Sample records for area array packages

  1. Thermal Cycle Reliability and Failure Mechanisms of CCGA and PBGA Assemblies with and without Corner Staking

    NASA Technical Reports Server (NTRS)

    Ghaffarian, Reza

    2008-01-01

    Area array packages (AAPs) with 1.27 mm pitch have been the packages of choice for commercial applications; they are now starting to be implemented for use in military and aerospace applications. Thermal cycling characteristics of plastic ball grid array (PBGA) and chip scale package assemblies, because of their wide usage for commercial applications, have been extensively reported on in literature. Thermal cycling represents the on-off environmental condition for most electronic products and therefore is a key factor that defines reliability.However, very limited data is available for thermal cycling behavior of ceramic packages commonly used for the aerospace applications. For high reliability applications, numerous AAPs are available with an identical design pattern both in ceramic and plastic packages. This paper compares assembly reliability of ceramic and plastic packages with the identical inputs/outputs(I/Os) and pattern. The ceramic package was in the form of ceramic column grid array (CCGA) with 560 I/Os peripheral array with the identical pad design as its plastic counterpart.

  2. Area Array Technology Evaluations for Space and Military Applications

    NASA Technical Reports Server (NTRS)

    Ghaffarian, Reza

    1996-01-01

    The Jet Propulsion Laboratory (JPL) is currently assessing the use of Area Array Packaging (AAP) for National Aeronautics and Space Administration (NASA) spaceflight applications. this work is being funded through NASA Headquarters, Code Q. The paper discusses background of AAP, objectives, and uses of AAP.

  3. Limiting Surface Density Method Adapted to Large Arrays of Heterogeneous Shipping Packages with Nonlinear Responses

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Stover, Tracy E.; Baker, James S.; Ratliff, Michael D.

    The classic Limiting Surface Density (LSD) method is an empirical calculation technique for analyzing and setting mass limits for fissile items in storage arrays. LSD is a desirable method because it can reduce or eliminate the need for lengthy detailed Monte Carlo models of storage arrays. The original (or classic) method was developed based on idealized arrays of bare spherical metal items in air-spaced cubic units in a water-reflected cubic array. In this case, the geometric and material-based surface densities were acceptably correlated by linear functions. Later updates to the method were made to allow for concrete reflection rather thanmore » water, cylindrical masses rather than spheres, different material forms, and noncubic arrays. However, in the intervening four decades since those updates, little work has been done to update the method, especially for use with contemporary highly heterogeneous shipping packages that are noncubic and stored in noncubic arrays. In this work, the LSD method is reevaluated for application to highly heterogeneous shipping packages for fissile material. The package modeled is the 9975 shipping package, currently the primary package used to store fissile material at Savannah River Site’s K-Area Complex. The package is neither cubic nor rectangular but resembles nested cylinders of stainless steel, lead, aluminum, and Celotex. The fissile content is assumed to be a cylinder of plutonium metal. The packages may be arranged in arrays with both an equal number of packages per side (package cubic) and an unequal number of packages per side (noncubic). The cubic arrangements are used to derive the 9975-specific material and geometry constants for the classic linear form LSD method. The linear form of the LSD, with noncubic array adjustment, is applied and evaluated against computational models for these packages to determine the critical unit fissile mass. Sensitivity equations are derived from the classic method, and these are also used to make projections of the critical unit fissile mass. It was discovered that the heterogeneous packages have a nonlinear surface density versus critical mass relationship compared to the acceptably linear response of bare spherical fissile masses. Methodology is developed to address the nonlinear response. In so doing, the solution to the nonlinear LSD method becomes decoupled from the critical mass of a single unit, adding to its flexibility. The ability of the method to predict changes in neutron multiplication due to perturbations in a parameter is examined to provide a basis for analyzing upset conditions. In conclusion, a full rederivation of the classic LSD method from diffusion theory is also included as this was found to be lacking in the available literature.« less

  4. Limiting Surface Density Method Adapted to Large Arrays of Heterogeneous Shipping Packages with Nonlinear Responses

    DOE PAGES

    Stover, Tracy E.; Baker, James S.; Ratliff, Michael D.; ...

    2018-03-02

    The classic Limiting Surface Density (LSD) method is an empirical calculation technique for analyzing and setting mass limits for fissile items in storage arrays. LSD is a desirable method because it can reduce or eliminate the need for lengthy detailed Monte Carlo models of storage arrays. The original (or classic) method was developed based on idealized arrays of bare spherical metal items in air-spaced cubic units in a water-reflected cubic array. In this case, the geometric and material-based surface densities were acceptably correlated by linear functions. Later updates to the method were made to allow for concrete reflection rather thanmore » water, cylindrical masses rather than spheres, different material forms, and noncubic arrays. However, in the intervening four decades since those updates, little work has been done to update the method, especially for use with contemporary highly heterogeneous shipping packages that are noncubic and stored in noncubic arrays. In this work, the LSD method is reevaluated for application to highly heterogeneous shipping packages for fissile material. The package modeled is the 9975 shipping package, currently the primary package used to store fissile material at Savannah River Site’s K-Area Complex. The package is neither cubic nor rectangular but resembles nested cylinders of stainless steel, lead, aluminum, and Celotex. The fissile content is assumed to be a cylinder of plutonium metal. The packages may be arranged in arrays with both an equal number of packages per side (package cubic) and an unequal number of packages per side (noncubic). The cubic arrangements are used to derive the 9975-specific material and geometry constants for the classic linear form LSD method. The linear form of the LSD, with noncubic array adjustment, is applied and evaluated against computational models for these packages to determine the critical unit fissile mass. Sensitivity equations are derived from the classic method, and these are also used to make projections of the critical unit fissile mass. It was discovered that the heterogeneous packages have a nonlinear surface density versus critical mass relationship compared to the acceptably linear response of bare spherical fissile masses. Methodology is developed to address the nonlinear response. In so doing, the solution to the nonlinear LSD method becomes decoupled from the critical mass of a single unit, adding to its flexibility. The ability of the method to predict changes in neutron multiplication due to perturbations in a parameter is examined to provide a basis for analyzing upset conditions. In conclusion, a full rederivation of the classic LSD method from diffusion theory is also included as this was found to be lacking in the available literature.« less

  5. Packaging optical sensors for the real world

    NASA Astrophysics Data System (ADS)

    Kachmar, Wayne; Nardone, Kenneth C.

    2007-09-01

    Optical fiber based sensing has now moved from laboratory demonstrations to actual applications in the real world. This has necessitated an entirely new area of extrusion - the packaging (cabling) of optical fibers and sensor arrays to protect them from the intended environment and installation handling while not masking or attenuating the phenomenon that is being sensed. Although each application presents new and unique challenges, the goal is to create a packaging concept for fiber sensors. Fiber sensing applications can be narrowed down to the five items below: 1. Conventional cable packages 2. Assembled (typically by hand) discrete sensor packages 3. Package enhanced sensors (where the packaging improves the effect of the sensor) 4. Linear sensor installation packaging 5. Scalar packaging (where the cabling adds to the range of the sensor) The above applications can be accomplished in a number of ways, and methods are still being developed in this relatively new science. Some of the new technology methods being explored include: UV cured liquids; Voided space cores; Conventional cable extrusion & its determination of mechanical characteristics. This paper reviews the pluses and minuses of the above methods and how their combination ultimately determines how the fiber or sensor array is to be jacketed in order to meet the specific application requirements. This paper will also review non-standard material characteristics, strength members and their role in measuring strain and stress values along with the overall influence of packaging on optical fibers and sensor arrays.

  6. Apollo lunar surface experiments package

    NASA Technical Reports Server (NTRS)

    1972-01-01

    Developments in the ALSEP program are reported. A summary of the status for the total ALSEP program is included. Other areas discussed include: (1) status of Apollo 16 (array D) and Apollo 17 (array E), (2) lunar seismic profiling experiment, (3) lunar ejecta and meteorites experiment, and (4) lunar mass spectrometer experiments.

  7. Spoked wheels to deploy large surfaces in space-weight estimates for solar arrays

    NASA Technical Reports Server (NTRS)

    Crawford, R. F.; Hedgepeth, J. M.; Preiswerk, P. R.

    1975-01-01

    Extensible booms were used to deploy and support solar cell arrays of varying areas. Solar cell array systems were built with one or two booms to deploy and tension a blanket with attached cells and bussing. A segmented and hinged rim supported by spokes joined to a common hub is described. This structure can be compactly packaged and deployed.

  8. An application specific integrated circuit based multi-anode microchannel array readout system

    NASA Technical Reports Server (NTRS)

    Smeins, Larry G.; Stechman, John M.; Cole, Edward H.

    1991-01-01

    Size reduction of two new multi-anode microchannel array (MAMA) readout systems is described. The systems are based on two analog and one digital application specific integrated circuits (ASICs). The new readout systems reduce volume over previous discrete designs by 80 percent while improving electrical performance on virtually every significant parameter. Emphasis is made on the packaging used to achieve the volume reduction. Surface mount technology (SMT) is combined with modular construction for the analog portion of the readout. SMT reliability concerns and the board area impact of MIL SPEC SMT components is addressed. Package selection for the analog ASIC is discussed. Future sytems will require even denser packaging and the volume reduction progression is shown.

  9. DOE Office of Scientific and Technical Information (OSTI.GOV)

    Grant, Robert

    Under this grant, three significant software packages were developed or improved, all with the goal of improving the ease-of-use of HPC libraries. The first component is a Python package, named DistArray (originally named Odin), that provides a high-level interface to distributed array computing. This interface is based on the popular and widely used NumPy package and is integrated with the IPython project for enhanced interactive parallel distributed computing. The second Python package is the Distributed Array Protocol (DAP) that enables separate distributed array libraries to share arrays efficiently without copying or sending messages. If a distributed array library supports themore » DAP, it is then automatically able to communicate with any other library that also supports the protocol. This protocol allows DistArray to communicate with the Trilinos library via PyTrilinos, which was also enhanced during this project. A third package, PyTrilinos, was extended to support distributed structured arrays (in addition to the unstructured arrays of its original design), allow more flexible distributed arrays (i.e., the restriction to double precision data was lifted), and implement the DAP. DAP support includes both exporting the protocol so that external packages can use distributed Trilinos data structures, and importing the protocol so that PyTrilinos can work with distributed data from external packages.« less

  10. The effects of additives to SnAgCu alloys on microstructure and drop impact reliability of solder joints

    NASA Astrophysics Data System (ADS)

    Liu, Weiping; Lee, Ning-Cheng

    2007-07-01

    The impact reliability of solder joints in electronic packages is critical to the lifetime of electronic products, especially those portable devices using area array packages such as ball-grid array (BGA) and chip-scale packages (CSP). Currently, SnAgCu (SAC) solders are most widely used for lead-free applications. However, BGA and CSP solder joints using SAC alloys are fragile and prone to premature interfacial failure, especially under shock loading. To further enhance impact reliability, a family of SAC alloys doped with a small amount of additives such as Mn, Ce, Ti, Bi, and Y was developed. The effects of doping elements on drop test performance, creep resistance, and microstructure of the solder joints were investigated, and the solder joints made with the modified alloys exhibited significantly higher impact reliability.

  11. A Comparative Study of Inspection Techniques for Array Packages

    NASA Technical Reports Server (NTRS)

    Mohammed, Jelila; Green, Christopher

    2008-01-01

    This viewgraph presentation reviews the inspection techniques for Column Grid Array (CGA) packages. The CGA is a method of chip scale packaging using high temperature solder columns to attach part to board. It is becoming more popular over other techniques (i.e. quad flat pack (QFP) or ball grid array (BGA)). However there are environmental stresses and workmanship challenges that require good inspection techniques for these packages.

  12. Telescoping Solar Array Concept for Achieving High Packaging Efficiency

    NASA Technical Reports Server (NTRS)

    Mikulas, Martin; Pappa, Richard; Warren, Jay; Rose, Geoff

    2015-01-01

    Lightweight, high-efficiency solar arrays are required for future deep space missions using high-power Solar Electric Propulsion (SEP). Structural performance metrics for state-of-the art 30-50 kW flexible blanket arrays recently demonstrated in ground tests are approximately 40 kW/cu m packaging efficiency, 150 W/kg specific power, 0.1 Hz deployed stiffness, and 0.2 g deployed strength. Much larger arrays with up to a megawatt or more of power and improved packaging and specific power are of interest to mission planners for minimizing launch and life cycle costs of Mars exploration. A new concept referred to as the Compact Telescoping Array (CTA) with 60 kW/cu m packaging efficiency at 1 MW of power is described herein. Performance metrics as a function of array size and corresponding power level are derived analytically and validated by finite element analysis. Feasible CTA packaging and deployment approaches are also described. The CTA was developed, in part, to serve as a NASA reference solar array concept against which other proposed designs of 50-1000 kW arrays for future high-power SEP missions could be compared.

  13. Microcoil Spring Interconnects for Ceramic Grid Array Integrated Circuits

    NASA Technical Reports Server (NTRS)

    Strickland, S. M.; Hester, J. D.; Gowan, A. K.; Montgomery, R. K.; Geist, D. L.; Blanche, J. F.; McGuire, G. D.; Nash, T. S.

    2011-01-01

    As integrated circuit miniaturization trends continue, they drive the need for smaller higher input/output (I/O) packages. Hermetically sealed ceramic area array parts are the package of choice by the space community for high reliability space flight electronic hardware. Unfortunately, the coefficient of thermal expansion mismatch between the ceramic area array package and the epoxy glass printed wiring board limits the life of the interconnecting solder joint. This work presents the results of an investigation by Marshall Space Flight Center into a method to increase the life of this second level interconnection by the use of compliant microcoil springs. The design of the spring and its attachment process are presented along with thermal cycling results of microcoil springs (MCS) compared with state-of-the-art ball and column interconnections. Vibration testing has been conducted on MCS and high lead column parts. Radio frequency simulation and measurements have been made and the MCS has been modeled and a stress analysis performed. Thermal cycling and vibration testing have shown MCS interconnects to be significantly more reliable than solder columns. Also, MCS interconnects are less prone to handling damage than solder columns. Future work that includes shock testing, incorporation into a digital signal processor board, and process evaluation of expansion from a 400 I/O device to a device with over 1,100 I/O is identified.

  14. High-performance packaging for monolithic microwave and millimeter-wave integrated circuits

    NASA Technical Reports Server (NTRS)

    Shalkhauser, K. A.; Li, K.; Shih, Y. C.

    1992-01-01

    Packaging schemes were developed that provide low-loss, hermetic enclosure for advanced monolithic microwave and millimeter-wave integrated circuits (MMICs). The package designs are based on a fused quartz substrate material that offers improved radio frequency (RF) performance through 44 gigahertz (GHz). The small size and weight of the packages make them appropriate for a variety of applications, including phased array antenna systems. Packages were designed in two forms; one for housing a single MMIC chip, the second in the form of a multi-chip phased array module. The single chip array module was developed in three separate sizes, for chips of different geometry and frequency requirements. The phased array module was developed to address packaging directly for antenna applications, and includes transmission line and interconnect structures to support multi-element operation. All packages are fabricated using fused quartz substrate materials. As part of the packaging effort, a test fixture was developed to interface the single chip packages to conventional laboratory instrumentation for characterization of the packaged devices. The package and test fixture designs were both developed in a generic sense, optimizing performance for a wide range of possible applications and devices.

  15. Modular package for cooling a laser diode array

    DOEpatents

    Mundinger, David C.; Benett, William J.; Beach, Raymond J.

    1992-01-01

    A laser diode array is disclosed that includes a plurality of planar packages and active cooling. The laser diode array may be operated in a long duty cycle, or in continuous operation. A laser diode bar and a microchannel heat sink are thermally coupled in a compact, thin planar package having the laser diode bar located proximate to one edge. In an array, a number of such thin planar packages are secured together in a stacked configuration, in close proximity so that the laser diodes are spaced closely. The cooling means includes a microchannel heat sink that is attached proximate to the laser bar so that it absorbs heat generated by laser operation. To provide the coolant to the microchannels, each thin planar package comprises a thin inlet manifold and a thin outlet manifold connected to an inlet corridor and an outlet corridor. The inlet corridor comprises a hole extending through each of the packages in the array, and the outlet corridor comprises a hole extending through each of the packages in the array. The inlet and outlet corridors are connected to a conventional coolant circulation system. The laser diode array with active cooling has application as an optical pump for high power solid state lasers. Further, it can be incorporated in equipment such as communications devices and active sensors, and in military and space applications, and it can be useful in applications having space constraints and energy limitations.

  16. VCSEL technology for medical diagnostics and therapeutics

    NASA Astrophysics Data System (ADS)

    Hibbs-Brenner, M. K.; Johnson, K. L.; Bendett, M.

    2009-02-01

    In the 1990's a new laser technology, Vertical Cavity Surface Emitting Lasers, or VCSELs, emerged and transformed the data communication industry. The combination of performance characteristics, reliability and performance/cost ratio allowed high data rate communication to occur over short distances at a commercially viable price. VCSELs have not been widely used outside of this application space, but with the development of new attributes, such as a wider range of available wavelengths, the demonstration of arrays of VCSELs on a single chip, and a variety of package form factors, VCSELs can have a significant impact on medical diagnostic and therapeutic applications. One area of potential application is neurostimulation. Researchers have previously demonstrated the feasibility of using 1850nm light for nerve stimulation. The ability to create an array of VCSELs emitting at this wavelength would allow significantly improved spatial resolution, and multiple parallel channels of stimulation. For instance, 2D arrays of 100 lasers or more can be integrated on a single chip less than 2mm on a side. A second area of interest is non-invasive sensing. Performance attributes such as the narrow spectral width, low power consumption, and packaging flexibility open up new possibilities in non-invasive and/or continuous sensing. This paper will suggest ways in which VCSELs can be implemented within these application areas, and the advantages provided by the unique performance characteristics of the VCSEL. The status of VCSEL technology as a function of available wavelength and array size and form factors will be summarized.

  17. Reliability of CCGA and PBGA assemblies

    NASA Technical Reports Server (NTRS)

    Ghaffarian, Reza

    2005-01-01

    Area Array Packages (AAPs) with 1.27 mm pitch have been the packages of the choice for commercial applications; they are now started to be implemented for use in military and aerospace applications. Thermal cycling characteristics of plastic BGA (PBGA) and CSP assemblies, because of their wide usage for commercial applications, have been extensively reported in literature. Thermal cycling represents the on-off environmental condition for most electronic products and therefore is a key factor that defines reliability.

  18. Design, processing and testing of LSI arrays: Hybrid microelectronics task

    NASA Technical Reports Server (NTRS)

    Himmel, R. P.; Stuhlbarg, S. M.; Ravetti, R. G.; Zulueta, P. J.

    1979-01-01

    Mathematical cost factors were generated for both hybrid microcircuit and printed wiring board packaging methods. A mathematical cost model was created for analysis of microcircuit fabrication costs. The costing factors were refined and reduced to formulae for computerization. Efficient methods were investigated for low cost packaging of LSI devices as a function of density and reliability. Technical problem areas such as wafer bumping, inner/outer leading bonding, testing on tape, and tape processing, were investigated.

  19. The Assurance Challenges of Advanced Packaging Technologies for Electronics

    NASA Technical Reports Server (NTRS)

    Sampson, Michael J.

    2010-01-01

    Advances in microelectronic parts performance are driving towards finer feature sizes, three-dimensional geometries and ever-increasing number of transistor equivalents that are resulting in increased die sizes and interconnection (I/O) counts. The resultant packaging necessary to provide assemble-ability, environmental protection, testability and interconnection to the circuit board for the active die creates major challenges, particularly for space applications, Traditionally, NASA has used hermetically packaged microcircuits whenever available but the new demands make hermetic packaging less and less practical at the same time as more and more expensive, Some part types of great interest to NASA designers are currently only available in non-hermetic packaging. It is a far more complex quality and reliability assurance challenge to gain confidence in the long-term survivability and effectiveness of nonhermetic packages than for hermetic ones. Although they may provide more rugged environmental protection than the familiar Plastic Encapsulated Microcircuits (PEMs), the non-hermetic Ceramic Column Grid Array (CCGA) packages that are the focus of this presentation present a unique combination of challenges to assessing their suitability for spaceflight use. The presentation will discuss the bases for these challenges, some examples of the techniques proposed to mitigate them and a proposed approach to a US MIL specification Class for non-hermetic microcircuits suitable for space application, Class Y, to be incorporated into M. IL-PRF-38535. It has recently emerged that some major packaging suppliers are offering hermetic area array packages that may offer alternatives to the nonhermetic CCGA styles but have also got their own inspectability and testability issues which will be briefly discussed in the presentation,

  20. Reliability and paste process optimization of eutectic and lead-free for mixed packaging

    NASA Technical Reports Server (NTRS)

    Ramkumar, S. M.; Ganeshan, V.; Thenalur, K.; Ghaffarian, R.

    2002-01-01

    This paper reports the results of an experiment that utilized the JPL's area array consortium test vehicle design, containing a myriad of mixed technology components with an OSP finish. The details of the reliability study are presented in this paper.

  1. Taguchi Experimental Design for Cleaning PWAs with Ball Grid Arrays

    NASA Technical Reports Server (NTRS)

    Bonner, J. K.; Mehta, A.; Walton, S.

    1997-01-01

    Ball grid arrays (BGAs), and other area array packages, are becoming more prominent as a way to increase component pin count while avoiding the manufacturing difficulties inherent in processing quad flat packs (QFPs)...Cleaning printed wiring assemblies (PWAs) with BGA components mounted on the surface is problematic...Currently, a low flash point semi-aqueous material, in conjunction with a batch cleaning unit, is being used to clean PWAs. The approach taken at JPL was to investigate the use of (1) semi-aqueous materials having a high flash point and (2) aqueous cleaning involving a saponifier.

  2. High-power LED package requirements

    NASA Astrophysics Data System (ADS)

    Wall, Frank; Martin, Paul S.; Harbers, Gerard

    2004-01-01

    Power LEDs have evolved from simple indicators into illumination devices. For general lighting applications, where the objective is to light up an area, white LED arrays have been utilized to serve that function. Cost constraints will soon drive the industry to provide a discrete lighting solution. Early on, that will mean increasing the power densities while quantum efficiencies are addressed. For applications such as automotive headlamps & projection, where light needs to be tightly collimated, or controlled, arrays of die or LEDs will not be able to satisfy the requirements & limitations defined by etendue. Ultimately, whether a luminaire requires a small source with high luminance, or light spread over a general area, economics will force the evolution of the illumination LED into a compact discrete high power package. How the customer interfaces with this new package should be an important element considered early on in the design cycle. If an LED footprint of adequate size is not provided, it may prove impossible for the customer, or end user, to get rid of the heat in a manner sufficient to prevent premature LED light output degradation. Therefore it is critical, for maintaining expected LED lifetime & light output, that thermal performance parameters be defined, by design, at the system level, which includes heat sinking methods & interface materials or methdology.

  3. Design and development of conformal antenna composite structure

    NASA Astrophysics Data System (ADS)

    Xie, Zonghong; Zhao, Wei; Zhang, Peng; Li, Xiang

    2017-09-01

    In the manufacturing process of the common smart skin antenna, the adhesive covered on the radiating elements of the antenna led to severe deviation of the resonant frequency, which degraded the electromagnetic performance of the antenna. In this paper, a new component called package cover was adopted to prevent the adhesive from covering on the radiating elements of the microstrip antenna array. The package cover and the microstrip antenna array were bonded together as packaged antenna which was then embedded into the composite sandwich structure to develop a new structure called conformal antenna composite structure (CACS). The geometric parameters of the microstrip antenna array and the CACS were optimized by the commercial software CST microwave studio. According to the optimal results, the microstrip antenna array and the CACS were manufactured and tested. The experimental and numerical results of electromagnetic performance showed that the resonant frequency of the CACS was close to that of the microstrip antenna array (with error less than 1%) and the CACS had a higher gain (about 2 dB) than the microstrip antenna array. The package system would increase the electromagnetic radiating energy at the design frequency nearly 66%. The numerical model generated by CST microwave studio in this study could successfully predict the electromagnetic performance of the microstrip antenna array and the CACS with relatively good accuracy. The mechanical analysis results showed that the CACS had better flexural property than the composite sandwich structure without the embedment of packaged antenna. The comparison of the electromagnetic performance for the CACS and the MECSSA showed that the package system was useful and effective.

  4. Space Shuttle power extension package

    NASA Technical Reports Server (NTRS)

    Loftus, J. P., Jr.; Craig, J. W.

    1980-01-01

    A modification kit for the Space Transportation System (STS) Orbiter is proposed to provide more power and mission duration for payloads. The power extension package (PEP), a flexible-substrate solar array deployed on the Space Shuttle Orbiter remote manipulator system, can provide as much as 29 kW total power for durations of 10 to 48 days. The kit is installed only for those flights which require enhanced power or duration. The PEP is made possible by development of the flexible-substrate array technology and, in itself, contributes to the technology base for the use of large area solar cells. Modifications to the Orbiter thermal control and life support systems to improve heat balance and to reduce consumables are proposed. The changes consist of repositioning the Orbiter forward radiators and replacing the lithium hydroxide scrubber with a regenerable solid amine.

  5. Ceramic ball grid array package stress analysis

    NASA Astrophysics Data System (ADS)

    Badri, S. H. B. S.; Aziz, M. H. A.; Ong, N. R.; Sauli, Z.; Alcain, J. B.; Retnasamy, V.

    2017-09-01

    The ball grid array (BGA), a form of chip scale package (CSP), was developed as one of the most advanced surface mount devices, which may be assembled by an ordinary surface ball bumps are used instead of plated nickel and gold (Ni/Au) bumps. Assembly and reliability of the BGA's printed circuit board (PCB), which is soldered by conventional surface mount technology is considered in this study. The Ceramic Ball Grid Array (CBGA) is a rectangular ceramic package or square-shaped that will use the solder ball for external electrical connections instead of leads or wire for connections. The solder balls will be arranged in an array or grid at the bottom of the ceramic package body. In this study, ANSYS software is used to investigate the stress on the package for 2 balls and 4 balls of the CBGA package with the various force range of 1-3 Newton applied to the top of the die, top of the substrate and side of the substrate. The highest maximum stress was analyzed and the maximum equivalent stress was observed on the solder ball and the die. From the simulation result, the CBGA package with less solder balls experience higher stress compared to the package with many solder balls. Therefore, less number of solder ball on the CBGA package results higher stress and critically affect the reliability of the solder balls itself, substrate and die which can lead to the solder crack and also die crack.

  6. Visual and x-ray inspection characteristics of eutectic and lead free assemblies

    NASA Technical Reports Server (NTRS)

    Ghaffarian, R.

    2003-01-01

    For high reliability applications, visual inspection has been the key technique for most conventional electronic package assemblies. Now, the use of x-ray technique has become an additional inspection requirement for quality control and detection of unique defects due to manufacturing of advanced electronic array packages such as ball grid array (BGAs) and chip scale packages (CSPs).

  7. Design and simulation of a novel high-efficiency cooling heat-sink structure using fluid-thermodynamics

    NASA Astrophysics Data System (ADS)

    Hongqi, Jing; Li, Zhong; Yuxi, Ni; Junjie, Zhang; Suping, Liu; Xiaoyu, Ma

    2015-10-01

    A novel high-efficiency cooling mini-channel heat-sink structure has been designed to meet the package technology demands of high power density laser diode array stacks. Thermal and water flowing characteristics have been simulated using the Ansys-Fluent software. Owing to the increased effective cooling area, this mini-channel heat-sink structure has a better cooling effect when compared with the traditional macro-channel heat-sinks. Owing to the lower flow velocity in this novel high efficient cooling structure, the chillers' water-pressure requirement is reduced. Meanwhile, the machining process of this high-efficiency cooling mini-channel heat-sink structure is simple and the cost is relatively low, it also has advantages in terms of high durability and long lifetime. This heat-sink is an ideal choice for the package of high power density laser diode array stacks. Project supported by the Defense Industrial Technology Development Program (No. B1320133033).

  8. Temperature environment for 9975 packages stored in KAC

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Daugherty, W. L.

    Plutonium materials are stored in the K Area Complex (KAC) in shipping packages, typically the 9975 shipping package. In order to estimate realistic degradation rates for components within the shipping package (i.e. the fiberboard overpack and O-ring seals), it is necessary to understand actual facility temperatures, which can vary daily and seasonally. Relevant facility temperature data available from several periods throughout its operating history have been reviewed. The annual average temperature within the Crane Maintenance Area has ranged from approximately 70 to 74 °F, although there is significant seasonal variation and lesser variation among different locations within the facility. Themore » long-term average degradation rate for 9975 package components is very close to that expected if the component were to remain continually at the annual average temperature. This result remains valid for a wide range of activation energies (which describes the variation in degradation rate as the temperature changes), if the activation energy remains constant over the seasonal range of component temperatures. It is recommended that component degradation analyses and service life estimates incorporate these results. Specifically, it is proposed that future analyses assume an average facility ambient air temperature of 94 °F. This value is bounding for all packages, and includes margin for several factors such as increased temperatures within the storage arrays, the addition of more packages in the future, and future operational changes.« less

  9. Evaluation of copy number variation detection for a SNP array platform

    PubMed Central

    2014-01-01

    Background Copy Number Variations (CNVs) are usually inferred from Single Nucleotide Polymorphism (SNP) arrays by use of some software packages based on given algorithms. However, there is no clear understanding of the performance of these software packages; it is therefore difficult to select one or several software packages for CNV detection based on the SNP array platform. We selected four publicly available software packages designed for CNV calling from an Affymetrix SNP array, including Birdsuite, dChip, Genotyping Console (GTC) and PennCNV. The publicly available dataset generated by Array-based Comparative Genomic Hybridization (CGH), with a resolution of 24 million probes per sample, was considered to be the “gold standard”. Compared with the CGH-based dataset, the success rate, average stability rate, sensitivity, consistence and reproducibility of these four software packages were assessed compared with the “gold standard”. Specially, we also compared the efficiency of detecting CNVs simultaneously by two, three and all of the software packages with that by a single software package. Results Simply from the quantity of the detected CNVs, Birdsuite detected the most while GTC detected the least. We found that Birdsuite and dChip had obvious detecting bias. And GTC seemed to be inferior because of the least amount of CNVs it detected. Thereafter we investigated the detection consistency produced by one certain software package and the rest three software suits. We found that the consistency of dChip was the lowest while GTC was the highest. Compared with the CNVs detecting result of CGH, in the matching group, GTC called the most matching CNVs, PennCNV-Affy ranked second. In the non-overlapping group, GTC called the least CNVs. With regards to the reproducibility of CNV calling, larger CNVs were usually replicated better. PennCNV-Affy shows the best consistency while Birdsuite shows the poorest. Conclusion We found that PennCNV outperformed the other three packages in the sensitivity and specificity of CNV calling. Obviously, each calling method had its own limitations and advantages for different data analysis. Therefore, the optimized calling methods might be identified using multiple algorithms to evaluate the concordance and discordance of SNP array-based CNV calling. PMID:24555668

  10. A front-end wafer-level microsystem packaging technique with micro-cap array

    NASA Astrophysics Data System (ADS)

    Chiang, Yuh-Min

    2002-09-01

    The back-end packaging process is the remaining challenge for the micromachining industry to commercialize microsystem technology (MST) devices at low cost. This dissertation presents a novel wafer level protection technique as a final step of the front-end fabrication process for MSTs. It facilitates improved manufacturing throughput and automation in package assembly, wafer level testing of devices, and enhanced device performance. The method involves the use of a wafer-sized micro-cap array, which consists of an assortment of small caps micro-molded onto a material with adjustable shapes and sizes to serve as protective structures against the hostile environments during packaging. The micro-cap array is first constructed by a micromachining process with micro-molding technique, then sealed to the device wafer at wafer level. Epoxy-based wafer-level micro cap array has been successfully fabricated and showed good compatibility with conventional back-end packaging processes. An adhesive transfer technique was demonstrated to seal the micro cap array with a MEMS device wafer. No damage or gross leak was observed while wafer dicing or later during a gross leak test. Applications of the micro cap array are demonstrated on MEMS, microactuators fabricated using CRONOS MUMPS process. Depending on the application needs, the micro-molded cap can be designed and modified to facilitate additional component functions, such as optical, electrical, mechanical, and chemical functions, which are not easily achieved in the device by traditional means. Successful fabrication of a micro cap array comprised with microlenses can provide active functions as well as passive protection. An optical tweezer array could be one possibility for applications of a micro cap with microlenses. The micro cap itself could serve as micro well for DNA or bacteria amplification as well.

  11. Development of a low cost integrated 15 kW A.C. solar tracking sub-array for grid connected PV power system applications

    NASA Astrophysics Data System (ADS)

    Stern, M.; West, R.; Fourer, G.; Whalen, W.; Van Loo, M.; Duran, G.

    1997-02-01

    Utility Power Group has achieved a significant reduction in the installed cost of grid-connected PV systems. The two part technical approach focused on 1) The utilization of a large area factory assembled PV panel, and 2) The integration and packaging of all sub-array power conversion and control functions within a single factory produced enclosure. Eight engineering prototype 15kW ac single axis solar tracking sub-arrays were designed, fabricated, and installed at the Sacramento Municipal Utility District's Hedge Substation site in 1996 and are being evaluated for performance and reliability. A number of design enhancements will be implemented in 1997 and demonstrated by the field deployment and operation of over twenty advanced sub-array PV power systems.

  12. Software for computing plant biomass—BIOPAK users guide.

    Treesearch

    Joseph E. Means; Heather A. Hansen; Greg J. Koerper; Paul B Alaback; Mark W. Klopsch

    1994-01-01

    BIOPAK is a menu-driven package of computer programs for IBM-compatible personal computers that calculates the biomass, area, height, length, or volume of plant components (leaves, branches, stem, crown, and roots). The routines were written in FoxPro, Fortran, and C.BIOPAK was created to facilitate linking of a diverse array of vegetation datasets with the...

  13. Performance characterization of high quantum efficiency metal package photomultiplier tubes for time-of-flight and high-resolution PET applications.

    PubMed

    Ko, Guen Bae; Lee, Jae Sung

    2015-01-01

    Metal package photomultiplier tubes (PMTs) with a metal channel dynode structure have several advanced features for devising such time-of-flight (TOF) and high spatial resolution positron emission tomography (PET) detectors, thanks to their high packing density, large effective area ratio, fast time response, and position encoding capability. Here, we report on an investigation of new metal package PMTs with high quantum efficiency (QE) for high-resolution PET and TOF PET detector modules. The latest metal package PMT, the Hamamatsu R11265 series, is served with two kinds of photocathodes that have higher quantum efficiency than normal bialkali (typical QE ≈ 25%), super bialkali (SBA; QE ≈ 35%), and ultra bialkali (UBA; QE ≈ 43%). In this study, the authors evaluated the performance of the new PMTs with SBA and UBA photocathodes as a PET detector by coupling various crystal arrays. They also investigated the performance improvements of high QE, focusing in particular on a block detector coupled with a lutetium-based scintillator. A single 4 × 4 × 10 mm(3) LYSO, a 7 × 7 array of 3 × 3 × 20 mm(3) LGSO, a 9 × 9 array of 1.2 × 1.2 × 10 mm(3) LYSO, and a 6 × 6 array of 1.5 × 1.5 × 7 mm(3) LuYAP were used for evaluation. All coincidence data were acquired with a DRS4 based fast digitizer. This new PMT shows promising crystal positioning accuracy, energy and time discrimination performance for TOF, and high-resolution PET applications. The authors also found that a metal channel PMT with SBA was enough for both TOF and high-resolution application, although UBA gave a minor improvement to time resolution. However, significant performance improvement was observed in relative low light output crystals (LuYAP) coupled with UBA. The results of this study will be of value as a useful reference to select PMTs for high-performance PET detectors.

  14. Array Technology for Terahertz Imaging

    NASA Technical Reports Server (NTRS)

    Reck, Theodore; Siles, Jose; Jung, Cecile; Gill, John; Lee, Choonsup; Chattopadhyay, Goutam; Mehdi, Imran; Cooper, Ken

    2012-01-01

    Heterodyne terahertz (0.3 - 3THz) imaging systems are currently limited to single or a low number of pixels. Drastic improvements in imaging sensitivity and speed can be achieved by replacing single pixel systems with an array of detectors. This paper presents an array topology that is being developed at the Jet Propulsion Laboratory based on the micromachining of silicon. This technique fabricates the array's package and waveguide components by plasma etching of silicon, resulting in devices with precision surpassing that of current metal machining techniques. Using silicon increases the versatility of the packaging, enabling a variety of orientations of circuitry within the device which increases circuit density and design options. The design of a two-pixel transceiver utilizing a stacked architecture is presented that achieves a pixel spacing of 10mm. By only allowing coupling from the top and bottom of the package the design can readily be arrayed in two dimensions with a spacing of 10mm x 18mm.

  15. Packaging and testing of multi-wavelength DFB laser array using REC technology

    NASA Astrophysics Data System (ADS)

    Ni, Yi; Kong, Xuan; Gu, Xiaofeng; Chen, Xiangfei; Zheng, Guanghui; Luan, Jia

    2014-02-01

    Packaging of distributed feedback (DFB) laser array based on reconstruction-equivalent-chirp (REC) technology is a bridge from chip to system, and influences the practical process of REC chip. In this paper, DFB laser arrays of 4-channel @1310 nm and 8-channel @1550 nm are packaged. Our experimental results show that both these laser arrays have uniform wavelength spacing and larger than 35 dB average Side Mode Suppression Ratio (SMSR). When I=35 mA, we obtain the total output power of 1 mW for 4-channel @1310 nm, and 227 μw for 8-channel @1550 nm respectively. The high frequency characteristics of the packaged chips are also obtained, and the requirements for 4×10 G or even 8×10 G systems can be reached. Our results demonstrate the practical and low cost performance of REC technology and indicate its potential in the future fiber-to-the-home (FTTH) application.

  16. Reliability of high I/O high density CCGA interconnect electronic packages under extreme thermal environments

    NASA Astrophysics Data System (ADS)

    Ramesham, Rajeshuni

    2012-03-01

    Ceramic column grid array (CCGA) packages have been increasing in use based on their advantages such as high interconnect density, very good thermal and electrical performances, compatibility with standard surfacemount packaging assembly processes, and so on. CCGA packages are used in space applications such as in logic and microprocessor functions, telecommunications, payload electronics, and flight avionics. As these packages tend to have less solder joint strain relief than leaded packages or more strain relief over lead-less chip carrier packages, the reliability of CCGA packages is very important for short-term and long-term deep space missions. We have employed high density CCGA 1152 and 1272 daisy chained electronic packages in this preliminary reliability study. Each package is divided into several daisy-chained sections. The physical dimensions of CCGA1152 package is 35 mm x 35 mm with a 34 x 34 array of columns with a 1 mm pitch. The dimension of the CCGA1272 package is 37.5 mm x 37.5 mm with a 36 x 36 array with a 1 mm pitch. The columns are made up of 80% Pb/20%Sn material. CCGA interconnect electronic package printed wiring polyimide boards have been assembled and inspected using non-destructive x-ray imaging techniques. The assembled CCGA boards were subjected to extreme temperature thermal atmospheric cycling to assess their reliability for future deep space missions. The resistance of daisy-chained interconnect sections were monitored continuously during thermal cycling. This paper provides the experimental test results of advanced CCGA packages tested in extreme temperature thermal environments. Standard optical inspection and x-ray non-destructive inspection tools were used to assess the reliability of high density CCGA packages for deep space extreme temperature missions.

  17. Addressable microshutter array for a high-performance infrared miniature dispersive spectrometer

    NASA Astrophysics Data System (ADS)

    Ilias, S.; Picard, F.; Larouche, C.; Kruzelecky, R.; Jamroz, W.

    2009-02-01

    Programmable microshutter arrays were designed to improve the attainable signal to noise ratio (SNR) of a miniature dispersive spectrometer developed for space applications. Integration of a microshutter array to this instrument provides advantages such as the addition of a binary coded optical input operation mode for the miniature spectrometer which results in SNR benefits without spectral resolution loss. These arrays were successfully fabricated using surface micromachining technology. Each microshutter is basically an electrostatic zipping actuator having a curved shape. Applying critical voltage to one microshutter pulls the actuator down to the substrate and closes the associated slit. Opening of the microslits relies on the restoring force generated within the actuated zippers. High light transmission is obtained with the actuator in the open position and excellent light blocking is observed when the shutter is closed. The pull-in voltage to close the microslits was about 110 V and the response times to close and open the microslits were about 2 ms and 7 ms, respectively. Selected array dies were mounted in modified off-the-shelf ceramic packages and electrically connected to package pins. The packages were hermetically sealed with AR coated sapphire windows. This last packaging step was performed in a dry nitrogen controlled atmosphere.

  18. Destructive examination of shipping package 9975-02101

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Daugherty, W. L.

    Destructive and non-destructive examinations have been performed on the components of shipping package 9975-02101 as part of the comprehensive Model 9975 package surveillance program. This package is one of ten high-wattage packages that were selected for field surveillance in FY15, and was identified to contain several non-conforming conditions. Most of these conditions (mold, stains, drum corrosion, calculated fiberboard dimensions and fiberboard damage) relate to the accumulation of water in the outer and lower portions of the cane fiberboard assembly. In the short term, this causes local but reversible changes in the fiberboard properties. Long-term effects can include the permanent lossmore » of fiberboard properties (thus far observed only in the bottom fiberboard layers) and reduced drum integrity due to corrosion. The observed conditions must be fully evaluated by KAC to ensure the safety function of the package is being maintained. Three of the other nine FY15 high-wattage packages examined in the K-Area Complex showed similar behavior. Corrosion of the overpack drum has been seen primarily in those packages with relatively severe fiberboard degradation. Visual examination of the drums in storage for external corrosion should be considered as a screening tool to identify additional packages with potential fiberboard degradation. Where overpack drum corrosion has been observed, it is typically heaviest adjacent to the stitch welds along the bottom edge. It is possible that changes to the stitch weld design would reduce the degree of corrosion in this area, but would not eliminate it. Several factors can contribute to the concentration of moisture in the fiberboard, including higher than average initial moisture content, higher internal temperature (due to internal heat load and placement with the array of packages), and the creation of additional moisture as the fiberboard begins to degrade.« less

  19. Patterning two-dimensional chalcogenide crystals of Bi2Se3 and In2Se3 and efficient photodetectors

    PubMed Central

    Zheng, Wenshan; Xie, Tian; Zhou, Yu; Chen, Y.L.; Jiang, Wei; Zhao, Shuli; Wu, Jinxiong; Jing, Yumei; Wu, Yue; Chen, Guanchu; Guo, Yunfan; Yin, Jianbo; Huang, Shaoyun; Xu, H.Q.; Liu, Zhongfan; Peng, Hailin

    2015-01-01

    Patterning of high-quality two-dimensional chalcogenide crystals with unique planar structures and various fascinating electronic properties offers great potential for batch fabrication and integration of electronic and optoelectronic devices. However, it remains a challenge that requires accurate control of the crystallization, thickness, position, orientation and layout. Here we develop a method that combines microintaglio printing with van der Waals epitaxy to efficiently pattern various single-crystal two-dimensional chalcogenides onto transparent insulating mica substrates. Using this approach, we have patterned large-area arrays of two-dimensional single-crystal Bi2Se3 topological insulator with a record high Hall mobility of ∼1,750 cm2 V−1 s−1 at room temperature. Furthermore, our patterned two-dimensional In2Se3 crystal arrays have been integrated and packaged to flexible photodetectors, yielding an ultrahigh external photoresponsivity of ∼1,650 A W−1 at 633 nm. The facile patterning, integration and packaging of high-quality two-dimensional chalcogenide crystals hold promise for innovations of next-generation photodetector arrays, wearable electronics and integrated optoelectronic circuits. PMID:25898022

  20. Integrated circuit package with lead structure and method of preparing the same

    NASA Technical Reports Server (NTRS)

    Kennedy, B. W. (Inventor)

    1973-01-01

    A beam-lead integrated circuit package assembly including a beam-lead integrated circuit chip, a lead frame array bonded to projecting fingers of the chip, a rubber potting compound disposed around the chip, and an encapsulating molded plastic is described. The lead frame array is prepared by photographically printing a lead pattern on a base metal sheet, selectively etching to remove metal between leads, and plating with gold. Joining of the chip to the lead frame array is carried out by thermocompression bonding of mating goldplated surfaces. A small amount of silicone rubber is then applied to cover the chip and bonded joints, and the package is encapsulated with epoxy resin, applied by molding.

  1. Quasi-CW 110 kW AlGaAs Laser Diode Array Module for Inertial Fusion Energy Laser Driver

    NASA Astrophysics Data System (ADS)

    Kawashima, Toshiyuki; Kanzaki, Takeshi; Matsui, Ken; Kato, Yoshinori; Matsui, Hiroki; Kanabe, Tadashi; Yamanaka, Masanobu; Nakatsuka, Masahiro; Izawa, Yasukazu; Nakai, Sadao; Miyamoto, Masahiro; Kan, Hirofumi; Hiruma, Teruo

    2001-12-01

    We have successfully demonstrated a large aperture 803 nm AlGaAs diode laser module as a pump source for a 1053 nm, 10 J output Nd:glass slab laser amplifier for diode-pumped solid-state laser (DPSSL) fusion driver. Detailed performance results of the laser diode module are presented, including bar package and stack configuration, and their thermal design and analysis. A sufficiently low thermal impedance of the stack was realized by combining backplane liquid cooling configuration with modular bar package architecture. Total peak power of 110 kW and electrical to optical conversion efficiency of 46% were obtained from the module consisting of a total of 1000 laser diode bars. A peak intensity of 2.6 kW/cm2 was accomplished across an emitting area of 418 mm× 10 mm. Currently, this laser diode array module with a large two-dimensional aperture is, to our knowledge, the only operational pump source for the high output energy DPSSL.

  2. SIMS prototype system 4: Design data brochure

    NASA Technical Reports Server (NTRS)

    1978-01-01

    A pre-package prototype unit having domestic hot water and room solar heating capability that uses air as the collector fluid is described. This system is designed to be used with a small single-family dwelling where a roof mounted collector array is not feasible. The prototype unit is an assemble containing 203 square feet of effective collector surface with 113 cubic feet of rock storage. The design of structure and storage is modular, which permits expansion and reduction of the collector array and storage bed in 68 square feet and 37 cubic feet increments respectively. The system is designed to be transportable. This permitted assemble and certification testing in one area and installation in another area without tear down and reassemble. Design, installation, operation, performance and maintenance of this system are described.

  3. Quartz/fused silica chip carriers

    NASA Technical Reports Server (NTRS)

    1992-01-01

    The primary objective of this research and development effort was to develop monolithic microwave integrated circuit (MMIC) packaging which will operate efficiently at millimeter-wave frequencies. The packages incorporated fused silica as the substrate material which was selected due to its favorable electrical properties and potential performance improvement over more conventional materials for Ka-band operation. The first step towards meeting this objective is to develop a package that meets standard mechanical and thermal requirements using fused silica and to be compatible with semiconductor devices operating up to at least 44 GHz. The second step is to modify the package design and add multilayer and multicavity capacity to allow for application specific integrated circuits (ASIC's) to control multiple phase shifters. The final step is to adapt the package design to a phased array module with integral radiating elements. The first task was a continuation of the SBIR Phase 1 work. Phase 1 identified fused silica as a viable substrate material by demonstrating various plating, machining, and adhesion properties. In Phase 2 Task 1, a package was designed and fabricated to validate these findings. Task 2 was to take the next step in packaging and fabricate a multilayer, multichip module (MCM). This package is the predecessor to the phased array module and demonstrates the ability to via fill, circuit print, laminate, and to form vertical interconnects. The final task was to build a phased array module. The radiating elements were to be incorporated into the package instead of connecting to it with wire or ribbon bonds.

  4. Lightweight Integrated Solar Array (LISA): Providing Higher Power to Small Spacecraft

    NASA Technical Reports Server (NTRS)

    Johnson, Les; Carr, John; Fabisinski, Leo; Lockett, Tiffany Russell

    2015-01-01

    Affordable and convenient access to electrical power is essential for all spacecraft and is a critical design driver for the next generation of smallsats, including CubeSats, which are currently extremely power limited. The Lightweight Integrated Solar Array (LISA), a concept designed, prototyped, and tested at the NASA Marshall Space Flight Center (MSFC) in Huntsville, Alabama provides an affordable, lightweight, scalable, and easily manufactured approach for power generation in space. This flexible technology has many wide-ranging applications from serving small satellites to providing abundant power to large spacecraft in GEO and beyond. By using very thin, ultraflexible solar arrays adhered to an inflatable or deployable structure, a large area (and thus large amount of power) can be folded and packaged into a relatively small volume.

  5. Micromachined three-dimensional electrode arrays for transcutaneous nerve tracking

    NASA Astrophysics Data System (ADS)

    Rajaraman, Swaminathan; Bragg, Julian A.; Ross, James D.; Allen, Mark G.

    2011-08-01

    We report the development of metal transfer micromolded (MTM) three-dimensional microelectrode arrays (3D MEAs) for a transcutaneous nerve tracking application. The measurements of electrode-skin-electrode impedance (ESEI), electromyography (EMG) and nerve conduction utilizing these minimally invasive 3D MEAs are demonstrated in this paper. The 3D MEAs used in these measurements consist of a metalized micro-tower array that can penetrate the outer layers of the skin in a painless fashion and are fabricated using MTM technology. Two techniques, an inclined UV lithography approach and a double-side exposure of thick negative tone resist, have been developed to fabricate the 3D MEA master structure. The MEAs themselves are fabricated from the master structure utilizing micromolding techniques. Metal patterns are transferred during the micromolding process, thereby ensuring reduced process steps compared to traditional silicon-based approaches. These 3D MEAs have been packaged utilizing biocompatible Kapton® substrates. ESEI measurements have been carried out on test human subjects with standard commercial wet electrodes as a reference. The 3D MEAs demonstrate an order of magnitude lower ESEI (normalized to area) compared to wet electrodes for an area that is 12.56 times smaller. This compares well with other demonstrated approaches in literature. For a nerve tracking demonstration, we have chosen EMG and nerve conduction measurements on test human subjects. The 3D MEAs show 100% improvement in signal power and SNR/√area as compared to standard electrodes. They also demonstrate larger amplitude signals and faster rise times during nerve conduction measurements. We believe that this microfabrication and packaging approach scales well to large-area, high-density arrays required for applications like nerve tracking. This development will increase the stimulation and recording fidelity of skin surface electrodes, while increasing their spatial resolution by an order of magnitude or more. Although biopotential electrode systems are not without their challenges, the non-invasive access to neural information, along with the potential for automation with associated electronic and software development, is precisely what makes this technology an excellent candidate for the next generation in diagnostic, therapeutic, and prosthetic devices.

  6. DOE Office of Scientific and Technical Information (OSTI.GOV)

    Daugherty, W. L.

    Destructive and non-destructive examinations have been performed on the components of shipping package 9975-02019 as part of a comprehensive SRS surveillance program for plutonium material stored in the K-Area Complex (KAC). During the field surveillance inspection of this package in KAC, two non-conforming conditions were noted: the axial gap of 1.577 inch exceeded the 1 inch maximum criterion, and two areas of dried glue residue were noted on the upper fiberboard subassembly. This package was subsequently transferred to SRNL for more detailed inspection and destructive examination. In addition to the conditions noted in KAC, the following conditions were noted: -more » Numerous small spots of corrosion were observed along the bottom edge of the drum. - In addition to the smeared glue residue on the upper fiberboard subassembly, there was also a small dark stain. - Mold was present on the side and bottom of the lower fiberboard subassembly. Dark stains from elevated moisture content were also present in these areas. - A dark spot with possible light corrosion was observed on the primary containment vessel flange, and corresponding rub marks were observed on the secondary containment vessel ID. - The fiberboard thermal conductivity in the radial orientation was above the specified range. When the test was repeated with slightly lower moisture content, the result was acceptable. The moisture content for both tests was within a range typical of other packages in storage. The observed conditions must be fully evaluated by KAC to ensure the safety function of the package is being maintained. Several factors can contribute to the concentration of moisture in the fiberboard, including higher than average initial moisture content, higher internal temperature (due to internal heat load and placement within the array of packages), and the creation of additional moisture as the fiberboard begins to degrade.« less

  7. ANTS — a simulation package for secondary scintillation Anger-camera type detector in thermal neutron imaging

    NASA Astrophysics Data System (ADS)

    Morozov, A.; Defendi, I.; Engels, R.; Fraga, F. A. F.; Fraga, M. M. F. R.; Guerard, B.; Jurkovic, M.; Kemmerling, G.; Manzin, G.; Margato, L. M. S.; Niko, H.; Pereira, L.; Petrillo, C.; Peyaud, A.; Piscitelli, F.; Raspino, D.; Rhodes, N. J.; Sacchetti, F.; Schooneveld, E. M.; Van Esch, P.; Zeitelhack, K.

    2012-08-01

    A custom and fully interactive simulation package ANTS (Anger-camera type Neutron detector: Toolkit for Simulations) has been developed to optimize the design and operation conditions of secondary scintillation Anger-camera type gaseous detectors for thermal neutron imaging. The simulation code accounts for all physical processes related to the neutron capture, energy deposition pattern, drift of electrons of the primary ionization and secondary scintillation. The photons are traced considering the wavelength-resolved refraction and transmission of the output window. Photo-detection accounts for the wavelength-resolved quantum efficiency, angular response, area sensitivity, gain and single-photoelectron spectra of the photomultipliers (PMTs). The package allows for several geometrical shapes of the PMT photocathode (round, hexagonal and square) and offers a flexible PMT array configuration: up to 100 PMTs in a custom arrangement with the square or hexagonal packing. Several read-out patterns of the PMT array are implemented. Reconstruction of the neutron capture position (projection on the plane of the light emission) is performed using the center of gravity, maximum likelihood or weighted least squares algorithm. Simulation results reproduce well the preliminary results obtained with a small-scale detector prototype. ANTS executables can be downloaded from http://coimbra.lip.pt/~andrei/.

  8. Reliability of High I/O High Density CCGA Interconnect Electronic Packages under Extreme Thermal Environment

    NASA Technical Reports Server (NTRS)

    Ramesham, Rajeshuni

    2012-01-01

    This paper provides the experimental test results of advanced CCGA packages tested in extreme temperature thermal environments. Standard optical inspection and x-ray non-destructive inspection tools were used to assess the reliability of high density CCGA packages for deep space extreme temperature missions. Ceramic column grid array (CCGA) packages have been increasing in use based on their advantages such as high interconnect density, very good thermal and electrical performances, compatibility with standard surface-mount packaging assembly processes, and so on. CCGA packages are used in space applications such as in logic and microprocessor functions, telecommunications, payload electronics, and flight avionics. As these packages tend to have less solder joint strain relief than leaded packages or more strain relief over lead-less chip carrier packages, the reliability of CCGA packages is very important for short-term and long-term deep space missions. We have employed high density CCGA 1152 and 1272 daisy chained electronic packages in this preliminary reliability study. Each package is divided into several daisy-chained sections. The physical dimensions of CCGA1152 package is 35 mm x 35 mm with a 34 x 34 array of columns with a 1 mm pitch. The dimension of the CCGA1272 package is 37.5 mm x 37.5 mm with a 36 x 36 array with a 1 mm pitch. The columns are made up of 80% Pb/20%Sn material. CCGA interconnect electronic package printed wiring polyimide boards have been assembled and inspected using non-destructive x-ray imaging techniques. The assembled CCGA boards were subjected to extreme temperature thermal atmospheric cycling to assess their reliability for future deep space missions. The resistance of daisy-chained interconnect sections were monitored continuously during thermal cycling. This paper provides the experimental test results of advanced CCGA packages tested in extreme temperature thermal environments. Standard optical inspection and x-ray non-destructive inspection tools were used to assess the reliability of high density CCGA packages for deep space extreme temperature missions. Keywords: Extreme temperatures, High density CCGA qualification, CCGA reliability, solder joint failures, optical inspection, and x-ray inspection.

  9. A Probabilistic Approach to Predict Thermal Fatigue Life for Ball Grid Array Solder Joints

    NASA Astrophysics Data System (ADS)

    Wei, Helin; Wang, Kuisheng

    2011-11-01

    Numerous studies of the reliability of solder joints have been performed. Most life prediction models are limited to a deterministic approach. However, manufacturing induces uncertainty in the geometry parameters of solder joints, and the environmental temperature varies widely due to end-user diversity, creating uncertainties in the reliability of solder joints. In this study, a methodology for accounting for variation in the lifetime prediction for lead-free solder joints of ball grid array packages (PBGA) is demonstrated. The key aspects of the solder joint parameters and the cyclic temperature range related to reliability are involved. Probabilistic solutions of the inelastic strain range and thermal fatigue life based on the Engelmaier model are developed to determine the probability of solder joint failure. The results indicate that the standard deviation increases significantly when more random variations are involved. Using the probabilistic method, the influence of each variable on the thermal fatigue life is quantified. This information can be used to optimize product design and process validation acceptance criteria. The probabilistic approach creates the opportunity to identify the root causes of failed samples from product fatigue tests and field returns. The method can be applied to better understand how variation affects parameters of interest in an electronic package design with area array interconnections.

  10. The graphics and data acquisition software package

    NASA Technical Reports Server (NTRS)

    Crosier, W. G.

    1981-01-01

    A software package was developed for use with micro and minicomputers, particularly the LSI-11/DPD-11 series. The package has a number of Fortran-callable subroutines which perform a variety of frequently needed tasks for biomedical applications. All routines are well documented, flexible, easy to use and modify, and require minimal programmer knowledge of peripheral hardware. The package is also economical of memory and CPU time. A single subroutine call can perform any one of the following functions: (1) plot an array of integer values from sampled A/D data, (2) plot an array of Y values versus an array of X values; (3) draw horizontal and/or vertical grid lines of selectable type; (4) annotate grid lines with user units; (5) get coordinates of user controlled crosshairs from the terminal for interactive graphics; (6) sample any analog channel with program selectable gain; (7) wait a specified time interval, and (8) perform random access I/O of one or more blocks of a sequential disk file. Several miscellaneous functions are also provided.

  11. Micromachined High Frequency PMN-PT/Epoxy 1-3 Composite Ultrasonic Annular Array

    PubMed Central

    Liu, Changgeng; Djuth, Frank; Li, Xiang; Chen, Ruimin; Zhou, Qifa; Shung, K. Kirk

    2013-01-01

    This paper reports the design, fabrication, and performance of miniature micromachined high frequency PMN-PT/epoxy 1-3 composite ultrasonic annular arrays. The PMN-PT single crystal 1-3 composites were made with micromachining techniques. The area of a single crystal pillar was 9 μm × 9 μm. The width of the kerf among pillars was ~ 5 μm and the kerfs were filled with a polymer. The composite thickness was 25 μm. A six-element annular transducer of equal element area of 0.2 mm2 with 16 μm kerf widths between annuli was produced. The aperture size the array transducer is about 1.5 mm in diameter. A novel electrical interconnection strategy for high density array elements was implemented. After the transducer was attached to the electric connection board and packaged, the array transducer was tested in a pulse/echo arrangement, whereby the center frequency, bandwidth, two-way insertion loss (IL), and cross talk between adjacent elements were measured for each annulus. The center frequency was 50 MHz and -6 dB bandwidth was 90%. The average insertion loss was 19.5 dB at 50 MHz and the crosstalk between adjacent elements was about -35 dB. The micromachining techniques described in this paper are promising for the fabrication of other types of high frequency transducers e.g. 1D and 2D arrays. PMID:22119324

  12. Radiometric packaging of uncooled bolometric infrared focal plane arrays

    NASA Astrophysics Data System (ADS)

    García-Blanco, Sonia; Pope, Timothy; Côté, Patrice; Leclerc, Mélanie; Ngo Phong, Linh; Châteauneuf, François

    2017-11-01

    INO has a wide experience in the design and fabrication of different kinds of microbolometer focal plane arrays (FPAs). In particular, a 512x3 pixel microbolometer FPA has been selected as the sensor for the New Infrared Sensor Technology (NIRST) instrument, one of the payloads of the SACD/Aquarius mission. In order to make the absolute temperature measurements necessary for many infrared Earth observation applications, the microbolometer FPA must be integrated into a package offering a very stable thermal environment. The radiometric packaging technology developed at INO presents an innovative approach since it was conceived to be modular and adaptable for the packaging of different microbolometer FPAs and for different sets of assembly requirements without need for requalification of the assembly process. The development of the radiometric packaging technology has broadened the position of INO as a supplier of radiometric detector modules integrating FPAs of microbolometers inside a radiometric package capable of achieving the requirements of different space missions. This paper gives an overview of the design of INO's radiometric package. Key performance parameters are also discussed and the test campaign conducted with the radiometric package is presented.

  13. Attenuated total internal reflection infrared microspectroscopic imaging using a large-radius germanium internal reflection element and a linear array detector.

    PubMed

    Patterson, Brian M; Havrilla, George J

    2006-11-01

    The number of techniques and instruments available for Fourier transform infrared (FT-IR) microspectroscopic imaging has grown significantly over the past few years. Attenuated total internal reflectance (ATR) FT-IR microspectroscopy reduces sample preparation time and has simplified the analysis of many difficult samples. FT-IR imaging has become a powerful analytical tool using either a focal plane array or a linear array detector, especially when coupled with a chemometric analysis package. The field of view of the ATR-IR microspectroscopic imaging area can be greatly increased from 300 x 300 microm to 2500 x 2500 microm using a larger internal reflection element of 12.5 mm radius instead of the typical 1.5 mm radius. This gives an area increase of 70x before aberrant effects become too great. Parameters evaluated include the change in penetration depth as a function of beam displacement, measurements of the active area, magnification factor, and change in spatial resolution over the imaging area. Drawbacks such as large file size will also be discussed. This technique has been successfully applied to the FT-IR imaging of polydimethylsiloxane foam cross-sections, latent human fingerprints, and a model inorganic mixture, which demonstrates the usefulness of the method for pharmaceuticals.

  14. Design and simulation of a tactile display based on a CMUT array

    NASA Astrophysics Data System (ADS)

    Chouvardas, Vasilios G.; Hatalis, Miltiadis K.; Miliou, Amalia N.

    2012-10-01

    In this article, we present the design of a tactile display based on a CMUT-phased array. The array implements a 'pixel' of the display and is used to focus airborne ultrasound energy on the skin surface. The pressure field, generated by the focused ultrasound waves, is used to excite the mechanoreceptors under the skin and transmit tactile information. The results of Finite Element Analysis (FEA) of the Capacitive Micromachined Ultrasonic Transducer (CMUT) and the CMUT-phased array for ultrasound emission are presented. The 3D models of the device and the array were developed using a commercial FEA package. Modelling and simulations were performed using the parameters from the POLYMUMPS surface micromachining technology from MEMSCAP. During the analysis of the phased array, several parameters were studied in order to determine their importance in the design of the tactile display. The output of the array is compared with the acoustic intensity thresholds in order to prove the feasibility of the design. Taking into account the density of the mechanoreceptors in the skin, we conclude that there should be at least one receptor under the excitation area formed on the skin.

  15. 10 CFR 71.59 - Standards for arrays of fissile material packages.

    Code of Federal Regulations, 2012 CFR

    2012-01-01

    ... the stack by water: (1) Five times “N” undamaged packages with nothing between the packages would be.... The value of the CSI may be zero provided that an unlimited number of packages are subcritical, such...) of this section. Any CSI greater than zero must be rounded up to the first decimal place. (c) For a...

  16. 10 CFR 71.59 - Standards for arrays of fissile material packages.

    Code of Federal Regulations, 2013 CFR

    2013-01-01

    ... the stack by water: (1) Five times “N” undamaged packages with nothing between the packages would be.... The value of the CSI may be zero provided that an unlimited number of packages are subcritical, such...) of this section. Any CSI greater than zero must be rounded up to the first decimal place. (c) For a...

  17. 10 CFR 71.59 - Standards for arrays of fissile material packages.

    Code of Federal Regulations, 2014 CFR

    2014-01-01

    ... the stack by water: (1) Five times “N” undamaged packages with nothing between the packages would be.... The value of the CSI may be zero provided that an unlimited number of packages are subcritical, such...) of this section. Any CSI greater than zero must be rounded up to the first decimal place. (c) For a...

  18. Integrated Electrode Arrays for Neuro-Prosthetic Implants

    NASA Technical Reports Server (NTRS)

    Brandon, Erik; Mojarradi, Mohammede

    2003-01-01

    Arrays of electrodes integrated with chip-scale packages and silicon-based integrated circuits have been proposed for use as medical electronic implants, including neuro-prosthetic devices that might be implanted in brains of patients who suffer from strokes, spinal-cord injuries, or amyotrophic lateral sclerosis. The electrodes of such a device would pick up signals from neurons in the cerebral cortex, and the integrated circuit would perform acquisition and preprocessing of signal data. The output of the integrated circuit could be used to generate, for example, commands for a robotic arm. Electrode arrays capable of acquiring electrical signals from neurons already exist, but heretofore, there has been no convenient means to integrate these arrays with integrated-circuit chips. Such integration is needed in order to eliminate the need for the extensive cabling now used to pass neural signals to data-acquisition and -processing equipment outside the body. The proposed integration would enable progress toward neuro-prostheses that would be less restrictive of patients mobility. An array of electrodes would comprise a set of thin wires of suitable length and composition protruding from and supported by a fine-pitch micro-ball grid array or chip-scale package (see figure). The associated integrated circuit would be mounted on the package face opposite the probe face, using the solder bumps (the balls of the ball grid array) to make the electrical connections between the probes and the input terminals of the integrated circuit. The key innovation is the insertion of probe wires of the appropriate length and material into the solder bumps through a reflow process, thereby fixing the probes in place and electrically connecting them with the integrated circuit. The probes could be tailored to any distribution of lengths and made of any suitable metal that could be drawn into fine wires. Furthermore, the wires could be coated with an insulating layer using anodization or other processes, to achieve the correct electrical impedance. The probe wires and the packaging materials must be biocompatible using such materials as lead-free solders. For protection, the chip and package can be coated with parylene.

  19. Effect of interface layer on the performance of high power diode laser arrays

    NASA Astrophysics Data System (ADS)

    Zhang, Pu; Wang, Jingwei; Xiong, Lingling; Li, Xiaoning; Hou, Dong; Liu, Xingsheng

    2015-02-01

    Packaging is an important part of high power diode laser (HPLD) development and has become one of the key factors affecting the performance of high power diode lasers. In the package structure of HPLD, the interface layer of die bonding has significant effects on the thermal behavior of high power diode laser packages and most degradations and failures in high power diode laser packages are directly related to the interface layer. In this work, the effects of interface layer on the performance of high power diode laser array were studied numerically by modeling and experimentally. Firstly, numerical simulations using finite element method (FEM) were conducted to analyze the effects of voids in the interface layer on the temperature rise in active region of diode laser array. The correlation between junction temperature rise and voids was analyzed. According to the numerical simulation results, it was found that the local temperature rise of active region originated from the voids in the solder layer will lead to wavelength shift of some emitters. Secondly, the effects of solder interface layer on the spectrum properties of high power diode laser array were studied. It showed that the spectrum shape of diode laser array appeared "right shoulder" or "multi-peaks", which were related to the voids in the solder interface layer. Finally, "void-free" techniques were developed to minimize the voids in the solder interface layer and achieve high power diode lasers with better optical-electrical performances.

  20. Wide-field microscopy using microcamera arrays

    NASA Astrophysics Data System (ADS)

    Marks, Daniel L.; Youn, Seo Ho; Son, Hui S.; Kim, Jungsang; Brady, David J.

    2013-02-01

    A microcamera is a relay lens paired with image sensors. Microcameras are grouped into arrays to relay overlapping views of a single large surface to the sensors to form a continuous synthetic image. The imaged surface may be curved or irregular as each camera may independently be dynamically focused to a different depth. Microcamera arrays are akin to microprocessors in supercomputers in that both join individual processors by an optoelectronic routing fabric to increase capacity and performance. A microcamera may image ten or more megapixels and grouped into an array of several hundred, as has already been demonstrated by the DARPA AWARE Wide-Field program with multiscale gigapixel photography. We adapt gigapixel microcamera array architectures to wide-field microscopy of irregularly shaped surfaces to greatly increase area imaging over 1000 square millimeters at resolutions of 3 microns or better in a single snapshot. The system includes a novel relay design, a sensor electronics package, and a FPGA-based networking fabric. Biomedical applications of this include screening for skin lesions, wide-field and resolution-agile microsurgical imaging, and microscopic cytometry of millions of cells performed in situ.

  1. NASA DOD Lead Free Electronics Project

    NASA Technical Reports Server (NTRS)

    Kessel, Kurt R.

    2008-01-01

    The primary'technical objective of this project is to undertake comprehensive testing to generate information on failure modes/criteria to better understand the reliability of: Packages (e.g., Thin Small Outline Package [TSOP], Ball Grid Array [BGA], Plastic Dual In-line Package [PDIPD assembled and reworked with lead-free alloys Packages (e.g., TSOP, BGA, PDIP) assembled and reworked with mixed (lead/lead-free) alloys.

  2. Structures and Techniques For Implementing and Packaging Complex, Large Scale Microelectromechanical Systems Using Foundry Fabrication Processes.

    DTIC Science & Technology

    1996-06-01

    switches 5-43 Figure 5-27. Mechanical interference between ’Pull Spring’ devices 5-45 Figure 5-28. Array of LIGA mechanical relay switches 5-49...like coating DM Direct metal interconnect technique DMD ™ Digital Micromirror Device EDP Ethylene, diamine, pyrocatechol and water; silicon anisotropic...mechanical systems MOSIS MOS Implementation Service PGA Pin grid array, an electronic die package PZT Lead-zirconate-titanate LIGA Lithographie

  3. Dimpled ball grid array process development for space flight applications

    NASA Technical Reports Server (NTRS)

    Barr, S. L.; Mehta, A.

    2000-01-01

    A 472 dimpled ball grid array (D-BGA) package has not been used in past space flight environments, therefore it was necessary to develop a process that would yield robust and reliable solder joints. The process developing assembly, inspection and rework techniques, were verified by conducting environmental tests. Since the 472 D-BGA packages passed the above environmental tests within the specifications, the process was successfully developed for space flight electronics.

  4. Plastic-Sealed Hybrid Power Circuit Package

    NASA Technical Reports Server (NTRS)

    Miller, W. N.; Gray, O. E.

    1983-01-01

    Proposed design for hybrid high-voltage power-circuit package uses molded plastic for hermetic sealing instead of glass-to-metal seal. New package used to house high-voltage regulators and solid-state switches for applications in aircraft, electric automobiles, industrial equipment, satellites, solarcell arrays, and other equipment in extreme environments.

  5. High-performance packaging for monolithic microwave and millimeter-wave integrated circuits

    NASA Technical Reports Server (NTRS)

    Shalkhauser, K. A.; Li, K.; Shih, Y. C.

    1992-01-01

    Packaging schemes are developed that provide low-loss, hermetic enclosure for enhanced monolithic microwave and millimeter-wave integrated circuits. These package schemes are based on a fused quartz substrate material offering improved RF performance through 44 GHz. The small size and weight of the packages make them useful for a number of applications, including phased array antenna systems. As part of the packaging effort, a test fixture was developed to interface the single chip packages to conventional laboratory instrumentation for characterization of the packaged devices.

  6. Reliability of CGA/LGA/HDI Package Board/Assembly (Final Report)

    NASA Technical Reports Server (NTRS)

    Ghaffaroam. Reza

    2014-01-01

    Package manufacturers are now offering commercial-off-the-shelf column grid array (COTS CGA) packaging technologies in high-reliability versions. Understanding the process and quality assurance (QA) indicators for reliability are important for low-risk insertion of these advanced electronics packages. The previous reports, released in January of 2012 and January of 2013, presented package test data, assembly information, and reliability evaluation by thermal cycling for CGA packages with 1752, 1517, 1509, and 1272 inputs/outputs (I/Os) and 1-mm pitch. It presented the thermal cycling (-55C either 100C or 125C) test results for up to 200 cycles. This report presents up to 500 thermal cycles with quality assurance and failure analysis evaluation represented by optical photomicrographs, 2D real time X-ray images, dye-and-pry photomicrographs, and optical/scanning electron Microscopy (SEM) cross-sectional images. The report also presents assembly challenge using reflowing by either vapor phase or rework station of CGA and land grid array (LGA) versions of three high I/O packages both ceramic and plastic configuration. A new test vehicle was designed having high density interconnect (HDI) printed circuit board (PCB) with microvia-in-pad to accommodate both LGA packages as well as a large number of fine pitch ball grid arrays (BGAs). The LGAs either were assembled onto HDI PCB as an LGA or were solder paste print and reflow first to form solder dome on pads before assembly. Both plastic BGAs with 1156 I/O and ceramic LGAs were assembled. It also presented the X-ray inspection results as well as failures due to 200 thermal cycles. Lessons learned on assembly of ceramic LGAs are also presented.

  7. Lightweight Inflatable Solar Array: Providing a Flexible, Efficient Solution to Space Power Systems for Small Spacecraft

    NASA Technical Reports Server (NTRS)

    Johnson, Les; Fabisinski, Leo; Justice, Stefanie

    2014-01-01

    Affordable and convenient access to electrical power is critical to consumers, spacecraft, military and other applications alike. In the aerospace industry, an increased emphasis on small satellite flights and a move toward CubeSat and NanoSat technologies, the need for systems that could package into a small stowage volume while still being able to power robust space missions has become more critical. As a result, the Marshall Space Flight Center's Advanced Concepts Office identified a need for more efficient, affordable, and smaller space power systems to trade in performing design and feasibility studies. The Lightweight Inflatable Solar Array (LISA), a concept designed, prototyped, and tested at the NASA Marshall Space Flight Center (MSFC) in Huntsville, Alabama provides an affordable, lightweight, scalable, and easily manufactured approach for power generation in space or on Earth. This flexible technology has many wide-ranging applications from serving small satellites to soldiers in the field. By using very thin, ultraflexible solar arrays adhered to an inflatable structure, a large area (and thus large amount of power) can be folded and packaged into a relatively small volume (shown in artist rendering in Figure 1 below). The proposed presentation will provide an overview of the progress to date on the LISA project as well as a look at its potential, with continued development, to revolutionize small spacecraft and portable terrestrial power systems.

  8. Fully Printed, Flexible, Phased Array Antenna for Lunar Surface Communication

    NASA Technical Reports Server (NTRS)

    Subbaraman, Harish; Hen, Ray T.; Lu, Xuejun; Chen, Maggie Yihong

    2013-01-01

    NASAs future exploration missions focus on the manned exploration of the Moon, Mars, and beyond, which will rely heavily on the development of a reliable communications infrastructure from planetary surface-to-surface, surface-to-orbit, and back to Earth. Flexible antennas are highly desired in many scenarios. Active phased array antennas (active PAAs) with distributed control and processing electronics at the surface of an antenna aperture offer numerous advantages for radar communications. Large-area active PAAs on flexible substrates are of particular interest in NASA s space radars due to their efficient inflatable package that can be rolled up during transportation and deployed in space. Such an inflatable package significantly reduces stowage volume and mass. Because of these performance and packaging advantages, large-area inflatable active PAAs are highly desired in NASA s surface-to-orbit and surface-to-relay communications. To address the issues of flexible electronics, a room-temperature printing process of active phased-array antennas on a flexible Kapton substrate was developed. Field effect transistors (FETs) based on carbon nanotubes (CNTs), with many unique physical properties, were successfully proved feasible for the PAA system. This innovation is a new type of fully inkjet-printable, two-dimensional, high-frequency PAA on a flexible substrate at room temperature. The designed electronic circuit components, such as the FET switches in the phase shifter, metal interconnection lines, microstrip transmission lines, etc., are all printed using a special inkjet printer. Using the developed technology, entire 1x4, 2x2, and 4x4 PAA systems were developed, packaged, and demonstrated at 5.3 GHz. Several key solutions are addressed in this work to solve the fabrication issues. The source/drain contact is developed using droplets of silver ink printed on the source/drain areas prior to applying CNT thin-film. The wet silver ink droplets allow the silver to wet the CNT thin-film area and enable good contact with the source and drain contact after annealing. A passivation layer to protect the device channel is developed by bonding a thin Kapton film on top of the device channel. This film is also used as the media for transferring the aligned CNT thin-film on the device substrate. A simple and cost-effective technique to form multilayer metal interconnections on flexible substrate is developed and demonstrated. Contact vias are formed on the second substrate prior to bonding on the first substrate. Inkjet printing is used to fill the silver ink into the via structure. The printed silver ink penetrates through the vias to contact with the contact pads on the bottom layer. It is then annealed to form a good connection. One-dimensional and two-dimensional PAAs were fabricated and characterized. In these circuits, multilayer metal interconnects were used to make a complete PAA system.

  9. NASA-DoD Lead-Free Electronics Project

    NASA Technical Reports Server (NTRS)

    Kessel, Kurt R.

    2009-01-01

    The primary technical objective of this project is to undertake comprehensive testing to generate information on failure modes/criteria to better understand the reliability of: (1) Packages (e.g., Thin Small Outline Package [TSOP], Ball Grid Array [BGA], Plastic Dual In-line Package [PDIP]) assembled and reworked with lead-free alloys, (2) Packages (e.g., TSOP, BGA, PDIP) assembled and reworked with mixed (lead/lead-free) alloys.

  10. Reliability of CGA/LGA/HDI Package Board/Assembly (Revision A)

    NASA Technical Reports Server (NTRS)

    Ghaffarian, Reza

    2013-01-01

    This follow-up report presents reliability test results conducted by thermal cycling of five CGA assemblies evaluated under two extreme cycle profiles, representative of use for high-reliability applications. The thermal cycles ranged from a low temperature of 55 C to maximum temperatures of either 100 C or 125 C with slow ramp-up rate (3 C/min) and dwell times of about 15 minutes at the two extremes. Optical photomicrographs that illustrate key inspection findings of up to 200 thermal cycles are presented. Other information presented include an evaluation of the integrity of capacitors on CGA substrate after thermal cycling as well as process evaluation for direct assembly of an LGA onto PCB. The qualification guidelines, which are based on the test results for CGA/LGA/HDI packages and board assemblies, will facilitate NASA projects' use of very dense and newly available FPGA area array packages with known reliably and mitigation risks, allowing greater processing power in a smaller board footprint and lower system weight.

  11. oneChannelGUI: a graphical interface to Bioconductor tools, designed for life scientists who are not familiar with R language.

    PubMed

    Sanges, Remo; Cordero, Francesca; Calogero, Raffaele A

    2007-12-15

    OneChannelGUI is an add-on Bioconductor package providing a new set of functions extending the capability of the affylmGUI package. This library provides a graphical interface (GUI) for Bioconductor libraries to be used for quality control, normalization, filtering, statistical validation and data mining for single channel microarrays. Affymetrix 3' expression (IVT) arrays as well as the new whole transcript expression arrays, i.e. gene/exon 1.0 ST, are actually implemented. oneChannelGUI is available for most platforms on which R runs, i.e. Windows and Unix-like machines. http://www.bioconductor.org/packages/2.0/bioc/html/oneChannelGUI.html

  12. Uniform rotating field network structure to efficiently package a magnetic bubble domain memory

    NASA Technical Reports Server (NTRS)

    Murray, Glen W. (Inventor); Chen, Thomas T. (Inventor); Wolfshagen, Ronald G. (Inventor); Ypma, John E. (Inventor)

    1978-01-01

    A unique and compact open coil rotating magnetic field network structure to efficiently package an array of bubble domain devices is disclosed. The field network has a configuration which effectively enables selected bubble domain devices from the array to be driven in a vertical magnetic field and in an independent and uniform horizontal rotating magnetic field. The field network is suitably adapted to minimize undesirable inductance effects, improve capabilities of heat dissipation, and facilitate repair or replacement of a bubble device.

  13. Parametric study of two planar high power flexible solar array concepts

    NASA Technical Reports Server (NTRS)

    Garba, J. A.; Kudija, D. A.; Zeldin, B.; Costogue, E. N.

    1978-01-01

    The design parameters examined were: frequency, aspect ratio, packaging constraints, and array blanket flatness. Specific power-to-mass ratios for both solar arrays as a function of array frequency and array width were developed and plotted. Summaries of the baseline design data, developed equations, the computer program operation, plots of the parameters, and the process for using the information as a design manual are presented.

  14. Mechanical Design and Development of TES Bolometer Detector Arrays for the Advanced ACTPol Experiment

    NASA Technical Reports Server (NTRS)

    Ward, Jonathan T.; Austermann, Jason; Beall, James A.; Choi, Steve K.; Crowley, Kevin T.; Devlin, Mark J.; Duff, Shannon M.; Gallardo, Patricio M.; Henderson, Shawn W.; Ho, Shuay-Pwu Patty; hide

    2016-01-01

    The next generation Advanced ACTPol (AdvACT) experiment is currently underway and will consist of four Transition Edge Sensor (TES) bolometer arrays, with three operating together, totaling 5800 detectors on the sky. Building on experience gained with the ACTPol detector arrays, AdvACT will utilize various new technologies, including 150 mm detector wafers equipped with multichroic pixels, allowing for a more densely packed focal plane. Each set of detectors includes a feedhorn array of stacked silicon wafers which form a spline pro le leading to each pixel. This is then followed by a waveguide interface plate, detector wafer, back short cavity plate, and backshort cap. Each array is housed in a custom designed structure manufactured from high purity copper and then gold plated. In addition to the detector array assembly, the array package also encloses cryogenic readout electronics. We present the full mechanical design of the AdvACT high frequency (HF) detector array package along with a detailed look at the detector array stack assemblies. This experiment will also make use of extensive hardware and software previously developed for ACT, which will be modi ed to incorporate the new AdvACT instruments. Therefore, we discuss the integration of all AdvACT arrays with pre-existing ACTPol infrastructure.

  15. Mechanical designs and development of TES bolometer detector arrays for the Advanced ACTPol experiment

    NASA Astrophysics Data System (ADS)

    Ward, Jonathan T.; Austermann, Jason; Beall, James A.; Choi, Steve K.; Crowley, Kevin T.; Devlin, Mark J.; Duff, Shannon M.; Gallardo, Patricio A.; Henderson, Shawn W.; Ho, Shuay-Pwu Patty; Hilton, Gene; Hubmayr, Johannes; Khavari, Niloufar; Klein, Jeffrey; Koopman, Brian J.; Li, Dale; McMahon, Jeffrey; Mumby, Grace; Nati, Federico; Niemack, Michael D.; Page, Lyman A.; Salatino, Maria; Schillaci, Alessandro; Schmitt, Benjamin L.; Simon, Sara M.; Staggs, Suzanne T.; Thornton, Robert; Ullom, Joel N.; Vavagiakis, Eve M.; Wollack, Edward J.

    2016-07-01

    The next generation Advanced ACTPol (AdvACT) experiment is currently underway and will consist of four Transition Edge Sensor (TES) bolometer arrays, with three operating together, totaling 5800 detectors on the sky. Building on experience gained with the ACTPol detector arrays, AdvACT will utilize various new technologies, including 150 mm detector wafers equipped with multichroic pixels, allowing for a more densely packed focal plane. Each set of detectors includes a feedhorn array of stacked silicon wafers which form a spline profile leading to each pixel. This is then followed by a waveguide interface plate, detector wafer, back short cavity plate, and backshort cap. Each array is housed in a custom designed structure manufactured from high purity copper and then gold plated. In addition to the detector array assembly, the array package also encloses cryogenic readout electronics. We present the full mechanical design of the AdvACT high frequency (HF) detector array package along with a detailed look at the detector array stack assemblies. This experiment will also make use of extensive hardware and software previously developed for ACT, which will be modified to incorporate the new AdvACT instruments. Therefore, we discuss the integration of all AdvACT arrays with pre-existing ACTPol infrastructure.

  16. Simplified plotting package for the LSI-11 computer and Tektronix terminals

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Henline, P.

    1980-12-01

    These plotting subroutines were written to allow the user to do plotting easily and quickly, but do not contain many fancy features in order to minimize memory space. Plots are produced of real values only. The first element of the plotting array contains the number of points to plot and the values to plot are stored in the remaining array locations. The maximum number of points which can be plotted is 300. The user must provide titles and other alpha numeric information. This can be done easily by a call to LOCATE, then ALPHA, and then doing a FORTRAN write.more » LOCATE and ALPHA are part of the Oak Ridge TEK11 Graphics Package. All plots are framed and labeled. The X axis has ten tick marks and three labels (left, center, and right side) and the Y axis has three tick marks and three labels. The subroutines assume the user is smart. Curves (especially when more than one is drawn on one plot) are assumed to be completely within the defined area as no clipping or dark lines are drawn. The user has the ability to do multiple curves on one graph or multiple graphs on a page.« less

  17. Package architecture and component design for an implanted neural stimulator with closed loop control.

    PubMed

    Bjune, Caroline K; Marinis, Thomas F; Brady, Jeanne M; Moran, James; Wheeler, Jesse; Sriram, Tirunelveli S; Parks, Philip D; Widge, Alik S; Dougherty, Darin D; Eskandar, Emad N

    2015-08-01

    An implanted neural stimulator with closed loop control requires electrodes for stimulation pulses and recording neuron activity. Our system features arrays of 64 electrodes. Each electrode can be addressed through a cross bar switch, to enable it to be used for stimulation or recording. This electrode switch, a bank of low noise amplifiers with an integrated analog to digital converter, power conditioning electronics, and a communications and control gate array are co-located with the electrode array in a 14 millimeter diameter satellite package that is designed to be flush mounted in a skull burr hole. Our system features five satellite packages connected to a central hub processor-controller via ten conductor cables that terminate in a custom designed, miniaturized connector. The connector incorporates features of high reliability, military grade devices and utilizes three distinct seals to isolate the contacts from fluid permeation. The hub system is comprised of a connector header, hermetic electronics package, and rechargeable battery pack, which are mounted on and electrically interconnected by a flexible circuit board. The assembly is over molded with a compliant silicone rubber. The electronics package contains two antennas, a large coil, used for recharging the battery and a high bandwidth antenna that is used to download data and update software. The package is assembled from two machined alumina pieces, a flat base with brazed in, electrical feed through pins and a rectangular cover with rounded corners. Titanium seal rings are brazed onto these two pieces so that they can be sealed by laser welding. A third system antenna is incorporated in the flexible circuit board. It is used to communicate with an externally worn control package, which monitors the health of the system and allows both the user and clinician to control or modify various system function parameters.

  18. Column Grid Array Rework for High Reliability

    NASA Technical Reports Server (NTRS)

    Mehta, Atul C.; Bodie, Charles C.

    2008-01-01

    Due to requirements for reduced size and weight, use of grid array packages in space applications has become common place. To meet the requirement of high reliability and high number of I/Os, ceramic column grid array packages (CCGA) were selected for major electronic components used in next MARS Rover mission (specifically high density Field Programmable Gate Arrays). ABSTRACT The probability of removal and replacement of these devices on the actual flight printed wiring board assemblies is deemed to be very high because of last minute discoveries in final test which will dictate changes in the firmware. The questions and challenges presented to the manufacturing organizations engaged in the production of high reliability electronic assemblies are, Is the reliability of the PWBA adversely affected by rework (removal and replacement) of the CGA package? and How many times can we rework the same board without destroying a pad or degrading the lifetime of the assembly? To answer these questions, the most complex printed wiring board assembly used by the project was chosen to be used as the test vehicle, the PWB was modified to provide a daisy chain pattern, and a number of bare PWB s were acquired to this modified design. Non-functional 624 pin CGA packages with internal daisy chained matching the pattern on the PWB were procured. The combination of the modified PWB and the daisy chained packages enables continuity measurements of every soldered contact during subsequent testing and thermal cycling. Several test vehicles boards were assembled, reworked and then thermal cycled to assess the reliability of the solder joints and board material including pads and traces near the CGA. The details of rework process and results of thermal cycling are presented in this paper.

  19. 10 CFR 71.59 - Standards for arrays of fissile material packages.

    Code of Federal Regulations, 2011 CFR

    2011-01-01

    ... fissile material package shall derive a number “N” based on all the following conditions being satisfied.... The value of the CSI may be zero provided that an unlimited number of packages are subcritical, such...) of this section. Any CSI greater than zero must be rounded up to the first decimal place. (c) For a...

  20. 10 CFR 71.59 - Standards for arrays of fissile material packages.

    Code of Federal Regulations, 2010 CFR

    2010-01-01

    ... fissile material package shall derive a number “N” based on all the following conditions being satisfied.... The value of the CSI may be zero provided that an unlimited number of packages are subcritical, such...) of this section. Any CSI greater than zero must be rounded up to the first decimal place. (c) For a...

  1. WebArray: an online platform for microarray data analysis

    PubMed Central

    Xia, Xiaoqin; McClelland, Michael; Wang, Yipeng

    2005-01-01

    Background Many cutting-edge microarray analysis tools and algorithms, including commonly used limma and affy packages in Bioconductor, need sophisticated knowledge of mathematics, statistics and computer skills for implementation. Commercially available software can provide a user-friendly interface at considerable cost. To facilitate the use of these tools for microarray data analysis on an open platform we developed an online microarray data analysis platform, WebArray, for bench biologists to utilize these tools to explore data from single/dual color microarray experiments. Results The currently implemented functions were based on limma and affy package from Bioconductor, the spacings LOESS histogram (SPLOSH) method, PCA-assisted normalization method and genome mapping method. WebArray incorporates these packages and provides a user-friendly interface for accessing a wide range of key functions of limma and others, such as spot quality weight, background correction, graphical plotting, normalization, linear modeling, empirical bayes statistical analysis, false discovery rate (FDR) estimation, chromosomal mapping for genome comparison. Conclusion WebArray offers a convenient platform for bench biologists to access several cutting-edge microarray data analysis tools. The website is freely available at . It runs on a Linux server with Apache and MySQL. PMID:16371165

  2. Lightweight Innovative Solar Array (LISA): Providing Higher Power to Small Spacecraft

    NASA Technical Reports Server (NTRS)

    Johnson, Les; Carr, John; Fabisinski, Leo; Russell,Tiffany; Smith, Leigh

    2015-01-01

    Affordable and convenient access to electrical power is essential for all spacecraft and is a critical design driver for the next generation of smallsats, including cubesats, which are currently extremely power limited. The Lightweight Innovative Solar Array (LISA), a concept designed, prototyped, and tested at the NASA Marshall Space Flight Center (MSFC) in Huntsville, Alabama provides an affordable, lightweight, scalable, and easily manufactured approach for power generation in space. This flexible technology has many wide-ranging applications from serving small satellites to providing abundant power to large spacecraft in GEO and beyond. By using very thin, ultra-flexible solar arrays adhered to an inflatable structure, a large area (and thus large amount of power) can be folded and packaged into a relatively small volume. The LISA array comprises a launch-stowed, orbit-deployed structure on which lightweight photovoltaic devices and, potentially, transceiver elements are embedded. The system will provide a 2.5 to 5 fold increase in specific power generation (Watts/kilogram) coupled with a >2x enhancement of stowed volume (Watts/cubic-meter) and a decrease in cost (dollars/Watt) when compared to state-of-the-art solar arrays.

  3. A Conductometric Indium Oxide Semiconducting Nanoparticle Enzymatic Biosensor Array

    PubMed Central

    Lee, Dongjin; Ondrake, Janet; Cui, Tianhong

    2011-01-01

    We report a conductometric nanoparticle biosensor array to address the significant variation of electrical property in nanomaterial biosensors due to the random network nature of nanoparticle thin-film. Indium oxide and silica nanoparticles (SNP) are assembled selectively on the multi-site channel area of the resistors using layer-by-layer self-assembly. To demonstrate enzymatic biosensing capability, glucose oxidase is immobilized on the SNP layer for glucose detection. The packaged sensor chip onto a ceramic pin grid array is tested using syringe pump driven feed and multi-channel I–V measurement system. It is successfully demonstrated that glucose is detected in many different sensing sites within a chip, leading to concentration dependent currents. The sensitivity has been found to be dependent on the channel length of the resistor, 4–12 nA/mM for channel lengths of 5–20 μm, while the apparent Michaelis-Menten constant is 20 mM. By using sensor array, analytical data could be obtained with a single step of sample solution feeding. This work sheds light on the applicability of the developed nanoparticle microsensor array to multi-analyte sensors, novel bioassay platforms, and sensing components in a lab-on-a-chip. PMID:22163696

  4. Reliability of Ceramic Column Grid Array Interconnect Packages Under Extreme Temperatures

    NASA Technical Reports Server (NTRS)

    Ramesham, Rajeshuni

    2011-01-01

    A paper describes advanced ceramic column grid array (CCGA) packaging interconnects technology test objects that were subjected to extreme temperature thermal cycles. CCGA interconnect electronic package printed wiring boards (PWBs) of polyimide were assembled, inspected nondestructively, and, subsequently, subjected to ex - treme-temperature thermal cycling to assess reliability for future deep-space, short- and long-term, extreme-temperature missions. The test hardware consisted of two CCGA717 packages with each package divided into four daisy-chained sections, for a total of eight daisy chains to be monitored. The package is 33 33 mm with a 27 27 array of 80%/20% Pb/Sn columns on a 1.27-mm pitch. The change in resistance of the daisy-chained CCGA interconnects was measured as a function of the increasing number of thermal cycles. Several catastrophic failures were observed after 137 extreme-temperature thermal cycles, as per electrical resistance measurements, and then the tests were continued through 1,058 thermal cycles to corroborate and understand the test results. X-ray and optical inspection have been made after thermal cycling. Optical inspections were also conducted on the CCGA vs. thermal cycles. The optical inspections were conclusive; the x-ray images were not. Process qualification and assembly is required to optimize the CCGA assembly, which is very clear from the x-rays. Six daisy chains were open out of seven daisy chains, as per experimental test data reported. The daisy chains are open during the cold cycle, and then recover during the hot cycle, though some of them also opened during the hot thermal cycle..

  5. Installation package for concentrating solar collector panels

    NASA Technical Reports Server (NTRS)

    1978-01-01

    The concentrating solar collector panels comprise a complete package array consisting of collector panels using modified Fresnel prismatic lenses for a 10 to 1 concentrating ratio, supporting framework, fluid manifolding and tracking drive system, and unassembled components for field erection.

  6. Real-time system for measuring three-dimensional shape of solder bump array by focus using varifocal mirror

    NASA Astrophysics Data System (ADS)

    Ishii, Akira; Tai, Haruka; Mitsudo, Jun

    2007-10-01

    This paper describes a real-time system for measuring the three-dimensional shape of solder bumps arrayed on an LSI chip-size-package (CSP) board presented for inspection based on the shape-from-focus technique. It uses a copper-alloy mirror deformed by a piezoelectric actuator as a varifocal mirror enabling a simple, fast, precise focusing mechanism without moving parts to be built. A practical measuring speed of 1.69 s/package for a small CSP board (4 x 4 mm2) was achieved by incorporating an exclusive field programmable gate array processor to calculate focus measure and by constructing a domed array of LEDs as a high-intensity, uniform illumination system so that a fast (150 fps) and high-resolution (1024 x 1024 pixels/frame) CMOS image sensor could be used. Accurate measurements of bump height were also achieved with errors of 10 μm (2σ) meeting the requirements for testing the coplanarity of a bump array.

  7. A 5 meter range non-planar CMUT array for Automotive Collision Avoidance

    NASA Astrophysics Data System (ADS)

    Hernandez Aguirre, Jonathan

    A discretized hyperbolic paraboloid geometry capacitive micromachined ultrasonic transducer (CMUT) array has been designed and fabricated for automotive collision avoidance. The array is designed to operate at 40 kHz, beamwidth of 40° with a maximum sidelobe intensity of -10dB. An SOI based fabrication technology has been used for the 5x5 array with 5 sensing surfaces along each x and y axis and 7 elevation levels. An assembly and packaging technique has been developed to realize the non-planar geometry in a PGA-68 package. A highly accurate mathematical method has been presented for analytical characterization of capacitive micromachined ultrasonic transducers (CMUTs) built with square diaphragms. The method uses a new two-dimensional polynomial function to more accurately predict the deflection curve of a multilayer square diaphragm subject to both mechanical and electrostatic pressure and a new capacitance model that takes into account the contribution of the fringing field capacitances.

  8. Optical waveguide circuit board with a surface-mounted optical receiver array

    NASA Astrophysics Data System (ADS)

    Thomson, J. E.; Levesque, Harold; Savov, Emil; Horwitz, Fred; Booth, Bruce L.; Marchegiano, Joseph E.

    1994-03-01

    A photonic circuit board is fabricated for potential application to interchip and interboard parallel optical links. The board comprises photolithographically patterned polymer optical waveguides on a conventional glass-epoxy electrical circuit board and a surface-mounted integrated circuit (IC) package that optically and electrically couples to an optoelectronic IC. The waveguide circuits include eight-channel arrays of straights, cross-throughs, curves, self- aligning interconnects to multi-fiber ribbon, and out-of-plane turning mirrors. A coherent, fused bundle of optical fibers couples light between 45-deg waveguide mirrors and a GaAs receiver array in the IC package. The fiber bundle is easily aligned to the mirrors and the receivers and is amenable to surface mounting and hermetic sealing. The waveguide-receiver- array board achieved error-free data rates up to 1.25 Gbits/s per channel, and modal noise was shown to be negligible.

  9. Progress of the Dust Accumulation and Removal Technology Experiment (DART) for the Mars 2001 Lander

    NASA Technical Reports Server (NTRS)

    Jenkins, Phillip; Landis, Geoffrey A.; Wilt, David; Krasowski, Michael; Greer, Lawrence; Baraona, Cosmo; Scheiman, David

    2005-01-01

    Dust deposition could be a significant problem for photovoltaic array operation for long duration missions on the surface of Mars. Measurements made by Pathfinder showed 0.3 percent loss of solar array performance per day due to dust obscuration. We have designed an experiment package, "DART", which is part of the Mars ISPP Precursor (MIP) package, to fly on the Mars-2001 Surveyor Lander. This mission, to launch in April 2001, will arrive on Mars in January 2002. The DART experiment is designed to quantify dust deposition from the Mars atmosphere, measure the properties of settled dust, measure the effect of dust deposition on array performance, and test several methods of clearing dust from solar cells.

  10. Application of Seismic Array Processing to Tsunami Early Warning

    NASA Astrophysics Data System (ADS)

    An, C.; Meng, L.

    2015-12-01

    Tsunami wave predictions of the current tsunami warning systems rely on accurate earthquake source inversions of wave height data. They are of limited effectiveness for the near-field areas since the tsunami waves arrive before data are collected. Recent seismic and tsunami disasters have revealed the need for early warning to protect near-source coastal populations. In this work we developed the basis for a tsunami warning system based on rapid earthquake source characterisation through regional seismic array back-projections. We explored rapid earthquake source imaging using onshore dense seismic arrays located at regional distances on the order of 1000 km, which provides faster source images than conventional teleseismic back-projections. We implement this method in a simulated real-time environment, and analysed the 2011 Tohoku earthquake rupture with two clusters of Hi-net stations in Kyushu and Northern Hokkaido, and the 2014 Iquique event with the Earthscope USArray Transportable Array. The results yield reasonable estimates of rupture area, which is approximated by an ellipse and leads to the construction of simple slip models based on empirical scaling of the rupture area, seismic moment and average slip. The slip model is then used as the input of the tsunami simulation package COMCOT to predict the tsunami waves. In the example of the Tohoku event, the earthquake source model can be acquired within 6 minutes from the start of rupture and the simulation of tsunami waves takes less than 2 min, which could facilitate a timely tsunami warning. The predicted arrival time and wave amplitude reasonably fit observations. Based on this method, we propose to develop an automatic warning mechanism that provides rapid near-field warning for areas of high tsunami risk. The initial focus will be Japan, Pacific Northwest and Alaska, where dense seismic networks with the capability of real-time data telemetry and open data accessibility, such as the Japanese HiNet (>800 instruments) and the Earthscope USArray Transportable Array (~400 instruments), are established.

  11. Push plate, mounting assembly, circuit board, and method of assembling thereof for ball grid array packages

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Vaughn, Mark R.; Montague, Stephen

    A push plate that includes springs in the form of cantilever flexures and an inspection window is disclosed. The push plate provides a known, uniform, down force and minimal torque to a package to be tested. The cantilevers have a known, calculable down force producing stiffness. The window provides for viewing of the package during testing.

  12. Optical design for a breadboard high-resolution spectrometer for SIRTF/IRS

    NASA Astrophysics Data System (ADS)

    Brown, Robert J.; Houck, James R.; van Cleve, Jeffrey E.

    1996-11-01

    The optical design of a breadboard high resolution infrared spectrometer for the IRS instrument on the SIRTF mission is discussed. The spectrometer uses a crossed echelle grating configuration to cover the spectral region from 10 to 20 micrometer with a resolving power of approximately equals 600. The all reflective spectrometer forms a nearly diffraction limited image of the two dimensional spectrum on a 128 multiplied by 128 arsenic doped silicon area array with 75 micrometer pixels. The design aspects discussed include, grating numerology, image quality, packaging and alignment philosophy.

  13. A model for the distributed storage and processing of large arrays

    NASA Technical Reports Server (NTRS)

    Mehrota, P.; Pratt, T. W.

    1983-01-01

    A conceptual model for parallel computations on large arrays is developed. The model provides a set of language concepts appropriate for processing arrays which are generally too large to fit in the primary memories of a multiprocessor system. The semantic model is used to represent arrays on a concurrent architecture in such a way that the performance realities inherent in the distributed storage and processing can be adequately represented. An implementation of the large array concept as an Ada package is also described.

  14. Enabling More than Moore: Accelerated Reliability Testing and Risk Analysis for Advanced Electronics Packaging

    NASA Technical Reports Server (NTRS)

    Ghaffarian, Reza; Evans, John W.

    2014-01-01

    For five decades, the semiconductor industry has distinguished itself by the rapid pace of improvement in miniaturization of electronics products-Moore's Law. Now, scaling hits a brick wall, a paradigm shift. The industry roadmaps recognized the scaling limitation and project that packaging technologies will meet further miniaturization needs or ak.a "More than Moore". This paper presents packaging technology trends and accelerated reliability testing methods currently being practiced. Then, it presents industry status on key advanced electronic packages, factors affecting accelerated solder joint reliability of area array packages, and IPC/JEDEC/Mil specifications for characterizations of assemblies under accelerated thermal and mechanical loading. Finally, it presents an examples demonstrating how Accelerated Testing and Analysis have been effectively employed in the development of complex spacecraft thereby reducing risk. Quantitative assessments necessarily involve the mathematics of probability and statistics. In addition, accelerated tests need to be designed which consider the desired risk posture and schedule for particular project. Such assessments relieve risks without imposing additional costs. and constraints that are not value added for a particular mission. Furthermore, in the course of development of complex systems, variances and defects will inevitably present themselves and require a decision concerning their disposition, necessitating quantitative assessments. In summary, this paper presents a comprehensive view point, from technology to systems, including the benefits and impact of accelerated testing in offsetting risk.

  15. Implementation Status of a Ultra-Wideband Receiver Package for the next-generation Very Large Array

    NASA Astrophysics Data System (ADS)

    Lazio, T. Joseph W.; Velazco, Jose; Soriano, Melissa; Hoppe, Daniel; Russell, Damon; D'Addario, Larry; Long, Ezra; Bowen, James; Samoska, Lorene; Janzen, Andrew

    2017-01-01

    The next-generation Very Large Array (ngVLA) is a concept for a radio astronomical interferometric array operating in the frequency range 1.2 GHz to 116 GHz and designed to provide substantial improvements in sensitivity, angular resolution, and frequency coverage above the current Very Large Array (VLA). As notional design goals, it would have a continuous frequency coverage of 1.2 GHz to 48 GHz and be 10 times more sensitive than the VLA (and 25 times more sensitive than a 34 m diameter antenna of the Deep Space Network [DSN]). One of the key goals for the ngVLA is to reduce the operating costs without sacrificing performance. We are designing an ultra-wideband receiver package designed to operate across the 8 to 48 GHz frequency range, which can be contrasted to the current VLA, which covers this frequency range with five receiver packages. Reducing the number of receiving systems required to cover the full frequency range would reduce operating costs, and the objective of this work is to develop a prototype integrated feed-receiver package with a sensitivity performance comparable to current narrower band systems on radio telescopes and the DSN, but with a design that meets the requirement of low long-term operational costs. The ultra-wideband receiver package consists of a feed horn, low-noise amplifier (LNA), and down-converters to analog intermediate frequencies. Key features of this design are a quad-ridge feed horn with dielectric loading and a cryogenic receiver with a noise temperature of no more than 30 K at the low end of the band. We will report on the status of this receiver package development including the feed design and LNA implementation. We will present simulation studies of the feed horn including the insertion of dielectric components for improved illumination efficiencies across the band of interest. In addition, we will show experimental results of low-noise 35nm InP HEMT amplifier testing performed across the 8-50 GHz frequency range.Part of this research was carried out at the Jet Propulsion Laboratory, California Institute of Technology, under a contract with the National Aeronautics and Space Administration.

  16. A Study of Ultrasonic Wavefront Distortion Compensation.

    DTIC Science & Technology

    1998-08-01

    arrays. The array is made of piezoelectric composite consisting of PZT (lead zirconate titanate) ceramic rods in a polymer matrix. The transducer...We have developed the procedures for making the final transducer array package by a series of steps. The arrays utilize PZT piezoelectric ceramic ...the low contrast cyst at coordinates (250,425) in Figure 6a. Seen below the cyst is a region with an altered texture and poorer angular resolution, a

  17. 30-kW SEP Spacecraft as Secondary Payloads for Low-Cost Deep Space Science Missions

    NASA Technical Reports Server (NTRS)

    Brophy, John R.; Larson, Tim

    2013-01-01

    The Solar Array System contracts awarded by NASA's Space Technology Mission Directorate are developing solar arrays in the 30 kW to 50 kW power range (beginning of life at 1 AU) that have significantly higher specific powers (W/kg) and much smaller stowed volumes than conventional rigid-panel arrays. The successful development of these solar array technologies has the potential to enable new types of solar electric propulsion (SEP) vehicles and missions. This paper describes a 30-kW electric propulsion vehicle built into an EELV Secondary Payload Adapter (ESPA) ring. The system uses an ESPA ring as the primary structure and packages two 15-kW Megaflex solar array wings, two 14-kW Hall thrusters, a hydrazine Reaction Control Subsystem (RCS), 220 kg of xenon, 26 kg of hydrazine, and an avionics module that contains all of the rest of the spacecraft bus functions and the instrument suite. Direct-drive is used to maximize the propulsion subsystem efficiency and minimize the resulting waste heat and required radiator area. This is critical for packaging a high-power spacecraft into a very small volume. The fully-margined system dry mass would be approximately 1120 kg. This is not a small dry mass for a Discovery-class spacecraft, for example, the Dawn spacecraft dry mass was only about 750 kg. But the Dawn electric propulsion subsystem could process a maximum input power of 2.5 kW, and this spacecraft would process 28 kW, an increase of more than a factor of ten. With direct-drive the specific impulse would be limited to about 2,000 s assuming a nominal solar array output voltage of 300 V. The resulting spacecraft would have a beginning of life acceleration that is more than an order of magnitude greater than the Dawn spacecraft. Since the spacecraft would be built into an ESPA ring it could be launched as a secondary payload to a geosynchronous transfer orbit significantly reducing the launch costs for a planetary spacecraft. The SEP system would perform the escape from Earth and then the heliocentric transfer to the science target.

  18. High Power Laser Diode Arrays for 2-Micron Solid State Coherent Lidars Applications

    NASA Technical Reports Server (NTRS)

    Amzajerdian, Farzin; Meadows, Byron; Kavaya, Michael J.; Singh, Upendra; Sudesh, Vikas; Baker, Nathaniel

    2003-01-01

    Laser diode arrays are critical components of any diode-pumped solid state laser systems, constraining their performance and reliability. Laser diode arrays (LDAs) are used as the pump source for energizing the solid state lasing media to generate an intense coherent laser beam with a high spatial and spectral quality. The solid state laser design and the characteristics of its lasing materials define the operating wavelength, pulse duration, and power of the laser diodes. The pump requirements for high pulse energy 2-micron solid state lasers are substantially different from those of more widely used 1-micron lasers and in many aspects more challenging [1]. Furthermore, the reliability and lifetime demanded by many coherent lidar applications, such as global wind profiling from space and long-range clear air turbulence detection from aircraft, are beyond the capability of currently available LDAs. In addition to the need for more reliable LDAs with longer lifetime, further improvement in the operational parameters of high power quasi-cw LDAs, such as electrical efficiency, brightness, and duty cycle, are also necessary for developing cost-effective 2-micron coherent lidar systems for applications that impose stringent size, heat dissipation, and power constraints. Global wind sounding from space is one of such applications, which is the main driver for this work as part of NASA s Laser Risk Reduction Program. This paper discusses the current state of the 792 nm LDA technology and the technology areas being pursued toward improving their performance. The design and development of a unique characterization facility for addressing the specific issues associated with the LDAs for pumping 2-micron coherent lidar transmitters and identifying areas of technological improvement will be described. Finally, the results of measurements to date on various standard laser diode packages, as well as custom-designed packages with potentially longer lifetime, will be reported.

  19. HALT to qualify electronic packages: a proof of concept

    NASA Astrophysics Data System (ADS)

    Ramesham, Rajeshuni

    2014-03-01

    A proof of concept of the Highly Accelerated Life Testing (HALT) technique was explored to assess and optimize electronic packaging designs for long duration deep space missions in a wide temperature range (-150°C to +125°C). HALT is a custom hybrid package suite of testing techniques using environments such as extreme temperatures and dynamic shock step processing from 0g up to 50g of acceleration. HALT testing used in this study implemented repetitive shock on the test vehicle components at various temperatures to precipitate workmanship and/or manufacturing defects to show the weak links of the designs. The purpose is to reduce the product development cycle time for improvements to the packaging design qualification. A test article was built using advanced electronic package designs and surface mount technology processes, which are considered useful for a variety of JPL and NASA projects, i.e. (surface mount packages such as ball grid arrays (BGA), plastic ball grid arrays (PBGA), very thin chip array ball grid array (CVBGA), quad flat-pack (QFP), micro-lead-frame (MLF) packages, several passive components, etc.). These packages were daisy-chained and independently monitored during the HALT test. The HALT technique was then implemented to predict reliability and assess survivability of these advanced packaging techniques for long duration deep space missions in much shorter test durations. Test articles were built using advanced electronic package designs that are considered useful in various NASA projects. All the advanced electronic packages were daisychained independently to monitor the continuity of the individual electronic packages. Continuity of the daisy chain packages was monitored during the HALT testing using a data logging system. We were able to test the boards up to 40g to 50g shock levels at temperatures ranging from +125°C to -150°C. The HALT system can deliver 50g shock levels at room temperature. Several tests were performed by subjecting the test boards to various g levels ranging from 5g to 50g, test durations of 10 minutes to 60 minutes, hot temperatures of up to +125°C and cold temperatures down to -150°C. During the HALT test, electrical continuity measurements of the PBGA package showed an open-circuit, whereas the BGA, MLF, and QFPs showed signs of small variations of electrical continuity measurements. The electrical continuity anomaly of the PBGA occurred in the test board within 12 hours of commencing the accelerated test. Similar test boards were assembled, thermal cycled independently from -150°C to +125°C and monitored for electrical continuity through each package design. The PBGA package on the test board showed an anomalous electrical continuity behavior after 959 thermal cycles. Each thermal cycle took around 2.33 hours, so that a total test time to failure of the PBGA was 2,237 hours (or ~3.1 months) due to thermal cycling alone. The accelerated technique (thermal cycling + shock) required only 12 hours to cause a failure in the PBGA electronic package. Compared to the thermal cycle only test, this was an acceleration of ~186 times (more than 2 orders of magnitude). This acceleration process can save significant time and resources for predicting the life of a package component in a given environment, assuming the failure mechanisms are similar in both the tests. Further studies are in progress to make systematic evaluations of the HALT technique on various other advanced electronic packaging components on the test board. With this information one will be able to estimate the number of mission thermal cycles to failure with a much shorter test program. Further studies are in progress to make systematic study of various components, constant temperature range for both the tests. Therefore, one can estimate the number of hours to fail in a given thermal and shock levels for a given test board physical properties.

  20. Impact of Isothermal Aging on Long-Term Reliability of Fine-Pitch Ball Grid Array Packages with Sn-Ag-Cu Solder Interconnects: Surface Finish Effects

    NASA Astrophysics Data System (ADS)

    Lee, Tae-Kyu; Ma, Hongtao; Liu, Kuo-Chuan; Xue, Jie

    2010-12-01

    The interaction between isothermal aging and the long-term reliability of fine-pitch ball grid array (BGA) packages with Sn-3.0Ag-0.5Cu (wt.%) solder ball interconnects was investigated. In this study, 0.4-mm fine-pitch packages with 300- μm-diameter Sn-Ag-Cu solder balls were used. Two different package substrate surface finishes were selected to compare their effects on the final solder composition, especially the effect of Ni, during thermal cycling. To study the impact on thermal performance and long-term reliability, samples were isothermally aged and thermally cycled from 0°C to 100°C with 10 min dwell time. Based on Weibull plots for each aging condition, package lifetime was reduced by approximately 44% by aging at 150°C. Aging at 100°C showed a smaller impact but similar trend. The microstructure evolution was observed during thermal aging and thermal cycling with different phase microstructure transformations between electrolytic Ni/Au and organic solderability preservative (OSP) surface finishes, focusing on the microstructure evolution near the package-side interface. Different mechanisms after aging at various conditions were observed, and their impacts on the fatigue lifetime of solder joints are discussed.

  1. Efficient Analysis of Systems Biology Markup Language Models of Cellular Populations Using Arrays.

    PubMed

    Watanabe, Leandro; Myers, Chris J

    2016-08-19

    The Systems Biology Markup Language (SBML) has been widely used for modeling biological systems. Although SBML has been successful in representing a wide variety of biochemical models, the core standard lacks the structure for representing large complex regular systems in a standard way, such as whole-cell and cellular population models. These models require a large number of variables to represent certain aspects of these types of models, such as the chromosome in the whole-cell model and the many identical cell models in a cellular population. While SBML core is not designed to handle these types of models efficiently, the proposed SBML arrays package can represent such regular structures more easily. However, in order to take full advantage of the package, analysis needs to be aware of the arrays structure. When expanding the array constructs within a model, some of the advantages of using arrays are lost. This paper describes a more efficient way to simulate arrayed models. To illustrate the proposed method, this paper uses a population of repressilator and genetic toggle switch circuits as examples. Results show that there are memory benefits using this approach with a modest cost in runtime.

  2. C%2B%2B tensor toolbox user manual.

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Plantenga, Todd D.; Kolda, Tamara Gibson

    2012-04-01

    The C++ Tensor Toolbox is a software package for computing tensor decompositions. It is based on the Matlab Tensor Toolbox, and is particularly optimized for sparse data sets. This user manual briefly overviews tensor decomposition mathematics, software capabilities, and installation of the package. Tensors (also known as multidimensional arrays or N-way arrays) are used in a variety of applications ranging from chemometrics to network analysis. The Tensor Toolbox provides classes for manipulating dense, sparse, and structured tensors in C++. The Toolbox compiles into libraries and is intended for use with custom applications written by users.

  3. High performance large infrared and visible astronomy arrays for low background applications: instruments performance data and future developments at Raytheon

    NASA Astrophysics Data System (ADS)

    Beuville, Eric; Acton, David; Corrales, Elizabeth; Drab, John; Levy, Alan; Merrill, Michael; Peralta, Richard; Ritchie, William

    2007-09-01

    Raytheon Vision Systems (RVS) has developed a family of high performance large format infrared detector arrays for astronomy and civil space applications. RVS offers unique off-the-shelf solutions to the astronomy community. This paper describes mega-pixel arrays, based on multiple detector materials, developed for astronomy and low-background applications. New focal plane arrays under development at RVS for the astronomy community will also be presented. Large Sensor Chip Assemblies (SCAs) using various detector materials like Si:PIN, HgCdTe, InSb, and Si:As IBC, covering a detection range from visible to large wavelength infrared (LWIR) have been demonstrated with an excellent quantum efficiency and very good uniformity. These focal plane arrays have been assembled using state-of-the-art low noise, low power, readout integrated circuits (ROIC) designed at RVS. Raytheon packaging capabilities address reliability, precision alignment and flatness requirements for both ground-based and space applications. Multiple SCAs can be packaged into even larger focal planes. The VISTA telescope, for example, contains sixteen 2k × 2k infrared focal plane arrays. RVS astronomical arrays are being deployed world-wide in ground-based and space-based applications. A summary of performance data for each of these array types from instruments in operation will be presented (VIRGO Array for large format SWIR, the ORION and VISTA Arrays, NEWFIRM and other solutions for MWIR spectral ranges).

  4. Characterization of large-area pressure sensitive robot skin

    NASA Astrophysics Data System (ADS)

    Saadatzi, Mohammad Nasser; Baptist, Joshua R.; Wijayasinghe, Indika B.; Popa, Dan O.

    2017-05-01

    Sensorized robot skin has considerable promise to enhance robots' tactile perception of surrounding environments. For physical human-robot interaction (pHRI) or autonomous manipulation, a high spatial sensor density is required, typically driven by the skin location on the robot. In our previous study, a 4x4 flexible array of strain sensors were printed and packaged onto Kapton sheets and silicone encapsulants. In this paper, we are extending the surface area of the patch to larger arrays with up to 128 tactel elements. To address scalability, sensitivity, and calibration challenges, a novel electronic module, free of the traditional signal conditioning circuitry was created. The electronic design relies on a software-based calibration scheme using high-resolution analog-to-digital converters with internal programmable gain amplifiers. In this paper, we first show the efficacy of the proposed method with a 4x4 skin array using controlled pressure tests, and then perform procedures to evaluate each sensor's characteristics such as dynamic force-to-strain property, repeatability, and signal-to-noise-ratio. In order to handle larger sensor surfaces, an automated force-controlled test cycle was carried out. Results demonstrate that our approach leads to reliable and efficient methods for extracting tactile models for use in future interaction with collaborative robots.

  5. Thermal management and light extraction in multi-chip and high-voltage LEDs by cup-shaped copper heat spreader technology

    NASA Astrophysics Data System (ADS)

    Horng, Ray-Hua; Hu, Hung-Lieh; Tang, Li-Shen; Ou, Sin-Liang

    2013-03-01

    For LEDs with original structure and copper heat spreader, the highest surface temperatures of 3×3 array LEDs modules were 52.6 and 42.67 °C (with 1050 mA injection current), while the highest surface temperatures of 4×4 array LEDs modules were 58.55 and 48.85 °C (with 1400 mA injection current), respectively. As the 5×5 array LEDs modules with original structure and copper heat spreader were fabricated, the highest surface temperatures at 1750 mA injection current were 68.51 and 56.73 °C, respectively. The thermal resistance of optimal LEDs array module with copper heat spreader on heat sink using compound solder is reduced obviously. On the other hand, the output powers of 3×3, 4×4 and 5×5 array LEDs modules with original structure were 3621.7, 6346.3 and 9760.4 mW at injection currents of 1050, 1400 and 1750 mA, respectively. Meanwhile, the output powers of these samples with copper heat spreader can be improved to 4098.5, 7150.3 and 10919.6 mW, respectively. The optical and thermal characteristics of array LEDs module have been improved significantly using the cup-shaped copper structure. Furthermore, various types of epoxy-packaged LEDs with cup-shaped structure were also fabricated. It is found that the light extraction efficiency of LED with semicircle package has 55% improvement as compared to that of LED with flat package. The cup-shaped copper structure was contacted directly with sapphire to enhance heat dissipation. In addition to efficient heat dissipation, the light extraction of the lateral emitting in high-power LEDs can be improved.

  6. Microstrip Antenna Arrays on Multilayer LCP Substrates

    NASA Technical Reports Server (NTRS)

    Thompson, Dane; Bairavasubramanian, Ramanan; Wang, Guoan; Kingsley, Nickolas D.; Papapolymerou, Ioannis; Tenteris, Emmanouil M.; DeJean, Gerald; Li, RonglLin

    2007-01-01

    A research and development effort now underway is directed toward satisfying requirements for a new type of relatively inexpensive, lightweight, microwave antenna array and associated circuitry packaged in a thin, flexible sheet that can readily be mounted on a curved or flat rigid or semi-rigid surface. A representative package of this type consists of microwave antenna circuitry embedded in and/or on a multilayer liquid- crystal polymer (LCP) substrate. The circuitry typically includes an array of printed metal microstrip patch antenna elements and their feedlines on one or more of the LCP layer(s). The circuitry can also include such components as electrostatically actuated microelectromechanical systems (MEMS) switches for connecting and disconnecting antenna elements and feedlines. In addition, the circuitry can include switchable phase shifters described below. LCPs were chosen over other flexible substrate materials because they have properties that are especially attractive for high-performance microwave applications. These properties include low permittivity, low loss tangent, low water-absorption coefficient, and low cost. By means of heat treatments, their coefficients of thermal expansion can be tailored to make them more amenable to integration into packages that include other materials. The nature of the flexibility of LCPs is such that large LCP sheets containing antenna arrays can be rolled up, then later easily unrolled and deployed. Figure 1 depicts a prototype three- LCP-layer package containing two four-element, dual-polarization microstrip-patch arrays: one for a frequency of 14 GHz, the other for a frequency of 35 GHz. The 35-GHz patches are embedded on top surface of the middle [15-mil (approx.0.13-mm)-thick] LCP layer; the 14- GHz patches are placed on the top surface of the upper [9-mil (approx. 0.23-mm)-thick] LCP layer. The particular choice of LCP layer thicknesses was made on the basis of extensive analysis of the effects of the thicknesses on cross-polarization levels, bandwidth, and efficiency at each frequency.

  7. GENERAL PURPOSE ADA PACKAGES

    NASA Technical Reports Server (NTRS)

    Klumpp, A. R.

    1994-01-01

    Ten families of subprograms are bundled together for the General-Purpose Ada Packages. The families bring to Ada many features from HAL/S, PL/I, FORTRAN, and other languages. These families are: string subprograms (INDEX, TRIM, LOAD, etc.); scalar subprograms (MAX, MIN, REM, etc.); array subprograms (MAX, MIN, PROD, SUM, GET, and PUT); numerical subprograms (EXP, CUBIC, etc.); service subprograms (DATE_TIME function, etc.); Linear Algebra II; Runge-Kutta integrators; and three text I/O families of packages. In two cases, a family consists of a single non-generic package. In all other cases, a family comprises a generic package and its instances for a selected group of scalar types. All generic packages are designed to be easily instantiated for the types declared in the user facility. The linear algebra package is LINRAG2. This package includes subprograms supplementing those in NPO-17985, An Ada Linear Algebra Package Modeled After HAL/S (LINRAG). Please note that LINRAG2 cannot be compiled without LINRAG. Most packages have widespread applicability, although some are oriented for avionics applications. All are designed to facilitate writing new software in Ada. Several of the packages use conventions introduced by other programming languages. A package of string subprograms is based on HAL/S (a language designed for the avionics software in the Space Shuttle) and PL/I. Packages of scalar and array subprograms are taken from HAL/S or generalized current Ada subprograms. A package of Runge-Kutta integrators is patterned after a built-in MAC (MIT Algebraic Compiler) integrator. Those packages modeled after HAL/S make it easy to translate existing HAL/S software to Ada. The General-Purpose Ada Packages program source code is available on two 360K 5.25" MS-DOS format diskettes. The software was developed using VAX Ada v1.5 under DEC VMS v4.5. It should be portable to any validated Ada compiler and it should execute either interactively or in batch. The largest package requires 205K of main memory on a DEC VAX running VMS. The software was developed in 1989, and is a copyrighted work with all copyright vested in NASA.

  8. Vacuum packaging of InGaAs focal plane array with four-stage thermoelectric cooler

    NASA Astrophysics Data System (ADS)

    Mo, De-feng; Liu, Da-fu; Yang, Li-yi; Xu, Qin-fei; Li, Xue

    2013-09-01

    The InGaAs focal plane array (FPA) detectors, covering the near-infrared 1~2.4 μm wavelength range, have been developed for application in space-based spectroscopy of the Earth atmosphere. This paper shows an all-metal vacuum package design for area array InGaAs detector of 1024×64 pixels, and its architecture will be given. Four-stage thermoelectric cooler (TEC) is used to cool down the FPA chip. To acquire high heat dissipation for TEC's Joule-heat, tungsten copper (CuW80) and kovar (4J29) is used as motherboard and cavity material respectively which joined by brazing. The heat loss including conduction, convection and radiation is analyzed. Finite element model is established to analyze the temperature uniformity of the chip substrate which is made of aluminum nitride (AlN). The performance of The TEC with and without heat load in vacuum condition is tested. The results show that the heat load has little influence to current-voltage relationship of TEC. The temperature difference (ΔT) increases as the input current increases. A linear relationship exists between heat load and ΔT of the TEC. Theoretical analysis and calculation show that the heat loss of radiation and conduction is about 187 mW and 82 mW respectively. Considering the Joule-heat of readout circuit and the heat loss of radiation and conduction, the FPA for a 220 K operation at room temperature can be achieved. As the thickness of AlN chip substrate is thicker than 1 millimeter, the temperature difference can be less than 0.3 K.

  9. Vector-matrix-quaternion, array and arithmetic packages: All HAL/S functions implemented in Ada

    NASA Technical Reports Server (NTRS)

    Klumpp, Allan R.; Kwong, David D.

    1986-01-01

    The HAL/S avionics programmers have enjoyed a variety of tools built into a language tailored to their special requirements. Ada is designed for a broader group of applications. Rather than providing built-in tools, Ada provides the elements with which users can build their own. Standard avionic packages remain to be developed. These must enable programmers to code in Ada as they have coded in HAL/S. The packages under development at JPL will provide all of the vector-matrix, array, and arithmetic functions described in the HAL/S manuals. In addition, the linear algebra package will provide all of the quaternion functions used in Shuttle steering and Galileo attitude control. Furthermore, using Ada's extensibility, many quaternion functions are being implemented as infix operations; equivalent capabilities were never implemented in HAL/S because doing so would entail modifying the compiler and expanding the language. With these packages, many HAL/S expressions will compile and execute in Ada, unchanged. Others can be converted simply by replacing the implicit HAL/S multiply operator with the Ada *. Errors will be trapped and identified. Input/output will be convenient and readable.

  10. Optomechanical Design and Characterization of a Printed-Circuit-Board-Based Free-Space Optical Interconnect Package

    NASA Astrophysics Data System (ADS)

    Zheng, Xuezhe; Marchand, Philippe J.; Huang, Dawei; Kibar, Osman; Ozkan, Nur S. E.; Esener, Sadik C.

    1999-09-01

    We present a proof of concept and a feasibility demonstration of a practical packaging approach in which free-space optical interconnects (FSOI s) can be integrated simply on electronic multichip modules (MCM s) for intra-MCM board interconnects. Our system-level packaging architecture is based on a modified folded 4 f imaging system that has been implemented with only off-the-shelf optics, conventional electronic packaging, and passive-assembly techniques to yield a potentially low-cost and manufacturable packaging solution. The prototypical system as built supports 48 independent FSOI channels with 8 separate laser and detector chips, for which each chip consists of a one-dimensional array of 12 devices. All the chips are assembled on a single substrate that consists of a printed circuit board or a ceramic MCM. Optical link channel efficiencies of greater than 90% and interchannel cross talk of less than 20 dB at low frequency have been measured. The system is compact at only 10 in. 3 (25.4 cm 3 ) and is scalable, as it can easily accommodate additional chips as well as two-dimensional optoelectronic device arrays for increased interconnection density.

  11. ALSEP arrays A, B, C, and A-2. [lunar surface exploration instrument specifications

    NASA Technical Reports Server (NTRS)

    1973-01-01

    The objectives of the lunar surface exploration packages are defined and the preliminary design of scientific systems hardware is reported. Instrument packages are to collect and transmit to earth scientific data on the lunar interior, the lunar surface composition, and the lunar geomorphology

  12. Apollo lunar surface experiments package. Apollo 17 ALSEP (array E) familiarization course handout

    NASA Technical Reports Server (NTRS)

    1972-01-01

    The familiarization course for the Apollo 17 ALSEP (ARRAY E) is presented. The subjects discussed are: (1) power and data subsystems, (2) lunar surface gravimeter, (3) lunar mass spectrometer, (4) lunar seismic profiling experiment, and (5) heat flow experiment.

  13. Fabrication and analysis of microfiber array platform for optogenetics with cellular resolution

    PubMed Central

    Chen, Jian-Hong; Chou, Ming-Yi; Pan, Chien-Yuan; Wang, Lon A.

    2016-01-01

    Optogenetics has emerged as a revolutionary technology especially for neuroscience and has advanced continuously over the past decade. Conventional approaches for patterned in vivo optical illumination have a limitation on the implanted device size and achievable spatio-temporal resolution. In this work, we developed a fabrication process for a microfiber array platform. Arrayed poly(methyl methacrylate) (PMMA) microfibers were drawn from a polymer solution and packaged with polydimethylsiloxane (PDMS). The exposed end face of a packaged microfiber was tuned to have a size corresponding to a single cell. To demonstrate its capability for single cell optogenetics, HEK293T cells expressing channelrhodopsin-2 (ChR2) were cultured on the platform and excited with UV laser. We could then observe an elevation in the intracellular Ca2+ concentrations due to the influx of Ca2+ through the activated ChR2 into the cytosol. The statistical and simulation results indicate that the proposed microfiber array platform can be used for single cell optogenetic applications. PMID:27895984

  14. A 15-MHz 1-3 Piezocomposite Concave Array Transducer for Ophthalmic Imaging.

    PubMed

    Cha, Jung Hyui; Kang, Byungwoo; Jang, Jihun; Chang, Jin Ho

    2015-11-01

    Because of the spherical shape of the human eye, the anterior segments of the eye, particularly the cornea and the lens, create high levels of refraction and reflection of ultrasound which negatively affect the performance of linear and convex arrays. To minimize the ultrasound energy loss, a 15-MHz concave array transducer was designed, fabricated, and characterized; its footprint is able to mesh well with the shape of the cornea. The concave array has a curvature with a radius of 15 mm and 128 elements with a 1.44- pitch. Its elevational focus and view angle are 30 mm and 72.3°, respectively, thus allowing the imaging area to cover the retinal region of interest in the posterior segment. As an active layer, a 1-3 piezocomposite was designed and fabricated in response to the bidirectional (i.e., azimuthal and elevational) curvature of the concave array and the high coupling coefficient. From the performance evaluation, it was found that the completed concave array is able to provide a center frequency of 15.95 MHz and a -6-dB fractional bandwidth of 67.8% after electrical tuning has been conducted. The crosstalk level was measured to be less than -25 dB. It was verified that the concave array is robust to the refraction and reflection from the cornea through pulse-echo testing using a custom-made eye-mimicking phantom. Furthermore, images of both the wire-target phantom and the ex vivo porcine eye were acquired by the finished concave array, which was connected to a commercial ultrasound scanner equipped with a research package. The evaluation results demonstrated that the developed concave array transducer is a possible alternative to conventional arrays for effectively imaging the posterior segment of the eye.

  15. Maskless wafer-level microfabrication of optical penetrating neural arrays out of soda-lime glass: Utah Optrode Array.

    PubMed

    Boutte, Ronald W; Blair, Steve

    2016-12-01

    Borrowing from the wafer-level fabrication techniques of the Utah Electrode Array, an optical array capable of delivering light for neural optogenetic studies is presented in this paper: the Utah Optrode Array. Utah Optrode Arrays are micromachined out of sheet soda-lime-silica glass using standard backend processes of the semiconductor and microelectronics packaging industries such as precision diamond grinding and wet etching. 9 × 9 arrays with 1100μ m × 100μ m optrodes and a 500μ m back-plane are repeatably reproduced on 2i n wafers 169 arrays at a time. This paper describes the steps and some of the common errors of optrode fabrication.

  16. Report of the sensor readout electronics panel

    NASA Technical Reports Server (NTRS)

    Fossum, Eric R.; Carson, J.; Kleinhans, W.; Kosonocky, W.; Kozlowski, L.; Pecsalski, A.; Silver, A.; Spieler, H.; Woolaway, J.

    1991-01-01

    The findings of the Sensor Readout Electronics Panel are summarized in regard to technology assessment and recommended development plans. In addition to two specific readout issues, cryogenic readouts and sub-electron noise, the panel considered three advanced technology areas that impact the ability to achieve large format sensor arrays. These are mega-pixel focal plane packaging issues, focal plane to data processing module interfaces, and event driven readout architectures. Development in each of these five areas was judged to have significant impact in enabling the sensor performance desired for the Astrotech 21 mission set. Other readout issues, such as focal plane signal processing or other high volume data acquisition applications important for Eos-type mapping, were determined not to be relevant for astrophysics science goals.

  17. Multispectral Linear Array detector technology

    NASA Astrophysics Data System (ADS)

    Tower, J. R.; McCarthy, B. M.; Pellon, L. E.; Strong, R. T.; Elabd, H.

    1984-01-01

    The Multispectral Linear Array (MLA) program sponsored by NASA has the aim to extend space-based remote sensor capabilities. The technology development effort involves the realization of very large, all-solid-state, pushbroom focal planes. The pushbroom, staring focal planes will contain thousands of detectors with the objective to provide two orders of magnitude improvement in detector dwell time compared to present Landsat mechanically scanned systems. Attenton is given to visible and near-infrared sensor development, the shortwave infrared sensor, aspects of filter technology development, the packaging concept, and questions of system performance. First-sample, four-band interference filters have been fabricated successfully, and a hybrid packaging technology is being developed.

  18. Modeling the Rate-Dependent Durability of Reduced-Ag SAC Interconnects for Area Array Packages Under Torsion Loads

    NASA Astrophysics Data System (ADS)

    Srinivas, Vikram; Menon, Sandeep; Osterman, Michael; Pecht, Michael G.

    2013-08-01

    Solder durability models frequently focus on the applied strain range; however, the rate of applied loading, or strain rate, is also important. In this study, an approach to incorporate strain rate dependency into durability estimation for solder interconnects is examined. Failure data were collected for SAC105 solder ball grid arrays assembled with SAC305 solder that were subjected to displacement-controlled torsion loads. Strain-rate-dependent (Johnson-Cook model) and strain-rate-independent elastic-plastic properties were used to model the solders in finite-element simulation. Test data were then used to extract damage model constants for the reduced-Ag SAC solder. A generalized Coffin-Manson damage model was used to estimate the durability. The mechanical fatigue durability curve for reduced-silver SAC solder was generated and compared with durability curves for SAC305 and Sn-Pb from the literature.

  19. Artificial Roughness Encoding with a Bio-inspired MEMS- based Tactile Sensor Array

    PubMed Central

    Oddo, Calogero Maria; Beccai, Lucia; Felder, Martin; Giovacchini, Francesco; Carrozza, Maria Chiara

    2009-01-01

    A compliant 2×2 tactile sensor array was developed and investigated for roughness encoding. State of the art cross shape 3D MEMS sensors were integrated with polymeric packaging providing in total 16 sensitive elements to external mechanical stimuli in an area of about 20 mm2, similarly to the SA1 innervation density in humans. Experimental analysis of the bio-inspired tactile sensor array was performed by using ridged surfaces, with spatial periods from 2.6 mm to 4.1 mm, which were indented with regulated 1N normal force and stroked at constant sliding velocity from 15 mm/s to 48 mm/s. A repeatable and expected frequency shift of the sensor outputs depending on the applied stimulus and on its scanning velocity was observed between 3.66 Hz and 18.46 Hz with an overall maximum error of 1.7%. The tactile sensor could also perform contact imaging during static stimulus indentation. The experiments demonstrated the suitability of this approach for the design of a roughness encoding tactile sensor for an artificial fingerpad. PMID:22412304

  20. Thermally Conductive Tape Based on Carbon Nanotube Arrays

    NASA Technical Reports Server (NTRS)

    Kashani, Ali

    2011-01-01

    To increase contact conductance between two mating surfaces, a conductive tape has been developed by growing dense arrays of carbon nanotubes (CNTs, graphite layers folded into cylinders) on both sides of a thermally conductive metallic foil. When the two mating surfaces are brought into contact with the conductive tape in between, the CNT arrays will adhere to the mating surface. The van der Waals force between the contacting tubes and the mating surface provides adhesion between the two mating surfaces. Even though the thermal contact conductance of a single tube-to-tube contact is small, the tremendous amount of CNTs on the surface leads to a very large overall contact conductance. Interface contact thermal resistance rises from the microroughness and the macroscopic non-planar quality of mating surfaces. When two surfaces come into contact with each other, the actual contact area may be much less than the total area of the surfaces. The real area of contact depends on the load, the surface roughness, and the elastic and inelastic properties of the surface. This issue is even more important at cryogenic temperatures, where materials become hard and brittle and vacuum is used, which prevents any gas conduction through the interstitial region. A typical approach to increase thermal contact conductance is to use thermally conducting epoxies or greases, which are not always compatible with vacuum conditions. In addition, the thermal conductivities of these compounds are often relatively low. The CNTs used in this approach can be metallic or semiconducting, depending on the folding angle and diameter. The electrical resistivity of multiwalled carbon nanotubes (MWCNTs) has been reported. MWCNTs can pass a current density and remain stable at high temperatures in air. The thermal conductivity of a MWCNT at room temperature is measured to be approximately 3,000 W/m-K, which is much larger than that of diamond. At room temperature, the thermal conductance of a 0.3 sq cm array of CNTs was measured to be as high as 10 W/K. The high thermal conductivity and the nanoscale size make CNTs ideal as thermal interface materials. The CNT-based thermal tape can be used for the thermal management of microelectronic packages and electronic systems. It also can be integrated with current device technology and packaging. The material would allow for an efficient method to manage excess heat generation without requiring any additional power. Lastly, the CNT tape can be used to enhance thermal contact conductance across two mating surfaces on some NASA missions.

  1. On-Line Data Reconstruction in Redundant Disk Arrays.

    DTIC Science & Technology

    1994-05-01

    each sale, - file servers that support a large number of clients with differing work schedules , and * automated teller networks in banking systems...24KB Head scheduling : FIFO User data layout: Sequential in address space of array Disk spindles: Synchronized Table 2.2: Default array parameters for...package and a set of scheduling and queueing routines. 2.3.3. Default workload This dissertation reports on many performance evaluations. In order to

  2. Experiment on a three-beam adaptive array for EHF frequency-hopped signals using a fast algorithm, phase-D

    NASA Astrophysics Data System (ADS)

    Yen, J. L.; Kremer, P.; Amin, N.; Fung, J.

    1989-05-01

    The Department of National Defence (Canada) has been conducting studies into multi-beam adaptive arrays for extremely high frequency (EHF) frequency hopped signals. A three-beam 43 GHz adaptive antenna and a beam control processor is under development. An interactive software package for the operation of the array, capable of applying different control algorithms is being written. A maximum signal to jammer plus noise ratio (SJNR) was found to provide superior performance in preventing degradation of user signals in the presence of nearby jammers. A new fast algorithm using a modified conjugate gradient approach was found to be a very efficient way to implement anti-jamming arrays based on maximum SJNR criterion. The present study was intended to refine and simplify this algorithm and to implement the algorithm on an experimental array for real-time evaluation of anti-jamming performance. A three-beam adaptive array was used. A simulation package was used in the evaluation of multi-beam systems using more than three beams and different user-jammer scenarios. An attempt to further reduce the computation burden through continued analysis of maximum SJNR met with limited success. A method to acquire and track an incoming laser beam is proposed.

  3. Experiment on a three-beam adaptive array for EHF frequency-hopped signals using a fast algorithm, phase E

    NASA Astrophysics Data System (ADS)

    Yen, J. L.; Kremer, P.; Fung, J.

    1990-05-01

    The Department of National Defence (Canada) has been conducting studies into multi-beam adaptive arrays for extremely high frequency (EHF) frequency hopped signals. A three-beam 43 GHz adaptive antenna and a beam control processor is under development. An interactive software package for the operation of the array, capable of applying different control algorithms is being written. A maximum signal to jammer plus noise ratio (SJNR) has been found to provide superior performance in preventing degradation of user signals in the presence of nearby jammers. A new fast algorithm using a modified conjugate gradient approach has been found to be a very efficient way to implement anti-jamming arrays based on maximum SJNR criterion. The present study was intended to refine and simplify this algorithm and to implement the algorithm on an experimental array for real-time evaluation of anti-jamming performance. A three-beam adaptive array was used. A simulation package was used in the evaluation of multi-beam systems using more than three beams and different user-jammer scenarios. An attempt to further reduce the computation burden through further analysis of maximum SJNR met with limited success. The investigation of a new angle detector for spatial tracking in heterodyne laser space communications was completed.

  4. Development Of A Three-Dimensional Circuit Integration Technology And Computer Architecture

    NASA Astrophysics Data System (ADS)

    Etchells, R. D.; Grinberg, J.; Nudd, G. R.

    1981-12-01

    This paper is the first of a series 1,2,3 describing a range of efforts at Hughes Research Laboratories, which are collectively referred to as "Three-Dimensional Microelectronics." The technology being developed is a combination of a unique circuit fabrication/packaging technology and a novel processing architecture. The packaging technology greatly reduces the parasitic impedances associated with signal-routing in complex VLSI structures, while simultaneously allowing circuit densities orders of magnitude higher than the current state-of-the-art. When combined with the 3-D processor architecture, the resulting machine exhibits a one- to two-order of magnitude simultaneous improvement over current state-of-the-art machines in the three areas of processing speed, power consumption, and physical volume. The 3-D architecture is essentially that commonly referred to as a "cellular array", with the ultimate implementation having as many as 512 x 512 processors working in parallel. The three-dimensional nature of the assembled machine arises from the fact that the chips containing the active circuitry of the processor are stacked on top of each other. In this structure, electrical signals are passed vertically through the chips via thermomigrated aluminum feedthroughs. Signals are passed between adjacent chips by micro-interconnects. This discussion presents a broad view of the total effort, as well as a more detailed treatment of the fabrication and packaging technologies themselves. The results of performance simulations of the completed 3-D processor executing a variety of algorithms are also presented. Of particular pertinence to the interests of the focal-plane array community is the simulation of the UNICORNS nonuniformity correction algorithms as executed by the 3-D architecture.

  5. 10-channel fiber array fabrication technique for parallel optical coherence tomography system

    NASA Astrophysics Data System (ADS)

    Arauz, Lina J.; Luo, Yuan; Castillo, Jose E.; Kostuk, Raymond K.; Barton, Jennifer

    2007-02-01

    Optical Coherence Tomography (OCT) shows great promise for low intrusive biomedical imaging applications. A parallel OCT system is a novel technique that replaces mechanical transverse scanning with electronic scanning. This will reduce the time required to acquire image data. In this system an array of small diameter fibers is required to obtain an image in the transverse direction. Each fiber in the array is configured in an interferometer and is used to image one pixel in the transverse direction. In this paper we describe a technique to package 15μm diameter fibers on a siliconsilica substrate to be used in a 2mm endoscopic probe tip. Single mode fibers are etched to reduce the cladding diameter from 125μm to 15μm. Etched fibers are placed into a 4mm by 150μm trench in a silicon-silica substrate and secured with UV glue. Active alignment was used to simplify the lay out of the fibers and minimize unwanted horizontal displacement of the fibers. A 10-channel fiber array was built, tested and later incorporated into a parallel optical coherence system. This paper describes the packaging, testing, and operation of the array in a parallel OCT system.

  6. Reliability assessment of ceramic column grid array (CCGA717) interconnect packages under extreme temperatures for space applications (-185°C to +125°C)

    NASA Astrophysics Data System (ADS)

    Ramesham, Rajeshuni

    2010-02-01

    Ceramic Column Grid Array packages have been increasing in use based on their advantages such as high interconnect density, very good thermal and electrical performance, compatibility with standard surface-mount packaging assembly processes, etc. CCGA packages are used in space applications such as in logics and microprocessor functions, telecommunications, flight avionics, payload electronics, etc. As these packages tend to have less solder joint strain relief than leaded packages, the reliability of CCGA packages is very important for short and long-term space missions. CCGA interconnect electronic package printed wiring boards (PWBs) of polyimide have been assembled, inspected non-destructively and subsequently subjected to extreme temperature thermal cycling to assess the reliability for future deep space, short and long-term, extreme temperature missions. In this investigation, the employed temperature range covers from -185°C to +125°C extreme thermal environments. The test hardware consists of two CCGA717 packages with each package divided into four daisy-chained sections, for a total of eight daisy chains to be monitored. The CCGA717 package is 33 mm × 33 mm with a 27×27 array of 80%/20% Pb/Sn columns on a 1.27 mm pitch. The resistance of daisy-chained, CCGA interconnects were continuously monitored as a function of thermal cycling. Electrical resistance measurements as a function of thermal cycling are reported and the tests to date have shown significant change in daisy chain resistance as a function of thermal cycling. The change in interconnect resistance becomes more noticeable with increasing number of thermal cycles. This paper will describe the experimental test results of CCGA testing under wide extreme temperatures. Standard Weibull analysis tools were used to extract the Weibull parameters to understand the CCGA failures. Optical inspection results clearly indicate that the solder joints of columns with the board and the ceramic package have failed as a function of thermal cycling. The first failure was observed at 137th thermal cycle and 63.2% failures of daisy chains have occurred at about 664 thermal cycles. The shape parameter extracted from Weibull plot was about 1.47 which indicates the failures were related to failures occurred during the flat region or useful life region of standard bath tub curve. Based on this experimental test data one can use the CCGAs for the temperature range studied for ~100 thermal cycles (ΔT = 310°C, 5oC/minute, and 15 minutes dwell) with high degree of confidence for high reliability space and other applications.

  7. IRIS Arrays: Observing Wavefields at Multiple Scales and Frequencies

    NASA Astrophysics Data System (ADS)

    Sumy, D. F.; Woodward, R.; Frassetto, A.

    2014-12-01

    The Incorporated Research Institutions for Seismology (IRIS) provides instruments for creating and operating seismic arrays at a wide range of scales. As an example, for over thirty years the IRIS PASSCAL program has provided instruments to individual Principal Investigators to deploy arrays of all shapes and sizes on every continent. These arrays have ranged from just a few sensors to hundreds or even thousands of sensors, covering areas with dimensions of meters to thousands of kilometers. IRIS also operates arrays directly, such as the USArray Transportable Array (TA) as part of the EarthScope program. Since 2004, the TA has rolled across North America, at any given time spanning a swath of approximately 800 km by 2,500 km, and thus far sampling 2% of the Earth's surface. This achievement includes all of the lower-48 U.S., southernmost Canada, and now parts of Alaska. IRIS has also facilitated specialized arrays in polar environments and on the seafloor. In all cases, the data from these arrays are freely available to the scientific community. As the community of scientists who use IRIS facilities and data look to the future they have identified a clear need for new array capabilities. In particular, as part of its Wavefields Initiative, IRIS is exploring new technologies that can enable large, dense array deployments to record unaliased wavefields at a wide range of frequencies. Large-scale arrays might utilize multiple sensor technologies to best achieve observing objectives and optimize equipment and logistical costs. Improvements in packaging and power systems can provide equipment with reduced size, weight, and power that will reduce logistical constraints for large experiments, and can make a critical difference for deployments in harsh environments or other situations where rapid deployment is required. We will review the range of existing IRIS array capabilities with an overview of previous and current deployments and examples of data and results. We will review existing IRIS projects that explore new array capabilities and highlight future directions for IRIS instrumentation facilities.

  8. Transmitter experiment package for the communications technology satellite

    NASA Technical Reports Server (NTRS)

    Farber, B.; Goldin, D. S.; Marcus, B.; Mock, P.

    1977-01-01

    The operating requirements, system design characteristics, high voltage packaging considerations, nonstandard components development, and test results for the transmitter experiment package (TEP) are described. The TEP is used for broadcasting power transmission from the Communications Technology Satellite. The TEP consists of a 12 GHz, 200-watt output stage tube (OST), a high voltage processing system that converts the unregulated spacecraft solar array power to the regulated voltages required for OST operation, and a variable conductance heat pipe system that is used to cool the OST body.

  9. DART: Instrument Package Developed for Investigating Atmospheric Dust on Mars

    NASA Technical Reports Server (NTRS)

    Landis, Geoffrey A.

    2001-01-01

    Mars' dust-filled atmosphere could be a significant problem for photovoltaic array operation during long missions on the surface of Mars. Measurements made by Pathfinder showed a 0.3-percent loss of solar array performance per day due to dust obscuration. Thus, dust deposition is the limiting factor in the lifetime of solar arrays for Martian power systems, and developing design tools to mitigate this deposition is important for long missions.

  10. High-power, format-flexible, 885-nm vertical-cavity surface-emitting laser arrays

    NASA Astrophysics Data System (ADS)

    Wang, Chad; Talantov, Fedor; Garrett, Henry; Berdin, Glen; Cardellino, Terri; Millenheft, David; Geske, Jonathan

    2013-03-01

    High-power, format flexible, 885 nm vertical-cavity surface-emitting laser (VCSEL) arrays have been developed for solid-state pumping and illumination applications. In this approach, a common VCSEL size format was designed to enable tiling into flexible formats and operating configurations. The fabrication of a common chip size on ceramic submount enables low-cost volume manufacturing of high-power VCSEL arrays. This base VCSEL chip was designed to be 5x3.33 mm2, and produced up to 50 Watts of peak continuous wave (CW) power. To scale to higher powers, multiple chips can be tiled into a combination of series or parallel configurations tailored to the application driver conditions. In actively cooled CW operation, the VCSEL array chips were packaged onto a single water channel cooler, and we have demonstrated 0.5x1, 1x1, and 1x3 cm2 formats, producing 150, 250, and 500 Watts of peak power, respectively, in under 130 A operating current. In QCW operation, the 1x3 cm2 VCSEL module, which contains 18 VCSEL array chips packaged on a single water cooler, produced over 1.3 kW of peak power. In passively cooled packages, multiple chip configurations have been developed for illumination applications, producing over 300 Watts of peak power in QCW operating conditions. These VCSEL chips use a substrate-removed structure to allow for efficient thermal heatsinking to enable high-power operation. This scalable, format flexible VCSEL architecture can be applied to wavelengths ranging from 800 to 1100 nm, and can be used to tailor emission spectral widths and build high-power hyperspectral sources.

  11. DOE Office of Scientific and Technical Information (OSTI.GOV)

    Allman, M. S., E-mail: shane.allman@boulder.nist.gov; Verma, V. B.; Stevens, M.

    We demonstrate a 64-pixel free-space-coupled array of superconducting nanowire single photon detectors optimized for high detection efficiency in the near-infrared range. An integrated, readily scalable, multiplexed readout scheme is employed to reduce the number of readout lines to 16. The cryogenic, optical, and electronic packaging to read out the array as well as characterization measurements are discussed.

  12. Enhanced thermaly managed packaging for III-nitride light emitters

    NASA Astrophysics Data System (ADS)

    Kudsieh, Nicolas

    In this Dissertation our work on `enhanced thermally managed packaging of high power semiconductor light sources for solid state lighting (SSL)' is presented. The motivation of this research and development is to design thermally high stable cost-efficient packaging of single and multi-chip arrays of III-nitrides wide bandgap semiconductor light sources through mathematical modeling and simulations. Major issues linked with this technology are device overheating which causes serious degradation in their illumination intensity and decrease in the lifetime. In the introduction the basics of III-nitrides WBG semiconductor light emitters are presented along with necessary thermal management of high power cingulated and multi-chip LEDs and laser diodes. This work starts at chip level followed by its extension to fully packaged lighting modules and devices. Different III-nitride structures of multi-quantum well InGaN/GaN and AlGaN/GaN based LEDs and LDs were analyzed using advanced modeling and simulation for different packaging designs and high thermal conductivity materials. Study started with basic surface mounted devices using conventional packaging strategies and was concluded with the latest thermal management of chip-on-plate (COP) method. Newly discovered high thermal conductivity materials have also been incorporated for this work. Our study also presents the new approach of 2D heat spreaders using such materials for SSL and micro LED array packaging. Most of the work has been presented in international conferences proceedings and peer review journals. Some of the latest work has also been submitted to well reputed international journals which are currently been reviewed for publication. .

  13. Design Challenges of Power Systems for Instrumented Spacecraft with Very Low Perigees in the Earth's Ionosphere

    NASA Technical Reports Server (NTRS)

    Moran, Vickie Eakin; Manzer, Dominic D.; Pfaff, Robert E.; Grebowsky, Joseph M.; Gervin, Jan C.

    1999-01-01

    Designing a solar array to power a spacecraft bus supporting a set of instruments making in situ plasma and neutral atmosphere measurements in the ionosphere at altitudes of 120km or lower poses several challenges. The driving scientific requirements are the field-of-view constraints of the instruments resulting in a three-axis stabilized spacecraft, the need for an electromagnetically unperturbed environment accomplished by designing an electrostatically conducting solar array surface to avoid large potentials, making the spacecraft body as small and as symmetric as possible, and body-mounting the solar array. Furthermore, the life and thermal constraints, in the midst of the effects of the dense atmosphere at low altitude, drive the cross-sectional area of the spacecraft to be small particularly normal to the ram direction. Widely varying sun angles and eclipse durations add further complications, as does the growing desire for multiple spacecraft to resolve spatial and temporal variations packaged into a single launch vehicle. Novel approaches to insure adequate orbit-averaged power levels of approximately 250W include an oval-shaped cross section to increase the solar array collecting area during noon-midnight orbits and the use of a flywheel energy storage system. The flywheel could also be used to help maintain the spacecraft's attitude, particularly during excursions to the lowest perigee altitudes. This paper discusses the approaches used in conceptual power designs for both the proposed Dipper and the Global Electrodynamics Connections (GEC) Mission currently being studied at the NASA/Goddard Space Flight Center.

  14. Platinum nanowire microelectrode arrays for neurostimulation applications: Fabrication, characterization, and in-vitro retinal cell stimulation

    NASA Astrophysics Data System (ADS)

    Whalen, John J., III

    Implantable electrical neurostimulating devices are being developed for a number of applications, including artificial vision through retinal stimulation. The epiretinal prosthesis will use a two-dimensional array microelectrodes to address individual cells of the retina. MEMS fabrication processes can produce arrays of microelectrodes with these dimensions, but there are two critical issues that they cannot satisfy. One, the stimulating electrodes are the only part of the implanted electrical device that penetrate through the water impermeable package, and must do so without sacrificing hermeticity. Two, As electrode size decreases, the current density (A cm-2 ) increases, due to increased electrochemical impedance. This reduces the amount of charge that can be safely injected into the tissue. To date, MEMS processing method, cannot produce electrode arrays with good, prolonged hermetic properties. Similarly, MEMS approaches do not account for the increased impedance caused by decreased surface area. For these reasons there is a strong motivation for the development of a water-impermeable, substrate-penetrating electrode array with low electrochemical impedance. This thesis presents a stimulating electrode array fabricated from platinum nanowires using a modified electrochemical template synthesis approach. Nanowires are electrochemically deposited from ammonium hexachloroplatinate solution into lithographically patterned nanoporous anodic alumina templates to produce microarrays of platinum nanowires. The platinum nanowires penetrating through the ceramic aluminum oxide template serve as parallel electrical conduits through the water impermeable, electrically insulating substrate. Electrode impedance can be adjusted by either controlling the nanowire hydrous platinum oxide content or by partially etching the alumina template to expose additional surface area. A stepwise approach to this project was taken. First, the electrochemistry of ammonium hexachloroplatinate solution was characterized, and physical properties of electrodeposited thin films were correlated to deposition conditions used. Second, platinum nanowires were fabricated and their properties characterized, using similar deposition conditions. Third, the feasibility of fabricating platinum nanowire stimulating electrode arrays with a variety of surface structures was demonstrated. Fourth, the enhanced charge transfer characteristics of these structures were demonstrated using electrochemical techniques. Finally, retinal cell stimulation was demonstrated using electrodes from platinum nanowire arrays.

  15. Latest improvements in microbolometer thin film packaging: paving the way for low-cost consumer applications

    NASA Astrophysics Data System (ADS)

    Yon, J. J.; Dumont, G.; Goudon, V.; Becker, S.; Arnaud, A.; Cortial, S.; Tisse, C. L.

    2014-06-01

    Silicon-based vacuum packaging is a key enabling technology for achieving affordable uncooled Infrared Focal Plane Arrays (IRFPA) required by a promising mass market that shows momentum for some extensive consumer applications, such as automotive driving assistance, smart presence localization and building management. Among the various approaches studied worldwide, CEA, LETI in partnership with ULIS is committed to the development of a unique technology referred to as PLP (Pixel Level Packaging). In this PLP technology, each bolometer pixel is sealed under vacuum using a transparent thin film deposition on wafer. PLP operates as an array of hermetic micro caps above the focal plane, each enclosing a single microbolometer. In continuation of our on-going studies on PLP for regular QVGA IRFPAs, this paper emphasizes on the innate scalability of the technology which was successfully demonstrated through the development of an 80 × 80 pixel IRFPA. The relevance of the technology with regard to the two formats is discussed, considering both performance and cost issues. We show that the suboptimal fill factor inherent to the PLP arrangement is not so critical when considering smaller arrays preferably fitted for consumer applications. The discussion is supported with the electro-optical performance measurements of the PLP-based 80×80 demonstrator.

  16. Mechanism of Void Prediction in Flip Chip Packages with Molded Underfill

    NASA Astrophysics Data System (ADS)

    Wu, Kuo-Tsai; Hwang, Sheng-Jye; Lee, Huei-Huang

    2017-08-01

    Voids have always been present using the molded underfill (MUF) package process, which is a problem that needs further investigation. In this study, the process was studied using the Moldex3D numerical analysis software. The effects of gas (air vent effect) on the overall melt front were also considered. In this isothermal process containing two fluids, the gas and melt colloid interact in the mold cavity. Simulation enabled an appropriate understanding of the actual situation to be gained, and, through analysis, the void region and exact location of voids were predicted. First, the global flow end area was observed to predict the void movement trend, and then the local flow ends were observed to predict the location and size of voids. In the MUF 518 case study, simulations predicted the void region as well as the location and size of the voids. The void phenomenon in a flip chip ball grid array underfill is discussed as part of the study.

  17. Micromolded thick PZT sol gel composite structures for ultrasound transducer devices operating at high frequencies

    NASA Astrophysics Data System (ADS)

    Pang, Guofeng

    The objective of this work has been to design and develop a micromolding technique useful for batch fabrication to microfabricate 3D ceramic structures for device purposes using a sol gel composite processing technique and deep photolithography (UV LIGA). These structures may be the elements of ultrasound transducers, the structures associated with electronic packaging, or microstructures for microfluidic applications. To demonstrate the technique, the project has focused on the design and fabrication of annular and linear arrays for high frequency (>20 MHz) ultrasound imaging applications, particularly where an electronically steered imaging modality is employed. Other typical micromolded structures have been demonstrated to show the potential for micromolding. The transferability of the technique for industrial purposes is proposed. Using a sol gel composite process, the critical components in this technique are mold making, mold filling, material-processing, demolding, top electrode and essential material characterization. Two types of molds have been created using UV LIGA and/or electroplating. A purely organic mold made of Su-8 epoxy based photo-resist has shown tremendous performance for micromolding. The transducer packaging process has also been designed and evaluated at the laboratory level. A Su-8 micro bridge and bond pad has been used for wire bonding purposes. A 5-element annular array transducer has been fabricated by this technique and fully packaged. The micromolded piezoceramic structures have been characterized. The pulse echo performance of each element and the focusing performance of 5 elements of a packaged transducer array have been evaluated using a coaxial cable and a cable delay system.

  18. Manipulating Environmental Time Series in Python/Numpy: the Scikits.Timeseries Package and its Applications.

    NASA Astrophysics Data System (ADS)

    Gerard-Marchant, P. G.

    2008-12-01

    Numpy is a free, open source C/Python interface designed for the fast and convenient manipulation of multidimensional numerical arrays. The base object, ndarray, can also be easily be extended to define new objects meeting specific needs. Thanks to its simplicity, efficiency and modularity, numpy and its companion library Scipy have become increasingly popular in the scientific community over the last few years, with application ranging from astronomy and engineering to finances and statistics. Its capacity to handle missing values is particularly appealing when analyzing environmental time series, where irregular data sampling might be an issue. After reviewing the main characteristics of numpy objects and the mechanism of subclassing, we will present the scikits.timeseries package, developed to manipulate single- and multi-variable arrays indexed in time. We will illustrate some typical applications of this package by introducing climpy, a set of extensions designed to help analyzing the impacts of climate variability on environmental data such as precipitations or streamflows.

  19. Ka-Band MMIC Subarray Technology Program (Ka-Mist)

    NASA Technical Reports Server (NTRS)

    Pottinger, W.

    1995-01-01

    Ka-band monolithic microwave integrated circuit (MMIC) arrays have been considered as having high potential for increasing the capability of space, aircraft, and land mobile communication systems in terms of scan performance, data rate, link margin, and flexibility while offering a significant reduction in size, weight, and power consumption. Insertion of MMIC technology into antenna systems, particularly at millimeter wave frequencies using low power and low noise amplifiers in closed proximity to the radiating elements, offers a significant improvement in the array transmit efficiency, receive system noise figure, and overall array reliability. Application of active array technology also leads to the use of advanced beamforming techniques that can improve beam agility, diversity, and adaptivity to complex signal environments. The objective of this program was to demonstrate the technical feasibility of the 'tile' array packaging architecture at EHF via the insertion of 1990 MMIC technology into a functional tile array or subarray module. The means test of this objective was to demonstrate and deliver to NASA a minimum of two 4 x 4 (16 radiating element) subarray modules operating in a transmit mode at 29.6 GHz. Available (1990) MMIC technology was chosen to focus the program effort on the novel interconnect schemes and packaging requirements rather than focusing on MMIC development. Major technical achievements of this program include the successful integration of two 4 x 4 subarray modules into a single antenna array. This 32 element array demonstrates a transmit EIRP of over 300 watts yielding an effective directive power gain in excess of 55 dB at 29.63 GHz. The array has been actively used as the transmit link in airborne/terrestrial mobile communication experiments accomplished via the ACTS satellite launched in August 1993.

  20. Mechanical Designs and Developement of Advanced ACT: A Transfomative Upgrade to the ACTPol Receiver on the Atacama Cosmology Telescope.

    NASA Astrophysics Data System (ADS)

    Ward, Jonathan; Advanced ACT Collaboration, NASA Space Technology Research Fellowship

    2017-06-01

    The Atacama Cosmology Telescope is a six-meter diameter telescope located at 17,000 feet (5,200 meters) on Cerro Toco in the Andes Mountains of northern Chile. The next generation Advanced ACT (AdvACT) experiment is currently underway and will consist of three multichroic TES bolometer arrays operating together, totaling 5800 detectors on the sky. Each array will be sensitive to two frequency bands: a high frequency (HF) array at 150 and 230 GHz, two middle frequency (MF) arrays at 90 and 150 GHz, and a low frequency (LF) array at 28 and 41 GHz. The AdACT detector arrays will feature a revamped design when compared to ACTPol, including a transition to 150mm wafers equipped with multichroic pixels, allowing for a more densely packed focal plane. Each set of detectors consists of a feedhorn array of stacked silicon wafers which form a corrugated profile leading to each pixel. This is then followed by a four-piece detector stack assembly of silicon wafers which includes a waveguide interface plate, detector wafer, backshort cavity plate, and backshort cap. Each array is housed in a custom designed structure manufactured out of gold-plated, high purity copper. In addition to the detector array assembly, the array package also encloses the majority of our readout electronics. We present the full mechanical design of the AdvACT HF and MF detector array packages along with a detailed look at the detector array assemblies. We also highlight the use of continuously rotating warm half-wave plates (HWPs) at the front of the AdvACT receiver. We review the design of the rotation system and also early pipeline data analysis results. This experiment will also make use of extensive hardware and software previously developed for ACT, which will be modified to incorporate the new AdvACT instruments. Therefore, we discuss the integration of all AdvACT instruments with pre-existing ACTPol infrastructure.

  1. XAPiir: A recursive digital filtering package

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Harris, D.

    1990-09-21

    XAPiir is a basic recursive digital filtering package, containing both design and implementation subroutines. XAPiir was developed for the experimental array processor (XAP) software package, and is written in FORTRAN. However, it is intended to be incorporated into any general- or special-purpose signal analysis program. It replaces the older package RECFIL, offering several enhancements. RECFIL is used in several large analysis programs developed at LLNL, including the seismic analysis package SAC, several expert systems (NORSEA and NETSEA), and two general purpose signal analysis packages (SIG and VIEW). This report is divided into two sections: the first describes the use ofmore » the subroutine package, and the second, its internal organization. In the first section, the filter design problem is briefly reviewed, along with the definitions of the filter design parameters and their relationship to the subroutine input parameters. In the second section, the internal organization is documented to simplify maintenance and extensions to the package. 5 refs., 9 figs.« less

  2. Size Distribution of Genesis Solar Wind Array Collector Fragments Recovered

    NASA Technical Reports Server (NTRS)

    Allton, J. H.; Stansbery, E. K.; McNamara, K. M.

    2005-01-01

    Genesis launched in 2001 with 271 whole and 30 half hexagonally-shaped collectors mounted on 5 arrays, comprised of 9 materials described in [1]. The array collectors were damaged during re-entry impact in Utah in 2004 [2], breaking into many smaller pieces and dust. A compilation of the number and approximate size of the fragments recovered was compiled from notes made during the field packaging performed in the Class 10,000 cleanroom at Utah Test and Training Range [3].

  3. Method for Fabricating and Packaging an M.Times.N Phased-Array Antenna

    NASA Technical Reports Server (NTRS)

    Xu, Xiaochuan (Inventor); Chen, Yihong (Inventor); Chen, Ray T. (Inventor); Subbaraman, Harish (Inventor)

    2017-01-01

    A method for fabricating an M.times.N, P-bit phased-array antenna on a flexible substrate is disclosed. The method comprising ink jet printing and hardening alignment marks, antenna elements, transmission lines, switches, an RF coupler, and multilayer interconnections onto the flexible substrate. The substrate of the M.times.N, P-bit phased-array antenna may comprise an integrated control circuit of printed electronic components such as, photovoltaic cells, batteries, resistors, capacitors, etc. Other embodiments are described and claimed.

  4. Electrode array for neural stimulation

    DOEpatents

    Wessendorf, Kurt O [Albuquerque, NM; Okandan, Murat [Edgewood, NM; Stein, David J [Albuquerque, NM; Yang, Pin [Albuquerque, NM; Cesarano, III, Joseph; Dellinger, Jennifer [Albuquerque, NM

    2011-08-16

    An electrode array for neural stimulation is disclosed which has particular applications for use in a retinal prosthesis. The electrode array can be formed as a hermetically-sealed two-part ceramic package which includes an electronic circuit such as a demultiplexer circuit encapsulated therein. A relatively large number (up to 1000 or more) of individually-addressable electrodes are provided on a curved surface of a ceramic base portion the electrode array, while a much smaller number of electrical connections are provided on a ceramic lid of the electrode array. The base and lid can be attached using a metal-to-metal seal formed by laser brazing. Electrical connections to the electrode array can be provided by a flexible ribbon cable which can also be used to secure the electrode array in place.

  5. R classes and methods for SNP array data.

    PubMed

    Scharpf, Robert B; Ruczinski, Ingo

    2010-01-01

    The Bioconductor project is an "open source and open development software project for the analysis and comprehension of genomic data" (1), primarily based on the R programming language. Infrastructure packages, such as Biobase, are maintained by Bioconductor core developers and serve several key roles to the broader community of Bioconductor software developers and users. In particular, Biobase introduces an S4 class, the eSet, for high-dimensional assay data. Encapsulating the assay data as well as meta-data on the samples, features, and experiment in the eSet class definition ensures propagation of the relevant sample and feature meta-data throughout an analysis. Extending the eSet class promotes code reuse through inheritance as well as interoperability with other R packages and is less error-prone. Recently proposed class definitions for high-throughput SNP arrays extend the eSet class. This chapter highlights the advantages of adopting and extending Biobase class definitions through a working example of one implementation of classes for the analysis of high-throughput SNP arrays.

  6. Hermetic electronics package with dual-sided electrical feedthrough configuration

    DOEpatents

    Shah, Kedar G.; Pannu, Satinderpall S.

    2016-11-22

    A hermetic electronics package includes a metal case with opposing first and second open ends, with each end connected to a first feedthrough construction and a second feedthrough construction. Each feedthrough contruction has an electrically insulating substrate and an array of electrically conductive feedthroughs extending therethrough, with the electrically insulating substrates connected to the opposing first and second open ends, respectively, of the metal case so as to form a hermetically sealed enclosure. A set of electronic components are located within the hermetically sealed enclosure and are operably connected to the feedthroughs of the first and second feedthrough constructions so as to electrically communicate outside the package from opposite sides of the package.

  7. Physics of Failure Analysis of Xilinx Flip Chip CCGA Packages: Effects of Mission Environments on Properties of LP2 Underfill and ATI Lid Adhesive Materials

    NASA Technical Reports Server (NTRS)

    Suh, Jong-ook

    2013-01-01

    The Xilinx Virtex 4QV and 5QV (V4 and V5) are next-generation field-programmable gate arrays (FPGAs) for space applications. However, there have been concerns within the space community regarding the non-hermeticity of V4/V5 packages; polymeric materials such as the underfill and lid adhesive will be directly exposed to the space environment. In this study, reliability concerns associated with the non-hermeticity of V4/V5 packages were investigated by studying properties and behavior of the underfill and the lid adhesvie materials used in V4/V5 packages.

  8. Development of an Ultra-Wideband Receiver for the North America Array

    NASA Astrophysics Data System (ADS)

    Velazco, J. E.; Soriano, M.; Hoppe, D.; Russell, D.; D'Addario, L.; Long, E.; Bowen, J.; Samoska, L.; Lazio, J.

    2016-11-01

    The North America Array (NAA) is a concept for a radio astronomical interferometric array operating in the 1.2 GHz to 116 GHz frequency range. It has been designed to provide substantial improvements in sensitivity, angular resolution, and frequency coverage beyond the current Karl G. Jansky Very Large Array (VLA). It will have a continuous frequency coverage of 1.2 GHz to 50 GHz and 70 to 116 GHz, and a total aperture 10 times more sensitive than the VLA (and 25 times more sensitive than a 34-m-diameter antenna of the Deep Space Network [DSN]). One of the key goals for the NAA is to reduce the operating costs without sacrificing performance. We are designing an ultra-wideband receiver package designed to operate across the 8 to 48 GHz frequency range in contrast to the current VLA, which covers this frequency range with five receiver packages. Reducing the number of receiving systems required to cover the full frequency range would reduce operating costs. To minimize implementation, operational, and maintenance costs, we are developing a receiver that is compact, simple to assemble, and that consumes less power. The objective of this work is to develop a prototype integrated feed-receiver package with a sensitivity performance comparable to current narrower-band systems on radio telescopes and the DSN, but with a design that meets the requirement of low long-term operational costs. The ultra-wideband receiver package consists of a feedhorn, low-noise amplifier (LNA), and downconverters to analog intermediate frequencies. Both the feedhorn and the LNA are cryogenically cooled. Key features of this design are a quad-ridge feedhorn with dielectric loading and a cryogenic receiver with a noise temperature of no more than 30°K at the low end of the band. In this article, we report on the status of this receiver package development, including the feed design and LNA implementation. We present simulation studies of the feed horn carried out to optimize illumination efficiencies across the band of interest. In addition, we show experimental results of low-noise 70-nm gallium arsenide, metamorphic high-electron-mobility-transistor (HEMT) amplifier testing performed across the 1 to 18 GHz frequency range. Also presented are 8 to 48 GHz simulation results for 35-nm indium phosphide HEMT amplifiers.

  9. Skylab

    NASA Image and Video Library

    1973-09-01

    This Earth Resource Experiment Package (EREP) photograph of the Uncompahgre area of Colorado was electronically acquired in September of 1973 by the Multi-spectral Scarner, Skylab Experiment S192. EREP images were used to analyze the vegetation conditions and landscape characteristic of this area. Skylab's Earth sensors played the dual roles of gathering information about the planet and perfecting instruments and techniques for future satellites and manned stations. An array of six fixed cameras, another for high resolution, and the astronauts' handheld cameras photographed surface features. Other instruments, recording on magnetic tape, measured the reflectivity of plants, soils, and water. Radar measured the altitude of land and water surfaces. The sensors' objectives were to survey croplands and forests, identify soils and rock types, map natural features and urban developments, detect sediments and the spread of pollutants, study clouds and the sea, and determine the extent of snow and ice cover.

  10. Very large scale heterogeneous integration (VLSHI) and wafer-level vacuum packaging for infrared bolometer focal plane arrays

    NASA Astrophysics Data System (ADS)

    Forsberg, Fredrik; Roxhed, Niclas; Fischer, Andreas C.; Samel, Björn; Ericsson, Per; Hoivik, Nils; Lapadatu, Adriana; Bring, Martin; Kittilsland, Gjermund; Stemme, Göran; Niklaus, Frank

    2013-09-01

    Imaging in the long wavelength infrared (LWIR) range from 8 to 14 μm is an extremely useful tool for non-contact measurement and imaging of temperature in many industrial, automotive and security applications. However, the cost of the infrared (IR) imaging components has to be significantly reduced to make IR imaging a viable technology for many cost-sensitive applications. This paper demonstrates new and improved fabrication and packaging technologies for next-generation IR imaging detectors based on uncooled IR bolometer focal plane arrays. The proposed technologies include very large scale heterogeneous integration for combining high-performance, SiGe quantum-well bolometers with electronic integrated read-out circuits and CMOS compatible wafer-level vacuum packing. The fabrication and characterization of bolometers with a pitch of 25 μm × 25 μm that are arranged on read-out-wafers in arrays with 320 × 240 pixels are presented. The bolometers contain a multi-layer quantum well SiGe thermistor with a temperature coefficient of resistance of -3.0%/K. The proposed CMOS compatible wafer-level vacuum packaging technology uses Cu-Sn solid-liquid interdiffusion (SLID) bonding. The presented technologies are suitable for implementation in cost-efficient fabless business models with the potential to bring about the cost reduction needed to enable low-cost IR imaging products for industrial, security and automotive applications.

  11. Multi-Material ALE with AMR for Modeling Hot Plasmas and Cold Fragmenting Materials

    NASA Astrophysics Data System (ADS)

    Alice, Koniges; Nathan, Masters; Aaron, Fisher; David, Eder; Wangyi, Liu; Robert, Anderson; David, Benson; Andrea, Bertozzi

    2015-02-01

    We have developed a new 3D multi-physics multi-material code, ALE-AMR, which combines Arbitrary Lagrangian Eulerian (ALE) hydrodynamics with Adaptive Mesh Refinement (AMR) to connect the continuum to the microstructural regimes. The code is unique in its ability to model hot radiating plasmas and cold fragmenting solids. New numerical techniques were developed for many of the physics packages to work efficiently on a dynamically moving and adapting mesh. We use interface reconstruction based on volume fractions of the material components within mixed zones and reconstruct interfaces as needed. This interface reconstruction model is also used for void coalescence and fragmentation. A flexible strength/failure framework allows for pluggable material models, which may require material history arrays to determine the level of accumulated damage or the evolving yield stress in J2 plasticity models. For some applications laser rays are propagating through a virtual composite mesh consisting of the finest resolution representation of the modeled space. A new 2nd order accurate diffusion solver has been implemented for the thermal conduction and radiation transport packages. One application area is the modeling of laser/target effects including debris/shrapnel generation. Other application areas include warm dense matter, EUV lithography, and material wall interactions for fusion devices.

  12. Ada (Trademark) Case Studies II.

    DTIC Science & Technology

    1984-01-01

    number ( CSN ) in that character set’s "transmission identifier". The array is named START CSN , but a better name would be STARTOFCSN. The word of...protocols), CSN (Channel Sequence Number), EON (End of Message), LMF (Line Media Format), MCB (Message Control Block), RI (Routing Indicator), and TI...component names should end with -PART, - FIELD , or COMPONENT.El - Package names should end with PACKAGE. - Enumeration literals should have suffixes

  13. Thermally Stabilized Transmit/Receive Modules

    NASA Technical Reports Server (NTRS)

    Hoffman, James; DelCastillo, Linda; Miller, Jennifer; Birur, Gaj

    2011-01-01

    RF-hybrid technologies enable smaller packaging and mass reduction in radar instruments, especially for subsystems with dense electronics, such as electronically steered arrays. We are designing thermally stabilized RF-hybrid T/R modules using new materials for improved thermal performance of electronics. We are combining advanced substrate and housing materials with a thermal reservoir material, and develop new packaging techniques to significantly improve thermal-cycling reliability and performance stability over temperature.

  14. Synthesis of a large communications aperture using small antennas

    NASA Technical Reports Server (NTRS)

    Resch, George M.; Cwik, T. W.; Jamnejad, V.; Logan, R. T.; Miller, R. B.; Rogstad, Dave H.

    1994-01-01

    In this report we compare the cost of an array of small antennas to that of a single large antenna assuming both the array and single large antenna have equal performance and availability. The single large antenna is taken to be one of the 70-m antennas of the Deep Space Network. The cost of the array is estimated as a function of the array element diameter for three different values of system noise temperature corresponding to three different packaging schemes for the first amplifier. Array elements are taken to be fully steerable paraboloids and their cost estimates were obtained from commercial vendors. Array loss mechanisms and calibration problems are discussed. For array elements in the range 3 - 35 m there is no minimum in the cost versus diameter curve for the three system temperatures that were studied.

  15. Design and Performance of a Miniature Radar L-Band Transceiver

    NASA Technical Reports Server (NTRS)

    McWatters, D.; Price, D.; Edelstein, W.

    2004-01-01

    Radar electronics developed for past JPL space missions historically had been custom designed and as such, given budgetary, time, and risk constraints, had not been optimized for maximum flexibility or miniaturization. To help reduce cost and risk of future radar missions, a generic radar module was conceived. The module includes a 1.25-GHz (L-band) transceiver and incorporates miniature high-density packaging of integrated circuits in die/chip form. The technology challenges include overcoming the effect of miniaturization and high packaging density to achieve the performance, reliability, and environmental ruggedness required for space missions. The module was chosen to have representative (generic) functionality most likely required from an L-band radar. For very large aperture phased-array spaceborne radar missions, the large dimensions of the array suggest the benefit of distributing the radar electronics into the antenna array. For such applications, this technology is essential in order to bring down the cost, mass, and power of the radar electronics module replicated in each panel of the array. For smaller sized arrays, a single module can be combined with the central radar controller and still provide the bene.ts of configuration .exibility, low power, and low mass. We present the design approach for the radar electronics module and the test results for its radio frequency (RF) portion: a miniature, low-power, radiation-hard L-band transceiver.

  16. BeadArray Expression Analysis Using Bioconductor

    PubMed Central

    Ritchie, Matthew E.; Dunning, Mark J.; Smith, Mike L.; Shi, Wei; Lynch, Andy G.

    2011-01-01

    Illumina whole-genome expression BeadArrays are a popular choice in gene profiling studies. Aside from the vendor-provided software tools for analyzing BeadArray expression data (GenomeStudio/BeadStudio), there exists a comprehensive set of open-source analysis tools in the Bioconductor project, many of which have been tailored to exploit the unique properties of this platform. In this article, we explore a number of these software packages and demonstrate how to perform a complete analysis of BeadArray data in various formats. The key steps of importing data, performing quality assessments, preprocessing, and annotation in the common setting of assessing differential expression in designed experiments will be covered. PMID:22144879

  17. Advancements of ultra-high peak power laser diode arrays

    NASA Astrophysics Data System (ADS)

    Crawford, D.; Thiagarajan, P.; Goings, J.; Caliva, B.; Smith, S.; Walker, R.

    2018-02-01

    Enhancements of laser diode epitaxy in conjunction with process and packaging improvements have led to the availability of 1cm bars capable of over 500W peak power at near-infrared wavelengths (770nm to 1100nm). Advances in cooler design allow for multi-bar stacks with bar-to-bar pitches as low as 350μm and a scalable package architecture enabled a single diode assembly with total peak powers of over 1MegaWatt of peak power. With the addition of micro-optics, overall array brightness greater than 10kW/cm2 was achieved. Performance metrics of barbased diode lasers specifically engineered for high peak power and high brightness at wavelengths and pulse conditions commonly used to pump a variety of fiber and solid-state materials are presented.

  18. PEP solar array definition study

    NASA Technical Reports Server (NTRS)

    1979-01-01

    The power extension package (PEP) is a solar array system that will be used on the space transportation system to augment the power of the Orbiter vehicle and to extend the time the vehicle may stay in orbit. The baseline configuration of the PEP is reviewed. The programmatic aspects of the design covering the development plan, the manufacturing facility plan and the estimated costs and risks are presented.

  19. Recent advances in superconducting nanowire single photon detectors for single-photon imaging

    NASA Astrophysics Data System (ADS)

    Verma, V. B.; Allman, M. S.; Stevens, M.; Gerrits, T.; Horansky, R. D.; Lita, A. E.; Marsili, F.; Beyer, A.; Shaw, M. D.; Stern, J. A.; Mirin, R. P.; Nam, S. W.

    2016-05-01

    We demonstrate a 64-pixel free-space-coupled array of superconducting nanowire single photon detectors optimized for high detection efficiency in the near-infrared range. An integrated, readily scalable, multiplexed readout scheme is employed to reduce the number of readout lines to 16. The cryogenic, optical, and electronic packaging to read out the array, as well as characterization measurements are discussed.

  20. ActiveSeismoPick3D - automatic first arrival determination for large active seismic arrays

    NASA Astrophysics Data System (ADS)

    Paffrath, Marcel; Küperkoch, Ludger; Wehling-Benatelli, Sebastian; Friederich, Wolfgang

    2016-04-01

    We developed a tool for automatic determination of first arrivals in active seismic data based on an approach, that utilises higher order statistics (HOS) and the Akaike information criterion (AIC), commonly used in seismology, but not in active seismics. Automatic picking is highly desirable in active seismics as the number of data provided by large seismic arrays rapidly exceeds of what an analyst can evaluate in a reasonable amount of time. To bring the functionality of automatic phase picking into the context of active data, the software package ActiveSeismoPick3D was developed in Python. It uses a modified algorithm for the determination of first arrivals which searches for the HOS maximum in unfiltered data. Additionally, it offers tools for manual quality control and postprocessing, e.g. various visualisation and repicking functionalities. For flexibility, the tool also includes methods for the preparation of geometry information of large seismic arrays and improved interfaces to the Fast Marching Tomography Package (FMTOMO), which can be used for the prediction of travel times and inversion for subsurface properties. Output files are generated in the VTK format, allowing the 3D visualization of e.g. the inversion results. As a test case, a data set consisting of 9216 traces from 64 shots was gathered, recorded at 144 receivers deployed in a regular 2D array of a size of 100 x 100 m. ActiveSeismoPick3D automatically checks the determined first arrivals by a dynamic signal to noise ratio threshold. From the data a 3D model of the subsurface was generated using the export functionality of the package and FMTOMO.

  1. High duty cycle hard soldered kilowatt laser diode arrays

    NASA Astrophysics Data System (ADS)

    Klumel, Genady; Karni, Yoram; Oppenheim, Jacob; Berk, Yuri; Shamay, Moshe; Tessler, Renana; Cohen, Shalom

    2010-02-01

    High-brightness laser diode arrays operating at a duty cycle of 10% - 20% are in ever-increasing demand for the optical pumping of solid state lasers and directed energy applications. Under high duty-cycle operation at 10% - 20%, passive (conductive) cooling is of limited use, while micro-coolers using de-ionized cooling water can considerably degrade device reliability. When designing and developing actively-cooled collimated laser diode arrays for high duty cycle operation, three main problems should be carefully addressed: an effective local and total heat removal, a minimization of packaging-induced and operational stresses, and high-precision fast axis collimation. In this paper, we present a novel laser diode array incorporating a built-in tap water cooling system, all-hard-solder bonded assembly, facet-passivated high-power 940 nm laser bars and tight fast axis collimation. By employing an appropriate layout of water cooling channels, careful choice of packaging materials, proper design of critical parts, and active optics alignment, we have demonstrated actively-cooled collimated laser diode arrays with extended lifetime and reliability, without compromising their efficiency, optical power density, brightness or compactness. Among the key performance benchmarks achieved are: 150 W/bar optical peak power at 10% duty cycle, >50% wallplug efficiency and <1° collimated fast axis divergence. A lifetime of >0.5 Ghots with <2% degradation has been experimentally proven. The laser diode arrays have also been successfully tested under harsh environmental conditions, including thermal cycling between -20°C and 40°C and mechanical shocks at 500g acceleration. The results of both performance and reliability testing bear out the effectiveness and robustness of the manufacturing technology for high duty-cycle laser arrays.

  2. Monte Carlo studies of medium-size telescope designs for the Cherenkov Telescope Array

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Wood, M. D.; Jogler, T.; Dumm, J.

    In this paper, we present studies for optimizing the next generation of ground-based imaging atmospheric Cherenkov telescopes (IACTs). Results focus on mid-sized telescopes (MSTs) for CTA, detecting very high energy gamma rays in the energy range from a few hundred GeV to a few tens of TeV. We describe a novel, flexible detector Monte Carlo package, FAST (FAst Simulation for imaging air cherenkov Telescopes), that we use to simulate different array and telescope designs. The simulation is somewhat simplified to allow for efficient exploration over a large telescope design parameter space. We investigate a wide range of telescope performance parametersmore » including optical resolution, camera pixel size, and light collection area. In order to ensure a comparison of the arrays at their maximum sensitivity, we analyze the simulations with the most sensitive techniques used in the field, such as maximum likelihood template reconstruction and boosted decision trees for background rejection. Choosing telescope design parameters representative of the proposed Davies–Cotton (DC) and Schwarzchild–Couder (SC) MST designs, we compare the performance of the arrays by examining the gamma-ray angular resolution and differential point-source sensitivity. We further investigate the array performance under a wide range of conditions, determining the impact of the number of telescopes, telescope separation, night sky background, and geomagnetic field. We find a 30–40% improvement in the gamma-ray angular resolution at all energies when comparing arrays with an equal number of SC and DC telescopes, significantly enhancing point-source sensitivity in the MST energy range. Finally, we attribute the increase in point-source sensitivity to the improved optical point-spread function and smaller pixel size of the SC telescope design.« less

  3. Monte Carlo studies of medium-size telescope designs for the Cherenkov Telescope Array

    DOE PAGES

    Wood, M. D.; Jogler, T.; Dumm, J.; ...

    2015-06-07

    In this paper, we present studies for optimizing the next generation of ground-based imaging atmospheric Cherenkov telescopes (IACTs). Results focus on mid-sized telescopes (MSTs) for CTA, detecting very high energy gamma rays in the energy range from a few hundred GeV to a few tens of TeV. We describe a novel, flexible detector Monte Carlo package, FAST (FAst Simulation for imaging air cherenkov Telescopes), that we use to simulate different array and telescope designs. The simulation is somewhat simplified to allow for efficient exploration over a large telescope design parameter space. We investigate a wide range of telescope performance parametersmore » including optical resolution, camera pixel size, and light collection area. In order to ensure a comparison of the arrays at their maximum sensitivity, we analyze the simulations with the most sensitive techniques used in the field, such as maximum likelihood template reconstruction and boosted decision trees for background rejection. Choosing telescope design parameters representative of the proposed Davies–Cotton (DC) and Schwarzchild–Couder (SC) MST designs, we compare the performance of the arrays by examining the gamma-ray angular resolution and differential point-source sensitivity. We further investigate the array performance under a wide range of conditions, determining the impact of the number of telescopes, telescope separation, night sky background, and geomagnetic field. We find a 30–40% improvement in the gamma-ray angular resolution at all energies when comparing arrays with an equal number of SC and DC telescopes, significantly enhancing point-source sensitivity in the MST energy range. Finally, we attribute the increase in point-source sensitivity to the improved optical point-spread function and smaller pixel size of the SC telescope design.« less

  4. Use of optical technique for inspection of warpage of IC packages

    NASA Astrophysics Data System (ADS)

    Toh, Siew-Lok; Chau, Fook S.; Ong, Sim Heng

    2001-06-01

    The packaging of IC packages has changed over the years, form dual-in-line, wire-bond, and pin-through-hole in printed wiring board technologies in the 1970s to ball grid array, chip scale and surface mount technologies in the 1990s. Reliability has been a big problem for manufacturers for some moisture-sensitive packages. One of the potential problems in plastic IC packages is moisture-induced popcorn effect which can arise during the reflow process. Shearography is a non-destructive inspection technique that may be used to detect the delamination and warpage of IC packages. It is non-contacting and permits a full-field observation of surface displacement derivatives. Another advantage of this technique is that it is able to give the real-time formation of the fringes which indicate flaws in the IC package under real-time simulation condition of Surface Mount Technology (SMT) IR reflow profile. It is extremely fast and convenient to study the true behavior of the packaging deformation during the SMT process. It can be concluded that shearography has the potential for the real- time detection, in situ and non-destructive inspection of IC packages during the surface mount process.

  5. Precise annealing of focal plane arrays for optical detection

    DOEpatents

    Bender, Daniel A.

    2015-09-22

    Precise annealing of identified defective regions of a Focal Plane Array ("FPA") (e.g., exclusive of non-defective regions of the FPA) facilitates removal of defects from an FPA that has been hybridized and/or packaged with readout electronics. Radiation is optionally applied under operating conditions, such as under cryogenic temperatures, such that performance of an FPA can be evaluated before, during, and after annealing without requiring thermal cycling.

  6. Precise annealing of focal plane arrays for optical detection

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Bender, Daniel A.

    2017-10-17

    Precise annealing of identified defective regions of a Focal Plane Array ("FPA") (e.g., exclusive of non-defective regions of the FPA) facilitates removal of defects from an FPA that has been hybridized and/or packaged with readout electronics. Radiation is optionally applied under operating conditions, such as under cryogenic temperatures, such that performance of an FPA can be evaluated before, during, and after annealing without requiring thermal cycling.

  7. Navy Virginia (SSN-774) Class Attack Submarine Procurement: Background and Issues for Congress

    DTIC Science & Technology

    2010-07-30

    conformal acoustic velocity sensor wide aperture array (CAVES WAA), and a flexible payload sail. AESR is a software package comprised of two systems...when they are modernized. CAVES WAA is a sensor array that is designed to detect the vibrations and acoustic signatures of targets. The Navy has...require reliability improvements (Active Shaft Grounding System, Circuit D, Ship Service Turbine Generator magnetic levitation bearings / throttle

  8. affy2sv: an R package to pre-process Affymetrix CytoScan HD and 750K arrays for SNP, CNV, inversion and mosaicism calling.

    PubMed

    Hernandez-Ferrer, Carles; Quintela Garcia, Ines; Danielski, Katharina; Carracedo, Ángel; Pérez-Jurado, Luis A; González, Juan R

    2015-05-20

    The well-known Genome-Wide Association Studies (GWAS) had led to many scientific discoveries using SNP data. Even so, they were not able to explain the full heritability of complex diseases. Now, other structural variants like copy number variants or DNA inversions, either germ-line or in mosaicism events, are being studies. We present the R package affy2sv to pre-process Affymetrix CytoScan HD/750k array (also for Genome-Wide SNP 5.0/6.0 and Axiom) in structural variant studies. We illustrate the capabilities of affy2sv using two different complete pipelines on real data. The first one performing a GWAS and a mosaic alterations detection study, and the other detecting CNVs and performing an inversion calling. Both examples presented in the article show up how affy2sv can be used as part of more complex pipelines aimed to analyze Affymetrix SNP arrays data in genetic association studies, where different types of structural variants are considered.

  9. Protection of microelectronic devices during packaging

    DOEpatents

    Peterson, Kenneth A.; Conley, William R.

    2002-01-01

    The present invention relates to a method of protecting a microelectronic device during device packaging, including the steps of applying a water-insoluble, protective coating to a sensitive area on the device; performing at least one packaging step; and then substantially removing the protective coating, preferably by dry plasma etching. The sensitive area can include a released MEMS element. The microelectronic device can be disposed on a wafer. The protective coating can be a vacuum vapor-deposited parylene polymer, silicon nitride, metal (e.g. aluminum or tungsten), a vapor deposited organic material, cynoacrylate, a carbon film, a self-assembled monolayered material, perfluoropolyether, hexamethyldisilazane, or perfluorodecanoic carboxylic acid, silicon dioxide, silicate glass, or combinations thereof. The present invention also relates to a method of packaging a microelectronic device, including: providing a microelectronic device having a sensitive area; applying a water-insoluble, protective coating to the sensitive area; providing a package; attaching the device to the package; electrically interconnecting the device to the package; and substantially removing the protective coating from the sensitive area.

  10. Temporary coatings for protection of microelectronic devices during packaging

    DOEpatents

    Peterson, Kenneth A.; Conley, William R.

    2005-01-18

    The present invention relates to a method of protecting a microelectronic device during device packaging, including the steps of applying a water-insoluble, temporary protective coating to a sensitive area on the device; performing at least one packaging step; and then substantially removing the protective coating, preferably by dry plasma etching. The sensitive area can include a released MEMS element. The microelectronic device can be disposed on a wafer. The protective coating can be a vacuum vapor-deposited parylene polymer, silicon nitride, metal (e.g. aluminum or tungsten), a vapor deposited organic material, cynoacrylate, a carbon film, a self-assembled monolayered material, perfluoropolyether, hexamethyldisilazane, or perfluorodecanoic carboxylic acid, silicon dioxide, silicate glass, or combinations thereof. The present invention also relates to a method of packaging a microelectronic device, including: providing a microelectronic device having a sensitive area; applying a water-insoluble, protective coating to the sensitive area; providing a package; attaching the device to the package; electrically interconnecting the device to the package; and substantially removing the protective coating from the sensitive area.

  11. The design and development of a space laboratory to conduct magnetospheric and plasma research

    NASA Technical Reports Server (NTRS)

    Rosen, A.

    1974-01-01

    A design study was conducted concerning a proposed shuttle-borne space laboratory for research on magnetospheric and plasma physics. A worldwide survey found two broad research disciplines of interest: geophysical studies of the dynamics and structure of the magnetosphere (including wave characteristics, wave-particle interactions, magnetospheric modifications, beam-plasma interactions, and energetic particles and tracers) and plasma physics studies (plasma physics in space, wake and sheath studies, and propulsion and devices). The Plasma Physics and Environmental Perturbation Laboratory (PPEPL) designed to perform experiments in these areas will include two 50-m booms and two maneuverable subsatellites, a photometer array, standardized proton, electron, and plasma accelerators, a high-powered transmitter for frequencies above 100 kHz, a low-power transmitter for VLF and below, and complete diagnostic packages. Problem areas in the design of a space plasma physics laboratory are indicated.

  12. Complete indium-free CW 200W passively cooled high power diode laser array using double-side cooling technology

    NASA Astrophysics Data System (ADS)

    Wang, Jingwei; Zhu, Pengfei; Liu, Hui; Liang, Xuejie; Wu, Dihai; Liu, Yalong; Yu, Dongshan; Zah, Chung-en; Liu, Xingsheng

    2017-02-01

    High power diode lasers have been widely used in many fields. To meet the requirements of high power and high reliability, passively cooled single bar CS-packaged diode lasers must be robust to withstand thermal fatigue and operate long lifetime. In this work, a novel complete indium-free double-side cooling technology has been applied to package passively cooled high power diode lasers. Thermal behavior of hard solder CS-package diode lasers with different packaging structures was simulated and analyzed. Based on these results, the device structure and packaging process of double-side cooled CS-packaged diode lasers were optimized. A series of CW 200W 940nm high power diode lasers were developed and fabricated using hard solder bonding technology. The performance of the CW 200W 940nm high power diode lasers, such as output power, spectrum, thermal resistance, near field, far field, smile, lifetime, etc., is characterized and analyzed.

  13. Aeroflex Technology as Class-Y Demonstrator

    NASA Technical Reports Server (NTRS)

    Suh, Jong-ook; Agarwal, Shri; Popelar, Scott

    2014-01-01

    Modern space field programmable gate array (FPGA) devices with increased functional density and operational frequency, such as Xilinx Virtex 4 (V4) and S (V5), are packaged in non-hermetic ceramic flip chip forms. These next generation space parts were not qualified to the MIL-PRF-38535 Qualified Manufacturer Listing (QML) class-V when they were released because class-V was only intended for hermetic parts. In order to bring Xilinx V5 type packages into the QML system, it was suggested that class-Y be set up as a new category. From 2010 through 2014, a JEDEC G12 task group developed screening and qualification requirements for Class-Y products. The Document Standardization Division of the Defense Logistics Agency (DLA) has completed an engineering practice study. In parallel with the class-Y efforts, the NASA Electronic Parts and Packaging (NEPP) program has funded JPL to study potential reliability issues of the class-Y products. The major hurdle of this task was the absence of adequate research samples. Figure 1-1 shows schematic diagrams of typical structures of class-Y type products. Typically, class-Y products are either in ceramic flip chip column grid array (CGA) or land grid array (LGA) form. In class-Y packages, underfill and heat spread adhesive materials are directly exposed to the spacecraft environment due to their non-hermeticity. One of the concerns originally raised was that the underfill material could degrade due to the spacecraft environment and negatively impact the reliability of the package. In order to study such issues, it was necessary to use ceramic daisy chain flip chip package samples so that continuity of flip chip solder bumps could be monitored during the reliability tests. However, none of the commercially available class-Y daisy chain parts had electrical connections through flip chip solder bumps; only solder columns were daisy chained, which made it impossible to test continuity of flip chip solder bumps without using extremely costly functional parts. Among space parts manufacturers who were interested in producing class-Y products, Aeroflex Microelectronic Solutions-HiRel had been developing assembly processes using their internal R&D classy type samples. In early 2012, JPL and Aeroflex initiated a collaboration to study reliability of the Aeroflex technology as a class-Y demonstrator.

  14. Power Extension Package (PEP) system definition extension, orbital service module systems analysis study. Volume 1: Executive summary

    NASA Technical Reports Server (NTRS)

    1979-01-01

    An array deployment assembly, power regulation and control assembly, the necessary interface, and display and control equipment comprise the power extension package (PEP) which is designed to provide increased power and duration, as well as reduce fuel cell cryogen consumption during Spacelab missions. Compatible with all currently defined missions and payloads, PEP imposes minimal weight and volume penalties on sortie missions, and can be installed and removed as needed at the launch site within the normal Orbiter turnaround cycle. The technology on which it is based consists of a modified solar electric propulsion array, standard design regulator and control equipment, and a minimally modified Orbiter design. The requirements from which PEP was derived, and the system and its performance capabilities are described. Features of the recommended project are presented.

  15. Autonomous microexplosives subsurface tracing system final report.

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Engler, Bruce Phillip; Nogan, John; Melof, Brian Matthew

    The objective of the autonomous micro-explosive subsurface tracing system is to image the location and geometry of hydraulically induced fractures in subsurface petroleum reservoirs. This system is based on the insertion of a swarm of autonomous micro-explosive packages during the fracturing process, with subsequent triggering of the energetic material to create an array of micro-seismic sources that can be detected and analyzed using existing seismic receiver arrays and analysis software. The project included investigations of energetic mixtures, triggering systems, package size and shape, and seismic output. Given the current absence of any technology capable of such high resolution mapping ofmore » subsurface structures, this technology has the potential for major impact on petroleum industry, which spends approximately $1 billion dollar per year on hydraulic fracturing operations in the United States alone.« less

  16. Development of Suitable Technologies for Heterodyne W-Band Focal-Plane Arrays

    NASA Astrophysics Data System (ADS)

    Mena, Patricio; Reyes, N.; Jarufe, C.; Barrueto, I.; Molina, R.; Monasterio, D.; Bronfman, L.

    2018-01-01

    We present the ongoing efforts at University of Chile to develop technologies for heterodyne focal-plane arrays. We have focused in W band covering four areas of study. 1. OPTICAL SYSTEMS: We have studied the possibility of using multi-pixel receivers at ALMA-type antennas. We designed an array of 7 pixels (extensible to 19) that fits into an ALMA cartridge. The design includes a set of mirrors and a fly-eye lens that allows the system to fit on the available space. For the feed, we have studied smooth-wall horns and Vivaldi antennas. 2. COMPACT OMTS: We have been working on turnstile-type OMTs fabricated in platelets that permit integration of several OMTs in the same block. 3. LOW NOISE AMPLIFIERS: We are working on a hybrid concept that uses a single transistor mounted before a commercial MMIC. We have measured noise temperatures lower than 50 K. The aim is to produce compact blocks suitable for integration. 4. DOWNCONVERTING MIXERS: We have designed biased sub-harmonic mixers based on Schottky diodes using MMIC technology and to be fabricated in a commercial run. We expect conversion losses below 15 dB. Mixers and LNA will be packaged in a single block using a 2SB scheme.

  17. Nano-engineered Multiwall Carbon Nanotube-copper Composite Thermal Interface Material for Efficient Heat Conduction

    NASA Technical Reports Server (NTRS)

    Ngo, Quoc; Cruden, Brett A.; Cassell, Alan M.; Sims, Gerard; Li, Jun; Meyyappa, M.; Yang, Cary Y.

    2005-01-01

    Efforts in integrated circuit (IC) packaging technologies have recently been focused on management of increasing heat density associated with high frequency and high density circuit designs. While current flip-chip package designs can accommodate relatively high amounts of heat density, new materials need to be developed to manage thermal effects of next-generation integrated circuits. Multiwall carbon nanotubes (MWNT) have been shown to significantly enhance thermal conduction in the axial direction and thus can be considered to be a candidate for future thermal interface materials by facilitating efficient thermal transport. This work focuses on fabrication and characterization of a robust MWNT-copper composite material as an element in IC package designs. We show that using vertically aligned MWNT arrays reduces interfacial thermal resistance by increasing conduction surface area, and furthermore, the embedded copper acts as a lateral heat spreader to efficiently disperse heat, a necessary function for packaging materials. In addition, we demonstrate reusability of the material, and the absence of residue on the contacting material, both novel features of the MWNT-copper composite that are not found in most state-of-the-art thermal interface materials. Electrochemical methods such as metal deposition and etch are discussed for the creation of the MWNT-Cu composite, detailing issues and observations with using such methods. We show that precise engineering of the composite surface affects the ability of this material to act as an efficient thermal interface material. A thermal contact resistance measurement has been designed to obtain a value of thermal contact resistance for a variety of different thermal contact materials.

  18. Arrays of probes for positional sequencing by hybridization

    DOEpatents

    Cantor, Charles R [Boston, MA; Prezetakiewiczr, Marek [East Boston, MA; Smith, Cassandra L [Boston, MA; Sano, Takeshi [Waltham, MA

    2008-01-15

    This invention is directed to methods and reagents useful for sequencing nucleic acid targets utilizing sequencing by hybridization technology comprising probes, arrays of probes and methods whereby sequence information is obtained rapidly and efficiently in discrete packages. That information can be used for the detection, identification, purification and complete or partial sequencing of a particular target nucleic acid. When coupled with a ligation step, these methods can be performed under a single set of hybridization conditions. The invention also relates to the replication of probe arrays and methods for making and replicating arrays of probes which are useful for the large scale manufacture of diagnostic aids used to screen biological samples for specific target sequences. Arrays created using PCR technology may comprise probes with 5'- and/or 3'-overhangs.

  19. Industrial Base: Contractors Have Ability to Meet Requirements for Rations During Wartime

    DTIC Science & Technology

    1994-08-01

    their pouches. Some assemblers purchase prepackaged items (e.g., crackers or applesauce ) if they lack in-house capacity. Generally, assemblers have...functional staging and packaging areas (e.g., meal pouch staging area, cracker packaging, accessory packaging, and applesauce packaging). Once food and...we requested that they provide us with the current total surge output for I month for each functional area (e.g., crackers, accessories, applesauce

  20. Pilot production and advanced development of large-area picosecond photodetectors

    NASA Astrophysics Data System (ADS)

    Minot, Michael J.; Adams, Bernhard W.; Aviles, Melvin; Bond, Justin L.; Craven, Christopher A.; Cremer, Till; Foley, Michael R.; Lyashenko, Alexey; Popecki, Mark A.; Stochaj, Michael E.; Worstell, William A.; Mane, Anil U.; Elam, Jeffrey W.; Siegmund, Oswald H. W.; Ertley, Camden; Frisch, Henry; Elagin, Andrey

    2016-09-01

    We report pilot production and advanced development performance results achieved for Large Area Picosecond Photodetectors (LAPPD). The LAPPD is a microchannel plate (MCP) based photodetector, capable of imaging with single-photon sensitivity at high spatial and temporal resolutions in a hermetic package with an active area of 400 square centimeters. In December 2015, Incom Inc. completed installation of equipment and facilities for demonstration of early stage pilot production of LAPPD. Initial fabrication trials commenced in January 2016. The "baseline" LAPPD employs an all-glass hermetic package with top and bottom plates and sidewalls made of borosilicate float glass. Signals are generated by a bi-alkali Na2KSb photocathode and amplified with a stacked chevron pair of "next generation" MCPs produced by applying resistive and emissive atomic layer deposition coatings to borosilicate glass capillary array (GCA) substrates. Signals are collected on RF strip-line anodes applied to the bottom plates which exit the detector via pinfree hermetic seals under the side walls. Prior tests show that LAPPDs have electron gains greater than 107, submillimeter space resolution for large pulses and several mm for single photons, time resolutions of 50 picoseconds for single photons, predicted resolution of less than 5 picoseconds for large pulses, high stability versus charge extraction, and good uniformity. LAPPD performance results for product produced during the first half of 2016 will be reviewed. Recent advances in the development of LAPPD will also be reviewed, as the baseline design is adapted to meet the requirements for a wide range of emerging application. These include a novel ceramic package design, ALD coated MCPs optimized to have a low temperature coefficient of resistance (TCR) and further advances to adapt the LAPPD for cryogenic applications using Liquid Argon (LAr). These developments will meet the needs for DOE-supported RD for the Deep Underground Neutrino Experiment (DUNE), nuclear physics applications such as EIC, medical, homeland security and astronomical applications for direct and indirect photon detection.

  1. Dynamic characteristics of far-field radiation of current modulated phase-locked diode laser arrays

    NASA Technical Reports Server (NTRS)

    Elliott, R. A.; Hartnett, K.

    1987-01-01

    A versatile and powerful streak camera/frame grabber system for studying the evolution of the near and far field radiation patterns of diode lasers was assembled and tested. Software needed to analyze and display the data acquired with the steak camera/frame grabber system was written and the total package used to record and perform preliminary analyses on the behavior of two types of laser, a ten emitter gain guided array and a flared waveguide Y-coupled array. Examples of the information which can be gathered with this system are presented.

  2. Real-Time Label-Free Detection of Suspicious Powders Using Noncontact Optical Methods

    DTIC Science & Technology

    2013-11-05

    energy in a small, 1 pound, low power consumption package; and 2) new technology resistive gate linear CCD array detectors developed by Hamamatsu Corp...as a wide range of possible interferent or confusant organic materials such as powdered sugar, granulate sugar, fruit pectin, flower, corn starch ...resolution, room temperature, resistive gate linear CCD array, the BRANE sensor SWAP decreases along with a decrease in sensitivity, but the information

  3. NEPP Update of Independent Single Event Upset Field Programmable Gate Array Testing

    NASA Technical Reports Server (NTRS)

    Berg, Melanie; Label, Kenneth; Campola, Michael; Pellish, Jonathan

    2017-01-01

    This presentation provides a NASA Electronic Parts and Packaging (NEPP) Program update of independent Single Event Upset (SEU) Field Programmable Gate Array (FPGA) testing including FPGA test guidelines, Microsemi RTG4 heavy-ion results, Xilinx Kintex-UltraScale heavy-ion results, Xilinx UltraScale+ single event effect (SEE) test plans, development of a new methodology for characterizing SEU system response, and NEPP involvement with FPGA security and trust.

  4. Accelerated Thermal Cycling and Failure Mechanisms

    NASA Technical Reports Server (NTRS)

    Ghaffarian, R.

    1999-01-01

    This paper reviews the accelerated thermal cycling test methods that are currently used by industry to characterize the interconnect reliability of commercial-off-the-shelf (COTS) ball grid array (BGA) and chip scale package (CSP) assemblies.

  5. Navigation-aid power systems

    NASA Technical Reports Server (NTRS)

    Goltz, G. L.; Kaiser, L. M.; Weiner, H.

    1979-01-01

    Design synthesis and performance analysis (DSPA) program package is collection of subroutines used for computation of design and performance characteristics of viable solar-array-charged battery powered system for flashing-lamp buoys employed as maritime aids to navigation.

  6. Body of Knowledge (BOK) for Leadless Quad Flat No-Lead/bottom Termination Components (QFN/BTC) Package Trends and Reliability

    NASA Technical Reports Server (NTRS)

    Ghaffarian, Reza

    2014-01-01

    Bottom terminated components and quad flat no-lead (BTC/QFN) packages have been extensively used by commercial industry for more than a decade. Cost and performance advantages and the closeness of the packages to the boards make them especially unique for radio frequency (RF) applications. A number of high-reliability parts are now available in this style of package configuration. This report presents a summary of literature surveyed and provides a body of knowledge (BOK) gathered on the status of BTC/QFN and their advanced versions of multi-row QFN (MRQFN) packaging technologies. The report provides a comprehensive review of packaging trends and specifications on design, assembly, and reliability. Emphasis is placed on assembly reliability and associated key design and process parameters because they show lower life than standard leaded package assembly under thermal cycling exposures. Inspection of hidden solder joints for assuring quality is challenging and is similar to ball grid arrays (BGAs). Understanding the key BTC/QFN technology trends, applications, processing parameters, workmanship defects, and reliability behavior is important when judicially selecting and narrowing the follow-on packages for evaluation and testing, as well as for the low risk insertion in high-reliability applications.

  7. Body of Knowledge (BOK) for Leadless Quad Flat No-Lead/Bottom Termination Components (QFN/BTC) Package Trends and Reliability

    NASA Technical Reports Server (NTRS)

    Ghaffarian, Reza

    2014-01-01

    Bottom terminated components and quad flat no-lead (BTC/QFN) packages have been extensively used by commercial industry for more than a decade. Cost and performance advantages and the closeness of the packages to the boards make them especially unique for radio frequency (RF) applications. A number of high-reliability parts are now available in this style of package configuration. This report presents a summary of literature surveyed and provides a body of knowledge (BOK) gathered on the status of BTC/QFN and their advanced versions of multi-row QFN (MRQFN) packaging technologies. The report provides a comprehensive review of packaging trends and specifications on design, assembly, and reliability. Emphasis is placed on assembly reliability and associated key design and process parameters because they show lower life than standard leaded package assembly under thermal cycling exposures. Inspection of hidden solder joints for assuring quality is challenging and is similar to ball grid arrays (BGAs). Understanding the key BTC/QFN technology trends, applications, processing parameters, workmanship defects, and reliability behavior is important when judicially selecting and narrowing the follow-on packages for evaluation and testing, as well as for the low risk insertion in high-reliability applications.

  8. DOE Office of Scientific and Technical Information (OSTI.GOV)

    Adams, B.W.; et al.

    The Large Area Picosecond PhotoDetector (LAPPD) Collaboration was formed in 2009 to develop large-area photodetectors capable of time resolutions measured in pico-seconds, with accompanying sub-millimeter spatial resolution. During the next three and one-half years the Collaboration developed the LAPPD design of 20 x 20 cm modules with gains greater thanmore » $10^7$ and non-uniformity less than $$15\\%$$, time resolution less than 50 psec for single photons and spatial resolution of 700~microns in both lateral dimensions. We describe the R\\&D performed to develop large-area micro-channel plate glass substrates, resistive and secondary-emitting coatings, large-area bialkali photocathodes, and RF-capable hermetic packaging. In addition, the Collaboration developed the necessary electronics for large systems capable of precise timing, built up from a custom low-power 15-GigaSample/sec waveform sampling 6-channel integrated circuit and supported by a two-level modular data acquisition system based on Field-Programmable Gate Arrays for local control, data-sparcification, and triggering. We discuss the formation, organization, and technical successes and short-comings of the Collaboration. The Collaboration ended in December 2012 with a transition from R\\&D to commercialization.« less

  9. A hollow stainless steel microneedle array to deliver insulin to a diabetic rat

    NASA Astrophysics Data System (ADS)

    Vinayakumar, K. B.; Kulkarni, Prachit G.; Nayak, M. M.; Dinesh, N. S.; Hegde, Gopalkrishna M.; Ramachandra, S. G.; Rajanna, K.

    2016-06-01

    A novel fabrication process has been described for the development of a hollow stainless steel microneedle array using femto second laser micromachining. Using this method, a complicated microstructure can be fabricated in a single process step without using masks. The mechanical stability of the fabricated microneedle array was measured for axial and transverse loading. Skin histology was carried out to study the microneedle penetration into the rat skin. Fluid flow through the microneedle array was studied for different inlet pressures. The packaging of the microneedle array, to protect the microneedle bore blockage from dust and other atmospheric contaminations, was also considered. Finally, the microneedle array was tested and studied in vivo for insulin delivery to a diabetic rat. The results obtained were compared with the standard subcutaneous delivery with the same dose rate and were found to be in good agreement.

  10. RELIC: a novel dye-bias correction method for Illumina Methylation BeadChip.

    PubMed

    Xu, Zongli; Langie, Sabine A S; De Boever, Patrick; Taylor, Jack A; Niu, Liang

    2017-01-03

    The Illumina Infinium HumanMethylation450 BeadChip and its successor, Infinium MethylationEPIC BeadChip, have been extensively utilized in epigenome-wide association studies. Both arrays use two fluorescent dyes (Cy3-green/Cy5-red) to measure methylation level at CpG sites. However, performance difference between dyes can result in biased estimates of methylation levels. Here we describe a novel method, called REgression on Logarithm of Internal Control probes (RELIC) to correct for dye bias on whole array by utilizing the intensity values of paired internal control probes that monitor the two color channels. We evaluate the method in several datasets against other widely used dye-bias correction methods. Results on data quality improvement showed that RELIC correction statistically significantly outperforms alternative dye-bias correction methods. We incorporated the method into the R package ENmix, which is freely available from the Bioconductor website ( https://www.bioconductor.org/packages/release/bioc/html/ENmix.html ). RELIC is an efficient and robust method to correct for dye-bias in Illumina Methylation BeadChip data. It outperforms other alternative methods and conveniently implemented in R package ENmix to facilitate DNA methylation studies.

  11. 320 x 240 uncooled IRFPA with pixel wise thin film vacuum packaging

    NASA Astrophysics Data System (ADS)

    Yon, J.-J.; Dumont, G.; Rabaud, W.; Becker, S.; Carle, L.; Goudon, V.; Vialle, C.; Hamelin, A.; Arnaud, A.

    2012-10-01

    Silicon based vacuum packaging is a key enabling technology for achieving affordable uncooled Infrared Focal Plane Arrays (IRFPA) as required by the promising mass market for very low cost IR applications, such as automotive driving assistance, energy loss monitoring in buildings, motion sensors… Among the various approaches studied worldwide, the CEA, LETI is developing a unique technology where each bolometer pixel is sealed under vacuum at the wafer level, using an IR transparent thin film deposition. This technology referred to as PLP (Pixel Level Packaging), leads to an array of hermetic micro-caps each containing a single microbolometer. Since the successful demonstration that the PLP technology, when applied on a single microbolometer pixel, can provide the required vacuum < 10-3 mbar, the authors have pushed forward the development of the technology on fully operational QVGA readout circuits CMOS base wafers (320 x 240 pixels). In this outlook, the article reports on the electro optical performance obtained from this preliminary PLP based QVGA demonstrator. Apart from the response, noise and NETD distributions, the paper also puts emphasis on additional key features such as thermal time constant, image quality, and ageing properties.

  12. Thermal Cycling Life Prediction of Sn-3.0Ag-0.5Cu Solder Joint Using Type-I Censored Data

    PubMed Central

    Mi, Jinhua; Yang, Yuan-Jian; Huang, Hong-Zhong

    2014-01-01

    Because solder joint interconnections are the weaknesses of microelectronic packaging, their reliability has great influence on the reliability of the entire packaging structure. Based on an accelerated life test the reliability assessment and life prediction of lead-free solder joints using Weibull distribution are investigated. The type-I interval censored lifetime data were collected from a thermal cycling test, which was implemented on microelectronic packaging with lead-free ball grid array (BGA) and fine-pitch ball grid array (FBGA) interconnection structures. The number of cycles to failure of lead-free solder joints is predicted by using a modified Engelmaier fatigue life model and a type-I censored data processing method. Then, the Pan model is employed to calculate the acceleration factor of this test. A comparison of life predictions between the proposed method and the ones calculated directly by Matlab and Minitab is conducted to demonstrate the practicability and effectiveness of the proposed method. At last, failure analysis and microstructure evolution of lead-free solders are carried out to provide useful guidance for the regular maintenance, replacement of substructure, and subsequent processing of electronic products. PMID:25121138

  13. MethLAB: a graphical user interface package for the analysis of array-based DNA methylation data.

    PubMed

    Kilaru, Varun; Barfield, Richard T; Schroeder, James W; Smith, Alicia K; Conneely, Karen N

    2012-03-01

    Recent evidence suggests that DNA methylation changes may underlie numerous complex traits and diseases. The advent of commercial, array-based methods to interrogate DNA methylation has led to a profusion of epigenetic studies in the literature. Array-based methods, such as the popular Illumina GoldenGate and Infinium platforms, estimate the proportion of DNA methylated at single-base resolution for thousands of CpG sites across the genome. These arrays generate enormous amounts of data, but few software resources exist for efficient and flexible analysis of these data. We developed a software package called MethLAB (http://genetics.emory.edu/conneely/MethLAB) using R, an open source statistical language that can be edited to suit the needs of the user. MethLAB features a graphical user interface (GUI) with a menu-driven format designed to efficiently read in and manipulate array-based methylation data in a user-friendly manner. MethLAB tests for association between methylation and relevant phenotypes by fitting a separate linear model for each CpG site. These models can incorporate both continuous and categorical phenotypes and covariates, as well as fixed or random batch or chip effects. MethLAB accounts for multiple testing by controlling the false discovery rate (FDR) at a user-specified level. Standard output includes a spreadsheet-ready text file and an array of publication-quality figures. Considering the growing interest in and availability of DNA methylation data, there is a great need for user-friendly open source analytical tools. With MethLAB, we present a timely resource that will allow users with no programming experience to implement flexible and powerful analyses of DNA methylation data.

  14. Design, processing and testing of LSI arrays hybrid microelectronics task

    NASA Technical Reports Server (NTRS)

    Himmel, R. P.; Stuhlbarg, S. M.; Salmassy, S.

    1978-01-01

    Those factors affecting the cost of electronic subsystems utilizing LSI microcircuits were determined and the most efficient methods for low cost packaging of LSI devices as a function of density and reliability were developed.

  15. SIRU utilization. Volume 2: Software description and program documentation

    NASA Technical Reports Server (NTRS)

    Oehrle, J.; Whittredge, R.

    1973-01-01

    A complete description of the additional analysis, development and evaluation provided for the SIRU system as identified in the requirements for the SIRU utilization program is presented. The SIRU configuration is a modular inertial subsystem with hardware and software features that achieve fault tolerant operational capabilities. The SIRU redundant hardware design is formulated about a six gyro and six accelerometer instrument module package. The modules are mounted in this package so that their measurement input axes form a unique symmetrical pattern that corresponds to the array of perpendiculars to the faces of a regular dodecahedron. This six axes array provides redundant independent sensing and the symmetry enables the formulation of an optimal software redundant data processing structure with self-contained fault detection and isolation (FDI) capabilities. Documentation of the additional software and software modifications required to implement the utilization capabilities includes assembly listings and flow charts

  16. GST-PRIME: an algorithm for genome-wide primer design.

    PubMed

    Leister, Dario; Varotto, Claudio

    2007-01-01

    The profiling of mRNA expression based on DNA arrays has become a powerful tool to study genome-wide transcription of genes in a number of organisms. GST-PRIME is a software package created to facilitate large-scale primer design for the amplification of probes to be immobilized on arrays for transcriptome analyses, even though it can be also applied in low-throughput approaches. GST-PRIME allows highly efficient, direct amplification of gene-sequence tags (GSTs) from genomic DNA (gDNA), starting from annotated genome or transcript sequences. GST-PRIME provides a customer-friendly platform for automatic primer design, and despite the relative simplicity of the algorithm, experimental tests in the model plant species Arabidopsis thaliana confirmed the reliability of the software. This chapter describes the algorithm used for primer design, its input and output files, and the installation of the standalone package and its use.

  17. Visualization of Underfill Flow in Ball Grid Array (BGA) using Particle Image Velocimetry (PIV)

    NASA Astrophysics Data System (ADS)

    Ng, Fei Chong; Abas, Aizat; Abustan, Ismail; Remy Rozainy, Z. Mohd; Abdullah, MZ; Jamaludin, Ali b.; Kon, Sharon Melissa

    2018-05-01

    This paper presents the experimental methodology using particle image velocimetry (PIV) to study the underfill process of ball grid array (BGA) chip package. PIV is a non-intrusive approach to visualize the flow behavior of underfill across the solder ball array. The BGA model of three different configurations – perimeter, middle empty and full array – were studied in current research. Through PIV experimental works, the underfill velocity distribution and vector fields for each BGA models were successfully obtained. It is found that perimeter has the shortest filling time resulting to a higher underfill velocity. Therefore, it is concluded that the flow behavior of underfill in BGA can be justified thoroughly with the aid of PIV.

  18. [Dandy-walker syndrome and microdeletions on chromosome 7].

    PubMed

    Liao, Can; Fu, Fang; Li, Ru; Pan, Min; Yang, Xin; Yi, Cui-xing; Li, Jian; Li, Dong-zhi

    2012-02-01

    To investigate genetic etiology of Dandy-Walker syndrome with array-based comparative genomic hybridization (array-CGH). Eight fetuses with Dandy-Walker malformations but normal karyotypes by conventional cytogenetic technique were selected. DNA samples were extracted and hybridized with Affymetrix cytogenetic 2.7 M arrays by following the manufacturer's standard protocol. The data were analyzed by special software packages. By using array-CGH technique, common deletions and duplication on chromosome 7p21.3 were identified in three cases, within which were central nervous system disease associated genes NDUFA4 and PHF14. Copy number variations (CNVs) of chromosome 7p21.3 region are associated with Dandy-Walker malformations which may be due to haploinsufficiency or overexpression of NDUFA4 and PHF14 genes.

  19. Muon–hadron detector of the carpet-2 array

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Dzhappuev, D. D.; Kudzhaev, A. U., E-mail: kudjaev@mail.ru; Klimenko, N. F.

    The 1-GeV muon–hadron detector of the Carpet-2 multipurpose shower array at the Baksan Neutrino Observatory, Institute for Nuclear Research, Russian Academy of Sciences (INR, Moscow, Russia) is able to record simultaneously muons and hadrons. The procedure developed for this device makes it possible to separate the muon and hadron components to a high degree of precision. The spatial and energy features of the muon and hadron extensive-air-shower components are presented. Experimental data from the Carpet-2 array are contrasted against data from the EAS-TOP and KASCADE arrays and against the results of the calculations based on the CORSIKA (GHEISHA + QGSJET01)more » code package and performed for primary protons and iron nuclei.« less

  20. Single-Event Effect (SEE) Survey of Advanced Reconfigurable Field Programmable Gate Arrays: NASA Electronic Parts and Packaging (NEPP) Program Office of Safety and Mission Assurance

    NASA Technical Reports Server (NTRS)

    Allen, Gregory

    2011-01-01

    The NEPP Reconfigurable Field-Programmable Gate Array (FPGA) task has been charged to evaluate reconfigurable FPGA technologies for use in space. Under this task, the Xilinx single-event-immune, reconfigurable FPGA (SIRF) XQR5VFX130 device was evaluated for SEE. Additionally, the Altera Stratix-IV and SiliconBlue iCE65 were screened for single-event latchup (SEL).

  1. The T/R modules for phased-array antennas

    NASA Astrophysics Data System (ADS)

    Peignet, Colette; Mancuso, Yves; Resneau, J. Claude

    1990-09-01

    The concept of phased array radar is critically dependent on the availability of compact, reliable and low power consuming Transmitter/Receiver (T/R) modules. An overview is given on two major programs actually at development stage within the Thomson group and on three major development axis (electrical concept optimization, packaging, and size reduction). The technical feasibility of the concept was proven and the three major axis were enlightened, based on reliability, power added efficiency, and RF tests optimization.

  2. Thematic mapper critical elements breadboard program

    NASA Technical Reports Server (NTRS)

    Dale, C. H., Jr.; Engel, J. L.; Harney, E. D.

    1976-01-01

    A 40.6 cm bidirectional scan mirror assembly, a scan line corrector and a silicon photodiode array with integral preamplifier input stages were designed, fabricated, and tested to demonstrate performance consistent with requirements of the Hughes thematic mapper system. The measured performance met or exceeded the original design goals in all cases with the qualification that well defined and well understood deficiencies in the design of the photodiode array package will require the prescribed corrections before flight use.

  3. Terahertz Array Receivers with Integrated Antennas

    NASA Technical Reports Server (NTRS)

    Chattopadhyay, Goutam; Llombart, Nuria; Lee, Choonsup; Jung, Cecile; Lin, Robert; Cooper, Ken B.; Reck, Theodore; Siles, Jose; Schlecht, Erich; Peralta, Alessandro; hide

    2011-01-01

    Highly sensitive terahertz heterodyne receivers have been mostly single-pixel. However, now there is a real need of multi-pixel array receivers at these frequencies driven by the science and instrument requirements. In this paper we explore various receiver font-end and antenna architectures for use in multi-pixel integrated arrays at terahertz frequencies. Development of wafer-level integrated terahertz receiver front-end by using advanced semiconductor fabrication technologies has progressed very well over the past few years. Novel stacking of micro-machined silicon wafers which allows for the 3-dimensional integration of various terahertz receiver components in extremely small packages has made it possible to design multi-pixel heterodyne arrays. One of the critical technologies to achieve fully integrated system is the antenna arrays compatible with the receiver array architecture. In this paper we explore different receiver and antenna architectures for multi-pixel heterodyne and direct detector arrays for various applications such as multi-pixel high resolution spectrometer and imaging radar at terahertz frequencies.

  4. Shape memory alloy actuation for a variable area fan nozzle

    NASA Astrophysics Data System (ADS)

    Rey, Nancy; Tillman, Gregory; Miller, Robin M.; Wynosky, Thomas; Larkin, Michael J.; Flamm, Jeffrey D.; Bangert, Linda S.

    2001-06-01

    The ability to control fan nozzle exit area is an enabling technology for next generation high-bypass-ratio turbofan engines. Performance benefits for such designs are estimated at up to 9% in thrust specific fuel consumption (TSFC) relative to current fixed-geometry engines. Conventionally actuated variable area fan nozzle (VAN) concepts tend to be heavy and complicated, with significant aircraft integration, reliability and packaging issues. The goal of this effort was to eliminate these undesirable features and formulate a design that meets or exceeds leakage, durability, reliability, maintenance and manufacturing cost goals. A Shape Memory Alloy (SMA) bundled cable actuator acting to move an array of flaps around the fan nozzle annulus is a concept that meets these requirements. The SMA bundled cable actuator developed by the United Technologies Corporation (Patents Pending) provides significant work output (greater than 2200 in-lb per flap, through the range of motion) in a compact package and minimizes system complexity. Results of a detailed design study indicate substantial engine performance, weight, and range benefits. The SMA- based actuation system is roughly two times lighter than a conventional mechanical system, with significant aircraft direct operating cost savings (2-3%) and range improvements (5-6%) relative to a fixed-geometry nozzle geared turbofan. A full-scale sector model of this VAN system was built and then tested at the Jet Exit Test Facility at NASA Langley to demonstrate the system's ability to achieve 20% area variation of the nozzle under full scale aerodynamic loads. The actuator exceeded requirements, achieving repeated actuation against full-scale loads representative of typical cruise as well as greater than worst-case (ultimate) aerodynamic conditions. Based on these encouraging results, work is continuing with the goal of a flight test on a C-17 transport aircraft.

  5. A top-crossover-to-bottom addressed segmented annular array using piezoelectric micromachined ultrasonic transducers

    NASA Astrophysics Data System (ADS)

    Jung, Joontaek; Lee, Wonjun; Kang, Woojin; Hong, Hyeryung; Yuen Song, Hi; Oh, Inn-yeal; Park, Chul Soon; Choi, Hongsoo

    2015-11-01

    We design and fabricate segmented annular arrays (SAAs) using piezoelectric micromachined ultrasonic transducers (pMUTs) to demonstrate the feasibility of acoustic focusing of ultrasound. The fabricated SAAs have 25 concentric top-electrode signal lines and eight bottom-electrodes for grounding to enable electronic steering of selectively grouped ultrasonic transducers from 2393 pMUT elements. Each element in the array is connected by top-crossover-to-bottom metal bridges, which reduce the parasitic capacitance. Circular-shaped pMUT elements, 120 μm in diameter, are fabricated using 1 μm-thick sol-gel lead zirconate titanate on a silicon wafer. To utilize the high-density pMUT array, a deep reactive ion etching process is used for anisotropic silicon etching to realize the transducer membranes. The resonant frequency and effective coupling coefficient of the elements, measured with an impedance analyzer, yields 1.517 MHz and 1.29%, respectively, in air. The SAAs using pMUTs are packaged on a printed circuit board and coated with parylene C for acoustic intensity measurements in water. The ultrasound generated by each segmented array is focused on a selected point in space. When a 5 Vpp, 1.5 MHz square wave is applied, the maximum spatial peak temporal average intensity ({{I}\\text{spta}} ) is found to be 79 mW cm-2 5 mm from the SAAs’ surface without beamforming. The beam widths (-3 dB) of ultrasonic radiation patterns in the elevation and azimuth directions are recorded as 3 and 3.4 mm, respectively. The results successfully show the feasibility of focusing ultrasound on a small area with SAAs using pMUTs.

  6. Long-term lumen depreciation behavior and failure modes of multi-die array LEDs

    NASA Astrophysics Data System (ADS)

    Jayawardena, Asiri; Marcus, Daniel; Prugue, Ximena; Narendran, Nadarajah

    2013-09-01

    One of the main advantages of multi-die array light-emitting diodes (LEDs) is their high flux density. However, a challenge for using such a product in lighting fixture applications is the heat density and the need for thermal management to keep the junction temperatures of all the dies low for long-term reliable performance. Ten multi-die LED array samples for each product from four different manufacturers were subjected to lumen maintenance testing (as described in IES-LM-80-08), and their resulting lumen depreciation and failure modes were studied. The products were tested at the maximum case (or pin) temperature reported by the respective manufacturer by appropriately powering the LEDs. In addition, three samples for each product from two different manufacturers were subjected to rapid thermal cycling, and the resulting lumen depreciation and failure modes were studied. The results showed that the exponential lumen decay model using long-term lumen maintenance data as recommended in IES TM-21 does not fit for all package types. The failure of a string of dies and single die failure in a string were observed in some of the packages.

  7. Power enhancement via multivariate outlier testing with gene expression arrays.

    PubMed

    Asare, Adam L; Gao, Zhong; Carey, Vincent J; Wang, Richard; Seyfert-Margolis, Vicki

    2009-01-01

    As the use of microarrays in human studies continues to increase, stringent quality assurance is necessary to ensure accurate experimental interpretation. We present a formal approach for microarray quality assessment that is based on dimension reduction of established measures of signal and noise components of expression followed by parametric multivariate outlier testing. We applied our approach to several data resources. First, as a negative control, we found that the Affymetrix and Illumina contributions to MAQC data were free from outliers at a nominal outlier flagging rate of alpha=0.01. Second, we created a tunable framework for artificially corrupting intensity data from the Affymetrix Latin Square spike-in experiment to allow investigation of sensitivity and specificity of quality assurance (QA) criteria. Third, we applied the procedure to 507 Affymetrix microarray GeneChips processed with RNA from human peripheral blood samples. We show that exclusion of arrays by this approach substantially increases inferential power, or the ability to detect differential expression, in large clinical studies. http://bioconductor.org/packages/2.3/bioc/html/arrayMvout.html and http://bioconductor.org/packages/2.3/bioc/html/affyContam.html affyContam (credentials: readonly/readonly)

  8. 7 CFR 58.211 - Packaging room for bulk products.

    Code of Federal Regulations, 2013 CFR

    2013-01-01

    ... maintained to keep roofs and outside areas free of dry product. Only packaging materials that are used within a day's operation may be kept in the packaging area. These materials shall be kept on metal racks or...

  9. 7 CFR 58.211 - Packaging room for bulk products.

    Code of Federal Regulations, 2014 CFR

    2014-01-01

    ... maintained to keep roofs and outside areas free of dry product. Only packaging materials that are used within a day's operation may be kept in the packaging area. These materials shall be kept on metal racks or...

  10. 7 CFR 58.211 - Packaging room for bulk products.

    Code of Federal Regulations, 2011 CFR

    2011-01-01

    ... maintained to keep roofs and outside areas free of dry product. Only packaging materials that are used within a day's operation may be kept in the packaging area. These materials shall be kept on metal racks or...

  11. 7 CFR 58.211 - Packaging room for bulk products.

    Code of Federal Regulations, 2012 CFR

    2012-01-01

    ... maintained to keep roofs and outside areas free of dry product. Only packaging materials that are used within a day's operation may be kept in the packaging area. These materials shall be kept on metal racks or...

  12. Pico-strain multiplexed fiber optic sensor array operating down to infra-sonic frequencies.

    PubMed

    Littler, Ian C M; Gray, Malcolm B; Chow, Jong H; Shaddock, Daniel A; McClelland, David E

    2009-06-22

    An integrated sensor system is presented which displays passive long range operation to 100 km at pico-strain (pepsilon) sensitivity to low frequencies (4 Hz) in wavelength division multiplexed operation with negligible cross-talk (better than -75 dB). This has been achieved by pre-stabilizing and multiplexing all interrogation lasers for the sensor array to a single optical frequency reference. This single frequency reference allows each laser to be locked to an arbitrary wavelength and independently tuned, while maintaining suppression of laser frequency noise. With appropriate packaging, such a multiplexed strain sensing system can form the core of a low frequency accelerometer or hydrophone array.

  13. Astronomical Data Processing Using SciQL, an SQL Based Query Language for Array Data

    NASA Astrophysics Data System (ADS)

    Zhang, Y.; Scheers, B.; Kersten, M.; Ivanova, M.; Nes, N.

    2012-09-01

    SciQL (pronounced as ‘cycle’) is a novel SQL-based array query language for scientific applications with both tables and arrays as first class citizens. SciQL lowers the entrance fee of adopting relational DBMS (RDBMS) in scientific domains, because it includes functionality often only found in mathematics software packages. In this paper, we demonstrate the usefulness of SciQL for astronomical data processing using examples from the Transient Key Project of the LOFAR radio telescope. In particular, how the LOFAR light-curve database of all detected sources can be constructed, by correlating sources across the spatial, frequency, time and polarisation domains.

  14. A micromachined silicon parallel acoustic delay line (PADL) array for real-time photoacoustic tomography (PAT)

    NASA Astrophysics Data System (ADS)

    Cho, Young Y.; Chang, Cheng-Chung; Wang, Lihong V.; Zou, Jun

    2015-03-01

    To achieve real-time photoacoustic tomography (PAT), massive transducer arrays and data acquisition (DAQ) electronics are needed to receive the PA signals simultaneously, which results in complex and high-cost ultrasound receiver systems. To address this issue, we have developed a new PA data acquisition approach using acoustic time delay. Optical fibers were used as parallel acoustic delay lines (PADLs) to create different time delays in multiple channels of PA signals. This makes the PA signals reach a single-element transducer at different times. As a result, they can be properly received by single-channel DAQ electronics. However, due to their small diameter and fragility, using optical fiber as acoustic delay lines poses a number of challenges in the design, construction and packaging of the PADLs, thereby limiting their performances and use in real imaging applications. In this paper, we report the development of new silicon PADLs, which are directly made from silicon wafers using advanced micromachining technologies. The silicon PADLs have very low acoustic attenuation and distortion. A linear array of 16 silicon PADLs were assembled into a handheld package with one common input port and one common output port. To demonstrate its real-time PAT capability, the silicon PADL array (with its output port interfaced with a single-element transducer) was used to receive 16 channels of PA signals simultaneously from a tissue-mimicking optical phantom sample. The reconstructed PA image matches well with the imaging target. Therefore, the silicon PADL array can provide a 16× reduction in the ultrasound DAQ channels for real-time PAT.

  15. Moho Depth and Geometry in the Illinois Basin Region Based on Gravity and Seismic Data from an EarthScope FlexArray Experiment

    NASA Astrophysics Data System (ADS)

    Curcio, D. D.; Pavlis, G. L.; Yang, X.; Hamburger, M. W.; Zhang, H.; Ravat, D.

    2017-12-01

    We present results from a combined analysis of seismic and gravity in the Illinois Basin region that demonstrate the presence of an unusually deep and highly variable Moho discontinuity. We construct a new, high-resolution image of the Earth's crust beneath the Illinois Basin using teleseismic P-wave receiver functions from the EarthScope OIINK (Ozarks, Illinois, INdiana, Kentucky) Flexible Array and the USArray Transportable Array. Our seismic analyses involved data from 143 OIINK stations and 80 USArray stations, using 3D plane-wave migration and common conversion point (CCP) stacking of P-to-S conversion data. Seismic interpretation has been done using the seismic exploration software package Petrel. One of the most surprising results is the anomalous depth of the Moho in this area, ranging from 41 to 63 km, with an average depth of 50 km. This thickened crust is unexpected in the Illinois Basin area, which has not been subject to convergence and mountain building processes in the last 900 Ma. This anomalously thick crust in combination with the minimal topography requires abnormally dense lower crust or unusually light upper mantle in order to retain gravitational equilibrium. Combining gravity modeling with the seismically identified Moho and a ubiquitous lower crustal boundary, we solve for the density variation of the middle and lower crust. We test the hypothesis that the anomalously thick crust and its high lower crustal layer observed in most of the central and southeastern Illinois Basin predates the formation and development of the current Illinois Basin. Post-formation tectonic activity, such as late Precambrian rifting or underplating are inferred to have modified the crustal thickness as well. The combination of high-resolution seismic data analysis and gravity modeling promises to provide additional insight into the geometry and composition of the lower crust in the Illinois Basin area.

  16. Clonality: an R package for testing clonal relatedness of two tumors from the same patient based on their genomic profiles.

    PubMed

    Ostrovnaya, Irina; Seshan, Venkatraman E; Olshen, Adam B; Begg, Colin B

    2011-06-15

    If a cancer patient develops multiple tumors, it is sometimes impossible to determine whether these tumors are independent or clonal based solely on pathological characteristics. Investigators have studied how to improve this diagnostic challenge by comparing the presence of loss of heterozygosity (LOH) at selected genetic locations of tumor samples, or by comparing genomewide copy number array profiles. We have previously developed statistical methodology to compare such genomic profiles for an evidence of clonality. We assembled the software for these tests in a new R package called 'Clonality'. For LOH profiles, the package contains significance tests. The analysis of copy number profiles includes a likelihood ratio statistic and reference distribution, as well as an option to produce various plots that summarize the results. Bioconductor (http://bioconductor.org/packages/release/bioc/html/Clonality.html) and http://www.mskcc.org/mskcc/html/13287.cfm.

  17. NASA-DoD Lead-Free Electronics Project

    NASA Technical Reports Server (NTRS)

    Kessel, Kurt

    2009-01-01

    In response to concerns about risks from lead-free induced faults to high reliability products, NASA has initiated a multi-year project to provide manufacturers and users with data to clarify the risks of lead-free materials in their products. The project will also be of interest to component manufacturers supplying to high reliability markets. The project was launched in November 2006. The primary technical objective of the project is to undertake comprehensive testing to generate information on failure modes/criteria to better understand the reliability of: (1) Packages (e.g., Thin Small Outline Package [TSOP], Ball Grid Array [BGA], Plastic Dual In-line Package [PDIP]) assembled and reworked with solder interconnects consisting of lead-free alloys (2) Packages (e.g., TSOP, BGA, PDIP) assembled and reworked with solder interconnects consisting of mixed alloys, lead component finish/lead-free solder and lead-free component finish/SnPb solder

  18. Clinical prototype of a plastic water-equivalent scintillating fiber dosimeter array for QA applications.

    PubMed

    Lacroix, Fréderic; Archambault, Louis; Gingras, Luc; Guillot, Mathieu; Beddar, A Sam; Beaulieu, Luc

    2008-08-01

    A clinical prototype of a scintillating fiber dosimeter array for quality assurance applications is presented. The array consists of a linear array of 29 plastic scintillation detectors embedded in a water-equivalent plastic sheet coupled to optical fibers used to guide optical photons to a charge coupled device (CCD) camera. The CCD is packaged in a light-tight, radiation-shielded housing designed for convenient transport. A custom designed connector is used to ensure reproducible mechanical positioning of the optical fibers relative to the CCD. Profile and depth dose characterization measurements are presented and show that the prototype provides excellent dose measurement reproducibility (+/-0.8%) in-field and good accuracy (+/-1.6% maximum deviation) relative to the dose measured with an IC10 ionization chamber.

  19. Constructing and Modifying Sequence Statistics for relevent Using informR in 𝖱

    PubMed Central

    Marcum, Christopher Steven; Butts, Carter T.

    2015-01-01

    The informR package greatly simplifies the analysis of complex event histories in 𝖱 by providing user friendly tools to build sufficient statistics for the relevent package. Historically, building sufficient statistics to model event sequences (of the form a→b) using the egocentric generalization of Butts’ (2008) relational event framework for modeling social action has been cumbersome. The informR package simplifies the construction of the complex list of arrays needed by the rem() model fitting for a variety of cases involving egocentric event data, multiple event types, and/or support constraints. This paper introduces these tools using examples from real data extracted from the American Time Use Survey. PMID:26185488

  20. Wearable and flexible thermoelectric generator with enhanced package

    NASA Astrophysics Data System (ADS)

    Francioso, L.; De Pascali, C.; Taurino, A.; Siciliano, P.; De Risi, A.

    2013-05-01

    Present work shows recent progresses in thin film-based flexible and wearable thermoelectric generator (TEG), finalized to support energy scavenging and local storage for low consumption electronics in Ambient Assisted Living (AAL) applications and buildings integration. The proposed TEG is able to recover energy from heat dispersed into the environment converting a thermal gradient to an effective electrical energy available to power ultra-low consumption devices. A low cost fabrication process based on planar thin-film technology was optimized to scale down the TEG dimensions to micrometer range. The prototype integrates 2778 thermocouples of sputtered Sb2Te3 and Bi2Te3 thin films (1 μm thick) on an area of 25 cm2. The electrical properties of thermoelectric materials were investigated by Van der Pauw measurements. Transfer Length Method (TLM) analysis was performed on three different multi-layer contact schemes in order to select the best solution to use for the definition of the contact pads realized on each section of the thermoelectric array configuration to allow electrical testing of single production areas. Kapton polyimide film was used as flexible substrate in order to add comfortable lightweight and better wearability to the device. The realized TEG is able to autonomously recover the thermal gradient useful to thermoelectric generation thanks to an appropriate package designed and optimized by a thermal analysis based on finite element method (FEM). The proposed package solution consists in coupling the module realized onto Kapton foil to a PDMS layer opportunely molded to thermally insulate TEG cold junctions and enhance the thermal gradient useful for the energy scavenging. Simulations results were compared to experimental tests performed by a thermal infrared camera, in order to evaluate the real performance of the designed package. First tests conducted on the realized TEG indicate that the prototype is able to recover about 5°C between hot and cold thermocouples junctions with a thermal difference of 17°C initially available between body skin and environment, generating about 2 V of open circuit output voltage.

  1. Large-Aperture Membrane Active Phased-Array Antennas

    NASA Technical Reports Server (NTRS)

    Karasik, Boris; McGrath, William; Leduc, Henry

    2009-01-01

    Large-aperture phased-array microwave antennas supported by membranes are being developed for use in spaceborne interferometric synthetic aperture radar systems. There may also be terrestrial uses for such antennas supported on stationary membranes, large balloons, and blimps. These antennas are expected to have areal mass densities of about 2 kg/sq m, satisfying a need for lightweight alternatives to conventional rigid phased-array antennas, which have typical areal mass densities between 8 and 15 kg/sq m. The differences in areal mass densities translate to substantial differences in total mass in contemplated applications involving aperture areas as large as 400 sq m. A membrane phased-array antenna includes patch antenna elements in a repeating pattern. All previously reported membrane antennas were passive antennas; this is the first active membrane antenna that includes transmitting/receiving (T/R) electronic circuits as integral parts. Other integral parts of the antenna include a network of radio-frequency (RF) feed lines (more specifically, a corporate feed network) and of bias and control lines, all in the form of flexible copper strip conductors on flexible polymeric membranes. Each unit cell of a prototype antenna (see Figure 1) contains a patch antenna element and a compact T/R module that is compatible with flexible membrane circuitry. There are two membrane layers separated by a 12.7-mm air gap. Each membrane layer is made from a commercially available flexible circuit material that, as supplied, comprises a 127-micron-thick polyimide dielectric layer clad on both sides with 17.5-micron-thick copper layers. The copper layers are patterned into RF, bias, and control conductors. The T/R module is located on the back side of the ground plane and is RF-coupled to the patch element via a slot. The T/R module is a hybrid multilayer module assembled and packaged independently and attached to the membrane array. At the time of reporting the information for this article, an 8 16 passive array (not including T/R modules) and a 2 4 active array (including T/R modules) had been demonstrated, and it was planned to fabricate and test larger arrays.

  2. Lateral mobility of minibasins during shortening: Insights from the SE Precaspian Basin, Kazakhstan

    NASA Astrophysics Data System (ADS)

    Duffy, Oliver B.; Fernandez, Naiara; Hudec, Michael R.; Jackson, Martin P. A.; Burg, George; Dooley, Tim P.; A-L Jackson, Christopher

    2017-04-01

    Minibasin provinces are widespread and can be found in all types of salt tectonic settings, many of which are prone to shortening. Previous studies of how minibasin provinces shorten assume that the salt between the minibasins is homogeneous and that the base of salt is flat or of low relief, such that minibasins are free to move laterally. Here we investigate how minibasin provinces respond to shortening when the lateral mobility of the minibasins is restricted by intra-salt sediment bodies. We examine a borehole-constrained, 3D seismic reflection dataset from the SE Precaspian Basin (onshore western Kazakhstan). The study area is characterised by large, supra-salt minibasins and an array of smaller intra-salt sediment packages distributed between these larger minibasins. We first outline the evidence of episodic shortening between the Late Triassic and present-day, after the onset of supra-salt minibasin subsidence. Next, we document spatial variations in shortening style, showing how these relate to the concentration of intra-salt sediment packages. Finally, we develop synoptic models showing how intra-salt sediment packages influence both the lateral mobility of minibasins during shortening and the resultant structural style, and we compare and contrast our findings with existing models and other natural examples of shortened minibasin provinces. We conclude that minibasin provinces may have different degrees of lateral mobility depending on the presence, or absence, of intrasalt barriers, and that these variations provide a first-order control on basin-shortening style and tectono-stratigraphic evolution.

  3. Power Extension Package (PEP) system definition extension, orbital service module systems analysis study. Volume 3: PEP analysis and tradeoffs

    NASA Technical Reports Server (NTRS)

    1979-01-01

    The objectives, conclusions, and approaches for accomplishing 19 specific design and analysis activities related to the installation of the power extension package (PEP) into the Orbiter cargo bay are described as well as those related to its deployment, extension, and retraction. The proposed cable handling system designed to transmit power from PEP to the Orbiter by way of the shuttle remote manipulator system is described and a preliminary specification for the gimbal assembly, solar array drive is included.

  4. Multilayered microelectronic device package with an integral window

    DOEpatents

    Peterson, Kenneth A.; Watson, Robert D.

    2003-01-01

    An apparatus for packaging of microelectronic devices is disclosed, wherein the package includes an integral window. The microelectronic device can be a semiconductor chip, a CCD chip, a CMOS chip, a VCSEL chip, a laser diode, a MEMS device, or a IMEMS device. The package can comprise, for example, a cofired ceramic frame or body. The package has an internal stepped structure made of a plurality of plates, with apertures, which are patterned with metallized conductive circuit traces. The microelectronic device can be flip-chip bonded on the plate to these traces, and oriented so that the light-sensitive side is optically accessible through the window. A cover lid can be attached to the opposite side of the package. The result is a compact, low-profile package, having an integral window that can be hermetically-sealed. The package body can be formed by low-temperature cofired ceramic (LTCC) or high-temperature cofired ceramic (HTCC) multilayer processes with the window being simultaneously joined (e.g. cofired) to the package body during LTCC or HTCC processing. Multiple chips can be located within a single package, according to some embodiments. The cover lid can include a window. The apparatus is particularly suited for packaging of MEMS devices, since the number of handling steps is greatly reduced, thereby reducing the potential for contamination. The integral window can further include a lens for optically transforming light passing through the window. The package can include an array of binary optic lenslets made integral with the window. The package can include an electrically-switched optical modulator, such as a lithium niobate window attached to the package, for providing a very fast electrically-operated shutter.

  5. Improving Reliability of High Power Quasi-CW Laser Diode Arrays for Pumping Solid State Lasers

    NASA Technical Reports Server (NTRS)

    Amzajerdian, Farzin; Meadows, Byron L.; Baker, Nathaniel R.; Barnes, Bruce W.; Baggott, Renee S.; Lockard, George E.; Singh, Upendra N.; Kavaya, Michael J.

    2005-01-01

    Most Lidar applications rely on moderate to high power solid state lasers to generate the required transmitted pulses. However, the reliability of solid state lasers, which can operate autonomously over long periods, is constrained by their laser diode pump arrays. Thermal cycling of the active regions is considered the primary reason for rapid degradation of the quasi-CW high power laser diode arrays, and the excessive temperature rise is the leading suspect in premature failure. The thermal issues of laser diode arrays are even more drastic for 2-micron solid state lasers which require considerably longer pump pulses compared to the more commonly used pump arrays for 1-micron lasers. This paper describes several advanced packaging techniques being employed for more efficient heat removal from the active regions of the laser diode bars. Experimental results for several high power laser diode array devices will be reported and their performance when operated at long pulsewidths of about 1msec will be described.

  6. NGST Yardstick Integrated Science Instrument Module (ISIM) Feasibility Study

    NASA Astrophysics Data System (ADS)

    Greenhouse, M. A.; Dipirro, M.; Federline, B.; Gardner, Jonathan P.; Guy, P.; Hagopian, J.; Hein, J.; Jurotich, M.; Lawrence, J.; Martineau, B.; Mather, J. C.; Mentzell, E.; Satyapal, S.; Stanley, D.; Teplitz, H. I.; Travis, J.; Bely, P.; Petro, L. D.; Stockman, P.; Burg, R.; Bitzel, R.

    1998-12-01

    We display portions of the baseline design concept for the NGST Integrated Science Instrument Module (ISIM). This ISIM design is under ongoing development for integration with the "Yardstick" and other NGST 8 m architectures that are intended for packaging in an EELV or Ariane 5 meter class fairing. The goals of this activity are to: [1] demonstrate mission science feasibility, [2] identify ISIM technology challenge areas, [3] assess ISIM engineering and cost feasibility, [5] identify ISIM/NGST interface constraints, and [6] enable smart customer procurement of the ISIM. In this poster, we display a snap shot of work in progress including: optical design, opto-mechanical layout, thermal modeling, focal plane array design, and electronics design. Ongoing progress can be monitored via ISIM team web site: http://ngst.gsfc.nasa.gov/

  7. Development of a MEMS acoustic emission sensor system

    NASA Astrophysics Data System (ADS)

    Greve, David W.; Oppenheim, Irving J.; Wu, Wei; Wright, Amelia P.

    2007-04-01

    An improved multi-channel MEMS chip for acoustic emission sensing has been designed and fabricated in 2006 to create a device that is smaller in size, superior in sensitivity, and more practical to manufacture than earlier designs. The device, fabricated in the MUMPS process, contains four resonant-type capacitive transducers in the frequency range between 100 kHz and 500 kHz on a chip with an area smaller than 2.5 sq. mm. The completed device, with its circuit board, electronics, housing, and connectors, possesses a square footprint measuring 25 mm x 25 mm. The small footprint is an important attribute for an acoustic emission sensor, because multiple sensors must typically be arrayed around a crack location. Superior sensitivity was achieved by a combination of four factors: the reduction of squeeze film damping, a resonant frequency approximating a rigid body mode rather than a bending mode, a ceramic package providing direct acoustic coupling to the structural medium, and high-gain amplifiers implemented on a small circuit board. Manufacture of the system is more practical because of higher yield (lower unit costs) in the MUMPS fabrication task and because of a printed circuit board matching the pin array of the MEMS chip ceramic package for easy assembly and compactness. The transducers on the MEMS chip incorporate two major mechanical improvements, one involving squeeze film damping and one involving the separation of resonance modes. For equal proportions of hole area to plate area, a triangular layout of etch holes reduces squeeze film damping as compared to the conventional square layout. The effect is modeled analytically, and is verified experimentally by characterization experiments on the new transducers. Structurally, the transducers are plates with spring supports; a rigid plate would be the most sensitive transducer, and bending decreases the sensitivity. In this chip, the structure was designed for an order-of-magnitude separation between the first and the second mode frequency, strongly approximating the desirable rigid plate limit. The effect is modeled analytically and is verified experimentally by measurement of the resonance frequencies in the new transducers. Another improvement arises from the use of a pin grid array ceramic package, in which the MEMS chip is acoustically coupled to the structure with only two interfaces, through a ceramic medium that is negligible in thickness when compared to wavelengths of interest. Like other acoustic emission sensors, those on the 2006 MEMS chip are sensitive only to displacements normal to the surface on which the device is mounted. To overcome that long-standing limitation, a new MEMS sensor sensitive to in-plane motion has been designed, featuring a different spring-mass mechanism and creating the signal by the change in capacitance between stationary and moving fingers. Predicted damping is much lower for the case of the in-plane sensor, and squeeze-film damping is used selectively to isolate the desired in-plane mechanical response from any unwanted out-of-plane response. The new spring-mass mechanism satisfies the design rules for the PolyMUMPS fabrication (foundry) process. A 3-D MEMS sensor system is presently being fabricated, collocating two in-plane sensors and one out-of-plane sensor at the mm scale, which is very short compared to the acoustic wavelength of interest for stress waves created by acoustic emission events.

  8. Fabrication and characterization of microfabricated on-chip microelectrochemical cell for biosensing applications

    NASA Astrophysics Data System (ADS)

    Said, N. A. Mohd; Twomey, K.; Herzog, G.; Ogurtsov, V. I.

    2017-03-01

    The fabrication of on-chip microelectrochemical cell on Si wafer by means of photolithography is described here. The single on-chip microelectrochemical cell device has dimensions of 100 × 380 mm with integrated Pt counter electrode (CE), Ag/AgCl reference electrode (RE) and gold microelectrode array of 500 nm recess depth as the working electrode (WE). Two geometries of electrode array were implemented, band and disc, with fixed diameter/width of 10 µm; and varied centre-to-centre spacing (d) and number of electrodes (N) in the array. The on-chip microelectrochemical cell structure has been designed to facilitate further WE biomodifications. Firstly, the developed microelectrochemical cell does not require packaging hence reducing the production cost and time. Secondly, the working electrode (WE) on the microelectrochemical cell is positioned towards the end of the chip enabling modification of the working electrode surface to be carried out for surface bio-functionalisation without affecting both the RE and CE surface conditions. The developed on-chip microelectrochemical cell was examined with scanning electron microscopy (SEM) and characterised by two electrochemical techniques. Both cyclic voltammetry (CV) and electrochemical impedance spectroscopy (EIS) were performed in 1 mM ferrocenecarboxylic acid (FCA) in 0.01 M phosphate buffered saline (PBS) solution at pH7.4. Electrochemical experiments showed that in the case of halving the interspacing distance of the microdisc WE array (50 nm instead of 100 nm), the voltammogram shifted from a steady-state CV (feature of hemispherical diffusion) to an inclined peak-shaped CV (feature of linear diffusion) albeit the arrays had the same surface area. In terms of EIS it was also found that linear diffusion dominates the surface instead of hemispherical diffusion once the interspacing distance was reduced, supporting the fact that closely packed arrays may behave like a macroelectrode

  9. High power vertical stacked and horizontal arrayed diode laser bar development based on insulation micro-channel cooling (IMCC) and hard solder bonding technology

    NASA Astrophysics Data System (ADS)

    Wang, Boxue; Jia, Yangtao; Zhang, Haoyu; Jia, Shiyin; Liu, Jindou; Wang, Weifeng; Liu, Xingsheng

    2018-02-01

    An insulation micro-channel cooling (IMCC) has been developed for packaging high power bar-based vertical stack and horizontal array diode lasers, which eliminates many issues caused in its congener packaged by commercial copper formed micro-channel cooler(MCC), such as coefficient of thermal expansion (CTE) mismatch between cooler and diode laser bar, high coolant quality requirement (DI water) and channel corrosion and electro-corrosion induced by DI water if the DI-water quality is not well maintained The IMCC cooler separates water flow route and electrical route, which allows tap-water as coolant without electro-corrosion and therefore prolongs cooler lifetime dramatically and escalated the reliability of these diode lasers. The thickness of ceramic and copper in an IMCC cooler is well designed to minimize the CTE mismatch between laser bar and cooler, consequently, a very low "SMILE" of the laser bar can be achieved for small fast axis divergence after collimation. In additional, gold-tin hard solder bonding technology was also developed to minimize the risk of solder electromigration at high current density and thermal fatigue under hard-pulse operation mode. Testing results of IMCC packaged diode lasers are presented in this report.

  10. Compact multiwavelength transmitter module for multimode fiber optic ribbon cable

    DOEpatents

    Deri, Robert J.; Pocha, Michael D.; Larson, Michael C.; Garrett, Henry E.

    2002-01-01

    A compact multiwavelength transmitter module for multimode fiber optic ribbon cable, which couples light from an M.times.N array of emitters onto N fibers, where the M wavelength may be distributed across two or more vertical-cavity surface-emitting laser (VCSEL) chips, and combining emitters and multiplexer into a compact package that is compatible with placement on a printed circuit board. A key feature is bringing together two emitter arrays fabricated on different substrates--each array designed for a different wavelength--into close physical proximity. Another key feature is to compactly and efficiently combine the light from two or more clusters of optical emitters, each in a different wavelength band, into a fiber ribbon.

  11. Tips on hybridizing, washing, and scanning affymetrix microarrays.

    PubMed

    Ares, Manuel

    2014-02-01

    Starting in the late 1990s, Affymetrix, Inc. produced a commercial system for hybridizing, washing, and scanning microarrays that was designed to be easy to operate and reproducible. The system used arrays packaged in a plastic cassette or chamber in which the prefabricated array was mounted and could be filled with fluid through resealable membrane ports either by hand or by an automated "fluidics station" specially designed to handle the arrays. A special rotating hybridization oven and a specially designed scanner were also required. Primarily because of automation and standardization the Affymetrix system was and still remains popular. Here, we provide a skeleton protocol with the potential pitfalls identified. It is designed to augment the protocols provided by Affymetrix.

  12. Development of a RadFET Linear Array for Intracavitary in vivo Dosimetry During External Beam Radiotherapy and Brachytherapy

    NASA Astrophysics Data System (ADS)

    Price, R. A.; Benson, C.; Joyce, M. J.; Rodgers, K.

    2004-08-01

    We present the details of a new linear array dosimeter consisting of a chain of semiconductors mounted on an ultra-thin (50 /spl mu/m thick) flexible substrate and housed in an intracavitary catheter. The semiconductors, manufactured by NMRC Cork, have not been packaging and incorporate a passivation layer that allows them to be mounted on the substrate using flip-chip-bonding. This paper reports, for the first time, the construction of a multiple (ten) detector array suited to in vivo dosimetry in the rectum, esophagus and vagina during external beam radiotherapy, as well as being adaptable to in vivo dosimetry during brachytherapy and diagnostic radiology.

  13. K-Band Phased Array Developed for Low- Earth-Orbit Satellite Communications

    NASA Technical Reports Server (NTRS)

    Anzic, Godfrey

    1999-01-01

    Future rapid deployment of low- and medium-Earth-orbit satellite constellations that will offer various narrow- to wide-band wireless communications services will require phased-array antennas that feature wide-angle and superagile electronic steering of one or more antenna beams. Antennas, which employ monolithic microwave integrated circuits (MMIC), are perfectly suited for this application. Under a cooperative agreement, an MMIC-based, K-band phased-array antenna is being developed with 50/50 cost sharing by the NASA Lewis Research Center and Raytheon Systems Company. The transmitting array, which will operate at 19 gigahertz (GHz), is a state-of-the-art design that features dual, independent, electronically steerable beam operation ( 42 ), a stand-alone thermal management, and a high-density tile architecture. This array can transmit 622 megabits per second (Mbps) in each beam from Earth orbit to small Earth terminals. The weight of the total array package is expected to be less than 8 lb. The tile integration technology (flip chip MMIC tile) chosen for this project represents a major advancement in phased-array engineering and holds much promise for reducing manufacturing costs.

  14. Electronic packaging: new results in singulation by Laser Microjet

    NASA Astrophysics Data System (ADS)

    Wagner, Frank; Sibailly, Ochelio; Richerzhagen, Bernold

    2004-07-01

    Cutting electronic packages that are produced in a matrix array fashion is an important process and deals with the ready-to-use devices. Thus an increase in the singulation yield is directly correlated to an increase in benefit. Due to the usage of different substrate materials, the saws encounter big problems in terms of lifetime and constancy of cut quality in these applications. Today"s equipment manufacturers are not yet in the position to propose an adequate solution for all types of packages. Compared to classical laser cutting, the water-jet guided laser technology minimizes the heat damages in any kind of sample. This new material processing method consists in guiding a laser beam inside a hair thin, lowpressure water-jet by total internal reflection, and is applied to package singulation since two years approximately. Using a frequency doubled Nd:YAG laser guided by a water jet, an LTCC-ceramics based package is singulated according to a scribe and break process. Speeds of 2-10 mm/s are reached in the LTTC and 40 mm/s in the mold compound. The process is wear-free and provides very good edge quality of the LTCC and the mold compound as well as reliable separation of the packages.

  15. What Do Cigarette Pack Colors Communicate to Smokers in the U.S.?

    PubMed Central

    Bansal-Travers, Maansi; O’Connor, Richard; Fix, Brian V.; Cummings, K. Michael

    2011-01-01

    Background New legislation in the U.S. prohibits tobacco companies from labelling cigarette packs with terms such as ‘light,’ ‘mild,’ or ‘low’ after June 2010. However, experience from countries that have removed these descriptors suggests different terms, colors, or numbers communicating the same messages may replace them. Purpose The main purpose of this study was to examine how cigarette pack colors are perceived by smokers to correspond to different descriptive terms. Methods Newspaper advertisements and craigslist.org postings directed interested current smokers to a survey website. Eligible participants were shown an array of six cigarette packages (altered to remove all descriptive terms) and asked to link package images with their corresponding descriptive terms. Participants were then asked to identify which pack in the array they would choose if they were concerned with health, tar, nicotine, image, and taste. Results A total of 193 participants completed the survey from February to March 2008 (data were analyzed from May 2008 through November 2010). Participants were more accurate in matching descriptors to pack images for Marlboro brand cigarettes than for unfamiliar Peter Jackson brand (sold in Australia). Smokers overwhelmingly chose the ‘whitest’ pack if they were concerned about health, tar, and nicotine. Conclusions Smokers in the U.S. associate brand descriptors with colors. Further, white packaging appears to most influence perceptions of safety. Removal of descriptor terms but not the associated colors will be insufficient in eliminating misperceptions about the risks from smoking communicated to smokers through packaging. PMID:21565662

  16. What do cigarette pack colors communicate to smokers in the U.S.?

    PubMed

    Bansal-Travers, Maansi; O'Connor, Richard; Fix, Brian V; Cummings, K Michael

    2011-06-01

    New legislation in the U.S. prohibits tobacco companies from labeling cigarette packs with terms such as light, mild, or low after June 2010. However, experience from countries that have removed these descriptors suggests that different terms, colors, or numbers communicating the same messages may replace them. The main purpose of this study was to examine how cigarette pack colors are perceived by smokers to correspond to different descriptive terms. Newspaper advertisements and CraigsList.org postings directed interested current smokers to a survey website. Eligible participants were shown an array of six cigarette packages (altered to remove all descriptive terms) and asked to link package images with their corresponding descriptive terms. Participants were then asked to identify which pack in the array they would choose if they were concerned with health, tar, nicotine, image, and taste. A total of 193 participants completed the survey from February to March 2008 (data were analyzed from May 2008 through November 2010). Participants were more accurate in matching descriptors to pack images for Marlboro brand cigarettes than for unfamiliar Peter Jackson brand (sold in Australia). Smokers overwhelmingly chose the "whitest" pack if they were concerned about health, tar, and nicotine. Smokers in the U.S. associate brand descriptors with colors. Further, white packaging appears to most influence perceptions of safety. Removal of descriptor terms but not the associated colors will be insufficient in eliminating misperceptions about the risks from smoking communicated to smokers through packaging. Copyright © 2011 American Journal of Preventive Medicine. Published by Elsevier Inc. All rights reserved.

  17. Optical Design of Plant Canopy Measurement System and Fabrication of Two-Dimensional High-Speed Metal-Semiconductor-Metal Photodetector Arrays

    NASA Technical Reports Server (NTRS)

    Sarto, Anthony; VanZeghbroeck, Bart; Vanderbilt, Vern C.

    1996-01-01

    Electrical and optical designs for the prototype plant canopy architecture measurement system, including specified component and parts lists, are presented. Six single Metal-Semiconductor-Metal (MSM) detectors are mounted in high-speed packages.

  18. QTL mapping of potato chip color and tuber traits within an autotetraploid family

    USDA-ARS?s Scientific Manuscript database

    Cultivated potato (Solanum tuberosum L.) is a highly heterozygous autotetraploid crop species, and this presents challenges for traditional line development and molecular breeding. Recent availability of a single nucleotide polymorphism (SNP) array with 8303 features and software packages for linkag...

  19. Design, fabrication, and packaging of an integrated, wirelessly-powered optrode array for optogenetics application

    PubMed Central

    Kwon, Ki Yong; Lee, Hyung-Min; Ghovanloo, Maysam; Weber, Arthur; Li, Wen

    2015-01-01

    The recent development of optogenetics has created an increased demand for advancing engineering tools for optical modulation of neural circuitry. This paper details the design, fabrication, integration, and packaging procedures of a wirelessly-powered, light emitting diode (LED) coupled optrode neural interface for optogenetic studies. The LED-coupled optrode array employs microscale LED (μLED) chips and polymer-based microwaveguides to deliver light into multi-level cortical networks, coupled with microelectrodes to record spontaneous changes in neural activity. An integrated, implantable, switched-capacitor based stimulator (SCS) system provides high instantaneous power to the μLEDs through an inductive link to emit sufficient light and evoke neural activities. The presented system is mechanically flexible, biocompatible, miniaturized, and lightweight, suitable for chronic implantation in small freely behaving animals. The design of this system is scalable and its manufacturing is cost effective through batch fabrication using microelectromechanical systems (MEMS) technology. It can be adopted by other groups and customized for specific needs of individual experiments. PMID:25999823

  20. Space Construction System Analysis. Special Emphasis Studies

    NASA Technical Reports Server (NTRS)

    1979-01-01

    Generic concepts were analyzed to determine: (1) the maximum size of a deployable solar array which might be packaged into a single orbit payload bay; (2) the optimal overall shape of a large erectable structure for large satellite projects; (3) the optimization of electronic communication with emphasis on the number of antennas and their diameters; and (4) the number of beams, traffic growth, and projections and frequencies were found feasible to package a deployable solar array which could generate over 250 kilowatts of electrical power. Also, it was found that the linear-shaped erectable structure is better for ease of construction and installation of systems, and compares favorably on several other counts. The study of electronic communication technology indicated that proliferation of individual satellites will crowd the spectrum by the early 1990's, so that there will be a strong tendency toward a small number of communications platforms over the continental U.S.A. with many antennas and multiple spot beams.

  1. International Space Station (ISS)

    NASA Image and Video Library

    2000-12-04

    This video still depicts the recently deployed starboard and port solar arrays towering over the International Space Station (ISS). The video was recorded on STS-97's 65th orbit. Delivery, assembly, and activation of the solar arrays was the main mission objective of STS-97. The electrical power system, which is built into a 73-meter (240-foot) long solar array structure consists of solar arrays, radiators, batteries, and electronics, and will provide the power necessary for the first ISS crews to live and work in the U.S. segment. The entire 15.4-metric ton (17-ton) package is called the P6 Integrated Truss Segment, and is the heaviest and largest element yet delivered to the station aboard a space shuttle. The STS-97 crew of five launched aboard the Space Shuttle Orbiter Endeavor on November 30, 2000 for an 11 day mission.

  2. High power diode lasers for solid-state laser pumps

    NASA Technical Reports Server (NTRS)

    Linden, Kurt J.; Mcdonnell, Patrick N.

    1994-01-01

    The development and commercial application of high power diode laser arrays for use as solid-state laser pumps is described. Such solid-state laser pumps are significantly more efficient and reliable than conventional flash-lamps. This paper describes the design and fabrication of diode lasers emitting in the 780 - 900 nm spectral region, and discusses their performance and reliability. Typical measured performance parameters include electrical-to-optical power conversion efficiencies of 50 percent, narrow-band spectral emission of 2 to 3 nm FWHM, pulsed output power levels of 50 watts/bar with reliability values of over 2 billion shots to date (tests to be terminated after 10 billion shots), and reliable operation to pulse lengths of 1 ms. Pulse lengths up to 5 ms have been demonstrated at derated power levels, and CW performance at various power levels has been evaluated in a 'bar-in-groove' laser package. These high-power 1-cm stacked-bar arrays are now being manufactured for OEM use. Individual diode laser bars, ready for package-mounting by OEM customers, are being sold as commodity items. Commercial and medical applications of these laser arrays include solid-state laser pumping for metal-working, cutting, industrial measurement and control, ranging, wind-shear/atmospheric turbulence detection, X-ray generation, materials surface cleaning, microsurgery, ophthalmology, dermatology, and dental procedures.

  3. Focal plane subsystem design and performance for atmospheric chemistry from geostationary orbit tropospheric emissions monitoring of pollution

    NASA Astrophysics Data System (ADS)

    Gilmore, A. S.; Philbrick, R. H.; Funderburg, J.

    2017-09-01

    Remote sensing of pollutants are enabled from a satellite in a geostationary orbit containing an imaging spectrometer encompassing the wavelength ranges of 290 - 490 nm and 540 - 740 nm. As the first of NASA's Earth Venture Instrument Program, the Tropospheric Emissions: Monitoring of Pollution (TEMPO) program will utilize this instrument to measure hourly air quality over a large portion of North America. The focal plane subsystem (FPS) contains two custom designed and critically aligned full frame transfer charge coupled devices (active area: 1028 x 2048, 18 μm) within a focal plane array package designed for radiation tolerance and space charging rejection. In addition, the FPS contains custom distributed focal plane electronics that provide all necessary clocks and biases to the sensors, receives all analog data from the sensors and performs 14 bit analog to digital conversion for upstream processing. Finally, the FPS encompasses custom low noise cables connecting the focal plane array and associated electronics. This paper discusses the design and performance of this novel focal plane subsystem with particular emphasis on the optical performance achieved including alignment, quantum efficiency, and modulation transfer function.

  4. Design, Fabrication and Characterization of a Low-Impedance 3D Electrode Array System for Neuro-Electrophysiology

    PubMed Central

    Kusko, Mihaela; Craciunoiu, Florea; Amuzescu, Bogdan; Halitzchi, Ferdinand; Selescu, Tudor; Radoi, Antonio; Popescu, Marian; Simion, Monica; Bragaru, Adina; Ignat, Teodora

    2012-01-01

    Recent progress in patterned microelectrode manufacturing technology and microfluidics has opened the way to a large variety of cellular and molecular biosensor-based applications. In this extremely diverse and rapidly expanding landscape, silicon-based technologies occupy a special position, given their statute of mature, consolidated, and highly accessible areas of development. Within the present work we report microfabrication procedures and workflows for 3D patterned gold-plated microelectrode arrays (MEA) of different shapes (pyramidal, conical and high aspect ratio), and we provide a detailed characterization of their physical features during all the fabrication steps to have in the end a reliable technology. Moreover, the electrical performances of MEA silicon chips mounted on standardized connector boards via ultrasound wire-bonding have been tested using non-destructive electrochemical methods: linear sweep and cyclic voltammetry, impedance spectroscopy. Further, an experimental recording chamber package suitable for in vitro electrophysiology experiments has been realized using custom-design electronics for electrical stimulus delivery and local field potential recording, included in a complete electrophysiology setup, and the experimental structures have been tested on newborn rat hippocampal slices, yielding similar performance compared to commercially available MEA equipments. PMID:23208555

  5. Cluster Computing For Real Time Seismic Array Analysis.

    NASA Astrophysics Data System (ADS)

    Martini, M.; Giudicepietro, F.

    A seismic array is an instrument composed by a dense distribution of seismic sen- sors that allow to measure the directional properties of the wavefield (slowness or wavenumber vector) radiated by a seismic source. Over the last years arrays have been widely used in different fields of seismological researches. In particular they are applied in the investigation of seismic sources on volcanoes where they can be suc- cessfully used for studying the volcanic microtremor and long period events which are critical for getting information on the volcanic systems evolution. For this reason arrays could be usefully employed for the volcanoes monitoring, however the huge amount of data produced by this type of instruments and the processing techniques which are quite time consuming limited their potentiality for this application. In order to favor a direct application of arrays techniques to continuous volcano monitoring we designed and built a small PC cluster able to near real time computing the kinematics properties of the wavefield (slowness or wavenumber vector) produced by local seis- mic source. The cluster is composed of 8 Intel Pentium-III bi-processors PC working at 550 MHz, and has 4 Gigabytes of RAM memory. It runs under Linux operating system. The developed analysis software package is based on the Multiple SIgnal Classification (MUSIC) algorithm and is written in Fortran. The message-passing part is based upon the LAM programming environment package, an open-source imple- mentation of the Message Passing Interface (MPI). The developed software system includes modules devote to receiving date by internet and graphical applications for the continuous displaying of the processing results. The system has been tested with a data set collected during a seismic experiment conducted on Etna in 1999 when two dense seismic arrays have been deployed on the northeast and the southeast flanks of this volcano. A real time continuous acquisition system has been simulated by a pro- gram which reads data from disk files and send them to a remote host by using the Internet protocols.

  6. Gas hydrate environmental monitoring program in the Ulleung Basin, East Sea of Korea

    NASA Astrophysics Data System (ADS)

    Ryu, Byong-Jae; Chun, Jong-Hwa; McLean, Scott

    2013-04-01

    As a part of the Korean National Gas Hydrate Program, the Korea Institute of Geoscience and Mineral Resources (KIGAM) has been planned and conducted the environmental monitoring program for the gas hydrate production test in the Ulleung Basin, East Sea of Korea in 2014. This program includes a baseline survey using a KIGAM Seafloor Observation System (KISOS) and R/V TAMHAE II of KIGAM, development of a KIGAM Seafloor Monitoring System (KIMOS), and seafloor monitoring on various potential hazards associated with the dissociated gas from gas hydrates during the production test. The KIGAM also plans to conduct the geophysical survey for determining the change of gas hydrate reservoirs and production-efficiency around the production well before and after the production test. During production test, release of gas dissociated from the gas hydrate to the water column, seafloor deformation, changes in chemical characteristics of bottom water, changes in seafloor turbidity, etc. will be monitored by using the various monitoring instruments. The KIMOS consists of a near-field observation array and a far-field array. The near-field array is constructed with four remote sensor platforms each, and cabled to the primary node. The far-field sensor array will consists of four autonomous instrument pods. A scientific Remotely Operated Vehicle (ROV) will be used to deploy the sensor arrays, and to connect the cables to each field instrument package and a primary node. A ROV will also be tasked to collect the water and/or gas samples, and to identify any gas (bubble) plumes from the seafloor using a high-frequency sector scanning sonar. Power to the near-field instrument packages will be supplied by battery units located on the seafloor near the primary node. Data obtained from the instruments on the near-field array will be logged and downloaded in-situ at the primary node, and transmitted real-time to the support vessel using a ROV. These data will also be transmitted real-time to the drilling vessel via satellite.

  7. ChAMP: updated methylation analysis pipeline for Illumina BeadChips.

    PubMed

    Tian, Yuan; Morris, Tiffany J; Webster, Amy P; Yang, Zhen; Beck, Stephan; Feber, Andrew; Teschendorff, Andrew E

    2017-12-15

    The Illumina Infinium HumanMethylationEPIC BeadChip is the new platform for high-throughput DNA methylation analysis, effectively doubling the coverage compared to the older 450 K array. Here we present a significantly updated and improved version of the Bioconductor package ChAMP, which can be used to analyze EPIC and 450k data. Many enhanced functionalities have been added, including correction for cell-type heterogeneity, network analysis and a series of interactive graphical user interfaces. ChAMP is a BioC package available from https://bioconductor.org/packages/release/bioc/html/ChAMP.html. a.teschendorff@ucl.ac.uk or s.beck@ucl.ac.uk or a.feber@ucl.ac.uk. Supplementary data are available at Bioinformatics online. © The Author(s) 2017. Published by Oxford University Press.

  8. Xarray: multi-dimensional data analysis in Python

    NASA Astrophysics Data System (ADS)

    Hoyer, Stephan; Hamman, Joe; Maussion, Fabien

    2017-04-01

    xarray (http://xarray.pydata.org) is an open source project and Python package that provides a toolkit and data structures for N-dimensional labeled arrays, which are the bread and butter of modern geoscientific data analysis. Key features of the package include label-based indexing and arithmetic, interoperability with the core scientific Python packages (e.g., pandas, NumPy, Matplotlib, Cartopy), out-of-core computation on datasets that don't fit into memory, a wide range of input/output options, and advanced multi-dimensional data manipulation tools such as group-by and resampling. In this contribution we will present the key features of the library and demonstrate its great potential for a wide range of applications, from (big-)data processing on super computers to data exploration in front of a classroom.

  9. Mate and Dart: An Instrument Package for Characterizing Solar Energy and Atmospheric Dust on Mars

    NASA Technical Reports Server (NTRS)

    Landis, Geoffrey A.; Jenkins, Phillip; Scheiman, David; Baraona, Cosmo

    2000-01-01

    The MATE (Mars Array Technology Experiment) and DART (Dust Accumulation and Removal Test) instruments were developed to fly as part of the Mars ISPP Precursor (MIP) experiment on the (now postponed) Mars-2001 Surveyor Lander. MATE characterizes the solar energy reaching the surface of Mars, and measures the performance and degradation of solar cells under Martian conditions. DART characterizes the dust environment of Mars, measures the effect of settled dust on solar arrays, and investigates methods to mitigate power loss due to dust accumulation.

  10. Reading in the Content Areas. Learning Package No. 4.

    ERIC Educational Resources Information Center

    Collins, Norma; Smith, Carl, Comp.

    Originally developed for the Department of Defense Schools (DoDDS) system, this learning package on reading in the content areas is designed for teachers who wish to upgrade or expand their teaching skills on their own. The package includes a comprehensive search of the ERIC database; a lecture giving an overview on the topic; the full text of…

  11. Item Unique Identification (IUID) Marking for a Littoral Combat Ship (LCS) Class Mission Module (MM) at the Mission Package Support Facility (MPSF): Implementation Analysis and Development of Optimal Marking Procedures

    DTIC Science & Technology

    2010-06-01

    scanners, readers, or imagers. These types of ADCS devices use two slightly different technologies. Laser scanners use a photodiode to measure the...structure of a ship, but the LCS utilizes modular mission packages that can be removed and replaced when the threat , environment, or mission changes...would need to support a wide array of business applications and users (Clarion, 2009). The DoD’s solution to this deficiency is called IUID. IUID is a

  12. Safety analysis report for packaging (onsite) multicanister overpack cask

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Edwards, W.S.

    1997-07-14

    This safety analysis report for packaging (SARP) documents the safety of shipments of irradiated fuel elements in the MUlticanister Overpack (MCO) and MCO Cask for a highway route controlled quantity, Type B fissile package. This SARP evaluates the package during transfers of (1) water-filled MCOs from the K Basins to the Cold Vacuum Drying Facility (CVDF) and (2) sealed and cold vacuum dried MCOs from the CVDF in the 100 K Area to the Canister Storage Building in the 200 East Area.

  13. FY15 Status of Immersion Phased Array Ultrasonic Probe Development and Performance Demonstration Results for Under Sodium Viewing

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Diaz, Aaron A.; Larche, Michael R.; Mathews, Royce

    2015-09-01

    This Technical Letter Report (TLR) describes work conducted at the Pacific Northwest National Laboratory (PNNL) during FY 2015 on the under-sodium viewing (USV) PNNL project 58745, Work Package AT-15PN230102. This TLR satisfies PNNL’s M3AT-15PN2301027 milestone, and is focused on summarizing the design, development, and evaluation of a two-dimensional matrix phased-array probe referred to as serial number 3 (SN3). In addition, this TLR also provides the results from a performance demonstration of in-sodium target detection trials at 260°C using a one-dimensional 22-element linear array developed in FY14 and referred to as serial number 2 (SN2).

  14. DET/MPS - The GSFC Energy Balance Programs

    NASA Technical Reports Server (NTRS)

    Jagielski, J. M.

    1994-01-01

    Direct Energy Transfer (DET) and MultiMission Spacecraft Modular Power System (MPS) computer programs perform mathematical modeling and simulation to aid in design and analysis of DET and MPS spacecraft power system performance in order to determine energy balance of subsystem. DET spacecraft power system feeds output of solar photovoltaic array and nickel cadmium batteries directly to spacecraft bus. MPS system, Standard Power Regulator Unit (SPRU) utilized to operate array at array's peak power point. DET and MPS perform minute-by-minute simulation of performance of power system. Results of simulation focus mainly on output of solar array and characteristics of batteries. Both packages limited in terms of orbital mechanics, they have sufficient capability to calculate data on eclipses and performance of arrays for circular or near-circular orbits. DET and MPS written in FORTRAN-77 with some VAX FORTRAN-type extensions. Both available in three versions: GSC-13374, for DEC VAX-series computers running VMS. GSC-13443, for UNIX-based computers. GSC-13444, for Apple Macintosh computers.

  15. Modular, Microprocessor-Controlled Flash Lighting System

    NASA Technical Reports Server (NTRS)

    Kiefer, Dwayne; Gray, Elizabeth; Skupinski, Robert; Stachowicz, Arthur; Birchenough, William

    2006-01-01

    A microprocessor-controlled lighting system generates brief, precisely timed, high-intensity flashes of light for scientific imaging at frame rates up to about 1 kHz. The system includes an array of light-emitting diodes (LEDs) that are driven in synchronism with an externally generated timing signal (for example, a timing signal generated by a video camera). The light output can be varied in peak intensity, pulse duration, pulse delay, and pulse rate, all depending on the timing signal and associated externally generated control signals. The array of LEDs comprises as many as 16 LED panels that can be attached together. Each LED panel is a module consisting of a rectangular subarray of 10 by 20 LEDs of advanced design on a printed-circuit board in a mounting frame with a power/control connector. The LED panels are controlled by an LED control module that contains an AC-to-DC power supply, a control board, and 8 LED-panel driver boards. In prior LED panels, the LEDs are packaged at less than maximum areal densities in bulky metal housings that reduce effective active areas. In contrast, in the present LED panels, the LEDs are packed at maximum areal density so as to afford 100-percent active area and so that when panels are joined side by side to form the array, there are no visible seams between them and the proportion of active area is still 100 percent. Each panel produces an illuminance of .5 x 10( exp 4) lux at a distance of 5.8 in. (approx.1.6 cm). The LEDs are driven according to a pulse-width-modulation control scheme that makes it safe to drive the LEDs beyond their rated steady-state currents in order to generate additional light during short periods. The drive current and the pulse-width modulation for each LED panel can be controlled independently of those of the other 15 panels. The maximum allowable duration of each pulse of drive current is a function of the amount of overdrive, the total time to be spent in overdrive operation, and the limitations of the LEDs. The system is configured to limit the overdrive according to values specific to each type of LED in the array. These values are coded into firmware to prevent inadvertent damage to the LED panels.

  16. Scripting MODFLOW model development using Python and FloPy

    USGS Publications Warehouse

    Bakker, Mark; Post, Vincent E. A.; Langevin, Christian D.; Hughes, Joseph D.; White, Jeremy; Starn, Jeffrey; Fienen, Michael N.

    2016-01-01

    Graphical user interfaces (GUIs) are commonly used to construct and postprocess numerical groundwater flow and transport models. Scripting model development with the programming language Python is presented here as an alternative approach. One advantage of Python is that there are many packages available to facilitate the model development process, including packages for plotting, array manipulation, optimization, and data analysis. For MODFLOW-based models, the FloPy package was developed by the authors to construct model input files, run the model, and read and plot simulation results. Use of Python with the available scientific packages and FloPy facilitates data exploration, alternative model evaluations, and model analyses that can be difficult to perform with GUIs. Furthermore, Python scripts are a complete, transparent, and repeatable record of the modeling process. The approach is introduced with a simple FloPy example to create and postprocess a MODFLOW model. A more complicated capture-fraction analysis with a real-world model is presented to demonstrate the types of analyses that can be performed using Python and FloPy.

  17. Planetary and deep space requirements for photovoltaic solar arrays

    NASA Technical Reports Server (NTRS)

    Bankston, C. P.; Bennett, R. B.; Stella, P. M.

    1995-01-01

    In the past 25 years, the majority of interplanetary spacecraft have been powered by nuclear sources. However, as the emphasis on smaller, low cost missions gains momentum, the majority of missions now being planned will use photovoltaic solar arrays. This will present challenges to the solar array builders, inasmuch as planetary requirements usually differ from earth orbital requirements. In addition, these requirements often differ greatly, depending on the specific mission; for example, inner planets vs. outer planets, orbiters vs. flybys, spacecraft vs. landers, and so on. Also, the likelihood of electric propulsion missions will influence the requirements placed on solar array developers. The paper will discuss representative requirements for a range of planetary missions now in the planning stages. Insofar as inner planets are concerned, a Mercury orbiter is being studied with many special requirements. Solar arrays would be exposed to high temperatures and a potentially high radiation environment, and will need to be increasingly pointed off sun as the vehicle approaches Mercury. Identification and development of cell materials and arrays at high incidence angles will be critical to the design. Missions to the outer solar system that have been studied include a Galilean orbiter and a flight to the Kuiper belt. While onboard power requirements would be small (as low as 10 watts), the solar intensity will require relatively large array areas. As a result, such missions will demand extremely compact packaging and low mass structures to conform to launch vehicle constraints. In turn, the large are, low mass designs will impact allowable spacecraft loads. Inflatable array structures, with and without concentration, and multiband gap cells will be considered if available. In general, the highest efficiency cell technologies operable under low intensity, low temperature conditions are needed. Solar arrays will power missions requiring as little as approximately 100 watts, up to several kilowatts (at Earth) in the case of solar electric propulsion missions. Thus, mass and stowage volume minimization will be required over a range of array sizes. Concentrator designs, inflatable structures, and the combination of solar arrays with the telecommunications system have been proposed. Performance, launch vehicle constraints, an cost will be the principal parameters in the design trade space. Other special applications will also be discussed, including requirements relating to planetary landers and probes. In those cases, issues relating to shock loads on landing, operability in (possibly dusty) atmospheres, and extreme temperature cycles must be considered, in addition to performance, stowed volume, and costs.

  18. PRISM Spectrograph Optical Design

    NASA Technical Reports Server (NTRS)

    Chipman, Russell A.

    1995-01-01

    The objective of this contract is to explore optical design concepts for the PRISM spectrograph and produce a preliminary optical design. An exciting optical configuration has been developed which will allow both wavelength bands to be imaged onto the same detector array. At present the optical design is only partially complete because PRISM will require a fairly elaborate optical system to meet its specification for throughput (area*solid angle). The most complex part of the design, the spectrograph camera, is complete, providing proof of principle that a feasible design is attainable. This camera requires 3 aspheric mirrors to fit inside the 20x60 cm cross-section package. A complete design with reduced throughput (1/9th) has been prepared. The design documents the optical configuration concept. A suitable dispersing prism material, CdTe, has been identified for the prism spectrograph, after a comparison of many materials.

  19. Reliability and accuracy of three imaging software packages used for 3D analysis of the upper airway on cone beam computed tomography images.

    PubMed

    Chen, Hui; van Eijnatten, Maureen; Wolff, Jan; de Lange, Jan; van der Stelt, Paul F; Lobbezoo, Frank; Aarab, Ghizlane

    2017-08-01

    The aim of this study was to assess the reliability and accuracy of three different imaging software packages for three-dimensional analysis of the upper airway using CBCT images. To assess the reliability of the software packages, 15 NewTom 5G ® (QR Systems, Verona, Italy) CBCT data sets were randomly and retrospectively selected. Two observers measured the volume, minimum cross-sectional area and the length of the upper airway using Amira ® (Visage Imaging Inc., Carlsbad, CA), 3Diagnosys ® (3diemme, Cantu, Italy) and OnDemand3D ® (CyberMed, Seoul, Republic of Korea) software packages. The intra- and inter-observer reliability of the upper airway measurements were determined using intraclass correlation coefficients and Bland & Altman agreement tests. To assess the accuracy of the software packages, one NewTom 5G ® CBCT data set was used to print a three-dimensional anthropomorphic phantom with known dimensions to be used as the "gold standard". This phantom was subsequently scanned using a NewTom 5G ® scanner. Based on the CBCT data set of the phantom, one observer measured the volume, minimum cross-sectional area, and length of the upper airway using Amira ® , 3Diagnosys ® , and OnDemand3D ® , and compared these measurements with the gold standard. The intra- and inter-observer reliability of the measurements of the upper airway using the different software packages were excellent (intraclass correlation coefficient ≥0.75). There was excellent agreement between all three software packages in volume, minimum cross-sectional area and length measurements. All software packages underestimated the upper airway volume by -8.8% to -12.3%, the minimum cross-sectional area by -6.2% to -14.6%, and the length by -1.6% to -2.9%. All three software packages offered reliable volume, minimum cross-sectional area and length measurements of the upper airway. The length measurements of the upper airway were the most accurate results in all software packages. All software packages underestimated the upper airway dimensions of the anthropomorphic phantom.

  20. High Energy 2-Micron Laser Developments

    NASA Technical Reports Server (NTRS)

    Yu, Jirong; Trieu, Bo C.; Petros, Mulugeta; Bai, Yingxin; Petzar, Paul J.; Koch, Grady J.; Singh, Upendra N.; Kavaya, Michael J.

    2007-01-01

    A master oscillator power amplifier, high energy Q-switched 2-micron laser system has been recently demonstrated. The laser and amplifiers are all designed in side-pumped rod configuration, pumped by back-cooled conductive packaged GaAlAs diode laser arrays. This 2-micron laser system provides nearly transform limited beam quality.

  1. Wafer-level radiometric performance testing of uncooled microbolometer arrays

    NASA Astrophysics Data System (ADS)

    Dufour, Denis G.; Topart, Patrice; Tremblay, Bruno; Julien, Christian; Martin, Louis; Vachon, Carl

    2014-03-01

    A turn-key semi-automated test system was constructed to perform on-wafer testing of microbolometer arrays. The system allows for testing of several performance characteristics of ROIC-fabricated microbolometer arrays including NETD, SiTF, ROIC functionality, noise and matrix operability, both before and after microbolometer fabrication. The system accepts wafers up to 8 inches in diameter and performs automated wafer die mapping using a microscope camera. Once wafer mapping is completed, a custom-designed quick insertion 8-12 μm AR-coated Germanium viewport is placed and the chamber is pumped down to below 10-5 Torr, allowing for the evaluation of package-level focal plane array (FPA) performance. The probe card is electrically connected to an INO IRXCAM camera core, a versatile system that can be adapted to many types of ROICs using custom-built interface printed circuit boards (PCBs). We currently have the capability for testing 384x288, 35 μm pixel size and 160x120, 52 μm pixel size FPAs. For accurate NETD measurements, the system is designed to provide an F/1 view of two rail-mounted blackbodies seen through the Germanium window by the die under test. A master control computer automates the alignment of the probe card to the dies, the positioning of the blackbodies, FPA image frame acquisition using IRXCAM, as well as data analysis and storage. Radiometric measurement precision has been validated by packaging dies measured by the automated probing system and re-measuring the SiTF and Noise using INO's pre-existing benchtop system.

  2. High resolution phoswich gamma-ray imager utilizing monolithic MPPC arrays with submillimeter pixelized crystals

    NASA Astrophysics Data System (ADS)

    Kato, T.; Kataoka, J.; Nakamori, T.; Kishimoto, A.; Yamamoto, S.; Sato, K.; Ishikawa, Y.; Yamamura, K.; Kawabata, N.; Ikeda, H.; Kamada, K.

    2013-05-01

    We report the development of a high spatial resolution tweezers-type coincidence gamma-ray camera for medical imaging. This application consists of large-area monolithic Multi-Pixel Photon Counters (MPPCs) and submillimeter pixelized scintillator matrices. The MPPC array has 4 × 4 channels with a three-side buttable, very compact package. For typical operational gain of 7.5 × 105 at + 20 °C, gain fluctuation over the entire MPPC device is only ± 5.6%, and dark count rates (as measured at the 1 p.e. level) amount to <= 400 kcps per channel. We selected Ce-doped (Lu,Y)2(SiO4)O (Ce:LYSO) and a brand-new scintillator, Ce-doped Gd3Al2Ga3O12 (Ce:GAGG) due to their high light yield and density. To improve the spatial resolution, these scintillators were fabricated into 15 × 15 matrices of 0.5 × 0.5 mm2 pixels. The Ce:LYSO and Ce:GAGG scintillator matrices were assembled into phosphor sandwich (phoswich) detectors, and then coupled to the MPPC array along with an acrylic light guide measuring 1 mm thick, and with summing operational amplifiers that compile the signals into four position-encoded analog outputs being used for signal readout. Spatial resolution of 1.1 mm was achieved with the coincidence imaging system using a 22Na point source. These results suggest that the gamma-ray imagers offer excellent potential for applications in high spatial medical imaging.

  3. Phenological Parameters Estimation Tool

    NASA Technical Reports Server (NTRS)

    McKellip, Rodney D.; Ross, Kenton W.; Spruce, Joseph P.; Smoot, James C.; Ryan, Robert E.; Gasser, Gerald E.; Prados, Donald L.; Vaughan, Ronald D.

    2010-01-01

    The Phenological Parameters Estimation Tool (PPET) is a set of algorithms implemented in MATLAB that estimates key vegetative phenological parameters. For a given year, the PPET software package takes in temporally processed vegetation index data (3D spatio-temporal arrays) generated by the time series product tool (TSPT) and outputs spatial grids (2D arrays) of vegetation phenological parameters. As a precursor to PPET, the TSPT uses quality information for each pixel of each date to remove bad or suspect data, and then interpolates and digitally fills data voids in the time series to produce a continuous, smoothed vegetation index product. During processing, the TSPT displays NDVI (Normalized Difference Vegetation Index) time series plots and images from the temporally processed pixels. Both the TSPT and PPET currently use moderate resolution imaging spectroradiometer (MODIS) satellite multispectral data as a default, but each software package is modifiable and could be used with any high-temporal-rate remote sensing data collection system that is capable of producing vegetation indices. Raw MODIS data from the Aqua and Terra satellites is processed using the TSPT to generate a filtered time series data product. The PPET then uses the TSPT output to generate phenological parameters for desired locations. PPET output data tiles are mosaicked into a Conterminous United States (CONUS) data layer using ERDAS IMAGINE, or equivalent software package. Mosaics of the vegetation phenology data products are then reprojected to the desired map projection using ERDAS IMAGINE

  4. hemaClass.org: Online One-By-One Microarray Normalization and Classification of Hematological Cancers for Precision Medicine.

    PubMed

    Falgreen, Steffen; Ellern Bilgrau, Anders; Brøndum, Rasmus Froberg; Hjort Jakobsen, Lasse; Have, Jonas; Lindblad Nielsen, Kasper; El-Galaly, Tarec Christoffer; Bødker, Julie Støve; Schmitz, Alexander; H Young, Ken; Johnsen, Hans Erik; Dybkær, Karen; Bøgsted, Martin

    2016-01-01

    Dozens of omics based cancer classification systems have been introduced with prognostic, diagnostic, and predictive capabilities. However, they often employ complex algorithms and are only applicable on whole cohorts of patients, making them difficult to apply in a personalized clinical setting. This prompted us to create hemaClass.org, an online web application providing an easy interface to one-by-one RMA normalization of microarrays and subsequent risk classifications of diffuse large B-cell lymphoma (DLBCL) into cell-of-origin and chemotherapeutic sensitivity classes. Classification results for one-by-one array pre-processing with and without a laboratory specific RMA reference dataset were compared to cohort based classifiers in 4 publicly available datasets. Classifications showed high agreement between one-by-one and whole cohort pre-processsed data when a laboratory specific reference set was supplied. The website is essentially the R-package hemaClass accompanied by a Shiny web application. The well-documented package can be used to run the website locally or to use the developed methods programmatically. The website and R-package is relevant for biological and clinical lymphoma researchers using affymetrix U-133 Plus 2 arrays, as it provides reliable and swift methods for calculation of disease subclasses. The proposed one-by-one pre-processing method is relevant for all researchers using microarrays.

  5. SAR processing on the MPP

    NASA Technical Reports Server (NTRS)

    Batcher, K. E.; Eddey, E. E.; Faiss, R. O.; Gilmore, P. A.

    1981-01-01

    The processing of synthetic aperture radar (SAR) signals using the massively parallel processor (MPP) is discussed. The fast Fourier transform convolution procedures employed in the algorithms are described. The MPP architecture comprises an array unit (ARU) which processes arrays of data; an array control unit which controls the operation of the ARU and performs scalar arithmetic; a program and data management unit which controls the flow of data; and a unique staging memory (SM) which buffers and permutes data. The ARU contains a 128 by 128 array of bit-serial processing elements (PE). Two-by-four surarrays of PE's are packaged in a custom VLSI HCMOS chip. The staging memory is a large multidimensional-access memory which buffers and permutes data flowing with the system. Efficient SAR processing is achieved via ARU communication paths and SM data manipulation. Real time processing capability can be realized via a multiple ARU, multiple SM configuration.

  6. Uncooled infrared focal plane array imaging in China

    NASA Astrophysics Data System (ADS)

    Lei, Shuyu

    2015-06-01

    This article reviews the development of uncooled infrared focal plane array (UIFPA) imaging in China in the past decade. Sensors based on optical or electrical read-out mechanism were developed but the latter dominates the market. In resistive bolometers, VOx and amorphous silicon are still the two major thermal-sensing materials. The specifications of the IRFPA made by different manufactures were collected and compared. Currently more than five Chinese companies and institutions design and fabricate uncooled infrared focal plane array. Some devices have sensitivity as high as 30 mK; the largest array for commercial products is 640×512 and the smallest pixel size is 17 μm. Emphasis is given on the pixel MEMS design, ROIC design, fabrication, and packaging of the IRFPA manufactured by GWIC, especially on design for high sensitivities, low noise, better uniformity and linearity, better stabilization for whole working temperature range, full-digital design, etc.

  7. Characterization of Settled Atmospheric Dust by the DART Experiment

    NASA Technical Reports Server (NTRS)

    Landis, Geoffrey A.; Jenkins, Phillip P.; Baraona, Cosmo

    1999-01-01

    The DART ("Dust Accumulation and Removal Test") package is an experiment which will fly as part of the MIP experiment on the Mars-2001 Surveyor Lander. Dust deposition could be a significant problem for photovoltaic array operation for long duration emissions on the surface of Mars. Measurements made by Pathfinder showed 0.3% loss of solar array performance per day due to dust obscuration. The DART experiment is designed to quantify dust deposition from the Mars atmosphere, measure the properties of settled dust, measure the effect of dust deposition on the array performance, and test several methods of mitigating the effect of settled dust on a solar array. Although the purpose of DART (along with its sister experiment, MATE) is to gather information critical to the design of future power systems on the surface of Mars, the dust characterization instrumentation on DART will also provide significant scientific data on the properties of settled atmospheric dust.

  8. Cantilever arrayed blood pressure sensor for arterial applanation tonometry.

    PubMed

    Lee, Byeungleul; Jeong, Jinwoo; Kim, Jinseok; Kim, Bonghwan; Chun, Kukjin

    2014-03-01

    The authors developed a cantilever-arrayed blood pressure sensor array fabricated by (111) silicon bulk-micromachining for the non-invasive and continuous measurement of blood pressure. The blood pressure sensor measures the blood pressure based on the change in the resistance of the piezoresistor on a 5-microm-thick-arrayed perforated membrane and 20-microm-thick metal pads. The length and the width of the unit membrane are 210 and 310 microm, respectively. The width of the insensible zone between the adjacent units is only 10 microm. The resistance change over contact force was measured to verify the performance. The good linearity of the result confirmed that the polydimethylsiloxane package transfers the forces appropriately. The measured sensitivity was about 4.5%/N. The maximum measurement range and the resolution of the fabricated blood pressure sensor were greater than 900 mmHg (= 120 kPa) and less than 1 mmHg (= 133.3 Pa), respectively.

  9. IOTA: the array controller for a gigapixel OTCCD camera for Pan-STARRS

    NASA Astrophysics Data System (ADS)

    Onaka, Peter; Tonry, John; Luppino, Gerard; Lockhart, Charles; Lee, Aaron; Ching, Gregory; Isani, Sidik; Uyeshiro, Robin

    2004-09-01

    The PanSTARRS project has undertaken an ambitious effort to develop a completely new array controller architecture that is fundamentally driven by the large 1gigapixel, low noise, high speed OTCCD mosaic requirements as well as the size, power and weight restrictions of the PanSTARRS telescope. The result is a very small form factor next generation controller scalar building block with 1 Gigabit Ethernet interfaces that will be assembled into a system that will readout 512 outputs at ~1 Megapixel sample rates on each output. The paper will also discuss critical technology and fabrication techniques such as greater than 1MHz analog to digital converters (ADCs), multiple fast sampling and digital calculation of multiple correlated samples (DMCS), ball grid array (BGA) packaged circuits, LINUX running on embedded field programmable gate arrays (FPGAs) with hard core microprocessors for the prototype currently being developed.

  10. Monolithic short wave infrared (SWIR) detector array

    NASA Technical Reports Server (NTRS)

    1983-01-01

    A monolithic self-scanned linear detector array was developed for remote sensing in the 1.1- 2.4-micron spectral region. A high-density IRCCD test chip was fabricated to verify new design approaches required for the detector array. The driving factors in the Schottky barrier IRCCD (Pdsub2Si) process development are the attainment of detector yield, uniformity, adequate quantum efficiency, and lowest possible dark current consistent with radiometric accuracy. A dual-band module was designed that consists of two linear detector arrays. The sensor architecture places the floating diffusion output structure in the middle of the chip, away from the butt edges. A focal plane package was conceptualized and includes a polycrystalline silicon substrate carrying a two-layer, thick-film interconnecting conductor pattern and five epoxy-mounted modules. A polycrystalline silicon cover encloses the modules and bond wires, and serves as a radiation and EMI shield, thermal conductor, and contamination seal.

  11. Large Format, Background Limited Arrays of Kinetic Inductance Detectors for Sub-mm Astronomy

    NASA Astrophysics Data System (ADS)

    Baselmans, Jochem

    2018-01-01

    We present the development of large format imaging arrays for sub-mm astronomy based upon microwave Kinetic Inductance detectors and their read-out. In particular we focus on the arrays developed for the A-MKID instrument for the APEX telescope. AMKID contains 2 focal plane arrays, covering a field of view of 15?x15?. One array is optimized for the 350 GHz telluric window, the other for the 850 GHz window. Both arrays are constructed from four 61 x 61 mm detector chips, each of which contains up to 3400 detectors and up to 880 detectors per readout line. The detectors are lens antenna coupled MKIDs made from NbTiN and Aluminium that reach photon noise limited sensitivity in combination with a high optical coupling. The lens-antenna radiation coupling enables the use of 4K optics and Lyot stop due to the intrinsic directivity of the detector beam, allowing a simple cryogenic architecture. We discuss the pixel design and verification, detector packaging and the array performance. We will also discuss the readout system, which is a combination of a digital and analog back-end that can read-out up to 4000 pixels simultaneously using frequency division multiplexing.

  12. How Many Peripheral Solder Joints in a Surface Mounted Design Experience Inelastic Strains?

    NASA Astrophysics Data System (ADS)

    Suhir, E.; Yi, S.; Ghaffarian, R.

    2017-03-01

    It has been established that it is the peripheral solder joints that are the most vulnerable in the ball-grid-array (BGA) and column-grid-array (CGA) designs and most often fail. As far as the long-term reliability of a soldered microelectronics assembly as a whole is concerned, it makes a difference, if just one or more peripheral joints experience inelastic strains. It is clear that the low cycle fatigue lifetime of the solder system is inversely proportional to the number of joints that simultaneously experience inelastic strains. A simple and physically meaningful analytical expression (formula) is obtained for the prediction, at the design stage, of the number of such joints, if any, for the given effective thermal expansion (contraction) mismatch of the package and PCB; materials and geometrical characteristics of the package/PCB assembly; package size; and, of course, the level of the yield stress in the solder material. The suggested formula can be used to determine if the inelastic strains in the solder material could be avoided by the proper selection of the above characteristics and, if not, how many peripheral joints are expected to simultaneously experience inelastic strains. The general concept is illustrated by a numerical example carried out for a typical BGA package. The suggested analytical model (formula) is applicable to any soldered microelectronics assembly. The roles of other important factors, such as, e.g., solder material anisotropy, grain size, and their random orientation within a joint, are viewed in this analysis as less important factors than the level of the interfacial stress. The roles of these factors will be accounted for in future work and considered, in addition to the location of the joint, in a more complicated, more sophisticated, and more comprehensive reliability/fatigue model.

  13. Development of low-SWaP and low-noise InGaAs detectors

    NASA Astrophysics Data System (ADS)

    Fraenkel, R.; Berkowicz, E.; Bikov, L.; Elishkov, R.; Giladi, A.; Hirsh, I.; Ilan, E.; Jakobson, C.; Kondrashov, P.; Louzon, E.; Nevo, I.; Pivnik, I.; Tuito, A.; Vasserman, S.

    2017-02-01

    In recent years SCD has developed InGaAs/InP technology for Short-Wave Infrared (SWIR) imaging. The first product, Cardinal 640, has a 640×512 (VGA) format at 15μm pitch, and more than two thousand units have already been delivered to customers. Recently we have also introduced Cardinal 1280 which is an SXGA array with 10μm pitch aimed for long-range high end platforms [1]. One of the big challenges facing the SWIR technology is its proliferation to widespread low cost and low SWaP applications, specifically Low Light Level (LLL) and Image Intensifier (II) replacements. In order to achieve this goal we have invested and combined efforts in several design and development directions: 1. Optimization of the InGaAs pixel array, reducing the dark current below 2fA at 20° C in order to save TEC cooling power under harsh light and environmental conditions. 2. Design of a new "Low Noise" ROIC targeting 15e noise floor and improved active imaging capabilities 3. Design of compact, low SWaP and low cost packages. In this context we have developed 2 types of packages: a non-hermetic package with thermo-electric cooler (TEC) and a hermetic TEC-Less ceramic package. 4. Development of efficient TEC-Less algorithms for optimal imaging at both day-light and low light level conditions. The result of these combined efforts is a compact low SWaP detector that provides equivalent performance to Gen III image intensifier under starlight conditions. In this paper we will present results from lab and field experiments that will support this claim.

  14. missMethyl: an R package for analyzing data from Illumina's HumanMethylation450 platform.

    PubMed

    Phipson, Belinda; Maksimovic, Jovana; Oshlack, Alicia

    2016-01-15

    DNA methylation is one of the most commonly studied epigenetic modifications due to its role in both disease and development. The Illumina HumanMethylation450 BeadChip is a cost-effective way to profile >450 000 CpGs across the human genome, making it a popular platform for profiling DNA methylation. Here we introduce missMethyl, an R package with a suite of tools for performing normalization, removal of unwanted variation in differential methylation analysis, differential variability testing and gene set analysis for the 450K array. missMethyl is an R package available from the Bioconductor project at www.bioconductor.org. alicia.oshlack@mcri.edu.au Supplementary data are available at Bioinformatics online. © The Author 2015. Published by Oxford University Press. All rights reserved. For Permissions, please e-mail: journals.permissions@oup.com.

  15. KAPPA -- Kernel Application Package

    NASA Astrophysics Data System (ADS)

    Currie, Malcolm J.; Berry, David. S.

    KAPPA is an applications package comprising about 180 general-purpose commands for image processing, data visualisation, and manipulation of the standard Starlink data format---the NDF. It is intended to work in conjunction with Starlink's various specialised packages. In addition to the NDF, KAPPA can also process data in other formats by using the `on-the-fly' conversion scheme. Many commands can process data arrays of arbitrary dimension, and others work on both spectra and images. KAPPA operates from both the UNIX C-shell and the ICL command language. This document describes how to use KAPPA and its features. There is some description of techniques too, including a section on writing scripts. This document includes several tutorials and is illustrated with numerous examples. The bulk of this document comprises detailed descriptions of each command as well as classified and alphabetical summaries.

  16. Optical sensor array platform based on polymer electronic devices

    NASA Astrophysics Data System (ADS)

    Koetse, Marc M.; Rensing, Peter A.; Sharpe, Ruben B. A.; van Heck, Gert T.; Allard, Bart A. M.; Meulendijks, Nicole N. M. M.; Kruijt, Peter G. M.; Tijdink, Marcel W. W. J.; De Zwart, René M.; Houben, René J.; Enting, Erik; van Veen, Sjaak J. J. F.; Schoo, Herman F. M.

    2007-10-01

    Monitoring of personal wellbeing and optimizing human performance are areas where sensors have only begun to be used. One of the reasons for this is the specific demands that these application areas put on the underlying technology and system properties. In many cases these sensors will be integrated in clothing, be worn on the skin, or may even be placed inside the body. This implies that flexibility and wearability of the systems is essential for their success. Devices based on polymer semiconductors allow for these demands since they can be fabricated with thin film technology. The use of thin film device technology allows for the fabrication of very thin sensors (e.g. integrated in food product packaging), flexible or bendable sensors in wearables, large area/distributed sensors, and intrinsically low-cost applications in disposable products. With thin film device technology a high level of integration can be achieved with parts that analyze signals, process and store data, and interact over a network. Integration of all these functions will inherently lead to better cost/performance ratios, especially if printing and other standard polymer technology such as high precision moulding is applied for the fabrication. In this paper we present an optical transmission sensor array based on polymer semiconductor devices made by thin film technology. The organic devices, light emitting diodes, photodiodes and selective medium chip, are integrated with classic electronic components. Together they form a versatile sensor platform that allows for the quantitative measurement of 100 channels and communicates wireless with a computer. The emphasis is given to the sensor principle, the design, fabrication technology and integration of the thin film devices.

  17. Real-time temperature monitoring during radiofrequency treatments on ex-vivo animal model by fiber Bragg grating sensors

    NASA Astrophysics Data System (ADS)

    Palumbo, Giovanna; Tosi, Daniele; Schena, Emiliano; Massaroni, Carlo; Ippolito, Juliet; Verze, Paolo; Carlomagno, Nicola; Tammaro, Vincenzo; Iadicicco, Agostino; Campopiano, Stefania

    2017-05-01

    Fiber Bragg Grating (FBG) sensors applied to bio-medical procedures such as surgery and rehabilitation are a valid alternative to traditional sensing techniques due to their unique characteristics. Herein we propose the use of FBG sensor arrays for accurate real-time temperature measurements during multi-step RadioFrequency Ablation (RFA) based thermal tumor treatment. Real-time temperature monitoring in the RF-applied region represents a valid feedback for the success of the thermo-ablation procedure. In order to create a thermal multi-point map around the tumor area to be treated, a proper sensing configuration was developed. In particular, the RF probe of a commercial medical instrumentation, has been equipped with properly packaged FBGs sensors. Moreover, in order to discriminate the treatment areas to be ablated as precisely as possible, a second array 3.5 cm long, made by several FBGs was used. The results of the temperature measurements during the RFA experiments conducted on ex-vivo animal liver and kidney tissues are presented herein. The proposed FBGs based solution has proven to be capable of distinguish different and consecutive discharges and for each of them, to measure the temperature profile with a resolution of 0.1 °C and a minimum spatial resolution of 5mm. Based upon our experiments, it is possible to confirm that the temperature decreases with distance from a RF peak ablation, in accordance with RF theory. The proposed solution promises to be very useful for the surgeon because a real-time temperature feedback allows for the adaptation of RFA parameters during surgery and better delineates the area under treatment.

  18. Mountain-Plains Master Course List. Curriculum Areas: Job Titles: Learning Activity Packages: Courses: Units.

    ERIC Educational Resources Information Center

    Mountain-Plains Education and Economic Development Program, Inc., Glasgow AFB, MT.

    The document contains a master listing of all Mountain-Plains curriculum, compiled by job title, course, unit and LAP (Learning Activity Package), and arranged in numerical order by curriculum area. Preceding each curriculum area is a page of explanatory notes describing the curriculum area and including relevant job descriptions. Where a job…

  19. Miniature curved artificial compound eyes

    PubMed Central

    Floreano, Dario; Pericet-Camara, Ramon; Viollet, Stéphane; Ruffier, Franck; Brückner, Andreas; Leitel, Robert; Buss, Wolfgang; Menouni, Mohsine; Expert, Fabien; Juston, Raphaël; Dobrzynski, Michal Karol; L’Eplattenier, Geraud; Recktenwald, Fabian; Mallot, Hanspeter A.; Franceschini, Nicolas

    2013-01-01

    In most animal species, vision is mediated by compound eyes, which offer lower resolution than vertebrate single-lens eyes, but significantly larger fields of view with negligible distortion and spherical aberration, as well as high temporal resolution in a tiny package. Compound eyes are ideally suited for fast panoramic motion perception. Engineering a miniature artificial compound eye is challenging because it requires accurate alignment of photoreceptive and optical components on a curved surface. Here, we describe a unique design method for biomimetic compound eyes featuring a panoramic, undistorted field of view in a very thin package. The design consists of three planar layers of separately produced arrays, namely, a microlens array, a neuromorphic photodetector array, and a flexible printed circuit board that are stacked, cut, and curved to produce a mechanically flexible imager. Following this method, we have prototyped and characterized an artificial compound eye bearing a hemispherical field of view with embedded and programmable low-power signal processing, high temporal resolution, and local adaptation to illumination. The prototyped artificial compound eye possesses several characteristics similar to the eye of the fruit fly Drosophila and other arthropod species. This design method opens up additional vistas for a broad range of applications in which wide field motion detection is at a premium, such as collision-free navigation of terrestrial and aerospace vehicles, and for the experimental testing of insect vision theories. PMID:23690574

  20. A Triboelectric Sensor Array for Electrostatic Studies on the Lunar Surface

    NASA Technical Reports Server (NTRS)

    Johansen, Michael R.; Mackey, Paul J.; Calle, C. I.

    2015-01-01

    The moons electrostatic environment requires careful consideration in the development of future lunar landers. Electrostatically charged dust was well documented during the Apollo missions to cause thermal control, mechanical, and visibility issues. The fine dust particles that make up the surface are electrostatically charged as a result of numerous charging mechanisms. The relatively dry conditions on the moon creates a prime tribocharging environment during surface operations. The photoelectric effect is dominant for lunar day static charging, while plasma electrons are the main contributor for lunar night electrostatic effects. Electrostatic charging is also dependent on solar intensity, Earth-moon relative positions, and cosmic ray flux. This leads to a very complex and dynamic electrostatic environment that must be studied for the success of long term lunar missions.In order to better understand the electrostatic environment of planetary bodies, Kennedy Space Center, in previous collaboration with the Jet Propulsion Laboratory, has developed an electrostatic sensor suite. One of the instruments included in this package is the triboelectric sensor array. It is comprised of strategically selected materials that span the triboelectric series and that also have previous spaceflight history. In this presentation, we discuss detailed testing with the triboelectric sensor array performed at Kennedy Space Center. We will discuss potential benefits and use cases of this low mass, low cost sensor package, both for science and for mission success.

  1. Hydrogeologic unit flow characterization using transition probability geostatistics.

    PubMed

    Jones, Norman L; Walker, Justin R; Carle, Steven F

    2005-01-01

    This paper describes a technique for applying the transition probability geostatistics method for stochastic simulation to a MODFLOW model. Transition probability geostatistics has some advantages over traditional indicator kriging methods including a simpler and more intuitive framework for interpreting geologic relationships and the ability to simulate juxtapositional tendencies such as fining upward sequences. The indicator arrays generated by the transition probability simulation are converted to layer elevation and thickness arrays for use with the new Hydrogeologic Unit Flow package in MODFLOW 2000. This makes it possible to preserve complex heterogeneity while using reasonably sized grids and/or grids with nonuniform cell thicknesses.

  2. Systems analysis of Mars solar electric propulsion vehicles

    NASA Technical Reports Server (NTRS)

    Hickman, J. M.; Curtis, H. B.; Kenny, B. H.; Sefcik, R. J.

    1990-01-01

    Mission performance, mass, initial power, and cost are determined for solar electric propulsion vehicles across a range of payload masses, reference powers, and mission trajectories. Thick radiation shielding is added to arrays using indium phosphide or III-V multijunction solar cells to reduce the damage incurred through the radiation belts. Special assessments of power management and distribution systems, atmospheric drag, and energy storage are made. It is determined that atmospheric drag is of no great concern and that the energy storage used in countering drag is unnecessary. A scheme to package the arrays, masts, and ion thrusters into a single fairing is presented.

  3. CRISPRCasFinder, an update of CRISRFinder, includes a portable version, enhanced performance and integrates search for Cas proteins.

    PubMed

    Couvin, David; Bernheim, Aude; Toffano-Nioche, Claire; Touchon, Marie; Michalik, Juraj; Néron, Bertrand; C Rocha, Eduardo P; Vergnaud, Gilles; Gautheret, Daniel; Pourcel, Christine

    2018-05-22

    CRISPR (clustered regularly interspaced short palindromic repeats) arrays and their associated (Cas) proteins confer bacteria and archaea adaptive immunity against exogenous mobile genetic elements, such as phages or plasmids. CRISPRCasFinder allows the identification of both CRISPR arrays and Cas proteins. The program includes: (i) an improved CRISPR array detection tool facilitating expert validation based on a rating system, (ii) prediction of CRISPR orientation and (iii) a Cas protein detection and typing tool updated to match the latest classification scheme of these systems. CRISPRCasFinder can either be used online or as a standalone tool compatible with Linux operating system. All third-party software packages employed by the program are freely available. CRISPRCasFinder is available at https://crisprcas.i2bc.paris-saclay.fr.

  4. Solid state laser disk amplifer architecture: the normal-incidence stack

    DOEpatents

    Dane, C. Brent; Albrecht, Georg F.; Rotter, Mark D.

    2005-01-25

    Normal incidence stack architecture coupled with the development of diode array pumping enables the power/energy per disk to be increased, a reduction in beam distortions by orders of magnitude, a beam propagation no longer restricted to only one direction of polarization, and the laser becomes so much more amendable to robust packaging.

  5. Small, Optically-Driven Power Source

    NASA Technical Reports Server (NTRS)

    Cockrum, Richard H.; Wang, Ke-Li J.

    1988-01-01

    Power transmitted along fiber-optic cables. Transmitted as infrared light along fiber-optic cable, converted to electricity to supply small electronic circuit. Power source and circuit remains electrically isolated from each other for safety or reduces electromagnetic interference. Array of diodes made by standard integrated-circuit techniques and packaged for mounting at end of fiber-optic cable.

  6. Apollo lunar surface experiments package

    NASA Technical Reports Server (NTRS)

    1972-01-01

    The ALSEP program status and monthly progress are reported. Environmental and quality control tests and test results are described. Details are given on the Apollo 17 Array E, and the lunar seismic profiling, ejecta and meteorites, mass spectrometer, surface gravimeter, and heat flow experiments. Monitoring of the four ALSEP systems on the moon is also described.

  7. Improved charge injection device and a focal plane interface electronics board for stellar tracking

    NASA Technical Reports Server (NTRS)

    Michon, G. J.; Burke, H. K.

    1984-01-01

    An improved Charge Injection Device (CID) stellar tracking sensor and an operating sensor in a control/readout electronics board were developed. The sensor consists of a shift register scanned, 256x256 CID array organized for readout of 4x4 subarrays. The 4x4 subarrays can be positioned anywhere within the 256x256 array with a 2 pixel resolution. This allows continuous tracking of a number of stars simultaneously since nine pixels (3x3) centered on any star can always be read out. Organization and operation of this sensor and the improvements in design and semiconductor processing are described. A hermetic package incorporating an internal thermoelectric cooler assembled using low temperature solders was developed. The electronics board, which contains the sensor drivers, amplifiers, sample hold circuits, multiplexer, analog to digital converter, and the sensor temperature control circuits, is also described. Packaged sensors were evaluated for readout efficiency, spectral quantum efficiency, temporal noise, fixed pattern noise, and dark current. Eight sensors along with two tracker electronics boards were completed, evaluated, and delivered.

  8. A Portable Presentation Package for Audio-Visual Instruction. Technical Documentary Report.

    ERIC Educational Resources Information Center

    Smith, Edgar A.; And Others

    The Portable Presentation Package is a prototype of an audiovisual equipment package designed to facilitate technical training in remote areas, situations in which written communications are difficult, or in situations requiring rapid presentation of instructional material. The major criteria employed in developing the package were (1) that the…

  9. Reliability of CCGA 1152 and CCGA 1272 Interconnect Packages for Extreme Thermal Environments

    NASA Technical Reports Server (NTRS)

    Ramesham, Rajeshuni

    2013-01-01

    Ceramic column grid array (CCGA) packages have been increasing in use based on their advantages of high interconnect density, very good thermal and electrical performance, and compatibility with standard surface-mount packaging assembly processes. CCGA packages are used in space applications such as in logics and microprocessor functions, telecommunications, flight avionics, and payload electronics. As these packages tend to have less solder joint strain relief than leaded packages, the reliability of CCGA packages is very important for short- and long-term space missions. Certain planetary satellites require operations of thermally uncontrolled hardware under extremely cold and hot temperatures with large diurnal temperature change from day to night. The planetary protection requires the hardware to be baked at +125 C for 72 hours to kill microbugs to avoid any biological contamination, especially for sample return missions. Therefore, the present CCGA package reliability research study has encompassed the temperature range of 185 to +125 C to cover various NASA deep space missions. Advanced 1152 and 1272 CCGA packaging interconnects technology test hardware objects have been subjected to ex treme temperature thermal cycles from 185 to +125 C. X-ray inspections of CCGA packages have been made before thermal cycling. No anomalous behavior and process problems were observed in the x-ray images. The change in resistance of the daisy-chained CCGA interconnects was measured as a function of increasing number of thermal cycles. Electrical continuity measurements of daisy chains have shown no anomalies, even until 596 thermal cycles. Optical inspections of hardware have shown a significant fatigue for CCGA 1152 packages over CCGA 1272 packages. No catastrophic failures have been observed yet in the results. Process qualification and assembly are required to optimize the CCGA assembly processes. Optical inspections of CCGA boards have been made after 258 and 596 thermal cycles. Corner columns have started showing significant fatigue per optical inspection results.

  10. A compact high resolution flat panel PET detector based on the new 4-side buttable MPPC for biomedical applications.

    PubMed

    Wang, Qiang; Wen, Jie; Ravindranath, Bosky; O'Sullivan, Andrew W; Catherall, David; Li, Ke; Wei, Shouyi; Komarov, Sergey; Tai, Yuan-Chuan

    2015-09-11

    Compact high-resolution panel detectors using virtual pinhole (VP) PET geometry can be inserted into existing clinical or pre-clinical PET systems to improve regional spatial resolution and sensitivity. Here we describe a compact panel PET detector built using the new Though Silicon Via (TSV) multi-pixel photon counters (MPPC) detector. This insert provides high spatial resolution and good timing performance for multiple bio-medical applications. Because the TSV MPPC design eliminates wire bonding and has a package dimension which is very close to the MPPC's active area, it is 4-side buttable. The custom designed MPPC array (based on Hamamatsu S12641-PA-50(x)) used in the prototype is composed of 4 × 4 TSV-MPPC cells with a 4.46 mm pitch in both directions. The detector module has 16 × 16 lutetium yttrium oxyorthosilicate (LYSO) crystal array, with each crystal measuring 0.92 × 0.92 × 3 mm 3 with 1.0 mm pitch. The outer diameter of the detector block is 16.8 × 16.8 mm 2 . Thirty-two such blocks will be arranged in a 4 × 8 array with 1 mm gaps to form a panel detector with detection area around 7 cm × 14 cm in the full-size detector. The flood histogram acquired with Ge-68 source showed excellent crystal separation capability with all 256 crystals clearly resolved. The detector module's mean, standard deviation, minimum (best) and maximum (worst) energy resolution were 10.19%, +/-0.68%, 8.36% and 13.45% FWHM, respectively. The measured coincidence time resolution between the block detector and a fast reference detector (around 200 ps single photon timing resolution) was 0.95 ns. When tested with Siemens Cardinal electronics the performance of the detector blocks remain consistent. These results demonstrate that the TSV-MPPC is a promising photon sensor for use in a flat panel PET insert composed of many high resolution compact detector modules.

  11. Processing of thermionic power on an electrically propelled spacecraft

    NASA Technical Reports Server (NTRS)

    Macie, T. W.

    1973-01-01

    A study to define the power processing equipment required between a thermionic reactor and an array of mercury-ion thrusters for a nuclear electric propulsion system is reported. Observations and recommendations that resulted from this study were: (1) the preferred thermionic-fuel-element source voltages are 23 V or higher; (2) transistor characteristics exert a strong effect on power processor mass; (3) the power processor mass could be considerably reduced should the magnetic materials that exhibit low losses at high frequencies, that have a high Curie point, and that can operate at 15 to 20 kG become avaliable; (4) electrical component packaging on the radiator could reduce the area that is sensitive to meteoroid penetration, thereby reducing the meteoroid shielding mass requirement; (5) an experimental model of the power processor design should be built and tested to verify the efficiencies, masses, and all the automatic operational aspects of the design.

  12. Controlled thermal expansion printed wiring boards based on liquid crystal polymer dielectrics

    NASA Technical Reports Server (NTRS)

    Knoll, Thomas E.; Blizard, Kent; Jayaraj, K.; Rubin, Leslie S.

    1994-01-01

    Dielectric materials based on innovative Liquid Crystal Polymers (LCP's) have been used to fabricate surface mount printed wiring boards (PWB's) with a coefficient of thermal expansion matched to leadless ceramic chip carriers. Proprietary and patented polymer processing technology has resulted in self reinforcing material with balanced in-plane mechanical properties. In addition, LCP's possess excellent electrical properties, including a low dielectric constant (less than 2.9) and very low moisture absorption (less than 0.02%). LCP-based multilayer boards processed with conventional drilling and plating processes show improved performance over other materials because they eliminate the surface flatness problems of glass or aramid reinforcements. Laser drilling of blind vias in the LCP dielectric provides a very high density for use in direct chip attach and area array packages. The material is ideally suited for MCM-L and PCMCIA applications fabricated with very thin dielectric layers of the liquid crystal polymer.

  13. Columbia, OV-102, forward middeck locker experiments and meal tray assemblies

    NASA Technical Reports Server (NTRS)

    1982-01-01

    Overall view of forward middeck locker shows Continuous Flow Electrophoresis System (CFES) experiment control and monitoring module and sample storage module (on port side) and Monodisperse Latex Reactor (MLR) (on starboard side). Water Dispenser Kit water gun (above CFES module) and meal tray assemblies covered with snack food packages and beverage containers appear around the two experiments. Thanks to a variety of juices and other food items, this array in the middeck probably represents the most colorful area onboard the Earth-orbiting Columbia, Orbiter Vehicle (OV) 102. Most of the meal items have been carefully fastened to meal tray assemblies (foodtrays) and locker doors (or both). What has not been attached by conventional methods has been safely 'tucked' under something heavy (note jacket shoved into space occupied MLR). MLR is making its second flight and is designed to test the flexibility of making large-size, monodisperse (same size), polystyrene latex micro-spheres using

  14. Partition resampling and extrapolation averaging: approximation methods for quantifying gene expression in large numbers of short oligonucleotide arrays.

    PubMed

    Goldstein, Darlene R

    2006-10-01

    Studies of gene expression using high-density short oligonucleotide arrays have become a standard in a variety of biological contexts. Of the expression measures that have been proposed to quantify expression in these arrays, multi-chip-based measures have been shown to perform well. As gene expression studies increase in size, however, utilizing multi-chip expression measures is more challenging in terms of computing memory requirements and time. A strategic alternative to exact multi-chip quantification on a full large chip set is to approximate expression values based on subsets of chips. This paper introduces an extrapolation method, Extrapolation Averaging (EA), and a resampling method, Partition Resampling (PR), to approximate expression in large studies. An examination of properties indicates that subset-based methods can perform well compared with exact expression quantification. The focus is on short oligonucleotide chips, but the same ideas apply equally well to any array type for which expression is quantified using an entire set of arrays, rather than for only a single array at a time. Software implementing Partition Resampling and Extrapolation Averaging is under development as an R package for the BioConductor project.

  15. Adaptive and mobile ground sensor array.

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Holzrichter, Michael Warren; O'Rourke, William T.; Zenner, Jennifer

    The goal of this LDRD was to demonstrate the use of robotic vehicles for deploying and autonomously reconfiguring seismic and acoustic sensor arrays with high (centimeter) accuracy to obtain enhancement of our capability to locate and characterize remote targets. The capability to accurately place sensors and then retrieve and reconfigure them allows sensors to be placed in phased arrays in an initial monitoring configuration and then to be reconfigured in an array tuned to the specific frequencies and directions of the selected target. This report reviews the findings and accomplishments achieved during this three-year project. This project successfully demonstrated autonomousmore » deployment and retrieval of a payload package with an accuracy of a few centimeters using differential global positioning system (GPS) signals. It developed an autonomous, multisensor, temporally aligned, radio-frequency communication and signal processing capability, and an array optimization algorithm, which was implemented on a digital signal processor (DSP). Additionally, the project converted the existing single-threaded, monolithic robotic vehicle control code into a multi-threaded, modular control architecture that enhances the reuse of control code in future projects.« less

  16. 7 CFR 58.211 - Packaging room for bulk products.

    Code of Federal Regulations, 2010 CFR

    2010-01-01

    ... 7 Agriculture 3 2010-01-01 2010-01-01 false Packaging room for bulk products. 58.211 Section 58... Service 1 Rooms and Compartments § 58.211 Packaging room for bulk products. A separate room or area shall... dust within the packaging room and where needed, a dust collector shall be provided and properly...

  17. [Determination of eleven fluorescent whitening agents in paper food packaging materials by UPLC-FLD/PDA with series double-detector].

    PubMed

    Wang, Tianjiao; Wu, Pinggu; Hu, Zhengyan; Wang, Liyuan; Tang, Jun; Jiang, Wei; Wang, Zhiyuan

    2016-07-01

    To establish a new qualitative and quantitative ultraperformance liquid chromatography-fluorescence detector / photodiode array detector with series double-detector method for the determination of eleven fluorescent whitening agents in paper food packaging materials. The sample was extracted with 40%acetonitrile water solution, separated by Waters ACQUITY UPLC BEH C_(18)column( 1. 7μm, 2. 1 mm × 100 mm) and eluted gradient. The excitation wavelength and emission wavelength of fluorescence detector( FLD) were 350 nm and 430 nm, and the wavelength of photodiode array detector( PDA) was 350 nm. The detectors were used in series to achieve qualitative and quantitative detection. In the substrates of paper cups, paper bowls, paper trays and paper boxes, those eleven fluorescent whitening agents were separated properly. For both detectors, in the linear range of 25- 1000 ng / m L, the correlation coefficient was greater than 0. 99, and the recoveries of spiked recoveries were between 82. 2%- 104. 1% with the RSD less than 10%( n = 6). The detection limits ofthose eleven fluorescent whitening agents were 0. 20- 0. 28 mg / kg for FLD and 1. 4- 2. 5mg / kg for PDA. The eleven fluorescent whitening agents could be separated properly with complete separation, good shapes and high recovery rate. This method is easy to operate also. Thus it's an effective method to detect the fluorescent whitening agents in paper food packaging materials.

  18. Scripting MODFLOW Model Development Using Python and FloPy.

    PubMed

    Bakker, M; Post, V; Langevin, C D; Hughes, J D; White, J T; Starn, J J; Fienen, M N

    2016-09-01

    Graphical user interfaces (GUIs) are commonly used to construct and postprocess numerical groundwater flow and transport models. Scripting model development with the programming language Python is presented here as an alternative approach. One advantage of Python is that there are many packages available to facilitate the model development process, including packages for plotting, array manipulation, optimization, and data analysis. For MODFLOW-based models, the FloPy package was developed by the authors to construct model input files, run the model, and read and plot simulation results. Use of Python with the available scientific packages and FloPy facilitates data exploration, alternative model evaluations, and model analyses that can be difficult to perform with GUIs. Furthermore, Python scripts are a complete, transparent, and repeatable record of the modeling process. The approach is introduced with a simple FloPy example to create and postprocess a MODFLOW model. A more complicated capture-fraction analysis with a real-world model is presented to demonstrate the types of analyses that can be performed using Python and FloPy. © 2016, National Ground Water Association.

  19. Inspection design using 2D phased array, TFM and cueMAP software

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    McGilp, Ailidh; Dziewierz, Jerzy; Lardner, Tim

    2014-02-18

    A simulation suite, cueMAP, has been developed to facilitate the design of inspection processes and sparse 2D array configurations. At the core of cueMAP is a Total Focusing Method (TFM) imaging algorithm that enables computer assisted design of ultrasonic inspection scenarios, including the design of bespoke array configurations to match the inspection criteria. This in-house developed TFM code allows for interactive evaluation of image quality indicators of ultrasonic imaging performance when utilizing a 2D phased array working in FMC/TFM mode. The cueMAP software uses a series of TFM images to build a map of resolution, contrast and sensitivity of imagingmore » performance of a simulated reflector, swept across the inspection volume. The software takes into account probe properties, wedge or water standoff, and effects of specimen curvature. In the validation process of this new software package, two 2D arrays have been evaluated on 304n stainless steel samples, typical of the primary circuit in nuclear plants. Thick section samples have been inspected using a 1MHz 2D matrix array. Due to the processing efficiency of the software, the data collected from these array configurations has been used to investigate the influence sub-aperture operation on inspection performance.« less

  20. EarthScope's Transportable Array: Advancing Eastward

    NASA Astrophysics Data System (ADS)

    Busby, R. W.; Vernon, F.; Newman, R. L.; Astiz, L.

    2006-12-01

    EarthScope's Transportable Array has installed more than 200 high-quality broadband seismic stations over the last 3 years in the western US. These stations have a nominal spacing of 70 km and are part of an eventual 400 station array that migrates from west to east at a rate of 18 stations per month. The full 400 stations will be operating by September 2007. Stations have a residence time of about 2 years before being relocated to the next site. Throughout the continental US, 1623 sites are expected to be occupied. Standardized procedures and protocols have been developed to streamline all aspects of Transportable Array operations, from siting to site construction and installation to equipment purchasing and data archiving. Earned Value Management tools keep facility installation and operation on budget and schedule. A diverse, yet efficient, infrastructure installs and maintains the Transportable Array. Sensors, dataloggers, and other equipment are received and tested by the IRIS PASSCAL Instrument Center and shipped to regional storage facilities. To engage future geoscientists in the project, students are trained to conduct field and analytical reconnaissance to identify suitable seismic station sites. Contract personnel are used for site verification; vault construction; and installation of sensors, power, and communications systems. IRIS staff manages permitting, landowner communications, and station operations and maintenance. Seismic signal quality and metadata are quality-checked at the Array Network Facility at the University of California-San Diego and simultaneously archived at the IRIS Data Management Center in Seattle. Station equipment has been specifically designed for low power, remote, unattended operation and uses diverse two-way IP communications for real-time transmission. Digital cellular services, VSAT satellite, and commercial DSL, cable or wireless transport services are employed. Automatic monitoring of status, signal quality and earthquake event detection as well as operational alarms for low voltage and water intrusion are performed by a robust data acquisition package. This software is coupled with a host of network management tools and display managers operated by the Array Network Facility to allow managers, field personnel, and network operations staff to visualize array performance in real-time and to access historical information for diagnostics. Current data recording proficiency is 99.1%, with real-time telemetry averaging about 91%. EarthScope, IRIS and the USGS are working with regional seismic network operators, both existing and newly formed, to transition some of the Transportable Array stations into regional network assets. Each region has unique circumstances and interested parties are invited to exchange ideas on how this might be accomplished in their area. Contact busby@iris.edu for more information.

  1. Status Report - Cane Fiberboard Properties and Degradation Rates for Storage of the 9975 Shipping Package in KAMS

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Daugherty, W. L.

    Thermal, mechanical and physical properties have been measured on cane fiberboard samples following accelerated aging for up to approximately 7 years. The aging environments have included elevated temperature < 250 ?F (the maximum allowed service temperature for fiberboard in 9975 packages) and elevated humidity. The results from this testing have been analyzed, and aging models fit to the data. Correlations relating several properties (thermal conductivity, energy absorption, weight loss and height decrease) to their rate of change in potential storage environments have been developed. Combined with an estimate of the actual conditions the fiberboard experiences in KAMS, these models allowmore » development of service life predictions. Some of the predicted degradation rates presented in this report are relatively extreme. However, these relate to environments that do not exist within KAMS, or would be postulated only as upset conditions that would not likely persist for an extended period. For a typical package with ~10 watts internal heat load or less, and ambient temperatures below 90 ?F, the fiberboard experiences storage conditions less severe than any of the aging environments. Little or no degradation of the fiberboard is expected for typical storage conditions. It should be noted that the ultimate service life will be determined by the cumulative effect of degradation from all the conditions these packages might encounter. The assumptions and inputs behind the models in this report should be well understood before attempting to identify an actual service life in KAMS. Additional data continue to be collected to permit future refinements to the models and assumptions. For developing service life predictions, the ambient conditions within KAMS can be reasonably identified, and the temperature profiles within the various packages (with a range of heat loads and at varying locations within an array of packages) can be calculated. However, the humidity within the package is not as well characterized. While the outer drum does not provide an air-tight seal, it does greatly restrict the gain or loss of moisture in the fiberboard. Preliminary efforts have identified a relationship between the moisture content of fiberboard samples and the relative humidity of the surrounding air, but further work is needed in this area. Improvement in understanding this relationship might be realized with a change in the way humidity data are collected during field surveillances. It is recommended that the humidity be measured through a caplug hole before the package is removed from its storage location. The package would remain in thermal equilibrium, and anomalous humidity changes could be avoided. Further work should be performed to better define KAMS storage conditions and the environment within the 9975 shipping packages, and to identify appropriate limits for each property. This should be a joint effort by SRNL and NMM personnel. The results and model predictions presented in this report are applicable to 9975 packages with cane fiberboard overpack assemblies. A separate effort is underway to identify whether softwood fiberboard would behave similarly. In addition, the degradation models do not address the effects of non-conforming conditions such as the presence of excess moisture and mold, or beetle infestations.« less

  2. Tandem concentrator photovoltaic array applied to Space Station Freedom evolutionary power requirements

    NASA Technical Reports Server (NTRS)

    Fisher, Edward M., Jr.

    1991-01-01

    Additional power is required to support Space Station Freedom (SSF) evolution. Boeing Defense and Space Group, LeRC, and Entech Corporation have participated in the development of efficiency gallium arsenide and gallium antimonide solar cells make up the solar array tandem cell stacks. Entech's Mini-Dome Fresnel Lens Concentrators focus solar energy onto the active area of the solar cells at 50 times one solar energy flux. Development testing for a flight array, to be launched in Nov. 1992 is under way with support from LeRC. The tandem cells, interconnect wiring, concentrator lenses, and structure were integrated into arrays subjected to environmental testing. A tandem concentrator array can provide high mass and area specific power and can provide equal power with significantly less array area and weight than the baseline array design. Alternatively, for SSF growth, an array of twice the baseline power can be designed which still has a smaller drag area than the baseline.

  3. "Kiwi Kids Are Weet-Bix[TM] Kids"--Body Matters in Childhood

    ERIC Educational Resources Information Center

    Burrows, Lisette

    2010-01-01

    A wide array of health policies and initiatives have emerged in New Zealand recently in an attempt to resurrect a presumed "lost", adventure-loving, physically capable and non-obese Kiwi kid. Chief among these is "Mission-On"--a 67 million dollar package of 10 initiatives designed to explicitly target the eating and exercise…

  4. Interpolating of climate data using R

    NASA Astrophysics Data System (ADS)

    Reinhardt, Katja

    2017-04-01

    Interpolation methods are used in many different geoscientific areas, such as soil physics, climatology and meteorology. Thereby, unknown values are calculated by using statistical calculation approaches applied on known values. So far, the majority of climatologists have been using computer languages, such as FORTRAN or C++, but there is also an increasing number of climate scientists using R for data processing and visualization. Most of them, however, are still working with arrays and vector based data which is often associated with complex R code structures. For the presented study, I have decided to convert the climate data into geodata and to perform the whole data processing using the raster package, gstat and similar packages, providing a much more comfortable way for data handling. A central goal of my approach is to create an easy to use, powerful and fast R script, implementing the entire geodata processing and visualization into a single and fully automated R based procedure, which allows avoiding the necessity of using other software packages, such as ArcGIS or QGIS. Thus, large amount of data with recurrent process sequences can be processed. The aim of the presented study, which is located in western Central Asia, is to interpolate wind data based on the European reanalysis data Era-Interim, which are available as raster data with a resolution of 0.75˚ x 0.75˚ , to a finer grid. Therefore, various interpolation methods are used: inverse distance weighting, the geostatistical methods ordinary kriging and regression kriging, generalized additve model and the machine learning algorithms support vector machine and neural networks. Besides the first two mentioned methods, the methods are used with influencing factors, e.g. geopotential and topography.

  5. Lateral mobility of minibasins during shortening: Insights from the SE Precaspian Basin, Kazakhstan

    NASA Astrophysics Data System (ADS)

    Duffy, Oliver B.; Fernandez, Naiara; Hudec, Michael R.; Jackson, Martin P. A.; Burg, George; Dooley, Tim P.; Jackson, Christopher A.-L.

    2017-04-01

    Minibasin provinces are widespread and can be found in all types of salt tectonic settings, many of which are prone to shortening. Previous studies of how minibasin provinces shorten assume that the salt between the minibasins is homogeneous and that the base of salt is flat or of low relief, such that minibasins are free to move laterally. Here we investigate how minibasin provinces respond to shortening when the lateral mobility of the minibasins is restricted by intra-salt sediment bodies, in order to gain a greater understanding of the controls on the structural styles and modes of tectono-stratigraphic evolution exhibited in minibasin provinces. We examine a borehole-constrained, 3D seismic reflection dataset from the SE Precaspian Basin (onshore western Kazakhstan). The study area is characterised by large, supra-salt minibasins and an array of smaller intra-salt sediment packages distributed between these larger minibasins. We first outline the evidence of episodic shortening between the Late Triassic and present, after the onset of supra-salt minibasin subsidence. Next, we document spatial variations in shortening style, showing how these relate to the concentration of intra-salt sediment packages. Finally, we develop synoptic models showing how intra-salt sediment packages influence both the lateral mobility of minibasins during shortening and the resultant structural style, and we compare and contrast our findings with existing models and other natural examples of shortened minibasin provinces. We conclude that minibasin provinces may have different degrees of lateral mobility depending on the presence, or absence, of intrasalt barriers, and that these variations provide a first-order control on basin-shortening style and tectono-stratigraphic evolution.

  6. Platform technologies for hybrid optoelectronic integration and packaging

    NASA Astrophysics Data System (ADS)

    Datta, Madhumita

    In order to bring fiber-optics closer to individual home and business services, the optical network components have to be inexpensive and reliable. Integration and packaging of optoelectronic devices holds the key to high-volume low-cost component manufacturing. The goal of this dissertation is to propose, study, and demonstrate various ways to integrate optoelectronic devices on a packaging platform to implement cost-effective, functional optical modules. Two types of hybrid integration techniques have been proposed: flip-chip solder bump bonding for high-density two-dimensional array packaging of surface-emitting devices, and solder preform bonding for fiber-coupled edge-emitting semiconductor devices. For flip-chip solder bump bonding, we developed a simple, inexpensive remetallization process called "electroless plating", which converts the aluminum bond pads of foundry-made complementary metal oxide semiconductor (CMOS) chips into solder-bondable and wire-bondable gold surfaces. We have applied for a patent on this remetallization technique. For fiber-pigtailed edge-emitting laser modules, we have studied the coupling characteristics of different types of lensed single-mode fibers including semispherically lensed fiber, cylindrically lensed fiber and conically lensed fiber. We have experimentally demonstrated 66% coupling efficiency with semispherically lensed fiber and 50% efficiency with conically lensed fibers. We have proposed and designed a packaging platform on which lensed fibers can be actively aligned to a laser and solder-attached reliably to the platform so that the alignment is retained. We have designed thin-film nichrome heaters on fused quartz platforms as local heat source to facilitate on-board solder alignment and attachment of fiber. The thermal performance of the heaters was simulated using finite element analysis tool ANSYS prior to fabrication. Using the heater's reworkability advantage, we have estimated the shift of the fiber due to solder shrinkage and introduced a pre-correction in the alignment process to restore optimum coupling efficiency close to 50% with conically lensed fibers. We have applied for a patent on this unique active alignment method through the University of Maryland's Technology Commercialization Office. Although we have mostly concentrated on active alignment platforms, we have proposed the idea of combining the passive alignment advantages of silicon optical benches to the on-board heater-assisted active alignment technique. This passive-active alignment process has the potential of cost-effective array packaging of edge-emitting devices.

  7. A contactless positioning system for monitoring discontinuities in three dimensions with geological and geotechnical applications

    NASA Astrophysics Data System (ADS)

    Rinaldi-Montes, Natalia; Rowberry, Matt; Frontera, Carlos; BaroÅ, Ivo; Garcés, Javier; Blahůt, Jan; Pérez-López, Raúl; Pennos, Christos; Martí, Xavi

    2017-07-01

    In this paper, a contactless positioning system is presented which has been designed to monitor the kinematic behavior of mechanical discontinuities in three dimensions. The positioning system comprises a neodymium magnet, fixed on one side of a discontinuity, and a magnetoresistive sensing array, fixed on the opposing side. Each of the anisotropic magnetoresistive sensors in the sensing array records the magnetic field along three orthogonal directions. The positioning system intrinsically generates compact data packages which are transmitted effectively using a range of standard wireless telecommunication technologies. These data are then modeled using a global least squares fitting procedure in which the adjustable parameters are represented by the position and orientation of the neodymium magnet. The instrumental resolution of the positioning system can be tuned depending on the strength of the magnetic field generated by the neodymium magnet and the distance between the neodymium magnet and the magnetoresistive sensing array. For a typical installation, the displacement resolution is shown to be circa 10 μm while the rotation resolution is circa 0.1°. The first permanently deployed positioning system was established in June 2016 to monitor the behavior of an N-S trending fault located at the contact between the eastern Alps and the Vienna Basin. The robust design of the positioning system is demonstrated by the fact that no interruptions in the broadcasted data streams have occurred since its installation. It has a range of potential applications in many areas of basic and applied research including geology, geotechnical engineering, and structural health monitoring.

  8. Feasibility Study for an Autonomous UAV -Magnetometer System -- Final Report on SERDP SEED 1509:2206

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Roelof Versteeg; Mark McKay; Matt Anderson

    2007-09-01

    Large areas across the United States are potentially contaminated with UXO, with some ranges encompassing tens to hundreds of thousands of acres. Technologies are needed which will allow for cost effective wide area scanning with 1) near 100 % coverage and 2) near 100 % detection of subsurface ordnance or features indicative of subsurface ordnance. The current approach to wide area scanning is a multi-level one, in which medium altitude fixed wing optical imaging is used for an initial site assessment. This assessment is followed with low altitude manned helicopter based magnetometry followed by surface investigations using either towed geophysicalmore » sensor arrays or man portable sensors. In order to be effective for small UXO detection, the sensing altitude for magnetic site investigations needs to be on the order of 1 – 3 meters. These altitude requirements means that manned helicopter surveys will generally only be feasible in large, open and relatively flat terrains. While such surveys are effective in mapping large areas relatively fast there are substantial mobilization/demobilization, staffing and equipment costs associated with these surveys (resulting in costs of approximately $100-$150/acre). Surface towed arrays provide high resolution maps but have other limitations, e.g. in their ability to navigate rough terrain effectively. Thus, other systems are needed allowing for effective data collection. An UAV (Unmanned Aerial Vehicle) magnetometer platform is an obvious alternative. The motivation behind such a system is that it would be safer for the operators, cheaper in initial and O&M costs, and more effective in terms of site characterization. However, while UAV data acquisition from fixed wing platforms for large (> 200 feet) stand off distances is relatively straight forward, a host of challenges exist for low stand-off distance (~ 6 feet) UAV geophysical data acquisition. The objective of SERDP SEED 1509:2006 was to identify the primary challenges associated with a low stand off distance autonomous UAV magnetometer platform and to investigate whether these challenges can be resolved successfully such that a successful UAV magnetometer platform can be constructed. The primary challenges which were identified and investigated include: 1. The feasibility of assembling a payload package which integrates magnetometers, accurate positioning systems (DGPS, height above ground measurement), obstacle avoidance systems, power infrastructure, communications and data storage as well as auxiliary flight controls 2. The availability of commercial UAV platforms with autonomous flight capability which can accommodate this payload package 3. The feasibility of integrating obstacle avoidance controls in UAV platform control 4. The feasibility of collecting high quality magnetic data in the vicinity of an UAV.« less

  9. Advanced compilation techniques in the PARADIGM compiler for distributed-memory multicomputers

    NASA Technical Reports Server (NTRS)

    Su, Ernesto; Lain, Antonio; Ramaswamy, Shankar; Palermo, Daniel J.; Hodges, Eugene W., IV; Banerjee, Prithviraj

    1995-01-01

    The PARADIGM compiler project provides an automated means to parallelize programs, written in a serial programming model, for efficient execution on distributed-memory multicomputers. .A previous implementation of the compiler based on the PTD representation allowed symbolic array sizes, affine loop bounds and array subscripts, and variable number of processors, provided that arrays were single or multi-dimensionally block distributed. The techniques presented here extend the compiler to also accept multidimensional cyclic and block-cyclic distributions within a uniform symbolic framework. These extensions demand more sophisticated symbolic manipulation capabilities. A novel aspect of our approach is to meet this demand by interfacing PARADIGM with a powerful off-the-shelf symbolic package, Mathematica. This paper describes some of the Mathematica routines that performs various transformations, shows how they are invoked and used by the compiler to overcome the new challenges, and presents experimental results for code involving cyclic and block-cyclic arrays as evidence of the feasibility of the approach.

  10. Highly scalable parallel processing of extracellular recordings of Multielectrode Arrays.

    PubMed

    Gehring, Tiago V; Vasilaki, Eleni; Giugliano, Michele

    2015-01-01

    Technological advances of Multielectrode Arrays (MEAs) used for multisite, parallel electrophysiological recordings, lead to an ever increasing amount of raw data being generated. Arrays with hundreds up to a few thousands of electrodes are slowly seeing widespread use and the expectation is that more sophisticated arrays will become available in the near future. In order to process the large data volumes resulting from MEA recordings there is a pressing need for new software tools able to process many data channels in parallel. Here we present a new tool for processing MEA data recordings that makes use of new programming paradigms and recent technology developments to unleash the power of modern highly parallel hardware, such as multi-core CPUs with vector instruction sets or GPGPUs. Our tool builds on and complements existing MEA data analysis packages. It shows high scalability and can be used to speed up some performance critical pre-processing steps such as data filtering and spike detection, helping to make the analysis of larger data sets tractable.

  11. Thermal management methods for compact high power LED arrays

    NASA Astrophysics Data System (ADS)

    Christensen, Adam; Ha, Minseok; Graham, Samuel

    2007-09-01

    The package and system level temperature distributions of a high power (>1W) light emitting diode (LED) array has been investigated using numerical heat flow models. For this analysis, a thermal resistor network model was combined with a 3D finite element submodel of an LED structure to predict system and die level temperatures. The impact of LED array density, LED power density, and active versus passive cooling methods on device operation were calculated. In order to help understand the role of various thermal resistances in cooling such compact arrays, the thermal resistance network was analyzed in order to estimate the contributions from materials as well as active and passive cooling schemes. An analysis of thermal stresses and residual stresses in the die are also calculated based on power dissipation and convection heat transfer coefficients. Results show that the thermal stress in the GaN layer are compressive which can impact the band gap and performance of the LEDs.

  12. Correlates of in-store promotions for beer: differential effects of market and product characteristics.

    PubMed

    Bray, Jeremy W; Loomis, Brett; Engelen, Mark

    2007-03-01

    We estimated the strength and direction of the association between product characteristics (beer type, package size, and brand name) and market-area socioeconomic characteristics, and promoted sales of beer in grocery stores. Supermarket scanner data from 64 market areas across the United States over 5 years were used to estimate regression models of the share of beer sales that are promoted, controlling for beer price, packaging, and type; and for market-level age, race/ethnicity, income, unemployment rate, and percentage of the population living in an alcohol control state. Large-volume units, such as 144-oz and 288-oz packages, are more likely to be promoted than smaller package sizes. Malt-liquor beverages are less likely to be promoted than non-malt-liquor beverages. Age, race/ethnicity, income, and geographic location of the market area are not significantly related to promoted beer sales. Marketing research has shown that in-store merchandising and promotions can substantially increase beer sales and that purchasing large package sizes may increase total consumption. Our results suggest that high levels of promoted sales for large-volume beer packages may result in increased beer consumption.

  13. Imaging photomultiplier array with integrated amplifiers and high-speed USB interfacea)

    NASA Astrophysics Data System (ADS)

    Blacksell, M.; Wach, J.; Anderson, D.; Howard, J.; Collis, S. M.; Blackwell, B. D.; Andruczyk, D.; James, B. W.

    2008-10-01

    Multianode photomultiplier tube (PMT) arrays are finding application as convenient high-speed light sensitive devices for plasma imaging. This paper describes the development of a USB-based "plug-n-play" 16-channel PMT camera with 16bits simultaneous acquisition of 16 signal channels at rates up to 2MS/s per channel. The preamplifiers and digital hardware are packaged in a compact housing which incorporates magnetic shielding, on-board generation of the high-voltage PMT bias, an optical filter mount and slits, and F-mount lens adaptor. Triggering, timing, and acquisition are handled by four field-programmable gate arrays (FPGAs) under instruction from a master FPGA controlled by a computer with a LABVIEW interface. We present technical design details and specifications and illustrate performance with high-speed images obtained on the H-1 heliac at the ANU.

  14. Imaging photomultiplier array with integrated amplifiers and high-speed USB interface.

    PubMed

    Blacksell, M; Wach, J; Anderson, D; Howard, J; Collis, S M; Blackwell, B D; Andruczyk, D; James, B W

    2008-10-01

    Multianode photomultiplier tube (PMT) arrays are finding application as convenient high-speed light sensitive devices for plasma imaging. This paper describes the development of a USB-based "plug-n-play" 16-channel PMT camera with 16 bits simultaneous acquisition of 16 signal channels at rates up to 2 MSs per channel. The preamplifiers and digital hardware are packaged in a compact housing which incorporates magnetic shielding, on-board generation of the high-voltage PMT bias, an optical filter mount and slits, and F-mount lens adaptor. Triggering, timing, and acquisition are handled by four field-programmable gate arrays (FPGAs) under instruction from a master FPGA controlled by a computer with a LABVIEW interface. We present technical design details and specifications and illustrate performance with high-speed images obtained on the H-1 heliac at the ANU.

  15. Comparative analysis of film cooling efficiency at coolant supply into a single array of triangular dimples

    NASA Astrophysics Data System (ADS)

    Khalatov, A. A.; Petliak, O. O.; Severin, S. D.; Panchenko, N. A.

    2018-03-01

    The purpose of this work is a comparative study of the physical structure and film cooling efficiency of the single array of inclined holes, placed in triangular dimples and in a trench. The software package ANSYS CFX 17.0 was used along with RANS SST turbulence model. Calculations were made in a wide range of the blowing ratio ranging from 0.5 to 2.0. Results of modeling have shown high efficiency of triangular film cooling configuration. At m ≥ 1.5, the triangular configuration is comparable with the trench configuration in terms of the film cooling efficiency.

  16. Advanced Deployable Structural Systems for Small Satellites

    NASA Technical Reports Server (NTRS)

    Belvin, W. Keith; Straubel, Marco; Wilkie, W. Keats; Zander, Martin E.; Fernandez, Juan M.; Hillebrandt, Martin F.

    2016-01-01

    One of the key challenges for small satellites is packaging and reliable deployment of structural booms and arrays used for power, communication, and scientific instruments. The lack of reliable and efficient boom and membrane deployment concepts for small satellites is addressed in this work through a collaborative project between NASA and DLR. The paper provides a state of the art overview on existing spacecraft deployable appendages, the special requirements for small satellites, and initial concepts for deployable booms and arrays needed for various small satellite applications. The goal is to enhance deployable boom predictability and ground testability, develop designs that are tolerant of manufacturing imperfections, and incorporate simple and reliable deployment systems.

  17. Angular acceptance analysis of an infrared focal plane array with a built-in stationary Fourier transform spectrometer.

    PubMed

    Gillard, Frédéric; Ferrec, Yann; Guérineau, Nicolas; Rommeluère, Sylvain; Taboury, Jean; Chavel, Pierre

    2012-06-01

    Stationary Fourier transform spectrometry is an interesting concept for building reliable field or embedded spectroradiometers, especially for the mid- and far- IR. Here, a very compact configuration of a cryogenic stationary Fourier transform IR (FTIR) spectrometer is investigated, where the interferometer is directly integrated in the focal plane array (FPA). We present a theoretical analysis to explain and describe the fringe formation inside the FTIR-FPA structure when illuminated by an extended source positioned at a finite distance from the detection plane. The results are then exploited to propose a simple front lens design compatible with a handheld package.

  18. ICT and the paperboard and packaging industry

    Treesearch

    Peter Ince; Sanna Kallioranta; Richard Vlosky

    2005-01-01

    The purpose of this chapter is to describe the reasons for the development of ICT and e-business systems in the paper and paperboard packaging industry and to discuss future scenarios that may serve to guide forest- sector research in this topical area. The paper and paperboard packaging industry encompasses producers of primary paper and paperboard packaging materials...

  19. The Effects of Linear Microphone Array Changes on Computed Sound Exposure Level Footprints

    NASA Technical Reports Server (NTRS)

    Mueller, Arnold W.; Wilson, Mark R.

    1997-01-01

    Airport land planning commissions often are faced with determining how much area around an airport is affected by the sound exposure levels (SELS) associated with helicopter operations. This paper presents a study of the effects changing the size and composition of a microphone array has on the computed SEL contour (ground footprint) areas used by such commissions. Descent flight acoustic data measured by a fifteen microphone array were reprocessed for five different combinations of microphones within this array. This resulted in data for six different arrays for which SEL contours were computed. The fifteen microphone array was defined as the 'baseline' array since it contained the greatest amount of data. The computations used a newly developed technique, the Acoustic Re-propagation Technique (ART), which uses parts of the NASA noise prediction program ROTONET. After the areas of the SEL contours were calculated the differences between the areas were determined. The area differences for the six arrays are presented that show a five and a three microphone array (with spacing typical of that required by the FAA FAR Part 36 noise certification procedure) compare well with the fifteen microphone array. All data were obtained from a database resulting from a joint project conducted by NASA and U.S. Army researchers at Langley and Ames Research Centers. A brief description of the joint project test design, microphone array set-up, and data reduction methodology associated with the database are discussed.

  20. 3-D readout-electronics packaging for high-bandwidth massively paralleled imager

    DOEpatents

    Kwiatkowski, Kris; Lyke, James

    2007-12-18

    Dense, massively parallel signal processing electronics are co-packaged behind associated sensor pixels. Microchips containing a linear or bilinear arrangement of photo-sensors, together with associated complex electronics, are integrated into a simple 3-D structure (a "mirror cube"). An array of photo-sensitive cells are disposed on a stacked CMOS chip's surface at a 45.degree. angle from light reflecting mirror surfaces formed on a neighboring CMOS chip surface. Image processing electronics are held within the stacked CMOS chip layers. Electrical connections couple each of said stacked CMOS chip layers and a distribution grid, the connections for distributing power and signals to components associated with each stacked CSMO chip layer.

  1. Space Experiments with Particle Accelerators (SEPAC)

    NASA Technical Reports Server (NTRS)

    Obayashi, T.; Kawashima, N.; Kuriki, K.; Nagatomo, M.; Ninomiya, K.; Sasaki, S.; Ushirokawa, A.; Kudo, I.; Ejiri, M.; Roberts, W. T.

    1982-01-01

    Plans for SEPAC, an instrument array to be used on Spacelab 1 to study vehicle charging and neutralization, beam-plasma interaction in space, beam-atmospheric interaction exciting artificial aurora and airglow, and the electromagnetic-field configuration of the magnetosphere, are presented. The hardware, consisting of electron beam accelerator, magnetoplasma arcjet, neutral-gas plume generator, power supply, diagnostic package (photometer, plasma probes, particle analyzers, and plasma-wave package), TV monitor, and control and data-management unit, is described. The individual SEPAC experiments, the typical operational sequence, and the general outline of the SEPAC follow-on mission are discussed. Some of the experiments are to be joint ventures with AEPI (INS 003) and will be monitored by low-light-level TV.

  2. MOSAIC: Software for creating mosaics from collections of images

    NASA Technical Reports Server (NTRS)

    Varosi, F.; Gezari, D. Y.

    1992-01-01

    We have developed a powerful, versatile image processing and analysis software package called MOSAIC, designed specifically for the manipulation of digital astronomical image data obtained with (but not limited to) two-dimensional array detectors. The software package is implemented using the Interactive Data Language (IDL), and incorporates new methods for processing, calibration, analysis, and visualization of astronomical image data, stressing effective methods for the creation of mosaic images from collections of individual exposures, while at the same time preserving the photometric integrity of the original data. Since IDL is available on many computers, the MOSAIC software runs on most UNIX and VAX workstations with the X-Windows or Sun View graphics interface.

  3. Long Duration Exposure Facility (LDEF) low-temperature heat pipe experiment package power system results

    NASA Technical Reports Server (NTRS)

    Tiller, Smith E.; Sullivan, David

    1992-01-01

    An overview of a self-contained Direct Energy Transfer Power System which was developed to provide power to the Long Duration Exposure Facility (LDEF) Low-Temperature Heat Pipe Experiment Package is presented. The power system operated successfully for the entire mission. Data recorded by the onboard recorder shows that the system operated within design specifications. Other than unanticipated overcharging of the battery, the power system operated as expected for nearly 32,000 low earth orbit cycles, and was still operational when tested after the LDEF recovery. Some physical damage was sustained by the solar array panels due to micrometeoroid hits, but there were not electrical failures.

  4. Packaging for Food Service

    NASA Technical Reports Server (NTRS)

    Stilwell, E. J.

    1985-01-01

    Most of the key areas of concern in packaging the three principle food forms for the space station were covered. It can be generally concluded that there are no significant voids in packaging materials availability or in current packaging technology. However, it must also be concluded that the process by which packaging decisions are made for the space station feeding program will be very synergistic. Packaging selection will depend heavily on the preparation mechanics, the preferred presentation and the achievable disposal systems. It will be important that packaging be considered as an integral part of each decision as these systems are developed.

  5. Thermal Interface Materials Selection and Application Guidelines: In Perspective of Xilinx Virtex-5QV Thermal Management

    NASA Technical Reports Server (NTRS)

    Suh, Jong-ook; Dillon, R. Peter; Tseng, Stephen

    2015-01-01

    The heat from high-power microdevices for space, such as Xilinx Virtex 4 and 5 (V4 and V5), has to be removed mainly through conduction in the space vacuum environment. The class-Y type packages are designed to remove the heat from the top of the package, and the most effective method to remove heat from the class-Y type packages is to attach a heat transfer device on the lid of the package and to transfer the heat to frame or chassis. When a heat transfer device is attached to the package lid, the surfaces roughness of the package lid and the heat transfer device reduces the effective contact area between the two. The reduced contact area results in increased thermal contact resistance, and a thermal interface material is required to reduce the thermal contact resistance by filling in the gap between the surfaces of the package lid and the heat transfer device. The current report describes JPL's FY14 NEPP task study on property requirements of TIM and impact of TIM properties on the packaging reliability. The current task also developed appratuses to investigate the performances of TIMs in the actual mission environment.

  6. The abundance and diversity of antibiotic resistance genes in the atmospheric environment of composting plants.

    PubMed

    Gao, Min; Qiu, Tianlei; Sun, Yanmei; Wang, Xuming

    2018-07-01

    Composting is considered to reduce the introduction of antimicrobial resistance genes (ARGs) into the environment through land application of manure; however, the possible pollution of ARGs in the atmospheric environment of composting plants is unknown. In this study, 29 air samples including up- and downwind, composting, packaging, and office areas from 4 composting plants were collected. Dynamic concentrations of 22 subtypes of ARGs, class 1 integron (intl1), and 2 potential human pathogenic bacteria (HPB), and bacterial communities were investigated using droplet digital PCR and 16S rRNA gene sequencing, respectively. In this study, intl1 and 22 subtypes of ARGs (except tetQ) were detected in air of composting, packaging, office, and downwind areas. The highest concentration of 15 out of 22 subtypes of ARGs was detected in the packaging areas, and intl1 also had the maximum average concentration of 10 4  copies/m 3 , with up to (1.78 ± 0.49) × 10 -2 copies/16S rRNA copy. Non-metric multi-dimensional scaling of ARGs, potential HPBs, and bacterial components all indicated that the bioaerosol pollutant pattern in packaging areas was most similar to that in composting areas, followed by office, downwind, and upwind areas. The co-occurrence between ARGs and bacterial taxa assessed by Procrustes test, mantel test, and network analysis implied that aerosolized ARG fragments from composting and packaging areas contributed to the compositions of ARG aerosols in office and downwind areas. The results presented here show that atmoshperic environments of composting plants harbor abundant and diverse ARGs, which highlight the urgent need for comprehensive evaluation of potential human health and ecological risks of composts during both production as well as land application. Copyright © 2018 Elsevier Ltd. All rights reserved.

  7. Thermal management of quantum cascade lasers in an individually addressable monolithic array architecture

    NASA Astrophysics Data System (ADS)

    Missaggia, Leo; Wang, Christine; Connors, Michael; Saar, Brian; Sanchez-Rubio, Antonio; Creedon, Kevin; Turner, George; Herzog, William

    2016-03-01

    There are a number of military and commercial applications for high-power laser systems in the mid-to-long-infrared wavelength range. By virtue of their demonstrated watt-level performance and wavelength diversity, quantum cascade laser (QCL) and amplifier devices are an excellent choice of emitter for those applications. To realize the power levels of interest, beam combining of arrays of these emitters is required and as a result, array technology must be developed. With this in mind, packaging and thermal management strategies were developed to facilitate the demonstration of a monolithic QCL array operating under CW conditions. Thermal models were constructed and simulations performed to determine the effect of parameters such as array-element ridge width and pitch on gain region temperature rise. The results of the simulations were considered in determining an appropriate QCL array configuration. State-of-the-art micro-impingement cooling along with an electrical distribution scheme comprised of AlN multi-layer technology were integrated into the design. The design of the module allows for individual electrical addressability of the array elements, a method of phase control demonstrated previously for coherent beam combining of diode arrays, along with access to both front and rear facets. Hence, both laser and single-pass amplifier arrays can be accommodated. A module was realized containing a 5 mm cavity length monolithic QCL array comprised of 7 elements on 450 m pitch. An output power of 3.16 W was demonstrated under CW conditions at an emission wavelength of 9μm.

  8. Vertical-cavity surface-emitting lasers - Design, growth, fabrication, characterization

    NASA Astrophysics Data System (ADS)

    Jewell, Jack L.; Lee, Y. H.; Harbison, J. P.; Scherer, A.; Florez, L. T.

    1991-06-01

    The authors have designed, fabricated, and tested vertical-cavity surface-emitting lasers (VCSEL) with diameters ranging from 0.5 microns to above 50 microns. Design issues, molecular beam epitaxial growth, fabrication, and lasing characteristics are discussed. The topics considered in fabrication of VCSELs are microlaser geometries; ion implementation and masks; ion beam etching; packaging and arrays; and ultrasmall devices.

  9. Thermal Lens Measurement in Diode-Pumped Nd:YAG Zig-Zag Slab

    NASA Technical Reports Server (NTRS)

    Smoak, M. C.; Kay, R. B.; Coyle, D. B.; Hopf, D.

    1998-01-01

    A major advantage that solid state zig-zag slab lasers have over conventional rod-based designs is that a much weaker thermal lens is produced in the slab when side-pumped with Quasi-CW laser diode arrays, particularly if the pump radiation is kept well away from the Brewster-cut ends. This paper reports on a rather strong thermal lens produced when diode pump radiation is collimated into a narrow portion of the zig-zag slab. The collimation of multi-bar pump packages to increase brightness and improve overlap is a direct consequence of designs which seek to maximize performance and efficiency. Our slab design employed a 8.1 cm x 2.5 mm x 5 mm slab with opposing Brewster end faces. It was pumped through the 2.5 mm direction by seven laser diode array packages, each housing four 6OW diode bars, 1 cm in width. The pump face, anti-reflection (AR) coated at 809 nm, was 6.8 cm in width and the 8.1 cm opposing side, high-reflection (HR) coated at 809 nm, reflected the unabsorbed pump beam for a second pass through the slab.

  10. New seismic instrumentation packaged for all terrestrial environments (including the quietest observatories!).

    NASA Astrophysics Data System (ADS)

    Parker, Tim; Devanney, Peter; Bainbridge, Geoff; Townsend, Bruce

    2017-04-01

    The march to make every type of seismometer, weak to strong motion, reliable and economically deployable in any terrestrial environment continues with the availability of three new sensors and seismic systems including ones with over 200dB of dynamic range. Until recently there were probably 100 pier type broadband sensors for every observatory type pier, not the types of deployments geoscientists are needing to advance science and monitoring capability. Deeper boreholes are now the recognized quieter environments for best observatory class instruments and these same instruments can now be deployed in direct burial environments which is unprecedented. The experiences of facilities in large deployments of broadband seismometers in continental scale rolling arrays proves the utility of packaging new sensors in corrosion resistant casings and designing in the robustness needed to work reliably in temporary deployments. Integrating digitizers and other sensors decreases deployment complexity, decreases acquisition and deployment costs, increases reliability and utility. We'll discuss the informed evolution of broadband pier instruments into the modern integrated field tools that enable economic densification of monitoring arrays along with supporting new ways to approach geoscience research in a field environment.

  11. Minfi: a flexible and comprehensive Bioconductor package for the analysis of Infinium DNA methylation microarrays

    PubMed Central

    Aryee, Martin J.; Jaffe, Andrew E.; Corrada-Bravo, Hector; Ladd-Acosta, Christine; Feinberg, Andrew P.; Hansen, Kasper D.; Irizarry, Rafael A.

    2014-01-01

    Motivation: The recently released Infinium HumanMethylation450 array (the ‘450k’ array) provides a high-throughput assay to quantify DNA methylation (DNAm) at ∼450 000 loci across a range of genomic features. Although less comprehensive than high-throughput sequencing-based techniques, this product is more cost-effective and promises to be the most widely used DNAm high-throughput measurement technology over the next several years. Results: Here we describe a suite of computational tools that incorporate state-of-the-art statistical techniques for the analysis of DNAm data. The software is structured to easily adapt to future versions of the technology. We include methods for preprocessing, quality assessment and detection of differentially methylated regions from the kilobase to the megabase scale. We show how our software provides a powerful and flexible development platform for future methods. We also illustrate how our methods empower the technology to make discoveries previously thought to be possible only with sequencing-based methods. Availability and implementation: http://bioconductor.org/packages/release/bioc/html/minfi.html. Contact: khansen@jhsph.edu; rafa@jimmy.harvard.edu Supplementary information: Supplementary data are available at Bioinformatics online. PMID:24478339

  12. Introduction to Software Packages. [Final Report.

    ERIC Educational Resources Information Center

    Frankel, Sheila, Ed.; And Others

    This document provides an introduction to applications computer software packages that support functional managers in government and encourages the use of such packages as an alternative to in-house development. A review of current application areas includes budget/project management, financial management/accounting, payroll, personnel,…

  13. Modeling parameterized geometry in GPU-based Monte Carlo particle transport simulation for radiotherapy.

    PubMed

    Chi, Yujie; Tian, Zhen; Jia, Xun

    2016-08-07

    Monte Carlo (MC) particle transport simulation on a graphics-processing unit (GPU) platform has been extensively studied recently due to the efficiency advantage achieved via massive parallelization. Almost all of the existing GPU-based MC packages were developed for voxelized geometry. This limited application scope of these packages. The purpose of this paper is to develop a module to model parametric geometry and integrate it in GPU-based MC simulations. In our module, each continuous region was defined by its bounding surfaces that were parameterized by quadratic functions. Particle navigation functions in this geometry were developed. The module was incorporated to two previously developed GPU-based MC packages and was tested in two example problems: (1) low energy photon transport simulation in a brachytherapy case with a shielded cylinder applicator and (2) MeV coupled photon/electron transport simulation in a phantom containing several inserts of different shapes. In both cases, the calculated dose distributions agreed well with those calculated in the corresponding voxelized geometry. The averaged dose differences were 1.03% and 0.29%, respectively. We also used the developed package to perform simulations of a Varian VS 2000 brachytherapy source and generated a phase-space file. The computation time under the parameterized geometry depended on the memory location storing the geometry data. When the data was stored in GPU's shared memory, the highest computational speed was achieved. Incorporation of parameterized geometry yielded a computation time that was ~3 times of that in the corresponding voxelized geometry. We also developed a strategy to use an auxiliary index array to reduce frequency of geometry calculations and hence improve efficiency. With this strategy, the computational time ranged in 1.75-2.03 times of the voxelized geometry for coupled photon/electron transport depending on the voxel dimension of the auxiliary index array, and in 0.69-1.23 times for photon only transport.

  14. Lessons Learned in the Design and Use of IP1 / IP2 Flexible Packaging - 13621

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Sanchez, Mike; Reeves, Wendall; Smart, Bill

    2013-07-01

    For many years in the USA, Low Level Radioactive Waste (LLW), contaminated soils and construction debris, have been transported, interim stored, and disposed of, using IP1 / IP2 metal containers. The performance of these containers has been more than adequate, with few safety occurrences. The containers are used under the regulatory oversight of the US Department of Transportation (DOT), 49 Code of Federal Regulations (CFR). In the late 90's the introduction of flexible packaging for the transport, storage, and disposal of low level contaminated soils and construction debris was introduced. The development of flexible packaging came out of a needmore » for a more cost effective package, for the large volumes of waste generated by the decommissioning of many of the US Department of Energy (DOE) legacy sites across the US. Flexible packaging had to be designed to handle a wide array of waste streams, including soil, gravel, construction debris, and fine particulate dust migration. The design also had to meet all of the IP1 requirements under 49CFR 173.410, and be robust enough to pass the IP2 testing 49 CFR 173.465 required for many LLW shipments. Tens of thousands of flexible packages have been safely deployed and used across the US nuclear industry as well as for hazardous non-radioactive applications, with no recorded release of radioactive materials. To ensure that flexible packages are designed properly, the manufacturer must use lessons learned over the years, and the tests performed to provide evidence that these packages are suitable for transporting low level radioactive wastes. The design and testing of flexible packaging for LLW, VLLW and other hazardous waste streams must be as strict and stringent as the design and testing of metal containers. The design should take into consideration the materials being loaded into the package, and should incorporate the right materials, and manufacturing methods, to provide a quality, safe product. Flexible packaging can be shown to meet the criteria for safe and fit for purpose packaging, by meeting the US DOT regulations, and the IAEA Standards for IP-1 and IP-2 including leak tightness. (authors)« less

  15. Near- and far-field infrasound monitoring in the Mediterranean area

    NASA Astrophysics Data System (ADS)

    Campus, Paola; Marchetti, Emanuele; Le Pichon, Alexis; Wallenstein, Nicolau; Ripepe, Maurizio; Kallel, Mohamed; Mialle, Pierrick

    2013-04-01

    The Mediterranean area is characterized by a number of very interesting sources of infrasound signals and offers a promising playground for the development of a deeper understanding of such sources and of the associated propagation models. The progress in the construction and certification of infrasound arrays belonging to the International Monitoring System (IMS) of the Comprehensive Nuclear-Test-Ban Treaty (CTBT) in the vicinity of this area has been complemented, in the last decade, by the construction of infrasound arrays established by several European research groups. The University of Florence (UniFi) plays a crucial role for the detection of infrasound signals in the Mediterranean area, having deployed since several years two infrasound arrays on Stromboli and Etna volcanoes, and, more recently, three infrasound arrays in the Alpine area of NW Italy and one infrasound array on the Apennines (Mount Amiata), designed and established in the framework of the ARISE Project. The IMS infrasound arrays IS42 (Graciosa, Azores, Portugal) and IS48 (Kesra, Tunisia) recorded, since the time of their certification, a number of far-field events which can be correlated with some near-field records of the infrasound arrays belonging to UniFi. An analysis of the results and potentialities of infrasound source's detections in near and far-field realized by IS42, IS48 and UniFi arrays in the Mediterranean area, with special focus on volcanic events is presented. The combined results deriving from the analysis of data recorded by the Unifi arrays and by the IS42 and IS48 arrays, in collaboration with the Department of Analyse et Surveillance (CEA/DASE), will generate a synergy which will certainly contribute to the progress of the ARISE Project.

  16. Nanotechnology: An Untapped Resource for Food Packaging.

    PubMed

    Sharma, Chetan; Dhiman, Romika; Rokana, Namita; Panwar, Harsh

    2017-01-01

    Food commodities are packaged and hygienically transported to protect and preserve them from any un-acceptable alteration in quality, before reaching the end-consumer. Food packaging continues to evolve along-with the innovations in material science and technology, as well as in light of consumer's demand. Presently, the modern consumers of competitive economies demands for food with natural quality, assured safety, minimal processing, extended shelf-life and ready-to-eat concept. Innovative packaging systems, not only ascertains transit preservation and effective distribution, but also facilitates communication at the consumer levels. The technological advances in the domain of food packaging in twenty-first century are mainly chaired by nanotechnology, the science of nano-materials. Nanotechnology manipulates and creates nanometer scale materials, of commercial and scientific relevance. Introduction of nanotechnology in food packaging sector has significantly addressed the food quality, safety and stability concerns. Besides, nanotechnology based packaging intimate's consumers about the real time quality of food product. Additionally, nanotechnology has been explored for controlled release of preservatives/antimicrobials, extending the product shelf life within the package. The promising reports for nanotechnology interventions in food packaging have established this as an independent priority research area. Nanoparticles based food packages offer improved barrier and mechanical properties, along with food preservation and have gained welcoming response from market and end users. In contrary, recent advances and up-liftment in this area have raised various ethical, environmental and safety concerns. Policies and regulation regarding nanoparticles incorporation in food packaging are being reviewed. This review presents the existing knowledge, recent advances, concerns and future applications of nanotechnology in food packaging sector.

  17. Nanotechnology: An Untapped Resource for Food Packaging

    PubMed Central

    Sharma, Chetan; Dhiman, Romika; Rokana, Namita; Panwar, Harsh

    2017-01-01

    Food commodities are packaged and hygienically transported to protect and preserve them from any un-acceptable alteration in quality, before reaching the end-consumer. Food packaging continues to evolve along-with the innovations in material science and technology, as well as in light of consumer's demand. Presently, the modern consumers of competitive economies demands for food with natural quality, assured safety, minimal processing, extended shelf-life and ready-to-eat concept. Innovative packaging systems, not only ascertains transit preservation and effective distribution, but also facilitates communication at the consumer levels. The technological advances in the domain of food packaging in twenty-first century are mainly chaired by nanotechnology, the science of nano-materials. Nanotechnology manipulates and creates nanometer scale materials, of commercial and scientific relevance. Introduction of nanotechnology in food packaging sector has significantly addressed the food quality, safety and stability concerns. Besides, nanotechnology based packaging intimate's consumers about the real time quality of food product. Additionally, nanotechnology has been explored for controlled release of preservatives/antimicrobials, extending the product shelf life within the package. The promising reports for nanotechnology interventions in food packaging have established this as an independent priority research area. Nanoparticles based food packages offer improved barrier and mechanical properties, along with food preservation and have gained welcoming response from market and end users. In contrary, recent advances and up-liftment in this area have raised various ethical, environmental and safety concerns. Policies and regulation regarding nanoparticles incorporation in food packaging are being reviewed. This review presents the existing knowledge, recent advances, concerns and future applications of nanotechnology in food packaging sector. PMID:28955314

  18. RF beam transmission of x-band PAA system utilizing large-area, polymer-based true-time-delay module developed using imprinting and inkjet printing

    NASA Astrophysics Data System (ADS)

    Pan, Zeyu; Subbaraman, Harish; Zhang, Cheng; Li, Qiaochu; Xu, Xiaochuan; Chen, Xiangning; Zhang, Xingyu; Zou, Yi; Panday, Ashwin; Guo, L. Jay; Chen, Ray T.

    2016-02-01

    Phased-array antenna (PAA) technology plays a significant role in modern day radar and communication networks. Truetime- delay (TTD) enabled beam steering networks provide several advantages over their electronic counterparts, including squint-free beam steering, low RF loss, immunity to electromagnetic interference (EMI), and large bandwidth control of PAAs. Chip-scale and integrated TTD modules promise a miniaturized, light-weight system; however, the modules are still rigid and they require complex packaging solutions. Moreover, the total achievable time delay is still restricted by the wafer size. In this work, we propose a light-weight and large-area, true-time-delay beamforming network that can be fabricated on light-weight and flexible/rigid surfaces utilizing low-cost "printing" techniques. In order to prove the feasibility of the approach, a 2-bit thermo-optic polymer TTD network is developed using a combination of imprinting and ink-jet printing. RF beam steering of a 1×4 X-band PAA up to 60° is demonstrated. The development of such active components on large area, light-weight, and low-cost substrates promises significant improvement in size, weight, and power (SWaP) requirements over the state-of-the-art.

  19. Soft lithography microlens fabrication and array for enhanced light extraction from organic light emitting diodes (OLEDs)

    DOEpatents

    Leung, Wai Y.; Park, Joong-Mok; Gan, Zhengqing; Constant, Kristen P.; Shinar, Joseph; Shinar, Ruth; ho, Kai-Ming

    2014-06-03

    Provided are microlens arrays for use on the substrate of OLEDs to extract more light that is trapped in waveguided modes inside the devices and methods of manufacturing same. Light extraction with microlens arrays is not limited to the light emitting area, but is also efficient in extracting light from the whole microlens patterned area where waveguiding occurs. Large microlens array, compared to the size of the light emitting area, extract more light and result in over 100% enhancement. Such a microlens array is not limited to (O)LEDs of specific emission, configuration, pixel size, or pixel shape. It is suitable for all colors, including white, for microcavity OLEDs, and OLEDs fabricated directly on the (modified) microlens array.

  20. Materials, devices, techniques, and applications for Z-plane focal plane array technology II; Proceedings of the Meeting, San Diego, CA, July 12, 13, 1990

    NASA Astrophysics Data System (ADS)

    Carson, John C.

    1990-11-01

    Various papers on materials, devices, techniques, and applications for X-plane focal plane array technology are presented. Individual topics addressed include: application of Z-plane technology to the remote sensing of the earth from GEO, applications of smart neuromorphic focal planes, image-processing of Z-plane technology, neural network Z-plane implementation with very high interconnection rates, using a small IR surveillance satellite for tactical applications, establishing requirements for homing applications, Z-plane technology. Also discussed are: on-array spike suppression signal processing, algorithms for on-focal-plane gamma circumvention and time-delay integration, current HYMOSS Z-technology, packaging of electrons for on- and off-FPA signal processing, space/performance qualification of tape automated bonded devices, automation in tape automated bonding, high-speed/high-volume radiometric testing of Z-technology focal planes, 128-layer HYMOSS-module fabrication issues, automation of IRFPA production processes.

  1. New Cloud and Precipitation Research Avenues Enabled by low-cost Phased-array Radar Technology

    NASA Astrophysics Data System (ADS)

    Kollias, P.; Oue, M.; Fridlind, A. M.; Matsui, T.; McLaughlin, D. J.

    2017-12-01

    For over half a century, radars operating in a wide range of frequencies have been the primary source of observational insights of clouds and precipitation microphysics and dynamics and contributed to numerous significant advancements in the field of cloud and precipitation physics. The development of multi-wavelength and polarization diversity techniques has further strengthened the quality of microphysical and dynamical retrievals from radars and has assisted in overcoming some of the limitations imposed by the physics of scattering. Atmospheric radars have historically employed a mechanically-scanning dish antenna and their ability to point to, survey, and revisit specific points or regions in the atmosphere is limited by mechanical inertia. Electronically scanned, or phased-array, radars capable of high-speed, inertialess beam steering, have been available for several decades, but the cost of this technology has limited its use to military applications. During the last 10 years, lower power and lower-cost versions of electronically scanning radars have been developed, and this presents an attractive and affordable new tool for the atmospheric sciences. The operational and research communities are currently exploring phased array advantages in signal processing (i.e. beam multiplexing, improved clutter rejection, cross beam wind estimation, adaptive sensing) and science applications (i.e. tornadic storm morphology studies). Here, we will present some areas of atmospheric research where inertia-less radars with ability to provide rapid volume imaging offers the potential to advance cloud and precipitation research. We will discuss the added value of single phased-array radars as well as networks of these radars for several problems including: multi-Doppler wind retrieval techniques, cloud lifetime studies and aerosol-convection interactions. The performance of current (dish) and future (e-scan) radar systems for these atmospheric studies will be evaluated using numerical model output and a sophisticated radar simulator package.

  2. DOE Office of Scientific and Technical Information (OSTI.GOV)

    Diaz, Aaron A.; Chamberlin, Clyde E.; Edwards, Matthew K.

    This section of the Joint summary technical letter report (TLR) describes work conducted at the Pacific Northwest National Laboratory (PNNL) during FY 2016 (FY16) on the under-sodium viewing (USV) PNNL project 58745, work package AT-16PN230102. This section of the TLR satisfies PNNL’s M3AT-16PN2301025 milestone and is focused on summarizing the design, development, and evaluation of two different phased-array ultrasonic testing (PA-UT) probe designs—a two-dimensional (2D) matrix phased-array probe, and two one-dimensional (1D) linear array probes, referred to as serial number 4 (SN4) engineering test units (ETUs). The 2D probe is a pulse-echo (PE), 32×2, 64-element matrix phased-array ETU. The 1Dmore » probes are 32×1 element linear array ETUs. This TLR also provides the results from a performance demonstration (PD) of in-sodium target detection trials at 260°C using both probe designs. This effort continues the iterative evolution supporting the longer term goal of producing and demonstrating a pre-manufacturing prototype ultrasonic probe that possesses the fundamental performance characteristics necessary to enable the development of a high-temperature sodium-cooled fast reactor (SFR) inspection system for in-sodium detection and imaging.« less

  3. Accelerated Bayesian model-selection and parameter-estimation in continuous gravitational-wave searches with pulsar-timing arrays

    NASA Astrophysics Data System (ADS)

    Taylor, Stephen; Ellis, Justin; Gair, Jonathan

    2014-11-01

    We describe several new techniques which accelerate Bayesian searches for continuous gravitational-wave emission from supermassive black-hole binaries using pulsar-timing arrays. These techniques mitigate the problematic increase of search dimensionality with the size of the pulsar array which arises from having to include an extra parameter per pulsar as the array is expanded. This extra parameter corresponds to searching over the phase of the gravitational wave as it propagates past each pulsar so that we can coherently include the pulsar term in our search strategies. Our techniques make the analysis tractable with powerful evidence-evaluation packages like MultiNest. We find good agreement of our techniques with the parameter-estimation and Bayes factor evaluation performed with full signal templates and conclude that these techniques make excellent first-cut tools for detection and characterization of continuous gravitational-wave signals with pulsar-timing arrays. Crucially, at low to moderate signal-to-noise ratios the factor by which the analysis is sped up can be ≳100 , permitting rigorous programs of systematic injection and recovery of signals to establish robust detection criteria within a Bayesian formalism.

  4. Development and testing of bio-inspired microelectromechanical pressure sensor arrays for increased situational awareness for marine vehicles

    NASA Astrophysics Data System (ADS)

    Dusek, J.; Kottapalli, A. G. P.; Woo, M. E.; Asadnia, M.; Miao, J.; Lang, J. H.; Triantafyllou, M. S.

    2013-01-01

    The lateral line found on most species of fish is a sensory organ without analog in humans. Using sensory feedback from the lateral line, fish are able to track prey, school, avoid obstacles, and detect vortical flow structures. Composed of both a superficial component, and a component contained within canals beneath the fish’s skin, the lateral line acts in a similar fashion to an array of differential pressure sensors. In an effort to enhance the situational and environmental awareness of marine vehicles, lateral-line-inspired pressure sensor arrays were developed to mimic the enhanced sensory capabilities observed in fish. Three flexible and waterproof pressure sensor arrays were fabricated for use as a surface-mounted ‘smart skin’ on marine vehicles. Two of the sensor arrays were based around the use of commercially available piezoresistive sensor dies, with innovative packaging schemes to allow for flexibility and underwater operation. The sensor arrays employed liquid crystal polymer and flexible printed circuit board substrates with metallic circuits and silicone encapsulation. The third sensor array employed a novel nanocomposite material set that allowed for the fabrication of a completely flexible sensor array. All three sensors were surface mounted on the curved hull of an autonomous kayak vehicle, and tested in both pool and reservoir environments. Results demonstrated that all three sensors were operational while deployed on the autonomous vehicle, and provided an accurate means for monitoring the vehicle dynamics.

  5. Thin planar package for cooling an array of edge-emitting laser diodes

    DOEpatents

    Mundinger, David C.; Benett, William J.

    1992-01-01

    A laser diode array is disclosed that includes a plurality of planar assemblies and active cooling of each assembly. The laser diode array may be operated in a long duty cycle, or in continuous operation. A laser diode bar and a microchannel heat sink are thermally coupled in a compact, thin planar assembly having the laser diode bar located proximate to one edge. In an array, a number of such thin planar assemblies are secured together in a stacked configuration, in close proximity so that the laser diodes are spaced closely. The cooling means includes a microchannel heat sink proximate to the laser diode bar to absorb heat generated by laser operation. To provide the coolant to the microchannels, each thin planar assembly comprises passageways that connect the microchannels to inlet and outlet corridors. Each inlet passageway may comprise a narrow slot that directs coolant into the microchannels and increases the velocity of flow therethrough. The corridors comprises holes extending through each of the assemblies in the array. The inlet and outlet corridors are connected to a conventional coolant circulation system. The laser diode array with active cooling has applications as an optical pump for high power solid state lasers, or by mating the diodes with fiber optic lenses. Further, the arrays can be useful in applications having space constraints and energy limitations, and in military and space applications. The arrays can be incorporated in equipment such as communications devices and active sensors.

  6. Development of high sensitivity eight-element multiplexed fiber laser acoustic pressure hydrophone array and interrogation system

    NASA Astrophysics Data System (ADS)

    Li, Ming; Sun, Zhihui; Zhang, Xiaolei; Li, Shujuan; Song, Zhiqiang; Wang, Meng; Guo, Jian; Ni, Jiasheng; Wang, Chang; Peng, Gangding; Xu, Xiangang

    2017-09-01

    Fiber laser hydrophones have got widespread concerns due to the unique advantages and broad application prospects. In this paper, the research results of the eight-element multiplexed fiber laser acoustic pressure array and the interrogation system are introduced, containing low-noise distributed feedback fiber laser (DFB-FL) fabrication, sensitivity enhancement packaging, and interferometric signal demodulation. The frequency response range of the system is 10Hz-10kHz, the laser frequency acoustic pressure sensitivity reaches 115 dB re Hz/Pa, and the equivalent noise acoustic pressure is less than 60μPa/Hz1/2. The dynamic range of the system is greater than 120 dB.

  7. 78 FR 45181 - Foreign-Trade Zone 230-Piedmont Triad Area, North Carolina, Authorization of Production Activity...

    Federal Register 2010, 2011, 2012, 2013, 2014

    2013-07-26

    ... DEPARTMENT OF COMMERCE Foreign-Trade Zones Board [B-31-2013] Foreign-Trade Zone 230--Piedmont Triad Area, North Carolina, Authorization of Production Activity, Oracle Flexible Packaging, Inc., (Foil... (FTZ) Board on behalf of Oracle Flexible Packaging, Inc., within Site 28, in Winston-Salem, North...

  8. A Lunar Laser Ranging Retroreflector for the 21st Century

    NASA Astrophysics Data System (ADS)

    Currie, D.; Dell-Agnello, S.; Delle Monache, G.

    Over the past forty years, Lunar Laser Ranging (LLR) to the Apollo Cube Corner (CCR) Retroreflector arrays has supplied almost all of the significant tests of General Relativity. The LLR program has evaluated the PPN parameters and addressed, for example, the possible change in the gravitational constant and the properties of the self-energy of the gravitational field. In addition, LLR has provided significant information on the composition and origin of the moon. These arrays are the only experiment of the Apollo program that are still in operation. Initially the Apollo Lunar Arrays contributed a negligible portion of the error budget used to achieve these results. Over the decades, the performance of ground stations has greatly upgraded so that the ranging accuracy has improved by more than two orders of magnitude, i.e., a factor of 140. Now, after forty years, because of the lunar librations the existing Apollo retroreflector arrays contribute significant fraction of the limiting errors in the range measurements. The University of Maryland, as the Principal Investigator for the original Apollo arrays, is now proposing a new approach to the Lunar Laser CCR array technology. The investigation of this new technology, with Professor Currie as Principal Investigator, is currently being supported by two NASA programs and, in part, also by INFN/LNF. Thus after the proposed installation on the next Lunar landing, the new arrays will support ranging observations that are a factor 100 more accurate than the current Apollo LLRRAs, from the centimeter level to the micron level. The new fundamental physics and the lunar physics that this new LLRRA can provide will be described. In the design of the new array, there are three major challenges: 1) Validate that the specifications of the CCR required for the new array, with are significantly beyond the properties of current CCRs, can indeed be achieved. 2) Address the thermal and optical effects of the absorption of solar radiation within the CCR, reduce the transfer of heat from the hot housing to the CCR and 3) Define a method of emplacing the CCR package on the lunar surface such that the relation between the optical center of the array and the center of mass of the moon remains stable over the lunar day/night cycle. The design approach, the computer simulations using Thermal Desktop, Code V and locally developed IDL software, and the results of the thermal vacuum testing conducted at the INFN/LNF's SCF facility at Frascati, Italy of the new array will also be presented. For example, the new lunar CCR housing has been built at INFN/LNF. The innovations in the LLRRA-21 with respect to the Apollo LLRR Arrays and current satellite retroreflector packages will be described. The new requirements for ground stations will be briefly addressed. This new concept for the LLRRA-21 is being considered for the NASA Manned Lunar Landings, for the NASA Anchor Nodes for the International Lunar Network and for the proposed Italian Space Agency's MAGIA lunar orbiter mission.

  9. Component-based integration of chemistry and optimization software.

    PubMed

    Kenny, Joseph P; Benson, Steven J; Alexeev, Yuri; Sarich, Jason; Janssen, Curtis L; McInnes, Lois Curfman; Krishnan, Manojkumar; Nieplocha, Jarek; Jurrus, Elizabeth; Fahlstrom, Carl; Windus, Theresa L

    2004-11-15

    Typical scientific software designs make rigid assumptions regarding programming language and data structures, frustrating software interoperability and scientific collaboration. Component-based software engineering is an emerging approach to managing the increasing complexity of scientific software. Component technology facilitates code interoperability and reuse. Through the adoption of methodology and tools developed by the Common Component Architecture Forum, we have developed a component architecture for molecular structure optimization. Using the NWChem and Massively Parallel Quantum Chemistry packages, we have produced chemistry components that provide capacity for energy and energy derivative evaluation. We have constructed geometry optimization applications by integrating the Toolkit for Advanced Optimization, Portable Extensible Toolkit for Scientific Computation, and Global Arrays packages, which provide optimization and linear algebra capabilities. We present a brief overview of the component development process and a description of abstract interfaces for chemical optimizations. The components conforming to these abstract interfaces allow the construction of applications using different chemistry and mathematics packages interchangeably. Initial numerical results for the component software demonstrate good performance, and highlight potential research enabled by this platform.

  10. 7 CFR 58.241 - Packaging, repackaging and storage.

    Code of Federal Regulations, 2011 CFR

    2011-01-01

    ... 7 Agriculture 3 2011-01-01 2011-01-01 false Packaging, repackaging and storage. 58.241 Section 58... Service 1 Operations and Operating Procedures § 58.241 Packaging, repackaging and storage. (a) Containers... palleting or dry storage areas. (c) Repackaging. The entire repackaging operation shall be conducted in a...

  11. 7 CFR 58.241 - Packaging, repackaging and storage.

    Code of Federal Regulations, 2013 CFR

    2013-01-01

    ... 7 Agriculture 3 2013-01-01 2013-01-01 false Packaging, repackaging and storage. 58.241 Section 58... Service 1 Operations and Operating Procedures § 58.241 Packaging, repackaging and storage. (a) Containers... palleting or dry storage areas. (c) Repackaging. The entire repackaging operation shall be conducted in a...

  12. 16 CFR 502.2 - Terms defined.

    Code of Federal Regulations, 2010 CFR

    2010-01-01

    ... market or trade area for a reasonably substantial period of time, i.e., a 30-day period. For consumer..., package, label, person, commerce, principal display panel, and random package have the same meaning as... person engaged in the packaging or labeling of any consumer commodity for distribution in commerce or any...

  13. Engineering study of the module/array interface for large terrestrial photovoltaic arrays

    NASA Technical Reports Server (NTRS)

    1977-01-01

    Three major areas--structural, electrical, and maintenance--were evaluated. Efforts in the structural area included establishing acceptance criteria for materials and members, determining loading criteria, and analyzing glass modules in various framing system configurations. Array support structure design was addressed briefly. Electrical considerations included evaluation of module characteristics, intermodule connectors, array wiring, converters and lightning protection. Plant maintenance features such as array cleaning, failure detection, and module installation and replacement were addressed.

  14. Construction of RNA nanocages by re-engineering the packaging RNA of Phi29 bacteriophage

    NASA Astrophysics Data System (ADS)

    Hao, Chenhui; Li, Xiang; Tian, Cheng; Jiang, Wen; Wang, Guansong; Mao, Chengde

    2014-05-01

    RNA nanotechnology promises rational design of RNA nanostructures with wide array of structural diversities and functionalities. Such nanostructures could be used in applications such as small interfering RNA delivery and organization of in vivo chemical reactions. Though having impressive development in recent years, RNA nanotechnology is still quite limited and its programmability and complexity could not rival the degree of its closely related cousin: DNA nanotechnology. Novel strategies are needed for programmed RNA self-assembly. Here, we have assembled RNA nanocages by re-engineering a natural, biological RNA motif: the packaging RNA of phi29 bacteriophage. The resulting RNA nanostructures have been thoroughly characterized by gel electrophoresis, cryogenic electron microscopy imaging and dynamic light scattering.

  15. Robust optical sensors for safety critical automotive applications

    NASA Astrophysics Data System (ADS)

    De Locht, Cliff; De Knibber, Sven; Maddalena, Sam

    2008-02-01

    Optical sensors for the automotive industry need to be robust, high performing and low cost. This paper focuses on the impact of automotive requirements on optical sensor design and packaging. Main strategies to lower optical sensor entry barriers in the automotive market include: Perform sensor calibration and tuning by the sensor manufacturer, sensor test modes on chip to guarantee functional integrity at operation, and package technology is key. As a conclusion, optical sensor applications are growing in automotive. Optical sensor robustness matured to the level of safety critical applications like Electrical Power Assisted Steering (EPAS) and Drive-by-Wire by optical linear arrays based systems and Automated Cruise Control (ACC), Lane Change Assist and Driver Classification/Smart Airbag Deployment by camera imagers based systems.

  16. SMURF: SubMillimeter User Reduction Facility

    NASA Astrophysics Data System (ADS)

    Jenness, Tim; Chapin, Edward L.; Berry, David S.; Gibb, Andy G.; Tilanus, Remo P. J.; Balfour, Jennifer; Tilanus, Vincent; Currie, Malcolm J.

    2013-10-01

    SMURF reduces submillimeter single-dish continuum and heterodyne data. It is mainly targeted at data produced by the James Clerk Maxwell Telescope but data from other telescopes have been reduced using the package. SMURF is released as part of the bundle that comprises Starlink (ascl:1110.012) and most of the packages that use it. The two key commands are MAKEMAP for the creation of maps from sub millimeter continuum data and MAKECUBE for the creation of data cubes from heterodyne array instruments. The software can also convert data from legacy JCMT file formats to the modern form to allow it to be processed by MAKECUBE. SMURF is a core component of the ORAC-DR (ascl:1310.001) data reduction pipeline for JCMT.

  17. A survey of packages for large linear systems

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Wu, Kesheng; Milne, Brent

    2000-02-11

    This paper evaluates portable software packages for the iterative solution of very large sparse linear systems on parallel architectures. While we cannot hope to tell individual users which package will best suit their needs, we do hope that our systematic evaluation provides essential unbiased information about the packages and the evaluation process may serve as an example on how to evaluate these packages. The information contained here include feature comparisons, usability evaluations and performance characterizations. This review is primarily focused on self-contained packages that can be easily integrated into an existing program and are capable of computing solutions to verymore » large sparse linear systems of equations. More specifically, it concentrates on portable parallel linear system solution packages that provide iterative solution schemes and related preconditioning schemes because iterative methods are more frequently used than competing schemes such as direct methods. The eight packages evaluated are: Aztec, BlockSolve,ISIS++, LINSOL, P-SPARSLIB, PARASOL, PETSc, and PINEAPL. Among the eight portable parallel iterative linear system solvers reviewed, we recommend PETSc and Aztec for most application programmers because they have well designed user interface, extensive documentation and very responsive user support. Both PETSc and Aztec are written in the C language and are callable from Fortran. For those users interested in using Fortran 90, PARASOL is a good alternative. ISIS++is a good alternative for those who prefer the C++ language. Both PARASOL and ISIS++ are relatively new and are continuously evolving. Thus their user interface may change. In general, those packages written in Fortran 77 are more cumbersome to use because the user may need to directly deal with a number of arrays of varying sizes. Languages like C++ and Fortran 90 offer more convenient data encapsulation mechanisms which make it easier to implement a clean and intuitive user interface. In addition to reviewing these portable parallel iterative solver packages, we also provide a more cursory assessment of a range of related packages, from specialized parallel preconditioners to direct methods for sparse linear systems.« less

  18. Flexible Bond Wire Capacitive Strain Sensor for Vehicle Tyres.

    PubMed

    Cao, Siyang; Pyatt, Simon; Anthony, Carl J; Kubba, Ammar I; Kubba, Ali E; Olatunbosun, Oluremi

    2016-06-21

    The safety of the driving experience and manoeuvrability of a vehicle can be improved by detecting the strain in tyres. To measure strain accurately in rubber, the strain sensor needs to be flexible so that it does not deform the medium that it is measuring. In this work, a novel flexible bond wire capacitive strain sensor for measuring the strain in tyres is developed, fabricated and calibrated. An array of 25 micron diameter wire bonds in an approximately 8 mm × 8 mm area is built to create an interdigitated structure, which consists of 50 wire loops resulting in 49 capacitor pairs in parallel. Laser machining was used to pattern copper on a flexible printed circuit board PCB to make the bond pads for the wire attachment. The wire array was finally packaged and embedded in polydimethylsiloxane (PDMS), which acts as the structural material that is strained. The capacitance of the device is in a linear like relationship with respect to the strain, which can measure the strain up to at least ±60,000 micro-strain (±6%) with a resolution of ~132 micro-strain (0.013%). In-tyre testing under static loading has shown the ability of the sensor to measure large tyre strains. The technology used for sensor fabrication lends itself to mass production and so the design is considered to be consistent with low cost commercialisable strain sensing technology.

  19. Design of an ultra low power CMOS pixel sensor for a future neutron personal dosimeter

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Zhang, Y.; Hu-Guo, C.; Husson, D.

    2011-07-01

    Despite a continuously increasing demand, neutron electronic personal dosimeters (EPDs) are still far from being completely established because their development is a very difficult task. A low-noise, ultra low power consumption CMOS pixel sensor for a future neutron personal dosimeter has been implemented in a 0.35 {mu}m CMOS technology. The prototype is composed of a pixel array for detection of charged particles, and the readout electronics is integrated on the same substrate for signal processing. The excess electrons generated by an impinging particle are collected by the pixel array. The charge collection time and the efficiency are the crucial pointsmore » of a CMOS detector. The 3-D device simulations using the commercially available Synopsys-SENTAURUS package address the detailed charge collection process. Within a time of 1.9 {mu}s, about 59% electrons created by the impact particle are collected in a cluster of 4 x 4 pixels with the pixel pitch of 80 {mu}m. A charge sensitive preamplifier (CSA) and a shaper are employed in the frond-end readout. The tests with electrical signals indicate that our prototype with a total active area of 2.56 x 2.56 mm{sup 2} performs an equivalent noise charge (ENC) of less than 400 e - and 314 {mu}W power consumption, leading to a promising prototype. (authors)« less

  20. Flexible Bond Wire Capacitive Strain Sensor for Vehicle Tyres

    PubMed Central

    Cao, Siyang; Pyatt, Simon; Anthony, Carl J.; Kubba, Ammar I.; Kubba, Ali E.; Olatunbosun, Oluremi

    2016-01-01

    The safety of the driving experience and manoeuvrability of a vehicle can be improved by detecting the strain in tyres. To measure strain accurately in rubber, the strain sensor needs to be flexible so that it does not deform the medium that it is measuring. In this work, a novel flexible bond wire capacitive strain sensor for measuring the strain in tyres is developed, fabricated and calibrated. An array of 25 micron diameter wire bonds in an approximately 8 mm × 8 mm area is built to create an interdigitated structure, which consists of 50 wire loops resulting in 49 capacitor pairs in parallel. Laser machining was used to pattern copper on a flexible printed circuit board PCB to make the bond pads for the wire attachment. The wire array was finally packaged and embedded in polydimethylsiloxane (PDMS), which acts as the structural material that is strained. The capacitance of the device is in a linear like relationship with respect to the strain, which can measure the strain up to at least ±60,000 micro-strain (±6%) with a resolution of ~132 micro-strain (0.013%). In-tyre testing under static loading has shown the ability of the sensor to measure large tyre strains. The technology used for sensor fabrication lends itself to mass production and so the design is considered to be consistent with low cost commercialisable strain sensing technology. PMID:27338402

  1. A high-speed GaAs MESFET optical controller

    NASA Technical Reports Server (NTRS)

    Claspy, P. C.; Bhasin, K. B.; Richard, M.; Bendett, M.; Gustafson, G.

    1989-01-01

    Optical interconnects are being considered for control signal distribution in phased array antennas. A packaged hybrid GaAs optical controller with a 1:16 demultiplexed output that is suitable for this application is described. The controller, which was fabricated using enhancement/depletion mode MESFET technology, operates at demultiplexer-limited input data rates up to 305 Mb/s and requires less than 200 microW optical input power.

  2. Packaging and Mounting of In-Fibre Bragg Grating Arrays for Structural Health Monitoring of Large Structures

    DTIC Science & Technology

    2010-10-01

    33 Abbreviations CFRP Carbon Fibre Reinforced Polymer FBG Fibre Bragg Grating FGI Fiberglass International FO... Fibre Optic FOS Fibre Optic Sensor GFRP Glass Fibre Reinforced Polymer HDPE High Density Polyethylene LED Light Emitting Diode MHC Mine Hunter...subsequent paragraphs. An operational loads monitoring system for wind turbine blades was demonstrated [7] using FBGs surface-mounted onto glass fibre

  3. Initial Results: An Ultra-Low-Background Germanium Crystal Array

    DTIC Science & Technology

    2010-09-01

    data (focused on γ -γ coincidence signatures) (Smith et al., 2004) and the Multi- Isotope Coincidence Analysis code (MICA) (Warren et al., 2006). The...The follow-on “CASCADES” project aims to develop a multicoincidence data- analysis package and make robust fission-product demonstration measurements...sensitivity. This effort is focused on improving gamma analysis capabilities for nuclear detonation detection (NDD) applications, e.g., nuclear treaty

  4. Fabrication and Packaging of Discontinuous MIM (Metal-Insulator-Metal) Film Arrays for Efficient MM Wave and IR Detection and Mixing.

    DTIC Science & Technology

    1987-10-01

    ADDRESS 12. REPORT DATE II. &. krm Researh Office -October, 1987 Podt Office 8ox 12211 IS. MUMBER OF PAGES Research Triangle Parli NC 2770 61 14...11 Ac know ledaements The authors wi.sh to thank Ms. Dora Liverman of the Biology Department for assistance in the SEM work. This research is

  5. Status of the Direct Data Distribution (D(exp 3)) Experiment

    NASA Technical Reports Server (NTRS)

    Wald, Lawrence

    2001-01-01

    NASA Glenn Research Center's Direct Data Distribution (D3) project will demonstrate an advanced, high-performance communications system that transmits information from an advanced technology payload carried by a NASA spacecraft in low Earth orbit (LEO) to a small receiving terminal on Earth. The space-based communications package will utilize a solid-state, K-band phased-array antenna that electronically steers the radiated energy beam toward a low-cost, tracking ground terminal, thereby providing agile, vibration-free, electronic steering at reduced size and weight with increased reliability. The array-based link will also demonstrate new digital processing technology that will allow the transmission of substantially increased amounts of latency-tolerant data collected from the LEO spacecraft directly to NASA field centers, principal investigators, or into the commercial terrestrial communications network. The technologies demonstrated by D3 will facilitate NASA's transition from using Government-owned communication assets to using commercial communication services. The hardware for D3 will incorporate advanced technology components developed under the High Rate Data Delivery (HRDD) Thrust Area of NASA's Office of Aerospace Technology Space Base Program at Glenn's Communications Technology Division. The flight segment components will include the electrically steerable phased-array antenna, which is being built by the Raytheon System Corporation and utilizes monolithic microwave integrated circuit (MMIC) technology operating at 19.05 GHz; and the digital encoder/modulator chipset, which uses four-channel orthogonal frequency division multiplexing (OFDM). The encoder/modulator will use a chipset developed by SICOM, Inc., which is both bandwidth and power efficient. The ground segment components will include a low-cost, open-loop tracking ground terminal incorporating a cryoreceiver to minimize terminal size without compromising receiver capability. The project is planning to hold a critical design review in the second quarter of fiscal year 2002.

  6. A case for ZnO nanowire field emitter arrays in advanced x-ray source applications

    NASA Astrophysics Data System (ADS)

    Robinson, Vance S.; Bergkvist, Magnus; Chen, Daokun; Chen, Jun; Huang, Mengbing

    2016-09-01

    Reviewing current efforts in X-ray source miniaturization reveals a broad spectrum of applications: Portable and/or remote nondestructive evaluation, high throughput protein crystallography, invasive radiotherapy, monitoring fluid flow and particulate generation in situ, and portable radiography devices for battle-front or large scale disaster triage scenarios. For the most part, all of these applications are being addressed with a top-down approach aimed at improving portability, weight and size. That is, the existing system or a critical sub-component is shrunk in some manner in order to miniaturize the overall package. In parallel to top-down x-ray source miniaturization, more recent efforts leverage field emission and semiconductor device fabrication techniques to achieve small scale x-ray sources via a bottom-up approach where phenomena effective at a micro/nanoscale are coordinated for macro-scale effect. The bottom-up approach holds potential to address all the applications previously mentioned but its entitlement extends into new applications with much more ground-breaking potential. One such bottom-up application is the distributed x-ray source platform. In the medical space, using an array of microscale x-ray sources instead of a single source promises significant reductions in patient dose as well as smaller feature detectability and fewer image artifacts. Cold cathode field emitters are ideal for this application because they can be gated electrostatically or via photonic excitation, they do not generate excessive heat like other common electron emitters, they have higher brightness and they are relatively compact. This document describes how ZnO nanowire field emitter arrays are well suited for distributed x-ray source applications because they hold promise in each of the following critical areas: emission stability, simple scalable fabrication, performance, radiation resistance and photonic coupling.

  7. Computing and software

    USGS Publications Warehouse

    White, Gary C.; Hines, J.E.

    2004-01-01

    The reality is that the statistical methods used for analysis of data depend upon the availability of software. Analysis of marked animal data is no different than the rest of the statistical field. The methods used for analysis are those that are available in reliable software packages. Thus, the critical importance of having reliable, up–to–date software available to biologists is obvious. Statisticians have continued to develop more robust models, ever expanding the suite of potential analysis methodsavailable. But without software to implement these newer methods, they will languish in the abstract, and not be applied to the problems deserving them.In the Computers and Software Session, two new software packages are described, a comparison of implementation of methods for the estimation of nest survival is provided, and a more speculative paper about how the next generation of software might be structured is presented.Rotella et al. (2004) compare nest survival estimation with different software packages: SAS logistic regression, SAS non–linear mixed models, and Program MARK. Nests are assumed to be visited at various, possibly infrequent, intervals. All of the approaches described compute nest survival with the same likelihood, and require that the age of the nest is known to account for nests that eventually hatch. However, each approach offers advantages and disadvantages, explored by Rotella et al. (2004).Efford et al. (2004) present a new software package called DENSITY. The package computes population abundance and density from trapping arrays and other detection methods with a new and unique approach. DENSITY represents the first major addition to the analysis of trapping arrays in 20 years.Barker & White (2004) discuss how existing software such as Program MARK require that each new model’s likelihood must be programmed specifically for that model. They wishfully think that future software might allow the user to combine pieces of likelihood functions together to generate estimates. The idea is interesting, and maybe some bright young statistician can work out the specifics to implement the procedure.Choquet et al. (2004) describe MSURGE, a software package that implements the multistate capture–recapture models. The unique feature of MSURGE is that the design matrix is constructed with an interpreted language called GEMACO. Because MSURGE is limited to just multistate models, the special requirements of these likelihoods can be provided.The software and methods presented in these papers gives biologists and wildlife managers an expanding range of possibilities for data analysis. Although ease–of–use is generally getting better, it does not replace the need for understanding of the requirements and structure of the models being computed. The internet provides access to many free software packages as well as user–discussion groups to share knowledge and ideas. (A starting point for wildlife–related applications is (http://www.phidot.org).

  8. A new generation of ultra-dense optical I/O for silicon photonics

    NASA Astrophysics Data System (ADS)

    Wlodawski, Mitchell S.; Kopp, Victor I.; Park, Jongchul; Singer, Jonathan; Hubner, Eric E.; Neugroschl, Daniel; Chao, Norman; Genack, Azriel Z.

    2014-03-01

    In response to the optical packaging needs of a rapidly growing silicon photonics market, Chiral Photonics, Inc. (CPI) has developed a new generation of ultra-dense-channel, bi-directional, all-optical, input/output (I/O) couplers that bridge the data transport gap between standard optical fibers and photonic integrated circuits. These couplers, called Pitch Reducing Optical Fiber Arrays (PROFAs), provide a means to simultaneously match both the mode field and channel spacing (i.e. pitch) between an optical fiber array and a photonic integrated circuit (PIC). Both primary methods for optically interfacing with PICs, via vertical grating couplers (VGCs) and edge couplers, can be addressed with PROFAs. PROFAs bring the signal-carrying cores, either multimode or singlemode, of many optical fibers into close proximity within an all-glass device that can provide low loss coupling to on-chip components, including waveguides, gratings, detectors and emitters. Two-dimensional (2D) PROFAs offer more than an order of magnitude enhancement in channel density compared to conventional one-dimensional (1D) fiber arrays. PROFAs can also be used with low vertical profile solutions that simplify optoelectronic packaging while reducing PIC I/O real estate usage requirements. PROFA technology is based on a scalable production process for microforming glass preform assemblies as they are pulled through a small oven. An innovative fiber design, called the "vanishing core," enables tailoring the mode field along the length of the PROFA to meet the coupling needs of disparate waveguide technologies, such as fiber and onchip. Examples of single- and multi-channel couplers fabricated using this technology will be presented.

  9. Woven electrochemical fabric-based test sensors (WEFTS): a new class of multiplexed electrochemical sensors.

    PubMed

    Choudhary, Tripurari; Rajamanickam, G P; Dendukuri, Dhananjaya

    2015-05-07

    We present textile weaving as a new technique for the manufacture of miniature electrochemical sensors with significant advantages over current fabrication techniques. Biocompatible silk yarn is used as the material for fabrication instead of plastics and ceramics used in commercial sensors. Silk yarns are coated with conducting inks and reagents before being handloom-woven as electrodes into patches of fabric to create arrays of sensors, which are then laminated, cut and packaged into individual sensors. Unlike the conventionally used screen-printing, which results in wastage of reagents, yarn coating uses only as much reagent and ink as required. Hydrophilic and hydrophobic yarns are used for patterning so that sample flow is restricted to a small area of the sensor. This simple fluidic control is achieved with readily available materials. We have fabricated and validated individual sensors for glucose and hemoglobin and a multiplexed sensor, which can detect both analytes. Chronoamperometry and differential pulse voltammetry (DPV) were used to detect glucose and hemoglobin, respectively. Industrial quantities of these sensors can be fabricated at distributed locations in the developing world using existing skills and manufacturing facilities. We believe such sensors could find applications in the emerging area of wearable sensors for chemical testing.

  10. MIRAGE: developments in IRSP systems, RIIC design, emitter fabrication, and performance

    NASA Astrophysics Data System (ADS)

    Bryant, Paul; Oleson, Jim; James, Jay; McHugh, Steve; Lannon, John; Vellenga, David; Goodwin, Scott; Huffman, Alan; Solomon, Steve; Goldsmith, George C., II

    2005-05-01

    SBIR's family of MIRAGE infrared scene projection systems is undergoing significant growth and expansion. The first two lots of production IR emitters have completed fabrication at Microelectronics Center of North Carolina/Research and Development Institute (MCNC-RDI), and the next round(s) of emitter production has begun. These latest emitter arrays support programs such as Large Format Resistive Array (LFRA), Optimized Array for Space-based Infrared Simulation (OASIS), MIRAGE 1.5, and MIRAGE II. We present the latest performance data on emitters fabricated at MCNC-RDI, plus integrated system performance on recently completed IRSP systems. Teamed with FLIR Systems/Indigo Operations, SBIR and the Tri-Services IRSP Working Group have completed development of the CMOS Read-In Integrated Circuit (RIIC) portion of the Wide Format Resistive Array (WFRA) program-to extend LFRA performance to a 768 x 1536 "wide screen" projection configuration. WFRA RIIC architecture and performance is presented. Finally, we summarize development of the LFRA Digital Emitter Engine (DEE) and OASIS cryogenic package assemblies, the next-generation Command & Control Electronics (C&CE).

  11. Multilevel photonic modules for millimeter-wave phased-array antennas

    NASA Astrophysics Data System (ADS)

    Paolella, Arthur C.; Bauerle, Athena; Joshi, Abhay M.; Wright, James G.; Coryell, Louis A.

    2000-09-01

    Millimeter wave phased array systems have antenna element sizes and spacings similar to MMIC chip dimensions by virtue of the operating wavelength. Designing modules in traditional planar packaing techniques are therefore difficult to implement. An advantageous way to maintain a small module footprint compatible with Ka-Band and high frequency systems is to take advantage of two leading edge technologies, opto- electronic integrated circuits (OEICs) and multilevel packaging technology. Under a Phase II SBIR these technologies are combined to form photonic modules for optically controlled millimeter wave phased array antennas. The proposed module, consisting of an OEIC integrated with a planar antenna array will operate on the 40GHz region. The OEIC consists of an InP based dual-depletion PIN photodetector and distributed amplifier. The multi-level module will be fabricated using an enhanced circuit processing thick film process. Since the modules are batch fabricated using an enhanced circuit processing thick film process. Since the modules are batch fabricated, using standard commercial processes, it has the potential to be low cost while maintaining high performance, impacting both military and commercial communications systems.

  12. Ultrasonic simulation—Imagine3D and SimScan: Tools to solve the inverse problem for complex turbine components

    NASA Astrophysics Data System (ADS)

    Mair, H. D.; Ciorau, P.; Owen, D.; Hazelton, T.; Dunning, G.

    2000-05-01

    Two ultrasonic simulation packages: Imagine 3D and SIMSCAN have specifically been developed to solve the inverse problem for blade root and rotor steeple of low-pressure turbine. The software was integrated with the 3D drawing of the inspected parts, and with the dimensions of linear phased-array probes. SIMSCAN simulates the inspection scenario in both optional conditions: defect location and probe movement/refracted angle range. The results are displayed into Imagine 3-D, with a variety of options: rendering, display 1:1, grid, generated UT beam. The results are very useful for procedure developer, training and to optimize the phased-array probe inspection sequence. A spreadsheet is generated to correlate the defect coordinates with UT data (probe position, skew and refracted angle, UT path, and probe movement). The simulation models were validated during experimental work with phased-array systems. The accuracy in probe position is ±1 mm, and the refracted/skew angle is within ±0.5°. Representative examples of phased array focal laws/probe movement for a specific defect location, are also included.

  13. Fill-factor improvement of Si CMOS single-photon avalanche diode detector arrays by integration of diffractive microlens arrays.

    PubMed

    Intermite, Giuseppe; McCarthy, Aongus; Warburton, Ryan E; Ren, Ximing; Villa, Federica; Lussana, Rudi; Waddie, Andrew J; Taghizadeh, Mohammad R; Tosi, Alberto; Zappa, Franco; Buller, Gerald S

    2015-12-28

    Single-photon avalanche diode (SPAD) detector arrays generally suffer from having a low fill-factor, in which the photo-sensitive area of each pixel is small compared to the overall area of the pixel. This paper describes the integration of different configurations of high efficiency diffractive optical microlens arrays onto a 32 × 32 SPAD array, fabricated using a 0.35 µm CMOS technology process. The characterization of SPAD arrays with integrated microlens arrays is reported over the spectral range of 500-900 nm, and a range of f-numbers from f/2 to f/22. We report an average concentration factor of 15 measured for the entire SPAD array with integrated microlens array. The integrated SPAD and microlens array demonstrated a very high uniformity in overall efficiency.

  14. [Establishment and verification of detecting multiple biomarkers for ovarian cancer by suspension array technology].

    PubMed

    Zhao, B B; Yang, Z J; Wang, Q; Pan, Z M; Zhang, W; Li, D R; Li, L

    2016-10-25

    Objective: Establish and validation of combined detecting of CCL18, CXCL1, C1D, TM4SF1, FXR1, TIZ suspension array technology. Methods: (1)CCL18, CXCL1 monoclonal antibody and C1D, TM4SF1, FXR1, TIZ protein were coupled with polyethylene microspheres. Biotinylated CCL18, CXCL1 polyclonal antibody and sheep anti-human IgG polyclonal antibody were prepared simultaneously. The best packaged concentrations of CCL18, CXCL1 monoclonal antibody and C1D, TM4SF1, FXR1, TIZ antigens were optimized. The best packaged concentrations of CCL18, CXCL1 polyclonal antibodys and C1D, TM4SF1, FXR1, TIZ sheep anti-human IgG polyclonal antibody were optimized to establish a stable detected suspension array.(2)Sixty patients confirmed by pathological examination with ovarian cancer(ovarian cancer group)which treated in Affiliated Tumor Hospital of Guangxi Medical University, 30 patients with ovarian benign tumor(benign group)and 30 cases of healthy women(control group)were chosen between September 2003 and December 2003. Suspension array technology and ELISA method were used to detect expression of CCL18, CXCL1 antigen and C1D, TM4SF1, FXR1 and TIZ IgG autoantibody contented in 3 groups of serum, then to compare the diagnostic efficiency and diagnostic accuracy of two methods(coefficient of variation between batch and batch). Results: (1)This research successfully established stable detecting system of CCL18, CXCL1, C1D, TM4SF1, FXR1 and TIZ IgG autoantibody. The best concentration of CCL18, CXCL1 monoclonal antibody and C1D, TM4SF1, FXR1, TIZ antigen package were 8, 8, 12, 8, 4 and 8 μg/ml; the best detection of CCL18, CXCL1 biotin polyclonal antibody and C1D, TM4SF1, FXR1, TIZ sheep anti-huamne IgG polyclonal antibody were respectively 4, 2, 2, 4, 4 and 2 μg/ml.(2)Suspension array technology and ELISA method were used to detect CCL18, CXCL1 antigen and C1D, TM4SF1, FXR1, TIZ IgG autoantibody of three groups in serum were similar( P >0.05).(3)The comparison of two methods in the diagnosis of efficiency: the diagnostic accuracy of two methods were 99.2%(119/120)and 94.2%(113/120), the difference was statistically significant( P =0.031). The sensitivity of the diagnosis of ovarian cancer of two methods were 100.0%(60/60)and 93.3%(56/60), specific degrees were 100.0%(59/59)and 93.4%(57/61), positive predictive value was 100.0%(60/60)and 93.3%(56/60), negative predictive value was 98.3%(59/60)and 95.0%(57/60), the difference was statistically significant( P <0.05).(4)The detected results of CCL18, CXCL1 antigen and C1D, TM4SF1, FXR1, TIZ IgG autoantibody shown that the diagnostic accuracy of suspension array technology was superior to those of ELISA method(all P <0.05). Conclusion: The study has established the stable detection of suspension array technology, and the diagnostic efficiency and diagnostic accuracy was much better than that by ELISA.

  15. Limits of variation, specific infectivity, and genome packaging of massively recoded poliovirus genomes.

    PubMed

    Song, Yutong; Gorbatsevych, Oleksandr; Liu, Ying; Mugavero, JoAnn; Shen, Sam H; Ward, Charles B; Asare, Emmanuel; Jiang, Ping; Paul, Aniko V; Mueller, Steffen; Wimmer, Eckard

    2017-10-10

    Computer design and chemical synthesis generated viable variants of poliovirus type 1 (PV1), whose ORF (6,189 nucleotides) carried up to 1,297 "Max" mutations (excess of overrepresented synonymous codon pairs) or up to 2,104 "SD" mutations (randomly scrambled synonymous codons). "Min" variants (excess of underrepresented synonymous codon pairs) are nonviable except for P2 Min , a variant temperature-sensitive at 33 and 39.5 °C. Compared with WT PV1, P2 Min displayed a vastly reduced specific infectivity (si) (WT, 1 PFU/118 particles vs. P2 Min , 1 PFU/35,000 particles), a phenotype that will be discussed broadly. Si of haploid PV presents cellular infectivity of a single genotype. We performed a comprehensive analysis of sequence and structures of the PV genome to determine if evolutionary conserved cis-acting packaging signal(s) were preserved after recoding. We showed that conserved synonymous sites and/or local secondary structures that might play a role in determining packaging specificity do not survive codon pair recoding. This makes it unlikely that numerous "cryptic, sequence-degenerate, dispersed RNA packaging signals mapping along the entire viral genome" [Patel N, et al. (2017) Nat Microbiol 2:17098] play the critical role in poliovirus packaging specificity. Considering all available evidence, we propose a two-step assembly strategy for +ssRNA viruses: step I, acquisition of packaging specificity, either ( a ) by specific recognition between capsid protein(s) and replication proteins (poliovirus), or ( b ) by the high affinity interaction of a single RNA packaging signal (PS) with capsid protein(s) (most +ssRNA viruses so far studied); step II, cocondensation of genome/capsid precursors in which an array of hairpin structures plays a role in virion formation.

  16. Cleanup Verification Package for the 600-47 Waste Site

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    M. J. Cutlip

    This cleanup verification package documents completion of interim remedial action for the 600-47 waste site. This site consisted of several areas of surface debris and contamination near the banks of the Columbia River across from Johnson Island. Contaminated material identified in field surveys included four areas of soil, wood, nuts, bolts, and other metal debris.

  17. 16 CFR 500.21 - Type size in relationship to the area of the principal display panel.

    Code of Federal Regulations, 2010 CFR

    2010-01-01

    ... principal display panel. 500.21 Section 500.21 Commercial Practices FEDERAL TRADE COMMISSION RULES... relationship to the area of the principal display panel. (a) The statement of net quantity of contents shall be... display panel of the package or commodity and shall be uniform for all packages or commodities of...

  18. Effects of box liner perforation area on methyl bromide diffusion into table grape packages during fumigation

    USDA-ARS?s Scientific Manuscript database

    Plastic liners are used inside boxes of table grapes to retard moisture loss from the grapes and to contain sulfur dioxide gas released inside the packages to control postharvest decay. However, to control organisms of quarantine concern, regulators specify exported packages must be fumigated with m...

  19. Preferences for benefit packages for community-based health insurance: an exploratory study in Nigeria.

    PubMed

    Onwujekwe, Obinna; Onoka, Chima; Uguru, Nkoli; Nnenna, Tasie; Uzochukwu, Benjamin; Eze, Soludo; Kirigia, Joses; Petu, Amos

    2010-06-12

    It is important that community-based health insurance (CBHI) schemes are designed in such a way as to ensure the relevance of the benefit packages to potential clients. Hence, this paper provides an understanding of the preferred benefit packages by different economic status groups as well as urban and rural dwellers for CBHI in Southeast Nigeria. The study took place in rural, urban and semi-urban communities of south-east Nigeria. A questionnaire was used to collect information from 3070 randomly picked household heads. Focus group discussions were used to collect qualitative data. Data was examined for links between preferences for benefit packages with SES and geographic residence of the respondents. Respondents in the rural areas and in the lower SES preferred a comprehensive benefit package which includes all inpatient, outpatient and emergencies services, while those in urban areas as well as those in the higher SES group showed a preference for benefit packages which will cover only basic disease control interventions. Equity concerns in preferences for services to be offered by the CBHI scheme should be addressed for CBHI to succeed in different contexts.

  20. Examination of shipping packages 9975-01641, 9975-01692, 9975-03373, 9975-02101 AND 9975-02713

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Daugherty, W. L.

    SRNL has assisted in the examination of five 9975 shipping packages following storage of nuclear material in K-Area Complex (KAC). Two packages (9975-01641 and -01692) with water intrusion resulting from a roof leak were selected for detailed examination after internal fiberboard degradation (mold) was observed. 9975-01692 contained regions of saturated fiberboard and significant mold, while the second package was less degraded. A third package (9975-03373) was removed from storage for routine surveillance activities, and set aside for further examination after a musty odor was noted inside. No additional degradation was noted in 9975-03373, but the lower assembly could not bemore » removed from the drum for detailed examination. Two additional packages (9975-02101 and -02713) identified for further examination were among a larger group selected for surveillance as part of a specific focus on high-wattage packages. These two packages displayed several non-conforming conditions, including the following: (1) the axial gap criterion was exceeded, (2) a significant concentration of moisture was found in the bottom fiberboard layers, with active mold in this area, (3) condensation and/or water stains were observed on internal components (drum, lid, air shield), and (4) both drums contained localized corrosion along the bottom lip. It is recommended that a new screening check be implemented for packages that are removed from storage, as well as high wattage packages remaining in storage. An initial survey for corrosion along the drum bottom lip of high wattage packages could identify potential degraded packages for future surveillance focus. In addition, after packages have been removed from storage (and unloaded), the drum bottom lip and underside should be inspected for corrosion. The presence of corrosion could signal the need to remove the lower fiberboard assembly for further inspection of the fiberboard and drum prior to recertification of the package.« less

  1. Tutorial: Performance and reliability in redundant disk arrays

    NASA Technical Reports Server (NTRS)

    Gibson, Garth A.

    1993-01-01

    A disk array is a collection of physically small magnetic disks that is packaged as a single unit but operates in parallel. Disk arrays capitalize on the availability of small-diameter disks from a price-competitive market to provide the cost, volume, and capacity of current disk systems but many times their performance. Unfortunately, relative to current disk systems, the larger number of components in disk arrays leads to higher rates of failure. To tolerate failures, redundant disk arrays devote a fraction of their capacity to an encoding of their information. This redundant information enables the contents of a failed disk to be recovered from the contents of non-failed disks. The simplest and least expensive encoding for this redundancy, known as N+1 parity is highlighted. In addition to compensating for the higher failure rates of disk arrays, redundancy allows highly reliable secondary storage systems to be built much more cost-effectively than is now achieved in conventional duplicated disks. Disk arrays that combine redundancy with the parallelism of many small-diameter disks are often called Redundant Arrays of Inexpensive Disks (RAID). This combination promises improvements to both the performance and the reliability of secondary storage. For example, IBM's premier disk product, the IBM 3390, is compared to a redundant disk array constructed of 84 IBM 0661 3 1/2-inch disks. The redundant disk array has comparable or superior values for each of the metrics given and appears likely to cost less. In the first section of this tutorial, I explain how disk arrays exploit the emergence of high performance, small magnetic disks to provide cost-effective disk parallelism that combats the access and transfer gap problems. The flexibility of disk-array configurations benefits manufacturer and consumer alike. In contrast, I describe in this tutorial's second half how parallelism, achieved through increasing numbers of components, causes overall failure rates to rise. Redundant disk arrays overcome this threat to data reliability by ensuring that data remains available during and after component failures.

  2. Environmental databases and other computerized information tools

    NASA Technical Reports Server (NTRS)

    Clark-Ingram, Marceia

    1995-01-01

    Increasing environmental legislation has brought about the development of many new environmental databases and software application packages to aid in the quest for environmental compliance. These databases and software packages are useful tools and applicable to a wide range of environmental areas from atmospheric modeling to materials replacement technology. The great abundance of such products and services can be very overwhelming when trying to identify the tools which best meet specific needs. This paper will discuss the types of environmental databases and software packages available. This discussion will also encompass the affected environmental areas of concern, product capabilities, and hardware requirements for product utilization.

  3. Validity and reliability of rectus femoris ultrasound measurements: Comparison of curved-array and linear-array transducers.

    PubMed

    Hammond, Kendra; Mampilly, Jobby; Laghi, Franco A; Goyal, Amit; Collins, Eileen G; McBurney, Conor; Jubran, Amal; Tobin, Martin J

    2014-01-01

    Muscle-mass loss augers increased morbidity and mortality in critically ill patients. Muscle-mass loss can be assessed by wide linear-array ultrasound transducers connected to cumbersome, expensive console units. Whether cheaper, hand-carried units equipped with curved-array transducers can be used as alternatives is unknown. Accordingly, our primary aim was to investigate in 15 nondisabled subjects the validity of measurements of rectus femoris cross-sectional area by using a curved-array transducer against a linear-array transducer-the reference-standard technique. In these subjects, we also determined the reliability of measurements obtained by a novice operator versus measurements obtained by an experienced operator. Lastly, the relationship between quadriceps strength and rectus area recorded by two experienced operators with a curved-array transducer was assessed in 17 patients with chronic obstructive pulmonary disease (COPD). In nondisabled subjects, the rectus cross-sectional area measured with the curved-array transducer by the novice and experienced operators was valid (intraclass correlation coefficient [ICC]: 0.98, typical percentage error [%TE]: 3.7%) and reliable (ICC: 0.79, %TE: 9.7%). In the subjects with COPD, both reliability (ICC: 0.99) and repeatability (%TE: 7.6% and 9.8%) were high. Rectus area was related to quadriceps strength in COPD for both experienced operators (coefficient of determination: 0.67 and 0.70). In conclusion, measurements of rectus femoris cross-sectional area recorded with a curved-array transducer connected to a hand-carried unit are valid, reliable, and reproducible, leading us to contend that this technique is suitable for cross-sectional and longitudinal studies.

  4. Conceptual design study of concentrator enhanced solar arrays for space applications. 2kW Si and GaAs systems at 1 AU

    NASA Technical Reports Server (NTRS)

    1980-01-01

    The effect of concentration level on the specific power for a deployable, thin, gallium arsenide cell array in geosynchronous orbit for 10 years in conjunction with a two dimensional flat plate trough concentrator (V trough) and also with a multiple flat plate concentrator was investigated as well as the effects for a conventional silicon cell array on a rigid substrate. For application to a thin GaAs array at 1 AU for 10 years, the V trough produces a 19% benefit in specific power and a dramatic reduction in array area, while the multiple flat plate collector design is not only of no benefit, but is a considerable detriment. The benefit it achieves by reducing array area is duplicated by the 2D design. For the silicon array on a rigid substrate, improvement in performance due to a concentrator with ordinary mirror coating is quite small: 9% increase in specific power, and 13% reduction in array area. When the concentrator mirrors are coated with an improved cold mirror coating, somewhat more significant results are obtained: 31% specific power improvement; and 27% area reduction. In both cases, a 10 year exposure reduces BOL output by 23%.

  5. Broadband High Efficiency Fractal-Like and Diverse Geometry Silicon Nanowire Arrays for Photovoltaic Applications

    NASA Astrophysics Data System (ADS)

    AL-Zoubi, Omar H.

    Solar energy has many advantages over conventional sources of energy. It is abundant, clean and sustainable. One way to convert solar energy directly into electrical energy is by using the photovoltaic solar cells (PVSC). Despite PVSC are becoming economically competitive, they still have high cost and low light to electricity conversion efficiency. Therefore, increasing the efficiency and reducing the cost are key elements for producing economically more competitive PVSC that would have significant impact on energy market and saving environment. A significant percentage of the PVSC cost is due to the materials cost. For that, thin films PVSC have been proposed which offer the benefits of the low amount of material and fabrication costs. Regrettably, thin film PVSC show poor light to electricity conversion efficiency because of many factors especially the high optical losses. To enhance conversion efficiency, numerous techniques have been proposed to reduce the optical losses and to enhance the absorption of light in thin film PVSC. One promising technique is the nanowire (NW) arrays in general and the silicon nanowire (SiNW) arrays in particular. The purpose of this research is to introduce vertically aligned SiNW arrays with enhanced and broadband absorption covering the entire solar spectrum while simultaneously reducing the amount of material used. To this end, we apply new concept for designing SiNW arrays based on employing diversity of physical dimensions, especially radial diversity within certain lattice configurations. In order to study the interaction of light with SiNW arrays and compute their optical properties, electromagnetic numerical modeling is used. A commercial numerical electromagnetic solver software package, high frequency structure simulation (HFSS), is utilized to model the SiNW arrays and to study their optical properties. We studied different geometries factors that affect the optical properties of SiNW arrays. Based on this study, we found that the optical properties of SiNW arrays are strongly affected by the radial diversity, the arrangement of SiNW in a lattice, and the configuration of such lattice. The proper selection of these parameters leads to broaden and enhance the light absorption of the SiNW arrays. Inspired by natural configurations, fractal geometry and diamond lattice structures, we introduced two lattice configurations: fractal-like array (FLA) that is inspired by fractal geometry, and diamond-like array (DLA) that is inspired by diamond crystal lattice structure. Optimization, using parametric analysis, of the introduced arrays parameters for the light absorption level and the amount of used material has been performed. Both of the introduced SiNW arrays show broadband, strong light absorption coupled with reduction of the amount of the used material. DLA in specific showed significantly enhanced absorption covering the entire solar spectrum of interest, where near-unity absorption spectrum could be achieved. We studied the optical properties of complete PVSC devices that are based on SiNW array. Moreover, the performance of PVSC device that is based on SiNW has been investigated by using numerical modeling. SILVACO software package is used for performing the numerical simulation of the PVSC device performance, which can simultaneously handle the different coupled physical mechanisms contributing to the photovoltaic effect. The effect of the geometry of PVSC device that is based on SiNW is investigated, which shows that the geometry of such PVSC has a role in enhancing its electrical properties. The outcome of this study introduces new SiNW array configurations that have enhanced optical properties using a low amount of material that can be utilized for producing higher efficiency thin film PVCS. The overall conclusion of this work is that a weak absorption indirect band gap material, silicon, in the form of properly designed SiNW and SiNC arrays has the potentials to achieve near-unity ideal absorption spectrum using reduced amount of material, which can lead to produce new generation of lower cost and enhanced efficiency thin film PVSC.

  6. The Ulysses Reference Mission (URM); Proceedings of the EUROAVIA Design Workshop, Friedrichshafen, Federal Republic of Germany, Apr. 8-19, 1991

    NASA Astrophysics Data System (ADS)

    The present design symposium on the Ulysses Reference Mission (URM) provides data on the feasibility of the URM with particular attention given to reference data for Ulysses in the ecliptic plane as it passes the southern and northern pole areas of the sun. Specific issues addressed during the design workshop include the scientific objectives of the URM, the elements of the URM payload, the configuration and structural elements of the spacecraft, thermal control requirements and considerations, a system-engineering analysis, and the scientific subsystems of the URM. Also examined are the solar array and battery package, power control and distribution, technology considerations for the transmission of telemetric data, and a functional analysis of the URM on-board data-handling equipment. The description of the workshop concludes by noting that design studies are required to establish the moment of inertia and center of gravity of the URM spacecraft as well as specific mission parameters.

  7. Self-assembled virus-membrane complexes

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Yang, Lihua; Liang, Hongjun; Angelini, Thomas

    Anionic polyelectrolytes and cationic lipid membranes can self-assemble into lamellar structures ranging from alternating layers of membranes and polyelectrolytes to 'missing layer' superlattice structures. We show that these structural differences can be understood in terms of the surface-charge-density mismatch between the polyelectrolyte and membrane components by examining complexes between cationic membranes and highly charged M13 viruses, a system that allowed us to vary the polyelectrolyte diameter independently of the charge density. Such virus-membrane complexes have pore sizes that are about ten times larger in area than DNA-membrane complexes, and can be used to package and organize large functional molecules; correlatedmore » arrays of Ru(bpy){sub 3}{sup 2+} macroionic dyes have been directly observed within the virus-membrane complexes using an electron-density reconstruction. These observations elucidate fundamental design rules for rational control of self-assembled polyelectrolyte-membrane structures, which have applications ranging from non-viral gene therapy to biomolecular templates for nanofabrication.« less

  8. Documentation of a computer program to simulate transient leakage from confining units using the modular finite-difference, ground-water flow model

    USGS Publications Warehouse

    Leake, S.A.; Leahy, P.P.; Navoy, A.S.

    1994-01-01

    Transient leakage into or out of a compressible fine-grained confining unit results from ground- water storage changes within the unit. The computer program described in this report provides a new method of simulating transient leakage using the U.S. Geological Survey modular finite- difference ground-water flow model (MODFLOW). The new program is referred to as the Transient- Leakage Package. The Transient-Leakage Package solves integrodifferential equations that describe flow across the upper and lower boundaries of confining units. For each confining unit, vertical hydraulic conductivity, thickness, and specific storage are specified in input arrays. These properties can vary from cell to cell and the confining unit need not be present at all locations in the grid; however, the confining units must be bounded above and below by model layers in which head is calculated or specified. The package was used in an example problem to simulate drawdown around a pumping well in a system with two aquifers separated by a confining unit. For drawdown values in excess of 1 centimeter, the solution using the new package closely matched an exact analytical solution. The problem also was simulated without the new package by using a separate model layer to represent the confining unit. That simulation was refined by using two model layers to represent the confining unit. The simulation using the Transient-Leakage Package was faster and more accurate than either of the simulations using model layers to represent the confining unit.

  9. Modular Analytical Multicomponent Analysis in Gas Sensor Aarrays

    PubMed Central

    Chaiyboun, Ali; Traute, Rüdiger; Kiesewetter, Olaf; Ahlers, Simon; Müller, Gerhard; Doll, Theodor

    2006-01-01

    A multi-sensor system is a chemical sensor system which quantitatively and qualitatively records gases with a combination of cross-sensitive gas sensor arrays and pattern recognition software. This paper addresses the issue of data analysis for identification of gases in a gas sensor array. We introduce a software tool for gas sensor array configuration and simulation. It concerns thereby about a modular software package for the acquisition of data of different sensors. A signal evaluation algorithm referred to as matrix method was used specifically for the software tool. This matrix method computes the gas concentrations from the signals of a sensor array. The software tool was used for the simulation of an array of five sensors to determine gas concentration of CH4, NH3, H2, CO and C2H5OH. The results of the present simulated sensor array indicate that the software tool is capable of the following: (a) identify a gas independently of its concentration; (b) estimate the concentration of the gas, even if the system was not previously exposed to this concentration; (c) tell when a gas concentration exceeds a certain value. A gas sensor data base was build for the configuration of the software. With the data base one can create, generate and manage scenarios and source files for the simulation. With the gas sensor data base and the simulation software an on-line Web-based version was developed, with which the user can configure and simulate sensor arrays on-line.

  10. Performance and characterization of new micromachined high-frequency linear arrays.

    PubMed

    Lukacs, Marc; Yin, Jianhua; Pang, Guofeng; Garcia, Richard C; Cherin, Emmanuel; Williams, Ross; Mehi, Jim; Foster, F Stuart

    2006-10-01

    A new approach for fabricating high frequency (> 20 MHz) linear array transducers, based on laser micromachining, has been developed. A 30 MHz, 64-element, 74-microm pitch, linear array design is presented. The performance of the device is demonstrated by comparing electrical and acoustic measurements with analytical, equivalent circuit, and finite-element analysis (FEA) simulations. All FEA results for array performance have been generated using one global set of material parameters. Each fabricated array has been integrated onto a flex circuit for ease of handling, and the flex has been integrated onto a custom printed circuit board test card for ease of testing. For a fully assembled array, with an acoustic lens, the center frequency was 28.7 MHz with a one-way -3 dB and -6 dB bandwidth of 59% and 83%, respectively, and a -20 dB pulse width of -99 ns. The per-element peak acoustic power, for a +/- 30 V single cycle pulse, measured at the 10 mm focal length of the lens was 590 kPa with a -6 dB directivity span of about 30 degrees. The worst-case total cross talk of the combined array and flex assembly is for nearest neighboring elements and was measured to have an average level -40 dB across the -6 dB bandwidth of the device. Any significant deviation from simulation can be explained through limitations in apparatus calibration and in device packaging.

  11. A compact high resolution flat panel PET detector based on the new 4-side buttable MPPC for biomedical applications

    PubMed Central

    Wang, Qiang; Wen, Jie; Ravindranath, Bosky; O’Sullivan, Andrew W.; Catherall, David; Li, Ke; Wei, Shouyi; Komarov, Sergey; Tai, Yuan-Chuan

    2015-01-01

    Compact high-resolution panel detectors using virtual pinhole (VP) PET geometry can be inserted into existing clinical or pre-clinical PET systems to improve regional spatial resolution and sensitivity. Here we describe a compact panel PET detector built using the new Though Silicon Via (TSV) multi-pixel photon counters (MPPC) detector. This insert provides high spatial resolution and good timing performance for multiple bio-medical applications. Because the TSV MPPC design eliminates wire bonding and has a package dimension which is very close to the MPPC’s active area, it is 4-side buttable. The custom designed MPPC array (based on Hamamatsu S12641-PA-50(x)) used in the prototype is composed of 4 × 4 TSV-MPPC cells with a 4.46 mm pitch in both directions. The detector module has 16 × 16 lutetium yttrium oxyorthosilicate (LYSO) crystal array, with each crystal measuring 0.92 × 0.92 × 3 mm3 with 1.0 mm pitch. The outer diameter of the detector block is 16.8 × 16.8 mm2. Thirty-two such blocks will be arranged in a 4 × 8 array with 1 mm gaps to form a panel detector with detection area around 7 cm × 14 cm in the full-size detector. The flood histogram acquired with Ge-68 source showed excellent crystal separation capability with all 256 crystals clearly resolved. The detector module’s mean, standard deviation, minimum (best) and maximum (worst) energy resolution were 10.19%, +/−0.68%, 8.36% and 13.45% FWHM, respectively. The measured coincidence time resolution between the block detector and a fast reference detector (around 200 ps single photon timing resolution) was 0.95 ns. When tested with Siemens Cardinal electronics the performance of the detector blocks remain consistent. These results demonstrate that the TSV-MPPC is a promising photon sensor for use in a flat panel PET insert composed of many high resolution compact detector modules. PMID:26085702

  12. The underground seismic array of Gran Sasso (UNDERSEIS), central Italy

    NASA Astrophysics Data System (ADS)

    Scarpa, R.; Muscente, R.; Tronca, F.; Fischione, C.; Rotella, P.; Abril, M.; Alguacil, G.; Martini, M.; de Cesare, W.

    2003-04-01

    Since early May, 2002, a small aperture seismic array has been installed in the underground Physics Laboratories of Gran Sasso, located near seismic active faults of central Apennines, Italy. This array is presently composed by 21 three-component short period seismic stations (Mark L4C-3D), with average distance 90 m and semi-circular aperture of 400 m x 600 m. It is intersecting a main seismogenic fault where the presence of slow earthquakes has been recently detected through two wide band geodetic laser interferometers. The underground Laboratories are shielded by a limestone rock layer having 1400 m thickness. Each seismometer is linked, through a 24 bits A/D board, to a set of 6 industrial PC via a serial RS-485 standard. The six PC transmit data to a server through an ethernet network. Time syncronization is provided by a Master Oscillator controlled by an atomic clock. Earthworm package is used for data selection and transmission. High quality data have been recorded since May 2002, including local and regional earthquakes. In particular the 31 October, 2002, Molise (Mw=5.8 earthquake) and its aftershocks have been recorded at this array. Array techniques such as polarisation and frequency-slowness analyses with the MUSIC noise algorithm indicate the high performance of this array, as compared to the national seismic network, for identifying the basic source parameters for earthquakes located at distance of few hundreds of km.

  13. A user-friendly workflow for analysis of Illumina gene expression bead array data available at the arrayanalysis.org portal.

    PubMed

    Eijssen, Lars M T; Goelela, Varshna S; Kelder, Thomas; Adriaens, Michiel E; Evelo, Chris T; Radonjic, Marijana

    2015-06-30

    Illumina whole-genome expression bead arrays are a widely used platform for transcriptomics. Most of the tools available for the analysis of the resulting data are not easily applicable by less experienced users. ArrayAnalysis.org provides researchers with an easy-to-use and comprehensive interface to the functionality of R and Bioconductor packages for microarray data analysis. As a modular open source project, it allows developers to contribute modules that provide support for additional types of data or extend workflows. To enable data analysis of Illumina bead arrays for a broad user community, we have developed a module for ArrayAnalysis.org that provides a free and user-friendly web interface for quality control and pre-processing for these arrays. This module can be used together with existing modules for statistical and pathway analysis to provide a full workflow for Illumina gene expression data analysis. The module accepts data exported from Illumina's GenomeStudio, and provides the user with quality control plots and normalized data. The outputs are directly linked to the existing statistics module of ArrayAnalysis.org, but can also be downloaded for further downstream analysis in third-party tools. The Illumina bead arrays analysis module is available at http://www.arrayanalysis.org . A user guide, a tutorial demonstrating the analysis of an example dataset, and R scripts are available. The module can be used as a starting point for statistical evaluation and pathway analysis provided on the website or to generate processed input data for a broad range of applications in life sciences research.

  14. Chimenea and other tools: Automated imaging of multi-epoch radio-synthesis data with CASA

    NASA Astrophysics Data System (ADS)

    Staley, T. D.; Anderson, G. E.

    2015-11-01

    In preparing the way for the Square Kilometre Array and its pathfinders, there is a pressing need to begin probing the transient sky in a fully robotic fashion using the current generation of radio telescopes. Effective exploitation of such surveys requires a largely automated data-reduction process. This paper introduces an end-to-end automated reduction pipeline, AMIsurvey, used for calibrating and imaging data from the Arcminute Microkelvin Imager Large Array. AMIsurvey makes use of several component libraries which have been packaged separately for open-source release. The most scientifically significant of these is chimenea, which implements a telescope-agnostic algorithm for automated imaging of pre-calibrated multi-epoch radio-synthesis data, of the sort typically acquired for transient surveys or follow-up. The algorithm aims to improve upon standard imaging pipelines by utilizing iterative RMS-estimation and automated source-detection to avoid so called 'Clean-bias', and makes use of CASA subroutines for the underlying image-synthesis operations. At a lower level, AMIsurvey relies upon two libraries, drive-ami and drive-casa, built to allow use of mature radio-astronomy software packages from within Python scripts. While targeted at automated imaging, the drive-casa interface can also be used to automate interaction with any of the CASA subroutines from a generic Python process. Additionally, these packages may be of wider technical interest beyond radio-astronomy, since they demonstrate use of the Python library pexpect to emulate terminal interaction with an external process. This approach allows for rapid development of a Python interface to any legacy or externally-maintained pipeline which accepts command-line input, without requiring alterations to the original code.

  15. Gardening and Groundskeeping: A Series of Learning Activity Packages. Volume I: Learning Activity Packages 1-42.

    ERIC Educational Resources Information Center

    South Carolina State Dept. of Education, Columbia. Agricultural Education Section.

    These forty-two learning activity packages, intended for student use, are based on a catalog of performance objectives, criterion-referenced measures, and performance guides for gardening-groundskeeping developed by the Vocational Education Consortium of States (V-TECS). They are organized by four areas of instruction: Organizing and Planning…

  16. Surface roughness and packaging tightness affect calcium lactate crystallization on Cheddar cheese.

    PubMed

    Rajbhandari, P; Kindstedt, P S

    2014-01-01

    Calcium lactate crystals that sometimes form on Cheddar cheese surfaces are a significant expense to manufacturers. Researchers have identified several postmanufacture conditions such as storage temperature and packaging tightness that contribute to crystal formation. Anecdotal reports suggest that physical characteristics at the cheese surface, such as roughness, cracks, and irregularities, may also affect crystallization. The aim of this study was to evaluate the combined effects of surface roughness and packaging tightness on crystal formation in smoked Cheddar cheese. Four 20-mm-thick cross-section slices were cut perpendicular to the long axis of a retail block (~300g) of smoked Cheddar cheese using a wire cutting device. One cut surface of each slice was lightly etched with a cheese grater to create a rough, grooved surface; the opposite cut surface was left undisturbed (smooth). The 4 slices were vacuum packaged at 1, 10, 50, and 90kPa (very tight, moderately tight, loose, very loose, respectively) and stored at 1°C. Digital images were taken at 1, 4, and 8 wk following the first appearance of crystals. The area occupied by crystals and number of discrete crystal regions (DCR) were quantified by image analysis. The experiment was conducted in triplicate. Effects of storage time, packaging tightness, surface roughness, and their interactions were evaluated by repeated-measures ANOVA. Surface roughness, packaging tightness, storage time, and their 2-way interactions significantly affected crystal area and DCR number. Extremely heavy crystallization occurred on both rough and smooth surfaces when slices were packaged loosely or very loosely and on rough surfaces with moderately tight packaging. In contrast, the combination of rough surface plus very tight packaging resulted in dramatic decreases in crystal area and DCR number. The combination of smooth surface plus very tight packaging virtually eliminated crystal formation, presumably by eliminating available sites for nucleation. Cut-and-wrap operations may significantly influence the crystallization behavior of Cheddar cheeses that are saturated with respect to calcium lactate and thus predisposed to form crystals. Copyright © 2014 American Dairy Science Association. Published by Elsevier Inc. All rights reserved.

  17. Novel photon management for thin-film photovoltaics

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Menon, Rajesh

    2016-11-11

    The objective of this project is to enable commercially viable thin-film photovoltaics whose efficiencies are increased by over 10% using a novel optical spectral-separation technique. A thin planar diffractive optic is proposed that efficiently separates the solar spectrum and assigns these bands to optimal thin-film sub-cells. An integrated device that is comprised of the optical element, an array of sub-cells and associated packaging is proposed.

  18. Results of the 1978 NASA/JPL balloon flight solar cell calibration program

    NASA Technical Reports Server (NTRS)

    Seaman, C. H.; Sidwell, L. B.

    1979-01-01

    The 1978 scheduled solar cell calibration balloon flight was successfully completed. Thirty six modules were carried to an altitude of above 36 kilometers. Recovery of telemetry and flight packages was without incident. These calibrated standard cells are used as reference standards in simulator testing of cells and arrays with similar spectral response characteristics. The factors affecting the spectral transmission of the atmosphere at various altitudes are summarized.

  19. Hydrogeologic Unit Flow Characterization Using Transition Probability Geostatistics

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Jones, N L; Walker, J R; Carle, S F

    2003-11-21

    This paper describes a technique for applying the transition probability geostatistics method for stochastic simulation to a MODFLOW model. Transition probability geostatistics has several advantages over traditional indicator kriging methods including a simpler and more intuitive framework for interpreting geologic relationships and the ability to simulate juxtapositional tendencies such as fining upwards sequences. The indicator arrays generated by the transition probability simulation are converted to layer elevation and thickness arrays for use with the new Hydrogeologic Unit Flow (HUF) package in MODFLOW 2000. This makes it possible to preserve complex heterogeneity while using reasonably sized grids. An application of themore » technique involving probabilistic capture zone delineation for the Aberjona Aquifer in Woburn, Ma. is included.« less

  20. Space Shuttle Projects

    NASA Image and Video Library

    2000-11-30

    Nearby waters reflect the flames of the Space Shuttle Endeavor as she lifts off November 30, 2000, carrying the STS-97 crew of five. The STS-97 mission's primary objective was the delivery, assembly, and activation of the U.S. electrical power system onboard the International Space Station (ISS). The electrical power system, which is built into a 73-meter (240-foot) long solar array structure, consists of solar arrays, radiators, batteries, and electronics. The entire 15.4-metric ton (17-ton) package is called the P6 Integrated Truss Segment and is the heaviest and largest element yet delivered to the station aboard a space shuttle. The electrical system will eventually provide the power necessary for the first ISS crews to live and work in the U.S. segment.

  1. Space Shuttle Projects

    NASA Image and Video Library

    2000-11-30

    Nearby waters reflect the flames of the Space Shuttle Endeavor as she lifts off November 30, 2000 carrying the STS-97 crew of five. The STS-97 mission's primary objective was the delivery, assembly, and activation of the U.S. electrical power system onboard the International Space Station (ISS). The electrical power system, which is built into a 73-meter (240-foot) long solar array structure, consists of solar arrays, radiators, batteries, and electronics. The entire 15.4-metric ton (17-ton) package is called the P6 Integrated Truss Segment, and is the heaviest and largest element yet delivered to the station aboard a space shuttle. The electrical system will eventually provide the power necessary for the first ISS crews to live and work in the U.S. segment.

  2. Compactly packaged monolithic four-wavelength VCSEL array with 100-GHz wavelength spacing for future-proof mobile fronthaul transport.

    PubMed

    Lee, Eun-Gu; Mun, Sil-Gu; Lee, Sang Soo; Lee, Jyung Chan; Lee, Jong Hyun

    2015-01-12

    We report a cost-effective transmitter optical sub-assembly using a monolithic four-wavelength vertical-cavity surface-emitting laser (VCSEL) array with 100-GHz wavelength spacing for future-proof mobile fronthaul transport using the data rate of common public radio interface option 6. The wavelength spacing is achieved using selectively etched cavity control layers and fine current adjustment. The differences in operating current and output power for maintaining the wavelength spacing of four VCSELs are <1.4 mA and <1 dB, respectively. Stable operation performance without mode hopping is observed, and error-free transmission under direct modulation is demonstrated over a 20-km single-mode fiber without any dispersion-compensation techniques.

  3. Development of Very Long Baseline Interferometry (VLBI) techniques in New Zealand: Array simulation, image synthesis and analysis

    NASA Astrophysics Data System (ADS)

    Weston, S. D.

    2008-04-01

    This thesis presents the design and development of a process to model Very Long Base Line Interferometry (VLBI) aperture synthesis antenna arrays. In line with the Auckland University of Technology (AUT) Institute for Radiophysics and Space Research (IRSR) aims to develop the knowledge, skills and experience within New Zealand, extensive use of existing radio astronomical software has been incorporated into the process namely AIPS (Astronomical Imaging Processing System), MIRIAD (a radio interferometry data reduction package) and DIFMAP (a program for synthesis imaging of visibility data from interferometer arrays of radio telescopes). This process has been used to model various antenna array configurations for two proposed New Zealand sites for antenna in a VLBI array configuration with existing Australian facilities and a passable antenna at Scott Base in Antarctica; and the results are presented in an attempt to demonstrate the improvement to be gained by joint trans-Tasman VLBI observation. It is hoped these results and process will assist the planning and placement of proposed New Zealand radio telescopes for cooperation with groups such as the Australian Long Baseline Array (LBA), others in the Pacific Rim and possibly globally; also potential future involvement of New Zealand with the SKA. The developed process has also been used to model a phased building schedule for the SKA in Australia and the addition of two antennas in New Zealand. This has been presented to the wider astronomical community via the Royal Astronomical Society of New Zealand Journal, and is summarized in this thesis with some additional material. A new measure of quality ("figure of merit") for comparing the original model image and final CLEAN images by utilizing normalized 2-D cross correlation is evaluated as an alternative to the existing subjective visual operator image comparison undertaken to date by other groups. This new unit of measure is then used ! in the presentation of the results to provide a quantative comparison of the different array configurations modelled. Included in the process is the development of a new antenna array visibility program which was based on a Perl code script written by Prof Steven Tingay to plot antenna visibilities for the Australian Square Kilometre Array (SKA) proposal. This has been expanded and improved removing the hard coded fixed assumptions for the SKA configuration, providing a new useful and flexible program for the wider astronomical community. A prototype user interface using html/cgi/perl was developed for the process so that the underlying software packages can be served over the web to a user via an internet browser. This was used to demonstrate how easy it is to provide a friendlier interface compared to the existing cumbersome and difficult command line driven interfaces (although the command line can be retained for more experienced users).

  4. MK3TOOLS & NetCDF - storing VLBI data in a machine independent array oriented data format

    NASA Astrophysics Data System (ADS)

    Hobiger, T.; Koyama, Y.; Kondo, T.

    2007-07-01

    In the beginning of 2002 the International VLBI Service (IVS) has agreed to introduce a Platform-independent VLBI exchange format (PIVEX) which permits the exchange of observational data and stimulates the research across different analysis groups. Unfortunately PIVEX has never been implemented and many analysis software packages are still depending on prior processing (e.g. ambiguity resolution and computation of ionosphere corrections) done by CALC/SOLVE. Thus MK3TOOLS which handles MK3 databases without CALC/SOLVE being installed has been developed. It uses the NetCDF format to store the data and since interfaces exist for a variety of programming languages (FORTRAN, C/C++, JAVA, Perl, Python) it can be easily incorporated in existing and upcoming analysis software packages.

  5. A flexible ultrasound transducer array with micro-machined bulk PZT.

    PubMed

    Wang, Zhe; Xue, Qing-Tang; Chen, Yuan-Quan; Shu, Yi; Tian, He; Yang, Yi; Xie, Dan; Luo, Jian-Wen; Ren, Tian-Ling

    2015-01-23

    This paper proposes a novel flexible piezoelectric micro-machined ultrasound transducer, which is based on PZT and a polyimide substrate. The transducer is made on the polyimide substrate and packaged with medical polydimethylsiloxane. Instead of etching the PZT ceramic, this paper proposes a method of putting diced PZT blocks into holes on the polyimide which are pre-etched. The device works in d31 mode and the electromechanical coupling factor is 22.25%. Its flexibility, good conformal contacting with skin surfaces and proper resonant frequency make the device suitable for heart imaging. The flexible packaging ultrasound transducer also has a good waterproof performance after hundreds of ultrasonic electric tests in water. It is a promising ultrasound transducer and will be an effective supplementary ultrasound imaging method in the practical applications.

  6. Preventing type 2 diabetes: Changing the food industry

    PubMed Central

    Popkin, Barry M.; Kenan, W. R.

    2016-01-01

    Improving our global diet by working with the food industry is a fairly complex task. Previously the global food manufacturing companies and governments were the major players. However, matters have shifted rapidly so that food retailers, food manufacturers, the restaurant–food service sector, and agribusinesses are now the major players. The current modern system of packaged processed food has now penetrated the globe—rich and poor, rural and urban are all in reach of this food system. Consequently, working with this complex sector when possible and an array of governmental regulatory large-scale options to improve our diet have increased in importance. Taxation of unhealthy foods and beverages, marketing controls, and front of the package labeling are the primary current options. Evaluations of the impacts of both public and industry initiatives are needed. PMID:27432072

  7. Advanced Sensor Arrays and Packaging

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Ryter, John Wesley; Romero, Christopher J.; Ramaiyan, Kannan

    2016-08-11

    Novel sensor packaging elements were designed, fabricated, and tested in order to facilitate the transition of electrochemical mixed-potential sensors toward commercialization. Of the two designs completed, the first is currently undergoing field trials, taking direct measurements within vehicle exhaust streams, while the second is undergoing preliminary laboratory testing. The sensors’ optimal operating conditions, sensitivity to hydrogen, and long-­term baseline stability were also investigated. The sensing capabilities of lanthanum chromite (La 0.8Sr 0.2CrO 3) and indium-­doped tin oxide (ITO) working electrodes were compared, and the ITO devices were selected for pre-­commercial field trials testing at a hydrogen fuel cell vehicle fuelingmore » station in California. Previous data from that fueling station were also analyzed, and the causes of anomalous baseline drift were identified.« less

  8. See Also:physica status solidi (a)physica status solidi (c)Copyright © 2004 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim

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  1. 49 CFR 175.630 - Special requirements for Division 6.1 (poisonous) material and Division 6.2 (infectious...

    Code of Federal Regulations, 2013 CFR

    2013-10-01

    ... (infectious substances) materials. (a) A package required to bear a POISON, POISON INHALATION HAZARD, or... person may operate an aircraft that has been used to transport any package required to bear a POISON or POISON INHALATION HAZARD label unless, upon removal of such package, the area in the aircraft in which it...

  2. Preferences for benefit packages for community-based health insurance: an exploratory study in Nigeria

    PubMed Central

    2010-01-01

    Background It is important that community-based health insurance (CBHI) schemes are designed in such a way as to ensure the relevance of the benefit packages to potential clients. Hence, this paper provides an understanding of the preferred benefit packages by different economic status groups as well as urban and rural dwellers for CBHI in Southeast Nigeria. Methods The study took place in rural, urban and semi-urban communities of south-east Nigeria. A questionnaire was used to collect information from 3070 randomly picked household heads. Focus group discussions were used to collect qualitative data. Data was examined for links between preferences for benefit packages with SES and geographic residence of the respondents. Results Respondents in the rural areas and in the lower SES preferred a comprehensive benefit package which includes all inpatient, outpatient and emergencies services, while those in urban areas as well as those in the higher SES group showed a preference for benefit packages which will cover only basic disease control interventions. Conclusion Equity concerns in preferences for services to be offered by the CBHI scheme should be addressed for CBHI to succeed in different contexts. PMID:20540787

  3. ARNICA: the Arcetri Observatory NICMOS3 imaging camera

    NASA Astrophysics Data System (ADS)

    Lisi, Franco; Baffa, Carlo; Hunt, Leslie K.

    1993-10-01

    ARNICA (ARcetri Near Infrared CAmera) is the imaging camera for the near infrared bands between 1.0 and 2.5 micrometers that Arcetri Observatory has designed and built as a general facility for the TIRGO telescope (1.5 m diameter, f/20) located at Gornergrat (Switzerland). The scale is 1' per pixel, with sky coverage of more than 4' X 4' on the NICMOS 3 (256 X 256 pixels, 40 micrometers side) detector array. The optical path is compact enough to be enclosed in a 25.4 cm diameter dewar; the working temperature is 76 K. The camera is remotely controlled by a 486 PC, connected to the array control electronics via a fiber-optics link. A C-language package, running under MS-DOS on the 486 PC, acquires and stores the frames, and controls the timing of the array. We give an estimate of performance, in terms of sensitivity with an assigned observing time, along with some details on the main parameters of the NICMOS 3 detector.

  4. ARNICA, the NICMOS 3 imaging camera of TIRGO.

    NASA Astrophysics Data System (ADS)

    Lisi, F.; Baffa, C.; Hunt, L.; Stanga, R.

    ARNICA (ARcetri Near Infrared CAmera) is the imaging camera for the near infrared bands between 1.0 and 2.5 μm that Arcetri Observatory has designed and built as a general facility for the TIRGO telescope (1.5 m diameter, f/20) located at Gornergrat (Switzerland). The scale is 1″per pixel, with sky coverage of more than 4 min×4 min on the NICMOS 3 (256×256 pixels, 40 μm side) detector array. The camera is remotely controlled by a PC 486, connected to the array control electronics via a fiber-optics link. A C-language package, running under MS-DOS on the PC 486, acquires and stores the frames, and controls the timing of the array. The camera is intended for imaging of large extra-galactic and Galactic fields; a large effort has been dedicated to explore the possibility of achieving precise photometric measurements in the J, H, K astronomical bands, with very promising results.

  5. Optical and Thermal Analyses of High-Power Laser Diode Arrays

    NASA Technical Reports Server (NTRS)

    Vasilyev, Aleksey; Allan, Graham R.; Schafer, John; Stephen, Mark A.; Young, Stefano

    2004-01-01

    An important need, especially for space-borne applications, is the early identification and rejection of laser diode arrays which may fail prematurely. The search for reliable failure predictors is ongoing and has led to the development of two techniques, infrared imagery and monitoring the Temporally-resolved and Spectrally-Resolved (TSR) optical output from which temperature of the device can be measured. This is in addition to power monitoring on long term burn stations. A direct measurement of the temperature of the active region is an important parameter as the lifetime of Laser Diode Arrays (LDA) decreases exponentially with increasing temperature. We measure the temperature from time-resolving the spectral emission in an analogous method to Voss et al. In this paper we briefly discuss the measurement setup and present temperature data derived from thermal images and TSR data for two differently designed high-power 808 nanometer LDA packages of similar specification operated in an electrical and thermal environment that mimic the expected operational conditions.

  6. International Space Station (ISS)

    NASA Image and Video Library

    2000-12-05

    Astronaut Joseph R. Tanner, STS-97 mission specialist, is seen during a session of Extravehicular Activity (EVA), performing work on the International Space Station (ISS). Part of the Remote Manipulator System (RMS) arm and a section of the newly deployed solar array panel are in the background. The primary objective of the STS-97 mission was the delivery, assembly, and activation of the U.S. electrical power system on board the ISS. The electrical power system, which is built into a 73-meter (240-foot) long solar array structure consists of solar arrays, radiators, batteries, and electronics. The entire 15.4-metric ton (17-ton) package is called the P6 Integrated Truss Segment and is the heaviest and largest element yet delivered to the station aboard a space shuttle. The electrical system will eventually provide the power necessary for the first ISS crews to live and work in the U.S. segment. The STS-97 crew of five launched aboard the Space Shuttle Orbiter Endeavor on November 30, 2000 for an 11 day mission.

  7. Flight Plasma Diagnostics for High-Power, Solar-Electric Deep-Space Spacecraft

    NASA Technical Reports Server (NTRS)

    Johnson, Lee; De Soria-Santacruz Pich, Maria; Conroy, David; Lobbia, Robert; Huang, Wensheng; Choi, Maria; Sekerak, Michael J.

    2018-01-01

    NASA's Asteroid Redirect Robotic Mission (ARRM) project plans included a set of plasma and space environment instruments, the Plasma Diagnostic Package (PDP), to fulfill ARRM requirements for technology extensibility to future missions. The PDP objectives were divided into the classes of 1) Plasma thruster dynamics, 2) Solar array-specific environmental effects, 3) Plasma environmental spacecraft effects, and 4) Energetic particle spacecraft environment. A reference design approach and interface requirements for ARRM's PDP was generated by the PDP team at JPL and GRC. The reference design consisted of redundant single-string avionics located on the ARRM spacecraft bus as well as solar array, driving and processing signals from multiple copies of several types of plasma, effects, and environments sensors distributed over the spacecraft and array. The reference design sensor types were derived in part from sensors previously developed for USAF Research Laboratory (AFRL) plasma effects campaigns such as those aboard TacSat-2 in 2007 and AEHF-2 in 2012.

  8. An implantable integrated low-power amplifier-microelectrode array for Brain-Machine Interfaces.

    PubMed

    Patrick, Erin; Sankar, Viswanath; Rowe, William; Sanchez, Justin C; Nishida, Toshikazu

    2010-01-01

    One of the important challenges in designing Brain-Machine Interfaces (BMI) is to build implantable systems that have the ability to reliably process the activity of large ensembles of cortical neurons. In this paper, we report the design, fabrication, and testing of a polyimide-based microelectrode array integrated with a low-power amplifier as part of the Florida Wireless Integrated Recording Electrode (FWIRE) project at the University of Florida developing a fully implantable neural recording system for BMI applications. The electrode array was fabricated using planar micromachining MEMS processes and hybrid packaged with the amplifier die using a flip-chip bonding technique. The system was tested both on bench and in-vivo. Acute and chronic neural recordings were obtained from a rodent for a period of 42 days. The electrode-amplifier performance was analyzed over the chronic recording period with the observation of a noise floor of 4.5 microVrms, and an average signal-to-noise ratio of 3.8.

  9. Demonstration of Compact and Low-Loss Athermal Arrayed-Waveguide Grating Module Based on 2.5%-Δ Silica-Based Waveguides

    NASA Astrophysics Data System (ADS)

    Maru, Koichi; Abe, Yukio; Uetsuka, Hisato

    2008-10-01

    We demonstrated a compact and low-loss athermal arrayed-waveguide grating (AWG) module utilizing silica-based planar lightwave circuit (PLC) technology. Spot-size converters based on a vertical ridge-waveguide taper were integrated with a 2.5%-Δ athermal AWG to reduce the loss at chip-to-fiber interface. Spot-size converters based on a segmented core were formed around resin-filled trenches for athermalization formed in the slab to reduce the diffraction loss at the trenches. A 16-channel athermal AWG module with 100-GHz channel spacing was fabricated. The use of a 2.5%-Δ athermal chip with a single-side fiber array enabled a compact package of the size of 41.6×16.6×4.5 mm3. Athermal characteristics and a small insertion loss of 3.5-3.8 dB were obtained by virtue of low fiber-to-chip coupling loss and athermalization with low excess loss.

  10. Fabrication of Fresnel micro lens array in borosilicate glass by F2-laser ablation for glass interposer application

    NASA Astrophysics Data System (ADS)

    Brusberg, Lars; Neitz, Marcel; Schröder, Henning; Fricke-Begemann, Thomas; Ihlemann, Jürgen

    2014-03-01

    The future need for more bandwidth forces the development of optical transmission solutions for rack-to-rack, boardto- board and chip-to-chip interconnects. The goals are significant reduction of power consumption, highest density and potential for bandwidth scalability to overcome the limitations of the systems today with mostly copper based interconnects. For system integration the enabling of thin glass as a substrate material for electro-optical components with integrated micro-optics for efficient light coupling to integrated optical waveguides or fibers is becoming important. Our glass based packaging approach merges micro-system packaging and glass integrated optics. This kind of packaging consists of a thin glass substrate with integrated micro lenses providing a platform for photonic component assembly and optical fiber or waveguide interconnection. Thin glass is commercially available in panel and wafer size and characterizes excellent optical and high frequency properties. That makes it perfect for microsystem packaging. A suitable micro lens approach has to be comparable with different commercial glasses and withstand post-processing like soldering. A benefit of using laser ablated Fresnel lenses is the planar integration capability in the substrate for highest integration density. In the paper we introduce our glass based packaging concept and the Fresnel lens design for different scenarios like chip-to-fiber, chip-to-optical-printed-circuit-board coupling. Based on the design the Fresnel lenses were fabricated by using a 157 nm fluorine laser ablation system.

  11. VLED for Si wafer-level packaging

    NASA Astrophysics Data System (ADS)

    Chu, Chen-Fu; Chen, Chiming; Yen, Jui-Kang; Chen, Yung-Wei; Tsou, Chingfu; Chang, Chunming; Doan, Trung; Tran, Chuong Anh

    2012-03-01

    In this paper, we introduced the advantages of Vertical Light emitting diode (VLED) on copper alloy with Si-wafer level packaging technologies. The silicon-based packaging substrate starts with a <100> dou-ble-side polished p-type silicon wafer, then anisotropic wet etching technology is done to construct the re-flector depression and micro through-holes on the silicon substrate. The operating voltage, at a typical cur-rent of 350 milli-ampere (mA), is 3.2V. The operation voltage is less than 3.7V under higher current driving conditions of 1A. The VLED chip on Si package has excellent heat dissipation and can be operated at high currents up to 1A without efficiency degradation. The typical spatial radiation pattern emits a uniform light lambertian distribution from -65° to 65° which can be easily fit for secondary optics. The correlated color temperature (CCT) has only 5% variation for daylight and less than 2% variation for warm white, when the junction temperature is increased from 25°C to 110°C, suggesting a stable CCT during operation for general lighting application. Coupled with aspheric lens and micro lens array in a wafer level process, it has almost the same light distribution intensity for special secondary optics lighting applications. In addition, the ul-tra-violet (UV) VLED, featuring a silicon substrate and hard glass cover, manufactured by wafer level pack-aging emits high power UV wavelengths appropriate for curing, currency, document verification, tanning, medical, and sterilization applications.

  12. Compact multispectral photodiode arrays using micropatterned dichroic filters

    NASA Astrophysics Data System (ADS)

    Chandler, Eric V.; Fish, David E.

    2014-05-01

    The next generation of multispectral instruments requires significant improvements in both spectral band customization and portability to support the widespread deployment of application-specific optical sensors. The benefits of spectroscopy are well established for numerous applications including biomedical instrumentation, industrial sorting and sensing, chemical detection, and environmental monitoring. In this paper, spectroscopic (and by extension hyperspectral) and multispectral measurements are considered. The technology, tradeoffs, and application fits of each are evaluated. In the majority of applications, monitoring 4-8 targeted spectral bands of optimized wavelength and bandwidth provides the necessary spectral contrast and correlation. An innovative approach integrates precision spectral filters at the photodetector level to enable smaller sensors, simplify optical designs, and reduce device integration costs. This method supports user-defined spectral bands to create application-specific sensors in a small footprint with scalable cost efficiencies. A range of design configurations, filter options and combinations are presented together with typical applications ranging from basic multi-band detection to stringent multi-channel fluorescence measurement. An example implementation packages 8 narrowband silicon photodiodes into a 9x9mm ceramic LCC (leadless chip carrier) footprint. This package is designed for multispectral applications ranging from portable color monitors to purpose- built OEM industrial and scientific instruments. Use of an eight-channel multispectral photodiode array typically eliminates 10-20 components from a device bill-of-materials (BOM), streamlining the optical path and shrinking the footprint by 50% or more. A stepwise design approach for multispectral sensors is discussed - including spectral band definition, optical design tradeoffs and constraints, and device integration from prototype through scalable volume production. Additional customization options are explored for application-specific OEM sensors integrated into portable devices using multispectral photodiode arrays.

  13. AlGaInN laser diode technology for defence, security and sensing applications

    NASA Astrophysics Data System (ADS)

    Najda, Stephen P.; Perlin, Piotr; Suski, Tadek; Marona, Lucja; Boćkowski, Mike; Leszczyński, Mike; Wisniewski, Przemek; Czernecki, Robert; Kucharski, Robert; Targowski, Grzegorz; Watson, Scott; Kelly, Antony E.

    2014-10-01

    The latest developments in AlGaInN laser diode technology are reviewed for defence, security and sensing applications. The AlGaInN material system allows for laser diodes to be fabricated over a very wide range of wavelengths from u.v., i.e, 380nm, to the visible, i.e., 530nm, by tuning the indium content of the laser GaInN quantum well. Advantages of using Plasma assisted MBE (PAMBE) compared to more conventional MOCVD epitaxy to grow AlGaInN laser structures are highlighted. Ridge waveguide laser diode structures are fabricated to achieve single mode operation with optical powers of <100mW in the 400-420nm wavelength range that are suitable for telecom applications. Visible light communications at high frequency (up to 2.5 Gbit/s) using a directly modulated 422nm Gallium-nitride (GaN) blue laser diode is reported. High power operation of AlGaInN laser diodes is demonstrated with a single chip, AlGaInN laser diode `mini-array' with a common p-contact configuration at powers up to 2.5W cw at 410nm. Low defectivity and highly uniform GaN substrates allow arrays and bars of nitride lasers to be fabricated. GaN laser bars of up to 5mm with 20 emitters, mounted in a CS mount package, give optical powers up to 4W cw at ~410nm with a common contact configuration. An alternative package configuration for AlGaInN laser arrays allows for each individual laser to be individually addressable allowing complex free-space and/or fibre optic system integration within a very small form-factor.or.

  14. Cold plasma decontamination using flexible jet arrays

    NASA Astrophysics Data System (ADS)

    Konesky, Gregory

    2010-04-01

    Arrays of atmospheric discharge cold plasma jets have been used to decontaminate surfaces of a wide range of microorganisms quickly, yet not damage that surface. Its effectiveness in decomposing simulated chemical warfare agents has also been demonstrated, and may also find use in assisting in the cleanup of radiological weapons. Large area jet arrays, with short dwell times, are necessary for practical applications. Realistic situations will also require jet arrays that are flexible to adapt to contoured or irregular surfaces. Various large area jet array prototypes, both planar and flexible, are described, as is the application to atmospheric decontamination.

  15. CRP for Pesticides - Child Resistant Packaging Consultants

    EPA Pesticide Factsheets

    This list includes consultants who have indicated an expertise in the area of child-resistant packaging. This list is not intended to indicate EPA approval, certification, or endorsement of these consultants, nor is it necessarily comprehensive.

  16. PINT, A Modern Software Package for Pulsar Timing

    NASA Astrophysics Data System (ADS)

    Luo, Jing; Ransom, Scott M.; Demorest, Paul; Ray, Paul S.; Stovall, Kevin; Jenet, Fredrick; Ellis, Justin; van Haasteren, Rutger; Bachetti, Matteo; NANOGrav PINT developer team

    2018-01-01

    Pulsar timing, first developed decades ago, has provided an extremely wide range of knowledge about our universe. It has been responsible for many important discoveries, such as the discovery of the first exoplanet and the orbital period decay of double neutron star systems. Currently pulsar timing is the leading technique for detecting low frequency (about 10^-9 Hertz) gravitational waves (GW) using an array of pulsars as the detectors. To achieve this goal, high precision pulsar timing data, at about nanoseconds level, is required. Most high precision pulsar timing data are analyzed using the widely adopted software TEMPO/TEMPO2. But for a robust and believable GW detection, it is important to have independent software that can cross-check the result. In this poster we present the new generation pulsar timing software PINT. This package will provide a robust system to cross check high-precision timing results, completely independent of TEMPO and TEMPO2. In addition, PINT is designed to be a package that is easy to extend and modify, through use of flexible code architecture and a modern programming language, Python, with modern technology and libraries.

  17. Thermal Characterization for a Modular 3-D Multichip Module

    NASA Technical Reports Server (NTRS)

    Fan, Mark S.; Plante, Jeannette; Shaw, Harry

    2000-01-01

    NASA Goddard Space Flight Center has designed a high-density modular 3-D multichip module (MCM) for future spaceflight use. This MCM features a complete modular structure, i.e., each stack can be removed from the package without damaging the structure. The interconnection to the PCB is through the Column Grid Array (CGA) technology. Because of its high-density nature, large power dissipation from multiple layers of circuitry is anticipated and CVD diamond films are used in the assembly for heat conduction enhancement. Since each stacked layer dissipates certain amount of heat, designing effective heat conduction paths through each stack and balancing the heat dissipation within each stack for optimal thermal performance become a challenging task. To effectively remove the dissipated heat from the package, extensive thermal analysis has been performed with finite element methods. Through these analyses, we are able to improve the thermal design and increase the total wattage of the package for maximum electrical performance. This paper provides details on the design-oriented thermal analysis and performance enhancement. It also addresses issues relating to contact thermal resistance between the diamond film and the metallic heat conduction paths.

  18. CarbAl Heat Transfer Material

    NASA Technical Reports Server (NTRS)

    Fink, Richard

    2015-01-01

    The increasing use of power electronics, such as high-current semiconductor devices and modules, within space vehicles is driving the need to develop specialty thermal management materials in both the packaging of these discrete devices and the packaging of modules consisting of these device arrays. Developed by Applied Nanotech, Inc. (ANI), CarbAl heat transfer material is uniquely characterized by its low density, high thermal diffusivity, and high thermal conductivity. Its coefficient of thermal expansion (CTE) is similar to most power electronic materials, making it an effective base plate substrate for state-of-the-art silicon carbide (SiC) super junction transistors. The material currently is being used to optimize hybrid vehicle inverter packaging. Adapting CarbAl-based substrates to space applications was a major focus of the SBIR project work. In Phase I, ANI completed modeling and experimentation to validate its deployment in a space environment. Key parameters related to cryogenic temperature scaling of CTE, thermal conductivity, and mechanical strength. In Phase II, the company concentrated on improving heat sinks and thermally conductive circuit boards for power electronic applications.

  19. Analytical determination of flavonoids aimed to analysis of natural samples and active packaging applications.

    PubMed

    Castro-López, María del Mar; López-Vilariño, José Manuel; González-Rodríguez, María Victoria

    2014-05-01

    Several HPLC and UHPLC developed methods were compared to analyse the natural antioxidants catechins and quercetin used in active packaging and functional foods. Photodiode array detector coupled with a fluorescence detector and compared with LTQ-Orbitrap-MS was used. UHPLC was investigated as quick alternative without compromising the separation, analysis time shortened up to 6-fold. The feasibility of the four developed methods was compared. Linearity up to 0.9995, low detection limits (between 0.02 and 0.7 for HPLC-PDA, 2 to 7-fold lower for HPLC- LTQ-Orbitrap-MS and from 0.2 to 2mgL(-)(1) for UHPLC-PDA) and good precision parameters (RSD lower than 0.06%) were obtained. All methods were successfully applied to natural samples. LTQ-Orbitrap-MS allowed to identify other analytes of interest too. Good feasibility of the methods was also concluded from the analysis of catechin and quercetin release from new active packaging materials based on polypropylene added with catechins and green tea. Copyright © 2013 Elsevier Ltd. All rights reserved.

  20. See Also:Mechanics of Cohesive-frictional MaterialsCopyright © 2004 John Wiley & Sons, Ltd.Get Sample Copy

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  1. Design package for concentrating solar collector panels

    NASA Technical Reports Server (NTRS)

    1978-01-01

    Information used to evaluate the design of the Northrup concentrating collector is presented. Included are the system performance specifications, the applications manual, and the detailed design drawings of the collector. The collector is a water/glycol/working fluid type, with a dipped galvanized steel housing, transparent acrylic Fresnel lens cover, copper absorber tube, and fiber glass insulation. It weights 98 pounds. A collector assembly includes four collector units within a tracking mount array.

  2. Natural Convection Cooling of a Three by Three Array of Leadless Chip Carrier Packages in a Dielectric Liquid

    DTIC Science & Technology

    1994-03-24

    sources. gathering and maintaining the data needed, and completing and reviewing the collection of information. Send comments regarding ths burden estimate...for .oration Operations and Reports. 1215 Jefferson Davis Highway. Suite 1204. Arlington. VA 22202-4302. and to the Office of Management and Budget...ceramic substrate was examined. Baseline data were obtained for cooling with pure dielectric liquids. The effects of addition of high thermal

  3. Concept, Design, and Prototyping of XSAS: A High Power Extendable Solar Array for CubeSat Applications

    NASA Technical Reports Server (NTRS)

    Senatore, Patrick; Klesh, Andrew; Zurbuchen, Thomas H.; McKague, Darren; Cutler, James

    2010-01-01

    CubeSats have proven themselves as a reliable and cost-effective method to perform experiments in space, but they are highly constrained by their specifications and size. One such constraint is the average continuous power, about 5 W, which is available to the typical CubeSat. To improve this constraint, we have developed the eXtendable Solar Array System (XSAS), a deployable solar array prototype in a CubeSat package, which can provide an average 23 W of continuous power. The prototype served as a technology demonstrator for the high risk mechanisms needed to release, deploy, and control the solar array. Aside from this drastic power increase, it is in the integration of each mechanism, their application within the small CubeSat form-factor, and the inherent passive control benefit of the deployed geometry that make XSAS a novel design. In this paper, we discuss the requirements and design process for the XSAS system and mechanical prototype, and provide qualitative and quantitative results from numerical simulations and prototype tests. We also discuss future work, including an upcoming NASA zero-gravity flight campaign, to further improve on XSAS and prepare it for future launch opportunities.

  4. Dynamically Alterable Arrays of Polymorphic Data Types

    NASA Technical Reports Server (NTRS)

    James, Mark

    2006-01-01

    An application library package was developed that represents data packets for Deep Space Network (DSN) message packets as dynamically alterable arrays composed of arbitrary polymorphic data types. The software was to address a limitation of the present state of the practice for having an array directly composed of a single monomorphic data type. This is a severe limitation when one is dealing with science data in that the types of objects one is dealing with are typically not known in advance and, therefore, are dynamic in nature. The unique feature of this approach is that it enables one to define at run-time the dynamic shape of the matrix with the ability to store polymorphic data types in each of its indices. Existing languages such as C and C++ have the restriction that the shape of the array must be known in advance and each of its elements be a monomorphic data type that is strictly defined at compile-time. This program can be executed on a variety of platforms. It can be distributed in either source code or binary code form. It must be run in conjunction with any one of a number of Lisp compilers that are available commercially or as shareware.

  5. Plenoptic camera image simulation for reconstruction algorithm verification

    NASA Astrophysics Data System (ADS)

    Schwiegerling, Jim

    2014-09-01

    Plenoptic cameras have emerged in recent years as a technology for capturing light field data in a single snapshot. A conventional digital camera can be modified with the addition of a lenslet array to create a plenoptic camera. Two distinct camera forms have been proposed in the literature. The first has the camera image focused onto the lenslet array. The lenslet array is placed over the camera sensor such that each lenslet forms an image of the exit pupil onto the sensor. The second plenoptic form has the lenslet array relaying the image formed by the camera lens to the sensor. We have developed a raytracing package that can simulate images formed by a generalized version of the plenoptic camera. Several rays from each sensor pixel are traced backwards through the system to define a cone of rays emanating from the entrance pupil of the camera lens. Objects that lie within this cone are integrated to lead to a color and exposure level for that pixel. To speed processing three-dimensional objects are approximated as a series of planes at different depths. Repeating this process for each pixel in the sensor leads to a simulated plenoptic image on which different reconstruction algorithms can be tested.

  6. Conceptual design study of concentrator enhanced solar arrays for space applications. Performance evaluation of 5 KW and 20 KW systems in Si and GaAs at 1 AU employing a flat plate trough concentrator

    NASA Technical Reports Server (NTRS)

    1980-01-01

    A simple, efficient and very lightweight preliminary design for a 5 KW and 20 KW BOL output concentrated array evolved and is described by drawings. The relative effectiveness of this design, as compared to an unconcentrated planar array of equal power output, was measured by comparing power to mass performance of and the solar cell area required by each. Improvements in power to mass performance as high as 42% together with array area size reduction of 57% are possible in GaAs systems. By contrast, when the same concentrator design is applied to silicon systems, no improvement in power to mass can be obtained although array area reductions as high as 35% are obtainable.

  7. Measurement of Emissions from Prescribed Burning of Forests and Grasslands

    EPA Science Inventory

    Aerial sampling methods for open area sources, such as prescribed fires, are described. Evolution from the tethered aerostat and instrument package to the smaller lighter package flown on an unmanned aerial system is described.

  8. Hazardous Materials Packaging and Transportation Safety

    DOT National Transportation Integrated Search

    1995-09-27

    To establish safety requirements for the proper packaging and : transportation of Department of Energy (DOE) offsite shipments and onsite transfers of hazardous materials and for modal transport. (Offsite is any area within or outside a DOE site to w...

  9. Probablistic Analyses of Waste Package Quantities Impacted by Potential Igneous Disruption at Yucca Mountain

    NASA Astrophysics Data System (ADS)

    Wallace, M. G.; Iuzzolina, H.

    2005-12-01

    A probabilistic analysis was conducted to estimate ranges for the numbers of waste packages that could be damaged in a potential future igneous event through a repository at Yucca Mountain. The analysis includes disruption from an intrusive igneous event and from an extrusive volcanic event. This analysis supports the evaluation of the potential consequences of future igneous activity as part of the total system performance assessment for the license application for the Yucca Mountain Project (YMP). The first scenario, igneous intrusion, investigated the case where one or more igneous dikes intersect the repository. A swarm of dikes was characterized by distributions of length, width, azimuth, and number of dikes and the spacings between them. Through the use in part of a latin hypercube simulator and a modified video game engine, mathematical relationships were built between those parameters and the number of waste packages hit. Corresponding cumulative distribution function curves (CDFs) for the number of waste packages hit under several different scenarios were calculated. Variations in dike thickness ranges, as well as in repository magma bulkhead positions were examined through sensitivity studies. It was assumed that all waste packages in an emplacement drift would be impacted if that drift was intersected by a dike. Over 10,000 individual simulations were performed. Based on these calculations, out of a total of over 11,000 planned waste packages distributed over an area of approximately 5.5 km2 , the median number of waste packages impacted was roughly 1/10 of the total. Individual cases ranged from 0 waste packages to the entire inventory being impacted. The igneous intrusion analysis involved an explicit characterization of dike-drift intersections, built upon various distributions that reflect the uncertainties associated with the inputs. The second igneous scenario, volcanic eruption (eruptive conduits), considered the effects of conduits formed in association with a volcanic eruption through the repository. Mathematical relations were built between the resulting conduit areas and the fraction of the repository area occupied by waste packages. This relation was used in conjunction with a joint distribution incorporating variability in eruptive conduit diameters and in the number of eruptive conduits that could intersect the repository.

  10. See Also:physica status solidi (a)physica status solidi (c)Copyright © 2004 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim

  11. Get Sample Copy
  12. Recommend to Your Librarian
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  1. 78 FR 77656 - Aerosols and Similar Pressurized Containers-Meeting To Discuss the Method of Sale for Packages...

    Federal Register 2010, 2011, 2012, 2013, 2014

    2013-12-24

    ..., Packaging and Labeling Regulation (UPLR) in NIST Handbook 130, ``Uniform Laws and Regulations in the Areas... permit price and quantity comparison is forbidden.'' Products using BOV technology versus traditional...

  2. Effect of weight and frontal area of external telemetry packages on the kinematics, activity levels and swimming performance of small-bodied sharks.

    PubMed

    Bouyoucos, I A; Suski, C D; Mandelman, J W; Brooks, E J

    2017-05-01

    This study sought to observe the effects of submerged weight and frontal cross-sectional area of external telemetry packages on the kinematics, activity levels and swimming performance of small-bodied juvenile sharks, using lemon sharks Negaprion brevirostris (60-80 cm total length, L T ) as a model species. Juveniles were observed free-swimming in a mesocosm untagged and with small and large external accelerometer packages that increased frontal cross-sectional area of the animals and their submerged weight. Despite adhering to widely used standards for tag mass, the presence of an external telemetry package altered swimming kinematics, activity levels and swimming performance of juvenile N. brevirostris relative to untagged individuals, suggesting that tag mass is not a suitable standalone metric of device suitability. Changes in swimming performance could not be detected from tail-beat frequency, which suggests that tail-beat frequency is an unsuitable standalone metric of swimming performance for small N. brevirostris. Lastly, sharks experienced treatment-specific changes in activity level and swimming kinematics from morning to afternoon observation. Therefore, the presence of external telemetry packages altered the kinematics, activity levels and swimming performance of small young-of-the-year N. brevirostris and these data may therefore be relevant to other similar-sized juveniles of other shark species. © 2017 The Fisheries Society of the British Isles.

  3. See Also:physica status solidi (a)physica status solidi (c)Copyright © 2004 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim

  4. Get Sample Copy
  5. Recommend to Your Librarian
  6. E-MailPrint
  1. Degradation of carotenoids in dehydrated pumpkins as affected by different storage conditions.

    PubMed

    Song, Jiangfeng; Wei, Qiuyu; Wang, Xiaoping; Li, Dajing; Liu, Chunquan; Zhang, Min; Meng, Lili

    2018-05-01

    The degradation kinetics of carotenoids in dehydrated pumpkins, stored at 4, 25, and 40 °C under air or controlled atmosphere conditions (N 2 ), was evaluated using reversed-phase high performance liquid chromatography coupled with diode array and mass spectrometry detectors. The degradations of predominant carotenoids including β-carotene, α-carotene and lutein depended on the storage temperature, the storage duration as well as the presence of oxygen, which was following the first-order kinetics. The temperature dependence of reaction constants were well explained by the Arrhenius relationship. The activation energy (Ea) for carotenoids degradation ranged from 23.69 kJ/mol for lutein in N 2 -packaged dehydrated pumpkins to 13.82 kJ/mol for β-carotene in air-packaged samples. Lutein was less degradable than α-carotene and β-carotene in dehydrated pumpkins during storage. Higher all-E-carotenoid degradation in N 2 -packaged dehydrated pumpkins stored at 40 °C occurred than that stored at lower temperature under N 2 or air storage, and those storage conditions were beneficial to the formation of Z-isomers (e.g., 15-Z-β-carotene and 13-Z-β-carotene). Storage under N 2 at 4 °C enhanced the retention of all-E-carotenoids in dehydrated pumpkins. Thus, package atmosphere should be paid more attention during long-term storage. Copyright © 2018 Elsevier Ltd. All rights reserved.

  2. Signal processing techniques for damage detection with piezoelectric wafer active sensors and embedded ultrasonic structural radar

    NASA Astrophysics Data System (ADS)

    Yu, Lingyu; Bao, Jingjing; Giurgiutiu, Victor

    2004-07-01

    Embedded ultrasonic structural radar (EUSR) algorithm is developed for using piezoelectric wafer active sensor (PWAS) array to detect defects within a large area of a thin-plate specimen. Signal processing techniques are used to extract the time of flight of the wave packages, and thereby to determine the location of the defects with the EUSR algorithm. In our research, the transient tone-burst wave propagation signals are generated and collected by the embedded PWAS. Then, with signal processing, the frequency contents of the signals and the time of flight of individual frequencies are determined. This paper starts with an introduction of embedded ultrasonic structural radar algorithm. Then we will describe the signal processing methods used to extract the time of flight of the wave packages. The signal processing methods being used include the wavelet denoising, the cross correlation, and Hilbert transform. Though hardware device can provide averaging function to eliminate the noise coming from the signal collection process, wavelet denoising is included to ensure better signal quality for the application in real severe environment. For better recognition of time of flight, cross correlation method is used. Hilbert transform is applied to the signals after cross correlation in order to extract the envelope of the signals. Signal processing and EUSR are both implemented by developing a graphical user-friendly interface program in LabView. We conclude with a description of our vision for applying EUSR signal analysis to structural health monitoring and embedded nondestructive evaluation. To this end, we envisage an automatic damage detection application utilizing embedded PWAS, EUSR, and advanced signal processing.

  3. Recrystallization Behavior in SAC305 and SAC305 + 3.0POSS Solder Joints Under Thermal Shock

    NASA Astrophysics Data System (ADS)

    Han, Jing; Gu, Penghao; Ma, Limin; Guo, Fu; Liu, Jianping

    2018-04-01

    Sn-3.0Ag-0.5Cu (SAC305) and SAC305 + 3.0 polyhedral oligomeric silsesquioxanes (POSS) ball grid array (BGA) assemblies have been prepared, observed, and subjected to thermal shock. The microstructure and grain orientation evolution of the solder joints located at the same position of the package were characterized by scanning electron microscopy and electron backscattering diffraction, respectively. The results showed that the microstructure of the solder joints was refined by addition of POSS particles. In addition, compared with the single-grained or tricrystal joints normally observed in SAC305 BGA solder joints, the frequency of single-grained as-reflowed SAC305 + 3.0POSS BGA joints was greatly reduced, and the solder joints were typically composed of multicrystals with orientations separated by high-angle grain boundaries. These multicrystal joints appear to be obtained by dominant tricrystals or double tricrystals with deviation of the preferred [110] and [1\\bar{1}0] growth directions of Sn dendrites in Sn-Ag-based solder alloys during solidification from the melt. After 928 thermal shock cycles, the SAC305 solder joint had large-area recrystallization and cracks in contrast to the SAC305 + 3.0POSS solder joint located at the same position of the package, indicating that addition of POSS to SAC305 solder joints may contribute to postponement of recrystallization and subsequent crack initiation and propagation along recrystallized grain boundaries by pinning grain boundaries and movement of dislocations. This finding also confirms the double tricrystal solidification twinning nucleation behavior in Pb-free solder joints.

  4. Caliver: An R package for CALIbration and VERification of forest fire gridded model outputs.

    PubMed

    Vitolo, Claudia; Di Giuseppe, Francesca; D'Andrea, Mirko

    2018-01-01

    The name caliver stands for CALIbration and VERification of forest fire gridded model outputs. This is a package developed for the R programming language and available under an APACHE-2 license from a public repository. In this paper we describe the functionalities of the package and give examples using publicly available datasets. Fire danger model outputs are taken from the modeling components of the European Forest Fire Information System (EFFIS) and observed burned areas from the Global Fire Emission Database (GFED). Complete documentation, including a vignette, is also available within the package.

  5. Caliver: An R package for CALIbration and VERification of forest fire gridded model outputs

    PubMed Central

    Di Giuseppe, Francesca; D’Andrea, Mirko

    2018-01-01

    The name caliver stands for CALIbration and VERification of forest fire gridded model outputs. This is a package developed for the R programming language and available under an APACHE-2 license from a public repository. In this paper we describe the functionalities of the package and give examples using publicly available datasets. Fire danger model outputs are taken from the modeling components of the European Forest Fire Information System (EFFIS) and observed burned areas from the Global Fire Emission Database (GFED). Complete documentation, including a vignette, is also available within the package. PMID:29293536

  6. Implementation of radiation shielding calculation methods. Volume 1: Synopsis of methods and summary of results

    NASA Technical Reports Server (NTRS)

    Capo, M. A.; Disney, R. K.

    1971-01-01

    The work performed in the following areas is summarized: (1) Analysis of Realistic nuclear-propelled vehicle was analyzed using the Marshall Space Flight Center computer code package. This code package includes one and two dimensional discrete ordinate transport, point kernel, and single scatter techniques, as well as cross section preparation and data processing codes, (2) Techniques were developed to improve the automated data transfer in the coupled computation method of the computer code package and improve the utilization of this code package on the Univac-1108 computer system. (3) The MSFC master data libraries were updated.

  7. Nanotechnology for the Solid Waste Reduction of Military Food Packaging

    DTIC Science & Technology

    2016-06-01

    WP-200816) Nanotechnology for the Solid Waste Reduction of Military Food Packaging June 2016 This document has been cleared for public release...NAME OF RESPONSIBLE PERSON 19b. TELEPHONE NUMBER (Include area code) 01/06/2016 Cost and Performance Report 04/01/2008 - 01/01/2015 Nanotechnology for... nanotechnology packaging. The PIs have been dedicated to these efforts, and it is anticipated that this technology will be used someday by the Warfighter

  8. A Multi-Channel, Flex-Rigid ECoG Microelectrode Array for Visual Cortical Interfacing

    PubMed Central

    Tolstosheeva, Elena; Gordillo-González, Víctor; Biefeld, Volker; Kempen, Ludger; Mandon, Sunita; Kreiter, Andreas K.; Lang, Walter

    2015-01-01

    High-density electrocortical (ECoG) microelectrode arrays are promising signal-acquisition platforms for brain-computer interfaces envisioned, e.g., as high-performance communication solutions for paralyzed persons. We propose a multi-channel microelectrode array capable of recording ECoG field potentials with high spatial resolution. The proposed array is of a 150 mm2 total recording area; it has 124 circular electrodes (100, 300 and 500 μm in diameter) situated on the edges of concentric hexagons (min. 0.8 mm interdistance) and a skull-facing reference electrode (2.5 mm2 surface area). The array is processed as a free-standing device to enable monolithic integration of a rigid interposer, designed for soldering of fine-pitch SMD-connectors on a minimal assembly area. Electrochemical characterization revealed distinct impedance spectral bands for the 100, 300 and 500 μm-type electrodes, and for the array's own reference. Epidural recordings from the primary visual cortex (V1) of an awake Rhesus macaque showed natural electrophysiological signals and clear responses to standard visual stimulation. The ECoG electrodes of larger surface area recorded signals with greater spectral power in the gamma band, while the skull-facing reference electrode provided higher average gamma power spectral density (γPSD) than the common average referencing technique. PMID:25569757

  9. Incentives could induce Ethiopian doctors and nurses to work in rural settings.

    PubMed

    Hanson, Kara; Jack, William

    2010-08-01

    What would best motivate more doctors and nurses to work in rural areas of poor countries, where they are badly needed? We presented doctors and nurses in Ethiopia with a series of hypothetical job combinations of wages, working conditions, housing benefits, and training opportunities. For doctors, we found that higher wages and quality housing incentives had the biggest impact on their willingness to practice in towns in rural areas. For nurses, improvements in the availability of medical equipment and supplies were the factors most likely to bring about a move to a rural village. Choosing the right incentive package requires a consideration of both the effects of different packages on health workers' choices and the cost of those packages.

  10. Engineering sciences area and module performance and failure analysis area

    NASA Technical Reports Server (NTRS)

    Ross, R. G., Jr.; Runkle, L. D.

    1982-01-01

    Photovoltaic-array/power-conditioner interface studies are updated. An experiment conducted to evaluate different operating-point strategies, such as constant voltage and pilot cells, and to determine array energy losses when the array is operated off the maximum power points is described. Initial results over a test period of three and a half weeks showed a 2% energy loss when the array is operated at a fixed voltage. Degraded-array studies conducted at NE RES that used a range of simulated common types of degraded I-V curves are reviewed. The instrumentation installed at the JPL field-test site to obtain the irradiance data was described. Experiments using an optical filter to adjust the spectral irradiance of the large-area pulsed solar simulator (LAPSS) to AM1.5 are described. Residential-array research activity is reviewed. Voltage isolation test results are described. Experiments performed on one type of module to determine the relationship between leakage current and temperature are reviewed. An encapsulated-cell testing approach is explained. The test program, data reduction methods, and initial results of long-duration module testing are described.

  11. Antimicrobial activity of biodegradable polysaccharide and protein-based films containing active agents.

    PubMed

    Kuorwel, Kuorwel K; Cran, Marlene J; Sonneveld, Kees; Miltz, Joseph; Bigger, Stephen W

    2011-04-01

    Significant interest has emerged in the introduction of food packaging materials manufactured from biodegradable polymers that have the potential to reduce the environmental impacts associated with conventional packaging materials. Current technologies in active packaging enable effective antimicrobial (AM) packaging films to be prepared from biodegradable materials that have been modified and/or blended with different compatible materials and/or plasticisers. A wide range of AM films prepared from modified biodegradable materials have the potential to be used for packaging of various food products. This review examines biodegradable polymers derived from polysaccharides and protein-based materials for their potential use in packaging systems designed for the protection of food products from microbial contamination. A comprehensive table that systematically analyses and categorizes much of the current literature in this area is included in the review.

  12. AE (Acoustic Emission) for Flip-Chip CGA/FCBGA Defect Detection

    NASA Technical Reports Server (NTRS)

    Ghaffarian, Reza

    2014-01-01

    C-mode scanning acoustic microscopy (C-SAM) is a nondestructive inspection technique that uses ultrasound to show the internal feature of a specimen. A very high or ultra-high-frequency ultrasound passes through a specimen to produce a visible acoustic microimage (AMI) of its inner features. As ultrasound travels into a specimen, the wave is absorbed, scattered or reflected. The response is highly sensitive to the elastic properties of the materials and is especially sensitive to air gaps. This specific characteristic makes AMI the preferred method for finding "air gaps" such as delamination, cracks, voids, and porosity. C-SAM analysis, which is a type of AMI, was widely used in the past for evaluation of plastic microelectronic circuits, especially for detecting delamination of direct die bonding. With the introduction of the flip-chip die attachment in a package; its use has been expanded to nondestructive characterization of the flip-chip solder bumps and underfill. Figure 1.1 compares visual and C-SAM inspection approaches for defect detection, especially for solder joint interconnections and hidden defects. C-SAM is specifically useful for package features like internal cracks and delamination. C-SAM not only allows for the visualization of the interior features, it has the ability to produce images on layer-by-layer basis. Visual inspection; however, is only superior to C-SAM for the exposed features including solder dewetting, microcracks, and contamination. Ideally, a combination of various inspection techniques - visual, optical and SEM microscopy, C-SAM, and X-ray - need to be performed in order to assure quality at part, package, and system levels. This reports presents evaluations performed on various advanced packages/assemblies, especially the flip-chip die version of ball grid array/column grid array (BGA/CGA) using C-SAM equipment. Both external and internal equipment was used for evaluation. The outside facility provided images of the key features that could be detected using the most advanced C-SAM equipment with a skilled operator. Investigation continued using in-house equipment with its limitations. For comparison, representative X-rays of the assemblies were also gathered to show key defect detection features of these non-destructive techniques. Key images gathered and compared are: Compared the images of 2D X-ray and C-SAM for a plastic LGA assembly showing features that could be detected by either NDE technique. For this specific case, X-ray was a clear winner. Evaluated flip-chip CGA and FCBGA assemblies with and without heat sink by C-SAM. Only the FCCGA package that had no heat sink could be fully analyzed for underfill and bump quality. Cross-sectional microscopy did not revealed peripheral delamination features detected by C-SAM. Analyzed a number of fine pitch PBGA assemblies by C-SAM. Even though the internal features of the package assemblies could be detected, C-SAM was unable to detect solder joint failure at either the package or board level. Twenty times touch ups by solder iron with 700degF tip temperature, each with about 5 second duration, did not induce defects to be detected by C-SAM images. Other techniques need to be considered to induce known defects for characterization. Given NASA's emphasis on the use of microelectronic packages and assemblies and quality assurance on workmanship defect detection, understanding key features of various inspection systems that detect defects in the early stages of package and assembly is critical to developing approaches that will minimize future failures. Additional specific, tailored non-destructive inspection approaches could enable low-risk insertion of these advanced electronic packages having hidden and fine features.

  13. Solar Array Structures for 300 kW-Class Spacecraft

    NASA Technical Reports Server (NTRS)

    Pappa, Richard; Rose, Geoff; Mann, Troy O.; Warren, Jerry E.; Mikulas, Martin M., Jr.; Kerslake, Tom; Kraft, Tom; Banik, Jeremy

    2013-01-01

    State-of-the-art solar arrays for spacecraft provide on the order of 20 kW of electrical power, and they usually consist of 3J solar cells bonded to hinged rigid panels about 1 inch in thickness. This structural construction allows specific mass and packaging volumes of up to approximately 70 W/kg and 15 kW/m3 to be achieved. Significant advances in solar array structures are required for future very-high-power spacecraft (300+ kW), such as those proposed for pre-positioning heavy cargo on or near the Moon, Mars, or asteroids using solar electric propulsion. These applications will require considerable increases in both W/kg and kW/m3, and will undoubtedly require the use of flexible-substrate designs. This presentation summarizes work sponsored by NASA's Game Changing Development Program since Oct. 2011 to address the challenge of developing 300+ kW solar arrays. The work is primarily being done at NASA Langley, NASA Glenn, and two contractor teams (ATK and DSS), with technical collaboration from AFRL/Kirtland. The near-tem objective of the project is design, analysis, and testing of 30-50 kW solar array designs that are extensible to the far-term objective of 300+ kW. The work is currently focused on three designs: the MegaFlex concept by ATK, the Mega-ROSA concept by DSS, and an in-house 300-kW Government Reference Array concept. Each of these designs will be described in the presentation. Results obtained to date by the team, as well as future work plans, for the design, analysis, and testing of these large solar array structures will be summarized.

  14. Life testing of reflowed and reworked advanced CCGA surface mount packages in harsh thermal environments

    NASA Astrophysics Data System (ADS)

    Ramesham, Rajeshuni

    2013-03-01

    Life testing/qualification of reflowed (1st reflow) and reworked (1st reflow, 1st removal, and then 1st rework) advanced ceramic column grid array (CCGA) surface mount interconnect electronic packaging technologies for future flight projects has been studied to enhance the mission assurance of JPL-NASA projects. The reliability of reworked/reflowed surface mount technology (SMT) packages is very important for short-duration and long-duration deep space harsh extreme thermal environmental missions. The life testing of CCGA electronic packages under extreme thermal environments (for example: -185°C to +125°C) has been performed with reference to various JPL/NASA project requirements which encompass the temperature range studied. The test boards of reflowed and reworked CCGA packages (717 Xilinx package, 624, 1152, and 1272 column Actel Packages) were selected for the study to survive three times the total number of expected temperature cycles resulting from all environmental and operational exposures occurring over the life of the flight hardware including all relevant manufacturing, ground operations, and mission phases or cycles to failure to assess the life of the hardware. Qualification/life testing was performed by subjecting test boards to the environmental harsh temperature extremes and assessing any structural failures, mechanical failures or degradation in electrical performance solder-joint failures due to either overstress or thermal cycle fatigue. The large, high density, high input/output (I/O) electronic interconnect SMT packages such as CCGA have increased usage in avionics hardware of NASA projects during the last two decades. The test boards built with CCGA packages are expensive and often require a rework to replace a reflowed, reprogrammed, failed, redesigned, etc., CCGA packages. Theoretically speaking, a good rework process should have similar temperature-time profile as that used for the original manufacturing process of solder reflow. A multiple rework processes may be implemented with CCGA packaging technology to understand the effect of number of reworks on the reliability of this technology for harsh thermal environments. In general, reliability of the assembled electronic packages reduces as a function of number of reworks and the extent is not known yet. A CCGA rework process has been tried and implemented to design a daisy-chain test board consists of 624 and 717 packages. Reworked CCGA interconnect electronic packages of printed wiring polyimide boards have been assembled and inspected using non-destructive x-ray imaging and optical microscope techniques. The assembled boards after 1st rework and 1st reflow were subjected to extreme temperature thermal atmospheric cycling to assess their reliability for future deep space JPL/NASA for moderate to harsh thermal mission environments. The resistance of daisy-chained interconnect sections were monitored continuously during thermal cycling to determine intermittent failures. This paper provides the experimental reliability test results to failure of assemblies for the first time of reflowed and reworked CCGA packages under extreme harsh thermal environments.

  15. 1st NASA Electronic Parts Packaging (NEPP) Program Electronic Technology Workshop (ETW)

    NASA Technical Reports Server (NTRS)

    LaBel, Kenneth A.; Sampson, Michael J.

    2010-01-01

    NEPP supports all of NASA for >20 years - 7 NASA Centers and JPL actively participate The NEPP Program focuses on the reliability aspects of electronic devices - Three prime technical areas: Parts (die), Packaging, and Radiation Alternately, reliability may be viewed as: -

  16. How Institutions Respond to Training Packages.

    ERIC Educational Resources Information Center

    Boorman, Andrew

    The impact of the transition to training packages (TPs) on institutionally based training in Australia was examined. Information was gathered from 14 case studies of registered trade organizations (RTOs) delivering qualifications to institutionally based students in TPs in the following areas: administration, beauty therapy, community services,…

  17. Waterpipe product packaging and labelling at the 3rd international Hookah Fair; does it comply with Article 11 of the Framework Convention on Tobacco Control?

    PubMed

    Jawad, Mohammed; Darzi, Andrea; Lotfi, Tamara; Nakkash, Rima; Hawkins, Ben; Akl, Elie A

    2017-08-01

    We assessed compliance of waterpipe product packaging and labelling with the Framework Convention on Tobacco Control's Article 11. We evaluated samples collected at a trade fair against ten domains: health warning location, size, use of pictorials, use of colour, and packaging information on constituents and emissions. We also evaluated waterpipe accessories (e.g., charcoal) for misleading claims. Ten of 15 tobacco products had health warnings on their principal display areas, covering a median of 22.4 per cent (interquartile range 19.4-27.4 per cent) of those areas. Three had pictorial, in-colour health warnings. We judged all packaging information on constituents and emissions to be misleading. Eight of 13 charcoal products displayed environmentally friendly descriptors and/or claims of reduced harm that we judged to be misleading. Increased compliance with waterpipe tobacco regulation is warranted. An improved policy framework for waterpipe tobacco should also consider regulation of accessories such as charcoal products.

  18. A Lunar Laser Retroreflector for the FOR the 21ST Century (LLRRA-21): Selenodesy, Science and Status

    NASA Astrophysics Data System (ADS)

    Currie, D. G.; Delle Monache, G.; Dell'Agnello, S.

    2010-12-01

    The Lunar Laser Ranging Program using the Apollo Cube Corner Retroreflector (CCR) Arrays [1] has operated as the only active experiment on the lunar surface for the past 4 decades. During this time it has provided control points for the lunar coordinate system, contributed to the determination of the physical properties of the moon and provided some of the best tests of General Relativity [2]. In terms of the physical properties of the moon, Lunar Laser Ranging (LLR) has detected, evaluated the shape and the frictional behavior of the boundaries of the liquid core. This and other areas will be addressed. The LLR Program has evaluated the PPN parameters, addressed the possible changes in the gravitational constant and the properties of the self-energy of the gravitational field. Initially the Apollo CCRs contributed a negligible fraction of the ranging error. Over the decades, the ground stations have improved by more than a factor of 200. Now, the existing Apollo retroreflector arrays contribute a significant fraction of the limiting errors in the range measurements due to the lunar librations tilting of the array of CCRs and thus contribution to the spreading of the return laser pulse. The University of Maryland, as the Principal Investigator for the original Apollo arrays, is now proposing a new approach to the Lunar Laser Array technology [3]. The investigation of this new technology, by two teams with Professor Currie as PI, is currently being supported by two NASA programs, the LSSO and LUNAR. The LUNAR program at the University of Colorado the is funded through the NLSI. Both LSSO and the LUNAR programs are in collaboration with the INFN-LNF in Frascati, Italy. After the proposed installation during the next lunar landing, the new arrays will support ranging observations that are a factor 100 more accurate than the current Apollo Cube Corner Retroreflector (CCR) Arrays. The new fundamental selenodetic, cosmological physics and the lunar physics [3] that this new LLRRA-21 can provide will be described. In the initial design of the new array, there are three major challenges: 1) Validate the ability to fabricate the required CCR; 2) Address the thermal and optical effects of the absorption of solar radiation within the CCR; 3) Validate an emplacement technique for the CCR package on the lunar surface to remain stable over the lunar day/night cycle and the long term. References: [1] C. O. Alley 1, R. F. Chang 1, D. G. Currie 1, Apollo 11 Laser Ranging Retro-Reflector: Initial Measurements from the McDonald Observatory Science 23 January 1970: Vol. 167. no. 3917, pp. 368 - 370 [2] P. L. Bender, D. G. Currie, S. K. Poultney The Lunar Laser Ranging Experiment Science 19 October 1973: Vol. 182. no. 4109, pp. 229 - 238 [3] D. G. Currie; S. Dell-Agnello; G. Delle Monache. A LUNAR LASER REFLECTOR FOR THE 21ST CENTURY Acta Astronatica to be published

  19. Optimization of a large-area detector-block based on SiPM and pixelated LYSO crystal arrays.

    PubMed

    Calva-Coraza, E; Alva-Sánchez, H; Murrieta-Rodríguez, T; Martínez-Dávalos, A; Rodríguez-Villafuerte, M

    2017-10-01

    We present the performance evaluation of a large-area detector module based on the ArrayC-60035-64P, an 8×8 array of tileable, 7.2mm pitch, silicon photomultipliers (SiPM) by SensL, covering a total area of 57.4mm×57.4mm. We characterized the ArrayC-60035-64P, operating at room temperature, using LYSO pixelated crystal arrays of different pitch sizes (1.075, 1.430, 1.683, 2.080 and 2.280mm) to determine the resolvable crystal size. After an optimization process, a 7mm thick coupling light guide was used for all crystal pitches. To identify the interaction position a 16-channel (8 columns, 8 rows) symmetric charge division (SCD) readout board together with a center-of-gravity algorithm was used. Based on this, we assembled the detector modules using a 40×40 LYSO, 1.43mm pitch array, covering the total detector area. Calibration was performed using a 137 Cs source resulting in excellent crystal maps with minor geometric distortion, a mean 4.1 peak-to-valley ratio and 9.6% mean energy resolution for 662keV photons in the central region. The resolvability index was calculated in the x and y directions with values under 0.42 in all cases. We show that these large area SiPM arrays, combined with a 16-channel SCD readout board, can offer high spatial resolution, without processing a big number of signals, attaining excellent energy resolution and detector uniformity. Copyright © 2017 Associazione Italiana di Fisica Medica. Published by Elsevier Ltd. All rights reserved.

  20. MODFLOW-2005, The U.S. Geological Survey Modular Ground-Water Model - Documentation of the Multiple-Refined-Areas Capability of Local Grid Refinement (LGR) and the Boundary Flow and Head (BFH) Package

    USGS Publications Warehouse

    Mehl, Steffen W.; Hill, Mary C.

    2007-01-01

    This report documents the addition of the multiple-refined-areas capability to shared node Local Grid Refinement (LGR) and Boundary Flow and Head (BFH) Package of MODFLOW-2005, the U.S. Geological Survey modular, three-dimensional, finite-difference ground-water flow model. LGR now provides the capability to simulate ground-water flow by using one or more block-shaped, higher resolution local grids (child model) within a coarser grid (parent model). LGR accomplishes this by iteratively coupling separate MODFLOW-2005 models such that heads and fluxes are balanced across the shared interfacing boundaries. The ability to have multiple, nonoverlapping areas of refinement is important in situations where there is more than one area of concern within a regional model. In this circumstance, LGR can be used to simulate these distinct areas with higher resolution grids. LGR can be used in two-and three-dimensional, steady-state and transient simulations and for simulations of confined and unconfined ground-water systems. The BFH Package can be used to simulate these situations by using either the parent or child models independently.

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