Photorefractor ocular screening system

NASA Technical Reports Server (NTRS)

Richardson, John R. (Inventor); Kerr, Joseph H. (Inventor)

1987-01-01

A method and apparatus for detecting human eye defects, particularly detection of refractive error is presented. Eye reflex is recorded on color film when the eyes are exposed to a flash of light. The photographs are compared with predetermined standards to detect eye defects. The base structure of the ocular screening system is a folding interconnect structure, comprising hinged sections. Attached to one end of the structure is a head positioning station which comprises vertical support, a head positioning bracket having one end attached to the top of the support, and two head positioning lamps to verify precise head positioning. At the opposite end of the interconnect structure is a camera station with camera, electronic flash unit, and blinking fixation lamp, for photographing the eyes of persons being evaluated.

Microfabricated structures with electrical isolation and interconnections

NASA Technical Reports Server (NTRS)

Clark, William A. (Inventor); Juneau, Thor N. (Inventor); Roessig, Allen W. (Inventor); Lemkin, Mark A. (Inventor)

2001-01-01

The invention is directed to a microfabricated device. The device includes a substrate that is etched to define mechanical structures at least some of which are anchored laterally to the remainder of the substrate. Electrical isolation at points where mechanical structures are attached to the substrate is provided by filled isolation trenches. Filled trenches may also be used to electrically isolate structure elements from each other at points where mechanical attachment of structure elements is desired. The performance of microelectromechanical devices is improved by 1) having a high-aspect-ratio between vertical and lateral dimensions of the mechanical elements, 2) integrating electronics on the same substrate as the mechanical elements, 3) good electrical isolation among mechanical elements and circuits except where electrical interconnection is desired.

Method of bonding an interconnection layer on an electrode of an electrochemical cell

DOEpatents

Pal, Uday B.; Isenberg, Arnold O.; Folser, George R.

1992-01-01

An electrochemical cell containing an air electrode (16), contacting electrolyte and electronically conductive interconnection layer (26), and a fuel electrode, has the interconnection layer (26) attached by: (A) applying a thin, closely packed, discrete layer of LaCrO.sub.3 particles (30), doped with an element selected from the group consisting of Ca, Sr, Co, Ba, Mg and their mixtures on a portion of the air electrode, and then (B) electrochemical vapor depositing a dense skeletal structure (32) between and around the doped LaCrO.sub.3 particles (30).

Next generation space interconnect research and development in space communications

NASA Astrophysics Data System (ADS)

Collier, Charles Patrick

2017-11-01

Interconnect or "bus" is one of the critical technologies in design of spacecraft avionics systems that dictates its architecture and complexity. MIL-STD-1553B has long been used as the avionics backbone technology. As avionics systems become more and more capable and complex, however, limitations of MIL-STD-1553B such as insufficient 1 Mbps bandwidth and separability have forced current avionics architects and designers to use combination of different interconnect technologies in order to meet various requirements: CompactPCI is used for backplane interconnect; LVDS or RS422 is used for low and high-speed direct point-to-point interconnect; and some proprietary interconnect standards are designed for custom interfaces. This results in a very complicated system that consumes significant spacecraft mass and power and requires extensive resources in design, integration and testing of spacecraft systems.

WDM package enabling high-bandwidth optical intrasystem interconnects for high-performance computer systems

NASA Astrophysics Data System (ADS)

Schrage, J.; Soenmez, Y.; Happel, T.; Gubler, U.; Lukowicz, P.; Mrozynski, G.

2006-02-01

From long haul, metro access and intersystem links the trend goes to applying optical interconnection technology at increasingly shorter distances. Intrasystem interconnects such as data busses between microprocessors and memory blocks are still based on copper interconnects today. This causes a bottleneck in computer systems since the achievable bandwidth of electrical interconnects is limited through the underlying physical properties. Approaches to solve this problem by embedding optical multimode polymer waveguides into the board (electro-optical circuit board technology, EOCB) have been reported earlier. The principle feasibility of optical interconnection technology in chip-to-chip applications has been validated in a number of projects. For reasons of cost considerations waveguides with large cross sections are used in order to relax alignment requirements and to allow automatic placement and assembly without any active alignment of components necessary. On the other hand the bandwidth of these highly multimodal waveguides is restricted due to mode dispersion. The advance of WDM technology towards intrasystem applications will provide sufficiently high bandwidth which is required for future high-performance computer systems: Assuming that, for example, 8 wavelength-channels with 12Gbps (SDR1) each are given, then optical on-board interconnects with data rates a magnitude higher than the data rates of electrical interconnects for distances typically found at today's computer boards and backplanes can be realized. The data rate will be twice as much, if DDR2 technology is considered towards the optical signals as well. In this paper we discuss an approach for a hybrid integrated optoelectronic WDM package which might enable the application of WDM technology to EOCB.

Scaling induced performance challenges/limitations of on-chip metal interconnects and comparisons with optical interconnects

NASA Astrophysics Data System (ADS)

Kapur, Pawan

The miniaturization paradigm for silicon integrated circuits has resulted in a tremendous cost and performance advantage. Aggressive shrinking of devices provides faster transistors and a greater functionality for circuit design. However, scaling induced smaller wire cross-sections coupled with longer lengths owing to larger chip areas, result in a steady deterioration of interconnects. This degradation in interconnect trends threatens to slow down the rapid growth along Moore's law. This work predicts that the situation is worse than anticipated. It shows that in the light of technology and reliability constraints, scaling induced increase in electron surface scattering, fractional cross section area occupied by the highly resistive barrier, and realistic interconnect operation temperature will lead to a significant rise in effective resistivity of modern copper based interconnects. We start by discussing various technology factors affecting copper resistivity. We, next, develop simulation tools to model these effects. Using these tools, we quantify the increase in realistic copper resistivity as a function of future technology nodes, under various technology assumptions. Subsequently, we evaluate the impact of these technology effects on delay and power dissipation of global signaling interconnects. Modern long on-chip wires use repeaters, which dramatically improves their delay and bandwidth. We quantify the repeated wire delays and power dissipation using realistic resistance trends at future nodes. With the motivation of reducing power, we formalize a methodology, which trades power with delay very efficiently for repeated wires. Using this method, we find that although the repeater power comes down, the total power dissipation due to wires is still found to be very large at future nodes. Finally, we explore optical interconnects as a possible substitute, for specific interconnect applications. We model an optical receiver and waveguides. Using this we assess future optical system performance. Finally, we compare the delay and power of future metal interconnects with that of optical interconnects for global signaling application. We also compare the power dissipation of the two approaches for an upper level clock distribution application. We find that for long on-chip communication links, optical interconnects have lower latencies than future metal interconnects at comparable levels of power dissipation.

Helix coupling

DOEpatents

Ginell, W.S.

1982-03-17

A coupling for connecting helix members in series, which consists of a pair of U-shaped elements, one of which is attached to each helix end with the U sections of the elements interlocked. The coupling is particularly beneficial for interconnecting helical Nitinol elements utilized in thermal actuators or engines. Each coupling half is attached to the associated helix at two points, thereby providing axial load while being easily removed from the helix, and reusable.

Helix coupling

DOEpatents

Ginell, William S.

1989-04-25

A coupling for connecting helix members in series, which consists of a pair of U-shaped elements, one of which is attached to each helix end with the "U" sections of the elements interlocked. The coupling is particularly beneficial for interconnecting helical Nitinol elements utilized in thermal actuators or engines. Each coupling half is attached to the associated helix at two points, thereby providing axial load while being easily removed from the helix, and reusable.

Implementation of virtual LANs over ATM WANs

NASA Astrophysics Data System (ADS)

Braun, Torsten; Maehler, Martin

1998-09-01

Virtual LANs (VLANs) allow to interconnect users over campus or wide area networks and gives the users the impression as they would be connected to the same local area network (LAN). The implementation of VLANs is based on ATM Forum's LAN Emulation and LAN/ATM switches providing interconnection of emulated LANs over ATM and the LAN ports to which the user's end systems are attached to. The paper discusses possible implementation architectures and describes advanced features such as ATM short-cuts, QoS, and redundancy concepts.

Novel optical interconnect devices applying mask-transfer self-written method

NASA Astrophysics Data System (ADS)

Ishizawa, Nobuhiko; Matsuzawa, Yusuke; Tokiwa, Yu; Nakama, Kenichi; Mikami, Osamu

2012-01-01

The introduction of optical interconnect technology is expected to solve problems of conventional electric wiring. One of the promising technologies realizing optical interconnect is the self-written waveguide (SWW) technology with lightcurable resin. We have developed a new technology of the "Mask-Transfer Self-Written (MTSW)" method. This new method enables fabrication of arrayed M x N optical channels at one shot of UV-light. Using this technology, several new optical interconnect devices and connection technologies have been proposed and investigated. In this paper, first, we introduce MTSW method briefly. Next, we show plug-in alignment approach using optical waveguide plugs (OWP) and a micro-hole array (MHA) which are made of the light-curable resin. Easy and high efficiency plug-in alignment between fibers and an optoelectronic-printed wiring board (OE-PWB), between a fiber and a VCSEL, so on will be feasible. Then, we propose a new three-dimensional (3D) branch waveguide. By controlling the irradiating angle through the photomask aperture, it will be possible to fabricate 2-branch and 4-branch waveguides with a certain branch angle. The 3D branch waveguide will be very promising in the future optical interconnects and coupler devices of the multicore optical fiber.

Highly conductive metal interconnects on three-dimensional objects fabricated with omnidirectional ink jet printing technology

NASA Astrophysics Data System (ADS)

Yoshida, Yasunori; Wada, Hikaru; Izumi, Konami; Tokito, Shizuo

2017-05-01

In this work, we demonstrate that highly conductive metal interconnects can be fabricated on the surface of three-dimensional objects using “omnidirectional ink jet” (OIJ) printing technology. OIJ printing technology makes it possible to perform ink jet printing in all directions by combining the motion of a 6-axis vertically articulated robot with precise positioning and a thermal drying process, which allows for the printing of stacked layers. By using OIJ technology, we were the first to successfully fabricate printed interconnect layers having a very low electrical resistance of 12 mΩ over a 10 mm length. Moreover, the results of the high-current test demonstrated that the printed interconnects can withstand high-current-flow of 5 A for 30 min or more.

PICSiP: new system-in-package technology using a high bandwidth photonic interconnection layer for converged microsystems

NASA Astrophysics Data System (ADS)

Tekin, Tolga; Töpper, Michael; Reichl, Herbert

2009-05-01

Technological frontiers between semiconductor technology, packaging, and system design are disappearing. Scaling down geometries [1] alone does not provide improvement of performance, less power, smaller size, and lower cost. It will require "More than Moore" [2] through the tighter integration of system level components at the package level. System-in-Package (SiP) will deliver the efficient use of three dimensions (3D) through innovation in packaging and interconnect technology. A key bottleneck to the implementation of high-performance microelectronic systems, including SiP, is the lack of lowlatency, high-bandwidth, and high density off-chip interconnects. Some of the challenges in achieving high-bandwidth chip-to-chip communication using electrical interconnects include the high losses in the substrate dielectric, reflections and impedance discontinuities, and susceptibility to crosstalk [3]. Obviously, the incentive for the use of photonics to overcome the challenges and leverage low-latency and highbandwidth communication will enable the vision of optical computing within next generation architectures. Supercomputers of today offer sustained performance of more than petaflops, which can be increased by utilizing optical interconnects. Next generation computing architectures are needed with ultra low power consumption; ultra high performance with novel interconnection technologies. In this paper we will discuss a CMOS compatible underlying technology to enable next generation optical computing architectures. By introducing a new optical layer within the 3D SiP, the development of converged microsystems, deployment for next generation optical computing architecture will be leveraged.

Method for reworkable packaging of high speed, low electrical parasitic power electronics modules through gate drive integration

DOEpatents

Passmore, Brandon; Cole, Zach; Whitaker, Bret; Barkley, Adam; McNutt, Ty; Lostetter, Alexander

2016-08-02

A multichip power module directly connecting the busboard to a printed-circuit board that is attached to the power substrate enabling extremely low loop inductance for extreme environments such as high temperature operation. Wire bond interconnections are taught from the power die directly to the busboard further enabling enable low parasitic interconnections. Integration of on-board high frequency bus capacitors provide extremely low loop inductance. An extreme environment gate driver board allows close physical proximity of gate driver and power stage to reduce overall volume and reduce impedance in the control circuit. Parallel spring-loaded pin gate driver PCB connections allows a reliable and reworkable power module to gate driver interconnections.

Board-to-Board Free-Space Optical Interconnections Passing through Boards for a Bookshelf-Assembled Terabit-Per-Second-Class ATM Switch.

PubMed

Hirabayashi, K; Yamamoto, T; Matsuo, S; Hino, S

1998-05-10

We propose free-space optical interconnections for a bookshelf-assembled terabit-per-second-class ATM switch. Thousands of arrayed optical beams, each having a rate of a few gigabits per second, propagate vertically to printed circuit boards, passing through some boards, and are connected to arbitrary transmitters and receivers on boards by polarization controllers and prism arrays. We describe a preliminary experiment using a 1-mm-pitch 2 x 2 beam-collimator array that uses vertical-cavity surface-emitting laser diodes. These optical interconnections can be made quite stable in terms of mechanical shock and temperature fluctuation by the attachment of reinforcing frames to the boards and use of an autoalignment system.

Modular microfluidic systems using reversibly attached PDMS fluid control modules

NASA Astrophysics Data System (ADS)

Skafte-Pedersen, Peder; Sip, Christopher G.; Folch, Albert; Dufva, Martin

2013-05-01

The use of soft lithography-based poly(dimethylsiloxane) (PDMS) valve systems is the dominating approach for high-density microscale fluidic control. Integrated systems enable complex flow control and large-scale integration, but lack modularity. In contrast, modular systems are attractive alternatives to integration because they can be tailored for different applications piecewise and without redesigning every element of the system. We present a method for reversibly coupling hard materials to soft lithography defined systems through self-aligning O-ring features thereby enabling easy interfacing of complex-valve-based systems with simpler detachable units. Using this scheme, we demonstrate the seamless interfacing of a PDMS-based fluid control module with hard polymer chips. In our system, 32 self-aligning O-ring features protruding from the PDMS fluid control module form chip-to-control module interconnections which are sealed by tightening four screws. The interconnection method is robust and supports complex fluidic operations in the reversibly attached passive chip. In addition, we developed a double-sided molding method for fabricating PDMS devices with integrated through-holes. The versatile system facilitates a wide range of applications due to the modular approach, where application specific passive chips can be readily attached to the flow control module.

Optical interconnection and packaging technologies for advanced avionics systems

NASA Astrophysics Data System (ADS)

Schroeder, J. E.; Christian, N. L.; Cotti, B.

1992-09-01

An optical backplane developed to demonstrate the advantages of high-performance optical interconnections and supporting technologies and designed to be compatible with standard avionics racks is described. The hardware demonstrates the three basic components of optical interconnects: optical sources, an optical signal distribution network, and optical receivers. Results from characterization and environmental tests, including a demonstration of the reliable transmission of serial data at a 1 Gb/s, are reported.

Fixture for assembling solar panels

NASA Technical Reports Server (NTRS)

Dillard, P. A.; Fritz, W. M.

1979-01-01

Vacuum fixture attaches array of silicon solar cells to mounting plate made of clear glass which holds and protects cells. Glass plate transmits, rather than absorbs, solar energy thus cooling cells for efficient operation. Device therefore reduces handling of cells and interconnecting conductors to one operation.

The fabrication of well-interconnected polycaprolactone/hydroxyapatite composite scaffolds, enhancing the exposure of hydroxyapatite using the wire-network molding technique.

PubMed

Cho, Yong Sang; Hong, Myoung Wha; Jeong, Hoon-Jin; Lee, Seung-Jae; Kim, Young Yul; Cho, Young-Sam

2017-11-01

In this study, the fabrication method was proposed for the well-interconnected polycaprolactone/hydroxyapatite composite scaffold with exposed hydroxyapatite using modified WNM technique. To characterize well-interconnected scaffolds in terms of hydroxyapatite exposure, several assessments were performed as follows: morphology, mechanical property, wettability, calcium ion release, and cell response assessments. The results of these assessments were compared with those of control scaffolds which were fabricated by precision extruding deposition (PED) apparatus. The control PED scaffolds have interconnected pores with nonexposed hydroxyapatite. Consequently, cell attachment of proposed WNM scaffold was improved by increased hydrophilicity and surface roughness of scaffold surface resulting from the exposure of hydroxyapatite particles and fabrication process using powders. Moreover, cell proliferation and differentiation of WNM scaffold were increased, because the exposure of hydroxyapatite particles may enhance cell adhesion and calcium ion release. © 2016 Wiley Periodicals, Inc. J Biomed Mater Res Part B: Appl Biomater, 105B: 2315-2325, 2017. © 2016 Wiley Periodicals, Inc.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Sheaffer, P.; Lemar, P.; Honton, E. J.

The Universal Interconnection Technology (UIT) Workshop - sponsored by the U.S. Department of Energy, Distributed Energy and Electric Reliability (DEER) Program, and Distribution and Interconnection R&D - was held July 25-26, 2002, in Chicago, Ill., to: (1) Examine the need for a modular universal interconnection technology; (2) Identify UIT functional and technical requirements; (3) Assess the feasibility of and potential roadblocks to UIT; (4) Create an action plan for UIT development. These proceedings begin with an overview of the workshop. The body of the proceedings provides a series of industry representative-prepared papers on UIT functions and features, present interconnection technology,more » approaches to modularization and expandability, and technical issues in UIT development as well as detailed summaries of group discussions. Presentations, a list of participants, a copy of the agenda, and contact information are provided in the appendices of this document.« less

39 CFR 255.2 - Definitions.

Code of Federal Regulations, 2014 CFR

2014-07-01

... technology” and any equipment or interconnected system or subsystem of equipment that is used in the creation... embedded information technology that is used as an integral part of the product, but the principal function... an impairment. (f) Information technology means any equipment, or interconnected system or subsystem...

39 CFR 255.2 - Definitions.

Code of Federal Regulations, 2013 CFR

2013-07-01

... technology” and any equipment or interconnected system or subsystem of equipment that is used in the creation... embedded information technology that is used as an integral part of the product, but the principal function... an impairment. (f) Information technology means any equipment, or interconnected system or subsystem...

39 CFR 255.2 - Definitions.

Code of Federal Regulations, 2011 CFR

2011-07-01

... technology” and any equipment or interconnected system or subsystem of equipment that is used in the creation... embedded information technology that is used as an integral part of the product, but the principal function... an impairment. (f) Information technology means any equipment, or interconnected system or subsystem...

39 CFR 255.2 - Definitions.

Code of Federal Regulations, 2012 CFR

2012-07-01

... technology” and any equipment or interconnected system or subsystem of equipment that is used in the creation... embedded information technology that is used as an integral part of the product, but the principal function... an impairment. (f) Information technology means any equipment, or interconnected system or subsystem...

Microwave interconnection

NASA Astrophysics Data System (ADS)

Fry, P. E.

1993-06-01

A limited evaluation was made of two commonly found microwave interconnections: microstrip-to-microstrip and coaxial-to-microstrip. The evaluation attempted to select the interconnection technique which worked best for the particular interface type. Short ribbon wires worked best for the microstrip-to-microstrip interconnection. A published method of compensating the microstrip conductor had the best performance for the coaxial-to-microstrip interconnection. The work was conducted under the Microwave Technology Process Capability Assurance Program at Allied-Signal Inc., Kansas City Division.

Extreme temperature packaging: challenges and opportunities

NASA Astrophysics Data System (ADS)

Johnson, R. Wayne

2016-05-01

Consumer electronics account for the majority of electronics manufactured today. Given the temperature limits of humans, consumer electronics are typically rated for operation from -40°C to +85°C. Military applications extend the range to -65°C to +125°C while underhood automotive electronics may see +150°C. With the proliferation of the Internet of Things (IoT), the goal of instrumenting (sensing, computation, transmission) to improve safety and performance in high temperature environments such as geothermal wells, nuclear reactors, combustion chambers, industrial processes, etc. requires sensors, electronics and packaging compatible with these environments. Advances in wide bandgap semiconductors (SiC and GaN) allow the fabrication of high temperature compatible sensors and electronics. Integration and packaging of these devices is required for implementation into actual applications. The basic elements of packaging are die attach, electrical interconnection and the package or housing. Consumer electronics typically use conductive adhesives or low melting point solders for die attach, wire bonds or low melting solder for electrical interconnection and epoxy for the package. These materials melt or decompose in high temperature environments. This paper examines materials and processes for high temperature packaging including liquid transient phase and sintered nanoparticle die attach, high melting point wires for wire bonding and metal and ceramic packages. The limitations of currently available solutions will also be discussed.

NREL Leadership Contributes to Revision of Key Energy Integration Standard,

Science.gov Websites

interconnection standard for distributed energy resource technologies, including rooftop solar panels. The , which establishes uniform requirements for interconnection of distributed energy resources (DERs), such foundation for integrating clean renewable energy technologies as well as other distributed generation and

High-performance parallel processors based on star-coupled wavelength division multiplexing optical interconnects

DOEpatents

Deri, Robert J.; DeGroot, Anthony J.; Haigh, Ronald E.

2002-01-01

As the performance of individual elements within parallel processing systems increases, increased communication capability between distributed processor and memory elements is required. There is great interest in using fiber optics to improve interconnect communication beyond that attainable using electronic technology. Several groups have considered WDM, star-coupled optical interconnects. The invention uses a fiber optic transceiver to provide low latency, high bandwidth channels for such interconnects using a robust multimode fiber technology. Instruction-level simulation is used to quantify the bandwidth, latency, and concurrency required for such interconnects to scale to 256 nodes, each operating at 1 GFLOPS performance. Performance scales have been shown to .apprxeq.100 GFLOPS for scientific application kernels using a small number of wavelengths (8 to 32), only one wavelength received per node, and achievable optoelectronic bandwidth and latency.

Aircraft Lightning Electromagnetic Environment Measurement

NASA Technical Reports Server (NTRS)

Ely, Jay J.; Nguyen, Truong X.; Szatkowski, George N.

2011-01-01

This paper outlines a NASA project plan for demonstrating a prototype lightning strike measurement system that is suitable for installation onto research aircraft that already operate in thunderstorms. This work builds upon past data from the NASA F106, FAA CV-580, and Transall C-180 flight projects, SAE ARP5412, and the European ILDAS Program. The primary focus is to capture airframe current waveforms during attachment, but may also consider pre and post-attachment current, electric field, and radiated field phenomena. New sensor technologies are being developed for this system, including a fiber-optic Faraday polarization sensor that measures lightning current waveforms from DC to over several Megahertz, and has dynamic range covering hundreds-of-volts to tens-of-thousands-of-volts. A study of the electromagnetic emission spectrum of lightning (including radio wave, microwave, optical, X-Rays and Gamma-Rays), and a compilation of aircraft transfer-function data (including composite aircraft) are included, to aid in the development of other new lightning environment sensors, their placement on-board research aircraft, and triggering of the onboard instrumentation system. The instrumentation system will leverage recent advances in high-speed, high dynamic range, deep memory data acquisition equipment, and fiber-optic interconnect.

Novel optical interconnect devices and coupling methods applying self-written waveguide technology

NASA Astrophysics Data System (ADS)

Nakama, Kenichi; Mikami, Osamu

2011-05-01

For the use in cost-effective optical interconnection of opt-electronic printed wiring boards (OE-PWBs), we have developed novel optical interconnect devices and coupling methods simplifying board to board optical interconnect. All these are based on the self-written waveguide (SWW) technology by the mask-transfer method with light-curable resin. This method enables fabrication of arrayed M × N optical channels at one shot of UV light. Very precise patterns, as an example, optical rod with diameters of 50μm to 500μm, can be easily fabricated. The length of the fabricated patterns ,, typically up to about 1000μm , can be controlled by a spacer placed between the photomask and the substrate. Using these technologies, several new optical interfaces have been demonstrated. These are a chip VCSEL with an optical output rod and new coupling methods of "plug-in" alignment and "optical socket" based on SWW.

Microprobe array with low impedance electrodes and highly flexible polyimide cables for acute neural recording.

PubMed

Kisban, S; Herwik, S; Seidl, K; Rubehn, B; Jezzini, A; Umiltà, M A; Fogassi, L; Stieglitz, T; Paul, O; Ruther, P

2007-01-01

This paper reports on a novel type of silicon-based microprobes with linear, two and three dimensional (3D) distribution of their recording sites. The microprobes comprise either single shafts, combs with multiple shafts or 3D arrays combining two combs with 9, 36 or 72 recording sites, respectively. The electrical interconnection of the probes is achieved through highly flexible polyimide ribbon cables attached using the MicroFlex Technology which allows a connection part of small lateral dimensions. For an improved handling, probes can be secured by a protecting canula. Low-impedance electrodes are achieved by the deposition of platinum black. First in vivo experiments proved the capability to record single action potentials in the motor cortex from electrodes close to the tip as well as body electrodes along the shaft.

Policy issues in interconnecting networks

NASA Technical Reports Server (NTRS)

Leiner, Barry M.

1989-01-01

To support the activities of the Federal Research Coordinating Committee (FRICC) in creating an interconnected set of networks to serve the research community, two workshops were held to address the technical support of policy issues that arise when interconnecting such networks. The workshops addressed the required and feasible technologies and architectures that could be used to satisfy the desired policies for interconnection. The results of the workshop are documented.

Chip-package nano-structured copper and nickel interconnections with metallic and polymeric bonding interfaces

NASA Astrophysics Data System (ADS)

Aggarwal, Ankur

With the semiconductor industry racing toward a historic transition, nano chips with less than 45 nm features demand I/Os in excess of 20,000 that support computing speed in terabits per second, with multi-core processors aggregately providing highest bandwidth at lowest power. On the other hand, emerging mixed signal systems are driving the need for 3D packaging with embedded active components and ultra-short interconnections. Decreasing I/O pitch together with low cost, high electrical performance and high reliability are the key technological challenges identified by the 2005 International Technology Roadmap for Semiconductors (ITRS). Being able to provide several fold increase in the chip-to-package vertical interconnect density is essential for garnering the true benefits of nanotechnology that will utilize nano-scale devices. Electrical interconnections are multi-functional materials that must also be able to withstand complex, sustained and cyclic thermo-mechanical loads. In addition, the materials must be environmentally-friendly, corrosion resistant, thermally stable over a long time, and resistant to electro-migration. A major challenge is also to develop economic processes that can be integrated into back end of the wafer foundry, i.e. with wafer level packaging. Device-to-system board interconnections are typically accomplished today with either wire bonding or solders. Both of these are incremental and run into either electrical or mechanical barriers as they are extended to higher density of interconnections. Downscaling traditional solder bump interconnect will not satisfy the thermo-mechanical reliability requirements at very fine pitches of the order of 30 microns and less. Alternate interconnection approaches such as compliant interconnects typically require lengthy connections and are therefore limited in terms of electrical properties, although expected to meet the mechanical requirements. A novel chip-package interconnection technology is developed to address the IC packaging requirements beyond the ITRS projections and to introduce innovative design and fabrication concepts that will further advance the performance of the chip, the package, and the system board. The nano-structured interconnect technology simultaneously packages all the ICs intact in wafer form with quantum jump in the number of interconnections with the lowest electrical parasitics. The intrinsic properties of nano materials also enable several orders of magnitude higher interconnect densities with the best mechanical properties for the highest reliability and yet provide higher current and heat transfer densities. Nano-structured interconnects provides the ability to assemble the packaged parts on the system board without the use of underfill materials and to enable advanced analog/digital testing, reliability testing, and burn-in at wafer level. This thesis investigates the electrical and mechanical performance of nanostructured interconnections through modeling and test vehicle fabrication. The analytical models evaluate the performance improvements over solder and compliant interconnections. Test vehicles with nano-interconnections were fabricated using low cost electro-deposition techniques and assembled with various bonding interfaces. Interconnections were fabricated at 200 micron pitch to compare with the existing solder joints and at 50 micron pitch to demonstrate fabrication processes at fine pitches. Experimental and modeling results show that the proposed nano-interconnections could enhance the reliability and potentially meet all the system performance requirements for the emerging micro/nano-systems.

Stretchable biocompatible electronics by embedding electrical circuitry in biocompatible elastomers.

PubMed

Jahanshahi, Amir; Salvo, Pietro; Vanfleteren, Jan

2012-01-01

Stretchable and curvilinear electronics has been used recently for the fabrication of micro systems interacting with the human body. The applications range from different kinds of implantable sensors inside the body to conformable electrodes and artificial skins. One of the key parameters in biocompatible stretchable electronics is the fabrication of reliable electrical interconnects. Although very recent literature has reported on the reliability of stretchable interconnects by cyclic loading, work still needs to be done on the integration of electrical circuitry composed of rigid components and stretchable interconnects in a biological environment. In this work, the feasibility of a developed technology to fabricate simple electrical circuits with meander shaped stretchable interconnects is presented. Stretchable interconnects are 200 nm thin Au layer supported with polyimide (PI). A stretchable array of light emitting diodes (LEDs) is embedded in biocompatible elastomer using this technology platform and it features a 50% total elongation.

Final Technical Report for Automated Manufacturing of Innovative CPV/PV Modules

DOE Office of Scientific and Technical Information (OSTI.GOV)

Okawa, David

Cogenra’s Dense Cell Interconnect system was designed to use traditional front-contact cells and string them together into high efficiency and high reliability “supercells”. This novel stringer allows one to take advantage of the ~100 GW/year of existing cell production capacity and create a solar product for the customer that will produce more power and last longer than traditional PV products. The goal for this program was for Cogenra Solar to design and develop a first-of-kind automated solar manufacturing line that produces strings of overlapping cells or “supercells” based on Cogenra’s Dense Cell Interconnect (DCI) technology for their Low Concentration Photovoltaicmore » (LCPV) systems. This will enable the commercialization of DCI technology to improve the efficiency, reliability and economics for their Low Concentration Photovoltaic systems. In this program, Cogenra Solar very successfully designed, developed, built, installed, and started up the ground-breaking manufacturing tools required to assemble supercells. Cogenra then successfully demonstrated operation of the integrated line at high yield and throughput far exceeding expectations. The development of a supercell production line represents a critical step toward a high volume and low cost Low Concentration Photovoltaic Module with Dense Cell Interconnect technology and has enabled the evaluation of the technology for reliability and yield. Unfortunately, performance and cost headwinds on Low Concentration Photovoltaics systems including lack of diffuse capture (10-15% hit) and more expensive tracker requirements resulted in a move away from LCPV technology. Fortunately, the versatility of Dense Cell Interconnect technology allows for application to flat plate module technology as well and Cogenra has worked with the DOE to utilize the learning from this grant to commercialize DCI technology for the solar market through the on-going grant: Catalyzing PV Manufacturing in the US With Cogenra Solar’s Next-Generation Dense Cell Interconnect PV Module Manufacturing Technology. This program is now very successfully building off of this work and commercializing the technology to enable increased solar adoption.« less

Microcoil Spring Interconnects for Ceramic Grid Array Integrated Circuits

NASA Technical Reports Server (NTRS)

Strickland, S. M.; Hester, J. D.; Gowan, A. K.; Montgomery, R. K.; Geist, D. L.; Blanche, J. F.; McGuire, G. D.; Nash, T. S.

2011-01-01

As integrated circuit miniaturization trends continue, they drive the need for smaller higher input/output (I/O) packages. Hermetically sealed ceramic area array parts are the package of choice by the space community for high reliability space flight electronic hardware. Unfortunately, the coefficient of thermal expansion mismatch between the ceramic area array package and the epoxy glass printed wiring board limits the life of the interconnecting solder joint. This work presents the results of an investigation by Marshall Space Flight Center into a method to increase the life of this second level interconnection by the use of compliant microcoil springs. The design of the spring and its attachment process are presented along with thermal cycling results of microcoil springs (MCS) compared with state-of-the-art ball and column interconnections. Vibration testing has been conducted on MCS and high lead column parts. Radio frequency simulation and measurements have been made and the MCS has been modeled and a stress analysis performed. Thermal cycling and vibration testing have shown MCS interconnects to be significantly more reliable than solder columns. Also, MCS interconnects are less prone to handling damage than solder columns. Future work that includes shock testing, incorporation into a digital signal processor board, and process evaluation of expansion from a 400 I/O device to a device with over 1,100 I/O is identified.

Biomimetics in Tribology

NASA Astrophysics Data System (ADS)

Gebeshuber, I. C.; Majlis, B. Y.; Stachelberger, H.

Science currently goes through a major change. Biology is evolving as new Leitwissenschaft, with more and more causation and natural laws being uncovered. The term `technoscience' denotes the field where science and technology are inseparably interconnected, the trend goes from papers to patents, and the scientific `search for truth' is increasingly replaced by search for applications with a potential economic value. Biomimetics, i.e. knowledge transfer from biology to technology, is a field that has the potential to drive major technical advances. The biomimetic approach might change the research landscape and the engineering culture dramatically, by the blending of disciplines. It might substantially support successful mastering of current tribological challenges: friction, adhesion, lubrication and wear in devices and systems from the meter to the nanometer scale. A highly successful method in biomimectics, the biomimicry innovation method, is applied in this chapter to identify nature's best practices regarding two key issues in tribology: maintenance of the physical integrity of a system, and permanent as well as temporary attachment. The best practices identified comprise highly diverse organisms and processes and are presented in a number of tables with detailed references.

Critical Understanding of U.S. Youths' Citizenship: Community Belonging and Engagement of "Successful Citizens"

ERIC Educational Resources Information Center

Josic, Jasmina

2011-01-01

As today's youth is growing up in societies made more complicated by globalization, the argument grows for expanding the discussion about citizenship education. In increasingly multicultural and interconnected societies, young people are developing new civic attitudes as well as "attachments and identifications" as citizens within three…

78 FR 52710 - Extension of Lines, Interconnection, Numbering, Payphone Compensation, Pole Attachment Complaint...

Federal Register 2010, 2011, 2012, 2013, 2014

2013-08-26

... FEDERAL COMMUNICATIONS COMMISSION 47 CFR Parts 1, 51, 52, 53, 63, and 64 [FCC 96-79; FCC 96-489... Communications Commission. ACTION: Final rule; announcement of effective date. SUMMARY: This document announces..., Federal Communications Commission, Room 5-C458, 445 12th Street SW., Washington, DC 20554. Please include...

Micro-fluidic interconnect

DOEpatents

Okandan, Murat [Albuquerque, NM; Galambos, Paul C [Albuquerque, NM; Benavides, Gilbert L [Los Ranchos, NM; Hetherington, Dale L [Albuquerque, NM

2006-02-28

An apparatus for simultaneously aligning and interconnecting microfluidic ports is presented. Such interconnections are required to utilize microfluidic devices fabricated in Micro-Electromechanical-Systems (MEMS) technologies, that have multiple fluidic access ports (e.g. 100 micron diameter) within a small footprint, (e.g. 3 mm.times.6 mm). Fanout of the small ports of a microfluidic device to a larger diameter (e.g. 500 microns) facilitates packaging and interconnection of the microfluidic device to printed wiring boards, electronics packages, fluidic manifolds etc.

Flexible organic tandem solar modules: a story of up-scaling

NASA Astrophysics Data System (ADS)

Spyropoulos, George D.; Kubis, Peter; Li, Ning; Lucera, Luca; Salvador, Michael; Baran, Derya; Machui, Florian; Ameri, Tayebeh; Voigt, Monika M.; Brabec, Christoph J.

2014-10-01

The competition in the field of solar energy between Organic Photovoltaics (OPVs) and several Inorganic Photovoltaic technologies is continuously increasing to reach the ultimate purpose of energy supply from inexpensive and easily manufactured solar cell units. Solution-processed printing techniques on flexible substrates attach a tremendous opportunity to the OPVs for the accomplishment of low-cost and large area applications. Furthermore, tandem architectures came to boost up even more OPVs by increasing the photon-harvesting properties of the device. In this work, we demonstrate the road of realizing flexible organic tandem solar modules constructed by a fully roll-to-roll compatible processing. The modules exhibit an efficiency of 5.4% with geometrical fill factors beyond 80% and minimized interconnection-resistance losses. The processing involves low temperature (<70 °C), coating methods compatible with slot die coating and high speed and precision laser patterning.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Fu, Jiajia; Zhao, Lixia, E-mail: lxzhao@semi.ac.cn, E-mail: jmli@semi.ac.cn; Cao, Haicheng

The degradation behaviors of high power GaN-based vertical blue LEDs on Si substrates were measured using in-situ accelerated life test. The results show that the dominant failure mechanism would be different during the operation. Besides that, the corresponding associated failure mechanisms were investigated systematically by using different analysis technologies, such as Scan Electron Microscopy, Reflectivity spectroscopy, Transient Thermal Analysis, Raman Spectra, etc. It is shown that initially, the failure modes were mainly originated from the semiconductor die and interconnect, while afterwards, the following serious deterioration of the radiant fluxes was attributed to the package. The interface material and quality, suchmore » as die attach and frame, play an important role in determining the thermal performance and reliability. In addition, the heating effect during the operation will also release the compressive strain in the chip. These findings will help to improve the reliability of GaN-based LEDs, especially for the LEDs with vertical structure.« less

Design of 3D scaffolds for tissue engineering testing a tough polylactide-based graft copolymer.

PubMed

Dorati, R; Colonna, C; Tomasi, C; Genta, I; Bruni, G; Conti, B

2014-01-01

The aim of this research was to investigate a tough polymer to develop 3D scaffolds and 2D films for tissue engineering applications, in particular to repair urethral strictures or defects. The polymer tested was a graft copolymer of polylactic acid (PLA) synthesized with the rationale to improve the toughness of the related PLA homopolymer. The LMP-3055 graft copolymer (in bulk) demonstrated to have negligible cytotoxicity (bioavailability >85%, MTT test). Moreover, the LMP-3055 sterilized through gamma rays resulted to be cytocompatible and non-toxic, and it has a positive effect on cell biofunctionality, promoting the cell growth. 3D scaffolds and 2D film were prepared using different LMP-3055 polymer concentrations (7.5, 10, 12.5 and 15%, w/v), and the effect of polymer concentration on pore size, porosity and interconnectivity of the 3D scaffolds and 2D film was investigated. 3D scaffolds got better results for fulfilling structural and biofunctional requirements: porosity, pore size and interconnectivity, cell attachment and proliferation. 3D scaffolds obtained with 10 and 12.5% polymer solutions (3D-2 and 3D-3, respectively) were identified as the most suitable construct for the cell attachment and proliferation presenting pore size ranged between 100 and 400μm, high porosity (77-78%) and well interconnected pores. In vitro cell studies demonstrated that all the selected scaffolds were able to support the cell proliferation, the cell attachment and growth resulting to their dependency on the polymer concentration and structural features. The degradation test revealed that the degradation of polymer matrix (ΔMw) and water uptake of 3D scaffolds exceed those of 2D film and raw polymer (used as control reference), while the mass loss of samples (3D scaffold and 2D film) resulted to be controlled, they showed good stability and capacity to maintain the physical integrity during the incubation time. © 2013.

Rapid thermal cycling of new technology solar array blanket coupons

NASA Technical Reports Server (NTRS)

Scheiman, David A.; Smith, Bryan K.; Kurland, Richard M.; Mesch, Hans G.

1990-01-01

NASA Lewis Research Center is conducting thermal cycle testing of a new solar array blanket technologies. These technologies include test coupons for Space Station Freedom (SSF) and the advanced photovoltaic solar array (APSA). The objective of this testing is to demonstrate the durability or operational lifetime of the solar array interconnect design and blanket technology within a low earth orbit (LEO) or geosynchronous earth orbit (GEO) thermal cycling environment. Both the SSF and the APSA array survived all rapid thermal cycling with little or no degradation in peak performance. This testing includes an equivalent of 15 years in LEO for SSF test coupons and 30 years of GEO plus ten years of LEO for the APSA test coupon. It is concluded that both the parallel gap welding of the SSF interconnects and the soldering of the APSA interconnects are adequately designed to handle the thermal stresses of space environment temperature extremes.

Embedded optical interconnect technology in data storage systems

NASA Astrophysics Data System (ADS)

Pitwon, Richard C. A.; Hopkins, Ken; Milward, Dave; Muggeridge, Malcolm

2010-05-01

As both data storage interconnect speeds increase and form factors in hard disk drive technologies continue to shrink, the density of printed channels on the storage array midplane goes up. The dominant interconnect protocol on storage array midplanes is expected to increase to 12 Gb/s by 2012 thereby exacerbating the performance bottleneck in future digital data storage systems. The design challenges inherent to modern data storage systems are discussed and an embedded optical infrastructure proposed to mitigate this bottleneck. The proposed solution is based on the deployment of an electro-optical printed circuit board and active interconnect technology. The connection architecture adopted would allow for electronic line cards with active optical edge connectors to be plugged into and unplugged from a passive electro-optical midplane with embedded polymeric waveguides. A demonstration platform has been developed to assess the viability of embedded electro-optical midplane technology in dense data storage systems and successfully demonstrated at 10.3 Gb/s. Active connectors incorporate optical transceiver interfaces operating at 850 nm and are connected in an in-plane coupling configuration to the embedded waveguides in the midplane. In addition a novel method of passively aligning and assembling passive optical devices to embedded polymer waveguide arrays has also been demonstrated.

Fabric-based active electrode design and fabrication for health monitoring clothing.

PubMed

Merritt, Carey R; Nagle, H Troy; Grant, Edward

2009-03-01

In this paper, two versions of fabric-based active electrodes are presented to provide a wearable solution for ECG monitoring clothing. The first version of active electrode involved direct attachment of surface-mountable components to a textile screen-printed circuit using polymer thick film techniques. The second version involved attaching a much smaller, thinner, and less obtrusive interposer containing the active electrode circuitry to a simplified textile circuit. These designs explored techniques for electronic textile interconnection, chip attachment to textiles, and packaging of circuits on textiles for durability. The results from ECG tests indicate that the performance of each active electrode is comparable to commercial Ag/AgCl electrodes. The interposer-based active electrodes survived a five-cycle washing test while maintaining good signal integrity.

Multiband Radio Frequency Interconnect (MRFI) Technology For Next Generation Mobile/Airborne Computing Systems

DTIC Science & Technology

2017-02-01

enable high scalability and reconfigurability for inter-CPU/Memory communications with an increased number of communication channels in frequency ...interconnect technology (MRFI) to enable high scalability and re-configurability for inter-CPU/Memory communications with an increased number of communication ...testing in the University of California, Los Angeles (UCLA) Center for High Frequency Electronics, and Dr. Afshin Momtaz at Broadcom Corporation for

A Comprehensive Surface Mount Technology Solution for Integrated Circuits onto Flexible Screen Printed Electrical Interconnects

DTIC Science & Technology

2014-05-19

their acceptable thermal stability, Polyimides have established as a conventional substrate material for flexible interconnects, which can be...of the silver flake ink for the screen-printed interconnects, the assembled unit fulfills biocompatibility requirements in a limited manner ([29...30]). Even though biocompatibility of substrate [31] is fulfilled, toxicity of the insulating mask [32] and encapsulation need to be considered

Synthetic scaffolds with full pore interconnectivity for bone regeneration prepared by supercritical foaming using advanced biofunctional plasticizers.

PubMed

Salerno, Aurelio; Diéguez, Sara; Diaz-Gomez, Luis; Gómez-Amoza, José L; Magariños, Beatriz; Concheiro, Angel; Domingo, Concepción; Alvarez-Lorenzo, Carmen; García-González, Carlos A

2017-06-30

Supercritical foaming allows for the solvent-free processing of synthetic scaffolds for bone regeneration. However, the control on the pore interconnectivity and throat pore size with this technique still needs to be improved. The use of plasticizers may help overcome these limitations. Eugenol, a GRAS natural compound extracted from plants, is proposed in this work as an advanced plasticizer with bioactive properties. Eugenol-containing poly(ε-caprolactone) (PCL) scaffolds were obtained by supercritical foaming (20.0 MPa, 45 °C, 17 h) followed by a one or a two-step depressurization profile. The effects of the eugenol content and the depressurization profile on the porous structure of the material and the physicochemical properties of the scaffold were evaluated. The combination of both processing parameters was successful to simultaneously tune the pore interconnectivity and throat sizes to allow mesenchymal stem cells infiltration. Scaffolds with eugenol were cytocompatible, presented antimicrobial activity preventing the attachment of Gram positive (S. aureus, S. epidermidis) bacteria and showed good tissue integration.

Compact holographic optical neural network system for real-time pattern recognition

NASA Astrophysics Data System (ADS)

Lu, Taiwei; Mintzer, David T.; Kostrzewski, Andrew A.; Lin, Freddie S.

1996-08-01

One of the important characteristics of artificial neural networks is their capability for massive interconnection and parallel processing. Recently, specialized electronic neural network processors and VLSI neural chips have been introduced in the commercial market. The number of parallel channels they can handle is limited because of the limited parallel interconnections that can be implemented with 1D electronic wires. High-resolution pattern recognition problems can require a large number of neurons for parallel processing of an image. This paper describes a holographic optical neural network (HONN) that is based on high- resolution volume holographic materials and is capable of performing massive 3D parallel interconnection of tens of thousands of neurons. A HONN with more than 16,000 neurons packaged in an attache case has been developed. Rotation- shift-scale-invariant pattern recognition operations have been demonstrated with this system. System parameters such as the signal-to-noise ratio, dynamic range, and processing speed are discussed.

Robot Would Reconfigure Modular Equipment

NASA Technical Reports Server (NTRS)

Purves, Lloyd R.

1993-01-01

Special-purpose sets of equipment, packaged in identical modules with identical interconnecting mechanisms, attached to or detached from each other by specially designed robot, according to proposal. Two-arm walking robot connects and disconnects modules, operating either autonomously or under remote supervision. Robot walks along row of connected modules by grasping successive attachment subassemblies in hand-over-hand motion. Intended application for facility or station in outer space; robot reconfiguration scheme makes it unnecessary for astronauts to venture outside spacecraft or space station. Concept proves useful on Earth in assembly, disassembly, or reconfiguration of equipment in such hostile environments as underwater, near active volcanoes, or in industrial process streams.

Challenges in the implementation of dense wavelength division multiplexed (DWDM) optical interconnects using resonant silicon photonics (invited)

DOE PAGES

Lentine, Anthony L.; DeRose, Christopher T.

2016-02-12

In this study, small silicon photonics micro-resonator modulators and filters hold the promise for multi-terabit per-second interconnects at energy consumptions well below 1 pJ/bit. To date, no products exist and little known commercial development is occurring using this technology. Why? In this talk, we review the many challenges that remain to be overcome in bringing this technology from the research labs to the field where they can overcome important commercial, industrial, and national security limitations of existing photonic technologies.

SCSI Communication Test Bus

NASA Technical Reports Server (NTRS)

Hua, Chanh V.; D'Ambrose, John J.; Jaworski, Richard C.; Halula, Elaine M.; Thornton, David N.; Heligman, Robert L.; Turner, Michael R.

1990-01-01

Small Computer System Interface (SCSI) communication test bus provides high-data-rate, standard interconnection enabling communication among International Business Machines (IBM) Personal System/2 Micro Channel, other devices connected to Micro Channel, test equipment, and host computer. Serves primarily as nonintrusive input/output attachment to PS/2 Micro Channel bus, providing rapid communication for debugger. Opens up possibility of using debugger in real-time applications.

Backplane photonic interconnect modules with optical jumpers

NASA Astrophysics Data System (ADS)

Glebov, Alexei L.; Lee, Michael G.; Yokouchi, Kishio

2005-03-01

Prototypes of optical interconnect (OI) modules for backplane applications are presented. The transceivers attached to the linecards E/O convert the signals that are passed to and from the backplane by optical jumpers terminated with MTP-type connectors. The connectors plug into adaptors attached to the backplane and the microlens arrays mounted in the adaptors couple the light between the fibers and waveguides. Planar polymer channel waveguides with 30-50 μm cross-sections route the optical signals across the board with propagation losses as low as 0.05 dB/cm @ 850 nm. The 45¦-tapered integrated micromirrors reflect the light in and out of the waveguide plane with the loss of 0.8 dB per mirror. The connector displacement measurements indicate that the adaptor lateral assembly accuracy can be at least +/-10 μm for the excess loss not exceeding 1 dB. Insertion losses of the test modules with integrated waveguides, 45¦ mirrors, and pluggable optical jumper connectors are about 5 dB. Eye diagrams at 10.7 Gb/s have typical width and height of 70 ps and 400 mV, respectively, and jitter of about 20 ps.

Its ovr b/n u n me: technology use, attachment styles, and gender roles in relationship dissolution.

PubMed

Weisskirch, Robert S; Delevi, Raquel

2012-09-01

Relationship dissolution now occurs through technologies like text messaging, e-mail, and social networking sites (SNS). Individuals who experience relationship dissolution via technology may differ in their attachment pattern and gender role attitudes from those who have not had that experience. One hundred five college students (males=21 and females=84) completed an online questionnaire about technology-mediated breakups, attachment style, and gender role attitudes. More than a quarter of the sample had experienced relationship dissolution via technology. Attachment anxiety predicted those subject to technology-mediated breakups. Attachment avoidance and less traditional gender roles were associated with increased likelihood of technology use in relationship dissolution. Implications are discussed in regards to future research and practice.

Standard Hardware Acquisition and Reliability Program's (SHARP's) efforts in incorporating fiber optic interconnects into standard electronic module (SEM) connectors

NASA Astrophysics Data System (ADS)

Riggs, William R.

1994-05-01

SHARP is a Navy wide logistics technology development effort aimed at reducing the acquisition costs, support costs, and risks of military electronic weapon systems while increasing the performance capability, reliability, maintainability, and readiness of these systems. Lower life cycle costs for electronic hardware are achieved through technology transition, standardization, and reliability enhancement to improve system affordability and availability as well as enhancing fleet modernization. Advanced technology is transferred into the fleet through hardware specifications for weapon system building blocks of standard electronic modules, standard power systems, and standard electronic systems. The product lines are all defined with respect to their size, weight, I/O, environmental performance, and operational performance. This method of defining the standard is very conducive to inserting new technologies into systems using the standard hardware. This is the approach taken thus far in inserting photonic technologies into SHARP hardware. All of the efforts have been related to module packaging; i.e. interconnects, component packaging, and module developments. Fiber optic interconnects are discussed in this paper.

Analysis of the influencing factors of global energy interconnection development

NASA Astrophysics Data System (ADS)

Zhang, Yi; He, Yongxiu; Ge, Sifan; Liu, Lin

2018-04-01

Under the background of building global energy interconnection and achieving green and low-carbon development, this paper grasps a new round of energy restructuring and the trend of energy technology change, based on the present situation of global and China's global energy interconnection development, established the index system of the impact of global energy interconnection development factors. A subjective and objective weight analysis of the factors affecting the development of the global energy interconnection was conducted separately by network level analysis and entropy method, and the weights are summed up by the method of additive integration, which gives the comprehensive weight of the influencing factors and the ranking of their influence.

Stretchable multilayer self-aligned interconnects fabricated using excimer laser photoablation and in situ masking

NASA Astrophysics Data System (ADS)

Lin, Kevin L.; Jain, Kanti

2009-02-01

Stretchable interconnects are essential to large-area flexible circuits and large-area sensor array systems, and they play an important role towards the realization of the realm of systems which include wearable electronics, sensor arrays for structural health monitoring, and sensor skins for tactile feedback. These interconnects must be reliable and robust for viability, and must be flexible, stretchable, and conformable to non-planar surfaces. This research describes the design, modeling, fabrication, and testing of stretchable interconnects on polymer substrates using metal patterns both as functional interconnect layers and as in-situ masks for excimer laser photoablation. Excimer laser photoablation is often used for patterning of polymers and thin-film metals. The fluences for photoablation of polymers are generally much lower than the threshold fluence for removal or damage of high-thermallyconductive metals; thus, metal thin films can be used as in-situ masks for polymers if the proper fluence is used. Selfaligned single-layer and multi-layer interconnects of various designs (rectilinear and 'meandering') have been fabricated, and certain 'meandering' interconnect designs can be stretched up to 50% uniaxially while maintaining good electrical conductivity and structural integrity. These results are compared with Finite Element Analysis (FEA) models and are observed to be in good accordance with them. This fabrication approach eliminates masks and microfabrication processing steps as compared to traditional fabrication approaches; furthermore, this technology is scalable for large-area sensor arrays and electronic circuits, adaptable for a variety of materials and interconnects designs, and compatible with MEMS-based capacitive sensor technology.

NASA 2009 Body of Knowledge (BoK) Through-Slicon Via Technology

NASA Technical Reports Server (NTRS)

Gerke, David

2009-01-01

Through-silicon via (TSV) is the latest in a progression of technologies for stacking silicon devices in three dimensions (3D). Driven by the need for improved performance, methods to use short vertical interconnects to replace the long interconnects found in 2D structures have been developed. The industry is moving past the feasibility (research and development [R and D]) phase for TSV technology into the commercialization phase where economic realities will determine which technologies are adopted. Low-cost fine via hole formation and highly reliable via filling technologies have been demonstrated; process equipment and materials are available. Even though design, thermal, and test issues remain, much progress has been made.

Sense and nonsense of logic-level optical interconnect: reflections on an experiment

NASA Astrophysics Data System (ADS)

Van Campenhout, Jan M.; Brunfaut, Marnik; Meeus, Wim; Dambre, Joni; De Wilde, Michiel

2001-12-01

Centimeter-range high-density optical interconnect between chips is coming into reach with current optical interconnect technology. Many theoretical studies have identified several good reasons why to use such types of interconnect as a replacement of various layers of the traditional electronic interconnect hierarchy. However, the true feasibility and usefulness of optical interconnects can only be established by actually building and evaluating them in a real system setting. This contribution reports on our experience in using short-range high-density optical inter-chip interconnects. It is based on the design and construction of a fully functional optoelectronic demonstrator system. We discuss the rationale for building the demonstrator in the first place, the implications of using many low-level optical interconnections in electronic systems, and the degree to which our expectations have been fulfilled by the demonstrator. The detailed description of the architecture, design and implementation of the demonstrator is not presented here, but can be found elsewhere in this issue.

Silicon photonics devices for metro applications

NASA Astrophysics Data System (ADS)

Fukuda, H.; Kikuchi, K.; Jizodo, M.; Kawamura, Y.; Takeda, K.; Honda, K.

2017-01-01

Digital coherent technology is considered an attractive way of realizing both high-speed metro links and long distance transmissions. In metro areas, there is a strong demand for a smaller, faster transceiver module. This demand is mainly driven by the rapidly increasing data center interconnection traffic, where transmission capacity per faceplane is a key feature. Therefore, optical integration technology is desired. Since compensation in digital coherent technology is performed in the electrical or digital domain, users can deal with those optics performances that are not compensated for digitally. This means using a new material that cannot provide perfect characteristics but that is suitable for miniaturization and integration is possible. Silicon photonics (SiPh) is considered an attractive technology that would enable the significant miniaturization of optical circuits and be capable of optical integration with high manufacturability. While SiPh-based devices have begun to be deployed for very short or short reach links on the basis of direct detection technology, their digital coherent applications have recently been investigated in view of their integration capability. This paper describes recent progress on SiPh-based integrated optical devices for high-speed digital coherent transceivers targeting metro links. An optical modulator and receiver with related circuits have been integrated into a single SiPh chip. TEC-free operation under non-hermetic conditions and the direct attachment of optical fibers have both been realized. Very thin and small packaging with sufficient performance has been demonstrated by using the SiPh chip co-packaged with high-speed ICs.

Oxidation Resistant, Cr Retaining, Electrically Conductive Coatings on Metallic Alloys for SOFC Interconnects

DOE Office of Scientific and Technical Information (OSTI.GOV)

Vladimir Gorokhovsky

2008-03-31

This report describes significant results from an on-going, collaborative effort to enable the use of inexpensive metallic alloys as interconnects in planar solid oxide fuel cells (SOFCs) through the use of advanced coating technologies. Arcomac Surface Engineering, LLC, under the leadership of Dr. Vladimir Gorokhovsky, is investigating filtered-arc and filtered-arc plasma-assisted hybrid coating deposition technologies to promote oxidation resistance, eliminate Cr volatility, and stabilize the electrical conductivity of both standard and specialty steel alloys of interest for SOFC metallic interconnect (IC) applications. Arcomac has successfully developed technologies and processes to deposit coatings with excellent adhesion, which have demonstrated a substantialmore » increase in high temperature oxidation resistance, stabilization of low Area Specific Resistance values and significantly decrease Cr volatility. An extensive matrix of deposition processes, coating compositions and architectures was evaluated. Technical performance of coated and uncoated sample coupons during exposures to SOFC interconnect-relevant conditions is discussed, and promising future directions are considered. Cost analyses have been prepared based on assessment of plasma processing parameters, which demonstrate the feasibility of the proposed surface engineering process for SOFC metallic IC applications.« less

Feasibility of optically interconnected parallel processors using wavelength division multiplexing

DOE Office of Scientific and Technical Information (OSTI.GOV)

Deri, R.J.; De Groot, A.J.; Haigh, R.E.

1996-03-01

New national security demands require enhanced computing systems for nearly ab initio simulations of extremely complex systems and analyzing unprecedented quantities of remote sensing data. This computational performance is being sought using parallel processing systems, in which many less powerful processors are ganged together to achieve high aggregate performance. Such systems require increased capability to communicate information between individual processor and memory elements. As it is likely that the limited performance of today`s electronic interconnects will prevent the system from achieving its ultimate performance, there is great interest in using fiber optic technology to improve interconnect communication. However, little informationmore » is available to quantify the requirements on fiber optical hardware technology for this application. Furthermore, we have sought to explore interconnect architectures that use the complete communication richness of the optical domain rather than using optics as a simple replacement for electronic interconnects. These considerations have led us to study the performance of a moderate size parallel processor with optical interconnects using multiple optical wavelengths. We quantify the bandwidth, latency, and concurrency requirements which allow a bus-type interconnect to achieve scalable computing performance using up to 256 nodes, each operating at GFLOP performance. Our key conclusion is that scalable performance, to {approx}150 GFLOPS, is achievable for several scientific codes using an optical bus with a small number of WDM channels (8 to 32), only one WDM channel received per node, and achievable optoelectronic bandwidth and latency requirements. 21 refs. , 10 figs.« less

Helium Ion Secondary Electron Mode Microscopy For Interconnect Material Imaging

NASA Astrophysics Data System (ADS)

Ogawa, Shinichi; Thompson, William; Stern, Lewis; Scipioni, Larry; Notte, John; Farkas, Lou; Barriss, Louise

2010-04-01

The recently developed helium ion microscope (HIM) is now capable of 0.35 nm secondary electron (SE) mode image resolution. When low-k dielectrics or copper interconnects in ultra large scale integrated circuits (ULSI) interconnect structures were imaged in this mode, it was found that unique pattern dimension and fidelity information at sub-nanometer resolution was available for the first time. This paper will discuss the helium ion microscope architecture and the SE imaging techniques that make the HIM observation method of particular value to the low-k dielectric and dual damascene copper interconnect technologies.

Next-generation optical wireless communications for data centers

NASA Astrophysics Data System (ADS)

Arnon, Shlomi

2015-01-01

Data centers collect and process information with a capacity that has been increasing from year to year at an almost exponential pace. Traditional fiber/cable data center network interconnections suffer from bandwidth overload, as well as flexibility and scalability issues. Therefore, a technology-shift from the fiber and cable to wireless has already been initiated in order to meet the required data-rate, flexibility and scalability demands for next-generation data center network interconnects. In addition, the shift to wireless reduces the volume allocated to the cabling/fiber and increases the cooling efficiency. Optical wireless communication (OWC), or free space optics (FSO), is one of the most effective wireless technologies that could be used in future data centers and could provide ultra-high capacity, very high cyber security and minimum latency, due to the low index of refraction of air in comparison to fiber technologies. In this paper we review the main concepts and configurations for next generation OWC for data centers. Two families of technologies are reviewed: the first technology regards interconnects between rack units in the same rack and the second technology regards the data center network that connects the server top of rack (TOR) to the switch. A comparison between different network technologies is presented.

High-speed and low-power repeater for VLSI interconnects

NASA Astrophysics Data System (ADS)

Karthikeyan, A.; Mallick, P. S.

2017-10-01

This paper proposes a repeater for boosting the speed of interconnects with low power dissipation. We have designed and implemented at 45 and 32 nm technology nodes. Delay and power dissipation performances are analyzed for various voltage levels at these technology nodes using Spice simulations. A significant reduction in delay and power dissipation are observed compared to a conventional repeater. The results show that the proposed high-speed low-power repeater has a reduced delay for higher load capacitance. The proposed repeater is also compared with LPTG CMOS repeater, and the results shows that the proposed repeater has reduced delay. The proposed repeater can be suitable for high-speed global interconnects and has the capacity to drive large loads.

Optical interconnection networks for high-performance computing systems

NASA Astrophysics Data System (ADS)

Biberman, Aleksandr; Bergman, Keren

2012-04-01

Enabled by silicon photonic technology, optical interconnection networks have the potential to be a key disruptive technology in computing and communication industries. The enduring pursuit of performance gains in computing, combined with stringent power constraints, has fostered the ever-growing computational parallelism associated with chip multiprocessors, memory systems, high-performance computing systems and data centers. Sustaining these parallelism growths introduces unique challenges for on- and off-chip communications, shifting the focus toward novel and fundamentally different communication approaches. Chip-scale photonic interconnection networks, enabled by high-performance silicon photonic devices, offer unprecedented bandwidth scalability with reduced power consumption. We demonstrate that the silicon photonic platforms have already produced all the high-performance photonic devices required to realize these types of networks. Through extensive empirical characterization in much of our work, we demonstrate such feasibility of waveguides, modulators, switches and photodetectors. We also demonstrate systems that simultaneously combine many functionalities to achieve more complex building blocks. We propose novel silicon photonic devices, subsystems, network topologies and architectures to enable unprecedented performance of these photonic interconnection networks. Furthermore, the advantages of photonic interconnection networks extend far beyond the chip, offering advanced communication environments for memory systems, high-performance computing systems, and data centers.

Integrated Flexible Electronic Devices Based on Passive Alignment for Physiological Measurement

PubMed Central

Ryu, Jin Hwa; Byun, Sangwon; Baek, In-Bok; Lee, Bong Kuk; Jang, Won Ick; Jang, Eun-Hye; Kim, Ah-Yung; Yu, Han Yung

2017-01-01

This study proposes a simple method of fabricating flexible electronic devices using a metal template for passive alignment between chip components and an interconnect layer, which enabled efficient alignment with high accuracy. An electrocardiogram (ECG) sensor was fabricated using 20 µm thick polyimide (PI) film as a flexible substrate to demonstrate the feasibility of the proposed method. The interconnect layer was fabricated by a two-step photolithography process and evaporation. After applying solder paste, the metal template was placed on top of the interconnect layer. The metal template had rectangular holes at the same position as the chip components on the interconnect layer. Rectangular hole sizes were designed to account for alignment tolerance of the chips. Passive alignment was performed by simply inserting the components in the holes of the template, which resulted in accurate alignment with positional tolerance of less than 10 µm based on the structural design, suggesting that our method can efficiently perform chip mounting with precision. Furthermore, a fabricated flexible ECG sensor was easily attachable to the curved skin surface and able to measure ECG signals from a human subject. These results suggest that the proposed method can be used to fabricate epidermal sensors, which are mounted on the skin to measure various physiological signals. PMID:28420219

WDM mid-board optics for chip-to-chip wavelength routing interconnects in the H2020 ICT-STREAMS

NASA Astrophysics Data System (ADS)

Kanellos, G. T.; Pleros, N.

2017-02-01

Multi-socket server boards have emerged to increase the processing power density on the board level and further flatten the data center networks beyond leaf-spine architectures. Scaling however the number of processors per board puts current electronic technologies into challenge, as it requires high bandwidth interconnects and high throughput switches with increased number of ports that are currently unavailable. On-board optical interconnection has proved the potential to efficiently satisfy the bandwidth needs, but their use has been limited to parallel links without performing any smart routing functionality. With CWDM optical interconnects already a commodity, cyclical wavelength routing proposed to fit the datacom for rack-to-rack and board-to-board communication now becomes a promising on-board routing platform. ICT-STREAMS is a European research project that aims to combine WDM parallel on-board transceivers with a cyclical AWGR, in order to create a new board-level, chip-to-chip interconnection paradigm that will leverage WDM parallel transmission to a powerful wavelength routing platform capable to interconnect multiple processors with unprecedented bandwidth and throughput capacity. Direct, any-to-any, on-board interconnection of multiple processors will significantly contribute to further flatten the data centers and facilitate east-west communication. In the present communication, we present ICT-STREAMS on-board wavelength routing architecture for multiple chip-to-chip interconnections and evaluate the overall system performance in terms of throughput and latency for several schemes and traffic profiles. We also review recent advances of the ICT-STREAMS platform key-enabling technologies that span from Si in-plane lasers and polymer based electro-optical circuit boards to silicon photonics transceivers and photonic-crystal amplifiers.

Methods for Trustworthy Design of On-Chip Bus Interconnect for General-Purpose Processors

DTIC Science & Technology

2012-03-01

Technology Andrew Huang, was able to test the security properties of HyperTransport bus protocol on an Xbox [20]. In his research, he was able to...TRUSTWORTHY DESIGN OF ON -CHIP BUS INTERCONNECT FOR GENERAL-PURPOSE PROCESSORS by Jay F. Elson March 2012 Thesis Advisor: Ted Huffmire Second...AND DATES COVERED Master’s Thesis 4. TITLE AND SUBTITLE Methods for Trustworthy Design of On -Chip Bus Interconnect for General-Purpose Processors 5

Flexible Chip Scale Package and Interconnect for Implantable MEMS Movable Microelectrodes for the Brain

PubMed Central

Jackson, Nathan; Muthuswamy, Jit

2009-01-01

We report here a novel approach called MEMS microflex interconnect (MMFI) technology for packaging a new generation of Bio-MEMS devices that involve movable microelectrodes implanted in brain tissue. MMFI addresses the need for (i) operating space for movable parts and (ii) flexible interconnects for mechanical isolation. We fabricated a thin polyimide substrate with embedded bond-pads, vias, and conducting traces for the interconnect with a backside dry etch, so that the flexible substrate can act as a thin-film cap for the MEMS package. A double gold stud bump rivet bonding mechanism was used to form electrical connections to the chip and also to provide a spacing of approximately 15–20 µm for the movable parts. The MMFI approach achieved a chip scale package (CSP) that is lightweight, biocompatible, having flexible interconnects, without an underfill. Reliability tests demonstrated minimal increases of 0.35 mΩ, 0.23 mΩ and 0.15 mΩ in mean contact resistances under high humidity, thermal cycling, and thermal shock conditions respectively. High temperature tests resulted in an increase in resistance of > 90 mΩ when aluminum bond pads were used, but an increase of ~ 4.2 mΩ with gold bond pads. The mean-time-to-failure (MTTF) was estimated to be at least one year under physiological conditions. We conclude that MMFI technology is a feasible and reliable approach for packaging and interconnecting Bio-MEMS devices. PMID:20160981

DOE Office of Scientific and Technical Information (OSTI.GOV)

Rana Zucchi, Global Energy Concepts, LLC; Brad Reeve, Kotzebue Electric Association; DOE Project Officer - Doug Hooker

The Kotzebue Wind Power Project is a joint undertaking of the U.S. Department of Energy (DOE); Kotzebue Electric Association (KEA); and the Alaska Energy Authority (AEA). The goal of the project is to develop, construct, and operate a wind power plant interconnected to a small isolated utility grid in an arctic climate in Northwest Alaska. The primary objective of KEA’s wind energy program is to bring more affordable electricity and jobs to remote Alaskan communities. DOE funding has allowed KEA to develop a multi-faceted approach to meet these objectives that includes wind project planning and development, technology transfer, and communitymore » outreach. The first wind turbines were installed in the summer of 1997 and the newest turbines were installed in the spring of 2007. The total installed capacity of the KEA wind power project is 1.16 MW with a total of 17 turbines rated between 65 kW and 100 kW. The operation of the wind power plant has resulted in a wind penetration on the utility system in excess of 35% during periods of low loads. This document and referenced attachments are presented as the final technical report for the U.S. Department of Energy (DOE) grant agreement DE-FG36-97GO10199. Interim deliverables previously submitted are also referenced within this document and where reasonable to do so, specific sections are incorporated in the report or attached as appendices.« less

Regenerating Articular Tissue by Converging Technologies

PubMed Central

Paoluzzi, Luca; Pieper, Jeroen; de Wijn, Joost R.; van Blitterswijk, Clemens A.

2008-01-01

Scaffolds for osteochondral tissue engineering should provide mechanical stability, while offering specific signals for chondral and bone regeneration with a completely interconnected porous network for cell migration, attachment, and proliferation. Composites of polymers and ceramics are often considered to satisfy these requirements. As such methods largely rely on interfacial bonding between the ceramic and polymer phase, they may often compromise the use of the interface as an instrument to direct cell fate. Alternatively, here, we have designed hybrid 3D scaffolds using a novel concept based on biomaterial assembly, thereby omitting the drawbacks of interfacial bonding. Rapid prototyped ceramic particles were integrated into the pores of polymeric 3D fiber-deposited (3DF) matrices and infused with demineralized bone matrix (DBM) to obtain constructs that display the mechanical robustness of ceramics and the flexibility of polymers, mimicking bone tissue properties. Ostechondral scaffolds were then fabricated by directly depositing a 3DF structure optimized for cartilage regeneration adjacent to the bone scaffold. Stem cell seeded scaffolds regenerated both cartilage and bone in vivo. PMID:18716660

Reliability and Qualification of Hardware to Enhance the Mission Assurance of JPL/NASA Projects

NASA Technical Reports Server (NTRS)

Ramesham, Rajeshuni

2010-01-01

Packaging Qualification and Verification (PQV) and life testing of advanced electronic packaging, mechanical assemblies (motors/actuators), and interconnect technologies (flip-chip), platinum temperature thermometer attachment processes, and various other types of hardware for Mars Exploration Rover (MER)/Mars Science Laboratory (MSL), and JUNO flight projects was performed to enhance the mission assurance. The qualification of hardware under extreme cold to hot temperatures was performed with reference to various project requirements. The flight like packages, assemblies, test coupons, and subassemblies were selected for the study to survive three times the total number of expected temperature cycles resulting from all environmental and operational exposures occurring over the life of the flight hardware including all relevant manufacturing, ground operations, and mission phases. Qualification/life testing was performed by subjecting flight-like qualification hardware to the environmental temperature extremes and assessing any structural failures, mechanical failures or degradation in electrical performance due to either overstress or thermal cycle fatigue. Experimental flight qualification test results will be described in this presentation.

Optical Interconnections for VLSI Computational Systems Using Computer-Generated Holography.

NASA Astrophysics Data System (ADS)

Feldman, Michael Robert

Optical interconnects for VLSI computational systems using computer generated holograms are evaluated in theory and experiment. It is shown that by replacing particular electronic connections with free-space optical communication paths, connection of devices on a single chip or wafer and between chips or modules can be improved. Optical and electrical interconnects are compared in terms of power dissipation, communication bandwidth, and connection density. Conditions are determined for which optical interconnects are advantageous. Based on this analysis, it is shown that by applying computer generated holographic optical interconnects to wafer scale fine grain parallel processing systems, dramatic increases in system performance can be expected. Some new interconnection networks, designed to take full advantage of optical interconnect technology, have been developed. Experimental Computer Generated Holograms (CGH's) have been designed, fabricated and subsequently tested in prototype optical interconnected computational systems. Several new CGH encoding methods have been developed to provide efficient high performance CGH's. One CGH was used to decrease the access time of a 1 kilobit CMOS RAM chip. Another was produced to implement the inter-processor communication paths in a shared memory SIMD parallel processor array.

High-Penetration Photovoltaic Planning Methodologies

DOE Office of Scientific and Technical Information (OSTI.GOV)

Gao, David Wenzhong; Muljadi, Eduard; Tian, Tian

The main objective of this report is to provide an overview of select U.S. utility methodologies for performing high-penetration photovoltaic (HPPV) system planning and impact studies. This report covers the Federal Energy Regulatory Commission's orders related to photovoltaic (PV) power system interconnection, particularly the interconnection processes for the Large Generation Interconnection Procedures and Small Generation Interconnection Procedures. In addition, it includes U.S. state interconnection standards and procedures. The procedures used by these regulatory bodies consider the impacts of HPPV power plants on the networks. Technical interconnection requirements for HPPV voltage regulation include aspects of power monitoring, grounding, synchronization, connection tomore » the overall distribution system, back-feeds, disconnecting means, abnormal operating conditions, and power quality. This report provides a summary of mitigation strategies to minimize the impact of HPPV. Recommendations and revisions to the standards may take place as the penetration level of renewables on the grid increases and new technologies develop in future years.« less

Clad metals, roll bonding and their applications for SOFC interconnects

NASA Astrophysics Data System (ADS)

Chen, Lichun; Yang, Zhenguo; Jha, Bijendra; Xia, Guanguang; Stevenson, Jeffry W.

Metallic interconnects have been becoming an increasingly interesting topic in the development in intermediate temperature solid oxide fuel cells (SOFC). High temperature oxidation resistant alloys are currently considered as candidate materials. Among these alloys however, different groups of alloys demonstrate different advantages and disadvantages, and few if any can completely satisfy the stringent requirements for the application. To integrate the advantages and avoid the disadvantages of different groups of alloys, clad metal has been proposed for SOFC interconnect applications and interconnect structures. This paper gives a brief overview of the cladding approach and its applications, and discuss the viability of this technology to fabricate the metallic layered-structure interconnects. To examine the feasibility of this approach, the austenitic Ni-base alloy Haynes 230 and the ferritic stainless steel AL 453 were selected as examples and manufactured into a clad metal. Its suitability as an interconnect construction material was investigated.

Morphological effects of porous poly-d,l-lactic acid/hydroxyapatite scaffolds produced by supercritical CO2 foaming on their mechanical performance.

PubMed

Rouholamin, Davood; van Grunsven, William; Reilly, Gwendolen C; Smith, Patrick J

2016-08-01

A novel supercritical CO2 foaming technique was used to fabricate scaffolds of controllable morphology and mechanical properties, with the potential to tailor the scaffolds to specific tissue engineering applications. Biodegradable scaffolds are widely used as temporary supportive structures for bone regeneration. The scaffolds must provide a sufficient mechanical support while allowing cell attachment and growth as well as metabolic activities. In this study, supercritical CO2 foaming was used to prepare fully interconnected porous scaffolds of poly-d,l-lactic acid and poly-d,l-lactic acid/hydroxyapatite. The morphological, mechanical and cell behaviours of the scaffolds were measured to examine the effect of hydroxyapatite on these properties. These scaffolds showed an average porosity in the range of 86%-95%, an average pore diameter of 229-347 µm and an average pore interconnection of 103-207 µm. The measured porosity, pore diameter, and interconnection size are suitable for cancellous bone regeneration. Compressive strength and modulus of up to 36.03 ± 5.90 and 37.97 ± 6.84 MPa were measured for the produced porous scaffolds of various compositions. The mechanical properties presented an improvement with the addition of hydroxyapatite to the structure. The relationship between morphological and mechanical properties was investigated. The matrices with different compositions were seeded with bone cells, and all the matrices showed a high cell viability and biocompatibility. The number of cells attached on the matrices slightly increased with the addition of hydroxyapatite indicating that hydroxyapatite improves the biocompatibility and proliferation of the scaffolds. The produced poly-d,l-lactic acid/hydroxyapatite scaffolds in this study showed a potential to be used as bone graft substitutes. © IMechE 2016.

Lightweight solar array blanket tooling, laser welding and cover process technology

NASA Technical Reports Server (NTRS)

Dillard, P. A.

1983-01-01

A two phase technology investigation was performed to demonstrate effective methods for integrating 50 micrometer thin solar cells into ultralightweight module designs. During the first phase, innovative tooling was developed which allows lightweight blankets to be fabricated in a manufacturing environment with acceptable yields. During the second phase, the tooling was improved and the feasibility of laser processing of lightweight arrays was confirmed. The development of the cell/interconnect registration tool and interconnect bonding by laser welding is described.

Silicon photonic IC embedded optical-PCB for high-speed interconnect application

NASA Astrophysics Data System (ADS)

Kallega, Rakshitha; Nambiar, Siddharth; Kumar, Abhai; Ranganath, Praveen; Selvaraja, Shankar Kumar

2018-02-01

Optical-Printed Circuit Board (PCB) is an emerging optical interconnect technology to bridge the gap between the board edge and the processing module. The technology so far has been used as a broadband transmitter using polymer waveguides in the PCB. In this paper, we report a Silicon Nitride based photonic IC embedded in the PCB along with the polymers as waveguides in the PCB. The motivation for such integration is to bring routing capability and to reduce the power loss due to broadcasting mode.

29 CFR 1615.103 - Definitions.

Code of Federal Regulations, 2010 CFR

2010-07-01

... COMMISSION AND IN ACCESSIBILITY OF COMMISSION ELECTRONIC AND INFORMATION TECHNOLOGY § 1615.103 Definitions.... Electronic and Information technology. Includes information technology and any equipment or interconnected... information. The term electronic and information technology includes, but is not limited to...

Digital optical interconnects for photonic computing

NASA Astrophysics Data System (ADS)

Guilfoyle, Peter S.; Stone, Richard V.; Zeise, Frederick F.

1994-05-01

A 32-bit digital optical computer (DOC II) has been implemented in hardware utilizing 8,192 free-space optical interconnects. The architecture exploits parallel interconnect technology by implementing microcode at the primitive level. A burst mode of 0.8192 X 1012 binary operations per sec has been reliably demonstrated. The prototype has been successful in demonstrating general purpose computation. In addition to emulating the RISC instruction set within the UNIX operating environment, relational database text search operations have been implemented on DOC II.

NREL: U.S.-China Renewable Energy Partnership Publications

Science.gov Websites

storage or to solar photovoltaic (PV) technology, including higher energy value, ancillary services value Partnership (USCREP) activities. 2017 Comparative Analysis and Considerations for PV Interconnection Standards main objectives of this report are to evaluate China's photovoltaic (PV) interconnection standards and

DOE Office of Scientific and Technical Information (OSTI.GOV)

Coddington, M.; Fox, K.; Stanfield, S.

Federal and state regulators are faced with the challenge of keeping interconnection procedures updated against a backdrop of evolving technology, new codes and standards, and considerably transformed market conditions. This report is intended to educate policymakers and stakeholders on beneficial reforms that will keep interconnection processes efficient and cost-effective while maintaining a safe and reliable power system.

Hybrid Microcircuit Rework Procedures Evaluation.

DTIC Science & Technology

1980-08-01

replacement Task III. Polymer Attachment Rework (a) Die replacement (b) Substrate replacement Task IV. Interconnection Rework (a) Gold and aluminum ...the following conclusions: (a) Lap Shear Strength The shear strength ( aluminum to aluminum ) values ranged from a high of 4000 psi (for Ablefilm 550...bonded specimens ( aluminum to aluminum ) to 150°C for 10, 20 and 35 days prior to testing. No significant degradation of lap shear strength of any of the

National Offshore Wind Energy Grid Interconnection Study

DOE Office of Scientific and Technical Information (OSTI.GOV)

Daniel, John P.; Liu, Shu; Ibanez, Eduardo

2014-07-30

The National Offshore Wind Energy Grid Interconnection Study (NOWEGIS) considers the availability and potential impacts of interconnecting large amounts of offshore wind energy into the transmission system of the lower 48 contiguous United States. A total of 54GW of offshore wind was assumed to be the target for the analyses conducted. A variety of issues are considered including: the anticipated staging of offshore wind; the offshore wind resource availability; offshore wind energy power production profiles; offshore wind variability; present and potential technologies for collection and delivery of offshore wind energy to the onshore grid; potential impacts to existing utility systemsmore » most likely to receive large amounts of offshore wind; and regulatory influences on offshore wind development. The technologies considered the reliability of various high-voltage ac (HVAC) and high-voltage dc (HVDC) technology options and configurations. The utility system impacts of GW-scale integration of offshore wind are considered from an operational steady-state perspective and from a regional and national production cost perspective.« less

A Vision of China-Arab Interconnection Transmission Network Planning with UHVDC Technology

NASA Astrophysics Data System (ADS)

Wu, Dan; Liu, Yujun; Yin, Hongyuan; Xu, Qingshan; Xu, Xiaohui; Ding, Maosheng

2017-05-01

Developments in ultra-high-voltage (UHV) power systems and clean energy technologies are paving the way towards unprecedented energy market globalization. In accordance with the international community’s enthusiasm for building up the Global Energy Internet, this paper focuses on the feasibility of transmitting large-size electricity from northwest China to Arab world through a long-distance transnational power interconnection. The complete investigations on the grids of both the sending-end and receiving-end is firstly presented. Then system configuration of the transmission scheme and corridor route planning is proposed with UHVDC technology. Based on transmission costs’ investigation about similar transmission projects worldwide, the costs of the proposed transmission scheme are estimated through adjustment factors which represent differences in latitude, topography and economy. The proposed China-Arab transmission line sheds light on the prospects of power cooperation and resource sharing between China and Arab states, and appeals for more emphasis on green energy concentrated power interconnections from a global perspective.

Novel Vertical Interconnects With 180 Degree Phase Shift for Amplifiers, Filters, and Integrated Antennas

NASA Technical Reports Server (NTRS)

Goverdhanam, Kavita; Simons, Rainee N.; Katehi, Linda P. B.; Burke, Thomas P. (Technical Monitor)

2001-01-01

In this paper, novel low loss, wide-band coplanar stripline technology for RF/microwave integrated circuits is demonstrated on high resistivity silicon wafer. In particular, the fabrication process for the deposition of spin-on-glass (SOG) as a dielectric layer, the etching of microvias for the vertical interconnects, the design methodology for the multiport circuits and their measured/simulated characteristics are graphically illustrated. The study shows that circuits with very low loss, large bandwidth and compact size are feasible using this technology. This multilayer planar technology has potential to significantly enhance RF/microwave IC performance when combined with semiconductor devices and microelectromechanical systems (MEMS).

Variability in attachment of the coracoacromial ligament in relation with its morphology.

PubMed

Alraddadi, Abdulrahman; Alashkham, Abduelmenem; Lamb, Clare; Soames, Roger

2017-12-01

The coracoacromial ligament (CAL) presents with variable morphology and plays a significant role in the development of subacromial impingement syndrome. Sectioning the CAL has been suggested to relieve impingement of the rotator cuff. The aim of the current study was to investigate the CAL attachment in relation with ligament morphology. The CAL was investigated in 220 cadaveric shoulders from 58 males and 59 females, with a median age of 82 years (range 53-102 years). CALs were classified according to three factors: (1) number of bands present; (2) shape; and (3) attachment to the acromial and coracoid processes. 35 (16%) CALs had a single band, 84 (38%) two bands, and 101 (46%) three or more bands. CAL shape was either broadband (14: 6%), quadrangular (21: 10%), Y-shaped (84: 38%), or multiple-banded (101: 46%). More ligaments were attached to the medial aspect of the acromion (60%) and medial end of the coracoid (75%) than those restricted to the anterior edge of the acromion (40%) and posterior aspect of the coracoid (25%). Multiple-banded ligaments attached significantly more medially at the acromion and coracoid processes, while single band ligament attachments were restricted to the anterior edge of the acromion and posterior aspect of the coracoid process. The CAL has variable morphology and attachments with interconnections to different structures around the shoulder. CALs with a medial acromial attachment may narrow the subacromial space leading to further shoulder impingement.

Monolithically interconnected GaAs solar cells: A new interconnection technology for high voltage solar cell output

NASA Astrophysics Data System (ADS)

Dinetta, L. C.; Hannon, M. H.

1995-10-01

Photovoltaic linear concentrator arrays can benefit from high performance solar cell technologies being developed at AstroPower. Specifically, these are the integration of thin GaAs solar cell and epitaxial lateral overgrowth technologies with the application of monolithically interconnected solar cell (MISC) techniques. This MISC array has several advantages which make it ideal for space concentrator systems. These are high system voltage, reliable low cost monolithically formed interconnections, design flexibility, costs that are independent of array voltage, and low power loss from shorts, opens, and impact damage. This concentrator solar cell will incorporate the benefits of light trapping by growing the device active layers over a low-cost, simple, PECVD deposited silicon/silicon dioxide Bragg reflector. The high voltage-low current output results in minimal 12R losses while properly designing the device allows for minimal shading and resistance losses. It is possible to obtain open circuit voltages as high as 67 volts/cm of solar cell length with existing technology. The projected power density for the high performance device is 5 kW/m for an AMO efficiency of 26% at 1 5X. Concentrator solar cell arrays are necessary to meet the power requirements of specific mission platforms and can supply high voltage power for electric propulsion systems. It is anticipated that the high efficiency, GaAs monolithically interconnected linear concentrator solar cell array will enjoy widespread application for space based solar power needs. Additional applications include remote man-portable or ultra-light unmanned air vehicle (UAV) power supplies where high power per area, high radiation hardness and a high bus voltage or low bus current are important. The monolithic approach has a number of inherent advantages, including reduced cost per interconnect and increased reliability of array connections. There is also a high potential for a large number of consumer products. Dual-use applications can include battery chargers and remote power supplies for consumer electronics products such as portable telephones/beepers, portable radios, CD players, dashboard radar detectors, remote walkway lighting, etc.

Monolithically interconnected GaAs solar cells: A new interconnection technology for high voltage solar cell output

NASA Technical Reports Server (NTRS)

Dinetta, L. C.; Hannon, M. H.

1995-01-01

Photovoltaic linear concentrator arrays can benefit from high performance solar cell technologies being developed at AstroPower. Specifically, these are the integration of thin GaAs solar cell and epitaxial lateral overgrowth technologies with the application of monolithically interconnected solar cell (MISC) techniques. This MISC array has several advantages which make it ideal for space concentrator systems. These are high system voltage, reliable low cost monolithically formed interconnections, design flexibility, costs that are independent of array voltage, and low power loss from shorts, opens, and impact damage. This concentrator solar cell will incorporate the benefits of light trapping by growing the device active layers over a low-cost, simple, PECVD deposited silicon/silicon dioxide Bragg reflector. The high voltage-low current output results in minimal 12R losses while properly designing the device allows for minimal shading and resistance losses. It is possible to obtain open circuit voltages as high as 67 volts/cm of solar cell length with existing technology. The projected power density for the high performance device is 5 kW/m for an AMO efficiency of 26% at 1 5X. Concentrator solar cell arrays are necessary to meet the power requirements of specific mission platforms and can supply high voltage power for electric propulsion systems. It is anticipated that the high efficiency, GaAs monolithically interconnected linear concentrator solar cell array will enjoy widespread application for space based solar power needs. Additional applications include remote man-portable or ultra-light unmanned air vehicle (UAV) power supplies where high power per area, high radiation hardness and a high bus voltage or low bus current are important. The monolithic approach has a number of inherent advantages, including reduced cost per interconnect and increased reliability of array connections. There is also a high potential for a large number of consumer products. Dual-use applications can include battery chargers and remote power supplies for consumer electronics products such as portable telephones/beepers, portable radios, CD players, dashboard radar detectors, remote walkway lighting, etc.

Flexible Chip Scale Package and Interconnect for Implantable MEMS Movable Microelectrodes for the Brain.

PubMed

Jackson, Nathan; Muthuswamy, Jit

2009-04-01

We report here a novel approach called MEMS microflex interconnect (MMFI) technology for packaging a new generation of Bio-MEMS devices that involve movable microelectrodes implanted in brain tissue. MMFI addresses the need for (i) operating space for movable parts and (ii) flexible interconnects for mechanical isolation. We fabricated a thin polyimide substrate with embedded bond-pads, vias, and conducting traces for the interconnect with a backside dry etch, so that the flexible substrate can act as a thin-film cap for the MEMS package. A double gold stud bump rivet bonding mechanism was used to form electrical connections to the chip and also to provide a spacing of approximately 15-20 µm for the movable parts. The MMFI approach achieved a chip scale package (CSP) that is lightweight, biocompatible, having flexible interconnects, without an underfill. Reliability tests demonstrated minimal increases of 0.35 mΩ, 0.23 mΩ and 0.15 mΩ in mean contact resistances under high humidity, thermal cycling, and thermal shock conditions respectively. High temperature tests resulted in an increase in resistance of > 90 mΩ when aluminum bond pads were used, but an increase of ~ 4.2 mΩ with gold bond pads. The mean-time-to-failure (MTTF) was estimated to be at least one year under physiological conditions. We conclude that MMFI technology is a feasible and reliable approach for packaging and interconnecting Bio-MEMS devices.

Clad metals by roll bonding for SOFC interconnects

NASA Astrophysics Data System (ADS)

Chen, L.; Jha, B.; Yang, Zhenguo; Xia, Guang-Guang; Stevenson, Jeffry W.; Singh, Prabhakar

2006-08-01

High-temperature oxidation-resistant alloys are currently considered as a candidate material for construction of interconnects in intermediate-temperature solid oxide fuel cells. Among these alloys, however, different groups of alloys demonstrate different advantages and disadvantages, and few, if any, can completely satisfy the stringent requirements for the application. To integrate the advantages and avoid the disadvantages of different groups of alloys, cladding has been proposed as one approach in fabricating metallic layered interconnect structures. To examine the feasibility of this approach, the austenitic Ni-base alloy Haynes 230 and the ferritic stainless steel AL 453 were selected as examples and manufactured into a clad metal. Its suitability as an interconnect construction material was investigated. This paper provides a brief overview of the cladding approach and discusses the viability of this technology to fabricate the metallic layered-structure interconnects.

Lightwave technology in microwave systems

NASA Astrophysics Data System (ADS)

Popa, A. E.; Gee, C. M.; Yen, H. W.

1986-01-01

Many advanced microwave system concepts such as active aperture phased array antennas use distributed topologies in which lightwave circuits are being proposed to interconnect both the analog and digital modules of the system. Lightwave components designed to implement these interconnects are reviewed and their performance analyzed. The impact of trends in component development are discussed.

A Conceptual Framework Based on Activity Theory for Mobile CSCL

ERIC Educational Resources Information Center

Zurita, Gustavo; Nussbaum, Miguel

2007-01-01

There is a need for collaborative group activities that promote student social interaction in the classroom. Handheld computers interconnected by a wireless network allow people who work on a common task to interact face to face while maintaining the mediation afforded by a technology-based system. Wirelessly interconnected handhelds open up new…

Home page | prc.gatech.edu | Georgia Institute of Technology | Atlanta, GA

Science.gov Websites

Interconnections & Assembly Low Cost Glass Interposers & Packages MEMS and Sensors GRA Opportunities addressing electrical, mechanical and thermal barriers. Low-cost Glass Interposer and Package Panel-based ultra-thin glass as a high performance, high I/O density, and low cost platform. Interconnections and

Project demonstration of wind-turbine electricity: Interconnecting a northern Michigan fruit farm with a major utility

NASA Astrophysics Data System (ADS)

Amon, D. M.

Progress is reviewed in a project to test the economic feasibility of wind turbine technology for generating electricity. The use of wind generating electricity on a commercial fruit farm interconnecting a commercial fruit farm with a major utility to sell power are the find project goals.

75 FR 67321 - Wireless E911 Location Accuracy Requirements; E911 Requirements for IP-Enabled Service Providers

Federal Register 2010, 2011, 2012, 2013, 2014

2010-11-02

...'s CMRS E911 location requirements without ensuring that time is taken to study location technologies... accuracy requirements on interconnected VoIP service without further study.'' A number of commenters... study the technical, operational and economic issues related to the provision of ALI for interconnected...

77 FR 52766 - Technology and Trading Roundtable

Federal Register 2010, 2011, 2012, 2013, 2014

2012-08-30

... SECURITIES AND EXCHANGE COMMISSION [Release No. 34-67725; File No. 4-652] Technology and Trading... ``Technology and Trading: Promoting Stability in Today's Markets'' to discuss ways to promote stability in..., implement, and manage complex and inter-connected trading technologies. The roundtable discussion will be...

Fabrication of a novel gigabit/second free-space optical interconnect - photodetector characterization and testing and system development

NASA Technical Reports Server (NTRS)

Savich, Gregory R.

2004-01-01

The time when computing power is limited by the copper wire inherent in the computer system and not the speed of the microprocessor is rapidly approaching. With constant advances in computer technology, many researchers believe that in only a few years, optical interconnects will begin to replace copper wires in your Central Processing Unit (CPU). On a more macroscopic scale, the telecommunications industry has already made the switch to optical data transmission as, to date, fiber optic technology is the only reasonable method of reliable, long range data transmission. Within the span of a decade, we will see optical technologies move from the macroscopic world of the telecommunications industry to the microscopic world of the computer chip. Already, the communications industry is marketing commercially available optical links to connect two personal computers, thereby eliminating the need for standard and comparatively slow wired and wireless Ethernet transfers and greatly increasing the distance the computers can be separated. As processing demands continue to increase, the realm of optical communications will continue to move closer to the microprocessor and quite possibly onto the microprocessor itself. A day may come when copper connections are used only to supply power, not transfer data. This summer s work marks some of the beginning stages of a 5 to 10 year, long-term research project to create and study a free-space, 1 Gigabit/sec optical interconnect. The research will result in a novel fabricated, chip-to-chip interconnect consisting of a Vertical Cavity Surface Emitting Laser (VCSEL) Diode linked through free space to a Metal- Semiconductor-Metal (MSM) Photodetector with the possible integration of microlenses for signal focusing and Micro-Electromechanical Systems (MEMS) devices for optical signal steering. The advantages, disadvantages, and practicality of incorporating flip-chip mounting technologies will also be addressed. My work began with the design and construction of a test setup for the experiment and then appropriate characterization of the test system. Specifically, I am involved in the characterization of a commercially available 1550nm wavelength, 5mW diode laser and a study of its modulation bandwidth. Commercially produced photodetectors as well as the incorporation of microwave technology, in the form of RF input and output, are used in the characterization procedure. The next stage involves the use of a probe station and network analyzer to characterize and test a series of photodetectors fabricated on a 2 inch, Indium Gallium Arsenide (InGaAs) wafer in the Branch s microlithography lab. Other project responsibilities include, but are not limited to the incorporation of a transimpedance amplifier to the photodetector circuit; a study of VCSEL technology; bit error rate analysis of an optical interconnect system; and analysis of free space divergence of the VCSEL, optical path length of the interconnect; and any other pertinent optical properties of the one gigabit per second interconnect for fabrication and testing.

How Clusters Work

EPA Pesticide Factsheets

Technology innovation clusters are geographic concentrations of interconnected companies, universities, and other organizations with a focus on environmental technology. They play a key role in addressing the nation’s pressing environmental problems.

Origin of high photoconductive gain in fully transparent heterojunction nanocrystalline oxide image sensors and interconnects.

PubMed

Jeon, Sanghun; Song, Ihun; Lee, Sungsik; Ryu, Byungki; Ahn, Seung-Eon; Lee, Eunha; Kim, Young; Nathan, Arokia; Robertson, John; Chung, U-In

2014-11-05

A technique for invisible image capture using a photosensor array based on transparent conducting oxide semiconductor thin-film transistors and transparent interconnection technologies is presented. A transparent conducting layer is employed for the sensor electrodes as well as interconnection in the array, providing about 80% transmittance at visible-light wavelengths. The phototransistor is a Hf-In-Zn-O/In-Zn-O heterostructure yielding a high quantum-efficiency in the visible range. © 2014 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

Heterogeneously integrated microsystem-on-a-chip

DOEpatents

Chanchani, Rajen [Albuquerque, NM

2008-02-26

A microsystem-on-a-chip comprises a bottom wafer of normal thickness and a series of thinned wafers can be stacked on the bottom wafer, glued and electrically interconnected. The interconnection layer comprises a compliant dielectric material, an interconnect structure, and can include embedded passives. The stacked wafer technology provides a heterogeneously integrated, ultra-miniaturized, higher performing, robust and cost-effective microsystem package. The highly integrated microsystem package, comprising electronics, sensors, optics, and MEMS, can be miniaturized both in volume and footprint to the size of a bottle-cap or less.

Single-mode glass waveguide technology for optical interchip communication on board level

NASA Astrophysics Data System (ADS)

Brusberg, Lars; Neitz, Marcel; Schröder, Henning

2012-01-01

The large bandwidth demand in long-distance telecom networks lead to single-mode fiber interconnects as result of low dispersion, low loss and dense wavelength multiplexing possibilities. In contrast, multi-mode interconnects are suitable for much shorter lengths up to 300 meters and are promising for optical links between racks and on board level. Active optical cables based on multi-mode fiber links are at the market and research in multi-mode waveguide integration on board level is still going on. Compared to multi-mode, a single-mode waveguide has much more integration potential because of core diameters of around 20% of a multi-mode waveguide by a much larger bandwidth. But light coupling in single-mode waveguides is much more challenging because of lower coupling tolerances. Together with the silicon photonics technology, a single-mode waveguide technology on board-level will be the straight forward development goal for chip-to-chip optical interconnects integration. Such a hybrid packaging platform providing 3D optical single-mode links bridges the gap between novel photonic integrated circuits and the glass fiber based long-distance telecom networks. Following we introduce our 3D photonic packaging approach based on thin glass substrates with planar integrated optical single-mode waveguides for fiber-to-chip and chip-to-chip interconnects. This novel packaging approach merges micro-system packaging and glass integrated optics. It consists of a thin glass substrate with planar integrated singlemode waveguide circuits, optical mirrors and lenses providing an integration platform for photonic IC assembly and optical fiber interconnect. Thin glass is commercially available in panel and wafer formats and characterizes excellent optical and high-frequency properties. That makes it perfect for microsystem packaging. The paper presents recent results in single-mode waveguide technology on wafer level and waveguide characterization. Furthermore the integration in a hybrid packaging process and design issues are discussed.

Joint Services Electronics Program.

DTIC Science & Technology

1993-03-05

Mary- land, June 1992. Interconnection Network Design Based on Packaging Considerations Professor Abhiram Ranade with M. T. Raghunath A central...characterized by our abstract models of packaging technology. JSEP Publications [1] M.T. Raghunath and Abhiram Ranade, "Customizing Interconnection...94720, January 1993. [21 M.T. Raghunath and Abhiram Ranade, "Fault-Tolerant Routing in Partitioned Butterfly Networks," submitted to the 1993

Advanced Platform for Development and Evaluation of Grid Interconnection Systems Using Hardware-in-the-Loop: Part III -- Grid Interconnection System Evaluator: Preprint

DOE Office of Scientific and Technical Information (OSTI.GOV)

Lundstrom, B.; Shirazi, M.; Coddington, M.

2013-01-01

This paper, presented at the IEEE Green Technologies Conference 2013, describes a Grid Interconnection System Evaluator (GISE) that leverages hardware-in-the-loop (HIL) simulation techniques to rapidly evaluate the grid interconnection standard conformance of an ICS according to the procedures in IEEE Std 1547.1 (TM). The architecture and test sequencing of this evaluation tool, along with a set of representative ICS test results from three different photovoltaic (PV) inverters, are presented. The GISE adds to the National Renewable Energy Laboratory's (NREL) evaluation platform that now allows for rapid development of ICS control algorithms using controller HIL (CHIL) techniques, the ability to testmore » the dc input characteristics of PV-based ICSs through the use of a PV simulator capable of simulating real-world dynamics using power HIL (PHIL), and evaluation of ICS grid interconnection conformance.« less

Trust and Reputation Management for Critical Infrastructure Protection

NASA Astrophysics Data System (ADS)

Caldeira, Filipe; Monteiro, Edmundo; Simões, Paulo

Today's Critical Infrastructures (CI) depend of Information and Communication Technologies (ICT) to deliver their services with the required level of quality and availability. ICT security plays a major role in CI protection and risk prevention for single and also for interconnected CIs were cascading effects might occur because of the interdependencies that exist among different CIs. This paper addresses the problem of ICT security in interconnected CIs. Trust and reputation management using the Policy Based Management paradigm is the proposed solution to be applied at the CI interconnection points for information exchange. The proposed solution is being applied to the Security Mediation Gateway being developed in the European FP7 MICIE project, to allow for information exchange among interconnected CIs.

On-board processing satellite network architecture and control study

NASA Technical Reports Server (NTRS)

Campanella, S. Joseph; Pontano, Benjamin A.; Chalmers, Harvey

1987-01-01

The market for telecommunications services needs to be segmented into user classes having similar transmission requirements and hence similar network architectures. Use of the following transmission architecture was considered: satellite switched TDMA; TDMA up, TDM down; scanning (hopping) beam TDMA; FDMA up, TDM down; satellite switched MF/TDMA; and switching Hub earth stations with double hop transmission. A candidate network architecture will be selected that: comprises multiple access subnetworks optimized for each user; interconnects the subnetworks by means of a baseband processor; and optimizes the marriage of interconnection and access techniques. An overall network control architecture will be provided that will serve the needs of the baseband and satellite switched RF interconnected subnetworks. The results of the studies shall be used to identify elements of network architecture and control that require the greatest degree of technology development to realize an operational system. This will be specified in terms of: requirements of the enabling technology; difference from the current available technology; and estimate of the development requirements needed to achieve an operational system. The results obtained for each of these tasks are presented.

Advantages and Challenges of 10-Gbps Transmission on High-Density Interconnect Boards

NASA Astrophysics Data System (ADS)

Yee, Chang Fei; Jambek, Asral Bahari; Al-Hadi, Azremi Abdullah

2016-06-01

This paper provides a brief introduction to high-density interconnect (HDI) technology and its implementation on printed circuit boards (PCBs). The advantages and challenges of implementing 10-Gbps signal transmission on high-density interconnect boards are discussed in detail. The advantages (e.g., smaller via dimension and via stub removal) and challenges (e.g., crosstalk due to smaller interpair separation) of HDI are studied by analyzing the S-parameter, time-domain reflectometry (TDR), and transmission-line eye diagrams obtained by three-dimensional electromagnetic modeling (3DEM) and two-dimensional electromagnetic modeling (2DEM) using Mentor Graphics HyperLynx and Keysight Advanced Design System (ADS) electronic computer-aided design (ECAD) software. HDI outperforms conventional PCB technology in terms of signal integrity, but proper routing topology should be applied to overcome the challenge posed by crosstalk due to the tight spacing between traces.

SEMICONDUCTOR TECHNOLOGY Development of spin-on-glass process for triple metal interconnects

NASA Astrophysics Data System (ADS)

Li, Peng; Wenbin, Zhao; Guozhang, Wang; Zongguang, Yu

2010-12-01

Spin-on-glass (SOG), an interlayer dielectric material applied in liquid form to fill narrow gaps in the sub-dielectric surface and thus conducive to planarization, is an alternative to silicon dioxide (SiO2) deposited using PECVD processes. However, its inability to adhere to metal and problems such as cracking prevent the easy application of SOG technology to provide an interlayer dielectric in multilevel metal interconnect circuits, particularly in university processing labs. This paper will show that a thin layer of CVD SiO2 and a curing temperature below the sintering temperature of the metal interconnect layer will promote adhesion, reduce gaps, and prevent cracking. Electron scanning microscope analysis has been used to demonstrate the success of the improved technique. This optimized process has been used in batches of double-poly, triple-metal CMOS wafer fabrication to date.

Optical interconnect technologies for high-bandwidth ICT systems

NASA Astrophysics Data System (ADS)

Chujo, Norio; Takai, Toshiaki; Mizushima, Akiko; Arimoto, Hideo; Matsuoka, Yasunobu; Yamashita, Hiroki; Matsushima, Naoki

2016-03-01

The bandwidth of information and communication technology (ICT) systems is increasing and is predicted to reach more than 10 Tb/s. However, an electrical interconnect cannot achieve such bandwidth because of its density limits. To solve this problem, we propose two types of high-density optical fiber wiring for backplanes and circuit boards such as interface boards and switch boards. One type uses routed ribbon fiber in a circuit board because it has the ability to be formed into complex shapes to avoid interfering with the LSI and electrical components on the board. The backplane is required to exhibit high density and flexibility, so the second type uses loose fiber. We developed a 9.6-Tb/s optical interconnect demonstration system using embedded optical modules, optical backplane, and optical connector in a network apparatus chassis. We achieved 25-Gb/s transmission between FPGAs via the optical backplane.

Comparison of self-written waveguide techniques and bulk index matching for low-loss polymer waveguide interconnects

NASA Astrophysics Data System (ADS)

Burrell, Derek; Middlebrook, Christopher

2016-03-01

Polymer waveguides (PWGs) are used within photonic interconnects as inexpensive and versatile substitutes for traditional optical fibers. The PWGs are typically aligned to silica-based optical fibers for coupling. An epoxide elastomer is then applied and cured at the interface for index matching and rigid attachment. Self-written waveguides (SWWs) are proposed as an alternative to further reduce connection insertion loss (IL) and alleviate marginal misalignment issues. Elastomer material is deposited after the initial alignment, and SWWs are formed by injecting ultraviolet (UV) light into the fiber or waveguide. The coupled UV light cures a channel between the two differing structures. A suitable cladding layer can be applied after development. Such factors as longitudinal gap distance, UV cure time, input power level, polymer material selection and choice of solvent affect the resulting SWWs. Experimental data are compared between purely index-matched samples and those with SWWs at the fiber-PWG interface. It is shown that < 1 dB IL per connection can be achieved by either method and results indicate lowest potential losses associated with a fine-tuned self-writing process. Successfully fabricated SWWs reduce overall processing time and enable an effectively continuous low-loss rigid interconnect.

Work Station For Inverting Solar Cells

NASA Technical Reports Server (NTRS)

Feder, H.; Frasch, W.

1982-01-01

Final work station along walking-beam conveyor of solar-array assembly line turns each pretabbed solar cell over, depositing it back-side-up onto landing pad, which centers cell without engaging collector surface. Solar cell arrives at inverting work station collector-side-up with two interconnect tabs attached to collector side. Cells are inverted so that second soldering operation takes place in plain view of operator. Inversion protects collector from damage when handled at later stages of assembly.

High-Temperature Storage Testing of ACF Attached Sensor Structures

PubMed Central

Lahokallio, Sanna; Hoikkanen, Maija; Vuorinen, Jyrki; Frisk, Laura

2015-01-01

Several electronic applications must withstand elevated temperatures during their lifetime. Materials and packages for use in high temperatures have been designed, but they are often very expensive, have limited compatibility with materials, structures, and processing techniques, and are less readily available than traditional materials. Thus, there is an increasing interest in using low-cost polymer materials in high temperature applications. This paper studies the performance and reliability of sensor structures attached with anisotropically conductive adhesive film (ACF) on two different organic printed circuit board (PCB) materials: FR-4 and Rogers. The test samples were aged at 200 °C and 240 °C and monitored electrically during the test. Material characterization techniques were also used to analyze the behavior of the materials. Rogers PCB was observed to be more stable at high temperatures in spite of degradation observed, especially during the first 120 h of aging. The electrical reliability was very good with Rogers. At 200 °C, the failures occurred after 2000 h of testing, and even at 240 °C the interconnections were functional for 400 h. The study indicates that, even though these ACFs were not designed for use in high temperatures, with stable PCB material they are promising interconnection materials at elevated temperatures, especially at 200 °C. However, the fragility of the structure due to material degradation may cause reliability problems in long-term high temperature exposure. PMID:28793735

Mathematics Teacher TPACK Standards and Development Model

ERIC Educational Resources Information Center

Niess, Margaret L.; Ronau, Robert N.; Shafer, Kathryn G.; Driskell, Shannon O.; Harper, Suzanne R.; Johnston, Christopher; Browning, Christine; Ozgun-Koca, S. Asli; Kersaint, Gladis

2009-01-01

What knowledge is needed to teach mathematics with digital technologies? The overarching construct, called technology, pedagogy, and content knowledge (TPACK), has been proposed as the interconnection and intersection of technology, pedagogy, and content knowledge. Mathematics Teacher TPACK Standards offer guidelines for thinking about this…

75 FR 62299 - National Cybersecurity Awareness Month, 2010

Federal Register 2010, 2011, 2012, 2013, 2014

2010-10-08

..., government efficiency, and national security. We stand at a transformational moment in history, when our technologically interconnected world presents both immense promise and potential risks. The same technology that... efforts to defend our Nation's information technology and communications infrastructure. We must continue...

Computation for Electromigration in Interconnects of Microelectronic Devices

NASA Astrophysics Data System (ADS)

Averbuch, Amir; Israeli, Moshe; Ravve, Igor; Yavneh, Irad

2001-03-01

Reliability and performance of microelectronic devices depend to a large extent on the resistance of interconnect lines. Voids and cracks may occur in the interconnects, causing a severe increase in the total resistance and even open circuits. In this work we analyze void motion and evolution due to surface diffusion effects and applied external voltage. The interconnects under consideration are three-dimensional (sandwich) constructs made of a very thin metal film of possibly variable thickness attached to a substrate of nonvanishing conductance. A two-dimensional level set approach was applied to study the dynamics of the moving (assumed one-dimensional) boundary of a void in the metal film. The level set formulation of an electromigration and diffusion model results in a fourth-order nonlinear (two-dimensional) time-dependent PDE. This equation was discretized by finite differences on a regular grid in space and a Runge-Kutta integration scheme in time, and solved simultaneously with a second-order static elliptic PDE describing the electric potential distribution throughout the interconnect line. The well-posed three-dimensional problem for the potential was approximated via singular perturbations, in the limit of small aspect ratio, by a two-dimensional elliptic equation with variable coefficients describing the combined local conductivity of metal and substrate (which is allowed to vary in time and space). The difference scheme for the elliptic PDE was solved by a multigrid technique at each time step. Motion of voids in both weak and strong electric fields was examined, and different initial void configurations were considered, including circles, ellipses, polygons with rounded corners, a butterfly, and long grooves. Analysis of the void behavior and its influence on the resistance gives the circuit designer a tool for choosing the proper parameters of an interconnect (width-to-length ratio, properties of the line material, conductivity of the underlayer, etc.).

Self-healing of cracks in Ag joining layer for die-attachment in power devices

NASA Astrophysics Data System (ADS)

Chen, Chuantong; Nagao, Shijo; Suganuma, Katsuaki; Jiu, Jinting; Zhang, Hao; Sugahara, Tohru; Iwashige, Tomohito; Sugiura, Kazuhiko; Tsuruta, Kazuhiro

2016-08-01

Sintered silver (Ag) joining has attracted significant interest in power devices modules for its ability to form stable joints with a porous interconnection layer. A function for the self-healing of cracks in sintered porous Ag interlayers at high temperatures is discovered and reported here. A crack which was prepared on a Ag joining layer was closed after heating at 200 °C in air. The tensile strength of pre-cracked Ag joining layer specimens recovers to the value of non-cracked specimens after heating treatment. Transmission electron microscopy (TEM) was used to probe the self-healing mechanism. TEM images and electron diffraction patterns show that a large quantity of Ag nanoparticles formed at the gap with the size less than 10 nm, which bridges the crack in the self-healing process. This discovery provides additional motivation for the application of Ag as an interconnection material for power devices at high temperature.

Al-Si-Cu/TiN multilayer interconnection and Al-Ge reflow sputtering technologies for quarter-micron devices

NASA Astrophysics Data System (ADS)

Kikkawa, Takamaro; Kikuta, Kuniko

1993-05-01

Issues of interconnection technologies for quarter-micron devices are the reliability of metal lines with quarter-micron feature sizes and the formation of contact-hole-plugs with high aspect ratios. This paper describes a TiN/Al-Si-Cu/TiN/Al-Si-Cu/TiN/Ti multilayer conductor structure as a quarter-micron interconnection technology and aluminum-germanium (Al-Ge) reflow sputtering as a contact-hole filling technology. The TiN/Al-Si-Cu/TiN/Al-Si-Cu/TiN/Ti multilayer conductor structure could suppress stress-induced voiding and improve the electromigration mean-time to failure. These improvements are attributed to the fact that the grain boundaries for the Al-Si-Cu film and the interfaces between the Al-Si-Cu and the TiN films are strengthened by the rigid intermetallic compound, TiAl3. The Al-Ge alloy reflow sputtering is a candidate for contact- and via-hole filling technologies in terms of reducing fabrication costs. The Al-Ge reflow sputtering achieved low temperature contact hole filling at 300 degree(s)C. Contact holes with a diameter of 0.25 micrometers and aspect ratio of 4 could be filled. This is attributed to the low eutectic temperature for Al-Ge (424 degree(s)C) and the effect of thin polysilicon underlayer on the enhancement of Al-Ge reflow.

Power System Study for Renewable Energy Interconnection in Malaysia

NASA Astrophysics Data System (ADS)

Askar, O. F.; Ramachandaramurthy, V. K.

2013-06-01

The renewable energy (RE) sector has grown exponentially in Malaysia with the introduction of the Feed-In-Tariff (FIT) by the Ministry of Energy, Green Technology and Water. Photovoltaic, biogas, biomass and mini hydro are among the renewable energy sources which offer a lucrative tariff to incite developers in taking the green technology route. In order to receive the FIT, a developer is required by the utility company to perform a power system analysis which will determine the technical feasibility of an RE interconnection to the utility company's existing grid system. There are a number of aspects which the analysis looks at, the most important being the load flow and fault levels in the network after the introduction of an RE source. The analysis is done by modelling the utility company's existing network and simulating the network with the interconnection of an RE source. The results are then compared to the values before an interconnection is made as well as ensuring the voltage rise or the increase in fault levels do not violate any pre-existing regulations set by the utility company. This paper will delve into the mechanics of performing a load flow analysis and examining the results obtained.

Stretchable interconnections for flexible electronic systems.

PubMed

Jianhui, Lin; Bing, Yan; Xiaoming, Wu; Tianling, Ren; Litian, Liu

2009-01-01

Sensors, actuators and integrated circuits (IC) can be encapsulated together on an elastic substrate, which makes a flexible electronic system. In this system, electrical interconnections that can sustain large and reversible stretching are in great need. This paper is devoted to the fabrication of highly stretchable metal interconnections. Transfer printing technology is utilized, which mainly involves the transfer of 100-nm-thick gold ribbons from silicon wafers to pre-stretched elastic substrates. After the elastic substrates relax from the pre-strain, the gold ribbons buckle and form wavy geometries. These wavy geometries change in shapes to accommodate the applied strain and can be reversely stretched without cracks or fractures occurring, which will greatly raise the stretchability of the gold ribbons. As an application example, some of these wavy ribbons can accommodate high levels of stretching (up to 100%) and bending (with curvature radius down to 1.20 mm). Moreover, the efficiency and reliability of the transfer, especially for slender ribbons, have been increased due to the improvement of the technology. All the characteristics above will permit making stretchable gold conductors as interconnections for flexible electronic systems such as implantable medical systems and smart clothes.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Thomas, H. P.; Basso, T. S.; Kroposki, B.

The Department of Energy (DOE) Distributed Power Program (DPP) is conducting work to complete, validate in the field, and support the development of a national interconnection standard for distributed energy resources (DER), and to address the institutional and regulatory barriers slowing the commercial adoption of DER systems. This work includes support for the IEEE standards, including P1547 Standard for Interconnecting Distributed Resources with Electric Power Systems, P1589 Standard for Conformance Test Procedures for Equipment Interconnecting Distributed Resources with Electric Power Systems, and the P1608 Application Guide. Work is also in progress on system integration research and development (R&D) on themore » interface and control of DER with local energy systems. Additional efforts are supporting high-reliability power for industry, evaluating innovative concepts for DER applications, and exploring plug-and-play interface and control technologies for intelligent autonomous interconnection systems. This paper summarizes (1) the current status of the IEEE interconnection standards and application guides in support of DER, and (2) the R&D in progress at the National Renewable Energy Laboratory (NREL) for interconnection and system integration and application of distributed energy resources.« less

[Attachment theory and baby slings/carriers: technological network formation].

PubMed

Lu, Zxy-Yann Jane; Lin, Wan-Shiuan

2011-12-01

Healthcare providers recognize the important role played by attachment theory in explaining the close relationship between mental health and social behavior in mothers and their children. This paper uses attachment theory in a socio-cultural context to ascertain the mechanism by which baby slings/carriers, a new technology, produced and reproduced the scientific motherhood. It further applies a social history of technology perspective to understand how baby carriers and attachment theory are socially constructed and historically contingent on three major transformations. These transformations include the use of attachment theory-based baby carriers to further scientific motherhood; the use of baby slings/carriers to further the medicalization of breastfeeding and enhance mother-infant attachment; and the use of baby slings/carriers to transform woman's identities by integrating scientific motherhood, independence and fashion. Implications for nursing clinical policy are suggested.

Exploration of operator method digital optical computers for application to NASA

NASA Technical Reports Server (NTRS)

1990-01-01

Digital optical computer design has been focused primarily towards parallel (single point-to-point interconnection) implementation. This architecture is compared to currently developing VHSIC systems. Using demonstrated multichannel acousto-optic devices, a figure of merit can be formulated. The focus is on a figure of merit termed Gate Interconnect Bandwidth Product (GIBP). Conventional parallel optical digital computer architecture demonstrates only marginal competitiveness at best when compared to projected semiconductor implements. Global, analog global, quasi-digital, and full digital interconnects are briefly examined as alternative to parallel digital computer architecture. Digital optical computing is becoming a very tough competitor to semiconductor technology since it can support a very high degree of three dimensional interconnect density and high degrees of Fan-In without capacitive loading effects at very low power consumption levels.

Fiber optic interconnect and optoelectronic packaging challenges for future generation avionics

NASA Astrophysics Data System (ADS)

Beranek, Mark W.

2007-02-01

Forecasting avionics industry fiber optic interconnect and optoelectronic packaging challenges that lie ahead first requires an assumption that military avionics architectures will evolve from today's centralized/unified concept based on gigabit laser, optical-to-electrical-to-optical switching and optical backplane technology, to a future federated/distributed or centralized/unified concept based on gigabit tunable laser, electro-optical switch and add-drop wavelength division multiplexing (WDM) technology. The requirement to incorporate avionics optical built-in test (BIT) in military avionics fiber optic systems is also assumed to be correct. Taking these assumptions further indicates that future avionics systems engineering will use WDM technology combined with photonic circuit integration and advanced packaging to form the technical basis of the next generation military avionics onboard local area network (LAN). Following this theme, fiber optic cable plants will evolve from today's multimode interconnect solution to a single mode interconnect solution that is highly installable, maintainable, reliable and supportable. Ultimately optical BIT for fiber optic fault detection and isolation will be incorporated as an integral part of a total WDM-based avionics LAN solution. Cost-efficient single mode active and passive photonic component integration and packaging integration is needed to enable reliable operation in the harsh military avionics application environment. Rugged multimode fiber-based transmitters and receivers (transceivers) with in-package optical BIT capability are also needed to enable fully BIT capable single-wavelength fiber optic links on both legacy and future aerospace platforms.

Virginia Offshore Wind Technology Advancement Project (VOWTAP) DOE EE0005985 Final Technical Report Rev 1a

DOE Office of Scientific and Technical Information (OSTI.GOV)

Pietryk, Steven

The primary purpose of the VOWTAP was to advance the offshore wind industry in the United States (U.S.) by demonstrating innovative technologies and process solutions that would establish offshore wind as a cost-effective renewable energy resource. The VOWTAP Team proposed to design, construct, and operate a 12 megawatt (MW) offshore wind facility located approximately 27 statute miles (mi) (24 nautical miles [nm], 43 kilometers [km]) off the coast of Virginia. The proposed Project would consist of two Alstom Haliade™ 150-6 MW turbines mounted on inward battered guide structures (IBGS), a 34.5-kilovolt (kV) alternating current (AC) submarine cable interconnecting the WTGsmore » (inter-array cable), a 34.5-kV AC submarine transmission cable (export cable), and a 34.5 kV underground cable (onshore interconnection cable) that would connect the Project with existing Dominion infrastructure located in Virginia Beach, Virginia (Figure 1). Interconnection with the existing Dominion infrastructure would also require an onshore switch cabinet, a fiber optic cable, and new interconnection station to be located entirely within the boundaries of the Camp Pendleton State Military Reservation (Camp Pendleton). The VOWTAP balanced technology innovation with commercial readiness such that turbine operations were anticipated to commence by 2018. Dominion, as the leaseholder of the Virginia Wind Energy Area (WEA), anticipated leveraging lessons learned through the VOWTAP, and applying them to future commercial-scale offshore wind development.« less

Integration of e-Management, e-Development and e-Learning Technologies for Blended Course Delivery

ERIC Educational Resources Information Center

Johnson, Lynn E.; Tang, Michael

2005-01-01

This paper describes and assesses a pre-engineering curriculum development project called Foundations of Engineering, Science and Technology (FEST). FEST integrates web-based technologies into an inter-connected system to enable delivery of a blended program at multiple institutions. Tools and systems described include 1) technologies to deliver…

In Vitro Reconstitution of Autophagosome-Lysosome Fusion.

PubMed

Diao, J; Li, L; Lai, Y; Zhong, Q

2017-01-01

SNARE (soluble N-ethylmaleimide-sensitive factor attachment protein receptors) proteins are a highly regulated class of membrane proteins lying in the center of membrane fusion. In conjunction with accessory proteins, SNAREs drive efficient merger of two distinct lipid bilayers into one interconnected structure. This chapter describes our fluorescence resonance energy transfer (FRET)-based proteoliposome fusion assays for the roles of various SNARE proteins, accessory proteins, and effects of different lipid compositions on membrane fusion involved in autophagy. © 2017 Elsevier Inc. All rights reserved.

U.S. Laws and Regulations for Renewable Energy Grid Interconnections

DOE Office of Scientific and Technical Information (OSTI.GOV)

Chernyakhovskiy, Ilya; Tian, Tian; McLaren, Joyce

Rapidly declining costs of wind and solar energy technologies, increasing concerns about the environmental and climate change impacts of fossil fuels, and sustained investment in renewable energy projects all point to a not-so-distant future in which renewable energy plays a pivotal role in the electric power system of the 21st century. In light of public pressures and market factors that hasten the transition towards a low-carbon system, power system planners and regulators are preparing to integrate higher levels of variable renewable generation into the grid. Updating the regulations that govern generator interconnections and operations is crucial to ensure system reliabilitymore » while creating an enabling environment for renewable energy development. This report presents a chronological review of energy laws and regulations concerning grid interconnection procedures in the United States, highlighting the consequences of policies for renewable energy interconnections. Where appropriate, this report places interconnection policies and their impacts on renewable energy within the broader context of power market reform.« less

A nanostructure based on metasurfaces for optical interconnects

NASA Astrophysics Data System (ADS)

Lin, Shulang; Gu, Huarong

2017-08-01

Optical-electronic Integrated Neural Co-processor takes vital part in optical neural network, which is mainly realized by optical interconnects. Because of the accuracy requirement and long-term goal of integration, optical interconnects should be effective and pint-size. In traditional solutions of optical interconnects, holography built on crystalloid or law of Fresnel diffraction exploited on zone plate was used. However, holographic method cannot meet the efficiency requirement and zone plate is too bulk to make the optical neural unit miniaturization. Thus, this paper aims to find a way to replace holographic method or zone plate with enough diffraction efficiency and smaller size. Metasurfaces are composed of subwavelength-spaced phase shifters at an interface of medium. Metasurfaces allow for unprecedented control of light properties. They also have advanced optical technology of enabling versatile functionalities in a planar structure. In this paper, a nanostructure is presented for optical interconnects. The comparisons of light splitting ability and simulated crosstalk between nanostructure and zone plate are also made.

The potential benefits of photonics in the computing platform

NASA Astrophysics Data System (ADS)

Bautista, Jerry

2005-03-01

The increase in computational requirements for real-time image processing, complex computational fluid dynamics, very large scale data mining in the health industry/Internet, and predictive models for financial markets are driving computer architects to consider new paradigms that rely upon very high speed interconnects within and between computing elements. Further challenges result from reduced power requirements, reduced transmission latency, and greater interconnect density. Optical interconnects may solve many of these problems with the added benefit extended reach. In addition, photonic interconnects provide relative EMI immunity which is becoming an increasing issue with a greater dependence on wireless connectivity. However, to be truly functional, the optical interconnect mesh should be able to support arbitration, addressing, etc. completely in the optical domain with a BER that is more stringent than "traditional" communication requirements. Outlined are challenges in the advanced computing environment, some possible optical architectures and relevant platform technologies, as well roughly sizing these opportunities which are quite large relative to the more "traditional" optical markets.

Reflow-oven-processing of pressureless sintered-silver interconnects

DOE Office of Scientific and Technical Information (OSTI.GOV)

Wereszczak, Andrew A.; Chen, Branndon R.; Oistad, Brian A.

Here, a method was developed to pressurelessly fabricate strong and consistent sinterable-silver joints or interconnects using reflow oven heating. Circular sinterable-silver interconnects, having nominal diameter of 5 mm and 0.1 mm thickness were stencil printed, contact-dried, and then pressurelessly sinter-bonded to Au-plated direct copper bonded ceramic substrates at 250 °C in ambient air. That sintering was done in either a reflow oven or a convective oven (latter being a conventional heating source for processing sinterable-silver). Consistently strong (>40 MPa) interconnects were produced with reflow oven heating and were as strong as those produced with convective oven heating. This is significantmore » because reflow oven technology affords better potential for continuous mass production and it was shown that strong sintered-silver bonds can indeed be achieved with its use.« less

Reflow-oven-processing of pressureless sintered-silver interconnects

DOE PAGES

Wereszczak, Andrew A.; Chen, Branndon R.; Oistad, Brian A.

2018-01-04

Here, a method was developed to pressurelessly fabricate strong and consistent sinterable-silver joints or interconnects using reflow oven heating. Circular sinterable-silver interconnects, having nominal diameter of 5 mm and 0.1 mm thickness were stencil printed, contact-dried, and then pressurelessly sinter-bonded to Au-plated direct copper bonded ceramic substrates at 250 °C in ambient air. That sintering was done in either a reflow oven or a convective oven (latter being a conventional heating source for processing sinterable-silver). Consistently strong (>40 MPa) interconnects were produced with reflow oven heating and were as strong as those produced with convective oven heating. This is significantmore » because reflow oven technology affords better potential for continuous mass production and it was shown that strong sintered-silver bonds can indeed be achieved with its use.« less

Technology Solutions | Distributed Generation Interconnection Collaborative

Science.gov Websites

technologies, both hardware and software, can support the wider adoption of distributed generation on the grid . As the penetration of distributed-generation photovoltaics (DGPV) has risen rapidly in recent years posed by high penetrations of distributed PV. Other promising technologies include new utility software

Fatal Attractions: Attachment to Smartphones Predicts Anthropomorphic Beliefs and Dangerous Behaviors.

PubMed

Bodford, Jessica E; Kwan, Virginia S Y; Sobota, David S

2017-05-01

As technology's presence grows increasingly concrete in global societies, so too do our relationships with the devices we keep close at hand from day to day. Whereas research has, in the past, framed smartphone addiction in terms of possessional attachment, the present research hypothesizes that anxious smartphone attachment stems from human attachment, in which Anxiously attached individuals may be more likely to generalize their anxious attachment style to communication devices. In the present study, we found support for this hypothesis and showed that anxious smartphone attachment predicts (1) anthropomorphic beliefs, (2) reliance on-or "clinginess" toward-smartphones, and (3) a seemingly compulsive urge to answer one's phone, even in dangerous situations (e.g., while driving). Taken together, we seek to provide a theoretical framework and methodological tools to identify the sources of technology attachment and those most at risk of engaging in dangerous or inappropriate behaviors as a result of attachment to ever-present mobile devices.

Structures with three dimensional nanofences comprising single crystal segments

DOEpatents

Goyal, Amit; Wee, Sung-Hun

2013-08-27

An article includes a substrate having a surface and a nanofence supported by the surface. The nanofence includes a multiplicity of primary nanorods and branch nanorods, each of the primary nanorods being attached to said substrate, and each of the branch nanorods being attached to a primary nanorods and/or another branch nanorod. The primary and branch nanorods are arranged in a three-dimensional, interconnected, interpenetrating, grid-like network defining interstices within the nanofence. The article further includes an enveloping layer supported by the nanofence, disposed in the interstices, and forming a coating on the primary and branch nanorods. The enveloping layer has a different composition from that of the nanofence and includes a radial p-n single junction solar cell photovoltaic material and/or a radial p-n multiple junction solar cell photovoltaic material.

Security barriers with automated reconnaissance

DOEpatents

McLaughlin, James O; Baird, Adam D; Tullis, Barclay J; Nolte, Roger Allen

2015-04-07

An intrusion delaying barrier includes primary and secondary physical structures and can be instrumented with multiple sensors incorporated into an electronic monitoring and alarm system. Such an instrumented intrusion delaying barrier may be used as a perimeter intrusion defense and assessment system (PIDAS). Problems with not providing effective delay to breaches by intentional intruders and/or terrorists who would otherwise evade detection are solved by attaching the secondary structures to the primary structure, and attaching at least some of the sensors to the secondary structures. By having multiple sensors of various types physically interconnected serves to enable sensors on different parts of the overall structure to respond to common disturbances and thereby provide effective corroboration that a disturbance is not merely a nuisance or false alarm. Use of a machine learning network such as a neural network exploits such corroboration.

Technology as "A Human Practice with Social Meaning:" A New Scenery for Engineering Education

ERIC Educational Resources Information Center

Gana, Maria Teresa Santander; Fuentes, Luis Antonio Trejo

2006-01-01

In a world sustained and interconnected by technology, people make choices. Therefore, they have to consider that technology is subject to analysis and interpretation because it is designed by humans with varied histories, experiences and cultures. To generate an understanding of the technological phenomenon, this article proposes to view the…

Authentication in Virtual Organizations: A Reputation Based PKI Interconnection Model

NASA Astrophysics Data System (ADS)

Wazan, Ahmad Samer; Laborde, Romain; Barrere, Francois; Benzekri, Abdelmalek

Authentication mechanism constitutes a central part of the virtual organization work. The PKI technology is used to provide the authentication in each organization involved in the virtual organization. Different trust models are proposed to interconnect the different PKIs in order to propagate the trust between them. While the existing trust models contain many drawbacks, we propose a new trust model based on the reputation of PKIs.

A proposed holistic approach to on-chip, off-chip, test, and package interconnections

NASA Astrophysics Data System (ADS)

Bartelink, Dirk J.

1998-11-01

The term interconnection has traditionally implied a `robust' connection from a transistor or a group of transistors in an IC to the outside world, usually a PC board. Optimum system utilization is done from outside the IC. As an alternative, this paper addresses `unimpeded' transistor-to-transistor interconnection aimed at reaching the high circuit densities and computational capabilities of neighboring IC's. In this view, interconnections are not made to some human-centric place outside the IC world requiring robustness—except for system input and output connections. This unimpeded interconnect style is currently available only through intra-chip signal traces in `system-on-a-chip' implementations, as exemplified by embedded DRAMs. Because the traditional off-chip penalty in performance and wiring density is so large, a merging of complex process technologies is the only option today. It is suggested that, for system integration to move forward, the traditional robustness requirement inherited from conventional packaging interconnect and IC manufacturing test must be discarded. Traditional system assembly from vendor parts requires robustness under shipping, inspection and assembly. The trend toward systems on a chip signifies willingness by semiconductor companies to design and fabricate whole systems in house, so that `in-house' chip-to-chip assembly is not beyond reach. In this scenario, bare chips never leave the controlled environment of the IC fabricator while the two major contributors to off-chip signal penalty, ESD protection and the need to source a 50-ohm test head, are avoided. With in-house assembly, ESD protection can be eliminated with the precautions already familiar in plasma etching. Test interconnection impacts the fundamentals of IC manufacturing, particularly with clock speeds approaching 1GHz, and cannot be an afterthought. It should be an integral part of the chip-to-chip interconnection bandwidth optimization, because—as we must recognize—test is also performed using IC's. A system interconnection is proposed using multiple chips fabricated with conventional silicon processes, including MEMS technology. The system resembles an MCM that can be joined without committing to final assembly to perform at-speed testing. 50-Ohm test probes never load the circuit; only intended neighboring chips are ever connected. A `back-plane' chip provides the connection layers for both inter- and intra-chip signals and also serves as the probe card, in analogy with membrane probes now used for single-chip testing. Intra-chip connections, which require complicated connections during test that exactly match the product, are then properly made and all waveforms and loading conditions under test will be identical to those of the product. The major benefit is that all front-end chip technologies can be merged—logic, memory, RF, even passives. ESD protection is required only on external system connections. Manufacturing test information will accurately characterize process faults and thus avoid the Known-Good-Die problem that has slowed the arrival of conventional MCM's.

Wicked problems in space technology development at NASA

NASA Astrophysics Data System (ADS)

Balint, Tibor S.; Stevens, John

2016-01-01

Technological innovation is key to enable future space exploration missions at NASA. Technology development, however, is not only driven by performance and resource considerations, but also by a broad range of directly or loosely interconnected factors. These include, among others, strategy, policy and politics at various levels, tactics and programmatics, interactions between stakeholders, resource requirements, performance goals from component to system level, mission infusion targets, portfolio execution and tracking, and technology push or mission pull. Furthermore, at NASA, these influences occur on varying timescales and at diverse geographic locations. Such a complex and interconnected system could impede space technology innovation in this examined segment of the government environment. Hence, understanding the process through NASA's Planning, Programming, Budget and Execution cycle could benefit strategic thinking, planning and execution. Insights could be gained through suitable models, for example assessing the key drivers against the framework of Wicked Problems. This paper discusses NASA specific space technology innovation and innovation barriers in the government environment through the characteristics of Wicked Problems; that is, they do not have right or wrong solutions, only improved outcomes that can be reached through authoritative, competitive, or collaborative means. We will also augment the Wicked Problems model to account for the temporally and spatially coupled, and cyclical nature of this NASA specific case, and propose how appropriate models could improve understanding of the key influencing factors. In turn, such understanding may subsequently lead to reducing innovation barriers, and stimulating technology innovation at NASA. Furthermore, our approach can be adopted for other government-directed environments to gain insights into their structures, hierarchies, operational flow, and interconnections to facilitate circular dialogs towards preferred outcomes.

Fibroblastic interactions with high-porosity Ti-6Al-4V metal foam.

PubMed

Cheung, Serene; Gauthier, Maxime; Lefebvre, Louis-Philippe; Dunbar, Michael; Filiaggi, Mark

2007-08-01

A novel metallic Ti-6Al-4V foam in development at the National Research Council of Canada was investigated for its ability to foster cell attachment and growth using a fibroblast cell culture model. The foam was manufactured via a powder metallurgical process that could produce interconnected porosity greater than 70%. Cell attachment was assessed after 6 and 24 h, while proliferation was examined after 3 and 7 days. Ingrown fibroblasts displayed a number of different morphologies; some fibroblasts were spread thinly in close apposition with the irregular surface, or more often had several anchorage points and extended in three dimensions as they spanned pore space. It was also demonstrated that fibroblasts were actively migrating through the porous scaffold over a 14-day period. In a 60-day extended culture, fibroblasts were bridging and filling macropores and had extensively infiltrated the foams. Overall, it was established that this foam was supportive of cell attachment and proliferation, migration through the porous network, and that it was capable of sustaining a large cell population.

Evaluation of advanced microelectronic fluxless solder-bump contacts for hybrid microcircuits

NASA Technical Reports Server (NTRS)

Mandal, R. P.

1976-01-01

Technology for interconnecting monolithic integrated circuit chips with other components is investigated. The advantages and disadvantages of the current flip-chip approach as compared to other interconnection methods are outlined. A fluxless solder-bump contact technology is evaluated. Multiple solder-bump contacts were formed on silicon integrated circuit chips. The solder-bumps, comprised of a rigid nickel under layer and a compliant solder overlayer, were electroformed onto gold device pads with the aid of thick dry film photomasks. Different solder alloys and the use of conductive epoxy for bonding were explored. Fluxless solder-bump bond quality and reliability were evaluated by measuring the effects of centrifuge, thermal cycling, and high temperature storage on bond visual characteristics, bond electrical continuity, and bond shear tests. The applicability and suitability of this technology for hybrid microelectronic packaging is discussed.

Lift/cruise fan V/STOL technology aircraft design definition study. Volume 2: Propulsion transmission system design

NASA Technical Reports Server (NTRS)

Obrien, W. J.

1976-01-01

Two types of lift/cruise fan technology aircraft were conceptually designed. One aircraft used turbotip fans pneumatically interconnected to three gas generators, and the other aircraft used variable pitch fans mechanically interconnected to three turboshaft engines. The components of each propulsion transmission system were analyzed and designed to the depth necessary to determine areas of risk, development methods, performance, weights and costs. The types of materials and manufacturing processes were identified to show that the designs followed a low cost approach. The lift/cruise fan thrust vectoring hoods, which are applicable to either aircraft configuration, were also evaluated to assure a low cost/low risk approach.

Selection and Evaluation of Priority Domains in Global Energy Internet Standard Development Based on Technology Foresight

NASA Astrophysics Data System (ADS)

Jin, Yang; Ciwei, Gao; Jing, Zhang; Min, Sun; Jie, Yu

2017-05-01

The selection and evaluation of priority domains in Global Energy Internet standard development will help to break through limits of national investment, thus priority will be given to standardizing technical areas with highest urgency and feasibility. Therefore, in this paper, the process of Delphi survey based on technology foresight is put forward, the evaluation index system of priority domains is established, and the index calculation method is determined. Afterwards, statistical method is used to evaluate the alternative domains. Finally the top four priority domains are determined as follows: Interconnected Network Planning and Simulation Analysis, Interconnected Network Safety Control and Protection, Intelligent Power Transmission and Transformation, and Internet of Things.

Development of technologies for welding interconnects to fifty-micron thick silicon solar cells

NASA Technical Reports Server (NTRS)

Patterson, R. E.

1982-01-01

A program was conducted to develop technologies for welding interconnects to 50 microns thick, 2 by 2 cm solar cells. The cells were characterized with respect to electrical performance, cell thickness, silver contact thickness, contact waviness, bowing, and fracture strength. Weld schedules were independently developed for each of the three cell types and were coincidentally identical. Thermal shock tests (100 cycles from 100 C to -180 C) were performed on 16 cell coupons for each cell type without any weld joint failures or electrical degradation. Three 48 cell modules (one for each cell type) were assembled with 50 microns thick cells, frosted fused silica covers, silver clad Invar interconnectors, and Kapton substrates.

Community and communication in the third age: the impact of internet and cell phone use on attachment to place in later life in England.

PubMed

Gilleard, Chris; Hyde, Martin; Higgs, Paul

2007-07-01

We investigated the following question: Would access to and use of domestic information and communication technology affect people's attachment to place in later life? Drawing upon data on ownership of cell phones and use of Internet/e-mail from the English Longitudinal Study of Ageing, we measured the association between access to such technology and self-rated attachment to one's neighborhood. There was a significant negative association between attachment to place and ownership and use of domestic information and communication technology, particularly the Internet. This association remained after taking account of age/cohort differences, as well as the influence of gender, disability, socioeconomic status of the neighborhood, differences in income and educational status, and length of residence in the area. The results suggest that ownership and use of domestic information and communication technology reduces the sense of attachment to the local neighborhood among individuals 50 and older in England. It does not, however, influence the perceived sense of trust in or perceived friendliness of people in the neighborhood. We suggest that domestic information and communication technology may be more liberating of neighborhood boundedness than destructive of social capital.

Board-to-board optical interconnection using novel optical plug and slot

NASA Astrophysics Data System (ADS)

Cho, In K.; Yoon, Keun Byoung; Ahn, Seong H.; Kim, Jin Tae; Lee, Woo Jin; Shin, Kyoung Up; Heo, Young Un; Park, Hyo Hoon

2004-10-01

A novel optical PCB with transmitter/receiver system boards and optical bakcplane was prepared, which is board-to-board interconnection by optical plug and slot. We report an 8Gb/s PRBS NRZ data transmission between transmitter system board and optical backplane embedded multimode polymeric waveguide arrays. The basic concept of ETRI's optical PCB is as follows; 1) Metal optical bench is integrated with optoelectronic devices, driver and receiver circuits, polymeric waveguide and access line PCB module. 2) Multimode polymeric waveguide inside an optical backplane, which is embedded into PCB. 3) Optical slot and plug for high-density(channel pitch : 500um) board-to-board interconnection. The polymeric waveguide technology can be used for transmission of data on transmitter/ receiver system boards and for backplane interconnections. The main components are low-loss tapered polymeric waveguides and a novel optical plug and slot for board-to-board interconnections, respectively. The optical PCB is characteristic of low coupling loss, easy insertion/extraction of the boards and, especially, reliable optical coupling unaffected from external environment after board insertion.

Self-healing of cracks in Ag joining layer for die-attachment in power devices

DOE Office of Scientific and Technical Information (OSTI.GOV)

Chen, Chuantong, E-mail: chenchuantong@sanken.osaka-u.ac.jp; Nagao, Shijo; Suganuma, Katsuaki

Sintered silver (Ag) joining has attracted significant interest in power devices modules for its ability to form stable joints with a porous interconnection layer. A function for the self-healing of cracks in sintered porous Ag interlayers at high temperatures is discovered and reported here. A crack which was prepared on a Ag joining layer was closed after heating at 200 °C in air. The tensile strength of pre-cracked Ag joining layer specimens recovers to the value of non-cracked specimens after heating treatment. Transmission electron microscopy (TEM) was used to probe the self-healing mechanism. TEM images and electron diffraction patterns show thatmore » a large quantity of Ag nanoparticles formed at the gap with the size less than 10 nm, which bridges the crack in the self-healing process. This discovery provides additional motivation for the application of Ag as an interconnection material for power devices at high temperature.« less

Porous starch/cellulose nanofibers composite prepared by salt leaching technique for tissue engineering.

PubMed

Nasri-Nasrabadi, Bijan; Mehrasa, Mohammad; Rafienia, Mohammad; Bonakdar, Shahin; Behzad, Tayebeh; Gavanji, Shahin

2014-08-08

Starch/cellulose nanofibers composites with proper porosity pore size, mechanical strength, and biodegradability for cartilage tissue engineering have been reported in this study. The porous thermoplastic starch-based composites were prepared by combining film casting, salt leaching, and freeze drying methods. The diameter of 70% nanofibers was in the range of 40-90 nm. All samples had interconnected porous morphology; however an increase in pore interconnectivity was observed when the sodium chloride ratio was increased in the salt leaching. Scaffolds with the total porogen content of 70 wt% exhibited adequate mechanical properties for cartilage tissue engineering applications. The water uptake ratio of nanocomposites was remarkably enhanced by adding 10% cellulose nanofibers. The scaffolds were partially destroyed due to low in vitro degradation rate after more than 20 weeks. Cultivation of isolated rabbit chondrocytes on the fabricated scaffold proved that the incorporation of nanofibers in starch structure improves cell attachment and proliferation. Copyright © 2014 Elsevier Ltd. All rights reserved.

Integration of micro-/nano-/quantum-scale photonic devices: scientific and technological considerations

NASA Astrophysics Data System (ADS)

Lee, El-Hang; Lee, Seung-Gol; O, Beom Hoan; Park, Se Geun

2004-08-01

Scientific and technological issues and considerations regarding the integration of miniaturized microphotonic devices, circuits and systems in micron, submicron, and quantum scale, are presented. First, we examine the issues regarding the miniaturization of photonic devices including the size effect, proximity effect, energy confinement effect, microcavity effect, optical and quantum interference effect, high field effect, nonlinear effect, noise effect, quantum optical effect, and chaotic effect. Secondly, we examine the issues regarding the interconnection including the optical alignment, minimizing the interconnection losses, and maintaining optical modes. Thirdly, we address the issues regarding the two-dimensional or three-dimensional integration either in a hybrid format or in a monolithic format between active devices and passive devices of varying functions. We find that the concept of optical printed circuit board (O-PCB) that we propose is highly attractive as a platform for micro/nano/quantum-scale photonic integration. We examine the technological issues to be addressed in the process of fabrication, characterization, and packaging for actual implementation of the miniaturization, interconnection and integration. Devices that we have used for our study include: mode conversion schemes, micro-ring and micro-racetrack resonator devices, multimode interference devices, lasers, vertical cavity surface emitting microlasers, and their arrays. Future prospects are also discussed.

Love in the Time of Facebook: How Technology Now Shapes Romantic Attachments in College Students

ERIC Educational Resources Information Center

Klein, Michael C.

2013-01-01

College counseling clinicians need to understand how students use technology to form, sustain, and end romantic attachments. Students now frequently incorporate aspects of these technologically based interactions, or mediated communications, into counseling sessions and often make important attributions based on them. Heavy daily use of a growing…

Grain-size considerations for optoelectronic multistage interconnection networks.

PubMed

Krishnamoorthy, A V; Marchand, P J; Kiamilev, F E; Esener, S C

1992-09-10

This paper investigates, at the system level, the performance-cost trade-off between optical and electronic interconnects in an optoelectronic interconnection network. The specific system considered is a packet-switched, free-space optoelectronic shuffle-exchange multistage interconnection network (MIN). System bandwidth is used as the performance measure, while system area, system power, and system volume constitute the cost measures. A detailed design and analysis of a two-dimensional (2-D) optoelectronic shuffle-exchange routing network with variable grain size K is presented. The architecture permits the conventional 2 x 2 switches or grains to be generalized to larger K x K grain sizes by replacing optical interconnects with electronic wires without affecting the functionality of the system. Thus the system consists of log(k) N optoelectronic stages interconnected with free-space K-shuffles. When K = N, the MIN consists of a single electronic stage with optical input-output. The system design use an effi ient 2-D VLSI layout and a single diffractive optical element between stages to provide the 2-D K-shuffle interconnection. Results indicate that there is an optimum range of grain sizes that provides the best performance per cost. For the specific VLSI/GaAs multiple quantum well technology and system architecture considered, grain sizes larger than 256 x 256 result in a reduced performance, while grain sizes smaller than 16 x 16 have a high cost. For a network with 4096 channels, the useful range of grain sizes corresponds to approximately 250-400 electronic transistors per optical input-output channel. The effect of varying certain technology parameters such as the number of hologram phase levels, the modulator driving voltage, the minimum detectable power, and VLSI minimum feature size on the optimum grain-size system is studied. For instance, results show that using four phase levels for the interconnection hologram is a good compromise for the cost functions mentioned above. As VLSI minimum feature sizes decrease, the optimum grain size increases, whereas, if optical interconnect performance in terms of the detector power or modulator driving voltage requirements improves, the optimum grain size may be reduced. Finally, several architectural modifications to the system, such as K x K contention-free switches and sorting networks, are investigated and optimized for grain size. Results indicate that system bandwidth can be increased, but at the price of reduced performance/cost. The optoelectronic MIN architectures considered thus provide a broad range of performance/cost alternatives and offer a superior performance over purely electronic MIN's.

Fast Response, Open-Celled Porous, Shape Memory Effect Actuators with Integrated Attachments

NASA Technical Reports Server (NTRS)

Jardine, Andrew Peter (Inventor)

2015-01-01

This invention relates to the exploitation of porous foam articles exhibiting the Shape Memory Effect as actuators. Each foam article is composed of a plurality of geometric shapes, such that some geometric shapes can fit snugly into or around rigid mating connectors that attach the Shape Memory foam article intimately into the load path between a static structure and a moveable structure. The foam is open-celled, composed of a plurality of interconnected struts whose mean diameter can vary from approximately 50 to 500 microns. Gases and fluids flowing through the foam transfer heat rapidly with the struts, providing rapid Shape Memory Effect transformations. Embodiments of porous foam articles as torsional actuators and approximately planar structures are disposed. Simple, integral connection systems exploiting the ability to supply large loads to a structure, and that can also supply hot and cold gases and fluids to effect rapid actuation are also disposed.

Compressed gas fuel storage system

DOEpatents

Wozniak, John J.; Tiller, Dale B.; Wienhold, Paul D.; Hildebrand, Richard J.

2001-01-01

A compressed gas vehicle fuel storage system comprised of a plurality of compressed gas pressure cells supported by shock-absorbing foam positioned within a shape-conforming container. The container is dimensioned relative to the compressed gas pressure cells whereby a radial air gap surrounds each compressed gas pressure cell. The radial air gap allows pressure-induced expansion of the pressure cells without resulting in the application of pressure to adjacent pressure cells or physical pressure to the container. The pressure cells are interconnected by a gas control assembly including a thermally activated pressure relief device, a manual safety shut-off valve, and means for connecting the fuel storage system to a vehicle power source and a refueling adapter. The gas control assembly is enclosed by a protective cover attached to the container. The system is attached to the vehicle with straps to enable the chassis to deform as intended in a high-speed collision.

Structural Preferential Attachment: Network Organization beyond the Link

NASA Astrophysics Data System (ADS)

Hébert-Dufresne, Laurent; Allard, Antoine; Marceau, Vincent; Noël, Pierre-André; Dubé, Louis J.

2011-10-01

We introduce a mechanism which models the emergence of the universal properties of complex networks, such as scale independence, modularity and self-similarity, and unifies them under a scale-free organization beyond the link. This brings a new perspective on network organization where communities, instead of links, are the fundamental building blocks of complex systems. We show how our simple model can reproduce social and information networks by predicting their community structure and more importantly, how their nodes or communities are interconnected, often in a self-similar manner.

Synthesis of Side Chain Liquid Crystal Polymers by Living Ring Opening Metathesis Polymerization. 3. Influence of Molecular Weight, Interconnecting Unit and Substituent on the Mesomorphic behavior of Polymers with Laterally Attached Mesogens

DTIC Science & Technology

1992-04-08

polymethylsiloxanes, 6 -7 polyacrylates ,2,4,5 polymethacrylates, 1 ,3 and polychloroacrylates, 5 exhibit only nematic mesophases regardless of the...corresponding carboxyl chloride. Potassium bicyclo[2.2.1]hept-2-ene-5- carboxylate was prepared by titrating a methanolic solution of the carboxylic acid...Esterification of the Corresponding Benzyl Bromides. Monomers 1I-n were prepared in 47-88% yield using the following procedure. A mixture of potassium bicyclo

Bond layer for a solid oxide fuel cell, and related processes and devices

DOEpatents

Wu, Jian; Striker, Todd-Michael; Renou, Stephane; Gaunt, Simon William

2017-03-21

An electrically-conductive layer of material having a composition comprising lanthanum and strontium is described. The material is characterized by a microstructure having bimodal porosity. Another concept in this disclosure relates to a solid oxide fuel cell attached to at least one cathode interconnect by a cathode bond layer. The bond layer includes a microstructure having bimodal porosity. A fuel cell stack which incorporates at least one of the cathode bond layers is also described herein, along with related processes for forming the cathode bond layer.

Reliability Assessment of Advanced Flip-clip Interconnect Electronic Package Assemblies under Extreme Cold Temperatures (-190 and -120 C)

NASA Technical Reports Server (NTRS)

Ramesham, Rajeshuni; Ghaffarian, Reza; Shapiro, Andrew; Napala, Phil A.; Martin, Patrick A.

2005-01-01

Flip-chip interconnect electronic package boards have been assembled, underfilled, non-destructively evaluated and subsequently subjected to extreme temperature thermal cycling to assess the reliability of this advanced packaging interconnect technology for future deep space, long-term, extreme temperature missions. In this very preliminary study, the employed temperature range covers military specifications (-55 C to 100 C), extreme cold Martian (-120 C to 115 C) and asteroid Nereus (-180 C to 25 C) environments. The resistance of daisy-chained, flip-chip interconnects were measured at room temperature and at various intervals as a function of extreme temperature thermal cycling. Electrical resistance measurements are reported and the tests to date have not shown significant change in resistance as a function of extreme temperature thermal cycling. However, the change in interconnect resistance becomes more noticeable with increasing number of thermal cycles. Further research work has been carried out to understand the reliability of flip-chip interconnect packages under extreme temperature applications (-190 C to 85 C) via continuously monitoring the daisy chain resistance. Adaptation of suitable diagnostic techniques to identify the failure mechanisms is in progress. This presentation will describe the experimental test results of flip-chip testing under extreme temperatures.

The Perceptions of U.S.-Based IT Security Professionals about the Effectiveness of IT Security Frameworks: A Quantitative Study

ERIC Educational Resources Information Center

Warfield, Douglas L.

2011-01-01

The evolution of information technology has included new methodologies that use information technology to control and manage various industries and government activities. Information Technology has also evolved as its own industry with global networks of interconnectivity, such as the Internet, and frameworks, models, and methodologies to control…

NASA EEE Parts and Advanced Interconnect Program (AIP)

NASA Technical Reports Server (NTRS)

Gindorf, T.; Garrison, A.

1996-01-01

none given From Program Objectives: I. Accelerate the readiness of new technologies through development of validation, assessment and test method/tools II. Provide NASA Projects infusion paths for emerging technologies III. Provide NASA Projects technology selection, application and validation guidelines for harware and processes IV. Disseminate quality assurance, reliability, validation, tools and availability information to the NASA community.

STEM Comes to Preschool

ERIC Educational Resources Information Center

Moomaw, Sally; Davis, Jaumall A.

2010-01-01

Math and science and the related technology and engineering are natural pairings. These four disciplines form the acronym STEM (Science, Technology, Engineering, and Math) and can be readily combined into an integrated curriculum for early childhood classrooms. Many educators believe that children learn best when disciplines are interconnected. An…

32 x 16 CMOS smart pixel array for optical interconnects

NASA Astrophysics Data System (ADS)

Kim, Jongwoo; Guilfoyle, Peter S.; Stone, Richard V.; Hessenbruch, John M.; Choquette, Kent D.; Kiamilev, Fouad E.

2000-05-01

Free space optical interconnects can increase throughput capacities and eliminate much of the energy consumption required for `all electronic' systems. High speed optical interconnects can be achieved by integrating optoelectronic devices with conventional electronics. Smart pixel arrays have been developed which use optical interconnects. An individual smart pixel cell is composed of a vertical cavity surface emitting laser (VCSEL), a photodetector, an optical receiver, a laser driver, and digital logic circuitry. Oxide-confined VCSELs are being developed to operate at 850 nm with a threshold current of approximately 1 mA. Multiple quantum well photodetectors are being fabricated from AlGaAs for use with the 850 nm VCSELs. The VCSELs and photodetectors are being integrated with complementary metal oxide semiconductor (CMOS) circuitry using flip-chip bonding. CMOS circuitry is being integrated with a 32 X 16 smart pixel array. The 512 smart pixels are serially linked. Thus, an entire data stream may be clocked through the chip and output electrically by the last pixel. Electrical testing is being performed on the CMOS smart pixel array. Using an on-chip pseudo random number generator, a digital data sequence was cycled through the chip verifying operation of the digital circuitry. Although, the prototype chip was fabricated in 1.2 micrometers technology, simulations have demonstrated that the array can operate at 1 Gb/s per pixel using 0.5 micrometers technology.

Accelerated Metastable Solid-liquid Interdiffusion Bonding with High Thermal Stability and Power Handling

NASA Astrophysics Data System (ADS)

Huang, Ting-Chia; Smet, Vanessa; Kawamoto, Satomi; Pulugurtha, Markondeya R.; Tummala, Rao R.

2018-01-01

Emerging high-performance systems are driving the need for advanced packaging solutions such as 3-D integrated circuits (ICs) and 2.5-D system integration with increasing performance and reliability requirements for off-chip interconnections. Solid-liquid interdiffusion (SLID) bonding resulting in all-intermetallic joints has been proposed to extend the applicability of solders, but faces fundamental and manufacturing challenges hindering its wide adoption. This paper introduces a Cu-Sn SLID interconnection technology, aiming at stabilization of the microstructure in the Cu6Sn5 metastable phase rather than the usual stable Cu3Sn phase. This enables formation of a void-free interface yielding higher mechanical strength than standard SLID bonding, as well as significantly reducing the transition time. The metastable SLID technology retains the benefits of standard SLID with superior I/O pitch scalability, thermal stability and current handling capability, while advancing assembly manufacturability. In the proposed concept, the interfacial reaction is controlled by introducing Ni(P) diffusion barrier layers, designed to effectively isolate the metastable Cu6Sn5 phase preventing any further transformation. Theoretical diffusion and kinetic models were applied to design the Ni-Cu-Sn interconnection stack to achieve the targeted joint composition. A daisy chain test vehicle was used to demonstrate this technology as a first proof of concept. Full transition to Cu6Sn5 was successfully achieved within a minute at 260°C as confirmed by scanning electron microscope (SEM) and x-ray energy dispersive spectroscopy (XEDS) analysis. The joint composition was stable through 10× reflow, with outstanding bond strength averaging 90 MPa. The metastable SLID interconnections also showed excellent electromigration performance, surviving 500 h of current stressing at 105 A/cm2 at 150°C.

Warpage Characteristics and Process Development of Through Silicon Via-Less Interconnection Technology.

PubMed

Shen, Wen-Wei; Lin, Yu-Min; Wu, Sheng-Tsai; Lee, Chia-Hsin; Huang, Shin-Yi; Chang, Hsiang-Hung; Chang, Tao-Chih; Chen, Kuan-Neng

2018-08-01

In this study, through silicon via (TSV)-less interconnection using the fan-out wafer-level-packaging (FO-WLP) technology and a novel redistribution layer (RDL)-first wafer level packaging are investigated. Since warpage of molded wafer is a critical issue and needs to be optimized for process integration, the evaluation of the warpage issue on a 12-inch wafer using finite element analysis (FEA) at various parameters is presented. Related parameters include geometric dimension (such as chip size, chip number, chip thickness, and mold thickness), materials' selection and structure optimization. The effect of glass carriers with various coefficients of thermal expansion (CTE) is also discussed. Chips are bonded onto a 12-inch reconstituted wafer, which includes 2 RDL layers, 3 passivation layers, and micro bumps, followed by using epoxy molding compound process. Furthermore, an optical surface inspector is adopted to measure the surface profile and the results are compared with the results from simulation. In order to examine the quality of the TSV-less interconnection structure, electrical measurement is conducted and the respective results are presented.

Manufacturability of the X Architecture at the 90-nm technology node

NASA Astrophysics Data System (ADS)

Smayling, Michael C.; Sarma, Robin C.; Nagata, Toshiyuki; Arora, Narain; Duane, Michael P.; Oemardani, Shiany; Shah, Santosh

2004-05-01

In this paper, we discuss the results from a test chip that demonstrate the manufacturability and integration-worthiness of the X Architecture at the 90-nm technology node. We discuss how a collaborative effort between the design and chip making communities used the current generation of mask, lithography, wafer processing, inspection and metrology equipment to create 45 degree wires in typical metal pitches for the upper layers on a 90-nm device in a production environment. Cadence Design Systems created the test structure design and chip validation tools for the project. Canon"s KrF ES3 and ArF AS2 scanners were used for the lithography. Applied Materials used its interconnect fabrication technologies to produce the multilayer copper, low-k interconnect on 300-mm wafers. The results were confirmed for critical dimension and defect levels using Applied Materials" wafer inspection and metrology systems.

A 30 GHz monolithic receive module technology assessment

NASA Technical Reports Server (NTRS)

Geddes, J.; Sokolov, V.; Bauhahn, P.; Contolatis, T.

1988-01-01

This report is a technology assessment relevant to the 30 GHz Monolithic Receive Module development. It is based on results obtained on the present NASA Contract (NAS3-23356) as well as on information gathered from literature and other industry sources. To date the on-going Honeywell program has concentrated on demonstrating the so-called interconnected receive module which consists of four monolithic chips - the low noise front-end amplifier (LNA), the five bit phase shifter (PS), the gain control amplifier (GC), and the RF to IF downconverter (RF/IF). Results on all four individual chips have been obtained and interconnection of the first three functions has been accomplished. Future work on this contract is aimed at a higher level of integration, i.e., integration of the first three functions (LNA + PS + GC) on a single GaAs chip. The report presents the status of this technology and projections of its future directions.

Emerging Communication Technologies (ECT) Phase 4 Report

NASA Technical Reports Server (NTRS)

Bastin, Gary L.; Harris, William G.; Marin, Jose A.; Nelson, Richard A.

2005-01-01

The Emerging Communication Technology (ECT) project investigated three First Mile communication technologies in support of NASA s Crew Exploration Vehicle (CEV), Advanced Range Technology Working Group (ARTWG), and the Advanced Spaceport Technology Working Group (ASTWG). These First Mile technologies have the purpose of interconnecting mobile users with existing Range Communication infrastructures on a 24/7 basis. ECT is a continuation of the Range Information System Management (RISM) task started in 2002. This is the fourth year of the project.

High Resolution Fabrication of Interconnection Lines Using Picosecond Laser and Controlled Deposition of Gold Nanoparticles

NASA Astrophysics Data System (ADS)

Shahmoon, Asaf; Strauß, Johnnes; Zafri, Hadar; Schmidt, Michael; Zalevsky, Zeev

In this paper we present the fabrication procedure as well as the preliminary experimental results of a novel method for construction of high resolution nanometric interconnection lines. The fabrication procedure relies on a self-assembly process of gold nanoparticles at specific predetermined nanostructures. The nanostructures for the self-assembly process are based on the focused ion beam (FIB) or scanning electron beam (SEM) technology. The assembled nanoparticles are being illuminated using a picosecond laser with a wavelength of 532 nm. Different pulse energies have been investigated. The paper aimed at developing a novel and reliable process for fabrication of interconnection lines encompass three different disciplines, self-assembly of nanometric particles, optics and microelectronic.

Wearables and the Internet of Things for Health: Wearable, Interconnected Devices Promise More Efficient and Comprehensive Health Care.

PubMed

Metcalf, David; Milliard, Sharlin T J; Gomez, Melinda; Schwartz, Michael

2016-01-01

In our recent book Health-e Everything: Wearables and the Internet of Things for Health, we capture in an interactive e-book format some global thought-leader perspectives as well as early examples of case studies and novel innovations that are driving this emerging technology domain. Here, we provide a brief snapshot of key findings related to these novel technologies and use cases, which are driving both health care practitioners and health consumers (patients). As technologists, having a firm understanding of customer-driven innovation and the actual user benefits of interconnective devices for health will help us engineer better solutions that are more targeted to the triple aim of better, faster, and cheaper health solutions.

It Is Risky Business: Three Essays on Ensuring Reliability, Security and Privacy in Technology-Mediated Settings

ERIC Educational Resources Information Center

Anderson, Catherine L.

2010-01-01

Today's interconnected technical environment creates unprecedented opportunities while simultaneously introducing risks. With economic, social and personal interactions increasingly occurring in technology-mediated settings new vulnerabilities are continually being introduced. This dissertation seeks to improve extant understanding of how…

Network Framing of Pest Management Knowledge and Practice

ERIC Educational Resources Information Center

Moore, Keith M.

2008-01-01

Conventional technology transfer is based on the assumption that autonomous individuals independently make behavioral decisions. In contrast, Actor-Network Theory (ANT) suggests that people and technologies are interconnected in ways that reinforce and reproduce some types of knowledge and consequent behavioral practices, but not others. Research…

Supporting Teachers Learning through the Collaborative Design of Technology-Enhanced Science Lessons

ERIC Educational Resources Information Center

Kafyulilo, Ayoub C.; Fisser, Petra; Voogt, Joke

2015-01-01

This study used the Interconnected Model of Professional Growth (Clarke & Hollingsworth in "Teaching and Teacher Education," 18, 947-967, 2002) to unravel how science teachers' technology integration knowledge and skills developed in a professional development arrangement. The professional development arrangement used Technological…

Miniaturized tool for optogenetics based on an LED and an optical fiber interfaced by a silicon housing.

PubMed

Schwaerzle, M; Elmlinger, P; Paul, O; Ruther, P

2014-01-01

This paper reports on the design, simulation, fabrication and characterization of a tool for optogenetic experiments based on a light emitting diode (LED). A minimized silicon (Si) interface houses the LED and aligns it to an optical fiber. With a Si housing size of 550×500×380 μm(3) and an electrical interconnection of the LED by a highly flexible polyimide (PI) ribbon cable is the system very variable. PI cables and Si housings are fabricated using established microsystem technologies. A 270×220×50 μm(3) bare LED chip is flip-chip-bonded onto the PI cable. The Si housing is adhesively attached to the PI cable, thereby hosting the LED in a recess. An opposite recess guides the optical fiber with a diameter of 125 μm. An aperture in-between restricts the emitted LED light to the fiber core. The optical fiber is adhesively fixed into the Si housing recess. An optical output intensity at the fiber end facet of 1.71 mW/mm(2) was achieved at a duty cycle of 10 % and a driving current of 30 mA.

Special-purpose computer for holography HORN-4 with recurrence algorithm

NASA Astrophysics Data System (ADS)

Shimobaba, Tomoyoshi; Hishinuma, Sinsuke; Ito, Tomoyoshi

2002-10-01

We designed and built a special-purpose computer for holography, HORN-4 (HOlographic ReconstructioN) using PLD (Programmable Logic Device) technology. HORN computers have a pipeline architecture. We use HORN-4 as an attached processor to enhance the performance of a general-purpose computer when it is used to generate holograms using a "recurrence formulas" algorithm developed by our previous paper. In the HORN-4 system, we designed the pipeline by adopting our "recurrence formulas" algorithm which can calculate the phase on a hologram. As the result, we could integrate the pipeline composed of 21 units into one PLD chip. The units in the pipeline consists of one BPU (Basic Phase Unit) unit and twenty CU (Cascade Unit) units. These CU units can compute twenty light intensities on a hologram plane at one time. By mounting two of the PLD chips on a PCI (Peripheral Component Interconnect) universal board, HORN-4 can calculate holograms at high speed of about 42 Gflops equivalent. The cost of HORN-4 board is about 1700 US dollar. We could obtain 800×600 grids hologram from a 3D-image composed of 415 points in about 0.45 sec with the HORN-4 system.

Surface nitridation improves bone cell response to melt-derived bioactive silicate/borosilicate glass composite scaffolds.

PubMed

Orgaz, Felipe; Dzika, Alexandra; Szycht, Olga; Amat, Daniel; Barba, Flora; Becerra, José; Santos-Ruiz, Leonor

2016-01-01

Novel bioactive amorphous glass-glass composite scaffolds (ICIE16/BSG) with interconnected porosity have been developed. Hierarchically interconnected porous glass scaffolds were prepared from a mixture of two melt-derived glasses: a ICIE16 bioactive glass that was previously developed by Wu et al. (2011) to prevent crystallization, and a borosilicate glass of composition 73.48 SiO2-11.35 B2O3-15.15 Na2O (wt%). The resulting melt derived glass-glass composite scaffolds (ICIE16/BSG) were subject to surface functionalization to further improve its interaction with biological systems. Surface functionalization was performed by a nitridation process with hot gas N2/ammonia at 550°C for 2h, obtaining the ICIE16/BSG-NITRI. Evaluation of the degradation rate and the conversion to hydroxyapatite after immersion in simulated body fluid predicted a good biological activity of all the scaffolds, but particularly of the nitrided ones. In vitro evaluation of osteoblastic cells cultured onto the nitrided and non-nitrided scaffolds showed cell attachment, proliferation and differentiation on all scaffolds, but both proliferation and differentiation were improved in the nitrided ICIE16/BSG-NITRI. Biomaterials are often required in the clinic to stimulate bone repair. We have developed a novel bioglass (ICIE16/SBG-NITRI) that can be sintered into highly porous 3D scaffolds, and we have further improved its bioactivity by nitridation. ICIE16/SBG-NITRI was synthesized from a mixture of two melt-derived glasses through combined gel casting and foam replication techniques, followed by nitridation. To mimic bone, it presents high-interconnected porosity while being mechanically stable. Nitridation improved its reactivity and bioactivity facilitating its resorption and the deposition of apatite (bone-like mineral) on its surface and increasing its degradation rate. The nitrided surface also improved the bioglass' interaction with bone cells, which were found to attach better to ICIE16/SBG-NITRI and to differentiate earlier on its surface. Copyright © 2015 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

Optoelectronic Technology Consortium: Precompetitive Consortium for Optoelectronic Interconnect Technology

DTIC Science & Technology

1992-09-01

demonstrating the producibility of optoelectronic components for high-density/high-data-rate processors and accelerating the insertion of this technology...technology development stage, OETC will advance the development of optical components, produce links for a multiboard processor testbed demonstration, and...components that are affordable, initially at <$100 per line, and reliable, with a li~e BER᝺-15 and MTTF >10 6 hours. Under the OETC program, Honeywell will

Technique for Determination of Rational Boundaries in Combining Construction and Installation Processes Based on Quantitative Estimation of Technological Connections

NASA Astrophysics Data System (ADS)

Gusev, E. V.; Mukhametzyanov, Z. R.; Razyapov, R. V.

2017-11-01

The problems of the existing methods for the determination of combining and technologically interlinked construction processes and activities are considered under the modern construction conditions of various facilities. The necessity to identify common parameters that characterize the interaction nature of all the technology-related construction and installation processes and activities is shown. The research of the technologies of construction and installation processes for buildings and structures with the goal of determining a common parameter for evaluating the relationship between technologically interconnected processes and construction works are conducted. The result of this research was to identify the quantitative evaluation of interaction construction and installation processes and activities in a minimum technologically necessary volume of the previous process allowing one to plan and organize the execution of a subsequent technologically interconnected process. The quantitative evaluation is used as the basis for the calculation of the optimum range of the combination of processes and activities. The calculation method is based on the use of the graph theory. The authors applied a generic characterization parameter to reveal the technological links between construction and installation processes, and the proposed technique has adaptive properties which are key for wide use in organizational decisions forming. The article provides a written practical significance of the developed technique.

Semiconductor lasers for versatile applications from global communications to on-chip interconnects

NASA Astrophysics Data System (ADS)

Arai, Shigehisa

2015-01-01

Since semiconductor lasers were realized in 1962, various efforts have been made to enrich human life thorough novel equipments and services. Among them optical fiber communications in global communications have brought out marvelous information technology age represented by the internet. In this paper, emerging topics made on GaInAsP/InP based long-wavelength lasers toward ultra-low power consumption semiconductor lasers for optical interconnects in supercomputers as well as in future LSIs are presented.

Development of low cost custom hybrid microcircuit technology

NASA Technical Reports Server (NTRS)

Perkins, K. L.; Licari, J. J.

1981-01-01

Selected potentially low cost, alternate packaging and interconnection techniques were developed and implemented in the manufacture of specific NASA/MSFC hardware, and the actual cost savings achieved by their use. The hardware chosen as the test bed for this evaluation ws the hybrids and modules manufactured by Rockwell International fo the MSFC Flight Accelerometer Safety Cut-Off System (FASCOS). Three potentially low cost packaging and interconnection alternates were selected for evaluation. This study was performed in three phases: hardware fabrication and testing, cost comparison, and reliability evaluation.

A Course on Energy Technology and Policy

ERIC Educational Resources Information Center

Edgar, Thomas F.

2007-01-01

The emerging energy situation in the United States puts chemical engineering at the forefront of the large research and education effort that will need to be undertaken during the next 20 years. Chemical engineering undergraduates and graduate students will need to be literate on energy alternatives and the interconnection of technology,…

Embedded 100 Gbps Photonic Components

DOE Office of Scientific and Technical Information (OSTI.GOV)

Kuznia, Charlie

This innovation to fiber optic component technology increases the performance, reduces the size and reduces the power consumption of optical communications within dense network systems, such as advanced distributed computing systems and data centers. VCSEL technology is enabling short-reach (< 100 m) and >100 Gbps optical interconnections over multi-mode fiber in commercial applications.

The Federal Government and Information Technology Standards: Building the National Information Infrastructure.

ERIC Educational Resources Information Center

Radack, Shirley M.

1994-01-01

Examines the role of the National Institute of Standards and Technology (NIST) in the development of the National Information Infrastructure (NII). Highlights include the standards process; voluntary standards; Open Systems Interconnection problems; Internet Protocol Suite; consortia; government's role; and network security. (16 references) (LRW)

Multi-gigabit optical interconnects for next-generation on-board digital equipment

NASA Astrophysics Data System (ADS)

Venet, Norbert; Favaro, Henri; Sotom, Michel; Maignan, Michel; Berthon, Jacques

2017-11-01

Parallel optical interconnects are experimentally assessed as a technology that may offer the high-throughput data communication capabilities required to the next-generation on-board digital processing units. An optical backplane interconnect was breadboarded, on the basis of a digital transparent processor that provides flexible connectivity and variable bandwidth in telecom missions with multi-beam antenna coverage. The unit selected for the demonstration required that more than tens of Gbit/s be supported by the backplane. The demonstration made use of commercial parallel optical link modules at 850 nm wavelength, with 12 channels running at up to 2.5 Gbit/s. A flexible optical fibre circuit was developed so as to route board-to-board connections. It was plugged to the optical transmitter and receiver modules through 12-fibre MPO connectors. BER below 10-14 and optical link budgets in excess of 12 dB were measured, which would enable to integrate broadcasting. Integration of the optical backplane interconnect was successfully demonstrated by validating the overall digital processor functionality.

Multi-gigabit optical interconnects for next-generation on-board digital equipment

NASA Astrophysics Data System (ADS)

Venet, Norbert; Favaro, Henri; Sotom, Michel; Maignan, Michel; Berthon, Jacques

2004-06-01

Parallel optical interconnects are experimentally assessed as a technology that may offer the high-throughput data communication capabilities required to the next-generation on-board digital processing units. An optical backplane interconnect was breadboarded, on the basis of a digital transparent processor that provides flexible connectivity and variable bandwidth in telecom missions with multi-beam antenna coverage. The unit selected for the demonstration required that more than tens of Gbit/s be supported by the backplane. The demonstration made use of commercial parallel optical link modules at 850 nm wavelength, with 12 channels running at up to 2.5 Gbit/s. A flexible optical fibre circuit was developed so as to route board-to-board connections. It was plugged to the optical transmitter and receiver modules through 12-fibre MPO connectors. BER below 10-14 and optical link budgets in excess of 12 dB were measured, which would enable to integrate broadcasting. Integration of the optical backplane interconnect was successfully demonstrated by validating the overall digital processor functionality.

White beam analysis of coupling between precipitation and plasticdeformation during electromigration in a passivated Al(0.5wt. percent Cu)interconnect

DOE Office of Scientific and Technical Information (OSTI.GOV)

Barabash, R.I.; Ice, G.E.; Tamura, N.

2005-09-01

The scaling of device dimensions with a simultaneous increase in functional density imposes a challenge to materials technology and reliability of interconnects. White beam X-ray microdiffraction is particularly well suited for the in situ study of electromigration. M.A. Krivoglaz theory was applied for the interpretation of white beam diffraction. The technique was used to probe microstructure in interconnects and has recently been able to monitor the onset of plastic deformation induced by mass transport during electromigration in Al(Cu) lines even before any macroscopic damage became visible. In the present paper, we demonstrate that the evolution of the dislocation structure duringmore » electromigration is highly inhomogeneous and results in the formation of unpaired randomly distributed geometrically necessary dislocations as well as geometrically necessary dislocation boundaries. When almost all unpaired dislocations and dislocation walls with the density n+ are parallel (as in the case of Al-based interconnects), the anisotropy in the scattering properties of the material becomes important, and the electrical properties of the interconnect depend strongly on the direction of the electric current relative to the orientation of the dislocation network. A coupling between the dissolution, growth and reprecipitation of Al2Cu precipitates and the electromigration-induced plastic deformation of grains in interconnects is observed.« less

Biofabrication of a PLGA-TCP-based porous bioactive bone substitute with sustained release of icaritin.

PubMed

Xie, Xin-Hui; Wang, Xin-Luan; Zhang, Ge; He, Yi-Xin; Leng, Yang; Tang, Ting-Ting; Pan, Xiaohua; Qin, Ling

2015-08-01

A phytomolecule, icaritin, has been identified and shown to be osteopromotive for the prevention of osteoporosis and osteonecrosis. This study aimed to produce a bioactive poly (l-lactide-co-glycolide)-tricalcium phosphate (PLGA-TCP)-based porous scaffold incorporating the osteopromotive phytomolecule icaritin, using a fine spinning technology. Both the structure and the composition of icaritin-releasing PLGA-TCP-based scaffolds were evaluated by scanning electron microscopy (SEM). The porosity was quantified by both water absorption and micro-computed tomography (micro-CT). The mechanical properties were evaluated using a compression test. In vitro release of icaritin from the PLGA-TCP scaffold was quantified by high-performance liquid chromatography (HPLC). The attachment, proliferation and osteogenic differentiation of bone marrow mesenchymal stem cells (BMSCs) on the composite scaffold were evaluated. Both an in vitro cytotoxicity test and an in vivo test via muscular implantation were conducted to confirm the scaffold's biocompatibility. The results showed that the PLGA-TCP-icaritin composite scaffold was porous, with interconnected macro- (about 480 µm) and micropores (2-15 µm). The mechanical properties of the PLGA-TCP-icaritin scaffold were comparable with those of the pure PLGA-TCP scaffold, yet was spinning direction-dependent. Icaritin content was detected in the medium and increased with time. The PLGA-TCP-icaritin scaffold facilitated the attachment, proliferation and osteogenic differentiation of BMSCs. In vitro cytotoxicity test and in vivo intramuscular implantation showed that the composite scaffold had no toxicity with good biocompatibility. In conclusion, an osteopromotive phytomolecule, icaritin, was successfully incorporated into PLGA-TCP to form an innovative porous composite scaffold with sustained release of osteopromotive icaritin, and this scaffold had good biocompatibility and osteopromotion, suggesting its potential for orthopaedic applications. Copyright © 2012 John Wiley & Sons, Ltd.

3D Printing of Scaffolds for Tissue Regeneration Applications

PubMed Central

Do, Anh-Vu; Khorsand, Behnoush; Geary, Sean M.; Salem, Aliasger K.

2015-01-01

The current need for organ and tissue replacement, repair and regeneration for patients is continually growing such that supply is not meeting the high demand primarily due to a paucity of donors as well as biocompatibility issues that lead to immune rejection of the transplant. In an effort to overcome these drawbacks, scientists working in the field of tissue engineering and regenerative medicine have investigated the use of scaffolds as an alternative to transplantation. These scaffolds are designed to mimic the extracellular matrix (ECM) by providing structural support as well as promoting attachment, proliferation, and differentiation with the ultimate goal of yielding functional tissues or organs. Initial attempts at developing scaffolds were problematic and subsequently inspired a growing interest in 3D printing as a mode for generating scaffolds. Utilizing three-dimensional printing (3DP) technologies, ECM-like scaffolds can be produced with a high degree of complexity and precision, where fine details can be included at a micron level. In this review, we discuss the criteria for printing viable and functional scaffolds, scaffolding materials, and 3DP technologies used to print scaffolds for tissue engineering. A hybrid approach, employing both natural and synthetic materials, as well as multiple printing processes may be the key to yielding an ECM-like scaffold with high mechanical strength, porosity, interconnectivity, biocompatibility, biodegradability, and high processability. Creating such biofunctional scaffolds could potentially help to meet the demand by patients for tissues and organs without having to wait or rely on donors for transplantation. PMID:26097108

Laminar flow assisted anisotropic bacteria absorption for chemotaxis delivery of bacteria-attached microparticle

NASA Astrophysics Data System (ADS)

Huh, Keon; Oh, Darong; Son, Seok Young; Yoo, Hyung Jung; Song, Byeonghwa; Cho, Dong-il Dan; Seo, Jong-Mo; Kim, Sung Jae

2016-12-01

The concepts of microrobots has been drawn significant attentions recently since its unprecedented applicability in nanotechnology and biomedical field. Bacteria attached microparticles presented in this work are one of pioneering microrobot technology for self-propulsion or producing kinetic energy from ambient for their motions. Microfluidic device, especially utilizing laminar flow characteristics, were employed for anisotropic attachment of Salmonella typhimurium flagellated chemotactic bacteria to 30 um × 30 um and 50 um × 50 um microparticles that made of biodegradable polymer. Any toxic chemicals or harmful treatments were excluded during the attachment process and it finished within 100 s for the anisotropic attachment. The attachments were directly confirmed by fluorescent intensity changes and SEM visualization. Chemotaxis motions were tracked using aspartate and the maximum velocity of the bacteria-attached microrobot was measured to be 5 um/s which is comparable to prior state of art technologies. This reusable and scalable method could play a key role in chemotaxis delivery of functional microparticles such as drug delivery system.

IFLA General Conference 1988. Division of Management and Technology. Section on Information Technology; Section on Statistics; Section on Library Buildings and Equipment; Section on Conservation; Round Table on Management of Library Associations; Round Table on AV Media.

ERIC Educational Resources Information Center

International Federation of Library Associations, The Hague (Netherlands).

The 15 papers in this compilation focus on library nagement and technology, including information technology, statistics, buildings and equipment, and conservation: (1) "Information Control: OSI (Open Systems Interconnection) and Networking Strategies" (Neil McClean, United Kingdom); (2) "OSI in Australia: Potential, Planning,…

Nano-Nucleation Characteristic of Cu-Ag Alloy Directly Electrodeposited on W Diffusion Barrier for Microelectronic Device Interconnect.

PubMed

Kim, Kang O; Kim, Sunjung

2016-05-01

Cu-Ag alloy interconnect is promising for ultra-large-scale integration (ULSI) microelectronic system of which device dimension keeps shrinking. In this study, seedless electrodeposition of Cu-Ag alloy directly on W diffusion barrier as interconnect technology is presented in respect of nano-nucleation control. Chemical equilibrium state of electrolyte was fundamentally investigated according to the pH of electrolyte because direct nano-nucleation of Cu-Ag alloy on W surface is challenging. Chelation behavior of Cu2+ and Ag+ ions with citrate (Cit) and ammonia ligands was dependent on the pH of electrolyte. The amount and kind of Cu- and Ag-based complexes determine the deposition rate, size, elemental composition, and surface morphology of Cu-Ag alloy nano-nuclei formed on W surface.

Optimal condition sampling of infrastructure networks.

DOT National Transportation Integrated Search

2009-10-15

Transportation infrastructure systems consist of spatially extensive and longlived sets of interconnected : facilities. Over the past two decades, several new nondestructive inspection technologies have been : developed and applied in collectin...

Electricity exchange and the valuation of transnational transmission access: A case study of intra-regional integration of the electric industries of Argentina and Chile

NASA Astrophysics Data System (ADS)

Brereton, Beverly Ann

The interconnection of neighboring electricity networks provides opportunities for the realization of synergies between electricity systems. Examples of the synergies to be realized are the rationalized management of the electricity networks whose fuel source domination differs, and the exploitation of non-coincident system peak demands. These factors allow technology diversity in the satisfaction of electricity demand, the coordination of planning and maintenance schedules between the networks by exploiting the cost differences in the pool of generation assets and the load configuration differences in the neighboring locations. The interconnection decision studied in this dissertation focused on the electricity networks of Argentina and Chile whose electricity systems operate in isolation at the current time. The cooperative game-theoretic framework was applied in the analysis of the decision facing the two countries and the net surplus to be derived from interconnection was evaluated. Measurement of the net gains from interconnection used in this study were reflected in changes in generating costs under the assumption that demand is fixed under all scenarios. With the demand for electricity assumed perfectly inelastic, passive or aggressive bidding strategies were considered under the scenarios for the generators in the two countries. The interconnection decision was modeled using a linear power flow model which utilizes linear programming techniques to reflect dispatch procedures based on generation bids. Results of the study indicate that the current interconnection project between Argentina and Chile will not result in positive net surplus under a variety of scenarios. Only under significantly reduced interconnection cost will the venture prove attractive. Possible sharing mechanisms were also explored in the research and a symmetric distribution of the net surplus to be derived under the reduced interconnection cost scenario was recommended to preserve equity in the allocation of the interconnection gains.

Generational Theory: Implications for Recruiting the Millennials

DTIC Science & Technology

2006-03-10

basic forces of influence on an individual considering military service: Parents, technology , the New economy, education, and the media.72 Some of...affect this generation specifically. These five forces are all interconnected. For example, the rise in technology is driving the new economy...Parents are demanding more from education. Both technology and the new economy are requiring students who are better educated. And so on. When looking

Cu Pillar Low Temperature Bonding and Interconnection Technology of for 3D RF Microsystem

NASA Astrophysics Data System (ADS)

Shi, G. X.; Qian, K. Q.; Huang, M.; Yu, Y. W.; Zhu, J.

2018-03-01

In this paper 3D interconnects technologies used Cu pillars are discussed with respect to RF microsystem. While 2.5D Si interposer and 3D packaging seem to rely to cu pillars for the coming years, RF microsystem used the heterogeneous chip such as GaAs integration with Si interposers should be at low temperature. The pillars were constituted by Cu (2 micron) -Ni (2 micron) -Cu (3 micron) -Sn (1 micron) multilayer metal and total height is 8 micron on the front-side of the wafer by using electroplating. The wafer backside Cu pillar is obtained by temporary bonding, thinning and silicon surface etching. The RF interposers are stacked by Cu-Sn eutectic bonding at 260 °C. Analyzed the reliability of different pillar bonding structure.

3D interconnect metrology in CMS/ITRI

NASA Astrophysics Data System (ADS)

Ku, Y. S.; Shyu, D. M.; Hsu, W. T.; Chang, P. Y.; Chen, Y. C.; Pang, H. L.

2011-05-01

Semiconductor device packaging technology is rapidly advancing, in response to the demand for thinner and smaller electronic devices. Three-dimensional chip/wafer stacking that uses through-silicon vias (TSV) is a key technical focus area, and the continuous development of this novel technology has created a need for non-contact characterization. Many of these challenges are novel to the industry due to the relatively large variety of via sizes and density, and new processes such as wafer thinning and stacked wafer bonding. This paper summarizes the developing metrology that has been used during via-middle & via-last TSV process development at EOL/ITRI. While there is a variety of metrology and inspection applications for 3D interconnect processing, the main topics covered here are via CD/depth measurement, thinned wafer inspection and wafer warpage measurement.

Polymer waveguides for electro-optical integration in data centers and high-performance computers.

PubMed

Dangel, Roger; Hofrichter, Jens; Horst, Folkert; Jubin, Daniel; La Porta, Antonio; Meier, Norbert; Soganci, Ibrahim Murat; Weiss, Jonas; Offrein, Bert Jan

2015-02-23

To satisfy the intra- and inter-system bandwidth requirements of future data centers and high-performance computers, low-cost low-power high-throughput optical interconnects will become a key enabling technology. To tightly integrate optics with the computing hardware, particularly in the context of CMOS-compatible silicon photonics, optical printed circuit boards using polymer waveguides are considered as a formidable platform. IBM Research has already demonstrated the essential silicon photonics and interconnection building blocks. A remaining challenge is electro-optical packaging, i.e., the connection of the silicon photonics chips with the system. In this paper, we present a new single-mode polymer waveguide technology and a scalable method for building the optical interface between silicon photonics chips and single-mode polymer waveguides.

Processing and Characterization of Thousand-Hour 500 C Durable 4H-SiC JFET Integrated Circuits

NASA Technical Reports Server (NTRS)

Spry, David J.; Neudeck, Philip G.; Chen, Liangyu; Lukco, Dorothy; Chang, Carl W.; Beheim, Glenn M.; Krasowski, Michael J.; Prokop, Norman F.

2016-01-01

This work reports fabrication and testing of integrated circuits (ICs) with two levels of interconnect that consistently achieve greater than 1000 hours of stable electrical operation at 500 C in air ambient. These ICs are based on 4H-SiC junction field effect transistor (JFET) technology that integrates hafnium ohmic contacts with TaSi2 interconnects and SiO2 and Si3N4 dielectric layers over 1-m scale vertical topology. Following initial burn-in, important circuit parameters remain stable for more than 1000 hours of 500 C operational testing. These results advance the technology foundation for realizing long-term durable 500 C ICs with increased functional capability for sensing and control combustion engine, planetary, deep-well drilling, and other harsh-environment applications.

Processing and Characterization of Thousand-Hour 500 C Durable 4H-SiC JFET Integrated Circuits

NASA Technical Reports Server (NTRS)

Spry, David J.; Neudeck, Philip G.; Chen, Liang-Yu; Lukco, Dorothy; Chang, Carl W.; Beheim, Glenn M.; Krasowski, Michael J.; Prokop, Norman F.

2016-01-01

This work reports fabrication and testing of integrated circuits (ICs) with two levels of interconnect that consistently achieve greater than 1000 hours of stable electrical operation at 500 C in air ambient. These ICs are based on 4H-SiC junction field effect transistor (JFET) technology that integrates hafnium ohmic contacts with TaSi2 interconnects and SiO2 and Si3N4 dielectric layers over approximately 1-micrometer scale vertical topology. Following initial burn-in, important circuit parameters remain stable for more than 1000 hours of 500 C operational testing. These results advance the technology foundation for realizing long-term durable 500 C ICs with increased functional capability for sensing and control combustion engine, planetary, deep-well drilling, and other harsh-environment applications.

Strategic siting and regional grid interconnections key to low-carbon futures in African countries

PubMed Central

Deshmukh, Ranjit; Ndhlukula, Kudakwashe; Radojicic, Tijana; Reilly-Moman, Jessica; Phadke, Amol; Kammen, Daniel M.; Callaway, Duncan S.

2017-01-01

Recent forecasts suggest that African countries must triple their current electricity generation by 2030. Our multicriteria assessment of wind and solar potential for large regions of Africa shows how economically competitive and low-environmental–impact renewable resources can significantly contribute to meeting this demand. We created the Multicriteria Analysis for Planning Renewable Energy (MapRE) framework to map and characterize solar and wind energy zones in 21 countries in the Southern African Power Pool (SAPP) and the Eastern Africa Power Pool (EAPP) and find that potential is several times greater than demand in many countries. Significant fractions of demand can be quickly served with “no-regrets” options—or zones that are low-cost, low-environmental impact, and highly accessible. Because no-regrets options are spatially heterogeneous, international interconnections are necessary to help achieve low-carbon development for the region as a whole, and interconnections that support the best renewable options may differ from those planned for hydropower expansion. Additionally, interconnections and selecting wind sites to match demand reduce the need for SAPP-wide conventional generation capacity by 9.5% in a high-wind scenario, resulting in a 6–20% cost savings, depending on the avoided conventional technology. Strategic selection of low-impact and accessible zones is more cost effective with interconnections compared with solutions without interconnections. Overall results are robust to multiple load growth scenarios. Together, results show that multicriteria site selection and deliberate planning of interconnections may significantly increase the economic and environmental competitiveness of renewable alternatives relative to conventional generation. PMID:28348209

Strategic siting and regional grid interconnections key to low-carbon futures in African countries

DOE Office of Scientific and Technical Information (OSTI.GOV)

Wu, Grace C.; Deshmukh, Ranjit; Ndhlukula, Kudakwashe

2017-03-27

Recent forecasts suggest that African countries must triple their current electricity generation by 2030. Our multicriteria assessment of wind and solar potential for large regions of Africa shows how economically competitive and low-environmental– impact renewable resources can significantly contribute to meeting this demand. We created the Multicriteria Analysis for Planning Renewable Energy (MapRE) framework to map and characterize solar and wind energy zones in 21 countries in the Southern African Power Pool (SAPP) and the Eastern Africa Power Pool (EAPP) and find that potential is several times greater than demand in many countries. Significant fractions of demand can be quicklymore » served with “no-regrets” options—or zones that are low-cost, low-environmental impact, and highly accessible. Because no-regrets options are spatially heterogeneous, international interconnections are necessary to help achieve low-carbon development for the region as a whole, and interconnections that support the best renewable options may differ from those planned for hydropower expansion. Additionally, interconnections and selecting wind sites to match demand reduce the need for SAPP-wide conventional generation capacity by 9.5% in a high-wind scenario, resulting in a 6–20% cost savings, depending on the avoided conventional technology. Strategic selection of low-impact and accessible zones is more cost effective with interconnections compared with solutions without interconnections. In conclusion, the overall results are robust to multiple load growth scenarios. Together, results show that multicriteria site selection and deliberate planning of interconnections may significantly increase the economic and environmental competitiveness of renewable alternatives relative to conventional generation.« less

Strategic siting and regional grid interconnections key to low-carbon futures in African countries.

PubMed

Wu, Grace C; Deshmukh, Ranjit; Ndhlukula, Kudakwashe; Radojicic, Tijana; Reilly-Moman, Jessica; Phadke, Amol; Kammen, Daniel M; Callaway, Duncan S

2017-04-11

Recent forecasts suggest that African countries must triple their current electricity generation by 2030. Our multicriteria assessment of wind and solar potential for large regions of Africa shows how economically competitive and low-environmental-impact renewable resources can significantly contribute to meeting this demand. We created the Multicriteria Analysis for Planning Renewable Energy (MapRE) framework to map and characterize solar and wind energy zones in 21 countries in the Southern African Power Pool (SAPP) and the Eastern Africa Power Pool (EAPP) and find that potential is several times greater than demand in many countries. Significant fractions of demand can be quickly served with "no-regrets" options-or zones that are low-cost, low-environmental impact, and highly accessible. Because no-regrets options are spatially heterogeneous, international interconnections are necessary to help achieve low-carbon development for the region as a whole, and interconnections that support the best renewable options may differ from those planned for hydropower expansion. Additionally, interconnections and selecting wind sites to match demand reduce the need for SAPP-wide conventional generation capacity by 9.5% in a high-wind scenario, resulting in a 6-20% cost savings, depending on the avoided conventional technology. Strategic selection of low-impact and accessible zones is more cost effective with interconnections compared with solutions without interconnections. Overall results are robust to multiple load growth scenarios. Together, results show that multicriteria site selection and deliberate planning of interconnections may significantly increase the economic and environmental competitiveness of renewable alternatives relative to conventional generation.

All-optical LAN architectures based on arrayed waveguide grating multiplexers

NASA Astrophysics Data System (ADS)

Woesner, Hagen

1998-10-01

The paper presents optical LAN topologies which are made possible using an Arrayed Waveguide Grating Multiplexer (AWGM) instead of a passive star coupler to interconnect stations in an all-optical LAN. Due to the collision-free nature of an AWGM it offers the n-fold bandwidth compared to the star coupler. Virtual ring topologies appear (one ring on each wavelength) if the number of stations attached to the AWGM is a prime number. A method to construct larger networks using Cayley graphs is shown. An access protocol to avoid collisions on the proposed network is outlined.

A Framework of Complex Adaptive Systems: Parents As Partners in the Neonatal Intensive Care Unit.

PubMed

DʼAgata, Amy L; McGrath, Jacqueline M

2016-01-01

Advances in neonatal care are allowing for increased infant survival; however, neurodevelopmental complications continue. Using a complex adaptive system framework, a broad analysis of the network of agents most influential to vulnerable infants in the neonatal intensive care unit (NICU) is presented: parent, nurse, and organization. By exploring these interconnected relationships and the emergent behaviors, a model of care that increases parental caregiving in the NICU is proposed. Supportive parent caregiving early in an infant's NICU stay has the potential for more sensitive caregiving and enhanced opportunities for attachment, perhaps positively impacting neurodevelopment.

Brand Attachment to Specific Technology, Means Efficacy, and Organizational Commitment

ERIC Educational Resources Information Center

McReynolds, Kevin V.

2010-01-01

This study was exploratory in nature and examined the organizational commitment (dependent variable) impact of evangelistic marketing and training efforts. There was sufficient evidence from the practitioner press that many technology companies have adopted an evangelism marketing approach. This marketing method seeks to create attachments to…

DOE Office of Scientific and Technical Information (OSTI.GOV)

Liss, W.; Dybel, M.; West, R.

This report covers the first year's work performed by the Gas Technology Institute and Encorp Inc. under subcontract to the National Renewable Energy Laboratory. The objective of this three-year contract is to develop innovative grid interconnection and control systems. This supports the advancement of distributed generation in the marketplace by making installations more cost-effective and compatible across the electric power and energy management systems. Specifically, the goals are: (1) To develop and demonstrate cost-effective distributed power grid interconnection products and software and communication solutions applicable to improving the economics of a broad range of distributed power systems, including existing, emerging,more » and other power generation technologies. (2) To enhance the features and capabilities of distributed power products to integrate, interact, and provide operational benefits to the electric power and advanced energy management systems. This includes features and capabilities for participating in resource planning, the provision of ancillary services, and energy management. Specific topics of this report include the development of an advanced controller, a power sensing board, expanded communication capabilities, a revenue-grade meter interface, and a case study of an interconnection distributed power system application that is a model for demonstrating the functionalities of the design of the advanced controller.« less

Implementation and Integration of Regional Health Care Data Networks in the Hellenic National Health Service

PubMed Central

Vidalis, Ioannis; Papanikolaou, Christos; Vagelatos, Aristides

2002-01-01

Background Modern health care is provided with close cooperation among many different institutions and professionals, using their specialized expertise in a common effort to deliver best-quality and, at the same time, cost-effective services. Within this context of the growing need for information exchange, the demand for realization of data networks interconnecting various health care institutions at a regional level, as well as a national level, has become a practical necessity. Objectives To present the technical solution that is under consideration for implementing and interconnecting regional health care data networks in the Hellenic National Health System. Methods The most critical requirements for deploying such a regional health care data network were identified as: fast implementation, security, quality of service, availability, performance, and technical support. Results The solution proposed is the use of proper virtual private network technologies for implementing functionally-interconnected regional health care data networks. Conclusions The regional health care data network is considered to be a critical infrastructure for further development and penetration of information and communication technologies in the Hellenic National Health System. Therefore, a technical approach was planned, in order to have a fast cost-effective implementation, conforming to certain specifications. PMID:12554551

Implementation and integration of regional health care data networks in the Hellenic National Health Service.

PubMed

Lampsas, Petros; Vidalis, Ioannis; Papanikolaou, Christos; Vagelatos, Aristides

2002-12-01

Modern health care is provided with close cooperation among many different institutions and professionals, using their specialized expertise in a common effort to deliver best-quality and, at the same time, cost-effective services. Within this context of the growing need for information exchange, the demand for realization of data networks interconnecting various health care institutions at a regional level, as well as a national level, has become a practical necessity. To present the technical solution that is under consideration for implementing and interconnecting regional health care data networks in the Hellenic National Health System. The most critical requirements for deploying such a regional health care data network were identified as: fast implementation, security, quality of service, availability, performance, and technical support. The solution proposed is the use of proper virtual private network technologies for implementing functionally-interconnected regional health care data networks. The regional health care data network is considered to be a critical infrastructure for further development and penetration of information and communication technologies in the Hellenic National Health System. Therefore, a technical approach was planned, in order to have a fast cost-effective implementation, conforming to certain specifications.

Integrated Avionics System (IAS), Integrating 3-D Technology On A Spacecraft Panel

NASA Technical Reports Server (NTRS)

Hunter, Don J.; Halpert, Gerald

1999-01-01

As spacecraft designs converge toward miniaturization, and with the volumetric and mass challenges placed on avionics, programs will continue to advance the "state of the art" in spacecraft system development with new challenges to reduce power, mass and volume. Traditionally, the trend is to focus on high-density 3-D packaging technologies. Industry has made significant progress in 3-D technologies, and other related internal and external interconnection schemes. Although new technologies have improved packaging densities, a system packaging architecture is required that not only reduces spacecraft volume and mass budgets, but increase integration efficiencies, provide modularity and flexibility to accommodate multiple missions while maintaining a low recurring cost. With these challenges in mind, a novel system packaging approach incorporates solutions that provide broader environmental applications, more flexible system interconnectivity, scalability, and simplified assembly test and integration schemes. The Integrated Avionics System (IAS) provides for a low-mass, modular distributed or centralized packaging architecture which combines ridged-flex technologies, high-density COTS hardware and a new 3-D mechanical packaging approach, Horizontal Mounted Cube (HMC). This paper will describe the fundamental elements of the IAS, HMC hardware design, system integration and environmental test results.

Advanced optical network architecture for integrated digital avionics

NASA Astrophysics Data System (ADS)

Morgan, D. Reed

1996-12-01

For the first time in the history of avionics, the network designer now has a choice in selecting the media that interconnects the sources and sinks of digital data on aircraft. Electrical designs are already giving way to photonics in application areas where the data rate times distance product is large or where special design requirements such as low weight or EMI considerations are critical. Future digital avionic architectures will increasingly favor the use of photonic interconnects as network data rates of one gigabit/second and higher are needed to support real-time operation of high-speed integrated digital processing. As the cost of optical network building blocks is reduced and as temperature-rugged laser sources are matured, metal interconnects will be forced to retreat to applications spanning shorter and shorter distances. Although the trend is already underway, the widespread use of digital optics will first occur at the system level, where gigabit/second, real-time interconnects between sensors, processors, mass memories and displays separated by a least of few meters will be required. The application of photonic interconnects for inter-printed wiring board signalling across the backplane will eventually find application for gigabit/second applications since signal degradation over copper traces occurs before one gigabit/second and 0.5 meters are reached. For the foreseeable future however, metal interconnects will continue to be used to interconnect devices on printed wiring boards since 5 gigabit/second signals can be sent over metal up to around 15 centimeters. Current-day applications of optical interconnects at the system level are described and a projection of how advanced optical interconnect technology will be driven by the use of high speed integrated digital processing on future aircraft is presented. The recommended advanced network for application in the 2010 time frame is a fiber-based system with a signalling speed of around 2-3 gigabits per second. This switch-based unified network will interconnect sensors, displays, mass memory and controls and displays to computer modules within the processing complex. The characteristics of required building blocks needed for the future are described. These building blocks include the fiber, an optical switch, a laser-based transceiver, blind-mate connectors and an optical backplane.

High density circuit technology, part 1

NASA Technical Reports Server (NTRS)

Wade, T. E.

1982-01-01

The metal (or dielectric) lift-off processes used in the semiconductor industry to fabricate high density very large scale integration (VLSI) systems were reviewed. The lift-off process consists of depositing the light-sensitive material onto the wafer and patterning first in such a manner as to form a stencil for the interconnection material. Then the interconnection layer is deposited and unwanted areas are lifted off by removing the underlying stencil. Several of these lift-off techniques were examined experimentally. The use of an auxiliary layer of polyimide to form a lift-off stencil offers considerable promise.

Technology achievements and projections for communication satellites of the future

NASA Technical Reports Server (NTRS)

Bagwell, J. W.

1986-01-01

Multibeam systems of the future using monolithic microwave integrated circuits to provide phase control and power gain are contrasted with discrete microwave power amplifiers from 10 to 75 W and their associated waveguide feeds, phase shifters and power splitters. Challenging new enabling technology areas include advanced electrooptical control and signal feeds. Large scale MMIC's will be used incorporating on chip control interfaces, latching, and phase and amplitude control with power levels of a few watts each. Beam forming algorithms for 80 to 90 deg. wide angle scanning and precise beam forming under wide ranging environments will be required. Satelllite systems using these dynamically reconfigured multibeam antenna systems will demand greater degrees of beam interconnectivity. Multiband and multiservice users will be interconnected through the same space platform. Monolithic switching arrays operating over a wide range of RF and IF frequencies are contrasted with current IF switch technology implemented discretely. Size, weight, and performance improvements by an order of magnitude are projected.

Electronic Communications Technologies and the Transition to College: Links to Parent-Child Attachment and Adjustment

ERIC Educational Resources Information Center

Sarigiani, Pamela A.; Trumbell, Jill M.; Camarena, Phame M.

2013-01-01

Electronic communications technologies (ECTs) help college students and parents remain in contact. Because recent reports have emphasized a link between ECTs, helicopter parenting, and autonomy issues, this study focused on the significance of contact patterns for attachment and student adjustment. First-semester college students (199 female, 81…

Generic three-dimensional wavelength routers based on cross connects of multilayer diffractive elements

NASA Astrophysics Data System (ADS)

Deng, Xuegong; Chen, Ray T.

2001-05-01

We report a generic method to construct 3D wavelength routers by adapting a novel design for multi-optical wavelength interconnects (MOWI's). Optical wavelength- selective (WS) interconnections are realized by resorting to layered diffractive phase elements. Besides, we simultaneously carry out several other integrated operations on the incident beams according to their wavelengths. We demonstrate an 4 X 4 inline 3D WS optical crossconnect and a 1D 1 X 8 WS perfect shuffler. The devices are well feasible for mass production by using current standard microelectronics technologies. It is plausible that the proposed WS MOWI scenario will find critical applications in module-to-module and board-to-board optical interconnect systems, as well as in other devices for short-link multi- wavelength networks that would benefit from function integration.

Design guidelines for advanced LSI microcircuit packaging using thick film multilayer technology

NASA Technical Reports Server (NTRS)

Peckinpaugh, C. J.

1974-01-01

Ceramic multilayer circuitry results from the sequential build-up of two or more layers of pre-determined conductive interconnections separated by dielectric layers and fired at an elevated temperature to form a solidly fused structure. The resultant ceramic interconnect matrix is used as a base to mount active and passive devices and provide the necessary electrical interconnection to accomplish the desired electrical circuit. Many methods are known for developing multilevel conductor mechanisms such as multilayer printed circuits, welded wire matrices, flexible copper tape conductors, and thin and thick-film ceramic multilayers. Each method can be considered as a specialized field with each possessing its own particular set of benefits and problems. This design guide restricts itself to the art of design, fabrication and assembly of ceramic multilayer circuitry and the reliability of the end product.

Cryogenic 3D printing for producing hierarchical porous and rhBMP-2-loaded Ca-P/PLLA nanocomposite scaffolds for bone tissue engineering.

PubMed

Wang, Chong; Zhao, Qilong; Wang, Min

2017-06-07

The performance of bone tissue engineering scaffolds can be assessed through cell responses to scaffolds, including cell attachment, infiltration, morphogenesis, proliferation, differentiation, etc, which are determined or heavily influenced by the composition, structure, mechanical properties, and biological properties (e.g. osteoconductivity and osteoinductivity) of scaffolds. Although some promising 3D printing techniques such as fused deposition modeling and selective laser sintering could be employed to produce biodegradable bone tissue engineering scaffolds with customized shapes and tailored interconnected pores, effective methods for fabricating scaffolds with well-designed hierarchical porous structure (both interconnected macropores and surface micropores) and tunable osteoconductivity/osteoinductivity still need to be developed. In this investigation, a novel cryogenic 3D printing technique was investigated and developed for producing hierarchical porous and recombinant human bone morphogenetic protein-2 (rhBMP-2)-loaded calcium phosphate (Ca-P) nanoparticle/poly(L-lactic acid) nanocomposite scaffolds, in which the Ca-P nanoparticle-incorporated scaffold layer and rhBMP-2-encapsulated scaffold layer were deposited alternatingly using different types of emulsions as printing inks. The mechanical properties of the as-printed scaffolds were comparable to those of human cancellous bone. Sustained releases of Ca 2+ ions and rhBMP-2 were achieved and the biological activity of rhBMP-2 was well-preserved. Scaffolds with a desirable hierarchical porous structure and dual delivery of Ca 2+ ions and rhBMP-2 exhibited superior performance in directing the behaviors of human bone marrow-derived mesenchymal stem cells and caused improved cell viability, attachment, proliferation, and osteogenic differentiation, which has suggested their great potential for bone tissue engineering.

Fabrication method to create high-aspect ratio pillars for photonic coupling of board level interconnects

NASA Astrophysics Data System (ADS)

Debaes, C.; Van Erps, J.; Karppinen, M.; Hiltunen, J.; Suyal, H.; Last, A.; Lee, M. G.; Karioja, P.; Taghizadeh, M.; Mohr, J.; Thienpont, H.; Glebov, A. L.

2008-04-01

An important challenge that remains to date in board level optical interconnects is the coupling between the optical waveguides on printed wiring boards and the packaged optoelectronics chips, which are preferably surface mountable on the boards. One possible solution is the use of Ball Grid Array (BGA) packages. This approach offers a reliable attachment despite the large CTE mismatch between the organic FR4 board and the semiconductor materials. Collimation via micro-lenses is here typically deployed to couple the light vertically from the waveguide substrate to the optoelectronics while allowing for a small misalignment between board and package. In this work, we explore the fabrication issues of an alternative approach in which the vertical photonic connection between board and package is governed by a micro-optical pillar which is attached both to the board substrate and to the optoelectronic chips. Such an approach allows for high density connections and small, high-speed detector footprints while maintaining an acceptable tolerance between board and package. The pillar should exhibit some flexibility and thus a high-aspect ratio is preferred. This work presents and compares different fabrication methods and applies different materials for such high-aspect ratio pillars. The different fabrication methods are: photolithography, direct laser writing and deep proton writing. The selection of optical materials that was investigated is: SU8, Ormocers, PU and a multifunctional acrylate polymer. The resulting optical pillars have diameters ranging from 20um up to 80um, with total heights ranging between 30um and 100um (symbol for micron). The aspect-ratio of the fabricated structures ranges from 1.5 to 5.

Suspended polyhydroxyalkanoate microspheres as 3D carriers for mammalian cell growth.

PubMed

Wei, Dai-Xu; Dao, Jin-Wei; Liu, Hua-Wei; Chen, Guo-Qiang

2018-04-13

Different forms of biopolyester PHBVHHx microspheres were prepared so as to compare the mammalian cell behaviors in suspension cultivation system. Based on a microbial terpolyester PHBVHHx consisting of 3-hydroxybutyrate (HB), 3-hydroxyvalerate (HV), and 3-hydroxyhexanoate (HHx), solid microspheres (SMSs), hollow microspheres (HMSs), and porous microspheres (PMS) were successfully prepared by a modified solvent evaporation method involving gas-in-oil-in-water (G1/O/W2) double emulsion, water-in-oil-in-water (W1/O/W2) double emulsion and oil-in-water (O/W) single emulsion, respectively. Generally, PMSs have diameters ranging from 330 to 400 μm with pore sizes of 10 to 60 μm. The pores inside the PMSs were found well interconnected compared with PHBVHHx prepared by the traditional solvent evaporation method, resulting in the highest water uptake ratio. When inoculated with human osteoblast-like cells lasting 6 days, PMS showed much better cell attachment and proliferation compared with other less porous microspheres due to its large inner space as a 3 D carrier. Cell migration towards surface and other interconnected inner pores was clearly observable. Dead or apoptotic cells were found more common among less porous SMSs or HMSs compared with highly porous PMSs. It is therefore concluded that porous PHBVHHx microspheres with larger surface open pores and interconnected inner pores can serve as a carrier or scaffold supporting more and better cell growth for either injectable purposes or simply supporting cell growth.

Optoelectronic interconnects for 3D wafer stacks

NASA Astrophysics Data System (ADS)

Ludwig, David E.; Carson, John C.; Lome, Louis S.

1996-01-01

Wafer and chip stacking are envisioned as a means of providing increased processing power within the small confines of a three-dimensional structure. Optoelectronic devices can play an important role in these dense 3-D processing electronic packages in two ways. In pure electronic processing, optoelectronics can provide a method for increasing the number of input/output communication channels within the layers of the 3-D chip stack. Non-free space communication links allow the density of highly parallel input/output ports to increase dramatically over typical edge bus connections. In hybrid processors, where electronics and optics play a role in defining the computational algorithm, free space communication links are typically utilized for, among other reasons, the increased network link complexity which can be achieved. Free space optical interconnections provide bandwidths and interconnection complexity unobtainable in pure electrical interconnections. Stacked 3-D architectures can provide the electronics real estate and structure to deal with the increased bandwidth and global information provided by free space optical communications. This paper provides definitions and examples of 3-D stacked architectures in optoelectronics processors. The benefits and issues of these technologies are discussed.

Optoelectronic interconnects for 3D wafer stacks

NASA Astrophysics Data System (ADS)

Ludwig, David; Carson, John C.; Lome, Louis S.

1996-01-01

Wafer and chip stacking are envisioned as means of providing increased processing power within the small confines of a three-dimensional structure. Optoelectronic devices can play an important role in these dense 3-D processing electronic packages in two ways. In pure electronic processing, optoelectronics can provide a method for increasing the number of input/output communication channels within the layers of the 3-D chip stack. Non-free space communication links allow the density of highly parallel input/output ports to increase dramatically over typical edge bus connections. In hybrid processors, where electronics and optics play a role in defining the computational algorithm, free space communication links are typically utilized for, among other reasons, the increased network link complexity which can be achieved. Free space optical interconnections provide bandwidths and interconnection complexity unobtainable in pure electrical interconnections. Stacked 3-D architectures can provide the electronics real estate and structure to deal with the increased bandwidth and global information provided by free space optical communications. This paper will provide definitions and examples of 3-D stacked architectures in optoelectronics processors. The benefits and issues of these technologies will be discussed.

Highly Efficient Perovskite Solar Modules by Scalable Fabrication and Interconnection Optimization

DOE PAGES

Yang, Mengjin; Kim, Dong Hoe; Klein, Talysa R.; ...

2018-01-02

To push perovskite solar cell (PSC) technology toward practical applications, large-area perovskite solar modules with multiple subcells need to be developed by fully scalable deposition approaches. Here, we demonstrate a deposition scheme for perovskite module fabrication with spray coating of a TiO2 electron transport layer (ETL) and blade coating of both a perovskite absorber layer and a spiro-OMeTAD-based hole transport layer (HTL). The TiO2 ETL remaining in the interconnection between subcells significantly affects the module performance. Reducing the TiO2 thickness changes the interconnection contact from a Schottky diode to ohmic behavior. Owing to interconnection resistance reduction, the perovskite modules withmore » a 10 nm TiO2 layer show enhanced performance mainly associated with an improved fill factor. Finally, we demonstrate a four-cell MA0.7FA0.3PbI3 perovskite module with a stabilized power conversion efficiency (PCE) of 15.6% measured from an aperture area of ~10.36 cm2, corresponding to an active-area module PCE of 17.9% with a geometric fill factor of ~87.3%.« less

Continuous epitaxial growth of extremely strong Cu6Sn5 textures at liquid-Sn/(111)Cu interface under temperature gradient

NASA Astrophysics Data System (ADS)

Zhong, Y.; Zhao, N.; Liu, C. Y.; Dong, W.; Qiao, Y. Y.; Wang, Y. P.; Ma, H. T.

2017-11-01

As the diameter of solder interconnects in three-dimensional integrated circuits (3D ICs) downsizes to several microns, how to achieve a uniform microstructure with thousands of interconnects on stacking chips becomes a critical issue in 3D IC manufacturing. We report a promising way for fabricating fully intermetallic interconnects with a regular grain morphology and a strong texture feature by soldering single crystal (111) Cu/Sn/polycrystalline Cu interconnects under the temperature gradient. Continuous epitaxial growth of η-Cu6Sn5 at cold end liquid-Sn/(111)Cu interfaces has been demonstrated. The resultant η-Cu6Sn5 grains show faceted prism textures with an intersecting angle of 60° and highly preferred orientation with their ⟨ 11 2 ¯ 0 ⟩ directions nearly paralleling to the direction of the temperature gradient. These desirable textures are maintained even after soldering for 120 min. The results pave the way for controlling the morphology and orientation of interfacial intermetallics in 3D packaging technologies.

Highly Efficient Perovskite Solar Modules by Scalable Fabrication and Interconnection Optimization

DOE Office of Scientific and Technical Information (OSTI.GOV)

Yang, Mengjin; Kim, Dong Hoe; Klein, Talysa R.

To push perovskite solar cell (PSC) technology toward practical applications, large-area perovskite solar modules with multiple subcells need to be developed by fully scalable deposition approaches. Here, we demonstrate a deposition scheme for perovskite module fabrication with spray coating of a TiO2 electron transport layer (ETL) and blade coating of both a perovskite absorber layer and a spiro-OMeTAD-based hole transport layer (HTL). The TiO2 ETL remaining in the interconnection between subcells significantly affects the module performance. Reducing the TiO2 thickness changes the interconnection contact from a Schottky diode to ohmic behavior. Owing to interconnection resistance reduction, the perovskite modules withmore » a 10 nm TiO2 layer show enhanced performance mainly associated with an improved fill factor. Finally, we demonstrate a four-cell MA0.7FA0.3PbI3 perovskite module with a stabilized power conversion efficiency (PCE) of 15.6% measured from an aperture area of ~10.36 cm2, corresponding to an active-area module PCE of 17.9% with a geometric fill factor of ~87.3%.« less

Final analysis of cost, value, and risk.

DOT National Transportation Integrated Search

2009-03-05

USDOT understands that access to emergency services provided by 9-1-1 in todays world of evolving : technology will ultimately occur within a broader array of interconnected networks comprehensively : supporting emergency servicesfrom public ac...

Wireless Internet Gateways (WINGS)

DTIC Science & Technology

1997-01-01

WIRELESS INTERNET GATEWAYS (WINGS) J.J. Garcia-Luna-Aceves, Chane L. Fullmer, Ewerton Madruga Computer Engineering Department University of...rooftop.com Abstract— Today’s internetwork technology has been extremely success- ful in linking huge numbers of computers and users. However, to date...this technology has been oriented to computer interconnection in relatively stable operational environments, and thus cannot adequately support many of

Automated solar cell assembly team process research

NASA Astrophysics Data System (ADS)

Nowlan, M. J.; Hogan, S. J.; Darkazalli, G.; Breen, W. F.; Murach, J. M.; Sutherland, S. F.; Patterson, J. S.

1994-06-01

This report describes work done under the Photovoltaic Manufacturing Technology (PVMaT) project, Phase 3A, which addresses problems that are generic to the photovoltaic (PV) industry. Spire's objective during Phase 3A was to use its light soldering technology and experience to design and fabricate solar cell tabbing and interconnecting equipment to develop new, high-yield, high-throughput, fully automated processes for tabbing and interconnecting thin cells. Areas that were addressed include processing rates, process control, yield, throughput, material utilization efficiency, and increased use of automation. Spire teamed with Solec International, a PV module manufacturer, and the University of Massachusetts at Lowell's Center for Productivity Enhancement (CPE), automation specialists, who are lower-tier subcontractors. A number of other PV manufacturers, including Siemens Solar, Mobil Solar, Solar Web, and Texas instruments, agreed to evaluate the processes developed under this program.

Data processing and optimization system to study prospective interstate power interconnections

NASA Astrophysics Data System (ADS)

Podkovalnikov, Sergei; Trofimov, Ivan; Trofimov, Leonid

2018-01-01

The paper presents Data processing and optimization system for studying and making rational decisions on the formation of interstate electric power interconnections, with aim to increasing effectiveness of their functioning and expansion. The technologies for building and integrating a Data processing and optimization system including an object-oriented database and a predictive mathematical model for optimizing the expansion of electric power systems ORIRES, are described. The technology of collection and pre-processing of non-structured data collected from various sources and its loading to the object-oriented database, as well as processing and presentation of information in the GIS system are described. One of the approaches of graphical visualization of the results of optimization model is considered on the example of calculating the option for expansion of the South Korean electric power grid.

Assessment of Industrial Attachment: Issues and Concerns of Chinhoyi University of Technology's Undergraduate Degree Programme, Zimbabwe

ERIC Educational Resources Information Center

Chinyemba, Fredreck; Bvekerwa, Sailos T.

2012-01-01

This article presents findings from an action research that explored industrial attachment supervision and assessment issues and concerns of CUT's (Chinhoyi University of Technology) undergraduate degree programme. The study was motivated by the observation that there is no research project contacted in order to determine the social and economic…

Chip-scale integrated optical interconnects: a key enabler for future high-performance computing

NASA Astrophysics Data System (ADS)

Haney, Michael; Nair, Rohit; Gu, Tian

2012-01-01

High Performance Computing (HPC) systems are putting ever-increasing demands on the throughput efficiency of their interconnection fabrics. In this paper, the limits of conventional metal trace-based inter-chip interconnect fabrics are examined in the context of state-of-the-art HPC systems, which currently operate near the 1 GFLOPS/W level. The analysis suggests that conventional metal trace interconnects will limit performance to approximately 6 GFLOPS/W in larger HPC systems that require many computer chips to be interconnected in parallel processing architectures. As the HPC communications bottlenecks push closer to the processing chips, integrated Optical Interconnect (OI) technology may provide the ultra-high bandwidths needed at the inter- and intra-chip levels. With inter-chip photonic link energies projected to be less than 1 pJ/bit, integrated OI is projected to enable HPC architecture scaling to the 50 GFLOPS/W level and beyond - providing a path to Peta-FLOPS-level HPC within a single rack, and potentially even Exa-FLOPSlevel HPC for large systems. A new hybrid integrated chip-scale OI approach is described and evaluated. The concept integrates a high-density polymer waveguide fabric directly on top of a multiple quantum well (MQW) modulator array that is area-bonded to the Silicon computing chip. Grayscale lithography is used to fabricate 5 μm x 5 μm polymer waveguides and associated novel small-footprint total internal reflection-based vertical input/output couplers directly onto a layer containing an array of GaAs MQW devices configured to be either absorption modulators or photodetectors. An external continuous wave optical "power supply" is coupled into the waveguide links. Contrast ratios were measured using a test rider chip in place of a Silicon processing chip. The results suggest that sub-pJ/b chip-scale communication is achievable with this concept. When integrated into high-density integrated optical interconnect fabrics, it could provide a seamless interconnect fabric spanning the intra-

Smart City Energy Interconnection Technology Framework Preliminary Research

NASA Astrophysics Data System (ADS)

Zheng, Guotai; Zhao, Baoguo; Zhao, Xin; Li, Hao; Huo, Xianxu; Li, Wen; Xia, Yu

2018-01-01

to improve urban energy efficiency, improve the absorptive ratio of new energy resources and renewable energy sources, and reduce environmental pollution and other energy supply and consumption technology framework matched with future energy restriction conditions and applied technology level are required to be studied. Relative to traditional energy supply system, advanced information technology-based “Energy Internet” technical framework may give play to energy integrated application and load side interactive technology advantages, as a whole optimize energy supply and consumption and improve the overall utilization efficiency of energy.

Preliminary analysis of cost, value, and risk.

DOT National Transportation Integrated Search

2008-02-12

The U.S. Department of Transportation (USDOT) understands that access to emergency services provided by 9-1-1 in todays world of evolving technology will ultimately occur within a broader array of interconnected networks comprehensively supporting...

The Wearable Motherboard: a flexible information infrastructure or sensate liner for medical applications.

PubMed

Park, S; Gopalsamy, C; Rajamanickam, R; Jayaraman, S

1999-01-01

Research on the design and development of a Sensate Liner for Combat Casualty Care has led to the realization of the world's first Wearable Motherboard or an "intelligent" garment for the 21st Century. This Georgia Tech Wearable Motherboard (GTWM) provides an extremely versatile framework for the incorporation of sensing, monitoring and information processing devices. The principal advantage of GTWM is that it provides, for the first time, a very systematic way of monitoring the vital signs of humans in an unobtrusive manner. Appropriate sensors have been "plugged" into this motherboard using the developed Interconnection Technology and attached to any part of the individual being monitored, thereby creating a flexible wearable monitoring device. The flexible data bus integrated into the structure transmits the information to monitoring devices such as an EKG Machine, a temperature recorder, a voice recorder, etc. The bus also serves to transmit information to the sensors (and hence, the wearer) from external sources, thus making GTWM a valuable information infrastructure. GTWM is lightweight and can be worn easily by anyone--from infants to senior citizens. GTWM has enormous potential for applications in fields such as telemedicine, monitoring of patients in post-operative recovery, the prevention of SIDS (sudden infant death syndrome), and monitoring of astronauts, athletes, law enforcement personnel and combat soldiers.

Depression in female adolescents: an IPA analysis.

PubMed

Shaw, Samantha K; Dallos, Rudi; Shoebridge, Philip

2009-04-01

Six female adolescents participated in open-ended interviews regarding their experiences of depression. The transcripts of their interviews were explored using Interpretative Phenomenological Analysis (Smith, 1991). The analysis revealed three inter-connected super-ordinate themes which were: communication, hurt self, and difference. These themes centred on communication processes in participants' families and with peers, issues relating to shifts in identity through adolescence, and feelings of being damaged, distressed, and hurt. Amongst a range of potentially relevant perspectives, an attachment theory (Bowlby, 1969) orientation was found to be particularly relevant and helpful in interpreting the themes that captured these young women's experiences. Some implications for clinical practice are discussed.

Instrument Systems Analysis and Verification Facility (ISAVF) users guide

NASA Technical Reports Server (NTRS)

Davis, J. F.; Thomason, J. O.; Wolfgang, J. L.

1985-01-01

The ISAVF facility is primarily an interconnected system of computers, special purpose real time hardware, and associated generalized software systems, which will permit the Instrument System Analysts, Design Engineers and Instrument Scientists, to perform trade off studies, specification development, instrument modeling, and verification of the instrument, hardware performance. It is not the intent of the ISAVF to duplicate or replace existing special purpose facilities such as the Code 710 Optical Laboratories or the Code 750 Test and Evaluation facilities. The ISAVF will provide data acquisition and control services for these facilities, as needed, using remote computer stations attached to the main ISAVF computers via dedicated communication lines.

The use of hybrid integrated circuit techniques in biotelemetry applications

NASA Technical Reports Server (NTRS)

Fryer, T. B.

1977-01-01

A review is presented of some features of hybrid integrated circuits that make their use advantageous in miniature biotelemetry applications. The various techniques for fabricating resistors, capacitors and interconnections by both thin film and thick film technology are discussed. The use of chip capacitors, resistors, and especially standard IC chips on substrates with fired-on interconnection patterns is emphasized. The review is designed primarily to acquaint biotelemetry users and designers with an overview of this fabrication technique so that they can better communicate their needs with an understanding of its limitations and advantages to facilities specializing in hybrid construction.

Process development for automated solar cell and module production. Task 4: Automated array assembly

NASA Technical Reports Server (NTRS)

1980-01-01

A process sequence which can be used in conjunction with automated equipment for the mass production of solar cell modules for terrestrial use was developed. The process sequence was then critically analyzed from a technical and economic standpoint to determine the technological readiness of certain process steps for implementation. The steps receiving analysis were: back contact metallization, automated cell array layup/interconnect, and module edge sealing. For automated layup/interconnect, both hard automation and programmable automation (using an industrial robot) were studied. The programmable automation system was then selected for actual hardware development.

UNISIST Working Group on Technology of Systems Interconnection. Meeting (3rd, Quezon City, Philippines, October 17-20, 1983).

ERIC Educational Resources Information Center

United Nations Educational, Scientific and Cultural Organization, Paris (France). General Information Programme.

Participants in the meeting summarized in this report advised and made recommendations on appropriate activities and programs conducive to the development of cooperative networks and the exchange of information and experience in science and technology in the Asia Pacific Region. Invited in their personal capacity as experts, the 14 participants…

Leveraging Simulation Against the F-16 Flying Training Gap

DTIC Science & Technology

2005-11-01

must leverage emerging simulation technology into combined flight training to counter mission employment complexity created by technology itself...two or more of these stand-alone simulators creates a mission training center (MTC), which when further networked create distributed mission...operations (DMO). Ultimately, the grand operational vision of DMO is to interconnect non-collocated users creating a “virtual” joint training environment

Information engineering

DOE Office of Scientific and Technical Information (OSTI.GOV)

Hunt, D.N.

1997-02-01

The Information Engineering thrust area develops information technology to support the programmatic needs of Lawrence Livermore National Laboratory`s Engineering Directorate. Progress in five programmatic areas are described in separate reports contained herein. These are entitled Three-dimensional Object Creation, Manipulation, and Transport, Zephyr:A Secure Internet-Based Process to Streamline Engineering Procurements, Subcarrier Multiplexing: Optical Network Demonstrations, Parallel Optical Interconnect Technology Demonstration, and Intelligent Automation Architecture.

Hexagonal boron nitride intercalated multi-layer graphene: a possible ultimate solution to ultra-scaled interconnect technology

NASA Astrophysics Data System (ADS)

Li, Yong-Jun; Sun, Qing-Qing; Chen, Lin; Zhou, Peng; Wang, Peng-Fei; Ding, Shi-Jin; Zhang, David Wei

2012-03-01

We proposed intercalation of hexagonal boron nitride (hBN) in multilayer graphene to improve its performance in ultra-scaled interconnects for integrated circuit. The effect of intercalated hBN layer in bilayer graphene is investigated using non-equilibrium Green's functions. We find the hBN intercalated bilayer graphene exhibit enhanced transport properties compared with pristine bilayer ones, and the improvement is attributed to suppression of interlayer scattering and good planar bonding condition of inbetween hBN layer. Based on these results, we proposed a via structure that not only benefits from suppressed interlayer scattering between multilayer graphene, but also sustains the unique electrical properties of graphene when many graphene layers are stacking together. The ideal current density across the structure can be as high as 4.6×109 A/cm2 at 1V, which is very promising for the future high-performance interconnect.

Accurate Modeling Method for Cu Interconnect

NASA Astrophysics Data System (ADS)

Yamada, Kenta; Kitahara, Hiroshi; Asai, Yoshihiko; Sakamoto, Hideo; Okada, Norio; Yasuda, Makoto; Oda, Noriaki; Sakurai, Michio; Hiroi, Masayuki; Takewaki, Toshiyuki; Ohnishi, Sadayuki; Iguchi, Manabu; Minda, Hiroyasu; Suzuki, Mieko

This paper proposes an accurate modeling method of the copper interconnect cross-section in which the width and thickness dependence on layout patterns and density caused by processes (CMP, etching, sputtering, lithography, and so on) are fully, incorporated and universally expressed. In addition, we have developed specific test patterns for the model parameters extraction, and an efficient extraction flow. We have extracted the model parameters for 0.15μm CMOS using this method and confirmed that 10%τpd error normally observed with conventional LPE (Layout Parameters Extraction) was completely dissolved. Moreover, it is verified that the model can be applied to more advanced technologies (90nm, 65nm and 55nm CMOS). Since the interconnect delay variations due to the processes constitute a significant part of what have conventionally been treated as random variations, use of the proposed model could enable one to greatly narrow the guardbands required to guarantee a desired yield, thereby facilitating design closure.

Device and circuit-level performance of carbon nanotube field-effect transistor with benchmarking against a nano-MOSFET.

PubMed

Tan, Michael Loong Peng; Lentaris, Georgios; Amaratunga Aj, Gehan

2012-08-19

The performance of a semiconducting carbon nanotube (CNT) is assessed and tabulated for parameters against those of a metal-oxide-semiconductor field-effect transistor (MOSFET). Both CNT and MOSFET models considered agree well with the trends in the available experimental data. The results obtained show that nanotubes can significantly reduce the drain-induced barrier lowering effect and subthreshold swing in silicon channel replacement while sustaining smaller channel area at higher current density. Performance metrics of both devices such as current drive strength, current on-off ratio (Ion/Ioff), energy-delay product, and power-delay product for logic gates, namely NAND and NOR, are presented. Design rules used for carbon nanotube field-effect transistors (CNTFETs) are compatible with the 45-nm MOSFET technology. The parasitics associated with interconnects are also incorporated in the model. Interconnects can affect the propagation delay in a CNTFET. Smaller length interconnects result in higher cutoff frequency.

Mission Systems Open Architecture Science and Technology (MOAST) program

NASA Astrophysics Data System (ADS)

Littlejohn, Kenneth; Rajabian-Schwart, Vahid; Kovach, Nicholas; Satterthwaite, Charles P.

2017-04-01

The Mission Systems Open Architecture Science and Technology (MOAST) program is an AFRL effort that is developing and demonstrating Open System Architecture (OSA) component prototypes, along with methods and tools, to strategically evolve current OSA standards and technical approaches, promote affordable capability evolution, reduce integration risk, and address emerging challenges [1]. Within the context of open architectures, the program is conducting advanced research and concept development in the following areas: (1) Evolution of standards; (2) Cyber-Resiliency; (3) Emerging Concepts and Technologies; (4) Risk Reduction Studies and Experimentation; and (5) Advanced Technology Demonstrations. Current research includes the development of methods, tools, and techniques to characterize the performance of OMS data interconnection methods for representative mission system applications. Of particular interest are the OMS Critical Abstraction Layer (CAL), the Avionics Service Bus (ASB), and the Bulk Data Transfer interconnects, as well as to develop and demonstrate cybersecurity countermeasures techniques to detect and mitigate cyberattacks against open architecture based mission systems and ensure continued mission operations. Focus is on cybersecurity techniques that augment traditional cybersecurity controls and those currently defined within the Open Mission System and UCI standards. AFRL is also developing code generation tools and simulation tools to support evaluation and experimentation of OSA-compliant implementations.

Interconnecting astronomical networks: evolving from single networks to meta-networks

NASA Astrophysics Data System (ADS)

White, R. R.; Allan, A.; Evans, S.; Vestrand, W. T.; Wren, J.; Wozniak, P.

2006-06-01

Over the past four years we have seen continued advancement in network technology and how those technologies are beginning to enable astronomical science. Even though some sociological aspects are hindering full cooperation between most observatories and telescopes outside of their academic or institutional connections, an unprecedented step during the summer of 2005 was taken towards creating a world-wide interconnection of astronomical assets. The Telescope Alert Operations Network System (TALONS), a centralized server/client bi-directional network developed and operated by Los Alamos National Laboratory, integrated one of its network nodes with a node from the eScience Telescopes for Astronomical Research (eSTAR), a peer-to-peer agent based network developed and operated by The University of Exeter. Each network can act independently, providing support for their direct clients, and by interconnection provide local clients with access to; outside telescope systems, software tools unavailable locally, and the ability to utilize assets far more efficiently, thereby enabling science on a world-wide scale. In this paper we will look at the evolution of these independent networks into the worlds first heterogeneous telescope network and where this may take astronomy in the future. We will also examine those key elements necessary to providing universal communication between diverse astronomical networks.

Si photonics technology for future optical interconnection

NASA Astrophysics Data System (ADS)

Zheng, Xuezhe; Krishnamoorthy, Ashok V.

2011-12-01

Scaling of computing systems require ultra-efficient interconnects with large bandwidth density. Silicon photonics offers a disruptive solution with advantages in reach, energy efficiency and bandwidth density. We review our progress in developing building blocks for ultra-efficient WDM silicon photonic links. Employing microsolder based hybrid integration with low parasitics and high density, we optimize photonic devices on SOI platforms and VLSI circuits on more advanced bulk CMOS technology nodes independently. Progressively, we successfully demonstrated single channel hybrid silicon photonic transceivers at 5 Gbps and 10 Gbps, and 80 Gbps arrayed WDM silicon photonic transceiver using reverse biased depletion ring modulators and Ge waveguide photo detectors. Record-high energy efficiency of less than 100fJ/bit and 385 fJ/bit were achieved for the hybrid integrated transmitter and receiver, respectively. Waveguide grating based optical proximity couplers were developed with low loss and large optical bandwidth to enable multi-layer intra/inter-chip optical interconnects. Thermal engineering of WDM devices by selective substrate removal, together with WDM link using synthetic wavelength comb, we significantly improved the device tuning efficiency and reduced the tuning range. Using these innovative techniques, two orders of magnitude tuning power reduction was achieved. And tuning cost of only a few 10s of fJ/bit is expected for high data rate WDM silicon photonic links.

Optical interconnects based on VCSELs and low-loss silicon photonics

NASA Astrophysics Data System (ADS)

Aalto, Timo; Harjanne, Mikko; Karppinen, Mikko; Cherchi, Matteo; Sitomaniemi, Aila; Ollila, Jyrki; Malacarne, Antonio; Neumeyr, Christian

2018-02-01

Silicon photonics with micron-scale Si waveguides offers most of the benefits of submicron SOI technology while avoiding most of its limitations. In particular, thick silicon-on-insulator (SOI) waveguides offer 0.1 dB/cm propagation loss, polarization independency, broadband single-mode (SM) operation from 1.2 to >4 µm wavelength and ability to transmit high optical powers (>1 W). Here we describe the feasibility of Thick-SOI technology for advanced optical interconnects. With 12 μm SOI waveguides we demonstrate efficient coupling between standard single-mode fibers, vertical-cavity surface-emitting lasers (VCSELs) and photodetectors (PDs), as well as wavelength multiplexing in small footprint. Discrete VCSELs and PDs already support 28 Gb/s on-off keying (OOK), which shows a path towards 50-100 Gb/s bandwidth per wavelength by using more advanced modulation formats like PAM4. Directly modulated VCSELs enable very power-efficient optical interconnects for up to 40 km distance. Furthermore, with 3 μm SOI waveguides we demonstrate extremely dense and low-loss integration of numerous optical functions, such as multiplexers, filters, switches and delay lines. Also polarization independent and athermal operation is demonstrated. The latter is achieved by using short polymer waveguides to compensate for the thermo-optic effect in silicon. New concepts for isolator integration and polarization rotation are also explained.

Machinima and Video-Based Soft-Skills Training for Frontline Healthcare Workers.

PubMed

Conkey, Curtis A; Bowers, Clint; Cannon-Bowers, Janis; Sanchez, Alicia

2013-02-01

Multimedia training methods have traditionally relied heavily on video-based technologies, and significant research has shown these to be very effective training tools. However, production of video is time and resource intensive. Machinima technologies are based on videogaming technology. Machinima technology allows videogame technology to be manipulated into unique scenarios based on entertainment or training and practice applications. Machinima is the converting of these unique scenarios into video vignettes that tell a story. These vignettes can be interconnected with branching points in much the same way that education videos are interconnected as vignettes between decision points. This study addressed the effectiveness of machinima-based soft-skills education using avatar actors versus the traditional video teaching application using human actors in the training of frontline healthcare workers. This research also investigated the difference between presence reactions when using avatar actor-produced video vignettes as compared with human actor-produced video vignettes. Results indicated that the difference in training and/or practice effectiveness is statistically insignificant for presence, interactivity, quality, and the skill of assertiveness. The skill of active listening presented a mixed result indicating the need for careful attention to detail in situations where body language and facial expressions are critical to communication. This study demonstrates that a significant opportunity exists for the exploitation of avatar actors in video-based instruction.

Job Analysis Techniques for Restructuring Health Manpower Education and Training in the Navy Medical Department. Attachment 9. Laboratory QPCB Task Sort for Medical Laboratory Technology.

ERIC Educational Resources Information Center

Technomics, Inc., McLean, VA.

This publication is Attachment 9 of a set of 16 computer listed QPCB task sorts, by career level, for the entire Hospital Corps and Dental Technician fields. Statistical data are presented in tabular form for a detailed listing of job duties in medical laboratory technology. (BT)

"I Thought My Heart Would Burst": The Role of Ultrasound Technology on Expectant Grandmotherhood

ERIC Educational Resources Information Center

Harpel, Tammy S.; Hertzog, Jodie

2010-01-01

Using both quantitative and qualitative data, this study investigates the role of ultrasound technology on feelings of attachment and emotions experienced by expectant grandmothers. A total of 109 expectant grandmothers complete the 84-question Web-based survey. A 12-item scale is used to assess the impact of ultrasound on attachment. As expected,…

Adaptive Code Division Multiple Access Protocol for Wireless Network-on-Chip Architectures

NASA Astrophysics Data System (ADS)

Vijayakumaran, Vineeth

Massive levels of integration following Moore's Law ushered in a paradigm shift in the way on-chip interconnections were designed. With higher and higher number of cores on the same die traditional bus based interconnections are no longer a scalable communication infrastructure. On-chip networks were proposed enabled a scalable plug-and-play mechanism for interconnecting hundreds of cores on the same chip. Wired interconnects between the cores in a traditional Network-on-Chip (NoC) system, becomes a bottleneck with increase in the number of cores thereby increasing the latency and energy to transmit signals over them. Hence, there has been many alternative emerging interconnect technologies proposed, namely, 3D, photonic and multi-band RF interconnects. Although they provide better connectivity, higher speed and higher bandwidth compared to wired interconnects; they also face challenges with heat dissipation and manufacturing difficulties. On-chip wireless interconnects is one other alternative proposed which doesn't need physical interconnection layout as data travels over the wireless medium. They are integrated into a hybrid NOC architecture consisting of both wired and wireless links, which provides higher bandwidth, lower latency, lesser area overhead and reduced energy dissipation in communication. However, as the bandwidth of the wireless channels is limited, an efficient media access control (MAC) scheme is required to enhance the utilization of the available bandwidth. This thesis proposes using a multiple access mechanism such as Code Division Multiple Access (CDMA) to enable multiple transmitter-receiver pairs to send data over the wireless channel simultaneously. It will be shown that such a hybrid wireless NoC with an efficient CDMA based MAC protocol can significantly increase the performance of the system while lowering the energy dissipation in data transfer. In this work it is shown that the wireless NoC with the proposed CDMA based MAC protocol outperformed the wired counterparts and several other wireless architectures proposed in literature in terms of bandwidth and packet energy dissipation. Significant gains were observed in packet energy dissipation and bandwidth even with scaling the system to higher number of cores. Non-uniform traffic simulations showed that the proposed CDMA-WiNoC was consistent in bandwidth across all traffic patterns. It is also shown that the CDMA based MAC scheme does not introduce additional reliability concerns in data transfer over the on-chip wireless interconnects.

High-bandwidth and low-loss multimode polymer waveguides and waveguide components for high-speed board-level optical interconnects

NASA Astrophysics Data System (ADS)

Bamiedakis, N.; Chen, J.; Penty, R. V.; White, I. H.

2016-03-01

Multimode polymer waveguides are being increasingly considered for use in short-reach board-level optical interconnects as they exhibit favourable optical properties and allow direct integration onto standard PCBs with conventional methods of the electronics industry. Siloxane-based multimode waveguides have been demonstrated with excellent optical transmission performance, while a wide range of passive waveguide components that offer routing flexibility and enable the implementation of complex on-board interconnection architectures has been reported. In recent work, we have demonstrated that these polymer waveguides can exhibit very high bandwidth-length products in excess of 30 GHz×m despite their highly-multimoded nature, while it has been shown that even larger values of > 60 GHz×m can be achieved by adjusting their refractive index profile. Furthermore, the combination of refractive index engineering and launch conditioning schemes can ensure high bandwidth (> 100 GHz×m) and high coupling efficiency (<1 dB) with standard multimode fibre inputs with relatively large alignment tolerances (~17×15 μm2). In the work presented here, we investigate the effects of refractive index engineering on the performance of passive waveguide components (crossings, bends) and provide suitable design rules for their on-board use. It is shown that, depending on the interconnection layout and link requirements, appropriate choice of refractive index profile can provide enhanced component performance, ensuring low loss interconnection and adequate link bandwidth. The results highlight the strong potential of this versatile optical technology for the formation of high-performance board-level optical interconnects with high routing flexibility.

Preparing Global-Ready Teachers

ERIC Educational Resources Information Center

Larson, Lotta; Brown, Jennifer S.

2017-01-01

To produce global-ready students who can thrive and compete in an interconnected world, we must prepare global-ready teachers. This article shares how one teacher preparation program focuses on literacy, technology, and globalization, while offering relevant K-12 applications.

VCSEL Applications and Simulation

NASA Technical Reports Server (NTRS)

Cheung, Samson; Goorjian, Peter; Ning, Cun-Zheng; Li, Jian-Zhong

2000-01-01

This viewgraph presentation gives an overview of Vertical Cavity Surface Emitting Laser (VCSEL) simulation and its applications. Details are given on the optical interconnection in information technology of VCSEL, the formulation of the simulation, its numeric algorithm, and the computational results.

Development and production integration of a planarized AlCu interconnect process for submicron CMOS

NASA Astrophysics Data System (ADS)

Brown, Kevin C.; Hill, Rodney; Reddy, Krishna; Gadepally, Kamesh

1995-09-01

A planarized aluminum alloy interconnect has been developed as an alternative to tungsten plugs for a 0.65 (mu) CMOS technology. Contact resistance can increase with either an inadequate RF sputter clean or titanium that is too thin to reduce the native oxide. Diffusion barrier results show that a minimum amount of titanium nitride, whether deposited conventionally or with collimation, is necessary for low junction leakage and good sort yield. Stacked contacts and vias are supported while via resistance and defect density are improved. Electrical bridging due to silicon residues from AlSiCu can be minimized with metal overetching, but not to the extent of AlCu. Sidewall pitting was observed to be due to galvanic corrosion from copper precipitate formation. Overall yield has been improved along with decreased wafer cost compared to conventional tungsten plug technology.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Lentine, Anthony L.; DeRose, Christopher T.

In this study, small silicon photonics micro-resonator modulators and filters hold the promise for multi-terabit per-second interconnects at energy consumptions well below 1 pJ/bit. To date, no products exist and little known commercial development is occurring using this technology. Why? In this talk, we review the many challenges that remain to be overcome in bringing this technology from the research labs to the field where they can overcome important commercial, industrial, and national security limitations of existing photonic technologies.

A metallic interconnect for a solid oxide fuel cell stack

NASA Astrophysics Data System (ADS)

England, Diane Mildred

A solid oxide fuel cell (SOFC) electrochemically converts the chemical energy of reaction into electrical energy. The commercial success of planar, SOFC stack technology has a number of challenges, one of which is the interconnect that electrically and physically connects the cathode of one cell to the anode of an adjacent cell in the SOFC stack and in addition, separates the anodic and cathodic gases. An SOFC stack operating at intermediate temperatures, between 600°C and 800°C, can utilize a metallic alloy as an interconnect material. Since the interconnect of an SOFC stack must operate in both air and fuel environments, the oxidation kinetics, adherence and electronic resistance of the oxide scales formed on commercial alloys were investigated in air and wet hydrogen under thermal cycling conditions to 800°C. The alloy, Haynes 230, exhibited the slowest oxidation kinetics and the lowest area-specific resistance as a function of oxidation time of all the alloys in air at 800°C. However, the area-specific resistance of the oxide scale formed on Haynes 230 in wet hydrogen was unacceptably high after only 500 hours of oxidation, which was attributed to the high resistivity of Cr2O3 in a reducing atmosphere. A study of the electrical conductivity of the minor phase manganese chromite, MnXCr3-XO4, in the oxide scale of Haynes 230, revealed that a composition closer to Mn2CrO4 had significantly higher electrical conductivity than that closer to MnCr 2O4. Haynes 230 was coated with Mn to form a phase closer to the Mn2CrO4 composition for application on the fuel side of the interconnect. U.S. Patent No. 6,054,231 is pending. Although coating a metallic alloy is inexpensive, the stringent economic requirements of SOFC stack technology required an alloy without coating for production applications. As no commercially available alloy, among the 41 alloys investigated, performed to the specifications required, a new alloy was created and designated DME-A2. The oxide scale formed on DME-A2 at 800°C exhibited extremely high electrical conductivity with respect to the commercially available alloys studied. This new alloy shows great promise for use as an interconnect material for a planar SOFC stack operating at intermediate temperatures.

Stochastic Lotka-Volterra equations: A model of lagged diffusion of technology in an interconnected world

NASA Astrophysics Data System (ADS)

Chakrabarti, Anindya S.

2016-01-01

We present a model of technological evolution due to interaction between multiple countries and the resultant effects on the corresponding macro variables. The world consists of a set of economies where some countries are leaders and some are followers in the technology ladder. All of them potentially gain from technological breakthroughs. Applying Lotka-Volterra (LV) equations to model evolution of the technology frontier, we show that the way technology diffuses creates repercussions in the partner economies. This process captures the spill-over effects on major macro variables seen in the current highly globalized world due to trickle-down effects of technology.

Modelling Facebook Usage among University Students in Thailand: The Role of Emotional Attachment in an Extended Technology Acceptance Model

ERIC Educational Resources Information Center

Teo, Timothy

2016-01-01

The aim of this study is to examine the factors that influenced the use of Facebook among university students. Using an extended technology acceptance model (TAM) with emotional attachment (EA) as an external variable, a sample of 498 students from a public-funded Thailand university were surveyed on their responses to five variables hypothesized…

Proceedings of a Conference on Telecommunication Technologies, Networkings and Libraries

NASA Astrophysics Data System (ADS)

Knight, N. K.

1981-12-01

Current and developing technologies for digital transmission of image data likely to have an impact on the operations of libraries and information centers or provide support for information networking are reviewed. Technologies reviewed include slow scan television, teleconferencing, and videodisc technology and standards development for computer network interconnection through hardware and software, particularly packet switched networks computer network protocols for library and information service applications, the structure of a national bibliographic telecommunications network; and the major policy issues involved in the regulation or deregulation of the common communications carriers industry.

NEXUS Scalable and Distributed Next-Generation Avionics Bus for Space Missions

NASA Technical Reports Server (NTRS)

He, Yutao; Shalom, Eddy; Chau, Savio N.; Some, Raphael R.; Bolotin, Gary S.

2011-01-01

A paper discusses NEXUS, a common, next-generation avionics interconnect that is transparently compatible with wired, fiber-optic, and RF physical layers; provides a flexible, scalable, packet switched topology; is fault-tolerant with sub-microsecond detection/recovery latency; has scalable bandwidth from 1 Kbps to 10 Gbps; has guaranteed real-time determinism with sub-microsecond latency/jitter; has built-in testability; features low power consumption (< 100 mW per Gbps); is lightweight with about a 5,000-logic-gate footprint; and is implemented in a small Bus Interface Unit (BIU) with reconfigurable back-end providing interface to legacy subsystems. NEXUS enhances a commercial interconnect standard, Serial RapidIO, to meet avionics interconnect requirements without breaking the standard. This unified interconnect technology can be used to meet performance, power, size, and reliability requirements of all ranges of equipment, sensors, and actuators at chip-to-chip, board-to-board, or box-to-box boundary. Early results from in-house modeling activity of Serial RapidIO using VisualSim indicate that the use of a switched, high-performance avionics network will provide a quantum leap in spacecraft onboard science and autonomy capability for science and exploration missions.

Contextualizing Technology in the Classroom via Remote Access: Using Space Exploration Themes and Scanning Electron Microscopy as Tools to Promote Engagement in Geology/Chemistry Experiments

ERIC Educational Resources Information Center

Rodriguez, Brandon; Jaramillo, Veronica; Wolf, Vanessa; Bautista, Esteban; Portillo, Jennifer; Brouke, Alexandra; Min, Ashley; Melendez, Andrea; Amann, Joseph; Pena-Francesch, Abdon; Ashcroft, Jared

2018-01-01

A multidisciplinary science experiment was performed in K-12 classrooms focusing on the interconnection between technology with geology and chemistry. The engagement and passion for science of over eight hundred students across twenty-one classrooms, utilizing a combination of hands-on activities using relationships between Earth and space rock…

Common pressure vessel development for the nickel hydrogen technology

NASA Technical Reports Server (NTRS)

Holleck, G.

1981-01-01

The design of a pressure vessel nickel hydrogen cell is described. The cell has the following key features: it eliminates electrolyte bridging; provides for independent electrolyte management for each unit stack; provides for independent oxygen management for each unit stack; has good heat dissipation; has a mechanically sound and practical interconnection; and has the maximum in common with state of the art individual pressure vessel technology.

Optimal Operation and Management for Smart Grid Subsumed High Penetration of Renewable Energy, Electric Vehicle, and Battery Energy Storage System

NASA Astrophysics Data System (ADS)

Shigenobu, Ryuto; Noorzad, Ahmad Samim; Muarapaz, Cirio; Yona, Atsushi; Senjyu, Tomonobu

2016-04-01

Distributed generators (DG) and renewable energy sources have been attracting special attention in distribution systems in all over the world. Renewable energies, such as photovoltaic (PV) and wind turbine generators are considered as green energy. However, a large amount of DG penetration causes voltage deviation beyond the statutory range and reverse power flow at interconnection points in the distribution system. If excessive voltage deviation occurs, consumer's electric devices might break and reverse power flow will also has a negative impact on the transmission system. Thus, mass interconnections of DGs has an adverse effect on both of the utility and the customer. Therefore, reactive power control method is proposed previous research by using inverters attached DGs for prevent voltage deviations. Moreover, battery energy storage system (BESS) is also proposed for resolve reverse power flow. In addition, it is possible to supply high quality power for managing DGs and BESSs. Therefore, this paper proposes a method to maintain voltage, active power, and reactive power flow at interconnection points by using cooperative controlled of PVs, house BESSs, EVs, large BESSs, and existing voltage control devices. This paper not only protect distribution system, but also attain distribution loss reduction and effectivity management of control devices. Therefore mentioned control objectives are formulated as an optimization problem that is solved by using the Particle Swarm Optimization (PSO) algorithm. Modified scheduling method is proposed in order to improve convergence probability of scheduling scheme. The effectiveness of the proposed method is verified by case studies results and by using numerical simulations in MATLAB®.

Characterization of mechanical and biological properties of 3-D scaffolds reinforced with zinc oxide for bone tissue engineering.

PubMed

Feng, Pei; Wei, Pingpin; Shuai, Cijun; Peng, Shuping

2014-01-01

A scaffold for bone tissue engineering should have highly interconnected porous structure, appropriate mechanical and biological properties. In this work, we fabricated well-interconnected porous β-tricalcium phosphate (β-TCP) scaffolds via selective laser sintering (SLS). We found that the mechanical and biological properties of the scaffolds were improved by doping of zinc oxide (ZnO). Our data showed that the fracture toughness increased from 1.09 to 1.40 MPam(1/2), and the compressive strength increased from 3.01 to 17.89 MPa when the content of ZnO increased from 0 to 2.5 wt%. It is hypothesized that the increase of ZnO would lead to a reduction in grain size and an increase in density of the strut. However, the fracture toughness and compressive strength decreased with further increasing of ZnO content, which may be due to the sharp increase in grain size. The biocompatibility of the scaffolds was investigated by analyzing the adhesion and the morphology of human osteoblast-like MG-63 cells cultured on the surfaces of the scaffolds. The scaffolds exhibited better and better ability to support cell attachment and proliferation when the content of ZnO increased from 0 to 2.5 wt%. Moreover, a bone like apatite layer formed on the surfaces of the scaffolds after incubation in simulated body fluid (SBF), indicating an ability of osteoinduction and osteoconduction. In summary, interconnected porous β-TCP scaffolds doped with ZnO were successfully fabricated and revealed good mechanical and biological properties, which may be used for bone repair and replacement potentially.

Attached cultivation technology of microalgae for efficient biomass feedstock production.

PubMed

Liu, Tianzhong; Wang, Junfeng; Hu, Qiang; Cheng, Pengfei; Ji, Bei; Liu, Jinli; Chen, Yu; Zhang, Wei; Chen, Xiaoling; Chen, Lin; Gao, Lili; Ji, Chunli; Wang, Hui

2013-01-01

The potential of microalgae biofuel has not been realized because of low productivity and high costs associated with the current cultivation systems. In this paper, an attached cultivation method was introduced, in which microalgae cells grew on the surface of vertical artificial supporting material to form algal film. Multiple of the algal films were assembled in an array fashion to dilute solar irradiation to facilitate high photosynthetic efficiency. Results showed that a broad range of microalgae species can grow with this attached method. A biomass productivity of 50-80 g m(-2) d(-1) was obtained outdoors for Scenedesmus obliquus, corresponding to the photosynthetic efficiency of 5.2-8.3% (total solar radiation). This attached method also offers lots of possible advantages over traditional open ponds, such as on water saving, harvesting, contamination controlling and scale-up. The attached cultivation represents a promising technology for economically viable production of microalgae biofuels. Copyright © 2012 Elsevier Ltd. All rights reserved.

Linear induction pump

DOEpatents

Meisner, John W.; Moore, Robert M.; Bienvenue, Louis L.

1985-03-19

Electromagnetic linear induction pump for liquid metal which includes a unitary pump duct. The duct comprises two substantially flat parallel spaced-apart wall members, one being located above the other and two parallel opposing side members interconnecting the wall members. Located within the duct are a plurality of web members interconnecting the wall members and extending parallel to the side members whereby the wall members, side members and web members define a plurality of fluid passageways, each of the fluid passageways having substantially the same cross-sectional flow area. Attached to an outer surface of each side member is an electrically conductive end bar for the passage of an induced current therethrough. A multi-phase, electrical stator is located adjacent each of the wall members. The duct, stators, and end bars are enclosed in a housing which is provided with an inlet and outlet in fluid communication with opposite ends of the fluid passageways in the pump duct. In accordance with a preferred embodiment, the inlet and outlet includes a transition means which provides for a transition from a round cross-sectional flow path to a substantially rectangular cross-sectional flow path defined by the pump duct.

Biwavelength transceiver module for parallel simultaneous bidirectional optical interconnections

NASA Astrophysics Data System (ADS)

Nguyen, Nga T. H.; Ukaegbu, Ikechi A.; Sangirov, Jamshid; Cho, Mu-Hee; Lee, Tae-Woo; Park, Hyo-Hoon

2013-12-01

The design of a biwavelength transceiver (TRx) module for parallel simultaneous bidirectional optical interconnects is described. The TRx module has been implemented using two different wavelengths, 850 and 1060 nm, to send and receive signals simultaneously through a common optical interface while optimizing cost and performance. Filtering mirrors are formed in the optical fibers which are embedded on a V-grooved silicon substrate for reflecting and filtering optical signals from/to vertical-cavity surface-emitting laser (VCSEL)/photodiode (PD). The VCSEL and PD are flip-chip bonded on individual silicon optical benches, which are attached on the silicon substrate for optical signal coupling from the VCSEL to fiber and from fiber to the PD. A high-speed and low-loss ceramic printed circuit board, which has a compact size of 0.033 cc, has been designed to carry transmitter and receiver chips for easy packaging of the TRx module. Applied for quad small form-factor pluggable applications at 40-Gbps operation, the four-channel biwavelength TRx module showed clear eye diagrams with a bit error rate (BER) of 10-12 at input powers of -5 and -5.8 dBm for 1060 and 850 nm operation modes, respectively.

On Event-Triggered Adaptive Architectures for Decentralized and Distributed Control of Large-Scale Modular Systems

PubMed Central

Albattat, Ali; Gruenwald, Benjamin C.; Yucelen, Tansel

2016-01-01

The last decade has witnessed an increased interest in physical systems controlled over wireless networks (networked control systems). These systems allow the computation of control signals via processors that are not attached to the physical systems, and the feedback loops are closed over wireless networks. The contribution of this paper is to design and analyze event-triggered decentralized and distributed adaptive control architectures for uncertain networked large-scale modular systems; that is, systems consist of physically-interconnected modules controlled over wireless networks. Specifically, the proposed adaptive architectures guarantee overall system stability while reducing wireless network utilization and achieving a given system performance in the presence of system uncertainties that can result from modeling and degraded modes of operation of the modules and their interconnections between each other. In addition to the theoretical findings including rigorous system stability and the boundedness analysis of the closed-loop dynamical system, as well as the characterization of the effect of user-defined event-triggering thresholds and the design parameters of the proposed adaptive architectures on the overall system performance, an illustrative numerical example is further provided to demonstrate the efficacy of the proposed decentralized and distributed control approaches. PMID:27537894

On Event-Triggered Adaptive Architectures for Decentralized and Distributed Control of Large-Scale Modular Systems.

PubMed

Albattat, Ali; Gruenwald, Benjamin C; Yucelen, Tansel

2016-08-16

The last decade has witnessed an increased interest in physical systems controlled over wireless networks (networked control systems). These systems allow the computation of control signals via processors that are not attached to the physical systems, and the feedback loops are closed over wireless networks. The contribution of this paper is to design and analyze event-triggered decentralized and distributed adaptive control architectures for uncertain networked large-scale modular systems; that is, systems consist of physically-interconnected modules controlled over wireless networks. Specifically, the proposed adaptive architectures guarantee overall system stability while reducing wireless network utilization and achieving a given system performance in the presence of system uncertainties that can result from modeling and degraded modes of operation of the modules and their interconnections between each other. In addition to the theoretical findings including rigorous system stability and the boundedness analysis of the closed-loop dynamical system, as well as the characterization of the effect of user-defined event-triggering thresholds and the design parameters of the proposed adaptive architectures on the overall system performance, an illustrative numerical example is further provided to demonstrate the efficacy of the proposed decentralized and distributed control approaches.

Development of a biodegradable scaffold with interconnected pores by heat fusion and its application to bone tissue engineering.

PubMed

Shin, Michael; Abukawa, Harutsugi; Troulis, Maria J; Vacanti, Joseph P

2008-03-01

Tissue engineering has been proposed as an approach to alleviate the shortage of donor tissue and organs by combining cells and a biodegradable scaffold as a temporary extracellular matrix. While numerous scaffold fabrication methods have been proposed, tissue formation is typically limited to the surface of the scaffolds in bone tissue engineering applications due to early calcification on the surface. To improve tissue formation, a novel scaffold with a hierarchical interconnected pore structure on two distinct length scales has been developed. Here we present the fabrication process and the application of the scaffold to bone tissue engineering. Porous poly(lactide-co-glycolide) (PLGA) scaffolds were made by combining solvent casting/particulate leaching with heat fusion. Porcine bone marrow-derived mesenchymal stem cells (MSCs) were differentiated into osteoblasts and cultured on these scaffolds in vitro for 2, 4, and 6 weeks. Subsequently, the constructs were assessed using histology and scanning electron microscopy. The bone marrow-derived osteoblasts attached well on these scaffolds. Cells were observed throughout the scaffolds. These initial results show promise for this scaffold to aid in the regeneration of bone. (c) 2007 Wiley Periodicals, Inc.

Chip-scale thermal management of high-brightness LED packages

NASA Astrophysics Data System (ADS)

Arik, Mehmet; Weaver, Stanton

2004-10-01

The efficiency and reliability of the solid-state lighting devices strongly depend on successful thermal management. Light emitting diodes, LEDs, are a strong candidate for the next generation, general illumination applications. LEDs are making great strides in terms of lumen performance and reliability, however the barrier to widespread use in general illumination still remains the cost or $/Lumen. LED packaging designers are pushing the LED performance to its limits. This is resulting in increased drive currents, and thus the need for lower thermal resistance packaging designs. As the power density continues to rise, the integrity of the package electrical and thermal interconnect becomes extremely important. Experimental results with high brightness LED packages show that chip attachment defects can cause significant thermal gradients across the LED chips leading to premature failures. A numerical study was also carried out with parametric models to understand the chip active layer temperature profile variation due to the bump defects. Finite element techniques were utilized to evaluate the effects of localized hot spots at the chip active layer. The importance of "zero defects" in one of the more popular interconnect schemes; the "epi down" soldered flip chip configuration is investigated and demonstrated.

Vertical cavity surface emitting lasers based on InP and related compounds -- Bottleneck and corkscrew

DOE Office of Scientific and Technical Information (OSTI.GOV)

Iga, K.

1996-12-31

Vertical optical interconnects of LSI chips and circuit boards and multiple fiber systems may be the most interesting field related to SE lasers. From this point of view, the device should be small as possible. The future process technology for it including epitaxy and etching will drastically change the situation of SE lasers. Dome optical technologies are already introduced in various subsystems, but the arrayed microoptic technology would be very helpful for advanced systems.

Gender and family influences on Spanish students' aspirations and values in stem fields

NASA Astrophysics Data System (ADS)

Sáinz, Milagros; Müller, Jörg

2018-01-01

Drawing on expectancy-value theory, this study examines gender and family influences on students' career aspirations and attached values. 796 secondary Spanish students (M age = 16 years old, S.D. = 0.81) participated. 53% were boys. The results show that boys and students with mothers who have completed intermediate level education were more interested in science, technology, engineering and mathematics (STEM) architecture and technology. Girls and students with highly educated mothers born in Spain were more likely to aspire to STEM health and experimental studies. Furthermore, boys and students planning to pursue STEM-technology studies attached higher extrinsic values to these studies. On the contrary, girls and participants with interest in experimental and health studies attached less extrinsic values to these studies. Moreover, students with highly educated mothers and interested in STEM architecture and technology reported higher extrinsic values. Understanding the interaction of gender and family factors shaping adolescents' career aspirations in STEM fields seems to be crucial to designing significant and effective school and family grounded interventions.

Network Payload Integration for the Scan-Eagle UAV

DTIC Science & Technology

2007-12-01

With the increasing maturity of MESH network technology, it is inevitable that we exploit the synergistic capabilities in networking of autonomous ... vehicles . The interconnectivity enables the sharing or dissemination of information between various nodes and has the capability to enhance

36 CFR 1194.4 - Definitions.

Code of Federal Regulations, 2010 CFR

2010-07-01

... technology. Any item, piece of equipment, or system, whether acquired commercially, modified, or customized... interconnected system or subsystem of equipment, that is used in the creation, conversion, or duplication of data..., display, switching, interchange, transmission, or reception of data or information. For example, HVAC...

36 CFR 1194.4 - Definitions.

Code of Federal Regulations, 2014 CFR

2014-07-01

... technology. Any item, piece of equipment, or system, whether acquired commercially, modified, or customized... interconnected system or subsystem of equipment, that is used in the creation, conversion, or duplication of data..., display, switching, interchange, transmission, or reception of data or information. For example, HVAC...

36 CFR 1194.4 - Definitions.

Code of Federal Regulations, 2011 CFR

2011-07-01

... technology. Any item, piece of equipment, or system, whether acquired commercially, modified, or customized... interconnected system or subsystem of equipment, that is used in the creation, conversion, or duplication of data..., display, switching, interchange, transmission, or reception of data or information. For example, HVAC...

36 CFR § 1194.4 - Definitions.

Code of Federal Regulations, 2013 CFR

2013-07-01

... description. Assistive technology. Any item, piece of equipment, or system, whether acquired commercially... equipment or interconnected system or subsystem of equipment, that is used in the creation, conversion, or... information. For example, HVAC (heating, ventilation, and air conditioning) equipment such as thermostats or...

36 CFR 1194.4 - Definitions.

Code of Federal Regulations, 2012 CFR

2012-07-01

... technology. Any item, piece of equipment, or system, whether acquired commercially, modified, or customized... interconnected system or subsystem of equipment, that is used in the creation, conversion, or duplication of data..., display, switching, interchange, transmission, or reception of data or information. For example, HVAC...

12 CFR 1072.103 - Definitions.

Code of Federal Regulations, 2014 CFR

2014-01-01

... means information technology and any equipment or interconnected system or subsystem of equipment that... data or information. For example, HVAC (heating, ventilation, and air conditioning) equipment such as... of major bodily functions of the immune system, special sense organs and skin, normal cell growth...

12 CFR 1072.103 - Definitions.

Code of Federal Regulations, 2013 CFR

2013-01-01

... means information technology and any equipment or interconnected system or subsystem of equipment that... data or information. For example, HVAC (heating, ventilation, and air conditioning) equipment such as... of major bodily functions of the immune system, special sense organs and skin, normal cell growth...

Note: cryogenic microstripline-on-Kapton microwave interconnects.

PubMed

Harris, A I; Sieth, M; Lau, J M; Church, S E; Samoska, L A; Cleary, K

2012-08-01

Simple broadband microwave interconnects are needed for increasing the size of focal plane heterodyne radiometer arrays. We have measured loss and crosstalk for arrays of microstrip transmission lines in flex circuit technology at 297 and 77 K, finding good performance to at least 20 GHz. The dielectric constant of Kapton substrates changes very little from 297 to 77 K, and the electrical loss drops. The small cross-sectional area of metal in a printed circuit structure yields overall thermal conductivities similar to stainless steel coaxial cable. Operationally, the main performance tradeoffs are between crosstalk and thermal conductivity. We tested a patterned ground plane to reduce heat flux.

Interconnected magnetic tunnel junctions for spin-logic applications

NASA Astrophysics Data System (ADS)

Manfrini, Mauricio; Vaysset, Adrien; Wan, Danny; Raymenants, Eline; Swerts, Johan; Rao, Siddharth; Zografos, Odysseas; Souriau, Laurent; Gavan, Khashayar Babaei; Rassoul, Nouredine; Radisic, Dunja; Cupak, Miroslav; Dehan, Morin; Sayan, Safak; Nikonov, Dmitri E.; Manipatruni, Sasikanth; Young, Ian A.; Mocuta, Dan; Radu, Iuliana P.

2018-05-01

With the rapid progress of spintronic devices, spin-logic concepts hold promises of energy-delay conscious computation for efficient logic gate operations. We report on the electrical characterization of domain walls in interconnected magnetic tunnel junctions. By means of spin-transfer torque effect, domains walls are produced at the common free layer and its propagation towards the output pillar sensed by tunneling magneto-resistance. Domain pinning conditions are studied quasi-statically showing a strong dependence on pillar size, ferromagnetic free layer width and inter-pillar distance. Addressing pinning conditions are detrimental for cascading and fan-out of domain walls across nodes, enabling the realization of domain-wall-based logic technology.

Support and maneuvering apparatus for solar energy receivers

DOEpatents

Murphy, L.M.

1988-07-28

A support and maneuvering apparatus is disclosed for a solar energy receiving device adapted for receiving and concentrating solar energy and having a central axis extending through the center thereof. The apparatus includes a frame for mounting the perimeter of said solar energy receiving device. A support member extends along the central axis of the receiving device and has a base end passing through the center of the receiving device and an outer distal end adapted for carrying a solar energy receiving and conversion mechanism. A variable tension mechanism interconnects the support member with the frame to provide stiffening for the support member and the frame and to assist in the alignment of the frame to optimize the optical efficiency of the solar energy receiving device. A rotatable base is provided, and connecting members extend from the base for pivotable attachment to the frame at spaced positions therealong. Finally, an elevation assembly is connected to the receiving device for selectively pivoting the receiving about an axis defined between the attachment positions of the connecting members on the frame. 4 figs.

Support and maneuvering apparatus for solar energy receivers

DOEpatents

Murphy, Lawrence M.

1989-01-01

A support and maneuvering apparatus is disclosed for a solar energy receiving device adpated for receiving and concentrating solar energy and having a central axis extending through the center thereof. The apparatus includes a frame for mounting the perimeter of said solar energy receiving device. A support member extends along the central axis of the receiving device and has a base end passing through the center of the receiving device and an outer distal end adapted for carrying a solar energy receiving and conversion mechanism. A variable tension mechanism interconnects the support member with the frame to provide stiffening for the support member and the frame and to assist in the alignment of the frame to optimize the optical efficiency of the solar energy receiving device. A rotatable base is provided, and connecting members extend from the base for pivotable attachment to the frame at spaced positions therealong. Finally, an elevation assembly is connected to the receiving device for selectively pivoting the receiving device about an axis defined between the attachment positions of the connecting members on the frame.

Interconnects for intermediate temperature solid oxide fuel cells

NASA Astrophysics Data System (ADS)

Huang, Wenhua

Presently, one of the principal goals of solid oxide fuel cells (SOFCs) research is to reduce the stack operating temperature to between 600 and 800°C. However, one of the principal technological barriers is the non-availability of a suitable material satisfying all of the stability requirements for the interconnect. In this work two approaches for intermediate temperature SOFC interconnects have been explored. The first approach comprises an interconnect consisting of a bi-layer structure, a p-type oxide (La0.96Sr0.08MnO 2.001/LSM) layer exposed to a cathodic environment, and an n-type oxide (Y0.08Sr0.88Ti0.95Al0.05O 3-delta/YSTA) layer exposed to anodic conditions. Theoretical analysis based on the bi-layer structure has established design criteria to implement this approach. The analysis shows that the interfacial oxygen partial pressure, which determines the interconnect stability, is independent of the electronic conductivities of both layers but dependent on the oxygen ion layer interconnects, the oxygen ion conductivities of LSM and YSTA were measured as a function of temperature and oxygen partial pressure. Based on the measured data, it has been determined that if the thickness of YSTA layer is around 0.1cm, the thickness of LSM layer should be around 0.6 mum in order to maintain the stability of LSM. In a second approach, a less expensive stainless steel interconnect has been studied. However, one of the major concerns associated with the use of metallic interconnects is the development of a semi-conducting or insulating oxide scale and chromium volatility during extended exposure to the SOFC operating environment. Dense and well adhered Mn-Cu spinet oxide coatings were successfully deposited on stainless steel by an electrophoretic deposition (EPD) technique. It was found that the Mn-Cu-O coating significantly reduced the oxidation rate of the stainless steel and the volatility of chromium. The area specific resistance (ASR) of coated Crofer 22 APU is expected to he around 1.2x10 -2Ocm2 after exposure to air at 800°C for 50000 hours. This demonstrates that Crofer 22 APU with CuMn1.8O 4 coating deposited by EPD is suitable for application as interconnects in intermediate temperature SOFCs.

Novel Highly Parallel and Systolic Architectures Using Quantum Dot-Based Hardware

NASA Technical Reports Server (NTRS)

Fijany, Amir; Toomarian, Benny N.; Spotnitz, Matthew

1997-01-01

VLSI technology has made possible the integration of massive number of components (processors, memory, etc.) into a single chip. In VLSI design, memory and processing power are relatively cheap and the main emphasis of the design is on reducing the overall interconnection complexity since data routing costs dominate the power, time, and area required to implement a computation. Communication is costly because wires occupy the most space on a circuit and it can also degrade clock time. In fact, much of the complexity (and hence the cost) of VLSI design results from minimization of data routing. The main difficulty in VLSI routing is due to the fact that crossing of the lines carrying data, instruction, control, etc. is not possible in a plane. Thus, in order to meet this constraint, the VLSI design aims at keeping the architecture highly regular with local and short interconnection. As a result, while the high level of integration has opened the way for massively parallel computation, practical and full exploitation of such a capability in many applications of interest has been hindered by the constraints on interconnection pattern. More precisely. the use of only localized communication significantly simplifies the design of interconnection architecture but at the expense of somewhat restricted class of applications. For example, there are currently commercially available products integrating; hundreds of simple processor elements within a single chip. However, the lack of adequate interconnection pattern among these processing elements make them inefficient for exploiting a large degree of parallelism in many applications.

Integrated optical circuit engineering V; Proceedings of the Meeting, San Diego, CA, Aug. 17-20, 1987

NASA Astrophysics Data System (ADS)

Mentzer, Mark A.

Recent advances in the theoretical and practical design and applications of optoelectronic devices and optical circuits are examined in reviews and reports. Topics discussed include system and market considerations, guided-wave phenomena, waveguide devices, processing technology, lithium niobate devices, and coupling problems. Consideration is given to testing and measurement, integrated optics for fiber-optic systems, optical interconnect technology, and optical computing.

Emerging Communication Technologies (ECT) Phase 3 Final Report

NASA Technical Reports Server (NTRS)

Bastin, Gary L.; Harris, William G.; Bates, Lakesha D.; Nelson, Richard A.

2004-01-01

The Emerging Communication Technology (ECT) project investigated three First Mile communication technologies in support of NASA s Second Generation Reusable Launch Vehicle (2nd Gen RLV), Orbital Space Plane, Advanced Range Technology Working Group (ARTWG) and the Advanced Spaceport Technology Working Group (ASTWG). These First Mile technologies have the purpose of interconnecting mobile users with existing Range Communication infrastructures. ECT was a continuation of the Range Information System Management (RISM) task started in 2002. RISM identified the three advance communication technologies investigated under ECT. These were Wireless Ethernet (Wi-Fi), Free Space Optics (FSO), and Ultra Wideband (UWB). Due to the report s size, it has been broken into three volumes: 1) Main Report 2) Appendices 3) UWB.

Adolescent Internet Abuse: A Study on the Role of Attachment to Parents and Peers in a Large Community Sample

PubMed Central

Volpi, Barbara; Marzilli, Eleonora; Tambelli, Renata

2018-01-01

Adolescents are the main users of new technologies and their main purpose of use is social interaction. Although new technologies are useful to teenagers, in addressing their developmental tasks, recent studies have shown that they may be an obstacle in their growth. Research shows that teenagers with Internet addiction experience lower quality in their relationships with parents and more individual difficulties. However, limited research is available on the role played by adolescents' attachment to parents and peers, considering their psychological profiles. We evaluated in a large community sample of adolescents (N = 1105) the Internet use/abuse, the adolescents' attachment to parents and peers, and their psychological profiles. Hierarchical regression analyses were conducted to verify the influence of parental and peer attachment on Internet use/abuse, considering the moderating effect of adolescents' psychopathological risk. Results showed that adolescents' attachment to parents had a significant effect on Internet use. Adolescents' psychopathological risk had a moderating effect on the relationship between attachment to mothers and Internet use. Our study shows that further research is needed, taking into account both individual and family variables. PMID:29707572

Silent Sentry

NASA Technical Reports Server (NTRS)

1980-01-01

NASA developed personal security system, commercialized by Sentry Products, Inc. enables resident to summon instant help in case of medical emergency or threatened violence. Its principal elements are a pen-shaped signaling device, "silent" because its ultrasonic alert signal is inaudible to the human ear, and a system of receivers interconnected with a constantly-monitored aster console. SCAN pen weighs only two ounces and is worn on necklace or attached by a clip to the user's clothing. The person in trouble simply presses a clasp, releasing a hammer inside the pen which strikes an aluminum bar. The impact causes the bar to resonate like a tuning fork and emit the ultrasonic signal, which is detected by the nearest receiver.

Technology-Supported Inquiry for Learning about Aquatic Ecosystems

ERIC Educational Resources Information Center

Hmelo-Silver, Cindy E.; Eberbach, Catherine; Jordan, Rebecca

2014-01-01

Understanding ecosystems is challenging, but important for becoming environmentally-literate citizens of today's society. People have difficulty considering how different components, mechanisms, and phenomena, both visible and invisible, are interconnected within ecosystems. This research presents both the design and initial testing of an…

Investigation of ball bond integrity for 0.8 mil (20 microns) diameter gold bonding wire on low k die in wire bonding technology

NASA Astrophysics Data System (ADS)

Kudtarkar, Santosh Anil

Microelectronics technology has been undergoing continuous scaling to accommodate customer driven demand for smaller, faster and cheaper products. This demand has been satisfied by using novel materials, design techniques and processes. This results in challenges for the chip connection technology and also the package technology. The focus of this research endeavor was restricted to wire bond interconnect technology using gold bonding wires. Wire bond technology is often regarded as a simple first level interconnection technique. In reality, however, this is a complex process that requires a thorough understanding of the interactions between the design, material and process variables, and their impact on the reliability of the bond formed during this process. This research endeavor primarily focused on low diameter, 0.8 mil thick (20 mum) diameter gold bonding wire. Within the scope of this research, the integrity of the ball bond formed by 1.0 mil (25 mum) and 0.8 mil (20 mum) diameter wires was compared. This was followed by the evaluation of bonds formed on bond pads having doped SiO2 (low k) as underlying structures. In addition, the effect of varying the percentage of the wire dopant, palladium and bonding process parameters (bonding force, bond time, ultrasonic energy) for 0.8 mil (20 mum) bonding wire was also evaluated. Finally, a degradation empirical model was developed to understand the decrease in the wire strength. This research effort helped to develop a fundamental understanding of the various factors affecting the reliability of a ball bond from a design (low diameter bonding wire), material (low k and bonding wire dopants), and process (wire bonding process parameters) perspective for a first level interconnection technique, namely wire bonding. The significance of this research endeavor was the systematic investigation of the ball bonds formed using 0.8 mil (20 microm) gold bonding wire within the wire bonding arena. This research addressed low k structures on 90 nm silicon technology, bonding wires with different percentage of doping element (palladium), and different levels of bonding process parameters. An empirical model to understand the high temperature effects for bonds formed using the low diameter wire was also developed.

Plastic straw: future of high-speed signaling

NASA Astrophysics Data System (ADS)

Song, Ha Il; Jin, Huxian; Bae, Hyeon-Min

2015-11-01

The ever-increasing demand for bandwidth triggered by mobile and video Internet traffic requires advanced interconnect solutions satisfying functional and economic constraints. A new interconnect called E-TUBE is proposed as a cost-and-power-effective all-electrical-domain wideband waveguide solution for high-speed high-volume short-reach communication links. The E-TUBE achieves an unprecedented level of performance in terms of bandwidth-per-carrier frequency, power, and density without requiring a precision manufacturing process unlike conventional optical/waveguide solutions. The E-TUBE exhibits a frequency-independent loss-profile of 4 dB/m and has nearly 20-GHz bandwidth over the V band. A single-sideband signal transmission enabled by the inherent frequency response of the E-TUBE renders two-times data throughput without any physical overhead compared to conventional radio frequency communication technologies. This new interconnect scheme would be attractive to parties interested in high throughput links, including but not limited to, 100/400 Gbps chip-to-chip communications.

Towards energy aware optical networks and interconnects

NASA Astrophysics Data System (ADS)

Glesk, Ivan; Osadola, Tolulope; Idris, Siti

2013-10-01

In a today's world, information technology has been identified as one of the major factors driving economic prosperity. Datacenters businesses have been growing significantly in the past few years. The equipments in these datacenters need to be efficiently connected to each other and also to the outside world in order to enable effective exchange of information. This is why there is need for highly scalable, energy savvy and reliable network connectivity infrastructure that is capable of accommodating the large volume of data being exchanged at any time within the datacenter network and the outside network in general. These devices that can ensure such effective connectivity currently require large amount of energy in order to meet up with these increasing demands. In this paper, an overview of works being done towards realizing energy aware optical networks and interconnects for datacenters is presented. Also an OCDMA approach is discussed as potential multiple access technique for future optical network interconnections. We also presented some challenges that might inhibit effective implementation of the OCDMA multiplexing scheme.

Ballistic One-Dimensional InAs Nanowire Cross-Junction Interconnects.

PubMed

Gooth, Johannes; Borg, Mattias; Schmid, Heinz; Schaller, Vanessa; Wirths, Stephan; Moselund, Kirsten; Luisier, Mathieu; Karg, Siegfried; Riel, Heike

2017-04-12

Coherent interconnection of quantum bits remains an ongoing challenge in quantum information technology. Envisioned hardware to achieve this goal is based on semiconductor nanowire (NW) circuits, comprising individual NW devices that are linked through ballistic interconnects. However, maintaining the sensitive ballistic conduction and confinement conditions across NW intersections is a nontrivial problem. Here, we go beyond the characterization of a single NW device and demonstrate ballistic one-dimensional (1D) quantum transport in InAs NW cross-junctions, monolithically integrated on Si. Characteristic 1D conductance plateaus are resolved in field-effect measurements across up to four NW-junctions in series. The 1D ballistic transport and sub-band splitting is preserved for both crossing-directions. We show that the 1D modes of a single injection terminal can be distributed into multiple NW branches. We believe that NW cross-junctions are well-suited as cross-directional communication links for the reliable transfer of quantum information as required for quantum computational systems.

Cybersecurity through Real-Time Distributed Control Systems

DOE Office of Scientific and Technical Information (OSTI.GOV)

Kisner, Roger A; Manges, Wayne W; MacIntyre, Lawrence Paul

2010-04-01

Critical infrastructure sites and facilities are becoming increasingly dependent on interconnected physical and cyber-based real-time distributed control systems (RTDCSs). A mounting cybersecurity threat results from the nature of these ubiquitous and sometimes unrestrained communications interconnections. Much work is under way in numerous organizations to characterize the cyber threat, determine means to minimize risk, and develop mitigation strategies to address potential consequences. While it seems natural that a simple application of cyber-protection methods derived from corporate business information technology (IT) domain would lead to an acceptable solution, the reality is that the characteristics of RTDCSs make many of those methods inadequatemore » and unsatisfactory or even harmful. A solution lies in developing a defense-in-depth approach that ranges from protection at communications interconnect levels ultimately to the control system s functional characteristics that are designed to maintain control in the face of malicious intrusion. This paper summarizes the nature of RTDCSs from a cybersecurity perspec tive and discusses issues, vulnerabilities, candidate mitigation approaches, and metrics.« less

The Unification of Space Qualified Integrated Circuits by Example of International Space Project GAMMA-400

NASA Astrophysics Data System (ADS)

Bobkov, S. G.; Serdin, O. V.; Arkhangelskiy, A. I.; Arkhangelskaja, I. V.; Suchkov, S. I.; Topchiev, N. P.

The problem of electronic component unification at the different levels (circuits, interfaces, hardware and software) used in space industry is considered. The task of computer systems for space purposes developing is discussed by example of scientific data acquisition system for space project GAMMA-400. The basic characteristics of high reliable and fault tolerant chips developed by SRISA RAS for space applicable computational systems are given. To reduce power consumption and enhance data reliability, embedded system interconnect made hierarchical: upper level is Serial RapidIO 1x or 4x with rate transfer 1.25 Gbaud; next level - SpaceWire with rate transfer up to 400 Mbaud and lower level - MIL-STD-1553B and RS232/RS485. The Ethernet 10/100 is technology interface and provided connection with the previously released modules too. Systems interconnection allows creating different redundancy systems. Designers can develop heterogeneous systems that employ the peer-to-peer networking performance of Serial RapidIO using multiprocessor clusters interconnected by SpaceWire.

Device and circuit-level performance of carbon nanotube field-effect transistor with benchmarking against a nano-MOSFET

PubMed Central

2012-01-01

The performance of a semiconducting carbon nanotube (CNT) is assessed and tabulated for parameters against those of a metal-oxide-semiconductor field-effect transistor (MOSFET). Both CNT and MOSFET models considered agree well with the trends in the available experimental data. The results obtained show that nanotubes can significantly reduce the drain-induced barrier lowering effect and subthreshold swing in silicon channel replacement while sustaining smaller channel area at higher current density. Performance metrics of both devices such as current drive strength, current on-off ratio (Ion/Ioff), energy-delay product, and power-delay product for logic gates, namely NAND and NOR, are presented. Design rules used for carbon nanotube field-effect transistors (CNTFETs) are compatible with the 45-nm MOSFET technology. The parasitics associated with interconnects are also incorporated in the model. Interconnects can affect the propagation delay in a CNTFET. Smaller length interconnects result in higher cutoff frequency. PMID:22901374

Improvement in plasma illumination properties of ultrananocrystalline diamond films by grain boundary engineering

NASA Astrophysics Data System (ADS)

Sankaran, K. J.; Srinivasu, K.; Chen, H. C.; Dong, C. L.; Leou, K. C.; Lee, C. Y.; Tai, N. H.; Lin, I. N.

2013-08-01

Microstructural evolution of ultrananocrystalline diamond (UNCD) films as a function of substrate temperature (TS) and/or by introducing H2 in Ar/CH4 plasma is investigated. Variation of the sp2 and sp3 carbon content is analyzed using UV-Raman and near-edge X-ray absorption fine structure spectra. Morphological and microstructural studies confirm that films deposited using Ar/CH4 plasma at low TS consist of a random distribution of spherically shaped ultra-nano diamond grains with distinct sp2-bonded grain boundaries, which are attributed to the adherence of CH radicals to the nano-sized diamond clusters. By increasing TS, adhering efficiency of CH radicals to the diamond lattice drops and trans-polyacetylene (t-PA) encapsulating the nano-sized diamond grains break, whereas the addition of 1.5% H2 in Ar/CH4 plasma at low TS induces atomic hydrogen that preferentially etches out the t-PA attached to ultra-nano diamond grains. Both cases make the sp3-diamond phase less passivated. This leads to C2 radicals attaching to the diamond lattice promoting elongated clustered grains along with a complicated defect structure. Such a grain growth model is highly correlated to explain the technologically important functional property, namely, plasma illumination (PI) of UNCD films. Superior PI properties, viz. low threshold field of 0.21 V/μm with a high PI current density of 4.10 mA/cm2 (at an applied field of 0.25 V/μm) and high γ-coefficient (0.2604) are observed for the UNCD films possessing ultra-nano grains with a large fraction of grain boundary phases. The grain boundary component consists of a large amount of sp2-carbon phases that possibly form interconnected paths for facilitating the transport of electrons and the electron field emission process that markedly enhance PI properties.

[The reasons why 13 MK1 attachment were re-fabricated and some methods for improvement].

PubMed

Wu, Zhi-hong; Zhang, Xue-jun; Zhao, Jun

2013-12-01

To investigate the reasons why 13 MK1 attachment were re-fabricated and to suggest some improvement methods. Mechanics and denture production technology were reviewed in 13 cases with MK1 attachment denture to determine the causes of failure. In some cases, MK1 attachments were poorly designed, while in other cases problems were found during denture design and production process due to limited experiences at the initial stage. MK1 attachments were re-done based on the specific cause and the outcome was good after 1-1.5 years of follow-up. When using MK1 attachment, prosthodontists should be familiar with the characteristics and indications of MK1 attachment. Meanwhile, we should strengthen doctor-patient communication and follow up patients timely to improve the success rate of MK1 attached denture repair.

Standard semiconductor packaging for high-reliability low-cost MEMS applications

NASA Astrophysics Data System (ADS)

Harney, Kieran P.

2005-01-01

Microelectronic packaging technology has evolved over the years in response to the needs of IC technology. The fundamental purpose of the package is to provide protection for the silicon chip and to provide electrical connection to the circuit board. Major change has been witnessed in packaging and today wafer level packaging technology has further revolutionized the industry. MEMS (Micro Electro Mechanical Systems) technology has created new challenges for packaging that do not exist in standard ICs. However, the fundamental objective of MEMS packaging is the same as traditional ICs, the low cost and reliable presentation of the MEMS chip to the next level interconnect. Inertial MEMS is one of the best examples of the successful commercialization of MEMS technology. The adoption of MEMS accelerometers for automotive airbag applications has created a high volume market that demands the highest reliability at low cost. The suppliers to these markets have responded by exploiting standard semiconductor packaging infrastructures. However, there are special packaging needs for MEMS that cannot be ignored. New applications for inertial MEMS devices are emerging in the consumer space that adds the imperative of small size to the need for reliability and low cost. These trends are not unique to MEMS accelerometers. For any MEMS technology to be successful the packaging must provide the basic reliability and interconnection functions, adding the least possible cost to the product. This paper will discuss the evolution of MEMS packaging in the accelerometer industry and identify the main issues that needed to be addressed to enable the successful commercialization of the technology in the automotive and consumer markets.

Standard semiconductor packaging for high-reliability low-cost MEMS applications

NASA Astrophysics Data System (ADS)

Harney, Kieran P.

2004-12-01

Microelectronic packaging technology has evolved over the years in response to the needs of IC technology. The fundamental purpose of the package is to provide protection for the silicon chip and to provide electrical connection to the circuit board. Major change has been witnessed in packaging and today wafer level packaging technology has further revolutionized the industry. MEMS (Micro Electro Mechanical Systems) technology has created new challenges for packaging that do not exist in standard ICs. However, the fundamental objective of MEMS packaging is the same as traditional ICs, the low cost and reliable presentation of the MEMS chip to the next level interconnect. Inertial MEMS is one of the best examples of the successful commercialization of MEMS technology. The adoption of MEMS accelerometers for automotive airbag applications has created a high volume market that demands the highest reliability at low cost. The suppliers to these markets have responded by exploiting standard semiconductor packaging infrastructures. However, there are special packaging needs for MEMS that cannot be ignored. New applications for inertial MEMS devices are emerging in the consumer space that adds the imperative of small size to the need for reliability and low cost. These trends are not unique to MEMS accelerometers. For any MEMS technology to be successful the packaging must provide the basic reliability and interconnection functions, adding the least possible cost to the product. This paper will discuss the evolution of MEMS packaging in the accelerometer industry and identify the main issues that needed to be addressed to enable the successful commercialization of the technology in the automotive and consumer markets.

Emerging Communication Technologies (ECT) Phase 2 Report. Volume 3; Ultra Wideband (UWB) Technology

NASA Technical Reports Server (NTRS)

Bastin, Gary L.; Harris, William G.; Chiodini, Robert; Nelson, Richard A.; Huang, PoTien; Kruhm, David A.

2003-01-01

The Emerging Communication Technology (ECT) project investigated three First Mile communication technologies in support of NASA s Second Generation Reusable Launch Vehicle (2nd Gen RLV), Orbital Space Plane, Advanced Range Technology Working Group (ARTWG) and the Advanced Spaceport Technology Working Group (ASTWG). These First Mile technologies have the purpose of interconnecting mobile users with existing Range Communication infrastructures. ECT was a continuation of the Range Information System Management (RISM) task started in 2002. RISM identified the three advance communication technologies investigated under ECT. These were Wireless Ethernet (Wi-Fi), Free Space Optics (FSO), and Ultra Wideband (UWB). Due to the report s size, it has been broken into three volumes: 1) Main Report 2) Appendices 3) UWB

Development of a Thin Film Solar Cell Interconnect for the Powersphere Concept

NASA Technical Reports Server (NTRS)

Simburger, Edward J.; Matsumoto, James H.; Giants, Thomas W.; Garcia, Alexander, III; Liu, Simon; Rawal, Suraj P.; Perry, Alan R.; Marshall, Craig H.; Lin, John K.; Scarborough, Stephen

2003-01-01

Progressive development of microsatellite technologies has resulted in increased demand for lightweight electrical power subsystems including solar arrays. The use of thin film photovoltaics has been recognized as a key solution to meet the power needs. The lightweight cells can generate sufficient power and still meet critical mass requirements. Commercially available solar cells produced on lightweight substrates are being studied as an option to fulfill the power needs. The commercially available solar cells are relatively inexpensive and have a high payoff potential. Commercially available thin film solar cells are primarily being produced for terrestrial applications. The need to convert the solar cell from a terrestrial to a space compatible application is the primary challenge. Solar cell contacts, grids and interconnects need to be designed to be atomic oxygen resistant and withstand rapid thermal cycling environments. A mechanically robust solar cell interconnect is also required in order to withstand handling during fabrication and survive during launch. The need to produce the solar cell interconnects has been identified as a primary goal of the Powersphere program and is the topic of this paper. Details of the trade study leading to the final design involving the solar cell wrap around contact, flex blanket, welding process, and frame will be presented at the conference.

RapidIO as a multi-purpose interconnect

NASA Astrophysics Data System (ADS)

Baymani, Simaolhoda; Alexopoulos, Konstantinos; Valat, Sébastien

2017-10-01

RapidIO (http://rapidio.org/) technology is a packet-switched high-performance fabric, which has been under active development since 1997. Originally meant to be a front side bus, it developed into a system level interconnect which is today used in all 4G/LTE base stations world wide. RapidIO is often used in embedded systems that require high reliability, low latency and scalability in a heterogeneous environment - features that are highly interesting for several use cases, such as data analytics and data acquisition (DAQ) networks. We will present the results of evaluating RapidIO in a data analytics environment, from setup to benchmark. Specifically, we will share the experience of running ROOT and Hadoop on top of RapidIO. To demonstrate the multi-purpose characteristics of RapidIO, we will also present the results of investigating RapidIO as a technology for high-speed DAQ networks using a generic multi-protocol event-building emulation tool. In addition we will present lessons learned from implementing native ports of CERN applications to RapidIO.

The designing and implementation of PE teaching information resource database based on broadband network

NASA Astrophysics Data System (ADS)

Wang, Jian

2017-01-01

In order to change traditional PE teaching mode and realize the interconnection, interworking and sharing of PE teaching resources, a distance PE teaching platform based on broadband network is designed and PE teaching information resource database is set up. The designing of PE teaching information resource database takes Windows NT 4/2000Server as operating system platform, Microsoft SQL Server 7.0 as RDBMS, and takes NAS technology for data storage and flow technology for video service. The analysis of system designing and implementation shows that the dynamic PE teaching information resource sharing platform based on Web Service can realize loose coupling collaboration, realize dynamic integration and active integration and has good integration, openness and encapsulation. The distance PE teaching platform based on Web Service and the design scheme of PE teaching information resource database can effectively solve and realize the interconnection, interworking and sharing of PE teaching resources and adapt to the informatization development demands of PE teaching.

Insecure Attachment, Maladaptive Personality Traits, and the Perpetration of In-Person and Cyber Psychological Abuse.

PubMed

Bui, Nghi H; Pasalich, Dave S

2018-02-01

Although past findings show that insecure attachment and maladaptive personality traits confer risk for perpetrating intimate partner violence (IPV), little is known about how these factors may underpin psychological abuse (PA) committed in-person and via technology. This study examined whether borderline personality disorder (BPD) traits and psychopathic traits account for indirect effects of insecure attachment on the perpetration of face-to-face and cyber PA. Participants included a community-based sample ( N = 200; M age = 22.28 years) in Australia who completed a battery of online questionnaires. Results from bivariate correlations showed that elevated levels of attachment anxiety and avoidance, and higher scores on BPD traits and psychopathic traits, were significantly associated with the perpetration of both face-to-face and cyber PA. Findings from mediation analysis indicated that attachment anxiety was indirectly linked with the perpetration of both forms of PA via elevated scores on BPD traits and psychopathic traits. High levels of psychopathic traits accounted for the indirect effects of attachment avoidance on both forms of PA. Results support the theory that insecure attachment and maladaptive personality functioning might be involved in the development and/or maintenance of the perpetration of PA. These findings have implications for preventive and treatment programs for the perpetration of IPV in terms of shedding new light on potential risk factors for engagement in face-to-face and technology-based PA.

Three-Dimensional Integrated Circuit (3D IC) Key Technology: Through-Silicon Via (TSV).

PubMed

Shen, Wen-Wei; Chen, Kuan-Neng

2017-12-01

3D integration with through-silicon via (TSV) is a promising candidate to perform system-level integration with smaller package size, higher interconnection density, and better performance. TSV fabrication is the key technology to permit communications between various strata of the 3D integration system. TSV fabrication steps, such as etching, isolation, metallization processes, and related failure modes, as well as other characterizations are discussed in this invited review paper.

Moodle 2.0 Web Services Layer and Its New Application Contexts

NASA Astrophysics Data System (ADS)

Conde, Miguel Ángel; Aguilar, Diego Alonso Gómez; Del Pozo de Dios, Alberto; Peñalvo, Francisco José García

Owing to the intrinsic relation among actual education and new technologies, it results essential the fact to found the new ways to satisfy both sides of the modern eLearning platforms, the needs of students and tutors and the enough technologies to support it. Consequently, the possibility to interconnect the LMS with other external applications to enrich and strengthen the comprehension of learning process is one of the principal paths to follow.

Experimental Durability Testing of 4H SiC JFET Integrated Circuit Technology at 727 C

NASA Technical Reports Server (NTRS)

Spry, David; Neudeck, Phil; Chen, Liangyu; Chang, Carl; Lukco, Dorothy; Beheim, Glenn M

2016-01-01

We have reported SiC integrated circuits (IC's) with two levels of metal interconnect that have demonstrated prolonged operation for thousands of hours at their intended peak ambient operational temperature of 500 C [1, 2]. However, it is recognized that testing of semiconductor microelectronics at temperatures above their designed operating envelope is vital to qualification. Towards this end, we previously reported operation of a 4H-SiC JFET IC ring oscillator on an initial fast thermal ramp test through 727 C [3]. However, this thermal ramp was not ended until a peak temperature of 880 C (well beyond failure) was attained. Further experiments are necessary to better understand failure mechanisms and upper temperature limit of this extreme-temperature capable 4H-SiC IC technology. Here we report on additional experimental testing of custom-packaged 4H-SiC JFET IC devices at temperatures above 500 C. In one test, the temperature was ramped and then held at 727 C, and the devices were periodically measured until electrical failure was observed. A 4H-SiC JFET on this chip electrically functioned with little change for around 25 hours at 727 C before rapid increases in device resistance caused failure. In a second test, devices from our next generation 4H-SiC JFET ICs were ramped up and then held at 700 C (which is below the maximum deposition temperature of the dielectrics). Three ring oscillators functioned for 8 hours at this temperature before degradation. In a third experiment, an alternative die attach of gold paste and package lid was used, and logic circuit operation was demonstrated for 143.5 hours at 700 C.

Experimental Durability Testing of 4H SiC JFET Integrated Circuit Technology at 727 Degrees Centigrade

NASA Technical Reports Server (NTRS)

Spry, David J.; Neudeck, Philip G.; Chen, Liangyu; Chang, Carl W.; Lukco, Dorothy; Beheim, Glenn M.

2016-01-01

We have reported SiC integrated circuits (ICs) with two levels of metal interconnect that have demonstrated prolonged operation for thousands of hours at their intended peak ambient operational temperature of 500 degrees Centigrade. However, it is recognized that testing of semiconductor microelectronics at temperatures above their designed operating envelope is vital to qualification. Towards this end, we previously reported operation of a 4H-SiC JFET IC ring oscillator on an initial fast thermal ramp test through 727 degrees Centigrade. However, this thermal ramp was not ended until a peak temperature of 880 degrees Centigrade (well beyond failure) was attained. Further experiments are necessary to better understand failure mechanisms and upper temperature limit of this extreme-temperature capable 4H-SiC IC technology.Here we report on additional experimental testing of custom-packaged 4H-SiC JFET IC devices at temperatures above 500 degrees Centigrade. In one test, the temperature was ramped and then held at 727 degrees Centigrade, and the devices were periodically measured until electrical failure was observed. A 4H-SiC JFET on this chip electrically functioned with little change for around 25 hours at 727 degrees Centigrade before rapid increases in device resistance caused failure. In a second test, devices from our next generation 4H-SiC JFET ICs were ramped up and then held at 700 degrees Centigrade (which is below the maximum deposition temperature of the dielectrics). Three ring oscillators functioned for 8 hours at this temperature before degradation. In a third experiment, an alternative die attach of gold paste and package lid was used, and logic circuit operation was demonstrated for 143.5 hours at 700 degrees Centigrade.

Interconnected or disconnected? Promotion of mental health and prevention of mental disorder in the digital age

PubMed Central

Hayes, Joseph F; Maughan, Daniel L; Grant-Peterkin, Hugh

2016-01-01

Summary To date there have been few peer-reviewed studies on the feasibility, acceptability and effectiveness of digital technologies for mental health promotion and disorder prevention. Any evaluation of these evolving technologies is complicated by a lack of understanding about the specific risks and possible benefits of the many forms of internet use on mental health. In order to adequately meet the mental health needs of today’s society, psychiatry must engage in rigorous assessment of the impact of digital technologies. PMID:26932479

Capacity Expansion Modeling for Storage Technologies

DOE Office of Scientific and Technical Information (OSTI.GOV)

Hale, Elaine; Stoll, Brady; Mai, Trieu

2017-04-03

The Resource Planning Model (RPM) is a capacity expansion model designed for regional power systems and high levels of renewable generation. Recent extensions capture value-stacking for storage technologies, including batteries and concentrating solar power with storage. After estimating per-unit capacity value and curtailment reduction potential, RPM co-optimizes investment decisions and reduced-form dispatch, accounting for planning reserves; energy value, including arbitrage and curtailment reduction; and three types of operating reserves. Multiple technology cost scenarios are analyzed to determine level of deployment in the Western Interconnection under various conditions.

Interconnected or disconnected? Promotion of mental health and prevention of mental disorder in the digital age.

PubMed

Hayes, Joseph F; Maughan, Daniel L; Grant-Peterkin, Hugh

2016-03-01

To date there have been few peer-reviewed studies on the feasibility, acceptability and effectiveness of digital technologies for mental health promotion and disorder prevention. Any evaluation of these evolving technologies is complicated by a lack of understanding about the specific risks and possible benefits of the many forms of internet use on mental health. To adequately meet the mental health needs of today's society, psychiatry must engage in rigorous assessment of the impact of digital technologies. © The Royal College of Psychiatrists 2016.

Universal test system for system embedded optical interconnect

NASA Astrophysics Data System (ADS)

Pitwon, R.; Wang, K.; Immonen, M.; Schröder, H.; Neitz, M.

2018-02-01

We introduce a universal test and measurement system allowing comparative characterisation of optical transceivers, board-to-board optical connectors and both embedded and passive optical circuit boards. The system comprises a test enclosure with interlocking and interchangeable test cards, allowing different technologies spanning different Technology Readiness Levels to be both characterised alone and in combination with other technologies. They form part of the open test design standards portfolio developed on the FP7 PhoxTroT and H2020 COSMICC projects and allow testing on a common test platform.

Welding interconnects to 50-micron silicon solar cells

NASA Technical Reports Server (NTRS)

Patterson, R. E.; Mesch, H. G.

1983-01-01

A program was conducted to develop technologies for welding interconnects to 50-micron thick, 2 by 2 cm solar cells obtained from three suppliers. The cells were characterized with respect to electrical performance, cell thickness, silver contact thickness, contact waviness, bowing, and fracture strength. Weld schedules were independently developed for each of the three cell types and were coincidentally identical. Thermal shock tests (100 cycles from 100 deg to -180 deg C) were performed on 16-cell coupons for each cell type without any weld joint failures or electrical degradation. Three 48-cell modules (one for each cell type) were assembled with 50-micron thick cells, frosted fused silica covers, silver clad Invar interconnectors, and Kapton substrates.

IEEE 1547 Standards Advancing Grid Modernization

DOE Office of Scientific and Technical Information (OSTI.GOV)

Basso, Thomas; Chakraborty, Sudipta; Hoke, Andy

Technology advances including development of advanced distributed energy resources (DER) and grid-integrated operations and controls functionalities have surpassed the requirements in current standards and codes for DER interconnection with the distribution grid. The full revision of IEEE Standards 1547 (requirements for DER-grid interconnection and interoperability) and 1547.1 (test procedures for conformance to 1547) are establishing requirements and best practices for state-of-the-art DER including variable renewable energy sources. The revised standards will also address challenges associated with interoperability and transmission-level effects, in addition to strictly addressing the distribution grid needs. This paper provides the status and future direction of the ongoingmore » development focus for the 1547 standards.« less

Development of a bone-fixation prosthetic attachment. [with quick-disconnect coupling

NASA Technical Reports Server (NTRS)

Owens, L. J.

1975-01-01

An artificial limb attached directly to the bone by a quick-disconnect coupling was tested in-place at a California medical rehabilitation center. Its design concept and development, made possible by multiple spinoffs of aerospace technology, are discussed.

Protococcidian Eleutheroschizon duboscqi, an Unusual Apicomplexan Interconnecting Gregarines and Cryptosporidia

PubMed Central

Valigurová, Andrea; Paskerova, Gita G.; Diakin, Andrei; Kováčiková, Magdaléna; Simdyanov, Timur G.

2015-01-01

This study focused on the attachment strategy, cell structure and the host-parasite interactions of the protococcidian Eleutheroschizon duboscqi, parasitising the polychaete Scoloplos armiger. The attached trophozoites and gamonts of E. duboscqi were detected at different development stages. The parasite develops epicellularly, covered by a host cell-derived, two-membrane parasitophorous sac forming a caudal tipped appendage. Staining with Evans blue suggests that this tail is protein-rich, supported by the presence of a fibrous substance in this area. Despite the ultrastructural evidence for long filaments in the tail, it stained only weakly for F-actin, while spectrin seemed to accumulate in this area. The attachment apparatus consists of lobes arranged in one (trophozoites) or two (gamonts) circles, crowned by a ring of filamentous fascicles. During trophozoite maturation, the internal space between the parasitophorous sac and parasite turns translucent, the parasite trilaminar pellicle seems to reorganise and is covered by a dense fibrous glycocalyx. The parasite surface is organised in broad folds with grooves in between. Micropores are situated at the bottom of the grooves. A layer of filaments organised in bands, underlying the folds and ending above the attachment fascicles, was detected just beneath the pellicle. Confocal microscopy, along with the application of cytoskeletal drugs (jasplakinolide, cytochalasin D, oryzalin) confirmed the presence of actin and tubulin polymerised forms in both the parasitophorous sac and the parasite, while myosin labelling was restricted to the sac. Despite positive tubulin labelling, no microtubules were detected in mature stages. The attachment strategy of E. duboscqi shares features with that of cryptosporidia and gregarines, i.e. the parasite itself conspicuously resembles an epicellularly located gregarine, while the parasitophorous sac develops in a similar manner to that in cryptosporidia. This study provides a re-evaluation of epicellular development in other apicomplexans and directly compares their niche with that of E. duboscqi. PMID:25915503

Emerging Communication Technologies (ECT) Phase 2 Report. Volume 2; Appendices

NASA Technical Reports Server (NTRS)

Bastin, Gary L.; Harris, William G.; Chiodini, Robert; Nelson, Richard A.; Huang, PoTien; Kruhm, David A.

2003-01-01

The Emerging Communication Technology (ECT) project investigated three First Mile communication technologies in support of NASA s Second Generation Reusable Launch Vehicle (2nd Gen RLV), Orbital Space Plane, Advanced Range Technology Working Group (ARTWG) and the Advanced Spaceport Technology Working Group (ASTWG). These First Mile technologies have the purpose of interconnecting mobile users with existing Range Communication infrastructures. ECT was a continuation of the Range Information System Management (RISM) task started in 2002. RISM identified the three advance communication technologies investigated under ECT. These were Wireless Ethernet (Wi-Fi), Free Space Optics (FSO), and Ultra Wideband (UWB). Due to the report s size, it has been broken into three volumes: 1) Main Report 2) Appendices 3) UWB

Emerging Communication Technologies (ECT) Phase 2 Report. Volume 1; Main Report

NASA Technical Reports Server (NTRS)

Bastin, Gary L.; Harris, William G.; Chiodini, Robert; Nelson, Richard A.; Huang, PoTien; Kruhm, David A.

2003-01-01

The Emerging Communication Technology (ECT) project investigated three First Mile communication technologies in support of NASA s Second Generation Reusable Launch Vehicle (2nd Gen RLV), Orbital Space Plane, Advanced Range Technology Working Group (ARTWG) and the Advanced Spaceport Technology Working Group (ASTWG). These First Mile technologies have the purpose of interconnecting mobile users with existing Range Communication infrastructures. ECT was a continuation of the Range Information System Management (RISM) task started in 2002. RISM identified the three advance communication technologies investigated under ECT. These were Wireless Ethernet (Wi-Fi), Free Space Optics (FSO), and Ultra Wideband (UWB). Due to the report s size, it has been broken into three volumes: 1) Main Report 2) Appendices 3) UWB.

From Seurat to Snapshots: What the Visual Arts Could Contribute to Education.

ERIC Educational Resources Information Center

Duncum, Paul

1996-01-01

Advocates reconceptualizing visual arts as a core subject embodying key elements of experiential learning and critical thinking through an interdisciplinary approach. Illustrates this approach with a discussion of the interconnected issues surrounding family snapshots (social history, aesthetics, technological advancement). Discusses issues of…

Registering Names and Addresses for Information Technology.

ERIC Educational Resources Information Center

Knapp, Arthur A.

The identification of administrative authorities and the development of associated procedures for registering and accessing names and addresses of communications data systems are considered in this paper. It is noted that, for data communications systems using standards based on the Open Systems Interconnection (OSI) Reference Model specified by…

Model for Infusing a Global Perspective into the Curriculum.

ERIC Educational Resources Information Center

Thorne, Bonnie Baker, Comp.; And Others

Global education is an approach to learning that transcends national boundaries and involves the interconnection of cultural, ecological, economic, political and technological systems. This perspective promotes multicultural sensitivity that enables young people to see more clearly their own responsibilities and opportunities in today's world.…

Educating Digital Citizens

ERIC Educational Resources Information Center

Tan, Thomas

2011-01-01

Digital citizenship is how educators, citizens, and parents can teach where the lines of cyber safety and ethics are in the interconnected online world their students will inhabit. Aside from keeping technology users safe, digital citizenship also prepares students to survive and thrive in an environment embedded with information, communication,…

Manufacturing Methods & Technology Project Execution Report. First CY 83.

DTIC Science & Technology

1983-11-01

UCCURRENCE. H 83 5180 MMT FOR METAL DEWAR AND UNBONDED LEADS THE GOLD WIRE BONDED CONNECTIOkS ARE MADE BY HAND WHICH IS A TEDIOUS AND EXPENSIVE PROCESS. THE...ATTACHMENTS CURRENT FILAMENT WOUND COMPOSIIE ROCKET MOTOR CASES REQUIRE FORGED METAL POLE PIECESt NOZZLE CLOSURE ATTACHMENT RINGS, AND OTHER ATTACHMENT RINGS... ELASTOMER INSULATOR PROCESS LARGE TACTICAL ROCKET MOTOR INSULATORS ARE COSTLY, LACK DESIGN CHANGE FLEXIBILITY AND SUFFER LONG LEAD TIMES. CURRENT

Research on Optical Transmitter and Receiver Module Used for High-Speed Interconnection between CPU and Memory

NASA Astrophysics Data System (ADS)

He, Huimin; Liu, Fengman; Li, Baoxia; Xue, Haiyun; Wang, Haidong; Qiu, Delong; Zhou, Yunyan; Cao, Liqiang

2016-11-01

With the development of the multicore processor, the bandwidth and capacity of the memory, rather than the memory area, are the key factors in server performance. At present, however, the new architectures, such as fully buffered DIMM (FBDIMM), hybrid memory cube (HMC), and high bandwidth memory (HBM), cannot be commercially applied in the server. Therefore, a new architecture for the server is proposed. CPU and memory are separated onto different boards, and optical interconnection is used for the communication between them. Each optical module corresponds to each dual inline memory module (DIMM) with 64 channels. Compared to the previous technology, not only can the architecture realize high-capacity and wide-bandwidth memory, it also can reduce power consumption and cost, and be compatible with the existing dynamic random access memory (DRAM). In this article, the proposed module with system-in-package (SiP) integration is demonstrated. In the optical module, the silicon photonic chip is included, which is a promising technology to be applied in the next-generation data exchanging centers. And due to the bandwidth-distance performance of the optical interconnection, SerDes chips are introduced to convert the 64-bit data at 800 Mbps from/to 4-channel data at 12.8 Gbps after/before they are transmitted though optical fiber. All the devices are packaged on cheap organic substrates. To ensure the performance of the whole system, several optimization efforts have been performed on the two modules. High-speed interconnection traces have been designed and simulated with electromagnetic simulation software. Steady-state thermal characteristics of the transceiver module have been evaluated by ANSYS APLD based on finite-element methodology (FEM). Heat sinks are placed at the hotspot area to ensure the reliability of all working chips. Finally, this transceiver system based on silicon photonics is measured, and the eye diagrams of data and clock signals are verified.

Improvement of multiprocessing performance by using optical centralized shared bus

NASA Astrophysics Data System (ADS)

Han, Xuliang; Chen, Ray T.

2004-06-01

With the ever-increasing need to solve larger and more complex problems, multiprocessing is attracting more and more research efforts. One of the challenges facing the multiprocessor designers is to fulfill in an effective manner the communications among the processes running in parallel on multiple multiprocessors. The conventional electrical backplane bus provides narrow bandwidth as restricted by the physical limitations of electrical interconnects. In the electrical domain, in order to operate at high frequency, the backplane topology has been changed from the simple shared bus to the complicated switched medium. However, the switched medium is an indirect network. It cannot support multicast/broadcast as effectively as the shared bus. Besides the additional latency of going through the intermediate switching nodes, signal routing introduces substantial delay and considerable system complexity. Alternatively, optics has been well known for its interconnect capability. Therefore, it has become imperative to investigate how to improve multiprocessing performance by utilizing optical interconnects. From the implementation standpoint, the existing optical technologies still cannot fulfill the intelligent functions that a switch fabric should provide as effectively as their electronic counterparts. Thus, an innovative optical technology that can provide sufficient bandwidth capacity, while at the same time, retaining the essential merits of the shared bus topology, is highly desirable for the multiprocessing performance improvement. In this paper, the optical centralized shared bus is proposed for use in the multiprocessing systems. This novel optical interconnect architecture not only utilizes the beneficial characteristics of optics, but also retains the desirable properties of the shared bus topology. Meanwhile, from the architecture standpoint, it fits well in the centralized shared-memory multiprocessing scheme. Therefore, a smooth migration with substantial multiprocessing performance improvement is expected. To prove the technical feasibility from the architecture standpoint, a conceptual emulation of the centralized shared-memory multiprocessing scheme is demonstrated on a generic PCI subsystem with an optical centralized shared bus.

The Future of Mobile Information and Communication Technology in Austere Environments: A Command and Control Technology Integration Perspective

DTIC Science & Technology

2013-03-01

within the Global information Grid ( GiG ) (AFDD6-0, 2011). JP 1-02 describes the GiG : 10 The GIG is the globally interconnected, end-to-end set of...to warfighters, policy makers, and support personnel. The GIG includes all owned and leased communications and computing systems and services...software (including applications), data, security services, and other 19 associated services necessary to achieve information superiority. The GIG

Technology Description Sheets form the AMC 1990 Technology Expo Held in Aberdeen Proving Ground, Maryland on 1-4 October 1990

DTIC Science & Technology

1990-10-04

emission signals) " Compactness (can be hand-held). The ISOPADS was demonstrated to troop units at the Army Training Command, Grafenwoehr , West...To be controlled, the microwave chips and modules must be interconnected with remotely located components and subsystems. Utilizing metallic cables...forward observer systcm being developed for use in situations too dangerous for soldiers. such as nuclear- contaminated areas or in support of a minefield

Local network assessment

NASA Astrophysics Data System (ADS)

Glen, D. V.

1985-04-01

Local networks, related standards activities of the Institute of Electrical and Electronics Engineers the American National Standards Institute and other elements are presented. These elements include: (1) technology choices such as topology, transmission media, and access protocols; (2) descriptions of standards for the 802 local area networks (LAN's); high speed local networks (HSLN's) and military specification local networks; and (3) intra- and internetworking using bridges and gateways with protocols Interconnection (OSI) reference model. The convergence of LAN/PBX technology is also described.

High density circuit technology, part 2

NASA Technical Reports Server (NTRS)

Wade, T. E.

1982-01-01

A multilevel metal interconnection system for very large scale integration (VLSI) systems utilizing polyimides as the interlayer dielectric material is described. A complete characterization of polyimide materials is given as well as experimental methods accomplished using a double level metal test pattern. A low temperature, double exposure polyimide patterning procedure is also presented.

The Five Central Psychological Challenges Facing Effective Mobile Learning

ERIC Educational Resources Information Center

Terras, Melody M.; Ramsay, Judith

2012-01-01

Web 2.0 technology not only offers the opportunity of massively parallel interconnected networks that support the provision of information and communication anytime and anywhere but also offers immense opportunities for collaboration and sharing of user-generated content. This information-rich environment may support both formal and informal…

Laser Processing for Interconnect Technology

DTIC Science & Technology

1992-02-27

2.1 0.0002 - available in film ethylene- - insoluble propylene (FEP) Perfluoroalkoxy ( PFA ) Teflon AF Amorphous DuPont 1.9 0.0002 - soluble form...t,) where the pulse is sorption coefficient, hv is the photon energy, and f is the a maximum at the surface at time t0. The distance marker fraction

IT and Multimedia in Technical and Vocational Education in Malaysia.

ERIC Educational Resources Information Center

Mustapha, Ramlee B.

Development of information technology (IT) and the Multimedia Super Corridor (MSC) project has placed Malaysia within the global interconnectivity along with other developed nations. Types of IT applications are e-learning, e-mail, discussion group mailing lists, bulletin board systems, chat mode, newsgroups, Internet, tutorial, hypermedia, and…

Cross-Cultural Training in the Community College Curriculum.

ERIC Educational Resources Information Center

Coller, Richard W.; Summers, John Mark

While technological advances have transformed man's social and cultural environment and increased the interconnection between individuals and cultures, they have not in themselves led to a deeper understanding of other cultures. Educational programs can play an important role in remedying this defect and in developing students' sensitivity to…

Computer Electromagnetics and Supercomputer Architecture

NASA Technical Reports Server (NTRS)

Cwik, Tom

1993-01-01

The dramatic increase in performance over the last decade for microporcessor computations is compared with that for the supercomputer computations. This performance, the projected performance, and a number of other issues such as cost and the inherent pysical limitations in curent supercomputer technology have naturally led to parallel supercomputers and ensemble of interconnected microprocessors.

Understanding Integrated STEM Science Instruction through Experiences of Teachers and Students

ERIC Educational Resources Information Center

Gardner, Margery

2017-01-01

Integrated STEM education comprises an exploration of the interconnections between science, technology, engineering and mathematics in order to reflect on how each discipline operates within real world contexts. Students benefit from the integrated STEM approach because it values students' real-life experiences and hands-on applications that…

The American Archival Profession and Information Technology Standards.

ERIC Educational Resources Information Center

Cox, Richard J.

1992-01-01

Discussion of the use of standards by archivists highlights the U.S. MARC AMC (Archives-Manuscript Control) format for reporting archival records and manuscripts; their interest in specific standards being developed for the OSI (Open Systems Interconnection) reference model; and the management of records in electronic formats. (16 references) (LAE)

Developing a National STEM Workforce Strategy: A Workshop Summary

ERIC Educational Resources Information Center

Alper, Joe

2016-01-01

The future competitiveness of the United States in an increasingly interconnected global economy depends on the nation fostering a workforce with strong capabilities and skills in science, technology, engineering, and mathematics (STEM). STEM knowledge and skills enable both individual opportunity and national competitiveness, and the nation needs…

A Mediated Discourse Analysis (MDA) Approach to Multimodal Data

ERIC Educational Resources Information Center

Dooly, Melinda

2017-01-01

Just as research in language learning is moving beyond the four walls of the classroom, there is a growing awareness that language use (and simultaneous learning) takes place in increasingly complex and interconnected ways, in particular through the use of technology. This chapter summarizes an investigation into multimodal communicative…

Teaching and Learning in the Global Village: Connect, Create, Collaborate, and Communicate

ERIC Educational Resources Information Center

Dwyer, Bernadette

2016-01-01

The world is increasingly interconnected through technology. In order to live and work in a global village our students need to develop global literacy. Global literacy incorporates a range of overlapping concepts including an advocacy dimension, global citizenship responsibility, and cultural and linguistic awareness. Further, global literacy…

The Teaching Revolution: RTI, Technology, and Differentiation Transform Teaching for the 21st Century

ERIC Educational Resources Information Center

Bender, William N.; Waller, Laura

2011-01-01

"The Teaching Revolution" challenges educators to imagine schools the way they should be, with a "big picture" vision that includes student-driven curricula, interconnectivity, and targeted responsiveness to students' individual needs. The authors provide a futuristic and provocative discussion on combining three major instructional…

Factors Influencing Adoption of Ubiquitous Internet amongst Students

ERIC Educational Resources Information Center

Juned, Mohammad; Adil, Mohd

2015-01-01

Weiser's (1991) conceptualisation of a world wherein human's interaction with computer technology would no longer be limited to conventional input and output devices, has now been translated into a reality with human's constant interaction with multiple interconnected computers and sensors embedded in rooms, furniture, clothes, tools, and other…

RAID-2: Design and implementation of a large scale disk array controller

NASA Technical Reports Server (NTRS)

Katz, R. H.; Chen, P. M.; Drapeau, A. L.; Lee, E. K.; Lutz, K.; Miller, E. L.; Seshan, S.; Patterson, D. A.

1992-01-01

We describe the implementation of a large scale disk array controller and subsystem incorporating over 100 high performance 3.5 inch disk drives. It is designed to provide 40 MB/s sustained performance and 40 GB capacity in three 19 inch racks. The array controller forms an integral part of a file server that attaches to a Gb/s local area network. The controller implements a high bandwidth interconnect between an interleaved memory, an XOR calculation engine, the network interface (HIPPI), and the disk interfaces (SCSI). The system is now functionally operational, and we are tuning its performance. We review the design decisions, history, and lessons learned from this three year university implementation effort to construct a truly large scale system assembly.

Module level solutions to solar cell polarization

DOEpatents

Xavier, Grace , Li; Bo, [San Jose, CA

2012-05-29

A solar cell module includes interconnected solar cells, a transparent cover over the front sides of the solar cells, and a backsheet on the backsides of the solar cells. The solar cell module includes an electrical insulator between the transparent cover and the front sides of the solar cells. An encapsulant protectively packages the solar cells. To prevent polarization, the insulator has resistance suitable to prevent charge from leaking from the front sides of the solar cells to other portions of the solar cell module by way of the transparent cover. The insulator may be attached (e.g., by coating) directly on an underside of the transparent cover or be a separate layer formed between layers of the encapsulant. The solar cells may be back junction solar cells.

Expert networks in CLIPS

NASA Technical Reports Server (NTRS)

Hruska, S. I.; Dalke, A.; Ferguson, J. J.; Lacher, R. C.

1991-01-01

Rule-based expert systems may be structurally and functionally mapped onto a special class of neural networks called expert networks. This mapping lends itself to adaptation of connectionist learning strategies for the expert networks. A parsing algorithm to translate C Language Integrated Production System (CLIPS) rules into a network of interconnected assertion and operation nodes has been developed. The translation of CLIPS rules to an expert network and back again is illustrated. Measures of uncertainty similar to those rules in MYCIN-like systems are introduced into the CLIPS system and techniques for combining and hiring nodes in the network based on rule-firing with these certainty factors in the expert system are presented. Several learning algorithms are under study which automate the process of attaching certainty factors to rules.

Duct closure

DOEpatents

Vowell, Kennison L.

1987-01-01

A closure for an inclined duct having an open upper end and defining downwardly extending passageway. The closure includes a cap for sealing engagement with the open upper end of the duct. Associated with the cap are an array of vertically aligned plug members, each of which has a cross-sectional area substantially conforming to the cross-sectional area of the passageway at least adjacent the upper end of the passageway. The plug members are interconnected in a manner to provide for free movement only in the plane in which the duct is inclined. The uppermost plug member is attached to the cap means and the cap means is in turn connected to a hoist means which is located directly over the open end of the duct.

Photonics and other approaches to high speed communications

NASA Technical Reports Server (NTRS)

Maly, Kurt

1992-01-01

Our research group of 4 faculty and about 10-15 graduate students was actively involved (as a group) in the development of computer communication networks for the last five years. Many of its individuals have been involved in related research for a much longer period. The overall research goal is to extend network performance to higher data rates, to improve protocol performance at most ISO layers and to improve network operational performance. We briefly state our research goals, then discuss the research accomplishments and direct your attention to attached and/or published papers which cover the following topics: scalable parallel communications; high performance interconnection between high data rate networks; and a simple, effective media access protocol system for integrated, high data rate networks.

Rapid Airfield Damage Recovery: Deployable Saw Technology Evaluation

DTIC Science & Technology

2017-12-29

tested are not lighter, leaner, or faster than the SW345B and SW360B wheel saw attachments. The results also showed that a diamond- blade saw attachment...when compared to a walk-behind diamond- blade saw currently utilized for ADR, is more ideal for concrete crater repairs...16 3.1.3 Cuts, Inc. SS3600, SS3600HF, and SS4800HF diamond blade saw attachments ... 18 3.2 Cutting tools

Facilitating Factors and Barriers to the Use of Emerging Technologies for Suicide Prevention in Europe: Multicountry Exploratory Study

PubMed Central

Delgado, Carmen; Sánchez-Prada, Andrés; Parra-Vidales, Esther; de Leo, Diego; Franco-Martín, Manuel

2018-01-01

Background This study provides an analysis on the use of emerging technologies for the prevention of suicide in 8 different European countries. Objective The objective of this study was to analyze the potentiality of using emerging technologies in the area of suicide prevention based on the opinion of different professionals involved in suicide prevention. Methods Opinions of 3 groups of stakeholders (ie, relevant professionals in suicide field) were gathered using a specifically designed questionnaire to explore dimensions underlying perceptions of facilitating factors and barriers in relation to the use of emerging technologies for suicide prevention. Results Goal 1 involved facilitating factors for the use of emerging technologies in suicide prevention. Northern European countries, except for Belgium, attach greater relevance to those that optimize implementation and benefits. On the other hand, Southern European countries attach greater importance to professionally oriented and user-centered facilitating factors. According to different stakeholders, the analysis of these facilitating factors suggest that professionals in the field of social work attach greater relevance to those that optimize implementation and benefits. However, professionals involved in the area of mental health, policy makers, and political decision makers give greater importance to professionally oriented and user-centered facilitating factors. Goal 2 was related to barriers to the usability of emerging technologies for suicide prevention. Both countries and stakeholders attach greater importance to barriers associated with resource constraints than to those centered on personal limitations. There are no differences between countries or between stakeholders. Nevertheless, there is a certain stakeholders-countries interaction that indicates that the opinions on resource constraints expressed by different stakeholders do not follow a uniform pattern in different countries, but they differ depending on the country. Conclusions Although all countries and stakeholders agree in identifying resource constraints as the main barrier to the use of emerging technologies, factors facilitating their use in suicide prevention differ among countries and among stakeholders. PMID:29367183

On- and off-grid operation of hybrid renewable power plants: When are the economics favorable?

NASA Astrophysics Data System (ADS)

Petrakopoulou, F.; Santana, D.

2016-12-01

Hybrid renewable energy conversion systems offer a good alternative to conventional systems in locations where the extension of the electrical grid is difficult or not economical or where the cost of electricity is high. However, stand-alone operation implies net energy output restrictions (limited to exclusively serve the energy demand of a region), capacity oversizing and large storage facilities. In interconnected areas, on the other hand, the operational restrictions of the power stations change significantly and the efficiencies and costs of renewable technologies become more favorable. In this paper, the operation of three main renewable technologies (CSP, PV and wind) is studied assuming both hybrid and individual operation for both autonomous and inter-connected operation. The case study used is a Mediterranean island of ca. 3,000 inhabitants. Each system is optimized to fully cover the energy demand of the community. In addition, in the on-grid operation cases, it is required that the annual energy generated from the renewable sources is net positive (i.e., the island generates at least as much energy as it uses). It is found that when connected to the grid, hybridization of more than one technology is not required to satisfy the energy demand, as expected. Each of the renewable technologies investigated can satisfy the annual energy demand individually, without significant complications. In addition, the cost of electricity generated with the three studied technologies drops significantly for on-grid applications, when compared to off-grid operation. However, when compared to business-as-usual scenarios in both the on- and off-grid cases, both investigated hybrid and single-technology renewable scenarios are found to be economically viable. A sensitivity analysis reveals the limits of the acceptable costs that make the technologies favorable when compared to conventional alternatives.

Monolithically interconnected silicon-film™ module technology

NASA Astrophysics Data System (ADS)

DelleDonne, E. J.; Ford, D. H.; Hall, R. B.; Ingram, A. E.; Rand, J. A.; Barnett, A. M.

1999-03-01

AstroPower is developing an advanced thin-silicon-based, photovoltaic module product. A low-cost monolithic interconnected device is being integrated into a module that combines the design and process features of advanced light trapped, thin-silicon solar cells. This advanced product incorporates a low-cost substrate, a nominally 50-μm thick grown silicon layer with minority carrier diffusion lengths exceeding the active layer thickness, light trapping due to back-surface reflection, and back-surface passivation. The thin silicon layer enables high solar cell performance and can lead to a module conversion efficiency as high as 19%. These performance design features, combined with low-cost manufacturing using relatively low-cost capital equipment, continuous processing and a low-cost substrate, will lead to high-performance, low-cost photovoltaic panels.

Design process of a photonics network for military platforms

NASA Astrophysics Data System (ADS)

Nelson, George F.; Rao, Nagarajan M.; Krawczak, John A.; Stevens, Rick C.

1999-02-01

Technology development in photonics is rapidly progressing. The concept of a Unified Network will provide re- configurable network access to platform sensors, Vehicle Management Systems, Stores and avionics. The re-configurable taps into the network will accommodate present interface standards and provide scaleability for the insertion of future interfaces. Significant to this development is the design and test of the Optical Backplane Interconnect System funded by Naval Air Systems Command and developed by Lockheed Martin Tactical Defense Systems - Eagan. OBIS results in the merging of the electrical backplane and the optical backplane, with interconnect fabric and card edge connectors finally providing adequate electrical and optical card access. Presently OBIS will support 1.2 Gb/s per fiber over multiples of 12 fibers per ribbon cable.

Systems Integration Fact Sheet

DOE Office of Scientific and Technical Information (OSTI.GOV)

None

2016-06-01

This fact sheet is an overview of the Systems Integration subprogram at the U.S. Department of Energy SunShot Initiative. The Systems Integration subprogram enables the widespread deployment of safe, reliable, and cost-effective solar energy technologies by addressing the associated technical and non-technical challenges. These include timely and cost-effective interconnection procedures, optimal system planning, accurate prediction of solar resources, monitoring and control of solar power, maintaining grid reliability and stability, and many more. To address the challenges associated with interconnecting and integrating hundreds of gigawatts of solar power onto the electricity grid, the Systems Integration program funds research, development, and demonstrationmore » projects in four broad, interrelated focus areas: grid performance and reliability, dispatchability, power electronics, and communications.« less

Network integration of distributed power generation

NASA Astrophysics Data System (ADS)

Dondi, Peter; Bayoumi, Deia; Haederli, Christoph; Julian, Danny; Suter, Marco

The world-wide move to deregulation of the electricity and other energy markets, concerns about the environment, and advances in renewable and high efficiency technologies has led to major emphasis being placed on the use of small power generation units in a variety of forms. The paper reviews the position of distributed generation (DG, as these small units are called in comparison with central power plants) with respect to the installation and interconnection of such units with the classical grid infrastructure. In particular, the status of technical standards both in Europe and USA, possible ways to improve the interconnection situation, and also the need for decisions that provide a satisfactory position for the network operator (who remains responsible for the grid, its operation, maintenance and investment plans) are addressed.

Fabrication of Low Temperature Carbon Nanotube Vertical Interconnects Compatible with Semiconductor Technology

PubMed Central

Vollebregt, Sten; Ishihara, Ryoichi

2015-01-01

We demonstrate a method for the low temperature growth (350 °C) of vertically-aligned carbon nanotubes (CNT) bundles on electrically conductive thin-films. Due to the low growth temperature, the process allows integration with modern low-κ dielectrics and some flexible substrates. The process is compatible with standard semiconductor fabrication, and a method for the fabrication of electrical 4-point probe test structures for vertical interconnect test structures is presented. Using scanning electron microscopy the morphology of the CNT bundles is investigated, which demonstrates vertical alignment of the CNT and can be used to tune the CNT growth time. With Raman spectroscopy the crystallinity of the CNT is investigated. It was found that the CNT have many defects, due to the low growth temperature. The electrical current-voltage measurements of the test vertical interconnects displays a linear response, indicating good ohmic contact was achieved between the CNT bundle and the top and bottom metal electrodes. The obtained resistivities of the CNT bundle are among the average values in the literature, while a record-low CNT growth temperature was used. PMID:26709530

Formation of highly preferred orientation of β-Sn grains in solidified Cu/SnAgCu/Cu micro interconnects under temperature gradient effect

NASA Astrophysics Data System (ADS)

Zhao, N.; Zhong, Y.; Dong, W.; Huang, M. L.; Ma, H. T.; Wong, C. P.

2017-02-01

β-Sn grain orientation and configuration are becoming crucial factors to dominate the lifetime of solder interconnects in three-dimensional integrated circuit packaging. In this paper, we found that a temperature gradient during solidification significantly dominated the orientation and configuration of the final β-Sn grains in Cu/SnAgCu/Cu micro interconnects. Being different from the random orientations and growth fronts meeting or cyclic twin boundary forming near the center after homogeneous temperature bonding, the β-Sn grains solidified under a certain temperature gradient were observed to follow a highly preferred orientation with their c-axis departing from the direction of temperature gradient by about 45°-88°. Meanwhile, these preferred oriented β-Sn grains consisted of low angle grain boundary structures with misorientation in the range of 0°-15°. The mechanism was explained in terms of the anisotropy and directional growth of β-Sn grains. The results pave the way for grain orientation control in 3D packaging technology.

Utilization of Pb-free solders in MEMS packaging

NASA Astrophysics Data System (ADS)

Selvaduray, Guna S.

2003-01-01

Soldering of components within a package plays an important role in providing electrical interconnection, mechanical integrity and thermal dissipation. MEMS packages present challenges that are more complex than microelectronic packages because they are far more sensitive to shock and vibration and also require precision alignment. Soldering is used at two major levels within a MEMS package: at the die attach level and at the component attach level. Emerging environmental regulations worldwide, notably in Europe and Japan, have targeted the elimination of Pb usage in electronic assemblies, due to the inherent toxicity of Pb. This has provided the driving force for development and deployment of Pb-free solder alloys. A relatively large number of Pb-free solder alloys have been proposed by various researchers and companies. Some of these alloys have also been patented. After several years of research, the solder alloy system that has emerged is based on Sn as a major component. The electronics industry has identified different compositions for different specific uses, such as wave soldering, surface mount reflow, etc. The factors that affect choice of an appropriate Pb-free solder can be divided into two major categories, those related to manufacturing, and those related to long term reliability and performance.

A Dual Role of Graphene Oxide Sheet Deposition on Titanate Nanowire Scaffolds for Osteo-implantation: Mechanical Hardener and Surface Activity Regulator

NASA Astrophysics Data System (ADS)

Dong, Wenjun; Hou, Lijuan; Li, Tingting; Gong, Ziqiang; Huang, Huandi; Wang, Ge; Chen, Xiaobo; Li, Xiaoyun

2015-12-01

Scaffold biomaterials with open pores and channels are favourable for cell growth and tissue regeneration, however the inherent poor mechanical strength and low surface activity limit their applications as load-bearing bone grafts with satisfactory osseointegration. In this study, macro-porous graphene oxide (GO) modified titanate nanowire scaffolds with desirable surface chemistry and tunable mechanical properties were prepared through a simple hydrothermal process followed by electrochemical deposition of GO nanosheets. The interconnected and porous structure of the GO/titanate nanowire scaffolds provides a large surface area for cellular attachment and migration and displays a high compressive strength of approximately 81.1 MPa and a tunable Young’s modulus over the range of 12.4-41.0 GPa, which satisfies site-specific requirements for implantation. Surface chemistry of the scaffolds was modulated by the introduction of GO, which endows the scaffolds flexibility in attaching and patterning bioactive groups (such as -OH, -COOH and -NH2). In vitro cell culture tests suggest that the GO/titanate nanowire scaffolds act as a promising biomaterial candidate, in particular the one terminated with -OH groups, which demonstrates improved cell viability, and proliferation, differentiation and osteogenic activities.

Liquid cooled, linear focus solar cell receiver

DOEpatents

Kirpich, A.S.

1983-12-08

Separate structures for electrical insulation and thermal conduction are established within a liquid cooled, linear focus solar cell receiver for use with parabolic or Fresnel optical concentrators. The receiver includes a V-shaped aluminum extrusion having a pair of outer faces each formed with a channel receiving a string of solar cells in thermal contact with the extrusion. Each cell string is attached to a continuous glass cover secured within the channel with spring clips to isolate the string from the external environment. Repair or replacement of solar cells is effected simply by detaching the spring clips to remove the cover/cell assembly without interrupting circulation of coolant fluid through the receiver. The lower surface of the channel in thermal contact with the cells of the string is anodized to establish a suitable standoff voltage capability between the cells and the extrusion. Primary electrical insulation is provided by a dielectric tape disposed between the coolant tube and extrusion. Adjacent solar cells are soldered to interconnect members designed to accommodate thermal expansion and mismatches. The coolant tube is clamped into the extrusion channel with a releasably attachable clamping strip to facilitate easy removal of the receiver from the coolant circuit.

Liquid cooled, linear focus solar cell receiver

DOEpatents

Kirpich, Aaron S.

1985-01-01

Separate structures for electrical insulation and thermal conduction are established within a liquid cooled, linear focus solar cell receiver for use with parabolic or Fresnel optical concentrators. The receiver includes a V-shaped aluminum extrusion having a pair of outer faces each formed with a channel receiving a string of solar cells in thermal contact with the extrusion. Each cell string is attached to a continuous glass cover secured within the channel with spring clips to isolate the string from the external environment. Repair or replacement of solar cells is effected simply by detaching the spring clips to remove the cover/cell assembly without interrupting circulation of coolant fluid through the receiver. The lower surface of the channel in thermal contact with the cells of the string is anodized to establish a suitable standoff voltage capability between the cells and the extrusion. Primary electrical insulation is provided by a dielectric tape disposed between the coolant tube and extrusion. Adjacent solar cells are soldered to interconnect members designed to accommodate thermal expansion and mismatches. The coolant tube is clamped into the extrusion channel with a releasably attachable clamping strip to facilitate easy removal of the receiver from the coolant circuit.

A Dual Role of Graphene Oxide Sheet Deposition on Titanate Nanowire Scaffolds for Osteo-implantation: Mechanical Hardener and Surface Activity Regulator.

PubMed

Dong, Wenjun; Hou, Lijuan; Li, Tingting; Gong, Ziqiang; Huang, Huandi; Wang, Ge; Chen, Xiaobo; Li, Xiaoyun

2015-12-21

Scaffold biomaterials with open pores and channels are favourable for cell growth and tissue regeneration, however the inherent poor mechanical strength and low surface activity limit their applications as load-bearing bone grafts with satisfactory osseointegration. In this study, macro-porous graphene oxide (GO) modified titanate nanowire scaffolds with desirable surface chemistry and tunable mechanical properties were prepared through a simple hydrothermal process followed by electrochemical deposition of GO nanosheets. The interconnected and porous structure of the GO/titanate nanowire scaffolds provides a large surface area for cellular attachment and migration and displays a high compressive strength of approximately 81.1 MPa and a tunable Young's modulus over the range of 12.4-41.0 GPa, which satisfies site-specific requirements for implantation. Surface chemistry of the scaffolds was modulated by the introduction of GO, which endows the scaffolds flexibility in attaching and patterning bioactive groups (such as -OH, -COOH and -NH2). In vitro cell culture tests suggest that the GO/titanate nanowire scaffolds act as a promising biomaterial candidate, in particular the one terminated with -OH groups, which demonstrates improved cell viability, and proliferation, differentiation and osteogenic activities.

CTS digital video college curriculum-sharing experiment. [Communications Technology Satellite

NASA Technical Reports Server (NTRS)

Lumb, D. R.; Sites, M. J.

1974-01-01

NASA-Ames Research Center, Stanford University, and Carleton University, Ottawa, Canada, are participating in a joint experiment to evaluate the feasibility and effectiveness of college curriculum sharing using compressed digital television and the Communications Technology Satellite (CTS). Each university will offer televised courses to the other during the 1976-1977 academic year via CTS, a joint program by NASA and the Canadian Department of Communications. The video compression techniques to be demonstrated will enable economical interconnection of educational institutions using existing and planned domestic satellites.

Design definition study of a lift/cruise fan technology V/STOL airplane: Summary

NASA Technical Reports Server (NTRS)

Zabinsky, J. M.; Higgins, H. C.

1975-01-01

A two-engine three-fan V/STOL airplane was designed to fulfill naval operational requirements. A multimission airplane was developed from study of specific point designs. Based on the multimission concept, airplanes were designed to demonstrate and develop the technology and operational procedures for this class of aircraft. Use of interconnected variable pitch fans led to a good balance between high thrust with responsive control and efficient thrust at cruise speeds. The airplanes and their characteristics are presented.

Liquid Rocket Lines, Bellows, Flexible Hoses, and Filters

NASA Technical Reports Server (NTRS)

1977-01-01

Fluid-flow components in a liquid propellant rocket engine and the rocket vehicle which it propels are interconnected by lines, bellows, and flexible hoses. Elements involved in the successful design of these components are identified and current technologies pertaining to these elements are reviewed, assessed, and summarized to provide a technology base for a checklist of rules to be followed by project managers in guiding a design or assessing its adequacy. Recommended procedures for satisfying each of the design criteria are included.

Classification of Patient Care Complexity: Cloud Technology.

PubMed

de Oliveira Riboldi, Caren; Macedo, Andrea Barcellos Teixeira; Mergen, Thiane; Dias, Vera Lúcia Mendes; da Costa, Diovane Ghignatti; Malvezzi, Maria Luiza Falsarella; Magalhães, Ana Maria Muller; Silveira, Denise Tolfo

2016-01-01

Presentation of the computerized structure to implement, in a university hospital in the South of Brazil, the Patients Classification System of Perroca, which categorizes patients according to the care complexity. This solution also aims to corroborate a recent study at the hospital, which evidenced that the increasing workload presents a direct relation with the institutional quality indicators. The tools used were the Google applications with high productivity interconnecting the topic knowledge on behalf of the nursing professionals and information technology professionals.

National Assessment of Energy Storage for Grid Balancing and Arbitrage: Phase 1, WECC

DOE Office of Scientific and Technical Information (OSTI.GOV)

Kintner-Meyer, Michael CW; Balducci, Patrick J.; Colella, Whitney G.

2012-06-01

To examine the role that energy storage could play in mitigating the impacts of the stochastic variability of wind generation on regional grid operation, the Pacific Northwest National Laboratory (PNNL) examined a hypothetical 2020 grid scenario in which additional wind generation capacity is built to meet renewable portfolio standard targets in the Western Interconnection. PNNL developed a stochastic model for estimating the balancing requirements using historical wind statistics and forecasting error, a detailed engineering model to analyze the dispatch of energy storage and fast-ramping generation devices for estimating size requirements of energy storage and generation systems for meeting new balancingmore » requirements, and financial models for estimating the life-cycle cost of storage and generation systems in addressing the future balancing requirements for sub-regions in the Western Interconnection. Evaluated technologies include combustion turbines, sodium sulfur (Na-S) batteries, lithium ion batteries, pumped-hydro energy storage, compressed air energy storage, flywheels, redox flow batteries, and demand response. Distinct power and energy capacity requirements were estimated for each technology option, and battery size was optimized to minimize costs. Modeling results indicate that in a future power grid with high-penetration of renewables, the most cost competitive technologies for meeting balancing requirements include Na-S batteries and flywheels.« less

VCSEL-based optical transceiver module for high-speed short-reach interconnect

NASA Astrophysics Data System (ADS)

Yagisawa, Takatoshi; Oku, Hideki; Mori, Tatsuhiro; Tsudome, Rie; Tanaka, Kazuhiro; Daikuhara, Osamu; Komiyama, Takeshi; Ide, Satoshi

2017-02-01

Interconnects have been more important in high-performance computing systems and high-end servers beside its improvements in computing capability. Recently, active optical cables (AOCs) have started being used for this purpose instead of conventionally used copper cables. The AOC enables to extend the transmission distance of the high-speed signals dramatically by its broadband characteristics, however, it tend to increase the cost. In this paper, we report our developed quad small form-factor pluggable (QSFP) AOC utilizing cost-effective optical-module technologies. These are a unique structure using generally used flexible printed circuit (FPC) in combination with an optical waveguide that enables low-cost high-precision assembly with passive alignment, a lens-integrated ferrule that improves productivity by eliminating a polishing process for physical contact of standard PMT connector for the optical waveguide, and an overdrive technology that enables 100 Gb/s (25 Gb/s × 4-channel) operation with low-cost 14 Gb/s vertical-cavity surfaceemitting laser (VCSEL) array. The QSFP AOC demonstrated clear eye opening and error-free operation at 100 Gb/s with high yield rate even though the 14 Gb/s VCSEL was used thanks to the low-coupling loss resulting from the highprecision alignment of optical devices and the over-drive technology.

Managing Nigerian Secondary School Reforms to Enhance Equity and Globalization

ERIC Educational Resources Information Center

Peretomode, V. F.; Ikoya, P. O.

2010-01-01

The world is in a state of flux occasioned by profound natural forces, social, economic, and political changes and rapid scientific and technological advancement. The nations of the world, of which Nigeria is a part, are also becoming more interconnected and interdependent. To avoid possible "future shock" nations must respond quickly,…

Hybrid PV HgCdTe Detectors: Technology Reliability and Failure Physics Program

DTIC Science & Technology

1988-01-01

interconnect reliability. 3-1 8912-16 SECTION 4 ACKNOWLEDGEMENTS The authors would like to thank Dr. Marion Reine, Dr. Andrei Szilagyi , Nancy Hartle... Szilagyi , Mat. Res. Soc. Syrnp. Proc. 69, 257, (1986) 9. Private communications with Andrei Szilagy. 10. R.J. Briggs, J.W. Marciniec, P.H. Zimmermann and

Status of High Power Technology for Educational Satellites.

ERIC Educational Resources Information Center

Kuhns, Perry W.

The increasing desire to answer the educational needs of all segments of the population will necessitate a broader based communications system such as one based on satellites. The new system will require additional terminals, more interconnections, and more frequencies than are presently in use. To accomplish these goals, we need to use higher…

Integrated Collaborative E-Learning for the Global Management Education in the 21st Century

ERIC Educational Resources Information Center

Son, Barbara W. K.

2017-01-01

Rapidly growing information and communications technology and a more interconnected global world offer benefits and challenges to global business organizations. While exploring benefits from global workforce and global production, they must successfully adapt to their local market conditions and manage their multicultural resources. How can we…

Ethical and Privacy Principles for Learning Analytics

ERIC Educational Resources Information Center

Pardo, Abelardo; Siemens, George

2014-01-01

The massive adoption of technology in learning processes comes with an equally large capacity to track learners. Learning analytics aims at using the collected information to understand and improve the quality of a learning experience. The privacy and ethical issues that emerge in this context are tightly interconnected with other aspects such as…

An Example-Centric Tool for Context-Driven Design of Biomedical Devices

ERIC Educational Resources Information Center

Dzombak, Rachel; Mehta, Khanjan; Butler, Peter

2015-01-01

Engineering is one of the most global professions, with design teams developing technologies for an increasingly interconnected and borderless world. In order for engineering students to be proficient in creating viable solutions to the challenges faced by diverse populations, they must receive an expe­riential education in rigorous engineering…

Education on the Electronic Frontier: Teleapprentices in Globally Distributed Educational Contexts. Interactive Technology Laboratory Report #14.

ERIC Educational Resources Information Center

Levin, James A.; And Others

1987-01-01

The instructional media created by microcomputers interconnected by modems to form long-distance networks present some powerful new opportunities for education. While other uses of computers in education have been built on conventional instructional models of classroom interaction, instructional electronic networks facilitate a wider use of…

Digital Practices and Literacy Identities: Preservice Teachers Negotiating Contradictory Discourses of Innovation

ERIC Educational Resources Information Center

Ortega, Leticia

2013-01-01

This paper presents the results of a research study on preservice English teachers' understandings of the interconnection of literacy and technology in relation to their teaching practices. The study was conducted in an English education program among preservice teachers enrolled in a year-long internship. The data analyzed consisted of interview…

NASA Blue Team: Determining Operational Security Posture of Critical Systems and Networks

NASA Technical Reports Server (NTRS)

Alley, Adam David

2016-01-01

Emergence of Cybersecurity has increased the focus on security risks to Information Technology (IT) assets going beyond traditional Information Assurance (IA) concerns: More sophisticated threats have emerged from increasing sources as advanced hacker tools and techniques have emerged and proliferated to broaden the attack surface available across globally interconnected networks.

Globalization and Education: Exploring Pedagogical and Curricular Issues and Implications. Introductory Essay.

ERIC Educational Resources Information Center

Smits, Hans

2000-01-01

A continuation of colonialism, globalization's narrow focus on economics and free-market thinking reinforces modernist rationality and individualism and discounts how deeply all life is interconnected. Its effects on education are reflected in high stakes testing, emphasis on information technologies, and a discounting of non-Western cultures.…

Attention, and Other 21st-Century Social Media Literacies

ERIC Educational Resources Information Center

Rheingold, Howard

2010-01-01

If educators want to discover how they can engage students as well as themselves in the 21st century, they must move beyond skills and technologies. They must explore the interconnected social media literacies of (1) attention; (2) participation; (3) cooperation; (4) network awareness; and (5) critical consumption. In this article, the author…

Breaking Stereotypes: Constructing Geographic Literacy and Cultural Awareness through Technology

ERIC Educational Resources Information Center

Carano, Kenneth T.; Berson, Michael J.

2007-01-01

Youths in the United States are less geographically and culturally literate than are youths in many other industrialized countries. In an time in which the world is becoming increasingly interconnected, it is pertinent that American youths study geography, evaluate stereotypes, and understand how individuals are perceived by others. The authors…

Silicon Carbide Integrated Circuit Chip

NASA Image and Video Library

2015-02-17

A multilevel interconnect silicon carbide integrated circuit chip with co-fired ceramic package and circuit board recently developed at the NASA GRC Smart Sensors and Electronics Systems Branch for high temperature applications. High temperature silicon carbide electronics and compatible packaging technologies are elements of instrumentation for aerospace engine control and long term inner-solar planet explorations.

Application-driven strategies for efficient transfer of medical images over very high speed networks

NASA Astrophysics Data System (ADS)

Alsafadi, Yasser H.; McNeill, Kevin M.; Martinez, Ralph

1993-09-01

The American College of Radiology (ACR) and the National Electrical Manufacturing Association (NEMA) in 1982 formed the ACR-NEMA committee to develop a standard to enable equipment from different vendors to communicate and participate in a picture archiving and communications system (PACS). The standard focused mostly on interconnectivity issues and communication needs of PACS. It was patterned after the international standards organization open systems interconnection (ISO/OSI) reference model. Three versions of the standard appeared, evolving from simple point-to-point specification of connection between two medical devices to a complex standard of a network environment. However, fast changes in network software and hardware technologies makes it difficult for the standard to keep pace. This paper compares two versions of the ACR-NEMA standard and then describes a system that is used at the University of Arizona Intensive Care Unit. In this system, the application should specify the interface to network services and grade of service required. These provisions are suggested to make the application independent from evolving network technology and support true open systems.

Deep Proton Writing for the rapid prototyping of polymer micro-components for optical interconnects and optofluidics

NASA Astrophysics Data System (ADS)

Van Erps, Jürgen; Vervaeke, Michael; Ottevaere, Heidi; Hermanne, Alex; Thienpont, Hugo

2013-07-01

The use of photonics in data communication and numerous other industrial applications brought plenty of prospects for innovation and opened up different unexplored market opportunities. This is a major driving force for the fabrication of micro-optical and micro-mechanical structures and their accurate alignment and integration into opto-mechanical modules and systems. To this end, we present Deep Proton Writing (DPW) as a powerful rapid prototyping technology for such micro-components. The DPW process consists of bombarding polymer samples (PMMA or SU-8) with swift protons, which results after chemical processing steps in high-quality micro-optical components. One of the strengths of the DPW micro-fabrication technology is the ability to fabricate monolithic building blocks that include micro-optical and mechanical functionalities which can be precisely integrated into more complex photonic systems. In this paper we comment on how we shifted from using 8.3 to 16.5 MeV protons for DPW and give some examples of micro-optical and micro-mechanical components recently fabricated through DPW, targeting applications in optical interconnections and in optofluidics.

Thin glass based packaging and photonic single-mode waveguide integration by ion-exchange technology on board and module level

NASA Astrophysics Data System (ADS)

Brusberg, Lars; Lang, Günter; Schröder, Henning

2011-01-01

The proposed novel packaging approach merges micro-system packaging and glass integrated optics. It provides 3D optical single-mode intra system links to bridge the gap between novel photonic integrated circuits and the glass fibers for inter system interconnects. We introduce our hybrid 3D photonic packaging approach based on thin glass substrates with planar integrated optical single-mode waveguides for fiber-to-chip and chip-to-chip links. Optical mirrors and lenses provide optical mode matching for photonic IC assemblies and optical fiber interconnects. Thin glass is commercially available in panel and wafer formats and characterizes excellent optical and high-frequency properties as reviewed in the paper. That makes it perfect for micro-system packaging. The adopted planar waveguide process based on ion-exchange technology is capable for high-volume manufacturing. This ion-exchange process and the optical propagation are described in detail for thin glass substrates. An extensive characterization of all basic circuit elements like straight and curved waveguides, couplers and crosses proves the low attenuation of the optical circuit elements.

Biography of a technology: North America's power grid through the twentieth century

NASA Astrophysics Data System (ADS)

Cohn, Julie A.

North Americans are among the world's most intense consumers of electricity. The vast majority in the United States and Canada access power from a network of transmission lines that stretch from the East Coast to the West Coast and from Canada to the Mexican Baja. This network, known as the largest interconnected machine in the world, evolved during the first two thirds of the twentieth century. With the very first link-ups occurring at the end of the 1890s, a wide variety of public and private utilities extended power lines to reach markets, access and manage energy resources, balance loads, realize economies of scale, provide backup power, and achieve economic stability. In 1967, utility managers and the Bureau of Reclamation connected the expansive eastern and western power pools to create the North American grid. Unlike other power grids around the world, built by single, centrally controlled entities, this large technological system emerged as the result of multiple decisions across eighty-five years of development, and negotiations for control at the economic, political, and technological levels. This dissertation describes the process of building the North American grid and the paradoxes the resulting system represents. While the grid functions as a single machine moving electricity across the continent, it is owned by many independent entities. Smooth operations suggest that the grid is a unified system; however, it operates under shared management and divided authority. In addition, although a single power network seems the logical outcome of electrification, in fact it was assembled through aggregation, not planning. Interconnections intentionally increase the robustness of individual sub-networks, yet the system itself is fragile, as demonstrated by major cascading power outages. Finally, the transmission network facilitates increased use of energy resources and consumption of power, but at certain points in the past, it also served as a technology of conservation. While this project explores the history of how and why North America has a huge interconnected power system, it also offers insights into the challenges the grid poses for our energy future.

Exascale Hardware Architectures Working Group

DOE Office of Scientific and Technical Information (OSTI.GOV)

Hemmert, S; Ang, J; Chiang, P

2011-03-15

The ASC Exascale Hardware Architecture working group is challenged to provide input on the following areas impacting the future use and usability of potential exascale computer systems: processor, memory, and interconnect architectures, as well as the power and resilience of these systems. Going forward, there are many challenging issues that will need to be addressed. First, power constraints in processor technologies will lead to steady increases in parallelism within a socket. Additionally, all cores may not be fully independent nor fully general purpose. Second, there is a clear trend toward less balanced machines, in terms of compute capability compared tomore » memory and interconnect performance. In order to mitigate the memory issues, memory technologies will introduce 3D stacking, eventually moving on-socket and likely on-die, providing greatly increased bandwidth but unfortunately also likely providing smaller memory capacity per core. Off-socket memory, possibly in the form of non-volatile memory, will create a complex memory hierarchy. Third, communication energy will dominate the energy required to compute, such that interconnect power and bandwidth will have a significant impact. All of the above changes are driven by the need for greatly increased energy efficiency, as current technology will prove unsuitable for exascale, due to unsustainable power requirements of such a system. These changes will have the most significant impact on programming models and algorithms, but they will be felt across all layers of the machine. There is clear need to engage all ASC working groups in planning for how to deal with technological changes of this magnitude. The primary function of the Hardware Architecture Working Group is to facilitate codesign with hardware vendors to ensure future exascale platforms are capable of efficiently supporting the ASC applications, which in turn need to meet the mission needs of the NNSA Stockpile Stewardship Program. This issue is relatively immediate, as there is only a small window of opportunity to influence hardware design for 2018 machines. Given the short timeline a firm co-design methodology with vendors is of prime importance.« less

Technology Transfer: A Third World Perspective.

ERIC Educational Resources Information Center

Akubue, Anthony I.

2002-01-01

Technology transfer models are based on assumptions that do not reflect Third-World realities. Obstacles to building indigenous technology capacity include multinational corporations' control of innovations, strings attached to foreign aid, and indigenous reluctance to undertake research. Four areas of development include foreign direct…

Novel Low Loss Wide-Band Multi-Port Integrated Circuit Technology for RF/Microwave Applications

NASA Technical Reports Server (NTRS)

Simons, Rainee N.; Goverdhanam, Kavita; Katehi, Linda P. B.; Burke, Thomas P. (Technical Monitor)

2001-01-01

In this paper, novel low loss, wide-band coplanar stripline technology for radio frequency (RF)/microwave integrated circuits is demonstrated on high resistivity silicon wafer. In particular, the fabrication process for the deposition of spin-on-glass (SOG) as a dielectric layer, the etching of microvias for the vertical interconnects, the design methodology for the multiport circuits and their measured/simulated characteristics are graphically illustrated. The study shows that circuits with very low loss, large bandwidth, and compact size are feasible using this technology. This multilayer planar technology has potential to significantly enhance RF/microwave IC performance when combined with semi-conductor devices and microelectromechanical systems (MEMS).

Designing your office for technology.

PubMed

Unthank, Michael

2004-10-01

To practice efficiently, dentists need to consider the successful integration of technologies, which can benefit their practice of dentistry. The physical environment of the office must be developed to accommodate not only the appropriate placement of computer hardware and high-tech dental devices, but their interconnectivity, as well. Dentists need to make appropriate decisions regarding the types of technology they choose to integrate into their offices, and they need to understand how the technology will be installed and integrated. An office designed to optimize the use of technology will produce ongoing benefits for dentists, their staff members and their patients throughout the lives of their practices. A dentist's practice must be planned to accommodate networks of systems hidden below floors, above ceilings and within walls, as well as to support and connect diverse technology items throughout the office.

Recording of Electric Signal Passing Through a Pylon in Direct Skeletal Attachment of Leg Prostheses with Neuromuscular Control

PubMed Central

Pitkin, M.; Cassidy, C.; Muppavarapu, R.; Edell, David

2012-01-01

Direct recordings were made of electrical signals emanating from the muscles in a rabbit’s residuum. The signals were transmitted via wires attached on one end to the muscles, and on the other to an external recording system. The cable was held in a titanium tube inside a pylon that had been transcutaneously implanted into the residuum’s bone. The tube was surrounded by porous titanium cladding to enhance its bond with the bone and with the skin of the residuum. This study was the first known attempt to merge the technology of direct skeletal attachment of limb prostheses with the technology of neuromuscular control of prostheses, providing a safe and reliable passage of the electrical signal from the muscles inside the residuum to the outside recording system. PMID:22345523

Water supply as a constraint on transmission expansion planning in the Western interconnection

NASA Astrophysics Data System (ADS)

Tidwell, Vincent C.; Bailey, Michael; Zemlick, Katie M.; Moreland, Barbara D.

2016-12-01

Consideration of water supply in transmission expansion planning (TEP) provides a valuable means of managing impacts of thermoelectric generation on limited water resources. Toward this opportunity, thermoelectric water intensity factors and water supply availability (fresh and non-fresh sources) were incorporated into a recent TEP exercise conducted for the electric interconnection in the Western United States. The goal was to inform the placement of new thermoelectric generation so as to minimize issues related to water availability. Although freshwater availability is limited in the West, few instances across five TEP planning scenarios were encountered where water availability impacted the development of new generation. This unexpected result was related to planning decisions that favored the development of low water use generation that was geographically dispersed across the West. These planning decisions were not made because of their favorable influence on thermoelectric water demand; rather, on the basis of assumed future fuel and technology costs, policy drivers and the topology of electricity demand. Results also projected that interconnection-wide thermoelectric water consumption would increase by 31% under the business-as-usual case, while consumption would decrease by 42% under a scenario assuming a low-carbon future. Except in a few instances, new thermoelectric water consumption could be accommodated with less than 10% of the local available water supply; however, limited freshwater supplies and state-level policies could increase use of non-fresh water sources for new thermoelectric generation. Results could have been considerably different if scenarios favoring higher-intensity water use generation technology or potential impacts of climate change had been explored. Conduct of this exercise highlighted the importance of integrating water into all phases of TEP, particularly joint management of decisions that are both directly (e.g., water availability constraint) and indirectly (technology or policy constraints) related to future thermoelectric water demand, as well as, the careful selection of scenarios that adequately bound the potential dimensions of water impact.

Water supply as a constraint on transmission expansion planning in the Western interconnection

DOE Office of Scientific and Technical Information (OSTI.GOV)

Tidwell, Vincent C.; Bailey, Michael; Zemlick, Katie M.

Here, consideration of water supply in transmission expansion planning (TEP) provides a valuable means of managing impacts of thermoelectric generation on limited water resources. Toward this opportunity, thermoelectric water intensity factors and water supply availability (fresh and non-fresh sources) were incorporated into a recent TEP exercise conducted for the electric interconnection in the Western United States. The goal was to inform the placement of new thermoelectric generation so as to minimize issues related to water availability. Although freshwater availability is limited in the West, few instances across five TEP planning scenarios were encountered where water availability impacted the development ofmore » new generation. This unexpected result was related to planning decisions that favored the development of low water use generation that was geographically dispersed across the West. These planning decisions were not made because of their favorable influence on thermoelectric water demand; rather, on the basis of assumed future fuel and technology costs, policy drivers and the topology of electricity demand. Results also projected that interconnection-wide thermoelectric water consumption would increase by 31% under the business-as-usual case, while consumption would decrease by 42% under a scenario assuming a low-carbon future. Except in a few instances, new thermoelectric water consumption could be accommodated with less than 10% of the local available water supply; however, limited freshwater supplies and state-level policies could increase use of non-fresh water sources for new thermoelectric generation. Results could have been considerably different if scenarios favoring higher-intensity water use generation technology or potential impacts of climate change had been explored. Conduct of this exercise highlighted the importance of integrating water into all phases of TEP, particularly joint management of decisions that are both directly (e.g., water availability constraint) and indirectly (technology or policy constraints) related to future thermoelectric water demand, as well as, the careful selection of scenarios that adequately bound the potential dimensions of water impact.« less

Water supply as a constraint on transmission expansion planning in the Western interconnection

DOE PAGES

Tidwell, Vincent C.; Bailey, Michael; Zemlick, Katie M.; ...

2016-11-21

Here, consideration of water supply in transmission expansion planning (TEP) provides a valuable means of managing impacts of thermoelectric generation on limited water resources. Toward this opportunity, thermoelectric water intensity factors and water supply availability (fresh and non-fresh sources) were incorporated into a recent TEP exercise conducted for the electric interconnection in the Western United States. The goal was to inform the placement of new thermoelectric generation so as to minimize issues related to water availability. Although freshwater availability is limited in the West, few instances across five TEP planning scenarios were encountered where water availability impacted the development ofmore » new generation. This unexpected result was related to planning decisions that favored the development of low water use generation that was geographically dispersed across the West. These planning decisions were not made because of their favorable influence on thermoelectric water demand; rather, on the basis of assumed future fuel and technology costs, policy drivers and the topology of electricity demand. Results also projected that interconnection-wide thermoelectric water consumption would increase by 31% under the business-as-usual case, while consumption would decrease by 42% under a scenario assuming a low-carbon future. Except in a few instances, new thermoelectric water consumption could be accommodated with less than 10% of the local available water supply; however, limited freshwater supplies and state-level policies could increase use of non-fresh water sources for new thermoelectric generation. Results could have been considerably different if scenarios favoring higher-intensity water use generation technology or potential impacts of climate change had been explored. Conduct of this exercise highlighted the importance of integrating water into all phases of TEP, particularly joint management of decisions that are both directly (e.g., water availability constraint) and indirectly (technology or policy constraints) related to future thermoelectric water demand, as well as, the careful selection of scenarios that adequately bound the potential dimensions of water impact.« less

Cyber security challenges in Smart Cities: Safety, security and privacy.

PubMed

Elmaghraby, Adel S; Losavio, Michael M

2014-07-01

The world is experiencing an evolution of Smart Cities. These emerge from innovations in information technology that, while they create new economic and social opportunities, pose challenges to our security and expectations of privacy. Humans are already interconnected via smart phones and gadgets. Smart energy meters, security devices and smart appliances are being used in many cities. Homes, cars, public venues and other social systems are now on their path to the full connectivity known as the "Internet of Things." Standards are evolving for all of these potentially connected systems. They will lead to unprecedented improvements in the quality of life. To benefit from them, city infrastructures and services are changing with new interconnected systems for monitoring, control and automation. Intelligent transportation, public and private, will access a web of interconnected data from GPS location to weather and traffic updates. Integrated systems will aid public safety, emergency responders and in disaster recovery. We examine two important and entangled challenges: security and privacy. Security includes illegal access to information and attacks causing physical disruptions in service availability. As digital citizens are more and more instrumented with data available about their location and activities, privacy seems to disappear. Privacy protecting systems that gather data and trigger emergency response when needed are technological challenges that go hand-in-hand with the continuous security challenges. Their implementation is essential for a Smart City in which we would wish to live. We also present a model representing the interactions between person, servers and things. Those are the major element in the Smart City and their interactions are what we need to protect.

VCSELs for exascale computing, computer farms, and green photonics

NASA Astrophysics Data System (ADS)

Hofmann, Werner; Moser, Philip; Wolf, Philip; Larisch, Gunter; Li, Hui; Li, Wei; Lott, James; Bimberg, Dieter

2012-11-01

The bandwidth-induced communication bottleneck due to the intrinsic limitations of metal interconnects is inhibiting the performance and environmental friendliness of todaýs supercomputers, data centers, and in fact all other modern electrically interconnected and interoperable networks such as data farms and "cloud" fabrics. The same is true for systems of optical interconnects (OIs), where even when the metal interconnects are replaced with OIs the systems remain limited by bandwidth, physical size, and most critically the power consumption and lifecycle operating costs. Vertical-cavity surface-emitting lasers (VCSELs) are ideally suited to solve this dilemma. Global communication providers like Google Inc., Intel Inc., HP Inc., and IBM Inc. are now producing optical interconnects based on VCSELs. The optimal bandwidth per link may be analyzed by by using Amdahĺs Law and depends on the architecture of the data center and the performance of the servers within the data center. According to Google Inc., a bandwidth of 40 Gb/s has to be accommodated in the future. IBM Inc. demands 80 Tbps interconnects between solitary server chips in 2020. We recently realized ultrahigh bit rate VCSELs up to 49 Gb/s suited for such optical interconnects emitting at 980 nm. These devices show error-free transmission at temperatures up to 155°C and operate beyond 200°C. Single channel data-rates of 40 Gb/s were achieved up to 75°C. Record high energy efficiencies close to 50 fJ/bit were demonstrated for VCSELs emitting at 850 nm. Our devices are fabricated using a full three-inch wafer process, and the apertures were formed by in-situ controlled selective wet oxidation using stainless steel-based vacuum equipment of our own design. assembly, and operation. All device data are measured, recorded, and evaluated by our proprietary fully automated wafer mapping probe station. The bandwidth density of our present devices is expected to be scalable from about 100 Gbps/mm² to a physical limit of roughly 15 Tbps/mm² based on the current 12.5 Gb/s VCSEL technology. Still more energy-efficient and smaller volume laser diode devices dissipating less heat are mandatory for further up scaling of the bandwidth. Novel metal-clad VCSELs enable a reduction of the device's footprint for potentially ultrashort range interconnects by 1 to 2 orders of magnitude compared to conventional VCSELs thus enabling a similar increase of device density and bandwidth.

The Role of Peer Attachment and Normative Beliefs about Aggression on Traditional Bullying and Cyberbullying

ERIC Educational Resources Information Center

Burton, K. Alex; Florell, Dan; Wygant, Dustin B.

2013-01-01

This study examined the effects of normative beliefs about aggression and peer attachment on traditional bullying, cyberbullying, and both types of victimization. Cyberbullying departs from traditional forms of bullying in that it is through forms of technology, such as the Internet, which increases situational anonymity. Eight hundred fifty…

Fabrication of a TFF-Attached WDM-Type Triplex Transceiver Module Using Silica PLC Hybrid Integration Technology

NASA Astrophysics Data System (ADS)

Han, Young-Tak; Park, Yoon-Jung; Park, Sang-Ho; Shin, Jang-Uk; Lee, Chul-Wook; Ko, Hyunsung; Baek, Yongsoon; Park, Chul-Hee; Kwon, Yoon-Koo; Hwang, Wol-Yon; Oh, Kwang-Ryong; Sung, Heekyung

2006-12-01

An optical triplex transceiver (TRx) module, which consists of thin-film filter (TFF)-attached wavelength-division multiplexer (WDM) and photodiode (PD) carriers, has been fabricated using a silica planar lightwave circuit (PLC) hybrid integration technology. Two types of TFFs were attached to a diced sidewall of a silica-terraced PLC platform to realize the TFF-attached WDM. The PD carriers with a 45° mirror, on which receiving surface-illuminated PDs were bonded, were assembled with the PLC platform to form receiver (Rx) parts. As the main performances of the packaged TRx module, a very clear transmitter (Tx) eye pattern and minimum Rx sensitivity of -25.7 dBm were obtained under a 1.25-Gb/s Tx Rx operation for digital applications. For an analog Rx application, a module responsivity of about 0.8 A/W was achieved, and a second-order intermodulation distortion value of less than -70 dBc at an optical modulation index of 40% was obtained under a two-tone test of 400 and 450 MHz.

A solar module fabrication process for HALE solar electric UAV's

NASA Astrophysics Data System (ADS)

Carey, P. G.; Aceves, R. C.; Colella, N. J.; Williams, K. A.; Sinton, R. A.; Glenn, G. S.

1994-12-01

We describe a fabrication process used to manufacture high power-to-weight-ratio flexible solar array modules for use on high-altitude-long-endurance (HALE) solar-electric unmanned air vehicles (UAV's). These modules have achieved power-to-weight ratios of 315 and 396 W/kg for 150 micron-thick monofacial and 110 micron-thick bifacial silicon solar cells, respectively. These calculations reflect average module efficiencies of 15.3% (150 micron) and 14.7% (110 micron) obtained from electrical tests performed by Spectrolab, Inc. under AMO global conditions at 25 C, and include weight contributions from all module components (solar cells, lamination material, bypass diodes, interconnect wires, and adhesive tape used to attach the modules to the wing). The fabrication, testing, and performance of 32 sq m of these modules is described.

Forming electrical interconnections through semiconductor wafers

NASA Technical Reports Server (NTRS)

Anthony, T. R.

1981-01-01

An information processing system based on CMOS/SOS technology is being developed by NASA to process digital image data collected by satellites. An array of holes is laser drilled in a semiconductor wafer, and a conductor is formed in the holes to fabricate electrical interconnections through the wafers. Six techniques are used to form conductors in the silicon-on-sapphire (SOS) wafers, including capillary wetting, wedge extrusion, wire intersection, electroless plating, electroforming, double-sided sputtering and through-hole electroplating. The respective strengths and weaknesses of these techniques are discussed and compared, with double-sided sputtering and the through-hole plating method achieving best results. In addition, hollow conductors provided by the technique are available for solder refill, providing a natural way of forming an electrically connected stack of SOS wafers.

Unveiling the morphology of the acetabulum in octopus suckers and its role in attachment

PubMed Central

Tramacere, Francesca; Pugno, Nicola M.; Kuba, Michael J.; Mazzolai, Barbara

2015-01-01

In recent years, the attachment mechanism of the octopus sucker has attracted the interest of scientists from different research areas, including biology, engineering, medicine and robotics. From a technological perspective, the main goal is to identify the underlying mechanisms involved in sucker attachment for use in the development of new generations of artificial devices and materials. Recently, the understanding of the morphology of the sucker has been significantly improved; however, the mechanisms that allow attachment remain largely unknown. In this work, we present new anatomical findings: specifically, a protuberance in the acetabular roof in five different octopus species; previously, this protuberance was identified by the authors in Octopus vulgaris. Moreover, we discuss the role of the protuberance and other anatomical structures in attachment with minimal energy consumption. PMID:25657834

Operculum bone carp (cyprinus carprio sp.) scaffold is a new potential xenograft material: a preliminary study

NASA Astrophysics Data System (ADS)

Kartiwa, A.; Abbas, B.; Pandansari, P.; Prahasta, A.; Nandini, M.; Fadhlillah, M.; Subroto, T.; Panigoro, R.

2017-02-01

Orbital floor fracture with extensive bone loss, would cause herniation of the orbital tissue into the maxillary sinus. Graft implantation should be done on the orbital fracture with extensive bone loss. Different types of grafts have their own characteristics and advantages. Xenograft has been widely studied for use in bone defects. This study was to investigate cyprinus carprio sp. opercula bone as a potential xenograft. The aim of this study was to investigate based on EDS chemical analysis using a ZAF Standardless Method of Quantitative Analysis (Oxide) and SEM examination conducted in the laboratory of Mathematics, Institute of Technology Bandung. Particularly the mass ratio of Ca and P (5.8/3:47), the result is 1.67. This is equivalent to the stoichiometric Hydroxyapatite (HA) (Aoki H, 1991, Science and medical applications of hydroxyapatite, Tokyo: Institute for Medical and Engineering, Tokyo Medical and Dental University). C N O that there is an element of protein/amino acid collagen compound, serves as a matrix together with HA. As shown in the SEM analysis that the matrix is a porous sheet-shaped (oval) that interconnect with each other, which is good scaffold. The pore is composed of large pores >200 microns and smaller pores between the large pores with a size smaller or equal to 10 microns that can serve for the attachment of osteoblast cell. In conclusion, Opercula bone carp (cyprinus carprio sp.) scaffold could be a new potential xenograft material.

Micro-electro-optical devices in a five-level polysilicon surface-micromachining technology

NASA Astrophysics Data System (ADS)

Smith, James H.; Rodgers, M. Steven; Sniegowski, Jeffry J.; Miller, Samuel L.; Hetherington, Dale L.; McWhorter, Paul J.; Warren, Mial E.

1998-09-01

We recently reported on the development of a 5-level polysilicon surface micromachine fabrication process consisting of four levels of mechanical poly plus an electrical interconnect layer and its application to complex mechanical systems. This paper describes the application of this technology to create micro-optical systems-on-a-chip. These are demonstration systems, which show that give levels of polysilicon provide greater performance, reliability, and significantly increased functionality. This new technology makes it possible to realize levels of system complexity that have so far only existed on paper, while simultaneously adding to the robustness of many of the individual subassemblies.

Evaluating the Impact of the 2017 Solar Eclipse on U.S. Western Interconnection Operations

DOE Office of Scientific and Technical Information (OSTI.GOV)

Veda, Santosh; Zhang, Yingchen; Tan, Jin

With support from the U.S. Department of Energy (DOE) Solar Energy Technologies Office (SETO), the National Renewable Energy Laboratory (NREL) partnered with Peak Reliability to evaluate the impact of the August 21, 2017 total solar eclipse on the reliability and grid operations in the Western Electricity Coordinating Council (WECC) territory.

An Exploratory Study of the Idea of an Auxiliary Universal Language

ERIC Educational Resources Information Center

Majidi, Mojdeh

2007-01-01

We live in an increasingly interconnected world where the growing movements of ideas, goods, information, money and people across national boundaries and technological advancements have led to the urgent need to have a common secondary language to partake in the global community. This study intends to extend the literature on the idea of an…

Roles of Course Facilitators, Learners, and Technology in the Flow of Information of a cMOOC

ERIC Educational Resources Information Center

Skrypnyk, Oleksandra; Joksimovic, Srec´ko; Kovanovic, Vitomir; Gas?evic, Dragan; Dawson, Shane

2015-01-01

Distributed Massive Open Online Courses (MOOCs) are based on the premise that online learning occurs through a network of interconnected learners. The teachers' role in distributed courses extends to forming such a network by facilitating communication that connects learners and their separate personal learning environments scattered around the…

An Evidence Centered Design for Learning and Assessment in the Digital World. CRESST Report 778

ERIC Educational Resources Information Center

Behrens, John T.; Mislevy, Robert J.; DiCerbo, Kristen E.; Levy, Roy

2010-01-01

The world in which learning and assessment must take place is rapidly changing. The digital revolution has created a vast space of interconnected information, communication, and interaction. Functioning effectively in this environment requires so-called 21st century skills such as technological fluency, complex problem solving, and the ability to…

Facilitating Factors and Barriers to the Use of Emerging Technologies for Suicide Prevention in Europe: Multicountry Exploratory Study.

PubMed

Muñoz-Sánchez, Juan-Luis; Delgado, Carmen; Parra-Vidales, Esther; Franco-Martín, Manuel

2018-01-24

This study provides an analysis on the use of emerging technologies for the prevention of suicide in 8 different European countries. The objective of this study was to analyze the potentiality of using emerging technologies in the area of suicide prevention based on the opinion of different professionals involved in suicide prevention. Opinions of 3 groups of stakeholders (ie, relevant professionals in suicide field) were gathered using a specifically designed questionnaire to explore dimensions underlying perceptions of facilitating factors and barriers in relation to the use of emerging technologies for suicide prevention. Goal 1 involved facilitating factors for the use of emerging technologies in suicide prevention. Northern European countries, except for Belgium, attach greater relevance to those that optimize implementation and benefits. On the other hand, Southern European countries attach greater importance to professionally oriented and user-centered facilitating factors. According to different stakeholders, the analysis of these facilitating factors suggest that professionals in the field of social work attach greater relevance to those that optimize implementation and benefits. However, professionals involved in the area of mental health, policy makers, and political decision makers give greater importance to professionally oriented and user-centered facilitating factors. Goal 2 was related to barriers to the usability of emerging technologies for suicide prevention. Both countries and stakeholders attach greater importance to barriers associated with resource constraints than to those centered on personal limitations. There are no differences between countries or between stakeholders. Nevertheless, there is a certain stakeholders-countries interaction that indicates that the opinions on resource constraints expressed by different stakeholders do not follow a uniform pattern in different countries, but they differ depending on the country. Although all countries and stakeholders agree in identifying resource constraints as the main barrier to the use of emerging technologies, factors facilitating their use in suicide prevention differ among countries and among stakeholders. ©Juan-Luis Muñoz-Sánchez, Carmen Delgado, Esther Parra-Vidales, Manuel Franco-Martín. Originally published in JMIR Mental Health (http://mental.jmir.org), 24.01.2018.

Finite element based N-Port model for preliminary design of multibody systems

NASA Astrophysics Data System (ADS)

Sanfedino, Francesco; Alazard, Daniel; Pommier-Budinger, Valérie; Falcoz, Alexandre; Boquet, Fabrice

2018-02-01

This article presents and validates a general framework to build a linear dynamic Finite Element-based model of large flexible structures for integrated Control/Structure design. An extension of the Two-Input Two-Output Port (TITOP) approach is here developed. The authors had already proposed such framework for simple beam-like structures: each beam was considered as a TITOP sub-system that could be interconnected to another beam thanks to the ports. The present work studies bodies with multiple attaching points by allowing complex interconnections among several sub-structures in tree-like assembly. The TITOP approach is extended to generate NINOP (N-Input N-Output Port) models. A Matlab toolbox is developed integrating beam and bending plate elements. In particular a NINOP formulation of bending plates is proposed to solve analytic two-dimensional problems. The computation of NINOP models using the outputs of a MSC/Nastran modal analysis is also investigated in order to directly use the results provided by a commercial finite element software. The main advantage of this tool is to provide a model of a multibody system under the form of a block diagram with a minimal number of states. This model is easy to operate for preliminary design and control. An illustrative example highlights the potential of the proposed approach: the synthesis of the dynamical model of a spacecraft with two deployable and flexible solar arrays.

NATIONAL PREPAREDNESS: Technologies to Secure Federal Buildings

DTIC Science & Technology

2002-04-25

Medium, some resistance based on sensitivity of eye Facial recognition Facial features are captured and compared Dependent on lighting, positioning...two primary types of facial recognition technology used to create templates: 1. Local feature analysis—Dozens of images from regions of the face are...an adjacent feature. Attachment I—Access Control Technologies: Biometrics Facial Recognition How the technology works

Proceedings of the 1980 ERADCOM Hybrid Microcircuit Symposium, 1980, Fort Monmouth, New Jersey,

DTIC Science & Technology

1980-06-01

density and largest seam thickness. Eisenmann and Halyard [3] suggest the fluctuating contact resistance ob- served in epoxy attached devices results...34Advances in Epoxy Die Attach," Solid State Technology, Vol. 18, No. 9, Sept. 1975, pp 40-44. 3. D.E. Eisenmann and S.M. Halyard Jr., "Thermal

Design, processing and testing of LSI arrays, hybrid microelectronics task

NASA Technical Reports Server (NTRS)

Himmel, R. P.; Stuhlbarg, S. M.; Ravetti, R. G.; Zulueta, P. J.; Rothrock, C. W.

1979-01-01

Mathematical cost models previously developed for hybrid microelectronic subsystems were refined and expanded. Rework terms related to substrate fabrication, nonrecurring developmental and manufacturing operations, and prototype production are included. Sample computer programs were written to demonstrate hybrid microelectric applications of these cost models. Computer programs were generated to calculate and analyze values for the total microelectronics costs. Large scale integrated (LST) chips utilizing tape chip carrier technology were studied. The feasibility of interconnecting arrays of LSU chips utilizing tape chip carrier and semiautomatic wire bonding technology was demonstrated.

Overcoming Constraints in Healthcare with Cloud Technology.

PubMed

Hucíková, Anežka; Babic, Ankica

2016-01-01

Transitioning enterprise operations to the cloud brings a variety of opportunities and challenges. Such step requires a deep and complex understanding of all elements related to the technology as well as defining the manner in which specific cloud challenges can be dealt with. To provide a better understanding of these opportunities and challenges within healthcare, systematic literature overview and industrial cases review is used. Results of the two methods show interconnection between cloud deployment advantages and constrains. However, healthcare case studies provide interesting insights emphasizing cloud complexity and superposition which seems to balance organizational limitations.

Architecture for Survivable Systems Processing (ASSP). Technology benefits for Open System Interconnects

NASA Technical Reports Server (NTRS)

Wood, Richard J.

1992-01-01

The Architecture for Survivable Systems Processing (ASSP) program is a two phase program whose objective is the derivation, specification, development and validation of an open system architecture capable of supporting advanced processing needs of space, ground, and launch vehicle operations. The output of the first phase is a set of hardware and software standards and specifications defining this architecture at three levels. The second phase will validate these standards and develop the technology necessary to achieve strategic hardness, packaging density, throughput requirements, and interoperability/interchangeability.

Enabling Resiliency Operations across Multiple Microgrids with Grid Friendly Appliance Controllers

DOE PAGES

Schneider, Kevin P.; Tuffner, Frank K.; Elizondo, Marcelo A.; ...

2017-02-16

Changes in economic, technological, and environmental policies are resulting in a re-evaluation of the dependence on large central generation facilities and their associated transmission networks. Emerging concepts of smart communities/cities are examining the potential to leverage cleaner sources of generation, as well as integrating electricity generation with other municipal functions. When grid connected, these generation assets can supplement the existing interconnections with the bulk transmission system, and in the event of an extreme event, they can provide power via a collection of microgrids. To achieve the highest level of resiliency, it may be necessary to conduct switching operations to interconnectmore » individual microgrids. While the interconnection of multiple microgrids can increase the resiliency of the system, the associated switching operations can cause large transients in low inertia microgrids. The combination of low system inertia and IEEE 1547 and 1547a-compliant inverters can prevent multiple microgrids from being interconnected during extreme weather events. This study will present a method of using end-use loads equipped with Grid Friendly™ Appliance controllers to facilitate the switching operations between multiple microgrids; operations that are necessary for optimal operations when islanded for resiliency.« less

Enabling Resiliency Operations across Multiple Microgrids with Grid Friendly Appliance Controllers

DOE Office of Scientific and Technical Information (OSTI.GOV)

Schneider, Kevin P.; Tuffner, Frank K.; Elizondo, Marcelo A.

Changes in economic, technological, and environmental policies are resulting in a re-evaluation of the dependence on large central generation facilities and their associated transmission networks. Emerging concepts of smart communities/cities are examining the potential to leverage cleaner sources of generation, as well as integrating electricity generation with other municipal functions. When grid connected, these generation assets can supplement the existing interconnections with the bulk transmission system, and in the event of an extreme event, they can provide power via a collection of microgrids. To achieve the highest level of resiliency, it may be necessary to conduct switching operations to interconnectmore » individual microgrids. While the interconnection of multiple microgrids can increase the resiliency of the system, the associated switching operations can cause large transients in low inertia microgrids. The combination of low system inertia and IEEE 1547 and 1547a-compliant inverters can prevent multiple microgrids from being interconnected during extreme weather events. This study will present a method of using end-use loads equipped with Grid Friendly™ Appliance controllers to facilitate the switching operations between multiple microgrids; operations that are necessary for optimal operations when islanded for resiliency.« less

Shift-phase code multiplexing technique for holographic memories and optical interconnection

NASA Astrophysics Data System (ADS)

Honma, Satoshi; Muto, Shinzo; Okamoto, Atsushi

2008-03-01

Holographic technologies for optical memories and interconnection devices have been studied actively because of high storage capacity, many wiring patterns and high transmission rate. Among multiplexing techniques such as angular, phase code and wavelength-multiplexing, speckle multiplexing technique have gotten attention due to the simple optical setup having an adjustable random phase filter in only one direction. To keep simple construction and to suppress crosstalk among adjacent page data or wiring patterns for efficient holographic memories and interconnection, we have to consider about optimum randomness of the phase filter. The high randomness causes expanding an illumination area of reference beam on holographic media. On the other hands, the small randomness causes the crosstalk between adjacent hologram data. We have proposed the method of holographic multiplexing, shift-phase code multiplexing with a two-dimensional orthogonal matrix phase filter. A lot of orthogonal phase codes can be produced by shifting the phase filter in one direction. It is able to read and record the individual holograms with low crosstalk. We give the basic experimental result on holographic data multiplexing and consider the phase pattern of the filter to suppress the crosstalk between adjacent holograms sufficiently.

Scalable Performance Environments for Parallel Systems

NASA Technical Reports Server (NTRS)

Reed, Daniel A.; Olson, Robert D.; Aydt, Ruth A.; Madhyastha, Tara M.; Birkett, Thomas; Jensen, David W.; Nazief, Bobby A. A.; Totty, Brian K.

1991-01-01

As parallel systems expand in size and complexity, the absence of performance tools for these parallel systems exacerbates the already difficult problems of application program and system software performance tuning. Moreover, given the pace of technological change, we can no longer afford to develop ad hoc, one-of-a-kind performance instrumentation software; we need scalable, portable performance analysis tools. We describe an environment prototype based on the lessons learned from two previous generations of performance data analysis software. Our environment prototype contains a set of performance data transformation modules that can be interconnected in user-specified ways. It is the responsibility of the environment infrastructure to hide details of module interconnection and data sharing. The environment is written in C++ with the graphical displays based on X windows and the Motif toolkit. It allows users to interconnect and configure modules graphically to form an acyclic, directed data analysis graph. Performance trace data are represented in a self-documenting stream format that includes internal definitions of data types, sizes, and names. The environment prototype supports the use of head-mounted displays and sonic data presentation in addition to the traditional use of visual techniques.

Assessing Advanced Technology in CENATE

DOE Office of Scientific and Technical Information (OSTI.GOV)

Tallent, Nathan R.; Barker, Kevin J.; Gioiosa, Roberto

PNNL's Center for Advanced Technology Evaluation (CENATE) is a new U.S. Department of Energy center whose mission is to assess and facilitate access to emerging computing technology. CENATE is assessing a range of advanced technologies, from evolutionary to disruptive. Technologies of interest include the processor socket (homogeneous and accelerated systems), memories (dynamic, static, memory cubes), motherboards, networks (network interface cards and switches), and input/output and storage devices. CENATE is developing a multi-perspective evaluation process based on integrating advanced system instrumentation, performance measurements, and modeling and simulation. We show evaluations of two emerging network technologies: silicon photonics interconnects and the Datamore » Vortex network. CENATE's evaluation also addresses the question of which machine is best for a given workload under certain constraints. We show a performance-power tradeoff analysis of a well-known machine learning application on two systems.« less

Next-generation avionics packaging and cooling 'test results from a prototype system'

NASA Astrophysics Data System (ADS)

Seals, J. D.

The author reports on the design, material characteristics, and test results obtained under the US Air Force's advanced aircraft avionics packaging technologies (AAAPT) program, whose charter is to investigate new designs and technologies for reliable packaging, interconnection, and thermal management. Under this program, AT&T Bell Laboratories has completed the preliminary testing of and is evaluating a number of promising materials and technologies, including conformal encapsulation, liquid flow-through cooling, and a cyanate ester backplane. A fifty-two module system incorporating these and and other technologies has undergone preliminary cooling efficiency, shock, sine and random vibration, and maintenance testing. One of the primary objectives was to evaluate the interaction compatibility of new materials and designs with other components in the system.

Interconnect assembly for an electronic assembly and assembly method therefor

DOEpatents

Gerbsch, Erich William

2003-06-10

An interconnect assembly and method for a semiconductor device, in which the interconnect assembly can be used in lieu of wirebond connections to form an electronic assembly. The interconnect assembly includes first and second interconnect members. The first interconnect member has a first surface with a first contact and a second surface with a second contact electrically connected to the first contact, while the second interconnect member has a flexible finger contacting the second contact of the first interconnect member. The first interconnect member is adapted to be aligned and registered with a semiconductor device having a contact on a first surface thereof, so that the first contact of the first interconnect member electrically contacts the contact of the semiconductor device. Consequently, the assembly method does not require any wirebonds, but instead merely entails aligning and registering the first interconnect member with the semiconductor device so that the contacts of the first interconnect member and the semiconductor device make electrically contact, and then contacting the second contact of the first interconnect member with the flexible finger of the second interconnect member.

Terahertz MMICs and Antenna-in-Package Technology at 300 GHz for KIOSK Download System

NASA Astrophysics Data System (ADS)

Tajima, Takuro; Kosugi, Toshihiko; Song, Ho-Jin; Hamada, Hiroshi; El Moutaouakil, Amine; Sugiyama, Hiroki; Matsuzaki, Hideaki; Yaita, Makoto; Kagami, Osamu

2016-12-01

Toward the realization of ultra-fast wireless communications systems, the inherent broad bandwidth of the terahertz (THz) band is attracting attention, especially for short-range instant download applications. In this paper, we present our recent progress on InP-based THz MMICs and packaging techniques based on low-temperature co-fibered ceramic (LTCC) technology. The transmitter MMICs are based on 80-nm InP-based high electron mobility transistors (HEMTs). Using the transmitter packaged in an E-plane split-block waveguide and compact lens receiver packaged in LTCC multilayered substrates, we tested wireless data transmission up to 27 Gbps with the simple amplitude key shifting (ASK) modulation scheme. We also present several THz antenna-in-packaging solutions based on substrate integrated waveguide (SIW) technology. A vertical hollow (VH) SIW was applied to a compact medium-gain SIW antenna and low-loss interconnection integrated in LTCC multi-layer substrates. The size of the LTCC antennas with 15-dBi gain is less than 0.1 cm3. For feeding the antenna, we investigated an LTCC-integrated transition and polyimide transition to LTCC VH SIWs. These transitions exhibit around 1-dB estimated loss at 300 GHz and more than 35 GHz bandwidth with 10-dB return loss. The proposed package solutions make antennas and interconnections easy to integrate in a compact LTCC package with an MMIC chip for practical applications.

Creation of defined single cell resolution neuronal circuits on microelectrode arrays

NASA Astrophysics Data System (ADS)

Pirlo, Russell Kirk

2009-12-01

The way cell-cell organization of neuronal networks influences activity and facilitates function is not well understood. Microelectrode arrays (MEAs) and advancing cell patterning technologies have enabled access to and control of in vitro neuronal networks spawning much new research in neuroscience and neuroengineering. We propose that small, simple networks of neurons with defined circuitry may serve as valuable research models where every connection can be analyzed, controlled and manipulated. Towards the goal of creating such neuronal networks we have applied microfabricated elastomeric membranes, surface modification and our unique laser cell patterning system to create defined neuronal circuits with single-cell precision on MEAs. Definition of synaptic connectivity was imposed by the 3D physical constraints of polydimethylsiloxane elastomeric membranes. The membranes had 20mum clear-through holes and 2-3mum deep channels which when applied to the surface of the MEA formed microwells to confine neurons to electrodes connected via shallow tunnels to direct neurite outgrowth. Tapering and turning of channels was used to influence neurite polarity. Biocompatibility of the membranes was increased by vacuum baking, oligomer extraction, and autoclaving. Membranes were bound to the MEA by oxygen plasma treatment and heated pressure. The MEA/membrane surface was treated with oxygen plasma, poly-D-lysine and laminin to improve neuron attachment, survival and neurite outgrowth. Prior to cell patterning the outer edge of culture area was seeded with 5x10 5 cells per cm and incubated for 2 days. Single embryonic day 7 chick forebrain neurons were then patterned into the microwells and onto the electrodes using our laser cell patterning system. Patterned neurons successfully attached to and were confined to the electrodes. Neurites extended through the interconnecting channels and connected with adjacent neurons. These results demonstrate that neuronal circuits can be created with clearly defined circuitry and a one-to-one neuron-electrode ratio. The techniques and processes described here may be used in future research to create defined neuronal circuits to model in vivo circuits and study neuronal network processing.

Materials, devices, techniques, and applications for Z-plane focal plane array technology II; Proceedings of the Meeting, San Diego, CA, July 12, 13, 1990

NASA Astrophysics Data System (ADS)

Carson, John C.

1990-11-01

Various papers on materials, devices, techniques, and applications for X-plane focal plane array technology are presented. Individual topics addressed include: application of Z-plane technology to the remote sensing of the earth from GEO, applications of smart neuromorphic focal planes, image-processing of Z-plane technology, neural network Z-plane implementation with very high interconnection rates, using a small IR surveillance satellite for tactical applications, establishing requirements for homing applications, Z-plane technology. Also discussed are: on-array spike suppression signal processing, algorithms for on-focal-plane gamma circumvention and time-delay integration, current HYMOSS Z-technology, packaging of electrons for on- and off-FPA signal processing, space/performance qualification of tape automated bonded devices, automation in tape automated bonding, high-speed/high-volume radiometric testing of Z-technology focal planes, 128-layer HYMOSS-module fabrication issues, automation of IRFPA production processes.

Crosscutting Technology Development at the Center for Advanced Separation Technologies

DOE Office of Scientific and Technical Information (OSTI.GOV)

Christopher E. Hull

2006-09-30

This Technical Progress Report describes progress made on the twenty nine subprojects awarded in the second year of Cooperative Agreement DE-FC26-02NT41607: Crosscutting Technology Development at the Center for Advanced Separation Technologies. This work is summarized in the body of the main report: the individual sub-project Technical Progress Reports are attached as Appendices.

CROSSCUTTING TECHNOLOGY DEVELOPMENT AT THE CENTER FOR ADVANCED SEPARATION TECHNOLOGIES

DOE Office of Scientific and Technical Information (OSTI.GOV)

Christopher E. Hull

2006-05-15

This Technical Progress Report describes progress made on the twenty nine subprojects awarded in the second year of Cooperative Agreement DE-FC26-02NT41607: Crosscutting Technology Development at the Center for Advanced Separation Technologies. This work is summarized in the body of the main report: the individual sub-project Technical Progress Reports are attached as Appendices.

Climate Change and Future U.S. Electricity Infrastructure: the Nexus between Water Availability, Land Suitability, and Low-Carbon Technologies

NASA Astrophysics Data System (ADS)

Rice, J.; Halter, T.; Hejazi, M. I.; Jensen, E.; Liu, L.; Olson, J.; Patel, P.; Vernon, C. R.; Voisin, N.; Zuljevic, N.

2014-12-01

Integrated assessment models project the future electricity generation mix under different policy, technology, and socioeconomic scenarios, but they do not directly address site-specific factors such as interconnection costs, population density, land use restrictions, air quality, NIMBY concerns, or water availability that might affect the feasibility of achieving the technology mix. Moreover, since these factors can change over time due to climate, policy, socioeconomics, and so on, it is important to examine the dynamic feasibility of integrated assessment scenarios "on the ground." This paper explores insights from coupling an integrated assessment model (GCAM-USA) with a geospatial power plant siting model (the Capacity Expansion Regional Feasibility model, CERF) within a larger multi-model framework that includes regional climate, hydrologic, and water management modeling. GCAM-USA is a dynamic-recursive market equilibrium model simulating the impact of carbon policies on global and national markets for energy commodities and other goods; one of its outputs is the electricity generation mix and expansion at the state-level. It also simulates water demands from all sectors that are downscaled as input to the water management modeling. CERF simulates siting decisions by dynamically representing suitable areas for different generation technologies with geospatial analyses (informed by technology-specific siting criteria, such as required mean streamflow per the Clean Water Act), and then choosing siting locations to minimize interconnection costs (to electric transmission and gas pipelines). CERF results are compared across three scenarios simulated by GCAM-USA: 1) a non-mitigation scenario (RCP8.5) in which conventional fossil-fueled technologies prevail, 2) a mitigation scenario (RCP4.5) in which the carbon price causes a shift toward nuclear, carbon capture and sequestration (CCS), and renewables, and 3) a repeat of scenario (2) in which CCS technologies are made unavailable—resulting in a large increase in the nuclear fraction of the mix.

Design, fabrication, and characterization of high density silicon photonic components

NASA Astrophysics Data System (ADS)

Jones, Adam Michael

Our burgeoning appetite for data relentlessly demands exponential scaling of computing and communications resources leading to an overbearing and ever-present drive to improve eciency while reducing on-chip area even as photonic components expand to ll application spaces no longer satised by their electronic counterparts. With a high index contrast, low optical loss, and compatibility with the CMOS fabrication infrastructure, silicon-on-insulator technology delivers a mechanism by which ecient, sub-micron waveguides can be fabricated while enabling monolithic integration of photonic components and their associated electronic infrastructure. The result is a solution leveraging the superior bandwidth of optical signaling on a platform capable of delivering the optical analogue to Moore's Law scaling of transistor density. Device size is expected to end Moore's Law scaling in photonics as Maxwell's equations limit the extent to which this parameter may be reduced. The focus of the work presented here surrounds photonic device miniaturization and the development of 3D optical interconnects as approaches to optimize performance in densely integrated optical interconnects. In this dissertation, several technological barriers inhibiting widespread adoption of photonics in data communications and telecommunications are explored. First, examination of loss and crosstalk performance in silicon nitride over SOI waveguide crossings yields insight into the feasibility of 3D optical interconnects with the rst experimental analysis of such a structure presented herein. A novel measurement platform utilizing a modied racetrack resonator is then presented enabling extraction of insertion loss data for highly ecient structures while requiring minimal on-chip area. Finally, pioneering work in understanding the statistical nature of doublet formation in microphotonic resonators is delivered with the resulting impact on resonant device design detailed.

Weaves as an Interconnection Fabric for ASIM's and Nanosatellites

NASA Technical Reports Server (NTRS)

Gorlick, Michael M.

1995-01-01

Many of the micromachines under consideration require computer support, indeed, one of the appeals of this technology is the ability to intermix mechanical, optical, analog, and digital devices on the same substrate. The amount of computer power is rarely an issue, the sticking point is the complexity of the software required to make effective use of these devices. Micromachines are the nano-technologist's equivalent of 'golden screws'. In other words, they will be piece parts in larger assemblages. For example, a nano-satellite may be composed of stacked silicon wafers where each wafer contains hundreds to thousands of micromachines, digital controllers, general purpose computers, memories, and high-speed bus interconnects. Comparatively few of these devices will be custom designed, most will be stock parts selected from libraries and catalogs. The novelty will lie in the interconnections. For example, a digital accelerometer may be a component part in an adaptive suspension, a monitoring element embedded in the wrapper of a package, or a portion of the smart skin of a launch vehicle. In each case, this device must inter-operate with other devices and probes for the purposes of command, control, and communication. We propose a software technology called 'weaves' that will permit large collections of micromachines and their attendant computers to freely intercommunicate while preserving modularity, transparency, and flexibility. Weaves are composed of networks of communicating software components. The network, and the components comprising it, may be changed even while the software, and the devices it controls, are executing. This unusual degree of software plasticity permits micromachines to dynamically adapt the software to changing conditions and allows system engineers to rapidly and inexpensively develop special purpose software by assembling stock software components in custom configurations.

Cyber security challenges in Smart Cities: Safety, security and privacy

PubMed Central

Elmaghraby, Adel S.; Losavio, Michael M.

2014-01-01

The world is experiencing an evolution of Smart Cities. These emerge from innovations in information technology that, while they create new economic and social opportunities, pose challenges to our security and expectations of privacy. Humans are already interconnected via smart phones and gadgets. Smart energy meters, security devices and smart appliances are being used in many cities. Homes, cars, public venues and other social systems are now on their path to the full connectivity known as the “Internet of Things.” Standards are evolving for all of these potentially connected systems. They will lead to unprecedented improvements in the quality of life. To benefit from them, city infrastructures and services are changing with new interconnected systems for monitoring, control and automation. Intelligent transportation, public and private, will access a web of interconnected data from GPS location to weather and traffic updates. Integrated systems will aid public safety, emergency responders and in disaster recovery. We examine two important and entangled challenges: security and privacy. Security includes illegal access to information and attacks causing physical disruptions in service availability. As digital citizens are more and more instrumented with data available about their location and activities, privacy seems to disappear. Privacy protecting systems that gather data and trigger emergency response when needed are technological challenges that go hand-in-hand with the continuous security challenges. Their implementation is essential for a Smart City in which we would wish to live. We also present a model representing the interactions between person, servers and things. Those are the major element in the Smart City and their interactions are what we need to protect. PMID:25685517

Statistical metrology—measurement and modeling of variation for advanced process development and design rule generation

NASA Astrophysics Data System (ADS)

Boning, Duane S.; Chung, James E.

1998-11-01

Advanced process technology will require more detailed understanding and tighter control of variation in devices and interconnects. The purpose of statistical metrology is to provide methods to measure and characterize variation, to model systematic and random components of that variation, and to understand the impact of variation on both yield and performance of advanced circuits. Of particular concern are spatial or pattern-dependencies within individual chips; such systematic variation within the chip can have a much larger impact on performance than wafer-level random variation. Statistical metrology methods will play an important role in the creation of design rules for advanced technologies. For example, a key issue in multilayer interconnect is the uniformity of interlevel dielectric (ILD) thickness within the chip. For the case of ILD thickness, we describe phases of statistical metrology development and application to understanding and modeling thickness variation arising from chemical-mechanical polishing (CMP). These phases include screening experiments including design of test structures and test masks to gather electrical or optical data, techniques for statistical decomposition and analysis of the data, and approaches to calibrating empirical and physical variation models. These models can be integrated with circuit CAD tools to evaluate different process integration or design rule strategies. One focus for the generation of interconnect design rules are guidelines for the use of "dummy fill" or "metal fill" to improve the uniformity of underlying metal density and thus improve the uniformity of oxide thickness within the die. Trade-offs that can be evaluated via statistical metrology include the improvements to uniformity possible versus the effect of increased capacitance due to additional metal.

Innovative materials tailored for advanced micro-optic applications

NASA Astrophysics Data System (ADS)

Himmelhuber, Roland; Fink, Marion; Pfeiffer, Karl; Ostrzinski, Ute; Klukowska, Anna; Gruetzner, Gabi; Houbertz, Ruth; Wolter, Herbert

2007-02-01

The handling of a continuously increasing amount of data leads to a strong need for high-speed short-range connections. Conventional Cu technology between chips on a board is limited. Optical interconnects will dominate the market, since they can overcome the limitations. One of the issues for materials used, e.g., for waveguides embedded in printed circuit boards (PCBs) is the compatibility with standard epoxies used for PCBs during the entire board fabrication process. Materials applied for optical interconnects should be mechanically and optically reliable, and also allow low-cost production. From the material production side, the process should be easy to up-scale. Therefore, anticipatory research strategy and suitable tailoring is asked for. The handling of light in the UV and visible range often requires the use of specially designed materials. Most polymer materials show an increased yellowing effect upon being exposed to shorter wavelength light. The major influence on the absorption in the UV and visible range of a UV curable material is related to the UV initiator, beside any other chromophores formed mainly during the exposure. Different material approaches will be presented which fulfil the requirements for highly sophisticated applications in optics / optical packaging technology. Firstly, an epoxy-based material system for optical chip-to-chip interconnection will be introduced. Secondly, the adaptation of a UV patternable inorganic-organic hybrid material (ORMOCER ®) originally developed for waveguide applications in the data and telecom regime, will be discussed with respect to applications in the visible regime. Spectroscopy and UV-DSC measurements were carried out to investigate the influence of standard photoinitiators on the optical properties for an ORMOCER ® system suitable for microoptic applications. The results show that the resulting material properties were significantly improved by exchange of the initiators compared to the originally incorporated one.

Design Fabrication and Characterization of High Density Silicon Photonic Components

DOE Office of Scientific and Technical Information (OSTI.GOV)

Jones, Adam

2015-02-01

Our burgeoning appetite for data relentlessly demands exponential scaling of computing and communications resources leading to an overbearing and ever-present drive to improve e ciency while reducing on-chip area even as photonic components expand to ll application spaces no longer satis ed by their electronic counterparts. With a high index contrast, low optical loss, and compatibility with the CMOS fabrication infrastructure, silicon-on-insulator technology delivers a mechanism by which e cient, sub-micron waveguides can be fabricated while enabling monolithic integration of photonic components and their associated electronic infrastructure. The result is a solution leveraging the superior bandwidth of optical signaling onmore » a platform capable of delivering the optical analogue to Moore's Law scaling of transistor density. Device size is expected to end Moore's Law scaling in photonics as Maxwell's equations limit the extent to which this parameter may be reduced. The focus of the work presented here surrounds photonic device miniaturization and the development of 3D optical interconnects as approaches to optimize performance in densely integrated optical interconnects. In this dissertation, several technological barriers inhibiting widespread adoption of photonics in data communications and telecommunications are explored. First, examination of loss and crosstalk performance in silicon nitride over SOI waveguide crossings yields insight into the feasibility of 3D optical interconnects with the rst experimental analysis of such a structure presented herein. A novel measurement platform utilizing a modi ed racetrack resonator is then presented enabling extraction of insertion loss data for highly e cient structures while requiring minimal on-chip area. Finally, pioneering work in understanding the statistical nature of doublet formation in microphotonic resonators is delivered with the resulting impact on resonant device design detailed.« less

Method and apparatus for jetting, manufacturing and attaching uniform solder balls

DOEpatents

Yost, F.G.; Frear, D.R.; Schmale, D.T.

1999-01-05

An apparatus and process are disclosed for jetting molten solder in the form of balls directly onto all the metallized interconnects lands for a ball grid array package in one step with no solder paste required. Molten solder is jetted out of a grid of holes using a piston attached to a piezoelectric crystal. When voltage is applied to the crystal it expands forcing the piston to extrude a desired volume of solder through holes in the aperture plate. When the voltage is decreased the piston reverses motion creating an instability in the molten solder at the aperture plate surface and thereby forming spherical solder balls that fall onto a metallized substrate. The molten solder balls land on the substrate and form a metallurgical bond with the metallized lands. The size of the solder balls is determined by a combination of the size of the holes in the aperture plate, the duration of the piston pulse, and the displacement of the piston. The layout of the balls is dictated by the location of the hooks in the grid. Changes in ball size and layout can be easily accomplished by changing the grid plate. This invention also allows simple preparation of uniform balls for subsequent supply to BGA users. 7 figs.

Development of a new carbon nanotube–alginate–hydroxyapatite tricomponent composite scaffold for application in bone tissue engineering

PubMed Central

Rajesh, Rajendiran; Dominic Ravichandran, Y

2015-01-01

In recent times, tricomponent scaffolds prepared from naturally occurring polysaccharides, hydroxyapatite, and reinforcing materials have been gaining increased attention in the field of bone tissue engineering. In the current work, a tricomponent scaffold with an oxidized multiwalled carbon nanotube (fMWCNT)–alginate–hydroxyapatite with the required porosity was prepared for the first time by a freeze-drying method and characterized using analytical techniques. The hydroxyapatite for the scaffold was isolated from chicken bones by thermal calcination at 800°C. The Fourier transform infrared spectra and X-ray diffraction data confirmed ionic interactions and formation of the fMWCNT–alginate–hydroxyapatite scaffold. Interconnected porosity with a pore size of 130–170 µm was evident from field emission scanning electron microscopy. The total porosity calculated using the liquid displacement method was found to be 93.85%. In vitro biocompatibility and cell proliferation on the scaffold was checked using an MG-63 cell line by 3-(4,5-dimethylthiazol-2-yl)-2,5-diphenyltetrazolium bromide assay and cell attachment by Hoechst stain assay. In vitro studies showed better cell proliferation, cell differentiation, and cell attachment on the prepared scaffold. These results indicate that this scaffold could be a promising candidate for bone tissue engineering. PMID:26491303

Method and apparatus for jetting, manufacturing and attaching uniform solder balls

DOEpatents

Yost, Frederick G.; Frear, Darrel R.; Schmale, David T.

1999-01-01

An apparatus and process for jetting molten solder in the form of balls directly onto all the metallized interconnects lands for a ball grid array package in one step with no solder paste required. Molten solder is jetted out of a grid of holes using a piston attached to a piezoelectric crystal. When voltage is applied to the crystal it expands forcing the piston to extrude a desired volume of solder through holes in the aperture plate. When the voltage is decreased the piston reverses motion creating an instability in the molten solder at the aperture plate surface and thereby forming spherical solder balls that fall onto a metallized substrate. The molten solder balls land on the substrate and form a metallurgical bond with the metallized lands. The size of the solder balls is determined by a combination of the size of the holes in the aperture plate, the duration of the piston pulse, and the displacement of the piston. The layout of the balls is dictated by the location of the hooks in the grid. Changes in ball size and layout can be easily accomplished by changing the grid plate. This invention also allows simple preparation of uniform balls for subsequent supply to BGA users.

Battery Vent Mechanism And Method

DOEpatents

Ching, Larry K. W.

2000-02-15

Disclosed herein is a venting mechanism for a battery. The venting mechanism includes a battery vent structure which is located on the battery cover and may be integrally formed therewith. The venting mechanism includes an opening extending through the battery cover such that the opening communicates with a plurality of battery cells located within the battery case. The venting mechanism also includes a vent manifold which attaches to the battery vent structure. The vent manifold includes a first opening which communicates with the battery vent structure opening and second and third openings which allow the vent manifold to be connected to two separate conduits. In this manner, a plurality of batteries may be interconnected for venting purposes, thus eliminating the need to provide separate vent lines for each battery. The vent manifold may be attached to the battery vent structure by a spin-welding technique. To facilitate this technique, the vent manifold may be provided with a flange portion which fits into a corresponding groove portion on the battery vent structure. The vent manifold includes an internal chamber which is large enough to completely house a conventional battery flame arrester and overpressure safety valve. In this manner, the vent manifold, when installed, lessens the likelihood of tampering with the flame arrester and safety valve.

Battery venting system and method

DOEpatents

Casale, T.J.; Ching, L.K.W.; Baer, J.T.; Swan, D.H.

1999-01-05

Disclosed herein is a venting mechanism for a battery. The venting mechanism includes a battery vent structure which is located on the battery cover and may be integrally formed therewith. The venting mechanism includes an opening extending through the battery cover such that the opening communicates with a plurality of battery cells located within the battery case. The venting mechanism also includes a vent manifold which attaches to the battery vent structure. The vent manifold includes a first opening which communicates with the battery vent structure opening and second and third openings which allow the vent manifold to be connected to two separate conduits. In this manner, a plurality of batteries may be interconnected for venting purposes, thus eliminating the need to provide separate vent lines for each battery. The vent manifold may be attached to the battery vent structure by a spin-welding technique. To facilitate this technique, the vent manifold may be provided with a flange portion which fits into a corresponding groove portion on the battery vent structure. The vent manifold includes an internal chamber which is large enough to completely house a conventional battery flame arrester and overpressure safety valve. In this manner, the vent manifold, when installed, lessens the likelihood of tampering with the flame arrester and safety valve. 8 figs.

Battery venting system and method

DOEpatents

Casale, Thomas J.; Ching, Larry K. W.; Baer, Jose T.; Swan, David H.

1999-01-05

Disclosed herein is a venting mechanism for a battery. The venting mechanism includes a battery vent structure which is located on the battery cover and may be integrally formed therewith. The venting mechanism includes an opening extending through the battery cover such that the opening communicates with a plurality of battery cells located within the battery case. The venting mechanism also includes a vent manifold which attaches to the battery vent structure. The vent manifold includes a first opening which communicates with the battery vent structure opening and second and third openings which allow the vent manifold to be connected to two separate conduits. In this manner, a plurality of batteries may be interconnected for venting purposes, thus eliminating the need to provide separate vent lines for each battery. The vent manifold may be attached to the battery vent structure by a spin-welding technique. To facilitate this technique, the vent manifold may be provided with a flange portion which fits into a corresponding groove portion on the battery vent structure. The vent manifold includes an internal chamber which is large enough to completely house a conventional battery flame arrester and overpressure safety valve. In this manner, the vent manifold, when installed, lessens the likelihood of tampering with the flame arrester and safety valve.

Novel Approach for Positioning Sensor Lead Wires on SiC-Based Monolithic Ceramic and FRCMC Components/Subcomponents Having Flat and Curved Surfaces

NASA Technical Reports Server (NTRS)

Kiser, J. Douglas; Singh, Mrityunjay; Lei, Jin-Fen; Martin, Lisa C.

1999-01-01

A novel attachment approach for positioning sensor lead wires on silicon carbide-based monolithic ceramic and fiber reinforced ceramic matrix composite (FRCMC) components has been developed. This approach is based on an affordable, robust ceramic joining technology, named ARCJoinT, which was developed for the joining of silicon carbide-based ceramic and fiber reinforced composites. The ARCJoinT technique has previously been shown to produce joints with tailorable thickness and good high temperature strength. In this study, silicon carbide-based ceramic and FRCMC attachments of different shapes and sizes were joined onto silicon carbide fiber reinforced silicon carbide matrix (SiC/ SiC) composites having flat and curved surfaces. Based on results obtained in previous joining studies. the joined attachments should maintain their mechanical strength and integrity at temperatures up to 1350 C in air. Therefore they can be used to position and secure sensor lead wires on SiC/SiC components that are being tested in programs that are focused on developing FRCMCs for a number of demanding high temperature applications in aerospace and ground-based systems. This approach, which is suitable for installing attachments on large and complex shaped monolithic ceramic and composite components, should enhance the durability of minimally intrusive high temperature sensor systems. The technology could also be used to reinstall attachments on ceramic components that were damaged in service.

A Fully Implemented 12 × 12 Data Vortex Optical Packet Switching Interconnection Network

NASA Astrophysics Data System (ADS)

Shacham, Assaf; Small, Benjamin A.; Liboiron-Ladouceur, Odile; Bergman, Keren

2005-10-01

A fully functional optical packet switching (OPS) interconnection network based on the data vortex architecture is presented. The photonic switching fabric uniquely capitalizes on the enormous bandwidth advantage of wavelength division multiplexing (WDM) wavelength parallelism while delivering minimal packet transit latency. Utilizing semiconductor optical amplifier (SOA)-based switching nodes and conventional fiber-optic technology, the 12-port system exhibits a capacity of nearly 1 Tb/s. Optical packets containing an eight-wavelength WDM payload with 10 Gb/s per wavelength are routed successfully to all 12 ports while maintaining a bit error rate (BER) of 10-12 or better. Median port-to-port latencies of 110 ns are achieved with a distributed deflection routing network that resolves packet contention on-the-fly without the use of optical buffers and maintains the entire payload path in the optical domain.

A New Generation: A New Model of Education in the 21st Century

ERIC Educational Resources Information Center

Ellis, Deborah L.

2012-01-01

As technology evolves and the world becomes more interconnected, a new set of skills have become necessary to be successful in the workplace. Schools need to develop and modernize in order to prepare students to be competitive in the changing global economy. The purpose of this case study was to identify the programs and practices that promote the…

Culturally Aware Agents for Training Environments (CAATE): Phase I Final Report

DTIC Science & Technology

2009-01-01

attitudes, relationships , personality, personal traits, state, social roles, physical context. The initial set of potentially important cultural... relationships that affect culturally situated behavior. For instance, we will want to be able to model interconnections such as familial... relationships , group membership, and attitudes (e.g., trust, dislike). To accomplish this, our design leverages social network modeling technologies provided by

Self-Rerouting and Curative Interconnect Technology (SERCUIT)

DTIC Science & Technology

2017-12-01

microcompounder and a single screw extruder. The volume fraction of conductive filler is designed to provide conductivity comparable to traditional wires in...REPORT ARE NOT TO BE CONSTRUED AS AN OFFICIAL DEPARTMENT OF THE ARMY POSITION UNLESS SO DESIGNATED BY OTHER AUTHORIZED DOCUMENTS. TRADE...7. PERFORMING ORGANIZATION NAME(S) AND ADDRESS(ES) Commander, U.S. Army Research , Development, and Engineering Command ATTN: RDMR-CS

Assessment of Brazil’s Research Literature

DTIC Science & Technology

2007-09-28

Autonomously interconnecting with real-time monitoring • Secure, survivable, self - healing , and adaptable • Resistant to jamming • Homeland and... self - healing platforms • Force Protection • Anti-swimmer technology • Detect and determine threat intent • Non-lethal response Associated CV...Brazilian strengths in chemistry and several industrially oriented R&D domains. We apply text clustering to obtain “ self -organizing tables of

ICTs for TVET. Report of the UNESCO-UNEVOC Online Conference, 14-28 May, 2013

ERIC Educational Resources Information Center

UNESCO-UNEVOC International Centre for Technical and Vocational Education and Training, 2013

2013-01-01

Recent years have seen an explosion in the use of information and communications technologies (ICTs), which have come to play an increasingly important role in multiple aspects of daily lives. There is an unprecedented expansion of the information available online and existing in an ever more interconnected world; however, this change has been so…

The Last Millimeter: Interfacing the New Public Radio Satellite System. Info. Packets No. 14.

ERIC Educational Resources Information Center

Pizzi, Skip

Public radio is about to achieve a new technological level as the new Public Radio Satellite System (PRSS) is deployed. The network will dramatically improve the capacity and quality of its interconnection system, but proper interfacing at member stations will be required to realize the full benefits of the new system. The new system uses digital…

2015 Marine Corps Security Environment Forecast: Futures 2030-2045

DTIC Science & Technology

2015-01-01

The technologies that make the iPhone “smart” were publically funded—the Internet, wireless networks, the global positioning system, microelectronics...Energy Revolution (63 percent);  Internet of Things (ubiquitous sensors embedded in interconnected computing devices) (50 percent);  “Sci-Fi...Neuroscience & artificial intelligence - Sensors /control systems -Power & energy -Human-robot interaction Robots/autonomous systems will become part of the

State University of New York Institute of Technology (SUNYIT) Visiting Scholars Program

DTIC Science & Technology

2013-05-01

team members, and build the necessary backend metal interconnections. APPROVED FOR PUBLIC RELEASE; DISTRIBUTION UNLIMITED 4 Baek-Young Choi...Cooperative and Opportunistic Mobile Cloud for Energy Efficient Positioning; Department of Computer Science Electrical Engineering, University of...Missouri - Kansas City The fast growing popularity of smartphones and tablets enables us the use of various intelligent mobile applications. As many of

Fault Tolerance for VLSI Multicomputers

DTIC Science & Technology

1985-08-01

that consists of hundreds or thousands of VLSI computation nodes interconnected by dedicated links. Some important applications of high-end computers...technology, and intended applications . A proposed fault tolerance scheme combines hardware that performs error detection and system-level protocols for...order to recover from the error and resume correct operation, a valid system state must be restored. A low-overhead, application -transparent error

Advanced Interconnect Roadmap for Space Applications

NASA Technical Reports Server (NTRS)

Galbraith, Lissa

1999-01-01

This paper presents the NASA electronic parts and packaging program for space applications. The topics include: 1) Forecasts; 2) Technology Challenges; 3) Research Directions; 4) Research Directions for Chip on Board (COB); 5) Research Directions for HDPs: Multichip Modules (MCMs); 6) Research Directions for Microelectromechanical systems (MEMS); 7) Research Directions for Photonics; and 8) Research Directions for Materials. This paper is presented in viewgraph form.

Setting the vision: applied patient-reported outcomes and smart, connected digital healthcare systems to improve patient-centered outcomes prediction in critical illness.

PubMed

Wysham, Nicholas G; Abernethy, Amy P; Cox, Christopher E

2014-10-01

Prediction models in critical illness are generally limited to short-term mortality and uncommonly include patient-centered outcomes. Current outcome prediction tools are also insensitive to individual context or evolution in healthcare practice, potentially limiting their value over time. Improved prognostication of patient-centered outcomes in critical illness could enhance decision-making quality in the ICU. Patient-reported outcomes have emerged as precise methodological measures of patient-centered variables and have been successfully employed using diverse platforms and technologies, enhancing the value of research in critical illness survivorship and in direct patient care. The learning health system is an emerging ideal characterized by integration of multiple data sources into a smart and interconnected health information technology infrastructure with the goal of rapidly optimizing patient care. We propose a vision of a smart, interconnected learning health system with integrated electronic patient-reported outcomes to optimize patient-centered care, including critical care outcome prediction. A learning health system infrastructure integrating electronic patient-reported outcomes may aid in the management of critical illness-associated conditions and yield tools to improve prognostication of patient-centered outcomes in critical illness.

Integrated MEMS-tunable VCSELs for reconfigurable optical interconnects

NASA Astrophysics Data System (ADS)

Kögel, Benjamin; Debernardi, Pierluigi; Westbergh, Petter; Gustavsson, Johan S.; Haglund, Åsa; Haglund, Erik; Bengtsson, Jörgen; Larsson, Anders

2012-03-01

A simple and low-cost technology for tunable vertical-cavity surface-emitting lasers (VCSELs) with curved movable micromirror is presented. The micro-electro-mechanical system (MEMS) is integrated with the active optical component (so-called half-VCSEL) by means of surface-micromachining using a reflown photoresist droplet as sacrificial layer. The technology is demonstrated for electrically pumped, short-wavelength (850 nm) tunable VCSELs. Fabricated devices with 10 μm oxide aperture are singlemode with sidemode suppression >35 dB, tunable over 24 nm with output power up to 0.5mW, and have a beam divergence angle <6 °. An improved high-speed design with reduced parasitic capacitance enables direct modulation with 3dB-bandwidths up to 6GHz and error-free data transmission at 5Gbit/s. The modulation response of the MEMS under electrothermal actuation has a bandwidth of 400 Hz corresponding to switching times of about 10ms. The thermal crosstalk between MEMS and half-VCSEL is negligible and not degrading the device performance. With these characteristics the integrated MEMS-tunable VCSELs are basically suitable for use in reconfigurable optical interconnects and ready for test in a prototype system. Schemes for improving output power, tuning speed, and modulation bandwidth are briefly discussed.

Arbitrary-Shaped Graphene-Based Planar Sandwich Supercapacitors on One Substrate with Enhanced Flexibility and Integration.

PubMed

Zheng, Shuanghao; Tang, Xingyan; Wu, Zhong-Shuai; Tan, Yuan-Zhi; Wang, Sen; Sun, Chenglin; Cheng, Hui-Ming; Bao, Xinhe

2017-02-28

The emerging smart power source-unitized electronics represent an utmost innovative paradigm requiring dramatic alteration from materials to device assembly and integration. However, traditional power sources with huge bottlenecks on the design and performance cannot keep pace with the revolutionized progress of shape-confirmable integrated circuits. Here, we demonstrate a versatile printable technology to fabricate arbitrary-shaped, printable graphene-based planar sandwich supercapacitors based on the layer-structured film of electrochemically exfoliated graphene as two electrodes and nanosized graphene oxide (lateral size of 100 nm) as a separator on one substrate. These monolithic planar supercapacitors not only possess arbitrary shapes, e.g., rectangle, hollow-square, "A" letter, "1" and "2" numbers, circle, and junction-wire shape, but also exhibit outstanding performance (∼280 F cm -3 ), excellent flexibility (no capacitance degradation under different bending states), and applicable scalability, which are far beyond those achieved by conventional technologies. More notably, such planar supercapacitors with superior integration can be readily interconnected in parallel and series, without use of metal interconnects and contacts, to modulate the output current and voltage of modular power sources for designable integrated circuits in various shapes and sizes.

Attachment Avoidance Is Significantly Related to Attentional Preference for Infant Faces: Evidence from Eye Movement Data

PubMed Central

Jia, Yuncheng; Cheng, Gang; Zhang, Dajun; Ta, Na; Xia, Mu; Ding, Fangyuan

2017-01-01

Objective: To determine the influence of adult attachment orientations on infant preference. Methods: We adopted eye-tracking technology to monitor childless college women’s eye movements when looking at pairs of faces, including one adult face (man or woman) and one infant face, with three different expressions (happy, sadness, and neutral). The participants (N = 150; 84% Han ethnicity) were aged 18–29 years (M = 19.22, SD = 1.72). A random intercepts multilevel linear regression analysis was used to assess the unique contribution of attachment avoidance, determined using the Experiences in Close Relationships scale, to preference for infant faces. Results: Women with higher attachment avoidance showed less infant preference, as shown by less sustained overt attentional bias to the infant face than the adult face based on fixation time and count. Conclusion: Adult attachment might be related to infant preference according to eye movement indices. Women with higher attachment avoidance may lack attentional preference for infant faces. The findings may aid the treatment and remediation of the interactions between children and mothers with insecure attachment. PMID:28184210

Attachment Avoidance Is Significantly Related to Attentional Preference for Infant Faces: Evidence from Eye Movement Data.

PubMed

Jia, Yuncheng; Cheng, Gang; Zhang, Dajun; Ta, Na; Xia, Mu; Ding, Fangyuan

2017-01-01

Objective: To determine the influence of adult attachment orientations on infant preference. Methods: We adopted eye-tracking technology to monitor childless college women's eye movements when looking at pairs of faces, including one adult face (man or woman) and one infant face, with three different expressions (happy, sadness, and neutral). The participants ( N = 150; 84% Han ethnicity) were aged 18-29 years ( M = 19.22, SD = 1.72). A random intercepts multilevel linear regression analysis was used to assess the unique contribution of attachment avoidance, determined using the Experiences in Close Relationships scale, to preference for infant faces. Results: Women with higher attachment avoidance showed less infant preference, as shown by less sustained overt attentional bias to the infant face than the adult face based on fixation time and count. Conclusion: Adult attachment might be related to infant preference according to eye movement indices. Women with higher attachment avoidance may lack attentional preference for infant faces. The findings may aid the treatment and remediation of the interactions between children and mothers with insecure attachment.

Using sutures to attach miniature tracking tags to small bats for multimonth movement and behavioral studies

Treesearch

Kevin T. Castle; Ted Weller; Paul M. Cryan; Cris D. Hein; Michael R. Schirmacher

2015-01-01

Determining the detailed movements of individual animals often requires them to carry tracking devices, but tracking broad-scale movement of small bats (<30 g) has been limited by transmitter technology and long-term attachment methods. This limitation inhibits our understanding of bat dispersal and migration, particularly in the context of emerging...

Robotic hand and fingers

DOE Office of Scientific and Technical Information (OSTI.GOV)

Salisbury, Curt Michael; Dullea, Kevin J.

Technologies pertaining to a robotic hand are described herein. The robotic hand includes one or more fingers releasably attached to a robotic hand frame. The fingers can abduct and adduct as well as flex and tense. The fingers are releasably attached to the frame by magnets that allow for the fingers to detach from the frame when excess force is applied to the fingers.

The effective photoinduction of Haematococcus pluvialis for accumulating astaxanthin with attached cultivation.

PubMed

Wan, Minxi; Hou, Dongmei; Li, Yuanguang; Fan, Jianhua; Huang, Jianke; Liang, Songtao; Wang, Weiliang; Pan, Ronghua; Wang, Jun; Li, Shulan

2014-07-01

As the optimal source of astaxanthin, Haematococcus pluvialis was cultured for commercial production of astaxanthin through two continuous phases: cell growth and astaxanthin induction. In this study, the efficiency of an attached system for producing astaxanthin from H. pluvialis was investigated and compared to that of the suspended system (bubble column bioreactor) under various conditions. Results showed that this attached system is more suitable for photoinduction of H. pluvialis than the suspended bioreactor. Under the optimal conditions, the astaxanthin productivity of the attached system was 65.8 mg m(-2)d(-1) and 2.4-fold of that in the suspended system. This attached approach also offers other advantages over suspended systems, such as, producing astaxanthin under a wide range of light intensities and temperatures, saving water, ease to harvest cells, resisting contamination. Therefore, the attached approach can be considered an economical, environmentally friendly and highly-efficient technology for producing astaxanthin from H. pluvialis. Copyright © 2014 Elsevier Ltd. All rights reserved.

Topology and evolution of technology innovation networks

NASA Astrophysics Data System (ADS)

Valverde, Sergi; Solé, Ricard V.; Bedau, Mark A.; Packard, Norman

2007-11-01

The web of relations linking technological innovation can be fairly described in terms of patent citations. The resulting patent citation network provides a picture of the large-scale organization of innovations and its time evolution. Here we study the patterns of change of patents registered by the U.S. Patent and Trademark Office. We show that the scaling behavior exhibited by this network is consistent with a preferential attachment mechanism together with a Weibull-shaped aging term. Such an attachment kernel is shared by scientific citation networks, thus indicating a universal type of mechanism linking ideas and designs and their evolution. The implications for evolutionary theory of innovation are discussed.

Active holographic interconnects for interfacing volume storage

NASA Astrophysics Data System (ADS)

Domash, Lawrence H.; Schwartz, Jay R.; Nelson, Arthur R.; Levin, Philip S.

1992-04-01

In order to achieve the promise of terabit/cm3 data storage capacity for volume holographic optical memory, two technological challenges must be met. Satisfactory storage materials must be developed and the input/output architectures able to match their capacity with corresponding data access rates must also be designed. To date the materials problem has received more attention than devices and architectures for access and addressing. Two philosophies of parallel data access to 3-D storage have been discussed. The bit-oriented approach, represented by recent work on two-photon memories, attempts to store bits at local sites within a volume without affecting neighboring bits. High speed acousto-optic or electro- optic scanners together with dynamically focused lenses not presently available would be required. The second philosophy is that volume optical storage is essentially holographic in nature, and that each data write or read is to be distributed throughout the material volume on the basis of angle multiplexing or other schemes consistent with the principles of holography. The requirements for free space optical interconnects for digital computers and fiber optic network switching interfaces are also closely related to this class of devices. Interconnects, beamlet generators, angle multiplexers, scanners, fiber optic switches, and dynamic lenses are all devices which may be implemented by holographic or microdiffractive devices of various kinds, which we shall refer to collectively as holographic interconnect devices. At present, holographic interconnect devices are either fixed holograms or spatial light modulators. Optically or computer generated holograms (submicron resolution, 2-D or 3-D, encoding 1013 bits, nearly 100 diffraction efficiency) can implement sophisticated mathematical design principles, but of course once fabricated they cannot be changed. Spatial light modulators offer high speed programmability but have limited resolution (512 X 512 pixels, encoding about 106 bits of data) and limited diffraction efficiency. For any application, one must choose between high diffractive performance and programmability.

Proteomic approaches in cancer risk and response assessment.

PubMed

Petricoin, Emanuel F; Liotta, Lance A

2004-02-01

Proteomics is more than just a list-generating exercise where increases or decreases in protein expression are identified. Proteomic technologies will ultimately characterize information-flow through the protein circuitry that interconnects the extracellular microenvironment to the serum or plasma macroenvironment through intracellular signaling systems and their control of gene transcription. The nature of this information can be a cause or a consequence of disease processes and how patients respond to therapy. Analysis of human cancer as a model for how proteomics can have an impact at the bedside can take advantage of several promising new proteomic technologies. These technologies are being developed for early detection and risk assessment, therapeutic targeting and patient-tailored therapy.

NASA welding assessment program

NASA Technical Reports Server (NTRS)

Stofel, E. J.

1984-01-01

A long duration test was conducted for comparing various methods of attaching electrical interconnects to solar cells for near Earth orbit spacecraft. Representative solar array modules were thermally cycled for 36,000 cycles between -80 and +80 C. The environmental stress of more than 6 years on a near Earth spacecraft as it cycles in and out of the earth's shadow was simulated. Evaluations of the integrity of these modules were made by visual and by electrical examinations before starting the cycling and then at periodic intervals during the cycling tests. Modules included examples of parallel gap and of ultrasonic welding, as well as soldering. The materials and fabrication processes are state of the art, suitable for forming large solar arrays of spacecraft quality. The modules survived this extensive cycling without detectable degradation in their ability to generate power under sunlight illumination.

Certification of lightning protection for a full-authority digital engine control

NASA Technical Reports Server (NTRS)

Dargi, M.; Rupke, E.; Wiles, K.

1991-01-01

FADEC systems present many challenges to the lightning protection engineer. Verification of the protection-design adequacy for certification purposes presents additional challenges. The basic requirements of the certification plan of a FADEC is to demonstrate compliance with Federal Airworthiness Regulations (FAR) 25.1309 and 25.581. These FARs are intended for transport aircraft, but there are equivalent sections for general aviation aircraft, normal and transport rotorcraft. Military aircraft may have additional requirements. The criteria for demonstration of adequate lightning protection for a FADEC systems include the procedures outlined in FAA Advisory Circular (AC) 20-136, Protection of aircraft electrical/electronic systems against the indirect effects of lightning. As FADEC systems, including the interconnecting wiring, are generally not susceptible to direct attachment of lightning currents, the verification of protection against indirect effects is primarily described.

An optical approach to proximity-operations communications for Space Station Freedom

NASA Technical Reports Server (NTRS)

Marshalek, Robert G.

1991-01-01

An optical communications system is described that supports bi-directional interconnections between Space Station Freedom (SSF) and a host of attached and co-orbiting platforms. These proximity-operations (Prox-Ops) platforms are categorized by their maximum distance from SSF, with several remaining inside 1-km range and several extending out to 37-km and 2000-km ranges in the initial and growth phases, respectively. Two distinct Prox-Ops optical terminals are described. A 1-cm-aperture system is used on the short-range platforms to reduce payload mass, and a 10-cm-aperture system is used on the long-range platforms and on SSF to support the optical link budgets. The system supports up to four simultaneous user links, by assigning wavelengths to the various platforms and by using separate SSF terminals for each link.

A MEMS AlN transducer array with flexible interconnections for use as a cochlear implant

NASA Astrophysics Data System (ADS)

Knisely, Katherine; Zhao, Chuming; Grosh, Karl

2015-12-01

A completely implantable artificial organ of Corti (CIAO) was fabricated using batch MEMS processing techniques. A silicon backbone supports five piezoelectric cantilevers, each of which is designed to have an in vivo resonance corresponding to its tonotopic location in the guinea pig ST (20-40 kHz). An attachable polymer ribbon cable extends 4cm from the probe to an electrode bay, where electrical connections to each cantilever are accessed. The actuation responses of the fabricated devices were measured using laser vibrometry confirming the fluid-loaded resonance conforming to the straight section of the first turn of the guinea pig cochlea. First generation devices have been fabricated and the actuated resonances were measured to range from 80.3-134.2kHz in air and 24.3-41.0 kHz in water.

Simultaneous observations of solar MeV particles in a magnetic cloud and in the earth's northern tail lobe - Implications for the global field line topology of magnetic clouds and for the entry of solar particles into the magnetosphere during cloud passage

NASA Technical Reports Server (NTRS)

Farrugia, C. J.; Richardson, I. G.; Burlaga, L. F.; Lepping, R. P.; Osherovich, V. A.

1993-01-01

Simultaneous ISEE 3 and IMP 8 spacecraft observations of magnetic fields and flow anisotropies of solar energetic protons and electrons during the passage of an interplanetary magnetic cloud show various particle signature differences at the two spacecraft. These differences are interpretable in terms of the magnetic line topology of the cloud, the connectivity of the cloud field lines to the solar surface, and the interconnection between the magnetic fields of the magnetic clouds and of the earth. These observations are consistent with a magnetic cloud model in which these mesoscale configurations are curved magnetic flux ropes attached at both ends to the sun's surface, extending out to 1 AU.

Interconnections Seam Study | Energy Analysis | NREL

Science.gov Websites

Interconnections Seam Study Interconnections Seam Study Through the Interconnections Seam Study between the interconnections. This study will quantify the value of strengthening the connections (or Peer Review - Interconnections Seam Study to learn more. Our Approach To quantify the value of

Reliability of Ceramic Column Grid Array Interconnect Packages Under Extreme Temperatures

NASA Technical Reports Server (NTRS)

Ramesham, Rajeshuni

2011-01-01

A paper describes advanced ceramic column grid array (CCGA) packaging interconnects technology test objects that were subjected to extreme temperature thermal cycles. CCGA interconnect electronic package printed wiring boards (PWBs) of polyimide were assembled, inspected nondestructively, and, subsequently, subjected to ex - treme-temperature thermal cycling to assess reliability for future deep-space, short- and long-term, extreme-temperature missions. The test hardware consisted of two CCGA717 packages with each package divided into four daisy-chained sections, for a total of eight daisy chains to be monitored. The package is 33 33 mm with a 27 27 array of 80%/20% Pb/Sn columns on a 1.27-mm pitch. The change in resistance of the daisy-chained CCGA interconnects was measured as a function of the increasing number of thermal cycles. Several catastrophic failures were observed after 137 extreme-temperature thermal cycles, as per electrical resistance measurements, and then the tests were continued through 1,058 thermal cycles to corroborate and understand the test results. X-ray and optical inspection have been made after thermal cycling. Optical inspections were also conducted on the CCGA vs. thermal cycles. The optical inspections were conclusive; the x-ray images were not. Process qualification and assembly is required to optimize the CCGA assembly, which is very clear from the x-rays. Six daisy chains were open out of seven daisy chains, as per experimental test data reported. The daisy chains are open during the cold cycle, and then recover during the hot cycle, though some of them also opened during the hot thermal cycle..

Chip-to-chip interconnects based on 3D stacking of optoelectrical dies on Si

NASA Astrophysics Data System (ADS)

Duan, P.; Raz, O.; Smalbrugge, B. E.; Duis, J.; Dorren, H. J. S.

2012-01-01

We demonstrate a new approach to increase the optical interconnection bandwidth density by stacking the opto-electrical dies directly on the CMOS driver. The suggested implementation is aiming to provide a wafer scale process which will make the use of wire bonding redundant and will allow for impedance matched metallic wiring between the electronic driving circuit and its opto-electronic counter part. We suggest the use of a thick photoresist ramp between CMOS driver and opto-electrical dies surface as the bridge for supporting co-plannar waveguides (CPW) electrically plated with lithographic accuracy. In this way all three dimensions of the interconnecting metal layer, width, length and thickness can be completely controlled. In this 1st demonstration all processing is done on commercially available devices and products, and is compatible with CMOS processing technology. To test the applicability of CPW instead of wire bonds for interconnecting the CMOS circuit and opto-electronic chips, we have made test samples and tested their performance at speeds up to 10 Gbps. In this demonstration, a silicon substrate was used on which we evaporated gold co-planar waveguides (CPW) to mimic a wire on the driver. An optical link consisting of a VCSEL chip and a photodiode chip has been assembled and fully characterized using optical coupling into and out of a multimode fiber (MMF). A 10 Gb/s 27-1 NRZ PRBS signal transmitted from one chip to another chip was detected error free. A 4 dB receiver sensitivity penalty is measured for the integrated device compared to a commercial link.

Ultrafast dynamics of low-energy electron attachment via a non-valence correlation-bound state

NASA Astrophysics Data System (ADS)

Rogers, Joshua P.; Anstöter, Cate S.; Verlet, Jan R. R.

2018-03-01

The primary electron-attachment process in electron-driven chemistry represents one of the most fundamental chemical transformations with wide-ranging importance in science and technology. However, the mechanistic detail of the seemingly simple reaction of an electron and a neutral molecule to form an anion remains poorly understood, particularly at very low electron energies. Here, time-resolved photoelectron imaging was used to probe the electron-attachment process to a non-polar molecule using time-resolved methods. An initially populated diffuse non-valence state of the anion that is bound by correlation forces evolves coherently in ∼30 fs into a valence state of the anion. The extreme efficiency with which the correlation-bound state serves as a doorway state for low-energy electron attachment explains a number of electron-driven processes, such as anion formation in the interstellar medium and electron attachment to fullerenes.

Instantly switchable adhesion of bridged fibrillar adhesive via gecko-inspired detachment mechanism and its application to a transportation system

NASA Astrophysics Data System (ADS)

Bae, Won-Gyu; Kim, Doogon; Suh, Kahp-Yang

2013-11-01

Inspired by the exceptional climbing ability of gecko lizards, artificial fibrillar adhesives have been extensively studied over the last decade both experimentally and theoretically. Therefore, a new leap towards practical uses beyond the academic horizon is timely and highly anticipated. To this end, we present a fibrillar adhesive in the form of bridged micropillars and its application to a transportation system with the detachment mechanism inspired by the climbing behaviour of gecko lizards. The adhesive shows strong normal attachment (~30 N cm-2) as well as easy and fast detachment within 0.5 s without involving complex dynamic mechanisms or specific stimulus-responsive materials. The fabrication of the bridged micropillars consists of replica moulding of polydimethylsiloxane (PDMS) micropillars, transfer of the PDMS precursor to the heads of the micropillars, and inverse placement on an inert Teflon-coated surface. Owing to the spontaneous interconnections of low viscosity PDMS precursor, bridged micropillars with a uniform capping nanomembrane (~800 nm thickness) are formed over a large area. Interestingly, macroscopic adhesion in the normal direction can be immediately switched between on and off states by changing the two detachment modes of pulling and peeling, respectively. To prove the potential of the fibrillar adhesive for practical use, an automated transportation system is demonstrated for lifting and releasing a mass of stacked glass slides over 1000 cycles of attachment and detachment.Inspired by the exceptional climbing ability of gecko lizards, artificial fibrillar adhesives have been extensively studied over the last decade both experimentally and theoretically. Therefore, a new leap towards practical uses beyond the academic horizon is timely and highly anticipated. To this end, we present a fibrillar adhesive in the form of bridged micropillars and its application to a transportation system with the detachment mechanism inspired by the climbing behaviour of gecko lizards. The adhesive shows strong normal attachment (~30 N cm-2) as well as easy and fast detachment within 0.5 s without involving complex dynamic mechanisms or specific stimulus-responsive materials. The fabrication of the bridged micropillars consists of replica moulding of polydimethylsiloxane (PDMS) micropillars, transfer of the PDMS precursor to the heads of the micropillars, and inverse placement on an inert Teflon-coated surface. Owing to the spontaneous interconnections of low viscosity PDMS precursor, bridged micropillars with a uniform capping nanomembrane (~800 nm thickness) are formed over a large area. Interestingly, macroscopic adhesion in the normal direction can be immediately switched between on and off states by changing the two detachment modes of pulling and peeling, respectively. To prove the potential of the fibrillar adhesive for practical use, an automated transportation system is demonstrated for lifting and releasing a mass of stacked glass slides over 1000 cycles of attachment and detachment. Electronic supplementary information (ESI) available: Photograph of a custom-built adhesion measurement system, video snapshots showing the switchable adhesion via gecko-inspired detachment mechanism, schematic of fabricating a master mould, and a SEM image showing the thickness of the nanomembrane. See DOI: 10.1039/c3nr02008h

Life testing of reflowed and reworked advanced CCGA surface mount packages in harsh thermal environments

NASA Astrophysics Data System (ADS)

Ramesham, Rajeshuni

2013-03-01

Life testing/qualification of reflowed (1st reflow) and reworked (1st reflow, 1st removal, and then 1st rework) advanced ceramic column grid array (CCGA) surface mount interconnect electronic packaging technologies for future flight projects has been studied to enhance the mission assurance of JPL-NASA projects. The reliability of reworked/reflowed surface mount technology (SMT) packages is very important for short-duration and long-duration deep space harsh extreme thermal environmental missions. The life testing of CCGA electronic packages under extreme thermal environments (for example: -185°C to +125°C) has been performed with reference to various JPL/NASA project requirements which encompass the temperature range studied. The test boards of reflowed and reworked CCGA packages (717 Xilinx package, 624, 1152, and 1272 column Actel Packages) were selected for the study to survive three times the total number of expected temperature cycles resulting from all environmental and operational exposures occurring over the life of the flight hardware including all relevant manufacturing, ground operations, and mission phases or cycles to failure to assess the life of the hardware. Qualification/life testing was performed by subjecting test boards to the environmental harsh temperature extremes and assessing any structural failures, mechanical failures or degradation in electrical performance solder-joint failures due to either overstress or thermal cycle fatigue. The large, high density, high input/output (I/O) electronic interconnect SMT packages such as CCGA have increased usage in avionics hardware of NASA projects during the last two decades. The test boards built with CCGA packages are expensive and often require a rework to replace a reflowed, reprogrammed, failed, redesigned, etc., CCGA packages. Theoretically speaking, a good rework process should have similar temperature-time profile as that used for the original manufacturing process of solder reflow. A multiple rework processes may be implemented with CCGA packaging technology to understand the effect of number of reworks on the reliability of this technology for harsh thermal environments. In general, reliability of the assembled electronic packages reduces as a function of number of reworks and the extent is not known yet. A CCGA rework process has been tried and implemented to design a daisy-chain test board consists of 624 and 717 packages. Reworked CCGA interconnect electronic packages of printed wiring polyimide boards have been assembled and inspected using non-destructive x-ray imaging and optical microscope techniques. The assembled boards after 1st rework and 1st reflow were subjected to extreme temperature thermal atmospheric cycling to assess their reliability for future deep space JPL/NASA for moderate to harsh thermal mission environments. The resistance of daisy-chained interconnect sections were monitored continuously during thermal cycling to determine intermittent failures. This paper provides the experimental reliability test results to failure of assemblies for the first time of reflowed and reworked CCGA packages under extreme harsh thermal environments.

Anticipating the Future, Influencing the Present: Assessing the Societal Implications of Emerging Technologies

NASA Astrophysics Data System (ADS)

Michelson, Evan S.

A growing challenge for the American policymaking system is to respond effectively to a wide range of interconnected, complex, long-term science and technology issues. Simultaneously, current approaches and institutions of governance are ill suited to address these multidimensional challenges. As the next generation of innovations in science and technology is arriving at an accelerating rate, the governance system is lagging behind. This realization leads to a vital overarching consideration that steers this study: What approaches are well suited to anticipate the longer-term societal implications of emerging technologies in the 21st Century? This study identifies and examines strategies for anticipating the longer-term societal implications of emerging technologies by way of a qualitative case study. It explores one area of technology (nanotechnology), in one particular governance system (the United States), and with a focus on one high profile non-governmental organization (NGO) involved in addressing a range of nanotechnology's societal and policy implications: the Project on Emerging Nanotechnologies (PEN). Based at the Woodrow Wilson International Center for Scholars, PEN's goal was to ensure "that as nanotechnologies advance, possible risks are minimized, public and consumer engagement remains strong, and the potential benefits of these new technologies are realized." The conceptual framework of anticipatory governance guides the research, which offers a real-world example about how anticipatory governance applies in the nongovernmental sector and shows how this idea links to broader theoretical debates about the policymaking process. The study's main conclusion is that PEN utilized a set of interconnected strategies related to advancing foresight, operating in a boundary-spanning role, and promoting communications and public engagement in its attempt to influence, anticipate, and shape the societal implications of emerging technologies. The findings are informed by evidence from a range of sources, including document analysis, semi-structured interviews, and multiple media analyses. Finally, this study highlights a set of cross-cutting, transferable lessons that can be applied as future emerging technologies arise over time. The intention is that the insights gained from this study can help address these pressing issues as they rapidly unfold.

ECN-14284

NASA Image and Video Library

1980-12-30

A close-up view of the Highly Maneuverable Aircraft Technology (HiMAT) research vehicle attached to a wing pylon on NASA’s B-52 mothership during a 1980 test flight. The HiMAT used sharply swept-back wings and a canard configuration to test possible technology for advanced fighters.

Wolfram technologies as an integrated scalable platform for interactive learning

NASA Astrophysics Data System (ADS)

Kaurov, Vitaliy

2012-02-01

We rely on technology profoundly with the prospect of even greater integration in the future. Well known challenges in education are a technology-inadequate curriculum and many software platforms that are difficult to scale or interconnect. We'll review an integrated technology, much of it free, that addresses these issues for individuals and small schools as well as for universities. Topics include: Mathematica, a programming environment that offers a diverse range of functionality; natural language programming for getting started quickly and accessing data from Wolfram|Alpha; quick and easy construction of interactive courseware and scientific applications; partnering with publishers to create interactive e-textbooks; course assistant apps for mobile platforms; the computable document format (CDF); teacher-student and student-student collaboration on interactive projects and web publishing at the Wolfram Demonstrations site.

Disruptive Technologies in Workmanship: pH-neutral Flux, CDM ESD Events, HDI PCBs

NASA Technical Reports Server (NTRS)

Plante, Jeannette F.

2010-01-01

This slide presentation describes what it calls "disruptive technologies", i.e., "Low-end disruption" occurs when the rate at which products improve exceeds the rate at which customers can adopt the new performance. Therefore, at some point the performance of the product overshoots the needs of certain customer segments. At this point, a disruptive technology may enter the market and provide a product which has lower performance than the incumbent but which exceeds the requirements of certain segments, thereby gaining a foothold in the market. This concept is viewed in impacting incumbent technologies Rosin Flux, with a pH-neutral water soluble Flux; electrostatic discharge models being disrupted by the charge device model (CDM) concept; and High Density Interconnect Printed Circuit Boards (HDI PCB).

Technology for Range Security

DTIC Science & Technology

2005-06-01

friction- generated charge transfer between the inner and outer portions of a cable attached to the fence ( triboelectric ), by means of a charge transfer...helpful technical reviews of Paul Loechl, ERDC- CERL, and Joyce Nagle, ERDC-CRREL. This report was prepared under the general supervision of Dr...detection systems (IDSs) are designed to generate alarms when they sense human activity. IDSs attached to a fence (fence-mounted) respond to fence

Predicting the behavior of techno-social systems.

PubMed

Vespignani, Alessandro

2009-07-24

We live in an increasingly interconnected world of techno-social systems, in which infrastructures composed of different technological layers are interoperating within the social component that drives their use and development. Examples are provided by the Internet, the World Wide Web, WiFi communication technologies, and transportation and mobility infrastructures. The multiscale nature and complexity of these networks are crucial features in understanding and managing the networks. The accessibility of new data and the advances in the theory and modeling of complex networks are providing an integrated framework that brings us closer to achieving true predictive power of the behavior of techno-social systems.

Principles of designing cyber-physical system of producing mechanical assembly components at Industry 4.0 enterprise

NASA Astrophysics Data System (ADS)

Gurjanov, A. V.; Zakoldaev, D. A.; Shukalov, A. V.; Zharinov, I. O.

2018-03-01

The task of developing principles of cyber-physical system constitution at the Industry 4.0 company of the item designing components of mechanical assembly production is being studied. The task has been solved by analyzing the components and technologies, which have some practical application in the digital production organization. The list of components has been defined and the authors proposed the scheme of the components and technologies interconnection in the Industry 4.0 of mechanical assembly production to make an uninterrupted manufacturing route of the item designing components with application of some cyber-physical systems.