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Sample records for air solder leveling

  1. Age-aware solder performance models : level 2 milestone completion.

    SciTech Connect

    Neilsen, Michael K.; Vianco, Paul Thomas; Neidigk, Matthew Aaron; Holm, Elizabeth Ann

    2010-09-01

    Legislated requirements and industry standards are replacing eutectic lead-tin (Pb-Sn) solders with lead-free (Pb-free) solders in future component designs and in replacements and retrofits. Since Pb-free solders have not yet seen service for long periods, their long-term behavior is poorly characterized. Because understanding the reliability of Pb-free solders is critical to supporting the next generation of circuit board designs, it is imperative that we develop, validate and exercise a solder lifetime model that can capture the thermomechanical response of Pb-free solder joints in stockpile components. To this end, an ASC Level 2 milestone was identified for fiscal year 2010: Milestone 3605: Utilize experimentally validated constitutive model for lead-free solder to simulate aging and reliability of solder joints in stockpile components. This report documents the completion of this milestone, including evidence that the milestone completion criteria were met and a summary of the milestone Program Review.

  2. Wave soldering with Pb-free solders

    SciTech Connect

    Artaki, I.; Finley, D.W.; Jackson, A.M.; Ray, U.; Vianco, P.T.

    1995-07-01

    The manufacturing feasibility and attachment reliability of a series of newly developed lead-free solders were investigated for wave soldering applications. Some of the key assembly aspects addressed included: wettability as a function of board surface finish, flux activation and surface tension of the molten solder, solder joint fillet quality and optimization of soldering thermal profiles. Generally, all new solder formulations exhibited adequate wave soldering performance and can be considered as possible alternatives to eutectic SnPb for wave soldering applications. Further process optimization and flux development is necessary to achieve the defect levels associated with the conventional SnPb process.

  3. Solder Contamination

    SciTech Connect

    Vianco, P.T.

    1999-02-22

    There are two sources of contamination in solder alloys. The first source is trace elements from the primary metals used in the as-manufactured product, be that product in ingot, wire, or powder form. Their levels in the primary metal are determined by the refining process. While some of these trace elements are naturally occurring materials, additional contamination can result from the refining and/or forming processes. Sources include: furnace pot liners, debris on the cutting edges of shears, rolling mill rollers, etc. The types and levels of contaminants per solder alloy are set by recognized industrial, federal, military, and international specifications. For example, the 63Sn-37Pb solder purchased to the ASTM B 32 standard can have maximum levels of contamination for the following metals: 0.08(wt.)%Cu, 0.001 %Cd, 0.005%Al, 0.25%Bi, 0.03%As, 0.02%Fe, and 0.005 %Zn. A second cause of contamination in solders, and solder baths in particular, is their actual use in soldering operations. Each time a workpiece is introduced into the bath, some dissolution of the joint base metal(s), protective or solderable coatings, and fixture metal takes place which adds to contamination levels in the solder. The potential impurities include Cu; Ni; Au or other noble metals used as protective finishes and Al; Fe; and Zn to name a few. Even dissolution of the pot wall or liner is a source of impurities, typically Fe.

  4. Soldering instrument safety improvements

    SciTech Connect

    Kosslow, W.J.; Giron, R.W.

    1994-12-31

    It is an object of the present invention to make soldering instruments safer and easier to use. According to one aspect of the present invention, a non-heatsinking, protective shield is provided around the soldering tip of the solder iron. This heat shield covers the iron`s hot tip throughout the soldering process with the exception of the time needed to perform an actual solder connection using the tip. The shield protects the user or nearby personnel from harm when the soldering iron is at elevated temperatures (500{degrees}F to 800{degrees}F).Moreover, the shield is capable of preventing fires which might result if the iron`s tip inadvertently comes into contact with an object that can be easily ignited, e.g. paper. In addition, an air vacuum system is incorporated into the shield to remove the solder smoke.

  5. Solder Bonding for Power Transistors

    NASA Technical Reports Server (NTRS)

    Snytsheuvel, H. A.; Mandel, H.

    1985-01-01

    Indium solder boosts power rating and facilitates circuit changes. Efficient heat conduction from power transistor to heat sink provided by layer of indium solder. Low melting point of indium solder (141 degrees C) allows power transistor to be removed, if circuit must be reworked, without disturbing other components mounted with ordinary solder that melts at 181 degrees C. Solder allows devices operated at higher power levels than does conventional attachment by screws.

  6. Solder poisoning

    MedlinePlus

    ... when someone swallows solder in large amounts. Skin burns can occur if solder touches the skin. This ... urine output EYES, EARS, NOSE, MOUTH, AND THROAT Burns in mouth and throat Yellow eyes (jaundice) STOMACH ...

  7. Lead-free solder

    DOEpatents

    Anderson, Iver E.; Terpstra, Robert L.

    2001-05-15

    A Sn--Ag--Cu eutectic alloy is modified with one or more low level and low cost alloy additions to enhance high temperature microstructural stability and thermal-mechanical fatigue strength without decreasing solderability. Purposeful fourth or fifth element additions in the collective amount not exceeding about 1 weight % (wt. %) are added to Sn--Ag--Cu eutectic solder alloy based on the ternary eutectic Sn--4.7%Ag--1.7%Cu (wt. %) and are selected from the group consisting essentially of Ni, Fe, and like-acting elements as modifiers of the intermetallic interface between the solder and substrate to improve high temperature solder joint microstructural stability and solder joint thermal-mechanical fatigue strength.

  8. AIRS Level 2 Status

    NASA Technical Reports Server (NTRS)

    Lee, Sung-Yung; Manning, Evan; Olsen, Edward

    2003-01-01

    The Atmospheric Infrared Sounder (AIRS) is a facility instrument onboard EOS Aqua. Major level 2 products are highlighted including temperature profile; water vapor profile; surface skin temperature and other surface parameters; and, cloud friction and top cloud pressure. Level 2 files and data availability are discussed.

  9. Gelatin based on Power-gel.TM. as solders for Cr.sup.4+laser tissue welding and sealing of lung air leak and fistulas in organs

    DOEpatents

    Alfano, Robert R.; Tang, Jing; Evans, Jonathan M.; Ho, Peng Pei

    2006-04-25

    Laser tissue welding can be achieved using tunable Cr.sup.4+ lasers, semiconductor lasers and fiber lasers, where the weld strength follows the absorption spectrum of water. The use of gelatin and esterified gelatin as solders in conjunction with laser inducted tissue welding impart much stronger tensile and torque strengths than albumin solders. Selected NIR wavelength from the above lasers can improve welding and avoid thermal injury to tissue when used alone or with gelatin and esterified gelatin solders. These discoveries can be used to enhance laser tissue welding of tissues such as skin, mucous, bone, blood vessel, nerve, brain, liver, pancreas, spleen, kidney, lung, bronchus, respiratory track, urinary tract, gastrointestinal tract, or gynecologic tract and as a sealant for pulmonary air leaks and fistulas such as intestinal, rectal and urinary fistulas.

  10. Soldering tool heats workpieces and applies solder in one operation

    NASA Technical Reports Server (NTRS)

    Gudkese, V. W.

    1966-01-01

    Fountain-pen type soldering iron heats workpieces and applies solder to joints in densely packed electronics assemblies. The basic soldering tool is used with different-sized orifice tips, eliminating the need for an assortment of conventional soldering guns.

  11. Testing of printed circuit board solder joints by optical correlation

    NASA Technical Reports Server (NTRS)

    Espy, P. N.

    1975-01-01

    An optical correlation technique for the nondestructive evaluation of printed circuit board solder joints was evaluated. Reliable indications of induced stress levels in solder joint lead wires are achievable. Definite relations between the inherent strength of a solder joint, with its associated ability to survive stress, are demonstrable.

  12. Advanced soldering processes

    SciTech Connect

    Jellison, J.L.; Golden, J.; Frear, D.R.; Hosking, F.M.; Keicher, D.M.; Yost, F.G.

    1993-02-20

    Advanced soldering processes are discussed in a complete manner. The ability to meet the needs of electronic manufacturing, while addressing the environmental issues are challenging goals. Government regulations mandate the elimination of most solvents in solder flux removal. Alternative approaches to promoting wetting are discussed. Inert atmosphere soldering, acid vapor fluxless soldering, atomic and ionic hydrogen as reactive atmospheres, fluxless laser soldering in a controlled atmosphere are offered as soldering mechanisms for the future. Laser are discussed as alternate heat sources. Various types of lasers, advantages of lasers, and fiber optic beam delivery are considered.

  13. Soldering instrument safety improvements

    DOEpatents

    Kosslow, William J.; Giron, Ronald W.

    1996-01-01

    A safe soldering device includes a retractable heat shield which can be moved between a first position in which the solder tip of the device is exposed for soldering operation and a second position in which the solder tip is covered by the heat shield. Preferably, the heat shield is biased towards the second position and may be locked in the first position for ease of use. When the soldering device is equipped with a vacuum system, the heat shield may serve to guide the flow of gases and heat from the solder tip away from the work area. The heat shield is preferably made of non-heatsinking plastic.

  14. Platinum solder core wire: Development and industrial implications

    NASA Astrophysics Data System (ADS)

    Watt, R. J.; Koursaris, A.

    1996-06-01

    Jewelry neck chain is joined by age-old techniques, the most popular being the rather involved solder powder method. The solder core method of chain manufacture is a simpler process and offers the possibility of higher productivity. Neat narrow joints are formed, and a color match between the solder and parent alloy may be approached. This is particularly important in the case of platinum alloys that have a high melting point, necessitating the use of solders with compositions substantially different from those of the parent alloy. The solder core method also lends itself to the possibility of higher levels of automation.

  15. Moisture and aging effects of solder wettability of copper surfaces

    SciTech Connect

    Hernandez, C.L.; Sorensen, N.R.; Lucero, S.J.

    1996-12-01

    Solderability is a critical property of electronic assembly that affects both manufacturing efficiency and product reliability. There is often a considerable time interval between initial fabrication of a circuit board or component and its use at the assembly level. Parts are often stored under a variety of conditions, usually not controlled. Solder wettability can soon deteriorate during storage, especially in extreme environments. This paper describes ongoing efforts at Sandia to quantify solder wettability on bare and aged Cu surfaces. In addition, organic solderability preservatives (OSPs) were applied to the bare Cu to retard solderability loss due to aging. The OSPs generally performed well, although wetting did decrease with exposure time.

  16. Soldered solar arrays

    NASA Astrophysics Data System (ADS)

    Allen, H. C.

    1982-06-01

    The ability of soldered interconnects to withstand a combination of long life and severe environmental conditions was investigated. Improvements in joint life from the use of solder mixes appropriate to low temperature conditons were studied. Solder samples were placed in a 150 C oven for 5 weeks (= 12 yr at 80 C, or 24 at 70 C according to Arrhenius's rule). Conventional and high solder melting point array samples underwent 1000 thermal cycles between -186 and 100 C. Results show that conventional and lead rich soldered arrays can survive 10 yr geostationary orbit missions.

  17. Microstructural Evolution of SAC305 Solder Joints in Wafer Level Chip-Scale Packaging (WLCSP) with Continuous and Interrupted Accelerated Thermal Cycling

    NASA Astrophysics Data System (ADS)

    Zhou, Quan; Zhou, Bite; Lee, Tae-Kyu; Bieler, Thomas

    2016-06-01

    Four high-strain design wafer level chip scale packages were given accelerated thermal cycling with a 10°C/min ramp rate and 10 min hold times between 0°C and 100°C to examine the effects of continuous and interrupted thermal cycling on the number of cycles to failure. The interruptions given two of the samples were the result of periodic examinations using electron backscattered pattern mapping, leading to room temperature aging of 30 days-2.5 years after increments of about 100 cycles at several stages of the cycling history. The continuous thermal cycling resulted in solder joints with a much larger degree of recrystallization, whereas the interrupted thermal cycling tests led to much less recrystallization, which was more localized near the package side, and the crack was more localized near the interface and had less branching. The failure mode for both conditions was still the same, with cracks nucleating along the high angle grain boundaries formed during recrystallization. In conditions where there were few recrystallized grains, recovery led to formation of subgrains that strengthened the solder, and the higher strength led to a larger driving force for crack growth through the solder, leading to failure after less than half of the cycles in the continuous accelerated thermal cycling condition. This work shows that there is a critical point where sufficient strain energy accumulation will trigger recrystallization, but this point depends on the rate of strain accumulation in each cycle and various recovery processes, which further depends on local crystal orientations, stress state evolution, and specific activated slip and twinning systems.

  18. Solderability test system

    DOEpatents

    Yost, Fred; Hosking, Floyd M.; Jellison, James L.; Short, Bruce; Giversen, Terri; Reed, Jimmy R.

    1998-01-01

    A new test method to quantify capillary flow solderability on a printed wiring board surface finish. The test is based on solder flow from a pad onto narrow strips or lines. A test procedure and video image analysis technique were developed for conducting the test and evaluating the data. Feasibility tests revealed that the wetted distance was sensitive to the ratio of pad radius to line width (l/r), solder volume, and flux predry time.

  19. Solderability test system

    DOEpatents

    Yost, F.; Hosking, F.M.; Jellison, J.L.; Short, B.; Giversen, T.; Reed, J.R.

    1998-10-27

    A new test method to quantify capillary flow solderability on a printed wiring board surface finish. The test is based on solder flow from a pad onto narrow strips or lines. A test procedure and video image analysis technique were developed for conducting the test and evaluating the data. Feasibility tests revealed that the wetted distance was sensitive to the ratio of pad radius to line width (l/r), solder volume, and flux predry time. 11 figs.

  20. Design of Experiments to Determine Causes of Flex Cable Solder Wicking, Discoloration and Hole Location Defects

    SciTech Connect

    Wolfe, Larry

    2009-04-22

    Design of Experiments (DoE) were developed and performed in an effort to discover and resolve the causes of three different manufacturing issues; large panel voids after Hot Air Solder Leveling (HASL), cable hole locations out of tolerance after lamination and delamination/solder wicking around flat flex cable circuit lands after HASL. Results from a first DoE indicated large panel voids could be eliminated by removing the pre-HASL cleaning. It also revealed eliminating the pre-HASL bake would not be detrimental when using a hard press pad lamination stackup. A second DoE indicated a reduction in hard press pad stackup lamination pressure reduced panel stretch in the y axis approximately 70%. A third DoE illustrated increasing the pre-HASL bake temperature could reduce delamination/solder wicking when using a soft press pad lamination stackup.

  1. Use of organic solderability preservatives on solderability retention of copper after accelerated aging

    SciTech Connect

    Hernandez, C.L.; Sorensen, N.R.; Lucero, S.J.

    1997-02-01

    Organic solderability preservatives (OSP`s) have been used by the electronics industry for some time to maintain the solderability of circuit boards and components. Since solderability affects both manufacturing efficiency and product reliability, there is significant interest in maintaining good solder wettability. There is often a considerable time interval between the initial fabrication of a circuit board or component and its use at the assembly level. Parts are often stored under a variety of conditions, in many cases not well controlled. Solder wettability can deteriorate during storage, especially in harsh environments. This paper describes the ongoing efforts at Sandia National Laboratories to quantify solder watability on bare and aged copper surfaces. Benzotriazole and imidazole were applied to electronic grade copper to retard aging effects on solderability. The coupons were introduced into Sandia`s Facility for Atmospheric Corrosion Testing (FACT) to simulate aging in a typical indoor industrial environment. H{sub 2}S, NO{sub 2} and Cl{sub 2} mixed gas was introduced into the test cell and maintained at 35{degrees}C and 70% relative humidity for test periods of one day to two weeks. The OSP`s generally performed better than bare Cu, although solderability diminished with increasing exposure times.

  2. Soldering In Space Investigation

    NASA Technical Reports Server (NTRS)

    2004-01-01

    This video captures Mike Fincke melting solder during the first set of planned In-Space Soldering Investigation (ISSI) experiments onboard the International Space Station (ISS). In the video, Fincke touches the tip of the soldering iron to a wire wrapped with rosin-core solder.Review of the experiment video revealed melting kinetics, wetting characteristics, and equilibrium shape attainment of the solder charge. The main photograph shows the results of feeding solder wire onto a heated surface. Here the solder is still attached with the spool seen floating in the foreground of the image. The inset photograph at right, shows a set of three simple melting experiments in which the solder, not affected by gravity, achieved an unexpected equilibrium football shape on the wire. Samples returned to Earth were examined for porosity and flux distribution as well as micro structural development. ISSI's purpose was to find out how solder behaves in a weightless environment and promote our knowledge of fabrication and repair techniques that might be employed during extended space exploration missions.

  3. Soldering In Space Investigation

    NASA Technical Reports Server (NTRS)

    2004-01-01

    This video captures Mike Fincke melting solder during the first set of planned In-Space Soldering Investigation (ISSI) experiments onboard the International Space Station (ISS). In the video, Fincke touches the tip of the soldering iron to a wire wrapped with rosin-core solder. Review of the experiment video revealed melting kinetics, wetting characteristics, and equilibrium shape attainment of the solder charge. The main photograph shows the results of feeding solder wire onto a heated surface. Here the solder is still attached with the spool seen floating in the foreground of the image. The inset photograph at right, shows a set of three simple melting experiments in which the solder, not affected by gravity, achieved an unexpected equilibrium football shape on the wire. Samples returned to Earth were examined for porosity and flux distribution as well as micro structural development. ISSI's purpose was to find out how solder behaves in a weightless environment and promote our knowledge of fabrication and repair techniques that might be employed during extended space exploration missions.

  4. AIRS Level 2 Data Products

    NASA Technical Reports Server (NTRS)

    Vicente, Gilberto

    2003-01-01

    The Atmospheric InfraRed Sounder (AIRS) Standard Retrieval Product consists of retrieved cloud and surface properties; profiles of retrieved temperature, water vapor, and ozone; and a flag indicating the presence of cloud ice or water. They contain quality assessment flags in addition to retrieved quantities and are generated for all locations where atmospheric soundings are taken. An AIRS granule consists of 6 minutes of data. This corresponds to approximately 1/15 of an orbit but exactly 45 scan lines of AMSU-A data or 135 scan lines of AIRS and HSB data.

  5. Reduced oxide soldering activation (ROSA) PWB solderability testing

    SciTech Connect

    Hernandez, C.L.; Hosking, F.M.; Reed, J.; Tench, D.M.; White, J.

    1996-02-01

    The effect of ROSA pretreatment on the solderability of environmentally stressed PWB test coupons was investigated. The PWB surface finish was an electroplated, reflowed solder. Test results demonstrated the ability to recover plated-through-hole fill of steam aged samples with solder after ROSA processing. ROSA offers an alternative method for restoring the solderability of aged PWB surfaces.

  6. Compound solder joints

    NASA Technical Reports Server (NTRS)

    Batista, R. I.; Simonson, R. B.

    1976-01-01

    Joining technique prevents contamination, may be used to join dissimilar metal tubes, minimizes fluid and gas entrapment, expedites repairs, and can yield joints having leakage rates less than 0.000001 standard cubic cm He/min. Components of joint are solder sleeve, two solder rings, Teflon sleeve, and tubing to be joined.

  7. Solder Reflow Failures in Electronic Components During Manual Soldering

    NASA Technical Reports Server (NTRS)

    Teverovsky, Alexander; Greenwell, Chris; Felt, Frederick

    2008-01-01

    This viewgraph presentation reviews the solder reflow failures in electronic components that occur during manual soldering. It discusses the specifics of manual-soldering-induced failures in plastic devices with internal solder joints. The failure analysis turned up that molten solder had squeezed up to the die surface along the die molding compound interface, and the dice were not protected with glassivation allowing solder to short gate and source to the drain contact. The failure analysis concluded that the parts failed due to overheating during manual soldering.

  8. Removing Dross From Molten Solder

    NASA Technical Reports Server (NTRS)

    Webb, Winston S.

    1990-01-01

    Automatic device helps to assure good solder connections. Machine wipes dross away from area on surface of molten solder in pot. Sweeps across surface of molten solder somewhat in manner of windshield wiper. Each cycle of operation triggered by pulse from external robot. Equipment used wherever precise, automated soldering must be done to military specifications.

  9. Stress-relieved solder joints

    NASA Technical Reports Server (NTRS)

    Zemenick, C. J.

    1980-01-01

    Mechanical stress on solder joints is reduced by procedure for soldering electronic components to circuit boards. Procedure was developed for radio-frequency (RF) strip-line circuits, for which dimensions must be carefully controlled to minimize parasitic capacitance and inductance. Procedure consists of loosening component from its mounting after each lead is soldered relieving induced stresses before next soldering step.

  10. Solder dross removal apparatus

    NASA Technical Reports Server (NTRS)

    Webb, Winston S. (Inventor)

    1990-01-01

    An automatic dross removal apparatus is disclosed for removing dross from the surface of a solder bath in an automated electric component handling system. A rotatable wiper blade is positioned adjacent the solder bath which skims the dross off of the surface prior to the dipping of a robot conveyed component into the bath. An electronic control circuit causes a motor to rotate the wiper arm one full rotational cycle each time a pulse is received from a robot controller as a component approaches the solder bath.

  11. Solder dross removal apparatus

    NASA Technical Reports Server (NTRS)

    Webb, Winston S. (Inventor)

    1992-01-01

    An automatic dross removal apparatus (10) is disclosed for removing dross from the surface of a solder bath (22) in an automated electric component handling system. A rotatable wiper blade (14) is positioned adjacent the solder bath (22) which skims the dross off of the surface prior to the dipping of a robot conveyed component into the bath. An electronic control circuit (34) causes a motor (32) to rotate the wiper arm (14) one full rotational cycle each time a pulse is received from a robot controller (44) as a component approaches the solder bath (22).

  12. Processing AIRS Scientific Data Through Level 3

    NASA Technical Reports Server (NTRS)

    Granger, Stephanie; Oliphant, Robert; Manning, Evan

    2010-01-01

    The Atmospheric Infra-Red Sounder (AIRS) Science Processing System (SPS) is a collection of computer programs, known as product generation executives (PGEs). The AIRS SPS PGEs are used for processing measurements received from the AIRS suite of infrared and microwave instruments orbiting the Earth onboard NASA's Aqua spacecraft. Early stages of the AIRS SPS development were described in a prior NASA Tech Briefs article: Initial Processing of Infrared Spectral Data (NPO-35243), Vol. 28, No. 11 (November 2004), page 39. In summary: Starting from Level 0 (representing raw AIRS data), the AIRS SPS PGEs and the data products they produce are identified by alphanumeric labels (1A, 1B, 2, and 3) representing successive stages or levels of processing. The previous NASA Tech Briefs article described processing through Level 2, the output of which comprises geo-located atmospheric data products such as temperature and humidity profiles among others. The AIRS Level 3 PGE samples selected information from the Level 2 standard products to produce a single global gridded product. One Level 3 product is generated for each day s collection of Level 2 data. In addition, daily Level 3 products are aggregated into two multiday products: an eight-day (half the orbital repeat cycle) product and monthly (calendar month) product.

  13. Detecting Defective Solder Bonds

    NASA Technical Reports Server (NTRS)

    Paulson, R.; Barney, J.; Decker, H. J.

    1984-01-01

    Method is noncontact and nondestructive. Technique detects solder bonds in solar array of other large circuit board, using thermal-imaging camera. Board placed between heat lamp and camera. Poor joints indiated by "cold" spots on the infrared image.

  14. SOLDERING OF ALUMINUM BASE METALS

    DOEpatents

    Erickson, G.F.

    1958-02-25

    This patent deals with the soldering of aluminum to metals of different types, such as copper, brass, and iron. This is accomplished by heating the aluminum metal to be soldered to slightly above 30 deg C, rubbing a small amount of metallic gallium into the part of the surface to be soldered, whereby an aluminum--gallium alloy forms on the surface, and then heating the aluminum piece to the melting point of lead--tin soft solder, applying lead--tin soft solder to this alloyed surface, and combining the aluminum with the other metal to which it is to be soldered.

  15. Solder extrusion pressure bonding process and bonded products produced thereby

    DOEpatents

    Beavis, L.C.; Karnowsky, M.M.; Yost, F.G.

    1992-06-16

    Disclosed is a process for production of soldered joints which are highly reliable and capable of surviving 10,000 thermal cycles between about [minus]40 C and 110 C. Process involves interposing a thin layer of a metal solder composition between the metal surfaces of members to be bonded and applying heat and up to about 1000 psi compression pressure to the superposed members, in the presence of a reducing atmosphere, to extrude the major amount of the solder composition, contaminants including fluxing gases and air, from between the members being bonded, to form a very thin, strong intermetallic bonding layer having a thermal expansion tolerant with that of the bonded members.

  16. Solder extrusion pressure bonding process and bonded products produced thereby

    DOEpatents

    Beavis, Leonard C.; Karnowsky, Maurice M.; Yost, Frederick G.

    1992-01-01

    Production of soldered joints which are highly reliable and capable of surviving 10,000 thermal cycles between about -40.degree. C. and 110.degree. C. Process involves interposing a thin layer of a metal solder composition between the metal surfaces of members to be bonded and applying heat and up to about 1000 psi compression pressure to the superposed members, in the presence of a reducing atmosphere, to extrude the major amount of the solder composition, contaminants including fluxing gases and air, from between the members being bonded, to form a very thin, strong intermetallic bonding layer having a thermal expansion tolerant with that of the bonded members.

  17. Comparison of isopropyl alcohol and trichloroethylene in removing solder flux: Topical report

    SciTech Connect

    Benkovich, M.G.

    1988-01-01

    This work evaluated a nontoxic solvent for its ability to remove solder flux as compared to trichloroethylene solvent. Isopropyl alcohol was evaluated for its cleaning efficiency for solder flux removal using a high pressure spray process (minimum spray pressure of 80 psig). Cleanliness levels were measured by the Meseran Surface Analyzer. Test samples also underwent gas chromatograph/mass spectrometer Analysis and were visually inspected under a longwave ultraviolet lamp. Detailed analyses of flux removal by the two solvents were made as related to solder flux types, solder flux diluted by 50% with isopropyl alcohol, and solder process conditions. 2 refs., 2 figs., 12 tabs.

  18. Processing AIRS Scientific Data Through Level 2

    NASA Technical Reports Server (NTRS)

    Oliphant, Robert; Lee, Sung-Yung; Chahine, Moustafa; Susskind, Joel; arnet, Christopher; McMillin, Larry; Goldberg, Mitchell; Blaisdell, John; Rosenkranz, Philip; Strow, Larrabee

    2007-01-01

    The Atmospheric Infrared Spectrometer (AIRS) Science Processing System (SPS) is a collection of computer programs, denoted product generation executives (PGEs), for processing the readings of the AIRS suite of infrared and microwave instruments orbiting the Earth aboard NASA s Aqua spacecraft. AIRS SPS at an earlier stage of development was described in "Initial Processing of Infrared Spectral Data' (NPO-35243), NASA Tech Briefs, Vol. 28, No. 11 (November 2004), page 39. To recapitulate: Starting from level 0 (representing raw AIRS data), the PGEs and their data products are denoted by alphanumeric labels (1A, 1B, and 2) that signify the successive stages of processing. The cited prior article described processing through level 1B (the level-2 PGEs were not yet operational). The level-2 PGEs, which are now operational, receive packages of level-1B geolocated radiance data products and produce such geolocated geophysical atmospheric data products such as temperature and humidity profiles. The process of computing these geophysical data products is denoted "retrieval" and is quite complex. The main steps of the process are denoted microwave-only retrieval, cloud detection and cloud clearing, regression, full retrieval, and rapid transmittance algorithm.

  19. Microwave Tissue Soldering for Immediate Wound Closure

    NASA Technical Reports Server (NTRS)

    Arndt, G. Dickey; Ngo, Phong H.; Plan, Chau T.; Byerly, Diane; Dusl, John; Sognier, Marguerite A.

    2011-01-01

    equipment cannot be easily moved between operating rooms, let alone relocated to field sites where emergencies often occur. In addition, this approach is highly dependent on the uniformity and thickness of the protein solder as well as the surgeon s skills. In contrast, the use of microwave energy is highly tolerant of the thickness of the protein solder, level of fluids in and around the wound, and other parameters that can adversely affect the outcome of laser welding. However, controlling the depth of penetration of the microwave energy into the wound is critical for achieving effective wound sealing without damaging the adjacent tissue. In addition, microspheres that encapsulate metallic cores could also be incorporated into the protein solder to further control the depth of penetration of the microwave energy.

  20. Capillary flow solder wettability test

    SciTech Connect

    Vianco, P.T.; Rejent, J.A.

    1996-01-01

    A test procedure was developed to assess the capillary flow wettability of solders inside of a confined geometry. The test geometry was comprised of two parallel plates with a controlled gap of constant thickness (0.008 cm, 0.018 cm, 0.025 cm, and 0.038 cm). Capillary flow was assessed by: (1) the meniscus or capillary rise of the solder within the gap, (2) the extent of void formation in the gap, and (3) the time-dependence of the risen solder film. Tests were performed with the lead-free solders.

  1. Breakthrough: Lead-free Solder

    ScienceCinema

    Anderson, Iver

    2016-07-12

    Ames Laboratory senior metallurgist Iver Anderson explains the importance of lead-free solder in taking hazardous lead out of the environment by eliminating it from discarded computers and electronics that wind up in landfills. Anderson led a team that developed a tin-silver-copper replacement for traditional lead-tin solder that has been adopted by more than 50 companies worldwide.

  2. Breakthrough: Lead-free Solder

    SciTech Connect

    Anderson, Iver

    2012-01-01

    Ames Laboratory senior metallurgist Iver Anderson explains the importance of lead-free solder in taking hazardous lead out of the environment by eliminating it from discarded computers and electronics that wind up in landfills. Anderson led a team that developed a tin-silver-copper replacement for traditional lead-tin solder that has been adopted by more than 50 companies worldwide.

  3. Corrosive microenvironments at lead solder surfaces arising from galvanic corrosion with copper pipe.

    PubMed

    Nguyen, Caroline K; Stone, Kendall R; Dudi, Abhijeet; Edwards, Marc A

    2010-09-15

    As stagnant water contacts copper pipe and lead solder (simulated soldered joints), a corrosion cell is formed between the metals in solder (Pb, Sn) and the copper. If the resulting galvanic current exceeds about 2 μA/cm(2), a highly corrosive microenvironment can form at the solder surface, with pH < 2.5 and chloride concentrations at least 11 times higher than bulk water levels. Waters with relatively high chloride tend to sustain high galvanic currents, preventing passivation of the solder surface, and contributing to lead contamination of potable water supplies. The total mass of lead corroded was consistent with predictions based on the galvanic current, and lead leaching to water was correlated with galvanic current. If the concentration of sulfate in the water increased relative to chloride, galvanic currents and associated lead contamination could be greatly reduced, and solder surfaces were readily passivated.

  4. METHOD FOR SOLDERING NORMALLY NON-SOLDERABLE ARTICLES

    DOEpatents

    McGuire, J.C.

    1959-11-24

    Methods are presented for coating and joining materials which are considered difficult to solder by utilizing an abrasive wheel and applying a bar of a suitable coating material, such as Wood's metal, to the rotating wheel to fill the cavities of the abrasive wheel and load the wheel with the coating material. The surface of the base material is then rubbed against the loaded rotating wheel, thereby coating the surface with the soft coating metal. The coating is a cohesive bonded layer and holds the base metal as tenaciously as a solder holds to easily solderable metals.

  5. Requirements for soldered electrical connections

    NASA Technical Reports Server (NTRS)

    1992-01-01

    This publication is applicable to NASA programs involving solder connections for flight hardware, mission essential support equipment, and elements thereof. This publication sets forth hand and wave soldering requirements for reliable electrical connections. The prime consideration is the physical integrity of solder connections. Special requirements may exist which are not in conformance with the requirements of this publication. Design documentation contains the detail for these requirements, and they take precedence over conflicting portions of this publication when they are approved in writing by the procuring NASA installation.

  6. A new active solder for joining electronic components

    SciTech Connect

    SMITH,RONALD W.; VIANCO,PAUL T.; HERNANDEZ,CYNTHIA L.; LUGSCHEIDER,E.; RASS,I.; HILLEN,F.

    2000-05-11

    Electronic components and micro-sensors utilize ceramic substrates, copper and aluminum interconnect and silicon. The joining of these combinations require pre-metallization such that solders with fluxes can wet such combinations of metals and ceramics. The paper will present a new solder alloy that can bond metals, ceramics and composites. The alloy directly wets and bonds in air without the use flux or premetallized layers. The paper will present typical processing steps and joint microstructures in copper, aluminum, aluminum oxide, aluminum nitride, and silicon joints.

  7. Solder extrusion pressure bonding process and bonded products produced thereby

    SciTech Connect

    Beavis, L.C.; Karnowsky, M.M.; Yost, F.G.

    1990-12-31

    Production of soldiered joints which are highly reliable and capable of surviving 10,000 thermal cycles between about {minus}40{degrees}C and 110{degrees}C. Process involves interposing a thin layer of a metal solder composition between the metal surfaces of members to be bonded and applying heat and up to about 1000 psi compression pressure to the superposed members, in the presence of a reducing atmosphere, to extrude the major amount of the solder composition, contaminants including fluxing gases and air, from between the members being bonded, to form a very thin, strong intermetallic bonding layer having a thermal expansion tolerant with that of the bonded members.

  8. Reading Grade Levels of Air Force Civilian Personnel.

    ERIC Educational Resources Information Center

    Massey, Randy H.; Mathews, John J.

    A study was conducted to examine the reading levels of United States Air Force civilian employees according to occupational groupings and grade structure. Approximately 1,050 Air Force civilian subjects were tested on the Nelson-Denny Reading Test or the California Reading Test. Subjects were selected from eight Air Force bases representing the…

  9. Wetting behavior of alternative solder alloys

    SciTech Connect

    Hosking, F.M.; Vianco, P.T.; Hernandez, C.L.; Rejent, J.A.

    1993-07-01

    Recent economic and environmental issues have stimulated interest in solder alloys other than the traditional Sn-Pb eutectic or near eutectic composition. Preliminary evaluations suggest that several of these alloys approach the baseline properties (wetting, mechanical, thermal, and electrical) of the Sn-Pb solders. Final alloy acceptance will require major revisions to existing industrial and military soldering specifications. Bulk alloy and solder joint properties are consequently being investigated to validate their producibility and reliability. The work reported in this paper examines the wetting behavior of several of the more promising commercial alloys on copper substrates. Solder wettability was determined by the meniscometer and wetting balance techniques. The wetting results suggest that several of the alternative solders would satisfy pretinning and surface mount soldering applications. Their use on plated through hole technology might be more difficult since the alloys generally did not spread or flow as well as the 60Sn-40Pb solder.

  10. Economical solder connections to thin films

    NASA Technical Reports Server (NTRS)

    Bass, J. A.; Gaddy, E. M.

    1979-01-01

    Soldering procedure, successfully tested for attaching leads to silicon solar cells, cover-glasses, is simple, inexpensive, and very effective in forming stable connection. Procedure uses solder of indium alloyed with either silver or tin.

  11. Modified Spot Welder Solders Flat Cables

    NASA Technical Reports Server (NTRS)

    Haehner, Carl L.

    1992-01-01

    Soldering device, essentially modified spot welder, melts high-melting-temperature solders without damaging plastic insulation on flat electrical cables. Solder preform rests on exposed conductor of cable, under connector pin. Electrodes press pin/preform/conductor sandwich together and supply pulse of current to melt preform, bonding pin to conductor. Anvil acts as support and heat sink. Device used to solder flexible ribbon cables to subminiature pin connectors.

  12. 16 CFR 501.8 - Solder.

    Code of Federal Regulations, 2013 CFR

    2013-01-01

    ... 16 Commercial Practices 1 2013-01-01 2013-01-01 false Solder. 501.8 Section 501.8 Commercial Practices FEDERAL TRADE COMMISSION RULES, REGULATIONS, STATEMENT OF GENERAL POLICY OR INTERPRETATION AND... 500 § 501.8 Solder. Solder and brazing alloys containing precious metals when packaged and labeled...

  13. 16 CFR 501.8 - Solder.

    Code of Federal Regulations, 2011 CFR

    2011-01-01

    ... 16 Commercial Practices 1 2011-01-01 2011-01-01 false Solder. 501.8 Section 501.8 Commercial Practices FEDERAL TRADE COMMISSION RULES, REGULATIONS, STATEMENT OF GENERAL POLICY OR INTERPRETATION AND... 500 § 501.8 Solder. Solder and brazing alloys containing precious metals when packaged and labeled...

  14. 16 CFR 501.8 - Solder.

    Code of Federal Regulations, 2012 CFR

    2012-01-01

    ... 16 Commercial Practices 1 2012-01-01 2012-01-01 false Solder. 501.8 Section 501.8 Commercial Practices FEDERAL TRADE COMMISSION RULES, REGULATIONS, STATEMENT OF GENERAL POLICY OR INTERPRETATION AND... 500 § 501.8 Solder. Solder and brazing alloys containing precious metals when packaged and labeled...

  15. 16 CFR 501.8 - Solder.

    Code of Federal Regulations, 2010 CFR

    2010-01-01

    ... 16 Commercial Practices 1 2010-01-01 2010-01-01 false Solder. 501.8 Section 501.8 Commercial Practices FEDERAL TRADE COMMISSION RULES, REGULATIONS, STATEMENT OF GENERAL POLICY OR INTERPRETATION AND... 500 § 501.8 Solder. Solder and brazing alloys containing precious metals when packaged and labeled...

  16. Heat Lamps Solder Solar Array Quickly

    NASA Technical Reports Server (NTRS)

    Coyle, P. J.; Crouthamel, M. S.

    1982-01-01

    Interconnection tabs in a nine-solar-cell array have been soldered simultaneously with radiant heat. Cells and tabs are held in position for soldering by sandwiching them between compliant silicone-rubber vacuum platen and transparent polyimide sealing membrane. Heat lamps warm cells, producing smooth, flat solder joints of high quality.

  17. 16 CFR 501.8 - Solder.

    Code of Federal Regulations, 2014 CFR

    2014-01-01

    ... 16 Commercial Practices 1 2014-01-01 2014-01-01 false Solder. 501.8 Section 501.8 Commercial Practices FEDERAL TRADE COMMISSION RULES, REGULATIONS, STATEMENT OF GENERAL POLICY OR INTERPRETATION AND... 500 § 501.8 Solder. Solder and brazing alloys containing precious metals when packaged and labeled...

  18. 21 CFR 189.240 - Lead solders.

    Code of Federal Regulations, 2013 CFR

    2013-04-01

    ... 21 Food and Drugs 3 2013-04-01 2013-04-01 false Lead solders. 189.240 Section 189.240 Food and... Addition to Human Food Through Food-Contact Surfaces § 189.240 Lead solders. (a) Lead solders are alloys of metals that include lead and are used in the construction of metal food cans. (b) Food packaged in...

  19. 21 CFR 189.240 - Lead solders.

    Code of Federal Regulations, 2011 CFR

    2011-04-01

    ... 21 Food and Drugs 3 2011-04-01 2011-04-01 false Lead solders. 189.240 Section 189.240 Food and... Addition to Human Food Through Food-Contact Surfaces § 189.240 Lead solders. (a) Lead solders are alloys of metals that include lead and are used in the construction of metal food cans. (b) Food packaged in...

  20. 21 CFR 189.240 - Lead solders.

    Code of Federal Regulations, 2010 CFR

    2010-04-01

    ... 21 Food and Drugs 3 2010-04-01 2009-04-01 true Lead solders. 189.240 Section 189.240 Food and... Addition to Human Food Through Food-Contact Surfaces § 189.240 Lead solders. (a) Lead solders are alloys of metals that include lead and are used in the construction of metal food cans. (b) Food packaged in...

  1. 21 CFR 189.240 - Lead solders.

    Code of Federal Regulations, 2014 CFR

    2014-04-01

    ... 21 Food and Drugs 3 2014-04-01 2014-04-01 false Lead solders. 189.240 Section 189.240 Food and...-Contact Surfaces § 189.240 Lead solders. (a) Lead solders are alloys of metals that include lead and are used in the construction of metal food cans. (b) Food packaged in any container that makes use of...

  2. 21 CFR 189.240 - Lead solders.

    Code of Federal Regulations, 2012 CFR

    2012-04-01

    ... 21 Food and Drugs 3 2012-04-01 2012-04-01 false Lead solders. 189.240 Section 189.240 Food and... Addition to Human Food Through Food-Contact Surfaces § 189.240 Lead solders. (a) Lead solders are alloys of metals that include lead and are used in the construction of metal food cans. (b) Food packaged in...

  3. Reliability of lead-free solders in electronic packaging technology

    NASA Astrophysics Data System (ADS)

    Choi, Woojin

    have performed synchrotron radiation micro-diffraction analysis of Sn whiskers grown on the finish of eutectic SnCu to measure the local stress level and the orientation of the grains around the whisker. Also, we examined the intermetallic compound which gives the compressive stress and the surface oxide on the solder finish by Focused Ion Beam (FIB) and Transmission Electron Microscopy (TEM).

  4. An Overview of Surface Finishes and Their Role in Printed Circuit Board Solderability and Solder Joint Performance

    SciTech Connect

    Vianco, P.T.

    1998-10-15

    A overview has been presented on the topic of alternative surface finishes for package I/Os and circuit board features. Aspects of processability and solder joint reliability were described for the following coatings: baseline hot-dipped, plated, and plated-and-fused 100Sn and Sn-Pb coatings; Ni/Au; Pd, Ni/Pd, and Ni/Pd/Au finishes; and the recently marketed immersion Ag coatings. The Ni/Au coatings appear to provide the all-around best option in terms of solderability protection and wire bondability. Nickel/Pal ftishes offer a slightly reduced level of performance in these areas that is most likely due to variable Pd surface conditions. It is necessmy to minimize dissolved Au or Pd contents in the solder material to prevent solder joint embrittlement. Ancillary aspects that included thickness measurement techniques; the importance of finish compatibility with conformal coatings and conductive adhesives; and the need for alternative finishes for the processing of non-Pb bearing solders were discussed.

  5. Solder Joint Health Monitoring Testbed

    NASA Technical Reports Server (NTRS)

    Delaney, Michael M.; Flynn, James G.; Browder, Mark E.

    2009-01-01

    A method of monitoring the health of selected solder joints, called SJ-BIST, has been developed by Ridgetop Group Inc. under a Small Business Innovative Research (SBIR) contract. The primary goal of this research program is to test and validate this method in a flight environment using realistically seeded faults in selected solder joints. An additional objective is to gather environmental data for future development of physics-based and data-driven prognostics algorithms. A test board is being designed using a Xilinx FPGA. These boards will be tested both in flight and on the ground using a shaker table and an altitude chamber.

  6. Solder Mounting Technologies for Electronic Packaging

    SciTech Connect

    VIANCO, PAUL T.

    1999-09-23

    Soldering provides a cost-effective means for attaching electronic packages to circuit boards using both small scale and large scale manufacturing processes. Soldering processes accommodate through-hole leaded components as well as surface mount packages, including the newer area array packages such as the Ball Grid Arrays (BGA), Chip Scale Packages (CSP), and Flip Chip Technology. The versatility of soldering is attributed to the variety of available solder alloy compositions, substrate material methodologies, and different manufacturing processes. For example, low melting temperature solders are used with temperature sensitive materials and components. On the other hand, higher melting temperature solders provide reliable interconnects for electronics used in high temperature service. Automated soldering techniques can support large-volume manufacturing processes, while providing high reliability electronic products at a reasonable cost.

  7. Effect of Electromigration on the Type of Drop Failure of Sn-3.0Ag-0.5Cu Solder Joints in PBGA Packages

    NASA Astrophysics Data System (ADS)

    Huang, M. L.; Zhao, N.

    2015-10-01

    Board-level drop tests of plastic ball grid array (PBGA) packages were performed in accordance with the Joint Electron Devices Engineering Council standard to investigate the effect of electromigration (EM) on the drop reliability of Sn-3.0Ag-0.5Cu solder joints with two substrate surface finishes, organic solderability preservative (OSP) and electroless nickel electroless palladium immersion gold (ENEPIG). In the as-soldered state, drop failures occurred at the substrate sides only, with cracks propagating within the interfacial intermetallic compound (IMC) layer for OSP solder joints and along the IMC/Ni-P interface for ENEPIG solder joints. The drop lifetime of OSP solder joints was approximately twice that of ENEPIG joints. EM had an important effect on crack formation and drop lifetime of the PBGA solder joints. ENEPIG solder joints performed better in drop reliability tests after EM, that is, the drop lifetime of ENEPIG joints decreased by 43% whereas that of OSP solder joints decreased by 91%, compared with the as-soldered cases. The more serious polarity effect, i.e., excessive growth of the interfacial IMC at the anode, was responsible for the sharper decrease in drop lifetime. The different types of drop failure of PBGA solder joints before and after EM, including the position of initiation and the propagation path of cracks, are discussed on the basis of the growth behavior of interfacial IMC.

  8. Simulation of thermomechanical fatigue in solder joints

    SciTech Connect

    Fang, H.E.; Porter, V.L.; Fye, R.M.; Holm, E.A.

    1997-12-31

    Thermomechanical fatigue (TMF) is a very complex phenomenon in electronic component systems and has been identified as one prominent degradation mechanism for surface mount solder joints in the stockpile. In order to precisely predict the TMF-related effects on the reliability of electronic components in weapons, a multi-level simulation methodology is being developed at Sandia National Laboratories. This methodology links simulation codes of continuum mechanics (JAS3D), microstructural mechanics (GLAD), and microstructural evolution (PARGRAIN) to treat the disparate length scales that exist between the macroscopic response of the component and the microstructural changes occurring in its constituent materials. JAS3D is used to predict strain/temperature distributions in the component due to environmental variable fluctuations. GLAD identifies damage initiation and accumulation in detail based on the spatial information provided by JAS3D. PARGRAIN simulates the changes of material microstructure, such as the heterogeneous coarsening in Sn-Pb solder, when the component`s service environment varies.

  9. Characterization of solder flow on PWB surfaces

    SciTech Connect

    Hosking, F.M.; Yost, F.G.

    1995-07-01

    Different solderability tests have been developed to determine the wetting behavior of solder on metallic surfaces. None offer an exact measure of capillary flow associated with conventional mixed technology soldering. With shrinking package designs, increasing reliability requirements, and the emergence of new soldering technologies, there is a growing need to better understand and predict the flow of solder on printed wiring board (PWB) surfaces. Sandia National Laboratories has developed a capillary flow solderability test, through a joint effort with the National Center for Manufacturing Sciences, that considers this fundamental wetting issue for surface mount technology. The test geometry consists of a metal strip (width, {delta}) connected to a circular metal pad (radius, r{sub c}). Test methodology, experimental results, and validation of a flow model are presented in this paper.

  10. Impact of Cooling Rate-Induced Recrystallization on High G Mechanical Shock and Thermal Cycling in Sn-Ag-Cu Solder Interconnects

    NASA Astrophysics Data System (ADS)

    Lee, Tae-Kyu; Bieler, Thomas R.; Kim, Choong-Un

    2016-01-01

    The mechanical stability and thermo-mechanical fatigue performance of solder joints with low silver content Sn-1.0Ag-0.5Cu (wt.%) (SAC105) alloy based on different cooling rates are investigated in high G level shock environment and thermal cycling conditions. The cooling rate-controlled samples ranging from 1°C/min to 75°C/min cooling rate, not only show differences in microstructure, where a fine poly-granular microstructure develops in the case of fast cooling versus normal cooling, but also show various shock performances based on the microstructure changes. The fast cooling rate improves the high G shock performance by over 90% compared to the normal cooled SAC105 alloy air-cooling environment commonly used after assembly reflow. The microstructure effect on thermal cycling performance is also discussed, which is analyzed based on the Sn grain orientation, interconnect stability, and solder joint bulk microstructure.

  11. Tin soldering of aluminum and its alloys

    NASA Technical Reports Server (NTRS)

    Gallo, Gino

    1921-01-01

    A method is presented for soldering aluminum to other metals. The method adopted consists of a galvanic application to the surface of the light-metal parts to be soldered, of a layer of another metal, which, without reacting electrolytically on the aluminum, adheres strongly to the surface to which it is applied, and is, on the other hand, adapted to receive the soft solder. The metal found to meet the criteria best was iron.

  12. Intermetallic Layers in Soldered Joints

    1998-12-10

    ILAG solves the one-dimensional partial differential equations describing the multiphase, multicomponent, solid-state diffusion-controlled growth of intermetallic layers in soldered joints. This software provides an analysis capability for materials researchers to examine intermetallic growth mechanisms in a wide variety of defense and commercial applications involving both traditional and advanced materials. ILAG calculates the interface positions of the layers, as well as the spatial distribution of constituent mass fractions, and outputs the results at user-prescribed simulation times.

  13. [Field investigations of the air pollution level of populated territories].

    PubMed

    Vinokurov, M V

    2014-01-01

    The assessment and management of air quality of settlements is one of the priorities in the field of environmental protection. In the management of air quality the backbone factor is the methodology of the organization, performance and interpretation of data of field investigations. The present article is devoted to the analysis of the existing methodological approaches and practical aspects of their application in the organization and performance of field investigations with the aim to confirm the adequacy of the boundaries of the sanitary protection zone in the old industrial regions, hygienic evaluation of the data of field investigations of the air pollution level.

  14. Nano-soldering to single atomic layer

    DOEpatents

    Girit, Caglar O.; Zettl, Alexander K.

    2011-10-11

    A simple technique to solder submicron sized, ohmic contacts to nanostructures has been disclosed. The technique has several advantages over standard electron beam lithography methods, which are complex, costly, and can contaminate samples. To demonstrate the soldering technique graphene, a single atomic layer of carbon, has been contacted, and low- and high-field electronic transport properties have been measured.

  15. Experiments and Demonstrations with Soldering Guns.

    ERIC Educational Resources Information Center

    Henry, Dennis C.; Danielson, Sarah A.

    1993-01-01

    Discusses the essential electrical characteristics of a particular model of soldering gun. Presents four classroom demonstrations that utilize the soldering gun to test the following geometrics of wire loops as electromagnets: (1) the original tip; (2) a single circular loop; (3) a Helmholtz coil; and (4) the solenoid. (MDH)

  16. Solderability enhancement of copper through chemical etching

    SciTech Connect

    Stevenson, J.O.; Guilinger, T.R.; Hosking, F.M.; Yost, F.G.; Sorensen, N.R.

    1995-05-01

    Sandia National Laboratories has established a Cooperative Research and Development Agreement with consortium members of the National Center for Manufacturing Sciences (NCMS) to develop fundamental generic technology in the area of printed wiring board materials and surface finishes. Improved solderability of copper substrates is an important component of the Sandia-NCMS program. The authors are investigating the effects of surface roughness on the wettability and solderability behavior of several different types of copper board finishes. In this paper, the authors present roughness and solderability characterizations for a variety of chemically-etched copper substrates. Initial testing on six chemical etches demonstrate that surface roughness can be greatly enhanced through chemical etching. Noticeable improvements in solder wettability were observed to accompany increases in roughness. A number of different algorithms and measures of roughness were used to gain insight into surface morphologies that lead to improved solderability.

  17. Higher fuel prices are associated with lower air pollution levels.

    PubMed

    Barnett, Adrian G; Knibbs, Luke D

    2014-05-01

    Air pollution is a persistent problem in urban areas, and traffic emissions are a major cause of poor air quality. Policies to curb pollution levels often involve raising the price of using private vehicles, for example, congestion charges. We were interested in whether higher fuel prices were associated with decreased air pollution levels. We examined an association between diesel and petrol prices and four traffic-related pollutants in Brisbane from 2010 to 2013. We used a regression model and examined pollution levels up to 16 days after the price change. Higher diesel prices were associated with statistically significant short-term reductions in carbon monoxide and nitrogen oxides. Changes in petrol prices had no impact on air pollution. Raising diesel taxes in Australia could be justified as a public health measure. As raising taxes is politically unpopular, an alternative political approach would be to remove schemes that put a downward pressure on fuel prices, such as industry subsidies and shopping vouchers that give fuel discounts.

  18. Wetting studies of lead-free solders on lead-free PWB finishes

    NASA Astrophysics Data System (ADS)

    Sattiraju, Seshagirirao Venkata

    There is a universal focus for producing environmentally friendly products in many different areas of science and engineering. Pb in electronic solder has become the target recently. The shift towards Pb-free manufacturing is a complicated issue. For a successful transition to Pb-free manufacturing in electronics assembly, it is critical to understand the behavior of Pb-free solders (in bulk and paste form) and their interaction with the Pb-free printed wiring board (PWB) finishes before their implementation in high volume electronics manufacturing can be realized. In this research work, studies were performed to characterize the wetting process of some Pb-free solders and Pb-free PWB finishes. Results obtained from solder paste spread tests and wetting balance experiments with several Pb-free solder alloys and Pb-free PWB finishes are presented and conclusions are drawn on the solderability of the alloys and finishes. The solder alloys studied were Sn3.4Ag4.8Bi, Sn4.0Ag0.5 Cu, Sn3.5Ag and Sn0.7Cu. Eutectic Sn37Pb was used as a reference. The PWB surface finishes were immersion Sn, electroless Ni/immersion Au, immersion Ag and organic solderability preservative (OSP). Effects of multiple reflow cycles on solderability of the test coupons were also studied. Statistical analyses were performed on the data obtained from the wetting balance and spread tests. Wetting balance experiments were conducted in air while the spread tests were performed in air and nitrogen to understand the effect of reflow atmosphere on the spreading. Surface analyses techniques such as Auger Electron Spectroscopy (AES) and X-ray Photoelectron Spectroscopy (XPS) were applied to understand and analyze the surfaces. Conclusions were drawn based on the data obtained from the wetting balance and spread experiments and results from the surface and thermodynamic analyses were applied to augment the experimental results. Sequential Electrochemical Reduction Analysis (SERA) was also performed on the

  19. Mechanical properties of Pb-free solder alloys on thick film hybrid microcircuits

    SciTech Connect

    Hernandez, C.L.; Vianco, P.T.; Rejent, J.A.; Hosking, F.M.

    1998-03-10

    The technology drivers of the electronics industry continue to be systems miniaturization and reliability, in addition to addressing a variety of important environmental issues. Although the Sn-Pb eutectic alloy is widely used as a joining material in the electronics industry, it has drawn environmental concern due to its Pb content. The solder acts both as an electrical and mechanical connection within the different packaging levels in an electronic device. New Pb-free solders are being developed at Sandia National Laboratories. The alloys are based on the Sn-Ag alloy, having Bi and Au additions. Prototype hybrid microcircuit (HMC) test vehicles have been assembled to evaluate Pb-free solders for Au-Pt-Pd thick film soldering. The test components consist of a variety of dummy chip capacitors and leadless ceramic chip carriers (LCCC`s). The mechanical properties of the joints were evaluated. The reflow profiles and the solid state intermetallic formation reaction will also be presented. Improved solder joint manufacturability and increased fatigue resistance solder alloys are the goals of these materials.

  20. BOREAS AFM-5 Level-1 Upper Air Network Data

    NASA Technical Reports Server (NTRS)

    Barr, Alan; Hrynkiw, Charmaine; Newcomer, Jeffrey A. (Editor); Hall, Forrest G. (Editor); Smith, David E. (Technical Monitor)

    2000-01-01

    The Boreal Ecosystem-Atmosphere Study (BOREAS) Airborne Fluxes and Meteorology (AFM)-5 team collected and processed data from the numerous radiosonde flights during the project. The goals of the AFM-05 team were to provide large-scale definition of the atmosphere by supplementing the existing Atmospheric Environment Service (AES) aerological network, both temporally and spatially. This data set includes basic upper-air parameters collected from the network of upper-air stations during the 1993, 1994, and 1996 field campaigns over the entire study region. The data are contained in tabular ASCII files. The level-1 upper-air network data are available from the Earth Observing System Data and Information System (EOSDIS) Oak Ridge National Laboratory (ORNL) Distributed Active Archive Center (DAAC). The data files also are available on a CD-ROM (see document number 20010000884).

  1. Gestational Diabetes and Preeclampsia in Association with Air Pollution at Levels below Current Air Quality Guidelines

    PubMed Central

    Jakobsson, Kristina; Tinnerberg, Håkan; Rignell-Hydbom, Anna; Rylander, Lars

    2013-01-01

    Background: Several studies have estimated associations between air pollution and birth outcomes, but few have evaluated potential effects on pregnancy complications. Objective: We investigated whether low-level exposure to air pollution is associated with gestational diabetes and preeclampsia. Methods: High-quality registry information on 81,110 singleton pregnancy outcomes in southern Sweden during 1999–2005 was linked to individual-level exposure estimates with high spatial resolution. Modeled exposure to nitrogen oxides (NOx), expressed as mean concentrations per trimester, and proximity to roads of different traffic densities were used as proxy indicators of exposure to combustion-related air pollution. The data were analyzed by logistic regression, with and without adjusting for potential confounders. Results: The prevalence of gestational diabetes increased with each NOx quartile, with an adjusted odds ratio (OR) of 1.69 (95% CI: 1.41, 2.03) for the highest (> 22.7 µg/m3) compared with the lowest quartile (2.5–8.9 µg/m3) of exposure during the second trimester. The adjusted OR for acquiring preeclampsia after exposure during the third trimester was 1.51 (1.32, 1.73) in the highest quartile of NOx compared with the lowest. Both outcomes were associated with high traffic density, but ORs were significant for gestational diabetes only. Conclusion: NOx exposure during pregnancy was associated with gestational diabetes and preeclampsia in an area with air pollution levels below current air quality guidelines. PMID:23563048

  2. Solder flow on narrow copper strips

    SciTech Connect

    Hosking, F.M.; Yost, F.G.; Holm, E.A.; Michael, J.R.

    1996-07-01

    Various solderability tests have been developed over the years to quantify the wetting behavior of solder on metallic surfaces. None offer an exact measure of capillary flow normally associated with conventional plated-through-hole and surface mount soldering. With shrinking package designs, increasing reliability requirements, and the emergence of new soldering technologies, there is a growing need to better understand and predict the flow of solder on printed wiring board (PWB) surfaces. Sandia National Laboratories has developed a capillary flow solderability test, through a joint effort with the National Center for Manufacturing Sciences, that considers this fundamental wetting issue for surface mount technology. The test geometry consists of a metal strip (width, {delta}) connected to a circular metal pad (radius, r{sub c}). Solder flow from the pad onto the strip depends on the geometric relationship between {delta} and r{sub c}. Test methodology, experimental results, and validation of a flow model are presented in this paper. 17 refs., 11 figs., 4 tabs.

  3. Laser Assisted Soldering: Effects of Hydration on Solder-Tissue Adhesion

    SciTech Connect

    Chan, E.K.; Welch, A.J.; Brown, D.T.; Kovach, I.S.

    1998-10-01

    Wound stabilization is critical in early wound healing. Other than superficial skin wounds, most tissue repair is exposed to a hydrated environment postoperatively. To simulate the stability of laser-soldered tissue in a wet environment, we studied the effects of hydration on laser soldered rat dermis and baboon articular cartilage. In this {ital in vitro} study, we used a solder composed of human serum albumin, sodium hyaluronate, and Indocyanine Green. A 2 {mu}L solder droplet was deposited on each tissue specimen and then the solder was irradiated with a scanning laser beam (808 nm and 27thinspW/cm{sup 2}). After photocoagulation, each tissue specimen was cut into two halves dividing the solder. One half was reserved as control while the other half was soaked in saline for a designated period before fixation (1 h, 1, 2, and 7 days). All tissue specimens were prepared for scanning electron microscopy (SEM). SEM examinations revealed nonuniform coagulation across the solder thickness for most of the specimens, likely a result of the temperature gradient generated by laser heating. Closer to the laser beam, the uppermost region of the solder formed a dense coagulum. The solder aggregated into small globules in the region anterior to the solder-tissue interface. All cartilage specimens soaked in saline suffered coagulum detachment from tissue surface. We noted a high concentration of the protein globules in the detached coagulum. These globules were likely responsible for solder detachment from the cartilage surface. Solder adhered better to the dermis than to cartilage. The dermal layer of the skin, composed of collagen matrix, provided a better entrapment of the solder than the smooth surface of articular cartilage. Insufficient laser heating of solder formed protein globules. Unstable solder-tissue fusion was likely a result of these globules being detached from tissue substrate when the specimen was submerged in a hydrated environment. The solder-tissue bonding

  4. A comparison of X-ray fluorescence and wet chemical analysis for lead on air filters from different personal samplers used in a secondary lead smelter/solder manufacturer.

    PubMed

    Harper, Martin; Pacolay, Bruce

    2006-01-01

    Portable X-ray fluorescence (XRF) technology may provide faster turn-around without compromising accuracy when assessing personal exposures to metals such as lead, but it has only been tested in limited field environments. This study is part of a series, where various types of sampler are used to collect airborne lead in different environments for presentation to a portable XRF analyzer. In this case personal samples were taken at a manufacturer of solder alloys consisting mainly of lead and tin, using the closed-face 37 mm cassette (CFC), the 37 mm GSP or "cone" sampler, the 25 mm Institute of Occupational Medicine (IOM) inhalable sampler, the 25 mm button sampler, and the open-face 25 mm cassette. Mixed cellulose-ester filters were used in all samplers. Following XRF analysis the samples were extracted with acid and analyzed by inductively coupled plasma optical emission spectroscopy (ICP). The internal surfaces of CFC's and 25 mm open-face cassettes were also wiped, and the wipes analyzed for lead to assess wall-losses in these two samplers. Analysis of all elements present is useful to ascertain contributions to matrix interference effects. In addition to lead, other metals such as tin, copper, iron, silver, cadmium and antimony were also detected in some or all of the samples by ICP analysis, but only copper and iron could be determined using the XRF analyzer under test. After the removal of a few outliers, all five samplers gave good correlations (r(2) > 0.9) between the two analytical methods over the entire range of found lead mass, which encompassed both the action level and the permissible exposure limit enforced in the USA by the Occupational Safety and Health Administration (OSHA). Linear regression on the results from most samplers gave almost 1 ratio 1 correlations without additional correction, indicating an absence of matrix effects, particularly from tin, which was the most common element after lead. The average of three XRF readings across filters

  5. Level-1C Product from AIRS: Principal Component Filtering

    NASA Technical Reports Server (NTRS)

    Manning, Evan M.; Jiang, Yibo; Aumann, Hartmut H.; Elliott, Denis A.; Hannon, Scott

    2012-01-01

    The Atmospheric Infrared Sounder (AIRS), launched on the EOS Aqua spacecraft on May 4, 2002, is a grating spectrometer with 2378 channels in the range 3.7 to 15.4 microns. In a grating spectrometer each individual radiance measurement is largely independent of all others. Most measurements are extremely accurate and have very low noise levels. However, some channels exhibit high noise levels or other anomalous behavior, complicating applications needing radiances throughout a band, such as cross-calibration with other instruments and regression retrieval algorithms. The AIRS Level-1C product is similar to Level-1B but with instrument artifacts removed. This paper focuses on the "cleaning" portion of Level-1C, which identifies bad radiance values within spectra and produces substitute radiances using redundant information from other channels. The substitution is done in two passes, first with a simple combination of values from neighboring channels, then with principal components. After results of the substitution are shown, differences between principal component reconstructed values and observed radiances are used to investigate detailed noise characteristics and spatial misalignment in other channels.

  6. Alining Solder Pads on a Solar Cell

    NASA Technical Reports Server (NTRS)

    Lazzery, A. G.

    1984-01-01

    Mechanism consisting of stylus and hand-operated lever incorporated into screening machine to precisely register front and back solder pads during solar-cell assembly. Technique may interest those assembling solar cells manually for research or prototype work.

  7. High temperature solder device for flat cables

    NASA Technical Reports Server (NTRS)

    Haehner, Carl L. (Inventor)

    1992-01-01

    A high temperature solder device for flat cables includes a microwelder, an anvil which acts as a heat sink and supports a flexible flat ribbon cable that is to be connected to a multiple pin connector. The microwelder is made from a modified commercially available resistance welding machine such as the Split Tip Electrode microwelder by Weltek, which consists of two separate electrode halves with a removable dielectric spacer in between. The microwelder is not used to weld the items together, but to provide a controlled compressive force on, and energy pulse to, a solder preform placed between a pin of the connector and a conductor of the flexible flat ribbon cable. When the microwelder is operated, an electric pulse will flow down one electrode, through the solder preform and back up the other electrode. This pulse of electrical energy will cause the solder preform to heat up and melt, joining the pin and conductor.

  8. Induction soldering of photovoltaic system components

    SciTech Connect

    Kumaria, Shashwat; de Leon, Briccio

    2015-11-17

    A method comprises positioning a pair of photovoltaic wafers in a side-by-side arrangement. An interconnect is placed on the pair of wafers such that the interconnect overlaps both wafers of the pair, solder material being provided between the interconnect and the respective wafers. A solder head is then located adjacent the interconnect, and the coil is energized to effect inductive heating of the solder material. The solder head comprises an induction coil shaped to define an eye, and a magnetic field concentrator located at least partially in the eye of the coil. The magnetic field concentrator defines a passage extending axially through the eye of the coil, and may be of a material with a high magnetic permeability.

  9. Determinants of elite-level air rifle shooting performance.

    PubMed

    Ihalainen, S; Kuitunen, S; Mononen, K; Linnamo, V

    2016-03-01

    This study focused on identifying the most important factors determining performance in elite-level air rifle shooting technique. Forty international- and national-level shooters completed a simulated air rifle shooting competition series. From a total of 13 795 shots in 319 tests, shooting score and 17 aiming point trajectory variables were measured with an optoelectronic device and six postural balance variables were measured with force platform. Principal component analysis revealed six components in the air rifle shooting technique: aiming time, stability of hold, measurement time, cleanness of triggering, aiming accuracy, and timing of triggering. Multiple regression analysis identified four of those, namely stability of hold, cleanness of triggering, aiming accuracy, and timing of triggering as the most important predictors of shooting performance, accounting for 81% of the variance in shooting score. The direct effect of postural balance on performance was small, accounting for less than 1% of the variance in shooting score. Indirectly, the effect can be greater through a more stable holding ability, to which postural balance was correlated significantly (R = 0.55, P < 0.001). The results of the present study can be used in assessing athletes' technical strengths and weaknesses and in directing training programs on distinct shooting technical components.

  10. Shrink-Fit Solderable Inserts Seal Hermetically

    NASA Technical Reports Server (NTRS)

    Croucher, William C.

    1992-01-01

    Shrink-fit stainless-steel insert in aluminum equipment housing allows electrical connectors to be replaced by soldering, without degrading hermeticity of housing or connector. Welding could destroy electrostatic-sensitive components and harm housing and internal cables. Steel insert avoids problems because connector soldered directly to it rather than welded to housing. Seals between flange and housing, and between connector and flange resistant to leaks, even after mechanical overloading and thermal shocking.

  11. Modelled air pollution levels versus EC air quality legislation - results from high resolution simulation.

    PubMed

    Chervenkov, Hristo

    2013-12-01

    An appropriate method for evaluating the air quality of a certain area is to contrast the actual air pollution levels to the critical ones, prescribed in the legislative standards. The application of numerical simulation models for assessing the real air quality status is allowed by the legislation of the European Community (EC). This approach is preferable, especially when the area of interest is relatively big and/or the network of measurement stations is sparse, and the available observational data are scarce, respectively. Such method is very efficient for similar assessment studies due to continuous spatio-temporal coverage of the obtained results. In the study the values of the concentration of the harmful substances sulphur dioxide, (SO2), nitrogen dioxide (NO2), particulate matter - coarse (PM10) and fine (PM2.5) fraction, ozone (O3), carbon monoxide (CO) and ammonia (NH3) in the surface layer obtained from modelling simulations with resolution 10 km on hourly bases are taken to calculate the necessary statistical quantities which are used for comparison with the corresponding critical levels, prescribed in the EC directives. For part of them (PM2.5, CO and NH3) this is done for first time with such resolution. The computational grid covers Bulgaria entirely and some surrounding territories and the calculations are made for every year in the period 1991-2000. The averaged over the whole time slice results can be treated as representative for the air quality situation of the last decade of the former century.

  12. Degradation of phosphorene in air: understanding at atomic level

    NASA Astrophysics Data System (ADS)

    Wang, Gaoxue; Slough, William J.; Pandey, Ravindra; Karna, Shashi P.

    2016-06-01

    Phosphorene is a promising two-dimensional (2D) material with a direct band gap, high carrier mobility, and anisotropic electronic properties. Phosphorene-based electronic devices, however, are found to degrade upon exposure to air. In this paper, we provide an atomic level understanding of the stability of phosphorene in terms of its interaction with O2 and H2O. The results based on density functional theory together with first principles molecular dynamics calculations show that O2 could the spontaneously dissociate on phosphorene at room temperature. H2O will not strongly interact with pristine phosphorene, however, an exothermic reaction could occur if phosphorene is first oxidized. The pathway of oxidation first, followed by exothermic reaction with water is the most likely route for the chemical degradation of phosphorene-based devices in air.

  13. PWB solder wettability after simulated storage

    SciTech Connect

    Hernandez, C.L.; Hosking, F.M.

    1996-03-01

    A new solderability test method has been developed at Sandia National Laboratories that simulates the capillary flow physics of solders on circuit board surfaces. The solderability test geometry was incorporated on a circuit board prototype that was developed for a National Center for Manufacturing Sciences (NCMS) program. The work was conducted under a cooperative research and development agreement between Sandia National Laboratories, NCMS, and several PWB fabricators (AT&T, IBM, Texas Instruments, United Technologies/Hamilton Standard and Hughes Aircraft) to advance PWB interconnect technology. The test was used to investigate the effects of environmental prestressing on the solderability of printed wiring board (PWB) copper finishes. Aging was performed in a controlled chamber representing a typical indoor industrial environment. Solderability testing on as-fabricated and exposed copper samples was performed with the Sn-Pb eutectic solder at four different reflow temperatures (215, 230, 245 and 260{degrees}C). Rosin mildly activated (RMA), low solids (LS), and citric acid-based (CA) fluxes were included in the evaluation. Under baseline conditions, capillary flow was minimal at the lowest temperatures with all fluxes. Wetting increased with temperature at both baseline and prestressing conditions. Poor wetting, however, was observed at all temperatures with the LS flux. Capillary flow is effectively restored with the CA flux.

  14. Fluxless soldering using activated acid vapors

    SciTech Connect

    Frear, D.R.; Keicher, D.M.

    1992-01-01

    Acid vapors have been used to fluxlessly reduce metal oxides and enhance wetting of solder on metallizations. Dilute solutions of hydrogen, acetic acid and formic acid in an inert carrier gas of nitrogen or argon were used with the sessile drop technique for 60Sn-40 Pb solder on Cu and Au/Ni metallizations. The time to reduce metal oxides and the extent of wetting as a function of acid vapor concentrations were characterized. Acetic and formic acids reduce the surface metal oxides sufficiently to form metallurgically sound solder joints. Hydrogen did not reduce oxides rapidly enough at 220{degree}C to be suitable for soldering applications. The optimum conditions for oxide reduction with formic acid was with an acid vapor concentration in nitrogen carrier gas of 4% for Cu metallizations and 1.6% on Au/Ni. The acetic acid vapor concentration, also in nitrogen, was optimized at 1.5% for both metallizations. Above a vapor concentration of 1.5%, the acetic acid combined with the bare metal to form acetates which increased the wetting time. These results indicate that acid vapor fluxless soldering is a viable alternative to traditional flux soldering.

  15. Integrated environmentally compatible soldering technologies. Final report

    SciTech Connect

    Hosking, F.M.; Frear, D.R.; Iman, R.L.; Keicher, D.M.; Lopez, E.P.; Peebles, H.C.; Sorensen, N.R.; Vianco, P.T.

    1994-05-01

    Chemical fluxes are typically used during conventional electronic soldering to enhance solder wettability. Most fluxes contain very reactive, hazardous constituents that require special storage and handling. Corrosive flux residues that remain on soldered parts can severely degrade product reliability. The residues are removed with chlorofluorocarbon (CFC), hydrochlorofluorocarbon (HCFC), or other hazardous solvents that contribute to ozone depletion, release volatile organic compounds into the atmosphere, or add to the solvent waste stream. Alternative materials and processes that offer the potential for the reduction or elimination of cleaning are being developed to address these environmental issues. Timing of the effort is critical, since the targeted chemicals will soon be heavily taxed or banned. DOE`s Office of Environmental Restoration and Waste Management (DOE/EM) has supported Sandia National Laboratories` Environmentally Conscious Manufacturing Integrated Demonstration (ECMID). Part of the ECM program involves the integration of several environmentally compatible soldering technologies for assembling electronics devices. Fluxless or {open_quotes}low-residue/no clean{close_quotes} soldering technologies (conventional and ablative laser processing, controlled atmospheres, ultrasonic tinning, protective coatings, and environmentally compatible fluxes) have been demonstrated at Sandia (SNL/NM), the University of California at Berkeley, and Allied Signal Aerospace-Kansas City Division (AS-KCD). The university demonstrations were directed under the guidance of Sandia staff. Results of the FY93 Soldering ID are presented in this report.

  16. Whisker Formation on SAC305 Soldered Assemblies

    NASA Astrophysics Data System (ADS)

    Meschter, S.; Snugovsky, P.; Bagheri, Z.; Kosiba, E.; Romansky, M.; Kennedy, J.; Snugovsky, L.; Perovic, D.

    2014-11-01

    This article describes the results of a whisker formation study on SAC305 assemblies, evaluating the effects of lead-frame materials and cleanliness in different environments: low-stress simulated power cycling (50-85°C thermal cycling), thermal shock (-55°C to 85°C), and high temperature/high humidity (85°C/85% RH). Cleaned and contaminated small outline transistors, large leaded quad flat packs (QFP), plastic leaded chip carrier packages, and solder balls with and without rare earth elements (REE) were soldered to custom designed test boards with Sn3Ag0.5Cu (SAC305) solder. After assembly, all the boards were cleaned, and half of them were recontaminated (1.56 µg/cm2 Cl-). Whisker length, diameter, and density were measured. Detailed metallurgical analysis on components before assembly and on solder joints before and after testing was performed. It was found that whiskers grow from solder joint fillets, where the thickness is less than 25 µm, unless REE was present. The influence of lead-frame and solder ball material, microstructure, cleanliness, and environment on whisker characteristics is discussed. This article provides detailed metallurgical observations and select whisker length data obtained during this multiyear testing program.

  17. Microstructural influences on the mechanical properties of solder

    SciTech Connect

    Morris, J.W. Jr.; Goldstein, J.L.F.; Mei, Z.

    1993-04-01

    Intent of this book is to review analytic methods for predicting behavior of solder joints, based on continuum mechanics. The solder is treated as a continuous, homogeneous body, or composite of such bodies, whose mechanical behavior is uniform and governed by simple constitutive equations. The microstructure of a solder joint influences its mechanical properties in 3 ways: it governs deformation and failure; common solders deform inhomogeneously; and common solders are microstructurally unstable. The variety of microstructures often found in solder joints are briefly reviewed, and some of the ways are discussed in which the microstructure influences the common types of high-temperature mechanical behavior. 25 figs, 40 refs.

  18. Air quality in Moscow megacity: basic level and extreme cases

    NASA Astrophysics Data System (ADS)

    Pankratova, N.; Skorokhod, A.; Moiseenko, K.

    2012-04-01

    Moscow is one of the largest megacities in the world. Total annual emissions of polluting substances into the atmosphere in Moscow is likely to be about 2,0 mln. t. More than 90% of pollutants are emitted by traffic. Problem of air quality assessment is very urgent for Moscow both to alarm population and to compare with other world megacities. To study contemporary structure of atmospheric pollution over Moscow megacity data on air composition (including CO, NO, NO2, O3, CH4, CO2, SO2, NMHC, aerosol) obtained since 2002 has been analyzed. The monitoring site is located at Moscow State University meteorological observatory on South-West of Moscow. All observations are provided by A.M. Obukhov Institute of Atmospheric Physics RAS. Due to these continuous measurements typical (basic) level of pollution as well as extreme cases have been studied. The relationship between O3, NOx and VOCs were analyzed as well. Due to weather conditions (cyclonic regime is dominated) concentrations of pollutants usually do not reach dangerous levels but sometimes they are high. The case of abnormal hot and dry weather in the summer of 2010 was investigated. Many Russians were suffering from the record-breaking heat and the worst drought in 40 years. The heat was caused by very intensive and stable blocking anticyclone that established in Moscow since June, 18 till August, 18. Anticyclone of such strength has been never observed before. During 33 days in succession surface air temperature exceeded 30°C. During these 2 months troposphere over ETR was almost closed for western winds. Hot weather led to numerous forest and peat fires (about 29,000 cases) with total covered area about 12,000 km2. One of aftermaths was significant change of atmospheric composition. Many cities and settlements were covered by dense haze from fires. Evident presence of high amount of aerosol in the ambient air caused anxiety and application of safeguards. Meanwhile, less obvious increase of concentrations of

  19. Survey of New Jersey schools and day care centers for lead in plumbing solder. Identification of lead solder and prevention of exposure to drinking water contaminated with lead from plumbing solder.

    PubMed

    Berkowitz, M

    1995-10-01

    Levels of lead in drinking water can be high enough to pose a potential health threat to very young children, primarily from the use of lead solder for indoor plumbing. In February 1987, New Jersey banned lead solder for use in the installation or repair of drinking water plumbing systems. However, because lead solder continued to be available for purchase in the state, New Jersey Department of Health staff sought to (i) determine the extent to which schools and day care centers were in compliance with the ban, and (ii) determine the effectiveness of a solder analysis test kit commonly used by plumbing inspectors in the field. Samples of solder were collected from 53 day care centers and 37 schools known to have been constructed or renovated after the ban took effect. Samples from 24% of those facilities constructed or renovated just after the lead ban (1987-1988) tested positive for lead content. However, for those facilities constructed or renovated in later years (1989-1992), there was a decline in the percentage of samples that tested positive for lead content. For this period of time, 13% of the samples tested positive for lead. In total, more than 10% of facilities with new plumbing installed between 1987 and 1992 had solder samples that tested positive for lead. A lead in solder test kit commonly used by inspectors proved to be an effective screening tool for the field. The New Jersey Department of Health recommends continued enforcement of the lead solder ban through inspection and encouragement of behaviors that minimize consumption of potentially lead-contaminated drinking water. In order to assess patterns of water use, staff at the day care centers were asked to complete a questionnaire. Sixty-seven percent of the respondents reported that they "always" use water from the cold tap when preparing drinks or food for the children. In addition, 57% reported that they always first flush the tap before using the water for drinking or food purposes. Posters

  20. Prototyping lead-free solders on hand-soldered, through-hole circuit boards

    SciTech Connect

    Vianco, P.T.; Mizik, P.M.

    1993-12-31

    The lead-free solders 96.5Sn-3.5Ag (wt %), 95.5Sn-4.0Cu-0.5Ag, 91. 84Sn-3.33Ag-4.83Bi were used in the assembly of a through-hole circuit board to determine the feasibility of their suitability in hand soldering processes. Prototypes assembled with 63Sn-37Pb solder were manufactured to serve as control units. Implementation of the lead-free alloys were performed with a rosin-based, mildly activated (RMA) flux and a 700{degree}F soldering tip. A procedure was developed to remove the tin-lead finish from the leaded components and replace it with a 100Sn hot dipped coating. Assembly feasibility was demonstrated for all three lead-free solders. Defect counts were greater than observed with the tin-lead control alloy; however, the number of defects diminished with experience gained by the operator. Visual examination of the solder joints indicated satisfactory wetting of both the device leads and circuit board land with no apparent damage to the underlying laminate nor to the device packages. Cross sections of the lead-free solder joints showed that the were more susceptible to void formation within the holes than was the case with the tin-lead solder. Some cracking was observed at the interface between the Sn-Ag-Bi solder and the copper lands; the relatively high strength of this solder and fast cooling rate of the hand assembly process was believed responsible for this defect.

  1. Asthma and low level air pollution in Helsinki

    SciTech Connect

    Poenkae A5 )

    1991-09-01

    The effects of relatively low levels of air pollution and weather conditions on the number of patients who had asthma attacks and who were admitted to a hospital were studied in Helsinki during a 3-y period. The number of admissions increased during cold weather (n = 4,209), especially among persons who were of working age but not among children. Even after standardization for temperature, all admissions, including emergency ward admissions, were significantly correlated with ambient air concentrations of nitrogen dioxide (NO2), nitric oxide (NO), sulfur dioxide (SO2), carbon monoxide (CO), ozone (O3), and total suspended particulates (TSP). Regression analysis revealed that NO and O3 were most strongly associated with asthma problems. Effects of air pollutants and cold were maximal if they occurred on the same day, except for O3, which had a more pronounced effect after a 1-d lag. The associations between pollutants, low temperature, and admissions were most significant among adults of working age, followed by the elderly. Among children, only O3 and NO were significantly correlated with admissions. Levels of pollutants were fairly low, the long-term mean being 19.2 micrograms/m3 for SO2, 38.6 micrograms/m3 for NO2, 22.0 micrograms/m3 or O3, and 1.3 mg/m3 for CO. In contrast, the mean concentration of TSP was high (76.3 micrograms/m3), and the mean temperature was low (+ 4.7 degrees C). These results suggest that concentrations of pollutants lower than those given as guidelines in many countries may increase the incidence of asthma attacks.

  2. Tropospheric gas at potentially toxic levels in air

    NASA Astrophysics Data System (ADS)

    Bhattacharya, Atreyee

    2012-08-01

    Forest fires and emission of air pollutants, such as fumes from vehicles running on diesel and slow burning of coal and charcoal, release isocyanic acid in the troposphere. In 2011, scientists first detected isocyanic acid in the ambient atmosphere at levels toxic to human populations; at concentrations exceeding 1 part per billion by volume (ppbv), human beings could experience tissue decay when exposed to the toxin. For the first time, using a chemical transport model designed to estimate the distribution and budget of isocyanic acid in the troposphere, Young et al. showed that in several parts of the world, local emissions may increase the concentration of isocyanic acid in the ambient atmosphere, thereby exposing large populations to potentially toxic levels of the acid.

  3. Computer simulation of solder joint failure

    SciTech Connect

    Burchett, S.N.; Frear, D.R.; Rashid, M.M.

    1997-04-01

    The thermomechanical fatigue failure of solder joints is increasingly becoming an important reliability issue for electronic packages. The purpose of this Laboratory Directed Research and Development (LDRD) project was to develop computational tools for simulating the behavior of solder joints under strain and temperature cycling, taking into account the microstructural heterogeneities that exist in as-solidified near eutectic Sn-Pb joints, as well as subsequent microstructural evolution. The authors present two computational constitutive models, a two-phase model and a single-phase model, that were developed to predict the behavior of near eutectic Sn-Pb solder joints under fatigue conditions. Unique metallurgical tests provide the fundamental input for the constitutive relations. The two-phase model mathematically predicts the heterogeneous coarsening behavior of near eutectic Sn-Pb solder. The finite element simulations with this model agree qualitatively with experimental thermomechanical fatigue tests. The simulations show that the presence of an initial heterogeneity in the solder microstructure could significantly degrade the fatigue lifetime. The single-phase model was developed to predict solder joint behavior using materials data for constitutive relation constants that could be determined through straightforward metallurgical experiments. Special thermomechanical fatigue tests were developed to give fundamental materials input to the models, and an in situ SEM thermomechanical fatigue test system was developed to characterize microstructural evolution and the mechanical behavior of solder joints during the test. A shear/torsion test sample was developed to impose strain in two different orientations. Materials constants were derived from these tests. The simulation results from the two-phase model showed good fit to the experimental test results.

  4. Characterization of tin crystal orientation evolution during thermal cycling in lead-free solder joints

    NASA Astrophysics Data System (ADS)

    Zhou, Bite

    To address the long term reliability of lead-free solder joints in electronic devices during thermal cycling, the fundamental understanding of deformation mechanisms was studied using polarized light optical microscopy (PLM), electron backscatter diffraction (EBSD) in scanning electron microscopy (SEM), and synchrotron X-ray diffraction (XRD). Near-eutectic Sn-3.0(wt %) Ag-0.5(wt %) Cu (SAC305) lead-free solder joints were assessed in three different package designs: low-strain plastic ball grid array (PBGA), medium-strain fine-pitch ball grid array (BGA), and high-strain wafer-level-chip-scale package (WLCSP). The effect of microstructure evolution on solder failure is correlated with dislocation slip activities. The major failure mode in lead-free solder joints during thermal cycling that causes the electrical failure of the device is cracking in the bulk Sn near the Si chip/solder interface. Microstructure and Sn grain orientation evolution usually precedes crack development. A combined approach of both statistical analysis of a large number of solder joints, and detailed studies of individual solder balls was used to investigate the causes of fracture. Sn crystal orientation evolution and its effect on deformation was characterized in solder joints with different thermal histories, and compared with those from other package designs with different effective strain levels. The relationship between the initial dominant and localized recrystallized Sn grain orientations on crack development was investigated. It is found that in the low-strain package design, cracking is strongly correlated with Sn grain orientations with the [001] direction (c-axis) nearly aligned with the chip/solder interface. But no cracks were observed in solder balls with dominant orientations that have the c-axis normal to the interface plane. In higher-strain packages, however, cracking occurred in a variety of Sn grain orientations, and even solder balls with dominant orientations that are

  5. Fluxless laser soldering for electronic packaging

    SciTech Connect

    Hosking, F M; Keicher, D M

    1991-01-01

    Conventional soldering typically requires the use of reactive fluxes to promote wetting. The resulting flux residues are removed primarily with halogenated or chlorofluorocarbon (CFC) solvents. With the mandated phaseout of CFCs by the year 2000, there has been a concentrated effort to develop alternative, environmentally compatible manufacturing and cleaning technologies that will satisfy the restrictions placed on CFCs, but still yield high quality product. Sandia National Laboratories is currently evaluating a variety of alternative fluxless soldering technologies which can be applied to electronic packaging. Laser soldering in a controlled atmosphere has shown great potential as an environmentally compatible process. The effects of laser heating with a 100 watt CW Nd:YAG laser, joint design, and base/filler metal reactions on achieving fluxless wetting with good metallurgical bonds were examined. Satisfactory Ni-Au plated Kovar{reg sign} solder joints were made with 80In-15Pb-5Ag and 63Sn-37Pb (wt. %) solder alloys in a slightly reducing cover gas. Wetting generally increased with increasing laser power, decreasing laser beam spot size, and decreasing part travel speed. The materials and processing interaction effects are identified and discussed.

  6. Fluxless laser soldering for electronic packaging

    SciTech Connect

    Hosking, F.M.; Keicher, D.M.

    1991-12-31

    Conventional soldering typically requires the use of reactive fluxes to promote wetting. The resulting flux residues are removed primarily with halogenated or chlorofluorocarbon (CFC) solvents. With the mandated phaseout of CFCs by the year 2000, there has been a concentrated effort to develop alternative, environmentally compatible manufacturing and cleaning technologies that will satisfy the restrictions placed on CFCs, but still yield high quality product. Sandia National Laboratories is currently evaluating a variety of alternative fluxless soldering technologies which can be applied to electronic packaging. Laser soldering in a controlled atmosphere has shown great potential as an environmentally compatible process. The effects of laser heating with a 100 watt CW Nd:YAG laser, joint design, and base/filler metal reactions on achieving fluxless wetting with good metallurgical bonds were examined. Satisfactory Ni-Au plated Kovar{reg_sign} solder joints were made with 80In-15Pb-5Ag and 63Sn-37Pb (wt. %) solder alloys in a slightly reducing cover gas. Wetting generally increased with increasing laser power, decreasing laser beam spot size, and decreasing part travel speed. The materials and processing interaction effects are identified and discussed.

  7. Microstructural evolution of eutectic Au-Sn solder joints

    SciTech Connect

    Song, Ho Geon

    2002-05-31

    Current trends toward miniaturization and the use of lead(Pb)-free solder in electronic packaging present new problems in the reliability of solder joints. This study was performed in order to understand the microstructure and microstructural evolution of small volumes of nominally eutectic Au-Sn solder joints (80Au-20Sn by weight), which gives insight into properties and reliability.

  8. Efforts to Develop a 300°C Solder

    SciTech Connect

    Norann, Randy A

    2015-01-25

    This paper covers the efforts made to find a 300°C electrical solder solution for geothermal well monitoring and logging tools by Perma Works LLC. This paper covers: why a high temperature solder is needed, what makes for a good solder, testing flux, testing conductive epoxy and testing intermetallic bonds. Future areas of research are suggested.

  9. Thermal resistances of solder-boss/potting compound combinations

    NASA Technical Reports Server (NTRS)

    Veilleux, E. D.

    1968-01-01

    Formulas, which can be used as a design tool, are derived to calculate the thermal resistance of solder-boss/potting compound combinations, for different depths of a solder boss, in electronic cordwood modules. Since the solder boss is the heat source, its shape and position will affect the thermal resistance of the surrounding potting compound.

  10. Utilizing energy efficient microwave sintering to significantly enhance the tensile response of a lead-free solder

    NASA Astrophysics Data System (ADS)

    Nai, S. M. L.; Kuma, J. V. M.; Gupta, M.

    2009-01-01

    This study investigates the effects of conventional sintering and hybrid microwave sintering techniques on the microstructure evolution and tensile properties of a Sn-Ag-Cu solder. A significant energy saving of up to 99% was achieved using the hybrid microwave assisted sintering approach. Hybrid microwave sintered samples exhibited better densification (in terms of lower porosity level) and this indicates the ability of microwaves to sinter solder materials more effectively. Furthermore, tensile results revealed that samples hybrid microwave sintered at 210 °C exhibited the best enhancement in yield strength and ultimate tensile strength, with no compromise in the failure strain, as compared with other widely used commercial solders. The morphology of pores and interparticle spacing were observed to be the two key factors influencing the mechanical properties of the solders.

  11. Mechanical Shock Behavior of Environmentally-Benign Lead-free Solders

    NASA Astrophysics Data System (ADS)

    Yazzie, Kyle

    The mechanical behavior of Pb-free solder alloys is important, since they must maintain mechanical integrity under thermomechanical fatigue, creep, and mechanical shock conditions. Mechanical shock, in particular, has become an increasing concern in the electronics industry, since electronic packages can be subjected to mechanical shock by mishandling during manufacture or by accidental dropping. In this study, the mechanical shock behavior of Sn and Sn-Ag-Cu alloys was systematically analyzed over the strain rate range 10-3 -- 30 s-1 in bulk samples, and over 10-3 -- 12 s-1 on the single solder joint level. More importantly, the influences of solder microstructure and intermetallic compounds (IMC) on mechanical shock resistance were quantified. A thorough microstructural characterization of Sn-rich alloys was conducted using synchrotron x-ray computed tomography. The three-dimensional morphology and distribution of contiguous phases and precipitates was analyzed. A multiscale approach was utilized to characterize Sn-rich phases on the microscale with x-ray tomography and focused ion beam tomography to characterize nanoscale precipitates. A high strain rate servohydraulic test system was developed in conjunction with a modified tensile specimen geometry and a high speed camera for quantifying deformation. The effect of microstructure and applied strain rate on the local strain and strain rate distributions were quantified using digital image correlation. Necking behavior was analyzed using a novel mirror fixture, and the triaxial stresses associated with necking were corrected using a self-consistent method to obtain the true stress-true strain constitutive behavior. Fracture mechanisms were quantified as a function of strain rate. Finally, the relationship between solder microstructure and intermetallic compound layer thickness with the mechanical shock resistance of Sn-3.8Ag-0.7Cu solder joints was characterized. It was found that at low strain rates the dynamic

  12. Air and blood lead levels in a battery factory.

    PubMed

    Ibiebele, D D

    1994-08-01

    Chronic exposure of acid-lead battery factory workers to lead was assessed by determining blood lead levels (PbB) in 80 blood samples obtained from 20 workers and relating the values to lead in air (PbA) values in 80 air samples collected at four operational areas. All the samples were analyzed for lead by atomic absorption spectrophotometry. The geometric means of PbA at the sampling areas were: 92.01 micrograms/m3 in the casting and pasting area; 85.73 micrograms/m3 in the assembly line area; 36.31 micrograms/m3 in the battery charging and sales area; and 4.2 micrograms/m3 in the administration area. The corresponding PbB values were 32.19 micrograms/dl, 35.42 micrograms/dl, 17.33 micrograms/dl and 7.78 micrograms/dl, respectively. The correlations between the PbA and PbB were positive for all the areas and also for the dry and wet seasons. The possibility of predicting PbB by monitoring PbA needs to be evaluated.

  13. A novel method for direct solder bump pull testing using lead-free solders

    NASA Astrophysics Data System (ADS)

    Turner, Gregory Alan

    This thesis focuses on the design, fabrication, and evaluation of a new method for testing the adhesion strength of lead-free solders, named the Isotraction Bump Pull method (IBP). In order to develop a direct solder joint-strength testing method that did not require customization for different solder types, bump sizes, specific equipment, or trial-and-error, a combination of two widely used and accepted standards was created. First, solder bumps were made from three types of lead free solder were generated on untreated copper PCB substrates using an in-house fabricated solder bump-on-demand generator, Following this, the newly developed method made use of a polymer epoxy to encapsulate the solder bumps that could then be tested under tension using a high precision universal vertical load machine. The tests produced repeatable and predictable results for each of the three alloys tested that were in agreement with the relative behavior of the same alloys using other testing methods in the literature. The median peak stress at failure for the three solders tested were 2020.52 psi, 940.57 psi, and 2781.0 psi, and were within one standard deviation of the of all data collected for each solder. The assumptions in this work that brittle fracture occurred through the Intermetallic Compound layer (IMC) were validated with the use of Energy-Dispersive X-Ray Spectrometry and high magnification of the fractured surface of both newly exposed sides of the test specimens. Following this, an examination of the process to apply the results from the tensile tests into standard material science equations for the fracture of the systems was performed..

  14. The Influence of Declining Air Lead Levels on Blood Lead-Air Lead Slope Factors in Children

    EPA Science Inventory

    This presentation describes calculation of blood lead-air lead slope factor within an analysis of the relationship between blood lead levels and air lead levels among participants in the National Health and Nutrition Examination Survey (NHANES). The slope factors are compared wi...

  15. NASA-DoD Lower Process Temperature Lead-Free Solder Project Overview

    NASA Technical Reports Server (NTRS)

    Kessel, Kurt R.

    2014-01-01

    This project is a follow-on effort to the Joint Council on Aging AircraftJoint Group on Pollution Prevention (JCAAJG-PP) Pb-free Solder Project and NASA-DoD Lead-Free Electronics Project which were the first projects to test the reliability of Pb-free solder joints against the requirements of the aerospace and military community. This effort would continue to build on the results from the JCAAJG-PP Lead-Free Solder Project and NASA-DoD Lead-Free Electronics Project while focusing on a particular failure mechanism currently plaguing Pb-free assemblies, pad cratering.The NASA-DoD Lead-Free Electronics Project confirmed that pad cratering is one of the dominant failure modes that occur in various board level reliability tests, especially under dynamic loading. Pad Cratering is a latent defect that may occur during assembly, rework, and post assembly handling and testing.

  16. Nanocopper Based Solder-Free Electronic Assembly

    NASA Astrophysics Data System (ADS)

    Schnabl, K.; Wentlent, L.; Mootoo, K.; Khasawneh, S.; Zinn, A. A.; Beddow, J.; Hauptfleisch, E.; Blass, D.; Borgesen, P.

    2014-12-01

    CuantumFuse nano copper material has been used to assemble functional LED test boards and a small camera board with a 48 pad CMOS sensor quad-flat no-lead chip and a 10 in flexible electronics demo. Drop-in replacement of solder, by use of stencil printing and standard surface mount technology equipment, has been demonstrated. Applications in space and commercial systems are currently under consideration. The stable copper-nanoparticle paste has been examined and characterized by scanning electron microscopy and high-resolution transmission electron microscopy; this has shown that the joints are nanocrystalline but with substantial porosity. Assessment of reliability is expected to be complicated by this and by the effects of thermal and strain-enhanced coarsening of pores. Strength, creep, and fatigue properties were measured and results are discussed with reference to our understanding of solder reliability to assess the potential of this nano-copper based solder alternative.

  17. Pb-Free Soldering Iron Temperature Controller

    NASA Astrophysics Data System (ADS)

    Hamane, Hiroto; Wajima, Kenji; Hayashi, Yoichi; Komiyama, Eiichi; Tachibana, Toshiaki; Miyazaki, Kazuyoshi

    Recently, much importance has been attached to the environmental problem. The content of two directives to better control the management of waste electronic equipment was approved. The two directives are the Waste from Electrical and Electronic Equipment (WEEE) and the Restriction of Hazardous Substances (RoHS). These set phase-out dates for the use of lead materials contained in electronic products. Increasingly, attention is focusing on the potential use of Pb-free soldering in electronics manufacturing. It should be noted that many of the current solding irons are not suitable for Pb-free technology, due to the inferior wetting ability of Pb-free alloys compared with SnPb solder pastes. This paper presents a Pb-free soldering iron temperature controller using an embedded micro-processor with a low memory capacity.

  18. Solder Joint Health Monitoring Testbed System

    NASA Technical Reports Server (NTRS)

    Delaney, Michael M.

    2009-01-01

    The density and pin count for Field Programmable Gate Arrays (FPGAs) has been increasing, and has exceeded current methods of solder joint inspection, making early detection of failures more problematic. These failures are a concern for both flight safety and maintenance in commercial aviation. Ridgetop Group, Inc. has developed a method for detecting solder joint failures in real time. The NASA Dryden Flight Research Center is developing a set of boards to test this method in ground environmental and accelerated testing as well as flight test on a Dryden F-15 or F-18 research aircraft. In addition to detecting intermittent and total solder joint failures, environmental data on the boards, such as temperature and vibration, will be collected and time-correlated to aircraft state data. This paper details the technical approach involved in the detection process, and describes the design process and products to date for Dryden s FPGA failure detection boards.

  19. Solderability Study of RABiTS-Based YBCO Coated Conductors

    SciTech Connect

    Zhang, Yifei; Duckworth, Robert C; Ha, Tam T; Gouge, Michael J

    2011-01-01

    The solderability of commercially available YBa{sub 2}Cu{sub 3}O{sub 7-x} (YBCO) coated conductors that were made from Rolling Assisted Biaxially Textured Substrates (RABiTS)-based templates was studied. The coated conductors, also known as second-generation (2G) high temperature superconductor (HTS) wires (in the geometry of flat tapes about 4 mm wide), were laminated with copper, brass, or stainless steel strips as stabilizers. To understand the factors that influence their solderability, surface profilometry and scanning electron microscopy were used to characterize the wire surfaces. The solderability of three solders, 52In48Sn, 67Bi33In, and 100In (wt.%), was evaluated using a standard test (IPC/ECA J-STD-002) and with two different commercial fluxes. It was found that the solderability varied with the solder and flux but the three different wires showed similar solderability for a fixed combination of solder and flux. Solder joints of the 2G wires were fabricated using the tools and the procedures recommended by the HTS wire manufacturer. The solder joints were made in a lap-joint geometry and with the superconducting sides of the two wires face-to-face. The electrical resistances of the solder joints were measured at 77 K, and the results were analyzed to qualify the soldering materials and evaluate the soldering process. It was concluded that although the selection of soldering materials affected the resistance of a solder joint, the resistivity of the stabilizer was the dominant factor.

  20. The advantages and disadvantages of centralized control of air power at operational level

    NASA Astrophysics Data System (ADS)

    Arisoy, Uǧur

    2014-05-01

    People do not want to see and hear a war. In today's world, if war is inevitable, the use of air power is seen as the preferable means of conducting operations instead of financially burdensome land battles which are more likely to cause heavy loss of life. The use of Air Power has gained importance in NATO operations in the Post-Cold War era. For example, air power has undertaken a decisive role from the beginning to the end of the operation in Libya. From this point of view, the most important issue to consider is how to direct air power more effectively at operational level. NATO's Core JFAC (Joint Force Air Command) was established in 2012 to control joint air power at operational level from a single center. US had experienced JFAC aproach in the Operation Desert Storm in 1991. UK, France, Germany, Italy and Spain are also directing their air power from their JFAC structures. Joint air power can be directed from a single center at operational level by means of JFAC. JFAC aproach provides complex planning progress of Air Power to be controled faster in a single center. An Air Power with a large number of aircrafts, long range missiles of cutting-edge technology may have difficulties in achieving results unless directed effectively. In this article, directing air power more effectively at operational level has been studied in the framework of directing air power from a single center carried out by SWOT analysis technique. "Directing Air Power at operational level from a single center similar to JFAC-like structure" is compared with "Directing Air Power at operational level from two centers similar to AC (Air Command) + CAOC (Combined Air Operations Center) structure" As a result of this study, it is assessed that directing air power at operational level from a single center would bring effectiveness to the air campaign. The study examines directing air power at operational level. Developments at political, strategic and tactical levels have been ignored.

  1. Low temperature solder process to join a copper tube to a silicon wafer

    NASA Astrophysics Data System (ADS)

    Versteeg, Christo; Scarpim de Souza, Marcio

    2014-06-01

    With the application for wafer level packages, which could be Complementary Metal-Oxide-Semiconductor (CMOS) based, and which requires a reduced atmosphere, a copper tube connection to a vacuum pump and the package is proposed. The method evaluated uses laser assisted brazing of a solder, to join the copper tube to a silicon wafer. The method was applied to a silicon wafer coated with a metallic interface to bond to the solder. The hermeticity of the joint was tested with a helium leak rate tester and the bonding energy thermal extent was verified with a thin layer of indium that melted wherever the substrate temperature rose above its melting temperature.

  2. Lead (Pb)-Free Solder Applications

    SciTech Connect

    VIANCO,PAUL T.

    2000-08-15

    Legislative and marketing forces both abroad and in the US are causing the electronics industry to consider the use of Pb-free solders in place of traditional Sn-Pb alloys. Previous case studies have demonstrated the satisfactory manufacturability and reliability of several Pb-free compositions for printed circuit board applications. Those data, together with the results of fundamental studies on Pb-free solder materials, have indicated the general feasibility of their use in the broader range of present-day, electrical and electronic components.

  3. ESD Test Apparatus for Soldering Irons

    NASA Technical Reports Server (NTRS)

    Sancho, Jose; Esser, Robert

    2013-01-01

    ESDA (Electrostatic Discharge Association) ESD STM 13.1-2000 requires frequent testing of the voltage leakage from the tip of a soldering iron and the resistance from the tip of the soldering iron to the common point ground. Without this test apparatus, the process is time-consuming and requires several wires, alligator clips, or test probes, as well as additional equipment. Soldering iron tips must be tested for electrostatic discharge risks frequently, and this typically takes a lot of time in setup and testing. This device enables the operator to execute the full test in one minute or less. This innovation is a simple apparatus that plugs into a digital multimeter (DMM) and the Common Point Ground (CPG) reference. It enables the user to perform two of the electrostatic discharge tests required in ESD STM 13.1-2000. The device consists of a small black box with two prongs sticking out of one end, two inputs on the opposite end (one of the inputs is used to connect the reference CPG to the DMM), and a metal tab on one side. Inside the box are wires, several washers of various materials, and assembly hardware (nuts and screws/bolts). The device is a passive electronic component that is plugged into a DMM. The operator sets the DMM to read voltage. The operator places the heated tip of the soldering iron onto the metal tab with a small amount of solder to ensure a complete connection. The voltage is read and recorded. The operator switches the DMM to read resistance. The operator places the heated tip of the soldering iron onto the metal tab with a small amount of solder to ensure a complete connection. The resistance is recorded. If the recorded voltage and resistance are below a number stated in ESDA ESD STM 13.1-2000, the test is considered to pass. The device includes all the necessary wiring internal to its body so the operator does not need to do any independent wiring, except for grounding. It uses a stack of high-thermal-resistance washers to minimize the

  4. Prototype circuit boards assembled with non-lead bearing solders

    SciTech Connect

    Vianco, P.T.; Rejent, J.A.

    1998-04-01

    The 91.84Sn-3.33Ag-4.83Bi and 96.5Sn-3.5Ag Pb-free solders were evaluated for surface mount circuit board interconnects. The 63Sn-37Pb solder provided the baseline data. All three solders exhibited suitable manufacturability per a defect analyses of circuit board test vehicles. Thermal cycling had no significant effect on the 91.84Sn-3.33Ag-4.83Bi solder joints. Some degradation in the form of grain boundary sliding was observed in 96.5Sn-3.5Ag and 63Sn-37Pb solder joints. The quality of the solder joint microstructures showed a slight degree of degradation under thermal shock exposure for all of the solders tested. Trends in the solder joint shear strengths could be traced to the presence of Pd in the solder, the source of which was the Pd/Ni finish on the circuit board conductor features. The higher, intrinsic strengths of the Pb-free solders encouraged the failure path to be located in proximity to the solder/substrate interface where Pd combined with Sn to form brittle PdSn{sub 4} particles, resulting in reduced shear strengths.

  5. Solder flow over fine line PWB surface finishes

    SciTech Connect

    Hosking, F.M.; Hernandez, C.L.

    1998-08-01

    The rapid advancement of interconnect technology has stimulated the development of alternative printed wiring board (PWB) surface finishes to enhance the solderability of standard copper and solder-coated surfaces. These new finishes are based on either metallic or organic chemistries. As part of an ongoing solderability study, Sandia National Laboratories has investigated the solder flow behavior of two azole-based organic solderability preservations, immersion Au, immersion Ag, electroless Pd, and electroless Pd/Ni on fine line copper features. The coated substrates were solder tested in the as-fabricated and environmentally-stressed conditions. Samples were processed through an inerted reflow machine. The azole-based coatings generally provided the most effective protection after aging. Thin Pd over Cu yielded the best wetting results of the metallic coatings, with complete dissolution of the Pd overcoat and wetting of the underlying Cu by the flowing solder. Limited wetting was measured on the thicker Pd and Pd over Ni finishes, which were not completely dissolved by the molten solder. The immersion Au and Ag finishes yielded the lowest wetted lengths, respectively. These general differences in solderability were directly attributed to the type of surface finish which the solder came in contact with. The effects of circuit geometry, surface finish, stressing, and solder processing conditions are discussed.

  6. Automatic computer-aided system of simulating solder joint formation

    NASA Astrophysics Data System (ADS)

    Zhao, Xiujuan; Wang, Chunqing; Zheng, Guanqun; Wang, Gouzhong; Yang, Shiqin

    1999-08-01

    One critical aspect in electronic packaging is the fatigue/creep-induced failure in solder interconnections, which is found to be highly dependent on the shape of solder joints. Thus predicting and analyzing the solder joint shape is warranted. In this paper, an automatic computer-aided system is developed to simulate the formation of solder joint and analyze the influence of the different process parameters on the solder joint shape. The developed system is capable of visually designing the process parameters and calculating the solder joint shape automatically without any intervention from the user. The automation achieved will enable fast shape estimation with the variation of process parameters without time consuming experiments, and the simulating system provides the design and manufacturing engineers an efficient software tools to design soldering process in design environment. Moreover, a program developed from the system can serve as the preprocessor for subsequent finite element joint analysis program.

  7. Solder for oxide layer-building metals and alloys

    DOEpatents

    Kronberg, James W.

    1992-01-01

    A low temperature solder and method for soldering an oxide layer-building metal such as aluminum, titanium, tantalum or stainless steel. The comosition comprises tin and zinc; germanium as a wetting agent; preferably small amounts of copper and antimony; and a grit, such as silicon carbide. The grit abrades any oxide layer formed on the surface of the metal as the germanium penetrates beneath and loosens the oxide layer to provide good metal-to-metal contact. The germanium comprises less than aproximatley 10% by weight of the solder composition so that it provides sufficient wetting action but does not result in a melting temperature above approximately 300.degree. C. The method comprises the steps rubbing the solder against the metal surface so the grit in the solder abrades the surface while heating the surface until the solder begins to melt and the germanium penetrates the oxide layer, then brushing aside any oxide layer loosened by the solder.

  8. Solder for oxide layer-building metals and alloys

    DOEpatents

    Kronberg, J.W.

    1992-09-15

    A low temperature solder and method for soldering an oxide layer-building metal such as aluminum, titanium, tantalum or stainless steel is disclosed. The composition comprises tin and zinc; germanium as a wetting agent; preferably small amounts of copper and antimony; and a grit, such as silicon carbide. The grit abrades any oxide layer formed on the surface of the metal as the germanium penetrates beneath and loosens the oxide layer to provide good metal-to-metal contact. The germanium comprises less than approximately 10% by weight of the solder composition so that it provides sufficient wetting action but does not result in a melting temperature above approximately 300 C. The method comprises the steps rubbing the solder against the metal surface so the grit in the solder abrades the surface while heating the surface until the solder begins to melt and the germanium penetrates the oxide layer, then brushing aside any oxide layer loosened by the solder.

  9. Capillary flow of solder on chemically roughened PWB surfaces

    SciTech Connect

    Hosking, F.M.; Stevenson, J.O.; Yost, F.G.

    1996-02-01

    The Center for Solder Science and Technology at Sandia National Laboratories has developed a solderability test for evaluating fundamental solder flow over PWB (printed wiring boards) surface finishes. The work supports a cooperative research and development agreement between Sandia, the National Center for Manufacturing Sciences (NCMS), and several industrial partners. An important facet of the effort involved the ``engineering`` of copper surfaces through mechanical and chemical roughening. The roughened topography enhances solder flow, especially over very fine features. In this paper, we describe how etching with different chemical solutions can affect solder flow on a specially designed ball grid array test vehicle (BGATV). The effects of circuit geometry, solution concentration, and etching time are discussed. Surface roughness and solder flow data are presented to support the roughening premise. Noticeable improvements in solder wettability were observed on uniformly etched surfaces having relatively steep peak-to-valley slopes.

  10. Embrittlement of surface mount solder joints by hot solder-dipped, gold-plated leads

    SciTech Connect

    Vianco, P.T.

    1993-07-01

    The detachment of beam-leaded transistors from several surface mount circuit boards following modest thermal cycling was examined. Microstructural analysis of the package leads and bonding pads from the failed units indicated that gold embrittlement was responsible for a loss of solder joint mechanical integrity that caused detachment of transistors from the circuit boards. An analysis of the hot dipping process used to remove gold from the leads prior to assembly demonstrated that the gold, although dissolved from the lead, remained in the nearby solder and was subsequently retained in the coating formed on the lead upon withdrawal from the bath. This scenario allowed gold to enter the circuit board solder joints. It was hypothesized, and later confirmed by experimental trials, that increasing the number of dips prevented gold from entering the solder coatings.

  11. Evaluation of the Bondability of the Epoxy-Enhanced Sn-58Bi Solder with ENIG and ENEPIG Surface Finishes

    NASA Astrophysics Data System (ADS)

    Myung, Woo-Ram; Kim, Yongil; Jung, Seung-Boo

    2015-11-01

    The effect of different surface finishes, electroless nickel immersion gold (ENIG) and electroless nickel electroless palladium immersion gold (ENEPIG), on the mechanical properties of Sn-58Bi bumps made with solder paste enhanced with epoxy were investigated. The microstructure and fracture surfaces were observed with scanning electron microscopy, and the compositions of the IMC and solder were measured using energy dispersive spectrometry and an electron probe micro-analyzer (EPMA). To evaluate the mechanical properties, low-speed shear tests and board-level drop tests were performed. The result of the shear tests showed that the bonding strength of the epoxy-enhanced Sn-58Bi solder bumps was higher than that of Sn-58Bi solder for all surface finishes, because of the epoxy surrounding the solder, and the fracture surfaces of epoxy-enhanced Sn-58Bi indicated ductile fracture in the solder joint. However, the result of the drop tests showed that samples with the ENIG and ENEPIG surface finishes had lower drop numbers compared to the sample without these surface finishes. The lower performance resulted from insufficient ejection of epoxy from the ENIG and ENEPIG surface finishes during reflow, which reduced the interfacial bonding area.

  12. Microstructural Evolution of Lead-Free Solder Joints in Ultrasonic-Assisted Soldering

    NASA Astrophysics Data System (ADS)

    Ji, Hongjun; Wang, Qiang; Li, Mingyu

    2016-01-01

    Solder joint reliability greatly depends on the microstructure of the solder matrix and the morphology of intermetallic compounds (IMCs) in the joints. Addition of strengthening phases such as carbon nanotubes and ceramic particles to solder joints to improve their properties has been widely studied. In this work, ultrasonic vibration (USV) of casting ingots was applied to considerably improve their microstructure and properties, and the resulting influence on fluxless soldering of Cu/Sn-3.0Ag-0.5Cu/Cu joints and their microstructural evolution was investigated. It was demonstrated that USV application during reflow of Sn-based solder had favorable effects on β-Sn grain size refinement as well as the growth and distribution of various IMC phases within the joints. The β-Sn grain size was significantly refined as the ultrasound power was increased, with a reduction of almost 90% from more than 100 μm to below 10 μm. Long and large Cu6Sn5 tubes in the solder matrix of the joints were broken into tiny ones. Needle-shaped Ag3Sn was transformed into flake-shaped. These IMCs were mainly precipitated along β-Sn phase boundaries. High-temperature storage tests indicated that the growth rate of interfacial IMCs in joints formed with USV was slower than in conventional reflow joints. The mechanisms of grain refinement and IMC fragmentation are discussed and related to the ultrasonic effects.

  13. 42 CFR 84.140 - Air velocity and noise levels; hoods and helmets; minimum requirements.

    Code of Federal Regulations, 2013 CFR

    2013-10-01

    ... 42 Public Health 1 2013-10-01 2013-10-01 false Air velocity and noise levels; hoods and helmets; minimum requirements. 84.140 Section 84.140 Public Health PUBLIC HEALTH SERVICE, DEPARTMENT OF HEALTH AND... PROTECTIVE DEVICES Supplied-Air Respirators § 84.140 Air velocity and noise levels; hoods and...

  14. 42 CFR 84.140 - Air velocity and noise levels; hoods and helmets; minimum requirements.

    Code of Federal Regulations, 2010 CFR

    2010-10-01

    ... 42 Public Health 1 2010-10-01 2010-10-01 false Air velocity and noise levels; hoods and helmets; minimum requirements. 84.140 Section 84.140 Public Health PUBLIC HEALTH SERVICE, DEPARTMENT OF HEALTH AND... PROTECTIVE DEVICES Supplied-Air Respirators § 84.140 Air velocity and noise levels; hoods and...

  15. 42 CFR 84.140 - Air velocity and noise levels; hoods and helmets; minimum requirements.

    Code of Federal Regulations, 2012 CFR

    2012-10-01

    ... 42 Public Health 1 2012-10-01 2012-10-01 false Air velocity and noise levels; hoods and helmets; minimum requirements. 84.140 Section 84.140 Public Health PUBLIC HEALTH SERVICE, DEPARTMENT OF HEALTH AND... PROTECTIVE DEVICES Supplied-Air Respirators § 84.140 Air velocity and noise levels; hoods and...

  16. 42 CFR 84.140 - Air velocity and noise levels; hoods and helmets; minimum requirements.

    Code of Federal Regulations, 2014 CFR

    2014-10-01

    ... 42 Public Health 1 2014-10-01 2014-10-01 false Air velocity and noise levels; hoods and helmets; minimum requirements. 84.140 Section 84.140 Public Health PUBLIC HEALTH SERVICE, DEPARTMENT OF HEALTH AND... PROTECTIVE DEVICES Supplied-Air Respirators § 84.140 Air velocity and noise levels; hoods and...

  17. 42 CFR 84.140 - Air velocity and noise levels; hoods and helmets; minimum requirements.

    Code of Federal Regulations, 2011 CFR

    2011-10-01

    ... 42 Public Health 1 2011-10-01 2011-10-01 false Air velocity and noise levels; hoods and helmets; minimum requirements. 84.140 Section 84.140 Public Health PUBLIC HEALTH SERVICE, DEPARTMENT OF HEALTH AND... PROTECTIVE DEVICES Supplied-Air Respirators § 84.140 Air velocity and noise levels; hoods and...

  18. Multilead, Vaporization-Cooled Soldering Heat Sink

    NASA Technical Reports Server (NTRS)

    Rice, John

    1995-01-01

    Vaporization-cooled heat sink proposed for use during soldering of multiple electrical leads of packaged electronic devices to circuit boards. Heat sink includes compliant wicks held in grooves on edges of metal fixture. Wicks saturated with water. Prevents excessive increases in temperature at entrances of leads into package.

  19. Demonstrated results of welded and soldered interconnections

    NASA Technical Reports Server (NTRS)

    Hart, R. E., Jr.

    1985-01-01

    Solar cell modules with welded and soldered interconnections were constructed using a flexible substrate material. These modules were thermally cycled between approx. 80 deg C at rates 100 cycles/day to demonstrate survivability under simulated low Earth orbit (LEO) temperature conditions. The modules, cycled in an inert atmosphere, show durability for 36,000 cycles.

  20. Entrainment of Upper Level Dry Air Into Hurricane Earl

    NASA Technical Reports Server (NTRS)

    Guillory, Anthony R.; Jedlovec, Gary J.; Hood, Robbie E.; Atkinson, Robert J.; LaFontaine, Frank J.

    1999-01-01

    Hurricane Earl formed in the Gulf of Mexico in September 1998. It quickly was upgraded from a tropical disturbance to tropical storm status and then to a hurricane. Earl possessed hybrid (tropical and extratropical) characteristics throughout its lifetime. The system maintained and erratic track, which led to wide variability in the operational track forecasts. It eventually made landfall on the Florida panhandle on 2 September and raced northeastward. During August and September 1998, NASA conducted the third Convection and Moisture Experiment (CAMEX-3). The experiment was focused on studying hurricanes with an emphasis toward developing a better understanding of their intensification and motion. Earl provides a unique opportunity to utilize high spatial and temporal resolution data collected from the DC-8 and high altitude ER-2 NASA platforms, which flew over Earl as it made landfall. These data can also be put into broader view provided by other instruments from the Geosynchronous Operational Environmental Satellites (GOES) and the Tropical Rainfall Measuring Mission (TRMM) satellites. Hurricane Earl was affected by entrainment of dry air from the northwest. Hurricane Isis was intensifying and approaching the Mexican Pacific coast with its associated outflow potentially affecting the inflow into Earl as the storm neared Florida. In addition, a longwave synoptic trough circulation was present over the eastern U.S. Either or both of these could be responsible for the dry air into the system. This paper will focus on identifying the source of the dry by using upper-level wind and moisture fields derived from the GOES 6.7 um water vapor imagery. We will attempt to relate the large-scale observations to those from the NASA aircraft. An infrared instrument onboard the ER-2 also has a similar wavelength and may be able to confirm some of the GOES findings. In addition, a microwave radiometer with 4 channels focused on measuring precipitation and its associated ice

  1. Microwave Tissue Soldering for Immediate Wound Closure

    NASA Technical Reports Server (NTRS)

    Arndt, G. Dickey; Ngo, Phong H.; Phan, Chau T.; Byerly, Diane; Dusl, John; Sognier, Marguerite A.; Carl, James

    2011-01-01

    A novel approach for the immediate sealing of traumatic wounds is under development. A portable microwave generator and handheld antenna are used to seal wounds, binding the edges of the wound together using a biodegradable protein sealant or solder. This method could be used for repairing wounds in emergency settings by restoring the wound surface to its original strength within minutes. This technique could also be utilized for surgical purposes involving solid visceral organs (i.e., liver, spleen, and kidney) that currently do not respond well to ordinary surgical procedures. A miniaturized microwave generator and a handheld antenna are used to deliver microwave energy to the protein solder, which is applied to the wound. The antenna can be of several alternative designs optimized for placement either in contact with or in proximity to the protein solder covering the wound. In either case, optimization of the design includes the matching of impedances to maximize the energy delivered to the protein solder and wound at a chosen frequency. For certain applications, an antenna could be designed that would emit power only when it is in direct contact with the wound. The optimum frequency or frequencies for a specific application would depend on the required depth of penetration of the microwave energy. In fact, a computational simulation for each specific application could be performed, which would then match the characteristics of the antenna with the protein solder and tissue to best effect wound closure. An additional area of interest with potential benefit that remains to be validated is whether microwave energy can effectively kill bacteria in and around the wound. Thus, this may be an efficient method for simultaneously sterilizing and closing wounds.

  2. Soldering of Carbon Materials Using Transition Metal Rich Alloys.

    PubMed

    Burda, Marek; Lekawa-Raus, Agnieszka; Gruszczyk, Andrzej; Koziol, Krzysztof K K

    2015-08-25

    Joining of carbon materials via soldering has not been possible up to now due to lack of wetting of carbons by metals at standard soldering temperatures. This issue has been a severely restricting factor for many potential electrical/electronic and mechanical applications of nanostructured and conventional carbon materials. Here we demonstrate the formation of alloys that enable soldering of these structures. By addition of several percent (2.5-5%) of transition metal such as chromium or nickel to a standard lead-free soldering tin based alloy we obtained a solder that can be applied using a commercial soldering iron at typical soldering temperatures of approximately 350 °C and at ambient conditions. The use of this solder enables the formation of mechanically strong and electrically conductive joints between carbon materials and, when supported by a simple two-step technique, can successfully bond carbon structures to any metal terminal. It has been shown using optical and scanning electron microscope images as well as X-ray diffraction patterns and energy dispersive X-ray mapping that the successful formation of carbon-solder bonds is possible, first, thanks to the uniform nonreactive dispersion of transition metals in the tin-based matrix. Further, during the soldering process, these free elements diffuse into the carbon-alloy border with no formation of brazing-like carbides, which would damage the surface of the carbon materials. PMID:26256042

  3. Effect of Solder Joint Length on Fracture Under Bending

    NASA Astrophysics Data System (ADS)

    Akbari, Saeed; Nourani, Amir; Spelt, Jan K.

    2016-01-01

    Fracture tests were conducted on copper-solder-copper joints of various lengths using double-cantilever-beam (DCB) specimens under mode I loading conditions. The thickness and length of the solder joints were large enough to neglect any anisotropy associated with the solder microstructure. It was found that the critical strain energy release rate at crack initiation, G ci, was insensitive to the length of the solder joint; however, for joints shorter than a characteristic length which was a function of the thickness and the mechanical properties of the solder layer and the substrates, the fracture load increased with increasing solder joint length. A sandwich model was developed for the analysis of the stress and strain in solder joints, taking into account the influence of both the bending deformation and the shear deformation of the substrates on the solder joint stresses. Consistent with the experimental results, it was found that solder joints longer than the characteristic length have a maximum peel stress that remains unchanged with joint length, causing the joint strength to become independent of the joint length. A closed-form analytical solution was developed for the characteristic length of DCB specimens under mode I loading. The experimental results were in good agreement with the analytical model and with finite element results. The generality of the G ci failure criterion was demonstrated by comparing the experimental results and the fracture load predictions of mode I DCB solder joints with different lengths.

  4. CO2 temperature-controlled laser soldering of pig trachea incisions in vitro using flexible albumin bands

    NASA Astrophysics Data System (ADS)

    Sharvit, Dan; Vasilyev, Tamar; Vasserman, Irena; Simhon, David; Kariv, Naam; DeRowe, Ari; Katzir, Abraham

    2005-04-01

    Resection of a segment of the trachea is a procedure applied for the removal of cervical tumors invading the trachea, or for the treatment of severe tracheal stenosis. The current method of anastomosis is based on multiple sutures. The main drawbacks of this method are: 1) A long procedure time, 2) An air leakage, and 3) An inflammatory response to the sutures. In this study we evaluated the feasibility and effectiveness of the use of temperature controlled CO2 laser soldering of incisions in pig tracheas in vitro. A transverse incision was made in a separated pig trachea. A flexible albumin band was prepared and was laser soldered with albumin solder to the outer surface of the trachea, covering the incision. The soldered trachea ends were sealed and the burst pressure was measured. In a series of in vitro experiments, the mean burst pressure was found to be 230 mm Hg. These preliminary results demonstrated that laser soldering using a flexible albumin band may be a useful method for sealing an incision in the trachea.

  5. Improved performance of diode-end-pumped Nd:GdVO4 912 nm laser property with indium solder technology

    NASA Astrophysics Data System (ADS)

    Yan, R. P.; Yu, X.; Chen, D. Y.; Chen, F.; Li, X. D.; Ma, Y. F.; Wang, C.; Yu, J. H.

    2011-03-01

    A novel indium-solder technology is demonstrated to deal with the serious thermal dissipation problem in the 912 nm Nd:GdVO4 laser operation. By use of indium-solder between the laser rod and the heat-sink, the contact resistance is reduced by removing the air bubble and heat conducting silicon and the boundary heat transfer coefficient is raised. After the indium-solder was used, it is found that the temperature in the laser rod and the deformation in the pumping end surface are eased remarkably based on a simulation of finite element analysis. Experimental results show that the continuous-wave 912 nm laser performance is improved obviously, both in a plano-plano cavity and a plano-concave cavity.

  6. Vandenberg Air Force Base Upper Level Wind Launch Weather Constraints

    NASA Technical Reports Server (NTRS)

    Shafer, Jaclyn A.; Wheeler, Mark M.

    2012-01-01

    The 30th Operational Support Squadron Weather Flight (30 OSSWF) provides comprehensive weather services to the space program at Vandenberg Air Force Base (VAFB) in California. One of their responsibilities is to monitor upper-level winds to ensure safe launch operations of the Minuteman III ballistic missile. The 30 OSSWF tasked the Applied Meteorology Unit (AMU) to analyze VAFB sounding data with the goal of determining the probability of violating (PoV) their upper-level thresholds for wind speed and shear constraints specific to this launch vehicle, and to develop a tool that will calculate the PoV of each constraint on the day of launch. In order to calculate the probability of exceeding each constraint, the AMU collected and analyzed historical data from VAFB. The historical sounding data were retrieved from the National Oceanic and Atmospheric Administration Earth System Research Laboratory archive for the years 1994-2011 and then stratified into four sub-seasons: January-March, April-June, July-September, and October-December. The maximum wind speed and 1000-ft shear values for each sounding in each subseason were determined. To accurately calculate the PoV, the AMU determined the theoretical distributions that best fit the maximum wind speed and maximum shear datasets. Ultimately it was discovered that the maximum wind speeds follow a Gaussian distribution while the maximum shear values follow a lognormal distribution. These results were applied when calculating the averages and standard deviations needed for the historical and real-time PoV calculations. In addition to the requirements outlined in the original task plan, the AMU also included forecast sounding data from the Rapid Refresh model. This information provides further insight for the launch weather officers (LWOs) when determining if a wind constraint violation will occur over the next few hours on day of launch. The interactive graphical user interface (GUI) for this project was developed in

  7. Ocular surface adverse effects of ambient levels of air pollution.

    PubMed

    Torricelli, André Augusto Miranda; Novaes, Priscila; Matsuda, Monique; Alves, Milton Ruiz; Monteiro, Mário Luiz Ribeiro

    2011-01-01

    It is widely recognized today that outdoor air pollution can affect human health. Various chemical components that are present in ambient pollution may have an irritant effect on the mucous membranes of the body, particularly those of the respiratory tract. Much less attention has been focused on the adverse effect on the ocular surface, despite the fact that this structure is even more exposed to air pollution than the respiratory mucosa since only a very thin tear film separates the corneal and conjunctival epithelia from the air pollutants. So far, clinical data are the more widespread tools used by ophthalmologists for assessing possible aggression to the ocular surface; however, clinical findings alone appears not to correlate properly with the complaints presented by the patients pointing out the need for further clinical and laboratory studies on the subject. The purpose of this study is to review signs and symptoms associated with chronic long-term exposure to environmental air pollutants on the ocular structures currently defined as the ocular surface and to review clinical and laboratory tests used to investigate the adverse effects of air pollutants on such structures. We also review previous studies that investigated the adverse effects of air pollution on the ocular surface and discuss the need for further investigation on the subject.

  8. Comparison of lead and tin concentrations in air at a solder manufacturer from the closed-face 37-mm cassette with and without a custom cellulose-acetate cassette insert.

    PubMed

    Lee, Eun Gyung; Chisholm, William P; Burns, Dru A; Nelson, John H; Kashon, Michael L; Harper, Martin

    2014-01-01

    A polyvinyl chloride (PVC) cassette insert with PVC filter (ACCU-CAP) in a 37-mm closed-face cassette (CFC) was designed for gravimetric analysis. A customized version of the ACCU-CAP, also to be used in the CFC, was manufactured from an acid-digestible cellulose-acetate cassette insert joined to a mixed cellulose ester (MCE) filter for wet chemical analysis. The aim of this study was to compare metal particle concentrations as sampled by the customized insert (CI) in a CFC sampler with the traditional sampling method using only a MCE filter in the CFC. Thirty-nine personal and 13 area samples were taken using paired filter-based CFC and the CI in CFC samplers at a solder manufacturing plant. The CI was removed from its CFC, and digested and analyzed as a whole. The MCE filter from the typical CFC was removed for analysis and then the interior of the cassette was wiped with Ghost Wipe for a separate analysis. The MCE filter only, Ghost Wipe, and CI were separately dissolved in heated nitric acid for ICP-MS analysis. Overall, the geometric mean concentration of the filter-only (FO) samples was considerably lower than that of the CI samples, by 53% for lead and 32% for tin. However, if the FO analysis was added to the corresponding Ghost Wipe analysis, i.e., filter+interior wipe (FW), the geometric mean concentrations of the FW results were similar to those of the CI results (by 113% for lead and 98% for tin). For both lead and tin the comparison of (log-transformed) metal concentrations between the FW and CI results showed no statistically significant difference (p-value = 0.3009 for lead and 0.800 for tin), while the comparison between the FO and CI results shows statistically significant differences (all p-values < 0.05). In conclusion, incorporating the sampler internal non-filter deposits by wiping or use of an internal filter capsule gave higher results than analyzing only the filter. Close agreement between the two methods of including non-filter deposits is

  9. Comparison of Lead and Tin Concentrations in Air at a Solder Manufacturer from the Closed-Face 37-mm Cassette With and Without a Custom Cellulose-Acetate Cassette Insert

    PubMed Central

    Lee, Eun Gyung; Chisholm, William P.; Burns, Dru A.; Nelson, John H.; Kashon, Michael L.; Harper, Martin

    2015-01-01

    A polyvinyl chloride (PVC) cassette insert with PVC filter (ACCU-CAP) in a 37-mm closed-face cassette (CFC) was designed for gravimetric analysis. A customized version of the ACCU-CAP, also to be used in the CFC, was manufactured from an acid-digestible cellulose-acetate cassette insert joined to a mixed cellulose ester (MCE) filter for wet chemical analysis. The aim of this study was to compare metal particle concentrations as sampled by the customized insert (CI) in a CFC sampler with the traditional sampling method using only a MCE filter in the CFC. Thirty-nine personal and 13 area samples were taken using paired filter-based CFC and the CI in CFC samplers at a solder manufacturing plant. The CI was removed from its CFC, and digested and analyzed as a whole. The MCE filter from the typical CFC was removed for analysis and then the interior of the cassette was wiped with Ghost Wipe for a separate analysis. The MCE filter only, Ghost Wipe, and CI were separately dissolved in heated nitric acid for ICP-MS analysis. Overall, the geometric mean concentration of the filter-only (FO) samples was considerably lower than that of the CI samples, by 53% for lead and 32% for tin. However, if the FO analysis was added to the corresponding Ghost Wipe analysis, i.e., filter+interior wipe (FW), the geometric mean concentrations of the FW results were similar to those of the CI results (by 113% for lead and 98% for tin). For both lead and tin the comparison of (log-transformed) metal concentrations between the FW and CI results showed no statistically significant difference (p-value = 0.3009 for lead and 0.800 for tin), while the comparison between the FO and CI results shows statistically significant differences (all p-values < 0.05). In conclusion, incorporating the sampler internal non-filter deposits by wiping or use of an internal filter capsule gave higher results than analyzing only the filter. Close agreement between the two methods of including non-filter deposits is

  10. Comparison of lead and tin concentrations in air at a solder manufacturer from the closed-face 37-mm cassette with and without a custom cellulose-acetate cassette insert.

    PubMed

    Lee, Eun Gyung; Chisholm, William P; Burns, Dru A; Nelson, John H; Kashon, Michael L; Harper, Martin

    2014-01-01

    A polyvinyl chloride (PVC) cassette insert with PVC filter (ACCU-CAP) in a 37-mm closed-face cassette (CFC) was designed for gravimetric analysis. A customized version of the ACCU-CAP, also to be used in the CFC, was manufactured from an acid-digestible cellulose-acetate cassette insert joined to a mixed cellulose ester (MCE) filter for wet chemical analysis. The aim of this study was to compare metal particle concentrations as sampled by the customized insert (CI) in a CFC sampler with the traditional sampling method using only a MCE filter in the CFC. Thirty-nine personal and 13 area samples were taken using paired filter-based CFC and the CI in CFC samplers at a solder manufacturing plant. The CI was removed from its CFC, and digested and analyzed as a whole. The MCE filter from the typical CFC was removed for analysis and then the interior of the cassette was wiped with Ghost Wipe for a separate analysis. The MCE filter only, Ghost Wipe, and CI were separately dissolved in heated nitric acid for ICP-MS analysis. Overall, the geometric mean concentration of the filter-only (FO) samples was considerably lower than that of the CI samples, by 53% for lead and 32% for tin. However, if the FO analysis was added to the corresponding Ghost Wipe analysis, i.e., filter+interior wipe (FW), the geometric mean concentrations of the FW results were similar to those of the CI results (by 113% for lead and 98% for tin). For both lead and tin the comparison of (log-transformed) metal concentrations between the FW and CI results showed no statistically significant difference (p-value = 0.3009 for lead and 0.800 for tin), while the comparison between the FO and CI results shows statistically significant differences (all p-values < 0.05). In conclusion, incorporating the sampler internal non-filter deposits by wiping or use of an internal filter capsule gave higher results than analyzing only the filter. Close agreement between the two methods of including non-filter deposits is

  11. An objective definition of air mass types affecting Athens, Greece; the corresponding atmospheric pressure patterns and air pollution levels.

    PubMed

    Sindosi, O A; Katsoulis, B D; Bartzokas, A

    2003-08-01

    This work aims at defining characteristic air mass types that dominate in the region of Athens, Greece during the cold (November-March) and the warm (May-September) period of the year and also at evaluating the corresponding concentration levels of the main air pollutants. For each air mass type, the mean atmospheric pressure distribution (composite maps) over Europe and the Mediterranean is estimated in order to reveal the association of atmospheric circulation with air pollution levels in Athens. The data basis for this work consists of daily values of thirteen meteorological and six pollutant parameters covering the period 1993-97. The definition of the characteristic air mass types is attempted objectively by using the methods of Factor Analysis and Cluster Analysis. The results show that during the cold period of the year there are six prevailing air mass types (at least 3% of the total number of days) and six infrequent ones. The examination of the corresponding air pollution concentration levels shows that the primary air pollutants appear with increased concentrations when light or southerly winds prevail. This is usually the case when a high pressure system is located over the central Mediterranean or a low pressure system lays over south Italy, respectively. Low levels of the primary pollutants are recorded under northeasterly winds, mainly caused by a high pressure system over Ukraine. During the warm period of the year, the southwestern Asia thermal low and the subtropical anticyclone of the Atlantic Ocean affect Greece. Though these synoptic systems cause almost stagnant conditions, four main air mass types are dominant and ten others, associated with extreme weather, are infrequent. Despite the large amounts of total solar radiation characterizing this period, ozone concentrations remain at low levels in central Athens because of its destruction by nitric oxide.

  12. Sn-Ag-Cu Nanosolders: Solder Joints Integrity and Strength

    NASA Astrophysics Data System (ADS)

    Roshanghias, Ali; Khatibi, Golta; Yakymovych, Andriy; Bernardi, Johannes; Ipser, Herbert

    2016-08-01

    Although considerable research has been dedicated to the synthesis and characterization of lead-free nanoparticle solder alloys, only very little has been reported on the reliability of the respective joints. In fact, the merit of nanoparticle solders with depressed melting temperatures close to the Sn-Pb eutectic temperature has always been challenged when compared with conventional solder joints, especially in terms of inferior solderability due to the oxide shell commonly present on the nanoparticles, as well as due to compatibility problems with common fluxing agents. Correspondingly, in the current study, Sn-Ag-Cu (SAC) nanoparticle alloys were combined with a proper fluxing vehicle to produce prototype nanosolder pastes. The reliability of the solder joints was successively investigated by means of electron microscopy and mechanical tests. As a result, the optimized condition for employing nanoparticles as a competent nanopaste and a novel procedure for surface treatment of the SAC nanoparticles to diminish the oxide shell prior to soldering are being proposed.

  13. Investigation of Solder Cracking Problems on Printed Circuit Boards

    NASA Technical Reports Server (NTRS)

    Berkebile, M. J.

    1967-01-01

    A Solder Committee designated to investigate a solder cracking phenomena occurring on the SATURN electrical/electronic hardware found the cause to be induced stress in the soldered connections rather than faulty soldering techniques. The design of the printed circuit (PC) board assemblies did not allow for thermal expansion of the boards that occurred during normal operation. The difference between the thermal expansion properties of the boards and component lead materials caused stress and cracking in the soldered connections. The failure mechanism and various PC boards component mounting configurations are examined in this report. Effective rework techniques using flanged tubelets, copper tubelets, and soft copper wiring are detailed. Future design considerations to provide adequate strain relief in mounting configurations are included to ensure successful solder terminations.

  14. Optimal solder and power density for diode-laser tissue soldering (LTS)

    NASA Astrophysics Data System (ADS)

    Schwartz, Ian P.; Suh, Donald D.; Canning, Douglas A.; Snyder, Howard M., III; Zderic, Stephen A.; Kirsch, Andrew J.

    1998-07-01

    Purpose: The purpose of the study was to determine the optimal indocyanine green dye (ICG) concentration and laser power density (PD) for tissue soldering using an 808-nm diode laser. Methods: Temperature profiles in vitro and in vivo were obtained using the ICG/albumin solder. [ICG] ranged from 0.31 mg/mL to 20 mg/mL while PD ranged from 3.2 to 63.7 W/cm2. Solder color and textural changes were noted. Eighteen rats were subjected to 1.5 cm incisions (N equals 128) created on the dorsal skin followed by closure with LTS at varying PD and [ICG]. Tensile strength profiles using rat skin were taken immediately and 10 days postoperatively. Histological examination was performed at the time of sacrifice. Results: Temperature profiles of the ICG/albumin solder did not differ with varying [ICG], but showed statistically significant variability at different laser PD. Using solder color change as a subjective endpoint, average peak solder temperature ranged from 69 degrees Celsius at a PD of 8.0 W/cm2, 105 degrees Celsius to 120 degrees Celsius at PD 15.9 to 31.8 W/cm2, and greater than 200 degrees Celsius at PD greater than or equal to 47.7 W/cm2. Peak intradermal temperatures remained below 50 degrees Celsius at all PD. The broadest range of color change in the solder was observed at [ICG] of 2.5 mg/mL. Immediate tensile strength data showed a trend towards greater strength at higher [ICG]. The greatest immediate tensile strength was reached at a PD of greater than or equal to 31.8 W/cm2 for all [ICG]. At 10 days an inverse trend existed only between PD (not ICG) and tensile strength, however this was not statically significant. Histologic analysis showed poorer healing and thermal injury to tissue soldered at a PD greater than or equal to 23.9 W/cm2. Conclusions: Based on these findings, optimal laser tissue soldering occurs with an [ICG] of 2.5 mg/ml and a PD of 15.9 W/cm2.

  15. Particulate Matter Levels in Ambient Air Adjacent to Industrial Area

    NASA Astrophysics Data System (ADS)

    Mohamed, R. M. S. R.; Nizam, N. M. S.; Al-Gheethi, A. A.; Lajis, A.; Kassim, A. H. M.

    2016-07-01

    Air quality in the residential areas adjacent to the industrial regions is of great concern due to the association with human health risks. In this work, the concentrations of particulate matter (PM10) in the ambient air of UTHM campus was investigated tostudy the air qualityand their compliance to the Malaysian Ambient Air Quality Guidelines (AAQG). The PM10 samples were taken over 24 hours from the most significant area at UTHM including Stadium, KolejKediamanTunDr. Ismail (KKTDI) and MakmalBahan. The meteorological parameters; temperature, relative humidity, wind speed and wind direction as well as particulate matterwere estimated by using E-Sampler Particulate Matter (PM10) Collector. The highest concentrations of PM10 (55.56 µg/m3) was recorded at MakmalBahan during the working and weekend days. However, these concentrations are less than 150 pg/m3. It can be concluded that although UTHM is surrounded by the industrial area, the air quality in the campus still within the standards limits.

  16. Solder Creep-Fatigue Interactions with Flexible Leaded Part

    NASA Technical Reports Server (NTRS)

    Ross, R. G., Jr.; Wen, L. C.

    1994-01-01

    In most electronic packaging applications it is not a single high stress event that breaks a component solder joint; rather it is repeated or prolonged load applications that result in fatigue or creep failure of the solder. The principal strain in solder joints is caused by differential expansion between the part and its mounting environment due to hanges in temperature (thermal cycles) and/or due to temperature gradients between the part and the board.

  17. Capillary flow solderability test for printed wiring boards

    SciTech Connect

    Hosking, F.M.; Yost, F.G.; Hernandez, C.L.; Sackinger, S.J.

    1994-04-01

    This report describes a new technique for evaluating capillary flow solderability on printed circuit boards. The test involves the flow of molten solder from a pad onto different-sized conductor lines. It simulates the spreading dynamics of either plated-through-hole (PTH) or surface mount technology (SMT) soldering. A standard procedure has been developed for the test. Preliminary experiments were conducted and the results demonstrate test feasibility. Test procedures and results are presented in this report.

  18. Anomalous creep in Sn-rich solder joints

    SciTech Connect

    Song, Ho Geon; Morris Jr., John W.; Hua, Fay

    2002-03-15

    This paper discusses the creep behavior of example Sn-rich solders that have become candidates for use in Pb-free solder joints. The specific solders discussed are Sn-3.5Ag, Sn-3Ag-0.5Cu, Sn-0.7Cu and Sn-10In-3.1Ag, used in thin joints between Cu and Ni-Au metallized pads.

  19. Microstructural evolution during the thermomechanical fatigue of solder joints

    SciTech Connect

    Frear, D R

    1991-01-01

    Solder joints in electronic packages are electrical interconnections that also function as mechanical bonds. The solder often constrains materials of different coefficients of thermal expansion that, when thermal fluctuations are encountered, causes the solder joint to experience cyclical deformation. Due to the catastrophic consequences of electrical or mechanical failure of solder joints, a great deal of work has been performed to develop a better understanding of the metallurgical response of solder joints subjected to thermomechanical fatigue. This work reviews the microstructural and mechanical evolution that occurs in solder joints during thermomechanical fatigue. The eutectic Sn-Pb solder alloy is highlighted. Unlike most materials that experience thermomechanical fatigue, solder is commonly used at temperatures of up to nine-tenths of its melting point. Therefore extensive creep, solid state diffusion, recrystallization and grain growth occur in this alloy resulting in the evolution of a heterogeneous coarsened band through which failure eventually takes place. Two other solder alloys are compared with the Sn-Pb eutectic, a Pb-rich Sn-Pb alloy and a ternary near eutectic (40In-40Sn-20Pb, all alloys are given in wt. %). The Pb-rich alloy is a precipitated single phase matrix that does not evolve during thermomechanical fatigue and subsequently has a shorter lifetime. Conversely, the 40In-40Sn-20Pb solder is a two phase eutectic in which the microstructures refines during thermomechanical fatigue giving it a longer lifetime than the eutectic Sn-Pb solder. The microstructural processes that occur during thermomechanical fatigue and final fracture behavior are discussed for the three solder alloys. 47 refs., 14 figs.

  20. Air

    MedlinePlus

    ... do to protect yourself from dirty air . Indoor air pollution and outdoor air pollution Air can be polluted indoors and it can ... this chart to see what things cause indoor air pollution and what things cause outdoor air pollution! Indoor ...

  1. Coarsening of the Sn-Pb Solder Microstructure in Constitutive Model-Based Predictions of Solder Joint Thermal Mechanical Fatigue

    SciTech Connect

    Vianco, P.T.; Burchett, S.N.; Neilsen, M.K.; Rejent, J.A.; Frear, D.R.

    1999-04-12

    Thermal mechanical fatigue (TMF) is an important damage mechanism for solder joints exposed to cyclic temperature environments. Predicting the service reliability of solder joints exposed to such conditions requires two knowledge bases: first, the extent of fatigue damage incurred by the solder microstructure leading up to fatigue crack initiation, must be quantified in both time and space domains. Secondly, fatigue crack initiation and growth must be predicted since this metric determines, explicitly, the loss of solder joint functionality as it pertains to its mechanical fastening as well as electrical continuity roles. This paper will describe recent progress in a research effort to establish a microstructurally-based, constitutive model that predicts TMF deformation to 63Sn-37Pb solder in electronic solder joints up to the crack initiation step. The model is implemented using a finite element setting; therefore, the effects of both global and local thermal expansion mismatch conditions in the joint that would arise from temperature cycling.

  2. Solderability preservation through the use of organic inhibitors

    SciTech Connect

    Sorensen, N.R.; Hosking, F.M.

    1994-12-01

    Organic inhibitors can be used to prevent corrosion of metals and have application in the electronics industry as solderability preservatives. We have developed a model to describe the action of two inhibitors (benzotriazole and imidazole) during the environmental aging and soldering process. The inhibitors bond with the metal surface and form a barrier that prevents or retards oxidation. At soldering temperatures, the metal-organic complex breaks down leaving an oxide-free metal surface that allows excellent wetting by molten solder. The presence of the inhibitor retards the wetting rate relative to clean copper, but provides a vast improvement relative to oxidized copper.

  3. Aging, stressing and solderability of electroplated and electroless copper

    SciTech Connect

    Sorensen, N.R.; Hosking, F.M.

    1995-08-01

    Organic inhibitors can be used to prevent corrosion of metals have application in the electronics industry as solderability preservatives. We have developed a model to describe the action of two inhibitors (benzotriazole and imidazole) during the environmental aging and soldering process. The inhibitors bond with the metal surface and form a barrier that prevents or retards oxidation. At soldering temperatures, the metal-organic complex breaks down leaving an oxide-free metal surface that allows excellent wetting by the molten solder. The presence of the inhibitor retards the wetting rate relative to clean copper but provides a vast improvement relative to oxidized copper.

  4. Study of heating capacity of focused IR light soldering systems.

    PubMed

    Anguiano, C; Félix, M; Medel, A; Bravo, M; Salazar, D; Márquez, H

    2013-10-01

    An experimental study about four optical setups used for developing a Focused IR Light Soldering System (FILSS) for Surface Mount Technology (SMT) lead-free electronic devices specifically for Ball Grid Arrays (BGA) is presented. An analysis of irradiance and infrared thermography at BGA surface is presented, as well as heat transfer by radiation and conduction process from the surface of the BGA to the solder balls. The results of this work show that the heating provided by our proposed optical setups, measured at the BGA under soldering process, meets the high temperature and uniform thermal distribution requirements, which are defined by the reflow solder method for SMT devices. PMID:24104296

  5. High temperature solder alloys for underhood applications: Final report

    SciTech Connect

    Kern, J.A.; Drewien, C.A.; Yost, F.G.; Sackinger, S.; Weiser, M.W.

    1996-06-01

    In this continued study, the microstructural evolution and peel strength as a function of thermal aging were evaluated for four Sn-Ag solders deposited on double layered Ag-Pt metallization. Additionally, activation energies for intermetallic growth over the temperature range of 134 to 190{degrees}C were obtained through thickness measurements of the Ag-Sn intermetallic that formed at the solder-metallization interface. It was found that Bi-containing solders yielded higher activation energies for the intermetallic growth, leading to thicker intermetallic layers at 175 and 190{degrees}C for times of 542 and 20.5 hrs, respectively, than the solders free of Bi. Complete reaction of the solder with the metallization occurred and lower peel strengths were measured on the Bi-containing solders. In all solder systems, a Ag-Sn intermetallic thickness of greater than {approximately}7 {mu}m contributed to lower peel strength values. The Ag-Sn binary eutectic composition and the Ag-Sn-Cu ternary eutectic composition solders yielded lower activation energies for intermetallic formation, less microstructural change with time, and higher peel strengths; these solder systems were resilient to the effects of temperatures up to 175{degrees}C. Accelerated isothermal aging studies provide useful criteria for recommendation of materials systems. The Sn-Ag and Sn-Ag-Cu eutectic compositions should be considered for future service life and reliability studies based upon their performance in this study.

  6. MEASUREMENT OF LOW LEVEL AIR TOXICS WITH MODIFIED UV DOAS

    EPA Science Inventory

    To further understand near source impacts, EPA is working to develop open-path optical techniques for spatiotemporal-resolved measurement of air pollutants. Of particular interest is near real time quantification of mobile-source generated CO, Nox and hydrocarbons measured in cl...

  7. Shaping Transistor Leads for Better Solder Joints

    NASA Technical Reports Server (NTRS)

    Mandel, H.; Dillon, J. D.

    1982-01-01

    Special lead-forming tool puts step in leads of microwave power transistors without damaging braze joints that fasten leads to package. Stepped leads are soldered to circuit boards more reliably than straight leads, and stress on brazes is relieved. Lead-forming hand-tool has two parts: a forming die and an actuator. Spring-loaded saddle is adjusted so that when transistor package is placed on it, leads rest on forming rails.

  8. Sn-Ag-Cu solders and solder joints: Alloy development, microstructure, and properties

    NASA Astrophysics Data System (ADS)

    Anderson, I. E.; Cook, B. A.; Harringa, J. L.; Terpstra, R. L.

    2002-06-01

    Slow cooling of Sn-Ag-Cu and Sn-Ag-Cu-X (X = Fe, Co) solder-joint specimens made by hand soldering simulated reflow in surface-mount assembly to achieve similar as-solidified joint microstructures for realistic shearstrength testing, using Sn-3.5Ag (wt.%) as a baseline. Minor substitutions of either cobalt or iron for copper in Sn-3.7Ag-0.9Cu refined the joint matrix microstructure, modified the Cu6Sn5 intermetallic phase at the copper substrate/solder interface, and increased the shear strength. At elevated (150°C) temperature, no significant difference in shear strength was found in all of the alloys studied. Ambient temperature shear strength was reduced by largescale tin dendrites in the joint microstructure, especially by the coarse dendrites in solute poor Sn-Ag-Cu.

  9. Simulation of forced convection-infrared reflow soldering with nitrogen injection

    SciTech Connect

    Son, Y.S.; Bergman, T.L.; Hyun, M.T.

    1995-12-31

    In this paper, forced convection reflow soldering is simulated using an existing numerical model which accounts for multimode effects and is capable of predicting large and small scale thermal and species concentration phenomena. Soldering is performed in an oven equipped with porous panel heaters through which air or nitrogen is introduced to the reflow environment. The gas is injected selectively through top or bottom infrared heaters in order to (1) dampen gas temperature fluctuations which can be established by thermal buoyancy forces and (2) minimize nitrogen use. The results reveal the utility of general process models of the reflow operation as applied to oven design. The effects of mixed convection on heat and gas species transport in the oven are also revealed, and the potential impact on the solidification process is discussed.

  10. Growth Behavior of Intermetallic Compounds in Cu/Sn3.0Ag0.5Cu Solder Joints with Different Rates of Cooling

    NASA Astrophysics Data System (ADS)

    Yang, Linmei; Zhang, Z. F.

    2015-01-01

    The growth behavior of intermetallic compounds (IMC) in Cu/Sn3.0Ag0.5Cu solder joints, including the interfacial Cu6Sn5 layer and Ag3Sn, and Cu6Sn5 in the solder, were investigated when different cooling methods—quenched water, cooling in air, and cooling in a furnace after reflow—were used. For the solder joint quenched in water, no obvious Cu6Sn5 or Ag3Sn was detected in the solder, and the thickness of interfacial Cu6Sn5 layer was slightly thinner than that of the joint cooled in air. On the basis of results from scanning electron microscopy and energy-dispersive spectrometry, a mechanism is proposed for growth of IMC in Sn3.0Ag0.5Cu solder during solidification. The rate of cooling has a substantial effect on the morphology and size of Ag3Sn, which evolved into large plate-like shapes when the joint was cooled slowly in a furnace. However, the morphology of Ag3Sn was branch-like or particle-like when the joint was cooled in air. This is attributed to re-growth of Ag3Sn grains via substantial atomic diffusion during the high-temperature stage of furnace cooling.

  11. 14 CFR 325.10 - Modification of the designated level of essential air service.

    Code of Federal Regulations, 2010 CFR

    2010-01-01

    ... 14 Aeronautics and Space 4 2010-01-01 2010-01-01 false Modification of the designated level of essential air service. 325.10 Section 325.10 Aeronautics and Space OFFICE OF THE SECRETARY, DEPARTMENT OF TRANSPORTATION (AVIATION PROCEEDINGS) PROCEDURAL REGULATIONS ESSENTIAL AIR SERVICE PROCEDURES § 325.10 Modification of the designated level...

  12. 42 CFR 84.1139 - Air velocity and noise levels; hoods and helmets; minimum requirements.

    Code of Federal Regulations, 2013 CFR

    2013-10-01

    ... 42 Public Health 1 2013-10-01 2013-10-01 false Air velocity and noise levels; hoods and helmets; minimum requirements. 84.1139 Section 84.1139 Public Health PUBLIC HEALTH SERVICE, DEPARTMENT OF HEALTH... Efficiency Respirators and Combination Gas Masks § 84.1139 Air velocity and noise levels; hoods and...

  13. 42 CFR 84.202 - Air velocity and noise levels; hoods and helmets; minimum requirements.

    Code of Federal Regulations, 2014 CFR

    2014-10-01

    ... 42 Public Health 1 2014-10-01 2014-10-01 false Air velocity and noise levels; hoods and helmets; minimum requirements. 84.202 Section 84.202 Public Health PUBLIC HEALTH SERVICE, DEPARTMENT OF HEALTH AND... PROTECTIVE DEVICES Chemical Cartridge Respirators § 84.202 Air velocity and noise levels; hoods and...

  14. 42 CFR 84.1139 - Air velocity and noise levels; hoods and helmets; minimum requirements.

    Code of Federal Regulations, 2011 CFR

    2011-10-01

    ... 42 Public Health 1 2011-10-01 2011-10-01 false Air velocity and noise levels; hoods and helmets; minimum requirements. 84.1139 Section 84.1139 Public Health PUBLIC HEALTH SERVICE, DEPARTMENT OF HEALTH... Efficiency Respirators and Combination Gas Masks § 84.1139 Air velocity and noise levels; hoods and...

  15. 42 CFR 84.202 - Air velocity and noise levels; hoods and helmets; minimum requirements.

    Code of Federal Regulations, 2013 CFR

    2013-10-01

    ... 42 Public Health 1 2013-10-01 2013-10-01 false Air velocity and noise levels; hoods and helmets; minimum requirements. 84.202 Section 84.202 Public Health PUBLIC HEALTH SERVICE, DEPARTMENT OF HEALTH AND... PROTECTIVE DEVICES Chemical Cartridge Respirators § 84.202 Air velocity and noise levels; hoods and...

  16. 42 CFR 84.1139 - Air velocity and noise levels; hoods and helmets; minimum requirements.

    Code of Federal Regulations, 2010 CFR

    2010-10-01

    ... 42 Public Health 1 2010-10-01 2010-10-01 false Air velocity and noise levels; hoods and helmets; minimum requirements. 84.1139 Section 84.1139 Public Health PUBLIC HEALTH SERVICE, DEPARTMENT OF HEALTH... Efficiency Respirators and Combination Gas Masks § 84.1139 Air velocity and noise levels; hoods and...

  17. 42 CFR 84.1139 - Air velocity and noise levels; hoods and helmets; minimum requirements.

    Code of Federal Regulations, 2014 CFR

    2014-10-01

    ... 42 Public Health 1 2014-10-01 2014-10-01 false Air velocity and noise levels; hoods and helmets; minimum requirements. 84.1139 Section 84.1139 Public Health PUBLIC HEALTH SERVICE, DEPARTMENT OF HEALTH... Efficiency Respirators and Combination Gas Masks § 84.1139 Air velocity and noise levels; hoods and...

  18. 42 CFR 84.202 - Air velocity and noise levels; hoods and helmets; minimum requirements.

    Code of Federal Regulations, 2011 CFR

    2011-10-01

    ... 42 Public Health 1 2011-10-01 2011-10-01 false Air velocity and noise levels; hoods and helmets; minimum requirements. 84.202 Section 84.202 Public Health PUBLIC HEALTH SERVICE, DEPARTMENT OF HEALTH AND... PROTECTIVE DEVICES Chemical Cartridge Respirators § 84.202 Air velocity and noise levels; hoods and...

  19. 42 CFR 84.1139 - Air velocity and noise levels; hoods and helmets; minimum requirements.

    Code of Federal Regulations, 2012 CFR

    2012-10-01

    ... 42 Public Health 1 2012-10-01 2012-10-01 false Air velocity and noise levels; hoods and helmets; minimum requirements. 84.1139 Section 84.1139 Public Health PUBLIC HEALTH SERVICE, DEPARTMENT OF HEALTH... Efficiency Respirators and Combination Gas Masks § 84.1139 Air velocity and noise levels; hoods and...

  20. 42 CFR 84.202 - Air velocity and noise levels; hoods and helmets; minimum requirements.

    Code of Federal Regulations, 2010 CFR

    2010-10-01

    ... 42 Public Health 1 2010-10-01 2010-10-01 false Air velocity and noise levels; hoods and helmets; minimum requirements. 84.202 Section 84.202 Public Health PUBLIC HEALTH SERVICE, DEPARTMENT OF HEALTH AND... PROTECTIVE DEVICES Chemical Cartridge Respirators § 84.202 Air velocity and noise levels; hoods and...

  1. 42 CFR 84.202 - Air velocity and noise levels; hoods and helmets; minimum requirements.

    Code of Federal Regulations, 2012 CFR

    2012-10-01

    ... 42 Public Health 1 2012-10-01 2012-10-01 false Air velocity and noise levels; hoods and helmets; minimum requirements. 84.202 Section 84.202 Public Health PUBLIC HEALTH SERVICE, DEPARTMENT OF HEALTH AND... PROTECTIVE DEVICES Chemical Cartridge Respirators § 84.202 Air velocity and noise levels; hoods and...

  2. RELATIONSHIPS BETWEEN LEVELS OF VOLATILE ORGANIC COMPOUNDS IN AIR AND BLOOD FROM THE GENERAL POPULATION

    EPA Science Inventory

    Background: The relationships between levels of volatile organic compounds (VOCs) in blood and air have not been well characterized in the general population where exposure concentrations are generally at ppb levels. Objectives: This study investigates relationships between ...

  3. Solder joint reliability in alternator power diode assemblies

    SciTech Connect

    Pan, T.Y.; White, S.C.; Lutz, E.L.; Blair, H.D.; Nicholson, J.M.

    1999-11-01

    Power diodes in an alternator convert alternating current, generated by the spinning magnetic field, to direct current to be used by the battery and all the automotive electrical/electronic components. The diodes are press-fit into aluminum heatsinks to quickly and efficiently dissipate the heat from the silicon dies in the diode body. The diodes are soldered to a rectifier circuit board through the diode leads by a wave soldering process using a Pb-free, eutectic Sn-3.5Ag solder. A set of positive diodes reside on a different substrate than the set of negative diodes, resulting in differences in the lengths of the diode leads. The distance from the diode body to the solder joint on the leads of the positive diodes is 7 mm less than those of the negative diodes. Solderability, cross-section micrographs, and thermal-cycling fatigue reliability studies were compared between the positive and negative diodes and between diode designs from different suppliers. Wetting balance testing showed significant differences in solderability between positive and negative diodes and between the two different diode designs. Combining the diode body and lead together had a more drastic effect on the solderability than the lead alone. It was discovered that, although the nature of the diode design is to dissipate the heat away from the diode quickly and efficiently, there is a large temperature gradient along the lead immediately above the solder bath which can be as much as 100 C just 2 mm from the bath. This large temperature gradient caused some leads to be too cold to form good solder fillets. The solder fillets obtained in the laboratory wetting tests matched those observed in the actual alternators. The inadequate solder fillets resulted in a 250% difference in the thermal cycling fatigue reliability between the two diode designs.

  4. Development of Level 3 (gridded) products for the Atmospheric Infrared Sounder (AIRS)

    NASA Technical Reports Server (NTRS)

    Granger, Stephanie L.; Leroy, Stephen S.; Manning, Evan M.; Fetzer, Eric J.; Oliphant, Robert B.; Braverman, Amy; Lee, Sung-Yung; Lambrigtsen, Bjom H.

    2004-01-01

    The Atmospheric Infrared Sounder (AIRS) sounding system is a suite of infrared and microwave instruments flown as part of NASA's Earth Observing System (EOS) onboard the Aqua platform. The AIRS dataset provides a daily, global view of Earth processes at a finer vertical resolution than ever before. However, analysis of the AIRS data is a daunting task given the sheer volume and complexity of the data. The volume of data produced by the EOS project is unprecedented; the AIRS project alone will produce many terabytes of data over the lifetime of the mission. This paper describes development of AIRS Level 3 data products that will help to alleviate problems of access and usability.

  5. Ground level air convection produces frost damage patterns in turfgrass.

    PubMed

    Ackerson, Bruce J; Beier, Richard A; Martin, Dennis L

    2015-11-01

    Frost injury patterns are commonly observed on the warm-season turfgrass species bermudagrass (Cynodon species Rich.), zoysiagrass (Zoysia species Willd.), and buffalograss [Bouteloua dactyloides (Nutt.) J.T. Columbus] in cool-temperate and subtropical zones. Qualitative observations of these injury patterns are presented and discussed. A model for the formation of such patterns based on thermal instability and convection of air is presented. The characteristic length scale of the observed frost pattern injury requires a temperature profile that decreases with height from the soil to the turfgrass canopy surface followed by an increase in temperature with height above the turfgrass canopy. This is justified by extending the earth temperature theory to include a turf layer with atmosphere above it. Then the theory for a thermally unstable layer beneath a stable region by Ogura and Kondo is adapted to a turf layer to include different parameter values for pure air, as well as for turf, which is treated as a porous medium. The earlier porous medium model of Thompson and Daniels proposed to explain frost injury patterns is modified to give reasonable agreement with observed patterns. PMID:25796203

  6. Ground level air convection produces frost damage patterns in turfgrass.

    PubMed

    Ackerson, Bruce J; Beier, Richard A; Martin, Dennis L

    2015-11-01

    Frost injury patterns are commonly observed on the warm-season turfgrass species bermudagrass (Cynodon species Rich.), zoysiagrass (Zoysia species Willd.), and buffalograss [Bouteloua dactyloides (Nutt.) J.T. Columbus] in cool-temperate and subtropical zones. Qualitative observations of these injury patterns are presented and discussed. A model for the formation of such patterns based on thermal instability and convection of air is presented. The characteristic length scale of the observed frost pattern injury requires a temperature profile that decreases with height from the soil to the turfgrass canopy surface followed by an increase in temperature with height above the turfgrass canopy. This is justified by extending the earth temperature theory to include a turf layer with atmosphere above it. Then the theory for a thermally unstable layer beneath a stable region by Ogura and Kondo is adapted to a turf layer to include different parameter values for pure air, as well as for turf, which is treated as a porous medium. The earlier porous medium model of Thompson and Daniels proposed to explain frost injury patterns is modified to give reasonable agreement with observed patterns.

  7. Ground level air convection produces frost damage patterns in turfgrass

    NASA Astrophysics Data System (ADS)

    Ackerson, Bruce J.; Beier, Richard A.; Martin, Dennis L.

    2015-11-01

    Frost injury patterns are commonly observed on the warm-season turfgrass species bermudagrass ( Cynodon species Rich.), zoysiagrass ( Zoysia species Willd.), and buffalograss [ Bouteloua dactyloides (Nutt.) J.T. Columbus] in cool-temperate and subtropical zones. Qualitative observations of these injury patterns are presented and discussed. A model for the formation of such patterns based on thermal instability and convection of air is presented. The characteristic length scale of the observed frost pattern injury requires a temperature profile that decreases with height from the soil to the turfgrass canopy surface followed by an increase in temperature with height above the turfgrass canopy. This is justified by extending the earth temperature theory to include a turf layer with atmosphere above it. Then the theory for a thermally unstable layer beneath a stable region by Ogura and Kondo is adapted to a turf layer to include different parameter values for pure air, as well as for turf, which is treated as a porous medium. The earlier porous medium model of Thompson and Daniels proposed to explain frost injury patterns is modified to give reasonable agreement with observed patterns.

  8. Characterization of Solder Joint Reliability Using Cyclic Mechanical Fatigue Testing

    NASA Astrophysics Data System (ADS)

    Kim, Choong-Un; Bang, Woong-Ho; Xu, Huili; Lee, Tae-Kyu

    2013-10-01

    This article summarizes the mechanics of two mechanical fatigue methods, cyclic bending fatigue and shear fatigue, in inducing failure in solder joints in package assemblies, and it presents the characteristics of fatigue failures resulting from these methods using example cases of Sn-Pb eutectic and Sn-rich Pb-free solder alloys. Numerical simulation suggests that both testing configurations induce fatigue failure by the crack-opening mode. In the case of bending fatigue, the strain induced by the bending displacement is found to be sensitive to chip geometry, and it induces fatigue cracks mainly at the solder matrix adjacent to the printed circuit board interface. In case of shear fatigue, the failure location is firmly fixed at the solder neck, created by solder mask, where an abrupt change in the solder geometry occurs. Both methods conclude that the Coffin-Manson model is the most appropriate model for the isothermal mechanical fatigue of solder alloys. An analysis of fatigue characteristics using the frame of the Coffin-Manson model produces several insightful results, such as the reason why Pb-free alloys show higher fatigue resistance than Sn-Pb alloys even if they are generally more brittle. Our analysis suggests that it is related to higher work hardening. All these results indicate that mechanical fatigue can be an extremely useful method for fast screening of defective package structures and also in gaining a better understanding of fatigue failure mechanism and prediction of reliability in solder joints.

  9. Modified soldering iron speeds cutting of synthetic materials

    NASA Technical Reports Server (NTRS)

    Schafer, W. G., Jr.

    1966-01-01

    Modified soldering iron cuts large lots of synthetic materials economically without leaving frayed or jagged edges. The soldering iron is modified by machining an axial slot in its heating element tip and mounting a cutting disk in it. An alternate design has an axially threaded bore in the tip to permit the use of various shapes of cutting blades.

  10. Low-temperature solder for laser tissue welding

    NASA Astrophysics Data System (ADS)

    Lauto, Antonio; Stewart, Robert B.; Felsen, D.; Foster, John; Poole-Warren, Laura; Poppas, Dix P.

    2003-12-01

    In this study, a two layer (TL) solid solder was developed with a fixed thickness to minimize the difference in temperature across the solder (ΔT) and to weld at low temperature. Solder strips comprising two layers (65% albumin, 35% water) were welded onto rectangular sections of dog small intestine by a diode laser (λ = 808 nm). The laser delivered a power of 170 +/- 10 mW through an optical fiber (spot size approximately 1 mm) for 100 seconds. A solder layer incorporated also a dye (carbon black, 0.25%) to absorb the laser radiation. A thermocouple and an infrared thermometer system recorded the temperatures at the tissue interface and at the external solder surface, during welding. The repaired tissue was tested for tensile strength by a calibrated tensiometer. The TL strips were able to minimize ΔT (12 +/- 4°C) and control the temperature at tissue-interface. The strips fused on tissue at 55<=T<=62°C had higher tensile strength than the strips soldered at 51<=T<55°C (19.1 +/- 6.6 versus 13.1 +/- 6.4 gmf). The solid solder could efficiently weld at 60°C as it became insoluble and formed stable bonds with tissue. Fluid albumin solders, by contrast, requires temperatures >=70°C for tissue repair, which cause more irreversible thermal damage.

  11. Laser-activated protein solder for peripheral nerve repair

    NASA Astrophysics Data System (ADS)

    Trickett, Rodney I.; Lauto, Antonio; Dawes, Judith M.; Owen, Earl R.

    1995-05-01

    A 100 micrometers core optical fiber-coupled 75 mW diode laser operating at a wavelength of 800 nm has been used in conjunction with a protein solder to stripe weld severed rat tibial nerves, reducing the long operating time required for microsurgical nerve repair. Welding is produced by selective laser denaturation of the albumin based solder which contains the dye indocyanine green. Operating time for laser soldering was 10 +/- 5 min. (n equals 20) compared to 23 +/- 9 min. (n equals 10) for microsuturing. The laser solder technique resulted in patent welds with a tensile strength of 15 +/- 5 g, while microsutured nerves had a tensile strength of 40 +/- 10 g. Histopathology of the laser soldered nerves, conducted immediately after surgery, displayed solder adhesion to the outer membrane with minimal damage to the inner axons of the nerves. An in vivo study is under way comparing laser solder repaired tibial nerves to conventional microsuture repair. At the time of submission 15 laser soldered nerves and 7 sutured nerves were characterized at 3 months and showed successful regeneration with compound muscle action potentials of 27 +/- 8 mV and 29 +/- 8 mW respectively. A faster, less damaging and long lasting laser based anastomotic technique is presented.

  12. [Influence of atmospheric transport on air pollutant levels at a mountain background site of East China].

    PubMed

    Su, Bin-Bin; Xu, Ju-Yang; Zhang, Ruo-Yu; Ji, Xian-Xin

    2014-08-01

    Transport characteristics of air pollutants transported to the background atmosphere of East China were investigated using HYSPLIT (Hybrid Single Particle Lagrangian Integrated Trajectory) 4.8 model driven by NCEP reanalysis data during June 2011 to May 2012. Based on the air pollutants monitoring data collected at the National atmospheric background monitoring station (Wuyishan station) in Fujian Province, characteristics of different clustered air masses as well as the origins of highly polluted air masses were further examined. The results showed that 65% of all the trajectories, in which air masses mainly passed over highly polluted area of East China, Jiangxi province and upper air in desert areas of Northwest China, carried polluted air to the station, while the rest of trajectories (35%) with air masses originated from ocean could effectively remove air pollutants at the Wuyishan station. However, the impact on the air pollutants for each air mass group varied with seasons. Elevated SO2 concentrations observed at the background station were mainly influenced by coal burning activities in Northern China during heating season. The high CO concentrations were likely associated with the pollutants emission in the process of coal production and consumption in Anhui province. The elevated NO(x), O3, PM10 and PM2.5 concentrations were mostly impacted by East China with high levels of air pollutants.

  13. Cost comparison modeling between current solder sphere attachment technology and solder jetting technology

    SciTech Connect

    Davidson, R.N.

    1996-10-01

    By predicting the total life-cycle cost of owning and operating production equipment, it becomes possible for processors to make accurate and intelligent decisions regarding major capitol equipment investments as well as determining the most cost effective manufacturing processes and environments. Cost of Ownership (COO) is a decision making technique based on inputting the total costs of acquiring, operating and maintaining production equipment. All quantitative economic and production data can be modeled and processed using COO software programs such as the Cost of Ownership Luminator program TWO COOL{trademark}. This report investigated the Cost of Ownership differences between the current state-of-the-art solder ball attachment process and a prototype solder jetting process developed by Sandia National Laboratories. The prototype jetting process is a novel and unique approach to address the anticipated high rate ball grid array (BGA) production requirements currently forecasted for the next decade. The jetting process, which is both economically and environmentally attractive eliminates the solder sphere fabrication step, the solder flux application step as well as the furnace reflow and post cleaning operations.

  14. Tin-silver-bismuth solders for electronics assembly

    DOEpatents

    Vianco, Paul T.; Rejent, Jerome A.

    1995-01-01

    A lead-free solder alloy for electronic assemblies composed of a eutectic alloy of tin and silver with a bismuth addition, x, of 0level. Melting point ranges from about 218.degree. C. down to about 205.degree. C. depending an the amount of bismuth added to the eutectic tin-silver alloy as determined by DSC analysis, 10.degree. C./min. A preferred alloy composition is 91.84Sn-3.33Ag-4.83Bi (weight percent based on total alloy weight).

  15. Tin-silver-bismuth solders for electronics assembly

    DOEpatents

    Vianco, P.T.; Rejent, J.A.

    1995-08-08

    A lead-free solder alloy is disclosed for electronic assemblies composed of a eutectic alloy of tin and silver with a bismuth addition, x, of 0level. Melting point ranges from about 218 C down to about 205 C depending an the amount of bismuth added to the eutectic tin-silver alloy as determined by DSC analysis, 10 C/min. A preferred alloy composition is 91.84Sn-3.33Ag-4.83Bi (weight percent based on total alloy weight). 4 figs.

  16. Dry soldering with hot filament produced atomic hydrogen

    DOEpatents

    Panitz, J.K.G.; Jellison, J.L.; Staley, D.J.

    1995-04-25

    A system is disclosed for chemically transforming metal surface oxides to metal that is especially, but not exclusively, suitable for preparing metal surfaces for dry soldering and solder reflow processes. The system employs one or more hot, refractory metal filaments, grids or surfaces to thermally dissociate molecular species in a low pressure of working gas such as a hydrogen-containing gas to produce reactive species in a reactive plasma that can chemically reduce metal oxides and form volatile compounds that are removed in the working gas flow. Dry soldering and solder reflow processes are especially applicable to the manufacture of printed circuit boards, semiconductor chip lead attachment and packaging multichip modules. The system can be retrofitted onto existing metal treatment ovens, furnaces, welding systems and wave soldering system designs. 1 fig.

  17. Dry soldering with hot filament produced atomic hydrogen

    DOEpatents

    Panitz, Janda K. G.; Jellison, James L.; Staley, David J.

    1995-01-01

    A system for chemically transforming metal surface oxides to metal that is especially, but not exclusively, suitable for preparing metal surfaces for dry soldering and solder reflow processes. The system employs one or more hot, refractory metal filaments, grids or surfaces to thermally dissociate molecular species in a low pressure of working gas such as a hydrogen-containing gas to produce reactive species in a reactive plasma that can chemically reduce metal oxides and form volatile compounds that are removed in the working gas flow. Dry soldering and solder reflow processes are especially applicable to the manufacture of printed circuit boards, semiconductor chip lead attachment and packaging multichip modules. The system can be retrofitted onto existing metal treatment ovens, furnaces, welding systems and wave soldering system designs.

  18. Hybrid microcircuit board assembly with lead-free solders

    SciTech Connect

    Vianco, P.T.; Hernandez, C.L.; Rejent, J.A.

    2000-01-11

    An assessment was made of the manufacturability of hybrid microcircuit test vehicles assembled using three Pb-free solder compositions 96.5Sn--3.5Ag (wt.%), 91.84Sn--3.33Ag--4.83Bi, and 86.85Sn--3.15Ag--5.0Bi--5.0Au. The test vehicle substrate was 96% alumina; the thick film conductor composition was 76Au--21Pt--3Pd. Excellent registration between the LCCC or chip capacitor packages and the thick film solder pads was observed. Reduced wetting of bare (Au-coated) LCCC castellations was eliminated by hot solder dipping the I/Os prior to assembly of the circuit card. The Pb-free solders were slightly more susceptible to void formation, but not to a degree that would significantly impact joint functionality. Microstructural damage, while noted in the Sn-Pb solder joints, was not observed in the Pb-free interconnects.

  19. A Study of Solder Alloy Ductility for Cryogenic Applications

    NASA Technical Reports Server (NTRS)

    Lupinacci, A.; Shapiro, A. A.; Suh, J-O.; Minor, A. M.

    2013-01-01

    For aerospace applications it is important to understand the mechanical performance of components at the extreme temperature conditions seen in service. For solder alloys used in microelectronics, cryogenic temperatures can prove problematic. At low temperatures Sn-based solders undergo a ductile to brittle transition that leads to brittle cracks, which can result in catastrophic failure of electronic components, assemblies and spacecraft payloads. As industrial processes begin to move away from Pb-Sn solder, it is even more critical to characterize the behavior of alternative Sn-based solders. Here we report on initial investigations using a modified Charpy test apparatus to characterize the ductile to brittle transformation temperature of nine different solder systems.

  20. The influence of microstructure on the mechanical properties of solder

    SciTech Connect

    Morris, J.W. Jr.; Reynolds, H.L.

    1996-06-01

    Solder joints in microelectronics devices consist of low-melting solder compositions that wet and join metal contacts and are, ordinarily, used at high homologous temperatures in the as-solidified condition. Differences in solidification rate and substrate interactions have the consequence that even solder joints of similar compositions exhibit a wide range of microstructures. The variation in microstructure causes a variation in properties; in particular, the high-temperature creep properties that govern much of the mechanical behavior of the solder may differ significantly from joint to joint. The present paper reviews the varieties of microstructure that are found in common solder joints, and describes some of the ways in which microstructural changes affect mechanical properties and joint reliability.

  1. Drop Reliability of Epoxy-contained Sn-58 wt.%Bi Solder Joint with ENIG and ENEPIG Surface Finish Under Temperature and Humidity Test

    NASA Astrophysics Data System (ADS)

    Myung, Woo-Ram; Kim, Yongil; Kim, Kyung-Yeol; Jung, Seung-Boo

    2016-07-01

    The influence of two kinds of surface finish, namely electroless nickel immersion gold (ENIG) and electroless nickel electroless palladium immersion gold (ENEPIG), on the interfacial reactions and drop reliability of epoxy-enhanced Sn-58 wt.%Bi solder has been investigated after temperature-humidity storage tests. The chemical composition and morphology of intermetallic compounds (IMCs) were characterized by scanning electron microscopy, energy-dispersive x-ray spectroscopy, and electron probe microanalysis. Also, the mechanical reliability of solder joints was evaluated using board-level drop tests. The Sn-Bi epoxy solder/ENEPIG joint exhibited higher IMC growth rate than the Sn-Bi epoxy solder/ENIG joint. After 500 h at 85°C/85% RH storage condition, new IMCs were formed on the Ni3Sn4 layer in samples with both surface finishes. The results of board-level drop tests showed that the number of drops was higher for the ENIG than the ENEPIG surface finish. Solder joint fracture occurred along the interface between the solder and IMC layer for the ENIG surface finish. However, with the ENEPIG surface finish, the crack propagated between the IMCs.

  2. Source levels of northern elephant seal vocalizations in-air

    NASA Astrophysics Data System (ADS)

    Insley, Stephen J.; Southall, Brandon L.

    2005-09-01

    Accurate measurements of vocalization sound-pressure levels are necessary to determine the acoustical active space of animals in natural and human-altered ambient noise conditions. Despite this basic need, such data are limited or nonexistent for most species. Our study characterized aerial ambient noise and vocalization source levels for northern elephant seals during the breeding season. Subjects were adult males, lactating females, and dependent offspring (pups) at An~o Nuevo State Reserve. Source level measurements were made using a Type 1 sound level meter and calibrated microphones on-axis: (1) at 1 m; (2) at several known distances (laser measured); and (3) simultaneously at 1 m and a second known distance. Concurrent ambient noise conditions were measured in situ (non-weighted 5 min Leq integrated averages) and recorded for later spectral analysis. Measurements were made at two sites, one relatively noisy and the other relatively quiet, to determine whether animals compensate for higher noise conditions by increasing source levels (Lombard effect). Results indicate a wide range in signal strength, particularly for adult males whose vocalization source levels appear to be correlated with dominance rank and related to ambient noise conditions. The Lombard effect was not observed for adult females or elephant seal pups.

  3. Personal, indoor and outdoor air pollution levels among pregnant women

    NASA Astrophysics Data System (ADS)

    Schembari, Anna; Triguero-Mas, Margarita; de Nazelle, Audrey; Dadvand, Payam; Vrijheid, Martine; Cirach, Marta; Martinez, David; Figueras, Francesc; Querol, Xavier; Basagaña, Xavier; Eeftens, Marloes; Meliefste, Kees; Nieuwenhuijsen, Mark J.

    2013-01-01

    AimThe aims of this study were to investigate the relationship between pregnant women's personal exposures to NOx, NO2, PM2.5 concentration and absorbance as a marker for black carbon and their indoor and outdoor concentration levels at their residence, and also to identify predictors of personal exposure and indoor levels using questionnaire and time activity data. MethodWe recruited 54 pregnant women in Barcelona who carried a personal PM2.5 sampler for two days and NOx/NO2 passive badges for one week, while indoor and outdoor PM2.5 and NOx/NO2 levels at their residence were simultaneously measured. Time activity and house characteristics were recorded. Gravimetry determinations for PM2.5 concentration and absorbance measurements were carried out on the PM2.5 filter samples. ResultsLevels of personal exposure to NOx, PM2.5 and absorbance were slightly higher than indoor and outdoor levels (geometric mean of personal NOx = 61.9 vs indoor NOx = 60.6 μg m-3), while for NO2 the indoor levels were slightly higher than the personal ones. Generally, there was a high statistically significant correlation between personal exposure and indoor levels (Spearman's r between 0.78 and 0.84). Women spent more than 60% of their time indoors at home. Ventilation of the house by opening the windows, the time spent cooking and indicators for traffic intensity were re-occurring statistically significant determinants of the personal and indoor pollutants levels with models for NOx explaining the 55% and 60% of the variability respectively, and models for NO2 explaining the 39% and 16% of the variability respectively. Models for PM2.5 and absorbance explained the least of the variability. ConclusionOur findings improve the current understanding of the characterization and inter-associations between personal, indoor and outdoor pollution levels among pregnant women. Variability in personal and indoor NOx and to a lesser extent NO2 levels could be explained well, but not the variability

  4. Factors Affecting Parent's Perception on Air Quality-From the Individual to the Community Level.

    PubMed

    Guo, Yulin; Liu, Fengfeng; Lu, Yuanan; Mao, Zongfu; Lu, Hanson; Wu, Yanyan; Chu, Yuanyuan; Yu, Lichen; Liu, Yisi; Ren, Meng; Li, Na; Chen, Xi; Xiang, Hao

    2016-01-01

    The perception of air quality significantly affects the acceptance of the public of the government's environmental policies. The aim of this research is to explore the relationship between the perception of the air quality of parents and scientific monitoring data and to analyze the factors that affect parents' perceptions. Scientific data of air quality were obtained from Wuhan's environmental condition reports. One thousand parents were investigated for their knowledge and perception of air quality. Scientific data show that the air quality of Wuhan follows an improving trend in general, while most participants believed that the air quality of Wuhan has deteriorated, which indicates a significant difference between public perception and reality. On the individual level, respondents with an age of 40 or above (40 or above: OR = 3.252; 95% CI: 1.170-9.040), a higher educational level (college and above: OR = 7.598; 95% CI: 2.244-25.732) or children with poor healthy conditions (poor: OR = 6.864; 95% CI: 2.212-21.302) have much more negative perception of air quality. On the community level, industrial facilities, vehicles and city construction have major effects on parents' perception of air quality. Our investigation provides baseline information for environmental policy researchers and makers regarding the public's perception and expectation of air quality and the benefits to the environmental policy completing and enforcing.

  5. Factors Affecting Parent's Perception on Air Quality-From the Individual to the Community Level.

    PubMed

    Guo, Yulin; Liu, Fengfeng; Lu, Yuanan; Mao, Zongfu; Lu, Hanson; Wu, Yanyan; Chu, Yuanyuan; Yu, Lichen; Liu, Yisi; Ren, Meng; Li, Na; Chen, Xi; Xiang, Hao

    2016-01-01

    The perception of air quality significantly affects the acceptance of the public of the government's environmental policies. The aim of this research is to explore the relationship between the perception of the air quality of parents and scientific monitoring data and to analyze the factors that affect parents' perceptions. Scientific data of air quality were obtained from Wuhan's environmental condition reports. One thousand parents were investigated for their knowledge and perception of air quality. Scientific data show that the air quality of Wuhan follows an improving trend in general, while most participants believed that the air quality of Wuhan has deteriorated, which indicates a significant difference between public perception and reality. On the individual level, respondents with an age of 40 or above (40 or above: OR = 3.252; 95% CI: 1.170-9.040), a higher educational level (college and above: OR = 7.598; 95% CI: 2.244-25.732) or children with poor healthy conditions (poor: OR = 6.864; 95% CI: 2.212-21.302) have much more negative perception of air quality. On the community level, industrial facilities, vehicles and city construction have major effects on parents' perception of air quality. Our investigation provides baseline information for environmental policy researchers and makers regarding the public's perception and expectation of air quality and the benefits to the environmental policy completing and enforcing. PMID:27187432

  6. Printability Optimization For Fine Pitch Solder Bonding

    SciTech Connect

    Kwon, Sang-Hyun; Lee, Chang-Woo; Yoo, Sehoon

    2011-01-17

    Effect of metal mask and pad design on solder printability was evaluated by DOE in this study. The process parameters were stencil thickness, squeegee angle, squeegee speed, mask separating speed, and pad angle of PCB. The main process parameters for printability were stencil thickness and squeegee angle. The response surface showed that maximum printability of 1005 chip was achieved at the stencil thickness of 0.12 mm while the maximum printability of 0603 and 0402 chip was obtained at the stencil thickness of 0.05 mm. The bonding strength of the MLCC chips was also directly related with the printability.

  7. Organophosphate Esters in Canadian Arctic Air: Occurrence, Levels and Trends.

    PubMed

    Sühring, Roxana; Diamond, Miriam L; Scheringer, Martin; Wong, Fiona; Pućko, Monika; Stern, Gary; Burt, Alexis; Hung, Hayley; Fellin, Philip; Li, Henrik; Jantunen, Liisa M

    2016-07-19

    Fourteen organophosphate esters (OPEs) were measured in the filter fraction of 117 active air samples from yearly ship-based sampling campaigns (2007-2013) and two land-based stations in the Canadian Arctic, to assess trends and long-range transport potential of OPEs. Four OPEs were detected in up to 97% of the samples, seven in 50% or less of the samples, and three were not detected. Median concentrations of ∑OPEs were 237 and 50 pg m(-3) for ship- and land-based samples, respectively. Individual median concentrations ranged from below detection to 119 pg m(-3) for ethanol, 2-chloro-, phosphate (3:1) (TCEP). High concentrations of up to 2340 pg m(-3) were observed for Tri-n-butyl phosphate (TnBP) at a land-based sampling location in Resolute Bay from 2012, whereas it was only detected in one ship-based sample at a concentration below 100 pg m(-3). Concentrations of halogenated OPEs seemed to be driven by river discharge from the Nelson and Churchill Rivers (Manitoba) and Churchill River and Lake Melville (Newfoundland and Labrador). In contrast, nonhalogenated OPE concentrations appeared to have diffuse sources or local sources close to the land-based sampling stations. Triphenyl phosphate (TPhP) showed an apparent temporal trend with a doubling-time of 11 months (p = 0.044). The results emphasize the increasing relevance of halogenated and nonhalogenated OPEs as contaminants in the Arctic.

  8. Organophosphate Esters in Canadian Arctic Air: Occurrence, Levels and Trends.

    PubMed

    Sühring, Roxana; Diamond, Miriam L; Scheringer, Martin; Wong, Fiona; Pućko, Monika; Stern, Gary; Burt, Alexis; Hung, Hayley; Fellin, Philip; Li, Henrik; Jantunen, Liisa M

    2016-07-19

    Fourteen organophosphate esters (OPEs) were measured in the filter fraction of 117 active air samples from yearly ship-based sampling campaigns (2007-2013) and two land-based stations in the Canadian Arctic, to assess trends and long-range transport potential of OPEs. Four OPEs were detected in up to 97% of the samples, seven in 50% or less of the samples, and three were not detected. Median concentrations of ∑OPEs were 237 and 50 pg m(-3) for ship- and land-based samples, respectively. Individual median concentrations ranged from below detection to 119 pg m(-3) for ethanol, 2-chloro-, phosphate (3:1) (TCEP). High concentrations of up to 2340 pg m(-3) were observed for Tri-n-butyl phosphate (TnBP) at a land-based sampling location in Resolute Bay from 2012, whereas it was only detected in one ship-based sample at a concentration below 100 pg m(-3). Concentrations of halogenated OPEs seemed to be driven by river discharge from the Nelson and Churchill Rivers (Manitoba) and Churchill River and Lake Melville (Newfoundland and Labrador). In contrast, nonhalogenated OPE concentrations appeared to have diffuse sources or local sources close to the land-based sampling stations. Triphenyl phosphate (TPhP) showed an apparent temporal trend with a doubling-time of 11 months (p = 0.044). The results emphasize the increasing relevance of halogenated and nonhalogenated OPEs as contaminants in the Arctic. PMID:27309668

  9. Soldering in a Reduced Gravity Environment (SoRGE)

    NASA Technical Reports Server (NTRS)

    Easton, John W.; Struk, Peter M.

    2012-01-01

    Future long-duration human exploration missions will be challenged by constraints on mass and volume allocations available for spare parts. Addressing this challenge will be critical to the success of these missions. As a result, it is necessary to consider new approaches to spacecraft maintenance and repair that reduce the need for large replacement components. Currently, crew members on the International Space Station (ISS) recover from faults by removing and replacing, using backup systems, or living without the function of Orbital Replacement Units (ORUs). These ORUs are returned to a depot where the root cause of the failure is determined and the ORU is repaired. The crew has some limited repair capability with the Modulation/DeModulation (MDM) ORU, where circuit cards are removed and replace in faulty units. The next step to reducing the size of the items being replaced would be to implement component-level repair. This mode of repair has been implemented by the U.S. Navy in an operational environment and is now part of their standard approach for maintenance. It is appropriate to consider whether this approach can be adapted for future spaceflight operations. To this end, the Soldering in a Reduced Gravity Environment (SoRGE) experiment studied the effect of gravity on the formation of solder joints on electronic circuit boards. This document describes the SoRGE experiment, the analysis methods, and results to date. This document will also contain comments from the crew regarding their experience conducting the SoRGE experiment as well as recommendations for future improvements. Finally, this document will discuss the plans for the SoRGE samples which remain on ISS.

  10. 77 FR 66595 - U.S. Air Force Broadcast of Consent Order, and Determination of Interest Level for a United...

    Federal Register 2010, 2011, 2012, 2013, 2014

    2012-11-06

    ... Department of the Air Force U.S. Air Force Broadcast of Consent Order, and Determination of Interest Level for a United Launch Alliance (ULA) Consent Order Industry Day AGENCY: Headquarters Air Force, Deputy Under Secretary of the Air Force (Space). ACTION: Publicize Consent Order, and Determine Level...

  11. Interconnection of thermal parameters, microstructure and mechanical properties in directionally solidified Sn–Sb lead-free solder alloys

    SciTech Connect

    Dias, Marcelino; Costa, Thiago; Rocha, Otávio; Spinelli, José E.; Cheung, Noé; Garcia, Amauri

    2015-08-15

    Considerable effort is being made to develop lead-free solders for assembling in environmental-conscious electronics, due to the inherent toxicity of Pb. The search for substitute alloys of Pb–Sn solders has increased in order to comply with different soldering purposes. The solder must not only meet the expected levels of electrical performance but may also have appropriate mechanical strength, with the absence of cracks in the solder joints. The Sn–Sb alloy system has a range of compositions that can be potentially included in the class of high temperature solders. This study aims to establish interrelations of solidification thermal parameters, microstructure and mechanical properties of Sn–Sb alloys (2 wt.%Sb and 5.5 wt.%Sb) samples, which were directionally solidified under cooling rates similar to those of reflow procedures in industrial practice. A complete high-cooling rate cellular growth is shown to be associated with the Sn–2.0 wt.%Sb alloy and a reverse dendrite-to-cell transition is observed for the Sn–5.5 wt.%Sb alloy. Strength and ductility of the Sn–2.0 wt.%Sb alloy are shown not to be affected by the cellular spacing. On the other hand, a considerable variation in these properties is associated with the cellular region of the Sn–5.5 wt.%Sb alloy casting. - Graphical abstract: Display Omitted - Highlights: • The microstructure of the Sn–2 wt.%Sb alloy is characterized by high-cooling rates cells. • Reverse dendrite > cell transition occurs for Sn–5.5 wt.%Sb alloy: cells prevail for cooling rates > 1.2 K/s. • Sn–5.5 wt.%Sb alloy: the dendritic region occurs for cooling rates < 0.9 K/s. • Sn–5.5 wt.%Sb alloy: tensile properties are improved with decreasing cellular spacing.

  12. Electromigration of composite Sn-Ag-Cu solder bumps

    NASA Astrophysics Data System (ADS)

    Sharma, Ashutosh; Xu, Di Erick; Chow, Jasper; Mayer, Michael; Sohn, Heung-Rak; Jung, Jae Pil

    2015-11-01

    This study investigates the electromigration (EM) behavior of lead free Sn-Ag-Cu (SAC) solder alloys that were reinforced with different types of nanoparticles [Copper-coated carbon nanotubes (Cu/CNT), La2O3, Graphene, SiC, and ZrO2]. The composite solders were bumped on a Cu substrate at 220°C, and the resistance of the bumped solders was measured using a four wire setup. Current aging was carried out for 4 hours at a temperature of 160°C, and an increase in resistance was noted during this time. Of all the composite solders that were studied, La2O3 and SiC reinforced SAC solders exhibited the smallest resistances after current aging. However, the rate of change in the resistance at room temperature was lower for the SiC-reinforced SAC solder. The SAC and Graphene reinforced SAC solder bumps completely failed within 15 - 20 min of these tests. The SiC nanoparticles were reported to possibly entrap the SAC atoms better than other nanoparticles with a lower rate of EM. [Figure not available: see fulltext.

  13. Laser forward transfer of solder paste for microelectronics fabrication

    NASA Astrophysics Data System (ADS)

    Mathews, Scott A.; Charipar, Nicholas A.; Auyeung, Ray C.; Kim, Heungsoo; Piqué, Alberto

    2015-03-01

    The progressive miniaturization of electronic devices requires an ever-increasing density of interconnects attached via solder joints. As a consequence, the overall size and spacing (or pitch) of these solder joint interconnects keeps shrinking. When the pitch between interconnects decreases below 200 μm, current technologies, such as stencil printing, find themselves reaching their resolution limit. Laser direct-write (LDW) techniques based on laser-induced forward transfer (LIFT) of functional materials offer unique advantages and capabilities for the printing of solder pastes. At NRL, we have demonstrated the successful transfer, patterning, and subsequent reflow of commercial Pb-free solder pastes using LIFT. Transfers were achieved both with the donor substrate in contact with the receiving substrate and across a 25 μm gap, such that the donor substrate does not make contact with the receiving substrate. We demonstrate the transfer of solder paste features down to 25 μm in diameter and as large as a few hundred microns, although neither represents the ultimate limit of the LIFT process in terms of spatial dimensions. Solder paste was transferred onto circular copper pads as small as 30 μm and subsequently reflowed, in order to demonstrate that the solder and flux were not adversely affected by the LIFT process.

  14. Fatigue and thermal fatigue of Pb-Sn solder joints

    SciTech Connect

    Frear, D.; Grivas, D.; McCormack, M.; Tribula, D.; Morris, J.W. Jr.

    1987-01-01

    This paper presents a fundamental investigation of the fatigue and thermal fatigue characteristics, with an emphasis on the microstructural development during fatigue, of Sn-Pb solder joints. Fatigue tests were performed in simple shear on both 60Sn-40Pb and 5Sn-95Pb solder joints. Isothermal fatigue tests show increasing fatigue life of 60Sn-40Pb solder joints with decreasing strain and temperature. In contrast, such behavior was not observed in the isothermal fatigue of 5Sn-95Pb solder joints. Thermal fatigue results on 60Sn-40Pb solder cycled between -55/sup 0/C and 125/sup 0/C show that a coarsened region develops in the center of the joint. Both Pb-rich and Sn-rich phases coarsen, and cracks form within these coarsened regions. The failure mode 60Sn-40Pb solder joints in thermal and isothermal fatigue is similar: cracks form intergranularly through the Sn-rich phase or along Sn/Pb interphase boundaries. Extensive cracking is found throughout the 5Sn-95Pb joint for both thermal and isothermal fatigue. In thermal fatigue the 5Sn-95Pb solder joints failed after fewer cycles than 60Sn-40Pb.

  15. Stress and physiological, behavioral and performance patterns of children under varied air ion levels

    NASA Astrophysics Data System (ADS)

    Fornof, K. T.; Gilbert, G. O.

    1988-12-01

    The possibility that individual differences in reactivity to stressors are a major factor underlying discordant results reported for air ion studies prompted an investigation of response patterns in school children under both normal indoor air ion levels and moderately increased negative air ion levels (4000±500/cm3). It was hypothesized that the impact of stressors is reduced with high negative air ionization, and that resultant changes in stress effects would be differentially exhibited according to the children's normal degree of stimulus reactivity. A counter-balanced, replicative, withinssubject design was selected, and the subjects were 12 environmentally sensitive, 1st 4th grade school children. In addition to monitoring stress effects on activity level, attention span, concentration to task and conceptual performance, measures were also made of urinary 5-hydroxyindole acetic acid levels and skin resistance response (SRR) to determine if changes extended to the physiological state. The cold water test was used to add physical stress and enable calculations of Lacey's autonomic lability scores (ALS) as indicators of individual reactivity. The results show main effects for air ions on both physiological parameters, with 48% less change in %SRR ( P<0.01) and 46% less change in urinary 5-HIAA levels ( P<0.055) during negative air ions, indicating increased stress tolerance. Strong interactive effects for ALS x air ion condition appeared, with high and low ALS children reacting oppositely to negative air ions in measures of skin resistance level ( P<0.01), wrist activity ( P<0.01) and digit span backwards ( P<0.004). Thus individual differences in autonomic reactivity and the presence or absence of stressors appear as critical elements for internal validity, and in preventing consequent skewed results from obscuring progress in air ion research.

  16. Albumin-genipin solder for laser tissue welding

    NASA Astrophysics Data System (ADS)

    Lauto, Antonio; Foster, John; Avolio, Albert; Poole-Warren, Laura

    2004-07-01

    Background. Laser tissue soldering (LTS) is an alternative technique to suturing for tissue repair. One of the major drawbacks of LTS is the weak tensile strength of the solder welds when compared to sutures. In this study, the possibility was investigated for a low cytotoxic crosslinker, acting on amino groups, to enhance the bond strength of albumin solders. Materials and Methods. Solder strips were welded onto rectangular sections of sheep small intestine by a diode laser. The laser delivered in continuous mode mode a power of 170 +/- 10 mW at λ=808 nm, through a multimode optical fiber (core size = 200 μm) to achieve a dose of 10.8 +/- 0.5 J/mg. The solder thickness and surface area were kept constant throughout the experiment (thickness = 0.15 +/- 1 mm, area = 12 +/- 1.2 mm2). The solder incorporated 62% bovine serum albumin, 0.38% genipin, 0.25% indocyanin green dye (IG) and water. Tissue welding was also performed with a similar solder, which did not incorporate genipin, as a control group. The repaired tissue was tested for tensile strength by a calibrated tensiometer. Results. The tensile strength of the "genipin" solder was twice as high as the strength of the BSA solder (0.21 +/- 0.04 N and 0.11 +/- 0.04 N respectively; p~10-15 unpaired t-test, N=30). Discussion. Addition of a chemical crosslinking agent, such as genipin, significantly increased the tensile strength of adhesive-tissue bonds. A proposed mechanism for this enhanced bond strength is the synergistic action of mechanical adhesion with chemical crosslinking by genipin.

  17. Wettability analysis of tin-based, lead free solders

    SciTech Connect

    Vianco, P T; Hosking, F M; Rejent, J A

    1992-01-01

    The overall program is comprised of two efforts. The first effort studies the wettability of tin-based, lead free solders on two commonly used substrate materials: copper and gold-nickel plated Kovar{trademark}. The evaluation is being conducted by the meniscometer/wetting balance technique which uses the contact angle as the primary metric to quantify wettability. Information about the rate of wetting is also obtainable with this test. The second part of the program is comprised of an assessment of the solderability of actual circuit board assemblies (surface mount and through-hole). This report will describe data from the wettability analysis of lead free solders on copper.

  18. Thermal fatigue evaluation of solder alloys. Final report

    SciTech Connect

    Jarboe, D.M.

    1980-02-01

    An evaluation was made of the relative thermal fatigue resistance of 29 solder alloys. A number of these alloys were found to be less susceptible to thermal fatigue cracking in encapsulated printed wiring board applications than the commonly used tin-lead eutectic (63Sn-37Pb). Three alloys, 95Sn-5Ag, 96.5Sn-3.5Ag, and 95Sn-5Sb offered the greatest resistance to thermal fatigue. The selection of the encapsulation materials was confirmed to be a significant factor in thermal fatigue of solder joints, regardless of the solder alloy used.

  19. Inconsistencies in the Understanding of Solder Joint Reliability Physics

    NASA Technical Reports Server (NTRS)

    Wen, L.; Mon, G. R.; Ross, R. G., Jr.

    1997-01-01

    Over the years, many analytical and experimental research studies have aimed to improve the state-of-the-art assessment of solder joint integrity from a physics-of-failure perspective. Although much progress has been made, there still exist many inconsistent and even contradictory correlations and conclusions. Before discussing some of the prominent inconsistencies found in the literature, this paper reviews the fundamental physics underlying the nature of solder failure...Using the complex constitutive properties of solder, fundamental mechanical and thermomechanical proccesses can be modeled to demonstrate some of the inconsistencies in the literature.

  20. Crystal plasticity finite element analysis of deformation behaviour in SAC305 solder joint

    NASA Astrophysics Data System (ADS)

    Darbandi, Payam

    Due to the awareness of the potential health hazards associated with the toxicity of lead (Pb), actions have been taken to eliminate or reduce the use of Pb in consumer products. Among those, tin (Sn) solders have been used for the assembly of electronic systems. Anisotropy is of significant importance in all structural metals, but this characteristic is unusually strong in Sn, making Sn based solder joints one of the best examples of the influence of anisotropy. The effect of anisotropy arising from the crystal structure of tin and large grain microstructure on the microstructure and the evolution of constitutive responses of microscale SAC305 solder joints is investigated. Insights into the effects of key microstructural features and dominant plastic deformation mechanisms influencing the measured relative activity of slip systems in SAC305 are obtained from a combination of optical microscopy, orientation imaging microscopy (OIM), slip plane trace analysis and crystal plasticity finite element (CPFE) modeling. Package level SAC305 specimens were subjected to shear deformation in sequential steps and characterized using optical microscopy and OIM to identify the activity of slip systems. X-ray micro Laue diffraction and high energy monochromatic X-ray beam were employed to characterize the joint scale tensile samples to provide necessary information to be able to compare and validate the CPFE model. A CPFE model was developed that can account for relative ease of activating slip systems in SAC305 solder based upon the statistical estimation based on correlation between the critical resolved shear stress and the probability of activating various slip systems. The results from simulations show that the CPFE model developed using the statistical analysis of activity of slip system not only can satisfy the requirements associated with kinematic of plastic deformation in crystal coordinate systems (activity of slip systems) and global coordinate system (shape changes

  1. Relationship Between Indoor Air Pollutant Levels and Residential Environment in Children With Atopic Dermatitis

    PubMed Central

    Lee, Jung Hyun; Lee, Ho Seok; Park, Mi Ran; Lee, Sang Woon; Kim, Eun Hye; Cho, Joong Bum; Kim, Jihyun; Han, Youngshin; Jung, Kweon; Cheong, Hae Kwan; Lee, Sang Il

    2014-01-01

    Purpose This study was aimed to investigate the relationship between indoor air pollutant levels and residential environment in children with atopic dermatitis (AD) living in Seoul. Methods A total of 150 children with AD were included. Residential environment was assessed by questionnaires which were completed by their parents. To evaluate the level of exposure to the indoor air pollutants, concentrations of the indoor air pollutants including particulate matter with diameter less than 10 µm (PM10), formaldehyde, carbon dioxide (CO2), carbon monoxide (CO), nitrogen dioxide (NO2), Total Volatile Organic Compound (TVOC), benzene, toluene, ethyl-benzene, xylene, styrene, bacterial aerosols, and airborne fungi were measured. Results A significant difference was exhibited in the levels of PM10 in case of visible fungus on the walls (P=0.047). There was relationship between the construction year of the house, moving to a newly constructed building within 1 year and formaldehyde level. With the use of artificial air freshener, the differences were found in the concentrations of TVOC (P=0.003), benzene (P=0.015), toluene (P=0.012) and ethyl-benzene (P=0.027). The concentration of xylene was significantly high when oil was used as heating fuel (P=0.015). Styrene exhibited differences depending on building type and its concentrations were significantly high in a residential and commercial complex building (P=0.005). The indoor concentration of bacterial aerosols was significantly low with the use of air cleaner (P=0.045). High NO2, benzene concentrations were present in case of almost no ventilation (P=0.028 and P=0.028, respectively). Conclusions Individual residential environments are closely related with the levels of the indoor air pollutants. To alleviate AD symptoms, simple questions about residential environments such as visible fungus on the walls and the use of artificial air freshener are helpful to assess the possibility of increased indoor air pollutant levels

  2. Monitoring strategy to assessment the air pollution level in Salamanca (México)

    NASA Astrophysics Data System (ADS)

    Barrón-Adame, J. M.; Cortina-Januchs, M. G.; Andina, D.; Vega-Corona, A.

    2009-04-01

    Air pollution affects not only the quality of life and the health of the urban population but also forests and agriculture. Agricultural crops can be injured when exposed to high concentrations of various air pollutants. Air pollutants can generally be classed as either local or widespread. Local pollutants are those emitted from a specific stationary source and result in a well-defined zone of vegetation injury or contamination. Most common among the local pollutants are sulphur dioxide, fluorides, ammonia and particulate matter. The paper presents an air monitoring strategy based on data fusion and Artificial Neural Networks. The main objective is to classify automatically the air pollution level as a proposal to assessment the air pollution level affecting the agriculture in Salamanca (Mexico). Salamanca is catalogued as one of the most polluted cities in Mexico. Pollutant concentrations and meteorological variables have been consider in data fusion process in order to build a Representative Pollution Vector (RPV). Meteorological variables (Wind Direction and Wind Speed) are taken as a decision factor in the air pollutant concentration level. RPV is used to train an Artificial Neural Network in order to classify new pollutant events. In the experiments, real time series gathered from the Automatic Environmental Monitoring Network (AEMN) in Salamanca have been used.

  3. Damage Produced in Solder Alloys during Thermal Cycling

    NASA Astrophysics Data System (ADS)

    Liu, X. W.; Plumbridge, W. J.

    2007-09-01

    The anisotropy of tin is associated with significant variations in its coefficient of thermal expansion and elastic modulus, with crystallographic direction. Under pure thermal cycling (with no externally applied stress or strain), substantial strains, in excess of 100%, may develop locally, and for very small structures, such as soldered interconnections comprising a few grains, structural integrity may be adversely affected. To examine this possibility, freestanding samples of tin, Sn-3.5wt.%Ag, Sn-0.5wt.%Cu, and Sn-3.8wt.%Ag-0.7wt.%Cu, have been subjected to thermal cycling. Temperature cycles from 30°C to 125°C or from -40°C to 55°C initially caused surface cracking, with openings up to several tens of microns after 3,000 cycles. Subsequently, the surface cracks grew into the interior of the specimens, with the maximum penetration ranging from a few microns after 100 cycles to more than 200 μm after 3,000 cycles. The cracks initiated from damage accumulated along grain boundaries. For the same temperature range, less damage resulted after the lower maximum (or mean) temperature cycle, and there appears to be a thermally activated component of cracking. The microstructure produced by rapid cooling (water quenching) was slightly more resistant than that formed by air, or furnace, cooling. Apart from microstructural coarsening, no damage accrues from isothermal exposure alone.

  4. Microbial counts and particulate matter levels in roadside air samples under skytrain stations, Bangkok, Thailand.

    PubMed

    Luksamijarulkul, Pipat; Kongtip, Pornpimol

    2010-05-01

    In conditions with heavy traffic and crowds of people on roadside areas under skytrain stations in Bangkok, the natural air ventilation may be insufficient and air quality may be poor. A study of 350 air samples collected from the roadside, under skytrain stations in Bangkok, was carried out to assess microbial counts (210 air samples) and particulate matter (PM10) levels (140 samples). The results reveal the mean +/- standard deviation bacterial counts and fungal counts were 406.8 +/- 302.7 cfu/m3 and 128.9 +/- 89.7 cfu/m3, respectively. The PM10 level was 186.1 +/- 188.1 microg/m3. When compared to recommended levels, 4.8% of air samples (10/210 samples) had bacterial counts more than recommended levels (> 1,000 cfu/ m3) and 27.1% (38/140 samples) had PM10 levels more than recommended levels (> 120 microg/m3). These may affect human health, especially of street venders who spend most of their working time in these areas. PMID:20578558

  5. Microbial counts and particulate matter levels in roadside air samples under skytrain stations, Bangkok, Thailand.

    PubMed

    Luksamijarulkul, Pipat; Kongtip, Pornpimol

    2010-05-01

    In conditions with heavy traffic and crowds of people on roadside areas under skytrain stations in Bangkok, the natural air ventilation may be insufficient and air quality may be poor. A study of 350 air samples collected from the roadside, under skytrain stations in Bangkok, was carried out to assess microbial counts (210 air samples) and particulate matter (PM10) levels (140 samples). The results reveal the mean +/- standard deviation bacterial counts and fungal counts were 406.8 +/- 302.7 cfu/m3 and 128.9 +/- 89.7 cfu/m3, respectively. The PM10 level was 186.1 +/- 188.1 microg/m3. When compared to recommended levels, 4.8% of air samples (10/210 samples) had bacterial counts more than recommended levels (> 1,000 cfu/ m3) and 27.1% (38/140 samples) had PM10 levels more than recommended levels (> 120 microg/m3). These may affect human health, especially of street venders who spend most of their working time in these areas.

  6. High temperature solder alloys for underhood applications. Progress report

    SciTech Connect

    Drewien, C.A.; Yost, F.G.; Sackinger, S.; Kern, J.; Weiser, M.W.

    1995-02-01

    Under a cooperative research and development agreement with General Motors Corporation, lead-free solder systems including the flux, metallization, and solder are being developed for high temperature, underhood applications. Six tin-rich solders, five silver-rich metallizations, and four fluxes were screened using an experimental matrix whereby every combination was used to make sessile drops via hot plate or Heller oven processing. The contact angle, sessile drop appearance, and in some instances the microstructure was evaluated to determine combinations that would yield contact angles of less than 30{degrees}, well-formed sessile drops, and fine, uniform microstructures. Four solders, one metallization, and one flux were selected and will be used for further aging and mechanical property studies.

  7. BOREAS AFM-5 Level-2 Upper Air Network Standard Pressure Level Data

    NASA Technical Reports Server (NTRS)

    Barr, Alan; Hrynkiw, Charmaine; Hall, Forrest G. (Editor); Newcomer, Jeffrey A. (Editor); Smith, David E. (Technical Monitor)

    2000-01-01

    The BOREAS AFM-5 team collected and processed data from the numerous radiosonde flights during the project. The goals of the AFM-05 team were to provide large-scale definition of the atmosphere by supplementing the existing AES aerological network, both temporally and spatially. This data set includes basic upper-air parameters interpolated at 0.5 kiloPascal increments of atmospheric pressure from data collected from the network of upper-air stations during the 1993, 1994, and 1996 field campaigns over the entire study region. The data are contained in tabular ASCII files. The data files are available on a CD-ROM (see document number 20010000884) or from the Oak Ridge National Laboratory (ORNL) Distributed Active Archive Center (DAAC).

  8. [Study on feasible emission control level of air pollutions for cement industry ].

    PubMed

    Ren, Chun; Jiang, Mei; Zou, Lan; Li, Xiao-qian; Wei, Yu-xia; Zhao, Guo-hua; Zhang, Guo-ning

    2014-09-01

    The revised National Emission Standard of Air Pollutions for Cement Industry has been issued, which will be effective for the new enterprises and the existing enterprises on Mar. 1st, 2014 and July 1st, 2015, respectively. In the process of revision, the key technical issues on determination of standard limits was how to determine the feasible emission control level of air pollutions. Feasible emission control requirements were put forward, according to air pollutants emission, technologies, environmental management requirements and foreign standards, etc. The main contents of the revised standard include expanding the scope of application, increasing the pollutants, improving the particulate and NO emissions control level, and increasing special emission limits applied to key areas of air pollutants. The standard will become the gripper of pollution prevention, total emission reduction, structural adjustment and optimization of the layout, and will promote scientific and technical progression for the cement industry.

  9. Substrate solder barriers for semiconductor epilayer growth

    DOEpatents

    Drummond, T.J.; Ginley, D.S.; Zipperian, T.E.

    1987-10-23

    During the growth of compound semiconductors by epitaxial processes, substrates are typically mounted to a support. In molecular beam epitaxy, mounting is done using indium as a solder. This method has two drawbacks: the indium reacts with the substrate, and it is difficult to uniformly wet the back of a large diameter substrate. Both of these problems have been successfully overcome by sputter coating the back of the substrate with a thin layer of tungsten carbide or tungsten carbide and gold. In addition to being compatible with the growth of high quality semiconductor epilayers this coating is also inert in all standard substate cleaning etchants used for compound semiconductors, and provides uniform distribution of energy in radiant heating. 1 tab.

  10. Substrate solder barriers for semiconductor epilayer growth

    DOEpatents

    Drummond, Timothy J.; Ginley, David S.; Zipperian, Thomas E.

    1989-01-01

    During the growth of compound semiconductors by epitaxial processes, substrates are typically mounted to a support. In modular beam epitaxy, mounting is done using indium as a solder. This method has two drawbacks: the indium reacts with the substrate, and it is difficult to uniformly wet the back of a large diameter substrate. Both of these problems have been successfully overcome by sputter coating the back of the substrate with a thin layer of tungsten carbide or tungsten carbide and gold. In addition to being compatible with the growth of high quality semiconductor epilayers this coating is also inert in all standard substrate cleaning etchants used for compound semiconductors, and provides uniform distribution of energy in radiant heating.

  11. Substrate solder barriers for semiconductor epilayer growth

    DOEpatents

    Drummond, T.J.; Ginley, D.S.; Zipperian, T.E.

    1989-05-09

    During the growth of compound semiconductors by epitaxial processes, substrates are typically mounted to a support. In modular beam epitaxy, mounting is done using indium as a solder. This method has two drawbacks: the indium reacts with the substrate, and it is difficult to uniformly wet the back of a large diameter substrate. Both of these problems have been successfully overcome by sputter coating the back of the substrate with a thin layer of tungsten carbide or tungsten carbide and gold. In addition to being compatible with the growth of high quality semiconductor epilayers this coating is also inert in all standard substrate cleaning etchants used for compound semiconductors, and provides uniform distribution of energy in radiant heating.

  12. Mechanical Properties of Laser-jetted SAC305 Solder on Coated Optical Surfaces

    NASA Astrophysics Data System (ADS)

    Mäusezahl, Max; Hornaff, Marcel; Burkhardt, Thomas; Beckert, Erik

    Micro-optical packaging methods using laser-based Solderjet Bumping are a versatile alternative to established adhesive bonding, featuring the advantages of metallic solder in optical systems. Yet, aging properties have often been studied only for certain use cases. To examine application independent, long-term material properties of SAC305, square substrates of two widely used soda-lime glasses and the ceramic Al2O3 have been coated with a thin metallic layer system to be receptive for metallic solder. Using Solderjet Bumping, SAC305 balls of 400 μm diameter have been processed with different parameters to form an array of solder bumps on each substrate. While aging for two months at elevated temperature and for over a year at room temperature, shear strengths and failure modes of the individual bumps have been measured and compared. The results show that the mechanical stability of such bumps will stabilize on a level known from research by the electronics industry while observing a considerable dependency on the used substrate material.

  13. Investigation of gold embrittlement in connector solder joints

    NASA Technical Reports Server (NTRS)

    Lane, F. L.

    1972-01-01

    An investigation was performed to determine to what extent typical flight connector solder joints may be embrittled by the presence of gold. In addition to mapping of gold content in connector solder joints by an electron microprobe analyzer, metallographic examinations and mechanical tests (thermal shock, vibration, impact and tensile strength) were also conducted. A description of the specimens and tests, a discussion of the data, and some conclusions are presented.

  14. Level 1B products from the Atmospheric Infrared Sounder (AIRS) on the EOS Aqua Spacecraft

    NASA Technical Reports Server (NTRS)

    Pagano, Thomas S.; Aumann, H. H.; Overoye, Ken

    2003-01-01

    The Atmospheric Infrared Sounder (AIRS) was launched May 4, 2002 on the EOS Aqua Spacecraft. A discussion is given of the objectives of the AIRS experiment, including requirements on the data products. We summarize the instrument characteristics, including sensitivity, noise, and spectral response, and preflight calibration results leading to the estimate of the calibration accuracy. The Level 1B calibration algorithm is presented as well as the results of in-flight stability and sensitivity measurements.

  15. Search for tachyons associated with extensive air showers in the ground level cosmic radiation

    NASA Technical Reports Server (NTRS)

    Masjed, H. F.; Ashton, F.

    1985-01-01

    Events detected in a shielded plastic scintillation counter occurring in the 26 microsec preceding the arrival of an extensive air shower at ground level with local electron density or = 20 m to the -2 power and the 240 microsec after its arrival have been studied. No significant excess of events (tachyons) arriving in the early time domain have been observed in a sample of 11,585 air shower triggers.

  16. Solderability perservative coatings: Electroless tin vs. organic azoles

    SciTech Connect

    Artaki, I.; Ray, U.; Jackson, A.M.; Gordon, H.M.; Vianco, P.T.

    1993-07-01

    This paper compares the solderability performance and corrosions ion protection effectiveness of electroless tin coatings versus organic azole films after exposure to a series of humidity and thermal (lead-free solders) cycling conditions. The solderability of immersion tin is directly related to the tin oxide growth on the surface and is not affected by the formation of Sn-Cu intermetallic phases as long as the intermetallic phase is protected by a Sn layer. For a nominal tin thickness of 60{mu}inches, the typical thermal excursions associated with assembly are not sufficient to cause the intermetallic phase to consume the entire tin layer. Exposure to humidity at moderate to elevated temperatures promotes heavy tin oxide formation which leads to solderability loss. In contrast, thin azole films are more robust to humidity exposure; however upon heating in the presence of oxygen, they decompose and lead to severe solderability degradation. Evaluations of lead-free solder pastes for surface mount assembly applications indicate that immersion tin significantly improves the spreading of Sn:Ag and Sn:Bi alloys as compared to azole surface finishes.

  17. Eutectic Solder Bonding for Highly Manufacturable Microelectromechanical Systems Probe Card

    NASA Astrophysics Data System (ADS)

    Kim, Bonghwan

    2011-06-01

    We developed eutectic solder bonding for the microelectromechanical systems (MEMS) probe card. We tested various eutectic solder materials, such as Sn, AgSn, and AuSn, and investigated the bonding ability of Sn-based multi-element alloys and their resistance to chemical solutions. The Sn-based alloys were formed by sputtering, electroplating, and the use of solder paste. According to our experimental results, Sn-rich solders, such as Ag3.5Sn, Ag3.5Sn96Cu0.5, and Sn, were severely damaged by silicon wet etchant such as potassium hydroxide (KOH) and tetramethylammonium hydroxide (TMAH). On the other hand Au80Sn20 was resistant to those chemicals. In order to verify the joint bondability of the solders, we used a cantilever probe beam, and bump which were made of nickel and nickel alloy. After flip-chip bonding of the cantilever beam and the bump with Au80Sn20 solder paste, we measured the contact force to verify the mechanical strength. We then re-inspected it with X-rays and found no voids in the joint.

  18. Microsurgical anastomosis of sperm duct by laser tissue soldering

    NASA Astrophysics Data System (ADS)

    Wehner, Martin M.; Teutu-Kengne, Alain-Fleury; Brkovic, Drasko; Henning, Thomas; Klee, Doris; Poprawe, Reinhart; Jakse, Gerhard

    2005-04-01

    Connection of small vessels is usually done by suturing which is very cumbersome. Laser tissue soldering can circumvent that obstacle if a handy procedure can be defined. Our principle approach consists of a bioresorbable hollow stent with an expected degradation time of 3 weeks in combination with laser soldering. The stent is to be fed into the vessel to stabilize both ends and should allow percolation immediately after joining. The stents are made of Poly(D,L-lactid-co-glycolid) and solder is prepared from bovine serum albumin (BSA) doped with Indocyanine green (ICG) as chromophore to increase the absorption of laser light. After insertion, solder is applied onto the outer surface of the vessel and coagulated by laser radiation. The wavelength of 810 nm of a diode laser fits favorably to absorption properties of tissue and solder such that heating up of tissue is limited to prevent from necrosis and wound healing complications. In our study the preparation of stents, the consistency and doping of solder, a beam delivery instrument and the irradiation conditions are worked out. In-vitro tests are carried out on sperm ducts of Sprague-Dowlae (SD) rats. Different irradiation conditions are investigated and a micro-optical system consisting of a lens and a reflecting prism to ensure simultaneous irradiation of front and back side of the vessels tested. Under these conditions, the short-term rupture strength of laser anastomosis revealed as high as those achieved by suturing.

  19. Soldering of Thin Film-Metallized Glass Substrates

    SciTech Connect

    Hosking, F.M.; Hernandez, C.L.; Glass, S.J.

    1999-03-31

    The ability to produce reliable electrical and structural interconnections between glass and metals by soldering was investigated. Soldering generally requires premetallization of the glass. As a solderable surface finish over soda-lime-silicate glass, two thin films coatings, Cr-Pd-Au and NiCr-Sn, were evaluated. Solder nettability and joint strengths were determined. Test samples were processed with Sn60-Pb40 solder alloy at a reflow temperature of 210 C. Glass-to-cold rolled steel single lap samples yielded an average shear strength of 12 MPa. Solder fill was good. Control of the Au thickness was critical in minimizing the formation of AuSn{sub 4} intermetallic in the joint, with a resulting joint shear strength of 15 MPa. Similar glass-to-glass specimens with the Cr-Pd-Au finish failed at 16.5 MPa. The NiCr-Sn thin film gave even higher shear strengths of 20-22.5 MPa, with failures primarily in the glass.

  20. Creep properties of Pb-free solder joints

    SciTech Connect

    Song, H.G.; Morris Jr., J.W.; Hua, F.

    2002-04-01

    Describes the creep behavior of three Sn-rich solders that have become candidates for use in Pb-free solder joints: Sn-3.5Ag, Sn-3Ag-0.5Cu and Sn-0.7Cu. The three solders show the same general behavior when tested in thin joints between Cu and Ni/Au metallized pads at temperatures between 60 and 130 C. Their steady-state creep rates are separated into two regimes with different stress exponents(n). The low-stress exponents range from {approx}3-6, while the high-stress exponents are anomalously high (7-12). Strikingly, the high-stress exponent has a strong temperature dependence near room temperature, increasing significantly as the temperature drops from 95 to 60 C. The anomalous creep behavior of the solders appears to be due to the dominant Sn constituent. Joints of pure Sn have stress exponents, n, that change with stress and temperature almost exactly like those of the Sn-rich solder joints. Research on creep in bulk samples of pure Sn suggests that the anomalous temperature dependence of the stress exponent may show a change in the dominant mechanism of creep. Whatever its source, it has the consequence that conventional constitutive relations for steady-state creep must be used with caution in treating Sn-rich solder joints, and qualification tests that are intended to verify performance should be carefully designed.

  1. Lead-free solder technology transfer from ASE Americas

    SciTech Connect

    FTHENAKIS,V.

    1999-10-19

    To safeguard the environmental friendliness of photovoltaics, the PV industry follows a proactive, long-term environmental strategy involving a life-of-cycle approach to prevent environmental damage by its processes and products from cradle to grave. Part of this strategy is to examine substituting lead-based solder on PV modules with other solder alloys. Lead is a toxic metal that, if ingested, can damage the brain, nervous system, liver and kidneys. Lead from solder in electronic products has been found to leach out from municipal waste landfills and municipal incinerator ash was found to be high in lead also because of disposed consumer electronics and batteries. Consequently, there is a movement in Europe and Japan to ban lead altogether from use in electronic products and to restrict the movement across geographical boundaries of waste containing lead. Photovoltaic modules may contain small amounts of regulated materials, which vary from one technology to another. Environmental regulations impact the cost and complexity of dealing with end-of-life PV modules. If they were classified as hazardous according to Federal or State criteria, then special requirements for material handling, disposal, record-keeping and reporting would escalate the cost of decommissioning the modules. Fthenakis showed that several of today's x-Si modules failed the US-EPA Toxicity Characteristic Leaching Procedure (TCLP) for potential leaching of Pb in landfills and also California's standard on Total Threshold Limit Concentration (TTLC) for Pb. Consequently, such modules may be classified as hazardous waste. He highlighted potential legislation in Europe and Japan which could ban or restrict the use of lead and the efforts of the printed-circuit industries in developing Pb-free solder technologies in response to such expected legislation. Japanese firms already have introduced electronic products with Pb-free solder, and one PV manufacturer in the US, ASE Americas has used a Pb

  2. GSOD Based Daily Global Mean Surface Temperature and Mean Sea Level Air Pressure (1982-2011)

    DOE Data Explorer

    Xuan Shi, Dali Wang

    2014-05-05

    This data product contains all the gridded data set at 1/4 degree resolution in ASCII format. Both mean temperature and mean sea level air pressure data are available. It also contains the GSOD data (1982-2011) from NOAA site, contains station number, location, temperature and pressures (sea level and station level). The data package also contains information related to the data processing methods

  3. Determination of radionuclide concentrations in ground level air using the ASS-500 high volume sampler

    SciTech Connect

    Frenzel, E.; Arnold, D.; Wershofen, H.

    1996-06-01

    A method for determination of radionuclide concentrations in air aerosol samples collected by the high volume aerosol sampler ASS-500 was elaborated. The aerosol sampling station ASS-500 is a Stand alone, all-weather proofed instrument. It is designed for representative sampling of airborne radionuclides from ground level air at a height of about 1.5 m above ground level. The ASS-500 station enables continuous air monitoring both normal and emergency Situations. The collection of aerosols on the Petrianov FPP-15-1.5 type filter out of an air volume of about 100,000 m{sup 3} (sampling period 1 wk) or of about 250,000 m{sup 3} (sampling period 3 wk) admits accurate spectrometric low level measurements of natural and artificial radionuclides. The achieved detection limit is 0.5 {mu}Bq m{sup -3} and 0.2 {mu}Bq m{sup -3} for {sup 137}Cs, respectively. A new developed air flow Meter system allows to enhance the collected air volume to about 150,000 m{sup 3} per week and lowers the detection limit to <0.4 {mu}Bq m{sup -3} for {sup 137}Cs for weekly collected aerosol samples. In Poland the CLOR uses 9 Stations ASS-500 at different sites as atmospheric radioactivity control system. On the basis of spectrometric measurements of natural and artificial radionuclides in the collected aerosol samples at the different sites, CLOR establishes a weekly report about the radiological situation at Poland for responsible authorities. The very low achievable detection limit of the Station ASS-500 due 10 the high air flow fate and the long possible sampling period were the key argument for other government radiation protection authorities in Europe to introduce the Station ASS-500 into their low level radionuclide atmospheric monitoring programs (Austria, Belarus, France, Germany, Iceland, Spain, Switzerland, Ukraine).

  4. Characterization of Low-Melting-Point Sn-Bi-In Lead-Free Solders

    NASA Astrophysics Data System (ADS)

    Li, Qin; Ma, Ninshu; Lei, YongPing; Lin, Jian; Fu, HanGuang; Gu, Jian

    2016-11-01

    Development of lead-free solders with low melting temperature is important for substitution of Pb-based solders to reduce direct risks to human health and the environment. In the present work, Sn-Bi-In solders were studied for different ratios of Bi and Sn to obtain solders with low melting temperature. The microstructure, thermal properties, wettability, mechanical properties, and reliability of joints with Cu have been investigated. The results show that the microstructures of the Sn-Bi-In solders were composed of β-Sn, Bi, and InBi phases. The intermetallic compound (IMC) layer was mainly composed of Cu6Sn5, and its thickness increased slightly as the Bi content was increased. The melting temperature of the solders was around 100°C to 104°C. However, when the Sn content exceeded 50 wt.%, the melting range became larger and the wettability became worse. The tensile strength of the solder alloys and solder joints declined with increasing Bi content. Two fracture modes (IMC layer fracture and solder/IMC mixed fracture) were found in solder joints. The fracture mechanism of solder joints was brittle fracture. In addition, cleavage steps on the fracture surface and coarse grains in the fracture structure were comparatively apparent for higher Bi content, resulting in decreased elongation for both solder alloys and solder joints.

  5. Characterization of Low-Melting-Point Sn-Bi-In Lead-Free Solders

    NASA Astrophysics Data System (ADS)

    Li, Qin; Ma, Ninshu; Lei, YongPing; Lin, Jian; Fu, HanGuang; Gu, Jian

    2016-02-01

    Development of lead-free solders with low melting temperature is important for substitution of Pb-based solders to reduce direct risks to human health and the environment. In the present work, Sn-Bi-In solders were studied for different ratios of Bi and Sn to obtain solders with low melting temperature. The microstructure, thermal properties, wettability, mechanical properties, and reliability of joints with Cu have been investigated. The results show that the microstructures of the Sn-Bi-In solders were composed of β-Sn, Bi, and InBi phases. The intermetallic compound (IMC) layer was mainly composed of Cu6Sn5, and its thickness increased slightly as the Bi content was increased. The melting temperature of the solders was around 100°C to 104°C. However, when the Sn content exceeded 50 wt.%, the melting range became larger and the wettability became worse. The tensile strength of the solder alloys and solder joints declined with increasing Bi content. Two fracture modes (IMC layer fracture and solder/IMC mixed fracture) were found in solder joints. The fracture mechanism of solder joints was brittle fracture. In addition, cleavage steps on the fracture surface and coarse grains in the fracture structure were comparatively apparent for higher Bi content, resulting in decreased elongation for both solder alloys and solder joints.

  6. Aging effects on the microstructure, surface characteristics and wettability of Cu pretinned with Sn-Pb solders

    SciTech Connect

    Linch, H.S.

    1993-11-01

    This study investigates effects of aging in air and argon at 170 C on Cu coupons which were pretinned with 75Sn-25Pb, 8Sn-92Pb, and 5Sn-95Pb solders. Coatings were applied using electroplating or hot dipping techniques. The coating thickness was controlled between 3 to 3{mu}m and the specimens were aged for 0 hours, 2 hours, 24 hours and 2 weeks. Wetting balance tests were used to evaluate the wettability of the test specimens. Microstructural development was evaluated using X-ray diffraction, energy dispersive X-ray and Auger spectroscopy, as well as optical and scanning electron microscopy. The wetting behavior of the test specimens is interpreted with respect to observed microstructural changes and as a function of aging time, solder composition, and processing conditions.

  7. Wafer-level vacuum packaging for an optical readout bi-material cantilever infrared FPA

    NASA Astrophysics Data System (ADS)

    Li, Shuyu; Zhou, Xiaoxiong; Yu, Xiaomei

    2013-12-01

    In this paper, we report the design and fabrication of an uncooled infrared (IR) focal plane array (FPA) on quartz substrate and the wafer-level vacuum packaging for the IR FPA in view of an optical readout method. This FPA is composed of bi-material cantilever array which fabricated by the Micro-Electro Mechanical System (MEMS) technology, and the wafer-level packaging of the IR FPA is realized based on AuSn solder bonding technique. The interface of soldering is observed by scan electron microscope (SEM), which indicates that bonding interface is smooth and with no bubbles. The air leakage rate of packaged FPA is measured to be 1.3×10-9 atm·cc/s.

  8. Australia’s first national level quantitative environmental justice assessment of industrial air pollution

    NASA Astrophysics Data System (ADS)

    Chakraborty, Jayajit; Green, Donna

    2014-04-01

    This study presents the first national level quantitative environmental justice assessment of industrial air pollution in Australia. Specifically, our analysis links the spatial distribution of sites and emissions associated with industrial pollution sources derived from the National Pollution Inventory, to Indigenous status and social disadvantage characteristics of communities derived from Australian Bureau of Statistics indicators. Our results reveal a clear national pattern of environmental injustice based on the locations of industrial pollution sources, as well as volume, and toxicity of air pollution released at these locations. Communities with the highest number of polluting sites, emission volume, and toxicity-weighted air emissions indicate significantly greater proportions of Indigenous population and higher levels of socio-economic disadvantage. The quantities and toxicities of industrial air pollution are particularly higher in communities with the lowest levels of educational attainment and occupational status. These findings emphasize the need for more detailed analysis in specific regions and communities where socially disadvantaged groups are disproportionately impacted by industrial air pollution. Our empirical findings also underscore the growing necessity to incorporate environmental justice considerations in environmental planning and policy-making in Australia.

  9. Some insights into the relationship between urban air pollution and noise levels.

    PubMed

    Kim, Ki-Hyun; Ho, Duy Xuan; Brown, Richard J C; Oh, J-M; Park, Chan Goo; Ryu, In Cheol

    2012-05-01

    The relationship between noise and air pollution was investigated in eight different districts across Seoul, Korea, between September and November 2010. The noise levels in each district were measured at both roadside and non-roadside locations. It was found that the maximum levels of noise were generally at frequencies of around 1000 Hz. The equivalent noise levels (L(eq)), over all districts, averaged 61.4 ± 7.36 dB which is slightly lower than the noise guidelines set by the World Health Organization (WHO) of 70 dB for industrial, commercial, traffic, and outdoor areas. Comparison of L(eq) levels in each district consistently indicates that noise levels are higher at roadside sites than non-roadside sites. In addition the relative dominance of noise during daytime as compared to nighttime was also apparent. Moreover, the results of an analysis relating sound levels with air pollutant levels indicate strongly that the correlation between these two parameters is the strongest at roadside sites (relative to non-roadside sites) and during nighttime (relative to daytime). The results of our data analysis point to a positive, but complex, correlation between noise levels and air pollution.

  10. Microbial leaching of waste solder for recovery of metal.

    PubMed

    Hocheng, H; Hong, T; Jadhav, U

    2014-05-01

    This study proposes an environment-friendly bioleaching process for recovery of metals from solders. Tin-copper (Sn-Cu), tin-copper-silver (Sn-Cu-Ag), and tin-lead (Sn-Pb) solders were used in the current study. The culture supernatant of Aspergillus niger removed metals faster than the culture supernatant of Acidithiobacillus ferrooxidans. Also, the metal removal by A. niger culture supernatant is faster for Sn-Cu-Ag solder as compared to other solder types. The effect of various process parameters such as shaking speed, temperature, volume of culture supernatant, and increased solder weight on bioleaching of metals was studied. About 99 (±1.75) % metal dissolution was achieved in 60 h, at 200-rpm shaking speed, 30 °C temperature, and by using 100-ml A. niger culture supernatant. An optimum solder weight for bioleaching was found to be 5 g/l. Addition of sodium hydroxide (NaOH) and sodium chloride (NaCl) in the bioleached solution from Sn-Cu-Ag precipitated tin (85 ± 0.35 %) and silver (80 ± 0.08 %), respectively. Passing of hydrogen sulfide (H2S) gas at pH 8.1 selectively precipitated lead (57.18 ± 0.13 %) from the Sn-Pb bioleached solution. The proposed innovative bioleaching process provides an alternative technology for recycling waste solders to conserve resources and protect environment. PMID:24634142

  11. Microorganism levels in air near spray irrigation of municipal waste water: The Lubbock Infection Surveillance Study

    SciTech Connect

    Camann, D.E.; Moore, B.E.; Harding, H.J.; Sorber, C.A.

    1988-01-01

    The Lubbock Infection Surveillance Study (LISS) investigated possible adverse effects on human health from slow-rate land application of municipal wastewater. Extensive air sampling was conducted to characterize the irrigation site as a source of infectious microbial aerosols. Spray irrigation of poor-quality waste water received directly from the treatment plant significantly elevated air densities of fecal coliforms, fecal streptococci, mycobacteria, and coliphage above ambient background levels for at least 200 m downwind. Enteroviruses were repeatedly recovered at 44 to 60 m downwind at a higher level (geometric mean = 0.05 pfu/m3) than observed at other waste water aerosol sites in the U.S. and in Israel. Waste water storage in reservoirs reduced downwind air densities of indicator organisms by two orders of magnitude.

  12. Development of a new Pb-free solder: Sn-Ag-Cu

    SciTech Connect

    Miller, C.M.

    1995-02-10

    With the ever increasing awareness of the toxicity of Pb, significant pressure has been put on the electronics industry to get the Pb out of solder. This work pertains to the development and characterization of an alloy which is Pb-free, yet retains the proven positive qualities of current Sn-Pb solders while enhancing the shortcomings of Sn-Pb solder. The solder studied is the Sn-4.7Ag-1.7Cu wt% alloy. By utilizing a variety of experimental techniques the alloy was characterized. The alloy has a melting temperature of 217{degrees}C and exhibits eutectic melting behavior. The solder was examined by subjecting to different annealing schedules and examining the microstructural stability. The effect of cooling rate on the microstructure of the solder was also examined. Overall, this solder alloy shows great promise as a viable alternative to Pb-bearing solders and, as such, an application for a patent has been filed.

  13. Solder wetting behavior enhancement via laser-textured surface microcosmic topography

    NASA Astrophysics Data System (ADS)

    Chen, Haiyan; Peng, Jianke; Fu, Li; Wang, Xincheng; Xie, Yan

    2016-04-01

    In order to reduce or even replace the use of Sn-Pb solder in electronics industry, the laser-textured surface microstructures were used to enhance the wetting behavior of lead free solder during soldering. According to wetting theory and Sn-Ag-Cu lead free solder performance, we calculated and designed four microcosmic structures with the similar shape and different sizes to control the wetting behavior of lead free solder. The micro-structured surfaces with different dimensions were processed on copper plates by fiber femtosecond laser, and the effect of microstructures on wetting behavior was verified experimentally. The results showed that the wetting angle of Sn-Ag-Cu solder on the copper plate with microstructures decreased effectively compared with that on the smooth copper plate. The wetting angles had a sound fit with the theoretical values calculated by wetting model. The novel method provided a feasible route for adjusting the wetting behavior of solders and optimizing solders system.

  14. Effects of post-reflow cooling rate and thermal aging on growth behavior of interfacial intermetallic compound between SAC305 solder and Cu substrate

    NASA Astrophysics Data System (ADS)

    Hu, Xiaowu; Xu, Tao; Jiang, Xiongxin; Li, Yulong; Liu, Yi; Min, Zhixian

    2016-04-01

    The interfacial reactions between Cu and Sn3Ag0.5Cu (SAC305) solder reflowed under various cooling rates were investigated. It is found that the cooling rate is an important parameter in solder reflow process because it influences not only microstructure of solder alloy but also the morphology and growth of intermetallic compounds (IMCs) formed between solder and Cu substrate. The experimental results indicate that only scallop-like Cu6Sn5 IMC layer is observed between solder and Cu substrate in case of water cooling and air cooling, while bilayer composed of scallop-like Cu6Sn5 and thin layer-like Cu3Sn is detected under furnace cooling due to sufficient reaction time to form Cu3Sn between Cu6Sn5 IMC and Cu substrate which resulted from slow cooling rate. Samples with different reflow cooling rates were further thermal-aged at 423 K. And it is found that the thickness of IMC increases linearly with square root of aging time. The growth constants of interfacial IMC layer during aging were obtained and compared for different cooling rates, indicating that the IMC layer thickness increased faster in samples under low cooling rate than in the high cooling rate under the same aging condition. The long prismatic grains were formed on the existing interfacial Cu6Sn5 grains to extrude deeply into solder matrix with lower cooling rate and long-term aging, and the Cu6Sn5 grains coarsened linearly with cubic root of aging time.

  15. The Influence of Declining Air Lead Levels on Blood Lead–Air Lead Slope Factors in Children

    PubMed Central

    Richmond-Bryant, Jennifer; Davis, Allen; Cohen, Jonathan; Lu, Shou-En; Svendsgaard, David; Brown, James S.; Tuttle, Lauren; Hubbard, Heidi; Rice, Joann; Kirrane, Ellen; Vinikoor-Imler, Lisa C.; Kotchmar, Dennis; Hines, Erin P.; Ross, Mary

    2014-01-01

    Background: It is difficult to discern the proportion of blood lead (PbB) attributable to ambient air lead (PbA), given the multitude of lead (Pb) sources and pathways of exposure. The PbB–PbA relationship has previously been evaluated across populations. This relationship was a central consideration in the 2008 review of the Pb national ambient air quality standards. Objectives: The objectives of this study were to evaluate the relationship between PbB and PbA concentrations among children nationwide for recent years and to compare the relationship with those obtained from other studies in the literature. Methods: We merged participant-level data for PbB from the National Health and Nutrition Examination Survey (NHANES) III (1988–1994) and NHANES 9908 (1999–2008) with PbA data from the U.S. Environmental Protection Agency. We applied mixed-effects models, and we computed slope factor, d[PbB]/d[PbA] or the change in PbB per unit change in PbA, from the model results to assess the relationship between PbB and PbA. Results: Comparing the NHANES regression results with those from the literature shows that slope factor increased with decreasing PbA among children 0–11 years of age. Conclusion: These findings suggest that a larger relative public health benefit may be derived among children from decreases in PbA at low PbA exposures. Simultaneous declines in Pb from other sources, changes in PbA sampling uncertainties over time largely related to changes in the size distribution of Pb-bearing particulate matter, and limitations regarding sampling size and exposure error may contribute to the variability in slope factor observed across peer-reviewed studies. Citation: Richmond-Bryant J, Meng Q, Davis A, Cohen J, Lu SE, Svendsgaard D, Brown JS, Tuttle L, Hubbard H, Rice J, Kirrane E, Vinikoor-Imler LC, Kotchmar D, Hines EP, Ross M. 2014. The Influence of declining air lead levels on blood lead–air lead slope factors in children. Environ Health Perspect 122:754

  16. Assessment of the effects of the Japanese shift to lead-free solders and its impact on material substitution and environmental emissions by a dynamic material flow analysis.

    PubMed

    Fuse, Masaaki; Tsunemi, Kiyotaka

    2012-11-01

    Lead-free electronics has been extensively studied, whereas their adoption by society and their impact on material substitution and environmental emissions are not well understood. Through a material flow analysis (MFA), this paper explores the life cycle flows for solder-containing metals in Japan, which leads the world in the shift to lead-free solders in electronics. The results indicate that the shift has been progressing rapidly for a decade, and that substitutes for lead in solders, which include silver and copper, are still in the early life cycle stages. The results also show, however, that such substitution slows down during the late life cycle stages owing to long electronic product lifespans. This deceleration of material substitution in the solder life cycle may not only preclude a reduction in lead emissions to air but also accelerate an increase in silver emissions to air and water. As an effective measure against ongoing lead emissions, our scenario analysis suggests an aggressive recycling program for printed circuit boards that utilizes an existing recycling scheme.

  17. Indoor air quality levels in a University Hospital in the Eastern Province of Saudi Arabia

    PubMed Central

    El-Sharkawy, Mahmoud F.; Noweir, Mohamed E. H.

    2014-01-01

    Aim of the Study: The complex hospital environment requires special attention to ensure a healthy indoor air quality (IAQ) to protect patients and healthcare workers against hospital-acquired infections and occupational diseases. Poor hospital IAQ may cause outbreaks of building-related illness such as headaches, fatigue, eye, and skin irritations, and other symptoms. The general objective for this study was to assess IAQ inside a large University hospital at Al-Khobar City in the Eastern Province of Saudi Arabia. Materials and Methods: Different locations representing areas where most activities and tasks are performed were selected as sampling points for air pollutants in the selected hospital. In addition, several factors were studied to determine those that were most likely to affect the IAQ levels. The temperature and relative percent humidity of different air pollutants were measured simultaneously at each location. Results: The outdoor levels of all air pollutant levels, except volatile organic compounds (VOCs), were higher than the indoor levels which meant that the IAQ inside healthcare facilities (HCFs) were greatly affected by outdoor sources, particularly traffic. The highest levels of total suspended particulates (TSPs) and those less than 10 microns (PM10) inside the selected hospital were found at locations that are characterized with m4ore human activity. Conclusions: Levels of particulate matter (both PM10 and TSP) were higher than the Air Quality Guidelines (AQGs). The highest concentrations of the fungal species recorded were Cladosporium and Penicillium. Education of occupants of HCF on IAQ is critical. They must be informed about the sources and effects of contaminants and the proper operation of the ventilation system. PMID:24696632

  18. Simulation and experiment of packaging of the fibre Bragg grating sensors using brazing/soldering methods

    NASA Astrophysics Data System (ADS)

    Wen, Changjin; Li, Yulong; Hu, Ronghua; Xu, Jianning

    2016-08-01

    To manufacture fibre Bragg grating (FBG) transducer, finite element model simulation and experimental verification of packaging of the FBG by brazing/soldering were investigated. The packaging processes and their impacts on the wavelength change of FBG were analysed. Simulation results showed that the Bragg wavelength of packaged FBG shifted down a level of ~10 nm. For experimental verification, temperature sensitivity of the packaged FBG was enhanced about twice of the bare FBG, while its spectrum was well preserved. The Bragg wavelength was shifted down a level of ~10 nm which was in accordance with the simulation.

  19. Trends in motor neuron disease: association with latitude and air lead levels in Spain.

    PubMed

    Santurtún, Ana; Villar, Alejandro; Delgado-Alvarado, Manuel; Riancho, Javier

    2016-08-01

    Motor neuron diseases (MND) are a group of disorders characterized by motor neuron degeneration. Among them, amyotrophic lateral sclerosis (ALS) is by far the most common in adulthood. This paper assesses the trend and geographical pattern in MND incidence in Spain and the possible air lead levels effect on this pathology. To confirm this concept, we performed a retrospective analysis of the deaths due to MND in Spain during 2000 and 2013, determined the geographical differences, and explored the relationship between MND and the air levels of lead. Overall, between 2000 and 2013, 11,355 people died in Spain because of MND. Disease mortality significantly increased in recent years (2007-2013) when compared with the first time of the period. Spearman's rank correlation coefficient also showed a statistically significant positive trend (CC = 0.824, p = 0.0002). Among people over 65 years, mortality rates were higher in Northern provinces. Moreover, we found a significant association of MND mortality with higher air lead levels (CC = 0.457, p = 0.01). Our study confirms that MND mortality is increasing in Spain, with a significant latitude gradient, which suggests an important role of environmental exposures. This ecological study suggests that air lead levels may be implicated in ALS pathogenesis.

  20. Precipitation and Air Temperature Impact on Seasonal Variations of Groundwater Levels

    NASA Astrophysics Data System (ADS)

    Vitola, Ilva; Vircavs, Valdis; Abramenko, Kaspars; Lauva, Didzis; Veinbergs, Arturs

    2012-12-01

    The aim of this study is to clarify seasonal effects of precipitation and temperature on groundwater level changes in monitoring stations of the Latvia University of Agriculture - Mellupīte, Bērze and Auce. Groundwater regime and level fluctuations depend on climatic conditions such as precipitation intensity, evapotranspiration, surface runoff and drainage, as well as other hydrological factors. The relationship between precipitation, air temperature and groundwater level fluctuations could also lead and give different perspective of possible changes in groundwater quality. Using mathematical statistics and graphic-analytic methods it is concluded that autumn and winter precipitation has the dominant impact on groundwater level fluctuations, whereas spring and summer season fluctuations are more dependent on the air temperature.

  1. Gross Alpha Beta Radioactivity in Air Filters Measured by Ultra Low Level α/β Counter

    NASA Astrophysics Data System (ADS)

    Cfarku, Florinda; Bylyku, Elida; Deda, Antoneta; Dhoqina, Polikron; Bakiu, Erjona; Perpunja, Flamur

    2010-01-01

    Study of radioactivity in air as very important for life is done regularly using different methods in every country. As a result of nuclear reactors, atomic centrals, institutions and laboratories, which use the radioactivity substances in open or closed sources, there are a lot radioactive wastes. Mixing of these wastes after treatment with rivers and lakes waters makes very important control of radioactivity. At the other side nuclear and radiological accidents are another source of the contamination of air and water. Due to their radio toxicity, especially those of Sr90, Pu239, etc. a contamination hazard for human begins exist even at low concentration levels. Measurements of radioactivity in air have been performed in many parts of the world mostly for assessment of the doses and risk resulting from consuming air. In this study we present the results of international comparison organized by IAEA Vienna, Austria for the air filters spiked with unknown Alpha and Beta Activity. For the calibration of system we used the same filters spiked: a) with Pu-239 as alpha source; b) Sr-90 as beta source and also the blank filter. The measurements of air filter samples after calibration of the system are done with Ultra Low Level α/β Counter (MPC 9604) Protean Instrument Corporation. The high sensitivity of the system for the determination of the Gross Alpha and Beta activity makes sure detection of low values activity of air filters. Our laboratory results are: Aα = (0.19±0.01) Bq/filter and Aα (IAEA) = (0.17±0.009) Bq/filter; Aβ = (0.33±0.009) Bq/filter and Aβ (IAEA) = (0.29±0.01) Bq/filter. As it seems our results are in good agreement with reference values given by IAEA (International Atomic Energy Agency).

  2. Methylene blue solder re-absorption in microvascular anastomoses

    NASA Astrophysics Data System (ADS)

    Birch, Jeremy F.; Hepplewhite, J.; Frier, Malcolm; Bell, Peter R. F.

    2003-06-01

    Soldered vascular anastomoses have been reported using several chromophores but little is known of the optimal conditions for microvascular anastomosis. There are some indications of the optimal protein contents of a solder, and the effects of methylene blue on anastomotic strength. The effects of varying laser power density in vivo have also been described, showing a high rate of thrombosis with laser power over 22.9Wcm-2. However no evidence exists to describe how long the solder remains at the site of the anastomosis. Oz et al reported that the fibrin used in their study had been almost completely removed by 90 days but without objective evidence of solder removal. In order to address the issue of solder re-absorption from the site of an anastomosis we used radio-labelled albumin (I-125) incorporated into methylene blue based solder. This was investigated in both the situation of the patent and thrombosed anastomosis with anastomoses formed at high and low power. Iodine-125 (half life: 60.2 days) was covalently bonded to porcine albumin and mixed with the solder solution. Radio-iodine has been used over many years to determine protein turnover using either I-125 or I-131. Iodine-125 labelled human albumin is regularly used as a radiopharmaceutical tool for the determination of plasma volume. Radio-iodine has the advantages of not affecting protein metabolism and the label is rapidly excreted after metabolic breakdown. Labelling with chromium (Cr-51) causes protein denaturation and is lost from the protein with time. Labelled albumin has been reported in human studies over a 21-day period, with similar results reported by Matthews. Most significantly McFarlane reported a different rate of catabolism of I-131 and I-125 over a 22-day period. The conclusion from this is that the rate of iodine clearance is a good indicator of protein catabolism. In parallel with the surgery a series of blank standards were prepared with a known mass of solder to correct for isotope

  3. Microstructural evolution of eutectic gold-tin solder joints

    NASA Astrophysics Data System (ADS)

    Song, Ho Geon

    Current trends toward miniaturization and the use of lead (Pb)-free solders in electronic packaging present new problems in the reliability of solder joints. This study was performed in order to understand the microstructure and microstructural evolution of small volumes of nominally eutectic Au-Sn solder joints (80Au-20Sn by weight), which gives insight into properties and reliability. The study particularly concentrated on the effects that the joint size and the type of substrate metallization have on both the bulk and interface microstructures of the joints. The systems studied were eutectic Au-Sn on Cu and Cu/electroless Ni/Au and for each system, two sets of sample geometries were used. Eutectic Au-Sn solder joints on Cu have microstructures that are very coarse on the scale of the joint, where the microstructure is strongly affected by the amount of Cu dissolution during reflow process. During aging, steady diffusion of Cu leads to the growth of Cu-rich interfacial intermetallic layers, significant consumption of substrate Cu, and formation of Kirkendall pores along the interface. Thermal cycling of the joints caused decomposition of the thick zeta(Cu)-phase into a fine-grained multiphase microstructure. The microstructures of eutectic Au-Sn solder joints on Cu/electroless Ni/Au are also very coarse due to the dissolution of Au used as a protective layer during soldering. Electroless Ni is shown to effectively act as a diffusion barrier for Cu. The electroless Ni near the interface evolves into a complicated structure due to the interfacial reaction. The solubility characteristics and diffusional behavior of substrate metals into eutectic Au-Sn solder determines the detailed microstructure and microstructural evolution of the ultrafine eutectic Au-Sn joints. Two important things to be noted from the results are as follows: First, the overall microstructures of these joints are very coarse with respect to the size of joint, and hence the properties of the

  4. [Winter serum levels of 25-hydroxy-vitamin D in Ushuaia and Buenos Aires].

    PubMed

    Oliveri, M B; Ladizesky, M; Somoza, J; Martínez, L; Mautalen, C

    1990-01-01

    Public Health Annals recording diagnosis of nutritional rickets in patients admitted in Public Hospitals disclosed that from birth to age 14, in the period 1980-1981, the incidence was 2.7 higher in the Patagonia (latitude 39 degrees S to 55 degrees S) compared with the Pampeana Region and 8.5 higher than in the rest of the country. After informed parental consent 37 healthy children of Buenos Aires (34 degrees S) with an age of (Av +/- 1 SD) 7.0 +/- 1.2 years, 29 with an age of 13.1 +/- 1.5 years and 63 of Ushuaia (55 degrees S) with an age of 7.1 +/- 0.8 years were studied at the end of winter (August). Serum levels of 25-OH-D were as follows (mean +/- SE): Buenos Aires: 21.1 +/- 2.03 ng/ml (Average: seven years old), 19.0 +/- 1.18 ng/ml (children of thirteen years old) and Ushuaia: 9.3 +/- 0.64 ng/ml (p less than 0.001) (Fig. 2). Serum levels were below 8 ng/ml in 52% of the children in Ushuaia but only in 9% in Buenos Aires. Serum calcium and alkaline phosphatase levels were similar in the two groups but serum phosphate was higher in Ushuaia (Table 1). The calcium intake was greater in Ushuaia (811 +/- 49 mg/day) than in Buenos Aires (634 +/- 61 mg/day) and was correlated with 25-OH-D levels in children of Ushuaia (r = 0.50, p less than 0.001) but not in Buenos Aires (r = 0.08). The main source of calcium intake was vitamin D fortified milk. These results disclosed a significantly diminished level of serum 25-OH-D in Ushuaia.(ABSTRACT TRUNCATED AT 250 WORDS)

  5. Benzene levels in ambient air and breath of smokers and nonsmokers in urban and pristine environments

    SciTech Connect

    Wester, R.C.; Maibach, H.I.; Gruenke, L.D.; Craig, J.C.

    1986-01-01

    Benzene levels in human breath and in ambient air were compared in the urban area of San Francisco (SF) and in a more remote coastal pristine setting of Stinson Beach, Calif. (SB). Benzene analysis was done by gas chromatography-mass spectroscopy (GC-MS). Ambient benzene levels were sevenfold higher in SF (2.6 +/- 1.3 ppb, n = 25) than SB (0.38 +/- 0.39 ppb, n = 21). In SF, benzene in smokers' breath (6.8 +/- 3.0 ppb) was greater than in nonsmokers' breath (2.5 +/- 0.8 ppb) and smokers' ambient air (3.3 +/- 0.8 ppb). In SB the same pattern was observed: benzene in smokers' breath was higher than in nonsmokers' breath and ambient air. Benzene in SF nonsmokers' breath was greater than in SB nonsmokers' breath. Marijuana-only smokers had benzene breath levels between those of smokers and nonsmokers. There was little correlation between benzene in breath and number of cigarettes smoked, or with other benzene exposures such as diet. Of special interest was the finding that benzene in breath of SF nonsmokers (2.5 +/- 0.8 ppb) was greater than that in nonsmokers ambient air (1.4 +/- 0.1 ppb). The same was true in SB, where benzene in nonsmokers breath was greater than ambient air (1.8 +/- 0.2 ppb versus 1.0 +/- 0.1 ppb on d 1 and 1.3 +/- 0.3 ppb versus 0.23 +/- 0.18 ppb on d 2). This suggests an additional source of benzene other than outdoor ambient air.

  6. Experimental Methods in Reduced-gravity Soldering Research

    NASA Technical Reports Server (NTRS)

    Pettegrew, Richard D.; Struk, Peter M.; Watson, John K.; Haylett, Daniel R.

    2002-01-01

    The National Center for Microgravity Research, NASA Glenn Research Center, and NASA Johnson Space Center are conducting an experimental program to explore the influence of reduced gravity environments on the soldering process. An improved understanding of the effects of the acceleration environment is important to application of soldering during current and future human space missions. Solder joint characteristics that are being considered include solder fillet geometry, porosity, and microstructural features. Both through-hole and surface mounted devices are being investigated. This paper focuses on the experimental methodology employed in this project and the results of macroscopic sample examination. The specific soldering process, sample configurations, materials, and equipment were selected to be consistent with those currently on-orbit. Other apparatus was incorporated to meet requirements imposed by operation onboard NASA's KC-135 research aircraft and instrumentation was provided to monitor both the atmospheric and acceleration environments. The contingent of test operators was selected to include both highly skilled technicians and less skilled individuals to provide a population cross-section that would be representative of the skill mix that might be encountered in space mission crews.

  7. Solder creep-fatigue interactions with flexible leaded parts

    NASA Technical Reports Server (NTRS)

    Ross, R. G., Jr.; Wen, L. C.; Mon, G. R.; Jetter, E.

    1992-01-01

    With flexible leaded parts, the solder-joint failure process involves a complex interplay of creep and fatigue mechanisms. To better understand the role of creep in typical multi-hour cyclic loading conditions, a specialized non-linear finite-element creep simulation computer program has been formulated. The numerical algorithm includes the complete part-lead-solder-PWB system, accounting for strain-rate dependence of creep on applied stress and temperature, and the role of the part-lead dimensions and flexibility that determine the total creep deflection (solder strain range) during stress relaxation. The computer program has been used to explore the effects of various solder creep-fatigue parameters such as lead height and stiffness, thermal-cycle test profile, and part/board differential thermal expansion properties. One of the most interesting findings is the strong presence of unidirectional creep-ratcheting that occurs during thermal cycling due to temperature dominated strain-rate effects. To corroborate the solder fatigue model predictions, a number of carefully controlled thermal-cycle tests have been conducted using special bimetallic test boards.

  8. 30 CFR 77.1916 - Welding, cutting, and soldering; fire protection.

    Code of Federal Regulations, 2012 CFR

    2012-07-01

    ... 30 Mineral Resources 1 2012-07-01 2012-07-01 false Welding, cutting, and soldering; fire... OF UNDERGROUND COAL MINES Slope and Shaft Sinking § 77.1916 Welding, cutting, and soldering; fire protection. (a) One portable fire extinguisher shall be provided where welding, cutting, or soldering...

  9. 30 CFR 77.1112 - Welding, cutting, or soldering with arc or flame; safeguards.

    Code of Federal Regulations, 2013 CFR

    2013-07-01

    ... 30 Mineral Resources 1 2013-07-01 2013-07-01 false Welding, cutting, or soldering with arc or... WORK AREAS OF UNDERGROUND COAL MINES Fire Protection § 77.1112 Welding, cutting, or soldering with arc or flame; safeguards. (a) When welding, cutting, or soldering with arc or flame near...

  10. 30 CFR 77.1112 - Welding, cutting, or soldering with arc or flame; safeguards.

    Code of Federal Regulations, 2010 CFR

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, or soldering with arc or... WORK AREAS OF UNDERGROUND COAL MINES Fire Protection § 77.1112 Welding, cutting, or soldering with arc or flame; safeguards. (a) When welding, cutting, or soldering with arc or flame near...

  11. 30 CFR 77.1916 - Welding, cutting, and soldering; fire protection.

    Code of Federal Regulations, 2014 CFR

    2014-07-01

    ... 30 Mineral Resources 1 2014-07-01 2014-07-01 false Welding, cutting, and soldering; fire... OF UNDERGROUND COAL MINES Slope and Shaft Sinking § 77.1916 Welding, cutting, and soldering; fire protection. (a) One portable fire extinguisher shall be provided where welding, cutting, or soldering...

  12. 30 CFR 77.1112 - Welding, cutting, or soldering with arc or flame; safeguards.

    Code of Federal Regulations, 2012 CFR

    2012-07-01

    ... 30 Mineral Resources 1 2012-07-01 2012-07-01 false Welding, cutting, or soldering with arc or... WORK AREAS OF UNDERGROUND COAL MINES Fire Protection § 77.1112 Welding, cutting, or soldering with arc or flame; safeguards. (a) When welding, cutting, or soldering with arc or flame near...

  13. 30 CFR 75.1106 - Welding, cutting, or soldering with arc or flame underground.

    Code of Federal Regulations, 2012 CFR

    2012-07-01

    ... 30 Mineral Resources 1 2012-07-01 2012-07-01 false Welding, cutting, or soldering with arc or... Protection § 75.1106 Welding, cutting, or soldering with arc or flame underground. All welding, cutting, or... conducted in fireproof enclosures. Welding, cutting, or soldering with arc or flame in other than...

  14. 30 CFR 77.1916 - Welding, cutting, and soldering; fire protection.

    Code of Federal Regulations, 2013 CFR

    2013-07-01

    ... 30 Mineral Resources 1 2013-07-01 2013-07-01 false Welding, cutting, and soldering; fire... OF UNDERGROUND COAL MINES Slope and Shaft Sinking § 77.1916 Welding, cutting, and soldering; fire protection. (a) One portable fire extinguisher shall be provided where welding, cutting, or soldering...

  15. 30 CFR 75.1106 - Welding, cutting, or soldering with arc or flame underground.

    Code of Federal Regulations, 2013 CFR

    2013-07-01

    ... 30 Mineral Resources 1 2013-07-01 2013-07-01 false Welding, cutting, or soldering with arc or... Protection § 75.1106 Welding, cutting, or soldering with arc or flame underground. All welding, cutting, or... conducted in fireproof enclosures. Welding, cutting, or soldering with arc or flame in other than...

  16. 30 CFR 75.1106 - Welding, cutting, or soldering with arc or flame underground.

    Code of Federal Regulations, 2011 CFR

    2011-07-01

    ... 30 Mineral Resources 1 2011-07-01 2011-07-01 false Welding, cutting, or soldering with arc or... Protection § 75.1106 Welding, cutting, or soldering with arc or flame underground. All welding, cutting, or... conducted in fireproof enclosures. Welding, cutting, or soldering with arc or flame in other than...

  17. 30 CFR 77.1112 - Welding, cutting, or soldering with arc or flame; safeguards.

    Code of Federal Regulations, 2014 CFR

    2014-07-01

    ... 30 Mineral Resources 1 2014-07-01 2014-07-01 false Welding, cutting, or soldering with arc or... WORK AREAS OF UNDERGROUND COAL MINES Fire Protection § 77.1112 Welding, cutting, or soldering with arc or flame; safeguards. (a) When welding, cutting, or soldering with arc or flame near...

  18. 30 CFR 75.1106 - Welding, cutting, or soldering with arc or flame underground.

    Code of Federal Regulations, 2014 CFR

    2014-07-01

    ... 30 Mineral Resources 1 2014-07-01 2014-07-01 false Welding, cutting, or soldering with arc or... Protection § 75.1106 Welding, cutting, or soldering with arc or flame underground. All welding, cutting, or... conducted in fireproof enclosures. Welding, cutting, or soldering with arc or flame in other than...

  19. 30 CFR 75.1106 - Welding, cutting, or soldering with arc or flame underground.

    Code of Federal Regulations, 2010 CFR

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, or soldering with arc or... Protection § 75.1106 Welding, cutting, or soldering with arc or flame underground. All welding, cutting, or... conducted in fireproof enclosures. Welding, cutting, or soldering with arc or flame in other than...

  20. 30 CFR 77.1112 - Welding, cutting, or soldering with arc or flame; safeguards.

    Code of Federal Regulations, 2011 CFR

    2011-07-01

    ... 30 Mineral Resources 1 2011-07-01 2011-07-01 false Welding, cutting, or soldering with arc or... WORK AREAS OF UNDERGROUND COAL MINES Fire Protection § 77.1112 Welding, cutting, or soldering with arc or flame; safeguards. (a) When welding, cutting, or soldering with arc or flame near...

  1. Making air quality indices comparable--assessment of 10 years of air pollutant levels in western Europe.

    PubMed

    Lokys, Hanna Leona; Junk, Jürgen; Krein, Andreas

    2015-01-01

    To address the incomparability of the large number of existing air quality indices, we propose a new normalization method that is suited to directly compare air quality indices based on the common European World Health Organization (WHO) air quality guidelines for NO2, O3, and PM10. Using this method, we compared three air quality indices based on the European guidelines, related them to another air quality index based on the relative risk concept, and used them to assess the air quality and its trends in northwest central Europe. The average air quality in the area of investigation is below the recommended European guidelines. The majority of index values exceeding this threshold are caused by PM10, which is also, in most cases, responsible for the degrading trends in air quality. Eleven out of 29 stations tested showed significant trends, of which eight indicated trends towards better air quality.

  2. On evaluating compliance with air pollution levels 'not to be exceeded more than once per year'

    NASA Technical Reports Server (NTRS)

    Neustadter, H. E.; Sidik, S. M.

    1974-01-01

    The point of view taken is that the Environmental Protection Agency (EPA) Air Quality Standards (AQS) represent conditions which must be made to exist in the ambient environment. The statistical techniques developed should serve as tools for measuring the closeness to achieving the desired quality of air. It is shown that the sampling frequency recommended by EPA is inadequate to meet these objectives when the standard is expressed as a level not to be exceeded more than once per year and sampling frequency is once every three days or less frequent.

  3. An evaluation of the spring finger solder joints on SA1358-10 and SA2052-4 connector assemblies (MC3617,W87).

    SciTech Connect

    Kilgo, Alice C.; Vianco, Paul Thomas; Hlava, Paul Frank; Zender, Gary L.

    2006-08-01

    remelting of the spring finger solder joint. The Cd (Cr) layer did not show signs of spalling. These results suggested that, due to the size of the SA1358-10 connector, any of the former or current soldering processes used to attach the EMR adapter ring and/or EMR shell to the connector shell, requires a level of heat energy that will always result in the remelting of the spring finger solder joint attached with either the Sn-Ag or the Sn-Sb alloy. Lastly, it was construed that the induction soldering process, which is used to attach the EMR adapter ring onto the shell, was more likely to have caused the remelting event rather than the more localized heat source of the hand soldering iron used to attach the EMR shell to the adapter ring.

  4. Comparing rural ground and air emergency medical services: a level I trauma center's experience.

    PubMed

    von Recklinghausen, Friedrich Maximilian

    2011-01-01

    We sought to compare differences in patients transported by ground and air emergency medical services directly from the scenes of their injuries to a rural level I trauma facility. Variables examined included age, gender, vital signs, Glasgow Coma Scale score, discharge location, length of stay, and survival metrics. Student t tests and odds ratios were used for analysis. Demographics and vital signs differed between trauma patients transported by air versus those transported by ground. Generally, length of stay was longer in air-transported patients, who also had poorer survival metrics with negligible risk of death. Significant differences exist in the markers of physiology such as vital signs, expected survival, and degree of injury. PMID:22157533

  5. Effects of solder temperature on pin through-hole during wave soldering: thermal-fluid structure interaction analysis.

    PubMed

    Aziz, M S Abdul; Abdullah, M Z; Khor, C Y

    2014-01-01

    An efficient simulation technique was proposed to examine the thermal-fluid structure interaction in the effects of solder temperature on pin through-hole during wave soldering. This study investigated the capillary flow behavior as well as the displacement, temperature distribution, and von Mises stress of a pin passed through a solder material. A single pin through-hole connector mounted on a printed circuit board (PCB) was simulated using a 3D model solved by FLUENT. The ABAQUS solver was employed to analyze the pin structure at solder temperatures of 456.15 K (183(°)C) < T < 643.15 K (370(°)C). Both solvers were coupled by the real time coupling software and mesh-based parallel code coupling interface during analysis. In addition, an experiment was conducted to measure the temperature difference (ΔT) between the top and the bottom of the pin. Analysis results showed that an increase in temperature increased the structural displacement and the von Mises stress. Filling time exhibited a quadratic relationship to the increment of temperature. The deformation of pin showed a linear correlation to the temperature. The ΔT obtained from the simulation and the experimental method were validated. This study elucidates and clearly illustrates wave soldering for engineers in the PCB assembly industry. PMID:25225638

  6. Corrosion Issues in Solder Joint Design and Service

    SciTech Connect

    VIANCO,PAUL T.

    1999-11-24

    Corrosion is an important consideration in the design of a solder joint. It must be addressed with respect to the service environment or, as in the case of soldered conduit, as the nature of the medium being transported within piping or tubing. Galvanic-assisted corrosion is of particular concern, given the fact that solder joints are comprised of different metals or alloy compositions that are in contact with one-another. The (thermodynamic) potential for corrosion to take place in a particular environment requires the availability of the galvanic series for those conditions and which includes the metals or alloys in question. However, the corrosion kinetics, which actually determine the rate of material loss under the specified service conditions, are only available through laboratory evaluations or field data that are found in the existing literature or must be obtained by in-house testing.

  7. Solder wetting kinetics in narrow V-grooves

    SciTech Connect

    Yost, F.G.; Rye, R.R.; Mann, J.A. Jr.

    1997-12-01

    Experiments are performed to observe capillary flow in grooves cut into copper surfaces. Flow kinetics of two liquids, 1-heptanol and eutectic Sn-Pb solder, are modeled with modified Washburn kinetics and compared to flow data. It is shown that both liquids flow parabolically in narrow V-grooves, and the data scale as predicted by the modified Washburn model. The early portions of the flow kinetics are characterized by curvature in the length vs time relationship which is not accounted for in the modified Washburn model. This effect is interpreted in terms of a dynamic contact angle. It is concluded that under conditions of rapid flow, solder spreading can be understood as a simple fluid flow process. Slower kinetics, e.g. solder droplet spreading on flat surfaces, may be affected by subsidiary chemical processes such as reaction.

  8. Development of alternatives to lead-bearing solders

    SciTech Connect

    Vianco, P.T.

    1993-07-01

    Soldering technology, using tin-lead alloys has had a significant role in the packaging of highly functional, low cost electronic devices. The elimination of lead from all manufactured products, whether through legislation or tax incentives, will impact the electronics community which uses lead-containing solders. In response to these proposed measures, the National Center for Manufacturing Sciences has established a multi-year program involving participants from industry, academia, and the national laboratories with the objective to identify potential replacements for lead-bearing solders. Selection of candidate alloys is based upon the analysis of materials properties, manufacturability, modeling codes for reliability prediction, as well as toxicological properties and resource availability, data developed in the program.

  9. Materials chemistry. Composition-matched molecular "solders" for semiconductors.

    PubMed

    Dolzhnikov, Dmitriy S; Zhang, Hao; Jang, Jaeyoung; Son, Jae Sung; Panthani, Matthew G; Shibata, Tomohiro; Chattopadhyay, Soma; Talapin, Dmitri V

    2015-01-23

    We propose a general strategy to synthesize largely unexplored soluble chalcogenidometallates of cadmium, lead, and bismuth. These compounds can be used as "solders" for semiconductors widely used in photovoltaics and thermoelectrics. The addition of solder helped to bond crystal surfaces and link nano- or mesoscale particles together. For example, CdSe nanocrystals with Na2Cd2Se3 solder was used as a soluble precursor for CdSe films with electron mobilities exceeding 300 square centimeters per volt-second. CdTe, PbTe, and Bi2Te3 powders were molded into various shapes in the presence of a small additive of composition-matched chalcogenidometallate or chalcogel, thus opening new design spaces for semiconductor technologies. PMID:25569110

  10. Reliability assessment of indium solder for low temperature electronic packaging

    NASA Astrophysics Data System (ADS)

    Chang, Rui W.; Patrick McCluskey, F.

    2009-11-01

    Indium is the choice of material for cryogenic joining applications. It is superior under repeated wide temperature excursions including extreme cold temperatures (below -55 °C) because of its excellent electrical conductivity and ductility at cryogenic temperatures. In particular, it is being considered for die/substrate attaches in low temperature SiGe BiCMOS modules for Martian and Lunar exploration. An efficient and systematic assessment was conducted to evaluate the reliability of indium solder under thermal fatigue and extended cold temperature mechanical fatigue conditions encountered in space exploration missions. In addition, fatigue failure sites, modes and mechanisms in indium solder at low temperature were investigated. A fatigue model was also calibrated for indium solder joint at cryogenic temperatures.

  11. Materials chemistry. Composition-matched molecular "solders" for semiconductors.

    PubMed

    Dolzhnikov, Dmitriy S; Zhang, Hao; Jang, Jaeyoung; Son, Jae Sung; Panthani, Matthew G; Shibata, Tomohiro; Chattopadhyay, Soma; Talapin, Dmitri V

    2015-01-23

    We propose a general strategy to synthesize largely unexplored soluble chalcogenidometallates of cadmium, lead, and bismuth. These compounds can be used as "solders" for semiconductors widely used in photovoltaics and thermoelectrics. The addition of solder helped to bond crystal surfaces and link nano- or mesoscale particles together. For example, CdSe nanocrystals with Na2Cd2Se3 solder was used as a soluble precursor for CdSe films with electron mobilities exceeding 300 square centimeters per volt-second. CdTe, PbTe, and Bi2Te3 powders were molded into various shapes in the presence of a small additive of composition-matched chalcogenidometallate or chalcogel, thus opening new design spaces for semiconductor technologies.

  12. Background information on sources of low-level radionuclide emissions to air

    SciTech Connect

    Corbit, C.D.; Herrington, W.N.; Higby, D.P.; Stout, L.A.; Corley, J.P.

    1983-09-01

    This report provides a general description and reported emissions for eight low-level radioactive source categories, including facilties that are licensed by the Nuclear Regulatory Commission (NRC) and Agreement States, and non-Department of Energy (DOE) federal facilities. The eight categories of low-level radioactive source facilities covered by this report are: research and test reactors, accelerators, the radiopharmaceutical industry, source manufacturers, medical facilities, laboratories, naval shipyards, and low-level commercial waste disposal sites. Under each category five elements are addressed: a general description, a facility and process description, the emission control systems, a site description, and the radionuclides released to air (from routine operations).

  13. Techno-Economic Analysis of Indian Draft Standard Levels for RoomAir Conditioners

    SciTech Connect

    McNeil, Michael A.; Iyer, Maithili

    2007-03-01

    The Indian Bureau of Energy Efficiency (BEE) finalized its first set of efficiency standards and labels for room air conditioners in July of 2006. These regulations followed soon after the publication of levels for frost-free refrigerators in the same year. As in the case of refrigerators, the air conditioner program introduces Minimum Efficiency Performance Standards (MEPS) and comparative labels simultaneously, with levels for one to five stars. Also like the refrigerator program, BEE defined several successive program phases of increasing stringency. In support of BEE's refrigerator program, Lawrence Berkeley National Laboratory (LBNL) produced an analysis of national impacts of standards in collaboration with the Collaborative Labeling and Standards Program (CLASP). That analysis drew on LBNL's experience with standards programs in the United States, as well as many other countries. Subsequently, as part of the process for setting optimal levels for air conditioner regulations, CLASP commissioned LBNL to provide support to BEE in the form of a techno-economic evaluation of air conditioner efficiency technologies. This report describes the methodology and results of this techno-economic evaluation. The analysis consists of three components: (1) Cost effectiveness to consumers of efficiency technologies relative to current baseline. (2) Impacts on the current market from efficiency regulations. (3) National energy and financial impacts. The analysis relied on detailed and up-to-date technical data made available by BEE and industry representatives. Technical parameters were used in conjunction with knowledge about air conditioner use patterns in the residential and commercial sectors, and prevailing marginal electricity prices, in order to give an estimate of per-unit financial impacts. In addition, the overall impact of the program was evaluated by combining unit savings with market forecasts in order to yield national impacts. LBNL presented preliminary results

  14. Combining regression analysis and air quality modelling to predict benzene concentration levels

    NASA Astrophysics Data System (ADS)

    Vlachokostas, Ch.; Achillas, Ch.; Chourdakis, E.; Moussiopoulos, N.

    2011-05-01

    State of the art epidemiological research has found consistent associations between traffic-related air pollution and various outcomes, such as respiratory symptoms and premature mortality. However, many urban areas are characterised by the absence of the necessary monitoring infrastructure, especially for benzene (C 6H 6), which is a known human carcinogen. The use of environmental statistics combined with air quality modelling can be of vital importance in order to assess air quality levels of traffic-related pollutants in an urban area in the case where there are no available measurements. This paper aims at developing and presenting a reliable approach, in order to forecast C 6H 6 levels in urban environments, demonstrated for Thessaloniki, Greece. Multiple stepwise regression analysis is used and a strong statistical relationship is detected between C 6H 6 and CO. The adopted regression model is validated in order to depict its applicability and representativeness. The presented results demonstrate that the adopted approach is capable of capturing C 6H 6 concentration trends and should be considered as complementary to air quality monitoring.

  15. BTEX in indoor air of waterpipe cafés: Levels and factors influencing their concentrations.

    PubMed

    Hazrati, Sadegh; Rostami, Roohollah; Fazlzadeh, Mehdi

    2015-08-15

    BTEX (benzene, toluene, ethylbenzene and xylene) concentrations, factors affecting their levels, and the exposure risks related to these compounds were studied in waterpipe (Ghalyun/Hookah) cafés of Ardabil city in Islamic Republic of Iran. 81 waterpipe cafés from different districts of Ardabil city were selected and their ambient air was monitored for BTEX compounds. Air samples were taken from standing breathing zone of employees, ~150 cm above the ground level, and were analyzed using GC-FID. In each case, the types of smoked tobacco (regular, fruit flavored), types of ventilation systems (natural/artificial), and the floor level at which the café was located were investigated. A high mean concentration of 4.96±2.63 mg/m(3) corresponding to long term exposure to benzene-related cancer risk of 4314×10(-6) was estimated. The levels of the remaining compounds were lower than the national guideline limits, but their hazard quotients (HQ) for long term exposure to ethylbenzene (1.15) and xylene (17.32) exceeded the HQ unit value. Total hazard indices (HI) of 63.23 were obtained for non-cancer risks. Type of the smoked tobacco was the most important factor influencing BTEX concentrations in the cafés. BTEX concentrations in indoor ambient air of Ardabil waterpipe cafés were noticeably high, and therefore may pose important risks for human health on both short and long term exposures. PMID:25912530

  16. A ban on use of lead-bearing solders: Implications for the electronics industry

    SciTech Connect

    Vianco, P.T.; Yost, F.G.

    1992-04-01

    This white paper addresses the issue of banning lead from solders used in electronics manufacturing. The current efforts by legislative bodies and regulatory agencies to curtail the use of lead in manufactured goods, including solders, are described. In response to a ban on lead or the imposition of a tax which makes lead uneconomical for use in solder alloys, alternative technologies including lead-free solders and conductive epoxies are presented. The recommendation is made that both users and producers of solder materials join together as partners in a consortium to address this issue in a timely and cost-effective manner.

  17. Process characterization and control of hand-soldered printed wiring assemblies

    SciTech Connect

    Cheray, D.L.; Mandl, R.G.

    1993-09-01

    A designed experiment was conducted to characterize the hand soldering process parameters for manufacturing printed wiring assemblies (PWAs). Component tinning was identified as the most important parameter in hand soldering. After tinning, the soldering iron tip temperature of 700{degrees}F and the choice of operators influence solder joint quality more than any other parameters. Cleaning and flux/flux core have little impact on the quality of the solder joint. The need for component cleaning prior to assembly must be evaluated for each component.

  18. Preparation of Sn—Ag—In ternary solder bumps by electroplating in sequence and reliability

    NASA Astrophysics Data System (ADS)

    Dongliang, Wang; Yuan, Yuan; Le, Luo

    2011-08-01

    This paper describes a technique that can obtain ternary Sn—Ag—In solder bumps with fine pitch and homogenous composition distribution. The mainfeature of this process is that tin-silver and indium are electroplated on copper under bump metallization (UBM) in sequence. After an accurate reflow process, Sn1.8Ag9.4In solder bumps are obtained. It is found that the intermetallic compounds (IMCs) between Sn—Ag—In solder and Cu grow with the reflow time, which results in an increase in Ag concentration in the solder area. So during solidification, more Ag2In nucleates and strengthens the solder.

  19. Low-level NOx removal in ambient air by pulsed corona technology

    NASA Astrophysics Data System (ADS)

    Beckers, F. J. C. M.; Hoeben, W. F. L. M.; Pemen, A. J. M.; van Heesch, E. J. M.

    2013-07-01

    Although removal of NOx by (pulsed) corona discharges has been thoroughly investigated for high concentrations of NOx in flue gas, removal of low levels in ambient air proves to be a difficult task. (Sub) ppm NOx levels exist in traffic tunnels due to accumulation of exhaust gases. The application of pulsed corona technology for purification of traffic tunnel air is studied during a series of lab and field experiments. An industrial pilot scale wire-cylinder type corona reactor has been utilized. Lab tests have been carried out using a diesel generator as NOx source. NOx conversion levels have been determined by applying two Recordum Airpointers (chemiluminescence-based detection). The detector appeared to be cross-sensitive for HNO3 and high levels of O3. NOx removal rates of 60-80% were obtained for inlet levels of 2-10 ppm. The SIE value of 10 ppm NOx removal is 7 J l-1. The corona discharges produce ppm level NOx at high energy densities. This intrinsic NOx production limits removal of inlet levels due to equilibrium between production and oxidation.

  20. Air pollution critical levels in central México protected natural areas

    NASA Astrophysics Data System (ADS)

    Ruiz Suarez, L.; Andraca Ayala, G.; Mar Morales, B.; Garcia-reynoso, J.; Torres-JArdon, R.

    2013-05-01

    All the Natural Protected Areas (NPA) within the Central Mexico City Belt comprising five metropolitan areas including MCMA are under strong impact from air pollution. Ozone, nitrogen oxides and sulfur dioxide exceed critical levels for several types of vegetation. In this work we show the critical level maps for ozone, nitrogen oxides and sulfur dioxide for Sierra of Chichinautzin, the mountain that acts as the physical barrier to air pollution dispersion south of Mexico City Metropolitan Area, what makes of it a receptor area to MCMA pollution. Maps were made combining model outputs from WRF-Chem and passive samplers. We also describe a proposal to extend the observation network to all natural protected areas within the Central Mexico City Belt.

  1. Global surface air temperature in 1995: Return to pre-Pinatubo level

    NASA Astrophysics Data System (ADS)

    Hansen, J.; Ruedy, R.; Sato, M.; Reynolds, R.

    Global surface air temperature has increased about 0.5°C from the minimum of mid-1992, a year after the Mt. Pinatubo eruption. Both a land-based surface air temperature record and a land-marine temperature index place the meteorological year 1995 at approximately the same level as 1990, previously the warmest year in the period of instrumental data. As El Niño warming was small in 1995, the solar cycle near a minimum, and ozone depletion near record levels, the observed high temperature supports the contention of an underlying global warming trend. The pattern of Northern Hemisphere temperature change in recent decades appears to reflect a change of atmospheric dynamics.

  2. Creep deformation behavior in eutectic Sn-Ag solder joints using a novel mapping technique

    SciTech Connect

    Lucas, J.P.; Guo, F.; McDougall, J.; Bieler, T.R.; Subramanian, K.N.; Park, J.K.

    1999-11-01

    Creep deformation behavior was measured for 60--100 {micro}m thick solder joints. The solder joints investigated consisted of: (1) non-composite solder joints made with eutectic Sn-Ag solder, and (2) composite solder joints with eutectic Sn-Ag solder containing 20 vol.%, 5 {micro}m diameter in-situ Cu{sub 6}Sn{sub 5} intermetallic reinforcements. All creep testing in this study was carried out at room temperature. Qualitative and quantitative assessment of creep deformation was characterized on the solder joints. Creep deformation was analyzed using a novel mapping technique where a geometrical-regular line pattern was etched over the entire solder joint using excimer laser ablation. During creep, the laser-ablation (LA) pattern becomes distorted due to deformation in the solder joint. By imaging the distortion of laser-ablation patterns using the SEM, actual deformation mapping for the entire solder joint is revealed. The technique involves sequential optical/digital imaging of the deformation versus time history during creep. By tracing and recording the deformation of the LA patterns on the solder over intervals of time, local creep data are obtained in many locations in the joint. This analysis enables global and localized creep shear strains and strain rate to be determined.

  3. Occupational exposure to acrylamide in closed system production plants: air levels and biomonitoring.

    PubMed

    Moorman, William J; Reutman, Susan S; Shaw, Peter B; Blade, Leo Michael; Marlow, David; Vesper, Hubert; Clark, John C; Schrader, Steven M

    2012-01-01

    The aim of this study was to evaluate biomarkers of acrylamide exposure, including hemoglobin adducts and urinary metabolites in acrylamide production workers. Biomarkers are integrated measures of the internal dose, and it is total acrylamide dose from all routes and sources that may present health risks. Workers from three companies were studied. Workers potentially exposed to acrylamide monomer wore personal breathing-zone air samplers. Air samples and surface-wipe samples were collected and analyzed for acrylamide. General-area air samples were collected in chemical processing units and control rooms. Hemoglobin adducts were isolated from ethylenediamine teraacetic acid (EDTA)-whole blood, and adducts of acrylamide and glycidamide, at the N-terminal valines of hemoglobin, were cleaved from the protein chain by use of a modified Edman reaction. Full work-shift, personal breathing zone, and general-area air samples were collected and analyzed for particulate and acrylamide monomer vapor. The highest general-area concentration of acrylamide vapor was 350 μg/cm(3) in monomer production. Personal breathing zone and general-area concentrations of acrylamide vapor were found to be highest in monomer production operations, and lower levels were in the polymer production operations. Adduct levels varied widely among workers, with the highest in workers in the monomer and polymer production areas. The acrylamide adduct range was 15-1884 pmol/g; glycidamide adducts ranged from 17.8 to 1376 p/mol/g. The highest acrylamide and glycidamide adduct levels were found among monomer production process operators. The primary urinary metabolite N-acetyl-S-(2-carbamoylethyl) cysteine (NACEC) ranged from the limit of detection to 15.4 μg/ml. Correlation of workplace exposure and sentinel health effects is needed to determine and control safe levels of exposure for regulatory standards.

  4. Impact of natural gas extraction on Pah levels in ambient air

    PubMed Central

    Paulik, L. Blair; Donald, Carey E.; Smith, Brian W.; Tidwell, Lane G.; Hobbie, Kevin A.; Kincl, Laurel; Haynes, Erin N.; Anderson, Kim A.

    2015-01-01

    Natural gas extraction, often referred to as “fracking,” has increased rapidly in the U.S. in recent years. To address potential health impacts, passive air samplers were deployed in a rural community heavily affected by the natural gas boom. Samplers were analyzed for 62 polycyclic aromatic hydrocarbons (PAHs). Results were grouped based on distance from each sampler to the nearest active well. PAH levels were highest when samplers were closest to active wells. Additionally, PAH levels closest to natural gas activity were an order of magnitude higher than levels previously reported in rural areas. Sourcing ratios indicate that PAHs were predominantly petrogenic, suggesting that elevated PAH levels were influenced by direct releases from the earth. Quantitative human health risk assessment estimated the excess lifetime cancer risks associated with exposure to the measured PAHs. Closest to active wells, the risk estimated for maximum residential exposure was 2.9 in 10,000, which is above the U.S. EPA's acceptable risk level. Overall, risk estimates decreased 30% when comparing results from samplers closest to active wells to those farthest. This work suggests that natural gas extraction may be contributing significantly to PAHs in air, at levels that are relevant to human health. PMID:25810398

  5. Impact of natural gas extraction on PAH levels in ambient air.

    PubMed

    Paulik, L Blair; Donald, Carey E; Smith, Brian W; Tidwell, Lane G; Hobbie, Kevin A; Kincl, Laurel; Haynes, Erin N; Anderson, Kim A

    2015-04-21

    Natural gas extraction, often referred to as "fracking," has increased rapidly in the U.S. in recent years. To address potential health impacts, passive air samplers were deployed in a rural community heavily affected by the natural gas boom. Samplers were analyzed for 62 polycyclic aromatic hydrocarbons (PAHs). Results were grouped based on distance from each sampler to the nearest active well. PAH levels were highest when samplers were closest to active wells. Additionally, PAH levels closest to natural gas activity were an order of magnitude higher than levels previously reported in rural areas. Sourcing ratios indicate that PAHs were predominantly petrogenic, suggesting that elevated PAH levels were influenced by direct releases from the earth. Quantitative human health risk assessment estimated the excess lifetime cancer risks associated with exposure to the measured PAHs. Closest to active wells, the risk estimated for maximum residential exposure was 2.9 in 10 000, which is above the U.S. EPA's acceptable risk level. Overall, risk estimates decreased 30% when comparing results from samplers closest to active wells to those farthest. This work suggests that natural gas extraction may be contributing significantly to PAHs in air, at levels that are relevant to human health. PMID:25810398

  6. Impact of natural gas extraction on PAH levels in ambient air.

    PubMed

    Paulik, L Blair; Donald, Carey E; Smith, Brian W; Tidwell, Lane G; Hobbie, Kevin A; Kincl, Laurel; Haynes, Erin N; Anderson, Kim A

    2015-04-21

    Natural gas extraction, often referred to as "fracking," has increased rapidly in the U.S. in recent years. To address potential health impacts, passive air samplers were deployed in a rural community heavily affected by the natural gas boom. Samplers were analyzed for 62 polycyclic aromatic hydrocarbons (PAHs). Results were grouped based on distance from each sampler to the nearest active well. PAH levels were highest when samplers were closest to active wells. Additionally, PAH levels closest to natural gas activity were an order of magnitude higher than levels previously reported in rural areas. Sourcing ratios indicate that PAHs were predominantly petrogenic, suggesting that elevated PAH levels were influenced by direct releases from the earth. Quantitative human health risk assessment estimated the excess lifetime cancer risks associated with exposure to the measured PAHs. Closest to active wells, the risk estimated for maximum residential exposure was 2.9 in 10 000, which is above the U.S. EPA's acceptable risk level. Overall, risk estimates decreased 30% when comparing results from samplers closest to active wells to those farthest. This work suggests that natural gas extraction may be contributing significantly to PAHs in air, at levels that are relevant to human health.

  7. 5 CFR 842.811 - Deposits for second-level supervisory air traffic controller service performed before February 10...

    Code of Federal Regulations, 2012 CFR

    2012-01-01

    ... 5 Administrative Personnel 2 2012-01-01 2012-01-01 false Deposits for second-level supervisory air traffic controller service performed before February 10, 2004. 842.811 Section 842.811 Administrative... Regulations Pertaining to Noncodified Statutes § 842.811 Deposits for second-level supervisory air...

  8. 5 CFR 842.811 - Deposits for second-level supervisory air traffic controller service performed before February 10...

    Code of Federal Regulations, 2014 CFR

    2014-01-01

    ... 5 Administrative Personnel 2 2014-01-01 2014-01-01 false Deposits for second-level supervisory air traffic controller service performed before February 10, 2004. 842.811 Section 842.811 Administrative... Regulations Pertaining to Noncodified Statutes § 842.811 Deposits for second-level supervisory air...

  9. 5 CFR 842.811 - Deposits for second-level supervisory air traffic controller service performed before February 10...

    Code of Federal Regulations, 2013 CFR

    2013-01-01

    ... 5 Administrative Personnel 2 2013-01-01 2013-01-01 false Deposits for second-level supervisory air traffic controller service performed before February 10, 2004. 842.811 Section 842.811 Administrative... Regulations Pertaining to Noncodified Statutes § 842.811 Deposits for second-level supervisory air...

  10. Thermal Stress of Surface Oxide Layer on Micro Solder Bumps During Reflow

    NASA Astrophysics Data System (ADS)

    Key Chung, C.; Zhu, Z. X.; Kao, C. R.

    2015-02-01

    Micro-bumps are now being developed with diameters smaller than 10 μm. At these dimensions, only very small amounts of solder are used to form the interconnections. Surface oxidation of such small micro-bumps is a critical issue. The key question is whether the oxide film on the solder bumps acts as a barrier to formation of solder joints. In this work, the mechanical stability of the oxide layer on solder bumps was investigated. Solder bumps with 35- μm radii were heated for different times. Auger electron spectroscopy was used to determine the thickness of the oxide layer on the solder bumps. Solder bumps with known oxide layer thicknesses were then heated in a low-oxygen environment (<50 ppm) until they melted. The mechanical stability of the oxide layer was observed by use of a high-speed camera. Results showed that a 14-nm-thick oxide layer on a solder bump of radius 35 μm was able to withstand the molten solder without cracking, leading to a non-wetting solder joint. A thermal stress model of the surface oxide layer revealed that the stress varied substantially with bump size and temperature, and increased almost linearly with temperature. Upon melting, the thermal stress on the oxide increased abruptly, because of the higher thermal expansion of molten solder compared with its solid state. On the basis of the experimental results and the thermal stress model of the oxide film, the maximum oxide thickness that can be tolerated to form a solder joint was determined, e.g. 14 nm oxide can support liquid solder, and thus lead to a non-wetting condition. This work provided a new method of determination of the maximum stress of oxide film for solder joint formation.

  11. Cyclic siloxanes in air, including identification of high levels in Chicago and distinct diurnal variation.

    PubMed

    Yucuis, Rachel A; Stanier, Charles O; Hornbuckle, Keri C

    2013-08-01

    The organosilicon compounds octamethylcyclotetrasiloxane (D4), decamethylcyclopentasiloxane (D5), and dodecamethylcyclohexasiloxane (D6) are high production volume chemicals that are widely used in household goods and personal care products. Due to their prevalence and chemical characteristics, cyclic siloxanes are being assessed as possible persistent organic pollutants. D4, D5, and D6 were measured in indoor and outdoor air to quantify and compare siloxane concentrations and compound ratios depending on location type. Indoor air samples had a median concentration of 2200 ng m(-3) for the sum of D4, D5, and D6. Outdoor sampling locations included downtown Chicago, Cedar Rapids, IA, and West Branch, IA, and had median sum siloxane levels of 280, 73, and 29 ng m(-3) respectively. A diurnal trend is apparent in the samples taken in downtown Chicago. Nighttime samples had a median 2.7 times higher on average than daytime samples, which is due, in part, to the fluctuations of the planetary boundary layer. D5 was the dominant siloxane in both indoor and outdoor air. Ratios of D5 to D4 averaged 91 and 3.2 for indoor and outdoor air respectively.

  12. Indoor air quality in Portuguese archives: a snapshot on exposure levels.

    PubMed

    Pinheiro, A C; Viegas, C; Viegas, S; Veríssimo, C; Brandão, J; Macedo, M F

    2012-01-01

    Indoor air quality recently entered legislation in Portugal. Several parameters must be evaluated and kept within limits in order to obtain a certification for air quality and energy consumption. Certification parameters were analyzed in two Portuguese archives in order to assess indoor air quality both for people attending or working on these premises and for maintenance of a written heritage that must be retained for future generations. Carbon monoxide (CO) and carbon dioxide (CO₂), formaldehyde, and fungal counts were kept within stipulated limits. Relative humidity (RH), volatile organic compounds (VOC), particulate matter (PM₁₀), and ozone (O₃) showed values above legislated levels and justified the implementation of corrective measures. In terms of conservation, studies on the limit values are still needed, but according to the available international guidelines, some of the analyzed parameters such as PM₁₀, O₃, and RH were also above desirable values. Corrective measures were proposed to these institutions. Although this study was only of a short duration, it proved valuable in assessing potential eventual problems and constitutes the first Portuguese indoor air quality assessment taking into consideration both aspects of an archive such as human health and heritage safekeeping.

  13. Long-term trends in ambient air 1,3-butadiene levels in Houston, Texas.

    PubMed

    Hendler, Albert H; Goodmanson Bunch, Alea T; Crow, Walter L

    2010-10-01

    1,3-Butadiene is one of the top air pollution risk drivers in the United States. The ambient air concentrations in Houston, TX are of particular interest because of the relatively large number of stationary industrial sources that report 1,3-butadiene emissions and the relatively large number of vehicle miles traveled every day on Houston roadways. Several Federal and State regulatory programs initiated over the last two decades regulate the amount of 1,3-butadiene emitted to the air from industrial, mobile, and area sources. Emissions reductions from industrial sources in Houston have also been achieved through voluntary agreements between individual facilities and the Texas Commission on Environmental Quality (TCEQ). The impact of these regulatory and voluntary initiatives on air quality has been measured by a network of 30 monitors stationed within the Houston area. Most of the area's monitors have measured reductions in annual average 1,3-butadiene levels in the range of 40-80%. The greatest decreases and statistically significant downward trends have been measured at the monitoring sites closest to industrial facilities.

  14. Cyclic siloxanes in air, including identification of high levels in Chicago and distinct diurnal variation

    PubMed Central

    Yucuis, Rachel A.; Stanier, Charles O.; Hornbuckle, Keri C.

    2014-01-01

    The organosilicon compounds octamethylcyclotetrasiloxane (D4), decamethylcyclopentasiloxane (D5), and dodecamethylcyclohexasiloxane (D6) are high production volume chemicals that are widely used in household goods and personal care products. Due to their prevalence and chemical characteristics, cyclic siloxanes are being assessed as possible persistent organic pollutants. D4, D5, and D6 were measured in indoor and outdoor air to quantify and compare siloxane concentrations and compound ratios depending on location type. Indoor air samples had a median concentration of 2200 ng m−3 for the sum of D4, D5, and D6. Outdoor sampling locations included downtown Chicago, Cedar Rapids, IA, and West Branch, IA, and had median sum siloxane levels of 280, 73, and 29 ng m−3 respectively. A diurnal trend is apparent in the samples taken in downtown Chicago. Nighttime samples had a median 2.7 times higher on average than daytime samples, which is due, in part, to the fluctuations of the planetary boundary layer. D5 was the dominant siloxane in both indoor and outdoor air. Ratios of D5 to D4 averaged 91 and 3.2 for indoor and outdoor air respectively. PMID:23541357

  15. Groundwater level and nitrate concentration trends on Mountain Home Air Force Base, southwestern Idaho

    USGS Publications Warehouse

    Williams, Marshall L.

    2014-01-01

    Mountain Home Air Force Base in southwestern Idaho draws most of its drinking water from the regional aquifer. The base is located within the State of Idaho's Mountain Home Groundwater Management Area and is adjacent to the State's Cinder Cone Butte Critical Groundwater Area. Both areas were established by the Idaho Department of Water Resources in the early 1980s because of declining water levels in the regional aquifer. The base also is listed by the Idaho Department of Environmental Quality as a nitrate priority area. The U.S. Geological Survey, in cooperation with the U.S. Air Force, began monitoring wells on the base in 1985, and currently monitors 25 wells for water levels and 17 wells for water quality, primarily nutrients. This report provides a summary of water-level and nitrate concentration data collected primarily between 2001 and 2013 and examines trends in those data. A Regional Kendall Test was run to combine results from all wells to determine an overall regional trend in water level. Groundwater levels declined at an average rate of about 1.08 feet per year. Nitrate concentration trends show that 3 wells (18 percent) are increasing in nitrate concentration trend, 3 wells (18 percent) show a decreasing nitrate concentration trend, and 11 wells (64 percent) show no nitrate concentration trend. Six wells (35 percent) currently exceed the U.S. Environmental Protection Agency's maximum contaminant limit of 10 milligrams per liter for nitrate (nitrite plus nitrate, measured as nitrogen).

  16. Studies on in situ particulate reinforced tin-silver composite solders relevant to thermomechanical fatigue issues

    NASA Astrophysics Data System (ADS)

    Choi, Sunglak

    2001-07-01

    Global pressure based on environmental and health concerns regarding the use of Pb-bearing solder has forced the electronics industry to develop Pb-free alternative solders. Eutectic Sn-Ag solder has received much attention as a potential Pb-free candidate to replace Sn-Pb solder. Since introduction of surface mount technology, packaging density increased and the electronic devices became smaller. As a result, solders in electronic modules are forced to function as a mechanical connection as well as electrical contact. Solders are also exposed to very harsh service conditions such as automotive under-the-hood and aerospace applications. Solder joints experience thermomechanical fatigue, i.e. interaction of fatigue and creep, during thermal cycling due to temperature fluctuation in service conditions. Microstructural study on thermomechanical fatigue of the actual eutectic Sn-Ag and Sn-4Ag-0.5Cu solder joints was performed to better understand deformation and damage accumulation occurring during service. Incorporation of reinforcements has been pursued to improve the mechanical and particularly thermomechanical behavior of solders, and their service temperature capability. In-situ Sn-Ag composite solders were developed by incorporating Cu 6Sn5, Ni3Sn4, and FeSn2 particulate reinforcements in the eutectic Sn-Ag solder in an effort to enhance thermomechanical fatigue resistance. In-situ composite solders were investigated on the growth of interfacial intermetallic layer between solder and Cu substrate growth and creep properties. Solder joints exhibited significant deformation and damage on free surface and interior regions during thermomechanical fatigue. Cracks initiated on the free surface of the solder joints and propagated toward interior regions near the substrate of the solder joint. Crack grew along Sn grain boundaries by grain boundary sliding. There was significant residual stress within the solder joint causing more damage. Presence of small amount of Cu

  17. Aqueous cleaning of flux residue from solder joints. Final report

    SciTech Connect

    Krska, C.M.

    1992-08-01

    Solder joints have traditionally been cleaned using chlorinated or fluorinated solvents. This study addressed alternate processing. One process involved using a saponifier/water solution to remove rosin flux residues; the other process involved using a water-soluble flux and water to remove the residues. Although both processes were satisfactory, the water-soluble flux with water cleaning proved to be the best.

  18. Aqueous cleaning of flux residue from solder joints

    SciTech Connect

    Krska, C.M.

    1992-08-01

    Solder joints have traditionally been cleaned using chlorinated or fluorinated solvents. This study addressed alternate processing. One process involved using a saponifier/water solution to remove rosin flux residues; the other process involved using a water-soluble flux and water to remove the residues. Although both processes were satisfactory, the water-soluble flux with water cleaning proved to be the best.

  19. Fixture aids soldering of electronic components on circuit board

    NASA Technical Reports Server (NTRS)

    Ross, M. H.

    1966-01-01

    Spring clamp fixture holds small electronic components in a desired position while they are being soldered on a circuit board. The spring clamp is clipped on the edge of the circuit board and an adjustable spring-steel boom holds components against the board. The felt pad at the end of the boom is replaced with different attachments for other holding tasks.

  20. 28. VIEW OF THE SOLDERING NICHE FORMED WITH BRICKS. THE ...

    Library of Congress Historic Buildings Survey, Historic Engineering Record, Historic Landscapes Survey

    28. VIEW OF THE SOLDERING NICHE FORMED WITH BRICKS. THE BACK OF THE NICHE IS CEMENT FINISHED. THE BOTTOM HAS A 1 INCH THICK ASBESTOS SHELF. THIS PHOTO WAS TAKEN AT THE 3RD FLOOR. - Pacific Telephone & Telegraph Company Building, 1519 Franklin Street, Oakland, Alameda County, CA

  1. Porosity in collapsible Ball Grid Array solder joints

    SciTech Connect

    Gonzalez, C.A. |

    1998-05-01

    Ball Grid Array (BGA) technology has taken off in recent years due to the increased need for high interconnect density. Opposite to all the advantages BGA packages offer, porosity in collapsible BGA solder joints is often a major concern in the reliability of such packages. The effect of pores on the strength of collapsible BGA solder-joints was studied by manufacturing samples with different degrees of porosity and testing them under a shear load. It was found that the shear strength of the solder joints decreased in a linear fashion with increasing porosity. Failure occurred by internal necking of the interpore matrix. It was confirmed that entrapment of flux residues leads to porosity by manufacturing fluxless samples in a specially made furnace, and comparing them with samples assembled using flux. Also, contamination of Au electrodeposits (in substrate metallization) was determined to cause significant porosity. It was found that hard-Au (Co hardened Au) electrodeposits produce high degrees of porosity even in the absence of flux. Finally, increasing the time the solder spends in the molten state was proven to successfully decrease porosity.

  2. Fundamentals of wetting and spreading with emphasis on soldering

    SciTech Connect

    Yost, F.G.

    1991-01-01

    Soldering is often referred to as a mature technology whose fundamentals were established long ago. Yet a multitude of soldering problems persist, not the least of which are related to the wetting and spreading of solder. The Buff-Goodrich approach to thermodynamics of capillarity is utilized in a review of basic wetting principles. These thermodynamics allow a very compact formulation of capillary phenomena which is used to calculate various meniscus shapes and wetting forces. These shapes and forces lend themselves to experimental techniques, such as the sessile drop and the Wilhelmy plate, for measuring useful surface and interfacial energies. The familiar equations of Young, Wilhelmy, and Neumann are all derived with this approach. The force-energy duality of surface energy is discussed and the force method is developed and used to derive the Herring relations for anisotropic surfaces. The importance of contact angle hysteresis which results from surface roughness and chemical inhomogeneity is presented and Young's equation is modified to reflect these ever present effects. Finally, an analysis of wetting with simultaneous metallurigical reaction is given and used to discuss solder wetting phenomena. 60 refs., 13 figs.

  3. Inelastic Strain Analysis of Solder Joint in NASA Fatigue Specimen

    NASA Technical Reports Server (NTRS)

    Dasgupta, Abhijit; Oyan, Chen

    1991-01-01

    The solder fatigue specimen designed by NASA-GSFC/UNISYS is analyzed in order to obtain the inelastic strain history during two different representative temperature cycles specified by UNISYS. In previous reports (dated July 25, 1990, and November 15, 1990), results were presented of the elastic-plastic and creep analysis for delta T = 31 C cycle, respectively. Subsequent results obtained during the current phase, from viscoplastic finite element analysis of the solder fatigue specimen for delta T = 113 C cycle are summarized. Some common information is repeated for self-completeness. Large-deformation continuum formulations in conjunction with a standard linear solid model is utilized for modeling the solder constitutive creep-plasticity behavior. Relevant material properties are obtained from the literature. Strain amplitudes, mean strains, and residual strains (as well as stresses) accumulated due to a representative complete temperature cycle are obtained as a result of this analysis. The partitioning between elastic strains, time-independent inelastic (plastic) strains, and time-dependent inelastic (creep) strains is also explicitly obtained for two representative cycles. Detailed plots are presented for two representative temperature cycles. This information forms an important input for fatigue damage models, when predicting the fatigue life of solder joints under thermal cycling

  4. Robot End Effector To Place and Solder Solar Cells

    NASA Technical Reports Server (NTRS)

    Hagerty, J. J.

    1982-01-01

    Encapsulated in robot end effector is RF induction-heating coil for heating solar cell while in transit. Holes in encapsulant permit end of unit to act as vacuum pickup to grip solar cell. Use of RF induction heating allows cell to be heated without requiring direct mechanical and thermal contact of bonding tool such as soldering iron.

  5. A constitutive model for Sn-Pb solder.

    SciTech Connect

    Neilsen, Michael K.; Vianco, Paul Thomas; Boyce, Brad Lee

    2010-10-01

    A unified creep plasticity damage (UCPD) model for Sn-Pb solder is developed in this paper. Stephens and Frear (1999) studied the creep behavior of near-eutectic 60Sn-40Pb solder subjected to low strain rates and found that the inelastic (creep and plastic) strain rate could be accurately described using a hyperbolic Sine function of the applied effective stress. A recently developed high-rate servo-hydraulic method was employed to characterize the temperature and strain-rate dependent stress-strain behavior of eutectic Sn-Pb solder over a wide range of strain rates (10{sup -4} to 10{sup 2} per second). The steady state inelastic strain rate data from these latest experiments were also accurately captured by the hyperbolic Sine equation developed by Stephens and Frear. Thus, this equation was used as the basis for the UCPD model for Sn-Pb solder developed in this paper. Stephens, J.J., and Frear, D.R., Metallurgical and Materials Transactions A, Volume 30A, pp. 1301-1313, May 1999.

  6. Printed-Circuit-Board Soldering Training for Group IV Personnel.

    ERIC Educational Resources Information Center

    Hooprich, E. A.; Matlock, E. W.

    As part of a larger program to determine which Navy skills can be learned by lower aptitude personnel, and which methods and techniques would be most effective, an experimental course in printed circuit board soldering was given to 186 Group IV students in 13 classes. Two different training approaches--one stressing instructor guidance and the…

  7. Horizon shells and BMS-like soldering transformations

    NASA Astrophysics Data System (ADS)

    Blau, Matthias; O'Loughlin, Martin

    2016-03-01

    We revisit the theory of null shells in general relativity, with a particular emphasis on null shells placed at horizons of black holes. We study in detail the considerable freedom that is available in the case that one solders two metrics together across null hypersurfaces (such as Killing horizons) for which the induced metric is invariant under translations along the null generators. In this case the group of soldering transformations turns out to be infinite dimensional, and these solderings create non-trivial horizon shells containing both massless matter and impulsive gravitational wave components. We also rephrase this result in the language of Carrollian symmetry groups. To illustrate this phenomenon we discuss in detail the example of shells on the horizon of the Schwarzschild black hole (with equal interior and exterior mass), uncovering a rich classical structure at the horizon and deriving an explicit expression for the general horizon shell energy-momentum tensor. In the special case of BMS-like soldering supertranslations we find a conserved shell-energy that is strikingly similar to the standard expression for asymptotic BMS supertranslation charges, suggesting a direct relation between the physical properties of these horizon shells and the recently proposed BMS supertranslation hair of a black hole.

  8. Recycling of lead solder dross, Generated from PCB manufacturing

    NASA Astrophysics Data System (ADS)

    Lucheva, Biserka; Tsonev, Tsonio; Iliev, Peter

    2011-08-01

    The main purpose of this work is to analyze lead solder dross, a waste product from manufacturing of printed circuit boards by wave soldering, and to develop an effective and environmentally sound technology for its recycling. A methodology for determination of the content and chemical composition of the metal and oxide phases of the dross is developed. Two methods for recycling of lead solder dross were examined—carbothermal reduction and recycling using boron-containing substances. The influence of various factors on the metal yield was studied and the optimal parameters of the recycling process are defined. The comparison between them under the same parameters-temperature and retention time, showed that recycling of dross with a mixture of borax and boric acid in a 1:2 ratio provides higher metal yield (93%). The recycling of this hazardous waste under developed technology gets glassy slag and solder, which after correction of the chemical composition can be used again for production of PCB.

  9. Air radioactivity levels following the Fukushima reactor accident measured at the Laboratoire Souterrain de Modane, France.

    PubMed

    Loaiza, P; Brudanin, V; Piquemal, F; Reyss, J-L; Stekl, I; Warot, G; Zampaolo, M

    2012-12-01

    The radioactivity levels in the air of the radionuclides released by the Fukushima accident were measured at the Laboratoire Souterrain de Modane, in the South-East of France, during the period 25 March-18 April 2011. Air-filters from the ventilation system exposed for one or two days were measured using low-background gamma-ray spectrometry. In this paper we present the activity concentrations obtained for the radionuclides (131)I, (132)Te, (134)Cs, (137)Cs, (95)Nb, (95)Zr, (106)Ru, (140)Ba/La and (103)Ru. The activity concentration of (131)I was of the order of 100 μBq/m(3), more than 100 times higher than the activities of other fission products. The highest activities of (131)I were measured as a first peak on 30 March and a second peak on 3-4 April. The activity concentrations of (134)Cs and (137)Cs varied from 5 to 30 μBq/m(3). The highest activity concentration recorded for Cs corresponded to the same period as for (131)I, with a peak on 2-3 April. The results of the radioactivity concentration levels in grass and mushrooms exposed to the air in the Modane region were also measured. Activity concentrations of (131)I of about 100 mBq/m(2) were found in grass.

  10. Roles of interfacial reaction on mechanical properties of solder interfaces

    NASA Astrophysics Data System (ADS)

    Liu, Pilin

    This study investigated roles of interfacial reaction in fracture and fatigue of solder interconnects. The interfacial reaction phases in the as-reflowed and after aging were examined by cross-sectional transmission electron microscopy (TEM) while interfacial mechanical properties were determined from a flexural peel fracture mechanics technique. Because of their widespread uses in microelectronic packaging, SnPb solder interfaces, and Bi-containing Pb-free solder interfaces were chosen as the subjects of this study. In the interfacial reaction study, we observed a complicated micro structural evolution during solid-state aging of electroless-Ni(P)/SnPb solder interconnects. In as-reflowed condition, the interfacial reaction produced Ni3Sn 4 and P-rich layers. Following overaging, the interfacial microstructure degenerated into a complex multilayer structure consisting of multiple layers of Ni-Sn compounds and transformed Ni-P phases. In SnPb solder interfacial system, fatigue study showed that the overaging of the high P electroless Ni-P/SnPb interconnects resulted in a sharp reduction in the fatigue resistance of the interface in the high crack growth rate regime. Fracture mechanism analysis indicated that the sharp drop in fatigue resistance was triggered by the brittle fracture of the Ni3Sn2 intermetallic phase developed at the overaged interface. The fatigue behavior was strongly dependent on P concentration in electroless Ni. Kirkendall voids were found in the interfacial region after aging, but they did not cause premature fracture of the solder interfaces. In Bi-containing solder interfacial system, we found that Bi segregated to the Cu-intermetallic interface during aging in SnBi/Cu interconnect. This caused serious embrittlement of Sn-Bi/Cu interface. Further aging induced numerous voids along the Cu3Sn/Cu interface. These interfacial voids were different from Kirkendall voids. Their formation was explained on basis of vacancy condensation at the

  11. [Evaluation of functional adaptation level in air specialists according to biochemical indexes of saliva secretion].

    PubMed

    Soldatov, S K; Malysheva, E V; Zasiad'ko, K I; Abashev, V Iu; Gulin, A V; Ermakova, N V

    2009-09-01

    It was examined a capability of evaluation of functional condition of air staff by indexes of natrium, kalium, cortisol and glucose in saliva. There were realized 5 series of examinations with participations of 71 airplane pilot of the same level in conditions of realizing flies of different difficultness. Saliva sampling was effectuated before and after the flies not later then 10-15 minutes after landing. On pre-flight medical examination and after performance of task of air relay there was registration of systolic, diasystolic blood pressure and cardiac rate. It was posed the correlation of physiological indexes with percentage of examined ingredients in saliva in different flight loads. The results of examinations speak for capability of using of indexes of percentage of natrium, kalium, cortisol and glucose in saliva for evaluation of functional condition of airplane pilots during effectuating the flies and rating of value of flight load with account of individual peculiarities.

  12. Ultralow Level Mercury Treatment Using Chemical Reduction and Air Stripping: Scoping Report

    SciTech Connect

    Looney, B.B.

    2000-08-18

    Data collected during the first stage of a Savannah River Technology Center (SRTC) Strategic Research and Development Project confirmed the efficacy of chemical reduction and air stripping/sparging as an ultralow level mercury treatment concept for waters containing Hg(II). The process consists of dosing the water with low levels of stannous chloride to convert the mercury to Hg. This form of mercury can easily be removed from the water by air stripping or sparging. Samples of Savannah River Site (SRS) groundwater containing approximately 130 ng/L of total mercury (as Hg(II)) were used for the study. In undosed samples, sparging removed 0 percent of the initial mercury. In the dosed samples, all of the removals were greater than 94 percent, except in one water type at one dose. This sample, which was saturated with dissolved oxygen, showed a 63 percent reduction in mercury following treatment at the lowest dose. Following dosing at minimally effective levels and sparging, treated water contained less than 10 ng/L total mercury. In general, the data indicate that the reduction of mercury is highly favored and that stannous chloride reagent efficiently targets the Hg(II) contaminant in the presence of competing reactions. Based on the results, the authors estimated that the costs of implementing and operating an ultralow level mercury treatment process based on chemical reduction and stripping/sparging are 10 percent to 20 percent of traditional treatment technologies.

  13. Passive inhalation of marijuana smoke: urinalysis and room air levels of delta-9-tetrahydrocannabinol

    SciTech Connect

    Cone, E.J.; Johnson, R.E.; Darwin, W.D.; Yousefnejad, D.; Mell, L.D.; Paul, B.D.; Mitchell, J.

    1987-05-01

    In two separate studies, 5 drug-free male volunteers with a history of marijuana use were passively exposed to the sidestream smoke of 4 and 16 marijuana cigarettes (2.8% delta-9-tetrahydrocannabinol (THC)) for 1 h each day for 6 consecutive days. A third study was similarly performed with 2 marijuana-naive subjects passively exposed to the smoke of 16 marijuana cigarettes. Passive smoke exposure was conducted in a small, unventilated room. Room air levels of THC and CO were monitored frequently. All urine specimens were collected and analyzed by EMIT d.a.u. assay, Abuscreen radioimmunoassay and GC/MS. The studies show that significant amounts of THC were absorbed by all subjects at the higher level of passive smoke exposure (eg., smoke from 16 marijuana cigarettes), resulting in urinary excretion of significant amounts of cannabinoid metabolites. However, it seems improbable that subjects would unknowingly tolerate the noxious smoke conditions produced by this exposure. At the lower level of passive marijuana-smoke exposure, specimens tested positive only infrequently or were negative. Room air levels of THC during passive smoke exposure appeared to be the most critical factor in determining whether a subject produced cannabinoid-positive urine specimens.

  14. Study on particulate matter air pollution in Beijing with MODIS aerosol level 2 products

    NASA Astrophysics Data System (ADS)

    Mao, Jietai; Li, Chengcai; Lau, Alexis K.

    2004-09-01

    In the run-up to the 2008 Olympic Games in Beijing, Chinese government officials at both the central and municipal levels are keenly aware that they must transform Beijing into a world-class city. According to the Beijing Municipal Environmental Protection Bureau (BJEPB) to improve its air quality some actions are adopting, including taking steps to increase the forested area surrounding the city preventing dust storms, reducing the automotive vehicles, moving polluting factories now inside the fourth ring road ringing the inner city to locations outside of the fourth ring road, and switching the fuel of public buses and taxis from diesel to natural gas, etc. Will they eliminate most serious environmental problems in Beijing? MODIS aerosol products are helping us to answer this kind of questions. A long-term validation has been finished by sun-photometer observations, and the results proved the relative error of MODIS level 2 products was slightly larger than the estimation of Chu et al. (2002) from the results in most AERONET sites. However, the comparison between the products and moisture-corrected air pollution index (API) data, which were daily released to public by EPB, showed a high correlation coefficient. An air pollution episode in 2003 was investigated by the usage of satellite products. Our conclusion for the air pollution control strategy in Beijing is that only reducing the pollution sources from inner city can't fully solve the pollution problems in Beijing and the regional transports from the nearby southern provinces are contributing a lot to the pollution situation in Beijing.

  15. Effect of Different Levels of Pressure Relieving Air-Mattress Firmness on Cough Strength

    PubMed Central

    Kamikawa, Norimichi; Taito, Shunsuke; Takahashi, Makoto; Sekikawa, Kiyokazu; Hamada, Hironobu

    2016-01-01

    Cough is an important host-defense mechanism. The elderly and patients who are severely ill cannot cough effectively when lying in the supine position. Furthermore, pressure relieving air-mattresses are recommended for preventing the development of pressure ulcers. In this study, we clarified whether or not the cough peak flow (CPF), an index of cough strength, is affected by different firmness levels of a pressure relieving air-mattress in healthy volunteers in the supine position. Fifty-two healthy young men participated. All the measurements were carried out on each participant in the supine position on a pressure relieving air-mattress. The participants were assessed at two firmness levels, a “hard” and “soft” mode. The CPF, forced vital capacity (FVC), maximal expiratory pressure (PEmax), and maximal inspiratory pressure (PImax) were determined for each mode. The sinking distance of the body into the mattress was measured without any activity and the difference between the sinking distances of the two firmness levels was determined. The CPF, FVC, PEmax, and PImax were determined for each mode. The sinking distance of the body into the mattress was measured and the difference between the sinking distances of the two firmness levels was determined. The CPF, FVC, PEmax and PImax values of the participants coughing on the mattress were significantly lower when the mattress was in “soft” than in “hard” mode. The differences between the sinking distances of the mattress in “soft” and “hard” modes were larger for the anterior superior iliac spine. A harder mattress may lead to increased CPF in healthy young men lying in the supine position, and increased CPF may be important for host defense. PMID:26741497

  16. Effect of Different Levels of Pressure Relieving Air-Mattress Firmness on Cough Strength.

    PubMed

    Kamikawa, Norimichi; Taito, Shunsuke; Takahashi, Makoto; Sekikawa, Kiyokazu; Hamada, Hironobu

    2016-01-01

    Cough is an important host-defense mechanism. The elderly and patients who are severely ill cannot cough effectively when lying in the supine position. Furthermore, pressure relieving air-mattresses are recommended for preventing the development of pressure ulcers. In this study, we clarified whether or not the cough peak flow (CPF), an index of cough strength, is affected by different firmness levels of a pressure relieving air-mattress in healthy volunteers in the supine position. Fifty-two healthy young men participated. All the measurements were carried out on each participant in the supine position on a pressure relieving air-mattress. The participants were assessed at two firmness levels, a "hard" and "soft" mode. The CPF, forced vital capacity (FVC), maximal expiratory pressure (PEmax), and maximal inspiratory pressure (PImax) were determined for each mode. The sinking distance of the body into the mattress was measured without any activity and the difference between the sinking distances of the two firmness levels was determined. The CPF, FVC, PEmax, and PImax were determined for each mode. The sinking distance of the body into the mattress was measured and the difference between the sinking distances of the two firmness levels was determined. The CPF, FVC, PEmax and PImax values of the participants coughing on the mattress were significantly lower when the mattress was in "soft" than in "hard" mode. The differences between the sinking distances of the mattress in "soft" and "hard" modes were larger for the anterior superior iliac spine. A harder mattress may lead to increased CPF in healthy young men lying in the supine position, and increased CPF may be important for host defense. PMID:26741497

  17. Effect of Different Levels of Pressure Relieving Air-Mattress Firmness on Cough Strength.

    PubMed

    Kamikawa, Norimichi; Taito, Shunsuke; Takahashi, Makoto; Sekikawa, Kiyokazu; Hamada, Hironobu

    2016-01-01

    Cough is an important host-defense mechanism. The elderly and patients who are severely ill cannot cough effectively when lying in the supine position. Furthermore, pressure relieving air-mattresses are recommended for preventing the development of pressure ulcers. In this study, we clarified whether or not the cough peak flow (CPF), an index of cough strength, is affected by different firmness levels of a pressure relieving air-mattress in healthy volunteers in the supine position. Fifty-two healthy young men participated. All the measurements were carried out on each participant in the supine position on a pressure relieving air-mattress. The participants were assessed at two firmness levels, a "hard" and "soft" mode. The CPF, forced vital capacity (FVC), maximal expiratory pressure (PEmax), and maximal inspiratory pressure (PImax) were determined for each mode. The sinking distance of the body into the mattress was measured without any activity and the difference between the sinking distances of the two firmness levels was determined. The CPF, FVC, PEmax, and PImax were determined for each mode. The sinking distance of the body into the mattress was measured and the difference between the sinking distances of the two firmness levels was determined. The CPF, FVC, PEmax and PImax values of the participants coughing on the mattress were significantly lower when the mattress was in "soft" than in "hard" mode. The differences between the sinking distances of the mattress in "soft" and "hard" modes were larger for the anterior superior iliac spine. A harder mattress may lead to increased CPF in healthy young men lying in the supine position, and increased CPF may be important for host defense.

  18. Mapping Air Pollution Concentrations and Sources in China from Ground-Level Observations

    NASA Astrophysics Data System (ADS)

    Rohde, R. A.; Muller, R. A.

    2014-12-01

    China has recently established an extensive air quality monitoring system with over 1500 sites providing hourly data on airborne particulate matter (PM2.5 / PM10), sulfur dioxide (SO2), nitrogen dioxide (NO2), ozone (O3), and carbon monoxide (CO). Based on Kriging interpolation of these surface data, we derive a detailed map of air pollution across the eastern half of China. In northern and central China, the pollution is widespread; contrary to popular belief, pollution is not simply localized to major cities such as Beijing, Shanghai, or Chongqing, or in geologic basins. Pollution levels are lower in southern China, in part due to frequent rains. By incorporating wind measurements and estimating pollution transport, we also infer source distributions for key pollutants. Sources are widespread, but many of the largest sources are often situated in or near major population centers. A northeast corridor extending from near Shanghai to north of Beijing includes many of the most significant pollution sources in China. Roughly 5% of the study region accounts for 25% of observed particulate matter emissions. During the analysis period, roughly half of the population of China was subjected to a long-term average pollution level in the unhealthy range, according to standards used by the US Environmental Protection Agency. In addition, nearly all of China's population (>90%) was exposed to unhealthy levels of air pollution at least some of the time. Based on health impact estimates from the Huai River Study, we estimate that the observed levels of particulate matter pollution contribute to about 1.4 million deaths every year in China, about 3500 per day, in agreement with prior estimates. Identification of sources from pollution data was facilitated by the reporting of hourly measurements, and we encourage other nations around the world to follow China's example and provide such time-resolved data.

  19. Electromigration Behaviors of Cu Reinforced Sn-3.5Ag Composite Solder Joints

    NASA Astrophysics Data System (ADS)

    Wang, Yan; Han, Jing; Ma, Limin; Zuo, Yong; Guo, Fu

    2016-09-01

    The composite approach, by incorporating small amounts of reinforcement particles in the solder matrix, has proven to be one of the effective ways to improve the reliability of solder joints. The effects of Cu addition on electromigration were investigated in this study by incorporating 2% volume fraction Cu particles into Sn-3.5Ag eutectic solder paste by the in situ process. The one-dimensional solder joints, designed to prevent the current crowding effect, were stressed under a constant current density of 104 A/cm2 at room temperature, and the temperature of the sample could reach 105 ± 5°C due to the Joule heating effect. Doping 2 vol.% Cu was found to retard the electromigration phenomenon effectively. After electric current stressing for 528 h, the growth rate of an interfacial intermetallic compound (IMC) layer at the anode decreased 73% in contrast to that of Sn-3.5Ag solder joints, and the IMC layer at the cathode was almost unchanged. The polarization effect of Cu reinforced composite solder joints was also apparently mitigated. In addition, the surface damage of the composite solder joints was relieved by incorporating 2 vol.% Cu particles. Compared to Sn-3.5Ag solder joints, which had protruded Cu6Sn5 and wrinkles of Sn-solder matrix on the surface, the solder joints with Cu addition had a more even surface.

  20. Ventilation, air confinement and high radon level in an underground gallery studied from profiles measurements.

    NASA Astrophysics Data System (ADS)

    Richon, P.; Perrier, F.; Sabroux, J.-C.; Pili, E.; Ferry, C.; Dezayes, C.; Voisin, V.

    2003-04-01

    An horizontal closed-end tunnel, 128 m long and 2 m in diameter, located within the eastern margin of the Belledonne crystalline basement, French Alps, near the west shore of the Roselend artificial lake, 600 m NE of the dam, has been instrumented since 1995 for radon emanation and deformation measurements. Radon bursts are repeatedly associated with transient deformation events induced by variations in lake levels (Trique et al., 1999). This high radon anomalies (up to 30,000 Bq.m-3) in the air of the tunnel result from its particular geometry, its excellent confinement, the water and radium-226 contents of rocks, and the crossing of several faults. We calculated the equilibrium factor F, directly proportional to air ventilation, from the ratios of radon-222 gas activity measured with an AlphaGUARDTM, and the Potential Alpha Energy Concentration (PAEC, in μJ.m-3) of its short-lived daughters measured with a TracerlabTM, simultaneously in five locations along the tunnel. The calculated equilibrium factors of 0.60 to 0.78 show that confinement is very good all along the tunnel. Fast Fourier Transform of the radon-222 signals measured during six months simultaneously with six BarasolTM distributed along the tunnel shows also the poor ventilation and the weak influence of atmospheric pressure and air temperature.

  1. Genetic effects of an air discharge plasma on Staphylococcus aureus at the gene transcription level

    NASA Astrophysics Data System (ADS)

    Xu, Zimu; Wei, Jun; Shen, Jie; Liu, Yuan; Ma, Ronghua; Zhang, Zelong; Qian, Shulou; Ma, Jie; Lan, Yan; Zhang, Hao; Zhao, Ying; Xia, Weidong; Sun, Qiang; Cheng, Cheng; Chu, Paul K.

    2015-05-01

    The dynamics of gene expression regulation (at transcription level) in Staphylococcus aureus after different doses of atmospheric-pressure room-temperature air plasma treatments are investigated by monitoring the quantitative real-time polymerase chain reaction. The plasma treatment influences the transcription of genes which are associated with several important bio-molecular processes related to the environmental stress resistance of the bacteria, including oxidative stress response, biofilm formation, antibiotics resistance, and DNA damage protection/repair. The reactive species generated by the plasma discharge in the gas phase and/or induced in the liquid phase may account for these gene expression changes.

  2. Factors Affecting Parent’s Perception on Air Quality—From the Individual to the Community Level

    PubMed Central

    Guo, Yulin; Liu, Fengfeng; Lu, Yuanan; Mao, Zongfu; Lu, Hanson; Wu, Yanyan; Chu, Yuanyuan; Yu, Lichen; Liu, Yisi; Ren, Meng; Li, Na; Chen, Xi; Xiang, Hao

    2016-01-01

    The perception of air quality significantly affects the acceptance of the public of the government’s environmental policies. The aim of this research is to explore the relationship between the perception of the air quality of parents and scientific monitoring data and to analyze the factors that affect parents’ perceptions. Scientific data of air quality were obtained from Wuhan’s environmental condition reports. One thousand parents were investigated for their knowledge and perception of air quality. Scientific data show that the air quality of Wuhan follows an improving trend in general, while most participants believed that the air quality of Wuhan has deteriorated, which indicates a significant difference between public perception and reality. On the individual level, respondents with an age of 40 or above (40 or above: OR = 3.252; 95% CI: 1.170–9.040), a higher educational level (college and above: OR = 7.598; 95% CI: 2.244–25.732) or children with poor healthy conditions (poor: OR = 6.864; 95% CI: 2.212–21.302) have much more negative perception of air quality. On the community level, industrial facilities, vehicles and city construction have major effects on parents’ perception of air quality. Our investigation provides baseline information for environmental policy researchers and makers regarding the public’s perception and expectation of air quality and the benefits to the environmental policy completing and enforcing. PMID:27187432

  3. A real time sorbent based air monitoring system for determining low level airborne exposure levels to Lewisite

    SciTech Connect

    Lattin, F.G.; Paul, D.G.; Jakubowski, E.M.

    1994-12-31

    The Real Time Analytical Platform (RTAP) is designed to provide mobile, real-time monitoring support to ensure protection of worker safety in areas where military unique compounds are used and stored, and at disposal sites. Quantitative analysis of low-level vapor concentrations in air is accomplished through sorbent-based collection with subsequent thermal desorption into a gas chromatograph (GC) equipped with a variety of detectors. The monitoring system is characterized by its sensitivity (ability to measure at low concentrations), selectivity (ability to filter out interferences), dynamic range and linearity, real time mode (versus methods requiring extensive sample preparation procedures), and ability to interface with complimentary GC detectors. This presentation describes an RTAP analytical method for analyzing lewisite, an arsenical compound, that consists of a GC screening technique with an Electron Capture Detector (ECD), and a confirmation technique using an Atomic Emission Detector (AED). Included in the presentation is a description of quality assurance objectives in the monitoring system, and an assessment of method accuracy, precision and detection levels.

  4. The ATO (Air Tasking Order): Improving JTLS' (Joint Theater Level Simulation) C/sup 3/I with an expert system

    SciTech Connect

    Hartley, D.; Allgood, G.

    1988-01-01

    The Air Tasking Order (ATO) Advisor models the human cognitive functions (Command, Control, Communications, and Intelligence (C/sup 3/I)) required for interaction with the Joint Theater Level Simulation (JTLS) at the theater level (rather than the air mission level). The ATO Advisor applies specifically to the air war portion of the simulation. It contains an expert system, a decision support system, and a group of fast running LISP and C service routines. Beyond the needs of JTLS, the ATO Advisor provides a paradigm for future C/sup 3/I modeling. 5 figs.

  5. Proposal for a Vehicle Level Test Procedure to Measure Air Conditioning Fuel Use

    SciTech Connect

    Rugh, J. P.

    2010-04-01

    The air-conditioning (A/C) compressor load significantly impacts the fuel economy of conventional vehicles and the fuel use/range of plug-in hybrid electric vehicles (PHEV). A National Renewable Energy Laboratory (NREL) vehicle performance analysis shows the operation of the air conditioner reduces the charge depletion range of a 40-mile range PHEV from 18% to 30% in a worst case hot environment. Designing for air conditioning electrical loads impacts PHEV and electric vehicle (EV) energy storage system size and cost. While automobile manufacturers have climate control procedures to assess A/C performance, and the U.S. EPA has the SCO3 drive cycle to measure indirect A/C emissions, there is no automotive industry consensus on a vehicle level A/C fuel use test procedure. With increasing attention on A/C fuel use due to increased regulatory activities and the development of PHEVs and EVs, a test procedure is needed to accurately assess the impact of climate control loads. A vehicle thermal soak period is recommended, with solar lamps that meet the SCO3 requirements or an alternative heating method such as portable electric heaters. After soaking, the vehicle is operated over repeated drive cycles or at a constant speed until steady-state cabin air temperature is attained. With this method, the cooldown and steady-state A/C fuel use are measured. This method can be run at either different ambient temperatures to provide data for the GREEN-MAC-LCCP model temperature bins or at a single representative ambient temperature. Vehicles with automatic climate systems are allowed to control as designed, while vehicles with manual climate systems are adjusted to approximate expected climate control settings. An A/C off test is also run for all drive profiles. This procedure measures approximate real-world A/C fuel use and assess the impact of thermal load reduction strategies.

  6. Reducing the emission of ozone depleting chemicals through use of a self-cleaning soldering process

    SciTech Connect

    Lichtenberg, L.; Martin, G.; Van Buren, P.; Iman, R.; Paffett, M.T.

    1991-12-31

    Motorola has jointed with Sandia and Los Alamos National Laboratories to perform work under a Cooperative Research and Development Agreement (CRADA) to reduce the use of CFC`s and other ozone depleting printing wiring board (PWB) cleaning solvents. This study evaluated the use of a new soldering process that uses dilute adipic acid in lieu of rosin flux. The process consumes the adipic acid in lieu of rosin flux. The process consumes the adipic acid during the soldering process and precludes the need for subsequent cleaning with ozone depleting solvents. This paper presents results from a series of designed experiments that evaluated PWB cleanliness as a function of various levels of machine control parameters. The study included a comprehensive hardware reliability evaluation, which included environmental conditioning, cleanliness testing, surface chemical analysis, surface insulation resistance testing, along with electrical, mechanical and long term storage testing. The results of this study that the new process produces quality, reliable hardware over a wide range of processing parameters. Adoption of this process, which eliminates the need for supplemental cleaning, will have a positive impact on many environmental problems, including depletion of the ozone layer.

  7. Reducing the emission of ozone depleting chemicals through use of a self-cleaning soldering process

    SciTech Connect

    Lichtenberg, L.; Martin, G.; Van Buren, P. . Government Electronics Group); Iman, R. ); Paffett, M.T. )

    1991-01-01

    Motorola has jointed with Sandia and Los Alamos National Laboratories to perform work under a Cooperative Research and Development Agreement (CRADA) to reduce the use of CFC's and other ozone depleting printing wiring board (PWB) cleaning solvents. This study evaluated the use of a new soldering process that uses dilute adipic acid in lieu of rosin flux. The process consumes the adipic acid in lieu of rosin flux. The process consumes the adipic acid during the soldering process and precludes the need for subsequent cleaning with ozone depleting solvents. This paper presents results from a series of designed experiments that evaluated PWB cleanliness as a function of various levels of machine control parameters. The study included a comprehensive hardware reliability evaluation, which included environmental conditioning, cleanliness testing, surface chemical analysis, surface insulation resistance testing, along with electrical, mechanical and long term storage testing. The results of this study that the new process produces quality, reliable hardware over a wide range of processing parameters. Adoption of this process, which eliminates the need for supplemental cleaning, will have a positive impact on many environmental problems, including depletion of the ozone layer.

  8. Using Mobile Monitoring to Assess Spatial Variability in Urban Air Pollution Levels: Opportunities and Challenges (Invited)

    NASA Astrophysics Data System (ADS)

    Larson, T.

    2010-12-01

    Measuring air pollution concentrations from a moving platform is not a new idea. Historically, however, most information on the spatial variability of air pollutants have been derived from fixed site networks operating simultaneously over space. While this approach has obvious advantages from a regulatory perspective, with the increasing need to understand ever finer scales of spatial variability in urban pollution levels, the use of mobile monitoring to supplement fixed site networks has received increasing attention. Here we present examples of the use of this approach: 1) to assess existing fixed-site fine particle networks in Seattle, WA, including the establishment of new fixed-site monitoring locations; 2) to assess the effectiveness of a regulatory intervention, a wood stove burning ban, on the reduction of fine particle levels in the greater Puget Sound region; and 3) to assess spatial variability of both wood smoke and mobile source impacts in both Vancouver, B.C. and Tacoma, WA. Deducing spatial information from the inherently spatio-temporal measurements taken from a mobile platform is an area that deserves further attention. We discuss the use of “fuzzy” points to address the fine-scale spatio-temporal variability in the concentration of mobile source pollutants, specifically to deduce the broader distribution and sources of fine particle soot in the summer in Vancouver, B.C. We also discuss the use of principal component analysis to assess the spatial variability in multivariate, source-related features deduced from simultaneous measurements of light scattering, light absorption and particle-bound PAHs in Tacoma, WA. With increasing miniaturization and decreasing power requirements of air monitoring instruments, the number of simultaneous measurements that can easily be made from a mobile platform is rapidly increasing. Hopefully the methods used to design mobile monitoring experiments for differing purposes, and the methods used to interpret those

  9. Evaluation of advanced microelectronic fluxless solder-bump contacts for hybrid microcircuits

    NASA Technical Reports Server (NTRS)

    Mandal, R. P.

    1976-01-01

    Technology for interconnecting monolithic integrated circuit chips with other components is investigated. The advantages and disadvantages of the current flip-chip approach as compared to other interconnection methods are outlined. A fluxless solder-bump contact technology is evaluated. Multiple solder-bump contacts were formed on silicon integrated circuit chips. The solder-bumps, comprised of a rigid nickel under layer and a compliant solder overlayer, were electroformed onto gold device pads with the aid of thick dry film photomasks. Different solder alloys and the use of conductive epoxy for bonding were explored. Fluxless solder-bump bond quality and reliability were evaluated by measuring the effects of centrifuge, thermal cycling, and high temperature storage on bond visual characteristics, bond electrical continuity, and bond shear tests. The applicability and suitability of this technology for hybrid microelectronic packaging is discussed.

  10. Effects of pre-stressing and flux on the flow of solder on PWB copper surfaces

    SciTech Connect

    Hernandez, C.L.; Hosking, F.M.

    1994-12-31

    A variety of test methods are available to evaluate the solderability of printed wiring board [PWB] surface finishes. A new test has been developed which better simulates the capillary flow physics of typical solder assembly processing, especially surface mount soldering. The work was conducted under a cooperative research and development agreement between Sandia National Laboratories, the National Center for Manufacturing Sciences, and several PWB fabricators (AT&T, IBM, Texas Instruments, and United Technologies Corporation/Hamilton Standard) to advance PWB interconnect systems technology. Particular attention has been given at Sandia to characterizing the effects of accelerated aging in a simulated indoor industrial environment on subsequent PWB solderability. The program`s baseline surface finish was copper. Solderability testing on ``as-fabricated`` and ``pre-stressed copper`` pad-strip geometries was performed with Sn-Pb eutectic solder and three different fluxes at four different reflow temperatures.

  11. Threshold current density of electromigration in eutectic SnPb solder

    SciTech Connect

    Yeh, Y.T.; Chou, C.K.; Hsu, Y.C.; Chen Chih; Tu, K.N.

    2005-05-16

    Electromigration has emerged as an important reliability issue in the microelectronics packaging industry since the dimension of solder joints has continued to shrink. In this letter, we report a technique that enables the precise measurement of the important parameters of solder electromigration, such as activation energy, critical length, threshold current density, effective charge numbers, and electromigration rate. Patterned Cu/Ti films in a Si trench were employed for eutectic SnPb solder to be reflowed on, and thus solder Blech specimens were fabricated. Atomic force microscope was used to measure the depletion volume caused by electromigration on the cathode end. The threshold current density is estimated to be 8.5x10{sup 3} A/cm{sup 2} at 100 deg. C, which relates directly to the maximum allowable current that a solder joint can carry without electromigration damage. This technique facilitates the scientifically systematic investigation of electromigration in solders.

  12. Improvement of High-Temperature Performance of Zn-Sn Solder Joint

    NASA Astrophysics Data System (ADS)

    Takahashi, Toshihide; Komatsu, Shuichi; Nishikawa, Hiroshi; Takemoto, Tadashi

    2010-08-01

    Pb-based solders are used as high-temperature solders in power semiconductor devices. Although the use of Pb is globally restricted, alternative materials cannot replace the Pb-based solder. This study proposes that the Pb-based solder can be replaced by Zn-Sn alloys. Die shear tests revealed that some Zn-Sn solder joints between Cu substrates had a higher shear strength between 300 K and 543 K than those between Fe-42Ni substrates. The microstructure of the Zn-Sn solder joints between Cu substrates showed network microstructures consisting of a Zn phase and ɛ-CuZn5 phase and direct connection between the network microstructures and intermetallic compound layer. These morphologies of the high melting phase should improve the shear strength even at the elevated temperature of 543 K.

  13. Evaluating near highway air pollutant levels and estimating emission factors: Case study of Tehran, Iran.

    PubMed

    Nayeb Yazdi, Mohammad; Delavarrafiee, Maryam; Arhami, Mohammad

    2015-12-15

    A field sampling campaign was implemented to evaluate the variation in air pollutants levels near a highway in Tehran, Iran (Hemmat highway). The field measurements were used to estimate road link-based emission factors for average vehicle fleet. These factors were compared with results of an in tunnel measurement campaign (in Resalat tunnel). Roadside and in-tunnel measurements of carbon monoxide (CO) and size-fractionated particulate matter (PM) were conducted during the field campaign. The concentration gradient diagrams showed exponential decay, which represented a substantial decay, more than 50-80%, in air pollutants level in a distance between 100 and 150meters (m) of the highway. The changes in particle size distribution by distancing from highway were also captured and evaluated. The results showed particle size distribution shifted to larger size particles by distancing from highway. The empirical emission factors were obtained by using the roadside and in tunnel measurements with a hypothetical box model, floating machine model, CALINE4, CT-EMFAC or COPERT. Average CO emission factors were estimated to be in a range of 4 to 12g/km, and those of PM10 were 0.1 to 0.2g/km, depending on traffic conditions. Variations of these emission factors under real working condition with speeds were determined.

  14. Improving Neural Network Prediction Accuracy for PM10 Individual Air Quality Index Pollution Levels.

    PubMed

    Feng, Qi; Wu, Shengjun; Du, Yun; Xue, Huaiping; Xiao, Fei; Ban, Xuan; Li, Xiaodong

    2013-12-01

    Fugitive dust deriving from construction sites is a serious local source of particulate matter (PM) that leads to air pollution in cities undergoing rapid urbanization in China. In spite of this fact, no study has yet been published relating to prediction of high levels of PM with diameters <10 μm (PM10) as adjudicated by the Individual Air Quality Index (IAQI) on fugitive dust from nearby construction sites. To combat this problem, the Construction Influence Index (Ci) is introduced in this article to improve forecasting models based on three neural network models (multilayer perceptron, Elman, and support vector machine) in predicting daily PM10 IAQI one day in advance. To obtain acceptable forecasting accuracy, measured time series data were decomposed into wavelet representations and wavelet coefficients were predicted. Effectiveness of these forecasters were tested using a time series recorded between January 1, 2005, and December 31, 2011, at six monitoring stations situated within the urban area of the city of Wuhan, China. Experimental trials showed that the improved models provided low root mean square error values and mean absolute error values in comparison to the original models. In addition, these improved models resulted in higher values of coefficients of determination and AHPC (the accuracy rate of high PM10 IAQI caused by nearby construction activity) compared to the original models when predicting high PM10 IAQI levels attributable to fugitive dust from nearby construction sites. PMID:24381481

  15. Variation in particulate PAHs levels and their relation with the transboundary movement of the air masses.

    PubMed

    Ravindra, Khaiwal; Wauters, Eric; Van Grieken, René

    2008-06-25

    The levels of particulate polycyclic aromatic hydrocarbons (PAHs) were determined with a fast analytical approach to study their seasonal variations at Menen (Belgium) during 2003; they were found to be 5-7 times higher in January, February and December, in comparison to May, June and August. The annual average concentration of the sum of 16 US Environmental Protection Agency (EPA) criteria PAHs was 6.7 ng/m3 and around 63% of it was found to be probably carcinogenic to humans. The application of diagnostic ratio and principal component analysis showed vehicular emission as a major source. An increased ratio of 'combustion PAHs' to 'total EPA-PAHs' during the winter season indicated towards combustion activities. Further, the differences in PAHs concentration were assessed with relation to backward air mass trajectories, which show that the levels of PAHs increase when there is an air mass movement from Central and Western Europe and a fall when the trajectories spend most of their 4-day time over the Atlantic Ocean or in the Arctic region.

  16. Interfacial reaction of Sn-based solder joint in the package system

    NASA Astrophysics Data System (ADS)

    Gu, Huandi

    In this thesis, I report a study on the effect of the solder size on intermetallic layer formation by comparing the morphology change and growth rate of two different size solder joint aged at a same temperature for different aging time. The layer thickness and microstructure were analyzed using scanning electron microscopy (SEM). Photoshop was used to measure the thickness of intermetallic compound. Two different size of solder joints with composition of Sn-Ag-Cu (305) were used.

  17. Serum 2,3,7,8-tetrachlorodibenzo-p-dioxin levels in Air Force health study participants - preliminary report

    SciTech Connect

    Not Available

    1988-06-24

    In 1978, the US Air Force responded to a congressional mandate to initiate an epidemiologic study of the possible health effects of exposure to herbicides and their 2,3,7,8-tetrachlorodibenzo-p-dioxin (TCDD) contaminants in Air Force veterans who served in the Ranch Hand defoliation operation during the Vietnam conflict. Accordingly, the Air Force conducted a nonconcurrent prospective study, the Air Force Health Study, of all 1267 members of the Ranch Hand unit and a series of matched controls. This phase of the Air Force study focused on measuring serum TCDD levels in 150 Ranch Hand veterans and 50 controls. All participants were enlisted men; the Ranch Hand veterans had been either herbicide loaders or herbicide specialists in Vietnam. The demographic and health characteristics of Ranch Hand personnel and controls were similar; however, their serum TCDD levels differed markedly.

  18. Effects of simulated storage on the solder wettability of inhibited substrates

    SciTech Connect

    Hosking, F.M.; Sorensen, N.R.

    1992-01-01

    Solder wettability of Class II environmentally exposed Cu substrates coated with an organic solderability preservative (OSP) is being investigated. The OSP coatings slightly retarded the wetting behavior of 60Sn-40Pb solder during baseline testing of unaged coupons. A nominal increase in wetting angle, or decrease in wettability, was observed on the inhibited surfaces, particularly when less active fluxes were used. Small increases in the wetting time and decreases in the wetting rate were also measured. Simulated accelerated aging tests are underway to determine the effects of aging in a typical indoor industrial environment on the solder wettability of OSP coated Cu.

  19. Effects of simulated storage on the solder wettability of inhibited substrates

    SciTech Connect

    Hosking, F.M.; Sorensen, N.R.

    1992-12-01

    Solder wettability of Class II environmentally exposed Cu substrates coated with an organic solderability preservative (OSP) is being investigated. The OSP coatings slightly retarded the wetting behavior of 60Sn-40Pb solder during baseline testing of unaged coupons. A nominal increase in wetting angle, or decrease in wettability, was observed on the inhibited surfaces, particularly when less active fluxes were used. Small increases in the wetting time and decreases in the wetting rate were also measured. Simulated accelerated aging tests are underway to determine the effects of aging in a typical indoor industrial environment on the solder wettability of OSP coated Cu.

  20. High-power semiconductor laser array packaged on microchannel cooler using gold-tin soldering technology

    NASA Astrophysics Data System (ADS)

    Wang, Jingwei; Kang, Lijun; Zhang, Pu; Nie, Zhiqiang; Li, Xiaoning; Xiong, Lingling; Liu, Xingsheng

    2012-03-01

    High power semiconductor laser arrays have found increased applications in many fields. In this work, a hard soldering microchannel cooler (HSMCC) technology was developed for packaging high power diode laser array. Numerical simulations of the thermal behavior characteristics of hard solder and indium solder MCC-packaged diode lasers were conducted and analyzed. Based on the simulated results, a series of high power HSMCC packaged diode laser arrays were fabricated and characterized. The test and statistical results indicated that under the same output power the HSMCC packaged laser bar has lower smile and high reliability in comparison with the conventional copper MCC packaged laser bar using indium soldering technology.

  1. An Evaluation of Prototype Circuit Boards Assembled with a Sn-Ag Bi Solder

    SciTech Connect

    ARTAKI,I.; RAY,U.; REJENT,JEROME A.; VIANCO,PAUL T.

    1999-09-01

    An evaluation was performed which examined the aging of surface mount solder joints assembled with 91.84Sn-3.33Ag-4.83Bi solder. Defect analysis of the as-fabricated test vehicles revealed excellent solderability, good package alignment, and a minimum number of voids. Continuous DC electrical monitoring of the solder joints did not reveal opens during as many as 10,000 thermal cycles (0 C, 100 C). The solder joints exhibited no significant degradation through 2500 cycles, based upon an absence of microstructural damage and sustained shear and pull strengths of chip capacitors and J-leaded solder joints, respectively. Thermal cycles of 5000 and 10,000 resulted in some surface cracking of the solder fillets and coatings. In a few cases, deeper cracks were observed in the thinner reaches of several solder fillets. There was no deformation or cracking in the solder located in the gap between the package I/O and the circuit board pad nor in the interior of the fillets, both locations that would raise concerns of joint mechanical integrity. A drop in the chip capacitor shear strength was attributed to crack growth near the top of the fillet.

  2. Automated inspection of solder joints for surface mount technology

    NASA Technical Reports Server (NTRS)

    Savage, Robert M.; Park, Hyun Soo; Fan, Mark S.

    1993-01-01

    Researchers at NASA/GSFC evaluated various automated inspection systems (AIS) technologies using test boards with known defects in surface mount solder joints. These boards were complex and included almost every type of surface mount device typical of critical assemblies used for space flight applications: X-ray radiography; X-ray laminography; Ultrasonic Imaging; Optical Imaging; Laser Imaging; and Infrared Inspection. Vendors, representative of the different technologies, inspected the test boards with their particular machine. The results of the evaluation showed limitations of AIS. Furthermore, none of the AIS technologies evaluated proved to meet all of the inspection criteria for use in high-reliability applications. It was found that certain inspection systems could supplement but not replace manual inspection for low-volume, high-reliability, surface mount solder joints.

  3. Solder Interconnect Predictor (SIP) Software v. 0.5

    2008-11-19

    This software tool was developed for predicting the fatigue damage in a wide variety of 63Sn-37Pb solder joints used in electronics applications. This tool is based upon the unified creep plasticity damage model CompSIR developed at Sandia National Laboratories. The software can be used as a design tool for predicting the long term reliability of consumer, military and space electronics. Both service as well as accelerated testing environments can be addressed by the user. Themore » mesh generating function provides the user with the greater versatility to explore different package and I/O configurations. For example, different solder joint geometries can be investigated to determine the effects of workmanship quality on reliability. Graphical user interfaces provide the user with easy data input screens as well as results profiles.« less

  4. Laser tissue welding mediated with a protein solder

    SciTech Connect

    Small, W. IV; Heredia, N.J.; Celliers, P.M.

    1996-02-01

    A study of laser tissue welding mediated with an indocyanine green dye-enhanced protein solder was performed. Freshly obtained sections of porcine artery were used for the experiments. Sample arterial wall thickness ranged from two to three millimeters. Incisions approximately four millimeters in length were treated using an 805 nanometer continuous-wave diode laser coupled to a one millimeter diameter fiber. Controlled parameters included the power delivered by the laser, the duration of the welding process, and the concentration of dye in the solder. A two-color infrared detection system was constructed to monitor the surface temperatures achieved at the weld site. Burst pressure measurements were made to quantify the strengths of the welds immediately following completion of the welding procedure.

  5. Solder Interconnect Predictor (SIP) Software v. 0.5

    SciTech Connect

    VIANCO, PAUL; NEILSEN, MICHAEL; & REJENT, JEROME

    2008-11-19

    This software tool was developed for predicting the fatigue damage in a wide variety of 63Sn-37Pb solder joints used in electronics applications. This tool is based upon the unified creep plasticity damage model CompSIR developed at Sandia National Laboratories. The software can be used as a design tool for predicting the long term reliability of consumer, military and space electronics. Both service as well as accelerated testing environments can be addressed by the user. The mesh generating function provides the user with the greater versatility to explore different package and I/O configurations. For example, different solder joint geometries can be investigated to determine the effects of workmanship quality on reliability. Graphical user interfaces provide the user with easy data input screens as well as results profiles.

  6. Traffic source emission and street level air pollution in urban areas of Guangzhou, South China (P.R.C.)

    NASA Astrophysics Data System (ADS)

    Qin, Y.; Chan, L. Y.

    Street level air pollution due to traffic emission is a cause of concern in Guangzhou City. During the winter and summer of 1988, the traffic-related air pollutant concentrations, wind field, traffic volume and vehicle speed were measured extensively in three types of street canyons in Guangzhou City. Various types of motor vehicle emission in idle condition were measured and the composite emission factors of vehicles were derived. The variation of traffic volume and vehicle speed in 223 mainstreets were also investigated. The annual air pollutant concentration levels of traffic source emission were calculated. Using CO as a traffic emission tracer for air pollution on the street, the contributions of traffic emission to street level air pollution were determined by the receptor method. Ground level air pollution in Guangzhou has changed from coal combustion emission type into traffic source emission type. The average contributions of traffic source emission to the concentration of CO and NO x on the street in 1988 are about 87% and 67%. The most significant pollutant of ambient air quality that traffic source emission influences in NO x.

  7. Assessment of air pollution tolerance levels of selected plants around cement industry, Coimbatore, India.

    PubMed

    Radhapriya, P; NavaneethaGopalakrishnan, A; Malini, P; Ramachandran, A

    2012-05-01

    Being the second largest manufacturing industry in India, cement industry is one of the major contributors of suspended particulate matter (SPM). Since plants are sensitive to air pollution, introducing suitable plant species as part of the greenbelt around cement industry was the objective of the present study. Suitable plant species were selected based on the Air pollution tolerance index (APTI) calculated by analyzing ascorbic acid (AA), pH, relative water content (RWC) and total chlorophyll (TChl) of the plants occuring in the locality. Plants were selected within a 6 km radius from the industry and were graded as per their tolerance levels by analyzing the biochemical parameters. From the statistical analysis at 0.05 level of significance a difference in the APTI values among the 27 plant species was observed, but they showed homogenous results when analysed zone wise using one-way analyses of variance. Analyses of individual parameters showed variation in the different zones surrounding the cement industry, whereas the APTI value (which is a combination of the parameter viz. AA, RWC, TChl, pH) showed more or less same gradation. Significant variation in individual parameters and APTI was seen with in the species. All the plants surrounding the cement industry are indicative of high pollution exposure comparable to the results obtain for control plants. Based on the APTI value, it was observed that about 37% of the plant species were tolerant. Among them Mangifera indica, Bougainvillea species, Psidum quajava showed high APTI values. 33% of the species were highly susceptible to the adverse effects of SPM, among which Thevetia neriifolia, Saraca indica, Phyllanthus emblica and Cercocarpus ledifolius showed low APTI values. 15% each of the species were at the intermediary and moderate tolerance levels.

  8. Low-level air pollution and upper respiratory infections in children.

    PubMed Central

    Jaakkola, J J; Paunio, M; Virtanen, M; Heinonen, O P

    1991-01-01

    Effects of low-level air pollution were studied in one polluted city and two reference cities in northern Finland by comparing the frequency of upper respiratory infections over a 12-month period in 1982 as reported by parents of children ages 14 through 18 months (n = 679) and 6 years (n = 759). A similar comparison was carried out between children living in the more polluted and less polluted areas of the polluted city. The annual mean and the greatest half-hour concentrations of sulfur dioxide (23 and 807 micrograms/m3), particulates (31 and 291 micrograms/m3), nitrogen oxides (15 and 160 micrograms/m3), and hydrogen sulfide (2 and 177 micrograms/m3) in the polluted city were mainly due to industrial sources. In the reference cities, air pollution was produced mainly by traffic and heating. Adjusted odds ratios (OR) for one or more upper respiratory infections of residents in the polluted city vs those in the reference cities were 2.0 (95% confidence interval [CI] = 1.3-3.2) in the younger age group and 1.6 (95% CI = 1.1-2.1) in the older age group. Within the polluted city, OR calculated for living in more vs less polluted areas were 2.0 (95% CI = 1.0-4.0) in the younger and 1.6 (95% CI = 1.0-2.7) in the older children. The present results suggests that, for children, air pollution can be hazardous in concentrations lower than those recorded in earlier studies from Britain and central Europe. The synergistic effect of sulfur dioxide, particulates, nitrogen oxides, hydrogen sulfide, and other pollutants may be a contributing factor. PMID:1854003

  9. Predicted ball grid array thermal response during reflow soldering

    SciTech Connect

    Voth, T.E.; Bergman, T.L.

    1995-12-31

    A numerical model is developed to predict the detailed thermomechanical response of a BGA assembly during reflow soldering. The governing coupled solid mechanics and heat diffusion equations are solved using a commercially available finite element package. Reported predictions illustrate the system`s sensitivity to both thermal and mechanical processing conditions, as well as component thermal properties. Specifically, assemblies with components of high thermal conductivity show the greatest sensitivity to mechanical loading conditions.

  10. Impact of lead and other metallic solders on water quality

    SciTech Connect

    Murrell, N.E.

    1990-02-01

    A study of the relationship between water quality at the consumer's taps and the corrosion of lead solder was conducted under actual field conditions in 90 homes supplied by public water in the South Huntington Water District (New York) and at 14 houses supplied by private wells in Suffolk County on Long Island (New York). The study was done in three phases three different pH ranges (5.0-6.8, 7.0-7.4, and 8.0 and greater). The phase I study was preformed without any pH adjustments on the water sources. Phase II and III studies consisted of raising the pH by the addition of caustic soda and maintaining pH for thirty days prior to the sampling. After an overnight period of nonuse, a series of samples were collected at specific time intervals to evaluate the effect of time on the leaching rate of lead. Data were collected on leaching of cadmium and copper and water quality parameters were monitored. In the 2nd part of the investigation, a more controlled, four-pipe loop study was conducted with the same corrosive Long Island water. Each pipe loop consisted of approximately 60 feet of copper pipe with 22 solder joints, each loop having a different type of solder: (1) tin/lead; (2) tin/antimony; (3) silver/copper, and (4) tin/copper. The four loop solder test results indicate the tin/antimony, silver/copper, and tin/copper can be used with only minor metal leaching.

  11. Solder joint fatigue analysis under low temperature Martian conditions

    NASA Technical Reports Server (NTRS)

    Tudryn, Carissa

    2006-01-01

    Electronics, without requiring heater power or enclosure in a centralized 'warm electronics box,' will need to survive mean surface temperatures of -120 degrees Celsius to +20 degrees Celsius for an extended Martian mission and an operational temperature up to 85 degrees Celsisus. Since these electronics will need to survive extended cycles under these conditions, fatigue is a significant concern. The solder joint reliability of connectors on a printed wiring board was investigated.

  12. Developing Community-Level Policy and Practice to Reduce Traffic-Related Air Pollution Exposure

    PubMed Central

    Brugge, Doug; Patton, Allison P.; Bob, Alex; Reisner, Ellin; Lowe, Lydia; Bright, Oliver-John M.; Durant, John L.; Newman, Jim; Zamore, Wig

    2016-01-01

    The literature consistently shows associations of adverse cardiovascular and pulmonary outcomes with residential proximity to highways and major roadways. Air monitoring shows that traffic-related pollutants (TRAP) are elevated within 200–400 m of these roads. Community-level tactics for reducing exposure include the following: 1) HEPA filtration; 2) Appropriate air-intake locations; 3) Sound proofing, insulation and other features; 4) Land-use buffers; 5) Vegetation or wall barriers; 6) Street-side trees, hedges and vegetation; 7) Decking over highways; 8) Urban design including placement of buildings; 9) Garden and park locations; and 10) Active travel locations, including bicycling and walking paths. A multidisciplinary design charrette was held to test the feasibility of incorporating these tactics into near-highway housing and school developments that were in the planning stages. The resulting designs successfully utilized many of the protective tactics and also led to engagement with the designers and developers of the sites. There is a need to increase awareness of TRAP in terms of building design and urban planning. PMID:27413416

  13. Association between State Assistance on the Topic of Indoor Air Quality and School District-Level Policies That Promote Indoor Air Quality in Schools

    ERIC Educational Resources Information Center

    Everett Jones, Sherry; Doroski, Brenda; Glick, Sherry

    2015-01-01

    Nationally representative data from the 2012 School Health Policies and Practices Study examined whether state assistance on indoor air quality (IAQ) was associated with district-level policies and practices related to IAQ and integrated pest management (IPM). Districts in states that provided assistance on IAQ were more likely than districts not…

  14. Morphology and Shear Strength of Lead-Free Solder Joints with Sn3.0Ag0.5Cu Solder Paste Reinforced with Ceramic Nanoparticles

    NASA Astrophysics Data System (ADS)

    Yakymovych, A.; Plevachuk, Yu.; Švec, P.; Švec, P.; Janičkovič, D.; Šebo, P.; Beronská, N.; Roshanghias, A.; Ipser, H.

    2016-08-01

    To date, additions of different oxide nanoparticles is one of the most widespread procedures to improve the mechanical properties of metals and metal alloys. This research deals with the effect of minor ceramic nanoparticle additions (SiO2, TiO2 and ZrO2) on the microstructure and mechanical properties of Cu/solder/Cu joints. The reinforced Sn3.0Ag0.5Cu (SAC305) solder alloy with 0.5 wt.% and 1.0 wt.% of ceramic nanoparticles was prepared through mechanically stirring. The microstructure of as-solidified Cu/solder/Cu joints was studied using scanning electron microscopy. The additions of ceramic nanoparticles suppressed the growth of the intermetallic compound layer Cu6Sn5 at the interface solder/Cu and improved the microstructure of the joints. Furthermore, measurements of mechanical properties showed improved shear strength of Cu/composite solder/Cu joints compared to joints with unreinforced solder. This fact related to all investigated ceramic nanoinclusions and should be attributed to the adsorption of nanoparticles on the grain surface during solidification. However, this effect is less pronounced on increasing the nanoinclusion content from 0.5 wt.% to 1.0 wt.% due to agglomeration of nanoparticles. Moreover, a comparison analysis showed that the most beneficial influence was obtained by minor additions of SiO2 nanoparticles into the SAC305 solder alloy.

  15. A Well-Mixed Computational Model for Estimating Room Air Levels of Selected Constituents from E-Vapor Product Use

    PubMed Central

    Rostami, Ali A.; Pithawalla, Yezdi B.; Liu, Jianmin; Oldham, Michael J.; Wagner, Karl A.; Frost-Pineda, Kimberly; Sarkar, Mohamadi A.

    2016-01-01

    Concerns have been raised in the literature for the potential of secondhand exposure from e-vapor product (EVP) use. It would be difficult to experimentally determine the impact of various factors on secondhand exposure including, but not limited to, room characteristics (indoor space size, ventilation rate), device specifications (aerosol mass delivery, e-liquid composition), and use behavior (number of users and usage frequency). Therefore, a well-mixed computational model was developed to estimate the indoor levels of constituents from EVPs under a variety of conditions. The model is based on physical and thermodynamic interactions between aerosol, vapor, and air, similar to indoor air models referred to by the Environmental Protection Agency. The model results agree well with measured indoor air levels of nicotine from two sources: smoking machine-generated aerosol and aerosol exhaled from EVP use. Sensitivity analysis indicated that increasing air exchange rate reduces room air level of constituents, as more material is carried away. The effect of the amount of aerosol released into the space due to variability in exhalation was also evaluated. The model can estimate the room air level of constituents as a function of time, which may be used to assess the level of non-user exposure over time. PMID:27537903

  16. A Well-Mixed Computational Model for Estimating Room Air Levels of Selected Constituents from E-Vapor Product Use.

    PubMed

    Rostami, Ali A; Pithawalla, Yezdi B; Liu, Jianmin; Oldham, Michael J; Wagner, Karl A; Frost-Pineda, Kimberly; Sarkar, Mohamadi A

    2016-01-01

    Concerns have been raised in the literature for the potential of secondhand exposure from e-vapor product (EVP) use. It would be difficult to experimentally determine the impact of various factors on secondhand exposure including, but not limited to, room characteristics (indoor space size, ventilation rate), device specifications (aerosol mass delivery, e-liquid composition), and use behavior (number of users and usage frequency). Therefore, a well-mixed computational model was developed to estimate the indoor levels of constituents from EVPs under a variety of conditions. The model is based on physical and thermodynamic interactions between aerosol, vapor, and air, similar to indoor air models referred to by the Environmental Protection Agency. The model results agree well with measured indoor air levels of nicotine from two sources: smoking machine-generated aerosol and aerosol exhaled from EVP use. Sensitivity analysis indicated that increasing air exchange rate reduces room air level of constituents, as more material is carried away. The effect of the amount of aerosol released into the space due to variability in exhalation was also evaluated. The model can estimate the room air level of constituents as a function of time, which may be used to assess the level of non-user exposure over time. PMID:27537903

  17. Air evacuation under high-level biosafety containment: the aeromedical isolation team.

    PubMed Central

    Christopher, G. W.; Eitzen, E. M.

    1999-01-01

    Military contingency operations in tropical environments and potential use of biological weapons by adversaries may place troops at risk for potentially lethal contagious infections (e.g., viral hemorrhagic fevers, plague, and zoonotic poxvirus infections). Diagnosis and treatment of such infections would be expedited by evacuating a limited number of patients to a facility with containment laboratories. To safely evacuate such patients by military aircraft and minimize the risk for transmission to air crews, caregivers, and civilians, the U.S. Army Medical Research Institute of Infectious Diseases maintains an aeromedical isolation team. This rapid response team, which has worldwide airlift capability designed to evacuate and manage patients under high-level containment, also offers a portable containment laboratory, limited environmental decontamination, and specialized consultative expertise. This article also examines technical aspects of the team's equipment, training, capabilities, and deployments. PMID:10221876

  18. SPONTANEOUS CATALYTIC WET AIR OXIDATION DURING PRE-TREATMENT OF HIGH-LEVEL RADIOACTIVE WASTE SLUDGE

    SciTech Connect

    Koopman, D.; Herman, C.; Pareizs, J.; Bannochie, C.; Best, D.; Bibler, N.; Fellinger, T.

    2009-10-01

    Savannah River Remediation, LLC (SRR) operates the Defense Waste Processing Facility for the U.S. Department of Energy at the Savannah River Site. This facility immobilizes high-level radioactive waste through vitrification following chemical pretreatment. Catalytic destruction of formate and oxalate ions to carbon dioxide has been observed during qualification testing of non-radioactive analog systems. Carbon dioxide production greatly exceeded hydrogen production, indicating the occurrence of a process other than the catalytic decomposition of formic acid. Statistical modeling was used to relate the new reaction chemistry to partial catalytic wet air oxidation of both formate and oxalate ions driven by the low concentrations of palladium, rhodium, and/or ruthenium in the waste. Variations in process conditions led to increases or decreases in the total oxidative destruction, as well as partially shifting the preferred species undergoing destruction from oxalate ion to formate ion.

  19. Polybrominated diphenyl ethers in air across China: levels, compositions, and gas-particle partitioning.

    PubMed

    Yang, Meng; Qi, Hong; Jia, Hong-Liang; Ren, Nan-Qi; Ding, Yong-Sheng; Ma, Wan-Li; Liu, Li-Yan; Hung, Hayley; Sverko, Ed; Li, Yi-Fan

    2013-08-01

    Air samples were concurrently collected using high volume air samplers for 24 h every week from September 2008 to August 2009 at 15 sites (11 urban, 1 suburban, and 3 background/rural) across China. Twelve polybrominated diphenyl ether (PBDE) congeners (BDE-17, -28, -47, -66, -85, -99, -100, -138, -153, -154, -183, and -209) were measured. Total PBDE concentrations (∑12PBDEs) in air (gas + particle phases) were in the range of 11.0-838 pg m(-3) with a mean of 232 ± 72 (mean ± SE) pg m(-3). The site with the highest concentration was Guangzhou (838 ± 126 pg m(-3)), followed by Beijing (781 ± 107 pg m(-3)). Significant positive correlations were found between PBDEs levels and urban population (R = 0.69, P < 0.05) and gross industrial output values (R = 0.87, P < 0.001) as well. BDE-209 was the dominating congener with the contribution of 64 ± 23% to ∑12PBDEs, followed by BDE-47(8 ± 8%) and -99(6 ± 5%) at all urban and suburban sites. At background/rural sites, however, BDE-47 was the dominating congener, followed by BDE-99, together accounting for 52 ± 21% of ∑12PBDEs, while BDE-209 was only 11 ± 2%. It was found that PBDEs at the 15 sites showed a primary distribution and fractionation pattern. This study produced more than 700 pairs of air samples in gaseous and particulate phases with a wide temperature range of ∼60 °C, providing a good opportunity to investigate gas-particle partitioning for individual PBDE congeners. The results of gas-particle partitioning analysis for PBDEs using both subcooled-liquid-vapor pressure (PL)-based and octanol-air partition coefficient (KOA)-based models indicated that PBDEs in air at all sampling sites had not reached equilibrium because the slope values (mO) in the KOA-based equation and the opposite slope values (mP) in the PL-based equation at all 15 sampling sites were less than 1. It also found that both mO and -mP were significantly and positively correlated with the annual average temperatures of sampling

  20. Indoor air quality in Portuguese schools: levels and sources of pollutants.

    PubMed

    Madureira, J; Paciência, I; Pereira, C; Teixeira, J P; Fernandes, E de O

    2016-08-01

    Indoor air quality (IAQ) parameters in 73 primary classrooms in Porto were examined for the purpose of assessing levels of volatile organic compounds (VOCs), aldehydes, particulate matter, ventilation rates and bioaerosols within and between schools, and potential sources. Levels of VOCs, aldehydes, PM2.5 , PM10 , bacteria and fungi, carbon dioxide (CO2 ), carbon monoxide, temperature and relative humidity were measured indoors and outdoors and a walkthrough survey was performed concurrently. Ventilation rates were derived from CO2 and occupancy data. Concentrations of CO2 exceeding 1000 ppm were often encountered, indicating poor ventilation. Most VOCs had low concentrations (median of individual species <5 μg/m(3) ) and were below the respective WHO guidelines. Concentrations of particulate matter and culturable bacteria were frequently higher than guidelines/reference values. The variability of VOCs, aldehydes, bioaerosol concentrations, and CO2 levels between schools exceeded the variability within schools. These findings indicate that IAQ problems may persist in classrooms where pollutant sources exist and classrooms are poorly ventilated; source control strategies (related to building location, occupant behavior, maintenance/cleaning activities) are deemed to be the most reliable for the prevention of adverse health consequences in children in schools.

  1. Impacts of traffic-induced lead emissions on air, soil and blood lead levels in Beirut.

    PubMed

    Hashisho, Z; El-Fadel, M

    2004-01-01

    Lead is a purely toxic heavy metal which induces a wide variety of adverse physiologic effects. Nevertheless, it has been mined and used for more than 8,000 years. Among the different contemporary sources of lead pollution, traffic-induced emissions from the combustion of leaded gasoline is of particular concern, as it can constitute more than 90 percent of total lead emissions into the atmosphere in congested urban areas where no phase-out activities have been adopted. Gasoline lead content and traffic volume are strongly correlated with concentrations of lead in various environmental media. In the absence of policies to reduce the use of lead in gasoline or to favor the use of unleaded gasoline, leaded gasoline remains the predominant grade in many countries. This paper assesses the status of lead pollution from the combustion of leaded gasoline in Beirut based on field measurements of lead in air and roadside dust of urban and rural/suburban areas and recent data on soil and blood lead levels. Average atmospheric lead concentrations was about 1.86 microg m(-3) at urban locations and 0.147 microg m(-3) at suburban locations. The analysis of roadside dust revealed an average lead level of 353 microg g(-1) along urban streets and 125 microg g(-1) along rural/suburban roads. Blood lead levels were also relatively high in comparison to countries where leaded gasoline has been phased-out.

  2. A microstructural analysis of solder joints from the electronic assemblies of dismantled nuclear weapons

    SciTech Connect

    Vianco, P.T.; Rejent, J.A.

    1997-05-01

    MC1814 Interconnection Boxes from dismantled B57 bombs, and MC2839 firing Sets from retired W70-1 warheads were obtained from the Pantex facility. Printed circuit boards were selected from these components for microstructural analysis of their solder joints. The analysis included a qualitative examination of the solder joints and quantitative assessments of (1) the thickness of the intermetallic compound layer that formed between the solder and circuit board Cu features, and (2) the Pb-rich phase particle distribution within the solder joint microstructure. The MC2839 solder joints had very good workmanship qualities. The intermetallic compound layer stoichiometry was determined to be that of Cu6Sn5. The mean intermetallic compound layer thickness for all solder joints was 0.885 mm. The magnitude of these values did not indicate significant growth over the weapon lifetime. The size distribution of the Pb-rich phase particles for each of the joints were represented by the mean of 9.85 {times} 10{sup {minus}6} mm{sup 2}. Assuming a spherical geometry, the mean particle diameter would be 3.54 mm. The joint-to-joint difference of intermetallic compound layer thickness and Pb-rich particle size distribution was not caused by varying thermal environments, but rather, was a result of natural variations in the joint microstructure that probably existed at the time of manufacture. The microstructural evaluation of the through-hole solder joints form the MC2839 and MC1814 components indicated that the environmental conditions to which these electronic units were exposed in the stockpile, were benign regarding solder joint aging. There was an absence of thermal fatigue damage in MC2839 circuit board, through-hole solder joints. The damage to the eyelet solder joints of the MC1814 more likely represented infant mortality failures at or very near the time of manufacture, resulting from a marginal design status of this type of solder joint design.

  3. 3D FEM Simulations of Drop Test Reliability on 3D-WLP: Effects of Solder Reflow Residual Stress and Molding Resin Parameters

    NASA Astrophysics Data System (ADS)

    Belhenini, Soufyane; Tougui, Abdellah; Bouchou, Abdelhake; Mohan, Ranganathan; Dosseul, Franck

    2014-01-01

    Numerous three-dimensional (3D) packaging technologies are currently used for 3D integration. 3D-wafer level package (3D-WLP) appears to be a way to keep increasing the density of the microelectronic components. The reliability of 3D components has to be evaluated on mechanical demonstrators with daisy chains before real production. Numerical modeling is acknowledged as a very efficient tool for design optimization. In this paper, 3D finite-elements calculations are carried out to analyze the effects of molding resin's mechanical properties and thickness on the 3D component's dynamic response under drop loading conditions. Residual stress generated by solder reflow is also discussed. The influences of residual stresses on the numerical estimation of the component behavior during drop loading are studied. Solder reflow residual stresses have an impact on solder plastic strain and die equivalent stress calculations. We have compared the result of two numerical drop test models. Stress-free initial conduction is introduced for the first model. Solder reflow residual stresses are considered as the initial condition for the second drop test model. Quantitative and qualitative comparisons are carried out to show the effect of residual stress in drop test calculations. For the effect of molding resin thickness on the component behavior under drop loading, the stress-free initial condition is considered. The effect of the molding resin's thickness on critical area location is discussed. The solder bump maximum plastic shear strain and the silicon die maximum equivalent stress are used as reliability criteria. Numerical submodeling techniques are used to increase calculation accuracy. Numerical results have contributed to the design optimization of the 3D-WLP component.

  4. Urban morphology and air quality in dense residential environments in Hong Kong. Part I: District-level analysis

    NASA Astrophysics Data System (ADS)

    Edussuriya, P.; Chan, A.; Ye, A.

    2011-09-01

    The link between urban morphology and air quality in various dense residential environments of Hong Kong are investigated through field measurements and statistical analysis. With regard to the myriads of parameters available in the literature, this study aims to identify the most important urban morphological parameters in the street-level and district levels that affect air quality dispersion in Hong Kong. The study postulates that there is an association between urban morphology and urban air quality and a statistical model is developed to explain the relationship amongst urban air quality, micro-meteorology and urban morphological dimension. The study considered 20 different urban residential areas in five major districts of Hong Kong and real-time street-level air pollutant and microclimatic data are collected. 21 morphological variables are identified and calculated based on the geometry of the urban fabric. This study is the first part of a series which focuses to identify whether district demarcation is correlated with air quality. According to the findings of statistical analysis, only 6 out of 21 morphological variables (complete aspect ratio, occlusivity, roughness height, zero-plane displacement height, total building volume/number of buildings, and standard deviation of height) report distinguishable variability at the district level. Their R2 (correlation coefficient) values vary from 0.2937 (plan area index) to 0.5457 (occlusivity) which is considered moderate to high. All these parameters describe the overall feature of the site rather than the specific geometric features of the street. It translates to the fact that in spite of the large in-district variations in morphological variables amongst the five districts, air pollution variations are insignificant for most of the variables and it means that air quality in Hong Kong are distinguishable not by district-level variable but rather in-site fabrics.

  5. Simulated inhalation levels of fragrance materials in a surrogate air freshener formulation.

    PubMed

    Rogers, Robert E; Isola, Daniel A; Jeng, Chwen-Jyh; Lefebvre, Andrea; Smith, Ladd W

    2005-10-15

    This study measured postapplication exposure levels of fragrance materials in a surrogate air freshener formulation in an environmentally-controlled exposure room (ECER). A five-s spray was released to simulate normal consumer use conditions. Time-course airborne fragrance material levels were sampled with Tenax tubes, and aerosol size distributions were monitored with a TSI 3320 aerodynamic particle sizer. Triplicate experiments were performed for each of the control/test substances. The control substance (unfragranced formulation) experiments indicated that the airborne fragrance materials were not detected, suggesting that the base propellant formulation did not interfere with the sampling procedure or analytical results. The test substance experiments found that the higher the volatility of the fragrance material, the higherthe airborne fragrance concentration within the ECER. In the adult breathing zone height, the maximum concentrations of the nine fragrance materials ranged from 108 to 347 microg/m3 during the first minute postapplication. In the child breathing zone height, the maximum fragrance material concentrations ranged from 125 to 362 microg/m3 during 2-6 min postapplication. Particle size distributions indicated that approximately 60-70% of the generated aerosols were less than 1 microm aerodynamic diameter. Initial peak particle mass concentrations (<5 microm) were 800-1000 microg/m3 during the first minute postapplication. Following initial peak concentrations, there was approximately 10-15 min of fluctuation, and then particle levels decayed gradually and exponentiallyto near background levels. Exposure to the test formulation would originate from two components: particle-bound and vapor-phase fragrance materials. Particle-bound fragrance exposure accounted for approximately 47% and 72% of the total exposures during the first minute postapplication period in the adult and child breathing zone heights, respectively.

  6. Exploring EKC, trends of growth patterns and air pollutants concentration level in Malaysia: A Nemerow Index Approach

    NASA Astrophysics Data System (ADS)

    Bekhet, Hussain A.; >Tahira Yasmin,

    2013-06-01

    The present study examines an Environmental Kuznets Curve (EKC) hypothesis by analyzing annual data of air pollutants concentartion and per capita GDP as economic indicator over the (1996-2010) period in Malaysia. Nemerow Index Approach (I) used to generate a measures of air pollution. The results show that ambient air quality indicators supports the EKC hypothesis which stated that pollution levels increase as a country develops, but begin to decrease as rising incomes pass beyond a turning poin. Also, the I result is justifying that most pollutants are showing value less than 1.

  7. On evaluating compliance with air pollution levels not to be exceeded more than once per year

    NASA Technical Reports Server (NTRS)

    Neustadter, H. E.; Sidik, S. M.

    1974-01-01

    The adequacy is considered of currently practiced monitoring and data reduction techniques for assessing compliance with 24-hour Air Quality Standards (AQS) not to be exceeded more than once per year. The present situation for suspended particulates is discussed. The following conclusions are reached: (1) For typical less than daily sampling (i.e., 60 to 120 24-hour samples per year) the deviation from independence of the data set should not be substantial. (2) The interchange of exponentiation and expectation operations in the EPA data reduction model, underestimates the second highest level by about 4 to 8 percent for typical sigma values. (3) Estimates of the second highest pollution level have associated with them a large statistical variability arising from the finite size of the sample. The 0.95 confidence interval ranges from + or - 40 percent for 120 samples per year to + or - 84 percent for 30 samples per year. (4) The design value suggested by EPA for abatement and/or control planning purposes typically gives a margin of safety of 60 to 120 percent.

  8. Low-level air pollution and hospital admissions for cardiac and cerebrovascular diseases in Helsinki.

    PubMed Central

    Pönkä, A; Virtanen, M

    1996-01-01

    OBJECTIVES: This study investigated whether low concentrations of ambient air pollutants are associated with hospital admissions for ischemic cardiac and cerebrovascular diseases. METHODS: Associations between daily concentrations of sulfur dioxide, nitric oxide, nitrogen dioxide, ozone, and particulates and daily hospital admissions due to ischemic cardiac and cerebrovascular diseases were studied in Helsinki, Finland, 1987 through 1989. The regression analyses controlled for weather, day of the week, season, long-term trends, and influenza epidemics. RESULTS: Admissions via emergency rooms due to ischemic cardiac diseases (n = 7005) were significantly associated with the prevailing levels of nitric oxide and ozone, and those due to cerebrovascular diseases (n = 3737) were associated with nitrogen dioxide; these levels were only moderate. Long-term transient myocardial ischemic attacks were related to particulates, and short-term ischemic attacks were related to nitrogen dioxide. CONCLUSIONS: Symptoms of ischemic cardiac and cerebrovascular diseases may be provoked by pollutants in concentrations lower than those given as guidelines in many countries and lower than previously shown. Images FIGURE 1 PMID:8806380

  9. NIST gravimetrically prepared atmospheric level methane in dry air standards suite.

    PubMed

    Rhoderick, George C; Carney, Jennifer; Guenther, Franklin R

    2012-04-17

    The Gas Metrology Group at the National Institute of Standards and Technology was tasked, by a congressional climate change act, to support the atmospheric measurement community through standards development of key greenhouse gases. This paper discusses the development of a methane (CH(4)) primary standard gas mixture (PSM) suite to support CH(4) measurement needs over a large amount-of-substance fraction range 0.3-20,000 μmol mol(-1), but with emphasis at the atmospheric level 300-4000 nmol mol(-1). Thirty-six CH(4) in dry air PSMs were prepared in 5.9 L high-pressure aluminum cylinders with use of a time-tested gravimetric technique. Ultimately 14 of these 36 PSMs define a CH(4) standard suite covering the nominal ambient atmospheric range of 300-4000 nmol mol(-1). Starting materials of pure CH(4) and cylinders of dry air were exhaustively analyzed to determine the purity and air composition. Gas chromatography with flame-ionization detection (GC-FID) was used to determine a CH(4) response for each of the 14 PSMs where the reproducibility of average measurement ratios as a standard error was typically (0.04-0.26) %. An ISO 6134-compliant generalized least-squares regression (GenLine) program was used to analyze the consistency of the CH(4) suite. All 14 PSMs passed the u-test with residuals between the gravimetric and the GenLine solution values being between -0.74 and 1.31 nmol mol(-1); (0.00-0.16)% relative absolute. One of the 14 PSMs, FF4288 at 1836.16 ± 0.75 nmol mol(-1) (k = 1) amount-of-substance fraction, was sent to the Korea Research Institute of Standards and Science (KRISS), the Republic of Korea's National Metrology Institute, for comparison. The same PSM was subsequently sent to the National Oceanic and Atmospheric Administration (NOAA) for analysis to their standards. Results show agreement between KRISS-NIST of +0.13% relative (+2.3 nmol mol(-1)) and NOAA-NIST of -0.14% relative (-2.54 nmol mol(-1)).

  10. Air modelling as an alternative to sampling for low-level radioactive airborne releases

    SciTech Connect

    Morgenstern, M.Y.; Hueske, K.

    1995-05-01

    This paper describes our efforts to assess the effect of airborne releases at one DOE laboratory using air modelling based on historical data. Among the facilities affected by these developments is Los Alamos National Laboratory (LANL) in New Mexico. RCRA, as amended by the Hazardous and Solid Waste Amendments (HSWA) in 1984, requires all facilities which involve the treatment, storage, and disposal of hazardous waste obtain a RCRA/HSWA waste facility permit. LANL complied with CEARP by initiating a process of identifying potential release sites associated with LANL operations prior to filing a RCRA/HSWA permit application. In the process of preparing the RCRA/HSWA waste facility permit application to the U.S. Environmental Protection Agency (EPA), a total of 603 Solid Waste Management Units (SWMUs) were identified as part of the requirements of the HSWA Module VIH permit requirements. The HSWA Module VIII permit requires LANL to determine whether there have been any releases of hazardous waste or hazardous constituents from SWMUs at the facility dating from the 1940`s by performing a RCRA Facility Investigation to address known or suspected releases from specified SWMUs to affected media (i.e. soil, groundwater, surface water, and air). Among the most troublesome of the potential releases sites are those associated with airborne radioactive releases. In order to assess health risks associated with radioactive contaminants in a manner consistent with exposure standards currently in place, the DOE and LANL have established Screening Action Levels (SALs) for radioactive soil contamination. The SALs for each radionuclide in soil are derived from calculations based on a residential scenario in which individuals are exposed to contaminated soil via inhalation and ingestion as well as external exposure to gamma emitters in the soil. The applicable SALs are shown.

  11. Three-Layer Zn/Al/Zn Clad Solder for Die Attachment

    NASA Astrophysics Data System (ADS)

    Yamaguchi, T.; Ikeda, O.; Oda, Y.; Hata, S.; Kuroki, K.; Kuroda, H.; Hirose, A.

    2015-02-01

    Three-layer Zn/Al/Zn clad solders have been developed for high-temperature die attachment. The clad structure is used to improve the wettability and bondability of Zn-Al eutectic solder by preventing oxidation of the Al. The materials were produced by clad-rolling Zn and Al strips. TEM observations revealed that the Zn/Al clad interface was metallurgically bonded and that the Al oxide was almost entirely removed. The melting behavior of Zn/Al/Zn clad solder was examined. Eutectic melting began at the Zn/Al clad interface at 382°C, and all of the material melted within approximately 10 s. Unlike conventional Zn-Al solders, Zn/Al/Zn clad solders were successfully bonded without flux. The shear strength of a Zn/Al/Zn clad solder joint was three times that of a Pb-based solder joint. The bondability of Zn/Al/Zn clad solder was superior because the Al oxide films, which prevent bonding between chip and substrate, were fragmented by clad-rolling, and the outer Zn layers prevented Al oxidation during the bonding process.

  12. Generation of Tin(II) Oxide Crystals on Lead-Free Solder Joints in Deionized Water

    NASA Astrophysics Data System (ADS)

    Chang, Hong; Chen, Hongtao; Li, Mingyu; Wang, Ling; Fu, Yonggao

    2009-10-01

    The effect of the anode and cathode on the electrochemical corrosion behavior of lead-free Sn-Ag-Cu and Sn-Ag-Cu-Bi solder joints in deionized water was investigated. Corrosion studies indicate that SnO crystals were generated on the surfaces of all lead-free solder joints. The constituents of the lead-free solder alloys, such as Ag, Cu, and Bi, did not affect the corrosion reaction significantly. In contrast to lead-free solders, PbO x was formed on the surface of the traditional 63Sn-37Pb solder joint in deionized water. A cathode, such as Au or Cu, was necessary for the electrochemical corrosion reaction of solders to occur. The corrosion reaction rate decreased with reduction of the cathode area. The formation mechanism of SnO crystals was essentially a galvanic cell reaction. The anodic reaction of Sn in the lead-free solder joints occurred through solvation by water molecules to form hydrated cations. In the cathodic reaction, oxygen dissolved in the deionized water captures electrons and is deoxidized to hydroxyl at the Au or Cu cathode. By diffusion, the anodic reaction product Sn2+ and the cathodic reaction product OH- meet to form Sn(OH)2, some of which can dehydrate to form more stable SnO· xH2O crystals on the surface of the solder joints. In addition, thermodynamic analysis confirms that the Sn corrosion reaction could occur spontaneously.

  13. Microstructure and Properties of Sn-10Bi- xCu Solder Alloy/Joint

    NASA Astrophysics Data System (ADS)

    Lai, Zhongmin; Ye, Dan

    2016-07-01

    The effect of Cu on the microstructure and properties of Sn-10Bi solder alloy/joint were investigated. The results showed that the microstructure of Sn-10Bi-Cu solder alloy consisted of a Sn-rich phase, Bi-rich phase, and particles of Cu6Sn5 intermetallic compounds (IMCs). The pasty range of Sn-10Bi- xCu had an influence on the spreading property of Sn-10Bi- xCu. Cu improved the growth of the IMCs layer during the liquid reaction stage. Furthermore, the hardness of the solder alloy increased as the Cu concentration of increased. The strength of the solder joint was controlled by the solder alloy hardness and the interfacial IMCs layer thickness together. For the joints with low solder alloy hardness and a thin IMCs layer, the fracture was in the solder alloy. For the joints with high solder alloy hardness and a thick IMCs layer, the fracture was in the IMCs layer.

  14. Dural reconstruction by fascia using a temperature-controlled CO2 laser soldering system

    NASA Astrophysics Data System (ADS)

    Forer, Boaz; Vasilyev, Tamar; Brosh, Tamar; Kariv, Naam; Gil, Ziv; Fliss, Dan M.; Katzir, Abraham

    2005-04-01

    Conventional methods for dura repair are normally based on sutures or stitches. These methods have several disadvantages: (1) The dura is often brittle, and the standard procedures are difficult and time consuming. (2) The seal is leaky. (3) The introduction of a foreign body (e.g. sutures) may cause an inflammatory response. In order to overcome these difficulties we used a temperature controlled fiber optic based CO2 laser soldering system. In a set of in vitro experiments we generated a hole of diameter 10 mm in the dura of a pig corpse, covered the hole with a segment of fascia, and soldered the fascia to the edges of the hole, using 47% bovine albumin as a solder. The soldering was carried out spot by spot, and each spot was heated to 65° C for 3-6 seconds. The soldered dura was removed and the burst pressure of the soldered patch was measured. The average value for microscopic muscular side soldering was 194 mm Hg. This is much higher than the maximal physiological pressure of the CSF fluid in the brain, which is 15 mm Hg. In a set of in vivo experiments, fascia patches were soldered on holes in five farm pigs. The long term results of these experiments were very promising. In conclusion, we have developed an advanced technique for dural reconstruction, which will find important clinical applications.

  15. Tissue soldering with biodegradable polymer films: in-vitro investigation of hydration effects on weld strength

    NASA Astrophysics Data System (ADS)

    Sorg, Brian S.; Welch, Ashley J.

    2001-05-01

    Previous work demonstrated increased breaking strengths of tissue repaired with liquid albumin solder reinforced with a biodegradable polymer film compared to unreinforced control specimens. It was hypothesized that the breaking strength increase was due to reinforcement of the liquid solder cohesive strength. Immersion in a moist environment can decrease the adhesion of solder to tissue and negate any strength benefits gained from reinforcement. The purpose of this study was to determine if hydrated specimens repaired with reinforced solder would still be stronger than unreinforced controls. A 50%(w/v) bovine serum albumin solder with 0.5 mg/mL Indocyanine Green dye was used to repair an incision in bovine aorta. The solder was coagulated with 806-nm diode laser light. A poly(DL-lactic- co-glycolic acid) film was used to reinforce the solder (the controls had no reinforcement). The repaired tissues were immersed in phosphate buffered saline for time periods of 1 and 2 days. The breaking strengths of all of the hydrated specimens decreased compared to the acute breaking strengths. However, the reinforced specimens still had larger breaking strengths than the unreinforced controls. These results indicate that reinforcement of a liquid albumin solder may have the potential to improve the breaking strength in a clinical setting.

  16. Development of technique for laser welding of biological tissues using laser welding device and nanocomposite solder.

    PubMed

    Gerasimenko, A; Ichcitidze, L; Podgaetsky, V; Ryabkin, D; Pyankov, E; Saveliev, M; Selishchev, S

    2015-08-01

    The laser device for welding of biological tissues has been developed involving quality control and temperature stabilization of weld seam. Laser nanocomposite solder applied onto a wound to be weld has been used. Physicochemical properties of the nanocomposite solder have been elucidated. The nature of the tissue-organizing nanoscaffold has been analyzed at the site of biotissue welding. PMID:26738200

  17. Microstructural Evaluation and Comparison of Solder Samples Processed Aboard the International Space Station

    NASA Technical Reports Server (NTRS)

    Grugel, R. N.; Hua, F.; Anilkumar, A. V.

    2008-01-01

    Samples from the In-Space Soldering Investigation (ISSI), conducted aboard the International Space Station (ISS), are being examined for post-solidification microstructural development and porosity distribution. In this preliminary study, the internal structures of two ISSI processed samples are compared. In one case 10cm of rosin-core solder was wrapped around a coupon wire and melted by conduction, whereas, in the other a comparable length of solder was melted directly onto the hot wire; in both cases the molten solder formed ellipsoidal blobs, a shape that was maintained during subsequent solidification. In the former case, there is clear evidence of porosity throughout the sample, and an accumulation of larger pores near the hot end that implies thermocapillary induced migration and eventual coalescence of the flux vapor bubbles. In the second context, when solder was fed onto the wire. a part of the flux constituting the solder core is introduced into and remains within the liquid solder ball, becoming entombed upon solidification. In both cases the consequential porosity, particularly at a solder/contact interface, is very undesirable. In addition to compromising the desired electrical and thermal conductivity, it promotes mechanical failure.

  18. Method and apparatus for jetting, manufacturing and attaching uniform solder balls

    SciTech Connect

    Yost, Frederick G.; Frear, Darrel R.; Schmale, David T.

    1999-01-01

    An apparatus and process for jetting molten solder in the form of balls directly onto all the metallized interconnects lands for a ball grid array package in one step with no solder paste required. Molten solder is jetted out of a grid of holes using a piston attached to a piezoelectric crystal. When voltage is applied to the crystal it expands forcing the piston to extrude a desired volume of solder through holes in the aperture plate. When the voltage is decreased the piston reverses motion creating an instability in the molten solder at the aperture plate surface and thereby forming spherical solder balls that fall onto a metallized substrate. The molten solder balls land on the substrate and form a metallurgical bond with the metallized lands. The size of the solder balls is determined by a combination of the size of the holes in the aperture plate, the duration of the piston pulse, and the displacement of the piston. The layout of the balls is dictated by the location of the hooks in the grid. Changes in ball size and layout can be easily accomplished by changing the grid plate. This invention also allows simple preparation of uniform balls for subsequent supply to BGA users.

  19. Method and apparatus for jetting, manufacturing and attaching uniform solder balls

    DOEpatents

    Yost, F.G.; Frear, D.R.; Schmale, D.T.

    1999-01-05

    An apparatus and process are disclosed for jetting molten solder in the form of balls directly onto all the metallized interconnects lands for a ball grid array package in one step with no solder paste required. Molten solder is jetted out of a grid of holes using a piston attached to a piezoelectric crystal. When voltage is applied to the crystal it expands forcing the piston to extrude a desired volume of solder through holes in the aperture plate. When the voltage is decreased the piston reverses motion creating an instability in the molten solder at the aperture plate surface and thereby forming spherical solder balls that fall onto a metallized substrate. The molten solder balls land on the substrate and form a metallurgical bond with the metallized lands. The size of the solder balls is determined by a combination of the size of the holes in the aperture plate, the duration of the piston pulse, and the displacement of the piston. The layout of the balls is dictated by the location of the hooks in the grid. Changes in ball size and layout can be easily accomplished by changing the grid plate. This invention also allows simple preparation of uniform balls for subsequent supply to BGA users. 7 figs.

  20. New multicomponent solder alloys of low melting pointfor low-cost commercial electronic assembly

    NASA Astrophysics Data System (ADS)

    Al-Ganainy, G. S.; Sakr, M. S.

    2003-09-01

    The requirements of the telecommunications, automobile, electronics and aircraft industries for non-toxic solders with melting points close to that of near-eutectic Pb-Sn alloys has led to the development of new Sn-Zn-In solder alloys. Differential thermal analysis (DTA) shows melting points of 198, 195, 190 and 185 +/- 2 °C for the alloys Sn-9Zn, Sn-9Zn-2In, Sn-9Zn-4In and Sn-9Zn-6In, respectively. An equation that fits the data relating the melting point to the In content in the solders is derived. The X-ray diffraction patterns are analyzed to determine the phases that exist in each solder. The stress-strain curves are studied in the temperature range from 90 to 130 °C for all the solders except for those that contain 4 wt% of In, where the temperature range continues to 150 °C. The work-hardening parameters, y (the yield stress), f (the fracture stress), and the parabolic work-hardening coefficient X, increase with increasing indium content in the solders at all working temperatures. They decrease with increasing working temperature for each solder, and show two relaxation stages only for the Sn-9Zn-4In solder around a temperature of 120 °C. (

  1. 30 CFR 77.1111 - Welding, cutting, soldering; use of fire extinguisher.

    Code of Federal Regulations, 2011 CFR

    2011-07-01

    ... 30 Mineral Resources 1 2011-07-01 2011-07-01 false Welding, cutting, soldering; use of fire... OF UNDERGROUND COAL MINES Fire Protection § 77.1111 Welding, cutting, soldering; use of fire extinguisher. One portable fire extinguisher shall be provided at each location where welding, cutting,...

  2. 30 CFR 77.1111 - Welding, cutting, soldering; use of fire extinguisher.

    Code of Federal Regulations, 2012 CFR

    2012-07-01

    ... 30 Mineral Resources 1 2012-07-01 2012-07-01 false Welding, cutting, soldering; use of fire... OF UNDERGROUND COAL MINES Fire Protection § 77.1111 Welding, cutting, soldering; use of fire extinguisher. One portable fire extinguisher shall be provided at each location where welding, cutting,...

  3. 30 CFR 77.1111 - Welding, cutting, soldering; use of fire extinguisher.

    Code of Federal Regulations, 2010 CFR

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, soldering; use of fire... OF UNDERGROUND COAL MINES Fire Protection § 77.1111 Welding, cutting, soldering; use of fire extinguisher. One portable fire extinguisher shall be provided at each location where welding, cutting,...

  4. 30 CFR 77.1111 - Welding, cutting, soldering; use of fire extinguisher.

    Code of Federal Regulations, 2014 CFR

    2014-07-01

    ... 30 Mineral Resources 1 2014-07-01 2014-07-01 false Welding, cutting, soldering; use of fire... OF UNDERGROUND COAL MINES Fire Protection § 77.1111 Welding, cutting, soldering; use of fire extinguisher. One portable fire extinguisher shall be provided at each location where welding, cutting,...

  5. 30 CFR 77.1111 - Welding, cutting, soldering; use of fire extinguisher.

    Code of Federal Regulations, 2013 CFR

    2013-07-01

    ... 30 Mineral Resources 1 2013-07-01 2013-07-01 false Welding, cutting, soldering; use of fire... OF UNDERGROUND COAL MINES Fire Protection § 77.1111 Welding, cutting, soldering; use of fire extinguisher. One portable fire extinguisher shall be provided at each location where welding, cutting,...

  6. Intermetallics Characterization of Lead-Free Solder Joints under Isothermal Aging

    NASA Astrophysics Data System (ADS)

    Choubey, Anupam; Yu, Hao; Osterman, Michael; Pecht, Michael; Yun, Fu; Yonghong, Li; Ming, Xu

    2008-08-01

    Solder interconnect reliability is influenced by environmentally imposed loads, solder material properties, and the intermetallics formed within the solder and the metal surfaces to which the solder is bonded. Several lead-free metallurgies are being used for component terminal plating, board pad plating, and solder materials. These metallurgies react together and form intermetallic compounds (IMCs) that affect the metallurgical bond strength and the reliability of solder joint connections. This study evaluates the composition and extent of intermetallic growth in solder joints of ball grid array components for several printed circuit board pad finishes and solder materials. Intermetallic growth during solid state aging at 100°C and 125°C up to 1000 h for two solder alloys, Sn-3.5Ag and Sn-3.0Ag-0.5Cu, was investigated. For Sn-3.5Ag solder, the electroless nickel immersion gold (ENIG) pad finish was found to result in the lowest IMC thickness compared to immersion tin (ImSn), immersion silver (ImAg), and organic solderability preservative (OSP). Due to the brittle nature of the IMC, a lower IMC thickness is generally preferred for optimal solder joint reliability. A lower IMC thickness may make ENIG a desirable finish for long-life applications. Activation energies of IMC growth in solid-state aging were found to be 0.54 ± 0.1 eV for ENIG, 0.91 ± 0.12 eV for ImSn, and 1.03 ± 0.1 eV for ImAg. Cu3Sn and Cu6Sn5 IMCs were found between the solder and the copper pad on boards with the ImSn and ImAg pad finishes. Ternary (Cu,Ni)6Sn5 intermetallics were found for the ENIG pad finish on the board side. On the component side, a ternary IMC layer composed of Ni-Cu-Sn was found. Along with intermetallics, microvoids were observed at the interface between the copper pad and solder, which presents some concern if devices are subject to shock and vibration loading.

  7. Evaluation of alternative cleaners for solder flux and mold release removal

    SciTech Connect

    Lopez, E.P.; Peebles, D.E.; Reich, J.E.; Smith, M.E.

    1991-01-01

    As part of a solvent substitution program, an evaluation of selected alternative cleaners for solder flux and mold release removal has been performed. Six cleaners were evaluated for their efficiency in removing a rosin mildly activated flux and a silicone mold release from copper, 17-4PH stainless steel, polyimide quartz glass and tin-lead surfaces. A parallel effort also studied deionized water removal of organic acid fluxes. Auger electron spectroscopy and X-ray photoelectron spectroscopy were used to determine relative elemental cleanliness of the outermost atomic layers. An Omega Meter Test was used to measure residual ionic contamination. Water drop contact angles were used to measure the effectiveness of silicone removal from Cu substrates. In most cases, the cleanliness levels were good to excellent. 10 refs., 8 figs., 19 tabs.

  8. Household-level disparities in cancer risks from vehicular air pollution in Miami

    NASA Astrophysics Data System (ADS)

    Collins, Timothy W.; Grineski, Sara E.; Chakraborty, Jayajit

    2015-09-01

    Environmental justice (EJ) research has relied on ecological analyses of socio-demographic data from areal units to determine if particular populations are disproportionately burdened by toxic risks. This article advances quantitative EJ research by (a) examining whether statistical associations found for geographic units translate to relationships at the household level; (b) testing alternative explanations for distributional injustices never before investigated; and (c) applying a novel statistical technique appropriate for geographically-clustered data. Our study makes these advances by using generalized estimating equations to examine distributive environmental inequities in the Miami (Florida) metropolitan area, based on primary household-level survey data and census block-level cancer risk estimates of hazardous air pollutant (HAP) exposure from on-road mobile emission sources. In addition to modeling determinants of on-road HAP cancer risk among all survey participants, two subgroup models are estimated to examine whether determinants of risk differ based on disadvantaged minority (Hispanic and non-Hispanic Black) versus non-Hispanic white racial/ethnic status. Results reveal multiple determinants of risk exposure disparities. In the model including all survey participants, renter-occupancy, Hispanic and non-Hispanic black race/ethnicity, the desire to live close to work/urban services or public transportation, and higher risk perception are associated with greater on-road HAP cancer risk; the desire to live in an amenity-rich environment is associated with less risk. Divergent subgroup model results shed light on the previously unexamined role of racial/ethnic status in shaping determinants of risk exposures. While lower socioeconomic status and higher risk perception predict significantly greater on-road HAP cancer risk among disadvantaged minorities, the desire to live near work/urban services or public transport predict significantly greater risk among

  9. The Resistance and Strength of Soft Solder Splices between Conductors in MICE Coils

    SciTech Connect

    Wu, Hong; Pan, Heng; Green, Michael A; Dietderich, Dan; Gartner, T. E.; Higley, Hugh C; Mentink, M.; Xu, FengYu; Trillaud, F.; Liu, X. K.; Wang, Li; Zheng, S. X.; Tam, D.G.

    2010-08-03

    Two of the three types of MICE magnets will have splices within their coils. The MICE coupling coils may have as many as fifteen one-meter long splices within them. Each of the MICE focusing coils may have a couple of 0.25-meter long conductor splices. Equations for the calculation of resistance of soldered lap splices of various types are presented. This paper presents resistance measurements of soldered lap splices of various lengths. Measured splice resistance is shown for one-meter long splices as a function of the fabrication method. Another important consideration is the strength of the splices. The measured breaking stress of splices of various lengths is presented in this paper. Tin-lead solders and tin-silver solders were used for the splices that were tested. From the data given in this report, the authors recommend that the use of lead free solders be avoided for low temperature coils.

  10. Bonding nature of rare-earth-containing lead-free solders

    NASA Astrophysics Data System (ADS)

    Ramirez, Ainissa G.; Mavoori, Hareesh; Jin, Sungho

    2002-01-01

    The ability of rare-earth-containing lead-free solders to wet and bond to silica was investigated. Small additions of Lu (0.5-2 wt. %) added to eutectic Sn-Ag or Au-Sn solder render it directly solderable to a silicon oxide surface. The bonding is attributed to the migration of the rare-earth element to the solder-silica interface for chemical reaction and the creation of an interfacial layer that contains a rare-earth oxide. It was found that additions of rare-earth materials did not significantly modify the solidification microstructure or the melting point. Such oxide-bondable solders can be useful for assembly of various optical communication devices.

  11. Some Observations of Solder Joint Failure Under Tensile-Compressive Stress

    NASA Technical Reports Server (NTRS)

    Winslow, J. W.

    1993-01-01

    It has long been known that solder joints under mechanical stress are subject to failure. In early electronic systems, such failures were avoided primarily by avoiding the use of solder as a mechanical structural component. The rule was to first make sound wire connections that did not depend mechanically on solder, and only then to solder them. Careful design and miniaturization in modern electronic systems limits the mechanical stresses exerted on solder joints to values less than their yield points, and these joints have become integral parts of the mechanical structures. Unfortunately, while these joints are strong enough when new, they have proven vulnerable to fatigue failures as they age.Details of the fatigue process are poorly understood, making predictions of expected lifetimes difficult.

  12. Learning algorithms for both real-time detection of solder shorts and for SPC measurement correction using cross-sectional x-ray images of PCBA solder joints

    NASA Astrophysics Data System (ADS)

    Roder, Paul A.

    1994-03-01

    Learning algorithms are introduced for use in the inspection of cross-sectional X-ray images of solder joints. These learning algorithms improve measurement accuracy by accounting for localized shading effects that can occur when inspecting double- sided printed circuit board assemblies. Two specific examples are discussed. The first is an algorithm for detection of solder short defects. The second algorithm utilizes learning to generate more accurate statistical process control measurements.

  13. Atmospheric infrared sounder on AIRS with emphasis on level 2 products

    NASA Technical Reports Server (NTRS)

    Lee, Sung-Yung; Fetzer, Eric; Granger, Stephanie; Hearty, Thomas; Lambrigtsen, Bjorn; Manning, Evan M.; Olsen, Edward; Pagano, Thomas

    2004-01-01

    The Atmospheric Infrared Sounder (AIRS) was launched aboard EOS Aqua in May of 2002. AIRS is a grating spectrometer with almost 2400 channels covering the 3.74 to 15.40 micron spectral region with a nominal spectral resolution ((nu)/(delta)(nu)) of 1200, with some gaps. In addition, AIRS has 4 channels in the NIR/VIS region. The AIRS operates in conjunction with the microwave sounders Advanced Microwave Sounding Unit (AMSU-A) and Humidity Sounder of Brazil (HSB). The microwave sounders are mainly used for cloud clearing of IR radiances, or to remove the effect of cloud on the IR radiances.

  14. Fast formation and growth of high-density Sn whiskers in Mg/Sn-based solder/Mg joints by ultrasonic-assisted soldering: Phenomena, mechanism and prevention.

    PubMed

    Li, M Y; Yang, H F; Zhang, Z H; Gu, J H; Yang, S H

    2016-01-01

    A universally applicable method for promoting the fast formation and growth of high-density Sn whiskers on solders was developed by fabricating Mg/Sn-based solder/Mg joints using ultrasonic-assisted soldering at 250 °C for 6 s and then subjected to thermal aging at 25 °C for 7 d. The results showed that the use of the ultrasonic-assisted soldering could produce the supersaturated dissolution of Mg in the liquid Sn and lead to the existence of two forms of Mg in Sn after solidification. Moreover, the formation and growth of the high-density whiskers were facilitated by the specific contributions of both of the Mg forms in the solid Sn. Specifically, interstitial Mg can provide the persistent driving force for Sn whisker growth, whereas the Mg2Sn phase can increase the formation probability of Sn whiskers. In addition, we presented that the formation and growth of Sn whiskers in the Sn-based solders can be significantly restricted by a small amount of Zn addition (≥3 wt.%), and the prevention mechanisms are attributed to the segregation of Zn atoms at grain or phase boundaries and the formation of the lamellar-type Zn-rich structures in the solder. PMID:27273421

  15. Fast formation and growth of high-density Sn whiskers in Mg/Sn-based solder/Mg joints by ultrasonic-assisted soldering: Phenomena, mechanism and prevention.

    PubMed

    Li, M Y; Yang, H F; Zhang, Z H; Gu, J H; Yang, S H

    2016-06-08

    A universally applicable method for promoting the fast formation and growth of high-density Sn whiskers on solders was developed by fabricating Mg/Sn-based solder/Mg joints using ultrasonic-assisted soldering at 250 °C for 6 s and then subjected to thermal aging at 25 °C for 7 d. The results showed that the use of the ultrasonic-assisted soldering could produce the supersaturated dissolution of Mg in the liquid Sn and lead to the existence of two forms of Mg in Sn after solidification. Moreover, the formation and growth of the high-density whiskers were facilitated by the specific contributions of both of the Mg forms in the solid Sn. Specifically, interstitial Mg can provide the persistent driving force for Sn whisker growth, whereas the Mg2Sn phase can increase the formation probability of Sn whiskers. In addition, we presented that the formation and growth of Sn whiskers in the Sn-based solders can be significantly restricted by a small amount of Zn addition (≥3 wt.%), and the prevention mechanisms are attributed to the segregation of Zn atoms at grain or phase boundaries and the formation of the lamellar-type Zn-rich structures in the solder.

  16. Fast formation and growth of high-density Sn whiskers in Mg/Sn-based solder/Mg joints by ultrasonic-assisted soldering: Phenomena, mechanism and prevention

    NASA Astrophysics Data System (ADS)

    Li, M. Y.; Yang, H. F.; Zhang, Z. H.; Gu, J. H.; Yang, S. H.

    2016-06-01

    A universally applicable method for promoting the fast formation and growth of high-density Sn whiskers on solders was developed by fabricating Mg/Sn-based solder/Mg joints using ultrasonic-assisted soldering at 250 °C for 6 s and then subjected to thermal aging at 25 °C for 7 d. The results showed that the use of the ultrasonic-assisted soldering could produce the supersaturated dissolution of Mg in the liquid Sn and lead to the existence of two forms of Mg in Sn after solidification. Moreover, the formation and growth of the high-density whiskers were facilitated by the specific contributions of both of the Mg forms in the solid Sn. Specifically, interstitial Mg can provide the persistent driving force for Sn whisker growth, whereas the Mg2Sn phase can increase the formation probability of Sn whiskers. In addition, we presented that the formation and growth of Sn whiskers in the Sn-based solders can be significantly restricted by a small amount of Zn addition (≥3 wt.%), and the prevention mechanisms are attributed to the segregation of Zn atoms at grain or phase boundaries and the formation of the lamellar-type Zn-rich structures in the solder.

  17. Effect of the Silver Content of SnAgCu Solder on the Interfacial Reaction and on the Reliability of Angle Joints Fabricated by Laser-Jet Soldering

    NASA Astrophysics Data System (ADS)

    Ji, Hongjun; Ma, Yuyou; Li, Mingyu; Wang, Chunqing

    2015-02-01

    The silver content of lead-free solders affects their microstructure, the interfacial reaction, and the performance of the joints in reliability tests. In this study, Sn3.0Ag0.5Cu (wt.%, SAC305) and Sn1.0Ag0.5Cu (wt.%, SAC105) solder balls of diameter 55 μm were reflowed on gold surface pads by laser-jet soldering. It was found that four types of layered intermetallic compound (IMC) were formed at the interfaces; these were Au5Sn/AuSn, AuSn, AuSn2, and AuSn4 from the pad side to the solder matrix. The Au5Sn/AuSn eutectic region, thickness 400 nm, formed because of the high cooling rate induced by the laser-jet soldering. During high-temperature storage tests, the silver became segregated at the interfaces between the Au-Sn IMC and the solder matrix, resulting in inhibition of IMC growth in SAC305 joints, the shear strengths of which were higher than those of SAC105 joints. In mechanical drop tests, however, percentage failure of the SAC305 joints was twice that of the SAC105 joints.

  18. Fast formation and growth of high-density Sn whiskers in Mg/Sn-based solder/Mg joints by ultrasonic-assisted soldering: Phenomena, mechanism and prevention

    PubMed Central

    Li, M. Y.; Yang, H. F.; Zhang, Z. H.; Gu, J. H.; Yang, S. H.

    2016-01-01

    A universally applicable method for promoting the fast formation and growth of high-density Sn whiskers on solders was developed by fabricating Mg/Sn-based solder/Mg joints using ultrasonic-assisted soldering at 250 °C for 6 s and then subjected to thermal aging at 25 °C for 7 d. The results showed that the use of the ultrasonic-assisted soldering could produce the supersaturated dissolution of Mg in the liquid Sn and lead to the existence of two forms of Mg in Sn after solidification. Moreover, the formation and growth of the high-density whiskers were facilitated by the specific contributions of both of the Mg forms in the solid Sn. Specifically, interstitial Mg can provide the persistent driving force for Sn whisker growth, whereas the Mg2Sn phase can increase the formation probability of Sn whiskers. In addition, we presented that the formation and growth of Sn whiskers in the Sn-based solders can be significantly restricted by a small amount of Zn addition (≥3 wt.%), and the prevention mechanisms are attributed to the segregation of Zn atoms at grain or phase boundaries and the formation of the lamellar-type Zn-rich structures in the solder. PMID:27273421

  19. Assessment of Solder Joint Fatigue Life Under Realistic Service Conditions

    NASA Astrophysics Data System (ADS)

    Hamasha, Sa'd.; Jaradat, Younis; Qasaimeh, Awni; Obaidat, Mazin; Borgesen, Peter

    2014-12-01

    The behavior of lead-free solder alloys under complex loading scenarios is still not well understood. Common damage accumulation rules fail to account for strong effects of variations in cycling amplitude, and random vibration test results cannot be interpreted in terms of performance under realistic service conditions. This is a result of the effects of cycling parameters on materials properties. These effects are not yet fully understood or quantitatively predictable, preventing modeling based on parameters such as strain, work, or entropy. Depending on the actual spectrum of amplitudes, Miner's rule of linear damage accumulation has been shown to overestimate life by more than an order of magnitude, and greater errors are predicted for other combinations. Consequences may be particularly critical for so-called environmental stress screening. Damage accumulation has, however, been shown to scale with the inelastic work done, even if amplitudes vary. This and the observation of effects of loading history on subsequent work per cycle provide for a modified damage accumulation rule which allows for the prediction of life. Individual joints of four different Sn-Ag-Cu-based solder alloys (SAC305, SAC105, SAC-Ni, and SACXplus) were cycled in shear at room temperature, alternating between two different amplitudes while monitoring the evolution of the effective stiffness and work per cycle. This helped elucidate general trends and behaviors that are expected to occur in vibrations of microelectronics assemblies. Deviations from Miner's rule varied systematically with the combination of amplitudes, the sequences of cycles, and the strain rates in each. The severity of deviations also varied systematically with Ag content in the solder, but major effects were observed for all the alloys. A systematic analysis was conducted to assess whether scenarios might exist in which the more fatigue-resistant high-Ag alloys would fail sooner than the lower-Ag ones.

  20. A novel multi-level interconnect scheme with air as low K inter-metal dielectric for ultradeep submicron application

    NASA Astrophysics Data System (ADS)

    Chen, Chung-Hui; Fang, Yean-Kuen; Lin, Chun-Sheng; Yang, Chih-Wei; Hsieh, Jang-Cheng

    2001-01-01

    In this letter, a novel multi-level interconnect scheme with air as the low K inter-metal dielectric for ultra large scale integrated circuit (ULSI) application in ultradeep submicron (UDSM) range is proposed. The detailed process integration with copper dual damascene processing is described. The feasibility of the scheme is examined by trimethylaluminum Raphael simulation for the effective dielectric constant and the cutoff frequency in a standard divide by three counter. The simulation results are also compared with these reported air gap formation technologies. The results show the developed multi-level interconnect system is suitable for UDSM application.

  1. Respiratory health symptoms among students exposed to different levels of air pollution in a Turkish city.

    PubMed

    Gül, Hülya; Gaga, Eftade O; Döğeroğlu, Tuncay; Özden, Özlem; Ayvaz, Özkan; Özel, Sevda; Güngör, Günay

    2011-04-01

    In this study, we aimed to investigate the frequency of respiratory health symptoms among high school students attending schools at industrial, urban and rural areas in a Turkish city. Three schools located in different zones of the city having different pollution characteristics were chosen based on the pollutant distribution maps using Geographical Information Systems (GIS) software. A cross-sectional survey was performed among 667 high school students in the schools. Outdoor and indoor nitrogen dioxide (NO(2)) and ozone (O(3)) concentrations were also measured by passive samplers in the same schools to investigate possible routes of exposure. Chronic pulmonary disease (OR = 1.49; 95%CI: 1.11-1.99; p = 0.008), tightness in the chest (OR = 1.57; 95%CI: 1.22-2.02; p = 0.001), morning cough (OR = 1.81 95%CI: 1.19-2.75; p = 0.006) were higher among students in the industrial zone where nitrogen dioxide and ozone levels were also highest. There were no indoor sources of nitrogen dioxide and ozone exists in the schools except for the dining hall. As a conclusion, this study has noticed that air pollution and respiratory health problems among high school students are high in industrial zones and the use of passive samplers combined with GIS is an effective tool that may be used by public health researchers to identify pollutant zones and persons at risk.

  2. Effects of bleed air extraction on thrust levels on the F404-GE-400 turbofan engine

    NASA Technical Reports Server (NTRS)

    Yuhas, Andrew J.; Ray, Ronald J.

    1992-01-01

    A ground test was performed to determine the effects of compressor bleed flow extraction on the performance of F404-GE-400 afterburning turbofan engines. The two engines were installed in the F/A-18 High Alpha Research Vehicle at the NASA Dryden Flight Research Facility. A specialized bleed ducting system was installed onto the aircraft to control and measure engine bleed airflow while the aircraft was tied down to a thrust measuring stand. The test was conducted on each engine and at various power settings. The bleed air extraction levels analyzed included flow rates above the manufacturer's maximum specification limit. The measured relationship between thrust and bleed flow extraction was shown to be essentially linear at all power settings with an increase in bleed flow causing a corresponding decrease in thrust. A comparison with the F404-GE-400 steady-state engine simulation showed the estimation to be within +/- 1 percent of measured thrust losses for large increases in bleed flow rate.

  3. Respiratory health symptoms among students exposed to different levels of air pollution in a Turkish city.

    PubMed

    Gül, Hülya; Gaga, Eftade O; Döğeroğlu, Tuncay; Özden, Özlem; Ayvaz, Özkan; Özel, Sevda; Güngör, Günay

    2011-04-01

    In this study, we aimed to investigate the frequency of respiratory health symptoms among high school students attending schools at industrial, urban and rural areas in a Turkish city. Three schools located in different zones of the city having different pollution characteristics were chosen based on the pollutant distribution maps using Geographical Information Systems (GIS) software. A cross-sectional survey was performed among 667 high school students in the schools. Outdoor and indoor nitrogen dioxide (NO(2)) and ozone (O(3)) concentrations were also measured by passive samplers in the same schools to investigate possible routes of exposure. Chronic pulmonary disease (OR = 1.49; 95%CI: 1.11-1.99; p = 0.008), tightness in the chest (OR = 1.57; 95%CI: 1.22-2.02; p = 0.001), morning cough (OR = 1.81 95%CI: 1.19-2.75; p = 0.006) were higher among students in the industrial zone where nitrogen dioxide and ozone levels were also highest. There were no indoor sources of nitrogen dioxide and ozone exists in the schools except for the dining hall. As a conclusion, this study has noticed that air pollution and respiratory health problems among high school students are high in industrial zones and the use of passive samplers combined with GIS is an effective tool that may be used by public health researchers to identify pollutant zones and persons at risk. PMID:21695031

  4. Respiratory Health Symptoms among Students Exposed to Different Levels of Air Pollution in a Turkish City

    PubMed Central

    Gül, Hülya; Gaga, Eftade O.; Döğeroğlu, Tuncay; Özden, Özlem; Ayvaz, Özkan; Özel, Sevda; Güngör, Günay

    2011-01-01

    In this study, we aimed to investigate the frequency of respiratory health symptoms among high school students attending schools at industrial, urban and rural areas in a Turkish city. Three schools located in different zones of the city having different pollution characteristics were chosen based on the pollutant distribution maps using Geographical Information Systems (GIS) software. A cross-sectional survey was performed among 667 high school students in the schools. Outdoor and indoor nitrogen dioxide (NO2) and ozone (O3) concentrations were also measured by passive samplers in the same schools to investigate possible routes of exposure. Chronic pulmonary disease (OR = 1.49; 95%CI: 1.11–1.99; p = 0.008), tightness in the chest (OR = 1.57; 95%CI: 1.22–2.02; p = 0.001), morning cough (OR = 1.81 95%CI: 1.19–2.75; p = 0.006) were higher among students in the industrial zone where nitrogen dioxide and ozone levels were also highest. There were no indoor sources of nitrogen dioxide and ozone exists in the schools except for the dining hall. As a conclusion, this study has noticed that air pollution and respiratory health problems among high school students are high in industrial zones and the use of passive samplers combined with GIS is an effective tool that may be used by public health researchers to identify pollutant zones and persons at risk. PMID:21695031

  5. Pb-free Sn-Ag-Cu ternary eutectic solder

    DOEpatents

    Anderson, Iver E.; Yost, Frederick G.; Smith, John F.; Miller, Chad M.; Terpstra, Robert L.

    1996-06-18

    A Pb-free solder includes a ternary eutectic composition consisting essentially of about 93.6 weight % Sn-about 4.7 weight % Ag-about 1.7 weight % Cu having a eutectic melting temperature of about 217.degree. C. and variants of the ternary composition wherein the relative concentrations of Sn, Ag, and Cu deviate from the ternary eutectic composition to provide a controlled melting temperature range (liquid-solid "mushy" zone) relative to the eutectic melting temperature (e.g. up to 15.degree. C. above the eutectic melting temperature).

  6. Pb-free Sn-Ag-Cu ternary eutectic solder

    DOEpatents

    Anderson, I.E.; Yost, F.G.; Smith, J.F.; Miller, C.M.; Terpstra, R.L.

    1996-06-18

    A Pb-free solder includes a ternary eutectic composition consisting essentially of about 93.6 weight % Sn-about 4.7 weight % Ag-about 1.7 weight % Cu having a eutectic melting temperature of about 217 C and variants of the ternary composition wherein the relative concentrations of Sn, Ag, and Cu deviate from the ternary eutectic composition to provide a controlled melting temperature range (liquid-solid ``mushy`` zone) relative to the eutectic melting temperature (e.g. up to 15 C above the eutectic melting temperature). 5 figs.

  7. Indoor Air Quality in Schools (IAQ): The Importance of Monitoring Carbon Dioxide Levels.

    ERIC Educational Resources Information Center

    Sundersingh, David; Bearg, David W.

    This article highlights indoor air quality and exposure to pollutants at school. Typical air pollutants within schools include environmental tobacco smoke, formaldehyde, volatile organic compounds, nitrogen oxides, carbon monoxide, carbon dioxide, allergens, pathogens, radon, pesticides, lead, and dust. Inadequate ventilation, inefficient…

  8. AIR LEVELS OF CARCINOGENIC POLYCYCLIC AROMATIC HYDROCARBONS FOLLOWING THE WORLD TRADE CENTER DISASTER

    EPA Science Inventory

    The catastrophic collapse of the World Trade Center (WTC) on September 11, 2001, created an immense dust cloud followed by fires that emitted soot into the air of New York City (NYC) well into December. The subsequent cleanup used diesel equipment that further polluted the air un...

  9. ANTIOXIDANT SUPPLEMENTATION AND LUNG FUNCTIONS AMONG ASTHMATIC CHILDREN EXPOSED TO HIGH LEVELS OF AIR POLLUTANTS

    EPA Science Inventory

    Abstract

    Air pollutant exposure has been related to adverse respiratory effects, in particular, in asthmatics. This effect could be the consequence of the oxidative stress caused by air pollutants on the lung. Antioxidant vitamins are free- radical scavengers, and could ha...

  10. Levels, sources, and health risks of carbonyls in residential indoor air in Hangzhou, China.

    PubMed

    Weng, Mili; Zhu, Lizhong; Yang, Kun; Chen, Shuguang

    2010-04-01

    Concentrations of formaldehyde, acetaldehyde, acetone, propionaldehyde, i-pentanal, and butyraldehyde in residential indoor air in Hangzhou were determined. The mean concentration of the total carbonyl compounds in summer was 222.6 microg/m(3), higher than that in winter (68.5 microg/m(3)). The concentration of a specific carbonyl in indoor air was higher than the outdoor air measurement, indicating the release of carbonyls from the indoor sources. Formaldehyde and acetone were the most abundant carbonyls detected in summer and winter, respectively. Multiple regression analysis indicated that carbonyl concentrations in residential indoor air depended on the age of decoration and furniture, as well as their concentrations in outdoor air. In addition, a primary estimation showed that the health risks of carbonyls in summer were higher than those in winter.

  11. Air density 2.7 billion years ago limited to less than twice modern levels by fossil raindrop imprints.

    PubMed

    Som, Sanjoy M; Catling, David C; Harnmeijer, Jelte P; Polivka, Peter M; Buick, Roger

    2012-04-19

    According to the 'Faint Young Sun' paradox, during the late Archaean eon a Sun approximately 20% dimmer warmed the early Earth such that it had liquid water and a clement climate. Explanations for this phenomenon have invoked a denser atmosphere that provided warmth by nitrogen pressure broadening or enhanced greenhouse gas concentrations. Such solutions are allowed by geochemical studies and numerical investigations that place approximate concentration limits on Archaean atmospheric gases, including methane, carbon dioxide and oxygen. But no field data constraining ground-level air density and barometric pressure have been reported, leaving the plausibility of these various hypotheses in doubt. Here we show that raindrop imprints in tuffs of the Ventersdorp Supergroup, South Africa, constrain surface air density 2.7 billion years ago to less than twice modern levels. We interpret the raindrop fossils using experiments in which water droplets of known size fall at terminal velocity into fresh and weathered volcanic ash, thus defining a relationship between imprint size and raindrop impact momentum. Fragmentation following raindrop flattening limits raindrop size to a maximum value independent of air density, whereas raindrop terminal velocity varies as the inverse of the square root of air density. If the Archaean raindrops reached the modern maximum measured size, air density must have been less than 2.3 kg m(-3), compared to today's 1.2 kg m(-3), but because such drops rarely occur, air density was more probably below 1.3 kg m(-3). The upper estimate for air density renders the pressure broadening explanation possible, but it is improbable under the likely lower estimates. Our results also disallow the extreme CO(2) levels required for hot Archaean climates. PMID:22456703

  12. Air density 2.7 billion years ago limited to less than twice modern levels by fossil raindrop imprints.

    PubMed

    Som, Sanjoy M; Catling, David C; Harnmeijer, Jelte P; Polivka, Peter M; Buick, Roger

    2012-04-19

    According to the 'Faint Young Sun' paradox, during the late Archaean eon a Sun approximately 20% dimmer warmed the early Earth such that it had liquid water and a clement climate. Explanations for this phenomenon have invoked a denser atmosphere that provided warmth by nitrogen pressure broadening or enhanced greenhouse gas concentrations. Such solutions are allowed by geochemical studies and numerical investigations that place approximate concentration limits on Archaean atmospheric gases, including methane, carbon dioxide and oxygen. But no field data constraining ground-level air density and barometric pressure have been reported, leaving the plausibility of these various hypotheses in doubt. Here we show that raindrop imprints in tuffs of the Ventersdorp Supergroup, South Africa, constrain surface air density 2.7 billion years ago to less than twice modern levels. We interpret the raindrop fossils using experiments in which water droplets of known size fall at terminal velocity into fresh and weathered volcanic ash, thus defining a relationship between imprint size and raindrop impact momentum. Fragmentation following raindrop flattening limits raindrop size to a maximum value independent of air density, whereas raindrop terminal velocity varies as the inverse of the square root of air density. If the Archaean raindrops reached the modern maximum measured size, air density must have been less than 2.3 kg m(-3), compared to today's 1.2 kg m(-3), but because such drops rarely occur, air density was more probably below 1.3 kg m(-3). The upper estimate for air density renders the pressure broadening explanation possible, but it is improbable under the likely lower estimates. Our results also disallow the extreme CO(2) levels required for hot Archaean climates.

  13. Imaging and Analysis of Void-defects in Solder Joints Formed in Reduced Gravity using High-Resolution Computed Tomography

    NASA Technical Reports Server (NTRS)

    Easton, John W.; Struk, Peter M.; Rotella, Anthony

    2008-01-01

    As a part of efforts to develop an electronics repair capability for long duration space missions, techniques and materials for soldering components on a circuit board in reduced gravity must be developed. This paper presents results from testing solder joint formation in low gravity on a NASA Reduced Gravity Research Aircraft. The results presented include joints formed using eutectic tin-lead solder and one of the following fluxes: (1) a no-clean flux core, (2) a rosin flux core, and (3) a solid solder wire with external liquid no-clean flux. The solder joints are analyzed with a computed tomography (CT) technique which imaged the interior of the entire solder joint. This replaced an earlier technique that required the solder joint to be destructively ground down revealing a single plane which was subsequently analyzed. The CT analysis technique is described and results presented with implications for future testing as well as implications for the overall electronics repair effort discussed.

  14. Whole air canister sampling coupled with preconcentration GC/MS analysis of part-per-trillion levels of trimethylsilanol in semiconductor cleanroom air.

    PubMed

    Herrington, Jason S

    2013-08-20

    The costly damage airborne trimethylsilanol (TMS) exacts on optics in the semiconductor industry has resulted in the demand for accurate and reliable methods for measuring TMS at trace levels (i.e., parts per trillion, volume per volume of air [ppt(v)] [~ng/m(3)]). In this study I developed a whole air canister-based approach for field sampling trimethylsilanol in air, as well as a preconcentration gas chromatography/mass spectrometry laboratory method for analysis. The results demonstrate clean canister blanks (0.06 ppt(v) [0.24 ng/m(3)], which is below the detection limit), excellent linearity (a calibration relative response factor relative standard deviation [RSD] of 9.8%) over a wide dynamic mass range (1-100 ppt(v)), recovery/accuracy of 93%, a low selected ion monitoring method detection limit of 0.12 ppt(v) (0.48 ng/m(3)), replicate precision of 6.8% RSD, and stability (84% recovery) out to four days of storage at room temperature. Samples collected at two silicon wafer fabrication facilities ranged from 10.0 to 9120 ppt(v) TMS and appear to be associated with the use of hexamethyldisilazane priming agent. This method will enable semiconductor cleanroom managers to monitor and control for trace levels of trimethylsilanol.

  15. Size effects in tin-based lead-free solder joints: Kinetics of bond formation and mechanical characteristics

    NASA Astrophysics Data System (ADS)

    Abdelhadi, Ousama Mohamed Omer

    Continuous miniaturization of microelectronic interconnects demands smaller joints with comparable microstructural and structural sizes. As the size of joints become smaller, the volume of intermetallics (IMCs) becomes comparable with the joint size. As a result, the kinetics of bond formation changes and the types and thicknesses of IMC phases that form within the constrained region of the bond varies. This dissertation focuses on investigating combination effects of process parameters and size on kinetics of bond formation, resulting microstructure and the mechanical properties of joints that are formed under structurally constrained conditions. An experiment is designed where several process parameters such as time of bonding, temperature, and pressure, and bond thickness as structural chracteristic, are varied at multiple levels. The experiment is then implemented on the process. Scanning electron microscope (SEM) is then utilized to determine the bond thickness, IMC phases and their thicknesses, and morphology of the bonds. Electron backscatter diffraction (EBSD) is used to determine the grain size in different regions, including the bulk solder, and different IMC phases. Physics-based analytical models have been developed for growth kinetics of IMC compounds and are verified using the experimental results. Nanoindentation is used to determine the mechanical behavior of IMC phases in joints in different scales. Four-point bending notched multilayer specimen and four-point bending technique were used to determine fracture toughness of the bonds containing IMCs. Analytical modeling of peeling and shear stresses and fracture toughness in tri-layer four-point bend specimen containing intermetallic layer was developed and was verified and validated using finite element simulation and experimental results. The experiment is used in conjunction with the model to calculate and verify the fracture toughness of Cu6Sn5 IMC materials. As expected two different IMC phases

  16. Microstructure Evolution and Shear Behavior of the Solder Joints for Flip-Chip LED on ENIG Substrate

    NASA Astrophysics Data System (ADS)

    Liu, Yang; Sun, Fenglian; Luo, Liangliang; Yuan, Cadmus A.; Zhang, Guoqi

    2015-07-01

    The microstructure evolution and shear behavior of the solder joints for the flip-chip light-emitting diode on the electroless nickel/immersion gold (ENIG) substrate were investigated in this study. The experimental results reveal that the solder joints for the anode and cathode have different microstructures and failure characteristics during the shear test before and after isothermal aging. For the solder joints for the anode, the interfacial intermetallic compound (IMC) is (Au, Ni)Sn4 at the solder/anode interface but dendritic Ni3Sn4 grains at the solder/ENIG interface after reflow. Meanwhile, the dendritic Ni3Sn4 grains are surrounded by (Au, Ni)Sn4, which suppresses the growth of the Ni3Sn4 grains during aging. For the solder joints for the cathode, a nano scaled Au-rich layer can be observed near the cathode/solder layer interface after reflow. And the Au-rich layer moves toward the bulk solder because of the volume expansion by the transformation from Au into (Au, Ni)Sn4 during reflow and isothermal aging. Due to the diffusion of the Au atom from the Au-rich layer into the bulk solder, the Au-rich layer transformed into an interface inside of the solder joint. The average shear force of the solder joints shows a decrease from 380 gf to 250 gf because of the microstructure evolution during the isothermal aging for 1000 h at 85°C. After long time aging, the primary failure mode of the solder joint for the anode changed from the anode broken to the brittle failure of the solder layer. The delamination between the IMC layer and the insulation layer is suggested to be the dominated failure mode of the solder joint for the cathode after aging.

  17. A microstructural study of creep and thermal fatigue deformation in 60Sn-40Pb solder joints

    SciTech Connect

    Tribula, D.

    1990-06-02

    Thermal fatigue failures of solder joints in electronic devices often arise from cyclic shear strains imposed by the mismatched thermal expansion coefficients of the materials that bind the joint as temperature changes are encountered. Increased solder joint reliability demands a fundamental understanding of the metallurigical mechanisms that control the fatigue to design accurate accelerated probative tests and new, more fatigue resistant solder alloys. The high temperatures and slow strain rates that pertain to thermal fatigue imply that creep is an important deformation mode in the thermal fatigue cycle. In this work, the creep behaviour of a solder joint is studied to determine the solder's microstructural response to this type of deformation and to relate this to the more complex problem of thermal fatigue. It is shown that creep failures arise from the inherent inhomogeneity and instability of the solder microstructure and suggest that small compositional changes of the binary near-eutectic Pn-Sn alloy may defeat the observed failure mechanisms. This work presents creep and thermal fatigue data for several near-eutectic Pb-Sn solder compositions and concludes that a 58Sn-40Pb-2In and a 58Sn-40Pb-2Cd alloy show significantly enhanced fatigue resistance over that of the simple binary material. 80 refs., 33 figs., 1 tab.

  18. Simulation of Grain Growth in a Near-Eutectic Solder Alloy

    SciTech Connect

    TIKARE,VEENA; VIANCO,PAUL T.

    1999-12-16

    Microstructural evolution due to aging of solder alloys determines their long-term reliability as electrical, mechanical and thermal interconnects in electronics packages. The ability to accurately determine the reliability of existing electronic components as well as to predict the performance of proposed designs depends upon the development of reliable material models. A kinetic Monte Carlo simulation was used to simulate microstructural evolution in solder-class materials. The grain growth model simulated many of the microstructural features observed experimentally in 63Sn-37Pb, a popular near-eutectic solder alloy. The model was validated by comparing simulation results to new experimental data on coarsening of Sn-Pb solder. The computational and experimental grain growth exponent for two-phase solder was found to be much lower than that for normal, single phase grain growth. The grain size distributions of solders obtained from simulations were narrower than that of normal grain growth. It was found that the phase composition of solder is important in determining grain growth behavior.

  19. Enhanced laser tissue soldering using indocyanine green chromophore and gold nanoshells combination.

    PubMed

    Khosroshahi, Mohammad E; Nourbakhsh, Mohammad S

    2011-08-01

    Gold nanoshells (GNs) are new materials that have an optical response dictated by the plasmon resonance. The wavelength at which the resonance occurs depends on the core and shell sizes. The purposes of this study were to use the combination of indocyanine green (ICG) and different concentration of gold nanoshells for skin tissue soldering and also to examine the effect of laser soldering parameters on the properties of repaired skin. Two mixtures of albumin solder and different combinations of ICG and gold nanoshells were prepared. A full thickness incision of 2 × 20 mm(2) was made on the surface and after addition of mixtures it was irradiated by an 810 nm diode laser at different power densities. The changes of tensile strength (σ(t)) due to temperature rise, number of scan (Ns), and scan velocity (Vs) were investigated. The results showed at constant laser power density (I), σ(t) of repaired incisions increases by increasing the concentration of gold nanoshells in solder, Ns, and decreasing Vs. It was demonstrated that laser soldering using combination of ICG + GNs could be practical provided the optothermal properties of the tissue are carefully optimized. Also, the tensile strength of soldered skin is higher than skins that soldered with only ICG or GNs. In our case, this corresponds to σ(t) = 1800 g cm(-2) at I ∼ 47 Wcm(-2), T ∼ 85 [ordinal indicator, masculine]C, Ns = 10, and Vs = 0.3 mms(-1). PMID:21895342

  20. Temperature-controlled laser-soldering system and its clinical application for bonding skin incisions.

    PubMed

    Simhon, David; Gabay, Ilan; Shpolyansky, Gregory; Vasilyev, Tamar; Nur, Israel; Meidler, Roberto; Hatoum, Ossama Abu; Katzir, Abraham; Hashmonai, Moshe; Kopelman, Doron

    2015-01-01

    Laser tissue soldering is a method of repairing incisions. It involves the application of a biological solder to the approximated edges of the incision and heating it with a laser beam. A pilot clinical study was carried out on 10 patients who underwent laparoscopic cholecystectomy. Of the four abdominal incisions in each patient, two were sutured and two were laser soldered. Cicatrization, esthetical appearance, degree of pain, and pruritus in the incisions were examined on postoperative days 1, 7, and 30. The soldered wounds were watertight and healed well, with no discharge from these wounds or infection. The total closure time was equal in both methods, but the net soldering time was much shorter than suturing. There was no difference between the two types of wound closure with respect to the pain and pruritus on a follow-up of one month. Esthetically, the soldered incisions were estimated as good as the sutured ones. The present study confirmed that temperature-controlled laser soldering of human skin incisions is clinically feasible, and the results obtained were at least equivalent to those of standard suturing. PMID:26720882

  1. Temperature-controlled laser-soldering system and its clinical application for bonding skin incisions

    NASA Astrophysics Data System (ADS)

    Simhon, David; Gabay, Ilan; Shpolyansky, Gregory; Vasilyev, Tamar; Nur, Israel; Meidler, Roberto; Hatoum, Ossama Abu; Katzir, Abraham; Hashmonai, Moshe; Kopelman, Doron

    2015-12-01

    Laser tissue soldering is a method of repairing incisions. It involves the application of a biological solder to the approximated edges of the incision and heating it with a laser beam. A pilot clinical study was carried out on 10 patients who underwent laparoscopic cholecystectomy. Of the four abdominal incisions in each patient, two were sutured and two were laser soldered. Cicatrization, esthetical appearance, degree of pain, and pruritus in the incisions were examined on postoperative days 1, 7, and 30. The soldered wounds were watertight and healed well, with no discharge from these wounds or infection. The total closure time was equal in both methods, but the net soldering time was much shorter than suturing. There was no difference between the two types of wound closure with respect to the pain and pruritus on a follow-up of one month. Esthetically, the soldered incisions were estimated as good as the sutured ones. The present study confirmed that temperature-controlled laser soldering of human skin incisions is clinically feasible, and the results obtained were at least equivalent to those of standard suturing.

  2. Long-term effects of soldering fumes upon respiratory symptoms and pulmonary function.

    PubMed

    Rastogi, S K; Gupta, B N; Husain, T; Pangtey, B S; Srivastava, S; Garg, N

    1991-06-01

    To evaluate the long-term effect of soldering gases and fumes, and of cigarette smoke on lung function, and the prevalence of respiratory symptoms, a comparative study of spirometric measurements in 57 solderers engaged in acetylene gas soldering of brassware joints in the brass industry (mean exposure: 12.4 +/- 1.1 years) and in 131 controls was performed. The two groups were similar in age, height, smoking habits and social class. The prevalence of respiratory symptoms in the solderers did not differ significantly from that in the unexposed controls (59.6 vs 56.4%). However, solderers who smoked showed higher prevalence of respiratory symptoms than those who did not smoke; a similar trend was observed in the controls. The study failed to demonstrate any association between the respiratory symptoms and length of exposure. The respiratory status of the solderers was unaffected as the results of spirometric measurements of lung function did not show any significant differences between the exposed and the control groups, indicating the absence of an additive effect of cigarette smoking and exposure to soldering fumes.

  3. The failure analysis and lifetime prediction for the solder joint of the magnetic head

    NASA Astrophysics Data System (ADS)

    Xiao, Xianghui; Peng, Minfang; Cardoso, Jaime S.; Tang, Rongjun; Zhou, YingLiang

    2015-02-01

    Micro-solder joint (MSJ) lifetime prediction methodology and failure analysis (FA) are to assess reliability by fatigue model with a series of theoretical calculations, numerical simulation and experimental method. Due to shortened time of solder joints on high-temperature, high-frequency sampling error that is not allowed in productions may exist in various models, including round-off error. Combining intermetallic compound (IMC) growth theory and the FA technology for the magnetic head in actual production, this thesis puts forward a new growth model to predict life expectancy for solder joint of the magnetic head. And the impact of IMC, generating from interface reaction between slider (magnetic head, usually be called slider) and bonding pad, on mechanical performance during aging process is analyzed in it. By further researching on FA of solder ball bonding, thesis chooses AuSn4 growth model that affects least to solder joint mechanical property to indicate that the IMC methodology is suitable to forecast the solder lifetime. And the diffusion constant under work condition 60 °C is 0.015354; the solder lifetime t is 14.46 years.

  4. Metallurgical characterization of experimental Ag-based soldering alloys

    PubMed Central

    Ntasi, Argyro; Al Jabbari, Youssef S.; Silikas, Nick; Al Taweel, Sara M.; Zinelis, Spiros

    2014-01-01

    Aim To characterize microstructure, hardness and thermal properties of experimental Ag-based soldering alloys for dental applications. Materials and methods Ag12Ga (AgGa) and Ag10Ga5Sn (AgGaSn) were fabricated by induction melting. Six samples were prepared for each alloy and microstructure, hardness and their melting range were determined by, scanning electron microscopy, energy dispersive X-ray (EDX) microanalysis, X-ray diffraction (XRD), Vickers hardness testing and differential scanning calorimetry (DSC). Results Both alloys demonstrated a gross dendritic microstructure while according to XRD results both materials consisted predominately of a Ag-rich face centered cubic phase The hardness of AgGa (61 ± 2) was statistically lower than that of AgGaSn (84 ± 2) while the alloys tested showed similar melting range of 627–762 °C for AgGa and 631–756 °C for AgGaSn. Conclusion The experimental alloys tested demonstrated similar microstructures and melting ranges. Ga and Sn might be used as alternative to Cu and Zn to modify the selected properties of Ag based soldering alloys. PMID:25382945

  5. The Analysis of PPM Levels of Gases in Air by Photoionization Mass Spectrometry

    ERIC Educational Resources Information Center

    Driscoll, John N.; Warneck, Peter

    1973-01-01

    Discusses analysis of trace gases in air by photoionization mass spectrometer. It is shown that the necessary sensitivity can be obtained by eliminating the UV monochromator and using direct ionization with a hydrogen light source. (JP)

  6. Distribution of air and serum PCDD/F levels of electric arc furnaces and secondary aluminum and copper smelters.

    PubMed

    Lee, Ching-Chang; Shih, Tung-Seng; Chen, Hsiu-Ling

    2009-12-30

    Metallurgical processes, such as smelting, can generate organic impurities such as organic chloride chemicals, polychlorinated dibenzo-p-dioxins and polychlorinated dibenzofurans (PCDD/Fs). The objective of this study was to elucidate the serum PCDD/F levels of 134 workers and ambient air levels around electric arc furnaces (EAF), secondary copper smelters and secondary aluminum smelters (ALSs) in Taiwan. The highest serum PCDD/F levels were found in the ALSs workers (21.9 pg WHO-TEQ/g lipid), with lower levels in copper smelter workers (21.5 pg WHO-TEQ/g lipid), and the lowest in the EAF plant workers (18.8 pg WHO-TEQ/g lipid). This was still higher than the levels for residents living within 5 km of municipal waste incinerators (14.0 pg WHO-TEQ/g lipid). For ambient samples, the highest ambient air PCDD/F level was in the copper smelters (12.4 pg WHO-TEQ/Nm(3)), with lower levels in ALSs (7.2 pg WHO-TEQ/Nm(3)), and the lowest in the EAF industry (1.8 pg WHO-TEQ/Nm(3)). The congener profiles were consistent in serum and in air samples collected in the copper smelters, but not for ALSs and EAF. In secondary copper smelters, the air PCDD/Fs levels might be directly linked to the PCDD/Fs accumulated in the workers due to the exceedingly stable congener pattern of the PCDD/F emission. PMID:19717228

  7. Effect of contact metallization on electromigration reliability of Pb-free solder joints

    NASA Astrophysics Data System (ADS)

    Ding, Min; Wang, Guotao; Chao, Brook; Ho, Paul S.; Su, Peng; Uehling, Trent

    2006-05-01

    The effect of underbump metallization (UBM) on electromigration (EM) lifetime and failure mechanism has been investigated for Pb-free solder bumps of 97Sn3Ag composition in the temperature range of 110-155 °C. The EM lifetime of the SnAg Pb-free solders with either Cu or Ni UBM was found to be better than the eutectic SnPb (63Sn37Pb) solders but worse than high-Pb (95Pb5Sn) solders. In the test temperature range, the EM lifetimes were found to be comparable for Cu and Ni UBMs but with different activation energies: 0.64-0.72 eV for Cu UBM and 1.03-1.11 eV for Ni UBM. EM failure was observed only in solder bumps with electron current flow from UBM to the substrate. Failure analysis revealed that EM damage was initiated by the formation of intermetallic compounds (IMC) at the UBM/solder interface which was found to be significantly enhanced by mass transport driven by the electron current. Under EM, the continued growth of IMC with the dissolution of the UBM and the accumulation of Kirkendall voids resulted in the formation of interfacial cracks and eventual EM failure of the solder bump. For Ni UBM, the IMC formation was dominated by the Ni3Sn4 phase while for Cu UBM, a bilayer of Cu3Sn/Cu6Sn5 was found. Void formation at the Cu6Sn5/solder interface was found to be important in controlling the EM lifetime of the Cu UBM solder.

  8. A study of respiratory morbidity and pulmonary function among solderers in the electronics industry.

    PubMed

    Gupta, B N; Rastogi, S K; Husain, T; Mathur, N; Pangtey, B S

    1991-02-01

    Pulmonary function assessment of 197 solderers engaged in soldering printed circuit boards and other electronic components using lead-tin alloy impregnated solder in five major electronics workplaces in India was compared with the findings observed in 143 unexposed controls. Spirometry showed a significant impairment in the values of vital capacity (VC) and forced expiratory volume/forced vital capacity (FEV1/FVC) percent ratio in 47.2% of the solderers in comparison to 1.3% in the reference group (p less than 0.001). In the exposed group, female solderers particularly showed significantly higher (55.0%) prevalence of overall respiratory impairment in comparison to the 32.3% observed in their male counterparts (p less than 0.001). Bronchial obstruction was recorded in 7.6% of the solderers compared with 1.3% of the unexposed controls (p less than 0.01). The prevalence of restrictive and mixed ventilatory impairment was found to be 28.9 and 10.6%, respectively, among the exposed workers, while there was none among the control group. The solderers showed a predominantly restrictive pattern of pulmonary impairment that was mild in nature. Smoking caused no significant effect on the pulmonary impairment among the exposed workers. The study also did not show any significant differences in the prevalence of respiratory impairment between solderers exposed either less or more than 10 yr, thereby suggesting that there was no link between the respiratory impairment and duration of exposure. The industrial hygiene study conducted in the assembly section where soldering was done showed the mean concentration of lead to be 0.40 micrograms/m3 (range 0.12-0.43 micrograms/m3).(ABSTRACT TRUNCATED AT 250 WORDS)

  9. Energetic delayed hadrons in large air showers observed at 5200m above sea level

    NASA Technical Reports Server (NTRS)

    Kaneko, T.; Hagiwara, K.; Yoshii, H.; Martinic, N.; Siles, L.; Miranda, P.; Kakimoto, F.; Tsuchimoto, I.; Inoue, N.; Suga, K.

    1985-01-01

    Energetic delayed hadrons in air showers with electron sizes in the range 10 to the 6th power to 10 to the 9th power were studied by observing the delayed bursts produced in the shield of nine square meter scintillation detectors in the Chacaltaya air-shower array. The frequency of such delayed burst is presented as a function of electron size, core distance and sec theta.

  10. Influence of synoptic and local atmospheric patterns on PM10 air pollution levels: a model application to Naples (Italy)

    NASA Astrophysics Data System (ADS)

    Fortelli, Alberto; Scafetta, Nicola; Mazzarella, Adriano

    2016-10-01

    We investigate the relationship between synoptic/local meteorological patterns and PM10 air pollution levels in the metropolitan area of Naples, Italy. We found that severe air pollution crises occurred when the 850 and 500 hpa geopotential heights and their relative temperatures present maximum values above the city. The most relevant synoptic parameter was the 850 hPa geopotential height, which is located about 1500 m of altitude. We compared local meteorological conditions (specifically wind stress, rain amount and thermal inversion) against the urban air pollution levels from 2009 to 2013. We found several empirical criteria for forecasting high daily PM10 air pollution levels in Naples. Pollution crises occurred when (a) the wind stress was between 1 and 2 m/s, (b) the thermal inversion between two strategic locations was at least 3°C/200 m and (c) it did not significantly rain for at least 7 days. Beside these meteorological conditions, severe pollution crises occurred also during festivals when fireworks and bonfires are lighted, and during anomalous breeze conditions and severe fire accidents. Finally, we propose a basic model to predict PM10 concentration levels from local meteorological conditions that can be easily forecast a few days in advance. The synthetic PM10 record predicted by the model was found to correlate with the PM10 observations with a correlation coefficient close to 0.80 with a confidence level greater than 99%. The proposed model is expected to provide reliable information to city officials to carry out practical strategies to mitigate air pollution effects. Although the proposed model equation is calibrated on the topographical and meteorological conditions of Naples, it should be easily adaptable to alternative locations.

  11. Research on defects inspection of solder balls based on eddy current pulsed thermography.

    PubMed

    Zhou, Xiuyun; Zhou, Jinlong; Tian, Guiyun; Wang, Yizhe

    2015-10-13

    In order to solve tiny defect detection for solder balls in high-density flip-chip, this paper proposed feasibility study on the effect of detectability as well as classification based on eddy current pulsed thermography (ECPT). Specifically, numerical analysis of 3D finite element inductive heat model is generated to investigate disturbance on the temperature field for different kind of defects such as cracks, voids, etc. The temperature variation between defective and non-defective solder balls is monitored for defects identification and classification. Finally, experimental study is carried on the diameter 1mm tiny solder balls by using ECPT and verify the efficacy of the technique.

  12. Observations of microstructural coarsening in micro flip-chip solder joints

    NASA Astrophysics Data System (ADS)

    Barney, Monica M.; Morris, J. W.

    2001-09-01

    Coarsening of solder microstructures dramatically affects fatigue lifetimes. This paper presents a study of microstructural evolution due to thermal cycling and aging of small solder joints. The lead-tin solder joints in this study have a height of 55 5 m and a tin content of 65 70 wt.%, with a degenerate eutectic microstructure. The joint microstructure coarsens more rapidly during aging at 160°C than cycling from 0 160°C. No coarsened bands are observed. The cycling data scales with standard coarsening equations, while the aging data fits to an enhanced trend. The joints experiencing 2.8% strain during cycling fail by 1000 cycles.

  13. Research on defects inspection of solder balls based on eddy current pulsed thermography.

    PubMed

    Zhou, Xiuyun; Zhou, Jinlong; Tian, Guiyun; Wang, Yizhe

    2015-01-01

    In order to solve tiny defect detection for solder balls in high-density flip-chip, this paper proposed feasibility study on the effect of detectability as well as classification based on eddy current pulsed thermography (ECPT). Specifically, numerical analysis of 3D finite element inductive heat model is generated to investigate disturbance on the temperature field for different kind of defects such as cracks, voids, etc. The temperature variation between defective and non-defective solder balls is monitored for defects identification and classification. Finally, experimental study is carried on the diameter 1mm tiny solder balls by using ECPT and verify the efficacy of the technique. PMID:26473871

  14. Low-temperature solder for joining large cryogenic structures. [cooling cools for the National Transonic Facility

    NASA Technical Reports Server (NTRS)

    Buckley, J. D.; Sandefur, P. G., Jr.

    1980-01-01

    Three joining methods were considered for use in fabricating cooling coils for the National Transonic Facility. After analysis and preliminary testing, soldering was chosen as the cooling coil joining technique over mechanical force fit and brazing techniques. Charpy V-Notch tests, cyclic thermal tests (ambient to 77.8 K) and tensile tests at cryogenic temperatures were performed on solder joints to evaluate their structural integrity. It was determined that low temperature solder can be used to ensure good fin-to-tube contact for cooling-coil applications.

  15. Fluid Dynamics and Solidification of Molten Solder Droplets Impacting on a Substrate in Microgravity

    NASA Technical Reports Server (NTRS)

    Poulikakos, Dimos; Megaridis, Constantine M.; Vedha-Nayagam, M.

    1996-01-01

    This program investigates the fluid dynamics and simultaneous solidification of molten solder droplets impacting on a flat substrate. The problem of interest is directly relevant to the printing of microscopic solder droplets in surface mounting of microelectronic devices. The study consists of a theoretical and an experimental component. The theoretical work uses axisymmetric Navier-Stokes models based on finite element techniques. The experimental work is performed in microgravity to allow for the use of larger solder droplets that make feasible the performance of accurate measurements while maintaining similitude of the relevant fluid dynamics groups (Re, We) and keeping the effect of gravity negligible.

  16. Fluid Dynamics and Solidification of Molten Solder Droplets Impacting on a Substrate in Microgravity

    NASA Technical Reports Server (NTRS)

    Megardis, C. M.; Poulikakos, D.; Diversiev, G.; Boomsma, K.; Xiong, B.; Nayagam, V.

    1999-01-01

    This program investigates the fluid dynamics and simultaneous solidification of molten solder droplets impacting on a flat smooth substrate. The problem of interest is directly relevant to the printing of microscopic solder droplets in surface mounting of microelectronic devices. The study consists of a theoretical and an experimental component. The theoretical work uses axisymmetric Navier-Stokes models based on finite element techniques. The experimental work will be ultimately performed in microgravity in order to allow for the use of larger solder droplets which make feasible the performance of accurate measurements, while maintaining similitude of the relevant fluid dynamics groups (Re, We).

  17. Research on Defects Inspection of Solder Balls Based on Eddy Current Pulsed Thermography

    PubMed Central

    Zhou, Xiuyun; Zhou, Jinlong; Tian, Guiyun; Wang, Yizhe

    2015-01-01

    In order to solve tiny defect detection for solder balls in high-density flip-chip, this paper proposed feasibility study on the effect of detectability as well as classification based on eddy current pulsed thermography (ECPT). Specifically, numerical analysis of 3D finite element inductive heat model is generated to investigate disturbance on the temperature field for different kind of defects such as cracks, voids, etc. The temperature variation between defective and non-defective solder balls is monitored for defects identification and classification. Finally, experimental study is carried on the diameter 1mm tiny solder balls by using ECPT and verify the efficacy of the technique. PMID:26473871

  18. Potentiodynamic polarization effect on phase and microstructure of SAC305 solder in hydrochloric acid solution

    NASA Astrophysics Data System (ADS)

    Zaini, Nurwahida Binti Mohd; Nazeri, Muhammad Firdaus Bin Mohd

    2016-07-01

    The corrosion analysis of SAC305 lead free solder was investigated in Hydrochloric acid (HCl) solution. Potentiodynamic polarization was used to polarize the SAC305. The effect of polarization on the phase and microstructure were compared to as-prepared SAC305 solder. Potentiodynamic polarization introduces mixed corrosion products on the surface of SAC305 solder. The XRD analysis confirms that the mixed corrosion products emerged on the surface after polarization by formation of SnO and SnO2 of which confirmed that dissolution of Sn was dominant during polarization. Microstructure analysis reveal the presence of gap and porosities produced limits the protection offered by the passivation film.

  19. Artificial neural networks as a useful tool to predict the risk level of Betula pollen in the air

    NASA Astrophysics Data System (ADS)

    Castellano-Méndez, M.; Aira, M. J.; Iglesias, I.; Jato, V.; González-Manteiga, W.

    2005-05-01

    An increasing percentage of the European population suffers from allergies to pollen. The study of the evolution of air pollen concentration supplies prior knowledge of the levels of pollen in the air, which can be useful for the prevention and treatment of allergic symptoms, and the management of medical resources. The symptoms of Betula pollinosis can be associated with certain levels of pollen in the air. The aim of this study was to predict the risk of the concentration of pollen exceeding a given level, using previous pollen and meteorological information, by applying neural network techniques. Neural networks are a widespread statistical tool useful for the study of problems associated with complex or poorly understood phenomena. The binary response variable associated with each level requires a careful selection of the neural network and the error function associated with the learning algorithm used during the training phase. The performance of the neural network with the validation set showed that the risk of the pollen level exceeding a certain threshold can be successfully forecasted using artificial neural networks. This prediction tool may be implemented to create an automatic system that forecasts the risk of suffering allergic symptoms.

  20. Indoor-outdoor levels of nitrogen and sulphur species and their relation to air flow in Antigonish, Nova Scotia.

    PubMed

    Méranger, J C; Brûlé, D; Smith-Palmer, T; Wentzell, B; Donini, J C

    1987-01-01

    A study was conducted in Antigonish, Nova Scotia, to determine the extent to which acid rain related pollutants are present in indoor ambient air. The pollutant study included: fine (0 to 2.5 micron) and coarse (2.5 to 10 micron) particulates, sulphates, nitrates, acidity (H2SO4 and HNO3), SO2 and NO2. During the 3 1/2 month study, maximum levels of 173n equivalent/m3 fine sulphate and 55 n equivalent/m3 H2SO4 were recorded for outdoor air within the town site compared to corresponding values of 110 n equivalent/m3 and 13 n equivalent/m3 for indoor air. Based on back trajectory analysis, wind direction, and sulphuric acid content, it was postulated that local or medium range pollution sources are predominant in the winter while long range transport originating from the United States produces the major episodes when SW winds are persistent.

  1. Kinetics of the wetting of tin on air-passivated copper in the absence of a fluxing agent

    SciTech Connect

    Peebles, D.E.; Peebles, H.C.; Ohlhausen, J.A.; Yost, F.G.

    1994-10-01

    A specially designed ultrahigh vacuum in situ surface analysis and wetting system has been constructed to study the spreading of liquid metal solders on carefully prepared and well-characterized solid substrates. Initial studies have been completed for the spreading of pure tin solder on copper substrates in the absence of any fluxing agent. Surface chemical analysis by x-ray photoelectron spectroscopy showed the air-exposed surface to consisted of about 3 nm of Cu{sub 2}O, while the as-received surface consisted of about 8 nm of Cu{sub 2}O. The sputter-cleaned surface contained less than one monolayer (0.3 nm) of Cu{sub 2}O. Sample surfaces were prepared and spreading experiments performed without intermediate exposure of the surfaces to contaminating atmospheres. Solder spreading was performed under 50 torr of highly purified helium gas to allow for adequate thermal coupling between the solder and the substrate. Spreading experiments utilizing a linear temperature ramp show that pure tin solder spreads readily on oxidized copper surfaces at elevated temperatures. The initiation temperature for rapid tin spreading on the as-received copper surface was 325{degrees}C, similar to the temperature where isothermal spreading changes activation energy or rate. Decreasing the thickness of the oxide on the surface lowered the observed temperature for the initiation of spreading and increased the rate of spreading. On the sputter-cleaned copper surface, rapid solder spreading was observed immediately upon melting of the solder.

  2. SPECIAL ANALYSIS AIR PATHWAY MODELING OF E-AREA LOW-LEVEL WASTE FACILITY

    SciTech Connect

    Hiergesell, R.; Taylor, G.

    2011-08-30

    This Special Analysis (SA) was initiated to address a concern expressed by the Department of Energy's Low Level Waste Disposal Facility Federal Review Group (LFRG) Review Team during their review of the 2008 E-Area Performance Assessment (PA) (WSRC, 2008). Their concern was the potential for overlapping of atmospheric plumes, emanating from the soil surface above SRS LLW disposal facilities within the E-Area, to contribute to the dose received by a member of the public during the Institutional Control (IC) period. The implication of this concern was that the dose to the maximally-exposed individual (MEI) located at the SRS boundary might be underestimated during this time interval. To address this concern a re-analysis of the atmospheric pathway releases from E-Area was required. In the process of developing a new atmospheric release model (ARM) capable of addressing the LFRG plume overlap concern, it became obvious that new and better atmospheric pathway disposal limits should be developed for each of the E-Area disposal facilities using the new ARM. The scope of the SA was therefore expanded to include the generation of these new limits. The initial work conducted in this SA was to develop a new ARM using the GoldSim{reg_sign} program (GTG, 2009). The model simulates the subsurface vapor diffusion of volatile radionuclides as they release from E-Area disposal facility waste zones and migrate to the land surface. In the process of this work, many new features, including several new physical and chemical transport mechanisms, were incorporated into the model. One of the most important improvements was to incorporate a mechanism to partition volatile contaminants across the water-air interface within the partially saturated pore space of the engineered and natural materials through which vapor phase transport occurs. A second mechanism that was equally important was to incorporate a maximum concentration of 1.9E-07 Ci/m{sup 3} of {sup 14}CO{sub 2} in the air

  3. Mechanical and Physical Properties of In-Zn-Ga Lead-Free Solder Alloy for Low Energy Consumption

    NASA Astrophysics Data System (ADS)

    Ervina Efzan, M. N.; Nur Faziera, M. N.; Bakri Abdullah, Mohd Mustafa Al

    2016-06-01

    Due to the demand in the use of electronics devices in industry, the usage of solder connections has increased. Concerning with the toxicity of lead in Sn-37Pb solder alloy, developing lead free solder alloy with low melting temperature is one of the most important issues in electronic industry. Previously, researchers found out that the most promising candidate of lead free solder alloy is Sn-3.0Ag-0.5Cu (SAC). However, the melting temperature of this solder alloy is 217°C, 34°C higher than Sn-37Pb. This can lead to high energy consumption in electronic industry. In this paper, In-Zn-Ga solder alloy was investigated as a potential candidate replacing SAC. This study covers on the physical and mechanical properties of the solder alloy. Differential Scanning Calorimetry (DSC) testing shows that this solder alloy gave low melting temperature as low as 141.31°C. The addition of Ga in In-Zn solder alloy lowered the melting temperature compared to SAC and Sn-37Pb. From coefficient of thermal expansion (CTE) analysis, the In-Zn-Ga solder alloy gives good expansion properties and able to avoid the mismatch between the solder and copper substrates. The density of In-Zn-Ga solder alloy is 6.801g/cm3, lower than SAC and Sn-37Pb. For the strength, single lap shear testing was conducted on the In-Zn-Ga solder alloy and the results is near to the strength of SAC.

  4. A piloted simulation investigation of yaw dynamics requirements for turreted gun use in low-level helicopter air combat

    NASA Technical Reports Server (NTRS)

    Decker, William A.; Morris, Patrick M.; Williams, Jeffrey N.

    1988-01-01

    A piloted, fixed-base simulation study was conducted to investigate the handling qualities requirements for helicopter air-to-air combat using turreted guns in the near-terrain environment. The study used a version of the helicopter air combat system developed at NASA Ames Research Center for one-on-one air combat. The study focused on the potential trade-off between gun angular movement capability and required yaw axis response. Experimental variables included yaw axis response frequency and damping and the size of the gun-movement envelope. A helmet position and sighting system was used for pilot control of gun aim. Approximately 340 simulated air combat engagements were evaluated by pilots from the Army and industry. Results from the experiment indicate that a highly-damped, high frequency yaw response was desired for Level I handling qualities. Pilot preference for those characteristics became more pronounced as gun turret movement was restricted; however, a stable, slow-reacting platform could be used with a large turret envelope. Most pilots preferred to engage with the opponent near the own-ship centerline. Turret elevation restriction affected the engagement more than azimuth restrictions.

  5. Residential heating contribution to level of air pollutants (PAHs, major, trace, and rare earth elements): a moss bag case study.

    PubMed

    Vuković, Gordana; Aničić Urošević, Mira; Pergal, Miodrag; Janković, Milan; Goryainova, Zoya; Tomašević, Milica; Popović, Aleksandar

    2015-12-01

    In areas with moderate to continental climates, emissions from residential heating system lead to the winter air pollution peaks. The EU legislation requires only the monitoring of airborne concentrations of particulate matter, As, Cd, Hg, Ni, and B[a]P. Transition metals and rare earth elements (REEs) have also arisen questions about their detrimental health effects. In that sense, this study examined the level of extensive set of air pollutants: 16 polycyclic aromatic hydrocarbons (PAHs), and 41 major elements, trace elements, and REEs using Sphagnum girgensohnii moss bag technique. During the winter of 2013/2014, the moss bags were exposed across Belgrade (Serbia) to study the influence of residential heating system to the overall air quality. The study was set as an extension to our previous survey during the summer, i.e., non-heating season. Markedly higher concentrations of all PAHs, Sb, Cu, V, Ni, and Zn were observed in the exposed moss in comparison to the initial values. The patterns of the moss REE concentrations normalized to North American Shale Composite and Post-Archean Australian Shales were identical across the study area but enhanced by anthropogenic activities. The results clearly demonstrate the seasonal variations in the moss enrichment of the air pollutants. Moreover, the results point out a need for monitoring of air quality during the whole year, and also of various pollutants, not only those regulated by the EU Directive.

  6. Personal exposures, indoor-outdoor relationships, and breath levels of toxic air pollutants measured for 355 persons in New Jersey

    NASA Astrophysics Data System (ADS)

    Wallace, Lance A.; Pellizzari, Edo D.; Hartwell, Ty D.; Sparacino, Charles M.; Sheldon, Linda S.; Zelon, Harvey

    EPA's TEAM Study has measured exposures to 20 volatile organic compounds in personal air, outdoor air, drinking water and the breath of 355 persons in NJ, in the fall of 1981. The NJ residents were selected by a probability sampling scheme to represent 128,000 inhabitants of Elizabeth and Bayonne. Participants carried a personal monitor to collect two 12-h air samples and gave a breath sample at the end of the day. Two consecutive 12-h outdoor air samples were also collected on identical Tenax cartridges in the back yards of 90 of the participants. About 3000 samples were collected, of which 1000 were quality control samples. Eleven compounds were often present in air. Personal exposures were consistently higher than outdoor concentrations for these chemicals, and were sometimes ten times the outdoor concentrations. Indoor sources appeared responsible for much of the difference. Breath concentrations also usually exceed outdoor concentrations, and correlated more strongly with personal exposures than with outdoor concentrations. Some activities (smoking, driving, visiting dry cleaners or service stations) and occupations (chemical, paint and plastics plants) were associated with significantly elevated exposures and breath levels for certain toxic chemicals.

  7. Occupational exposure to dioxins by thermal oxygen cutting, welding, and soldering of metals.

    PubMed

    Menzel, H M; Bolm-Audorff, U; Turcer, E; Bienfait, H G; Albracht, G; Walter, D; Emmel, C; Knecht, U; Päpke, O

    1998-04-01

    This paper focuses on one aspect of occupational dioxin exposure that is novel and unexpected. Exposures in excess of the German threshold limit value of 50 pg international toxicity equivalent (I-TEQ)/m3 are very frequent, unpredictable, and sometimes very high--up to 6612 pg I-TEQ/m3--during thermal oxygen cutting at scrap metal and demolition sites. The same procedure involving virgin steel in steel trade and mass production of steel objects gave no such evidence, even though no final conclusions can be drawn because of the low number of samples analyzed. Low dioxin exposures during inert gas electric arc welding confirm previous literature findings, whereas soldering and thermal oxygen cutting in the presence of polyvinyl chloride give rise to concern. The consequences of occupational dioxin exposure were studied by analysis of the dioxin-blood concentration, the body burden, of men performing thermal oxygen cutting at scrap metal reclamation and demolition sites, in steel trade and producing plants as well as for industrial welders and white-collar workers. The results concerning body burdens are in excellent agreement with the dioxin exposure as characterized by dioxin air concentration in the workplace. The significant positive correlation between duration and frequency of performing thermal oxygen cutting at metal reclamation and demolition sites expressed in job-years and dioxin body burden speaks for the occupational origin of the observed overload after long times. The results reported here lead to consequences for occupational health, which are discussed and require immediate attention.

  8. Investigation of Dynamic Oxygen Adsorption in Molten Solder Jetting Technology

    NASA Technical Reports Server (NTRS)

    Megaridis, Constantine M.; Bellizia, Giulio; McNallan, Michael; Wallace, David B.

    2003-01-01

    Surface tension forces play a critical role in fluid dynamic phenomena that are important in materials processing. The surface tension of liquid metals has been shown to be very susceptible to small amounts of adsorbed oxygen. Consequently, the kinetics of oxygen adsorption can influence the capillary breakup of liquid-metal jets targeted for use in electronics assembly applications, where low-melting-point metals (such as tin-containing solders) are utilized as an attachment material for mounting of electronic components to substrates. By interpreting values of surface tension measured at various surface ages, adsorption and diffusion rates of oxygen on the surface of the melt can be estimated. This research program investigates the adsorption kinetics of oxygen on the surface of an atomizing molten-metal jet. A novel oscillating capillary jet method has been developed for the measurement of dynamic surface tension of liquids, and in particular, metal melts which are susceptible to rapid surface degradation caused by oxygen adsorption. The experimental technique captures the evolution of jet swells and necks continuously along the jet propagation axis and is used in conjunction with an existing linear, axisymmetric, constant-property model to determine the variation of the instability growth rate, and, in turn, surface tension of the liquid as a function of surface age measured from the exit orifice. The conditions investigated so far focus on a time window of 2-4ms from the jet orifice. The surface properties of the eutectic 63%Sn-37%Pb solder alloy have been investigated in terms of their variation due to O2 adsorption from a N2 atmosphere containing controlled amounts of oxygen (from 8 ppm to 1000 ppm). The method performed well for situations where the oxygen adsorption was low in that time window. The value of surface tension for the 63Sn-37Pb solder in pure nitrogen was found to be 0.49 N/m, in good agreement with previously published work. A characteristic

  9. Flying-qualities criteria for wings-level-turn maneuvering during an air-to-ground weapon delivery task

    NASA Technical Reports Server (NTRS)

    Sammonds, R. I.; Bunnell, J. W., Jr.

    1980-01-01

    A moving-base simulator experiment conducted at Ames Research Center demonstrated that a wings-level-turn control mode improved flying qualities for air-to-ground weapons delivery compared with those of a conventional aircraft. Evaluations of criteria for dynamic response for this system have shown that pilot ratings correlate well on the basis of equivalent time constant of the initial response. Ranges of this time constant, as well as digital-system transport delays and lateral-acceleration control authorities that encompassed Level I through Level III handling qualities, were determined.

  10. Effect of Solder-Joint Geometry on the Low-Cycle Fatigue Behavior of Sn-xAg-0.7Cu

    NASA Astrophysics Data System (ADS)

    Lee, Hwa-Teng; Huang, Kuo-Chen

    2016-07-01

    Low-cycle fatigue tests of Sn-Ag-Cu (SAC) Pb-free solder joints under fixed displacement were performed to evaluate the influence of Ag content (0-3 wt.%) and solder-joint geometry (barrel and hourglass types) on solder-joint fatigue behavior and reliability. The solder joints were composed of fine particles of Ag3Sn and Cu6Sn5, which aggregated as an eutectic constituent at grain boundaries of the primary β-Sn phase and formed a dense network structure. A decrease in the Ag content resulted in coarsening of the β-Sn and eutectic phases, which, in turn, decreased the strength of the joint and caused earlier failure. Solder joints in the hourglass form exhibited better fatigue performance with longer life than barrel-type joints. The sharp contact angle formed between the solder and the Cu substrate by the barrel-type joints concentrated stress, which compromised fatigue reliability. The addition of Ag to the solder, however, enhanced fatigue performance because of strengthening caused by Ag3Sn formation. The cracks of the barrel-type SAC solder joints originated mostly at the contact corner and propagated along the interfacial layer between the interfacial intermetallic compound (IMC) and solder matrix. Hourglass-type solder joints, however, demonstrated both crack initiation and propagation in the solder matrix (solder mode). The addition of 1.5-2.0 wt.% Ag to SAC solder appears to enhance the fatigue performance of solder joints while maintaining sufficient strength.

  11. Burden of Outdoor Air Pollution in Kerala, India—A First Health Risk Assessment at State Level.

    PubMed

    Tobollik, Myriam; Razum, Oliver; Wintermeyer, Dirk; Plass, Dietrich

    2015-08-28

    Ambient air pollution causes a considerable disease burden, particularly in South Asia. The objective of the study is to test the feasibility of applying the environmental burden of disease method at state level in India and to quantify a first set of disease burden estimates due to ambient air pollution in Kerala. Particulate Matter (PM) was used as an indicator for ambient air pollution. The disease burden was quantified in Years of Life Lost (YLL) for the population (30 + years) living in urban areas of Kerala. Scenario analyses were performed to account for uncertainties in the input parameters. 6108 (confidence interval (95% CI): 4150-7791) of 81,636 total natural deaths can be attributed to PM, resulting in 96,359 (95% CI: 65,479-122,917) YLLs due to premature mortality (base case scenario, average for 2008-2011). Depending on the underlying assumptions the results vary between 69,582 and 377,195 YLLs. Around half of the total burden is related to cardiovascular deaths. Scenario analyses show that a decrease of 10% in PM concentrations would save 15,904 (95% CI: 11,090-19,806) life years. The results can be used to raise awareness about air quality standards at a local level and to support decision-making processes aiming at cleaner and healthier environments.

  12. Burden of Outdoor Air Pollution in Kerala, India—A First Health Risk Assessment at State Level

    PubMed Central

    Tobollik, Myriam; Razum, Oliver; Wintermeyer, Dirk; Plass, Dietrich

    2015-01-01

    Ambient air pollution causes a considerable disease burden, particularly in South Asia. The objective of the study is to test the feasibility of applying the environmental burden of disease method at state level in India and to quantify a first set of disease burden estimates due to ambient air pollution in Kerala. Particulate Matter (PM) was used as an indicator for ambient air pollution. The disease burden was quantified in Years of Life Lost (YLL) for the population (30 + years) living in urban areas of Kerala. Scenario analyses were performed to account for uncertainties in the input parameters. 6108 (confidence interval (95% CI): 4150–7791) of 81,636 total natural deaths can be attributed to PM, resulting in 96,359 (95% CI: 65,479–122,917) YLLs due to premature mortality (base case scenario, average for 2008–2011). Depending on the underlying assumptions the results vary between 69,582 and 377,195 YLLs. Around half of the total burden is related to cardiovascular deaths. Scenario analyses show that a decrease of 10% in PM concentrations would save 15,904 (95% CI: 11,090–19,806) life years. The results can be used to raise awareness about air quality standards at a local level and to support decision-making processes aiming at cleaner and healthier environments. PMID:26343701

  13. Characterization of endotoxin and 3-hydroxy fatty acid levels in air and settled dust from commercial aircraft cabins.

    PubMed

    Hines, C J; Waters, M A; Larsson, L; Petersen, M R; Saraf, A; Milton, D K

    2003-06-01

    Endotoxin was measured in air and dust samples collected during four commercial aircraft flights. Samples were analyzed for endotoxin biological activity using the Limulus assay. 3-hydroxy fatty acids (3-OH FA) of carbon chain lengths C10:0-C18:0 were determined in dust by gas chromatography-ion trap tandem mass spectrometry. The geometric mean (geometric standard deviation) endotoxin air level was 1.5 EU/m3 (1.9, n = 28); however, significant differences were found by flight within aircraft type. Mean endotoxin levels were significantly higher in carpet dust than in seat dust (140 +/- 81 vs. 51 +/- 25 EU/mg dust, n = 32 each, P < 0.001). Airborne endotoxin levels were not significantly related to either carpet or seat dust endotoxin levels. Mean 3-OH FA levels were significantly higher in carpet dust than in seat dust for C10:2, C12:0, and C14:0 (P < 0.001 for each), while the mean level of C16:0 was significantly higher in seat dust than in carpet dust (P < 0.01). Carpet dust endotoxin was significantly, but moderately, correlated with 3-OH-C12:0 and 3-OH-C14:0 (Pearson r = 0.52 and 0.48, respectively), while correlation of seat dust endotoxin with individual 3-OH FAs depended on the test statistic used. Mean endotoxin potency was significantly higher for carpet dust than for seat dust (6.3 +/- 3.0 vs. 3.0 +/- 1.4 EU/pmol LPS, P < 0.0001). Mean endotoxin levels in the air and dust of commercial aircraft cabins were generally higher than mean levels reported in homes and office buildings. These results suggest that exposure route and dust source are important considerations when relating endotoxin exposure to specific health outcomes.

  14. Long-Term Effects of Soldering By-Products on Nickel-Coated Copper Wire

    NASA Technical Reports Server (NTRS)

    Rolin, T. D.; Hodge, R. E.

    2008-01-01

    An analysis of thirty-year-old, down graded flight cables was conducted to determine the makeup of a green material on the surface of the shielded wire near soldered areas and to ascertain if the green material had corroded the nickel-coated copper wire. Two likely candidates were possible due to the handling and environments to which these cables were exposed. The flux used to solder the cables is known to contain abietic acid, a carboxylic acid found in many pine rosins used for the soldering process. The resulting material copper abietate is green in color and is formed during the application of heat during soldering operations. Copper (II) chloride, which is also green in color is known to contaminate flight parts and is corrosive. Data is presented that shows the material is copper abietate, not copper (II) chloride, and more importantly that the abietate does not aggressively attack nickel-plated copper wire.

  15. Ultrasonic semi-solid coating soldering 6061 aluminum alloys with Sn-Pb-Zn alloys.

    PubMed

    Yu, Xin-ye; Xing, Wen-qing; Ding, Min

    2016-07-01

    In this paper, 6061 aluminum alloys were soldered without a flux by the ultrasonic semi-solid coating soldering at a low temperature. According to the analyses, it could be obtained that the following results. The effect of ultrasound on the coating which promoted processes of metallurgical reaction between the components of the solder and 6061 aluminum alloys due to the thermal effect. Al2Zn3 was obtained near the interface. When the solder was in semi-solid state, the connection was completed. Ultimately, the interlayer mainly composed of three kinds of microstructure zones: α-Pb solid solution phases, β-Sn phases and Sn-Pb eutectic phases. The strength of the joints was improved significantly with the minimum shear strength approaching 101MPa.

  16. Experimental Investigation of Solder Joint Defect Formation and Mitigation in Reduced-Gravity Environments

    NASA Technical Reports Server (NTRS)

    Watson, J. Kevin; Struk, Peter M.; Pettegrew, RIchard D.; Downs, Robert S.

    2006-01-01

    This paper documents a research effort on reduced gravity soldering of plated through hole joints which was conducted jointly by the National Center for Space Exploration Research, NASA Glenn Research Center, and NASA Johnson Space Center. Significant increases in joint porosity and changes in external geometry were observed in joints produced in reduced gravity as compared to normal gravity. Multiple techniques for mitigating the observed increase in porosity were tried, including several combinations of flux and solder application techniques, and demoisturizing the circuit board prior to soldering. Results were consistent with the hypothesis that the source of the porosity is a combination of both trapped moisture in the circuit board itself, as well as vaporized flux that is trapped in the molten solder. Other topics investigated include correlation of visual inspection results with joint porosity, pore size measurements, limited pressure effects (0.08 MPa - 0.1 MPa) on the size and number of pores, and joint cooling rate.

  17. Microstructurally based thermomechanical fatigue lifetime model of solder joints for electronic applications

    SciTech Connect

    Frear, D.R.; Rashid, M.M.; Burchett, S.N.

    1993-07-01

    We present a new methodology for predicting the fatigue life of solder joints for electronics applications. This approach involves integration of experimental and computational techniques. The first stage involves correlating the manufacturing and processing parameters with the starting microstructure of the solder joint. The second stage involves a series of experiments that characterize the evolution of the microstructure during thermal cycling. The third stage consists of a computer modeling and simulation effort that utilizes the starting microstructure and experimental data to produce a reliability prediction of the solder joint. This approach is an improvement over current methodologies because it incorporates the microstructure and properties of the solder directly into the model and allows these properties to evolve as the microstructure changes during fatigue.

  18. Ultrasonic semi-solid coating soldering 6061 aluminum alloys with Sn-Pb-Zn alloys.

    PubMed

    Yu, Xin-ye; Xing, Wen-qing; Ding, Min

    2016-07-01

    In this paper, 6061 aluminum alloys were soldered without a flux by the ultrasonic semi-solid coating soldering at a low temperature. According to the analyses, it could be obtained that the following results. The effect of ultrasound on the coating which promoted processes of metallurgical reaction between the components of the solder and 6061 aluminum alloys due to the thermal effect. Al2Zn3 was obtained near the interface. When the solder was in semi-solid state, the connection was completed. Ultimately, the interlayer mainly composed of three kinds of microstructure zones: α-Pb solid solution phases, β-Sn phases and Sn-Pb eutectic phases. The strength of the joints was improved significantly with the minimum shear strength approaching 101MPa. PMID:26964943

  19. Effect of Fluxes on 60Sn-40Bi Solder Alloy on Copper Substrate

    NASA Astrophysics Data System (ADS)

    Ervina Efzan, M. N.; Ng, W. L.; Bakri Abdullah, Mohd Mustafa Al

    2016-06-01

    This paper investigated the effect of different types of fluxes on the wettability of a type of low temperature lead-free solder, 60Sn-40Bi alloy. The purpose of this paper is to investigate the effect of different types of fluxes on the wettability of 60Sn-40Bi solder (Tm : 138 -170 oC), so that the most compatible flux to be used with low temperature alloy can be determined.The results of this paper showed that the water soluble flux sample has the highest spread area and lowest contact angle. This meant that the solder has the highest wettability when water soluble flux is used, followed by RMA flux and low solids flux. Therefore, it was determined that water soluble flux is the most compatible to be used with the low temperature 60Sn-40Bi solder. The characteristic of this type of flux enables it to function well even at a low working temperature.

  20. Cleanliness tests with the Omega Meter: A comparative study for solder flux removal

    SciTech Connect

    Lopez, E.P.

    1987-12-01

    This paper reports on a dynamic conductivity test which indicates the effectiveness of solder flux removal. The Omega Meter, a device to measure residual ionic contaminants has been used to measure cleanliness as required by MIL-P-15110 and MIL-P-28809. The cleaning efficiency of seven solvents in removing three basic types of rosin solder fluxes after solder dipping has been evaluated. Results obtained indicate fairly good correlation with those obtained from radiochemical techniques and evaporative rate analysis using the Meseran Surface Analyzer. In this study, using vapor degreasing as the method of cleaning, isopropyl alcohol, trichloroethylene, and 1,1,1 trichloroethane (stabilized) respectively were the best single solvents identified in the removal of types R, RMA, and RA rosin solder fluxes. 3 refs., 6 figs., 3 tabs.

  1. STS-57 Pilot Duffy uses TDS soldering tool in SPACEHAB-01 aboard OV-105

    NASA Technical Reports Server (NTRS)

    1993-01-01

    STS-57 Pilot Brian J. Duffy, at a SPACEHAB-01 (Commercial Middeck Augmentation Module (CMAM)) work bench, handles a soldering tool onboard the Earth-orbiting Endeavour, Orbiter Vehicle (OV) 105. Duffy is conducting a soldering experiment (SE) which is part of the Tools and Diagnostic Systems (TDS) project. He is soldering on a printed circuit board, positioned in a specially designed holder, containing 45 connection points and will later de-solder 35 points on a similar board. TDS' sponsor is the Flight Crew Support Division, Space and Life Sciences Directorate, JSC. It represents a group of equipment selected from tools and diagnostic hardware to be supported by the Space Station program. TDS was designed to demonstrate the maintenance of experiment hardware on-orbit and to evaluate the adequacy of its design and the crew interface.

  2. Interfacial Reactions and Joint Strengths of Sn- xZn Solders with Immersion Ag UBM

    NASA Astrophysics Data System (ADS)

    Jee, Y. K.; Yu, Jin

    2010-10-01

    The solder joint microstructures of immersion Ag with Sn- xZn ( x = 0 wt.%, 1 wt.%, 5 wt.%, and 9 wt.%) solders were analyzed and correlated with their drop impact reliability. Addition of 1 wt.% Zn to Sn did not change the interface microstructure and was only marginally effective. In comparison, the addition of 5 wt.% or 9 wt.% Zn formed layers of AgZn3/Ag5Zn8 at the solder joint interface, which increased drop reliability significantly. Under extensive aging, Ag-Zn intermetallic compounds (IMCs) transformed into Cu5Zn8 and Ag3Sn, and the drop impact resistance at the solder joints deteriorated up to a point. The beneficial role of Zn on immersion Ag pads was ascribed to the formation of Ag-Zn IMC layers, which were fairly resistant to the drop impact, and to the suppression of the brittle Cu6Sn5 phase at the joint interface.

  3. Effect of grain orientation on mechanical properties and thermomechanical response of Sn-based solder interconnects

    SciTech Connect

    Chen, Hongtao; Yan, Bingbing; Yang, Ming; Ma, Xin; Li, Mingyu

    2013-11-15

    The thermomechanical response of Sn-based solder interconnects with differently oriented grains was investigated by electron backscattered diffraction technique under thermal cycling and thermal shock testing in this study. The results showed that deformation and cracking of solder interconnects have a close relationship with the unique characteristics of grain orientation and boundaries in each solder interconnect, and deformation was frequently confined within the high-angle grain boundaries. The micro Vickers hardness testing results showed that the hardness varied significantly depending on the grain orientation and structure, and deformation twins can be induced around the indents by the indentation testing. - Highlights: • Thermomechanical response shows a close relationship with the grain structure. • Deformation was frequently confined within the high-angle grain boundaries. • Different grain orientations exhibit different hardness. • Deformation twins can be induced around the indents in SAC105 solder interconnects.

  4. Lacrimal Cytokines Assessment in Subjects Exposed to Different Levels of Ambient Air Pollution in a Large Metropolitan Area

    PubMed Central

    Matsuda, Monique; Bonatti, Rodolfo; Marquezini, Mônica V.; Garcia, Maria L. B.; Santos, Ubiratan P.; Braga, Alfésio L. F.; Alves, Milton R.

    2015-01-01

    Background Air pollution is one of the most environmental health concerns in the world and has serious impact on human health, particularly in the mucous membranes of the respiratory tract and eyes. However, ocular hazardous effects to air pollutants are scarcely found in the literature. Design Panel study to evaluate the effect of different levels of ambient air pollution on lacrimal film cytokine levels of outdoor workers from a large metropolitan area. Methods Thirty healthy male workers, among them nineteen professionals who work on streets (taxi drivers and traffic controllers, high pollutants exposure, Group 1) and eleven workers of a Forest Institute (Group 2, lower pollutants exposure compared to group 1) were evaluated twice, 15 days apart. Exposure to ambient PM2.5 (particulate matter equal or smaller than 2.5 μm) was 24 hour individually collected and the collection of tears was performed to measure interleukins (IL) 2, 4, 5 and 10 and interferon gamma (IFN-γ) levels. Data from both groups were compared using Student’s t test or Mann- Whitney test for cytokines. Individual PM2.5 levels were categorized in tertiles (lower, middle and upper) and compared using one-way ANOVA. Relationship between PM2.5 and cytokine levels was evaluated using generalized estimating equations (GEE). Results PM2.5 levels in the three categories differed significantly (lower: ≤22 μg/m3; middle: 23–37.5 μg/m3; upper: >37.5 μg/m3; p<0.001). The subjects from the two groups were distributed unevenly in the lower category (Group 1 = 8%; Group 2 = 92%), the middle category (Group 1 = 89%; Group 2 = 11%) and the upper category (Group 1 = 100%). A significant relationship was found between IL-5 and IL-10 and PM2.5 levels of the group 1, with an average decrease of 1.65 pg/mL of IL-5 level and of 0.78 pg/mL of IL-10 level in tear samples for each increment of 50 μg/m3 of PM2.5 (p = 0.01 and p = 0.003, respectively). Conclusion High levels of PM2.5 exposure is associated

  5. Understanding the Relationships between Air Pollution Levels and Human Health Outcomes

    EPA Science Inventory

    As mandated by the CAA, EPA established National Ambient Air Quality Standards (NAAQS) for criteria pollutants and conducts periodic review of the NAAQS to assess if they need to be revised. The CAA then provides for implementation of the NAAQS based on a combination of local con...

  6. Air-climate-energy investigations with a state-level Integrated Assessment Model: GCAM-USA

    EPA Science Inventory

    The Global Change Assessment Model (GCAM) is a global integrated assessment model used for exploring future scenarios and examining strategies that address air pollution, climate change, and energy goals.  GCAM includes technology-rich representations of the energy, transportatio...

  7. Understanding the structure of hydrophobic surfactants at the air/water interface from molecular level.

    PubMed

    Zhang, Li; Liu, Zhipei; Ren, Tao; Wu, Pan; Shen, Jia-Wei; Zhang, Wei; Wang, Xinping

    2014-11-25

    Understanding the behavior of fluorocarbon surfactants at the air/water interface is crucial for many applications, such as lubricants, paints, cosmetics, and fire-fighting foams. In this study, molecular dynamics (MD) simulations were employed to investigate the microscopic properties of non-ionic fluorocarbon surfactants at the air/water interface. Several properties, including the distribution of head groups, the distribution probability of the tilt angle between hydrophobic tails with respect to the xy plane, and the order parameter of surfactants, were computed to probe the structure of hydrophobic surfactants at the air/water interface. The effects of the monomer structure on interfacial phenomena of non-ionic surfactants were investigated as well. It is observed that the structure of fluorocarbon surfactants at the air/water interface is more ordered than that of hydrocarbons, which is dominated by the van der Waals interaction between surfactants and water molecules. However, replacing one or two CF2 with one or two CH2 group does not significantly influence the interfacial structure, suggesting that hydrocarbons may be promising alternatives to perfluorinated surfactants.

  8. Soldered Contact and Current Risetime Effects on Negative Polarity Wire Array Z-pinches

    SciTech Connect

    Chalenski, D. A.; Kusse, B. R.; Greenly, J. B.; Blesener, I. C.; McBride, R. D.; Hammer, D. A.; Knapp, P. F.

    2009-01-21

    The Cornell University COBRA pulser is a nominal 1 MA machine, capable of driving up to 32 wire cylindrical Z-pinch arrays. COBRA can operate with variable current risetimes ranging from 100 ns to 200 ns (short and long pulse, respectively). Wires are typically strung with a 'press' contact to the electrode hardware, where the wire is loosely pulled against the hardware and held there to establish electrical contact. The machine is normally negative, but a bolt-on convolute can be used to modify the current path and effectively produce positive polarity operation at the load.Previous research with single wires on a 1-5 kA pulser has shown that soldering the wire, thereby improving the wire/electrode contact, and operating in positive polarity can improve the energy deposition into the wire and enhance wire core expansion. Negative polarity showed no difference. Previous experiments on the negative polarity, 20 MA, 100 ns Z accelerator have shown that improving the contact improved the x-ray yield.Cornell data were collected on 16-wire Aluminum Z-pinch arrays in negative polarity. Experiments were conducted with both short and long current pulses with soldered and no-soldered wire/electrode contacts. The initiation, ablation, implosion and stagnation phases were compared for these four conditions. Time dependent x-ray signals were measured using diodes and diamond detectors. An inductive voltage monitor was used to infer minimum current radius achieved, as defined by a uniform shell of current moving radially inward, producing a time dependent inductance. Total energy data were collected with a metal-strip bolometer. Self-emission data were collected by an XUV 4-frame camera and an optical streak camera.In negative polarity and with short pulses, soldering appeared to produce a smaller radius pinch and decrease variations in the x-ray pulse shape. The bolometer, laser backlighter, 4-frame and streak cameras showed negligible differences in the initiation ablation

  9. Object-oriented graphical tool for automated laser soldering

    NASA Astrophysics Data System (ADS)

    Fidan, Ismail

    1995-10-01

    Object-oriented interfaces (OOIs) have become an important component of automation activity. Object-oriented software techniques have provided some hope to cope with the complexity of modern software development tasks. Object orientation is expressed by many researchers as an important direction in designing and implementing software in the 1990s and beyond. In today's electronics industry, there are several different types of interfaces used for different pieces of manufacturing equipment. It is now possible to create a general, OOI for most manufacturing equipment that is easy to use, easy to learn how to use, and easy to modify. Such an interface can benefit the user in terms of savings in time and money. The laser soldering interface, designed and implemented in the Center for Integrated Electronics and Electronics Manufacturing (CIEEM) at Rensselaer, is one of the 'flexible' user interfaces described above. This paper describes the object-oriented graphical tool (OOGT) development and its final structure.

  10. Ionic cleaning after wave solder and before conformal coat

    NASA Astrophysics Data System (ADS)

    Nguygen, Tochau N.; Sutherland, Thomas H.

    An account is given of efforts made by a military electronics manufacturer to upgrade product reliability in response to the printed writing board (PWB) ionic cleanliness requirements recently set out in MIL-P-28809 Rev. A. These requirements had to be met both after wave soldering, involving the immediate removal of ionically active RA flux, and immediately before conformal coating, in order to remove the less active RMA flux and bonding contaminants. Attention is given to the results of a test program which compared the effectiveness with which five different solvents and two (batch and conveyorized vapor degreasing) cleaning methods cleaned representative PWBs containing many components. Alcohol-containing fluorocarbon blends were adequate, but the most densely packed PWBs required a supplemental water rinse.

  11. Development of motion control method for laser soldering process

    SciTech Connect

    Yerganian, S.S.

    1997-05-01

    Development of a method to generate the motion control data for sealing an electronic housing using laser soldering is described. The motion required to move the housing under the laser is a nonstandard application and was performed with a four-axis system using the timed data streaming mode capabilities of a Compumotor AT6400 indexer. A Microsoft Excel 5.0 spreadsheet (named Israuto.xls) was created to calculate the movement of the part under the laser, and macros were written into the spreadsheet to allow the user to easily create this data. A data verification method was developed for simulating the motion data. The geometry of the assembly was generated using Parametric Technology Corporation Pro/E version 15. This geometry was then converted using Pro/DADS version 3.1 from Computer Aided Design Software Inc. (CADSI), and the simulation was carried out using DADS version 8.0 from CADSI.

  12. Magellan/Galileo solder joint failure analysis and recommendations

    NASA Technical Reports Server (NTRS)

    Ross, Ronald G., Jr.

    1989-01-01

    On or about November 10, 1988 an open circuit solder joint was discovered in the Magellan Radar digital unit (DFU) during integration testing at Kennedy Space Center (KSC). A detailed analysis of the cause of the failure was conducted at the Jet Propulsion Laboratory leading to the successful repair of many pieces of affected electronic hardware on both the Magellan and Galileo spacecraft. The problem was caused by the presence of high thermal coefficient of expansion heat sink and conformal coating materials located in the large (0.055 inch) gap between Dual Inline Packages (DIPS) and the printed wiring board. The details of the observed problems are described and recommendations are made for improved design and testing activities in the future.

  13. Silicon solar cells with nickel/solder metallization

    NASA Technical Reports Server (NTRS)

    Petersen, R. C.; Muleo, A.

    1981-01-01

    The use of nickel plus solder is shown to be feasible for contact metallization for silicon solar cells by offering a relatively inexpensive method of making electrical contact with the cell surfaces. Nickel is plated on silicon solar cells using an electroless chemical deposition method to give contacts with good adhesion, and in some cases where adhesion is poor initially, sintering under relatively mild conditions will dramatically improve the quality of the bond without harming the p-n junction of the cell. The cells can survive terrestrial environment stresses, which is demonstrated by a 1000 hour test at 85 C and 85% relative humidity under constant forward bias of 0.45 volt.

  14. Packaging of hard solder 500W QCW diode laser array

    NASA Astrophysics Data System (ADS)

    Li, Xiaoning; Wang, Jingwei; Hou, Dong; Nie, Zhiqiang; Liu, Xingsheng

    2016-03-01

    The package structure critically influences the major characteristics of diode laser, such as thermal behavior, output power, wavelength and smile effect. In this work, a novel micro channel cooler (MCC) for stack array laser with good heat dissipation capability and high reliability is presented. Numerical simulations of thermal management with different MCC structure are conducted and analyzed. Based on this new MCC packaging structure, a series of QCW 500W high power laser arrays with hard solder packaging technology has been fabricated. The performances of the laser arrays are characterized. A narrow spectrum of 3.12 nm and an excellent smile value are obtained. The lifetime of the laser array is more than 1.38×109 shots and still ongoing.

  15. Nanoconstruction by welding individual metallic nanowires together using nanoscale solder

    NASA Astrophysics Data System (ADS)

    Peng, Y.; Cullis, A. G.; Inkson, B. J.

    2010-07-01

    This work presents a new bottom-up nanowelding technique enabling building blocks to be assembled and welded together into complex 3D nanostructures using nanovolumes of metal solder. The building blocks of gold nanowires, (Co72Pt28/Pt)n multilayer nanowires, and nanosolder Sn99Au1 alloy nanowires were successfully fabricated by a template technique. Individual metallic nanowires were picked up and assembled together. Conductive nanocircuits were then welded together using similar or dissimilar nanosolder material. At the weld sites, nanoscale volumes of a chosen metal are deposited using nanosolder of a sacrificial nanowire, which ensures that the nanoobjects to be bonded retain their structural integrity. The whole nanowelding process is clean, controllable and reliable, and ensures both mechanically strong and electrically conductive contacts.

  16. Final report of the key comparison CCQM-K88: Determination of lead in lead-free solder containing silver and copper

    NASA Astrophysics Data System (ADS)

    Hioki, Akiharu; Nonose, Naoko; Liandi, Ma; Jingbo, Chao; Liuxing, Feng; Chao, Wei; Haeng Cho, Kyung; Suh, Jung Ki; Min, Hyung Sik; Lim, Youngran; Recknagel, Sebastian; Koenig, Maren; Vogl, Jochen; Caciano de Sena, Rodrigo; dos Reis, Lindomar Augusto; Borinsky, Mónica; Puelles, Mabel; Hatamleh, Nadia; Acosta, Osvaldo; Turk, Gregory; Rabb, Savelas; Sturgeon, Ralph; Methven, Brad; Rienitz, Olaf; Jaehrling, Reinhard; Konopelko, L. A.; Kustikov, Yu A.; Kozyreva, S. B.; Korzh, A. A.

    2013-01-01

    The CCQM-K88 key comparison was organized by the Inorganic Analysis Working Group of CCQM to test the abilities of the national metrology institutes to measure the mass fraction of lead in lead-free solder containing silver and copper. National Metrology Institute of Japan (NMIJ), National Institute of Metrology of China (NIM) and Korea Research Institute of Standards and Science (KRISS) acted as the coordinating laboratories. The participants used different measurement methods, though most of them used inductively coupled plasma optical emission spectrometry (ICP-OES) or isotope-dilution inductively coupled plasma mass spectrometry (ID-ICP-MS). Accounting for relative expanded uncertainty, comparability of measurement results was successfully demonstrated by the participating NMIs for the measurement of the mass fraction of lead in lead-free solder at the level of 200 mg/kg. It is expected that metals at mass fractions greater than approximately 100 mg/kg in lead-free solder containing silver and copper can be determined by each participant using the same technique(s) employed for this key comparison to achieve similar uncertainties mentioned in the present report. Main text. To reach the main text of this paper, click on Final Report. Note that this text is that which appears in Appendix B of the BIPM key comparison database kcdb.bipm.org/. The final report has been peer-reviewed and approved for publication by the CCQM, according to the provisions of the CIPM Mutual Recognition Arrangement (CIPM MRA).

  17. The Pd2Si - /Pd/ - Ni - solder plated metallization system for silicon solar cells

    NASA Technical Reports Server (NTRS)

    Coleman, M. G.; Pryor, R. A.; Sparks, T. G.

    1978-01-01

    The rationale and application of a plated metal system, Pd2Si Pd - Ni - solder, is presented. This metallization system is particularly useful on shallow p-n junction solar cells. The advantages of such plated solar cell contacts are discussed. A process sequence for applying the metallization system is outlined. A specific example is presented, including chemical plating solution formulations and detailed process step descriptions. Electrical test data for solar cells metallized with the palladium-nickel-solder system are provided.

  18. Joint Lead-Free Solder Test Program for High Reliability Military and Space Applications

    NASA Technical Reports Server (NTRS)

    Brown, Christina

    2004-01-01

    Current and future space and defense systems face potential risks from the continued use of tin-lead solder, including: compliance with current environmental regulations, concerns about potential environmental legislation banning lead-containing products, reduced mission readiness, and component obsolescence with lead surface finishes. For example, the United States Environmental Protection Agency (USEPA) has lowered the Toxic Chemical Release reporting threshold for lead to 100 pounds. Overseas, the Waste Electrical and Electronic Equipment (WEEE) and the Restriction on Hazardous Substances (RoHS) Dicctives in Europe and similar mandates in Japan have instilled concern that a legislative body will prohibit the use of lead in aerospace/military electronics soldering. Any potential banning of lead compounds could reduce the supplier base and adversely affect the readiness of missions led by the National Aeronautics and Space Administration (NASA) and the U.S. Department of Defense (DoD). Before considering lead-free electronics for system upgrades or future designs, however, it is important for the DoD and NASA to know whether lead-free solders can meet their systems' requirements. No single lead-free solder is likely to qualify for all defense and space applications. Therefore, it is important to validate alternative solders for discrete applications. As a result of the need for comprehensive test data on the reliability of lead-free solders, a partnership was formed between the DoD, NASA, and several original equipment manufactures (OEMs) to conduct solder-joint reliability (laboratory) testing of three lead-free solder alloys on newly manufactured and reworked circuit cards to generate performance data for high-reliability (IPC Class 3) applications.

  19. The revision of the air quality legislation in the european union related to ground-level ozone.

    PubMed

    Amann, M; Lutz, M

    2000-11-01

    Complying with the obligation in the current ozone directive, the European Commission came forward in 1999 with a strategy to combat tropospheric ozone together with a proposed revision of the air quality legislation for this pollutant. As a daughter legislation under the 1996 Framework Directive on Air Quality, the proposed ozone daughter directive defines for the first time (interim) air quality targets for ozone to be attained by 2010, complemented by long-term objectives for ozone based on the guideline values of the World Health Organisation. It also sets out enhanced requirements for monitoring and assessment of ozone concentrations, as well as minimum criteria for appropriate information of the public about the measured air pollution. In the past, abatement strategies against air pollution consisted of concrete obligations for controlling emissions derived solely on the basis of technical and economic aspects, covering specific types of installations or activities, thus with no direct quantitative relationship to the level of air pollution let alone to its effects. In compensating this deficit, the Commission presented, as a complement to the existing sectoral legislation, a proposal for a directive on national emission ceilings (NEC) which quantifies emission targets for every Member State to bring its total precursor emissions by 2010 down to levels being considered as necessary to achieve everywhere on a regional scale the air quality targets set in the ozone daughter directive. As the core element of the ozone abatement strategy, the national ceilings for emissions of sulfur dioxide (SO(2)), nitrogen oxides (NO(x)), ammonia (NH(3)) and volatile organic compounds (VOC) were derived from a cost-effectiveness analysis integrating information on economic, technical, physical and biological aspects of ozone pollution and abatement. This integrated assessment considers the potential and costs for further emission control in the various economic sectors in the

  20. The revision of the air quality legislation in the european union related to ground-level ozone.

    PubMed

    Amann, M; Lutz, M

    2000-11-01

    Complying with the obligation in the current ozone directive, the European Commission came forward in 1999 with a strategy to combat tropospheric ozone together with a proposed revision of the air quality legislation for this pollutant. As a daughter legislation under the 1996 Framework Directive on Air Quality, the proposed ozone daughter directive defines for the first time (interim) air quality targets for ozone to be attained by 2010, complemented by long-term objectives for ozone based on the guideline values of the World Health Organisation. It also sets out enhanced requirements for monitoring and assessment of ozone concentrations, as well as minimum criteria for appropriate information of the public about the measured air pollution. In the past, abatement strategies against air pollution consisted of concrete obligations for controlling emissions derived solely on the basis of technical and economic aspects, covering specific types of installations or activities, thus with no direct quantitative relationship to the level of air pollution let alone to its effects. In compensating this deficit, the Commission presented, as a complement to the existing sectoral legislation, a proposal for a directive on national emission ceilings (NEC) which quantifies emission targets for every Member State to bring its total precursor emissions by 2010 down to levels being considered as necessary to achieve everywhere on a regional scale the air quality targets set in the ozone daughter directive. As the core element of the ozone abatement strategy, the national ceilings for emissions of sulfur dioxide (SO(2)), nitrogen oxides (NO(x)), ammonia (NH(3)) and volatile organic compounds (VOC) were derived from a cost-effectiveness analysis integrating information on economic, technical, physical and biological aspects of ozone pollution and abatement. This integrated assessment considers the potential and costs for further emission control in the various economic sectors in the