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Sample records for circuit board pcb

  1. PVC-based composite material containing recycled non-metallic printed circuit board (PCB) powders.

    PubMed

    Wang, Xinjie; Guo, Yuwen; Liu, Jingyang; Qiao, Qi; Liang, Jijun

    2010-12-01

    The study is directed to the use of non-metallic powders obtained from comminuted recycled paper-based printed circuit boards (PCBs) as an additive to polyvinyl chloride (PVC) substrate. The physical properties of the non-metallic PCB (NMPCB) powders were measured, and the morphological, mechanical and thermal properties of the NMPCB/PVC composite material were investigated. The results show that recycled NMPCB powders, when added below a threshold, tended to increase the tensile strength and bending strength of PVC. When 20 wt% NMPCB powders (relative to the substrate PVC) of an average diameter of 0.08 mm were added, the composite tensile strength and bending strength reached 22.6 MPa and 39.83 MPa, respectively, representing 107.2% and 123.1% improvement over pure PVC. The elongation at break of the composite material reached 151.94% of that of pure PVC, while the Vicat softening temperature of the composite material did not increase significantly compared to the pure PVC. The above results suggest that paper-based NMPCB powders, when used at appropriate amounts, can be effective for toughening PVC. Thus, this study suggests a new route for reusing paper-based NMPCB, which may have a significant beneficial environmental impact.

  2. Vertical waveguide structure optical printed circuit board based on a low-dielectric and transparent PCB materials

    NASA Astrophysics Data System (ADS)

    Hwang, Sung Hwan; Lee, Woo-Jin; An, Jong Bae; Kim, Gye Won; Kim, Myoung Jin; Jung, Eun Joo; Kim, Young Ho; Jung, Ki Young; Sohn, Ik-Bu; Rho, Byung Sup

    2015-02-01

    This paper suggests an optical printed circuit board (OPCB) having new optical coupling structures, including a laser-drilled and under-filled structure (LD-UFS) and a vertical waveguide structure (VWS). The suggested OPCB has the features of high-speed data transmission as well as highly efficient optical coupling because it was fabricated with low-dielectric and transparent electrical PCB materials through a PCB compatible process. To evaluate and compare the optical and electrical performances of the suggested OPCB with those of other OPCBs, the various types of OPCBs were fabricated and measured. The optical coupling losses of the LD-UFS and the VWS were measured with excellent results of 9.8 and 7.8 dB, respectively, which are lower than that of the basic structure. The electrical 3-dB bandwidth of the OPCB was also evaluated up to more than 40 GHz.

  3. Investigation of multilayer printed circuit board (PCB) film warpage using viscoelastic properties measured by a vibration test

    NASA Astrophysics Data System (ADS)

    Joo, Sung-Jun; Park, Buhm; Kim, Do-Hyoung; Kwak, Dong-Ok; Song, In-Sang; Park, Junhong; Kim, Hak-Sung

    2015-03-01

    Woven glass fabric/BT (bismaleimide triazine) composite laminate (BT core), copper (Cu), and photoimageable solder resist (PSR) are the most widely used materials for semiconductors in electronic devices. Among these materials, BT core and PSR contain polymeric materials that exhibit viscoelastic behavior. For this reason, these materials are considered to have time- and temperature-dependent moduli during warpage analysis. However, the thin geometry of multilayer printed circuit board (PCB) film makes it difficult to identify viscoelastic characteristics. In this work, a vibration test method was proposed for measuring the viscoelastic properties of a multilayer PCB film at different temperatures. The beam-shaped specimens, composed of a BT core, Cu laminated on a BT core, and PSR and Cu laminated on a BT core, were used in the vibration test. The frequency-dependent variation of the complex bending stiffness was determined using a transfer function method. The storage modulus (E‧) of the BT core, Cu, and PSR as a function of temperature and frequency were obtained, and their temperature-dependent variation was identified. The obtained properties were fitted using a viscoelastic model for the BT core and the PSR, and a linear elastic model for the Cu. Warpage of a line pattern specimen due to temperature variation was measured using a shadow Moiré analysis and compared to predictions using a finite element model. The results provide information on the mechanism of warpage, especially warpage due to temperature-dependent variation in viscoelastic properties.

  4. Disassembly and physical separation of electric/electronic components layered in printed circuit boards (PCB).

    PubMed

    Lee, Jaeryeong; Kim, Youngjin; Lee, Jae-chun

    2012-11-30

    Although printed circuit boards (PCBs) contain various elements, only the major elements (i.e., those with content levels in wt% or over grade) of and precious metals (e.g., Ag, Au, and platinum groups) contained within PCBs can be recycled. To recover other elements from PCBs, the PCBs should be properly disassembled as the first step of the recycling process. The recovery of these other elements would be beneficial for efforts to conserve scarce resources, reuse electric/electronic components (EECs), and eliminate environmental problems. This paper examines the disassembly of EECs from wasted PCBs (WPCBs) and the physical separation of these EECs using a self-designed disassembling apparatus and a 3-step separation process of sieving, magnetic separation, and dense medium separation. The disassembling efficiencies were evaluated by using the ratio of grinding area (E(area)) and the weight ratio of the detached EECs (E(weight)). In the disassembly treatment, these efficiencies were improved with an increase of grinder speed and grinder height. 97.7% (E(area)) and 98% (E(weight)) could be accomplished ultimately by 3 repetitive treatments at a grinder speed of 5500 rpm and a grinder height of 1.5mm. Through a series of physical separations, most groups of the EECs (except for the diode, transistor, and IC chip groups) could be sorted at a relatively high separation efficiency of about 75% or more. To evaluate the separation efficiency with regard to the elemental composition, the distribution ratio (R(dis)) and the concentration ratio (R(conc)) were used. 15 elements could be separated with the highest R(dis) and R(conc) in the same separated division. This result implies that the recyclability of the elements is highly feasible, even though the initial content in EECs is lower than several tens of mg/kg.

  5. Bi-directional homogenization equivalent modeling for the prediction of thermo-mechanical properties of a multi-layered printed circuit board (PCB)

    NASA Astrophysics Data System (ADS)

    Joo, Sung-Jun; Park, Buhm; Kim, Do-Hyoung; Kwak, Dong-Ok; Park, Junhong; Kim, Hak-Sung

    2016-04-01

    Warpage of multi-layered printed circuit boards (PCB) during the reflow process is a serious problem which affects the reliability of solder ball connections between the PCB and the mounted semi-conductor packages in electronic devices. It is essential to predict the warpage of the PCB accurately; however, the complicated copper patterns in multi-layered PCBs render a full modeling analysis impossible due to the excessive computing time required. To overcome this problem, we have developed analytical equations of three Cu patterns (line, square, and grid) for the application of thermo-mechanical properties simply by equivalent modeling of Cu patterns. In the proposed equations, the effect of thermo-viscoelastic properties as well as the influence of surrounding layers such as woven glass fabric/BT (bismaleimide triazine), composite laminate (BT core), and photoimageable solder resist (PSR) were considered. To verify the developed equations, vibration tests based on the wave propagation approach were performed at various temperatures. Good agreement was observed between the equivalent model and the experimental results.

  6. Document Template for Printed Circuit Board Layout

    SciTech Connect

    Anderson, J.T.; /Fermilab

    1998-01-01

    The purpose of this document is to list the information that may be required to properly specify a printed circuit board (PCB) design. You must provide sufficient information to the PCB layout vendor such that they can quote accurately and design the PCB that you need. Use the following information as a guide to write your specification. Include as much of it as is necessary to get the PCB design that you want.

  7. Fabrication and integration of micro/nano-scale optical wire circuit arrays and devices for high-speed and compact optical printed circuit board (O-PCB) and VLSI photonic applications

    NASA Astrophysics Data System (ADS)

    Lee, El-Hang; Lee, S. G.; O, B. H.; Park, S. G.; Kim, K. H.; Kang, J. K.; Choi, Y. W.; Song, S. H.

    2005-09-01

    We report on the design, fabrication and integration of micro/nano-scale optical wire circuit arrays and devices for high-speed, compact, light-weight, low power optical printed circuit boards (O-PCBs) and VLSI photonic applications. The optical wires are formed in the form of waveguides by thermal embossing and ultraviolet (UV) radiated embossing of polymer materials. The photonic devices include vertically coupled surface emitting laser (VCSEL) microlasers, microlenses, 45-degree reflection couplers, directional couplers, arrayed waveguide grating structures, multimode interference (MMI) devices and photodetectors. These devices are optically interconnected and integrated for O-PCB assembly and VLSI micro/nano-photonics. The O-PCBs are to perform the functions of transporting, switching, routing and distributing optical signals on flat modular boards or substrates. We report on the result of the optical transmission performances of these assembled O-PCBs. For the design, fabrication, and VLSI integration of nano-scale photonic devices, we used photonic crystal structures and plasmonic metallic waveguide structures. We examined the bandwidth, power dissipation, thermal stability, weight, and the miniaturization and density of optical wires and the O-PCB module. Characteristics of these devices are also described.

  8. Printed circuit board industry.

    PubMed

    LaDou, Joseph

    2006-05-01

    The printed circuit board is the platform upon which microelectronic components such as semiconductor chips and capacitors are mounted. It provides the electrical interconnections between components and is found in virtually all electronics products. Once considered low technology, the printed circuit board is evolving into a high-technology product. Printed circuit board manufacturing is highly complicated, requiring large equipment investments and over 50 process steps. Many of the high-speed, miniaturized printed circuit boards are now manufactured in cleanrooms with the same health and safety problems posed by other microelectronics manufacturing. Asia produces three-fourths of the world's printed circuit boards. In Asian countries, glycol ethers are the major solvents used in the printed circuit board industry. Large quantities of hazardous chemicals such as formaldehyde, dimethylformamide, and lead are used by the printed circuit board industry. For decades, chemically intensive and often sloppy manufacturing processes exposed tens of thousands of workers to a large number of chemicals that are now known to be reproductive toxicants and carcinogens. The printed circuit board industry has exposed workers to high doses of toxic metals, solvents, acids, and photolithographic chemicals. Only recently has there been any serious effort to diminish the quantity of lead distributed worldwide by the printed circuit board industry. Billions of electronics products have been discarded in every region of the world. This paper summarizes recent regulatory and enforcement efforts. PMID:16580876

  9. Training Circuit Boards

    NASA Technical Reports Server (NTRS)

    1986-01-01

    Young Electronics Company's new product is a testboard developed by the Jet Propulsion Laboratory as a tool for training and qualifying personnel in board assembly and in the art of soldering components without damaging boards or components. The boards are used for pre- employment testing and employee requalification.

  10. Sliding contacts on printed circuit boards and wear behavior

    NASA Astrophysics Data System (ADS)

    Le Solleu, J.-P.

    2010-04-01

    Automotive suppliers use since decades printed circuit boards (PCB) gold plating pads, as direct contact interface for low current sliding contacts. Several gold plating processes are available on the market, providing various wear behaviour. Some specific galvanic hard gold (AuCo or AuNi). plating was developed on PCB's. This specific plating generates extra costs due to the material quantity and also the process complexity. In a cost driven industry, the challenge is to use a standard low cost PCB for systems requesting high reliability performances. After a brief overview of standard PCB manufacturing processes and especially gold plating processes, the global experimental results of wear behaviour of three different gold plating technologies will be exposed and an explanation of the correlation between surface key parameters and wear out will be provided.

  11. Materials for printed circuit boards: Past usage and future prospects

    SciTech Connect

    Lee Hong Ng; Field, F.R. III )

    1989-01-01

    This paper examines current materials utilization patterns in a major electronic materials market, printed circuit board (PCB) materials. As demands on PCB materials become more stringent, the use of high performance materials will increase. However, development of better materials is no guarantee of market success. New materials must offer an attractive price/performance combination to PCB users. A methodology to assess the competitive position of new PCB materials by combining manufacturing cost models with operations research techniques has been developed and applied to the PCB materials market. The methodology is illustrated using case studies drawn from the computers and communication industries. Results indicate that the computer industry favors high glass transition temperature materials, such as polymide and bismaleimide triazine, while the telecommunications market prefers epoxy glass for its low cost. Among the new materials targeted at high performance applications in the PCB market, cyanate ester (CE) and polytetrafluoroethylene (PTFE) have the greatest potential. PTFE is expected to fill a niche in the extremely high performance market due to its high cost and incompatibility with standard manufacturing requirements. The potential of cyanate ester, however, depends on its pricing policy and manufacturing requirements. Through the use of the PCB cost model and making some assumptions on the processing requirements of CE, it was found that almost all the price-yield combinations would make cyanate ester a viable competitor, especially in the high performance end of the market place.

  12. Laser drilling for improving circuit board manufacturing

    NASA Astrophysics Data System (ADS)

    Yu, Gang; Zhang, Jincheng; Gao, Chunlin; Wang, Honcai; Li, Ping; An, Yongqiang; Zhang, Guiqiu

    1998-08-01

    We reported here a novel technique for laser high speed drillings on Printed Circuit Boards (PCBs). A CNC solid laser based system is developed to drill through and blind vias as an alternative to mechanical drilling. The system employs an Acousto-Optic Q-switched Nd:YAG laser, a computer control system and an X-Y moving table which can handle up to 400 X 400 mm PCB. With a special designed cavity the laser system works in a pulsed operation in order to generate pulses with width down to 0.5 microseconds and maximum peak power over 10 kW at 10 k repetition rate. Delivered by an improved optical beam transforming system, the focused laser beam can drill holes including blind vias on PCBs with diameter in the range of 0.1 - 0.4 mm and at up to 300 - 500 vias per second (depending on the construction of PCBs). By means of a CNC X-Y moving system, laser pulses with pulse-to-pulse superior repeatability can be fired at desired location on a PCBs with high accuracy. This alternative technology for drilling through or blind vias on PCBs or PWBs (printed wiring boards) will obviously enhance the capability to printed boards manufacturing.

  13. Recycling of WEEE: Characterization of spent printed circuit boards from mobile phones and computers

    SciTech Connect

    Yamane, Luciana Harue; Tavares de Moraes, Viviane; Crocce Romano Espinosa, Denise; Soares Tenorio, Jorge Alberto

    2011-12-15

    Highlights: > This paper presents new and important data on characterization of wastes of electric and electronic equipments. > Copper concentration is increasing in mobile phones and remaining constant in personal computers. > Printed circuit boards from mobile phones and computers would not be mixed prior treatment. - Abstract: This paper presents a comparison between printed circuit boards from computers and mobile phones. Since printed circuits boards are becoming more complex and smaller, the amount of materials is constantly changing. The main objective of this work was to characterize spent printed circuit boards from computers and mobile phones applying mineral processing technique to separate the metal, ceramic, and polymer fractions. The processing was performed by comminution in a hammer mill, followed by particle size analysis, and by magnetic and electrostatic separation. Aqua regia leaching, loss-on-ignition and chemical analysis (inductively coupled plasma atomic emission spectroscopy - ICP-OES) were carried out to determine the composition of printed circuit boards and the metal rich fraction. The composition of the studied mobile phones printed circuit boards (PCB-MP) was 63 wt.% metals; 24 wt.% ceramics and 13 wt.% polymers; and of the printed circuit boards from studied personal computers (PCB-PC) was 45 wt.% metals; 27 wt.% polymers and ceramics 28 wt.% ceramics. The chemical analysis showed that copper concentration in printed circuit boards from personal computers was 20 wt.% and in printed circuit boards from mobile phones was 34.5 wt.%. According to the characteristics of each type of printed circuit board, the recovery of precious metals may be the main goal of the recycling process of printed circuit boards from personal computers and the recovery of copper should be the main goal of the recycling process of printed circuit boards from mobile phones. Hence, these printed circuit boards would not be mixed prior treatment. The results of

  14. Packaging printed circuit boards: A production application of interactive graphics

    NASA Technical Reports Server (NTRS)

    Perrill, W. A.

    1975-01-01

    The structure and use of an Interactive Graphics Packaging Program (IGPP), conceived to apply computer graphics to the design of packaging electronic circuits onto printed circuit boards (PCB), were described. The intent was to combine the data storage and manipulative power of the computer with the imaginative, intuitive power of a human designer. The hardware includes a CDC 6400 computer and two CDC 777 terminals with CRT screens, light pens, and keyboards. The program is written in FORTRAN 4 extended with the exception of a few functions coded in COMPASS (assembly language). The IGPP performs four major functions for the designer: (1) data input and display, (2) component placement (automatic or manual), (3) conductor path routing (automatic or manual), and (4) data output. The most complex PCB packaged to date measured 16.5 cm by 19 cm and contained 380 components, two layers of ground planes and four layers of conductors mixed with ground planes.

  15. Recycling of WEEE: characterization of spent printed circuit boards from mobile phones and computers.

    PubMed

    Yamane, Luciana Harue; de Moraes, Viviane Tavares; Espinosa, Denise Crocce Romano; Tenório, Jorge Alberto Soares

    2011-12-01

    This paper presents a comparison between printed circuit boards from computers and mobile phones. Since printed circuits boards are becoming more complex and smaller, the amount of materials is constantly changing. The main objective of this work was to characterize spent printed circuit boards from computers and mobile phones applying mineral processing technique to separate the metal, ceramic, and polymer fractions. The processing was performed by comminution in a hammer mill, followed by particle size analysis, and by magnetic and electrostatic separation. Aqua regia leaching, loss-on-ignition and chemical analysis (inductively coupled plasma atomic emission spectroscopy - ICP-OES) were carried out to determine the composition of printed circuit boards and the metal rich fraction. The composition of the studied mobile phones printed circuit boards (PCB-MP) was 63 wt.% metals; 24 wt.% ceramics and 13 wt.% polymers; and of the printed circuit boards from studied personal computers (PCB-PC) was 45 wt.% metals; 27 wt.% polymers and ceramics 28 wt.% ceramics. The chemical analysis showed that copper concentration in printed circuit boards from personal computers was 20 wt.% and in printed circuit boards from mobile phones was 34.5 wt.%. According to the characteristics of each type of printed circuit board, the recovery of precious metals may be the main goal of the recycling process of printed circuit boards from personal computers and the recovery of copper should be the main goal of the recycling process of printed circuit boards from mobile phones. Hence, these printed circuit boards would not be mixed prior treatment. The results of this paper show that copper concentration is increasing in mobile phones and remaining constant in personal computers.

  16. Recycling of WEEE: characterization of spent printed circuit boards from mobile phones and computers.

    PubMed

    Yamane, Luciana Harue; de Moraes, Viviane Tavares; Espinosa, Denise Crocce Romano; Tenório, Jorge Alberto Soares

    2011-12-01

    This paper presents a comparison between printed circuit boards from computers and mobile phones. Since printed circuits boards are becoming more complex and smaller, the amount of materials is constantly changing. The main objective of this work was to characterize spent printed circuit boards from computers and mobile phones applying mineral processing technique to separate the metal, ceramic, and polymer fractions. The processing was performed by comminution in a hammer mill, followed by particle size analysis, and by magnetic and electrostatic separation. Aqua regia leaching, loss-on-ignition and chemical analysis (inductively coupled plasma atomic emission spectroscopy - ICP-OES) were carried out to determine the composition of printed circuit boards and the metal rich fraction. The composition of the studied mobile phones printed circuit boards (PCB-MP) was 63 wt.% metals; 24 wt.% ceramics and 13 wt.% polymers; and of the printed circuit boards from studied personal computers (PCB-PC) was 45 wt.% metals; 27 wt.% polymers and ceramics 28 wt.% ceramics. The chemical analysis showed that copper concentration in printed circuit boards from personal computers was 20 wt.% and in printed circuit boards from mobile phones was 34.5 wt.%. According to the characteristics of each type of printed circuit board, the recovery of precious metals may be the main goal of the recycling process of printed circuit boards from personal computers and the recovery of copper should be the main goal of the recycling process of printed circuit boards from mobile phones. Hence, these printed circuit boards would not be mixed prior treatment. The results of this paper show that copper concentration is increasing in mobile phones and remaining constant in personal computers. PMID:21820883

  17. Design principles and realization of electro-optical circuit boards

    NASA Astrophysics Data System (ADS)

    Betschon, Felix; Lamprecht, Tobias; Halter, Markus; Beyer, Stefan; Peterson, Harry

    2013-02-01

    The manufacturing of electro-optical circuit boards (EOCB) is based to a large extent on established technologies. First products with embedded polymer waveguides are currently produced in series. The range of applications within the sensor and data communication markets is growing with the increasing maturity level. EOCBs require design flows, processes and techniques similar to existing printed circuit board (PCB) manufacturing and appropriate for optical signal transmission. A key aspect is the precise and automated assembly of active and passive optical components to the optical waveguides which has to be supported by the technology. The design flow is described after a short introduction into the build-up of EOCBs and the motivation for the usage of this technology within the different application fields. Basis for the design of EOCBs are the required optical signal transmission properties. Thereafter, the devices for the electro-optical conversion are chosen and the optical coupling approach is defined. Then, the planar optical elements (waveguides, splitters, couplers) are designed and simulated. This phase already requires co-design of the optical and electrical domain using novel design flows. The actual integration of an optical system into a PCB is shown in the last part. The optical layer is thereby laminated to the purely electrical PCB using a conventional PCB-lamination process to form the EOCB. The precise alignment of the various electrical and optical layers is thereby essential. Electrical vias are then generated, penetrating also the optical layer, to connect the individual electrical layers. Finally, the board has to be tested electrically and optically.

  18. Removing Bonded Integrated Circuits From Boards

    NASA Technical Reports Server (NTRS)

    Rice, John T.

    1989-01-01

    Small resistance heater makes it easier, faster, and cheaper to remove integrated circuit from hybrid-circuit board, package, or other substrate for rework. Heater, located directly in polymeric bond interface or on substrate under integrated-circuit chip, energized when necessary to remove chip. Heat generated softens adhesive or solder that bonds chip to substrate. Chip then lifted easily from substrate.

  19. High-reliability flexible optical printed circuit board for opto-electric interconnections

    NASA Astrophysics Data System (ADS)

    Rho, Byung Sup; Lee, Woo-Jin; Lim, Jung Woon; Kim, Gye Won; Cho, Che Hyun; Hwang, Sung Hwan

    2009-01-01

    A rigid flexible optical electrical printed circuit board (RFOE-PCB) with both electrical layers and an optical layer was fabricated using a conventional PCB manufacture process. The RFOE-PCB is applicable to fold-type mobile devices such as mobile phones and laptop computers. The RFOE-PCB was designed to be embedded with a flexible 45-deg-ended optical waveguide, which was made using a polymeric material. The precise lamination between an electrical layer and an optical layer was achieved by a passive alignment method. We carried out the repetitive folding test and an environment test for physical and optical reliability suitable for mobile devices. Data transmission of 2.5 Gb/s was demonstrated with a clear eye diagram using the fabricated RFOE-PCB.

  20. Reducing Printed Circuit Board Emissions with Low-Noise Design Practices

    NASA Technical Reports Server (NTRS)

    Bradley, Arthur T.; Fowler, Jennifer; Yavoich, Brian J.; Jennings, Stephen A.

    2012-01-01

    This paper presents the results of an experiment designed to determine the effectiveness of adopting several low-noise printed circuit board (PCB) design practices. Two boards were designed and fabricated, each consisting of identical mixed signal circuitry. Several important differences were introduced between the board layouts: one board was constructed using recommended low-noise practices and the other constructed without such attention. The emissions from the two boards were then measured and compared, demonstrating an improvement in radiated emissions of up to 22 dB.

  1. Studies on the reuse of waste printed circuit board as an additive for cement mortar.

    PubMed

    Ban, Bong-Chan; Song, Jong-Yoon; Lim, Joong-Yeon; Wang, Soo-Kyoon; An, Kwang-Guk; Kim, Dong-Su

    2005-01-01

    The recent development in electronic industries has generated a drastic increase in production of printed circuit boards (PCB). Accordingly, the amount of waste PCB from electronic productions and waste electronics and its environmental impact such as soil and groundwater contamination have become a great concern. This study aims to propose a method for reuse of waste PCB as an additive for cement mortar. Although the expansibility of waste PCB powder finer than 0.08 mm in water was observed to be greater than 2.0%, the maximum expansion rates in water for 0.08 to approximately 0.15 and 0.15 to approximately 0.30 mm sized PCB powders were less than 2.0%, which satisfied the necessary condition as an alternative additive for cement mortar in place of sand. The difference in the compressive strength of standard mortar and waste PCB added mortar was observed to be less than 10% and their difference was expected to be smaller after prolonged aging. The durability of waste PCB added cement mortar was also examined through dry/wet conditioning cyclic tests and acidic/alkaline conditioning tests. From the tests, both weight and compressive strength of cement mortar were observed to be recovered with aging. The leaching test for heavy metals from waste PCB added mortar showed that no heavy metal ions such as copper, lead, or cadmium were detected in the leachate, which resulted from fixation effect of the cement hydrates.

  2. Ultrasonic evaluation of high voltage circuit boards

    NASA Technical Reports Server (NTRS)

    Klima, S. J.; Riley, T. J.

    1976-01-01

    Preliminary observations indicate that an ultrasonic scanning technique may be useful as a quick, low cost, nondestructive method for judging the quality of circuit board materials for high voltage applications. Corona inception voltage tests were conducted on fiberglass-epoxy and fiberglass-polyimide high pressure laminates from 20 to 140 C. The same materials were scanned ultrasonically by utilizing the single transducer, through-transmission technique with reflector plate, and recording variations in ultrasonic energy transmitted through the board thickness. A direct relationship was observed between ultrasonic transmission level and corona inception voltage. The ultrasonic technique was subsequently used to aid selection of high quality circuit boards for the Communications Technology Satellite.

  3. Printed circuit board layout by microcomputer

    NASA Astrophysics Data System (ADS)

    Krausman, E. W.

    1983-12-01

    Printed circuit board artwork is usually prepared manually because of the unavailability of computer-aided-design tools. This thesis presents the design of a microcomputer based printed circuit board layout system that is easy to use and cheap. Automatic routing and component placement routines will significantly speed up the process. The design satisfies the following requirements: Microcomputer implementation, portable, algorithm independent, interactive, and user friendly. When it is fully implemented a user will be able to select components and a board outline from an automated catalog, enter a schematic diagram, position the components on the board, and completely route the board from a single graphics terminal. Currently, the user interface and the outer level command processor have been implemented in Pascal. Future versions will be written in C for better portability.

  4. An automatic placement tool for rapid prototyping of printed circuit boards

    NASA Astrophysics Data System (ADS)

    Granacki, John; Kazi, Tauseef

    1993-11-01

    This report describes a fully automatic placement tool for PCB's (printed circuit boards), nap (nonhierarchical automatic placement) that combines approaches from different placement heuristics developed both for PCB and VLSI chip placement. Although the problem of placement for a PCB can be abstractly cast into the same formalism as the problem of VLSI cell placement, a practical tool must incorporate many additional features. In this report we describe the impact of incorporating these PCB-specific features as well as other constraints imposed by the CAD environment (that is, the schematic capture system and the automatic routing tools) into an automatic placement tool. Next we discuss the selected heuristics and their associated data structures in detail. Following this discussion, we present the results of using the placement tool on two test cases along with an analysis of the tools performance. Finally, we identify the limitations of the current implementation and we propose some possible solutions and future work.

  5. Vibration suppression of printed circuit boards using an external particle damper

    NASA Astrophysics Data System (ADS)

    Veeramuthuvel, P.; Sairajan, K. K.; Shankar, K.

    2016-03-01

    Particle damping is an effective method of passive vibration control, of recent research interest. The novel use of particle damper capsule on a Printed Circuit Board (PCB) and the development of Radial Basis Function neural network to accurately predict the acceleration response is presented here. The prediction of particle damping using this neural network is studied in comparison with the Back Propagation Neural network. Extensive experiments are carried out on a PCB for different combinations of particle damper parameters such as particle size, particle density, packing ratio, and the input force during the primary modes of vibration and the obtained results are used for training and testing of neural networks. Based on the prediction from the better trained network, useful design guidelines for the particle damper suitable for PCB are arrived at. The effectiveness of particle dampers for vibration suppression of PCB under random vibration environment is demonstrated based on these design guidelines.

  6. Flexible composite film for printed circuit board

    NASA Technical Reports Server (NTRS)

    Yabe, K.; Asakura, M.; Tanaka, H.; Soda, A.

    1982-01-01

    A flexible printed circuit for a printed circuit board in which layers of reaction product composed of a combination of phenoxy resin - polyisocyanate - brominated epoxy resin, and in which the equivalent ratio of those functional groups is hydroxyl group: isocyanate group: epoxy group - 1 : 0.2 to 2 : 0.5 to 3 are laminated on at least one side of saturated polyester film is discussed.

  7. Detection of Banned and Restricted Ozone-Depleting Chemicals in Printed Circuit Boards

    SciTech Connect

    Lee, Richard N.; Wright, Bob W.

    2008-12-01

    A study directed toward the detection of halogenated solvents in the matrix of circuit boards has recently been completed. This work was undertaken to demonstrate the potential for reliable detection of solvents used during the fabrication of printed circuit boards (PCB). Since many of these solvents are now, or soon will be, restricted under the terms of legislation enacted in response to the Montreal Protocol and other international agreements, the work described here, conducted over a period of more that 4 years, has provided guidance for the development of chromatographic system and analytical protocol to assure compliance with regulations introduced to control, or ban, industrial solvents associated with adverse environmental impact.

  8. Converting non-metallic printed circuit boards waste into a value added product

    PubMed Central

    2013-01-01

    The aim of this study was to investigate the feasibility of using nonmetallic printed circuit board (PCB) waste as filler in recycled HDPE (rHDPE) in production of rHDPE/PCB composites. Maleic anhydride modified linear low-density polyethylene (MAPE) was used as compatibilizer. In particular, the effects of nonmetallic PCB and MAPE on mechanical properties of the composites were assessed through tensile, flexural and impact testing. Scanning electron microscope (SEM) was used to study the dispersion of nonmetallic PCB and MAPE in the matrix. Nonmetallic PCB was blended with rHDPE from 0–30 wt% and prepared by counter-rotating twin screw extruder followed by molding into test samples via hot press for analysis. A good balance between stiffness, strength and toughness was achieved for the system containing 30 wt% PCB. Thus, this system was chosen in order to investigate the effect of the compatibilizer on the mechanical properties of the composites. The results indicate that MAPE as a compatiblizer can effectively promote the interfacial adhesion between nonmetallic PCB and rHDPE. The addition of 6 phr MAPE increased the flexural strength, tensile strength and impact strength by 71%, 98% and 44% respectively compared to the uncompatibilized composites. PMID:24764542

  9. Chemical inertness of UV-cured optical elastomers within the printed circuit board manufacturing process for embedded waveguide applications

    NASA Astrophysics Data System (ADS)

    Kruse, Kevin; Walczak, Karl; Thomas, Nicholas; Swatowski, Brandon; Demars, Casey; Middlebrook, Christopher

    2014-03-01

    Embedding polymer optical waveguides (WGs) into printed circuit boards (PCBs) for intra-board or board-to-board high speed data communications requires polymer materials that are compatible and inert when exposed to common PCB manufacturing processes. Ensuring both WG functionality after chemical exposure and maintaining PCB manufacturing integrities within the production process is crucial for successful implementation. The PCB manufacturing flow is analyzed to expose major requirements that would be required for the successful implementation of polymer materials for embedded WG development. Chemical testing and analysis were performed on Dow Corning ® OE-4140 UV-Cured Optical Elastomer Core and Dow Corning® OE-4141 UV-Cured Optical Elastomer Cladding which are designed for low loss embedded optical WGs. Contamination testing was conducted to demonstrate polymer compatibility in both cured and uncured form. Various PCB chemicals were treated with uncured polymer material and tested for effective contamination. Fully polymerized multimode WGs were fabricated and exposed to PCB chemicals at temperatures and durations comparable to PCB manufacturing conditions. Chemical analysis shows that the chosen polymer is compatible and inert with most common PCB manufacturing processes.

  10. The p53 circuit board

    PubMed Central

    Sullivan, Kelly D.; Gallant-Behm, Corrie L.; Henry, Ryan E.; Fraikin, Jean-Luc; Espinosa, Joaquín M.

    2012-01-01

    The p53 tumor suppressor is embedded in a large gene network controlling diverse cellular and organismal phenotypes. Multiple signaling pathways converge onto p53 activation, mostly by relieving the inhibitory effects of its repressors, MDM2 and MDM4. In turn, signals originating from increased p53 activity diverge into distinct effector pathways to deliver a specific cellular response to the activating stimuli. Much attention has been devoted to dissecting how the various input pathways trigger p53 activation and how the activity of the p53 protein itself can be modulated by a plethora of co-factors and post-translational modifications. In this review we will focus instead on the multiple configurations of the effector pathways. We will discuss how p53-generated signals are transmitted, amplified, resisted and eventually integrated by downstream gene circuits operating at the transcriptional, post-transcriptional and post-translational level. We will also discuss how context-dependent variations in these gene circuits define the cellular response to p53 activation and how they may impact the clinical efficacy of p53-based targeted therapies. PMID:22333261

  11. Effect of Heat-Treatment on Metallic Collection for Used Printed Circuit Board

    NASA Astrophysics Data System (ADS)

    Agawa, Ryuichi; Tsugita, Yasuhiro; Nishida, Minoru; Araki, Takao

    In this research, we examined the method that separates the material from the printed circuit board by the proof scale heat-treatment. The size of the printed circuit board (PCB) used for the examination was about 150 mm × 200 mm, and PCB was executed heat-treatment by two kinds of shape as received (Sample-A) and crushed (Sample-B) by hammarcrasher. The following result was obtained. The organic resin and also omine were removed by the heat treatment in both cases. In Sample-B heat-treatment, though combustion was done with stability, however, the temperature rises locally so that the organism in the board crushed by the high contact with oxygen may burn instantaneously and the combustion residue melted solidifies. In Sample-A heat-treatment, the metallic collection rate in the combustion residue was higher than Sample-B, especially Cu and Ni are collected by 90mass% or more, and Ag, Au and Pb collected were twice larger compared with Sample-B. The residue in Sample-A could be crushed comparatively easily with hammarcrasher. Therefore, to make the crushing combustion residue concentrated of the metal in the printed circuit board adjust to metallic refinement process, it is thought that we should heat-treat the printed circuit board near as received.

  12. Physically separating printed circuit boards with a resilient, conductive contact

    NASA Technical Reports Server (NTRS)

    Baker, John D. (Inventor); Montalvo, Alberto (Inventor)

    1999-01-01

    A multi-board module provides high density electronic packaging in which multiple printed circuit boards are stacked. Electrical power, or signals, are conducted between the boards through a resilient contact. One end of the contact is located at a via in the lower circuit board and soldered to a pad near the via. The top surface of the contact rests against a via of the facing printed circuit board.

  13. Improving Heat Transfer Performance of Printed Circuit Boards

    NASA Technical Reports Server (NTRS)

    Schatzel, Donald V.

    2009-01-01

    This paper will explore the ability of printed circuit boards laminated with a Carbon Core Laminate to transfer heat vs. standard printed circuit boards that use only thick layers of copper. The paper will compare the differences in heat transfer performance of printed circuit boards with and without CCL.

  14. 29 CFR 1915.181 - Electrical circuits and distribution boards.

    Code of Federal Regulations, 2012 CFR

    2012-07-01

    ... 29 Labor 7 2012-07-01 2012-07-01 false Electrical circuits and distribution boards. 1915.181... Electrical Machinery § 1915.181 Electrical circuits and distribution boards. (a) The provisions of this... employee is permitted to work on an electrical circuit, except when the circuit must remain energized...

  15. 29 CFR 1915.181 - Electrical circuits and distribution boards.

    Code of Federal Regulations, 2014 CFR

    2014-07-01

    ... 29 Labor 7 2014-07-01 2014-07-01 false Electrical circuits and distribution boards. 1915.181... Electrical Machinery § 1915.181 Electrical circuits and distribution boards. (a) The provisions of this... employee is permitted to work on an electrical circuit, except when the circuit must remain energized...

  16. 29 CFR 1915.181 - Electrical circuits and distribution boards.

    Code of Federal Regulations, 2011 CFR

    2011-07-01

    ... 29 Labor 7 2011-07-01 2011-07-01 false Electrical circuits and distribution boards. 1915.181... Electrical Machinery § 1915.181 Electrical circuits and distribution boards. (a) The provisions of this... employee is permitted to work on an electrical circuit, except when the circuit must remain energized...

  17. A Docking Casette For Printed Circuit Boards

    DOEpatents

    Barringer, Dennis R.; Seminaro, Edward J.; Toffler, Harold M.

    2003-08-19

    A docking apparatus for printed circuit boards including a cassette housing, having a housing base, a housing cover and a housing wall, wherein the housing base and the housing wall are disposed relative to each other so as to define a housing cavity for containing a printed circuit board and wherein the housing wall includes a cable opening disposed so as to be communicated with the housing cavity, a linkage mechanism, wherein the linkage mechanism includes an engagement configuration and a disengagement configuration and wherein the linkage mechanism is disposed so as to be associated with the cassette housing and a housing bezel, wherein the housing bezel is disposed relative to the cassette housing so as to be associated with the cable opening.

  18. Automated inspection in printed circuit board assembly (PCBA) manufacturing

    NASA Astrophysics Data System (ADS)

    Abraham, Francy K.

    1997-08-01

    Visual inspection has long been a necessary method of quality control in Printed Circuit Board Assemblies (PCBA) manufacturing. The characteristics of electronic assemblies have changed substantially over the last decade. Todays high lead count, fine pitch SMT components are becoming even more difficult for humans to inspect at the same time automated inspection systems have become reliable than manual inspection and are now accepted as valuable tools for producing high quality PCBA products. The basic requirements of an automated inspection system remain same in all PCBA manufacturing but the type of the automated system (off- line/on-line), where applied in the production flow, entire boards or only on a sample basis, inspection coverage (100% or partial) vary between different PCBA manufacturers. In PCBA manufacturing the emphasis is more in the electrical functionality of the PCBA than in it's appearance. It is nearly impossible to impose stringent specifications in the appearance of the components and other materials used in PCBA manufacturing. Due to the large number of component/PCB supplier and wide variations in materials and processes the challenge in successfully automating the inspection process is the variability in the appearance of components on PCBA. But in a high volume PCBA manufacturing where fewer board types are running in large volumes for long periods of time, the variability in component appearance can be controlled much better than a low volume PCBA manufacturing where more types are running in low volumes for short period of time. This paper discusses the development and implementation of a low cost flexible automated inspection system for PCBAs. The system can detect over ninety percent of visual defects on PCBAs. The key features of the system are quick and easy set-up, capability to inspect different types of board and quick change over between different boards and low cost.

  19. Printed Circuit Board Design with HDL Designer

    NASA Technical Reports Server (NTRS)

    Winkert, Thomas K.; LaFourcade, Teresa

    2004-01-01

    Staying up to date with the latest CAD tools both from a cost and time perspective is difficult. Within a given organization there may be experts in Printed Circuit Board Design tools and experts in FPGA/VHDL tools. Wouldn't it be great to have someone familiar with HDL Designer be able to design PCBs without having to learn another tool? This paper describes a limited experiment to do this.

  20. High density printed electrical circuit board card connection system

    DOEpatents

    Baumbaugh, A.E.

    1997-05-06

    A zero insertion/extraction force printed circuit board card connection system comprises a cam-operated locking mechanism disposed along an edge portion of the printed circuit board. The extrusions along the circuit board mate with an extrusion fixed to the card cage having a plurality of electrical connectors. The card connection system allows the connectors to be held away from the circuit board during insertion/extraction and provides a constant mating force once the circuit board is positioned. The card connection system provides a simple solution to the need for a greater number of electrical signal connections. 12 figs.

  1. High density printed electrical circuit board card connection system

    DOEpatents

    Baumbaugh, Alan E.

    1997-01-01

    A zero insertion/extraction force printed circuit board card connection system comprises a cam-operated locking mechanism disposed along an edge portion of the printed circuit board. The extrusions along the circuit board mate with an extrusion fixed to the card cage having a plurality of electrical connectors. The card connection system allows the connectors to be held away from the circuit board during insertion/extraction and provides a constant mating force once the circuit board is positioned. The card connection system provides a simple solution to the need for a greater number of electrical signal connections.

  2. Sequential computer algorithms for printed circuit board inspection

    NASA Astrophysics Data System (ADS)

    Hernandez, Moises E.; Villalobos, Jesus R.; Johnson, W. Carrol

    1993-08-01

    Surface mounted technology (SMT) in automated assembly facilities requires the use of automatic surface-mount-device (SMD) placement machines. One of the problems involved in the electronic printed circuit board (PCB) assembly process is the verification of the SMD placement operation within tight tolerances. The high throughput of modern manufacturing lines along with the required accuracy demand the use of automatic inspection systems to verify SMD placement. Image complexity of the board makes the use of machine vision for the inspection process a difficult task. This is complicated by the fact that misclassification errors should be kept to a minimum. Additionally, it is desirable that the inspection results provide enough information to be used for statistical process control (SPC). The strategy adopted to solve this problem was to simplify the complexity of the image by means of special illumination devices. The simplified image was then suitable for analysis by simple processing, segmentation, and detection algorithms that, sequentially applied to the image, met the required repeatability and accuracy specifications for the inspection system. The scope of this paper is to describe the techniques explored by the authors to solve the SMD inspection problem in order to develop a working industrial SMD inspection system.

  3. Chemical and biological processes for multi-metal extraction from waste printed circuit boards of computers and mobile phones.

    PubMed

    Shah, Monal B; Tipre, Devayani R; Dave, Shailesh R

    2014-11-01

    E-waste printed circuit boards (PCB) of computers, mobile-phones, televisions, LX (LongXiang) PCB in LED lights and bulbs, and tube-lights were crushed to ≥250 µm particle size and 16 different metals were analysed. A comparative study has been carried out to evaluate the extraction of Cu-Zn-Ni from computer printed circuit boards (c-PCB) and mobile-phone printed circuit boards (m-PCB) by chemical and biological methods. Chemical process showed the extraction of Cu-Zn-Ni by ferric sulphate was best among the studied chemical lixiviants. Bioleaching experiments were carried out with the iron oxidising consortium, which showed that when E-waste and inoculum were added simultaneously in the medium (one-step process); 60.33% and 87.50% Cu, 75.67% and 85.67% Zn and 71.09% and 81.87% Ni were extracted from 10 g L(-1) of c-PCB and m-PCB, respectively, within 10-15 days of reaction time. Whereas, E-waste added after the complete oxidation of Fe(2+) to Fe(3+) iron containing medium (two-step process) showed 85.26% and 99.99% Cu, 96.75% and 99.49% Zn and 93.23% and 84.21% Ni extraction from c-PCB and m-PCB, respectively, only in 6-8 days. Influence of varying biogenerated Fe(3+) and c-PCB concentrations showed that 16.5 g L(-1) of Fe(3+) iron was optimum up to 100 g L(-1) of c-PCB. Changes in pH, acid consumed and redox potential during the process were also studied. The present study shows the ability of an eco-friendly process for the recovery of multi-metals from E-waste even at 100 g L(-1) printed circuit boards concentration.

  4. Fixture aids soldering of electronic components on circuit board

    NASA Technical Reports Server (NTRS)

    Ross, M. H.

    1966-01-01

    Spring clamp fixture holds small electronic components in a desired position while they are being soldered on a circuit board. The spring clamp is clipped on the edge of the circuit board and an adjustable spring-steel boom holds components against the board. The felt pad at the end of the boom is replaced with different attachments for other holding tasks.

  5. Developing 300°C Ceramic Circuit Boards

    SciTech Connect

    Normann, Randy A

    2015-02-15

    This paper covers the development of a geothermal ceramic circuit board technology using 3D traces in a machinable ceramic. Test results showing the circuit board to be operational to at least 550°C. Discussion on producing this type of board is outlined along with areas needing improvement.

  6. Wideband characterization of printed circuit board materials up to 50 ghz

    NASA Astrophysics Data System (ADS)

    Rakov, Aleksei

    A traveling-wave technique developed a few years ago in the Missouri S&T EMC Laboratory has been employed until now for characterization of PCB materials over a broad frequency range up to 30 GHz. This technique includes measuring S-parameters of the specially designed PCB test vehicles. An extension of the frequency range of printed circuit board laminate dielectric and copper foil characterization is an important problem. In this work, a new PCB test vehicle design for operating up to 50 GHz has been proposed. As the frequency range of measurements increases, the analysis of errors and uncertainties in measuring dielectric properties becomes increasingly important. Formulas for quantification of two major groups of errors, repeatability (manufacturing variability) and reproducibility (systematic) errors, in extracting dielectric constant (DK) and dissipation factor (DK) have been derived, and computations for a number of cases are presented. Conductor (copper foil) surface roughness of PCB interconnects is an important factor, which affects accuracy of DK and DF measurements. This work describes a new algorithm for semi-automatic characterization of copper foil profiles on optical or scanning electron microscopy (SEM) pictures of signal traces. The collected statistics of numerous copper foil roughness profiles allows for introducing a new metric for roughness characterization of PCB interconnects. This is an important step to refining the measured DK and DF parameters from roughness contributions. The collected foil profile data and its analysis allow for developing "design curves", which could be used by SI engineers and electronics developers in their designs.

  7. Printed circuit boards as platform for disposable lab-on-a-chip applications

    NASA Astrophysics Data System (ADS)

    Leiterer, Christian; Urban, Matthias; Fritzsche, Wolfgang; Goldys, Ewa; Inglis, David

    2015-12-01

    An increasing demand in performance from electronic devices has resulted in continuous shrinking of electronic components. This shrinkage has demanded that the primary integration platform, the printed circuit board (PCB), follow this same trend. Today, PCB companies offer ~100 micron sized features (depth and width) which mean they are becoming suitable as physical platforms for Lab-on-a-Chip (LOC) and microfluidic applications. Compared to current lithographic based fluidic approaches; PCB technology offers several advantages that are useful for this technology. These include: Being easily designed and changed using free software, robust structures that can often be reused, chip layouts that can be ordered from commercial PCB suppliers at very low cost (1 AUD each in this work), and integration of electrodes at no additional cost. Here we present the application of PCB technology in connection with microfluidics for several biomedical applications. In case of commercialization the costs for each device can be even further decreased to approximately one tenth of its current cost.

  8. Sampling and Control Circuit Board for an Inertial Measurement Unit

    NASA Technical Reports Server (NTRS)

    Chelmins, David T (Inventor); Powis, Richard T., Jr. (Inventor); Sands, Obed (Inventor)

    2016-01-01

    A circuit board that serves as a control and sampling interface to an inertial measurement unit ("IMU") is provided. The circuit board is also configured to interface with a local oscillator and an external trigger pulse. The circuit board is further configured to receive the external trigger pulse from an external source that time aligns the local oscillator and initiates sampling of the inertial measurement device for data at precise time intervals based on pulses from the local oscillator. The sampled data may be synchronized by the circuit board with other sensors of a navigation system via the trigger pulse.

  9. Preparing printed circuit boards for rapid turn-around time on a plotter

    SciTech Connect

    Hawtree, J.

    1998-01-01

    This document describes the use of the LPKF ProtoMat mill/drill unit circuit board Plotter, with the associated CAD/CAM software BoardMaster and CircuitCAM. At present its primarily use here at Fermilab`s Particle Physics Department is for rapid-turnover of prototype PCBs double-sided and single-sided copper clad printed circuit boards (PCBs). (The plotter is also capable of producing gravure films and engraving aluminum or plastic although we have not used it for this.) It has the capability of making traces 0.004 inch wide with 0.004 inch spacings which is appropriate for high density surface mount circuits as well as other through-mounted discrete and integrated components. One of the primary benefits of the plotter is the capability to produce double-sided drilled boards from CAD files in a few hours. However to achieve this rapid turn-around time, some care must be taken in preparing the files. This document describes how to optimize the process of PCB fabrication. With proper preparation, researchers can often have a completed circuit board in a day`s time instead of a week or two wait with usual procedures. It is assumed that the software and hardware are properly installed and that the machinist is acquainted with the Win95 operating system and the basics of the associated software. This paper does not describe its use with pen plotters, lasers or rubouts. The process of creating a PCB (printed circuit board) begins with the CAD (computer-aided design) software, usually PCAD or VeriBest. These files are then moved to CAM (computer-aided machining) where they are edited and converted to put them into the proper format for running on the ProtoMat plotter. The plotter then performs the actual machining of the board. This document concentrates on the LPKF programs CircuitCam BASIS and BoardMaster for the CAM software. These programs run on a Windows 95 platform to run an LPKF ProtoMat 93s plotter.

  10. Optical contacts to waveguides in printed circuit boards

    NASA Astrophysics Data System (ADS)

    Rupp, Torsten; Shkarban, Oleksandr; Menschig, Arnd

    2004-09-01

    The development of printed circuit boards (PCB) with integrated layers for optical data transfer was pushed during the last few years. Solutions with optical fibers or planar waveguides fabricated from plastics or glass will soon be available on the market. Nevertheless the low loss coupling of functional optical components as connectors, transmitters and receivers to these new generations of PCBs still is open. The packaging of otical transceivers or connectors actually is based mainly on single device solutions or active coupling concepts. On the other side the connectors of external optical data lines or of daughter cards to the main boards and the coupling of transmitter and receiver modules to optical PCBs do need linear array concepts. And the coupling efficiency should not decrease during reflow process. Actual concepts using mulit-mode connectors or a direct waveguide coupling of receivers suffer under high optical losses. However the use of micro-optical functional elements allows the realization of coupling concepts with teh lowest losses possible. The total losses for optical lines from the transmitter to the waveguide and back to the receiver can be reduced below 4 dB. For cost reduction even symmetric optical set-up can be used. The transmission rate can be as high as 40 Gb/s. With this concept error tolerant systems for the optical interconnection are possible. We report about the modeling, the design and the characterization of micro-optical interconnect modules for high efficient contacts to the optical layer in PCBs. For the assembly of the modules we use the new concept of a desk-top factory with miniaturized tools for handling, assembly, and inspection. This concept increases the flexibility and reduces the manufacturing costs.

  11. Chemical Characterisation of Printed Circuit Board Wastewater

    NASA Astrophysics Data System (ADS)

    Sobri, S.; Ali, A. H. M.

    2011-02-01

    Manufacturing of PCBs is highly complicated and involves many processes. Recycling of PCB wastewater receives wide concerns as the recent international growth in the electronics industry has generated a drastic increase in the amount of waste PCBs with profound environmental impacts such as soil and groundwater contamination. This paper reports on the chemical characterization of PCB wastewater as the initial investigation for selective metal recovery.

  12. Tetrabromobisphenol A contamination and emission in printed circuit board production and implications for human exposure.

    PubMed

    Zhou, Xiaoyu; Guo, Jie; Zhang, Wei; Zhou, Peng; Deng, Jingjing; Lin, Kuangfei

    2014-05-30

    The emission of and exposure to tetrabromobisphenol A (TBBPA) during the production of printed circuit boards (PCBs) were evaluated in this study. TBBPA was determined in production wastes (fine solid waste, rinsing water, effluent and sludge) and environmental samples (dust and PM10) from a typical PCB plant. The TBBPA concentrations of the solid and liquid wastes were on the order of 10(2)-10(4)ng/g and 10(1)-10(2)ng/L, respectively. The highest emission to the environment was exhibited by the fine solid waste (187-1220μg/kg-PCB), suggesting the need for strict control of its production and disposal. Regarding the environmental samples, the TBBPA contents of dust (125-9090ng/g) and PM10 (12.3-1640pg/m(3)) were higher than other values reported worldwide, indicating that PCB production was a non-negligible source of TBBPA for the occupational environment. TBBPA contamination mainly occurred in the form of sedimentary dust rather than suspended particulate matter. According to our estimation, worker exposures to TBBPA via dust ingestion, dust dermal absorption and PM10 inhalation varied widely by process, with the greatest exposures being 1930, 431 and 96.5pg/kg-bw/day, respectively. The exposure via dust represented most of the overall exposure via the above three pathways in PCB workshops.

  13. Direct-referencing Two-dimensional-array Digital Microfluidics Using Multi-layer Printed Circuit Board

    PubMed Central

    Gong, Jian; Kim, Chang-Jin “CJ”

    2008-01-01

    Digital (i.e. droplet-based) microfluidics, by the electrowetting-on-dielectric (EWOD) mechanism, has shown great potential for a wide range of applications, such as lab-on-a-chip. While most reported EWOD chips use a series of electrode pads essentially in one-dimensional line pattern designed for specific tasks, the desired universal chips allowing user-reconfigurable paths would require the electrode pads in two-dimensional pattern. However, to electrically access the electrode pads independently, conductive lines need to be fabricated underneath the pads in multiple layers, raising a cost issue especially for disposable chip applications. In this article, we report the building of digital microfluidic plates based on a printed-circuit-board (PCB), in which multilayer electrical access lines were created inexpensively using mature PCB technology. However, due to its surface topography and roughness and resulting high resistance against droplet movement, as-fabricated PCB surfaces require unacceptably high (~500 V) voltages unless coated with or immersed in oil. Our goal is EWOD operations of aqueous droplets not only on oil-covered but also on dry surfaces. To meet varying levels of performances, three types of gradually complex post-PCB microfabrication processes are developed and evaluated. By introducing land-grid-array (LGA) sockets in the packaging, a scalable digital microfluidics system with reconfigurable and low-cost chip is also demonstrated. PMID:19234613

  14. New reconstruction method for x-ray testing of multilayer printed circuit board

    NASA Astrophysics Data System (ADS)

    Yang, Min; Wang, Gao; Liu, Yongzhan

    2010-05-01

    For multilayer printed circuit board (PCB) and large-scale integrated circuit (LIC) chips, nondestructive testing of the inner structure and welding defects is very important for circuit diagram reverse design and manufacturing quality control. The traditional nondestructive testing of this kind of plate-like object is digital radiography (DR), which can provide only images with overlapped information, so it is difficult to get a full and accurate circuit image of every layer and the position of the defects using the DR method. At the same time, traditional computed tomography scanning methods are also unable to resolve this problem. A new reconstruction method is proposed for the nondestructive testing of plate-like objects. With this method, x rays irradiate the surface of the reconstructed object at an oblique angle, and a series of projection images are obtained while the object is rotating. Then, through a relevant preprocessing method on the projections and a special reconstructing algorithm, cross sections of the scanning region are finally obtained slice by slice. The experimental results prove that this method satisfactorily addresses the challenges of nondestructive testing of plate-like objects such as PCB or LIC.

  15. Theoretic model and computer simulation of separating mixture metal particles from waste printed circuit board by electrostatic separator.

    PubMed

    Li, Jia; Xu, Zhenming; Zhou, Yaohe

    2008-05-30

    Traditionally, the mixture metals from waste printed circuit board (PCB) were sent to the smelt factory to refine pure copper. Some valuable metals (aluminum, zinc and tin) with low content in PCB were lost during smelt. A new method which used roll-type electrostatic separator (RES) to recovery low content metals in waste PCB was presented in this study. The theoretic model which was established from computing electric field and the analysis of forces on the particles was used to write a program by MATLAB language. The program was design to simulate the process of separating mixture metal particles. Electrical, material and mechanical factors were analyzed to optimize the operating parameters of separator. The experiment results of separating copper and aluminum particles by RES had a good agreement with computer simulation results. The model could be used to simulate separating other metal (tin, zinc, etc.) particles during the process of recycling waste PCBs by RES.

  16. Field analysis and enhancement of multi-pole magnetic components fabricated on printed circuit board

    NASA Astrophysics Data System (ADS)

    Chiu, Kuo-Chi; Chen, Chin-Sen

    2007-09-01

    A multi-pole magnetic component magnetized with a fine magnetic pole pitch of less than 1 mm is very difficult to achieve by using traditional methods. Moreover, it requires a precise mechanical process and a complicated magnetization system. Different fine magnetic pole pitches of 300, 350 and 400 μm have been accomplished on 9-pole magnetic components through the printed circuit board (PCB) manufacturing technology. Additionally, another fine magnetic pole pitch of 500 μm was also fabricated on a dual-layered (DL) wire circuit structure to investigate the field enhancement. After measurements, a gain factor of 1.37 was obtained in the field strength. The field variations among different magnetic pole pitches were analyzed in this paper.

  17. Manufacturing methods and technology for digital fault isolation of printed circuit boards

    NASA Astrophysics Data System (ADS)

    1980-11-01

    This report presents the final recommendations and conclusions, with supporting data, resulting from the contract option phase of contract DAAK40-78-C-0290. It describes the manufacturing technology and test system that will enable detection, identification, and location of digital faults in the advanced missile electronic systems that will be used in the 1980's. Emphasis is placed on the fault diagnosis of large printed circuit boards containing complex hybrid digital microelectronic circuits. The basic effort included an industry survey for digital printed circuit board test requirements and available test system capabilities, the D/PCB testability investigation and resulting design guide, the development of digital fault isolation methodology and the comprehensive selection of the optimum ATE that recommended the DTS-70 system. The contract option phase of this project involved the purchase and installation of the DTS-70 system, the selection of the PN-1635972 and the PN-1646178 D/PCBs for testing, the development of generalized test software and the development of the specific hardware and software needed to test these worst-case boards.

  18. Process produces accurate registry between circuit board prints

    NASA Technical Reports Server (NTRS)

    1966-01-01

    Tapes and quick-mount circles of contrasting colors aid in obtaining precise registry between the two circuits of two-sided printed circuit boards. The tapes and circles are mounted on opposite sides of transparent plastic film to define the conductive path and feed-through hole locations.

  19. Electrostatic separation for recovering metals and nonmetals from waste printed circuit board: problems and improvements.

    PubMed

    Wu, Jiang; Li, Jia; Xu, Zhenming

    2008-07-15

    Electrostatic separation is an effective and environmentally friendly method for recycling comminuted waste printed circuit boards (PCB). As a classical separator, the roll-type corona-electrostatic separator (RTS) has some advantages in this field. However, there are still some notable problems, such as the middling products and their further treatment, impurity of nonconductive products because of the aggregation of fine particles, and stability of the separation process and balance between the production capacity and the separation quality. To overcome these problems, a conception of two-step separation is presented, and a new two-roll type corona-electrostatic separator (T-RTS) was built As compared to RTS, the conductive products increase by 8.9%, the middling products decrease by 45%, and the production capacity increases by 50% in treating comminuted PCB wastes by T-RTS. In addition, the separation process in T-RTS is more stable. Therefore, T-RTS is a promising separator for recycling comminuted PCB.

  20. Cell electroporation with a three-dimensional microelectrode array on a printed circuit board.

    PubMed

    Xu, Youchun; Su, Shisheng; Zhou, Changcheng; Lu, Ying; Xing, Wanli

    2015-04-01

    Electroporation is a commonly used approach to rapidly introduce exogenous molecules into cells without permanent damage. Compared to classical electroporation protocols, microchip-based electroporation approaches have the advantages of high transfection efficiency and low consumption, but they also commonly rely on costly and tedious microfabrication technology. Hence, it is desirable to develop a novel, more affordable, and effective approach to facilitate cell electroporation. In this study, we utilized a standard printed circuit board (PCB) technology to fabricate a chip with an interdigitated array of electrodes for electroporation of suspended cells. The electrodes (thickness ~35 μm) fabricated by PCB technology are much thicker than the two-dimensional (2D) planar electrodes (thickness < 1 μm) fabricated by conventional microfabrication techniques and possess a smooth corner edge. Numerical simulations showed that the three-dimensional (3D) electrodes fabricated by PCB technology can provide a more uniformly distributed electric field compared to 2D planar electrodes, which is beneficial for reducing the electrolysis of water and improving cell transfection efficiency. The chip constructed here is composed of 18 individually addressable wells for high throughput cell electroporation. HeLa, MCF7, COS7, Jurkat, and 3T3-L1 cells were efficiently transfected with the pEGFP-N1 plasmid using individually optimal electroporation parameters. This work provides a novel method for convenient and rapid cell transfection and thus holds promise for use as a low-cost disposable device in biomedical research.

  1. Evaluation of a recycling process for printed circuit board by physical separation and heat treatment

    SciTech Connect

    Fujita, Toyohisa; Ono, Hiroyuki; Dodbiba, Gjergj; Yamaguchi, Kunihiko

    2014-07-15

    Highlights: • The parts mounted on printed circuit board (PCB) were liberated by underwater explosion and mechanical crushing. • The crushed PCB without surface-mounted parts was carbonized under inert atmosphere at 873 K to recover copper. • The multi-layered ceramic capacitors including nickel was carbonized at 873 K to recover nickel by the magnetic separation. • The tantalum powders were recovered from the molded resins by heat treatment at 723 and 823 K in air atmosphere and screening. • Energy and treatment cost of new process increased, however, the environmental burden decreased comparing conventional one. - Abstract: Printed circuit boards (PCBs) from discarded personal computer (PC) and hard disk drive were crushed by explosion in water or mechanical comminution in order to disintegrate the attached parts. More parts were stripped from PCB of PC, composed of epoxy resin; than from PCB of household appliance, composed of phenol resin. In an attempt to raise the copper grade of PCB by removing other components, a carbonization treatment was investigated. The crushed PCB without surface-mounted parts was carbonized under a nitrogen atmosphere at 873–1073 K. After screening, the char was classified by size into oversized pieces, undersized pieces and powder. The copper foil and glass fiber pieces were liberated and collected in undersized fraction. The copper foil was liberated easily from glass fiber by stamping treatment. As one of the mounted parts, the multi-layered ceramic capacitors (MLCCs), which contain nickel, were carbonized at 873 K. The magnetic separation is carried out at a lower magnetic field strength of 0.1 T and then at 0.8 T. In the +0.5 mm size fraction the nickel grade in magnetic product was increased from 0.16% to 6.7% and the nickel recovery is 74%. The other useful mounted parts are tantalum capacitors. The tantalum capacitors were collected from mounted parts. The tantalum-sintered bodies were separated from molded resins

  2. Copper extraction from coarsely ground printed circuit boards using moderate thermophilic bacteria in a rotating-drum reactor

    SciTech Connect

    Rodrigues, Michael L.M.; Leão, Versiane A.; Gomes, Otavio; Lambert, Fanny; Bastin, David; Gaydardzhiev, Stoyan

    2015-07-15

    Highlights: • Copper bioleaching from PCB (20 mm) by moderate thermophiles was demonstrated. • Larger PCB sheets enable a cost reduction due to the elimination of fine grinding. • Crushing generated cracks in PCB increasing the copper extraction. • A pre-treatment step was necessary to remove the lacquer coating. • High copper extractions (85%) were possible with pulp density of up to 25.0 g/L. - Abstract: The current work reports on a new approach for copper bioleaching from Printed Circuit Board (PCB) by moderate thermophiles in a rotating-drum reactor. Initially leaching of PCB was carried out in shake flasks to assess the effects of particle size (−208 μm + 147 μm), ferrous iron concentration (1.25–10.0 g/L) and pH (1.5–2.5) on copper leaching using mesophile and moderate thermophile microorganisms. Only at a relatively low solid content (10.0 g/L) complete copper extraction was achieved from the particle size investigated. Conversely, high copper extractions were possible from coarse-ground PCB (20 mm-long) working with increased solids concentration (up to 25.0 g/L). Because there was as the faster leaching kinetics at 50 °C Sulfobacillus thermosulfidooxidans was selected for experiments in a rotating-drum reactor with the coarser-sized PCB sheets. Under optimal conditions, copper extraction reached 85%, in 8 days and microscopic observations by SEM–EDS of the on non-leached and leached material suggested that metal dissolution from the internal layers was restricted by the fact that metal surface was not entirely available and accessible for the solution in the case of the 20 mm-size sheets.

  3. Modular integration of electronics and microfluidic systems using flexible printed circuit boards.

    PubMed

    Wu, Amy; Wang, Lisen; Jensen, Erik; Mathies, Richard; Boser, Bernhard

    2010-02-21

    Microfluidic systems offer an attractive alternative to conventional wet chemical methods with benefits including reduced sample and reagent volumes, shorter reaction times, high-throughput, automation, and low cost. However, most present microfluidic systems rely on external means to analyze reaction products. This substantially adds to the size, complexity, and cost of the overall system. Electronic detection based on sub-millimetre size integrated circuits (ICs) has been demonstrated for a wide range of targets including nucleic and amino acids, but deployment of this technology to date has been limited due to the lack of a flexible process to integrate these chips within microfluidic devices. This paper presents a modular and inexpensive process to integrate ICs with microfluidic systems based on standard printed circuit board (PCB) technology to assemble the independently designed microfluidic and electronic components. The integrated system can accommodate multiple chips of different sizes bonded to glass or PDMS microfluidic systems. Since IC chips and flex PCB manufacturing and assembly are industry standards with low cost, the integrated system is economical for both laboratory and point-of-care settings.

  4. Modular integration of electronics and microfluidic systems using flexible printed circuit boards.

    PubMed

    Wu, Amy; Wang, Lisen; Jensen, Erik; Mathies, Richard; Boser, Bernhard

    2010-02-21

    Microfluidic systems offer an attractive alternative to conventional wet chemical methods with benefits including reduced sample and reagent volumes, shorter reaction times, high-throughput, automation, and low cost. However, most present microfluidic systems rely on external means to analyze reaction products. This substantially adds to the size, complexity, and cost of the overall system. Electronic detection based on sub-millimetre size integrated circuits (ICs) has been demonstrated for a wide range of targets including nucleic and amino acids, but deployment of this technology to date has been limited due to the lack of a flexible process to integrate these chips within microfluidic devices. This paper presents a modular and inexpensive process to integrate ICs with microfluidic systems based on standard printed circuit board (PCB) technology to assemble the independently designed microfluidic and electronic components. The integrated system can accommodate multiple chips of different sizes bonded to glass or PDMS microfluidic systems. Since IC chips and flex PCB manufacturing and assembly are industry standards with low cost, the integrated system is economical for both laboratory and point-of-care settings. PMID:20126694

  5. Evaluation of a recycling process for printed circuit board by physical separation and heat treatment.

    PubMed

    Fujita, Toyohisa; Ono, Hiroyuki; Dodbiba, Gjergj; Yamaguchi, Kunihiko

    2014-07-01

    Printed circuit boards (PCBs) from discarded personal computer (PC) and hard disk drive were crushed by explosion in water or mechanical comminution in order to disintegrate the attached parts. More parts were stripped from PCB of PC, composed of epoxy resin; than from PCB of household appliance, composed of phenol resin. In an attempt to raise the copper grade of PCB by removing other components, a carbonization treatment was investigated. The crushed PCB without surface-mounted parts was carbonized under a nitrogen atmosphere at 873-1073 K. After screening, the char was classified by size into oversized pieces, undersized pieces and powder. The copper foil and glass fiber pieces were liberated and collected in undersized fraction. The copper foil was liberated easily from glass fiber by stamping treatment. As one of the mounted parts, the multi-layered ceramic capacitors (MLCCs), which contain nickel, were carbonized at 873 K. The magnetic separation is carried out at a lower magnetic field strength of 0.1T and then at 0.8 T. In the +0.5mm size fraction the nickel grade in magnetic product was increased from 0.16% to 6.7% and the nickel recovery is 74%. The other useful mounted parts are tantalum capacitors. The tantalum capacitors were collected from mounted parts. The tantalum-sintered bodies were separated from molded resins by heat treatment at 723-773 K in air atmosphere and screening of 0.5mm. Silica was removed and 70% of tantalum grade was obtained after more than 823K heating and separation. Next, the evaluation of Cu recycling in PCB is estimated. Energy consumption of new process increased and the treatment cost becomes 3 times higher comparing the conventional process, while the environmental burden of new process decreased comparing conventional process. The nickel recovery process in fine ground particles increased energy and energy cost comparing those of the conventional process. However, the environmental burden decreased than the conventional

  6. Evaluation of a recycling process for printed circuit board by physical separation and heat treatment.

    PubMed

    Fujita, Toyohisa; Ono, Hiroyuki; Dodbiba, Gjergj; Yamaguchi, Kunihiko

    2014-07-01

    Printed circuit boards (PCBs) from discarded personal computer (PC) and hard disk drive were crushed by explosion in water or mechanical comminution in order to disintegrate the attached parts. More parts were stripped from PCB of PC, composed of epoxy resin; than from PCB of household appliance, composed of phenol resin. In an attempt to raise the copper grade of PCB by removing other components, a carbonization treatment was investigated. The crushed PCB without surface-mounted parts was carbonized under a nitrogen atmosphere at 873-1073 K. After screening, the char was classified by size into oversized pieces, undersized pieces and powder. The copper foil and glass fiber pieces were liberated and collected in undersized fraction. The copper foil was liberated easily from glass fiber by stamping treatment. As one of the mounted parts, the multi-layered ceramic capacitors (MLCCs), which contain nickel, were carbonized at 873 K. The magnetic separation is carried out at a lower magnetic field strength of 0.1T and then at 0.8 T. In the +0.5mm size fraction the nickel grade in magnetic product was increased from 0.16% to 6.7% and the nickel recovery is 74%. The other useful mounted parts are tantalum capacitors. The tantalum capacitors were collected from mounted parts. The tantalum-sintered bodies were separated from molded resins by heat treatment at 723-773 K in air atmosphere and screening of 0.5mm. Silica was removed and 70% of tantalum grade was obtained after more than 823K heating and separation. Next, the evaluation of Cu recycling in PCB is estimated. Energy consumption of new process increased and the treatment cost becomes 3 times higher comparing the conventional process, while the environmental burden of new process decreased comparing conventional process. The nickel recovery process in fine ground particles increased energy and energy cost comparing those of the conventional process. However, the environmental burden decreased than the conventional

  7. Effective electromagnetic shielding in multilayer printed circuit boards

    NASA Astrophysics Data System (ADS)

    Wiles, K. G.; Moe, J. L.

    Multilayer printed circuit boards have proven to be recurrent abettors of electromagnetic coupling problems created by the incessantly faster response times in integrated circuit technologies. Coupling within multilayer boards has not only inhibited meeting certain EMI requirements but has also precipitated 'self-inflicted' malfunctions commonly experienced during development of avionic systems. A recent avionic system, interfacing two asynchronous processors through a fourteen-layer motherboard, permitted coupling through ground plane connector apertures of sufficient amplitude and duration as to cause unintentional intercommunication and system malfunctions. The coupling mechanism and ground plane modifications which reduced this coupling by 40 dB and eliminated the incompatibility are discussed in this paper

  8. Printed circuit boards: a review on the perspective of sustainability.

    PubMed

    Canal Marques, André; Cabrera, José-María; Malfatti, Célia de Fraga

    2013-12-15

    Modern life increasingly requires newer equipments and more technology. In addition, the fact that society is highly consumerist makes the amount of discarded equipment as well as the amount of waste from the manufacture of new products increase at an alarming rate. Printed circuit boards, which form the basis of the electronics industry, are technological waste of difficult disposal whose recycling is complex and expensive due to the diversity of materials and components and their difficult separation. Currently, printed circuit boards have a fixing problem, which is migrating from traditional Pb-Sn alloys to lead-free alloys without definite choice. This replacement is an attempt to minimize the problem of Pb toxicity, but it does not change the problem of separation of the components for later reuse and/or recycling and leads to other problems, such as temperature rise, delamination, flaws, risks of mechanical shocks and the formation of "whiskers". This article presents a literature review on printed circuit boards, showing their structure and materials, the environmental problem related to the board, some the different alternatives for recycling, and some solutions that are being studied to reduce and/or replace the solder, in order to minimize the impact of solder on the printed circuit boards. PMID:24189538

  9. Printed circuit boards: a review on the perspective of sustainability.

    PubMed

    Canal Marques, André; Cabrera, José-María; Malfatti, Célia de Fraga

    2013-12-15

    Modern life increasingly requires newer equipments and more technology. In addition, the fact that society is highly consumerist makes the amount of discarded equipment as well as the amount of waste from the manufacture of new products increase at an alarming rate. Printed circuit boards, which form the basis of the electronics industry, are technological waste of difficult disposal whose recycling is complex and expensive due to the diversity of materials and components and their difficult separation. Currently, printed circuit boards have a fixing problem, which is migrating from traditional Pb-Sn alloys to lead-free alloys without definite choice. This replacement is an attempt to minimize the problem of Pb toxicity, but it does not change the problem of separation of the components for later reuse and/or recycling and leads to other problems, such as temperature rise, delamination, flaws, risks of mechanical shocks and the formation of "whiskers". This article presents a literature review on printed circuit boards, showing their structure and materials, the environmental problem related to the board, some the different alternatives for recycling, and some solutions that are being studied to reduce and/or replace the solder, in order to minimize the impact of solder on the printed circuit boards.

  10. Double sided circuit board and a method for its manufacture

    DOEpatents

    Lindenmeyer, Carl W.

    1989-07-04

    Conductance between the sides of a large double sided printed circuit board is provided using a method which eliminates the need for chemical immersion or photographic exposure of the entire large board. A plurality of through-holes are drilled or punched in a substratum according to the desired pattern, conductive laminae are made to adhere to both sides of the substratum covering the holes and the laminae are pressed together and permanently joined within the holes, providing conductive paths.

  11. Double sided circuit board and a method for its manufacture

    DOEpatents

    Lindenmeyer, C.W.

    1988-04-14

    Conductance between the sides of a large double sided printed circuit board is provided using a method which eliminates the need for chemical immersion or photographic exposure of the entire large board. A plurality of through-holes are drilled or punched in a substratum according to the desired pattern, conductive laminae are made to adhere to both sides of the substratum covering the holes and the laminae are pressed together and permanently joined within the holes, providing conductive paths. 4 figs.

  12. Double sided circuit board and a method for its manufacture

    DOEpatents

    Lindenmeyer, Carl W.

    1989-01-01

    Conductance between the sides of a large double sided printed circuit board is provided using a method which eliminates the need for chemical immersion or photographic exposure of the entire large board. A plurality of through-holes are drilled or punched in a substratum according to the desired pattern, conductive laminae are made to adhere to both sides of the substratum covering the holes and the laminae are pressed together and permanently joined within the holes, providing conductive paths.

  13. Note: Design and construction of a simple and reliable printed circuit board-substrate Bradbury-Nielsen gate for ion mobility spectrometry

    NASA Astrophysics Data System (ADS)

    Du, Yongzhai; Cang, Huaiwen; Wang, Weiguo; Han, Fenglei; Chen, Chuang; Li, Lin; Hou, Keyong; Li, Haiyang

    2011-08-01

    A less laborious, structure-simple, and performance-reliable printed circuit board (PCB) based Bradbury-Nielsen gate for high-resolution ion mobility spectrometry was introduced and investigated. The gate substrate was manufactured using a PCB etching process with small holes (Φ 0.1 mm) drilled along the gold-plated copper lines. Two interdigitated sets of rigid stainless steel spring wire (Φ 0.1 mm) that stands high temperature and guarantees performance stability were threaded through the holes. Our homebuilt ion mobility spectrometer mounted with the gate gave results of about 40 for resolution while keeping a signal intensity of over 0.5 nano-amperes.

  14. Laser Processing of Thin Glass Printed Circuit Boards with a Picosecond Laser at 515 nm Wavelength

    NASA Astrophysics Data System (ADS)

    Plat, K.; Witzendorff, P. v.; Suttmann, O.; Overmeyer, L.

    High temperature applications of printed circuit boards (PCB)require materials with specifically adapted properties. Hence, conventional electrically isolating glass fiber and epoxy-resin materials have to be replaced by thin borosilicate glass.Therefore, an industrially suitable process to remove the metal coatings from the brittle thin glass has to be developed. Laser processing has the advantage of individualization for the production of customer-specific PCBs. Thus, laser ablation of metal coatings for electrical isolation is investigated with different material composites based on thin glass.The study aims to identify a laser process for a picosecond laser source with 515 nm wavelength to perform the process without damaging the glass substrate with a high throughput.

  15. Longitudinal Ultrasonic Bonding of Electrodes between Rigid and Flexible Printed Circuit Boards

    NASA Astrophysics Data System (ADS)

    Lee, Jong-Bum; Koo, Ja-Myeong; Hong, Soon-Min; Shin, Hyoyoung; Moon, Young-jun; Jung, Jae-Pil; Yoo, Choong-Don; Jung, Seung-Boo

    2008-05-01

    In this study, two electrodes between a flexible printed circuit board (FPCB) and a rigid PCB (RPCB) are bonded using longitudinal ultrasonic vibration. The surface finish of the electrode of the RPCB is fixed as an electroless Ni/immersion Au (ENIG), whereas two different surface finishes are employed for the FPCB: immersion Sn and ENIG. Electrodes of the RPCB and FPCB are successfully bonded using longitudinal ultrasonic vibration. While a continuous intermetallic compound (IMC) of (CuxAu1-x)6Sn5 is formed at the ENIG/Sn interface, a Au-Ni-P reaction layer is formed with an un-bonded region at the ENIG/ENIG interface. The peel strength of the ENIG/Sn joint is higher than that of the ENIG/ENIG joint. Results of peel tests show that the bonding conditions have a significant effect on joint integrity.

  16. Environmental friendly automatic line for recovering metal from waste printed circuit boards.

    PubMed

    Li, Jia; Xu, Zhenming

    2010-02-15

    The technology industrialization was the final goal of the research. A set of automatic line without negative impact to environment for recycling waste printed circuit boards (PCB) in industry-scale was investigated in this study. The independent technologies were integrated and many problems in the process of technology industrialization were solved. The whole technology contained four parts: multiple scarping, material screening, multiple-roll corona electrostatic separator, and dust precipitation. The output of this automatic line reached 600 kg/h and the recovery rate of copper reached 95%. After separation, the metal and nonmetal products were totally reused. Compared with other production lines (traditional fluid bed production line and processing from developed countries), the automatic line has lower energy consumption and better technology rationality. The cost of this line was in acceptable level for local processors. PMID:20092305

  17. Electrostatic separation for recycling waste printed circuit board: a study on external factor and a robust design for optimization.

    PubMed

    Hou, Shibing; Wu, Jiang; Qin, Yufei; Xu, Zhenming

    2010-07-01

    Electrostatic separation is an effective and environmentally friendly method for recycling waste printed circuit board (PCB) by several kinds of electrostatic separators. However, some notable problems have been detected in its applications and cannot be efficiently resolved by optimizing the separation process. Instead of the separator itself, these problems are mainly caused by some external factors such as the nonconductive powder (NP) and the superficial moisture of feeding granule mixture. These problems finally lead to an inefficient separation. In the present research, the impacts of these external factors were investigated and a robust design was built to optimize the process and to weaken the adverse impact. A most robust parameter setting (25 kv, 80 rpm) was concluded from the experimental design. In addition, some theoretical methods, including cyclone separation, were presented to eliminate these problems substantially. This will contribute to efficient electrostatic separation of waste PCB and make remarkable progress for industrial applications.

  18. New printed circuit boards magnetic coils in the vacuum vessel of J-TEXT tokamak for position measurement

    SciTech Connect

    Qiu, S. S.; Zhuang, G.; Zhang, M.; Xia, D. H.; Rao, B.; Zhang, X. Q.; Pan, Y.; Gentle, K.

    2010-10-15

    Four sets of magnetic diagnostic coils, which are printed on machinable ceramic printed circuit boards (PCB), are designed, fabricated, installed, and tested in the Joint Texas Experimental Tokamak (J-TEXT) vacuum vessel for detecting the plasma radial and vertical displacements relative to the geometric center of the vacuum vessel in Ohmic discharges. Each coordinate is determined by a pair of variable cross-section Rogowski and saddle coils, which measure the tangential and normal magnetic fields (relative to the coil surface). These coils are suitable for mass production and offer advantages in vacuum compatibility and temperature tolerance that are important for J-TEXT. Position measurements using PCB coils are compared with those from soft x-ray image system and match the position well.

  19. New printed circuit boards magnetic coils in the vacuum vessel of J-TEXT tokamak for position measurementa)

    NASA Astrophysics Data System (ADS)

    Qiu, S. S.; Zhuang, G.; Zhang, M.; Xia, D. H.; Rao, B.; Zhang, X. Q.; Pan, Y.; Gentle, K.

    2010-10-01

    Four sets of magnetic diagnostic coils, which are printed on machinable ceramic printed circuit boards (PCB), are designed, fabricated, installed, and tested in the Joint Texas Experimental Tokamak (J-TEXT) vacuum vessel for detecting the plasma radial and vertical displacements relative to the geometric center of the vacuum vessel in Ohmic discharges. Each coordinate is determined by a pair of variable cross-section Rogowski and saddle coils, which measure the tangential and normal magnetic fields (relative to the coil surface). These coils are suitable for mass production and offer advantages in vacuum compatibility and temperature tolerance that are important for J-TEXT. Position measurements using PCB coils are compared with those from soft x-ray image system and match the position well.

  20. Testing of printed circuit board solder joints by optical correlation

    NASA Technical Reports Server (NTRS)

    Espy, P. N.

    1975-01-01

    An optical correlation technique for the nondestructive evaluation of printed circuit board solder joints was evaluated. Reliable indications of induced stress levels in solder joint lead wires are achievable. Definite relations between the inherent strength of a solder joint, with its associated ability to survive stress, are demonstrable.

  1. Handwritten, Soft Circuit Boards and Antennas Using Liquid Metal Nanoparticles.

    PubMed

    Lin, Yiliang; Cooper, Christopher; Wang, Meng; Adams, Jacob J; Genzer, Jan; Dickey, Michael D

    2015-12-22

    Soft conductors are created by embedding liquid metal nanoparticles between two elastomeric sheets. Initially, the particles form an electrically insulating composite. Soft circuit boards can be handwritten by a stylus, which sinters the particles into conductive traces by applying localized mechanical pressure to the elastomeric sheets. Antennas with tunable frequencies are formed by sintering nanoparticles in microchannels.

  2. Printed-Circuit-Board Soldering Training for Group IV Personnel.

    ERIC Educational Resources Information Center

    Hooprich, E. A.; Matlock, E. W.

    As part of a larger program to determine which Navy skills can be learned by lower aptitude personnel, and which methods and techniques would be most effective, an experimental course in printed circuit board soldering was given to 186 Group IV students in 13 classes. Two different training approaches--one stressing instructor guidance and the…

  3. Biodegradable materials for multilayer transient printed circuit boards.

    PubMed

    Huang, Xian; Liu, Yuhao; Hwang, Suk-Won; Kang, Seung-Kyun; Patnaik, Dwipayan; Cortes, Jonathan Fajardo; Rogers, John A

    2014-11-19

    Biodegradable printed circuit boards based on water-soluble materials are demonstrated. These systems can dissolve in water within 10 mins to yield end-products that are environmentally safe. These and related approaches have the potential to reduce hazardous waste streams associated with electronics disposal.

  4. A model for computing the trajectories of the conducting particles from waste printed circuit boards in corona electrostatic separators.

    PubMed

    Li, Jia; Lu, Hongzhou; Xu, Zhenming; Zhou, Yaohe

    2008-02-28

    A model for computing the trajectory of conducting particle from waste printed circuit board (PCB) scraps in corona electrostatic separator is established. Using analytical expression for computing non-uniformity of the electric field in the active zone of the separator and the differential method were used for computing the trajectories of conducting particles in the air, after detachment. The result shows that the trajectory of conducting particle can be computed under various initial parameters (R, r, L, alpha, U, n; rho, r0) by the computing model and the computing results have a good agreement with the actual separating process. This model offers a possible for designing the new corona electrostatic separator.

  5. Preparation of hierarchical porous carbon from waste printed circuit boards for high performance electric double-layer capacitors

    NASA Astrophysics Data System (ADS)

    Du, Xuan; Wang, Li; Zhao, Wei; Wang, Yi; Qi, Tao; Li, Chang Ming

    2016-08-01

    Renewable clean energy and resources recycling have become inevitable choices to solve worldwide energy shortages and environmental pollution problems. It is a great challenge to recycle tons of waste printed circuit boards (PCB) produced every year for clean environment while creating values. In this work, low cost, high quality activated carbons (ACs) were synthesized from non-metallic fractions (NMF) of waste PCB to offer a great potential for applications of electrochemical double-layer capacitors (EDLCs). After recovering metal from waste PCB, hierarchical porous carbons were produced from NMF by carbonization and activation processes. The experimental results exhibit that some pores were formed after carbonization due to the escape of impurity atoms introduced by additives in NMF. Then the pore structure was further tailored by adjusting the activation parameters. Roles of micropores and non-micropores in charge storage were investigated when the hierarchical porous carbons were applied as electrode of EDLCs. The highest specific capacitance of 210 F g-1 (at 50 mA g-1) and excellent rate capability were achieved when the ACs possessing a proper micropores/non-micropores ratio. This work not only provides a promising method to recycle PCB, but also investigates the structure tailoring arts for a rational hierarchical porous structure in energy storage/conversion.

  6. Suppressing effect of calcium-based waste on control of bromine flux during the pyrolysis of printed circuit boards.

    PubMed

    Jie, Guan; Min, Xu; Wu, Wenjie; Zhang, Chenglong; Wang, Jingwei; Bai, Jianfeng

    2012-11-01

    The effect of calcium-based addition on the brominate flux during printed circuit board (PCB) pyrolysis was investigated. It was found that bromine (Br) can be effectively fixed in solid phase during PCB pyrolysis by adding calcium-based waste materials. Phenol and 4-ethylphenol are the major products of pyrolysis. When the two kinds of red mud were used as additive, their content was 85.25 and 84.81%, respectively, which was higher than others. The 2-bromophenol and 2-bromo-4-methyl-benzene are the main Br-containing pyrolysis volatiles. After adding calcium-based additive, these two volatiles were apparently reduced and only small amounts of 2-bromo-4-methyl-benzene were detected in the products, namely 0.71 and 0.86%, respectively for the two kinds of red mud. Hence, no matter from the perspective of product use or simple Br-fixing, the bromine in the three-phase products can be effectively regulated and controlled by adding calcium-based waste residue during PCB pyrolysis. Finally, the Br-fixing mechanism was analysed. As a result, when calcium-based waste materials were added to the PCB pyrolysis it made bromine fix easily in the resident yielding a byproduct that can be further used.

  7. Sampling and Control Circuit Board for an Inertial Measurement Unit

    NASA Technical Reports Server (NTRS)

    Chelmins, David; Powis, Rick

    2012-01-01

    Spacesuit navigation is one component of NASA s efforts to return humans to the Moon. Studies performed at the NASA Glenn Research Center (GRC) considered various navigation technologies and filtering approaches to enable navigation on the lunar surface. As part of this effort, microelectromechanical systems (MEMS) inertial measurement units (IMUs) were studied to determine if they could supplement a radiometric infrastructure. MEMS IMUs were included in the Lunar Extra-Vehicular Activity Crewmember Location Determination System (LECLDS) testbed during NASA s annual Desert Research and Technology Studies (D-RATS) event in 2009 and 2010. The testbed included one IMU in 2009 and three IMUs in 2010, along with a custom circuit board interfacing between the navigation processor and each IMU. The board was revised for the 2010 test, and this paper documents the design details of this latest revision of the interface circuit board and firmware.

  8. Interfacial and mechanical property analysis of waste printed circuit boards subject to thermal shock.

    PubMed

    Li, Jinhui; Duan, Huabo; Yu, Keli; Wang, Siting

    2010-02-01

    Waste printed circuit boards (PCBs) are the focal points for handling electric and electronic waste. In this paper, a thermal shock method was used to pretreat waste PCBs for the improvement of crushing performance. The influence of the thermal shock process on interfacial modification and mechanical property attenuation of PCB waste was studied. The appearance and layer spacing of the basal plane began to change slightly when the temperature reached 200 degrees C. By 250 degrees C, apparent bulging, cracking, and delamination were observed. However, pyrolysis of PCBs occurred when the temperature reached 275 degrees C, where PCBs were carbonized. The thermogravimetric analysis of PCB particles under vacuum showed that 270 degrees C was the starting point of pyrolysis. The tensile and impact strength of PCBs were reduced as shock temperature rose gradually, with a reduction by 2.6 and 16.5%, respectively, at 250 degrees C from its unheated strength. The PCBs that were heated to 250 degrees C achieved 100% liberation, increasing linearly from 13.6% for unheated PCBs through a single-level shear-crusher (2-mm mesh) and resulting in an obvious reduction of 9.5% (dB) in dust and noise at 250 degrees C. These parameters could be helpful for establishing the operational setup for industrial-scale facilities with the aim of achieving a compact process and a highly efficient recovery for waste PCBs compared with those of the traditional combination mechanical technologies.

  9. Effect of High-Humidity Testing on Material Parameters of Flexible Printed Circuit Board Materials

    NASA Astrophysics Data System (ADS)

    Lahokallio, Sanna; Saarinen, Kirsi; Frisk, Laura

    2013-09-01

    The tendency of polymers to absorb moisture impairs especially their electrical and mechanical properties. These are important characteristics for printed circuit board (PCB) materials, which should provide mechanical support as well as electrical insulation in many different environments in order to guarantee safe operation for electrical devices. Moreover, the effects of moisture are accelerated at increased temperatures. In this study, three flexible PCB dielectric materials, namely polyimide (PI), fluorinated ethylene-propylene (FEP), and polyethylene terephthalate (PET), were aged over different periods of time in a high-humidity test, in which the temperature was 85°C and relative humidity 85%. After aging, the changes in the structure of the polymers were studied by determining different material parameters such as modulus of elasticity, glass-transition temperature, melting point, coefficient of thermal expansion, water absorption, and crystallinity, and changes in the chemical structure with several techniques including thermomechanical analysis, differential scanning calorimetry, Fourier-transform infrared spectroscopy, moisture analysis, and a precision scale. The results showed that PI was extremely stable under the aging conditions and therefore an excellent choice for electrical applications under harsh conditions. Similarly, FEP proved to be relatively stable under the applied aging conditions. However, its crystallinity increased markedly during aging, and after 6000 h of aging the results indicated oxidation. PET suffered from hydrolysis during the test, leading to its embrittlement after 2000 h of aging.

  10. Ion track enabled multiple wire microvia interconnects in printed circuit boards

    NASA Astrophysics Data System (ADS)

    Yousef, H.; Lindeberg, M.; Hjort, K.

    2008-04-01

    As the call for higher wiring density in packaging and vertical microvia interconnections (microvias) rapidly evolves, the need for smaller lateral dimensions in printed circuit boards (PCB) microvias must be met. The ion track lithography described in this paper allows for high throughput micromachining of small, deep, vertical microvias in flexible PCB and all-polymer laminates. Ion track lithography makes use of swift heavy ion irradiation to enhance the selectivity and directionality of chemical etching. Within the areas exposed to the ion irradiation, small sub-micron pores (capillaries) are created, one for every ion. If etching is prolonged, the pores become merged. Electrodeposition from a metallic seed layer is used to fill these structures with metal. The lithography masks define either the areas where the ion tracks are developed or where the tracks are metallized. The smallest achievable size of the microvias is only limited by the resolution of the mask; microvias below 10 μm in diameter can also be achieved also in thick polyimide foils. Since each impinging ion forms one track, the foil's porosity can be controlled by adjusting the irradiation dose, as well as by etching the pores to a suitable size. Depending on the porosity and material, the resultant metallized microvia consists of either individual or interlaced wires (like strands in a bundle wire), or is a solid. As an individual sub-micron wire may have an aspect ratio of several hundreds, this allows for the fabrication of truly vertical microvia structures, allowing ultra-high density microvia batch production. Demonstrator microstructures with highly vertical microvias have been fabricated in foils up to 125 μm thickness. Several components integrated in flexible PCB have been presented by us, e.g. magnetoresistive sensors, thermopile IR-sensors and microwave components like inductor elements.

  11. Investigation of Solder Cracking Problems on Printed Circuit Boards

    NASA Technical Reports Server (NTRS)

    Berkebile, M. J.

    1967-01-01

    A Solder Committee designated to investigate a solder cracking phenomena occurring on the SATURN electrical/electronic hardware found the cause to be induced stress in the soldered connections rather than faulty soldering techniques. The design of the printed circuit (PC) board assemblies did not allow for thermal expansion of the boards that occurred during normal operation. The difference between the thermal expansion properties of the boards and component lead materials caused stress and cracking in the soldered connections. The failure mechanism and various PC boards component mounting configurations are examined in this report. Effective rework techniques using flanged tubelets, copper tubelets, and soft copper wiring are detailed. Future design considerations to provide adequate strain relief in mounting configurations are included to ensure successful solder terminations.

  12. Evaluation of gold and silver leaching from printed circuit board of cellphones

    SciTech Connect

    Petter, P.M.H. Veit, H.M.; Bernardes, A.M.

    2014-02-15

    Highlights: • Printed circuit boards (PCB) of mobile phones have large amounts of metals with high economic value such as gold and silver. • Dissolution of gold was done with a cyanide-based reagent and silver with nitric acid. • Leaching of PCB with Na{sub 2}S{sub 2}O{sub 3} and (NH{sub 4}){sub 2}S{sub 2}O{sub 3} to examine the feasibility of using these reagents was done. - Abstract: Electronic waste has been increasing proportionally with the technology. So, nowadays, it is necessary to consider the useful life, recycling, and final disposal of these equipment. Metals, such as Au, Ag, Cu, Sn and Ni can be found in the printed circuit boards (PCB). According to this, the aims of this work is to characterize the PCBs of mobile phones with aqua regia; obtaining “reference” values of leaching, to gold and silver, with cyanide and nitric acid, respectively; and study the process of leaching of these metals in alternative leaching with sodium thiosulfate and ammonium thiosulfate. The metals were characterized by digesting the sample with aqua regia for 1 and 2 h at 60 °C and 80 °C. The leaching of Au with a commercial reagent (cyanide) and the Ag with HNO{sub 3}were made. The leaching of Au and Ag with alternative reagents: Na{sub 2}S{sub 2}O{sub 3,} and (NH{sub 4}){sub 2}S{sub 2}O{sub 3} in 0.1 M concentration with the addition of CuSO{sub 4}, NH{sub 4}OH, and H{sub 2}O{sub 2}, was also studied. The results show that the digestion with aqua regia was efficient to characterize the metals present in the PCBs of mobile phones. However, the best method to solubilize silver was by digesting the sample with nitric acid. The leaching process using sodium thiosulfate was more efficient when an additional concentration of 0.015 and 0.030 M of the CuSO{sub 4} was added.

  13. Coaxial connector for use with printed circuit board edge connector

    DOEpatents

    Howard, Donald R.; MacGill, Robert A.

    1989-01-01

    A coaxial cable connector for interfacing with an edge connector for a printed circuit board whereby a coaxial cable can be interconnected with a printed circuit board through the edge connector. The coaxial connector includes a body having two leg portions extending from one side for receiving the edge connector therebetween, and a tubular portion extending from an opposing side for receiving a coaxial cable. A cavity within the body receives a lug of the edge connector and the center conductor of the coaxial cable. Adjacent lugs of the edge connector can be bend around the edge connector housing to function as spring-loaded contacts for receiving the coaxial connector. The lugs also function to facilitate shielding of the center conductor where fastened to the edge connector lug.

  14. Prototype circuit boards assembled with non-lead bearing solders

    SciTech Connect

    Vianco, P.T.; Rejent, J.A.

    1998-04-01

    The 91.84Sn-3.33Ag-4.83Bi and 96.5Sn-3.5Ag Pb-free solders were evaluated for surface mount circuit board interconnects. The 63Sn-37Pb solder provided the baseline data. All three solders exhibited suitable manufacturability per a defect analyses of circuit board test vehicles. Thermal cycling had no significant effect on the 91.84Sn-3.33Ag-4.83Bi solder joints. Some degradation in the form of grain boundary sliding was observed in 96.5Sn-3.5Ag and 63Sn-37Pb solder joints. The quality of the solder joint microstructures showed a slight degree of degradation under thermal shock exposure for all of the solders tested. Trends in the solder joint shear strengths could be traced to the presence of Pd in the solder, the source of which was the Pd/Ni finish on the circuit board conductor features. The higher, intrinsic strengths of the Pb-free solders encouraged the failure path to be located in proximity to the solder/substrate interface where Pd combined with Sn to form brittle PdSn{sub 4} particles, resulting in reduced shear strengths.

  15. Pollution prevention assessment for a printed circuit board plant

    SciTech Connect

    Edwards, H.W.; Kostrzewa, M.F.; Looby, G.P.

    1995-09-01

    The US Environmental Protection Agency (EPA) has funded a pilot project to assist small and medium-size manufacturers who want to minimize their generation of waste but who lack the expertise to do so. In an effort to assist these manufacturers Waste Minimization Assessment Centers (WMACs) were established at selected universities and procedures were adapted from the EPA Waste Minimization Opportunity Assessment Manual. The WMAC team at Colorado State University performed an assessment at a plant that manufacturers printed circuit boards. Templates for the circuit design are generated from customer-supplied circuit information. Copper/epoxy laminates and copper foil are cut into blank boards and layers. Circuit patterns are generated through a series of photolithographic and plating processes. The team`s report, detailing findings and recommendations, indicated that the onsite ion-exchange treatment of metal-containing rinse water generates regenerant solutions that could be further treated by electrowinning to recover metals and to achieve significant cost savings. This Research Brief was developed by the principal investigators and EPA`s National Risk Management Research Laboratory, Cincinnati, OH, to announce key findings of an ongoing research project that is fully documented in a separate report of the same title available from University City Science Center.

  16. An Investigation into the Package and Printed Circuit Board Assembly Solutions of an Ultrathin Coreless Flip-Chip Substrate

    NASA Astrophysics Data System (ADS)

    Chang, Jing-Yao; Chaung, Tung-Han; Chang, Tao-Chih

    2015-10-01

    Flip-chip technology has been widely accepted as a solution for electronic packaging of high-pin-count devices. Due to the demand for smaller and thinner package dimensions, coreless build-up substrates will be used in industry to carry the die by solder bumps due to the advantages of shorter transmission route and lower inductance and thermal resistance. However, coefficient of thermal expansion (CTE) mismatch between the Cu trace and the laminate often causes the coreless substrate to warp, which leads to failures such as nonwetted solder bumps and interfacial cracking during assembly and reliability tests. In a previous study, assembly of a six-layer polyimide-based coreless flip-chip package was achieved by a 17 mm × 17 mm die with 4355 Sn-37Pb solder bumps, an amide-based underfill, and 1521 Sn-3.0Ag-0.5Cu solder balls. For determination of its board-level reliability characteristics, the component was mounted on a printed circuit board (PCB) using a conventional surface mount technology, and 10 test vehicles were assembled for assessment of their reliability under a temperature cycling environment. The experimental results show that the characteristic life of the PCB assembly exceeded 1500 cycles and that failure resulted from fracture of the outermost solder balls on the substrate side. This was different from the failure mode of die cracking when the package experienced hundreds of temperature cycles at the component level because the rigid PCB, through solder balls, moderated the deformation of the coreless flip-chip package. Hence, the concentrated bending stress at the die edge region was lowered. Finally, the local CTE mismatch between the stiffener and the PCB dominated the fatigue fracture of the outermost solder balls to become the main failure mode.

  17. Use of large pieces of printed circuit boards for bioleaching to avoid ‘precipitate contamination problem’ and to simplify overall metal recovery

    PubMed Central

    Adhapure, N.N.; Dhakephalkar, P.K.; Dhakephalkar, A.P.; Tembhurkar, V.R.; Rajgure, A.V.; Deshmukh, A.M.

    2014-01-01

    Very recently bioleaching has been used for removing metals from electronic waste. Most of the research has been targeted to using pulverized PCBs for bioleaching where precipitate formed during bioleaching contaminates the pulverized PCB sample and making the overall metal recovery process more complicated. In addition to that, such mixing of pulverized sample with precipitate also creates problems for the final separation of non metallic fraction of PCB sample. In the present investigation we attempted the use of large pieces of printed circuit boards instead of pulverized sample for removal of metals. Use of large pieces of PCBs for bioleaching was restricted due to the chemical coating present on PCBs, the problem has been solved by chemical treatment of PCBs prior to bioleaching. In short,•Large pieces of PCB can be used for bioleaching instead of pulverized PCB sample.•Metallic portion on PCBs can be made accessible to bacteria with prior chemical treatment of PCBs.•Complete metal removal obtained on PCB pieces of size 4 cm × 2.5 cm with the exception of solder traces. The final metal free PCBs (non metallic) can be easily recycled and in this way the overall recycling process (metallic and non metallic part) of PCBs becomes simple. PMID:26150951

  18. Use of large pieces of printed circuit boards for bioleaching to avoid 'precipitate contamination problem' and to simplify overall metal recovery.

    PubMed

    Adhapure, N N; Dhakephalkar, P K; Dhakephalkar, A P; Tembhurkar, V R; Rajgure, A V; Deshmukh, A M

    2014-01-01

    Very recently bioleaching has been used for removing metals from electronic waste. Most of the research has been targeted to using pulverized PCBs for bioleaching where precipitate formed during bioleaching contaminates the pulverized PCB sample and making the overall metal recovery process more complicated. In addition to that, such mixing of pulverized sample with precipitate also creates problems for the final separation of non metallic fraction of PCB sample. In the present investigation we attempted the use of large pieces of printed circuit boards instead of pulverized sample for removal of metals. Use of large pieces of PCBs for bioleaching was restricted due to the chemical coating present on PCBs, the problem has been solved by chemical treatment of PCBs prior to bioleaching. In short,•Large pieces of PCB can be used for bioleaching instead of pulverized PCB sample.•Metallic portion on PCBs can be made accessible to bacteria with prior chemical treatment of PCBs.•Complete metal removal obtained on PCB pieces of size 4 cm × 2.5 cm with the exception of solder traces. The final metal free PCBs (non metallic) can be easily recycled and in this way the overall recycling process (metallic and non metallic part) of PCBs becomes simple. PMID:26150951

  19. Exhaust constituent emission factors of printed circuit board pyrolysis processes and its exhaust control.

    PubMed

    Chiang, Hung-Lung; Lin, Kuo-Hsiung

    2014-01-15

    The printed circuit board (PCB) is an important part of electrical and electronic equipment, and its disposal and the recovery of useful materials from waste PCBs (WPCBs) are key issues for waste electrical and electronic equipment. Waste PCB compositions and their pyrolysis characteristics were analyzed in this study. In addition, the volatile organic compound (VOC) exhaust was controlled by an iron-impregnated alumina oxide catalyst. Results indicated that carbon and oxygen were the dominant components (hundreds mg/g) of the raw materials, and other elements such as nitrogen, bromine, and copper were several decades mg/g. Exhaust constituents of CO, H2, CH4, CO2, and NOx, were 60-115, 0.4-4.0, 1.1-10, 30-95, and 0-0.7mg/g, corresponding to temperatures ranging from 200 to 500°C. When the pyrolysis temperature was lower than 300°C, aromatics and paraffins were the major species, contributing 90% of ozone precursor VOCs, and an increase in the pyrolysis temperature corresponded to a decrease in the fraction of aromatic emission factors. Methanol, ethylacetate, acetone, dichloromethane, tetrachloromethane and acrylonitrile were the main species of oxygenated and chlorinated VOCs. The emission factors of some brominated compounds, i.e., bromoform, bromophenol, and dibromophenol, were higher at temperatures over 400°C. When VOC exhaust was flowed through the bed of Fe-impregnated Al2O3, the emission of ozone precursor VOCs could be reduced by 70-80%. PMID:24239260

  20. Laser-induced breakdown spectroscopy (LIBS) combined with hyperspectral imaging for the evaluation of printed circuit board composition.

    PubMed

    Carvalho, Rodrigo R V; Coelho, Jomarc A O; Santos, Jozemir M; Aquino, Francisco W B; Carneiro, Renato L; Pereira-Filho, Edenir R

    2015-03-01

    In this study, laser-induced breakdown spectroscopy (LIBS) was combined with chemometric strategies (PCA, Principal Component Analysis) and scanning electron microscopy with energy-dispersive X-ray spectroscopy (SEM-EDS) to investigate the metal composition of a printed circuit board (PCB) sample from a mobile phone. Scanning electron microscopy-EDS was used for two main reasons: it was possible at the same time to visualize the sample surface, craters (made by the laser pulses) and also the chemical composition of the samples. A 30 mm×40 mm area of the mobile phone PCB sample, which was manufactured in 2011, was investigated. In this case, a matrix with 30 rows and 40 columns (1200 points) was analyzed, and 10 pulses were performed at each point. A total of 12,000 emission spectra were recorded in the wavelength range from 186 to 1040 nm. After an initial exploratory investigation using PCA, 18 emission lines were selected (representing the elements Al, Au, Ba, Ca, Co, Cu, Fe, K, Li, Mg, Mn, Na, Ni, Sb, Si, Sn, Ti and Zn) and then normalized by the relative intensities, and a new PCA was calculated with the autoscaled data. For example, Au and Si were mainly observed in the superficial electrical contacts and in the bulk of the PCB, respectively. A second sample (a mouse PCB) was also analyzed and Pb (emission lines 357.273, 363.956, 368.346, 373.994 and 405.780 nm) was identified in the solders. In addition, this element was determined using FAAS (flame atomic absorption spectrometry) and the Pb concentration was around 25% (w/w). This study opens the possibility for improved recycling processes and the chemical investigation of solid samples measuring a few millimeters in dimension without sample preparation.

  1. Development of two-step process for enhanced biorecovery of Cu-Zn-Ni from computer printed circuit boards.

    PubMed

    Shah, Monal B; Tipre, Devayani R; Purohit, Mamta S; Dave, Shailesh R

    2015-08-01

    Metal pollution due to the huge electronic waste (E-waste) accumulation is widespread across the globe. Extraction of copper, zinc and nickel from computer printed circuit boards (c-PCB) with a two-step bleaching process using ferric sulphate generated by Leptospirillum ferriphilum dominated consortium and the factors influencing the process were investigated in the present study. The studied factors with 10 g/L pulp density showed that pH 2.0 was optimum which resulted in 87.50-97.80% Cu-Zn-Ni extraction. Pre-treatment of PCB powder with acidified distilled water and NaCl solution showed 3.80-7.98% increase in metal extraction corresponding to 94.08% Cu, 99.80% Zn and 97.99% Ni extraction. Particle size of 75 μm for Cu and Zn while 1680 μm for Ni showed 2-folds increase in metal extraction, giving 97.35-99.80% Cu-Zn-Ni extraction in 2-6 days of reaction time. Whereas; 2.76-3.12 folds increase in Cu and Zn extraction was observed with the addition of 0.1% chelating agents. When the studies were carried out with high pulp density, ferric iron concentration of 16.57 g/L was found to be optimum for metal extraction from 75 g/L c-PCB and c-PCB addition in multiple installments resulted in 8.81-26.35% increase in metal extraction compared to single addition. The studied factors can be implemented for the scale-up aimed at faster recovery of multimetals from E-waste and thereby providing a secondary source of metal in an eco-friendly manner.

  2. Ion chromatography in the manufacture of multilayer circuit boards

    NASA Astrophysics Data System (ADS)

    Smith, Robert E.

    1990-01-01

    Ion chromatography (IC) has proven useful in analyzing chemical solutions used in the manufacture of multilayer circuit boards. Unlike other chemical quantification techniques, IC provides results on ions not expected in the production solutions. Thus, solution contamination and break-down products can be monitored in every phase of the circuit board manufacturing. During the first phase, epoxy laminates experience an etchback, first in chromic acid, which can be analyzed for trace chloride and sulfate, then in ammonium bifluoride/HCl, which can be analyzed for fluoride and chloride. Following a wet-blasting to roughen up the surface, 20 microinches of copper are deposited using an electroless bath. Again, IC is applicable for monitoring formate, tartarate, and sulfate levels. Next, an acid copper bath is used to electroplate the through holes with 0.001 inches of ductile copper. This bath is analyzed for trace chloride. Photoimaging is then performed, and the organic solvents used can be assayed for trace ionic chloride. Finally, a fluoroboric acid-based tin-lead bath is used to deposit a solderable alloy. This bath is analyzed for fluoroborate, tin, and lead. In addition, mobile phase ion chromatography (MPIC) is used to monitor the nonionic organic brighteners in the baths.

  3. Ion chromatography in the manufacture of multilayer circuit boards

    NASA Astrophysics Data System (ADS)

    Smith, R. E.

    1987-10-01

    Ion chromatography (IC) has proven useful in analyzing chemical solutions used in the manufacture of multilayer circuit boards. IC provides results on ions not expected in the production solutions. Thus, solution contamination and breakdown products can be monitored in every phase of the circuit board manufacturing. During the first phase, epoxy laminates experience an etchback, first in chromic acid, which can be analyzed for trace chloride and sulfate, then in ammonium bifluoride/HCl, which can be analyzed for fluoride and chloride. Following a wet blasting to roughen up the surface, 20 mu in. of copper are deposited using an electroless bath. Again, IC is applicable for monitoring formate, tartarate, and sulfate levels. Next, an acid copper bath is used to electroplate the through holes with 0.001 in. of ductile copper. This bath is analyzed for trace chloride. Photoimaging is then performed, and the organic solvents used can be assayed for trace ionic chloride. Finally, a fluoroboric acid-based tin-lead bath is used to deposit a solderable alloy. This bath is analyzed for total fluoroborate, tin, and lead. In addition, mobile phase ion chromatography (MPIC) is used to monitor the nonionic organic brighteners in the baths.

  4. Volumetric segmentation of range images for printed circuit board inspection

    NASA Astrophysics Data System (ADS)

    Van Dop, Erik R.; Regtien, Paul P. L.

    1996-10-01

    Conventional computer vision approaches towards object recognition and pose estimation employ 2D grey-value or color imaging. As a consequence these images contain information about projections of a 3D scene only. The subsequent image processing will then be difficult, because the object coordinates are represented with just image coordinates. Only complicated low-level vision modules like depth from stereo or depth from shading can recover some of the surface geometry of the scene. Recent advances in fast range imaging have however paved the way towards 3D computer vision, since range data of the scene can now be obtained with sufficient accuracy and speed for object recognition and pose estimation purposes. This article proposes the coded-light range-imaging method together with superquadric segmentation to approach this task. Superquadric segments are volumetric primitives that describe global object properties with 5 parameters, which provide the main features for object recognition. Besides, the principle axes of a superquadric segment determine the phase of an object in the scene. The volumetric segmentation of a range image can be used to detect missing, false or badly placed components on assembled printed circuit boards. Furthermore, this approach will be useful to recognize and extract valuable or toxic electronic components on printed circuit boards scrap that currently burden the environment during electronic waste processing. Results on synthetic range images with errors constructed according to a verified noise model illustrate the capabilities of this approach.

  5. Apparatus And Method Of Using Flexible Printed Circuit Board In Optical Transceiver Device

    DOEpatents

    Anderson, Gene R.; Armendariz, Marcelino G.; Bryan, Robert P.; Carson, Richard F.; Duckett, III, Edwin B.; McCormick, Frederick B.; Peterson, David W.; Peterson, Gary D.; Reysen, Bill H.

    2005-03-15

    This invention relates to a flexible printed circuit board that is used in connection with an optical transmitter, receiver or transceiver module. In one embodiment, the flexible printed circuit board has flexible metal layers in between flexible insulating layers, and the circuit board comprises: (1) a main body region orientated in a first direction having at least one electrical or optoelectronic device; (2) a plurality of electrical contact pads integrated into the main body region, where the electrical contact pads function to connect the flexible printed circuit board to an external environment; (3) a buckle region extending from one end of the main body region; and (4) a head region extending from one end of the buckle region, and where the head region is orientated so that it is at an angle relative to the direction of the main body region. The electrical contact pads may be ball grid arrays, solder balls or land-grid arrays, and they function to connect the circuit board to an external environment. A driver or amplifier chip may be adapted to the head region of the flexible printed circuit board. In another embodiment, a heat spreader passes along a surface of the head region of the flexible printed circuit board, and a window is formed in the head region of the flexible printed circuit board. Optoelectronic devices are adapted to the head spreader in such a manner that they are accessible through the window in the flexible printed circuit board.

  6. Fast copper extraction from printed circuit boards using supercritical carbon dioxide.

    PubMed

    Calgaro, C O; Schlemmer, D F; da Silva, M D C R; Maziero, E V; Tanabe, E H; Bertuol, D A

    2015-11-01

    Technological development and intensive marketing support the growth in demand for electrical and electronic equipment (EEE), for which printed circuit boards (PCBs) are vital components. As these devices become obsolete after short periods, waste PCBs present a problem and require recycling. PCBs are composed of ceramics, polymers, and metals, particularly Cu, which is present in highest percentages. The aim of this study was to develop an innovative method to recover Cu from the PCBs of old mobile phones, obtaining faster reaction kinetics by means of leaching with supercritical CO2 and co-solvents. The PCBs from waste mobile phones were characterized, and evaluation was made of the reaction kinetics during leaching at atmospheric pressure and using supercritical CO2 with H2O2 and H2SO4 as co-solvents. The results showed that the PCBs contained 34.83 wt% of Cu. It was found that the supercritical extraction was 9 times faster, compared to atmospheric pressure extraction. After 20 min of supercritical leaching, approximately 90% of the Cu contained in the PCB was extracted using a 1:20 solid:liquid ratio and 20% of H2O2 and H2SO4 (2.5 M). These results demonstrate the efficiency of the process. Therefore the supercritical CO2 employment in the PCBs recycling is a promising alternative and the CO2 is environmentally acceptable and reusable.

  7. Impact of nonconductive powder on electrostatic separation for recycling crushed waste printed circuit board.

    PubMed

    Wu, Jiang; Qin, Yufei; Zhou, Quan; Xu, Zhenming

    2009-05-30

    The electrostatic separation is an effective and environmentally friendly method for recycling metals and nonmetals from crushed printed circuit board (PCB) wastes. However, it still confronts some problems brought by nonconductive powder (NP). Firstly, the NP is fine and liable to aggregate. This leads to an increase of middling products and loss of metals. Secondly, the stability of separation process is influenced by NP. Finally, some NPs accumulate on the surface of the corona and electrostatic electrodes during the process. These problems lead to an inefficient separation. In the present research, the impacts of NP on electrostatic separation are investigated. The experimental results show that: the separation is notably influenced when the NP content is more than 10%. With the increase of NP content, the middling products sharply increase from 1.4 g to 4.3g (increase 207.1%), while the conductive products decrease from 24.0 g to 19.1g (decrease 20.4%), and the separation process become more instable.

  8. Recycle technology for recovering resources and products from waste printed circuit boards.

    PubMed

    Li, Jia; Lu, Hongzhou; Guo, Jie; Xu, Zhenming; Zhou, Yaohe

    2007-03-15

    The printed circuit board (PCB) contains nearly 28% metals that are abundant non-ferrous metals such as Cu, Al, Sn, etc. The purity of precious metals in PCBs is more than 10 times higher than that of rich-content minerals. Therefore, recycling of PCBs is an important subject not only from the treatment of waste but also from the recovery of valuable materials. Chemical and mechanical methods are two traditional recycling processes for waste PCBs. However, the prospect of chemical methods will be limited since the emission of toxic liquid or gas brings secondary pollution to the environment during the process. Mechanical processes, such as shape separation, jigging, density-based separation, and electrostatic separation have been widely utilized in the recycling industry. But, recycling of waste PCBs is only beginning. In this study, a total of 400 kg of waste PCBs was processed by a recycle technology without negative impact to the environment. The technology contained mechanical two-step crushing, corona electrostatic separating, and recovery. The results indicated that (i) two-step crushing was an effect process to strip metals from base plates completely; (ii) the size of particles between 0.6 and 1.2 mm was suitable for corona electrostatic separating during industrial application; and (iii) the nonmetal of waste PCBs attained 80% weight of a kind of nonmetallic plate that expanded the applying prospect of waste nonmetallic materials.

  9. Printed circuit board recycling: Physical processing and copper extraction by selective leaching.

    PubMed

    Silvas, Flávia P C; Correa, Mónica M Jiménez; Caldas, Marcos P K; de Moraes, Viviane T; Espinosa, Denise C R; Tenório, Jorge A S

    2015-12-01

    Global generation of waste electrical and electronic equipment (WEEE) is about 40 million tons per year. Constant increase in WEEE generation added to international legislations has improved the development of processes for materials recovery and sustainability of electrical and electronic industry. This paper describes a new hydrometallurgical route (leaching process) to recycle printed circuit boards (PCBs) from printers to recover copper. Methodology included PCBs characterization and a combined route of physical and hydrometallurgical processing. Magnetic separation, acid digestion and chemical analysis by ICP-OES were performed. On leaching process were used two stages: the first one in a sulfuric media and the second in an oxidant media. The results showed that the PCBs composition was 74.6 wt.% of non-magnetic material and 25.4 wt.% of magnetic one. The metallic fraction corresponded to 44.0 wt.%, the polymeric to 28.5 wt.% and the ceramic to 27.5 wt.%. The main metal was copper and its initial content was 32.5 wt.%. On sulfuric leaching 90 wt.% of Al, 40 wt.% of Zn and 8.6 wt.% of Sn were extracted, whereas on oxidant leaching tests the extraction percentage of Cu was 100 wt.%, of Zn 60 wt.% and of Al 10 wt.%. At the end of the hydrometallurgical processing was obtained 100% of copper extraction and the recovery factor was 98.46%, which corresponds to a 32 kg of Cu in 100 kg of PCB.

  10. A review of the recycling of non-metallic fractions of printed circuit boards.

    PubMed

    Marques, André Canal; Cabrera Marrero, José-María; de Fraga Malfatti, Célia

    2013-01-01

    There is a big waste generation nowadays due to the growing demand for innovation and the fact that more and more products have a reduced lifetime, increasing the volume of dumps and landfills. Currently, one of the segments of large volume is the technology waste, which reflects on the printed circuit boards (PCBs) that are the basis of the electronics industry. This type of waste disposal is difficult, given that recycling is complex and expensive, because of the diversity of existing materials and components, and their difficult separation process. Regarding the material involved in PCBs, there are metal fractions (MFs) and non-metallic fractions (NMFs), of which the recycling of NMFs is one of the most important and difficult processes, because they amount to about 70% of the weight of the PCB's waste. In the present paper, a literature review of the recycling of non-metallic fractions (NMFs) has been carried out, showing different studies and guidelines regarding this type of recycling, emphasizing that this type of waste still lacks for further application.

  11. Prioritizing material recovery for end-of-life printed circuit boards.

    PubMed

    Wang, Xue; Gaustad, Gabrielle

    2012-10-01

    The increasing growth in generation of electronic waste (e-waste) motivates a variety of waste reduction research. Printed circuit boards (PCBs) are an important sub-set of the overall e-waste stream due to the high value of the materials contained within them and potential toxicity. This work explores several environmental and economic metrics for prioritizing the recovery of materials from end-of-life PCBs. A weighted sum model is used to investigate the trade-offs among economic value, energy saving potentials, and eco-toxicity. Results show that given equal weights for these three sustainability criteria gold has the highest recovery priority, followed by copper, palladium, aluminum, tin, lead, platinum, nickel, zinc, and silver. However, recovery priority will change significantly due to variation in the composition of PCBs, choice of ranking metrics, and weighting factors when scoring multiple metrics. These results can be used by waste management decision-makers to quantify the value and environmental savings potential for recycling technology development and infrastructure. They can also be extended by policy-makers to inform possible penalties for land-filling PCBs or exporting to the informal recycling sector. The importance of weighting factors when examining recovery trade-offs, particularly for policies regarding PCB collection and recycling are explored further.

  12. Simultaneous detection of lactate and glucose by integrated printed circuit board based array sensing chip.

    PubMed

    Li, Xuelian; Zang, Jianfeng; Liu, Yingshuai; Lu, Zhisong; Li, Qing; Li, Chang Ming

    2013-04-10

    An integrated printed circuit board (PCB) based array sensing chip was developed to simultaneously detect lactate and glucose in mouse serum. The novelty of the chip relies on a concept demonstration of inexpensive high-throughput electronic biochip, a chip design for high signal to noise ratio and high sensitivity by construction of positively charged chitosan/redox polymer Polyvinylimidazole-Os (PVI-Os)/carbon nanotube (CNT) composite sensing platform, in which the positively charged chitosan/PVI-Os is mediator and electrostatically immobilizes the negatively charged enzyme, while CNTs function as an essential cross-linker to network PVI-Os and chitosan due to its negative charged nature. Additional electrodes on the chip with the same sensing layer but without enzymes were prepared to correct the interferences for high specificity. Low detection limits of 0.6 μM and 5 μM were achieved for lactate and glucose, respectively. This work could be extended to inexpensive array sensing chips with high sensitivity, good specificity and high reproducibility for various sensor applications.

  13. Prioritizing material recovery for end-of-life printed circuit boards.

    PubMed

    Wang, Xue; Gaustad, Gabrielle

    2012-10-01

    The increasing growth in generation of electronic waste (e-waste) motivates a variety of waste reduction research. Printed circuit boards (PCBs) are an important sub-set of the overall e-waste stream due to the high value of the materials contained within them and potential toxicity. This work explores several environmental and economic metrics for prioritizing the recovery of materials from end-of-life PCBs. A weighted sum model is used to investigate the trade-offs among economic value, energy saving potentials, and eco-toxicity. Results show that given equal weights for these three sustainability criteria gold has the highest recovery priority, followed by copper, palladium, aluminum, tin, lead, platinum, nickel, zinc, and silver. However, recovery priority will change significantly due to variation in the composition of PCBs, choice of ranking metrics, and weighting factors when scoring multiple metrics. These results can be used by waste management decision-makers to quantify the value and environmental savings potential for recycling technology development and infrastructure. They can also be extended by policy-makers to inform possible penalties for land-filling PCBs or exporting to the informal recycling sector. The importance of weighting factors when examining recovery trade-offs, particularly for policies regarding PCB collection and recycling are explored further. PMID:22677014

  14. Ion chromatography in the manufacture of multilayer circuit boards

    NASA Astrophysics Data System (ADS)

    Smith, Robert E.

    1990-09-01

    Ion chromatography (IC) has proven useful in analyzing chemical solutions used in the manufacture of multilayer circuit boards. The manufacturing process is described briefly and previously published IC methods are reviewed. Then, methods are described for determining chlorate and chlorite in a brown oxide solution; salicylic acid in an epoxy cure agent; formate, sulfate, and tartrate in an electroless copper bath; anionic detergents in a tin-lead brightener and in a cleaning solution; and aqueous photoresist and nonionic brightener in a tin-lead bath. Anion exchange, reverse phase HPLC on a poly(styrene/divinylbenzene), PS/DVB, column and 2-D liquid chromatography also are described. Chemically suppressed conductivity and photometric detection are used.

  15. Ion chromatography in the manufacture of multilayer circuit boards

    SciTech Connect

    Smith, R.E.

    1990-09-01

    Ion chromatography (IC) has proven useful in analyzing chemical solutions used in the manufacture of multilayer circuit boards. The manufacturing process is described briefly and previously published IC methods are reviewed. Then, methods are described for determining chlorate and chlorite in a brown oxide solution; salicylic acid in an epoxy cure agent; formate, sulfate, and tartrate in an electroless copper bath; anionic detergents in a tin-lead brightener and in a cleaning solution; and aqueous photoresist and nonionic brightener in a tin-lead bath. Anion exchange, reverse phase HPLC on a poly(styrene/divinylbenzene), PS/DVB, column and two-dimensional liquid chromatography also are described. Chemically suppressed conductivity and photometric detection are used. 13 refs., 10 figs., 1 tab.

  16. Quadratic nonlinear models for optimizing electrostatic separation of crushed waste printed circuit boards using response surface methodology.

    PubMed

    Qin, Yufei; Wu, Jiang; Zhou, Quan; Xu, Zhenming

    2009-08-15

    The electrostatic separation has proved to be an effective and environment-friendly treatment for the recovery of crushed waste printed circuit boards (PCBs). In this paper a more sophisticated response surface methodology was applied to build quadratic models and optimize the three main factors on a roll-type electrostatic separator. The sample of granular mixture got from crushed PCB wastes (size 0.3-0.45 mm, containing 25% metal and 75% nonmetal). According to the analysis of the experiment data, some quadratic effects were found, and two quadratic models for conductor production (C) and middling production (M) were established. The results indicated that the high voltage level and roll speed are the most important factors for the process. Because of the existence of the quadratic effect, the highest efficiency can also be achieved at a lower voltage level (27-29 kV) compared with a maximum voltage level.

  17. Tailored benzoxazines as novel resin systems for printed circuit boards in high temperature e-mobility applications

    SciTech Connect

    Troeger, K. Darka, R. Khanpour Neumeyer, T. Altstaedt, V.

    2014-05-15

    This study focuses on the development of Bisphenol-F-benzoxazine resins blended with different ratios of a trifunctional epoxy resin suitable as matrix for substrates for high temperature printed circuit board (HT-PCB) applications. With the benzoxazine blends glass transition temperatures of more than 190 °C could be achieved in combination with a coefficient of thermal expansion in thickness direction (z-CTE) of less than 60 ppm/K without adding any fillers. This shows the high potential of the benzoxazine-epoxy blend systems as substrate materials for HT-PCBs. To understand the thermal behavior of the different formulations, the apparent crosslink density was calculated based on data from Dynamic Mechanical Analysis. Laminates in laboratory scale were prepared and characterized to demonstrate the transformation of the neat resin properties into real electronic substrate properties. The produced laminates exhibit a z-CTE below 40 ppm/K.

  18. Radiological characterization of printed circuit boards for future elimination.

    PubMed

    Zaffora, Biagio; Magistris, Matteo

    2016-07-01

    Electronic components like printed circuit boards (PCBs) are commonly used in CERN's accelerator complex. During their lifetime some of these PCBs are exposed to a radiation field of protons, neutrons and pions and are activated. In view of their disposal towards the appropriate final repository, a radiological characterization must be performed. The present work proposes a general characterization procedure based on the definition of a reference chemical composition, on the calculation of the corresponding radionuclide inventory and on the measurement of a tracer radionuclide. This method has been validated with real-life cases of electronic boards which were exposed to the typical radiation fields in CERN's accelerators. The activation studies demonstrate that silver is the key element with respect to the radiological characterization of electronic waste due to the production of Ag-110m and Ag-108m. A sensitivity analysis shows that the waiting time is the main parameter affecting the radionuclide inventory. Results also indicate that, as is the case of other families of radioactive waste, an accurate assessment of the radiological inventory of PCBs would require the precise knowledge of their chemical composition, as well as the radiation field to which they were exposed. PMID:27129133

  19. Aluminum heat sink enables power transistors to be mounted integrally with printed circuit board

    NASA Technical Reports Server (NTRS)

    Seaward, R. C.

    1967-01-01

    Power transistor is provided with an integral flat plate aluminum heat sink which mounts directly on a printed circuit board containing associated circuitry. Standoff spacers are used to attach the heat sink to the printed circuit board containing the remainder of the circuitry.

  20. Fast and Efficient Fabrication of Intrinsically Stretchable Multilayer Circuit Boards by Wax Pattern Assisted Filtration.

    PubMed

    Tybrandt, Klas; Vörös, Janos

    2016-01-13

    Intrinsically stretchable multilayer circuit boards are fabricated with a fast and material efficient method based on filtration. Silver nanowire conductor patterns of outstanding performance are defined by filtration through wax printed membranes and the circuit board is assembled by subsequent transfers of the nanowires onto the elastomer substrate. The method is used to fabricate a bright stretchable light emitting diode matrix display.

  1. A Circuit Board Using a Sheet of Thick Paper and Aluminium Tape

    ERIC Educational Resources Information Center

    Kamata, Masahiro; Honda, Motoshi

    2003-01-01

    We have developed a circuit board using materials that are inexpensive and familiar to elementary school students. Most of the responses from students who made this board were relatively positive and we observed them enjoy making the boards at a Science Festival in Japan and in elementary school. As an application, we also developed a tiny torch…

  2. Technology development of RF MEMS switches on printed circuit boards

    NASA Astrophysics Data System (ADS)

    Chang, Hung-Pin

    Today, some engineers have shifted their focus on the micro-electro-mechanical system (MEMS) to pursue better technological advancements. Recent development in RF MEMS technologies have lead to superior switch characteristics, i.e., very low insertion loss, very low power requirements, and high isolation comparing to the conventional semiconductor devices. This success has promised the potential of MEMS to revolutionize RF and microwave system implementation for the next generation of communication applications. However, RF MEMS switches integrated monolithically with various RF functional components on the same substrate to create multifunctional and reconfigurable complete communication systems remains to be a challenge research topic due to the concerns of the high cost of packaging process and the high cost of RF matching requirements in module board implementation. Furthermore, the fabrication of most RF MEMS switches requires thickness control and surface planarization of wide metal lines prior to deposition of a metal membrane bridge, which poses a major challenge to manufacturability. To ease the fabrication of RF MEMS switches and to facilitate their integration with other RF components such as antennas, phase delay lines, tunable filters, it is imperative to develop a manufacturable RF MEMS switch technology on a common substrate housing all essential RF components. Development of a novel RF MEMS technology to build a RF MEMS switch and provide a system-level packaging on microwave laminated printed circuit boards (PCBs) are proposed in this dissertation. Two key processes, high-density inductively coupled plasma chemical vapor deposition (HDICP CVD) for low temperature dielectric deposition, and compressive molding planarization (COMP) for the temporary sacrificial polymer planarization have been developed for fabricating RF MEMS switches on PCBs. Several membrane-type capacitive switches have been fabricated showing excellent RF performance and dynamic

  3. Hydrometallurgical Recovery of Metals from Large Printed Circuit Board Pieces

    PubMed Central

    Jadhav, U.; Hocheng, H.

    2015-01-01

    The recovery of precious metals from waste printed circuit boards (PCBs) is an effective recycling process. This paper presents a promising hydrometallurgical process to recover precious metals from waste PCBs. To simplify the metal leaching process, large pieces of PCBs were used instead of a pulverized sample. The chemical coating present on the PCBs was removed by sodium hydroxide (NaOH) treatment prior to the hydrometallurgical treatment. Among the leaching reagents examined, hydrochloric acid (HCl) showed great potential for the recovery of metals. The HCl-mediated leaching of waste PCBs was investigated over a range of conditions. Increasing the acid concentration decreased the time required for complete metal recovery. The shaking speed showed a pronounced positive effect on metal recovery, but the temperature showed an insignificant effect. The results showed that 1 M HCl recovered all of the metals from 4 cm × 4 cm PCBs at room temperature and 150 rpm shaking speed in 22 h. PMID:26415827

  4. Elemental analysis of printed circuit boards considering the ROHS regulations

    SciTech Connect

    Wienold, Julia; Recknagel, Sebastian; Scharf, Holger; Hoppe, Marion; Michaelis, Matthias

    2011-03-15

    The EU RoHS Directive (2002/95/EC of the European Parliament and of the Council) bans the placing of new electrical and electronic equipment containing more than agreed levels of lead, cadmium, mercury, hexavalent chromium, polybrominated biphenyl (PBB) and polybrominated diphenyl ether (PBDE) flame retardants on the EU market. It necessitates methods for the evaluation of RoHS compliance of assembled electronic equipment. In this study mounted printed circuit boards from personal computers were analyzed on their content of the three elements Cd, Pb and Hg which were limited by the EU RoHS directive. Main focus of the investigations was the influence of sample pre-treatment on the precision and reproducibility of the results. The sample preparation steps used were based on the guidelines given in EN 62321. Five different types of dissolution procedures were tested on different subsequent steps of sample treatment like cutting and milling. Elemental analysis was carried out using ICP-OES, XRF and CV-AFS (Hg). The results obtained showed that for decision-making with respect to RoHS compliance a size reduction of the material to be analyzed to particles {<=}1.5 mm can already be sufficient. However, to ensure analytical results with relative standard deviations of less than 20%, as recommended by the EN 62321, a much larger effort for sample processing towards smaller particle sizes might be required which strongly depends on the mass fraction of the element under investigation.

  5. International standards for optical circuit board fabrication, assembly and measurement

    NASA Astrophysics Data System (ADS)

    Pitwon, Richard; Immonen, Marika; Wang, Kai; Itoh, Hideo; Shioda, Tsuyoshi; Wu, Jinhua; Zhu, Long Xiu; Yan, Hui Juan; Worrall, Alex

    2016-03-01

    The commercial adoption of electro-optical printed circuit board (EOCB) technology will be accelerated by the development of industrial and conformity standards for high volume fabrication, connector assembly and waveguide measurement. In this paper, we introduce international standardisation activities surrounding EOCBs and report on industrial processes developed for the high volume fabrication of complex EOCBs with embedded multimode polymer waveguides including a first connector standard for polymer waveguide termination. We focus on solving a serious historic problem with the measurement of optical waveguide systems, namely the lack of harmonised measurement conditions for optical waveguides, which to this day gives rise to strong inconsistencies in the results of measurements by different parties on the same waveguide. We report on the development of a standard to ensure repeatable measurement of optical waveguides, whereby we demonstrate how the application of a measurement identification system and proposed reference measurement conditions can bring variation in measurement results to within 5%, thereby serving as the basis for a formal reliable optical waveguide measurement methodology.

  6. Using multiple sensors for printed circuit board insertion

    NASA Technical Reports Server (NTRS)

    Sood, Deepak; Repko, Michael C.; Kelley, Robert B.

    1989-01-01

    As more and more activities are performed in space, there will be a greater demand placed on the information handling capacity of people who are to direct and accomplish these tasks. A promising alternative to full-time human involvement is the use of semi-autonomous, intelligent robot systems. To automate tasks such as assembly, disassembly, repair and maintenance, the issues presented by environmental uncertainties need to be addressed. These uncertainties are introduced by variations in the computed position of the robot at different locations in its work envelope, variations in part positioning, and tolerances of part dimensions. As a result, the robot system may not be able to accomplish the desired task without the help of sensor feedback. Measurements on the environment allow real time corrections to be made to the process. A design and implementation of an intelligent robot system which inserts printed circuit boards into a card cage are presented. Intelligent behavior is accomplished by coupling the task execution sequence with information derived from three different sensors: an overhead three-dimensional vision system, a fingertip infrared sensor, and a six degree of freedom wrist-mounted force/torque sensor.

  7. 29 CFR 1915.181 - Electrical circuits and distribution boards.

    Code of Federal Regulations, 2013 CFR

    2013-07-01

    ... employee is permitted to work on an electrical circuit, except when the circuit must remain energized for testing and adjusting, the circuit shall be deenergized and checked at the point at which the work is to be done to insure that it is actually deenergized. When testing or adjusting an energized circuit...

  8. Liquid oil and residual characteristics of printed circuit board recycle by pyrolysis.

    PubMed

    Lin, Kuo-Hsiung; Chiang, Hung-Lung

    2014-04-30

    Non-metal fractions of waste printed circuit boards (PCBs) were thermally treated (200-500°C) under nitrogen atmosphere. Carbon, hydrogen, and nitrogen were determined by elemental analyzer, bromine by instrumental neutron activation analysis (INAA), phosphorus by energy dispersive X-ray spectrometer (EDX), and 29 trace elements by inductively coupled plasma atomic emission spectrometer (ICP-AES) and mass spectrometry (ICP-MS) for raw material and pyrolysis residues. Organic compositions of liquid oil were identified by GC (gas chromatography)-MS, trace element composition by ICP system, and 12 water-soluble ions by IC (ionic chromatography). Elemental content of carbon was >450 mg/g, oxygen 300 mg/g, bromine and hydrogen 60 mg/g, nitrogen 30 mg/g, and phosphorus 28 mg/g. Sulfur was trace in PCBs. Copper content was 25-28 mg/g, iron 1.3-1.7 mg/g, tin 0.8-1.0mg/g and magnesium 0.4-1.0mg/g; those were the main metals in the raw materials and pyrolytic residues. In the liquid products, carbon content was 68-73%, hydrogen was 10-14%, nitrogen was 4-5%, and sulfur was less than 0.05% at pyrolysis temperatures from 300 to 500°C. Phenol, 3-bromophenol, 2-methylphenol and 4-propan-2-ylphenol were major species in liquid products, accounting for >50% of analyzed organic species. Bromides, ammonium and phosphate were the main species in water sorption samples for PCB pyrolysis exhaust.

  9. Prioritizing material recovery for end-of-life printed circuit boards

    SciTech Connect

    Wang Xue; Gaustad, Gabrielle

    2012-10-15

    Highlights: Black-Right-Pointing-Pointer Material recovery driven by composition, choice of ranking, and weighting. Black-Right-Pointing-Pointer Economic potential for new recycling technologies quantified for several metrics. Black-Right-Pointing-Pointer Indicators developed for materials incurring high eco-toxicity costs. Black-Right-Pointing-Pointer Methodology useful for a variety of stakeholders, particularly policy-makers. - Abstract: The increasing growth in generation of electronic waste (e-waste) motivates a variety of waste reduction research. Printed circuit boards (PCBs) are an important sub-set of the overall e-waste stream due to the high value of the materials contained within them and potential toxicity. This work explores several environmental and economic metrics for prioritizing the recovery of materials from end-of-life PCBs. A weighted sum model is used to investigate the trade-offs among economic value, energy saving potentials, and eco-toxicity. Results show that given equal weights for these three sustainability criteria gold has the highest recovery priority, followed by copper, palladium, aluminum, tin, lead, platinum, nickel, zinc, and silver. However, recovery priority will change significantly due to variation in the composition of PCBs, choice of ranking metrics, and weighting factors when scoring multiple metrics. These results can be used by waste management decision-makers to quantify the value and environmental savings potential for recycling technology development and infrastructure. They can also be extended by policy-makers to inform possible penalties for land-filling PCBs or exporting to the informal recycling sector. The importance of weighting factors when examining recovery trade-offs, particularly for policies regarding PCB collection and recycling are explored further.

  10. 29 CFR 1915.181 - Electrical circuits and distribution boards.

    Code of Federal Regulations, 2010 CFR

    2010-07-01

    ... the switch, or removing the fuse, whichever method is appropriate. The circuit breaker, switch, or fuse location shall be tagged to indicate that an employee is working on the circuit. Such tags...

  11. Recent developments and perspective of the spent waste printed circuit boards.

    PubMed

    Xu, Yuquan; Liu, Junsheng

    2015-05-01

    The amount of spent electronic and electrical solid wastes (i.e. e-wastes) has increased to a new level with the rapid development of electronic and electrical industries. Management of e-wastes challenges the administrators and researchers. As a major component of the e-waste stream, pollution caused by the spent printed circuit boards has captured increasing attention. Various innovative methods have recently been developed to dispose and reuse these municipal spent printed circuit boards. In this mini-review article, the disposal approaches for spent printed circuit boards are highlighted. The present state and future perspective are also discussed. We hope that this mini-review can promote the extensive understanding and effective disposal of the spent printed circuit boards in the field of solid waste treatment and resources.

  12. Dielectric nanocomposites for high performance embedded capacitors in organic printed circuit boards

    NASA Astrophysics Data System (ADS)

    Xu, Jianwen

    Conventionally discrete passive components like capacitors, resistors, and inductors are surface-mounted on top of the printed circuit boards (PCBs). To match the ever increasing demands of miniaturization, cost reduction, and high performance in microelectronic industry, a promising approach is to integrate passive components into the board during PCB manufacture. Because they are embedded inside multilayer PCBs, such components are called embedded passives. This work focuses on the materials design, development and processing of polymer-based dielectric nanocomposites for embedded capacitor applications. The methodology of this approach is to combine the advantages of the polymer and the filler to satisfy the electric, dielectric, mechanical, fabrication, and reliability requirements for embedded capacitors. Restrained by poor adhesion and poor thermal stress reliability at high filler loadings, currently polymer-ceramic composites can only achieve a dielectric constant of less than 50. In order to increase the dielectric constant to above 50, effects of high-kappa polymer matrix, bimodal fillers, and dispersing agent are systematically investigated. Surface functionalization of nanofiller particles and modification of epoxy matrix with a secondary rubberized epoxy to form sea-island structure are proposed to enhance the dielectric constant, adhesion and high-temperature thermal stress reliability of high-kappa composites. To obtain photodefinable high-kappa composites, fundamental understanding of the photopolymerization of the novel epoxy-ceramic composite photoresist is addressed. While the properties of high-kappa composites largely depend on the polymer matrix, the fillers can also drastically affect the material properties. Carbon black- and carbon nanotubes-filled ultrahigh-kappa polymer composites are investigated as the candidate materials for embedded capacitors. Dielectric composites based on percolation typically show a high dielectric constant, and a

  13. Problem-Solving at a Circuit-Board Assembly Machine: A Microanalysis.

    ERIC Educational Resources Information Center

    Kleifgen, Jo Anne; Frenz-Belken, Patricia

    A study described machine operators' problem-solving actions at a computerized circuit-board assembly machine in a small manufacturing plant located on the West Coast. Participants were a machine operator and his supervisor, both from Vietnam, who were building large prototype boards for a major computer corporation. Over a 6.5 minute interval,…

  14. Printed circuit board impedance matching step for microwave (millimeter wave) devices

    SciTech Connect

    Pao, Hsueh-Yuan; Aguirre, Jerardo; Sargis, Paul

    2013-10-01

    An impedance matching ground plane step, in conjunction with a quarter wave transformer section, in a printed circuit board provides a broadband microwave matching transition from board connectors or other elements that require thin substrates to thick substrate (>quarter wavelength) broadband microwave (millimeter wave) devices. A method of constructing microwave and other high frequency electrical circuits on a substrate of uniform thickness, where the circuit is formed of a plurality of interconnected elements of different impedances that individually require substrates of different thicknesses, by providing a substrate of uniform thickness that is a composite or multilayered substrate; and forming a pattern of intermediate ground planes or impedance matching steps interconnected by vias located under various parts of the circuit where components of different impedances are located so that each part of the circuit has a ground plane substrate thickness that is optimum while the entire circuit is formed on a substrate of uniform thickness.

  15. Fluid Power Multi-actuator Circuit Board with Microcomputer Control Option.

    ERIC Educational Resources Information Center

    McKechnie, R. E.; Vickers, G. W.

    1981-01-01

    Describes a portable fluid power engineering laboratory and class demonstration apparatus designed to enable students to design, build, and test multi-actuator circuits. Features a variety of standard pneumatic values and actuators fitted with quick disconnect couplings. Discusses sequencing circuit boards, microcomputer control, cost, and…

  16. New testing equipment for SMT PC boards

    NASA Astrophysics Data System (ADS)

    Balme, Louis; Mignotte, Anne; Monari, Jean-Yves; Pondaven, Patrick; Vaucher, Christophe

    1988-06-01

    The problems created by surface mounted technology (SMT) in the field of printed circuit board (PCB) testing are addressed. A device for testing the new surface mounting boards which allows for a resolution of 0.1 mm is presented. The device is able to detect and identify opens and shorts on both sides of the PCB, simultaneously, in a few seconds with 4,000 non-multiplexed test points per side. Details of the software and hardware involved in making the testing device are outlined. The device has CAD/CAM links, a PCB defect display and a high system integration (reliablility).

  17. Novel waste printed circuit board recycling process with molten salt.

    PubMed

    Riedewald, Frank; Sousa-Gallagher, Maria

    2015-01-01

    The objective of the method was to prove the concept of a novel waste PCBs recycling process which uses inert, stable molten salts as the direct heat transfer fluid and, simultaneously, uses this molten salt to separate the metal products in either liquid (solder, zinc, tin, lead, etc.) or solid (copper, gold, steel, palladium, etc.) form at the operating temperatures of 450-470 °C. The PCB recovery reactor is essentially a U-shaped reactor with the molten salt providing a continuous fluid, allowing molten salt access from different depths for metal recovery. A laboratory scale batch reactor was constructed using 316L as suitable construction material. For safety reasons, the inert, stable LiCl-KCl molten salts were used as direct heat transfer fluid. Recovered materials were washed with hot water to remove residual salt before metal recovery assessment. The impact of this work was to show metal separation using molten salts in one single unit, by using this novel reactor methodology. •The reactor is a U-shaped reactor filled with a continuous liquid with a sloped bottom representing a novel reactor concept.•This method uses large PCB pieces instead of shredded PCBs as the reactor volume is 2.2 L.•The treated PCBs can be removed via leg B while the process is on-going.

  18. Novel waste printed circuit board recycling process with molten salt

    PubMed Central

    Riedewald, Frank; Sousa-Gallagher, Maria

    2015-01-01

    The objective of the method was to prove the concept of a novel waste PCBs recycling process which uses inert, stable molten salts as the direct heat transfer fluid and, simultaneously, uses this molten salt to separate the metal products in either liquid (solder, zinc, tin, lead, etc.) or solid (copper, gold, steel, palladium, etc.) form at the operating temperatures of 450–470 °C. The PCB recovery reactor is essentially a U-shaped reactor with the molten salt providing a continuous fluid, allowing molten salt access from different depths for metal recovery. A laboratory scale batch reactor was constructed using 316L as suitable construction material. For safety reasons, the inert, stable LiCl–KCl molten salts were used as direct heat transfer fluid. Recovered materials were washed with hot water to remove residual salt before metal recovery assessment. The impact of this work was to show metal separation using molten salts in one single unit, by using this novel reactor methodology. • The reactor is a U-shaped reactor filled with a continuous liquid with a sloped bottom representing a novel reactor concept. • This method uses large PCB pieces instead of shredded PCBs as the reactor volume is 2.2 L. • The treated PCBs can be removed via leg B while the process is on-going. PMID:26150977

  19. Waste printed circuit board recycling techniques and product utilization.

    PubMed

    Hadi, Pejman; Xu, Meng; Lin, Carol S K; Hui, Chi-Wai; McKay, Gordon

    2015-01-01

    E-waste, in particular waste PCBs, represents a rapidly growing disposal problem worldwide. The vast diversity of highly toxic materials for landfill disposal and the potential of heavy metal vapors and brominated dioxin emissions in the case of incineration render these two waste management technologies inappropriate. Also, the shipment of these toxic wastes to certain areas of the world for eco-unfriendly "recycling" has recently generated a major public outcry. Consequently, waste PCB recycling should be adopted by the environmental communities as an ultimate goal. This article reviews the recent trends and developments in PCB waste recycling techniques, including both physical and chemical recycling. It is concluded that the physical recycling techniques, which efficiently separate the metallic and nonmetallic fractions of waste PCBs, offer the most promising gateways for the environmentally-benign recycling of this waste. Moreover, although the reclaimed metallic fraction has gained more attention due to its high value, the application of the nonmetallic fraction has been neglected in most cases. Hence, several proposed applications of this fraction have been comprehensively examined.

  20. Novel waste printed circuit board recycling process with molten salt.

    PubMed

    Riedewald, Frank; Sousa-Gallagher, Maria

    2015-01-01

    The objective of the method was to prove the concept of a novel waste PCBs recycling process which uses inert, stable molten salts as the direct heat transfer fluid and, simultaneously, uses this molten salt to separate the metal products in either liquid (solder, zinc, tin, lead, etc.) or solid (copper, gold, steel, palladium, etc.) form at the operating temperatures of 450-470 °C. The PCB recovery reactor is essentially a U-shaped reactor with the molten salt providing a continuous fluid, allowing molten salt access from different depths for metal recovery. A laboratory scale batch reactor was constructed using 316L as suitable construction material. For safety reasons, the inert, stable LiCl-KCl molten salts were used as direct heat transfer fluid. Recovered materials were washed with hot water to remove residual salt before metal recovery assessment. The impact of this work was to show metal separation using molten salts in one single unit, by using this novel reactor methodology. •The reactor is a U-shaped reactor filled with a continuous liquid with a sloped bottom representing a novel reactor concept.•This method uses large PCB pieces instead of shredded PCBs as the reactor volume is 2.2 L.•The treated PCBs can be removed via leg B while the process is on-going. PMID:26150977

  1. Electro-optical circuit board with single-mode glass waveguide optical interconnects

    NASA Astrophysics Data System (ADS)

    Brusberg, Lars; Neitz, Marcel; Pernthaler, Dominik; Weber, Daniel; Sirbu, Bogdan; Herbst, Christian; Frey, Christopher; Queisser, Marco; Wöhrmann, Markus; Manessis, Dionysios; Schild, Beatrice; Oppermann, Hermann; Eichhammer, Yann; Schröder, Henning; Hâkansson, Andreas; Tekin, Tolga

    2016-03-01

    A glass optical waveguide process has been developed for fabrication of electro-optical circuit boards (EOCB). Very thin glass panels with planar integrated single-mode waveguides can be embedded as a core layer in printed circuit boards for high-speed board-level chip-to-chip and board-to-board optical interconnects over an optical backplane. Such singlemode EOCBs will be needed in upcoming high performance computers and data storage network environments in case single-mode operating silicon photonic ICs generate high-bandwidth signals [1]. The paper will describe some project results of the ongoing PhoxTroT project, in which a development of glass based single-mode on-board and board-to-board interconnection platform is successfully in progress. The optical design comprises a 500 μm thin glass panel (Schott D263Teco) with purely optical layers for single-mode glass waveguides. The board size is accommodated to the mask size limitations of the fabrication (200 mm wafer level process, being later transferred also to larger panel size). Our concept consists of directly assembling of silicon photonic ICs on cut-out areas in glass-based optical waveguide panels. A part of the electrical wiring is patterned by thin film technology directly on the glass wafer surface. A coupling element will be assembled on bottom side of the glass-based waveguide panel for 3D coupling between board-level glass waveguides and chip-level silicon waveguides. The laminate has a defined window for direct glass access for assembling of the photonic integrated circuit chip and optical coupling element. The paper describes the design, fabrication and characterization of glass-based electro-optical circuit board with format of (228 x 305) mm2.

  2. Compact fluid cooled power converter supporting multiple circuit boards

    DOEpatents

    Radosevich, Lawrence D.; Meyer, Andreas A.; Beihoff, Bruce C.; Kannenberg, Daniel G.

    2005-03-08

    A support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support, in conjunction with other packaging features may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.

  3. All-semiconductor metamaterial-based optical circuit board at the microscale

    SciTech Connect

    Min, Li; Huang, Lirong

    2015-07-07

    The newly introduced metamaterial-based optical circuit, an analogue of electronic circuit, is becoming a forefront topic in the fields of electronics, optics, plasmonics, and metamaterials. However, metals, as the commonly used plasmonic elements in an optical circuit, suffer from large losses at the visible and infrared wavelengths. We propose here a low-loss, all-semiconductor metamaterial-based optical circuit board at the microscale by using interleaved intrinsic GaAs and doped GaAs, and present the detailed design process for various lumped optical circuit elements, including lumped optical inductors, optical capacitors, optical conductors, and optical insulators. By properly combining these optical circuit elements and arranging anisotropic optical connectors, we obtain a subwavelength optical filter, which can always hold band-stop filtering function for various polarization states of the incident electromagnetic wave. All-semiconductor optical circuits may provide a new opportunity in developing low-power and ultrafast components and devices for optical information processing.

  4. Critical rotational speed model of the rotating roll electrode in corona electrostatic separation for recycling waste printed circuit boards.

    PubMed

    Li, Jia; Lu, Hongzhou; Xu, Zhenming; Zhou, Yaohe

    2008-06-15

    Waste printed circuit board (PCB) is increasing worldwide. The corona electrostatic separation (CES) was an effective and environmental protection way to recycle resource from waste PCBs. The aim of this paper is to analyze the main factor (rotational speed) that affects the efficiency of CES from the point of view of electrostatics and mechanics. A quantitative method for analyzing the affection of rotational speed was studied and the model for separating flat nonmetal particles in waste PCBs was established. The conception of "charging critical rotational speed" and "detaching critical rotational speed" were presented. Experiments with the waste PCBs verified the theoretical model, and the experimental results were in good agreement with the theoretical model. The results indicated that the purity and recycle percentage of materials got a good level when the rotational speed was about 70 rpm and the critical rotational speed of small particles was higher than big particles. The model can guide the definition of operator parameter and the design of CES, which are needed for the development of any new application of the electrostatic separation method.

  5. Electrostatic separation for multi-size granule of crushed printed circuit board waste using two-roll separator.

    PubMed

    Wu, Jiang; Li, Jia; Xu, Zhenming

    2008-11-30

    The electrostatic separation is an effective method for recycle of crushed waste electrical and electronic equipment (WEEE). However, the robustness of the classical roll-type separator is vulnerable because of its sensitivity to variation of granule size. A new "two-roll type corona-electrostatic separator" was built to overcome the limitation of the classical one considering the actual situation of the industrial application which always contains granule with different size. Multi-size granule of crushed printed circuit board (PCB) wastes was used for investigation and the results showed that the efficiency of the separation process was improved by using the new separator. Compared with the process (lower voltage) performed on the old separator, the metal products increased 34% while the middling products reduced 73%, respectively. Compared with the process (higher voltage) performed on the old separator, the metal products increased 22% while the middling products reduced 59%, respectively. In addition, the metal component of the middling products using new machine notably decreased, 33% (new machine) compared with 58% (lower voltage) and 66% (higher voltage). The efficiency of the separation process is enhanced compared with the classical one.

  6. Critical rotational speed model of the rotating roll electrode in corona electrostatic separation for recycling waste printed circuit boards.

    PubMed

    Li, Jia; Lu, Hongzhou; Xu, Zhenming; Zhou, Yaohe

    2008-06-15

    Waste printed circuit board (PCB) is increasing worldwide. The corona electrostatic separation (CES) was an effective and environmental protection way to recycle resource from waste PCBs. The aim of this paper is to analyze the main factor (rotational speed) that affects the efficiency of CES from the point of view of electrostatics and mechanics. A quantitative method for analyzing the affection of rotational speed was studied and the model for separating flat nonmetal particles in waste PCBs was established. The conception of "charging critical rotational speed" and "detaching critical rotational speed" were presented. Experiments with the waste PCBs verified the theoretical model, and the experimental results were in good agreement with the theoretical model. The results indicated that the purity and recycle percentage of materials got a good level when the rotational speed was about 70 rpm and the critical rotational speed of small particles was higher than big particles. The model can guide the definition of operator parameter and the design of CES, which are needed for the development of any new application of the electrostatic separation method. PMID:18037234

  7. Printed Circuit Board Surface Finish and Effects of Chloride Contamination, Electric Field, and Humidity on Corrosion Reliability

    NASA Astrophysics Data System (ADS)

    Conseil-Gudla, Hélène; Jellesen, Morten S.; Ambat, Rajan

    2016-10-01

    Corrosion reliability is a serious issue today for electronic devices, components, and printed circuit boards (PCBs) due to factors such as miniaturization, globalized manufacturing practices which can lead to process-related residues, and global usage effects such as bias voltage and unpredictable user environments. The investigation reported in this paper focuses on understanding the synergistic effect of such parameters, namely contamination, humidity, PCB surface finish, pitch distance, and potential bias on leakage current under different humidity levels, and electrochemical migration probability under condensing conditions. Leakage currents were measured on interdigitated comb test patterns with three different types of surface finish typically used in the electronics industry, namely gold, copper, and tin. Susceptibility to electrochemical migration was studied under droplet conditions. The level of base leakage current (BLC) was similar for the different surface finishes and NaCl contamination levels up to relative humidity (RH) of 65%. A significant increase in leakage current was found for comb patterns contaminated with NaCl above 70% to 75% RH, close to the deliquescent RH of NaCl. Droplet tests on Cu comb patterns with varying pitch size showed that the initial BLC before dendrite formation increased with increasing NaCl contamination level, whereas electrochemical migration and the frequency of dendrite formation increased with bias voltage. The effect of different surface finishes on leakage current under humid conditions was not very prominent.

  8. Printed circuit board for a CCD camera head

    DOEpatents

    Conder, Alan D.

    2002-01-01

    A charge-coupled device (CCD) camera head which can replace film for digital imaging of visible light, ultraviolet radiation, and soft to penetrating x-rays, such as within a target chamber where laser produced plasmas are studied. The camera head is small, capable of operating both in and out of a vacuum environment, and is versatile. The CCD camera head uses PC boards with an internal heat sink connected to the chassis for heat dissipation, which allows for close (0.04" for example) stacking of the PC boards. Integration of this CCD camera head into existing instrumentation provides a substantial enhancement of diagnostic capabilities for studying high energy density plasmas, for a variety of military industrial, and medical imaging applications.

  9. Designing High Speed Printed Circuit Boards Using DxDesigner and Expedition

    NASA Technical Reports Server (NTRS)

    Navarro, Robert

    2007-01-01

    Mentor's DxDesigner and Expedition schematic capture and printed circuit board tools were chosen to implement a custom high speed signal processing board containing many high pin count Field Programmable Gate Arrays and many high speed serial connections with data rates over 2 Gigasamples/sec. The methodology used to place the parts and route the board involved the interaction of both the DxDesigner and Expedition tools. The basic design philosophy was to specify as much as possible through design constraints at the schematic level. This paper will explore implementing that philosophy in both tools to facilitate part placement and trace routing.

  10. A filter circuit board for the Earthworm Seismic Data Acquisition System

    USGS Publications Warehouse

    Jensen, Edward Gray

    2000-01-01

    The Earthworm system is a seismic network data acquisition and processing system used by the Northern California Seismic Network as well as many other seismic networks. The input to the system is comprised of many realtime electronic waveforms fed to a multi-channel digitizer on a PC platform. The digitizer consists of one or more National Instruments Corp. AMUX–64T multiplexer boards attached to an A/D converter board located in the computer. Originally, passive filters were installed on the multiplexers to eliminate electronic noise picked up in cabling. It was later discovered that a small amount of crosstalk occurred between successive channels in the digitizing sequence. Though small, this crosstalk will cause what appear to be small earthquake arrivals at the wrong time on some channels. This can result in erroneous calculation of earthquake arrival times, particularly by automated algorithms. To deal with this problem, an Earthworm filter board was developed to provide the needed filtering while eliminating crosstalk. This report describes the tests performed to find a suitable solution, and the design of the circuit board. Also included are all the details needed to build and install this board in an Earthworm system or any other system using the AMUX–64T board. Available below is the report in PDF format as well as an archive file containing the circuit board manufacturing information.

  11. Pollution prevention assessment for a printed circuit board plant. Environmental research brief

    SciTech Connect

    Edwards, H.W.; Kostrzewa, M.F.; Looby, G.P.

    1995-09-01

    The WMAC team at Colorado State University performed an assessment at a plant that manufactures printed circuit boards. The team`s report, detailing findings and recommendations, indicated that the onsite ion-exchange treatment of metal-containing rinse water generates regenerant solutions that could be further treated by electrowinning to recover metals and to achieve significant cost savings.

  12. 40 CFR 413.80 - Applicability: Description of the printed circuit board subcategory.

    Code of Federal Regulations, 2010 CFR

    2010-07-01

    ... 40 Protection of Environment 28 2010-07-01 2010-07-01 true Applicability: Description of the printed circuit board subcategory. 413.80 Section 413.80 Protection of Environment ENVIRONMENTAL PROTECTION AGENCY (CONTINUED) EFFLUENT GUIDELINES AND STANDARDS ELECTROPLATING POINT SOURCE CATEGORY...

  13. 40 CFR 413.80 - Applicability: Description of the printed circuit board subcategory.

    Code of Federal Regulations, 2011 CFR

    2011-07-01

    ... 40 Protection of Environment 29 2011-07-01 2009-07-01 true Applicability: Description of the printed circuit board subcategory. 413.80 Section 413.80 Protection of Environment ENVIRONMENTAL PROTECTION AGENCY (CONTINUED) EFFLUENT GUIDELINES AND STANDARDS ELECTROPLATING POINT SOURCE CATEGORY...

  14. Compressed Air System Enhancement Increase Efficiency and Provides Energy Savings at a Circuit Board Manufacturer

    SciTech Connect

    2001-06-01

    This case study is one in a series on industrial firms who are implementing energy efficient technologies and system improvements into their manufacturing processes. This case study documents the activities, savings, and lessons learned on the circuit board manufacturer (Sanmina Plant) project.

  15. Circuit Board Analysis for Lead by Atomic Absorption Spectroscopy in a Course for Nonscience Majors

    ERIC Educational Resources Information Center

    Weidenhammer, Jeffrey D.

    2007-01-01

    A circuit board analysis of the atomic absorption spectroscopy, which is used to measure lead content in a course for nonscience majors, is being presented. The experiment can also be used to explain the potential environmental hazards of unsafe disposal of various used electronic equipments.

  16. An Integer Programming-Based Generalized Vehicle Routing Approach for Printed Circuit Board Assembly Optimization

    ERIC Educational Resources Information Center

    Seth, Anupam

    2009-01-01

    Production planning and scheduling for printed circuit, board assembly has so far defied standard operations research approaches due to the size and complexity of the underlying problems, resulting in unexploited automation flexibility. In this thesis, the increasingly popular collect-and-place machine configuration is studied and the assembly…

  17. PCB drill path optimization by combinatorial cuckoo search algorithm.

    PubMed

    Lim, Wei Chen Esmonde; Kanagaraj, G; Ponnambalam, S G

    2014-01-01

    Optimization of drill path can lead to significant reduction in machining time which directly improves productivity of manufacturing systems. In a batch production of a large number of items to be drilled such as printed circuit boards (PCB), the travel time of the drilling device is a significant portion of the overall manufacturing process. To increase PCB manufacturing productivity and to reduce production costs, a good option is to minimize the drill path route using an optimization algorithm. This paper reports a combinatorial cuckoo search algorithm for solving drill path optimization problem. The performance of the proposed algorithm is tested and verified with three case studies from the literature. The computational experience conducted in this research indicates that the proposed algorithm is capable of efficiently finding the optimal path for PCB holes drilling process. PMID:24707198

  18. PCB drill path optimization by combinatorial cuckoo search algorithm.

    PubMed

    Lim, Wei Chen Esmonde; Kanagaraj, G; Ponnambalam, S G

    2014-01-01

    Optimization of drill path can lead to significant reduction in machining time which directly improves productivity of manufacturing systems. In a batch production of a large number of items to be drilled such as printed circuit boards (PCB), the travel time of the drilling device is a significant portion of the overall manufacturing process. To increase PCB manufacturing productivity and to reduce production costs, a good option is to minimize the drill path route using an optimization algorithm. This paper reports a combinatorial cuckoo search algorithm for solving drill path optimization problem. The performance of the proposed algorithm is tested and verified with three case studies from the literature. The computational experience conducted in this research indicates that the proposed algorithm is capable of efficiently finding the optimal path for PCB holes drilling process.

  19. PCB Drill Path Optimization by Combinatorial Cuckoo Search Algorithm

    PubMed Central

    Lim, Wei Chen Esmonde; Kanagaraj, G.; Ponnambalam, S. G.

    2014-01-01

    Optimization of drill path can lead to significant reduction in machining time which directly improves productivity of manufacturing systems. In a batch production of a large number of items to be drilled such as printed circuit boards (PCB), the travel time of the drilling device is a significant portion of the overall manufacturing process. To increase PCB manufacturing productivity and to reduce production costs, a good option is to minimize the drill path route using an optimization algorithm. This paper reports a combinatorial cuckoo search algorithm for solving drill path optimization problem. The performance of the proposed algorithm is tested and verified with three case studies from the literature. The computational experience conducted in this research indicates that the proposed algorithm is capable of efficiently finding the optimal path for PCB holes drilling process. PMID:24707198

  20. PCB with fully integrated optical interconnects

    NASA Astrophysics Data System (ADS)

    Langer, Gregor; Satzinger, Valentin; Schmidt, Volker; Schmid, Gerhard; Leeb, Walter R.

    2011-01-01

    The increasing demand for miniaturization and design flexibility of polymer optical waveguides integrated into electrical printed circuit boards (PCB) calls for new coupling and integration concepts. We report on a method that allows the coupling of optical waveguides to electro-optical components as well as the integration of an entire optical link into the PCB. The electro-optical devices such as lasers and photodiodes are assembled on the PCB and then embedded in an optically transparent material. A focused femtosecond laser beam stimulates a polymerization reaction based on a two-photon absorption effect in the optical material and locally increases the refractive index of the material. In this way waveguide cores can be realized and the embedded components can be connected optically. This approach does not only allow a precise alignment of the waveguide end faces to the components but also offers a truly 3-dimensional routing capability of the waveguides. Using this technology we were able to realize butt-coupling and mirror-coupling interface solutions in several demonstrators. We were also manufacturing demonstrator boards with fully integrated driver and preamplifier chips, which show very low power consumption of down to 10 mW for about 2.5 Gbit/s. Furthermore, demonstrators with interconnects at two different optical layers were realized.

  1. PERSONAL COMPUTER MONITORS: A SCREENING EVALUATION OF VOLATILE ORGANIC EMISSIONS FROM EXISTING PRINTED CIRCUIT BOARD LAMINATES AND POTENTIAL POLLUTION PREVENTION ALTERNATIVES

    EPA Science Inventory

    The report gives results of a screening evaluation of volatile organic emissions from printed circuit board laminates and potential pollution prevention alternatives. In the evaluation, printed circuit board laminates, without circuitry, commonly found in personal computer (PC) m...

  2. Highly flexible self-powered sensors based on printed circuit board technology for human motion detection and gesture recognition.

    PubMed

    Fuh, Yiin-Kuen; Ho, Hsi-Chun

    2016-03-01

    In this paper, we demonstrate a new integration of printed circuit board (PCB) technology-based self-powered sensors (PSSs) and direct-write, near-field electrospinning (NFES) with polyvinylidene fluoride (PVDF) micro/nano fibers (MNFs) as source materials. Integration with PCB technology is highly desirable for affordable mass production. In addition, we systematically investigate the effects of electrodes with intervals in the range of 0.15 mm to 0.40 mm on the resultant PSS output voltage and current. The results show that at a strain of 0.5% and 5 Hz, a PSS with a gap interval 0.15 mm produces a maximum output voltage of 3 V and a maximum output current of 220 nA. Under the same dimensional constraints, the MNFs are massively connected in series (via accumulation of continuous MNFs across the gaps ) and in parallel (via accumulation of parallel MNFs on the same gap) simultaneously. Finally, encapsulation in a flexible polymer with different interval electrodes demonstrated that electrical superposition can be realized by connecting MNFs collectively and effectively in serial/parallel patterns to achieve a high current and high voltage output, respectively. Further improvement in PSSs based on the effect of cooperativity was experimentally realized by rolling-up the device into a cylindrical shape, resulting in a 130% increase in power output due to the cooperative effect. We assembled the piezoelectric MNF sensors on gloves, bandages and stockings to fabricate devices that can detect different types of human motion, including finger motion and various flexing and extensions of an ankle. The firmly glued PSSs were tested on the glove and ankle respectively to detect and harvest the various movements and the output voltage was recorded as ∼1.5 V under jumping movement (one PSS) and ∼4.5 V for the clenched fist with five fingers bent concurrently (five PSSs). This research shows that piezoelectric MNFs not only have a huge impact on harvesting various external

  3. Highly flexible self-powered sensors based on printed circuit board technology for human motion detection and gesture recognition

    NASA Astrophysics Data System (ADS)

    Fuh, Yiin-Kuen; Ho, Hsi-Chun

    2016-03-01

    In this paper, we demonstrate a new integration of printed circuit board (PCB) technology-based self-powered sensors (PSSs) and direct-write, near-field electrospinning (NFES) with polyvinylidene fluoride (PVDF) micro/nano fibers (MNFs) as source materials. Integration with PCB technology is highly desirable for affordable mass production. In addition, we systematically investigate the effects of electrodes with intervals in the range of 0.15 mm to 0.40 mm on the resultant PSS output voltage and current. The results show that at a strain of 0.5% and 5 Hz, a PSS with a gap interval 0.15 mm produces a maximum output voltage of 3 V and a maximum output current of 220 nA. Under the same dimensional constraints, the MNFs are massively connected in series (via accumulation of continuous MNFs across the gaps ) and in parallel (via accumulation of parallel MNFs on the same gap) simultaneously. Finally, encapsulation in a flexible polymer with different interval electrodes demonstrated that electrical superposition can be realized by connecting MNFs collectively and effectively in serial/parallel patterns to achieve a high current and high voltage output, respectively. Further improvement in PSSs based on the effect of cooperativity was experimentally realized by rolling-up the device into a cylindrical shape, resulting in a 130% increase in power output due to the cooperative effect. We assembled the piezoelectric MNF sensors on gloves, bandages and stockings to fabricate devices that can detect different types of human motion, including finger motion and various flexing and extensions of an ankle. The firmly glued PSSs were tested on the glove and ankle respectively to detect and harvest the various movements and the output voltage was recorded as ∼1.5 V under jumping movement (one PSS) and ∼4.5 V for the clenched fist with five fingers bent concurrently (five PSSs). This research shows that piezoelectric MNFs not only have a huge impact on harvesting various external

  4. Highly flexible self-powered sensors based on printed circuit board technology for human motion detection and gesture recognition.

    PubMed

    Fuh, Yiin-Kuen; Ho, Hsi-Chun

    2016-03-01

    In this paper, we demonstrate a new integration of printed circuit board (PCB) technology-based self-powered sensors (PSSs) and direct-write, near-field electrospinning (NFES) with polyvinylidene fluoride (PVDF) micro/nano fibers (MNFs) as source materials. Integration with PCB technology is highly desirable for affordable mass production. In addition, we systematically investigate the effects of electrodes with intervals in the range of 0.15 mm to 0.40 mm on the resultant PSS output voltage and current. The results show that at a strain of 0.5% and 5 Hz, a PSS with a gap interval 0.15 mm produces a maximum output voltage of 3 V and a maximum output current of 220 nA. Under the same dimensional constraints, the MNFs are massively connected in series (via accumulation of continuous MNFs across the gaps ) and in parallel (via accumulation of parallel MNFs on the same gap) simultaneously. Finally, encapsulation in a flexible polymer with different interval electrodes demonstrated that electrical superposition can be realized by connecting MNFs collectively and effectively in serial/parallel patterns to achieve a high current and high voltage output, respectively. Further improvement in PSSs based on the effect of cooperativity was experimentally realized by rolling-up the device into a cylindrical shape, resulting in a 130% increase in power output due to the cooperative effect. We assembled the piezoelectric MNF sensors on gloves, bandages and stockings to fabricate devices that can detect different types of human motion, including finger motion and various flexing and extensions of an ankle. The firmly glued PSSs were tested on the glove and ankle respectively to detect and harvest the various movements and the output voltage was recorded as ∼1.5 V under jumping movement (one PSS) and ∼4.5 V for the clenched fist with five fingers bent concurrently (five PSSs). This research shows that piezoelectric MNFs not only have a huge impact on harvesting various external

  5. An innovative approach to predict technology evolution for the desoldering of printed circuit boards: A perspective from China and America.

    PubMed

    Wang, Chen; Zhao, Wu; Wang, Jie; Chen, Ling; Luo, Chun-Jing

    2016-06-01

    The printed circuit boards basis of electronic equipment have seen a rapid growth in recent years and played a significant role in modern life. Nowadays, the fact that electronic devices upgrade quickly necessitates a proper management of waste printed circuit boards. Non-destructive desoldering of waste printed circuit boards becomes the first and the most crucial step towards recycling electronic components. Owing to the diversity of materials and components, the separation process is difficult, which results in complex and expensive recovery of precious materials and electronic components from waste printed circuit boards. To cope with this problem, we proposed an innovative approach integrating Theory of Inventive Problem Solving (TRIZ) evolution theory and technology maturity mapping system to forecast the evolution trends of desoldering technology of waste printed circuit boards. This approach can be applied to analyse the technology evolution, as well as desoldering technology evolution, then research and development strategy and evolution laws can be recommended. As an example, the maturity of desoldering technology is analysed with a technology maturity mapping system model. What is more, desoldering methods in different stages are analysed and compared. According to the analysis, the technological evolution trends are predicted to be 'the law of energy conductivity' and 'increasing the degree of idealisation'. And the potential technology and evolutionary state of waste printed circuit boards are predicted, offering reference for future waste printed circuit boards recycling. PMID:27067430

  6. An innovative approach to predict technology evolution for the desoldering of printed circuit boards: A perspective from China and America.

    PubMed

    Wang, Chen; Zhao, Wu; Wang, Jie; Chen, Ling; Luo, Chun-Jing

    2016-06-01

    The printed circuit boards basis of electronic equipment have seen a rapid growth in recent years and played a significant role in modern life. Nowadays, the fact that electronic devices upgrade quickly necessitates a proper management of waste printed circuit boards. Non-destructive desoldering of waste printed circuit boards becomes the first and the most crucial step towards recycling electronic components. Owing to the diversity of materials and components, the separation process is difficult, which results in complex and expensive recovery of precious materials and electronic components from waste printed circuit boards. To cope with this problem, we proposed an innovative approach integrating Theory of Inventive Problem Solving (TRIZ) evolution theory and technology maturity mapping system to forecast the evolution trends of desoldering technology of waste printed circuit boards. This approach can be applied to analyse the technology evolution, as well as desoldering technology evolution, then research and development strategy and evolution laws can be recommended. As an example, the maturity of desoldering technology is analysed with a technology maturity mapping system model. What is more, desoldering methods in different stages are analysed and compared. According to the analysis, the technological evolution trends are predicted to be 'the law of energy conductivity' and 'increasing the degree of idealisation'. And the potential technology and evolutionary state of waste printed circuit boards are predicted, offering reference for future waste printed circuit boards recycling.

  7. The application of a polypyrrole precoat for the metallization of printed circuit boards

    SciTech Connect

    Gottesfeld, S.; Uribe, F.A.; Armes, P. )

    1992-01-01

    This paper describes a printed circuit board metallization process starting with the formation of a percent of polypyrrole (PPY) on the board, followed by the direct electrodeposition of copper onto the polypyrrole-coated substrate. The polypyrrole film is applied to the insulating substrate by a single chemical polymerization step from an aqueous solution. The sheet resistance of the polypyrrole precoat is typically of the order of a few hundred {Omega}/{open square} which is a sufficiently low resistance to enable direct metal electrodeposition onto the PPY-coated substrate.

  8. Thermal verification testing of commercial printed-circuit boards for spaceflight

    NASA Technical Reports Server (NTRS)

    Foster, William M., II

    1992-01-01

    A method developed to verify commercial printed-circuit boards for a Shuttle orbital flight is discussed. The test sequence is based on early fault detection, desire to test the final assembly, and integration with other verification testing. A component thermal screening test is performed first to force flaws in design, workmanship, parts, processes, and materials into observable failures. Temperature definition and vibration tests are performed next. Final assembly testing is performed to simulate the Shuttle flight. An abbreviated thermal screening test is performed as a check after the vibration test, and then a complete thermal operational test is performed. The final assembly test finishes up with a burn-in of 100 h of trouble-free operation. Verification is successful when all components and final assemblies have passed each test. This method was very successful in verifying that commercial printed-circuit boards will survive in the Shuttle environment.

  9. Differential microfluidic sensor on printed circuit board for biological cells analysis.

    PubMed

    Shi, Dongyuan; Guo, Jinhong; Chen, Liang; Xia, Chuncheng; Yu, Zhefeng; Ai, Ye; Li, Chang Ming; Kang, Yuejun; Wang, Zhiming

    2015-08-01

    Coulter principal based resistive pulse sensor has been demonstrated as an important platform in biological cell detection and enumeration since several decades ago. Recently, the miniaturized micro-Coulter counter has attracted much attention due to its advantages in point of care diagnostics for on chip detection and enumeration of rare cells, such as circulating tumor cells. In this paper, we present a microfluidic cytometer with differential amplifier based on Coulter principle on a SU-8 coated printed circuit board substrate. The electrical current changes induced by the blockage of the microparticles in the sensing aperture are calibrated by polystyrene particles of standard size. Finally, HeLa cells are used to evaluate the performance of the proposed device for enumeration of biological samples. The proposed cytometer is built upon the cheap and widely available printed circuit board substrate and shows its great potential as personalized healthcare monitor. PMID:25735615

  10. A Formal Algorithm for Routing Traces on a Printed Circuit Board

    NASA Technical Reports Server (NTRS)

    Hedgley, David R., Jr.

    1996-01-01

    This paper addresses the classical problem of printed circuit board routing: that is, the problem of automatic routing by a computer other than by brute force that causes the execution time to grow exponentially as a function of the complexity. Most of the present solutions are either inexpensive but not efficient and fast, or efficient and fast but very costly. Many solutions are proprietary, so not much is written or known about the actual algorithms upon which these solutions are based. This paper presents a formal algorithm for routing traces on a print- ed circuit board. The solution presented is very fast and efficient and for the first time speaks to the question eloquently by way of symbolic statements.

  11. The separation of waste printed circuit board by dissolving bromine epoxy resin using organic solvent.

    PubMed

    Zhu, P; Chen, Y; Wang, L Y; Zhou, M; Zhou, J

    2013-02-01

    Separation of waste printed circuit boards (WPCBs) has been a bottleneck in WPCBs resource processing. In this study, the separation of WPCBs was performed using dimethyl sulfoxide (DMSO) as a solvent. Various parameters, which included solid to liquid ratio, temperature, WPCB sizes, and time, were studied to understand the separation of WPCBs by dissolving bromine epoxy resin using DMSO. Experimental results showed that the concentration of dissolving the bromine epoxy resin increased with increasing various parameters. The optimum condition of complete separation of WPCBs was solid to liquid ratio of 1:7 and WPCB sizes of 16 mm(2) at 145°C for 60 min. The used DMSO was vapored under the decompression, which obtained the regenerated DMSO and dissolved bromine epoxy resin. This clean and non-polluting technology offers a new way to separate valuable materials from WPCBs and prevent the environmental pollution of waste printed circuit boards effectively.

  12. Differential microfluidic sensor on printed circuit board for biological cells analysis.

    PubMed

    Shi, Dongyuan; Guo, Jinhong; Chen, Liang; Xia, Chuncheng; Yu, Zhefeng; Ai, Ye; Li, Chang Ming; Kang, Yuejun; Wang, Zhiming

    2015-08-01

    Coulter principal based resistive pulse sensor has been demonstrated as an important platform in biological cell detection and enumeration since several decades ago. Recently, the miniaturized micro-Coulter counter has attracted much attention due to its advantages in point of care diagnostics for on chip detection and enumeration of rare cells, such as circulating tumor cells. In this paper, we present a microfluidic cytometer with differential amplifier based on Coulter principle on a SU-8 coated printed circuit board substrate. The electrical current changes induced by the blockage of the microparticles in the sensing aperture are calibrated by polystyrene particles of standard size. Finally, HeLa cells are used to evaluate the performance of the proposed device for enumeration of biological samples. The proposed cytometer is built upon the cheap and widely available printed circuit board substrate and shows its great potential as personalized healthcare monitor.

  13. Design and implementation of a multi-sensor robot system for printed circuit board insertion

    NASA Technical Reports Server (NTRS)

    Sood, Deepak; Repko, Michael C.; Kelley, Robert B.

    1989-01-01

    The design and implementation of a robot system equipped with multiple sensors are described. The robotic assembly system couples the task sequence of the robot with information from different sensors, enabling the system to handle uncertainties encountered during task execution. The target task involves the insertion of a printed circuit board into a card cage. The sensors used are an overhead three-dimensional vision system, a fingertip cross-fire sensor, and a 6-DOF force/torque sensor. The vision system is used to locate the printed circuit boards and the insertion slots. Information provided by the cross-fire sensor is used to complement the information from the vision system in order to obtain a proper grasping location on the printed circuit board. A fuzzy-logic-based system is used to interpret the forces and torques generated by the force/torque sensor during the insertion process. The repeated success of this assembly task over many experimental trials verifies the modeling and controller assumptions.

  14. A multi-stage image charge detector made from printed circuit boards.

    PubMed

    Barney, Brandon L; Daly, R Terik; Austin, Daniel E

    2013-11-01

    We present the first reported instance of an image-charge detector for charged particles in which detection elements are patterned onto printed circuit boards. In contrast to conventional techniques involving separately machined and positioned segments of metal tubing, this technique is much simpler to assemble, align, and connect to electrical wiring, with no loss in sensitivity. The performance of single-stage and 5-stage charge detectors is demonstrated using electrospray-charged, micrometer-size polystyrene spheres. Both velocity and charge of each particle are measured. Multiple detection stages--which require no extra effort to pattern or setup compared with a single stage--result in an ensemble averaging effect, improving the detection limit over what can be achieved with a single-stage detector. A comparison is made between the printed circuit board detector and a conventional tubular charge detector and found to be statistically equivalent. These results demonstrate and illustrate that devices for detection, analysis, and/or manipulation of charged particles and ions can be made using printed circuit boards rather than using separately fabricated metal electrodes.

  15. Surface and Electrical Characterization of Ag/AgCl Pseudo-Reference Electrodes Manufactured with Commercially Available PCB Technologies.

    PubMed

    Moschou, Despina; Trantidou, Tatiana; Regoutz, Anna; Carta, Daniela; Morgan, Hywel; Prodromakis, Themistoklis

    2015-07-24

    Lab-on-Chip is a technology that could potentially revolutionize medical Point-of-Care diagnostics. Considerable research effort is focused towards innovating production technologies that will make commercial upscaling financially viable. Printed circuit board manufacturing techniques offer several prospects in this field. Here, we present a novel approach to manufacturing Printed Circuit Board (PCB)-based Ag/AgCl reference electrodes, an essential component of biosensors. Our prototypes were characterized both structurally and electrically. Scanning Electron Microscopy (SEM) and X-Ray Photoelectron Spectroscopy (XPS) were employed to evaluate the electrode surface characteristics. Electrical characterization was performed to determine stability and pH dependency. Finally, we demonstrate utilization along with PCB pH sensors, as a step towards a fully integrated PCB platform, comparing performance with discrete commercial reference electrodes.

  16. Surface and Electrical Characterization of Ag/AgCl Pseudo-Reference Electrodes Manufactured with Commercially Available PCB Technologies

    PubMed Central

    Moschou, Despina; Trantidou, Tatiana; Regoutz, Anna; Carta, Daniela; Morgan, Hywel; Prodromakis, Themistoklis

    2015-01-01

    Lab-on-Chip is a technology that could potentially revolutionize medical Point-of-Care diagnostics. Considerable research effort is focused towards innovating production technologies that will make commercial upscaling financially viable. Printed circuit board manufacturing techniques offer several prospects in this field. Here, we present a novel approach to manufacturing Printed Circuit Board (PCB)-based Ag/AgCl reference electrodes, an essential component of biosensors. Our prototypes were characterized both structurally and electrically. Scanning Electron Microscopy (SEM) and X-Ray Photoelectron Spectroscopy (XPS) were employed to evaluate the electrode surface characteristics. Electrical characterization was performed to determine stability and pH dependency. Finally, we demonstrate utilization along with PCB pH sensors, as a step towards a fully integrated PCB platform, comparing performance with discrete commercial reference electrodes. PMID:26213940

  17. Comparison between conventional and laser method of imaging tracks on PCB

    NASA Astrophysics Data System (ADS)

    Barbucha, R.; Kocik, M.; Mizeraczyk, J.; Kozioł, G.; Borecki, J.

    2007-02-01

    The increasing demands for miniaturization and better functionality of electronic components and devices have a significant effect on the requirements facing the printed circuit board (PCB) industry. PCB manufactures are driving for producing high density interconnect (HDI) boards at significantly reduced cost and reduced implementation time. The interconnection complexity of the PCB is still growing and today calls for 50/50 μm or 25/25 μm technology are real. Existing technologies are unable to offer acceptable solution. Recently the Laser Direct Imaging (LDI) technology is considered as an answer for these challenges. LDI is a process of imaging electric circuits directly on PCB without the use of a phototool or mask. The exposure of the photo-sensitive resist is carried out using a laser beam that is scanned across photoresist surface and switched on and off by means of a computer control system according to the electrical circuit pattern. Usually the laser used in the LDI generates a UV line, which is suitable to the commonly available photoresists. Our laboratory system for Laser Direct Imaging is designed for tracks and spaces on PCB with minimum width distance of 50/50 μm. In comparison with conventional photolithography method, this technology is much better for 50/50 μm track and spaces. In our research we used photoresist with resolution 50 μm, but in case of using laser photoresists with better resolution (e.g. 25 μm) it will be possible to image tracks in super-fine-line technology (25/25 μm). The comparison between two technology of creating mosaic pattern tracks on PCB proved that laser imaging is promising technology in high density interconnects patterns, which are widely use in multilayered PCB and similar applications.

  18. Enrichment of the metallic components from waste printed circuit boards by a mechanical separation process using a stamp mill

    SciTech Connect

    Yoo, Jae-Min; Jeong, Jinki; Yoo, Kyoungkeun; Lee, Jae-chun Kim, Wonbaek

    2009-03-15

    Printed circuit boards incorporated in most electrical and electronic equipment contain valuable metals such as Cu, Ni, Au, Ag, Pd, Fe, Sn, and Pb. In order to employ a hydrometallurgical route for the recycling of valuable metals from printed circuit boards, a mechanical pre-treatment step is needed. In this study, the metallic components from waste printed circuit boards have been enriched using a mechanical separation process. Waste printed circuit boards shredded to <10 mm were milled using a stamp mill to liberate the various metallic components, and then the milled printed circuit boards were classified into fractions of <0.6, 0.6-1.2, 1.2-2.5, 2.5-5.0, and >5.0 mm. The fractions of milled printed circuit boards of size <5.0 mm were separated into a light fraction of mostly non-metallic components and a heavy fraction of the metallic components by gravity separation using a zig-zag classifier. The >5.0 mm fraction and the heavy fraction were subjected to two-step magnetic separation. Through the first magnetic separation at 700 Gauss, 83% of the nickel and iron, based on the whole printed circuit boards, was recovered in the magnetic fraction, and 92% of the copper was recovered in the non-magnetic fraction. The cumulative recovery of nickel-iron concentrate was increased by a second magnetic separation at 3000 Gauss, but the grade of the concentrate decreased remarkably from 76% to 56%. The cumulative recovery of copper concentrate decreased, but the grade increased slightly from 71.6% to 75.4%. This study has demonstrated the feasibility of the mechanical separation process consisting of milling/size classification/gravity separation/two-step magnetic separation for enriching metallic components such as Cu, Ni, Al, and Fe from waste printed circuit boards.

  19. Enrichment of the metallic components from waste printed circuit boards by a mechanical separation process using a stamp mill.

    PubMed

    Yoo, Jae-Min; Jeong, Jinki; Yoo, Kyoungkeun; Lee, Jae-Chun; Kim, Wonbaek

    2009-03-01

    Printed circuit boards incorporated in most electrical and electronic equipment contain valuable metals such as Cu, Ni, Au, Ag, Pd, Fe, Sn, and Pb. In order to employ a hydrometallurgical route for the recycling of valuable metals from printed circuit boards, a mechanical pre-treatment step is needed. In this study, the metallic components from waste printed circuit boards have been enriched using a mechanical separation process. Waste printed circuit boards shredded to <10mm were milled using a stamp mill to liberate the various metallic components, and then the milled printed circuit boards were classified into fractions of <0.6, 0.6-1.2, 1.2-2.5, 2.5-5.0, and >5.0mm. The fractions of milled printed circuit boards of size <5.0mm were separated into a light fraction of mostly non-metallic components and a heavy fraction of the metallic components by gravity separation using a zig-zag classifier. The >5.0mm fraction and the heavy fraction were subjected to two-step magnetic separation. Through the first magnetic separation at 700 Gauss, 83% of the nickel and iron, based on the whole printed circuit boards, was recovered in the magnetic fraction, and 92% of the copper was recovered in the non-magnetic fraction. The cumulative recovery of nickel-iron concentrate was increased by a second magnetic separation at 3000 Gauss, but the grade of the concentrate decreased remarkably from 76% to 56%. The cumulative recovery of copper concentrate decreased, but the grade increased slightly from 71.6% to 75.4%. This study has demonstrated the feasibility of the mechanical separation process consisting of milling/size classification/gravity separation/two-step magnetic separation for enriching metallic components such as Cu, Ni, Al, and Fe from waste printed circuit boards. PMID:18835149

  20. Initial Corrosion Behavior and Mechanism of PCB-HASL in Typical Outdoor Environments in China

    NASA Astrophysics Data System (ADS)

    Ding, Kangkang; Xiao, Kui; Dong, Chaofang; Zou, Shiwen; Yi, Pan; Li, Xiaogang

    2015-11-01

    A long-term (1, 3, and 6 months) outdoor exposure test was performed for lead-free hot air solder leveling printed circuit boards (PCB-HASL) in typical environments in China and the corrosion behavior and mechanism of outdoor PCB-HASL were investigated. In a dry environment PCB-HASL corroded slightly, because of the protective effect of surface oxide films. Corrosion spread from places where dust particles were deposited or mold spores were adsorbed. Under the combined effects of humidity and contamination, large amounts of granular corrosion products with a loose structure were generated, greatly reducing the protective effect of the Sn layer. Furthermore, protection of the edges of the plates was poor, and corrosion products from these regions migrated rapidly on the FR-4 board. When a 12 V electrical bias was applied, Sn and Cu migrated simultaneously. In the electrochemical migration process the effect of humidity was much more critical than that of contamination.

  1. Polymer multimode waveguide optical and electronic PCB manufacturing

    NASA Astrophysics Data System (ADS)

    Selviah, David R.

    2009-02-01

    The paper describes the research in the Â#1.3 million IeMRC Integrated Optical and Electronic Interconnect PCB Manufacturing (OPCB) Flagship Project in which 8 companies and 3 universities carry out collaborative research and which was formed and is technically led by the author. The consortium's research is aimed at investigating a range of fabrication techniques, some established and some novel, for fabricating polymer multimode waveguides from several polymers, some formulations of which are being developed within the project. The challenge is to develop low cost waveguide manufacturing techniques compatible with commercial PCB manufacturing and to reduce their alignment cost. The project aims to take the first steps in making this hybrid optical waveguide and electrical copper track printed circuit board disruptive technology widely available by establishing and incorporating waveguide design rules into commercial PCB layout software and transferring the technology for fabricating such boards to a commercial PCB manufacturer. To focus the research the project is designing an optical waveguide backplane to tight realistic constraints, using commercial layout software with the new optical design rules, for a demonstrator into which 4 daughter cards are plugged, each carrying an aggregate of 80 Gb/s data so that each waveguide carries 10 Gb/s.

  2. Assembling surface mounted components on ink-jet printed double sided paper circuit board.

    PubMed

    Andersson, Henrik A; Manuilskiy, Anatoliy; Haller, Stefan; Hummelgård, Magnus; Sidén, Johan; Hummelgård, Christine; Olin, Håkan; Nilsson, Hans-Erik

    2014-03-01

    Printed electronics is a rapidly developing field where many components can already be manufactured on flexible substrates by printing or by other high speed manufacturing methods. However, the functionality of even the most inexpensive microcontroller or other integrated circuit is, at the present time and for the foreseeable future, out of reach by means of fully printed components. Therefore, it is of interest to investigate hybrid printed electronics, where regular electrical components are mounted on flexible substrates to achieve high functionality at a low cost. Moreover, the use of paper as a substrate for printed electronics is of growing interest because it is an environmentally friendly and renewable material and is, additionally, the main material used for many packages in which electronics functionalities could be integrated. One of the challenges for such hybrid printed electronics is the mounting of the components and the interconnection between layers on flexible substrates with printed conductive tracks that should provide as low a resistance as possible while still being able to be used in a high speed manufacturing process. In this article, several conductive adhesives are evaluated as well as soldering for mounting surface mounted components on a paper circuit board with ink-jet printed tracks and, in addition, a double sided Arduino compatible circuit board is manufactured and programmed.

  3. Assembling surface mounted components on ink-jet printed double sided paper circuit board

    NASA Astrophysics Data System (ADS)

    Andersson, Henrik A.; Manuilskiy, Anatoliy; Haller, Stefan; Hummelgård, Magnus; Sidén, Johan; Hummelgård, Christine; Olin, Håkan; Nilsson, Hans-Erik

    2014-03-01

    Printed electronics is a rapidly developing field where many components can already be manufactured on flexible substrates by printing or by other high speed manufacturing methods. However, the functionality of even the most inexpensive microcontroller or other integrated circuit is, at the present time and for the foreseeable future, out of reach by means of fully printed components. Therefore, it is of interest to investigate hybrid printed electronics, where regular electrical components are mounted on flexible substrates to achieve high functionality at a low cost. Moreover, the use of paper as a substrate for printed electronics is of growing interest because it is an environmentally friendly and renewable material and is, additionally, the main material used for many packages in which electronics functionalities could be integrated. One of the challenges for such hybrid printed electronics is the mounting of the components and the interconnection between layers on flexible substrates with printed conductive tracks that should provide as low a resistance as possible while still being able to be used in a high speed manufacturing process. In this article, several conductive adhesives are evaluated as well as soldering for mounting surface mounted components on a paper circuit board with ink-jet printed tracks and, in addition, a double sided Arduino compatible circuit board is manufactured and programmed.

  4. Pyrolysis characteristics of integrated circuit boards at various particle sizes and temperatures.

    PubMed

    Chiang, Hung-Lung; Lin, Kuo-Hsiung; Lai, Mei-Hsiu; Chen, Ting-Chien; Ma, Sen-Yi

    2007-10-01

    A pyrolysis method was employed to recycle the metals and brominated compounds blended into printed circuit boards. This research investigated the effect of particle size and process temperature on the element composition of IC boards and pyrolytic residues, liquid products, and water-soluble ionic species in the exhaust, with the overall goal being to identify the pyrolysis conditions that will have the least impact on the environment. Integrated circuit (IC) boards were crushed into 5-40 mesh (0.71-4.4mm), and the crushed particles were pyrolyzed at temperatures ranging from 200 to 500 degrees C. The thermal decomposition kinetics were measured by a thermogravimetric (TG) analyzer. The composition of pyrolytic residues was analyzed by Energy Dispersive X-ray Spectrometer (EDS), Inductively Coupled Plasma Atomic Emission Spectrometer (ICP-AES) and Inductively Coupled Plasma-Mass Spectrometry (ICP-MS). In addition, the element compositions of liquid products were analyzed by ICP-AES and ICP-MS. Pyrolytic exhaust was collected by a water-absorption system in an ice-bath cooler, and IC analysis showed that the absorbed solution comprised 11 ionic species. Based on the pyrolytic kinetic parameters of TG analysis and pyrolytic residues at various temperatures for 30 min, the effect of particle size was insignificant in this study, and temperature was the key factor for the IC board pyrolysis. Two stages of decomposition were found for IC board pyrolysis under nitrogen atmosphere. The activation energy was 38-47 kcal/mol for the first-stage reaction and 5.2-9.4 kcal/mol for the second-stage reaction. Metal content was low in the liquid by-product of the IC board pyrolysis process, which is an advantage in that the liquid product could be used as a fuel. Brominate and ammonium were the main water-soluble ionic species of the pyrolytic exhaust. A plan for their safe and effective disposal must be developed if the pyrolytic recycling process is to be applied to IC boards

  5. Pyrolysis characteristics of integrated circuit boards at various particle sizes and temperatures.

    PubMed

    Chiang, Hung-Lung; Lin, Kuo-Hsiung; Lai, Mei-Hsiu; Chen, Ting-Chien; Ma, Sen-Yi

    2007-10-01

    A pyrolysis method was employed to recycle the metals and brominated compounds blended into printed circuit boards. This research investigated the effect of particle size and process temperature on the element composition of IC boards and pyrolytic residues, liquid products, and water-soluble ionic species in the exhaust, with the overall goal being to identify the pyrolysis conditions that will have the least impact on the environment. Integrated circuit (IC) boards were crushed into 5-40 mesh (0.71-4.4mm), and the crushed particles were pyrolyzed at temperatures ranging from 200 to 500 degrees C. The thermal decomposition kinetics were measured by a thermogravimetric (TG) analyzer. The composition of pyrolytic residues was analyzed by Energy Dispersive X-ray Spectrometer (EDS), Inductively Coupled Plasma Atomic Emission Spectrometer (ICP-AES) and Inductively Coupled Plasma-Mass Spectrometry (ICP-MS). In addition, the element compositions of liquid products were analyzed by ICP-AES and ICP-MS. Pyrolytic exhaust was collected by a water-absorption system in an ice-bath cooler, and IC analysis showed that the absorbed solution comprised 11 ionic species. Based on the pyrolytic kinetic parameters of TG analysis and pyrolytic residues at various temperatures for 30 min, the effect of particle size was insignificant in this study, and temperature was the key factor for the IC board pyrolysis. Two stages of decomposition were found for IC board pyrolysis under nitrogen atmosphere. The activation energy was 38-47 kcal/mol for the first-stage reaction and 5.2-9.4 kcal/mol for the second-stage reaction. Metal content was low in the liquid by-product of the IC board pyrolysis process, which is an advantage in that the liquid product could be used as a fuel. Brominate and ammonium were the main water-soluble ionic species of the pyrolytic exhaust. A plan for their safe and effective disposal must be developed if the pyrolytic recycling process is to be applied to IC boards.

  6. Recovery of copper from printed circuit boards scraps by mechanical processing and electrometallurgy.

    PubMed

    Veit, Hugo Marcelo; Bernardes, Andréa Moura; Ferreira, Jane Zoppas; Tenório, Jorge Alberto Soares; de Fraga Malfatti, Célia

    2006-10-11

    The constant growth in generation of solid wastes stimulates studies of recycling processes. The electronic scrap is part of this universe of obsolete and/or defective materials that need to be disposed of more appropriately, or then recycled. In this work, printed circuit boards, that are part of electronic scrap and are found in almost all electro-electronic equipments, were studied. Printed circuit boards were collected in obsolete or defective personal computers that are the largest source of this kind of waste. Printed circuit boards are composed of different materials such as polymers, ceramics and metals, which makes the process more difficult. However, the presence of metals, such as copper and precious metals encourage recycling studies. Also the presence of heavy metals, as Pb and Cd turns this scrap into dangerous residues. This demonstrates the need to search for solutions of this kind of residue, in order to have it disposed in a proper way, without harming the environment. At the first stage of this work, mechanical processing was used, as comminution followed by size, magnetic and electrostatic separation. By this process it was possible to obtain a concentrated fraction in metals (mainly Cu, Pb and Sn) and another fraction containing polymers and ceramics. The copper content reached more than 50% in mass in most of the conductive fractions and significant content of Pb and Sn. At the second stage, the fraction concentrated in metals was dissolved with acids and treated in an electrochemical process in order to recover the metals separately, especially copper. The results demonstrate the technical viability of recovering copper using mechanical processing followed by an electrometallurgical technique. The copper content in solution decayed quickly in all the experiments and the copper obtained by electrowinning is above 98% in most of the tests. PMID:16757116

  7. Note: Printed circuit board based electrically triggered compact rail gap switch

    NASA Astrophysics Data System (ADS)

    Saxena, A. K.; Kaushik, T. C.; Goswami, M. P.; Gupta, Satish C.

    2010-05-01

    An electrically triggered rail gap switch has been designed over a commercially available copper clad fiberglass sheet commonly used in making printed circuit boards for applications requiring compact design and direct integration to parallel plate transmission lines. Switch performance has been investigated in terms of its inductance, jitter, and gap closing time. With an electrode separation of 9.0 mm, it has been found to have an inductance of 6 nH, gap closing time of 5 ns, and jitter of about 4-10 ns measured at 95% of self-breakdown voltage. An application of this switch has been demonstrated as an electrically exploding foil accelerator developed over the same board and velocities up to 1.6 km/s have been achieved on Kapton flyers with diameter of 3.0 mm and thickness of 125 μm using a compact 1 μF capacitor bank.

  8. Note: Printed circuit board based electrically triggered compact rail gap switch.

    PubMed

    Saxena, A K; Kaushik, T C; Goswami, M P; Gupta, Satish C

    2010-05-01

    An electrically triggered rail gap switch has been designed over a commercially available copper clad fiberglass sheet commonly used in making printed circuit boards for applications requiring compact design and direct integration to parallel plate transmission lines. Switch performance has been investigated in terms of its inductance, jitter, and gap closing time. With an electrode separation of 9.0 mm, it has been found to have an inductance of 6 nH, gap closing time of 5 ns, and jitter of about 4-10 ns measured at 95% of self-breakdown voltage. An application of this switch has been demonstrated as an electrically exploding foil accelerator developed over the same board and velocities up to 1.6 km/s have been achieved on Kapton flyers with diameter of 3.0 mm and thickness of 125 microm using a compact 1 microF capacitor bank. PMID:20515183

  9. Recovery Act: High-Temperature Circuit Boards for use in Geothermal Well Monitoring Applications

    SciTech Connect

    Hooker, Matthew; Fabian, Paul

    2013-05-01

    The U.S. Department of Energy is leading the development of alternative energy sources that will ensure the long-term energy independence of our nation. One of the key renewable resources currently being advanced is geothermal energy. To tap into the large potential offered by generating power from the heat of the earth, and for geothermal energy to be more widely used, it will be necessary to drill deeper wells to reach the hot, dry rock located up to 10 km beneath the earth’s surface. In this instance, water will be introduced into the well to create a geothermal reservoir. A geothermal well produced in this manner is referred to as an enhanced geothermal system (EGS). EGS reservoirs are typically at depths of 3 to 10 km, and the temperatures at these depths have become a limiting factor in the application of existing downhole technologies. These high temperatures are especially problematic for electronic systems such as downhole data-logging tools, which are used to map and characterize the fractures and high-permeability regions in underground formations. Information provided by these tools is assessed so that underground formations capable of providing geothermal energy can be identified, and the subsequent drilling operations can be accurately directed to those locations. The mapping of geothermal resources involves the design and fabrication of sensor packages, including the electronic control modules, to quantify downhole conditions (300°C temperature, high pressure, seismic activity, etc.). Because of the extreme depths at which these measurements are performed, it is most desirable to perform the sensor signal processing downhole and then transmit the information to the surface. This approach necessitates the use of high-temperature electronics that can operate in the downhole environment. Downhole signal processing in EGS wells will require the development and demonstration of circuit boards that can withstand the elevated temperatures found at these

  10. Separation of the metallic and non-metallic fraction from printed circuit boards employing green technology.

    PubMed

    Estrada-Ruiz, R H; Flores-Campos, R; Gámez-Altamirano, H A; Velarde-Sánchez, E J

    2016-07-01

    The generation of electrical and electronic waste is increasing day by day; recycling is attractive because of the metallic fraction containing these. Nevertheless, conventional techniques are highly polluting. The comminution of the printed circuit boards followed by an inverse flotation process is a clean technique that allows one to separate the metallic fraction from the non-metallic fraction. It was found that particle size and superficial air velocity are the main variables in the separation of the different fractions. In this way an efficient separation is achieved by avoiding the environmental contamination coupled with the possible utilization of the different fractions obtained. PMID:26963241

  11. Waste-minimization assessment for a manufacturer of printed-circuit boards. Environmental research brief

    SciTech Connect

    Kirsch, F.W.; Looby, G.P.

    1991-07-01

    The U.S. Environmental Protection Agency (EPA) has funded a pilot project to assist small- and medium-size manufacturers who want to minimize their generation of hazardous waste but who lack the expertise to do so. Waste Minimization Assessment Centers (WMACs) were established at selected universities and procedures were adapted from the EPA Waste Minimization Opportunity Assessment Manual (EPA/625/7-88/003, July 1988). The WMAC team at Colorado State University inspected a plant producing printed circuit boards -- a plant that already had taken steps to control its hazardous wastes. Producing a circuit board involves many major processes and subprocesses: preparing the board; depositing copper on the board by electroless plating; applying dry film; electrolytically plating copper; electrolytically plating tin; etching and stripping; applying solder; and, perhaps, plating gold on connectors. Each of these steps produces hazardous wastes, e.g., electrolytic copper plating results in acid soap dumps, copper and tin drag-out, and sulfuric acid. The main sources of metallic contamination (copper (both dissolved and metallic), tin, lead, gold) are the rinses after scrubbing, plating, and etching. Although the greatest amount of waste can be reduced by reusing effluent from the MEMTEK (with some further treatment), the greatest dollar savings can be found by changing the dry film developer. The present brand adheres strongly to the unexposed film and requires an aggressive acid soap; a less aggressive, nonhazardous soap could be used with a less-adhering dry film developer. The Research Brief was developed by the principal investigators and EPA's Risk Reduction Engineering Laboratory, Cincinnati, OH, to announce key findings of an ongoing research project that is fully documented in a separate report of the same title available from the authors.

  12. Nonlinear electromagnetic energy harvesters fabricated by rigid-flex printed circuit board technology

    NASA Astrophysics Data System (ADS)

    Chiu, Yi; Hong, Hao-Chiao; Hsu, Wei-Hung

    2015-12-01

    In this paper, a wideband electromagnetic energy harvester designed and fabricated by commercial rigid-flex PCB technology is demonstrated. The rigid FR-4 boards are used for mechanical frames and coil winding whereas the flexible polyimide film is used for mechanical springs and mass platforms. The total dimension of the device is 20 × 20 × 2 mm3. The internal coil resistance is 15 Ω. In vibration tests, nonlinearity can be observed even at 0.1 g vibration level due to the spring hardening effect. The peak frequency was increased as the vibration level increased. The effective bandwidth was increased from 6 Hz at 0.1 g to 21 Hz at 0.5 g and 27 Hz at 1 g, respectivel, due to the hysteresis effect. For a matched load and 1 g vibration at 240 Hz, the maximum output power is 24.5 nW, corresponding to a power density of 31 nW/cm3.

  13. PCB-Based Break-Out Box

    NASA Technical Reports Server (NTRS)

    Lee, Jason H.

    2011-01-01

    Break-out boxes (BOBs) are necessary for all electrical integration/cable checkouts and troubleshooting. Because the price of a BOB is high, and no work can be done without one, often the procedure stops, simply waiting for a BOB. A less expensive BOB would take less time in the integration, testing, and troubleshooting process. The PCB-based BOB works and looks the same as a standard JPL BOB, called Gold Boxes. The only differences between the old BOB and the new PCB-based BOB is that the new one has 80 percent of its circuitry in a printed circuit board. This process reduces the time for fabrication, thus making the BOBs less expensive. Moreover, because of its unique design, the new BOBs can be easily assembled and fixed. About 80 percent of the new PCB-based BOB is in a $22 (at the time of this reporting) custom-designed, yet commercially available PCB. This device has been used successfully to verify that BOB cables were properly made. Also, upon completion, the BOB was beeped out via a multimeter to ensure that all sockets on the connectors were properly connected to the respective banana jack. When compared to the Gold Box BOBs, the new BOB has many advantages. It is much more cost efficient, it delivers equal usability at substantially lower cost of the BOB, and the Gold Box is much heavier when compared to the new BOB. The new BOB is also a bit longer and much more versatile in that connectors are easily changeable and if a banana jack is broken, it can be replaced instead of throwing away an entire BOB.

  14. Thermal verification testing of commercial printed-circuit boards for spaceflight

    NASA Technical Reports Server (NTRS)

    Foster, William M., II

    1991-01-01

    A method is discussed developed to verify commercial printed-circuit boards for a shuttle orbital flight. The Space Acceleration Measurement System Project used this method first with great success. The test sequence is based on early fault detection, desire to test the final assembly, and integration with other verification testing. A component thermal screening test is performed first to force flaws in design, workmanship, parts, processes, and materials into observable failures. Then temperature definition tests are performed that consist of infrared scanning, thermal vacuum testing, and preliminary thermal operational testing. Only the engineering unit is used for temperature definition testing, but the preliminary thermal operational testing is performed on the flight unit after the temperature range has been defined. In the sequence of testing, vibration testing is performed next, but most vibration failures cannot be detected without subsequent temperature cycling. Finally, final assembly testing is performed to simulate the shuttle flight. An abbreviated thermal screening test is performed as a check after the vibration test, and then a complete thermal operational test is performed. The final assembly test finishes up with a burn-in of 100 hours of trouble-free operation. Verification is successful when all components and final assemblies have passed each test satisfactory. This method was very successful in verifying that commercial printed-circuit boards will survive in the shuttle environment.

  15. Immobilization of Acidithiobacillus ferrooxidans on Cotton Gauze for the Bioleaching of Waste Printed Circuit Boards.

    PubMed

    Nie, Hongyan; Zhu, Nengwu; Cao, Yanlan; Xu, Zhiguo; Wu, Pingxiao

    2015-10-01

    The bioleaching parameters of metal concentrates from waste printed circuit boards by Acidithiobacillus ferrooxidans immobilized on cotton gauze in a two-step reactor were investigated in this study. The results indicated that an average ferrous iron oxidation rate of 0.54 g/(L·h) and a ferrous iron oxidation ratio of 96.90 % were obtained after 12 h at aeration rate of 1 L/min in bio-oxidation reactor. After 96 h, the highest leaching efficiency of copper reached 91.68 % under the conditions of the content of the metal powder 12 g/L, the retention time 6 h, and the aeration rate 1 L/min. The bioleaching efficiency of copper could be above 91.12 % under repeated continuous batch operation. Meanwhile, 95.32 % of zinc, 90.32 % of magnesium, 86.31 % of aluminum, and 59.07 % of nickel were extracted after 96 h. All the findings suggested that the recovery of metal concentrates from waste printed circuit boards via immobilization of A. ferrooxidans on cotton gauze was feasible. PMID:26239442

  16. Microwave assisted leaching and electrochemical recovery of copper from printed circuit boards of computer waste

    NASA Astrophysics Data System (ADS)

    Ivǎnuş, R. C.; ǎnuş, D., IV; Cǎlmuc, F.

    2010-06-01

    Due to the rapid technological progress, the replacement of electronic equipment is very often necessary, leading to huge amounts that end up as waste. In addition, waste electrical and electronic equipment (WEEE) contains metals of high commercial value and others that are supposed to be hazardous for the environment. Consequently, WEEE could be considered as a significant source for recovery of nonferrous metals. Among these wastes, computers appear to be distinctive, as far as further exploitation is concerned. The most ″useful″ parts of the computers are the printed circuit boards that contain many metals of interest. A study on microwave assisted electronic scrap (printed circuit boards of computer waste - PCBs) leaching was carried out with a microwave hydrothermal reactor. The leaching was conducted with thick slurries (50-100 g/L). The leaching media is a mixed solution of CuCl2 and NaCl. Preliminary electrolysis from leaching solution has investigated the feasibility of electrodeposition of copper. The results were discussed and compared with the conventional leaching method and demonstrated the potential for selective extraction of copper from PCBs.

  17. Mineralogical analysis of dust collected from typical recycling line of waste printed circuit boards.

    PubMed

    Wang, Fangfang; Zhao, Yuemin; Zhang, Tao; Duan, Chenlong; Wang, Lizhang

    2015-09-01

    As dust is one of the byproducts originating in the mechanical recycling process of waste printed circuit boards such as crushing and separating, from the viewpoints of resource reuse and environmental protection, an effective recycling method to recover valuable materials from this kind of dust is in urgent need. In this paper, detailed mineralogical analysis on the dust collected from a typical recycling line of waste printed circuit boards is investigated by coupling several analytical techniques. The results demonstrate that there are 73.1wt.% organic matters, 4.65wt.% Al, 4.55wt.% Fe, 2.67wt.% Cu and 1.06wt.% Pb in the dust, which reveals the dust is worthy of reuse and harmful to environment. The concentration ratios of Fe, Mn and Zn can reach 12.35, 12.33 and 6.67 respectively by magnetic separation. The yield of dust in each size fraction is nonuniform, while the yield of -0.75mm size fraction is up to 51.15wt.%; as the particle size decreases, the content of liberated metals and magnetic materials increase, and metals are mainly in elemental forms. The F, Cl and Br elements combing to C in the dust would make thermal treatment dangerous to the environment. Based on these results, a flowsheet to recycle the dust is proposed. PMID:26117419

  18. Three-dimensionally deformable, highly stretchable, permeable, durable and washable fabric circuit boards

    PubMed Central

    Li, Qiao; Tao, Xiao Ming

    2014-01-01

    This paper reports fabric circuit boards (FCBs), a new type of circuit boards, that are three-dimensionally deformable, highly stretchable, durable and washable ideally for wearable electronic applications. Fabricated by using computerized knitting technologies at ambient dry conditions, the resultant knitted FCBs exhibit outstanding electrical stability with less than 1% relative resistance change up to 300% strain in unidirectional tensile test or 150% membrane strain in three-dimensional ball punch test, extraordinary fatigue life of more than 1 000 000 loading cycles at 20% maximum strain, and satisfactory washing capability up to 30 times. To the best of our knowledge, the performance of new FCBs has far exceeded those of previously reported metal-coated elastomeric films or other organic materials in terms of changes in electrical resistance, stretchability, fatigue life and washing capability as well as permeability. Theoretical analysis and numerical simulation illustrate that the structural conversion of knitted fabrics is attributed to the effective mitigation of strain in the conductive metal fibres, hence the outstanding mechanical and electrical properties. Those distinctive features make the FCBs particularly suitable for next-to-skin electronic devices. This paper has further demonstrated the application potential of the knitted FCBs in smart protective apparel for in situ measurement during ballistic impact. PMID:25383032

  19. Mineralogical analysis of dust collected from typical recycling line of waste printed circuit boards.

    PubMed

    Wang, Fangfang; Zhao, Yuemin; Zhang, Tao; Duan, Chenlong; Wang, Lizhang

    2015-09-01

    As dust is one of the byproducts originating in the mechanical recycling process of waste printed circuit boards such as crushing and separating, from the viewpoints of resource reuse and environmental protection, an effective recycling method to recover valuable materials from this kind of dust is in urgent need. In this paper, detailed mineralogical analysis on the dust collected from a typical recycling line of waste printed circuit boards is investigated by coupling several analytical techniques. The results demonstrate that there are 73.1wt.% organic matters, 4.65wt.% Al, 4.55wt.% Fe, 2.67wt.% Cu and 1.06wt.% Pb in the dust, which reveals the dust is worthy of reuse and harmful to environment. The concentration ratios of Fe, Mn and Zn can reach 12.35, 12.33 and 6.67 respectively by magnetic separation. The yield of dust in each size fraction is nonuniform, while the yield of -0.75mm size fraction is up to 51.15wt.%; as the particle size decreases, the content of liberated metals and magnetic materials increase, and metals are mainly in elemental forms. The F, Cl and Br elements combing to C in the dust would make thermal treatment dangerous to the environment. Based on these results, a flowsheet to recycle the dust is proposed.

  20. Selective recovery of palladium from waste printed circuit boards by a novel non-acid process.

    PubMed

    Zhang, Zhiyuan; Zhang, Fu-Shen

    2014-08-30

    An environmental benign, non-acid process was successfully developed for selective recovery of palladium from waste printed circuit boards (PCBs). In the process, palladium was firstly enriched during copper recovery procedure and dissolved in a special solution made of CuSO4 and NaCl. The dissolved palladium was then extracted by diisoamyl sulfide (S201). It was found that 99.4% of Pd(II) could be extracted from the solution under the optimum conditions (10% S201, A/O ratio 5 and 2min extraction). In the whole extraction process, the influence of base metals was negligible due to the relatively weak nucleophilic substitution of S201 with base metal irons and the strong steric hindrance of S201 molecular. Around 99.5% of the extracted Pd(II) could be stripped from S201/dodecane with 0.1mol/L NH3 after a two-stage stripping at A/O ratio of 1. The total recovery percentage of palladium was 96.9% during the dissolution-extraction-stripping process. Therefore, this study established a benign and effective process for selective recovery of palladium from waste printed circuit boards.

  1. Three-dimensionally deformable, highly stretchable, permeable, durable and washable fabric circuit boards.

    PubMed

    Li, Qiao; Tao, Xiao Ming

    2014-11-01

    This paper reports fabric circuit boards (FCBs), a new type of circuit boards, that are three-dimensionally deformable, highly stretchable, durable and washable ideally for wearable electronic applications. Fabricated by using computerized knitting technologies at ambient dry conditions, the resultant knitted FCBs exhibit outstanding electrical stability with less than 1% relative resistance change up to 300% strain in unidirectional tensile test or 150% membrane strain in three-dimensional ball punch test, extraordinary fatigue life of more than 1 000 000 loading cycles at 20% maximum strain, and satisfactory washing capability up to 30 times. To the best of our knowledge, the performance of new FCBs has far exceeded those of previously reported metal-coated elastomeric films or other organic materials in terms of changes in electrical resistance, stretchability, fatigue life and washing capability as well as permeability. Theoretical analysis and numerical simulation illustrate that the structural conversion of knitted fabrics is attributed to the effective mitigation of strain in the conductive metal fibres, hence the outstanding mechanical and electrical properties. Those distinctive features make the FCBs particularly suitable for next-to-skin electronic devices. This paper has further demonstrated the application potential of the knitted FCBs in smart protective apparel for in situ measurement during ballistic impact. PMID:25383032

  2. Bioleaching of metals from printed circuit boards supported with surfactant-producing bacteria.

    PubMed

    Karwowska, Ewa; Andrzejewska-Morzuch, Dorota; Łebkowska, Maria; Tabernacka, Agnieszka; Wojtkowska, Małgorzata; Telepko, Alicja; Konarzewska, Agnieszka

    2014-01-15

    This study has evaluated the possibility of bioleaching zinc, copper, lead, nickel, cadmium and chromium from printed circuit boards by applying a culture of sulphur-oxidising bacteria and a mixed culture of biosurfactant-producing bacteria and sulphur-oxidising bacteria. It was revealed that zinc was removed effectively both in a traditional solution acidified by a way of microbial oxidation of sulphur and when using a microbial culture containing sulphur-oxidising and biosurfactant-producing bacteria. The average process efficiency was 48% for Zn dissolution. Cadmium removal was similar in both media, with a highest metal release of 93%. For nickel and copper, a better effect was obtained in the acidic medium, with a process effectiveness of 48.5% and 53%, respectively. Chromium was the only metal that was removed more effectively in the bioleaching medium containing both sulphur-oxidising and biosurfactant-producing bacteria. Lead was removed from the printed circuit boards with very low effectiveness (below 0.5%). Aerating the culture medium with compressed air increased the release of all metals in the medium with sulphur and biosurfactant, and of Ni, Cu, Zn and Cr in the acidic medium. Increasing the temperature of the medium (to 37°C) had a more significant impact in the acidic environment than in the neutral environment. PMID:24295772

  3. Effect of embedded printed circuit board (PCB) sensors on the mechanical behavior of glass fiber-reinforced polymer (GFRP) structures

    NASA Astrophysics Data System (ADS)

    Javdanitehran, M.; Hoffmann, R.; Groh, J.; Vossiek, M.; Ziegmann, G.

    2016-06-01

    The embedding of dielectric chipless sensors for cure monitoring into fiber-reinforced thermosets allows for monitoring and controlling the curing process and consequently higher quality in production. The embedded sensors remain after the processing in the structure. This affects the integrity of the composite structure locally. In order to investigate these effects on the mechanical behavior of the glass fiber-reinforced polymer (GFRP), sensors made on special low loss substrates are integrated into laminates with different lay-ups and thicknesses using vacuum assisted resin transfer molding (VARTM) method. In a parametric study the size of the sensor is varied to observe its influence on the strength and the stiffness of the laminates according to its lay-up and thickness. The size and orientation of the resin rich areas near sensors as well as the distortion in load bearing area as the consequences of the introduction of the sensors are investigated in conjunction with the strength of the structure. An empirical model is proposed by the authors which involves the previously mentioned factors and is used as a rapid tool for the prediction of the changes in bending and tensile strength of simple structures with embedded sensors. The methodology for model’s calibration as well as the validation of the model against the experimental data of different laminates with distinct lay-ups and thicknesses are presented in this work. Mechanical tests under tensile and bending loading indicate that the reduction of the structure’s strength due to sensor integration can be attributed to the size and the orientation of rich resin zones and depends over and above on the size of distorted load bearing area. Depending on the sensor’s elastic modulus the stiffness of the structure may vary through the introduction of a sensor.

  4. The high speed low noise multi-data processing signal process circuit research of remote sensing

    NASA Astrophysics Data System (ADS)

    Su, Lei; Jiang, Haibin; Dong, Wang

    2013-08-01

    The high speed, low noise and integration characteristic are the main technology and the main development directions on the signal process circuit of the image sensor, especially in high resolution remote sensing. With these developments, the high noise limiting circuits, high speed data transfer system and the integrated design of the signal process circuit become more and more important. Therefore the requirement of the circuit system simulation is more and more important during the system design and PCB board design process. A CCD signal process circuit system which has the high speed, low noise and several selectable operate modes function was designed and certificated in this paper, during the CCD signal process circuit system design, simulation was made which include the signal integrity and the power integrity. The important devices such as FPGA and the DDR2 device were simulated, using the power integrity simulation the sensitive power planes of the FPGA on the PCB was modified to make the circuit operate more stabilize on a higher frequency. The main clock path and the high speed data path of the PCB board were simulated with the signal integrity. All the simulation works make the signal process circuit system's image's SNR value get higher and make the circuit system could operate well on higher frequency. In the board testing process, the PCB time diagrams were listed on the testing chapter and the wave's parameter meets the request. The real time diagram and the simulated result of the PCB board was listed respectively. The CCD signal process circuit system's images' SNR (Signal Noise Ratio) value, the 14bit AFE slew rate and the data transfer frequency is listed in the paper respective.

  5. Optimizing the operating parameters of corona electrostatic separation for recycling waste scraped printed circuit boards by computer simulation of electric field.

    PubMed

    Li, Jia; Lu, Hongzhou; Liu, Shushu; Xu, Zhenming

    2008-05-01

    The printed circuit board (PCB) has a metal content of nearly 28% metal, including an abundance of nonferrous metals such as copper, lead, and tin. The purity of precious metals in PCBs is more than 10 times that of rich-content minerals. Therefore, the recycling of PCBs is an important subject, not only from the viewpoint of waste treatment, but also with respect to the recovery of valuable materials. Compared with traditional process the corona electrostatic separation (CES) had no waste water or gas during the process and it had high productivity with a low-energy cost. In this paper, the roll-type corona electrostatic separator was used to separate metals and nonmetals from scraped waste PCBs. The software MATLAB was used to simulate the distribution of electric field in separating space. It was found that, the variations of parameters of electrodes and applied voltages directly influenced the distribution of electric field. Through the correlation of simulated and experimental results, the good separation results were got under the optimized operating parameter: U=20-30 kV, L=L(1)=L(2)=0.21 m, R(1)=0.114, R(2)=0.019 m, theta(1)=20 degrees and theta(2)=60 degrees .

  6. Toward environmentally-benign utilization of nonmetallic fraction of waste printed circuit boards as modifier and precursor

    SciTech Connect

    Hadi, Pejman; Ning, Chao; Ouyang, Weiyi; Xu, Meng; Lin, Carol S.K.; McKay, Gordon

    2015-01-15

    Highlights: • Environmental impacts of electronic waste and specifically waste printed circuit boards. • Review of the recycling techniques of waste printed circuit boards. • Advantages of physico-mechanical recycling techniques over chemical methods. • Utilization of nonmetallic fraction of waste printed circuit boards as modifier/filler. • Recent advances in the use of nonmetallic fraction of waste printed circuit boards as precursor. - Abstract: Electronic waste, including printed circuit boards, is growing at an alarming rate due to the accelerated technological progress and the shorter lifespan of the electronic equipment. In the past decades, due to the lack of proper economic and environmentally-benign recycling technologies, a major fraction of e-waste generated was either destined to landfills or incinerated with the sole intention of its disposal disregarding the toxic nature of this waste. Recently, with the increasing public awareness over their environment and health issues and with the enaction of more stringent regulations, environmentally-benign recycling has been driven to be an alternative option partially replacing the traditional eco-unfriendly disposal methods. One of the most favorable green technologies has been the mechanical separation of the metallic and nonmetallic fraction of the waste printed circuit boards. Although metallic fraction, as the most profitable component, is used to generate the revenue of the separation process, the nonmetallic fraction (NMF) has been left isolated. Herein, the recent developments in the application of NMF have been comprehensively reviewed and an eco-friendly emerging usage of NMF as a value-added material for sustainable remediation has been introduced.

  7. Infrared Thermography as Applied to Thermal Testing of Power Systems Circuit Boards.

    NASA Astrophysics Data System (ADS)

    Miles, Jonathan James

    All operational electronic equipment dissipates some amount of energy in the form of infrared radiation. Faulty electronic components on a printed circuit board can be categorized as hard (functional) or soft (latent functional). Hard faults are those which are detected during a conventional manufacturing electronic test process. Soft failures, in contrast, are those which are undetectable through conventional testing, but which manifest themselves after a product has been placed into service. Such field defective modules ultimately result in operational failure and subsequently enter a manufacturer's costly repair process. While thermal imaging systems are being used increasingly in the electronic equipment industry as a product-testing tool, applications have primarily been limited to product design or repair processes, with minimal use in a volume manufacturing environment. Use of thermal imaging systems in such an environment has mostly been limited to low-volume products or random screening of high-volume products. Thermal measurements taken in a manufacturing environment are often taken manually, thus defeating their capability of rapid data acquisition and constraining their full potential in a high-volume manufacturing process. Integration of a thermal measurement system with automated testing equipment is essential for optimal use of expensive infrared measurement tools in a high-volume manufacturing environment. However, such a marriage presents problems with respect to both existing manufacturing test processes and infrared measurement techniques. Methods are presented in this dissertation to test automatically for latent faults, those which elude detection during conventional electronic testing, on printed circuit boards. These methods are intended for implementation in a volume manufacturing environment and involve the application of infrared imaging tools. Successful incorporation of infrared testing into existing test processes requires that: PASS

  8. Optical waveguides and structures for short haul optical communication channels within printed circuit boards

    NASA Astrophysics Data System (ADS)

    Riegel, Nicholas J.

    Optical waveguides have shown promising results for use within printed circuit boards. These optical waveguides have higher bandwidth than traditional copper transmission systems and are immune to electromagnetic interference. Design parameters for these optical waveguides are needed to ensure an optimal link budget. Modeling and simulation methods are used to determine the optimal design parameters needed in designing the waveguides. As a result, optical structures necessary for incorporating optical waveguides into printed circuit boards are designed and optimized. Embedded siloxane polymer waveguides are investigated for their use in optical printed circuit boards. This material was chosen because it has low absorption, high temperature stability, and can be deposited using common processing techniques. Two sizes of waveguides are investigated, 50 mum multimode and 4 - 9 mum single mode waveguides. A beam propagation method is developed for simulating the multimode and single mode waveguide parameters. The attenuation of simulated multimode waveguides are able to match the attenuation of fabricated waveguides with a root mean square error of 0.192 dB. Using the same process as the multimode waveguides, parameters needed to ensure a low link loss are found for single mode waveguides including maximum size, minimum cladding thickness, minimum waveguide separation, and minimum bend radius. To couple light out-of-plane to a transmitter or receiver, a structure such as a vertical interconnect assembly (VIA) is required. For multimode waveguides the optimal placement of a total internal reflection mirror can be found without prior knowledge of the waveguide length. The optimal placement is found to be either 60 microm or 150 microm away from the end of the waveguide depending on which metric a designer wants to optimize the average output power, the output power variance, or the maximum possible power loss. For single mode waveguides a volume grating coupler is

  9. Four-Channel PC/104 MIL-STD-1553 Circuit Board

    NASA Technical Reports Server (NTRS)

    Cox, Gary L.

    2004-01-01

    The mini bus interface card (miniBIC) is the first four-channel electronic circuit board that conforms to MIL-STD-1553 and to the electrical-footprint portion of PC/104. [MIL-STD-1553 is a military standard that encompasses a method of communication and electrical- interface requirements for digital electronic subsystems connected to a data bus. PC/104 is an industry standard for compact, stackable modules that are fully compatible (in architecture, hardware, and software) with personal-computer data- and power-bus circuitry.] Prior to the development of the miniBIC, only one- and two-channel PC/104 MIL-STD-1553 boards were available. To obtain four channels, it was necessary to include at least two boards in a PC/104 stack. In comparison with such a two-board stack, the miniBIC takes up less space, consumes less power, and is more reliable. In addition, the miniBIC includes 32 digital input/output channels. The miniBIC (see figure) contains four MIL-STD-1553B hybrid integrated circuits (ICs), four transformers, a field-programmable gate array (FPGA), and an Industry Standard Architecture (ISA) interface. Each hybrid IC includes a MILSTD-1553 dual transceiver, memory-management circuitry, processor interface logic circuitry, and 64Kx16 bits of shared static random access memory. The memory is used to configure message and data blocks. In addition, 23 16-bit registers are available for (1) configuring the hybrid IC for, and starting it in, various modes of operation; (2) reading the status of the functionality of the hybrid IC; and (3) resetting the hybrid IC to a known state. The miniBIC can operate as a remote terminal, bus controller, or bus monitor. The FPGA provides the chip-select and data-strobe signals needed for operation of the hybrid ICs. The FPGA also receives interruption signals and forwards them to the ISA bus. The ISA interface connects the address, data, and control interfaces of the hybrid ICs to the ISA backplane. Each channel is, in effect, a MIL

  10. A Novel Transient Fault Current Sensor Based on the PCB Rogowski Coil for Overhead Transmission Lines

    PubMed Central

    Liu, Yadong; Xie, Xiaolei; Hu, Yue; Qian, Yong; Sheng, Gehao; Jiang, Xiuchen

    2016-01-01

    The accurate detection of high-frequency transient fault currents in overhead transmission lines is the basis of malfunction detection and diagnosis. This paper proposes a novel differential winding printed circuit board (PCB) Rogowski coil for the detection of transient fault currents in overhead transmission lines. The interference mechanism of the sensor surrounding the overhead transmission line is analyzed and the guideline for the interference elimination is obtained, and then a differential winding printed circuit board (PCB) Rogowski coil is proposed, where the branch and return line of the PCB coil were designed to be strictly symmetrical by using a joining structure of two semi-rings and collinear twisted pair differential windings in each semi-ring. A serial test is conducted, including the frequency response, linearity, and anti-interference performance as well as a comparison with commercial sensors. Results show that a PCB Rogowski coil has good linearity and resistance to various external magnetic field interferences, thus enabling it to be widely applied in fault-current-collecting devices. PMID:27213402

  11. A Novel Transient Fault Current Sensor Based on the PCB Rogowski Coil for Overhead Transmission Lines.

    PubMed

    Liu, Yadong; Xie, Xiaolei; Hu, Yue; Qian, Yong; Sheng, Gehao; Jiang, Xiuchen

    2016-05-21

    The accurate detection of high-frequency transient fault currents in overhead transmission lines is the basis of malfunction detection and diagnosis. This paper proposes a novel differential winding printed circuit board (PCB) Rogowski coil for the detection of transient fault currents in overhead transmission lines. The interference mechanism of the sensor surrounding the overhead transmission line is analyzed and the guideline for the interference elimination is obtained, and then a differential winding printed circuit board (PCB) Rogowski coil is proposed, where the branch and return line of the PCB coil were designed to be strictly symmetrical by using a joining structure of two semi-rings and collinear twisted pair differential windings in each semi-ring. A serial test is conducted, including the frequency response, linearity, and anti-interference performance as well as a comparison with commercial sensors. Results show that a PCB Rogowski coil has good linearity and resistance to various external magnetic field interferences, thus enabling it to be widely applied in fault-current-collecting devices.

  12. Application of printed circuit board technology to FT-ICR MS analyzer cell construction and prototyping.

    PubMed

    Leach, Franklin E; Norheim, Randolph; Anderson, Gordon; Pasa-Tolic, Ljiljana

    2014-12-01

    Although Fourier transform ion cyclotron resonance mass spectrometry (FT-ICR MS) remains the mass spectrometry platform that provides the highest levels of performance for mass accuracy and resolving power, there is room for improvement in analyzer cell design as the ideal quadrupolar trapping potential has yet to be generated for a broadband MS experiment. To this end, analyzer cell designs have improved since the field's inception, yet few research groups participate in this area because of the high cost of instrumentation efforts. As a step towards reducing this barrier to participation and allowing for more designs to be physically tested, we introduce a method of FT-ICR analyzer cell prototyping utilizing printed circuit boards at modest vacuum conditions. This method allows for inexpensive devices to be readily fabricated and tested over short intervals and should open the field to laboratories lacking or unable to access high performance machine shop facilities because of the required financial investment.

  13. NOTE: Plated through-hole vias in a porous polyimide foil for flexible printed circuit boards

    NASA Astrophysics Data System (ADS)

    Yousef, Hanna; Hjort, Klas; Lindeberg, Mikael

    2008-01-01

    A fabrication process for high aspect ratio plated through-hole vias is presented for flexible printed circuit boards. A 75 µm thick porous Kapton foil that allows direct definition of high aspect ratio through-hole vias by dry photoresist film lithography and electrodeposition is presented. Pretreatment with swift heavy ion irradiation and wet etching define the pore density and porosity of the foil, similar to ion-track-etched filter membranes. Thin film metallization of a seed layer and lithography of a laminated dry photoresist film define the via sizes and positions. Subsequent through-hole electrodeposition produces vias consisting of multiple wires, where each open pore defines one wire. The via geometries are characterized by scanning electron microscopy. The electrical properties of the vias are characterized by resistance measurements. Vias with an aspect ratio over 2 and a side length of 33 µm show high yield with low resistance and low variation in resistance.

  14. Waste minimization study for a printed circuit board manufacturing facility in Taiwan

    SciTech Connect

    Chiu, Shen-yann; Huang, Hann S.; Peters, R.W.; Tsai, S.Y. ); Tsai, Wen-Tien; Shieh, Shih-Shien; Hsieh, Te-Yuan; Hwang, Li-Shyong ); Liu, Solo; Peng, Chien-Tang ); Wu, Min H. )

    1990-01-01

    This paper presents a demonstration of industrial waste minimization sponsored by the Environmental Protection Administration, Taiwan, Republic of China. Waste reduction opportunities are identified and evaluated for a printed circuit board manufacturing facility in Taiwan. Plant audits were conducted on various processes, such as deburring, alkaline etching, black oxidation, desmearing, electroless copper, and copper and tin/lead plating. Specific areas in which the wastes could be minimized, such as reducing the amount of dragout and rinse water requirements in the plating and etchant lines, and on-site treatment and reuse of spent bath solutions were identified, assessed, and implemented. Jar tests on the wastewater were performed, and the results were used to improve the efficiency of the wastewater treatment plant for removal of heavy metals and reduction of sludge generation. In addition, administrative controls of hazardous wastes designed to reduce associated health and environmental hazards were recommended. 4 figs., 9 tabs.

  15. Layer modeling of zinc removal from metallic mixture of waste printed circuit boards by vacuum distillation.

    PubMed

    Gao, Yujie; Li, Xingang; Ding, Hui

    2015-08-01

    A layer model was established to elucidate the mechanism of zinc removal from the metallic mixture of waste printed circuit boards by vacuum distillation. The removal process was optimized by response surface methodology, and the optimum operating conditions were the chamber pressure of 0.1Pa, heating temperature of 923K, heating time of 60.0min, particle size of 70 mesh (0.212mm) and initial mass of 5.25g. Evaporation efficiency of zinc, the response variable, was 99.79%, which indicates that the zinc can be efficiently removed. Based on the experimental results, a mathematical model, which bears on layer structure, evaporation, mass transfer and condensation, interprets the mechanism of the variable effects. Especially, in order to reveal blocking effect on the zinc removal, the Blake-Kozeny-Burke-Plummer equation was introduced into the mass transfer process. The layer model can be applied to a wider range of metal removal by vacuum distillation.

  16. Ductile electroless Ni-P coating onto flexible printed circuit board

    NASA Astrophysics Data System (ADS)

    Wang, Wenchang; Zhang, Weiwei; Wang, Yurong; Mitsuzak, Naotoshi; Chen, Zhidong

    2016-03-01

    In this study, a ductile electroless Ni-P coating on the flexible printed circuit board (FPCB) was prepared in an acidic nickel plating bath. The addition of dipropylamine (DPA) in electroless plating not only improves the ductility of the Ni-P coating, but also enhances the corrosion resistance. The further analysis reveals that the ductility improvement and enhancement of corrosion resistance for the Ni-P coating may be due to the fact that the addition of DPA significantly refines the volume of columnar nodule and reduce the porosity, thus leading to the released internal stress. In addition, it was found that the nodule within the Ni-P coating grew into a columnar structure, which may be also contribute to the improvement of ductility.

  17. Application of Printed Circuit Board Technology to FT-ICR MS Analyzer Cell Construction and Prototyping

    SciTech Connect

    Leach, Franklin E.; Norheim, Randolph V.; Anderson, Gordon A.; Pasa-Tolic, Ljiljana

    2014-12-01

    Although Fourier transform ion cyclotron resonance mass spectrometry (FT-ICRMS) remains themass spectrometry platform that provides the highest levels of performance for mass accuracy and resolving power, there is room for improvement in analyzer cell design as the ideal quadrupolar trapping potential has yet to be generated for a broadband MS experiment. To this end, analyzer cell designs have improved since the field’s inception, yet few research groups participate in this area because of the high cost of instrumentation efforts. As a step towards reducing this barrier to participation and allowing for more designs to be physically tested, we introduce a method of FT-ICR analyzer cell prototyping utilizing printed circuit boards at modest vacuum conditions. This method allows for inexpensive devices to be readily fabricated and tested over short intervals and should open the field to laboratories lacking or unable to access high performance machine shop facilities because of the required financial investment.

  18. Manufacturing process of reproduction plate by nonmetallic materials reclaimed from pulverized printed circuit boards.

    PubMed

    Guo, Jie; Guo, Jiuyong; Cao, Bin; Tang, Yinen; Xu, Zhenming

    2009-04-30

    The aim of this study was to present a new method for resource utilization of nonmetallic materials reclaimed from pulverized waste printed circuit boards. A reproduction nonmetallic plate (RNMP) was prepared by adding resin paste, glass fiber and additives into nonmetallic materials using self-made hot-press former. Principle of manufacturing process and effects of mould temperature and moulding time on the mechanical properties of RNMP were studied. The results showed that when moulding pressure was fixed at 6 MPa, the optimum conditions for the RNMP were as follows: 140/135 degrees C for top/bottom mould temperature, 5 min for moulding time. The maximum content of nonmetallic materials in RNMP was up to 40 wt%. When nonmetallic material content was 20 wt%, the RNMP moulded at optimum conditions had excellent mechanical properties, with impact strength of 5.8 kJ/m(2) and flexural strength of 65.1 MPa.

  19. Long-lasting FR-4 surface hydrophilisation towards commercial PCB passive microfluidics

    NASA Astrophysics Data System (ADS)

    Vasilakis, Nikolaos; Moschou, Despina; Carta, Daniela; Morgan, Hywel; Prodromakis, Themistoklis

    2016-04-01

    Printed circuit boards (PCB) technologies are an attractive system for simple sensing and microfluidic systems. Controlling the surface properties of PCB material is an important part of this technology and to date there has been no study on long-term hydrophilisation stability of these materials. In this work, the effect of different oxygen plasma input power and treatment duration times on the wetting properties of FR-4 surfaces was investigated by sessile droplet contact angle measurements. Super and weakly hydrophilic behaviour was achieved and the retention time of these properties was studied, with the hydrophilic nature being retained for at least 26 days. To demonstrate the applicability of this treatment method, a commercially manufactured microfluidic structure made from a multilayer PCB (3-layer FR-4 stack) was exposed to oxygen plasma at the optimum conditions. The structures could be filled with deionised (DI) water under capillary flow unlike the virgin devices.

  20. Metal-slotted hybrid optical waveguides for PCB-compatible optical interconnection.

    PubMed

    Kim, Jin Tae; Ju, Jung Jin; Park, Suntak

    2012-04-23

    For development of electro-optical printed circuit board (PCB) systems, PCB-compatible metal-slotted hybrid optical waveguide was proposed and its optical characteristics are investigated at a wavelength of 1.31 μm. To confine light in a metallic multilayered structure, a metal film with a wide trench is inserted at the center of a dielectric medium that is sandwiched between metal films of infinite width. A circularly symmetric spot of the guided mode was measured at the center of the metal-slotted optical waveguide, which is a good agreement with the theoretical prediction by using the finite-element method. The measured propagation loss is about 1.5 dB/cm. Successful transmission of 2.5 Gbps optical signal without any distortion of the eye diagram confirms that the proposed hybrid optical waveguide holds a potential transmission line for the PCB-compatible optical interconnection.

  1. Prototyping lead-free solders on hand-soldered, through-hole circuit boards

    SciTech Connect

    Vianco, P.T.; Mizik, P.M.

    1993-12-31

    The lead-free solders 96.5Sn-3.5Ag (wt %), 95.5Sn-4.0Cu-0.5Ag, 91. 84Sn-3.33Ag-4.83Bi were used in the assembly of a through-hole circuit board to determine the feasibility of their suitability in hand soldering processes. Prototypes assembled with 63Sn-37Pb solder were manufactured to serve as control units. Implementation of the lead-free alloys were performed with a rosin-based, mildly activated (RMA) flux and a 700{degree}F soldering tip. A procedure was developed to remove the tin-lead finish from the leaded components and replace it with a 100Sn hot dipped coating. Assembly feasibility was demonstrated for all three lead-free solders. Defect counts were greater than observed with the tin-lead control alloy; however, the number of defects diminished with experience gained by the operator. Visual examination of the solder joints indicated satisfactory wetting of both the device leads and circuit board land with no apparent damage to the underlying laminate nor to the device packages. Cross sections of the lead-free solder joints showed that the were more susceptible to void formation within the holes than was the case with the tin-lead solder. Some cracking was observed at the interface between the Sn-Ag-Bi solder and the copper lands; the relatively high strength of this solder and fast cooling rate of the hand assembly process was believed responsible for this defect.

  2. CO2 laser micromachining of optical waveguides for interconnection on circuit boards

    NASA Astrophysics Data System (ADS)

    Zakariyah, Shefiu S.; Conway, Paul P.; Hutt, David A.; Wang, Kai; Selviah, David R.

    2012-12-01

    The introduction of microvia and surface mount technologies into the manufacturing process for printed circuit boards (PCBs) has significantly improved the interconnection density. However, as the speed of signals for data communication on the board approaches and begins to exceed 10 Gb/s, the loss and crosstalk of copper interconnections increase. To resolve these problems, optical interconnections (OI) have been suggested as a viable solution. Literature reports have proved the photochemical nature of excimer laser ablation with its minimal thermal effect, and other ultra-violet lasers are also being investigated for the fabrication of polymer waveguides by laser ablation. In this paper, the authors demonstrate the fabrication of multimode optical polymer waveguides by using infra-red 10.6 μm CO2 laser micromachining to etch acrylate-based photopolymer (Truemode™). CO2 lasers offer a low cost and high speed fabrication route as CO2 lasers can be used to cut through various engineering materials including polymers and metals. The paper characterises the relationship between the laser ablation power, the fabrication speed and the resulting effect on the waveguide optical insertion loss for the first time.

  3. AC properties of low-pass RC filters embedded in printed circuit boards

    NASA Astrophysics Data System (ADS)

    Winiarski, Paweł; Kłossowicz, Adam; Steplewski, Wojciech; Borecki, Janusz; Nitsch, Karol; Dziedzic, Andrzej

    2013-07-01

    Impedance Spectroscopy (IS) is a widely used measurement technique for determining the characteristics of a variety of materials and systems. Analysis of object's AC-response can allow determine of different electrical properties due to its structure. IS can also be used to study electronic components such as gas and humidity sensors, thermistors, varistors, capacitors or resistors. The resulting impedance spectrum can be approximated by electrical equivalent circuit. However, It is difficult to find papers dedicated to the electronic systems investigated by IS method. For this reason authors analyzed properties of RC low-pass filters embedded in printed circuit boards using IS technique. These four-contact structures were made of special Ohmega/FaradFlex® composite material. It consists of a resistive/capacitive core containing OhmegaPly RCM layer (resistive NiP alloy) laminated to FaradFlex dielectric of Oak-Mitsui company. Analysis of the measurements results using impedance spectroscopy allowed a more precise determination of the filter parameters than an analysis using standard method based on ideal components. Additionally selected filters were subjected to one of the aging process (thermal aging or thermal-humidity exposure), and found that this results in a frequency shift of the filter.

  4. A 5 Giga Samples Per Second 8-Bit Analog to Digital Printed Circuit Board for Radio Astronomy

    NASA Astrophysics Data System (ADS)

    Jiang, Homin; Liu, Howard; Guzzino, Kim; Kubo, Derek; Li, Chao-Te; Chang, Ray; Chen, Ming-Tang

    2014-08-01

    We have designed, manufactured, and characterized an 8-bit 5 Giga samples per second (Gsps) ADC printed circuit board assembly (PCBA). An e2v EV8AQ160 ADC chip was used in the design and the board is plug compatible with the field programmable gate array (FPGA) board developed by the Collaboration for Astronomy Signal Processing and Electronics Research (CASPER) community. Astronomical interference fringes were demonstrated across a single baseline pair of antennas using two ADC boards on the Yuan Tseh Lee Array for Microwave Background Anisotropy (AMiBA) telescope. Several radio interferometers are using this board for bandwidth expansion, such as Submillimeter Array; also, several experimental telescopes are building new spectrometers using the same board. The ADC boards were attached directly to the Reconfigurable Open Architecture Computing Hardware (ROACH-2) FPGA board for processing of the digital output signals. This ADC board provides the capability of digitizing radio frequency signals from DC to 2 GHz (3 dB bandwidth), and to an extended bandwidth of 2.5 GHz (5 dB) with derated performance. The following worst-case performance parameters were obtained over 2 GHz: spur free dynamic range (SFDR) of 44 dB, signal-to-noise and distortion (SINAD) of 35 dB, and effective number of bits (ENOB) of 5.5.

  5. Separation and Recovery of Fine Particles from Waste Circuit Boards Using an Inflatable Tapered Diameter Separation Bed

    PubMed Central

    Sheng, Cheng; Wu, Lingling; Zhao, Yuemin; He, Jinfeng; Zhou, Enhui

    2014-01-01

    Recovering particle materials from discarded printed circuit boards can enhance resource recycling and reduce environmental pollution. Efficiently physically separating and recovering fine metal particles (−0.5 mm) from the circuit boards are a key recycling challenge. To do this, a new type of separator, an inflatable tapered diameter separation bed, was developed to study particle motion and separation mechanisms in the bed's fluid flow field. For 0.5–0.25 mm circuit board particles, metal recovery rates ranged from 87.56 to 94.17%, and separation efficiencies ranged from 87.71 to 94.20%. For 0.25–0.125 mm particles, metal recovery rates ranged from 84.76 to 91.97%, and separation efficiencies ranged from 84.74 to 91.86%. For superfine products (−0.125 mm), metal recovery rates ranged from 73.11 to 83.04%, and separation efficiencies ranged from 73.00 to 83.14%. This research showed that the inflatable tapered diameter separation bed achieved efficient particle separation and can be used to recover fine particles under a wide range of operational conditions. The bed offers a new mechanical technology to recycle valuable materials from discarded printed circuit boards, reducing environmental pollution. PMID:25379546

  6. Treatment of Wastewater from Electroplating, Metal Finishing and Printed Circuit Board Manufacturing. Operation of Wastewater Treatment Plants Volume 4.

    ERIC Educational Resources Information Center

    California State Univ., Sacramento. Dept. of Civil Engineering.

    One of four manuals dealing with the operation of wastewater plants, this document was designed to address the treatment of wastewater from electroplating, metal finishing, and printed circuit board manufacturing. It emphasizes how to operate and maintain facilities which neutralize acidic and basic waters; treat waters containing metals; destroy…

  7. Maze solving automatons for self-healing of open interconnects: Modular add-on for circuit boards

    NASA Astrophysics Data System (ADS)

    Nair, Aswathi; Raghunandan, Karthik; Yaswant, Vaddi; Pillai, Sreelal S.; Sambandan, Sanjiv

    2015-03-01

    We present the circuit board integration of a self-healing mechanism to repair open faults. The electric field driven mechanism physically restores fractured interconnects in electronic circuits and has the ability to solve mazes. The repair is performed by conductive particles dispersed in an insulating fluid. We demonstrate the integration of the healing module onto printed circuit boards and the ability of maze solving. We model and perform experiments on the influence of the geometry of conductive particles as well as the terminal impedances of the route on the healing efficiency. The typical heal rate is 10 μm/s with healed route having mean resistance of 8 kΩ across a 200 micron gap and depending on the materials and concentrations used.

  8. Maze solving automatons for self-healing of open interconnects: Modular add-on for circuit boards

    SciTech Connect

    Nair, Aswathi; Raghunandan, Karthik; Yaswant, Vaddi; Sambandan, Sanjiv E-mail: ssanjiv@isu.iisc.ernet.in; Pillai, Sreelal S.

    2015-03-23

    We present the circuit board integration of a self-healing mechanism to repair open faults. The electric field driven mechanism physically restores fractured interconnects in electronic circuits and has the ability to solve mazes. The repair is performed by conductive particles dispersed in an insulating fluid. We demonstrate the integration of the healing module onto printed circuit boards and the ability of maze solving. We model and perform experiments on the influence of the geometry of conductive particles as well as the terminal impedances of the route on the healing efficiency. The typical heal rate is 10 μm/s with healed route having mean resistance of 8 kΩ across a 200 micron gap and depending on the materials and concentrations used.

  9. Generation of copper rich metallic phases from waste printed circuit boards

    SciTech Connect

    Cayumil, R.; Khanna, R.; Ikram-Ul-Haq, M.; Rajarao, R.; Hill, A.; Sahajwalla, V.

    2014-10-15

    Highlights: • Recycling and material recovery from waste printed circuit boards is very complex. • Thermoset polymers, ceramics and metals are present simultaneously in waste PCBs. • Heat treatment of PCBs was carried out at 1150 °C under inert conditions. • Various metallic phases could be segregated out as copper based metallic droplets. • Carbon and ceramics residues can be further recycled in a range of applications. - Abstract: The rapid consumption and obsolescence of electronics have resulted in e-waste being one of the fastest growing waste streams worldwide. Printed circuit boards (PCBs) are among the most complex e-waste, containing significant quantities of hazardous and toxic materials leading to high levels of pollution if landfilled or processed inappropriately. However, PCBs are also an important resource of metals including copper, tin, lead and precious metals; their recycling is appealing especially as the concentration of these metals in PCBs is considerably higher than in their ores. This article is focused on a novel approach to recover copper rich phases from waste PCBs. Crushed PCBs were heat treated at 1150 °C under argon gas flowing at 1 L/min into a horizontal tube furnace. Samples were placed into an alumina crucible and positioned in the cold zone of the furnace for 5 min to avoid thermal shock, and then pushed into the hot zone, with specimens exposed to high temperatures for 10 and 20 min. After treatment, residues were pulled back to the cold zone and kept there for 5 min to avoid thermal cracking and re-oxidation. This process resulted in the generation of a metallic phase in the form of droplets and a carbonaceous residue. The metallic phase was formed of copper-rich red droplets and tin-rich white droplets along with the presence of several precious metals. The carbonaceous residue was found to consist of slag and ∼30% carbon. The process conditions led to the segregation of hazardous lead and tin clusters in the

  10. Copper recovery and gold enrichment from waste printed circuit boards by mediated electrochemical oxidation.

    PubMed

    Fogarasi, Szabolcs; Imre-Lucaci, Florica; Imre-Lucaci, Arpád; Ilea, Petru

    2014-05-30

    The present study aims to develop an eco-friendly chemical-electrochemical process for the simultaneous recovery of copper and separation of a gold rich residue from waste printed circuit boards (WPCBs). The process was carried out by employing two different types of reactors coupled in series: a leaching reactor with a perforated rotating drum, for the dissolution of base metals and a divided electrochemical reactor for the regeneration of the leaching solution with the parallel electrowinning of copper. The process performances were evaluated on the basis of the dissolution efficiency, current efficiency and specific energy consumptions. Finally a process scale up was realized taking into consideration the optimal values of the operating parameters. The laboratory scale leaching plant allowed the recovery of a high purity copper deposit (99.04wt.%) at a current efficiency of 63.84% and specific energy consumption of 1.75kWh/kg cooper. The gold concentration in the remained solid residue was 25 times higher than the gold concentration in the initial WPCB samples. PMID:24747374

  11. Thermal analysis of a part of circuit board card by the photothermal deflection technique

    NASA Astrophysics Data System (ADS)

    Dhouib, A.; Yacoubi, N.

    2014-09-01

    Photothermal deflection which is a non-destructive technique is widely used to study defects in materials. However, high spatial resolution and high sensitivity are required to detect them. To validate the theoretical model that we developed in the case, the sample is immersed in a paraffin oil-filled cell and heated with a laser beam of a diameter less than the dimensions of defects and of power 2 mW instead of several 100 mW power frequently used. Our model was tested on a part of a circuit board card having copper strips spaced periodically and embedded in the resin. The experimental curves of amplitude and phase variations according to displacement of the sample are in good agreement with the corresponding theoretical ones; and their coincidence permit us to deduce several parameters such as the width of the copper and resin strips, their thicknesses and their thermal properties. These comparisons allowed also to detect some anomalies in the structure such as inhomogeneity in the width, the shape and the thicknesses of copper and resins strips.

  12. A Novel Designed Bioreactor for Recovering Precious Metals from Waste Printed Circuit Boards.

    PubMed

    Jujun, Ruan; Jie, Zheng; Jian, Hu; Zhang, Jianwen

    2015-01-01

    For recovering precious metals from waste printed circuit boards (PCBs), a novel hybrid technology including physical and biological methods was developed. It consisted of crushing, corona-electrostatic separation, and bioleaching. Bioleaching process is the focus of this paper. A novel bioreactor for bioleaching was designed. Bioleaching was carried out using Pseudomonas chlororaphis. Bioleaching experiments using mixed particles of Au and Cu were performed and leachate contained 0.006 mg/L, 2823 mg/L Au(+) and Cu(2+) respectively. It showed when Cu existed, the concentrations of Au were extremely small. This provided the feasibility to separate Cu from Au. The method of orthogonal experimental design was employed in the simulation bioleaching experiments. Experimental results showed the optimized parameters for separating Cu from Au particles were pH 7.0, temperature 22.5 °C, and rotation speed 80 r/min. Based on the optimized parameters obtained, the bioreactor was operated for recovering mixed Au and Cu particles. 88.1 wt.% of Cu and 76.6 wt.% of Au were recovered. The paper contributed important information to recover precious metals from waste PCBs.

  13. Recycling of waste printed circuit boards: a review of current technologies and treatment status in China.

    PubMed

    Huang, Kui; Guo, Jie; Xu, Zhenming

    2009-05-30

    From the use of renewable resources and environmental protection viewpoints, recycling of waste printed circuit boards (PCBs) receives wide concerns as the amounts of scrap PCBs increases dramatically. However, treatment for waste PCBs is a challenge due to the fact that PCBs are diverse and complex in terms of materials and components makeup as well as the original equipment's manufacturing processes. Recycle technology for waste PCBs in China is still immature. Previous studies focused on metals recovery, but resource utilization for nonmetals and further separation of the mixed metals are relatively fewer. Therefore, it is urgent to develop a proper recycle technology for waste PCBs. In this paper, current status of waste PCBs treatment in China was introduced, and several recycle technologies were analyzed. Some advices against the existing problems during recycling process were presented. Based on circular economy concept in China and complete recycling and resource utilization for all materials, a new environmental-friendly integrated recycling process with no pollution and high efficiency for waste PCBs was provided and discussed in detail.

  14. Copper recovery and gold enrichment from waste printed circuit boards by mediated electrochemical oxidation.

    PubMed

    Fogarasi, Szabolcs; Imre-Lucaci, Florica; Imre-Lucaci, Arpád; Ilea, Petru

    2014-05-30

    The present study aims to develop an eco-friendly chemical-electrochemical process for the simultaneous recovery of copper and separation of a gold rich residue from waste printed circuit boards (WPCBs). The process was carried out by employing two different types of reactors coupled in series: a leaching reactor with a perforated rotating drum, for the dissolution of base metals and a divided electrochemical reactor for the regeneration of the leaching solution with the parallel electrowinning of copper. The process performances were evaluated on the basis of the dissolution efficiency, current efficiency and specific energy consumptions. Finally a process scale up was realized taking into consideration the optimal values of the operating parameters. The laboratory scale leaching plant allowed the recovery of a high purity copper deposit (99.04wt.%) at a current efficiency of 63.84% and specific energy consumption of 1.75kWh/kg cooper. The gold concentration in the remained solid residue was 25 times higher than the gold concentration in the initial WPCB samples.

  15. Wood plastic composite produced by nonmetals from pulverized waste printed circuit boards.

    PubMed

    Guo, Jie; Tang, Yinen; Xu, Zhenming

    2010-01-01

    Nonmetals reclaimed from waste printed circuit boards (PCBs) are used to replace wood flour in the production of wood plastic composite (WPC). To evaluate property durability against weather exposure, the effects of accelerated aging process on the properties of WPC are investigated. The results show that filling of nonmetals in WPC improves the flexural strength and tensile strength, and reduces screw withdrawal strength. Before hollow WPC with 15% nonmetals (H-15-WPC) underwent aging process, H-15-WPC had a flexural strength of 25.8 MPa, a tensile strength of 9.8 MPa, a charpy impact strength of 3.4 kJ/m(2), and face/edge screw withdrawal strength of 121/115 N/mm. It is found that flexural strength of H-15-WPC decreases linearly with the increase of accelerated aging cycles, and the effects of aging test on tensile and impact strength of H-15-WPC are minor. For solid WPC, the accelerated aging test decreases screw withdrawal strength slightly. All the results indicate that nonmetals of waste PCBs can be reused as an alternative for wood flour in WPC products rather than resorting to their landfill or combustion. PMID:20000352

  16. Metals recovering from waste printed circuit boards (WPCBs) using molten salts.

    PubMed

    Flandinet, L; Tedjar, F; Ghetta, V; Fouletier, J

    2012-04-30

    Recycling of waste electrical and electronic equipments (WEEE) has been taken into consideration in the literature due to the large quantity of concerned wastes and their hazardous contents. The situation is so critical that EU published European Directives imposing collection and recycling with a minimum of material recovery [1]. Moreover, WEEEs contain precious metals, making the recycling of these wastes economically interesting, but also some critical metals and their recycling leads to resource conservation. This paper reports on a new approach for recycling waste printed circuit boards (WPCBs). Molten salts and specifically molten KOH-NaOH eutectic is used to dissolve glasses, oxides and to destruct plastics present in wastes without oxidizing the most valuable metals. This method is efficient for recovering a copper-rich metallic fraction, which is, moreover, cleared of plastics and glasses. In addition, analyses of gaseous emission show that this method is environmentally friendly since most of the process gases, such as carbon monoxide and dioxide and halogens, are trapped in the highly basic molten salt. In other respects, under operation without oxygen, a large quantity of hydrogen is produced and might be used as fuel gas or as synthesis gas, leading to a favourable energy balance for this new process.

  17. Disposing and recycling waste printed circuit boards: disconnecting, resource recovery, and pollution control.

    PubMed

    Wang, Jianbo; Xu, Zhenming

    2015-01-20

    Over the past decades, China has been suffering from negative environmental impacts from distempered e-waste recycling activities. After a decade of effort, disassembly and raw materials recycling of environmentally friendly e-waste have been realized in specialized companies, in China, and law enforcement for illegal activities of e-waste recycling has also been made more and more strict. So up to now, the e-waste recycling in China should be developed toward more depth and refinement to promote industrial production of e-waste resource recovery. Waste printed circuit boards (WPCBs), which are the most complex, hazardous, and valuable components of e-waste, are selected as one typical example in this article that reviews the status of related regulations and technologies of WPCBs recycling, then optimizes, and integrates the proper approaches in existence, while the bottlenecks in the WPCBs recycling system are analyzed, and some preliminary experiments of pinch technologies are also conducted. Finally, in order to provide directional guidance for future development of WPCBs recycling, some key points in the WPCBs recycling system are proposed to point towards a future trend in the e-waste recycling industry.

  18. Column bioleaching copper and its kinetics of waste printed circuit boards (WPCBs) by Acidithiobacillus ferrooxidans.

    PubMed

    Chen, Shu; Yang, Yuankun; Liu, Congqiang; Dong, Faqin; Liu, Bijun

    2015-12-01

    Application of bioleaching process for metal recovery from electronic waste has received an increasing attention in recent years. In this work, a column bioleaching of copper from waste printed circuit boards (WPCBs) by Acidithiobacillus ferrooxidans has been investigated. After column bioleaching for 28d, the copper recovery reached at 94.8% from the starting materials contained 24.8% copper. Additionally, the concentration of Fe(3+) concentration varied significantly during bioleaching, which inevitably will influence the Cu oxidation, thus bioleaching process. Thus the variation in Fe(3+) concentration should be taken into consideration in the conventional kinetic models of bioleaching process. Experimental results show that the rate of copper dissolution is controlled by external diffusion rather than internal one because of the iron hydrolysis and formation of jarosite precipitates at the surface of the material. The kinetics of column bioleaching WPCBs remains unchanged because the size and morphology of precipitates are unaffected by maintaining the pH of solution at 2.25 level. In bioleaching process, the formation of jarosite precipitate can be prevented by adding dilute sulfuric acid and maintaining an acidic condition of the leaching medium. In such way, the Fe(2)(+)-Fe(3+) cycle process can kept going and create a favorable condition for Cu bioleaching. Our experimental results show that column Cu bioleaching from WPCBs by A. ferrooxidans is promising.

  19. Integrated printed circuit board device for cell lysis and nucleic acid extraction.

    PubMed

    Marshall, Lewis A; Wu, Liang Li; Babikian, Sarkis; Bachman, Mark; Santiago, Juan G

    2012-11-01

    Preparation of raw, untreated biological samples remains a major challenge in microfluidics. We present a novel microfluidic device based on the integration of printed circuit boards and an isotachophoresis assay for sample preparation of nucleic acids from biological samples. The device has integrated resistive heaters and temperature sensors as well as a 70 μm × 300 μm × 3.7 cm microfluidic channel connecting two 15 μL reservoirs. We demonstrated this device by extracting pathogenic nucleic acids from 1 μL dispensed volume of whole blood spiked with Plasmodium falciparum. We dispensed whole blood directly onto an on-chip reservoir, and the system's integrated heaters simultaneously lysed and mixed the sample. We used isotachophoresis to extract the nucleic acids into a secondary buffer via isotachophoresis. We analyzed the convective mixing action with micro particle image velocimetry (micro-PIV) and verified the purity and amount of extracted nucleic acids using off-chip quantitative polymerase chain reaction (PCR). We achieved a clinically relevant limit of detection of 500 parasites per microliter. The system has no moving parts, and the process is potentially compatible with a wide range of on-chip hybridization or amplification assays.

  20. [Speciation distribution characters of heavy metals in waste printed circuit boards].

    PubMed

    Zhao, Guo-hua; Luo, Xing-zhang; Huang, Zhuo-hui; Feng, Jing-wei; Zheng, Zheng; Gao, Shun-zhi; Nie, Er; Ni, Li-xiao

    2009-09-15

    The environmental availability of heavy metals from the waste printed circuit boards (PCBs) were studied through BCR's three-stage extraction procedures from EU and Tessier's five sequential extraction procedures. The results show that the heavy metal extraction rates with BCR's procedures are higher than that with Tessier's from waste PCBs. There are significant differences in fraction distributions of heavy metals in PCBs. The speciation of Ni in the PCBs exists mainly in residual forms and has little effect on the environment. The percentage of acidic extractable forms with BCR's method and the total amount of exchangeable and carbonate which bound for Tessier's procedure of Pb and Zn are high, in the South China, the two metals are more easily released by acid rain. Acidic extractable forms of Cu is the main speciation in PCBs with BCR's extraction procedures, while the percentage of Fe-Mn oxides- bound of Cu is the highest with Tessier's procedures, though the result is not agree consistent, due to the high content of Cu in PCBs, the harm of Cu from PCBs could not be neglected.

  1. An environmentally friendly technology of disassembling electronic components from waste printed circuit boards.

    PubMed

    Wang, Jianbo; Guo, Jie; Xu, Zhenming

    2016-07-01

    Electronic components (ECs) disassembling from waste printed circuit boards (WPCBs) is the first and essential step in WPCBs recycling chain. Over the past decades, primitive methods like simply heating WPCBs on a coal-heated plate to melt solders are dominated in practice, causing serious environmental pollution and also putting a real threat to the human health. In order to solve this problem, in this article, an automatic system in pilot-scale for ECs disassembling from WPCBs is designed, manufactured, and investigated. This system contains two parts: ECs automatic disassembly and off-gas purification. Meanwhile, WPCBs from television (i.e., TV-WPCBs) and personal computer (i.e., PC-WPCBs) are used for disassembling tests, respectively. When the disassembling temperature, rotating speed, and incubation time are 265±5°C, 10rpm, and 8min, respectively, the solder can be completely removed from both TV-WPCBs and PC-WPCBs. No pollutant is discharged from this system. Finally, the disassembling procedures for ECs from both TV-WPCBs and PC-WPCBs are suggested to promote WPCBs disassembling in an environment-friendly way, without threaten the environment and human health. PMID:27026495

  2. A novel dismantling process of waste printed circuit boards using water-soluble ionic liquid.

    PubMed

    Zeng, Xianlai; Li, Jinhui; Xie, Henghua; Liu, Lili

    2013-10-01

    Recycling processes for waste printed circuit boards (WPCBs) have been well established in terms of scientific research and field pilots. However, current dismantling procedures for WPCBs have restricted the recycling process, due to their low efficiency and negative impacts on environmental and human health. This work aimed to seek an environmental-friendly dismantling process through heating with water-soluble ionic liquid to separate electronic components and tin solder from two main types of WPCBs-cathode ray tubes and computer mainframes. The work systematically investigates the influence factors, heating mechanism, and optimal parameters for opening solder connections on WPCBs during the dismantling process, and addresses its environmental performance and economic assessment. The results obtained demonstrate that the optimal temperature, retention time, and turbulence resulting from impeller rotation during the dismantling process, were 250 °C, 12 min, and 45 rpm, respectively. Nearly 90% of the electronic components were separated from the WPCBs under the optimal experimental conditions. This novel process offers the possibility of large industrial-scale operations for separating electronic components and recovering tin solder, and for a more efficient and environmentally sound process for WPCBs recycling. PMID:23910241

  3. Wood plastic composite produced by nonmetals from pulverized waste printed circuit boards.

    PubMed

    Guo, Jie; Tang, Yinen; Xu, Zhenming

    2010-01-01

    Nonmetals reclaimed from waste printed circuit boards (PCBs) are used to replace wood flour in the production of wood plastic composite (WPC). To evaluate property durability against weather exposure, the effects of accelerated aging process on the properties of WPC are investigated. The results show that filling of nonmetals in WPC improves the flexural strength and tensile strength, and reduces screw withdrawal strength. Before hollow WPC with 15% nonmetals (H-15-WPC) underwent aging process, H-15-WPC had a flexural strength of 25.8 MPa, a tensile strength of 9.8 MPa, a charpy impact strength of 3.4 kJ/m(2), and face/edge screw withdrawal strength of 121/115 N/mm. It is found that flexural strength of H-15-WPC decreases linearly with the increase of accelerated aging cycles, and the effects of aging test on tensile and impact strength of H-15-WPC are minor. For solid WPC, the accelerated aging test decreases screw withdrawal strength slightly. All the results indicate that nonmetals of waste PCBs can be reused as an alternative for wood flour in WPC products rather than resorting to their landfill or combustion.

  4. Comparative study on copper leaching from waste printed circuit boards by typical ionic liquid acids.

    PubMed

    Chen, Mengjun; Huang, Jinxiu; Ogunseitan, Oladele A; Zhu, Nengming; Wang, Yan-min

    2015-07-01

    Waste printed circuit boards (WPCBs) are attracting increasing concerns because the recovery of its content of valuable metallic resources is hampered by the presence of hazardous substances. In this study, we used ionic liquids (IL) to leach copper from WPCBs. [BSO3HPy]OTf, [BSO3HMIm]OTf, [BSO4HPy]HSO4, [BSO4HMim]HSO4 and [MIm]HSO4 were selected. Factors that affect copper leaching rate were investigated in detail and their leaching kinetics were also examined with the comparison of [Bmim]HSO4. The results showed that all six IL acids could successfully leach copper out, with near 100% recovery. WPCB particle size and leaching time had similar influences on copper leaching performance, while IL acid concentration, hydrogen peroxide addition, solid to liquid ratio, temperature, showed different influences. Moreover, IL acid with HSO4(-) was more efficient than IL acid with CF3SO3(-). These six IL acids indicate a similar behavior with common inorganic acids, except temperature since copper leaching rate of some IL acids decreases with its increase. The results of leaching kinetics studies showed that diffusion plays a more important role than surface reaction, whereas copper leaching by inorganic acids is usually controlled by surface reaction. This innovation provides a new option for recovering valuable materials such as copper from WPCBs.

  5. Pyrolysis characteristics of the mixture of printed circuit board scraps and coal powder.

    PubMed

    Hao, Juan; Wang, Haifeng; Chen, Shuhe; Cai, Bin; Ge, Linhan; Xia, Wencheng

    2014-10-01

    Thermogravimetric (TG) analysis and infrared spectroscopy were used to analyze the pyrolysis characteristics of printed circuit board scraps (PCBs), coal powder and their mixtures under nitrogen atmosphere. The experimental results show that there is a large difference between waste PCBs and coal powder in pyrolysis processing. The pyrolysis properties of the mixing samples are the result of interaction of the PCBs and coal powder, which is influenced by the content of mixture. The degree of pyrolysis and pyrolysis properties of the mixture are much better than that of the single component. The TG and the differential thermogravimetric (DTG) curves of the PCBs mixed with coal powder move towards the high-temperature zone with increasing amount of coal powder and subsequently the DTG peak also becomes wider. The Coats-Redfern integral method was used to determine the kinetic parameters of pyrolysis reaction mechanism with the different proportion of mixture. The gas of pyrolysis mainly composes of CO2, CO, H2O and some hydrocarbon. The bromide characteristic absorption peak has been detected obviously in the pyrolysis gas of PCBs. On the contrary, the absorption peak of the bromide is not obvious in pyrolysis gas of the PCBs samples adding 40% coal powder.

  6. A Novel Designed Bioreactor for Recovering Precious Metals from Waste Printed Circuit Boards

    PubMed Central

    Jujun, Ruan; Jie, Zheng; Jian, Hu; Zhang, Jianwen

    2015-01-01

    For recovering precious metals from waste printed circuit boards (PCBs), a novel hybrid technology including physical and biological methods was developed. It consisted of crushing, corona-electrostatic separation, and bioleaching. Bioleaching process is the focus of this paper. A novel bioreactor for bioleaching was designed. Bioleaching was carried out using Pseudomonas chlororaphis. Bioleaching experiments using mixed particles of Au and Cu were performed and leachate contained 0.006 mg/L, 2823 mg/L Au+ and Cu2+ respectively. It showed when Cu existed, the concentrations of Au were extremely small. This provided the feasibility to separate Cu from Au. The method of orthogonal experimental design was employed in the simulation bioleaching experiments. Experimental results showed the optimized parameters for separating Cu from Au particles were pH 7.0, temperature 22.5 °C, and rotation speed 80 r/min. Based on the optimized parameters obtained, the bioreactor was operated for recovering mixed Au and Cu particles. 88.1 wt.% of Cu and 76.6 wt.% of Au were recovered. The paper contributed important information to recover precious metals from waste PCBs. PMID:26316021

  7. An environmentally friendly technology of disassembling electronic components from waste printed circuit boards.

    PubMed

    Wang, Jianbo; Guo, Jie; Xu, Zhenming

    2016-07-01

    Electronic components (ECs) disassembling from waste printed circuit boards (WPCBs) is the first and essential step in WPCBs recycling chain. Over the past decades, primitive methods like simply heating WPCBs on a coal-heated plate to melt solders are dominated in practice, causing serious environmental pollution and also putting a real threat to the human health. In order to solve this problem, in this article, an automatic system in pilot-scale for ECs disassembling from WPCBs is designed, manufactured, and investigated. This system contains two parts: ECs automatic disassembly and off-gas purification. Meanwhile, WPCBs from television (i.e., TV-WPCBs) and personal computer (i.e., PC-WPCBs) are used for disassembling tests, respectively. When the disassembling temperature, rotating speed, and incubation time are 265±5°C, 10rpm, and 8min, respectively, the solder can be completely removed from both TV-WPCBs and PC-WPCBs. No pollutant is discharged from this system. Finally, the disassembling procedures for ECs from both TV-WPCBs and PC-WPCBs are suggested to promote WPCBs disassembling in an environment-friendly way, without threaten the environment and human health.

  8. A new technology for recycling materials from waste printed circuit boards.

    PubMed

    Zhou, Yihui; Qiu, Keqiang

    2010-03-15

    Waste printed circuit boards (WPCBs) contain lots of valuable resources together with plenty of hazardous materials, which are considered both an attractive secondary resource and an environmental contaminant. In this research, a new process of "centrifugal separation+vacuum pyrolysis" for the combined recovery of solder and organic materials from WPCBs was investigated. The results of centrifugal separation indicated that the separation of solder from WPCBs was complete when WPCBs were heated at 240 degrees C, and the rotating drum was rotated at 1400 rpm for 6 min intermittently. The results of vacuum pyrolysis showed that the type-A of WPCBs without solder pyrolysed to form an average of 69.5 wt% residue, 27.8 wt% oil, and 2.7 wt% gas; and pyrolysis of the type-B of WPCBs without solder led to an average mass balance of 75.7 wt% residue, 20.0 wt% oil, and 4.3 wt% gas. The pyrolysis residues contain various metals, glass fibers and other inorganic materials, which could be recycled for further processing. The pyrolysis oils can be used for fuel or chemical feedstock and the pyrolysis gases can be collected and combusted for the pyrolysis self-sustain. This clean and non-polluting technology offers a new way to recycle valuable materials from WPCBs and prevent the environmental pollution of WPCBs effectively.

  9. Application of glass-nonmetals of waste printed circuit boards to produce phenolic moulding compound.

    PubMed

    Guo, Jie; Rao, Qunli; Xu, Zhenming

    2008-05-01

    The aim of this study was to investigate the feasibility of using glass-nonmetals, a byproduct of recycling waste printed circuit boards (PCBs), to replace wood flour in production of phenolic moulding compound (PMC). Glass-nonmetals were attained by two-step crushing and corona electrostatic separating processes. Glass-nonmetals with particle size shorter than 0.07 mm were in the form of single fibers and resin powder, with the biggest portion (up to 34.6 wt%). Properties of PMC with glass-nonmetals (PMCGN) were compared with reference PMC and the national standard of PMC (PF2C3). When the adding content of glass-nonmetals was 40 wt%, PMCGN exhibited flexural strength of 82 MPa, notched impact strength of 2.4 kJ/m(2), heat deflection temperature of 175 degrees C, and dielectric strength of 4.8 MV/m, all of which met the national standard. Scanning electron microscopy (SEM) showed strong interfacial bonding between glass fibers and the phenolic resin. All the results showed that the use of glass-nonmetals as filler in PMC represented a promising method for resolving the environmental pollutions and reducing the cost of PMC, thus attaining both environmental and economic benefits.

  10. Dissolution of brominated epoxy resins by dimethyl sulfoxide to separate waste printed circuit boards.

    PubMed

    Zhu, Ping; Chen, Yan; Wang, Liangyou; Qian, Guangren; Zhang, Wei Jie; Zhou, Ming; Zhou, Jin

    2013-03-19

    Improved methods are required for the recycling of waste printed circuit boards (WPCBs). In this study, WPCBs (1-1.5 cm(2)) were separated into their components using dimethyl sulfoxide (DMSO) at 60 °C for 45 min and a metallographic microscope was used to verify their delamination. An increased incubation time of 210 min yielded a complete separation of WPCBs into their components, and copper foils and glass fibers were obtained. The separation time decreased with increasing temperature. When the WPCB size was increased to 2-3 cm(2), the temperature required for complete separation increased to 90 °C. When the temperature was increased to 135 °C, liquid photo solder resists could be removed from the copper foil surfaces. The DMSO was regenerated by rotary decompression evaporation, and residues were obtained. Fourier transform infrared spectroscopy (FT-IR), thermal analysis, nuclear magnetic resonance, scanning electron microscopy, and energy-dispersive X-ray spectroscopy were used to verify that these residues were brominated epoxy resins. From FT-IR analysis after the dissolution of brominated epoxy resins in DMSO it was deduced that hydrogen bonding may play an important role in the dissolution mechanism. This novel technology offers a method for separating valuable materials and preventing environmental pollution from WPCBs.

  11. Leaching characteristics of heavy metals and brominated flame retardants from waste printed circuit boards.

    PubMed

    Zhou, Xiaoyu; Guo, Jie; Lin, Kuangfei; Huang, Kai; Deng, Jingjing

    2013-02-15

    Leaching assessment on five heavy metals (copper, zinc, lead, nickel and cadmium) and two brominated flame retardants (BFRs), polybrominated diphenyl ethers (PBDEs) and tetrabromobisphenol A (TBBPA), from waste printed circuit boards (WPCBs) were conducted using various leaching methods. The mean leaching concentrations of copper were the highest in both toxicity characteristic leaching procedures (TCLP) and synthetic precipitation leaching procedures (SPLP) tests at 8.6 mg/L and 1.1mg/L, while only lead (6.2mg/L) exceeded the TCLP criteria and Chinese EPA regulatory limit (both 5.0mg/L). However, PBDEs and TBBPA were not detected in TCLP and SPLP tests. Then the BFRs leaching trends and potential leachabilities were further investigated in actual landfill leachates using a modified method. Leaching characteristics that fast-leaching initially followed by slow-desorption over time were generally observed. In landfill leachate tests, the highest leaching concentrations of PBDEs and TBBPA were determined at 30.39 and 12.27 μg/L. Meanwhile, the highest leaching rates were estimated to reach 0.08% and 1.00%, respectively, which were significantly influenced by the dissolved organic carbon contents of extracts, the hydrophobicities of target BFRs and the specific surface areas of WPCBs materials. These results proved that leaching from WPCBs was a significant emission source of BFRs in landfill and electronic waste recycling dumpsite. PMID:23291335

  12. An Evaluation of Prototype Circuit Boards Assembled with a Sn-Ag Bi Solder

    SciTech Connect

    ARTAKI,I.; RAY,U.; REJENT,JEROME A.; VIANCO,PAUL T.

    1999-09-01

    An evaluation was performed which examined the aging of surface mount solder joints assembled with 91.84Sn-3.33Ag-4.83Bi solder. Defect analysis of the as-fabricated test vehicles revealed excellent solderability, good package alignment, and a minimum number of voids. Continuous DC electrical monitoring of the solder joints did not reveal opens during as many as 10,000 thermal cycles (0 C, 100 C). The solder joints exhibited no significant degradation through 2500 cycles, based upon an absence of microstructural damage and sustained shear and pull strengths of chip capacitors and J-leaded solder joints, respectively. Thermal cycles of 5000 and 10,000 resulted in some surface cracking of the solder fillets and coatings. In a few cases, deeper cracks were observed in the thinner reaches of several solder fillets. There was no deformation or cracking in the solder located in the gap between the package I/O and the circuit board pad nor in the interior of the fillets, both locations that would raise concerns of joint mechanical integrity. A drop in the chip capacitor shear strength was attributed to crack growth near the top of the fillet.

  13. Combustion and inorganic bromine emission of waste printed circuit boards in a high temperature furnace

    SciTech Connect

    Ni Mingjiang; Xiao Hanxi; Chi Yong; Yan Jianhua; Buekens, Alfons; Jin Yuqi; Lu Shengyong

    2012-03-15

    Highlights: Black-Right-Pointing-Pointer The combustion efficiency of waste printed circuit boards (PCBs) depends on temperature, excess air factor, and high temperature zone residence time. Temperature has the most significant impact. Under the proposed condition, combustion of waste PCBs alone is quite complete within the furnace. Black-Right-Pointing-Pointer High temperature prompts a more complete bromine release and conversion. When temperature is high enough, 99.9% organobrominated compounds, the potential precursors for brominated dixoins formation, are destroyed efficiently and convert to inorganic bromine in flue gas, as HBr and Br{sub 2}. Black-Right-Pointing-Pointer Temperature has crucial influence over the inhibition of HBr conversion to Br{sub 2}, while the oxygen partial pressure plays a reverse role in the conversion to a very small extent. Increasing temperature will decrease the volume percentage ratio of Br{sub 2}/HBr in flue gas greatly. Black-Right-Pointing-Pointer The thermodynamic equilibrium approach of bromine conversion was investigated. The two forms of inorganic bromine in flue gas substantially reach thermodynamic equilibrium within 0.25 s. Under the proposed operating condition, the reaction of Br transfer and conversion finish. - Abstract: High temperature combustion experiments of waste printed circuit boards (PCBs) were conducted using a lab-scale system featuring a continuously-fed drop tube furnace. Combustion efficiency and the occurrence of inorganic bromine (HBr and Br{sub 2}) were systematically studied by monitoring the main combustion products continuously. The influence of furnace temperature (T) was studied from 800 to 1400 Degree-Sign C, the excess air factor (EAF) was varied from 1.2 to 1.9 and the residence time in the high temperature zone (RT{sub HT}) was set at 0.25, 0.5, or 0.75 s. Combustion efficiency depends on temperature, EAF and RT{sub HT}; temperature has the most significant effect. Conversion of organic

  14. Effects of PCB Pad Metal Finishes on the Cu-Pillar/Sn-Ag Micro Bump Joint Reliability of Chip-on-Board (COB) Assembly

    NASA Astrophysics Data System (ADS)

    Kim, Youngsoon; Lee, Seyong; Shin, Ji-won; Paik, Kyung-Wook

    2016-06-01

    While solder bumps have been used as the bump structure to form the interconnection during the last few decades, the continuing scaling down of devices has led to a change in the bump structure to Cu-pillar/Sn-Ag micro-bumps. Cu-pillar/Sn-Ag micro-bump interconnections differ from conventional solder bump interconnections in terms of their assembly processing and reliability. A thermo-compression bonding method with pre-applied b-stage non-conductive films has been adopted to form solder joints between Cu pillar/Sn-Ag micro bumps and printed circuit board vehicles, using various pad metal finishes. As a result, various interfacial inter-metallic compounds (IMCs) reactions and stress concentrations occur at the Cu pillar/Sn-Ag micro bumps joints. Therefore, it is necessary to investigate the influence of pad metal finishes on the structural reliability of fine pitch Cu pillar/Sn-Ag micro bumps flip chip packaging. In this study, four different pad surface finishes (Thin Ni ENEPIG, OSP, ENEPIG, ENIG) were evaluated in terms of their interconnection reliability by thermal cycle (T/C) test up to 2000 cycles at temperatures ranging from -55°C to 125°C and high-temperature storage test up to 1000 h at 150°C. The contact resistances of the Cu pillar/Sn-Ag micro bump showed significant differences after the T/C reliability test in the following order: thin Ni ENEPIG > OSP > ENEPIG where the thin Ni ENEPIG pad metal finish provided the best Cu pillar/Sn-Ag micro bump interconnection in terms of bump joint reliability. Various IMCs formed between the bump joint areas can account for the main failure mechanism.

  15. Recovery of materials from waste printed circuit boards by vacuum pyrolysis and vacuum centrifugal separation.

    PubMed

    Zhou, Yihui; Wu, Wenbiao; Qiu, Keqiang

    2010-11-01

    In this research, a two-step process consisting of vacuum pyrolysis and vacuum centrifugal separation was employed to treat waste printed circuit boards (WPCBs). Firstly, WPCBs were pyrolysed under vacuum condition at 600 °C for 30 min in a lab-scale reactor. Then, the obtained pyrolysis residue was heated under vacuum until the solder was melted, and then the molten solder was separated from the pyrolysis residue by the centrifugal force. The results of vacuum pyrolysis showed that the type-A of WPCBs (the base plates of which was made from cellulose paper reinforced phenolic resin) pyrolysed to form an average of 67.97 wt.% residue, 27.73 wt.% oil, and 4.30 wt.% gas; and pyrolysis of the type-B of WPCBs (the base plates of which was made from glass fiber reinforced epoxy resin) led to an average mass balance of 72.20 wt.% residue, 21.45 wt.% oil, and 6.35 wt.% gas. The results of vacuum centrifugal separation showed that the separation of solder was complete when the pyrolysis residue was heated at 400 °C, and the rotating drum was rotated at 1200 rpm for 10 min. The pyrolysis oil and gas can be used as fuel or chemical feedstock after treatment. The pyrolysis residue after solder separation contained various metals, glass fibers and other inorganic materials, which could be recycled for further processing. The recovered solder can be reused directly and it can also be a good resource of lead and tin for refining.

  16. Identification of estrogenic compounds emitted from the combustion of computer printed circuit boards in electronic waste.

    PubMed

    Owens, Clyde V; Lambright, Christy; Bobseine, Kathy; Ryan, Bryce; Gray, L Earl; Gullett, Brian K; Wilson, Vickie S

    2007-12-15

    Rapid changes in technology have brought about a surge in demand for electronic equipment. Many of these products contain brominated flame-retardants (BFRs) as additives to decrease the rate of combustion, raising concerns about their toxicological risk. In our study, emissions from the combustion of computer-printed circuit boards were evaluated in the T47D-KBluc estrogen-responsive cell line at a series of concentrations. There was significant activity from the emission extract when compared to the positive control, 0.1 nM estradiol. After HPLC fractionation, GC/MS identified ten chemicals which included bisphenol A; the brominated derivates mono-, di-, and tribisphenol, triphenyl phosphate, triphenyl phosphine oxide, 4'-bromo-[1,1'-biphenyl]-4-ol,3,5-dibromo-4-hydroxybiphenyl,3,5-dibromo-2-hydroxybiphenyl, and the oxygenated polyaromatic hydrocarbon benzanthrone. Commercially available samples of these ten compounds were tested. The compound 4'-bromo-[1,1'-biphenyl]-4-ol resulted in dose-dependent significant increases for luciferase activity at concentrations ranging from 0.1 to 10 microM in the T47D-KBluc assay. The chemical also demonstrated an affinity for binding to the estrogen receptor (ER) with an IC50 of 2 x 10(-7) M. To determine the uterotrophic activity, three doses (50, 100, and 200 mg/kg/day) of 4'-bromo-[1,1'-biphenyl]-4-ol were administered to adult ovariectomized Long-Evans rats for 3 days. Treatment of the animals with 200 mg/ kg/day showed an increase in uterine weight Hence one new chemical, released by burning of electrical wastes, was identified which displays estrogenic activity both in vitro and in vivo. However, it was about 1000-fold less potent than ethynyl estradiol.

  17. Recovery of materials from waste printed circuit boards by vacuum pyrolysis and vacuum centrifugal separation.

    PubMed

    Zhou, Yihui; Wu, Wenbiao; Qiu, Keqiang

    2010-11-01

    In this research, a two-step process consisting of vacuum pyrolysis and vacuum centrifugal separation was employed to treat waste printed circuit boards (WPCBs). Firstly, WPCBs were pyrolysed under vacuum condition at 600 °C for 30 min in a lab-scale reactor. Then, the obtained pyrolysis residue was heated under vacuum until the solder was melted, and then the molten solder was separated from the pyrolysis residue by the centrifugal force. The results of vacuum pyrolysis showed that the type-A of WPCBs (the base plates of which was made from cellulose paper reinforced phenolic resin) pyrolysed to form an average of 67.97 wt.% residue, 27.73 wt.% oil, and 4.30 wt.% gas; and pyrolysis of the type-B of WPCBs (the base plates of which was made from glass fiber reinforced epoxy resin) led to an average mass balance of 72.20 wt.% residue, 21.45 wt.% oil, and 6.35 wt.% gas. The results of vacuum centrifugal separation showed that the separation of solder was complete when the pyrolysis residue was heated at 400 °C, and the rotating drum was rotated at 1200 rpm for 10 min. The pyrolysis oil and gas can be used as fuel or chemical feedstock after treatment. The pyrolysis residue after solder separation contained various metals, glass fibers and other inorganic materials, which could be recycled for further processing. The recovered solder can be reused directly and it can also be a good resource of lead and tin for refining. PMID:20655190

  18. Using vacuum pyrolysis and mechanical processing for recycling waste printed circuit boards.

    PubMed

    Long, Laishou; Sun, Shuiyu; Zhong, Sheng; Dai, Wencan; Liu, Jingyong; Song, Weifeng

    2010-05-15

    The constant growth in generation of waste printed circuit boards (WPCB) poses a huge disposal problem because they consist of a heterogeneous mixture of organic and metallic chemicals as well as glass fiber. Also the presence of heavy metals, such as Pb and Cd turns this scrap into hazardous waste. Therefore, recycling of WPCB is an important subject not only from the recovery of valuable materials but also from the treatment of waste. The aim of this study was to present a recycling process without negative impact to the environment as an alternative for recycling WPCB. In this work, a process technology containing vacuum pyrolysis and mechanical processing was employed to recycle WPCB. At the first stage of this work, the WPCB was pyrolyzed under vacuum in a self-made batch pilot-scale fixed bed reactor to recycle organic resins contained in the WPCB. By vacuum pyrolysis the organic matter was decomposed to gases and liquids which could be used as fuels or chemical material resources, however, the inorganic WPCB matter was left unaltered as solid residues. At the second stage, the residues obtained at the first stage were investigated to separate and recover the copper through mechanical processing such as crushing, screening, and gravity separation. The copper grade of 99.50% with recovery of 99.86% based on the whole WPCB was obtained. And the glass fiber could be obtained by calcinations in a muffle furnace at 600 degrees C for 10 min. This study had demonstrated the feasibility of vacuum pyrolysis and mechanical processing for recycling WPCB. PMID:20060640

  19. Fluorescence detection test by black printed circuit board based microfluidic channel for polymerase chain reaction.

    PubMed

    Hwang, Ji-Soo; Kim, Yu-Seop; Song, Hye-Jeong; Kim, Jong-Dae; Park, Chan-Young

    2015-01-01

    This paper proposes the optimal structure of a PCB-based micro PCR chip constructed on a PCB substrate using commercial adhesive tapes and plastic covers. The solder mask of the PCB substrate was coated black, and the area where the reaction chamber is attached was legend printed with white silk to minimize the noise during fluorescence detection. The performance of the PCR and fluorescence detection was compared using 6 types of reaction chambers, each made with different double-sided tapes. Three of the chambers were unsuccessful in completing the PCR. The performance of the other three chambers that successfully amplified DNA was compared using Taqman probe for Chlamydia Trachomatis DNA. The amplified product was illuminated diagonally with a blue LED to excite the product just before imaging, and the LED was turned off when the image was captured to prevent quenching of the probe. The images were taken 10 seconds prior to the last extension step for each cycle using a DSLR camera. The experiments were run as a quartet for each three chambers made with different double-sided tape. The results showed that there were significant difference between the three tapes. PMID:26409548

  20. [Copper recovery from artificial bioleaching lixivium of waste printed circuit boards].

    PubMed

    Cheng, Dan; Zhu, Neng-Wu; Wu, Ping-Xiao; Zou, Ding-Hui; Xing, Yi-Jia

    2014-04-01

    The key step to realize metal recovery from bioleaching solutions is the recovery of copper from bioleaching lixivium of waste printed circuit boards in high-grade form. The influences of cathode material, current density, initial pH and initial copper ion concentration on the efficiency and energy consumption of copper recovery from artificial bioleaching lixivium under condition of constant current were investigated using an electro-deposition approach. The results showed that the larger specific surface area of the cathode material (carbon felt) led to the higher copper recovery efficiency (the recovery efficiencies of the anode and the cathode chambers were 96.56% and 99.25%, respectively) and the smaller the total and unit mass product energy consumption (the total and unit mass product energy consumptions were 0.022 kW x h and 15.71 kW x h x kg(-1), respectively). The copper recovery efficiency and energy consumption increased with the increase of current density. When the current density was 155.56 mA x cm(-2), the highest copper recovery efficiencies in the anode and cathode chambers reached 98.51% and 99.37%, respectively. Accordingly, the highest total and unit mass product energy consumptions were 0.037 kW x h and 24.34 kW x h x kg(-1), respectively. The copper recovery efficiency was also significantly affected by the initial copper ion concentration. The increase of the initial copper ion concentration would lead to faster decrease of copper ion concentration, higher total energy consumption, and lower unit mass product consumption. However, the initial pH had no significant effect on the copper recovery efficiency. Under the optimal conditions (carbon felt for cathode materials, current density of 111.11 mA x cm(-2), initial pH of 2.0, and initial copper ion concentration of 10 g x L(-1)), the copper recovery efficiencies of the anode and cathode chambers were 96.75% and 99.35%, and the total and unit mass product energy consumptions were 0.021 kW x h

  1. Recycling of non-metallic fractions from waste printed circuit boards: a review.

    PubMed

    Guo, Jiuyong; Guo, Jie; Xu, Zhenming

    2009-09-15

    The major economic driving force for recycling of waste printed circuit boards (PCBs) is the value of the metallic fractions (MFs) of PCBs. The non-metallic fractions (NMFs), which take up almost 70wt% of waste PCBs, were treated by combustion or land filling in the past. However, combustion of the NMFs will cause the formation of highly toxic polybrominated dibenzodioxins and dibenzofurans (PBDD/Fs) while land filling of the NMFs will lead to secondary pollution caused by heavy metals and brominated flame retardants (BFRs) leaching to the groundwater. Therefore, recycling of the NMFs from waste PCBs is drawing more and more attention from the public and the governments. Currently, how to recycle the NMFs environmental soundly has become a significant topic in recycling of waste PCBs. In order to fulfill the better resource utilization of the NMFs, the compositions and characteristics of the NMFs, methods and outcomes of recycling the NMFs from waste PCBs and analysis and treatment for the hazardous substances contained in the NMFs were reviewed in this paper. Thermosetting resin matrix composites, thermoplastic matrix composites, concrete and viscoelastic materials are main applications for physical recycling of the NMFs. Chemical recycling methods consisting of pyrolysis, gasification, supercritical fluids depolymerization and hydrogenolytic degradation can be used to convert the NMFs to chemical feedstocks and fuels. The toxicity characteristic leaching procedure (TCLP) and synthetic precipitation leaching procedure (SPLP) can be used to determine the toxicity characteristic (TC) of the NMFs and to evaluate the environmental safety of products made from the recycled NMFs. It is believed that physical recycling of the NMFs has been a promising recycling method. Much more work should be done to develop comprehensive and industrialized usage of the NMFs recycled by physical methods. Chemical recycling methods have the advantages in eliminating hazardous substances

  2. Generation of copper rich metallic phases from waste printed circuit boards.

    PubMed

    Cayumil, R; Khanna, R; Ikram-Ul-Haq, M; Rajarao, R; Hill, A; Sahajwalla, V

    2014-10-01

    The rapid consumption and obsolescence of electronics have resulted in e-waste being one of the fastest growing waste streams worldwide. Printed circuit boards (PCBs) are among the most complex e-waste, containing significant quantities of hazardous and toxic materials leading to high levels of pollution if landfilled or processed inappropriately. However, PCBs are also an important resource of metals including copper, tin, lead and precious metals; their recycling is appealing especially as the concentration of these metals in PCBs is considerably higher than in their ores. This article is focused on a novel approach to recover copper rich phases from waste PCBs. Crushed PCBs were heat treated at 1150°C under argon gas flowing at 1L/min into a horizontal tube furnace. Samples were placed into an alumina crucible and positioned in the cold zone of the furnace for 5 min to avoid thermal shock, and then pushed into the hot zone, with specimens exposed to high temperatures for 10 and 20 min. After treatment, residues were pulled back to the cold zone and kept there for 5 min to avoid thermal cracking and re-oxidation. This process resulted in the generation of a metallic phase in the form of droplets and a carbonaceous residue. The metallic phase was formed of copper-rich red droplets and tin-rich white droplets along with the presence of several precious metals. The carbonaceous residue was found to consist of slag and ∼30% carbon. The process conditions led to the segregation of hazardous lead and tin clusters in the metallic phase. The heat treatment temperature was chosen to be above the melting point of copper; molten copper helped to concentrate metallic constituents and their separation from the carbonaceous residue and the slag. Inert atmosphere prevented the re-oxidation of metals and the loss of carbon in the gaseous fraction. Recycling e-waste is expected to lead to enhanced metal recovery, conserving natural resources and providing an environmentally

  3. Generation of copper rich metallic phases from waste printed circuit boards.

    PubMed

    Cayumil, R; Khanna, R; Ikram-Ul-Haq, M; Rajarao, R; Hill, A; Sahajwalla, V

    2014-10-01

    The rapid consumption and obsolescence of electronics have resulted in e-waste being one of the fastest growing waste streams worldwide. Printed circuit boards (PCBs) are among the most complex e-waste, containing significant quantities of hazardous and toxic materials leading to high levels of pollution if landfilled or processed inappropriately. However, PCBs are also an important resource of metals including copper, tin, lead and precious metals; their recycling is appealing especially as the concentration of these metals in PCBs is considerably higher than in their ores. This article is focused on a novel approach to recover copper rich phases from waste PCBs. Crushed PCBs were heat treated at 1150°C under argon gas flowing at 1L/min into a horizontal tube furnace. Samples were placed into an alumina crucible and positioned in the cold zone of the furnace for 5 min to avoid thermal shock, and then pushed into the hot zone, with specimens exposed to high temperatures for 10 and 20 min. After treatment, residues were pulled back to the cold zone and kept there for 5 min to avoid thermal cracking and re-oxidation. This process resulted in the generation of a metallic phase in the form of droplets and a carbonaceous residue. The metallic phase was formed of copper-rich red droplets and tin-rich white droplets along with the presence of several precious metals. The carbonaceous residue was found to consist of slag and ∼30% carbon. The process conditions led to the segregation of hazardous lead and tin clusters in the metallic phase. The heat treatment temperature was chosen to be above the melting point of copper; molten copper helped to concentrate metallic constituents and their separation from the carbonaceous residue and the slag. Inert atmosphere prevented the re-oxidation of metals and the loss of carbon in the gaseous fraction. Recycling e-waste is expected to lead to enhanced metal recovery, conserving natural resources and providing an environmentally

  4. Recycling-oriented characterization of plastic frames and printed circuit boards from mobile phones by electronic and chemical imaging

    SciTech Connect

    Palmieri, Roberta; Bonifazi, Giuseppe; Serranti, Silvia

    2014-11-15

    Highlights: • A recycling oriented characterization of end-of-life mobile phones was carried out. • Characterization was developed in a zero-waste-perspective, aiming to recover all the mobile phone materials. • Plastic frames and printed circuit boards were analyzed by electronic and chemical imaging. • Suitable milling/classification strategies were set up to define specialized-pre-concentrated-streams. • The proposed approach can improve the recovery of polymers, base/precious metals, rare earths and critical raw materials. - Abstract: This study characterizes the composition of plastic frames and printed circuit boards from end-of-life mobile phones. This knowledge may help define an optimal processing strategy for using these items as potential raw materials. Correct handling of such a waste is essential for its further “sustainable” recovery, especially to maximize the extraction of base, rare and precious metals, minimizing the environmental impact of the entire process chain. A combination of electronic and chemical imaging techniques was thus examined, applied and critically evaluated in order to optimize the processing, through the identification and the topological assessment of the materials of interest and their quantitative distribution. To reach this goal, end-of-life mobile phone derived wastes have been systematically characterized adopting both “traditional” (e.g. scanning electronic microscopy combined with microanalysis and Raman spectroscopy) and innovative (e.g. hyperspectral imaging in short wave infrared field) techniques, with reference to frames and printed circuit boards. Results showed as the combination of both the approaches (i.e. traditional and classical) could dramatically improve recycling strategies set up, as well as final products recovery.

  5. Graded-index core polymer optical waveguide for high-bandwidth-density optical printed circuit boards: fabrication and characterization

    NASA Astrophysics Data System (ADS)

    Ishigure, Takaaki

    2014-03-01

    We demonstrate that graded-index (GI) core polymer optical waveguides are a promising component realizing highbandwidth- density on-board interconnects. As a method for fabricating GI-circular-core polymer optical waveguides, we introduce the Mosquito method utilizing a microdispenser. The Mosquito method is capable of accurately controlling the core diameter and the inter-core pitch. We also demonstrate that the GI-core polymer waveguides enable remarkably low loss waveguide circuits involving waveguide crossings in a mono layer. We show an alternative technique to realize the low-loss GI-core crossed waveguide: the photo-addressing method which was developed by Sumitomo Bakelite Co., Ltd.

  6. Computational algorithms for analysis of data from thin-film thermoresistors on a radio-electronic printed circuit board

    NASA Astrophysics Data System (ADS)

    Korneeva, Anna; Shaydurov, Vladimir

    2016-08-01

    In the paper, the data analysis is considered for thin-film thermoresistors coated on to a radio-electronic printed circuit board to determine possible zones of its overheating. A mathematical model consists in an underdetermined system of linear algebraic equations with an infinite set of solutions. For computing a more real solution, two additional conditions are used: the smoothness of a solution and the positiveness of an increase of temperature during overheating. Computational experiments demonstrate that an overheating zone is determined exactly with a tolerable accuracy of temperature in it.

  7. The PCB mark

    SciTech Connect

    1994-12-01

    Polychlorinated biphenyls (PCBs) are a class of organic chemicals that had become widely used in industrial applications due to their practical physical and chemical properties. Historical uses of PCBs include dielectric fluids (used in utility transformers, capacitors, etc.), hydraulic fluids, and other applications requiring stable, fire-retardant materials. Due to findings that PCBs may cause adverse health effects and due to their persistence and accumulation in the environment. The Toxic Substances Control Act (TSCA), enacted on October 11, 1976, banned the manufacture of PCBs after 1978 [Section 6(e)]. The first PCB regulations, promulgated at 40 CFR Part 761, were finalized on February 17, 1978. These PCB regulations include requirements specifying disposal methods and marking (labeling) procedures, and controlling PCB use. To assist the Department of Energy (DOE) in its efforts to comply with the TSCA statute and implementing regulations, the Office of Environmental Guidance has prepared the document ``Guidance on the Management of Polychlorinated Biphenyls (PCBs).`` That document explains the requirements specified in the statute and regulations for managing PCBs including PCB use, storage, transport, and disposal. The requirements outlined at 40 CFR 761.40 through 761.45 specify marking requirements for most PCB items (i.e., any PCB Article, PCB Container, PCB Article Container, or PCB Equipment that contains PCBs). Most PCB items require PCB marks, which are defined as a descriptive name, instructions, cautions, or other information applied to PCB Items or other objects subject to these regulations. The marking regulations include requirements for PCB marks on PCB Items, storage areas, and temporary storage areas. This Information Brief supplements the PCB guidance document by responding to common questions concerning marking requirements for PCBs. It is one of a series of Information Briefs pertinent to PCB management issues.

  8. Assessment of gold and silver in assorted mobile phone printed circuit boards (PCBs): Original article.

    PubMed

    Vats, M C; Singh, S K

    2015-11-01

    Demand for gold and silver has been escalating with increasing usage of electronic equipment globally. Around 267.3 MT of gold and 7275 MT of silver are being consumed annually for manufacturing mobile phones, laptops and other electronic equipment. However, only 15% is recuperated from these equipment; the remainder lies in the storage yards or landfills. The waste comprise glass, plastics, wires, batteries, PCBs, metal casing, etc. The PCB is composed of precious metals, which creates immense purpose for recycling and recovery. This paper characterises and assesses the recoverable metallic fraction of gold and silver from PCBs of mobile phones. The methodology is based on dismantling of the mobile handset and subjecting the PCBs to roasting and acid digestion. The digested samples were analysed by atomic absorption spectroscopy and the content of gold and silver in the PCBs was to be found in the range of 0.009-0.017% and 0.25-0.79% by weight respectively.

  9. Removing lead from metallic mixture of waste printed circuit boards by vacuum distillation: factorial design and removal mechanism.

    PubMed

    Li, Xingang; Gao, Yujie; Ding, Hui

    2013-10-01

    The lead removal from the metallic mixture of waste printed circuit boards by vacuum distillation was optimized using experimental design, and a mathematical model was established to elucidate the removal mechanism. The variables studied in lead evaporation consisted of the chamber pressure, heating temperature, heating time, particle size and initial mass. The low-level chamber pressure was fixed at 0.1 Pa as the operation pressure. The application of two-level factorial design generated a first-order polynomial that agreed well with the data for evaporation efficiency of lead. The heating temperature and heating time exhibited significant effects on the efficiency, which was validated by means of the copper-lead mixture experiments. The optimized operating conditions within the region studied were the chamber pressure of 0.1 Pa, heating temperature of 1023 K and heating time of 120 min. After the conditions were employed to remove lead from the metallic mixture of waste printed circuit boards, the efficiency was 99.97%. The mechanism of the effects was elucidated by mathematical modeling that deals with evaporation, mass transfer and condensation, and can be applied to a wider range of metal removal by vacuum distillation.

  10. Toward environmentally-benign utilization of nonmetallic fraction of waste printed circuit boards as modifier and precursor.

    PubMed

    Hadi, Pejman; Ning, Chao; Ouyang, Weiyi; Xu, Meng; Lin, Carol S K; McKay, Gordon

    2015-01-01

    Electronic waste, including printed circuit boards, is growing at an alarming rate due to the accelerated technological progress and the shorter lifespan of the electronic equipment. In the past decades, due to the lack of proper economic and environmentally-benign recycling technologies, a major fraction of e-waste generated was either destined to landfills or incinerated with the sole intention of its disposal disregarding the toxic nature of this waste. Recently, with the increasing public awareness over their environment and health issues and with the enaction of more stringent regulations, environmentally-benign recycling has been driven to be an alternative option partially replacing the traditional eco-unfriendly disposal methods. One of the most favorable green technologies has been the mechanical separation of the metallic and nonmetallic fraction of the waste printed circuit boards. Although metallic fraction, as the most profitable component, is used to generate the revenue of the separation process, the nonmetallic fraction (NMF) has been left isolated. Herein, the recent developments in the application of NMF have been comprehensively reviewed and an eco-friendly emerging usage of NMF as a value-added material for sustainable remediation has been introduced.

  11. Recycling-oriented characterization of plastic frames and printed circuit boards from mobile phones by electronic and chemical imaging.

    PubMed

    Palmieri, Roberta; Bonifazi, Giuseppe; Serranti, Silvia

    2014-11-01

    This study characterizes the composition of plastic frames and printed circuit boards from end-of-life mobile phones. This knowledge may help define an optimal processing strategy for using these items as potential raw materials. Correct handling of such a waste is essential for its further "sustainable" recovery, especially to maximize the extraction of base, rare and precious metals, minimizing the environmental impact of the entire process chain. A combination of electronic and chemical imaging techniques was thus examined, applied and critically evaluated in order to optimize the processing, through the identification and the topological assessment of the materials of interest and their quantitative distribution. To reach this goal, end-of-life mobile phone derived wastes have been systematically characterized adopting both "traditional" (e.g. scanning electronic microscopy combined with microanalysis and Raman spectroscopy) and innovative (e.g. hyperspectral imaging in short wave infrared field) techniques, with reference to frames and printed circuit boards. Results showed as the combination of both the approaches (i.e. traditional and classical) could dramatically improve recycling strategies set up, as well as final products recovery.

  12. Process development for recovery of copper and precious metals from waste printed circuit boards with emphasize on palladium and gold leaching and precipitation.

    PubMed

    Behnamfard, Ali; Salarirad, Mohammad Mehdi; Veglio, Francesco

    2013-11-01

    A novel hydrometallurgical process was proposed for selective recovery of Cu, Ag, Au and Pd from waste printed circuit boards (PCBs). More than 99% of copper content was dissolved by using two consecutive sulfuric acid leaching steps in the presence of H2O2 as oxidizing agents. The solid residue of 2nd leaching step was treated by acidic thiourea in the presence of ferric iron as oxidizing agent and 85.76% Au and 71.36% Ag dissolution was achieved. The precipitation of Au and Ag from acidic thiourea leachate was investigated by using different amounts of sodium borohydride (SBH) as a reducing agent. The leaching of Pd and remained gold from the solid reside of 3rd leaching step was performed in NaClO-HCl-H2O2 leaching system and the effect of different parameters was investigated. The leaching of Pd and specially Au increased by increasing the NaClO concentration up to 10V% and any further increasing the NaClO concentration has a negligible effect. The leaching of Pd and Au increased by increasing the HCl concentration from 2.5 to 5M. The leaching of Pd and Au were endothermic and raising the temperature had a positive effect on leaching efficiency. The kinetics of Pd leaching was quite fast and after 30min complete leaching of Pd was achieved, while the leaching of Au need a longer contact time. The best conditions for leaching of Pd and Au in NaClO-HCl-H2O2 leaching system were determined to be 5M HCl, 1V% H2O2, 10V% NaClO at 336K for 3h with a solid/liquid ratio of 1/10. 100% of Pd and Au of what was in the chloride leachate were precipitated by using 2g/L SBH. Finally, a process flow sheet for the recovery of Cu, Ag, Au and Pd from PCB was proposed. PMID:23927928

  13. Impedance Discontinuity Reduction Between High-Speed Differential Connectors and PCB Interfaces

    NASA Technical Reports Server (NTRS)

    Navidi, Sal; Agdinaoay, Rodell; Walter, Keith

    2013-01-01

    High-speed serial communication (i.e., Gigabit Ethernet) requires differential transmission and controlled impedances. Impedance control is essential throughout cabling, connector, and circuit board construction. An impedance discontinuity arises at the interface of a high-speed quadrax and twinax connectors and the attached printed circuit board (PCB). This discontinuity usually is lower impedance since the relative dielectric constant of the board is higher (i.e., polyimide approx. = 4) than the connector (Teflon approx. = 2.25). The discontinuity can be observed in transmit or receive eye diagrams, and can reduce the effective link margin of serial data networks. High-speed serial data network transmission improvements can be made at the connector-to-board interfaces as well as improving differential via hole impedances. The impedance discontinuity was improved by 10 percent by drilling a 20-mil (approx. = 0.5-mm) hole in between the pin of a differential connector spaced 55 mils (approx. = 1.4 mm) apart as it is attached to the PCB. The effective dielectric constant of the board can be lowered by drilling holes into the board material between the differential lines in a quadrax or twinax connector attachment points. The differential impedance is inversely proportional to the square root of the relative dielectric constant. This increases the differential impedance and thus reduces the above described impedance discontinuity. The differential via hole impedance can also be increased in the same manner. This technique can be extended to multiple smaller drilled holes as well as tapered holes (i.e., big in the middle followed by smaller ones diagonally).

  14. Evolving circuits in seconds: experiments with a stand-alone board-level evolvable system

    NASA Technical Reports Server (NTRS)

    Stoica, A.; Zebulum, R. S.; Ferguson, M. I.; Keymeulen, D.; Duong, V.; Guo, X.

    2002-01-01

    The purpose of this paper is twofold: first, to illustrate a stand-alone board-level evolvable system (SABLES) and its performance, and second to illustrate some problems that occur during evolution with real hardware in the loop, or when the intention of the user is not completely reflected in the fitness function.

  15. Effect of Time and Pressure on Ultrasonic Bonding Strength of Flexible Printed Circuit Board to Glass with Nonconductive Film

    NASA Astrophysics Data System (ADS)

    Lee, Jong-Bum; Lee, Jong-Gun; Jo, Jung-Lae; Koo, Ja-Myeong; Chun, Chang-Keun; Jung, Seung-Boo

    2009-07-01

    This study investigates the feasibility of ultrasonic bonding of flexible printed circuit board (FPCB) on glass with nonconductive film (NCF). The glass substrate is sputtered with Cr as a diffusion barrier and Cu to form the electrodes, whereas two different surface finishes are employed for the FPCB: immersion Sn and electroless Ni/immersion Au (ENIG). The peel strengths of the joints are investigated with various parameters, such as bonding time and pressure. The study showed that bonding time of the joints was not related to the degree of curing of NCF, because almost the same curing degree resulted when bonded for 1 or 3 s. Furthermore, the bonding pressure on the joints is strongly related to the amplitude of vibration at the horn.

  16. Fabric circuit board-based dry electrode and its characteristics for long-term physiological signal recording.

    PubMed

    Yoo, Jerald; Yoo, Hoi-Jun

    2011-01-01

    This paper presents a dry fabric electrode and its characteristics. For long-term physiological signal monitoring, conventional wet type electrode such as an Ag/AgCl electrode may not be sufficient, because captured signal strength degrades over time as its electrolyte dehydrates. Moreover, the electrolyte may cause skin irritation over a period of time. As a complement, a dry electrode can be used. In this work, fabric-based dry electrodes are introduced. Planar-Fabric Circuit Board (P-FCB) technology enables low cost and uniform productions of such electrodes; electrical properties of the electrodes with various materials, sizes, and time are shown. Both the strengths and drawbacks of the fabric-based electrodes are also discussed.

  17. Development of nondestructive testing techniques for plated-through holes in multilayer printed circuit boards

    NASA Technical Reports Server (NTRS)

    Anthony, P. L.; Mcmurtrey, J. E.

    1971-01-01

    The development of a nondestructive test with the capability to interrogate plated-through holes as small as 0.51 millimeters inside diameter is discussed. The system can detect defects such as holes, voids, cracks, and thin spots that reduce the current carrying capability of plates-through interconnects by 20 percent or more. Efforts were directed toward the design and fabrication of magnetic circuitry mutual coupling probes and to evaluate the effectiveness of these devices for detecting in multilayer board plated-through holes.

  18. Infant phantom head circuit board for EEG head phantom and pediatric brain simulation

    NASA Astrophysics Data System (ADS)

    Almohsen, Safa

    The infant's skull differs from an adult skull because of the characteristic features of the human skull during early development. The fontanels and the conductivity of the infant skull influence surface currents, generated by neurons, which underlie electroencephalography (EEG) signals. An electric circuit was built to power a set of simulated neural sources for an infant brain activity simulator. Also, in the simulator, three phantom tissues were created using saline solution plus Agarose gel to mimic the conductivity of each layer in the head [scalp, skull brain]. The conductivity measurement was accomplished by two different techniques: using the four points' measurement technique, and a conductivity meter. Test results showed that the optimized phantom tissues had appropriate conductivities to simulate each tissue layer to fabricate a physical head phantom. In this case, the best results should be achieved by testing the electrical neural circuit with the sample physical model to generate simulated EEG data and use that to solve both the forward and the inverse problems for the purpose of localizing the neural sources in the head phantom.

  19. PCB storage requirements

    SciTech Connect

    1994-12-01

    Polychlorinated biphenyls (PCBs) are a class of organic chemicals that had become widely used in industrial applications due to their practical physical and chemical properties. Historical uses of PCBs include dielectric fluids (used in utility transformers, capacitors, etc.), hydraulic fluids, and other applications requiring stable, fire-retardant materials. Due to findings that PCBs may cause adverse health effects and due to their persistence and accumulation in the environment, the Toxic Substances Control Act (TSCA), enacted on october 11, 1976, banned the manufacture of PCBs after 1978 [Section 6(e)]. The first PCB regulations, promulgated at 40 CFR Part 761, were finalized on February 17, 1978. These PCB regulations include requirements specifying disposal methods and marking (labeling) procedures, and controlling PCB use. To assist the Department of Energy (DOE) in its efforts to comply with the TSCA statute and implementing regulations, the Office of Environmental Guidance has prepared the document ``Guidance on the Management of Polychlorinated Biphenyls (PCBs).`` That document explains the requirements specified in the statute and regulations for managing PCBs, including PCB use, storage, transport, and disposal. The requirements specified at 40 CFR Part 761.65 require most PCB wastes to be stored in a facility that meets the specifications of that section. Additionally, the regulations include rules concerning time limits for PCBs and PCB Items in storage, rules concerning leaking electrical equipment, and rules concerning types of containers used to store PCBs and PCB Items. This Information Brief supplements the PCB guidance document by responding to common questions concerning storage requirements for PCBs. It is one of a series of Information Briefs pertinent to PCB management issues.

  20. Determination of the potential gold electrowinning from an ammoniacal thiosulphate solution applied to recycling of printed circuit board scraps.

    PubMed

    Kasper, Angela C; Carrillo Abad, Jordi; García Gabaldón, Montserrat; Veit, Hugo M; Pérez Herranz, Valentín

    2016-01-01

    The use of electrochemical techniques in the selective recovery of gold from a solution containing thiosulphate, ammonia, and copper, obtained from the leaching of printed circuit boards from mobile phones using ammoniacal thiosulphate, are shown in this work. First, cyclic voltammetry tests were performed to determine the potential of electrodeposition of gold and copper, and then, electrowinning tests at different potentials for checking the rates of recovery of these metals were performed. The results of the cyclic voltammetry show that copper deposition occurs at potentials more negative than -600 mV (Ag/AgCl), whereas the gold deposition can be performed at potentials more positives than -600 mV (Ag/AgCl). The results of electrowinning show that 99% of the gold present in solutions containing thiosulphate and copper can be selectively recovered in a potential range between -400 mV (vs Ag/AgCl) and -500 mV (vs Ag/AgCl). Furthermore, 99% of copper can be recovered in potentials more negative than -700 mV (vs Ag/AgCl). PMID:26437680

  1. An Overview of Surface Finishes and Their Role in Printed Circuit Board Solderability and Solder Joint Performance

    SciTech Connect

    Vianco, P.T.

    1998-10-15

    A overview has been presented on the topic of alternative surface finishes for package I/Os and circuit board features. Aspects of processability and solder joint reliability were described for the following coatings: baseline hot-dipped, plated, and plated-and-fused 100Sn and Sn-Pb coatings; Ni/Au; Pd, Ni/Pd, and Ni/Pd/Au finishes; and the recently marketed immersion Ag coatings. The Ni/Au coatings appear to provide the all-around best option in terms of solderability protection and wire bondability. Nickel/Pal ftishes offer a slightly reduced level of performance in these areas that is most likely due to variable Pd surface conditions. It is necessmy to minimize dissolved Au or Pd contents in the solder material to prevent solder joint embrittlement. Ancillary aspects that included thickness measurement techniques; the importance of finish compatibility with conformal coatings and conductive adhesives; and the need for alternative finishes for the processing of non-Pb bearing solders were discussed.

  2. Direct extraction of palladium and silver from waste printed circuit boards powder by supercritical fluids oxidation-extraction process.

    PubMed

    Liu, Kang; Zhang, Zhiyuan; Zhang, Fu-Shen

    2016-11-15

    The current study was carried out to develop an environmental benign process for direct recovery of palladium (Pd) and silver (Ag) from waste printed circuit boards (PCBs) powder. The process ingeniously combined supercritical water oxidation (SCWO) and supercritical carbon dioxide (Sc-CO2) extraction techniques. SCWO treatment could effectively enrich Pd and Ag by degrading non-metallic component, and a precious metal concentrate (PMC) could be obtained, in which the enrichment factors of Pd and Ag reached 5.3 and 4.8, respectively. In the second stage, more than 93.7% Pd and 96.4% Ag could be extracted from PMC by Sc-CO2 modified with acetone and KI-I2 under optimum conditions. Mechanism study indicated that Pd and Ag extraction by Sc-CO2 was a complicated physiochemical process, involving oxidation, complexation, anion exchange, mass transfer and migration approaches. Accordingly, this study established a benign and effective process for selective recovery of dispersal precious metals from waste materials. PMID:27427888

  3. Simultaneous recovery of Ni and Cu from computer-printed circuit boards using bioleaching: statistical evaluation and optimization.

    PubMed

    Arshadi, M; Mousavi, S M

    2014-12-01

    Computer printed circuit boards (CPCBs) have a rich metal content and are produced in high volume, making them an important component of electronic waste. The present study used a pure culture of Acidithiobacillus ferrooxidans to leach Cu and Ni from CPCBs waste. The adaptation phase began at 1g/l CPCBs powder with 10% inoculation and final pulp density was reached at 20g/l after about 80d. Four effective factors including initial pH, particle size, pulp density, and initial Fe(3+) concentration were optimized to achieve maximum simultaneous recovery of Cu and Ni. Their interactions were also identified using central composite design in response surface methodology. The suggested optimal conditions were initial pH 3, initial Fe(3+) 8.4g/l, pulp density 20g/l and particle size 95μm. Nearly 100% of Cu and Ni were simultaneously recovered under optimum conditions. Finally, bacterial growth characteristics versus time at optimum conditions were plotted.

  4. Recovery of copper and lead from waste printed circuit boards by supercritical water oxidation combined with electrokinetic process.

    PubMed

    Xiu, Fu-Rong; Zhang, Fu-Shen

    2009-06-15

    An effective and benign process for copper and lead recovery from waste printed circuit boards (PCBs) was developed. In the process, the PCBs was pre-treated in supercritical water, then subjected to electrokinetic (EK) process. Experimental results showed that supercritical water oxidation (SCWO) process was strong enough to decompose the organic compounds of PCBs, and XRD spectra indicated that copper and lead were oxidized into CuO, Cu(2)O and beta-PbO(2) in the process. The optimum SCWO treatment conditions were 60 min, 713 K, 30 MPa, and EK treatment time, constant current density were 11h, 20 mA cm(-2), respectively. The recovery percentages of copper and lead under optimum SCWO+EK treatment conditions were around 84.2% and 89.4%, respectively. In the optimized EK treatment, 74% of Cu was recovered as a deposit on the cathode with a purity of 97.6%, while Pb was recovered as concentrated solutions in either anode (23.1%) or cathode (66.3%) compartments but little was deposited on the electrodes. It is believed that the process is effective and practical for Cu and Pb recovery from waste electric and electronic equipments.

  5. Real-time monitoring system for improving corona electrostatic separation in the process of recovering waste printed circuit boards.

    PubMed

    Li, Jia; Zhou, Quan; Xu, Zhenming

    2014-12-01

    Although corona electrostatic separation is successfully used in recycling waste printed circuit boards in industrial applications, there are problems that cannot be resolved completely, such as nonmetal particle aggregation and spark discharge. Both of these problems damage the process of separation and are not easy to identify during the process of separation in industrial applications. This paper provides a systematic study on a real-time monitoring system. Weight monitoring systems were established to continuously monitor the separation process. A Virtual Instrumentation program written by LabVIEW was utilized to sample and analyse the mass increment of the middling product. It includes four modules: historical data storage, steady-state analysis, data computing and alarm. Three kinds of operating conditions were used to verify the applicability of the monitoring system. It was found that the system achieved the goal of monitoring during the separation process and realized the function of real-time analysis of the received data. The system also gave comprehensible feedback on the accidents of material blockages in the feed inlet and high-voltage spark discharge. With the warning function of the alarm system, the whole monitoring system could save the human cost and help the new technology to be more easily applied in industry.

  6. Recovery of metals from waste printed circuit boards by supercritical water pre-treatment combined with acid leaching process.

    PubMed

    Xiu, Fu-Rong; Qi, Yingying; Zhang, Fu-Shen

    2013-05-01

    Waste printed circuit boards (PCBs) contain a large number of metals such as Cu, Sn, Pb, Cd, Cr, Zn, and Mn. In this work, an efficient and environmentally friendly process for metals recovery from waste PCBs by supercritical water (SCW) pre-treatment combined with acid leaching was developed. In the proposed process, waste PCBs were pre-treated by SCW, then the separated solid phase product with concentrated metals was subjected to an acid leaching process for metals recovery. The effect of SCW pre-treatment on the recovery of different metals from waste PCBs was investigated. Two methods of SCW pre-treatment were studied: supercritical water oxidation (SCWO) and supercritical water depolymerization (SCWD). Experimental results indicated that SCWO and SCWD pre-treatment had significant effect on the recovery of different metals. SCWO pre-treatment was highly efficient for enhancing the recovery of Cu and Pb, and the recovery efficiency increased significantly with increasing pre-treatment temperature. The recovery efficiency of Cu and Pb for SCWO pre-treatment at 420°C was 99.8% and 80%, respectively, whereas most of the Sn and Cr were immobilized in the residue. The recovery of all studied metals was enhanced by SCWD pre-treatment and increased along with pre-treatment temperature. Up to 90% of Sn, Zn, Cr, Cd, and Mn could be recovered for SCWD pre-treatment at 440°C.

  7. Direct extraction of palladium and silver from waste printed circuit boards powder by supercritical fluids oxidation-extraction process.

    PubMed

    Liu, Kang; Zhang, Zhiyuan; Zhang, Fu-Shen

    2016-11-15

    The current study was carried out to develop an environmental benign process for direct recovery of palladium (Pd) and silver (Ag) from waste printed circuit boards (PCBs) powder. The process ingeniously combined supercritical water oxidation (SCWO) and supercritical carbon dioxide (Sc-CO2) extraction techniques. SCWO treatment could effectively enrich Pd and Ag by degrading non-metallic component, and a precious metal concentrate (PMC) could be obtained, in which the enrichment factors of Pd and Ag reached 5.3 and 4.8, respectively. In the second stage, more than 93.7% Pd and 96.4% Ag could be extracted from PMC by Sc-CO2 modified with acetone and KI-I2 under optimum conditions. Mechanism study indicated that Pd and Ag extraction by Sc-CO2 was a complicated physiochemical process, involving oxidation, complexation, anion exchange, mass transfer and migration approaches. Accordingly, this study established a benign and effective process for selective recovery of dispersal precious metals from waste materials.

  8. Production and characterization of polypropylene composites filled with glass fibre recycled from pyrolysed waste printed circuit boards.

    PubMed

    Li, Shenyong; Sun, Shuiyu; Liang, Haifeng; Zhong, Sheng; Yang, Fan

    2014-01-01

    Waste printed circuit boards (WPCBs) are composed of nearly 70% non-metals, which are generally recycled as low-value filling materials or even directly dumped in landfills. In this study, polypropylene (PP) composites reinforced by recycled pure glass fibres (RGF) from pyrolysed WPCBs were successfully produced. The manufacturing process, mechanical properties and thermal behaviour of the composites were investigated. The results showed that the appropriate addition of RGF in the composites can significantly improve the mechanical properties and thermal behaviour. When the added content of RGF was 30%, the maximum increment of tensile strength, impact strength, flexural strength and flexural modulus of the glass fibre (GF)/PP composites are 25.93%, 41.38%, 31.16% and 68.42%, respectively, and the vicat softening temperature could rise by 4.6°C. Furthermore, leaching of the GF/PP composites was also investigated. The GF/PP composites exhibited high performance and non-toxicity, offering a promising method to recycle RGF from pyrolysed WPCBs with high-value applications. PMID:25176309

  9. Investigation of the influence of inert and oxidizing atmospheres on the efficiency of decomposition of waste printed circuit boards (WPCBs)

    NASA Astrophysics Data System (ADS)

    Kumari, Anjan; Jha, Manis Kumar; Singh, Rajendra Prasad; Ranganathan, S.

    2016-08-01

    Thermo-gravimetry was used for studying the influence of the furnace atmosphere during the pyrolysis waste circuit boards (WPCBs). Pyrolysis in argon atmosphere resulted in a continuous decrease of mass of the sample. Rapid mass loss occurred at about 573 K. Heating the WPCBs in air and oxygen atmospheres resulted in an increase in the mass of the sample in the early stages until rapid mass loss occurred at about 573 K. When pyrolysis of larger sample mass (about 5 g each) was carried out in tubular furnace, about 20.43 % mass loss was observed during the pyrolysis of WPCBs in a flowing stream of argon at 548 K during a period of 4 min. On the other hand, a maximum of about 2.26 % mass loss was recorded when the WPCBs were heated at about 600 K for the same time interval in the still air. The mass transfer during the pyrolysis of WPCBs in flowing stream of inert gas was also modeled. It is found that controlling the flow rate of inert gas and the geometry of the equipment can enhance the rate of mass loss significantly.

  10. Determination of the potential gold electrowinning from an ammoniacal thiosulphate solution applied to recycling of printed circuit board scraps.

    PubMed

    Kasper, Angela C; Carrillo Abad, Jordi; García Gabaldón, Montserrat; Veit, Hugo M; Pérez Herranz, Valentín

    2016-01-01

    The use of electrochemical techniques in the selective recovery of gold from a solution containing thiosulphate, ammonia, and copper, obtained from the leaching of printed circuit boards from mobile phones using ammoniacal thiosulphate, are shown in this work. First, cyclic voltammetry tests were performed to determine the potential of electrodeposition of gold and copper, and then, electrowinning tests at different potentials for checking the rates of recovery of these metals were performed. The results of the cyclic voltammetry show that copper deposition occurs at potentials more negative than -600 mV (Ag/AgCl), whereas the gold deposition can be performed at potentials more positives than -600 mV (Ag/AgCl). The results of electrowinning show that 99% of the gold present in solutions containing thiosulphate and copper can be selectively recovered in a potential range between -400 mV (vs Ag/AgCl) and -500 mV (vs Ag/AgCl). Furthermore, 99% of copper can be recovered in potentials more negative than -700 mV (vs Ag/AgCl).

  11. Real-time monitoring system for improving corona electrostatic separation in the process of recovering waste printed circuit boards.

    PubMed

    Li, Jia; Zhou, Quan; Xu, Zhenming

    2014-12-01

    Although corona electrostatic separation is successfully used in recycling waste printed circuit boards in industrial applications, there are problems that cannot be resolved completely, such as nonmetal particle aggregation and spark discharge. Both of these problems damage the process of separation and are not easy to identify during the process of separation in industrial applications. This paper provides a systematic study on a real-time monitoring system. Weight monitoring systems were established to continuously monitor the separation process. A Virtual Instrumentation program written by LabVIEW was utilized to sample and analyse the mass increment of the middling product. It includes four modules: historical data storage, steady-state analysis, data computing and alarm. Three kinds of operating conditions were used to verify the applicability of the monitoring system. It was found that the system achieved the goal of monitoring during the separation process and realized the function of real-time analysis of the received data. The system also gave comprehensible feedback on the accidents of material blockages in the feed inlet and high-voltage spark discharge. With the warning function of the alarm system, the whole monitoring system could save the human cost and help the new technology to be more easily applied in industry. PMID:25395159

  12. Recycling of organic materials and solder from waste printed circuit boards by vacuum pyrolysis-centrifugation coupling technology.

    PubMed

    Zhou, Yihui; Wu, WenBiao; Qiu, Keqiang

    2011-12-01

    Here, we focused on the recycling of waste printed circuit boards (WPCBs) using vacuum pyrolysis-centrifugation coupling technology (VPCT) aiming to obtain valuable feedstock and resolve environmental pollution. The two types of WPCBs were pyrolysed at 600°C for 30 min under vacuum condition. During the pyrolysis process, the solder of WPCBs was separated and recovered when the temperature range was 400-600°C, and the rotating drum was rotated at 1000 rpm for 10 min. The type-A of WPCBs pyrolysed to form an average of 67.91 wt.% residue, 27.84 wt.% oil, and 4.25 wt.% gas; and pyrolysis of the type-B of WPCBs led to an average mass balance of 72.22 wt.% residue, 21.57 wt.% oil, and 6.21 wt.% gas. The GC-MS and FT-IR analyses showed that the two pyrolysis oils consisted mainly of phenols and substituted phenols. The pyrolysis oil can be used for fuel or chemical feedstock for further processing. The recovered solder can be recycled directly and it can also be a good resource of lead and tin for refining. The pyrolysis residues contained various metals, glass fibers and other inorganic materials, which could be recovered after further treatment. The pyrolysis gases consisted mainly of CO, CO(2), CH(4), and H(2), which could be collected and recycled. PMID:21840196

  13. An advanced study on the hydrometallurgical processing of waste computer printed circuit boards to extract their valuable content of metals.

    PubMed

    Birloaga, Ionela; Coman, Vasile; Kopacek, Bernd; Vegliò, Francesco

    2014-12-01

    This study refers to two chemical leaching systems for the base and precious metals extraction from waste printed circuit boards (WPCBs); sulfuric acid with hydrogen peroxide have been used for the first group of metals, meantime thiourea with the ferric ion in sulfuric acid medium were employed for the second one. The cementation process with zinc, copper and iron metal powders was attempted for solutions purification. The effects of hydrogen peroxide volume in rapport with sulfuric acid concentration and temperature were evaluated for oxidative leaching process. 2M H2SO4 (98% w/v), 5% H2O2, 25 °C, 1/10 S/L ratio and 200 rpm were founded as optimal conditions for Cu extraction. Thiourea acid leaching process, performed on the solid filtrate obtained after three oxidative leaching steps, was carried out with 20 g/L of CS(NH2)2, 6g/L of Fe(3+), 0.5M H2SO4, The cross-leaching method was applied by reusing of thiourea liquid suspension and immersing 5 g/L of this reagent for each other experiment material of leaching. This procedure has lead to the doubling and, respectively, tripling, of gold and silver concentrations into solution. These results reveal a very efficient, promising and environmental friendly method for WPCBs processing.

  14. Application of vacuum metallurgy to separate pure metal from mixed metallic particles of crushed waste printed circuit board scraps.

    PubMed

    Zhan, Lu; Xu, Zhenming

    2008-10-15

    The principle of separating pure metal from mixed metallic particles (MMPs) byvacuum metallurgy is that the vapor pressures of various metals at the same temperature are different As a result, the metal with high vapor pressure and low boiling point can be separated from the mixed metals through distillation or sublimation, and then it can be recycled through condensation under a certain condition. The vacuum metallurgy separation (VMS) of MMPs of crushed waste printed circuit boards (WPCBs) has been studied in this paper. Theoretical analyses show that the MMPs (copper, zinc, bismuth, lead, and indium, for example) can be separated by vacuum metallurgy. The copper particles (0.15-0.20 mm) and zinc particles (<0.30 mm) were chosen to simulate the MMPs of crushed WPCBs. Experimental results show that the separated efficiency of zinc in the copper-rich particles achieves 96.19 wt % when the vacuum pressure is 0.01-0.10 Pa, the heating temperature is 1123 K, and the heating time is 105 min. Under this operation condition, the separated efficiency of zinc in the copper-rich particles from crushed WPCBs achieves 97.00 wt % and the copper purity increases from 90.68 to 99.84 wt %.

  15. A novel reutilization method for waste printed circuit boards as flame retardant and smoke suppressant for poly (vinyl chloride).

    PubMed

    Xiu, Fu-Rong; Weng, Huiwei; Qi, Yingying; Yu, Gending; Zhang, Zhigang; Zhang, Fu-Shen

    2016-09-01

    In this study, a novel reutilization method for waste printed circuit boards (PCBs) as flame retardant and smoke suppressant for poly (vinyl chloride) (PVC) was successfully testified. A supercritical water oxidation (SCWO) process was applied to treat waste PCBs before they could be used as flame retardants of PVC. The results indicated that SCWO conditions had a significant effect on the flame retarding and smoke suppressing properties of waste PCBs for PVC. Cu2O, CuO, and SnO2 were the main active ingredients in waste PCBs-derived flame retardants. A conversion of Cu elements (Cu(0)→Cu(+)→Cu(2+)) during SCWO process with the increase of reaction temperature was found to be the key influence factor for the flame retarding properties of SCWO-treated PCBs. The experiment results also showed that there was a synergistic effect of flame retardancy between Cu(+) and Cu(2+). After the optimized SCWO treatment, SCWO-treated PCBs significantly improved the flame retardancy and smoke suppression of PVC. Limiting oxygen index (LOI) and char yield (CY) increased with increasing SCWO-treated PCBs content in PVC, while smoke density rating (SDR) and maximum smoke density (MSD) decreased markedly. The mechanical properties of PVC samples were influenced in different degree by adding different content SCWO-treated PCBs. PMID:27179704

  16. Performance and thermal behavior of wood plastic composite produced by nonmetals of pulverized waste printed circuit boards.

    PubMed

    Guo, Jie; Tang, Yinen; Xu, Zhenming

    2010-07-15

    A new kind of wood plastic composite (WPC) was produced by compounding nonmetals from waste printed circuit boards (PCBs), recycled high-density polyethylene (HDPE), wood flour and other additives. The blended granules were then extruded to profile WPC products by a conical counter-rotating twin-screw extruder. The results showed that the addition of nonmetals in WPC improved the flexural strength and tensile strength and reduced screw withdrawal strength. When the added content of nonmetals was 40%, the flexural strength of WPC was 23.4 MPa, tensile strength was 9.6 MPa, impact strength was 3.03 J/m(2) and screw withdrawal strength was 1755 N. Dimensional stability and fourier transform infrared spectroscopy (FTIR) of WPC panels were also investigated. Furthermore, thermogravimetric analysis showed that thermal degradation of WPC mainly included two steps. The first step was the decomposition of wood flour and nonmetals from 260 to 380 degrees C, and the second step was the decomposition of HDPE from 440 to 500 degrees C. The performance and thermal behavior of WPC produced by nonmetals from PCBs achieves the standard of WPC. It offers a novel method to treat nonmetals from PCBs.

  17. Recycling of organic materials and solder from waste printed circuit boards by vacuum pyrolysis-centrifugation coupling technology.

    PubMed

    Zhou, Yihui; Wu, WenBiao; Qiu, Keqiang

    2011-12-01

    Here, we focused on the recycling of waste printed circuit boards (WPCBs) using vacuum pyrolysis-centrifugation coupling technology (VPCT) aiming to obtain valuable feedstock and resolve environmental pollution. The two types of WPCBs were pyrolysed at 600°C for 30 min under vacuum condition. During the pyrolysis process, the solder of WPCBs was separated and recovered when the temperature range was 400-600°C, and the rotating drum was rotated at 1000 rpm for 10 min. The type-A of WPCBs pyrolysed to form an average of 67.91 wt.% residue, 27.84 wt.% oil, and 4.25 wt.% gas; and pyrolysis of the type-B of WPCBs led to an average mass balance of 72.22 wt.% residue, 21.57 wt.% oil, and 6.21 wt.% gas. The GC-MS and FT-IR analyses showed that the two pyrolysis oils consisted mainly of phenols and substituted phenols. The pyrolysis oil can be used for fuel or chemical feedstock for further processing. The recovered solder can be recycled directly and it can also be a good resource of lead and tin for refining. The pyrolysis residues contained various metals, glass fibers and other inorganic materials, which could be recovered after further treatment. The pyrolysis gases consisted mainly of CO, CO(2), CH(4), and H(2), which could be collected and recycled.

  18. A long-term static immersion experiment on the leaching behavior of heavy metals from waste printed circuit boards.

    PubMed

    Zhao, Guo-Hua; Luo, Xing-Zhang; Chen, Gui; Zhao, Yong-Jun

    2014-08-01

    Printed circuit boards (PCBs) are the main components of electrical and electronic equipment (EEE). Waste PCBs contain several kinds of heavy metals, including Cu, Pb and Zn. We characterize the leaching of heavy metals (Cu, Pb, Zn and Ni) from waste PCBs in a pH range of 3.0 to 5.6 using a novel approach based on batch pH-static leaching experiments in this work. The results indicate that the leaching behavior of Cu, Pb, Zn and Ni is strongly dependent on pH. Leaching behavior also varies with different pH values and leaching times. The maximum concentrations of Cu, Pb, Zn and Ni in leachate from waste PCBs were 335.00, 17.57, 2.40 and 2.33 mg L(-1), respectively. The highest Pb, Ni, and Cu concentrations leached significantly exceeded the European Union waste-acceptance limit values with respect to inert waste landfills. The leaching of metals follows the shrinking core model with surface reaction control.

  19. A novel reutilization method for waste printed circuit boards as flame retardant and smoke suppressant for poly (vinyl chloride).

    PubMed

    Xiu, Fu-Rong; Weng, Huiwei; Qi, Yingying; Yu, Gending; Zhang, Zhigang; Zhang, Fu-Shen

    2016-09-01

    In this study, a novel reutilization method for waste printed circuit boards (PCBs) as flame retardant and smoke suppressant for poly (vinyl chloride) (PVC) was successfully testified. A supercritical water oxidation (SCWO) process was applied to treat waste PCBs before they could be used as flame retardants of PVC. The results indicated that SCWO conditions had a significant effect on the flame retarding and smoke suppressing properties of waste PCBs for PVC. Cu2O, CuO, and SnO2 were the main active ingredients in waste PCBs-derived flame retardants. A conversion of Cu elements (Cu(0)→Cu(+)→Cu(2+)) during SCWO process with the increase of reaction temperature was found to be the key influence factor for the flame retarding properties of SCWO-treated PCBs. The experiment results also showed that there was a synergistic effect of flame retardancy between Cu(+) and Cu(2+). After the optimized SCWO treatment, SCWO-treated PCBs significantly improved the flame retardancy and smoke suppression of PVC. Limiting oxygen index (LOI) and char yield (CY) increased with increasing SCWO-treated PCBs content in PVC, while smoke density rating (SDR) and maximum smoke density (MSD) decreased markedly. The mechanical properties of PVC samples were influenced in different degree by adding different content SCWO-treated PCBs.

  20. Novel Application of Glass Fibers Recovered From Waste Printed Circuit Boards as Sound and Thermal Insulation Material

    NASA Astrophysics Data System (ADS)

    Sun, Zhixing; Shen, Zhigang; Ma, Shulin; Zhang, Xiaojing

    2013-10-01

    The aim of this study is to investigate the feasibility of using glass fibers, a recycled material from waste printed circuit boards (WPCB), as sound absorption and thermal insulation material. Glass fibers were obtained through a fluidized-bed recycling process. Acoustic properties of the recovered glass fibers (RGF) were measured and compared with some commercial sound absorbing materials, such as expanded perlite (EP), expanded vermiculite (EV), and commercial glass fiber. Results show that RGF have good sound absorption ability over the whole tested frequency range (100-6400 Hz). The average sound absorption coefficient of RGF is 0.86, which is prior to those of EP (0.81) and EV (0.73). Noise reduction coefficient analysis indicates that the absorption ability of RGF can meet the requirement of II rating for sound absorbing material according to national standard. The thermal insulation results show that RGF has a fair low thermal conductivity (0.046 W/m K), which is comparable to those of some insulation materials (i.e., EV, EP, and rock wool). Besides, an empirical dependence of thermal conductivity on material temperature was determined for RGF. All the results showed that the reuse of RGF for sound and thermal insulation material provided a promising way for recycling WPCB and obtaining high beneficial products.

  1. PCB recordkeeping and reporting

    SciTech Connect

    1994-12-01

    Polychlorinated biphenyls (PCBs) are a class of organic chemicals that had become widely used in industrial applications due to their practical physical and chemical properties. Historical uses of PCBs include dielectric fluids (used in utility transformers, capacitors, etc.), hydraulic fluids, and other applications requiring stable, fire-retardant materials. Due to findings that PCBs may cause adverse health effects and due to their persistence and accumulation in the environment, the Toxic Substances Control Act (TSCA), enacted on October 11, 1976, banned the manufacture of PCBs after 1978 [Section 6(e)]. The first PCB regulations, promulgated at 40 CFR Part 761, were finalized on February 17, 1978. These PCB regulations include requirements specifying disposal methods and marking (labeling) procedures, and controlling PCB use. To assist the Department of Energy (DOE) in its efforts to comply with the TSCA statute and implementing regulations, the Office of Environmental Guidance has prepared the document ``Guidance on the Management of Polychlorinated Biphenyls (PCBs).`` That document explains the requirements specified in the statute and regulations for managing PCBs including PCB use, storage, transport, and disposal. All generators, disposers, and storers of PCB waste must comply with the recordkeeping and reporting requirements found at 40 CFR 761.180. The regulations include directions for writing and maintaining annual records and annual document logs and for preparing annual reports, exception reports, manifest discrepancy reports, and unmanifested waste reports. This Information Brief supplements the PCB guidance document by responding to common questions concerning recordkeeping and reporting requirements for PCBs. It is one of a series of Information Briefs pertinent to PCB management issues.

  2. PCB biohalogenation under anaerobic conditions

    SciTech Connect

    Gauger, W.K.; McCue, J.J.

    1990-01-01

    The Institute of Gas Technology (IGT) is conducting research on the biodehalogenation of polychlorinated biphenyls (PCB's) under anoxic conditions. Reductive dechlorination of PCB's has been observed in treatments inoculated with Hudson River sediments. Differences in gas chromatograms between time 0 and 4-month incubations indicate pattern shifts of the PCB homologs that constitute Aroclor 1242 from highly chlorinated to lesser chlorinated congeners. Changes in distribution patterns of PCB homologs were also evident. PCB homologs containing 4, 5, 6, and 7 chlorine atoms were shown to decrease over the incubation period, whereas PCB homologs containing 2 and 3 chlorines increased in concentration. 10 refs., 5 figs., 1 tab.

  3. An assessment of alternatives for replacing Freon 113 in bench type electrical circuit board cleaning at Fermi National Accelerator Laboratory

    SciTech Connect

    Isakson, K.; Vessell, A.L.

    1994-07-01

    Fermilab is presently phasing out all solvents containing Freon-113 (CFC-113) as part of the continuing Waste Minimization Program. These solvents are used primarily in cleaning the flux off of electronic circuit boards after soldering, specifically in bench type work. Title VI of the Clean Air Act mandates a production phase-out for ozone depleting substances, like CFC-113, by the year 2000. Our study addresses this issue by evaluating and choosing alternative non-CFC solvents to replace the CFC-1 13 solvents at Fermilab. Several potential non-CFC cleaning solvents were tested. The evaluation took place in three parts: controlled experimental evaluation, chemical composition evaluation, and employee performed evaluation. First, we performed a controlled nine-step procedure with the potential solvents where each was evaluated in categories such as cleaning effectiveness, odor, residue, type of output and drying time. Next, we listed the chemical composition of each solvent. We noted which solvents contained hydrochlorofluorocarbons because they are targeted for phase-out in the future and will be recognized as interim solutions only. Finally, after preliminary testing, five solvents were chosen as the best options. These solvents were sent to be tested by Fermilab employees who use such materials. Their opinions are valuable not only because they are knowledgeable in this field, but also because they will be using the solvents chosen to replace the CFC-113 solvents. The results favored two ``best alternatives``: Safezone Solvent Flux Remover by Miller-Stephenson and E-Series CFC Free Flux-Off 2000 by Chemtech. Another possible solution also pursued is the no-clean solder option. In our study, we were not able to thoroughly investigate the many types of no-clean solders because of time and financial constraints. The testing that was done, however, showed that no-clean solder was a viable alternative in many cases.

  4. Temporal and spectral analysis of laser induced plasma in the ablation process of flexible printed circuit board

    NASA Astrophysics Data System (ADS)

    Ryoo, Hoon C.; Kim, Seok; Hahn, Jae W.

    2008-02-01

    Flexible printed circuit board (FPCB), consisting of copper sheets laminated onto non conductive film substrates with multiple structures, are core elements in electronics with their flexibility and capability of high density 3 dimensional wiring characteristics. In laser applied FPCB processing, a better understanding of the ablation mechanism leads to precision control of the depth processing especially by monitoring of the material transition layer. For this purpose, here we investigate the temporal and spectral behavior of the plasma plum generated on the single sided structure of FPCB using the technique of laser induced breakdown spectroscopy (LIBS). Using KrF excimer laser, the characteristic spectral emission lines of C II swan band at the wavelength of 516.5 nm and neutral copper at the wavelength range from 510 nm to 522 nm are acquired under ambient pressure in the ablation process of polyimide film and copper coated layer respectively. From a time delay from 50 ns to 4.05 μs from the beginning of the laser pulse, the temporal profiles of the spectral intensity are obtained in steps of 200 ns, which have a tendency of exponential decrease on both C II and neutral copper. In particular, we concentrate our attention on the temporal intensity behavior of the Bremsstrahlung continuum emission that decides the proper set of detection time window, by which the monitoring sensitivity of LIBS is determined. Finally, using the information of the temporal analysis for each molecular, atomic, and continuum emission, the transition layer between polyimide and copper film is distinguished by their characteristic peak information.

  5. Characterization and mechanical separation of metals from computer Printed Circuit Boards (PCBs) based on mineral processing methods.

    PubMed

    Sarvar, Mojtaba; Salarirad, Mohammad Mehdi; Shabani, Mohammad Amin

    2015-11-01

    In this paper, a novel mechanical process is proposed for enriching metal content of computer Printed Circuit Boards (PCBs). The PCBs are crushed and divided into three different size fractions namely: -0.59, +0.59 to 1.68 and +1.68 mm. Wet jigging and froth flotation methods are selected for metal enrichment. The coarse size fraction (+1.68 mm) is processed by jigging. The plastic free product is grinded and screened. The oversized product is separated as the first concentrate. It was rich of metal because the grinding process was selective. The undersized product is processed by froth flotation. Based on the obtained results, the middle size fraction (+0.59 to 1.68 mm) and the small size fraction (-0.59 mm) are processed by wet jigging and froth flotation respectively. The wet jigging process is optimized by investigating the effect of pulsation frequency and water flow rate. The results of examining the effect of particle size, solid to liquid ratio, conditioning time and using apolar collector showed that collectorless flotation is a promising method for separating nonmetals of PCBs. 95.6%, 97.5% and 85% of metal content of coarse size, middle size and small size fraction are recovered. The grades of obtained concentrates were 63.3%, 92.5% and 75% respectively. The total recovery is calculated as 95.64% and the grade of the final concentrate was 71.26%. Determining the grade of copper and gold in the final product reveals that 4.95% of copper and 24.46% of gold are lost during the concentration. The major part of the lost gold is accumulated in froth flotation tail.

  6. Copper sludge from printed circuit board production/recycling for ceramic materials: a quantitative analysis of copper transformation and immobilization.

    PubMed

    Tang, Yuanyuan; Lee, Po-Heng; Shih, Kaimin

    2013-08-01

    The fast development of electronic industries and stringent requirement of recycling waste electronics have produced a large amount of metal-containing waste sludge. This study developed a waste-to-resource strategy to beneficially use such metal-containing sludge from the production and recycling processes of printed circuit board (PCBs). To observe the metal incorporation mechanisms and phase transformation processes, mixtures of copper industrial waste sludge and kaolinite-based materials (kaolinite and mullite) were fired between 650 and 1250 °C for 3 h. The different copper-hosting phases were identified by powder X-ray diffraction (XRD) in the sintered products, and CuAl2O4 was found to be the predominant hosting phase throughout the reactions, regardless of the strong reduction potential of copper expected at high temperatures. The experimental results indicated that CuAl2O4 was generated more easily and in larger quantities at low-temperature processing when using the kaolinite precursor. Maximum copper transformations reached 86% and 97% for kaolinite and mullite systems, respectively, when sintering at 1000 °C. To monitor the stabilization effect after thermal process, prolonged leaching tests were carried out using acetic acid with an initial pH value of 2.9 to leach the sintered products for 20 days. The results demonstrated the decrease of copper leachability with the formation of CuAl2O4, despite different sintering behavior in kaolinite and mullite systems. This study clearly indicates spinel formation as the most crucial metal stabilization mechanism when sintering copper sludge with aluminosilicate materials, and suggests a promising and reliable technique for reusing metal-containing sludge as ceramic materials.

  7. Leaching behavior of copper from waste printed circuit boards with Brønsted acidic ionic liquid

    SciTech Connect

    Huang, Jinxiu; Chen, Mengjun Chen, Haiyan; Chen, Shu; Sun, Quan

    2014-02-15

    Highlights: • A Brønsted acidic ILs was used to leach Cu from WPCBs for the first time. • The particle size of WPCBs has significant influence on Cu leaching rate. • Cu leaching rate was higher than 99% under the optimum leaching conditions. • The leaching process can be modeled with shrinking core model, and the E{sub a} was 25.36 kJ/mol. - Abstract: In this work, a Brønsted acidic ionic liquid, 1-butyl-3-methyl-imidazolium hydrogen sulfate ([bmim]HSO{sub 4}), was used to leach copper from waste printed circuit boards (WPCBs, mounted with electronic components) for the first time, and the leaching behavior of copper was discussed in detail. The results showed that after the pre-treatment, the metal distributions were different with the particle size: Cu, Zn and Al increased with the increasing particle size; while Ni, Sn and Pb were in the contrary. And the particle size has significant influence on copper leaching rate. Copper leaching rate was higher than 99%, almost 100%, when 1 g WPCBs powder was leached under the optimum conditions: particle size of 0.1–0.25 mm, 25 mL 80% (v/v) ionic liquid, 10 mL 30% hydrogen peroxide, solid/liquid ratio of 1/25, 70 °C and 2 h. Copper leaching by [bmim]HSO{sub 4} can be modeled with the shrinking core model, controlled by diffusion through a solid product layer, and the kinetic apparent activation energy has been calculated to be 25.36 kJ/mol.

  8. Using the Fuzzy DEMATEL to Determine Environmental Performance: A Case of Printed Circuit Board Industry in Taiwan.

    PubMed

    Tsai, Sang-Bing; Chien, Min-Fang; Xue, Youzhi; Li, Lei; Jiang, Xiaodong; Chen, Quan; Zhou, Jie; Wang, Lei

    2015-01-01

    The method by which high-technology product manufacturers balance profits and environmental performance is of crucial concern for governments and enterprises. To examine the environmental performance of manufacturers, the present study applied Fuzzy-DEMATEL model to examine environmental performance of the PCB industry in Taiwan. Fuzzy theory was employed to examine the environmental performance criteria of manufacturers and analyse fuzzy linguistics. The fuzzy-DEMATEL model was then employed to assess the direction and level of interaction between environmental performance criteria. The core environmental performance criteria which were critical for enhancing environmental performance of the PCB industry in Taiwan were identified and presented. The present study revealed that green design (a1), green material procurement (a2), and energy consumption (b3) constitute crucial reason criteria, the core criteria influencing other criteria, and the driving factors for resolving problems. PMID:26052710

  9. Using the Fuzzy DEMATEL to Determine Environmental Performance: A Case of Printed Circuit Board Industry in Taiwan.

    PubMed

    Tsai, Sang-Bing; Chien, Min-Fang; Xue, Youzhi; Li, Lei; Jiang, Xiaodong; Chen, Quan; Zhou, Jie; Wang, Lei

    2015-01-01

    The method by which high-technology product manufacturers balance profits and environmental performance is of crucial concern for governments and enterprises. To examine the environmental performance of manufacturers, the present study applied Fuzzy-DEMATEL model to examine environmental performance of the PCB industry in Taiwan. Fuzzy theory was employed to examine the environmental performance criteria of manufacturers and analyse fuzzy linguistics. The fuzzy-DEMATEL model was then employed to assess the direction and level of interaction between environmental performance criteria. The core environmental performance criteria which were critical for enhancing environmental performance of the PCB industry in Taiwan were identified and presented. The present study revealed that green design (a1), green material procurement (a2), and energy consumption (b3) constitute crucial reason criteria, the core criteria influencing other criteria, and the driving factors for resolving problems.

  10. Using the Fuzzy DEMATEL to Determine Environmental Performance: A Case of Printed Circuit Board Industry in Taiwan

    PubMed Central

    Tsai, Sang-Bing; Chien, Min-Fang; Xue, Youzhi; Li, Lei; Jiang, Xiaodong; Chen, Quan; Zhou, Jie; Wang, Lei

    2015-01-01

    The method by which high-technology product manufacturers balance profits and environmental performance is of crucial concern for governments and enterprises. To examine the environmental performance of manufacturers, the present study applied Fuzzy-DEMATEL model to examine environmental performance of the PCB industry in Taiwan. Fuzzy theory was employed to examine the environmental performance criteria of manufacturers and analyse fuzzy linguistics. The fuzzy-DEMATEL model was then employed to assess the direction and level of interaction between environmental performance criteria. The core environmental performance criteria which were critical for enhancing environmental performance of the PCB industry in Taiwan were identified and presented. The present study revealed that green design (a1), green material procurement (a2), and energy consumption (b3) constitute crucial reason criteria, the core criteria influencing other criteria, and the driving factors for resolving problems. PMID:26052710

  11. Data Mining Approaches for Modeling Complex Electronic Circuit Design Activities

    SciTech Connect

    Kwon, Yongjin; Omitaomu, Olufemi A; Wang, Gi-Nam

    2008-01-01

    A printed circuit board (PCB) is an essential part of modern electronic circuits. It is made of a flat panel of insulating materials with patterned copper foils that act as electric pathways for various components such as ICs, diodes, capacitors, resistors, and coils. The size of PCBs has been shrinking over the years, while the number of components mounted on these boards has increased considerably. This trend makes the design and fabrication of PCBs ever more difficult. At the beginning of design cycles, it is important to estimate the time to complete the steps required accurately, based on many factors such as the required parts, approximate board size and shape, and a rough sketch of schematics. Current approach uses multiple linear regression (MLR) technique for time and cost estimations. However, the need for accurate predictive models continues to grow as the technology becomes more advanced. In this paper, we analyze a large volume of historical PCB design data, extract some important variables, and develop predictive models based on the extracted variables using a data mining approach. The data mining approach uses an adaptive support vector regression (ASVR) technique; the benchmark model used is the MLR technique currently being used in the industry. The strengths of SVR for this data include its ability to represent data in high-dimensional space through kernel functions. The computational results show that a data mining approach is a better prediction technique for this data. Our approach reduces computation time and enhances the practical applications of the SVR technique.

  12. PCB breakdown by anaerobic microorganisms

    SciTech Connect

    Not Available

    1989-03-01

    Recently, altered PCB cogener distribution patterns observed in anaerobic sediment samples from the upper Hudson River are being attributed to biologically mediated reductive dechlorination. The authors report their successful demonstration of biologically mediated reductive dechlorination of an Aroclor mixture. In their investigation, they assessed the ability of microorganisms from PCB-contaminated Hudson River sediments (60-562 ppm PCBs) to dechlorinate Aroclor 1242 under anaerobic conditions by eluting microorganisms from the PCB- contaminated sediments and transferring them to a slurry of reduced anaerobic mineral medium and PCB-free sediments in tightly stoppered bottles. They observed dechlorination to be the most rapid at the highest PCB concentration tried by them.

  13. Comparison of an Electromagnetic Energy Harvester Performance using Wound Coil Wire and PCB Coil

    NASA Astrophysics Data System (ADS)

    Resali, MSM; Salleh, H.

    2016-03-01

    This paper presents the performance of two types of electromagnetic energy harvester, one using manually wound coil wire (EH-EC) and the other one using printed circuit board (PCB) coil (EH-EP). The objective of the study is to measure the corresponding output voltage and power by varying the number of coils and the position of the magnet. The experiment was conducted at a fix 50 Hz of frequency and at 0.25g of acceleration. The EH-EP was found to be more effective than the 350 turns of the wound coil wire, with maximum power of 26 μW. Overall, the performance of the EH-EC showed better result with maximum power of 125 μW for 1050 turns when compared to the EH-EP.

  14. Surface plasma preionization produced on a specially patterned PCB and its application in a pulsed CO2 laser

    NASA Astrophysics Data System (ADS)

    Ghorbanzadeh, Atamalek; Pakmanesh, Nahid; Rastegari, Ali; Abdolghader, Pedram; Feizollah, Peyman; Siadati, Neda

    2016-04-01

    The performance of an atmospheric pressure pulsed carbon dioxide laser employing surface plasma preionization, produced on a specially patterned printed circuit board (PCB), is reported. The surface plasma is formed due to many tiny plasma channels produced in millimeter sized open circular gaps, made by lithography on one side of PCB. The preionizing plasma is mostly consisted of corona or glow stage and transition to spark one hardly occurs. This type of preionization allows a maximum of 220 J/l energy deposition into the main plasma, while up scaling is yet possible by more optimization of PCB and the pattern. The laser output energy of 1.2 J per pulse with overall efficiency of 7% has been obtained with gas mixture of He:CO2:N2=3:1:1. This type of surface plasma preionization is specifically appropriate for very large volumes and high pressures, where the conventional UV emitting preionizations like spark arrays or corona are not effective.

  15. Recycling of lead solder dross, Generated from PCB manufacturing

    NASA Astrophysics Data System (ADS)

    Lucheva, Biserka; Tsonev, Tsonio; Iliev, Peter

    2011-08-01

    The main purpose of this work is to analyze lead solder dross, a waste product from manufacturing of printed circuit boards by wave soldering, and to develop an effective and environmentally sound technology for its recycling. A methodology for determination of the content and chemical composition of the metal and oxide phases of the dross is developed. Two methods for recycling of lead solder dross were examined—carbothermal reduction and recycling using boron-containing substances. The influence of various factors on the metal yield was studied and the optimal parameters of the recycling process are defined. The comparison between them under the same parameters-temperature and retention time, showed that recycling of dross with a mixture of borax and boric acid in a 1:2 ratio provides higher metal yield (93%). The recycling of this hazardous waste under developed technology gets glassy slag and solder, which after correction of the chemical composition can be used again for production of PCB.

  16. Flexible circuits with integrated switches for robotic shape sensing

    NASA Astrophysics Data System (ADS)

    Harnett, C. K.

    2016-05-01

    Digital switches are commonly used for detecting surface contact and limb-position limits in robotics. The typical momentary-contact digital switch is a mechanical device made from metal springs, designed to connect with a rigid printed circuit board (PCB). However, flexible printed circuits are taking over from the rigid PCB in robotics because the circuits can bend while carrying signals and power through moving joints. This project is motivated by a previous work where an array of surface-mount momentary contact switches on a flexible circuit acted as an all-digital shape sensor compatible with the power resources of energy harvesting systems. Without a rigid segment, the smallest commercially-available surface-mount switches would detach from the flexible circuit after several bending cycles, sometimes violently. This report describes a low-cost, conductive fiber based method to integrate electromechanical switches into flexible circuits and other soft, bendable materials. Because the switches are digital (on/off), they differ from commercially-available continuous-valued bend/flex sensors. No amplification or analog-to-digital conversion is needed to read the signal, but the tradeoff is that the digital switches only give a threshold curvature value. Boundary conditions on the edges of the flexible circuit are key to setting the threshold curvature value for switching. This presentation will discuss threshold-setting, size scaling of the design, automation for inserting a digital switch into the flexible circuit fabrication process, and methods for reconstructing a shape from an array of digital switch states.

  17. Sampling of BTX in Hat Yai city using cost effective laboratory-built PCB passive sampler.

    PubMed

    Subba, Jas Raj; Thammakhet, Chongdee; Thavarungkul, Panote; Kanatharana, Proespichaya

    2016-08-23

    A laboratory-built printed circuit board (PCB) passive sampler used for the monitoring of xylene and styrene in copy print shops was re-validated for detecting benzene, toluene and xylene (BTX) and applied for the sampling of ambient air from Hat Yai city, Songkhla, Thailand, in the month of November 2014. For monitoring, the PCB passive samplers were exposed to target analytes in 16 locations covering high to low exposure areas. After sampling, the samplers were thermally desorbed and the analytes were trapped by multi-walled carbon nanotubes packed into a micro-preconcentrator coupled to a gas chromatograph (GC) equipped with a flame ionization detector. At the optimum GC operating conditions, the linear dynamic ranges for BTX were 0.06-5.6 µg for benzene, 0.07-2.2 µg for toluene and 0.23-2.5 µg for xylene with R(2) > 0.99 with the limits of detection being 6.6, 6.8 and 19 ng for benzene, toluene and xylene, respectively. The concentrations of BTX in the 16 sampling sites were in the range of N.D.-1.3 ± 1.6, 4.50 ± 0.76-49.6 ± 3.7 and 1.00 ± 0.21-39.6 ± 3.1 µg m(-3), respectively. When compared to past studies, there had been an increase in the benzene concentration. PMID:27231039

  18. Evaluating the Effects of Aging on Electronic Instrument and Control Circuit Boards and Components in Nuclear Power Plants

    SciTech Connect

    G. William Hannaman; C. Dan Wilkinson

    2005-05-15

    The report describes potentially useful techniques for monitoring the aging of I&C boards. The techniques have been grouped into: periodic testing, reliability modeling, resistance measures, signal comparison, eternal measures, and internal measures, each representing distinct theoretical approaches to detection and evaluation.

  19. Eco-friendly copper recovery process from waste printed circuit boards using Fe³⁺/Fe²⁺ redox system.

    PubMed

    Fogarasi, Szabolcs; Imre-Lucaci, Florica; Egedy, Attila; Imre-Lucaci, Árpád; Ilea, Petru

    2015-06-01

    The present study aimed at developing an original and environmentally friendly process for the recovery of copper from waste printed circuit boards (WPCBs) by chemical dissolution with Fe(3+) combined with the simultaneous electrowinning of copper and oxidant regeneration. The recovery of copper was achieved in an original set-up consisting of a three chamber electrochemical reactor (ER) connected in series with a chemical reactor (CR) equipped with a perforated rotating drum. Several experiments were performed in order to identify the optimal flow rate for the dissolution of copper in the CR and to ensure the lowest energy consumption for copper electrodeposition in the ER. The optimal hydrodynamic conditions were provided at 400 mL/min, leading to the 75% dissolution of metals and to a low specific energy consumption of 1.59 kW h/kg Cu for the electrodeposition process. In most experiments, the copper content of the obtained cathodic deposits was over 99.9%.

  20. Computer simulation of the pneumatic separator in the pneumatic-electrostatic separation system for recycling waste printed circuit boards with electronic components.

    PubMed

    Xue, Mianqiang; Xu, Zhenming

    2013-05-01

    Technologies could be integrated in different ways into automatic recycling lines for a certain kind of electronic waste according to practical requirements. In this study, a new kind of pneumatic separator with openings at the dust hooper was applied combing with electrostatic separation for recycling waste printed circuit boards. However, the flow pattern and the particles' movement behavior could not be obtained by experimental methods. To better control the separation quantity and the material size distribution, computational fluid dynamics was used to model the new pneumatic separator giving a detailed understanding of the mechanisms. Simulated results showed that the tangential velocity direction reversed with a relatively small value. Axial velocity exhibited two sharp decreases at the x axis. It is indicated that the bottom openings at the dust hopper resulted in an enormous change in the velocity profile. A new phenomenon that was named dusting was observed, which would mitigate the effect of particles with small diameter on the following electrostatic separation and avoid materials plugging caused by the waste printed circuit boards special properties effectively. The trapped materials were divided into seven grades. Experimental results showed that the mass fraction of grade 5, grade 6, and grade 7 materials were 27.54%, 15.23%, and 17.38%, respectively. Grade 1 particles' mass fraction was reduced by 80.30% compared with a traditional separator. Furthermore, the monocrystalline silicon content in silicon element in particles with a diameter of -0.091 mm was 18.9%, higher than that in the mixed materials. This study could serve as guidance for the future material flow control, automation control, waste recycling, and semiconductor storage medium destruction.

  1. The major components of particles emitted during recycling of waste printed circuit boards in a typical e-waste workshop of South China

    NASA Astrophysics Data System (ADS)

    Bi, Xinhui; Simoneit, Bernd R. T.; Wang, ZhenZhen; Wang, Xinming; Sheng, Guoying; Fu, Jiamo

    2010-11-01

    Electronic waste from across the world is dismantled and disposed of in China. The low-tech recycling methods have caused severe air pollution. Air particle samples from a typical workshop of South China engaged in recycling waste printed circuit boards have been analyzed with respect to chemical constituents. This is the first report on the chemical composition of particulate matter (PM) emitted in an e-waste recycling workshop of South China. The results show that the composition of PM from this recycling process was totally different from other emission sources. Organic matter comprised 46.7-51.6% of the PM. The major organic constituents were organophosphates consisting mainly of triphenyl phosphate (TPP) and its methyl substituted compounds, methyl esters of hexadecanoic and octadecanoic acids, levoglucosan and bisphenol A. TPP and bisphenol A were present at 1-5 orders of magnitude higher than in other indoor and outdoor environments throughout the world, which implies that they might be used as potential markers for e-waste recycling. The elemental carbon, inorganic elements and ions had a minor contribution to the PM (<5% each). The inorganic elements were dominated by phosphorus and followed by crustal elements and metal elements Pb, Zn, Sn, and lesser Cu, Sb, Mn, Ni, Ba and Cd. The recycling of printed circuit boards was demonstrated as an important contributor of heavy metal contamination, particularly Cd, Pb and Ni, to the local environment. These findings suggest that this recycling method represents a strong source of PM associated with pollutants to the ambient atmosphere of an e-waste recycling locale.

  2. A Low-cost 4 Bit, 10 Giga-samples-per-second Analog-to-digital Converter Printed Circuit Board Assembly for FPGA-based Backends

    NASA Astrophysics Data System (ADS)

    Jiang, Homin; Yu, Chen-Yu; Kubo, Derek; Chen, Ming-Tang; Guzzino, Kim

    2016-11-01

    In this study, a 4 bit, 10 giga-samples-per-second analog-to-digital converter (ADC) printed circuit board assembly (PCBA) was designed, manufactured, and characterized for digitizing radio telescopes. For this purpose, an Adsantec ANST7120A-KMA flash ADC chip was used. Together with the field-programmable gate array platform, developed by the Collaboration for Astronomy Signal Processing and Electronics Research community, the PCBA enables data acquisition with a wide bandwidth and simplifies the intermediate frequency section. In the current version, the PCBA and the chip exhibit an analog bandwidth of 10 GHz (3 dB loss) and 20 GHz, respectively, which facilitates second, third, and even fourth Nyquist sampling. The following average performance parameters were obtained from the first and second Nyquist zones of the three boards: a spurious-free dynamic range of 31.35/30.45 dB, a signal-to-noise and distortion ratio of 22.95/21.83 dB, and an effective number of bits of 3.65/3.43, respectively.

  3. Display glass for low-loss and high-density optical interconnects in electro-optical circuit boards with eight optical layers.

    PubMed

    Brusberg, Lars; Whalley, Simon; Herbst, Christian; Schröder, Henning

    2015-12-14

    Parallel optical interconnects on-board level requires low propagation loss in wavelength range between 850 and 1550 nm to be compatible with datacom and telecom optical engines. For highest integration density tight waveguide bends and a scalable number of optical layers should be manufacturable for 2D interfaces to optical fiber array connectors and photonic assembly I/O's. We developed a glass waveguide panel process for double-sided processing of commercial available display glass by applying a two-step thermal ion-exchange process for low-loss multi-mode graded-index waveguides. Multiple glass waveguide panels can be embedded between electrical layers. The generic concept enables fabrication of high-density integration (HDI) electro-optical circuit boards (EOCB) with high number of optical and electrical layers. Waveguides with high NA of 0.3 for low bend losses could be achieved in glass with propagation loss of 0.05 dB/cm for all key wavelengths. Four of those glass waveguide panels were embedded in an EOCB demonstrator with size of 280 x 233 mm² providing eight optical layers with 96 channels in an area of 2.8 x 1.5 mm². To the best of our knowledge it's the highest number of layers that has ever been demonstrated for an EOCB.

  4. Display glass for low-loss and high-density optical interconnects in electro-optical circuit boards with eight optical layers.

    PubMed

    Brusberg, Lars; Whalley, Simon; Herbst, Christian; Schröder, Henning

    2015-12-14

    Parallel optical interconnects on-board level requires low propagation loss in wavelength range between 850 and 1550 nm to be compatible with datacom and telecom optical engines. For highest integration density tight waveguide bends and a scalable number of optical layers should be manufacturable for 2D interfaces to optical fiber array connectors and photonic assembly I/O's. We developed a glass waveguide panel process for double-sided processing of commercial available display glass by applying a two-step thermal ion-exchange process for low-loss multi-mode graded-index waveguides. Multiple glass waveguide panels can be embedded between electrical layers. The generic concept enables fabrication of high-density integration (HDI) electro-optical circuit boards (EOCB) with high number of optical and electrical layers. Waveguides with high NA of 0.3 for low bend losses could be achieved in glass with propagation loss of 0.05 dB/cm for all key wavelengths. Four of those glass waveguide panels were embedded in an EOCB demonstrator with size of 280 x 233 mm² providing eight optical layers with 96 channels in an area of 2.8 x 1.5 mm². To the best of our knowledge it's the highest number of layers that has ever been demonstrated for an EOCB. PMID:26699042

  5. Disposal requirements for PCB waste

    SciTech Connect

    1994-12-01

    Polychlorinated biphenyls (PCBs) are a class of organic chemicals that had become widely used in industrial applications due to their practical physical and chemical properties. Historical uses of PCBs include dielectric fluids (used in utility transformers, capacitors, etc.), hydraulic fluids, and other applications requiring stable, fire-retardant materials. Due to findings that PCBs may cause adverse health effects and due to their persistence and accumulation in the environment, the Toxic Substances Control Act (TSCA), enacted on october 11, 1976, banned the manufacture of PCBs after 1978 [Section 6(e)]. The first PCB regulations, promulgated at 40 CFR Part 761, were finalized on February 17, 1978. These PCB regulations include requirements specifying disposal methods and marking (labeling) procedures, and controlling PCB use. To assist the Department of Energy (DOE) in its efforts to comply with the TSCA statute and implementing regulations, the Office of Environmental Guidance has prepared the document ``Guidance on the Management of Polychlorinated Biphenyls (PCBs).`` That document explains the requirements specified in the statute and regulations for managing PCBs including PCB use, storage, transport, and disposal. PCB materials that are no longer in use and have been declared a waste must be disposed of according to the requirements found at 40 CFR 761.60. These requirements establish disposal options for a multitude of PCB materials including soil and debris, liquid PCBs, sludges and slurries, containers, transformers, capacitors, hydraulic machines, and other electrical equipment. This Information Brief supplements the PCB guidance document by responding to common questions concerning disposal requirements for PCBs. It is one of a series of Information Briefs pertinent to PCB management issues.

  6. Co-recycling of acrylonitrile-butadiene-styrene waste plastic and nonmetal particles from waste printed circuit boards to manufacture reproduction composites.

    PubMed

    Sun, Zhixing; Shen, Zhigang; Zhang, Xiaojing; Ma, Shulin

    2015-01-01

    This study investigated the feasibility of using acrylonitrile-butadiene-styrene (ABS) waste plastic and nonmetal particles from waste printed circuit boards (WPCB) to manufacture reproduction composites (RC), with the aim of co-recycling these two waste resources. The composites were prepared in a twin-crew extruder and investigated by means of mechanical testing, in situ flexural observation, thermogravimatric analysis, and dimensional stability evaluation. The results showed that the presence of nonmetal particles significantly improved the mechanical properties and the physical performance of the RC. A loading of 30 wt% nonmetal particles could achieve a flexural strength of 72.6 MPa, a flexural modulus of 3.57 GPa, and an impact strength of 15.5 kJ/m2. Moreover, it was found that the application of maleic anhydride-grafted ABS as compatilizer could effectively promote the interfacial adhesion between the ABS plastic and the nonmetal particles. This research provides a novel method to reuse waste ABS and WPCB nonmetals for manufacturing high value-added product, which represents a promising way for waste recycling and resolving the environmental problem.

  7. Eco-friendly copper recovery process from waste printed circuit boards using Fe³⁺/Fe²⁺ redox system.

    PubMed

    Fogarasi, Szabolcs; Imre-Lucaci, Florica; Egedy, Attila; Imre-Lucaci, Árpád; Ilea, Petru

    2015-06-01

    The present study aimed at developing an original and environmentally friendly process for the recovery of copper from waste printed circuit boards (WPCBs) by chemical dissolution with Fe(3+) combined with the simultaneous electrowinning of copper and oxidant regeneration. The recovery of copper was achieved in an original set-up consisting of a three chamber electrochemical reactor (ER) connected in series with a chemical reactor (CR) equipped with a perforated rotating drum. Several experiments were performed in order to identify the optimal flow rate for the dissolution of copper in the CR and to ensure the lowest energy consumption for copper electrodeposition in the ER. The optimal hydrodynamic conditions were provided at 400 mL/min, leading to the 75% dissolution of metals and to a low specific energy consumption of 1.59 kW h/kg Cu for the electrodeposition process. In most experiments, the copper content of the obtained cathodic deposits was over 99.9%. PMID:25816768

  8. Recycling of waste printed circuit boards with simultaneous enrichment of special metals by using alkaline melts: A green and strategically advantageous solution.

    PubMed

    Stuhlpfarrer, Philipp; Luidold, Stefan; Antrekowitsch, Helmut

    2016-04-15

    The increasing consumption of electric and electronic equipment has led to a rise in toxic waste. To recover the metal fraction, a separation of the organic components is necessary because harmful substances such as chlorine, fluorine and bromine cause ecological damage, for example in the form of dioxins and furans at temperature above 400°C. Hence, an alternative, environmentally friendly approach was investigated exploiting that a mixture of caustic soda and potassium hydroxide in eutectic composition melts below 200°C, enabling a fast cracking of the long hydrocarbon chains. The trials demonstrate the removal of organic compounds without a loss of copper and precious metals, as well as a suppressed formation of hazardous off-gases. In order to avoid an input of alkaline elements into the furnace and ensuing problems with refractory materials, a washing step generates a sodium and potassium hydroxide solution, in which special metals like indium, gallium and germanium are enriched. Their concentrations facilitate the recovery of these elements, because otherwise they become lost in the typical recycling processes. The aim of this work was to find an environmental solution for the separation of plastics and metals as well as a strategically important answer for the recycling of printed circuit boards and mobile phones. PMID:26775099

  9. Eco-friendly copper recovery process from waste printed circuit boards using Fe{sup 3+}/Fe{sup 2+} redox system

    SciTech Connect

    Fogarasi, Szabolcs; Imre-Lucaci, Florica; Egedy, Attila; Imre-Lucaci, Árpád; Ilea, Petru

    2015-06-15

    Highlights: • We developed an ecofriendly mediated electrochemical process for copper recovery. • The recovery of copper was achieved without mechanical pretreatment of the samples. • We identified the optimal flow rate for the leaching and electrowinning of copper. • The copper content of the obtained cathodic deposits was over 99.9%. - Abstract: The present study aimed at developing an original and environmentally friendly process for the recovery of copper from waste printed circuit boards (WPCBs) by chemical dissolution with Fe{sup 3+} combined with the simultaneous electrowinning of copper and oxidant regeneration. The recovery of copper was achieved in an original set-up consisting of a three chamber electrochemical reactor (ER) connected in series with a chemical reactor (CR) equipped with a perforated rotating drum. Several experiments were performed in order to identify the optimal flow rate for the dissolution of copper in the CR and to ensure the lowest energy consumption for copper electrodeposition in the ER. The optimal hydrodynamic conditions were provided at 400 mL/min, leading to the 75% dissolution of metals and to a low specific energy consumption of 1.59 kW h/kg Cu for the electrodeposition process. In most experiments, the copper content of the obtained cathodic deposits was over 99.9%.

  10. Study on the influence of various factors in the hydrometallurgical processing of waste printed circuit boards for copper and gold recovery.

    PubMed

    Birloaga, Ionela; De Michelis, Ida; Ferella, Francesco; Buzatu, Mihai; Vegliò, Francesco

    2013-04-01

    The present lab-scale experimental study presents the process of leaching waste printed circuit boards (WPCBs) in order to recover gold by thioureation. Preliminary tests have shown that copper adversely affects gold extraction; therefore an oxidative leaching pre-treatment was performed in order to remove base metals. The effects of sulfuric acid concentration, hydrogen peroxide volume and temperature on the metal extraction yield were studied by analysis of variance (ANOVA). The highest copper extraction yields were 76.12% for sample A and 18.29% for sample D, after leaching with 2M H2SO4, 20 ml of 30% H2O2 at 30°C for 3h. In order to improve Cu removal, a second leaching was performed only on sample A, resulting in a Cu extraction yield of 90%. Other experiments have shown the negative effect of the stirring rate on copper dissolution. The conditions used for the process of gold extraction by thiourea were: 20 g/L thiourea, 6g/L ferric ion, 10 g/L sulfuric acid, 600 rpm stirring rate. To study the influence of temperature and particle size, this process was tested on pins manually removed from computer central processing units (CPUs) and on waste CPU for 3½ h. A gold extraction yield of 69% was obtained after 75% of Cu was removed by a double oxidative leaching treatment of WPCBs with particle sizes smaller than 2 mm.

  11. A new technology for separation and recovery of materials from waste printed circuit boards by dissolving bromine epoxy resins using ionic liquid.

    PubMed

    Zhu, P; Chen, Y; Wang, L Y; Qian, G Y; Zhou, M; Zhou, J

    2012-11-15

    Recovery of valuable materials from waste printed circuit boards (WPCBs) is quite difficult because WPCBs is a heterogeneous mixture of polymer materials, glass fibers, and metals. In this study, WPCBs was treated using ionic liquid (1-ethyl-3-methylimizadolium tetrafluoroborate [EMIM+][BF4-]). Experimental results showed that the separation of the solders went to completion, and electronic components (ECs) were removed in WPCBs when [EMIM+][BF4-] solution containing WPCBs was heated to 240 °C. Meanwhile, metallographic observations verified that the WPCBs had an initial delamination. When the temperature increased to 260 °C, the separation of the WPCBs went to completion, and coppers and glass fibers were obtained. The used [EMIM+][BF4-] was treated by water to generate a solid-liquid suspension, which was separated completely to obtain solid residues by filtration. Thermal analyses combined with infrared ray spectra (IR) observed that the solid residues were bromine epoxy resins. NMR (nuclear magnetic resonance) showed that hydrogen bond played an important role for [EMIM+][BF4-] dissolving bromine epoxy resins. This clean and non-polluting technology offers a new way to recycle valuable materials from WPCBs and prevent environmental pollution from WPCBs effectively.

  12. Modeling and characteristic of the SMT Board Plug connector in high speed optical communication system

    NASA Astrophysics Data System (ADS)

    Wu, Haoran; Dong, Zhenzhen; Wang, Tanglin; Zhao, Heng; Feng, Junbo; Cui, Naidi; Teng, Jie; Guo, Jin

    2015-04-01

    Modeling and characteristic of the SMT Board Plug connector, which is used to connect micro optical transceiver to the main board, are proposed and analyzed in this paper. When the high speed signal transfers from the PCB of transceiver to main board through SMT Board Plug connector, the structure and material discontinuity of the connector causes insertion losses and impedance mismatches. This makes the performance of high speed digital system exacerbated. So it is essential to analyze the signal transfer characteristics of the connector and find out what factors affected the signal quality at the design stage of the digital system. To solve this problem, Ansoft's High Frequency Structure Simulator (HFSS), based on the finite element method, was employed to build accurate 3D models, analyze the effects of various structure parameters, and obtain the full-wave characteristics of the SMT Board Plug connectors in this paper. Then an equivalent circuit model was developed. The circuit parameters were extracted precisely in the frequency range of interests by using the curve fitting method in ADS software, and the result was in good agreement with HFSS simulations up to 8GHz with different structure parameters. At last, the measurement results of S-parameter and eye diagram were given and the S-parameters showed good coincidence between the measurement and HFSS simulation up to 4GHz.

  13. Leaching of Au, Ag, and Pd from waste printed circuit boards of mobile phone by iodide lixiviant after supercritical water pre-treatment.

    PubMed

    Xiu, Fu-Rong; Qi, Yingying; Zhang, Fu-Shen

    2015-07-01

    Precious metals are the most attractive resources in waste printed circuit boards (PCBs) of mobile phones. In this work, an alternative process for recovering Au, Ag, and Pd from waste PCBs of mobile phones by supercritical water oxidation (SCWO) pre-treatment combined with iodine-iodide leaching process was developed. In the process, the waste PCBs of mobile phones were pre-treated in supercritical water, then a diluted hydrochloric acid leaching (HL) process was used to recovery the Cu, whose leaching efficiency was approximately 100%, finally the resulting residue was subjected to the iodine-iodide leaching process for recovering the Au, Ag, and Pd. Experimental results indicated that SCWO pre-treatment temperature, time, and pressure had significant influence on the Au, Ag, and Pd leaching from (SCWO+HL)-treated waste PCBs. The optimal SCWO pre-treatment conditions were 420°C and 60min for Au and Pd, and 410°C and 30min for Ag. The optimum dissolution parameters for Au, Pd, and Ag in (SCWO+HL)-treated PCBs with iodine-iodide system were leaching time of 120min (90min for Ag), iodine/iodide mole ratio of 1:5 (1:6 for Ag), solid-to-liquid ratio (S/L) of 1:10g/mL (1:8g/mL for Ag), and pH of 9, respectively. It is believed that the process developed in this study is environment friendly for the recovery of Au, Ag, and Pd from waste PCBs of mobile phones by SCWO pre-treatment combined with iodine-iodide leaching process.

  14. Advanced degradation of brominated epoxy resin and simultaneous transformation of glass fiber from waste printed circuit boards by improved supercritical water oxidation processes.

    PubMed

    Liu, Kang; Zhang, Zhiyuan; Zhang, Fu-Shen

    2016-10-01

    This work investigated various supercritical water oxidation (SCWO) systems, i.e. SCWO1 (only water), SCWO2 (water+H2O2) and SCWO3 (water+H2O2/NaOH), for waste printed circuit boards (PCBs) detoxification and recycling. Response surface methodology (RSM) was applied to optimize the operating conditions of the optimal SCWO3 systems. The optimal reaction conditions for debromination were found to be the NaOH of 0.21g, the H2O2 volume of 9.04mL, the time of 39.7min, maximum debromination efficiency of 95.14%. Variance analysis indicated that the factors influencing debromination efficiency was in the sequence of NaOH>H2O2>time. Mechanism studies indicated that the dissociated ions from NaOH in supercritical water promoted the debromination of brominated epoxy resins (BERs) through an elimination reaction and nucleophilic substitution. HO2, produced by H2O2 could induce the oxidation of phenol ring to open (intermediates of BERs), which were thoroughly degraded to form hydrocarbons, CO2, H2O and NaBr. In addition, the alkali-silica reaction between OH(-) and SiO2 induced the phase transformation of glass fibers, which were simultaneously converted into anorthite and albite. Waste PCBs in H2O2/NaOH improved SCWO system were fully degraded into useful products and simultaneously transformed into functional materials. These findings are helpful for efficient recycling of waste PCBs.

  15. Design and characterization of a mixed-signal PCB for digital-to-analog conversion in a modular and scalable infrared scene projector

    NASA Astrophysics Data System (ADS)

    Benedict, Jacob

    Infra-red (IR) sensors have proven instrumental in a wide variety of fields from military to industrial applications. The proliferation of IR sensors has spawned an intense push for technologies that can test and calibrate the multitudes of IR sensors. One such technology, IR scene projection (IRSP), provides an inexpensive and safe method for the testing of IR sensor devices. Previous efforts have been conducted to develop IRSPs based on super-lattice light emitting diodes (SLEDS). A single-color 512x512 SLEDs system has been developed, produced, and tested as documented in Corey Lange's Master's thesis, and a GOMAC paper by Rodney McGee [1][2]. Current efforts are being undergone to develop a two-color 512x512 SLEDs system designated (TCSA). The following thesis discusses the design and implementation of a custom printed circuit board (PCB), known as the FMC 4DAC, that contains both analog and digital signals. Utilizing two 16-bit digital-to-analog converters (DAC) the purpose of the board is to provide four analog current output channels for driving the TCSA system to a maximum frame rate of 1 kHz. In addition, the board supports a scalable TCSA system architecture. Several copies of the board can be run in parallel to achieve a range of analog channels between 4 and 32.

  16. Packaging Of Control Circuits In A Robot Arm

    NASA Technical Reports Server (NTRS)

    Kast, William

    1994-01-01

    Packaging system houses and connects control circuitry mounted on circuit boards within shoulder, upper section, and lower section of seven-degree-of-freedom robot arm. Has modular design that incorporates surface-mount technology, multilayer circuit boards, large-scale integrated circuits, and multi-layer flat cables between sections for compactness. Three sections of robot arm contain circuit modules in form of stardardized circuit boards. Each module contains two printed-circuit cards, one of each face.

  17. a Pcb Based Capacitive Shear Force Sensor Developed for Robotic Gripper Application

    NASA Astrophysics Data System (ADS)

    Huang, Jian-Lin; Chen, Sheng-Jui; Wu, Gwo-Jen; Wu, Chung-Lin; Pan, Sheau-Shi

    The shear force sensor is one of the key elements in future robotic industry, it is of great importance in applications where robotic arms are required to delicately interact with objects to be handled. In this paper, we present the development of a capacitive shear force capable of sensing shear forces in two degrees of freedom. The fabrication of the sensor is based on the printed circuit board (PCB) fabrication process, a well-known and mature technology. We adopt the capacitance sensing scheme for its high sensitivity and easy implementation. For sensor characterization, we used a force gauge and an optical interferometer to measure sensor's parameters including its sensing coefficient and resolution. The dimension of our prototype shear force sensor including the metal housing is 26 mm×13 mm×58 mm suitable for the integration with commercial robotic grippers. For sensor performance, we achieved a shear force sensing coefficient of 23.3 fF/N and a resolution of smaller than 5mN.

  18. Environmental risk assessment of CRT and PCB workshops in a mobile e-waste recycling plant.

    PubMed

    Song, Qingbin; Zeng, Xianlai; Li, Jinhui; Duan, Huabo; Yuan, Wenyi

    2015-08-01

    The mobile e-waste recycling equipment was chosen as the object of this study, including manual dismantling, mechanical separation of cathode ray tubes (CRTs), and printed circuit boards (PCBs) in the two independent workshops. To determine the potential environmental contamination, the noise, the heavy metals (Cu, Cd, Pb), and the environmental impacts of the e-waste recycling processes in the two workshops of the mobile plant have been evaluated in this paper. This study determined that when control measures are employed, the noise within the two workshops (<80 dB) will meet the national standards. In the CRT workshop, Pb was the most polluting metal, with 2.3 μg/m(3) and 10.53 mg/g in the air and floor dust, respectively. The result of a health risk assessment shows that noncancerous effects are possible for Pb (hazard index (HI) = 3.54 in the CRT workshop and HI = 1.27 in the PCB workshop). The carcinogenic risks to workers for Cd are relatively light in both the workshops. From the results of life cycle assessment (LCA), it can be seen that there was an environmental benefit from the e-waste recycling process as a whole.

  19. Maskless fabrication of a microfluidic device with interdigitated electrodes on PCB using laser ablation

    NASA Astrophysics Data System (ADS)

    Contreras-Saenz, Michael; Hassard, Christian; Vargas-Chacon, Rafael; Gordillo, Jose Luis; Camacho-Leon, Sergio

    2016-03-01

    This paper reports the maskless fabrication of a microfluidic device with interdigitated electrodes (IDE) based on the technology of MicroElectroMechanical Systems on Printed Circuit Board (PCB-MEMS) and laser ablation. The device has flame retardant (FR)-4 resin as substrate, cooper (Cu) as active material and SU-8 polymer as structural material. By adjusting the laser parameters, Cu IDEs and SU-8 microchannels were successfully patterned onto the FR-4 substrate. The respective width, gap and overlap of the IDEs were 50 μm, 25 μm and 500 μm. The respective width, depth and length of the microchannels were 210 μm, 24.6 μm and 6.3 mm. The resolution and repeatability achieved in this approach, along with the low cost of the involved materials and techniques, enable an affordable micromachining platform with rapid fabrication-test cycle to develop active multiphysic microdevices with several applications in the fields of biosensing, cell culture, drug delivery, transport and sorting of molecules, among others.

  20. Printed wiring board system programmer's manual

    NASA Technical Reports Server (NTRS)

    Brinkerhoff, C. D.

    1973-01-01

    The printed wiring board system provides automated techniques for the design of printed circuit boards and hybrid circuit boards. The system consists of four programs: (1) the preprocessor program combines user supplied data and pre-defined library data to produce the detailed circuit description data; (2) the placement program assigns circuit components to specific areas of the board in a manner that optimizes the total interconnection length of the circuit; (3) the organizer program assigns pin interconnections to specific board levels and determines the optimal order in which the router program should attempt to layout the paths connecting the pins; and (4) the router program determines the wire paths which are to be used to connect each input pin pair on the circuit board. This document is intended to serve as a programmer's reference manual for the printed wiring board system. A detailed description of the internal logic and flow of the printed wiring board programs is included.

  1. Advantages and Challenges of 10-Gbps Transmission on High-Density Interconnect Boards

    NASA Astrophysics Data System (ADS)

    Yee, Chang Fei; Jambek, Asral Bahari; Al-Hadi, Azremi Abdullah

    2016-06-01

    This paper provides a brief introduction to high-density interconnect (HDI) technology and its implementation on printed circuit boards (PCBs). The advantages and challenges of implementing 10-Gbps signal transmission on high-density interconnect boards are discussed in detail. The advantages (e.g., smaller via dimension and via stub removal) and challenges (e.g., crosstalk due to smaller interpair separation) of HDI are studied by analyzing the S-parameter, time-domain reflectometry (TDR), and transmission-line eye diagrams obtained by three-dimensional electromagnetic modeling (3DEM) and two-dimensional electromagnetic modeling (2DEM) using Mentor Graphics HyperLynx and Keysight Advanced Design System (ADS) electronic computer-aided design (ECAD) software. HDI outperforms conventional PCB technology in terms of signal integrity, but proper routing topology should be applied to overcome the challenge posed by crosstalk due to the tight spacing between traces.

  2. PCB metabolism by ectomycorrhizal fungi

    SciTech Connect

    Donnelly, P.K.; Fletcher, J.S.

    1995-04-01

    Since 1976 the use of polychlorinated biphenyls (PCBs) has been banned in the U.S. Prior to this, commercial mixtures (Aroclors) had been used extensively as an industrial lubricant because of their nonflammable, nonreactive properties. These same properties are responsible for their persistent in the environment where they bind to soil particles and resist biodegradation. Decontamination of PCB-laden soil is expensive with excavation followed by either storage or incineration as the primary means of remediation. The use of microorganisms for PCB bioremediation has been gaining popularity in the past few years. Bacteria and/or fungi isolated from environmental samples have been used to degrade PCBs under laboratory conditions, but in field trials they have not been as effective. The most common explanation for the poor performance of PCB-degrading organisms introduced at contaminated sites is that they do not compete well with the existing populations. Plant-ectomycorrhizal systems may overcome this problem. Introduction and cultivation of a known host plant at a contaminated site has the potential of providing a survival advantage for ectomycorrhizal fungi that normally colonize the roots of the introduced plant. Ectomycorrhizal fungi exist naturally in the soil and normally grow in association with the roots of a host plant in a mutualistic symbiotic relationship. Preliminary in vitro examination of this group of fungi for their ability to enzymatically degrade xenobiotics is very promising. In vivo studies have shown that some of these fungi have the ability to degrade chlorinated, aromatic compounds, such as 2,4-D and atrazine. The aspect of ectomycorrhizal metabolism was investigated further in the current study by determining the ability of 21 different fungi to metabolize 19 different PCB congeners with varying chlorine content and substitution patterns. 13 refs., 1 fig., 2 tabs.

  3. A compact picosecond pulsed laser source using a fully integrated CMOS driver circuit

    NASA Astrophysics Data System (ADS)

    He, Yuting; Li, Yuhua; Yadid-Pecht, Orly

    2016-03-01

    Picosecond pulsed laser source have applications in areas such as optical communications, biomedical imaging and supercontinuum generation. Direct modulation of a laser diode with ultrashort current pulses offers a compact and efficient approach to generate picosecond laser pulses. A fully integrated complementary metaloxide- semiconductor (CMOS) driver circuit is designed and applied to operate a 4 GHz distributed feedback laser (DFB). The CMOS driver circuit combines sub-circuits including a voltage-controlled ring oscillator, a voltagecontrolled delay line, an exclusive-or (XOR) circuit and a current source circuit. Ultrashort current pulses are generated by the XOR circuit when the delayed square wave is XOR'ed with the original square wave from the on-chip oscillator. Circuit post-layout simulation shows that output current pulses injected into an equivalent circuit load of the laser have a pulse full width at half maximum (FWHM) of 200 ps, a peak current of 80 mA and a repetition rate of 5.8 MHz. This driver circuit is designed in a 0.13 μm CMOS process and taped out on a 0.3 mm2 chip area. This CMOS chip is packaged and interconnected with the laser diode on a printed circuit board (PCB). The optical output waveform from the laser source is captured by a 5 GHz bandwidth photodiode and an 8 GHz bandwidth oscilloscope. Measured results show that the proposed laser source can output light pulses with a pulse FWHM of 151 ps, a peak power of 6.4 mW (55 mA laser peak forward current) and a repetition rate of 5.3 MHz.

  4. Multiple mechanisms of PCB neurotoxicity

    SciTech Connect

    Carpenter, D.O.; Stoner, C.T.; Lawrence, D.A.

    1996-12-31

    Polychlorinated biphenyls (PCBs) have been implicated in cancer, but many of the symptoms in humans exposed to PCBs are related to the nervous system and behavior. We demonstrated three different direct mechanisms whereby PCBs are neurotoxic in rats. By using flow cytometry, we demonstrated that the orthosubstituted PCB congener 2,4,4{prime}, but neither TCDD nor the coplanar PCB congener 3,4,5,3{prime},4{prime}, causes rapid death of cerebellar granule cells. The ortho-substituted congener 2,4,4{prime} reduced long-term potentiation, an indicator of cognitive potential, in hippocampal brain slices, but a similar effect was observed for the coplanar congener 3,4,3{prime},4{prime}, indicating that this effect may be caused by both ortho- and coplanar congeners by mechanisms presumably not mediated via the Ah receptor. It was previously shown that some ortho-substituted PCB congeners cause a reduction in levels of the neurotransmitter dopamine, and we present in vitro and in vivo evidence that this is due to reduction of synthesis of dopamine via inhibition of the enzyme tyrosine hydroxylase. Thus, PCBs have a variety of mechanisms of primary neurotoxicity, and neurotoxicity is a characteristic of ortho-substituted, non-dioxin-like congeners as well as some coplanar congeners. The relative contribution of each of these mechanisms to the loss of cognitive function in humans exposed to PCBs remains to be determined. 42 refs., 3 figs., 1 tab.

  5. Leaching of Au, Ag, and Pd from waste printed circuit boards of mobile phone by iodide lixiviant after supercritical water pre-treatment

    SciTech Connect

    Xiu, Fu-Rong; Qi, Yingying; Zhang, Fu-Shen

    2015-07-15

    Highlights: • We report a novel process for recovering Au, Ag, and Pd from waste PCBs. • The effect of SCWO on the leaching of Au, Ag, and Pd in waste PCBs was studied. • SCWO was highly efficient for enhancing the leaching of Au, Ag, and Pd. • The optimum leaching parameters for Au, Ag, and Pd in iodine–iodide were studied. - Abstract: Precious metals are the most attractive resources in waste printed circuit boards (PCBs) of mobile phones. In this work, an alternative process for recovering Au, Ag, and Pd from waste PCBs of mobile phones by supercritical water oxidation (SCWO) pre-treatment combined with iodine–iodide leaching process was developed. In the process, the waste PCBs of mobile phones were pre-treated in supercritical water, then a diluted hydrochloric acid leaching (HL) process was used to recovery the Cu, whose leaching efficiency was approximately 100%, finally the resulting residue was subjected to the iodine–iodide leaching process for recovering the Au, Ag, and Pd. Experimental results indicated that SCWO pre-treatment temperature, time, and pressure had significant influence on the Au, Ag, and Pd leaching from (SCWO + HL)-treated waste PCBs. The optimal SCWO pre-treatment conditions were 420 °C and 60 min for Au and Pd, and 410 °C and 30 min for Ag. The optimum dissolution parameters for Au, Pd, and Ag in (SCWO + HL)-treated PCBs with iodine–iodide system were leaching time of 120 min (90 min for Ag), iodine/iodide mole ratio of 1:5 (1:6 for Ag), solid-to-liquid ratio (S/L) of 1:10 g/mL (1:8 g/mL for Ag), and pH of 9, respectively. It is believed that the process developed in this study is environment friendly for the recovery of Au, Ag, and Pd from waste PCBs of mobile phones by SCWO pre-treatment combined with iodine–iodide leaching process.

  6. PCB (Polychlorinated Biphenyls) retrofill: Fact or fiction

    SciTech Connect

    Seifert, G.D.

    1990-01-01

    PCB transformers changes form the fire safety engineers friend to the environmental engineers worst nightmare, when it became apparent that PCB filled devices are a source of highly toxic chemicals when they are burned improperly. This concern, combined with new regulations, is prompting engineers worldwide to actively plan and design PCB replacements. The two most commonly used PCB mitigation methods are retrofill and retrofit. This report will address retrofill only and is directed toward environmental concerns, facility interfaces, outage requirements, and application questions. This information is offered to help engineers make informed decisions regarding the best way to replace PCB transformers. This overview also addresses whether PCB retrofill is a viable fact'' or is it fiction'' without merit. 3 figs.

  7. ENVIROGARD™ PCB TEST KIT, MILLIPORE, INC. - INNOVATIVE TECHNOLOGY EVALUATION REPORT

    EPA Science Inventory

    The Envirogard™ polychlorinated biphenyl (PCB) immunoassay test kit rapidly analyzes for PCB concentrations in soils. Soils samples are extracted using methanol; extracts and calibration solutions are added to test tubes coated with antibodies that bind PCB molecules. The soil ex...

  8. PCB tester selection for future systems. Volume 1. Final report, August 1989-June 1991

    SciTech Connect

    Schmitt, W.

    1992-06-01

    This report describes a computer program (to run on an IBM compatible PC) designed to aid in the selection of a PCB tester, given the characteristics of the PC board to be tested. The program contains a limited data base of PCB testers, and others may be added easily. This report also provides a specification for a limited family of PCB testers to fill the gap between what the U.S. Air Force is expected to need and what is expected to be available within the next four to six years. The parameters used in the computer program and the specification are based on a survey of military and commercial PCBs - both those now available and those expected to come on line within the next four to six years. The results of the survey are covered in volume 2 - available from DTIC. Automatic Test Equipment, Technology Forecast, Air Force Avionics.

  9. PCB tester selection for future systems. Volume 2. Final report, August 1989-June 1991

    SciTech Connect

    Schmitt, W.

    1992-06-01

    This report describes a computer program (to run on an IBM compatible PC) designed to aid in the selection of a PCB tester, given the characteristics of the PC board to be tested. The program contains a limited data base of PCB testers, and others may be added easily. This report also provides a specification for a limited family of PCB testers to fill the gap between what the U.S. Air Force is expected to need and what is expected to be available within the next four to six years. The parameters used in the computer program and the specification are based on a survey of military and commercial PCBs - both those now available and those expected to come on line within the next four to six years. The results of the survey are covered in volume 2 - available from DTIC. Automatic Test Equipment, Technology Forecast, Air Force Avionics.

  10. BEHAVIORAL ASSESSMENTS OF ADULTS RATS EXPOSED PERINATALLY TO PCB153.

    EPA Science Inventory

    Ortho-substituted polychlorinated biphenyl (PCB) congeners are more neurotoxic in vitro than are non-ortho-substituted PCB congeners. We selected PCB153, a common ortho-substituted PCB congener, to evaluate the neurobehavioral toxicity of this class of PCBs in vivo. Pregnant fema...

  11. 40 CFR 761.2 - PCB concentration assumptions for use.

    Code of Federal Regulations, 2014 CFR

    2014-07-01

    ..., and whose PCB concentration is not established is PCB-Contaminated Electrical Equipment (i.e., contains ≥50 ppm PCB, but pad-mounted distribution transformers... electrical equipment manufactured after July 2, 1979, is non-PCB (i.e., <50 ppm PCBs). If the date...

  12. DEMONSTRATION BULLETIN: CLOR-N-SOIL PCB TEST KIT L2000 PCB/CHLORIDE ANALYZER - DEXSIL CORP.

    EPA Science Inventory

    DEXSIL CORP(Environmental Test Kits)The Dexsil Corporation (Dexsil) produces two test kits that detect polychlorinated biphenyls (PCB) in soil: the Dexsil Clor-N-Soil PCB Screening Kit, and the Dexsil L2000 PCB/Chloride Analyzer. The Dexsil Clor-N-Soil PCB Screening Kit extr...

  13. Uptake and depuration of PCB 77, PCB 169, and hexachlorobenzene by zebra mussels (Dreissena polymorpha)

    SciTech Connect

    Brieger, G.; Hunter, R.D. )

    1993-10-01

    Zebra mussels (Dreissena polymorpha) were examined for their ability to take up and depurate hexachlorobenzene (HCB), 3,3',4,4'-tetrachlorobiphenyl (PCB 77), and 3,3',4,4',5,5'-hexachlorobiphenyl (PCB 169) in the laboratory. The intent was to investigate response to acute exposure at high contaminant levels and to observe the time course of depuration. Tissue loads of all three compounds taken up from food increased rapidly and peaked after 10 (PCB 169), 14 (PCB 77), and 21 (HCB) days followed by rapid depuration to equilibrium levels. Peak tissue loads were 3.7, 3.4, and 3.6 micrograms/g for PCB 169, PCB 77, and HCB, respectively (wet weight basis). Equilibrium levels were approximately 1.0 microgram/g for both PCB 169 and HCB. Uptake rate of PCB 77 followed the order: sediment > food > water. Dreissena sampled from five Great Lakes field sites had tissue Aroclor loads ranging from 120 to 530 ng/g for Aroclor 1242 and 33 to 270 ng/g for Aroclor 1254 (wet weight basis). PCB 77 was detected at 1.9 ng/g at one site. Tissue levels for both Aroclors in Dreissena were approximately 10 times those of Lampsilis siliquoidea, a unionid bivalve to which they were attached. Where Dreissena reaches high densities, it is likely to play a significant role in contaminant dynamics.

  14. Uptake and depuration of PCB 77, PCB 169, and hexachlorobenzene by zebra mussels (Dreissena polymorpha).

    PubMed

    Brieger, G; Hunter, R D

    1993-10-01

    Zebra mussels (Dreissena polymorpha) were examined for their ability to take up and depurate hexachlorobenzene (HCB), 3,3',4,4'-tetrachlorobiphenyl (PCB 77), and 3,3',4,4',5,5'-hexachlorobiphenyl (PCB 169) in the laboratory. The intent was to investigate response to acute exposure at high contaminant levels and to observe the time course of depuration. Tissue loads of all three compounds taken up from food increased rapidly and peaked after 10 (PCB 169), 14 (PCB 77), and 21 (HCB) days followed by rapid depuration to equilibrium levels. Peak tissue loads were 3.7, 3.4, and 3.6 micrograms/g for PCB 169, PCB 77, and HCB, respectively (wet weight basis). Equilibrium levels were approximately 1.0 microgram/g for both PCB 169 and HCB. Uptake rate of PCB 77 followed the order: sediment > food > water. Dreissena sampled from five Great Lakes field sites had tissue Aroclor loads ranging from 120 to 530 ng/g for Aroclor 1242 and 33 to 270 ng/g for Aroclor 1254 (wet weight basis). PCB 77 was detected at 1.9 ng/g at one site. Tissue levels for both Aroclors in Dreissena were approximately 10 times those of Lampsilis siliquoidea, a unionid bivalve to which they were attached. Where Dreissena reaches high densities, it is likely to play a significant role in contaminant dynamics.

  15. Optimizing the Design of Avionics Lightning Suppression Circuits

    NASA Astrophysics Data System (ADS)

    McCreary, Clay Allen

    This dissertation documents research into optimizing the design of lightning suppression circuits for electronic equipment used on aircraft (avionics). Aircraft manufacturers are increasingly using carbon composite material for the fabrication of the airframe instead of aluminum, and avionics have become more integrated. This has resulted in avionics with higher signal density at the interface being exposed to transients with wider pulse widths and increased levels from the indirect effects of lightning. This dissertation details the development of techniques to select the smallest components and minimum printed circuit board trace dimensions that can tolerate given lightning transient levels. Also, there is a desire to upgrade existing avionics to tolerate the more severe indirect effects of lightning requirements for composite aircraft. This requires evaluation of the immunity of existing designs to new transient levels and different waveforms than those to which they are certified. This evaluation determines if additional protection is needed. The evaluation technique is described, and methods for providing additional protection are given within this document. Lastly, graphical user interfaces (GUI) are created to perform all of the calculations for component selection, minimum PCB trace width, and the first step in evaluating existing designs against new requirements.

  16. PCB spill response and notification requirements

    SciTech Connect

    1994-12-01

    Polychlorinated biphenyls (PCBs) are a class of organic chemicals that had become widely used in industrial applications due to their practical physical and chemical properties. Historical uses of PCBs include dielectric fluids (used in utility transformers, capacitors, etc.), hydraulic fluids, and other applications requiring stable, fire-retardant materials. Due to findings that PCBs may cause adverse health effects and due to their persistence and accumulation in the environment. The Toxic Substances Control Act (TSCA), enacted on october 11, 1976, banned the manufacture of PCBs after 1978 [Section 6(e)]. The first PCB regulations, promulgated at 40 CFR Part 761, were finalized on February 17, 1978. These PCB regulations include requirements specifying disposal methods and marking (labeling) procedures, and controlling PCB use. To assist the Department of Energy (DOE) in its efforts to comply with the TSCA statute and implementing regulations, the Office of Environmental Guidance has prepared the document ``Guidance on the Management of Polychlorinated Biphenyls (PCBs).`` That document explains the requirements specified in the statute and regulations for managing PCBs including PCB use, storage, transport, and disposal. The Environmental Protection Agency (EPA) established regulations at 40 CFR 761 Subpart G for the reporting and cleanup of spills resulting from the release of any quantity of material containing PCBs at concentrations of {ge} 50 ppm. The regulations, known collectively as the TSCA Spill Cleanup Policy, contain requirements for the notification, cleanup, decontamination verification, and recordkeeping of PCB spills. This Information Brief supplements the PCB guidance document by responding to common questions concerning PCB spill response and notification requirements. It is one of a series of Information Briefs pertinent to PCB management issues.

  17. No-warp potted circuits

    NASA Technical Reports Server (NTRS)

    Robinson, W. W.

    1979-01-01

    Sponge inserts compensate for potting-compound expansion and relieve thermal stresses on circuit boards. Technique quality of production runs on PC boards intended for applications in environments less severe than those for aerospace equipment. Pads reduce weight of modules because they weigh far less than potting compound they displace.

  18. Polychlorinated biphenyl (PCB) effects, PCB congener distributions, and cytochrome P-450 regulation in fish

    SciTech Connect

    Elskus, A.A.

    1992-01-01

    PCB studies were conducted in gonadally mature winter flounder (Pseudopleuronectes americanus) collected from spawning grounds with different degrees of PCB contamination. Flounder from Fox Is., RI, Gaspee Pt., RI and New Bedford, MA (US) had mean hepatic PCB concentrations between 1.6-10.6, 3.8-17.7, and 58-333 {mu}g PCB/g dry liver, respectively. PCB congener distributions in these flounder indicated that PCB disposition was not influenced by reproductive condition, that these migratory fish accumulate a significant portion of their PCB body burden during residence in their spawning grounds, and that flounder selectively metabolize congeners with adjacent meta-, para-unsubstituted carbon atoms. The most significant reproductive effect of PCBs in flounder was a 32 to 52% decrease in the mean ovarian size of highly contaminated females from New Bedford. Plasma levels of the sex hormones, estradiol and testosterone, and of the egg yolk precursor, vitellogenin, as well as hepatic estradiol metabolism (measured as estradiol 2-hydroxylase), showed no relationship to hepatic PCB concentration. PCB effects on flounder P4501A indicated that hepatic PCB concentrations as low as 0.9 {mu}g PCB/g were associated with decreased P4501A catalytic efficiency. Additional suppression of flounder P4501A by estrogens was suggested by depressed levels of P4501A messenger RNA, protein and catalytic activity in highly contaminated female fish with high estradiol titers. The mechanism of P4501A suppression by estrogens was studied in killifish (Fundulus heteroclitus) treated wit {beta}-napthoflavone ({beta}-NF), a P4501A inducer, and/or estradiol.

  19. Polychlorinated biphenyl (PCB)-degrading bacteria associated with trees in a PCB-contaminated site.

    PubMed

    Leigh, Mary Beth; Prouzová, Petra; Macková, Martina; Macek, Tomás; Nagle, David P; Fletcher, John S

    2006-04-01

    The abundance, identities, and degradation abilities of indigenous polychlorinated biphenyl (PCB)-degrading bacteria associated with five species of mature trees growing naturally in a contaminated site were investigated to identify plants that enhance the microbial PCB degradation potential in soil. Culturable PCB degraders were associated with every plant species examined in both the rhizosphere and root zone, which was defined as the bulk soil in which the plant was rooted. Significantly higher numbers of PCB degraders (2.7- to 56.7-fold-higher means) were detected in the root zones of Austrian pine (Pinus nigra) and goat willow (Salix caprea) than in the root zones of other plants or non-root-containing soil in certain seasons and at certain soil depths. The majority of culturable PCB degraders throughout the site and the majority of culturable PCB degraders associated with plants were identified as members of the genus Rhodococcus by 16S rRNA gene sequence analysis. Other taxa of PCB-degrading bacteria included members of the genera Luteibacter and Williamsia, which have not previously been shown to include PCB degraders. PCB degradation assays revealed that some isolates from the site have broad congener specificities; these isolates included one Rhodococcus strain that exhibited degradation abilities similar to those of Burkholderia xenovorans LB400. Isolates with broad congener specificity were widespread at the site, including in the biostimulated root zone of willow. The apparent association of certain plant species with increased abundance of indigenous PCB degraders, including organisms with outstanding degradation abilities, throughout the root zone supports the notion that biostimulation through rhizoremediation is a promising strategy for enhancing PCB degradation in situ.

  20. Atmospheric PCB congeners across Chicago

    PubMed Central

    HU, DINGFEI; LEHMLER, HANS-JOACHIM; MARTINEZ, ANDRES; WANG, KAI; HORNBUCKLE, KERI C.

    2010-01-01

    We have measured PCBs in 184 air samples collected at 37 sites in the city of Chicago using an innovative system of high-volume air samplers mounted on two health clinic vans. Here we describe results of sampling conducted from November 2006 to November 2007. The samples were analyzed for all 209 PCB congeners using a gas chromatograph with tandem mass spectrometry (GC-MS/MS). The ΣPCBs (sum of 169 peaks) in Chicago ranged from 75 pg m−3 to 5500 pg m−3 and primarily varied as a function of temperature. The congener patterns are surprisingly similar throughout the city even though the temperature-corrected concentrations vary by more than an order of magnitude. The average profile resembles a mixture of Aroclor 1242 and Aroclor 1254, and includes many congeners that have been identified as being aryl hydrocarbon receptor (AhR) agonists (dioxin-like) and/or neurotoxins. The toxic equivalence (TEQ) and neurotoxic equivalence (NEQ) in air were calculated and investigated for their spatial distribution throughout the urban-industrial complex of Chicago. The NEQ concentrations are linearly correlated with ΣPCBs while the TEQ concentrations are not predictable. The findings of this study suggest that airborne PCBs in Chicago are widely present and elevated in residential communities; there are multiple sources rather than one or a few locations of very high emissions; the emission includes congeners associated with dioxin-like and neurotoxic effects and congeners associated with unidentified sources. PMID:21918637

  1. Congenital PCB poisoning: a reevaluation

    SciTech Connect

    Miller, R.W.

    1985-05-01

    A review of the literature reveals a need to clarify the pathologic physiology of congenital polychlorinated biphenyl (PCB) poisoning, which is characterized by intrauterine growth retardation, brown staining of the skin and mucous membranes as in Addison's disease, natal teeth, widely open fontanelles and sagittal suture and apparent overgrowth of the gingiva. The skull abnormalities may represent irregular calcification, with natal teeth appearing because the bone of the mandible is penetrated more easily than usual. Some fetuses were poisoned at the time the mothers ingested the oil; others were affected in the subsequent years from residual contamination in the mothers' bodies. The misadventure in Japan was repeated in Taiwan in 1979. The seven congenital cases in Taiwan reported thus far seem to differ from those in Japan. In Taiwan the noses were somewhat black, two of the infants did not have low birth weight and the osseous abnormalities of the skull and gingival hyperplasia were not observed. Systematic followup studies should be made in Taiwan of the children born within 2 years of maternal poisoning with PCBs. Special attention should be given to age at first dentition and skull-X-rays for spotty calcification, among other measures of physical, neurologic and intellectual development.

  2. Atmospheric PCB congeners across Chicago

    NASA Astrophysics Data System (ADS)

    Hu, Dingfei; Lehmler, Hans-Joachim; Martinez, Andres; Wang, Kai; Hornbuckle, Keri C.

    2010-04-01

    We have measured PCBs in 184 air samples collected at 37 sites in the city of Chicago using an innovative system of high-volume air samplers mounted on two health clinic vans. Here we describe results of sampling conducted from November 2006 to November 2007. The samples were analyzed for all 209 PCB congeners using a gas chromatograph with tandem mass spectrometry (GC-MS/MS). The ΣPCBs (sum of 169 peaks) in Chicago ranged from 75 pg m -3 to 5500 pg m -3 and primarily varied as a function of temperature. The congener patterns are surprisingly similar throughout the city even though the temperature-corrected concentrations vary by more than an order of magnitude. The average profile resembles a mixture of Aroclor 1242 and Aroclor 1254, and includes many congeners that have been identified as being aryl hydrocarbon receptor (AhR) agonists (dioxin-like) and/or neurotoxins. The toxic equivalence (TEQ) and neurotoxic equivalence (NEQ) in air were calculated and investigated for their spatial distribution throughout the urban-industrial complex of Chicago. The NEQ concentrations are linearly correlated with ΣPCBs while the TEQ concentrations are not predictable. The findings of this study suggest that airborne PCBs in Chicago are widely present and elevated in residential communities; there are multiple sources rather than one or a few locations of very high emissions; the emission includes congeners associated with dioxin-like or neurotoxic effects and congeners associated with unidentified sources.

  3. Visualization of circuit card electromagnetic fields

    NASA Astrophysics Data System (ADS)

    Zwillinger, Daniel

    1995-01-01

    Circuit boards are used in nearly every electrical appliance. Most board failures cause differing currents in the circuit board traces and components. This causes the circuit board to radiate a differing electromagnetic field. Imaging this radiated field, which is equivalent to measuring the field, could be used for error detection. Using estimates of the fields radiated by a low power digital circuit board, properties of known materials, and available equipment, we determined how well the following technologies could be used to visualize circuit board electromagnetic fields (prioritized by promise): electrooptical techniques, magnetooptical techniques, piezoelectric techniques, thermal techniques, and electrodynamic force technique. We have determined that sensors using the electrooptical effect (Pockels effect) appear to be sufficiently sensitive for use in a circuit board imaging system. Sensors utilizing the magnetooptical effect may also be adequate for this purpose, when using research materials. These sensors appear to be capable of achieving direct broadband measurements. We also reviewed existing electromagnetic field sensors. Only one of the sensors (recently patented) was specifically designed for circuit board measurements.

  4. Measuring circuit

    DOEpatents

    Sun, Shan C.; Chaprnka, Anthony G.

    1977-01-11

    An automatic gain control circuit functions to adjust the magnitude of an input signal supplied to a measuring circuit to a level within the dynamic range of the measuring circuit while a log-ratio circuit adjusts the magnitude of the output signal from the measuring circuit to the level of the input signal and optimizes the signal-to-noise ratio performance of the measuring circuit.

  5. Bayesian Monte Carlo updating of Hudson River PCB model using water column PCB measurements

    SciTech Connect

    Zhang, S.; Toll, J.; Cothern, K.

    1995-12-31

    The authors have developed prior probability distributions for model parameters and terms describing physico-chemical processes in sediment and water column models of PCB fate in a segment of the lower Hudson River, and performed importance analyses to identify the key uncertainties affecting the models` predictive power. In this work, the authors employ field measurements of the mean total water column PCB concentration from nearby river segments to refine the prior probability distributions for the important parameters and terms in the water column PCB model, using Bayesian Monte Carlo analysis. The principal objectives of the current work are (1) to implement Bayesian Monte Carlo analysis, to demonstrate the technique and evaluate its potential benefits, and (2) to improve the parameterization of the water column PCB model on the basis of site-specific PCB concentration data. The Bayesian updating procedure resulted in improved estimates of PCB mass loading and re-suspension velocity terms, but posteriors for three other key parameters -- settling velocity and particulate PCB fractions in the water column and surface sediments -- were unaffected by the information extracted from the new field data. In addition, the authors found that some of the high posterior probability parameter vectors, though mathematically plausible, were physically implausible, as a consequence of the unrealistic (but common) Monte Carlo assumption that the model`s parameters are independently distributed. The implications of this and other findings are discussed.

  6. PCB biodegradation: Laboratory studies transitioned into the field

    SciTech Connect

    Abramowicz, D.A.

    1993-12-31

    Two distinct bacterial systems are known to be involved in PCB biotransformations. Both aerobic PCB biodegradation (Oxidative attack) and anaerobic PCB dechlorination (reductive attack) have been demonstrated in the laboratory. These results have been successfully reproducted in recent experiments performed in aquatic sediments. In 1991, GE performed a large scale test of in situ aerobic PCB biodegradation in the Upper Hudson River. The experiments involved six sealed caissons (six feet in diameter) lowered into Aroclor 1242 contaminated sediments that had already undergone extensive anaerobic PCB dechlorination. Stimulation of indigenous PCB-degrading microorganisms resulted in >50% biodegradation over 10 weeks. A large scale stimulation of in situ anaerobic PCB dechlorination in Housatonic River sediments contaminated with untransformed Aroclor 1260 was initiated in 1992. The experiments similarly involve six sealed caissons (six feet in diameter) lowered into contaminated sediments to investigate new methods developed to accelerate PCB dechlorination in the field. Preliminary results from this ongoing field test will be discussed.

  7. Association of blood pressure and PCB level in Yusho patients

    SciTech Connect

    Akagi, K.; Okumura, M.

    1985-02-01

    Correlations of blood polychlorinated biphenyl (PCB) levels or PCB patterns and blood pressures were studied in 59 patients with Yusho (PCB poisoning) above 40 years old. In spite of the passage of 13 years from the onset, 52.5% of these patients still have PCB levels higher than the range found in the general population. The frequency of hypertension in the patients was 16.9%, a value similar to that expected on the basis of the rate for a population of the same age and sex compositions. As an independent variable, the blood pressure of patients was not associated with blood PCB levels and PCB patterns. No PCB blood pressure association was confirmed in 20 patients with PCB levels persistently higher than 5 ppb for 9 years. On the other hand, age, obesity and habitual alcohol intake, known influencing factors for hypertension, tended to be positively associated with elevated blood pressure in these Yusho patients.

  8. High Surface-Enhanced Raman Scattering (SERS) Amplification Factor Obtained with Silver Printed Circuit Boards and the Influence of Phenolic Resins for the Characterization of the Pesticide Thiram.

    PubMed

    Silva de Almeida, Francylaine; Bussler, Larissa; Marcio Lima, Sandro; Fiorucci, Antonio Rogério; da Cunha Andrade, Luis Humberto

    2016-07-01

    In this work, low-cost substrates with rough silver surfaces were prepared from commercial copper foil-covered phenolic board (CPB) and an aqueous solution of AgNO3, and were used for surface-enhanced Raman scattering (SERS) and surface-enhanced resonance Raman scattering (SERRS) measurements. A maximum SERS amplification factor of 1.2 × 10(7) was obtained for Rhodamine 6G (R6G), and use of the CPB resulted in a detection limit for Thiram pesticide of 0.5 µmol L(-1) The minimum detection level was limited by residual traces of phenolic groups that originated from the substrate resin, which became solubilized in the aqueous Ag(+) solution. It was found that the bands corresponding to the impurities had less influence in the Thiram analysis, which could be explained by the high affinity of sulfur for Ag surfaces. The influence of impurities in the SERS analyses therefore depended on the linkage between the rough silver surface and the analyte. The findings demonstrated the ease and effectiveness of using CPB to prepare a nanostructured surface for SERS.

  9. High Surface-Enhanced Raman Scattering (SERS) Amplification Factor Obtained with Silver Printed Circuit Boards and the Influence of Phenolic Resins for the Characterization of the Pesticide Thiram.

    PubMed

    Silva de Almeida, Francylaine; Bussler, Larissa; Marcio Lima, Sandro; Fiorucci, Antonio Rogério; da Cunha Andrade, Luis Humberto

    2016-07-01

    In this work, low-cost substrates with rough silver surfaces were prepared from commercial copper foil-covered phenolic board (CPB) and an aqueous solution of AgNO3, and were used for surface-enhanced Raman scattering (SERS) and surface-enhanced resonance Raman scattering (SERRS) measurements. A maximum SERS amplification factor of 1.2 × 10(7) was obtained for Rhodamine 6G (R6G), and use of the CPB resulted in a detection limit for Thiram pesticide of 0.5 µmol L(-1) The minimum detection level was limited by residual traces of phenolic groups that originated from the substrate resin, which became solubilized in the aqueous Ag(+) solution. It was found that the bands corresponding to the impurities had less influence in the Thiram analysis, which could be explained by the high affinity of sulfur for Ag surfaces. The influence of impurities in the SERS analyses therefore depended on the linkage between the rough silver surface and the analyte. The findings demonstrated the ease and effectiveness of using CPB to prepare a nanostructured surface for SERS. PMID:27279502

  10. 40 CFR 761.61 - PCB remediation waste.

    Code of Federal Regulations, 2010 CFR

    2010-07-01

    ... 40 Protection of Environment 30 2010-07-01 2010-07-01 false PCB remediation waste. 761.61 Section... PROHIBITIONS Storage and Disposal § 761.61 PCB remediation waste. This section provides cleanup and disposal options for PCB remediation waste. Any person cleaning up and disposing of PCBs managed under this...

  11. DEMONSTRATION BULLETIN: ENVIROGARD™ PCB TEST KIT - MILLIPORE, INC.

    EPA Science Inventory

    The EnviroGard™ polychlorinated biphenyl (PCB) immunoassay test kit rapidly analyzes for PCB concentrations in soils. Soil sample extracts are added to test tubes coated with antibodies that bind PCB molecules. The excess soil extracts are washed out of the tubes after incubat...

  12. Driver circuit

    NASA Technical Reports Server (NTRS)

    Matsumoto, Raymond T. (Inventor); Higashi, Stanley T. (Inventor)

    1976-01-01

    A driver circuit which has low power requirements, a relatively small number of components and provides flexibility in output voltage setting. The driver circuit comprises, essentially, two portions which are selectively activated by the application of input signals. The output signal is determined by which of the two circuit portions is activated. While each of the two circuit portions operates in a manner similar to silicon controlled rectifiers (SCR), the circuit portions are on only when an input signal is supplied thereto.

  13. High transmission 3D printed flex-PCB-based ion funnel.

    PubMed

    Tridas, Eric Miguel; Allemang, Christopher; Mast, Fabian; Anthony, J Mark; Schlaf, Rudiger

    2015-07-01

    In this study a novel fabrication method for a radio frequency (RF) ion funnel is presented. RF ion funnels are important devices for focusing ion clouds at low vacuum conditions for mass spectrometry or deposition-related applications. Typically, ion funnels are constructed of stainless steel plate ring electrodes with a decreasing diameter where RF and direct current potentials are applied to the electrodes to focus the ion cloud. The presented novel design is based on a flexible circuit board that serves both as the signal distribution circuit and as the electrodes of the ion funnel. The flexible circuit board is rolled into a 3D printed scaffold to create a funnel shape with ring electrodes formed by the copper electrodes of the flexible circuit board. The design is characterized in direct comparison with a conventional steel-plate electrode design. The discussed results show that the new funnel has similar performance to the conventionally designed funnel despite much lower manufacturing costs.

  14. Herring gull eggs indicate stabilizing Great Lakes PCB concentrations

    SciTech Connect

    Stow, C.

    1995-12-31

    The author evaluated the fit of 3 alternative models to herring gull (Larus argentatus) egg PCB concentration data from 1978--1992 to examine whether PCB levels were decreasing or had ceased to decline. The best fit models indicate that, following initial declines, no discernible PCB decreases are occurring in 4 of the 5 lakes. Only Lake Erie indicates a continued PCB decline, though the Erie data may be too noisy to differentiate model fits. These results are consistent with previous analyses indicating stable PCB concentrations in Lake Michigan fishes and suggest that further improvements may be too slow to be of practical importance from a management perspective.

  15. Electronics. Module 4: Circuit Construction Techniques. Instructor's Guide.

    ERIC Educational Resources Information Center

    Slack, Don

    This guide contains instructor's materials for a three-unit secondary school course on circuit construction techniques. The units are breadboarding circuits, solder/desolder circuits, and printed circuit board repair. The document begins with advice on its use and a cross-referenced table of instructional materials that show which materials in the…

  16. PUZZLE - A program for computer-aided design of printed circuit artwork

    NASA Technical Reports Server (NTRS)

    Harrell, D. A. W.; Zane, R.

    1971-01-01

    Program assists in solving spacing problems encountered in printed circuit /PC/ design. It is intended to have maximum use for two-sided PC boards carrying integrated circuits, and also aids design of discrete component circuits.

  17. Environmental and health hazards from recycling PCB sources

    SciTech Connect

    Greichus, Y.A.; Dohman, B.A.

    1980-06-01

    Soil, corn plants, foliage, earthworms, and small rodents from areas surrounding two electrical salvage companies involved in reconditioning old transformers had unusually high levels of PCB's. Levels decreased as distance from the factories increased. PCB's were dispersed into the air through incineration of waste oils; water and soil contamination was caused by runoff from the factories. PCB's found to be present in the contaminated areas and in the waste oil closely resembled Aroclor 1260. Soil samples taken from depths of 2-4 in showed degradation of some PCB isomers. PCB concentrations in corn cobs and kernels were 0.05 ppm, whereas leaves contained PCB levels of up to 2.2 ppm. PCB levels in earthworms and small rodents collected near the factories were considerably higher than levels in the same types of animals collected from other areas. (10 references, 2 tables)

  18. Hybrid stretchable circuits on silicone substrate

    SciTech Connect

    Robinson, A. Aziz, A.; Liu, Q.; Suo, Z.; Lacour, S. P.

    2014-04-14

    When rigid and stretchable components are integrated onto a single elastic carrier substrate, large strain heterogeneities appear in the vicinity of the deformable-non-deformable interfaces. In this paper, we report on a generic approach to manufacture hybrid stretchable circuits where commercial electronic components can be mounted on a stretchable circuit board. Similar to printed circuit board development, the components are electrically bonded on the elastic substrate and interconnected with stretchable electrical traces. The substrate—a silicone matrix carrying concentric rigid disks—ensures both the circuit elasticity and the mechanical integrity of the most fragile materials.

  19. Adhesive-backed terminal board eliminates mounting screws

    NASA Technical Reports Server (NTRS)

    1965-01-01

    Low-profile terminal board is used in dense electronic circuits where mounting and working space is limited. The board has a thin layer of pressure-sensitive adhesive backing which eliminates the need for mounting screws.

  20. View southwest of model board and operator's station #2; cabinet ...

    Library of Congress Historic Buildings Survey, Historic Engineering Record, Historic Landscapes Survey

    View southwest of model board and operator's station #2; cabinet in foreground houses at supervisory board and control switches for circuit breakers - Thirtieth Street Station, Power Director Center, Thirtieth & Market Streets in Amtrak Railroad Station, Philadelphia, Philadelphia County, PA

  1. Disposable Electrochemical Immunosensors for Pcb Detection

    NASA Astrophysics Data System (ADS)

    Laschi, S.; Mascini, M.; Fránek, M.

    2000-12-01

    We realised an electrochemical enzyme immunoassay for polychlorinated biphenyls (PCB) using carbon-based screen-printed disposable electrodes as solid-phase for reagent immobilisation and as signal transducer. Horseradish peroxidase (HRP) conjugate with Ag or Ab as enzyme label was used; hydrogen peroxide and ferrocenemonocarboxylic acid (FCA) as mediator were employed in order to evaluate the HRP activity in the range 10-8-10-10 M. Indirect and direct competitive assays for PCB were performed and a detection limit of 0.01 μg/mL was obtained in direct competitive format. The advantage of this approach is the relatively fast analysis (30 min) in comparison with a test based on microtiter assay plates (14h); moreover, the use of disposable screen-printed electrodes eliminates the problems of fouling and surface regeneration of electrochemical device.

  2. ADDER CIRCUIT

    DOEpatents

    Jacobsohn, D.H.; Merrill, L.C.

    1959-01-20

    An improved parallel addition unit is described which is especially adapted for use in electronic digital computers and characterized by propagation of the carry signal through each of a plurality of denominationally ordered stages within a minimum time interval. In its broadest aspects, the invention incorporates a fast multistage parallel digital adder including a plurality of adder circuits, carry-propagation circuit means in all but the most significant digit stage, means for conditioning each carry-propagation circuit during the time period in which information is placed into the adder circuits, and means coupling carry-generation portions of thc adder circuit to the carry propagating means.

  3. PCB levels in human fluids: Sheboygan cohort study, Sheboygan maternal/infant PCB study

    SciTech Connect

    Smith, B.J.

    1983-01-01

    The PCB problem in the United States today has been raised to national concern with the discovery of PCBs in human breast milk above the highest recommended level for any commercially sold flood. This study, done in Sheboygan, Wisconsin in 1980-81, was to determine if (1) there were high levels of PCBs in mother's serum and breast milk in the vicinity of a PCB spill, (2) if these levels could be linked to the women's consumption of local fish, and (3) if the infants born to these women in the study showed signals of impaired health, growth, and development. Seventy-three women participated in the study, 62 who were breast-feeding their children, and 11 who were bottle-feeding their children. The serum PCB levels for the study population ranged from 1.29 to 14.90 ppb with a mean of 5.76 ppb. The breast milk PCB levels for the women who were breast feeding was 0.29 to 4.04 ppm with a mean of 1.13 ppm. The infants showed signs of impaired health as a result of in utero exposure to PCBs. No negative effects from exposure to breast milk PCB could be discerned up to 4 months postpartum.

  4. PCB's in Suburban Watershed, Reston, Va

    USGS Publications Warehouse

    Martell, J.M.; Rickert, D.A.; Siegel, F.R.

    1975-01-01

    Polychlorinated biphenyl concentrations in Lake Anne basin increased from water (<0.05-0.2 ppb), to bed sediment (<2.5-105 ppb), to fish (140-700 ppb) in an average ratio of 1:500:3000. The highest concentrations were observed in the lake, which is 10 years old, and receives no sewage or industrial waste discharges. Evidence indicates that the polvchlorinated biphenyls (PCB's) originate from diffuse sources associated with urban development and living.

  5. Decontamination and disposal of PCB wastes.

    PubMed Central

    Johnston, L E

    1985-01-01

    Decontamination and disposal processes for PCB wastes are reviewed. Processes are classed as incineration, chemical reaction or decontamination. Incineration technologies are not limited to the rigorous high temperature but include those where innovations in use of oxident, heat transfer and residue recycle are made. Chemical processes include the sodium processes, radiant energy processes and low temperature oxidations. Typical processing rates and associated costs are provided where possible. PMID:3928363

  6. PCB concentrations of lake whitefish (Coregonus clupeaformis) vary by sex

    USGS Publications Warehouse

    Madenjian, Charles P.; Ebener, Mark P.; Sepulveda, Maria S.

    2015-01-01

    We determined whole-fish polychlorinated biphenyl (PCB) concentrations in 26 female lake whitefish (Coregonus clupeaformis) and 34 male lake whitefish from northern Lake Huron. In 5 of the 26 female lake whitefish, we also determined PCB concentrations in the somatic tissue and ovaries. In addition, bioenergetics modeling was used to determine the contribution of the growth dilution effect to the observed difference in PCB concentrations between the sexes. Whole-fish PCB concentrations for females and males averaged 60 ng/g and 80 ng/g, respectively; thus males were 34% higher in PCB concentration compared with females. Based on the PCB determinations in the somatic tissue and ovaries, we predicted that PCB concentration of females would increase by 2.5%, on average, immediately after spawning due to release of eggs. Thus, the change in PCB concentration due to release of eggs did not explain, to any degree, the higher PCB concentrations observed in males compared with females. Bioenergetics modeling results indicated that the growth dilution effect could account for males being only 0.7% higher in PCB concentration compared with females. Thus, the growth dilution effect contributed very little to the observed difference in PCB concentrations between the sexes. We conclude that males were higher than females in PCB concentration most likely due to a higher rate of energy expenditure, stemming from greater activity and a greater resting metabolic rate. A higher rate of energy expenditure leads to a higher rate of food consumption, which, in turn, leads to a higher PCB accumulation rate.

  7. Serum PCB levels and congener profiles among US construction workers

    PubMed Central

    Herrick, Robert F; Meeker, John D; Hauser, Russ; Altshul, Larisa; Weymouth, George A

    2007-01-01

    Background The presence of PCB in caulking (sealant) material found in masonry buildings has been well-documented in several countries. A recent investigation of 24 buildings in the greater Boston area found that 8 buildings had high PCB levels in caulking materials used around window frames and in joints between masonry blocks. Workers removing caulking material have been shown to have elevated serum PCB levels. Methods This project compared serum PCB levels among male workers who installed and/or removed PCB-containing caulking material from buildings in the greater Boston area with reference serum PCB levels from 358 men from the same area. Serum PCB levels were measured in the same laboratory by liquid-liquid extraction, column chromatography clean-up and dual capillary column GC/microECD analysis. Results When the congener profiles were compared between the reference population and the construction workers, the serum levels of the more volatile, lighter PCBs (di-, tri-and tetrachloro, sum of IUPAC# 6–74) were substantially higher among the construction workers. One of the youngest workers had the lowest total serum PCB levels (sum of 57 congeners) of all 6 workers, but the contribution of more volatile (less chlorinated) PCB congeners (#16, 26,28,33,74,66, and 60) was markedly higher than in other 5 workers and reference men. Only this worker was working on a job that involved removing PCB caulking at the time of the blood sampling. Conclusion While the results of this pilot study are based upon small numbers (6 construction workers who handled PCB caulking), the serum PCB levels among the construction workers exceed the referents. Comparison of the congener profiles suggests that there are substantial differences between the construction workers and the general population samples. These differences, and the similarities of profiles among the construction workers strongly suggest that occupational contact with caulking material can be a major source of PCB

  8. Design, fabrication, and characterization of archaeal tetraether free-standing planar membranes in a PDMS- and PCB-based fluidic platform.

    PubMed

    Ren, Xiang; Liu, Kewei; Zhang, Qingwei; Noh, Hongseok Moses; Kumbur, E Caglan; Yuan, Wenqiao Wayne; Zhou, Jack G; Chong, Parkson Lee-Gau

    2014-08-13

    The polar lipid fraction E (PLFE) isolated from the thermoacidophilic archaeon Sulfolobus acidocaldarius contains exclusively bipolar tetraether lipids, which are able to form extraordinarily stable vesicular membranes against a number of chemical, physical, and mechanical stressors. PLFE liposomes have thus been considered appealing biomaterials holding great promise for biotechnology applications such as drug delivery and biosensing. Here we demonstrated that PLFE can also form free-standing "planar" membranes on micropores (∼100 μm) of polydimethylsiloxane (PDMS) thin films embedded in printed circuit board (PCB)-based fluidics. To build this device, two novel approaches were employed: (i) an S1813 sacrificial layer was used to facilitate the fabrication of the PDMS thin film, and (ii) oxygen plasma treatment was utilized to conveniently bond the PDMS thin film to the PCB board and the PDMS fluidic chamber. Using electrochemical impedance spectroscopy, we found that the dielectric properties of PLFE planar membranes suspended on the PDMS films are distinctly different from those obtained from diester lipid and triblock copolymer membranes. In addition to resistance (R) and capacitance (C) that were commonly seen in all the membranes examined, PLFE planar membranes showed an inductance (L) component. Furthermore, PLFE planar membranes displayed a relatively large membrane resistance, suggesting that, among the membranes examined, PLFE planar membrane would be a better matrix for studying channel proteins and transmembrane events. PLFE planar membranes also exhibited a sharp decrease in phase angle with the frequency of the input AC signal at ∼1 MHz, which could be utilized to develop sensors for monitoring PLFE membrane integrity in fluidics. Since the stability of free-standing planar lipid membranes increases with increasing membrane packing tightness and PLFE lipid membranes are more tightly packed than those made of diester lipids, PLFE free

  9. AQUEOUS CLEANING OF PRINTED CIRCUIT BOARD STENCILS

    EPA Science Inventory

    The USEPA through NRMRL has partnered with the California Dept. of Toxic Substance Control under an ETV Pilot Project to verigy polllution prevention, recycling and waste treatment technologies. One of the projects selected for verification was the ultrasonic aqueous cleaning tec...

  10. Variation in net trophic transfer efficiencies among 21 PCB congeners

    USGS Publications Warehouse

    Madenjian, C.P.; Schmidt, L.J.; Chernyak, S.M.; Elliott, R.F.; Desorcie, T.J.; Quintal, R.T.; Begnoche, L.J.; Hesselberg, R.J.

    1999-01-01

    We tested the hypothesis that the efficiency with which fish retain polychlorinated biphenyl (PCB) congeners from their food strongly depends on Kow and degree of chlorination of the congener. We used diet information, determinations of concentrations of individual PCB congeners in both coho salmon (Oncorhynchus kisutch) and their prey, and bioenergetics modeling to estimate the efficiencies with which Lake Michigan coho salmon retain various PCB congeners from their food. The retention efficiency for the tetrachloro congeners averaged 38%, whereas retention efficiencies for higher chlorinated congeners ranged from 43 to 56%. Not including tetrachloro congeners, we found neither decreasing nor increasing trends in the efficiencies with which the coho salmon retained the PCB congeners from their food with either increasing Kow or increasing degree of chlorination of the PCB congeners. We concluded that (a) for PCB congeners with 5−8 chlorine atoms/molecule, Kow and degree of chlorination had little influence on the efficiency with which coho salmon retained the various PCB congeners in their food, and (b) the efficiency with which coho salmon retained tetrachloro PCB congeners in their food appeared to be slightly lower than that for higher chlorinated PCB congeners.

  11. Estimating whole-body fish PCB concentrations from fillet data

    SciTech Connect

    Rigg, D.; Hohreiter, D.; Strause, K.; Brown, M.; Barnes, C.

    1995-12-31

    A study was designed to assess a potentially cost-effective method for generating both types of data from single fish specimens. The method is based on the testable hypothesis that whole-body PCE concentrations are predictable from fillet PCB concentrations and fillet and whole-body lipid concentrations. The study involved the collection of small-mouth bass (Micropterus dolomieui) and carp (Cyprinus carpio) from several locations in the Kalamazoo River (Michigan) watershed to represent a range in PCB exposure. PCB and lipid concentrations were determined in aliquots of homogenized fillets and remaining carcasses. Wet-weight total PCB concentrations in carp ranged from 0.06 to 17 mg/kg in fillets, and from 0.11 to 14 mg/kg for remaining carcass; small-mouth bass ranged from 0.08 to 5.8 mg/kg in fillets, and from 0.21 to 13.2 mg/kg for remaining carcass. Whole-body PCB concentrations predicted using fillet PCB concentrations and fillet and carcass lipid concentrations accounted for 94% and 88% of the variability in measured whole-body small-mouth and whole-body carp concentrations, respectively. Predicted and measured whole-body PCB concentrations had a correlation of 91% for small-mouth bass, and 84% for carp. These results demonstrate that value of the lipid-based model in predicting whole-body PCB concentrations from measured fillet PCB concentrations and lipid concentrations in fillet and remaining carcass.

  12. Gender difference in walleye PCB concentrations persists following remedial dredging

    USGS Publications Warehouse

    Madenjian, Charles P.; Jude, David J.; Rediske, Richard R.; O'Keefe, James P.; Noguchi, George E.

    2009-01-01

    Eleven male walleyes (Sander vitreus) and 10 female walleyes from the Saginaw Bay (Lake Huron) population were caught during the spawning run at Dow Dam (Midland, Michigan) in the Tittabawassee River during April 1996, and individual whole-fish polychlorinated biphenyl (PCB) determinations were made. Total PCB concentrations averaged 7.95 and 3.17??mg/kg for males and females, respectively. As part of the Natural Resource Damage Assessment remediation process, contaminated sediments from the Saginaw River, the main tributary to Saginaw Bay, were removed during 2000 and 2001. Total PCB concentrations of 10 male and 10 female walleyes caught at Dow Dam during April 2007 averaged 1.58 and 0.55??mg/kg, respectively. Thus, dredging of the Saginaw River appeared to be effective in reducing PCB concentrations of Saginaw Bay adult walleyes, as both males and females decreased in PCB concentration by more than 80% between 1996 and 2007. However, the ratio of male PCB concentration to female PCB concentration did not decline between 1996 and 2007. This persistent gender difference in PCB concentrations was apparently due to a gender difference in habitat utilization coupled with a persistent spatial gradient in prey fish PCB concentrations from the Saginaw River to Lake Huron.

  13. COVE, MARINA, and the Future of On-Board Processing (OBP) Platforms for CubeSat Science Missions

    NASA Astrophysics Data System (ADS)

    Pingree, P.; Bekker, D. L.; Bryk, M.; DeLucca, J.; Franklin, B.; Hancock, B.; Klesh, A. T.; Meehan, C.; Meshkaty, N.; Nichols, J.; Peay, C.; Rider, D. M.; Werne, T.; Wu, Y.

    2012-12-01

    The CubeSat On-board processing Validation Experiment (COVE), JPL's first CubeSat payload launched on October 28, 2011, features the Xilinx Virtex-5QV Single event Immune Reconfigurable FPGA (SIRF). The technology demonstration mission was to validate the SIRF device running an on-board processing (OBP) algorithm developed to reduce the data set by 2-orders of magnitude for the Multi-angle SpectroPolarimetric Imager (MSPI), an instrument under development at JPL (PI: D. Diner). COVE has a single data interface to the CubeSat flight computer that is used to transfer a static image taken from the CubeSat camera and store it to local memory where the FPGA then reads it to run the algorithm on it. In the next generation COVE design, called MARINA, developed for the GRIFEX CubeSat project, the OBP board is extended, using rigid-flex PCB technology, to provide an interface to a JPL-developed Read-Out Integrated Circuit (ROIC) hybridized to a detector developed by Raytheon. In this configuration the focal plane array (FPA) data can be streamed directly to the FPGA for data processing or for storage to local memory. The MARINA rigid-flex PCB design is integrated with a commercial camera lens to create a 1U instrument payload for integration with a CubeSat under development by the University of Michigan and planned for launch in 2014. In the GRIFEX technology demonstration, the limited on-board storage capacity is filled by high-rate FPA data in less than a second. The system is also limited by the CubeSat downlink data rate and several ground station passes are required to transmit this limited amount of data. While this system is sufficient to validate the ROIC technology on-orbit, the system cannot be operated in a way to perform continuous science observations due to the on-board storage and data downlink constraints. In order to advance the current platform to support sustained science observations, more on-board storage is needed. Radiation tolerant memory

  14. Low-cost electro-optical package for use with PCB-embedded waveguides

    NASA Astrophysics Data System (ADS)

    Weiss, Jonas; Berger, Christoph; Witzig, Martin; Morf, Thomas; Dangel, Roger; Horst, Folkert; Schmatz, Martin

    2007-09-01

    We present a novel approach for packaging high-speed opto-electronic 12x-array devices in a compact, low-cost package for waveguide-based intra-system links. In order to avoid optical signal loss and crosstalk, the mutual alignment between PCB-embedded multimode waveguides and the opto-electronic components needs to be in the order of 5-10 micrometer, which is an order of magnitude tighter than standard PCB manufacturing tolerances. Our packaging concept uses a combination of passive alignment steps, tolerance stackup reduction and a misalignment-tolerant coupling scheme in order to bridge this gap in a cost competitive way. Using flip-chip technology, the opto-electronic components are placed onto a very thin substrate with holes for the light path. The top side of the 25 μm liquid crystal polymer (LCP) substrate not only provides fast and low-loss electrical connections, but also serves as alignment reference plane for the entire module, avoiding alignment tolerance accumulation over different assembly steps. Openings for the laser beams, passive lens alignment features, centering holes for mechanical alignment pins between module and board and optional MT-guide receptacles are all laser-cut within one single process step, with a precision better than 5 μm. A similar approach is used for the PCB-side optics, and a lens-pair coupling scheme provides for a sufficiently large misalignment tolerance between the package and the PCB. Mechanical rigidity of the package and thermal protection are provided by an epoxy filled aluminum frame. We will present our design considerations, the basic package concept, the actual experimental implementation and characterization results of our first prototype package.

  15. 40 CFR 761.274 - Reporting PCB concentrations in samples.

    Code of Federal Regulations, 2011 CFR

    2011-07-01

    ... 40 Protection of Environment 31 2011-07-01 2011-07-01 false Reporting PCB concentrations in... Accordance with § 761.61(a)(2) § 761.274 Reporting PCB concentrations in samples. (a) Report all sample concentrations for non-liquid PCBs on a dry weight basis as micrograms of PCBs per gram of sample (ppm by...

  16. 40 CFR 761.274 - Reporting PCB concentrations in samples.

    Code of Federal Regulations, 2013 CFR

    2013-07-01

    ... 40 Protection of Environment 32 2013-07-01 2013-07-01 false Reporting PCB concentrations in... Accordance with § 761.61(a)(2) § 761.274 Reporting PCB concentrations in samples. (a) Report all sample concentrations for non-liquid PCBs on a dry weight basis as micrograms of PCBs per gram of sample (ppm by...

  17. 40 CFR 761.274 - Reporting PCB concentrations in samples.

    Code of Federal Regulations, 2012 CFR

    2012-07-01

    ... 40 Protection of Environment 32 2012-07-01 2012-07-01 false Reporting PCB concentrations in... Accordance with § 761.61(a)(2) § 761.274 Reporting PCB concentrations in samples. (a) Report all sample concentrations for non-liquid PCBs on a dry weight basis as micrograms of PCBs per gram of sample (ppm by...

  18. 40 CFR 761.274 - Reporting PCB concentrations in samples.

    Code of Federal Regulations, 2010 CFR

    2010-07-01

    ... 40 Protection of Environment 30 2010-07-01 2010-07-01 false Reporting PCB concentrations in... Accordance with § 761.61(a)(2) § 761.274 Reporting PCB concentrations in samples. (a) Report all sample concentrations for non-liquid PCBs on a dry weight basis as micrograms of PCBs per gram of sample (ppm by...

  19. 40 CFR 761.274 - Reporting PCB concentrations in samples.

    Code of Federal Regulations, 2014 CFR

    2014-07-01

    ... 40 Protection of Environment 31 2014-07-01 2014-07-01 false Reporting PCB concentrations in... Accordance with § 761.61(a)(2) § 761.274 Reporting PCB concentrations in samples. (a) Report all sample concentrations for non-liquid PCBs on a dry weight basis as micrograms of PCBs per gram of sample (ppm by...

  20. 21 CFR 109.30 - Tolerances for polychlorinated biphenyls (PCB's).

    Code of Federal Regulations, 2011 CFR

    2011-04-01

    ... and ubiquitous contaminant in the environment. As a result, certain foods and animal feeds, principally those of animal and marine origin, contain PCB's as unavoidable, environmental contaminants. PCB's are transmitted to the food portion (meat, milk, and eggs) of food-producing animals ingesting...

  1. 21 CFR 109.30 - Tolerances for polychlorinated biphenyls (PCB's).

    Code of Federal Regulations, 2010 CFR

    2010-04-01

    ... and ubiquitous contaminant in the environment. As a result, certain foods and animal feeds, principally those of animal and marine origin, contain PCB's as unavoidable, environmental contaminants. PCB's are transmitted to the food portion (meat, milk, and eggs) of food-producing animals ingesting...

  2. 40 CFR 761.2 - PCB concentration assumptions for use.

    Code of Federal Regulations, 2012 CFR

    2012-07-01

    ... (i.e., contains ≥50 ppm PCB, but pad-mounted distribution... that electrical equipment manufactured after July 2, 1979, is non-PCB (i.e., i.e., ≥ 500 ppm). If the date of manufacture and the type...

  3. 40 CFR 761.2 - PCB concentration assumptions for use.

    Code of Federal Regulations, 2011 CFR

    2011-07-01

    ... (i.e., contains ≥50 ppm PCB, but pad-mounted distribution... that electrical equipment manufactured after July 2, 1979, is non-PCB (i.e., i.e., ≥ 500 ppm). If the date of manufacture and the type...

  4. 21 CFR 109.30 - Tolerances for polychlorinated biphenyls (PCB's).

    Code of Federal Regulations, 2014 CFR

    2014-04-01

    ... the food therein by a functional barrier which is impermeable to migration of PCB's. (b) A compilation... functional for purposes of paragraph (a)(9) of this section if the barrier limits migration of PCB's from the packaging material to food to a level not exceeding the migration which occurs under the same...

  5. 40 CFR 761.269 - Sampling liquid PCB remediation waste.

    Code of Federal Regulations, 2010 CFR

    2010-07-01

    ... 40 Protection of Environment 30 2010-07-01 2010-07-01 false Sampling liquid PCB remediation waste... with § 761.61(a)(2) § 761.269 Sampling liquid PCB remediation waste. (a) If the liquid is single phase... liquid is multi-phasic, separate the phases, and collect and analyze a sample from each liquid...

  6. 40 CFR 761.269 - Sampling liquid PCB remediation waste.

    Code of Federal Regulations, 2013 CFR

    2013-07-01

    ... 40 Protection of Environment 32 2013-07-01 2013-07-01 false Sampling liquid PCB remediation waste... with § 761.61(a)(2) § 761.269 Sampling liquid PCB remediation waste. (a) If the liquid is single phase... liquid is multi-phasic, separate the phases, and collect and analyze a sample from each liquid...

  7. 40 CFR 761.269 - Sampling liquid PCB remediation waste.

    Code of Federal Regulations, 2011 CFR

    2011-07-01

    ... 40 Protection of Environment 31 2011-07-01 2011-07-01 false Sampling liquid PCB remediation waste... with § 761.61(a)(2) § 761.269 Sampling liquid PCB remediation waste. (a) If the liquid is single phase... liquid is multi-phasic, separate the phases, and collect and analyze a sample from each liquid...

  8. 40 CFR 761.269 - Sampling liquid PCB remediation waste.

    Code of Federal Regulations, 2014 CFR

    2014-07-01

    ... 40 Protection of Environment 31 2014-07-01 2014-07-01 false Sampling liquid PCB remediation waste... with § 761.61(a)(2) § 761.269 Sampling liquid PCB remediation waste. (a) If the liquid is single phase... liquid is multi-phasic, separate the phases, and collect and analyze a sample from each liquid...

  9. 40 CFR 761.269 - Sampling liquid PCB remediation waste.

    Code of Federal Regulations, 2012 CFR

    2012-07-01

    ... 40 Protection of Environment 32 2012-07-01 2012-07-01 false Sampling liquid PCB remediation waste... with § 761.61(a)(2) § 761.269 Sampling liquid PCB remediation waste. (a) If the liquid is single phase... liquid is multi-phasic, separate the phases, and collect and analyze a sample from each liquid...

  10. PCB remediation in schools: a review.

    PubMed

    Brown, Kathleen W; Minegishi, Taeko; Cummiskey, Cynthia Campisano; Fragala, Matt A; Hartman, Ross; MacIntosh, David L

    2016-02-01

    Growing awareness of polychlorinated biphenyls (PCBs) in legacy caulk and other construction materials of schools has created a need for information on best practices to control human exposures and comply with applicable regulations. A concise review of approaches and techniques for management of building-related PCBs is the focus of this paper. Engineering and administrative controls that block pathways of PCB transport, dilute concentrations of PCBs in indoor air or other exposure media, or establish uses of building space that mitigate exposure can be effective initial responses to identification of PCBs in a building. Mitigation measures also provide time for school officials to plan a longer-term remediation strategy and to secure the necessary resources. These longer-term strategies typically involve removal of caulk or other primary sources of PCBs as well as nearby masonry or other materials contaminated with PCBs by the primary sources. The costs of managing PCB-containing building materials from assessment through ultimate disposal can be substantial. Optimizing the efficacy and cost-effectiveness of remediation programs requires aligning a thorough understanding of sources and exposure pathways with the most appropriate mitigation and abatement methods. PMID:25994266

  11. Developmental exposure to purity-controlled polychlorinated biphenyl congeners (PCB74 and PCB95) in rats: effects on brainstem auditory evoked potentials and catalepsy.

    PubMed

    Lilienthal, Hellmuth; Korkalainen, Merja; Andersson, Patrik L; Viluksela, Matti

    2015-01-01

    Whereas the effects of dioxin-like polychlorinated biphenyls (DL-PCBs) are well described, less is known about non-dioxin-like PCBs (NDL-PCBs), including influences on the nervous system and related behavioral effects after developmental exposure. Following the examination of the highly purified NDL congeners PCB52 and PCB180, we report here the results of experiments with PCB74 and PCB95. Rat dams were orally exposed to equimolar doses of either congener (40μmol/kg bw - 11.68mg PCB74/kg bw or 13.06mg PCB95/kg bw) from gestational day (GD) 10 to postnatal day (PND) 7. Control dams were given the vehicle. Adult offspring were tested for cataleptic behavior after induction with haloperidol, a classical neuroleptic drug, and brainstem auditory evoked potentials (BAEPs), using clicks and tone pips of different frequencies for stimulation. Results revealed slight effects on latencies to movement onset in female offspring exposed to PCB74, whereas PCB74 males and offspring exposed to PCB95 were not affected. Pronounced changes were observed in BAEPs at low frequencies in PCB74 offspring, with elevated thresholds in both sexes. PCB95 increased thresholds in males, but not females. Small effects were detected on latency of the late wave IV in both sexes after developmental exposure to PCB74 or PCB95. Compared with the other NDL-PCB congeners tested, PCB74 caused the most pronounced effects on BAEPs.

  12. Predicting and controlling downwind concentrations of PCB from surface impoundments

    SciTech Connect

    Angiola, A.J.; Soden, J.M.

    1982-01-01

    Over 227,000 kv of PCB were discharged into the Hudson River from two capacitor manufacturing plants at Fort Edward and Hudson Falls, New York. Much of the discharged PCB was absorbed by the bottom sediments of the river and accumulated behind the Fort Edward Dam. A large amount of the contaminated sediments migrated dowstream when the dam was removed. An effort has been made to dredge PCB-contaminated sediments from the Upper Hudson River and to deposit those sediments in a secure containment site. Part of this project was an air quality impact analysis which addressed the effect of PCB volatilization from the proposed containment site on ambient 24-hour concentrations of PCB downwind of the site. An estimate of the volatilization rate was made and a dispersion modeling analysis was performed in order to calculate the potential impact on residences. 4 references, 1 table.

  13. High reliability DC/DC converter module for electronic boards equipped with FPGAs

    NASA Astrophysics Data System (ADS)

    Viganò, W.; Boccardi, A.; Zamantzas, C.

    2015-01-01

    The Beam Instrumentation Group at CERN is designing a new general-purpose VME carrier module utilising several PTH04T230W DC/DC converters. These off-the-shelf converters are built with unshielded inductors and need to be mounted on the printed circuit board as stand-alone components. Thus, reducing the global manageability and increasing the total cost of the carrier module. The new design aims to develop a module with better power dissipation, efficiency and reliability. In the future, it should be also possible to be directly integrated on the mainboard. For this reason, a Buck DC/DC converter has been implemented with the following main characteristics: input range from 3.0 V to 5.5 V; output range from 0.6 V to 3.3 V, settable by means of an external resistor; output current protection at 6 A; maximum output ripple ± 50 mVpp; switching frequency of 300KHz; short circuit protection; On/Off function; EMI reduction with frequency spread spectrum; soft-start function and thermal shutdown, in a 16 × 19 mm compact size. The selected buck controller is the TPS40303 integrated circuit and drives the CSD16321 power MOSFET, both from Texas Instruments. All selected components have been used at a minimum derating of 50% to reduce component stress and increase the reliability of this module. The selected inductors, i.e. Bourns SRP1055, are the main contributor for the high efficiency (95%), due to their very low equivalent series resistance. On the 4-layer PCB comprising all the components of this module, a snubber circuit, for further reduction of the output ripple due to the MOSFET ringing, can be mounted optionally. It is left as an option due to its effect on the total efficiency. The board layout has been optimized for maximum heat transfer and it can be used without active cooling. The board can maintain the maximum temperature on its surface, while at maximum current output, below 55°C at 25°C ambient temperature. An example of the electrical performance

  14. GATING CIRCUITS

    DOEpatents

    Merrill, L.C.

    1958-10-14

    Control circuits for vacuum tubes are described, and a binary counter having an improved trigger circuit is reported. The salient feature of the binary counter is the application of the input signal to the cathode of each of two vacuum tubes through separate capacitors and the connection of each cathode to ground through separate diodes. The control of the binary counter is achieved in this manner without special pulse shaping of the input signal. A further advantage of the circuit is the simplicity and minimum nuruber of components required, making its use particularly desirable in computer machines.

  15. MULTIPLIER CIRCUIT

    DOEpatents

    Thomas, R.E.

    1959-01-20

    An electronic circuit is presented for automatically computing the product of two selected variables by multiplying the voltage pulses proportional to the variables. The multiplier circuit has a plurality of parallel resistors of predetermined values connected through separate gate circults between a first input and the output terminal. One voltage pulse is applied to thc flrst input while the second voltage pulse is applied to control circuitry for the respective gate circuits. Thc magnitude of the second voltage pulse selects the resistors upon which the first voltage pulse is imprcssed, whereby the resultant output voltage is proportional to the product of the input voltage pulses

  16. Supreme Court of the United States, Syllabus. Dayton Board of Education et al. v. Brinkman et. al. Certiorari to the United States Court of Appeals for the Sixth Circuit. No. 78-627.

    ERIC Educational Resources Information Center

    Supreme Court of the U. S., Washington, DC.

    This booklet records the opinion of the Supreme Court in this case, as well as one of the dissenting opinions. The Court upheld the charges brought by students of the Dayton, Ohio, school system that the Dayton Board of Education, the State Board of Education, and various local and State officials were operating a racially segregated school system…

  17. TRIPPING CIRCUIT

    DOEpatents

    Lees, G.W.; McCormick, E.D.

    1962-05-22

    A tripping circuit employing a magnetic amplifier for tripping a reactor in response to power level, period, or instrument failure is described. A reference winding and signal winding are wound in opposite directions on the core. Current from an ion chamber passes through both windings. If the current increases at too fast a rate, a shunt circuit bypasses one or the windings and the amplifier output reverses polarity. (AEC)

  18. Communication design for multi-boards based on VME bus

    NASA Astrophysics Data System (ADS)

    Liu, Yang; Song, Fazhi; Wei, Kai; Fu, Zhenxian

    2015-02-01

    As a widely used open-architecture computer bus ,VME bus is increasingly applied in military, aerospace, transportation and other large-scale control systems. Lithography, a very delicate and complicated integrated circuit manufacturing equipment, uses many circuit boards with VME interface in its control system, including one single-board computer, many movement control boards and one data acquisition board. This paper designs communication modules which include VME bus module and VME user-defined bus module for multi-boards in Lithography control system. VME bus module is designed for the communication between the single-board computer and movement control boards and VME user-defined bus is designed for the communication between movement control boards and data acquisition board. The experimental results demonstrate its effectiveness.

  19. Estrogenicity and androgenicity screening of PCB sulfate monoesters in human breast cancer MCF-7 cells.

    PubMed

    Flor, Susanne; He, Xianran; Lehmler, Hans-Joachim; Ludewig, Gabriele

    2016-02-01

    Recent studies identified polychlorinated biphenyl (PCB) sulfate esters as a major product of PCB metabolism. Since hydroxy-PCBs (HO-PCBs), the immediate precursors of PCB sulfates and important contributors to PCB toxicity, were shown to have estrogenic activity, we investigated the estrogenicity/androgenicty of a series of PCB sulfate metabolites. We synthesized the five possible structural sulfate monoester metabolites of PCB 3, a congener shown to be biotransformed to sulfates, a sulfate ester of the paint-specific congener PCB 11, and sulfate monoesters of two HO-PCBs reported to interact with sulfotransferases (PCB 39, no ortho chlorines, and PCB 53, 3 ortho chlorines). We tested these PCB sulfates and 4'-HO-PCB 3 as positive control for estrogenic, androgenic, anti-estrogenic, and anti-androgenic activity in the E- and A-screen with human breast cancer MCF7-derived cells at 100 μM-1 pM concentrations. Only 4'-HO-PCB 3 was highly cytotoxic at 100 μM. We observed structure-activity relationships: compounds with a sulfate group in the chlorine-containing ring of PCB 3 (2PCB 3 and 3PCB 3 sulfate) showed no interaction with the estrogen (ER) and androgen (AR) receptor. The 4'-HO-PCB 3 and its sulfate ester had the highest estrogenic effect, but at 100-fold different concentrations, i.e., 1 and 100 μM, respectively. Four of the PCB sulfates were estrogenic (2'PCB 3, 4'PCB 3, 4'PCB 39, and 4'PCB 53 sulfates; at 100 μM). These sulfates and 3'PCB 3 sulfate also exhibited anti-estrogenic activity, but at nM and pM concentrations. The 4'PCB 3 sulfate (para-para' substituted) had the strongest androgenic activity, followed by 3'PCB 3, 4'PCB 53, 4PCB11, and 4PCB 39 sulfates and the 4'HO-PCB 3. In contrast, anti-androgenicity was only observed with the two compounds that have the sulfate group in ortho- or meta- position in the second ring (2'PCB 3 and 3'PCB 3 sulfate). No dose-response was observed in any screen, but, with exception of estrogenic activity (only seen

  20. Sexual difference in PCB concentrations of coho salmon (Oncorhynchus kisutch).

    PubMed

    Madenjian, Charles P; Schrank, Candy S; Begnoche, Linda J; Elliott, Robert F; Quintal, Richard T

    2010-03-01

    We determined polychlorinated biphenyl (PCB) concentrations in 35 female coho salmon (Oncorhynchus kisutch) and 60 male coho salmon caught in Lake Michigan (Michigan and Wisconsin, United States) during the fall of 1994 and 1995. In addition, we determined PCB concentrations in the skin-on fillets of 26 female and 19 male Lake Michigan coho salmon caught during the fall of 2004 and 2006. All coho salmon were age-2 fish. These fish were caught prior to spawning, and therefore release of eggs could not account for sexual differences in PCB concentrations because female coho salmon spawn only once during their lifetime. To investigate whether gross growth efficiency (GGE) differed between the sexes, we applied bioenergetics modeling. Results showed that, on average, males were 19% higher in PCB concentration than females, based on the 1994-1995 dataset. Similarly, males averaged a 20% higher PCB concentration in their skin-on fillets compared with females. According to the bioenergetics modeling results, GGE of adult females was less than 1% higher than adult male GGE. Thus, bioenergetics modeling could not explain the 20% higher PCB concentration exhibited by the males. Nonetheless, a sexual difference in GGE remained a plausible explanation for the sexual difference in PCB concentrations.

  1. Biogeochemical controls on PCB deposition in Hudson Bay.

    PubMed

    Kuzyk, Zou Zou A; Macdonald, Robie W; Johannessen, Sophia C; Stern, Gary A

    2010-05-01

    PCB concentrations, congener patterns, and fluxes were examined in 13 dated and organically characterized (C, N, delta(13)C, delta(15)N) marine sediment cores from Hudson Bay, Canada, to investigate the importance of organic matter (OM) supply and transport to PCB sequestration. Drawdown of PCBs, supported by marine primary production, is reflected in elevated summation operatorPCB concentrations and more highly chlorinated PCB signatures in surface sediments underlying eutrophic regions. Sediments in oligotrophic regions, which are dominated by "old" marine OM, have lower PCB concentrations and weathered signatures. For the surface of Hudson Bay, average atmospheric deposition appears to be very low (ca. 1.4 pg summation operatorPCBs cm(-2) a(-1)) compared to fluxes reported for nearby lakes (ca. 44 pg summation operatorPCBs cm(-2) a(-1)). (210)Pb fails to provide a means to normalize the fluxes, highlighting important differences in the biocycling of (210)Pb and PCBs. Unlike (210)Pb, atmospheric PCB exchange with the water's surface is partially forced by the aquatic organic carbon cycle. The extremely low atmospheric deposition of PCBs to the surface of Hudson Bay is likely a reflection of the Bay's exceptionally low productivity and vertical carbon fluxes. If future marine production and vertical flux of carbon increase due to loss of ice cover or change in river input as consequences of global warming, PCB deposition would also increase.

  2. Sexual difference in PCB concentrations of coho salmon (Oncorhynchus kisutch)

    USGS Publications Warehouse

    Madenjian, Charles P.; Schrank, Candy S.; Begnoche, Linda J.; Elliott, Robert F.; Quintal, Richard T.

    2010-01-01

    We determined polychlorinated biphenyl (PCB) concentrations in 35 female coho salmon (Oncorhynchus kisutch) and 60 male coho salmon caught in Lake Michigan (Michigan and Wisconsin, United States) during the fall of 1994 and 1995. In addition, we determined PCB concentrations in the skin-on fillets of 26 female and 19 male Lake Michigan coho salmon caught during the fall of 2004 and 2006. All coho salmon were age-2 fish. These fish were caught prior to spawning, and therefore release of eggs could not account for sexual differences in PCB concentrations because female coho salmon spawn only once during their lifetime. To investigate whether gross growth efficiency (GGE) differed between the sexes, we applied bioenergetics modeling. Results showed that, on average, males were 19% higher in PCB concentration than females, based on the 1994–1995 dataset. Similarly, males averaged a 20% higher PCB concentration in their skin-on fillets compared with females. According to the bioenergetics modeling results, GGE of adult females was less than 1% higher than adult male GGE. Thus, bioenergetics modeling could not explain the 20% higher PCB concentration exhibited by the males. Nonetheless, a sexual difference in GGE remained a plausible explanation for the sexual difference in PCB concentrations.

  3. Biogeochemical controls on PCB deposition in Hudson Bay.

    PubMed

    Kuzyk, Zou Zou A; Macdonald, Robie W; Johannessen, Sophia C; Stern, Gary A

    2010-05-01

    PCB concentrations, congener patterns, and fluxes were examined in 13 dated and organically characterized (C, N, delta(13)C, delta(15)N) marine sediment cores from Hudson Bay, Canada, to investigate the importance of organic matter (OM) supply and transport to PCB sequestration. Drawdown of PCBs, supported by marine primary production, is reflected in elevated summation operatorPCB concentrations and more highly chlorinated PCB signatures in surface sediments underlying eutrophic regions. Sediments in oligotrophic regions, which are dominated by "old" marine OM, have lower PCB concentrations and weathered signatures. For the surface of Hudson Bay, average atmospheric deposition appears to be very low (ca. 1.4 pg summation operatorPCBs cm(-2) a(-1)) compared to fluxes reported for nearby lakes (ca. 44 pg summation operatorPCBs cm(-2) a(-1)). (210)Pb fails to provide a means to normalize the fluxes, highlighting important differences in the biocycling of (210)Pb and PCBs. Unlike (210)Pb, atmospheric PCB exchange with the water's surface is partially forced by the aquatic organic carbon cycle. The extremely low atmospheric deposition of PCBs to the surface of Hudson Bay is likely a reflection of the Bay's exceptionally low productivity and vertical carbon fluxes. If future marine production and vertical flux of carbon increase due to loss of ice cover or change in river input as consequences of global warming, PCB deposition would also increase. PMID:20392087

  4. Spatial patterns in PCB concentrations of Lake Michigan lake trout

    USGS Publications Warehouse

    Madenjian, Charles P.; DeSorcie, Timothy J.; Stedman, Ralph M.; Brown, Edward H.; Eck, Gary W.; Schmidt, Larry J.; Hesselberg, Robert J.; Chernyak, Sergei M.; Passino-Reader, Dora R.

    1999-01-01

    Most of the PCB body burden in lake trout (Salvelinus namaycush) of the Great Lakes is from their food. PCB concentrations were determined in lake trout from three different locations in Lake Michigan during 1994–1995, and lake trout diets were analyzed at all three locations. The PCB concentrations were also determined in alewife (Alosa pseudoharengus), rainbow smelt (Osmerus mordax), bloater (Coregonus hoyi), slimy sculpin (Cottus cognatus), and deepwater sculpin (Myoxocephalus thompsoni), five species of prey fish eaten by lake trout in Lake Michigan, at three nearshore sites in the lake. Despite the lack of significant differences in the PCB concentrations of alewife, rainbow smelt, bloater, slimy sculpin, and deepwater sculpin from the southeastern nearshore site near Saugatuck (Michigan) compared with the corresponding PCB concentrations from the northwestern nearshore site near Sturgeon Bay (Wisconsin), PCB concentrations in lake trout at Saugatuck were significantly higher than those at Sturgeon Bay. The difference in the lake trout PCB concentrations between Saugatuck and Sturgeon Bay could be explained by diet differences. The diet of lake trout at Saugatuck was more concentrated in PCBs than the diet of Sturgeon Bay lake trout, and therefore lake trout at Saugatuck were more contaminated in PCBs than Sturgeon Bay lake trout. These findings were useful in interpreting the long-term monitoring series for contaminants in lake trout at both Saugatuck and the Wisconsin side of the lake.

  5. Inhalation of Polychlorinated Biphenyls (PCB) Produces Hyperactivity in Rats.

    PubMed

    Lombardo, John P; Berger, David F; Hunt, Anne; Carpenter, David O

    2015-01-01

    Attention deficit hyperactivity disorder (ADHD) is a serious behavioral syndrome seen in children, and more common in males than females. There is increasing evidence that prenatal and/or early life exposure to persistent organic pollutants (POP) such as polychlorinated biphenyls (PCB) is associated with increased risk of ADHD occurrence. While PCB exposure is usually attributed to ingestion of contaminated food, recent reports of elevated PCB concentrations in indoor air, especially in schools, raised concern regarding inhalation as an important route of exposure to PCB with consequent effects on neurobehavior. The effects of exposure to air contaminated with Aroclor 1248 or contaminated sediment (SED) from the St. Lawrence River were examined on operant behavior of male and female Sprague-Dawley rats. Data showed that relative to controls, vapor-phase inhalation of PCB, whether from blowing air over Aroclor 1248 or from blowing air over sediment contaminated with PCB, resulted in hyperactivity and impatience in rats, more pronounced in males than females. These results are consistent with the hypothesis that inhalation of PCB may contribute to behavioral abnormalities in children. PMID:26398098

  6. Reliability of CGA/LGA/HDI Package Board/Assembly (Final Report)

    NASA Technical Reports Server (NTRS)

    Ghaffaroam. Reza

    2014-01-01

    Package manufacturers are now offering commercial-off-the-shelf column grid array (COTS CGA) packaging technologies in high-reliability versions. Understanding the process and quality assurance (QA) indicators for reliability are important for low-risk insertion of these advanced electronics packages. The previous reports, released in January of 2012 and January of 2013, presented package test data, assembly information, and reliability evaluation by thermal cycling for CGA packages with 1752, 1517, 1509, and 1272 inputs/outputs (I/Os) and 1-mm pitch. It presented the thermal cycling (-55C either 100C or 125C) test results for up to 200 cycles. This report presents up to 500 thermal cycles with quality assurance and failure analysis evaluation represented by optical photomicrographs, 2D real time X-ray images, dye-and-pry photomicrographs, and optical/scanning electron Microscopy (SEM) cross-sectional images. The report also presents assembly challenge using reflowing by either vapor phase or rework station of CGA and land grid array (LGA) versions of three high I/O packages both ceramic and plastic configuration. A new test vehicle was designed having high density interconnect (HDI) printed circuit board (PCB) with microvia-in-pad to accommodate both LGA packages as well as a large number of fine pitch ball grid arrays (BGAs). The LGAs either were assembled onto HDI PCB as an LGA or were solder paste print and reflow first to form solder dome on pads before assembly. Both plastic BGAs with 1156 I/O and ceramic LGAs were assembled. It also presented the X-ray inspection results as well as failures due to 200 thermal cycles. Lessons learned on assembly of ceramic LGAs are also presented.

  7. Circuit-field coupled finite element analysis method for an electromagnetic acoustic transducer under pulsed voltage excitation

    NASA Astrophysics Data System (ADS)

    Hao, Kuan-Sheng; Huang, Song-Ling; Zhao, Wei; Wang, Shen

    2011-06-01

    This paper presents an analytical method for electromagnetic acoustic transducers (EMATs) under voltage excitation and considers the non-uniform distribution of the biased magnetic field. A complete model of EMATs including the non-uniform biased magnetic field, a pulsed eddy current field and the acoustic field is built up. The pulsed voltage excitation is transformed to the frequency domain by fast Fourier transformation (FFT). In terms of the time harmonic field equations of the EMAT system, the impedances of the coils under different frequencies are calculated according to the circuit-field coupling method and Poynting's theorem. Then the currents under different frequencies are calculated according to Ohm's law and the pulsed current excitation is obtained by inverse fast Fourier transformation (IFFT). Lastly, the sequentially coupled finite element method (FEM) is used to calculate the Lorentz force in the EMATs under the current excitation. An actual EMAT with a two-layer two-bundle printed circuit board (PCB) coil, a rectangular permanent magnet and an aluminium specimen is analysed. The coil impedances and the pulsed current are calculated and compared with the experimental results. Their agreement verified the validity of the proposed method. Furthermore, the influences of lift-off distances and the non-uniform static magnetic field on the Lorentz force under pulsed voltage excitation are studied.

  8. Laboratory study of PCB transport from primary sources to settled dust

    EPA Science Inventory

    Transport of house dust and Arizona Test Dust on polychlorinated biphenyl (PCB)-containing panels and PCB-free panels was investigated in a 30-m3 stainless steel chamber. The PCB-containing panels were aluminum sheets coated with a PCB-spiked, oil-based primer or two-part polysul...

  9. Hybrid free-space optical bus system for board-to-board interconnections.

    PubMed

    Yeh, J H; Kostuk, R K; Tu, K Y

    1996-11-10

    A free-space optical bus system is described for board-to-board interconnections at the backplane level. The system uses active optoelectronic modules as the interface between the circuit boards and the electrical backplane. Substrate-mode holograms are used to implement signal broadcast operations between boards, and each board on the backplane shares common free-space channels for transmitting and receiving signals. System-design considerations are given, and the potential performance of the optical bus system is evaluated. An experimental demonstration is also presented for the signal broadcast operation through cascaded substrate-mode holograms at a data rate of 622 Mb/s.

  10. MULTIPLIER CIRCUIT

    DOEpatents

    Chase, R.L.

    1963-05-01

    An electronic fast multiplier circuit utilizing a transistor controlled voltage divider network is presented. The multiplier includes a stepped potentiometer in which solid state or transistor switches are substituted for mechanical wipers in order to obtain electronic switching that is extremely fast as compared to the usual servo-driven mechanical wipers. While this multiplier circuit operates as an approximation and in steps to obtain a voltage that is the product of two input voltages, any desired degree of accuracy can be obtained with the proper number of increments and adjustment of parameters. (AEC)

  11. Effect of Interfacial Reactions on the Reliability of Lead-Free Assemblies after Board Level Drop Tests

    NASA Astrophysics Data System (ADS)

    Xia, Yanghua; Lu, Chuanyan; Xie, Xiaoming

    2007-09-01

    The reliability of lead-free electronic assemblies after board level drop tests was investigated. Thin small outline package (TSOP) components with 42 FeNi alloy leads were reflow soldered on FR4 printed circuit boards (PCBs) with Sn3.0Ag0.5Cu (wt%) solder. The effects of different PCB finishes [organic solderability preservative (OSP) and electroless nickel immersion gold (ENIG)], multiple reflow (once and three times), and isothermal aging (500 h at 125°C after one time reflow) were studied. The ENIG finish showed better performance than its OSP counterparts. With the OSP finish, solder joints reflowed three times showed obvious improvement compared to those of the sample reflowed once, while aging led to apparent degradation. The results showed that intermetallic compound (IMC) types, IMC microstructure and solder microstructure compete with each other, all playing very important roles in the solder joint lifetime. The results also showed that it is important to specify adequate conditions for a given reliability assessment program, to allow meaningful comparison between results of different investigators.

  12. 40 CFR 761.2 - PCB concentration assumptions for use.

    Code of Federal Regulations, 2010 CFR

    2010-07-01

    ... assume that transformers with transformers manufactured before July 2, 1979, must be assumed to be mineral-oil filled. Any person may assume... be PCB-Contaminated. (3) Any person must assume that a transformer manufactured prior to July 2,...

  13. FIELD ANALYTICAL SCREENING PROGRAM: PCB METHOD - INNOVATIVE TECHNOLOGY REPORT

    EPA Science Inventory

    This innovative technology evaluation report (ITER) presents information on the demonstration of the U.S. Environmental Protection Agency (EPA) Region 7 Superfund Field Analytical Screening Program (FASP) method for determining polychlorinated biphenyl (PCB) contamination in soil...

  14. Effects of PCB exposure on neuropsychological function in children.

    PubMed

    Schantz, Susan L; Widholm, John J; Rice, Deborah C

    2003-03-01

    In the last decade advances in the analytic methods for quantification of polychlorinated biphenyls (PCBs) have resulted in widespread availability of congener-specific analysis procedures, and large amounts of data on PCB congener profiles in soil, air, water, sediments, foodstuffs, and human tissues have become available. These data have revealed that the PCB residues in environmental media and human tissues may not closely resemble any of the commercial PCB mixtures, depending on source of exposure, bioaccumulation through the food chain, and weathering of PCBs in the environment. At the same time, toxicological research has led to a growing awareness that different classes of PCB congeners have different profiles of toxicity. These advances in analytic techniques and toxicological knowledge are beginning to influence the risk assessment process. As the data from ongoing PCB studies assessing the mediators of neurobehavioral outcomes in children are published, the weight of evidence for PCB effects on neurodevelopment is growing. Studies in Taiwan, Michigan (USA), New York (USA), Holland, Germany, and the Faroe Islands have all reported negative associations between prenatal PCB exposure and measures of cognitive functioning in infancy or childhood. The German study also reported a negative association between postnatal PCB exposure and cognitive function in early childhood--a result that had not been found in previous studies. Only one published study in North Carolina (USA) has failed to find an association between PCB exposure and cognitive outcomes. Despite the fact that several more recent studies have used congener-specific analytic techniques, there have been only limited attempts to assess the role of specific PCB congeners or classes of congeners in mediating neurodevelopmental outcomes. From a statistical standpoint, attempts to determine the role of individual congeners in mediating outcomes are hampered by the fact that concentrations of most

  15. Circuit Training.

    ERIC Educational Resources Information Center

    Nelson, Jane B.

    1998-01-01

    Describes a research-based activity for high school physics students in which they build an LC circuit and find its resonant frequency of oscillation using an oscilloscope. Includes a diagram of the apparatus and an explanation of the procedures. (DDR)

  16. LONG-TERM RECOVERY OF PCB-CONTAMINATED SEDIMENTS AT THE LAKE HARTWELL SUPERFUND SITE: PCB DECHLORINATION. 2. RATES AND EXTENT

    EPA Science Inventory

    This paper reports on extensive polychlorinated biphenyl (PCB) dechlorination measured in Lake Hartwell (Pickens County, SC) sediments. Vertical sediment cores were collected from 18 locations in Lake Hartwell (Pickens County, SC) and analyzed in 5-cm increments for PCB congeners...

  17. Different carbon sources affect PCB accumulation by marine bivalves.

    PubMed

    Laitano, M V; Silva Barni, M F; Costa, P G; Cledón, M; Fillmann, G; Miglioranza, K S B; Panarello, H O

    2016-02-01

    Pampean creeks were evaluated in the present study as potential land-based sources of PCB marine contamination. Different carbon and nitrogen sources from such creeks were analysed as boosters of PCB bioaccumulation by the filter feeder bivalve Brachidontes rodriguezii and grazer limpet Siphonaria lessoni. Carbon of different source than marine and anthropogenic nitrogen assimilated by organisms were estimated through their C and N isotopic composition. PCB concentration in surface sediments and mollusc samples ranged from 2.68 to 6.46 ng g(-1) (wet weight) and from 1074 to 4583 ng g(-1) lipid, respectively, reflecting a punctual source of PCB contamination related to a landfill area. Thus, despite the low flow of creeks, they should not be underestimated as contamination vectors to the marine environment. On the other hand, mussels PCB bioaccumulation was related with the carbon source uptake which highlights the importance to consider this factor when studying PCB distribution in organisms of coastal systems.

  18. Different carbon sources affect PCB accumulation by marine bivalves.

    PubMed

    Laitano, M V; Silva Barni, M F; Costa, P G; Cledón, M; Fillmann, G; Miglioranza, K S B; Panarello, H O

    2016-02-01

    Pampean creeks were evaluated in the present study as potential land-based sources of PCB marine contamination. Different carbon and nitrogen sources from such creeks were analysed as boosters of PCB bioaccumulation by the filter feeder bivalve Brachidontes rodriguezii and grazer limpet Siphonaria lessoni. Carbon of different source than marine and anthropogenic nitrogen assimilated by organisms were estimated through their C and N isotopic composition. PCB concentration in surface sediments and mollusc samples ranged from 2.68 to 6.46 ng g(-1) (wet weight) and from 1074 to 4583 ng g(-1) lipid, respectively, reflecting a punctual source of PCB contamination related to a landfill area. Thus, despite the low flow of creeks, they should not be underestimated as contamination vectors to the marine environment. On the other hand, mussels PCB bioaccumulation was related with the carbon source uptake which highlights the importance to consider this factor when studying PCB distribution in organisms of coastal systems. PMID:26606107

  19. PCB-resistant diatoms in the Hudson River estuary

    NASA Astrophysics Data System (ADS)

    Cosper, Elizabeth M.; Wurster, Charles F.; Bautista, Mark F.

    1988-02-01

    Diatom cells that are resistant, as well as sensitive, to the toxicity of polychlorinated biphenyls (PCB) are widespread throughout the highly polluted Hudson River estuary. A study of the distribution of PCB resistance among populations of the diatoms, Thalassiosira nordenskioldii and Asterionella glacialis, revealed few spatial or temporal patterns for the trait during spring and summer. The number of estuarine clones of A. glacialis tolerant of more than 25 ppb of PCB was greater than twice the number of clones isolated from nearshore waters at Sandy Hook, NJ. This suggests that selection pressure for PCB resistance is greater in the estuary than in the New York Bight apex. If specific sites of selection exist, the mixing of cells within the estuary may be rapid enough to distribute resistant clones throughout the estuary, or the selection process may involve a generalized response to a multitude of pollutants. Several clones of both species tested were not only tolerant of PCB, but were actually enhanced in their growth in the presence of PCB. Such clones were distributed throughout the estuary during both seasons. Selection in the estuary favours not only resistant strains of diatoms, but forms that may utilize organic pollutants.

  20. Electrical two and three dimensional modelling of high-speed board to board interconnections

    SciTech Connect

    Gailus, M.; Fusi, M.A.; Zanella, F.

    1995-12-31

    In today`s high speed electronic systems, board-to-board connectors can contribute to signal degradation, reflections, and crosstalk. Methods exist for using computer modeling to predict the electrical behavior of interconnections from a knowledge of their materials and construction. A typical modeling process utilizes a combination of 2 or 3 dimensional electromagnetic field solvers to derive an approximate circuit model of the connector. Predictions of connector electrical performance are then obtained by plugging this connector model into a model test circuit and simulating the combination with circuit simulation software such as SPICE.

  1. Cell death mechanisms in GT1-7 GnRH cells exposed to polychlorinated biphenyls PCB74, PCB118, and PCB153

    SciTech Connect

    Dickerson, Sarah M.; Guevara, Esperanza; Woller, Michael J.; Gore, Andrea C.

    2009-06-01

    Exposure to endocrine disrupting chemicals (EDCs) such as polychlorinated biphenyls (PCBs) causes functional deficits in neuroendocrine systems. We used an immortalized hypothalamic GT1-7 cell line, which synthesizes the neuroendocrine peptide gonadotropin-releasing hormone (GnRH), to examine the neurotoxic and endocrine disrupting effects of PCBs and their mechanisms of action. Cells were treated for 1, 4, 8, or 24 h with a range of doses of a representative PCB from each of three classes: coplanar (2,4,4',5-tetrachlorobiphenyl: PCB74), dioxin-like coplanar (2',3,4,4',5' pentachlorobiphenyl: PCB118), non-coplanar (2,2',4,4',5,5'-hexachlorobiphenyl: PCB153), or their combination. GnRH peptide concentrations, cell viability, apoptotic and necrotic cell death, and caspase activation were quantified. In general, GnRH peptide levels were suppressed by high doses and longer durations of PCBs, and elevated at low doses and shorter timepoints. The suppression of GnRH peptide levels was partially reversed in cultures co-treated with the estrogen receptor antagonist ICI 182,780. All PCBs reduced viability and increased both apoptotic and necrotic cell death. Although the effects for the three classes of PCBs were often similar, subtle differences in responses, together with evidence that the combination of PCBs acted slightly different from individual PCBs, suggest that the three tested PCB compounds may act via slightly different or more than one mechanism. These results provide evidence that PCB congeners have endocrine disrupting and/or neurotoxic effects on the hypothalamic GnRH cell line, a finding that has implications for environmental endocrine disruption in animals.

  2. The greening of PCB analytical methods

    SciTech Connect

    Erickson, M.D.; Alvarado, J.S.; Aldstadt, J.H.

    1995-12-01

    Green chemistry incorporates waste minimization, pollution prevention and solvent substitution. The primary focus of green chemistry over the past decade has been within the chemical industry; adoption by routine environmental laboratories has been slow because regulatory standard methods must be followed. A related paradigm, microscale chemistry has gained acceptance in undergraduate teaching laboratories, but has not been broadly applied to routine environmental analytical chemistry. We are developing green and microscale techniques for routine polychlorinated biphenyl (PCB) analyses as an example of the overall potential within the environmental analytical community. Initial work has focused on adaptation of commonly used routine EPA methods for soils and oils. Results of our method development and validation demonstrate that: (1) Solvent substitution can achieve comparable results and eliminate environmentally less-desirable solvents, (2) Microscale extractions can cut the scale of the analysis by at least a factor of ten, (3) We can better match the amount of sample used with the amount needed for the GC determination step, (4) The volume of waste generated can be cut by at least a factor of ten, and (5) Costs are reduced significantly in apparatus, reagent consumption, and labor.

  3. Fingerprinting PCB patterns among Mohawk women.

    PubMed

    Hwang, S A; Yang, B Z; Fitzgerald, E F; Bush, B; Cook, K

    2001-01-01

    This study examined the association of contaminated fish consumption and polychlorinated biphenyl (PCB) body burden by comparing the similarity of the congener pattern in yellow perch, caught near the point source of industrial pollution, and in other local fish to the pattern found in the breast milk of Mohawk women from Akwesasne, a Native American community located along the St. Lawrence River in New York, Ontario, and Quebec. The similarity is defined by the weighted Euclidean distance between two congener patterns. Ninety-seven Mohawk mothers participated and provided samples of breast milk. One hundred fifty-four nursing women from the Supplemental Nutrition Program for Women, Infants and Children (WIC) of Warren and Schoharie counties, New York, who gave birth during the same time period, were used as the comparison group. Results revealed that the breast milk of the Mohawk women, who ate the most local fish, had a congener pattern that more closely resembled that of perch caught near the waste site or average sampled fish caught in the Reserve than Mohawk women who ate less fish or the controls. The outcome demonstrates how PCBs may be "fingerprinted" as they migrate offsite from industrial sources and ultimately result in human exposure.

  4. Biochemistry and genetics of PCB metabolism

    SciTech Connect

    Kurukawa, Kensuke; Kimura, Nobutada

    1995-06-01

    Biphenyl(BP)-utilizing bacteria, which include both Gram-negative and Gram-positive strains, are ubiquitously distributed in the environment. These bacteria co-metabolically degrade a variety of polychlorinated biphenyl (PCB) congeners to the corresponding chlorobenzoic: acids through 2,3-dioxygenation. Certain strains degrade even highly chlorinated PCBs through 3,4-dioxygenation. The ring meta-cleavage dioxygenase purified from Pseudomonas pseudoalcaligenes KF707 is a homo-octamer containing ferrous ions as the essential cofactor. Transposon mutants revealed that the bph-encoded enzymes possess a wide range of substrate specificity for various aromatic hydrocarbons. The bphABCXD gene cluster coding for the degradation of PCBs to chlorobenzoic acids was first cloned from P. pseudoalcaligenes KF707 and sequenced and then was cloned from a number of BP-utilizing strains and sequenced. Some strains possess a bph operon that is very similar, if not identical, to that of KF707. Some bph genes share homologies with different degrees. Deletion and shuffling of bph genes are also found. 14 refs., 1 fig.

  5. Dayton Board of Education et al. v. Brinkman et al. Certiorari to the United States Court of Appeals for the Sixth Circuit. Supreme Court of the United States, Syllabus.

    ERIC Educational Resources Information Center

    Supreme Court of the U. S., Washington, DC.

    In this school desegregation case the District Court after an evidentiary hearing held that petitioner, Dayton, Ohio School Board had engaged in racial discrimination in the operation of city schools. On the basis of a cumulative violation of the Equal Protection Clause that the court found, the District Court, following reversals by the Court of…

  6. Standards for compatibility of printed circuit and component lead materials

    NASA Technical Reports Server (NTRS)

    1968-01-01

    Study of packaging of microminiature electronic components reveals methods of improving compatibility of lead materials, joining techniques, transfer molding concepts, printed circuit board materials, and process and material specifications.

  7. Economical printed circuit front panel for computer use

    NASA Technical Reports Server (NTRS)

    Newman, J.

    1970-01-01

    Techniques for preparing printed circuit boards are used to provide an alternate method for producing panel symbology for ground computer test trap. After processing, the panel unit is either solder or gold plated.

  8. Tool For Tinning Integrated-Circuit Leads

    NASA Technical Reports Server (NTRS)

    Prosser, Gregory N.

    1988-01-01

    As many as eight flatpacks held. Tool made of fiberglass boards. Clamps row of flatpacks by their leads so leads on opposite side of packages dipped. After dipping, nuts on boards loosened, flatpacks turned around, nuts retightened, and untinned leads dipped. Strips of magnetic material grip leads of flatpacks (made of Kovar, magnetic iron/nickel/cobalt alloy) while boards repositioned. Micrometerlike screw used to adjust exposed width of magnetic strip to suit dimensions of flatpacks. Holds flatpack integrated circuits so leads tinned. Accommodates several flatpacks for simultaneous dipping of leads in molten solder. Adjusts to accept flatpacks in range of sizes.

  9. Biotransformation of 2,2',5,5'-tetrachlorobiphenyl (PCB 52) and 3,3',4,4'-tetrachlorobiphenyl (PCB 77) by liver microsomes from four species of sea turtles.

    PubMed

    Richardson, Kristine L; Schlenk, Daniel

    2011-05-16

    The rates of oxidative metabolism of two tetrachlorobiphenyl congeners were determined in hepatic microsomes from four species of sea turtles, green (Chelonia mydas), olive ridley (Lepidochelys olivacea), loggerhead (Caretta caretta), and hawksbill (Eretmochelys imbricata). Hydroxylation of 3,3',4,4'-tetrachlorobiphenyl (PCB 77), an ortho-meta unsubstituted rodent cytochrome P450 (P450) 1A substrate PCB, was not observed in sea turtle microsomes. Sea turtle microsomes hydroxylated 2,2',5,5'-tetrachlorobiphenyl (PCB 52), a meta-para unsubstituted rodent P450 family 2 substrate PCB, at rates ranging from less than 0.5 to 53 pmol/min/mg protein. The P450 inhibitor ketoconazole inhibited hydroxylation of PCB 52, supporting the role of P450 catalysis. Sea turtle PCB 52 hydroxlyation rates strongly correlated with immunodetected P450 family 2-like and less so with P450 family 3-like hepatic proteins. Testosterone 6β-, 16α-, 16β-hydroxylase activities were also significantly correlated with the expression of these enzymes, indicating that P450 family 2 or P450 family 3 proteins are responsible for PCB hydroxylation in sea turtles. This study indicated species-specific PCB biotransformation in sea turtles and preferential elimination of meta-para unsubstituted PCB congeners over ortho-meta unsubstituted PCB congeners consistent with PCB accumulation patterns observed in tissues of sea turtles.

  10. Comparison of the in vitro effects of TCDD, PCB 126 and PCB 153 on thyroid-restricted gene expression and thyroid hormone secretion by the chicken thyroid gland.

    PubMed

    Katarzyńska, Dorota; Hrabia, Anna; Kowalik, Kinga; Sechman, Andrzej

    2015-03-01

    The aim of this study was to compare the in vitro effects of 2,3,7,8-tetrachlorodibenzo-p-dioxin (TCDD), 3,3',4,4',5-pentachlorobiphenyl (PCB 126; a coplanar PCB congener) and 2,2'4,4',5,5'-hexachlorobiphenyl (PCB153; non-coplanar PCB) on mRNA expression of thyroid-restricted genes, i.e. sodium iodide symporter (NIS), thyroid peroxidase (TPO) and thyroglobulin (TG), and thyroid hormone secretion from the thyroid gland of the laying chicken. Relative expression levels of NIS, TG and TPO genes and thyroxine (T4) and triiodothyronine (T3) secretion from the thyroidal explants were quantified by the real-time qPCR and RIA methods, respectively. In comparison with the control group, TCDD and PCB 126 significantly increased mRNA expression of TPO and TG genes. TCDD did not affect NIS mRNA levels, but PCB 126 decreased its expression. No effect of PCB 153 on the expression of these genes was observed. TCDD and PCB 126 significantly decreased T4 and T3 secretion. There was no significant effect of PCB 153 on these hormone secretions. In conclusion, the results obtained show that in comparison with non-coplanar PCB 153, TCDD and coplanar PCB 126 can directly affect thyroid hormone synthesis and secretion, and in consequence, they may disrupt the endocrine function of the thyroid gland of the laying chicken.

  11. Modeling trapping mechanism for PCB adsorption on activated carbon

    NASA Astrophysics Data System (ADS)

    Jensen, Bjørnar; Kvamme, Bjørn; Kuznetsova, Tatyana; Oterhals, A.˚ge

    2012-12-01

    The levels of polychlorinated dibenzo-p-dioxin, polychlorinated dibenzofuran (PCDD/F) and dioxin-like polychlorinated biphenyl (DL-PCB) in fishmeal and fish oil produced for use in feed for salmon is above present European legislation levels in some regions of the world and different decontamination approaches have been proposed [1]. One of these is adsorption on activated carbon. This approach appears to be efficient for adsorption of PCDD/F but less efficient for DL-PCB [2]. Activated carbon consists of slit pores with average sizes of 20 - 50 Ångstroms. One hypothesis [2] for the mechanism of trapping DL-PCB is reduced ability for intramolecular movements of the PCB molecules inside the slit pores. In order to investigate this hypothesis we have used quantum mechanics [3] to characterize two DL-PCB congeners, respectively congener 77 (3,3',4,4'-Tetrachlorobiphenyl) and congener 118 (2,3',4,4',5-Pentachlorobiphenyl) and Triolein (18:1) [4] as a major constituent of the solvent fish oil. A model for activated carbon was constructed using a crystal structure of graphite from the American Mineralogist Crystal Structure Database [5]. The crystal structure used was originally from Wyckoff [6]. A small program had to be written to generate the desired graphite structure as it contains no less than 31232 Carbon atoms. Partial atomic charges were estimated using QM with DFT/B3LYP/6-311+g** and SM6 [7].

  12. A current-excited triple-time-voltage oversampling method for bio-impedance model for cost-efficient circuit system.

    PubMed

    Yan Hong; Yong Wang; Wang Ling Goh; Yuan Gao; Lei Yao

    2015-08-01

    This paper presents a mathematic method and a cost-efficient circuit to measure the value of each component of the bio-impedance model at electrode-electrolyte interface. The proposed current excited triple-time-voltage oversampling (TTVO) method deduces the component values by solving triple simultaneous electric equation (TSEE) at different time nodes during a current excitation, which are the voltage functions of time. The proposed triple simultaneous electric equations (TSEEs) allows random selections of the time nodes, hence numerous solutions can be obtained during a single current excitation. Following that, the oversampling approach is engaged by averaging all solutions of multiple TSEEs acquired after a single current excitation, which increases the practical measurement accuracy through the improvement of the signal-to-noise ratio (SNR). In addition, a print circuit board (PCB) that consists a switched current exciter and an analog-to-digital converter (ADC) is designed for signal acquisition. This presents a great cost reduction when compared against other instrument-based measurement data reported [1]. Through testing, the measured values of this work is proven to be in superb agreements on the true component values of the electrode-electrolyte interface model. This work is most suited and also useful for biological and biomedical applications, to perform tasks such as stimulations, recordings, impedance characterizations, etc.

  13. Reusable vibration resistant integrated circuit mounting socket

    SciTech Connect

    Evans, C.N.

    1993-12-31

    This invention discloses a novel form of socket for integrated circuits to be mounted on printed circuit boards. The socket uses a novel contact which is fabricated out of a bimetallic strip with a shape which makes the end of the strip move laterally as temperature changes. The end of the strip forms a barb which digs into an integrated circuit lead at normal temperatures and hold it firmly in the contact, preventing loosening and open circuits from vibration. By cooling the contact containing the bimetallic strip the barb end can be made to release so that the integrated circuit lead can be removed from the socket without damage either to the lead or to the socket components.

  14. Reusable vibration resistant integrated circuit mounting socket

    DOEpatents

    Evans, Craig N.

    1995-01-01

    This invention discloses a novel form of socket for integrated circuits to be mounted on printed circuit boards. The socket uses a novel contact which is fabricated out of a bimetallic strip with a shape which makes the end of the strip move laterally as temperature changes. The end of the strip forms a barb which digs into an integrated circuit lead at normal temperatures and holds it firmly in the contact, preventing loosening and open circuits from vibration. By cooling the contact containing the bimetallic strip the barb end can be made to release so that the integrated circuit lead can be removed from the socket without damage either to the lead or to the socket components.

  15. LOGIC CIRCUIT

    DOEpatents

    Strong, G.H.; Faught, M.L.

    1963-12-24

    A device for safety rod counting in a nuclear reactor is described. A Wheatstone bridge circuit is adapted to prevent de-energizing the hopper coils of a ball backup system if safety rods, sufficient in total control effect, properly enter the reactor core to effect shut down. A plurality of resistances form one arm of the bridge, each resistance being associated with a particular safety rod and weighted in value according to the control effect of the particular safety rod. Switching means are used to switch each of the resistances in and out of the bridge circuit responsive to the presence of a particular safety rod in its effective position in the reactor core and responsive to the attainment of a predetermined velocity by a particular safety rod enroute to its effective position. The bridge is unbalanced in one direction during normal reactor operation prior to the generation of a scram signal and the switching means and resistances are adapted to unbalance the bridge in the opposite direction if the safety rods produce a predetermined amount of control effect in response to the scram signal. The bridge unbalance reversal is then utilized to prevent the actuation of the ball backup system, or, conversely, a failure of the safety rods to produce the predetermined effect produces no unbalance reversal and the ball backup system is actuated. (AEC)

  16. GENERATING THE RIGHT PCB DATA DETERMINATION OF AROCLORS VERSUS PCB CONGENERS

    SciTech Connect

    NARQUIS CT; PRIGNANO AL

    2007-11-21

    Polychlorinated biphenyls (PCBs) are a major environmental concern due to their ubiquity and tendency to bio-accumulate. as well as their persistence and toxicity. As the cleanup of waste and contaminated soil progresses at U.S. Department of Energy (DOE) sites, the costs for accurate PCB data are increasing. PCBs are actually a broad name for a group of 209 individual compounds known as congeners. PCBs were originally produced in the United States as specific mixtures of congeners known as Aroclors'. PCBs can be analyzed and quantified either as Aroclor mixtures or as individual congeners. Aroclor analysis, which is the more common analytical method applied to PCBs. has been in use for decades, and in general, most cleanup regulations are based on total PCB concentrations using Aroclor analyses. Congener analysis is relatively new to environmental cleanup and restoration due to both technical issues and associated cost. The benefits of congener analysis are that it allows a more direct analysis of the risk of the PCBs. The World Health Organization (WHO) has identified twelve specific congeners as dioxin-like with toxicity ranging from 0.00003 to 0.1 times the standard 2,3,7.8-Tetrachlorodibenzo-p-dioxin (2.3.7.8-TCDD) toxicity. This paper defines Aroclors and congeners and compares the current application and usefulness of the two analytical methods for environmental restoration and cleanup. A strategy for the best use of the two methods to optimize overall characterization cost is presented. As part of the strategy. a method using the data from Aroclor analyses to calculate 2,3,7,8-TCDD toxicity equivalent concentrations is also presented.

  17. Generating the Right PCB Data: Determination of Aroclors Versus PCB Congeners

    SciTech Connect

    Prignano, A.L.; Narquis, C.T.; Hyatt, J.E.

    2008-07-01

    Polychlorinated biphenyls (PCBs) are a major environmental concern due to their ubiquity and tendency to bio-accumulate, as well as their persistence and toxicity. As the cleanup of waste and contaminated soil progresses at U.S. Department of Energy (DOE) sites, the costs for accurate PCB data are increasing. PCBs are actually a broad name for a group of 209 individual compounds known as congeners. PCBs were originally produced in the United States as specific mixtures of congeners known as Aroclors. PCBs can be analyzed and quantified either as Aroclor mixtures or as individual congeners. Aroclor analysis, which is the more common analytical method applied to PCBs, has been in use for decades, and in general, most cleanup regulations are based on total PCB concentrations using Aroclor analyses. Congener analysis is relatively new to environmental cleanup and restoration due to both technical issues and associated cost. The benefits of congener analysis are that it allows a more direct analysis of the risk of the PCBs. The World Health Organization (WHO) has identified twelve specific congeners as dioxin-like with toxicity ranging from 0.00003 to 0.1 times the standard 2,3,7,8-Tetrachlorodibenzo-p-dioxin (2,3,7,8-TCDD) toxicity. This paper defines Aroclors and congeners and compares the current application and usefulness of the two analytical methods for environmental restoration and cleanup. A strategy for the best use of the two methods to optimize overall characterization cost is presented. As part of the strategy, a method using the data from Aroclor analyses to calculate 2,3,7,8-TCDD toxicity equivalent concentrations is also presented. (authors)

  18. Stable Polyurethane Coatings for Electronic Circuits

    NASA Technical Reports Server (NTRS)

    Morris, D. E.

    1983-01-01

    Alkane-based polyurethanes resist deterioration while maintaining good dielectric properties. Weight loss after prolonged immersion in hot water far less for alkane-based polyurethanes than for more common ether based polyurethanes, at any given oxygen content. Major uses of polyurethanes are as connector potting materials and conformal coatings for printed circuit boards.

  19. Computer-Assisted Experiments with Oscillatory Circuits

    ERIC Educational Resources Information Center

    Fernandes, J. C.; Ferraz, A.; Rogalski, M. S.

    2010-01-01

    A basic setup for data acquisition and analysis from an oscillatory circuit is described, with focus on its application as either low-pass, high-pass, band-pass or band-reject frequency filter. A homemade board containing the "RLC" elements allows for the interchange of some of them, in particular, for the easy change of the "R" value, and this…

  20. ENVIRONMENTAL TECHNOLOGY VERIFICATION REPORT: IMMUNOASSAY KIT, ENVIROLOGIX, INC., PCB IN SOIL TUBE ASSAY

    EPA Science Inventory

    In July 1997, the U.S. Environmental Protection Agency (EPA) conducted a demonstration of polychlorinated biphenyl (PCB) field analytical techniques. The purpose of this demonstration was to evaluate field analytical technologies capable of detecting and quantifying PCB's in soi...

  1. Immunity of PCB transplacental Yu-Cheng children in Taiwan

    SciTech Connect

    Lan, Shou Jen; Yen, Yea Yin; Chen, Eng Rin; Ko, Ying Chin ); Lan, Joung Liang )

    1990-02-01

    Up to now, there has been no studies about the immune status of PCB transplacental Yu-Cheng babies. In an earlier study, Yu-Cheng babies were reported to have a high infant mortality rate. It was reported that these babies would easily catch cold, experience diarrhea and abdominal pains. Recently, it was found that the bronchitis rate of Yu-Cheng babies is higher than in control babies. Because of high risk of infection, it is presumed that these babies might suffer immunosuppression to a certain extent. According to these findings, investigations into the immune functions of PCB transplacental Yu-Cheng babies are needed.

  2. Environmental projects. Volume 1: Polychlorinated biphenyl (PCB) abatement program

    NASA Technical Reports Server (NTRS)

    Kushner, L.

    1987-01-01

    Six large parabolic dish antennas are located at the Goldstone Deep Space Communications Complex north of Barstow, California. Some of the ancillary electrical equipment of thes Deep Space Stations, particularly transformers and power capicitors, were filled with stable, fire-retardant, dielectric fluids containing substances called polychlorobiphenyls (PCBs). Because the Environmental Protection Agency has determined that PCBs are environmental pollutants toxic to humans, all NASA centers have been asked to participate in a PCB-abatement program. Under the supervision of JPL's Office of Telecommunications and Data Acquisition, a two-year long PCB-abatement program has eliminated PCBs from the Goldstone Complex.

  3. An overlooked environmental issue? A review of the inadvertent formation of PCB-11 and other PCB congeners and their occurrence in consumer products and in the environment.

    PubMed

    Vorkamp, Katrin

    2016-01-15

    Polychlorinated biphenyls (PCBs) are banned from production and use in most countries as they are persistent organic pollutants (POPs) of concern for environment and health. Recent research has pointed at a new environment issue resulting from the inadvertent formation of PCBs in certain processes, in particular the pigment production. PCB-11 is a major by-product in these processes, but PCB-28, PCB-52, PCB-77 as well as the nonachlorinated PCBs and PCB-209 have been found in pigments and consumer products as well. In addition to environmental emissions via point sources, in particular related to industrial and municipal wastewater, atmospheric transport seems to be important for the global distribution of PCB-11. Thus, PCB-11 has also been detected in the polar regions. Worldwide air concentrations appear relatively uniform, but maxima have been found in urban and industrialised areas. Data on the uptake and accumulation of PCB-11 in the food chain are still inconclusive: Although food web studies do not show biomagnification, PCB-11 has been detected in humans. The human exposure might originate from the direct contact to consumer products as well as from the omnipresence of PCB-11 in the environment. PMID:26490526

  4. The dioxin-like PCB 77 but not the ortho-substituted PCB 153 interferes with chicken embryo thyroid hormone homeostasis and delays hatching.

    PubMed

    Roelens, Simon A; Beck, Veerle; Maervoet, Johan; Aerts, Goele; Reyns, Geert E; Schepens, Paul; Darras, Veerle M

    2005-08-01

    The effects of the dioxin-like polychlorinated biphenyl (PCB) 77 and the ortho-substituted PCB 153 on thyroid hormone availability were investigated during the last week of embryonic development in chicken. High doses of these PCBs (1microg PCB 77 and 20microg PCB 153) were injected into chicken eggs at day 4 of incubation. Blood and tissue samples were collected from day 14 of incubation until 1 day after hatching. We did not observe influences of PCB 153 on thyroid hormone (TH) levels. Treatment with PCB 77, on the other hand, decreased plasma total T(4) concentrations but increased hepatic T(4) levels at day 14 of incubation. Later in development, at stages near the process of hatching, severe decreases of T(4) and T(3) levels were observed in the PCB 77 group, both in plasma and tissues. PCB 77 severely reduced the TH peak that normally coincides with the stage of internal pipping. This reduction was accompanied by a considerable delay in the moment of hatching. We conclude that the dioxin-like PCB 77, but not the ortho-substituted PCB 153, can decrease TH availability towards the end of embryonic development and hence disturb the process of hatching.

  5. Altered stress-induced cortisol levels in goats exposed to polychlorinated biphenyls (PCB 126 and PCB 153) during fetal and postnatal development.

    PubMed

    Zimmer, Karin E; Gutleb, Arno C; Lyche, Jan L; Dahl, Ellen; Oskam, Irma C; Krogenaes, Anette; Skaare, Janneche Utne; Ropstad, Erik

    2009-01-01

    Short-term stress exposure is associated with activation of the hypothalamic-pituitary-adrenal (HPA) axis and a consequent rise in blood glucocorticoids and catecholamines, from the adrenal cortex and medulla, respectively. The HPA axis is a potential target for some persistent organic pollutants, among which polychlorinated biphenyls (PCB) were found to be modulators of the mammalian endocrine system. PCB are distributed globally in the environment, in food chains, and are transferred to the fetuses of pregnant animals and via mother's milk to suckling offspring. In the present study it was postulated that intrauterine and lactational exposure to either of two single congeners of PCB (PCB 153 and PCB 126, respectively) might affect basal cortisol concentrations, and also the cortisol response to short-term stress in adulthood. Thus, pregnant goats were orally exposed to one of these PCB congeners from d 60 of gestation until delivery, and their offspring studied. Low-dose exposure to PCB 153 and PCB 126 resulted in significantly lower mean basal cortisol concentrations in goat offspring during certain periods of pubertal development and their first breeding season. Male goat kids exposed to either PCB congener showed a greater and more prolonged rise in plasma cortisol levels than controls when animals were subjected to mild stress at 9 mo of age using frequent blood sampling. Neither the basal maternal cortisol plasma level nor goat kid adrenal masses were affected by PCB exposure.

  6. An overlooked environmental issue? A review of the inadvertent formation of PCB-11 and other PCB congeners and their occurrence in consumer products and in the environment.

    PubMed

    Vorkamp, Katrin

    2016-01-15

    Polychlorinated biphenyls (PCBs) are banned from production and use in most countries as they are persistent organic pollutants (POPs) of concern for environment and health. Recent research has pointed at a new environment issue resulting from the inadvertent formation of PCBs in certain processes, in particular the pigment production. PCB-11 is a major by-product in these processes, but PCB-28, PCB-52, PCB-77 as well as the nonachlorinated PCBs and PCB-209 have been found in pigments and consumer products as well. In addition to environmental emissions via point sources, in particular related to industrial and municipal wastewater, atmospheric transport seems to be important for the global distribution of PCB-11. Thus, PCB-11 has also been detected in the polar regions. Worldwide air concentrations appear relatively uniform, but maxima have been found in urban and industrialised areas. Data on the uptake and accumulation of PCB-11 in the food chain are still inconclusive: Although food web studies do not show biomagnification, PCB-11 has been detected in humans. The human exposure might originate from the direct contact to consumer products as well as from the omnipresence of PCB-11 in the environment.

  7. PCB glass-fibre laminates: Thermal conductivity measurements and their effect on simulation

    NASA Astrophysics Data System (ADS)

    Sarvar, F.; Poole, N. J.; Witting, P. A.

    1990-12-01

    Accurate values of thermal conductivity are required for the simulation of temperature phenomena in electronic circuits. This paper presents the results of measurements carried out to determine the thermal conductivity along and normal to the plane of fibre glass laminates used in the manufacture of printed circuit boards. It has been found that the reinforced fibre-glass substrates used in PCBs are strongly anisotropic with the conductivity normal to the boards being much smaller than tangential to it. The test samples were type FR4 epoxy/glass laminates. An experiment has been designed which determines the thermal conductivity in-the-plane of the laminates by matching the measured temperature distribution along a heated specimen with a finite difference solution. An electrically heated Lees’ disc apparatus is also used to measure the thermal conductivity of these boards in a direction normal to their plane. The samples tested yielded values of 0.343 W/mK and 1.059 W/mK for thermal conductivity through and along the plane of the boards, respectively.

  8. Effects of PCB126 and PCB153 on telomerase activity and telomere length in undifferentiated and differentiated HL-60 cells.

    PubMed

    Xin, Xing; Senthilkumar, P K; Schnoor, Jerald L; Ludewig, Gabriele

    2016-02-01

    PCBs are persistent organic pollutants that are carcinogenic and immunotoxic and have developmental toxicity. This suggests that they may interfere with normal cell maturation. Cancer and stem/progenitor cells have telomerase activity to maintain and protect the chromosome ends, but lose this activity during differentiation. We hypothesized that PCBs interfere with telomerase activity and the telomere complex, thereby disturbing cell differentiation and stem/progenitor cell function. HL-60 cells are cancer cells that can differentiated into granulocytes and monocytes. We exposed HL-60 cells to PCB126 (dioxin-like) and PCB153 (nondioxin-like) 6 days before and during 3 days of differentiation. The differentiated cells showed G0/G1 phase arrest and very low telomerase activity. hTERT and hTR, two telomerase-related genes, were downregulated. The telomere shelterins TRF1, TRF2, and POT1 were upregulated in granulocytes, and TRF2 was upregulated and POT1 downregulated in monocytes. Both PCBs further reduced telomerase activity in differentiated cells, but had only small effects on the differentiation and telomere-related genes. Treatment of undifferentiated HL-60 cells for 30 days with PCB126 produced a downregulation of telomerase activity and a decrease of hTERT, hTR, TRF1, and POT1 gene expression. With PCB153, the effects were less pronounced and some shelterin genes were increased after 30 days of exposure. With each PCB, no differentiation of cells was observed and cells continued to proliferate despite reduced telomerase activity, resulting in shortened telomeres after 30 days of exposure. These results indicate cell-type and PCB congener-specific effects on telomere/telomerase-related genes. Although PCBs do not seem to strongly affect differentiation, they may influence stem or progenitor cells through telomere attrition with potential long-term consequences for health.

  9. 40 CFR 761.62 - Disposal of PCB bulk product waste.

    Code of Federal Regulations, 2014 CFR

    2014-07-01

    ... 40 Protection of Environment 31 2014-07-01 2014-07-01 false Disposal of PCB bulk product waste..., AND USE PROHIBITIONS Storage and Disposal § 761.62 Disposal of PCB bulk product waste. PCB bulk... EPA approves another sampling plan under paragraph (c) of this section. (a) Performance-based...

  10. 40 CFR 761.62 - Disposal of PCB bulk product waste.

    Code of Federal Regulations, 2012 CFR

    2012-07-01

    ... 40 Protection of Environment 32 2012-07-01 2012-07-01 false Disposal of PCB bulk product waste..., AND USE PROHIBITIONS Storage and Disposal § 761.62 Disposal of PCB bulk product waste. PCB bulk... EPA approves another sampling plan under paragraph (c) of this section. (a) Performance-based...

  11. 40 CFR 761.62 - Disposal of PCB bulk product waste.

    Code of Federal Regulations, 2013 CFR

    2013-07-01

    ... 40 Protection of Environment 32 2013-07-01 2013-07-01 false Disposal of PCB bulk product waste..., AND USE PROHIBITIONS Storage and Disposal § 761.62 Disposal of PCB bulk product waste. PCB bulk... EPA approves another sampling plan under paragraph (c) of this section. (a) Performance-based...

  12. 40 CFR 761.298 - Decisions based on PCB concentration measurements resulting from sampling.

    Code of Federal Regulations, 2012 CFR

    2012-07-01

    ... 40 Protection of Environment 32 2012-07-01 2012-07-01 false Decisions based on PCB concentration....61(a)(6) § 761.298 Decisions based on PCB concentration measurements resulting from sampling. (a) For grid samples which are chemically analyzed individually, the PCB concentration applies to the area...

  13. 40 CFR 761.298 - Decisions based on PCB concentration measurements resulting from sampling.

    Code of Federal Regulations, 2011 CFR

    2011-07-01

    ... 40 Protection of Environment 31 2011-07-01 2011-07-01 false Decisions based on PCB concentration....61(a)(6) § 761.298 Decisions based on PCB concentration measurements resulting from sampling. (a) For grid samples which are chemically analyzed individually, the PCB concentration applies to the area...

  14. 40 CFR 761.298 - Decisions based on PCB concentration measurements resulting from sampling.

    Code of Federal Regulations, 2013 CFR

    2013-07-01

    ... 40 Protection of Environment 32 2013-07-01 2013-07-01 false Decisions based on PCB concentration....61(a)(6) § 761.298 Decisions based on PCB concentration measurements resulting from sampling. (a) For grid samples which are chemically analyzed individually, the PCB concentration applies to the area...

  15. 40 CFR 761.298 - Decisions based on PCB concentration measurements resulting from sampling.

    Code of Federal Regulations, 2014 CFR

    2014-07-01

    ... 40 Protection of Environment 31 2014-07-01 2014-07-01 false Decisions based on PCB concentration....61(a)(6) § 761.298 Decisions based on PCB concentration measurements resulting from sampling. (a) For grid samples which are chemically analyzed individually, the PCB concentration applies to the area...

  16. DISTRIBUTION OF PCB 84 ENANTIOMERS IN C57BL/6 MICE

    EPA Science Inventory

    Nineteen of the 209 possible PCB congeners exist as pairs of stable rotational isomers that are enantiomeric to each other. A racemic mixture of PCB atropisomers is present in technical PCB mixtures, thus raising concerns about enantioselective distribution, metabolism, and dispo...

  17. 40 CFR 261.8 - PCB wastes regulated under Toxic Substance Control Act.

    Code of Federal Regulations, 2012 CFR

    2012-07-01

    ... 40 Protection of Environment 27 2012-07-01 2012-07-01 false PCB wastes regulated under Toxic... (CONTINUED) SOLID WASTES (CONTINUED) IDENTIFICATION AND LISTING OF HAZARDOUS WASTE General § 261.8 PCB wastes regulated under Toxic Substance Control Act. The disposal of PCB-containing dielectric fluid and...

  18. 40 CFR 261.8 - PCB wastes regulated under Toxic Substance Control Act.

    Code of Federal Regulations, 2010 CFR

    2010-07-01

    ... 40 Protection of Environment 25 2010-07-01 2010-07-01 false PCB wastes regulated under Toxic... (CONTINUED) SOLID WASTES (CONTINUED) IDENTIFICATION AND LISTING OF HAZARDOUS WASTE General § 261.8 PCB wastes regulated under Toxic Substance Control Act. The disposal of PCB-containing dielectric fluid and...

  19. 40 CFR 261.8 - PCB wastes regulated under Toxic Substance Control Act.

    Code of Federal Regulations, 2014 CFR

    2014-07-01

    ... 40 Protection of Environment 26 2014-07-01 2014-07-01 false PCB wastes regulated under Toxic... (CONTINUED) SOLID WASTES (CONTINUED) IDENTIFICATION AND LISTING OF HAZARDOUS WASTE General § 261.8 PCB wastes regulated under Toxic Substance Control Act. The disposal of PCB-containing dielectric fluid and...

  20. 40 CFR 261.8 - PCB wastes regulated under Toxic Substance Control Act.

    Code of Federal Regulations, 2013 CFR

    2013-07-01

    ... 40 Protection of Environment 27 2013-07-01 2013-07-01 false PCB wastes regulated under Toxic... (CONTINUED) SOLID WASTES (CONTINUED) IDENTIFICATION AND LISTING OF HAZARDOUS WASTE General § 261.8 PCB wastes regulated under Toxic Substance Control Act. The disposal of PCB-containing dielectric fluid and...

  1. 40 CFR 261.8 - PCB wastes regulated under Toxic Substance Control Act.

    Code of Federal Regulations, 2011 CFR

    2011-07-01

    ... 40 Protection of Environment 26 2011-07-01 2011-07-01 false PCB wastes regulated under Toxic... (CONTINUED) SOLID WASTES (CONTINUED) IDENTIFICATION AND LISTING OF HAZARDOUS WASTE General § 261.8 PCB wastes regulated under Toxic Substance Control Act. The disposal of PCB-containing dielectric fluid and...

  2. gamma. Irradiation induced formation of PCB-solvent adducts in aliphatic solvents

    SciTech Connect

    Lepine, F.; Milot, S.; Gagne, N. )

    1990-09-01

    {gamma}Irradiation induced formation of PCB-solvent adducts was investigated as a model for PCB residues in irradiated food. Formation of cyclohexyl adducts of PCBs was found to be significant when pure PCB congeners and Aroclor mixture were irradiated in cyclohexane and cyclohexene. Reaction pathways were investigated, and the effects of oxygen and electron scavenger were studied.

  3. Subchronic Exposure to TCDD, PeCDF, PCB126, and PCB153: Effect on Hepatic Gene Expression

    PubMed Central

    Vezina, Chad M.; Walker, Nigel J.; Olson, James R.

    2004-01-01

    We employed DNA microarray to identify unique hepatic gene expression patterns associated with subchronic exposure to 2,3,7,8-tetrachlorodibenzo-p-dioxin (TCDD) and other halogenated aromatic hydrocarbons (HAHs). Female Harlan Sprague-Dawley rats were exposed for 13 weeks to toxicologically equivalent doses of four different HAHs based on the toxic equivalency factor of each chemical: TCDD (100 ng/kg/day), 2,3,4,7,8-pentachlorodibenzofuran (PeCDF; 200 ng/kg/day), 3,3′,4,4′,5-pentachlorobiphenyl (PCB126; 1,000 ng/kg/day), or 2,2′,4,4′,5,5′-hexachlorobiphenyl (PCB153; 1,000 μg/kg/day). Global gene expression profiles for each exposure, which account for 8,799 gene probe sets contained on Affymetrix RGU34A GeneChips, were compared by principal components analysis. The aryl hydrocarbon receptor (AhR) ligands TCDD, PeCDF, and PCB126 produced very similar global gene expression profiles that were unique from the nonAhR ligand PCB153, underscoring the extensive impact of AhR activation and/or the resulting hepatic injury on global gene expression in female rat liver. Many genes were co-expressed during the 13-week TCDD, PeCDF, or PCB126 exposures, including classical AhR-regulated genes and some genes not previously characterized as being AhR regulated, such as carcinoembryonic-cell adhesion molecule 4 (C-CAM4) and adenylate cyclase-associated protein 2 (CAP2). Real-time reverse-transcriptase polymerase chain reaction confirmed the increased expression of these genes in TCDD-, PeCDF-, and PCB126-exposed rats as well as the up- or down-regulation of several other novel dioxin-responsive genes. In summary, DNA microarray successfully identified dioxin-responsive genes expressed after exposure to AhR ligands (TCDD, PeCDF, PCB126) but not after exposure to the non-AhR ligand PCB153. Together, these findings may help to elucidate some of the fundamental features of dioxin toxicity and may further clarify the biologic role of the AhR signaling pathway. PMID:15598615

  4. Test for optical systems in laser projection imaging for PCB

    NASA Astrophysics Data System (ADS)

    Qin, Ouyang; Zhou, Jinyun; Lei, Liang; Lin, Qinghua

    2010-11-01

    Projection imaging is one of the most important steps in the fabrication of Printed Circuit Board. In order to meet the increasing demand for higher resolution, speed and larger area of imaging, a novel Laser Projection Imaging (LPI) has been developed to take the place of the conventional Hg lamp exposure. We set up a system with resolution 10μm over large exposure area of 460mm×610mm on substrate materials. The system is available by the combination of three main parts: an XeF excimer laser with a wavelength of 351nm and single pulse energy of 120mJ, an illumination system with numerical aperture (NA) value of 0.02, and a double telecentric optical projection lens with NA value of 0.025. Such designs can theoretically meet the demand of actual lithography. However, experiments have shown that the propagation loss ratio of laser power from the light source to the substrate can be up to 50% or more so as to hardly achieve the expected results. In this paper, we present our results of experiments under different conditions on laser projection imaging equipment, and meanwhile, parameters such as gas lifetime, pulse repetition rate, exposure dose, as well as the optical lose of quartz microlens array are analyzed. Finally, we acquired the optimum exposure parameters.

  5. Commutation circuit for an HVDC circuit breaker

    DOEpatents

    Premerlani, W.J.

    1981-11-10

    A commutation circuit for a high voltage DC circuit breaker incorporates a resistor capacitor combination and a charging circuit connected to the main breaker, such that a commutating capacitor is discharged in opposition to the load current to force the current in an arc after breaker opening to zero to facilitate arc interruption. In a particular embodiment, a normally open commutating circuit is connected across the contacts of a main DC circuit breaker to absorb the inductive system energy trapped by breaker opening and to limit recovery voltages to a level tolerable by the commutating circuit components. 13 figs.

  6. Commutation circuit for an HVDC circuit breaker

    DOEpatents

    Premerlani, William J.

    1981-01-01

    A commutation circuit for a high voltage DC circuit breaker incorporates a resistor capacitor combination and a charging circuit connected to the main breaker, such that a commutating capacitor is discharged in opposition to the load current to force the current in an arc after breaker opening to zero to facilitate arc interruption. In a particular embodiment, a normally open commutating circuit is connected across the contacts of a main DC circuit breaker to absorb the inductive system energy trapped by breaker opening and to limit recovery voltages to a level tolerable by the commutating circuit components.

  7. 21 CFR 109.30 - Tolerances for polychlorinated biphenyls (PCB's).

    Code of Federal Regulations, 2013 CFR

    2013-04-01

    ... 21 Food and Drugs 2 2013-04-01 2013-04-01 false Tolerances for polychlorinated biphenyls (PCB's). 109.30 Section 109.30 Food and Drugs FOOD AND DRUG ADMINISTRATION, DEPARTMENT OF HEALTH AND HUMAN SERVICES (CONTINUED) FOOD FOR HUMAN CONSUMPTION UNAVOIDABLE CONTAMINANTS IN FOOD FOR HUMAN CONSUMPTION...

  8. Recovery of a PCB-Contaminated Creek Fish Community

    EPA Science Inventory

    Polychlorinated Biphenyls (PCBs) from the Sangamo-Weston Superfund Site near Clemson, South Carolina, USA, were released into the Twelvemile Creek until the early 1990s. PCB concentrations in fish in this creek have remained elevated: levels in six target fish species are still a...

  9. 40 CFR 761.2 - PCB concentration assumptions for use.

    Code of Federal Regulations, 2013 CFR

    2013-07-01

    ... must assume that a capacitor manufactured prior to July 2, 1979, whose PCB concentration is not established contains ≥500 ppm PCBs. Any person may assume that a capacitor manufactured after July 2, 1979, is... capacitor contains ≥500 ppm PCBs. Any person may assume that a capacitor marked at the time of...

  10. PCB congener accumulation by periphyton, herbivores, and omnivores.

    PubMed

    Hill, W R; Napolitano, G E

    1997-05-01

    The concentrations of 20 polychlorinated biphenyl (PCB) congeners were measured in periphyton, herbivorous fish (stoneroller minnows, Campostoma anomalum), and omnivorous fish (striped shiners, Luxilus chrysocephalus) in an industrially contaminated stream and a reference stream in eastern Tennessee. The sum of the concentrations of the 20 congeners, normalized by dry mass, was one to two orders of magnitude higher in stonerollers and shiners than in periphyton. Normalizing PCB concentrations by lipid mass reduced concentration differences between periphyton and stonerollers, but PCBs per unit lipid in stonerollers were still 50-350% higher than those in periphyton. Shiners had significantly higher lipid-specific PCB concentrations than did stonerollers, so a trophic hierarchy of primary producer < herbivore < omnivore was evident in lipid-specific PCB concentrations. Differences in lipid type, exposure duration, and exposure sources may account for the trophic-level differences in total PCBs. Congener profiles were roughly similar in periphyton, stonerollers, and shiners: five congeners (IUPAC numbers 101, 110, 138, 153, and 180) constituted >60% of the total mass of PCBs analyzed in all three trophic levels. However, stoneroller and shiner tissue was enriched in congeners 153, 118, and 187 relative to periphyton; congeners 153 and 187 are resistant to metabolic breakdown by monooxygenases found in fish liver. Principal component analysis of congener percentages separated periphyton from fish and distinguished between sampling locations.

  11. ENVIRONMENTAL PCB AND PESTICIDE EXPOSURE AND RISK OF ENDOMETRIOSIS

    EPA Science Inventory

    Environmental PCB and Pesticide Exposure and Risk of Endometriosis

    Germaine M. Buck1, John M. Weiner2, Hebe Greizerstein3, Brian Whitcomb1, Enrique Schisterman1, Paul Kostyniak3, Danelle Lobdell4, Kent Crickard5, and Ralph Sperrazza5

    1Epidemiology Branch, Division o...

  12. Thermal desorption of PCB-contaminated soil with sodium hydroxide.

    PubMed

    Liu, Jie; Qi, Zhifu; Zhao, Zhonghua; Li, Xiaodong; Buekens, Alfons; Yan, Jianhua; Ni, Mingjiang

    2015-12-01

    The thermal desorption was combined with sodium hydroxide to remediate polychlorinated biphenyl (PCB)-contaminated soil. The experiments were conducted at different temperatures ranging from 300 to 600 °C with three NaOH contents of 0.1, 0.5, and 1 %. The results showed that thermal desorption was effective for PCB removal, destruction, and detoxication, and the presence of NaOH enhanced the process by significant dechlorination. After treatment with 0.1 % NaOH, the removal efficiency (RE) increased from 84.8 % at 300 °C to 98.0 % at 600 °C, corresponding to 72.7 and 91.7 % of destruction efficiency (DE). With 1 % NaOH content treated at 600 °C, the RE and DE were 99.0 and 93.6 %, respectively. The effect of NaOH content on PCB removal was significant, especially at lower temperature, yet it weakened under higher temperature. The interaction between NaOH content and temperature influenced the PCB composition. The higher temperature with the help of NaOH effectively increased the RE and DE of 12 dioxin-like PCBs (based on WHO-TEQ).

  13. Computer Model for Prediction of PCB Dechlorination and Biodegradation Endpoints

    SciTech Connect

    Just, E.M.; Klasson, T.

    1999-04-19

    Mathematical modeling of polychlorinated biphenyl (PCB) transformation served as a means of predicting possible endpoints of bioremediation, thus allowing evaluation of several of the most common transformation patterns. Correlation between laboratory-observed and predicted endpoint data was, in some cases, as good as 0.98 (perfect correlation = 1.0).

  14. PC board mount corrosion sensitive sensor

    DOEpatents

    Robinson, Alex L.; Casias, Adrian L.; Pfeifer, Kent B.; Laguna, George R.

    2016-03-22

    The present invention relates to surface mount structures including a capacitive element or a resistive element, where the element has a property that is responsive to an environmental condition. In particular examples, the structure can be optionally coupled to a printed circuit board. Other apparatuses, surface mountable structures, and methods of use are described herein.

  15. A simple tachometer circuit

    NASA Technical Reports Server (NTRS)

    Dimeff, J.

    1972-01-01

    Electric circuit to measure frequency of repetitive sinusoidal or rectangular wave is presented. Components of electric circuit and method of operation are explained. Application of circuit as tachometer for automobile is discussed.

  16. Photomultiplier blanking circuit

    NASA Technical Reports Server (NTRS)

    Mcclenahan, J. O.

    1972-01-01

    Circuit for protecting photomultiplier equipment from current surges which occur when exposed to brilliant illumination is discussed. Components of circuit and details of operation are provided. Circuit diagram to show action of blanking pulse on zener diode is included.

  17. The Transcriptional Effects of PCB118 and PCB153 on the Liver, Adipose Tissue, Muscle and Colon of Mice: Highlighting of Glut4 and Lipin1 as Main Target Genes for PCB Induced Metabolic Disorders.

    PubMed

    Mesnier, Aurélia; Champion, Serge; Louis, Laurence; Sauzet, Christophe; May, Phealay; Portugal, Henri; Benbrahim, Karim; Abraldes, Joelle; Alessi, Marie-Christine; Amiot-Carlin, Marie-Josephe; Peiretti, Franck; Piccerelle, Philippe; Nalbone, Gilles; Villard, Pierre-Henri

    2015-01-01

    Epidemiological studies have associated environmental exposure to polychlorinated biphenyls (PCBs) with an increased risk of type 2 diabetes; however, little is known about the underlying mechanisms involved in the metabolic side-effects of PCB. Our study evaluated the transcriptional effects of a subchronic exposure (gavage at Day 0 and Day 15 with 10 or 100 μmol/Kg bw) to PCB118 (dioxin-like PCB), PCB153 (non-dioxin-like PCB), or an equimolar mixture of PCB118 and PCB153 on various tissues (liver, visceral adipose tissue, muscle, and colon) in mice. Our results showed that a short-term exposure to PCB118 and/or PCB153 enhanced circulating triglyceride levels but did not affect glycemia. Among the studied tissues, we did not observe any modification of the expression of inflammation-related genes, such as cytokines or chemokines. The main transcriptional effects were observed in visceral adipose and liver tissues. We found a downregulation of lipin1 and glut4 expression in these two target organs. In adipose tissue, we also showed a downregulation of Agpat2, Slc25a1, and Fasn. All of these genes are involved in lipid metabolism and insulin resistance. In muscles, we observed an induction of CnR1 and Foxo3 expression, which may be partly involved in PCB metabolic effects. In summary, our results suggest that lipin1 and glut4, notably in adipose tissue, are the main targeted genes in PCB-induced metabolic disorders, however, further studies are required to fully elucidate the mechanisms involved.

  18. The Transcriptional Effects of PCB118 and PCB153 on the Liver, Adipose Tissue, Muscle and Colon of Mice: Highlighting of Glut4 and Lipin1 as Main Target Genes for PCB Induced Metabolic Disorders

    PubMed Central

    Mesnier, Aurélia; Champion, Serge; Louis, Laurence; Sauzet, Christophe; May, Phealay; Portugal, Henri; Benbrahim, Karim; Abraldes, Joelle; Alessi, Marie-Christine; Amiot-Carlin, Marie-Josephe; Peiretti, Franck; Piccerelle, Philippe; Nalbone, Gilles; Villard, Pierre-Henri

    2015-01-01

    Epidemiological studies have associated environmental exposure to polychlorinated biphenyls (PCBs) with an increased risk of type 2 diabetes; however, little is known about the underlying mechanisms involved in the metabolic side-effects of PCB. Our study evaluated the transcriptional effects of a subchronic exposure (gavage at Day 0 and Day 15 with 10 or 100 μmol/Kg bw) to PCB118 (dioxin-like PCB), PCB153 (non-dioxin-like PCB), or an equimolar mixture of PCB118 and PCB153 on various tissues (liver, visceral adipose tissue, muscle, and colon) in mice. Our results showed that a short-term exposure to PCB118 and/or PCB153 enhanced circulating triglyceride levels but did not affect glycemia. Among the studied tissues, we did not observe any modification of the expression of inflammation-related genes, such as cytokines or chemokines. The main transcriptional effects were observed in visceral adipose and liver tissues. We found a downregulation of lipin1 and glut4 expression in these two target organs. In adipose tissue, we also showed a downregulation of Agpat2, Slc25a1, and Fasn. All of these genes are involved in lipid metabolism and insulin resistance. In muscles, we observed an induction of CnR1 and Foxo3 expression, which may be partly involved in PCB metabolic effects. In summary, our results suggest that lipin1 and glut4, notably in adipose tissue, are the main targeted genes in PCB-induced metabolic disorders, however, further studies are required to fully elucidate the mechanisms involved. PMID:26086818

  19. Assessment of the Polychlorinated Biphenyl (PCB) Occurrence in Copper Sulfates and the Influential Role of PCB Levels on Grapes

    PubMed Central

    Li, Xiaomin; Su, Xiaoou

    2015-01-01

    Copper sulfates (CuSO4) are widely used as the primary component of fungicides in the grape industry. The agricultural-grade CuSO4 that we collected from Chinese nationwide markets were found to be contaminated by polychlorinated dibenzo-p-dioxins and dibenzofurans and high levels of polychlorinated biphenyls (Σ19PCBs: 0.32~9.51 ng/g). In the following research, we studied the impact of CuSO4 application on PCB levels in grape products through a field experiment, and conducted a national survey to speculate the role that CuSO4 played on the occurrence of PCB in grapes. In the field experiment, an obvious increase of PCBs in grape leaves (from 174 to 250 pg/g fw) was observed after Bordeaux mixture (the main component of which is CuSO4) application. As to the main PCB congener in CuSO4, the most toxic CB 126 (toxic equivalency factor = 0.1) also increased in grape peels (from 1.66 to 2.93 pg/g fw) after pesticide spray. Both the correlation study and the principal component analysis indicated that environmental factors were dominant PCB contributors to grapes, and grapes from e-waste dismantling area containing the highest PCBs also proved the notion. It is worth noting that this report describes the first research examining PCBs in CuSO4 and its influence on agricultural products to date. PMID:26658158

  20. Assessment of the Polychlorinated Biphenyl (PCB) Occurrence in Copper Sulfates and the Influential Role of PCB Levels on Grapes.

    PubMed

    Li, Xiaomin; Su, Xiaoou

    2015-01-01

    Copper sulfates (CuSO4) are widely used as the primary component of fungicides in the grape industry. The agricultural-grade CuSO4 that we collected from Chinese nationwide markets were found to be contaminated by polychlorinated dibenzo-p-dioxins and dibenzofurans and high levels of polychlorinated biphenyls (Σ19PCBs: 0.32~9.51 ng/g). In the following research, we studied the impact of CuSO4 application on PCB levels in grape products through a field experiment, and conducted a national survey to speculate the role that CuSO4 played on the occurrence of PCB in grapes. In the field experiment, an obvious increase of PCBs in grape leaves (from 174 to 250 pg/g fw) was observed after Bordeaux mixture (the main component of which is CuSO4) application. As to the main PCB congener in CuSO4, the most toxic CB 126 (toxic equivalency factor = 0.1) also increased in grape peels (from 1.66 to 2.93 pg/g fw) after pesticide spray. Both the correlation study and the principal component analysis indicated that environmental factors were dominant PCB contributors to grapes, and grapes from e-waste dismantling area containing the highest PCBs also proved the notion. It is worth noting that this report describes the first research examining PCBs in CuSO4 and its influence on agricultural products to date. PMID:26658158