% increase, p=0.0179) levels; and O3 with γ-GTP (5.3% increase, p=0.0324) levels. Significant modification of these effects by exercise and alcohol consumption was found (p for interaction <0.05). The effects of air pollutants were greater in non-exercisers and heavy drinkers. Conclusions: Short-term exposure to air pollutants such as PM2.5, NO2, and O3 is associated with increased liver enzyme levels in the elderly. These adverse effects can be reduced by exercising regularly and abstinence from alcohol. PMID:26081652

  18. 3D FEM Simulations of Drop Test Reliability on 3D-WLP: Effects of Solder Reflow Residual Stress and Molding Resin Parameters

    NASA Astrophysics Data System (ADS)

    Belhenini, Soufyane; Tougui, Abdellah; Bouchou, Abdelhake; Mohan, Ranganathan; Dosseul, Franck

    2014-01-01

    Numerous three-dimensional (3D) packaging technologies are currently used for 3D integration. 3D-wafer level package (3D-WLP) appears to be a way to keep increasing the density of the microelectronic components. The reliability of 3D components has to be evaluated on mechanical demonstrators with daisy chains before real production. Numerical modeling is acknowledged as a very efficient tool for design optimization. In this paper, 3D finite-elements calculations are carried out to analyze the effects of molding resin's mechanical properties and thickness on the 3D component's dynamic response under drop loading conditions. Residual stress generated by solder reflow is also discussed. The influences of residual stresses on the numerical estimation of the component behavior during drop loading are studied. Solder reflow residual stresses have an impact on solder plastic strain and die equivalent stress calculations. We have compared the result of two numerical drop test models. Stress-free initial conduction is introduced for the first model. Solder reflow residual stresses are considered as the initial condition for the second drop test model. Quantitative and qualitative comparisons are carried out to show the effect of residual stress in drop test calculations. For the effect of molding resin thickness on the component behavior under drop loading, the stress-free initial condition is considered. The effect of the molding resin's thickness on critical area location is discussed. The solder bump maximum plastic shear strain and the silicon die maximum equivalent stress are used as reliability criteria. Numerical submodeling techniques are used to increase calculation accuracy. Numerical results have contributed to the design optimization of the 3D-WLP component.

  19. Atmospheric infrared sounder on AIRS with emphasis on level 2 products

    NASA Technical Reports Server (NTRS)

    Lee, Sung-Yung; Fetzer, Eric; Granger, Stephanie; Hearty, Thomas; Lambrigtsen, Bjorn; Manning, Evan M.; Olsen, Edward; Pagano, Thomas

    2004-01-01

    The Atmospheric Infrared Sounder (AIRS) was launched aboard EOS Aqua in May of 2002. AIRS is a grating spectrometer with almost 2400 channels covering the 3.74 to 15.40 micron spectral region with a nominal spectral resolution ((nu)/(delta)(nu)) of 1200, with some gaps. In addition, AIRS has 4 channels in the NIR/VIS region. The AIRS operates in conjunction with the microwave sounders Advanced Microwave Sounding Unit (AMSU-A) and Humidity Sounder of Brazil (HSB). The microwave sounders are mainly used for cloud clearing of IR radiances, or to remove the effect of cloud on the IR radiances.

  20. A novel multi-level interconnect scheme with air as low K inter-metal dielectric for ultradeep submicron application

    NASA Astrophysics Data System (ADS)

    Chen, Chung-Hui; Fang, Yean-Kuen; Lin, Chun-Sheng; Yang, Chih-Wei; Hsieh, Jang-Cheng

    2001-01-01

    In this letter, a novel multi-level interconnect scheme with air as the low K inter-metal dielectric for ultra large scale integrated circuit (ULSI) application in ultradeep submicron (UDSM) range is proposed. The detailed process integration with copper dual damascene processing is described. The feasibility of the scheme is examined by trimethylaluminum Raphael simulation for the effective dielectric constant and the cutoff frequency in a standard divide by three counter. The simulation results are also compared with these reported air gap formation technologies. The results show the developed multi-level interconnect system is suitable for UDSM application.

  1. Effects of bleed air extraction on thrust levels on the F404-GE-400 turbofan engine

    NASA Technical Reports Server (NTRS)

    Yuhas, Andrew J.; Ray, Ronald J.

    1992-01-01

    A ground test was performed to determine the effects of compressor bleed flow extraction on the performance of F404-GE-400 afterburning turbofan engines. The two engines were installed in the F/A-18 High Alpha Research Vehicle at the NASA Dryden Flight Research Facility. A specialized bleed ducting system was installed onto the aircraft to control and measure engine bleed airflow while the aircraft was tied down to a thrust measuring stand. The test was conducted on each engine and at various power settings. The bleed air extraction levels analyzed included flow rates above the manufacturer's maximum specification limit. The measured relationship between thrust and bleed flow extraction was shown to be essentially linear at all power settings with an increase in bleed flow causing a corresponding decrease in thrust. A comparison with the F404-GE-400 steady-state engine simulation showed the estimation to be within +/- 1 percent of measured thrust losses for large increases in bleed flow rate.

  2. Infection levels of the cestode Hymenolepis diminuta in rat populations from Buenos Aires, Argentina.

    PubMed

    Hancke, D; Suárez, O V

    2016-03-01

    Ecological studies on zoonotic parasites are crucial for the design and implementation of effective measures to prevent parasite transmission. The aim of this study was to evaluate factors such as season, landscape unit, rat sex and rat body length, affecting the abundance of the cestode Hymenolepis diminuta, a parasite of synanthropic rats, within an urban environment. A parasitological survey was undertaken on 169 rats from landscape units such as shantytowns, parklands, industrial-residential areas and scrap-metal yards in Buenos Aires, Argentina. The overall prevalence of H. diminuta was 21.3%, although the occurrence of this species in rats was not homogeneous. The abundance of H. diminuta, using a zero-inflated negative binomial model, was correlated with rat body length. In shantytowns, abundance levels were higher than other landscape units, largely due to differences in individual environmental characteristics and rat assemblages. The populations of arthropod intermediate hosts could be subjected to seasonal fluctuations and the degree of urbanization. Shantytowns are overcrowded urban marginal settlements with most inhabitants living in precarious conditions and supporting large populations of rats, thereby increasing the risk of zoonotic infection. PMID:25869333

  3. Occurrence of spruce bark beetles in forest stands at different levels of air pollution stress.

    PubMed

    Grodzki, Wojciech; McManus, Michael; Knízek, Milos; Meshkova, Valentina; Mihalciuc, Vasile; Novotny, Julius; Turcani, Marek; Slobodyan, Yaroslav

    2004-07-01

    The spruce bark beetle, Ips typographus (L.) is the most serious pest of mature spruce stands, mainly Norway spruce, Picea abies (L.) Karst. throughout Eurasia. A complex of weather-related events and other environmental stresses are reported to predispose spruce stands to bark beetle attack and subsequent tree mortality; however the possible role of industrial pollution as a predisposing factor to attack by this species is poorly understood. The abundance and dynamics of I. typographus populations was evaluated in 60-80 year old Norway spruce stands occurring on 10 x 50 ha sites in five countries within the Carpathian range that were selected in proximity to established ozone measurement sites. Data were recorded on several parameters including the volume of infested trees, captures of adult beetles in pheromone traps, number of attacks, and the presence and relative abundance of associated bark beetle species. In several cases, stands adjacent to sites with higher ozone values were associated with higher bark beetle populations. The volume of sanitary cuttings, a reflection of tree mortality, and the mean daily capture of beetles in pheromone traps were significantly higher at sites where the O(3) level was higher. However, the mean infestation density on trees was higher in plots associated with lower O(3) levels. Captures of beetles in pheromone traps and infestation densities were higher in the zone above 800 m. However, none of the relationships was conclusive, suggesting that spruce bark beetle dynamics are driven by a complex interaction of biotic and abiotic factors and not by a single parameter such as air pollution. PMID:15046842

  4. Dural reconstruction by fascia using a temperature-controlled CO2 laser soldering system

    NASA Astrophysics Data System (ADS)

    Forer, Boaz; Vasilyev, Tamar; Brosh, Tamar; Kariv, Naam; Gil, Ziv; Fliss, Dan M.; Katzir, Abraham

    2005-04-01

    Conventional methods for dura repair are normally based on sutures or stitches. These methods have several disadvantages: (1) The dura is often brittle, and the standard procedures are difficult and time consuming. (2) The seal is leaky. (3) The introduction of a foreign body (e.g. sutures) may cause an inflammatory response. In order to overcome these difficulties we used a temperature controlled fiber optic based CO2 laser soldering system. In a set of in vitro experiments we generated a hole of diameter 10 mm in the dura of a pig corpse, covered the hole with a segment of fascia, and soldered the fascia to the edges of the hole, using 47% bovine albumin as a solder. The soldering was carried out spot by spot, and each spot was heated to 65° C for 3-6 seconds. The soldered dura was removed and the burst pressure of the soldered patch was measured. The average value for microscopic muscular side soldering was 194 mm Hg. This is much higher than the maximal physiological pressure of the CSF fluid in the brain, which is 15 mm Hg. In a set of in vivo experiments, fascia patches were soldered on holes in five farm pigs. The long term results of these experiments were very promising. In conclusion, we have developed an advanced technique for dural reconstruction, which will find important clinical applications.

  5. Intermetallic compound layer growth kinetics in non-lead bearing solders

    SciTech Connect

    Vianco, P.T.; Kilgo, A.C.; Grant, R.

    1995-04-01

    The introduction of alternative, non-lead bearing solders into electronic assemblies requires a thorough investigation of product manufacturability and reliability. Both of these attributes can be impacted by the excessive growth of intermetallic compound (IMC) layers at the solder/substrate interface. An extensive study has documented the stoichiometry and solid state growth kinetics of IMC layers formed between copper and the lead-free solders: 96.5Sn-3.5Ag (wt.%), 95Sn-5Sb, 100Sn, and 58Bi-42Sn. Aging temperatures were 70--205 C for the Sn-based solders and 55--120 C for the Bi-rich solder. Time periods were 1--400 days for all of the alloys. The Sn/Cu, Sn-Ag/Cu, and Sn-Sb/Cu IMC layers exhibited sub-layers of Cu{sub 6}Sn{sub 5} and Cu{sub 3}Sn; the latter composition was present only following prolonged aging times or higher temperatures. The total layer growth exhibited a time exponent of n = 0.5 at low temperatures and a value of n = 0.42 at higher temperatures in each of the solder/Cu systems. Similar growth kinetics were observed with the low temperature 58Bi-42Sn solder; however, a considerably more complex sub-layer structure was observed. The kinetic data will be discussed with respect to predicting IMC layer growth based upon solder composition.

  6. 30 CFR 77.1111 - Welding, cutting, soldering; use of fire extinguisher.

    Code of Federal Regulations, 2012 CFR

    2012-07-01

    ... 30 Mineral Resources 1 2012-07-01 2012-07-01 false Welding, cutting, soldering; use of fire... OF UNDERGROUND COAL MINES Fire Protection § 77.1111 Welding, cutting, soldering; use of fire extinguisher. One portable fire extinguisher shall be provided at each location where welding, cutting,...

  7. 30 CFR 77.1111 - Welding, cutting, soldering; use of fire extinguisher.

    Code of Federal Regulations, 2013 CFR

    2013-07-01

    ... 30 Mineral Resources 1 2013-07-01 2013-07-01 false Welding, cutting, soldering; use of fire... OF UNDERGROUND COAL MINES Fire Protection § 77.1111 Welding, cutting, soldering; use of fire extinguisher. One portable fire extinguisher shall be provided at each location where welding, cutting,...

  8. 30 CFR 77.1111 - Welding, cutting, soldering; use of fire extinguisher.

    Code of Federal Regulations, 2014 CFR

    2014-07-01

    ... 30 Mineral Resources 1 2014-07-01 2014-07-01 false Welding, cutting, soldering; use of fire... OF UNDERGROUND COAL MINES Fire Protection § 77.1111 Welding, cutting, soldering; use of fire extinguisher. One portable fire extinguisher shall be provided at each location where welding, cutting,...

  9. 30 CFR 77.1111 - Welding, cutting, soldering; use of fire extinguisher.

    Code of Federal Regulations, 2011 CFR

    2011-07-01

    ... 30 Mineral Resources 1 2011-07-01 2011-07-01 false Welding, cutting, soldering; use of fire... OF UNDERGROUND COAL MINES Fire Protection § 77.1111 Welding, cutting, soldering; use of fire extinguisher. One portable fire extinguisher shall be provided at each location where welding, cutting,...

  10. 30 CFR 77.1111 - Welding, cutting, soldering; use of fire extinguisher.

    Code of Federal Regulations, 2010 CFR

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, soldering; use of fire... OF UNDERGROUND COAL MINES Fire Protection § 77.1111 Welding, cutting, soldering; use of fire extinguisher. One portable fire extinguisher shall be provided at each location where welding, cutting,...

  11. Development of technique for laser welding of biological tissues using laser welding device and nanocomposite solder.

    PubMed

    Gerasimenko, A; Ichcitidze, L; Podgaetsky, V; Ryabkin, D; Pyankov, E; Saveliev, M; Selishchev, S

    2015-08-01

    The laser device for welding of biological tissues has been developed involving quality control and temperature stabilization of weld seam. Laser nanocomposite solder applied onto a wound to be weld has been used. Physicochemical properties of the nanocomposite solder have been elucidated. The nature of the tissue-organizing nanoscaffold has been analyzed at the site of biotissue welding. PMID:26738200

  12. Microstructure and Properties of Sn-10Bi- xCu Solder Alloy/Joint

    NASA Astrophysics Data System (ADS)

    Lai, Zhongmin; Ye, Dan

    2016-07-01

    The effect of Cu on the microstructure and properties of Sn-10Bi solder alloy/joint were investigated. The results showed that the microstructure of Sn-10Bi-Cu solder alloy consisted of a Sn-rich phase, Bi-rich phase, and particles of Cu6Sn5 intermetallic compounds (IMCs). The pasty range of Sn-10Bi- xCu had an influence on the spreading property of Sn-10Bi- xCu. Cu improved the growth of the IMCs layer during the liquid reaction stage. Furthermore, the hardness of the solder alloy increased as the Cu concentration of increased. The strength of the solder joint was controlled by the solder alloy hardness and the interfacial IMCs layer thickness together. For the joints with low solder alloy hardness and a thin IMCs layer, the fracture was in the solder alloy. For the joints with high solder alloy hardness and a thick IMCs layer, the fracture was in the IMCs layer.

  13. Microstructural Evaluation and Comparison of Solder Samples Processed Aboard the International Space Station

    NASA Technical Reports Server (NTRS)

    Grugel, R. N.; Hua, F.; Anilkumar, A. V.

    2008-01-01

    Samples from the In-Space Soldering Investigation (ISSI), conducted aboard the International Space Station (ISS), are being examined for post-solidification microstructural development and porosity distribution. In this preliminary study, the internal structures of two ISSI processed samples are compared. In one case 10cm of rosin-core solder was wrapped around a coupon wire and melted by conduction, whereas, in the other a comparable length of solder was melted directly onto the hot wire; in both cases the molten solder formed ellipsoidal blobs, a shape that was maintained during subsequent solidification. In the former case, there is clear evidence of porosity throughout the sample, and an accumulation of larger pores near the hot end that implies thermocapillary induced migration and eventual coalescence of the flux vapor bubbles. In the second context, when solder was fed onto the wire. a part of the flux constituting the solder core is introduced into and remains within the liquid solder ball, becoming entombed upon solidification. In both cases the consequential porosity, particularly at a solder/contact interface, is very undesirable. In addition to compromising the desired electrical and thermal conductivity, it promotes mechanical failure.

  14. Method and apparatus for jetting, manufacturing and attaching uniform solder balls

    DOEpatents

    Yost, F.G.; Frear, D.R.; Schmale, D.T.

    1999-01-05

    An apparatus and process are disclosed for jetting molten solder in the form of balls directly onto all the metallized interconnects lands for a ball grid array package in one step with no solder paste required. Molten solder is jetted out of a grid of holes using a piston attached to a piezoelectric crystal. When voltage is applied to the crystal it expands forcing the piston to extrude a desired volume of solder through holes in the aperture plate. When the voltage is decreased the piston reverses motion creating an instability in the molten solder at the aperture plate surface and thereby forming spherical solder balls that fall onto a metallized substrate. The molten solder balls land on the substrate and form a metallurgical bond with the metallized lands. The size of the solder balls is determined by a combination of the size of the holes in the aperture plate, the duration of the piston pulse, and the displacement of the piston. The layout of the balls is dictated by the location of the hooks in the grid. Changes in ball size and layout can be easily accomplished by changing the grid plate. This invention also allows simple preparation of uniform balls for subsequent supply to BGA users. 7 figs.

  15. Method and apparatus for jetting, manufacturing and attaching uniform solder balls

    SciTech Connect

    Yost, Frederick G.; Frear, Darrel R.; Schmale, David T.

    1999-01-01

    An apparatus and process for jetting molten solder in the form of balls directly onto all the metallized interconnects lands for a ball grid array package in one step with no solder paste required. Molten solder is jetted out of a grid of holes using a piston attached to a piezoelectric crystal. When voltage is applied to the crystal it expands forcing the piston to extrude a desired volume of solder through holes in the aperture plate. When the voltage is decreased the piston reverses motion creating an instability in the molten solder at the aperture plate surface and thereby forming spherical solder balls that fall onto a metallized substrate. The molten solder balls land on the substrate and form a metallurgical bond with the metallized lands. The size of the solder balls is determined by a combination of the size of the holes in the aperture plate, the duration of the piston pulse, and the displacement of the piston. The layout of the balls is dictated by the location of the hooks in the grid. Changes in ball size and layout can be easily accomplished by changing the grid plate. This invention also allows simple preparation of uniform balls for subsequent supply to BGA users.

  16. New multicomponent solder alloys of low melting pointfor low-cost commercial electronic assembly

    NASA Astrophysics Data System (ADS)

    Al-Ganainy, G. S.; Sakr, M. S.

    2003-09-01

    The requirements of the telecommunications, automobile, electronics and aircraft industries for non-toxic solders with melting points close to that of near-eutectic Pb-Sn alloys has led to the development of new Sn-Zn-In solder alloys. Differential thermal analysis (DTA) shows melting points of 198, 195, 190 and 185 +/- 2 °C for the alloys Sn-9Zn, Sn-9Zn-2In, Sn-9Zn-4In and Sn-9Zn-6In, respectively. An equation that fits the data relating the melting point to the In content in the solders is derived. The X-ray diffraction patterns are analyzed to determine the phases that exist in each solder. The stress-strain curves are studied in the temperature range from 90 to 130 °C for all the solders except for those that contain 4 wt% of In, where the temperature range continues to 150 °C. The work-hardening parameters, y (the yield stress), f (the fracture stress), and the parabolic work-hardening coefficient X, increase with increasing indium content in the solders at all working temperatures. They decrease with increasing working temperature for each solder, and show two relaxation stages only for the Sn-9Zn-4In solder around a temperature of 120 °C. (

  17. ANTIOXIDANT SUPPLEMENTATION AND LUNG FUNCTIONS AMONG ASTHMATIC CHILDREN EXPOSED TO HIGH LEVELS OF AIR POLLUTANTS

    EPA Science Inventory

    Abstract

    Air pollutant exposure has been related to adverse respiratory effects, in particular, in asthmatics. This effect could be the consequence of the oxidative stress caused by air pollutants on the lung. Antioxidant vitamins are free- radical scavengers, and could ha...

  18. AIR LEVELS OF CARCINOGENIC POLYCYCLIC AROMATIC HYDROCARBONS FOLLOWING THE WORLD TRADE CENTER DISASTER

    EPA Science Inventory

    The catastrophic collapse of the World Trade Center (WTC) on September 11, 2001, created an immense dust cloud followed by fires that emitted soot into the air of New York City (NYC) well into December. The subsequent cleanup used diesel equipment that further polluted the air un...

  19. Indoor Air Quality in Schools (IAQ): The Importance of Monitoring Carbon Dioxide Levels.

    ERIC Educational Resources Information Center

    Sundersingh, David; Bearg, David W.

    This article highlights indoor air quality and exposure to pollutants at school. Typical air pollutants within schools include environmental tobacco smoke, formaldehyde, volatile organic compounds, nitrogen oxides, carbon monoxide, carbon dioxide, allergens, pathogens, radon, pesticides, lead, and dust. Inadequate ventilation, inefficient…

  20. Air density 2.7 billion years ago limited to less than twice modern levels by fossil raindrop imprints.

    PubMed

    Som, Sanjoy M; Catling, David C; Harnmeijer, Jelte P; Polivka, Peter M; Buick, Roger

    2012-04-19

    According to the 'Faint Young Sun' paradox, during the late Archaean eon a Sun approximately 20% dimmer warmed the early Earth such that it had liquid water and a clement climate. Explanations for this phenomenon have invoked a denser atmosphere that provided warmth by nitrogen pressure broadening or enhanced greenhouse gas concentrations. Such solutions are allowed by geochemical studies and numerical investigations that place approximate concentration limits on Archaean atmospheric gases, including methane, carbon dioxide and oxygen. But no field data constraining ground-level air density and barometric pressure have been reported, leaving the plausibility of these various hypotheses in doubt. Here we show that raindrop imprints in tuffs of the Ventersdorp Supergroup, South Africa, constrain surface air density 2.7 billion years ago to less than twice modern levels. We interpret the raindrop fossils using experiments in which water droplets of known size fall at terminal velocity into fresh and weathered volcanic ash, thus defining a relationship between imprint size and raindrop impact momentum. Fragmentation following raindrop flattening limits raindrop size to a maximum value independent of air density, whereas raindrop terminal velocity varies as the inverse of the square root of air density. If the Archaean raindrops reached the modern maximum measured size, air density must have been less than 2.3 kg m(-3), compared to today's 1.2 kg m(-3), but because such drops rarely occur, air density was more probably below 1.3 kg m(-3). The upper estimate for air density renders the pressure broadening explanation possible, but it is improbable under the likely lower estimates. Our results also disallow the extreme CO(2) levels required for hot Archaean climates. PMID:22456703

  1. Intermetallics Characterization of Lead-Free Solder Joints under Isothermal Aging

    NASA Astrophysics Data System (ADS)

    Choubey, Anupam; Yu, Hao; Osterman, Michael; Pecht, Michael; Yun, Fu; Yonghong, Li; Ming, Xu

    2008-08-01

    Solder interconnect reliability is influenced by environmentally imposed loads, solder material properties, and the intermetallics formed within the solder and the metal surfaces to which the solder is bonded. Several lead-free metallurgies are being used for component terminal plating, board pad plating, and solder materials. These metallurgies react together and form intermetallic compounds (IMCs) that affect the metallurgical bond strength and the reliability of solder joint connections. This study evaluates the composition and extent of intermetallic growth in solder joints of ball grid array components for several printed circuit board pad finishes and solder materials. Intermetallic growth during solid state aging at 100°C and 125°C up to 1000 h for two solder alloys, Sn-3.5Ag and Sn-3.0Ag-0.5Cu, was investigated. For Sn-3.5Ag solder, the electroless nickel immersion gold (ENIG) pad finish was found to result in the lowest IMC thickness compared to immersion tin (ImSn), immersion silver (ImAg), and organic solderability preservative (OSP). Due to the brittle nature of the IMC, a lower IMC thickness is generally preferred for optimal solder joint reliability. A lower IMC thickness may make ENIG a desirable finish for long-life applications. Activation energies of IMC growth in solid-state aging were found to be 0.54 ± 0.1 eV for ENIG, 0.91 ± 0.12 eV for ImSn, and 1.03 ± 0.1 eV for ImAg. Cu3Sn and Cu6Sn5 IMCs were found between the solder and the copper pad on boards with the ImSn and ImAg pad finishes. Ternary (Cu,Ni)6Sn5 intermetallics were found for the ENIG pad finish on the board side. On the component side, a ternary IMC layer composed of Ni-Cu-Sn was found. Along with intermetallics, microvoids were observed at the interface between the copper pad and solder, which presents some concern if devices are subject to shock and vibration loading.

  2. The effects of long-term storage on the solderability of immersion silver coatings.

    SciTech Connect

    Buttry, R. Wayne; Lopez, Edwin Paul; Martin, Joseph; Vianco, Paul Thomas; Lucero, Samuel J.; Rejent, Jerome Andrew

    2006-04-01

    The solderability of an immersion Ag finish was evaluated after the exposure of test specimens to a Battelle Class II environment, which accelerates the storage conditions of light industrial surroundings. The solderability metric was the contact angle, (?C), as determined by the meniscometer/wetting balance technique. Auger surface and depth profile analyses were utilized to identify changes in the coating chemistry. The solderability test results indicate that there was no appreciable loss in solderability when the immersion Ag coated coupons were packaged in vapor phase corrosion (VPC) inhibitor bags and/or inhibitor bags with VPC inhibitor paper and aged for 8 hours, 1 week or 2 weeks in the Battelle Class II environment. An increase in surface carbon concentration after aging did not appear to significantly affect solderability.

  3. Bonding nature of rare-earth-containing lead-free solders

    NASA Astrophysics Data System (ADS)

    Ramirez, Ainissa G.; Mavoori, Hareesh; Jin, Sungho

    2002-01-01

    The ability of rare-earth-containing lead-free solders to wet and bond to silica was investigated. Small additions of Lu (0.5-2 wt. %) added to eutectic Sn-Ag or Au-Sn solder render it directly solderable to a silicon oxide surface. The bonding is attributed to the migration of the rare-earth element to the solder-silica interface for chemical reaction and the creation of an interfacial layer that contains a rare-earth oxide. It was found that additions of rare-earth materials did not significantly modify the solidification microstructure or the melting point. Such oxide-bondable solders can be useful for assembly of various optical communication devices.

  4. Some Observations of Solder Joint Failure Under Tensile-Compressive Stress

    NASA Technical Reports Server (NTRS)

    Winslow, J. W.

    1993-01-01

    It has long been known that solder joints under mechanical stress are subject to failure. In early electronic systems, such failures were avoided primarily by avoiding the use of solder as a mechanical structural component. The rule was to first make sound wire connections that did not depend mechanically on solder, and only then to solder them. Careful design and miniaturization in modern electronic systems limits the mechanical stresses exerted on solder joints to values less than their yield points, and these joints have become integral parts of the mechanical structures. Unfortunately, while these joints are strong enough when new, they have proven vulnerable to fatigue failures as they age.Details of the fatigue process are poorly understood, making predictions of expected lifetimes difficult.

  5. The Resistance and Strength of Soft Solder Splices between Conductors in MICE Coils

    SciTech Connect

    Wu, Hong; Pan, Heng; Green, Michael A; Dietderich, Dan; Gartner, T. E.; Higley, Hugh C; Mentink, M.; Xu, FengYu; Trillaud, F.; Liu, X. K.; Wang, Li; Zheng, S. X.; Tam, D.G.

    2010-08-03

    Two of the three types of MICE magnets will have splices within their coils. The MICE coupling coils may have as many as fifteen one-meter long splices within them. Each of the MICE focusing coils may have a couple of 0.25-meter long conductor splices. Equations for the calculation of resistance of soldered lap splices of various types are presented. This paper presents resistance measurements of soldered lap splices of various lengths. Measured splice resistance is shown for one-meter long splices as a function of the fabrication method. Another important consideration is the strength of the splices. The measured breaking stress of splices of various lengths is presented in this paper. Tin-lead solders and tin-silver solders were used for the splices that were tested. From the data given in this report, the authors recommend that the use of lead free solders be avoided for low temperature coils.

  6. Learning algorithms for both real-time detection of solder shorts and for SPC measurement correction using cross-sectional x-ray images of PCBA solder joints

    NASA Astrophysics Data System (ADS)

    Roder, Paul A.

    1994-03-01

    Learning algorithms are introduced for use in the inspection of cross-sectional X-ray images of solder joints. These learning algorithms improve measurement accuracy by accounting for localized shading effects that can occur when inspecting double- sided printed circuit board assemblies. Two specific examples are discussed. The first is an algorithm for detection of solder short defects. The second algorithm utilizes learning to generate more accurate statistical process control measurements.

  7. 24 CFR 3280.406 - Air chamber test method for certification and qualification of formaldehyde emission levels.

    Code of Federal Regulations, 2012 CFR

    2012-04-01

    ... 24 Housing and Urban Development 5 2012-04-01 2012-04-01 false Air chamber test method for certification and qualification of formaldehyde emission levels. 3280.406 Section 3280.406 Housing and Urban Development Regulations Relating to Housing and Urban Development (Continued) OFFICE OF ASSISTANT SECRETARY FOR HOUSING-FEDERAL HOUSING...

  8. Fast formation and growth of high-density Sn whiskers in Mg/Sn-based solder/Mg joints by ultrasonic-assisted soldering: Phenomena, mechanism and prevention

    PubMed Central

    Li, M. Y.; Yang, H. F.; Zhang, Z. H.; Gu, J. H.; Yang, S. H.

    2016-01-01

    A universally applicable method for promoting the fast formation and growth of high-density Sn whiskers on solders was developed by fabricating Mg/Sn-based solder/Mg joints using ultrasonic-assisted soldering at 250 °C for 6 s and then subjected to thermal aging at 25 °C for 7 d. The results showed that the use of the ultrasonic-assisted soldering could produce the supersaturated dissolution of Mg in the liquid Sn and lead to the existence of two forms of Mg in Sn after solidification. Moreover, the formation and growth of the high-density whiskers were facilitated by the specific contributions of both of the Mg forms in the solid Sn. Specifically, interstitial Mg can provide the persistent driving force for Sn whisker growth, whereas the Mg2Sn phase can increase the formation probability of Sn whiskers. In addition, we presented that the formation and growth of Sn whiskers in the Sn-based solders can be significantly restricted by a small amount of Zn addition (≥3 wt.%), and the prevention mechanisms are attributed to the segregation of Zn atoms at grain or phase boundaries and the formation of the lamellar-type Zn-rich structures in the solder. PMID:27273421

  9. Effect of the Silver Content of SnAgCu Solder on the Interfacial Reaction and on the Reliability of Angle Joints Fabricated by Laser-Jet Soldering

    NASA Astrophysics Data System (ADS)

    Ji, Hongjun; Ma, Yuyou; Li, Mingyu; Wang, Chunqing

    2015-02-01

    The silver content of lead-free solders affects their microstructure, the interfacial reaction, and the performance of the joints in reliability tests. In this study, Sn3.0Ag0.5Cu (wt.%, SAC305) and Sn1.0Ag0.5Cu (wt.%, SAC105) solder balls of diameter 55 μm were reflowed on gold surface pads by laser-jet soldering. It was found that four types of layered intermetallic compound (IMC) were formed at the interfaces; these were Au5Sn/AuSn, AuSn, AuSn2, and AuSn4 from the pad side to the solder matrix. The Au5Sn/AuSn eutectic region, thickness 400 nm, formed because of the high cooling rate induced by the laser-jet soldering. During high-temperature storage tests, the silver became segregated at the interfaces between the Au-Sn IMC and the solder matrix, resulting in inhibition of IMC growth in SAC305 joints, the shear strengths of which were higher than those of SAC105 joints. In mechanical drop tests, however, percentage failure of the SAC305 joints was twice that of the SAC105 joints.

  10. Fast formation and growth of high-density Sn whiskers in Mg/Sn-based solder/Mg joints by ultrasonic-assisted soldering: Phenomena, mechanism and prevention.

    PubMed

    Li, M Y; Yang, H F; Zhang, Z H; Gu, J H; Yang, S H

    2016-01-01

    A universally applicable method for promoting the fast formation and growth of high-density Sn whiskers on solders was developed by fabricating Mg/Sn-based solder/Mg joints using ultrasonic-assisted soldering at 250 °C for 6 s and then subjected to thermal aging at 25 °C for 7 d. The results showed that the use of the ultrasonic-assisted soldering could produce the supersaturated dissolution of Mg in the liquid Sn and lead to the existence of two forms of Mg in Sn after solidification. Moreover, the formation and growth of the high-density whiskers were facilitated by the specific contributions of both of the Mg forms in the solid Sn. Specifically, interstitial Mg can provide the persistent driving force for Sn whisker growth, whereas the Mg2Sn phase can increase the formation probability of Sn whiskers. In addition, we presented that the formation and growth of Sn whiskers in the Sn-based solders can be significantly restricted by a small amount of Zn addition (≥3 wt.%), and the prevention mechanisms are attributed to the segregation of Zn atoms at grain or phase boundaries and the formation of the lamellar-type Zn-rich structures in the solder. PMID:27273421

  11. Fast formation and growth of high-density Sn whiskers in Mg/Sn-based solder/Mg joints by ultrasonic-assisted soldering: Phenomena, mechanism and prevention

    NASA Astrophysics Data System (ADS)

    Li, M. Y.; Yang, H. F.; Zhang, Z. H.; Gu, J. H.; Yang, S. H.

    2016-06-01

    A universally applicable method for promoting the fast formation and growth of high-density Sn whiskers on solders was developed by fabricating Mg/Sn-based solder/Mg joints using ultrasonic-assisted soldering at 250 °C for 6 s and then subjected to thermal aging at 25 °C for 7 d. The results showed that the use of the ultrasonic-assisted soldering could produce the supersaturated dissolution of Mg in the liquid Sn and lead to the existence of two forms of Mg in Sn after solidification. Moreover, the formation and growth of the high-density whiskers were facilitated by the specific contributions of both of the Mg forms in the solid Sn. Specifically, interstitial Mg can provide the persistent driving force for Sn whisker growth, whereas the Mg2Sn phase can increase the formation probability of Sn whiskers. In addition, we presented that the formation and growth of Sn whiskers in the Sn-based solders can be significantly restricted by a small amount of Zn addition (≥3 wt.%), and the prevention mechanisms are attributed to the segregation of Zn atoms at grain or phase boundaries and the formation of the lamellar-type Zn-rich structures in the solder.

  12. Distribution of air and serum PCDD/F levels of electric arc furnaces and secondary aluminum and copper smelters.

    PubMed

    Lee, Ching-Chang; Shih, Tung-Seng; Chen, Hsiu-Ling

    2009-12-30

    Metallurgical processes, such as smelting, can generate organic impurities such as organic chloride chemicals, polychlorinated dibenzo-p-dioxins and polychlorinated dibenzofurans (PCDD/Fs). The objective of this study was to elucidate the serum PCDD/F levels of 134 workers and ambient air levels around electric arc furnaces (EAF), secondary copper smelters and secondary aluminum smelters (ALSs) in Taiwan. The highest serum PCDD/F levels were found in the ALSs workers (21.9 pg WHO-TEQ/g lipid), with lower levels in copper smelter workers (21.5 pg WHO-TEQ/g lipid), and the lowest in the EAF plant workers (18.8 pg WHO-TEQ/g lipid). This was still higher than the levels for residents living within 5 km of municipal waste incinerators (14.0 pg WHO-TEQ/g lipid). For ambient samples, the highest ambient air PCDD/F level was in the copper smelters (12.4 pg WHO-TEQ/Nm(3)), with lower levels in ALSs (7.2 pg WHO-TEQ/Nm(3)), and the lowest in the EAF industry (1.8 pg WHO-TEQ/Nm(3)). The congener profiles were consistent in serum and in air samples collected in the copper smelters, but not for ALSs and EAF. In secondary copper smelters, the air PCDD/Fs levels might be directly linked to the PCDD/Fs accumulated in the workers due to the exceedingly stable congener pattern of the PCDD/F emission. PMID:19717228

  13. Exceedances of air quality standard level of PM2.5 in Japan caused by Siberian wildfires

    NASA Astrophysics Data System (ADS)

    Ikeda, Kohei; Tanimoto, Hiroshi

    2015-10-01

    We revisited long-term observations of PM2.5 at ground-based stations in Japan during 2001-2012 to examine possible impacts of Siberian wildfires on regional air quality. Exceedances of Japan’s air quality standard for daily mean concentration (35 μg m-3) were observed several times at Rishiri Island in northern Japan in the spring of 2003 and 2008 when intense wildfires occurred in Siberia. Satellite observations showed that aerosols and CO originating from biomass burning were transported from Siberia toward Japan. The regional chemical transport model also demonstrated that the PM2.5 enhancements during high PM2.5 days (>35 μg m-3) were attributed to Siberian wildfires, suggesting that the contribution from Siberian biomass burning had a critical impact on exceedances of air quality standard level. The monthly (May) and annual mean PM2.5 concentrations in 2003 were about twice and 20% higher, respectively, than those of the long-term average at Rishiri Island, where the influence of Siberian wildfires was the largest in Japan. Except for 2003 and 2008, a high PM2.5 day due to Siberian wildfires was not identified. Although Siberian biomass burning does not affect the air quality standard of PM2.5 for the years without strong fires, it causes exceedance of the air quality standard level when intense fires occur.

  14. Pb-free Sn-Ag-Cu ternary eutectic solder

    DOEpatents

    Anderson, I.E.; Yost, F.G.; Smith, J.F.; Miller, C.M.; Terpstra, R.L.

    1996-06-18

    A Pb-free solder includes a ternary eutectic composition consisting essentially of about 93.6 weight % Sn-about 4.7 weight % Ag-about 1.7 weight % Cu having a eutectic melting temperature of about 217 C and variants of the ternary composition wherein the relative concentrations of Sn, Ag, and Cu deviate from the ternary eutectic composition to provide a controlled melting temperature range (liquid-solid ``mushy`` zone) relative to the eutectic melting temperature (e.g. up to 15 C above the eutectic melting temperature). 5 figs.

  15. Pb-free Sn-Ag-Cu ternary eutectic solder

    DOEpatents

    Anderson, Iver E.; Yost, Frederick G.; Smith, John F.; Miller, Chad M.; Terpstra, Robert L.

    1996-06-18

    A Pb-free solder includes a ternary eutectic composition consisting essentially of about 93.6 weight % Sn-about 4.7 weight % Ag-about 1.7 weight % Cu having a eutectic melting temperature of about 217.degree. C. and variants of the ternary composition wherein the relative concentrations of Sn, Ag, and Cu deviate from the ternary eutectic composition to provide a controlled melting temperature range (liquid-solid "mushy" zone) relative to the eutectic melting temperature (e.g. up to 15.degree. C. above the eutectic melting temperature).

  16. The Analysis of PPM Levels of Gases in Air by Photoionization Mass Spectrometry

    ERIC Educational Resources Information Center

    Driscoll, John N.; Warneck, Peter

    1973-01-01

    Discusses analysis of trace gases in air by photoionization mass spectrometer. It is shown that the necessary sensitivity can be obtained by eliminating the UV monochromator and using direct ionization with a hydrogen light source. (JP)

  17. MODEL FOR MEASURING THE HEALTH IMPACT FROM CHANGING LEVELS OF AMBIENT AIR POLLUTION: MORBIDITY STUDY

    EPA Science Inventory

    The study quantitatively examines the relationship between human health and ambient air concentrations of the major pollutants in the city of Chicago. This report describes the morbidity analysis in which linear regression models have been developed to quantitatively estimate the...

  18. The Precision and Accuracy of AIRS Level 1B Radiances for Climate Studies

    NASA Technical Reports Server (NTRS)

    Hearty, Thomas J.; Gaiser, Steve; Pagano, Tom; Aumann, Hartmut

    2004-01-01

    We investigate uncertainties in the Atmospheric Infrared Sounder (AIRS) radiances based on in-flight and preflight calibration algorithms and observations. The global coverage and spectra1 resolution ((lamda)/(Delta)(lamda) 1200) of AIRS enable it to produce a data set that can be used as a climate data record over the lifetime of the instrument. Therefore, we examine the effects of the uncertainties in the calibration and the detector stability on future climate studies. The uncertainties of the parameters that go into the AIRS radiometric calibration are propagated to estimate the accuracy of the radiances and any climate data record created from AIRS measurements. The calculated radiance uncertainties are consistent with observations. Algorithm enhancements may be able to reduce the radiance uncertainties by as much as 7%. We find that the orbital variation of the gain contributes a brightness temperature bias of < 0.01 K.

  19. Energetic delayed hadrons in large air showers observed at 5200m above sea level

    NASA Technical Reports Server (NTRS)

    Kaneko, T.; Hagiwara, K.; Yoshii, H.; Martinic, N.; Siles, L.; Miranda, P.; Kakimoto, F.; Tsuchimoto, I.; Inoue, N.; Suga, K.

    1985-01-01

    Energetic delayed hadrons in air showers with electron sizes in the range 10 to the 6th power to 10 to the 9th power were studied by observing the delayed bursts produced in the shield of nine square meter scintillation detectors in the Chacaltaya air-shower array. The frequency of such delayed burst is presented as a function of electron size, core distance and sec theta.

  20. Polycyclic aromatic hydrocarbon (PAH) residues on skin in relation to air levels among roofers

    SciTech Connect

    Wolff, M.S.; Herbert, R.; Marcus, M.; Rivera, M.; Landrigan, P.J.; Andrews, L.R.

    1989-05-01

    To assess the utility of skin wipes as an index of exposure to polycyclic aromatic hydrocarbons (PAHs), simultaneous skin wipe and breathing zone air samples were obtained for 10 roofers. Samples were obtained during removal of an old coal-tar pitch roof and application of a new asphalt roof. Skin wipes were obtained immediately before and after the workshift. Anthracene was present in air but not skin samples. In air samples, the relative concentrations of seven PAHs were fluoranthene greater than pyrene greater than benzanthracene greater than benzo(a)pyrene greater than benzo(b)fluoranthene greater than benzo(ghi)perylene greater than benzo(k)fluoranthene. A similar pattern, or rank concentration, was observed in matching skin wipe samples. The amount (ng) of PAH (either total or individual compounds) found in skin wipes taken after the workday was significantly correlated with that in air samples (micrograms/m3, time-weighted average) for 8 of the 9 cases with air and skin samples taken the same day (r = 0.99 for total PAH). Skin wipe PAH residues were not significantly correlated with air samples taken 4 d earlier. These findings suggest that skin wipes can provide a useful measure of exposure to PAH.

  1. Imaging and Analysis of Void-defects in Solder Joints Formed in Reduced Gravity using High-Resolution Computed Tomography

    NASA Technical Reports Server (NTRS)

    Easton, John W.; Struk, Peter M.; Rotella, Anthony

    2008-01-01

    As a part of efforts to develop an electronics repair capability for long duration space missions, techniques and materials for soldering components on a circuit board in reduced gravity must be developed. This paper presents results from testing solder joint formation in low gravity on a NASA Reduced Gravity Research Aircraft. The results presented include joints formed using eutectic tin-lead solder and one of the following fluxes: (1) a no-clean flux core, (2) a rosin flux core, and (3) a solid solder wire with external liquid no-clean flux. The solder joints are analyzed with a computed tomography (CT) technique which imaged the interior of the entire solder joint. This replaced an earlier technique that required the solder joint to be destructively ground down revealing a single plane which was subsequently analyzed. The CT analysis technique is described and results presented with implications for future testing as well as implications for the overall electronics repair effort discussed.

  2. Artificial neural networks as a useful tool to predict the risk level of Betula pollen in the air

    NASA Astrophysics Data System (ADS)

    Castellano-Méndez, M.; Aira, M. J.; Iglesias, I.; Jato, V.; González-Manteiga, W.

    2005-05-01

    An increasing percentage of the European population suffers from allergies to pollen. The study of the evolution of air pollen concentration supplies prior knowledge of the levels of pollen in the air, which can be useful for the prevention and treatment of allergic symptoms, and the management of medical resources. The symptoms of Betula pollinosis can be associated with certain levels of pollen in the air. The aim of this study was to predict the risk of the concentration of pollen exceeding a given level, using previous pollen and meteorological information, by applying neural network techniques. Neural networks are a widespread statistical tool useful for the study of problems associated with complex or poorly understood phenomena. The binary response variable associated with each level requires a careful selection of the neural network and the error function associated with the learning algorithm used during the training phase. The performance of the neural network with the validation set showed that the risk of the pollen level exceeding a certain threshold can be successfully forecasted using artificial neural networks. This prediction tool may be implemented to create an automatic system that forecasts the risk of suffering allergic symptoms.

  3. SPECIAL ANALYSIS AIR PATHWAY MODELING OF E-AREA LOW-LEVEL WASTE FACILITY

    SciTech Connect

    Hiergesell, R.; Taylor, G.

    2011-08-30

    This Special Analysis (SA) was initiated to address a concern expressed by the Department of Energy's Low Level Waste Disposal Facility Federal Review Group (LFRG) Review Team during their review of the 2008 E-Area Performance Assessment (PA) (WSRC, 2008). Their concern was the potential for overlapping of atmospheric plumes, emanating from the soil surface above SRS LLW disposal facilities within the E-Area, to contribute to the dose received by a member of the public during the Institutional Control (IC) period. The implication of this concern was that the dose to the maximally-exposed individual (MEI) located at the SRS boundary might be underestimated during this time interval. To address this concern a re-analysis of the atmospheric pathway releases from E-Area was required. In the process of developing a new atmospheric release model (ARM) capable of addressing the LFRG plume overlap concern, it became obvious that new and better atmospheric pathway disposal limits should be developed for each of the E-Area disposal facilities using the new ARM. The scope of the SA was therefore expanded to include the generation of these new limits. The initial work conducted in this SA was to develop a new ARM using the GoldSim{reg_sign} program (GTG, 2009). The model simulates the subsurface vapor diffusion of volatile radionuclides as they release from E-Area disposal facility waste zones and migrate to the land surface. In the process of this work, many new features, including several new physical and chemical transport mechanisms, were incorporated into the model. One of the most important improvements was to incorporate a mechanism to partition volatile contaminants across the water-air interface within the partially saturated pore space of the engineered and natural materials through which vapor phase transport occurs. A second mechanism that was equally important was to incorporate a maximum concentration of 1.9E-07 Ci/m{sup 3} of {sup 14}CO{sub 2} in the air

  4. Microstructure Evolution and Shear Behavior of the Solder Joints for Flip-Chip LED on ENIG Substrate

    NASA Astrophysics Data System (ADS)

    Liu, Yang; Sun, Fenglian; Luo, Liangliang; Yuan, Cadmus A.; Zhang, Guoqi

    2015-07-01

    The microstructure evolution and shear behavior of the solder joints for the flip-chip light-emitting diode on the electroless nickel/immersion gold (ENIG) substrate were investigated in this study. The experimental results reveal that the solder joints for the anode and cathode have different microstructures and failure characteristics during the shear test before and after isothermal aging. For the solder joints for the anode, the interfacial intermetallic compound (IMC) is (Au, Ni)Sn4 at the solder/anode interface but dendritic Ni3Sn4 grains at the solder/ENIG interface after reflow. Meanwhile, the dendritic Ni3Sn4 grains are surrounded by (Au, Ni)Sn4, which suppresses the growth of the Ni3Sn4 grains during aging. For the solder joints for the cathode, a nano scaled Au-rich layer can be observed near the cathode/solder layer interface after reflow. And the Au-rich layer moves toward the bulk solder because of the volume expansion by the transformation from Au into (Au, Ni)Sn4 during reflow and isothermal aging. Due to the diffusion of the Au atom from the Au-rich layer into the bulk solder, the Au-rich layer transformed into an interface inside of the solder joint. The average shear force of the solder joints shows a decrease from 380 gf to 250 gf because of the microstructure evolution during the isothermal aging for 1000 h at 85°C. After long time aging, the primary failure mode of the solder joint for the anode changed from the anode broken to the brittle failure of the solder layer. The delamination between the IMC layer and the insulation layer is suggested to be the dominated failure mode of the solder joint for the cathode after aging.

  5. Metallurgical characterization of experimental Ag-based soldering alloys

    PubMed Central

    Ntasi, Argyro; Al Jabbari, Youssef S.; Silikas, Nick; Al Taweel, Sara M.; Zinelis, Spiros

    2014-01-01

    Aim To characterize microstructure, hardness and thermal properties of experimental Ag-based soldering alloys for dental applications. Materials and methods Ag12Ga (AgGa) and Ag10Ga5Sn (AgGaSn) were fabricated by induction melting. Six samples were prepared for each alloy and microstructure, hardness and their melting range were determined by, scanning electron microscopy, energy dispersive X-ray (EDX) microanalysis, X-ray diffraction (XRD), Vickers hardness testing and differential scanning calorimetry (DSC). Results Both alloys demonstrated a gross dendritic microstructure while according to XRD results both materials consisted predominately of a Ag-rich face centered cubic phase The hardness of AgGa (61 ± 2) was statistically lower than that of AgGaSn (84 ± 2) while the alloys tested showed similar melting range of 627–762 °C for AgGa and 631–756 °C for AgGaSn. Conclusion The experimental alloys tested demonstrated similar microstructures and melting ranges. Ga and Sn might be used as alternative to Cu and Zn to modify the selected properties of Ag based soldering alloys. PMID:25382945

  6. A microstructural study of creep and thermal fatigue deformation in 60Sn-40Pb solder joints

    SciTech Connect

    Tribula, D.

    1990-06-02

    Thermal fatigue failures of solder joints in electronic devices often arise from cyclic shear strains imposed by the mismatched thermal expansion coefficients of the materials that bind the joint as temperature changes are encountered. Increased solder joint reliability demands a fundamental understanding of the metallurigical mechanisms that control the fatigue to design accurate accelerated probative tests and new, more fatigue resistant solder alloys. The high temperatures and slow strain rates that pertain to thermal fatigue imply that creep is an important deformation mode in the thermal fatigue cycle. In this work, the creep behaviour of a solder joint is studied to determine the solder's microstructural response to this type of deformation and to relate this to the more complex problem of thermal fatigue. It is shown that creep failures arise from the inherent inhomogeneity and instability of the solder microstructure and suggest that small compositional changes of the binary near-eutectic Pn-Sn alloy may defeat the observed failure mechanisms. This work presents creep and thermal fatigue data for several near-eutectic Pb-Sn solder compositions and concludes that a 58Sn-40Pb-2In and a 58Sn-40Pb-2Cd alloy show significantly enhanced fatigue resistance over that of the simple binary material. 80 refs., 33 figs., 1 tab.

  7. Simulation of Grain Growth in a Near-Eutectic Solder Alloy

    SciTech Connect

    TIKARE,VEENA; VIANCO,PAUL T.

    1999-12-16

    Microstructural evolution due to aging of solder alloys determines their long-term reliability as electrical, mechanical and thermal interconnects in electronics packages. The ability to accurately determine the reliability of existing electronic components as well as to predict the performance of proposed designs depends upon the development of reliable material models. A kinetic Monte Carlo simulation was used to simulate microstructural evolution in solder-class materials. The grain growth model simulated many of the microstructural features observed experimentally in 63Sn-37Pb, a popular near-eutectic solder alloy. The model was validated by comparing simulation results to new experimental data on coarsening of Sn-Pb solder. The computational and experimental grain growth exponent for two-phase solder was found to be much lower than that for normal, single phase grain growth. The grain size distributions of solders obtained from simulations were narrower than that of normal grain growth. It was found that the phase composition of solder is important in determining grain growth behavior.

  8. The failure analysis and lifetime prediction for the solder joint of the magnetic head

    NASA Astrophysics Data System (ADS)

    Xiao, Xianghui; Peng, Minfang; Cardoso, Jaime S.; Tang, Rongjun; Zhou, YingLiang

    2015-02-01

    Micro-solder joint (MSJ) lifetime prediction methodology and failure analysis (FA) are to assess reliability by fatigue model with a series of theoretical calculations, numerical simulation and experimental method. Due to shortened time of solder joints on high-temperature, high-frequency sampling error that is not allowed in productions may exist in various models, including round-off error. Combining intermetallic compound (IMC) growth theory and the FA technology for the magnetic head in actual production, this thesis puts forward a new growth model to predict life expectancy for solder joint of the magnetic head. And the impact of IMC, generating from interface reaction between slider (magnetic head, usually be called slider) and bonding pad, on mechanical performance during aging process is analyzed in it. By further researching on FA of solder ball bonding, thesis chooses AuSn4 growth model that affects least to solder joint mechanical property to indicate that the IMC methodology is suitable to forecast the solder lifetime. And the diffusion constant under work condition 60 °C is 0.015354; the solder lifetime t is 14.46 years.

  9. Thermomigration: An experimental damage mechanics study on nanoelectronic lead free solder alloys

    NASA Astrophysics Data System (ADS)

    Abdul Hamid, Mohd Foad

    This dissertation focuses on experimental study of thermomigration in lead-free solder alloys. Thermomigration in microelectronic solder joints was not a concern until significant miniaturization of electronics devices required to run high current densities with smaller solder joint sizes. High current density induces electromigration and Joule heating at the same time. The imbalance of Joule heating generated at top and bottom of solder joint causes a temperature gradient which is large enough to induce thermomigration damage. In the literature, most studies report electromigration induced damage without considering the influence of thermomigration, thus the effect of electromigration and thermomigration can not be individually identified. This dissertation studies the experimental damage mechanics of thermomigration without electromigration by studying formation and destruction of intermetallic compound, and vacancy migration due to diffusion driving forces. Microstructural degradation and hardness testing were used to quantify thermomigration induced damage. After studying material science and physics behind the thermomigration process, using test vehicles, the combined effects of electromigration and thermomigration were studied experimentally. The studies were repeated at a subzero temperatures to see the effect of low temperature on thermomigration and electromigration, and reliability of nanoelectronic solder joints. A new time to failure equation is proposed to show a threshold temperature below which diffusion slows down significantly. By ensuring the solder operating temperature is well kept below the threshold value by proper thermal management, the solder joint life can be extended.

  10. Temperature-controlled laser-soldering system and its clinical application for bonding skin incisions.

    PubMed

    Simhon, David; Gabay, Ilan; Shpolyansky, Gregory; Vasilyev, Tamar; Nur, Israel; Meidler, Roberto; Hatoum, Ossama Abu; Katzir, Abraham; Hashmonai, Moshe; Kopelman, Doron

    2015-01-01

    Laser tissue soldering is a method of repairing incisions. It involves the application of a biological solder to the approximated edges of the incision and heating it with a laser beam. A pilot clinical study was carried out on 10 patients who underwent laparoscopic cholecystectomy. Of the four abdominal incisions in each patient, two were sutured and two were laser soldered. Cicatrization, esthetical appearance, degree of pain, and pruritus in the incisions were examined on postoperative days 1, 7, and 30. The soldered wounds were watertight and healed well, with no discharge from these wounds or infection. The total closure time was equal in both methods, but the net soldering time was much shorter than suturing. There was no difference between the two types of wound closure with respect to the pain and pruritus on a follow-up of one month. Esthetically, the soldered incisions were estimated as good as the sutured ones. The present study confirmed that temperature-controlled laser soldering of human skin incisions is clinically feasible, and the results obtained were at least equivalent to those of standard suturing. PMID:26720882

  11. Enhanced laser tissue soldering using indocyanine green chromophore and gold nanoshells combination

    NASA Astrophysics Data System (ADS)

    Khosroshahi, Mohammad E.; Nourbakhsh, Mohammad S.

    2011-08-01

    Gold nanoshells (GNs) are new materials that have an optical response dictated by the plasmon resonance. The wavelength at which the resonance occurs depends on the core and shell sizes. The purposes of this study were to use the combination of indocyanine green (ICG) and different concentration of gold nanoshells for skin tissue soldering and also to examine the effect of laser soldering parameters on the properties of repaired skin. Two mixtures of albumin solder and different combinations of ICG and gold nanoshells were prepared. A full thickness incision of 2 × 20 mm2 was made on the surface and after addition of mixtures it was irradiated by an 810 nm diode laser at different power densities. The changes of tensile strength (σt) due to temperature rise, number of scan (Ns), and scan velocity (Vs) were investigated. The results showed at constant laser power density (I), σt of repaired incisions increases by increasing the concentration of gold nanoshells in solder, Ns, and decreasing Vs. It was demonstrated that laser soldering using combination of ICG + GNs could be practical provided the optothermal properties of the tissue are carefully optimized. Also, the tensile strength of soldered skin is higher than skins that soldered with only ICG or GNs. In our case, this corresponds to σt = 1800 g cm-2 at I ~ 47 Wcm-2, T ~ 85 ºC, Ns = 10, and Vs = 0.3 mms-1.

  12. Wound healing studies of skin incisions in animal models: laser soldering versus other bonding methods

    NASA Astrophysics Data System (ADS)

    Simhon, David; Vasilyev, Tamar; Brosh, Tamar; Nevo, Zvi; Tennenbaum, Tamar; Kariv, Naam; Katzir, Abraham

    2003-06-01

    In the past, we have successfully used laser soldering for bonding cuts in the skin of medium and large size animal models. In this work, we have used the same method for bonding cuts on the backs of rabbits and mature pigs model. Cuts were created in dorsally depilated skins of rabbits and mature pigs. 47% bovine serum albumin (BSA) solder was applied onto the approximated edges of each cut, using a special approximation device. An infrared fiberoptic CO2 laser system was used to heat a spot on the cut, under good temperature control, to 65°C for 10 seconds. Other glued or sutured cuts, served as controls. Immediate tensile strength measurements were done on bonded incisions in rabbit skins. We found that laser soldered incisions exhibited similar strength to one bonded by cayanoacrylate glue. No dehiscence of wound edges was found in both treatments. The laser soldering procedure was 25% faster then suturing. A 14-day follow up of the bonded pig skin incisions was carried out, using punch biopsies. We found better aesthetic appearance of the soldered incisions. We observed better and faster wound repair in the laser-soldered scars, using histological and molecular staining. The temperature controlled laser soldering offers immediate strength similar to that of cyanoacrylate glues and better aesthetic and wound healing properties, in comparison to suturing techniques. We have clearly demonstrated the potential of this novel technique, which will pave thw way for clinical studies.

  13. Temperature-controlled laser-soldering system and its clinical application for bonding skin incisions

    NASA Astrophysics Data System (ADS)

    Simhon, David; Gabay, Ilan; Shpolyansky, Gregory; Vasilyev, Tamar; Nur, Israel; Meidler, Roberto; Hatoum, Ossama Abu; Katzir, Abraham; Hashmonai, Moshe; Kopelman, Doron

    2015-12-01

    Laser tissue soldering is a method of repairing incisions. It involves the application of a biological solder to the approximated edges of the incision and heating it with a laser beam. A pilot clinical study was carried out on 10 patients who underwent laparoscopic cholecystectomy. Of the four abdominal incisions in each patient, two were sutured and two were laser soldered. Cicatrization, esthetical appearance, degree of pain, and pruritus in the incisions were examined on postoperative days 1, 7, and 30. The soldered wounds were watertight and healed well, with no discharge from these wounds or infection. The total closure time was equal in both methods, but the net soldering time was much shorter than suturing. There was no difference between the two types of wound closure with respect to the pain and pruritus on a follow-up of one month. Esthetically, the soldered incisions were estimated as good as the sutured ones. The present study confirmed that temperature-controlled laser soldering of human skin incisions is clinically feasible, and the results obtained were at least equivalent to those of standard suturing.

  14. Enhanced laser tissue soldering using indocyanine green chromophore and gold nanoshells combination.

    PubMed

    Khosroshahi, Mohammad E; Nourbakhsh, Mohammad S

    2011-08-01

    Gold nanoshells (GNs) are new materials that have an optical response dictated by the plasmon resonance. The wavelength at which the resonance occurs depends on the core and shell sizes. The purposes of this study were to use the combination of indocyanine green (ICG) and different concentration of gold nanoshells for skin tissue soldering and also to examine the effect of laser soldering parameters on the properties of repaired skin. Two mixtures of albumin solder and different combinations of ICG and gold nanoshells were prepared. A full thickness incision of 2 × 20 mm(2) was made on the surface and after addition of mixtures it was irradiated by an 810 nm diode laser at different power densities. The changes of tensile strength (σ(t)) due to temperature rise, number of scan (Ns), and scan velocity (Vs) were investigated. The results showed at constant laser power density (I), σ(t) of repaired incisions increases by increasing the concentration of gold nanoshells in solder, Ns, and decreasing Vs. It was demonstrated that laser soldering using combination of ICG + GNs could be practical provided the optothermal properties of the tissue are carefully optimized. Also, the tensile strength of soldered skin is higher than skins that soldered with only ICG or GNs. In our case, this corresponds to σ(t) = 1800 g cm(-2) at I ∼ 47 Wcm(-2), T ∼ 85 [ordinal indicator, masculine]C, Ns = 10, and Vs = 0.3 mms(-1). PMID:21895342

  15. Proinflammatory and anti-inflammatory cytokines in adolescents from Southeast Bulgarian cities with different levels of air pollution.

    PubMed

    Dobreva, Zlatka Georgieva; Kostadinova, Gergana Stoianova; Popov, Borislav Nikolov; Petkov, Georgi Stefanov; Stanilova, Spaska Angelova

    2015-12-01

    Epidemiological studies demonstrated that the exposure of different air pollutants including particulate matter (PM) has been related to adverse effect on immune system. Current study was designed to investigate cytokines in blood plasma of adolescent persons continuously exposed to different degrees of ambient air pollutions. Tumor necrosis factor-α (TNF-α), interleukin 6 (IL-6), IL-12p40, and IL-10 were chosen as cytokines of proinflammatory and anti-inflammatory immune response. The peripheral venous blood was taken from adolescents living in the cities of Stara Zagora region, Southeast Bulgaria, that is, in Stara Zagora, Kazanlak, and Chirpan. The quantity of cytokines in plasma samples was determined by enzyme-linked immunosorbent assay. Results demonstrated that youths living in Stara Zagora showed significantly smaller quantity of TNF-α, compared with adolescents from Kazanlak and Chirpan. Moreover, adolescents living in Stara Zagora showed significantly higher quantity of IL-10 than students from Kazanlak and Chirpan. Analysis of the data of air quality gives reason to assert that PM10 and PM2.5 have been the main atmospheric pollutants around the monitoring points. The complex air quality assessment based on these criteria determined that the highest air pollution was in the city of Stara Zagora, followed by Chirpan and the relatively unpolluted town was Kazanlak. We concluded that air pollutants, mostly PM2.5, can modulate cytokine production and can change the balance between proinflammatory TNF-α and anti-inflammatory IL-10 production. Increased levels of IL-10 combined with decreased level of TNF-α in adolescents living in Stara Zagora can serve as a biomarker for suppression of T helper 1 (Th1) cell-mediated immunity and exacerbation of Th2 humoral immune response and could be a prerequisite for the development of allergic and autoimmune diseases. PMID:23771874

  16. Flying-qualities criteria for wings-level-turn maneuvering during an air-to-ground weapon delivery task

    NASA Technical Reports Server (NTRS)

    Sammonds, R. I.; Bunnell, J. W., Jr.

    1980-01-01

    A moving-base simulator experiment conducted at Ames Research Center demonstrated that a wings-level-turn control mode improved flying qualities for air-to-ground weapons delivery compared with those of a conventional aircraft. Evaluations of criteria for dynamic response for this system have shown that pilot ratings correlate well on the basis of equivalent time constant of the initial response. Ranges of this time constant, as well as digital-system transport delays and lateral-acceleration control authorities that encompassed Level I through Level III handling qualities, were determined.

  17. Comparison of different sampling methods for the determination of low-level radionuclides in air.

    PubMed

    Duch, Ma; Serrano, I; Cabello, V; Camacho, A

    2016-03-01

    The aim of this work is to check the consistency of results given by different air dust samplers (flow-rates between 2 and 700m(3)/h) and measurement protocols at a single location. The study is focussed on (210)Pb since is the only nuclide that can be easily assessed through all the studied sampler types. Results from high- and mid-volume samplers agreed well to within the associated uncertainties. Gross beta activity from low-volume samplers can be used as a good indicator of the evolution of (210)Pb concentration in air. PMID:26631453

  18. A piloted simulation investigation of yaw dynamics requirements for turreted gun use in low-level helicopter air combat

    NASA Technical Reports Server (NTRS)

    Decker, William A.; Morris, Patrick M.; Williams, Jeffrey N.

    1988-01-01

    A piloted, fixed-base simulation study was conducted to investigate the handling qualities requirements for helicopter air-to-air combat using turreted guns in the near-terrain environment. The study used a version of the helicopter air combat system developed at NASA Ames Research Center for one-on-one air combat. The study focused on the potential trade-off between gun angular movement capability and required yaw axis response. Experimental variables included yaw axis response frequency and damping and the size of the gun-movement envelope. A helmet position and sighting system was used for pilot control of gun aim. Approximately 340 simulated air combat engagements were evaluated by pilots from the Army and industry. Results from the experiment indicate that a highly-damped, high frequency yaw response was desired for Level I handling qualities. Pilot preference for those characteristics became more pronounced as gun turret movement was restricted; however, a stable, slow-reacting platform could be used with a large turret envelope. Most pilots preferred to engage with the opponent near the own-ship centerline. Turret elevation restriction affected the engagement more than azimuth restrictions.

  19. Residential heating contribution to level of air pollutants (PAHs, major, trace, and rare earth elements): a moss bag case study.

    PubMed

    Vuković, Gordana; Aničić Urošević, Mira; Pergal, Miodrag; Janković, Milan; Goryainova, Zoya; Tomašević, Milica; Popović, Aleksandar

    2015-12-01

    In areas with moderate to continental climates, emissions from residential heating system lead to the winter air pollution peaks. The EU legislation requires only the monitoring of airborne concentrations of particulate matter, As, Cd, Hg, Ni, and B[a]P. Transition metals and rare earth elements (REEs) have also arisen questions about their detrimental health effects. In that sense, this study examined the level of extensive set of air pollutants: 16 polycyclic aromatic hydrocarbons (PAHs), and 41 major elements, trace elements, and REEs using Sphagnum girgensohnii moss bag technique. During the winter of 2013/2014, the moss bags were exposed across Belgrade (Serbia) to study the influence of residential heating system to the overall air quality. The study was set as an extension to our previous survey during the summer, i.e., non-heating season. Markedly higher concentrations of all PAHs, Sb, Cu, V, Ni, and Zn were observed in the exposed moss in comparison to the initial values. The patterns of the moss REE concentrations normalized to North American Shale Composite and Post-Archean Australian Shales were identical across the study area but enhanced by anthropogenic activities. The results clearly demonstrate the seasonal variations in the moss enrichment of the air pollutants. Moreover, the results point out a need for monitoring of air quality during the whole year, and also of various pollutants, not only those regulated by the EU Directive. PMID:26213134

  20. Lacrimal Cytokines Assessment in Subjects Exposed to Different Levels of Ambient Air Pollution in a Large Metropolitan Area

    PubMed Central

    Matsuda, Monique; Bonatti, Rodolfo; Marquezini, Mônica V.; Garcia, Maria L. B.; Santos, Ubiratan P.; Braga, Alfésio L. F.; Alves, Milton R.

    2015-01-01

    Background Air pollution is one of the most environmental health concerns in the world and has serious impact on human health, particularly in the mucous membranes of the respiratory tract and eyes. However, ocular hazardous effects to air pollutants are scarcely found in the literature. Design Panel study to evaluate the effect of different levels of ambient air pollution on lacrimal film cytokine levels of outdoor workers from a large metropolitan area. Methods Thirty healthy male workers, among them nineteen professionals who work on streets (taxi drivers and traffic controllers, high pollutants exposure, Group 1) and eleven workers of a Forest Institute (Group 2, lower pollutants exposure compared to group 1) were evaluated twice, 15 days apart. Exposure to ambient PM2.5 (particulate matter equal or smaller than 2.5 μm) was 24 hour individually collected and the collection of tears was performed to measure interleukins (IL) 2, 4, 5 and 10 and interferon gamma (IFN-γ) levels. Data from both groups were compared using Student’s t test or Mann- Whitney test for cytokines. Individual PM2.5 levels were categorized in tertiles (lower, middle and upper) and compared using one-way ANOVA. Relationship between PM2.5 and cytokine levels was evaluated using generalized estimating equations (GEE). Results PM2.5 levels in the three categories differed significantly (lower: ≤22 μg/m3; middle: 23–37.5 μg/m3; upper: >37.5 μg/m3; p<0.001). The subjects from the two groups were distributed unevenly in the lower category (Group 1 = 8%; Group 2 = 92%), the middle category (Group 1 = 89%; Group 2 = 11%) and the upper category (Group 1 = 100%). A significant relationship was found between IL-5 and IL-10 and PM2.5 levels of the group 1, with an average decrease of 1.65 pg/mL of IL-5 level and of 0.78 pg/mL of IL-10 level in tear samples for each increment of 50 μg/m3 of PM2.5 (p = 0.01 and p = 0.003, respectively). Conclusion High levels of PM2.5 exposure is associated

  1. Burden of Outdoor Air Pollution in Kerala, India—A First Health Risk Assessment at State Level

    PubMed Central

    Tobollik, Myriam; Razum, Oliver; Wintermeyer, Dirk; Plass, Dietrich

    2015-01-01

    Ambient air pollution causes a considerable disease burden, particularly in South Asia. The objective of the study is to test the feasibility of applying the environmental burden of disease method at state level in India and to quantify a first set of disease burden estimates due to ambient air pollution in Kerala. Particulate Matter (PM) was used as an indicator for ambient air pollution. The disease burden was quantified in Years of Life Lost (YLL) for the population (30 + years) living in urban areas of Kerala. Scenario analyses were performed to account for uncertainties in the input parameters. 6108 (confidence interval (95% CI): 4150–7791) of 81,636 total natural deaths can be attributed to PM, resulting in 96,359 (95% CI: 65,479–122,917) YLLs due to premature mortality (base case scenario, average for 2008–2011). Depending on the underlying assumptions the results vary between 69,582 and 377,195 YLLs. Around half of the total burden is related to cardiovascular deaths. Scenario analyses show that a decrease of 10% in PM concentrations would save 15,904 (95% CI: 11,090–19,806) life years. The results can be used to raise awareness about air quality standards at a local level and to support decision-making processes aiming at cleaner and healthier environments. PMID:26343701

  2. Young Scientists Explore Air, Land, and Water Life. Book 3 Primary Level.

    ERIC Educational Resources Information Center

    Penn, Linda

    Designed to present interesting facts about science and to heighten the curiosity of primary age students, this book contains activities about the natural world and numerous black and white illustrations. The activities focus on familiar animals that are found in the air, on land, and in the water. A duckling named Little Mac Mallard introduces…

  3. Understanding the Relationships between Air Pollution Levels and Human Health Outcomes

    EPA Science Inventory

    As mandated by the CAA, EPA established National Ambient Air Quality Standards (NAAQS) for criteria pollutants and conducts periodic review of the NAAQS to assess if they need to be revised. The CAA then provides for implementation of the NAAQS based on a combination of local con...

  4. Understanding the structure of hydrophobic surfactants at the air/water interface from molecular level.

    PubMed

    Zhang, Li; Liu, Zhipei; Ren, Tao; Wu, Pan; Shen, Jia-Wei; Zhang, Wei; Wang, Xinping

    2014-11-25

    Understanding the behavior of fluorocarbon surfactants at the air/water interface is crucial for many applications, such as lubricants, paints, cosmetics, and fire-fighting foams. In this study, molecular dynamics (MD) simulations were employed to investigate the microscopic properties of non-ionic fluorocarbon surfactants at the air/water interface. Several properties, including the distribution of head groups, the distribution probability of the tilt angle between hydrophobic tails with respect to the xy plane, and the order parameter of surfactants, were computed to probe the structure of hydrophobic surfactants at the air/water interface. The effects of the monomer structure on interfacial phenomena of non-ionic surfactants were investigated as well. It is observed that the structure of fluorocarbon surfactants at the air/water interface is more ordered than that of hydrocarbons, which is dominated by the van der Waals interaction between surfactants and water molecules. However, replacing one or two CF2 with one or two CH2 group does not significantly influence the interfacial structure, suggesting that hydrocarbons may be promising alternatives to perfluorinated surfactants. PMID:25358083

  5. MODEL FOR MEASURING THE HEALTH IMPACT FROM CHANGING LEVELS OF AMBIENT AIR POLLUTION: MORTALITY STUDY

    EPA Science Inventory

    The major objective of this study is to answer the questions, Is a recent mortality decline in the city of Chicago caused by a decrease in the amount of major air pollutants such as suspended particulate and sulfur dioxide. Based on multiple regression analysis for the cross-sect...

  6. Air-climate-energy investigations with a state-level Integrated Assessment Model: GCAM-USA

    EPA Science Inventory

    The Global Change Assessment Model (GCAM) is a global integrated assessment model used for exploring future scenarios and examining strategies that address air pollution, climate change, and energy goals.  GCAM includes technology-rich representations of the energy, transportatio...

  7. Potentiodynamic polarization effect on phase and microstructure of SAC305 solder in hydrochloric acid solution

    NASA Astrophysics Data System (ADS)

    Zaini, Nurwahida Binti Mohd; Nazeri, Muhammad Firdaus Bin Mohd

    2016-07-01

    The corrosion analysis of SAC305 lead free solder was investigated in Hydrochloric acid (HCl) solution. Potentiodynamic polarization was used to polarize the SAC305. The effect of polarization on the phase and microstructure were compared to as-prepared SAC305 solder. Potentiodynamic polarization introduces mixed corrosion products on the surface of SAC305 solder. The XRD analysis confirms that the mixed corrosion products emerged on the surface after polarization by formation of SnO and SnO2 of which confirmed that dissolution of Sn was dominant during polarization. Microstructure analysis reveal the presence of gap and porosities produced limits the protection offered by the passivation film.

  8. Research on defects inspection of solder balls based on eddy current pulsed thermography.

    PubMed

    Zhou, Xiuyun; Zhou, Jinlong; Tian, Guiyun; Wang, Yizhe

    2015-01-01

    In order to solve tiny defect detection for solder balls in high-density flip-chip, this paper proposed feasibility study on the effect of detectability as well as classification based on eddy current pulsed thermography (ECPT). Specifically, numerical analysis of 3D finite element inductive heat model is generated to investigate disturbance on the temperature field for different kind of defects such as cracks, voids, etc. The temperature variation between defective and non-defective solder balls is monitored for defects identification and classification. Finally, experimental study is carried on the diameter 1mm tiny solder balls by using ECPT and verify the efficacy of the technique. PMID:26473871

  9. Low-temperature solder for joining large cryogenic structures. [cooling cools for the National Transonic Facility

    NASA Technical Reports Server (NTRS)

    Buckley, J. D.; Sandefur, P. G., Jr.

    1980-01-01

    Three joining methods were considered for use in fabricating cooling coils for the National Transonic Facility. After analysis and preliminary testing, soldering was chosen as the cooling coil joining technique over mechanical force fit and brazing techniques. Charpy V-Notch tests, cyclic thermal tests (ambient to 77.8 K) and tensile tests at cryogenic temperatures were performed on solder joints to evaluate their structural integrity. It was determined that low temperature solder can be used to ensure good fin-to-tube contact for cooling-coil applications.

  10. Fluid Dynamics and Solidification of Molten Solder Droplets Impacting on a Substrate in Microgravity

    NASA Technical Reports Server (NTRS)

    Poulikakos, Dimos; Megaridis, Constantine M.; Vedha-Nayagam, M.

    1996-01-01

    This program investigates the fluid dynamics and simultaneous solidification of molten solder droplets impacting on a flat substrate. The problem of interest is directly relevant to the printing of microscopic solder droplets in surface mounting of microelectronic devices. The study consists of a theoretical and an experimental component. The theoretical work uses axisymmetric Navier-Stokes models based on finite element techniques. The experimental work is performed in microgravity to allow for the use of larger solder droplets that make feasible the performance of accurate measurements while maintaining similitude of the relevant fluid dynamics groups (Re, We) and keeping the effect of gravity negligible.

  11. Fluid Dynamics and Solidification of Molten Solder Droplets Impacting on a Substrate in Microgravity

    NASA Technical Reports Server (NTRS)

    Megardis, C. M.; Poulikakos, D.; Diversiev, G.; Boomsma, K.; Xiong, B.; Nayagam, V.

    1999-01-01

    This program investigates the fluid dynamics and simultaneous solidification of molten solder droplets impacting on a flat smooth substrate. The problem of interest is directly relevant to the printing of microscopic solder droplets in surface mounting of microelectronic devices. The study consists of a theoretical and an experimental component. The theoretical work uses axisymmetric Navier-Stokes models based on finite element techniques. The experimental work will be ultimately performed in microgravity in order to allow for the use of larger solder droplets which make feasible the performance of accurate measurements, while maintaining similitude of the relevant fluid dynamics groups (Re, We).

  12. Research on Defects Inspection of Solder Balls Based on Eddy Current Pulsed Thermography

    PubMed Central

    Zhou, Xiuyun; Zhou, Jinlong; Tian, Guiyun; Wang, Yizhe

    2015-01-01

    In order to solve tiny defect detection for solder balls in high-density flip-chip, this paper proposed feasibility study on the effect of detectability as well as classification based on eddy current pulsed thermography (ECPT). Specifically, numerical analysis of 3D finite element inductive heat model is generated to investigate disturbance on the temperature field for different kind of defects such as cracks, voids, etc. The temperature variation between defective and non-defective solder balls is monitored for defects identification and classification. Finally, experimental study is carried on the diameter 1mm tiny solder balls by using ECPT and verify the efficacy of the technique. PMID:26473871

  13. International comparison CCQM-K82: methane in air at ambient level (1800 to 2200) nmol/mol

    NASA Astrophysics Data System (ADS)

    Flores, Edgar; Viallon, Joële; Choteau, Tiphaine; Moussay, Philippe; Wielgosz, Robert I.; Kang, Namgoo; Kim, Byung Moon; Zalewska, Ewelina; H van der Veen, Adriaan (A. M.; Konopelko, Leonid; Wu, Hai; Han, Qiao; Rhoderick, George; Guenther, Franklin R.; Watanabe, Takuro; Shimosaka, Takuya; Kato, Kenji; Hall, Brad; Brewer, Paul

    2015-01-01

    The CCQM-K82 comparison was designed to evaluate the degrees of equivalence of NMI capabilities for methane in air primary reference mixtures in the range (1800 to 2200) nmol/mol. The balance gas for the standards was either scrubbed dry real air or synthetic air. CH4 in air standards have been produced by a number of laboratories for many years, with more recent developments focused on standards at atmospheric measurement concentrations and aimed at obtaining agreement between independently produced standards. A comparison of the differences in primary gas standards for methane in air was previously performed in 2003 (CCQM-P41 Greenhouse gases. 1 and 2) with a standard deviation of results around the reference value of 30 nmol/mol and 10 nmol/mol for a more limited set of standards. This can be contrasted with the level of agreement required from field laboratories routinely measuring atmospheric methane levels, set by Data Quality Objectives (DQO) established by the World Meteorological Organization (WMO) to reflect the scientifically desirable level of compatibility for CH4 measurements at the global scale, currently set at 2 nmol/mol (1 sigma). The measurements of this key comparison took place from May 2012 to June 2012. Eight laboratories took part in this comparison coordinated by the BIPM and NIST. Key comparison reference values were calculated based on Cavity Ring Down Spectroscopy Measurements performed at the BIPM, combined with participant's gravimetric values to identify a consistent set of standards. Regression analysis allowed predicted values for each standard to be calculated which acted as the KCRVs. In this comparison reported standard uncertainties by participants ranged from 0.50 nmol/mol to 2.4 nmol/mol and the uncertainties of individual KCRVs ranged from 0.68 nmol/mol to 0.71 nmol/mol. The standard deviation of the ensemble of standards about the KCRV value was 1.70 nmol/mol. This represents a greater than tenfold improvement in the level

  14. Association between ADSL, GARS-AIRS-GART, DGAT1, and DECR1 expression levels and pork meat quality traits.

    PubMed

    Zhang, X D; Zhang, S J; Ding, Y Y; Feng, Y F; Zhu, H Y; Huang, L; Wu, T; Zhou, J; Yin, Z J

    2015-01-01

    In this study, meat quality traits were compared between Chinese lard- and European lean-type pigs. The association between expression of four genes (ADSL, GARS-AIRS-GART, DGAT1, and DECR1) and meat quality traits was also investigated. Meat quality traits were found to differ significantly between pig breeds. Meat color parameter values (a* and b*) and intramuscular fat content in Anqingliubai were significantly higher than those in Landrace (P < 0.01). Meat pH at 1 and 24 h following slaughter was significantly higher in Landrace than in Wei pigs, and meat inosine monophosphate (IMP) content was significantly higher in Landrace than in Wei and Anqingliubai pigs (both P < 0.01). Expression levels of ADSL, GARS-AIRS-GART, and DGAT1 were higher in longissimus lumborum muscle than in heart or liver tissues. ADSL and GARS-AIRS-GART expression levels were correlated with meat IMP content and pH levels. The results of this study will contribute to the understanding of meat quality traits in Chinese lard- and European lean-type pigs. PMID:26600543

  15. Variation of annual effective dose due to radon level in indoor air in Marwar region of Rajasthan, India

    NASA Astrophysics Data System (ADS)

    Rani, Asha; Mittal, Sudhir; Mehra, Rohit

    2015-08-01

    In the present work, indoor radon and thoron measurements have been carried out from different locations of Jodhpur and Nagaur districts of Northern Rajasthan, India using RAD7, a solid state alpha detector. The radon and thoron concentration in indoor air varies from 8.75 to 61.25 Bq m-3 and 32.7 to 147.2 Bq m-3 with the mean value of 32 and 73 Bq m-3 respectively. The observed indoor radon concentration values are well below the action level recommended by International Commission on Radiological Protection (200-300 Bq m-3) and Environmental Protection Agency (148 Bq m-3). The survey reveals that the thoron concentration values in the indoor air are well within the International Commission on Radiological Protection (2005). The calculated total annual effective dose due to radon level in indoor air varies from 0.22 to 1.54 mSv y-1 with the mean value of 0.81 mSv y-1 which is less than even the lower limit of action level 3-10 mSv y-1 recommended by International Commission on Radiological Protection (2005).

  16. Variation of annual effective dose due to radon level in indoor air in Marwar region of Rajasthan, India

    SciTech Connect

    Rani, Asha; Mittal, Sudhir; Mehra, Rohit

    2015-08-28

    In the present work, indoor radon and thoron measurements have been carried out from different locations of Jodhpur and Nagaur districts of Northern Rajasthan, India using RAD7, a solid state alpha detector. The radon and thoron concentration in indoor air varies from 8.75 to 61.25 Bq m{sup −3} and 32.7 to 147.2 Bq m{sup −3} with the mean value of 32 and 73 Bq m{sup −3} respectively. The observed indoor radon concentration values are well below the action level recommended by International Commission on Radiological Protection (200-300 Bq m{sup −3}) and Environmental Protection Agency (148 Bq m{sup −3}). The survey reveals that the thoron concentration values in the indoor air are well within the International Commission on Radiological Protection (2005). The calculated total annual effective dose due to radon level in indoor air varies from 0.22 to 1.54 mSv y{sup −1} with the mean value of 0.81 mSv y{sup −1} which is less than even the lower limit of action level 3-10 mSv y{sup −1} recommended by International Commission on Radiological Protection (2005)

  17. Kinetics of the wetting of tin on air-passivated copper in the absence of a fluxing agent

    SciTech Connect

    Peebles, D.E.; Peebles, H.C.; Ohlhausen, J.A.; Yost, F.G.

    1994-10-01

    A specially designed ultrahigh vacuum in situ surface analysis and wetting system has been constructed to study the spreading of liquid metal solders on carefully prepared and well-characterized solid substrates. Initial studies have been completed for the spreading of pure tin solder on copper substrates in the absence of any fluxing agent. Surface chemical analysis by x-ray photoelectron spectroscopy showed the air-exposed surface to consisted of about 3 nm of Cu{sub 2}O, while the as-received surface consisted of about 8 nm of Cu{sub 2}O. The sputter-cleaned surface contained less than one monolayer (0.3 nm) of Cu{sub 2}O. Sample surfaces were prepared and spreading experiments performed without intermediate exposure of the surfaces to contaminating atmospheres. Solder spreading was performed under 50 torr of highly purified helium gas to allow for adequate thermal coupling between the solder and the substrate. Spreading experiments utilizing a linear temperature ramp show that pure tin solder spreads readily on oxidized copper surfaces at elevated temperatures. The initiation temperature for rapid tin spreading on the as-received copper surface was 325{degrees}C, similar to the temperature where isothermal spreading changes activation energy or rate. Decreasing the thickness of the oxide on the surface lowered the observed temperature for the initiation of spreading and increased the rate of spreading. On the sputter-cleaned copper surface, rapid solder spreading was observed immediately upon melting of the solder.

  18. Air pollution and survival within the Washington University-EPRI Veterans Cohort: risks based on modelled estimates of ambient levels of hazardous and criteria air pollutants

    SciTech Connect

    Frederick W. Lipfert; Ronald E. Wyzga; Jack D. Baty; J. Philip Miller

    2009-04-15

    For this paper, we considered relationships between mortality, vehicular traffic density, and ambient levels of 12 hazardous air pollutants, elemental carbon (EC), oxides of nitrogen (NOx), sulfur dioxide (SO{sub 2}), and sulfate (SO{sub 4}{sup -2}). These pollutant species were selected as markers for specific types of emission sources, including vehicular traffic, coal combustion, smelters, and metal-working industries. Pollutant exposures were estimated using emissions inventories and atmospheric dispersion models. We analyzed associations between county ambient levels of these pollutants and survival patterns among approximately 70,000 U.S. male veterans by mortality period (1976-2001 and subsets), type of exposure model, and traffic density level. We found significant associations between all-cause mortality and traffic-related air quality indicators and with traffic density per se, with stronger associations for benzene, formaldehyde, diesel particulate, NOx, and EC. The maximum effect on mortality for all cohort subjects during the 26-yr follow-up period is approximately 10%, but most of the pollution-related deaths in this cohort occurred in the higher-traffic counties, where excess risks approach 20%. However, mortality associations with diesel particulates are similar in high- and low-traffic counties. Sensitivity analyses show risks decreasing slightly over time and minor differences between linear and logarithmic exposure models. We conclude that tailpipe emissions of both gases and particles are among the most significant and robust predictors of mortality in this cohort and that most of those associations have weakened over time. There may be concerns associated with large stationary sources burning coal, residual fuel oil and municipal solid wastes. Nickel and arsenic have been identified in coal fly ash and residual oil. 81 refs., 3 figs., 7 tabs.

  19. Mathematical Estimation of the Level of Microbial Contamination on Spacecraft Surfaces by Volumetric Air Sampling

    PubMed Central

    Oxborrow, G. S.; Roark, A. L.; Fields, N. D.; Puleo, J. R.

    1974-01-01

    Microbiological sampling methods presently used for enumeration of microorganisms on spacecraft surfaces require contact with easily damaged components. Estimation of viable particles on surfaces using air sampling methods in conjunction with a mathematical model would be desirable. Parameters necessary for the mathematical model are the effect of angled surfaces on viable particle collection and the number of viable cells per viable particle. Deposition of viable particles on angled surfaces closely followed a cosine function, and the number of viable cells per viable particle was consistent with a Poisson distribution. Other parameters considered by the mathematical model included deposition rate and fractional removal per unit time. A close nonlinear correlation between volumetric air sampling and airborne fallout on surfaces was established with all fallout data points falling within the 95% confidence limits as determined by the mathematical model. PMID:4151118

  20. Air pollution levels and regulations in the Federal Republic of Germany

    SciTech Connect

    Monarch, M.

    1986-03-01

    This report is one of a series of three prepared for the Office of Fossil Energy (OFE) of the US Department of Energy. Each report deals with one country in which acid deposition, commonly referred to as acid rain, has been a prominent issue of public discussion. The three countries covered in this series of reports are Canada, the Federal Republic of Germany, and the United Kingdom. For each country, air pollution control regulations and trends in air quality and emissions are broadly outlined, then are compared with corresponding regulations and trends in the United States. Since acid rain is the intended field of application, the reports generally deal only with sulfur dioxide, nitrogen oxides, ozone, and total suspended particulates.