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Sample records for au-sn solder joints

  1. Microstructural evolution of eutectic Au-Sn solder joints

    SciTech Connect

    Song, Ho Geon

    2002-05-31

    Current trends toward miniaturization and the use of lead(Pb)-free solder in electronic packaging present new problems in the reliability of solder joints. This study was performed in order to understand the microstructure and microstructural evolution of small volumes of nominally eutectic Au-Sn solder joints (80Au-20Sn by weight), which gives insight into properties and reliability.

  2. Microstructural evolution of eutectic gold-tin solder joints

    NASA Astrophysics Data System (ADS)

    Song, Ho Geon

    Current trends toward miniaturization and the use of lead (Pb)-free solders in electronic packaging present new problems in the reliability of solder joints. This study was performed in order to understand the microstructure and microstructural evolution of small volumes of nominally eutectic Au-Sn solder joints (80Au-20Sn by weight), which gives insight into properties and reliability. The study particularly concentrated on the effects that the joint size and the type of substrate metallization have on both the bulk and interface microstructures of the joints. The systems studied were eutectic Au-Sn on Cu and Cu/electroless Ni/Au and for each system, two sets of sample geometries were used. Eutectic Au-Sn solder joints on Cu have microstructures that are very coarse on the scale of the joint, where the microstructure is strongly affected by the amount of Cu dissolution during reflow process. During aging, steady diffusion of Cu leads to the growth of Cu-rich interfacial intermetallic layers, significant consumption of substrate Cu, and formation of Kirkendall pores along the interface. Thermal cycling of the joints caused decomposition of the thick zeta(Cu)-phase into a fine-grained multiphase microstructure. The microstructures of eutectic Au-Sn solder joints on Cu/electroless Ni/Au are also very coarse due to the dissolution of Au used as a protective layer during soldering. Electroless Ni is shown to effectively act as a diffusion barrier for Cu. The electroless Ni near the interface evolves into a complicated structure due to the interfacial reaction. The solubility characteristics and diffusional behavior of substrate metals into eutectic Au-Sn solder determines the detailed microstructure and microstructural evolution of the ultrafine eutectic Au-Sn joints. Two important things to be noted from the results are as follows: First, the overall microstructures of these joints are very coarse with respect to the size of joint, and hence the properties of the

  3. Effect of the Silver Content of SnAgCu Solder on the Interfacial Reaction and on the Reliability of Angle Joints Fabricated by Laser-Jet Soldering

    NASA Astrophysics Data System (ADS)

    Ji, Hongjun; Ma, Yuyou; Li, Mingyu; Wang, Chunqing

    2015-02-01

    The silver content of lead-free solders affects their microstructure, the interfacial reaction, and the performance of the joints in reliability tests. In this study, Sn3.0Ag0.5Cu (wt.%, SAC305) and Sn1.0Ag0.5Cu (wt.%, SAC105) solder balls of diameter 55 μm were reflowed on gold surface pads by laser-jet soldering. It was found that four types of layered intermetallic compound (IMC) were formed at the interfaces; these were Au5Sn/AuSn, AuSn, AuSn2, and AuSn4 from the pad side to the solder matrix. The Au5Sn/AuSn eutectic region, thickness 400 nm, formed because of the high cooling rate induced by the laser-jet soldering. During high-temperature storage tests, the silver became segregated at the interfaces between the Au-Sn IMC and the solder matrix, resulting in inhibition of IMC growth in SAC305 joints, the shear strengths of which were higher than those of SAC105 joints. In mechanical drop tests, however, percentage failure of the SAC305 joints was twice that of the SAC105 joints.

  4. Thermal and strain characteristics of high-power 940 nm laser arrays mounted with AuSn and In solders

    NASA Astrophysics Data System (ADS)

    Hostetler, John L.; Jiang, Ching-Long; Negoita, Viorel; Vethake, Thilo; Roff, Robert; Shroff, Ashutosh; Li, Ting; Miester, Carl; Bonna, Ulrich; Charache, Greg; Schlüter, Holger; Dorsch, Friedhelm

    2007-02-01

    As diode pumped solid state lasers gain more market share, the performance, stability and lifetime of the diode pump source faces unprecedented scrutiny. Lifetimes of diode pumps in excess of 35,000 hrs are sought with no intervention or maintenance from the end user. One lifetime and power limiting phenomena for arrays is that of solder creep typical with traditional mounting using soft solders such as Indium. Harder solders such as Gold/Tin on Copper-Tungsten submounts provide a more robust and stable mounting system for long term high power pump sources. Furthermore, beam multiplexing of laser bars require tight wavelength and polarization purity which are affected by mounting induced strain. In this investigation, high power 940 nm laser bars, operating in the 100 to 200 W power range, were mounted using AuSn/CuW and In soldering schemes. The differences in thermal and strain characteristics are investigated through the examination of the emitter wavelength, nearfield measurements, polarization and smile. The measurements are correlated with finite element modeling to predict the 3-dimensional thermal distributions within the laser bars.

  5. Compound solder joints

    NASA Technical Reports Server (NTRS)

    Batista, R. I.; Simonson, R. B.

    1976-01-01

    Joining technique prevents contamination, may be used to join dissimilar metal tubes, minimizes fluid and gas entrapment, expedites repairs, and can yield joints having leakage rates less than 0.000001 standard cubic cm He/min. Components of joint are solder sleeve, two solder rings, Teflon sleeve, and tubing to be joined.

  6. Stress-relieved solder joints

    NASA Technical Reports Server (NTRS)

    Zemenick, C. J.

    1980-01-01

    Mechanical stress on solder joints is reduced by procedure for soldering electronic components to circuit boards. Procedure was developed for radio-frequency (RF) strip-line circuits, for which dimensions must be carefully controlled to minimize parasitic capacitance and inductance. Procedure consists of loosening component from its mounting after each lead is soldered relieving induced stresses before next soldering step.

  7. Solder Joint Health Monitoring Testbed

    NASA Technical Reports Server (NTRS)

    Delaney, Michael M.; Flynn, James G.; Browder, Mark E.

    2009-01-01

    A method of monitoring the health of selected solder joints, called SJ-BIST, has been developed by Ridgetop Group Inc. under a Small Business Innovative Research (SBIR) contract. The primary goal of this research program is to test and validate this method in a flight environment using realistically seeded faults in selected solder joints. An additional objective is to gather environmental data for future development of physics-based and data-driven prognostics algorithms. A test board is being designed using a Xilinx FPGA. These boards will be tested both in flight and on the ground using a shaker table and an altitude chamber.

  8. The failure analysis and lifetime prediction for the solder joint of the magnetic head

    NASA Astrophysics Data System (ADS)

    Xiao, Xianghui; Peng, Minfang; Cardoso, Jaime S.; Tang, Rongjun; Zhou, YingLiang

    2015-02-01

    Micro-solder joint (MSJ) lifetime prediction methodology and failure analysis (FA) are to assess reliability by fatigue model with a series of theoretical calculations, numerical simulation and experimental method. Due to shortened time of solder joints on high-temperature, high-frequency sampling error that is not allowed in productions may exist in various models, including round-off error. Combining intermetallic compound (IMC) growth theory and the FA technology for the magnetic head in actual production, this thesis puts forward a new growth model to predict life expectancy for solder joint of the magnetic head. And the impact of IMC, generating from interface reaction between slider (magnetic head, usually be called slider) and bonding pad, on mechanical performance during aging process is analyzed in it. By further researching on FA of solder ball bonding, thesis chooses AuSn4 growth model that affects least to solder joint mechanical property to indicate that the IMC methodology is suitable to forecast the solder lifetime. And the diffusion constant under work condition 60 °C is 0.015354; the solder lifetime t is 14.46 years.

  9. Intermetallic Layers in Soldered Joints

    1998-12-10

    ILAG solves the one-dimensional partial differential equations describing the multiphase, multicomponent, solid-state diffusion-controlled growth of intermetallic layers in soldered joints. This software provides an analysis capability for materials researchers to examine intermetallic growth mechanisms in a wide variety of defense and commercial applications involving both traditional and advanced materials. ILAG calculates the interface positions of the layers, as well as the spatial distribution of constituent mass fractions, and outputs the results at user-prescribed simulation times.

  10. Computer simulation of solder joint failure

    SciTech Connect

    Burchett, S.N.; Frear, D.R.; Rashid, M.M.

    1997-04-01

    The thermomechanical fatigue failure of solder joints is increasingly becoming an important reliability issue for electronic packages. The purpose of this Laboratory Directed Research and Development (LDRD) project was to develop computational tools for simulating the behavior of solder joints under strain and temperature cycling, taking into account the microstructural heterogeneities that exist in as-solidified near eutectic Sn-Pb joints, as well as subsequent microstructural evolution. The authors present two computational constitutive models, a two-phase model and a single-phase model, that were developed to predict the behavior of near eutectic Sn-Pb solder joints under fatigue conditions. Unique metallurgical tests provide the fundamental input for the constitutive relations. The two-phase model mathematically predicts the heterogeneous coarsening behavior of near eutectic Sn-Pb solder. The finite element simulations with this model agree qualitatively with experimental thermomechanical fatigue tests. The simulations show that the presence of an initial heterogeneity in the solder microstructure could significantly degrade the fatigue lifetime. The single-phase model was developed to predict solder joint behavior using materials data for constitutive relation constants that could be determined through straightforward metallurgical experiments. Special thermomechanical fatigue tests were developed to give fundamental materials input to the models, and an in situ SEM thermomechanical fatigue test system was developed to characterize microstructural evolution and the mechanical behavior of solder joints during the test. A shear/torsion test sample was developed to impose strain in two different orientations. Materials constants were derived from these tests. The simulation results from the two-phase model showed good fit to the experimental test results.

  11. Solder Joint Health Monitoring Testbed System

    NASA Technical Reports Server (NTRS)

    Delaney, Michael M.

    2009-01-01

    The density and pin count for Field Programmable Gate Arrays (FPGAs) has been increasing, and has exceeded current methods of solder joint inspection, making early detection of failures more problematic. These failures are a concern for both flight safety and maintenance in commercial aviation. Ridgetop Group, Inc. has developed a method for detecting solder joint failures in real time. The NASA Dryden Flight Research Center is developing a set of boards to test this method in ground environmental and accelerated testing as well as flight test on a Dryden F-15 or F-18 research aircraft. In addition to detecting intermittent and total solder joint failures, environmental data on the boards, such as temperature and vibration, will be collected and time-correlated to aircraft state data. This paper details the technical approach involved in the detection process, and describes the design process and products to date for Dryden s FPGA failure detection boards.

  12. Testing of printed circuit board solder joints by optical correlation

    NASA Technical Reports Server (NTRS)

    Espy, P. N.

    1975-01-01

    An optical correlation technique for the nondestructive evaluation of printed circuit board solder joints was evaluated. Reliable indications of induced stress levels in solder joint lead wires are achievable. Definite relations between the inherent strength of a solder joint, with its associated ability to survive stress, are demonstrable.

  13. Effect of Solder Joint Length on Fracture Under Bending

    NASA Astrophysics Data System (ADS)

    Akbari, Saeed; Nourani, Amir; Spelt, Jan K.

    2016-01-01

    Fracture tests were conducted on copper-solder-copper joints of various lengths using double-cantilever-beam (DCB) specimens under mode I loading conditions. The thickness and length of the solder joints were large enough to neglect any anisotropy associated with the solder microstructure. It was found that the critical strain energy release rate at crack initiation, G ci, was insensitive to the length of the solder joint; however, for joints shorter than a characteristic length which was a function of the thickness and the mechanical properties of the solder layer and the substrates, the fracture load increased with increasing solder joint length. A sandwich model was developed for the analysis of the stress and strain in solder joints, taking into account the influence of both the bending deformation and the shear deformation of the substrates on the solder joint stresses. Consistent with the experimental results, it was found that solder joints longer than the characteristic length have a maximum peel stress that remains unchanged with joint length, causing the joint strength to become independent of the joint length. A closed-form analytical solution was developed for the characteristic length of DCB specimens under mode I loading. The experimental results were in good agreement with the analytical model and with finite element results. The generality of the G ci failure criterion was demonstrated by comparing the experimental results and the fracture load predictions of mode I DCB solder joints with different lengths.

  14. Automatic computer-aided system of simulating solder joint formation

    NASA Astrophysics Data System (ADS)

    Zhao, Xiujuan; Wang, Chunqing; Zheng, Guanqun; Wang, Gouzhong; Yang, Shiqin

    1999-08-01

    One critical aspect in electronic packaging is the fatigue/creep-induced failure in solder interconnections, which is found to be highly dependent on the shape of solder joints. Thus predicting and analyzing the solder joint shape is warranted. In this paper, an automatic computer-aided system is developed to simulate the formation of solder joint and analyze the influence of the different process parameters on the solder joint shape. The developed system is capable of visually designing the process parameters and calculating the solder joint shape automatically without any intervention from the user. The automation achieved will enable fast shape estimation with the variation of process parameters without time consuming experiments, and the simulating system provides the design and manufacturing engineers an efficient software tools to design soldering process in design environment. Moreover, a program developed from the system can serve as the preprocessor for subsequent finite element joint analysis program.

  15. Shaping Transistor Leads for Better Solder Joints

    NASA Technical Reports Server (NTRS)

    Mandel, H.; Dillon, J. D.

    1982-01-01

    Special lead-forming tool puts step in leads of microwave power transistors without damaging braze joints that fasten leads to package. Stepped leads are soldered to circuit boards more reliably than straight leads, and stress on brazes is relieved. Lead-forming hand-tool has two parts: a forming die and an actuator. Spring-loaded saddle is adjusted so that when transistor package is placed on it, leads rest on forming rails.

  16. The effect of intermetallic compound evolution on the fracture behavior of Au stud bumps joined with Sn-3.5Ag solder

    NASA Astrophysics Data System (ADS)

    Lee, Young-Kyu; Ko, Yong-Ho; Kim, Jun-Ki; Lee, Chang-Woo; Yoo, Sehoon

    2013-01-01

    The microstructure and joint properties of Au stud bumps joined with Sn-3.5Ag solder were investigated as functions of flip chip bonding temperature and aging time. Au stud bumps were bonded on solder-onpad (SOP) at bonding temperature of 260°C and 300°C for 10 s, respectively. Aging treatment was carried out at 150°C for 100 h, 300 h, and 500 h, respectively. After flip chip bonding, intermetallic compounds (IMCs) of AuSn, AuSn2, and AuSn4 were formed at the interface between the Au stud bump and Sn-3.5Ag solder. At a bonding temperature of 300°C, AuSn2 IMC clusters, which were surrounded by AuSn4 IMCs, were observed in the Sn-3.5Ag solder bump. After flip chip bonding, bonding strength was approximately 220.5mN/bump. As aging time increased, the bonding strength decreased. After 100 h of aging treatment, the bonding strength of the joint bonded at 300°C was lower than that bonded at 260°C due to the fast growth rate of the AuSn2 IMCs. The main failure modes were interface fractures between the AuSn2 IMCs and AuSn4 IMCs, fractures through the AuSn2 IMCs and pad lift. Initial joint microstructures after flip chip bonding strongly affected the bonding strengths of aged samples.

  17. Anomalous creep in Sn-rich solder joints

    SciTech Connect

    Song, Ho Geon; Morris Jr., John W.; Hua, Fay

    2002-03-15

    This paper discusses the creep behavior of example Sn-rich solders that have become candidates for use in Pb-free solder joints. The specific solders discussed are Sn-3.5Ag, Sn-3Ag-0.5Cu, Sn-0.7Cu and Sn-10In-3.1Ag, used in thin joints between Cu and Ni-Au metallized pads.

  18. Sn-Ag-Cu Nanosolders: Solder Joints Integrity and Strength

    NASA Astrophysics Data System (ADS)

    Roshanghias, Ali; Khatibi, Golta; Yakymovych, Andriy; Bernardi, Johannes; Ipser, Herbert

    2016-08-01

    Although considerable research has been dedicated to the synthesis and characterization of lead-free nanoparticle solder alloys, only very little has been reported on the reliability of the respective joints. In fact, the merit of nanoparticle solders with depressed melting temperatures close to the Sn-Pb eutectic temperature has always been challenged when compared with conventional solder joints, especially in terms of inferior solderability due to the oxide shell commonly present on the nanoparticles, as well as due to compatibility problems with common fluxing agents. Correspondingly, in the current study, Sn-Ag-Cu (SAC) nanoparticle alloys were combined with a proper fluxing vehicle to produce prototype nanosolder pastes. The reliability of the solder joints was successively investigated by means of electron microscopy and mechanical tests. As a result, the optimized condition for employing nanoparticles as a competent nanopaste and a novel procedure for surface treatment of the SAC nanoparticles to diminish the oxide shell prior to soldering are being proposed.

  19. Microstructural evolution during the thermomechanical fatigue of solder joints

    SciTech Connect

    Frear, D R

    1991-01-01

    Solder joints in electronic packages are electrical interconnections that also function as mechanical bonds. The solder often constrains materials of different coefficients of thermal expansion that, when thermal fluctuations are encountered, causes the solder joint to experience cyclical deformation. Due to the catastrophic consequences of electrical or mechanical failure of solder joints, a great deal of work has been performed to develop a better understanding of the metallurgical response of solder joints subjected to thermomechanical fatigue. This work reviews the microstructural and mechanical evolution that occurs in solder joints during thermomechanical fatigue. The eutectic Sn-Pb solder alloy is highlighted. Unlike most materials that experience thermomechanical fatigue, solder is commonly used at temperatures of up to nine-tenths of its melting point. Therefore extensive creep, solid state diffusion, recrystallization and grain growth occur in this alloy resulting in the evolution of a heterogeneous coarsened band through which failure eventually takes place. Two other solder alloys are compared with the Sn-Pb eutectic, a Pb-rich Sn-Pb alloy and a ternary near eutectic (40In-40Sn-20Pb, all alloys are given in wt. %). The Pb-rich alloy is a precipitated single phase matrix that does not evolve during thermomechanical fatigue and subsequently has a shorter lifetime. Conversely, the 40In-40Sn-20Pb solder is a two phase eutectic in which the microstructures refines during thermomechanical fatigue giving it a longer lifetime than the eutectic Sn-Pb solder. The microstructural processes that occur during thermomechanical fatigue and final fracture behavior are discussed for the three solder alloys. 47 refs., 14 figs.

  20. Microstructural Evolution of Lead-Free Solder Joints in Ultrasonic-Assisted Soldering

    NASA Astrophysics Data System (ADS)

    Ji, Hongjun; Wang, Qiang; Li, Mingyu

    2016-01-01

    Solder joint reliability greatly depends on the microstructure of the solder matrix and the morphology of intermetallic compounds (IMCs) in the joints. Addition of strengthening phases such as carbon nanotubes and ceramic particles to solder joints to improve their properties has been widely studied. In this work, ultrasonic vibration (USV) of casting ingots was applied to considerably improve their microstructure and properties, and the resulting influence on fluxless soldering of Cu/Sn-3.0Ag-0.5Cu/Cu joints and their microstructural evolution was investigated. It was demonstrated that USV application during reflow of Sn-based solder had favorable effects on β-Sn grain size refinement as well as the growth and distribution of various IMC phases within the joints. The β-Sn grain size was significantly refined as the ultrasound power was increased, with a reduction of almost 90% from more than 100 μm to below 10 μm. Long and large Cu6Sn5 tubes in the solder matrix of the joints were broken into tiny ones. Needle-shaped Ag3Sn was transformed into flake-shaped. These IMCs were mainly precipitated along β-Sn phase boundaries. High-temperature storage tests indicated that the growth rate of interfacial IMCs in joints formed with USV was slower than in conventional reflow joints. The mechanisms of grain refinement and IMC fragmentation are discussed and related to the ultrasonic effects.

  1. Fatigue and thermal fatigue of Pb-Sn solder joints

    SciTech Connect

    Frear, D.; Grivas, D.; McCormack, M.; Tribula, D.; Morris, J.W. Jr.

    1987-01-01

    This paper presents a fundamental investigation of the fatigue and thermal fatigue characteristics, with an emphasis on the microstructural development during fatigue, of Sn-Pb solder joints. Fatigue tests were performed in simple shear on both 60Sn-40Pb and 5Sn-95Pb solder joints. Isothermal fatigue tests show increasing fatigue life of 60Sn-40Pb solder joints with decreasing strain and temperature. In contrast, such behavior was not observed in the isothermal fatigue of 5Sn-95Pb solder joints. Thermal fatigue results on 60Sn-40Pb solder cycled between -55/sup 0/C and 125/sup 0/C show that a coarsened region develops in the center of the joint. Both Pb-rich and Sn-rich phases coarsen, and cracks form within these coarsened regions. The failure mode 60Sn-40Pb solder joints in thermal and isothermal fatigue is similar: cracks form intergranularly through the Sn-rich phase or along Sn/Pb interphase boundaries. Extensive cracking is found throughout the 5Sn-95Pb joint for both thermal and isothermal fatigue. In thermal fatigue the 5Sn-95Pb solder joints failed after fewer cycles than 60Sn-40Pb.

  2. Simulation of thermomechanical fatigue in solder joints

    SciTech Connect

    Fang, H.E.; Porter, V.L.; Fye, R.M.; Holm, E.A.

    1997-12-31

    Thermomechanical fatigue (TMF) is a very complex phenomenon in electronic component systems and has been identified as one prominent degradation mechanism for surface mount solder joints in the stockpile. In order to precisely predict the TMF-related effects on the reliability of electronic components in weapons, a multi-level simulation methodology is being developed at Sandia National Laboratories. This methodology links simulation codes of continuum mechanics (JAS3D), microstructural mechanics (GLAD), and microstructural evolution (PARGRAIN) to treat the disparate length scales that exist between the macroscopic response of the component and the microstructural changes occurring in its constituent materials. JAS3D is used to predict strain/temperature distributions in the component due to environmental variable fluctuations. GLAD identifies damage initiation and accumulation in detail based on the spatial information provided by JAS3D. PARGRAIN simulates the changes of material microstructure, such as the heterogeneous coarsening in Sn-Pb solder, when the component`s service environment varies.

  3. Investigation of gold embrittlement in connector solder joints

    NASA Technical Reports Server (NTRS)

    Lane, F. L.

    1972-01-01

    An investigation was performed to determine to what extent typical flight connector solder joints may be embrittled by the presence of gold. In addition to mapping of gold content in connector solder joints by an electron microprobe analyzer, metallographic examinations and mechanical tests (thermal shock, vibration, impact and tensile strength) were also conducted. A description of the specimens and tests, a discussion of the data, and some conclusions are presented.

  4. Characterization of Solder Joint Reliability Using Cyclic Mechanical Fatigue Testing

    NASA Astrophysics Data System (ADS)

    Kim, Choong-Un; Bang, Woong-Ho; Xu, Huili; Lee, Tae-Kyu

    2013-10-01

    This article summarizes the mechanics of two mechanical fatigue methods, cyclic bending fatigue and shear fatigue, in inducing failure in solder joints in package assemblies, and it presents the characteristics of fatigue failures resulting from these methods using example cases of Sn-Pb eutectic and Sn-rich Pb-free solder alloys. Numerical simulation suggests that both testing configurations induce fatigue failure by the crack-opening mode. In the case of bending fatigue, the strain induced by the bending displacement is found to be sensitive to chip geometry, and it induces fatigue cracks mainly at the solder matrix adjacent to the printed circuit board interface. In case of shear fatigue, the failure location is firmly fixed at the solder neck, created by solder mask, where an abrupt change in the solder geometry occurs. Both methods conclude that the Coffin-Manson model is the most appropriate model for the isothermal mechanical fatigue of solder alloys. An analysis of fatigue characteristics using the frame of the Coffin-Manson model produces several insightful results, such as the reason why Pb-free alloys show higher fatigue resistance than Sn-Pb alloys even if they are generally more brittle. Our analysis suggests that it is related to higher work hardening. All these results indicate that mechanical fatigue can be an extremely useful method for fast screening of defective package structures and also in gaining a better understanding of fatigue failure mechanism and prediction of reliability in solder joints.

  5. Embrittlement of surface mount solder joints by hot solder-dipped, gold-plated leads

    SciTech Connect

    Vianco, P.T.

    1993-07-01

    The detachment of beam-leaded transistors from several surface mount circuit boards following modest thermal cycling was examined. Microstructural analysis of the package leads and bonding pads from the failed units indicated that gold embrittlement was responsible for a loss of solder joint mechanical integrity that caused detachment of transistors from the circuit boards. An analysis of the hot dipping process used to remove gold from the leads prior to assembly demonstrated that the gold, although dissolved from the lead, remained in the nearby solder and was subsequently retained in the coating formed on the lead upon withdrawal from the bath. This scenario allowed gold to enter the circuit board solder joints. It was hypothesized, and later confirmed by experimental trials, that increasing the number of dips prevented gold from entering the solder coatings.

  6. Sn-Ag-Cu solders and solder joints: Alloy development, microstructure, and properties

    NASA Astrophysics Data System (ADS)

    Anderson, I. E.; Cook, B. A.; Harringa, J. L.; Terpstra, R. L.

    2002-06-01

    Slow cooling of Sn-Ag-Cu and Sn-Ag-Cu-X (X = Fe, Co) solder-joint specimens made by hand soldering simulated reflow in surface-mount assembly to achieve similar as-solidified joint microstructures for realistic shearstrength testing, using Sn-3.5Ag (wt.%) as a baseline. Minor substitutions of either cobalt or iron for copper in Sn-3.7Ag-0.9Cu refined the joint matrix microstructure, modified the Cu6Sn5 intermetallic phase at the copper substrate/solder interface, and increased the shear strength. At elevated (150°C) temperature, no significant difference in shear strength was found in all of the alloys studied. Ambient temperature shear strength was reduced by largescale tin dendrites in the joint microstructure, especially by the coarse dendrites in solute poor Sn-Ag-Cu.

  7. Creep properties of Pb-free solder joints

    SciTech Connect

    Song, H.G.; Morris Jr., J.W.; Hua, F.

    2002-04-01

    Describes the creep behavior of three Sn-rich solders that have become candidates for use in Pb-free solder joints: Sn-3.5Ag, Sn-3Ag-0.5Cu and Sn-0.7Cu. The three solders show the same general behavior when tested in thin joints between Cu and Ni/Au metallized pads at temperatures between 60 and 130 C. Their steady-state creep rates are separated into two regimes with different stress exponents(n). The low-stress exponents range from {approx}3-6, while the high-stress exponents are anomalously high (7-12). Strikingly, the high-stress exponent has a strong temperature dependence near room temperature, increasing significantly as the temperature drops from 95 to 60 C. The anomalous creep behavior of the solders appears to be due to the dominant Sn constituent. Joints of pure Sn have stress exponents, n, that change with stress and temperature almost exactly like those of the Sn-rich solder joints. Research on creep in bulk samples of pure Sn suggests that the anomalous temperature dependence of the stress exponent may show a change in the dominant mechanism of creep. Whatever its source, it has the consequence that conventional constitutive relations for steady-state creep must be used with caution in treating Sn-rich solder joints, and qualification tests that are intended to verify performance should be carefully designed.

  8. Solder joint reliability in alternator power diode assemblies

    SciTech Connect

    Pan, T.Y.; White, S.C.; Lutz, E.L.; Blair, H.D.; Nicholson, J.M.

    1999-11-01

    Power diodes in an alternator convert alternating current, generated by the spinning magnetic field, to direct current to be used by the battery and all the automotive electrical/electronic components. The diodes are press-fit into aluminum heatsinks to quickly and efficiently dissipate the heat from the silicon dies in the diode body. The diodes are soldered to a rectifier circuit board through the diode leads by a wave soldering process using a Pb-free, eutectic Sn-3.5Ag solder. A set of positive diodes reside on a different substrate than the set of negative diodes, resulting in differences in the lengths of the diode leads. The distance from the diode body to the solder joint on the leads of the positive diodes is 7 mm less than those of the negative diodes. Solderability, cross-section micrographs, and thermal-cycling fatigue reliability studies were compared between the positive and negative diodes and between diode designs from different suppliers. Wetting balance testing showed significant differences in solderability between positive and negative diodes and between the two different diode designs. Combining the diode body and lead together had a more drastic effect on the solderability than the lead alone. It was discovered that, although the nature of the diode design is to dissipate the heat away from the diode quickly and efficiently, there is a large temperature gradient along the lead immediately above the solder bath which can be as much as 100 C just 2 mm from the bath. This large temperature gradient caused some leads to be too cold to form good solder fillets. The solder fillets obtained in the laboratory wetting tests matched those observed in the actual alternators. The inadequate solder fillets resulted in a 250% difference in the thermal cycling fatigue reliability between the two diode designs.

  9. Inconsistencies in the Understanding of Solder Joint Reliability Physics

    NASA Technical Reports Server (NTRS)

    Wen, L.; Mon, G. R.; Ross, R. G., Jr.

    1997-01-01

    Over the years, many analytical and experimental research studies have aimed to improve the state-of-the-art assessment of solder joint integrity from a physics-of-failure perspective. Although much progress has been made, there still exist many inconsistent and even contradictory correlations and conclusions. Before discussing some of the prominent inconsistencies found in the literature, this paper reviews the fundamental physics underlying the nature of solder failure...Using the complex constitutive properties of solder, fundamental mechanical and thermomechanical proccesses can be modeled to demonstrate some of the inconsistencies in the literature.

  10. Coarsening of the Sn-Pb Solder Microstructure in Constitutive Model-Based Predictions of Solder Joint Thermal Mechanical Fatigue

    SciTech Connect

    Vianco, P.T.; Burchett, S.N.; Neilsen, M.K.; Rejent, J.A.; Frear, D.R.

    1999-04-12

    Thermal mechanical fatigue (TMF) is an important damage mechanism for solder joints exposed to cyclic temperature environments. Predicting the service reliability of solder joints exposed to such conditions requires two knowledge bases: first, the extent of fatigue damage incurred by the solder microstructure leading up to fatigue crack initiation, must be quantified in both time and space domains. Secondly, fatigue crack initiation and growth must be predicted since this metric determines, explicitly, the loss of solder joint functionality as it pertains to its mechanical fastening as well as electrical continuity roles. This paper will describe recent progress in a research effort to establish a microstructurally-based, constitutive model that predicts TMF deformation to 63Sn-37Pb solder in electronic solder joints up to the crack initiation step. The model is implemented using a finite element setting; therefore, the effects of both global and local thermal expansion mismatch conditions in the joint that would arise from temperature cycling.

  11. Corrosion Issues in Solder Joint Design and Service

    SciTech Connect

    VIANCO,PAUL T.

    1999-11-24

    Corrosion is an important consideration in the design of a solder joint. It must be addressed with respect to the service environment or, as in the case of soldered conduit, as the nature of the medium being transported within piping or tubing. Galvanic-assisted corrosion is of particular concern, given the fact that solder joints are comprised of different metals or alloy compositions that are in contact with one-another. The (thermodynamic) potential for corrosion to take place in a particular environment requires the availability of the galvanic series for those conditions and which includes the metals or alloys in question. However, the corrosion kinetics, which actually determine the rate of material loss under the specified service conditions, are only available through laboratory evaluations or field data that are found in the existing literature or must be obtained by in-house testing.

  12. Aqueous cleaning of flux residue from solder joints. Final report

    SciTech Connect

    Krska, C.M.

    1992-08-01

    Solder joints have traditionally been cleaned using chlorinated or fluorinated solvents. This study addressed alternate processing. One process involved using a saponifier/water solution to remove rosin flux residues; the other process involved using a water-soluble flux and water to remove the residues. Although both processes were satisfactory, the water-soluble flux with water cleaning proved to be the best.

  13. Aqueous cleaning of flux residue from solder joints

    SciTech Connect

    Krska, C.M.

    1992-08-01

    Solder joints have traditionally been cleaned using chlorinated or fluorinated solvents. This study addressed alternate processing. One process involved using a saponifier/water solution to remove rosin flux residues; the other process involved using a water-soluble flux and water to remove the residues. Although both processes were satisfactory, the water-soluble flux with water cleaning proved to be the best.

  14. Porosity in collapsible Ball Grid Array solder joints

    SciTech Connect

    Gonzalez, C.A. |

    1998-05-01

    Ball Grid Array (BGA) technology has taken off in recent years due to the increased need for high interconnect density. Opposite to all the advantages BGA packages offer, porosity in collapsible BGA solder joints is often a major concern in the reliability of such packages. The effect of pores on the strength of collapsible BGA solder-joints was studied by manufacturing samples with different degrees of porosity and testing them under a shear load. It was found that the shear strength of the solder joints decreased in a linear fashion with increasing porosity. Failure occurred by internal necking of the interpore matrix. It was confirmed that entrapment of flux residues leads to porosity by manufacturing fluxless samples in a specially made furnace, and comparing them with samples assembled using flux. Also, contamination of Au electrodeposits (in substrate metallization) was determined to cause significant porosity. It was found that hard-Au (Co hardened Au) electrodeposits produce high degrees of porosity even in the absence of flux. Finally, increasing the time the solder spends in the molten state was proven to successfully decrease porosity.

  15. Creep deformation behavior in eutectic Sn-Ag solder joints using a novel mapping technique

    SciTech Connect

    Lucas, J.P.; Guo, F.; McDougall, J.; Bieler, T.R.; Subramanian, K.N.; Park, J.K.

    1999-11-01

    Creep deformation behavior was measured for 60--100 {micro}m thick solder joints. The solder joints investigated consisted of: (1) non-composite solder joints made with eutectic Sn-Ag solder, and (2) composite solder joints with eutectic Sn-Ag solder containing 20 vol.%, 5 {micro}m diameter in-situ Cu{sub 6}Sn{sub 5} intermetallic reinforcements. All creep testing in this study was carried out at room temperature. Qualitative and quantitative assessment of creep deformation was characterized on the solder joints. Creep deformation was analyzed using a novel mapping technique where a geometrical-regular line pattern was etched over the entire solder joint using excimer laser ablation. During creep, the laser-ablation (LA) pattern becomes distorted due to deformation in the solder joint. By imaging the distortion of laser-ablation patterns using the SEM, actual deformation mapping for the entire solder joint is revealed. The technique involves sequential optical/digital imaging of the deformation versus time history during creep. By tracing and recording the deformation of the LA patterns on the solder over intervals of time, local creep data are obtained in many locations in the joint. This analysis enables global and localized creep shear strains and strain rate to be determined.

  16. Automated inspection of solder joints for surface mount technology

    NASA Technical Reports Server (NTRS)

    Savage, Robert M.; Park, Hyun Soo; Fan, Mark S.

    1993-01-01

    Researchers at NASA/GSFC evaluated various automated inspection systems (AIS) technologies using test boards with known defects in surface mount solder joints. These boards were complex and included almost every type of surface mount device typical of critical assemblies used for space flight applications: X-ray radiography; X-ray laminography; Ultrasonic Imaging; Optical Imaging; Laser Imaging; and Infrared Inspection. Vendors, representative of the different technologies, inspected the test boards with their particular machine. The results of the evaluation showed limitations of AIS. Furthermore, none of the AIS technologies evaluated proved to meet all of the inspection criteria for use in high-reliability applications. It was found that certain inspection systems could supplement but not replace manual inspection for low-volume, high-reliability, surface mount solder joints.

  17. Solder joint fatigue analysis under low temperature Martian conditions

    NASA Technical Reports Server (NTRS)

    Tudryn, Carissa

    2006-01-01

    Electronics, without requiring heater power or enclosure in a centralized 'warm electronics box,' will need to survive mean surface temperatures of -120 degrees Celsius to +20 degrees Celsius for an extended Martian mission and an operational temperature up to 85 degrees Celsisus. Since these electronics will need to survive extended cycles under these conditions, fatigue is a significant concern. The solder joint reliability of connectors on a printed wiring board was investigated.

  18. Inelastic Strain Analysis of Solder Joint in NASA Fatigue Specimen

    NASA Technical Reports Server (NTRS)

    Dasgupta, Abhijit; Oyan, Chen

    1991-01-01

    The solder fatigue specimen designed by NASA-GSFC/UNISYS is analyzed in order to obtain the inelastic strain history during two different representative temperature cycles specified by UNISYS. In previous reports (dated July 25, 1990, and November 15, 1990), results were presented of the elastic-plastic and creep analysis for delta T = 31 C cycle, respectively. Subsequent results obtained during the current phase, from viscoplastic finite element analysis of the solder fatigue specimen for delta T = 113 C cycle are summarized. Some common information is repeated for self-completeness. Large-deformation continuum formulations in conjunction with a standard linear solid model is utilized for modeling the solder constitutive creep-plasticity behavior. Relevant material properties are obtained from the literature. Strain amplitudes, mean strains, and residual strains (as well as stresses) accumulated due to a representative complete temperature cycle are obtained as a result of this analysis. The partitioning between elastic strains, time-independent inelastic (plastic) strains, and time-dependent inelastic (creep) strains is also explicitly obtained for two representative cycles. Detailed plots are presented for two representative temperature cycles. This information forms an important input for fatigue damage models, when predicting the fatigue life of solder joints under thermal cycling

  19. Electromigration Behaviors of Cu Reinforced Sn-3.5Ag Composite Solder Joints

    NASA Astrophysics Data System (ADS)

    Wang, Yan; Han, Jing; Ma, Limin; Zuo, Yong; Guo, Fu

    2016-09-01

    The composite approach, by incorporating small amounts of reinforcement particles in the solder matrix, has proven to be one of the effective ways to improve the reliability of solder joints. The effects of Cu addition on electromigration were investigated in this study by incorporating 2% volume fraction Cu particles into Sn-3.5Ag eutectic solder paste by the in situ process. The one-dimensional solder joints, designed to prevent the current crowding effect, were stressed under a constant current density of 104 A/cm2 at room temperature, and the temperature of the sample could reach 105 ± 5°C due to the Joule heating effect. Doping 2 vol.% Cu was found to retard the electromigration phenomenon effectively. After electric current stressing for 528 h, the growth rate of an interfacial intermetallic compound (IMC) layer at the anode decreased 73% in contrast to that of Sn-3.5Ag solder joints, and the IMC layer at the cathode was almost unchanged. The polarization effect of Cu reinforced composite solder joints was also apparently mitigated. In addition, the surface damage of the composite solder joints was relieved by incorporating 2 vol.% Cu particles. Compared to Sn-3.5Ag solder joints, which had protruded Cu6Sn5 and wrinkles of Sn-solder matrix on the surface, the solder joints with Cu addition had a more even surface.

  20. A wafer-level Sn-rich Au-Sn intermediate bonding technique with high strength

    NASA Astrophysics Data System (ADS)

    Fang, Zhiqiang; Mao, Xu; Yang, Jinling; Yang, Fuhua

    2013-09-01

    Sn-rich Au-Sn solder bonding has been systematically investigated for low temperature wafer-level hermetic packaging of high-end micro-electro-mechanical systems (MEMS) devices. The AuSn2 phase with the highest Vickers-hardness among the four stable intermetallic compounds of the Au-Sn system makes a major contribution to the high bonding strength. A maximum shear strength of 64 MPa and a leak rate lower than 4.9 × 10-7 atm-cc s-1 have been obtained for Au46Sn54 solder bonded at 310 °C. In addition, several routines have been used to effectively inhibit the solder overflow and preserve a good bonding strength and water resilience: producing dielectric SiO2 structures which do not wet the melting solder to the surrounding bonding region, reducing the bonding pressure, and prolonging the bonding time. This wafer level bonding technique with good hermeticity can be applied to MEMS devices requiring a low temperature package.

  1. A microstructural analysis of solder joints from the electronic assemblies of dismantled nuclear weapons

    SciTech Connect

    Vianco, P.T.; Rejent, J.A.

    1997-05-01

    MC1814 Interconnection Boxes from dismantled B57 bombs, and MC2839 firing Sets from retired W70-1 warheads were obtained from the Pantex facility. Printed circuit boards were selected from these components for microstructural analysis of their solder joints. The analysis included a qualitative examination of the solder joints and quantitative assessments of (1) the thickness of the intermetallic compound layer that formed between the solder and circuit board Cu features, and (2) the Pb-rich phase particle distribution within the solder joint microstructure. The MC2839 solder joints had very good workmanship qualities. The intermetallic compound layer stoichiometry was determined to be that of Cu6Sn5. The mean intermetallic compound layer thickness for all solder joints was 0.885 mm. The magnitude of these values did not indicate significant growth over the weapon lifetime. The size distribution of the Pb-rich phase particles for each of the joints were represented by the mean of 9.85 {times} 10{sup {minus}6} mm{sup 2}. Assuming a spherical geometry, the mean particle diameter would be 3.54 mm. The joint-to-joint difference of intermetallic compound layer thickness and Pb-rich particle size distribution was not caused by varying thermal environments, but rather, was a result of natural variations in the joint microstructure that probably existed at the time of manufacture. The microstructural evaluation of the through-hole solder joints form the MC2839 and MC1814 components indicated that the environmental conditions to which these electronic units were exposed in the stockpile, were benign regarding solder joint aging. There was an absence of thermal fatigue damage in MC2839 circuit board, through-hole solder joints. The damage to the eyelet solder joints of the MC1814 more likely represented infant mortality failures at or very near the time of manufacture, resulting from a marginal design status of this type of solder joint design.

  2. Interfacial reaction of Sn-based solder joint in the package system

    NASA Astrophysics Data System (ADS)

    Gu, Huandi

    In this thesis, I report a study on the effect of the solder size on intermetallic layer formation by comparing the morphology change and growth rate of two different size solder joint aged at a same temperature for different aging time. The layer thickness and microstructure were analyzed using scanning electron microscopy (SEM). Photoshop was used to measure the thickness of intermetallic compound. Two different size of solder joints with composition of Sn-Ag-Cu (305) were used.

  3. Some Observations of Solder Joint Failure Under Tensile-Compressive Stress

    NASA Technical Reports Server (NTRS)

    Winslow, J. W.

    1993-01-01

    It has long been known that solder joints under mechanical stress are subject to failure. In early electronic systems, such failures were avoided primarily by avoiding the use of solder as a mechanical structural component. The rule was to first make sound wire connections that did not depend mechanically on solder, and only then to solder them. Careful design and miniaturization in modern electronic systems limits the mechanical stresses exerted on solder joints to values less than their yield points, and these joints have become integral parts of the mechanical structures. Unfortunately, while these joints are strong enough when new, they have proven vulnerable to fatigue failures as they age.Details of the fatigue process are poorly understood, making predictions of expected lifetimes difficult.

  4. Improvement of High-Temperature Performance of Zn-Sn Solder Joint

    NASA Astrophysics Data System (ADS)

    Takahashi, Toshihide; Komatsu, Shuichi; Nishikawa, Hiroshi; Takemoto, Tadashi

    2010-08-01

    Pb-based solders are used as high-temperature solders in power semiconductor devices. Although the use of Pb is globally restricted, alternative materials cannot replace the Pb-based solder. This study proposes that the Pb-based solder can be replaced by Zn-Sn alloys. Die shear tests revealed that some Zn-Sn solder joints between Cu substrates had a higher shear strength between 300 K and 543 K than those between Fe-42Ni substrates. The microstructure of the Zn-Sn solder joints between Cu substrates showed network microstructures consisting of a Zn phase and ɛ-CuZn5 phase and direct connection between the network microstructures and intermetallic compound layer. These morphologies of the high melting phase should improve the shear strength even at the elevated temperature of 543 K.

  5. Observations of microstructural coarsening in micro flip-chip solder joints

    NASA Astrophysics Data System (ADS)

    Barney, Monica M.; Morris, J. W.

    2001-09-01

    Coarsening of solder microstructures dramatically affects fatigue lifetimes. This paper presents a study of microstructural evolution due to thermal cycling and aging of small solder joints. The lead-tin solder joints in this study have a height of 55 5 m and a tin content of 65 70 wt.%, with a degenerate eutectic microstructure. The joint microstructure coarsens more rapidly during aging at 160°C than cycling from 0 160°C. No coarsened bands are observed. The cycling data scales with standard coarsening equations, while the aging data fits to an enhanced trend. The joints experiencing 2.8% strain during cycling fail by 1000 cycles.

  6. Assessment of Solder Joint Fatigue Life Under Realistic Service Conditions

    NASA Astrophysics Data System (ADS)

    Hamasha, Sa'd.; Jaradat, Younis; Qasaimeh, Awni; Obaidat, Mazin; Borgesen, Peter

    2014-12-01

    The behavior of lead-free solder alloys under complex loading scenarios is still not well understood. Common damage accumulation rules fail to account for strong effects of variations in cycling amplitude, and random vibration test results cannot be interpreted in terms of performance under realistic service conditions. This is a result of the effects of cycling parameters on materials properties. These effects are not yet fully understood or quantitatively predictable, preventing modeling based on parameters such as strain, work, or entropy. Depending on the actual spectrum of amplitudes, Miner's rule of linear damage accumulation has been shown to overestimate life by more than an order of magnitude, and greater errors are predicted for other combinations. Consequences may be particularly critical for so-called environmental stress screening. Damage accumulation has, however, been shown to scale with the inelastic work done, even if amplitudes vary. This and the observation of effects of loading history on subsequent work per cycle provide for a modified damage accumulation rule which allows for the prediction of life. Individual joints of four different Sn-Ag-Cu-based solder alloys (SAC305, SAC105, SAC-Ni, and SACXplus) were cycled in shear at room temperature, alternating between two different amplitudes while monitoring the evolution of the effective stiffness and work per cycle. This helped elucidate general trends and behaviors that are expected to occur in vibrations of microelectronics assemblies. Deviations from Miner's rule varied systematically with the combination of amplitudes, the sequences of cycles, and the strain rates in each. The severity of deviations also varied systematically with Ag content in the solder, but major effects were observed for all the alloys. A systematic analysis was conducted to assess whether scenarios might exist in which the more fatigue-resistant high-Ag alloys would fail sooner than the lower-Ag ones.

  7. Generation of Tin(II) Oxide Crystals on Lead-Free Solder Joints in Deionized Water

    NASA Astrophysics Data System (ADS)

    Chang, Hong; Chen, Hongtao; Li, Mingyu; Wang, Ling; Fu, Yonggao

    2009-10-01

    The effect of the anode and cathode on the electrochemical corrosion behavior of lead-free Sn-Ag-Cu and Sn-Ag-Cu-Bi solder joints in deionized water was investigated. Corrosion studies indicate that SnO crystals were generated on the surfaces of all lead-free solder joints. The constituents of the lead-free solder alloys, such as Ag, Cu, and Bi, did not affect the corrosion reaction significantly. In contrast to lead-free solders, PbO x was formed on the surface of the traditional 63Sn-37Pb solder joint in deionized water. A cathode, such as Au or Cu, was necessary for the electrochemical corrosion reaction of solders to occur. The corrosion reaction rate decreased with reduction of the cathode area. The formation mechanism of SnO crystals was essentially a galvanic cell reaction. The anodic reaction of Sn in the lead-free solder joints occurred through solvation by water molecules to form hydrated cations. In the cathodic reaction, oxygen dissolved in the deionized water captures electrons and is deoxidized to hydroxyl at the Au or Cu cathode. By diffusion, the anodic reaction product Sn2+ and the cathodic reaction product OH- meet to form Sn(OH)2, some of which can dehydrate to form more stable SnO· xH2O crystals on the surface of the solder joints. In addition, thermodynamic analysis confirms that the Sn corrosion reaction could occur spontaneously.

  8. Experimental Investigation of Solder Joint Defect Formation and Mitigation in Reduced-Gravity Environments

    NASA Technical Reports Server (NTRS)

    Watson, J. Kevin; Struk, Peter M.; Pettegrew, RIchard D.; Downs, Robert S.

    2006-01-01

    This paper documents a research effort on reduced gravity soldering of plated through hole joints which was conducted jointly by the National Center for Space Exploration Research, NASA Glenn Research Center, and NASA Johnson Space Center. Significant increases in joint porosity and changes in external geometry were observed in joints produced in reduced gravity as compared to normal gravity. Multiple techniques for mitigating the observed increase in porosity were tried, including several combinations of flux and solder application techniques, and demoisturizing the circuit board prior to soldering. Results were consistent with the hypothesis that the source of the porosity is a combination of both trapped moisture in the circuit board itself, as well as vaporized flux that is trapped in the molten solder. Other topics investigated include correlation of visual inspection results with joint porosity, pore size measurements, limited pressure effects (0.08 MPa - 0.1 MPa) on the size and number of pores, and joint cooling rate.

  9. An Overview of Surface Finishes and Their Role in Printed Circuit Board Solderability and Solder Joint Performance

    SciTech Connect

    Vianco, P.T.

    1998-10-15

    A overview has been presented on the topic of alternative surface finishes for package I/Os and circuit board features. Aspects of processability and solder joint reliability were described for the following coatings: baseline hot-dipped, plated, and plated-and-fused 100Sn and Sn-Pb coatings; Ni/Au; Pd, Ni/Pd, and Ni/Pd/Au finishes; and the recently marketed immersion Ag coatings. The Ni/Au coatings appear to provide the all-around best option in terms of solderability protection and wire bondability. Nickel/Pal ftishes offer a slightly reduced level of performance in these areas that is most likely due to variable Pd surface conditions. It is necessmy to minimize dissolved Au or Pd contents in the solder material to prevent solder joint embrittlement. Ancillary aspects that included thickness measurement techniques; the importance of finish compatibility with conformal coatings and conductive adhesives; and the need for alternative finishes for the processing of non-Pb bearing solders were discussed.

  10. Microstructure and Properties of Sn-10Bi- xCu Solder Alloy/Joint

    NASA Astrophysics Data System (ADS)

    Lai, Zhongmin; Ye, Dan

    2016-07-01

    The effect of Cu on the microstructure and properties of Sn-10Bi solder alloy/joint were investigated. The results showed that the microstructure of Sn-10Bi-Cu solder alloy consisted of a Sn-rich phase, Bi-rich phase, and particles of Cu6Sn5 intermetallic compounds (IMCs). The pasty range of Sn-10Bi- xCu had an influence on the spreading property of Sn-10Bi- xCu. Cu improved the growth of the IMCs layer during the liquid reaction stage. Furthermore, the hardness of the solder alloy increased as the Cu concentration of increased. The strength of the solder joint was controlled by the solder alloy hardness and the interfacial IMCs layer thickness together. For the joints with low solder alloy hardness and a thin IMCs layer, the fracture was in the solder alloy. For the joints with high solder alloy hardness and a thick IMCs layer, the fracture was in the IMCs layer.

  11. Magellan/Galileo solder joint failure analysis and recommendations

    NASA Technical Reports Server (NTRS)

    Ross, Ronald G., Jr.

    1989-01-01

    On or about November 10, 1988 an open circuit solder joint was discovered in the Magellan Radar digital unit (DFU) during integration testing at Kennedy Space Center (KSC). A detailed analysis of the cause of the failure was conducted at the Jet Propulsion Laboratory leading to the successful repair of many pieces of affected electronic hardware on both the Magellan and Galileo spacecraft. The problem was caused by the presence of high thermal coefficient of expansion heat sink and conformal coating materials located in the large (0.055 inch) gap between Dual Inline Packages (DIPS) and the printed wiring board. The details of the observed problems are described and recommendations are made for improved design and testing activities in the future.

  12. Interfacial Reactions and Joint Strengths of Sn- xZn Solders with Immersion Ag UBM

    NASA Astrophysics Data System (ADS)

    Jee, Y. K.; Yu, Jin

    2010-10-01

    The solder joint microstructures of immersion Ag with Sn- xZn ( x = 0 wt.%, 1 wt.%, 5 wt.%, and 9 wt.%) solders were analyzed and correlated with their drop impact reliability. Addition of 1 wt.% Zn to Sn did not change the interface microstructure and was only marginally effective. In comparison, the addition of 5 wt.% or 9 wt.% Zn formed layers of AgZn3/Ag5Zn8 at the solder joint interface, which increased drop reliability significantly. Under extensive aging, Ag-Zn intermetallic compounds (IMCs) transformed into Cu5Zn8 and Ag3Sn, and the drop impact resistance at the solder joints deteriorated up to a point. The beneficial role of Zn on immersion Ag pads was ascribed to the formation of Ag-Zn IMC layers, which were fairly resistant to the drop impact, and to the suppression of the brittle Cu6Sn5 phase at the joint interface.

  13. Imaging and Analysis of Void-defects in Solder Joints Formed in Reduced Gravity using High-Resolution Computed Tomography

    NASA Technical Reports Server (NTRS)

    Easton, John W.; Struk, Peter M.; Rotella, Anthony

    2008-01-01

    As a part of efforts to develop an electronics repair capability for long duration space missions, techniques and materials for soldering components on a circuit board in reduced gravity must be developed. This paper presents results from testing solder joint formation in low gravity on a NASA Reduced Gravity Research Aircraft. The results presented include joints formed using eutectic tin-lead solder and one of the following fluxes: (1) a no-clean flux core, (2) a rosin flux core, and (3) a solid solder wire with external liquid no-clean flux. The solder joints are analyzed with a computed tomography (CT) technique which imaged the interior of the entire solder joint. This replaced an earlier technique that required the solder joint to be destructively ground down revealing a single plane which was subsequently analyzed. The CT analysis technique is described and results presented with implications for future testing as well as implications for the overall electronics repair effort discussed.

  14. Soldering of Thin Film-Metallized Glass Substrates

    SciTech Connect

    Hosking, F.M.; Hernandez, C.L.; Glass, S.J.

    1999-03-31

    The ability to produce reliable electrical and structural interconnections between glass and metals by soldering was investigated. Soldering generally requires premetallization of the glass. As a solderable surface finish over soda-lime-silicate glass, two thin films coatings, Cr-Pd-Au and NiCr-Sn, were evaluated. Solder nettability and joint strengths were determined. Test samples were processed with Sn60-Pb40 solder alloy at a reflow temperature of 210 C. Glass-to-cold rolled steel single lap samples yielded an average shear strength of 12 MPa. Solder fill was good. Control of the Au thickness was critical in minimizing the formation of AuSn{sub 4} intermetallic in the joint, with a resulting joint shear strength of 15 MPa. Similar glass-to-glass specimens with the Cr-Pd-Au finish failed at 16.5 MPa. The NiCr-Sn thin film gave even higher shear strengths of 20-22.5 MPa, with failures primarily in the glass.

  15. A microstructural study of creep and thermal fatigue deformation in 60Sn-40Pb solder joints

    SciTech Connect

    Tribula, D.

    1990-06-02

    Thermal fatigue failures of solder joints in electronic devices often arise from cyclic shear strains imposed by the mismatched thermal expansion coefficients of the materials that bind the joint as temperature changes are encountered. Increased solder joint reliability demands a fundamental understanding of the metallurigical mechanisms that control the fatigue to design accurate accelerated probative tests and new, more fatigue resistant solder alloys. The high temperatures and slow strain rates that pertain to thermal fatigue imply that creep is an important deformation mode in the thermal fatigue cycle. In this work, the creep behaviour of a solder joint is studied to determine the solder's microstructural response to this type of deformation and to relate this to the more complex problem of thermal fatigue. It is shown that creep failures arise from the inherent inhomogeneity and instability of the solder microstructure and suggest that small compositional changes of the binary near-eutectic Pn-Sn alloy may defeat the observed failure mechanisms. This work presents creep and thermal fatigue data for several near-eutectic Pb-Sn solder compositions and concludes that a 58Sn-40Pb-2In and a 58Sn-40Pb-2Cd alloy show significantly enhanced fatigue resistance over that of the simple binary material. 80 refs., 33 figs., 1 tab.

  16. Microstructurally based thermomechanical fatigue lifetime model of solder joints for electronic applications

    SciTech Connect

    Frear, D.R.; Rashid, M.M.; Burchett, S.N.

    1993-07-01

    We present a new methodology for predicting the fatigue life of solder joints for electronics applications. This approach involves integration of experimental and computational techniques. The first stage involves correlating the manufacturing and processing parameters with the starting microstructure of the solder joint. The second stage involves a series of experiments that characterize the evolution of the microstructure during thermal cycling. The third stage consists of a computer modeling and simulation effort that utilizes the starting microstructure and experimental data to produce a reliability prediction of the solder joint. This approach is an improvement over current methodologies because it incorporates the microstructure and properties of the solder directly into the model and allows these properties to evolve as the microstructure changes during fatigue.

  17. Intermetallics Characterization of Lead-Free Solder Joints under Isothermal Aging

    NASA Astrophysics Data System (ADS)

    Choubey, Anupam; Yu, Hao; Osterman, Michael; Pecht, Michael; Yun, Fu; Yonghong, Li; Ming, Xu

    2008-08-01

    Solder interconnect reliability is influenced by environmentally imposed loads, solder material properties, and the intermetallics formed within the solder and the metal surfaces to which the solder is bonded. Several lead-free metallurgies are being used for component terminal plating, board pad plating, and solder materials. These metallurgies react together and form intermetallic compounds (IMCs) that affect the metallurgical bond strength and the reliability of solder joint connections. This study evaluates the composition and extent of intermetallic growth in solder joints of ball grid array components for several printed circuit board pad finishes and solder materials. Intermetallic growth during solid state aging at 100°C and 125°C up to 1000 h for two solder alloys, Sn-3.5Ag and Sn-3.0Ag-0.5Cu, was investigated. For Sn-3.5Ag solder, the electroless nickel immersion gold (ENIG) pad finish was found to result in the lowest IMC thickness compared to immersion tin (ImSn), immersion silver (ImAg), and organic solderability preservative (OSP). Due to the brittle nature of the IMC, a lower IMC thickness is generally preferred for optimal solder joint reliability. A lower IMC thickness may make ENIG a desirable finish for long-life applications. Activation energies of IMC growth in solid-state aging were found to be 0.54 ± 0.1 eV for ENIG, 0.91 ± 0.12 eV for ImSn, and 1.03 ± 0.1 eV for ImAg. Cu3Sn and Cu6Sn5 IMCs were found between the solder and the copper pad on boards with the ImSn and ImAg pad finishes. Ternary (Cu,Ni)6Sn5 intermetallics were found for the ENIG pad finish on the board side. On the component side, a ternary IMC layer composed of Ni-Cu-Sn was found. Along with intermetallics, microvoids were observed at the interface between the copper pad and solder, which presents some concern if devices are subject to shock and vibration loading.

  18. Microstructure Evolution and Shear Behavior of the Solder Joints for Flip-Chip LED on ENIG Substrate

    NASA Astrophysics Data System (ADS)

    Liu, Yang; Sun, Fenglian; Luo, Liangliang; Yuan, Cadmus A.; Zhang, Guoqi

    2015-07-01

    The microstructure evolution and shear behavior of the solder joints for the flip-chip light-emitting diode on the electroless nickel/immersion gold (ENIG) substrate were investigated in this study. The experimental results reveal that the solder joints for the anode and cathode have different microstructures and failure characteristics during the shear test before and after isothermal aging. For the solder joints for the anode, the interfacial intermetallic compound (IMC) is (Au, Ni)Sn4 at the solder/anode interface but dendritic Ni3Sn4 grains at the solder/ENIG interface after reflow. Meanwhile, the dendritic Ni3Sn4 grains are surrounded by (Au, Ni)Sn4, which suppresses the growth of the Ni3Sn4 grains during aging. For the solder joints for the cathode, a nano scaled Au-rich layer can be observed near the cathode/solder layer interface after reflow. And the Au-rich layer moves toward the bulk solder because of the volume expansion by the transformation from Au into (Au, Ni)Sn4 during reflow and isothermal aging. Due to the diffusion of the Au atom from the Au-rich layer into the bulk solder, the Au-rich layer transformed into an interface inside of the solder joint. The average shear force of the solder joints shows a decrease from 380 gf to 250 gf because of the microstructure evolution during the isothermal aging for 1000 h at 85°C. After long time aging, the primary failure mode of the solder joint for the anode changed from the anode broken to the brittle failure of the solder layer. The delamination between the IMC layer and the insulation layer is suggested to be the dominated failure mode of the solder joint for the cathode after aging.

  19. Eutectic Solder Bonding for Highly Manufacturable Microelectromechanical Systems Probe Card

    NASA Astrophysics Data System (ADS)

    Kim, Bonghwan

    2011-06-01

    We developed eutectic solder bonding for the microelectromechanical systems (MEMS) probe card. We tested various eutectic solder materials, such as Sn, AgSn, and AuSn, and investigated the bonding ability of Sn-based multi-element alloys and their resistance to chemical solutions. The Sn-based alloys were formed by sputtering, electroplating, and the use of solder paste. According to our experimental results, Sn-rich solders, such as Ag3.5Sn, Ag3.5Sn96Cu0.5, and Sn, were severely damaged by silicon wet etchant such as potassium hydroxide (KOH) and tetramethylammonium hydroxide (TMAH). On the other hand Au80Sn20 was resistant to those chemicals. In order to verify the joint bondability of the solders, we used a cantilever probe beam, and bump which were made of nickel and nickel alloy. After flip-chip bonding of the cantilever beam and the bump with Au80Sn20 solder paste, we measured the contact force to verify the mechanical strength. We then re-inspected it with X-rays and found no voids in the joint.

  20. Effect of gamma radiation on micromechanical hardness of lead-free solder joint

    SciTech Connect

    Paulus, Wilfred; Rahman, Irman Abdul; Jalar, Azman; Kamil, Insan; Bakar, Maria Abu; Yusoff, Wan Yusmawati Wan

    2015-09-25

    Lead-free solders are important material in nano and microelectronic surface mounting technology for various applications in bio medicine, environmental monitoring, spacecraft and satellite instrumentation. Nevertheless solder joint in radiation environment needs higher reliability and resistance to any damage caused by ionizing radiations. In this study a lead-free 99.0Sn0.3Ag0.7Cu wt.% (SAC) solder joint was developed and subjected to various doses of gamma radiation to investigate the effects of the ionizing radiation to micromechanical hardness of the solder. Averaged hardness of the SAC joint was obtained from nanoindentation test. The results show a relationship between hardness values of indentations and the increment of radiation dose. Highest mean hardness, 0.2290 ± 0.0270 GPa was calculated on solder joint which was exposed to 5 Gray dose of gamma radiation. This value indicates possible radiation hardening effect on irradiated solder. The hardness gradually decreased to 0.1933 ± 0.0210 GPa and 0.1631 ± 0.0173 GPa when exposed to doses 50 and 500 gray respectively. These values are also lower than the hardness of non irradiated sample which was calculated as 0.2084 ± 0.0.3633 GPa indicating possible radiation damage and needs further related atomic dislocation study.

  1. Morphology and Shear Strength of Lead-Free Solder Joints with Sn3.0Ag0.5Cu Solder Paste Reinforced with Ceramic Nanoparticles

    NASA Astrophysics Data System (ADS)

    Yakymovych, A.; Plevachuk, Yu.; Švec, P.; Švec, P.; Janičkovič, D.; Šebo, P.; Beronská, N.; Roshanghias, A.; Ipser, H.

    2016-08-01

    To date, additions of different oxide nanoparticles is one of the most widespread procedures to improve the mechanical properties of metals and metal alloys. This research deals with the effect of minor ceramic nanoparticle additions (SiO2, TiO2 and ZrO2) on the microstructure and mechanical properties of Cu/solder/Cu joints. The reinforced Sn3.0Ag0.5Cu (SAC305) solder alloy with 0.5 wt.% and 1.0 wt.% of ceramic nanoparticles was prepared through mechanically stirring. The microstructure of as-solidified Cu/solder/Cu joints was studied using scanning electron microscopy. The additions of ceramic nanoparticles suppressed the growth of the intermetallic compound layer Cu6Sn5 at the interface solder/Cu and improved the microstructure of the joints. Furthermore, measurements of mechanical properties showed improved shear strength of Cu/composite solder/Cu joints compared to joints with unreinforced solder. This fact related to all investigated ceramic nanoinclusions and should be attributed to the adsorption of nanoparticles on the grain surface during solidification. However, this effect is less pronounced on increasing the nanoinclusion content from 0.5 wt.% to 1.0 wt.% due to agglomeration of nanoparticles. Moreover, a comparison analysis showed that the most beneficial influence was obtained by minor additions of SiO2 nanoparticles into the SAC305 solder alloy.

  2. Effect of Solder-Joint Geometry on the Low-Cycle Fatigue Behavior of Sn-xAg-0.7Cu

    NASA Astrophysics Data System (ADS)

    Lee, Hwa-Teng; Huang, Kuo-Chen

    2016-07-01

    Low-cycle fatigue tests of Sn-Ag-Cu (SAC) Pb-free solder joints under fixed displacement were performed to evaluate the influence of Ag content (0-3 wt.%) and solder-joint geometry (barrel and hourglass types) on solder-joint fatigue behavior and reliability. The solder joints were composed of fine particles of Ag3Sn and Cu6Sn5, which aggregated as an eutectic constituent at grain boundaries of the primary β-Sn phase and formed a dense network structure. A decrease in the Ag content resulted in coarsening of the β-Sn and eutectic phases, which, in turn, decreased the strength of the joint and caused earlier failure. Solder joints in the hourglass form exhibited better fatigue performance with longer life than barrel-type joints. The sharp contact angle formed between the solder and the Cu substrate by the barrel-type joints concentrated stress, which compromised fatigue reliability. The addition of Ag to the solder, however, enhanced fatigue performance because of strengthening caused by Ag3Sn formation. The cracks of the barrel-type SAC solder joints originated mostly at the contact corner and propagated along the interfacial layer between the interfacial intermetallic compound (IMC) and solder matrix. Hourglass-type solder joints, however, demonstrated both crack initiation and propagation in the solder matrix (solder mode). The addition of 1.5-2.0 wt.% Ag to SAC solder appears to enhance the fatigue performance of solder joints while maintaining sufficient strength.

  3. Polarity effect of electromigration on mechanical properties of lead-free solder joints

    NASA Astrophysics Data System (ADS)

    Ren, Fei

    The trend of electronic packaging is to package the chips and the associated interconnections in a compact way that allows high speed operation; that allows for sufficient heat removal; that can withstand the thermal cycling associated with the turning on and turning off of the circuits; and that protects the circuits from environmental attack. These goals require that flip chip solder joints have higher resistance to electromigration, stronger mechanical property to sustain thermal mechanical stress, and are lead-free materials to satisfy environment and health concern. With lots of work on chemical reaction, electromigration and mechanical study in flip chip solder joints, however, the interaction between different driving forces is still little known. As a matter of fact, the combination study of chemical, electrical and mechanical is more and more significant to the understanding of the behavior of flip chip solder joints. In this dissertation, I developed one dimensional Cu (wire)-eutectic SnAgCu(ball)-Cu(wire) structure to investigate the interaction between electrical and mechanical force in lead-free solder joints. Electromigration was first conducted. The mechanical behaviors of solder joints before, after, and during electromigration were examined. Electrical current and mechanical stress were applied either in serial or in parallel to the solder joints. Tensile, creep, and drop tests, combined with different electrical current densities (1˜5x10 3A/cm2) and different stressing time (3˜144 hours), have been performed to study the effect of electromigration on the mechanical behavior of solder joints. Nano-indentation test was conducted to study the localized mechanical property of IMC at both interfaces in nanometer scale. Fracture images help analyze the failure mechanism of solder joints driven by both electrical and mechanical forces. The combination study shows a strain build-up during electromigration. Furthermore, a ductile-to-brittle transition in

  4. Soldering tool heats workpieces and applies solder in one operation

    NASA Technical Reports Server (NTRS)

    Gudkese, V. W.

    1966-01-01

    Fountain-pen type soldering iron heats workpieces and applies solder to joints in densely packed electronics assemblies. The basic soldering tool is used with different-sized orifice tips, eliminating the need for an assortment of conventional soldering guns.

  5. A microstructurally based model of solder joints under conditions of thermomechanical fatigue

    SciTech Connect

    Frear, D.R.; Burchett, S.N.; Rashid, M.M.

    1994-12-31

    The thermomechanical fatigue failure of solder joints in increasingly becoming an important reliability issue. In this paper we present two computational methodologies that have been developed to predict the behavior of near eutectic Sn-Pb solder joints under fatigue conditions that are based on metallurgical tests as fundamental input for constitutive relations. The two-phase model mathematically predicts the heterogeneous coarsening behavior of near eutectic Sn-Pb solder. The finite element simulations from this model agree well with experimental thermomechanical fatigue tests. The simulations show that the presence of an initial heterogeneity in the solder microstructure could significantly degrade the fatigue lifetime. The single phase model is a computational technique that was developed to predict solder joint behavior using materials data for constitutive relation constants that could be determined through straightforward metallurgical experiments. A shear/torsion test sample was developed to impose strain in two different orientations. Materials constants were derived from these tests and the results showed an adequate fit to experimental results. The single-phase model could be very useful for conditions where microstructural evolution is not a dominant factor in fatigue.

  6. The Effect of Gap Angle on Tensile Strength of Preceramic Base Metal Solder Joints

    PubMed Central

    Fattahi, Farnaz; Hashemi Ardakani, Zahra; Hashemi Ardakani, Maryam

    2015-01-01

    Statement of the Problem Soldering is a process commonly used in fabricating dental prosthesis. Since most soldered prosthesis fail at the solder joints; the joint strength is of utmost importance. Purpose The purpose of this study was to evaluate the effect of gap angle on the tensile strength of base metal solder joints. Materials and Method A total number of 40 Ni-Cr samples were fabricated according to ADA/ISO 9693 specifications for tensile test. Samples were cut at the midpoint of the bar, and were placed at the considered angles by employing an explicitly designed device. They were divided into 4 groups regarding the gap angle; Group C (control group) with parallel gap on steady distance of 0.2mm, Group 1: 10°, Group 2: 20°, and Group3: 30° gap angles. When soldered, the specimens were all tested for tensile strength using a universal testing machine at a cross-head speed of 0.5 mm/min with a preload of 10N. Kruskal-Wallis H test was used to compare tensile strength among the groups (p< 0.05). Results The mean tensile strength values obtained from the study groups were respectively 307.84, 391.50, 365.18, and 368.86 MPa. The tensile strength was not statistically different among the four groups in general (p≤ 0.490). Conclusion Making the gap angular at the solder joints and the subsequent unsteady increase of the gap distance would not change the tensile strength of the joint. PMID:26636118

  7. Study of Height Reduction of Sn99Cu1/Cu Solder Joints as a Result of Isothermal Aging

    NASA Astrophysics Data System (ADS)

    Chen, Zhiwen; Liu, Changqing; Wu, Yiping; An, Bing; Zhou, Longzao

    2015-11-01

    Sn99Cu1/Cu solder joints were investigated after isothermal aging at 175°C for different lengths of time under vacuum conditions. The results revealed height reduction of the solder of approximately 1.2 μm after aging for 1132.5 h. This was primarily attributed to growth of a layer of interfacial intermetallic compounds. The reduction was measured by use of a copper block containing a recess filled with solder, which was reflowed then polished flat. Height reduction of the solder joint during aging was found to obey the parabolic law Δ h = -0.031√ t, and was in excellent agreement with theoretical calculation.

  8. Incorporation of Interfacial Intermetallic Morphology in Fracture Mechanism Map for Sn-Ag-Cu Solder Joints

    NASA Astrophysics Data System (ADS)

    Huang, Z.; Kumar, P.; Dutta, I.; Sidhu, R.; Renavikar, M.; Mahajan, R.

    2014-01-01

    A fracture mechanism map (FMM) is a powerful tool which correlates the fracture behavior of a material to its microstructural characteristics in an explicit and convenient way. In the FMM for solder joints, an effective thickness of the interfacial intermetallic compound (IMC) layer ( t eff) and the solder yield strength ( σ ys,eff) are used as abscissa and ordinate axes, respectively, as these two predominantly affect the fracture behavior of solder joints. Earlier, a definition of t eff, based on the uniform thickness of IMC ( t u) and the average height of the IMC scallops ( t s), was proposed and shown to aptly explain the fracture behavior of solder joints on Cu. This paper presents a more general definition of t eff that is more widely applicable to a range of metallizations, including Cu and electroless nickel immersion gold (ENIG). Using this new definition of t eff, mode I FMM for SAC387/Cu joints has been updated and its validity was confirmed. A preliminary FMM for SAC387/Cu joints with ENIG metallization is also presented.

  9. Characterization of tin crystal orientation evolution during thermal cycling in lead-free solder joints

    NASA Astrophysics Data System (ADS)

    Zhou, Bite

    To address the long term reliability of lead-free solder joints in electronic devices during thermal cycling, the fundamental understanding of deformation mechanisms was studied using polarized light optical microscopy (PLM), electron backscatter diffraction (EBSD) in scanning electron microscopy (SEM), and synchrotron X-ray diffraction (XRD). Near-eutectic Sn-3.0(wt %) Ag-0.5(wt %) Cu (SAC305) lead-free solder joints were assessed in three different package designs: low-strain plastic ball grid array (PBGA), medium-strain fine-pitch ball grid array (BGA), and high-strain wafer-level-chip-scale package (WLCSP). The effect of microstructure evolution on solder failure is correlated with dislocation slip activities. The major failure mode in lead-free solder joints during thermal cycling that causes the electrical failure of the device is cracking in the bulk Sn near the Si chip/solder interface. Microstructure and Sn grain orientation evolution usually precedes crack development. A combined approach of both statistical analysis of a large number of solder joints, and detailed studies of individual solder balls was used to investigate the causes of fracture. Sn crystal orientation evolution and its effect on deformation was characterized in solder joints with different thermal histories, and compared with those from other package designs with different effective strain levels. The relationship between the initial dominant and localized recrystallized Sn grain orientations on crack development was investigated. It is found that in the low-strain package design, cracking is strongly correlated with Sn grain orientations with the [001] direction (c-axis) nearly aligned with the chip/solder interface. But no cracks were observed in solder balls with dominant orientations that have the c-axis normal to the interface plane. In higher-strain packages, however, cracking occurred in a variety of Sn grain orientations, and even solder balls with dominant orientations that are

  10. Learning algorithms for both real-time detection of solder shorts and for SPC measurement correction using cross-sectional x-ray images of PCBA solder joints

    NASA Astrophysics Data System (ADS)

    Roder, Paul A.

    1994-03-01

    Learning algorithms are introduced for use in the inspection of cross-sectional X-ray images of solder joints. These learning algorithms improve measurement accuracy by accounting for localized shading effects that can occur when inspecting double- sided printed circuit board assemblies. Two specific examples are discussed. The first is an algorithm for detection of solder short defects. The second algorithm utilizes learning to generate more accurate statistical process control measurements.

  11. Joint Lead-Free Solder Test Program for High Reliability Military and Space Applications

    NASA Technical Reports Server (NTRS)

    Brown, Christina

    2004-01-01

    Current and future space and defense systems face potential risks from the continued use of tin-lead solder, including: compliance with current environmental regulations, concerns about potential environmental legislation banning lead-containing products, reduced mission readiness, and component obsolescence with lead surface finishes. For example, the United States Environmental Protection Agency (USEPA) has lowered the Toxic Chemical Release reporting threshold for lead to 100 pounds. Overseas, the Waste Electrical and Electronic Equipment (WEEE) and the Restriction on Hazardous Substances (RoHS) Dicctives in Europe and similar mandates in Japan have instilled concern that a legislative body will prohibit the use of lead in aerospace/military electronics soldering. Any potential banning of lead compounds could reduce the supplier base and adversely affect the readiness of missions led by the National Aeronautics and Space Administration (NASA) and the U.S. Department of Defense (DoD). Before considering lead-free electronics for system upgrades or future designs, however, it is important for the DoD and NASA to know whether lead-free solders can meet their systems' requirements. No single lead-free solder is likely to qualify for all defense and space applications. Therefore, it is important to validate alternative solders for discrete applications. As a result of the need for comprehensive test data on the reliability of lead-free solders, a partnership was formed between the DoD, NASA, and several original equipment manufactures (OEMs) to conduct solder-joint reliability (laboratory) testing of three lead-free solder alloys on newly manufactured and reworked circuit cards to generate performance data for high-reliability (IPC Class 3) applications.

  12. Thermal Cycling Fatigue in DIPs Mounted with Eutectic Tin-Lead Solder Joints in Stub and Gullwing Geometries

    NASA Technical Reports Server (NTRS)

    Winslow, J. W.; Silveira, C. de

    1993-01-01

    It has long been known that solder joints under mechanical stress are subject to failure. In early electronic systems, such failures were avoided primarily by avoiding the use of solder as a mechanical structural component. The rule was first to make sound wire connections that did not depend mechanically on solder, and only then to solder them. Careful design and miniaturization in modern electronic systems limits the mechanical stresses exerted on solder joints to values less than their yield points, and these joints have become integral parts of the mechanical structures. Unfortunately, while these joints are strong enough when new, they have proven vulnerable to fatigue failures as they age. Details of the fatigue process are poorly understood, making predictions of expected lifetimes difficult.

  13. In-situ study of electromigration-induced grain rotation in Pb-free solder joint by synchrotron microdiffraction

    SciTech Connect

    Chen, Kai; Tamura, Nobumichi; Tu, King-Ning

    2008-10-31

    The rotation of Sn grains in Pb-free flip chip solder joints hasn't been reported in literature so far although it has been observed in Sn strips. In this letter, we report the detailed study of the grain orientation evolution induced by electromigration by synchrotron based white beam X-ray microdiffraction. It is found that the grains in solder joint rotate more slowly than in Sn strip even under higher current density. On the other hand, based on our estimation, the reorientation of the grains in solder joints also results in the reduction of electric resistivity, similar to the case of Sn strip. We will also discuss the reason why the electric resistance decreases much more in strips than in the Sn-based solders, and the different driving force for the grain growth in solder joint and in thin film interconnect lines.

  14. Comparison of Extensive Thermal Cycling Effects on Microstructure Development in Micro-alloyed Sn-Ag-Cu Solder Joints

    SciTech Connect

    Anderson, Iver E.; Boesenberg, Adam; Harringa, Joel; Riegner, David; Steinmetz, Andrew; Hillman, David

    2011-09-28

    Pb-free solder alloys based on the Sn-Ag-Cu (SAC) ternary eutectic have promise for widespread adoption across assembly conditions and operating environments, but enhanced microstructural control is needed. Micro-alloying with elements such as Zn was demonstrated for promoting a preferred solidification path and joint microstructure earlier in simple (Cu/Cu) solder joints studies for different cooling rates. This beneficial behavior now has been verified in reworked ball grid array (BGA) joints, using dissimilar SAC305 (Sn-3.0Ag-0.5Cu, wt.%) solder paste. After industrial assembly, BGA components joined with Sn-3.5Ag-0.74Cu-0.21Zn solder were tested in thermal cycling (-55 C/+125 C) along with baseline SAC305 BGA joints beyond 3000 cycles with continuous failure monitoring. Weibull analysis of the results demonstrated that BGA components joined with SAC + Zn/SAC305 have less joint integrity than SAC305 joints, but their lifetime is sufficient for severe applications in consumer, defense, and avionics electronic product field environments. Failure analysis of the BGA joints revealed that cracking did not deviate from the typical top area (BGA component side) of each joint, in spite of different Ag3Sn blade content. Thus, SAC + Zn solder has not shown any advantage over SAC305 solder in these thermal cycling trials, but other characteristics of SAC + Zn solder may make it more attractive for use across the full range of harsh conditions of avionics or defense applications.

  15. Effect of Plasma Surface Finish on Wettability and Mechanical Properties of SAC305 Solder Joints

    NASA Astrophysics Data System (ADS)

    Kim, Kyoung-Ho; Koike, Junichi; Yoon, Jeong-Won; Yoo, Sehoon

    2016-09-01

    The wetting behavior, interfacial reactions, and mechanical reliability of Sn-Ag-Cu solder on a plasma-coated printed circuit board (PCB) substrate were evaluated under multiple heat-treatments. Conventional organic solderability preservative (OSP) finished PCBs were used as a reference. The plasma process created a dense and highly cross-linked polymer coating on the Cu substrates. The plasma finished samples had higher wetting forces and shorter zero-cross times than those with OSP surface finish. The OSP sample was degraded after sequential multiple heat treatments and reflow processes, whereas the solderability of the plasma finished sample was retained after multiple heat treatments. After the soldering process, similar microstructures were observed at the interfaces of the two solder joints, where the development of intermetallic compounds was observed. From ball shear tests, it was found that the shear force for the plasma substrate was consistently higher than that for the OSP substrate. Deterioration of the OSP surface finish was observed after multiple heat treatments. Overall, the plasma surface finish was superior to the conventional OSP finish with respect to wettability and joint reliability, indicating that it is a suitable material for the fabrication of complex electronic devices.

  16. Influence of bonding pressure on thermal resistance in reactively-bonded solder joints

    NASA Astrophysics Data System (ADS)

    Kanetsuki, Shunsuke; Miyake, Shugo; Kuwahara, Koichi; Namazu, Takahiro

    2016-06-01

    To realize the practical use of reactively bonded solder joints for thermally sensitive devices such as MEMS and electrical modules, we quantitatively measure the thermal resistance of solder joints fabricated by Al/Ni self-propagating exothermic reaction. By the laser flash method with response function analysis, the influence of bonding pressure on the thermal resistance of the reactive joints is investigated. The thermal resistance of the joints obtained by 3 MPa bonding is higher than that by 20 MPa bonding. By cross-sectional scanning electron microscopy (SEM) observation, many voids are found in the vicinity of the interface between the reacted AlNi and bottom-side solder layers in 3 MPa joints. In 20 MPa joints, a Ni-rich AlNi intermetallic compound instead of voids is produced around the interface. For reducing the thermal resistance of the reactive joints, the void generation mechanism is discussed in light of SEM observation and electron probe microanalysis (EPMA) analysis results.

  17. Al and Si Alloying Effect on Solder Joint Reliability in Sn-0.5Cu for Automotive Electronics

    NASA Astrophysics Data System (ADS)

    Hong, Won Sik; Oh, Chulmin; Kim, Mi-Song; Lee, Young Woo; Kim, Hui Joong; Hong, Sung Jae; Moon, Jeong Tak

    2016-08-01

    To suppress the bonding strength degradation of solder joints in automotive electronics, we proposed a mid-temperature quaternary Pb-free Sn-0.5Cu solder alloy with minor Pd, Al, Si and Ge alloying elements. We manufactured powders and solder pastes of Sn-0.5Cu-(0.01,0.03)Al-0.005Si-(0.006-0.007)Ge alloys (T m = 230°C), and vehicle electronic control units used for a flame-retardant-4 printed circuit board with an organic solderability preservative finish were assembled by a reflow soldering process. To investigate the degradation properties of solder joints used in engine compartments, thermal cycling tests were conducted from -40°C to 125°C (10 min dwell) for 1500 cycles. We also measured the shear strength of the solder joints in various components and observed the microstructural evolution of the solder joints. Based on these results, intermetallic compound (IMC) growth at the solder joints was suppressed by minor Pd, Al and Si additions to the Sn-0.5Cu alloy. After 1500 thermal cycles, IMC layers thicknesses for 100 parts per million (ppm) and 300 ppm Al alloy additions were 6.7 μm and 10 μm, compared to the as-reflowed bonding thicknesses of 6 μm and 7 μm, respectively. Furthermore, shear strength degradation rates for 100 ppm and 300 ppm Al(Si) alloy additions were at least 19.5%-26.2%. The cause of the improvement in thermal cycling reliability was analyzed using the (Al,Cu)-Sn, Si-Sn and Al-Sn phases dispersed around the Cu6Sn5 intermetallic at the solder matrix and bonding interfaces. From these results, we propose the possibility of a mid-temperature Sn-0.5Cu(Pd)-Al(Si)-Ge Pb-free solder for automotive engine compartment electronics.

  18. Effect of Electromigration on the Type of Drop Failure of Sn-3.0Ag-0.5Cu Solder Joints in PBGA Packages

    NASA Astrophysics Data System (ADS)

    Huang, M. L.; Zhao, N.

    2015-10-01

    Board-level drop tests of plastic ball grid array (PBGA) packages were performed in accordance with the Joint Electron Devices Engineering Council standard to investigate the effect of electromigration (EM) on the drop reliability of Sn-3.0Ag-0.5Cu solder joints with two substrate surface finishes, organic solderability preservative (OSP) and electroless nickel electroless palladium immersion gold (ENEPIG). In the as-soldered state, drop failures occurred at the substrate sides only, with cracks propagating within the interfacial intermetallic compound (IMC) layer for OSP solder joints and along the IMC/Ni-P interface for ENEPIG solder joints. The drop lifetime of OSP solder joints was approximately twice that of ENEPIG joints. EM had an important effect on crack formation and drop lifetime of the PBGA solder joints. ENEPIG solder joints performed better in drop reliability tests after EM, that is, the drop lifetime of ENEPIG joints decreased by 43% whereas that of OSP solder joints decreased by 91%, compared with the as-soldered cases. The more serious polarity effect, i.e., excessive growth of the interfacial IMC at the anode, was responsible for the sharper decrease in drop lifetime. The different types of drop failure of PBGA solder joints before and after EM, including the position of initiation and the propagation path of cracks, are discussed on the basis of the growth behavior of interfacial IMC.

  19. Sensitivity of Solder Joint Fatigue to Sources of Variation in Advanced Vehicular Power Electronics Cooling

    SciTech Connect

    Vlahinos, A.; O'Keefe, M.

    2010-06-01

    This paper demonstrates a methodology for taking variation into account in thermal and fatigue analyses of the die attach for an inverter of an electric traction drive vehicle. This method can be used to understand how variation and mission profile affect parameters of interest in a design. Three parameters are varied to represent manufacturing, material, and loading variation: solder joint voiding, aluminum nitride substrate thermal conductivity, and heat generation at the integrated gate bipolar transistor. The influence of these parameters on temperature and solder fatigue life is presented. The heat generation loading variation shows the largest influence on the results for the assumptions used in this problem setup.

  20. Wave soldering with Pb-free solders

    SciTech Connect

    Artaki, I.; Finley, D.W.; Jackson, A.M.; Ray, U.; Vianco, P.T.

    1995-07-01

    The manufacturing feasibility and attachment reliability of a series of newly developed lead-free solders were investigated for wave soldering applications. Some of the key assembly aspects addressed included: wettability as a function of board surface finish, flux activation and surface tension of the molten solder, solder joint fillet quality and optimization of soldering thermal profiles. Generally, all new solder formulations exhibited adequate wave soldering performance and can be considered as possible alternatives to eutectic SnPb for wave soldering applications. Further process optimization and flux development is necessary to achieve the defect levels associated with the conventional SnPb process.

  1. A systems approach to solder joint fatigue in spacecraft electronic packaging

    NASA Technical Reports Server (NTRS)

    Ross, R. G., Jr.

    1991-01-01

    Differential expansion induced fatigue resulting from temperature cycling is a leading cause of solder joint failures in spacecraft. Achieving high reliability flight hardware requires that each element of the fatigue issue be addressed carefully. This includes defining the complete thermal-cycle environment to be experienced by the hardware, developing electronic packaging concepts that are consistent with the defined environments, and validating the completed designs with a thorough qualification and acceptance test program. This paper describes a useful systems approach to solder fatigue based principally on the fundamental log-strain versus log-cycles-to-failure behavior of fatigue. This fundamental behavior has been useful to integrate diverse ground test and flight operational thermal-cycle environments into a unified electronics design approach. Each element of the approach reflects both the mechanism physics that control solder fatigue, as well as the practical realities of the hardware build, test, delivery, and application cycle.

  2. Ball shear strength and fracture modes of lead-free solder joints prepared using nickel nanoparticle doped flux

    NASA Astrophysics Data System (ADS)

    Sujan, G. K.; Haseeb, A. S. M. A.; Amalina, M. A.; Nishikawa, Hiroshi

    2015-05-01

    Miniaturization and the need for the replacement of lead (Pb) based solders in microelectronic devices raise concerns over their reliability in the recent years. Particularly, the rapid growth of interfacial intermetallic compound (IMC) layers in Pb free solders can lead to brittle fracture. A novel nanoparticle doped fluxing method was used to prepare ball grid array solder joints between Sn-3.0Ag-0.5Cu solder balls and Cu pads. In this method, nickel nanoparticles were mixed with a water soluble flux prior to its use. The shear strength and fracture modes of the resulting solder joints were investigated as a function of aging time. Results showed that IMC layer growth was suppressed in solder joints prepared with 0.1 wt.% Ni doped flux. The average shear strength was marginally higher for solder joints prepared using 0.1 wt. % Ni doped flux compared with the joints prepared with undoped flux. Samples prepared using Ni doped flux showed a better resistant against brittle fracture for up to 30 days of aging.[Figure not available: see fulltext.

  3. Properties and Reliability of Solder Microbump Joints Between Si Chips and a Flexible Substrate

    NASA Astrophysics Data System (ADS)

    Ko, Yong-Ho; Kim, Min-Su; Bang, Junghwan; Kim, Taek-Soo; Lee, Chang-Woo

    2015-07-01

    Future generations of electronics are expected to include flexible, bendable, and wearable devices. There have been very few studies, however, on the bonding technology and reliability of bonding joints between a chip and a flexible substrate. In this study, we investigated the properties and reliability of joints formed with Sn-58Bi solder microbumps between a Si chip and a flexible substrate. For fine-pitch bonding, we formed Cu pillar bumps and Sn-58Bi solder microbumps with diameter of 25 μm by electroplating. The Si chips were then bonded on a flexible substrate finished with electroless nickel immersion gold (ENIG) using flip-chip technology, processing at 170°C under a force of 1 N, 2 N, or 3 N for 15 s. Cross-sectional images of bump joints were analyzed using field-emission scanning electron microscopy. While the Cu6Sn5 intermetallic compound (IMC) was formed on the Cu-pillar-bump side, another IMC, Ni3Sn4, was formed on the ENIG-substrate side. In addition, we performed a shear test, thermal shock test, and bending test to evaluate the joints' mechanical properties and reliability. The bending test was performed by a machine designed for joints on flexible substrates. Unit shear force of 2 N was the nominally highest value obtained from joints prepared under the three bonding conditions. After the thermal shock test, we observed cracks initiated at the Cu6Sn5/Sn-58Bi interface, which then propagated within the solder bumps or at the interface. In the case of the bending test, failure occurred at the Ni3Sn4/Sn-58Bi interface or within the solder bumps.

  4. A quick electrical inspection method of solder joint quality for LED products

    NASA Astrophysics Data System (ADS)

    Zhang, Jianhua; Que, Xiufu; Liu, Yanan; Chen, Weining; Tao, Guoqiao; Yang, Lianqiao

    2016-06-01

    Solder joint qualities of light-emitting diodes (LED) lamps have a significant effect on their lifetime. Due to variations in LEDs, the product lifetime is determined by the lowest performing component of the product when multi-LEDs are used. In this paper, we propose a quick electrical inspection method of solder joint quality for LED products, which is obtained by the heating curve measurement for a short time with the forward voltage as a temperature sensitive parameter. The utility of this quick inspection method is verified by the measurement of a solder voids ratio based on the most commonly used approaches in the industry—x-ray. The proposed method is cost effective and only needs around 1-5 s for each LED, which is about one third of the x-ray. Therefore, the quick electrical test method is both meaningful and promising especially when carrying out quality tests on large quantities of solder and can be a highly recommended method to be adopted by the LED lighting industry.

  5. Reliability of Sn-3.5Ag Solder Joints in High Temperature Packaging Applications

    SciTech Connect

    Muralidharan, Govindarajan; Kurumaddali, Nalini Kanth; Kercher, Andrew K; Leslie, Dr Scott

    2010-01-01

    There is a significant need for next generation, high performance power electronic packages and systems with wide band gap devices to operate at high temperatures in automotive and electricity transmission applications. Sn-3.5Ag solder is a candidate for use in such packages with potential operating temperatures up to 200oC. However, there is a need to understand thermal cycling reliability of Sn-3.5Ag solders subject to such operating conditions. The results of a study on the damage evolution occurring in large area Sn-3.5Ag solders joints between silicon dies and DBC substrates subject to thermal cycling between 200oC and 5oC is presented in this paper. Damage accumulation was followed using high resolution X-ray radiography techniques while nonlinear finite element models were developed based on the mechanical property data available in literature to understand the relationship between the stress state within the solder joint and the damage evolution occurring under thermal cycling conditions. It was observed that regions of damage observed in the experiments do not correspond to the finite element predictions of the location of regions of maximum plastic work.

  6. A quick electrical inspection method of solder joint quality for LED products

    NASA Astrophysics Data System (ADS)

    Zhang, Jianhua; Que, Xiufu; Liu, Yanan; Chen, Weining; Tao, Guoqiao; Yang, Lianqiao

    2016-06-01

    Solder joint qualities of light-emitting diodes (LED) lamps have a significant effect on their lifetime. Due to variations in LEDs, the product lifetime is determined by the lowest performing component of the product when multi-LEDs are used. In this paper, we propose a quick electrical inspection method of solder joint quality for LED products, which is obtained by the heating curve measurement for a short time with the forward voltage as a temperature sensitive parameter. The utility of this quick inspection method is verified by the measurement of a solder voids ratio based on the most commonly used approaches in the industry—x-ray. The proposed method is cost effective and only needs around 1–5 s for each LED, which is about one third of the x-ray. Therefore, the quick electrical test method is both meaningful and promising especially when carrying out quality tests on large quantities of solder and can be a highly recommended method to be adopted by the LED lighting industry.

  7. Damage mechanics characterization on fatigue behavior of a solder joint material

    SciTech Connect

    Chow, C.L.; Yang, F.; Fang, H.E.

    1998-08-01

    This paper presents the first part of a comprehensive mechanics approach capable of predicting the integrity and reliability of solder joint material under fatigue loading without viscoplastic damage considerations. A separate report will be made to present a comprehensive damage model describing life prediction of the solder material under thermomechanical fatigue loading. The method is based on a theory of damage mechanics which makes possible a macroscopic description of the successive material deterioration caused by the presence of microcracks/voids in engineering materials. A damage mechanics model based on the thermodynamic theory of irreversible processes with internal state variables is proposed and used to provide a unified approach in characterizing the cyclic behavior of a typical solder material. With the introduction of a damage effect tensor, the constitutive equations are derived to enable the formulation of a fatigue damage dissipative potential function and a fatigue damage criterion. The fatigue evolution is subsequently developed based on the hypothesis that the overall damage is induced by the accumulation of fatigue and plastic damage. This damage mechanics approach offers a systematic and versatile means that is effective in modeling the entire process of material failure ranging from damage initiation and propagation leading eventually to macro-crack initiation and growth. As the model takes into account the load history effect and the interaction between plasticity damage and fatigue damage, with the aid of a modified general purpose finite element program, the method can readily be applied to estimate the fatigue life of solder joints under different loading conditions.

  8. Nucleation and Growth of Tin in Pb-Free Solder Joints

    NASA Astrophysics Data System (ADS)

    Gourlay, C. M.; Belyakov, S. A.; Ma, Z. L.; Xian, J. W.

    2015-08-01

    The solidification of Pb-free solder joints is overviewed with a focus on the formation of the βSn grain structure and grain orientations. Three solders commonly used in electronics manufacturing, Sn-3Ag-0.5Cu, Sn-3.5Ag, and Sn-0.7Cu-0.05Ni, are used as case studies to demonstrate that (I) growth competition between primary dendrites and eutectic fronts during growth in undercooled melts is important in Pb-free solders and (II) a metastable eutectic containing NiSn4 forms in Sn-3.5Ag/Ni joints. Additionally, it is shown that the substrate (metallization) has a strong influence on the nucleation and growth of tin. We identify Co, Pd, and Pt substrates as having the potential to control solidification and microstructure formation. In the case of Pd and Pt substrates, βSn is shown to nucleate on the PtSn4 or PdSn4 intermetallic compound (IMC) reaction layer at relatively low undercooling of ~4 K, even for small solder ball diameters down to <200 μm.

  9. Fast formation and growth of high-density Sn whiskers in Mg/Sn-based solder/Mg joints by ultrasonic-assisted soldering: Phenomena, mechanism and prevention.

    PubMed

    Li, M Y; Yang, H F; Zhang, Z H; Gu, J H; Yang, S H

    2016-01-01

    A universally applicable method for promoting the fast formation and growth of high-density Sn whiskers on solders was developed by fabricating Mg/Sn-based solder/Mg joints using ultrasonic-assisted soldering at 250 °C for 6 s and then subjected to thermal aging at 25 °C for 7 d. The results showed that the use of the ultrasonic-assisted soldering could produce the supersaturated dissolution of Mg in the liquid Sn and lead to the existence of two forms of Mg in Sn after solidification. Moreover, the formation and growth of the high-density whiskers were facilitated by the specific contributions of both of the Mg forms in the solid Sn. Specifically, interstitial Mg can provide the persistent driving force for Sn whisker growth, whereas the Mg2Sn phase can increase the formation probability of Sn whiskers. In addition, we presented that the formation and growth of Sn whiskers in the Sn-based solders can be significantly restricted by a small amount of Zn addition (≥3 wt.%), and the prevention mechanisms are attributed to the segregation of Zn atoms at grain or phase boundaries and the formation of the lamellar-type Zn-rich structures in the solder. PMID:27273421

  10. Fast formation and growth of high-density Sn whiskers in Mg/Sn-based solder/Mg joints by ultrasonic-assisted soldering: Phenomena, mechanism and prevention.

    PubMed

    Li, M Y; Yang, H F; Zhang, Z H; Gu, J H; Yang, S H

    2016-06-08

    A universally applicable method for promoting the fast formation and growth of high-density Sn whiskers on solders was developed by fabricating Mg/Sn-based solder/Mg joints using ultrasonic-assisted soldering at 250 °C for 6 s and then subjected to thermal aging at 25 °C for 7 d. The results showed that the use of the ultrasonic-assisted soldering could produce the supersaturated dissolution of Mg in the liquid Sn and lead to the existence of two forms of Mg in Sn after solidification. Moreover, the formation and growth of the high-density whiskers were facilitated by the specific contributions of both of the Mg forms in the solid Sn. Specifically, interstitial Mg can provide the persistent driving force for Sn whisker growth, whereas the Mg2Sn phase can increase the formation probability of Sn whiskers. In addition, we presented that the formation and growth of Sn whiskers in the Sn-based solders can be significantly restricted by a small amount of Zn addition (≥3 wt.%), and the prevention mechanisms are attributed to the segregation of Zn atoms at grain or phase boundaries and the formation of the lamellar-type Zn-rich structures in the solder.

  11. Fast formation and growth of high-density Sn whiskers in Mg/Sn-based solder/Mg joints by ultrasonic-assisted soldering: Phenomena, mechanism and prevention

    NASA Astrophysics Data System (ADS)

    Li, M. Y.; Yang, H. F.; Zhang, Z. H.; Gu, J. H.; Yang, S. H.

    2016-06-01

    A universally applicable method for promoting the fast formation and growth of high-density Sn whiskers on solders was developed by fabricating Mg/Sn-based solder/Mg joints using ultrasonic-assisted soldering at 250 °C for 6 s and then subjected to thermal aging at 25 °C for 7 d. The results showed that the use of the ultrasonic-assisted soldering could produce the supersaturated dissolution of Mg in the liquid Sn and lead to the existence of two forms of Mg in Sn after solidification. Moreover, the formation and growth of the high-density whiskers were facilitated by the specific contributions of both of the Mg forms in the solid Sn. Specifically, interstitial Mg can provide the persistent driving force for Sn whisker growth, whereas the Mg2Sn phase can increase the formation probability of Sn whiskers. In addition, we presented that the formation and growth of Sn whiskers in the Sn-based solders can be significantly restricted by a small amount of Zn addition (≥3 wt.%), and the prevention mechanisms are attributed to the segregation of Zn atoms at grain or phase boundaries and the formation of the lamellar-type Zn-rich structures in the solder.

  12. Fast formation and growth of high-density Sn whiskers in Mg/Sn-based solder/Mg joints by ultrasonic-assisted soldering: Phenomena, mechanism and prevention

    PubMed Central

    Li, M. Y.; Yang, H. F.; Zhang, Z. H.; Gu, J. H.; Yang, S. H.

    2016-01-01

    A universally applicable method for promoting the fast formation and growth of high-density Sn whiskers on solders was developed by fabricating Mg/Sn-based solder/Mg joints using ultrasonic-assisted soldering at 250 °C for 6 s and then subjected to thermal aging at 25 °C for 7 d. The results showed that the use of the ultrasonic-assisted soldering could produce the supersaturated dissolution of Mg in the liquid Sn and lead to the existence of two forms of Mg in Sn after solidification. Moreover, the formation and growth of the high-density whiskers were facilitated by the specific contributions of both of the Mg forms in the solid Sn. Specifically, interstitial Mg can provide the persistent driving force for Sn whisker growth, whereas the Mg2Sn phase can increase the formation probability of Sn whiskers. In addition, we presented that the formation and growth of Sn whiskers in the Sn-based solders can be significantly restricted by a small amount of Zn addition (≥3 wt.%), and the prevention mechanisms are attributed to the segregation of Zn atoms at grain or phase boundaries and the formation of the lamellar-type Zn-rich structures in the solder. PMID:27273421

  13. Investigation Of The Effects Of Reflow Profile Parameters On Lead-free Solder Bump Volumes And Joint Integrity

    NASA Astrophysics Data System (ADS)

    Amalu, E. H.; Lui, Y. T.; Ekere, N. N.; Bhatti, R. S.; Takyi, G.

    2011-01-01

    The electronics manufacturing industry was quick to adopt and use the Surface Mount Technology (SMT) assembly technique on realization of its huge potentials in achieving smaller, lighter and low cost product implementations. Increasing global customer demand for miniaturized electronic products is a key driver in the design, development and wide application of high-density area array package format. Electronic components and their associated solder joints have reduced in size as the miniaturization trend in packaging continues to be challenged by printing through very small stencil apertures required for fine pitch flip-chip applications. At very narrow aperture sizes, solder paste rheology becomes crucial for consistent paste withdrawal. The deposition of consistent volume of solder from pad-to-pad is fundamental to minimizing surface mount assembly defects. This study investigates the relationship between volume of solder paste deposit (VSPD) and the volume of solder bump formed (VSBF) after reflow, and the effect of reflow profile parameters on lead-free solder bump formation and the associated solder joint integrity. The study uses a fractional factorial design (FFD) of 24-1 Ramp-Soak-Spike reflow profile, with all main effects and two-way interactions estimable to determine the optimal factorial combination. The results from the study show that the percentage change in the VSPD depends on the combination of the process parameters and reliability issues could become critical as the size of solder joints soldered on the same board assembly vary greatly. Mathematical models describe the relationships among VSPD, VSBF and theoretical volume of solder paste. Some factors have main effects across the volumes and a number of interactions exist among them. These results would be useful for R&D personnel in designing and implementing newer applications with finer-pitch interconnect.

  14. Crystal plasticity finite element analysis of deformation behaviour in SAC305 solder joint

    NASA Astrophysics Data System (ADS)

    Darbandi, Payam

    Due to the awareness of the potential health hazards associated with the toxicity of lead (Pb), actions have been taken to eliminate or reduce the use of Pb in consumer products. Among those, tin (Sn) solders have been used for the assembly of electronic systems. Anisotropy is of significant importance in all structural metals, but this characteristic is unusually strong in Sn, making Sn based solder joints one of the best examples of the influence of anisotropy. The effect of anisotropy arising from the crystal structure of tin and large grain microstructure on the microstructure and the evolution of constitutive responses of microscale SAC305 solder joints is investigated. Insights into the effects of key microstructural features and dominant plastic deformation mechanisms influencing the measured relative activity of slip systems in SAC305 are obtained from a combination of optical microscopy, orientation imaging microscopy (OIM), slip plane trace analysis and crystal plasticity finite element (CPFE) modeling. Package level SAC305 specimens were subjected to shear deformation in sequential steps and characterized using optical microscopy and OIM to identify the activity of slip systems. X-ray micro Laue diffraction and high energy monochromatic X-ray beam were employed to characterize the joint scale tensile samples to provide necessary information to be able to compare and validate the CPFE model. A CPFE model was developed that can account for relative ease of activating slip systems in SAC305 solder based upon the statistical estimation based on correlation between the critical resolved shear stress and the probability of activating various slip systems. The results from simulations show that the CPFE model developed using the statistical analysis of activity of slip system not only can satisfy the requirements associated with kinematic of plastic deformation in crystal coordinate systems (activity of slip systems) and global coordinate system (shape changes

  15. Time And Temperature Dependent Micromechanical Properties Of Solder Joints For 3D-Package Integration

    NASA Astrophysics Data System (ADS)

    Roellig, Mike; Meier, Karsten; Metasch, Rene

    2010-11-01

    The recent development of 3D-integrated electronic packages is characterized by the need to increase the diversity of functions and to miniaturize. Currently many 3D-integration concepts are being developed and all of them demand new materials, new designs and new processing technologies. The combination of simulation and experimental investigation becomes increasingly accepted since simulations help to shorten the R&D cycle time and reduce costs. Numerical calculations like the Finite-Element-Method are strong tools to calculate stress conditions in electronic packages resulting from thermal strains due to the manufacturing process and environmental loads. It is essential for the application of numerical calculations that the material data is accurate and describes sufficiently the physical behaviour. The developed machine allows the measurement of time and temperature dependent micromechanical properties of solder joints. Solder joints, which are used to mechanically and electrically connect different packages, are physically measured as they leave the process. This allows accounting for process influences, which may change material properties. Additionally, joint sizes and metallurgical interactions between solder and under bump metallization can be respected by this particular measurement. The measurement allows the determination of material properties within a temperature range of 20° C-200° C. Further, the time dependent creep deformation can be measured within a strain-rate range of 10-31/s-10-81/s. Solder alloys based on Sn-Ag/Sn-Ag-Cu with additionally impurities and joint sizes down to O/ 200 μm were investigated. To finish the material characterization process the material model coefficient were extracted by FEM-Simulation to increase the accuracy of data.

  16. Influence of the Substrate on the Creep of SN Solder Joints

    NASA Astrophysics Data System (ADS)

    Lee, K.-O.; Morris, J. W.; Hua, F.

    2010-07-01

    The creep rate of Sn solder joints is noticeably affected by joint metallization. Cu|Sn|Cu joints have significantly higher creep rates than Ni|Sn|Cu joints, which, in turn, have higher creep rates than Ni|Sn|Ni joints. Replacing Ni by Cu on both substrates increases the creep rate at 333 K (60 °C) by roughly an order of magnitude. The increased creep rate appears with no apparent change in the dominant creep mechanism; the change in the constitutive equation for creep (the Dorn equation) is in the pre-exponential factor. The decreased creep rate on substituting Ni is accompanied by an increase in the hardness of the polygranular solder but a decrease in the nanohardness of the grain interiors. The source of the strong influence of the Ni substrate appears to be the introduction of an array of Ni3Sn4 intermetallic precipitates along the grain boundaries. These precipitates inhibit grain boundary sliding, boundary reconfiguration, and grain growth during creep. The intermediate creep rate of the asymmetric Ni|Sn|Cu joint has two causes: a decrease in grain boundary mobility due to precipitate decoration and a restriction in the free volume of the joint due to rapid intermetallic growth from the substrate on the Ni side. The sources of this anomalous intermetallic growth are discussed.

  17. Microstructural evolution and atomic transport by thermomigration in eutectic tin-lead flip chip solder joints

    SciTech Connect

    Yang, Dan; Wu, B. Y.; Chan, Y. C.; Tu, K. N.

    2007-08-15

    The thermomigration behavior of eutectic tin-lead flip chip solder joints at an ambient temperature of 150 deg. C was investigated in terms of microstructural evolution, atomic transport, and numerical simulation. Pb accumulation and phase separation were observed in solder joints near a melting temperature after 50 h, which was supported by energy dispersive x-ray and element mapping analysis. It is believed that Pb atoms migrated from the chip side (the hot side) to the substrate side (the cold side) under a temperature gradient. Thermal electrical finite element simulation for the real flip chip test structure showed the existence of a temperature difference between the substrate side and the chip side. In addition, a temperature gradient above 1000 deg. C/cm across the adjacent unpowered solder joints was predicted. This was also verified by temperature measurements with thermocouples. The atomic flux of Pb due to thermomigration was calculated here, which was agreeable with the values originally reported. Also, the driving force of thermomigration was estimated to be 10{sup -17} N, even approaching the same order with that of electromigration under a current density of 10{sup 4} A/cm{sup 2}.

  18. Influence of Dopant on Growth of Intermetallic Layers in Sn-Ag-Cu Solder Joints

    NASA Astrophysics Data System (ADS)

    Li, G. Y.; Bi, X. D.; Chen, Q.; Shi, X. Q.

    2011-02-01

    The interfacial interaction between Cu substrates and Sn-3.5Ag-0.7Cu- xSb ( x = 0, 0.2, 0.5, 0.8, 1.0, 1.5, and 2.0) solder alloys has been investigated under different isothermal aging temperatures of 100°C, 150°C, and 190°C. Scanning electron microscopy (SEM) was used to measure the thickness of the intermetallic compound (IMC) layer and observe the microstructural evolution of the solder joints. The IMC phases were identified by energy-dispersive x-ray spectroscopy (EDX) and x-ray diffractometry (XRD). The growth of both the Cu6Sn5 and Cu3Sn IMC layers at the interface between the Cu substrate and the solder fits a power-law relationship with the exponent ranging from 0.42 to 0.83, which suggests that the IMC growth is primarily controlled by diffusion but may also be influenced by interface reactions. The activation energies and interdiffusion coefficients of the IMC formation of seven solder alloys were determined. The addition of Sb has a strong influence on the growth of the Cu6Sn5 layer, but very little influence on the formation of the Cu3Sn IMC phase. The thickness of the Cu3Sn layer rapidly increases with aging time and temperature, whereas the thickness of the Cu6Sn5 layer increases slowly. This is probably due to the formation of Cu3Sn at the interface between two IMC phases, which occurs with consumption of Cu6Sn5. Adding antimony to Sn-3.5Ag-0.7Cu solder can evidently increase the activation energy of Cu6Sn5 IMC formation, reduce the atomic diffusion rate, and thus inhibit excessive growth of Cu6Sn5 IMCs. This study suggests that grain boundary pinning is one of the most important mechanisms for inhibiting the growth of Cu6Sn5 IMCs in such solder joints when Sb is added.

  19. Microstructural Evolution of Intermetallic Compounds in TCNCP Cu Pillar Solder Joints

    NASA Astrophysics Data System (ADS)

    Liang, Chien-Lung; Lin, Kwang-Lung; Peng-Wei, Jr.

    2016-01-01

    This study investigated the microstructure, especially intermetallic compounds (IMCs), formed between a Cu pillar and Cu trace joined by thermal compression bonding with nonconductive paste (NCP). Continuous, uniform layers of Cu3Sn formed on the surface of both the Cu pillar and Cu trace. However, the growth of Cu6Sn5 was suppressed, forming nonuniformly on the Cu trace due to NCP filler entrapment at the Cu-solder interface that hindered Sn diffusion flux. Multireflow induced rapid growth of IMCs within the Cu pillar solder joint. The combination of multireflow and thermal cycle testing gave rise to asymmetric growth of IMCs between the chip side and substrate side as a result of stress migration induced by thermal cycling.

  20. Fracture of Sn-Ag-Cu Solder Joints on Cu Substrates: I. Effects of Loading and Processing Conditions

    NASA Astrophysics Data System (ADS)

    Huang, Z.; Kumar, P.; Dutta, I.; Pang, J. H. L.; Sidhu, R.; Renavikar, M.; Mahajan, R.

    2012-02-01

    During service, microcracks form inside solder joints, making microelectronic packages highly prone to failure on dropping. Hence, the fracture behavior of solder joints under drop conditions at high strain rates and under mixed-mode conditions is a critically important design consideration for robust joints. This study reports on the effects of joint processing and loading conditions on the microstructure and fracture response of Sn-3.8%Ag-0.7%Cu (SAC387) solder joints attached to Cu substrates. The impact of parameters which control the microstructure (reflow condition, aging) as well as loading conditions (strain rate and loading angle) are explicitly studied. A methodology based on the calculation of the critical energy release rate, G C, using compact mixed-mode (CMM) samples was developed to quantify the fracture toughness of the joints under conditions of adhesive (i.e., interface-related) fracture. In general, higher strain rate and increased mode-mixity resulted in decreased G C. G C also decreased with increasing dwell time at reflow temperature, which produced a thicker intermetallic layer at the solder-substrate interface. Softer solders, produced by slower cooling following reflow, or post-reflow aging, showed enhanced G C. The sensitivity of the fracture toughness to all of the aforementioned parameters reduced with an increase in the mode-mixity. Fracture mechanisms, elucidating the effects of the loading conditions and process parameters, are briefly highlighted.

  1. Growth of a Au-Ni-Sn intermetallic compound on the solder-substrate interface after aging

    SciTech Connect

    Minor, Andrew M.; Morris, J.W., Jr.

    1999-12-16

    Au/Ni metallization has become increasingly common in microelectronic packaging when Cu pads are joined with Pb-Sn solder. The outermost Au layer serves to protect the pad from corrosion and oxidation and the Ni layer provides a diffusion barrier to inhibit detrimental growth of Cu-Sn intermetallics. As a result of reflowing eutectic Pb-Sn on top of Au/Ni metallization, the as-solidified joints have AuSn{sub 4} precipitates distributed throughout the bulk of the solder joint, and Ni{sub 3}Sn{sub 4} intermetallics at the interface. Recent work has shown that the Au-Sn redeposits onto the interface during aging, compromising the strength of the joint. The present work shows that the redeposited intermetallic layer is a ternary compound with stoichiometry Au{sub 0.5}Ni{sub 0.5}Sn{sub 4}. The growth of this intermetallic layer was investigated, and results show that the ternary compound is observed to grow after as little as 3 hours at 150 C and after 3 weeks at 150 C has grown to a thickness of 10 {micro}m. Additionally, methods for inhibiting the growth of the ternary layer were investigated and it was determined that multiple reflows, both with and without additional aging can substantially limit the thickness of the ternary layer.

  2. Electromigration effect on intermetallic growth and Young's modulus in SAC solder joint

    NASA Astrophysics Data System (ADS)

    Xu, Luhua; Pang, John H. L.; Ren, Fei; Tu, K. N.

    2006-12-01

    Solid-state intermetallic compound (IMC) growth behavior plays and important role in solder joint reliability of electronic packaging assemblies. The directional impact of electromigration (EM) on the growth of interfacial IMCs in Ni/SAC/Ni, Cu/SAC/Ni single BGA ball solder joint, and fine pitch ball-grid-array (FPBGA) at the anode and cathode sides is reported in this study. When the solder joint was subjected to a current density of 5,000 A/cm2 at 125°C or 150°C, IMC layer growth on the anode interface was faster than that on the cathode interface, and both were faster than isothermal aging due to the Joule heating effect. The EM affects the IMC growth rate, as well as the composition and mechanical properties. The Young’s modulus and hardness were measured by the nanoindentation continuous stiffness measurement (CSM) from planar IMC surfaces after EM exposure. Different values were observed at the anode and cathode. The energy-dispersive x-ray (EDX) line scan analysis was conducted at the interface from the cathode to anode to study the presence of species; Ni was found in the anode IMC at SAC/Cu in the Ni/SAC/Cu joint, but not detected when the current was reverse. Electron-probe microanalysis (EPMA) measurement on the Ni/SAC/Ni specimen also confirmed the polarized Ni and Cu distributions in cathode and anode IMCs, which were (Ni0.57Cu0.43)3Sn4 and (Cu0.73Ni0.27)6Sn5, respectively. Thus, the Young’s moduli of the IMC are 141 and 175 GPa, respectively.

  3. Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn-Ag-Cu/Cu solder joint during different thermal conditions

    NASA Astrophysics Data System (ADS)

    Tan, Ai Ting; Tan, Ai Wen; Yusof, Farazila

    2015-06-01

    Nanocomposite lead-free solders are gaining prominence as replacements for conventional lead-free solders such as Sn-Ag-Cu solder in the electronic packaging industry. They are fabricated by adding nanoparticles such as metallic and ceramic particles into conventional lead-free solder. It is reported that the addition of such nanoparticles could strengthen the solder matrix, refine the intermetallic compounds (IMCs) formed and suppress the growth of IMCs when the joint is subjected to different thermal conditions such as thermal aging and thermal cycling. In this paper, we first review the fundamental studies on the formation and growth of IMCs in lead-free solder joints. Subsequently, we discuss the effect of the addition of nanoparticles on IMC formation and their growth under several thermal conditions. Finally, an outlook on the future growth of research in the fabrication of nanocomposite solder is provided.

  4. Effect of Yttrium on the Fracture Strength of the Sn-1.0Ag-0.5Cu Solder Joints

    NASA Astrophysics Data System (ADS)

    Choi, Hyelim; Kaplan, Wayne D.; Choe, Heeman

    2016-07-01

    This is a preliminary investigation on the mechanical properties of Pb-free Sn-1.0Ag-0.5Cu solder joints containing 0.02 wt.% to 0.1 wt.% Y under a range of thermal aging and reflow conditions. Despite the significantly thicker intermetallic compound (IMC) formed at the solder joint, the 0.1 wt.% Y-doped joint exhibited a higher fracture strength than its baseline Sn-1.0Ag-0.5Cu counterpart under most aging and reflow conditions. This may be associated with the formation of Y-Cu IMCs formed at the interface between the solder and the Cu substrate, because the Y-Cu IMCs have recently been referred to as relatively `ductile' IMCs.

  5. Solder Contamination

    SciTech Connect

    Vianco, P.T.

    1999-02-22

    There are two sources of contamination in solder alloys. The first source is trace elements from the primary metals used in the as-manufactured product, be that product in ingot, wire, or powder form. Their levels in the primary metal are determined by the refining process. While some of these trace elements are naturally occurring materials, additional contamination can result from the refining and/or forming processes. Sources include: furnace pot liners, debris on the cutting edges of shears, rolling mill rollers, etc. The types and levels of contaminants per solder alloy are set by recognized industrial, federal, military, and international specifications. For example, the 63Sn-37Pb solder purchased to the ASTM B 32 standard can have maximum levels of contamination for the following metals: 0.08(wt.)%Cu, 0.001 %Cd, 0.005%Al, 0.25%Bi, 0.03%As, 0.02%Fe, and 0.005 %Zn. A second cause of contamination in solders, and solder baths in particular, is their actual use in soldering operations. Each time a workpiece is introduced into the bath, some dissolution of the joint base metal(s), protective or solderable coatings, and fixture metal takes place which adds to contamination levels in the solder. The potential impurities include Cu; Ni; Au or other noble metals used as protective finishes and Al; Fe; and Zn to name a few. Even dissolution of the pot wall or liner is a source of impurities, typically Fe.

  6. Three Dimensional Characterization of Tin Crystallography and Cu6Sn5 Intermetallics in Solder Joints by Multiscale Tomography

    NASA Astrophysics Data System (ADS)

    Kirubanandham, A.; Lujan-Regalado, I.; Vallabhaneni, R.; Chawla, N.

    2016-07-01

    Decreasing pitch size in electronic packaging has resulted in a drastic decrease in solder volumes. The Sn grain crystallography and fraction of intermetallic compounds (IMCs) in small-scale solder joints evolve much differently at the smaller length scales. A cross-sectional study limits the morphological analysis of microstructural features to two dimensions. This study utilizes serial sectioning technique in conjunction with electron backscatter diffraction to investigate the crystallographic orientation of both Sn grains and Cu6Sn5 IMCs in Cu/Pure Sn/Cu solder joints in three dimensional (3D). Quantification of grain aspect ratio is affected by local cooling rate differences within the solder volume. Backscatter electron imaging and focused ion beam serial sectioning enabled the visualization of morphology of both nanosized Cu6Sn5 IMCs and the hollow hexagonal morphology type Cu6Sn5 IMCs in 3D. Quantification and visualization of microstructural features in 3D thus enable us to better understand the microstructure and deformation mechanics within these small scale solder joints.

  7. New Failure Mode of Flip-Chip Solder Joints Related to the Metallization of an Organic Substrate

    NASA Astrophysics Data System (ADS)

    Jang, J. W.; Yoo, S. J.; Hwang, H. I.; Yuk, S. Y.; Kim, C. K.; Kim, S. J.; Han, J. S.; An, S. H.

    2015-10-01

    We report a new failure phenomenon during flip-chip die attach. After reflow, flip-chip bumps were separated between the Al and Ti layers on the Si die side. This was mainly observed at the Si die corner. Transmission electron microscopy images revealed corrosion of the Al layer at the edge of the solder bump metallization. The corrosion at the metallization edge exhibited a notch shape with high stress concentration factor. The organic substrate had Cu metallization with an organic solderable preservative (OSP) coating layer, where a small amount of Cl ions were detected. A solder bump separation mechanism is suggested based on the reaction between Al and Cl, related to the flow of soldering flux. During reflow, the flux will dissolve the Cl-containing OSP layer and flow up to the Al layer on the Si die side. Then, the Cl-dissolved flux will actively react with Al, forming AlCl3. During cooling, solder bumps at the Si die corner will separate through the location of Al corrosion. This demonstrated that the chemistry of the substrate metallization can affect the thermomechanical reliability of flip-chip solder joints.

  8. Cytotoxicity and genotoxicity of orthodontic bands with or without silver soldered joints.

    PubMed

    Gonçalves, Tatiana Siqueira; Menezes, Luciane Macedo de; Trindade, Cristiano; Machado, Miriana da Silva; Thomas, Philip; Fenech, Michael; Henriques, João Antonio Pêgas

    2014-03-01

    Stainless steel bands, with or without silver soldered joints, are routinely used in orthodontics. However, little is known about the toxic biological effects of these appliances. The aims of this study were to evaluate the cytotoxic, cytostatic, genotoxic and DNA damage-inducing effects of non-soldered bands (NSB) and silver soldered bands (SSB) on the HepG2 and HOK cell lines and to quantify the amount of ions released by the bands. The 24-h metallic eluates of NSBs and SSBs were quantified by atomic absorption spectrophotometry. An MTT reduction assay was performed to evaluate the cytotoxicity, alkaline and modified comet assays were employed to measure genotoxicity and oxidative DNA damage effects, and cytokinesis-block micronucleus cytome (CBMN-Cyt) assays were used to verify DNA damage, cytostasis and cytotoxicity. Ag, Cd, Cr, Cu and Zn were detected in SSB medium samples, and Fe and Ni were detected in both the SSB and NSB medium samples. The SSB group induced stronger cytotoxic effects than the NSB group in both evaluated cell lines. NSB and SSB induced genotoxicity as evaluated by comet assays; stronger effects were observed in the SSB group. Both groups induced similar increases in the number of oxidative DNA lesions, as detected by the FPG and Endo III enzymes. Nucleoplasmic bridges, biomarkers of DNA misrepair and/or telomere end fusions, were significantly elevated in the SSB group. The SSB eluates showed higher amounts of Ni and Fe than NSB, and all the quantified ions were detected in SSB eluates, including Cd. The SSB eluates were more cytotoxic and genotoxic than the NSB samples. Based on these results, we propose that other brands, materials and techniques should be further investigated for the future manufacture of orthodontic appliances. PMID:24495929

  9. Microstructural study on Kirkendall void formation in Sn-containing/Cu solder joints during solid-state aging.

    PubMed

    Liu, Zhi-Quan; Shang, Pan-Ju; Tan, Feifei; Li, Douxing

    2013-08-01

    Kirkendall void formation at the solder/metallization interface is an important reliability concern for Cu conductors and under-bump metallization in microelectronic packaging industry, whose mechanism is still hard to be understood for different individual cases. In the present work, two typical solder/Cu-diffusing couples, eutectic SnIn/Cu and SnBi/Cu, were studied by scanning/transmission electron microscopy to investigate the microstructural evolution and voiding process after soldering and then solid-state aging. It was concluded that Kirkendall voids formed between two sublayers within Cu2(In,Sn) phase in eutectic SnIn/Cu solder joint, whereas they appeared at the Cu3Sn/Cu interface or within Cu3Sn for eutectic SnBi/Cu solder joint. Besides the effect of impurity elements, the morphological difference within one intermetallic compound layer could change the diffusing rates of reactive species, hence resulting in void formation in the reaction zone. PMID:23920185

  10. Three-dimensional (3D) visualization of reflow porosity and modeling of deformation in Pb-free solder joints

    SciTech Connect

    Dudek, M.A.; Hunter, L.; Kranz, S.; Williams, J.J.; Lau, S.H.; Chawla, N.

    2010-04-15

    The volume, size, and dispersion of porosity in solder joints are known to affect mechanical performance and reliability. Most of the techniques used to characterize the three-dimensional (3D) nature of these defects are destructive. With the enhancements in high resolution computed tomography (CT), the detection limits of intrinsic microstructures have been significantly improved. Furthermore, the 3D microstructure of the material can be used in finite element models to understand their effect on microscopic deformation. In this paper we describe a technique utilizing high resolution (< 1 {mu}m) X-ray tomography for the three-dimensional (3D) visualization of pores in Sn-3.9Ag-0.7Cu/Cu joints. The characteristics of reflow porosity, including volume fraction and distribution, were investigated for two reflow profiles. The size and distribution of porosity size were visualized in 3D for four different solder joints. In addition, the 3D virtual microstructure was incorporated into a finite element model to quantify the effect of voids on the lap shear behavior of a solder joint. The presence, size, and location of voids significantly increased the severity of strain localization at the solder/copper interface.

  11. Mechanical Behavior of Sn-3.0Ag-0.5Cu/Cu Solder Joints After Isothermal Aging

    NASA Astrophysics Data System (ADS)

    Nguyen, Van Luong; Chung, Chin-Sung; Kim, Ho-Kyung

    2016-01-01

    The tensile impact behavior of lead-free Sn-3Ag-0.5Cu/Cu solder joints aged at 413 K and 453 K for times ranging from 24 h to 1000 h has been investigated in this study. The activation energy for growth of the intermetallic compound (IMC) layer was estimated and compared with literature values. Additionally, the tensile strength of solder joints with IMC thickness of 17.6 μm was found to be more sensitive to the strain rate as compared with solder joints with thinner IMC layers. Equations representing the relationships among the effective stress, strain rate, aging time, and aging temperature as well as IMC thickness were established using matrix laboratory (MATLAB) software. These equations show that the tensile strength decreases with increase in the IMC thickness to about 8 μm, after which it becomes nearly constant when the IMC thickness is between approximately 8 μm and 14 μm, before decreasing significantly when the IMC thickness exceeds 14 μm. The main reason for these characteristics was excessive increase in the IMC thickness of solder joints, causing a change in the stress concentration of the tensile load from the protruding region to the inside of the IMC layer at the same tested strain rate.

  12. Evolution of Microstructure Across Eutectic Sn-Bi Solder Joints Under Simultaneous Thermal Cycling and Current Stressing

    NASA Astrophysics Data System (ADS)

    Zuo, Yong; Ma, Limin; Liu, Sihan; Shu, Yutian; Guo, Fu

    2015-01-01

    Solder joints in practical service conditions are usually subjected to simultaneous current stressing and thermal cycling. At present, most studies focus on either thermal cycling or current stressing. Therefore, the existence of coupling between these two factors remains in doubt. In this study, experiments are conducted to reveal the effect(s) of current density magnitude on the thermomechanical fatigue (TMF) behavior of solder joints. At the early stage of coupling stressing, damage accumulation contributed to TMF at both high and low current densities. Fatigue micro-cracks readily nucleated and propagated along the boundary of Sn-rich and Bi-rich phases. Fatigue crack formation could be retarded through mass transport and Joule heating effects at an early stage. At later stages, the high current density led to electromigration (EM), which played an important role in the failure process by changing interfacial mechanics due to the mass transport. EM led to the final failure of solder joint, where fracture was located at the interface between the intermetallic compound and solder.

  13. Electromigration induced Kirkendall void growth in Sn-3.5Ag/Cu solder joints

    SciTech Connect

    Jung, Yong; Yu, Jin

    2014-02-28

    Effects of electric current flow on the Kirkendall void formation at solder joints were investigated using Sn-3.5Ag/Cu joints specially designed to have localized nucleation of Kirkendall voids at the Cu{sub 3}Sn/Cu interface. Under the current density of 1 × 10{sup 4} A/cm{sup 2}, kinetics of Kirkendall void growth and intermetallic compound thickening were affected by the electromigration (EM), and both showed the polarity effect. Cu{sub 6}Sn{sub 5} showed a strong susceptibility to the polarity effect, while Cu{sub 3}Sn did not. The electromigration force induced additional tensile (or compressive) stress at the cathode (or anode), which accelerated (or decelerated) the void growth. From the measurements of the fraction of void at the Cu{sub 3}Sn/Cu interface on SEM micrographs and analysis of the kinetics of void growth, the magnitude of the local stress induced by EM was estimated to be 9 MPa at the anode and −7 MPa at the cathode.

  14. Fatigue Life of Lead Free Solder BGA Joints Against Vibration Stress under High Temperature Circumstance

    NASA Astrophysics Data System (ADS)

    Matsushima, Michiya; Furusawa, Takeshi; Fukuda, Kyohei; Egusa, Minoru; Yasuda, Kiyokazu; Fujimoto, Kozo

    Recently, the wave of car computerizing is surging such as electronic control unit, car navigation system, electronic toll collection system, car to car communication system, etc. The use environment of in-car devices is under combined environmental stresses such as thermal stress, vibration, and humidity. In general, the reliability of the joints of the devices is individually tested by the evaluation methods for each stress. Our main purpose of this study is to construct the evaluation method for the damages of solder joints under multiple environmental stresses. We investigated the relationship between the plastic strain caused by one cycle vibration stress calculated with FEM analysis considering the temperature dependency of the elasto-plasticity and the fatigue life obtained by the vibration experiment. We indicated the adequacy of the analysis by the correspondence of the resonance frequency of the BGA package mounting board with the experimental result. We also showed that the plastic strain concentrating position corresponded to the crack position. We clarified that the creep strain rate in the total strain was less than 1 percent. We demonstrated that we could apply the power-law equation to predict the fatigue life of the vibration stress from plastic strain rate under 80°C and 125°C as well as the room temperature.

  15. Solder Reflow Failures in Electronic Components During Manual Soldering

    NASA Technical Reports Server (NTRS)

    Teverovsky, Alexander; Greenwell, Chris; Felt, Frederick

    2008-01-01

    This viewgraph presentation reviews the solder reflow failures in electronic components that occur during manual soldering. It discusses the specifics of manual-soldering-induced failures in plastic devices with internal solder joints. The failure analysis turned up that molten solder had squeezed up to the die surface along the die molding compound interface, and the dice were not protected with glassivation allowing solder to short gate and source to the drain contact. The failure analysis concluded that the parts failed due to overheating during manual soldering.

  16. Soldered solar arrays

    NASA Astrophysics Data System (ADS)

    Allen, H. C.

    1982-06-01

    The ability of soldered interconnects to withstand a combination of long life and severe environmental conditions was investigated. Improvements in joint life from the use of solder mixes appropriate to low temperature conditons were studied. Solder samples were placed in a 150 C oven for 5 weeks (= 12 yr at 80 C, or 24 at 70 C according to Arrhenius's rule). Conventional and high solder melting point array samples underwent 1000 thermal cycles between -186 and 100 C. Results show that conventional and lead rich soldered arrays can survive 10 yr geostationary orbit missions.

  17. Size effects in tin-based lead-free solder joints: Kinetics of bond formation and mechanical characteristics

    NASA Astrophysics Data System (ADS)

    Abdelhadi, Ousama Mohamed Omer

    Continuous miniaturization of microelectronic interconnects demands smaller joints with comparable microstructural and structural sizes. As the size of joints become smaller, the volume of intermetallics (IMCs) becomes comparable with the joint size. As a result, the kinetics of bond formation changes and the types and thicknesses of IMC phases that form within the constrained region of the bond varies. This dissertation focuses on investigating combination effects of process parameters and size on kinetics of bond formation, resulting microstructure and the mechanical properties of joints that are formed under structurally constrained conditions. An experiment is designed where several process parameters such as time of bonding, temperature, and pressure, and bond thickness as structural chracteristic, are varied at multiple levels. The experiment is then implemented on the process. Scanning electron microscope (SEM) is then utilized to determine the bond thickness, IMC phases and their thicknesses, and morphology of the bonds. Electron backscatter diffraction (EBSD) is used to determine the grain size in different regions, including the bulk solder, and different IMC phases. Physics-based analytical models have been developed for growth kinetics of IMC compounds and are verified using the experimental results. Nanoindentation is used to determine the mechanical behavior of IMC phases in joints in different scales. Four-point bending notched multilayer specimen and four-point bending technique were used to determine fracture toughness of the bonds containing IMCs. Analytical modeling of peeling and shear stresses and fracture toughness in tri-layer four-point bend specimen containing intermetallic layer was developed and was verified and validated using finite element simulation and experimental results. The experiment is used in conjunction with the model to calculate and verify the fracture toughness of Cu6Sn5 IMC materials. As expected two different IMC phases

  18. Mechanistic Prediction of the Effect of Microstructural Coarsening on Creep Response of SnAgCu Solder Joints

    NASA Astrophysics Data System (ADS)

    Mukherjee, S.; Chauhan, P.; Osterman, M.; Dasgupta, A.; Pecht, M.

    2016-07-01

    Mechanistic microstructural models have been developed to capture the effect of isothermal aging on time dependent viscoplastic response of Sn3.0Ag0.5Cu (SAC305) solders. SnAgCu (SAC) solders undergo continuous microstructural coarsening during both storage and service because of their high homologous temperature. The microstructures of these low melting point alloys continuously evolve during service. This results in evolution of creep properties of the joint over time, thereby influencing the long term reliability of microelectronic packages. It is well documented that isothermal aging degrades the creep resistance of SAC solder. SAC305 alloy is aged for (24-1000) h at (25-100)°C (~0.6-0.8 × T melt). Cross-sectioning and image processing techniques were used to periodically quantify the effect of isothermal aging on phase coarsening and evolution. The parameters monitored during isothermal aging include size, area fraction, and inter-particle spacing of nanoscale Ag3Sn intermetallic compounds (IMCs) and the volume fraction of micronscale Cu6Sn5 IMCs, as well as the area fraction of pure tin dendrites. Effects of microstructural evolution on secondary creep constitutive response of SAC305 solder joints were then modeled using a mechanistic multiscale creep model. The mechanistic phenomena modeled include: (1) dispersion strengthening by coarsened nanoscale Ag3Sn IMCs in the eutectic phase; and (2) load sharing between pro-eutectic Sn dendrites and the surrounding coarsened eutectic Sn-Ag phase and microscale Cu6Sn5 IMCs. The coarse-grained polycrystalline Sn microstructure in SAC305 solder was not captured in the above model because isothermal aging does not cause any significant change in the initial grain size and orientation of SAC305 solder joints. The above mechanistic model can successfully capture the drop in creep resistance due to the influence of isothermal aging on SAC305 single crystals. Contribution of grain boundary sliding to the creep strain of

  19. In vivo evaluation of the genotoxic effects of Hyrax auxiliary orthodontic appliances containing silver-soldered joints.

    PubMed

    Gonçalves, Tatiana Siqueira; Menezes, Luciane Macedo de; Trindade, Cristiano; Thomas, Philip; Fenechc, Michael; Henriques, João Antonio Pêgas

    2015-09-01

    Auxiliary appliances consisting of silver-soldered joints may be present in the patient's oral cavity for a long time. The aim of this study was to investigate, in vivo, the potential genotoxic effects of Hyrax-type maxillary expanders containing silver-soldered joints on the cells of the buccal mucosa. Buccal cells were collected from 20 patients and processed to perform the buccal comet assay (BCA) and the buccal micronucleus cytome (BMCyt) assay, to investigate DNA and chromosomal damage, respectively. For the BCA, patients were evaluated before and 14 days after the appliances were installed. For the BMCyt assay, the patients were evaluated longitudinally; before the insertion of the appliance and after one, six, and twelve months. The BCA showed significant increases in damage frequency and damage index in exfoliated buccal cells, following insertion of the appliance. For the BMCyt assay, the endpoints related to cell proliferation, cell death, and chromosomal damage (micronuclei and nuclear buds) resulted in no significant differences over the 12-month study period. In conclusion, the use of orthodontic appliances containing silver-soldered joints can significantly increase DNA damage as measured by the BCA. PMID:26338539

  20. Effect of current crowding and Joule heating on electromigration-induced failure in flip chip composite solder joints tested at room temperature

    SciTech Connect

    Nah, J.W.; Suh, J.O.; Tu, K.N.

    2005-07-01

    The electromigration of flip chip solder joints consisting of 97Pb-3Sn and 37Pb-63Sn composite solders was studied under high current densities at room temperature. The mean time to failure and failure modes were found to be strongly dependent on the change in current density. The composite solder joints did not fail after 1 month stressed at 4.07x10{sup 4} A/cm{sup 2}, but failed after just 10 h of current stressing at 4.58x10{sup 4} A/cm{sup 2}. At a slightly higher current stressing of 5.00x10{sup 4} A/cm{sup 2}, the composite solder joints failed after only 0.6 h due to melting. Precipitation and growth of Cu{sub 6}Sn{sub 5} at the cathode caused the Cu under bump metallurgy to be quickly consumed and resulted in void formation at the contact area. The void reduced the contact area and displaced the electrical path, affecting the current crowding and Joule heating inside the solder bump. Significant Joule heating inside solder bumps can cause melting of the solder and quick failure. The effect of void propagation on current crowding and Joule heating was confirmed by simulation.

  1. Effects of Rapid Solidification Process and 0.1 wt.% Pr Addition on Properties of Sn-9Zn Alloy and Cu/Solder/Cu Joints

    NASA Astrophysics Data System (ADS)

    Zhao, Guoji; Jing, Yanxia; Sheng, Guangmin; Chen, Jianhua

    2016-05-01

    Effects of 0.1 wt.% Pr addition and rapid solidification process on Sn-9Zn solder alloy were investigated. Solder characteristics of the as-solidified and rapidly solidified Sn-9Zn-0.1Pr alloys were analyzed in comparison with those of the as-solidified Sn-9Zn alloy. Mechanical properties and interfacial microstructure of solder/Cu joints obtained using these solders were comparatively studied. By comparison with the as-solidified Sn-9Zn alloy, the wettability of the solder was obviously improved with 0.1 wt.% Pr addition, and the melting behavior of the solder was promoted due to the rapid solidification process. The corrosion resistance of Sn-9Zn-0.1Pr alloy was improved due to the refined microstructure resulting from 0.1 wt.% Pr addition and rapid solidification. The growth of IMCs at the interface of Sn-9Zn-0.1Pr/Cu joints was depressed in some degree. Rapid solidification process promoted the interfacial reaction during soldering and improved the bonding strength of joints.

  2. Effect of Joint Scale and Processing on the Fracture of Sn-3Ag-0.5Cu Solder Joints: Application to Micro-bumps in 3D Packages

    NASA Astrophysics Data System (ADS)

    Talebanpour, B.; Huang, Z.; Chen, Z.; Dutta, I.

    2016-01-01

    In 3-dimensional (3D) packages, a stack of dies is vertically connected to each other using through-silicon vias and very thin solder micro-bumps. The thinness of the micro-bumps results in joints with a very high volumetric proportion of intermetallic compounds (IMCs), rendering them much more brittle compared to conventional joints. Because of this, the reliability of micro-bumps, and the dependence thereof on the proportion of IMC in the joint, is of substantial concern. In this paper, the growth kinetics of IMCs in thin Sn-3Ag-0.5Cu joints attached to Cu substrates were analyzed, and empirical kinetic laws for the growth of Cu6Sn5 and Cu3Sn in thin joints were obtained. Modified compact mixed mode fracture mechanics samples, with adhesive solder joints between massive Cu substrates, having similar thickness and IMC content as actual micro-bumps, were produced. The effects of IMC proportion and strain rate on fracture toughness and mechanisms were investigated. It was found that the fracture toughness G C decreased with decreasing joint thickness ( h Joint). In addition, the fracture toughness decreased with increasing strain rate. Aging also promoted alternation of the crack path between the two joint-substrate interfaces, possibly proffering a mechanism to enhance fracture toughness.

  3. In situ synchrotron study of electromigration induced grain rotations in Sn solder joints.

    PubMed

    Shen, Hao; Zhu, Wenxin; Li, Yao; Tamura, Nobumichi; Chen, Kai

    2016-01-01

    Here we report an in situ study of the early stage of microstructure evolution induced by electromigration in a Pb-free β-Sn based solder joint by synchrotron polychromatic X-ray microdiffraction. With this technique, crystal orientation evolution is monitored at intragranular levels with high spatial and angular resolution. During the entire experiment, no crystal growth is detected, and rigid grain rotation is observed only in the two grains within the current crowding region, where high density and divergence of electric current occur. Theoretical calculation indicates that the trend of electrical resistance drop still holds under the present conditions in the grain with high electrical resistivity, while the other grain with low resistivity reorients to align its a-axis more parallel with the ones of its neighboring grains. A detailed study of dislocation densities and subgrain boundaries suggests that grain rotation in β-Sn, unlike grain rotation in high melting temperature metals which undergo displacive deformation, is accomplished via diffusional process mainly, due to the high homologous temperature. PMID:27086863

  4. In situ synchrotron study of electromigration induced grain rotations in Sn solder joints

    DOE PAGES

    Shen, Hao; Zhu, Wenxin; Li, Yao; Tamura, Nobumichi; Chen, Kai

    2016-04-18

    In this paper we report an in situ study of the early stage of microstructure evolution induced by electromigration in a Pb-free β-Sn based solder joint by synchrotron polychromatic X-ray microdiffraction. With this technique, crystal orientation evolution is monitored at intragranular levels with high spatial and angular resolution. During the entire experiment, no crystal growth is detected, and rigid grain rotation is observed only in the two grains within the current crowding region, where high density and divergence of electric current occur. Theoretical calculation indicates that the trend of electrical resistance drop still holds under the present conditions in themore » grain with high electrical resistivity, while the other grain with low resistivity reorients to align its a-axis more parallel with the ones of its neighboring grains. A detailed study of dislocation densities and subgrain boundaries suggests that grain rotation in β-Sn, unlike grain rotation in high melting temperature metals which undergo displacive deformation, is accomplished via diffusional process mainly, due to the high homologous temperature.« less

  5. In situ synchrotron study of electromigration induced grain rotations in Sn solder joints

    PubMed Central

    Shen, Hao; Zhu, Wenxin; Li, Yao; Tamura, Nobumichi; Chen, Kai

    2016-01-01

    Here we report an in situ study of the early stage of microstructure evolution induced by electromigration in a Pb-free β-Sn based solder joint by synchrotron polychromatic X-ray microdiffraction. With this technique, crystal orientation evolution is monitored at intragranular levels with high spatial and angular resolution. During the entire experiment, no crystal growth is detected, and rigid grain rotation is observed only in the two grains within the current crowding region, where high density and divergence of electric current occur. Theoretical calculation indicates that the trend of electrical resistance drop still holds under the present conditions in the grain with high electrical resistivity, while the other grain with low resistivity reorients to align its a-axis more parallel with the ones of its neighboring grains. A detailed study of dislocation densities and subgrain boundaries suggests that grain rotation in β-Sn, unlike grain rotation in high melting temperature metals which undergo displacive deformation, is accomplished via diffusional process mainly, due to the high homologous temperature. PMID:27086863

  6. In situ synchrotron study of electromigration induced grain rotations in Sn solder joints

    NASA Astrophysics Data System (ADS)

    Shen, Hao; Zhu, Wenxin; Li, Yao; Tamura, Nobumichi; Chen, Kai

    2016-04-01

    Here we report an in situ study of the early stage of microstructure evolution induced by electromigration in a Pb-free β-Sn based solder joint by synchrotron polychromatic X-ray microdiffraction. With this technique, crystal orientation evolution is monitored at intragranular levels with high spatial and angular resolution. During the entire experiment, no crystal growth is detected, and rigid grain rotation is observed only in the two grains within the current crowding region, where high density and divergence of electric current occur. Theoretical calculation indicates that the trend of electrical resistance drop still holds under the present conditions in the grain with high electrical resistivity, while the other grain with low resistivity reorients to align its a-axis more parallel with the ones of its neighboring grains. A detailed study of dislocation densities and subgrain boundaries suggests that grain rotation in β-Sn, unlike grain rotation in high melting temperature metals which undergo displacive deformation, is accomplished via diffusional process mainly, due to the high homologous temperature.

  7. Drop Reliability of Epoxy-contained Sn-58 wt.%Bi Solder Joint with ENIG and ENEPIG Surface Finish Under Temperature and Humidity Test

    NASA Astrophysics Data System (ADS)

    Myung, Woo-Ram; Kim, Yongil; Kim, Kyung-Yeol; Jung, Seung-Boo

    2016-07-01

    The influence of two kinds of surface finish, namely electroless nickel immersion gold (ENIG) and electroless nickel electroless palladium immersion gold (ENEPIG), on the interfacial reactions and drop reliability of epoxy-enhanced Sn-58 wt.%Bi solder has been investigated after temperature-humidity storage tests. The chemical composition and morphology of intermetallic compounds (IMCs) were characterized by scanning electron microscopy, energy-dispersive x-ray spectroscopy, and electron probe microanalysis. Also, the mechanical reliability of solder joints was evaluated using board-level drop tests. The Sn-Bi epoxy solder/ENEPIG joint exhibited higher IMC growth rate than the Sn-Bi epoxy solder/ENIG joint. After 500 h at 85°C/85% RH storage condition, new IMCs were formed on the Ni3Sn4 layer in samples with both surface finishes. The results of board-level drop tests showed that the number of drops was higher for the ENIG than the ENEPIG surface finish. Solder joint fracture occurred along the interface between the solder and IMC layer for the ENIG surface finish. However, with the ENEPIG surface finish, the crack propagated between the IMCs.

  8. Analysis of a short beam with application to solder joints: could larger stand-off heights relieve stress?

    NASA Astrophysics Data System (ADS)

    Suhir, Ephraim

    2015-08-01

    Physically meaningful and easy-to-use analytical (mathematical) stress model is developed for a short beam with clamped and known-in-advance offset ends. The analysis is limited to elastic deformations. While the classical Timoshenko short-beam theory seeks the beam's deflection caused by the combined bending and shear deformations for the given loading, an inverse problem is considered here: the lateral force is sought for the given ends offset. In short beams this force is larger than in long beams, since, in order to achieve the given displacement (offset), the applied force has to overcome both bending and shear resistance of the beam. It is envisioned that short beams could adequately mimic the state of stress in solder joint interconnections, including ball-grid-array (BGA) systems, with large, compared to conventional joints, stand-off heights. When the package/printed-circuit-board (PCB) assembly is subjected to the change in temperature, the thermal expansion (contraction) mismatch of the package and the PCB results in an easily predictable relative displacement (offset) of the ends of the solder joint. This offset can be determined from the known external thermal mismatch strain (determined as the product of the difference in the coefficients of thermal expansion and the change in temperature) and the position of the joint with respect to the mid-cross-section of the assembly. The maximum normal and shearing stresses could be viewed as suitable criteria of the beam's (joint's) material long-term reliability. It is shown that these stresses can be brought down by employing beam-like joints, i.e., joints with an increased stand-off height compared to conventional joints. It is imperative, of course, that, if such joints are employed, there is still enough interfacial real estate, so that the BGA bonding strength is not compromised. On the other hand, owing to the lower stress level, reliability assurance might be much less of a challenge than in the case of

  9. Effect of contact metallization on electromigration reliability of Pb-free solder joints

    NASA Astrophysics Data System (ADS)

    Ding, Min; Wang, Guotao; Chao, Brook; Ho, Paul S.; Su, Peng; Uehling, Trent

    2006-05-01

    The effect of underbump metallization (UBM) on electromigration (EM) lifetime and failure mechanism has been investigated for Pb-free solder bumps of 97Sn3Ag composition in the temperature range of 110-155 °C. The EM lifetime of the SnAg Pb-free solders with either Cu or Ni UBM was found to be better than the eutectic SnPb (63Sn37Pb) solders but worse than high-Pb (95Pb5Sn) solders. In the test temperature range, the EM lifetimes were found to be comparable for Cu and Ni UBMs but with different activation energies: 0.64-0.72 eV for Cu UBM and 1.03-1.11 eV for Ni UBM. EM failure was observed only in solder bumps with electron current flow from UBM to the substrate. Failure analysis revealed that EM damage was initiated by the formation of intermetallic compounds (IMC) at the UBM/solder interface which was found to be significantly enhanced by mass transport driven by the electron current. Under EM, the continued growth of IMC with the dissolution of the UBM and the accumulation of Kirkendall voids resulted in the formation of interfacial cracks and eventual EM failure of the solder bump. For Ni UBM, the IMC formation was dominated by the Ni3Sn4 phase while for Cu UBM, a bilayer of Cu3Sn/Cu6Sn5 was found. Void formation at the Cu6Sn5/solder interface was found to be important in controlling the EM lifetime of the Cu UBM solder.

  10. Study of the thermal stress in a Pb-free half-bump solder joint under current stressing

    SciTech Connect

    Wu, B. Y.; Chan, Y. C.; Zhong, H. W.; Alam, M. O.; Lai, J. K. L.

    2007-06-04

    The thermal stress in a Sn3.5Ag1Cu half-bump solder joint under a 3.82x10{sup 8} A/m{sup 2} current stressing was analyzed using a coupled-field simulation. Substantial thermal stress accumulated around the Al-to-solder interface, especially in the Ni+(Ni,Cu){sub 3}Sn{sub 4} layer, where a maximal stress of 138 MPa was identified. The stress gradient in the Ni layer was about 1.67x10{sup 13} Pa/m, resulting in a stress migration force of 1.82x10{sup -16} N, which is comparable to the electromigration force, 2.82x10{sup -16} N. Dissolution of the Ni+(Ni,Cu){sub 3}Sn{sub 4} layer, void formation with cracks at the anode side, and extrusions at the cathode side were observed.

  11. Investigation on the Microstructure, Interfacial IMC Layer, and Mechanical Properties of Cu/Sn-0.7Cu- xNi/Cu Solder Joints

    NASA Astrophysics Data System (ADS)

    Yang, Li; Ge, Jinguo; Zhang, Yaocheng; Dai, Jun; Liu, Haixiang; Xiang, Jicen

    2016-07-01

    Sn-0.7Cu- xNi composite solder has been fabricated via mechanical mixing of different weight percentages of Ni particles with Sn-0.7Cu solder paste, and the effect of the Ni concentration on the microstructure, wettability, and tensile properties of Cu/Sn-0.7Cu- xNi/Cu solder joints investigated. The results show that refined dot-shaped particles of intermetallic compounds (IMCs) are uniformly dispersed in a primary β-Sn matrix in the Cu/Sn-0.7Cu-(0.05-0.1)Ni/Cu solder joints. The interfacial IMC layer thickness increased slightly when adding Ni content to 0.05 wt.%, then rapidly when further increasing the Ni concentration to 0.4 wt.%. Excellent wettability with bright appearance was obtained for the Sn-0.7Cu-0.05Ni solder due to diminished interfacial tension. The tensile properties improved after adding Ni content to 0.05 wt.% due to the presence of the refined dot-like IMC particles, in agreement with theoretical predictions based on the combination of dispersion and grain-refinement strengthening mechanisms. Refined microstructure and enhanced mechanical properties were obtained for the Cu/Sn-0.7Cu-0.05Ni/Cu solder joint.

  12. Growth Behavior of Intermetallic Compounds in Cu/Sn3.0Ag0.5Cu Solder Joints with Different Rates of Cooling

    NASA Astrophysics Data System (ADS)

    Yang, Linmei; Zhang, Z. F.

    2015-01-01

    The growth behavior of intermetallic compounds (IMC) in Cu/Sn3.0Ag0.5Cu solder joints, including the interfacial Cu6Sn5 layer and Ag3Sn, and Cu6Sn5 in the solder, were investigated when different cooling methods—quenched water, cooling in air, and cooling in a furnace after reflow—were used. For the solder joint quenched in water, no obvious Cu6Sn5 or Ag3Sn was detected in the solder, and the thickness of interfacial Cu6Sn5 layer was slightly thinner than that of the joint cooled in air. On the basis of results from scanning electron microscopy and energy-dispersive spectrometry, a mechanism is proposed for growth of IMC in Sn3.0Ag0.5Cu solder during solidification. The rate of cooling has a substantial effect on the morphology and size of Ag3Sn, which evolved into large plate-like shapes when the joint was cooled slowly in a furnace. However, the morphology of Ag3Sn was branch-like or particle-like when the joint was cooled in air. This is attributed to re-growth of Ag3Sn grains via substantial atomic diffusion during the high-temperature stage of furnace cooling.

  13. Early stage of material movements in eutectic SnPb solder joint undergoing current stressing at 150{degree}C.

    SciTech Connect

    Ho, C. E.; Lee, A.; Subramanian, K. N.; Liu, W.; Michigan State Univ.

    2007-07-10

    X-ray fluorescence spectroscopy was used to study movements of Sn and Pb in the eutectic SnPb solder joint undergoing electromigration with a current density of 10{sup 4} A/cm{sup 2} at 150 C. During early stages of current stressing, Sn moves toward the anode faster than Pb. However, on continued application of current stressing, both Sn and Pb will continue to accumulate at the anode. Such accumulation of conductive species facilitates the formation of hillock with associated valley near the cathode.

  14. Methodology for analyzing stress states during in-situ thermomechanical cycling in individual lead free solder joints using synchrotron radiation

    SciTech Connect

    Zhou, Bite; Bieler, Thomas R.; Lee , Tae-Kyu; Liu, Kuo-Chuan

    2010-07-22

    To examine how a lead-free solder joint deforms in a thermal cycling environment, both the elastic and plastic stress and strain behavior must be understood. Methods to identify evolution of the internal strain (stress) state during thermal cycling are described. A slice of a package containing a single row of solder joints was thermally cycled from 0 C to 100 C with a period of about 1 h with concurrent acquisition of transmission Laue patterns using synchrotron radiation. These results indicated that most joints are single crystals, with some being multicrystals with no more than a few Sn grain orientations. Laue patterns were analyzed to estimate local strains in different crystal directions at different temperatures during a thermal cycle. While the strains perpendicular to various crystal planes all vary in a similar way, the magnitude of strain varies. The specimens were subsequently given several hundred additional thermal cycles and measured again to assess changes in the crystal orientations. These results show that modest changes in crystal orientations occur during thermal cycling.

  15. Controlling Interfacial Reactions and Intermetallic Compound Growth at the Interface of a Lead-free Solder Joint with Layer-by-Layer Transferred Graphene.

    PubMed

    Ko, Yong-Ho; Lee, Jong-Dae; Yoon, Taeshik; Lee, Chang-Woo; Kim, Taek-Soo

    2016-03-01

    The immoderate growth of intermetallic compounds (IMCs) formed at the interface of a solder metal and the substrate during soldering can degrade the mechanical properties and reliability of a solder joint in electronic packaging. Therefore, it is critical to control IMC growth at the solder joints between the solder and the substrate. In this study, we investigated the control of interfacial reactions and IMC growth by the layer-by-layer transfer of graphene during the reflow process at the interface between Sn-3.0Ag-0.5Cu (in wt %) lead-free solder and Cu. As the number of graphene layers transferred onto the surface of the Cu substrate increased, the thickness of the total IMC (Cu6Sn5 and Cu3Sn) layer decreased. After 10 repetitions of the reflow process for 50 s above 217 °C, the melting temperature of Sn-3.0Ag-0.5Cu, with a peak temperature of 250 °C, the increase in thickness of the total IMC layer at the interface with multiple layers of graphene was decreased by more than 20% compared to that at the interface of bare Cu without graphene. Furthermore, the average diameter of the Cu6Sn5 scallops at the interface with multiple layers of graphene was smaller than that at the interface without graphene. Despite 10 repetitions of the reflow process, the growth of Cu3Sn at the interface with multiple layers of graphene was suppressed by more than 20% compared with that at the interface without graphene. The multiple layers of graphene at the interface between the solder metal and the Cu substrate hindered the diffusion of Cu atoms from the Cu substrate and suppressed the reactions between Cu and Sn in the solder. Thus, the multiple layers of graphene transferred at the interface between dissimilar metals can control the interfacial reaction and IMC growth occurring at the joining interface. PMID:26856638

  16. Single Image Camera Calibration in Close Range Photogrammetry for Solder Joint Analysis

    NASA Astrophysics Data System (ADS)

    Heinemann, D.; Knabner, S.; Baumgarten, D.

    2016-06-01

    Printed Circuit Boards (PCB) play an important role in the manufacturing of electronic devices. To ensure a correct function of the PCBs a certain amount of solder paste is needed during the placement of components. The aim of the current research is to develop an real-time, closed-loop solution for the analysis of the printing process where solder is printed onto PCBs. Close range photogrammetry allows for determination of the solder volume and a subsequent correction if necessary. Photogrammetry is an image based method for three dimensional reconstruction from two dimensional image data of an object. A precise camera calibration is indispensable for an accurate reconstruction. In our certain application it is not possible to use calibration methods with two dimensional calibration targets. Therefore a special calibration target was developed and manufactured, which allows for single image camera calibration.

  17. An evaluation of the spring finger solder joints on SA1358-10 and SA2052-4 connector assemblies (MC3617,W87).

    SciTech Connect

    Kilgo, Alice C.; Vianco, Paul Thomas; Hlava, Paul Frank; Zender, Gary L.

    2006-08-01

    The SA1358-10 and SA2052-4 circular JT Type plug connectors are used on a number of nuclear weapons and Joint Test Assembly (JTA) systems. Prototype units were evaluated for the following specific defects associated with the 95Sn-5Sb (Sn-Sb, wt.%) solder joint used to attach the beryllium-copper (BeCu) spring fingers to the aluminum (Al) connector shell: (1) extended cracking within the fillet; (2) remelting of the solder joint during the follow-on, soldering step that attached the EMR adapter ring to the connector shell (and/or soldering the EMR shell to the adapter ring) that used the lower melting temperature 63Sn-37Pb (Sn-Pb) alloy; and (3) spalling of the Cd (Cr) layer overplating layer from the fillet surface. Several pedigrees of connectors were evaluated, which represented older fielded units as well as those assemblies that were recently constructed at Kansas City Plant. The solder joints were evaluated that were in place on connectors made with the current soldering process as well as an alternative induction soldering process for attaching the EMR adapter ring to the shell. Very similar observations were made, which crossed the different pedigrees of parts and processes. The extent of cracking in the top side fillets varied between the different connector samples and likely the EMR adapter ring to the shell. Very similar observations were made, which crossed the different pedigrees of parts and processes. The extent of cracking in the top side fillets varied between the different connector samples and likely reflected the different extents to which the connector was mated to its counterpart assembly. In all cases, the spring finger solder joints on the SA1358-10 connectors were remelted as a result of the subsequent EMR adapter ring attachment process. Spalling of the Cd (Cr) overplating layer was also observed for these connectors, which was a consequence of the remelting activity. On the other hand, the SA2052-4 connector did not exhibit evidence of

  18. Lead-free solder

    DOEpatents

    Anderson, Iver E.; Terpstra, Robert L.

    2001-05-15

    A Sn--Ag--Cu eutectic alloy is modified with one or more low level and low cost alloy additions to enhance high temperature microstructural stability and thermal-mechanical fatigue strength without decreasing solderability. Purposeful fourth or fifth element additions in the collective amount not exceeding about 1 weight % (wt. %) are added to Sn--Ag--Cu eutectic solder alloy based on the ternary eutectic Sn--4.7%Ag--1.7%Cu (wt. %) and are selected from the group consisting essentially of Ni, Fe, and like-acting elements as modifiers of the intermetallic interface between the solder and substrate to improve high temperature solder joint microstructural stability and solder joint thermal-mechanical fatigue strength.

  19. Detecting Defective Solder Bonds

    NASA Technical Reports Server (NTRS)

    Paulson, R.; Barney, J.; Decker, H. J.

    1984-01-01

    Method is noncontact and nondestructive. Technique detects solder bonds in solar array of other large circuit board, using thermal-imaging camera. Board placed between heat lamp and camera. Poor joints indiated by "cold" spots on the infrared image.

  20. Effect of Thermal Aging on the Mechanical Properties of Sn3.0Ag0.5Cu/Cu Solder Joints Under High Strain Rate Conditions

    NASA Astrophysics Data System (ADS)

    Nguyen, Van Luong; Kim, Ho-Kyung

    2015-07-01

    Shear tests with velocities between 0.5 m/s and 2.5 m/s were conducted to investigate the deformation characteristics of 0.76 mm lead-free Sn-3Ag-0.5Cu solder ball joints after thermal aging at 373 K up to 1000 h. A scanning electron microscope equipped with energy dispersive spectroscopy was then used to examine the fracture surfaces and microstructures of the solder joints. The results showed that the main failure mode of the solder joints was the brittle interfacial fracture mode with cleavage failure in the intermetallic compound (IMC). The maximum shear strength and the fracture toughness ( K C) of the solder joint decreased substantially after aging for the initial aging time, after which they decreased gradually with further aging or an increase in the strain rate. The evolution of the IMC layer when it was thicker and had coarser nodules due to thermal aging was the primary cause of the reduction in the shear strength and fracture toughness in this study.

  1. Thermal Cycling Life Prediction of Sn-3.0Ag-0.5Cu Solder Joint Using Type-I Censored Data

    PubMed Central

    Mi, Jinhua; Yang, Yuan-Jian; Huang, Hong-Zhong

    2014-01-01

    Because solder joint interconnections are the weaknesses of microelectronic packaging, their reliability has great influence on the reliability of the entire packaging structure. Based on an accelerated life test the reliability assessment and life prediction of lead-free solder joints using Weibull distribution are investigated. The type-I interval censored lifetime data were collected from a thermal cycling test, which was implemented on microelectronic packaging with lead-free ball grid array (BGA) and fine-pitch ball grid array (FBGA) interconnection structures. The number of cycles to failure of lead-free solder joints is predicted by using a modified Engelmaier fatigue life model and a type-I censored data processing method. Then, the Pan model is employed to calculate the acceleration factor of this test. A comparison of life predictions between the proposed method and the ones calculated directly by Matlab and Minitab is conducted to demonstrate the practicability and effectiveness of the proposed method. At last, failure analysis and microstructure evolution of lead-free solders are carried out to provide useful guidance for the regular maintenance, replacement of substructure, and subsequent processing of electronic products. PMID:25121138

  2. Thermal cycling life prediction of Sn-3.0Ag-0.5Cu solder joint using type-I censored data.

    PubMed

    Mi, Jinhua; Li, Yan-Feng; Yang, Yuan-Jian; Peng, Weiwen; Huang, Hong-Zhong

    2014-01-01

    Because solder joint interconnections are the weaknesses of microelectronic packaging, their reliability has great influence on the reliability of the entire packaging structure. Based on an accelerated life test the reliability assessment and life prediction of lead-free solder joints using Weibull distribution are investigated. The type-I interval censored lifetime data were collected from a thermal cycling test, which was implemented on microelectronic packaging with lead-free ball grid array (BGA) and fine-pitch ball grid array (FBGA) interconnection structures. The number of cycles to failure of lead-free solder joints is predicted by using a modified Engelmaier fatigue life model and a type-I censored data processing method. Then, the Pan model is employed to calculate the acceleration factor of this test. A comparison of life predictions between the proposed method and the ones calculated directly by Matlab and Minitab is conducted to demonstrate the practicability and effectiveness of the proposed method. At last, failure analysis and microstructure evolution of lead-free solders are carried out to provide useful guidance for the regular maintenance, replacement of substructure, and subsequent processing of electronic products. PMID:25121138

  3. Viscoplasticity Behavior of a Solder Joint on a Drilled Cu Pillar Bump Under Thermal Cycling Using FEA

    NASA Astrophysics Data System (ADS)

    Kwon, Yong-Hyuk; Bang, Hee-Seon; Bang, Han-Sur

    2016-10-01

    ABSTRACT Although the copper (Cu) pillar bump (CPB) was developed in accordance with recent trends of miniaturized, multifunctional, and high-performance technology, its thermomechanical reliability remains in question. Accordingly, a hole was drilled into a CPB to increase its thermomechanical reliability, and the viscoplasticity behaviors of the two structures were subsequently compared through finite element analysis. In particular, this study applied the Anand model, which addresses both plastic strain and creep strain, as well as a submodeling technique to increase the accuracy of the analysis and decrease the analysis time. In addition, this study confirmed the superiority of the thermomechanical reliability of drilled Cu pillar bump through a hysteresis loop, which showed the equivalent stress versus equivalent inelastic strain of the solder joint interfaces. Moreover, the study compared the inelastic strain energy density values. The results demonstrated that the drilled copper pillar bump does indeed have a smaller inelastic range and a lower inelastic strain energy density.

  4. ZnO-Au-SnO2 Z-scheme photoanodes for remarkable photoelectrochemical water splitting.

    PubMed

    Li, Jing-Mei; Cheng, Hao-Yun; Chiu, Yi-Hsuan; Hsu, Yung-Jung

    2016-08-25

    For the first time a ZnO nanorod-based Z-scheme heterostructure system was proposed and realized for efficient photoelectrochemical water splitting. The samples were prepared by depositing a thin layer of SnO2 on the Au surface of Au particle-decorated ZnO nanorods. For ZnO-Au-SnO2 nanorods, the embedded Au can mediate interfacial charge transfer by promoting electron transfer from the conduction band of SnO2 to the valence band of ZnO. This vectorial charge transfer resulted in the situation that the photoexcited electrons accumulated at ZnO while the photogenerated holes concentrated at SnO2, giving ZnO-Au-SnO2 substantially high redox powers. Time-resolved photoluminescence spectra suggested that the interfacial charge transfer across the ZnO/Au/SnO2 interface was significantly improved as a result of the Z-scheme charge transfer mechanism. With the substantially high redox powers and significantly improved interfacial charge transfer, ZnO-Au-SnO2 nanorods performed much better as a photoanode in photoelectrochemical water splitting than pristine ZnO, plasmonic Au-decorated ZnO and type-II SnO2-coated ZnO nanorods did. The present study has provided a viable approach to exploit Z-scheme photoanodes in the design of efficient artificial photosynthesis systems for solar energy conversion. PMID:27527337

  5. Solder poisoning

    MedlinePlus

    ... when someone swallows solder in large amounts. Skin burns can occur if solder touches the skin. This ... urine output EYES, EARS, NOSE, MOUTH, AND THROAT Burns in mouth and throat Yellow eyes (jaundice) STOMACH ...

  6. Heat Lamps Solder Solar Array Quickly

    NASA Technical Reports Server (NTRS)

    Coyle, P. J.; Crouthamel, M. S.

    1982-01-01

    Interconnection tabs in a nine-solar-cell array have been soldered simultaneously with radiant heat. Cells and tabs are held in position for soldering by sandwiching them between compliant silicone-rubber vacuum platen and transparent polyimide sealing membrane. Heat lamps warm cells, producing smooth, flat solder joints of high quality.

  7. A thermodynamics based damage mechanics framework for fatigue analysis of microelectronics solder joints with size effects

    NASA Astrophysics Data System (ADS)

    Gomez, Juan

    Experimental observations of an increase in resistance with decreasing specimen size and under the presence of non-uniform plastic deformation fields have pushed the development for small scale plasticity theories since the early 90's. The observed phenomenon has been explained in terms of an accumulation of a density of geometrically necessary dislocations, which is required in order to accommodate nonuniform plastic deformation fields. This extra density of dislocations, contributes to the additional hardening observed in small scale specimens under imposed non-uniform plastic deformations. The density of geometrically necessary dislocations has been related to the gradients of plastic strain which are imposed either by the loading conditions or the geometry of the specimen. The proposed set of theories has promoted the idea that there is an additional material parameter, namely a plastic length scale. Within these theories when the material is under the presence of a non-uniform plastic deformation field and once typical structural dimensions approaches the material length scale there is an increase in resistance. Such a class of mathematical framework is currently known as strain gradient plasticity (SGP) theory. On the other hand, the current trend towards miniaturization in the microelectronics industry has raised questions about the true behavior of small structural systems. In this dissertation we address such a problem but from the perspective of eutectic solder alloys. Eutectic solder alloys as frequently used in the microelectronics industry exhibit considerable rate dependent response even at room temperature. Moreover for this type of material, the problem of interest is the response under cyclic loadings induced by thermomechanical fatigue leading to the classical case of creep-fatigue interaction. Several experimental and theoretical studies have been developed in order to generate robust constitutive descriptions for this class of applications. For

  8. Bonding nature of rare-earth-containing lead-free solders

    NASA Astrophysics Data System (ADS)

    Ramirez, Ainissa G.; Mavoori, Hareesh; Jin, Sungho

    2002-01-01

    The ability of rare-earth-containing lead-free solders to wet and bond to silica was investigated. Small additions of Lu (0.5-2 wt. %) added to eutectic Sn-Ag or Au-Sn solder render it directly solderable to a silicon oxide surface. The bonding is attributed to the migration of the rare-earth element to the solder-silica interface for chemical reaction and the creation of an interfacial layer that contains a rare-earth oxide. It was found that additions of rare-earth materials did not significantly modify the solidification microstructure or the melting point. Such oxide-bondable solders can be useful for assembly of various optical communication devices.

  9. Pursuing low joint resistivity in Cu-stabilized REBa2Cu3O δ coated conductor tapes by the ultrasonic weld-solder hybrid method

    NASA Astrophysics Data System (ADS)

    Shin, Hyung-Seop; Kim, Jong-min; Dedicatoria, Marlon J.

    2016-01-01

    Development of a coated conductor tape joint with good quality and low joint resistivity, R sj, in terms of transport and mechanical properties, was attempted by direct bonding at the interface of the Cu-Cu stabilizers in overlapped GdBCO CC tapes. In this study, we attempted to achieve a low R sj by introducing hybrid joining, soldering and ultrasonic welding (UW), and its mechanism was analyzed theoretically. Coated conductor tapes were experimentally joined using various methods of soldering, UW, and combinations of the two. As a result, a much lower R sj of about 57 nΩ · cm2 was obtained for RCE-DR-processed GdBCO CC tape joints using the hybrid joining method. The mechanical properties of the jointed CC tapes were also evaluated at room temperature and 77 K under self-field. Load-displacement curves of joined CC tapes followed the curve of the single CC tape. Critical current and joint resistance, R j, of hybrid-joined CC tape were retained after double bending at room temperature up to 20 mm bending diameter.

  10. Effect of firing conditions on thick film microstructure and solder joint strength for low-temperature, co-fired ceramic substrates

    SciTech Connect

    Hernandez, C.L.; Vianco, P.T.; Rejent, J.A.

    2000-01-04

    Low-temperature, co-fired ceramics (LTCC) are the substrate material-of-choice for a growing number of multi-chip module (MCM) applications. Unlike the longer-standing hybrid microcircuit technology based upon alumina substrates, the manufacturability and reliability of thick film solder joints on LTCC substrates have not been widely studied. An investigation was undertaken to fully characterize solder joints on these substrates. A surface mount test vehicle with Daisy chain electrical connections was designed and built with Dupont{trademark} 951 tape. The Dupont{trademark} 4569 thick film ink (Au76-Pt21-Pd3 wt.%) was used to establish the surface conductor pattern. The conductor pattern was fired onto the LTCC substrate in a matrix of processing conditions that included: (1) double versus triple prints, (2) dielectric window versus no window, and (3) three firing temperatures (800 C, 875 C and 950 C). Sn63-Pb37 solder paste with an RMA flux was screen printed onto the circuit boards. The appropriate packages, which included five sizes of chip capacitors and four sizes of leadless ceramic chip carriers, were placed on the circuit boards. The test vehicles were oven reflowed under a N{sub 2} atmosphere. Nonsoldered pads were removed from the test vehicles and the porosity of their thick film layers was measured using quantitative image analysis in both the transverse and short transverse directions. A significant dependence on firing temperature was recorded for porosity. The double printed substrates without a dielectric window revealed a thick film porosity of 31.2% at 800 C, 26.2% at 875 C and 20.4% at 950 C. In contrast, the thick film porosity of the triple printed substrates with a dielectric window is 24.1% at 800 C, 23.2% at 875 C and 17.6% at 950 C. These observations were compared with the shear strength of the as-fabricated chip capacitor solder joints to determine the effect of firing conditions on solder joint integrity. The denser films from the higher

  11. Frequency-Dependent Low Cycle Fatigue of Sn1Ag0.1Cu(In/Ni) Solder Joints Subjected to High-Frequency Loading

    NASA Astrophysics Data System (ADS)

    Wong, E. H.; Seah, S. K. W.; Shim, V. P. W.

    2014-02-01

    The low-cycle-fatigue characteristics of solder joints, formed by reflowing Sn98.8/Ag1.0/Cu0.1/In0.05/Ni0.02 solder over electroless nickel immersion gold-plated copper pads, were investigated by dynamic cyclic bending of printed circuit boards (PCBs). The PCB strain amplitudes were varied from 1.2 × 10-3 to 2.4 × 10-3 and the flexural frequencies ranged from 30 Hz to 150 Hz, to simulate drop impact-induced PCB resonant frequencies. A trend of drastically decreasing fatigue life with cyclic frequency was observed, in contrast with previous reports indicating the reverse; this is attributed to the different failure mechanisms activated. A systematic procedure involving optimization followed by transformation was used to condense the strain-frequency-life data into a master curve expressed in strain-life space.

  12. Microstructural Evolution and Mechanical Properties in (AuSn)eut-Cu Interconnections

    NASA Astrophysics Data System (ADS)

    Dong, Hongqun; Vuorinen, Vesa; Laurila, Tomi; Paulasto-Kröckel, Mervi

    2016-06-01

    The interfacial reactions between the widely employed solder Au-20wt.%Sn and the common contact metallizations (e.g. Ni, Cu and Pt) are normally complex and not well determined. In order to identify the proper contactor for Au-20wt.%Sn solder, the present study focuses on (1) rationalizing the interfacial reaction mechanisms of Au-20wt.%Sn|Cu as well as (2) measuring the mechanical properties of individual intermetallics formed at the interface. The evolution of interfacial reaction products were rationalized by using the experimental results in combination with the calculated Au-Cu-Sn phase diagram information. It was found that the growth of the AuCu interfacial intermetallic layer was diffusion-controlled. The diffusion path of Au-20wt.%Sn|Cu at 150°C was proposed. The hardness and indentation modulus of the interfacial reaction products were measured using nanoindentation tests. The results revealed a significant influence of the Cu solubility on the mechanical properties of (Au,Cu)Sn and (Au,Cu)5Sn, i.e. their hardness and contact modulus increased with the increase in the amount of Cu. Furthermore, results obtained here for the Au-20wt.%Sn|Cu joints were compared to those from Au-20wt.%Sn|Ni in order to assess the similarities and differences between these widely used interconnection metallization systems.

  13. Microstructural Evolution and Mechanical Properties in (AuSn)eut-Cu Interconnections

    NASA Astrophysics Data System (ADS)

    Dong, Hongqun; Vuorinen, Vesa; Laurila, Tomi; Paulasto-Kröckel, Mervi

    2016-10-01

    The interfacial reactions between the widely employed solder Au-20wt.%Sn and the common contact metallizations (e.g. Ni, Cu and Pt) are normally complex and not well determined. In order to identify the proper contactor for Au-20wt.%Sn solder, the present study focuses on (1) rationalizing the interfacial reaction mechanisms of Au-20wt.%Sn|Cu as well as (2) measuring the mechanical properties of individual intermetallics formed at the interface. The evolution of interfacial reaction products were rationalized by using the experimental results in combination with the calculated Au-Cu-Sn phase diagram information. It was found that the growth of the AuCu interfacial intermetallic layer was diffusion-controlled. The diffusion path of Au-20wt.%Sn|Cu at 150°C was proposed. The hardness and indentation modulus of the interfacial reaction products were measured using nanoindentation tests. The results revealed a significant influence of the Cu solubility on the mechanical properties of (Au,Cu)Sn and (Au,Cu)5Sn, i.e. their hardness and contact modulus increased with the increase in the amount of Cu. Furthermore, results obtained here for the Au-20wt.%Sn|Cu joints were compared to those from Au-20wt.%Sn|Ni in order to assess the similarities and differences between these widely used interconnection metallization systems.

  14. Microstructural influences on the mechanical properties of solder

    SciTech Connect

    Morris, J.W. Jr.; Goldstein, J.L.F.; Mei, Z.

    1993-04-01

    Intent of this book is to review analytic methods for predicting behavior of solder joints, based on continuum mechanics. The solder is treated as a continuous, homogeneous body, or composite of such bodies, whose mechanical behavior is uniform and governed by simple constitutive equations. The microstructure of a solder joint influences its mechanical properties in 3 ways: it governs deformation and failure; common solders deform inhomogeneously; and common solders are microstructurally unstable. The variety of microstructures often found in solder joints are briefly reviewed, and some of the ways are discussed in which the microstructure influences the common types of high-temperature mechanical behavior. 25 figs, 40 refs.

  15. Encapsuled nanoreactors (Au@SnO₂): a new sensing material for chemical sensors.

    PubMed

    Wang, Lili; Dou, Huimin; Lou, Zheng; Zhang, Tong

    2013-04-01

    New Au@SnO2 yolk-shell nanospheres have been successfully synthesized by using Au@SiO2 nanospheres as sacrificial templates. This process is environmentally friendly and is based on hydrothermal shell-by-shell deposition of polycrystalline SnO2 on spheriform Au@SiO2 nanotemplates. Au nanoparticles can be impregnated into the SnO2 nanospheres and the nanospheres show outer diameters of 110 nm and thicknesses of 15 nm. The possible growth model of the nanospheres is proposed. The gas sensing properties of the Au@SnO2 yolk-shell nanospheres were researched and compared with that of the hollow SnO2 nanospheres. The former shows lower operating temperature (210 °C), lower detection limit (5 ppm), faster response (0.3 s) and better selectivity. These improved sensing properties were attributed to the catalytic effect of Au, and enhanced electron depletion at the surface of the Au@SnO2 yolk-shell nanospheres.

  16. Encapsuled nanoreactors (Au@SnO2): a new sensing material for chemical sensors

    NASA Astrophysics Data System (ADS)

    Wang, Lili; Dou, Huimin; Lou, Zheng; Zhang, Tong

    2013-03-01

    New Au@SnO2 yolk-shell nanospheres have been successfully synthesized by using Au@SiO2 nanospheres as sacrificial templates. This process is environmentally friendly and is based on hydrothermal shell-by-shell deposition of polycrystalline SnO2 on spheriform Au@SiO2 nanotemplates. Au nanoparticles can be impregnated into the SnO2 nanospheres and the nanospheres show outer diameters of 110 nm and thicknesses of 15 nm. The possible growth model of the nanospheres is proposed. The gas sensing properties of the Au@SnO2 yolk-shell nanospheres were researched and compared with that of the hollow SnO2 nanospheres. The former shows lower operating temperature (210 °C), lower detection limit (5 ppm), faster response (0.3 s) and better selectivity. These improved sensing properties were attributed to the catalytic effect of Au, and enhanced electron depletion at the surface of the Au@SnO2 yolk-shell nanospheres.

  17. Wetting behavior of alternative solder alloys

    SciTech Connect

    Hosking, F.M.; Vianco, P.T.; Hernandez, C.L.; Rejent, J.A.

    1993-07-01

    Recent economic and environmental issues have stimulated interest in solder alloys other than the traditional Sn-Pb eutectic or near eutectic composition. Preliminary evaluations suggest that several of these alloys approach the baseline properties (wetting, mechanical, thermal, and electrical) of the Sn-Pb solders. Final alloy acceptance will require major revisions to existing industrial and military soldering specifications. Bulk alloy and solder joint properties are consequently being investigated to validate their producibility and reliability. The work reported in this paper examines the wetting behavior of several of the more promising commercial alloys on copper substrates. Solder wettability was determined by the meniscometer and wetting balance techniques. The wetting results suggest that several of the alternative solders would satisfy pretinning and surface mount soldering applications. Their use on plated through hole technology might be more difficult since the alloys generally did not spread or flow as well as the 60Sn-40Pb solder.

  18. In situ observation of thermomigration of Sn atoms to the hot end of 96.5Sn-3Ag-0.5Cu flip chip solder joints

    NASA Astrophysics Data System (ADS)

    Ouyang, Fan-Yi; Kao, C.-L.

    2011-12-01

    In this study, we investigated the phenomenon of thermomigration in 96.5Sn-3Ag-0.5Cu flip chip solder joints at an ambient temperature of 150 °C. We observed mass protrusion on the chip side (hot end), indicating that Sn atoms moved to the hot end, and void formation on the substrate side (cold end). The diffusion markers also moved to the substrate side, in the same direction of the vacancy flux, indicating that the latter played a dominant role during the thermomigration process. The molar heat of transport (Q*) of the Sn atoms was 3.38 kJ/mol.

  19. Formation of solid-solution Cu-to-Cu joints using Ga solder and Pt under bump metallurgy for three-dimensional integrated circuits

    NASA Astrophysics Data System (ADS)

    Lin, Shih-kang; Chang, Hao-miao; Cho, Cheng-liang; Liu, Yu-chen; Kuo, Yi-kai

    2015-07-01

    Three-dimensional (3D) integrated circuits (ICs) are the most important packaging technology for next-generation semiconductors. Cu-to-Cu throughsilicon via interconnections with micro-bumps are key components in the fabrication of 3D ICs. However, significant reliability concerns have been raised due to the formation of brittle intermetallic compounds in the entire 3D IC joints. This study proposes a Ga-based Cu-to-Cu bonding technology with Pt under bump metallurgy (UBM). A systematic analysis of reactive wetting between Ga solders and polycrystalline, single-crystalline, and Ptcoated Cu substrates was conducted. Pt UBM as a wetting layer was identified to be a key component for Ga-based Cu-to-Cu bonding. Pt-coated Cu substrates were bonded using Ga solders with various Ga-to-Pt ratios ( n) at 300℃. When n ≥ 4, the Cu/Pt/Ga/Pt/Cu interface evolves to Cu/facecentered cubic (fcc)/γ1-Cu9Ga4/fcc/Cu, Cu/fcc/γ1-Cu9Ga4 + Ga7Pt3/fcc/Cu, and finally Cu/fcc + Ga7Pt3/Cu structures. The desired ductile solid solution joint formed with discrete Ga7Pt3 precipitates. When n ≤ 1, a Cu/Ga7Pt3/Cu joint formed without Cu actively participating in the reactions. The reaction mechanism and microstructure evolution were elaborated with the aid of CALPHAD thermodynamic modeling. [Figure not available: see fulltext.

  20. The Role of Elastic and Plastic Anisotropy of Sn in Recrystallization and Damage Evolution During Thermal Cycling in SAC305 Solder Joints

    SciTech Connect

    Bieler, Thomas R.; Zhou, Bite; Blair, Lauren; Zamiri, Amir; Darbandi, Payam; Pourboghrat, Farhang; Lee, Tae-Kyu; Liu, Kuo-Chuan

    2013-04-08

    Because failures in lead-free solder joints occur at locations other than the most highly shear-strained regions, reliability prediction is challenging. To gain physical understanding of this phenomenon, physically based understanding of how elastic and plastic deformation anisotropy affect microstructural evolution during thermomechanical cycling is necessary. Upon solidification, SAC305 (Sn-3.0Ag-0.5Cu) solder joints are usually single or tricrystals. The evolution of microstructures and properties is characterized statistically using optical and orientation imaging microscopy. In situ synchrotron x-ray measurements during thermal cycling are used to examine how crystal orientation and thermal cycling history change strain history. Extensive characterization of a low-stress plastic ball grid array (PBGA) package design at different stages of cycling history is compared with preliminary experiments using higher-stress package designs. With time and thermal history, microstructural evolution occurs mostly from continuous recrystallization and particle coarsening that is unique to each joint, because of the specific interaction between local thermal and displacement boundary conditions and the strong anisotropic elastic, plastic, expansion, and diffusional properties of Sn crystals. The rate of development of recrystallized microstructures is a strong function of strain and aging. Cracks form at recrystallized (random) boundaries, and then percolate through recrystallized regions. Complications arising from electromigration and corrosion are also considered.

  1. Rapid diagnosis of electromigration induced failure time of Pb-free flip chip solder joints by high resolution synchrotron radiation laminography

    NASA Astrophysics Data System (ADS)

    Tian, Tian; Xu, Feng; Kyu Han, Jung; Choi, Daechul; Cheng, Yin; Helfen, Lukas; Di Michiel, Marco; Baumbach, Tilo; Tu, K. N.

    2011-08-01

    We performed a rapid diagnosis of electromigration induced void nucleation and growth in Pb-free flip chip solder joints. Quantitative measurements of the growth rate of voids during the stressing by 1.0 × 104 A/cm2 and 7.5 × 103 A/cm2 at 125 °C were conducted by synchrotron radiation high resolution x-ray laminography. The results were analyzed by the statistical model of Weibull distribution function [W. Weibull, ASME Trans. J. Appl. Mech. 18(3), 293 (1951)] of lifetime data. The Johnson-Mehl-Avrami phase transformation theory is proposed to provide a physical link to the statistical model and to estimate the lifetime of the joints at early stages.

  2. Effect of Reflow Time on Wetting Behavior, Microstructure Evolution, and Joint Strength of Sn-2.5Ag-0.5Cu Solder on Bare and Nickel-Coated Copper Substrates

    NASA Astrophysics Data System (ADS)

    Sona, Mrunali; Prabhu, K. Narayan

    2016-07-01

    The effect of reflow time on wetting behavior of Sn-2.5Ag-0.5Cu lead-free solder on bare and nickel-coated copper substrates has been investigated. The solder alloy was reflowed at 270°C for various reflow times of 10 s, 100 s, 300 s, and 500 s. On bare copper substrate, the intermetallic compound (IMC) thickness increased with increase in reflow time, whereas on Ni-coated Cu substrate, the IMC thickness increased up to 300 s followed by a drop for solder alloy reflowed for 500 s. The spreading behavior of the solder alloy was categorized into capillary, gravity (diffusion), and viscous zones. Gravity zone was obtained from 3.8 ± 0.43 s to 38.97 ± 3.38 s and from 5.99 ± 0.5 s to 77.82 ± 8.84 s for the Sn-2.5Ag-0.5Cu/Cu and Sn-2.5Ag-0.5Cu/Ni/Cu system, respectively. Sn-2.5Ag-0.5Cu solder alloy was also reflowed for the period corresponding to the end of the gravity zone (40 s and 80 s on bare and Ni-coated Cu, respectively). The joint strength was maximum at reflow time of 40 s and 80 s for the Sn-2.5Ag-0.5Cu/Cu and Sn-2.5Ag-0.5Cu/Ni/Cu system, respectively. The dynamic contact angle at the end of the gravity (diffusion) zone ( θ gz) was found to be a better parameter compared with the stabilized contact angle ( θ f) to assess the effect of the wettability of the liquid solder on the microstructure and joint strength. The present investigation reveals the significance of the gravity zone in assessment of optimum reflow time for lead-free solder alloys.

  3. Microstructural Evolution of SAC305 Solder Joints in Wafer Level Chip-Scale Packaging (WLCSP) with Continuous and Interrupted Accelerated Thermal Cycling

    NASA Astrophysics Data System (ADS)

    Zhou, Quan; Zhou, Bite; Lee, Tae-Kyu; Bieler, Thomas

    2016-06-01

    Four high-strain design wafer level chip scale packages were given accelerated thermal cycling with a 10°C/min ramp rate and 10 min hold times between 0°C and 100°C to examine the effects of continuous and interrupted thermal cycling on the number of cycles to failure. The interruptions given two of the samples were the result of periodic examinations using electron backscattered pattern mapping, leading to room temperature aging of 30 days-2.5 years after increments of about 100 cycles at several stages of the cycling history. The continuous thermal cycling resulted in solder joints with a much larger degree of recrystallization, whereas the interrupted thermal cycling tests led to much less recrystallization, which was more localized near the package side, and the crack was more localized near the interface and had less branching. The failure mode for both conditions was still the same, with cracks nucleating along the high angle grain boundaries formed during recrystallization. In conditions where there were few recrystallized grains, recovery led to formation of subgrains that strengthened the solder, and the higher strength led to a larger driving force for crack growth through the solder, leading to failure after less than half of the cycles in the continuous accelerated thermal cycling condition. This work shows that there is a critical point where sufficient strain energy accumulation will trigger recrystallization, but this point depends on the rate of strain accumulation in each cycle and various recovery processes, which further depends on local crystal orientations, stress state evolution, and specific activated slip and twinning systems.

  4. 24 CFR 3280.605 - Joints and connections.

    Code of Federal Regulations, 2014 CFR

    2014-04-01

    ... and copper tubing shall be inserted to the full depth of the solder cup or welding sockets of each... threads only. (3) Solder joints. Solder joints for tubing shall be made with approved or listed solder..., made with solder having not more than 0.2 percent lead. (4) Plastic pipe, fittings and joints....

  5. Age-aware solder performance models : level 2 milestone completion.

    SciTech Connect

    Neilsen, Michael K.; Vianco, Paul Thomas; Neidigk, Matthew Aaron; Holm, Elizabeth Ann

    2010-09-01

    Legislated requirements and industry standards are replacing eutectic lead-tin (Pb-Sn) solders with lead-free (Pb-free) solders in future component designs and in replacements and retrofits. Since Pb-free solders have not yet seen service for long periods, their long-term behavior is poorly characterized. Because understanding the reliability of Pb-free solders is critical to supporting the next generation of circuit board designs, it is imperative that we develop, validate and exercise a solder lifetime model that can capture the thermomechanical response of Pb-free solder joints in stockpile components. To this end, an ASC Level 2 milestone was identified for fiscal year 2010: Milestone 3605: Utilize experimentally validated constitutive model for lead-free solder to simulate aging and reliability of solder joints in stockpile components. This report documents the completion of this milestone, including evidence that the milestone completion criteria were met and a summary of the milestone Program Review.

  6. In situ measurement of electromigration-induced transient stress in Pb-free Sn-Cu solder joints by synchrotron radiation based X-ray polychromatic microdiffraction

    SciTech Connect

    Chen, Kai; Tamura, Nobumichi; Kunz, Martin; Tu, King-Ning; Lai, Yi-Shao

    2009-12-01

    Electromigration-induced hydrostatic elastic stress in Pb-free SnCu solder joints was studied by in situ synchrotron X-ray white beam microdiffraction. The elastic stresses in two different grains with similar crystallographic orientation, one located at the anode end and the other at the cathode end, were analyzed based on the elastic anisotropy of the Beta-Sn crystal structure. The stress in the grain at the cathode end remained constant except for temperature fluctuations, while the compressive stress in the grain at the anode end was built-up as a function of time during electromigration until a steady state was reached. The measured compressive stress gradient between the cathode and the anode is much larger than what is needed to initiate Sn whisker growth. The effective charge number of Beta-Sn derived from the electromigration data is in good agreement with the calculated value.

  7. In situ measurement of electromigration-induced transient stress in Pb-free Sn-Cu solder joints by synchrotron radiation based X-ray polychromatic microdiffraction

    SciTech Connect

    Chen, Kai; Tamura, Nobumichi; Kunz, Martin; Tu, King-Ning; Lai, Yi-Shao

    2009-05-15

    Electromigration-induced hydrostatic elastic stress in Pb-free SnCu solder joints was studied by in situ synchrotron X-ray white beam microdiffraction. The elastic stresses in two different grains with similar crystallographic orientation, one located at the anode end and the other at the cathode end, were analyzed based on the elastic anisotropy of the {beta}-Sn crystal structure. The stress in the grain at the cathode end remained constant except for temperature fluctuations, while the compressive stress in the grain at the anode end was built-up as a function of time during electromigration until a steady state was reached. The measured compressive stress gradient between the cathode and the anode is much larger than what is needed to initiate Sn whisker growth. The effective charge number of {beta}-Sn derived from the electromigration data is in good agreement with the calculated value.

  8. Joule heating effect on oxide whisker growth induced by current stressing in Cu/Sn-58Bi/Cu solder joint

    NASA Astrophysics Data System (ADS)

    He, Hongwen; Cao, Liqiang; Wan, Lixi; Zhao, Haiyan; Xu, Guangchen; Guo, Fu

    2012-08-01

    The electromigration test was conducted in Cu/Sn-58Bi/Cu solder joint with high current density of 104 A/ cm2. Results showed that a large number of whiskers with natural weed appearance were observed at the cathode side in such a short current stressing time. Furthermore, some secondary whiskers were attached to the primary whiskers, which has never been reported before. We presumed the vapor-solid (VS) mechanism to explain the oxide whiskers growth, which was quite different from the traditional theory that the compressive stress took on the driving force. In conclusion, due to the over-Joule heating effect, the metal oxide whiskers were synthesized in bulk quantities by thermal evaporation of Sn oxide and Bi oxide.

  9. The low-temperature form of calcium gold stannide, CaAuSn

    SciTech Connect

    Lin, Qisheng; Corbett, John D

    2014-07-19

    The EuAuGe-type CaAuSn phase has been synthesized and single-crystal X-ray diffraction analysis reveals that it has an ortho­rhom­bic symmetry (space group Imm2), with a = 4.5261 (7) Å, b = 7.1356 (11) Å and c = 7.8147 (11) Å. The structure features puckered layers that are connected by homoatomic Au-Au and Sn-Sn inter­layer bonds. This structure is one of the two parent structures of its high-temperature polymorph (ca 873 K), which is an inter­growth structure of the EuAuGe- and SrMgSi-type structures in a 2:3 ratio.

  10. Characterization of solder flow on PWB surfaces

    SciTech Connect

    Hosking, F.M.; Yost, F.G.

    1995-07-01

    Different solderability tests have been developed to determine the wetting behavior of solder on metallic surfaces. None offer an exact measure of capillary flow associated with conventional mixed technology soldering. With shrinking package designs, increasing reliability requirements, and the emergence of new soldering technologies, there is a growing need to better understand and predict the flow of solder on printed wiring board (PWB) surfaces. Sandia National Laboratories has developed a capillary flow solderability test, through a joint effort with the National Center for Manufacturing Sciences, that considers this fundamental wetting issue for surface mount technology. The test geometry consists of a metal strip (width, {delta}) connected to a circular metal pad (radius, r{sub c}). Test methodology, experimental results, and validation of a flow model are presented in this paper.

  11. Solderability Study of RABiTS-Based YBCO Coated Conductors

    SciTech Connect

    Zhang, Yifei; Duckworth, Robert C; Ha, Tam T; Gouge, Michael J

    2011-01-01

    The solderability of commercially available YBa{sub 2}Cu{sub 3}O{sub 7-x} (YBCO) coated conductors that were made from Rolling Assisted Biaxially Textured Substrates (RABiTS)-based templates was studied. The coated conductors, also known as second-generation (2G) high temperature superconductor (HTS) wires (in the geometry of flat tapes about 4 mm wide), were laminated with copper, brass, or stainless steel strips as stabilizers. To understand the factors that influence their solderability, surface profilometry and scanning electron microscopy were used to characterize the wire surfaces. The solderability of three solders, 52In48Sn, 67Bi33In, and 100In (wt.%), was evaluated using a standard test (IPC/ECA J-STD-002) and with two different commercial fluxes. It was found that the solderability varied with the solder and flux but the three different wires showed similar solderability for a fixed combination of solder and flux. Solder joints of the 2G wires were fabricated using the tools and the procedures recommended by the HTS wire manufacturer. The solder joints were made in a lap-joint geometry and with the superconducting sides of the two wires face-to-face. The electrical resistances of the solder joints were measured at 77 K, and the results were analyzed to qualify the soldering materials and evaluate the soldering process. It was concluded that although the selection of soldering materials affected the resistance of a solder joint, the resistivity of the stabilizer was the dominant factor.

  12. Prototype circuit boards assembled with non-lead bearing solders

    SciTech Connect

    Vianco, P.T.; Rejent, J.A.

    1998-04-01

    The 91.84Sn-3.33Ag-4.83Bi and 96.5Sn-3.5Ag Pb-free solders were evaluated for surface mount circuit board interconnects. The 63Sn-37Pb solder provided the baseline data. All three solders exhibited suitable manufacturability per a defect analyses of circuit board test vehicles. Thermal cycling had no significant effect on the 91.84Sn-3.33Ag-4.83Bi solder joints. Some degradation in the form of grain boundary sliding was observed in 96.5Sn-3.5Ag and 63Sn-37Pb solder joints. The quality of the solder joint microstructures showed a slight degree of degradation under thermal shock exposure for all of the solders tested. Trends in the solder joint shear strengths could be traced to the presence of Pd in the solder, the source of which was the Pd/Ni finish on the circuit board conductor features. The higher, intrinsic strengths of the Pb-free solders encouraged the failure path to be located in proximity to the solder/substrate interface where Pd combined with Sn to form brittle PdSn{sub 4} particles, resulting in reduced shear strengths.

  13. Solder Creep-Fatigue Interactions with Flexible Leaded Part

    NASA Technical Reports Server (NTRS)

    Ross, R. G., Jr.; Wen, L. C.

    1994-01-01

    In most electronic packaging applications it is not a single high stress event that breaks a component solder joint; rather it is repeated or prolonged load applications that result in fatigue or creep failure of the solder. The principal strain in solder joints is caused by differential expansion between the part and its mounting environment due to hanges in temperature (thermal cycles) and/or due to temperature gradients between the part and the board.

  14. The influence of microstructure on the mechanical properties of solder

    SciTech Connect

    Morris, J.W. Jr.; Reynolds, H.L.

    1996-06-01

    Solder joints in microelectronics devices consist of low-melting solder compositions that wet and join metal contacts and are, ordinarily, used at high homologous temperatures in the as-solidified condition. Differences in solidification rate and substrate interactions have the consequence that even solder joints of similar compositions exhibit a wide range of microstructures. The variation in microstructure causes a variation in properties; in particular, the high-temperature creep properties that govern much of the mechanical behavior of the solder may differ significantly from joint to joint. The present paper reviews the varieties of microstructure that are found in common solder joints, and describes some of the ways in which microstructural changes affect mechanical properties and joint reliability.

  15. Platinum solder core wire: Development and industrial implications

    NASA Astrophysics Data System (ADS)

    Watt, R. J.; Koursaris, A.

    1996-06-01

    Jewelry neck chain is joined by age-old techniques, the most popular being the rather involved solder powder method. The solder core method of chain manufacture is a simpler process and offers the possibility of higher productivity. Neat narrow joints are formed, and a color match between the solder and parent alloy may be approached. This is particularly important in the case of platinum alloys that have a high melting point, necessitating the use of solders with compositions substantially different from those of the parent alloy. The solder core method also lends itself to the possibility of higher levels of automation.

  16. A strategy for fabricating nanoporous gold films through chemical dealloying of electrochemically deposited Au-Sn alloys

    NASA Astrophysics Data System (ADS)

    Xu, Yantong; Ke, Xi; Yu, Changchun; Liu, Shaofang; Zhao, Jie; Cui, Guofeng; Higgins, Drew; Chen, Zhongwei; Li, Qing; Wu, Gang

    2014-11-01

    We report a novel strategy for the fabrication of nanoporous gold (NPG) films. The fabrication process involves the electrodeposition of a gold-tin alloy, followed by subsequent chemical dealloying of tin. Scanning electron microscopy (SEM) images show a bicontinuous nanoporous structure formed on the substrates after chemical dealloying. Energy dispersive x-ray (EDX) analysis indicates that there are no impurities in the Au-Sn alloy film with an average composition of 58 at. % Au and 42 at. % Sn. After dealloying, only gold remains in the NPG film indicating the effectiveness of this technique. X-ray diffraction (XRD) results reveal that the as-prepared Au-Sn alloy film is composed of two phases (Au5Sn and AuSn), while the NPG film is composed of a single phase (Au). We demonstrate that this approach enables the fabrication of NPG films, either freestanding or supported on various conductive substrates such as copper foil, stainless steel sheet and nickel foam. The resulting NPG electrode exhibits enhanced electrocatalytic activity toward both H2O2 reduction and methanol oxidation compared to the polished Au disc electrode. Our strategy provides a general method to fabricate high quality NPG films on conductive substrates, which will broaden the application potential of NPG or NPG-based materials in various fields such as catalysis, optics and sensor technology.

  17. High-Temperature Stable Au-Sn and Cu-Sn Interconnects for 3D Stacked Applications

    NASA Astrophysics Data System (ADS)

    Hoivik, Nils; Liu, He; Wang, Kaiying; Salomonsen, Guttorm; Aasmundtveit, Knut

    The desire to directly integrate MEMS with ASICs in a 3D stack is the main motivation behind the development of a bonding technology suitable for both interconnects and seal rings. SLID (Solid-Liquid Inter-Diffusion) bonding processes based upon Au-Sn and Cu-Sn (high melting point metal/low melting point metal) are therefore investigated. SLID bonding allows for repeated high temperature processing cycles as in the case for chip stacking, or for interconnections and seal rings bonded at different process steps. This work describes results obtained for fluxless bonding of SLID Au-Sn and Cu-Sn interconnects and seal rings, where a thin layer of intermetallic compound (IMC) on the Cu or Sn surface protects the metal surfaces from oxidizing at elevated temperatures. To evaluate the bond strength, test dies bonded at various temperatures were subjected to SEM/EDX bond line analysis, and shear testing at both room and elevated temperatures. Au-Sn samples bonded at 280°C re-melt at elevated temperatures; whereas samples bonded at 350°C remain intact past the initial bonding temperature. For the Cu-Sn samples, the measured shear strength is comparable to conventionally bonded interconnects. In order to remain within the uniformity requirements for SLID bonding, the pattern density of electroplated interconnects and seal rings require an optimized layout which can be calculated based upon the effective area.

  18. Characterization of Low-Melting-Point Sn-Bi-In Lead-Free Solders

    NASA Astrophysics Data System (ADS)

    Li, Qin; Ma, Ninshu; Lei, YongPing; Lin, Jian; Fu, HanGuang; Gu, Jian

    2016-11-01

    Development of lead-free solders with low melting temperature is important for substitution of Pb-based solders to reduce direct risks to human health and the environment. In the present work, Sn-Bi-In solders were studied for different ratios of Bi and Sn to obtain solders with low melting temperature. The microstructure, thermal properties, wettability, mechanical properties, and reliability of joints with Cu have been investigated. The results show that the microstructures of the Sn-Bi-In solders were composed of β-Sn, Bi, and InBi phases. The intermetallic compound (IMC) layer was mainly composed of Cu6Sn5, and its thickness increased slightly as the Bi content was increased. The melting temperature of the solders was around 100°C to 104°C. However, when the Sn content exceeded 50 wt.%, the melting range became larger and the wettability became worse. The tensile strength of the solder alloys and solder joints declined with increasing Bi content. Two fracture modes (IMC layer fracture and solder/IMC mixed fracture) were found in solder joints. The fracture mechanism of solder joints was brittle fracture. In addition, cleavage steps on the fracture surface and coarse grains in the fracture structure were comparatively apparent for higher Bi content, resulting in decreased elongation for both solder alloys and solder joints.

  19. Characterization of Low-Melting-Point Sn-Bi-In Lead-Free Solders

    NASA Astrophysics Data System (ADS)

    Li, Qin; Ma, Ninshu; Lei, YongPing; Lin, Jian; Fu, HanGuang; Gu, Jian

    2016-02-01

    Development of lead-free solders with low melting temperature is important for substitution of Pb-based solders to reduce direct risks to human health and the environment. In the present work, Sn-Bi-In solders were studied for different ratios of Bi and Sn to obtain solders with low melting temperature. The microstructure, thermal properties, wettability, mechanical properties, and reliability of joints with Cu have been investigated. The results show that the microstructures of the Sn-Bi-In solders were composed of β-Sn, Bi, and InBi phases. The intermetallic compound (IMC) layer was mainly composed of Cu6Sn5, and its thickness increased slightly as the Bi content was increased. The melting temperature of the solders was around 100°C to 104°C. However, when the Sn content exceeded 50 wt.%, the melting range became larger and the wettability became worse. The tensile strength of the solder alloys and solder joints declined with increasing Bi content. Two fracture modes (IMC layer fracture and solder/IMC mixed fracture) were found in solder joints. The fracture mechanism of solder joints was brittle fracture. In addition, cleavage steps on the fracture surface and coarse grains in the fracture structure were comparatively apparent for higher Bi content, resulting in decreased elongation for both solder alloys and solder joints.

  20. Advanced soldering processes

    SciTech Connect

    Jellison, J.L.; Golden, J.; Frear, D.R.; Hosking, F.M.; Keicher, D.M.; Yost, F.G.

    1993-02-20

    Advanced soldering processes are discussed in a complete manner. The ability to meet the needs of electronic manufacturing, while addressing the environmental issues are challenging goals. Government regulations mandate the elimination of most solvents in solder flux removal. Alternative approaches to promoting wetting are discussed. Inert atmosphere soldering, acid vapor fluxless soldering, atomic and ionic hydrogen as reactive atmospheres, fluxless laser soldering in a controlled atmosphere are offered as soldering mechanisms for the future. Laser are discussed as alternate heat sources. Various types of lasers, advantages of lasers, and fiber optic beam delivery are considered.

  1. Soldering instrument safety improvements

    DOEpatents

    Kosslow, William J.; Giron, Ronald W.

    1996-01-01

    A safe soldering device includes a retractable heat shield which can be moved between a first position in which the solder tip of the device is exposed for soldering operation and a second position in which the solder tip is covered by the heat shield. Preferably, the heat shield is biased towards the second position and may be locked in the first position for ease of use. When the soldering device is equipped with a vacuum system, the heat shield may serve to guide the flow of gases and heat from the solder tip away from the work area. The heat shield is preferably made of non-heatsinking plastic.

  2. Solder flow on narrow copper strips

    SciTech Connect

    Hosking, F.M.; Yost, F.G.; Holm, E.A.; Michael, J.R.

    1996-07-01

    Various solderability tests have been developed over the years to quantify the wetting behavior of solder on metallic surfaces. None offer an exact measure of capillary flow normally associated with conventional plated-through-hole and surface mount soldering. With shrinking package designs, increasing reliability requirements, and the emergence of new soldering technologies, there is a growing need to better understand and predict the flow of solder on printed wiring board (PWB) surfaces. Sandia National Laboratories has developed a capillary flow solderability test, through a joint effort with the National Center for Manufacturing Sciences, that considers this fundamental wetting issue for surface mount technology. The test geometry consists of a metal strip (width, {delta}) connected to a circular metal pad (radius, r{sub c}). Solder flow from the pad onto the strip depends on the geometric relationship between {delta} and r{sub c}. Test methodology, experimental results, and validation of a flow model are presented in this paper. 17 refs., 11 figs., 4 tabs.

  3. Prototyping lead-free solders on hand-soldered, through-hole circuit boards

    SciTech Connect

    Vianco, P.T.; Mizik, P.M.

    1993-12-31

    The lead-free solders 96.5Sn-3.5Ag (wt %), 95.5Sn-4.0Cu-0.5Ag, 91. 84Sn-3.33Ag-4.83Bi were used in the assembly of a through-hole circuit board to determine the feasibility of their suitability in hand soldering processes. Prototypes assembled with 63Sn-37Pb solder were manufactured to serve as control units. Implementation of the lead-free alloys were performed with a rosin-based, mildly activated (RMA) flux and a 700{degree}F soldering tip. A procedure was developed to remove the tin-lead finish from the leaded components and replace it with a 100Sn hot dipped coating. Assembly feasibility was demonstrated for all three lead-free solders. Defect counts were greater than observed with the tin-lead control alloy; however, the number of defects diminished with experience gained by the operator. Visual examination of the solder joints indicated satisfactory wetting of both the device leads and circuit board land with no apparent damage to the underlying laminate nor to the device packages. Cross sections of the lead-free solder joints showed that the were more susceptible to void formation within the holes than was the case with the tin-lead solder. Some cracking was observed at the interface between the Sn-Ag-Bi solder and the copper lands; the relatively high strength of this solder and fast cooling rate of the hand assembly process was believed responsible for this defect.

  4. Whisker Formation on SAC305 Soldered Assemblies

    NASA Astrophysics Data System (ADS)

    Meschter, S.; Snugovsky, P.; Bagheri, Z.; Kosiba, E.; Romansky, M.; Kennedy, J.; Snugovsky, L.; Perovic, D.

    2014-11-01

    This article describes the results of a whisker formation study on SAC305 assemblies, evaluating the effects of lead-frame materials and cleanliness in different environments: low-stress simulated power cycling (50-85°C thermal cycling), thermal shock (-55°C to 85°C), and high temperature/high humidity (85°C/85% RH). Cleaned and contaminated small outline transistors, large leaded quad flat packs (QFP), plastic leaded chip carrier packages, and solder balls with and without rare earth elements (REE) were soldered to custom designed test boards with Sn3Ag0.5Cu (SAC305) solder. After assembly, all the boards were cleaned, and half of them were recontaminated (1.56 µg/cm2 Cl-). Whisker length, diameter, and density were measured. Detailed metallurgical analysis on components before assembly and on solder joints before and after testing was performed. It was found that whiskers grow from solder joint fillets, where the thickness is less than 25 µm, unless REE was present. The influence of lead-frame and solder ball material, microstructure, cleanliness, and environment on whisker characteristics is discussed. This article provides detailed metallurgical observations and select whisker length data obtained during this multiyear testing program.

  5. Application of Au-Sn eutectic bonding in hermetic radio-frequency microelectromechanical system wafer level packaging

    NASA Astrophysics Data System (ADS)

    Wang, Qian; Choa, Sung-Hoon; Kim, Woonbae; Hwang, Junsik; Ham, Sukjin; Moon, Changyoul

    2006-03-01

    Development of packaging is one of the critical issues toward realizing commercialization of radio-frequency-microelectromechanical system (RF-MEMS) devices. The RF-MEMS package should be designed to have small size, hermetic protection, good RF performance, and high reliability. In addition, packaging should be conducted at sufficiently low temperature. In this paper, a low-temperature hermetic wafer level packaging scheme for the RF-MEMS devices is presented. For hermetic sealing, Au-Sn eutectic bonding technology at temperatures below 300°C is used. Au-Sn multilayer metallization with a square loop of 70 µm in width is performed. The electrical feed-through is achieved by the vertical through-hole via filling with electroplated Cu. The size of the MEMS package is 1 mm × 1 mm × 700 µm. The shear strength and hermeticity of the package satisfies the requirements of MIL-STD-883F. Any organic gases or contamination are not observed inside the package. The total insertion loss for the packaging is 0.075 dB at 2 GHz. Furthermore, the robustness of the package is demonstrated by observing no performance degradation and physical damage of the package after several reliability tests.

  6. Fabrication of Cu-Ni mixed phase layer using DC electroplating and suppression of Kirkendall voids in Sn-Ag-Cu solder joints

    NASA Astrophysics Data System (ADS)

    Chee, Sang-Soo; Lee, Jong-Hyun

    2014-05-01

    A solderable layer concurrently containing Cu-rich and Ni-rich phases (mixed-phase layer, MPL) was fabricated by direct current electroplating under varying process conditions. Current density was considered as the main parameter to adjust the microstructure and composition of MPL during the electroplating process, and deposit thickness were evaluated as functions of plating time. As a result, it was observed that the coral-like structure that consisted of Cu-rich and Ni-rich phases grew in the thickness direction. The most desirable microstructure was obtained at a relatively low current density of 0.4 mA/cm2. In other words, the surface was the smoothest and defect-free at this current density. The electroplating rate was slightly enhanced with an increase in current density. Investigations of its solid-state reaction properties, including the formation of Kirkendall voids, were also carried out after reflow soldering with Sn-3.0 Ag-0.5 Cu solder balls. In the solid-state aging experiment at 125°C, Kirkendall voids at the normal Sn-3.0 Ag-0.5 Cu solder/Cu interface were easily formed after just 240 h. Meanwhile, the presence of an intermetallic compound (IMC) layer created in the solder/MPL interface indicated a slightly lower growth rate, and no Kirkendall voids were observed in the IMC layer even after 720 h.

  7. Soldering of Carbon Materials Using Transition Metal Rich Alloys.

    PubMed

    Burda, Marek; Lekawa-Raus, Agnieszka; Gruszczyk, Andrzej; Koziol, Krzysztof K K

    2015-08-25

    Joining of carbon materials via soldering has not been possible up to now due to lack of wetting of carbons by metals at standard soldering temperatures. This issue has been a severely restricting factor for many potential electrical/electronic and mechanical applications of nanostructured and conventional carbon materials. Here we demonstrate the formation of alloys that enable soldering of these structures. By addition of several percent (2.5-5%) of transition metal such as chromium or nickel to a standard lead-free soldering tin based alloy we obtained a solder that can be applied using a commercial soldering iron at typical soldering temperatures of approximately 350 °C and at ambient conditions. The use of this solder enables the formation of mechanically strong and electrically conductive joints between carbon materials and, when supported by a simple two-step technique, can successfully bond carbon structures to any metal terminal. It has been shown using optical and scanning electron microscope images as well as X-ray diffraction patterns and energy dispersive X-ray mapping that the successful formation of carbon-solder bonds is possible, first, thanks to the uniform nonreactive dispersion of transition metals in the tin-based matrix. Further, during the soldering process, these free elements diffuse into the carbon-alloy border with no formation of brazing-like carbides, which would damage the surface of the carbon materials. PMID:26256042

  8. Studies on in situ particulate reinforced tin-silver composite solders relevant to thermomechanical fatigue issues

    NASA Astrophysics Data System (ADS)

    Choi, Sunglak

    2001-07-01

    Global pressure based on environmental and health concerns regarding the use of Pb-bearing solder has forced the electronics industry to develop Pb-free alternative solders. Eutectic Sn-Ag solder has received much attention as a potential Pb-free candidate to replace Sn-Pb solder. Since introduction of surface mount technology, packaging density increased and the electronic devices became smaller. As a result, solders in electronic modules are forced to function as a mechanical connection as well as electrical contact. Solders are also exposed to very harsh service conditions such as automotive under-the-hood and aerospace applications. Solder joints experience thermomechanical fatigue, i.e. interaction of fatigue and creep, during thermal cycling due to temperature fluctuation in service conditions. Microstructural study on thermomechanical fatigue of the actual eutectic Sn-Ag and Sn-4Ag-0.5Cu solder joints was performed to better understand deformation and damage accumulation occurring during service. Incorporation of reinforcements has been pursued to improve the mechanical and particularly thermomechanical behavior of solders, and their service temperature capability. In-situ Sn-Ag composite solders were developed by incorporating Cu 6Sn5, Ni3Sn4, and FeSn2 particulate reinforcements in the eutectic Sn-Ag solder in an effort to enhance thermomechanical fatigue resistance. In-situ composite solders were investigated on the growth of interfacial intermetallic layer between solder and Cu substrate growth and creep properties. Solder joints exhibited significant deformation and damage on free surface and interior regions during thermomechanical fatigue. Cracks initiated on the free surface of the solder joints and propagated toward interior regions near the substrate of the solder joint. Crack grew along Sn grain boundaries by grain boundary sliding. There was significant residual stress within the solder joint causing more damage. Presence of small amount of Cu

  9. Process characterization and control of hand-soldered printed wiring assemblies

    SciTech Connect

    Cheray, D.L.; Mandl, R.G.

    1993-09-01

    A designed experiment was conducted to characterize the hand soldering process parameters for manufacturing printed wiring assemblies (PWAs). Component tinning was identified as the most important parameter in hand soldering. After tinning, the soldering iron tip temperature of 700{degrees}F and the choice of operators influence solder joint quality more than any other parameters. Cleaning and flux/flux core have little impact on the quality of the solder joint. The need for component cleaning prior to assembly must be evaluated for each component.

  10. Soldering instrument safety improvements

    SciTech Connect

    Kosslow, W.J.; Giron, R.W.

    1994-12-31

    It is an object of the present invention to make soldering instruments safer and easier to use. According to one aspect of the present invention, a non-heatsinking, protective shield is provided around the soldering tip of the solder iron. This heat shield covers the iron`s hot tip throughout the soldering process with the exception of the time needed to perform an actual solder connection using the tip. The shield protects the user or nearby personnel from harm when the soldering iron is at elevated temperatures (500{degrees}F to 800{degrees}F).Moreover, the shield is capable of preventing fires which might result if the iron`s tip inadvertently comes into contact with an object that can be easily ignited, e.g. paper. In addition, an air vacuum system is incorporated into the shield to remove the solder smoke.

  11. Hybrid microcircuit board assembly with lead-free solders

    SciTech Connect

    Vianco, P.T.; Hernandez, C.L.; Rejent, J.A.

    2000-01-11

    An assessment was made of the manufacturability of hybrid microcircuit test vehicles assembled using three Pb-free solder compositions 96.5Sn--3.5Ag (wt.%), 91.84Sn--3.33Ag--4.83Bi, and 86.85Sn--3.15Ag--5.0Bi--5.0Au. The test vehicle substrate was 96% alumina; the thick film conductor composition was 76Au--21Pt--3Pd. Excellent registration between the LCCC or chip capacitor packages and the thick film solder pads was observed. Reduced wetting of bare (Au-coated) LCCC castellations was eliminated by hot solder dipping the I/Os prior to assembly of the circuit card. The Pb-free solders were slightly more susceptible to void formation, but not to a degree that would significantly impact joint functionality. Microstructural damage, while noted in the Sn-Pb solder joints, was not observed in the Pb-free interconnects.

  12. Fluxless soldering using activated acid vapors

    SciTech Connect

    Frear, D.R.; Keicher, D.M.

    1992-01-01

    Acid vapors have been used to fluxlessly reduce metal oxides and enhance wetting of solder on metallizations. Dilute solutions of hydrogen, acetic acid and formic acid in an inert carrier gas of nitrogen or argon were used with the sessile drop technique for 60Sn-40 Pb solder on Cu and Au/Ni metallizations. The time to reduce metal oxides and the extent of wetting as a function of acid vapor concentrations were characterized. Acetic and formic acids reduce the surface metal oxides sufficiently to form metallurgically sound solder joints. Hydrogen did not reduce oxides rapidly enough at 220{degree}C to be suitable for soldering applications. The optimum conditions for oxide reduction with formic acid was with an acid vapor concentration in nitrogen carrier gas of 4% for Cu metallizations and 1.6% on Au/Ni. The acetic acid vapor concentration, also in nitrogen, was optimized at 1.5% for both metallizations. Above a vapor concentration of 1.5%, the acetic acid combined with the bare metal to form acetates which increased the wetting time. These results indicate that acid vapor fluxless soldering is a viable alternative to traditional flux soldering.

  13. Mask-less deposition of Au-SnO2 nanocomposites on CMOS MEMS platform for ethanol detection

    NASA Astrophysics Data System (ADS)

    Santra, S.; Sinha, A. K.; De Luca, A.; Ali, S. Z.; Udrea, F.; Guha, P. K.; Ray, S. K.; Gardner, J. W.

    2016-03-01

    Here we report on the mask-less deposition of Au-SnO2 nanocomposites with a silicon-on-insulator (SOI) complementary metal oxide semiconductor (CMOS) micro electro mechanical system (MEMS) platform through the use of dip pen nanolithography (DPN) to create a low-cost ethanol sensor. MEMS technology is used in order to achieve low power consumption, by the employment of a membrane structure formed using deep reactive ion etching technique. The device consists of an embedded tungsten micro-heater with gold interdigitated electrodes on top of the SOI membrane. The tungsten micro-heater is used to raise the membrane temperature up to its operating temperature and the electrodes are used to measure the resistance of the nanocomposite sensing layer. The CMOS MEMS devices have high electro-thermal efficiency, with 8.2 °C temperature increase per mW power of consumption. The sensing material (Au-SnO2 nanocomposite) was synthesised starting from SnO nanoplates, then Au nanoparticles were attached chemically to the surface of SnO nanoplates, finally the mixture was heated at 700 °C in an oven in air for 4 h. This composite material was sonicated for 2 h in terpineol to make a viscous homogeneous slurry and then ‘written’ directly across the electrode area using the DPN technique without any mask. The devices were characterised by exposure to ethanol vapour in humid air in the concentration range of 100-1000 ppm. The sensitivity varied from 1.2 to 0.27 ppm-1 for 100-1000 ppm of ethanol at 10% relative humid air. Selectivity measurements showed that the sensors were selective towards ethanol when they were exposed to acetone and toluene.

  14. Mask-less deposition of Au-SnO2 nanocomposites on CMOS MEMS platform for ethanol detection.

    PubMed

    Santra, S; Sinha, A K; De Luca, A; Ali, S Z; Udrea, F; Guha, P K; Ray, S K; Gardner, J W

    2016-03-29

    Here we report on the mask-less deposition of Au-SnO2 nanocomposites with a silicon-on-insulator (SOI) complementary metal oxide semiconductor (CMOS) micro electro mechanical system (MEMS) platform through the use of dip pen nanolithography (DPN) to create a low-cost ethanol sensor. MEMS technology is used in order to achieve low power consumption, by the employment of a membrane structure formed using deep reactive ion etching technique. The device consists of an embedded tungsten micro-heater with gold interdigitated electrodes on top of the SOI membrane. The tungsten micro-heater is used to raise the membrane temperature up to its operating temperature and the electrodes are used to measure the resistance of the nanocomposite sensing layer. The CMOS MEMS devices have high electro-thermal efficiency, with 8.2 °C temperature increase per mW power of consumption. The sensing material (Au-SnO2 nanocomposite) was synthesised starting from SnO nanoplates, then Au nanoparticles were attached chemically to the surface of SnO nanoplates, finally the mixture was heated at 700 °C in an oven in air for 4 h. This composite material was sonicated for 2 h in terpineol to make a viscous homogeneous slurry and then 'written' directly across the electrode area using the DPN technique without any mask. The devices were characterised by exposure to ethanol vapour in humid air in the concentration range of 100-1000 ppm. The sensitivity varied from 1.2 to 0.27 ppm(-1) for 100-1000 ppm of ethanol at 10% relative humid air. Selectivity measurements showed that the sensors were selective towards ethanol when they were exposed to acetone and toluene.

  15. Fluxless laser soldering for electronic packaging

    SciTech Connect

    Hosking, F M; Keicher, D M

    1991-01-01

    Conventional soldering typically requires the use of reactive fluxes to promote wetting. The resulting flux residues are removed primarily with halogenated or chlorofluorocarbon (CFC) solvents. With the mandated phaseout of CFCs by the year 2000, there has been a concentrated effort to develop alternative, environmentally compatible manufacturing and cleaning technologies that will satisfy the restrictions placed on CFCs, but still yield high quality product. Sandia National Laboratories is currently evaluating a variety of alternative fluxless soldering technologies which can be applied to electronic packaging. Laser soldering in a controlled atmosphere has shown great potential as an environmentally compatible process. The effects of laser heating with a 100 watt CW Nd:YAG laser, joint design, and base/filler metal reactions on achieving fluxless wetting with good metallurgical bonds were examined. Satisfactory Ni-Au plated Kovar{reg sign} solder joints were made with 80In-15Pb-5Ag and 63Sn-37Pb (wt. %) solder alloys in a slightly reducing cover gas. Wetting generally increased with increasing laser power, decreasing laser beam spot size, and decreasing part travel speed. The materials and processing interaction effects are identified and discussed.

  16. Fluxless laser soldering for electronic packaging

    SciTech Connect

    Hosking, F.M.; Keicher, D.M.

    1991-12-31

    Conventional soldering typically requires the use of reactive fluxes to promote wetting. The resulting flux residues are removed primarily with halogenated or chlorofluorocarbon (CFC) solvents. With the mandated phaseout of CFCs by the year 2000, there has been a concentrated effort to develop alternative, environmentally compatible manufacturing and cleaning technologies that will satisfy the restrictions placed on CFCs, but still yield high quality product. Sandia National Laboratories is currently evaluating a variety of alternative fluxless soldering technologies which can be applied to electronic packaging. Laser soldering in a controlled atmosphere has shown great potential as an environmentally compatible process. The effects of laser heating with a 100 watt CW Nd:YAG laser, joint design, and base/filler metal reactions on achieving fluxless wetting with good metallurgical bonds were examined. Satisfactory Ni-Au plated Kovar{reg_sign} solder joints were made with 80In-15Pb-5Ag and 63Sn-37Pb (wt. %) solder alloys in a slightly reducing cover gas. Wetting generally increased with increasing laser power, decreasing laser beam spot size, and decreasing part travel speed. The materials and processing interaction effects are identified and discussed.

  17. Solderability test system

    DOEpatents

    Yost, Fred; Hosking, Floyd M.; Jellison, James L.; Short, Bruce; Giversen, Terri; Reed, Jimmy R.

    1998-01-01

    A new test method to quantify capillary flow solderability on a printed wiring board surface finish. The test is based on solder flow from a pad onto narrow strips or lines. A test procedure and video image analysis technique were developed for conducting the test and evaluating the data. Feasibility tests revealed that the wetted distance was sensitive to the ratio of pad radius to line width (l/r), solder volume, and flux predry time.

  18. Solderability test system

    DOEpatents

    Yost, F.; Hosking, F.M.; Jellison, J.L.; Short, B.; Giversen, T.; Reed, J.R.

    1998-10-27

    A new test method to quantify capillary flow solderability on a printed wiring board surface finish. The test is based on solder flow from a pad onto narrow strips or lines. A test procedure and video image analysis technique were developed for conducting the test and evaluating the data. Feasibility tests revealed that the wetted distance was sensitive to the ratio of pad radius to line width (l/r), solder volume, and flux predry time. 11 figs.

  19. A novel method for direct solder bump pull testing using lead-free solders

    NASA Astrophysics Data System (ADS)

    Turner, Gregory Alan

    This thesis focuses on the design, fabrication, and evaluation of a new method for testing the adhesion strength of lead-free solders, named the Isotraction Bump Pull method (IBP). In order to develop a direct solder joint-strength testing method that did not require customization for different solder types, bump sizes, specific equipment, or trial-and-error, a combination of two widely used and accepted standards was created. First, solder bumps were made from three types of lead free solder were generated on untreated copper PCB substrates using an in-house fabricated solder bump-on-demand generator, Following this, the newly developed method made use of a polymer epoxy to encapsulate the solder bumps that could then be tested under tension using a high precision universal vertical load machine. The tests produced repeatable and predictable results for each of the three alloys tested that were in agreement with the relative behavior of the same alloys using other testing methods in the literature. The median peak stress at failure for the three solders tested were 2020.52 psi, 940.57 psi, and 2781.0 psi, and were within one standard deviation of the of all data collected for each solder. The assumptions in this work that brittle fracture occurred through the Intermetallic Compound layer (IMC) were validated with the use of Energy-Dispersive X-Ray Spectrometry and high magnification of the fractured surface of both newly exposed sides of the test specimens. Following this, an examination of the process to apply the results from the tensile tests into standard material science equations for the fracture of the systems was performed..

  20. Soldering In Space Investigation

    NASA Technical Reports Server (NTRS)

    2004-01-01

    This video captures Mike Fincke melting solder during the first set of planned In-Space Soldering Investigation (ISSI) experiments onboard the International Space Station (ISS). In the video, Fincke touches the tip of the soldering iron to a wire wrapped with rosin-core solder.Review of the experiment video revealed melting kinetics, wetting characteristics, and equilibrium shape attainment of the solder charge. The main photograph shows the results of feeding solder wire onto a heated surface. Here the solder is still attached with the spool seen floating in the foreground of the image. The inset photograph at right, shows a set of three simple melting experiments in which the solder, not affected by gravity, achieved an unexpected equilibrium football shape on the wire. Samples returned to Earth were examined for porosity and flux distribution as well as micro structural development. ISSI's purpose was to find out how solder behaves in a weightless environment and promote our knowledge of fabrication and repair techniques that might be employed during extended space exploration missions.

  1. Soldering In Space Investigation

    NASA Technical Reports Server (NTRS)

    2004-01-01

    This video captures Mike Fincke melting solder during the first set of planned In-Space Soldering Investigation (ISSI) experiments onboard the International Space Station (ISS). In the video, Fincke touches the tip of the soldering iron to a wire wrapped with rosin-core solder. Review of the experiment video revealed melting kinetics, wetting characteristics, and equilibrium shape attainment of the solder charge. The main photograph shows the results of feeding solder wire onto a heated surface. Here the solder is still attached with the spool seen floating in the foreground of the image. The inset photograph at right, shows a set of three simple melting experiments in which the solder, not affected by gravity, achieved an unexpected equilibrium football shape on the wire. Samples returned to Earth were examined for porosity and flux distribution as well as micro structural development. ISSI's purpose was to find out how solder behaves in a weightless environment and promote our knowledge of fabrication and repair techniques that might be employed during extended space exploration missions.

  2. Thermal Stress of Surface Oxide Layer on Micro Solder Bumps During Reflow

    NASA Astrophysics Data System (ADS)

    Key Chung, C.; Zhu, Z. X.; Kao, C. R.

    2015-02-01

    Micro-bumps are now being developed with diameters smaller than 10 μm. At these dimensions, only very small amounts of solder are used to form the interconnections. Surface oxidation of such small micro-bumps is a critical issue. The key question is whether the oxide film on the solder bumps acts as a barrier to formation of solder joints. In this work, the mechanical stability of the oxide layer on solder bumps was investigated. Solder bumps with 35- μm radii were heated for different times. Auger electron spectroscopy was used to determine the thickness of the oxide layer on the solder bumps. Solder bumps with known oxide layer thicknesses were then heated in a low-oxygen environment (<50 ppm) until they melted. The mechanical stability of the oxide layer was observed by use of a high-speed camera. Results showed that a 14-nm-thick oxide layer on a solder bump of radius 35 μm was able to withstand the molten solder without cracking, leading to a non-wetting solder joint. A thermal stress model of the surface oxide layer revealed that the stress varied substantially with bump size and temperature, and increased almost linearly with temperature. Upon melting, the thermal stress on the oxide increased abruptly, because of the higher thermal expansion of molten solder compared with its solid state. On the basis of the experimental results and the thermal stress model of the oxide film, the maximum oxide thickness that can be tolerated to form a solder joint was determined, e.g. 14 nm oxide can support liquid solder, and thus lead to a non-wetting condition. This work provided a new method of determination of the maximum stress of oxide film for solder joint formation.

  3. Pull strength evaluation of Sn-Pb solder joints made to Au-Pt-Pd and Au thick film structures on low-temperature co-fired ceramic -final report for the MC4652 crypto-coded switch (W80).

    SciTech Connect

    Uribe, Fernando; Vianco, Paul Thomas; Zender, Gary L.

    2006-06-01

    A study was performed that examined the microstructure and mechanical properties of 63Sn-37Pb (wt.%, Sn-Pb) solder joints made to thick film layers on low-temperature co-fired (LTCC) substrates. The thick film layers were combinations of the Dupont{trademark} 4596 (Au-Pt-Pd) conductor and Dupont{trademark} 5742 (Au) conductor, the latter having been deposited between the 4596 layer and LTCC substrate. Single (1x) and triple (3x) thicknesses of the 4596 layer were evaluated. Three footprint sizes were evaluated of the 5742 thick film. The solder joints exhibited excellent solderability of both the copper (Cu) lead and thick film surface. In all test sample configurations, the 5742 thick film prevented side wall cracking of the vias. The pull strengths were in the range of 3.4-4.0 lbs, which were only slightly lower than historical values for alumina (Al{sub 2}O{sub 3}) substrates. General (qualitative) observations: (a) The pull strength was maximized when the total number of thick film layers was between two and three. Fewer that two layers did not develop as strong of a bond at the thick film/LTCC interface; more than three layers and of increased footprint area, developed higher residual stresses at the thick film/LTCC interface and in the underlying LTCC material that weakened the joint. (b) Minimizing the area of the weaker 4596/LTCC interface (e.g., larger 5742 area) improved pull strength. Specific observations: (a) In the presence of vias and the need for the 3x 4596 thick film, the preferred 4596:5742 ratio was 1.0:0.5. (b) For those LTCC components that require the 3x 4596 layer, but do not have vias, it is preferred to refrain from using the 5742 layer. (c) In the absence of vias, the highest strength was realized with a 1x thick 5742 layer, a 1x thick 4596 layer, and a footprint ratio of 1.0:1.0.

  4. Reduced oxide soldering activation (ROSA) PWB solderability testing

    SciTech Connect

    Hernandez, C.L.; Hosking, F.M.; Reed, J.; Tench, D.M.; White, J.

    1996-02-01

    The effect of ROSA pretreatment on the solderability of environmentally stressed PWB test coupons was investigated. The PWB surface finish was an electroplated, reflowed solder. Test results demonstrated the ability to recover plated-through-hole fill of steam aged samples with solder after ROSA processing. ROSA offers an alternative method for restoring the solderability of aged PWB surfaces.

  5. Nanocopper Based Solder-Free Electronic Assembly

    NASA Astrophysics Data System (ADS)

    Schnabl, K.; Wentlent, L.; Mootoo, K.; Khasawneh, S.; Zinn, A. A.; Beddow, J.; Hauptfleisch, E.; Blass, D.; Borgesen, P.

    2014-12-01

    CuantumFuse nano copper material has been used to assemble functional LED test boards and a small camera board with a 48 pad CMOS sensor quad-flat no-lead chip and a 10 in flexible electronics demo. Drop-in replacement of solder, by use of stencil printing and standard surface mount technology equipment, has been demonstrated. Applications in space and commercial systems are currently under consideration. The stable copper-nanoparticle paste has been examined and characterized by scanning electron microscopy and high-resolution transmission electron microscopy; this has shown that the joints are nanocrystalline but with substantial porosity. Assessment of reliability is expected to be complicated by this and by the effects of thermal and strain-enhanced coarsening of pores. Strength, creep, and fatigue properties were measured and results are discussed with reference to our understanding of solder reliability to assess the potential of this nano-copper based solder alternative.

  6. Removing Dross From Molten Solder

    NASA Technical Reports Server (NTRS)

    Webb, Winston S.

    1990-01-01

    Automatic device helps to assure good solder connections. Machine wipes dross away from area on surface of molten solder in pot. Sweeps across surface of molten solder somewhat in manner of windshield wiper. Each cycle of operation triggered by pulse from external robot. Equipment used wherever precise, automated soldering must be done to military specifications.

  7. An Evaluation of Prototype Circuit Boards Assembled with a Sn-Ag Bi Solder

    SciTech Connect

    ARTAKI,I.; RAY,U.; REJENT,JEROME A.; VIANCO,PAUL T.

    1999-09-01

    An evaluation was performed which examined the aging of surface mount solder joints assembled with 91.84Sn-3.33Ag-4.83Bi solder. Defect analysis of the as-fabricated test vehicles revealed excellent solderability, good package alignment, and a minimum number of voids. Continuous DC electrical monitoring of the solder joints did not reveal opens during as many as 10,000 thermal cycles (0 C, 100 C). The solder joints exhibited no significant degradation through 2500 cycles, based upon an absence of microstructural damage and sustained shear and pull strengths of chip capacitors and J-leaded solder joints, respectively. Thermal cycles of 5000 and 10,000 resulted in some surface cracking of the solder fillets and coatings. In a few cases, deeper cracks were observed in the thinner reaches of several solder fillets. There was no deformation or cracking in the solder located in the gap between the package I/O and the circuit board pad nor in the interior of the fillets, both locations that would raise concerns of joint mechanical integrity. A drop in the chip capacitor shear strength was attributed to crack growth near the top of the fillet.

  8. Solder Bonding for Power Transistors

    NASA Technical Reports Server (NTRS)

    Snytsheuvel, H. A.; Mandel, H.

    1985-01-01

    Indium solder boosts power rating and facilitates circuit changes. Efficient heat conduction from power transistor to heat sink provided by layer of indium solder. Low melting point of indium solder (141 degrees C) allows power transistor to be removed, if circuit must be reworked, without disturbing other components mounted with ordinary solder that melts at 181 degrees C. Solder allows devices operated at higher power levels than does conventional attachment by screws.

  9. Laser forward transfer of solder paste for microelectronics fabrication

    NASA Astrophysics Data System (ADS)

    Mathews, Scott A.; Charipar, Nicholas A.; Auyeung, Ray C.; Kim, Heungsoo; Piqué, Alberto

    2015-03-01

    The progressive miniaturization of electronic devices requires an ever-increasing density of interconnects attached via solder joints. As a consequence, the overall size and spacing (or pitch) of these solder joint interconnects keeps shrinking. When the pitch between interconnects decreases below 200 μm, current technologies, such as stencil printing, find themselves reaching their resolution limit. Laser direct-write (LDW) techniques based on laser-induced forward transfer (LIFT) of functional materials offer unique advantages and capabilities for the printing of solder pastes. At NRL, we have demonstrated the successful transfer, patterning, and subsequent reflow of commercial Pb-free solder pastes using LIFT. Transfers were achieved both with the donor substrate in contact with the receiving substrate and across a 25 μm gap, such that the donor substrate does not make contact with the receiving substrate. We demonstrate the transfer of solder paste features down to 25 μm in diameter and as large as a few hundred microns, although neither represents the ultimate limit of the LIFT process in terms of spatial dimensions. Solder paste was transferred onto circular copper pads as small as 30 μm and subsequently reflowed, in order to demonstrate that the solder and flux were not adversely affected by the LIFT process.

  10. Microstructural Characterization and Mechanical Performance of Wafer-Level SLID Bonded Au-Sn and Cu-Sn Seal Rings for MEMS Encapsulation

    NASA Astrophysics Data System (ADS)

    Rautiainen, Antti; Xu, Hongbo; Österlund, Elmeri; Li, Jue; Vuorinen, Vesa; Paulasto-Kröckel, Mervi

    2015-11-01

    Special applications, such as microelectromechanical systems (MEMS), often require hermetic sealing in order to achieve a desired operation. Solid-liquid interdiffusion (SLID) bonding is an attractive method for encapsulating MEMS devices at the wafer-level, providing, e.g., high re-melt temperatures and tolerance for topographical variations. Several different SLID bond solutions have been investigated; however, there are only a limited number of published reliability studies available. In this paper, wafer-level Au-Sn and Cu-Sn SLID seal rings were mechanically characterized with shear and tensile tests. The evolution of bond microstructures and consequent effects on mechanical reliability were evaluated with a mixed flow gas test, a high temperature storage test and a thermal shock (TS) test. Virgin samples showed high mechanical strength. The Au-Sn system, with a thin Ni layer between the TiW adhesion layer and the bond, demonstrated a shear strength of 170 MPa. Cu-Sn, with a Cu-Cu3Sn-Cu structure, exhibited a shear strength of 275 MPa. Statistically significant decreases in strength were identified after reliability tests. The shear strength of the Au-Sn bond with an (AuSn + Au5Sn)eut structure decreased 40% in a corrosive environment. After 3000 TS cycles, the tensile strength of the Cu-Sn bond reduced by 45%. Fracture surface analysis revealed through-bond failures that were not observed previously. In cross-sectional analysis, vertical cracks were observed, which may contribute to the decrease in tensile strength.

  11. Control of Surface Plasmon Resonance of Au/SnO2 by Modification with Ag and Cu for Photoinduced Reactions under Visible-Light Irradiation over a Wide Range.

    PubMed

    Tanaka, Atsuhiro; Hashimoto, Keiji; Kominami, Hiroshi

    2016-03-18

    Gold particles supported on tin(IV) oxide (0.2 wt% Au/SnO2) were modified with copper and silver by the multistep photodeposition method. Absorption around λ=550 nm, attributed to surface plasmon resonance (SPR) of Au, gradually shifted to longer wavelengths on modification with Cu and finally reached λ=620 nm at 0.8 wt% Cu. On the other hand, the absorption shifted to shorter wavelength with increasing amount of Ag and reached λ=450 nm at 0.8 wt% Ag. These Cu- and Ag-modified 0.2 wt% Au/SnO2 materials (Cu-Au/SnO2 and Ag-Au/SnO2) and 1.0 wt% Au/SnO2 were used for mineralization of formic acid to carbon dioxide in aqueous suspension under irradiation with visible light from a xenon lamp and three kinds of light-emitting diodes with different wavelengths. The reaction rates for the mineralization of formic acid over these materials depend on the wavelength of light. Apparent quantum efficiencies of Cu-Au/SnO2, Au/SnO2, and Ag-Au/SnO2 reached 5.5% at 625 nm, 5.8% at 525 nm, and 5.1% at 450 nm, respectively. These photocatalysts can also be used for selective oxidation of alcohols to corresponding carbonyl compounds in aqueous solution under visible-light irradiation. Broad responses to visible light in formic acid mineralization and selective alcohol oxidation were achieved when the three materials were used simultaneously.

  12. Solder extrusion pressure bonding process and bonded products produced thereby

    DOEpatents

    Beavis, L.C.; Karnowsky, M.M.; Yost, F.G.

    1992-06-16

    Disclosed is a process for production of soldered joints which are highly reliable and capable of surviving 10,000 thermal cycles between about [minus]40 C and 110 C. Process involves interposing a thin layer of a metal solder composition between the metal surfaces of members to be bonded and applying heat and up to about 1000 psi compression pressure to the superposed members, in the presence of a reducing atmosphere, to extrude the major amount of the solder composition, contaminants including fluxing gases and air, from between the members being bonded, to form a very thin, strong intermetallic bonding layer having a thermal expansion tolerant with that of the bonded members.

  13. Solder extrusion pressure bonding process and bonded products produced thereby

    DOEpatents

    Beavis, Leonard C.; Karnowsky, Maurice M.; Yost, Frederick G.

    1992-01-01

    Production of soldered joints which are highly reliable and capable of surviving 10,000 thermal cycles between about -40.degree. C. and 110.degree. C. Process involves interposing a thin layer of a metal solder composition between the metal surfaces of members to be bonded and applying heat and up to about 1000 psi compression pressure to the superposed members, in the presence of a reducing atmosphere, to extrude the major amount of the solder composition, contaminants including fluxing gases and air, from between the members being bonded, to form a very thin, strong intermetallic bonding layer having a thermal expansion tolerant with that of the bonded members.

  14. Thermal fatigue evaluation of solder alloys. Final report

    SciTech Connect

    Jarboe, D.M.

    1980-02-01

    An evaluation was made of the relative thermal fatigue resistance of 29 solder alloys. A number of these alloys were found to be less susceptible to thermal fatigue cracking in encapsulated printed wiring board applications than the commonly used tin-lead eutectic (63Sn-37Pb). Three alloys, 95Sn-5Ag, 96.5Sn-3.5Ag, and 95Sn-5Sb offered the greatest resistance to thermal fatigue. The selection of the encapsulation materials was confirmed to be a significant factor in thermal fatigue of solder joints, regardless of the solder alloy used.

  15. Solder dross removal apparatus

    NASA Technical Reports Server (NTRS)

    Webb, Winston S. (Inventor)

    1990-01-01

    An automatic dross removal apparatus is disclosed for removing dross from the surface of a solder bath in an automated electric component handling system. A rotatable wiper blade is positioned adjacent the solder bath which skims the dross off of the surface prior to the dipping of a robot conveyed component into the bath. An electronic control circuit causes a motor to rotate the wiper arm one full rotational cycle each time a pulse is received from a robot controller as a component approaches the solder bath.

  16. Solder dross removal apparatus

    NASA Technical Reports Server (NTRS)

    Webb, Winston S. (Inventor)

    1992-01-01

    An automatic dross removal apparatus (10) is disclosed for removing dross from the surface of a solder bath (22) in an automated electric component handling system. A rotatable wiper blade (14) is positioned adjacent the solder bath (22) which skims the dross off of the surface prior to the dipping of a robot conveyed component into the bath. An electronic control circuit (34) causes a motor (32) to rotate the wiper arm (14) one full rotational cycle each time a pulse is received from a robot controller (44) as a component approaches the solder bath (22).

  17. Threshold current density of electromigration in eutectic SnPb solder

    SciTech Connect

    Yeh, Y.T.; Chou, C.K.; Hsu, Y.C.; Chen Chih; Tu, K.N.

    2005-05-16

    Electromigration has emerged as an important reliability issue in the microelectronics packaging industry since the dimension of solder joints has continued to shrink. In this letter, we report a technique that enables the precise measurement of the important parameters of solder electromigration, such as activation energy, critical length, threshold current density, effective charge numbers, and electromigration rate. Patterned Cu/Ti films in a Si trench were employed for eutectic SnPb solder to be reflowed on, and thus solder Blech specimens were fabricated. Atomic force microscope was used to measure the depletion volume caused by electromigration on the cathode end. The threshold current density is estimated to be 8.5x10{sup 3} A/cm{sup 2} at 100 deg. C, which relates directly to the maximum allowable current that a solder joint can carry without electromigration damage. This technique facilitates the scientifically systematic investigation of electromigration in solders.

  18. SOLDERING OF ALUMINUM BASE METALS

    DOEpatents

    Erickson, G.F.

    1958-02-25

    This patent deals with the soldering of aluminum to metals of different types, such as copper, brass, and iron. This is accomplished by heating the aluminum metal to be soldered to slightly above 30 deg C, rubbing a small amount of metallic gallium into the part of the surface to be soldered, whereby an aluminum--gallium alloy forms on the surface, and then heating the aluminum piece to the melting point of lead--tin soft solder, applying lead--tin soft solder to this alloyed surface, and combining the aluminum with the other metal to which it is to be soldered.

  19. Wetting studies of lead-free solders on lead-free PWB finishes

    NASA Astrophysics Data System (ADS)

    Sattiraju, Seshagirirao Venkata

    as-received, aged and after multiple reflow cycles on Sn PWB test coupons to understand their effect on the growth of oxides and intermetallic compounds. Sn is the best finish in the as-received, unaged condition with all the Pb-free solders tested. It loses its solderability after extended storage and after multiple reflow cycles. The Sn finish is also cheaper compared to other alternatives such as Ag and Ni/Au finishes. Ni/Au and Ag finishes appear to be equal after multiple reflow cycles with all Pb-free solders tested. Halo formation was observed on Ni/Au board finishes with certain solder alloys. Many investigations such as line scans and spot chemical analysis were conducted on the halo to understand the mechanism involved. It was concluded that the halo formation was due to the formation of the Au-Sn intermetallic compounds. Finally, growth of intermetallic compounds at different aging temperatures for different combinations of solders and finishes has been studied and is reported. It appears that the modeling of the growth of IMCs on Sn and Ag PWB finishes based on a completely parabolic growth model may be insufficient. Diffusion is the predominant mechanism for the growth of the Ni-Sn IMCs. NiAu finish has the least thickness of the total intermetallic layer.

  20. Synthesis of Au/SnO{sub 2} core-shell structure nanoparticles by a microwave-assisted method and their optical properties

    SciTech Connect

    Yu, Yeon-Tae; Dutta, Prabir

    2011-02-15

    Au/SnO{sub 2} core-shell structure nanoparticles were synthesized using the microwave hydrothermal method. The optical and morphological properties of these particles were examined and compared with those obtained by the conventional hydrothermal method. In microwave preparation, the peak position of the UV-visible plasmon absorption band of Au nanoparticles was red-shifted from 520 to 543 nm, due to the formation of an SnO{sub 2} shell. An SnO{sub 2} shell formation was complete within 5 min. The thickness of the SnO{sub 2} shell was 10-12 nm, and the primary particle size of SnO{sub 2} crystallites was 3-5 nm. For the core-shell particles prepared by a conventional hydrothermal method, the shell formed over the entire synthesis period and was not as crystalline as those produced, using the microwave method. The relationship between the morphological and spectroscopic properties and the crystallinity of the SnO{sub 2} shell are discussed. -- Graphical abstract: In microwave preparation, the peak position of UV-visible absorption band of Au nanoparticles was red-shifted from 520 to 543 nm, due to the formation of an SnO{sub 2} shell with high crystallinity. Display Omitted Research highlights: > Au/SnO{sub 2} core-shell structure NPs were synthesized by the microwave-assisted method. > The peak position of an SP band of Au/SnO{sub 2} colloid was red-shifted till 543 nm. > The particles size of an SnO{sub 2} in the shell layer was 3-5 nm. > The crystallinity of an SnO{sub 2} shell was increased by the microwave hydrothermal reaction.

  1. Synthesis, structure, and bonding in K12Au21Sn4. A polar intermetallic compound with dense Au20 and open AuSn4 layers

    SciTech Connect

    Li, Bin; Kim, Sung-Jin; Miller, Gordon J.; and Corbett, John D.

    2009-10-29

    The new phase K{sub 12}Au{sub 21}Sn{sub 4} has been synthesized by direct reaction of the elements at elevated temperatures. Single crystal X-ray diffraction established its orthorhombic structure, space group Pmmn (No. 59), a = 12.162(2); b = 18.058(4); c = 8.657(2) {angstrom}, V = 1901.3(7) {angstrom}{sup 3}, and Z = 2. The structure consists of infinite puckered sheets of vertex-sharing gold tetrahedra (Au{sub 20}) that are tied together by thin layers of alternating four-bonded-Sn and -Au atoms (AuSn{sub 4}). Remarkably, the dense but electron-poorer blocks of Au tetrahedra coexist with more open and saturated Au-Sn layers, which are fragments of a zinc blende type structure that maximize tetrahedral heteroatomic bonding outside of the network of gold tetrahedra. LMTO band structure calculations reveal metallic properties and a pseudogap at 256 valence electrons per formula unit, only three electrons fewer than in the title compound and at a point at which strong Au-Sn bonding is optimized. Additionally, the tight coordination of the Au framework atoms by K plays an important bonding role: each Au tetrahedra has 10 K neighbors and each K atom has 8-12 Au contacts. The appreciably different role of the p element Sn in this structure from that in the triel members in K{sub 3}Au{sub 5}In and Rb{sub 2}Au{sub 3}Tl appears to arise from its higher electron count which leads to better p-bonding (valence electron concentrations = 1.32 versus 1.22).

  2. Corrosive microenvironments at lead solder surfaces arising from galvanic corrosion with copper pipe.

    PubMed

    Nguyen, Caroline K; Stone, Kendall R; Dudi, Abhijeet; Edwards, Marc A

    2010-09-15

    As stagnant water contacts copper pipe and lead solder (simulated soldered joints), a corrosion cell is formed between the metals in solder (Pb, Sn) and the copper. If the resulting galvanic current exceeds about 2 μA/cm(2), a highly corrosive microenvironment can form at the solder surface, with pH < 2.5 and chloride concentrations at least 11 times higher than bulk water levels. Waters with relatively high chloride tend to sustain high galvanic currents, preventing passivation of the solder surface, and contributing to lead contamination of potable water supplies. The total mass of lead corroded was consistent with predictions based on the galvanic current, and lead leaching to water was correlated with galvanic current. If the concentration of sulfate in the water increased relative to chloride, galvanic currents and associated lead contamination could be greatly reduced, and solder surfaces were readily passivated.

  3. A new active solder for joining electronic components

    SciTech Connect

    SMITH,RONALD W.; VIANCO,PAUL T.; HERNANDEZ,CYNTHIA L.; LUGSCHEIDER,E.; RASS,I.; HILLEN,F.

    2000-05-11

    Electronic components and micro-sensors utilize ceramic substrates, copper and aluminum interconnect and silicon. The joining of these combinations require pre-metallization such that solders with fluxes can wet such combinations of metals and ceramics. The paper will present a new solder alloy that can bond metals, ceramics and composites. The alloy directly wets and bonds in air without the use flux or premetallized layers. The paper will present typical processing steps and joint microstructures in copper, aluminum, aluminum oxide, aluminum nitride, and silicon joints.

  4. Relationship between morphologies and orientations of Cu{sub 6}Sn{sub 5} grains in Sn3.0Ag0.5Cu solder joints on different Cu pads

    SciTech Connect

    Tian, Yanhong Zhang, Rui; Hang, Chunjin; Niu, Lina; Wang, Chunqing

    2014-02-15

    The morphologies and orientations of Cu{sub 6}Sn{sub 5} intermetallic compounds in the Sn3.0Ag0.5Cu solder joints both on polycrystalline and single crystal Cu pads under different peak reflow temperatures and times above liquids were investigated. The relationship between Cu{sub 6}Sn{sub 5} grain orientations and morphologies was clarified. At the interface of Sn3.0Ag0.5Cu/polycrystalline Cu pad, scalloped Cu{sub 6}Sn{sub 5} intermetallic compounds formed at 250 °C and roof shape Cu{sub 6}Sn{sub 5} formed at 300 °C. Both scalloped Cu{sub 6}Sn{sub 5} and roof shape Cu{sub 6}Sn{sub 5} had a preferred orientation of (0001) plane being parallel to polycrystalline Cu pad surface. Besides, the percentage of large angle grain boundaries increased as the peak reflow temperature rose. At the interface of Sn3.0Ag0.5Cu/(111) single crystal Cu pad, the Cu{sub 6}Sn{sub 5} intermetallic compounds were mainly scallop-type at 250 °C and were prism type at 300 °C. The prismatic Cu{sub 6}Sn{sub 5} grains grew along the three preferred directions with the inter-angles of 60° on (111) single crystal Cu pad while along two perpendicular directions on (100) single crystal Cu pad. The orientation relationship between Cu{sub 6}Sn{sub 5} grains and the single crystal Cu pads was investigated by electron backscatter diffraction technology. In addition, two types of hollowed Cu{sub 6}Sn{sub 5} intermetallic compounds were found inside the joints of polycrystalline Cu pads. The long hexagonal Cu{sub 6}Sn{sub 5} strips were observed in the joints reflowing at 250 °C while the hollowed Cu{sub 6}Sn{sub 5} strips with the ‘▪’ shape cross-sections appeared at 300 °C, which was attributed to the different grain growth rates of different Cu{sub 6}Sn{sub 5} crystal faces. - Highlights: • The orientation of interfacial Cu{sub 6}Sn{sub 5} grains was obtained by EBSD technology. • Two types of hollowed Cu{sub 6}Sn{sub 5} strips were found at different temperatures. • The formation

  5. Three-Layer Zn/Al/Zn Clad Solder for Die Attachment

    NASA Astrophysics Data System (ADS)

    Yamaguchi, T.; Ikeda, O.; Oda, Y.; Hata, S.; Kuroki, K.; Kuroda, H.; Hirose, A.

    2015-02-01

    Three-layer Zn/Al/Zn clad solders have been developed for high-temperature die attachment. The clad structure is used to improve the wettability and bondability of Zn-Al eutectic solder by preventing oxidation of the Al. The materials were produced by clad-rolling Zn and Al strips. TEM observations revealed that the Zn/Al clad interface was metallurgically bonded and that the Al oxide was almost entirely removed. The melting behavior of Zn/Al/Zn clad solder was examined. Eutectic melting began at the Zn/Al clad interface at 382°C, and all of the material melted within approximately 10 s. Unlike conventional Zn-Al solders, Zn/Al/Zn clad solders were successfully bonded without flux. The shear strength of a Zn/Al/Zn clad solder joint was three times that of a Pb-based solder joint. The bondability of Zn/Al/Zn clad solder was superior because the Al oxide films, which prevent bonding between chip and substrate, were fragmented by clad-rolling, and the outer Zn layers prevented Al oxidation during the bonding process.

  6. Capillary flow solder wettability test

    SciTech Connect

    Vianco, P.T.; Rejent, J.A.

    1996-01-01

    A test procedure was developed to assess the capillary flow wettability of solders inside of a confined geometry. The test geometry was comprised of two parallel plates with a controlled gap of constant thickness (0.008 cm, 0.018 cm, 0.025 cm, and 0.038 cm). Capillary flow was assessed by: (1) the meniscus or capillary rise of the solder within the gap, (2) the extent of void formation in the gap, and (3) the time-dependence of the risen solder film. Tests were performed with the lead-free solders.

  7. Assessment of Solder Interconnect Integrity in Dismantled Electronic Components from N57 and B61 Tube-Type Radars

    SciTech Connect

    Rejent, J.A.; Vianco, P.T.; Woodrum, R.A.

    1999-07-01

    Aging analyses were performed on solder joints from two radar units: (1) a laboratory, N57 tube-type radar unit and (2) a field-returned, B61-0, tube-type radar unit. The cumulative temperature environments experienced by the units during aging were calculated from the intermetallic compound layer thickness and the mean Pb-rich phase particle size metrics for solder joints in the units, assuming an aging time of 35 years for both radars. Baseline aging metrics were obtained from a laboratory test vehicle assembled at AS/FM and T; the aging kinetics of both metrics were calculated from isothermal aging experiments. The N57 radar unit interconnect board solder joints exhibited very little aging. The eyelet solder joints did show cracking that most likely occurred at the time of assembly. The eyelet, SA1126 connector solder joints, showed some delamination between the Cu pad and underlying laminate. The B61 field-returned radar solder joints showed a nominal degree of aging. Cracking of the eyelet solder joints was observed. The Pb-rich phase particle measurements indicated additional aging of the interconnects as a result of residual stresses. Cracking of the terminal pole connector, pin-to-pin solder joint was observed; but it was not believed to jeopardize the electrical functionality of the interconnect. Extending the stockpile lifetime of the B61 tube-type radar by an additional 20 years would not be impacted by the reliability of the solder joints with respect to further growth of the intermetallic compound layer. Additional coarsening of the Pb-rich phase will increase the joints' sensitivity to thermomechanical fatigue.

  8. Solder extrusion pressure bonding process and bonded products produced thereby

    SciTech Connect

    Beavis, L.C.; Karnowsky, M.M.; Yost, F.G.

    1990-12-31

    Production of soldiered joints which are highly reliable and capable of surviving 10,000 thermal cycles between about {minus}40{degrees}C and 110{degrees}C. Process involves interposing a thin layer of a metal solder composition between the metal surfaces of members to be bonded and applying heat and up to about 1000 psi compression pressure to the superposed members, in the presence of a reducing atmosphere, to extrude the major amount of the solder composition, contaminants including fluxing gases and air, from between the members being bonded, to form a very thin, strong intermetallic bonding layer having a thermal expansion tolerant with that of the bonded members.

  9. The effect of 60Co (γ-ray) irradiation on the electrical characteristics of Au/SnO 2/n-Si (MIS) structures

    NASA Astrophysics Data System (ADS)

    Gökçen, M.; Tataroğlu, A.; Altındal, Ş.; Bülbül, M. M.

    2008-01-01

    The effect of 60Co (γ-ray) irradiation on the electrical properties of Au/SnO 2/n-Si (MIS) structures has been investigated using the capacitance-voltage ( C- V) and conductance-voltage ( G/ ω- V) measurements in the frequency range 1 kHz to 1 MHz at room temperature. The MIS structures were exposed to γ-rays at a dose rate of 2.12 kGy/h in water and the range of total dose was 0-500 kGy. It was found that the C- V and G/ ω- V curves were strongly influenced with both frequency and the presence of the dominant radiation-induced defects, and the series resistance was increased with increasing dose. Also, the radiation-induced threshold voltage shift (Δ VT) strongly depended on radiation dose and frequency, and the density of interface states Nss by Hill-Coleman method decreases with increasing radiation dose.

  10. Breakthrough: Lead-free Solder

    ScienceCinema

    Anderson, Iver

    2016-07-12

    Ames Laboratory senior metallurgist Iver Anderson explains the importance of lead-free solder in taking hazardous lead out of the environment by eliminating it from discarded computers and electronics that wind up in landfills. Anderson led a team that developed a tin-silver-copper replacement for traditional lead-tin solder that has been adopted by more than 50 companies worldwide.

  11. Breakthrough: Lead-free Solder

    SciTech Connect

    Anderson, Iver

    2012-01-01

    Ames Laboratory senior metallurgist Iver Anderson explains the importance of lead-free solder in taking hazardous lead out of the environment by eliminating it from discarded computers and electronics that wind up in landfills. Anderson led a team that developed a tin-silver-copper replacement for traditional lead-tin solder that has been adopted by more than 50 companies worldwide.

  12. Reliability assessment of indium solder for low temperature electronic packaging

    NASA Astrophysics Data System (ADS)

    Chang, Rui W.; Patrick McCluskey, F.

    2009-11-01

    Indium is the choice of material for cryogenic joining applications. It is superior under repeated wide temperature excursions including extreme cold temperatures (below -55 °C) because of its excellent electrical conductivity and ductility at cryogenic temperatures. In particular, it is being considered for die/substrate attaches in low temperature SiGe BiCMOS modules for Martian and Lunar exploration. An efficient and systematic assessment was conducted to evaluate the reliability of indium solder under thermal fatigue and extended cold temperature mechanical fatigue conditions encountered in space exploration missions. In addition, fatigue failure sites, modes and mechanisms in indium solder at low temperature were investigated. A fatigue model was also calibrated for indium solder joint at cryogenic temperatures.

  13. Experimental Methods in Reduced-gravity Soldering Research

    NASA Technical Reports Server (NTRS)

    Pettegrew, Richard D.; Struk, Peter M.; Watson, John K.; Haylett, Daniel R.

    2002-01-01

    The National Center for Microgravity Research, NASA Glenn Research Center, and NASA Johnson Space Center are conducting an experimental program to explore the influence of reduced gravity environments on the soldering process. An improved understanding of the effects of the acceleration environment is important to application of soldering during current and future human space missions. Solder joint characteristics that are being considered include solder fillet geometry, porosity, and microstructural features. Both through-hole and surface mounted devices are being investigated. This paper focuses on the experimental methodology employed in this project and the results of macroscopic sample examination. The specific soldering process, sample configurations, materials, and equipment were selected to be consistent with those currently on-orbit. Other apparatus was incorporated to meet requirements imposed by operation onboard NASA's KC-135 research aircraft and instrumentation was provided to monitor both the atmospheric and acceleration environments. The contingent of test operators was selected to include both highly skilled technicians and less skilled individuals to provide a population cross-section that would be representative of the skill mix that might be encountered in space mission crews.

  14. Solder creep-fatigue interactions with flexible leaded parts

    NASA Technical Reports Server (NTRS)

    Ross, R. G., Jr.; Wen, L. C.; Mon, G. R.; Jetter, E.

    1992-01-01

    With flexible leaded parts, the solder-joint failure process involves a complex interplay of creep and fatigue mechanisms. To better understand the role of creep in typical multi-hour cyclic loading conditions, a specialized non-linear finite-element creep simulation computer program has been formulated. The numerical algorithm includes the complete part-lead-solder-PWB system, accounting for strain-rate dependence of creep on applied stress and temperature, and the role of the part-lead dimensions and flexibility that determine the total creep deflection (solder strain range) during stress relaxation. The computer program has been used to explore the effects of various solder creep-fatigue parameters such as lead height and stiffness, thermal-cycle test profile, and part/board differential thermal expansion properties. One of the most interesting findings is the strong presence of unidirectional creep-ratcheting that occurs during thermal cycling due to temperature dominated strain-rate effects. To corroborate the solder fatigue model predictions, a number of carefully controlled thermal-cycle tests have been conducted using special bimetallic test boards.

  15. Effects of Aging Treatment on Mechanical Properties of Sn-58Bi Epoxy Solder on ENEPIG-Surface-Finished PCB

    NASA Astrophysics Data System (ADS)

    Kim, Jungsoo; Myung, Woo-Ram; Jung, Seung-Boo

    2016-07-01

    The mechanical properties of Sn-58Bi epoxy solder were evaluated by low-speed shear testing as functions of aging time and temperature. To determine the effects of epoxy, the interfacial reaction and mechanical properties of both Sn-58Bi and Sn-58Bi epoxy solder were investigated after aging treatment. The chemical composition and growth kinetics of the intermetallic compound (IMC) formed at the interface between Sn-58Bi solder and electroless nickel electroless palladium immersion gold (ENEPIG) surface finish were analyzed. Sn-58Bi solder paste was applied by stencil-printing on flame retardant-4 substrate, then reflowed. Reflowed samples were aged at 85°C, 95°C, 105°C, and 115°C for up to 1000 h. (Ni,Pd)3Sn4 IMC formed between Sn-58Bi solder and ENEPIG surface finish after reflow. Ni3Sn4 and Ni3P IMCs formed at the interface between (Ni,Pd)3Sn4 IMC and ENEPIG surface finish after aging at 115°C for 300 h. The overall IMC growth rate of Sn-58Bi solder joint was higher than that of Sn-58Bi epoxy solder joint during aging. The shear strength of Sn-58Bi epoxy solder was about 2.4 times higher than that of Sn-58Bi solder due to the blocking effect of epoxy, and the shear strength decreased with increasing aging time.

  16. Effects of Aging Treatment on Mechanical Properties of Sn-58Bi Epoxy Solder on ENEPIG-Surface-Finished PCB

    NASA Astrophysics Data System (ADS)

    Kim, Jungsoo; Myung, Woo-Ram; Jung, Seung-Boo

    2016-11-01

    The mechanical properties of Sn-58Bi epoxy solder were evaluated by low-speed shear testing as functions of aging time and temperature. To determine the effects of epoxy, the interfacial reaction and mechanical properties of both Sn-58Bi and Sn-58Bi epoxy solder were investigated after aging treatment. The chemical composition and growth kinetics of the intermetallic compound (IMC) formed at the interface between Sn-58Bi solder and electroless nickel electroless palladium immersion gold (ENEPIG) surface finish were analyzed. Sn-58Bi solder paste was applied by stencil-printing on flame retardant-4 substrate, then reflowed. Reflowed samples were aged at 85°C, 95°C, 105°C, and 115°C for up to 1000 h. (Ni,Pd)3Sn4 IMC formed between Sn-58Bi solder and ENEPIG surface finish after reflow. Ni3Sn4 and Ni3P IMCs formed at the interface between (Ni,Pd)3Sn4 IMC and ENEPIG surface finish after aging at 115°C for 300 h. The overall IMC growth rate of Sn-58Bi solder joint was higher than that of Sn-58Bi epoxy solder joint during aging. The shear strength of Sn-58Bi epoxy solder was about 2.4 times higher than that of Sn-58Bi solder due to the blocking effect of epoxy, and the shear strength decreased with increasing aging time.

  17. METHOD FOR SOLDERING NORMALLY NON-SOLDERABLE ARTICLES

    DOEpatents

    McGuire, J.C.

    1959-11-24

    Methods are presented for coating and joining materials which are considered difficult to solder by utilizing an abrasive wheel and applying a bar of a suitable coating material, such as Wood's metal, to the rotating wheel to fill the cavities of the abrasive wheel and load the wheel with the coating material. The surface of the base material is then rubbed against the loaded rotating wheel, thereby coating the surface with the soft coating metal. The coating is a cohesive bonded layer and holds the base metal as tenaciously as a solder holds to easily solderable metals.

  18. Low-temperature solder for joining large cryogenic structures. [cooling cools for the National Transonic Facility

    NASA Technical Reports Server (NTRS)

    Buckley, J. D.; Sandefur, P. G., Jr.

    1980-01-01

    Three joining methods were considered for use in fabricating cooling coils for the National Transonic Facility. After analysis and preliminary testing, soldering was chosen as the cooling coil joining technique over mechanical force fit and brazing techniques. Charpy V-Notch tests, cyclic thermal tests (ambient to 77.8 K) and tensile tests at cryogenic temperatures were performed on solder joints to evaluate their structural integrity. It was determined that low temperature solder can be used to ensure good fin-to-tube contact for cooling-coil applications.

  19. Requirements for soldered electrical connections

    NASA Technical Reports Server (NTRS)

    1992-01-01

    This publication is applicable to NASA programs involving solder connections for flight hardware, mission essential support equipment, and elements thereof. This publication sets forth hand and wave soldering requirements for reliable electrical connections. The prime consideration is the physical integrity of solder connections. Special requirements may exist which are not in conformance with the requirements of this publication. Design documentation contains the detail for these requirements, and they take precedence over conflicting portions of this publication when they are approved in writing by the procuring NASA installation.

  20. Reliability of lead-free solders in electronic packaging technology

    NASA Astrophysics Data System (ADS)

    Choi, Woojin

    The electromigration of flip chip solder bump (eutetic SnPb) has been studied at temperatures of 100, 125 and 150°C and current densities of 1.9 to 2.75 x 104 A/cm2. The under-bump-metallization on the chip side is thin film Al/Ni(V)/Cu and on the board side is thick Cu. By simulation, we found that current crowding occurs at the corner on the chip side where the electrons enter the solder ball. We are able to match this simulation to the real electromigration damage in the sample. The experimental result showed that voids initiated from the position of current crowding and propagated across the interface between UBM and the solder ball. The Cu-Sn intermetallic compounds formed during the reflow is known to adhere well to the thin film UBM, but they detached from the UBM after current stressing. Therefore, the UBM itself becomes part of the reliability problem of the flip chip solder joint under electromigration. Currently there is a renewed interest in Sn whisker growth owing to the introduction of Pb-free solder in electronic manufacturing. The leadframe is electroplated or finished with a layer of Pb-free solder. The solder is typically pure Sn or eutectic SnCu (0.7 atomic % Cu). It is a serious reliability concern in the use of the eutectic SnCu solder as leadframe surface finish due to the growth of long whiskers on it. The origin of the driving force of compressive stress can be mechanical, thermal, and chemical. Among them, the chemical force is the most important contribution to the whisker growth and its origin is due to the reaction between Sn and Cu to form intermetallic compound (IMC) at room temperature. For whisker or hillock growth, the surface cannot be free of oxide and it must be covered with oxide and the oxide must be a protective one so that it removes effectively all the vacancy sources and sinks on the surface. Hence, only those metals, which grow protective oxides such as Al and Sn, are known to have hillock growth or whisker growth. We

  1. The effect of intermetallic compound morphology on Cu diffusion in Sn-Ag and Sn-Pb solder bump on the Ni/Cu Under-bump metallization

    NASA Astrophysics Data System (ADS)

    Jang, Guh-Yaw; Duh, Jenq-Gong

    2005-01-01

    The eutectic Sn-Ag solder alloy is one of the candidates for the Pb-free solder, and Sn-Pb solder alloys are still widely used in today’s electronic packages. In this tudy, the interfacial reaction in the eutectic Sn-Ag and Sn-Pb solder joints was investigated with an assembly of a solder/Ni/Cu/Ti/Si3N4/Si multilayer structures. In the Sn-3.5Ag solder joints reflowed at 260°C, only the (Ni1-x,Cux)3Sn4 intermetallic compound (IMC) formed at the solder/Ni interface. For the Sn-37Pb solder reflowed at 225°C for one to ten cycles, only the (Ni1-x,Cux)3Sn4 IMC formed between the solder and the Ni/Cu under-bump metallization (UBM). Nevertheless, the (Cu1-y,Niy)6Sn5 IMC was observed in joints reflowed at 245°C after five cycles and at 265°C after three cycles. With the aid of microstructure evolution, quantitative analysis, and elemental distribution between the solder and Ni/Cu UBM, it was revealed that Cu content in the solder near the solder/IMC interface played an important role in the formation of the (Cu1-y,Niy)6Sn5 IMC. In addition, the diffusion behavior of Cu in eutectic Sn-Ag and Sn-Pb solders with the Ni/Cu UBM were probed and discussed. The atomic flux of Cu diffused through Ni was evaluated by detailed quantitative analysis in an electron probe microanalyzer (EPMA). During reflow, the atomic flux of Cu was on the order of 1016-1017 atoms/cm2sec in both the eutectic Sn-Ag and Sn-Pb systems.

  2. Solder Interconnect Predictor (SIP) Software v. 0.5

    2008-11-19

    This software tool was developed for predicting the fatigue damage in a wide variety of 63Sn-37Pb solder joints used in electronics applications. This tool is based upon the unified creep plasticity damage model CompSIR developed at Sandia National Laboratories. The software can be used as a design tool for predicting the long term reliability of consumer, military and space electronics. Both service as well as accelerated testing environments can be addressed by the user. Themore » mesh generating function provides the user with the greater versatility to explore different package and I/O configurations. For example, different solder joint geometries can be investigated to determine the effects of workmanship quality on reliability. Graphical user interfaces provide the user with easy data input screens as well as results profiles.« less

  3. Solder Interconnect Predictor (SIP) Software v. 0.5

    SciTech Connect

    VIANCO, PAUL; NEILSEN, MICHAEL; & REJENT, JEROME

    2008-11-19

    This software tool was developed for predicting the fatigue damage in a wide variety of 63Sn-37Pb solder joints used in electronics applications. This tool is based upon the unified creep plasticity damage model CompSIR developed at Sandia National Laboratories. The software can be used as a design tool for predicting the long term reliability of consumer, military and space electronics. Both service as well as accelerated testing environments can be addressed by the user. The mesh generating function provides the user with the greater versatility to explore different package and I/O configurations. For example, different solder joint geometries can be investigated to determine the effects of workmanship quality on reliability. Graphical user interfaces provide the user with easy data input screens as well as results profiles.

  4. Soldered joints—an essential component of demountable high temperature superconducting fusion magnets

    NASA Astrophysics Data System (ADS)

    Tsui, Yeekin; Surrey, Elizabeth; Hampshire, Damian

    2016-07-01

    Demountable superconducting magnet coils would offer significant benefits to commercial nuclear fusion power plants. Whether large pressed joints or large soldered joints provide the solution for demountable fusion magnets, a critical component or building block for both will be the many, smaller-scale joints that enable the supercurrent to leave the superconducting layer, cross the superconducting tape and pass into the solder that lies between the tape and the conductor that eventually provides one of the demountable surfaces. This paper considers the electrical and thermal properties of this essential component part of demountable high temperature superconducting (HTS) joints by considering the fabrication and properties of jointed HTSs consisting of a thin layer of solder (In52Sn48 or Pb38Sn62) sandwiched between two rare-earth-Ba2Cu3O7 (REBCO) second generation HTS coated conductors (CCs). The HTS joints are analysed using numerical modelling, critical current and resistivity measurements on the joints from 300 to 4.2 K in applied magnetic fields up to 12 T, as well as scanning electron microscopy studies. Our results show that the copper/silver layers significantly reduce the heating in the joints to less than a few hundred mK. When the REBCO alone is superconducting, the joint resistivity (R J) predominantly has two sources, the solder layer and an interfacial resistivity at the REBCO/silver interface (∼25 nΩ cm2) in the as-supplied CCs which together have a very weak magnetoresistance in fields up to 12 T. We achieved excellent reproducibility in the R J of the In52Sn48 soldered joints of better than 10% at temperatures below T c of the REBCO layer which can be compared to variations of more than two orders of magnitude in the literature. We also show that demountable joints in fusion energy magnets are viable and need only add a few percent to the total cryogenic cost for a fusion tokamak.

  5. Long-term effects of soldering fumes upon respiratory symptoms and pulmonary function.

    PubMed

    Rastogi, S K; Gupta, B N; Husain, T; Pangtey, B S; Srivastava, S; Garg, N

    1991-06-01

    To evaluate the long-term effect of soldering gases and fumes, and of cigarette smoke on lung function, and the prevalence of respiratory symptoms, a comparative study of spirometric measurements in 57 solderers engaged in acetylene gas soldering of brassware joints in the brass industry (mean exposure: 12.4 +/- 1.1 years) and in 131 controls was performed. The two groups were similar in age, height, smoking habits and social class. The prevalence of respiratory symptoms in the solderers did not differ significantly from that in the unexposed controls (59.6 vs 56.4%). However, solderers who smoked showed higher prevalence of respiratory symptoms than those who did not smoke; a similar trend was observed in the controls. The study failed to demonstrate any association between the respiratory symptoms and length of exposure. The respiratory status of the solderers was unaffected as the results of spirometric measurements of lung function did not show any significant differences between the exposed and the control groups, indicating the absence of an additive effect of cigarette smoking and exposure to soldering fumes.

  6. Economical solder connections to thin films

    NASA Technical Reports Server (NTRS)

    Bass, J. A.; Gaddy, E. M.

    1979-01-01

    Soldering procedure, successfully tested for attaching leads to silicon solar cells, cover-glasses, is simple, inexpensive, and very effective in forming stable connection. Procedure uses solder of indium alloyed with either silver or tin.

  7. Morphological evolution of voids by surface drift diffusion driven by capillary, electromigration, and thermal-stress gradients induced by steady-state heat flow in passivated metallic thin films and flip chip solder joints. I. Theory

    NASA Astrophysics Data System (ADS)

    Ogurtani, Tarik Omer; Akyildiz, Oncu

    2008-07-01

    The morphological evolution of intragranular voids induced by surface drift diffusion under the actions of capillary and electromigration (EM) forces and thermal-stress gradients (TSGs) associated with steady-state heat flow is investigated in passivated metallic thin films and flip chip solder joints via computer simulation using the front-tracking method. In the mesoscopic nonequilibrium thermodynamic formulation of the generalized driving forces for the thermal-stress-induced surface drift diffusion, not only the usual elastic strain energy density contribution but also the elastic dipole tensor interaction (EDTI) between the thermal-stress field and the mobile atomic species (monovacancies) are considered using the concept of elastic interaction energy promoted in unified linear instability analysis (ULISA) [T. O. Ogurtani, Phys. Rev. B 74, 155422 (2006)]. According to extensive computer experiments performed on voids, which are initially cylindrical in shape, two completely different and topographically distinct behaviors are observed during the development of quasistationary state void surface morphologies, even in the presence of strong EM forces. These behaviors strictly depend on whether or not heat flux crowding occurs in the regions between the void surface layer and the sidewalls of the interconnect lines due to proximity effects of the insulating boundaries. In both morphological cases, however, one also observes two well-defined regimes, namely, the EM and TSG dominated regimes in EM versus EDTI parametric space. In the case of the TSG dominated regime, the void center of gravity (centroid) exhibits uniform displacement (drift) velocity proportional and opposite to the induced TSG exactly as predicted by ULISA theory. These domains are bounded by a threshold level curve for the EDTI parameter, above which an extremely sharp crack tip nucleation and propagation occurs in the highly localized minima in the triaxial stress regions (i.e., hot spots

  8. Modified Spot Welder Solders Flat Cables

    NASA Technical Reports Server (NTRS)

    Haehner, Carl L.

    1992-01-01

    Soldering device, essentially modified spot welder, melts high-melting-temperature solders without damaging plastic insulation on flat electrical cables. Solder preform rests on exposed conductor of cable, under connector pin. Electrodes press pin/preform/conductor sandwich together and supply pulse of current to melt preform, bonding pin to conductor. Anvil acts as support and heat sink. Device used to solder flexible ribbon cables to subminiature pin connectors.

  9. In Situ Study on Current Density Distribution and Its Effect on Interfacial Reaction in a Soldering Process

    NASA Astrophysics Data System (ADS)

    Qu, Lin; Zhao, Ning; Ma, Haitao; Zhao, Huijing; Huang, Mingliang

    2015-01-01

    The interfacial reaction in Cu/Sn/Cu solder joint during liquid-solid eletromigration (EM) was in situ studied using synchrotron radiation real-time imaging technology. The current density distribution in the solder joint was analyzed with the finite element method (FEM). The relationships among solder shape, current density distribution, Cu dissolution, and the formation and dissolution of interfacial intermetallic compound (IMC) were revealed. The current promoted dissolution of the cathode IMC and growth of the anode IMC and suppressed the dissolution of anode Cu. The change of interfacial IMC had little effect on the current density distribution; however, the dissolution of cathode Cu, which changed the solder shape, had a significant effect on the current density distribution. The dissolution of cathode Cu under forward current and cathode IMC under reverse current and the growth of anode IMC under forward current was faster where the current density was higher. The synchrotron radiation real-time imaging technology can not only in situ observe the change of solder shape, the dissolution and growth behavior of interfacial IMC and the dissolution behavior of substrate in a soldering process but also provide data needed for numerical simulation of current density distribution in a solder joint.

  10. Mechanical properties of Pb-free solder alloys on thick film hybrid microcircuits

    SciTech Connect

    Hernandez, C.L.; Vianco, P.T.; Rejent, J.A.; Hosking, F.M.

    1998-03-10

    The technology drivers of the electronics industry continue to be systems miniaturization and reliability, in addition to addressing a variety of important environmental issues. Although the Sn-Pb eutectic alloy is widely used as a joining material in the electronics industry, it has drawn environmental concern due to its Pb content. The solder acts both as an electrical and mechanical connection within the different packaging levels in an electronic device. New Pb-free solders are being developed at Sandia National Laboratories. The alloys are based on the Sn-Ag alloy, having Bi and Au additions. Prototype hybrid microcircuit (HMC) test vehicles have been assembled to evaluate Pb-free solders for Au-Pt-Pd thick film soldering. The test components consist of a variety of dummy chip capacitors and leadless ceramic chip carriers (LCCC`s). The mechanical properties of the joints were evaluated. The reflow profiles and the solid state intermetallic formation reaction will also be presented. Improved solder joint manufacturability and increased fatigue resistance solder alloys are the goals of these materials.

  11. 16 CFR 501.8 - Solder.

    Code of Federal Regulations, 2013 CFR

    2013-01-01

    ... 16 Commercial Practices 1 2013-01-01 2013-01-01 false Solder. 501.8 Section 501.8 Commercial Practices FEDERAL TRADE COMMISSION RULES, REGULATIONS, STATEMENT OF GENERAL POLICY OR INTERPRETATION AND... 500 § 501.8 Solder. Solder and brazing alloys containing precious metals when packaged and labeled...

  12. 16 CFR 501.8 - Solder.

    Code of Federal Regulations, 2011 CFR

    2011-01-01

    ... 16 Commercial Practices 1 2011-01-01 2011-01-01 false Solder. 501.8 Section 501.8 Commercial Practices FEDERAL TRADE COMMISSION RULES, REGULATIONS, STATEMENT OF GENERAL POLICY OR INTERPRETATION AND... 500 § 501.8 Solder. Solder and brazing alloys containing precious metals when packaged and labeled...

  13. 16 CFR 501.8 - Solder.

    Code of Federal Regulations, 2012 CFR

    2012-01-01

    ... 16 Commercial Practices 1 2012-01-01 2012-01-01 false Solder. 501.8 Section 501.8 Commercial Practices FEDERAL TRADE COMMISSION RULES, REGULATIONS, STATEMENT OF GENERAL POLICY OR INTERPRETATION AND... 500 § 501.8 Solder. Solder and brazing alloys containing precious metals when packaged and labeled...

  14. 16 CFR 501.8 - Solder.

    Code of Federal Regulations, 2010 CFR

    2010-01-01

    ... 16 Commercial Practices 1 2010-01-01 2010-01-01 false Solder. 501.8 Section 501.8 Commercial Practices FEDERAL TRADE COMMISSION RULES, REGULATIONS, STATEMENT OF GENERAL POLICY OR INTERPRETATION AND... 500 § 501.8 Solder. Solder and brazing alloys containing precious metals when packaged and labeled...

  15. 16 CFR 501.8 - Solder.

    Code of Federal Regulations, 2014 CFR

    2014-01-01

    ... 16 Commercial Practices 1 2014-01-01 2014-01-01 false Solder. 501.8 Section 501.8 Commercial Practices FEDERAL TRADE COMMISSION RULES, REGULATIONS, STATEMENT OF GENERAL POLICY OR INTERPRETATION AND... 500 § 501.8 Solder. Solder and brazing alloys containing precious metals when packaged and labeled...

  16. 21 CFR 189.240 - Lead solders.

    Code of Federal Regulations, 2013 CFR

    2013-04-01

    ... 21 Food and Drugs 3 2013-04-01 2013-04-01 false Lead solders. 189.240 Section 189.240 Food and... Addition to Human Food Through Food-Contact Surfaces § 189.240 Lead solders. (a) Lead solders are alloys of metals that include lead and are used in the construction of metal food cans. (b) Food packaged in...

  17. 21 CFR 189.240 - Lead solders.

    Code of Federal Regulations, 2011 CFR

    2011-04-01

    ... 21 Food and Drugs 3 2011-04-01 2011-04-01 false Lead solders. 189.240 Section 189.240 Food and... Addition to Human Food Through Food-Contact Surfaces § 189.240 Lead solders. (a) Lead solders are alloys of metals that include lead and are used in the construction of metal food cans. (b) Food packaged in...

  18. 21 CFR 189.240 - Lead solders.

    Code of Federal Regulations, 2010 CFR

    2010-04-01

    ... 21 Food and Drugs 3 2010-04-01 2009-04-01 true Lead solders. 189.240 Section 189.240 Food and... Addition to Human Food Through Food-Contact Surfaces § 189.240 Lead solders. (a) Lead solders are alloys of metals that include lead and are used in the construction of metal food cans. (b) Food packaged in...

  19. 21 CFR 189.240 - Lead solders.

    Code of Federal Regulations, 2014 CFR

    2014-04-01

    ... 21 Food and Drugs 3 2014-04-01 2014-04-01 false Lead solders. 189.240 Section 189.240 Food and...-Contact Surfaces § 189.240 Lead solders. (a) Lead solders are alloys of metals that include lead and are used in the construction of metal food cans. (b) Food packaged in any container that makes use of...

  20. 21 CFR 189.240 - Lead solders.

    Code of Federal Regulations, 2012 CFR

    2012-04-01

    ... 21 Food and Drugs 3 2012-04-01 2012-04-01 false Lead solders. 189.240 Section 189.240 Food and... Addition to Human Food Through Food-Contact Surfaces § 189.240 Lead solders. (a) Lead solders are alloys of metals that include lead and are used in the construction of metal food cans. (b) Food packaged in...

  1. NASA-DoD Lower Process Temperature Lead-Free Solder Project Overview

    NASA Technical Reports Server (NTRS)

    Kessel, Kurt R.

    2014-01-01

    This project is a follow-on effort to the Joint Council on Aging AircraftJoint Group on Pollution Prevention (JCAAJG-PP) Pb-free Solder Project and NASA-DoD Lead-Free Electronics Project which were the first projects to test the reliability of Pb-free solder joints against the requirements of the aerospace and military community. This effort would continue to build on the results from the JCAAJG-PP Lead-Free Solder Project and NASA-DoD Lead-Free Electronics Project while focusing on a particular failure mechanism currently plaguing Pb-free assemblies, pad cratering.The NASA-DoD Lead-Free Electronics Project confirmed that pad cratering is one of the dominant failure modes that occur in various board level reliability tests, especially under dynamic loading. Pad Cratering is a latent defect that may occur during assembly, rework, and post assembly handling and testing.

  2. Ultrasonic semi-solid coating soldering 6061 aluminum alloys with Sn-Pb-Zn alloys.

    PubMed

    Yu, Xin-ye; Xing, Wen-qing; Ding, Min

    2016-07-01

    In this paper, 6061 aluminum alloys were soldered without a flux by the ultrasonic semi-solid coating soldering at a low temperature. According to the analyses, it could be obtained that the following results. The effect of ultrasound on the coating which promoted processes of metallurgical reaction between the components of the solder and 6061 aluminum alloys due to the thermal effect. Al2Zn3 was obtained near the interface. When the solder was in semi-solid state, the connection was completed. Ultimately, the interlayer mainly composed of three kinds of microstructure zones: α-Pb solid solution phases, β-Sn phases and Sn-Pb eutectic phases. The strength of the joints was improved significantly with the minimum shear strength approaching 101MPa.

  3. Ultrasonic semi-solid coating soldering 6061 aluminum alloys with Sn-Pb-Zn alloys.

    PubMed

    Yu, Xin-ye; Xing, Wen-qing; Ding, Min

    2016-07-01

    In this paper, 6061 aluminum alloys were soldered without a flux by the ultrasonic semi-solid coating soldering at a low temperature. According to the analyses, it could be obtained that the following results. The effect of ultrasound on the coating which promoted processes of metallurgical reaction between the components of the solder and 6061 aluminum alloys due to the thermal effect. Al2Zn3 was obtained near the interface. When the solder was in semi-solid state, the connection was completed. Ultimately, the interlayer mainly composed of three kinds of microstructure zones: α-Pb solid solution phases, β-Sn phases and Sn-Pb eutectic phases. The strength of the joints was improved significantly with the minimum shear strength approaching 101MPa. PMID:26964943

  4. Solder Mounting Technologies for Electronic Packaging

    SciTech Connect

    VIANCO, PAUL T.

    1999-09-23

    Soldering provides a cost-effective means for attaching electronic packages to circuit boards using both small scale and large scale manufacturing processes. Soldering processes accommodate through-hole leaded components as well as surface mount packages, including the newer area array packages such as the Ball Grid Arrays (BGA), Chip Scale Packages (CSP), and Flip Chip Technology. The versatility of soldering is attributed to the variety of available solder alloy compositions, substrate material methodologies, and different manufacturing processes. For example, low melting temperature solders are used with temperature sensitive materials and components. On the other hand, higher melting temperature solders provide reliable interconnects for electronics used in high temperature service. Automated soldering techniques can support large-volume manufacturing processes, while providing high reliability electronic products at a reasonable cost.

  5. Instantaneous fluxless bonding of Au with Pb-Sn solder in ambient atmosphere

    SciTech Connect

    Lee, T.K.; Zhang, Sam; Wong, C.C.; Tan, A.C.

    2005-08-01

    A fluxless bonding technique has been developed as a method of flip-chip bonding for microelectronic packaging. The fluxless bonding technique can be achieved instantaneously in an ambient environment between metallic stud bumps and predefined molten solder. This paper describes the mechanics of the bonding action and verifies the effectiveness of this bonding method through wetting balance tests and scanning electron microscope and energy dispersive x-ray analysis. This technique has been demonstrated by using a gold stud bump to break the tin oxide layer over molten solder. This allows for a fast, solid liquid interdiffusion between gold (Au) and the fresh molten eutectic lead-tin (Pb-Sn) solder for joint formation during solidification. This bonding method has been successfully tested with 130-{mu}m-pitch flip-chip bond pads on a joint-in-via flex substrate architecture.

  6. Liquid phase sintered composite solders for next generation thermal interface applications

    NASA Astrophysics Data System (ADS)

    Liu, Jia

    It is undeniable that electronics are becoming increasingly powerful and that there is continual effort towards miniaturization of these devices and thus increasing heat generation requires a new paradigm in thermal interface materials (TIM) design. This work was aimed at optimizing the processing parameters and characterizing the performance of Cu-In composite solders produced by liquid phase sintering (LPS). These composites comprise a high-melting phase (HMP) such as Cu embedded in a matrix of a low-melting phase (LMP) such as In. Copper contributes to high thermal and electrical conductivity of composites, whereas the soft In matrix helps maintain high shear compliance. This combination of high electrical/thermal conductivities and high shear compliance makes these solders suitable for a range of next-generation thermal interface material (TIM) and interconnect (IC) applications. After considering a range of compositions, a solder with 60 volume percent In was found to possess the requisite combination of high compliance and high conductivity. During the study, interfacial engineering was introduced to slow down the reaction between Cu and In, and hence further improve the performance of composite solders. A dual interfacial layer consisting of Al 2O3 and Au was used to mitigate the reaction between Cu and In. A 1 nm Al2O3 layer was used as a diffusion barrier to prohibit the inter-diffusion between Cu and In, while a 20 nm Au layer was coated on top of the ceramic Al2O3 for wetting enhancement. The dual layer increased the thermal conductivity of the solder by a factor of ˜2 while reducing the yield strength to make the solder more compliant. The effects of particle size, shape and volume fraction was also studied, and a simple model was utilized to explain the trends in the mechanical and the thermal properties. The optimized Cu-In composite solders were further used to study the performance of solder joints. Mechanical properties under shear and joint

  7. Mechanical Shock Behavior of Environmentally-Benign Lead-free Solders

    NASA Astrophysics Data System (ADS)

    Yazzie, Kyle

    The mechanical behavior of Pb-free solder alloys is important, since they must maintain mechanical integrity under thermomechanical fatigue, creep, and mechanical shock conditions. Mechanical shock, in particular, has become an increasing concern in the electronics industry, since electronic packages can be subjected to mechanical shock by mishandling during manufacture or by accidental dropping. In this study, the mechanical shock behavior of Sn and Sn-Ag-Cu alloys was systematically analyzed over the strain rate range 10-3 -- 30 s-1 in bulk samples, and over 10-3 -- 12 s-1 on the single solder joint level. More importantly, the influences of solder microstructure and intermetallic compounds (IMC) on mechanical shock resistance were quantified. A thorough microstructural characterization of Sn-rich alloys was conducted using synchrotron x-ray computed tomography. The three-dimensional morphology and distribution of contiguous phases and precipitates was analyzed. A multiscale approach was utilized to characterize Sn-rich phases on the microscale with x-ray tomography and focused ion beam tomography to characterize nanoscale precipitates. A high strain rate servohydraulic test system was developed in conjunction with a modified tensile specimen geometry and a high speed camera for quantifying deformation. The effect of microstructure and applied strain rate on the local strain and strain rate distributions were quantified using digital image correlation. Necking behavior was analyzed using a novel mirror fixture, and the triaxial stresses associated with necking were corrected using a self-consistent method to obtain the true stress-true strain constitutive behavior. Fracture mechanisms were quantified as a function of strain rate. Finally, the relationship between solder microstructure and intermetallic compound layer thickness with the mechanical shock resistance of Sn-3.8Ag-0.7Cu solder joints was characterized. It was found that at low strain rates the dynamic

  8. [Studies on silver soldering of super-elastic Ti-Ni alloy wire to Co-Cr alloy wire].

    PubMed

    Kuroda, K

    1994-12-01

    In order to attain joining the super-elastic Ti-Ni alloy wire to the Co-Cr alloy wire and be able to maintain the super-elasticity of the Ti-Ni alloy wire, a new soldering method was devised. The silver solder was first molten on the 0.016 x 0.022 inch Co-Cr alloy wire (Co-Cr) and then flowed onto the 0.016 x 0.022 inch super-elastic Ti-Ni alloy wire (Ti-Ni) to form soldering. The specimens of soldered Ti-Ni to Co-Cr butt joint, TN-CC, were examined for its super-elasticity, torsional strength, tensile strength and the metallographic structure of the soldered joint. The findings were as follows: 1. TN-CC still maintained its super-elasticity. 2. The torsional strength of TN-CC was equal to that of Ti-Ni. The tensile strength of TN-CC was 73% of that of Ti-Ni. 3. The tensile strength of TN-CC immersed in 1%NaCl solution at 37 degrees C for 30 days was considered to be still strong enough for clinical use. 4. During the tensile strength test, the breakage of TN-CC occurred at the area of merger of the solder and Ti-Ni. As the reason for this breakage, it suggested that Ti-Ni was stretched and narrowed at the soldered area and that the Sn-rich phase in the solder was induced along Ti-Ni. 5. This new soldering method was shown to be useful in clinical cases, and the fabrication of new orthodontic appliance using two distinct types of wire, one to independently move teeth and the other to be the anchorage, has already been developed. PMID:7897269

  9. Effects of Ga Addition on Interfacial Reactions Between Sn-Based Solders and Ni

    NASA Astrophysics Data System (ADS)

    Wang, Chao-Hong; Li, Kuan-Ting

    2016-07-01

    The use of Ga as a micro-alloying element in Sn-based solders can change the microstructure of solder joints to improve the mechanical properties, and even suppress the interfacial intermetallic compound (IMC) growth. This research investigated the effects of Ga addition (0.2-1 wt.%Ga) on the IMC formation and morphological evolution in the Sn-based solder joints with Ni substrate. In the soldering reaction at 250°C and with less than 0.2 wt.%Ga addition, the formed phase was Ni3Sn4. When the Ga addition increased to 0.5 wt.%, it changed to a thin Ni2Ga3 layer of ˜1 μm thick, which stably existed at the interface in the initial 1-h reaction. Subsequently, the whole Ni2Ga3 layer detached from the Ni substrate and drifted into the molten solder. The Ni3Sn4 phase became dominant in the later stage. Notably, the Ga addition significantly reduced the grain size of Ni3Sn4, resulting in the massive spalling of Ni3Sn4 grains. With 1 wt.%Ga addition, the Ni2Ga3 layer remained very thin with no significant growth, and it stably existed at the interface for more than 10 h. In addition, the solid-state reactions were examined at temperatures of 160°C to 200°C. With addition of 0.5 wt.%Ga, the Ni3Sn4 phase dominated the whole reaction. By contrast, with increasing to 1 wt.%Ga, only a thin Ni2Ga3 layer was found even after aging at 160°C for more than 1200 h. The 1 wt.%Ga addition in solder can effectively inhibit the Ni3Sn4 formation in soldering and the long-term aging process.

  10. Electromigration-induced back stress in critical solder length for three-dimensional integrated circuits

    SciTech Connect

    Huang, Y. T.; Hsu, H. H.; Wu, Albert T.

    2014-01-21

    Because of the miniaturization of electronic devices, the reliability of electromigration has become a major concern when shrinking the solder dimensions in flip-chip joints. Fast reaction between solders and electrodes causes intermetallic compounds (IMCs) to form, which grow rapidly and occupy entire joints when solder volumes decrease. In this study, U-grooves were fabricated on Si chips as test vehicles. An electrode-solder-electrode sandwich structure was fabricated by using lithography and electroplating. Gaps exhibiting well-defined dimensions were filled with Sn3.5Ag solders. The gaps between the copper electrodes in the test sample were limited to less than 15 μm to simulate microbumps. The samples were stressed at various current densities at 100 °C, 125 °C, and 150 °C. The morphological changes of the IMCs were observed, and the dimensions of the IMCs were measured to determine the kinetic growth of IMCs. Therefore, this study focused on the influence of back stress caused by microstructural evolution in microbumps.

  11. Tin soldering of aluminum and its alloys

    NASA Technical Reports Server (NTRS)

    Gallo, Gino

    1921-01-01

    A method is presented for soldering aluminum to other metals. The method adopted consists of a galvanic application to the surface of the light-metal parts to be soldered, of a layer of another metal, which, without reacting electrolytically on the aluminum, adheres strongly to the surface to which it is applied, and is, on the other hand, adapted to receive the soft solder. The metal found to meet the criteria best was iron.

  12. Development of Sn-Ag-Cu-X Solders for Electronic Assembly by Micro-Alloying with Al

    SciTech Connect

    Boesenberg, Adam; Anderson, Iver; Harringa, Joel

    2012-03-10

    Of Pb-free solder choices, an array of solder alloys based on the Sn-Ag-Cu (SAC) ternary eutectic (T eut = 217°C) composition have emerged with potential for broad use, including ball grid array (BGA) joints that cool slowly. This work investigated minor substitutional additions of Al (<0.25 wt.%) to Sn-3.5Ag-0.95Cu (SAC3595) solders to promote more consistent solder joint microstructures and to avoid deleterious product phases, e.g., Ag3Sn “blades,” for BGA cooling rates, since such Al additions to SAC had already demonstrated excellent thermal aging stability. Consistent with past work, blade formation was suppressed for increased Al content (>0.05Al), but the suppression effect faded for >0.20Al. Undercooling suppression did not correlate specifically with blade suppression since it became significant at 0.10Al and increased continuously with greater Al to 0.25Al. Surprisingly, an intermediate range of Al content (0.10 wt.% to 0.20 wt.% Al) promoted formation of significant populations of 2-μm to 5-μm faceted Cu-Al particles, identified as Cu33Al17, that clustered at the top of the solder joint matrix and exhibited extraordinary hardness. Clustering of Cu33Al17 was attributed to its buoyancy, from a lower density than Sn liquid, and its early position in the nucleation sequence within the solder matrix, permitting unrestricted migration to the top interface. Joint microstructures and implications for the full nucleation sequence for these SAC + Al solder joints are discussed, along with possible benefits from the clustered particles for improved thermal cycling resistance.

  13. Impact of lead and other metallic solders on water quality

    SciTech Connect

    Murrell, N.E.

    1990-02-01

    A study of the relationship between water quality at the consumer's taps and the corrosion of lead solder was conducted under actual field conditions in 90 homes supplied by public water in the South Huntington Water District (New York) and at 14 houses supplied by private wells in Suffolk County on Long Island (New York). The study was done in three phases three different pH ranges (5.0-6.8, 7.0-7.4, and 8.0 and greater). The phase I study was preformed without any pH adjustments on the water sources. Phase II and III studies consisted of raising the pH by the addition of caustic soda and maintaining pH for thirty days prior to the sampling. After an overnight period of nonuse, a series of samples were collected at specific time intervals to evaluate the effect of time on the leaching rate of lead. Data were collected on leaching of cadmium and copper and water quality parameters were monitored. In the 2nd part of the investigation, a more controlled, four-pipe loop study was conducted with the same corrosive Long Island water. Each pipe loop consisted of approximately 60 feet of copper pipe with 22 solder joints, each loop having a different type of solder: (1) tin/lead; (2) tin/antimony; (3) silver/copper, and (4) tin/copper. The four loop solder test results indicate the tin/antimony, silver/copper, and tin/copper can be used with only minor metal leaching.

  14. Low temperature solder process to join a copper tube to a silicon wafer

    NASA Astrophysics Data System (ADS)

    Versteeg, Christo; Scarpim de Souza, Marcio

    2014-06-01

    With the application for wafer level packages, which could be Complementary Metal-Oxide-Semiconductor (CMOS) based, and which requires a reduced atmosphere, a copper tube connection to a vacuum pump and the package is proposed. The method evaluated uses laser assisted brazing of a solder, to join the copper tube to a silicon wafer. The method was applied to a silicon wafer coated with a metallic interface to bond to the solder. The hermeticity of the joint was tested with a helium leak rate tester and the bonding energy thermal extent was verified with a thin layer of indium that melted wherever the substrate temperature rose above its melting temperature.

  15. In Situ Electromigration in Cu-Sn and Ni-Sn Critical Solder Length for Three-Dimensional Integrated Circuits

    NASA Astrophysics Data System (ADS)

    Huang, Y. T.; Chen, C. H.; Lee, B. H.; Chen, H. C.; Wang, C. M.; Wu, Albert T.

    2016-09-01

    An in situ electromigration study has been conducted on U-groove Cu/Sn-3.5Ag/Cu and Ni/Sn-3.5Ag/Ni sandwich structures; the results were used to simulate microsolder joints passing current density of 1 × 104 A/cm2 at 150°C. The solder gap was only 15 μm, shorter than the critical length of Sn-3.5Ag solder. Backstress was proved to exist at critical solder lengths and to influence the electromigration mechanism. Theoretical calculations of the diffusivity of Cu and Ni in Sn solder indicated that the degree to which the dominant diffusion species (Cu or Ni atoms) diffused through the solder line is retarded by the backstress effect. The morphologies of intermetallic compounds (IMCs) were observed, and the grain boundaries in Sn solder were measured using electron backscatter diffraction to determine the kinetics of intermetallic growth. The results reveal that the unique electromigration characteristics of microbump joints, including the diffusivity, morphology, and backstress, can be determined. The retardation of atomic migration improves the reliability against electromigration.

  16. Nano-soldering to single atomic layer

    DOEpatents

    Girit, Caglar O.; Zettl, Alexander K.

    2011-10-11

    A simple technique to solder submicron sized, ohmic contacts to nanostructures has been disclosed. The technique has several advantages over standard electron beam lithography methods, which are complex, costly, and can contaminate samples. To demonstrate the soldering technique graphene, a single atomic layer of carbon, has been contacted, and low- and high-field electronic transport properties have been measured.

  17. Experiments and Demonstrations with Soldering Guns.

    ERIC Educational Resources Information Center

    Henry, Dennis C.; Danielson, Sarah A.

    1993-01-01

    Discusses the essential electrical characteristics of a particular model of soldering gun. Presents four classroom demonstrations that utilize the soldering gun to test the following geometrics of wire loops as electromagnets: (1) the original tip; (2) a single circular loop; (3) a Helmholtz coil; and (4) the solenoid. (MDH)

  18. Solderability enhancement of copper through chemical etching

    SciTech Connect

    Stevenson, J.O.; Guilinger, T.R.; Hosking, F.M.; Yost, F.G.; Sorensen, N.R.

    1995-05-01

    Sandia National Laboratories has established a Cooperative Research and Development Agreement with consortium members of the National Center for Manufacturing Sciences (NCMS) to develop fundamental generic technology in the area of printed wiring board materials and surface finishes. Improved solderability of copper substrates is an important component of the Sandia-NCMS program. The authors are investigating the effects of surface roughness on the wettability and solderability behavior of several different types of copper board finishes. In this paper, the authors present roughness and solderability characterizations for a variety of chemically-etched copper substrates. Initial testing on six chemical etches demonstrate that surface roughness can be greatly enhanced through chemical etching. Noticeable improvements in solder wettability were observed to accompany increases in roughness. A number of different algorithms and measures of roughness were used to gain insight into surface morphologies that lead to improved solderability.

  19. Investigation of Low-temperature Solders for Cryogenic Wind Tunnel Models

    NASA Technical Reports Server (NTRS)

    Firth, G. C.; Watkins, V. E., Jr.

    1985-01-01

    The advent of high Reynolds number cryogenic wind tunnels has forced alteration of manufacturing and assembly techniques and eliminated usage of many materials associated with conventional wind tunnel models. One of the techniques affected is soldering. Solder alloys commonly used for wind tunnel models are susceptible to low-temperature embrittlement and phase transformation. The low-temperature performance of several solder alloys is being examined during research and development activities being conducted in support of design and fabrication of cryogenic wind tunnel models. Among the properties examined during these tests are shear strength, surface quality, joint stability, and durability when subjected to dynamic loading. Results of these tests and experiences with recent models are summarized.

  20. Microstructural characterization and mechanical property of active soldering anodized 6061 Al alloy using Sn-3.5Ag-xTi active solders

    SciTech Connect

    Wang, Wei-Lin Tsai, Yi-Chia

    2012-06-15

    Active solders Sn-3.5Ag-xTi varied from x = 0 to 6 wt.% Ti addition were prepared by vacuum arc re-melting and the resultant phase formation and variation of microstructure with titanium concentration were analyzed using X-ray diffraction, optical microscopy and scanning electron microscopy. The Sn-3.5Ag-xTi active solders are used as metallic filler to join with anodized 6061 Al alloy for potential applications of providing a higher heat conduction path. Their joints and mechanical properties were characterized and evaluated in terms of titanium content. The mechanical property of joints was measured by shear testing. The joint strength was very dependent on the titanium content. Solder with a 0.5 wt.% Ti addition can successfully wet and bond to the anodized aluminum oxide layers of Al alloy and posses a shear strength of 16.28 {+-} 0.64 MPa. The maximum bonding strength reached 22.24 {+-} 0.70 MPa at a 3 wt.% Ti addition. Interfacial reaction phase and chemical composition were identified by a transmission electron microscope with energy dispersive spectrometer. Results showed that the Ti element reacts with anodized aluminum oxide to form Al{sub 3}Ti-rich and Al{sub 3}Ti phases at the joint interfaces. - Highlights: Black-Right-Pointing-Pointer Active solder joining of anodized Al alloy needs 0.5 wt.% Ti addition for Sn-3.5Ag. Black-Right-Pointing-Pointer The maximum bonding strength occurs at 3 wt.% Ti addition. Black-Right-Pointing-Pointer The Ti reacts with anodized Al oxide to form Al{sub 3}Ti-rich and Al{sub 3}Ti at joint interface.

  1. Wetting and Soldering Behavior of Eutectic Au-Ge Alloy on Cu and Ni Substrates

    NASA Astrophysics Data System (ADS)

    Leinenbach, C.; Valenza, F.; Giuranno, D.; Elsener, H. R.; Jin, S.; Novakovic, R.

    2011-07-01

    Au-Ge-based alloys are interesting as novel high-temperature lead-free solders because of their low melting point, good thermal and electrical conductivity, and high corrosion resistance. In the present work, the wetting and soldering behavior of the eutectic Au-28Ge (at.%) alloy on Cu and Ni substrates have been investigated. Good wetting on both substrates with final contact angles of 13° to 14° was observed. In addition, solder joints with bond shear strength of 30 MPa to 35 MPa could be produced under controlled conditions. Cu substrates exhibit pronounced dissolution into the Au-Ge filler metal. On Ni substrates, the NiGe intermetallic compound was formed at the filler/substrate interface, which prevents dissolution of Ni into the solder. Using thin filler metal foils (25 μm), complete consumption of Ge in the reaction at the Ni interface was observed, leading to the formation of an almost pure Au layer in the soldering zone.

  2. An Evaluation Method for Tensile Characteristics of Cu/Sn IMCs Using Miniature Composite Solder Specimen

    NASA Astrophysics Data System (ADS)

    Ohguchi, Ken-ichi; Kurosawa, Kengo

    2016-06-01

    In design of electronic packages, finite-element method (FEM) analysis for evaluating the strength and reliability of solder joints should be conducted with consideration of the presence of Cu/Sn intermetallic compounds (IMCs) generated at the interface between solder and copper wiring. To conduct such analysis accurately, the deformation characteristics of Cu/Sn IMCs must be clarified by conducting tensile tests. This paper describes a method to evaluate tensile characteristics of Cu/Sn IMCs. The method employs a composite specimen with first outer layer of Cu, second layer of Cu/Sn IMCs, and core of Sn-3.0Ag-0.5Cu lead-free solder. The specimen is made by a method in which a copper-plated solder specimen is heat treated at 453 K to generate Cu/Sn IMCs between the solder and copper. Tensile tests were conducted using the composite specimen. After the tests, the fracture appearance and characteristics of the stress-strain relations of the specimens were investigated. Based on the results, a numerical method based on the rule of mixtures (ROM) is proposed to estimate the stress-strain relation of Cu/Sn IMCs under tensile loading.

  3. Analysis of lead free tin-silver-copper and tin-lead solder wetting reactions

    NASA Astrophysics Data System (ADS)

    Anson, Scott J.

    Lead free electronics soldering is driven by a combination of health and environmental concerns, international legislation and marketing pressure by lead free electronics manufacturing competitors. Since July 1, 2006, companies that do not comply with the European Union legislation are not able to sell circuit assemblies with lead solder in the European Union. China has developed its own regulations, based on the European Union documents with a compliance date of March 1, 2007. Extensive testing by the electronics community has determined that the Sn - Ag - Cu (SAC) family of alloys is the preferred choice for lead free Surface Mount Technology (SMT) soldering. The 96.5Sn/3.0Ag/0.5Cu alloy was used in this study. Lead free soldering requires an increase in reflow peak temperatures which further aggravates component moisture sensitivity risks and thereby decreases assembly yield. Prior research has revealed an enhanced solder spreading phenomena at lower peak temperature and shorter time above liquidus with 63Sn/37Pb solder. This current research investigated solder wetting reactions in 63Sn/37Pb and 96.5Sn/3.0Ag/0.5Cu (SAC305) using materials and manufacturing systems that are industry relevant. The objective was to advance the knowledge base of metal wetting while developing a reflow assembly process that minimized the component defect rates. The components are damaged during reflow by popcorn delamination, which is the result of moisture absorption and subsequent rapid evaporation. A classical Design Of Experiments (DOE) approach was used, with wetted area as the response variable. Outside of the DOE, substrate dissolution depth, and substrate surface new phase formation (reaction product) distance from the triple line (solder wetting front) and reaction product thickness in the solder joint (under the solder) were also analyzed. The samples were analyzed for correlation of reflow peak temperature, reflow Time Above Liquidus (TAL), wetted area, reaction product

  4. Microstructure and interfacial reactions of soldering magnesium alloy AZ31B

    SciTech Connect

    Liu Liming; Wu Zhonghui

    2010-01-15

    In this paper, economic and innoxious solder alloys with low melting temperature were designed for AZ31B. Their chemical composition and relevant parameters were investigated for a high-performance structure of bonding region. Results of microstructure observation showed that Zn-enriched phases disappeared and {alpha}-Mg existed in the joints in the form of coarse dendrites by increasing the concentration of Mg in the solder alloys. Water cooling with a high cooling rate was adopted in experiments. Experimental research showed that high cooling rate restricted the grains of {alpha}-Mg as the equiaxed dendrites, which was about 1/5 of the coarse dendrite but their number was more than 40-50 times. Both morphology with typical fracture and the analysis on X-ray diffraction fracture indicated that equiaxed dendrites significantly improved the mechanical property of the joints. Necking phenomenon occurred in the bonding region was in favor of the improvement of joint shear strength.

  5. A Novel Electronic Packaging Method to Replace High-Temperature Sn-Pb Solders

    NASA Astrophysics Data System (ADS)

    Yen, Yee-wen; Hsiao, Hsien-Ming; Shao, Pei-Sheng; Chang, Yen Wei

    2015-10-01

    The In/Ni/Cu/Ni/In multilayer was prepared by an electroplating method to replace high-temperature Sn-Pb solders that are conventionally used but are very harmful to the environment. This study shows all the sandwich couples that formed the (Cu,Ni)6(Sn,In)5 and Cu2In3Sn phases at the interface. When the solder joint was reflowed at 200°C, a planar layer (Ni,Cu)3(Sn,In)4 formed near the Ni layer. When the reflowing temperature was increased to 300°C, another planar layer Cu3(Sn,In) formed near the Cu substrate. The greater part of the intermetallic compounds in this case were the (Cu,Ni)6(Sn,In)5 and Cu3(Sn,In) phases. The Cu3(Sn,In) phase thickness was increased with increasing aging time. The thicker formation of Cu3(Sn,In) phase improved the solder-joint strength. The samples reflowed at 300°C exhibited the best mechanical strength, which was 57.6 kg/cm2 as reflowed. This In/Ni/Cu/Ni/In multilayer structure is a suitable candidate for high-temperature Pb-free solders.

  6. Laser Assisted Soldering: Effects of Hydration on Solder-Tissue Adhesion

    SciTech Connect

    Chan, E.K.; Welch, A.J.; Brown, D.T.; Kovach, I.S.

    1998-10-01

    Wound stabilization is critical in early wound healing. Other than superficial skin wounds, most tissue repair is exposed to a hydrated environment postoperatively. To simulate the stability of laser-soldered tissue in a wet environment, we studied the effects of hydration on laser soldered rat dermis and baboon articular cartilage. In this {ital in vitro} study, we used a solder composed of human serum albumin, sodium hyaluronate, and Indocyanine Green. A 2 {mu}L solder droplet was deposited on each tissue specimen and then the solder was irradiated with a scanning laser beam (808 nm and 27thinspW/cm{sup 2}). After photocoagulation, each tissue specimen was cut into two halves dividing the solder. One half was reserved as control while the other half was soaked in saline for a designated period before fixation (1 h, 1, 2, and 7 days). All tissue specimens were prepared for scanning electron microscopy (SEM). SEM examinations revealed nonuniform coagulation across the solder thickness for most of the specimens, likely a result of the temperature gradient generated by laser heating. Closer to the laser beam, the uppermost region of the solder formed a dense coagulum. The solder aggregated into small globules in the region anterior to the solder-tissue interface. All cartilage specimens soaked in saline suffered coagulum detachment from tissue surface. We noted a high concentration of the protein globules in the detached coagulum. These globules were likely responsible for solder detachment from the cartilage surface. Solder adhered better to the dermis than to cartilage. The dermal layer of the skin, composed of collagen matrix, provided a better entrapment of the solder than the smooth surface of articular cartilage. Insufficient laser heating of solder formed protein globules. Unstable solder-tissue fusion was likely a result of these globules being detached from tissue substrate when the specimen was submerged in a hydrated environment. The solder-tissue bonding

  7. Evaluation of the Bondability of the Epoxy-Enhanced Sn-58Bi Solder with ENIG and ENEPIG Surface Finishes

    NASA Astrophysics Data System (ADS)

    Myung, Woo-Ram; Kim, Yongil; Jung, Seung-Boo

    2015-11-01

    The effect of different surface finishes, electroless nickel immersion gold (ENIG) and electroless nickel electroless palladium immersion gold (ENEPIG), on the mechanical properties of Sn-58Bi bumps made with solder paste enhanced with epoxy were investigated. The microstructure and fracture surfaces were observed with scanning electron microscopy, and the compositions of the IMC and solder were measured using energy dispersive spectrometry and an electron probe micro-analyzer (EPMA). To evaluate the mechanical properties, low-speed shear tests and board-level drop tests were performed. The result of the shear tests showed that the bonding strength of the epoxy-enhanced Sn-58Bi solder bumps was higher than that of Sn-58Bi solder for all surface finishes, because of the epoxy surrounding the solder, and the fracture surfaces of epoxy-enhanced Sn-58Bi indicated ductile fracture in the solder joint. However, the result of the drop tests showed that samples with the ENIG and ENEPIG surface finishes had lower drop numbers compared to the sample without these surface finishes. The lower performance resulted from insufficient ejection of epoxy from the ENIG and ENEPIG surface finishes during reflow, which reduced the interfacial bonding area.

  8. Dissolution and Interfacial Reactions of (Cu,Ni)6Sn5 Intermetallic Compound in Molten Sn-Cu-Ni Solders

    NASA Astrophysics Data System (ADS)

    Wang, Chao-hong; Lai, Wei-han; Chen, Sinn-wen

    2014-01-01

    (Cu,Ni)6Sn5 is an important intermetallic compound (IMC) in lead-free Sn-Ag-Cu solder joints on Ni substrate. The formation, growth, and microstructural evolution of (Cu,Ni)6Sn5 are closely correlated with the concentrations of Cu and Ni in the solder. This study reports the interfacial behaviors of (Cu,Ni)6Sn5 IMC (Sn-31 at.%Cu-24 at.%Ni) with various Sn-Cu, Sn-Ni, and Sn-Cu-Ni solders at 250°C. The (Cu,Ni)6Sn5 substrate remained intact for Sn-0.7 wt.%Cu solder. When the Cu concentration was decreased to 0.3 wt.%, (Cu,Ni)6Sn5 significantly dissolved into the molten solder. Moreover, (Cu,Ni)6Sn5 dissolution and (Ni,Cu)3Sn4 formation occurred simultaneously for the Sn-0.1 wt.%Ni solder. In Sn-0.5 wt.%Cu-0.2 wt.%Ni solder, many tiny (Cu,Ni)6Sn5 particulates were formed and dispersed in the solder matrix, while in Sn-0.3 wt.%Cu-0.2 wt.%Ni a lot of (Ni,Cu)3Sn4 grains were produced. Based on the local equilibrium hypothesis, these results are further discussed based on the liquid-(Cu, Ni)6Sn5-(Ni,Cu)3Sn4 tie-triangle, and the liquid apex is suggested to be very close to Sn-0.4 wt.%Cu-0.2 wt.%Ni.

  9. Alining Solder Pads on a Solar Cell

    NASA Technical Reports Server (NTRS)

    Lazzery, A. G.

    1984-01-01

    Mechanism consisting of stylus and hand-operated lever incorporated into screening machine to precisely register front and back solder pads during solar-cell assembly. Technique may interest those assembling solar cells manually for research or prototype work.

  10. High temperature solder device for flat cables

    NASA Technical Reports Server (NTRS)

    Haehner, Carl L. (Inventor)

    1992-01-01

    A high temperature solder device for flat cables includes a microwelder, an anvil which acts as a heat sink and supports a flexible flat ribbon cable that is to be connected to a multiple pin connector. The microwelder is made from a modified commercially available resistance welding machine such as the Split Tip Electrode microwelder by Weltek, which consists of two separate electrode halves with a removable dielectric spacer in between. The microwelder is not used to weld the items together, but to provide a controlled compressive force on, and energy pulse to, a solder preform placed between a pin of the connector and a conductor of the flexible flat ribbon cable. When the microwelder is operated, an electric pulse will flow down one electrode, through the solder preform and back up the other electrode. This pulse of electrical energy will cause the solder preform to heat up and melt, joining the pin and conductor.

  11. Induction soldering of photovoltaic system components

    SciTech Connect

    Kumaria, Shashwat; de Leon, Briccio

    2015-11-17

    A method comprises positioning a pair of photovoltaic wafers in a side-by-side arrangement. An interconnect is placed on the pair of wafers such that the interconnect overlaps both wafers of the pair, solder material being provided between the interconnect and the respective wafers. A solder head is then located adjacent the interconnect, and the coil is energized to effect inductive heating of the solder material. The solder head comprises an induction coil shaped to define an eye, and a magnetic field concentrator located at least partially in the eye of the coil. The magnetic field concentrator defines a passage extending axially through the eye of the coil, and may be of a material with a high magnetic permeability.

  12. Shrink-Fit Solderable Inserts Seal Hermetically

    NASA Technical Reports Server (NTRS)

    Croucher, William C.

    1992-01-01

    Shrink-fit stainless-steel insert in aluminum equipment housing allows electrical connectors to be replaced by soldering, without degrading hermeticity of housing or connector. Welding could destroy electrostatic-sensitive components and harm housing and internal cables. Steel insert avoids problems because connector soldered directly to it rather than welded to housing. Seals between flange and housing, and between connector and flange resistant to leaks, even after mechanical overloading and thermal shocking.

  13. PWB solder wettability after simulated storage

    SciTech Connect

    Hernandez, C.L.; Hosking, F.M.

    1996-03-01

    A new solderability test method has been developed at Sandia National Laboratories that simulates the capillary flow physics of solders on circuit board surfaces. The solderability test geometry was incorporated on a circuit board prototype that was developed for a National Center for Manufacturing Sciences (NCMS) program. The work was conducted under a cooperative research and development agreement between Sandia National Laboratories, NCMS, and several PWB fabricators (AT&T, IBM, Texas Instruments, United Technologies/Hamilton Standard and Hughes Aircraft) to advance PWB interconnect technology. The test was used to investigate the effects of environmental prestressing on the solderability of printed wiring board (PWB) copper finishes. Aging was performed in a controlled chamber representing a typical indoor industrial environment. Solderability testing on as-fabricated and exposed copper samples was performed with the Sn-Pb eutectic solder at four different reflow temperatures (215, 230, 245 and 260{degrees}C). Rosin mildly activated (RMA), low solids (LS), and citric acid-based (CA) fluxes were included in the evaluation. Under baseline conditions, capillary flow was minimal at the lowest temperatures with all fluxes. Wetting increased with temperature at both baseline and prestressing conditions. Poor wetting, however, was observed at all temperatures with the LS flux. Capillary flow is effectively restored with the CA flux.

  14. Integrated environmentally compatible soldering technologies. Final report

    SciTech Connect

    Hosking, F.M.; Frear, D.R.; Iman, R.L.; Keicher, D.M.; Lopez, E.P.; Peebles, H.C.; Sorensen, N.R.; Vianco, P.T.

    1994-05-01

    Chemical fluxes are typically used during conventional electronic soldering to enhance solder wettability. Most fluxes contain very reactive, hazardous constituents that require special storage and handling. Corrosive flux residues that remain on soldered parts can severely degrade product reliability. The residues are removed with chlorofluorocarbon (CFC), hydrochlorofluorocarbon (HCFC), or other hazardous solvents that contribute to ozone depletion, release volatile organic compounds into the atmosphere, or add to the solvent waste stream. Alternative materials and processes that offer the potential for the reduction or elimination of cleaning are being developed to address these environmental issues. Timing of the effort is critical, since the targeted chemicals will soon be heavily taxed or banned. DOE`s Office of Environmental Restoration and Waste Management (DOE/EM) has supported Sandia National Laboratories` Environmentally Conscious Manufacturing Integrated Demonstration (ECMID). Part of the ECM program involves the integration of several environmentally compatible soldering technologies for assembling electronics devices. Fluxless or {open_quotes}low-residue/no clean{close_quotes} soldering technologies (conventional and ablative laser processing, controlled atmospheres, ultrasonic tinning, protective coatings, and environmentally compatible fluxes) have been demonstrated at Sandia (SNL/NM), the University of California at Berkeley, and Allied Signal Aerospace-Kansas City Division (AS-KCD). The university demonstrations were directed under the guidance of Sandia staff. Results of the FY93 Soldering ID are presented in this report.

  15. Use of organic solderability preservatives on solderability retention of copper after accelerated aging

    SciTech Connect

    Hernandez, C.L.; Sorensen, N.R.; Lucero, S.J.

    1997-02-01

    Organic solderability preservatives (OSP`s) have been used by the electronics industry for some time to maintain the solderability of circuit boards and components. Since solderability affects both manufacturing efficiency and product reliability, there is significant interest in maintaining good solder wettability. There is often a considerable time interval between the initial fabrication of a circuit board or component and its use at the assembly level. Parts are often stored under a variety of conditions, in many cases not well controlled. Solder wettability can deteriorate during storage, especially in harsh environments. This paper describes the ongoing efforts at Sandia National Laboratories to quantify solder watability on bare and aged copper surfaces. Benzotriazole and imidazole were applied to electronic grade copper to retard aging effects on solderability. The coupons were introduced into Sandia`s Facility for Atmospheric Corrosion Testing (FACT) to simulate aging in a typical indoor industrial environment. H{sub 2}S, NO{sub 2} and Cl{sub 2} mixed gas was introduced into the test cell and maintained at 35{degrees}C and 70% relative humidity for test periods of one day to two weeks. The OSP`s generally performed better than bare Cu, although solderability diminished with increasing exposure times.

  16. Refinement of the Microstructure of Sn-Ag-Bi-In Solder, by Addition of SiC Nanoparticles, to Reduce Electromigration Damage Under High Electric Current

    NASA Astrophysics Data System (ADS)

    Kim, Youngseok; Nagao, Shijo; Sugahara, Tohru; Suganuma, Katsuaki; Ueshima, Minoru; Albrecht, Hans-Juergen; Wilke, Klaus; Strogies, Joerg

    2014-12-01

    The trends of miniaturization, multi-functionality, and high performance in advanced electronic devices require higher densities of I/O gates and reduced area of soldering of interconnections. This increases the electric current density flowing through the interconnections, increasing the risk of interconnection failure caused by electromigration (EM). Accelerated directional atomic diffusion in solder materials under high current induces substantial growth of intermetallic compounds (IMCs) at the anode, and also void and crack formation at the cathode. In the work discussed in this paper, addition of SiC nanoparticles to Sn-Ag-Bi-In (SABI) lead-free solder refined its microstructure and improved its EM reliability under high current stress. Electron backscattering diffraction analysis revealed that the added SiC nanoparticles refined solder grain size after typical reflow. Under current stress, SABI joints with added nano-SiC had lifetimes almost twice as long as those without. Comparison of results from high-temperature aging revealed direct current affected evolution of the microstructure. Observations of IMC growth indicated that diffusion of Cu in the SiC composite solder may not have been reduced. During current flow, however, only narrow voids were formed in solder containing SiC, thus preventing the current crowding caused by bulky voids in the solder without SiC.

  17. Physical and metallurgical considerations of failures of soldered bars in bar attachment systems for implant overdentures: a review of the literature.

    PubMed

    Waddell, J Neil; Payne, Alan G T; Swain, Michael V

    2006-10-01

    The purpose of this literature review was to identify the etiological factors of failure of soldered bars in bar attachment systems for removable implant overdentures. A search of MEDLINE using the key words "bar attachment systems" was performed of English language peer-reviewed journals published between 1975 and 2005. Clinical studies of implant overdentures with prosthodontic maintenance complications of bar attachment systems were identified to establish the perceived etiology of failure. A further search of MEDLINE using the key words "solder joint" was also performed of the fixed prosthodontic literature to identify specific factors affecting the strength, fatigue resistance, and quality of gold solder joints used for bar attachment systems. The first search on bar attachment systems produced evidence of low failure rates of interabutment bars, but higher failure rates of bars where distal cantilever extensions were used. There were no explanations or descriptions of the nature of those failures in the clinical studies reviewed. The second search on fixed prosthodontic literature identified multiple factors that could potentially relate to the failed solder joints with bar attachments. Two potential sites of failure in bar attachments with distal cantilevers were identified, and a simple estimate of the tensile stresses at the solder joints was performed. The values found are comparable to the fatigue failure stresses reported in the searched literature.

  18. Efforts to Develop a 300°C Solder

    SciTech Connect

    Norann, Randy A

    2015-01-25

    This paper covers the efforts made to find a 300°C electrical solder solution for geothermal well monitoring and logging tools by Perma Works LLC. This paper covers: why a high temperature solder is needed, what makes for a good solder, testing flux, testing conductive epoxy and testing intermetallic bonds. Future areas of research are suggested.

  19. Thermal resistances of solder-boss/potting compound combinations

    NASA Technical Reports Server (NTRS)

    Veilleux, E. D.

    1968-01-01

    Formulas, which can be used as a design tool, are derived to calculate the thermal resistance of solder-boss/potting compound combinations, for different depths of a solder boss, in electronic cordwood modules. Since the solder boss is the heat source, its shape and position will affect the thermal resistance of the surrounding potting compound.

  20. Pb-Free Soldering Iron Temperature Controller

    NASA Astrophysics Data System (ADS)

    Hamane, Hiroto; Wajima, Kenji; Hayashi, Yoichi; Komiyama, Eiichi; Tachibana, Toshiaki; Miyazaki, Kazuyoshi

    Recently, much importance has been attached to the environmental problem. The content of two directives to better control the management of waste electronic equipment was approved. The two directives are the Waste from Electrical and Electronic Equipment (WEEE) and the Restriction of Hazardous Substances (RoHS). These set phase-out dates for the use of lead materials contained in electronic products. Increasingly, attention is focusing on the potential use of Pb-free soldering in electronics manufacturing. It should be noted that many of the current solding irons are not suitable for Pb-free technology, due to the inferior wetting ability of Pb-free alloys compared with SnPb solder pastes. This paper presents a Pb-free soldering iron temperature controller using an embedded micro-processor with a low memory capacity.

  1. Moisture and aging effects of solder wettability of copper surfaces

    SciTech Connect

    Hernandez, C.L.; Sorensen, N.R.; Lucero, S.J.

    1996-12-01

    Solderability is a critical property of electronic assembly that affects both manufacturing efficiency and product reliability. There is often a considerable time interval between initial fabrication of a circuit board or component and its use at the assembly level. Parts are often stored under a variety of conditions, usually not controlled. Solder wettability can soon deteriorate during storage, especially in extreme environments. This paper describes ongoing efforts at Sandia to quantify solder wettability on bare and aged Cu surfaces. In addition, organic solderability preservatives (OSPs) were applied to the bare Cu to retard solderability loss due to aging. The OSPs generally performed well, although wetting did decrease with exposure time.

  2. Lead (Pb)-Free Solder Applications

    SciTech Connect

    VIANCO,PAUL T.

    2000-08-15

    Legislative and marketing forces both abroad and in the US are causing the electronics industry to consider the use of Pb-free solders in place of traditional Sn-Pb alloys. Previous case studies have demonstrated the satisfactory manufacturability and reliability of several Pb-free compositions for printed circuit board applications. Those data, together with the results of fundamental studies on Pb-free solder materials, have indicated the general feasibility of their use in the broader range of present-day, electrical and electronic components.

  3. Microwave Tissue Soldering for Immediate Wound Closure

    NASA Technical Reports Server (NTRS)

    Arndt, G. Dickey; Ngo, Phong H.; Plan, Chau T.; Byerly, Diane; Dusl, John; Sognier, Marguerite A.

    2011-01-01

    A novel approach for the immediate sealing of traumatic wounds is under development. A portable microwave generator and handheld antenna are used to seal wounds, binding the edges of the wound together using a biodegradable protein sealant or solder. This method could be used for repairing wounds in emergency settings, by restoring the wound surface to its original strength within minutes. This technique could also be utilized for surgical purposes involving solid visceral organs (i.e., liver, spleen, and kidney) that currently do not respond well to ordinary surgical procedures. A miniaturized microwave generator and a handheld antenna are used to deliver microwave energy to the protein solder, which is applied to the wound. The antenna can be of several alternative designs optimized for placement either in contact with or proximity to the protein solder covering the wound. In either case, optimization of the design includes the matching of impedances to maximize the energy delivered to the protein solder and wound at a chosen frequency. For certain applications, an antenna could be designed that would emit power only when it is in direct contact with the wound. The optimum frequency or frequencies for a specific application would depend on the required depth of penetration of the microwave energy. In fact, a computational simulation for each specific application could be performed, which would then match the characteristics of the antenna with the protein solder and tissue to best effect wound closure. An additional area of interest with potential benefit that remains to be validated is whether microwave energy can effectively kill bacteria in and around the wound. Thus, this may be an efficient method for simultaneously sterilizing and closing wounds. Using microwave energy to seal wounds has a number of advantages over lasers, which are currently in experimental use in some hospitals. Laser tissue welding is unsuitable for emergency use because its large, bulky

  4. ESD Test Apparatus for Soldering Irons

    NASA Technical Reports Server (NTRS)

    Sancho, Jose; Esser, Robert

    2013-01-01

    ESDA (Electrostatic Discharge Association) ESD STM 13.1-2000 requires frequent testing of the voltage leakage from the tip of a soldering iron and the resistance from the tip of the soldering iron to the common point ground. Without this test apparatus, the process is time-consuming and requires several wires, alligator clips, or test probes, as well as additional equipment. Soldering iron tips must be tested for electrostatic discharge risks frequently, and this typically takes a lot of time in setup and testing. This device enables the operator to execute the full test in one minute or less. This innovation is a simple apparatus that plugs into a digital multimeter (DMM) and the Common Point Ground (CPG) reference. It enables the user to perform two of the electrostatic discharge tests required in ESD STM 13.1-2000. The device consists of a small black box with two prongs sticking out of one end, two inputs on the opposite end (one of the inputs is used to connect the reference CPG to the DMM), and a metal tab on one side. Inside the box are wires, several washers of various materials, and assembly hardware (nuts and screws/bolts). The device is a passive electronic component that is plugged into a DMM. The operator sets the DMM to read voltage. The operator places the heated tip of the soldering iron onto the metal tab with a small amount of solder to ensure a complete connection. The voltage is read and recorded. The operator switches the DMM to read resistance. The operator places the heated tip of the soldering iron onto the metal tab with a small amount of solder to ensure a complete connection. The resistance is recorded. If the recorded voltage and resistance are below a number stated in ESDA ESD STM 13.1-2000, the test is considered to pass. The device includes all the necessary wiring internal to its body so the operator does not need to do any independent wiring, except for grounding. It uses a stack of high-thermal-resistance washers to minimize the

  5. Effect of temperature and flux concentration on soldering of base metal.

    PubMed

    Lee, S Y; Lin, C T; Wang, M H; Tseng, H; Huang, H M; Dong, D R; Pan, L C; Shih, Y H

    2000-12-01

    The present study used the acoustic emission (AE) technique to evaluate interactions among soldering temperature, flux treatment, and the resultant ultimate tensile strength (UTS). Scanning electron microscopy (SEM) was used to examine fracture surfaces of the solder joints. Specimens were cast from removable partial denture alloy and then placed in a jig with a gap distance of 1.0 mm. A high-frequency soldering machine with an optical pyrometer was used for soldering at 1150 degrees C and 1200 degrees C, respectively. The flux concentrations were 67% and 75%. The soldered specimens were subjected to tensile test at a crosshead speed of 0.05 mm/min. During testing, acoustic emissions in the frequency range of 100--1200 kHz were collected, filtered, recorded, and processed by a sensing device. The results were analysed by ANOVA and Tukey LSD test. UTS at different temperatures showed no significant difference according to either mechanical or acoustic results. But in the 1200 degrees C group, the UTSs and AE counts showed significant differences (P<0.05) at both flux concentrations. SEM showed that the 1200C group had better dendritic crystal structure than did the 1150 degrees C group. In the 1200 degrees C group specimens with 67% flux had fewer flux inclusion bodies and dendritic crystals than did specimens with 75% flux. The 75% flux subgroup produced high-amplitude (60--70 dB) acoustic signals within the elastic deformation zone, while the 67% flux subgroup produced similar signals within the plastic deformation zone, either beyond the 0.2% yield point or before fracture. PMID:11251775

  6. Solder flow over fine line PWB surface finishes

    SciTech Connect

    Hosking, F.M.; Hernandez, C.L.

    1998-08-01

    The rapid advancement of interconnect technology has stimulated the development of alternative printed wiring board (PWB) surface finishes to enhance the solderability of standard copper and solder-coated surfaces. These new finishes are based on either metallic or organic chemistries. As part of an ongoing solderability study, Sandia National Laboratories has investigated the solder flow behavior of two azole-based organic solderability preservations, immersion Au, immersion Ag, electroless Pd, and electroless Pd/Ni on fine line copper features. The coated substrates were solder tested in the as-fabricated and environmentally-stressed conditions. Samples were processed through an inerted reflow machine. The azole-based coatings generally provided the most effective protection after aging. Thin Pd over Cu yielded the best wetting results of the metallic coatings, with complete dissolution of the Pd overcoat and wetting of the underlying Cu by the flowing solder. Limited wetting was measured on the thicker Pd and Pd over Ni finishes, which were not completely dissolved by the molten solder. The immersion Au and Ag finishes yielded the lowest wetted lengths, respectively. These general differences in solderability were directly attributed to the type of surface finish which the solder came in contact with. The effects of circuit geometry, surface finish, stressing, and solder processing conditions are discussed.

  7. Solder for oxide layer-building metals and alloys

    DOEpatents

    Kronberg, James W.

    1992-01-01

    A low temperature solder and method for soldering an oxide layer-building metal such as aluminum, titanium, tantalum or stainless steel. The comosition comprises tin and zinc; germanium as a wetting agent; preferably small amounts of copper and antimony; and a grit, such as silicon carbide. The grit abrades any oxide layer formed on the surface of the metal as the germanium penetrates beneath and loosens the oxide layer to provide good metal-to-metal contact. The germanium comprises less than aproximatley 10% by weight of the solder composition so that it provides sufficient wetting action but does not result in a melting temperature above approximately 300.degree. C. The method comprises the steps rubbing the solder against the metal surface so the grit in the solder abrades the surface while heating the surface until the solder begins to melt and the germanium penetrates the oxide layer, then brushing aside any oxide layer loosened by the solder.

  8. Solder for oxide layer-building metals and alloys

    DOEpatents

    Kronberg, J.W.

    1992-09-15

    A low temperature solder and method for soldering an oxide layer-building metal such as aluminum, titanium, tantalum or stainless steel is disclosed. The composition comprises tin and zinc; germanium as a wetting agent; preferably small amounts of copper and antimony; and a grit, such as silicon carbide. The grit abrades any oxide layer formed on the surface of the metal as the germanium penetrates beneath and loosens the oxide layer to provide good metal-to-metal contact. The germanium comprises less than approximately 10% by weight of the solder composition so that it provides sufficient wetting action but does not result in a melting temperature above approximately 300 C. The method comprises the steps rubbing the solder against the metal surface so the grit in the solder abrades the surface while heating the surface until the solder begins to melt and the germanium penetrates the oxide layer, then brushing aside any oxide layer loosened by the solder.

  9. Capillary flow of solder on chemically roughened PWB surfaces

    SciTech Connect

    Hosking, F.M.; Stevenson, J.O.; Yost, F.G.

    1996-02-01

    The Center for Solder Science and Technology at Sandia National Laboratories has developed a solderability test for evaluating fundamental solder flow over PWB (printed wiring boards) surface finishes. The work supports a cooperative research and development agreement between Sandia, the National Center for Manufacturing Sciences (NCMS), and several industrial partners. An important facet of the effort involved the ``engineering`` of copper surfaces through mechanical and chemical roughening. The roughened topography enhances solder flow, especially over very fine features. In this paper, we describe how etching with different chemical solutions can affect solder flow on a specially designed ball grid array test vehicle (BGATV). The effects of circuit geometry, solution concentration, and etching time are discussed. Surface roughness and solder flow data are presented to support the roughening premise. Noticeable improvements in solder wettability were observed on uniformly etched surfaces having relatively steep peak-to-valley slopes.

  10. Multilead, Vaporization-Cooled Soldering Heat Sink

    NASA Technical Reports Server (NTRS)

    Rice, John

    1995-01-01

    Vaporization-cooled heat sink proposed for use during soldering of multiple electrical leads of packaged electronic devices to circuit boards. Heat sink includes compliant wicks held in grooves on edges of metal fixture. Wicks saturated with water. Prevents excessive increases in temperature at entrances of leads into package.

  11. Demonstrated results of welded and soldered interconnections

    NASA Technical Reports Server (NTRS)

    Hart, R. E., Jr.

    1985-01-01

    Solar cell modules with welded and soldered interconnections were constructed using a flexible substrate material. These modules were thermally cycled between approx. 80 deg C at rates 100 cycles/day to demonstrate survivability under simulated low Earth orbit (LEO) temperature conditions. The modules, cycled in an inert atmosphere, show durability for 36,000 cycles.

  12. Creep deformation behavior of Sn-3.5Ag solder/Cu couple at small length scales

    SciTech Connect

    Kerr, M.; Chawla, N

    2004-09-06

    In order to adequately characterize the behavior of solder balls in electronic devices, the mechanical behavior of solder joints needs to be studied at small length scales. The creep behavior of single solder ball Sn-Ag/Cu solder joints was studied in shear, at 25, 60, 95, and 130 deg. C, using a microforce testing system. A change in the creep stress exponent with increasing stress was observed and explained in terms of a threshold stress for bypass of Ag{sub 3}Sn particles by dislocations. The stress exponent was also temperature dependent, exhibiting an increase in exponent of two from lower to higher temperature. The activation energy for creep was found to be temperature dependant, correlating with self-diffusion of pure Sn at high temperatures, and dislocation core diffusion of pure Sn at lower temperatures. Normalizing the creep rate for activation energy and the temperature-dependence of shear modulus allowed for unification of the creep data. Microstructure characterization, including preliminary TEM analysis, and fractographic analysis were conducted in order to fully describe the creep behavior of the material.

  13. Microwave Tissue Soldering for Immediate Wound Closure

    NASA Technical Reports Server (NTRS)

    Arndt, G. Dickey; Ngo, Phong H.; Phan, Chau T.; Byerly, Diane; Dusl, John; Sognier, Marguerite A.; Carl, James

    2011-01-01

    A novel approach for the immediate sealing of traumatic wounds is under development. A portable microwave generator and handheld antenna are used to seal wounds, binding the edges of the wound together using a biodegradable protein sealant or solder. This method could be used for repairing wounds in emergency settings by restoring the wound surface to its original strength within minutes. This technique could also be utilized for surgical purposes involving solid visceral organs (i.e., liver, spleen, and kidney) that currently do not respond well to ordinary surgical procedures. A miniaturized microwave generator and a handheld antenna are used to deliver microwave energy to the protein solder, which is applied to the wound. The antenna can be of several alternative designs optimized for placement either in contact with or in proximity to the protein solder covering the wound. In either case, optimization of the design includes the matching of impedances to maximize the energy delivered to the protein solder and wound at a chosen frequency. For certain applications, an antenna could be designed that would emit power only when it is in direct contact with the wound. The optimum frequency or frequencies for a specific application would depend on the required depth of penetration of the microwave energy. In fact, a computational simulation for each specific application could be performed, which would then match the characteristics of the antenna with the protein solder and tissue to best effect wound closure. An additional area of interest with potential benefit that remains to be validated is whether microwave energy can effectively kill bacteria in and around the wound. Thus, this may be an efficient method for simultaneously sterilizing and closing wounds.

  14. Interfacial Reaction Between Sn3.0Ag0.5Cu Solder and ENEPIG for Fine Pitch BGA by Stencil Printing

    NASA Astrophysics Data System (ADS)

    Liu, Ziyu; Cai, Jian; Wang, Qian; He, Xi; Chen, Yu

    2014-09-01

    In this work, solder balls in ball grid array packaging technology with the pitch of 300 μm were fabricated by stencil printing solder paste and then reflowed at high temperature. In order to evaluate the quality of solder ball after printing and reflowing processes, the mechanical performance of the joint between the solder balls and the pad was measured by shear test and the electrical resistance was tested after assembly of the substrate and printed circuit board. A comparative study of pad size on the interfacial reaction between solder paste and surface finish of electroless nickel-electroless palladium-immersion gold on the organic substrate was performed and then analyzed by observing the microstructure at the interface. Large discontinuous (Cu,Ni)6Sn5 was found at the interface of the solder with the pad size of 120 μm, while spalled (Pd,Ni)Sn4 and thin (Cu,Ni)6Sn5 layer appeared for a pad size of 140 μm. The IMC (intermetallic compounds) was determined by the residual Cu concentration, the Pd concentration in the solder, and the Ni2SnP barrier layer morphology at the interface, which were significantly influenced by the pad size. A reaction model during the reflow was proposed to illustrate the growth of the IMC and the relationship between the IMC and the pad size. With Pd concentration higher than the solubility of Pd in the solder, spalled (Pd,Ni)Sn4 took shape along the interface. The solubility of Pd was influenced by Ni concentration; however, the Ni diffusion from the substrate was largely dependent on the barrier layer Ni2SnP. Furthermore, the Ni diffusion also impacted the growth and morphology of (Cu,Ni)6Sn5, which was not only limited by the Cu concentration.

  15. Soldering in a Reduced Gravity Environment (SoRGE)

    NASA Technical Reports Server (NTRS)

    Easton, John W.; Struk, Peter M.

    2012-01-01

    Future long-duration human exploration missions will be challenged by constraints on mass and volume allocations available for spare parts. Addressing this challenge will be critical to the success of these missions. As a result, it is necessary to consider new approaches to spacecraft maintenance and repair that reduce the need for large replacement components. Currently, crew members on the International Space Station (ISS) recover from faults by removing and replacing, using backup systems, or living without the function of Orbital Replacement Units (ORUs). These ORUs are returned to a depot where the root cause of the failure is determined and the ORU is repaired. The crew has some limited repair capability with the Modulation/DeModulation (MDM) ORU, where circuit cards are removed and replace in faulty units. The next step to reducing the size of the items being replaced would be to implement component-level repair. This mode of repair has been implemented by the U.S. Navy in an operational environment and is now part of their standard approach for maintenance. It is appropriate to consider whether this approach can be adapted for future spaceflight operations. To this end, the Soldering in a Reduced Gravity Environment (SoRGE) experiment studied the effect of gravity on the formation of solder joints on electronic circuit boards. This document describes the SoRGE experiment, the analysis methods, and results to date. This document will also contain comments from the crew regarding their experience conducting the SoRGE experiment as well as recommendations for future improvements. Finally, this document will discuss the plans for the SoRGE samples which remain on ISS.

  16. Interconnection of thermal parameters, microstructure and mechanical properties in directionally solidified Sn–Sb lead-free solder alloys

    SciTech Connect

    Dias, Marcelino; Costa, Thiago; Rocha, Otávio; Spinelli, José E.; Cheung, Noé; Garcia, Amauri

    2015-08-15

    Considerable effort is being made to develop lead-free solders for assembling in environmental-conscious electronics, due to the inherent toxicity of Pb. The search for substitute alloys of Pb–Sn solders has increased in order to comply with different soldering purposes. The solder must not only meet the expected levels of electrical performance but may also have appropriate mechanical strength, with the absence of cracks in the solder joints. The Sn–Sb alloy system has a range of compositions that can be potentially included in the class of high temperature solders. This study aims to establish interrelations of solidification thermal parameters, microstructure and mechanical properties of Sn–Sb alloys (2 wt.%Sb and 5.5 wt.%Sb) samples, which were directionally solidified under cooling rates similar to those of reflow procedures in industrial practice. A complete high-cooling rate cellular growth is shown to be associated with the Sn–2.0 wt.%Sb alloy and a reverse dendrite-to-cell transition is observed for the Sn–5.5 wt.%Sb alloy. Strength and ductility of the Sn–2.0 wt.%Sb alloy are shown not to be affected by the cellular spacing. On the other hand, a considerable variation in these properties is associated with the cellular region of the Sn–5.5 wt.%Sb alloy casting. - Graphical abstract: Display Omitted - Highlights: • The microstructure of the Sn–2 wt.%Sb alloy is characterized by high-cooling rates cells. • Reverse dendrite > cell transition occurs for Sn–5.5 wt.%Sb alloy: cells prevail for cooling rates > 1.2 K/s. • Sn–5.5 wt.%Sb alloy: the dendritic region occurs for cooling rates < 0.9 K/s. • Sn–5.5 wt.%Sb alloy: tensile properties are improved with decreasing cellular spacing.

  17. Effect of Thick Film Firing Conditions on the Solderability and Structure of Au-Pt-Pd Conductor for Low-Temperature, Co-Fired Ceramic Substrates

    SciTech Connect

    Hernandez, C.L; Vianco, P.T.

    1999-03-16

    Low-temperature, co-fired ceramics (LTCC) are the substrate material-of-choice for a growing number of multi-chip module (MCM) applications. Unlike the longer-standing hybrid microcircuit technology based upon alumina substrates, the manufacturability and reliability of thick film solder joints on LTCC substrates have not been widely studied. An investigation was undertaken to fully characterize such solder joints. A surface mount test vehicle with Daisy chain electrical connections was designed and built with Dupont{trademark} 951 tape. The Dupont{trademark} 4569 thick film ink (Au76-Pt21 -Pd3 wt.%) was used to establish the surface conductor pattern. The conductor pattern was fired onto the LTCC substrate in a matrix of process conditions that included: (1) double versus triple prints, (2) dielectric frame versus no frame, and (3) three firing temperatures (800 C, 875 C and 950 C). Pads were examined from the test vehicles. The porosity of the thick film layers was measured using quantitative image analysis in both the transverse and short transverse directions. A significant dependence on firing temperature was recorded for porosity. Solder paste comprised of Sn63-Pb37 powder with an RMA flux was screen printed onto the circuit boards. The appropriate components, which included chip capacitors of sizes 0805 up to 2225 and 50 mil pitch, leadless ceramic chip carriers having sizes of 16 I/O to 68 I/O, were then placed on the circuit boards. The test vehicles were oven reflowed under a N{sub 2} atmosphere. The solderability of the thick film pads was also observed to be sensitive to the firing conditions. Solderability appeared to degrade by the added processing steps needed for the triple print and dielectric window depositions. However, the primary factor in solderability was the firing temperature. Solderability was poorer when the firing temperature was higher.

  18. Miniaturization of Micro-Solder Bumps and Effect of IMC on Stress Distribution

    NASA Astrophysics Data System (ADS)

    Choudhury, Soud Farhan; Ladani, Leila

    2016-07-01

    As the joints become smaller in more advanced packages and devices, intermetallic (IMCs) volume ratio increases, which significantly impacts the overall mechanical behavior of joints. The existence of only a few grains of Sn (Tin) and IMC materials results in anisotropic elastic and plastic behavior which is not detectable using conventional finite element (FE) simulation with average properties for polycrystalline material. In this study, crystal plasticity finite element (CPFE) simulation is used to model the whole joint including copper, Sn solder and Cu6Sn5 IMC material. Experimental lap-shear test results for solder joints from the literature were used to validate the models. A comparative analysis between traditional FE, CPFE and experiments was conducted. The CPFE model was able to correlate the experiments more closely compared to traditional FE analysis because of its ability to capture micro-mechanical anisotropic behavior. Further analysis was conducted to evaluate the effect of IMC thickness on stress distribution in micro-bumps using a systematic numerical experiment with IMC thickness ranging from 0% to 80%. The analysis was conducted on micro-bumps with single crystal Sn and bicrystal Sn. The overall stress distribution and shear deformation changes as the IMC thickness increases. The model with higher IMC thickness shows a stiffer shear response, and provides a higher shear yield strength.

  19. Investigation of Solder Cracking Problems on Printed Circuit Boards

    NASA Technical Reports Server (NTRS)

    Berkebile, M. J.

    1967-01-01

    A Solder Committee designated to investigate a solder cracking phenomena occurring on the SATURN electrical/electronic hardware found the cause to be induced stress in the soldered connections rather than faulty soldering techniques. The design of the printed circuit (PC) board assemblies did not allow for thermal expansion of the boards that occurred during normal operation. The difference between the thermal expansion properties of the boards and component lead materials caused stress and cracking in the soldered connections. The failure mechanism and various PC boards component mounting configurations are examined in this report. Effective rework techniques using flanged tubelets, copper tubelets, and soft copper wiring are detailed. Future design considerations to provide adequate strain relief in mounting configurations are included to ensure successful solder terminations.

  20. Optimal solder and power density for diode-laser tissue soldering (LTS)

    NASA Astrophysics Data System (ADS)

    Schwartz, Ian P.; Suh, Donald D.; Canning, Douglas A.; Snyder, Howard M., III; Zderic, Stephen A.; Kirsch, Andrew J.

    1998-07-01

    Purpose: The purpose of the study was to determine the optimal indocyanine green dye (ICG) concentration and laser power density (PD) for tissue soldering using an 808-nm diode laser. Methods: Temperature profiles in vitro and in vivo were obtained using the ICG/albumin solder. [ICG] ranged from 0.31 mg/mL to 20 mg/mL while PD ranged from 3.2 to 63.7 W/cm2. Solder color and textural changes were noted. Eighteen rats were subjected to 1.5 cm incisions (N equals 128) created on the dorsal skin followed by closure with LTS at varying PD and [ICG]. Tensile strength profiles using rat skin were taken immediately and 10 days postoperatively. Histological examination was performed at the time of sacrifice. Results: Temperature profiles of the ICG/albumin solder did not differ with varying [ICG], but showed statistically significant variability at different laser PD. Using solder color change as a subjective endpoint, average peak solder temperature ranged from 69 degrees Celsius at a PD of 8.0 W/cm2, 105 degrees Celsius to 120 degrees Celsius at PD 15.9 to 31.8 W/cm2, and greater than 200 degrees Celsius at PD greater than or equal to 47.7 W/cm2. Peak intradermal temperatures remained below 50 degrees Celsius at all PD. The broadest range of color change in the solder was observed at [ICG] of 2.5 mg/mL. Immediate tensile strength data showed a trend towards greater strength at higher [ICG]. The greatest immediate tensile strength was reached at a PD of greater than or equal to 31.8 W/cm2 for all [ICG]. At 10 days an inverse trend existed only between PD (not ICG) and tensile strength, however this was not statically significant. Histologic analysis showed poorer healing and thermal injury to tissue soldered at a PD greater than or equal to 23.9 W/cm2. Conclusions: Based on these findings, optimal laser tissue soldering occurs with an [ICG] of 2.5 mg/ml and a PD of 15.9 W/cm2.

  1. Investigation of the development of cracks in solder joints

    NASA Technical Reports Server (NTRS)

    Moore, R. L.; Vinson, R. J.

    1969-01-01

    Study consisted of an analytical approach, in which a mathematical model of existing printed circuit board component mounting techniques was analyzed, and an empirical investigation was performed to determine the extent of damage caused by temperature cycling of the printed circuit boards.

  2. Capillary flow solderability test for printed wiring boards

    SciTech Connect

    Hosking, F.M.; Yost, F.G.; Hernandez, C.L.; Sackinger, S.J.

    1994-04-01

    This report describes a new technique for evaluating capillary flow solderability on printed circuit boards. The test involves the flow of molten solder from a pad onto different-sized conductor lines. It simulates the spreading dynamics of either plated-through-hole (PTH) or surface mount technology (SMT) soldering. A standard procedure has been developed for the test. Preliminary experiments were conducted and the results demonstrate test feasibility. Test procedures and results are presented in this report.

  3. Rapid Solidification of Sn-Cu-Al Alloys for High-Reliability, Lead-Free Solder: Part II. Intermetallic Coarsening Behavior of Rapidly Solidified Solders After Multiple Reflows

    NASA Astrophysics Data System (ADS)

    Reeve, Kathlene N.; Choquette, Stephanie M.; Anderson, Iver E.; Handwerker, Carol A.

    2016-10-01

    Controlling the size, dispersion, and stability of intermetallic compounds in lead-free solder alloys is vital to creating reliable solder joints regardless of how many times the solder joints are melted and resolidified (reflowed) during circuit board assembly. In this article, the coarsening behavior of Cu x Al y and Cu6Sn5 in two Sn-Cu-Al alloys, a Sn-2.59Cu-0.43Al at. pct alloy produced via drip atomization and a Sn-5.39Cu-1.69Al at. pct alloy produced via melt spinning at a 5-m/s wheel speed, was characterized after multiple (1-5) reflow cycles via differential scanning calorimetry between the temperatures of 293 K and 523 K (20 °C and 250 °C). Little-to-no coarsening of the Cu x Al y particles was observed for either composition; however, clustering of Cu x Al y particles was observed. For Cu6Sn5 particle growth, a bimodal size distribution was observed for the drip atomized alloy, with large, faceted growth of Cu6Sn5 observed, while in the melt spun alloy, Cu6Sn5 particles displayed no significant increase in the average particle size, with irregularly shaped, nonfaceted Cu6Sn5 particles observed after reflow, which is consistent with shapes observed in the as-solidified alloys. The link between original alloy composition, reflow undercooling, and subsequent intermetallic coarsening behavior was discussed by using calculated solidification paths. The reflowed microstructures suggested that the heteroepitaxial relationship previously observed between the Cu x Al y and the Cu6Sn5 was maintained for both alloys.

  4. Solderability preservation through the use of organic inhibitors

    SciTech Connect

    Sorensen, N.R.; Hosking, F.M.

    1994-12-01

    Organic inhibitors can be used to prevent corrosion of metals and have application in the electronics industry as solderability preservatives. We have developed a model to describe the action of two inhibitors (benzotriazole and imidazole) during the environmental aging and soldering process. The inhibitors bond with the metal surface and form a barrier that prevents or retards oxidation. At soldering temperatures, the metal-organic complex breaks down leaving an oxide-free metal surface that allows excellent wetting by molten solder. The presence of the inhibitor retards the wetting rate relative to clean copper, but provides a vast improvement relative to oxidized copper.

  5. Aging, stressing and solderability of electroplated and electroless copper

    SciTech Connect

    Sorensen, N.R.; Hosking, F.M.

    1995-08-01

    Organic inhibitors can be used to prevent corrosion of metals have application in the electronics industry as solderability preservatives. We have developed a model to describe the action of two inhibitors (benzotriazole and imidazole) during the environmental aging and soldering process. The inhibitors bond with the metal surface and form a barrier that prevents or retards oxidation. At soldering temperatures, the metal-organic complex breaks down leaving an oxide-free metal surface that allows excellent wetting by the molten solder. The presence of the inhibitor retards the wetting rate relative to clean copper but provides a vast improvement relative to oxidized copper.

  6. Study of heating capacity of focused IR light soldering systems.

    PubMed

    Anguiano, C; Félix, M; Medel, A; Bravo, M; Salazar, D; Márquez, H

    2013-10-01

    An experimental study about four optical setups used for developing a Focused IR Light Soldering System (FILSS) for Surface Mount Technology (SMT) lead-free electronic devices specifically for Ball Grid Arrays (BGA) is presented. An analysis of irradiance and infrared thermography at BGA surface is presented, as well as heat transfer by radiation and conduction process from the surface of the BGA to the solder balls. The results of this work show that the heating provided by our proposed optical setups, measured at the BGA under soldering process, meets the high temperature and uniform thermal distribution requirements, which are defined by the reflow solder method for SMT devices. PMID:24104296

  7. High temperature solder alloys for underhood applications: Final report

    SciTech Connect

    Kern, J.A.; Drewien, C.A.; Yost, F.G.; Sackinger, S.; Weiser, M.W.

    1996-06-01

    In this continued study, the microstructural evolution and peel strength as a function of thermal aging were evaluated for four Sn-Ag solders deposited on double layered Ag-Pt metallization. Additionally, activation energies for intermetallic growth over the temperature range of 134 to 190{degrees}C were obtained through thickness measurements of the Ag-Sn intermetallic that formed at the solder-metallization interface. It was found that Bi-containing solders yielded higher activation energies for the intermetallic growth, leading to thicker intermetallic layers at 175 and 190{degrees}C for times of 542 and 20.5 hrs, respectively, than the solders free of Bi. Complete reaction of the solder with the metallization occurred and lower peel strengths were measured on the Bi-containing solders. In all solder systems, a Ag-Sn intermetallic thickness of greater than {approximately}7 {mu}m contributed to lower peel strength values. The Ag-Sn binary eutectic composition and the Ag-Sn-Cu ternary eutectic composition solders yielded lower activation energies for intermetallic formation, less microstructural change with time, and higher peel strengths; these solder systems were resilient to the effects of temperatures up to 175{degrees}C. Accelerated isothermal aging studies provide useful criteria for recommendation of materials systems. The Sn-Ag and Sn-Ag-Cu eutectic compositions should be considered for future service life and reliability studies based upon their performance in this study.

  8. Mechanical Properties and Microstructure Investigation of Lead Free Solder

    NASA Technical Reports Server (NTRS)

    Wang, Qing; Gail, William F.; Johnson, R. Wayne; Strickland, Mark; Blanche, Jim

    2005-01-01

    While the electronics industry appears to be focusing on Sn-Ag-Cu as the alloy of choice for lead free electronics assembly, ,the exact composition varies by geographic region, supplier and user. Add to that dissolved copper and silver from the printed circuit board traces and surface finish, and there can be significant variation in the final solder joint composition. A systematic study of the mechanical and microstructural properties of Sn-Ag-Cu alloys with Ag varying from 2wt% to 4wt% and Cu varying from 0.5wt% to lSwt%, was undertaken in this research study. Different sample preparation techniques (water quenched, oil quenched and water quenched followed by reflow) were explored and the resulting microstructure compared to that of a typical reflowed lead free chip scale package (CSP) solder joint. Tensile properties (modulus, 0.2% yield strength and the ultimate tensile strength) and creep behavior of selected alloy compositions (Sn-4Ag-1 X u , Sn-4Ag-OSCu, Sn- 2Ag-1 X u , Sn-2Ag-OSCu, Sn-3.5Ag-O.SCu) were determined for three conditions: as- cast; aged for 100 hours at 125OC; and aged for 250 hours at 125OC. There was no significant difference in Young's Modulus as a function of alloy composition. After an initial decrease in modulus after 100 hours at 125"C, there was an insignificant change with further aging. The distribution of 0.2% strain yield stress and ultimate tensile strength as a function of alloy composition was more significant and decreased with aging time and temperature. The microstructures of these alloys were examined using light and scanning electron microscopy (LM and SEM) respectively and SEM based energy dispersive x-ray spectroscopy (EDS). Fracture surface and cross-section analysis were performed on the specimens after creep testing. The creep testing results and the effect of high temperature aging on mechanical properties is presented for the oil quenched samples. In general the microstructure of oil quenched specimen exhibited a

  9. Microstructural development and mechanical properties of a near-eutectic directionally solidified Sn–Bi solder alloy

    SciTech Connect

    Silva, Bismarck Luiz; Reinhart, Guillaume; Nguyen-Thi, Henri; Mangelinck-Noël, Nathalie; Garcia, Amauri; Spinelli, José Eduardo

    2015-09-15

    Sn–Bi solders may be applied for electronic applications where low-temperature soldering is required, i.e., sensitive components, step soldering and soldering LEDs. In spite of their potential to cover such applications, the mechanical response of soldered joints of Sn–Bi alloys in some cases does not meet the strength requirements due to inappropriate resulting microstructures. Hence, careful examination and control of as-soldered microstructures become necessary with a view to pre-programming reliable final properties. The present study aims to investigate the effects of solidification thermal parameters (growth rate — V{sub L} and cooling rate — T-dot{sub L}) on the microstructure of the Sn–52 wt.%Bi solder solidified under unsteady-state conditions. Samples were obtained by upward directional solidification (DS), followed by characterization through metallography and scanning electron microscopy (SEM). The microstructures are shown to be formed by Sn-rich dendrites decorated with Bi precipitates surrounded by a complex regular eutectic mixture, with alternated Bi-rich and Sn-rich phases. Experimental correlations of primary (λ{sub 1}), secondary (λ{sub 2}), tertiary (λ{sub 3}) dendritic and eutectic spacings (λ{sub coarse} and λ{sub fine}) with cooling rate and growth rate are established. Two ranges of lamellar eutectic sizes were determined, described by two experimental equations λ = 1.1 V{sub L}{sup −1/2} and λ = 0.67 V{sub L}{sup −1/2}. The onset of tertiary branches within the dendritic array along the Sn–52 wt.%Bi alloy DS casting is shown to occur for cooling rates lower than 1.5 °C/s. - Highlights: • The Sn–52 wt.%Bi solder was shown to have two eutectic sizes. • The fishbone eutectic is preferably located adjacent to the Bi-rich lamellar phases. • The onset of tertiary dendritic branches in Sn–Bi is associated with T-dot{sub L} < 1.5 °C/s. • Higher eutectic fraction and λ{sub 3} provoked a reverse increase in

  10. Microstructure, mechanical and oxidation behavior of RE-containing lead-free solders

    NASA Astrophysics Data System (ADS)

    Dudek, Martha A.

    Pb-free solders pose new challenges associated with their incorporation and reliability during service of electronic components. Recently, a new class of alloys containing rare-earth (RE) elements has been discovered. In this study, solder alloys containing lanthanum (La), cerium (Ce) and yttrium (Y) were developed and characterized. It was found that small additions of La and Ce to Sn-Ag-Cu alloys significantly improved their ductility. This has direct implications for mechanical shock and drop reliability. Microstructure characterization of solder and solder/Cu joints containing Sn-3.9Ag-0.7Cu-XRE (X = 0, 0.1, 0.5 and 2 weight percent) was conducted using optical microscopy, scanning electron microscopy and transmission electron microscopy. It was found that RE elements refined the solder microstructure. A serial-sectioning 3D reconstruction process was used to visualize the RE-containing intermetallics. Solidification of these alloys was studied using differential scanning calorimetry. The melting point of Sn-3.9Ag-0.7Cu did not change with the incorporation of RE elements. Additionally, the effect of RE content on shear and creep of lap-shear joints was studied. It was found that additions of La and Ce up to 0.5 weight percent improved the elongation of Sn-3.9Ag-0.7Cu. Y-containing alloys did not show an improvement. Creep tests were conducted at 60, 95 and 120 degrees Celsius. RE content did not markedly alter the creep behavior. Due to RE's high affinity for oxygen, oxidation of RE-containing alloys may affect their mechanical performance. Thus, the effect of 2 weight percent Ce, La or Y on the oxidation behavior was studied at 60, 95 and 130 degrees Celsius. All alloys exhibited parabolic oxidation kinetics. La and Y-containing alloys oxidized significantly faster than the Ce-containing alloy. Sn whiskering was observed to take place during oxidation, likely due to the compressive stresses developed during oxidation. Serial-sectioning with a focused ion beam

  11. Development and Evaluation of Direct Deposition of Au/Pd(P) Bilayers over Cu Pads in Soldering Applications

    NASA Astrophysics Data System (ADS)

    Ho, C. E.; Kuo, T. T.; Gierlotka, W.; Ma, F. M.

    2012-12-01

    The thermal reliability of Sn-3Ag-0.5Cu/Au/Pd(P)/Cu solder joints was evaluated in this study. After reflow and subsequent solid-state aging (180°C), the reaction product species at the interface included Cu6Sn5 [or (Cu,Pd)6Sn5] and Cu3Sn, and their growth was strongly dependent on the Pd(P) thickness, δ Pd(P). As δ Pd(P) increased, the growth of Cu6Sn5 was significantly enhanced, while that of Cu3Sn was suppressed. Computer coupling of phase diagrams and thermochemistry (CALPHAD) analysis showed that minor incorporation of Pd (~2 at.%) into the Cu6Sn5 phase decreased the Gibbs free energy of Cu6Sn5 from -7339 J/mol to -9191 J/mol. This effect might enhance Sn diffusion in Cu6Sn5 but diminish Cu diffusion in Cu3Sn, thereby facilitating the growth of Cu6Sn5 but retarding that of Cu3Sn. High-speed ball shear (HSBS) test results showed that the mechanical properties of the solder joints were slightly enhanced by an increase in δ Pd(P). These findings suggest that direct deposition of Au/Pd(P) bilayers over the Cu pads can effectively modify the mechanical reliability of solder joints.

  12. The In-Space Soldering Investigation: Research Conducted on the International Space Station in Support of NASA's Exploration Initiative

    NASA Technical Reports Server (NTRS)

    Grugel, R. N.; Fincke, M.; Sergre, P. N.; Ogle, J. A.; Funkhouser, G.; Parris, F.; Murphy, L.; Gillies, D.; Hua, F.

    2004-01-01

    Soldering is a well established joining and repair process that is of particular importance in the electronics industry. Still. internal solder joint defects such as porosity are prevalent and compromise desired properties such as electrical/thermal conductivity and fatigue strength. Soldering equipment resides aboard the International Space Station (ISS) and will likely accompany Exploration Missions during transit to, as well as on, the moon and Mars. Unfortunately, detrimental porosity appears to be enhanced in lower gravity environments. To this end, the In-Space Soldering Investigation (ISSI) is being conducted in the Microgravity Workbench Area (MWA) aboard the ISS as "Saturday Science" with the goal of promoting our understanding of joining techniques, shape equilibrium, wetting phenomena, and microstructural development in a microgravity environment. The work presented here will focus on direct observation of melting dynamics and shape determination in comparison to ground-based samples, with implications made to processing in other low-gravity environments. Unexpected convection effects, masked on Earth, will also be shown as well as the value of the ISS as a research platform in support of Exploration Missions.

  13. The In-Space Soldering Investigation: To Date Analysis of Experiments Conducted on the International Space Station

    NASA Technical Reports Server (NTRS)

    Grugel, Richard N.; Gillies, D. C.; Hua, F.; Anilkumar, A.

    2006-01-01

    Soldering is a well established joining and repair process that is of particular importance in the electronics industry. Still, internal solder joint defects such as porosity are prevalent and compromise desired properties such as electrical/thermal conductivity and fatigue strength. Soldering equipment resides aboard the International Space Station (ISS) and will likely accompany Exploration Missions during transit to, as well as on, the moon and Mars. Unfortunately, detrimental porosity appears to be enhanced in lower gravity environments. To this end, the In-Space Soldering Investigation (ISSI) is being conducted in the Microgravity Workbench Area (MWA) aboard the ISS as "Saturday Science" with the goal of promoting our understanding of joining techniques, shape equilibrium, wetting phenomena, and microstructural development in a microgravity environment. The work presented here will focus on direct observation of melting dynamics and shape determination in comparison to ground-based samples, with implications made to processing in other low-gravity environments. Unexpected convection effects, masked on Earth, will also be shown as well as the value of the ISS as a research platform in support of Exploration Missions.

  14. (abstract) A Brief, Selective Review of Thermal Cycling Fatigue in Eutectic Tin-Lead Solder

    NASA Technical Reports Server (NTRS)

    Winslow, J. W.; Silveira, C. de

    1993-01-01

    This paper reviews selected parts of the current literature relevant to thermo-mechanical fatigue mechanisms in eutectic tin-lead solder, and suggests a general outline to account for some observed failures. The field is found to be complex. One recent experimental study finds some failure modes to be sensitive to joint geometry. Attempts to extrapolate from test environments to service environments have had only limited success. Much work remains to be done before fatigue failures in this material can be considered as under practical control.

  15. Modified soldering iron speeds cutting of synthetic materials

    NASA Technical Reports Server (NTRS)

    Schafer, W. G., Jr.

    1966-01-01

    Modified soldering iron cuts large lots of synthetic materials economically without leaving frayed or jagged edges. The soldering iron is modified by machining an axial slot in its heating element tip and mounting a cutting disk in it. An alternate design has an axially threaded bore in the tip to permit the use of various shapes of cutting blades.

  16. Low-temperature solder for laser tissue welding

    NASA Astrophysics Data System (ADS)

    Lauto, Antonio; Stewart, Robert B.; Felsen, D.; Foster, John; Poole-Warren, Laura; Poppas, Dix P.

    2003-12-01

    In this study, a two layer (TL) solid solder was developed with a fixed thickness to minimize the difference in temperature across the solder (ΔT) and to weld at low temperature. Solder strips comprising two layers (65% albumin, 35% water) were welded onto rectangular sections of dog small intestine by a diode laser (λ = 808 nm). The laser delivered a power of 170 +/- 10 mW through an optical fiber (spot size approximately 1 mm) for 100 seconds. A solder layer incorporated also a dye (carbon black, 0.25%) to absorb the laser radiation. A thermocouple and an infrared thermometer system recorded the temperatures at the tissue interface and at the external solder surface, during welding. The repaired tissue was tested for tensile strength by a calibrated tensiometer. The TL strips were able to minimize ΔT (12 +/- 4°C) and control the temperature at tissue-interface. The strips fused on tissue at 55<=T<=62°C had higher tensile strength than the strips soldered at 51<=T<55°C (19.1 +/- 6.6 versus 13.1 +/- 6.4 gmf). The solid solder could efficiently weld at 60°C as it became insoluble and formed stable bonds with tissue. Fluid albumin solders, by contrast, requires temperatures >=70°C for tissue repair, which cause more irreversible thermal damage.

  17. Laser-activated protein solder for peripheral nerve repair

    NASA Astrophysics Data System (ADS)

    Trickett, Rodney I.; Lauto, Antonio; Dawes, Judith M.; Owen, Earl R.

    1995-05-01

    A 100 micrometers core optical fiber-coupled 75 mW diode laser operating at a wavelength of 800 nm has been used in conjunction with a protein solder to stripe weld severed rat tibial nerves, reducing the long operating time required for microsurgical nerve repair. Welding is produced by selective laser denaturation of the albumin based solder which contains the dye indocyanine green. Operating time for laser soldering was 10 +/- 5 min. (n equals 20) compared to 23 +/- 9 min. (n equals 10) for microsuturing. The laser solder technique resulted in patent welds with a tensile strength of 15 +/- 5 g, while microsutured nerves had a tensile strength of 40 +/- 10 g. Histopathology of the laser soldered nerves, conducted immediately after surgery, displayed solder adhesion to the outer membrane with minimal damage to the inner axons of the nerves. An in vivo study is under way comparing laser solder repaired tibial nerves to conventional microsuture repair. At the time of submission 15 laser soldered nerves and 7 sutured nerves were characterized at 3 months and showed successful regeneration with compound muscle action potentials of 27 +/- 8 mV and 29 +/- 8 mW respectively. A faster, less damaging and long lasting laser based anastomotic technique is presented.

  18. Bonding Low-density Nanoporous Metal Foams Using Sputtered Solder

    SciTech Connect

    Bono, M; Cervantes, O; Akaba, C; Hamza, A; Foreman, R; Teslich, N

    2007-08-21

    could benefit from the bonding technology developed in this study, such as small-scale lightweight structural members, high-strength thermal insulating layers for electronics, and micro-scale mechanical dampers, to name but a few. Each of these applications requires one or more small metal foam components precisely bonded to a substrate. Several methods for bonding metal foam components have been developed by previous researchers. Macroscopic metal foam parts have been successfully bonded by laser welding to create T-sections and butt joints. Ultrasonic welding has been used to join aluminum sheet metal to aluminum foam for structural applications. These methods work well for bonding large foam components, but reducing these methods to a smaller length scale would be challenging. One method that has shown great potential for bonding layers of metal foams to substrates is a brazing process that uses a sputter-deposited interface material. Shirzadi et al.[9] have demonstrated bonds between stainless steel foam and a stainless steel substrate using a layer of copper-titanium filler metal that is sputtered onto the interface surfaces. The foam pieces that they bonded were approximately 10 mm in diameter and 10 mm thick with a cell size of approximately 200 {micro}m. After depositing the filler material, pressing the materials together, and heating them with an induction heater, bonds were achieved without causing significant damage to the foam. The current study also uses a sputter-deposited interface material to bond foam to a substrate. However, in contrast to previous work, the current study examines bonding microscale pieces of fragile nanoporous metal foam. In this study, a method is developed to bond a thin sheet of fragile, low-density nanoporous copper foam to an aluminum foil substrate of thickness 40 {micro}m. By sputter depositing an indium-silver alloy onto the foam and the substrate, a solder joint with a thickness of less than 2 {micro}m was achieved.

  19. Cost comparison modeling between current solder sphere attachment technology and solder jetting technology

    SciTech Connect

    Davidson, R.N.

    1996-10-01

    By predicting the total life-cycle cost of owning and operating production equipment, it becomes possible for processors to make accurate and intelligent decisions regarding major capitol equipment investments as well as determining the most cost effective manufacturing processes and environments. Cost of Ownership (COO) is a decision making technique based on inputting the total costs of acquiring, operating and maintaining production equipment. All quantitative economic and production data can be modeled and processed using COO software programs such as the Cost of Ownership Luminator program TWO COOL{trademark}. This report investigated the Cost of Ownership differences between the current state-of-the-art solder ball attachment process and a prototype solder jetting process developed by Sandia National Laboratories. The prototype jetting process is a novel and unique approach to address the anticipated high rate ball grid array (BGA) production requirements currently forecasted for the next decade. The jetting process, which is both economically and environmentally attractive eliminates the solder sphere fabrication step, the solder flux application step as well as the furnace reflow and post cleaning operations.

  20. Dry soldering with hot filament produced atomic hydrogen

    DOEpatents

    Panitz, J.K.G.; Jellison, J.L.; Staley, D.J.

    1995-04-25

    A system is disclosed for chemically transforming metal surface oxides to metal that is especially, but not exclusively, suitable for preparing metal surfaces for dry soldering and solder reflow processes. The system employs one or more hot, refractory metal filaments, grids or surfaces to thermally dissociate molecular species in a low pressure of working gas such as a hydrogen-containing gas to produce reactive species in a reactive plasma that can chemically reduce metal oxides and form volatile compounds that are removed in the working gas flow. Dry soldering and solder reflow processes are especially applicable to the manufacture of printed circuit boards, semiconductor chip lead attachment and packaging multichip modules. The system can be retrofitted onto existing metal treatment ovens, furnaces, welding systems and wave soldering system designs. 1 fig.

  1. Dry soldering with hot filament produced atomic hydrogen

    DOEpatents

    Panitz, Janda K. G.; Jellison, James L.; Staley, David J.

    1995-01-01

    A system for chemically transforming metal surface oxides to metal that is especially, but not exclusively, suitable for preparing metal surfaces for dry soldering and solder reflow processes. The system employs one or more hot, refractory metal filaments, grids or surfaces to thermally dissociate molecular species in a low pressure of working gas such as a hydrogen-containing gas to produce reactive species in a reactive plasma that can chemically reduce metal oxides and form volatile compounds that are removed in the working gas flow. Dry soldering and solder reflow processes are especially applicable to the manufacture of printed circuit boards, semiconductor chip lead attachment and packaging multichip modules. The system can be retrofitted onto existing metal treatment ovens, furnaces, welding systems and wave soldering system designs.

  2. A Study of Solder Alloy Ductility for Cryogenic Applications

    NASA Technical Reports Server (NTRS)

    Lupinacci, A.; Shapiro, A. A.; Suh, J-O.; Minor, A. M.

    2013-01-01

    For aerospace applications it is important to understand the mechanical performance of components at the extreme temperature conditions seen in service. For solder alloys used in microelectronics, cryogenic temperatures can prove problematic. At low temperatures Sn-based solders undergo a ductile to brittle transition that leads to brittle cracks, which can result in catastrophic failure of electronic components, assemblies and spacecraft payloads. As industrial processes begin to move away from Pb-Sn solder, it is even more critical to characterize the behavior of alternative Sn-based solders. Here we report on initial investigations using a modified Charpy test apparatus to characterize the ductile to brittle transformation temperature of nine different solder systems.

  3. In Situ TEM Observations of Cu6Sn5 Polymorphic Transformations in Reaction Layers Between Sn-0.7Cu Solders and Cu Substrates

    NASA Astrophysics Data System (ADS)

    Nogita, K.; Mohd Salleh, M. A. A.; Tanaka, E.; Zeng, G.; McDonald, S. D.; Matsumura, S.

    2016-07-01

    Direct evidence of the relationship between the polymorphic phase transformation from monoclinic Cu6Sn5 to hexagonal Cu6Sn5 and stress accumulation/release in Cu6Sn5, formed at the interface between Sn-0.7Cu lead-free solder and their Cu substrates, has been obtained. To explore this challenging phenomenon, we developed an in situ heating/isothermal observation technique in ultrahigh-voltage transmission electron microscopy that enables the observation of thick samples (around 0.5 μm) for solder joints, including Cu/Cu3Sn/Cu6Sn5/Sn-0.7Cu solder interfaces prepared by a focused ion beam milling technique. The results show evidence of stress creation and release events by imaging bend contours that may arise due to the polymorphic transformations of the Cu6Sn5 phase and the associated volumetric change.

  4. Microstructural effects on constitutive and fatigue fracture behavior of TinSilverCopper solder

    NASA Astrophysics Data System (ADS)

    Tucker, Jonathon P.

    As microelectronic package construction becomes more diverse and complex, the need for accurate, geometry-independent material constitutive and failure models increases. Evaluations of packages based on accelerated environmental tests (such as accelerated thermal cycling or power cycling) only provide package-dependent reliability information. In addition, extrapolations of such test data to life predictions under field conditions are often empirical. Besides geometry, accelerated environmental test data must account for microstructural factors such as alloy composition or isothermal aging condition, resulting in expensive experimental variation. In this work, displacement-controlled, creep, and fatigue lap shear tests are conducted on specially designed SnAgCu test specimens with microstructures representative to those found in commercial microelectronic packages. The data are used to develop constitutive and fatigue fracture material models capable of describing deformation and fracture behavior for the relevant temperature and strain rate ranges. Furthermore, insight is provided into the microstructural variation of solder joints and the subsequent effect on material behavior. These models are appropriate for application to packages of any geometrical construction. The first focus of the thesis is on Pb-mixed SnAgCu solder alloys. During the transition from Pb-containing solders to Pb-free solders, joints composed of a mixture of SnPb and SnAgCu often result from either mixed assemblies or rework. Three alloys of 1, 5 and 20 weight percent Pb were selected so as to represent reasonable ranges of Pb contamination expected from different 63Sn37Pb components mixed with Sn3.0Ag0.5Cu. Displacement-controlled (constant strain rate) and creep tests were performed at temperatures of 25°C, 75°C, and 125°C using a double lap shear test setup that ensures a nearly homogeneous state of plastic strain at the joint interface. Rate-dependent constitutive models for Pb

  5. Microstructural effects on constitutive and fatigue fracture behavior of TinSilverCopper solder

    NASA Astrophysics Data System (ADS)

    Tucker, Jonathon P.

    As microelectronic package construction becomes more diverse and complex, the need for accurate, geometry-independent material constitutive and failure models increases. Evaluations of packages based on accelerated environmental tests (such as accelerated thermal cycling or power cycling) only provide package-dependent reliability information. In addition, extrapolations of such test data to life predictions under field conditions are often empirical. Besides geometry, accelerated environmental test data must account for microstructural factors such as alloy composition or isothermal aging condition, resulting in expensive experimental variation. In this work, displacement-controlled, creep, and fatigue lap shear tests are conducted on specially designed SnAgCu test specimens with microstructures representative to those found in commercial microelectronic packages. The data are used to develop constitutive and fatigue fracture material models capable of describing deformation and fracture behavior for the relevant temperature and strain rate ranges. Furthermore, insight is provided into the microstructural variation of solder joints and the subsequent effect on material behavior. These models are appropriate for application to packages of any geometrical construction. The first focus of the thesis is on Pb-mixed SnAgCu solder alloys. During the transition from Pb-containing solders to Pb-free solders, joints composed of a mixture of SnPb and SnAgCu often result from either mixed assemblies or rework. Three alloys of 1, 5 and 20 weight percent Pb were selected so as to represent reasonable ranges of Pb contamination expected from different 63Sn37Pb components mixed with Sn3.0Ag0.5Cu. Displacement-controlled (constant strain rate) and creep tests were performed at temperatures of 25°C, 75°C, and 125°C using a double lap shear test setup that ensures a nearly homogeneous state of plastic strain at the joint interface. Rate-dependent constitutive models for Pb

  6. Printability Optimization For Fine Pitch Solder Bonding

    SciTech Connect

    Kwon, Sang-Hyun; Lee, Chang-Woo; Yoo, Sehoon

    2011-01-17

    Effect of metal mask and pad design on solder printability was evaluated by DOE in this study. The process parameters were stencil thickness, squeegee angle, squeegee speed, mask separating speed, and pad angle of PCB. The main process parameters for printability were stencil thickness and squeegee angle. The response surface showed that maximum printability of 1005 chip was achieved at the stencil thickness of 0.12 mm while the maximum printability of 0603 and 0402 chip was obtained at the stencil thickness of 0.05 mm. The bonding strength of the MLCC chips was also directly related with the printability.

  7. Optimization of the Ni(P) Thickness for an Ultrathin Ni(P)-Based Surface Finish in Soldering Applications

    NASA Astrophysics Data System (ADS)

    Ho, C. E.; Wang, S. J.; Fan, C. W.; Wu, W. H.

    2014-01-01

    The effects of the Ni(P) thickness δ Ni(P) on the interfacial reaction between an Sn-3Ag-0.5Cu solder and an Au/Pd(P)/Ni(P)/Cu pad (thickness: 0.05/0.05/0.1-0.3/20 μm) and the resulting mechanical properties were investigated using scanning electron microscopy equipped with an electron backscatter diffraction system, a focused ion beam system, electron probe microanalysis, and high-speed ball shear (HSBS) testing. Regardless of δ Ni(P), all of the Au/Pd(P)/Ni(P) surface finishes examined were completely exhausted in one reflow, exposing the Cu pad underneath the solder. Cu6Sn5 dissolved with various Ni contents, termed (Cu,Ni)6Sn5, was the dominant intermetallic compound (IMC) species at the solder/Cu interface. Additionally, Ni2SnP and Ni3P IMCs might form with the (Cu,Ni)6Sn5 in the thick Ni(P) case, i.e., δ Ni(P) = 0.3 μm, and the two IMCs (Ni2SnP and Ni3P) were gradually eliminated from the interface after multiple reflows. A mass balance analysis indicated that the growth of the Ni-containing IMCs, rather than the dissolution of the metallization pad, played a key role in the Ni(P) exhaustion. The HSBS test results indicated that the mechanical strength of the solder joints was also δ Ni(P) dependent. The combined results of the interfacial reaction and the mechanical evaluation provided the optimal δ Ni(P) value for soldering applications.

  8. Polarity effect of electromigration on kinetics of intermetallic compound formation in Pb-free solder V-groove samples

    NASA Astrophysics Data System (ADS)

    Gan, H.; Tu, K. N.

    2005-03-01

    Intermetallic compound (IMC) formation is critical for the reliability of microelectronic interconnections, especially for flip chip solder joints. In this article, we investigate the polarity effect of electromigration on kinetics of IMC formation at the anode and the cathode in solder V-groove samples. We use V-groove solder line samples, with width of 100 μm and length of 500-700 μm, to study interfacial IMC growth between Cu electrodes and Sn-3.8Ag-0.7Cu (in wt %) solder under different current density and temperature settings. The current densities are in the range of 103 to 104A/cm2 and the temperature settings are 120, 150, and 180 °C. While the same types of IMCs, Cu6Sn5 and Cu3Sn, form at the solder/Cu interfaces independent of the passage of electric current, the growth of the IMC layer has been enhanced by electric current at the anode and inhibited at the cathode, in comparison with the no-current case. We present a kinetic model, based on the Cu mass transport in the sample, to explain the growth rate of IMC at the anode and cathode. The growth of IMC at the anode follows a parabolic growth rule, and we propose that the back stress induced in the IMC plays a significant role. The model is in good agreement with our experimental data. We then discuss the influence of both chemical force and electrical force, and their combined effect on the IMC growth with electric current.

  9. Electromigration of composite Sn-Ag-Cu solder bumps

    NASA Astrophysics Data System (ADS)

    Sharma, Ashutosh; Xu, Di Erick; Chow, Jasper; Mayer, Michael; Sohn, Heung-Rak; Jung, Jae Pil

    2015-11-01

    This study investigates the electromigration (EM) behavior of lead free Sn-Ag-Cu (SAC) solder alloys that were reinforced with different types of nanoparticles [Copper-coated carbon nanotubes (Cu/CNT), La2O3, Graphene, SiC, and ZrO2]. The composite solders were bumped on a Cu substrate at 220°C, and the resistance of the bumped solders was measured using a four wire setup. Current aging was carried out for 4 hours at a temperature of 160°C, and an increase in resistance was noted during this time. Of all the composite solders that were studied, La2O3 and SiC reinforced SAC solders exhibited the smallest resistances after current aging. However, the rate of change in the resistance at room temperature was lower for the SiC-reinforced SAC solder. The SAC and Graphene reinforced SAC solder bumps completely failed within 15 - 20 min of these tests. The SiC nanoparticles were reported to possibly entrap the SAC atoms better than other nanoparticles with a lower rate of EM. [Figure not available: see fulltext.

  10. Albumin-genipin solder for laser tissue welding

    NASA Astrophysics Data System (ADS)

    Lauto, Antonio; Foster, John; Avolio, Albert; Poole-Warren, Laura

    2004-07-01

    Background. Laser tissue soldering (LTS) is an alternative technique to suturing for tissue repair. One of the major drawbacks of LTS is the weak tensile strength of the solder welds when compared to sutures. In this study, the possibility was investigated for a low cytotoxic crosslinker, acting on amino groups, to enhance the bond strength of albumin solders. Materials and Methods. Solder strips were welded onto rectangular sections of sheep small intestine by a diode laser. The laser delivered in continuous mode mode a power of 170 +/- 10 mW at λ=808 nm, through a multimode optical fiber (core size = 200 μm) to achieve a dose of 10.8 +/- 0.5 J/mg. The solder thickness and surface area were kept constant throughout the experiment (thickness = 0.15 +/- 1 mm, area = 12 +/- 1.2 mm2). The solder incorporated 62% bovine serum albumin, 0.38% genipin, 0.25% indocyanin green dye (IG) and water. Tissue welding was also performed with a similar solder, which did not incorporate genipin, as a control group. The repaired tissue was tested for tensile strength by a calibrated tensiometer. Results. The tensile strength of the "genipin" solder was twice as high as the strength of the BSA solder (0.21 +/- 0.04 N and 0.11 +/- 0.04 N respectively; p~10-15 unpaired t-test, N=30). Discussion. Addition of a chemical crosslinking agent, such as genipin, significantly increased the tensile strength of adhesive-tissue bonds. A proposed mechanism for this enhanced bond strength is the synergistic action of mechanical adhesion with chemical crosslinking by genipin.

  11. Development of the bus joint for the ITER Central Solenoid

    SciTech Connect

    Martovetsky, Nicolai N; Irick, David Kim; Kenney, Steven J

    2013-01-01

    The terminations of the Central Solenoid (CS) modules are connected to the bus extensions by joints located outside the CS in the gap between the CS and Torodial Field (TF) assemblies. These joints have very strict space limitations. Low resistance is a common requirement for all ITER joints. In addition, the CS bus joints will experience and must be designed to withstand significant variation in the magnetic field of several tenths of a Tesla per second during initiation of plasma. The joint resistance is specified to be less than 4 nOhm. The joints also have to be soldered in the field and designed with the possibility to be installed and dismantled in order to allow cold testing in the cold test facility. We have developed coaxial joints that meet these requirements and have demonstrated the feasibility to fabricate and assemble them in the vertical configuration. We introduced a coupling cylinder with superconducting strands soldered to the surface of the cable that can be installed in the ITER assembly hall and at the Cold Test Facility. This cylinder serves as a transition area between the CS module and the bus extension. We made two racetrack samples and tested four bus joints in our Joint Test Apparatus. Resistance of the bus joints was measured by a decay method and by a microvoltmeter; the value of the current was measured by the Hall probes. This measurement method was verified in the previous tests. The resistance of the joints varied insignificantly from 1.5 to 2 nOhm. One of the challenges associated with a soldered joint is the inability to use corrosive chemicals that are difficult to clean. This paper describes our development work on cable preparation, chrome removal, compaction, soldering, and final assembly and presents the test results.

  12. Wettability analysis of tin-based, lead free solders

    SciTech Connect

    Vianco, P T; Hosking, F M; Rejent, J A

    1992-01-01

    The overall program is comprised of two efforts. The first effort studies the wettability of tin-based, lead free solders on two commonly used substrate materials: copper and gold-nickel plated Kovar{trademark}. The evaluation is being conducted by the meniscometer/wetting balance technique which uses the contact angle as the primary metric to quantify wettability. Information about the rate of wetting is also obtainable with this test. The second part of the program is comprised of an assessment of the solderability of actual circuit board assemblies (surface mount and through-hole). This report will describe data from the wettability analysis of lead free solders on copper.

  13. The intermetallic formation and growth kinetics at the interface of near eutectic tin-silver-copper solder alloys and gold/nickel metallization

    NASA Astrophysics Data System (ADS)

    Gao, Mao

    The formation of a one micron thick layer of an intermetallic compound between a solder alloy and a metallic substrate generally constitutes a good solder joint in an electronic device. However, if the compound grows too thick, and/or if multiple intermetallic compounds form, poor solder joint reliability may result. Thus significant interest has been focused on intermetallic compound phase selection and growth kinetics at such solder/metal interfaces. The present study focuses on one such specific problem, the formation and growth of intermetallic compounds at near eutectic Sn-Ag-Cu solder alloy/Ni interfaces. Sn-3.0Ag-0.5Cu solder was reflowed on Au/Ni substrates, resulting in the initial formation and growth of (CuNi)6Sn 5 at Sn-3.0Ag-0.5Cu /Ni interfaces. (NiCu)3Sn4 formed between the (CuNi)6Sn5 and the Ni substrate when the concentration of Cu in the liquid SnAgCu solder decreased to a critical value which depended upon temperature: 0.37, 0.31 and 0.3(wt.%) at reflow temperatures of 260°C, 245°C and 230°C respectively. The growth rate of (CuNi)6Sn5 was found to be consistent with extrapolations of a diffusion limited growth model formulated for lower temperature, solid state diffusion couples. The long range diffusion of Cu did not limit growth rates. The spalling of (CuNiAu)6Sn5 from (NiCu)3 Sn4 surfaces during reflow was also examined. When the Cu concentration in the solder decreased to approximately 0.28wt.%, the (Cu,Ni,Au) 6Sn5 was observed to spall. Compressive stress in (CuNiAu) 6Sn5 and weak adhesion between (CuNiAu)6Sn 5 and (NiCu)3Sn4 was found to cause this effect.

  14. High temperature solder alloys for underhood applications. Progress report

    SciTech Connect

    Drewien, C.A.; Yost, F.G.; Sackinger, S.; Kern, J.; Weiser, M.W.

    1995-02-01

    Under a cooperative research and development agreement with General Motors Corporation, lead-free solder systems including the flux, metallization, and solder are being developed for high temperature, underhood applications. Six tin-rich solders, five silver-rich metallizations, and four fluxes were screened using an experimental matrix whereby every combination was used to make sessile drops via hot plate or Heller oven processing. The contact angle, sessile drop appearance, and in some instances the microstructure was evaluated to determine combinations that would yield contact angles of less than 30{degrees}, well-formed sessile drops, and fine, uniform microstructures. Four solders, one metallization, and one flux were selected and will be used for further aging and mechanical property studies.

  15. Substrate solder barriers for semiconductor epilayer growth

    DOEpatents

    Drummond, T.J.; Ginley, D.S.; Zipperian, T.E.

    1987-10-23

    During the growth of compound semiconductors by epitaxial processes, substrates are typically mounted to a support. In molecular beam epitaxy, mounting is done using indium as a solder. This method has two drawbacks: the indium reacts with the substrate, and it is difficult to uniformly wet the back of a large diameter substrate. Both of these problems have been successfully overcome by sputter coating the back of the substrate with a thin layer of tungsten carbide or tungsten carbide and gold. In addition to being compatible with the growth of high quality semiconductor epilayers this coating is also inert in all standard substate cleaning etchants used for compound semiconductors, and provides uniform distribution of energy in radiant heating. 1 tab.

  16. Substrate solder barriers for semiconductor epilayer growth

    DOEpatents

    Drummond, Timothy J.; Ginley, David S.; Zipperian, Thomas E.

    1989-01-01

    During the growth of compound semiconductors by epitaxial processes, substrates are typically mounted to a support. In modular beam epitaxy, mounting is done using indium as a solder. This method has two drawbacks: the indium reacts with the substrate, and it is difficult to uniformly wet the back of a large diameter substrate. Both of these problems have been successfully overcome by sputter coating the back of the substrate with a thin layer of tungsten carbide or tungsten carbide and gold. In addition to being compatible with the growth of high quality semiconductor epilayers this coating is also inert in all standard substrate cleaning etchants used for compound semiconductors, and provides uniform distribution of energy in radiant heating.

  17. Substrate solder barriers for semiconductor epilayer growth

    DOEpatents

    Drummond, T.J.; Ginley, D.S.; Zipperian, T.E.

    1989-05-09

    During the growth of compound semiconductors by epitaxial processes, substrates are typically mounted to a support. In modular beam epitaxy, mounting is done using indium as a solder. This method has two drawbacks: the indium reacts with the substrate, and it is difficult to uniformly wet the back of a large diameter substrate. Both of these problems have been successfully overcome by sputter coating the back of the substrate with a thin layer of tungsten carbide or tungsten carbide and gold. In addition to being compatible with the growth of high quality semiconductor epilayers this coating is also inert in all standard substrate cleaning etchants used for compound semiconductors, and provides uniform distribution of energy in radiant heating.

  18. Solderability perservative coatings: Electroless tin vs. organic azoles

    SciTech Connect

    Artaki, I.; Ray, U.; Jackson, A.M.; Gordon, H.M.; Vianco, P.T.

    1993-07-01

    This paper compares the solderability performance and corrosions ion protection effectiveness of electroless tin coatings versus organic azole films after exposure to a series of humidity and thermal (lead-free solders) cycling conditions. The solderability of immersion tin is directly related to the tin oxide growth on the surface and is not affected by the formation of Sn-Cu intermetallic phases as long as the intermetallic phase is protected by a Sn layer. For a nominal tin thickness of 60{mu}inches, the typical thermal excursions associated with assembly are not sufficient to cause the intermetallic phase to consume the entire tin layer. Exposure to humidity at moderate to elevated temperatures promotes heavy tin oxide formation which leads to solderability loss. In contrast, thin azole films are more robust to humidity exposure; however upon heating in the presence of oxygen, they decompose and lead to severe solderability degradation. Evaluations of lead-free solder pastes for surface mount assembly applications indicate that immersion tin significantly improves the spreading of Sn:Ag and Sn:Bi alloys as compared to azole surface finishes.

  19. Microsurgical anastomosis of sperm duct by laser tissue soldering

    NASA Astrophysics Data System (ADS)

    Wehner, Martin M.; Teutu-Kengne, Alain-Fleury; Brkovic, Drasko; Henning, Thomas; Klee, Doris; Poprawe, Reinhart; Jakse, Gerhard

    2005-04-01

    Connection of small vessels is usually done by suturing which is very cumbersome. Laser tissue soldering can circumvent that obstacle if a handy procedure can be defined. Our principle approach consists of a bioresorbable hollow stent with an expected degradation time of 3 weeks in combination with laser soldering. The stent is to be fed into the vessel to stabilize both ends and should allow percolation immediately after joining. The stents are made of Poly(D,L-lactid-co-glycolid) and solder is prepared from bovine serum albumin (BSA) doped with Indocyanine green (ICG) as chromophore to increase the absorption of laser light. After insertion, solder is applied onto the outer surface of the vessel and coagulated by laser radiation. The wavelength of 810 nm of a diode laser fits favorably to absorption properties of tissue and solder such that heating up of tissue is limited to prevent from necrosis and wound healing complications. In our study the preparation of stents, the consistency and doping of solder, a beam delivery instrument and the irradiation conditions are worked out. In-vitro tests are carried out on sperm ducts of Sprague-Dowlae (SD) rats. Different irradiation conditions are investigated and a micro-optical system consisting of a lens and a reflecting prism to ensure simultaneous irradiation of front and back side of the vessels tested. Under these conditions, the short-term rupture strength of laser anastomosis revealed as high as those achieved by suturing.

  20. Lead-free solder technology transfer from ASE Americas

    SciTech Connect

    FTHENAKIS,V.

    1999-10-19

    To safeguard the environmental friendliness of photovoltaics, the PV industry follows a proactive, long-term environmental strategy involving a life-of-cycle approach to prevent environmental damage by its processes and products from cradle to grave. Part of this strategy is to examine substituting lead-based solder on PV modules with other solder alloys. Lead is a toxic metal that, if ingested, can damage the brain, nervous system, liver and kidneys. Lead from solder in electronic products has been found to leach out from municipal waste landfills and municipal incinerator ash was found to be high in lead also because of disposed consumer electronics and batteries. Consequently, there is a movement in Europe and Japan to ban lead altogether from use in electronic products and to restrict the movement across geographical boundaries of waste containing lead. Photovoltaic modules may contain small amounts of regulated materials, which vary from one technology to another. Environmental regulations impact the cost and complexity of dealing with end-of-life PV modules. If they were classified as hazardous according to Federal or State criteria, then special requirements for material handling, disposal, record-keeping and reporting would escalate the cost of decommissioning the modules. Fthenakis showed that several of today's x-Si modules failed the US-EPA Toxicity Characteristic Leaching Procedure (TCLP) for potential leaching of Pb in landfills and also California's standard on Total Threshold Limit Concentration (TTLC) for Pb. Consequently, such modules may be classified as hazardous waste. He highlighted potential legislation in Europe and Japan which could ban or restrict the use of lead and the efforts of the printed-circuit industries in developing Pb-free solder technologies in response to such expected legislation. Japanese firms already have introduced electronic products with Pb-free solder, and one PV manufacturer in the US, ASE Americas has used a Pb

  1. Effects of metallic nanoparticle doped flux on the interfacial intermetallic compounds between lead-free solder ball and copper substrate

    SciTech Connect

    Sujan, G.K. Haseeb, A.S.M.A. Afifi, A.B.M.

    2014-11-15

    Lead free solders currently in use are prone to develop thick interfacial intermetallic compound layers with rough morphology which are detrimental to the long term solder joint reliability. A novel method has been developed to control the morphology and growth of intermetallic compound layers between lead-free Sn–3.0Ag–0.5Cu solder ball and copper substrate by doping a water soluble flux with metallic nanoparticles. Four types of metallic nanoparticles (nickel, cobalt, molybdenum and titanium) were used to investigate their effects on the wetting behavior and interfacial microstructural evaluations after reflow. Nanoparticles were dispersed manually with a water soluble flux and the resulting nanoparticle doped flux was placed on copper substrate. Lead-free Sn–3.0Ag–0.5Cu solder balls of diameter 0.45 mm were placed on top of the flux and were reflowed at a peak temperature of 240 °C for 45 s. Angle of contact, wetting area and interfacial microstructure were studied by optical microscopy, field emission scanning electron microscopy and energy-dispersive X-ray spectroscopy. It was observed that the angle of contact increased and wetting area decreased with the addition of cobalt, molybdenum and titanium nanoparticles to flux. On the other hand, wettability improved with the addition of nickel nanoparticles. Cross-sectional micrographs revealed that both nickel and cobalt nanoparticle doping transformed the morphology of Cu{sub 6}Sn{sub 5} from a typical scallop type to a planer one and reduced the intermetallic compound thickness under optimum condition. These effects were suggested to be related to in-situ interfacial alloying at the interface during reflow. The minimum amount of nanoparticles required to produce the planer morphology was found to be 0.1 wt.% for both nickel and cobalt. Molybdenum and titanium nanoparticles neither appear to undergo alloying during reflow nor have any influence at the solder/substrate interfacial reaction. Thus, doping

  2. Impact of Cooling Rate-Induced Recrystallization on High G Mechanical Shock and Thermal Cycling in Sn-Ag-Cu Solder Interconnects

    NASA Astrophysics Data System (ADS)

    Lee, Tae-Kyu; Bieler, Thomas R.; Kim, Choong-Un

    2016-01-01

    The mechanical stability and thermo-mechanical fatigue performance of solder joints with low silver content Sn-1.0Ag-0.5Cu (wt.%) (SAC105) alloy based on different cooling rates are investigated in high G level shock environment and thermal cycling conditions. The cooling rate-controlled samples ranging from 1°C/min to 75°C/min cooling rate, not only show differences in microstructure, where a fine poly-granular microstructure develops in the case of fast cooling versus normal cooling, but also show various shock performances based on the microstructure changes. The fast cooling rate improves the high G shock performance by over 90% compared to the normal cooled SAC105 alloy air-cooling environment commonly used after assembly reflow. The microstructure effect on thermal cycling performance is also discussed, which is analyzed based on the Sn grain orientation, interconnect stability, and solder joint bulk microstructure.

  3. Evaluation of Electroplated Co-P Film as Diffusion Barrier Between In-48Sn Solder and SiC-Dispersed Bi2Te3 Thermoelectric Material

    NASA Astrophysics Data System (ADS)

    Li, Siyang; Yang, Donghua; Tan, Qing; Li, Liangliang

    2015-06-01

    The diffusion barrier property of Co-P film as a buffer layer between SiC-dispersed Bi2Te3 bulk material and In-48Sn solder was investigated. A Co-P film with thickness of ~6 µm was electroplated on SiC-dispersed Bi2Te3 substrate, joined with In-48Sn solder by a reflow process, and annealed at 100°C for up to 625 h. The formation and growth kinetics of intermetallic compounds (IMCs) at the interface between the In-48Sn and substrate were studied using transmission electron microscopy and scanning electron microscopy with energy-dispersive x-ray spectroscopy. The results showed that crystalline Co(In,Sn)3 formed as an irregular layer adjacent to the solder side at the solder/Co-P interface due to diffusion of Co towards the solder, and a small amount of amorphous Co45P13In12Sn30 appeared at the Co-P side because of diffusion of In and Sn into Co-P. The growth of Co(In,Sn)3 and Co45P13In12Sn30 during solid-state aging was slow, being controlled by interfacial reaction and diffusion, respectively. For comparison, In-48Sn/Bi2Te3-SiC joints were prepared and the IMCs in the joints analyzed. Without a diffusion barrier, In penetrated rapidly into the substrate, which led to the formation of amorphous In x Bi y phase in crystalline In4Te3 matrix. These IMCs grew quickly with prolongation of the annealing time, and their growth was governed by volume diffusion of elements. The experimental data demonstrate that electroplated Co-P film is an effective diffusion barrier for use in Bi2Te3-based thermoelectric modules.

  4. Effect of Current Density and Plating Time on Cu Electroplating in TSV and Low Alpha Solder Bumping

    NASA Astrophysics Data System (ADS)

    Jung, Do-Hyun; Sharma, Ashutosh; Kim, Keong-Heum; Choo, Yong-Chul; Jung, Jae-Pil

    2015-03-01

    In this study, copper filling in through-silicon via (TSV) by pulse periodic reverse electroplating and low alpha solder bumping on Cu-filled TSVs was investigated. The via diameter and depth of TSV were 60 and 120 µm, respectively. The experimental results indicated that the thickness of electrodeposited copper layer increased with increasing cathodic current density and plating time. The electroplated Cu in TSV showed a typical bottom-up filling. A defectless, complete, and fast 100% Cu-filled TSV was achieved at cathodic and anodic current densities of -8 and 16 mA/cm2 for a plating time of 4 h, respectively. A sound low alpha solder ball, Sn-1.0 wt.% Ag-0.5 wt.% Cu (SAC 105) with a diameter of 83 µm and height of 66 µm was reflow processed at 245 °C on Cu-filled TSV. The Cu/solder joint interface was subjected to high temperature aging at 85 °C for 150 h, which showed an excellent bonding characteristic with minimum Cu-Sn intermetallic compounds growth.

  5. Reducing the emission of ozone depleting chemicals through use of a self-cleaning soldering process

    SciTech Connect

    Lichtenberg, L.; Martin, G.; Van Buren, P.; Iman, R.; Paffett, M.T.

    1991-12-31

    Motorola has jointed with Sandia and Los Alamos National Laboratories to perform work under a Cooperative Research and Development Agreement (CRADA) to reduce the use of CFC`s and other ozone depleting printing wiring board (PWB) cleaning solvents. This study evaluated the use of a new soldering process that uses dilute adipic acid in lieu of rosin flux. The process consumes the adipic acid in lieu of rosin flux. The process consumes the adipic acid during the soldering process and precludes the need for subsequent cleaning with ozone depleting solvents. This paper presents results from a series of designed experiments that evaluated PWB cleanliness as a function of various levels of machine control parameters. The study included a comprehensive hardware reliability evaluation, which included environmental conditioning, cleanliness testing, surface chemical analysis, surface insulation resistance testing, along with electrical, mechanical and long term storage testing. The results of this study that the new process produces quality, reliable hardware over a wide range of processing parameters. Adoption of this process, which eliminates the need for supplemental cleaning, will have a positive impact on many environmental problems, including depletion of the ozone layer.

  6. Reducing the emission of ozone depleting chemicals through use of a self-cleaning soldering process

    SciTech Connect

    Lichtenberg, L.; Martin, G.; Van Buren, P. . Government Electronics Group); Iman, R. ); Paffett, M.T. )

    1991-01-01

    Motorola has jointed with Sandia and Los Alamos National Laboratories to perform work under a Cooperative Research and Development Agreement (CRADA) to reduce the use of CFC's and other ozone depleting printing wiring board (PWB) cleaning solvents. This study evaluated the use of a new soldering process that uses dilute adipic acid in lieu of rosin flux. The process consumes the adipic acid in lieu of rosin flux. The process consumes the adipic acid during the soldering process and precludes the need for subsequent cleaning with ozone depleting solvents. This paper presents results from a series of designed experiments that evaluated PWB cleanliness as a function of various levels of machine control parameters. The study included a comprehensive hardware reliability evaluation, which included environmental conditioning, cleanliness testing, surface chemical analysis, surface insulation resistance testing, along with electrical, mechanical and long term storage testing. The results of this study that the new process produces quality, reliable hardware over a wide range of processing parameters. Adoption of this process, which eliminates the need for supplemental cleaning, will have a positive impact on many environmental problems, including depletion of the ozone layer.

  7. Microbial leaching of waste solder for recovery of metal.

    PubMed

    Hocheng, H; Hong, T; Jadhav, U

    2014-05-01

    This study proposes an environment-friendly bioleaching process for recovery of metals from solders. Tin-copper (Sn-Cu), tin-copper-silver (Sn-Cu-Ag), and tin-lead (Sn-Pb) solders were used in the current study. The culture supernatant of Aspergillus niger removed metals faster than the culture supernatant of Acidithiobacillus ferrooxidans. Also, the metal removal by A. niger culture supernatant is faster for Sn-Cu-Ag solder as compared to other solder types. The effect of various process parameters such as shaking speed, temperature, volume of culture supernatant, and increased solder weight on bioleaching of metals was studied. About 99 (±1.75) % metal dissolution was achieved in 60 h, at 200-rpm shaking speed, 30 °C temperature, and by using 100-ml A. niger culture supernatant. An optimum solder weight for bioleaching was found to be 5 g/l. Addition of sodium hydroxide (NaOH) and sodium chloride (NaCl) in the bioleached solution from Sn-Cu-Ag precipitated tin (85 ± 0.35 %) and silver (80 ± 0.08 %), respectively. Passing of hydrogen sulfide (H2S) gas at pH 8.1 selectively precipitated lead (57.18 ± 0.13 %) from the Sn-Pb bioleached solution. The proposed innovative bioleaching process provides an alternative technology for recycling waste solders to conserve resources and protect environment. PMID:24634142

  8. Development of a new Pb-free solder: Sn-Ag-Cu

    SciTech Connect

    Miller, C.M.

    1995-02-10

    With the ever increasing awareness of the toxicity of Pb, significant pressure has been put on the electronics industry to get the Pb out of solder. This work pertains to the development and characterization of an alloy which is Pb-free, yet retains the proven positive qualities of current Sn-Pb solders while enhancing the shortcomings of Sn-Pb solder. The solder studied is the Sn-4.7Ag-1.7Cu wt% alloy. By utilizing a variety of experimental techniques the alloy was characterized. The alloy has a melting temperature of 217{degrees}C and exhibits eutectic melting behavior. The solder was examined by subjecting to different annealing schedules and examining the microstructural stability. The effect of cooling rate on the microstructure of the solder was also examined. Overall, this solder alloy shows great promise as a viable alternative to Pb-bearing solders and, as such, an application for a patent has been filed.

  9. Solder wetting behavior enhancement via laser-textured surface microcosmic topography

    NASA Astrophysics Data System (ADS)

    Chen, Haiyan; Peng, Jianke; Fu, Li; Wang, Xincheng; Xie, Yan

    2016-04-01

    In order to reduce or even replace the use of Sn-Pb solder in electronics industry, the laser-textured surface microstructures were used to enhance the wetting behavior of lead free solder during soldering. According to wetting theory and Sn-Ag-Cu lead free solder performance, we calculated and designed four microcosmic structures with the similar shape and different sizes to control the wetting behavior of lead free solder. The micro-structured surfaces with different dimensions were processed on copper plates by fiber femtosecond laser, and the effect of microstructures on wetting behavior was verified experimentally. The results showed that the wetting angle of Sn-Ag-Cu solder on the copper plate with microstructures decreased effectively compared with that on the smooth copper plate. The wetting angles had a sound fit with the theoretical values calculated by wetting model. The novel method provided a feasible route for adjusting the wetting behavior of solders and optimizing solders system.

  10. Comparison of Sn-Ag-Cu Solder Alloy Intermetallic Compound Growth Under Different Thermal Excursions for Fine-Pitch Flip-Chip Assemblies

    NASA Astrophysics Data System (ADS)

    Tian, Ye; Liu, Xi; Chow, Justin; Wu, Yi Ping; Sitaraman, Suresh K.

    2013-08-01

    The intermetallic compound (IMC) evolution in Cu pad/Sn-Ag-Cu solder interface and Sn-Ag-Cu solder/Ni pad interface was investigated using thermal shock experiments with 100- μm-pitch flip-chip assemblies. The experiments show that low standoff height of solder joints and high thermomechanical stress play a great role in the interfacial IMC microstructure evolution under thermal shock, and strong cross-reaction of pad metallurgies is evident in the intermetallic growth. Furthermore, by comparing the IMC growth during thermal aging and thermal shock, it was found that thermal shock accelerates IMC growth and that kinetic models based on thermal aging experiments underpredict IMC growth in thermal shock experiments. Therefore, new diffusion kinetic parameters were determined for the growth of (Cu,Ni)6Sn5 using thermal shock experiments, and the Cu diffusion coefficient through the IMC layer was calculated to be 0.2028 μm2/h under thermal shock. Finite-element models also show that the solder stresses are higher under thermal shock, which could explain why the IMC growth is faster and greater under thermal shock cycling as opposed to thermal aging.

  11. Methylene blue solder re-absorption in microvascular anastomoses

    NASA Astrophysics Data System (ADS)

    Birch, Jeremy F.; Hepplewhite, J.; Frier, Malcolm; Bell, Peter R. F.

    2003-06-01

    Soldered vascular anastomoses have been reported using several chromophores but little is known of the optimal conditions for microvascular anastomosis. There are some indications of the optimal protein contents of a solder, and the effects of methylene blue on anastomotic strength. The effects of varying laser power density in vivo have also been described, showing a high rate of thrombosis with laser power over 22.9Wcm-2. However no evidence exists to describe how long the solder remains at the site of the anastomosis. Oz et al reported that the fibrin used in their study had been almost completely removed by 90 days but without objective evidence of solder removal. In order to address the issue of solder re-absorption from the site of an anastomosis we used radio-labelled albumin (I-125) incorporated into methylene blue based solder. This was investigated in both the situation of the patent and thrombosed anastomosis with anastomoses formed at high and low power. Iodine-125 (half life: 60.2 days) was covalently bonded to porcine albumin and mixed with the solder solution. Radio-iodine has been used over many years to determine protein turnover using either I-125 or I-131. Iodine-125 labelled human albumin is regularly used as a radiopharmaceutical tool for the determination of plasma volume. Radio-iodine has the advantages of not affecting protein metabolism and the label is rapidly excreted after metabolic breakdown. Labelling with chromium (Cr-51) causes protein denaturation and is lost from the protein with time. Labelled albumin has been reported in human studies over a 21-day period, with similar results reported by Matthews. Most significantly McFarlane reported a different rate of catabolism of I-131 and I-125 over a 22-day period. The conclusion from this is that the rate of iodine clearance is a good indicator of protein catabolism. In parallel with the surgery a series of blank standards were prepared with a known mass of solder to correct for isotope

  12. The polarity effect of electromigration on intermetallic compound formation and back stress in v-groove solder lines

    NASA Astrophysics Data System (ADS)

    Ou, Shengquan

    2005-07-01

    The trend of the miniaturization of VLSI and electronic packaging toward higher input/output density, smaller feature size and greater performance makes electromigration a serious reliability concern in flip chip technology. As an integral part of the joint, intermetallic compound (IMC) formation is very important to achieve good joint strength. However, the effect of electromigration on the IMC formation is a subject in which still very little is known. We utilize solder v-groove samples etched on (001) Si wafer with 100 mum opening to study the polarity effect of electromigration on IMC formation in solder joints. We focus on the interaction between chemical and electrical forces, and the influence of interface morphology on the IMC dissolution. The current densities used are from 103 to 104 A/cm2 and the temperature settings are in the range of 120°C to 180°C. We have found in both 95.5Sn3.8Ag0.7Cu/Cu and 96.5Sn3.5Ag systems the growth of the IMC has been enhanced by electric current at the anode and inhibited at the cathode. For Ni-Sn compound, kinetic analysis using the motion of the two interfaces gives the general formula of the growth rate as dXdt=aX + b. We have introduced the concept of mean-field theory and the classic model of Zener's precipitation growth into the discussion of the Cu-Sn compound growth under electromigration. A parabolic dependence of the IMC growth on time at the anode is derived as x 2 ≅ (Cm-Ce)2 (Cs-Ce)2 Dt. The interaction between chemical and electrical forces brings a dynamic equilibrium in IMC dissolution at the cathode. This has been proved theoretically and experimentally. A new critical product has been derived from this dynamic equilibrium, which can provide us a critical IMC thickness before voids formation at a given current density. Our study shows the dissolution rate of Cu with current density 5x103 A/cm2 at 150°C is about 0.076 mum/hr. We also notice that the interface morphology plays an important role in the IMC

  13. 30 CFR 77.1916 - Welding, cutting, and soldering; fire protection.

    Code of Federal Regulations, 2012 CFR

    2012-07-01

    ... 30 Mineral Resources 1 2012-07-01 2012-07-01 false Welding, cutting, and soldering; fire... OF UNDERGROUND COAL MINES Slope and Shaft Sinking § 77.1916 Welding, cutting, and soldering; fire protection. (a) One portable fire extinguisher shall be provided where welding, cutting, or soldering...

  14. 30 CFR 77.1112 - Welding, cutting, or soldering with arc or flame; safeguards.

    Code of Federal Regulations, 2013 CFR

    2013-07-01

    ... 30 Mineral Resources 1 2013-07-01 2013-07-01 false Welding, cutting, or soldering with arc or... WORK AREAS OF UNDERGROUND COAL MINES Fire Protection § 77.1112 Welding, cutting, or soldering with arc or flame; safeguards. (a) When welding, cutting, or soldering with arc or flame near...

  15. 30 CFR 77.1112 - Welding, cutting, or soldering with arc or flame; safeguards.

    Code of Federal Regulations, 2010 CFR

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, or soldering with arc or... WORK AREAS OF UNDERGROUND COAL MINES Fire Protection § 77.1112 Welding, cutting, or soldering with arc or flame; safeguards. (a) When welding, cutting, or soldering with arc or flame near...

  16. 30 CFR 77.1916 - Welding, cutting, and soldering; fire protection.

    Code of Federal Regulations, 2014 CFR

    2014-07-01

    ... 30 Mineral Resources 1 2014-07-01 2014-07-01 false Welding, cutting, and soldering; fire... OF UNDERGROUND COAL MINES Slope and Shaft Sinking § 77.1916 Welding, cutting, and soldering; fire protection. (a) One portable fire extinguisher shall be provided where welding, cutting, or soldering...

  17. 30 CFR 77.1112 - Welding, cutting, or soldering with arc or flame; safeguards.

    Code of Federal Regulations, 2012 CFR

    2012-07-01

    ... 30 Mineral Resources 1 2012-07-01 2012-07-01 false Welding, cutting, or soldering with arc or... WORK AREAS OF UNDERGROUND COAL MINES Fire Protection § 77.1112 Welding, cutting, or soldering with arc or flame; safeguards. (a) When welding, cutting, or soldering with arc or flame near...

  18. 30 CFR 75.1106 - Welding, cutting, or soldering with arc or flame underground.

    Code of Federal Regulations, 2012 CFR

    2012-07-01

    ... 30 Mineral Resources 1 2012-07-01 2012-07-01 false Welding, cutting, or soldering with arc or... Protection § 75.1106 Welding, cutting, or soldering with arc or flame underground. All welding, cutting, or... conducted in fireproof enclosures. Welding, cutting, or soldering with arc or flame in other than...

  19. 30 CFR 77.1916 - Welding, cutting, and soldering; fire protection.

    Code of Federal Regulations, 2013 CFR

    2013-07-01

    ... 30 Mineral Resources 1 2013-07-01 2013-07-01 false Welding, cutting, and soldering; fire... OF UNDERGROUND COAL MINES Slope and Shaft Sinking § 77.1916 Welding, cutting, and soldering; fire protection. (a) One portable fire extinguisher shall be provided where welding, cutting, or soldering...

  20. 30 CFR 75.1106 - Welding, cutting, or soldering with arc or flame underground.

    Code of Federal Regulations, 2013 CFR

    2013-07-01

    ... 30 Mineral Resources 1 2013-07-01 2013-07-01 false Welding, cutting, or soldering with arc or... Protection § 75.1106 Welding, cutting, or soldering with arc or flame underground. All welding, cutting, or... conducted in fireproof enclosures. Welding, cutting, or soldering with arc or flame in other than...

  1. 30 CFR 75.1106 - Welding, cutting, or soldering with arc or flame underground.

    Code of Federal Regulations, 2011 CFR

    2011-07-01

    ... 30 Mineral Resources 1 2011-07-01 2011-07-01 false Welding, cutting, or soldering with arc or... Protection § 75.1106 Welding, cutting, or soldering with arc or flame underground. All welding, cutting, or... conducted in fireproof enclosures. Welding, cutting, or soldering with arc or flame in other than...

  2. 30 CFR 77.1112 - Welding, cutting, or soldering with arc or flame; safeguards.

    Code of Federal Regulations, 2014 CFR

    2014-07-01

    ... 30 Mineral Resources 1 2014-07-01 2014-07-01 false Welding, cutting, or soldering with arc or... WORK AREAS OF UNDERGROUND COAL MINES Fire Protection § 77.1112 Welding, cutting, or soldering with arc or flame; safeguards. (a) When welding, cutting, or soldering with arc or flame near...

  3. 30 CFR 75.1106 - Welding, cutting, or soldering with arc or flame underground.

    Code of Federal Regulations, 2014 CFR

    2014-07-01

    ... 30 Mineral Resources 1 2014-07-01 2014-07-01 false Welding, cutting, or soldering with arc or... Protection § 75.1106 Welding, cutting, or soldering with arc or flame underground. All welding, cutting, or... conducted in fireproof enclosures. Welding, cutting, or soldering with arc or flame in other than...

  4. 30 CFR 75.1106 - Welding, cutting, or soldering with arc or flame underground.

    Code of Federal Regulations, 2010 CFR

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, or soldering with arc or... Protection § 75.1106 Welding, cutting, or soldering with arc or flame underground. All welding, cutting, or... conducted in fireproof enclosures. Welding, cutting, or soldering with arc or flame in other than...

  5. 30 CFR 77.1112 - Welding, cutting, or soldering with arc or flame; safeguards.

    Code of Federal Regulations, 2011 CFR

    2011-07-01

    ... 30 Mineral Resources 1 2011-07-01 2011-07-01 false Welding, cutting, or soldering with arc or... WORK AREAS OF UNDERGROUND COAL MINES Fire Protection § 77.1112 Welding, cutting, or soldering with arc or flame; safeguards. (a) When welding, cutting, or soldering with arc or flame near...

  6. Three-dimensional (3D) microstructural characterization and quantification of reflow porosity in Sn-rich alloy/copper joints by X-ray tomography

    SciTech Connect

    Jiang Ling; Chawla, Nikhilesh; Pacheco, Mario; Noveski, Vladimir

    2011-10-15

    In this paper high resolution X-ray tomography was used to characterize reflow porosity in Sn-3.9Ag-0.7Cu/Cu solder joints. The combination of two segmentation techniques was applied for the three-dimensional (3D) visualization of pores in the joints and the quantification on the characteristics of reflow porosity, including pore size, volume fraction and morphology. The size, morphology and distribution of porosity were visualized in 3D for three different solder joints. Since the results are relatively similar for all three, only the results of one joint are presented. Solder reflow porosity was mostly spherical, segregated along the solder/Cu interface, and had an average pore size of 30 {mu}m in diameter. A few large pores (larger than 100 {mu}m in diameter) were present, some of which had lower sphericity, i.e., they were more irregular. The presence of these large pores may significantly influence the mechanical behavior of solder joints. - Highlights: {yields} Non-destructive 3D characterization and quantification of porosity in Pb-free solders by X-ray tomography {yields} Two new image analysis and reconstruction tools are presented that can be used by the community at large {yields} Pore size, volume fraction, and sphericity, is critical to understanding microstructure and modeling of these systems.

  7. Effects of solder temperature on pin through-hole during wave soldering: thermal-fluid structure interaction analysis.

    PubMed

    Aziz, M S Abdul; Abdullah, M Z; Khor, C Y

    2014-01-01

    An efficient simulation technique was proposed to examine the thermal-fluid structure interaction in the effects of solder temperature on pin through-hole during wave soldering. This study investigated the capillary flow behavior as well as the displacement, temperature distribution, and von Mises stress of a pin passed through a solder material. A single pin through-hole connector mounted on a printed circuit board (PCB) was simulated using a 3D model solved by FLUENT. The ABAQUS solver was employed to analyze the pin structure at solder temperatures of 456.15 K (183(°)C) < T < 643.15 K (370(°)C). Both solvers were coupled by the real time coupling software and mesh-based parallel code coupling interface during analysis. In addition, an experiment was conducted to measure the temperature difference (ΔT) between the top and the bottom of the pin. Analysis results showed that an increase in temperature increased the structural displacement and the von Mises stress. Filling time exhibited a quadratic relationship to the increment of temperature. The deformation of pin showed a linear correlation to the temperature. The ΔT obtained from the simulation and the experimental method were validated. This study elucidates and clearly illustrates wave soldering for engineers in the PCB assembly industry. PMID:25225638

  8. Solder wetting kinetics in narrow V-grooves

    SciTech Connect

    Yost, F.G.; Rye, R.R.; Mann, J.A. Jr.

    1997-12-01

    Experiments are performed to observe capillary flow in grooves cut into copper surfaces. Flow kinetics of two liquids, 1-heptanol and eutectic Sn-Pb solder, are modeled with modified Washburn kinetics and compared to flow data. It is shown that both liquids flow parabolically in narrow V-grooves, and the data scale as predicted by the modified Washburn model. The early portions of the flow kinetics are characterized by curvature in the length vs time relationship which is not accounted for in the modified Washburn model. This effect is interpreted in terms of a dynamic contact angle. It is concluded that under conditions of rapid flow, solder spreading can be understood as a simple fluid flow process. Slower kinetics, e.g. solder droplet spreading on flat surfaces, may be affected by subsidiary chemical processes such as reaction.

  9. Development of alternatives to lead-bearing solders

    SciTech Connect

    Vianco, P.T.

    1993-07-01

    Soldering technology, using tin-lead alloys has had a significant role in the packaging of highly functional, low cost electronic devices. The elimination of lead from all manufactured products, whether through legislation or tax incentives, will impact the electronics community which uses lead-containing solders. In response to these proposed measures, the National Center for Manufacturing Sciences has established a multi-year program involving participants from industry, academia, and the national laboratories with the objective to identify potential replacements for lead-bearing solders. Selection of candidate alloys is based upon the analysis of materials properties, manufacturability, modeling codes for reliability prediction, as well as toxicological properties and resource availability, data developed in the program.

  10. Materials chemistry. Composition-matched molecular "solders" for semiconductors.

    PubMed

    Dolzhnikov, Dmitriy S; Zhang, Hao; Jang, Jaeyoung; Son, Jae Sung; Panthani, Matthew G; Shibata, Tomohiro; Chattopadhyay, Soma; Talapin, Dmitri V

    2015-01-23

    We propose a general strategy to synthesize largely unexplored soluble chalcogenidometallates of cadmium, lead, and bismuth. These compounds can be used as "solders" for semiconductors widely used in photovoltaics and thermoelectrics. The addition of solder helped to bond crystal surfaces and link nano- or mesoscale particles together. For example, CdSe nanocrystals with Na2Cd2Se3 solder was used as a soluble precursor for CdSe films with electron mobilities exceeding 300 square centimeters per volt-second. CdTe, PbTe, and Bi2Te3 powders were molded into various shapes in the presence of a small additive of composition-matched chalcogenidometallate or chalcogel, thus opening new design spaces for semiconductor technologies. PMID:25569110

  11. Materials chemistry. Composition-matched molecular "solders" for semiconductors.

    PubMed

    Dolzhnikov, Dmitriy S; Zhang, Hao; Jang, Jaeyoung; Son, Jae Sung; Panthani, Matthew G; Shibata, Tomohiro; Chattopadhyay, Soma; Talapin, Dmitri V

    2015-01-23

    We propose a general strategy to synthesize largely unexplored soluble chalcogenidometallates of cadmium, lead, and bismuth. These compounds can be used as "solders" for semiconductors widely used in photovoltaics and thermoelectrics. The addition of solder helped to bond crystal surfaces and link nano- or mesoscale particles together. For example, CdSe nanocrystals with Na2Cd2Se3 solder was used as a soluble precursor for CdSe films with electron mobilities exceeding 300 square centimeters per volt-second. CdTe, PbTe, and Bi2Te3 powders were molded into various shapes in the presence of a small additive of composition-matched chalcogenidometallate or chalcogel, thus opening new design spaces for semiconductor technologies.

  12. A ban on use of lead-bearing solders: Implications for the electronics industry

    SciTech Connect

    Vianco, P.T.; Yost, F.G.

    1992-04-01

    This white paper addresses the issue of banning lead from solders used in electronics manufacturing. The current efforts by legislative bodies and regulatory agencies to curtail the use of lead in manufactured goods, including solders, are described. In response to a ban on lead or the imposition of a tax which makes lead uneconomical for use in solder alloys, alternative technologies including lead-free solders and conductive epoxies are presented. The recommendation is made that both users and producers of solder materials join together as partners in a consortium to address this issue in a timely and cost-effective manner.

  13. Comparison of isopropyl alcohol and trichloroethylene in removing solder flux: Topical report

    SciTech Connect

    Benkovich, M.G.

    1988-01-01

    This work evaluated a nontoxic solvent for its ability to remove solder flux as compared to trichloroethylene solvent. Isopropyl alcohol was evaluated for its cleaning efficiency for solder flux removal using a high pressure spray process (minimum spray pressure of 80 psig). Cleanliness levels were measured by the Meseran Surface Analyzer. Test samples also underwent gas chromatograph/mass spectrometer Analysis and were visually inspected under a longwave ultraviolet lamp. Detailed analyses of flux removal by the two solvents were made as related to solder flux types, solder flux diluted by 50% with isopropyl alcohol, and solder process conditions. 2 refs., 2 figs., 12 tabs.

  14. Preparation of Sn—Ag—In ternary solder bumps by electroplating in sequence and reliability

    NASA Astrophysics Data System (ADS)

    Dongliang, Wang; Yuan, Yuan; Le, Luo

    2011-08-01

    This paper describes a technique that can obtain ternary Sn—Ag—In solder bumps with fine pitch and homogenous composition distribution. The mainfeature of this process is that tin-silver and indium are electroplated on copper under bump metallization (UBM) in sequence. After an accurate reflow process, Sn1.8Ag9.4In solder bumps are obtained. It is found that the intermetallic compounds (IMCs) between Sn—Ag—In solder and Cu grow with the reflow time, which results in an increase in Ag concentration in the solder area. So during solidification, more Ag2In nucleates and strengthens the solder.

  15. Fluxless flip chip bonding processes and aerial fluxless bonding technology

    NASA Astrophysics Data System (ADS)

    Kim, Dongwook

    New fluxless flip chip processes of Sn-rich non-eutectic Au-Sn solder bumps were developed using vacuum deposition and electroplating technique. It is believed that this is the first report that non-eutectic Au-Sn flip chip solder bonding is achieved without the use of flux. In order to make 200mum diameter and 10mum thick Au-Sn solder bump 0.03mum of Cr, 10mum of Sn and 0.3mum of Au were vacuum deposited on the Si wafer through the high carbon steal stencil mask. Nearly void-free solder bumps with small grains of AuSn4 intermetallic compound were achieved. The re-melting temperature of solder bumps was measured to be 220°C. In the second part, first, the fluxless bonding process was performed in hydrogen environment with electroplated 4 mm x 4mm Au-Sn multi-layer chips if electroplating technique is compatible with our process. High quality and nearly void free solder joint was successfully achieved with this new process. After proving compatibility of the process, tall electroplated Sn/Au bumps (50 mum) were produced by photolithography method using Su-8 photoresist. The bumps in the chip were flip chip bonded to the borosilicate glass wafer coated with Cr (0.03 mum) and Au (0.05 mum) pads without using any flux. Fluxless and lead-free bonding technology in air ambient based on non eutectic 5 at. % Au-95 at. % Sn and eutectic 57 at. %Sn-43 at. % Bi with Au capping layer have been developed and studied. To understand the fluxless bonding principles in air ambient, phase formation mechanism of Au-Sn intermetallics embedded in Bi matrix has been postulated. The Au-Sn intermetallic-capping layer covers most outer surface of the samples and inhibits formation of oxide layer due to the minimizing exposure of (beta-Sn) phase to the air. In conclusion, new-lead free and fluxless bonding processes for flip chip packages were developed. In this work, Sn-rich Au-Sn flip chip solder bumps using vacuum deposition and electroplating process were successfully produced. It is

  16. Perpendicular Growth Characteristics of Cu-Sn Intermetallic Compounds at the Surface of 99Sn-1Cu/Cu Solder Interconnects

    NASA Astrophysics Data System (ADS)

    Chen, Zhiwen; Liu, Changqing; Wu, Yiping; An, Bing

    2015-12-01

    The growth of intermetallic compounds (IMCs) on the free surface of 99Sn-1Cu solder joints perpendicular to the interdiffusion direction has been investigated in this work. The specimens were specifically designed and polished to reveal a flat free surface at the solder/Cu interface for investigation. After aging at 175°C for progressively increased durations, the height of the perpendicular IMCs was examined and found to follow a parabolic law with aging duration that could be expressed as y = 0.11√ t, where t is the aging duration in hours and y is the height of the perpendicular IMCs in μm. For comparison, the planar growth of IMCs along the interdiffusion direction was also investigated in 99Sn-1Cu/Cu solder joints. After prolonged aging at 175°C, the thickness of the planar interfacial IMC layers also increased parabolically with aging duration and could be expressed as h_{{IMC}} = 0.27√ t + 4.6, where h is the thickness in μm and t is the time in hours. It was found that both the planar and perpendicular growth of the IMCs were diffusion-controlled processes, but the perpendicular growth of the IMCs was much slower than their planar growth due to the longer diffusion distance. It is proposed that Cu3Sn forms prior to the formation of Cu6Sn5 in the perpendicular IMCs, being the reverse order compared with the planar IMC growth.

  17. Fixture aids soldering of electronic components on circuit board

    NASA Technical Reports Server (NTRS)

    Ross, M. H.

    1966-01-01

    Spring clamp fixture holds small electronic components in a desired position while they are being soldered on a circuit board. The spring clamp is clipped on the edge of the circuit board and an adjustable spring-steel boom holds components against the board. The felt pad at the end of the boom is replaced with different attachments for other holding tasks.

  18. 28. VIEW OF THE SOLDERING NICHE FORMED WITH BRICKS. THE ...

    Library of Congress Historic Buildings Survey, Historic Engineering Record, Historic Landscapes Survey

    28. VIEW OF THE SOLDERING NICHE FORMED WITH BRICKS. THE BACK OF THE NICHE IS CEMENT FINISHED. THE BOTTOM HAS A 1 INCH THICK ASBESTOS SHELF. THIS PHOTO WAS TAKEN AT THE 3RD FLOOR. - Pacific Telephone & Telegraph Company Building, 1519 Franklin Street, Oakland, Alameda County, CA

  19. Fundamentals of wetting and spreading with emphasis on soldering

    SciTech Connect

    Yost, F.G.

    1991-01-01

    Soldering is often referred to as a mature technology whose fundamentals were established long ago. Yet a multitude of soldering problems persist, not the least of which are related to the wetting and spreading of solder. The Buff-Goodrich approach to thermodynamics of capillarity is utilized in a review of basic wetting principles. These thermodynamics allow a very compact formulation of capillary phenomena which is used to calculate various meniscus shapes and wetting forces. These shapes and forces lend themselves to experimental techniques, such as the sessile drop and the Wilhelmy plate, for measuring useful surface and interfacial energies. The familiar equations of Young, Wilhelmy, and Neumann are all derived with this approach. The force-energy duality of surface energy is discussed and the force method is developed and used to derive the Herring relations for anisotropic surfaces. The importance of contact angle hysteresis which results from surface roughness and chemical inhomogeneity is presented and Young's equation is modified to reflect these ever present effects. Finally, an analysis of wetting with simultaneous metallurigical reaction is given and used to discuss solder wetting phenomena. 60 refs., 13 figs.

  20. Robot End Effector To Place and Solder Solar Cells

    NASA Technical Reports Server (NTRS)

    Hagerty, J. J.

    1982-01-01

    Encapsulated in robot end effector is RF induction-heating coil for heating solar cell while in transit. Holes in encapsulant permit end of unit to act as vacuum pickup to grip solar cell. Use of RF induction heating allows cell to be heated without requiring direct mechanical and thermal contact of bonding tool such as soldering iron.

  1. A constitutive model for Sn-Pb solder.

    SciTech Connect

    Neilsen, Michael K.; Vianco, Paul Thomas; Boyce, Brad Lee

    2010-10-01

    A unified creep plasticity damage (UCPD) model for Sn-Pb solder is developed in this paper. Stephens and Frear (1999) studied the creep behavior of near-eutectic 60Sn-40Pb solder subjected to low strain rates and found that the inelastic (creep and plastic) strain rate could be accurately described using a hyperbolic Sine function of the applied effective stress. A recently developed high-rate servo-hydraulic method was employed to characterize the temperature and strain-rate dependent stress-strain behavior of eutectic Sn-Pb solder over a wide range of strain rates (10{sup -4} to 10{sup 2} per second). The steady state inelastic strain rate data from these latest experiments were also accurately captured by the hyperbolic Sine equation developed by Stephens and Frear. Thus, this equation was used as the basis for the UCPD model for Sn-Pb solder developed in this paper. Stephens, J.J., and Frear, D.R., Metallurgical and Materials Transactions A, Volume 30A, pp. 1301-1313, May 1999.

  2. Printed-Circuit-Board Soldering Training for Group IV Personnel.

    ERIC Educational Resources Information Center

    Hooprich, E. A.; Matlock, E. W.

    As part of a larger program to determine which Navy skills can be learned by lower aptitude personnel, and which methods and techniques would be most effective, an experimental course in printed circuit board soldering was given to 186 Group IV students in 13 classes. Two different training approaches--one stressing instructor guidance and the…

  3. Horizon shells and BMS-like soldering transformations

    NASA Astrophysics Data System (ADS)

    Blau, Matthias; O'Loughlin, Martin

    2016-03-01

    We revisit the theory of null shells in general relativity, with a particular emphasis on null shells placed at horizons of black holes. We study in detail the considerable freedom that is available in the case that one solders two metrics together across null hypersurfaces (such as Killing horizons) for which the induced metric is invariant under translations along the null generators. In this case the group of soldering transformations turns out to be infinite dimensional, and these solderings create non-trivial horizon shells containing both massless matter and impulsive gravitational wave components. We also rephrase this result in the language of Carrollian symmetry groups. To illustrate this phenomenon we discuss in detail the example of shells on the horizon of the Schwarzschild black hole (with equal interior and exterior mass), uncovering a rich classical structure at the horizon and deriving an explicit expression for the general horizon shell energy-momentum tensor. In the special case of BMS-like soldering supertranslations we find a conserved shell-energy that is strikingly similar to the standard expression for asymptotic BMS supertranslation charges, suggesting a direct relation between the physical properties of these horizon shells and the recently proposed BMS supertranslation hair of a black hole.

  4. Recycling of lead solder dross, Generated from PCB manufacturing

    NASA Astrophysics Data System (ADS)

    Lucheva, Biserka; Tsonev, Tsonio; Iliev, Peter

    2011-08-01

    The main purpose of this work is to analyze lead solder dross, a waste product from manufacturing of printed circuit boards by wave soldering, and to develop an effective and environmentally sound technology for its recycling. A methodology for determination of the content and chemical composition of the metal and oxide phases of the dross is developed. Two methods for recycling of lead solder dross were examined—carbothermal reduction and recycling using boron-containing substances. The influence of various factors on the metal yield was studied and the optimal parameters of the recycling process are defined. The comparison between them under the same parameters-temperature and retention time, showed that recycling of dross with a mixture of borax and boric acid in a 1:2 ratio provides higher metal yield (93%). The recycling of this hazardous waste under developed technology gets glassy slag and solder, which after correction of the chemical composition can be used again for production of PCB.

  5. Microstructure and Sn crystal orientation evolution in Sn-3.5Ag lead-free solders in high temperature packaging applications

    SciTech Connect

    Zhou, Bite; Muralidharan, Govindarajan; Kurumaddali, Nalini Kanth; Parish, Chad M; Leslie, Dr Scott; Bieler, T. R.

    2014-01-01

    Understanding the reliability of eutectic Sn-3.5Ag lead-free solders in high temperature packaging applications is of significant interest in power electronics for the next generation electric grid. Large area (2.5mm 2.5mm) Sn-3.5Ag solder joints between silicon dies and direct bonded copper substrates were thermally cycled between 5 C and 200 C. Sn crystal orientation and microstructure evolution during thermal cycling were characterized by electron backscatter diffraction (EBSD) in scanning electron microscope (SEM). Comparisons are made between observed initial texture and microstructure and its evolution during thermal cycling. Gradual lattice rotation and grain boundary misorientation evolution suggested the continuous recrystallization mechanism. Recrystallization behavior was correlated with dislocation slip activities.

  6. Joint swelling

    MedlinePlus

    Swelling of a joint ... Joint swelling may occur along with joint pain . The swelling may cause the joint to appear larger or abnormally shaped. Joint swelling can cause pain or stiffness. After an ...

  7. Roles of interfacial reaction on mechanical properties of solder interfaces

    NASA Astrophysics Data System (ADS)

    Liu, Pilin

    This study investigated roles of interfacial reaction in fracture and fatigue of solder interconnects. The interfacial reaction phases in the as-reflowed and after aging were examined by cross-sectional transmission electron microscopy (TEM) while interfacial mechanical properties were determined from a flexural peel fracture mechanics technique. Because of their widespread uses in microelectronic packaging, SnPb solder interfaces, and Bi-containing Pb-free solder interfaces were chosen as the subjects of this study. In the interfacial reaction study, we observed a complicated micro structural evolution during solid-state aging of electroless-Ni(P)/SnPb solder interconnects. In as-reflowed condition, the interfacial reaction produced Ni3Sn 4 and P-rich layers. Following overaging, the interfacial microstructure degenerated into a complex multilayer structure consisting of multiple layers of Ni-Sn compounds and transformed Ni-P phases. In SnPb solder interfacial system, fatigue study showed that the overaging of the high P electroless Ni-P/SnPb interconnects resulted in a sharp reduction in the fatigue resistance of the interface in the high crack growth rate regime. Fracture mechanism analysis indicated that the sharp drop in fatigue resistance was triggered by the brittle fracture of the Ni3Sn2 intermetallic phase developed at the overaged interface. The fatigue behavior was strongly dependent on P concentration in electroless Ni. Kirkendall voids were found in the interfacial region after aging, but they did not cause premature fracture of the solder interfaces. In Bi-containing solder interfacial system, we found that Bi segregated to the Cu-intermetallic interface during aging in SnBi/Cu interconnect. This caused serious embrittlement of Sn-Bi/Cu interface. Further aging induced numerous voids along the Cu3Sn/Cu interface. These interfacial voids were different from Kirkendall voids. Their formation was explained on basis of vacancy condensation at the

  8. The tensile strength characteristics study of the laser welds of biological tissue using the nanocomposite solder

    NASA Astrophysics Data System (ADS)

    Rimshan, I. B.; Ryabkin, D. I.; Savelyev, M. S.; Zhurbina, N. N.; Pyanov, I. V.; Eganova, E. M.; Pavlov, A. A.; Podgaetsky, V. M.; Ichkitidze, L. P.; Selishchev, S. V.; Gerasimenko, A. Y.

    2016-04-01

    Laser welding device for biological tissue has been developed. The main device parts are the radiation system and adaptive thermal stabilization system of welding area. Adaptive thermal stabilization system provided the relation between the laser radiation intensity and the weld temperature. Using atomic force microscopy the structure of composite which is formed by the radiation of laser solder based on aqua- albuminous dispersion of multi-walled carbon nanotubes was investigated. AFM topograms nanocomposite solder are mainly defined by the presence of pores in the samples. In generally, the surface structure of composite is influenced by the time, laser radiation power and MWCNT concentration. Average size of backbone nanoelements not exceeded 500 nm. Bulk density of nanoelements was in the range 106-108 sm-3. The data of welding temperature maintained during the laser welding process and the corresponding tensile strength values were obtained. Maximum tensile strength of the suture was reached in the range 50-55°C. This temperature and the pointwise laser welding technology (point area ~ 2.5mm) allows avoiding thermal necrosis of healthy section of biological tissue and provided reliable bonding construction of weld join. In despite of the fact that tensile strength values of the samples are in the range of 15% in comparison with unbroken strips of pigskin leather. This situation corresponds to the initial stage of the dissected tissue connection with a view to further increasing of the joint strength of tissues with the recovery of tissue structure; thereby achieved ratio is enough for a medical practice in certain cases.

  9. Evaluation of advanced microelectronic fluxless solder-bump contacts for hybrid microcircuits

    NASA Technical Reports Server (NTRS)

    Mandal, R. P.

    1976-01-01

    Technology for interconnecting monolithic integrated circuit chips with other components is investigated. The advantages and disadvantages of the current flip-chip approach as compared to other interconnection methods are outlined. A fluxless solder-bump contact technology is evaluated. Multiple solder-bump contacts were formed on silicon integrated circuit chips. The solder-bumps, comprised of a rigid nickel under layer and a compliant solder overlayer, were electroformed onto gold device pads with the aid of thick dry film photomasks. Different solder alloys and the use of conductive epoxy for bonding were explored. Fluxless solder-bump bond quality and reliability were evaluated by measuring the effects of centrifuge, thermal cycling, and high temperature storage on bond visual characteristics, bond electrical continuity, and bond shear tests. The applicability and suitability of this technology for hybrid microelectronic packaging is discussed.

  10. Effects of pre-stressing and flux on the flow of solder on PWB copper surfaces

    SciTech Connect

    Hernandez, C.L.; Hosking, F.M.

    1994-12-31

    A variety of test methods are available to evaluate the solderability of printed wiring board [PWB] surface finishes. A new test has been developed which better simulates the capillary flow physics of typical solder assembly processing, especially surface mount soldering. The work was conducted under a cooperative research and development agreement between Sandia National Laboratories, the National Center for Manufacturing Sciences, and several PWB fabricators (AT&T, IBM, Texas Instruments, and United Technologies Corporation/Hamilton Standard) to advance PWB interconnect systems technology. Particular attention has been given at Sandia to characterizing the effects of accelerated aging in a simulated indoor industrial environment on subsequent PWB solderability. The program`s baseline surface finish was copper. Solderability testing on ``as-fabricated`` and ``pre-stressed copper`` pad-strip geometries was performed with Sn-Pb eutectic solder and three different fluxes at four different reflow temperatures.

  11. Effects of simulated storage on the solder wettability of inhibited substrates

    SciTech Connect

    Hosking, F.M.; Sorensen, N.R.

    1992-01-01

    Solder wettability of Class II environmentally exposed Cu substrates coated with an organic solderability preservative (OSP) is being investigated. The OSP coatings slightly retarded the wetting behavior of 60Sn-40Pb solder during baseline testing of unaged coupons. A nominal increase in wetting angle, or decrease in wettability, was observed on the inhibited surfaces, particularly when less active fluxes were used. Small increases in the wetting time and decreases in the wetting rate were also measured. Simulated accelerated aging tests are underway to determine the effects of aging in a typical indoor industrial environment on the solder wettability of OSP coated Cu.

  12. Effects of simulated storage on the solder wettability of inhibited substrates

    SciTech Connect

    Hosking, F.M.; Sorensen, N.R.

    1992-12-01

    Solder wettability of Class II environmentally exposed Cu substrates coated with an organic solderability preservative (OSP) is being investigated. The OSP coatings slightly retarded the wetting behavior of 60Sn-40Pb solder during baseline testing of unaged coupons. A nominal increase in wetting angle, or decrease in wettability, was observed on the inhibited surfaces, particularly when less active fluxes were used. Small increases in the wetting time and decreases in the wetting rate were also measured. Simulated accelerated aging tests are underway to determine the effects of aging in a typical indoor industrial environment on the solder wettability of OSP coated Cu.

  13. High-power semiconductor laser array packaged on microchannel cooler using gold-tin soldering technology

    NASA Astrophysics Data System (ADS)

    Wang, Jingwei; Kang, Lijun; Zhang, Pu; Nie, Zhiqiang; Li, Xiaoning; Xiong, Lingling; Liu, Xingsheng

    2012-03-01

    High power semiconductor laser arrays have found increased applications in many fields. In this work, a hard soldering microchannel cooler (HSMCC) technology was developed for packaging high power diode laser array. Numerical simulations of the thermal behavior characteristics of hard solder and indium solder MCC-packaged diode lasers were conducted and analyzed. Based on the simulated results, a series of high power HSMCC packaged diode laser arrays were fabricated and characterized. The test and statistical results indicated that under the same output power the HSMCC packaged laser bar has lower smile and high reliability in comparison with the conventional copper MCC packaged laser bar using indium soldering technology.

  14. Laser tissue welding mediated with a protein solder

    SciTech Connect

    Small, W. IV; Heredia, N.J.; Celliers, P.M.

    1996-02-01

    A study of laser tissue welding mediated with an indocyanine green dye-enhanced protein solder was performed. Freshly obtained sections of porcine artery were used for the experiments. Sample arterial wall thickness ranged from two to three millimeters. Incisions approximately four millimeters in length were treated using an 805 nanometer continuous-wave diode laser coupled to a one millimeter diameter fiber. Controlled parameters included the power delivered by the laser, the duration of the welding process, and the concentration of dye in the solder. A two-color infrared detection system was constructed to monitor the surface temperatures achieved at the weld site. Burst pressure measurements were made to quantify the strengths of the welds immediately following completion of the welding procedure.

  15. Predicted ball grid array thermal response during reflow soldering

    SciTech Connect

    Voth, T.E.; Bergman, T.L.

    1995-12-31

    A numerical model is developed to predict the detailed thermomechanical response of a BGA assembly during reflow soldering. The governing coupled solid mechanics and heat diffusion equations are solved using a commercially available finite element package. Reported predictions illustrate the system`s sensitivity to both thermal and mechanical processing conditions, as well as component thermal properties. Specifically, assemblies with components of high thermal conductivity show the greatest sensitivity to mechanical loading conditions.

  16. Microstructures and Mechanical Properties of Sn-0.1Ag-0.7Cu-(Co, Ni, and Nd) Lead-Free Solders

    NASA Astrophysics Data System (ADS)

    Chen, Xu; Zhou, Jian; Xue, Feng; Bai, Jing; Yao, Yao

    2015-02-01

    The influences of minor alloying elements Co, Ni, and Nd on the microstructures and mechanical properties of Sn-0.1Ag-0.7Cu (SAC0107) solder were investigated. The results show that the microstructures of SAC0107 alloy mainly consisted of primary Sn-rich phases and eutectic phases composed of Ag3Sn and Cu6Sn5 phases dispersed in a Sn matrix. With Co or Ni additions, the amount of primary Sn-rich phase reduced and IMCs dispersed more uniformly in the Sn matrix. The elements of Co and Ni were concentrated in (Co x Cu1- x )6Sn5 and (Ni x Cu1- x )6Sn5 intermetallic compounds (IMCs), respectively, and they also entered the IMC layer between solder alloys and Cu substrate during soldering. Shear strength of the joints all increased by adding Co, Ni, and Nd elements. Different from the Co and Nd additions, the addition of the Ni element also markedly improved the tensile strength and elongation of SAC0107 alloys.

  17. Microstructure and In Situ Observations of Undercooling for Nucleation of [beta]-Sn Relevant to Lead-Free Solder Alloys

    SciTech Connect

    Elmer, John W.; Specht, Eliot D.; Kumar, Mukul

    2010-03-16

    Difficult nucleation of {beta}-Sn during solidification of tin and tin-based lead-free solder alloys can result in high degrees of undercooling of the liquid prior to solidification. The undercooling can produce solder joints with large grains, anisotropic behavior, and undesirable mechanical properties. This paper describes our examination of the amount of undercooling of tin on both graphite (non-wetting) and copper (wetting) surfaces using in situ x-ray diffraction. The microstructure was further characterized by optical microscopy, scanning electron microscopy, and electron backscattering diffraction imaging microscopy. Undercoolings as high as 61 C were observed for Sn solidified on graphite, while lower undercoolings, up to 30 C, were observed for Sn solidified on copper. The microstructure of the high purity Sn sample solidified on graphite showed very few grains in the cross-section, while the commercially pure Sn sample solidified with only one grain and was twinned. Tin solidified on copper contained significant amounts of copper in the tin, intermetallic phase formation at the interface, and a eutectic microstructure.

  18. Microstructure and in situ observation of undercooling for nucleation of b-Sn relevant to lead-free solder alloys

    SciTech Connect

    Elmer, J. W.; Specht, Eliot D; Kumar, Mukul

    2010-01-01

    Difficult nucleation of b-Sn during solidification of tin and tin-based lead-free solder alloys can result in high degrees of undercooling of the liquid prior to solidification. The undercooling can produce solder joints with large grains, anisotropic behavior, and undesirable mechanical properties. This paper describes our examination of the amount of undercooling of tin on both graphite (non-wetting) and copper (wetting) surfaces using in situ x-ray diffraction. The microstructure was further characterized by optical microscopy, scanning electron microscopy, and electron backscattering diffraction imaging microscopy. Undercoolings as high as 61C were observed for Sn solidified on graphite, while lower undercoolings, up to 30C, were observed for Sn solidified on copper. The microstructure of the high purity Sn sample solidified on graphite showed very few grains in the cross-section, while the commercially pure Sn sample solidified with only one grain and was twinned. Tin solidified on copper contained significant amounts of copper in the tin, intermetallic phase formation at the interface, and a eutectic microstructure.

  19. Thermally Conductive Metal-Tube/Carbon-Composite Joints

    NASA Technical Reports Server (NTRS)

    Copeland, Robert J.

    2004-01-01

    An improved method of fabricating joints between metal and carbon-fiber-based composite materials in lightweight radiators and heat sinks has been devised. Carbon-fiber-based composite materials have been used in such heat-transfer devices because they offer a combination of high thermal conductivity and low mass density. Metal tubes are typically used to carry heat-transfer fluids to and from such heat-transfer devices. The present fabrication method helps to ensure that the joints between the metal tubes and the composite-material parts in such heat-transfer devices have both (1) the relatively high thermal conductances needed for efficient transfer of heat and (2) the flexibility needed to accommodate differences among thermal expansions of dissimilar materials in operation over wide temperature ranges. Techniques used previously to join metal tubes with carbon-fiber-based composite parts have included press fitting and bonding with epoxy. Both of these prior techniques have been found to yield joints characterized by relatively high thermal resistances. The present method involves the use of a solder (63 percent Sn, 37 percent Pb) to form a highly thermally conductive joint between a metal tube and a carbon-fiber-based composite structure. Ordinarily, the large differences among the coefficients of thermal expansion of the metal tube, solder, and carbon-fiber-based composite would cause the solder to pull away from the composite upon post-fabrication cooldown from the molten state. In the present method, the structure of the solder is modified (see figure) to enable it to deform readily to accommodate the differential thermal expansion.

  20. Dural reconstruction by fascia using a temperature-controlled CO2 laser soldering system

    NASA Astrophysics Data System (ADS)

    Forer, Boaz; Vasilyev, Tamar; Brosh, Tamar; Kariv, Naam; Gil, Ziv; Fliss, Dan M.; Katzir, Abraham

    2005-04-01

    Conventional methods for dura repair are normally based on sutures or stitches. These methods have several disadvantages: (1) The dura is often brittle, and the standard procedures are difficult and time consuming. (2) The seal is leaky. (3) The introduction of a foreign body (e.g. sutures) may cause an inflammatory response. In order to overcome these difficulties we used a temperature controlled fiber optic based CO2 laser soldering system. In a set of in vitro experiments we generated a hole of diameter 10 mm in the dura of a pig corpse, covered the hole with a segment of fascia, and soldered the fascia to the edges of the hole, using 47% bovine albumin as a solder. The soldering was carried out spot by spot, and each spot was heated to 65° C for 3-6 seconds. The soldered dura was removed and the burst pressure of the soldered patch was measured. The average value for microscopic muscular side soldering was 194 mm Hg. This is much higher than the maximal physiological pressure of the CSF fluid in the brain, which is 15 mm Hg. In a set of in vivo experiments, fascia patches were soldered on holes in five farm pigs. The long term results of these experiments were very promising. In conclusion, we have developed an advanced technique for dural reconstruction, which will find important clinical applications.

  1. Tissue soldering with biodegradable polymer films: in-vitro investigation of hydration effects on weld strength

    NASA Astrophysics Data System (ADS)

    Sorg, Brian S.; Welch, Ashley J.

    2001-05-01

    Previous work demonstrated increased breaking strengths of tissue repaired with liquid albumin solder reinforced with a biodegradable polymer film compared to unreinforced control specimens. It was hypothesized that the breaking strength increase was due to reinforcement of the liquid solder cohesive strength. Immersion in a moist environment can decrease the adhesion of solder to tissue and negate any strength benefits gained from reinforcement. The purpose of this study was to determine if hydrated specimens repaired with reinforced solder would still be stronger than unreinforced controls. A 50%(w/v) bovine serum albumin solder with 0.5 mg/mL Indocyanine Green dye was used to repair an incision in bovine aorta. The solder was coagulated with 806-nm diode laser light. A poly(DL-lactic- co-glycolic acid) film was used to reinforce the solder (the controls had no reinforcement). The repaired tissues were immersed in phosphate buffered saline for time periods of 1 and 2 days. The breaking strengths of all of the hydrated specimens decreased compared to the acute breaking strengths. However, the reinforced specimens still had larger breaking strengths than the unreinforced controls. These results indicate that reinforcement of a liquid albumin solder may have the potential to improve the breaking strength in a clinical setting.

  2. Development of technique for laser welding of biological tissues using laser welding device and nanocomposite solder.

    PubMed

    Gerasimenko, A; Ichcitidze, L; Podgaetsky, V; Ryabkin, D; Pyankov, E; Saveliev, M; Selishchev, S

    2015-08-01

    The laser device for welding of biological tissues has been developed involving quality control and temperature stabilization of weld seam. Laser nanocomposite solder applied onto a wound to be weld has been used. Physicochemical properties of the nanocomposite solder have been elucidated. The nature of the tissue-organizing nanoscaffold has been analyzed at the site of biotissue welding. PMID:26738200

  3. Microstructural Evaluation and Comparison of Solder Samples Processed Aboard the International Space Station

    NASA Technical Reports Server (NTRS)

    Grugel, R. N.; Hua, F.; Anilkumar, A. V.

    2008-01-01

    Samples from the In-Space Soldering Investigation (ISSI), conducted aboard the International Space Station (ISS), are being examined for post-solidification microstructural development and porosity distribution. In this preliminary study, the internal structures of two ISSI processed samples are compared. In one case 10cm of rosin-core solder was wrapped around a coupon wire and melted by conduction, whereas, in the other a comparable length of solder was melted directly onto the hot wire; in both cases the molten solder formed ellipsoidal blobs, a shape that was maintained during subsequent solidification. In the former case, there is clear evidence of porosity throughout the sample, and an accumulation of larger pores near the hot end that implies thermocapillary induced migration and eventual coalescence of the flux vapor bubbles. In the second context, when solder was fed onto the wire. a part of the flux constituting the solder core is introduced into and remains within the liquid solder ball, becoming entombed upon solidification. In both cases the consequential porosity, particularly at a solder/contact interface, is very undesirable. In addition to compromising the desired electrical and thermal conductivity, it promotes mechanical failure.

  4. Method and apparatus for jetting, manufacturing and attaching uniform solder balls

    SciTech Connect

    Yost, Frederick G.; Frear, Darrel R.; Schmale, David T.

    1999-01-01

    An apparatus and process for jetting molten solder in the form of balls directly onto all the metallized interconnects lands for a ball grid array package in one step with no solder paste required. Molten solder is jetted out of a grid of holes using a piston attached to a piezoelectric crystal. When voltage is applied to the crystal it expands forcing the piston to extrude a desired volume of solder through holes in the aperture plate. When the voltage is decreased the piston reverses motion creating an instability in the molten solder at the aperture plate surface and thereby forming spherical solder balls that fall onto a metallized substrate. The molten solder balls land on the substrate and form a metallurgical bond with the metallized lands. The size of the solder balls is determined by a combination of the size of the holes in the aperture plate, the duration of the piston pulse, and the displacement of the piston. The layout of the balls is dictated by the location of the hooks in the grid. Changes in ball size and layout can be easily accomplished by changing the grid plate. This invention also allows simple preparation of uniform balls for subsequent supply to BGA users.

  5. Method and apparatus for jetting, manufacturing and attaching uniform solder balls

    DOEpatents

    Yost, F.G.; Frear, D.R.; Schmale, D.T.

    1999-01-05

    An apparatus and process are disclosed for jetting molten solder in the form of balls directly onto all the metallized interconnects lands for a ball grid array package in one step with no solder paste required. Molten solder is jetted out of a grid of holes using a piston attached to a piezoelectric crystal. When voltage is applied to the crystal it expands forcing the piston to extrude a desired volume of solder through holes in the aperture plate. When the voltage is decreased the piston reverses motion creating an instability in the molten solder at the aperture plate surface and thereby forming spherical solder balls that fall onto a metallized substrate. The molten solder balls land on the substrate and form a metallurgical bond with the metallized lands. The size of the solder balls is determined by a combination of the size of the holes in the aperture plate, the duration of the piston pulse, and the displacement of the piston. The layout of the balls is dictated by the location of the hooks in the grid. Changes in ball size and layout can be easily accomplished by changing the grid plate. This invention also allows simple preparation of uniform balls for subsequent supply to BGA users. 7 figs.

  6. New multicomponent solder alloys of low melting pointfor low-cost commercial electronic assembly

    NASA Astrophysics Data System (ADS)

    Al-Ganainy, G. S.; Sakr, M. S.

    2003-09-01

    The requirements of the telecommunications, automobile, electronics and aircraft industries for non-toxic solders with melting points close to that of near-eutectic Pb-Sn alloys has led to the development of new Sn-Zn-In solder alloys. Differential thermal analysis (DTA) shows melting points of 198, 195, 190 and 185 +/- 2 °C for the alloys Sn-9Zn, Sn-9Zn-2In, Sn-9Zn-4In and Sn-9Zn-6In, respectively. An equation that fits the data relating the melting point to the In content in the solders is derived. The X-ray diffraction patterns are analyzed to determine the phases that exist in each solder. The stress-strain curves are studied in the temperature range from 90 to 130 °C for all the solders except for those that contain 4 wt% of In, where the temperature range continues to 150 °C. The work-hardening parameters, y (the yield stress), f (the fracture stress), and the parabolic work-hardening coefficient X, increase with increasing indium content in the solders at all working temperatures. They decrease with increasing working temperature for each solder, and show two relaxation stages only for the Sn-9Zn-4In solder around a temperature of 120 °C. (

  7. 30 CFR 77.1111 - Welding, cutting, soldering; use of fire extinguisher.

    Code of Federal Regulations, 2011 CFR

    2011-07-01

    ... 30 Mineral Resources 1 2011-07-01 2011-07-01 false Welding, cutting, soldering; use of fire... OF UNDERGROUND COAL MINES Fire Protection § 77.1111 Welding, cutting, soldering; use of fire extinguisher. One portable fire extinguisher shall be provided at each location where welding, cutting,...

  8. 30 CFR 77.1111 - Welding, cutting, soldering; use of fire extinguisher.

    Code of Federal Regulations, 2012 CFR

    2012-07-01

    ... 30 Mineral Resources 1 2012-07-01 2012-07-01 false Welding, cutting, soldering; use of fire... OF UNDERGROUND COAL MINES Fire Protection § 77.1111 Welding, cutting, soldering; use of fire extinguisher. One portable fire extinguisher shall be provided at each location where welding, cutting,...

  9. 30 CFR 77.1111 - Welding, cutting, soldering; use of fire extinguisher.

    Code of Federal Regulations, 2010 CFR

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Welding, cutting, soldering; use of fire... OF UNDERGROUND COAL MINES Fire Protection § 77.1111 Welding, cutting, soldering; use of fire extinguisher. One portable fire extinguisher shall be provided at each location where welding, cutting,...

  10. 30 CFR 77.1111 - Welding, cutting, soldering; use of fire extinguisher.

    Code of Federal Regulations, 2014 CFR

    2014-07-01

    ... 30 Mineral Resources 1 2014-07-01 2014-07-01 false Welding, cutting, soldering; use of fire... OF UNDERGROUND COAL MINES Fire Protection § 77.1111 Welding, cutting, soldering; use of fire extinguisher. One portable fire extinguisher shall be provided at each location where welding, cutting,...

  11. 30 CFR 77.1111 - Welding, cutting, soldering; use of fire extinguisher.

    Code of Federal Regulations, 2013 CFR

    2013-07-01

    ... 30 Mineral Resources 1 2013-07-01 2013-07-01 false Welding, cutting, soldering; use of fire... OF UNDERGROUND COAL MINES Fire Protection § 77.1111 Welding, cutting, soldering; use of fire extinguisher. One portable fire extinguisher shall be provided at each location where welding, cutting,...

  12. The Resistance and Strength of Soft Solder Splices between Conductors in MICE Coils

    SciTech Connect

    Wu, Hong; Pan, Heng; Green, Michael A; Dietderich, Dan; Gartner, T. E.; Higley, Hugh C; Mentink, M.; Xu, FengYu; Trillaud, F.; Liu, X. K.; Wang, Li; Zheng, S. X.; Tam, D.G.

    2010-08-03

    Two of the three types of MICE magnets will have splices within their coils. The MICE coupling coils may have as many as fifteen one-meter long splices within them. Each of the MICE focusing coils may have a couple of 0.25-meter long conductor splices. Equations for the calculation of resistance of soldered lap splices of various types are presented. This paper presents resistance measurements of soldered lap splices of various lengths. Measured splice resistance is shown for one-meter long splices as a function of the fabrication method. Another important consideration is the strength of the splices. The measured breaking stress of splices of various lengths is presented in this paper. Tin-lead solders and tin-silver solders were used for the splices that were tested. From the data given in this report, the authors recommend that the use of lead free solders be avoided for low temperature coils.

  13. An analysis of the pull strength behaviors of fine-pitch, flip chip solder interconnections using a Au-Pt-Pd thick film conductor on Low-Temperature, Co-fired Ceramic (LTCC) substrates.

    SciTech Connect

    Uribe, Fernando R.; Kilgo, Alice C.; Grazier, John Mark; Vianco, Paul Thomas; Zender, Gary L.; Hlava, Paul Frank; Rejent, Jerome Andrew

    2008-09-01

    The assembly of the BDYE detector requires the attachment of sixteen silicon (Si) processor dice (eight on the top side; eight on the bottom side) onto a low-temperature, co-fired ceramic (LTCC) substrate using 63Sn-37Pb (wt.%, Sn-Pb) in a double-reflow soldering process (nitrogen). There are 132 solder joints per die. The bond pads were gold-platinum-palladium (71Au-26Pt-3Pd, wt.%) thick film layers fired onto the LTCC in a post-process sequence. The pull strength and failure modes provided the quality metrics for the Sn-Pb solder joints. Pull strengths were measured in both the as-fabricated condition and after exposure to thermal cycling (-55/125 C; 15 min hold times; 20 cycles). Extremely low pull strengths--referred to as the low pull strength phenomenon--were observed intermittently throughout the product build, resulting in added program costs, schedule delays, and a long-term reliability concern for the detector. There was no statistically significant correlation between the low pull strength phenomenon and (1) the LTCC 'sub-floor' lot; (2) grit blasting the LTCC surfaces prior to the post-process steps; (3) the post-process parameters; (4) the conductor pad height (thickness); (5) the dice soldering assembly sequence; or (5) the dice pull test sequence. Formation of an intermetallic compound (IMC)/LTCC interface caused by thick film consumption during either the soldering process or by solid-state IMC formation was not directly responsible for the low-strength phenomenon. Metallographic cross sections of solder joints from dice that exhibited the low pull strength behavior, revealed the presence of a reaction layer resulting from an interaction between Sn from the molten Sn-Pb and the glassy phase at the TKN/LTCC interface. The thick film porosity did not contribute, explicitly, to the occurrence of reaction layer. Rather, the process of printing the very thin conductor pads was too sensitive to minor thixotropic changes to ink, which resulted in

  14. Joining technologies for the 1990s: Welding, brazing, soldering, mechanical, explosive, solid-state, adhesive

    NASA Technical Reports Server (NTRS)

    Buckley, John D. (Editor); Stein, Bland A. (Editor)

    1986-01-01

    A compilation of papers presented in a joint NASA, American Society for Metals, The George Washington University, American Welding Society, and Society of Manufacturing Engineers Conference on Welding, Bonding, and Fastening at Langley Research Center, Hampton, VA, on October 23 to 25, 1984 is given. Papers were presented on technology developed in current research programs relevant to welding, bonding, and fastening of structural materials required in fabricating structures and mechanical systems used in the aerospace, hydrospace, and automotive industries. Topics covered in the conference included equipment, hardware and materials used when welding, brazing, and soldering, mechanical fastening, explosive welding, use of unique selected joining techniques, adhesives bonding, and nondestructive evaluation. A concept of the factory of the future was presented, followed by advanced welding techniques, automated equipment for welding, welding in a cryogenic atmosphere, blind fastening, stress corrosion resistant fasteners, fastening equipment, explosive welding of different configurations and materials, solid-state bonding, electron beam welding, new adhesives, effects of cryogenics on adhesives, and new techniques and equipment for adhesive bonding.

  15. Pb-free Sn-Ag-Cu ternary eutectic solder

    DOEpatents

    Anderson, Iver E.; Yost, Frederick G.; Smith, John F.; Miller, Chad M.; Terpstra, Robert L.

    1996-06-18

    A Pb-free solder includes a ternary eutectic composition consisting essentially of about 93.6 weight % Sn-about 4.7 weight % Ag-about 1.7 weight % Cu having a eutectic melting temperature of about 217.degree. C. and variants of the ternary composition wherein the relative concentrations of Sn, Ag, and Cu deviate from the ternary eutectic composition to provide a controlled melting temperature range (liquid-solid "mushy" zone) relative to the eutectic melting temperature (e.g. up to 15.degree. C. above the eutectic melting temperature).

  16. Pb-free Sn-Ag-Cu ternary eutectic solder

    DOEpatents

    Anderson, I.E.; Yost, F.G.; Smith, J.F.; Miller, C.M.; Terpstra, R.L.

    1996-06-18

    A Pb-free solder includes a ternary eutectic composition consisting essentially of about 93.6 weight % Sn-about 4.7 weight % Ag-about 1.7 weight % Cu having a eutectic melting temperature of about 217 C and variants of the ternary composition wherein the relative concentrations of Sn, Ag, and Cu deviate from the ternary eutectic composition to provide a controlled melting temperature range (liquid-solid ``mushy`` zone) relative to the eutectic melting temperature (e.g. up to 15 C above the eutectic melting temperature). 5 figs.

  17. Effect of reaction time and P content on mechanical strength of the interface formed between eutectic Sn-Ag solder and Au/electroless Ni(P)/Cu bond pad

    NASA Astrophysics Data System (ADS)

    Alam, M. O.; Chan, Y. C.; Tu, K. N.

    2003-09-01

    In this work, shear strengths of the solder joints for Sn-Ag eutectic alloy with the Au/electroless Ni(P)/Cu bond pad were measured for three different electroless Ni(P) layers. Sn-Ag eutectic solder alloy was kept in molten condition (240 °C) on the Au/electroless Ni(P)/Cu bond pad for different time periods ranging from 0.5 min to 180 min to render the ultimate interfacial reaction and the consecutive shear strength. After the shear test, fracture surfaces were investigated by scanning electron microscopy equipped with energy dispersed x ray. Cross-sectional studies of the interfaces were also conducted to correlate with the fracture surfaces. It was found that formation of crystalline phosphorous-rich Ni layer at the solder interface of Au/electroless Ni(P)/Cu bond pad with Sn-Ag eutectic alloy deteriorates the mechanical strength of the joints significantly. It was also noticed that such weak P-rich Ni layer appears quickly for high-P content electroless Ni(P) layer. However, when this P-rich Ni layer disappears from a prolonged reaction, the shear strength increases again.

  18. Simulation of Grain Growth in a Near-Eutectic Solder Alloy

    SciTech Connect

    TIKARE,VEENA; VIANCO,PAUL T.

    1999-12-16

    Microstructural evolution due to aging of solder alloys determines their long-term reliability as electrical, mechanical and thermal interconnects in electronics packages. The ability to accurately determine the reliability of existing electronic components as well as to predict the performance of proposed designs depends upon the development of reliable material models. A kinetic Monte Carlo simulation was used to simulate microstructural evolution in solder-class materials. The grain growth model simulated many of the microstructural features observed experimentally in 63Sn-37Pb, a popular near-eutectic solder alloy. The model was validated by comparing simulation results to new experimental data on coarsening of Sn-Pb solder. The computational and experimental grain growth exponent for two-phase solder was found to be much lower than that for normal, single phase grain growth. The grain size distributions of solders obtained from simulations were narrower than that of normal grain growth. It was found that the phase composition of solder is important in determining grain growth behavior.

  19. Enhanced laser tissue soldering using indocyanine green chromophore and gold nanoshells combination.

    PubMed

    Khosroshahi, Mohammad E; Nourbakhsh, Mohammad S

    2011-08-01

    Gold nanoshells (GNs) are new materials that have an optical response dictated by the plasmon resonance. The wavelength at which the resonance occurs depends on the core and shell sizes. The purposes of this study were to use the combination of indocyanine green (ICG) and different concentration of gold nanoshells for skin tissue soldering and also to examine the effect of laser soldering parameters on the properties of repaired skin. Two mixtures of albumin solder and different combinations of ICG and gold nanoshells were prepared. A full thickness incision of 2 × 20 mm(2) was made on the surface and after addition of mixtures it was irradiated by an 810 nm diode laser at different power densities. The changes of tensile strength (σ(t)) due to temperature rise, number of scan (Ns), and scan velocity (Vs) were investigated. The results showed at constant laser power density (I), σ(t) of repaired incisions increases by increasing the concentration of gold nanoshells in solder, Ns, and decreasing Vs. It was demonstrated that laser soldering using combination of ICG + GNs could be practical provided the optothermal properties of the tissue are carefully optimized. Also, the tensile strength of soldered skin is higher than skins that soldered with only ICG or GNs. In our case, this corresponds to σ(t) = 1800 g cm(-2) at I ∼ 47 Wcm(-2), T ∼ 85 [ordinal indicator, masculine]C, Ns = 10, and Vs = 0.3 mms(-1). PMID:21895342

  20. Temperature-controlled laser-soldering system and its clinical application for bonding skin incisions.

    PubMed

    Simhon, David; Gabay, Ilan; Shpolyansky, Gregory; Vasilyev, Tamar; Nur, Israel; Meidler, Roberto; Hatoum, Ossama Abu; Katzir, Abraham; Hashmonai, Moshe; Kopelman, Doron

    2015-01-01

    Laser tissue soldering is a method of repairing incisions. It involves the application of a biological solder to the approximated edges of the incision and heating it with a laser beam. A pilot clinical study was carried out on 10 patients who underwent laparoscopic cholecystectomy. Of the four abdominal incisions in each patient, two were sutured and two were laser soldered. Cicatrization, esthetical appearance, degree of pain, and pruritus in the incisions were examined on postoperative days 1, 7, and 30. The soldered wounds were watertight and healed well, with no discharge from these wounds or infection. The total closure time was equal in both methods, but the net soldering time was much shorter than suturing. There was no difference between the two types of wound closure with respect to the pain and pruritus on a follow-up of one month. Esthetically, the soldered incisions were estimated as good as the sutured ones. The present study confirmed that temperature-controlled laser soldering of human skin incisions is clinically feasible, and the results obtained were at least equivalent to those of standard suturing. PMID:26720882

  1. Temperature-controlled laser-soldering system and its clinical application for bonding skin incisions

    NASA Astrophysics Data System (ADS)

    Simhon, David; Gabay, Ilan; Shpolyansky, Gregory; Vasilyev, Tamar; Nur, Israel; Meidler, Roberto; Hatoum, Ossama Abu; Katzir, Abraham; Hashmonai, Moshe; Kopelman, Doron

    2015-12-01

    Laser tissue soldering is a method of repairing incisions. It involves the application of a biological solder to the approximated edges of the incision and heating it with a laser beam. A pilot clinical study was carried out on 10 patients who underwent laparoscopic cholecystectomy. Of the four abdominal incisions in each patient, two were sutured and two were laser soldered. Cicatrization, esthetical appearance, degree of pain, and pruritus in the incisions were examined on postoperative days 1, 7, and 30. The soldered wounds were watertight and healed well, with no discharge from these wounds or infection. The total closure time was equal in both methods, but the net soldering time was much shorter than suturing. There was no difference between the two types of wound closure with respect to the pain and pruritus on a follow-up of one month. Esthetically, the soldered incisions were estimated as good as the sutured ones. The present study confirmed that temperature-controlled laser soldering of human skin incisions is clinically feasible, and the results obtained were at least equivalent to those of standard suturing.

  2. Metallurgical characterization of experimental Ag-based soldering alloys

    PubMed Central

    Ntasi, Argyro; Al Jabbari, Youssef S.; Silikas, Nick; Al Taweel, Sara M.; Zinelis, Spiros

    2014-01-01

    Aim To characterize microstructure, hardness and thermal properties of experimental Ag-based soldering alloys for dental applications. Materials and methods Ag12Ga (AgGa) and Ag10Ga5Sn (AgGaSn) were fabricated by induction melting. Six samples were prepared for each alloy and microstructure, hardness and their melting range were determined by, scanning electron microscopy, energy dispersive X-ray (EDX) microanalysis, X-ray diffraction (XRD), Vickers hardness testing and differential scanning calorimetry (DSC). Results Both alloys demonstrated a gross dendritic microstructure while according to XRD results both materials consisted predominately of a Ag-rich face centered cubic phase The hardness of AgGa (61 ± 2) was statistically lower than that of AgGaSn (84 ± 2) while the alloys tested showed similar melting range of 627–762 °C for AgGa and 631–756 °C for AgGaSn. Conclusion The experimental alloys tested demonstrated similar microstructures and melting ranges. Ga and Sn might be used as alternative to Cu and Zn to modify the selected properties of Ag based soldering alloys. PMID:25382945

  3. A study of respiratory morbidity and pulmonary function among solderers in the electronics industry.

    PubMed

    Gupta, B N; Rastogi, S K; Husain, T; Mathur, N; Pangtey, B S

    1991-02-01

    Pulmonary function assessment of 197 solderers engaged in soldering printed circuit boards and other electronic components using lead-tin alloy impregnated solder in five major electronics workplaces in India was compared with the findings observed in 143 unexposed controls. Spirometry showed a significant impairment in the values of vital capacity (VC) and forced expiratory volume/forced vital capacity (FEV1/FVC) percent ratio in 47.2% of the solderers in comparison to 1.3% in the reference group (p less than 0.001). In the exposed group, female solderers particularly showed significantly higher (55.0%) prevalence of overall respiratory impairment in comparison to the 32.3% observed in their male counterparts (p less than 0.001). Bronchial obstruction was recorded in 7.6% of the solderers compared with 1.3% of the unexposed controls (p less than 0.01). The prevalence of restrictive and mixed ventilatory impairment was found to be 28.9 and 10.6%, respectively, among the exposed workers, while there was none among the control group. The solderers showed a predominantly restrictive pattern of pulmonary impairment that was mild in nature. Smoking caused no significant effect on the pulmonary impairment among the exposed workers. The study also did not show any significant differences in the prevalence of respiratory impairment between solderers exposed either less or more than 10 yr, thereby suggesting that there was no link between the respiratory impairment and duration of exposure. The industrial hygiene study conducted in the assembly section where soldering was done showed the mean concentration of lead to be 0.40 micrograms/m3 (range 0.12-0.43 micrograms/m3).(ABSTRACT TRUNCATED AT 250 WORDS)

  4. Research on defects inspection of solder balls based on eddy current pulsed thermography.

    PubMed

    Zhou, Xiuyun; Zhou, Jinlong; Tian, Guiyun; Wang, Yizhe

    2015-10-13

    In order to solve tiny defect detection for solder balls in high-density flip-chip, this paper proposed feasibility study on the effect of detectability as well as classification based on eddy current pulsed thermography (ECPT). Specifically, numerical analysis of 3D finite element inductive heat model is generated to investigate disturbance on the temperature field for different kind of defects such as cracks, voids, etc. The temperature variation between defective and non-defective solder balls is monitored for defects identification and classification. Finally, experimental study is carried on the diameter 1mm tiny solder balls by using ECPT and verify the efficacy of the technique.

  5. Research on defects inspection of solder balls based on eddy current pulsed thermography.

    PubMed

    Zhou, Xiuyun; Zhou, Jinlong; Tian, Guiyun; Wang, Yizhe

    2015-01-01

    In order to solve tiny defect detection for solder balls in high-density flip-chip, this paper proposed feasibility study on the effect of detectability as well as classification based on eddy current pulsed thermography (ECPT). Specifically, numerical analysis of 3D finite element inductive heat model is generated to investigate disturbance on the temperature field for different kind of defects such as cracks, voids, etc. The temperature variation between defective and non-defective solder balls is monitored for defects identification and classification. Finally, experimental study is carried on the diameter 1mm tiny solder balls by using ECPT and verify the efficacy of the technique. PMID:26473871

  6. Fluid Dynamics and Solidification of Molten Solder Droplets Impacting on a Substrate in Microgravity

    NASA Technical Reports Server (NTRS)

    Poulikakos, Dimos; Megaridis, Constantine M.; Vedha-Nayagam, M.

    1996-01-01

    This program investigates the fluid dynamics and simultaneous solidification of molten solder droplets impacting on a flat substrate. The problem of interest is directly relevant to the printing of microscopic solder droplets in surface mounting of microelectronic devices. The study consists of a theoretical and an experimental component. The theoretical work uses axisymmetric Navier-Stokes models based on finite element techniques. The experimental work is performed in microgravity to allow for the use of larger solder droplets that make feasible the performance of accurate measurements while maintaining similitude of the relevant fluid dynamics groups (Re, We) and keeping the effect of gravity negligible.

  7. Fluid Dynamics and Solidification of Molten Solder Droplets Impacting on a Substrate in Microgravity

    NASA Technical Reports Server (NTRS)

    Megardis, C. M.; Poulikakos, D.; Diversiev, G.; Boomsma, K.; Xiong, B.; Nayagam, V.

    1999-01-01

    This program investigates the fluid dynamics and simultaneous solidification of molten solder droplets impacting on a flat smooth substrate. The problem of interest is directly relevant to the printing of microscopic solder droplets in surface mounting of microelectronic devices. The study consists of a theoretical and an experimental component. The theoretical work uses axisymmetric Navier-Stokes models based on finite element techniques. The experimental work will be ultimately performed in microgravity in order to allow for the use of larger solder droplets which make feasible the performance of accurate measurements, while maintaining similitude of the relevant fluid dynamics groups (Re, We).

  8. Research on Defects Inspection of Solder Balls Based on Eddy Current Pulsed Thermography

    PubMed Central

    Zhou, Xiuyun; Zhou, Jinlong; Tian, Guiyun; Wang, Yizhe

    2015-01-01

    In order to solve tiny defect detection for solder balls in high-density flip-chip, this paper proposed feasibility study on the effect of detectability as well as classification based on eddy current pulsed thermography (ECPT). Specifically, numerical analysis of 3D finite element inductive heat model is generated to investigate disturbance on the temperature field for different kind of defects such as cracks, voids, etc. The temperature variation between defective and non-defective solder balls is monitored for defects identification and classification. Finally, experimental study is carried on the diameter 1mm tiny solder balls by using ECPT and verify the efficacy of the technique. PMID:26473871

  9. Potentiodynamic polarization effect on phase and microstructure of SAC305 solder in hydrochloric acid solution

    NASA Astrophysics Data System (ADS)

    Zaini, Nurwahida Binti Mohd; Nazeri, Muhammad Firdaus Bin Mohd

    2016-07-01

    The corrosion analysis of SAC305 lead free solder was investigated in Hydrochloric acid (HCl) solution. Potentiodynamic polarization was used to polarize the SAC305. The effect of polarization on the phase and microstructure were compared to as-prepared SAC305 solder. Potentiodynamic polarization introduces mixed corrosion products on the surface of SAC305 solder. The XRD analysis confirms that the mixed corrosion products emerged on the surface after polarization by formation of SnO and SnO2 of which confirmed that dissolution of Sn was dominant during polarization. Microstructure analysis reveal the presence of gap and porosities produced limits the protection offered by the passivation film.

  10. Sn-Ag-Cu to Cu joint current aging test and evolution of resistance and microstructure

    NASA Astrophysics Data System (ADS)

    Xu, Di Erick; Chow, Jasper; Mayer, Michael; Jung, Jae Pil; Yoon, Jong Hyun

    2015-11-01

    SAC 305 solder bump with 800 μm diameter were produced and soldered to a custom substrate with Cu lines as leads that allow for resistance measurement during current aging. The measured joint resistance values (leads plus solder bump) before aging are 7.7 ± 1.8 mΩ and 11.8 ± 2.8 mΩ at room temperature and 160°C, respectively. In general, the resistance of the solder joint increases instantly by about 1 mΩ, when subjected to a 2.2 A aging current at 160°C. The increase is gradual in the following hours of aging and more drastic as it approaches the final failure. Four stages are identified in the resistance signal curve and compared with observations from cross sections. The stages are IMC growth, crack formation and propagation, intermittent crack healing-forming, and final failure resulting in an open connection at the cathode. Recently a periodical drop and rise behavior was reported for the resistance signal. This behavior is reproduced and attributed to the intermittent crack healing-forming stage. The healing events observed are faster than the sampling time. Possibly, as current is concentrated when bypassing interfacial cracks, local melting occurs partially filling cracks before resolidifying. [Figure not available: see fulltext.

  11. VOLTAGE DISTRIBUTION AND MECHANICAL STRENGTH IN SPLICE JOINTS MADE FROM AS-MANUFACTURED YBCO COATED CONDUCTORS

    SciTech Connect

    Duckworth, Robert C; Zhang, Yifei; Gouge, Michael J; Rey, Christopher M; Van der Laan, Danko; Clickner, Cam

    2010-01-01

    With recommendations from wire manufacturers as a starting point, a series of solder joints were fabricated and characterized to determine the best method to produce repeatable, low-resistance and high-mechanical-strength splices in as-manufactured, stabilized YBCO coated conductors. From the 2.54 cm long splice joints that were fabricated, parameters such as solder material, stabilization material, fabrication method, and conductor geometry were varied to determine the impact of each on splice joint properties. Results indicate that the lowest resistance splice joints were influenced primarily by the tape orientation in the joint and the stabilization material. The lowest resistances were between 2 10-8 and 1.0 10-7 in 4-mm wide tapes and were obtained from pure copper stabilized tapes oriented with the YBCO layers in closest proximity. The voltage drop along the splice length indicated that only a fraction of the splice length contributes to the splice joint resistance. Mechanical characterization of splice joints showed that the joint resistance remained unchanged under axial stress up to a stress level at which the critical current of the tapes forming the joint degrades irreversibly.

  12. Mechanical and Physical Properties of In-Zn-Ga Lead-Free Solder Alloy for Low Energy Consumption

    NASA Astrophysics Data System (ADS)

    Ervina Efzan, M. N.; Nur Faziera, M. N.; Bakri Abdullah, Mohd Mustafa Al

    2016-06-01

    Due to the demand in the use of electronics devices in industry, the usage of solder connections has increased. Concerning with the toxicity of lead in Sn-37Pb solder alloy, developing lead free solder alloy with low melting temperature is one of the most important issues in electronic industry. Previously, researchers found out that the most promising candidate of lead free solder alloy is Sn-3.0Ag-0.5Cu (SAC). However, the melting temperature of this solder alloy is 217°C, 34°C higher than Sn-37Pb. This can lead to high energy consumption in electronic industry. In this paper, In-Zn-Ga solder alloy was investigated as a potential candidate replacing SAC. This study covers on the physical and mechanical properties of the solder alloy. Differential Scanning Calorimetry (DSC) testing shows that this solder alloy gave low melting temperature as low as 141.31°C. The addition of Ga in In-Zn solder alloy lowered the melting temperature compared to SAC and Sn-37Pb. From coefficient of thermal expansion (CTE) analysis, the In-Zn-Ga solder alloy gives good expansion properties and able to avoid the mismatch between the solder and copper substrates. The density of In-Zn-Ga solder alloy is 6.801g/cm3, lower than SAC and Sn-37Pb. For the strength, single lap shear testing was conducted on the In-Zn-Ga solder alloy and the results is near to the strength of SAC.

  13. Investigation of Dynamic Oxygen Adsorption in Molten Solder Jetting Technology

    NASA Technical Reports Server (NTRS)

    Megaridis, Constantine M.; Bellizia, Giulio; McNallan, Michael; Wallace, David B.

    2003-01-01

    Surface tension forces play a critical role in fluid dynamic phenomena that are important in materials processing. The surface tension of liquid metals has been shown to be very susceptible to small amounts of adsorbed oxygen. Consequently, the kinetics of oxygen adsorption can influence the capillary breakup of liquid-metal jets targeted for use in electronics assembly applications, where low-melting-point metals (such as tin-containing solders) are utilized as an attachment material for mounting of electronic components to substrates. By interpreting values of surface tension measured at various surface ages, adsorption and diffusion rates of oxygen on the surface of the melt can be estimated. This research program investigates the adsorption kinetics of oxygen on the surface of an atomizing molten-metal jet. A novel oscillating capillary jet method has been developed for the measurement of dynamic surface tension of liquids, and in particular, metal melts which are susceptible to rapid surface degradation caused by oxygen adsorption. The experimental technique captures the evolution of jet swells and necks continuously along the jet propagation axis and is used in conjunction with an existing linear, axisymmetric, constant-property model to determine the variation of the instability growth rate, and, in turn, surface tension of the liquid as a function of surface age measured from the exit orifice. The conditions investigated so far focus on a time window of 2-4ms from the jet orifice. The surface properties of the eutectic 63%Sn-37%Pb solder alloy have been investigated in terms of their variation due to O2 adsorption from a N2 atmosphere containing controlled amounts of oxygen (from 8 ppm to 1000 ppm). The method performed well for situations where the oxygen adsorption was low in that time window. The value of surface tension for the 63Sn-37Pb solder in pure nitrogen was found to be 0.49 N/m, in good agreement with previously published work. A characteristic

  14. Survey of New Jersey schools and day care centers for lead in plumbing solder. Identification of lead solder and prevention of exposure to drinking water contaminated with lead from plumbing solder.

    PubMed

    Berkowitz, M

    1995-10-01

    Levels of lead in drinking water can be high enough to pose a potential health threat to very young children, primarily from the use of lead solder for indoor plumbing. In February 1987, New Jersey banned lead solder for use in the installation or repair of drinking water plumbing systems. However, because lead solder continued to be available for purchase in the state, New Jersey Department of Health staff sought to (i) determine the extent to which schools and day care centers were in compliance with the ban, and (ii) determine the effectiveness of a solder analysis test kit commonly used by plumbing inspectors in the field. Samples of solder were collected from 53 day care centers and 37 schools known to have been constructed or renovated after the ban took effect. Samples from 24% of those facilities constructed or renovated just after the lead ban (1987-1988) tested positive for lead content. However, for those facilities constructed or renovated in later years (1989-1992), there was a decline in the percentage of samples that tested positive for lead content. For this period of time, 13% of the samples tested positive for lead. In total, more than 10% of facilities with new plumbing installed between 1987 and 1992 had solder samples that tested positive for lead. A lead in solder test kit commonly used by inspectors proved to be an effective screening tool for the field. The New Jersey Department of Health recommends continued enforcement of the lead solder ban through inspection and encouragement of behaviors that minimize consumption of potentially lead-contaminated drinking water. In order to assess patterns of water use, staff at the day care centers were asked to complete a questionnaire. Sixty-seven percent of the respondents reported that they "always" use water from the cold tap when preparing drinks or food for the children. In addition, 57% reported that they always first flush the tap before using the water for drinking or food purposes. Posters

  15. Long-Term Effects of Soldering By-Products on Nickel-Coated Copper Wire

    NASA Technical Reports Server (NTRS)

    Rolin, T. D.; Hodge, R. E.

    2008-01-01

    An analysis of thirty-year-old, down graded flight cables was conducted to determine the makeup of a green material on the surface of the shielded wire near soldered areas and to ascertain if the green material had corroded the nickel-coated copper wire. Two likely candidates were possible due to the handling and environments to which these cables were exposed. The flux used to solder the cables is known to contain abietic acid, a carboxylic acid found in many pine rosins used for the soldering process. The resulting material copper abietate is green in color and is formed during the application of heat during soldering operations. Copper (II) chloride, which is also green in color is known to contaminate flight parts and is corrosive. Data is presented that shows the material is copper abietate, not copper (II) chloride, and more importantly that the abietate does not aggressively attack nickel-plated copper wire.

  16. Effect of Fluxes on 60Sn-40Bi Solder Alloy on Copper Substrate

    NASA Astrophysics Data System (ADS)

    Ervina Efzan, M. N.; Ng, W. L.; Bakri Abdullah, Mohd Mustafa Al

    2016-06-01

    This paper investigated the effect of different types of fluxes on the wettability of a type of low temperature lead-free solder, 60Sn-40Bi alloy. The purpose of this paper is to investigate the effect of different types of fluxes on the wettability of 60Sn-40Bi solder (Tm : 138 -170 oC), so that the most compatible flux to be used with low temperature alloy can be determined.The results of this paper showed that the water soluble flux sample has the highest spread area and lowest contact angle. This meant that the solder has the highest wettability when water soluble flux is used, followed by RMA flux and low solids flux. Therefore, it was determined that water soluble flux is the most compatible to be used with the low temperature 60Sn-40Bi solder. The characteristic of this type of flux enables it to function well even at a low working temperature.

  17. Cleanliness tests with the Omega Meter: A comparative study for solder flux removal

    SciTech Connect

    Lopez, E.P.

    1987-12-01

    This paper reports on a dynamic conductivity test which indicates the effectiveness of solder flux removal. The Omega Meter, a device to measure residual ionic contaminants has been used to measure cleanliness as required by MIL-P-15110 and MIL-P-28809. The cleaning efficiency of seven solvents in removing three basic types of rosin solder fluxes after solder dipping has been evaluated. Results obtained indicate fairly good correlation with those obtained from radiochemical techniques and evaporative rate analysis using the Meseran Surface Analyzer. In this study, using vapor degreasing as the method of cleaning, isopropyl alcohol, trichloroethylene, and 1,1,1 trichloroethane (stabilized) respectively were the best single solvents identified in the removal of types R, RMA, and RA rosin solder fluxes. 3 refs., 6 figs., 3 tabs.

  18. STS-57 Pilot Duffy uses TDS soldering tool in SPACEHAB-01 aboard OV-105

    NASA Technical Reports Server (NTRS)

    1993-01-01

    STS-57 Pilot Brian J. Duffy, at a SPACEHAB-01 (Commercial Middeck Augmentation Module (CMAM)) work bench, handles a soldering tool onboard the Earth-orbiting Endeavour, Orbiter Vehicle (OV) 105. Duffy is conducting a soldering experiment (SE) which is part of the Tools and Diagnostic Systems (TDS) project. He is soldering on a printed circuit board, positioned in a specially designed holder, containing 45 connection points and will later de-solder 35 points on a similar board. TDS' sponsor is the Flight Crew Support Division, Space and Life Sciences Directorate, JSC. It represents a group of equipment selected from tools and diagnostic hardware to be supported by the Space Station program. TDS was designed to demonstrate the maintenance of experiment hardware on-orbit and to evaluate the adequacy of its design and the crew interface.

  19. Effect of grain orientation on mechanical properties and thermomechanical response of Sn-based solder interconnects

    SciTech Connect

    Chen, Hongtao; Yan, Bingbing; Yang, Ming; Ma, Xin; Li, Mingyu

    2013-11-15

    The thermomechanical response of Sn-based solder interconnects with differently oriented grains was investigated by electron backscattered diffraction technique under thermal cycling and thermal shock testing in this study. The results showed that deformation and cracking of solder interconnects have a close relationship with the unique characteristics of grain orientation and boundaries in each solder interconnect, and deformation was frequently confined within the high-angle grain boundaries. The micro Vickers hardness testing results showed that the hardness varied significantly depending on the grain orientation and structure, and deformation twins can be induced around the indents by the indentation testing. - Highlights: • Thermomechanical response shows a close relationship with the grain structure. • Deformation was frequently confined within the high-angle grain boundaries. • Different grain orientations exhibit different hardness. • Deformation twins can be induced around the indents in SAC105 solder interconnects.

  20. Soldered Contact and Current Risetime Effects on Negative Polarity Wire Array Z-pinches

    SciTech Connect

    Chalenski, D. A.; Kusse, B. R.; Greenly, J. B.; Blesener, I. C.; McBride, R. D.; Hammer, D. A.; Knapp, P. F.

    2009-01-21

    The Cornell University COBRA pulser is a nominal 1 MA machine, capable of driving up to 32 wire cylindrical Z-pinch arrays. COBRA can operate with variable current risetimes ranging from 100 ns to 200 ns (short and long pulse, respectively). Wires are typically strung with a 'press' contact to the electrode hardware, where the wire is loosely pulled against the hardware and held there to establish electrical contact. The machine is normally negative, but a bolt-on convolute can be used to modify the current path and effectively produce positive polarity operation at the load.Previous research with single wires on a 1-5 kA pulser has shown that soldering the wire, thereby improving the wire/electrode contact, and operating in positive polarity can improve the energy deposition into the wire and enhance wire core expansion. Negative polarity showed no difference. Previous experiments on the negative polarity, 20 MA, 100 ns Z accelerator have shown that improving the contact improved the x-ray yield.Cornell data were collected on 16-wire Aluminum Z-pinch arrays in negative polarity. Experiments were conducted with both short and long current pulses with soldered and no-soldered wire/electrode contacts. The initiation, ablation, implosion and stagnation phases were compared for these four conditions. Time dependent x-ray signals were measured using diodes and diamond detectors. An inductive voltage monitor was used to infer minimum current radius achieved, as defined by a uniform shell of current moving radially inward, producing a time dependent inductance. Total energy data were collected with a metal-strip bolometer. Self-emission data were collected by an XUV 4-frame camera and an optical streak camera.In negative polarity and with short pulses, soldering appeared to produce a smaller radius pinch and decrease variations in the x-ray pulse shape. The bolometer, laser backlighter, 4-frame and streak cameras showed negligible differences in the initiation ablation

  1. Object-oriented graphical tool for automated laser soldering

    NASA Astrophysics Data System (ADS)

    Fidan, Ismail

    1995-10-01

    Object-oriented interfaces (OOIs) have become an important component of automation activity. Object-oriented software techniques have provided some hope to cope with the complexity of modern software development tasks. Object orientation is expressed by many researchers as an important direction in designing and implementing software in the 1990s and beyond. In today's electronics industry, there are several different types of interfaces used for different pieces of manufacturing equipment. It is now possible to create a general, OOI for most manufacturing equipment that is easy to use, easy to learn how to use, and easy to modify. Such an interface can benefit the user in terms of savings in time and money. The laser soldering interface, designed and implemented in the Center for Integrated Electronics and Electronics Manufacturing (CIEEM) at Rensselaer, is one of the 'flexible' user interfaces described above. This paper describes the object-oriented graphical tool (OOGT) development and its final structure.

  2. Ionic cleaning after wave solder and before conformal coat

    NASA Astrophysics Data System (ADS)

    Nguygen, Tochau N.; Sutherland, Thomas H.

    An account is given of efforts made by a military electronics manufacturer to upgrade product reliability in response to the printed writing board (PWB) ionic cleanliness requirements recently set out in MIL-P-28809 Rev. A. These requirements had to be met both after wave soldering, involving the immediate removal of ionically active RA flux, and immediately before conformal coating, in order to remove the less active RMA flux and bonding contaminants. Attention is given to the results of a test program which compared the effectiveness with which five different solvents and two (batch and conveyorized vapor degreasing) cleaning methods cleaned representative PWBs containing many components. Alcohol-containing fluorocarbon blends were adequate, but the most densely packed PWBs required a supplemental water rinse.

  3. Development of motion control method for laser soldering process

    SciTech Connect

    Yerganian, S.S.

    1997-05-01

    Development of a method to generate the motion control data for sealing an electronic housing using laser soldering is described. The motion required to move the housing under the laser is a nonstandard application and was performed with a four-axis system using the timed data streaming mode capabilities of a Compumotor AT6400 indexer. A Microsoft Excel 5.0 spreadsheet (named Israuto.xls) was created to calculate the movement of the part under the laser, and macros were written into the spreadsheet to allow the user to easily create this data. A data verification method was developed for simulating the motion data. The geometry of the assembly was generated using Parametric Technology Corporation Pro/E version 15. This geometry was then converted using Pro/DADS version 3.1 from Computer Aided Design Software Inc. (CADSI), and the simulation was carried out using DADS version 8.0 from CADSI.

  4. Tin-silver-bismuth solders for electronics assembly

    DOEpatents

    Vianco, Paul T.; Rejent, Jerome A.

    1995-01-01

    A lead-free solder alloy for electronic assemblies composed of a eutectic alloy of tin and silver with a bismuth addition, x, of 0

  5. Tin-silver-bismuth solders for electronics assembly

    DOEpatents

    Vianco, P.T.; Rejent, J.A.

    1995-08-08

    A lead-free solder alloy is disclosed for electronic assemblies composed of a eutectic alloy of tin and silver with a bismuth addition, x, of 0

  6. Silicon solar cells with nickel/solder metallization

    NASA Technical Reports Server (NTRS)

    Petersen, R. C.; Muleo, A.

    1981-01-01

    The use of nickel plus solder is shown to be feasible for contact metallization for silicon solar cells by offering a relatively inexpensive method of making electrical contact with the cell surfaces. Nickel is plated on silicon solar cells using an electroless chemical deposition method to give contacts with good adhesion, and in some cases where adhesion is poor initially, sintering under relatively mild conditions will dramatically improve the quality of the bond without harming the p-n junction of the cell. The cells can survive terrestrial environment stresses, which is demonstrated by a 1000 hour test at 85 C and 85% relative humidity under constant forward bias of 0.45 volt.

  7. Packaging of hard solder 500W QCW diode laser array

    NASA Astrophysics Data System (ADS)

    Li, Xiaoning; Wang, Jingwei; Hou, Dong; Nie, Zhiqiang; Liu, Xingsheng

    2016-03-01

    The package structure critically influences the major characteristics of diode laser, such as thermal behavior, output power, wavelength and smile effect. In this work, a novel micro channel cooler (MCC) for stack array laser with good heat dissipation capability and high reliability is presented. Numerical simulations of thermal management with different MCC structure are conducted and analyzed. Based on this new MCC packaging structure, a series of QCW 500W high power laser arrays with hard solder packaging technology has been fabricated. The performances of the laser arrays are characterized. A narrow spectrum of 3.12 nm and an excellent smile value are obtained. The lifetime of the laser array is more than 1.38×109 shots and still ongoing.

  8. Nanoconstruction by welding individual metallic nanowires together using nanoscale solder

    NASA Astrophysics Data System (ADS)

    Peng, Y.; Cullis, A. G.; Inkson, B. J.

    2010-07-01

    This work presents a new bottom-up nanowelding technique enabling building blocks to be assembled and welded together into complex 3D nanostructures using nanovolumes of metal solder. The building blocks of gold nanowires, (Co72Pt28/Pt)n multilayer nanowires, and nanosolder Sn99Au1 alloy nanowires were successfully fabricated by a template technique. Individual metallic nanowires were picked up and assembled together. Conductive nanocircuits were then welded together using similar or dissimilar nanosolder material. At the weld sites, nanoscale volumes of a chosen metal are deposited using nanosolder of a sacrificial nanowire, which ensures that the nanoobjects to be bonded retain their structural integrity. The whole nanowelding process is clean, controllable and reliable, and ensures both mechanically strong and electrically conductive contacts.

  9. The Pd2Si - /Pd/ - Ni - solder plated metallization system for silicon solar cells

    NASA Technical Reports Server (NTRS)

    Coleman, M. G.; Pryor, R. A.; Sparks, T. G.

    1978-01-01

    The rationale and application of a plated metal system, Pd2Si Pd - Ni - solder, is presented. This metallization system is particularly useful on shallow p-n junction solar cells. The advantages of such plated solar cell contacts are discussed. A process sequence for applying the metallization system is outlined. A specific example is presented, including chemical plating solution formulations and detailed process step descriptions. Electrical test data for solar cells metallized with the palladium-nickel-solder system are provided.

  10. Evaluation of low-residue soldering for military and commercial applications: A report from the Low-Residue Soldering Task Force

    SciTech Connect

    Iman, R.L.; Anderson, D.J.; Burress, R.V.

    1995-06-01

    The LRSTF combined the efforts of industry, military, and government to evaluate low-residue soldering processes for military and commercial applications. These processes were selected for evaluation because they provide a means for the military to support the presidential mandate while producing reliable hardware at a lower cost. This report presents the complete details and results of a testing program conducted by the LRSTF to evaluate low-residue soldering for printed wiring assemblies. A previous informal document provided details of the test plan used in this evaluation. Many of the details of that test plan are contained in this report. The test data are too massive to include in this report, however, these data are available on disk as Excel spreadsheets upon request. The main purpose of low-residue soldering is to eliminate waste streams during the manufacturing process.

  11. Characterization of Nitinol Laser-Weld Joints by Nondestructive Testing

    NASA Astrophysics Data System (ADS)

    Wohlschlögel, Markus; Gläßel, Gunter; Sanchez, Daniela; Schüßler, Andreas; Dillenz, Alexander; Saal, David; Mayr, Peter

    2015-12-01

    Joining technology is an integral part of today's Nitinol medical device manufacturing. Besides crimping and riveting, laser welding is often applied to join components made from Nitinol to Nitinol, as well as Nitinol components to dissimilar materials. Other Nitinol joining techniques include adhesive bonding, soldering, and brazing. Typically, the performance of joints is assessed by destructive mechanical testing, on a process validation base. In this study, a nondestructive testing method—photothermal radiometry—is applied to characterize small Nitinol laser-weld joints used to connect two wire ends via a sleeve. Two different wire diameters are investigated. Effective joint connection cross sections are visualized using metallography techniques. Results of the nondestructive testing are correlated to data from destructive torsion testing, where the maximum torque at fracture is evaluated for the same joints and criteria for the differentiation of good and poor laser-welding quality by nondestructive testing are established.

  12. A model for designing functionally gradient material joints

    SciTech Connect

    Messler, R.W. Jr.; Jou, M.; Orling, T.T.

    1995-05-01

    An analytical, thin-plate layer model was developed to assist research and development engineers in the design of functionally gradient material (FGM) joints consisting of discrete steps between end elements of dissimilar materials. Such joints have long been produced by diffusion bonding using intermediates or multiple interlayers; welding, brazing or soldering using multiple transition pieces; and glass-to-glass or glass-to-metal bonding using multiple layers to produce matched seals. More recently, FGM joints produced by self-propagating high-temperature synthesis (SHS) are attracting the attention of researchers. The model calculates temperature distributions and associated thermally induced stresses, assuming elastic behavior, for any number of layers of any thickness or composition, accounting for critically important thermophysical properties in each layer as functions of temperature. It is useful for assuring that cured-in fabrication stresses from thermal expansion mismatches will not prevent quality joint production. The model`s utility is demonstrated with general design cases.

  13. Numerical and experimental study of residual stresses and thermal fatigue in soldered electronic assemblies

    NASA Astrophysics Data System (ADS)

    Bourcier, R. J.; Stephens, J. J.

    The assembly examined consists of thin plates of alumina, Kovar, 410 stainless steel and 6061 aluminum bonded together using layers of three different solder alloys: 63% Sn - 37% Pb, 50% Pb - 50% In and 40% In - 40% Sn - 20% Pb. Numerical simulation of the fabrication process was performed using a simplified axisymmetric finite element microcell model of the actual assembly. The alumina, Kovar, 410 stainless steel and 6061 aluminum layers were modeled as temperature-dependent elastic-plastic materials while the solder alloys were treated as creeping solids following solidification. Experimental testing of the solder alloys was used to generate input for the finite element code constitutive models. The numerical results of this study have provided guidelines for the successful fabrication of the subject assembly. In particular, slower cooling rates following solidification of the solders have been shown to dramatically lower bending stresses generated in the alumina plate. The experimental portion of the program has provided data on the degration of solder bond integrity used to thermal cycling and has identified possible important factors in the mechanical response of thin solder layers.

  14. Preliminary Study on Synthesis of Organolead Halide with Lead Derived from Solder Wire

    NASA Astrophysics Data System (ADS)

    Pratiwi, P.; Rahmi, G. N.; Aimon, A. H.; Iskandar, F.; Abdullah, M.; Nuryadin, B. W.

    2016-08-01

    Organolead halide has attracted great attention for application in perovskite solar cells due to its high power conversion efficiency (PCE) of up to 20.1%. One of the most common perovskite materials is lead based reagent. In this research, we have synthesized organolead halide with lead extracted from solder wire. In the preparation procedure, first PbCl2 and PbI2 are produced by reacting lead from the solder wire with NaCl and KI, which are used as the basic substance for the perovskite material. Then, in order to get perovskite solution, the powders are reacted with methylamine iodide (MAI) in dimethylformamide (DMF) using a solution based method. Further, the spin coating method is used to fabricate perovskite thin film. The XRD peak results agreed with JCPDS Powder Diffraction of PbCl2 and PbI2. Based on FTIR, the transmittance spectra of the organolead mixed halide that was prepared using solder wire lead exhibited absorption peaks identical to organolead mixed halide using commercial lead. The UV-Vis absorbance spectra of the organolead mixed halide from solder wire lead also exhibited the same absorption ability as from commercial lead. Morever, EDS measurement showed that the element composition of the perovskite thin film using lead from solder wire identical to that from commercial lead. This indicates that solder wire lead is suitable enough for organolead halide material synthesis.

  15. Computational modeling of on-demand solder delivery for fluxless MCM packaging applications

    SciTech Connect

    Essien, M.; Sackinger, P.A.; Peebles, H.C.

    1996-10-01

    The development of smaller circuit volumes in microelectronic applications, particularly Multichip Module (MCM) technology, entails deposition of minute quantities of solder, with volumes on the order of nanoliters. We propose a system for fluxless solder deposition which uses on-demand solder jetting for deposition of 200 micrometer diameter solder droplets onto aluminum pads. This work details the computational modeling performed to provide design parameters for a magneto-hydrodynamic solder jetter (MHD). A dimensionless analysis was used to relate the fluid properties, the orifice length and width, and the droplet size to the amplitude and duration of the pressure pulse. These results were used as the initial inputs for the fluid dynamics model, and subsequent iterations were performed to determine the operational parameters that lead to the formation of stable, single droplets. Results show that a maximum pulse amplitude on the order of 0.5 Mdynes/cm[sup 2] is necessary to dispense molten solder from a 200 micrometer diameter orifice. The size of the droplet was found to vary linearly with the applied pressure pulse. The duration of the pulse ranged from approximately 0.6 to 0.9 milliseconds. A theoretical description of the relationship between the orifice diameter, surface tension, and `Pinch-off` time is given, and is in agreement with the results of the computational model.

  16. Description of a solder pulse generator for the single step formation of ball grid arrays

    SciTech Connect

    Schmale, D.T.; Frear, D.R.; Yost, F.G.; Essien, M.

    1997-02-01

    The traditional geometry for surface mount devices is the peripheral array where the leads are on the edges of the device. As the technology drives towards high input/output (I/O) count (increasing number of leads) and smaller packages with finer pitch (less distance between peripheral leads), limitations on peripheral surface mount devices arise. The leads on these fine pitch devices are fragile and can be easily bent. It becomes increasingly difficult to deliver solder past to leads spaced as little as 0.012 inch apart. Too much solder mass can result in bridging between leads while too little solder can contribute to the loss of mechanical and electrical continuity. A solution is to shift the leads from the periphery of the device to the area under the device. This scheme is called areal array packaging and is exemplified by the ball grid array (BGA) package. A system has been designed and constructed to deposit an entire array of several hundred uniform solder droplets onto a printed circuit board in a fraction of a second. The solder droplets wet to the interconnect lands on a pc board and forms a basis for later application of a BGA device. The system consists of a piezoelectric solder pulse unit, heater controls, an inert gas chamber and an analog power supply/pulse unit.

  17. Development of high strength Sn-Mg solder alloys with reasonable ductility

    NASA Astrophysics Data System (ADS)

    Alam, Md Ershadul; Gupta, Manoj

    2013-09-01

    This study discussed the development of a series of new lead-free Sn-Mg solders by incorporating varying amounts of Mg (0.8, 1.5 and 2.5 wt. %) into pure Sn using disintegrated melt deposition technique followed by room temperature extrusion. All extruded Sn and Sn-Mg solder samples were characterized. Microstructural characterization studies revealed equiaxed grain morphology, minimal porosity and relatively uniform distribution of secondary phase. Better coefficient of thermal expansion was observed for Sn-2.5Mg sample when compared to conventional Sn-37Pb solder. Melting temperature of Sn-1.5Mg was found to be 212°C which is much lower than the conventional Sn-Ag-Cu or Sn-Cu (227°C) solders. Microhardness was increased with increasing amount of Mg in pure Sn. Room temperature tensile test results revealed that newly developed Sn-Mg solders exhibit enhanced strengths (0.2% yield strength and ultimate tensile strength) with comparable (if not better) ductility when compared to other commercially available and widely used Sn-based solder alloys.

  18. Nucleation and Growth of Cu-Al Intermetallics in Al-Modified Sn-Cu and Sn-Ag-Cu Lead-Free Solder Alloys

    NASA Astrophysics Data System (ADS)

    Reeve, Kathlene N.; Anderson, Iver E.; Handwerker, Carol A.

    2015-03-01

    Lead-free solder alloys Sn-Cu (SC) and Sn-Ag-Cu (SAC) are widely used by the microelectronics industry, but enhanced control of the microstructure is needed to improve solder performance. For such control, nucleation and stability of Cu-Al intermetallic compound (IMC) solidification catalysts were investigated by variation of the Cu (0.7-3.0 wt.%) and Al (0.0-0.4 wt.%) content of SC + Al and SAC + Al alloys, and of SAC + Al ball-grid array (BGA) solder joints. All of the Al-modified alloys produced Cu-Al IMC particles with different morphologies and phases (occasionally non-equilibrium phases). A trend of increasing Cu-Al IMC volume fraction with increasing Al content was established. Because of solidification of non-equilibrium phases in wire alloy structures, differential scanning calorimetry (DSC) experiments revealed delayed, non-equilibrium melting at high temperatures related to quenched-in Cu-Al phases; a final liquidus of 960-1200°C was recorded. During cooling from 1200°C, the DSC samples had the solidification behavior expected from thermodynamic equilibrium calculations. Solidification of the ternary alloys commenced with formation of ternary β and Cu-Al δ phases at 450-550°C; this was followed by β-Sn, and, finally, Cu6Sn5 and Cu-Al γ1. Because of the presence of the retained, high-temperature phases in the alloys, particle size and volume fraction of the room temperature Cu-Al IMC phases were observed to increase when the alloy casting temperature was reduced from 1200°C to 800°C, even though both temperatures are above the calculated liquidus temperature of the alloys. Preliminary electron backscatter diffraction results seemed to show Sn grain refinement in the SAC + Al BGA alloy.

  19. Joint Disorders

    MedlinePlus

    A joint is where two or more bones come together, like the knee, hip, elbow, or shoulder. Joints can be damaged by many types of injuries or diseases, including Arthritis - inflammation of a joint. It causes pain, stiffness, and swelling. Over time, ...

  20. The relevancy of current environmental issues to solder joints in microelectronic applications

    SciTech Connect

    Walitsky, P.J. ); Yost, F.G. )

    1991-01-01

    The technical issues brought about by recent federal mandates are reviewed and discussed. Progress made in the elimination of CFCs is briefly reviewed. The problems, implications, and status of pending anti-lead legislation and taxation are discussed at length. Recommendations are made for the enactment of rational, fair, and orderly legislation and taxation.

  1. The relevancy of current environmental issues to solder joints in microelectronic applications

    SciTech Connect

    Walitsky, P.J.; Yost, F.G.

    1991-12-31

    The technical issues brought about by recent federal mandates are reviewed and discussed. Progress made in the elimination of CFCs is briefly reviewed. The problems, implications, and status of pending anti-lead legislation and taxation are discussed at length. Recommendations are made for the enactment of rational, fair, and orderly legislation and taxation.

  2. Some Oobservations of the Role of Component Size in Solder Joint Degradation under Thermal Cycling Environments

    NASA Technical Reports Server (NTRS)

    Winslow, J.; Wen, L-C.

    1995-01-01

    Experimental results will be presented from a continuing investigation into the influence of component size and configuration of thermal cycling lifetimes, observed in a set of quadpak electronic component packages.

  3. The Interplay of Surface Mount Solder Joint Quality and Reliability of Low Volume SMAs

    NASA Technical Reports Server (NTRS)

    Ghaffarian, R.

    1997-01-01

    Spacecraft electronics including those used at the Jet Propulsion Laboratory (JPL), demand production of highly reliable assemblies. JPL has recently completed an extensive study, funded by NASA's code Q, of the interplay between manufacturing defects and reliability of ball grid array (BGA) and surface mount electronic components.

  4. Laser solder repair technique for nerve anastomosis: temperatures required for optimal tensile strength

    NASA Astrophysics Data System (ADS)

    McNally-Heintzelman, Karen M.; Dawes, Judith M.; Lauto, Antonio; Parker, Anthony E.; Owen, Earl R.; Piper, James A.

    1998-01-01

    Laser-assisted repair of nerves is often unsatisfactory and has a high failure rate. Two disadvantages of laser assisted procedures are low initial strength of the resulting anastomosis and thermal damage of tissue by laser heating. Temporary or permanent stay sutures are used and fluid solders have been proposed to increase the strength of the repair. These techniques, however, have their own disadvantages including foreign body reaction and difficulty of application. To address these problems solid protein solder strips have been developed for use in conjunction with a diode laser for nerve anastomosis. The protein helps to supplement the bond, especially in the acute healing phase up to five days post- operative. Indocyanine green dye is added to the protein solder to absorb a laser wavelength (approximately 800 nm) that is poorly absorbed by water and other bodily tissues. This reduces the collateral thermal damage typically associated with other laser techniques. An investigation of the feasibility of the laser-solder repair technique in terms of required laser irradiance, tensile strength of the repair, and solder and tissue temperature is reported here. The tensile strength of repaired nerves rose steadily with laser irradiance reaching a maximum of 105 plus or minus 10 N.cm-2 at 12.7 W.cm-2. When higher laser irradiances were used the tensile strength of the resulting bonds dropped. Histopathological analysis of the laser- soldered nerves, conducted immediately after surgery, showed the solder to have adhered well to the perineurial membrane, with minimal damage to the inner axons of the nerve. The maximum temperature reached at the solder surface and at the solder/nerve interface, measured using a non-contact fiber optic radiometer and thermocouple respectively, also rose steadily with laser irradiance. At 12.7 W.cm-2, the temperatures reached at the surface and at the interface were 85 plus or minus 4 and 68 plus or minus 4 degrees Celsius respectively

  5. Evaluating the Impact of Dwell Time on Solder Interconnect Durability Under Bending Loads

    NASA Astrophysics Data System (ADS)

    Menon, Sandeep; Osterman, Michael; Pecht, Michael

    2015-11-01

    With the increasing portability and miniaturization of modern-day electronics, the mechanical robustness of these systems has become more of a concern. Existing standards for conducting mechanical durability tests of electronic assemblies include bend, shock/drop, vibration, and torsion. Although these standards provide insights into both cyclic fatigue and overstress damage incurred in solder interconnects (widely regarded as the primary mode of failure in electronic assemblies), they fail to address the impact of time- dependent (creep) behavior due to sustained mechanical loads on solder interconnect durability. It has been seen in previous studies that solder durability under thermal cycling loads is inversely proportional to the dwell time or hold time at either temperature extreme of the imposed temperature cycle. Fatigue life models, which include dwell time, have been developed for solder interconnects subject to temperature cycling. However, the fatigue life models that have been developed in the literature for solder interconnects under mechanical loads fail to address the influence of the duration of loading. In this study, solder interconnect test vehicles were subjected to cyclic mechanical bending with various dwell times in order to understand the impact of the duration of mechanical loads on solder interconnect durability. The solder interconnects examined in this study were formed with 2512 resistor packages using various solder compositions [tin-lead (Sn-Pb) and 96.5Sn-3Ag-0.5Cu (SAC305)]. To evaluate the impact of dwell time, the boards were tested with 0 s, 60 s, and 300 s of dwell time at both extremes of the loading profile. It was observed that an increase in the dwell time of the loading profile resulted in a decrease in the characteristic life of the solder interconnects. The decrease in fatigue life was attributed to increased creep damage as identified using finite-element simulations. An energy partitioning approach was then used to

  6. Capacitor Test, Evaluation. and Modeling Within NASA Electronic Parts and Packaging (NEPP) Program. "Why Ceramic Capacitors Fracture During Manual Soldering and How to Avoid Failures"

    NASA Technical Reports Server (NTRS)

    Teverovsky, Alexander

    2011-01-01

    Presentation discusses: (1) Why Multi-Layer Ceramic Capacitors(MLCCs) crack during manual soldering? Workmanship and parts issues. (2) Do existing qualification requirements assure crack-free soldering? MIL-spec Thermal Shock (TS) testing. MIL-spec Resistance to Soldering Heat (RSH) test. (3) What test can assure reliable soldering? Mechanical characteristics of ceramics. Comparison of three TS techniques: LND, TSD, and IWT. (4) Simulation of TS conditions.

  7. Transport phenomena in picoliter size solder droplet dispension on a composite substrate

    SciTech Connect

    Waldvogel, J.M.; Poulikakos, D.; Wallace, D.B.; Marusak, R.E.

    1995-12-31

    This paper presents a study of the presolidification fluid dynamics and heat transfer phenomena occurring during the impingement of a picoliter size liquid solder droplet upon a multi-layer, composite substrate. The theoretical model, based on the Lagrangian formulation, is solved numerically with the finite element method. A deforming mesh is utilized to accurately simulate the large deformations, as well as the domain nonuniformities characteristic of the spreading process. The occurrence of droplet recoiling and mass accumulation around the deposit periphery (which yields doughnut-shaped solder bumps) are standout features of the numerical simulations and yield a nonmonotonic dependence of the maximum radius on time. The results also document the transient temperature fields developing in both the solder droplet and the substrate during the impingement process. Convection effects on the temperature field development in a deforming droplet are found to be important for the entire history of spreading. These effects are demonstrated by the two-dimensional features of the temperature field in the droplet. The work is directly applicable to the miniature solder droplet dispension technology for the mounting of microscopic electronic components on various substrates under development at MicroFab Inc. The results of the numerical simulations are compared to solidified microscopic solder bumps obtained at MicroFab Inc.

  8. Effect of Preconditioning and Soldering on Failures of Chip Tantalum Capacitors

    NASA Technical Reports Server (NTRS)

    Teverovsky, Alexander A.

    2014-01-01

    Soldering of molded case tantalum capacitors can result in damage to Ta205 dielectric and first turn-on failures due to thermo-mechanical stresses caused by CTE mismatch between materials used in the capacitors. It is also known that presence of moisture might cause damage to plastic cases due to the pop-corning effect. However, there are only scarce literature data on the effect of moisture content on the probability of post-soldering electrical failures. In this work, that is based on a case history, different groups of similar types of CWR tantalum capacitors from two lots were prepared for soldering by bake, moisture saturation, and longterm storage at room conditions. Results of the testing showed that both factors: initial quality of the lot, and preconditioning affect the probability of failures. Baking before soldering was shown to be effective to prevent failures even in lots susceptible to pop-corning damage. Mechanism of failures is discussed and recommendations for pre-soldering bake are suggested based on analysis of moisture characteristics of materials used in the capacitors' design.

  9. Damage Produced in Solder Alloys during Thermal Cycling

    NASA Astrophysics Data System (ADS)

    Liu, X. W.; Plumbridge, W. J.

    2007-09-01

    The anisotropy of tin is associated with significant variations in its coefficient of thermal expansion and elastic modulus, with crystallographic direction. Under pure thermal cycling (with no externally applied stress or strain), substantial strains, in excess of 100%, may develop locally, and for very small structures, such as soldered interconnections comprising a few grains, structural integrity may be adversely affected. To examine this possibility, freestanding samples of tin, Sn-3.5wt.%Ag, Sn-0.5wt.%Cu, and Sn-3.8wt.%Ag-0.7wt.%Cu, have been subjected to thermal cycling. Temperature cycles from 30°C to 125°C or from -40°C to 55°C initially caused surface cracking, with openings up to several tens of microns after 3,000 cycles. Subsequently, the surface cracks grew into the interior of the specimens, with the maximum penetration ranging from a few microns after 100 cycles to more than 200 μm after 3,000 cycles. The cracks initiated from damage accumulated along grain boundaries. For the same temperature range, less damage resulted after the lower maximum (or mean) temperature cycle, and there appears to be a thermally activated component of cracking. The microstructure produced by rapid cooling (water quenching) was slightly more resistant than that formed by air, or furnace, cooling. Apart from microstructural coarsening, no damage accrues from isothermal exposure alone.

  10. Chemical wiring and soldering toward all-molecule electronic circuitry.

    PubMed

    Okawa, Yuji; Mandal, Swapan K; Hu, Chunping; Tateyama, Yoshitaka; Goedecker, Stefan; Tsukamoto, Shigeru; Hasegawa, Tsuyoshi; Gimzewski, James K; Aono, Masakazu

    2011-06-01

    Key to single-molecule electronics is connecting functional molecules to each other using conductive nanowires. This involves two issues: how to create conductive nanowires at designated positions, and how to ensure chemical bonding between the nanowires and functional molecules. Here, we present a novel method that solves both issues. Relevant functional molecules are placed on a self-assembled monolayer of diacetylene compound. A probe tip of a scanning tunneling microscope is then positioned on the molecular row of the diacetylene compound to which the functional molecule is adsorbed, and a conductive polydiacetylene nanowire is fabricated by initiating chain polymerization by stimulation with the tip. Since the front edge of chain polymerization necessarily has a reactive chemical species, the created polymer nanowire forms chemical bonding with an encountered molecular element. We name this spontaneous reaction "chemical soldering". First-principles theoretical calculations are used to investigate the structures and electronic properties of the connection. We demonstrate that two conductive polymer nanowires are connected to a single phthalocyanine molecule. A resonant tunneling diode formed by this method is discussed. PMID:21548552

  11. Ceramic joints

    DOEpatents

    Miller, Bradley J.; Patten, Jr., Donald O.

    1991-01-01

    Butt joints between materials having different coefficients of thermal expansion are prepared having a reduced probability of failure of stress facture. This is accomplished by narrowing/tapering the material having the lower coefficient of thermal expansion in a direction away from the joint interface and not joining the narrow-tapered surface to the material having the higher coefficient of thermal expansion.

  12. Massive spalling of intermetallic compounds in solder-substrate reactions due to limited supply of the active element

    SciTech Connect

    Yang, S. C.; Ho, C. E.; Chang, C. W.; Kao, C. R.

    2007-04-15

    Massive spalling of intermetallic compounds has been reported in the literature for several solder/substrate systems, including SnAgCu soldered on Ni substrate, SnZn on Cu, high-Pb PbSn on Cu, and high-Pb PbSn on Ni. In this work, a unified thermodynamic argument is proposed to explain this rather unusual phenomenon. According to this argument, two necessary conditions must be met. The number one condition is that at least one of the reactive constituents of the solder must be present in a limited amount, and the second condition is that the soldering reaction has to be very sensitive to its concentration. With the growth of intermetallic, more and more atoms of this constituent are extracted out of the solder and incorporated into the intermetallic. As the concentration of this constituent decreases, the original intermetallic at the interface becomes a nonequilibrium phase, and the spalling of the original intermetallic occurs.

  13. Universal solders for direct and powerful bonding on semiconductors, diamond, and optical materials

    NASA Astrophysics Data System (ADS)

    Mavoori, Hareesh; Ramirez, Ainissa G.; Jin, Sungho

    2001-05-01

    The surfaces of electronic and optical materials such as nitrides, carbides, oxides, sulfides, fluorides, selenides, diamond, silicon, and GaAs are known to be very difficult to bond with low melting point solders (<300 °C). We have achieved a direct and powerful bonding on these surfaces by using low temperature solders doped with rare-earth elements. The rare earth is stored in micron-scale, finely-dispersed intermetallic islands (Sn3Lu or Au4Lu), and when released, causes chemical reactions at the interface producing strong bonds. These solders directly bond to semiconductor surfaces and provide ohmic contacts. They can be useful for providing direct electrical contacts and interconnects in a variety of electronic assemblies, dimensionally stable and reliable bonding in optical fiber, laser, or thermal management assemblies.

  14. Pb-free surface-finishing on electronic components' terminals for Pb-free soldering assembly

    SciTech Connect

    Tanaka, Hitoshi; Tanimoto, Morimasa; Matsuda, Akira; Uno, Takeo; Kurihara, Masaaki; Shiga, Shoji

    1999-11-01

    Pb-free solderable surface finishing is essential to implement Pb-free solder assembly in order to meet with the growing demand of environmental consciousness to eliminate Pb from electronic products. Two types of widely applicable Pb-free surface finishing technologies are developed. One is the multilayer-system including Pd with Ni undercoat. Heat-resistance of Pd enables whole-surface-plating on to leadframe before IC-assembling process. The other is the double-layer-system with low-melting-point-materials, for example, thicker Sn underlayer and thinner Sn-Bi alloy overlayer, dilutes Sn-Bi alloy's defects of harmful reactivity along with substrate metal and mechanical brittleness with keeping its advantages of solder-wettability and no whisker.

  15. Design of Experiments to Determine Causes of Flex Cable Solder Wicking, Discoloration and Hole Location Defects

    SciTech Connect

    Wolfe, Larry

    2009-04-22

    Design of Experiments (DoE) were developed and performed in an effort to discover and resolve the causes of three different manufacturing issues; large panel voids after Hot Air Solder Leveling (HASL), cable hole locations out of tolerance after lamination and delamination/solder wicking around flat flex cable circuit lands after HASL. Results from a first DoE indicated large panel voids could be eliminated by removing the pre-HASL cleaning. It also revealed eliminating the pre-HASL bake would not be detrimental when using a hard press pad lamination stackup. A second DoE indicated a reduction in hard press pad stackup lamination pressure reduced panel stretch in the y axis approximately 70%. A third DoE illustrated increasing the pre-HASL bake temperature could reduce delamination/solder wicking when using a soft press pad lamination stackup.

  16. High-precision optomechanical lens system for space applications assembled by a local soldering technique

    NASA Astrophysics Data System (ADS)

    Pleguezuelo, Pol Ribes; Koechlin, Charlie; Hornaff, Marcel; Kamm, Andreas; Beckert, Erik; Fiault, Guillaume; Eberhardt, Ramona; Tünnermann, Andreas

    2016-06-01

    Soldering using metallic solder alloys is an alternative to adhesive bonding. Laser-based soldering processes are especially well suited for the joining of optical components made of fragile and brittle materials such as glass, ceramics, and optical crystals. This is due to a localized and minimized input of thermal energy. Solderjet bumping technology has been used to assemble a lens mount breadboard using specifications and requirements found for the optical beam expander for the European Space Agency EarthCare Mission. The silica lens and a titanium barrel have been designed and assembled with this technology in order to withstand the stringent mission demands of handling high mechanical and thermal loads without losing the optical performance. Finally, a high-precision optomechanical lens mount has been assembled with minimal localized stress (<1 MPa) showing outstanding performance in terms of wave-front error and beam depolarization ratio before and after environmental tests.

  17. Temporomandibular Joint, Closed

    MedlinePlus

    ... Oral Health > The Temporomandibular Joint, Closed The Temporomandibular Joint, Closed Main Content Title: The Temporomandibular Joint, Closed Description: The temporomandibular joint connects the lower ...

  18. Laparoscopic Mesh Fixation Using Laser-Assisted Tissue Soldering in a Porcine Model

    PubMed Central

    Soltz, Barbara A.; Stadler, Istvan; Soltz, Robert

    2009-01-01

    Background and Objective: Animal studies using open surgical models indicate that collagen solder is capable of fixation of surgical meshes without interfering with tissue integration, increasing adhesions, or increasing inflammation intraperitoneally. This study describes development of instrumentation and techniques for laparoscopic herniorrhaphy using laser-assisted soldering technology. Study Design and Methods: Anesthetized 20 kg to 25 kg female Yorkshire pigs underwent laparoscopy with a 3-trocar technique. Parietex TET, Parietex TEC, and Prolene mesh segments (5 × 5 cm) were embedded in 55% collagen solder. Segments were inserted by using a specially designed introducer and affixed to the peritoneum by using prototype laser devices (1.45 µ, 4.5 W continuous wave, 5-mm spot, 55° C set temperature) and a custom laparoscopic handpiece (IPOM). Parietex PCO mesh was inserted and affixed using the Endo-hernia stapler (Control). Animals were recovered and underwent second-look laparoscopy at 6 weeks. Mesh sites were harvested after animals were euthanized. Results: The mesh-solder constructs were easily inserted and affixed in an IPOM approach. Prolene mesh tended to curl at its edges as the solder was melted. Postoperative healing was similar to that in Control segments in all cases. Discussion and Conclusion: Collagen-based tissue soldering permits normal wound healing and may mitigate or reduce the use of staples or other foreign bodies for laparoscopic mesh fixation, prevent tissue ischemia and possibly nerve entrapment, which result in severe postoperative pain and morbidity. Laser-assisted mesh fixation is a promising alternative for laparoscopic herniorrhaphy. Further development of this strategy is warranted. PMID:19793465

  19. Haemostatic effects of laser tissue solder as a reinforcement to anastomoses with PTFE grafts

    NASA Astrophysics Data System (ADS)

    Birch, Jeremy F.; Seifalian, Alexander M.; Bell, Peter R.

    2003-06-01

    Laser activated tissue solders have been used for sutureless anastomosis in various contexts. Solders were initially developed in response to the finding that the use of lasers alone caused vessel damage resulting in aneurysm formation and medical damage. Many reports exist of the use of lasers to perform micro-anastomoses, but little has been reported on the use of laser tissue solder in the formation of medium sized vessel anastomoses or in vivo. This group has recently developed a methylene blue based albumin solder for use in vascular anastomoses. The early work concentrated on a rabbit carotid end-to-end model. More recently this has progressed into its application in medium sized vessels. The use of PTFE is common in clinical practice particularly relating to peripheral vascular reconstruction or vascular access surgery. In these instances conventional surgical techniques applied to PTFE will result in excessive bleeding at the site of the anastomosis. Suture materials commonly used such as polypropylene or polyamide leave holes in such prostheses. To compound the problem patients are often anticoagulated or suffer impaired platelet function, improving the chances of graft survival, but increasing bleeding time, the time required to achieve haemostasis and also the post operative complications related to bleeding such as haematoma formation. It was therefore intended to apply the techniques of soldered vascular anastomoses to such a scenario, by reinforcing the anastomotic suture line of grafts placed in an animal model, with MB based solder. The bleeding times, overall operating times and postoperative complications were then analyzed and compared to sutured controls.

  20. Suppressing tin whisker growth in lead-free solders and platings

    DOEpatents

    Hoffman, Elizabeth N; Lam, Poh-Sang

    2014-04-29

    A process of irradiation Sn containing Pb-free solder to mitigate whisker formation and growth thereon is provided. The use of gamma radiation such as cobalt-60 has been applied to a substrate of Sn on copper has been found to change the morphology of the crystalline whisker growth to a more truncated hillock pattern. The change in morphology greatly reduces the tendency of whiskers to contribute to electrical short-circuits being used as a Pb-free solder system on a copper substrate.