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Space Experiments with Particle Accelerators (SEPAC)
NASA Technical Reports Server (NTRS)
Obayashi, T.; Kawashima, N.; Kuriki, K.; Nagatomo, M.; Ninomiya, K.; Sasaki, S.; Ushirokawa, A.; Kudo, I.; Ejiri, M.; Roberts, W. T.
1982-01-01
Plans for SEPAC, an instrument array to be used on Spacelab 1 to study vehicle charging and neutralization, beam-plasma interaction in space, beam-atmospheric interaction exciting artificial aurora and airglow, and the electromagnetic-field configuration of the magnetosphere, are presented. The hardware, consisting of electron beam accelerator, magnetoplasma arcjet, neutral-gas plume generator, power supply, diagnostic package (photometer, plasma probes, particle analyzers, and plasma-wave package), TV monitor, and control and data-management unit, is described. The individual SEPAC experiments, the typical operational sequence, and the general outline of the SEPAC follow-on mission are discussed. Some of the experiments are to be joint ventures with AEPI (INS 003) and will be monitored by low-light-level TV.
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MOSAIC: Software for creating mosaics from collections of images
NASA Technical Reports Server (NTRS)
Varosi, F.; Gezari, D. Y.
1992-01-01
We have developed a powerful, versatile image processing and analysis software package called MOSAIC, designed specifically for the manipulation of digital astronomical image data obtained with (but not limited to) two-dimensional array detectors. The software package is implemented using the Interactive Data Language (IDL), and incorporates new methods for processing, calibration, analysis, and visualization of astronomical image data, stressing effective methods for the creation of mosaic images from collections of individual exposures, while at the same time preserving the photometric integrity of the original data. Since IDL is available on many computers, the MOSAIC software runs on most UNIX and VAX workstations with the X-Windows or Sun View graphics interface.
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Long Duration Exposure Facility (LDEF) low-temperature heat pipe experiment package power system results
NASA Technical Reports Server (NTRS)
Tiller, Smith E.; Sullivan, David
1992-01-01
An overview of a self-contained Direct Energy Transfer Power System which was developed to provide power to the Long Duration Exposure Facility (LDEF) Low-Temperature Heat Pipe Experiment Package is presented. The power system operated successfully for the entire mission. Data recorded by the onboard recorder shows that the system operated within design specifications. Other than unanticipated overcharging of the battery, the power system operated as expected for nearly 32,000 low earth orbit cycles, and was still operational when tested after the LDEF recovery. Some physical damage was sustained by the solar array panels due to micrometeoroid hits, but there were not electrical failures.
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Packaging for Food Service
NASA Technical Reports Server (NTRS)
Stilwell, E. J.
1985-01-01
Most of the key areas of concern in packaging the three principle food forms for the space station were covered. It can be generally concluded that there are no significant voids in packaging materials availability or in current packaging technology. However, it must also be concluded that the process by which packaging decisions are made for the space station feeding program will be very synergistic. Packaging selection will depend heavily on the preparation mechanics, the preferred presentation and the achievable disposal systems. It will be important that packaging be considered as an integral part of each decision as these systems are developed.
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Thermal Interface Materials Selection and Application Guidelines: In Perspective of Xilinx Virtex-5QV Thermal Management
NASA Technical Reports Server (NTRS)
Suh, Jong-ook; Dillon, R. Peter; Tseng, Stephen
2015-01-01
The heat from high-power microdevices for space, such as Xilinx Virtex 4 and 5 (V4 and V5), has to be removed mainly through conduction in the space vacuum environment. The class-Y type packages are designed to remove the heat from the top of the package, and the most effective method to remove heat from the class-Y type packages is to attach a heat transfer device on the lid of the package and to transfer the heat to frame or chassis. When a heat transfer device is attached to the package lid, the surfaces roughness of the package lid and the heat transfer device reduces the effective contact area between the two. The reduced contact area results in increased thermal contact resistance, and a thermal interface material is required to reduce the thermal contact resistance by filling in the gap between the surfaces of the package lid and the heat transfer device. The current report describes JPL's FY14 NEPP task study on property requirements of TIM and impact of TIM properties on the packaging reliability. The current task also developed appratuses to investigate the performances of TIMs in the actual mission environment.
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The abundance and diversity of antibiotic resistance genes in the atmospheric environment of composting plants.
PubMed
Gao, Min; Qiu, Tianlei; Sun, Yanmei; Wang, Xuming
2018-07-01
Composting is considered to reduce the introduction of antimicrobial resistance genes (ARGs) into the environment through land application of manure; however, the possible pollution of ARGs in the atmospheric environment of composting plants is unknown. In this study, 29 air samples including up- and downwind, composting, packaging, and office areas from 4 composting plants were collected. Dynamic concentrations of 22 subtypes of ARGs, class 1 integron (intl1), and 2 potential human pathogenic bacteria (HPB), and bacterial communities were investigated using droplet digital PCR and 16S rRNA gene sequencing, respectively. In this study, intl1 and 22 subtypes of ARGs (except tetQ) were detected in air of composting, packaging, office, and downwind areas. The highest concentration of 15 out of 22 subtypes of ARGs was detected in the packaging areas, and intl1 also had the maximum average concentration of 10 4 copies/m 3 , with up to (1.78 ± 0.49) × 10 -2 copies/16S rRNA copy. Non-metric multi-dimensional scaling of ARGs, potential HPBs, and bacterial components all indicated that the bioaerosol pollutant pattern in packaging areas was most similar to that in composting areas, followed by office, downwind, and upwind areas. The co-occurrence between ARGs and bacterial taxa assessed by Procrustes test, mantel test, and network analysis implied that aerosolized ARG fragments from composting and packaging areas contributed to the compositions of ARG aerosols in office and downwind areas. The results presented here show that atmoshperic environments of composting plants harbor abundant and diverse ARGs, which highlight the urgent need for comprehensive evaluation of potential human health and ecological risks of composts during both production as well as land application. Copyright © 2018 Elsevier Ltd. All rights reserved.
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Thermal management of quantum cascade lasers in an individually addressable monolithic array architecture
NASA Astrophysics Data System (ADS)
Missaggia, Leo; Wang, Christine; Connors, Michael; Saar, Brian; Sanchez-Rubio, Antonio; Creedon, Kevin; Turner, George; Herzog, William
2016-03-01
There are a number of military and commercial applications for high-power laser systems in the mid-to-long-infrared wavelength range. By virtue of their demonstrated watt-level performance and wavelength diversity, quantum cascade laser (QCL) and amplifier devices are an excellent choice of emitter for those applications. To realize the power levels of interest, beam combining of arrays of these emitters is required and as a result, array technology must be developed. With this in mind, packaging and thermal management strategies were developed to facilitate the demonstration of a monolithic QCL array operating under CW conditions. Thermal models were constructed and simulations performed to determine the effect of parameters such as array-element ridge width and pitch on gain region temperature rise. The results of the simulations were considered in determining an appropriate QCL array configuration. State-of-the-art micro-impingement cooling along with an electrical distribution scheme comprised of AlN multi-layer technology were integrated into the design. The design of the module allows for individual electrical addressability of the array elements, a method of phase control demonstrated previously for coherent beam combining of diode arrays, along with access to both front and rear facets. Hence, both laser and single-pass amplifier arrays can be accommodated. A module was realized containing a 5 mm cavity length monolithic QCL array comprised of 7 elements on 450 m pitch. An output power of 3.16 W was demonstrated under CW conditions at an emission wavelength of 9μm.
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Vertical-cavity surface-emitting lasers - Design, growth, fabrication, characterization
NASA Astrophysics Data System (ADS)
Jewell, Jack L.; Lee, Y. H.; Harbison, J. P.; Scherer, A.; Florez, L. T.
1991-06-01
The authors have designed, fabricated, and tested vertical-cavity surface-emitting lasers (VCSEL) with diameters ranging from 0.5 microns to above 50 microns. Design issues, molecular beam epitaxial growth, fabrication, and lasing characteristics are discussed. The topics considered in fabrication of VCSELs are microlaser geometries; ion implementation and masks; ion beam etching; packaging and arrays; and ultrasmall devices.
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Thermal Lens Measurement in Diode-Pumped Nd:YAG Zig-Zag Slab
NASA Technical Reports Server (NTRS)
Smoak, M. C.; Kay, R. B.; Coyle, D. B.; Hopf, D.
1998-01-01
A major advantage that solid state zig-zag slab lasers have over conventional rod-based designs is that a much weaker thermal lens is produced in the slab when side-pumped with Quasi-CW laser diode arrays, particularly if the pump radiation is kept well away from the Brewster-cut ends. This paper reports on a rather strong thermal lens produced when diode pump radiation is collimated into a narrow portion of the zig-zag slab. The collimation of multi-bar pump packages to increase brightness and improve overlap is a direct consequence of designs which seek to maximize performance and efficiency. Our slab design employed a 8.1 cm x 2.5 mm x 5 mm slab with opposing Brewster end faces. It was pumped through the 2.5 mm direction by seven laser diode array packages, each housing four 6OW diode bars, 1 cm in width. The pump face, anti-reflection (AR) coated at 809 nm, was 6.8 cm in width and the 8.1 cm opposing side, high-reflection (HR) coated at 809 nm, reflected the unabsorbed pump beam for a second pass through the slab.
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New seismic instrumentation packaged for all terrestrial environments (including the quietest observatories!).
NASA Astrophysics Data System (ADS)
Parker, Tim; Devanney, Peter; Bainbridge, Geoff; Townsend, Bruce
2017-04-01
The march to make every type of seismometer, weak to strong motion, reliable and economically deployable in any terrestrial environment continues with the availability of three new sensors and seismic systems including ones with over 200dB of dynamic range. Until recently there were probably 100 pier type broadband sensors for every observatory type pier, not the types of deployments geoscientists are needing to advance science and monitoring capability. Deeper boreholes are now the recognized quieter environments for best observatory class instruments and these same instruments can now be deployed in direct burial environments which is unprecedented. The experiences of facilities in large deployments of broadband seismometers in continental scale rolling arrays proves the utility of packaging new sensors in corrosion resistant casings and designing in the robustness needed to work reliably in temporary deployments. Integrating digitizers and other sensors decreases deployment complexity, decreases acquisition and deployment costs, increases reliability and utility. We'll discuss the informed evolution of broadband pier instruments into the modern integrated field tools that enable economic densification of monitoring arrays along with supporting new ways to approach geoscience research in a field environment.
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Minfi: a flexible and comprehensive Bioconductor package for the analysis of Infinium DNA methylation microarrays
PubMed Central
Aryee, Martin J.; Jaffe, Andrew E.; Corrada-Bravo, Hector; Ladd-Acosta, Christine; Feinberg, Andrew P.; Hansen, Kasper D.; Irizarry, Rafael A.
2014-01-01
Motivation: The recently released Infinium HumanMethylation450 array (the ‘450k’ array) provides a high-throughput assay to quantify DNA methylation (DNAm) at ∼450 000 loci across a range of genomic features. Although less comprehensive than high-throughput sequencing-based techniques, this product is more cost-effective and promises to be the most widely used DNAm high-throughput measurement technology over the next several years. Results: Here we describe a suite of computational tools that incorporate state-of-the-art statistical techniques for the analysis of DNAm data. The software is structured to easily adapt to future versions of the technology. We include methods for preprocessing, quality assessment and detection of differentially methylated regions from the kilobase to the megabase scale. We show how our software provides a powerful and flexible development platform for future methods. We also illustrate how our methods empower the technology to make discoveries previously thought to be possible only with sequencing-based methods. Availability and implementation: http://bioconductor.org/packages/release/bioc/html/minfi.html. Contact: khansen@jhsph.edu; rafa@jimmy.harvard.edu Supplementary information: Supplementary data are available at Bioinformatics online. PMID:24478339
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Introduction to Software Packages. [Final Report.
ERIC Educational Resources Information Center
Frankel, Sheila, Ed.; And Others
This document provides an introduction to applications computer software packages that support functional managers in government and encourages the use of such packages as an alternative to in-house development. A review of current application areas includes budget/project management, financial management/accounting, payroll, personnel,…
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Modeling parameterized geometry in GPU-based Monte Carlo particle transport simulation for radiotherapy.
PubMed
Chi, Yujie; Tian, Zhen; Jia, Xun
2016-08-07
Monte Carlo (MC) particle transport simulation on a graphics-processing unit (GPU) platform has been extensively studied recently due to the efficiency advantage achieved via massive parallelization. Almost all of the existing GPU-based MC packages were developed for voxelized geometry. This limited application scope of these packages. The purpose of this paper is to develop a module to model parametric geometry and integrate it in GPU-based MC simulations. In our module, each continuous region was defined by its bounding surfaces that were parameterized by quadratic functions. Particle navigation functions in this geometry were developed. The module was incorporated to two previously developed GPU-based MC packages and was tested in two example problems: (1) low energy photon transport simulation in a brachytherapy case with a shielded cylinder applicator and (2) MeV coupled photon/electron transport simulation in a phantom containing several inserts of different shapes. In both cases, the calculated dose distributions agreed well with those calculated in the corresponding voxelized geometry. The averaged dose differences were 1.03% and 0.29%, respectively. We also used the developed package to perform simulations of a Varian VS 2000 brachytherapy source and generated a phase-space file. The computation time under the parameterized geometry depended on the memory location storing the geometry data. When the data was stored in GPU's shared memory, the highest computational speed was achieved. Incorporation of parameterized geometry yielded a computation time that was ~3 times of that in the corresponding voxelized geometry. We also developed a strategy to use an auxiliary index array to reduce frequency of geometry calculations and hence improve efficiency. With this strategy, the computational time ranged in 1.75-2.03 times of the voxelized geometry for coupled photon/electron transport depending on the voxel dimension of the auxiliary index array, and in 0.69-1.23 times for photon only transport.
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Lessons Learned in the Design and Use of IP1 / IP2 Flexible Packaging - 13621
DOE Office of Scientific and Technical Information (OSTI.GOV)
Sanchez, Mike; Reeves, Wendall; Smart, Bill
2013-07-01
For many years in the USA, Low Level Radioactive Waste (LLW), contaminated soils and construction debris, have been transported, interim stored, and disposed of, using IP1 / IP2 metal containers. The performance of these containers has been more than adequate, with few safety occurrences. The containers are used under the regulatory oversight of the US Department of Transportation (DOT), 49 Code of Federal Regulations (CFR). In the late 90's the introduction of flexible packaging for the transport, storage, and disposal of low level contaminated soils and construction debris was introduced. The development of flexible packaging came out of a needmore » for a more cost effective package, for the large volumes of waste generated by the decommissioning of many of the US Department of Energy (DOE) legacy sites across the US. Flexible packaging had to be designed to handle a wide array of waste streams, including soil, gravel, construction debris, and fine particulate dust migration. The design also had to meet all of the IP1 requirements under 49CFR 173.410, and be robust enough to pass the IP2 testing 49 CFR 173.465 required for many LLW shipments. Tens of thousands of flexible packages have been safely deployed and used across the US nuclear industry as well as for hazardous non-radioactive applications, with no recorded release of radioactive materials. To ensure that flexible packages are designed properly, the manufacturer must use lessons learned over the years, and the tests performed to provide evidence that these packages are suitable for transporting low level radioactive wastes. The design and testing of flexible packaging for LLW, VLLW and other hazardous waste streams must be as strict and stringent as the design and testing of metal containers. The design should take into consideration the materials being loaded into the package, and should incorporate the right materials, and manufacturing methods, to provide a quality, safe product. Flexible packaging can be shown to meet the criteria for safe and fit for purpose packaging, by meeting the US DOT regulations, and the IAEA Standards for IP-1 and IP-2 including leak tightness. (authors)« less
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Near- and far-field infrasound monitoring in the Mediterranean area
NASA Astrophysics Data System (ADS)
Campus, Paola; Marchetti, Emanuele; Le Pichon, Alexis; Wallenstein, Nicolau; Ripepe, Maurizio; Kallel, Mohamed; Mialle, Pierrick
2013-04-01
The Mediterranean area is characterized by a number of very interesting sources of infrasound signals and offers a promising playground for the development of a deeper understanding of such sources and of the associated propagation models. The progress in the construction and certification of infrasound arrays belonging to the International Monitoring System (IMS) of the Comprehensive Nuclear-Test-Ban Treaty (CTBT) in the vicinity of this area has been complemented, in the last decade, by the construction of infrasound arrays established by several European research groups. The University of Florence (UniFi) plays a crucial role for the detection of infrasound signals in the Mediterranean area, having deployed since several years two infrasound arrays on Stromboli and Etna volcanoes, and, more recently, three infrasound arrays in the Alpine area of NW Italy and one infrasound array on the Apennines (Mount Amiata), designed and established in the framework of the ARISE Project. The IMS infrasound arrays IS42 (Graciosa, Azores, Portugal) and IS48 (Kesra, Tunisia) recorded, since the time of their certification, a number of far-field events which can be correlated with some near-field records of the infrasound arrays belonging to UniFi. An analysis of the results and potentialities of infrasound source's detections in near and far-field realized by IS42, IS48 and UniFi arrays in the Mediterranean area, with special focus on volcanic events is presented. The combined results deriving from the analysis of data recorded by the Unifi arrays and by the IS42 and IS48 arrays, in collaboration with the Department of Analyse et Surveillance (CEA/DASE), will generate a synergy which will certainly contribute to the progress of the ARISE Project.
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Nanotechnology: An Untapped Resource for Food Packaging.
PubMed
Sharma, Chetan; Dhiman, Romika; Rokana, Namita; Panwar, Harsh
2017-01-01
Food commodities are packaged and hygienically transported to protect and preserve them from any un-acceptable alteration in quality, before reaching the end-consumer. Food packaging continues to evolve along-with the innovations in material science and technology, as well as in light of consumer's demand. Presently, the modern consumers of competitive economies demands for food with natural quality, assured safety, minimal processing, extended shelf-life and ready-to-eat concept. Innovative packaging systems, not only ascertains transit preservation and effective distribution, but also facilitates communication at the consumer levels. The technological advances in the domain of food packaging in twenty-first century are mainly chaired by nanotechnology, the science of nano-materials. Nanotechnology manipulates and creates nanometer scale materials, of commercial and scientific relevance. Introduction of nanotechnology in food packaging sector has significantly addressed the food quality, safety and stability concerns. Besides, nanotechnology based packaging intimate's consumers about the real time quality of food product. Additionally, nanotechnology has been explored for controlled release of preservatives/antimicrobials, extending the product shelf life within the package. The promising reports for nanotechnology interventions in food packaging have established this as an independent priority research area. Nanoparticles based food packages offer improved barrier and mechanical properties, along with food preservation and have gained welcoming response from market and end users. In contrary, recent advances and up-liftment in this area have raised various ethical, environmental and safety concerns. Policies and regulation regarding nanoparticles incorporation in food packaging are being reviewed. This review presents the existing knowledge, recent advances, concerns and future applications of nanotechnology in food packaging sector.
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Nanotechnology: An Untapped Resource for Food Packaging
PubMed Central
Sharma, Chetan; Dhiman, Romika; Rokana, Namita; Panwar, Harsh
2017-01-01
Food commodities are packaged and hygienically transported to protect and preserve them from any un-acceptable alteration in quality, before reaching the end-consumer. Food packaging continues to evolve along-with the innovations in material science and technology, as well as in light of consumer's demand. Presently, the modern consumers of competitive economies demands for food with natural quality, assured safety, minimal processing, extended shelf-life and ready-to-eat concept. Innovative packaging systems, not only ascertains transit preservation and effective distribution, but also facilitates communication at the consumer levels. The technological advances in the domain of food packaging in twenty-first century are mainly chaired by nanotechnology, the science of nano-materials. Nanotechnology manipulates and creates nanometer scale materials, of commercial and scientific relevance. Introduction of nanotechnology in food packaging sector has significantly addressed the food quality, safety and stability concerns. Besides, nanotechnology based packaging intimate's consumers about the real time quality of food product. Additionally, nanotechnology has been explored for controlled release of preservatives/antimicrobials, extending the product shelf life within the package. The promising reports for nanotechnology interventions in food packaging have established this as an independent priority research area. Nanoparticles based food packages offer improved barrier and mechanical properties, along with food preservation and have gained welcoming response from market and end users. In contrary, recent advances and up-liftment in this area have raised various ethical, environmental and safety concerns. Policies and regulation regarding nanoparticles incorporation in food packaging are being reviewed. This review presents the existing knowledge, recent advances, concerns and future applications of nanotechnology in food packaging sector. PMID:28955314
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RF beam transmission of x-band PAA system utilizing large-area, polymer-based true-time-delay module developed using imprinting and inkjet printing
NASA Astrophysics Data System (ADS)
Pan, Zeyu; Subbaraman, Harish; Zhang, Cheng; Li, Qiaochu; Xu, Xiaochuan; Chen, Xiangning; Zhang, Xingyu; Zou, Yi; Panday, Ashwin; Guo, L. Jay; Chen, Ray T.
2016-02-01
Phased-array antenna (PAA) technology plays a significant role in modern day radar and communication networks. Truetime- delay (TTD) enabled beam steering networks provide several advantages over their electronic counterparts, including squint-free beam steering, low RF loss, immunity to electromagnetic interference (EMI), and large bandwidth control of PAAs. Chip-scale and integrated TTD modules promise a miniaturized, light-weight system; however, the modules are still rigid and they require complex packaging solutions. Moreover, the total achievable time delay is still restricted by the wafer size. In this work, we propose a light-weight and large-area, true-time-delay beamforming network that can be fabricated on light-weight and flexible/rigid surfaces utilizing low-cost "printing" techniques. In order to prove the feasibility of the approach, a 2-bit thermo-optic polymer TTD network is developed using a combination of imprinting and ink-jet printing. RF beam steering of a 1×4 X-band PAA up to 60° is demonstrated. The development of such active components on large area, light-weight, and low-cost substrates promises significant improvement in size, weight, and power (SWaP) requirements over the state-of-the-art.
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Soft lithography microlens fabrication and array for enhanced light extraction from organic light emitting diodes (OLEDs)
DOEpatents
Leung, Wai Y.; Park, Joong-Mok; Gan, Zhengqing; Constant, Kristen P.; Shinar, Joseph; Shinar, Ruth; ho, Kai-Ming
2014-06-03
Provided are microlens arrays for use on the substrate of OLEDs to extract more light that is trapped in waveguided modes inside the devices and methods of manufacturing same. Light extraction with microlens arrays is not limited to the light emitting area, but is also efficient in extracting light from the whole microlens patterned area where waveguiding occurs. Large microlens array, compared to the size of the light emitting area, extract more light and result in over 100% enhancement. Such a microlens array is not limited to (O)LEDs of specific emission, configuration, pixel size, or pixel shape. It is suitable for all colors, including white, for microcavity OLEDs, and OLEDs fabricated directly on the (modified) microlens array.
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Materials, devices, techniques, and applications for Z-plane focal plane array technology II; Proceedings of the Meeting, San Diego, CA, July 12, 13, 1990
NASA Astrophysics Data System (ADS)
Carson, John C.
1990-11-01
Various papers on materials, devices, techniques, and applications for X-plane focal plane array technology are presented. Individual topics addressed include: application of Z-plane technology to the remote sensing of the earth from GEO, applications of smart neuromorphic focal planes, image-processing of Z-plane technology, neural network Z-plane implementation with very high interconnection rates, using a small IR surveillance satellite for tactical applications, establishing requirements for homing applications, Z-plane technology. Also discussed are: on-array spike suppression signal processing, algorithms for on-focal-plane gamma circumvention and time-delay integration, current HYMOSS Z-technology, packaging of electrons for on- and off-FPA signal processing, space/performance qualification of tape automated bonded devices, automation in tape automated bonding, high-speed/high-volume radiometric testing of Z-technology focal planes, 128-layer HYMOSS-module fabrication issues, automation of IRFPA production processes.