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Sample records for amorphous silicon carbide

  1. Neutron irradiation induced amorphization of silicon carbide

    SciTech Connect

    Snead, L.L.; Hay, J.C.

    1998-09-01

    This paper provides the first known observation of silicon carbide fully amorphized under neutron irradiation. Both high purity single crystal hcp and high purity, highly faulted (cubic) chemically vapor deposited (CVD) SiC were irradiated at approximately 60 C to a total fast neutron fluence of 2.6 {times} 10{sup 25} n/m{sup 2}. Amorphization was seen in both materials, as evidenced by TEM, electron diffraction, and x-ray diffraction techniques. Physical properties for the amorphized single crystal material are reported including large changes in density ({minus}10.8%), elastic modulus as measured using a nanoindentation technique ({minus}45%), hardness as measured by nanoindentation ({minus}45%), and standard Vickers hardness ({minus}24%). Similar property changes are observed for the critical temperature for amorphization at this neutron dose and flux, above which amorphization is not possible, is estimated to be greater than 130 C.

  2. Amorphization of Silicon Carbide by Carbon Displacement

    SciTech Connect

    Devanathan, Ram; Gao, Fei; Weber, William J.

    2004-05-10

    We have used molecular dynamics simulations to examine the possibility of amorphizing silicon carbide (SiC) by exclusively displacing C atoms. At a defect generation corresponding to 0.2 displacements per atom, the enthalpy surpasses the level of melt-quenched SiC, the density decreases by about 15%, and the radial distribution function shows a lack of long-range order. Prior to amorphization, the surviving defects are mainly C Frenkel pairs (67%), but Si Frenkel pairs (18%) and anti-site defects (15%) are also present. The results indicate that SiC can be amorphized by C sublattice displacements. Chemical short-range disorder, arising mainly from interstitial production, plays a significant role in the amorphization.

  3. Neutron irradiation induced amorphization of silicon carbide

    NASA Astrophysics Data System (ADS)

    Snead, L. L.; Hay, J. C.

    1999-07-01

    This paper provides the properties of bulk stoichiometric silicon carbide which has been amorphized under neutron irradiation. Both high purity single crystal hcp and high purity, highly faulted (cubic) chemically vapor deposited (CVD) SiC were irradiated at approximately 60°C to a total fast neutron fluence of 2.6 × 10 25 n/m 2. Amorphization was seen in both materials as evidenced by TEM, electron diffraction and X-ray diffraction techniques. Physical properties for the amorphized single crystal material are reported including large changes in density (-10.8%), elastic modulus as measured using a nanoindentation technique (-45%), hardness as measured by nanoindentation (-45%), and standard Vickers hardness (-24%). Similar property changes are observed for the amorphized CVD SiC. Using measured thermal conductivity data for the CVD SiC sample, the critical temperature for amorphization at this neutron dose and flux, above which amorphization is not possible, is estimated to be greater than ˜125°C.

  4. Tunable plasticity in amorphous silicon carbide films.

    PubMed

    Matsuda, Yusuke; Kim, Namjun; King, Sean W; Bielefeld, Jeff; Stebbins, Jonathan F; Dauskardt, Reinhold H

    2013-08-28

    Plasticity plays a crucial role in the mechanical behavior of engineering materials. For instance, energy dissipation during plastic deformation is vital to the sufficient fracture resistance of engineering materials. Thus, the lack of plasticity in brittle hybrid organic-inorganic glasses (hybrid glasses) often results in a low fracture resistance and has been a significant challenge for their integration and applications. Here, we demonstrate that hydrogenated amorphous silicon carbide films, a class of hybrid glasses, can exhibit a plasticity that is even tunable by controlling their molecular structure and thereby leads to an increased and adjustable fracture resistance in the films. We decouple the plasticity contribution from the fracture resistance of the films by estimating the "work-of-fracture" using a mean-field approach, which provides some insight into a potential connection between the onset of plasticity in the films and the well-known rigidity percolation threshold.

  5. Amorphous silicon carbide passivating layers for crystalline-silicon-based heterojunction solar cells

    SciTech Connect

    Boccard, Mathieu; Holman, Zachary C.

    2015-08-14

    With this study, amorphous silicon enables the fabrication of very high-efficiency crystalline-silicon-based solar cells due to its combination of excellent passivation of the crystalline silicon surface and permeability to electrical charges. Yet, amongst other limitations, the passivation it provides degrades upon high-temperature processes, limiting possible post-deposition fabrication possibilities (e.g., forcing the use of low-temperature silver pastes). We investigate the potential use of intrinsic amorphous silicon carbide passivating layers to sidestep this issue. The passivation obtained using device-relevant stacks of intrinsic amorphous silicon carbide with various carbon contents and doped amorphous silicon are evaluated, and their stability upon annealing assessed, amorphous silicon carbide being shown to surpass amorphous silicon for temperatures above 300°C. We demonstrate open-circuit voltage values over 700 mV for complete cells, and an improved temperature stability for the open-circuit voltage. Transport of electrons and holes across the hetero-interface is studied with complete cells having amorphous silicon carbide either on the hole-extracting side or on the electron-extracting side, and a better transport of holes than of electrons is shown. Also, due to slightly improved transparency, complete solar cells using an amorphous silicon carbide passivation layer on the hole-collecting side are demonstrated to show slightly better performances even prior to annealing than obtained with a standard amorphous silicon layer.

  6. Amorphous silicon carbide passivating layers for crystalline-silicon-based heterojunction solar cells

    SciTech Connect

    Boccard, Mathieu; Holman, Zachary C.

    2015-08-14

    Amorphous silicon enables the fabrication of very high-efficiency crystalline-silicon-based solar cells due to its combination of excellent passivation of the crystalline silicon surface and permeability to electrical charges. Yet, amongst other limitations, the passivation it provides degrades upon high-temperature processes, limiting possible post-deposition fabrication possibilities (e.g., forcing the use of low-temperature silver pastes). We investigate the potential use of intrinsic amorphous silicon carbide passivating layers to sidestep this issue. The passivation obtained using device-relevant stacks of intrinsic amorphous silicon carbide with various carbon contents and doped amorphous silicon are evaluated, and their stability upon annealing assessed, amorphous silicon carbide being shown to surpass amorphous silicon for temperatures above 300 °C. We demonstrate open-circuit voltage values over 700 mV for complete cells, and an improved temperature stability for the open-circuit voltage. Transport of electrons and holes across the hetero-interface is studied with complete cells having amorphous silicon carbide either on the hole-extracting side or on the electron-extracting side, and a better transport of holes than of electrons is shown. Also, due to slightly improved transparency, complete solar cells using an amorphous silicon carbide passivation layer on the hole-collecting side are demonstrated to show slightly better performances even prior to annealing than obtained with a standard amorphous silicon layer.

  7. Amorphous silicon carbide passivating layers for crystalline-silicon-based heterojunction solar cells

    DOE PAGES

    Boccard, Mathieu; Holman, Zachary C.

    2015-08-14

    With this study, amorphous silicon enables the fabrication of very high-efficiency crystalline-silicon-based solar cells due to its combination of excellent passivation of the crystalline silicon surface and permeability to electrical charges. Yet, amongst other limitations, the passivation it provides degrades upon high-temperature processes, limiting possible post-deposition fabrication possibilities (e.g., forcing the use of low-temperature silver pastes). We investigate the potential use of intrinsic amorphous silicon carbide passivating layers to sidestep this issue. The passivation obtained using device-relevant stacks of intrinsic amorphous silicon carbide with various carbon contents and doped amorphous silicon are evaluated, and their stability upon annealing assessed, amorphousmore » silicon carbide being shown to surpass amorphous silicon for temperatures above 300°C. We demonstrate open-circuit voltage values over 700 mV for complete cells, and an improved temperature stability for the open-circuit voltage. Transport of electrons and holes across the hetero-interface is studied with complete cells having amorphous silicon carbide either on the hole-extracting side or on the electron-extracting side, and a better transport of holes than of electrons is shown. Also, due to slightly improved transparency, complete solar cells using an amorphous silicon carbide passivation layer on the hole-collecting side are demonstrated to show slightly better performances even prior to annealing than obtained with a standard amorphous silicon layer.« less

  8. Threshold irradiation dose for amorphization of silicon carbide

    SciTech Connect

    Snead, L.L.; Zinkle, S.J.

    1997-04-01

    The amorphization of silicon carbide due to ion and electron irradiation is reviewed with emphasis on the temperature-dependent critical dose for amorphization. The effect of ion mass and energy on the threshold dose for amorphization is summarized, showing only a weak dependence near room temperature. Results are presented for 0.56 MeV silicon ions implanted into single crystal 6H-SiC as a function of temperature and ion dose. From this, the critical dose for amorphization is found as a function of temperature at depths well separated from the implanted ion region. Results are compared with published data generated using electrons and xenon ions as the irradiating species. High resolution TEM analysis is presented for the Si ion series showing the evolution of elongated amorphous islands oriented such that their major axis is parallel to the free surface. This suggests that surface of strain effects may be influencing the apparent amorphization threshold. Finally, a model for the temperature threshold for amorphization is described using the Si ion irradiation flux and the fitted interstitial migration energy which was found to be {approximately}0.56 eV. This model successfully explains the difference in the temperature-dependent amorphization behavior of SiC irradiated with 0.56 MeV silicon ions at 1 x 10{sup {minus}3} dpa/s and with fission neutrons irradiated at 1 x 10{sup {minus}6} dpa/s irradiated to 15 dpa in the temperature range of {approximately}340 {+-} 10K.

  9. Grain boundary resistance to amorphization of nanocrystalline silicon carbide.

    PubMed

    Chen, Dong; Gao, Fei; Liu, Bo

    2015-11-12

    Under the C displacement condition, we have used molecular dynamics simulation to examine the effects of grain boundaries (GBs) on the amorphization of nanocrystalline silicon carbide (nc-SiC) by point defect accumulation. The results show that the interstitials are preferentially absorbed and accumulated at GBs that provide the sinks for defect annihilation at low doses, but also driving force to initiate amorphization in the nc-SiC at higher doses. The majority of surviving defects are C interstitials, as either C-Si or C-C dumbbells. The concentration of defect clusters increases with increasing dose, and their distributions are mainly observed along the GBs. Especially these small clusters can subsequently coalesce and form amorphous domains at the GBs during the accumulation of carbon defects. A comparison between displacement amorphized nc-SiC and melt-quenched single crystal SiC shows the similar topological features. At a dose of 0.55 displacements per atom (dpa), the pair correlation function lacks long range order, demonstrating that the nc-SiC is fully amorphilized.

  10. FTIR study of silicon carbide amorphization by heavy ion irradiations

    NASA Astrophysics Data System (ADS)

    Costantini, Jean-Marc; Miro, Sandrine; Pluchery, Olivier

    2017-03-01

    We have measured at room temperature (RT) the Fourier-transform infra-red (FTIR) absorption spectra of ion-irradiated thin epitaxial films of cubic silicon carbide (3C-SiC) with 1.1 µm thickness on a 500 µm thick (1 0 0) silicon wafer substrate. Irradiations were carried out at RT with 2.3 MeV 28Si+ ions and 3.0 MeV 84Kr+ ions for various fluences in order to induce amorphization of the SiC film. Ion projected ranges were adjusted to be slightly larger than the film thickness so that the whole SiC layers were homogeneously damaged. FTIR spectra of virgin and irradiated samples were recorded for various incidence angles from normal incidence to Brewster’s angle. We show that the amorphization process in ion-irradiated 3C-SiC films can be monitored non-destructively by FTIR absorption spectroscopy without any major interference of the substrate. The compared evolutions of TO and LO peaks upon ion irradiation yield valuable information on the damage process. Complementary test experiments were also performed on virgin silicon nitride (Si3N4) self-standing films for similar conditions. Asymmetrical shapes were found for TO peaks of SiC, whereas Gaussian profiles are found for LO peaks. Skewed Gaussian profiles, with a standard deviation depending on wave number, were used to fit asymmetrical peaks for both materials. A new methodology for following the amorphization process is proposed on the basis of the evolution of fitted IR absorption peak parameters with ion fluence. Results are discussed with respect to Rutherford backscattering spectrometry channeling and Raman spectroscopy analysis.

  11. Amorphous silicon carbide ultramicroelectrode arrays for neural stimulation and recording.

    PubMed

    Deku, Felix; Cohen, Yarden; Joshi-Imre, Alexandra; Kanneganti, Aswini; Gardner, Timothy; Cogan, Stuart

    2017-09-27

    Foreign body response to indwelling cortical microelectrodes limits the reliability of neural stimulation and recording, particularly for extended chronic applications in behaving animals. The extent to which this response compromises the chronic stability of neural devices depends on many factors including the materials used in the electrode construction, the size, and geometry of the indwelling structure. Here, we report on the development of microelectrode arrays (MEAs) based on amorphous silicon carbide (a-SiC). This technology utilizes a-SiC for its chronic stability and employs semiconductor manufacturing processes to create MEAs with small shank dimensions. The a-SiC films were deposited by plasma enhanced chemical vapor deposition and patterned by thin-film photolithographic techniques. To improve stimulation and recording capabilities with small contact areas, we investigated low impedance coatings on the electrode sites. The assembled devices were characterized in phosphate buffered saline for their electrochemical properties. MEAs utilizing a-SiC as both the primary structural element and encapsulation were fabricated successfully. These a-SiC MEAs had 16 penetrating shanks. Each shank has a cross-sectional area less than 60 µm<sup>2</sup> and electrode sites with a geometric surface area varying from 20-200 μm<sup>2</sup>. Electrode coatings of TiN and SIROF reduced 1 kHz electrode impedance to less than 100 kΩ from ~2.8 MΩ for 100 µm<sup>2</sup> Au electrode sites and increased the charge injection capacities to values greater than 3 mC/cm<sup>2</sup>. Finally, we demonstrated functionality by recording neural activity from basal ganglia nucleus of Zebra Finches and motor cortex of rat. The a-SiC MEAs provide a significant advancement in the development of microelectrodes that over the years has relied on silicon platforms for device manufacture. These flexible a-SiC MEAs have the potential for

  12. Wide gap microcrystalline silicon carbide emitter for amorphous silicon oxide passivated heterojunction solar cells

    NASA Astrophysics Data System (ADS)

    Pomaska, Manuel; Richter, Alexei; Lentz, Florian; Niermann, Tore; Finger, Friedhelm; Rau, Uwe; Ding, Kaining

    2017-02-01

    Wide gap n-type microcrystalline silicon carbide [µc-SiC:H(n)] is highly suitable as window layer material for silicon heterojunction (SHJ) solar cells due to its high optical transparency combined with high electrical conductivity. However, the hot wire chemical vapor deposition (HWCVD) of highly crystalline µc-SiC:H(n) requires a high hydrogen radical density in the gas phase that gives rise to strong deterioration of the intrinsic amorphous silicon oxide [a-SiO x :H(i)] surface passivation. Introducing an n-type microcrystalline silicon oxide [µc-SiO x :H(n)] protection layer between the µc-SiC:H(n) and the a-SiO x :H(i) prevents the deterioration of the passivation by providing an etch resistance and by blocking the diffusion of hydrogen radicals. We fabricated solar cells with µc-SiC:H(n)/µc-SiO x :H(n)/a-SiO x :H(i) stack for the front side and varied the µc-SiO x :H(n) material properties by changing the microstructure of the µc-SiO x :H(n) to evaluate the potential of such stack implemented in SHJ solar cells and to identify the limiting parameters of the protection layer in the device. With this approach we achieved a maximum open circuit voltage of 677 mV and a maximum energy conversion efficiency of 18.9% for a planar solar cell.

  13. In situ laser reflectometry study of the amorphization of silicon carbide by MeV ion implantation

    NASA Astrophysics Data System (ADS)

    Henkel, T.; Heera, V.; Kögler, R.; Skorupa, W.

    1998-09-01

    In situ laser reflectometry and ex situ Rutherford backscattering spectrometry have been used to investigate the ion fluence and temperature dependence of the amorphization process in silicon carbide induced by 3 MeV I2+ irradiation. A comparative study in silicon showed that damage accumulation in silicon carbide proceeds more gradually in the preliminary stage of amorphization. The amorphization fluence depends weakly on temperature below 300 K but strongly above 300 K. Silicon carbide is amorphized more quickly than silicon at elevated temperatures. At very low temperatures a higher ion fluence for the amorphization of silicon carbide is required in comparison to silicon. Owing to this behavior, different mechanisms of damage growth are assumed to be present in these semiconductors. A critical energy density of 5.6×1024 eV/cm3 for the amorphization of the silicon carbide crystal up to the surface has been found at room temperature. Experimental results are compared with predictions of the models proposed by Carter as well as by Morehead and Crowder.

  14. Investigation of hydrogen plasma treatment for reducing defects in silicon quantum dot superlattice structure with amorphous silicon carbide matrix

    PubMed Central

    2014-01-01

    We investigate the effects of hydrogen plasma treatment (HPT) on the properties of silicon quantum dot superlattice films. Hydrogen introduced in the films efficiently passivates silicon and carbon dangling bonds at a treatment temperature of approximately 400°C. The total dangling bond density decreases from 1.1 × 1019 cm-3 to 3.7 × 1017 cm-3, which is comparable to the defect density of typical hydrogenated amorphous silicon carbide films. A damaged layer is found to form on the surface by HPT; this layer can be easily removed by reactive ion etching. PMID:24521208

  15. Atomistic modeling of amorphous silicon carbide using a bond-order potential

    SciTech Connect

    Devanathan, Ram; Gao, Fei; Weber, William J.

    2007-02-16

    Molecular dynamics simulations were performed with a Brenner-type bond-order potential to study the melting of silicon carbide (SiC), the structure of amorphous SiC produced by quenching from the melt, and the evolution of the amorphous state after isochronal annealing at elevated temperatures. The simulations reveal that SiC melts above 3700 K with an enthalpy of fusion of about 0.6 eV/atom. The density of the quenched liquid is about 2820 kg/m3, in excellent agreement with the experimental value for SiC amorphized by neutron irradiation. In addition to the loss of long-range order, the quenched liquid shows short-range disorder as measured by the C homonuclear bond ratio. Upon annealing, there is partial recovery of shortrange order.

  16. Charging/discharging behavior and mechanism of silicon quantum dots embedded in amorphous silicon carbide films

    SciTech Connect

    Wen, Xixing; Zeng, Xiangbin Zheng, Wenjun; Liao, Wugang; Feng, Feng

    2015-01-14

    The charging/discharging behavior of Si quantum dots (QDs) embedded in amorphous silicon carbide (a-SiC{sub x}) was investigated based on the Al/insulating layer/Si QDs embedded in a-SiC{sub x}/SiO{sub 2}/p-Si (metal-insulator-quantum dots-oxide-silicon) multilayer structure by capacitance-voltage (C-V) and conductance-voltage (G-V) measurements. Transmission electron microscopy and Raman scattering spectroscopy measurements reveal the microstructure and distribution of Si QDs. The occurrence and shift of conductance peaks indicate the carrier transfer and the charging/discharging behavior of Si QDs. The multilayer structure shows a large memory window of 5.2 eV at ±8 V sweeping voltage. Analysis of the C-V and G-V results allows a quantification of the Coulomb charging energy and the trapped charge density associated with the charging/discharging behavior. It is found that the memory window is related to the size effect, and Si QDs with large size or low Coulomb charging energy can trap two or more electrons by changing the charging voltage. Meanwhile, the estimated lower potential barrier height between Si QD and a-SiC{sub x}, and the lower Coulomb charging energy of Si QDs could enhance the charging and discharging effect of Si QDs and lead to an enlarged memory window. Further studies of the charging/discharging mechanism of Si QDs embedded in a-SiC{sub x} can promote the application of Si QDs in low-power consumption semiconductor memory devices.

  17. Amorphous Silicon Carbide Passivating Layers to Enable Higher Processing Temperature in Crystalline Silicon Heterojunction Solar Cells

    SciTech Connect

    Boccard, Mathieu; Holman, Zachary

    2015-04-06

    "Very efficient crystalline silicon (c-Si) solar cells have been demonstrated when thin layers of intrinsic and doped hydrogenated amorphous silicon (a-Si:H) are used for passivation and carrier selectivity in a heterojunction device. One limitation of this device structure is the (parasitic) absorption in the front passivation/collection a-Si:H layers; another is the degradation of the a-Si:H-based passivation upon temperature, limiting the post-processes to approximately 200°C thus restricting the contacting possibilities and potential tandem device fabrication. To alleviate these two limitations, we explore the potential of amorphous silicon carbide (a-SiC:H), a widely studied material in use in standard a-Si:H thin-film solar cells, which is known for its wider bandgap, increased hydrogen content and stronger hydrogen bonding compared to a-Si:H. We study the surface passivation of solar-grade textured n-type c-Si wafers for symmetrical stacks of 10-nm-thick intrinsic a-SiC:H with various carbon content followed by either p-doped or n-doped a-Si:H (referred to as i/p or i/n stacks). For both doping types, passivation (assessed through carrier lifetime measurements) is degraded by increasing the carbon content in the intrinsic a-SiC:H layer. Yet, this hierarchy is reversed after annealing at 350°C or more due to drastic passivation improvements upon annealing when an a-SiC:H layer is used. After annealing at 350°C, lifetimes of 0.4 ms and 2.0 ms are reported for i/p and i/n stacks, respectively, when using an intrinsic a-SiC:H layer with approximately 10% of carbon (initial lifetimes of 0.3 ms and 0.1 ms, respectively, corresponding to a 30% and 20-fold increase, respectively). For stacks of pure a-Si:H material the lifetimes degrade from 1.2 ms and 2.0 ms for i/p and i/n stacks, respectively, to less than 0.1 ms and 1.1 ms (12-fold and 2-fold decrease, respectively). For complete solar cells using pure a-Si:H i/p and i/n stacks, the open-circuit voltage (Voc

  18. Plasma deposition of amorphous silicon carbide thin films irradiated with neutrons

    NASA Astrophysics Data System (ADS)

    Huran, J.; Bohacek, P.; Kucera, M.; Kleinova, A.; Sasinkova, V.; IEE SAS, Bratislava, Slovakia Team; Polymer Institute, SAS, Bratislava, Slovakia Team; Institute of Chemistry, SAS, Bratislava, Slovakia Team

    2015-09-01

    Amorphous silicon carbide and N-doped silicon carbide thin films were deposited on P-type Si(100) wafer by plasma enhanced chemical vapor deposition (PECVD) technology using silane, methane, ammonium and argon gases. The concentration of elements in the films was determined by RBS and ERDA method. Chemical compositions were analyzed by FTIR spectroscopy. Photoluminescence properties were studied by photoluminescence spectroscopy (PL). Irradiation of samples with various neutron fluencies was performed at room temperature. The films contain silicon, carbon, hydrogen, nitrogen and small amount of oxygen. From the IR spectra, the films contained Si-C, Si-H, C-H, Si-N, N-H and Si-O bonds. No significance effect on the IR spectra after neutron irradiation was observed. PL spectroscopy results of films showed decreasing PL intensity after neutron irradiation and PL intensity decreased with increased neutron fluencies. The measured current of the prepared structures increased after irradiation with neutrons and rise up with neutron fluencies.

  19. Luminescent amorphous silicon carbide ultrafine nanoparticles fabricated by pulsed-laser ablation

    NASA Astrophysics Data System (ADS)

    Zhu, Jun; Hu, Shan; Wang, Wei; Xia, Wei-wei; Chen, Hai-tao; Chen, Xiao-bing

    2017-04-01

    Bulk quantities of amorphous silicon carbide(SiC) ultrafine nanoparticles have been prepared via pulsed-laser ablation on a polished 3C-SiC polycrystalline target immersed in de-ionized water. The diameter of the nanoparticles is 10 ± 2.0 nm. The surface of the nanoparticles binds to the -H and -OH groups in water, suggesting that the ultrafine nanoparticles are hydrophilic. A direct band gap energy of 5.3 eV and an indirect band gap energy of 2.4 eV were determined via the ultraviolet-visible absorption characterization, which implies that the nanoparticles are of SiC. As excited at 320 nm, the suspension exhibited strong and stable violet emissions centered at 430 nm.

  20. Direct visualization of photoinduced glassy dynamics on the amorphous silicon carbide surface by STM movies

    NASA Astrophysics Data System (ADS)

    Nguyen, Duc; Nienhaus, Lea; Haasch, Richard T.; Lyding, Joseph; Gruebele, Martin

    2015-03-01

    Glassy dynamics can be controlled by light irradiation. Sub- and above-bandgap irradiation cause numerous phenomena in glasses including photorelaxation, photoexpansion, photodarkening and pohtoinduced fluidity. We used scanning tunneling microscopy to study surface glassy dynamics of amorphous silicon carbide irradiated with above- bandgap 532 nm light. Surface clusters of ~ 4-5 glass forming unit in diameter hop mostly in a two-state fashion, both without and with irradiation. Upon irradiation, the average surface hopping activity increases by a factor of 3. A very long (~1 day) movie of individual clusters with varying laser power density provides direct evidence for photoinduced enhanced hopping on the glass surfaces. We propose two mechanisms: heating and electronic for the photoenhanced surface dynamics.

  1. Formation of high conductive nano-crystalline silicon embedded in amorphous silicon-carbide films with large optical band gap

    NASA Astrophysics Data System (ADS)

    Ji, Yang; Shan, Dan; Qian, Mingqing; Xu, Jun; Li, Wei; Chen, Kunji

    2016-10-01

    High conductive phosphorus-doped nano-crystalline Si embedded in Silicon-Carbide (SiC) host matrix (nc-Si:SiC) films were obtained by thermally annealing doped amorphous Si-rich SiC materials. It was found that the room conductivity is increased significantly accompanying with the increase of doping concentrations as well as the enhanced crystallizations. The conductivity can be as high as 630 S/cm for samples with the optical band gap around 2.7 eV, while the carrier mobility is about 17.9 cm2/ V.s. Temperature-dependent conductivity and mobility measurements were performed which suggested that the carrier transport process is strongly affected by both the grain boundaries and the doping concentrations.

  2. Direct Transformation of Amorphous Silicon Carbide into Graphene under Low Temperature and Ambient Pressure

    PubMed Central

    Peng, Tao; Lv, Haifeng; He, Daping; Pan, Mu; Mu, Shichun

    2013-01-01

    A large-scale availability of the graphene is critical to the successful application of graphene-based electronic devices. The growth of epitaxial graphene (EG) on insulating silicon carbide (SiC) surfaces has opened a new promising route for large-scale high-quality graphene production. However, two key obstacles to epitaxial growth are extremely high requirements for almost perfectly ordered crystal SiC and harsh process conditions. Here, we report that the amorphous SiC (a-Si1−xCx) nano-shell (nano-film) can be directly transformed into graphene by using chlorination method under very mild reaction conditions of relative low temperature (800°C) and the ambient pressure in chlorine (Cl2) atmosphere. Therefore, our finding, the direct transformation of a-Si1−xCx into graphene under much milder condition, will open a door to apply this new method to the large-scale production of graphene at low costs. PMID:23359349

  3. In vivo Characterization of Amorphous Silicon Carbide As a Biomaterial for Chronic Neural Interfaces.

    PubMed

    Knaack, Gretchen L; McHail, Daniel G; Borda, German; Koo, Beomseo; Peixoto, Nathalia; Cogan, Stuart F; Dumas, Theodore C; Pancrazio, Joseph J

    2016-01-01

    Implantable microelectrode arrays (MEAs) offer clinical promise for prosthetic devices by enabling restoration of communication and control of artificial limbs. While proof-of-concept recordings from MEAs have been promising, work in animal models demonstrates that the obtained signals degrade over time. Both material robustness and tissue response are acknowledged to have a role in device lifetime. Amorphous Silicon carbide (a-SiC), a robust material that is corrosion resistant, has emerged as an alternative encapsulation layer for implantable devices. We systematically examined the impact of a-SiC coating on Si probes by immunohistochemical characterization of key markers implicated in tissue-device response. After implantation, we performed device capture immunohistochemical labeling of neurons, astrocytes, and activated microglia/macrophages after 4 and 8 weeks of implantation. Neuron loss and microglia activation were similar between Si and a-SiC coated probes, while tissue implanted with a-SiC displayed a reduction in astrocytes adjacent to the probe. These results suggest that a-SiC has a similar biocompatibility profile as Si, and may be suitable for implantable MEA applications as a hermetic coating to prevent material degradation.

  4. In vivo Characterization of Amorphous Silicon Carbide As a Biomaterial for Chronic Neural Interfaces

    PubMed Central

    Knaack, Gretchen L.; McHail, Daniel G.; Borda, German; Koo, Beomseo; Peixoto, Nathalia; Cogan, Stuart F.; Dumas, Theodore C.; Pancrazio, Joseph J.

    2016-01-01

    Implantable microelectrode arrays (MEAs) offer clinical promise for prosthetic devices by enabling restoration of communication and control of artificial limbs. While proof-of-concept recordings from MEAs have been promising, work in animal models demonstrates that the obtained signals degrade over time. Both material robustness and tissue response are acknowledged to have a role in device lifetime. Amorphous Silicon carbide (a-SiC), a robust material that is corrosion resistant, has emerged as an alternative encapsulation layer for implantable devices. We systematically examined the impact of a-SiC coating on Si probes by immunohistochemical characterization of key markers implicated in tissue-device response. After implantation, we performed device capture immunohistochemical labeling of neurons, astrocytes, and activated microglia/macrophages after 4 and 8 weeks of implantation. Neuron loss and microglia activation were similar between Si and a-SiC coated probes, while tissue implanted with a-SiC displayed a reduction in astrocytes adjacent to the probe. These results suggest that a-SiC has a similar biocompatibility profile as Si, and may be suitable for implantable MEA applications as a hermetic coating to prevent material degradation. PMID:27445672

  5. Silicon carbide

    SciTech Connect

    Ault, N.N.; Crowe, J.T. )

    1991-05-01

    This paper reports that, since silicon carbide (SiC) does not occur in nature, it must be synthesized by a high-temperature chemical reaction. The first commercial production began at the end of the 19th century when Acheson developed a process of reacting sand and coke in a resistance furnace. This process is still the basic SiC manufacturing process used today. High-quality silica sand (99.5% SiO{sub 2}), low-sulfur petroleum coke, and electricity (23.8 MJ/kg) are the major ingredients in the production of SiC. The reaction takes place in a trough-like furnace with a removable refractory side (or some similar configuration) and with permanent refractory ends holding carbon electrodes. When the furnace is started, the carbon electrodes are joined by the graphite core laid the length of the furnace near the center of the mixture which fills the furnace.

  6. Photoluminescence properties and crystallization of silicon quantum dots in hydrogenated amorphous Si-rich silicon carbide films

    SciTech Connect

    Wen, Guozhi; Zeng, Xiangbin Wen, Xixin; Liao, Wugang

    2014-04-28

    Silicon quantum dots (QDs) embedded in hydrogenated amorphous Si-rich silicon carbide (α-SiC:H) thin films were realized by plasma-enhanced chemical vapor deposition process and post-annealing. Fluorescence spectroscopy was used to characterize the room-temperature photoluminescence properties. X-ray photoelectron spectroscopy was used to analyze the element compositions and bonding configurations. Ultraviolet visible spectroscopy, Raman scattering, and high-resolution transmission electron microscopy were used to display the microstructural properties. Photoluminescence measurements reveal that there are six emission sub-bands, which behave in different ways. The peak wavelengths of sub-bands P1, P2, P3, and P6 are pinned at about 425.0, 437.3, 465.0, and 591.0 nm, respectively. Other two sub-bands, P4 is red-shifted from 494.6 to 512.4 nm and P5 from 570.2 to 587.8 nm with temperature increasing from 600 to 900 °C. But then are both blue-shifted, P4 to 500.2 nm and P5 to 573.8 nm from 900 to 1200 °C. The X-ray photoelectron spectroscopy analysis shows that the samples are in Si-rich nature, Si-O and Si-N bonds consumed some silicon atoms. The structure characterization displays that a separation between silicon phase and SiC phase happened; amorphous and crystalline silicon QDs synthesized with increasing the annealing temperature. P1, P2, P3, and P6 sub-bands are explained in terms of defect-related emission, while P4 and P5 sub-bands are explained in terms of quantum confinement effect. A correlation between the peak wavelength shift, as well as the integral intensity of the spectrum and crystallization of silicon QDs is supposed. These results help clarify the probable luminescence mechanisms and provide the possibility to optimize the optical properties of silicon QDs in Si-rich α-SiC: H materials.

  7. Photoelectron yield spectroscopy and inverse photoemission spectroscopy evaluations of p-type amorphous silicon carbide films prepared using liquid materials

    SciTech Connect

    Murakami, Tatsuya E-mail: mtakashi@jaist.ac.jp; Masuda, Takashi E-mail: mtakashi@jaist.ac.jp; Inoue, Satoshi; Shimoda, Tatsuya; Yano, Hiroshi; Iwamuro, Noriyuki

    2016-05-15

    Phosphorus-doped amorphous silicon carbide films were prepared using a polymeric precursor solution. Unlike conventional polymeric precursors, this polymer requires neither catalysts nor oxidation for its synthesis and cross-linkage, providing semiconducting properties in the films. The valence and conduction states of resultant films were determined directly through the combination of inverse photoemission spectroscopy and photoelectron yield spectroscopy. The incorporated carbon widened energy gap and optical gap comparably in the films with lower carbon concentrations. In contrast, a large deviation between the energy gap and the optical gap was observed at higher carbon contents because of exponential widening of the band tail.

  8. Diamond-silicon carbide composite

    DOEpatents

    Qian, Jiang; Zhao, Yusheng

    2006-06-13

    Fully dense, diamond-silicon carbide composites are prepared from ball-milled microcrystalline diamond/amorphous silicon powder mixture. The ball-milled powder is sintered (P=5–8 GPa, T=1400K–2300K) to form composites having high fracture toughness. A composite made at 5 GPa/1673K had a measured fracture toughness of 12 MPa.dot.m1/2. By contrast, liquid infiltration of silicon into diamond powder at 5 GPa/1673K produces a composite with higher hardness but lower fracture toughness. X-ray diffraction patterns and Raman spectra indicate that amorphous silicon is partially transformed into nanocrystalline silicon at 5 GPa/873K, and nanocrystalline silicon carbide forms at higher temperatures.

  9. The Synthesis and Structural Properties of Crystalline Silicon Quantum Dots upon Thermal Annealing of Hydrogenated Amorphous Si-Rich Silicon Carbide Films

    NASA Astrophysics Data System (ADS)

    Wen, Guozhi; Zeng, Xiangbin; Li, Xianghu

    2016-08-01

    Silicon quantum dots (QDs) embedded in non-stoichiometric hydrogenated silicon carbide (SiC:H) thin films have been successfully synthesized by plasma-enhanced chemical vapor deposition and post-annealing. The chemical composition analyses have been carried out by x-ray photoelectron spectroscopy (XPS). The bonding configurations have been deduced from Fourier transform infrared absorption measurements (FTIR). The evolution of microstructure with temperature has been characterized by glancing incident x-ray diffraction (XRD) and Raman diffraction spectroscopy. XPS and FTIR show that it is in Si-rich feature and there are a few hydrogenated silicon clusters in the as-grown sample. XRD and Raman diffraction spectroscopy show that it is in amorphous for the as-grown sample, while crystalline silicon QDs have been synthesized in the 900°C annealed sample. Silicon atoms precipitation from the SiC matrix or silicon phase transition from amorphous SiC is enhanced with annealing temperature increase. The average sizes of silicon QDs are about 5.1 nm and 5.6 nm, the number densities are as high as 1.7 × 1012 cm-2 and 3.2 × 1012 cm-2, and the crystalline volume fractions are about 58.3% and 61.3% for the 900°C and 1050°C annealed samples, respectively. These structural properties analyses provide an understanding about the synthesis of silicon QDs upon thermal annealing for applications in next generation optoelectronic and photovoltaic devices.

  10. SILICON CARBIDE FOR SEMICONDUCTORS

    DTIC Science & Technology

    This state-of-the-art survey on silicon carbide for semiconductors includes a bibliography of the most important references published as of the end...of 1964. The various methods used for growing silicon carbide single crystals are reviewed, as well as their properties and devices fabricated from...them. The fact that the state of-the-art of silicon carbide semiconductors is not further advanced may be attributed to the difficulties of growing

  11. Silicon Carbide Shapes.

    DTIC Science & Technology

    Free-standing silicon carbide shapes are produced by passing a properly diluted stream of a reactant gas, for example methyltrichlorosilane, into a...reaction chamber housing a thin walled, hollow graphite body heated to 1300-1500C. After the graphite body is sufficiently coated with silicon carbide , the...graphite body is fired, converting the graphite to gaseous CO2 and CO and leaving a silicon carbide shaped article remaining.

  12. Silicon carbide ceramic production

    NASA Technical Reports Server (NTRS)

    Suzuki, K.; Shinohara, N.

    1984-01-01

    A method to produce sintered silicon carbide ceramics in which powdery carbonaceous components with a dispersant are mixed with silicon carbide powder, shaped as required with or without drying, and fired in nonoxidation atmosphere is described. Carbon black is used as the carbonaceous component.

  13. Silicon Carbide Photoconductive Switches

    DTIC Science & Technology

    1994-09-01

    The optoelectronic properties of p-type 6-H silicon carbide (6H-SiC) have been investigated in an experiment that used lateral and vertical...and the bandgap was determined to be approximately 3.1 eV. 6H-SiC, Photoconductive, Photovoltaic, Absorption coefficient, Switch, Silicon carbide

  14. SILICON CARBIDE DATA SHEETS

    DTIC Science & Technology

    These data sheets present a compilation of a wide range of electrical, optical and energy values for alpha and beta- silicon carbide in bulk and film...spectrum. Energy data include energy bands, energy gap and energy levels for variously-doped silicon carbide , as well as effective mass tables, work

  15. An environment-dependent interatomic potential for silicon carbide: calculation of bulk properties, high-pressure phases, point and extended defects, and amorphous structures.

    PubMed

    Lucas, G; Bertolus, M; Pizzagalli, L

    2010-01-27

    An interatomic potential has been developed to describe interactions in silicon, carbon and silicon carbide, based on the environment-dependent interatomic potential (EDIP) (Bazant et al 1997 Phys. Rev. B 56 8542). The functional form of the original EDIP has been generalized and two sets of parameters have been proposed. Tests with these two potentials have been performed for many properties of SiC, including bulk properties, high-pressure phases, point and extended defects, and amorphous structures. One parameter set allows us to keep the original EDIP formulation for silicon, and is shown to be well suited for modelling irradiation-induced effects in silicon carbide, with a very good description of point defects and of the disordered phase. The other set, including a new parametrization for silicon, has been shown to be efficient for modelling point and extended defects, as well as high-pressure phases.

  16. Microstructures of the silicon carbide nanowires obtained by annealing the mechanically-alloyed amorphous powders

    SciTech Connect

    Zhang, Pengfei Li, Xinli

    2015-07-15

    Silicon, graphite and boron nitride powders were mechanically alloyed for 40 h in argon. The as-milled powders were annealed at 1700 °C in nitrogen for 30 min. The annealed powders are covered by a thick layer of gray–green SiC nanowires, which are 300 nm to 1000 nm in diameter and several hundred microns in length. Trace iron in the raw powders acts as a catalyst, promoting the V–L–S process. It follows that the actual substances contributing to the growth of the SiC nanowires may be silicon, graphite and the metal impurities in the raw powders. The results from HRTEM and XRD reveal that the products contain both straight α/β-SiC nanowires and nodular α/β-SiC nanochains. It is interestingly found that 6H–SiC coexists with 3C–SiC in one nodular nanowire. This novel structure may introduce periodic potential field along the longitudinal direction of the nanowires, and may find applications in the highly integrated optoelectronic devices. - Graphical abstract: Display Omitted - Highlights: • SiC nanowires were prepared by annealing the mechanically alloyed amorphous powders. • SiC nanowires are 300 nm to 1000 nm in diameter and several hundred microns in length. • The products contain both straight α/β-SiC nanowires and nodular α/β-SiC nanochains. • Trace Fe in the raw powders acts as a catalyst, promoting the V–L–S process. • 6H–SiC coexists with 3C–SiC in one nodular SiC nanowire.

  17. Extended x-ray-absorption and electron-energy-loss fine-structure studies of the local atomic structure of amorphous unhydrogenated and hydrogenated silicon carbide

    SciTech Connect

    Kaloyeros, A.E.; Rizk, R.B.; Woodhouse, J.B.

    1988-12-15

    Extended x-ray-absorption (EXAFS) and electron-energy-loss fine-structure (EXELFS) measurements have been performed on amorphous unhydrogenated silicon carbide, a-SiC, and amorphous hydrogenated silicon carbide, a-SiC:H. Two hydrogenated samples with hydrogen concentrations corresponding, respectively, to H flows of 4 sccm (20% of argon flow) and 8 sccm (40% of argon flow) during the reactive sputtering process, were analyzed (sccm denotes standard cubic centimeters per minute at STP). It is found that short-range order (SRO), consisting of the same tetrahedrally coordinated units present in cubic crystalline c-SiC (zinc-blende structure), where a Si atom is surrounded by nearly four C atoms and vice versa, does exist in all the amorphous samples. This SRO, however, is detected only at a level of the first C and Si coordination shells in a-SiC and a-SiC:H. The structural disorder of the first Si and C coordination shells in all forms of amorphous SiC is somewhat greater than c-SiC, and it decreases appreciably as hydrogen is added. The a-SiC sample exhibits large Si and C coordination numbers, almost identical to c-SiC, a low atomic density, and virtually the same Si-C bond length as c-SiC. These results indicate that a relatively small concentration of large voids exist in a highly disordered a-SiC matrix.

  18. Stabilization of boron carbide via silicon doping.

    PubMed

    Proctor, J E; Bhakhri, V; Hao, R; Prior, T J; Scheler, T; Gregoryanz, E; Chhowalla, M; Giulani, F

    2015-01-14

    Boron carbide is one of the lightest and hardest ceramics, but its applications are limited by its poor stability against a partial phase separation into separate boron and carbon. Phase separation is observed under high non-hydrostatic stress (both static and dynamic), resulting in amorphization. The phase separation is thought to occur in just one of the many naturally occurring polytypes in the material, and this raises the possibility of doping the boron carbide to eliminate this polytype. In this work, we have synthesized boron carbide doped with silicon. We have conducted a series of characterizations (transmission electron microscopy, scanning electron microscopy, Raman spectroscopy and x-ray diffraction) on pure and silicon-doped boron carbide following static compression to 50 GPa non-hydrostatic pressure. We find that the level of amorphization under static non-hydrostatic pressure is drastically reduced by the silicon doping.

  19. Stabilization of boron carbide via silicon doping

    NASA Astrophysics Data System (ADS)

    Proctor, J. E.; Bhakhri, V.; Hao, R.; Prior, T. J.; Scheler, T.; Gregoryanz, E.; Chhowalla, M.; Giulani, F.

    2015-01-01

    Boron carbide is one of the lightest and hardest ceramics, but its applications are limited by its poor stability against a partial phase separation into separate boron and carbon. Phase separation is observed under high non-hydrostatic stress (both static and dynamic), resulting in amorphization. The phase separation is thought to occur in just one of the many naturally occurring polytypes in the material, and this raises the possibility of doping the boron carbide to eliminate this polytype. In this work, we have synthesized boron carbide doped with silicon. We have conducted a series of characterizations (transmission electron microscopy, scanning electron microscopy, Raman spectroscopy and x-ray diffraction) on pure and silicon-doped boron carbide following static compression to 50 GPa non-hydrostatic pressure. We find that the level of amorphization under static non-hydrostatic pressure is drastically reduced by the silicon doping.

  20. Silicon carbide thyristor

    NASA Technical Reports Server (NTRS)

    Edmond, John A. (Inventor); Palmour, John W. (Inventor)

    1996-01-01

    The SiC thyristor has a substrate, an anode, a drift region, a gate, and a cathode. The substrate, the anode, the drift region, the gate, and the cathode are each preferably formed of silicon carbide. The substrate is formed of silicon carbide having one conductivity type and the anode or the cathode, depending on the embodiment, is formed adjacent the substrate and has the same conductivity type as the substrate. A drift region of silicon carbide is formed adjacent the anode or cathode and has an opposite conductivity type as the anode or cathode. A gate is formed adjacent the drift region or the cathode, also depending on the embodiment, and has an opposite conductivity type as the drift region or the cathode. An anode or cathode, again depending on the embodiment, is formed adjacent the gate or drift region and has an opposite conductivity type than the gate.

  1. Effects of hydrogen and rf power on the structural and electrical properties of rf sputtered hydrogenated amorphous silicon carbide films

    NASA Astrophysics Data System (ADS)

    Choi, W. K.; Loo, F. L.; Loh, F. C.; Tan, K. L.

    1996-08-01

    The effects of the rf power (100 to 600 W) and the hydrogen partial pressure (PH=0.15 to 0.6 Pa.) on the deposition rate and the structural and electrical properties of rf sputtered hydrogenated amorphous silicon carbide (a-Si1-xCx:H) films were investigated. The films were deposited in an argon plus hydrogen ambient. The deposition rate increased with increasing rf power, but decreased with increasing PH. The refractive index increases from 1.85-3.6 as the rf power increases from 100-600 W and from 2.8 to 3.5 as PH increases from 0.15-0.6 Pa. The optical gap increases from 1.5 to 2.15 eV as PH increases from 0.15-0.6 Pa, but decreases from 2.8-1.38 eV as the rf power increases from 100-600 W. The Si-C bond gave the most prominent absorption peak in the infrared spectra, and increased with increasing rf power but not affected by changes in PH. The Si-H bonds increases from 3.06×1021 to 1.64×1022 cm-3 as PH was increased from 0.15-0.6 Pa. The optical gap increases from 1.5-2.15 eV and the conductivity reduces from 7.3×10-9 to 1.9×10-11 Ω-1 cm-1 accordingly. No C-Hn stretching mode was detected in all the films and this was attributed to the low carbon content of the films. We conclude that rf sputtering technique is not effective in varying the carbon content in a-Si1-xCx:H films.

  2. Development of a corrosion-resistant amorphous silicon carbide photoelectrode for solar-to-hydrogen photovoltaic/photoelectrochemical devices

    NASA Astrophysics Data System (ADS)

    Matulionis, Ilvydas; Zhu, Feng; Hu, Jian; Deutsch, Todd; Kunrath, Augusto; Miller, Eric; Marsen, Bjorn; Madan, Arun

    2008-08-01

    Photoelectrochemical (PEC) water splitting at a semiconductor-electrolyte interface using sunlight is of considerable interest as it offers a clean approach to hydrogen production. PEC cells require semiconductor photoelectrode materials fulfilling a number of important requirements, such as band-edge alignment, corrosion resistance to electrolyte, and adequate current generation. We report the development of RF-PECVD-deposited hydrogenated amorphous silicon carbide (a-SiC:H) photoelectrodes with improved durability, which, when combined with a-Si:H tandem photovoltaic devices, should produce hydrogen directly from water under sunlight. The a-SiC:H is commonly grown with a bandgap in excess of 2.0 eV and completes the PEC device by providing contact with the electrolyte, proper band-edge alignment, and acts as a buffer for the a-Si:H tandem structure. Effects of the pH of electrolyte, type of substrates, and a platinum nanoparticle coating on the durability of a-SiC photoelectrodes will be presented. From these studies we surmise that corrosion or damage mechanism occurring on a-SiC:H layer could be divided into different aspects of physical and chemical. From the physical point of view, defects associated with spikes in textured TCO substrates, roughness of stainless steel, or other sources of pinholes may initiate delamination as confirmed by SEM (Scanning Electron Microscopy) and EDS (Energy-Dispersive X-ray Spectroscopy) studies. Chemically, the production of hydrogen involves reactions that may etch the electrode, especially when physical defects are involved. We observe that reducing the acidity of the electrolyte (increasing the pH from 0 to 2) significantly reduces corrosion while the useful photocurrent output of the a-SiC:H p/i structure is unaffected.

  3. Silicon nitride/silicon carbide composite powders

    DOEpatents

    Dunmead, Stephen D.; Weimer, Alan W.; Carroll, Daniel F.; Eisman, Glenn A.; Cochran, Gene A.; Susnitzky, David W.; Beaman, Donald R.; Nilsen, Kevin J.

    1996-06-11

    Prepare silicon nitride-silicon carbide composite powders by carbothermal reduction of crystalline silica powder, carbon powder and, optionally, crystalline silicon nitride powder. The crystalline silicon carbide portion of the composite powders has a mean number diameter less than about 700 nanometers and contains nitrogen. The composite powders may be used to prepare sintered ceramic bodies and self-reinforced silicon nitride ceramic bodies.

  4. Silicon carbide reinforced silicon carbide composite

    NASA Technical Reports Server (NTRS)

    Lau, Sai-Kwing (Inventor); Calandra, Salvatore J. (Inventor); Ohnsorg, Roger W. (Inventor)

    2001-01-01

    This invention relates to a process comprising the steps of: a) providing a fiber preform comprising a non-oxide ceramic fiber with at least one coating, the coating comprising a coating element selected from the group consisting of carbon, nitrogen, aluminum and titanium, and the fiber having a degradation temperature of between 1400.degree. C. and 1450.degree. C., b) impregnating the preform with a slurry comprising silicon carbide particles and between 0.1 wt % and 3 wt % added carbon c) providing a cover mix comprising: i) an alloy comprising a metallic infiltrant and the coating element, and ii) a resin, d) placing the cover mix on at least a portion of the surface of the porous silicon carbide body, e) heating the cover mix to a temperature between 1410.degree. C. and 1450.degree. C. to melt the alloy, and f) infiltrating the fiber preform with the melted alloy for a time period of between 15 minutes and 240 minutes, to produce a ceramic fiber reinforced ceramic composite.

  5. Silicon Carbide Metallization

    NASA Astrophysics Data System (ADS)

    Lescoat, F.; Tanguy, F.; Durand, P.

    2016-05-01

    A study has been done to assess the feasibility of metallization of Silicon Carbide (SiC) in order to simplify design and mounting of one or more ground reference rail needed to provide an electrical reference for electronics mounted on an SiC structure.

  6. Composition Comprising Silicon Carbide

    NASA Technical Reports Server (NTRS)

    Mehregany, Mehran (Inventor); Zorman, Christian A. (Inventor); Fu, Xiao-An (Inventor); Dunning, Jeremy L. (Inventor)

    2012-01-01

    A method of depositing a ceramic film, particularly a silicon carbide film, on a substrate is disclosed in which the residual stress, residual stress gradient, and resistivity are controlled. Also disclosed are substrates having a deposited film with these controlled properties and devices, particularly MEMS and NEMS devices, having substrates with films having these properties.

  7. Characterization of Silicon Carbide.

    DTIC Science & Technology

    The various electrical and structural measurement techniques for silicon carbide are described. The electrical measurements include conductivity, resistivity, carrier concentration, mobility, doping energy levels, and lifetime. The structural measurements include polytype determination and crystalline perfection. Both bulk and epitaxial films are included.

  8. Diamond-silicon carbide composite and method

    DOEpatents

    Zhao, Yusheng

    2011-06-14

    Uniformly dense, diamond-silicon carbide composites having high hardness, high fracture toughness, and high thermal stability are prepared by consolidating a powder mixture of diamond and amorphous silicon. A composite made at 5 GPa/1673K had a measured fracture toughness of 12 MPam.sup.1/2. By contrast, liquid infiltration of silicon into diamond powder at 5 GPa/1673K produces a composite with higher hardness but lower fracture toughness.

  9. Improved toughness of silicon carbide

    NASA Technical Reports Server (NTRS)

    Palm, J. A.

    1975-01-01

    Several techniques were employed to apply or otherwise form porous layers of various materials on the surface of hot-pressed silicon carbide ceramic. From mechanical properties measurements and studies, it was concluded that although porous layers could be applied to the silicon carbide ceramic, sufficient damage was done to the silicon carbide surface by the processing required so as to drastically reduce its mechanical strength. It was further concluded that there was little promise of success in forming an effective energy absorbing layer on the surface of already densified silicon carbide ceramic that would have the mechanical strength of the untreated or unsurfaced material. Using a process for the pressureless sintering of silicon carbide powders it was discovered that porous layers of silicon carbide could be formed on a dense, strong silicon carbide substrate in a single consolidation process.

  10. Tritium in amorphous silicon

    SciTech Connect

    Sidhu, L.S.; Kosteski, T.; O`Leary, S.K.; Gaspari, F.; Zukotynski, S.; Kherani, N.P.; Shmadya, W.

    1996-12-31

    Preliminary results on infrared and luminescence measurements of tritium incorporated amorphous silicon are reported. Tritium is an unstable isotope that readily substitutes hydrogen in the amorphous silicon network. Due to its greater mass, bonded tritium is found to introduce new stretching modes in the infrared spectrum. Inelastic collisions between the beta particles, produced as a result of tritium decay, and the amorphous silicon network, results in the generation of excess electron-hole pairs. Radiative recombination of these carriers is observed.

  11. Hydrogen in amorphous silicon

    SciTech Connect

    Peercy, P. S.

    1980-01-01

    The structural aspects of amorphous silicon and the role of hydrogen in this structure are reviewed with emphasis on ion implantation studies. In amorphous silicon produced by Si ion implantation of crystalline silicon, the material reconstructs into a metastable amorphous structure which has optical and electrical properties qualitatively similar to the corresponding properties in high-purity evaporated amorphous silicon. Hydrogen studies further indicate that these structures will accomodate less than or equal to 5 at.% hydrogen and this hydrogen is bonded predominantly in a monohydride (SiH/sub 1/) site. Larger hydrogen concentrations than this can be achieved under certain conditions, but the excess hydrogen may be attributed to defects and voids in the material. Similarly, glow discharge or sputter deposited amorphous silicon has more desirable electrical and optical properties when the material is prepared with low hydrogen concentration and monohydride bonding. Results of structural studies and hydrogen incorporation in amorphous silicon were discussed relative to the different models proposed for amorphous silicon.

  12. A silicon carbide array for electrocorticography and peripheral nerve recording.

    PubMed

    Diaz-Botia, C A; Luna, L E; Neely, R M; Chamanzar, M; Carraro, C; Carmena, J M; Sabes, P N; Maboudian, R; Maharbiz, M M

    2017-10-01

    Current neural probes have a limited device lifetime of a few years. Their common failure mode is the degradation of insulating films and/or the delamination of the conductor-insulator interfaces. We sought to develop a technology that does not suffer from such limitations and would be suitable for chronic applications with very long device lifetimes. We developed a fabrication method that integrates polycrystalline conductive silicon carbide with insulating silicon carbide. The technology employs amorphous silicon carbide as the insulator and conductive silicon carbide at the recording sites, resulting in a seamless transition between doped and amorphous regions of the same material, eliminating heterogeneous interfaces prone to delamination. Silicon carbide has outstanding chemical stability, is biocompatible, is an excellent molecular barrier and is compatible with standard microfabrication processes. We have fabricated silicon carbide electrode arrays using our novel fabrication method. We conducted in vivo experiments in which electrocorticography recordings from the primary visual cortex of a rat were obtained and were of similar quality to those of polymer based electrocorticography arrays. The silicon carbide electrode arrays were also used as a cuff electrode wrapped around the sciatic nerve of a rat to record the nerve response to electrical stimulation. Finally, we demonstrated the outstanding long term stability of our insulating silicon carbide films through accelerated aging tests. Clinical translation in neural engineering has been slowed in part due to the poor long term performance of current probes. Silicon carbide devices are a promising technology that may accelerate this transition by enabling truly chronic applications.

  13. Silicon Carbide Integrated Circuit Chip

    NASA Image and Video Library

    2015-02-17

    A multilevel interconnect silicon carbide integrated circuit chip with co-fired ceramic package and circuit board recently developed at the NASA GRC Smart Sensors and Electronics Systems Branch for high temperature applications. High temperature silicon carbide electronics and compatible packaging technologies are elements of instrumentation for aerospace engine control and long term inner-solar planet explorations.

  14. Silicon carbide sewing thread

    NASA Technical Reports Server (NTRS)

    Sawko, Paul M. (Inventor)

    1995-01-01

    Composite flexible multilayer insulation systems (MLI) were evaluated for thermal performance and compared with currently used fibrous silica (baseline) insulation system. The systems described are multilayer insulations consisting of alternating layers of metal foil and scrim ceramic cloth or vacuum metallized polymeric films quilted together using ceramic thread. A silicon carbide thread for use in the quilting and the method of making it are also described. These systems provide lightweight thermal insulation for a variety of uses, particularly on the surface of aerospace vehicles subject to very high temperatures during flight.

  15. Silicon Carbide Electronic Devices

    NASA Technical Reports Server (NTRS)

    Neudeck, P. G.

    2001-01-01

    The status of emerging silicon carbide (SiC) widebandgap semiconductor electronics technology is briefly surveyed. SiC-based electronic devices and circuits are being developed for use in high-temperature, high-power, and/or high-radiation conditions under which conventional semiconductors cannot function. Projected performance benefits of SiC electronics are briefly illustrated for several applications. However, most of these operational benefits of SiC have yet to be realized in actual systems, primarily owing to the fact that the growth techniques of SiC crystals are relatively immature and device fabrication technologies are not yet sufficiently developed to the degree required for widespread, reliable commercial use. Key crystal growth and device fabrication issues that limit the performance and capability of high-temperature and/or high-power SiC electronics are identified. The electrical and material quality differences between emerging SiC and mature silicon electronics technology are highlighted.

  16. Silicon Carbide Electronic Devices

    NASA Technical Reports Server (NTRS)

    Neudeck, P. G.

    2001-01-01

    The status of emerging silicon carbide (SiC) widebandgap semiconductor electronics technology is briefly surveyed. SiC-based electronic devices and circuits are being developed for use in high-temperature, high-power, and/or high-radiation conditions under which conventional semiconductors cannot function. Projected performance benefits of SiC electronics are briefly illustrated for several applications. However, most of these operational benefits of SiC have yet to be realized in actual systems, primarily owing to the fact that the growth techniques of SiC crystals are relatively immature and device fabrication technologies are not yet sufficiently developed to the degree required for widespread, reliable commercial use. Key crystal growth and device fabrication issues that limit the performance and capability of high-temperature and/or high-power SiC electronics are identified. The electrical and material quality differences between emerging SiC and mature silicon electronics technology are highlighted.

  17. Silicon Carbide Technology

    NASA Technical Reports Server (NTRS)

    Neudeck, Philip G.

    2006-01-01

    Silicon carbide based semiconductor electronic devices and circuits are presently being developed for use in high-temperature, high-power, and high-radiation conditions under which conventional semiconductors cannot adequately perform. Silicon carbide's ability to function under such extreme conditions is expected to enable significant improvements to a far-ranging variety of applications and systems. These range from greatly improved high-voltage switching for energy savings in public electric power distribution and electric motor drives to more powerful microwave electronics for radar and communications to sensors and controls for cleaner-burning more fuel-efficient jet aircraft and automobile engines. In the particular area of power devices, theoretical appraisals have indicated that SiC power MOSFET's and diode rectifiers would operate over higher voltage and temperature ranges, have superior switching characteristics, and yet have die sizes nearly 20 times smaller than correspondingly rated silicon-based devices [8]. However, these tremendous theoretical advantages have yet to be widely realized in commercially available SiC devices, primarily owing to the fact that SiC's relatively immature crystal growth and device fabrication technologies are not yet sufficiently developed to the degree required for reliable incorporation into most electronic systems. This chapter briefly surveys the SiC semiconductor electronics technology. In particular, the differences (both good and bad) between SiC electronics technology and the well-known silicon VLSI technology are highlighted. Projected performance benefits of SiC electronics are highlighted for several large-scale applications. Key crystal growth and device-fabrication issues that presently limit the performance and capability of high-temperature and high-power SiC electronics are identified.

  18. Investigation of the agglomeration and amorphous transformation effects of neutron irradiation on the nanocrystalline silicon carbide (3C-SiC) using TEM and SEM methods

    NASA Astrophysics Data System (ADS)

    Huseynov, Elchin M.

    2017-04-01

    Nanocrystalline 3C-SiC particles irradiated by neutron flux during 20 h in TRIGA Mark II light water pool type research reactor. Silicon carbide nanoparticles were analyzed by Scanning Electron Microscope (SEM) and Transmission Electron Microscopy (TEM) devices before and after neutron irradiation. The agglomeration of nanoparticles was studied comparatively before and after neutron irradiation. After neutron irradiation the amorphous layer surrounding the nanoparticles was analyzed in TEM device. Neutron irradiation defects in the 3C-SiC nanoparticles and other effects investigated by TEM device. The effect of irradiation on the crystal structure of the nanomaterial was studied by selected area electron diffraction (SAED) and electron diffraction patterns (EDP) analysis.

  19. Hydrogen-silicon carbide interactions

    NASA Technical Reports Server (NTRS)

    Eckel, Andrew J.; Jacobson, Nathan S.; Misra, Ajay K.; Humphrey, Donald L.

    1989-01-01

    A study of the thermochemistry and kinetics of hydrogen environmental attack of silicon carbide was conducted for temperatures in the range from 1100 C to 1400 C. Thermodynamic maps based on the parameters of pressure and oxygen/moisture content were constructed. With increasing moisture levels, four distinct regions of attack were identified. Each region is defined by the thermodynamically stable solid phases. The theoretically stable solid phases of Region 1 are silicon carbide and silicon. Experimental evidence is provided to support this thermodynamic prediction. Silicon carbide is the single stable solid phase in Region 2. Active attack of the silicon carbide in this region occurs by the formation of gases of SiO, CO, CH4, SiH4, and SiH. Analysis of the kinetics of reaction for Region 2 at 1300 C show the attack of the silicon carbide to be controlled by gas phase diffusion of H2O to the sample. Silicon carbide and silica are the stable phases common to Regions 3 and 4. These two regions are characterized by the passive oxidation of silicon carbide and formation of a protective silica layer.

  20. Hydrogen-silicon carbide interactions

    NASA Technical Reports Server (NTRS)

    Eckel, Andrew J.; Misra, Ajay K.; Humphrey, Donald L.; Jacobson, Nathan S.

    1990-01-01

    A study of the thermochemistry and kinetics of hydrogen environmental attack of silicon carbide was conducted for temperatures in the range from 1100 C to 1400 C. Thermodynamics maps based on the parameters of pressure and oxygen/moisture content were constructed. With increasing moisture levels, four distinct regions of attack were identified. Each region is defined by the thermodynamically stable solid phases. The theoretically stable solid phases of region 1 are silicon carbide and silicon. Experimental evidence is provided to support this thermodynamic prediction. Silicone carbide is the single stable solid phase in region 2. Active attack of the silicon carbide in this region occurs by the formation of gases of SiO, CO, CH4, SiH4 and SiH. Analyses of the kinetics of reaction for region 2 at 1300 C show the attack of the silicon carbide to be controlled by gas phase diffusion of H2O to the sample. Silicon carbide and silica are the stable phases common to regions 3 and 4. These two regions are characterized by the passive oxidation of silicon carbide and formation of a protective silica layer.

  1. PREPARATION AND PURIFICATION OF SILICON CARBIDE.

    DTIC Science & Technology

    the materials were divided into two parts. Part I covers problems of silicon carbide preparation and the growing of silicon carbide single crystals...and thin films for semiconductor devices. Part II treats problems of purity, including the purification and chemical analysis of silicon carbide and of starting materials for silicon carbide preparation.

  2. Extended x-ray-absorption and electron-energy-loss fine-structure studies of the local atomic structure of amorphous unhydrogenated and hydrogenated silicon carbide

    NASA Astrophysics Data System (ADS)

    Kaloyeros, Alain E.; Rizk, Richard B.; Woodhouse, John B.

    1988-12-01

    Extended x-ray-absorption (EXAFS) and electron-energy-loss fine-structure (EXELFS) measurements have been performed on amorphous unhydrogenated silicon carbide, a-SiC, and amorphous hydrogenated silicon carbide, a-SiC:H. Two hydrogenated samples with hydrogen concentrations corresponding, respectively, to H flows of 4 sccm (20% of argon flow) and 8 sccm (40% of argon flow) during the reactive sputtering process, were analyzed (sccm denotes standard cubic centimeters per minute at STP). It is found that short-range order (SRO), consisting of the same tetrahedrally coordinated units present in cubic crystalline c-SiC (zinc-blende structure), where a Si atom is surrounded by nearly four C atoms and vice versa, does exist in all the amorphous samples. This SRO, however, is detected only at a level of the first C and Si coordination shells in a-SiC and a-SiC:H. The structural disorder of the first Si and C coordination shells in all forms of amorphous SiC is somewhat greater than c-SiC, and it decreases appreciably as hydrogen is added. The a-SiC sample exhibits large Si and C coordination numbers, almost identical to c-SiC, a low atomic density, and virtually the same Si-C bond length as c-SiC. These results indicate that a relatively small concentration of large voids exist in a highly disordered a-SiC matrix. The a-SiC:H samples, on the other hand, exhibit a decrease in the C coordination number relative to a-SiC, which is independent of H concentration, low Si and C atomic densities, comparable to a-SiC, and virtually the same Si coordination number as a-SiC. These EXAFS-EXELFS results are consistent with a model where part of the H is substituting for Si in the local tetrahedra surrounding C atoms, while the rest is located inside internal voids in the a-SiC:H samples. The surface of the voids is composed of C atoms which have at least one bond to H, and of Si atoms. Finally, a straightforward computational procedure is applied to estimate the size of these voids

  3. The growth of cubic silicon carbide on a compliant substrate

    NASA Technical Reports Server (NTRS)

    Mitchell, Sharanda; Soward, Ida

    1995-01-01

    Research has shown that silicon carbide grown on silicon and 6H silicon carbide has problems associated with these substrates. This is because silicon and silicon carbide has a 20% lattice mismatch and cubic silicon carbide has not been successfully achieved on 6H silicon carbide. We are investigating the growth of silicon carbide on a compliant substrate in order to grow defect free silicon carbide. This compliant substrate consists of silicon/silicon dioxide with 1200 A of single crystal silicon on the top layer. We are using this compliant substrate because there is a possibility that the silicon dioxide layer and the carbonized layer will allow the silicon lattice to shrink or expand to match the lattice of the silicon carbide. This would improve the electrical properties of the film for the use of device fabrication. When trying to grow silicon carbide, we observed amorphous film. To investigate, we examined the process step by step using RHEED. RHEED data showed that each step was amorphous. We found that just by heating the substrate in the presence of hydrogen it changed the crystal structure. When heated to 1000 C for 2 minutes, RHEED showed that there was an amorphous layer on the surface. We also heated the substrate to 900 C for 2 minutes and RHEED data showed that there was a deterioration of the single crystalline structure. We assumed that the presence of oxygen was coming from the sides of the silicon dioxide layer. Therefore, we evaporated 2500 A of silicon to all four edges of the wafer to try to enclose the oxygen. When heating the evaporated wafer to 900 C the RHEED data showed single crystalline structure however at 1000 C the RHEED data showed deterioration of the single crystalline structure. We conclude that the substrate itself is temperature dependent and that the oxygen was coming from the sides of the silicon dioxide layer. We propose to evaporate more silicon on the edges of the wafer to eliminate the escape of oxygen. this will allow

  4. Characterization of amorphous silicon carbide and silicon carbonitride thin films synthesized by polymer-source chemical vapor deposition. Mechanical structural and metal-interface properties

    NASA Astrophysics Data System (ADS)

    Awad, Yousef

    Amorphous silicon carbide (a-SiC) and silicon carbonitride thin films have been deposited onto a variety of substrates by Polymer-Source Chemical Vapor Deposition (PS-CVD). The interfacial interaction between the a-SiC films and several substrates including silicon, SiO2, Si3N 4, Cr, Ti and refractory metal-coated silicon has been studied. The effect of thermal annealing on the structural and mechanical properties of the prepared films has been discussed in detail. The composition and bonding states are uniquely characterized with respect to the nitrogen atomic percentage introduced into the a-SiCN:H films. Capacitance-voltage (C-V) measurements were systematically used to evaluate the impurity level of the deposited a-SiC films. The chemical bonding of the films was systematically examined by means of Fourier transform infrared spectroscopy (FTIR). In addition, elastic recoil detection (ERD) and X-ray photoelectron spectroscopy (XPS) techniques were used to determine the elemental composition of the films and of their interface with substrates, while X-ray reflectivity measurements (XRR) were used to account for the film density. Spectral deconvolution was used to extract the individual components of the FTIR and XPS spectra. Scanning electron microscopy (SEM) and atomic force microscopy (AFM) were also employed to characterize the surface morphology of the films. In addition, their mechanical properties [(hardness (H) and Young's modulus (E)] were investigated by using the nanoindentation technique. The impurity levels of the a-SiC films were found to be clearly correlated with the nature of the underlying substrates. The Pt-Rh and TiN-coated Si substrates were shown to lead to the lowest impurity level (˜ 1x10 13 cm-3) in the PS-CVD grown a-SiC films, while Cr and Ti-coated Si substrates induced much higher impurity concentrations. Such high impurity levels were shown to be a consequence of a strong metallic diffusion of the metallic species (Cr or Ti). In

  5. Amorphous silicon photovoltaic devices

    DOEpatents

    Carlson, David E.; Lin, Guang H.; Ganguly, Gautam

    2004-08-31

    This invention is a photovoltaic device comprising an intrinsic or i-layer of amorphous silicon and where the photovoltaic device is more efficient at converting light energy to electric energy at high operating temperatures than at low operating temperatures. The photovoltaic devices of this invention are suitable for use in high temperature operating environments.

  6. Utilization of amorphous silicon carbide (a-Si:C:H) as a resistive layer in gas microstrip detectors

    SciTech Connect

    Hong, W.S.; Cho, H.S.; Perez-Mendez, V.; Gong, W.G.

    1995-04-01

    Thin semiconducting films of hydrogenated amorphous silicon (a-Si:H) and its carbon alloy (a-Si:C:H) were applied to gas microstrip detectors in order to control gain instabilities due to charges on the substrate. Thin ({approximately}100nm) layers of a-Si:H or p-doped a-Si:C:H were placed either over or under the electrodes using the plasma enhanced chemical vapor deposition (PECVD) technique to provide the substrate with a suitable surface conductivity. By changing the carbon content and boron doping density, the sheet resistance of the a-Si:C:H coating could be successfully controlled in the range of 10{sup 12} {approximately} 10{sup 17} {Omega}/{four_gradient}, and the light sensitivity, which causes the resistivity to vary with ambient light conditions, was minimized. An avalanche gain of 5000 and energy resolution of 20% FWHM were achieved and the gain remained constant over a week of operation. A-Si:C:H film is an attractive alternative to ion-implanted or semiconducting glass due to the wide range of resistivities possible and the feasibility of making deposits over a large area at low cost.

  7. Silicon carbide photoconductive switches

    NASA Astrophysics Data System (ADS)

    Saddow, Stephen E.

    1994-09-01

    The optoelectronic properties of p-type 6-H silicon carbide (6H-SiC) have been investigated in an experiment that used lateral and vertical photoconductive (PC) switches. Both photovoltaic and photoconductive effects are reported, which were observed on switches using both geometries and measured at several wavelengths near the 6H-SiC absorption edge. PC techniques were employed to measure the surface and bulk carrier lifetimes of 40 and 200 ns, respectively. The switches displayed a high-speed photovoltaic response to picosecond laser excitations in the UV and visible spectral regions. In particular, efficient subnanosecond optical absorption processes were observed in the visible region. The photovoltage was measured as a function of both laser wavelength (and hence absorption depth) and laser beam position within the switching gap. The switch response to picosecond laser pulses in the UV, violet, green, and red spectral regions was shown to have subnanosecond photovoltaic response times. Finally, since the optical absorption coefficient had not been well established for device-grade 6H-SiC, the optical absorption coefficient near the 6H-SiC bandgap energy (Eg) was also measured, and the bandgap was determined to be approximately 3.1 eV.

  8. Silicon Carbide Growth

    NASA Technical Reports Server (NTRS)

    2005-01-01

    Andrew Trunek has focused on supporting the Sic team through the growth of Sic crystals, making observations and conducting research that meets the collective needs and requirements of the team while fulfilling program commitments. Cancellation of the Ultra Efficient Engine Technology (UEET) program has had a significant negative impact on resources and research goals. This report highlights advancements and achievements made with this cooperative agreement over the past year. NASA Glenn Research Center (GRC) continues to make advances in silicon carbide (SiC) research during the past year. Step free surfaces were used as substrates for the deposition of GaN epilayers that yielded very low dislocation densities. Defect free 3C- SiC was successfully nucleated on step free mesas and test diodes were fabricated. Web growth techniques were used to increase the usable surface area of dislocation free SiC by approximately equal to 40%. The greatest advancement has been attained on stepped surfaces of SiC. A metrology standard was developed using high temperature etching techniques titled "Nanometer Step Height Standard". This development culminated in being recognized for a 2004 R&D100 award and the process to produce the steps received a NASA Space Act award.

  9. Palladium interaction with silicon carbide

    NASA Astrophysics Data System (ADS)

    Gentile, M.; Xiao, P.; Abram, T.

    2015-07-01

    In this work the palladium interaction with silicon carbide is investigated by means of complementary analytical techniques such as thermogravimetry (TG), differential scanning calorimetry (DSC), X-ray diffraction (XRD) and X-ray photoelectron spectroscopy (XPS). Thermoscans were carried out on pellets of palladium, α-SiC and β-SiC high purity powders in the temperature range comprised between 293 K and 1773 K, in order to study the effect of temperature on the palladium-silicon carbide reaction. Thermoscans of α-SiC pellets containing 5 at.%Pd show that during differential calorimetry scans three exothermic peaks occurred at 773 K, 1144 K and 1615 K, while thermoscans of β-SiC pellets containing 3 at.%Pd and 5 at.%Pd do not show peaks. For the pellet α-SiC-5 at.%Pd XRD spectra reveal that the first peak is associated with the formation of Pd3Si and SiO2 phases, while the second peak and the third peak are correlated with the formation of Pd2Si phase and the active oxidation of silicon carbide respectively. Thermogravimetry scans show weight gain and weight loss peaks due to the SiO2 phase formation and the active oxidation. Additionally XPS fittings reveal the development of SiCxOy phase during the first exothermic peak up to the temperature of 873 K. The experimental data reveals that alpha silicon carbide is attacked by palladium at lower temperatures than beta silicon carbide and the reaction mechanism between silicon carbide and palladium is strongly affected by silicon carbide oxidation.

  10. Porous silicon carbide (SIC) semiconductor device

    NASA Technical Reports Server (NTRS)

    Shor, Joseph S. (Inventor); Kurtz, Anthony D. (Inventor)

    1996-01-01

    Porous silicon carbide is fabricated according to techniques which result in a significant portion of nanocrystallites within the material in a sub 10 nanometer regime. There is described techniques for passivating porous silicon carbide which result in the fabrication of optoelectronic devices which exhibit brighter blue luminescence and exhibit improved qualities. Based on certain of the techniques described porous silicon carbide is used as a sacrificial layer for the patterning of silicon carbide. Porous silicon carbide is then removed from the bulk substrate by oxidation and other methods. The techniques described employ a two-step process which is used to pattern bulk silicon carbide where selected areas of the wafer are then made porous and then the porous layer is subsequently removed. The process to form porous silicon carbide exhibits dopant selectivity and a two-step etching procedure is implemented for silicon carbide multilayers.

  11. A silicon carbide array for electrocorticography and peripheral nerve recording

    NASA Astrophysics Data System (ADS)

    Diaz-Botia, C. A.; Luna, L. E.; Neely, R. M.; Chamanzar, M.; Carraro, C.; Carmena, J. M.; Sabes, P. N.; Maboudian, R.; Maharbiz, M. M.

    2017-10-01

    Objective. Current neural probes have a limited device lifetime of a few years. Their common failure mode is the degradation of insulating films and/or the delamination of the conductor-insulator interfaces. We sought to develop a technology that does not suffer from such limitations and would be suitable for chronic applications with very long device lifetimes. Approach. We developed a fabrication method that integrates polycrystalline conductive silicon carbide with insulating silicon carbide. The technology employs amorphous silicon carbide as the insulator and conductive silicon carbide at the recording sites, resulting in a seamless transition between doped and amorphous regions of the same material, eliminating heterogeneous interfaces prone to delamination. Silicon carbide has outstanding chemical stability, is biocompatible, is an excellent molecular barrier and is compatible with standard microfabrication processes. Main results. We have fabricated silicon carbide electrode arrays using our novel fabrication method. We conducted in vivo experiments in which electrocorticography recordings from the primary visual cortex of a rat were obtained and were of similar quality to those of polymer based electrocorticography arrays. The silicon carbide electrode arrays were also used as a cuff electrode wrapped around the sciatic nerve of a rat to record the nerve response to electrical stimulation. Finally, we demonstrated the outstanding long term stability of our insulating silicon carbide films through accelerated aging tests. Significance. Clinical translation in neural engineering has been slowed in part due to the poor long term performance of current probes. Silicon carbide devices are a promising technology that may accelerate this transition by enabling truly chronic applications.

  12. 500 C SILICON CARBIDE RECTIFIER PROGRAM.

    DTIC Science & Technology

    Efforts were continued on the development of 500 degree C silicon carbide rectifiers. The growth rate of silicon carbide crystals prepared by the...as obtained from a simple model. All values agree within a factor of five. The use of molten borax as an etchant for silicon carbide was studies...is possible. Details are given on the life and storage tests which were successfully passed by two silicon carbide rectifiers. An open tube-flowing

  13. Amorphous silicon radiation detectors

    DOEpatents

    Street, Robert A.; Perez-Mendez, Victor; Kaplan, Selig N.

    1992-01-01

    Hydrogenated amorphous silicon radiation detector devices having enhanced signal are disclosed. Specifically provided are transversely oriented electrode layers and layered detector configurations of amorphous silicon, the structure of which allow high electric fields upon application of a bias thereby beneficially resulting in a reduction in noise from contact injection and an increase in signal including avalanche multiplication and gain of the signal produced by incoming high energy radiation. These enhanced radiation sensitive devices can be used as measuring and detection means for visible light, low energy photons and high energy ionizing particles such as electrons, x-rays, alpha particles, beta particles and gamma radiation. Particular utility of the device is disclosed for precision powder crystallography and biological identification.

  14. Amorphous silicon radiation detectors

    DOEpatents

    Street, R.A.; Perez-Mendez, V.; Kaplan, S.N.

    1992-11-17

    Hydrogenated amorphous silicon radiation detector devices having enhanced signal are disclosed. Specifically provided are transversely oriented electrode layers and layered detector configurations of amorphous silicon, the structure of which allow high electric fields upon application of a bias thereby beneficially resulting in a reduction in noise from contact injection and an increase in signal including avalanche multiplication and gain of the signal produced by incoming high energy radiation. These enhanced radiation sensitive devices can be used as measuring and detection means for visible light, low energy photons and high energy ionizing particles such as electrons, x-rays, alpha particles, beta particles and gamma radiation. Particular utility of the device is disclosed for precision powder crystallography and biological identification. 13 figs.

  15. Silicon Carbide Semiconductor Device Fabrication and Characterization

    DTIC Science & Technology

    1990-02-08

    SPACE ADMINISTRATION For Grant NAG 3-782 S- 1 entitled SILICON CARBIDE SEMICONDUCTOR DEVICE FABRICATION AND CHARACTERIZATION For the Period 10 February...NUMBERS Silicon Carbide ..Semiconductor Device Fabrication and PR# 335820 Characterization __________________________________________________ APP# 505-62-01...also been demonstrated. _________ 14. SUBJECT TERMS 15. NuMBER OF PACiES -~- Silicon carbide , Ysemiconductor devices, ion implantation aseeI4i

  16. Method of Fabricating Silicon Carbide Articles.

    DTIC Science & Technology

    The patent relates to a method for fabricating silicon carbide articles which comprises hot pressing a homogeneous mixture of carbonaceous particles...and silicon carbide powder. The presence of the carbon limits grain growth so that a silicon carbide product having greatly improved physical

  17. Diamond-Silicon Carbide Composite And Method For Preparation Thereof

    DOEpatents

    Qian, Jiang; Zhao, Yusheng

    2005-09-06

    Fully dense, diamond-silicon carbide composites are prepared from ball-milled microcrystalline diamond/amorphous silicon powder mixture. The ball-milled powder is sintered (P=5-8 GPa, T=1400K-2300K) to form composites having high fracture toughness. A composite made at 5 GPa/1673K had a measured fracture toughness of 12 MPa.multidot.m.sup.1/2. By contrast, liquid infiltration of silicon into diamond powder at 5 GPa/1673K produces a composite with higher hardness but lower fracture toughness. X-ray diffraction patterns and Raman spectra indicate that amorphous silicon is partially transformed into nanocrystalline silicon at 5 GPa/873K, and nanocrystalline silicon carbide forms at higher temperatures.

  18. Anisotropic Tribological Properties of Silicon Carbide

    NASA Technical Reports Server (NTRS)

    Miyoshi, K.; Buckley, D. H.

    1980-01-01

    The anisotropic friction, deformation and fracture behavior of single crystal silicon carbide surfaces were investigated in two categories. The categories were called adhesive and abrasive wear processes, respectively. In the adhesive wear process, the adhesion, friction and wear of silicon carbide were markedly dependent on crystallographic orientation. The force to reestablish the shearing fracture of adhesive bond at the interface between silicon carbide and metal was the lowest in the preferred orientation of silicon carbide slip system. The fracturing of silicon carbide occurred near the adhesive bond to metal and it was due to primary cleavages of both prismatic (10(-1)0) and basal (0001) planes.

  19. Hydrogenated amorphous silicon photonics

    NASA Astrophysics Data System (ADS)

    Narayanan, Karthik

    2011-12-01

    Silicon Photonics is quickly proving to be a suitable interconnect technology for meeting the future goals of on-chip bandwidth and low power requirements. However, it is not clear how silicon photonics will be integrated into CMOS chips, particularly microprocessors. The issue of integrating photonic circuits into electronic IC fabrication processes to achieve maximum flexibility and minimum complexity and cost is an important one. In order to minimize usage of chip real estate, it will be advantageous to integrate in three-dimensions. Hydrogenated amorphous silicon (a-Si:H) is emerging as a promising material for the 3-D integration of silicon photonics for on-chip optical interconnects. In addition, a-Si:H film can be deposited using CMOS compatible low temperature plasma-enhanced chemical vapor deposition (PECVD) process at any point in the fabrication process allowing maximum flexibility and minimal complexity. In this thesis, we demonstrate a-Si:H as a high performance alternate platform to crystalline silicon, enabling backend integration of optical interconnects in a hybrid photonic-electronic network-on-chip architecture. High quality passive devices are fabricated on a low-loss a-Si:H platform enabling wavelength division multiplexing schemes. We demonstrate a broadband all-optical modulation scheme based on free-carrier absorption effect, which can enable compact electro-optic modulators in a-Si:H. Furthermore, we comprehensively characterize the optical nonlinearities in a-Si:H and observe that a-Si:H exhibits enhanced nonlinearities as compared to crystalline silicon. Based on the enhanced nonlinearities, we demonstrate low-power four-wave mixing in a-Si:H waveguides enabling high speed all-optical devices in an a-Si:H platform. Finally, we demonstrate a novel data encoding scheme using thermal and all-optical tuning of silicon waveguides, increasing the spectral efficiency in an interconnect link.

  20. Hydrogenated Amorphous Silicon

    NASA Astrophysics Data System (ADS)

    Street, R. A.

    1991-08-01

    Divided roughly into two parts, the book describes the physical properties and device applications of hydrogenated amorphous silicon. The first section is concerned with the atomic and electronic structure, and covers growth defects and doping and defect reactions. The emphasis is on the optical and electronic properties that result from the disordered structure. The second part of the book describes electronic conduction, recombination, interfaces, and multilayers. The special attribute of a-Si:H which makes it useful is the ability to deposit the material inexpensively over large areas, while retaining good semiconducting properties, and the final chapter discusses various applications and devices.

  1. Investigation of amorphization energies for heavy ion implants into silicon carbide at depths far beyond the projected ranges

    NASA Astrophysics Data System (ADS)

    Friedland, E.

    2017-01-01

    At ion energies with inelastic stopping powers less than a few keV/nm, radiation damage is thought to be due to atomic displacements by elastic collisions only. However, it is well known that inelastic processes and non-linear effects due to defect interaction within collision cascades can significantly increase or decrease damage efficiencies. The importance of these processes changes significantly along the ion trajectory and becomes negligible at some distance beyond the projected range, where damage is mainly caused by slowly moving secondary recoils. Hence, in this region amorphization energies should become independent of the ion type and only reflect the properties of the target lattice. To investigate this, damage profiles were obtained from α-particle channeling spectra of 6H-SiC wafers implanted at room temperature with ions in the mass range 84 ⩽ M ⩽ 133, employing the computer code DICADA. An average amorphization dose of (0.7 ± 0.2) dpa and critical damage energy of (17 ± 6) eV/atom are obtained from TRIM simulations at the experimentally observed boundary positions of the amorphous zones.

  2. A comparison of mechanical properties of three MEMS materials - silicon carbide, ultrananocrystalline diamond, and hydrogen-free tetrahedral amorphous carbon (Ta-C)

    SciTech Connect

    Carlisle, John A.; Moldovan, N.; Xiao, Xingcheng; Zorman, C. A.; Mancini, D. C.; Peng, B.; Espinosa, H. D.; Friedmann, Thomas Aquinas; Auciello, Orlando,

    2004-06-01

    Many MEMS devices are based on polysilicon because of the current availability of surface micromachining technology. However, polysilicon is not the best choice for devices where extensive sliding and/or thermal fields are applied due to its chemical, mechanical and tribological properties. In this work, we investigated the mechanical properties of three new materials for MEMS/NEMS devices: silicon carbide (SiC) from Case Western Reserve University (CWRU), ultrananocrystalline diamond (UNCD) from Argonne National Laboratory (ANL), and hydrogen-free tetrahedral amorphous carbon (ta-C) from Sandia National Laboratories (SNL). Young's modulus, characteristic strength, fracture toughness, and theoretical strength were measured for these three materials using only one testing methodology - the Membrane Deflection Experiment (MDE) developed at Northwestern University. The measured values of Young's modulus were 430GPa, 960GPa, and 800GPa for SiC, UNCD, and ta-C, repectively. Fracture toughness measurments resulted in values of 3.2, 4.5, and 6.2 MPa x m{sup 1/2}, respectively. The strengths were found to follow a Weibull distribution but their scaling was found to be controlled by different specimen size parameters. Therefore, a cross comparison of the strengths is not fully meaningful. We instead propose to compare their theoretical strengths as determined by employing Novozhilov fracture criterion. The estimated theoretical strength for SiC is 10.6GPa at a characteristic length of 58nm, for UNCD is 18.6GPa at a characteristic length of 37nm, and for ta-C is 25.4GPa at a characteristic length of 38nm. The techniques used to obtained these results as well as microscopic fractographic analyses are summarized in the article. We also highlight the importance of characterizing mechanical properties of MEMS materials by means of only one simple and accurate experimental technique.

  3. Compensated amorphous silicon solar cell

    DOEpatents

    Carlson, David E.

    1980-01-01

    An amorphous silicon solar cell incorporates a region of intrinsic hydrogenated amorphous silicon fabricated by a glow discharge wherein said intrinsic region is compensated by P-type dopants in an amount sufficient to reduce the space charge density of said region under illumination to about zero.

  4. Amorphous silicon ionizing particle detectors

    DOEpatents

    Street, Robert A.; Mendez, Victor P.; Kaplan, Selig N.

    1988-01-01

    Amorphous silicon ionizing particle detectors having a hydrogenated amorphous silicon (a--Si:H) thin film deposited via plasma assisted chemical vapor deposition techniques are utilized to detect the presence, position and counting of high energy ionizing particles, such as electrons, x-rays, alpha particles, beta particles and gamma radiation.

  5. Amorphous silicon ionizing particle detectors

    DOEpatents

    Street, R.A.; Mendez, V.P.; Kaplan, S.N.

    1988-11-15

    Amorphous silicon ionizing particle detectors having a hydrogenated amorphous silicon (a--Si:H) thin film deposited via plasma assisted chemical vapor deposition techniques are utilized to detect the presence, position and counting of high energy ionizing particles, such as electrons, x-rays, alpha particles, beta particles and gamma radiation. 15 figs.

  6. Ultrasonic characterization of microwave joined silicon carbide/silicon carbide

    SciTech Connect

    House, M.B.; Day, P.S.

    1997-05-01

    High frequency (50--150 MHz), ultrasonic immersion testing has been used to characterize the surface and interfacial joint conditions of microwave bonded, monolithic silicon carbide (SiC) materials. The high resolution ultrasonic C-scan images point to damage accumulation after thermal cycling. Image processing was used to study the effects of the thermal cycling on waveform shape, amplitude and distribution. Such information is useful for concurrently engineering material fabrication processes and suitable nondestructive test procedures.

  7. Silicon carbide semiconductor technology for high temperature and radiation environments

    NASA Technical Reports Server (NTRS)

    Matus, Lawrence G.

    1993-01-01

    Viewgraphs on silicon carbide semiconductor technology and its potential for enabling electronic devices to function in high temperature and high radiation environments are presented. Topics covered include silicon carbide; sublimation growth of 6H-SiC boules; SiC chemical vapor deposition reaction system; 6H silicon carbide p-n junction diode; silicon carbide MOSFET; and silicon carbide JFET radiation response.

  8. Compensated amorphous silicon solar cell

    DOEpatents

    Devaud, Genevieve

    1983-01-01

    An amorphous silicon solar cell including an electrically conductive substrate, a layer of glow discharge deposited hydrogenated amorphous silicon over said substrate and having regions of differing conductivity with at least one region of intrinsic hydrogenated amorphous silicon. The layer of hydrogenated amorphous silicon has opposed first and second major surfaces where the first major surface contacts the electrically conductive substrate and an electrode for electrically contacting the second major surface. The intrinsic hydrogenated amorphous silicon region is deposited in a glow discharge with an atmosphere which includes not less than about 0.02 atom percent mono-atomic boron. An improved N.I.P. solar cell is disclosed using a BF.sub.3 doped intrinsic layer.

  9. Silicon carbide fibers and articles including same

    DOEpatents

    Garnier, John E; Griffith, George W

    2015-01-27

    Methods of producing silicon carbide fibers. The method comprises reacting a continuous carbon fiber material and a silicon-containing gas in a reaction chamber at a temperature ranging from approximately 1500.degree. C. to approximately 2000.degree. C. A partial pressure of oxygen in the reaction chamber is maintained at less than approximately 1.01.times.10.sup.2 Pascal to produce continuous alpha silicon carbide fibers. Continuous alpha silicon carbide fibers and articles formed from the continuous alpha silicon carbide fibers are also disclosed.

  10. Methods for producing silicon carbide fibers

    DOEpatents

    Garnier, John E.; Griffith, George W.

    2016-03-01

    Methods of producing silicon carbide fibers. The method comprises reacting a continuous carbon fiber material and a silicon-containing gas in a reaction chamber at a temperature ranging from approximately 1500.degree. C. to approximately 2000.degree. C. A partial pressure of oxygen in the reaction chamber is maintained at less than approximately 1.01.times.10.sup.2 Pascal to produce continuous alpha silicon carbide fibers. Continuous alpha silicon carbide fibers and articles formed from the continuous alpha silicon carbide fibers are also disclosed.

  11. Microwave processing of silicon carbide

    SciTech Connect

    Akerman, M.A.; Baity, F.W. Jr.; Caughman, J.B.; Forrester, S.C.; Kass, M.D.; Morrow, M.S.; Holcombe, C.E. Jr.; Moyer, M.W.; Dews, T.W.

    1994-12-31

    Reaction-bonded silicon carbide ({alpha}-SiC) armor tiles were annealed at 2100{degree}C using microwave radiation at 2.45 GHz. Ultrasonic velocity measurements showed that the longitudinal and shear velocities, acoustic impedances, and acoustic moduli of the post-annealed tiles were statistically higher than for the unannealed tiles. However, the exposed surfaces of the annealed tiles experienced slight degradation, which was attributed to the high annealing temperatures.

  12. Pulsed energy synthesis and doping of silicon carbide

    DOEpatents

    Truher, J.B.; Kaschmitter, J.L.; Thompson, J.B.; Sigmon, T.W.

    1995-06-20

    A method for producing beta silicon carbide thin films by co-depositing thin films of amorphous silicon and carbon onto a substrate is disclosed, whereafter the films are irradiated by exposure to a pulsed energy source (e.g. excimer laser) to cause formation of the beta-SiC compound. Doped beta-SiC may be produced by introducing dopant gases during irradiation. Single layers up to a thickness of 0.5-1 micron have been produced, with thicker layers being produced by multiple processing steps. Since the electron transport properties of beta silicon carbide over a wide temperature range of 27--730 C is better than these properties of alpha silicon carbide, they have wide application, such as in high temperature semiconductors, including HETEROJUNCTION-junction bipolar transistors and power devices, as well as in high bandgap solar arrays, ultra-hard coatings, light emitting diodes, sensors, etc.

  13. Pulsed energy synthesis and doping of silicon carbide

    DOEpatents

    Truher, Joel B.; Kaschmitter, James L.; Thompson, Jesse B.; Sigmon, Thomas W.

    1995-01-01

    A method for producing beta silicon carbide thin films by co-depositing thin films of amorphous silicon and carbon onto a substrate, whereafter the films are irradiated by exposure to a pulsed energy source (e.g. excimer laser) to cause formation of the beta-SiC compound. Doped beta-SiC may be produced by introducing dopant gases during irradiation. Single layers up to a thickness of 0.5-1 micron have been produced, with thicker layers being produced by multiple processing steps. Since the electron transport properties of beta silicon carbide over a wide temperature range of 27.degree.-730.degree. C. is better than these properties of alpha silicon carbide, they have wide application, such as in high temperature semiconductors, including hetero-junction bipolar transistors and power devices, as well as in high bandgap solar arrays, ultra-hard coatings, light emitting diodes, sensors, etc.

  14. Method for producing silicon nitride/silicon carbide composite

    DOEpatents

    Dunmead, Stephen D.; Weimer, Alan W.; Carroll, Daniel F.; Eisman, Glenn A.; Cochran, Gene A.; Susnitzky, David W.; Beaman, Donald R.; Nilsen, Kevin J.

    1996-07-23

    Silicon carbide/silicon nitride composites are prepared by carbothermal reduction of crystalline silica powder, carbon powder and optionally crsytalline silicon nitride powder. The crystalline silicon carbide portion of the composite has a mean number diameter less than about 700 nanometers and contains nitrogen.

  15. Process for producing amorphous and crystalline silicon nitride

    DOEpatents

    Morgan, Peter E. D.; Pugar, Eloise A.

    1985-01-01

    A process for producing amorphous or crystalline silicon nitride is disclosed which comprises reacting silicon disulfide ammonia gas at elevated temperature. In a preferred embodiment silicon disulfide in the form of "whiskers" or needles is heated at temperature ranging from about 900.degree. C. to about 1200.degree. C. to produce silicon nitride which retains the whisker or needle morphological characteristics of the silicon disulfide. Silicon carbide, e.g. in the form of whiskers, also can be prepared by reacting substituted ammonia, e.g. methylamine, or a hydrocarbon containing active hydrogen-containing groups, such as ethylene, with silicon disulfide, at elevated temperature, e.g. 900.degree. C.

  16. Process for producing amorphous and crystalline silicon nitride

    DOEpatents

    Morgan, P.E.D.; Pugar, E.A.

    1985-11-12

    A process for producing amorphous or crystalline silicon nitride is disclosed which comprises reacting silicon disulfide ammonia gas at elevated temperature. In a preferred embodiment silicon disulfide in the form of whiskers'' or needles is heated at temperature ranging from about 900 C to about 1,200 C to produce silicon nitride which retains the whisker or needle morphological characteristics of the silicon disulfide. Silicon carbide, e.g. in the form of whiskers, also can be prepared by reacting substituted ammonia, e.g. methylamine, or a hydrocarbon containing active hydrogen-containing groups, such as ethylene, with silicon disulfide, at elevated temperature, e.g. 900 C. 6 figs.

  17. High-Q silicon carbide photonic-crystal cavities

    SciTech Connect

    Lee, Jonathan Y.; Lu, Xiyuan; Lin, Qiang

    2015-01-26

    We demonstrate one-dimensional photonic-crystal nanobeam cavities in amorphous silicon carbide. The fundamental mode exhibits intrinsic optical quality factor as high as 7.69 × 10{sup 4} with mode volume ∼0.60(λ/n){sup 3} at wavelength 1.5 μm. A corresponding Purcell factor value of ∼10{sup 4} is the highest reported to date in silicon carbide optical cavities. The device exhibits great potential for integrated nonlinear photonics and cavity nano-optomechanics.

  18. Silicon Carbide Nanotube Synthesized

    NASA Technical Reports Server (NTRS)

    Lienhard, Michael A.; Larkin, David J.

    2003-01-01

    Carbon nanotubes (CNTs) have generated a great deal of scientific and commercial interest because of the countless envisioned applications that stem from their extraordinary materials properties. Included among these properties are high mechanical strength (tensile and modulus), high thermal conductivity, and electrical properties that make different forms of single-walled CNTs either conducting or semiconducting, and therefore, suitable for making ultraminiature, high-performance CNT-based electronics, sensors, and actuators. Among the limitations for CNTs is their inability to survive in high-temperature, harsh-environment applications. Silicon carbon nanotubes (SiCNTs) are being developed for their superior material properties under such conditions. For example, SiC is stable in regards to oxidation in air to temperatures exceeding 1000 C, whereas carbon-based materials are limited to 600 C. The high-temperature stability of SiCNTs is envisioned to enable high-temperature, harsh-environment nanofiber- and nanotube-reinforced ceramics. In addition, single-crystal SiC-based semiconductors are being developed for hightemperature, high-power electronics, and by analogy to CNTs with silicon semiconductors, SiCNTs with single-crystal SiC-based semiconductors may allow high-temperature harsh-environment nanoelectronics, nanosensors, and nanoactuators to be realized. Another challenge in CNT development is the difficulty of chemically modifying the tube walls, which are composed of chemically stable graphene sheets. The chemical substitution of the CNTs walls will be necessary for nanotube self-assembly and biological- and chemical-sensing applications. SiCNTs are expected to have a different multiple-bilayer wall structure, allowing the surface Si atoms to be functionalized readily with molecules that will allow SiCNTs to undergo self-assembly and be compatible with a variety of materials (for biotechnology applications and high-performance fiber-reinforced ceramics).

  19. A study of silicon carbide synthesis from waste serpentine.

    PubMed

    Cheng, T W; Hsu, C W

    2006-06-01

    There are 60000 tons of serpentine wastes produced in year 2004 in Taiwan. This is due to the well-developed joints in the serpentine ore body as well as the stringent requirements of the particle size and chemical composition of serpentine by iron making company. The waste also creates considerable environmental problems. The purpose of this study is reutilization of waste serpentine to produce a high value silica powder after acid leaching. These siliceous microstructure products obtained from serpentine would be responsible for high reactivity and characteristic molecular sieving effect. In this study, the amorphous silica powder was then synthesized to silicon carbide with the C/SiO(2) molar ratio of 3. The experiment results show that silicon carbide can be synthesized in 1550 degrees C. The formed silicon carbide was whisker beta type SiC which can be used as raw materials for industry.

  20. Computer-assisted infrared spectra interpretation for amorphous silicon alloys

    NASA Astrophysics Data System (ADS)

    Kavak, Hamide; Esen, Ramazan

    2005-12-01

    A computer program for the structural interpretation of the infrared (IR) spectra is developed and tested. The interpretation of the IR spectra is made by using an hybrid system which includes library search and rule-based interpretation methods together. The computer programs were written in Pascal Codes. The prototype IR library of silicon alloys includes amorphous silicon (a-Si), amorphous silicon dioxide (a-SiOx), amorphous silicon nitride (a-Si3N4) and amorphous silicon carbide (a-SiC) references. The known spectra of these compounds were fed into the system as an unknown samples. The performance of the developed program was evaluated on a test set of 157 spectra and the percentages of successful identification ranged between 78% and 99% for different alloys.

  1. 500 C SILICON CARBIDE RECTIFIER PROGRAM

    DTIC Science & Technology

    Silicon carbide crystals of the hexagonal type were grown in a Kroll-type furnace by the sublimation technique. Both homogeneous and grown junction...feasibility of vapor-phase chemical reaction methods was investigated for the controlled growth of silicon carbide platelets and sheets. The growth of

  2. Process for making silicon carbide reinforced silicon carbide composite

    NASA Technical Reports Server (NTRS)

    Lau, Sai-Kwing (Inventor); Calandra, Salavatore J. (Inventor); Ohnsorg, Roger W. (Inventor)

    1998-01-01

    A process comprising the steps of: a) providing a fiber preform comprising a non-oxide ceramic fiber with at least one coating, the coating comprising a coating element selected from the group consisting of carbon, nitrogen, aluminum and titanium, and the fiber having a degradation temperature of between 1400.degree. C. and 1450.degree. C., b) impregnating the preform with a slurry comprising silicon carbide particles and between 0.1 wt % and 3 wt % added carbon c) providing a cover mix comprising: i) an alloy comprising a metallic infiltrant and the coating element, and ii) a resin, d) placing the cover mix on at least a portion of the surface of the porous silicon carbide body, e) heating the cover mix to a temperature between 1410.degree. C. and 1450.degree. C. to melt the alloy, and f) infiltrating the fiber preform with the melted alloy for a time period of between 15 minutes and 240 minutes, to produce a ceramic fiber reinforced ceramic composite.

  3. Preparation of silicon carbide fibers

    DOEpatents

    Wei, G.C.

    1983-10-12

    Silicon carbide fibers suitable for use in the fabrication of dense, high-strength, high-toughness SiC composites or as thermal insulating materials in oxidizing environments are fabricated by a new, simplified method wherein a mixture of short-length rayon fibers and colloidal silica is homogenized in a water slurry. Water is removed from the mixture by drying in air at 120/sup 0/C and the fibers are carbonized by (pyrolysis) heating the mixture to 800 to 1000/sup 0/C in argon. The mixture is subsequently reacted at 1550 to 1900/sup 0/C in argon to yield pure ..beta..-SiC fibers.

  4. Damage kinetics in silicon carbide

    NASA Astrophysics Data System (ADS)

    Pickup, I. M.; Barker, A. K.

    1998-07-01

    Three silicon carbides of similar density and grain size but manufactured via different routes (reaction bonded, pressureless sintered and pressure assisted densification) have been investigated. High speed photography in conjunction with Hopkinson pressure bar compression tests has revealed that not only does the manufacturing route confer a significant difference in failure kinetics but also modifies the phenomenology of failure. Plate impact experiments using lateral and longitudinal manganin stress gauges have been used to study shear strength behaviour of damaged material. Failure waves have been observed in all three materials and characteristically different damaged material shear strength relationships with pressure have been observed.

  5. Damage kinetics in silicon carbide

    SciTech Connect

    Pickup, I. M.; Barker, A. K.

    1998-07-10

    Three silicon carbides of similar density and grain size but manufactured via different routes (reaction bonded, pressureless sintered and pressure assisted densification) have been investigated. High speed photography in conjunction with Hopkinson pressure bar compression tests has revealed that not only does the manufacturing route confer a significant difference in failure kinetics but also modifies the phenomenology of failure. Plate impact experiments using lateral and longitudinal manganin stress gauges have been used to study shear strength behaviour of damaged material. Failure waves have been observed in all three materials and characteristically different damaged material shear strength relationships with pressure have been observed.

  6. Nanocrystalline silicon/amorphous silicon dioxide superlattices

    SciTech Connect

    Fauchet, P.M.; Tsybeskov, L.; Zacharias, M. |; Hirschman, K. |

    1998-12-31

    Thin layers made of densely packed silicon nanocrystals sandwiched between amorphous silicon dioxide layers have been manufactured and characterized. An amorphous silicon/amorphous silicon dioxide superlattice is first grown by CVD or RF sputtering. The a-Si layers are recrystallized in a two-step procedure (nucleation + growth) for form layers of nearly identical nanocrystals whose diameter is given by the initial a-Si layer thickness. The recrystallization is monitored using a variety of techniques, including TEM, X-Ray, Raman, and luminescence spectroscopies. When the a-Si layer thickness decreases (from 25 nm to 2.5 nm) or the a-SiO{sub 2} layer thickness increases (from 1.5 nm to 6 nm), the recrystallization temperature increases dramatically compared to that of a single a-Si film. The removal of the a-Si tissue present between the nanocrystals, the passivation of the nanocrystals, and their doping are discussed.

  7. Colloidal characterization of ultrafine silicon carbide and silicon nitride powders

    NASA Technical Reports Server (NTRS)

    Whitman, Pamela K.; Feke, Donald L.

    1986-01-01

    The effects of various powder treatment strategies on the colloid chemistry of aqueous dispersions of silicon carbide and silicon nitride are examined using a surface titration methodology. Pretreatments are used to differentiate between the true surface chemistry of the powders and artifacts resulting from exposure history. Silicon nitride powders require more extensive pretreatment to reveal consistent surface chemistry than do silicon carbide powders. As measured by titration, the degree of proton adsorption from the suspending fluid by pretreated silicon nitride and silicon carbide powders can both be made similar to that of silica.

  8. Colloidal characterization of ultrafine silicon carbide and silicon nitride powders

    NASA Technical Reports Server (NTRS)

    Whitman, Pamela K.; Feke, Donald L.

    1986-01-01

    The effects of various powder treatment strategies on the colloid chemistry of aqueous dispersions of silicon carbide and silicon nitride are examined using a surface titration methodology. Pretreatments are used to differentiate between the true surface chemistry of the powders and artifacts resulting from exposure history. Silicon nitride powders require more extensive pretreatment to reveal consistent surface chemistry than do silicon carbide powders. As measured by titration, the degree of proton adsorption from the suspending fluid by pretreated silicon nitride and silicon carbide powders can both be made similar to that of silica.

  9. Fabrication and characterization of silicon quantum dots in Si-rich silicon carbide films.

    PubMed

    Chang, Geng-Rong; Ma, Fei; Ma, Dayan; Xu, Kewei

    2011-12-01

    Amorphous Si-rich silicon carbide films were prepared by magnetron co-sputtering and subsequently annealed at 900-1100 degrees C. After annealing at 1100 degrees C, this configuration of silicon quantum dots embedded in amorphous silicon carbide formed. X-ray photoelectron spectroscopy was used to study the chemical modulation of the films. The formation and orientation of silicon quantum dots were characterized by glancing angle X-ray diffraction, which shows that the ratio of silicon and carbon significantly influences the species of quantum dots. High-resolution transmission electron microscopy investigations directly demonstrated that the formation of silicon quantum dots is heavily dependent on the annealing temperatures and the ratio of silicon and carbide. Only the temperature of about 1100 degrees C is enough for the formation of high-density and small-size silicon quantum dots due to phase separation and thermal crystallization. Deconvolution of the first order Raman spectra shows the existence of a lower frequency peak in the range 500-505 cm(-1) corresponding to silicon quantum dots with different atom ratio of silicon and carbon.

  10. Manufacture of silicon carbide using solar energy

    DOEpatents

    Glatzmaier, Gregory C.

    1992-01-01

    A method is described for producing silicon carbide particles using solar energy. The method is efficient and avoids the need for use of electrical energy to heat the reactants. Finely divided silica and carbon are admixed and placed in a solar-heated reaction chamber for a time sufficient to cause a reaction between the ingredients to form silicon carbide of very small particle size. No grinding of silicon carbide is required to obtain small particles. The method may be carried out as a batch process or as a continuous process.

  11. Improved consolidation of silicon carbide

    NASA Technical Reports Server (NTRS)

    Freedman, M. R.; Millard, M. L.

    1986-01-01

    Alpha silicon carbide powder was consolidated by both dry and wet methods. Dry pressing in a double acting steel die yielded sintered test bars with an average flexural strength of 235.6 MPa with a critical flaw size of approximately 100 micro m. An aqueous slurry pressing technique produced sintered test bars with an average flexural strength of 440.8 MPa with a critical flaw size of approximately 25 micro m. Image analysis revealed a reduction in both pore area and pore size distribution in the slurry pressed sintered test bars. The improvements in the slurry pressed material properties are discussed in terms of reduced agglomeration and improved particle packing during consolidation.

  12. In situ-grown hexagonal silicon nanocrystals in silicon carbide-based films

    PubMed Central

    2012-01-01

    Silicon nanocrystals (Si-NCs) were grown in situ in carbide-based film using a plasma-enhanced chemical vapor deposition method. High-resolution transmission electron microscopy indicates that these nanocrystallites were embedded in an amorphous silicon carbide-based matrix. Electron diffraction pattern analyses revealed that the crystallites have a hexagonal-wurtzite silicon phase structure. The peak position of the photoluminescence can be controlled within a wavelength of 500 to 650 nm by adjusting the flow rate of the silane gas. We suggest that this phenomenon is attributed to the quantum confinement effect of hexagonal Si-NCs in silicon carbide-based film with a change in the sizes and emission states of the NCs. PMID:23171576

  13. In situ-grown hexagonal silicon nanocrystals in silicon carbide-based films.

    PubMed

    Kim, Tae-Youb; Huh, Chul; Park, Nae-Man; Choi, Cheol-Jong; Suemitsu, Maki

    2012-11-21

    Silicon nanocrystals (Si-NCs) were grown in situ in carbide-based film using a plasma-enhanced chemical vapor deposition method. High-resolution transmission electron microscopy indicates that these nanocrystallites were embedded in an amorphous silicon carbide-based matrix. Electron diffraction pattern analyses revealed that the crystallites have a hexagonal-wurtzite silicon phase structure. The peak position of the photoluminescence can be controlled within a wavelength of 500 to 650 nm by adjusting the flow rate of the silane gas. We suggest that this phenomenon is attributed to the quantum confinement effect of hexagonal Si-NCs in silicon carbide-based film with a change in the sizes and emission states of the NCs.

  14. Prealloyed catalyst for growing silicon carbide whiskers

    DOEpatents

    Shalek, Peter D.; Katz, Joel D.; Hurley, George F.

    1988-01-01

    A prealloyed metal catalyst is used to grow silicon carbide whiskers, especially in the .beta. form. Pretreating the metal particles to increase the weight percentages of carbon or silicon or both carbon and silicon allows whisker growth to begin immediately upon reaching growth temperature.

  15. Synthesis of silicon carbide at room temperature from colloidal suspensions of silicon dioxide and carbon nanotubes

    NASA Astrophysics Data System (ADS)

    Zhukalin, D. A.; Tuchin, A. V.; Kulikova, T. V.; Bityutskaya, L. A.

    2015-11-01

    Experimental and theoretical approaches were used for the investigation of mechanisms and conditions of self-organized nanostructures formation in the drying drop of the mixture of colloidal suspensions of nanoscale amorphous silicon dioxide and carbon nanotubes. The formation of rodlike structures with diameter 250-300nm and length ∼4pm was revealed. The diffraction analysis of the obtained nanostructures showed the formation of the silicon carbide phase at room temperature.

  16. Selective etching of silicon carbide films

    DOEpatents

    Gao, Di; Howe, Roger T.; Maboudian, Roya

    2006-12-19

    A method of etching silicon carbide using a nonmetallic mask layer. The method includes providing a silicon carbide substrate; forming a non-metallic mask layer by applying a layer of material on the substrate; patterning the mask layer to expose underlying areas of the substrate; and etching the underlying areas of the substrate with a plasma at a first rate, while etching the mask layer at a rate lower than the first rate.

  17. Whatever happened to silicon carbide. [semiconductor devices

    NASA Technical Reports Server (NTRS)

    Campbell, R. B.

    1981-01-01

    The progress made in silicon carbide semiconductor devices in the 1955 to 1975 time frame is examined and reasons are given for the present lack of interest in the material. Its physical and chemical properties and methods of preparation are discussed. Fabrication techniques and the characteristics of silicon carbide devices are reviewed. It is concluded that a combination of economic factors and the lack of progress in fabrication techniques leaves no viable market for SiC devices in the near future.

  18. Crystallization of silicon carbide thin films by pulsed laser irradiation

    NASA Astrophysics Data System (ADS)

    De Cesare, G.; La Monica, S.; Maiello, G.; Masini, G.; Proverbio, E.; Ferrari, A.; Chitica, N.; Dinescu, M.; Alexandrescu, R.; Morjan, I.; Rotiu, E.

    1996-10-01

    Pulsed laser irradiation at low incident fluences was demonstrated to be effective for the crystallization of amorphous hydrogenated silicon carbide (a-SiC:H) films deposited on Si wafers. The amorphous films, with a carbon content in the range 30-50%, were deposited on (100) Si wafers by low temperature plasma enhanced chemical vapor deposition (PECVD). The crystallization treatment was carried out by a multipulse KrF excimer laser. The crystallinity modifications induced by the laser treatment were evidenced by Fourier transform infrared (FTIR) spectroscopy and X-ray diffraction. An important increase of the microhardness was evidenced as an effect of the laser treatment.

  19. Synthesis and Photoluminescence Property of Silicon Carbide Nanowires Via Carbothermic Reduction of Silica.

    PubMed

    Luo, Xiaogang; Ma, Wenhui; Zhou, Yang; Liu, Dachun; Yang, Bin; Dai, Yongnian

    2009-11-11

    Silicon carbide nanowires have been synthesized at 1400 degrees C by carbothermic reduction of silica with bamboo carbon under normal atmosphere pressure without metallic catalyst. X-ray diffraction, scanning electron microscopy, energy-dispersive spectroscopy, transmission electron microscopy and Fourier transformed infrared spectroscopy were used to characterize the silicon carbide nanowires. The results show that the silicon carbide nanowires have a core-shell structure and grow along <111> direction. The diameter of silicon carbide nanowires is about 50-200 nm and the length from tens to hundreds of micrometers. The vapor-solid mechanism is proposed to elucidate the growth process. The photoluminescence of the synthesized silicon carbide nanowires shows significant blueshifts, which is resulted from the existence of oxygen defects in amorphous layer and the special rough core-shell interface.

  20. Synthesis and Photoluminescence Property of Silicon Carbide Nanowires Via Carbothermic Reduction of Silica

    PubMed Central

    2010-01-01

    Silicon carbide nanowires have been synthesized at 1400 °C by carbothermic reduction of silica with bamboo carbon under normal atmosphere pressure without metallic catalyst. X-ray diffraction, scanning electron microscopy, energy-dispersive spectroscopy, transmission electron microscopy and Fourier transformed infrared spectroscopy were used to characterize the silicon carbide nanowires. The results show that the silicon carbide nanowires have a core–shell structure and grow along <111> direction. The diameter of silicon carbide nanowires is about 50–200 nm and the length from tens to hundreds of micrometers. The vapor–solid mechanism is proposed to elucidate the growth process. The photoluminescence of the synthesized silicon carbide nanowires shows significant blueshifts, which is resulted from the existence of oxygen defects in amorphous layer and the special rough core–shell interface. PMID:20651911

  1. Synthesis and Photoluminescence Property of Silicon Carbide Nanowires Via Carbothermic Reduction of Silica

    NASA Astrophysics Data System (ADS)

    Luo, Xiaogang; Ma, Wenhui; Zhou, Yang; Liu, Dachun; Yang, Bin; Dai, Yongnian

    2010-11-01

    Silicon carbide nanowires have been synthesized at 1400 °C by carbothermic reduction of silica with bamboo carbon under normal atmosphere pressure without metallic catalyst. X-ray diffraction, scanning electron microscopy, energy-dispersive spectroscopy, transmission electron microscopy and Fourier transformed infrared spectroscopy were used to characterize the silicon carbide nanowires. The results show that the silicon carbide nanowires have a core-shell structure and grow along <111> direction. The diameter of silicon carbide nanowires is about 50-200 nm and the length from tens to hundreds of micrometers. The vapor-solid mechanism is proposed to elucidate the growth process. The photoluminescence of the synthesized silicon carbide nanowires shows significant blueshifts, which is resulted from the existence of oxygen defects in amorphous layer and the special rough core-shell interface.

  2. Optical absorption in amorphous silicon

    SciTech Connect

    O`Leary, S.K.; Zukotynski, S.; Perz, J.M.; Sidhu, L.S.

    1996-12-31

    The role that disorder plays in shaping the form of the optical absorption spectrum of hydrogenated amorphous silicon is investigated. Disorder leads to a redistribution of states, which both reduces the Tauc gap and broadens the absorption tail. The observed relationship between the Tauc gap and the breadth of the absorption tail is thus explained.

  3. Subsurface damage of single crystalline silicon carbide in nanoindentation tests.

    PubMed

    Yan, Jiwang; Gai, Xiaohui; Harada, Hirofumi

    2010-11-01

    The response of single crystalline silicon carbide (SiC) to a Berkovich nanoindenter was investigated by examining the indents using a transmission electron microscope and the selected area electron diffraction technique. It was found that the depth of indentation-induced subsurface damage was far larger than the indentation depth, and the damaging mechanism of SiC was distinctly different from that of single crystalline silicon. For silicon, a broad amorphous region is formed underneath the indenter after unloading; for SiC, however, no amorphous phase was detected. Instead, a polycrystalline structure with a grain size of ten nanometer level was identified directly under the indenter tip. Micro cracks, basal plane dislocations and possible cross slips were also found around the indent. These finding provide useful information for ultraprecision manufacturing of SiC wafers.

  4. Process to produce silicon carbide fibers using a controlled concentration of boron oxide vapor

    NASA Technical Reports Server (NTRS)

    Barnard, Thomas Duncan (Inventor); Lipowitz, Jonathan (Inventor); Nguyen, Kimmai Thi (Inventor)

    2001-01-01

    A process for producing polycrystalline silicon carbide by heating an amorphous ceramic fiber that contains silicon and carbon in an environment containing boron oxide vapor. The boron oxide vapor is produced in situ by the reaction of a boron containing material such as boron carbide and an oxidizing agent such as carbon dioxide, and the amount of boron oxide vapor can be controlled by varying the amount and rate of addition of the oxidizing agent.

  5. Process to produce silicon carbide fibers using a controlled concentration of boron oxide vapor

    NASA Technical Reports Server (NTRS)

    Barnard, Thomas Duncan (Inventor); Lipowitz, Jonathan (Inventor); Nguyen, Kimmai Thi (Inventor)

    2000-01-01

    A process for producing polycrystalline silicon carbide includes heating an amorphous ceramic fiber that contains silicon and carbon in an environment containing boron oxide vapor. The boron oxide vapor is produced in situ by the reaction of a boron containing material such as boron carbide and an oxidizing agent such as carbon dioxide, and the amount of boron oxide vapor can be controlled by varying the amount and rate of addition of the oxidizing agent.

  6. Silicon Carbide Solar Cells Investigated

    NASA Technical Reports Server (NTRS)

    Bailey, Sheila G.; Raffaelle, Ryne P.

    2001-01-01

    The semiconductor silicon carbide (SiC) has long been known for its outstanding resistance to harsh environments (e.g., thermal stability, radiation resistance, and dielectric strength). However, the ability to produce device-quality material is severely limited by the inherent crystalline defects associated with this material and their associated electronic effects. Much progress has been made recently in the understanding and control of these defects and in the improved processing of this material. Because of this work, it may be possible to produce SiC-based solar cells for environments with high temperatures, light intensities, and radiation, such as those experienced by solar probes. Electronics and sensors based on SiC can operate in hostile environments where conventional silicon-based electronics (limited to 350 C) cannot function. Development of this material will enable large performance enhancements and size reductions for a wide variety of systems--such as high-frequency devices, high-power devices, microwave switching devices, and high-temperature electronics. These applications would supply more energy-efficient public electric power distribution and electric vehicles, more powerful microwave electronics for radar and communications, and better sensors and controls for cleaner-burning, more fuel-efficient jet aircraft and automobile engines. The 6H-SiC polytype is a promising wide-bandgap (Eg = 3.0 eV) semiconductor for photovoltaic applications in harsh solar environments that involve high-temperature and high-radiation conditions. The advantages of this material for this application lie in its extremely large breakdown field strength, high thermal conductivity, good electron saturation drift velocity, and stable electrical performance at temperatures as high as 600 C. This behavior makes it an attractive photovoltaic solar cell material for devices that can operate within three solar radii of the Sun.

  7. Power MOSFETs Formed In Silicon Carbide

    NASA Technical Reports Server (NTRS)

    Palmour, John W.

    1995-01-01

    High-performance power metal/oxide/semiconductor field-effect transistors (MOSFETs) fabricated in silicon carbide. Devices offer potential advantages over silicon-based MOSFETs, including lower "on" - state resistances at same rated voltages, ability to operate at higher temperatures, and higher thermal conductivity. Also more resistant to damage by ionizing radiation, an advantage for switching appications in nuclear facilities.

  8. Silicon Carbide Thyristors for Power Applications

    DTIC Science & Technology

    1995-07-01

    Silicon carbide has the potential to make high-performance power devices. Its high thermal conductivity, wide bandgap, high breakdown field and high saturated electron drift velocity imply a clear superiority over Si and GaAs. This work reports the fabrication and testing of three-terminal 6H-SiC thyristors. The silicon carbide thyristors show higher current density and higher temperature operation than is possible with silicon devices. Switching measurements at room temperature and at elevated temperatures are reported. SiC thyristors have

  9. Narrow band gap amorphous silicon semiconductors

    DOEpatents

    Madan, A.; Mahan, A.H.

    1985-01-10

    Disclosed is a narrow band gap amorphous silicon semiconductor comprising an alloy of amorphous silicon and a band gap narrowing element selected from the group consisting of Sn, Ge, and Pb, with an electron donor dopant selected from the group consisting of P, As, Sb, Bi and N. The process for producing the narrow band gap amorphous silicon semiconductor comprises the steps of forming an alloy comprising amorphous silicon and at least one of the aforesaid band gap narrowing elements in amount sufficient to narrow the band gap of the silicon semiconductor alloy below that of amorphous silicon, and also utilizing sufficient amounts of the aforesaid electron donor dopant to maintain the amorphous silicon alloy as an n-type semiconductor.

  10. Method of fabricating porous silicon carbide (SiC)

    NASA Technical Reports Server (NTRS)

    Shor, Joseph S. (Inventor); Kurtz, Anthony D. (Inventor)

    1995-01-01

    Porous silicon carbide is fabricated according to techniques which result in a significant portion of nanocrystallites within the material in a sub 10 nanometer regime. There is described techniques for passivating porous silicon carbide which result in the fabrication of optoelectronic devices which exhibit brighter blue luminescence and exhibit improved qualities. Based on certain of the techniques described porous silicon carbide is used as a sacrificial layer for the patterning of silicon carbide. Porous silicon carbide is then removed from the bulk substrate by oxidation and other methods. The techniques described employ a two-step process which is used to pattern bulk silicon carbide where selected areas of the wafer are then made porous and then the porous layer is subsequently removed. The process to form porous silicon carbide exhibits dopant selectivity and a two-step etching procedure is implemented for silicon carbide multilayers.

  11. Silicon carbide sintered body manufactured from silicon carbide powder containing boron, silicon and carbonaceous additive

    NASA Technical Reports Server (NTRS)

    Tanaka, Hidehiko

    1987-01-01

    A silicon carbide powder of a 5-micron grain size is mixed with 0.15 to 0.60 wt% mixture of a boron compound, i.e., boric acid, boron carbide (B4C), silicon boride (SiB4 or SiB6), aluminum boride, etc., and an aluminum compound, i.e., aluminum, aluminum oxide, aluminum hydroxide, aluminum carbide, etc., or aluminum boride (AlB2) alone, in such a proportion that the boron/aluminum atomic ratio in the sintered body becomes 0.05 to 0.25 wt% and 0.05 to 0.40 wt%, respectively, together with a carbonaceous additive to supply enough carbon to convert oxygen accompanying raw materials and additives into carbon monoxide.

  12. Carrier lifetimes in silicon carbide

    NASA Astrophysics Data System (ADS)

    Nigam, Saurav

    Carrier lifetimes are one of the most crucial parameters that govern the performance of high voltage/high power devices. The lack of understanding of the factors that determine the carrier lifetimes in silicon carbide is currently a major impediment in the development of high voltage/high power technology based on this material. The objective of this dissertation was to identify and subsequently, characterize various recombination channels present in silicon carbide. Of special importance was identification of lifetime limiting defects in the high quality epitaxial layers grown by state-of-the-art chemical vapor deposition technique for high voltage application. The effect of growth conditions (C/Si ratio, growth temperature, seed polarity, epilayer thickness, and background doping) on the concentrations of various defects were investigated with the aim of manipulating carrier lifetimes by controlling different growth parameters. Based on the qualitative correlations between various point defects and carrier lifetimes in more than thirty epitaxial layers, three defects (Z-defect, EH6/7 center, and P1 center) were identified as potential lifetime limiting defects. The P1 center was shown to act as efficient recombination channel whenever present in concentrations greater than 1013 cm-3. Such concentrations were observed in layers grown on the C-face and at low C/Si ratio (less than 1.5). The measurement of recombination rates of electrons and holes via the Z-defect and the EH6/7 center (as a function of temperature) were performed by analyzing the carrier dynamics in specially designed p-n diodes. At 300 K, the capture cross section of the two states of the Z-defect were sigman1˜6x10-15 cm2 (electron capture at the donor state), sigmap1˜2x1014 cm2 (hole capture at the donor state), sigman2˜1x10 16 cm2 (electron capture at the acceptor state), and sigma p2˜1e-13 cm2 (hole capture at the acceptor state). The electron capture cross section for the EH6/7 centers was

  13. Deposition method for producing silicon carbide high-temperature semiconductors

    DOEpatents

    Hsu, George C.; Rohatgi, Naresh K.

    1987-01-01

    An improved deposition method for producing silicon carbide high-temperature semiconductor material comprising placing a semiconductor substrate composed of silicon carbide in a fluidized bed silicon carbide deposition reactor, fluidizing the bed particles by hydrogen gas in a mildly bubbling mode through a gas distributor and heating the substrate at temperatures around 1200.degree.-1500.degree. C. thereby depositing a layer of silicon carbide on the semiconductor substrate.

  14. Bioactivation of biomorphous silicon carbide bone implants.

    PubMed

    Will, Julia; Hoppe, Alexander; Müller, Frank A; Raya, Carmen T; Fernández, Julián M; Greil, Peter

    2010-12-01

    Wood-derived silicon carbide (SiC) offers a specific biomorphous microstructure similar to the cellular pore microstructure of bone. Compared with bioactive ceramics such as calcium phosphate, however, silicon carbide is considered not to induce spontaneous interface bonding to living bone. Bioactivation by chemical treatment of biomorphous silicon carbide was investigated in order to accelerate osseointegration and improve bone bonding ability. Biomorphous SiC was processed from sipo (Entrandrophragma utile) wood by heating in an inert atmosphere and infiltrating the resulting carbon replica with liquid silicon melt at 1450°C. After removing excess silicon by leaching in HF/HNO₃ the biomorphous preform consisted of β-SiC with a small amount (approximately 6wt.%) of unreacted carbon. The preform was again leached in HCl/HNO₃ and finally exposed to CaCl₂ solution. X-ray photoelectron spectroscopy (XPS) and Fourier transform infrared analyses proved that oxidation of the residual carbon at the surface induced formation of carboxyl [COO⁻] groups, which triggered adsorption of Ca(2+), as confirmed by XPS and inductively coupled plasma optical emission spectroscopy measurements. A local increase in Ca(2+) concentration stimulated in vitro precipitation of Ca₅(PO₄)₃OH (HAP) on the silicon carbide preform surface during exposure to simulated body fluid, which indicates a significantly increased bone bonding activity compared with SiC. Copyright © 2010 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

  15. Varying potential silicon carbide gas sensor

    NASA Technical Reports Server (NTRS)

    Shields, Virgil B. (Inventor); Ryan, Margaret A. (Inventor); Williams, Roger M. (Inventor)

    1997-01-01

    A hydrocarbon gas detection device operates by dissociating or electro-chemically oxidizing hydrocarbons adsorbed to a silicon carbide detection layer. Dissociation or oxidation are driven by a varying potential applied to the detection layer. Different hydrocarbon species undergo reaction at different applied potentials so that the device is able to discriminate among various hydrocarbon species. The device can operate at temperatures between 100.degree. C. and at least 650.degree. C., allowing hydrocarbon detection in hot exhaust gases. The dissociation reaction is detected either as a change in a capacitor or, preferably, as a change of current flow through an FET which incorporates the silicon carbide detection layers. The silicon carbide detection layer can be augmented with a pad of catalytic material which provides a signal without an applied potential. Comparisons between the catalytically produced signal and the varying potential produced signal may further help identify the hydrocarbon present.

  16. Joining of porous silicon carbide bodies

    DOEpatents

    Bates, Carl H.; Couhig, John T.; Pelletier, Paul J.

    1990-05-01

    A method of joining two porous bodies of silicon carbide is disclosed. It entails utilizing an aqueous slip of a similar silicon carbide as was used to form the porous bodies, including the sintering aids, and a binder to initially join the porous bodies together. Then the composite structure is subjected to cold isostatic pressing to form a joint having good handling strength. Then the composite structure is subjected to pressureless sintering to form the final strong bond. Optionally, after the sintering the structure is subjected to hot isostatic pressing to further improve the joint and densify the structure. The result is a composite structure in which the joint is almost indistinguishable from the silicon carbide pieces which it joins.

  17. Mechanical Properties of Crystalline Silicon Carbide Nanowires.

    PubMed

    Zhang, Huan; Ding, Weiqiang; Aidun, Daryush K

    2015-02-01

    In this paper, the mechanical properties of crystalline silicon carbide nanowires, synthesized with a catalyst-free chemical vapor deposition method, were characterized with nanoscale tensile testing and mechanical resonance testing methods inside a scanning electron microscope. Tensile testing of individual silicon carbide nanowire was performed to determine the tensile properties of the material including the tensile strength, failure strain and Young's modulus. The silicon carbide nanowires were also excited to mechanical resonance in the scanning electron microscope vacuum chamber using mechanical excitation and electrical excitation methods, and the corresponding resonance frequencies were used to determine the Young's modulus of the material according to the simple beam theory. The Young's modulus values from tensile tests were in good agreement with the ones obtained from the mechanical resonance tests.

  18. Silicon carbide, an emerging high temperature semiconductor

    NASA Technical Reports Server (NTRS)

    Matus, Lawrence G.; Powell, J. Anthony

    1991-01-01

    In recent years, the aerospace propulsion and space power communities have expressed a growing need for electronic devices that are capable of sustained high temperature operation. Applications for high temperature electronic devices include development instrumentation within engines, engine control, and condition monitoring systems, and power conditioning and control systems for space platforms and satellites. Other earth-based applications include deep-well drilling instrumentation, nuclear reactor instrumentation and control, and automotive sensors. To meet the needs of these applications, the High Temperature Electronics Program at the Lewis Research Center is developing silicon carbide (SiC) as a high temperature semiconductor material. Research is focussed on developing the crystal growth, characterization, and device fabrication technologies necessary to produce a family of silicon carbide electronic devices and integrated sensors. The progress made in developing silicon carbide is presented, and the challenges that lie ahead are discussed.

  19. New process of silicon carbide purification intended for silicon passivation

    NASA Astrophysics Data System (ADS)

    Barbouche, M.; Zaghouani, R. Benabderrahmane; Benammar, N. E.; Aglieri, V.; Mosca, M.; Macaluso, R.; Khirouni, K.; Ezzaouia, H.

    2017-01-01

    In this work, we report on a new, efficient and low cost process of silicon carbide (SiC) powder purification intended to be used in photovoltaic applications. This process consists on the preparation of porous silicon carbide layers followed by a photo-thermal annealing under oxygen atmosphere and chemical treatment. The effect of etching time on impurities removal efficiency was studied. Inductively coupled plasma atomic emission spectrometry (ICP-AES) results showed that the best result was achieved for an etching time of 10 min followed by gettering at 900 °C during 1 h. SiC purity is improved from 3N (99.9771%) to 4N (99.9946%). Silicon carbide thin films were deposited onto silicon substrates by pulsed laser deposition technique (PLD) using purified SiC powder as target. Significant improvement of the minority carrier lifetime was obtained encouraging the use of SiC as a passivation layer for silicon.

  20. Continuous method of producing silicon carbide fibers

    NASA Technical Reports Server (NTRS)

    Barnard, Thomas Duncan (Inventor); Nguyen, Kimmai Thi (Inventor); Rabe, James Alan (Inventor)

    1999-01-01

    This invention pertains to a method for production of polycrystalline ceramic fibers from silicon oxycarbide (SiCO) ceramic fibers wherein the method comprises heating an amorphous ceramic fiber containing silicon and carbon in an inert environment comprising a boron oxide and carbon monoxide at a temperature sufficient to convert the amorphous ceramic fiber to a polycrystalline ceramic fiber. By having carbon monoxide present during the heating of the ceramic fiber, it is possible to achieve higher production rates on a continuous process.

  1. On the sintering of silicon carbide

    NASA Technical Reports Server (NTRS)

    Gugel, E.

    1986-01-01

    This document deals with the sintering of silicon carbide using pressureless sintering. This technique makes it possible to sinter a primarily covalent material to usable densities up to over 98% thD without having to use a high amount of sinter additives as is the case with other non-oxide ceramic materials. The process takes place rapidly, and it is also possible to produce relatively thick-walled structural parts without major problems. This sheds more light on the true characteristics of silicon carbide in one structural part, since there is no second or nearly no second phase. Heat pressing has improved stability.

  2. Liquid phase sintering of silicon carbide

    DOEpatents

    Cutler, R.A.; Virkar, A.V.; Hurford, A.C.

    1989-05-09

    Liquid phase sintering is used to densify silicon carbide based ceramics using a compound comprising a rare earth oxide and aluminum oxide to form liquids at temperatures in excess of 1,600 C. The resulting sintered ceramic body has a density greater than 95% of its theoretical density and hardness in excess of 23 GPa. Boron and carbon are not needed to promote densification and silicon carbide powder with an average particle size of greater than one micron can be densified via the liquid phase process. The sintered ceramic bodies made by the present invention are fine grained and have secondary phases resulting from the liquid phase. 4 figs.

  3. Liquid phase sintering of silicon carbide

    DOEpatents

    Cutler, Raymond A.; Virkar, Anil V.; Hurford, Andrew C.

    1989-01-01

    Liquid phase sintering is used to densify silicon carbide based ceramics using a compound comprising a rare earth oxide and aluminum oxide to form liquids at temperatures in excess of 1600.degree. C. The resulting sintered ceramic body has a density greater than 95% of its theoretical density and hardness in excess of 23 GPa. Boron and carbon are not needed to promote densification and silicon carbide powder with an average particle size of greater than one micron can be densified via the liquid phase process. The sintered ceramic bodies made by the present invention are fine grained and have secondary phases resulting from the liquid phase.

  4. Amorphous silicon solar cell allowing infrared transmission

    DOEpatents

    Carlson, David E.

    1979-01-01

    An amorphous silicon solar cell with a layer of high index of refraction material or a series of layers having high and low indices of refraction material deposited upon a transparent substrate to reflect light of energies greater than the bandgap energy of the amorphous silicon back into the solar cell and transmit solar radiation having an energy less than the bandgap energy of the amorphous silicon.

  5. Amorphous silicon based radiation detectors

    SciTech Connect

    Perez-Mendez, V.; Cho, G.; Drewery, J.; Jing, T.; Kaplan, S.N.; Qureshi, S.; Wildermuth, D. ); Fujieda, I.; Street, R.A. )

    1991-07-01

    We describe the characteristics of thin(1 {mu}m) and thick (>30{mu}m) hydrogenated amorphous silicon p-i-n diodes which are optimized for detecting and recording the spatial distribution of charged particles, x-rays and {gamma} rays. For x-ray, {gamma} ray, and charged particle detection we can use thin p-i-n photosensitive diode arrays coupled to evaporated layers of suitable scintillators. For direct detection of charged particles with high resistance to radiation damage, we use the thick p-i-n diode arrays. 13 refs., 7 figs.

  6. Tribological properties of sintered polycrystalline and single crystal silicon carbide

    NASA Technical Reports Server (NTRS)

    Miyoshi, K.; Buckley, D. H.; Srinivasan, M.

    1982-01-01

    Tribological studies and X-ray photoelectron spectroscopy analyses were conducted with sintered polycrystalline and single crystal silicon carbide surfaces in sliding contact with iron at various temperatures to 1500 C in a vacuum of 30 nPa. The results indicate that there is a significant temperature influence on both the friction properties and the surface chemistry of silicon carbide. The main contaminants on the as received sintered polycrystalline silicon carbide surfaces are adsorbed carbon, oxygen, graphite, and silicon dioxide. The surface revealed a low coefficient of friction. This is due to the presence of the graphite on the surface. At temperatures of 400 to 600 C graphite and copious amount of silicon dioxide were observed on the polycrystalline silicon carbide surface in addition to silicon carbide. At 800 C, the amount of the silicon dioxide decreased rapidly and the silicon carbide type silicon and carbon peaks were at a maximum intensity in the XPS spectra. The coefficients of friction were high in the temperature range 400 to 800 C. Small amounts of carbon and oxygen contaminants were observed on the as received single crystal silicon carbide surface below 250 C. Silicon carbide type silicon and carbon peaks were seen on the silicon carbide in addition to very small amount of graphite and silicon dioxide at temperatures of 450 to 800 C.

  7. PWR cores with silicon carbide cladding

    SciTech Connect

    Dobisesky, J. P.; Carpenter, D.; Pilat, E.; Kazimi, M. S.

    2012-07-01

    The feasibility of using silicon carbide rather than Zircaloy cladding, to reach higher power levels and higher discharge burnups in PWRs has been evaluated. A preliminary fuel design using fuel rods with the same dimensions as in the Westinghouse Robust Fuel Assembly but with fuel pellets having 10 vol% central void has been adopted to mitigate the higher fuel temperatures that occur due to the lower thermal conductivity of the silicon carbide and to the persistence of the open clad-pellet gap over most of the fuel life. With this modified fuel design, it is possible to achieve 18 month cycles that meet present-day operating constraints on peaking factor, boron concentration, reactivity coefficients and shutdown margin, while allowing batch average discharge burnups up to 80 MWD/kgU and peak rod burnups up to 100 MWD/kgU. Power uprates of 10% and possibly 20% also appear feasible. For non-uprated cores, the silicon carbide-clad fuel has a clear advantage that increases with increasing discharge burnup. Even for comparable discharge burnups, there is a savings in enriched uranium. Control rod configuration modifications may be required to meet the shutdown margin criterion for the 20% up-rate. Silicon carbide's ability to sustain higher burnups than Zircaloy also allows the design of a licensable two year cycle with only 96 fresh assemblies, avoiding the enriched uranium penalty incurred with use of larger batch sizes due to their excessive leakage. (authors)

  8. Ceramic Fabric Coated With Silicon Carbide

    NASA Technical Reports Server (NTRS)

    Riccitiello, S. R.; Smith, M.; Goldstein, H.; Zimmerman, N.

    1988-01-01

    Material used as high-temperature shell. Ceramic fabric coated with silicon carbide (SiC) serves as tough, heat-resistant covering for other refractory materials. Developed to protect reusable insulating tiles on advanced space transportation systems. New covering makes protective glaze unnecessary. Used on furnace bricks or on insulation for engines.

  9. Micromachining of Silicon Carbide using femtosecond lasers

    NASA Astrophysics Data System (ADS)

    Farsari, M.; Filippidis, G.; Zoppel, S.; Reider, G. A.; Fotakis, C.

    2007-04-01

    We have demonstrated micromachining of bulk 3C silicon carbide (3C- SiC) wafers by employing 1028nm wavelength femtosecond laser pulses of energy less than 10 nJ directly from a femtosecond laser oscillator, thus eliminating the need for an amplified system and increasing the micromachining speed by more than four orders of magnitude.

  10. High Q silicon carbide microdisk resonator

    SciTech Connect

    Lu, Xiyuan; Lee, Jonathan Y.; Feng, Philip X.-L.; Lin, Qiang

    2014-05-05

    We demonstrate a silicon carbide (SiC) microdisk resonator with optical Q up to 5.12 × 10{sup 4}. The high optical quality, together with the diversity of whispering-gallery modes and the tunability of external coupling, renders SiC microdisk a promising platform for integrated quantum photonics applications.

  11. Silicon Carbide Power Devices and Integrated Circuits

    NASA Technical Reports Server (NTRS)

    Lauenstein, Jean-Marie; Casey, Megan; Samsel, Isaak; LaBel, Ken; Chen, Yuan; Ikpe, Stanley; Wilcox, Ted; Phan, Anthony; Kim, Hak; Topper, Alyson

    2017-01-01

    An overview of the NASA NEPP Program Silicon Carbide Power Device subtask is given, including the current task roadmap, partnerships, and future plans. Included are the Agency-wide efforts to promote development of single-event effect hardened SiC power devices for space applications.

  12. Silicon carbide diode for increased light output

    NASA Technical Reports Server (NTRS)

    Griffiths, L. B.; Mlavsky, A. I.

    1969-01-01

    Transition metals improve the overall light output and the output in particular regions of the electroluminescent of a silicon carbide semiconductor device. These metals /impurities/ introduce levels that can be pumped electrically and affect the efficiency of the recombination process involved in emission of radiation.

  13. Surface chemistry and friction behavior of the silicon carbide (0001) surface at temperatures to 1500 deg C

    NASA Technical Reports Server (NTRS)

    Miyoshi, K.; Buckley, D. H.

    1981-01-01

    X-ray photoelectron and Auger electron spectroscopy analyses and friction studies were conducted with a silicon carbide (0001) surface in contact with iron at various temperatures to 1200 or 1500 C in a vacuum of 10 to the minus 8th power Pa. The results indicate that there is a significant temperature influence on both the surface chemistry and friction properties of silicon carbide. The principal contaminant of adsorbed amorphous carbon on the silicon carbide surface in the as received state is removed by simply heating to 400 C. Above 400 C, graphite and carbide type carbine are the primary species on the silicon carbide surface, in addition to silicon. The coefficients of friction of polycrystalline iron sliding against a single crystal silicon carbide (0001) surface were high at temperatures to 800 C. Similar coefficients of friction were obtained at room temperature after the silicon carbide was preheated at various temperatures up 800 C. When the friction experiments were conducted above 800 C or when the specimens were preheated to above 800 C, the coefficients of friction were dramatically lower. At 800 C the silicon and carbide type carbon are at a maximum intensity in the XPS spectra. With increasing temperature above 800 C, the concentration of the graphite increases rapidly on the surface, whereas those of the carbide type carbon and silicon decrease rapidly.

  14. Compensated amorphous-silicon solar cell

    DOEpatents

    Devaud, G.

    1982-06-21

    An amorphous silicon solar cell including an electrically conductive substrate, a layer of glow discharge deposited hydrogenated amorphous silicon having regions of differing conductivity with at least one region of intrinsic hydrogenated amorphous silicon. The layer of hydrogenated amorphous silicon has opposed first and second major surfaces where the first major surface contacts the elecrically conductive substrate and an electrode for electrically contacting the second major surface. The intrinsic hydrogenated amorphous silicon region is deposited in a glow discharge with an atmosphere which includes not less than about 0.02 atom percent mono-atomic boron. An improved N.I.P. solar cell is disclosed using a BF/sub 3/ doped intrinsic layer.

  15. Novel fabrication of silicon carbide based ceramics for nuclear applications

    NASA Astrophysics Data System (ADS)

    Singh, Abhishek Kumar

    Advances in nuclear reactor technology and the use of gas-cooled fast reactors require the development of new materials that can operate at the higher temperatures expected in these systems. These materials include refractory alloys based on Nb, Zr, Ta, Mo, W, and Re; ceramics and composites such as SiC--SiCf; carbon--carbon composites; and advanced coatings. Besides the ability to handle higher expected temperatures, effective heat transfer between reactor components is necessary for improved efficiency. Improving thermal conductivity of the fuel can lower the center-line temperature and, thereby, enhance power production capabilities and reduce the risk of premature fuel pellet failure. Crystalline silicon carbide has superior characteristics as a structural material from the viewpoint of its thermal and mechanical properties, thermal shock resistance, chemical stability, and low radioactivation. Therefore, there have been many efforts to develop SiC based composites in various forms for use in advanced energy systems. In recent years, with the development of high yield preceramic precursors, the polymer infiltration and pyrolysis (PIP) method has aroused interest for the fabrication of ceramic based materials, for various applications ranging from disc brakes to nuclear reactor fuels. The pyrolysis of preceramic polymers allow new types of ceramic materials to be processed at relatively low temperatures. The raw materials are element-organic polymers whose composition and architecture can be tailored and varied. The primary focus of this study is to use a pyrolysis based process to fabricate a host of novel silicon carbide-metal carbide or oxide composites, and to synthesize new materials based on mixed-metal silicocarbides that cannot be processed using conventional techniques. Allylhydridopolycarbosilane (AHPCS), which is an organometal polymer, was used as the precursor for silicon carbide. Inert gas pyrolysis of AHPCS produces near-stoichiometric amorphous

  16. Tests Of Amorphous-Silicon Photovoltaic Modules

    NASA Technical Reports Server (NTRS)

    Ross, Ronald G., Jr.

    1988-01-01

    Progress in identification of strengths and weaknesses of amorphous-silicon technology detailed. Report describes achievements in testing reliability of solar-power modules made of amorphous-silicon photovoltaic cells. Based on investigation of modules made by U.S. manufacturers. Modules subjected to field tests, to accelerated-aging tests in laboratory, and to standard sequence of qualification tests developed for modules of crystalline-silicon cells.

  17. Genesis Silicon Carbide Concentrator Target 60003 Preliminary Ellipsometry Mapping Results

    NASA Technical Reports Server (NTRS)

    Calaway, M. J.; Rodriquez, M. C.; Stansbery, E. K.

    2007-01-01

    The Genesis concentrator was custom designed to focus solar wind ions primarily for terrestrial isotopic analysis of O-17/O-16 and O-18/O-16 to +/-1%, N-15/N-14 to +/-1%, and secondarily to conduct elemental and isotopic analysis of Li, Be, and B. The circular 6.2 cm diameter concentrator target holder was comprised of four quadrants of highly pure semiconductor materials that included one amorphous diamond-like carbon, one C-13 diamond, and two silicon carbide (SiC). The amorphous diamond-like carbon quadrant was fractured upon impact at Utah Test and Training Range (UTTR), but the remaining three quadrants survived fully intact and all four quadrants hold an important collection of solar wind. The quadrants were removed from the target holder at NASA Johnso n Space Center Genesis Curation Laboratory in April 2005, and have been housed in stainless steel containers under continual nitrogen purge since time of disintegration. In preparation for allocation of a silicon carbide target for oxygen isotope analyses at UCLA, the two SiC targets were photographed for preliminary inspection of macro particle contamination from the hard non-nominal landing as well as characterized by spectroscopic ellipsometry to evaluate thin film contamination. This report is focused on Genesis SiC target sample number 60003.

  18. Shock compression properties of silicon carbide

    SciTech Connect

    Grady, D.E.; Kipp, M.E.

    1993-07-01

    An investigation of the shock compression and release properties of silicon carbide ceramic has been performed. A series of planar impact experiments has been completed in which stationary target discs of ceramic were struck by plates of either similar ceramic or other appropriate material at velocities up to 2.2 km/s with a propellant gun facility. The particle velocity history at the interface between the back of the target ceramic and a lithium-fluoride window material was measured with laser velocity interferometry (VISAR). Impact stresses achieved in these experiments range between about 10 and 50 GPa. Numerical solutions and analytic methods were used to determine the dynamic compression and release stress-strain behavior of the ceramic. Further analysis of the data was performed to determine dynamic strength and compressibility properties of silicon carbide.

  19. Corrosion Characteristics of Silicon Carbide and Silicon Nitride

    PubMed Central

    Munro, R. G.; Dapkunas, S. J.

    1993-01-01

    The present work is a review of the substantial effort that has been made to measure and understand the effects of corrosion with respect to the properties, performance, and durability of various forms of silicon carbide and silicon nitride. The review encompasses corrosion in diverse environments, usually at temperatures of 1000 °C or higher. The environments include dry and moist oxygen, mixtures of hot gaseous vapors, molten salts, molten metals, and complex environments pertaining to coal ashes and slags. PMID:28053489

  20. Computer Simulation of Displacement Damage in Silicon Carbide

    SciTech Connect

    Devanathan, Ram; Gao, Fei; Weber, William J.; M. Chipara, D. L. Edwards, S. Phillips, and R. Benson

    2005-07-01

    We have performed molecular dynamics simulation of displacement events on silicon and carbon sublattices in silicon carbide for displacement doses ranging from 0.005 to 0.5 displacements per atom. Our results indicate that the displacement threshold energy is about 21 eV for C and 35 eV for Si, and amorphization can occur by accumulation of displacement damage regardless of whether Si or C is displaced. In addition, we have simulated defect production in high-energy cascades as a function of the primary knock-on atom energy and observed features that are different from the case of damage accumulation in Si. These systematic studies shed light on the phenomenon of non-ionizing energy loss that is relevant to understanding space radiation effects in semiconductor devices.

  1. Size dependence of nanoscale wear of silicon carbide

    Treesearch

    Chaiyapat Tangpatjaroen; David Grierson; Steve Shannon; Joseph E. Jakes; Izabela Szlufarska

    2017-01-01

    Nanoscale, single-asperity wear of single-crystal silicon carbide (sc- SiC) and nanocrystalline silicon carbide (nc-SiC) is investigated using single-crystal diamond nanoindenter tips and nanocrystalline diamond atomic force microscopy (AFM) tips under dry conditions, and the wear behavior is compared to that of single-crystal silicon with both thin and thick native...

  2. High temperature silicon carbide impregnated insulating fabrics

    NASA Technical Reports Server (NTRS)

    Schomburg, C.; Dotts, R. L. (Inventor)

    1982-01-01

    High temperature insulating articles having improved performance characteristics are described. The articles comprise fabrics of closely woven refractory or heat resistant fibers having particles of silicon carbide dispersed at least partially through the fabric and bonded to the fibers with an emulsifiable polyethylene wax. Such articles exhibit significantly increased high temperature emittance characteristics and an improved retention of integrity and flexibility after prolonged exposure to high temperature.

  3. Silicon Carbide Technologies for Lightweighted Aerospace Mirrors

    DTIC Science & Technology

    2008-09-01

    Silicon Carbide Technologies for Lightweighted Aerospace Mirrors Lawrence E. Matson (1) Ming Y. Chen (1) Brett deBlonk (2) Iwona A...glass and beryllium to produce lightweighted aerospace mirror systems has reached its limits due to the long lead times, high processing costs...for making mirror structural substrates, figuring and finishing technologies being investigated to reduce cost time and cost, and non-destructive

  4. Low blow Charpy impact of silicon carbides

    NASA Technical Reports Server (NTRS)

    Abe, H.; Chandan, H. C.; Bradt, R. C.

    1978-01-01

    The room-temperature impact resistance of several commercial silicon carbides was examined using an instrumented pendulum-type machine and Charpy-type specimens. Energy balance compliance methods and fracture toughness approaches, both applicable to other ceramics, were used for analysis. The results illustrate the importance of separating the machine and the specimen energy contributions and confirm the equivalence of KIc and KId. The material's impact energy was simply the specimen's stored elastic strain energy at fracture.

  5. Producing Silicon Carbide for Semiconductor Devices

    NASA Technical Reports Server (NTRS)

    Hsu, G. C.; Rohatgi, N. K.

    1986-01-01

    Processes proposed for production of SiC crystals for use in semiconductors operating at temperatures as high as 900 degrees C. Combination of new processes produce silicon carbide chips containing epitaxial layers. Chips of SiC first grown on porous carbon matrices, then placed in fluidized bed, where additional layer of SiC grows. Processes combined to yield complete process. Liquid crystallization process used to make SiC particles or chips for fluidized-bed process.

  6. Low blow Charpy impact of silicon carbides

    NASA Technical Reports Server (NTRS)

    Abe, H.; Chandan, H. C.; Bradt, R. C.

    1978-01-01

    The room-temperature impact resistance of several commercial silicon carbides was examined using an instrumented pendulum-type machine and Charpy-type specimens. Energy balance compliance methods and fracture toughness approaches, both applicable to other ceramics, were used for analysis. The results illustrate the importance of separating the machine and the specimen energy contributions and confirm the equivalence of KIc and KId. The material's impact energy was simply the specimen's stored elastic strain energy at fracture.

  7. Friction and deformation behavior of single-crystal silicon carbide

    NASA Technical Reports Server (NTRS)

    Miyoshi, K.; Buckley, D. H.

    1977-01-01

    Friction and deformation studies were conducted with single-crystal silicon carbide in sliding contact with diamond. When the radius of curvature of the spherical diamond rider was large (0.3), deformation of silicon carbide was primarily elastic. Under these conditions the friction coefficient was low and did not show a dependence on the silicon carbide orientation. Further, there was no detectable cracking of the silicon carbide surfaces. When smaller radii of curvature of the spherical diamond riders (0.15 and 0.02 mm) or a conical diamond rider was used, plastic grooving occured and the silicon carbide exhibited anisotropic friction and deformation behavior. Under these conditions the friction coefficient depended on load. Anisotropic friction and deformation of the basal plane of silicon carbide was controlled by the slip system. 10101120and cleavage of1010.

  8. Nonlinear optical imaging of defects in cubic silicon carbide epilayers.

    PubMed

    Hristu, Radu; Stanciu, Stefan G; Tranca, Denis E; Matei, Alecs; Stanciu, George A

    2014-06-11

    Silicon carbide is one of the most promising materials for power electronic devices capable of operating at extreme conditions. The widespread application of silicon carbide power devices is however limited by the presence of structural defects in silicon carbide epilayers. Our experiment demonstrates that optical second harmonic generation imaging represents a viable solution for characterizing structural defects such as stacking faults, dislocations and double positioning boundaries in cubic silicon carbide layers. X-ray diffraction and optical second harmonic rotational anisotropy were used to confirm the growth of the cubic polytype, atomic force microscopy was used to support the identification of silicon carbide defects based on their distinct shape, while second harmonic generation microscopy revealed the detailed structure of the defects. Our results show that this fast and noninvasive investigation method can identify defects which appear during the crystal growth and can be used to certify areas within the silicon carbide epilayer that have optimal quality.

  9. Directional amorphization of boron carbide subjected to laser shock compression

    DOE PAGES

    Zhao, Shiteng; Kad, Bimal; Remington, Bruce A.; ...

    2016-10-12

    Solid-state shock-wave propagation is strongly nonequilibrium in nature and hence rate dependent. When using high-power pulsed-laser-driven shock compression, an unprecedented high strain rates can be achieved; we report the directional amorphization in boron carbide polycrystals. At a shock pressure of 45~50 GPa, multiple planar faults, slightly deviated from maximum shear direction, occur a few hundred nanometers below the shock surface. High-resolution transmission electron microscopy reveals that these planar faults are precursors of directional amorphization. We also propose that the shear stresses cause the amorphization and that pressure assists the process by ensuring the integrity of the specimen. Thermal energy conversionmore » calculations including heat transfer suggest that amorphization is a solid-state process. Such a phenomenon has significant effect on the ballistic performance of B4C.« less

  10. Directional amorphization of boron carbide subjected to laser shock compression

    NASA Astrophysics Data System (ADS)

    Zhao, Shiteng; Kad, Bimal; Remington, Bruce A.; LaSalvia, Jerry C.; Wehrenberg, Christopher E.; Behler, Kristopher D.; Meyers, Marc A.

    2016-10-01

    Solid-state shock-wave propagation is strongly nonequilibrium in nature and hence rate dependent. Using high-power pulsed-laser-driven shock compression, unprecedented high strain rates can be achieved; here we report the directional amorphization in boron carbide polycrystals. At a shock pressure of 45˜50 GPa, multiple planar faults, slightly deviated from maximum shear direction, occur a few hundred nanometers below the shock surface. High-resolution transmission electron microscopy reveals that these planar faults are precursors of directional amorphization. It is proposed that the shear stresses cause the amorphization and that pressure assists the process by ensuring the integrity of the specimen. Thermal energy conversion calculations including heat transfer suggest that amorphization is a solid-state process. Such a phenomenon has significant effect on the ballistic performance of B4C.

  11. Silicon carbide-silicon composite having improved oxidation resistance and method of making

    NASA Technical Reports Server (NTRS)

    Luthra, Krishan Lal (Inventor); Wang, Hongyu (Inventor)

    1999-01-01

    A Silicon carbide-silicon matrix composite having improved oxidation resistance at high temperatures in dry or water-containing environments is provided. A method is given for sealing matrix cracks in situ in melt infiltrated silicon carbide-silicon matrix composites. The composite cracks are sealed by the addition of various additives, such as boron compounds, into the melt infiltrated silicon carbide-silicon matrix.

  12. Method of making silicon carbide-silicon composite having improved oxidation resistance

    NASA Technical Reports Server (NTRS)

    Luthra, Krishan Lal (Inventor); Wang, Hongyu (Inventor)

    2002-01-01

    A Silicon carbide-silicon matrix composite having improved oxidation resistance at high temperatures in dry or water-containing environments is provided. A method is given for sealing matrix cracks in situ in melt infiltrated silicon carbide-silicon matrix composites. The composite cracks are sealed by the addition of various additives, such as boron compounds, into the melt infiltrated silicon carbide-silicon matrix.

  13. Controlled Thin-Film Growth Of Silicon Carbide Polytypes

    NASA Technical Reports Server (NTRS)

    Powell, J. Anthony; Larkin, David J.

    1995-01-01

    Improved deposition process to grows thin layers of silicon carbide having chosen crystalline structures. Process incorporated into sequences of deposition and etching steps used to fabricate silicon-carbide-based semiconductor devices. Important advance because silicon carbide emerging as superior semiconductor for devices operating under conditions of high power, high temperature, and/or high frequency. Furthermore, various crystalline structures of SiC have different electronic properties, each suited to specific application.

  14. Single Molecule Source Reagents for CVD of Beta Silicon Carbide

    DTIC Science & Technology

    1991-06-30

    Beta silicon carbide is an excellent candidate semiconductor material for demanding applications in high power and high temperature electronic...devices due to its high breakdown voltage, relatively large band gap, high thermal conductivity and high melting point. Use of silicon carbide thin films is...equipment has been used in the CVD systems, but small disparities remain between successive deposited films. The production of practical beta silicon carbide devices

  15. Fundamental Studies and Device Development in Beta Silicon Carbide

    DTIC Science & Technology

    1990-02-28

    The dependence of growth rate of alpha-SiC on alpha- Silicon Carbide substrates and surface morphology on temperature, source gas/carrier gas flow...Hydrogen- Silicon Carbide films during deposition have also been studied. Device research has involved studies of suitable ohmic and rectifying...semiconductor field effect transistor and Impact Avalanche transit-time diodes. Alpha silicon carbide , Semi-conductors, Growth rate, Aluminum dopant, Nitrogen dopant, Ohmic contacts, Schottky contacts, MESFET, MOSFET, IMPATT.

  16. Mechanical Testing of Silicon Carbide on MISSE-7

    DTIC Science & Technology

    2012-07-15

    JS) ii Abstract Silicon carbide ( SiC ) mechanical test specimens were included on the second Optical and Reflector Materials Experiment (ORMatE II...2. Vendor 2 EFS Weibull Results (normalized to Extra Disks Weibull parameters) 12 1. Introduction Silicon carbide ( SiC ) mechanical test...AEROSPACE REPORT NO ATR-2012(8921)-5 Mechanical Testing of Silicon Carbide on MISSE-7 Jul> 15. 2012 David B. Witkin Space Materials Laboratory

  17. Optical waveguide formed by cubic silicon carbide on sapphire substrates

    NASA Technical Reports Server (NTRS)

    Tang, Xiao; Wongchotigul, Kobchat; Spencer, Michael G.

    1991-01-01

    Optical confinement in beta silicon carbide (beta-SiC) thin films on sapphire substrate is demonstrated. Measurements are performed on waveguides formed by the mechanical transfer of thin beta-SiC films to sapphire. Recent results of epitaxial films of SiC on sapphire substrates attest to the technological viability of optoelectronic devices made from silicon carbide. Far-field mode patterns are shown. It is believed that this is the first step in validating a silicon carbide optoelectronic technology.

  18. Effect of Heat Treatment on Silicon Carbide Based Joining Materials for Fusion Energy

    SciTech Connect

    Lewinsohn, Charles A.; Jones, Russell H.; Nozawa, T.; Kotani, M.; Kishimoto, H.; Katoh, Y.; Kohyama, A.

    2001-10-01

    Two general approaches to obtaining silicon carbide-based joint materials were used. The first method relies on reactions between silicon and carbon to form silicon carbide, or to bond silicon carbide powders together. The second method consists of pyrolysing a polycarbosilane polymer to yield an amorphous, covalently bonded material. In order to assess the long-term durability of the joint materials, various heat treatments were performed and the effects on the mechanical properties of the joints were measured. Although the joints derived from the polycarbosilane polymer were not the strongest, the value of strength measured was not affected by heat treatment. On the other hand, the value of the strength of the reaction-based joints was affected by heat treatment, indicating the presence of residual stresses or unreacted material subsequent to processing. Further investigation of reaction-based joining should consist of detailed microscopic studies; however, continued study of joints derived from polymers is also warranted.

  19. HEAT-RESISTANT MATERIAL WITH SILICON CARBIDE AS A BASE,

    DTIC Science & Technology

    A new high-temperature material, termed SG-60, is a silicon carbide -graphite composite in which the graphite is the thermostability carrier since it...is more heat-conducting and softer (heat conductivity of graphite is 0.57 cal/g-cm-sec compared with 0.02 cal/g-cm-sec for silicon carbide ) while... silicon carbide is the carrier of high-temperature strength and hardness. The high covalent bonding strength of the atoms of silicon carbide (283 kcal

  20. Ion-Beam Milling of Silicon Carbide Epitaxial Layers.

    DTIC Science & Technology

    1982-08-04

    Ion milling of photolithographically processed silicon carbide heteroepitaxially grown layers on Si is feasible using an aluminum mask which is produced by standard photolithographic procedures and techniques. (Author)

  1. Silicon nitride/silicon carbide composite densified materials prepared using composite powders

    DOEpatents

    Dunmead, S.D.; Weimer, A.W.; Carroll, D.F.; Eisman, G.A.; Cochran, G.A.; Susnitzky, D.W.; Beaman, D.R.; Nilsen, K.J.

    1997-07-01

    Prepare silicon nitride-silicon carbide composite powders by carbothermal reduction of crystalline silica powder, carbon powder and, optionally, crystalline silicon nitride powder. The crystalline silicon carbide portion of the composite powders has a mean number diameter less than about 700 nanometers and contains nitrogen. The composite powders may be used to prepare sintered ceramic bodies and self-reinforced silicon nitride ceramic bodies.

  2. Colloidal characterization of silicon nitride and silicon carbide

    NASA Technical Reports Server (NTRS)

    Feke, Donald L.

    1986-01-01

    The colloidal behavior of aqueous ceramic slips strongly affects the forming and sintering behavior and the ultimate mechanical strength of the final ceramic product. The colloidal behavior of these materials, which is dominated by electrical interactions between the particles, is complex due to the strong interaction of the solids with the processing fluids. A surface titration methodology, modified to account for this interaction, was developed and used to provide fundamental insights into the interfacial chemistry of these systems. Various powder pretreatment strategies were explored to differentiate between true surface chemistry and artifacts due to exposure history. The colloidal behavior of both silicon nitride and carbide is dominated by silanol groups on the powder surfaces. However, the colloid chemistry of silicon nitride is apparently influenced by an additional amine group. With the proper powder treatments, silicon nitride and carbide powder can be made to appear colloidally equivalent. The impact of these results on processing control will be discussed.

  3. Colloidal characterization of silicon nitride and silicon carbide

    NASA Technical Reports Server (NTRS)

    Feke, Donald L.

    1986-01-01

    The colloidal behavior of aqueous ceramic slips strongly affects the forming and sintering behavior and the ultimate mechanical strength of the final ceramic product. The colloidal behavior of these materials, which is dominated by electrical interactions between the particles, is complex due to the strong interaction of the solids with the processing fluids. A surface titration methodology, modified to account for this interaction, was developed and used to provide fundamental insights into the interfacial chemistry of these systems. Various powder pretreatment strategies were explored to differentiate between true surface chemistry and artifacts due to exposure history. The colloidal behavior of both silicon nitride and carbide is dominated by silanol groups on the powder surfaces. However, the colloid chemistry of silicon nitride is apparently influenced by an additional amine group. With the proper powder treatments, silicon nitride and carbide powder can be made to appear colloidally equivalent. The impact of these results on processing control will be discussed.

  4. Electron tunnelling into amorphous germanium and silicon.

    NASA Technical Reports Server (NTRS)

    Smith, C. W.; Clark, A. H.

    1972-01-01

    Measurements of tunnel conductance versus bias, capacitance versus bias, and internal photoemission were made in the systems aluminum-oxide-amorphous germanium and aluminium-oxide-amorphous silicon. A function was extracted which expresses the deviation of these systems from the aluminium-oxide-aluminium system.

  5. Silicon carbide/SRBSN composites

    SciTech Connect

    Razzell, A.G.; Lewis, M.H.

    1991-08-01

    Ceramic matrix composites have been produced using unidirectionally aligned Textron SCS-6 fibers in a sintered reaction bonded silicon nitride (SRBSN) matrix. A tape casting technique was used to produce a prepreg sheet that could be cut and stacked to form a layup. Sintering aids were MgO, Al2O3, and Y2O3 either singly or in combination, final sintering being carried out under pressure at temperatures up to 1750 C. The three-point bend strength of the material varied between 448 and 513 MPa and showed no variation with oxidation time at 1000 C up to 25 hours. Interfacial shear strength measured by indentation was 4 MPa; some samples had a reaction layer at the interface and a shear strength of greater than MPa. Within sections 6 mm from exposed fiber ends, the interfacial carbon layers were partially removed, and the interfacial shear strength was reduced with increasing oxidation time. 4 refs.

  6. Influence of radiation damage on krypton diffusion in silicon carbide

    NASA Astrophysics Data System (ADS)

    Friedland, E.; Hlatshwayo, T. T.; van der Berg, N. G.; Mabena, M. C.

    2015-07-01

    Diffusion of krypton in poly and single crystalline silicon carbide is investigated and compared with the previously obtained results for xenon, which pointed to a different diffusion mechanism than observed for chemically active elements. For this purpose 360 keV krypton ions were implanted in commercial 6H-SiC and CVD-SiC wafers at room temperature, 350 °C and 600 °C. Width broadening of the implantation profiles and krypton retention during isochronal and isothermal annealing up to temperatures of 1400 °C was determined by RBS-analysis, whilst in the case of 6H-SiC damage profiles were simultaneously obtained by α-particle channeling. Little diffusion and no krypton loss was detected in the initially amorphized and eventually recrystallized surface layer of cold implanted 6H-SiC during annealing up to 1200 °C. Above that temperature thermal etching of the implanted surface became increasingly important. No diffusion or krypton loss is detected in the hot implanted 6H-SiC samples during annealing up to 1400 °C. Radiation damage dependent grain boundary diffusion is observed at 1300 °C in CVD-SiC. The results seem to indicate, that the chemically inert noble gas atoms do not form defect-impurity complexes, which strongly influence the diffusion behavior of other diffusors in silicon carbide.

  7. Low-Temperature Growth of Hydrogenated Amorphous Silicon Carbide Solar Cell by Inductively Coupled Plasma Deposition Toward High Conversion Efficiency in Indoor Lighting.

    PubMed

    Kao, Ming-Hsuan; Shen, Chang-Hong; Yu, Pei-Chen; Huang, Wen-Hsien; Chueh, Yu-Lun; Shieh, Jia-Min

    2017-10-05

    A p-a-SiC:H window layer was used in amorphous Si thin film solar cells to boost the conversion efficiency in an indoor lighting of 500 lx. The p-a-SiC:H window layer/p-a-Si:H buffer layer scheme moderates the abrupt band bending across the p/i interface for the enhancement of VOC, JSC and FF in the solar spectra of short wavelengths. The optimized thickness of i-a-Si:H absorber layer is 400 nm to achieve the conversion efficiency of ~9.58% in an AM1.5 G solar spectrum. However, the optimized thickness of the absorber layer can be changed from 400 to 600 nm in the indoor lighting of 500 lx, exhibiting the maximum output power of 25.56 μW/cm(2). Furthermore, various durability tests with excellent performance were investigated, which are significantly beneficial to harvest the indoor lights for applications in the self-powered internet of thing (IoT).

  8. Improved silicon carbide for advanced heat engines

    NASA Technical Reports Server (NTRS)

    Whalen, T. J.; Winterbottom, W. L.

    1986-01-01

    Work performed to develop silicon carbide materials of high strength and to form components of complex shape and high reliability is described. A beta-SiC powder and binder system was adapted to the injection molding process and procedures and process parameters developed capable of providing a sintered silicon carbide material with improved properties. The initial effort has been to characterize the baseline precursor materials (beta silicon carbide powder and boron and carbon sintering aids), develop mixing and injection molding procedures for fabricating test bars, and characterize the properties of the sintered materials. Parallel studies of various mixing, dewaxing, and sintering procedures have been carried out in order to distinguish process routes for improving material properties. A total of 276 MOR bars of the baseline material have been molded, and 122 bars have been fully processed to a sinter density of approximately 95 percent. The material has a mean MOR room temperature strength of 43.31 ksi (299 MPa), a Weibull characteristic strength of 45.8 ksi (315 MPa), and a Weibull modulus of 8.0. Mean values of the MOR strengths at 1000, 1200, and 14000 C are 41.4, 43.2, and 47.2 ksi, respectively. Strength controlling flaws in this material were found to consist of regions of high porosity and were attributed to agglomerates originating in the initial mixing procedures. The mean stress rupture lift at 1400 C of five samples tested at 172 MPa (25 ksi) stress was 62 hours and at 207 MPa (30 ksi) stress was 14 hours. New fluid mixing techniques have been developed which significantly reduce flaw size and improve the strength of the material. Initial MOR tests indicate the strength of the fluid-mixed material exceeds the baseline property by more than 33 percent.

  9. Atomic-scale disproportionation in amorphous silicon monoxide

    PubMed Central

    Hirata, Akihiko; Kohara, Shinji; Asada, Toshihiro; Arao, Masazumi; Yogi, Chihiro; Imai, Hideto; Tan, Yongwen; Fujita, Takeshi; Chen, Mingwei

    2016-01-01

    Solid silicon monoxide is an amorphous material which has been commercialized for many functional applications. However, the amorphous structure of silicon monoxide is a long-standing question because of the uncommon valence state of silicon in the oxide. It has been deduced that amorphous silicon monoxide undergoes an unusual disproportionation by forming silicon- and silicon-dioxide-like regions. Nevertheless, the direct experimental observation is still missing. Here we report the amorphous structure characterized by angstrom-beam electron diffraction, supplemented by synchrotron X-ray scattering and computer simulations. In addition to the theoretically predicted amorphous silicon and silicon-dioxide clusters, suboxide-type tetrahedral coordinates are detected by angstrom-beam electron diffraction at silicon/silicon-dioxide interfaces, which provides compelling experimental evidence on the atomic-scale disproportionation of amorphous silicon monoxide. Eventually we develop a heterostructure model of the disproportionated silicon monoxide which well explains the distinctive structure and properties of the amorphous material. PMID:27172815

  10. Atomic-scale disproportionation in amorphous silicon monoxide.

    PubMed

    Hirata, Akihiko; Kohara, Shinji; Asada, Toshihiro; Arao, Masazumi; Yogi, Chihiro; Imai, Hideto; Tan, Yongwen; Fujita, Takeshi; Chen, Mingwei

    2016-05-13

    Solid silicon monoxide is an amorphous material which has been commercialized for many functional applications. However, the amorphous structure of silicon monoxide is a long-standing question because of the uncommon valence state of silicon in the oxide. It has been deduced that amorphous silicon monoxide undergoes an unusual disproportionation by forming silicon- and silicon-dioxide-like regions. Nevertheless, the direct experimental observation is still missing. Here we report the amorphous structure characterized by angstrom-beam electron diffraction, supplemented by synchrotron X-ray scattering and computer simulations. In addition to the theoretically predicted amorphous silicon and silicon-dioxide clusters, suboxide-type tetrahedral coordinates are detected by angstrom-beam electron diffraction at silicon/silicon-dioxide interfaces, which provides compelling experimental evidence on the atomic-scale disproportionation of amorphous silicon monoxide. Eventually we develop a heterostructure model of the disproportionated silicon monoxide which well explains the distinctive structure and properties of the amorphous material.

  11. Molybdenum disilicide composites reinforced with zirconia and silicon carbide

    DOEpatents

    Petrovic, John J.

    1995-01-01

    Compositions consisting essentially of molybdenum disilicide, silicon carbide, and a zirconium oxide component. The silicon carbide used in the compositions is in whisker or powder form. The zirconium oxide component is pure zirconia or partially stabilized zirconia or fully stabilized zirconia.

  12. Molybdenum disilicide composites reinforced with zirconia and silicon carbide

    DOEpatents

    Petrovic, J.J.

    1995-01-17

    Compositions are disclosed consisting essentially of molybdenum disilicide, silicon carbide, and a zirconium oxide component. The silicon carbide used in the compositions is in whisker or powder form. The zirconium oxide component is pure zirconia or partially stabilized zirconia or fully stabilized zirconia.

  13. Molybdenum disilicide composites reinforced with zirconia and silicon carbide

    SciTech Connect

    Petrovic, J.J.

    1992-12-31

    This patent pertains to compositions consisting essentially of molybdenum disilicide, silicon carbide, and a zirconium oxide component. The silicon carbide used in the compositions is in whisker or powder form. The zirconium oxide component is pure zirconia or partially stabilized zirconia or fully stabilized zirconia. Fabrication, fracture toughness, and bend strength are covered.

  14. Aluminum/Silicon Carbide Matrix Material for Targeting System

    DTIC Science & Technology

    2006-07-21

    most common MMC is cast aluminum reinforced with various amounts of silicon carbide . LMMFC is currently machining very high precision components for...targeting systems from cast aluminum/ silicon carbide (AISiC) matrix material (with a very high SiC content) and are experiencing difficulty achieving the

  15. Process Development for Silicon Carbide Based Structural Ceramics

    DTIC Science & Technology

    1983-01-01

    The objective of this program is to develop a process for making shaped silicon carbide based ceramic materials with reduced microstructural flaw...identical conditions. The fracture toughness, KIC, measured by Vickers indentation testing was approximately the same as hot pressed Silicon carbide (NC203

  16. Aluminum / Silicon Carbide Matrix Material Machining for Targeting Systems

    DTIC Science & Technology

    2006-07-21

    most common (MMC) is cast aluminum reinforced with various amounts of silicon carbide . (LMMFC) is currently machining very high precision components for...targeting systems made from cast aluminum/ silicon carbide (AISiC) matrix material (with a very high SiC content) and is experiencing difficulty

  17. Process Development for Silicon Carbide Based Structural Ceramics.

    DTIC Science & Technology

    1982-02-01

    The objective of this program is to develop a process for making shaped silicon carbide based ceramic materials with reduced microstructural flaw...micrometers and a Weibull characteristic four point bend strength of 660 mPa, which significantly exceeds other reaction bonded silicon carbide materials

  18. Process for forming silicon carbide films and microcomponents

    DOEpatents

    Hamza, A.V.; Balooch, M.; Moalem, M.

    1999-01-19

    Silicon carbide films and microcomponents are grown on silicon substrates at surface temperatures between 900 K and 1700 K via C{sub 60} precursors in a hydrogen-free environment. Selective crystalline silicon carbide growth can be achieved on patterned silicon-silicon oxide samples. Patterned SiC films are produced by making use of the high reaction probability of C{sub 60} with silicon at surface temperatures greater than 900 K and the negligible reaction probability for C{sub 60} on silicon dioxide at surface temperatures less than 1250 K. 5 figs.

  19. Process for forming silicon carbide films and microcomponents

    DOEpatents

    Hamza, Alex V.; Balooch, Mehdi; Moalem, Mehran

    1999-01-01

    Silicon carbide films and microcomponents are grown on silicon substrates at surface temperatures between 900 K and 1700 K via C.sub.60 precursors in a hydrogen-free environment. Selective crystalline silicon carbide growth can be achieved on patterned silicon-silicon oxide samples. Patterned SiC films are produced by making use of the high reaction probability of C.sub.60 with silicon at surface temperatures greater than 900 K and the negligible reaction probability for C.sub.60 on silicon dioxide at surface temperatures less than 1250 K.

  20. Excess carbon in silicon carbide

    NASA Astrophysics Data System (ADS)

    Shen, X.; Oxley, M. P.; Puzyrev, Y.; Tuttle, B. R.; Duscher, G.; Pantelides, S. T.

    2010-12-01

    The application of SiC in electronic devices is currently hindered by low carrier mobility at the SiC/SiO2 interfaces. Recently, it was reported that 4H-SiC/SiO2 interfaces might have a transition layer on the SiC substrate side with C/Si ratio as high as 1.2, suggesting that carbon is injected into the SiC substrate during oxidation or other processing steps. We report finite-temperature quantum molecular dynamics simulations that explore the behavior of excess carbon in SiC. For SiC with 20% excess carbon, we find that, over short time (˜24 ps), carbon atoms bond to each other and form various complexes, while the silicon lattice is largely unperturbed. These results, however, suggest that at macroscopic times scale, C segregation is likely to occur; therefore a transition layer with 20% extra carbon would not be stable. For a dilute distribution of excess carbon, we explore the pairing of carbon interstitials and show that the formation of dicarbon interstitial cluster is kinetically very favorable, which suggests that isolated carbon clusters may exist inside SiC substrate.

  1. Fracture of silicon carbide whisker reinforced aluminum

    NASA Technical Reports Server (NTRS)

    Albritton, J. R.; Goree, J. G.

    1989-01-01

    An attempt is made to apply standard fracture toughness testing procedures, developed for metals, to whisker reinforced metal matrix composites. Test were carried out on compact-tension, center-notched, and edge-notched specimens of silicon carbide whisker reinforced extruded 2124 aluminum plate (10 and twenty volume percent of whiskers), with the loading direction either parallel or perpendicular to the extrusion direction. None of the tests is found to give a valid fracture toughness according to the criteria of the ASTM Standard E-399.

  2. Silicon Carbide Nanotube Oxidation at High Temperatures

    NASA Technical Reports Server (NTRS)

    Ahlborg, Nadia; Zhu, Dongming

    2012-01-01

    Silicon Carbide Nanotubes (SiCNTs) have high mechanical strength and also have many potential functional applications. In this study, SiCNTs were investigated for use in strengthening high temperature silicate and oxide materials for high performance ceramic nanocomposites and environmental barrier coating bond coats. The high · temperature oxidation behavior of the nanotubes was of particular interest. The SiCNTs were synthesized by a direct reactive conversion process of multiwall carbon nanotubes and silicon at high temperature. Thermogravimetric analysis (TGA) was used to study the oxidation kinetics of SiCNTs at temperatures ranging from 800degC to1300degC. The specific oxidation mechanisms were also investigated.

  3. Silicon carbide - Progress in crystal growth

    NASA Technical Reports Server (NTRS)

    Powell, J. Anthony

    1987-01-01

    Recent progress in the development of two processes for producing large-area high-quality single crystals of SiC is described: (1) a modified Lely process for the growth of the alpha polytypes (e.g., 6H SiC) initially developed by Tairov and Tsvetkov (1978, 1981) and Ziegler et al. (1983), and (2) a process for the epitaxial growth of the beta polytype on single-crystal silicon or other substrates. Growth of large-area cubic SiC on Si is described together with growth of defect-free beta-SiC films on alpha-6H SiC crystals and TiC lattice. Semiconducting qualities of silicon carbide crystals grown by various techniques are discussed.

  4. Silicon carbide - Progress in crystal growth

    NASA Technical Reports Server (NTRS)

    Powell, J. Anthony

    1987-01-01

    Recent progress in the development of two processes for producing large-area high-quality single crystals of SiC is described: (1) a modified Lely process for the growth of the alpha polytypes (e.g., 6H SiC) initially developed by Tairov and Tsvetkov (1978, 1981) and Ziegler et al. (1983), and (2) a process for the epitaxial growth of the beta polytype on single-crystal silicon or other substrates. Growth of large-area cubic SiC on Si is described together with growth of defect-free beta-SiC films on alpha-6H SiC crystals and TiC lattice. Semiconducting qualities of silicon carbide crystals grown by various techniques are discussed.

  5. An overview of silicon carbide device technology

    NASA Technical Reports Server (NTRS)

    Neudeck, Philip G.; Matus, Lawrence G.

    1992-01-01

    Recent progress in the development of silicon carbide (SiC) as a semiconductor is briefly reviewed. This material shows great promise towards providing electronic devices that can operate under the high-temperature, high-radiation, and/or high-power conditions where current semiconductor technologies fail. High quality single crystal wafers have become available, and techniques for growing high quality epilayers have been refined to the point where experimental SiC devices and circuits can be developed. The prototype diodes and transistors that have been produced to date show encouraging characteristics, but by the same token they also exhibit some device-related problems that are not unlike those faced in the early days of silicon technology development. Although these problems will not prevent the implementation of some useful circuits, the performance and operating regime of SiC electronics will be limited until these device-related issues are solved.

  6. Converting a carbon preform object to a silicon carbide object

    NASA Technical Reports Server (NTRS)

    Levin, Harry (Inventor)

    1990-01-01

    A process for converting in depth a carbon or graphite preform object to a silicon carbide object, silicon carbide/silicon object, silicon carbide/carbon-core object, or a silicon carbide/silicon/carbon-core object, by contacting it with silicon liquid and vapor over various lengths of contact time in a reaction chamber. In the process, a stream comprised of a silicon-containing precursor material in gaseous phase below the decomposition temperature of said gas and a coreactant, carrier or diluent gas such as hydrogen is passed through a hole within a high emissivity, thin, insulating septum into the reaction chamber above the melting point of silicon. The thin septum has one face below the decomposition temperature of the gas and an opposite face exposed to the reaction chamber. Thus, the precursor gas is decomposed directly to silicon in the reaction chamber. Any stream of decomposition gas and any unreacted precursor gas from the reaction chamber is removed. A carbon or graphite preform object placed in the reaction chamber is contacted with the silicon. The carbon or graphite preform object is recovered from the reactor chamber after it has been converted to a desired silicon carbide, silicon and carbon composition.

  7. Process Development for Silicon Carbide Based Structural Ceramics

    DTIC Science & Technology

    1980-12-31

    silicon carbide base structural ceramics with reduced microstructural flaw size by in situ reaction of silicon with fine, ultra-uniform pored carbon skeletons that are produced from liquid polymer solutions without particulate additions. Thus far, very uniform carbon skeletons in two pore sizes (2.5 and 0.27 microns) have been produced and siliconized. Very uniform samples of approx 1 cm cross section have been produced in a silicon carbide material of approx 5 microns average size. Limited regions of material with carbide size less than 1 micron have

  8. Amorphous silicon detectors in positron emission tomography

    SciTech Connect

    Conti, M. Lawrence Berkeley Lab., CA ); Perez-Mendez, V. )

    1989-12-01

    The physics of the detection process is studied and the performances of different Positron Emission Tomography (PET) system are evaluated by theoretical calculation and/or Monte Carlo Simulation (using the EGS code) in this paper, whose table of contents can be summarized as follows: a brief introduction to amorphous silicon detectors and some useful equation is presented; a Tantalum/Amorphous Silicon PET project is studied and the efficiency of the systems is studied by Monte Carlo Simulation; two similar CsI/Amorphous Silicon PET projects are presented and their efficiency and spatial resolution are studied by Monte Carlo Simulation, light yield and time characteristics of the scintillation light are discussed for different scintillators; some experimental result on light yield measurements are presented; a Xenon/Amorphous Silicon PET is presented, the physical mechanism of scintillation in Xenon is explained, a theoretical estimation of total light yield in Xenon and the resulting efficiency is discussed altogether with some consideration of the time resolution of the system; the amorphous silicon integrated electronics is presented, total noise and time resolution are evaluated in each of our applications; the merit parameters {epsilon}{sup 2}{tau}'s are evaluated and compared with other PET systems and conclusions are drawn; and a complete reference list for Xenon scintillation light physics and its applications is presented altogether with the listing of the developed simulation programs.

  9. Improved silicon carbide for advanced heat engines

    NASA Technical Reports Server (NTRS)

    Whalen, Thomas J.

    1988-01-01

    This is the third annual technical report for the program entitled, Improved Silicon Carbide for Advanced Heat Engines, for the period February 16, 1987 to February 15, 1988. The objective of the original program was the development of high strength, high reliability silicon carbide parts with complex shapes suitable for use in advanced heat engines. Injection molding is the forming method selected for the program because it is capable of forming complex parts adaptable for mass production on an economically sound basis. The goals of the revised program are to reach a Weibull characteristic strength of 550 MPa (80 ksi) and a Weibull modulus of 16 for bars tested in 4-point loading. Two tasks are discussed: Task 1 which involves materials and process improvements, and Task 2 which is a MOR bar matrix to improve strength and reliability. Many statistically designed experiments were completed under task 1 which improved the composition of the batches, the mixing of the powders, the sinter and anneal cycles. The best results were obtained by an attritor mixing process which yielded strengths in excess of 550 MPa (80 ksi) and an individual Weibull modulus of 16.8 for a 9-sample group. Strengths measured at 1200 and 1400 C were equal to the room temperature strength. Annealing of machined test bars significantly improved the strength. Molding yields were measured and flaw distributions were observed to follow a Poisson process. The second iteration of the Task 2 matrix experiment is described.

  10. Improved silicon carbide for advanced heat engines

    NASA Technical Reports Server (NTRS)

    Whalen, Thomas J.

    1987-01-01

    This is the second annual technical report entitled, Improved Silicon Carbide for Advanced Heat Engines, and includes work performed during the period February 16, 1986 to February 15, 1987. The program is conducted for NASA under contract NAS3-24384. The objective is the development of high strength, high reliability silicon carbide parts with complex shapes suitable for use in advanced heat engines. The fabrication methods used are to be adaptable for mass production of such parts on an economically sound basis. Injection molding is the forming method selected. This objective is to be accomplished in a two-phase program: (1) to achieve a 20 percent improvement in strength and a 100 percent increase in Weibull modulus of the baseline material; and (2) to produce a complex shaped part, a gas turbine rotor, for example, with the improved mechanical properties attained in the first phase. Eight tasks are included in the first phase covering the characterization of the properties of a baseline material, the improvement of those properties and the fabrication of complex shaped parts. Activities during the first contract year concentrated on two of these areas: fabrication and characterization of the baseline material (Task 1) and improvement of material and processes (Task 7). Activities during the second contract year included an MOR bar matrix study to improve mechanical properties (Task 2), materials and process improvements (Task 7), and a Ford-funded task to mold a turbocharger rotor with an improved material (Task 8).

  11. Amorphous Silicon Based Neutron Detector

    SciTech Connect

    Xu, Liwei

    2004-12-12

    Various large-scale neutron sources already build or to be constructed, are important for materials research and life science research. For all these neutron sources, neutron detectors are very important aspect. However, there is a lack of a high-performance and low-cost neutron beam monitor that provides time and temporal resolution. The objective of this SBIR Phase I research, collaboratively performed by Midwest Optoelectronics, LLC (MWOE), the University of Toledo (UT) and Oak Ridge National Laboratory (ORNL), is to demonstrate the feasibility for amorphous silicon based neutron beam monitors that are pixilated, reliable, durable, fully packaged, and fabricated with high yield using low-cost method. During the Phase I effort, work as been focused in the following areas: 1) Deposition of high quality, low-defect-density, low-stress a-Si films using very high frequency plasma enhanced chemical vapor deposition (VHF PECVD) at high deposition rate and with low device shunting; 2) Fabrication of Si/SiO2/metal/p/i/n/metal/n/i/p/metal/SiO2/ device for the detection of alpha particles which are daughter particles of neutrons through appropriate nuclear reactions; and 3) Testing of various devices fabricated for alpha and neutron detection; As the main results: · High quality, low-defect-density, low-stress a-Si films have been successfully deposited using VHF PECVD on various low-cost substrates; · Various single-junction and double junction detector devices have been fabricated; · The detector devices fabricated have been systematically tested and analyzed. · Some of the fabricated devices are found to successfully detect alpha particles. Further research is required to bring this Phase I work beyond the feasibility demonstration toward the final prototype devices. The success of this project will lead to a high-performance, low-cost, X-Y pixilated neutron beam monitor that could be used in all of the neutron facilities worldwide. In addition, the technologies

  12. Polymeric synthesis of silicon carbide with microwaves.

    PubMed

    Aguilar, Juan; Urueta, Luis; Valdez, Zarel

    2007-01-01

    The aim of this work is conducting polymeric synthesis with microwaves for producing beta-SiC. A polymeric precursor was prepared by means of hydrolysis and condensation reactions from pheniltrimethoxysilane, water, methanol, ammonium hydroxide and chloride acid. The precursor was placed into a quartz tube in vacuum; pyrolysis was carried out conventionally in a tube furnace, and by microwaves at 2.45 GHz in a multimode cavity. Conventional tests took place in a scheme where temperature was up to 1500 degrees C for 120 minutes. Microwave heating rate was not controlled and tests lasted 60 and 90 minutes, temperature was around 900 degrees C. Products of the pyrolysis were analyzed by means of x-ray diffraction; in the microwave case the diffraction patterns showed a strong background of either very fine particles or amorphous material, then infrared spectroscopy was also employed for confirming carbon bonds. In both processes beta-SiC was found as the only produced carbide.

  13. Single Molecule Source Reagents for CVD of Beta Silicon Carbide

    DTIC Science & Technology

    1991-08-31

    silicon carbide is an excellent candidate semiconductor material for demanding applications in high power and high temperature electronic devices due to its high breakdown voltage, relatively large band gap, high thermal conductivity and high melting point. Use of silicon carbide thin films is hampered, however, by the inability to reproducibly grow stoichiometric films free from excess silicon or carbon. The principal difficulty is that absolutely reproducible flows of the source gases cannot be provided with existing gas flow control equipment. The

  14. Formation of iron disilicide on amorphous silicon

    NASA Astrophysics Data System (ADS)

    Erlesand, U.; Östling, M.; Bodén, K.

    1991-11-01

    Thin films of iron disilicide, β-FeSi 2 were formed on both amorphous silicon and on crystalline silicon. The β-phase is reported to be semiconducting with a direct band-gap of about 0.85-0.89 eV. This phase is known to form via a nucleation-controlled growth process on crystalline silicon and as a consequence a rather rough silicon/silicide interface is usually formed. In order to improve the interface a bilayer structure of amorphous silicon and iron was sequentially deposited on Czochralski <111> silicon in an e-gun evaporation system. Secondary ion mass spectrometry profiling (SIMS) and scanning electron micrographs revealed an improvement of the interface sharpness. Rutherford backscattering spectrometry (RBS) and X-ray diffractiometry showed β-FeSi 2 formation already at 525°C. It was also observed that the silicide growth was diffusion-controlled, similar to what has been reported for example in the formation of NiSi 2 for the reaction of nickel on amorphous silicon. The kinetics of the FeSi 2 formation in the temperature range 525-625°C was studied by RBS and the activation energy was found to be 1.5 ± 0.1 eV.

  15. Inverted amorphous silicon solar cell utilizing cermet layers

    DOEpatents

    Hanak, Joseph J.

    1979-01-01

    An amorphous silicon solar cell incorporating a transparent high work function metal cermet incident to solar radiation and a thick film cermet contacting the amorphous silicon opposite to said incident surface.

  16. High precision optical finishing of lightweight silicon carbide aspheric mirror

    NASA Astrophysics Data System (ADS)

    Kong, John; Young, Kevin

    2010-10-01

    Critical to the deployment of large surveillance optics into the space environment is the generation of high quality optics. Traditionally, aluminum, glass and beryllium have been used; however, silicon carbide becomes of increasing interest and availability due to its high strength. With the hardness of silicon carbide being similar to diamond, traditional polishing methods suffer from slow material removal rates, difficulty in achieving the desired figure and inherent risk of causing catastrophic damage to the lightweight structure. Rather than increasing structural capacity and mass of the substrate, our proprietary sub-aperture aspheric surface forming technology offers higher material removal rates (comparable to that of Zerodur or Fused Silica), a deterministic approach to achieving the desired figure while minimizing contact area and the resulting load on the optical structure. The technology performed on computer-controlled machines with motion control software providing precise and quick convergence of surface figure, as demonstrated by optically finishing lightweight silicon carbide aspheres. At the same time, it also offers the advantage of ideal pitch finish of low surface micro-roughness and low mid-spatial frequency error. This method provides a solution applicable to all common silicon carbide substrate materials, including substrates with CVD silicon carbide cladding, offered by major silicon carbide material suppliers. This paper discusses a demonstration mirror we polished using this novel technology. The mirror is a lightweight silicon carbide substrate with CVD silicon carbide cladding. It is a convex hyperbolic secondary mirror with 104mm diameter and approximately 20 microns aspheric departure from best-fit sphere. The mirror has been finished with surface irregularity of better than 1/50 wave RMS @632.8 nm and surface micro-roughness of under 2 angstroms RMS. The technology has the potential to be scaled up for manufacturing capabilities of

  17. Separation of Nuclear Fuel Surrogates from Silicon Carbide Inert Matrix

    SciTech Connect

    Dr. Ronald Baney

    2008-12-15

    The objective of this project has been to identify a process for separating transuranic species from silicon carbide (SiC). Silicon carbide has become one of the prime candidates for the matrix in inert matrix fuels, (IMF) being designed to reduce plutonium inventories and the long half-lives actinides through transmutation since complete reaction is not practical it become necessary to separate the non-transmuted materials from the silicon carbide matrix for ultimate reprocessing. This work reports a method for that required process.l

  18. Field Emission of Thermally Grown Carbon Nanostructures on Silicon Carbide

    DTIC Science & Technology

    2012-03-22

    process, current CNT field emission issues, and patterning of silicon carbide ( SiC ). 2.2. CNT Background 2.2.1. CNT Structure CNT’s basic...density is obtain when S=3h [46] 2.5. Patterning of SiC 2.5.1. Silicon Carbide Properties As a result of its structure and material, SiC has...Its chemical inertness, however, limits the available techniques needed to pattern a SiC wafer. 2.5.2. Silicon Carbide Etching Because SiC

  19. Method of preparing silicon carbide particles dispersed in an electrolytic bath for composite electroplating of metals

    DOEpatents

    Peng, Yu-Min; Wang, Jih-Wen; Liue, Chun-Ying; Yeh, Shinn-Horng

    1994-01-01

    A method for preparing silicon carbide particles dispersed in an electrolytic bath for composite electroplating of metals includes the steps of washing the silicon carbide particles with an organic solvent; washing the silicon carbide particles with an inorganic acid; grinding the silicon carbide particles; and heating the silicon carbide particles in a nickel-containing solution at a boiling temperature for a predetermined period of time.

  20. Predicting Two-Dimensional Silicon Carbide Monolayers.

    PubMed

    Shi, Zhiming; Zhang, Zhuhua; Kutana, Alex; Yakobson, Boris I

    2015-10-27

    Intrinsic semimetallicity of graphene and silicene largely limits their applications in functional devices. Mixing carbon and silicon atoms to form two-dimensional (2D) silicon carbide (SixC1-x) sheets is promising to overcome this issue. Using first-principles calculations combined with the cluster expansion method, we perform a comprehensive study on the thermodynamic stability and electronic properties of 2D SixC1-x monolayers with 0 ≤ x ≤ 1. Upon varying the silicon concentration, the 2D SixC1-x presents two distinct structural phases, a homogeneous phase with well dispersed Si (or C) atoms and an in-plane hybrid phase rich in SiC domains. While the in-plane hybrid structure shows uniform semiconducting properties with widely tunable band gap from 0 to 2.87 eV due to quantum confinement effect imposed by the SiC domains, the homogeneous structures can be semiconducting or remain semimetallic depending on a superlattice vector which dictates whether the sublattice symmetry is topologically broken. Moreover, we reveal a universal rule for describing the electronic properties of the homogeneous SixC1-x structures. These findings suggest that the 2D SixC1-x monolayers may present a new "family" of 2D materials, with a rich variety of properties for applications in electronics and optoelectronics.

  1. Nanoporous Silicon Carbide for Nanoelectromechanical Systems Applications

    NASA Technical Reports Server (NTRS)

    Hossain, T.; Khan, F.; Adesida, I.; Bohn, P.; Rittenhouse, T.; Lienhard, Michael (Technical Monitor)

    2003-01-01

    A major goal of this project is to produce porous silicon carbide (PSiC) via an electroless process for eventual utilization in nanoscale sensing platforms. Results in the literature have shown a variety of porous morphologies in SiC produced in anodic cells. Therefore, predictability and reproducibility of porous structures are initial concerns. This work has concentrated on producing morphologies of known porosity, with particular attention paid toward producing the extremely high surface areas required for a porous flow sensor. We have conducted a parametric study of electroless etching conditions and characteristics of the resulting physical nanostructure and also investigated the relationship between morphology and materials properties. Further, we have investigated bulk etching of SiC using both photo-electrochemical etching and inductively-coupled-plasma reactive ion etching techniques.

  2. Temperature-dependent reflectivity of silicon carbide

    NASA Technical Reports Server (NTRS)

    Ng, Daniel

    1992-01-01

    The spectral reflectivity of a commercial silicon carbide (SiC) ceramic surface was measured at wavelengths from 2.5 to 14.5 microns and at temperatures ranging from 358 to 520 K using a NASA-developed multiwavelength pyrometer. The SiC surface reflectivity was low at the short wavelengths, decreasing to almost zero at 10 microns, then increasing rapidly to a maximum at approximately 12.5 microns, and decreasing gradually thereafter. The reflectivity maximum increased in magnitude with increasing surface temperature. The wavelength and temperature dependence can be explained in terms of the classical dispersion theory of crystals and the Lorentz electron theory. Electronic transitions between the donor state and the conduction band states were responsible for the dispersion. The concentration of the donor state in SiC was determined to be approximately 4 x 10 exp 18 and its ionization energy was determined to be approximately 71 meV.

  3. Condensation of Silicon Carbide in Supernova Ejecta

    NASA Astrophysics Data System (ADS)

    Deneault, Ethan

    2017-07-01

    We present a kinetic model of the formation of silicon carbide (SiC) in the expanding and cooling outflows of Type II supernova ejecta. We assume an ejecta cloud composed of a mixture of Si, C, and O in the gas phase, with the initial temperature, density, and composition as tunable parameters. The condensation of diatomic SiC into (SiC)2 molecules provides the abundance of nucleation sites for the eventual condensation of larger SiC solids and dust grains. We find that the abundance of these nucleation sites, formed after the first 1700 days after the explosion, is strongly governed by the C/Si ratio, the density of the gas, and the rate of cooling in the ejecta.

  4. Method of producing silicon carbide articles

    DOEpatents

    Milewski, John V.

    1985-01-01

    A method of producing articles comprising reaction-bonded silicon carbide (SiC) and graphite (and/or carbon) is given. The process converts the graphite (and/or carbon) in situ to SiC, thus providing the capability of economically obtaining articles made up wholly or partially of SiC having any size and shape in which graphite (and/or carbon) can be found or made. When the produced articles are made of an inner graphite (and/or carbon) substrate to which SiC is reaction bonded, these articles distinguish SiC-coated graphite articles found in the prior art by the feature of a strong bond having a gradual (as opposed to a sharply defined) interface which extends over a distance of mils. A method for forming SiC whisker-reinforced ceramic matrices is also given. The whisker-reinforced articles comprise SiC whiskers which substantially retain their structural integrity.

  5. Stored energy in irradiated silicon carbide

    SciTech Connect

    Snead, L.L.; Burchell, T.D.

    1997-04-01

    This report presents a short review of the phenomenon of Wigner stored energy release from irradiated graphite and discusses it in relation to neutron irradiation of silicon carbide. A single published work in the area of stored energy release in SiC is reviewed and the results are discussed. It appears from this previous work that because the combination of the comparatively high specific heat of SiC and distribution in activation energies for recombining defects, the stored energy release of SiC should only be a problem at temperatures lower than those considered for fusion devices. The conclusion of this preliminary review is that the stored energy release in SiC will not be sufficient to cause catastrophic heating in fusion reactor components, though further study would be desirable.

  6. Microwave hybrid synthesis of silicon carbide nanopowders

    SciTech Connect

    Ebadzadeh, Touradj Marzban-Rad, Ehsan

    2009-01-15

    Nanosized silicon carbide powders were synthesised from a mixture of silica gel and carbon through both the conventional and microwave heating methods. Reaction kinetics of SiC formation were found to exhibit notable differences for the samples heated in microwave field and furnace. In the conventional method SiC nanopowders can be synthesised after 105 min heating at 1500 deg. C in a coke-bed using an electrical tube furnace. Electron microscopy studies of these powders showed the existence of equiaxed SiC nanopowders with an average particle size of 8.2 nm. In the microwave heating process, SiC powders formed after 60 min; the powder consisted of a mixture of SiC nanopowders (with two average particle sizes of 13.6 and 58.2 nm) and particles in the shape of long strands (with an average diameter of 330 nm)

  7. Stable field emission from nanoporous silicon carbide.

    PubMed

    Kang, Myung-Gyu; Lezec, Henri J; Sharifi, Fred

    2013-02-15

    We report on a new type of stable field emitter capable of electron emission at levels comparable to thermal sources. Such an emitter potentially enables significant advances in several important technologies which currently use thermal electron sources. These include communications through microwave electronics, and more notably imaging for medicine and security where new modalities of detection may arise due to variable-geometry x-ray sources. Stable emission of 6 A cm(-2) is demonstrated in a macroscopic array, and lifetime measurements indicate these new emitters are sufficiently robust to be considered for realistic implementation. The emitter is a monolithic structure, and is made in a room-temperature process. It is fabricated from a silicon carbide wafer, which is formed into a highly porous structure resembling an aerogel, and further patterned into an array. The emission properties may be tuned both through control of the nanoscale morphology and the macroscopic shape of the emitter array.

  8. Development of a silicon carbide sewing thread

    NASA Technical Reports Server (NTRS)

    Sawko, Paul M.; Vasudev, Anand

    1989-01-01

    A silicon carbide (SiC) sewing thread has been designed which consists of a two-ply yarn in a 122 turns-per-meter-twist construction. Two processing aids in thread construction were evaluated. Prototype blankets were sewn using an SiC thread prepared either with polytetrafluoroethylene sizing or with an overwrap of rayon/dacron service yarn. The rayon/dacron-wrapped SiC thread was stronger, as shown by higher break-strength retention and less damage to the outer-mold-line fabric. This thread enables thermal protection system articles to be sewn or joined, or have perimeter close-out of assembled parts when using SiC fabric for high-temperature applications.

  9. Metal electrode for amorphous silicon solar cells

    DOEpatents

    Williams, Richard

    1983-01-01

    An amorphous silicon solar cell having an N-type region wherein the contact to the N-type region is composed of a material having a work function of about 3.7 electron volts or less. Suitable materials include strontium, barium and magnesium and rare earth metals such as gadolinium and yttrium.

  10. Silicon-Rich Silicon Carbide Hole-Selective Rear Contacts for Crystalline-Silicon-Based Solar Cells.

    PubMed

    Nogay, Gizem; Stuckelberger, Josua; Wyss, Philippe; Jeangros, Quentin; Allebé, Christophe; Niquille, Xavier; Debrot, Fabien; Despeisse, Matthieu; Haug, Franz-Josef; Löper, Philipp; Ballif, Christophe

    2016-12-28

    The use of passivating contacts compatible with typical homojunction thermal processes is one of the most promising approaches to realizing high-efficiency silicon solar cells. In this work, we investigate an alternative rear-passivating contact targeting facile implementation to industrial p-type solar cells. The contact structure consists of a chemically grown thin silicon oxide layer, which is capped with a boron-doped silicon-rich silicon carbide [SiCx(p)] layer and then annealed at 800-900 °C. Transmission electron microscopy reveals that the thin chemical oxide layer disappears upon thermal annealing up to 900 °C, leading to degraded surface passivation. We interpret this in terms of a chemical reaction between carbon atoms in the SiCx(p) layer and the adjacent chemical oxide layer. To prevent this reaction, an intrinsic silicon interlayer was introduced between the chemical oxide and the SiCx(p) layer. We show that this intrinsic silicon interlayer is beneficial for surface passivation. Optimized passivation is obtained with a 10-nm-thick intrinsic silicon interlayer, yielding an emitter saturation current density of 17 fA cm(-2) on p-type wafers, which translates into an implied open-circuit voltage of 708 mV. The potential of the developed contact at the rear side is further investigated by realizing a proof-of-concept hybrid solar cell, featuring a heterojunction front-side contact made of intrinsic amorphous silicon and phosphorus-doped amorphous silicon. Even though the presented cells are limited by front-side reflection and front-side parasitic absorption, the obtained cell with a Voc of 694.7 mV, a FF of 79.1%, and an efficiency of 20.44% demonstrates the potential of the p(+)/p-wafer full-side-passivated rear-side scheme shown here.

  11. Fabricating amorphous silicon solar cells by varying the temperature _of the substrate during deposition of the amorphous silicon layer

    DOEpatents

    Carlson, David E.

    1982-01-01

    An improved process for fabricating amorphous silicon solar cells in which the temperature of the substrate is varied during the deposition of the amorphous silicon layer is described. Solar cells manufactured in accordance with this process are shown to have increased efficiencies and fill factors when compared to solar cells manufactured with a constant substrate temperature during deposition of the amorphous silicon layer.

  12. A review of oxide, silicon nitride, and silicon carbide brazing

    SciTech Connect

    Santella, M.L.; Moorhead, A.J.

    1987-01-01

    There is growing interest in using ceramics for structural applications, many of which require the fabrication of components with complicated shapes. Normal ceramic processing methods restrict the shapes into which these materials can be produced, but ceramic joining technology can be used to overcome many of these limitations, and also offers the possibility for improving the reliability of ceramic components. One method of joining ceramics is by brazing. The metallic alloys used for bonding must wet and adhere to the ceramic surfaces without excessive reaction. Alumina, partially stabilized zirconia, and silicon nitride have high ionic character to their chemical bonds and are difficult to wet. Alloys for brazing these materials must be formulated to overcome this problem. Silicon carbide, which has some metallic characteristics, reacts excessively with many alloys, and forms joints of low mechanical strength. The brazing characteristics of these three types of ceramics, and residual stresses in ceramic-to-metal joints are briefly discussed.

  13. Conventional and Microwave Joining of Silicon Carbide Using Displacement Reactions

    NASA Technical Reports Server (NTRS)

    Kingsley, J.; Yiin, T.; Barmatz, M.

    1995-01-01

    Microwave heating was used to join Silicon Carbide rods using a thin TiC /Si tape interlayer . Microwaves quickly heated the rods and tape to temperatures where solid-state displacement reactions between TiC and Si occurred.

  14. Process for preparing fine grain silicon carbide powder

    DOEpatents

    Wei, G.C.

    Method of producing fine-grain silicon carbide powder comprises combining methyltrimethoxysilane with a solution of phenolic resin, acetone and water or sugar and water, gelling the resulting mixture, and then drying and heating the obtained gel.

  15. Impact-resistant silicon-carbide-based ceramic materials

    NASA Astrophysics Data System (ADS)

    Perevislov, S. N.; Bespalov, I. A.

    2017-08-01

    The bullet resistance is determined by an indirect method, by evaluation of time of delay of penetration by bullet of the silicon-carbide-based ceramics obtained by reactive sintering, liquid-phase sintering, and hot pressing.

  16. Conventional and Microwave Joining of Silicon Carbide Using Displacement Reactions

    NASA Technical Reports Server (NTRS)

    Kingsley, J.; Yiin, T.; Barmatz, M.

    1995-01-01

    Microwave heating was used to join Silicon Carbide rods using a thin TiC /Si tape interlayer . Microwaves quickly heated the rods and tape to temperatures where solid-state displacement reactions between TiC and Si occurred.

  17. Tribological properties of silicon carbide in metal removal process

    NASA Technical Reports Server (NTRS)

    Miyoshi, K.; Buckley, D. H.

    1980-01-01

    This paper reviews material properties of adhesion, friction and wear of single-crystal silicon carbide in contact with metals and alloys involved in a metal removal process such as grinding. The tribological properties in the metal removal processes are divided into properties which remove metal by adhesion between sliding surfaces, and metal removal by silicon carbide sliding against a metal, indenting it, and plowing a series of grooves or furrows. The paper also deals with fracture and deformation characteristics of the silicon carbide surface; the adhesion, friction and metal transfer to silicon carbide is related to the relative chemical activity of the metals. Atomic size and content of alloying elements play a dominant role in controlling adhesion and friction properties of alloys. The friction and abrasive wear decrease as the shear strength of the bulk metal increases.

  18. BETA-SILICON CARBIDE AND ITS POTENTIAL FOR DEVICES

    DTIC Science & Technology

    BETA- SILICON CARBIDE AND ITS POTENTIAL FOR DEVICES. GROWTH OF BETA SIC CRYSTALS FROM SOLUTION USING MOLTEN SI AS SOLVENT. INCREASED RESISTIVITY (FROM 0.5 TO 3.8 OHM/CM) ACCOMPANIED DECREASE IN N CONTAMINATION SOURCES.

  19. Silicon Carbide Threads For High-Temperature Service

    NASA Technical Reports Server (NTRS)

    Sawko, Paul M.; Vasudev, Anand

    1991-01-01

    New thread material outperforms silica. Sewing threads containing silicon carbide (SiC) yarn withstand temperatures of more than 1,100 degrees C. Intended for use in stitching thermally insulating blankets.

  20. Molecular dynamics simulations of nanoindentation and nanoscratching of silicon carbide

    NASA Astrophysics Data System (ADS)

    Noreyan, Alisa A.

    Parallel molecular dynamics simulations were carried out to investigate the interaction between a diamond indenter and silicon carbide during nanoindentation and nanoscratching. The dependence of the critical depth and pressure for the elastic-to-plastic transition on indentation velocity, tip size, and workpiece temperature was studied along with the nature of the deformation due to indentation and scratching. The two most widely used polytypes---cubic silicon carbide (3C-SiC) and hexagonal silicon carbide (6H-SiC)---were considered while the Si-terminated (001) ((0001)) surface was used in each case. Simulations were implemented using the Tersoff SiC potential, which accurately reproduces the lattice and elastic constants of 3C-SiC and 6H-SiC. Nanoindentation experiments were also carried out for 6H-SiC. For the 3C polytype, both the critical pressure and indentation depth for the elastic-to-plastic transition were found to decrease with increasing indenter size over the nanoscale range of indenter sizes used in our simulations. As a result, the measured hardness was found to be significantly higher than obtained experimentally for significantly larger indenter sizes. In addition, for indentation depths beyond the critical depth a phase transition to the rocksalt structure was observed. A similar phase transition was observed for the 6H polytype, but the transition pressure was found to be somewhat higher than for 3C-SiC. Both of these results are in good agreement with experimental results for bulk SiC. Thus, for nanoscale indentation of 3C and 6H-SiC, the onset of plastic behavior is related to the existence of a phase transition under the indenter tip. For the 6H case a weak dependence on indentation velocity was also observed. This claim was also confirmed by nanoindentation experiments, in which the strain rate sensitivity of mono-crystal 6H was investigated. Simulations of the nanoscratching of 3C-SiC were also carried out. Significant anisotropy in the

  1. Crystalline to amorphous transformation in silicon

    SciTech Connect

    Cheruvu, S.M.

    1982-09-01

    In the present investigation, an attempt was made to understand the fundamental mechanism of crystalline-to-amorphous transformation in arsenic implanted silicon using high resolution electron microscopy. A comparison of the gradual disappearance of simulated lattice fringes with increasing Frenkel pair concentration with the experimental observation of sharp interfaces between crystalline and amorphous regions was carried out leading to the conclusion that when the defect concentration reaches a critical value, the crystal does relax to an amorphous state. Optical diffraction experiments using atomic models also supported this hypothesis. Both crystalline and amorphous zones were found to co-exist with sharp interfaces at the atomic level. Growth of the amorphous fraction depends on the temperature, dose rate and the mass of the implanted ion. Preliminary results of high energy electron irradiation experiments at 1.2 MeV also suggested that clustering of point defects occurs near room temperature. An observation in a high resolution image of a small amorphous zone centered at the core of a dislocation is presented as evidence that the nucleation of an amorphous phase is heterogeneous in nature involving clustering or segregation of point defects near existing defects.

  2. Single-Event Effects in Silicon Carbide Power Devices

    NASA Technical Reports Server (NTRS)

    Lauenstein, Jean-Marie; Casey, Megan C.; LaBel, Kenneth A.; Ikpe, Stanley; Topper, Alyson D.; Wilcox, Edward P.; Kim, Hak; Phan, Anthony M.

    2015-01-01

    This report summarizes the NASA Electronic Parts and Packaging Program Silicon Carbide Power Device Subtask efforts in FY15. Benefits of SiC are described and example NASA Programs and Projects desiring this technology are given. The current status of the radiation tolerance of silicon carbide power devices is given and paths forward in the effort to develop heavy-ion single-event effect hardened devices indicated.

  3. Tribological properties of silicon carbide in metal removal process

    NASA Technical Reports Server (NTRS)

    Miyoshi, K.; Buckley, D. H.

    1980-01-01

    Material properties are considered as they relate to adhesion, friction, and wear of single crystal silicon carbide in contact with metals and alloys that are likely to be involved in a metal removal process such as grinding. Metal removal from adhesion between sliding surfaces in contact and metal removal as a result of the silicon carbide sliding against a metal, indenting into it, and plowing a series of grooves or furrows are discussed. Fracture and deformation characteristics of the silicon carbide surface are also covered. The adhesion, friction, and metal transfer to silicon carbide is related to the relative chemical activity of the metals. The more active the metal, the higher the adhesion and friction, and the greater the metal transfer to silicon carbide. Atomic size and content of alloying elements play a dominant role in controlling adhesion, friction, and abrasive wear properties of alloys. The friction and abrasive wear (metal removal) decrease linearly as the shear strength of the bulk metal increases. They decrease as the solute to solvent atomic radius ratio increases or decreases linearly from unity, and with an increase of solute content. The surface fracture of silicon carbide is due to cleavages of 0001, 10(-1)0, and/or 11(-2)0 planes.

  4. Friction and wear behavior of single-crystal silicon carbide in contact with titanium

    NASA Technical Reports Server (NTRS)

    Miyoshi, K.; Buckley, D. H.

    1977-01-01

    Sliding friction experiments were conducted with single crystal silicon carbide in sliding contact with titanium. Results indicate that the friction coefficient is greater in vacuum than in argon and that this is due to the greater adhesion or adhesive transfer in vacuum. Thin films of silicon carbide transferred to titanium also adhered to silicon carbide both in argon at atmospheric pressure and in high vacuum. Cohesive bonds fractured on both the silicon carbide and titanium surfaces. The wear debris of silicon carbide created by fracture plowed the silicon carbide surface in a plastic manner. The friction characteristics of titanium in contact with silicon carbide were sensitive to the surface roughness of silicon carbide, and the friction coefficients were higher for a rough surface of silicon carbide than for a smooth one. The difference in friction results was due to plastic deformation (plowing of titanium).

  5. Thermal properties of wood-derived silicon carbide and copper-silicon carbide composites

    NASA Astrophysics Data System (ADS)

    Pappecena, Kristen E.

    Wood-derived ceramics and composites have been of interest in recent years due to their unique microstructures, which lead to tailorable properties. The porosity and pore size distribution of each wood type is different, which yields variations in properties in the resultant materials. The thermal properties of silicon carbide ceramics and copper-silicon carbide composites derived from wood were studied as a function of their pore structures. Wood was pyrolyzed at temperatures ranging from 300-2400°C to yield porous carbon. The progression toward long-range order was studied as a function of pyrolyzation temperature. Biomorphic silicon carbide (bioSiC) is a porous ceramic material resulting from silicon melt infiltration of these porous carbon materials. BioSiC has potential applicability in many high temperature environments, particularly those in which rapid temperature changes occur. To understand the behavior of bioSiC at elevated temperatures, the thermal and thermo-mechanical properties were studied. The thermal conductivity of bioSiC from five precursors was determined using flash diffusivity at temperatures up to 1100°C. Thermal conductivity results varied with porosity, temperature and orientation, and decreased from 42-13 W/mK for porosities of 43-69%, respectively, at room temperature. The results were compared with to object-oriented finite-element analysis (OOF). OOF was also used to model and understand the heat-flow paths through the complex bioSiC microstructures. The thermal shock resistance of bioSiC was also studied, and no bioSiC sample was found to fail catastrophically after up to five thermal shock cycles from 1400°C to room temperature oil. Copper-silicon carbide composites have potential uses in thermal management applications due to the high thermal conductivity of each phase. Cu-bioSiC composites were created by electrodeposition of copper into bioSiC pores. The detrimental Cu-SiC reaction was avoided by using this room temperature

  6. Single-Event Effects in Silicon and Silicon Carbide Power Devices

    NASA Technical Reports Server (NTRS)

    Lauenstein, Jean-Marie; Casey, Megan C.; LaBel, Kenneth A.; Topper, Alyson D.; Wilcox, Edward P.; Kim, Hak; Phan, Anthony M.

    2014-01-01

    NASA Electronics Parts and Packaging program-funded activities over the past year on single-event effects in silicon and silicon carbide power devices are presented, with focus on SiC device failure signatures.

  7. Ion bombardment and disorder in amorphous silicon

    SciTech Connect

    Sidhu, L.S.; Gaspari, F.; Zukotynski, S.

    1997-07-01

    The effect of ion bombardment during growth on the structural and optical properties of amorphous silicon are presented. Two series of films were deposited under electrically grounded and positively biased substrate conditions. The biased samples displayed lower growth rates and increased hydrogen content relative to grounded counterparts. The film structure was examined using Raman spectroscopy. The transverse optic like phonon band position was used as a parameter to characterize network order. Biased samples displayed an increased order of the amorphous network relative to grounded samples. Furthermore, biased samples exhibited a larger optical gap. These results are correlated and attributed to reduced ion bombardment effects.

  8. Process for coating an object with silicon carbide

    NASA Technical Reports Server (NTRS)

    Levin, Harry (Inventor)

    1989-01-01

    A process for coating a carbon or graphite object with silicon carbide by contacting it with silicon liquid and vapor over various lengths of contact time. In the process, a stream of silicon-containing precursor material in gaseous phase below the decomposition temperature of said gas and a co-reactant, carrier or diluent gas such as hydrogen is passed through a hole within a high emissivity, thin, insulating septum into a reaction chamber above the melting point of silicon. The thin septum has one face below the decomposition temperature of the gas and an opposite face exposed to the reaction chamber. The precursor gas is decomposed directly to silicon in the reaction chamber. A stream of any decomposition gas and any unreacted precursor gas from said reaction chamber is removed. The object within the reaction chamber is then contacted with silicon, and recovered after it has been coated with silicon carbide.

  9. Structural characterization of stable amorphous silicon films

    NASA Astrophysics Data System (ADS)

    Zhang, Shibin; Kong, Guanglin; Wang, Yongqian; Sheng, Shuran; Liao, Xianbo

    2002-05-01

    A kind of hydrogenated diphasic silicon films has been prepared by a new regime of plasma enhanced chemical vapor deposition (PECVD) in the region adjacent to the phase transition from amorphous to crystalline state. The photoelectronic and microstructural properties of the films have been investigated by the constant photocurrent method (CPM), Raman scattering and nuclear magnetic resonance (NMR). Our experimental results and corresponding analyses showed that the diphasic films, incorporated with a subtle boron compensation, could gain both the fine photosensitivity and high stability, provided the crystalline fraction ( f) was controlled in the range of 0< f<0.3. When compared with the conventional hydrogenated amorphous silicon (a-Si:H), the diphasic films are more ordered and robust in the microstructure, and have a less clustered phase in the Si-H bond configurations.

  10. Amorphous metallic films in silicon metallization systems

    NASA Astrophysics Data System (ADS)

    So, F.; Kolawa, E.; Nicolet, M. A.

    1985-06-01

    Diffusion barrier research was focussed on lowering the chemical reactivity of amorphous thin films on silicon. An additional area of concern is the reaction with metal overlays such as aluminum, silver, and gold. Gold was included to allow for technology transfer to gallium arsenide PV cells. Amorphous tungsten nitride films have shown much promise. Stability to annealing temperatures of 700, 800, and 550 C were achieved for overlays of silver, gold, and aluminum, respectively. The lower results for aluminum were not surprising because there is an eutectic that can form at a lower temperature. It seems that titanium and zirconium will remove the nitrogen from a tungsten nitride amorphous film and render it unstable. Other variables of research interest were substrate bias and base pressure during sputtering.

  11. Amorphous metallic films in silicon metallization systems

    NASA Technical Reports Server (NTRS)

    So, F.; Kolawa, E.; Nicolet, M. A.

    1985-01-01

    Diffusion barrier research was focussed on lowering the chemical reactivity of amorphous thin films on silicon. An additional area of concern is the reaction with metal overlays such as aluminum, silver, and gold. Gold was included to allow for technology transfer to gallium arsenide PV cells. Amorphous tungsten nitride films have shown much promise. Stability to annealing temperatures of 700, 800, and 550 C were achieved for overlays of silver, gold, and aluminum, respectively. The lower results for aluminum were not surprising because there is an eutectic that can form at a lower temperature. It seems that titanium and zirconium will remove the nitrogen from a tungsten nitride amorphous film and render it unstable. Other variables of research interest were substrate bias and base pressure during sputtering.

  12. High resolution amorphous silicon radiation detectors

    DOEpatents

    Street, R.A.; Kaplan, S.N.; Perez-Mendez, V.

    1992-05-26

    A radiation detector employing amorphous Si:H cells in an array with each detector cell having at least three contiguous layers (n-type, intrinsic, p-type), positioned between two electrodes to which a bias voltage is applied. An energy conversion layer atop the silicon cells intercepts incident radiation and converts radiation energy to light energy of a wavelength to which the silicon cells are responsive. A read-out device, positioned proximate to each detector element in an array allows each such element to be interrogated independently to determine whether radiation has been detected in that cell. The energy conversion material may be a layer of luminescent material having a columnar structure. In one embodiment a column of luminescent material detects the passage therethrough of radiation to be detected and directs a light beam signal to an adjacent a-Si:H film so that detection may be confined to one or more such cells in the array. One or both electrodes may have a comb structure, and the teeth of each electrode comb may be interdigitated for capacitance reduction. The amorphous Si:H film may be replaced by an amorphous Si:Ge:H film in which up to 40 percent of the amorphous material is Ge. Two dimensional arrays may be used in X-ray imaging, CT scanning, crystallography, high energy physics beam tracking, nuclear medicine cameras and autoradiography. 18 figs.

  13. High resolution amorphous silicon radiation detectors

    DOEpatents

    Street, Robert A.; Kaplan, Selig N.; Perez-Mendez, Victor

    1992-01-01

    A radiation detector employing amorphous Si:H cells in an array with each detector cell having at least three contiguous layers (n type, intrinsic, p type), positioned between two electrodes to which a bias voltage is applied. An energy conversion layer atop the silicon cells intercepts incident radiation and converts radiation energy to light energy of a wavelength to which the silicon cells are responsive. A read-out device, positioned proximate to each detector element in an array allows each such element to be interrogated independently to determine whether radiation has been detected in that cell. The energy conversion material may be a layer of luminescent material having a columnar structure. In one embodiment a column of luminescent material detects the passage therethrough of radiation to be detected and directs a light beam signal to an adjacent a-Si:H film so that detection may be confined to one or more such cells in the array. One or both electrodes may have a comb structure, and the teeth of each electrode comb may be interdigitated for capacitance reduction. The amorphous Si:H film may be replaced by an amorphous Si:Ge:H film in which up to 40 percent of the amorphous material is Ge. Two dimensional arrays may be used in X-ray imaging, CT scanning, crystallography, high energy physics beam tracking, nuclear medicine cameras and autoradiography.

  14. Methods for producing silicon carbide architectural preforms

    NASA Technical Reports Server (NTRS)

    DiCarlo, James A. (Inventor); Yun, Hee (Inventor)

    2010-01-01

    Methods are disclosed for producing architectural preforms and high-temperature composite structures containing high-strength ceramic fibers with reduced preforming stresses within each fiber, with an in-situ grown coating on each fiber surface, with reduced boron within the bulk of each fiber, and with improved tensile creep and rupture resistance properties for each fiber. The methods include the steps of preparing an original sample of a preform formed from a pre-selected high-strength silicon carbide ceramic fiber type, placing the original sample in a processing furnace under a pre-selected preforming stress state and thermally treating the sample in the processing furnace at a pre-selected processing temperature and hold time in a processing gas having a pre-selected composition, pressure, and flow rate. For the high-temperature composite structures, the method includes additional steps of depositing a thin interphase coating on the surface of each fiber and forming a ceramic or carbon-based matrix within the sample.

  15. Material testing of silicon carbide mirrors

    NASA Astrophysics Data System (ADS)

    Witkin, David B.; Palusinski, Iwona A.

    2009-08-01

    The Aerospace Corporation is developing a space qualification method for silicon carbide optical systems that covers material verification through system development. One of the initial efforts has been to establish testing protocols for material properties. Three different tests have been performed to determine mechanical properties of SiC: modulus of rupture, equibiaxial flexural strength and fracture toughness. Testing materials and methods have been in accordance with the respective ASTM standards. Material from four vendors has been tested to date, as part of the MISSE flight program and other programs. Data analysis has focused on the types of issues that are important when building actual components- statistical modeling of test results, understanding batch-to-batch or other source material variations, and relating mechanical properties to microstructures. Mechanical properties are needed as inputs to design trade studies and development and analysis of proof tests, and to confirm or understand the results of non-destructive evaluations of the source materials. Measuring these properties using standardized tests on a statistically valid number of samples is intended to increase confidence for purchasers of SiC spacecraft components that materials and structures will perform as intended at the highest level of reliability.

  16. Thin films in silicon carbide semiconductor devices

    NASA Astrophysics Data System (ADS)

    Ostling, Mikael; Koo, Sang-Mo; Lee, Sang-Kwon; Zetterling, Carl-Mikael; Grishin, Alexander

    2004-12-01

    Silicon carbide (SiC) semiconductor devices have been established during the last decade as very useful high power, high speed and high temperature devices because of their inherent outstanding semiconductor materials properties. Due to its large band gap, SiC possesses a very high breakdown field and low intrinsic carrier concentration, which accordingly makes high voltage and high temperature operation possible. SiC is also suitable for high frequency device applications, because of the high saturation drift velocity and low permittivity. Thin film technology for various functions in the devices has been heavily researched. Suitable thin film technologies for Ohmic and low-resistive contact formation, passivation and new functionality utilizing ferroelectric materials have been developed. In ferroelectrics, the spontaneous polarization can be switched by an externally applied electric field, and thus are attractive for non-volatile memory and sensor applications. A novel integration of Junction-MOSFETs (JMOSFETs) and Nonvolatile FETs (NVFETs) on a single 4H-SiC substrate is realized. SiC JMOSFET controls the drain current effectively from the buried junction gate thereby allowing for a constant current level at elevated temperatures. SiC NVFET has similar functions with non-volatile memory capability due to ferroelectric gate stack, which operated up to 300°C with memory function retained up to 200°C.

  17. Improved silicon carbide for advanced heat engines

    NASA Technical Reports Server (NTRS)

    Whalen, Thomas J.

    1989-01-01

    The development of high strength, high reliability silicon carbide parts with complex shapes suitable for use in advanced heat engines is studied. Injection molding was the forming method selected for the program because it is capable of forming complex parts adaptable for mass production on an economically sound basis. The goals were to reach a Weibull characteristic strength of 550 MPa (80 ksi) and a Weibull modulus of 16 for bars tested in four-point loading. Statistically designed experiments were performed throughout the program and a fluid mixing process employing an attritor mixer was developed. Compositional improvements in the amounts and sources of boron and carbon used and a pressureless sintering cycle were developed which provided samples of about 99 percent of theoretical density. Strengths were found to improve significantly by annealing in air. Strengths in excess of 550 MPa (80 ksi) with Weibull modulus of about 9 were obtained. Further improvements in Weibull modulus to about 16 were realized by proof testing. This is an increase of 86 percent in strength and 100 percent in Weibull modulus over the baseline data generated at the beginning of the program. Molding yields were improved and flaw distributions were observed to follow a Poisson process. Magic angle spinning nuclear magnetic resonance spectra were found to be useful in characterizing the SiC powder and the sintered samples. Turbocharger rotors were molded and examined as an indication of the moldability of the mixes which were developed in this program.

  18. Palladium Implanted Silicon Carbide for Hydrogen Sensing

    NASA Technical Reports Server (NTRS)

    Muntele, C. I.; Ila, D.; Zimmerman, R. L.; Muntele, L.; Poker, D. B.; Hensley, D. K.; Larkin, David (Technical Monitor)

    2001-01-01

    Silicon carbide is intended for use in fabrication of high-temperature, efficient hydrogen sensors. Traditionally, when a palladium coating is applied on the exposed surface of SiC, the chemical reaction between palladium and hydrogen produces a detectable change in the surface chemical potential. We have produced both a palladium coated SiC as well as a palladium, ion implanted SiC sensor. The palladium implantation was done at 500 C into the Si face of 6H, N-type SiC at various energies, and at various fluences. Then, we measured the hydrogen sensitivity response of each fabricated sensor by exposing them to hydrogen while monitoring the current flow across the p-n junction(s), with respect to time. The sensitivity of each sensor was measured at temperatures between 27 and 300 C. The response of the SiC sensors produced by Pd implantation has revealed a completely different behaviour than the SiC sensors produced by Pd deposition. In the Pd-deposited SiC sensors as well as in the ones reported in the literature, the current rises in the presence of hydrogen at room temperature as well as at elevated temperatures. In the case of Pd-implanted SiC sensors, the current decreases in the presence of hydrogen whenever the temperature is raised above 100 C. We will present the details and conclusions from the results obtained during this meeting.

  19. Resonant Optical Forces in Silicon Carbide Nanostructures

    NASA Astrophysics Data System (ADS)

    Li, Dongfang; Zia, Rashid

    2012-02-01

    Silicon carbide (SiC) materials are widely used for their exceptional electronic, mechanical, and thermal properties. For example, given its high stiffness to density ratio, SiC is an ideal material for mechanical resonators, and it has been explored for applications in nanoelectromechanical systems (NEMS). SiC also supports strong surface phonon-polariton resonances in the infrared region, which could enable its use for optomechanics. Similar to surface plasmon-polaritons supported by metal-dielectric interfaces, these surface waves at a SiC-vacuum interface can be used to guide and confine intense electromagnetic energy. Here, we investigate the resonant optical forces induced by phonon-polariton modes in different SiC nanostructures. Specifically, we calculate optical forces using the Maxwell Stress Tensor for three geometries: spherical particles, slab waveguides, and rectangular waveguides. We find that the high quality factor phonon-polariton modes in SiC can produce very large forces, more than two orders of magnitude larger than the plasmonic forces in similar metal nanostructures. These strong resonant forces, combined with its mechanical and thermal properties, make SiC a promising material for optomechanical applications.

  20. Large silicon carbide optics for manufacturability

    NASA Astrophysics Data System (ADS)

    Pepi, John W.; Robichaud, Joseph; Milsap, Gary

    2013-09-01

    For space-based use, projected needs are for large optics of the one-meter class that lie under 30 kg/m2 in mass areal density. Current space programs using glass optics, such as Kepler, exhibit a mass of 45 kg/m2, while JWST beryllium optics, including hardware attachment, are as low as 18 kg/m2. Silicon carbide optics can be made lighter than glass, although not as light as beryllium; however, distinct advantages in thermal conductivity and expansion coefficient are evidenced at all temperatures, allowing for greater thermal flux , minimizing gradients and maximizing performance, both earth and space looking. For manufacturability and production, it is desirable to minimize weight while maintaining reasonable cell spacing for open back lightweight design, which will reduce both cost and risk. To this end we perform a trade study to design such an optic that meets both mass and stiffness requirements while being within the regime of ease of manufacture. The design study chooses a hexagonal segment, 1.2 meters across flats (1.4 meters corner to corner), mimicking the JWST design. Polishing, mounting, test, and environmental operational errors are duly considered.

  1. Palladium Implanted Silicon Carbide for Hydrogen Sensing

    NASA Technical Reports Server (NTRS)

    Muntele, C. I.; Ila, D.; Zimmerman, R. L.; Muntele, L.; Poker, D. B.; Hensley, D. K.; Larkin, David (Technical Monitor)

    2001-01-01

    Silicon carbide is intended for use in fabrication of high-temperature, efficient hydrogen sensors. Traditionally, when a palladium coating is applied on the exposed surface of SiC, the chemical reaction between palladium and hydrogen produces a detectable change in the surface chemical potential. We have produced both a palladium coated SiC as well as a palladium, ion implanted SiC sensor. The palladium implantation was done at 500 C into the Si face of 6H, N-type SiC at various energies, and at various fluences. Then, we measured the hydrogen sensitivity response of each fabricated sensor by exposing them to hydrogen while monitoring the current flow across the p-n junction(s), with respect to time. The sensitivity of each sensor was measured at temperatures between 27 and 300 C. The response of the SiC sensors produced by Pd implantation has revealed a completely different behaviour than the SiC sensors produced by Pd deposition. In the Pd-deposited SiC sensors as well as in the ones reported in the literature, the current rises in the presence of hydrogen at room temperature as well as at elevated temperatures. In the case of Pd-implanted SiC sensors, the current decreases in the presence of hydrogen whenever the temperature is raised above 100 C. We will present the details and conclusions from the results obtained during this meeting.

  2. Silicon Carbide Technologies for Lightweighted Aerospace Mirrors

    NASA Astrophysics Data System (ADS)

    Matson, L.; Chen, M.; Deblonk, B.; Palusinski, I.

    The use of monolithic glass and beryllium to produce lightweighted aerospace mirror systems has reached its limits due to the long lead times, high processing costs, environmental effects and launch load/weight requirements. New material solutions and manufacturing processes are required to meet DoD's directed energy weapons, reconnaissance/surveillance, and secured communications needs. Over the past several years the Air Force, MDA, and NASA has focused their efforts on the fabrication, lightweighting, and scale-up of numerous silicon carbide (SiC) based materials. It is anticipated that SiC can be utilized for most applications from cryogenic to high temperatures. This talk will focus on describing the SOA for these (near term) SiC technology solutions for making mirror structural substrates, figuring and finishing technologies being investigated to reduce cost time and cost, and non-destructive evaluation methods being investigated to help eliminate risk. Mirror structural substrates made out of advanced engineered materials (far term solutions) such as composites, foams, and microsphere arrays for ultra lightweighting will also be briefly discussed.

  3. A simple route to nanocrystalline silicon carbide

    NASA Astrophysics Data System (ADS)

    Ying, Yongcheng; Gu, Yunle; Li, Zhefeng; Gu, Hongzhou; Cheng, Luyang; Qian, Yitai

    2004-11-01

    Nanocrystalline silicon carbide has been prepared via reacting magnesium silicide (Mg 2Si) with carbon tetrachloride (CCl 4) in an autoclave at 450-600°C. X-ray diffraction patterns of the products can be indexed as the cubic cell of SiC with the lattice constant, a=4.352 Å, in good agreement with a=4.349 Å (JCPDS card No. 75-0254). The transmission electron microscopy images show that the sample mainly consists of nanoparticles with an average size from 30 to 80 nm co-existing with a small fraction of nanorods and nanowires. Typically the nanorods range from 20 to 40 nm in diameter and the nanowires have diameters of 20 nm and lengths up to 10 μm. The Raman spectrum shows a characteristic sharp peak at 790 cm -1. X-ray photoelectron spectra (XPS) gives an atomic ratio of Si to C as 1.08:1.00 from the quantification of the peak intensities. Photoluminescence spectrum reveals that the SiC sample emits ultraviolet light of 328 nm. A possible mechanism and the influence of temperature on the formation of crystalline SiC are proposed.

  4. Thermal equation of state of silicon carbide

    DOE PAGES

    Wang, Yuejian; Liu, Zhi T. Y.; Khare, Sanjay V.; ...

    2016-02-11

    A large volume press coupled with in-situ energy-dispersive synchrotron X-ray was used to probe the change of silicon carbide (SiC) under high pressure and temperature (P-T) up to 8.1 GPa and 1100 K. The obtained pressure–volume–temperature (P-V-T) data were fitted to a modified high-T Birch-Murnaghan equation of state, yielding values of a series of thermo-elastic parameters, such as, the ambient bulk modulus KTo = 237(2) GPa, temperature derivative of bulk modulus at constant pressure (∂K/∂T)P = -0.037(4) GPa K-1, volumetric thermal expansivity α(0, T)=a+bT with a = 5.77(1)×10-6 K-1 and b = 1.36(2)×10-8 K-2, and pressure derivative of thermal expansionmore » at constant temperature (∂α/∂P)T =6.53±0.64×10-7 K-1GPa-1. Furthermore, we found the temperature derivative of bulk modulus at constant volume, (∂KT/∂T)V, equal to -0.028(4) GPa K-1 by using a thermal pressure approach. In addition, the elastic properties of SiC were determined by density functional theory through the calculation of Helmholtz free energy. Lastly, the computed results generally agree well with the experimental values.« less

  5. Ultrahigh-quality silicon carbide single crystals.

    PubMed

    Nakamura, Daisuke; Gunjishima, Itaru; Yamaguchi, Satoshi; Ito, Tadashi; Okamoto, Atsuto; Kondo, Hiroyuki; Onda, Shoichi; Takatori, Kazumasa

    2004-08-26

    Silicon carbide (SiC) has a range of useful physical, mechanical and electronic properties that make it a promising material for next-generation electronic devices. Careful consideration of the thermal conditions in which SiC [0001] is grown has resulted in improvements in crystal diameter and quality: the quantity of macroscopic defects such as hollow core dislocations (micropipes), inclusions, small-angle boundaries and long-range lattice warp has been reduced. But some macroscopic defects (about 1-10 cm(-2)) and a large density of elementary dislocations (approximately 10(4) cm(-2)), such as edge, basal plane and screw dislocations, remain within the crystal, and have so far prevented the realization of high-efficiency, reliable electronic devices in SiC (refs 12-16). Here we report a method, inspired by the dislocation structure of SiC grown perpendicular to the c-axis (a-face growth), to reduce the number of dislocations in SiC single crystals by two to three orders of magnitude, rendering them virtually dislocation-free. These substrates will promote the development of high-power SiC devices and reduce energy losses of the resulting electrical systems.

  6. The diffusion bonding of silicon carbide and boron carbide using refractory metals

    SciTech Connect

    Cockeram, B.V.

    1999-10-01

    Joining is an enabling technology for the application of structural ceramics at high temperatures. Metal foil diffusion bonding is a simple process for joining silicon carbide or boron carbide by solid-state, diffusive conversion of the metal foil into carbide and silicide compounds that produce bonding. Metal diffusion bonding trials were performed using thin foils (5 {micro}m to 100 {micro}m) of refractory metals (niobium, titanium, tungsten, and molybdenum) with plates of silicon carbide (both {alpha}-SiC and {beta}-SiC) or boron carbide that were lapped flat prior to bonding. The influence of bonding temperature, bonding pressure, and foil thickness on bond quality was determined from metallographic inspection of the bonds. The microstructure and phases in the joint region of the diffusion bonds were evaluated using SEM, microprobe, and AES analysis. The use of molybdenum foil appeared to result in the highest quality bond of the metal foils evaluated for the diffusion bonding of silicon carbide and boron carbide. Bonding pressure appeared to have little influence on bond quality. The use of a thinner metal foil improved the bond quality. The microstructure of the bond region produced with either the {alpha}-SiC and {beta}-SiC polytypes were similar.

  7. Rapid thermal annealing and crystallization mechanisms study of silicon nanocrystal in silicon carbide matrix

    PubMed Central

    2011-01-01

    In this paper, a positive effect of rapid thermal annealing (RTA) technique has been researched and compared with conventional furnace annealing for Si nanocrystalline in silicon carbide (SiC) matrix system. Amorphous Si-rich SiC layer has been deposited by co-sputtering in different Si concentrations (50 to approximately 80 v%). Si nanocrystals (Si-NC) containing different grain sizes have been fabricated within the SiC matrix under two different annealing conditions: furnace annealing and RTA both at 1,100°C. HRTEM image clearly reveals both Si and SiC-NC formed in the films. Much better "degree of crystallization" of Si-NC can be achieved in RTA than furnace annealing from the research of GIXRD and Raman analysis, especially in high-Si-concentration situation. Differences from the two annealing procedures and the crystallization mechanism have been discussed based on the experimental results. PMID:21711625

  8. Method for forming fibrous silicon carbide insulating material

    DOEpatents

    Wei, G.C.

    1983-10-12

    A method whereby silicon carbide-bonded SiC fiber composites are prepared from carbon-bonded C fiber composites is disclosed. Carbon-bonded C fiber composite material is treated with gaseous silicon monoxide generated from the reaction of a mixture of colloidal silica and carbon black at an elevated temperature in an argon atmosphere. The carbon in the carbon bond and fiber is thus chemically converted to SiC resulting in a silicon carbide-bonded SiC fiber composite that can be used for fabricating dense, high-strength high-toughness SiC composites or as thermal insulating materials in oxidizing environments.

  9. Method for forming fibrous silicon carbide insulating material

    DOEpatents

    Wei, George C.

    1984-01-01

    A method whereby silicon carbide-bonded SiC fiber composites are prepared from carbon-bonded C fiber composites is disclosed. Carbon-bonded C fiber composite material is treated with gaseous silicon monoxide generated from the reaction of a mixture of colloidal silica and carbon black at an elevated temperature in an argon atmosphere. The carbon in the carbon bond and fiber is thus chemically converted to SiC resulting in a silicon carbide-bonded SiC fiber composite that can be used for fabricating dense, high-strength high-toughness SiC composites or as thermal insulating materials in oxidizing environments.

  10. Surface Figure Measurement of Silicon Carbide Mirrors at Cryogenic Temperatures

    NASA Technical Reports Server (NTRS)

    Blake, Peter; Mink, Ronald G.; Chambers, John; Robinson, F. David; Content, David; Davila, Pamela

    2005-01-01

    The surface figure of a developmental silicon carbide mirror, cooled to 87 K and then 20 K within a cryostat, was measured with unusually high precision at the Goddard Space Flight Center (GSFC). The concave spherical mirror, with a radius of 600 mm and a clear aperture of 150 mm, was fabricated of sintered silicon carbide. The mirror was mounted to an interface plate representative of an optical bench, made of the material Cesic@, a composite of silicon, carbon, and silicon carbide. The change in optical surface figure as the mirror and interface plate cooled from room temperature to 20 K was 3.7 nm rms, with a standard uncertainty of 0.23 nm in the rms statistic. Both the cryo-change figure and the uncertainty are among the lowest such figures yet published. This report describes the facilities, experimental methods, and uncertainty analysis of the measurements.

  11. Occurrence of airborne silicon carbide fibers during industrial production of silicon carbide.

    PubMed

    Bye, E; Eduard, W; Gjønnes, J; Sørbrøden, E

    1985-04-01

    Airborne dust from the production of silicon carbide has been analyzed for particle morphology and composition. Fibers of alpha silicon carbide were identified by scanning electron microscopy (SEM) combined with energy dispersive X-ray spectrometry (EDS) and transmission electron microscopy (TEM) with selected area electron diffraction techniques (SAED). Micrographs taken at high magnification revealed several stacking periods along the fiber axis, and one or more of the polytypes 2H, 4H, or 6H could be distinguished. Preliminary investigations applying SEM showed that 80% of the fibers had diameters of less than 0.5 micron and a length greater than 5 micron. Fiber concentrations were examined by the counting of stationary and personal samples in an optical phase contrast microscope. The fiber levels in the three plants investigated were low and less than 1 fiber/cc of air (10(6) fibers/m3). Dust samples from the handling of raw material, including recycled material, contained up to 5 fibers/cc (5 X 10(6) fibers/m3).

  12. Low Power Phase Change Memory using Silicon Carbide as a Heater Layer

    NASA Astrophysics Data System (ADS)

    Aziz, M. S.; Yin, Y.; Hosaka, S.; Mohammed, Z.; Alip, R. I.

    2015-11-01

    The amorphous to crystalline transition of germanium-antimony-tellurium (GST) using two types heating element was investigated. With separate heater structure, simulation was done using COMSOL Multiphysic 5.0. Silicon carbide (SiC) and Titanium Sitride (TiSi3) has been selected as a heater and differences of them have been studied. The voltage boundary is 0.905V and temperature of the memory layer is 463K when using SIC as a heater. While the voltage boundary and temperature of memory layer when using TiSi3 are 1.103 V and 459K respectively. Based on the result of a simulation, the suitable material of heater layer for separate heater structure is Silicon carbide (SiC) compared with Titanium Sitride (TiSi3).

  13. Microwave versus conventional sintering of silicon carbide tiles

    SciTech Connect

    Kass, M.D.; Caughman, J.B.O.; Forrester, S.C.; Akerman, A.

    1997-05-07

    Silicon carbide is being evaluated as an armor material because of its lightweight, high-hardness, and excellent armor efficiency. However, one of the problems associated with silicon carbide is the high cost associated with achieving fully dense tiles. Full density requires either hot pressing and sintering or reaction bonding. Past efforts have shown that hot pressed tiles have a higher armor efficiency than those produced by reaction bonded sintering. An earlier stuy showed that the acoustic properties of fully-dense silicon carbide tiles were enhanced through the use of post-sintered microwave heat treatments. One of the least expensive forming techniques is to isostatically press-and-sinter. In this study, the authors have used microwave energy to densify silicon carbide green bodies. Microwave sintering has been demonstrated to be a very quick way to sinter ceramics such as alumina to exceptionally high densities. Previous work has shown that microwave post treatment of fully-dense reaction bonded silicon carbide tiles significantly improves the acoustic properties of the tiles. These properties include Poisson`s ratio, Young`s modulus, shear modulus, and bulk modulus.

  14. Enhanced Sintering of Boron Carbide-Silicon Composites by Silicon

    NASA Astrophysics Data System (ADS)

    Zeng, Xiaojun; Liu, Weiliang

    2016-11-01

    Boron carbide (B4C)-silicon (Si) composites have been prepared by aqueous tape casting, laminating, and spark plasma sintering (SPS). The influences of silicon (Si) content on the phases, microstructure, sintering properties, and mechanical properties of the obtained B4C-Si composites are studied. The results indicate that the addition of Si powder can act as a sintering aid and contribute to the sintering densification. The addition of Si powder can also act as a second phase and contribute to the toughening for composites. The relative density of B4C-Si composites samples with adding 10 wt.% Si powder prepared by SPS at 1600 °C and 50 MPa for 8 min is up to 98.3%. The bending strength, fracture toughness, and Vickers hardness of the sintered samples are 518.5 MPa, 5.87 MPa m1/2, and 38.9 GPa, respectively. The testing temperature-dependent high-temperature bending strength and fracture toughness can reach a maximum value at 1350 °C. The B4C-Si composites prepared at 1600, 1650, and 1700 °C have good high-temperature mechanical properties. This paper provides a facile low-temperature sintering route for B4C ceramics with improved properties.

  15. Silicon Carbide Diodes Performance Characterization and Comparison With Silicon Devices

    NASA Technical Reports Server (NTRS)

    Lebron-Velilla, Ramon C.; Schwarze, Gene E.; Trapp, Scott

    2003-01-01

    Commercially available silicon carbide (SiC) Schottky diodes from different manufacturers were electrically tested and characterized at room temperature. Performed electrical tests include steady state forward and reverse I-V curves, as well as switching transient tests performed with the diodes operating in a hard switch dc-to-dc buck converter. The same tests were performed in current state of the art silicon (Si) and gallium arsenide (GaAs) Schottky and pn junction devices for evaluation and comparison purposes. The SiC devices tested have a voltage rating of 200, 300, and 600 V. The comparison parameters are forward voltage drop at rated current, reverse current at rated voltage and peak reverse recovery currents in the dc to dc converter. Test results show that steady state characteristics of the tested SiC devices are not superior to the best available Si Schottky and ultra fast pn junction devices. Transient tests reveal that the tested SiC Schottky devices exhibit superior transient behavior. This is more evident at the 300 and 600 V rating where SiC Schottky devices showed drastically lower reverse recovery currents than Si ultra fast pn diodes of similar rating.

  16. Amorphous molybdenum silicon superconducting thin films

    SciTech Connect

    Bosworth, D. Sahonta, S.-L.; Barber, Z. H.; Hadfield, R. H.

    2015-08-15

    Amorphous superconductors have become attractive candidate materials for superconducting nanowire single-photon detectors due to their ease of growth, homogeneity and competitive superconducting properties. To date the majority of devices have been fabricated using W{sub x}Si{sub 1−x}, though other amorphous superconductors such as molybdenum silicide (Mo{sub x}Si{sub 1−x}) offer increased transition temperature. This study focuses on the properties of MoSi thin films grown by magnetron sputtering. We examine how the composition and growth conditions affect film properties. For 100 nm film thickness, we report that the superconducting transition temperature (Tc) reaches a maximum of 7.6 K at a composition of Mo{sub 83}Si{sub 17}. The transition temperature and amorphous character can be improved by cooling of the substrate during growth which inhibits formation of a crystalline phase. X-ray diffraction and transmission electron microscopy studies confirm the absence of long range order. We observe that for a range of 6 common substrates (silicon, thermally oxidized silicon, R- and C-plane sapphire, x-plane lithium niobate and quartz), there is no variation in superconducting transition temperature, making MoSi an excellent candidate material for SNSPDs.

  17. Silicon carbide whiskers: Characterization and aerodynamic behaviors

    SciTech Connect

    Cheng, Y.S.; Smith, S.M.; Johnson, N.F.; Powell, Q.H.

    1995-10-01

    Silicon carbide (SiC) whiskers are fiberlike materials with a wide range of industrial applications. Industrial hygiene samplings of the material are taken to monitor and control possible exposures to workers. This study characterizes an SiC whisker in detail, including its width-length distribution, aspect ratio, particle density, and aerodynamic size distribution. The SiC whiskers were aerosolized, and samples from a filter, cascade impactor, and aerosol centrifuge were taken. The diameter-length distribution of SiC fibers determined by electron microscopy from filter samples was found to follow the bivariate lognormal distribution. The aerodynamic size of a fiber aerosol depends not only on the particle dimension and density but also on the orientation of its axis with respect to flow. The results show that the aerodynamic size distribution obtained from the impactor was consistent with the predicted value, assuming the long axis of the fiber was parallel to the flow toward the collection substrate. On the other hand, the aerodynamic size in the aerosol centrifuge was consistent with results for a perpendicular orientation. A larger aerodynamic size (20--25%) was obtained in the case of impactor data as compared with centrifuge data. The respirable fraction estimated from the cascade impactor data was 65%, consistent with the estimate from bivariate analysis (67%) but smaller than the estimated fraction from the aerosol centrifuge (76%). The results show that the data obtained with the bivariate analysis of fiber dimensions had good correlation with the cascade impactor data, and this approach can be used to predict the aerodynamic size distribution and the size-selective fractions for fiber aerosols from filter samples.

  18. Thermal equation of state of silicon carbide

    SciTech Connect

    Wang, Yuejian; Liu, Zhi T. Y.; Khare, Sanjay V.; Collins, Sean Andrew; Zhang, Jianzhong; Wang, Liping; Zhao, Yusheng

    2016-02-11

    A large volume press coupled with in-situ energy-dispersive synchrotron X-ray was used to probe the change of silicon carbide (SiC) under high pressure and temperature (P-T) up to 8.1 GPa and 1100 K. The obtained pressure–volume–temperature (P-V-T) data were fitted to a modified high-T Birch-Murnaghan equation of state, yielding values of a series of thermo-elastic parameters, such as, the ambient bulk modulus KTo = 237(2) GPa, temperature derivative of bulk modulus at constant pressure (∂K/∂T)P = -0.037(4) GPa K-1, volumetric thermal expansivity α(0, T)=a+bT with a = 5.77(1)×10-6 K-1 and b = 1.36(2)×10-8 K-2, and pressure derivative of thermal expansion at constant temperature (∂α/∂P)T =6.53±0.64×10-7 K-1GPa-1. Furthermore, we found the temperature derivative of bulk modulus at constant volume, (∂KT/∂T)V, equal to -0.028(4) GPa K-1 by using a thermal pressure approach. In addition, the elastic properties of SiC were determined by density functional theory through the calculation of Helmholtz free energy. Lastly, the computed results generally agree well with the experimental values.

  19. Three dimensional amorphous silicon/microcrystalline silicon solar cells

    DOEpatents

    Kaschmitter, James L.

    1996-01-01

    Three dimensional deep contact amorphous silicon/microcrystalline silicon (a-Si/.mu.c-Si) solar cells which use deep (high aspect ratio) p and n contacts to create high electric fields within the carrier collection volume material of the cell. The deep contacts are fabricated using repetitive pulsed laser doping so as to create the high aspect p and n contacts. By the provision of the deep contacts which penetrate the electric field deep into the material where the high strength of the field can collect many of the carriers, thereby resulting in a high efficiency solar cell.

  20. Three dimensional amorphous silicon/microcrystalline silicon solar cells

    DOEpatents

    Kaschmitter, J.L.

    1996-07-23

    Three dimensional deep contact amorphous silicon/microcrystalline silicon (a-Si/{micro}c-Si) solar cells are disclosed which use deep (high aspect ratio) p and n contacts to create high electric fields within the carrier collection volume material of the cell. The deep contacts are fabricated using repetitive pulsed laser doping so as to create the high aspect p and n contacts. By the provision of the deep contacts which penetrate the electric field deep into the material where the high strength of the field can collect many of the carriers, thereby resulting in a high efficiency solar cell. 4 figs.

  1. Kinetics and Mechanisms of Primary and Steady State Creep in B- and Al- Containing Alpha Silicon Carbide

    DTIC Science & Technology

    1989-07-01

    silicon carbide , devoid of sintering aids, creeps by dislocation motion and climb. Silicon carbide containing...impurity substitution in the sintered silicon carbide . Experimental measurements of grain boundary sliding offsets on polycrystalline silicon carbide have... carbide whisker reinforcement has no beneficial effect on the creep resistance of Si3N4, whereas, in the more easily deformed mullite, silicon carbide whisker reinforcement does result in a reduced steady state

  2. Processing, texture and mechanical properties of sintered silicon carbide

    NASA Technical Reports Server (NTRS)

    Landfermann, H.; Hausner, H.

    1988-01-01

    With regard to its favorable properties, in particular those shown at high temperatures, silicon carbide is of great interest for applications related to the construction of engines and turbines. Thus, silicon carbide could replace heat-resisting alloys with the objective to achieve a further increase in operational temperature. The present investigation is concerned with approaches which can provide silicon carbide material with suitable properties for the intended applications, taking into account the relations between characteristics of the raw material, material composition, sinter conditions, and results of the sintering process. The effects of density and texture formation on the mechanical properties are studied. It is found that a dense material with a fine-grained microstructure provides optimal mechanical properties, while any deviation from this ideal condition can lead to a considerable deterioration with respect to the material properties.

  3. Palladium in cubic silicon carbide: Stability and kinetics

    NASA Astrophysics Data System (ADS)

    Roma, Guido

    2009-12-01

    Several technological applications of silicon carbide are concerned with the introduction of palladium impurities. Be it intentional or not, this may lead to the formation of silicides. Not only this process is not well understood, but the basic properties of palladium impurities in silicon carbide, such as solubility or diffusion mechanisms, are far from being known. Here the stability and kinetics of isolated Pd impurities in cubic silicon carbide are studied by first principles calculations in the framework of density functional theory. The preferential insertion sites, as well as the main migration mechanisms, are analyzed and presented here, together with the results for solution and migration energies. The early stages of nucleation are discussed based on the properties of isolated impurities and the smallest clusters.

  4. Implanted bottom gate for epitaxial graphene on silicon carbide

    NASA Astrophysics Data System (ADS)

    Waldmann, D.; Jobst, J.; Fromm, F.; Speck, F.; Seyller, T.; Krieger, M.; Weber, H. B.

    2012-04-01

    We present a technique to tune the charge density of epitaxial graphene via an electrostatic gate that is buried in the silicon carbide substrate. The result is a device in which graphene remains accessible for further manipulation or investigation. Via nitrogen or phosphor implantation into a silicon carbide wafer and subsequent graphene growth, devices can routinely be fabricated using standard semiconductor technology. We have optimized samples for room temperature as well as for cryogenic temperature operation. Depending on implantation dose and temperature we operate in two gating regimes. In the first, the gating mechanism is similar to a MOSFET, the second is based on a tuned space charge region of the silicon carbide semiconductor. We present a detailed model that describes the two gating regimes and the transition in between.

  5. Low temperature internal friction of amorphous silicon

    NASA Astrophysics Data System (ADS)

    Liu, Xiao; Metcalf, Thomas; Jernigan, Glenn; Jugdersuren, Battogtokh; Kearney, Brian; Culberston, James

    The ubiquitous low-energy excitations, known as two-level tunnelling systems (TLS), are one of the universal phenomena of amorphous solids. These excitations dominate the acoustic, dielectric, and thermal properties of structurally disordered solids. Using the double-paddle oscillator internal friction measurement technique, we have shown that TLS can be made to almost completely disappear in e-beam deposited amorphous silicon (a-Si) as the growth temperature increased to 400°C. However, there is a mysterious broad maximum in internal friction at 2-3K, which we suspect to come from metallic contamination of our oscillators and is not related to a-Si. Our new result of a-Si, deposited in a different UHV system and on oscillators with a different type of metallic electrodes, confirms our suspicion. This lowers the upper bound of possible TLS content in a-Si, in terms of tunnelling strength, to below 10-6. Our results offer an encouraging opportunity to use growth temperature to improve the structure order of amorphous thin films and to develop high quality amorphous dielectrics for applications, such as in modern quantum devices. Work supported by the Office of Naval Research.

  6. Finite Element Analysis Modeling of Chemical Vapor Deposition of Silicon Carbide

    DTIC Science & Technology

    2014-06-19

    Conference on Computational Fluid Dynamics . 6. de Jong, F. & M. Meyyappan. (1996). Numerical Simulation of Silicon Carbide Chemical Vapor Deposition...FINITE ELEMENT ANALYSIS MODELING OF CHEMICAL VAPOR DEPOSITION OF SILICON CARBIDE !! THESIS JUNE 2014 ! Brandon M. Allen...T-14-J-38 ! ! FINITE ELEMENT ANALYSIS MODELING OF CHEMICAL VAPOR DEPOSITION OF SILICON CARBIDE !! THESIS Presented to the Faculty Department of

  7. Ultra low nanowear in novel chromium/amorphous chromium carbide nanocomposite films

    NASA Astrophysics Data System (ADS)

    Yate, Luis; Martínez-de-Olcoz, Leyre; Esteve, Joan; Lousa, Arturo

    2017-10-01

    In this work, we report the first observation of novel nanocomposite thin films consisting of nanocrystalline chromium embedded in an amorphous chromium carbide matrix (nc-Cr/a-CrC) with relatively high hardness (∼22,3 GPa) and ultra low nanowear. The films were deposited onto silicon substrates using a magnetic filtered cathodic arc deposition system at various negative bias voltages, from 50 to 450 V. X-ray diffraction (XRD) and X-ray photoelectron spectroscopy (XPS) suggested the co-existence of chromium and chromium carbide phases, while high resolution transmission electron microscopy (HRTEM) confirmed the presence of the nc-Cr/a-CrC structure. The friction coefficient measured with the ball-on disk technique and the nanowear results showed a strong correlation between the macro and nano-tribological properties of the samples. These novel nanocomposite films show promising properties as solid lubricant and wear resistant coatings with relatively high hardness, low friction coefficient and ultra low nanowear.

  8. Ion beam synthesis by tungsten-implantation into 6H-silicon carbide

    NASA Astrophysics Data System (ADS)

    Weishart, H.; Steffen, H. J.; Matz, W.; Voelskow, M.; Skorupa, W.

    1996-05-01

    Synthesis of a highly conductive surface layer on 6H-silicon carbide was achieved by high-dose, room temperature implantation of tungsten at 200 keV. Subsequently, the samples were annealed in two steps, namely at 500°C and 950°C. The influence of both dose and annealing on the reaction of W with SiC was investigated. Rutherford Backscattering Spectrometry (RBS), X-Ray Diffraction (XRD) and Auger Electron Spectroscopy (AES) contributed to study the structure and composition of the layer as well as the chemical states of the elements. During implantation sputtering becomes significant for doses exceeding 1.0 × 10 17 cm -2. Formation of tungsten carbide and silicide is already observed in the as-implanted state. An annealing temperature of 950°C is necessary to crystallize tungsten carbide. However, tungsten silicide remains amorphous at this temperature. Therefore, a mixture of polycrystalline tungsten carbide and amorphous tungsten silicide develops under these conditions. The resistivity of such a layer implanted with 1.0 × 10 17 W +cm -2 and annealed at 950°C is 565 μΩ cm.

  9. Characterization of silicon carbide coatings on Zircaloy-4 substrates

    NASA Astrophysics Data System (ADS)

    Al-Olayyan, Yousif Abdullah

    The lifetime of light water reactor (LWR) fuels is limited by the corrosion and degradation of Zircaloy cladding in the high temperature and high pressure operating conditions. As the thickness of the oxide layer increases, stresses build up in the oxide layer due to density differences between the oxide and the zirconium metal which lead to degradation and spallation of the oxide layer. The main objective of this research is to form protective coatings on the Zircaloy clad to prevent or at least slow the oxidation which can allow higher burnup of the fuel resulting in major benefits in plant safety and economics. Silicon carbide was identified as a candidate protective coating to reduce the corrosion and degradation of Zircaloy cladding. Silicon carbide coatings were deposited on Zircaloy substrates using plasma-assisted chemical vapor deposition (PE-CVD) and were found to be amorphous as determined by X-ray analysis. Since the adhesion of the films to the substrate was the most important property of a coating, scratch tests were used to assess the adhesion. The effects of different parameters on the test results including residual stresses, plastic deformation and friction between the stylus and the surface are discussed. Critical loads, characterized by continuous delamination of the SiC coatings deposited on Zircaloy-4, occurred at 0.5--2.5 N. The experimental results indicated that all SiC coatings used in this project, without exception, showed an adhesive failure when tested by scratch and indentation tests. Plastic deformation of the substrate due to compressive stresses induced by the scratch stylus caused flaking of the films at the interface, which was attributed to the low interfacial toughness. The effects of film thickness and substrate surface treatment on the quality and adhesion of SiC coatings were studied in detail. Thick films (5mum) exhibited extensive cracking. The scratch tests indicated higher adhesion with intermediate substrate surface

  10. Role of silicon dangling bonds in the electronic properties of epitaxial graphene on silicon carbide.

    PubMed

    Ridene, Mohamed; Kha, Calvin S; Flipse, Cees F J

    2016-03-29

    In this paper, we study the electronic properties of epitaxial graphene (EG) on silicon carbide by means of ab initio calculations based on the local spin density approximation + U method taking into account the Coulomb interaction between Si localized electrons. We show that this interaction is not completely suppressed but is screened by carbon layers grown on-top of silicon carbide. This finding leads to a good qualitative understanding of the experimental results reported on EG on silicon carbide. Our results highlight the presence of the Si localized states and might explain the anomalous Hanle curve and the high values of spin relaxation time in EG.

  11. Core-shell amorphous silicon-carbon nanoparticles for high performance anodes in lithium ion batteries

    NASA Astrophysics Data System (ADS)

    Sourice, Julien; Bordes, Arnaud; Boulineau, Adrien; Alper, John P.; Franger, Sylvain; Quinsac, Axelle; Habert, Aurélie; Leconte, Yann; De Vito, Eric; Porcher, Willy; Reynaud, Cécile; Herlin-Boime, Nathalie; Haon, Cédric

    2016-10-01

    Core-shell silicon-carbon nanoparticles are attractive candidates as active material to increase the capacity of Li-ion batteries while mitigating the detrimental effects of volume expansion upon lithiation. However crystalline silicon suffers from amorphization upon the first charge/discharge cycle and improved stability is expected in starting with amorphous silicon. Here we report the synthesis, in a single-step process, of amorphous silicon nanoparticles coated with a carbon shell (a-Si@C), via a two-stage laser pyrolysis where decomposition of silane and ethylene are conducted in two successive reaction zones. Control of experimental conditions mitigates silicon core crystallization as well as formation of silicon carbide. Auger electron spectroscopy and scanning transmission electron microscopy show a carbon shell about 1 nm in thickness, which prevents detrimental oxidation of the a-Si cores. Cyclic voltammetry demonstrates that the core-shell composite reaches its maximal lithiation during the first sweep, thanks to its amorphous core. After 500 charge/discharge cycles, it retains a capacity of 1250 mAh.g-1 at a C/5 rate and 800 mAh.g-1 at 2C, with an outstanding coulombic efficiency of 99.95%. Moreover, post-mortem observations show an electrode volume expansion of less than 20% and preservation of the nanostructuration.

  12. Ultrathin fiber poly-3-hydroxybutyrate, modified by silicon carbide nanoparticles

    NASA Astrophysics Data System (ADS)

    Olkhov, A. A.; Krutikova, A. A.; Goldshtrakh, M. A.; Staroverova, O. V.; Iordanskii, A. L.; Ischenko, A. A.

    2016-11-01

    The article presents the results of studies the composite fibrous material based on poly-3-hydroxybutyrate (PHB) and nano-size silicon carbide obtained by the electrospinning method. Size distribution of the silicon carbide nanoparticles in the fiber was estimated by X-ray diffraction technique. It is shown that immobilization of the SiC nanoparticles to the PHB fibers contributes to obtaining essentially smaller diameter of fibers, high physical-mechanical characteristics and increasing resistance to degradation in comparison with the fibers of PHB.

  13. Synthesis of High Purity Sinterable Silicon Carbide Powder

    DTIC Science & Technology

    1989-11-01

    adsorption and diffusion. Molecular diffusion is therefore, and important factor for condensational growth. The rate of condensational growth of a...Silicon Carbide Hydrogen Chloride Water Total Temperature. °F Pressure, psia Mol Frac Vapor Molecular Wt. GPM SCFH SLM Total H, 42.05 42.05 70...Silicon Carbide Hydrogen Chloride Water 6.77 24.31 37.28 Total 6.77 24.31 37.28 Temperature, °F Pressure, psia Mol Frac Vapor Molecular Wt

  14. Electronic states in epitaxial graphene fabricated on silicon carbide

    SciTech Connect

    Davydov, S. Yu.

    2011-08-15

    An analytical expression for the density of states of a graphene monolayer interacting with a silicon carbide surface (epitaxial graphene) is derived. The density of states of silicon carbide is described within the Haldane-Anderson model. It is shown that the graphene-substrate interaction results in a narrow gap of {approx}0.01-0.06 eV in the density of states of graphene. The graphene atom charge is estimated; it is shown that the charge transfer from the substrate is {approx}10{sup -3}-10{sup -2}e per graphene atom.

  15. Wear particles of single-crystal silicon carbide in vacuum

    NASA Technical Reports Server (NTRS)

    Miyoshi, K.; Buckley, D. H.

    1980-01-01

    Sliding friction experiments, conducted in vacuum with silicon carbide /000/ surface in contact with iron based binary alloys are described. Multiangular and spherical wear particles of silicon carbide are observed as a result of multipass sliding. The multiangular particles are produced by primary and secondary cracking of cleavage planes /000/, /10(-1)0/, and /11(-2)0/ under the Hertzian stress field or local inelastic deformation zone. The spherical particles may be produced by two mechanisms: (1) a penny shaped fracture along the circular stress trajectories under the local inelastic deformation zone, and (2) attrition of wear particles.

  16. Solar silicon from directional solidification of MG silicon produced via the silicon carbide route

    NASA Technical Reports Server (NTRS)

    Rustioni, M.; Margadonna, D.; Pirazzi, R.; Pizzini, S.

    1986-01-01

    A process of metallurgical grade (MG) silicon production is presented which appears particularly suitable for photovoltaic (PV) applications. The MG silicon is prepared in a 240 KVA, three electrode submerged arc furnace, starting from high grade quartz and high purity silicon carbide. The silicon smelted from the arc furnace was shown to be sufficiently pure to be directionally solidified to 10 to 15 kg. After grinding and acid leaching, had a material yield larger than 90%. With a MG silicon feedstock containing 3 ppmw B, 290 ppmw Fe, 190 ppmw Ti, and 170 ppmw Al, blended with 50% of off grade electronic grade (EG) silicon to reconduct the boron content to a concentration acceptable for solar cell fabrication, the 99% of deep level impurities were concentrated in the last 5% of the ingot. Quite remarkably this material has OCV values higher tham 540 mV and no appreciable shorts due to SiC particles.

  17. The Active Oxidation of Silicon Carbide

    NASA Technical Reports Server (NTRS)

    Jacobson, Nathan S.; Myers, Dwight L.

    2009-01-01

    The high temperature oxidation of silicon carbide occurs in two very different modes. Passive oxidation forms a protective oxide film which limits further attack of the SiC: SiC(s) + 3/2 O2(g) = SiO2(s) + CO(g) Active oxidation forms a volatile oxide and may lead to extensive attack of the SiC: SiC(s) + O2(g) = SiO(g) + CO(g) Generally passive oxidation occurs at higher oxidant pressures and active oxidation occurs at lower oxidant pressures and elevated temperatures. Active oxidation is a concern for reentry, where the flight trajectory involves the latter conditions. Thus the transition points and rates of active oxidation are a major concern. Passive/active transitions have been studied by a number of investigators. An examination of the literature indicates many questions remain regarding the effect of impurity, the hysteresis of the transition (i.e. the difference between active-to-passive and passive-toactive), and the effect of total pressure. In this study we systematically investigate each of these effects. Experiments were done in both an alumina furnace tube and a quartz furnace tube. It is known that alumina tubes release impurities such as sodium and increase the kinetics in the passive region [1]. We have observed that the active-to-passive transition occurs at a lower oxygen pressure when the experiment is conducted in alumina tubes and the resultant passive silica scale contains sodium. Thus the tests in this study are conducted in quartz tubes. The hysteresis of the transition has been discussed in the detail in the original theoretical treatise of this problem for pure silicon by Wagner [2], yet there is little mention of it in subsequent literature. Essentially Wagner points out that the active-to-passive transition is governed by the criterion for a stable Si/SiO2 equilibria and the passive-to-active transition is governed by the decomposition of the SiO2 film. A series of experiments were conducted for active-to-passive and passive

  18. The thermal conductivity of carbon coated silicon carbide fibers embedded in a silicon carbide matrix

    SciTech Connect

    Beecher, S.C.; Dinwiddie, R.B.; Lowden, R.A.

    1993-12-31

    The room temperature thermal conductivity has been measured for a series of composite materials composed of carbon coated silicon carbide (SiC) fibers embedded in a SiC matrix. The composite samples consisted of 0/30{degree} bi-directional plain weave Nicalon fibers coated with varying thicknesses of pyrolitic carbon and infiltrated with SiC by the forced flow chemical vapor infiltration process to form the matrix. The fiber volume fraction was held constant at 0.423 {plus_minus} 0.012 and the from 0.03 {mu}m to 0.983 {mu}m, with the fibers of one sample left uncoated. Results transverse to fiber direction show significant differences with the introduction and subsequent increase in the carbon coating thickness. The thermal conductivity decreased for all the coated samples compared to the uncoated sample coating thickness compared to the sample with the thinnest carbon coating.

  19. Radiation resistance studies of amorphous silicon films

    NASA Technical Reports Server (NTRS)

    Woodyard, James R.; Payson, J. Scott

    1989-01-01

    Hydrogenated amorphous silicon thin films were irradiated with 2.00 MeV helium ions using fluences ranging from 1E11 to 1E15 cm(-2). The films were characterized using photothermal deflection spectroscopy and photoconductivity measurements. The investigations show that the radiation introduces sub-band-gap states 1.35 eV below the conduction band and the states increase supralinearly with fluence. Photoconductivity measurements suggest the density of states above the Fermi energy is not changing drastically with fluence.

  20. Structural relaxation of vacancies in amorphous silicon

    SciTech Connect

    Kim, E.; Lee, Y.H.; Chen, C.; Pang, T.

    1997-07-01

    The authors have studied the structural relaxation of vacancies in amorphous silicon (a-Si) using a tight-binding molecular-dynamics method. The most significant difference between vacancies in a-Si and those in crystalline silicon (c-Si) is that the deep gap states do not show up in a-Si. This difference is explained through the unusual behavior of the structural relaxation near the vacancies in a-Si, which enhances the sp{sup 2} + p bonding near the band edges. They have also observed that the vacancies do not migrate below 450 K although some of them can still be annihilated, particularly at high defect density due to large structural relaxation.

  1. Amorphous silicon-based microchannel plates

    NASA Astrophysics Data System (ADS)

    Franco, Andrea; Riesen, Yannick; Wyrsch, Nicolas; Dunand, Sylvain; Powolny, François; Jarron, Pierre; Ballif, Christophe

    2012-12-01

    Microchannel plates (MCP) based on hydrogenated amorphous silicon (a-Si:H) were recently introduced to overcome some of the limitations of crystalline silicon and glass MCP. The typical thickness of a-Si:H based MCPs (AMCP) ranges between 80 and 100 μm and the micromachining of the channels is realized by deep reactive ion etching (DRIE). Advantages and issues regarding the fabrication process are presented and discussed. Electron amplification is demonstrated and analyzed using Electron Beam Induced Current (EBIC) technique. The gain increases as a function of the bias voltage, limited to -340 V on account of high leakage currents across the structure. EBIC maps on 10° tilted samples confirm that the device active area extend to the entire channel opening. AMCP characterization with the electron beam shows gain saturation and signal quenching which depends on the effectiveness of the charge replenishment in the channel walls.

  2. Sputtering and codeposition of silicon carbide with deuterium

    NASA Astrophysics Data System (ADS)

    Causey, Rion A.

    2003-03-01

    Due to its excellent thermal properties, silicon carbide is being considered as a possible plasma-facing material for fusion devices. If used as a plasma-facing material, the energetic hydrogen isotope ions and charge-exchanged neutrals escaping from the plasma will sputter the silicon carbide. To assess the tritium inventory problems that will be generated by the use of this material, it is necessary that we know the codeposition properties of the redeposited silicon carbide. To determine the codeposition properties, the deuterium plasma experiment at Sandia National Laboratories in Livermore, California has been used to directly compare the deuterium sputtering and codeposition of silicon carbide with that of graphite. A Penning discharge at a flux of 6×10 19 D/m 2 and an energy of ≈300 eV was used to sputter silicon and carbon from a pair of 0.05 m diameter silicon carbide disks. The removal rate of deuterium gas from the fixed volume of the system isolated from all other sources and sinks was used to measure the codeposition probability (probability that a hydrogen isotope atom will be removed through codeposition per ion striking the sample surface). A small catcher plate used to capture a fraction of the codeposited film was analyzed using Auger spectroscopy. This analysis showed the film to begin with a high carbon to silicon ratio due to preferential sputtering of the carbon. As the film became thicker, the ratio of the depositing material changed over to the (1:1) value that must eventually be attained.

  3. Silicon carbide alloys: Research reports in materials science

    SciTech Connect

    Dobson, M.M.

    1986-01-01

    The book draws from work done on other silicon materials, silicon nitrides and sialons, to emphasize the importance of the SiC system. A comprehensive treatment of non-oxide silicon ceramics, this work is of special interest to researchers involved in ceramics, materials science, and high-temperature technology. This book covers the alloys of silicon carbide with aluminum nitride. Crystallography and experimental methods including sample preparation, furnace methods, X-ray and electron diffraction, optical and electron microscopy and chemical analysis are covered.

  4. Characterization of oxide scales thermally formed on single-crystal silicon carbide.

    PubMed

    Chayasombat, B; Kato, T; Hirayama, T; Tokunaga, T; Sasaki, K; Kuroda, K

    2010-08-01

    Microstructures of oxide scales thermally formed on single-crystal silicon carbide were investigated using transmission electron microscopy. The oxide scales were formed on the Si-face of 6H-SiC at 1273-1473 K in dry oxygen. Spherical patterns were observed on the surfaces of the oxidized samples by an optical microscope in some regions. In these regions, cross-sectional transmission electron microscopy (TEM) observations show that the oxide scale was divided into two layers; the upper layer (surface side) was composed of crystalline silica, and the lower layer on the silicon carbide substrate was amorphous silica, while the oxide scales in the surroundings of the patterns were composed of only amorphous silica. The oxidation activation energy in the amorphous silica layer of the Si-face of 6H-SiC was found to be 408 kJ/mol by the evolution of thickness directly measured from the cross-sectional scanning electron microscopy and TEM images.

  5. Laser-induced phase separation of silicon carbide.

    PubMed

    Choi, Insung; Jeong, Hu Young; Shin, Hyeyoung; Kang, Gyeongwon; Byun, Myunghwan; Kim, Hyungjun; Chitu, Adrian M; Im, James S; Ruoff, Rodney S; Choi, Sung-Yool; Lee, Keon Jae

    2016-11-30

    Understanding the phase separation mechanism of solid-state binary compounds induced by laser-material interaction is a challenge because of the complexity of the compound materials and short processing times. Here we present xenon chloride excimer laser-induced melt-mediated phase separation and surface reconstruction of single-crystal silicon carbide and study this process by high-resolution transmission electron microscopy and a time-resolved reflectance method. A single-pulse laser irradiation triggers melting of the silicon carbide surface, resulting in a phase separation into a disordered carbon layer with partially graphitic domains (∼2.5 nm) and polycrystalline silicon (∼5 nm). Additional pulse irradiations cause sublimation of only the separated silicon element and subsequent transformation of the disordered carbon layer into multilayer graphene. The results demonstrate viability of synthesizing ultra-thin nanomaterials by the decomposition of a binary system.

  6. Laser-induced phase separation of silicon carbide

    NASA Astrophysics Data System (ADS)

    Choi, Insung; Jeong, Hu Young; Shin, Hyeyoung; Kang, Gyeongwon; Byun, Myunghwan; Kim, Hyungjun; Chitu, Adrian M.; Im, James S.; Ruoff, Rodney S.; Choi, Sung-Yool; Lee, Keon Jae

    2016-11-01

    Understanding the phase separation mechanism of solid-state binary compounds induced by laser-material interaction is a challenge because of the complexity of the compound materials and short processing times. Here we present xenon chloride excimer laser-induced melt-mediated phase separation and surface reconstruction of single-crystal silicon carbide and study this process by high-resolution transmission electron microscopy and a time-resolved reflectance method. A single-pulse laser irradiation triggers melting of the silicon carbide surface, resulting in a phase separation into a disordered carbon layer with partially graphitic domains (~2.5 nm) and polycrystalline silicon (~5 nm). Additional pulse irradiations cause sublimation of only the separated silicon element and subsequent transformation of the disordered carbon layer into multilayer graphene. The results demonstrate viability of synthesizing ultra-thin nanomaterials by the decomposition of a binary system.

  7. Scalable Quantum Photonics with Single Color Centers in Silicon Carbide.

    PubMed

    Radulaski, Marina; Widmann, Matthias; Niethammer, Matthias; Zhang, Jingyuan Linda; Lee, Sang-Yun; Rendler, Torsten; Lagoudakis, Konstantinos G; Son, Nguyen Tien; Janzén, Erik; Ohshima, Takeshi; Wrachtrup, Jörg; Vučković, Jelena

    2017-03-08

    Silicon carbide is a promising platform for single photon sources, quantum bits (qubits), and nanoscale sensors based on individual color centers. Toward this goal, we develop a scalable array of nanopillars incorporating single silicon vacancy centers in 4H-SiC, readily available for efficient interfacing with free-space objective and lensed-fibers. A commercially obtained substrate is irradiated with 2 MeV electron beams to create vacancies. Subsequent lithographic process forms 800 nm tall nanopillars with 400-1400 nm diameters. We obtain high collection efficiency of up to 22 kcounts/s optical saturation rates from a single silicon vacancy center while preserving the single photon emission and the optically induced electron-spin polarization properties. Our study demonstrates silicon carbide as a readily available platform for scalable quantum photonics architecture relying on single photon sources and qubits.

  8. Laser-induced phase separation of silicon carbide

    PubMed Central

    Choi, Insung; Jeong, Hu Young; Shin, Hyeyoung; Kang, Gyeongwon; Byun, Myunghwan; Kim, Hyungjun; Chitu, Adrian M.; Im, James S.; Ruoff, Rodney S.; Choi, Sung-Yool; Lee, Keon Jae

    2016-01-01

    Understanding the phase separation mechanism of solid-state binary compounds induced by laser–material interaction is a challenge because of the complexity of the compound materials and short processing times. Here we present xenon chloride excimer laser-induced melt-mediated phase separation and surface reconstruction of single-crystal silicon carbide and study this process by high-resolution transmission electron microscopy and a time-resolved reflectance method. A single-pulse laser irradiation triggers melting of the silicon carbide surface, resulting in a phase separation into a disordered carbon layer with partially graphitic domains (∼2.5 nm) and polycrystalline silicon (∼5 nm). Additional pulse irradiations cause sublimation of only the separated silicon element and subsequent transformation of the disordered carbon layer into multilayer graphene. The results demonstrate viability of synthesizing ultra-thin nanomaterials by the decomposition of a binary system. PMID:27901015

  9. Research and Development on Advanced Silicon Carbide Thin Film Growth Techniques and Fabrication of High Power and Microwave Frequency Silicon Carbide-Based Device Structures

    DTIC Science & Technology

    1990-12-01

    0W " -Annual Letter Report- N,4 Research and Developmen. on Advanced Silicon Carbide Thin Film Growth Techniques and Fabrication of High Power and...Microwave Frequency Silicon Carbide -Based Device Structures Supported under Grant #N00014-88-K-0341/P00002 Office of the Chief of Naval Research Report...SUBTITLE Research and Development on Advanced S. FUNDING NUMBERS Silicon Carbide Thin Filn.Growth Technl.ques and R&T:212k003---03 Fabrication of High

  10. Endurance Tests Of Amorphous-Silicon Photovoltaic Modules

    NASA Technical Reports Server (NTRS)

    Ross, Ronald G., Jr.; Sugimura, Russell S.

    1989-01-01

    Failure mechanisms in high-power service studied. Report discusses factors affecting endurance of amorphous-silicon solar cells. Based on field tests and accelerated aging of photovoltaic modules. Concludes that aggressive research needed if amorphous-silicon modules to attain 10-year life - value U.S. Department of Energy established as goal for photovoltaic modules in commercial energy-generating plants.

  11. Superlattice doped layers for amorphous silicon photovoltaic cells

    DOEpatents

    Arya, Rajeewa R.

    1988-01-12

    Superlattice doped layers for amorphous silicon photovoltaic cells comprise a plurality of first and second lattices of amorphous silicon alternatingly formed on one another. Each of the first lattices has a first optical bandgap and each of the second lattices has a second optical bandgap different from the first optical bandgap. A method of fabricating the superlattice doped layers also is disclosed.

  12. Method for improving the stability of amorphous silicon

    DOEpatents

    Branz, Howard M.

    2004-03-30

    A method of producing a metastable degradation resistant amorphous hydrogenated silicon film is provided, which comprises the steps of growing a hydrogenated amorphous silicon film, the film having an exposed surface, illuminating the surface using an essentially blue or ultraviolet light to form high densities of a light induced defect near the surface, and etching the surface to remove the defect.

  13. Endurance Tests Of Amorphous-Silicon Photovoltaic Modules

    NASA Technical Reports Server (NTRS)

    Ross, Ronald G., Jr.; Sugimura, Russell S.

    1989-01-01

    Failure mechanisms in high-power service studied. Report discusses factors affecting endurance of amorphous-silicon solar cells. Based on field tests and accelerated aging of photovoltaic modules. Concludes that aggressive research needed if amorphous-silicon modules to attain 10-year life - value U.S. Department of Energy established as goal for photovoltaic modules in commercial energy-generating plants.

  14. Switching in coplanar amorphous hydrogenated silicon devices

    NASA Astrophysics Data System (ADS)

    Avila, A.; Asomoza, R.

    2000-01-01

    Switching has been observed in a wide variety of materials and devices. Hydrogenated amorphous silicon has become one of the most important cases because of interest in neural network applications. Although there are many reports regarding this phenomenon, not all of the physical processes involved are still determined precisely. Therefore, some more experimental information is needed in order to achieve this task. Much of the behavior of the devices has been ascribed to the existence of a filamentary region which is produced after the first switching process, called forming. We observed this filamentary region in its full extension by producing forming in amorphous silicon devices with coplanar metallic contacts placed near each other (˜5 μm). The I-V characteristics, filament optical and atomic force microscopy images and chemical etching led us to correlate changes in resistance to metal inclusion into the amorphous film. There are two stages: the first is related to contact stabilization, the second to metal transport into the film bulk. Optical images show a permanent filamentary region after forming. AFM images of these filaments showed that they are formed essentially by material accumulation between the contacts. This material tends to get some atomic arrangement, becoming a polycrystalline solid. If the device was led to breakdown, such accumulation becomes either a hillock or a thin conducting channel connecting both contacts. In the case of a switching filament, the accumulation tends to be a chain of smaller hillocks along the conduction path. Metal from the contacts remains in the conduction path after forming and chemical etching indicated that it is placed near the path core. Before forming, a tunneling transport process can be ascribed to the non-ohmic behavior of the samples during the first stage of metallic inclusion.

  15. Study of sintering temperature on the structure of silicon carbide membrane

    NASA Astrophysics Data System (ADS)

    Sadighzadeh, A.; Mashayekhan, Sh.; Nedaie, B.; Ghorashi, A. H.

    2014-09-01

    Study of the microstructure of silicon carbide (SiC) membrane as a function of sintering temperature and the percentage amount of additive kaolin is the outcome of the experimental fabrications presented in this paper. The SEM micrographs are used to investigate the impact of above parameters on the porosity of membrane. The experimental results show that the rise in the temperature causes more sintering of powder particles, growing granules, augmentation of the number of pores and consequently increasing the total porosity of membrane. Using XRD analyses, it is found that SiC amorphous phase is highly sensitive to the temperature and its crystallization physically grows with temperature increase.

  16. Processing and mechanical properties of silicon nitride/silicon carbide ceramic nanocomposites derived from polymer precursors

    NASA Astrophysics Data System (ADS)

    Gasch, Matthew Jeremy

    Creep deformation of silicon nitride and silicon carbide ceramics is dominated by a solution-precipitation process through the glassy interface phase at grain boundary regions, which is formed by the reaction of oxide additives with the silicon oxide surface layer of the ceramic powder particles during liquid phase sintering. The ultimate approach to increase the creep resistance of these materials is to decrease the oxide content at the grain boundaries, rendering the solution-precipitation process non-effective. This research presents a new method of enhancing the creep properties of silicon nitride/silicon carbide composites by forming micro-nano and nano-nano microstructures during sintering. Starting from amorphous Si-C-N powders of micrometric size particles, powders were consolidated in three ways: (1) Consolidation of pyrolyzed powders without additives, (2) Electric Field Assisted Sintering (EFAS) of pyrolyzed powders with and without additives and (3) High pressure sintering. In all three cases, nanocomposites with varied grain size were achieved. High temperature mechanical creep testing was performed on the samples sintered by EFAS. Creep rates ranged from 1 x 10-8/s to 1 x 10-11/s depending on method in which powders were prepared and total oxide additive amount. For samples with high oxide contents the stress exponent was found to be n ˜ 2 with an activation energy of Q ˜ 600kJ/mol*K, indicating the typical solution precipitation process of deformation. But for the nano-nano composites sintered with little to none oxide additive, the stress exponent was found to be n ˜ 1 with and activation energy of Q ˜ 200kJ/mol*K, hinting at a diffusion controlled mechanism of creep deformation. For the nano-nano composites sintered without oxide additives, oxygen was found in the microstructure. However, oxygen contamination was found to distribute at grain boundary regions especially triple junctions. It is suggested that this highly dispersed distribution of

  17. Tritiated amorphous silicon films and devices

    NASA Astrophysics Data System (ADS)

    Kosteski, Tome

    The do saddle-field glow discharge deposition technique has been used to bond tritium within an amorphous silicon thin film network using silane and elemental tritium in the glow discharge. The concentration of tritium is approximately 7 at. %. Minimal outgassing of tritium from tritiated hydrogenated amorphous silicon (a-Si:H:T) at room temperature suggests that tritium is bonded stably. Tritium effusion only occurred at temperatures above the film's growth temperature. The radioactive decay of tritium results in the production of high-energy beta particles. Each beta particle can generate on average approximately 1300 electron-hole pairs in a-Si:H:T. Electrical conductivity of a-Si:H:T is shown to be due to a thermally activated process and due to the generation of excess carriers by the beta particles. p-i-n betavoltaic devices have been made with a-Si:H:T in the intrinsic (i-) region. The i-region consisted of either a-Si:H:T, or a thin section of a-Si:H:T (a Delta layer) sandwiched between undoped hydrogenated amorphous silicon (a-Si:H). The excess carriers generated in the i-region are separated by the device's built-in electric field. Short-circuit currents (Isc ), open-circuit voltages (Voc), and power have been measured and correlated to the generation of excess carriers in the i-region. Good devices were made at a substrate temperature of 250°C and relatively large flow rates of silane and tritium; this ensures that there are more monohydride bonds than dihydride bonds. Under dark conditions, Isc, and Voc have been found to decrease rapidly. This is consistent with the production of silicon neutral dangling bonds (5 x 1017cm-3 per day) from the loss of tritium due to its transmutation into helium. Dangling bonds reduce carrier lifetime and weaken the electric field in the i-region. The short-circuit current from Delta layer devices decreased more slowly and settled to higher values for narrower Delta layers. This is because the dangling bonds are

  18. Growth mechanism of silicon carbide films on silicon substrates using C 60 carbonization

    NASA Astrophysics Data System (ADS)

    Chen, Dong; Workman, Richard; Sarid, Dror

    1995-12-01

    Silicon carbide films were grown on silicon substrates using C 60 molecules as a carbon source. The grown films were characterized by atomic force microscopy (AFM), scanning electron microscopy (SEM), transmission electron microscopy (TEM), and infrared spectroscopy (IRS). Also, using SiO 2 as a mask on the Si substrate, a patterned SiC film was grown. Growth and defect mechanisms are discussed and compared with conventional CVD carbidizing methods.

  19. Sintered silicon carbide molded body and method for its production

    NASA Technical Reports Server (NTRS)

    Omori, M.; Sendai, M.; Ohira, K.

    1984-01-01

    Sintered silicon carbide shapes are described. They are produced by using a composition containing an oxide of at least one element chosen from the group: Li, Be, Mg, Si, Ca, Ti, V, Cr, Mn, Fe, Co, Ni, Zn, Nb, Mo, Ba, Tc, Ta, W and Th as a supplement to known sintering aids.

  20. The development of silicon carbide-based power electronics devices

    NASA Astrophysics Data System (ADS)

    Hopkins, Richard H.; Perkins, John F.

    1995-01-01

    In 1989 Westinghouse created an internally funded initiative to develop silicon carbide materials and device technology for a variety of potential commercial and military applications. Westinghouse saw silicon carbide as having the potential for dual use. For space applications, size and weight reductions could be achieved, together with increased reliability. Terrestrially, uses in harsh-temperature environments would be enabled. Theoretically, the physical and electrical properties of silicon carbide were highly promising for high-power, high-temperature, radiation-hardened electronics. However, bulk material with the requisite electronic qualities was not available, and the methods needed to produce a silicon carbide wafer—to fabricate high-quality devices—and to transition these technologies into a commercial product were considered to be a high-risk investment. It was recognized that through a collaborative effort, the CCDS could provide scientific expertise in several areas, thus reducing this risk. These included modeling of structures, electrical contacts, dielectrics, and epitaxial growth. This collaboration has been very successful, with developed technologies being transferred to Westinghouse.

  1. Crystal Lattice Dynamics of Various Silicon-Carbide Polytypes

    DTIC Science & Technology

    2001-01-01

    basis of these results. 2. SILICON CARBIDE POLYTYPES It is well known that close packed spheres form a face centred cubic structure or a hexagonal...polytypism. The simplest polytype, called 3C, has the cubic structure of sphalerite. The polytype 2H has the hexagonal structure of wurtzite. The

  2. Nuclear breeder reactor fuel element with silicon carbide getter

    DOEpatents

    Christiansen, David W.; Karnesky, Richard A.

    1987-01-01

    An improved cesium getter 28 is provided in a breeder reactor fuel element or pin in the form of an extended surface area, low density element formed in one embodiment as a helically wound foil 30 located with silicon carbide, and located at the upper end of the fertile material upper blanket 20.

  3. Silicon carbide and other films and method of deposition

    NASA Technical Reports Server (NTRS)

    Mehregany, Mehran (Inventor); Zorman, Christian A. (Inventor); Fu, Xiao-An (Inventor); Dunning, Jeremy L. (Inventor)

    2007-01-01

    A method of depositing a ceramic film, particularly a silicon carbide film, on a substrate is disclosed in which the residual stress, residual stress gradient, and resistivity are controlled. Also disclosed are substrates having a deposited film with these controlled properties and devices, particularly MEMS and NEMS devices, having substrates with films having these properties.

  4. Silicon carbide and other films and method of deposition

    NASA Technical Reports Server (NTRS)

    Mehregany, Mehran (Inventor); Zorman, Christian A. (Inventor); Fu, Xiao-An (Inventor); Dunning, Jeremy (Inventor)

    2011-01-01

    A method of depositing a ceramic film, particularly a silicon carbide film, on a substrate is disclosed in which the residual stress, residual stress gradient, and resistivity are controlled. Also disclosed are substrates having a deposited film with these controlled properties and devices, particularly MEMS and NEMS devices, having substrates with films having these properties.

  5. High Temperature Slow Crack Growth in Silicon Carbide.

    DTIC Science & Technology

    1978-12-18

    The purpose of this investigation was to identify by survey the probable maximum use temperatures and stress levels for Sintered Alpha Silicon ... Carbide in expected marine (salt containing) and oxidizing environments as a function of sample surface condition. The results of this survey should be

  6. Low Temperature Hall Measurements of Neutron Irradiated Silicon Carbide

    DTIC Science & Technology

    2004-03-01

    general programming interface bus (GPIB). Table 3: Equipment List for Keithley System 110 Make Model Name Keithley 617 Electrometer Keithley 196 Voltmeter...concentration with temperature as measured by the S110 system . Theory models the temperature dependence of carrier concentration as an exponential. 44 y = 8E+16x...Penney Model of Conduction ........................................................................ 7 Silicon Carbide

  7. Room-temperature near-infrared silicon carbide nanocrystalline emitters based on optically aligned spin defects

    SciTech Connect

    Muzha, A.; Fuchs, F.; Simin, D.; Astakhov, G. V.; Tarakina, N. V.; Trupke, M.; Soltamov, V. A.; Mokhov, E. N.; Baranov, P. G.; Dyakonov, V.; and others

    2014-12-15

    Bulk silicon carbide (SiC) is a very promising material system for bio-applications and quantum sensing. However, its optical activity lies beyond the near infrared spectral window for in-vivo imaging and fiber communications due to a large forbidden energy gap. Here, we report the fabrication of SiC nanocrystals and isolation of different nanocrystal fractions ranged from 600 nm down to 60 nm in size. The structural analysis reveals further fragmentation of the smallest nanocrystals into ca. 10-nm-size clusters of high crystalline quality, separated by amorphization areas. We use neutron irradiation to create silicon vacancies, demonstrating near infrared photoluminescence. Finally, we detect room-temperature spin resonances of these silicon vacancies hosted in SiC nanocrystals. This opens intriguing perspectives to use them not only as in-vivo luminescent markers but also as magnetic field and temperature sensors, allowing for monitoring various physical, chemical, and biological processes.

  8. Deuterium magnetic resonance studies in amorphous and crystalline silicon

    NASA Astrophysics Data System (ADS)

    Borzi, Raffaella

    Hydrogenation is essential for useful amorphous silicon films and devices. We used deuteron magnetic resonance (DMR) to investigate the hydrogen microstructure in amorphous and crystalline silicon. DMR line shapes analyses and longitudinal relaxation time studies can distinguish silicon-bonded deuterons from molecular deuterons. Our comparisons between crystalline and amorphous silicon have yielded new perspectives on the characterization of molecular hydrogen sites including interstitial tetragonal T-sites, and microvoids. Quantitative analyses of DMR line shapes and spin populations show that the fraction of interstitially trapped molecular hydrogen increases with increasing photovoltaic quality of the films.

  9. Analytical and experimental evaluation of joining silicon carbide to silicon carbide and silicon nitride to silicon nitride for advanced heat engine applications, phase 2

    NASA Astrophysics Data System (ADS)

    Sundberg, G. J.; Vartabedian, A. M.; Wade, J. A.; White, C. S.

    1994-10-01

    The purpose of joining, Phase 2 was to develop joining technologies for HIP'ed Si3N4 with 4wt% Y2O3 (NCX-5101) and for a siliconized SiC (NT230) for various geometries including: butt joins, curved joins and shaft to disk joins. In addition, more extensive mechanical characterization of silicon nitride joins to enhance the predictive capabilities of the analytical/numerical models for structural components in advanced heat engines was provided. Mechanical evaluation were performed by: flexure strength at 22 C and 1,370 C, stress rupture at 1,370 C, high temperature creep, 22 C tensile testing and spin tests. While the silicon nitride joins were produced with sufficient integrity for many applications, the lower join strength would limit its use in the more severe structural applications. Thus, the silicon carbide join quality was deemed unsatisfactory to advance to more complex, curved geometries. The silicon carbide joining methods covered within this contract, although not entirely successful, have emphasized the need to focus future efforts upon ways to obtain a homogeneous, well sintered parent/join interface prior to siliconization. In conclusion, the improved definition of the silicon carbide joining problem obtained by efforts during this contract have provided avenues for future work that could successfully obtain heat engine quality joins.

  10. Analytical and experimental evaluation of joining silicon carbide to silicon carbide and silicon nitride to silicon nitride for advanced heat engine applications Phase 2. Final report

    SciTech Connect

    Sundberg, G.J.; Vartabedian, A.M.; Wade, J.A.; White, C.S.

    1994-10-01

    The purpose of joining, Phase 2 was to develop joining technologies for HIP`ed Si{sub 3}N{sub 4} with 4wt% Y{sub 2}O{sub 3} (NCX-5101) and for a siliconized SiC (NT230) for various geometries including: butt joins, curved joins and shaft to disk joins. In addition, more extensive mechanical characterization of silicon nitride joins to enhance the predictive capabilities of the analytical/numerical models for structural components in advanced heat engines was provided. Mechanical evaluation were performed by: flexure strength at 22 C and 1,370 C, stress rupture at 1,370 C, high temperature creep, 22 C tensile testing and spin tests. While the silicon nitride joins were produced with sufficient integrity for many applications, the lower join strength would limit its use in the more severe structural applications. Thus, the silicon carbide join quality was deemed unsatisfactory to advance to more complex, curved geometries. The silicon carbide joining methods covered within this contract, although not entirely successful, have emphasized the need to focus future efforts upon ways to obtain a homogeneous, well sintered parent/join interface prior to siliconization. In conclusion, the improved definition of the silicon carbide joining problem obtained by efforts during this contract have provided avenues for future work that could successfully obtain heat engine quality joins.

  11. The addition of silicon carbide to surrogate nuclear fuel kernels made by the internal gelation process

    NASA Astrophysics Data System (ADS)

    Hunt, R. D.; Hunn, J. D.; Birdwell, J. F.; Lindemer, T. B.; Collins, J. L.

    2010-06-01

    The US Department of Energy plans to use the internal gelation process to make tristructural isotropic (TRISO)-coated transuranic (TRU) fuel particles. The focus of this work is to develop TRU fuel kernels with high crush strengths, good ellipticity, and adequately dispersed silicon carbide (SiC). The submicron SiC particles in the TRU kernels are to serve as getters for excess oxygen and to potentially sequester palladium, rhodium, and ruthenium, which could damage the coatings during irradiation. Zirconium oxide microspheres stabilized with yttrium were used as surrogates because zirconium and TRU microspheres from the internal gelation process are amorphous and encounter similar processing problems. The hardness of SiC required modifications to the experimental system that was used to make uranium carbide kernels. Suitable processing conditions and equipment changes were identified so that the SiC could be homogeneously dispersed in gel spheres for subsequent calcination into strong spherical kernels.

  12. Theoretical studies of amorphous silicon and hydrogenated amorphous silicon with molecular dynamics simulations

    SciTech Connect

    Kwon, I.

    1991-12-20

    Amorphous silicon (a-Si) and hydrogenated amorphous silicon (a-Si:H) have been studied with molecular dynamics simulations. The structural, vibrational, and electronic properties of these materials have been studied with computer-generated structural models and compare well with experimental observations. The stability of a-si and a-Si:H have been studied with the aim of understanding microscopic mechanisms underlying light-induced degradation in a-Si:H (the Staebler-Wronski effect). With a view to understanding thin film growth processes, a-Si films have been generated with molecular dynamics simulations by simulating the deposition of Si-clusters on a Si(111) substrate. A new two- and three-body interatomic potential for Si-H interactions has been developed. The structural properties of a-Si:H networks are in good agreement with experimental measurements. The presence of H atoms reduces strain and disorder relative to networks without H.

  13. Theoretical studies of amorphous silicon and hydrogenated amorphous silicon with molecular dynamics simulations

    SciTech Connect

    Kwon, I.

    1991-12-20

    Amorphous silicon (a-Si) and hydrogenated amorphous silicon (a-Si:H) have been studied with molecular dynamics simulations. The structural, vibrational, and electronic properties of these materials have been studied with computer-generated structural models and compare well with experimental observations. The stability of a-si and a-Si:H have been studied with the aim of understanding microscopic mechanisms underlying light-induced degradation in a-Si:H (the Staebler-Wronski effect). With a view to understanding thin film growth processes, a-Si films have been generated with molecular dynamics simulations by simulating the deposition of Si-clusters on a Si(111) substrate. A new two- and three-body interatomic potential for Si-H interactions has been developed. The structural properties of a-Si:H networks are in good agreement with experimental measurements. The presence of H atoms reduces strain and disorder relative to networks without H.

  14. Heteroepitaxial growth of highly oriented diamond on cubic silicon carbide

    SciTech Connect

    Kawarada, H.; Wild, C.; Herres, N.; Locher, R.; Koidl, P.; Nagasawa, H.

    1997-04-01

    We have deposited epitaxial diamond films with very low angular spread on epitaxial {beta}-phase silicon carbide layers on silicon (001) substrates. From x-ray rocking curve measurements, half-widths of the angular spread of the crystal orientation as low as 0.6{degree} have been determined, which is the smallest value ever reported in heteroepitaxial diamond films and appears to be smaller than those of the {beta}-phase silicon carbide underlayers. The film surface exhibits a roughness of about 100 nm with very few discernible boundaries due to misorientation. The optimization of the bias-enhanced nucleation process and the control of selective growth are the main factors for the improvement of the crystallinity. {copyright} {ital 1997 American Institute of Physics.}

  15. Protective coating for alumina-silicon carbide whisker composites

    DOEpatents

    Tiegs, Terry N.

    1989-01-01

    Ceramic composites formed of an alumina matrix reinforced with silicon carbide whiskers homogenously dispersed therein are provided with a protective coating for preventing fracture strength degradation of the composite by oxidation during exposure to high temperatures in oxygen-containing atmospheres. The coating prevents oxidation of the silicon carbide whiskers within the matrix by sealing off the exterior of the matrix so as to prevent oxygen transport into the interior of the matrix. The coating is formed of mullite or mullite plus silicon oxide and alumina and is formed in place by heating the composite in air to a temperature greater than 1200.degree. C. This coating is less than about 100 microns thick and adequately protects the underlying composite from fracture strength degradation due to oxidation.

  16. Diffusion Bonding of Silicon Carbide Ceramics using Titanium Interlayers

    NASA Technical Reports Server (NTRS)

    Halbig, Michael C.; Singh, Mrityunjay; Shpargel, Tarah P.; Kiser, James D.

    2006-01-01

    Robust joining approaches for silicon carbide ceramics are critically needed to fabricate leak free joints with high temperature mechanical capability. In this study, titanium foils and physical vapor deposited (PVD) titanium coatings were used to form diffusion bonds between SiC ceramics using hot pressing. Silicon carbide substrate materials used for bonding include sintered SiC and two types of CVD SiC. Microscopy results show the formation of well adhered diffusion bonds. The bond strengths as determined from pull tests are on the order of several ksi, which is much higher than required for a proposed application. Microprobe results show the distribution of silicon, carbon, titanium, and other minor elements across the diffusion bond. Compositions of several phases formed in the joint region were identified. Potential issues of material compatibility and optimal bond formation will also be discussed.

  17. Ambient to high-temperature fracture toughness and cyclic fatigue behavior in Al-containing silicon carbide ceramics

    SciTech Connect

    Yuan, R.; Kruzic, J.J.; Zhang, X.F.; De Jonghe, L.C.; Ritchie, R.O.

    2003-08-01

    A series of in situ toughened, A1, B and C containing, silicon carbide ceramics (ABC-SiC) has been examined with A1 contents varying from 3 to 7 wt percent. With increasing A1 additions, the grain morphology in the as-processed microstructures varied from elongated to bimodal to equiaxed, with a change in the nature of the grain-boundary film from amorphous to partially crystalline to fully crystalline.

  18. Method of fabricating silicon carbide coatings on graphite surfaces

    DOEpatents

    Varacalle, D.J. Jr.; Herman, H.; Burchell, T.D.

    1994-07-26

    The vacuum plasma spray process produces well-bonded, dense, stress-free coatings for a variety of materials on a wide range of substrates. The process is used in many industries to provide for the excellent wear, corrosion resistance, and high temperature behavior of the fabricated coatings. In this application, silicon metal is deposited on graphite. This invention discloses the optimum processing parameters for as-sprayed coating qualities. The method also discloses the effect of thermal cycling on silicon samples in an inert helium atmosphere at about 1,600 C which transforms the coating to silicon carbide. 3 figs.

  19. Method of fabricating silicon carbide coatings on graphite surfaces

    DOEpatents

    Varacalle, Jr., Dominic J.; Herman, Herbert; Burchell, Timothy D.

    1994-01-01

    The vacuum plasma spray process produces well-bonded, dense, stress-free coatings for a variety of materials on a wide range of substrates. The process is used in many industries to provide for the excellent wear, corrosion resistance, and high temperature behavior of the fabricated coatings. In this application, silicon metal is deposited on graphite. This invention discloses the optimum processing parameters for as-sprayed coating qualities. The method also discloses the effect of thermal cycling on silicon samples in an inert helium atmosphere at about 1600.degree.C. which transforms the coating to silicon carbide.

  20. Catastrophic degradation of the interface of epitaxial silicon carbide on silicon at high temperatures

    SciTech Connect

    Pradeepkumar, Aiswarya; Mishra, Neeraj; Kermany, Atieh Ranjbar; Iacopi, Francesca; Boeckl, John J.; Hellerstedt, Jack; Fuhrer, Michael S.

    2016-07-04

    Epitaxial cubic silicon carbide on silicon is of high potential technological relevance for the integration of a wide range of applications and materials with silicon technologies, such as micro electro mechanical systems, wide-bandgap electronics, and graphene. The hetero-epitaxial system engenders mechanical stresses at least up to a GPa, pressures making it extremely challenging to maintain the integrity of the silicon carbide/silicon interface. In this work, we investigate the stability of said interface and we find that high temperature annealing leads to a loss of integrity. High–resolution transmission electron microscopy analysis shows a morphologically degraded SiC/Si interface, while mechanical stress measurements indicate considerable relaxation of the interfacial stress. From an electrical point of view, the diode behaviour of the initial p-Si/n-SiC junction is catastrophically lost due to considerable inter-diffusion of atoms and charges across the interface upon annealing. Temperature dependent transport measurements confirm a severe electrical shorting of the epitaxial silicon carbide to the underlying substrate, indicating vast predominance of the silicon carriers in lateral transport above 25 K. This finding has crucial consequences on the integration of epitaxial silicon carbide on silicon and its potential applications.

  1. Catastrophic degradation of the interface of epitaxial silicon carbide on silicon at high temperatures

    NASA Astrophysics Data System (ADS)

    Pradeepkumar, Aiswarya; Mishra, Neeraj; Kermany, Atieh Ranjbar; Boeckl, John J.; Hellerstedt, Jack; Fuhrer, Michael S.; Iacopi, Francesca

    2016-07-01

    Epitaxial cubic silicon carbide on silicon is of high potential technological relevance for the integration of a wide range of applications and materials with silicon technologies, such as micro electro mechanical systems, wide-bandgap electronics, and graphene. The hetero-epitaxial system engenders mechanical stresses at least up to a GPa, pressures making it extremely challenging to maintain the integrity of the silicon carbide/silicon interface. In this work, we investigate the stability of said interface and we find that high temperature annealing leads to a loss of integrity. High-resolution transmission electron microscopy analysis shows a morphologically degraded SiC/Si interface, while mechanical stress measurements indicate considerable relaxation of the interfacial stress. From an electrical point of view, the diode behaviour of the initial p-Si/n-SiC junction is catastrophically lost due to considerable inter-diffusion of atoms and charges across the interface upon annealing. Temperature dependent transport measurements confirm a severe electrical shorting of the epitaxial silicon carbide to the underlying substrate, indicating vast predominance of the silicon carriers in lateral transport above 25 K. This finding has crucial consequences on the integration of epitaxial silicon carbide on silicon and its potential applications.

  2. Spectrometric characterization of amorphous silicon PIN detectors

    NASA Astrophysics Data System (ADS)

    Leyva, A.; Ramírez, F. J.; Ortega, Y.; Estrada, M.; Cabal, A.; Cerdeira, A.; Díaz, A.

    2000-10-01

    During the last years, much interest has been dedicated to the use of amorphous silicon PIN diodes as particle and radiation detectors for medical applications. This work presents the spectrometric characterization of PECVD high deposition rate diodes fabricated at our laboratory, with thickness up to 17.5 μm. Results show that the studied devices detect the Am241 alpha particles and the medical X-rays generated by a mammograph model Senographe 700T from General Electric Possible reasons of the observed energy losses are discussed in the text. Using the SRIM2000 program, the transit of 5.5 MeV alpha particles through a diode was simulated, determining the optimum thickness for these particles to deposit their energy in the intrinsic layer of the diode.

  3. Energy landscape of relaxed amorphous silicon

    NASA Astrophysics Data System (ADS)

    Valiquette, Francis; Mousseau, Normand

    2003-09-01

    We analyze the structure of the energy landscape of a well-relaxed 1000-atom model of amorphous silicon using the activation-relaxation technique (ART nouveau). Generating more than 40 000 events starting from a single minimum, we find that activated mechanisms are local in nature, that they are distributed uniformly throughout the model, and that the activation energy is limited by the cost of breaking one bond, independently of the complexity of the mechanism. The overall shape of the activation-energy-barrier distribution is also insensitive to the exact details of the configuration, indicating that well-relaxed configurations see essentially the same environment. These results underscore the localized nature of relaxation in this material.

  4. Short range atomic migration in amorphous silicon

    SciTech Connect

    Strauß, F. Jerliu, B.; Geue, T.; Stahn, J.; Schmidt, H.

    2016-05-07

    Experiments on self-diffusion in amorphous silicon between 400 and 500 °C are presented, which were carried out by neutron reflectometry in combination with {sup 29}Si/{sup nat}Si isotope multilayers. Short range diffusion is detected on a length scale of about 2 nm, while long range diffusion is absent. Diffusivities are in the order of 10{sup −19}–10{sup −20} m{sup 2}/s and decrease with increasing annealing time, reaching an undetectable low value for long annealing times. This behavior is strongly correlated to structural relaxation and can be explained as a result of point defect annihilation. Diffusivities for short annealing times of 60 s follow the Arrhenius law with an activation enthalpy of (0.74 ± 0.21) eV, which is interpreted as the activation enthalpy of Si migration.

  5. Radiation resistance studies of amorphous silicon films

    NASA Technical Reports Server (NTRS)

    Payson, J. Scott; Woodyard, James R.

    1988-01-01

    A study of hydrogenated amorphous silicon thin films irradiated with 2.00 MeV helium ions using fluences ranging from 1E11 to 1E15/sq cm is presented. The films were characterized using photothermal deflection spectroscopy, transmission and reflection spectroscopy, and photoconductivity and annealing measurements. Large changes were observed in the subband-gap optical absorption for energies between 0.9 and 1.7 eV. The steady-state photoconductivity showed decreases of almost five orders of magnitude for a fluence of 1E15/sq cm, but the slope of the intensity dependence of the photoconductivity remained almost constant for all fluences. Substantial annealing occurs even at room temperature, and for temperatures greater than 448 K the damage is completely annealed. The data are analyzed to describe the defects and the density of states function.

  6. SILICON CARBIDE CERAMICS FOR COMPACT HEAT EXCHANGERS

    SciTech Connect

    DR. DENNIS NAGLE; DR. DAJIE ZHANG

    2009-03-26

    Silicon carbide (SiC) materials are prime candidates for high temperature heat exchangers for next generation nuclear reactors due to their refractory nature and high thermal conductivity at elevated temperatures. This research has focused on demonstrating the potential of liquid silicon infiltration (LSI) for making SiC to achieve this goal. The major advantage of this method over other ceramic processing techniques is the enhanced capability of making high dense, high purity SiC materials in complex net shapes. For successful formation of net shape SiC using LSI techniques, the carbon preform reactivity and pore structure must be controlled to allow the complete infiltration of the porous carbon structure which allows complete conversion of the carbon to SiC. We have established a procedure for achieving desirable carbon properties by using carbon precursors consisting of two readily available high purity organic materials, crystalline cellulose and phenolic resin. Phenolic resin yields a glassy carbon with low chemical reactivity and porosity while the cellulose carbon is highly reactive and porous. By adjusting the ratio of these two materials in the precursor mixtures, the properties of the carbons produced can be controlled. We have identified the most favorable carbon precursor composition to be a cellulose resin mass ratio of 6:4 for LSI formation of SiC. The optimum reaction conditions are a temperature of 1800 C, a pressure of 0.5 Torr of argon, and a time of 120 minutes. The fully dense net shape SiC material produced has a density of 2.96 g cm{sup -3} (about 92% of pure SiC) and a SiC volume fraction of over 0.82. Kinetics of the LSI SiC formation process was studied by optical microscopy and quantitative digital image analysis. This study identified six reaction stages and provided important understanding of the process. Although the thermal conductivity of pure SiC at elevated temperatures is very high, thermal conductivities of most commercial Si

  7. Direct-patterned optical waveguides on amorphous silicon films

    DOEpatents

    Vernon, Steve; Bond, Tiziana C.; Bond, Steven W.; Pocha, Michael D.; Hau-Riege, Stefan

    2005-08-02

    An optical waveguide structure is formed by embedding a core material within a medium of lower refractive index, i.e. the cladding. The optical index of refraction of amorphous silicon (a-Si) and polycrystalline silicon (p-Si), in the wavelength range between about 1.2 and about 1.6 micrometers, differ by up to about 20%, with the amorphous phase having the larger index. Spatially selective laser crystallization of amorphous silicon provides a mechanism for controlling the spatial variation of the refractive index and for surrounding the amorphous regions with crystalline material. In cases where an amorphous silicon film is interposed between layers of low refractive index, for example, a structure comprised of a SiO.sub.2 substrate, a Si film and an SiO.sub.2 film, the formation of guided wave structures is particularly simple.

  8. Growth of silicon carbide crystals on a seed while pulling silicon crystals from a melt

    NASA Technical Reports Server (NTRS)

    Ciszek, T. F.; Schwuttke, G. H. (Inventor)

    1979-01-01

    A saturated solution of silicon and an element such as carbon having a segregation coefficient less than unity is formed by placing a solid piece of carbon in a body of molten silicon having a temperature differential decreasing toward the surface. A silicon carbide seed crystal is disposed on a holder beneath the surface of the molten silicon. As a rod or ribbon of silicon is slowly pulled from the melt, a supersaturated solution of carbon in silicon is formed in the vicinity of the seed crystal. Excess carbon is emitted from the solution in the form of silicon carbide which crystallizes on the seed crystal held in the cool region of the melt.

  9. STATUS OF HIGH FLUX ISOTOPE REACTOR IRRADIATION OF SILICON CARBIDE/SILICON CARBIDE JOINTS

    SciTech Connect

    Katoh, Yutai; Koyanagi, Takaaki; Kiggans, Jim; Cetiner, Nesrin; McDuffee, Joel

    2014-09-01

    Development of silicon carbide (SiC) joints that retain adequate structural and functional properties in the anticipated service conditions is a critical milestone toward establishment of advanced SiC composite technology for the accident-tolerant light water reactor (LWR) fuels and core structures. Neutron irradiation is among the most critical factors that define the harsh service condition of LWR fuel during the normal operation. The overarching goal of the present joining and irradiation studies is to establish technologies for joining SiC-based materials for use as the LWR fuel cladding. The purpose of this work is to fabricate SiC joint specimens, characterize those joints in an unirradiated condition, and prepare rabbit capsules for neutron irradiation study on the fabricated specimens in the High Flux Isotope Reactor (HFIR). Torsional shear test specimens of chemically vapor-deposited SiC were prepared by seven different joining methods either at Oak Ridge National Laboratory or by industrial partners. The joint test specimens were characterized for shear strength and microstructures in an unirradiated condition. Rabbit irradiation capsules were designed and fabricated for neutron irradiation of these joint specimens at an LWR-relevant temperature. These rabbit capsules, already started irradiation in HFIR, are scheduled to complete irradiation to an LWR-relevant dose level in early 2015.

  10. RF Sputtering for preparing substantially pure amorphous silicon monohydride

    DOEpatents

    Jeffrey, Frank R.; Shanks, Howard R.

    1982-10-12

    A process for controlling the dihydride and monohydride bond densities in hydrogenated amorphous silicon produced by reactive rf sputtering of an amorphous silicon target. There is provided a chamber with an amorphous silicon target and a substrate therein with the substrate and the target positioned such that when rf power is applied to the target the substrate is in contact with the sputtering plasma produced thereby. Hydrogen and argon are fed to the chamber and the pressure is reduced in the chamber to a value sufficient to maintain a sputtering plasma therein, and then rf power is applied to the silicon target to provide a power density in the range of from about 7 watts per square inch to about 22 watts per square inch to sputter an amorphous silicon hydride onto the substrate, the dihydride bond density decreasing with an increase in the rf power density. Substantially pure monohydride films may be produced.

  11. Microcavity effects in the photoluminescence of hydrogenated amorphous silicon nitride

    NASA Astrophysics Data System (ADS)

    Serpenguzel, Ali; Aydinli, Atilla; Bek, Alpan

    1998-07-01

    Fabry-Perot microcavities are used for the alteration of photoluminescence in hydrogenated amorphous silicon nitride grown with and without ammonia. The photoluminescence is red-near-infrared for the samples grown without ammonia, and blue-green for the samples grown with ammonia. In the Fabry- Perot microcavities, the amplitude of the photoluminescence is enhanced, while its linewidth is reduced with respect to the bulk hydrogenated amorphous silicon nitride. The microcavity was realized by a metallic back mirror and a hydrogenated amorphous silicon nitride--air or a metallic front mirror. The transmittance, reflectance, and absorbance spectra were also measured and calculated. The calculated spectra agree well with the experimental spectra. The hydrogenated amorphous silicon nitride microcavity has potential for becoming a versatile silicon based optoelectronic device such as a color flat panel display, a resonant cavity enhanced light emitting diode, or a laser.

  12. Silicon Nitride and Silicon Carbide Ceramics Structural Components in Avionics and Space

    NASA Astrophysics Data System (ADS)

    Berroth, Karl

    2014-06-01

    In the paper, Silicon Nitride and silicon carbide components for avionics and space are described. These lightweight stiff and strong materials with low and very low CTE and high thermal conductivity provide means for new designs and higher resolution in passive structures for optical instruments. Material properties and application examples are discussed.

  13. Development of a continuous spinning process for producing silicon carbide - silicon nitride precursor fibers

    NASA Technical Reports Server (NTRS)

    1985-01-01

    An apparatus was designed for the continuous production of silicon carbide - silicon nitride precursor fibers. The precursor polymer can be fiberized, crosslined and pyrolyzed. The product is a metallic black fiber with the composition of the type C sub x Si sub y n sub z. Little, other than the tensile strength and modulus of elasticity, is known of the physical properties.

  14. Analytical and Experimental Evaluation of Joining Silicon Carbide to Silicon Carbide and Silicon Nitride to Silicon Nitride for Advanced Heat Engine Applications Phase II

    SciTech Connect

    Sundberg, G.J.

    1994-01-01

    Techniques were developed to produce reliable silicon nitride to silicon nitride (NCX-5101) curved joins which were used to manufacture spin test specimens as a proof of concept to simulate parts such as a simple rotor. Specimens were machined from the curved joins to measure the following properties of the join interlayer: tensile strength, shear strength, 22 C flexure strength and 1370 C flexure strength. In parallel, extensive silicon nitride tensile creep evaluation of planar butt joins provided a sufficient data base to develop models with accurate predictive capability for different geometries. Analytical models applied satisfactorily to the silicon nitride joins were Norton's Law for creep strain, a modified Norton's Law internal variable model and the Monkman-Grant relationship for failure modeling. The Theta Projection method was less successful. Attempts were also made to develop planar butt joins of siliconized silicon carbide (NT230).

  15. Excimer laser crystallization of hydrogenated amorphous silicon

    SciTech Connect

    Dai Yongbing; Xu Zhongyang; Wang Changan; Zhang Shaoqiang; An Chengwu; Li Xingjiao; Wan Xinheng; Ding Hui

    1996-12-31

    Hydrogenated amorphous silicon (a-Si:H) films have been crystallized by the irradiations of XeCl excimer laser. The crystallized films have been examined by scanning electron microscopy (SEM), x-ray diffraction (XRD) and conductivity measurements to clarify their morphologies, structure and electrical properties. The results show that a high conductive super thin layer is formed by a single pulse laser irradiation with the energy density of 75mJ/cm{sup 2}. The conductivity increases quickly at laser energy density threshold which decreases when the hydrogen in a-Si:H films is removed by pre-annealing. During crystallization process, oxygen atoms from the air ambient have been introduced into the films and such an introducing process is hindered by the hydrogen eruption. When the oxygen content is high enough, the carrier-transport mechanism includes thermionic emission (TE) and thermionic field emission (TFE) in the vicinity of room temperature, which is similar to semi-insulating polycrystalline silicon (SIPOS).

  16. Formation of boron nitride coatings on silicon carbide fibers using trimethylborate vapor

    NASA Astrophysics Data System (ADS)

    Yuan, Mengjiao; Zhou, Tong; He, Jing; Chen, Lifu

    2016-09-01

    High quality boron nitride (BN) coatings have been grown on silicon carbide (SiC) fibers by carbothermal nitridation and at atmospheric pressure. SiC fibers were first treated in chlorine gas to form CDC (carbide-derived carbon) film on the fiber surface. The CDC-coated SiC fibers were then reacted with trimethylborate vapor and ammonia vapor at high temperature, forming BN coatings by carbothermal reduction. The FT-IR, XPS, XRD, SEM, TEM and AES were used to investigate the formation of the obtained coatings. It has been found that the obtained coatings are composed of phase mixture of h-BN and amorphous carbon, very uniform in thickness, have smooth surface and adhere well with the SiC fiber substrates. The BN-coated SiC fibers retain ∼80% strength of the as-received SiC fibers and show an obvious interfacial debonding and fiber pullout in the SiCf/SiOC composites. This method may be useful for the large scale production of high quality BN coating on silicon carbide fiber.

  17. Method of inducing differential etch rates in glow discharge produced amorphous silicon

    DOEpatents

    Staebler, David L.; Zanzucchi, Peter J.

    1980-01-01

    A method of inducing differential etch rates in glow discharge produced amorphous silicon by heating a portion of the glow discharge produced amorphous silicon to a temperature of about 365.degree. C. higher than the deposition temperature prior to etching. The etch rate of the exposed amorphous silicon is less than the unheated amorphous silicon.

  18. Comparison of the surface charge behavior of commercial silicon nitride and silicon carbide powders

    NASA Technical Reports Server (NTRS)

    Whitman, Pamela K.; Feke, Donald L.

    1988-01-01

    The adsorption and desorption of protons from aqueous solution onto the surfaces of a variety of commercial silicon carbide and silicon nitride powders has been examined using a surface titration methodology. This method provides information on some colloidal characteristics, such as the point of zero charge (pzc) and the variation of proton adsorption with dispersion pH, useful for the prediction of optimal ceramic-processing conditions. Qualitatively, the magnitude of the proton adsorption from solution reveals small differences among all of the materials studied. However, the results show that the pzc for the various silicon nitride powders is affected by the powder synthesis route. Complementary investigations have shown that milling can also act to shift the pzc exhibited by silicon nitride powder. Also, studies of the role of the electrolyte in the development of surface charge have indicated no evidence of specific adsorption of ammonium ion on either silicon nitride or silicon carbide powders.

  19. Comparison of the surface charge behavior of commercial silicon nitride and silicon carbide powders

    NASA Technical Reports Server (NTRS)

    Whitman, Pamela K.; Feke, Donald L.

    1988-01-01

    The adsorption and desorption of protons from aqueous solution onto the surfaces of a variety of commercial silicon carbide and silicon nitride powders has been examined using a surface titration methodology. This method provides information on some colloidal characteristics, such as the point of zero charge (pzc) and the variation of proton adsorption with dispersion pH, useful for the prediction of optimal ceramic-processing conditions. Qualitatively, the magnitude of the proton adsorption from solution reveals small differences among all of the materials studied. However, the results show that the pzc for the various silicon nitride powders is affected by the powder synthesis route. Complementary investigations have shown that milling can also act to shift the pzc exhibited by silicon nitride powder. Also, studies of the role of the electrolyte in the development of surface charge have indicated no evidence of specific adsorption of ammonium ion on either silicon nitride or silicon carbide powders.

  20. Revised activation estimates for silicon carbide

    SciTech Connect

    Heinisch, H.L.; Cheng, E.T.; Mann, F.M.

    1996-10-01

    Recent progress in nuclear data development for fusion energy systems includes a reevaluation of neutron activation cross sections for silicon and aluminum. Activation calculations using the newly compiled Fusion Evaluated Nuclear Data Library result in calculated levels of {sup 26}Al in irradiated silicon that are about an order of magnitude lower than the earlier calculated values. Thus, according to the latest internationally accepted nuclear data, SiC is much more attractive as a low activation material, even in first wall applications.

  1. Friction, deformation and fracture of single-crystal silicon carbide

    NASA Technical Reports Server (NTRS)

    Miyoshi, K.; Buckley, D. H.

    1977-01-01

    Friction experiments were conducted with hemispherical and conical diamond riders sliding on the basal plane of silicon carbide. The results indicate that, when deformation is primarily elastic, the friction does not depend on crystallographic orientation and there is no detectable fracture or cracking. When, however, plastic deformation occurs, silicon carbide exhibits anisotropic friction and deformation behavior. Surface fracture crack patterns surrounding wear tracks are observed to be of three types. The crack-geometries of two types are generally independent of orientation, the third crack, however, depends on the orientation. All surface cracks extend into subsurface. Anisotropic friction, deformation and fracture on the basal plane are primarily controlled by the slip system and cleavage.

  2. Evaluation of silicon carbide fiber/titanium composites

    NASA Technical Reports Server (NTRS)

    Jech, R. W.; Signorelli, R. A.

    1979-01-01

    Izod impact, tensile, and modulus of elasticity were determined for silicon carbide fiber/titanium composites to evaluate their potential usefulness as substitutes for titanium alloys or stainless steel in stiffness critical applications for aircraft turbine engines. Variations in processing conditions and matrix ductility were examined to produce composites having good impact strength in both the as-fabricated condition and after air exposure at elevated temperature. The impact strengths of composites containing 36 volume percent silicon carbide (SiC) fiber in an unalloyed (A-40) titanium matrix were found to be equal to unreinforced titanium-6 aluminum-4 vanadium alloy; the tensile strengths of the composites were marginally better than the unreinforced unalloyed (A-70) matrix at elevated temperature, though not at room temperature. At room temperature the modulus of elasticity of the composites was 48 percent higher than titanium or its alloys and 40 percent higher than that of stainless steel.

  3. Diffusion Bonding of Silicon Carbide for MEMS-LDI Applications

    NASA Technical Reports Server (NTRS)

    Halbig, Michael C.; Singh, Mrityunjay; Shpargel, Tarah P.; Kiser, J. Douglas

    2007-01-01

    A robust joining approach is critically needed for a Micro-Electro-Mechanical Systems-Lean Direct Injector (MEMS-LDI) application which requires leak free joints with high temperature mechanical capability. Diffusion bonding is well suited for the MEMS-LDI application. Diffusion bonds were fabricated using titanium interlayers between silicon carbide substrates during hot pressing. The interlayers consisted of either alloyed titanium foil or physically vapor deposited (PVD) titanium coatings. Microscopy shows that well adhered, crack free diffusion bonds are formed under optimal conditions. Under less than optimal conditions, microcracks are present in the bond layer due to the formation of intermetallic phases. Electron microprobe analysis was used to identify the reaction formed phases in the diffusion bond. Various compatibility issues among the phases in the interlayer and substrate are discussed. Also, the effects of temperature, pressure, time, silicon carbide substrate type, and type of titanium interlayer and thickness on the microstructure and composition of joints are discussed.

  4. Preferential killing of cancer cells using silicon carbide quantum dots.

    PubMed

    Mognetti, Barbara; Barberis, Alessandro; Marino, Silvia; Di Carlo, Francesco; Lysenko, Vladimir; Marty, Olivier; Géloën, Alain

    2010-12-01

    Silicon carbide quantum dots are highly luminescent biocompatible nanoparticles whose properties might be of particular interest for biomedical applications. In this study we investigated Silicon Carbide Quantum Dots (3C-SiC QDs) cellular localisation and influence on viability and proliferation on oral squamous carcinoma (AT-84 and HSC) and immortalized cell lines (S-G). They clearly localize into the nuclei, but the presence of 3C-SiC QDs in culture medium provoke morphological changes in cultured cells. We demonstrate that 3C-SiC QDs display dose- and time-dependent selective cytotoxicity on cancer versus immortalized cells in vitro. Since one of the limitations of classical antineoplastic drugs is their lack of selectivity, these results open a new way in the search for antiproliferative drugs.

  5. Room temperature quantum emission from cubic silicon carbide nanoparticles.

    PubMed

    Castelletto, Stefania; Johnson, Brett C; Zachreson, Cameron; Beke, David; Balogh, István; Ohshima, Takeshi; Aharonovich, Igor; Gali, Adam

    2014-08-26

    The photoluminescence (PL) arising from silicon carbide nanoparticles has so far been associated with the quantum confinement effect or to radiative transitions between electronically active surface states. In this work we show that cubic phase silicon carbide nanoparticles with diameters in the range 45-500 nm can host other point defects responsible for photoinduced intrabandgap PL. We demonstrate that these nanoparticles exhibit single photon emission at room temperature with record saturation count rates of 7 × 10(6) counts/s. The realization of nonclassical emission from SiC nanoparticles extends their potential use from fluorescence biomarker beads to optically active quantum elements for next generation quantum sensing and nanophotonics. The single photon emission is related to single isolated SiC defects that give rise to states within the bandgap.

  6. [beta]-silicon carbide protective coating and method for fabricating same

    DOEpatents

    Carey, P.G.; Thompson, J.B.

    1994-11-01

    A polycrystalline beta-silicon carbide film or coating and method for forming same on components, such as the top of solar cells, to act as an extremely hard protective surface, and as an anti-reflective coating are disclosed. This is achieved by DC magnetron co-sputtering of amorphous silicon and carbon to form a SiC thin film onto a surface, such as a solar cell. The thin film is then irradiated by a pulsed energy source, such as an excimer laser, to synthesize the poly- or [mu]c-SiC film on the surface and produce [beta]-SiC. While the method of this invention has primary application in solar cell manufacturing, it has application wherever there is a requirement for an extremely hard surface. 3 figs.

  7. .beta.-silicon carbide protective coating and method for fabricating same

    DOEpatents

    Carey, Paul G.; Thompson, Jesse B.

    1994-01-01

    A polycrystalline beta-silicon carbide film or coating and method for forming same on components, such as the top of solar cells, to act as an extremely hard protective surface, and as an anti-reflective coating. This is achieved by DC magnetron co-sputtering of amorphous silicon and carbon to form a SiC thin film onto a surface, such as a solar cell. The thin film is then irradiated by a pulsed energy source, such as an excimer laser, to synthesize the poly- or .mu.c-SiC film on the surface and produce .beta.--SiC. While the method of this invention has primary application in solar cell manufacturing, it has application wherever there is a requirement for an extremely hard surface.

  8. Proton NMR studies of PECVD hydrogenated amorphous silicon films and HWCVD hydrogenated amorphous silicon films

    NASA Astrophysics Data System (ADS)

    Herberg, Julie Lynn

    This dissertation discusses a new understanding of the internal structure of hydrogenated amorphous silicon. Recent research in our group has included nuclear spin echo double resonance (SEDOR) measurements on device quality hydrogenated amorphous silicon photovoltaic films. Using the SEDOR pulse sequence with and without the perturbing 29Si pulse, we obtain Fourier transform spectra for film at 80K that allows us to distinguish between molecular hydrogen and hydrogen bonded to silicon. Using such an approach, we have demonstrated that high quality a-Si:H films produced by Plasma Enhanced Chemical Vapor Deposition (PECVD) from SiH 4 contains about ten atomic percent hydrogen, nearly 40% of which is molecular hydrogen, individually trapped in the amorphous equivalent of tetragonal sites (T-sites). The main objective of this dissertation is to examine the difference between a-Si:H made by PECVD techniques and a-Si:H made by Hot Wire Chemical Vapor Deposition (HWCVD) techniques. Proton NMR and 1H- 29Si SEDOR NMR are used to examine the hydrogen structure of HWCVD a-Si:H films prepared at the University of Utrecht and at the National Renewable Energy Laboratory (NREL). Past NMR studies have shown that high quality PECVD a-Si:H films have geometries in which 40% of the contained hydrogen is present as H2 molecules individually trapped in the amorphous equivalent of T-sites. A much smaller H2 fraction sometimes is physisorbed on internal surfaces. In this dissertation, similar NMR methods are used to perform structural studies of the two HWCVD aSi:H samples. The 3kHz resonance line from T-site-trapped H2 molecules shows a hole-burn behavior similar to that found for PECVD a-Si:H films as does the 24kHz FWHM line from clustered hydrogen bonded to silicon. Radio frequency hole-burning is a tool to distinguish between inhomogenous and homogeneous broadening. In the hole-burn experiments, the 3kHz FWHM resonance line from T-site-trapped H2 molecules shows a hole

  9. PREPARATION OF B-MODIFICATION SILICON CARBIDE ALLOYED WITH VARIOUS IMPURITIES,

    DTIC Science & Technology

    The beta-modification of silicon carbide can be obtained by any of the following methods: (1) synthesis from silicon and carbon (graphite) at 1400...certain metals, a process based on the substantial temperature variation of the solubility of silicon carbide in fused metals; beta-SiC is obtained in

  10. Synthesis of multifilament silicon carbide fibers by chemical vapor deposition

    NASA Technical Reports Server (NTRS)

    Revankar, Vithal; Hlavacek, Vladimir

    1991-01-01

    A process for development of clean silicon carbide fiber with a small diameter and high reliability is presented. An experimental evaluation of operating conditions for SiC fibers of good mechanical properties and devising an efficient technique which will prevent welding together of individual filaments are discussed. The thermodynamic analysis of a different precursor system was analyzed vigorously. Thermodynamically optimum conditions for stoichiometric SiC deposit were obtained.

  11. Meteoritic silicon carbide - Pristine material from carbon stars

    NASA Technical Reports Server (NTRS)

    Lewis, Roy S.; Amari, Sachiko; Anders, Edward

    1990-01-01

    All five gases in interstellar silicon carbide grains have grossly nonsolar isotopic and elemental abundances that vary with grain size but are strikingly similar to calculated values for the helium-burning shell of low-mass carbon stars. Apparently these grains formed in carbon-star envelopes, and were impregnated with noble gas ions from a stellar wind. Meteoritic SiC provides a detailed record of nuclear and chemical processes in carbon stars.

  12. 6H Silicon Carbide Photoconductive Switches for High Power Applications

    DTIC Science & Technology

    2006-11-01

    6H SILICON CARBIDE PHOTOCONDUCTIVE SWITCHES FOR HIGH POWER APPLICATIONS W. C. Nunnally*, N. Islam, K. Kelkar & C. Fessler Photonics for Radars...PROJECT NUMBER 5e. TASK NUMBER 5f. WORK UNIT NUMBER 7. PERFORMING ORGANIZATION NAME(S) AND ADDRESS(ES) Photonics for Radars and Optical Systems...switches. Additional work by the UMC Photonics for Radar and Optical Systems (PROS) group has demonstrated that the relatively new material of

  13. Microstructure and properties of IN SITU toughened silicon carbide

    SciTech Connect

    De Jonghe, Lutgard C.; Ritchie, Robert O.; Zhang, Xiao Feng

    2003-05-01

    A silicon carbide with a fracture toughness as high as 9.1 MPa.m1/2 has been developed by hot pressing b-SiC powder with aluminum, boron, and carbon additions (ABC-SiC). Central in this material development has been systematic transmission electron microscopy (TEM) and mechanical characterizations. In particular, atomic-resolution electron microscopy and nanoprobe composition quantification were combined in analyzing grain boundary structure and nanoscale structural features.

  14. Defects in Amorphous Silicon: Dynamics and Role on Crystallization.

    NASA Astrophysics Data System (ADS)

    Shin, Jung Hoon

    Defects play a crucial role in determining the properties of many materials of scientific and technological interest. With ion irradiation, it is possible to controllably inject defects, and thus carefully study the dynamics of defect creation and annihilation, as well as the effects such defect injection has on materials properties and phase transformations. Amorphous silicon is a model system for the study of amorphous solids characterized as continuous random networks. In hydrogenated form, it is an important material for semiconductor devices such as solar cells and thin film transistors. It is the aim of this thesis to elucidate the dynamics of defects in an amorphous silicon matrix, and the role such defects can play on crystallization of amorphous silicon. In the first chapter, the concept of a continuous random network that characterizes amorphous silicon is presented as an introduction to amorphous silicon. Structural relaxation, or annihilation of non-equilibrium defects in an amorphous matrix, is introduced. Also developed are the concept of the activation energy spectrum theory for structural relaxation of amorphous solids and the density of relaxation states. In the second chapter, the density of relaxation states for the structural relaxation of amorphous silicon is measured by measuring changes in electrical conductivity, using ion irradiation and thermal anneal to create and annihilate defects, respectively. A new quantitative model for defect creation and annihilation, termed the generalized activation energy spectrum theory, is developed in Chapter 3, and is found to be superior to previous models in describing defect dynamics in amorphous silicon. In Chapter 4, the effect of irradiation on the crystallization of amorphous silicon is investigated. It is found that irradiation affects crystallization even when the growth kinetics of crystal grains is unaffected, and that defects injected into amorphous matrix by irradiation probably play a role in

  15. Construction and characterization of amorphous-silicon test structures

    SciTech Connect

    Koppel, L.N.; Milgram, A.A.

    1987-08-01

    The central goal of the project was to qualify amorphous silicon, a newly developed semiconductor material, as the basis for economical large-area photoconductive detectors of penetrating radiation. The thrust of the project was to establish the feasibility of constructing photoconductive amorphous-silicon devices whose electronic properties supported the radiation detection application. This issue of feasibility was successfully resolved by construction and experimental characterization of amorphous-silicon test pieces representative of the existing state-of-the-art. The focus of this work was the measurement of material electronic properties known to affect the performance of solid-state radiation detectors, and the investigation of candidate junction-device architectures. The construction and experimental evaluation of prototype radiation detectors based on amorphous silicon was beyond the scope of the current effort, and will form the core of work to be accomplished within a Phase II continuation of the project.

  16. Mechanism of combustion synthesis of silicon carbide

    NASA Astrophysics Data System (ADS)

    Narayan, J.; Raghunathan, R.; Chowdhury, R.; Jagannadham, K.

    1994-06-01

    The mechanism of self-propagating high-temperature synthesis (SHS) or combustion synthesis of SiC has been investigated using pellets consisting of silicon and carbon powders. The combustion reaction was initiated by rapidly heating the pellet on a graphite strip. The reaction products were analyzed using scanning and transmission electron microscopy, x-ray diffraction, and Raman spectroscopy. The results show that it is possible to produce β-SiC without any residual silicon and carbon. Occasionally, a very small number density of α-SiC precipitates embedded in the β-SiC matrix was observed. Based upon the microstructural features, it is proposed that the formation of SiC involves the dissolution of carbon into liquid silicon, diffusion of C into liquid silicon, and subsequent precipitation of SiC. The size of the SiC crystallites is determined by the diffusion coefficient of carbon in liquid silicon and the time available for SiC precipitation. The activation enthalpy for the SHS process is estimated to be 59±3 kcal/mol.

  17. Process for preparing fine grain silicon carbide powder

    DOEpatents

    Wei, G.C.

    Finely divided silicon carbide powder is obtained by mixing colloidal silica and unreacted phenolic resin in either acetone or methanol, evaporating solvent from the obtained solution to form a gel, drying and calcining the gel to polymerize the phenolic resin therein, pyrolyzing the dried and calcined gel at a temperature in the range of 500 to 1000/sup 0/C, and reacting silicon and carbon in the pyrolyzed gel at a temperature in the range of 1550 to 1700/sup 0/C to form the powder.

  18. Improvement of contact resistances on plasma-exposed silicon carbide

    NASA Astrophysics Data System (ADS)

    Cheung, R.; Hay, J.; van der Drift, E.; Gao, W.

    2000-11-01

    We demonstrate improvements in the specific contact resistance of unannealed ohmic contacts by at least one order of magnitude on undoped 6H-SiC (silicon carbide, SiC). The improved contacts with a specific resistance of 0.3 Ω cm 2 have been fabricated on SiC surfaces exposed to an argon plasma at -80 V for 2.5 min. Under these plasma conditions, the top monolayers of the plasma-exposed SiC surface is silicon rich as revealed by X-ray photoelectron spectroscopy, and the surface roughness is decreased by a factor of 2 from atomic force microscopy analysis.

  19. Numerical Simulation of the Detonation Propagation in Silicon Carbide Shell

    NASA Astrophysics Data System (ADS)

    Balagansky, Igor; Terechov, Anton

    2013-06-01

    Last years it was experimentally shown that in condensed high explosive charges (HE) placed in silicon carbide shell with sound velocity greater than the detonation velocity in HE, there may be observed interesting phenomena. Depending on the conditions, as an increase or decrease of the detonation velocity and pressure on the detonation front can be observed. There is also the distortion of the detonation front until the formation of a concave front. For a detailed explanation of the physical nature of the phenomenon we have provided numerical simulation of detonation wave propagation in Composition B HE charge, which was placed in silicon carbide shell. Modeling was performed with Ansys Autodyn in 2D-axis symmetry posting on an Eulerian mesh. Special attention was paid to selection of the parameters values in Lee-Tarver kinetic equation for HE and choice of constants to describe behavior of the ceramics. For comparison, also we have carried out the modeling of propagation of detonation in a completely similar assembly with brass shell. The simulation results agree well with the experimental data. In particular, in silicon carbide shell distortion of the detonation front was observed. A characteristic feature of the process is the pressure waves propagating in the direction of the axis of symmetry on the back surface of the detonation front.

  20. Bonding and Integration Technologies for Silicon Carbide Based Injector Components

    NASA Technical Reports Server (NTRS)

    Halbig, Michael C.; Singh, Mrityunjay

    2008-01-01

    Advanced ceramic bonding and integration technologies play a critical role in the fabrication and application of silicon carbide based components for a number of aerospace and ground based applications. One such application is a lean direct injector for a turbine engine to achieve low NOx emissions. Ceramic to ceramic diffusion bonding and ceramic to metal brazing technologies are being developed for this injector application. For the diffusion bonding, titanium interlayers (PVD and foils) were used to aid in the joining of silicon carbide (SiC) substrates. The influence of such variables as surface finish, interlayer thickness (10, 20, and 50 microns), processing time and temperature, and cooling rates were investigated. Microprobe analysis was used to identify the phases in the bonded region. For bonds that were not fully reacted an intermediate phase, Ti5Si3Cx, formed that is thermally incompatible in its thermal expansion and caused thermal stresses and cracking during the processing cool-down. Thinner titanium interlayers and/or longer processing times resulted in stable and compatible phases that did not contribute to microcracking and resulted in an optimized microstructure. Tensile tests on the joined materials resulted in strengths of 13-28 MPa depending on the SiC substrate material. Non-destructive evaluation using ultrasonic immersion showed well formed bonds. For the joining technology of brazing Kovar fuel tubes to silicon carbide, preliminary development of the joining approach has begun. Various technical issues and requirements for the injector application are addressed.

  1. Silicon Carbide Mounts for Fabry-Perot Interferometers

    NASA Technical Reports Server (NTRS)

    Lindemann, Scott

    2011-01-01

    Etalon mounts for tunable Fabry- Perot interferometers can now be fabricated from reaction-bonded silicon carbide structural components. These mounts are rigid, lightweight, and thermally stable. The fabrication of these mounts involves the exploitation of post-casting capabilities that (1) enable creation of monolithic structures having reduced (in comparison with prior such structures) degrees of material inhomogeneity and (2) reduce the need for fastening hardware and accommodations. Such silicon carbide mounts could be used to make lightweight Fabry-Perot interferometers or could be modified for use as general lightweight optical mounts. Heretofore, tunable Fabry-Perot interferometer structures, including mounting hardware, have been made from the low-thermal-expansion material Invar (a nickel/iron alloy) in order to obtain the thermal stability required for spectroscopic applications for which such interferometers are typically designed. However, the high mass density of Invar structures is disadvantageous in applications in which there are requirements to minimize mass. Silicon carbide etalon mounts have been incorporated into a tunable Fabry-Perot interferometer of a prior design that originally called for Invar structural components. The strength, thermal stability, and survivability of the interferometer as thus modified are similar to those of the interferometer as originally designed, but the mass of the modified interferometer is significantly less than the mass of the original version.

  2. Method for removing oxide contamination from silicon carbide powders

    DOEpatents

    Brynestad, J.; Bamberger, C.E.

    1984-08-01

    The described invention is directed to a method for removing oxide contamination in the form of oxygen-containing compounds such as SiO/sub 2/ and B/sub 2/O/sub 3/ from a charge of finely divided silicon carbide. The silicon carbide charge is contacted with a stream of hydrogen fluoride mixed with an inert gas carrier such as argon at a temperature in the range of about 200/sup 0/ to 650/sup 0/C. The oxides in the charge react with the heated hydrogen fluoride to form volatile gaseous fluorides such as SiF/sub 4/ and BF/sub 3/ which pass through the charge along with unreacted hydrogen fluoride and the carrier gas. Any residual gaseous reaction products and hydrogen fluoride remaining in the charge are removed by contacting the charge with the stream of inert gas which also cools the powder to room temperature. The removal of the oxygen contamination by practicing the present method provides silicon carbide powders with desirable pressing and sintering characteristics. 1 tab.

  3. Visible-blind ultraviolet photodetectors on porous silicon carbide substrates

    SciTech Connect

    Naderi, N.; Hashim, M.R.

    2013-06-01

    Highlights: • Highly reliable UV detectors are fabricated on porous silicon carbide substrates. • The optical properties of samples are enhanced by increasing the current density. • The optimized sample exhibits enhanced sensitivity to the incident UV radiation. - Abstract: Highly reliable visible-blind ultraviolet (UV) photodetectors were successfully fabricated on porous silicon carbide (PSC) substrates. High responsivity and high photoconductive gain were observed in a metal–semiconductor–metal ultraviolet photodetector that was fabricated on an optimized PSC substrate. The PSC samples were prepared via the UV-assisted photo-electrochemical etching of an n-type hexagonal silicon carbide (6H-SiC) substrate using different etching current densities. The optical results showed that the current density is an outstanding etching parameter that controls the porosity and uniformity of PSC substrates. A highly porous substrate was synthesized using a suitable etching current density to enhance its light absorption, thereby improving the sensitivity of UV detector with this substrate. The electrical characteristics of fabricated devices on optimized PSC substrates exhibited enhanced sensitivity and responsivity to the incident radiation.

  4. Ceramic composites reinforced with modified silicon carbide whiskers

    DOEpatents

    Tiegs, Terry N.; Lindemer, Terrence B.

    1990-01-01

    Silicon carbide whisker-reinforced ceramic composites are fabricated in a highly reproducible manner by beneficating the surfaces of the silicon carbide whiskers prior to their usage in the ceramic composites. The silicon carbide whiskers which contain considerable concentrations of surface oxides and other impurities which interact with the ceramic composite material to form a chemical bond are significantly reduced so that only a relatively weak chemical bond is formed between the whisker and the ceramic material. Thus, when the whiskers interact with a crack propagating into the composite the crack is diverted or deflected along the whisker-matrix interface due to the weak chemical bonding so as to deter the crack propagation through the composite. The depletion of the oxygen-containing compounds and other impurities on the whisker surfaces and near surface region is effected by heat treating the whiskers in a suitable oxygen sparaging atmosphere at elevated temperatures. Additionally, a sedimentation technique may be utilized to remove whiskers which suffer structural and physical anomalies which render them undesirable for use in the composite. Also, a layer of carbon may be provided on the surface of the whiskers to further inhibit chemical bonding of the whiskers to the ceramic composite material.

  5. Barrier properties of nano silicon carbide designed chitosan nanocomposites.

    PubMed

    Pradhan, Gopal C; Dash, Satyabrata; Swain, Sarat K

    2015-12-10

    Nano silicon carbide (SiC) designed chitosan nanocomposites were prepared by solution technique. Fourier transform infrared spectroscopy (FTIR) and X-ray diffraction (XRD) were used for studying structural interaction of nano silicon carbide (SiC) with chitosan. The morphology of chitosan/SiC nanocomposites was investigated by field emission scanning electron microscope (FESEM), and high resolution transmission electron microscope (HRTEM). The thermal stability of chitosan was substantially increased due to incorporation of stable silicon carbide nanopowder. The oxygen permeability of chitosan/SiC nanocomposites was reduced by three folds as compared to the virgin chitosan. The chemical resistance properties of chitosan were enhanced due to the incorporation of nano SiC. The biodegradability was investigated using sludge water. The tensile strength of chitosan/SiC nanocomposites was increased with increasing percentage of SiC. The substantial reduction in oxygen barrier properties in combination with increased thermal stability, tensile strength and chemical resistance properties; the synthesized nanocomposite may be suitable for packaging applications.

  6. Parallel microwave chemistry in silicon carbide microtiter platforms: a review.

    PubMed

    Kappe, C Oliver; Damm, Markus

    2012-02-01

    In this review, applications of silicon carbide-based microtiter platforms designed for use in combination with dedicated multimode microwave reactors are described. These platforms are employed not only for the efficient parallel synthesis of compound libraries, but also in the context of high-throughput reaction screening/optimization and a number of other (bio)analytical and biomedical applications. Since the semiconducting plate material (silicon carbide) is strongly microwave absorbing and possesses high thermal conductivity, no temperature gradients across the microtiter plate exist. Therefore, many of the disadvantages experienced in attempting to perform microtiter plate chemistry under conventional microwave conditions can be eliminated. In general, the silicon carbide-based microtiter platforms allow sealed vessel processing (either directly in the well or in glass vials placed into the wells) of volumes ranging from 0.02-3.0 mL at a maximum temperature/pressure limit of 200°C/20 bar. Depending on the specific plate and rotor configuration, a maximum of 80-192 transformations can be carried out in parallel in a single microwave irradiation experiment under strict temperature control. A platform type utilizing HPLC/GC vials as reaction vessels allows analysis directly from the reaction vessel eliminating the need for a transfer step from the reaction to the analysis vial. The latter system is particularly useful for analytical applications as well as reaction optimization/screening.

  7. The Development of Silicon Carbide Based Hydrogen and Hydrocarbon Sensors

    NASA Technical Reports Server (NTRS)

    Liu, Chung-Chiun

    1994-01-01

    Silicon carbide is a high temperature electronic material. Its potential for development of chemical sensors in a high temperature environment has not been explored. The objective of this study is to use silicon carbide as the substrate material for the construction of chemical sensors for high temperature applications. Sensors for the detection of hydrogen and hydrocarbon are developed in this program under the auspices of Lewis Research Center, NASA. Metal-semiconductor or metal-insulator-semiconductor structures are used in this development. Specifically, using palladium-silicon carbide Schottky diodes as gas sensors in the temperature range of 100 to 400 C are designed, fabricated and assessed. The effect of heat treatment on the Pd-SiC Schottky diode is examined. Operation of the sensors at 400 C demonstrate sensitivity of the sensor to hydrogen and hydrocarbons. Substantial progress has been made in this study and we believe that the Pd-SiC Schottky diode has potential as a hydrogen and hydrocarbon sensor over a wide range of temperatures. However, the long term stability and operational life of the sensor need to be assessed. This aspect is an important part of our future continuing investigation.

  8. Model of boron diffusion from gas phase in silicon carbide

    SciTech Connect

    Aleksandrov, O. V.; Mokhov, E. N.

    2011-06-15

    Boron diffusion from the gas phase in silicon carbide is described on the basis of a two-component model. 'Shallow' boron, i.e., boron at silicon sites, is a slow component with a high surface concentration. Its diffusivity is proportional to the concentration of positively charged intrinsic point defects, which are presumably interstitial silicon atoms. 'Deep' boron, i.e., impurity-defect pairs of boron-carbon vacancy, is a fast component with lower surface concentration. The ratio between the surface concentrations of the components depends on the pressure of silicon or carbon vapors in the gas phase. The diffusion and interaction of components are described by the set of diffusion-reaction equations. The diffusion retardation observed on the concentration-profile tail is related to the capture of impurity-defect pairs and excess vacancies by traps of background impurities and defects.

  9. Aligned silicon carbide nanowire crossed nets with high superhydrophobicity.

    PubMed

    Niu, Jun Jie; Wang, Jian Nong; Xu, Qian Feng

    2008-06-01

    Aligned silicon carbide nanowire crossed nets (a-SiCNWNs) were directly synthesized by using a vapor-solid reaction at 1100 degrees C. Zinc sulfide was used as catalyst to assist the growth of a-SiCNWNs with small size and crystal structure. After functionalization with perfluoroalkysilane, a-SiCNWNs showed excellent superhydrophobic property with a high water contact angle more than 156 +/- 2 degrees , compared to random nanowires (147 +/- 2 degrees ) and pure silicon wafers (101 +/- 2 degrees ). The topographic roughness and chemical modification with CF 2/CF 3 groups contributed the better superhydrophobicity. Furthermore, the as-grown SiCNWNs can be scraped off and coated on other substrates such as pure silicon wafers. The novel nanowire coating with good superhydrophobicity displays extensive applications in silicon-related fields such as solar cells, radar, etc.

  10. Extreme-Environment Silicon-Carbide (SiC) Wireless Sensor Suite

    NASA Technical Reports Server (NTRS)

    Yang, Jie

    2015-01-01

    Phase II objectives: Develop an integrated silicon-carbide wireless sensor suite capable of in situ measurements of critical characteristics of NTP engine; Compose silicon-carbide wireless sensor suite of: Extreme-environment sensors center, Dedicated high-temperature (450 deg C) silicon-carbide electronics that provide power and signal conditioning capabilities as well as radio frequency modulation and wireless data transmission capabilities center, An onboard energy harvesting system as a power source.

  11. Single Molecule Source Reagents for Chemical Vapor Deposition of B- Silicon Carbide

    DTIC Science & Technology

    1992-12-10

    vapor deposition of stoichiometric Beta silicon carbide . Four single molecule sources were synthesized, their decomposition pathways studied, and their...utility in Beta- silicon carbide CVD investigated. Dramatic differences in the CVD process resulted from small changes in the reagent structure. A...strained cyclic molecule, 1,3-disilacyclobutane, allowed growth of a Beta- silicon carbide film at a temperature >300 deg C lower than was possible with a

  12. Tensile Strengths of Silicon Carbide (SiC) Under Shock Loading

    DTIC Science & Technology

    2001-03-01

    The present work was initiated to measure and compare tensile strengths (i.e., spall thresholds) of five different types/varieties of silicon carbide materials...France. Spall strengths of these five different silicon carbide materials were measured by performing plane shock wave experiments to a maximum impact...investigation is that spall strength of silicon carbide , irrespective of its manufacturing process, improves initially to a certain impact stress level

  13. Polarization effects in femtosecond laser induced amorphization of monocrystalline silicon

    NASA Astrophysics Data System (ADS)

    Bai, Feng; Li, Hong-Jin; Huang, Yuan-Yuan; Fan, Wen-Zhong; Pan, Huai-Hai; Wang, Zhuo; Wang, Cheng-Wei; Qian, Jing; Li, Yang-Bo; Zhao, Quan-Zhong

    2016-10-01

    We have used femtosecond laser pulses to ablate monocrystalline silicon wafer. Raman spectroscopy and X-ray diffraction analysis of ablation surface indicates horizontally polarized laser beam shows an enhancement in amorphization efficiency by a factor of 1.6-1.7 over the circularly polarized laser ablation. This demonstrates that one can tune the amorphization efficiency through the polarization of irradiation laser.

  14. Affordable Fabrication and Properties of Silicon Carbide-Based Interpenetrating Phase Composites

    NASA Technical Reports Server (NTRS)

    Singh, Mrityunjay

    1998-01-01

    An affordable processing technique for the fabrication of silicon carbide-based interpenetrating phase composites (IPCs) is presented. This process consists of the production of microporous carbon preforms and subsequent infiltration with liquid silicon or silicon-refractory metal alloys. The microporous preforms are made by the pyrolysis of a polymerized resin mixture for which methods to control pore volume and pore size have been established. The process gives good control of microstructure and morphology of silicon carbide-based composite materials. Room and high temperature mechanical properties (flexural strength, compressive strength, and flexural creep) of low and high silicon-silicon carbide composites will be discussed.

  15. Graphitized silicon carbide microbeams: wafer-level, self-aligned graphene on silicon wafers

    NASA Astrophysics Data System (ADS)

    Cunning, Benjamin V.; Ahmed, Mohsin; Mishra, Neeraj; Ranjbar Kermany, Atieh; Wood, Barry; Iacopi, Francesca

    2014-08-01

    Currently proven methods that are used to obtain devices with high-quality graphene on silicon wafers involve the transfer of graphene flakes from a growth substrate, resulting in fundamental limitations for large-scale device fabrication. Moreover, the complex three-dimensional structures of interest for microelectromechanical and nanoelectromechanical systems are hardly compatible with such transfer processes. Here, we introduce a methodology for obtaining thousands of microbeams, made of graphitized silicon carbide on silicon, through a site-selective and wafer-scale approach. A Ni-Cu alloy catalyst mediates a self-aligned graphitization on prepatterned SiC microstructures at a temperature that is compatible with silicon technologies. The graphene nanocoating leads to a dramatically enhanced electrical conductivity, which elevates this approach to an ideal method for the replacement of conductive metal films in silicon carbide-based MEMS and NEMS devices.

  16. Resonant addressing and manipulation of silicon vacancy qubits in silicon carbide.

    PubMed

    Riedel, D; Fuchs, F; Kraus, H; Väth, S; Sperlich, A; Dyakonov, V; Soltamova, A A; Baranov, P G; Ilyin, V A; Astakhov, G V

    2012-11-30

    Several systems in the solid state have been suggested as promising candidates for spin-based quantum information processing. In spite of significant progress during the last decade, there is a search for new systems with higher potential [D. DiVincenzo, Nat. Mater. 9, 468 (2010)]. We report that silicon vacancy defects in silicon carbide comprise the technological advantages of semiconductor quantum dots and the unique spin properties of the nitrogen-vacancy defects in diamond. Similar to atoms, the silicon vacancy qubits can be controlled under the double radio-optical resonance conditions, allowing for their selective addressing and manipulation. Furthermore, we reveal their long spin memory using pulsed magnetic resonance technique. All these results make silicon vacancy defects in silicon carbide very attractive for quantum applications.

  17. Graphitized silicon carbide microbeams: wafer-level, self-aligned graphene on silicon wafers.

    PubMed

    Cunning, Benjamin V; Ahmed, Mohsin; Mishra, Neeraj; Kermany, Atieh Ranjbar; Wood, Barry; Iacopi, Francesca

    2014-08-15

    Currently proven methods that are used to obtain devices with high-quality graphene on silicon wafers involve the transfer of graphene flakes from a growth substrate, resulting in fundamental limitations for large-scale device fabrication. Moreover, the complex three-dimensional structures of interest for microelectromechanical and nanoelectromechanical systems are hardly compatible with such transfer processes. Here, we introduce a methodology for obtaining thousands of microbeams, made of graphitized silicon carbide on silicon, through a site-selective and wafer-scale approach. A Ni-Cu alloy catalyst mediates a self-aligned graphitization on prepatterned SiC microstructures at a temperature that is compatible with silicon technologies. The graphene nanocoating leads to a dramatically enhanced electrical conductivity, which elevates this approach to an ideal method for the replacement of conductive metal films in silicon carbide-based MEMS and NEMS devices.

  18. Hydrogen effusion from tritiated amorphous silicon

    NASA Astrophysics Data System (ADS)

    Kherani, N. P.; Liu, B.; Virk, K.; Kosteski, T.; Gaspari, F.; Shmayda, W. T.; Zukotynski, S.; Chen, K. P.

    2008-01-01

    Results for the effusion and outgassing of tritium from tritiated hydrogenated amorphous silicon (a-Si:H:T) films are presented. The samples were grown by dc-saddle field glow discharge at various substrate temperatures between 150 and 300°C. The tracer property of radioactive tritium is used to detect tritium release. Tritium effusion measurements are performed in a nonvacuum ion chamber and are found to yield similar results as reported for standard high vacuum technique. The results suggest for decreasing substrate temperature the growth of material with an increasing concentration of voids. These data are corroborated by analysis of infrared absorption data in terms of microstructure parameters. For material of low substrate temperature (and high void concentration) tritium outgassing in air at room temperature was studied, and it was found that after 600h about 0.2% of the total hydrogen (hydrogen+tritium) content is released. Two rate limiting processes are identified. The first process, fast tritium outgassing with a time constant of 15h, seems to be related to surface desorption of tritiated water (HTO) with a free energy of desorption of 1.04eV. The second process, slow tritium outgassing with a time constant of 200-300h, appears to be limited by oxygen diffusivity in a growing oxide layer. This material of lowest H stability would lose half of the hydrogen after 60years.

  19. Amorphous Silicon: Flexible Backplane and Display Application

    NASA Astrophysics Data System (ADS)

    Sarma, Kalluri R.

    Advances in the science and technology of hydrogenated amorphous silicon (a-Si:H, also referred to as a-Si) and the associated devices including thin-film transistors (TFT) during the past three decades have had a profound impact on the development and commercialization of major applications such as thin-film solar cells, digital image scanners and X-ray imagers and active matrix liquid crystal displays (AMLCDs). Particularly, during approximately the past 15 years, a-Si TFT-based flat panel AMLCDs have been a huge commercial success. a-Si TFT-LCD has enabled the note book PCs, and is now rapidly replacing the venerable CRT in the desktop monitor and home TV applications. a-Si TFT-LCD is now the dominant technology in use for applications ranging from small displays such as in mobile phones to large displays such as in home TV, as well-specialized applications such as industrial and avionics displays.

  20. Mechanism for amorphization of boron carbide B{sub 4}C under uniaxial compression

    SciTech Connect

    Aryal, Sitaram; Rulis, Paul; Ching, W. Y.

    2011-11-01

    Boron carbide undergoes an amorphization transition under high-velocity impacts, causing it to suffer a catastrophic loss in strength. The failure mechanism is not clear and this limits the ways to improve its resistance to impact. To help uncover the failure mechanism, we used ab initio methods to carry out large-scale uniaxial compression simulations on two polytypes of stoichiometric boron carbide (B{sub 4}C), B{sub 11}C-CBC, and B{sub 12}-CCC, where B{sub 11}C or B{sub 12} is the 12-atom icosahedron and CBC or CCC is the three-atom chain. The simulations were performed on large supercells of 180 atoms. Our results indicate that the B{sub 11}C-CBC (B{sub 12}-CCC) polytype becomes amorphous at a uniaxial strain s = 0.23 (0.22) and with a maximum stress of 168 (151) GPa. In both cases, the amorphous state is the consequence of structural collapse associated with the bending of the three-atom chain. Careful analysis of the structures after amorphization shows that the B{sub 11}C and B{sub 12} icosahedra are highly distorted but still identifiable. Calculations of the elastic coefficients (C{sub ij}) at different uniaxial strains indicate that both polytypes may collapse under a much smaller shear strain (stress) than the uniaxial strain (stress). On the other hand, separate simulations of both models under hydrostatic compression up to a pressure of 180 GPa show no signs of amorphization, in agreement with experimental observation. The amorphized nature of both models is confirmed by detailed analysis of the evolution of the radial pair distribution function, total density of states, and distribution of effective charges on atoms. The electronic structure and bonding of the boron carbide structures before and after amorphization are calculated to further elucidate the mechanism of amorphization and to help form the proper rationalization of experimental observations.

  1. Amorphous Silicon Nanowires Grown on Silicon Oxide Film by Annealing

    NASA Astrophysics Data System (ADS)

    Yuan, Zhishan; Wang, Chengyong; Chen, Ke; Ni, Zhonghua; Chen, Yunfei

    2017-08-01

    In this paper, amorphous silicon nanowires (α-SiNWs) were synthesized on (100) Si substrate with silicon oxide film by Cu catalyst-driven solid-liquid-solid mechanism (SLS) during annealing process (1080 °C for 30 min under Ar/H2 atmosphere). Micro size Cu pattern fabrication decided whether α-SiNWs can grow or not. Meanwhile, those micro size Cu patterns also controlled the position and density of wires. During the annealing process, Cu pattern reacted with SiO2 to form Cu silicide. More important, a diffusion channel was opened for Si atoms to synthesis α-SiNWs. What is more, the size of α-SiNWs was simply controlled by the annealing time. The length of wire was increased with annealing time. However, the diameter showed the opposite tendency. The room temperature resistivity of the nanowire was about 2.1 × 103 Ω·cm (84 nm diameter and 21 μm length). This simple fabrication method makes application of α-SiNWs become possible.

  2. Amorphous Silicon Nanowires Grown on Silicon Oxide Film by Annealing.

    PubMed

    Yuan, Zhishan; Wang, Chengyong; Chen, Ke; Ni, Zhonghua; Chen, Yunfei

    2017-08-10

    In this paper, amorphous silicon nanowires (α-SiNWs) were synthesized on (100) Si substrate with silicon oxide film by Cu catalyst-driven solid-liquid-solid mechanism (SLS) during annealing process (1080 °C for 30 min under Ar/H2 atmosphere). Micro size Cu pattern fabrication decided whether α-SiNWs can grow or not. Meanwhile, those micro size Cu patterns also controlled the position and density of wires. During the annealing process, Cu pattern reacted with SiO2 to form Cu silicide. More important, a diffusion channel was opened for Si atoms to synthesis α-SiNWs. What is more, the size of α-SiNWs was simply controlled by the annealing time. The length of wire was increased with annealing time. However, the diameter showed the opposite tendency. The room temperature resistivity of the nanowire was about 2.1 × 10(3) Ω·cm (84 nm diameter and 21 μm length). This simple fabrication method makes application of α-SiNWs become possible.

  3. Silicon heterojunction solar cell and crystallization of amorphous silicon

    NASA Astrophysics Data System (ADS)

    Lu, Meijun

    The rapid growth of photovoltaics in the past decade brings on the soaring price and demand for crystalline silicon. Hence it becomes necessary and also profitable to develop solar cells with over 20% efficiency, using thin (˜100mum) silicon wafers. In this respect, diffused junction cells are not the best choice, since the inescapable heating in the diffusion process not only makes it hard to handle thin wafers, but also reduces carriers' bulk lifetime and impairs the crystal quality of the substrate, which could lower cell efficiency. An alternative is the heterojunction cells, such as amorphous silicon/crystalline silicon heterojunction (SHJ) solar cell, where the emitter layer can be grown at low temperature (<200°C). In first part of this dissertation, I will introduce our work on front-junction SHJ solar cell, including the importance of intrinsic buffer layer; the discussion on the often observed anomalous "S"-shaped J-V curve (low fill factor) by using band diagram analysis; the surface passivation quality of intrinsic buffer and its relationship to the performance of front-junction SHJ cells. Although the a-Si:H is found to help to achieve high efficiency in c-Si heterojuntion solar cells, it also absorbs short wavelength (<600 nm) light, leading to non-ideal blue response and lower short circuit currents (JSC) in the front-junction SHJ cells. Considering this, heterojunction with both a-Si:H emitter and base contact on the back side in an interdigitated pattern, i.e. interdigitated back contact silicon heterojunction (IBC-SHJ) solar cell, is developed. This dissertation will show our progress in developing IBC-SHJ solar cells, including the structure design; device fabrication and characterization; two dimensional simulation by using simulator Sentaurus Device; some special features of IBC-SHJ solar cells; and performance of IBC-SHJ cells without and with back surface buffer layers. Another trend for solar cell industry is thin film solar cells, since

  4. Plasma Deposition of Silicon Carbide Thin Films.

    DTIC Science & Technology

    1987-08-20

    1987 Contract No. F49620-84-C-0063 August 20, 1987 Air Force Office of Scientific Research Bolling Air Force Base Washington, DC 20332 Captain Kevin...1987 Air Force Office of Scientific Research Bolling Air Force Base Washington, DC 20332 Captain Kevin J. Malloy Program Manager Westinghouse R&D Center...hydrocarbon species with silicon surfaces . At the outset of the program, very little work had been done in this area, so the research methods had to be

  5. Nanoscale engineering of radiation tolerant silicon carbide.

    PubMed

    Zhang, Yanwen; Ishimaru, Manabu; Varga, Tamas; Oda, Takuji; Hardiman, Chris; Xue, Haizhou; Katoh, Yutai; Shannon, Steven; Weber, William J

    2012-10-14

    Radiation tolerance is determined by how effectively the microstructure can remove point defects produced by irradiation. Engineered nanocrystalline SiC with a high-density of stacking faults (SFs) has significantly enhanced recombination of interstitials and vacancies, leading to self-healing of irradiation-induced defects. While single crystal SiC readily undergoes an irradiation-induced crystalline to amorphous transformation at room temperature, the nano-engineered SiC with a high-density of SFs exhibits more than an order of magnitude increase in radiation resistance. Molecular dynamics simulations of collision cascades show that the nano-layered SFs lead to enhanced mobility of interstitial Si atoms. The remarkable radiation resistance in the nano-engineered SiC is attributed to the high-density of SFs within nano-sized grain structures that significantly enhance point defect annihilation.

  6. Nanoscale Engineering Of Radiation Tolerant Silicon Carbide

    SciTech Connect

    Zhang, Yanwen; Ishimaru, Manabu; Varga, Tamas; Oda, Takuji; Hardiman, Christopher M.; Xue, Haizhou; Katoh, Yutai; Shannon, Steven; Weber, William J.

    2012-08-14

    Radiation tolerance is determined by how effectively the microstructure can remove point defects produced by irradiation. Engineered nanocrystalline SiC with a high-density of stacking faults (SFs) has significantly enhanced recombination of interstitials and vacancies, leading to selfhealing of irradiation-induced defects. While single crystal SiC readily undergoes an irradiationinduced crystalline to amorphous transformation at room temperature, the nano-engineered SiC with a high-density of SFs exhibits more than an order of magnitude increase in radiation resistance. Molecular dynamics simulations of collision cascades show that the nano-layered SFs lead to enhanced mobility of interstitial Si atoms. The remarkable radiation resistance in the nano-engineered SiC is attributed to the high-density of SFs within nano-sized grain structures that significantly enhance point defect annihilation.

  7. Fluorine-enhanced boron diffusion in amorphous silicon

    NASA Astrophysics Data System (ADS)

    Jacques, J. M.; Robertson, L. S.; Jones, K. S.; Law, M. E.; Rendon, Mike; Bennett, Joe

    2003-05-01

    Silicon wafers were preamorphized with 70 keV Si+ at a dose of 1×1015atoms/cm2, generating a deep amorphous layer of 1800 Å. Implants of 500 eV 11B+, with and without 6 keV F+, followed at doses of 1×1015 atoms/cm2 and 2×1015 atoms/cm2, respectively. After annealing at 550 °C, secondary ion mass spectroscopy determined that the diffusivity of boron in amorphous silicon is significantly enhanced in the presence of fluorine. Ellipsometry and cross-sectional transmission electron microscopy indicate the enhanced diffusion only occurs in the amorphous layer. Fluorine increases the boron diffusivity by approximately five orders of magnitude at 550 °C. It is proposed that the ability of fluorine to reduce the dangling bond concentration in amorphous silicon may reduce the formation energy for mobile boron, enhancing its diffusivity.

  8. Exposure to Fibres, Crystalline Silica, Silicon Carbide and Sulphur Dioxide in the Norwegian Silicon Carbide Industry

    PubMed Central

    Føreland, S.; Bye, E.; Bakke, B.; Eduard, W.

    2008-01-01

    Objectives: The aim of this study was to assess personal exposure to fibres, crystalline silica, silicon carbide (SiC) and sulphur dioxide in the Norwegian SiC industry. Methods: Approximately 720 fibre samples, 720 respirable dust samples and 1400 total dust samples were collected from randomly chosen workers from the furnace, processing and maintenance departments in all three Norwegian SiC plants. The respirable dust samples were analysed for quartz, cristobalite and non-fibrous SiC content. Approximately 240 sulphur dioxide samples were collected from workers in the furnace department. Results: The sorting operators from all plants, control room and cleaning operators in Plant A and charger, charger/mix and payloader operators in Plant C had a geometric mean (GM) of fibre exposure above the Norwegian occupational exposure limit (OEL) (0.1 fibre cm−3). The cleaner operators in Plant A had the highest GM exposure to respirable quartz (20 μg m−3). The charger/mix operators in Plant C had the highest GM exposure to respirable cristobalite (38 μg m−3) and the refinery crusher operators in Plant A had the highest GM exposure to non-fibrous SiC (0.65 mg m−3). Exposure to the crystalline silica and non-fibrous SiC was generally low and between 0.4 and 2.1% of the measurements exceeded the OELs. The cleaner operators in Plant A had the highest GM exposure to respirable dust (1.3 mg m−3) and total dust (21 mg m−3). GM exposures for respirable dust above the Norwegian SiC industry-specific OEL of 0.5 mg m−3 were also found for refinery crusher operators in all plants and mix, charger, charger/mix and sorting operators in Plant C. Only 4% of the total dust measurements exceeded the OEL for nuisance dust of (10 mg m−3). Exposure to sulphur dioxide was generally low. However, peaks in the range of 10–100 p.p.m. were observed for control room and crane operators in Plants A and B and for charger and charger/mix operators in Plant C. Conclusion: Workers in

  9. Research and Development on Advanced Silicon Carbide Thin Film Growth Techniques and Fabrication of High Power and Microwave Frequency Silicon Carbide-Based Device Structures

    DTIC Science & Technology

    1991-12-01

    AD-A243 531IIII!IIHUHllAlll| DTIC Annual Letter Report EL Vr DECA S C Research and Development on Advanced Silicon Carbide Thin Film Growth...Techniques and Fabrication of High Power and Microwave Frequency Silicon Carbide -Based Device Structures Supported under Grant #N00014-88-K-0341/P00002 Office...Letter l/,1- 2 3 lj9 l 4. TITLE AND SUBTITLE Research and Develp~nt on Advanced S. FUNDING NUMBERS Silicon Carbide Thin Film .Growth Techniques and R&T

  10. Gas-phase formation of silicon carbides, oxides, and sulphides from atomic silicon ions

    NASA Technical Reports Server (NTRS)

    Bohme, Diethard K.; Wlodek, Stanislaw; Fox, Arnold

    1989-01-01

    A systematic experimental study of the kinetics and mechanisms of the chemical reactions in the gas phase between ground-state Si(+)2p and a variety of astrophysical molecules. The aim of this study is to identify the reactions which trigger the formation of chemical bonds between silicon and carbon, oxygen and sulphur, and the chemical pathways which lead to further molecular growth. Such knowledge is valuable in the identification of new extraterrestrial silicon-bearing molecules and for an assessment of the gas-phase transition from atomic silicon to silicon carbide and silicate grain particles in carbon-rich and oxygen-rich astrophysical environments.

  11. Spin-photon entanglement interfaces in silicon carbide defect centers

    NASA Astrophysics Data System (ADS)

    Economou, Sophia E.; Dev, Pratibha

    2016-12-01

    Optically active spins in solid-state systems can be engineered to emit photons that are entangled with the spin in the solid. This allows for applications such as quantum communications, quantum key distribution, and distributed quantum computing. Recently, there has been a strong interest in silicon carbide defects, as they emit very close to the telecommunication wavelength, making them excellent candidates for long range quantum communications. In this work we develop explicit schemes for spin-photon entanglement in several SiC defects: the silicon monovacancy, the silicon divacancy, and the NV center in SiC. Distinct approaches are given for (i) single-photon and spin entanglement and (ii) the generation of long strings of entangled photons. The latter are known as cluster states and comprise a resource for measurement-based quantum information processing.

  12. Spin-photon entanglement interfaces in silicon carbide defect centers.

    PubMed

    Economou, Sophia E; Dev, Pratibha

    2016-12-16

    Optically active spins in solid-state systems can be engineered to emit photons that are entangled with the spin in the solid. This allows for applications such as quantum communications, quantum key distribution, and distributed quantum computing. Recently, there has been a strong interest in silicon carbide defects, as they emit very close to the telecommunication wavelength, making them excellent candidates for long range quantum communications. In this work we develop explicit schemes for spin-photon entanglement in several SiC defects: the silicon monovacancy, the silicon divacancy, and the NV center in SiC. Distinct approaches are given for (i) single-photon and spin entanglement and (ii) the generation of long strings of entangled photons. The latter are known as cluster states and comprise a resource for measurement-based quantum information processing.

  13. Liquid-Liquid Phase Transition in Nanoconfined Silicon Carbide.

    PubMed

    Wu, Weikang; Zhang, Leining; Liu, Sida; Ren, Hongru; Zhou, Xuyan; Li, Hui

    2016-03-02

    We report theoretical evidence of a liquid-liquid phase transition (LLPT) in liquid silicon carbide under nanoslit confinement. The LLPT is characterized by layering transitions induced by confinement and pressure, accompanying the rapid change in density. During the layering transition, the proportional distribution of tetracoordinated and pentacoordinated structures exhibits remarkable change. The tricoordinated structures lead to the microphase separation between silicon (with the dominant tricoordinated, tetracoordinated, and pentacoordinated structures) and carbon (with the dominant tricoordinated structures) in the layer close to the walls. A strong layer separation between silicon atoms and carbon atoms is induced by strong wall-liquid forces. Importantly, the pressure confinement phase diagram with negative slopes for LLPT lines indicates that, under high pressure, the LLPT is mainly confinement-induced, but under low pressure, it becomes dominantly pressure-induced.

  14. Electrical characteristics of amorphous iron-tungsten contacts on silicon

    NASA Technical Reports Server (NTRS)

    Finetti, M.; Pan, E. T.-S.; Nicolet, M.-A.; Suni, I.

    1983-01-01

    The electrical characteristics of amorphous Fe-W contacts have been determined on both p-type and n-type silicon. The amorphous films were obtained by cosputtering from a composite target. Contact resistivities of 1 x 10 to the -7th and 2.8 x 10 to the -6th were measured on n(+) and p(+) silicon, respectively. These values remain constant after thermal treatment up to at least 500 C. A barrier height of 0.61 V was measured on n-type silicon.

  15. Exciton Resonances in Novel Silicon Carbide Polymers

    NASA Astrophysics Data System (ADS)

    Burggraf, Larry; Duan, Xiaofeng

    2015-05-01

    A revolutionary technology transformation from electronics to excitionics for faster signal processing and computing will be advantaged by coherent exciton transfer at room temperature. The key feature required of exciton components for this technology is efficient and coherent transfer of long-lived excitons. We report theoretical investigations of optical properties of SiC materials having potential for high-temperature excitonics. Using Car-Parinello simulated annealing and DFT we identified low-energy SiC molecular structures. The closo-Si12C12 isomer, the most stable 12-12 isomer below 1100 C, has potential to make self-assembled chains and 2-D nanostructures to construct exciton components. Using TDDFT, we calculated the optical properties of the isomer as well as oligomers and 2-D crystal formed from the isomer as the monomer unit. This molecule has large optical oscillator strength in the visible. Its high-energy and low-energy transitions (1.15 eV and 2.56 eV) are nearly pure one-electron silicon-to-carbon transitions, while an intermediate energy transition (1.28 eV) is a nearly pure carbon-to-silicon one-electron charge transfer. These results are useful to describe resonant, coherent transfer of dark excitons in the nanostructures. Research supported by the Air Force Office of Scientific Research.

  16. Theoretical studies of amorphous and paracrystalline silicon

    NASA Astrophysics Data System (ADS)

    Nakhmanson, Serge M.

    Until recently, structural models used to represent amorphous silicon (a-Si) in computer simulations were either perfectly fourfold connected random networks or random networks containing only miscoordinated atoms. These models are an approximation to the structure of the real material and do not uniformly comply with all the experimental data for a-Si. In this dissertation we make an attempt to go beyond this approximation and construct and examine models that have two major types of defects, encountered in real material, in their structure---nanovoids and crystalline grains. For our study of voids in a-Si we have calculated vibrational properties of structural models of a-Si with and without voids using ab initio and empirical molecular dynamics techniques. A small 216 atom and a large 4096 atom continuous random network (CRN) models for a-Si have been employed as starting points for our a-Si models with voids. Our calculations show that the presence of voids leads to an emergence of localized low-energy states in the vibrational spectrum of the model system. Moreover, it appears that these states are responsible for the anomalous behavior of system's specific heat at very low temperatures. To our knowledge these are the first numerical simulations that provide adequate agreement with experiment for the very low-temperature properties of specific heat in disordered materials within the limits of harmonic approximation. For our study of crystalline grains in a-Si we have developed a new procedure for the preparation of physically realistic models of paracrystalline silicon based on a modification of the bond-switching method of Wooten, Winer, and Weaire. Our models contain randomly oriented c-Si grains embedded in a disordered matrix. Our technique creates interfaces between the crystalline and disordered phases of Si with an extremely low concentration of coordination defects. The resulting models possess structural and vibrational properties comparable with

  17. Epitaxial growth of cadmium telluride films on silicon with a buffer silicon carbide layer

    NASA Astrophysics Data System (ADS)

    Antipov, V. V.; Kukushkin, S. A.; Osipov, A. V.

    2017-02-01

    An epitaxial 1-3-μm-thick cadmium telluride film has been grown on silicon with a buffer silicon carbide layer using the method of open thermal evaporation and condensation in vacuum for the first time. The optimum substrate temperature was 500°C at an evaporator temperature of 580°C, and the growth time was 4 s. In order to provide more qualitative growth of cadmium telluride, a high-quality 100-nm-thick buffer silicon carbide layer was previously synthesized on the silicon surface using the method of topochemical substitution of atoms. The ellipsometric, Raman, X-ray diffraction, and electron-diffraction analyses showed a high structural perfection of the CdTe layer in the absence of a polycrystalline phase.

  18. Method for silicon carbide production by reacting silica with hydrocarbon gas

    DOEpatents

    Glatzmaier, Gregory C.

    1994-01-01

    A method is described for producing silicon carbide particles using a silicon source material and a hydrocarbon. The method is efficient and is characterized by high yield. Finely divided silicon source material is contacted with hydrocarbon at a temperature of 400.degree. C. to 1000.degree. C. where the hydrocarbon pyrolyzes and coats the particles with carbon. The particles are then heated to 1100.degree. C. to 1600.degree. C. to cause a reaction between the ingredients to form silicon carbide of very small particle size. No grinding of silicon carbide is required to obtain small particles. The method may be carried out as a batch process or as a continuous process.

  19. Method for silicon carbide production by reacting silica with hydrocarbon gas

    DOEpatents

    Glatzmaier, G.C.

    1994-06-28

    A method is described for producing silicon carbide particles using a silicon source material and a hydrocarbon. The method is efficient and is characterized by high yield. Finely divided silicon source material is contacted with hydrocarbon at a temperature of 400 C to 1000 C where the hydrocarbon pyrolyzes and coats the particles with carbon. The particles are then heated to 1100 C to 1600 C to cause a reaction between the ingredients to form silicon carbide of very small particle size. No grinding of silicon carbide is required to obtain small particles. The method may be carried out as a batch process or as a continuous process. 5 figures.

  20. Continuous synthesis of silicon carbide whiskers

    NASA Astrophysics Data System (ADS)

    Choi, Heon-Jin; Lee, June-Gunn

    1995-04-01

    Experimental synthesis of SiC whiskers coupled with thermodynamic calculations revealed the preferred reaction routes for the efficient synthesis of SiC whiskers. This formed the basis for the design of a continuous reactor, which consists of a boat-train loaded with silica-carbon mixture and iron-coated graphite substrate above it in an alumina-tube reactor. High-quality SiC whiskers have been grown with diameters of 1-3 micron. The yield was about 30% based on the silicon input as SiO2 and output as SiC whiskers. This demonstrates the feasibility of continuous SiC whiskers production without the additional processes of purification and classification.

  1. Silicon Carbide Emitter Turn-Off Thyristor

    DOE PAGES

    Wang, Jun; Wang, Gangyao; Li, Jun; ...

    2008-01-01

    A novel MOS-conmore » trolled SiC thyristor device, the SiC emitter turn-off thyristor (ETO) is a promising technology for future high-voltage switching applications because it integrates the excellent current conduction capability of a SiC thyristor with a simple MOS-control interface. Through unity-gain turn-off, the SiC ETO also achieves excellent Safe Operation Area (SOA) and faster switching speeds than silicon ETOs. The world's first 4.5-kV SiC ETO prototype shows a forward voltage drop of 4.26 V at 26.5  A / cm 2 current density at room and elevated temperatures. Tested in an inductive circuit with a 2.5 kV DC link voltage and a 9.56-A load current, the SiC ETO shows a fast turn-off time of 1.63 microseconds and a low 9.88 mJ turn-off energy. The low switching loss indicates that the SiC ETO could operate at about 4 kHz if 100  W / cm 2 conduction and the 100  W / cm 2 turn-off losses can be removed by the thermal management system. This frequency capability is about 4 times higher than 4.5-kV-class silicon power devices. The preliminary demonstration shows that the SiC ETO is a promising candidate for high-frequency, high-voltage power conversion applications, and additional developments to optimize the device for higher voltage (>5 kV) and higher frequency (10 kHz) are needed.« less

  2. Microstructural Evolution of Chloride-Cleaned Silicon Carbide Aluminum Composites

    NASA Astrophysics Data System (ADS)

    Adeosun, S. O.; Akpan, E. I.; Gbenebor, O. P.; Balogun, S. A.

    2016-02-01

    This study examines the synergy between reinforcement surface modifications on the evolution of microstructures of AA6011-silicon carbide particle (SiCp) composites in multidirectional solidification. Silicon carbide particles (SiCp) were cleaned with ammonium chloride, tin(II) chloride, sodium chloride, and palladium(II) chloride and used as reinforcement to cast AA6011-SiCp composites by applying the stir casting method. A scanning electron microscope and x-ray diffractometer were used to investigate the morphology and phases present, respectively, in the composite material. Results show that wetting agents were effective as they inhibited the formation of Al4C3 in all modified composites. The modified SiCp was found to have varying effects on the morphology, dendrite arm size and direction, size and configuration of AlFeSi, and the amount of eutectic silicon depending on the concentration of the reagent and cleaning time. The highest effect was shown by the use of 40 g/L of tin(II) chloride. The composites had short dendritic arms, good interfacial interaction, and only a few crystals of AlFeSi.

  3. Utility-Scale Silicon Carbide Semiconductor: Monolithic Silicon Carbide Anode Switched Thyristor for Medium Voltage Power Conversion

    SciTech Connect

    2010-09-01

    ADEPT Project: GeneSiC is developing an advanced silicon-carbide (SiC)-based semiconductor called an anode-switched thyristor. This low-cost, compact SiC semiconductor conducts higher levels of electrical energy with better precision than traditional silicon semiconductors. This efficiency will enable a dramatic reduction in the size, weight, and volume of the power converters and electronic devices it's used in.GeneSiC is developing its SiC-based semiconductor for utility-scale power converters. Traditional silicon semiconductors can't process the high voltages that utility-scale power distribution requires, and they must be stacked in complicated circuits that require bulky insulation and cooling hardware. GeneSiC's semiconductors are well suited for high-power applications like large-scale renewable wind and solar energy installations.

  4. Mechanism of the swift heavy ion induced epitaxial recrystallization in predamaged silicon carbide

    SciTech Connect

    Benyagoub, A.; Audren, A.

    2009-10-15

    Although silicon carbide has attracted extensive investigations of ion irradiation effects at low energy owing to its potential use in harsh environments, very few works were carried out in the field of ion irradiation at high energy. A recent preliminary study exploring the combination of low and high energy ion irradiation effects in silicon carbide revealed that the damaged layer formed by low energy ion irradiation can undergo an epitaxial recrystallization under subsequent swift heavy ion irradiation. The present paper is devoted to the investigation of the mechanisms at the origin of this phenomenon by performing additional experiments. A detailed analysis of the kinetics of this recrystallization effect demonstrates that the latter cannot be explained by the models proposed for the well-known ion-beam-induced epitaxial crystallization process. Furthermore, it is found that this effect can be accounted for by a mechanism combining the melting within the ion tracks of the amorphous zones through a thermal spike process and their subsequent epitaxial recrystallization initiated from the neighboring crystalline regions wherever the size of the latter surpasses a certain critical value.

  5. Irradiation and annealing of p-type silicon carbide

    SciTech Connect

    Lebedev, Alexander A.; Bogdanova, Elena V.; Grigor'eva, Maria V.; Lebedev, Sergey P.; Kozlovski, Vitaly V.

    2014-02-21

    The development of the technology of semiconductor devices based on silicon carbide and the beginning of their industrial manufacture have made increasingly topical studies of the radiation hardness of this material on the one hand and of the proton irradiation to form high-receptivity regions on the other hand. This paper reports on a study of the carrier removal rate (V{sub d}) in p-6H-SiC under irradiation with 8 MeV protons and of the conductivity restoration in radiation- compensated epitaxial layers of various p-type silicon carbide polytypes. V{sub d} was determined by analysis of capacitance-voltage characteristics and from results of Hall effect measurements. It was found that the complete compensation of samples with the initial value of Na - Nd ≈ 1.5 × 10{sup 18} cm{sup −3} occurs at an irradiation dose of ∼1.1 × 10{sup 16} cm{sup −2}. It is shown that specific features of the sublimation layer SiC (compared to CVD layers) are clearly manifested upon the gamma and electron irradiation and are hardly noticeable under the proton and neutron irradiation. It was also found that the radiation-induced compensation of SiC is retained after its annealing at ≤1000°C. The conductivity is almost completely restored at T ≥ 1200°C. This character of annealing of the radiation compensation is independent of a silicon carbide polytype and the starting doping level of the epitaxial layer. The complete annealing temperatures considerably exceed the working temperatures of SiC-based devices. It is shown that the radiation compensation is a promising method in the technology of high-temperature devices based on SiC.

  6. Nuclear transformation of Chlamydomonas reinhardtii with silicon carbide fibers

    SciTech Connect

    Dunahay, T.G. )

    1992-01-01

    Efficient nuclear transformation of cell wall-deficient strains of the green alga Chlamydomonas reinhardtii can be accomplished by vortexing the cells in the presence of glass beads and polyethylene glycol (Kindle 1990 PNAS 87:1228). Intact (walled) cells can also be transformed using this protocol, but at very low efficiencies. Two recent reports have described the use of silicon carbide fibers to mediate DNA entry into plant suspension cells (Kaeppler et al. 1990 Plant Cell Rep. 9:414; Asano et al. 1991 Plant Sci. 79:247). The author has found that nuclear transformation efficiencies of walled cells of C. reinhardtii can be increased 3 to 10 fold by vortexing the cells in the presence of silicon carbide fibers and PEG. Using a modification of the glass bead transformation procedure, the wild-type nitrate reductase structural gene was used to complement a NR-deficient mutant of C. reinhardtii, nit-1-305. The transformation efficiency increased with longer vortexing times, although the absolute number of transformants varied between experiments, ranging from 10 to 40 transformants per 10[sup 7] cells. In contrast to vortexing with glass beads, cell viability was very high, with greater than 80% cell survival even after vortexing for 10 minutes. Neither cell death nor transformation efficiency increased when cell wall-deficient mutants (cw15 nit-1-305) were used as compared to intact cells. Experiments are in progress to test the applicability of silicon carbide-mediated transformation to other algal strains for which cell wall mutants or protoplasting procedures are unavailabile.

  7. Method of enhanced lithiation of doped silicon carbide via high temperature annealing in an inert atmosphere

    DOEpatents

    Hersam, Mark C.; Lipson, Albert L.; Bandyopadhyay, Sudeshna; Karmel, Hunter J; Bedzyk, Michael J

    2014-05-27

    A method for enhancing the lithium-ion capacity of a doped silicon carbide is disclosed. The method utilizes heat treating the silicon carbide in an inert atmosphere. Also disclosed are anodes for lithium-ion batteries prepared by the method.

  8. Decoupling of silicon carbide optical sensor response for temperature and pressure measurements

    NASA Astrophysics Data System (ADS)

    Chakravarty, A.; Quick, N. R.; Kar, A.

    2007-10-01

    Single crystal silicon carbide is a chemically inert transparent material with superior oxidation-resistant properties at elevated temperatures compared to black polycrystalline silicon carbide substrates. These improved properties make crystalline silicon carbide a good optical sensor material for harsh environments such as combustion chambers and turbine systems. Interferometric optical sensors are orders of magnitude more sensitive than electrical sensors and are proposed for these applications. Silicon carbide itself behaves as a Fabry-Pérot etalon eliminating the need for an external interferometer for any measurement using this silicon carbide as a sensor. The principle of the optical sensor in this study is the temperature- and pressure-dependent refractive index of silicon carbide, which can be used to determine the temperatures and pressures of gases that are in contact with silicon carbide. Interference patterns produced by a silicon carbide (4H-SiC) wafer due to multiple reflections of a helium-neon laser beam of wavelength of 632.8nm have been obtained at temperatures up to 500°C and pressures up to 600psi. The pattern changes for the same gas at different temperatures and pressures and for different gases at the same temperature and pressure. The refractive index at the wafer-gas interface is calculated from the interference pattern and the refractive index gradients with respect to temperature and pressure, respectively, are also determined. Decoupling temperature and pressure using these gradients and the measured reflectivity data are discussed in this paper.

  9. THE CRYSTAL STRUCTURE OF THE NEW SILICON CARBIDE POLYMORPH 69R,

    DTIC Science & Technology

    The 69R polymorph is one of the 32 silicon carbide polymorphs recently discovered by us. The space group is R3m and the unit cell is hexagonal with...and in two industrial silicon carbide crystal plates. They all pair with the fundamental type 6H. The five ways of pairing are: 6H + 69R + 87R, 6H

  10. Silicon carbide synthesis with energy pulses

    NASA Astrophysics Data System (ADS)

    Majni, G.; Mengucci, P.; D'Anna, E.; Leggieri, G.; Luches, A.; Nassisi, V.

    1989-08-01

    Polycrystalline SiC layers were synthesized through nanosecond pulse heating of thin carbon films deposited on single-crystalline silicon wafers. The samples were submitted to electron beam irradiation (25 keV, 50 ns) at various current densities in vacuum (˜10-4mbar) and to XeCl excimer laser pulses (308 nm, 15ns) in air. Rutherford backscattering spectrometry (RBS) showed that in the e-beam annealed samples mixing of the elements at the interface starts at current densities of about 1200 A/cm2. The mixed layer thickness increases almost linearly with current density. From the RBS spectra a composition of the intermixed layers close to the SiC compound was deduced. Transmission electron microscopy (TEM) and electron diffraction studies clearly evidenced the formation of SiC polycrystals. Using the XeCl excimer laser, intermixing of the deposited C film with the Si substrate was observed after a single 0.3 J/cm2 pulse. Further analysis evidenced the formation of SiC nanocrystals, embedded in a diamond film.

  11. Study of Nitrogen Concentration in Silicon Carbide

    NASA Astrophysics Data System (ADS)

    Wang, Hui; Yan, Cheng-Feng; Kong, Hai-Kuan; Chen, Jian-Jun; Xin, Jun; Shi, Er-Wei; Yang, Jian-Hua

    2013-06-01

    This work focused on studying the nitrogen concentration ( C N) in SiC. The variations of C N in the synthesis of SiC powder as well as the transport during SiC crystal growth have been investigated for broad ranges of temperature and Ar pressure. Before SiC crystal growth, SiC powders were synthesized from high-purity silicon and carbon powders. The concentrations of nitrogen, free C, and free Si in the as-prepared powders were all measured. C N in the SiC source powder decreased with increasing temperature and decreasing Ar pressure, whereas it did not show a remarkable trend with the molar ratio of free Si to free C. SiC crystal was then grown by the physical vapor transport (PVT) technique using the as-prepared powder. The distribution of C N in the remaining material indirectly indicated the temperature field of crystal growth. In addition, compared with introducing N2 during SiC crystal growth, doping with nitrogen during synthesis of the SiC source powder might be a better method to control C N in SiC crystals.

  12. Heat transfer to a silicon carbide/water nanofluid.

    SciTech Connect

    Yu, W.; France , D. M.; Smith, D. S.; Singh, D.; Timofeeva, E. V.; Routbort, J. L.; Univ. of Illinois at Chicago

    2009-07-01

    Heat transfer experiments were performed with a water-based nanofluid containing 170-nm silicon carbide particles at a 3.7% volume concentration and having potential commercial viability. Heat transfer coefficients for the nanofluid are presented for Reynolds numbers ranging from 3300 to 13,000 and are compared to the base fluid water on the bases of constant Reynolds number, constant velocity, and constant pumping power. Results were also compared to predictions from standard liquid correlations and a recently altered nanofluid correlation. The slip mechanisms of Brownian diffusion and thermophoresis postulated in the altered correlation were investigated in a series of heating and cooling experiments.

  13. Dynamic consolidation of aluminum-silicon carbide composites

    SciTech Connect

    Rabin, B.H.; Korth, G.E.; Williamson, R.L.

    1990-01-01

    Dynamic consolidation was investigated as a potential method for producing P/M metal matrix composites. In this study, 2124 aluminum powders were mixed with silicon carbide particulate and consolidated using explosives. Numerical simulations were performed to provide insight into the consolidation process and to aid in the selection of experimental conditions. The microstructure of the as-consolidated product was dependent upon processing variables. Careful control of the shock parameters allowed full density, crack free composites to be achieved in cylindrical geometries. Although full density was obtained, low fracture strengths suggested a lack of interparticle bonding, probably resulting from the limited ability to redistribute surface oxides during consolidation. 10 refs., 9 figs.

  14. Temperature Induced Voltage Offset Drifts in Silicon Carbide Pressure Sensors

    NASA Technical Reports Server (NTRS)

    Okojie, Robert S.; Lukco, Dorothy; Nguyen, Vu; Savrun, Ender

    2012-01-01

    We report the reduction of transient drifts in the zero pressure offset voltage in silicon carbide (SiC) pressure sensors when operating at 600 C. The previously observed maximum drift of +/- 10 mV of the reference offset voltage at 600 C was reduced to within +/- 5 mV. The offset voltage drifts and bridge resistance changes over time at test temperature are explained in terms of the microstructure and phase changes occurring within the contact metallization, as analyzed by Auger electron spectroscopy and field emission scanning electron microscopy. The results have helped to identify the upper temperature reliable operational limit of this particular metallization scheme to be 605 C.

  15. Isotope Generated Electron Density in Silicon Carbide Direct Energy Converters

    DTIC Science & Technology

    2006-10-01

    Electricity, Year 3 Report for DOE contract, DE FG07-001D13927, August 2003. 22. Brown, P. M . Betavoltaic batteries. Journal of New Energy 2001, 5 (4...TECHL PUB (2 COPIES ) ATTN AMSRD-ARL-CI-OK-TL TECHL LIB (2 COPIES) ATTN AMSRD-ARL-SE-DE M LITZ (10 COPIES) ATTN AMSRD-ARL-SE-DE K...Isotope Generated Electron Density in Silicon Carbide Direct Energy Converters by Marc Litz and Kara Blaine ARL-TR-3964 October 2006

  16. Pulmonary effects of exposures in silicon carbide manufacturing.

    PubMed Central

    Peters, J M; Smith, T J; Bernstein, L; Wright, W E; Hammond, S K

    1984-01-01

    Chest x rays, smoking histories, and pulmonary function tests were obtained for 171 men employed in the manufacturing of silicon carbide. A lifetime exposure to respirable particulates (organic and inorganic fractions) and sulphur dioxide was estimated for each worker. Chest x ray abnormalities were related to respirable particulates (round opacities) and to age and smoking (linear opacities). Pulmonary function was affected by respirable particulates (FVC) and by sulphur dioxide and smoking (FEV1). Pleural thickening was related to age. No exposures exceeded the relevant standards; we therefore conclude that the current standards do not provide protection against injurious pulmonary effects, at least in this industry. PMID:6691928

  17. Harsh Environment Silicon Carbide Sensor Technology for Geothermal Instrumentation

    SciTech Connect

    Pisano, Albert P.

    2013-04-26

    This project utilizes Silicon Carbide (SiC) materials platform to fabricate advanced sensors to be used as high-temperature downhole instrumentation for the DOE’s Geothermal Technologies Program on Enhanced Geothermal Systems. The scope of the proposed research is to 1) develop a SiC pressure sensor that can operate in harsh supercritical conditions, 2) develop a SiC temperature sensor that can operate in harsh supercritical conditions, 3) develop a bonding process for adhering SiC sensor die to well casing couplers, and 4) perform experimental exposure testing of sensor materials and the sensor devices.

  18. The Oxidation of CVD Silicon Carbide in Carbon Dioxide

    NASA Technical Reports Server (NTRS)

    Opila, Elizabeth J.; Nguyen, QuynchGiao N.

    1997-01-01

    Chemically-vapor-deposited silicon carbide (CVD SiC) was oxidized in carbon dioxide (CO2) at temperatures of 1200-1400 C for times between 100 and 500 hours at several gas flow rates. Oxidation weight gains were monitored by thermogravimetric analysis (TGA) and were found to be very small and independent of temperature. Possible rate limiting kinetic laws are discussed. Oxidation of SiC by CO2 is negligible compared to the rates measured for other oxidants typically found in combustion environments: oxygen and water vapor.

  19. Synthesis of silicon carbide nanocrystals from waste polytetrafluoroethylene.

    PubMed

    Wang, Liangbiao; Cheng, Qinglin; Qin, Hengfei; Li, Zhongchun; Lou, Zhengsong; Lu, Juanjuan; Zhang, Junhao; Zhou, Quanfa

    2017-02-28

    Resource utilization of waste plastic could solve the problem of environmental pollution and simultaneously relieve energy shortages, achieving sustainable development. In this study, the conversion of waste polytetrafluoroethylene (PTFE) to cubic silicon carbide (SiC) nanoparticles has been described. The structures and morphologies of the obtained SiC were characterized by X-ray diffraction (XRD), scanning electron microscopy (SEM), and transmission electron microscopy (TEM). Furthermore, the FTIR spectrum of the obtained SiC sample suggests that the waste PTFE was completely converted into SiC in our approach.

  20. Thermal Transport Along the Dislocation Line in Silicon Carbide

    NASA Astrophysics Data System (ADS)

    Ni, Yuxiang; Xiong, Shiyun; Volz, Sebastian; Dumitric, Traian

    2014-09-01

    We elucidate thermal conductivity along the screw dislocation line, which represents a transport direction inaccessible to classical theories. By using equilibrium molecular dynamics simulations, we uncover a Burgers vector dependent thermal conductivity reduction in silicon carbide. The effect is uncorrelated with the classical modeling and originates in the highly deformed core region, which represents a significant source of anharmonic phonon-phonon scattering. High strain reduces the phonon relaxation time, especially in the longitudinal acoustic branches, and creates an effective internal thermal resistance around the dislocation axis. Our results have implications for designing materials useful for high-temperature electronics and thermoelectric applications.

  1. Improved Silicon Carbide Crystals Grown From Atomically Flat Surfaces

    NASA Technical Reports Server (NTRS)

    Neudeck, Philip G.

    2003-01-01

    The NASA Glenn Research Center is demonstrating that atomically flat (i.e., step-free) silicon carbide (SiC) surfaces are ideal for realizing greatly improved wide bandgap semiconductor films with lower crystal defect densities. Further development of these improved films could eventually enable harsh-environment electronics beneficial to jet engine and other aerospace and automotive applications, as well as much more efficient and compact power distribution and control. The technique demonstrated could also improve blue-light lasers and light-emitting-diode displays.

  2. Demonstration of Minimally Machined Honeycomb Silicon Carbide Mirrors

    NASA Technical Reports Server (NTRS)

    Goodman, William

    2012-01-01

    Honeycomb silicon carbide composite mirrors are made from a carbon fiber preform that is molded into a honeycomb shape using a rigid mold. The carbon fiber honeycomb is densified by using polymer infiltration pyrolysis, or through a reaction with liquid silicon. A chemical vapor deposit, or chemical vapor composite (CVC), process is used to deposit a polishable silicon or silicon carbide cladding on the honeycomb structure. Alternatively, the cladding may be replaced by a freestanding, replicated CVC SiC facesheet that is bonded to the honeycomb. The resulting carbon fiber-reinforced silicon carbide honeycomb structure is a ceramic matrix composite material with high stiffness and mechanical strength, high thermal conductivity, and low CTE (coefficient of thermal expansion). This innovation enables rapid, inexpensive manufacturing. The web thickness of the new material is less than 1 millimeter, and core geometries tailored. These parameters are based on precursor carbon-carbon honeycomb material made and patented by Ultracor. It is estimated at the time of this reporting that the HoneySiC(Trademark) will have a net production cost on the order of $38,000 per square meter. This includes an Ultracor raw material cost of about $97,000 per square meter, and a Trex silicon carbide deposition cost of $27,000 per square meter. Even at double this price, HoneySiC would beat NASA's goal of $100,000 per square meter. Cost savings are estimated to be 40 to 100 times that of current mirror technologies. The organic, rich prepreg material has a density of 56 kilograms per cubic meter. A charred carbon-carbon panel (volatile organics burnt off) has a density of 270 kilograms per cubic meter. Therefore, it is estimated that a HoneySiC panel would have a density of no more than 900 kilograms per cubic meter, which is about half that of beryllium and about onethird the density of bulk silicon carbide. It is also estimated that larger mirrors could be produced in a matter of weeks

  3. Modeling and simulation of boron-doped nanocrystalline silicon carbide thin film by a field theory.

    PubMed

    Xiong, Liming; Chen, Youping; Lee, James D

    2009-02-01

    This paper presents the application of a multiscale field theory in modeling and simulation of boron-doped nanocrystalline silicon carbide (B-SiC). The multiscale field theory was briefly introduced. Based on the field theory, numerical simulations show that intergranular glassy amorphous films (IGFs) and nano-sized pores exist in triple junctions of the grains for nanocrystalline B-SiC. Residual tensile stress in the SiC grains and compressive stress on the grain boundaries (GBs) were observed. Under tensile loading, it has been found that mechanical response of 5 wt% boron-SiC exhibits five characteristic regimes. Deformation mechanism at atomic scale has been revealed. Tensile strength and Young's modulus of nanocrystalline SiC were accurately reproduced.

  4. Electronic structure and localized states in a model amorphous silicon

    NASA Astrophysics Data System (ADS)

    Allan, G.; Delerue, C.; Lannoo, M.

    1998-03-01

    The electronic structure of a model amorphous silicon (a-Si) represented by a supercell of 4096 silicon atoms [B.R. Djordjevic, M.F. Thorpe, and F. Wooten, Phys. Rev. B 52, 5685 (1995)] and of a model hydrogenated amorphous silicon (a-Si:H) that we have built from the a-Si model are calculated in the tight-binding approximation. The band edges near the gap are characterized by exponential tails of localized states induced mainly by the variations in bond angles. The spatial localization of the states is compared between a-Si and a-Si:H. Comparison with experiments suggests that the structural models give good descriptions of the amorphous materials.

  5. Epitaxy of silicon carbide on silicon: Micromorphological analysis of growth surface evolution

    NASA Astrophysics Data System (ADS)

    Shikhgasan, Ramazanov; Ştefan, Ţălu; Dinara, Sobola; Sebastian, Stach; Guseyn, Ramazanov

    2015-10-01

    The main purpose of our research was the study of evolution of silicon carbide films on silicon by micromorphological analysis. Surface micromorphologies of Silicon Carbide epilayers with two different thicknesses were compared by means of fractal geometry. Silicon Carbide films were prepared on Si substrates by magnetron sputtering of polycrystalline target SiC in Ar atmosphere (99.999% purity). Synthesis of qualitative SiC/Si templates solves the questions of large diameter SiC single-crystal wafers formation. This technology decreases financial expenditure and provides integration of SiC into silicon technology. These hybrid substrates with buffer layer of high oriented SiC are useful for growth of both wide band gap materials (SiC, AlN, GaN) and graphene. The main problem of SiC heteroepitaxy on Si (1 1 1) is the large difference (∼20%) of the lattice parameters. Fractal analysis of surface morphology of heteroepitaxial films could help to understand the films growth mechanisms. The 3D (three-dimensional) surfaces revealed a fractal structure at the nanometer scale. The fractal dimension (D) provided global quantitative values that characterize the scale properties of surface geometry.

  6. Towards new binary compounds: Synthesis of amorphous phosphorus carbide by pulsed laser deposition

    SciTech Connect

    Hart, Judy N.; May, Paul W.; Allan, Neil L.; Hallam, Keith R.; Claeyssens, Frederik; Fuge, Gareth M.; Ruda, Michelle; Heard, Peter J.

    2013-02-15

    We have recently undertaken comprehensive computational studies predicting possible crystal structures of the as yet unknown phosphorus carbide as a function of composition. In this work, we report the synthesis of amorphous phosphorus-carbon films by pulsed laser deposition. The local bonding environments of carbon and phosphorus in the synthesised materials have been analysed by x-ray photoelectron spectroscopy; we have found strong evidence for the formation of direct P-C bonding and hence phosphorus carbide. There is a good agreement between the bonding environments found in this phosphorus carbide material and those predicted in the computational work. In particular, the local bonding environments are consistent with those found in the {beta}-InS-like structures that we predict to be low in energy for phosphorus:carbon ratios between 0.25 and 1. Highlights: Black-Right-Pointing-Pointer We have synthesised amorphous phosphorus-carbon films by pulsed laser deposition. Black-Right-Pointing-Pointer X-ray photoelectron spectroscopy results indicate formation of direct P-C bonds and hence phosphorus carbide. Black-Right-Pointing-Pointer Local bonding environments are consistent with those in predicted structures.

  7. Phase equilibrium in the formation of silicon carbide by topochemical conversion of silicon

    NASA Astrophysics Data System (ADS)

    Kukushkin, S. A.; Osipov, A. V.

    2016-04-01

    Methods of linear algebra were used to find a basis of independent chemical reactions in the topochemical conversion of silicon into silicon carbide by the reaction with carbon monoxide. The pressure-flow phase diagram was calculated from this basis, describing the composition of the solid phase for a particular design of vacuum furnace. It was demonstrated that to grow pure silicon carbide, it is necessary to ensure the pressure of carbon monoxide less than a certain value and its flow more than a certain value, depending on the temperature of the process. The elastic fields around vacancies formed were considered for the first time in calculating the topochemical reaction. It was shown that the anisotropy of these fields in a cubic crystal increases the constant of the main reaction approximately fourfold.

  8. Study of porous silicon, silicon carbide and DLC coated field emitters for pressure sensor application

    NASA Astrophysics Data System (ADS)

    Kleps, Irina; Angelescu, Anca; Samfirescu, Narcis; Gil, Adriana; Correia, Antonio

    2001-06-01

    This paper is a revue of our experimental data regarding field emitter array fabrication, various field emission materials and application in pressure sensors domain. Silicon emitter's arrays of different sizes and geometrical shapes were realised using micromachining technologies. Some important aspects as control in etch rate, emitter profile, selectivity and surface morphology were investigated. The emitter surface was modified or was covered by different materials in order to improve the emission properties. The most usual materials investigated for FED applications were: Si, diamond-like carbon layers, silicon carbide, and porous silicon. The main application which is present in our attention is the field emission pressure sensor.

  9. Porous silicon carbide (SiC) semiconductor device

    NASA Technical Reports Server (NTRS)

    Shor, Joseph S. (Inventor); Kurtz, Anthony D. (Inventor)

    1994-01-01

    A semiconductor device employs at least one layer of semiconducting porous silicon carbide (SiC). The porous SiC layer has a monocrystalline structure wherein the pore sizes, shapes, and spacing are determined by the processing conditions. In one embodiment, the semiconductor device is a p-n junction diode in which a layer of n-type SiC is positioned on a p-type layer of SiC, with the p-type layer positioned on a layer of silicon dioxide. Because of the UV luminescent properties of the semiconducting porous SiC layer, it may also be utilized for other devices such as LEDs and optoelectronic devices.

  10. Silicon Carbide-Based Hydrogen and Hydrocarbon Gas Detection

    NASA Technical Reports Server (NTRS)

    Hunter, Gary W.; Neudeck, Philip G.; Chen, Liang-Yu; Knight, D.; Liu, C. C.; Wu, Q. H.R

    1995-01-01

    Hydrogen and hydrocarbon detection in aeronautical applications is important for reasons of safety and emissions control. The use of silicon carbide as a semiconductor in a metal-semiconductor or metal-insulator-semiconductor structure opens opportunities to measure hydrogen and hydrocarbons in high temperature environments beyond the capabilities of silicon-based devices. The purpose of this paper is to explore the response and stability of Pd-SiC Schottky diodes as gas sensors in the temperature range from 100 to 400 C. The effect of heat treating on the diode properties as measured at 100 C is explored. Subsequent operation at 400 C demonstrates the diodes' sensitivity to hydrogen and hydrocarbons. It is concluded that the Pd-SiC Schottky diode has potential as a hydrogen and hydrocarbon sensor over a wide range of temperatures but further studies are necessary to determine the diodes' long term stability.

  11. Silicon Carbide Sensors and Electronics for Harsh Environment Applications

    NASA Technical Reports Server (NTRS)

    Evans, Laura J.

    2007-01-01

    Silicon carbide (SiC) semiconductor has been studied for electronic and sensing applications in extreme environment (high temperature, extreme vibration, harsh chemical media, and high radiation) that is beyond the capability of conventional semiconductors such as silicon. This is due to its near inert chemistry, superior thermomechanical and electronic properties that include high breakdown voltage and wide bandgap. An overview of SiC sensors and electronics work ongoing at NASA Glenn Research Center (NASA GRC) will be presented. The main focus will be two technologies currently being investigated: 1) harsh environment SiC pressure transducers and 2) high temperature SiC electronics. Work highlighted will include the design, fabrication, and application of SiC sensors and electronics, with recent advancements in state-of-the-art discussed as well. These combined technologies are studied for the goal of developing advanced capabilities for measurement and control of aeropropulsion systems, as well as enhancing tools for exploration systems.

  12. Surface wave accelerator based on silicon carbide: theoretical study

    NASA Astrophysics Data System (ADS)

    Kalmykov, S.; Korobkin, D.; Neuner, B.; Shvets, G.

    2009-01-01

    Compact near-field solid-state accelerating structure powered by a carbon dioxide (CO2) laser is considered. The accelerating luminous transverse magnetic mode is excited in a few-micron wide evacuated planar channel between two silicon carbide (SiC) films grown on silicon (Si) wafers. Laser coupling to this mode is accomplished through the properly designed Si gratings. Operating wavelength is dictated by the frequency-dependent dielectric permittivity of SiC and the channel width. The geometric loss factor κ of the accelerating mode is computed. It is found that the unwanted excitation of the guided modes in Si wafers reduces the laser coupling efficiency and increases the fields inside the Si wafer.

  13. Surface wave accelerator based on silicon carbide: theoretical study

    SciTech Connect

    Kalmykov, S.; Korobkin, D.; Neuner, B.; Shvets, G.

    2009-01-22

    Compact near-field solid-state accelerating structure powered by a carbon dioxide (CO{sub 2}) laser is considered. The accelerating luminous transverse magnetic mode is excited in a few-micron wide evacuated planar channel between two silicon carbide (SiC) films grown on silicon (Si) wafers. Laser coupling to this mode is accomplished through the properly designed Si gratings. Operating wavelength is dictated by the frequency-dependent dielectric permittivity of SiC and the channel width. The geometric loss factor {kappa} of the accelerating mode is computed. It is found that the unwanted excitation of the guided modes in Si wafers reduces the laser coupling efficiency and increases the fields inside the Si wafer.

  14. Optical thermometry based on level anticrossing in silicon carbide.

    PubMed

    Anisimov, A N; Simin, D; Soltamov, V A; Lebedev, S P; Baranov, P G; Astakhov, G V; Dyakonov, V

    2016-09-14

    We report a giant thermal shift of 2.1 MHz/K related to the excited-state zero-field splitting in the silicon vacancy centers in 4H silicon carbide. It is obtained from the indirect observation of the optically detected magnetic resonance in the excited state using the ground state as an ancilla. Alternatively, relative variations of the zero-field splitting for small temperature differences can be detected without application of radiofrequency fields, by simply monitoring the photoluminescence intensity in the vicinity of the level anticrossing. This effect results in an all-optical thermometry technique with temperature sensitivity of 100 mK/Hz(1/2) for a detection volume of approximately 10(-6) mm(3). In contrast, the zero-field splitting in the ground state does not reveal detectable temperature shift. Using these properties, an integrated magnetic field and temperature sensor can be implemented on the same center.

  15. Linear integrated optics in 3C silicon carbide.

    PubMed

    Martini, Francesco; Politi, Alberto

    2017-05-15

    The development of new photonic materials that combine diverse optical capabilities is needed to boost the integration of different quantum and classical components within the same chip. Amongst all candidates, the superior optical properties of cubic silicon carbide (3C SiC) could be merged with its crystalline point defects, enabling single photon generation, manipulation and light-matter interaction on a single device. The development of photonics devices in SiC has been limited by the presence of the silicon substrate, over which thin crystalline films are heteroepitaxially grown. By employing a novel approach in the material fabrication, we demonstrate grating couplers with coupling efficiency reaching -6 dB, sub-µm waveguides and high intrinsic quality factor (up to 24,000) ring resonators. These components are the basis for linear optical networks and essential for developing a wide range of photonics component for non-linear and quantum optics.

  16. Superconductivity in heavily boron-doped silicon carbide

    PubMed Central

    Kriener, Markus; Muranaka, Takahiro; Kato, Junya; Ren, Zhi-An; Akimitsu, Jun; Maeno, Yoshiteru

    2008-01-01

    The discoveries of superconductivity in heavily boron-doped diamond in 2004 and silicon in 2006 have renewed the interest in the superconducting state of semiconductors. Charge-carrier doping of wide-gap semiconductors leads to a metallic phase from which upon further doping superconductivity can emerge. Recently, we discovered superconductivity in a closely related system: heavily boron-doped silicon carbide. The sample used for that study consisted of cubic and hexagonal SiC phase fractions and hence this led to the question which of them participated in the superconductivity. Here we studied a hexagonal SiC sample, free from cubic SiC phase by means of x-ray diffraction, resistivity, and ac susceptibility. PMID:27878022

  17. Electromechanical computing at 500 degrees C with silicon carbide.

    PubMed

    Lee, Te-Hao; Bhunia, Swarup; Mehregany, Mehran

    2010-09-10

    Logic circuits capable of operating at high temperatures can alleviate expensive heat-sinking and thermal-management requirements of modern electronics and are enabling for advanced propulsion systems. Replacing existing complementary metal-oxide semiconductor field-effect transistors with silicon carbide (SiC) nanoelectromechanical system (NEMS) switches is a promising approach for low-power, high-performance logic operation at temperatures higher than 300 degrees C, beyond the capability of conventional silicon technology. These switches are capable of achieving virtually zero off-state current, microwave operating frequencies, radiation hardness, and nanoscale dimensions. Here, we report a microfabricated electromechanical inverter with SiC complementary NEMS switches capable of operating at 500 degrees C with ultralow leakage current.

  18. DECODING THE MESSAGE FROM METEORITIC STARDUST SILICON CARBIDE GRAINS

    SciTech Connect

    Lewis, Karen M.; Lugaro, Maria; Gibson, Brad K.; Pilkington, Kate E-mail: karen.michelle.lewis@gmail.com E-mail: kpilkington@uclan.ac.uk

    2013-05-01

    Micron-sized stardust grains that originated in ancient stars are recovered from meteorites and analyzed using high-resolution mass spectrometry. The most widely studied type of stardust is silicon carbide (SiC). Thousands of these grains have been analyzed with high precision for their Si isotopic composition. Here we show that the distribution of the Si isotopic composition of the vast majority of stardust SiC grains carries the imprints of a spread in the age-metallicity distribution of their parent stars and of a power-law increase of the relative formation efficiency of SiC dust with the metallicity. This result offers a solution for the long-standing problem of silicon in stardust SiC grains, confirms the necessity of coupling chemistry and dynamics in simulations of the chemical evolution of our Galaxy, and constrains the modeling of dust condensation in stellar winds as a function of the metallicity.

  19. Low voltage nanoelectromechanical switches based on silicon carbide nanowires.

    PubMed

    Feng, X L; Matheny, M H; Zorman, C A; Mehregany, M; Roukes, M L

    2010-08-11

    We report experimental demonstrations of electrostatically actuated, contact-mode nanoelectromechanical switches based on very thin silicon carbide (SiC) nanowires (NWs). These NWs are lithographically patterned from a 50 nm thick SiC layer heteroepitaxially grown on single-crystal silicon (Si). Several generic designs of in-plane electrostatic SiC NW switches have been realized, with NW widths as small as approximately 20 nm and lateral switching gaps as narrow as approximately 10 nm. Very low switch-on voltages are obtained, from a few volts down to approximately 1 V level. Two-terminal, contact-mode "hot" switching with high on/off ratios (>10(2) or 10(3)) has been demonstrated repeatedly for many devices. We find enhanced switching performance in bare SiC NWs, with lifetimes exceeding those based on metallized SiC NWs.

  20. Synthesis of high purity sinterable silicon carbide powder

    SciTech Connect

    Boecker, W.D.; Mehosky, B.L.; Rogers, R.S.C.; Storm, R.S.; Venkateswaran, V. . Structural Ceramics Div.)

    1989-11-01

    High purity, submicron silicon carbide powders were produced via gas phase synthesis using a hydrogen/argon plasma. Two test facilities were constructed, a bench-scale unit and a larger pilot scale reactor. Three candidate silicon sources were evaluated:silicon tetrachloride (SiCl{sub 4}). dimethyldichlorosilane (CH{sub 3}){sub 2}(SiCl{sub 2}) and methyltrichlorosilane (CH{sub 3}SiCl{sub 3}). Product powders were evaluated on the basis of pressureless sinterability, surface area, agglomeration, particle size distribution, phase distribution and chemistry. Three commercial powders, Starck A10, Starck B10, and Carborundum submicron alpha silicon carbide, were also evaluated for comparison to the product powders. Powders were reproducibly synthesized at a rate of one pound per hour for standard run times of five hours. Product powders exhibited chemical and physical properties equal to or exceeding the commercial powders evaluated. In limited attempts to pressureless sinter the product powders, densities of 91% of theoretical were obtained with as-produced powder. Post-processing permitted densities in excess of 97% of theoretical. X-ray diffraction of the product indicates that the product powders are primarily beta poly-types, with traces of alpha present. Increased production rates to a target level of seven pounds per hour were not possible due to current transients produced by the pilot scale power supply. Extensive unsuccessful efforts to reduce or eliminate the transients are described. Low recovered product yields resulted from a failure of a product collection filter that was not discovered until the completion of the project.

  1. Identification of infrared absorption peaks of amorphous silicon-carbon alloy by thermal annealing

    NASA Astrophysics Data System (ADS)

    Lin, Wei-Liang; Tsai, Hsiung-Kuang; Lee, Si-Chen; Sah, Wen-Jyh; Tzeng, Wen-Jer

    1987-12-01

    Amorphous silicon-carbon hydrogen alloy was prepared by radio frequency glow discharge decomposition of a silane-methane mixture. The infrared absorption spectra were measured at various stages of thermal annealing. By observing the change of relative intensities between these peaks the hydrogen bonding responsible for the absorption peaks could be assigned more accurately, for example, the stretching mode of monohydride Si-H is determined by its local environment, which supports H. Wagner's and W. Beyer's results [Solid State Commun. 48, 585 (1983)] but is inconsistent with the commonly believed view. It is also found that a significant fraction of carbon atoms are introduced into the film in -CH3 configuration which forms a local void and enhances the formation of polysilane chain and dangling bond defects. Only after high-temperature annealing are the hydrogen atoms driven out, and Si and C start to form a better silicon carbide network.

  2. Preparation and uses of amorphous boron carbide coated substrates

    DOEpatents

    Riley, Robert E.; Newkirk, Lawrence R.; Valencia, Flavio A.

    1981-09-01

    Cloth is coated at a temperature below about 1000.degree. C. with amorphous boron-carbon deposits in a process which provides a substantially uniform coating on all the filaments making up each yarn fiber bundle of the cloth. The coated cloths can be used in the as-deposited condition for example as wear surfaces where high hardness values are needed; or multiple layers of coated cloths can be hot-pressed to form billets useful for example in fusion reactor wall armor. Also provided is a method of controlling the atom ratio of B:C of boron-carbon deposits onto any of a variety of substrates, including cloths.

  3. Preparation and uses of amorphous boron carbide coated substrates

    DOEpatents

    Riley, R.E.; Newkirk, L.R.; Valencia, F.A.; Wallace, T.C.

    1979-12-05

    Cloth is coated at a temperature below about 1000/sup 0/C with amorphous boron-carbon deposits in a process which provides a substantially uniform coating on all the filaments making up each yarn fiber bundle of the cloth. The coated cloths can be used in the as-deposited condition for example as wear surfaces where high hardness values are needed; or multiple layers of coated cloths can be hot-pressed to form billets useful for example in fusion reactor wall armor. Also provided is a method of controlling the atom ratio of B:C of boron-carbon deposits onto any of a variety of substrates, including cloths.

  4. Transmissive metallic contact for amorphous silicon solar cells

    DOEpatents

    Madan, A.

    1984-11-29

    A transmissive metallic contact for amorphous silicon semiconductors includes a thin layer of metal, such as aluminum or other low work function metal, coated on the amorphous silicon with an antireflective layer coated on the metal. A transparent substrate, such as glass, is positioned on the light reflective layer. The metallic layer is preferably thin enough to transmit at least 50% of light incident thereon, yet thick enough to conduct electricity. The antireflection layer is preferably a transparent material that has a refractive index in the range of 1.8 to 2.2 and is approximately 550A to 600A thick.

  5. High-strength silicon carbides by hot isostatic pressing

    NASA Technical Reports Server (NTRS)

    Dutta, Sunil

    1988-01-01

    Silicon carbide has strong potential for heat engine hardware and other high-temperature applications because of its low density, good strength, high oxidation resistance, and good high-temperature creep resistance. Hot isostatic pressing (HIP) was used for producing alpha and beta silicon carbide (SiC) bodies with near-theoretical density, ultrafine grain size, and high strength at processing temperatures of 1900 to 2000 C. The HIPed materials exhibited ultrafine grain size. Furthermore, no phase transformation from beta to alpha was observed in HIPed beta-SiC. Both materials exhibited very high average flexural strength. It was also shown that alpha-SiC bodies without any sintering aids, when HIPed to high final density, can exhibit very high strength. Fracture toughness K (sub C) values were determined to be 3.6 to 4.0 MPa m (sup 1/2) for HIPed alpha-SiC and 3.7 to 4.1 MPa m (sup 1/2) for HIPed beta-SiC. In the HIPed specimens strength-controlling flaws were typically surface related. In spite of improvements in material properties such as strength and fracture toughness by elimination of the larger strength-limiting flaws and by grain size refinement, HIPing has no effect on the Weibull modulus.

  6. Development of the SOFIA silicon carbide secondary mirror

    NASA Astrophysics Data System (ADS)

    Fruit, Michel; Antoine, Pascal; Varin, Jean-Luc; Bittner, Hermann; Erdmann, Matthias

    2003-02-01

    The SOFIA telescope is ajoint NASA-DLR project for a 2.5 m airborne Stratospheric Observatory for IR Astronomy to be flown in a specially adapted Boeing 747 SP plane, Kayser-Threde being resopinsible for the development of the Telescope Optics. The φ 352 mm Secondary Mirror is mounted ona chopping mechanism to allow avoidance of background noise during IR observations. Stiffness associated to lightness is a major demand for such a mirror to achieve high frequency chopping. This leads to select SIlicon Carbide for the mirror blank. Its development has been run by the ASTRIUM/BOOSTEC joint venture SiCSPACE, taking full benefit of the instrinsic properties of the BOOSTEC SiC-100 sintered material, associated to qualified processes specifically developed for space borne mirrors by ASTRIUM. Achieved performances include a low mass of 1.97 kg, a very high stiffness with a first resonant frequency of 1865 Hz and a measured optical surface accuracy of 39 nm rms, using Ion Beam Figuring. It is proposed here to present the major design features of the SOFIA Secondary Mirror, highlighting the main advantages of using Silicon Carbide, the main steps of its development and the achieved optomechanical performances of the developed mirror.

  7. Delayed failure in a shock-loaded silicon carbide

    SciTech Connect

    Millett, J.C.F.; Bourne, N.K.; Dandekar, D.P.

    2005-06-01

    The shock response of a silicon carbide has been investigated using the methods of plate impact, and monitored using manganin stress gauges mounted so as to be responsive to lateral stress. Close to the impact face, a two-step stress response is observed, indicating the presence of delayed failure at the impact face. As the shock front moves through the target, the failure wave appears to slow, before arresting between 4 and 6 mm from the impact face. Measured shear stresses (ahead of the failure front) are in good agreement with the calculated elastic response, and with similar measurements made by both ourselves in other grades of silicon carbide and other authors. In gauge traces where the failure wave was not observed, a slight decrease in lateral stress (and thus a corresponding increase in shear strength) has been noticed. A similar response in some metals (in combination with recovery work in other ceramics) has led us to suggest that a degree of plastic deformation, in combination with a more brittle response, has occurred.

  8. Hydrogen adsorption in metal-decorated silicon carbide nanotubes

    NASA Astrophysics Data System (ADS)

    Singh, Ram Sevak; Solanki, Ankit

    2016-09-01

    Hydrogen storage for fuel cell is an active area of research and appropriate materials with excellent hydrogen adsorption properties are highly demanded. Nanotubes, having high surface to volume ratio, are promising storage materials for hydrogen. Recently, silicon carbide nanotubes have been predicted as potential materials for future hydrogen storage application, and studies in this area are ongoing. Here, we report a systematic study on hydrogen adsorption properties in metal (Pt, Ni and Al) decorated silicon carbide nanotubes (SiCNTs) using first principles calculations based on density functional theory. The hydrogen adsorption properties are investigated by calculations of adsorption energy, electronic band structure, density of states (DOS) and Mulliken charge population analysis. Our findings show that hydrogen adsorptions on Pt, Ni and Al-decorated SiCNTs undergo spontaneous exothermic reactions with significant modulation of electronic structure of SiCNTs in all cases. Importantly, according to the Mulliken charge population analysis, dipole-dipole interaction causes chemisorptions of hydrogen in Pt, Ni and Al decorated SiCNTs with formation of chemical bonds. The study is a platform for the development of metal decorated SiCNTs for hydrogen adsorption or hydrogen storage application.

  9. Oxidation Behavior of Carbon Fiber Reinforced Silicon Carbide Composites

    NASA Technical Reports Server (NTRS)

    Valentin, Victor M.

    1995-01-01

    Carbon fiber reinforced Silicon Carbide (C-SiC) composites offer high strength at high temperatures and good oxidation resistance. However, these composites present some matrix microcracks which allow the path of oxygen to the fiber. The aim of this research was to study the effectiveness of a new Silicon Carbide (SiC) coating developed by DUPONT-LANXIDE to enhance the oxidation resistance of C-SiC composites. A thermogravimetric analysis was used to determine the oxidation rate of the samples at different temperatures and pressures. The Dupont coat proved to be a good protection for the SiC matrix at temperatures lower than 1240 C at low and high pressures. On the other hand, at temperatures above 1340 C the Dupont coat did not seem to give good protection to the composite fiber and matrix. Even though some results of the tests have been discussed, because of time restraints, only a small portion of the desired tests could be completed. Therefore, no major conclusions or results about the effectiveness of the coat are available at this time.

  10. High-strength silicon carbides by hot isostatic pressing

    NASA Technical Reports Server (NTRS)

    Dutta, Sunil

    1989-01-01

    Silicon carbide has strong potential for heat engine hardware and other high-temperature applications because of its low density, good strength, high oxidation resistance, and good high-temperature creep resistance. Hot isostatic pressing (HIP) was used for producing alpha and beta silicon carbide (SiC) bodies with near-theoretical density, ultrafine grain size, and high strength at processing temperatures of 1900 to 2000 C. The HIPed materials exhibited ultrafine grain size. Furthermore, no phase transformation from beta to alpha was observed in HIPed beta-SiC. Both materials exhibited very high average flexural strength. It was also shown that alpha-SiC bodies without any sintering aids, when HIPed to high final density, can exhibit very high strength. Fracture toughness K (sub C) values were determined to be 3.6 to 4.0 MPa m (sup 1/2) for HIPed alpha-SiC and 3.7 to 4.1 MPa m (sup 1/2) for HIPed beta-SiC. In the HIPed specimens strength-controlling flaws were typically surface related. In spite of improvements in material properties such as strength and fracture toughness by elimination of the larger strength-limiting flaws and by grain size refinement, HIPing has no effect on the Weibull modulus.

  11. High-strength silicon carbides by hot isostatic pressing

    NASA Technical Reports Server (NTRS)

    Dutta, Sunil

    1989-01-01

    Silicon carbide has strong potential for heat engine hardware and other high-temperature applications because of its low density, good strength, high oxidation resistance, and good high-temperature creep resistance. Hot isostatic pressing (HIP) was used for producing alpha and beta silicon carbide (SiC) bodies with near-theoretical density, ultrafine grain size, and high strength at processing temperatures of 1900 to 2000 C. The HIPed materials exhibited ultrafine grain size. Furthermore, no phase transformation from beta to alpha was observed in HIPed beta-SiC. Both materials exhibited very high average flexural strength. It was also shown that alpha-SiC bodies without any sintering aids, when HIPed to high final density, can exhibit very high strength. Fracture toughness K (sub C) values were determined to be 3.6 to 4.0 MPa m (sup 1/2) for HIPed alpha-SiC and 3.7 to 4.1 MPa m (sup 1/2) for HIPed beta-SiC. In the HIPed specimens strength-controlling flaws were typically surface related. In spite of improvements in material properties such as strength and fracture toughness by elimination of the larger strength-limiting flaws and by grain size refinement, HIPing has no effect on the Weibull modulus.

  12. Microwave processing of silicon carbide. CRADA final report

    SciTech Connect

    Kimrey, H.D.; Kiggans, J.O.; Ness, E.A.; Rafaniello, W.

    1998-02-01

    A Cooperative Research and Development Agreement (CRADA) between Lockheed Martin Energy Systems, Inc. (LMES) and Dow Chemical Company was initiated on May 3, 1993. (Lockheed Martin Energy Research Inc. (LMER) replaced LMES). The completion date for the Agreement was December 1996. The purpose of this project is to develop microwave processing techniques to produce superior silicon carbide. Sintered silicon carbide is an attractive material for use in high-stress, high-temperature, high-wear, or highly corrosive applications. However, use in these applications has been hampered by a lack of consistency in strength, density, and other physical properties. It is proposed that the enhanced sintering that has been achieved using microwaves in oxide and halide systems be applied to the sintering of these materials to produce a more highly controlled density and microstructure. This will, in turn, increase the strength and Weibull modulus of the sintered body. The use of microwave energy to anneal for a moderate temperature (1,400--1,600 C) anneal in a high vacuum (< 10{sup {minus}4} Torr) results in an improvement in the sintered density and density distribution. These changes in turn result in improved properties of the sintered compacts. Further, scale up of the process has resulted in the routine production of 3 kg components in excess of 4 cm in thickness.

  13. High Input Voltage, Silicon Carbide Power Processing Unit Performance Demonstration

    NASA Technical Reports Server (NTRS)

    Bozak, Karin E.; Pinero, Luis R.; Scheidegger, Robert J.; Aulisio, Michael V.; Gonzalez, Marcelo C.; Birchenough, Arthur G.

    2015-01-01

    A silicon carbide brassboard power processing unit has been developed by the NASA Glenn Research Center in Cleveland, Ohio. The power processing unit operates from two sources - a nominal 300-Volt high voltage input bus and a nominal 28-Volt low voltage input bus. The design of the power processing unit includes four low voltage, low power supplies that provide power to the thruster auxiliary supplies, and two parallel 7.5 kilowatt power supplies that are capable of providing up to 15 kilowatts of total power at 300-Volts to 500-Volts to the thruster discharge supply. Additionally, the unit contains a housekeeping supply, high voltage input filter, low voltage input filter, and master control board, such that the complete brassboard unit is capable of operating a 12.5 kilowatt Hall Effect Thruster. The performance of unit was characterized under both ambient and thermal vacuum test conditions, and the results demonstrate the exceptional performance with full power efficiencies exceeding 97. With a space-qualified silicon carbide or similar high voltage, high efficiency power device, this design could evolve into a flight design for future missions that require high power electric propulsion systems.

  14. High Input Voltage, Silicon Carbide Power Processing Unit Performance Demonstration

    NASA Technical Reports Server (NTRS)

    Bozak, Karin E.; Pinero, Luis R.; Scheidegger, Robert J.; Aulisio, Michael V.; Gonzalez, Marcelo C.; Birchenough, Arthur G.

    2015-01-01

    A silicon carbide brassboard power processing unit has been developed by the NASA Glenn Research Center in Cleveland, Ohio. The power processing unit operates from two sources: a nominal 300 Volt high voltage input bus and a nominal 28 Volt low voltage input bus. The design of the power processing unit includes four low voltage, low power auxiliary supplies, and two parallel 7.5 kilowatt (kW) discharge power supplies that are capable of providing up to 15 kilowatts of total power at 300 to 500 Volts (V) to the thruster. Additionally, the unit contains a housekeeping supply, high voltage input filter, low voltage input filter, and master control board, such that the complete brassboard unit is capable of operating a 12.5 kilowatt Hall effect thruster. The performance of the unit was characterized under both ambient and thermal vacuum test conditions, and the results demonstrate exceptional performance with full power efficiencies exceeding 97%. The unit was also tested with a 12.5kW Hall effect thruster to verify compatibility and output filter specifications. With space-qualified silicon carbide or similar high voltage, high efficiency power devices, this would provide a design solution to address the need for high power electric propulsion systems.

  15. Cavity-Enhanced Measurements of Defect Spins in Silicon Carbide

    NASA Astrophysics Data System (ADS)

    Calusine, Greg; Politi, Alberto; Awschalom, David D.

    2016-07-01

    The identification of new solid-state defect-qubit candidates in widely used semiconductors has the potential to enable the use of nanofabricated devices for enhanced qubit measurement and control operations. In particular, the recent discovery of optically active spin states in silicon carbide thin films offers a scalable route for incorporating defect qubits into on-chip photonic devices. Here, we demonstrate the use of 3C silicon carbide photonic crystal cavities for enhanced excitation of color-center defect spin ensembles in order to increase measured photoluminescence signal count rates, optically detected magnetic-resonance signal intensities, and optical spin initialization rates. We observe an up to a factor of 30 increase in the photoluminescence and optically detected magnetic-resonance signals from Ky5 color centers excited by cavity-resonant excitation and increase the rate of ground-state spin initialization by approximately a factor of 2. Furthermore, we show that the 705-fold reduction in excitation mode volume and enhanced excitation and collection efficiencies provided by the structures can be used to overcome inhomogenous broadening in order to facilitate the study of defect-qubit subensemble properties. These results highlight some of the benefits that nanofabricated devices offer for engineering the local photonic environment of color-center defect qubits to enable applications in quantum information and sensing.

  16. Amorphous silicon oxide window layers for high-efficiency silicon heterojunction solar cells

    NASA Astrophysics Data System (ADS)

    Peter Seif, Johannes; Descoeudres, Antoine; Filipič, Miha; Smole, Franc; Topič, Marko; Charles Holman, Zachary; De Wolf, Stefaan; Ballif, Christophe

    2014-01-01

    In amorphous/crystalline silicon heterojunction solar cells, optical losses can be mitigated by replacing the amorphous silicon films by wider bandgap amorphous silicon oxide layers. In this article, we use stacks of intrinsic amorphous silicon and amorphous silicon oxide as front intrinsic buffer layers and show that this increases the short-circuit current density by up to 0.43 mA/cm2 due to less reflection and a higher transparency at short wavelengths. Additionally, high open-circuit voltages can be maintained, thanks to good interface passivation. However, we find that the gain in current is more than offset by losses in fill factor. Aided by device simulations, we link these losses to impeded carrier collection fundamentally caused by the increased valence band offset at the amorphous/crystalline interface. Despite this, carrier extraction can be improved by raising the temperature; we find that cells with amorphous silicon oxide window layers show an even lower temperature coefficient than reference heterojunction solar cells (-0.1%/°C relative drop in efficiency, compared to -0.3%/°C). Hence, even though cells with oxide layers do not outperform cells with the standard design at room temperature, at higher temperatures—which are closer to the real working conditions encountered in the field—they show superior performance in both experiment and simulation.

  17. Development of refractory armored silicon carbide by infrared transient liquid phase processing

    NASA Astrophysics Data System (ADS)

    Hinoki, Tatsuya; Snead, Lance L.; Blue, Craig A.

    2005-12-01

    Tungsten (W) and molybdenum (Mo) were coated on silicon carbide (SiC) for use as a refractory armor using a high power plasma arc lamp at powers up to 23.5 MW/m 2 in an argon flow environment. Both tungsten powder and molybdenum powder melted and formed coating layers on silicon carbide within a few seconds. The effect of substrate pre-treatment (vapor deposition of titanium (Ti) and tungsten, and annealing) and sample heating conditions on microstructure of the coating and coating/substrate interface were investigated. The microstructure was observed by scanning electron microscopy (SEM) and optical microscopy (OM). The mechanical properties of the coated materials were evaluated by four-point flexural tests. A strong tungsten coating was successfully applied to the silicon carbide substrate. Tungsten vapor deposition and pre-heating at 5.2 MW/m 2 made for a refractory layer containing no cracks propagating into the silicon carbide substrate. The tungsten coating was formed without the thick reaction layer. For this study, small tungsten carbide grains were observed adjacent to the interface in all conditions. In addition, relatively large, widely scattered tungsten carbide grains and a eutectic structure of tungsten and silicon were observed through the thickness in the coatings formed at lower powers and longer heating times. The strength of the silicon carbide substrate was somewhat decreased as a result of the processing. Vapor deposition of tungsten prior to powder coating helped prevent this degradation. In contrast, molybdenum coating was more challenging than tungsten coating due to the larger coefficient of thermal expansion (CTE) mismatch as compared to tungsten and silicon carbide. From this work it is concluded that refractory armoring of silicon carbide by Infrared Transient Liquid Phase Processing is possible. The tungsten armored silicon carbide samples proved uniform, strong, and capable of withstanding thermal fatigue testing.

  18. Solution-processed amorphous silicon surface passivation layers

    SciTech Connect

    Mews, Mathias Sontheimer, Tobias; Korte, Lars; Rech, Bernd; Mader, Christoph; Traut, Stephan; Wunnicke, Odo

    2014-09-22

    Amorphous silicon thin films, fabricated by thermal conversion of neopentasilane, were used to passivate crystalline silicon surfaces. The conversion is investigated using X-ray and constant-final-state-yield photoelectron spectroscopy, and minority charge carrier lifetime spectroscopy. Liquid processed amorphous silicon exhibits high Urbach energies from 90 to 120 meV and 200 meV lower optical band gaps than material prepared by plasma enhanced chemical vapor deposition. Applying a hydrogen plasma treatment, a minority charge carrier lifetime of 1.37 ms at an injection level of 10{sup 15}/cm{sup 3} enabling an implied open circuit voltage of 724 mV was achieved, demonstrating excellent silicon surface passivation.

  19. Spin states of the silicon vacancy in silicon carbide

    NASA Astrophysics Data System (ADS)

    Bockstedte, Michel; Schuetz, Felix

    2015-03-01

    SiC as a semi conductor fulfills all necessary requirements1 for implementing qubits via defect electron spins, such as the silicon vacancy, the di-vacancy or a complex of a silicon vacancy and a nitrogen impurity. The spin-selective fluorescence in contrast to the prototypical NV-center in diamond operates in the spectral range favorable for telecom applications.Spin-manipulation of the intrinsic centers was demonstrated even at room temperature.2,3 For the silicon vacancy in SiC inter system crossings (ISCs) from high to yet unknown low spin states govern the spin-relaxation. By DFT and a DFT-based multi-reference Hamiltonian we analyze the spin physics of the defect. In 4H SiC distinct luminescence lines are obtained for the inequivalent defect sites in agreement with experiment. Our result thus establishes an assignment of the lines to the sites. Owing to the spin (S=3/2) and a stronger electron-phonon coupling in the excited state, we find ISCs distinct from the NV-center.

  20. Applications of Silicon Carbide for High Temperature Electronics and Sensors

    NASA Technical Reports Server (NTRS)

    Shields, Virgil B.

    1995-01-01

    Silicon carbide (SiC) is a wide bandgap material that shows great promise in high-power and high temperature electronics applications because of its high thermal conductivity and high breakdown electrical field. The excellent physical and electronic properties of SiC allows the fabrication of devices that can operate at higher temperatures and power levels than devices produced from either silicon or GaAs. Although modern electronics depends primarily upon silicon based devices, this material is not capable of handling may special requirements. Devices which operate at high speeds, at high power levels and are to be used in extreme environments at high temperatures and high radiation levels need other materials with wider bandgaps than that of silicon. Many space and terrestrial applications also have a requirement for wide bandgap materials. SiC also has great potential for high power and frequency operation due to a high saturated drift velocity. The wide bandgap allows for unique optoelectronic applications, that include blue light emitting diodes and ultraviolet photodetectors. New areas involving gas sensing and telecommunications offer significant promise. Overall, the properties of SiC make it one of the best prospects for extending the capabilities and operational regimes of the current semiconductor device technology.

  1. Characterization of silicon carbide and diamond detectors for neutron applications

    NASA Astrophysics Data System (ADS)

    Hodgson, M.; Lohstroh, A.; Sellin, P.; Thomas, D.

    2017-10-01

    The presence of carbon atoms in silicon carbide and diamond makes these materials ideal candidates for direct fast neutron detectors. Furthermore the low atomic number, strong covalent bonds, high displacement energies, wide bandgap and low intrinsic carrier concentrations make these semiconductor detectors potentially suitable for applications where rugged, high-temperature, low-gamma-sensitivity detectors are required, such as active interrogation, electronic personal neutron dosimetry and harsh environment detectors. A thorough direct performance comparison of the detection capabilities of semi-insulating silicon carbide (SiC–SI), single crystal diamond (D–SC), polycrystalline diamond (D–PC) and a self-biased epitaxial silicon carbide (SiC–EP) detector has been conducted and benchmarked against a commercial silicon PIN (Si–PIN) diode, in a wide range of alpha (Am-241), beta (Sr/Y-90), ionizing photon (65 keV to 1332 keV) and neutron radiation fields (including 1.2 MeV to 16.5 MeV mono-energetic neutrons, as well as neutrons from AmBe and Cf-252 sources). All detectors were shown to be able to directly detect and distinguish both the different radiation types and energies by using a simple energy threshold discrimination method. The SiC devices demonstrated the best neutron energy discrimination ratio (E\\max (n=5 MeV)/E\\max (n=1 MeV)  ≈5), whereas a superior neutron/photon cross-sensitivity ratio was observed in the D–PC detector (E\\max (AmBe)/E\\max (Co-60)  ≈16). Further work also demonstrated that the cross-sensitivity ratios can be improved through use of a simple proton-recoil conversion layer. Stability issues were also observed in the D–SC, D–PC and SiC–SI detectors while under irradiation, namely a change of energy peak position and/or count rate with time (often referred to as the polarization effect). This phenomenon within the detectors was non-debilitating over the time period tested (> 5 h) and, as such, stable

  2. Theoretical estimation of static charge fluctuation in amorphous silicon

    NASA Astrophysics Data System (ADS)

    Kugler, Sándor; Surján, Péter R.; Náray-Szabó, Gábor

    1988-05-01

    A quantum-chemical method has been developed to determine charge fluctuations in finite aperiodic clusters of amorphous silicon. Calculated atomic net charges are in a close linear relationship to bond-angle distortions involving first and second neighbors. Applying this relationship to a continuous-random-network model of 216 silicon atoms proposed by Wooten et al., we obtained 0.021 electron units for the rms deviation from charge neutrality.

  3. Development of a model of silicon carbide thermodestruction for preparation of graphite layers

    NASA Astrophysics Data System (ADS)

    Davydov, S. Yu.; Lebedev, A. A.; Smirnova, N. Yu.

    2009-03-01

    A three-stage scheme of the silicon carbide thermodestruction resulting in surface graphitization, which was proposed earlier (based on structural studies), is discussed. A theoretical analysis shows, however, that this process occurs in two stages, namely, thermodesorption of silicon atoms from the two outer Si-C bilayers followed by condensation of carbon atoms on the Si(0001) face of silicon carbide, thus giving rise to the formation of a two-dimensional graphite structure (graphene).

  4. Recombination mechanisms in amorphous silicon/crystalline silicon heterojunction solar cells

    NASA Astrophysics Data System (ADS)

    Jensen, N.; Rau, U.; Hausner, R. M.; Uppal, S.; Oberbeck, L.; Bergmann, R. B.; Werner, J. H.

    2000-03-01

    This article investigates limitations to the open circuit voltage of n-type amorphous silicon/p-type crystalline silicon heterojunction solar cells. The analysis of quantum efficiency and temperature dependent current/voltage characteristics identifies the dominant recombination mechanism. Depending on the electronic quality of the crystalline silicon absorber, either recombination in the neutral bulk or recombination in the space charge region prevails; recombination at the heterointerface is not relevant. Although interface recombination does not limit the open circuit voltage, recombination of photogenerated charge carriers at the heterointerface or in the amorphous silicon emitter diminishes the short circuit current of the solar cells.

  5. Gamma radiation effects in amorphous silicon and silicon nitride photonic devices.

    PubMed

    Du, Qingyang; Huang, Yizhong; Ogbuu, Okechukwu; Zhang, Wei; Li, Junying; Singh, Vivek; Agarwal, Anuradha M; Hu, Juejun

    2017-02-01

    Understanding radiation damage is of significant importance for devices operating in radiation-harsh environments. In this Letter, we present a systematic study on gamma radiation effects in amorphous silicon and silicon nitride guided wave devices. It is found that gamma radiation increases the waveguide modal effective indices by as much as 4×10-3 in amorphous silicon and 5×10-4 in silicon nitride at 10 Mrad dose. This Letter further reveals that surface oxidation and radiation-induced densification account for the observed index change.

  6. Laterally inherently thin amorphous-crystalline silicon heterojunction photovoltaic cell

    SciTech Connect

    Chowdhury, Zahidur R. Kherani, Nazir P.

    2014-12-29

    This article reports on an amorphous-crystalline silicon heterojunction photovoltaic cell concept wherein the heterojunction regions are laterally narrow and distributed amidst a backdrop of well-passivated crystalline silicon surface. The localized amorphous-crystalline silicon heterojunctions consisting of the laterally thin emitter and back-surface field regions are precisely aligned under the metal grid-lines and bus-bars while the remaining crystalline silicon surface is passivated using the recently proposed facile grown native oxide–plasma enhanced chemical vapour deposited silicon nitride passivation scheme. The proposed cell concept mitigates parasitic optical absorption losses by relegating amorphous silicon to beneath the shadowed metallized regions and by using optically transparent passivation layer. A photovoltaic conversion efficiency of 13.6% is obtained for an untextured proof-of-concept cell illuminated under AM 1.5 global spectrum; the specific cell performance parameters are V{sub OC} of 666 mV, J{sub SC} of 29.5 mA-cm{sup −2}, and fill-factor of 69.3%. Reduced parasitic absorption, predominantly in the shorter wavelength range, is confirmed with external quantum efficiency measurement.

  7. Laterally inherently thin amorphous-crystalline silicon heterojunction photovoltaic cell

    NASA Astrophysics Data System (ADS)

    Chowdhury, Zahidur R.; Kherani, Nazir P.

    2014-12-01

    This article reports on an amorphous-crystalline silicon heterojunction photovoltaic cell concept wherein the heterojunction regions are laterally narrow and distributed amidst a backdrop of well-passivated crystalline silicon surface. The localized amorphous-crystalline silicon heterojunctions consisting of the laterally thin emitter and back-surface field regions are precisely aligned under the metal grid-lines and bus-bars while the remaining crystalline silicon surface is passivated using the recently proposed facile grown native oxide-plasma enhanced chemical vapour deposited silicon nitride passivation scheme. The proposed cell concept mitigates parasitic optical absorption losses by relegating amorphous silicon to beneath the shadowed metallized regions and by using optically transparent passivation layer. A photovoltaic conversion efficiency of 13.6% is obtained for an untextured proof-of-concept cell illuminated under AM 1.5 global spectrum; the specific cell performance parameters are VOC of 666 mV, JSC of 29.5 mA-cm-2, and fill-factor of 69.3%. Reduced parasitic absorption, predominantly in the shorter wavelength range, is confirmed with external quantum efficiency measurement.

  8. [Synergetic effects of silicon carbide and molecular sieve loaded catalyst on microwave assisted catalytic oxidation of toluene].

    PubMed

    Wang, Xiao-Hui; Bo, Long-Li; Liu, Hai-Nan; Zhang, Hao; Sun, Jian-Yu; Yang, Li; Cai, Li-Dong

    2013-06-01

    Molecular sieve loaded catalyst was prepared by impregnation method, microwave-absorbing material silicon carbide and the catalyst were investigated for catalytic oxidation of toluene by microwave irradiation. Research work examined effects of silicon carbide and molecular sieve loading Cu-V catalyst's mixture ratio as well as mixed approach changes on degradation of toluene, and characteristics of catalyst were measured through scanning electron microscope, specific surface area test and X-ray diffraction analysis. The result showed that the fixed bed reactor had advantages of both thermal storage property and low-temperature catalytic oxidation when 20% silicon carbide was filled at the bottom of the reactor, and this could effectively improve the utilization of microwave energy as well as catalytic oxidation efficiency of toluene. Under microwave power of 75 W and 47 W, complete-combustion temperatures of molecular sieve loaded Cu-V catalyst and Cu-V-Ce catalyst to toluene were 325 degrees C and 160 degrees C, respectively. Characteristics of the catalysts showed that mixture of rare-earth element Ce increased the dispersion of active components in the surface of catalyst, micropore structure of catalyst effectively guaranteed high adsorption capacity for toluene, while amorphous phase of Cu and V oxides increased the activity of catalyst greatly.

  9. Size Dependence of Nanoscale Wear of Silicon Carbide.

    PubMed

    Tangpatjaroen, Chaiyapat; Grierson, David; Shannon, Steve; Jakes, Joseph E; Szlufarska, Izabela

    2017-01-18

    Nanoscale, single-asperity wear of single-crystal silicon carbide (sc-SiC) and nanocrystalline silicon carbide (nc-SiC) is investigated using single-crystal diamond nanoindenter tips and nanocrystalline diamond atomic force microscopy (AFM) tips under dry conditions, and the wear behavior is compared to that of single-crystal silicon with both thin and thick native oxide layers. We discovered a transition in the relative wear resistance of the SiC samples compared to that of Si as a function of contact size. With larger nanoindenter tips (tip radius ≈ 370 nm), the wear resistances of both sc-SiC and nc-SiC are higher than that of Si. This result is expected from the Archard's equation because SiC is harder than Si. However, with the smaller AFM tips (tip radius ≈ 20 nm), the wear resistances of sc-SiC and nc-SiC are lower than that of Si, despite the fact that the contact pressures are comparable to those applied with the nanoindenter tips, and the plastic zones are well-developed in both sets of wear experiments. We attribute the decrease in the relative wear resistance of SiC compared to that of Si to a transition from a wear regime dominated by the materials' resistance to plastic deformation (i.e., hardness) to a regime dominated by the materials' resistance to interfacial shear. This conclusion is supported by our AFM studies of wearless friction, which reveal that the interfacial shear strength of SiC is higher than that of Si. The contributions of surface roughness and surface chemistry to differences in interfacial shear strength are also discussed.

  10. Stability and rheology of dispersions of silicon nitride and silicon carbide

    NASA Technical Reports Server (NTRS)

    Feke, Donald L.

    1987-01-01

    The relationship between the surface and colloid chemistry of commercial ultra-fine silicon carbide and silicon nitride powders was examined by a variety of standard characterization techniques and by methodologies especially developed for ceramic dispersions. These include electrokinetic measurement, surface titration, and surface spectroscopies. The effects of powder pretreatment and modification strategies, which can be utilized to augment control of processing characteristics, were monitored with these technologies. Both silicon carbide and nitride were found to exhibit silica-like surface chemistries, but silicon nitride powders possess an additional amine surface functionality. Colloidal characteristics of the various nitride powders in aqueous suspension is believed to be highly dependent on the relative amounts of the two types of surface groups, which in turn is determined by the powder synthesis route. The differences in the apparent colloidal characteristics for silicon nitride powders cannot be attributed to the specific absorption of ammonium ions. Development of a model for the prediction of double-layer characteristics of materials with a hybrid site interface facilitated understanding and prediction of the behavior of both surface charge and surface potential for these materials. The utility of the model in application to silicon nitride powders was demonstrated.

  11. Influence of stress state and strain rate on structural amorphization in boron carbide

    NASA Astrophysics Data System (ADS)

    Ghosh, Dipankar; Subhash, Ghatu; Zheng, James Q.; Halls, Virginia

    2012-03-01

    The reduced performance of B4C armor plate for impact against tungsten carbide penetrators beyond a critical velocity has been attributed in the literature to localized amorphization. However, it is unclear if this reduction in strength is a consequence of high pressure or high velocity. Despite numerous fundamental studies of B4C under indentation and impact, the roles of strain rate and pressure on amorphization have not been fully established. Toward this end, rate dependent uniaxial compressive strength and rate dependent indentation hardness, along with Raman spectroscopy, have been employed to show that high strain rate deformation alone (without concurrent high pressure) cannot trigger localized amorphization in B4C. Based on our analysis, it is also suggested that rate dependent indentation hardness can be used to reveal if a given B4C ceramic exhibits amorphization under high pressure and high strain rate loading. It is argued that when amorphization does occur in B4C, its dynamic inelastic properties degrade more severely than its static properties. Finally, it is suggested that dynamic hardness, in conjunction with static hardness, can be used as a measurable mechanical property to reveal the incidence of amorphization in B4C without the need for postmortem TEM or Raman spectroscopy analyses.

  12. Integral bypass diodes in an amorphous silicon alloy photovoltaic module

    NASA Technical Reports Server (NTRS)

    Hanak, J. J.; Flaisher, H.

    1991-01-01

    Thin-film, tandem-junction, amorphous silicon (a-Si) photovoltaic modules were constructed in which a part of the a-Si alloy cell material is used to form bypass protection diodes. This integral design circumvents the need for incorporating external, conventional diodes, thus simplifying the manufacturing process and reducing module weight.

  13. Performance of amorphous silicon photovoltaic systems, 1985--1989

    SciTech Connect

    Not Available

    1990-04-01

    This report discusses the performance of commercial amorphous silicon modules used in photovoltaic power systems from 1985 through 1989. Topics discussed include initial degradation, reliability, durability, and effects of temperature and solar irradiance on peak power and energy production. 6 refs., 18 figs.

  14. Photo-induced defects and photoconductivity in amorphous silicon

    NASA Astrophysics Data System (ADS)

    Okamoto, H.; Kida, H.; Hamakawa, Y.

    1984-02-01

    An essential connection between photo-induced defects and photoconductivity in amorphous silicon is discussed within the framework of Street's defect creation model. The excitation intensity dependence and doping level dependence of the photo-induced defect density and photoconductivity are derived on the basis of simple rate equation analysis, and compared with experimental data.

  15. Ultrasonic attenuation in amorphous silicon at 50 and 100 GHz

    NASA Astrophysics Data System (ADS)

    Hondongwa, D. B.; Daly, B. C.; Norris, T. B.; Yan, B.; Yang, J.; Guha, S.

    2011-03-01

    We have measured the attenuation of longitudinal acoustic waves in a series of amorphous and nanocrystalline silicon films using picosecond ultrasonics. The films were grown using a modified very high frequency glow discharge method on steel substrates. The deposition conditions were similar to that used in the fabrication of high-efficiency solar cells. The film thicknesses were varied so we could distinguish between interface losses and intrinsic losses within the silicon films. We determine the attenuation of amorphous Si to be 780 ± 160 cm-1 at 100 GHz and 340 ± 120 cm-1 at 50 GHz, values that are lower than those predicted by theories based on anharmonic interactions of the sound wave with localized phonons or extended resonant modes. We determine the attenuation of nanocrystalline Si at 50 GHz to be nearly an order of magnitude higher than amorphous Si (2600 ± 660 cm-1) and compare that value to a simple Rayleigh scattering prediction.

  16. Tight binding simulation of the thermodynamic behavior of amorphous silicon

    NASA Astrophysics Data System (ADS)

    Rosato, V.; Celino, M.

    1999-12-01

    Structures of amorphous silicon have been generated by using a suitable implementation of the reverse Monte Carlo technique, based on the reproduction of different experimental data. The structures have been subsequently relaxed at fixed temperature and pressure via tight binding molecular dynamics. The amorphous structures have been further characterized by evaluating structural, dynamic and electronic structure properties, as a function of temperature, up to and above the melting point. The model of amorphous silicon undergoes a melting transition at Tal≃0.55Tm (where Tm is the homogeneous melting temperature of the bulk crystal). In the temperature range between Tal and Tm, the system exhibits thermodynamic and structural properties typical of an undercooled liquid.

  17. Growth of silicon quantum dots by oxidation of the silicon nanocrystals embedded within silicon carbide matrix

    SciTech Connect

    Kole, Arindam; Chaudhuri, Partha

    2014-10-15

    A moderately low temperature (≤800 °C) thermal processing technique has been described for the growth of the silicon quantum dots (Si-QD) within microcrystalline silicon carbide (μc-SiC:H) dielectric thin films deposited by plasma enhanced chemical vapour deposition (PECVD) process. The nanocrystalline silicon grains (nc-Si) present in the as deposited films were initially enhanced by aluminium induced crystallization (AIC) method in vacuum at a temperature of T{sub v} = 525 °C. The samples were then stepwise annealed at different temperatures T{sub a} in air ambient. Analysis of the films by FTIR and XPS reveal a rearrangement of the μc-SiC:H network has taken place with a significant surface oxidation of the nc-Si domains upon annealing in air. The nc-Si grain size (D{sub XRD}) as calculated from the XRD peak widths using Scherrer formula was found to decrease from 7 nm to 4 nm with increase in T{sub a} from 250 °C to 800 °C. A core shell like structure with the nc-Si as the core and the surface oxide layer as the shell can clearly describe the situation. The results indicate that with the increase of the annealing temperature in air the oxide shell layer becomes thicker and the nc-Si cores become smaller until their size reduced to the order of the Si-QDs. Quantum confinement effect due to the SiO covered nc-Si grains of size about 4 nm resulted in a photoluminescence peak due to the Si QDs with peak energy at 1.8 eV.

  18. Effect of oxygen and nitrogen interactions on friction of single-crystal silicon carbide

    NASA Technical Reports Server (NTRS)

    Miyoshi, K.; Buckley, D. H.

    1978-01-01

    Friction studies were conducted with single-crystal silicon carbide contacting silicon carbide and titanium after having been exposed to oxygen and nitrogen in various forms. After they had been sputter cleaned, the surfaces were (1) exposed to gaseous oxygen and nitrogen (adsorption), (2) ion bombarded with oxygen and nitrogen, or (3) reacted with oxygen (SiC only). Auger emission spectroscopy was used to determine the presence of oxygen and nitrogen. The results indicate that the surfaces of silicon carbide with reacted and ion-bombarded oxygen ions give higher coefficients of friction than do argon sputter-cleaned surfaces. The effects of oxygen on friction may be related to the relative chemical, thermodynamic properties of silicon, carbon, and titanium for oxygen. The adsorbed films of oxygen, nitrogen, and mixed gases of oxygen and nitrogen on sputter-cleaned, oxygen-ion bombarded, and oxygen-reacted surfaces generally reduce friction. Adsorption to silicon carbide is relatively weak.

  19. Graphitic nanostripes in silicon carbide surfaces created by swift heavy ion irradiation

    NASA Astrophysics Data System (ADS)

    Ochedowski, Oliver; Osmani, Orkhan; Schade, Martin; Bussmann, Benedict Kleine; Ban-D'Etat, Brigitte; Lebius, Henning; Schleberger, Marika

    2014-06-01

    The controlled creation of defects in silicon carbide represents a major challenge. A well-known and efficient tool for defect creation in dielectric materials is the irradiation with swift (Ekin≥500 keV/amu) heavy ions, which deposit a significant amount of their kinetic energy into the electronic system. However, in the case of silicon carbide, a significant defect creation by individual ions could hitherto not be achieved. Here we present experimental evidence that silicon carbide surfaces can be modified by individual swift heavy ions with an energy well below the proposed threshold if the irradiation takes place under oblique angles. Depending on the angle of incidence, these grooves can span several hundreds of nanometres. We show that our experimental data are fully compatible with the assumption that each ion induces the sublimation of silicon atoms along its trajectory, resulting in narrow graphitic grooves in the silicon carbide matrix.

  20. Silicon-Carbide Power MOSFET Performance in High Efficiency Boost Power Processing Unit for Extreme Environments

    NASA Technical Reports Server (NTRS)

    Ikpe, Stanley A.; Lauenstein, Jean-Marie; Carr, Gregory A.; Hunter, Don; Ludwig, Lawrence L.; Wood, William; Del Castillo, Linda Y.; Fitzpatrick, Fred; Chen, Yuan

    2016-01-01

    Silicon-Carbide device technology has generated much interest in recent years. With superior thermal performance, power ratings and potential switching frequencies over its Silicon counterpart, Silicon-Carbide offers a greater possibility for high powered switching applications in extreme environment. In particular, Silicon-Carbide Metal-Oxide- Semiconductor Field-Effect Transistors' (MOSFETs) maturing process technology has produced a plethora of commercially available power dense, low on-state resistance devices capable of switching at high frequencies. A novel hard-switched power processing unit (PPU) is implemented utilizing Silicon-Carbide power devices. Accelerated life data is captured and assessed in conjunction with a damage accumulation model of gate oxide and drain-source junction lifetime to evaluate potential system performance at high temperature environments.