Packaging printed circuit boards: A production application of interactive graphics

NASA Technical Reports Server (NTRS)

Perrill, W. A.

1975-01-01

The structure and use of an Interactive Graphics Packaging Program (IGPP), conceived to apply computer graphics to the design of packaging electronic circuits onto printed circuit boards (PCB), were described. The intent was to combine the data storage and manipulative power of the computer with the imaginative, intuitive power of a human designer. The hardware includes a CDC 6400 computer and two CDC 777 terminals with CRT screens, light pens, and keyboards. The program is written in FORTRAN 4 extended with the exception of a few functions coded in COMPASS (assembly language). The IGPP performs four major functions for the designer: (1) data input and display, (2) component placement (automatic or manual), (3) conductor path routing (automatic or manual), and (4) data output. The most complex PCB packaged to date measured 16.5 cm by 19 cm and contained 380 components, two layers of ground planes and four layers of conductors mixed with ground planes.

A Compact Cosmic Ray Telescope using Silicon Photomultipliers for use in High Schools

NASA Astrophysics Data System (ADS)

Castro, Luis; Elizondo, Leonardo; Shelor, Mark; Cervantes, Omar; Fan, Sewan; Ritt, Stefan

2016-03-01

Over the years, the QuarkNet and the LBL Cosmic Ray Project have helped trained thousands of high school students and teachers to explore cosmic ray physics. To get high school students in the Salinas, CA area also excited about cosmic rays, we constructed a cosmic ray telescope as a physics outreach apparatus. Our apparatus includes a pair of plastic scintillators coupled to silicon photomultipliers (SiPM) and a coincidence circuit board. We designed and constructed custom circuit boards for mounting the SiPM detectors, the high voltage power supplies and coincidence AND circuit. The AND logic signals can be used for triggering data acquisition devices including an oscilloscope, a waveform digitizer or an Arduino microcontroller. To properly route the circuit wire traces, the circuit boards were layout in Eagle and fabricated in-house using a circuit board maker from LPKF LASER, model Protomat E33. We used a Raspberry Pi computer to control a fast waveform sampler, the DRS4 to digitize the SiPM signal waveforms. The CERN PAW software package was used to analyze the amplitude and time distributions of SiPM detector signals. At this conference, we present our SiPM experimental setup, circuit board fabrication procedures and the data analysis work flow. AIP Megger's Award, Dept. of Ed. Title V Grant PO31S090007.

Chemical and biological processes for multi-metal extraction from waste printed circuit boards of computers and mobile phones.

PubMed

Shah, Monal B; Tipre, Devayani R; Dave, Shailesh R

2014-11-01

E-waste printed circuit boards (PCB) of computers, mobile-phones, televisions, LX (LongXiang) PCB in LED lights and bulbs, and tube-lights were crushed to ≥250 µm particle size and 16 different metals were analysed. A comparative study has been carried out to evaluate the extraction of Cu-Zn-Ni from computer printed circuit boards (c-PCB) and mobile-phone printed circuit boards (m-PCB) by chemical and biological methods. Chemical process showed the extraction of Cu-Zn-Ni by ferric sulphate was best among the studied chemical lixiviants. Bioleaching experiments were carried out with the iron oxidising consortium, which showed that when E-waste and inoculum were added simultaneously in the medium (one-step process); 60.33% and 87.50% Cu, 75.67% and 85.67% Zn and 71.09% and 81.87% Ni were extracted from 10 g L(-1) of c-PCB and m-PCB, respectively, within 10-15 days of reaction time. Whereas, E-waste added after the complete oxidation of Fe(2+) to Fe(3+) iron containing medium (two-step process) showed 85.26% and 99.99% Cu, 96.75% and 99.49% Zn and 93.23% and 84.21% Ni extraction from c-PCB and m-PCB, respectively, only in 6-8 days. Influence of varying biogenerated Fe(3+) and c-PCB concentrations showed that 16.5 g L(-1) of Fe(3+) iron was optimum up to 100 g L(-1) of c-PCB. Changes in pH, acid consumed and redox potential during the process were also studied. The present study shows the ability of an eco-friendly process for the recovery of multi-metals from E-waste even at 100 g L(-1) printed circuit boards concentration. © The Author(s) 2014.

A Formal Algorithm for Routing Traces on a Printed Circuit Board

NASA Technical Reports Server (NTRS)

Hedgley, David R., Jr.

1996-01-01

This paper addresses the classical problem of printed circuit board routing: that is, the problem of automatic routing by a computer other than by brute force that causes the execution time to grow exponentially as a function of the complexity. Most of the present solutions are either inexpensive but not efficient and fast, or efficient and fast but very costly. Many solutions are proprietary, so not much is written or known about the actual algorithms upon which these solutions are based. This paper presents a formal algorithm for routing traces on a print- ed circuit board. The solution presented is very fast and efficient and for the first time speaks to the question eloquently by way of symbolic statements.

Optical printed circuit board (O-PCB) and VLSI photonic integrated circuits: visions, challenges, and progresses

NASA Astrophysics Data System (ADS)

Lee, El-Hang; Lee, S. G.; O, B. H.; Park, S. G.; Noh, H. S.; Kim, K. H.; Song, S. H.

2006-09-01

A collective overview and review is presented on the original work conducted on the theory, design, fabrication, and in-tegration of micro/nano-scale optical wires and photonic devices for applications in a newly-conceived photonic systems called "optical printed circuit board" (O-PCBs) and "VLSI photonic integrated circuits" (VLSI-PIC). These are aimed for compact, high-speed, multi-functional, intelligent, light-weight, low-energy and environmentally friendly, low-cost, and high-volume applications to complement or surpass the capabilities of electrical PCBs (E-PCBs) and/or VLSI electronic integrated circuit (VLSI-IC) systems. These consist of 2-dimensional or 3-dimensional planar arrays of micro/nano-optical wires and circuits to perform the functions of all-optical sensing, storing, transporting, processing, switching, routing and distributing optical signals on flat modular boards or substrates. The integrated optical devices include micro/nano-scale waveguides, lasers, detectors, switches, sensors, directional couplers, multi-mode interference devices, ring-resonators, photonic crystal devices, plasmonic devices, and quantum devices, made of polymer, silicon and other semiconductor materials. For VLSI photonic integration, photonic crystals and plasmonic structures have been used. Scientific and technological issues concerning the processes of miniaturization, interconnection and integration of these systems as applicable to board-to-board, chip-to-chip, and intra-chip integration, are discussed along with applications for future computers, telecommunications, and sensor-systems. Visions and challenges toward these goals are also discussed.

Stripline/Microstrip Transition in Multilayer Circuit Board

NASA Technical Reports Server (NTRS)

Epp, Larry; Khan, Abdur

2005-01-01

A stripline-to-microstrip transition has been incorporated into a multilayer circuit board that supports a distributed solid-state microwave power amplifier, for the purpose of coupling the microwave signal from a buried-layer stripline to a top-layer microstrip. The design of the transition could be adapted to multilayer circuit boards in such products as cellular telephones (for connecting between circuit-board signal lines and antennas), transmitters for Earth/satellite communication systems, and computer mother boards (if processor speeds increase into the range of tens of gigahertz). The transition is designed to satisfy the following requirements in addition to the basic coupling requirement described above: (1) The transition must traverse multiple layers, including intermediate layers that contain DC circuitry. (2) The transition must work at a frequency of 32 GHz with low loss and low reflection. (3) The power delivered by the transition to top-layer microstrip must be split equally in opposite directions along the microstrip. Referring to the figure, this amounts to a requirement that when power is supplied to input port 1, equal amounts of power flow through output ports 2 and 3. (4) The signal-line via that is necessarily a part of such a transition must not be what is known in the art as a blind via; that is, it must span the entire thickness of the circuit board.

Toxicity of electronic waste leachates to Daphnia magna: screening and toxicity identification evaluation of different products, components, and materials.

PubMed

Lithner, Delilah; Halling, Maja; Dave, Göran

2012-05-01

Electronic waste has become one of the fastest growing waste problems in the world. It contains both toxic metals and toxic organics. The aim of this study was to (1) investigate to what extent toxicants can leach from different electronic products, components, and materials into water and (2) identify which group of toxicants (metals or hydrophobic organics) that is causing toxicity. Components from five discarded electronic products (cell phone, computer, phone modem, keyboard, and computer mouse) were leached in deionised water for 3 days at 23°C in concentrations of 25 g/l for metal components, 50 g/l for mixed-material components, and 100 g/l for plastic components. The water phase was tested for acute toxicity to Daphnia magna. Eighteen of 68 leachates showed toxicity (with immobility of D. magna ≥ 50% after 48 h) and came from metal or mixed-material components. The 8 most toxic leachates, with 48 h EC(50)s ranging from 0.4 to 20 g/l, came from 2 circuit sheets (key board), integrated drive electronics (IDE) cable clips (computer), metal studs (computer), a circuit board (computer mouse), a cord (phone modem), mixed parts (cell phone), and a circuit board (key board). All 5 electronic products were represented among them. Toxicity identification evaluations (with C18 and CM resins filtrations and ethylenediaminetetraacetic acid addition) indicated that metals caused the toxicity in the majority of the most toxic leachates. Overall, this study has shown that electronic waste can leach toxic compounds also during short-term leaching with pure water.

A Computer Application for Severely Handicapped Children.

ERIC Educational Resources Information Center

Huenergard, Cliff; Albertson, Greg

A severely physically disabled (quadriplegic) third grade student with high average intellectual abilities was fitted with a computer system adapted for maximum student independence. A scanner, the face of which is an integrated circuit board, was constructed to allow accessibility to the computer by a single switch operated by the student's…

Characterization of shredded television scrap and implications for materials recovery.

PubMed

Cui, Jirang; Forssberg, Eric

2007-01-01

Characterization of TV scrap was carried out by using a variety of methods, such as chemical analysis, particle size and shape analysis, liberation degree analysis, thermogravimetric analysis, sink-float test, and IR spectrometry. A comparison of TV scrap, personal computer scrap, and printed circuit board scrap shows that the content of non-ferrous metals and precious metals in TV scrap is much lower than that in personal computer scrap or printed circuit board scrap. It is expected that recycling of TV scrap will not be cost-effective by utilizing conventional manual disassembly. The result of particle shape analysis indicates that the non-ferrous metal particles in TV scrap formed as a variety of shapes; it is much more heterogeneous than that of plastics and printed circuit boards. Furthermore, the separability of TV scrap using density-based techniques was evaluated by the sink-float test. The result demonstrates that a high recovery of copper could be obtained by using an effective gravity separation process. Identification of plastics shows that the major plastic in TV scrap is high impact polystyrene. Gravity separation of plastics may encounter some challenges in separation of plastics from TV scrap because of specific density variations.

The Air Force Geophysics Laboratory Standalone Data Acquisition System: A Functional Description.

DTIC Science & Technology

1980-10-09

the board are a buffer for the RUN/HALT front panel switch and a retriggerable oneshot multivibrator. This latter circuit senses the SRUN pulse train...recording on the data tapes, and providing the master timing source for data acquisition. An Electronic Research Company (ERC) model 2446 digital...the computer is fed to a retriggerable oneshot multivibrator on the board. (SRUN consists of a pulse train that is present when the computer is running

A filter circuit board for the Earthworm Seismic Data Acquisition System

USGS Publications Warehouse

Jensen, Edward Gray

2000-01-01

The Earthworm system is a seismic network data acquisition and processing system used by the Northern California Seismic Network as well as many other seismic networks. The input to the system is comprised of many realtime electronic waveforms fed to a multi-channel digitizer on a PC platform. The digitizer consists of one or more National Instruments Corp. AMUX–64T multiplexer boards attached to an A/D converter board located in the computer. Originally, passive filters were installed on the multiplexers to eliminate electronic noise picked up in cabling. It was later discovered that a small amount of crosstalk occurred between successive channels in the digitizing sequence. Though small, this crosstalk will cause what appear to be small earthquake arrivals at the wrong time on some channels. This can result in erroneous calculation of earthquake arrival times, particularly by automated algorithms. To deal with this problem, an Earthworm filter board was developed to provide the needed filtering while eliminating crosstalk. This report describes the tests performed to find a suitable solution, and the design of the circuit board. Also included are all the details needed to build and install this board in an Earthworm system or any other system using the AMUX–64T board. Available below is the report in PDF format as well as an archive file containing the circuit board manufacturing information.

Power converter using near-load output capacitance, direct inductor contact, and/or remote current sense

DOE Office of Scientific and Technical Information (OSTI.GOV)

Coteus, Paul W.; Ferencz, Andrew; Hall, Shawn A.

An apparatus includes a first circuit board including first components including a load, and a second circuit board including second components including switching power devices and an output inductor. Ground and output voltage contacts between the circuit boards are made through soldered or connectorized interfaces. Certain components on the first circuit board and certain components, including the output inductor, on the second circuit board act as a DC-DC voltage converter for the load. An output capacitance for the conversion is on the first circuit board with no board-to-board interface between the output capacitance and the load. The inductance of themore » board-to-board interface functions as part of the output inductor's inductance and not as a parasitic inductance. Sense components for sensing current through the output inductor are located on the first circuit board. Parasitic inductance of the board-to-board interface has less effect on a sense signal provided to a controller.« less

Sensor Authentication: Embedded Processor Code

DOE Office of Scientific and Technical Information (OSTI.GOV)

Svoboda, John

2012-09-25

Described is the c code running on the embedded Microchip 32bit PIC32MX575F256H located on the INL developed noise analysis circuit board. The code performs the following functions: Controls the noise analysis circuit board preamplifier voltage gains of 1, 10, 100, 000 Initializes the analog to digital conversion hardware, input channel selection, Fast Fourier Transform (FFT) function, USB communications interface, and internal memory allocations Initiates high resolution 4096 point 200 kHz data acquisition Computes complex 2048 point FFT and FFT magnitude. Services Host command set Transfers raw data to Host Transfers FFT result to host Communication error checking

Testing interconnected VLSI circuits in the Big Viterbi Decoder

NASA Technical Reports Server (NTRS)

Onyszchuk, I. M.

1991-01-01

The Big Viterbi Decoder (BVD) is a powerful error-correcting hardware device for the Deep Space Network (DSN), in support of the Galileo and Comet Rendezvous Asteroid Flyby (CRAF)/Cassini Missions. Recently, a prototype was completed and run successfully at 400,000 or more decoded bits per second. This prototype is a complex digital system whose core arithmetic unit consists of 256 identical very large scale integration (VLSI) gate-array chips, 16 on each of 16 identical boards which are connected through a 28-layer, printed-circuit backplane using 4416 wires. Special techniques were developed for debugging, testing, and locating faults inside individual chips, on boards, and within the entire decoder. The methods are based upon hierarchical structure in the decoder, and require that chips or boards be wired themselves as Viterbi decoders. The basic procedure consists of sending a small set of known, very noisy channel symbols through a decoder, and matching observables against values computed by a software simulation. Also, tests were devised for finding open and short-circuited wires which connect VLSI chips on the boards and through the backplane.

Design, Construction and Testing of a Prototype Holonomic Autonomous Vehicle

DTIC Science & Technology

2007-12-01

Circuit A simple 100 kHz crystal oscillator tank circuit using an LM741 opamp was fed to a LM393N comparator . The circuit’s schematic is provided...research in areas that support development of unmanned ground and air battlefield vehicles. Little attention has been paid to applying robotics to...motion control using a single board computer, a pulse width modulation (PWM) and optical isolation circuit, and a low-cost inertial measurement unit

User's Guide for Computer Program that Routes Signal Traces

NASA Technical Reports Server (NTRS)

Hedgley, David R., Jr.

2000-01-01

This disk contains both a FORTRAN computer program and the corresponding user's guide that facilitates both its incorporation into your system and its utility. The computer program represents an efficient algorithm that routes signal traces on layers of a printed circuit with both through-pins and surface mounts. The computer program included is an implementation of the ideas presented in the theoretical paper titled "A Formal Algorithm for Routing Signal Traces on a Printed Circuit Board", NASA TP-3639 published in 1996. The computer program in the "connects" file can be read with a FORTRAN compiler and readily integrated into software unique to each particular environment where it might be used.

High density printed electrical circuit board card connection system

DOEpatents

Baumbaugh, Alan E.

1997-01-01

A zero insertion/extraction force printed circuit board card connection system comprises a cam-operated locking mechanism disposed along an edge portion of the printed circuit board. The extrusions along the circuit board mate with an extrusion fixed to the card cage having a plurality of electrical connectors. The card connection system allows the connectors to be held away from the circuit board during insertion/extraction and provides a constant mating force once the circuit board is positioned. The card connection system provides a simple solution to the need for a greater number of electrical signal connections.

Electronic inverter assembly

DOE Office of Scientific and Technical Information (OSTI.GOV)

Singh, Brij N.; Schmit, Christopher J.

A first driver portion comprises a set of first components mounted on or associated with a first circuit board. A second circuit board is spaced apart from the first circuit board. A second driver portion comprises a set of second components mounted on or associated with the second circuit board, where the first driver portion and the second driver portion collectively are adapted to provide input signals to the control terminal of each semiconductor switch of an inverter. A first edge connector is mounted on the first circuit board. A second edge connector is mounted on the second circuit board.more » An interface board has mating edges that mate with the first edge connector and the second edge connector.« less

Soft-Matter Printed Circuit Board with UV Laser Micropatterning.

PubMed

Lu, Tong; Markvicka, Eric J; Jin, Yichu; Majidi, Carmel

2017-07-05

When encapsulated in elastomer, micropatterned traces of Ga-based liquid metal (LM) can function as elastically deformable circuit wiring that provides mechanically robust electrical connectivity between solid-state elements (e.g., transistors, processors, and sensor nodes). However, LM-microelectronics integration is currently limited by challenges in rapid fabrication of LM circuits and the creation of vias between circuit terminals and the I/O pins of packaged electronics. In this study, we address both with a unique layup for soft-matter electronics in which traces of liquid-phase Ga-In eutectic (EGaIn) are patterned with UV laser micromachining (UVLM). The terminals of the elastomer-sealed LM circuit connect to the surface mounted chips through vertically aligned columns of EGaIn-coated Ag-Fe 2 O 3 microparticles that are embedded within an interfacial elastomer layer. The processing technique is compatible with conventional UVLM printed circuit board (PCB) prototyping and exploits the photophysical ablation of EGaIn on an elastomer substrate. Potential applications to wearable computing and biosensing are demonstrated with functional implementations in which soft-matter PCBs are populated with surface-mounted microelectronics.

Analyzing Pulse-Code Modulation On A Small Computer

NASA Technical Reports Server (NTRS)

Massey, David E.

1988-01-01

System for analysis pulse-code modulation (PCM) comprises personal computer, computer program, and peripheral interface adapter on circuit board that plugs into expansion bus of computer. Functions essentially as "snapshot" PCM decommutator, which accepts and stores thousands of frames of PCM data, sifts through them repeatedly to process according to routines specified by operator. Enables faster testing and involves less equipment than older testing systems.

Physically separating printed circuit boards with a resilient, conductive contact

NASA Technical Reports Server (NTRS)

Baker, John D. (Inventor); Montalvo, Alberto (Inventor)

1999-01-01

A multi-board module provides high density electronic packaging in which multiple printed circuit boards are stacked. Electrical power, or signals, are conducted between the boards through a resilient contact. One end of the contact is located at a via in the lower circuit board and soldered to a pad near the via. The top surface of the contact rests against a via of the facing printed circuit board.

Unified Ultrasonic/Eddy-Current Data Acquisition

NASA Technical Reports Server (NTRS)

Chern, E. James; Butler, David W.

1993-01-01

Imaging station for detecting cracks and flaws in solid materials developed combining both ultrasonic C-scan and eddy-current imaging. Incorporation of both techniques into one system eliminates duplication of computers and of mechanical scanners; unifies acquisition, processing, and storage of data; reduces setup time for repetitious ultrasonic and eddy-current scans; and increases efficiency of system. Same mechanical scanner used to maneuver either ultrasonic or eddy-current probe over specimen and acquire point-by-point data. For ultrasonic scanning, probe linked to ultrasonic pulser/receiver circuit card, while, for eddy-current imaging, probe linked to impedance-analyzer circuit card. Both ultrasonic and eddy-current imaging subsystems share same desktop-computer controller, containing dedicated plug-in circuit boards for each.

Theoretic model and computer simulation of separating mixture metal particles from waste printed circuit board by electrostatic separator.

PubMed

Li, Jia; Xu, Zhenming; Zhou, Yaohe

2008-05-30

Traditionally, the mixture metals from waste printed circuit board (PCB) were sent to the smelt factory to refine pure copper. Some valuable metals (aluminum, zinc and tin) with low content in PCB were lost during smelt. A new method which used roll-type electrostatic separator (RES) to recovery low content metals in waste PCB was presented in this study. The theoretic model which was established from computing electric field and the analysis of forces on the particles was used to write a program by MATLAB language. The program was design to simulate the process of separating mixture metal particles. Electrical, material and mechanical factors were analyzed to optimize the operating parameters of separator. The experiment results of separating copper and aluminum particles by RES had a good agreement with computer simulation results. The model could be used to simulate separating other metal (tin, zinc, etc.) particles during the process of recycling waste PCBs by RES.

That Elusive, Eclectic Thing Called Thermal Environment: What a Board Should Know About It

ERIC Educational Resources Information Center

Schutte, Frederick

1970-01-01

Discussion of proper thermal environment for protection of sophisticated educational equipment such as computer and data-processing machines, magnetic tapes, closed-circuit television and video tape communications systems.

Improving Heat Transfer Performance of Printed Circuit Boards

NASA Technical Reports Server (NTRS)

Schatzel, Donald V.

2009-01-01

This paper will explore the ability of printed circuit boards laminated with a Carbon Core Laminate to transfer heat vs. standard printed circuit boards that use only thick layers of copper. The paper will compare the differences in heat transfer performance of printed circuit boards with and without CCL.

Printed wiring board system programmer's manual

NASA Technical Reports Server (NTRS)

Brinkerhoff, C. D.

1973-01-01

The printed wiring board system provides automated techniques for the design of printed circuit boards and hybrid circuit boards. The system consists of four programs: (1) the preprocessor program combines user supplied data and pre-defined library data to produce the detailed circuit description data; (2) the placement program assigns circuit components to specific areas of the board in a manner that optimizes the total interconnection length of the circuit; (3) the organizer program assigns pin interconnections to specific board levels and determines the optimal order in which the router program should attempt to layout the paths connecting the pins; and (4) the router program determines the wire paths which are to be used to connect each input pin pair on the circuit board. This document is intended to serve as a programmer's reference manual for the printed wiring board system. A detailed description of the internal logic and flow of the printed wiring board programs is included.

An interactive wire-wrap board layout program

NASA Technical Reports Server (NTRS)

Schlutsmeyer, A.

1987-01-01

An interactive computer-graphics-based tool for specifying the placement of electronic parts on a wire-wrap circuit board is presented. Input is a data file (currently produced by a commercial logic design system) which describes the parts used and their interconnections. Output includes printed reports describing the parts and wire paths, parts counts, placement lists, board drawing, and a tape to send to the wire-wrap vendor. The program should reduce the engineer's layout time by a factor of 3 to 5 as compared to manual methods.

Apparatus And Method Of Using Flexible Printed Circuit Board In Optical Transceiver Device

DOEpatents

Anderson, Gene R.; Armendariz, Marcelino G.; Bryan, Robert P.; Carson, Richard F.; Duckett, III, Edwin B.; McCormick, Frederick B.; Peterson, David W.; Peterson, Gary D.; Reysen, Bill H.

2005-03-15

This invention relates to a flexible printed circuit board that is used in connection with an optical transmitter, receiver or transceiver module. In one embodiment, the flexible printed circuit board has flexible metal layers in between flexible insulating layers, and the circuit board comprises: (1) a main body region orientated in a first direction having at least one electrical or optoelectronic device; (2) a plurality of electrical contact pads integrated into the main body region, where the electrical contact pads function to connect the flexible printed circuit board to an external environment; (3) a buckle region extending from one end of the main body region; and (4) a head region extending from one end of the buckle region, and where the head region is orientated so that it is at an angle relative to the direction of the main body region. The electrical contact pads may be ball grid arrays, solder balls or land-grid arrays, and they function to connect the circuit board to an external environment. A driver or amplifier chip may be adapted to the head region of the flexible printed circuit board. In another embodiment, a heat spreader passes along a surface of the head region of the flexible printed circuit board, and a window is formed in the head region of the flexible printed circuit board. Optoelectronic devices are adapted to the head spreader in such a manner that they are accessible through the window in the flexible printed circuit board.

Apple's Macintosh.

ERIC Educational Resources Information Center

Miller, Michael J.

1984-01-01

Description of the Macintosh personal, educational, and business computer produced by Apple covers cost; physical characteristics including display devices, circuit boards, and built-in features; company-produced software; third-party produced software; memory and storage capacity; word-processing features; and graphics capabilities. (MBR)

29 CFR 1915.181 - Electrical circuits and distribution boards.

Code of Federal Regulations, 2010 CFR

2010-07-01

... 29 Labor 7 2010-07-01 2010-07-01 false Electrical circuits and distribution boards. 1915.181... Electrical Machinery § 1915.181 Electrical circuits and distribution boards. (a) The provisions of this... employee is permitted to work on an electrical circuit, except when the circuit must remain energized for...

Device serves as hinge and electrical connector for circuit boards

NASA Technical Reports Server (NTRS)

Bethel, P. G.; Harris, G. G.

1966-01-01

Hinge makes both sides of electrical circuit boards readily accessible for component checkout and servicing. The hinge permits mounting of two circuit boards and incorporates connectors to maintain continuous electrical contact between the components on both boards.

Analysis of Multilayered Printed Circuit Boards using Computed Tomography

DTIC Science & Technology

2014-05-01

complex PCBs that present a challenge for any testing or fault analysis. Set-to- work testing and fault analysis of any electronic circuit require...Electronic Warfare and Radar Division in December 2010. He is currently in Electro- Optic Countermeasures Group. Samuel works on embedded system design...and software optimisation of complex electro-optical systems, including the set to work and characterisation of these systems. He has a Bachelor of

Localized radio frequency communication using asynchronous transfer mode protocol

DOEpatents

Witzke, Edward L [Edgewood, NM; Robertson, Perry J [Albuquerque, NM; Pierson, Lyndon G [Albuquerque, NM

2007-08-14

A localized wireless communication system for communication between a plurality of circuit boards, and between electronic components on the circuit boards. Transceivers are located on each circuit board and electronic component. The transceivers communicate with one another over spread spectrum radio frequencies. An asynchronous transfer mode protocol controls communication flow with asynchronous transfer mode switches located on the circuit boards.

Conduction-driven cooling of LED-based automotive LED lighting systems for abating local hot spots

NASA Astrophysics Data System (ADS)

Saati, Ferina; Arik, Mehmet

2018-02-01

Light-emitting diode (LED)-based automotive lighting systems pose unique challenges, such as dual-side packaging (front side for LEDs and back side for driver electronics circuit), size, harsh ambient, and cooling. Packaging for automotive lighting applications combining the advanced printed circuit board (PCB) technology with a multifunctional LED-based board is investigated with a focus on the effect of thermal conduction-based cooling for hot spot abatement. A baseline study with a flame retardant 4 technology, commonly known as FR4 PCB, is first compared with a metal-core PCB technology, both experimentally and computationally. The double-sided advanced PCB that houses both electronics and LEDs is then investigated computationally and experimentally compared with the baseline FR4 PCB. Computational models are first developed with a commercial computational fluid dynamics software and are followed by an advanced PCB technology based on embedded heat pipes, which is computationally and experimentally studied. Then, attention is turned to studying different heat pipe orientations and heat pipe placements on the board. Results show that conventional FR4-based light engines experience local hot spots (ΔT>50°C) while advanced PCB technology based on heat pipes and thermal spreaders eliminates these local hot spots (ΔT<10°C), leading to a higher lumen extraction with improved reliability. Finally, possible design options are presented with embedded heat pipe structures that further improve the PCB performance.

Applications of Computer Graphics in Engineering

NASA Technical Reports Server (NTRS)

1975-01-01

Various applications of interactive computer graphics to the following areas of science and engineering were described: design and analysis of structures, configuration geometry, animation, flutter analysis, design and manufacturing, aircraft design and integration, wind tunnel data analysis, architecture and construction, flight simulation, hydrodynamics, curve and surface fitting, gas turbine engine design, analysis, and manufacturing, packaging of printed circuit boards, spacecraft design.

Packaging Of Control Circuits In A Robot Arm

NASA Technical Reports Server (NTRS)

Kast, William

1994-01-01

Packaging system houses and connects control circuitry mounted on circuit boards within shoulder, upper section, and lower section of seven-degree-of-freedom robot arm. Has modular design that incorporates surface-mount technology, multilayer circuit boards, large-scale integrated circuits, and multi-layer flat cables between sections for compactness. Three sections of robot arm contain circuit modules in form of stardardized circuit boards. Each module contains two printed-circuit cards, one of each face.

High density electrical card connector system

DOEpatents

Haggard, J. Eric; Trotter, Garrett R.

2000-01-01

An electrical circuit board card connection system is disclosed which comprises a wedge-operated locking mechanism disposed along an edge portion of the printed circuit board. An extrusion along the edge of the circuit board mates with an extrusion fixed to the card cage having a plurality of electrical connectors. The connection system allows the connectors to be held away from the circuit board during insertion/extraction and provides a constant mating force once the circuit board is positioned and the wedge inserted. The disclosed connection system is a simple solution to the need for a greater number of electrical signal connections.

Sampling and Control Circuit Board for an Inertial Measurement Unit

NASA Technical Reports Server (NTRS)

Chelmins, David T (Inventor); Sands, Obed (Inventor); Powis, Richard T., Jr. (Inventor)

2016-01-01

A circuit board that serves as a control and sampling interface to an inertial measurement unit ("IMU") is provided. The circuit board is also configured to interface with a local oscillator and an external trigger pulse. The circuit board is further configured to receive the external trigger pulse from an external source that time aligns the local oscillator and initiates sampling of the inertial measurement device for data at precise time intervals based on pulses from the local oscillator. The sampled data may be synchronized by the circuit board with other sensors of a navigation system via the trigger pulse.

Hard and flexible optical printed circuit board

NASA Astrophysics Data System (ADS)

Lee, El-Hang; Lee, Hyun Sik; Lee, S. G.; O, B. H.; Park, S. G.; Kim, K. H.

2007-02-01

We report on the design and fabrication of hard and flexible optical printed circuit boards (O-PCBs). The objective is to realize generic and application-specific O-PCBs, either in hard form or flexible form, that are compact, light-weight, low-energy, high-speed, intelligent, and environmentally friendly, for low-cost and high-volume universal applications. The O-PCBs consist of 2-dimensional planar arrays of micro/nano-scale optical wires, circuits and devices that are interconnected and integrated to perform the functions of sensing, storing, transporting, processing, switching, routing and distributing optical signals on flat modular boards. For fabrication, the polymer and organic optical wires and waveguides are first fabricated on a board and are used to interconnect and integrate micro/nano-scale photonic devices. The micro/nano-optical functional devices include lasers, detectors, switches, sensors, directional couplers, multi-mode interference devices, ring-resonators, photonic crystal devices, plasmonic devices, and quantum devices. For flexible boards, the optical waveguide arrays are fabricated on flexible poly-ethylen terephthalate (PET) substrates by UV embossing. Electrical layer carrying VCSEL and PD array is laminated with the optical layer carrying waveguide arrays. Both hard and flexible electrical lines are replaced with high speed optical interconnection between chips over four waveguide channels up to 10Gbps on each. We discuss uses of hard or flexible O-PCBs for telecommunication systems, computer systems, transportation systems, space/avionic systems, and bio-sensor systems.

RF Device for Acquiring Images of the Human Body

NASA Technical Reports Server (NTRS)

Gaier, Todd C.; McGrath, William R.

2010-01-01

A safe, non-invasive method for forming images through clothing of large groups of people, in order to search for concealed weapons either made of metal or not, has been developed. A millimeter wavelength scanner designed in a unique, ring-shaped configuration can obtain a full 360 image of the body with a resolution of less than a millimeter in only a few seconds. Millimeter waves readily penetrate normal clothing, but are highly reflected by the human body and concealed objects. Millimeter wave signals are nonionizing and are harmless to human tissues when used at low power levels. The imager (see figure) consists of a thin base that supports a small-diameter vertical post about 7 ft (=2.13 m) tall. Attached to the post is a square-shaped ring 2 in. (=5 cm) wide and 3 ft (=91 cm) on a side. The ring is oriented horizontally, and is supported halfway along one side by a connection to a linear bearing on the vertical post. A planar RF circuit board is mounted to the inside of each side of the ring. Each circuit board contains an array of 30 receivers, one transmitter, and digitization electronics. Each array element has a printed-circuit patch antenna coupled to a pair of mixers by a 90 coupler. The mixers receive a reference local oscillator signal to a subharmonic of the transmitter frequency. A single local oscillator line feeds all 30 receivers on the board. The resulting MHz IF signals are amplified and carried to the edge of the board where they are demodulated and digitized. The transmitted signal is derived from the local oscillator at a frequency offset determined by a crystal oscillator. One antenna centrally located on each side of the square ring provides the source illumination power. The total transmitted power is less than 100 mW, resulting in an exposure level that is completely safe to humans. The output signals from all four circuit boards are fed via serial connection to a data processing computer. The computer processes the approximately 1-MB data set into a three-dimensional image in a matter of seconds. The innovation is to configure the receiver array in a ring topology surrounding the scanned object. The ring is then scanned vertically to cover the necessary two-dimensional surface. This fabrication of the ring is made possible by using planar antenna and circuit technology. A planar circuit board serves as a medium for both antennas and signal processing components. Using this technique, parts counts are kept low, and the cost per element is a small fraction of a waveguide-based system.

Design and construction of a high frame rate imaging system

NASA Astrophysics Data System (ADS)

Wang, Jing; Waugaman, John L.; Liu, Anjun; Lu, Jian-Yu

2002-05-01

A new high frame rate imaging method has been developed recently [Jian-yu Lu, ``2D and 3D high frame rate imaging with limited diffraction beams,'' IEEE Trans. Ultrason. Ferroelectr. Freq. Control 44, 839-856 (1997)]. This method may have a clinical application for imaging of fast moving objects such as human hearts, velocity vector imaging, and low-speckle imaging. To implement the method, an imaging system has been designed. The system consists of one main printed circuit board (PCB) and 16 channel boards (each channel board contains 8 channels), in addition to a set-top box for connections to a personal computer (PC), a front panel board for user control and message display, and a power control and distribution board. The main board contains a field programmable gate array (FPGA) and controls all channels (each channel has also an FPGA). We will report the analog and digital circuit design and simulations, multiplayer PCB designs with commercial software (Protel 99), PCB signal integrity testing and system RFI/EMI shielding, and the assembly and construction of the entire system. [Work supported in part by Grant 5RO1 HL60301 from NIH.

Product or waste? Importation and end-of-life processing of computers in Peru.

PubMed

Kahhat, Ramzy; Williams, Eric

2009-08-01

This paper considers the importation of used personal computers (PCs) in Peru and domestic practices in their production, reuse, and end-of-life processing. The empirical pillars of this study are analysis of government data describing trade in used and new computers and surveys and interviews of computer sellers, refurbishers, and recyclers. The United States is the primary source of used PCs imported to Peru. Analysis of shipment value (as measured by trade statistics) shows that 87-88% of imported used computers had a price higher than the ideal recycle value of constituent materials. The official trade in end-of-life computers is thus driven by reuse as opposed to recycling. The domestic reverse supply chain of PCs is well developed with extensive collection, reuse, and recycling. Environmental problems identified include open burning of copper-bearing wires to remove insulation and landfilling of CRT glass. Distinct from informal recycling in China and India, printed circuit boards are usually not recycled domestically but exported to Europe for advanced recycling or to China for (presumably) informal recycling. It is notable that purely economic considerations lead to circuit boards being exported to Europe where environmental standards are stringent, presumably due to higher recovery of precious metals.

System architecture of a gallium arsenide one-gigahertz digital IC tester

NASA Technical Reports Server (NTRS)

Fouts, Douglas J.; Johnson, John M.; Butner, Steven E.; Long, Stephen I.

1987-01-01

The design for a 1-GHz digital integrated circuit tester for the evaluation of custom GaAs chips and subsystems is discussed. Technology-related problems affecting the design of a GaAs computer are discussed, with emphasis on the problems introduced by long printed-circuit-board interconnect. High-speed interface modules provide a link between the low-speed microprocessor and the chip under test. Memory-multiplexer and memory-shift register architectures for the storage of test vectors are described in addition to an architecture for local data storage consisting of a long chain of GaAs shift registers. The tester is constructed around a VME system card cage and backplane, and very little high-speed interconnect exists between boards. The tester has a three part self-test consisting of a CPU board confidence test, a main memory confidence test, and a high-speed interface module functional test.

Mechanically-reattachable liquid-cooled cooling apparatus

DOEpatents

Arney, Susanne; Cheng, Jen-Hau; Kolodner, Paul R; Kota-Venkata, Krishna-Murty; Scofield, William; Salamon, Todd R; Simon, Maria E

2013-09-24

An apparatus comprising a rack having a row of shelves, each shelf supporting an electronics circuit board, each one of the circuit boards being manually removable from the shelve supporting the one of the circuit boards and having a local heat source thereon. The apparatus also comprises a cooler attached to the rack and being able to circulate a cooling fluid around a channel forming a closed loop. The apparatus further comprises a plurality of heat conduits, each heat conduit being located over a corresponding one of the circuit boards and forming a path to transport heat from the local heat source of the corresponding one of the circuit boards to the cooler. Each heat conduit is configured to be manually detachable from the cooler or the circuit board, without breaking a circulation pathway of the fluid through the cooler.

Developing 300°C Ceramic Circuit Boards

DOE Office of Scientific and Technical Information (OSTI.GOV)

Normann, Randy A

2015-02-15

This paper covers the development of a geothermal ceramic circuit board technology using 3D traces in a machinable ceramic. Test results showing the circuit board to be operational to at least 550°C. Discussion on producing this type of board is outlined along with areas needing improvement.

Microchannel cooling of face down bonded chips

DOEpatents

Bernhardt, Anthony F.

1993-01-01

Microchannel cooling is applied to flip-chip bonded integrated circuits, in a manner which maintains the advantages of flip-chip bonds, while overcoming the difficulties encountered in cooling the chips. The technique is suited to either multichip integrated circuit boards in a plane, or to stacks of circuit boards in a three dimensional interconnect structure. Integrated circuit chips are mounted on a circuit board using flip-chip or control collapse bonds. A microchannel structure is essentially permanently coupled with the back of the chip. A coolant delivery manifold delivers coolant to the microchannel structure, and a seal consisting of a compressible elastomer is provided between the coolant delivery manifold and the microchannel structure. The integrated circuit chip and microchannel structure are connected together to form a replaceable integrated circuit module which can be easily decoupled from the coolant delivery manifold and the circuit board. The coolant supply manifolds may be disposed between the circuit boards in a stack and coupled to supplies of coolant through a side of the stack.

Microchannel cooling of face down bonded chips

DOEpatents

Bernhardt, A.F.

1993-06-08

Microchannel cooling is applied to flip-chip bonded integrated circuits, in a manner which maintains the advantages of flip-chip bonds, while overcoming the difficulties encountered in cooling the chips. The technique is suited to either multi chip integrated circuit boards in a plane, or to stacks of circuit boards in a three dimensional interconnect structure. Integrated circuit chips are mounted on a circuit board using flip-chip or control collapse bonds. A microchannel structure is essentially permanently coupled with the back of the chip. A coolant delivery manifold delivers coolant to the microchannel structure, and a seal consisting of a compressible elastomer is provided between the coolant delivery manifold and the microchannel structure. The integrated circuit chip and microchannel structure are connected together to form a replaceable integrated circuit module which can be easily decoupled from the coolant delivery manifold and the circuit board. The coolant supply manifolds may be disposed between the circuit boards in a stack and coupled to supplies of coolant through a side of the stack.

47 CFR 2.1202 - Exclusions.

Code of Federal Regulations, 2014 CFR

2014-10-01

... 47 Telecommunication 1 2014-10-01 2014-10-01 false Exclusions. 2.1202 Section 2.1202 Telecommunication FEDERAL COMMUNICATIONS COMMISSION GENERAL FREQUENCY ALLOCATIONS AND RADIO TREATY MATTERS; GENERAL... marketing or use. Form 740 information will be required to be submitted for computer circuit boards that are...

47 CFR 2.1202 - Exclusions.

Code of Federal Regulations, 2010 CFR

2010-10-01

... 47 Telecommunication 1 2010-10-01 2010-10-01 false Exclusions. 2.1202 Section 2.1202 Telecommunication FEDERAL COMMUNICATIONS COMMISSION GENERAL FREQUENCY ALLOCATIONS AND RADIO TREATY MATTERS; GENERAL... marketing or use. Form 740 information will be required to be submitted for computer circuit boards that are...

47 CFR 2.1202 - Exclusions.

Code of Federal Regulations, 2013 CFR

2013-10-01

... 47 Telecommunication 1 2013-10-01 2013-10-01 false Exclusions. 2.1202 Section 2.1202 Telecommunication FEDERAL COMMUNICATIONS COMMISSION GENERAL FREQUENCY ALLOCATIONS AND RADIO TREATY MATTERS; GENERAL... marketing or use. Form 740 information will be required to be submitted for computer circuit boards that are...

47 CFR 2.1202 - Exclusions.

Code of Federal Regulations, 2012 CFR

2012-10-01

... 47 Telecommunication 1 2012-10-01 2012-10-01 false Exclusions. 2.1202 Section 2.1202 Telecommunication FEDERAL COMMUNICATIONS COMMISSION GENERAL FREQUENCY ALLOCATIONS AND RADIO TREATY MATTERS; GENERAL... marketing or use. Form 740 information will be required to be submitted for computer circuit boards that are...

47 CFR 2.1202 - Exclusions.

Code of Federal Regulations, 2011 CFR

2011-10-01

... 47 Telecommunication 1 2011-10-01 2011-10-01 false Exclusions. 2.1202 Section 2.1202 Telecommunication FEDERAL COMMUNICATIONS COMMISSION GENERAL FREQUENCY ALLOCATIONS AND RADIO TREATY MATTERS; GENERAL... marketing or use. Form 740 information will be required to be submitted for computer circuit boards that are...

Loopback Tester: a synchronous communications circuit diagnostic device

DOE Office of Scientific and Technical Information (OSTI.GOV)

Maestas, J.H.

1986-07-01

The Loopback Tester is an Intel SBC 86/12A Single Board Computer and an Intel SBC 534 Communications Expansion Board configured and programmed to perform various basic or less. These tests include: (1) Data Communications Equipment (DCE) transmit timing detection (2) data rate measurement (3) instantaneous loopback indication and (4) bit error rate testing. It requires no initial setup after plug in, and can be used to locate the source of communications loss in a circuit. It can also be used to determine when crypto variable mismatch problems are the source of communications loss. This report discusses the functionality of themore » Loopback Tester as a diagnostic device. It also discusses the hardware and software which implements this simple yet reliable device.« less

Protective Socket For Integrated Circuits

NASA Technical Reports Server (NTRS)

Wilkinson, Chris; Henegar, Greg

1988-01-01

Socket for intergrated circuits (IC's) protects from excessive voltages and currents or from application of voltages and currents in wrong sequence during insertion or removal. Contains built-in switch that opens as IC removed, disconnecting leads from signals and power. Also protects other components on circuit board from transients produced by insertion and removal of IC. Makes unnecessary to turn off power to entire circuit board so other circuits on board continue to function.

Volumetric segmentation of range images for printed circuit board inspection

NASA Astrophysics Data System (ADS)

Van Dop, Erik R.; Regtien, Paul P. L.

1996-10-01

Conventional computer vision approaches towards object recognition and pose estimation employ 2D grey-value or color imaging. As a consequence these images contain information about projections of a 3D scene only. The subsequent image processing will then be difficult, because the object coordinates are represented with just image coordinates. Only complicated low-level vision modules like depth from stereo or depth from shading can recover some of the surface geometry of the scene. Recent advances in fast range imaging have however paved the way towards 3D computer vision, since range data of the scene can now be obtained with sufficient accuracy and speed for object recognition and pose estimation purposes. This article proposes the coded-light range-imaging method together with superquadric segmentation to approach this task. Superquadric segments are volumetric primitives that describe global object properties with 5 parameters, which provide the main features for object recognition. Besides, the principle axes of a superquadric segment determine the phase of an object in the scene. The volumetric segmentation of a range image can be used to detect missing, false or badly placed components on assembled printed circuit boards. Furthermore, this approach will be useful to recognize and extract valuable or toxic electronic components on printed circuit boards scrap that currently burden the environment during electronic waste processing. Results on synthetic range images with errors constructed according to a verified noise model illustrate the capabilities of this approach.

Evaluating waste printed circuit boards recycling: Opportunities and challenges, a mini review.

PubMed

Awasthi, Abhishek Kumar; Zlamparet, Gabriel Ionut; Zeng, Xianlai; Li, Jinhui

2017-04-01

Rapid generation of waste printed circuit boards has become a very serious issue worldwide. Numerous techniques have been developed in the last decade to resolve the pollution from waste printed circuit boards, and also recover valuable metals from the waste printed circuit boards stream on a large-scale. However, these techniques have their own certain specific drawbacks that need to be rectified properly. In this review article, these recycling technologies are evaluated based on a strength, weaknesses, opportunities and threats analysis. Furthermore, it is warranted that, the substantial research is required to improve the current technologies for waste printed circuit boards recycling in the outlook of large-scale applications.

Board Saver for Use with Developmental FPGAs

NASA Technical Reports Server (NTRS)

Berkun, Andrew

2009-01-01

A device denoted a board saver has been developed as a means of reducing wear and tear of a printed-circuit board onto which an antifuse field programmable gate array (FPGA) is to be eventually soldered permanently after a number of design iterations. The need for the board saver or a similar device arises because (1) antifuse-FPGA design iterations are common and (2) repeated soldering and unsoldering of FPGAs on the printed-circuit board to accommodate design iterations can wear out the printed-circuit board. The board saver is basically a solderable/unsolderable FPGA receptacle that is installed temporarily on the printed-circuit board. The board saver is, more specifically, a smaller, square-ring-shaped, printed-circuit board (see figure) that contains half via holes one for each contact pad along its periphery. As initially fabricated, the board saver is a wider ring containing full via holes, but then it is milled along its outer edges, cutting the via holes in half and laterally exposing their interiors. The board saver is positioned in registration with the designated FPGA footprint and each via hole is soldered to the outer portion of the corresponding FPGA contact pad on the first-mentioned printed-circuit board. The via-hole/contact joints can be inspected visually and can be easily unsoldered later. The square hole in the middle of the board saver is sized to accommodate the FPGA, and the thickness of the board saver is the same as that of the FPGA. Hence, when a non-final FPGA is placed in the square hole, the combination of the non-final FPGA and the board saver occupy no more area and thickness than would a final FPGA soldered directly into its designated position on the first-mentioned circuit board. The contact leads of a non-final FPGA are not bent and are soldered, at the top of the board saver, to the corresponding via holes. A non-final FPGA can readily be unsoldered from the board saver and replaced by another one. Once the final FPGA design has been determined, the board saver can be unsoldered from the contact pads on the first-mentioned printed-circuit board and replaced by the final FPGA.

Implementation of an Intelligent Control System

DTIC Science & Technology

1992-05-01

there- fore implemented in a portable equipment rack. The controls computer consists of a microcomputer running a real time operating system , interface...circuit boards are mounted in an industry standard Multibus I chassis. The microcomputer runs the iRMX real time operating system . This operating system

Vibration analysis of printed circuit boards: Effect of boundary condition

NASA Astrophysics Data System (ADS)

Prashanth, M. D.

2018-04-01

A spacecraft consists of a number of electronic packages to meet the functional requirements. An electronic package is generally an assembly of printed circuit boards placed in a mechanical housing. A number of electronic components are mounted on the printed circuit board (PCB). A spacecraft experiences various types of loads during its launch such as vibration, acoustic and shock loads. Prediction of response for printed circuit boards due to vibration loads is important for mechanical design and reliability of electronic packages. The modeling and analysis of printed circuit boards is required for accurate prediction of response due to vibration loads. The response of PCB is highly dependent on the mounting configuration of PCB. In addition, anti-vibration mounts or stiffeners are used to reduce the PCB response. Vibration analysis of printed circuit boards is carried out using finite element method. The objective of this paper is to determine the dynamic characteristics of a printed circuit board. Modeling and analysis of PCB shall be carried out to study the effect of boundary conditions on the vibration response. The modeling of stiffeners or ribs shall also be considered in detail. The analysis results shall be validated using vibration tests of PCB.

Multidisciplinary analysis and design of printed wiring boards

NASA Astrophysics Data System (ADS)

Fulton, Robert E.; Hughes, Joseph L.; Scott, Waymond R., Jr.; Umeagukwu, Charles; Yeh, Chao-Pin

1991-04-01

Modern printed wiring board design depends on electronic prototyping using computer-based simulation and design tools. Existing electrical computer-aided design (ECAD) tools emphasize circuit connectivity with only rudimentary analysis capabilities. This paper describes a prototype integrated PWB design environment denoted Thermal Structural Electromagnetic Testability (TSET) being developed at Georgia Tech in collaboration with companies in the electronics industry. TSET provides design guidance based on enhanced electrical and mechanical CAD capabilities including electromagnetic modeling testability analysis thermal management and solid mechanics analysis. TSET development is based on a strong analytical and theoretical science base and incorporates an integrated information framework and a common database design based on a systematic structured methodology.

Ultrasonic pulser-receiver

DOEpatents

Taylor, Steven C.

2006-09-12

Ultrasonic pulser-receiver circuitry, for use with an ultrasonic transducer, the circuitry comprising a circuit board; ultrasonic pulser circuitry supported by the circuit board and configured to be coupled to an ultrasonic transducer and to cause the ultrasonic transducer to emit an ultrasonic output pulse; receiver circuitry supported by the circuit board, coupled to the pulser circuitry, including protection circuitry configured to protect against the ultrasonic pulse and including amplifier circuitry configured to amplify an echo, received back by the transducer, of the output pulse; and a connector configured to couple the ultrasonic transducer directly to the circuit board, to the pulser circuitry and receiver circuitry, wherein impedance mismatches that would result if the transducer was coupled to the circuit board via a cable can be avoided.

Fixture aids soldering of electronic components on circuit board

NASA Technical Reports Server (NTRS)

Ross, M. H.

1966-01-01

Spring clamp fixture holds small electronic components in a desired position while they are being soldered on a circuit board. The spring clamp is clipped on the edge of the circuit board and an adjustable spring-steel boom holds components against the board. The felt pad at the end of the boom is replaced with different attachments for other holding tasks.

An innovative approach to predict technology evolution for the desoldering of printed circuit boards: A perspective from China and America.

PubMed

Wang, Chen; Zhao, Wu; Wang, Jie; Chen, Ling; Luo, Chun-Jing

2016-06-01

The printed circuit boards basis of electronic equipment have seen a rapid growth in recent years and played a significant role in modern life. Nowadays, the fact that electronic devices upgrade quickly necessitates a proper management of waste printed circuit boards. Non-destructive desoldering of waste printed circuit boards becomes the first and the most crucial step towards recycling electronic components. Owing to the diversity of materials and components, the separation process is difficult, which results in complex and expensive recovery of precious materials and electronic components from waste printed circuit boards. To cope with this problem, we proposed an innovative approach integrating Theory of Inventive Problem Solving (TRIZ) evolution theory and technology maturity mapping system to forecast the evolution trends of desoldering technology of waste printed circuit boards. This approach can be applied to analyse the technology evolution, as well as desoldering technology evolution, then research and development strategy and evolution laws can be recommended. As an example, the maturity of desoldering technology is analysed with a technology maturity mapping system model. What is more, desoldering methods in different stages are analysed and compared. According to the analysis, the technological evolution trends are predicted to be 'the law of energy conductivity' and 'increasing the degree of idealisation'. And the potential technology and evolutionary state of waste printed circuit boards are predicted, offering reference for future waste printed circuit boards recycling. © The Author(s) 2016.

The research of laser marking control technology

NASA Astrophysics Data System (ADS)

Zhang, Qiue; Zhang, Rong

2009-08-01

In the area of Laser marking, the general control method is insert control card to computer's mother board, it can not support hot swap, it is difficult to assemble or it. Moreover, the one marking system must to equip one computer. In the system marking, the computer can not to do the other things except to transmit marking digital information. Otherwise it can affect marking precision. Based on traditional control methods existed some problems, introduced marking graphic editing and digital processing by the computer finish, high-speed digital signal processor (DSP) control marking the whole process. The laser marking controller is mainly contain DSP2812, digital memorizer, DAC (digital analog converting) transform unit circuit, USB interface control circuit, man-machine interface circuit, and other logic control circuit. Download the marking information which is processed by computer to U disk, DSP read the information by USB interface on time, then processing it, adopt the DSP inter timer control the marking time sequence, output the scanner control signal by D/A parts. Apply the technology can realize marking offline, thereby reduce the product cost, increase the product efficiency. The system have good effect in actual unit markings, the marking speed is more quickly than PCI control card to 20 percent. It has application value in practicality.

Three dimensional, multi-chip module

DOEpatents

Bernhardt, A.F.; Petersen, R.W.

1993-08-31

A plurality of multi-chip modules are stacked and bonded around the perimeter by sold-bump bonds to adjacent modules on, for instance, three sides of the perimeter. The fourth side can be used for coolant distribution, for more interconnect structures, or other features, depending on particular design considerations of the chip set. The multi-chip modules comprise a circuit board, having a planarized interconnect structure formed on a first major surface, and integrated circuit chips bonded to the planarized interconnect surface. Around the periphery of each circuit board, long, narrow dummy chips'' are bonded to the finished circuit board to form a perimeter wall. The wall is higher than any of the chips on the circuit board, so that the flat back surface of the board above will only touch the perimeter wall. Module-to-module interconnect is laser-patterned on the sides of the boards and over the perimeter wall in the same way and at the same time that chip to board interconnect may be laser-patterned.

Three dimensional, multi-chip module

DOEpatents

Bernhardt, Anthony F.; Petersen, Robert W.

1993-01-01

A plurality of multi-chip modules are stacked and bonded around the perimeter by sold-bump bonds to adjacent modules on, for instance, three sides of the perimeter. The fourth side can be used for coolant distribution, for more interconnect structures, or other features, depending on particular design considerations of the chip set. The multi-chip modules comprise a circuit board, having a planarized interconnect structure formed on a first major surface, and integrated circuit chips bonded to the planarized interconnect surface. Around the periphery of each circuit board, long, narrow "dummy chips" are bonded to the finished circuit board to form a perimeter wall. The wall is higher than any of the chips on the circuit board, so that the flat back surface of the board above will only touch the perimeter wall. Module-to-module interconnect is laser-patterned o the sides of the boards and over the perimeter wall in the same way and at the same time that chip to board interconnect may be laser-patterned.

Advanced Atmospheric Water Vapor DIAL Detection System

NASA Technical Reports Server (NTRS)

Refaat, Tamer F.; Elsayed-Ali, Hani E.; DeYoung, Russell J. (Technical Monitor)

2000-01-01

Measurement of atmospheric water vapor is very important for understanding the Earth's climate and water cycle. The remote sensing Differential Absorption Lidar (DIAL) technique is a powerful method to perform such measurement from aircraft and space. This thesis describes a new advanced detection system, which incorporates major improvements regarding sensitivity and size. These improvements include a low noise advanced avalanche photodiode detector, a custom analog circuit, a 14-bit digitizer, a microcontroller for on board averaging and finally a fast computer interface. This thesis describes the design and validation of this new water vapor DIAL detection system which was integrated onto a small Printed Circuit Board (PCB) with minimal weight and power consumption. Comparing its measurements to an existing DIAL system for aerosol and water vapor profiling validated the detection system.

Aluminum heat sink enables power transistors to be mounted integrally with printed circuit board

NASA Technical Reports Server (NTRS)

Seaward, R. C.

1967-01-01

Power transistor is provided with an integral flat plate aluminum heat sink which mounts directly on a printed circuit board containing associated circuitry. Standoff spacers are used to attach the heat sink to the printed circuit board containing the remainder of the circuitry.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Fulkerson, Edward; Lanning, Rodney K.; Telford, Steven

A device includes a u-channel shaped member and a printed circuit board including a plurality of capacitors. Each of the plurality of capacitors has a mounting surface mounted to the printed circuit board and an opposing heat transfer surface thermally coupled to the u-channel shaped member. The device also includes an output cable coupled to the printed circuit board and a return cable coupled to the printed circuit board. The device further includes a control transistor disposed inside the u-channel shaped member and a current sensing resistor disposed inside the u-channel shaped member.

High-Frequency Learning.

ERIC Educational Resources Information Center

Hollenbeck, Michelle D.

1997-01-01

For the past five years, Andover, Kansas middle-schoolers in an amateur radio club and class have sent and received Morse code messages, assembled and soldered circuit boards, designed and built antenna systems, and used computer programs to analyze radio communications problems. A successful bond issue financed a ham shack enabling students to…

A PC based time domain reflectometer for space station cable fault isolation

NASA Technical Reports Server (NTRS)

Pham, Michael; McClean, Marty; Hossain, Sabbir; Vo, Peter; Kouns, Ken

1994-01-01

Significant problems are faced by astronauts on orbit in the Space Station when trying to locate electrical faults in multi-segment avionics and communication cables. These problems necessitate the development of an automated portable device that will detect and locate cable faults using the pulse-echo technique known as Time Domain Reflectometry. A breadboard time domain reflectometer (TDR) circuit board was designed and developed at the NASA-JSC. The TDR board works in conjunction with a GRiD lap-top computer to automate the fault detection and isolation process. A software program was written to automatically display the nature and location of any possible faults. The breadboard system can isolate open circuit and short circuit faults within two feet in a typical space station cable configuration. Follow-on efforts planned for 1994 will produce a compact, portable prototype Space Station TDR capable of automated switching in multi-conductor cables for high fidelity evaluation. This device has many possible commercial applications, including commercial and military aircraft avionics, cable TV, telephone, communication, information and computer network systems. This paper describes the principle of time domain reflectometry and the methodology for on-orbit avionics utility distribution system repair, utilizing the newly developed device called the Space Station Time Domain Reflectometer (SSTDR).

TVC actuator model. [for the space shuttle main engine

NASA Technical Reports Server (NTRS)

Baslock, R. W.

1977-01-01

A prototype Space Shuttle Main Engine (SSME) Thrust Vector Control (TVC) Actuator analog model was successfully completed. The prototype, mounted on five printed circuit (PC) boards, was delivered to NASA, checked out and tested using a modular replacement technique on an analog computer. In all cases, the prototype model performed within the recording techniques of the analog computer which is well within the tolerances of the specifications.

Design of the Wind Tunnel Model Communication Controller Board. Degree awarded by Christopher Newport Univ. on Dec. 1998

NASA Technical Reports Server (NTRS)

Wilson, William C.

1999-01-01

The NASA Langley Research Center's Wind Tunnel Reinvestment project plans to shrink the existing data acquisition electronics to fit inside a wind tunnel model. Space limitations within a model necessitate a distributed system of Application Specific Integrated Circuits (ASICs) rather than a centralized system based on PC boards. This thesis will focus on the design of the prototype of the communication Controller board. A portion of the communication Controller board is to be used as the basis of an ASIC design. The communication Controller board will communicate between the internal model modules and the external data acquisition computer. This board is based around an Field Programmable Gate Array (FPGA), to allow for reconfigurability. In addition to the FPGA, this board contains buffer Random Access Memory (RAM), configuration memory (EEPROM), drivers for the communications ports, and passive components.

47 CFR 2.925 - Identification of equipment.

Code of Federal Regulations, 2014 CFR

2014-10-01

... sections assembled in a common enclosure, on a common chassis or circuit board, and with common frequency controlling circuits. Devices to which a single FCC Identifier has been assigned shall be identified pursuant... circuit boards with independent frequency controlling circuits. The FCC Identifier assigned to any...

47 CFR 2.925 - Identification of equipment.

Code of Federal Regulations, 2011 CFR

2011-10-01

... common chassis or circuit board, and with common frequency controlling circuits. Devices to which a... common enclosure, but constructed on separate sub-units or circuit boards with independent frequency controlling circuits. The FCC Identifier assigned to any transmitter section shall be preceded by the term TX...

47 CFR 2.925 - Identification of equipment.

Code of Federal Regulations, 2013 CFR

2013-10-01

... common chassis or circuit board, and with common frequency controlling circuits. Devices to which a... common enclosure, but constructed on separate sub-units or circuit boards with independent frequency controlling circuits. The FCC Identifier assigned to any transmitter section shall be preceded by the term TX...

47 CFR 2.925 - Identification of equipment.

Code of Federal Regulations, 2012 CFR

2012-10-01

... common chassis or circuit board, and with common frequency controlling circuits. Devices to which a... common enclosure, but constructed on separate sub-units or circuit boards with independent frequency controlling circuits. The FCC Identifier assigned to any transmitter section shall be preceded by the term TX...

47 CFR 2.925 - Identification of equipment.

Code of Federal Regulations, 2010 CFR

2010-10-01

... common chassis or circuit board, and with common frequency controlling circuits. Devices to which a... common enclosure, but constructed on separate sub-units or circuit boards with independent frequency controlling circuits. The FCC Identifier assigned to any transmitter section shall be preceded by the term TX...

High temperature transformations of waste printed circuit boards from computer monitor and CPU: Characterisation of residues and kinetic studies.

PubMed

Rajagopal, Raghu Raman; Rajarao, Ravindra; Sahajwalla, Veena

2016-11-01

This paper investigates the high temperature transformation, specifically the kinetic behaviour of the waste printed circuit board (WPCB) derived from computer monitor (single-sided/SSWPCB) and computer processing boards - CPU (multi-layered/MLWPCB) using Thermo-Gravimetric Analyser (TGA) and Vertical Thermo-Gravimetric Analyser (VTGA) techniques under nitrogen atmosphere. Furthermore, the resulting WPCB residues were subjected to characterisation using X-ray Fluorescence spectrometry (XRF), Carbon Analyser, X-ray Photoelectron Spectrometer (XPS) and Scanning Electron Microscopy (SEM). In order to analyse the material degradation of WPCB, TGA from 40°C to 700°C at the rates of 10°C, 20°C and 30°C and VTGA at 700°C, 900°C and 1100°C were performed respectively. The data obtained was analysed on the basis of first order reaction kinetics. Through experiments it is observed that there exists a substantial difference between SSWPCB and MLWPCB in their decomposition levels, kinetic behaviour and structural properties. The calculated activation energy (E A ) of SSWPCB is found to be lower than that of MLWPCB. Elemental analysis of SSWPCB determines to have high carbon content in contrast to MLWPCB and differences in materials properties have significant influence on kinetics, which is ceramic rich, proving to have differences in the physicochemical properties. These high temperature transformation studies and associated analytical investigations provide fundamental understanding of different WPCB and its major variations. Copyright © 2015 Elsevier Ltd. All rights reserved.

Wide-bandwidth high-resolution search for extraterrestrial intelligence

NASA Technical Reports Server (NTRS)

Horowitz, Paul

1993-01-01

A third antenna was added to the system. It is a terrestrial low-gain feed, to act as a veto for local interference. The 3-chip design for a 4 megapoint complex FFT was reduced to finished working hardware. The 4-Megachannel circuit board contains 36 MByte of DRAM, 5 CPLDs, the three large FFT ASICs, and 74 ICs in all. The Austek FDP-based Spectrometer/Power Accumulator (SPA) has now been implemented as a 4-layer printed circuit. A PC interface board has been designed and together with its associated user interface and control software allows an IBM compatible computer to control the SPA board, and facilitates the transfer of spectra to the PC for display, processing, and storage. The Feature Recognizer Array cards receive the stream of modulus words from the 4M FFT cards, and forward a greatly thinned set of reports to the PC's in whose backplane they reside. In particular, a powerful ROM-based state-machine architecture has been adopted, and DRAM has been added to permit integration modes when tracking or reobserving source candidates. The general purpose (GP) array consists of twenty '486 PC class computers, each of which receives and processes the data from a feature extractor/correlator board set. The array performs a first analysis on the provided 'features' and then passes this information on to the workstation. The core workstation software is now written. That is, the communication channels between the user interface, the backend monitor program and the PC's have working software.

An Open Hardware seismic data recorder - a solid basis for citizen science

NASA Astrophysics Data System (ADS)

Mertl, Stefan

2015-04-01

"Ruwai" is a 24-Bit Open Hardware seismic data recorder. It is built up of four stackable printed circuit boards fitting the Arduino Mega 2560 microcontroller prototyping platform. An interface to the BeagleBone Black single-board computer enables extensive data storage, -processing and networking capabilities. The four printed circuit boards provide a uBlox Lea-6T GPS module and real-time clock (GPS Timing shield), an Texas Instruments ADS1274 24-Bit analog to digital converter (ADC main shield), an analog input section with a Texas Instruments PGA281 programmable gain amplifier and an analog anti-aliasing filter (ADC analog interface pga) and the power conditioning based on 9-36V DC input (power supply shield). The Arduino Mega 2560 is used for controlling the hardware components, timestamping sampled data using the GPS timing information and transmitting the data to the BeagleBone Black single-board computer. The BeagleBone Black provides local data storage, wireless mesh networking using the optimized link state routing daemon and differential GNSS positioning using the RTKLIB software. The complete hardware and software is published under free software - or open hardware licenses and only free software (e.g. KiCad) was used for the development to facilitate the reusability of the design and increases the sustainability of the project. "Ruwai" was developed within the framework of the "Community Environmental Observation Network (CEON)" (http://www.mertl-research.at/ceon/) which was supported by the Internet Foundation Austria (IPA) within the NetIdee 2013 call.

Design, Assembly, Integration, and Testing of a Power Processing Unit for a Cylindrical Hall Thruster, the NORSAT-2 Flatsat, and the Vector Gravimeter for Asteroids Instrument Computer

NASA Astrophysics Data System (ADS)

Svatos, Adam Ladislav

This thesis describes the author's contributions to three separate projects. The bus of the NORSAT-2 satellite was developed by the Space Flight Laboratory (SFL) for the Norwegian Space Centre (NSC) and Space Norway. The author's contributions to the mission were performing unit tests for the components of all the spacecraft subsystems as well as designing and assembling the flatsat from flight spares. Gedex's Vector Gravimeter for Asteroids (VEGA) is an accelerometer for spacecraft. The author's contributions to this payload were modifying the instrument computer board schematic, designing the printed circuit board, developing and applying test software, and performing thermal acceptance testing of two instrument computer boards. The SFL's cylindrical Hall effect thruster combines the cylindrical configuration for a Hall thruster and uses permanent magnets to achieve miniaturization and low power consumption, respectively. The author's contributions were to design, build, and test an engineering model power processing unit.

Effects of Smoke on Functional Circuits

DTIC Science & Technology

1997-10-01

functional boards consisted of four layers ; that is, there were two pieces of FR-4* insulated circuit board material that were laminated together, each with...traces on both sides (three layers of dielectric in all). The layers were electrically connected by drilling holes into the circuit board and...allowing solder to flow through the holes and form "vias." For many of the circuits, one of the middle layers served as a ground plane, while the other

Fate of bromine in pyrolysis of printed circuit board wastes.

PubMed

Chien, Y C; Wang, H P; Lin, K S; Huang, Y J; Yang, Y W

2000-02-01

Behavior of Br in pyrolysis of the printed circuit board waste with valuable copper and oil recycling has been studied in the present work. Experimentally, pyrolysis of the printed circuit board waste generated approximately 40.6% of oils, 24.9% of noncondensible gases and 34.5% of solid residues that enriched in copper (90-95%). The cuts of the oils produced from pyrolysis of the printed circuit board waste into weighted boiling fraction were primarily light naphtha and heavy gas oil. Approximately 72.3% of total Br in the printed circuit board waste were found in product gas mainly as HBr and bromobenzene. However, by extended X-ray absorption fine structural (EXAFS) spectroscopy, Cu-O and Cu-(O)-Cu species with bond distance of 1.87 and 2.95 A, respectively, were observed in the solid residues. Essentially, no Cu-Br species was found.

Optical waveguide circuit board with a surface-mounted optical receiver array

NASA Astrophysics Data System (ADS)

Thomson, J. E.; Levesque, Harold; Savov, Emil; Horwitz, Fred; Booth, Bruce L.; Marchegiano, Joseph E.

1994-03-01

A photonic circuit board is fabricated for potential application to interchip and interboard parallel optical links. The board comprises photolithographically patterned polymer optical waveguides on a conventional glass-epoxy electrical circuit board and a surface-mounted integrated circuit (IC) package that optically and electrically couples to an optoelectronic IC. The waveguide circuits include eight-channel arrays of straights, cross-throughs, curves, self- aligning interconnects to multi-fiber ribbon, and out-of-plane turning mirrors. A coherent, fused bundle of optical fibers couples light between 45-deg waveguide mirrors and a GaAs receiver array in the IC package. The fiber bundle is easily aligned to the mirrors and the receivers and is amenable to surface mounting and hermetic sealing. The waveguide-receiver- array board achieved error-free data rates up to 1.25 Gbits/s per channel, and modal noise was shown to be negligible.

An Electrifying Quiz! Constructing a Printed-Circuit Board Quiz Game

ERIC Educational Resources Information Center

Calhoun, Michael J.

2005-01-01

Laptop computers, cell phones and the Apple iPod all contain transistors, IC chips, capacitors, and other electronic components. To the general public--and especially students in upper elementary and middle school grades--these components are most often very mysterious items. Yet, it is at elementary and middle school levels that scientists and…

Enhancement of simultaneous gold and copper extraction from computer printed circuit boards using Bacillus megaterium.

PubMed

Arshadi, M; Mousavi, S M

2015-01-01

In this research simultaneous gold and copper recovery from computer printed circuit boards (CPCBs) was evaluated using central composite design of response surface methodology (CCD-RSM). To maximize simultaneous metals' extraction from CPCB waste four factors which affected bioleaching were selected to be optimized. A pure culture of Bacillus megaterium, a cyanogenic bacterium, was used to produce cyanide as a leaching agent. Initial pH 10, pulp density 2g/l, particle mesh#100 and glycine concentration 0.5g/l were obtained as optimal conditions. Gold and copper were extracted simultaneously at about 36.81 and 13.26% under optimum conditions, respectively. To decrease the copper effect as an interference agent in the leaching solution, a pretreatment strategy was examined. For this purpose firstly using Acidithiobacillus ferrooxidans copper in the CPCB powder was totally extracted, then the residual sediment was subjected to further experiments for gold recovery by B. megaterium. Using pretreated sample under optimal conditions 63.8% gold was extracted. Copyright © 2014 Elsevier Ltd. All rights reserved.

Simultaneous recovery of Ni and Cu from computer-printed circuit boards using bioleaching: statistical evaluation and optimization.

PubMed

Arshadi, M; Mousavi, S M

2014-12-01

Computer printed circuit boards (CPCBs) have a rich metal content and are produced in high volume, making them an important component of electronic waste. The present study used a pure culture of Acidithiobacillus ferrooxidans to leach Cu and Ni from CPCBs waste. The adaptation phase began at 1g/l CPCBs powder with 10% inoculation and final pulp density was reached at 20g/l after about 80d. Four effective factors including initial pH, particle size, pulp density, and initial Fe(3+) concentration were optimized to achieve maximum simultaneous recovery of Cu and Ni. Their interactions were also identified using central composite design in response surface methodology. The suggested optimal conditions were initial pH 3, initial Fe(3+) 8.4g/l, pulp density 20g/l and particle size 95μm. Nearly 100% of Cu and Ni were simultaneously recovered under optimum conditions. Finally, bacterial growth characteristics versus time at optimum conditions were plotted. Copyright © 2014 Elsevier Ltd. All rights reserved.

Multi-level Simulation of a Real Time Vibration Monitoring System Component

NASA Technical Reports Server (NTRS)

Robertson, Bryan A.; Wilkerson, Delisa

2005-01-01

This paper describes the development of a custom built Digital Signal Processing (DSP) printed circuit board designed to implement the Advanced Real Time Vibration Monitoring Subsystem proposed by Marshall Space Flight Center (MSFC) Transportation Directorate in 2000 for the Space Shuttle Main Engine Advanced Health Management System (AHMS). This Real Time Vibration Monitoring System (RTVMS) is being developed for ground use as part of the AHMS Health Management Computer-Integrated Rack Assembly (HMC-IRA). The HMC-IRA RTVMS design contains five DSPs which are highly interconnected through individual communication ports, shared memory, and a unique communication router that allows all the DSPs to receive digitized data fiom two multi-channel analog boards simultaneously. This paper will briefly cover the overall board design but will focus primarily on the state-of-the-art simulation environment within which this board was developed. This 16-layer board with over 1800 components and an additional mezzanine card has been an extremely challenging design. Utilization of a Mentor Graphics simulation environment provided the unique board and system level simulation capability to ascertain any timing or functional concerns before production. By combining VHDL, Synopsys Software and Hardware Models, and the Mentor Design Capture Environment, multiple simulations were developed to verify the RTVMS design. This multi-level simulation allowed the designers to achieve complete operability without error the first time the RTVMS printed circuit board was powered. The HMC-IRA design has completed all engineering and deliverable unit testing. P

Multi-level Simulation of a Real Time Vibration Monitoring System Component

NASA Technical Reports Server (NTRS)

Roberston, Bryan; Wilkerson, DeLisa

2004-01-01

This paper describes the development of a custom built Digital Signal Processing (DSP) printed circuit board designed to implement the Advanced Real Time Vibration Monitoring Subsystem proposed by MSFC Transportation Directorate in 2000 for the Space Shuttle Main Engine Advanced Health Management System (AHMS). This Real Time Vibration Monitoring System (RTVMS) is being developed for ground use as part of the AHMS Health Management Computer-Integrated Rack Assembly (HMC-IRA). The HMC-IRA RTVMS design contains five DSPs which are highly interconnected through individual communication ports, shared memory, and a unique communication router that allows all the DSPs to receive digitized data from two multi-channel analog boards simultaneously. This paper will briefly cover the overall board design but will focus primarily on the state-of-the-art simulation environment within which this board was developed. This 16-layer board with over 1800 components and an additional mezzanine card has been an extremely challenging design. Utilization of a Mentor Graphics simulation environment provided the unique board and system level simulation capability to ascertain any timing or functional concerns before production. By combining VHDL, Synopsys Software and Hardware Models, and the Mentor Design Capture Environment, multiple simulations were developed to verify the RTVMS design. This multi-level simulation allowed the designers to achieve complete operability without error the first time the RTVMS printed circuit board was powered. The HMCIRA design has completed all engineering unit testing and the deliverable unit is currently under development.

Packaging system with cleaning channel and method of making the same

DOE Office of Scientific and Technical Information (OSTI.GOV)

Fang, Lu

A packaging structure and method for surface mount integrated circuits reduces electrochemical migration (ECM) problems by including one or more cleaning channels to effectively and efficiently remove flux residue that may otherwise remain lodged in gaps between the surface mount package and the printed circuit board. A cleaning channel may be formed along a bottom surface of the surface mount package (i.e., the surface facing the printed circuit board), or along a portion of a top surface of the printed circuit board. In either case, the inclusion of a cleaning channel enlarges the gap between the bottom surface of themore » surface mount package and the printed circuit board and creates a path for contaminants to be flushed out during a cleaning process.« less

Image dissector control and data system electronics, part 1, part 2, and part 3

NASA Technical Reports Server (NTRS)

1975-01-01

The operating and calibration procedures, design details, and maintenance information for the control console and the associated electronics are presented. Detailed circuit connector information is included which describes the destination of each wire leaving each pin of each circuit board. The schematic diagrams of the circuit boards in the system and of the interconnection between boards and consoles are presented.

Cables and crosstalk

NASA Astrophysics Data System (ADS)

Paul, Clayton R.

1991-06-01

Crosstalk is the unintentional electromagnetic coupling between circuits which are connected by parallel conductors that lie in close proximity to each other. Some examples are wires in cable harnesses or metallic lands on printed-circuit boards (PCB's). This unintended interaction between two or more circuits via their electromagnetic fields can cause interference problems. Signals from one circuit that couple to another circuit appear at the terminals of the devices that are interconnected by the wires. If these signals are of sufficient magnitude or spectral content, they may cause unintended operation of the device or a degradation in its performance. A summary of the standard models used for predicting crosstalk in various types of configurations is presented. The discussion focusses on the relative accuracies, regions of applicability, and computational complexity of the models. A simple explanation of the ability (or inability) of shielded wires and twisted pairs of wires to reduce the crosstalk is also given.

Computer simulation of the pneumatic separator in the pneumatic-electrostatic separation system for recycling waste printed circuit boards with electronic components.

PubMed

Xue, Mianqiang; Xu, Zhenming

2013-05-07

Technologies could be integrated in different ways into automatic recycling lines for a certain kind of electronic waste according to practical requirements. In this study, a new kind of pneumatic separator with openings at the dust hooper was applied combing with electrostatic separation for recycling waste printed circuit boards. However, the flow pattern and the particles' movement behavior could not be obtained by experimental methods. To better control the separation quantity and the material size distribution, computational fluid dynamics was used to model the new pneumatic separator giving a detailed understanding of the mechanisms. Simulated results showed that the tangential velocity direction reversed with a relatively small value. Axial velocity exhibited two sharp decreases at the x axis. It is indicated that the bottom openings at the dust hopper resulted in an enormous change in the velocity profile. A new phenomenon that was named dusting was observed, which would mitigate the effect of particles with small diameter on the following electrostatic separation and avoid materials plugging caused by the waste printed circuit boards special properties effectively. The trapped materials were divided into seven grades. Experimental results showed that the mass fraction of grade 5, grade 6, and grade 7 materials were 27.54%, 15.23%, and 17.38%, respectively. Grade 1 particles' mass fraction was reduced by 80.30% compared with a traditional separator. Furthermore, the monocrystalline silicon content in silicon element in particles with a diameter of -0.091 mm was 18.9%, higher than that in the mixed materials. This study could serve as guidance for the future material flow control, automation control, waste recycling, and semiconductor storage medium destruction.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Hopwood, J.E.; Affeldt, B.

An IBM personal computer (PC), a Gerber coordinate digitizer, and a collection of other instruments make up a system known as the Coordinate Digitizer Interactive Processor (CDIP). The PC extracts coordinate data from the digitizer through a special interface, and then, after reformatting, transmits the data to a remote VAX computer, a floppy disk, and a display terminal. This system has improved the efficiency of producing printed circuit-board artwork and extended the useful life of the Gerber GCD-1 Digitizer. 1 ref., 12 figs.

Planetary Waves and Mesoscale Disturbances in the Middle and Upper Atmosphere

DTIC Science & Technology

1998-05-14

processing of ionogram records made us to begin designing a computer - controlled system to collect, store, display and scale the ionograms in digital...circuit board " L - 154". L - 154 passed signals from the re- ceiver and the system of the control to computer in order to collect in for motion...the main purpose of the PSMOS project is the establishment of a ground-based mesopause observing system for the investigation of planetary scale

Agent-based services for B2B electronic commerce

NASA Astrophysics Data System (ADS)

Fong, Elizabeth; Ivezic, Nenad; Rhodes, Tom; Peng, Yun

2000-12-01

The potential of agent-based systems has not been realized yet, in part, because of the lack of understanding of how the agent technology supports industrial needs and emerging standards. The area of business-to-business electronic commerce (b2b e-commerce) is one of the most rapidly developing sectors of industry with huge impact on manufacturing practices. In this paper, we investigate the current state of agent technology and the feasibility of applying agent-based computing to b2b e-commerce in the circuit board manufacturing sector. We identify critical tasks and opportunities in the b2b e-commerce area where agent-based services can best be deployed. We describe an implemented agent-based prototype system to facilitate the bidding process for printed circuit board manufacturing and assembly. These activities are taking place within the Internet Commerce for Manufacturing (ICM) project, the NIST- sponsored project working with industry to create an environment where small manufacturers of mechanical and electronic components may participate competitively in virtual enterprises that manufacture printed circuit assemblies.

Development of a highly reliable composite board for printed circuitry for use in space environment

NASA Technical Reports Server (NTRS)

Bradbury, E. J.; Markle, R. A.; Dunnavant, W. R.; Stickney, P. B.

1971-01-01

Materials, processes and fabrication techniques have been investigated for the development of a high-temperature circuit-board laminate. High quality, void-free copper-clad laminates have been made using 7628/HS-1 style fiberglas reinforcements with filled polyimide matrices. The fabricating characteristics of P13N resin appear suitable for use as a filled matrix in this circuit board development. High-fired, ball-milled alumina appears to be necessary to obtain the desired effects in the circuit board system. Nickel-clad copper foil bonding surfaces appear to be another requirement for retention of good bond strengths after art work and plating sequences. The fabrication cycle for this circuit board system is very dependent on the heating profile. Very rapid heating with quick loading is recommended. A stack approach to lamination was successfully used.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Scott, Jeffrey Wayne

An RFID backscatter interrogator for transmitting data to an RFID tag, generating a carrier for the tag, and receiving data from the tag modulated onto the carrier, the interrogator including a single grounded-coplanar wave-guide circuit board and at least one surface mount integrated circuit supported by the circuit board.

3-D Packaging: A Technology Review

NASA Technical Reports Server (NTRS)

Strickland, Mark; Johnson, R. Wayne; Gerke, David

2005-01-01

Traditional electronics are assembled as a planar arrangement of components on a printed circuit board (PCB) or other type of substrate. These planar assemblies may then be plugged into a motherboard or card cage creating a volume of electronics. This architecture is common in many military and space electronic systems as well as large computer and telecommunications systems and industrial electronics. The individual PCB assemblies can be replaced if defective or for system upgrade. Some applications are constrained by the volume or the shape of the system and are not compatible with the motherboard or card cage architecture. Examples include missiles, camcorders, and digital cameras. In these systems, planar rigid-flex substrates are folded to create complex 3-D shapes. The flex circuit serves the role of motherboard, providing interconnection between the rigid boards. An example of a planar rigid - flex assembly prior to folding is shown. In both architectures, the interconnection is effectively 2-D.

Powerful timing generator using mono-chip timers: An application to pulsed nuclear magnetic resonance

NASA Astrophysics Data System (ADS)

Saint-Jalmes, Hervé; Barjhoux, Yves

1982-01-01

We present a 10 line-7 MHz timing generator built on a single board around two LSI timer chips interfaced to a 16-bit microcomputer. Once programmed from the host computer, this device is able to generate elaborate logic sequences on its 10 output lines without further interventions from the CPU. Powerful architecture introduces new possibilities over conventional memory-based timing simulators and word generators. Loop control on a given sequence of events, loop nesting, and various logic combinations can easily be implemented through a software interface, using a symbolic command language. Typical applications of such a device range from development, emulation, and test of integrated circuits, circuit boards, and communication systems to pulse-controlled instrumentation (radar, ultrasonic systems). A particular application to a pulsed Nuclear Magnetic Resonance (NMR) spectrometer is presented, along with customization of the device for generating four-channel radio-frequency pulses and the necessary sequence for subsequent data acquisition.

Circuit-lead trimming template

NASA Technical Reports Server (NTRS)

Ofarrell, K.; Winn, E.

1979-01-01

Template for use in trimming leads on production wiring boards is low-cost means for eliminating rejections for short leads and improving lead-strength uniformity. Template is simply unclad piece of printed-circuit board material that is drilled using same drill control tape used in making original production board. Revisions in component layout of board can therefore be made simultaneously in template.

A Real Time Controller For Applications In Smart Structures

NASA Astrophysics Data System (ADS)

Ahrens, Christian P.; Claus, Richard O.

1990-02-01

Research in smart structures, especially the area of vibration suppression, has warranted the investigation of advanced computing environments. Real time PC computing power has limited development of high order control algorithms. This paper presents a simple Real Time Embedded Control System (RTECS) in an application of Intelligent Structure Monitoring by way of modal domain sensing for vibration control. It is compared to a PC AT based system for overall functionality and speed. The system employs a novel Reduced Instruction Set Computer (RISC) microcontroller capable of 15 million instructions per second (MIPS) continuous performance and burst rates of 40 MIPS. Advanced Complimentary Metal Oxide Semiconductor (CMOS) circuits are integrated on a single 100 mm by 160 mm printed circuit board requiring only 1 Watt of power. An operating system written in Forth provides high speed operation and short development cycles. The system allows for implementation of Input/Output (I/O) intensive algorithms and provides capability for advanced system development.

Reliability Assessment of Critical Electronic Components

DTIC Science & Technology

1992-07-01

Failures FLHP - Full Horse Power FSN - Federal Stock Number I Current IC - Integrated Circuit IPB - Illustrated Parts Breakdown K - Boltzmans Constant L...Classified P - Power PC - Printed Circuit PCB - Printed Circuit Board PGA - Pin Grid Array PPM - Parts Per Million PWB - Printed Wiring Board 0...4-59 4.4.3.2.3 Circuit Brcakers ......................................................... 4-59 4.4.3.2.4 Thermal

DOE Office of Scientific and Technical Information (OSTI.GOV)

Korneeva, Anna; Shaydurov, Vladimir

In the paper, the data analysis is considered for thin-film thermoresistors coated on to a radio-electronic printed circuit board to determine possible zones of its overheating. A mathematical model consists in an underdetermined system of linear algebraic equations with an infinite set of solutions. For computing a more real solution, two additional conditions are used: the smoothness of a solution and the positiveness of an increase of temperature during overheating. Computational experiments demonstrate that an overheating zone is determined exactly with a tolerable accuracy of temperature in it.

Note: computer controlled rotation mount for large diameter optics.

PubMed

Rakonjac, Ana; Roberts, Kris O; Deb, Amita B; Kjærgaard, Niels

2013-02-01

We describe the construction of a motorized optical rotation mount with a 40 mm clear aperture. The device is used to remotely control the power of large diameter laser beams for a magneto-optical trap. A piezo-electric ultrasonic motor on a printed circuit board provides rotation with a precision better than 0.03° and allows for a very compact design. The rotation unit is controlled from a computer via serial communication, making integration into most software control platforms straightforward.

Sensing And Force-Reflecting Exoskeleton

NASA Technical Reports Server (NTRS)

Eberman, Brian; Fontana, Richard; Marcus, Beth

1993-01-01

Sensing and force-reflecting exoskeleton (SAFiRE) provides control signals to robot hand and force feedback from robot hand to human operator. Operator makes robot hand touch objects gently and manipulates them finely without exerting excessive forces. Device attaches to operator's hand; comfortable and lightweight. Includes finger exoskeleton, cable mechanical transmission, two dc servomotors, partial thumb exoskeleton, harness, amplifier box, two computer circuit boards, and software. Transduces motion of index finger and thumb. Video monitor of associated computer displays image corresponding to motion.

Fluid Power Multi-actuator Circuit Board with Microcomputer Control Option.

ERIC Educational Resources Information Center

McKechnie, R. E.; Vickers, G. W.

1981-01-01

Describes a portable fluid power engineering laboratory and class demonstration apparatus designed to enable students to design, build, and test multi-actuator circuits. Features a variety of standard pneumatic values and actuators fitted with quick disconnect couplings. Discusses sequencing circuit boards, microcomputer control, cost, and…

Reducing Printed Circuit Board Emissions with Low-Noise Design Practices

NASA Technical Reports Server (NTRS)

Bradley, Arthur T.; Fowler, Jennifer; Yavoich, Brian J.; Jennings, Stephen A.

2012-01-01

This paper presents the results of an experiment designed to determine the effectiveness of adopting several low-noise printed circuit board (PCB) design practices. Two boards were designed and fabricated, each consisting of identical mixed signal circuitry. Several important differences were introduced between the board layouts: one board was constructed using recommended low-noise practices and the other constructed without such attention. The emissions from the two boards were then measured and compared, demonstrating an improvement in radiated emissions of up to 22 dB.

A Circuit Board Using a Sheet of Thick Paper and Aluminium Tape

ERIC Educational Resources Information Center

Kamata, Masahiro; Honda, Motoshi

2003-01-01

We have developed a circuit board using materials that are inexpensive and familiar to elementary school students. Most of the responses from students who made this board were relatively positive and we observed them enjoy making the boards at a Science Festival in Japan and in elementary school. As an application, we also developed a tiny torch…

Adaptable Transponder for Multiple Telemetry Systems

NASA Technical Reports Server (NTRS)

Sims, William Herbert, III (Inventor); Varnavas, Kosta A. (Inventor)

2014-01-01

The present invention is a stackable telemetry circuit board for use in telemetry systems for satellites and other purposes. The present invention incorporates previously-qualified interchangeable circuit boards, or "decks," that perform functions such as power, signal receiving and transmission, and processing. Each deck is adapted to serve a range of telemetry applications. This provides flexibility in the construction of the stackable telemetry circuit board and significantly reduces the cost and time necessary to develop a telemetry system.

Heat sinking for printed circuitry

DOEpatents

Wilson, S.K.; Richardson, G.; Pinkerton, A.L.

1984-09-11

A flat pak or other solid-state device mounted on a printed circuit board directly over a hole extends therethrough so that the bottom of the pak or device extends beyond the bottom of the circuit board. A heat sink disposed beneath the circuit board contacts the bottom of the pak or device and provides direct heat sinking thereto. Pressure may be applied to the top of the pak or device to assure good mechanical and thermal contact with the heat sink.

Degradation of organic pollutants by Ag, Cu and Sn doped waste non-metallic printed circuit boards.

PubMed

Ramaswamy, Kadari; Radha, Velchuri; Malathi, M; Vithal, Muga; Munirathnam, Nagegownivari R

2017-02-01

The disposal and reuse of waste printed circuit boards have been the major global concerns. Printed circuit boards, a form of Electronic waste (hereafter e-waste), have been chemically processed, doped with Ag + , Cu 2+ and Sn 2+ , and used as visible light photocatalysts against the degradation of methylene blue and methyl violet. The elemental analyses of pristine and metal doped printed circuit board were obtained using energy dispersive X-ray fluorescence (EDXRF) spectra and inductively coupled plasma optical emission spectroscopy (ICP-OES). The morphology of parent and doped printed circuit board was obtained from scanning electron microscopy (SEM) measurements. The photocatalytic activity of parent and metal doped samples was carried out for the decomposition of organic pollutants, methylene blue and methyl violet, under visible light irradiation. Metal doped waste printed circuit boards (WPCBs) have shown higher photocatalytic activity against the degradation of methyl violet and methylene blue under visible light irradiation. Scavenger experiments were performed to identify the reactive intermediates responsible for the degradation of methylene blue and methyl violet. The reactive species responsible for the degradation of MV and MB were found to be holes and hydroxyl radicals. A possible mechanism of degradation of methylene blue and methyl violet is given. The stability and reusability of the catalysts are also investigated. Copyright © 2016. Published by Elsevier Ltd.

Printed circuit board impedance matching step for microwave (millimeter wave) devices

DOEpatents

Pao, Hsueh-Yuan; Aguirre, Jerardo; Sargis, Paul

2013-10-01

An impedance matching ground plane step, in conjunction with a quarter wave transformer section, in a printed circuit board provides a broadband microwave matching transition from board connectors or other elements that require thin substrates to thick substrate (>quarter wavelength) broadband microwave (millimeter wave) devices. A method of constructing microwave and other high frequency electrical circuits on a substrate of uniform thickness, where the circuit is formed of a plurality of interconnected elements of different impedances that individually require substrates of different thicknesses, by providing a substrate of uniform thickness that is a composite or multilayered substrate; and forming a pattern of intermediate ground planes or impedance matching steps interconnected by vias located under various parts of the circuit where components of different impedances are located so that each part of the circuit has a ground plane substrate thickness that is optimum while the entire circuit is formed on a substrate of uniform thickness.

Evaluation of Cleanliness Test Methods for Spacecraft PCB Assemblies

NASA Astrophysics Data System (ADS)

Tegehall, P.-E.; Dunn, B. D.

2006-10-01

Ionic contamination on printed-circuit-board assemblies may cause current leakage and short-circuits. The present cleanliness requirement in ECSS-Q-70-08, "The manual soldering of high-reliability electrical connections", is that the ionic contamination shall be less than 1.56 fl-glcm2 NaCI equivalents. The relevance of the method used for measurement of the ionic contamination level, resistivity of solvent extract, has been questioned. Alternative methods are ion chromatography and measurement of surface insulation resistance, but these methods also have their drawbacks. These methods are first described and their advantages and drawbacks are discussed. This is followed by an experimental evaluation of the three methods. This was done by soldering test vehicles at four manufacturers of space electronics using their ordinary processes for soldering and cleaning printed board assemblies. The experimental evaluation showed that the ionic contamination added by the four assemblers was very small and well below the acceptance criterion in ECSS-Q-70-80. Ion-chromatography analysis showed that most of the ionic contamination on the cleaned assembled boards originated from the hot-oil fusing of the printed circuit boards. Also, the surface insulation resistance was higher on the assembled boards compared to the bare printed circuit boards. Since strongly activated fluxes are normally used when printed circuit boards are hot-oil fused, it is essential that they are thoroughly cleaned in order to achieve low contamination levels on the final printed-board assemblies.

Design criteria: data acquisition system for waste tank liquid level gauges and SX Tank Farm thermocouples

DOE Office of Scientific and Technical Information (OSTI.GOV)

Martin, G.E.; Oliver, R.G.

1972-02-17

This design criteria revision (revision 2) will cancel revision 1 and will provide complete functional supervision of the liquid level gauges. A new.counter and an electronic supervisory circuit will be installed in each waste tank liquid level gauge. The electronic supervisory circuit will monitor (via the new counter and a signal from the gauge electronics) cycling of the gauge on a one minute time cycle. This supervisory circuit will fulfill the intent of revision 1 (monitor AC power to the gauge) and, in addition, will supervise all other aspects of the gauge including: the electronics, the drive motor, all sprocketsmore » and chain linkages, and the counter. If a gauge failure should occur, this circuit will remove the +12 volts excitation from the data acquisition system inferface board; and the computer will be programmed to recognize this condition as a gauge failure. (auth)« less

Printed circuit boards: a review on the perspective of sustainability.

PubMed

Canal Marques, André; Cabrera, José-María; Malfatti, Célia de Fraga

2013-12-15

Modern life increasingly requires newer equipments and more technology. In addition, the fact that society is highly consumerist makes the amount of discarded equipment as well as the amount of waste from the manufacture of new products increase at an alarming rate. Printed circuit boards, which form the basis of the electronics industry, are technological waste of difficult disposal whose recycling is complex and expensive due to the diversity of materials and components and their difficult separation. Currently, printed circuit boards have a fixing problem, which is migrating from traditional Pb-Sn alloys to lead-free alloys without definite choice. This replacement is an attempt to minimize the problem of Pb toxicity, but it does not change the problem of separation of the components for later reuse and/or recycling and leads to other problems, such as temperature rise, delamination, flaws, risks of mechanical shocks and the formation of "whiskers". This article presents a literature review on printed circuit boards, showing their structure and materials, the environmental problem related to the board, some the different alternatives for recycling, and some solutions that are being studied to reduce and/or replace the solder, in order to minimize the impact of solder on the printed circuit boards. Copyright © 2013 Elsevier Ltd. All rights reserved.

Lead phytoextraction from printed circuit computer boards by Lolium perenne L. and Medicago sativa L.

PubMed

Díaz Martínez, María Esther; Argumedo-Delira, Rosalba; Sánchez Viveros, Gabriela; Alarcón, Alejandro; Trejo-Téllez, Libia Iris

2018-04-16

This work assessed the ability of Lolium perenne and Medicago sativa for extracting lead (Pb) from particulate printed circuit computer boards (PCB) mixed in sand with the following concentrations: 0.5, 1.0 and 1.5 g of PCB, and including a control treatment without PCB. The PCB were obtained from computers, and grinded in two particle sizes: 0.0594 mm (PCB1) and 0.0706 mm (PCB2). The PCB particle sizes at their corresponding concentrations were applied to L. perenne and M. sativa by using three experimental assays. In assay II, PCB2 affected the biomass production for both plants. For assay III, the PCB1 increased the biomass of M. sativa (236.5%) and L. perenne (142.2%) when applying either 0.5 or 1.0 g, respectively. In regards to phytoextraction, assay I showed the highest Pb-extraction by roots of L. perenne (4.7%) when exposed to 1.5 g of PCB1. At assay I, L. perenne showed a Pb-bioconcentration factor higher than 1.0 when growing at 0.5 g of PCB1, and when HNO 3 was used as digestion solution; moreover, in assay III both plants showed a Pb-translocation factor higher than 1.0. Therefore, Lolium perenne and Medicago sativa are able to recover Pb from electronic wastes (PCB).

Selective thermal transformation of old computer printed circuit boards to Cu-Sn based alloy.

PubMed

Shokri, Ali; Pahlevani, Farshid; Cole, Ivan; Sahajwalla, Veena

2017-09-01

This study investigates, verifies and determines the optimal parameters for the selective thermal transformation of problematic electronic waste (e-waste) to produce value-added copper-tin (Cu-Sn) based alloys; thereby demonstrating a novel new pathway for the cost-effective recovery of resources from one of the world's fastest growing and most challenging waste streams. Using outdated computer printed circuit boards (PCBs), a ubiquitous component of e-waste, we investigated transformations across a range of temperatures and time frames. Results indicate a two-step heat treatment process, using a low temperature step followed by a high temperature step, can be used to produce and separate off, first, a lead (Pb) based alloy and, subsequently, a Cu-Sn based alloy. We also found a single-step heat treatment process at a moderate temperature of 900 °C can be used to directly transform old PCBs to produce a Cu-Sn based alloy, while capturing the Pb and antimony (Sb) as alloying elements to prevent the emission of these low melting point elements. These results demonstrate old computer PCBs, large volumes of which are already within global waste stockpiles, can be considered a potential source of value-added metal alloys, opening up a new opportunity for utilizing e-waste to produce metal alloys in local micro-factories. Copyright © 2017 Elsevier Ltd. All rights reserved.

Front-Side Microstrip Line Feeding a Raised Antenna Patch

NASA Technical Reports Server (NTRS)

Hodges, Richard; Hoppe, Daniel

2005-01-01

An improved design concept for a printed-circuit patch antenna and the transmission line that feeds the patch calls for (1) a microstrip transmission line on the front (radiative) side of a printed-circuit board based on a thin, high-permittivity dielectric substrate; (2) using the conductor covering the back side of the circuit board as a common ground plane for both the microstrip line and the antenna patch; (3) supporting the antenna patch in front of the circuit board on a much thicker, lower-permittivity dielectric spacer layer; and (4) connecting the microstrip transmission line to the patch by use of a thin wire or narrow ribbon that extends through the thickness of the spacer and is oriented perpendicularly to the circuit-board plane. The thickness of the substrate is typically chosen so that a microstrip transmission line of practical width has an impedance between 50 and 100 ohms. The advantages of this design concept are best understood in the context of the disadvantages of prior design concepts, as explained

DOE Office of Scientific and Technical Information (OSTI.GOV)

Hadi, Pejman; Ning, Chao; Ouyang, Weiyi

Highlights: • Environmental impacts of electronic waste and specifically waste printed circuit boards. • Review of the recycling techniques of waste printed circuit boards. • Advantages of physico-mechanical recycling techniques over chemical methods. • Utilization of nonmetallic fraction of waste printed circuit boards as modifier/filler. • Recent advances in the use of nonmetallic fraction of waste printed circuit boards as precursor. - Abstract: Electronic waste, including printed circuit boards, is growing at an alarming rate due to the accelerated technological progress and the shorter lifespan of the electronic equipment. In the past decades, due to the lack of proper economicmore » and environmentally-benign recycling technologies, a major fraction of e-waste generated was either destined to landfills or incinerated with the sole intention of its disposal disregarding the toxic nature of this waste. Recently, with the increasing public awareness over their environment and health issues and with the enaction of more stringent regulations, environmentally-benign recycling has been driven to be an alternative option partially replacing the traditional eco-unfriendly disposal methods. One of the most favorable green technologies has been the mechanical separation of the metallic and nonmetallic fraction of the waste printed circuit boards. Although metallic fraction, as the most profitable component, is used to generate the revenue of the separation process, the nonmetallic fraction (NMF) has been left isolated. Herein, the recent developments in the application of NMF have been comprehensively reviewed and an eco-friendly emerging usage of NMF as a value-added material for sustainable remediation has been introduced.« less

Advanced Packaging for VLSI/VHSIC (Very Large Scale Integrated Circuits/Very High Speed Integrated Circuits) Applications: Electrical, Thermal, and Mechanical Considerations - An IR&D Report.

DTIC Science & Technology

1987-11-01

developed that can be used by circuit engineers to extract the maximum performance from the devices on various board technologies including multilayer ceramic...Design guidelines have been developed that can be used by circuit engineers to extract the maxi- mum performance from the devices on various board...25 Attenuation and Dispersion Effects ......................................... 27 Skin Effect

Area-Efficient Graph Layouts (for VLSI).

DTIC Science & Technology

1980-08-13

thle short side, then no rectangle is ew r generated x’.ho se aspect r~itho i s \\orse di ai aJ. ’I lie d i % ide-I mid -cimq tier clInt ruolIn in... Sutherland and Donald Oestrcichcr, "flow big should a printed circuit board be?," ILEEE, Transactions on Computers, Vol. C-22, May 1973, pp. 537-542. 22

Design and Implementation of a Motor Incremental Shaft Encoder

DTIC Science & Technology

2008-09-01

SDC Student Design Center VHDL Verilog Hardware Description Language VSC Voltage Source Converters ZCE Zero Crossing Event xiii EXECUTIVE...student to make accurate predictions of voltage source converters ( VSC ) behavior via software simulation; these simulated results could also be... VSC ), and several other off-the-shelf components, a circuit board interface between FPGA and the power source, and a desktop computer [1]. Now, the

Random On-Board Pixel Sampling (ROPS) X-Ray Camera

DOE Office of Scientific and Technical Information (OSTI.GOV)

Wang, Zhehui; Iaroshenko, O.; Li, S.

Recent advances in compressed sensing theory and algorithms offer new possibilities for high-speed X-ray camera design. In many CMOS cameras, each pixel has an independent on-board circuit that includes an amplifier, noise rejection, signal shaper, an analog-to-digital converter (ADC), and optional in-pixel storage. When X-ray images are sparse, i.e., when one of the following cases is true: (a.) The number of pixels with true X-ray hits is much smaller than the total number of pixels; (b.) The X-ray information is redundant; or (c.) Some prior knowledge about the X-ray images exists, sparse sampling may be allowed. Here we first illustratemore » the feasibility of random on-board pixel sampling (ROPS) using an existing set of X-ray images, followed by a discussion about signal to noise as a function of pixel size. Next, we describe a possible circuit architecture to achieve random pixel access and in-pixel storage. The combination of a multilayer architecture, sparse on-chip sampling, and computational image techniques, is expected to facilitate the development and applications of high-speed X-ray camera technology.« less

Separation and recovery of fine particles from waste circuit boards using an inflatable tapered diameter separation bed.

PubMed

Duan, Chenlong; Sheng, Cheng; Wu, Lingling; Zhao, Yuemin; He, Jinfeng; Zhou, Enhui

2014-01-01

Recovering particle materials from discarded printed circuit boards can enhance resource recycling and reduce environmental pollution. Efficiently physically separating and recovering fine metal particles (-0.5 mm) from the circuit boards are a key recycling challenge. To do this, a new type of separator, an inflatable tapered diameter separation bed, was developed to study particle motion and separation mechanisms in the bed's fluid flow field. For 0.5-0.25 mm circuit board particles, metal recovery rates ranged from 87.56 to 94.17%, and separation efficiencies ranged from 87.71 to 94.20%. For 0.25-0.125 mm particles, metal recovery rates ranged from 84.76 to 91.97%, and separation efficiencies ranged from 84.74 to 91.86%. For superfine products (-0.125 mm), metal recovery rates ranged from 73.11 to 83.04%, and separation efficiencies ranged from 73.00 to 83.14%. This research showed that the inflatable tapered diameter separation bed achieved efficient particle separation and can be used to recover fine particles under a wide range of operational conditions. The bed offers a new mechanical technology to recycle valuable materials from discarded printed circuit boards, reducing environmental pollution.

High stability buffered phase comparator

NASA Technical Reports Server (NTRS)

Adams, W. A.; Reinhardt, V. S. (Inventor)

1984-01-01

A low noise RF signal phase comparator comprised of two high stability driver buffer amplifiers driving a double balanced mixer which operate to generate a beat frequency between the two RF input signals coupled to the amplifiers from the RF sources is described. The beat frequency output from the mixer is applied to a low noise zero crossing detector which is the phase difference between the two RF inputs. Temperature stability is provided by mounting the amplifiers and mixer on a common circuit board with the active circuit elements located on one side of a circuit board and the passive circuit elements located on the opposite side. A common heat sink is located adjacent the circuit board. The active circuit elements are embedded into the bores of the heat sink which slows the effect of ambient temperature changes and reduces the temperature gradients between the active circuit elements, thus improving the cancellation of temperature effects. The two amplifiers include individual voltage regulators, which increases RF isolation.

Spacelab, Spacehab, and Space Station Freedom payload interface projects

NASA Technical Reports Server (NTRS)

Smith, Dean Lance

1992-01-01

Contributions were made to several projects. Howard Nguyen was assisted in developing the Space Station RPS (Rack Power Supply). The RPS is a computer controlled power supply that helps test equipment used for experiments before the equipment is installed on Space Station Freedom. Ron Bennett of General Electric Government Services was assisted in the design and analysis of the Standard Interface Rack Controller hardware and software. An analysis was made of the GPIB (General Purpose Interface Bus), looking for any potential problems while transmitting data across the bus, such as the interaction of the bus controller with a data talker and its listeners. An analysis was made of GPIB bus communications in general, including any negative impact the bus may have on transmitting data back to Earth. A study was made of transmitting digital data back to Earth over a video channel. A report was written about the study and a revised version of the report will be submitted for publication. Work was started on the design of a PC/AT compatible circuit board that will combine digital data with a video signal. Another PC/AT compatible circuit board is being designed to recover the digital data from the video signal. A proposal was submitted to support the continued development of the interface boards after the author returns to Memphis State University in the fall. A study was also made of storing circuit board design software and data on the hard disk server of a LAN (Local Area Network) that connects several IBM style PCs. A report was written that makes several recommendations. A preliminary design review was started of the AIVS (Automatic Interface Verification System). The summer was over before any significant contribution could be made to this project.

Hybrid stretchable circuits on silicone substrate

DOE Office of Scientific and Technical Information (OSTI.GOV)

Robinson, A., E-mail: adam.1.robinson@nokia.com; Aziz, A., E-mail: a.aziz1@lancaster.ac.uk; Liu, Q.

When rigid and stretchable components are integrated onto a single elastic carrier substrate, large strain heterogeneities appear in the vicinity of the deformable-non-deformable interfaces. In this paper, we report on a generic approach to manufacture hybrid stretchable circuits where commercial electronic components can be mounted on a stretchable circuit board. Similar to printed circuit board development, the components are electrically bonded on the elastic substrate and interconnected with stretchable electrical traces. The substrate—a silicone matrix carrying concentric rigid disks—ensures both the circuit elasticity and the mechanical integrity of the most fragile materials.

A micro-CL system and its applications

NASA Astrophysics Data System (ADS)

Wei, Zenghui; Yuan, Lulu; Liu, Baodong; Wei, Cunfeng; Sun, Cuili; Yin, Pengfei; Wei, Long

2017-11-01

The computed laminography (CL) method is preferable to computed tomography for the non-destructive testing of plate-like objects. A micro-CL system is developed for three-dimensional imaging of plate-like objects. The details of the micro-CL system are described, including the system architecture, scanning modes, and reconstruction algorithm. The experiment results of plate-like fossils, insulated gate bipolar translator module, ball grid array packaging, and printed circuit board are also presented to demonstrate micro-CL's ability for 3D imaging of flat specimens and universal applicability in various fields.

A micro-CL system and its applications.

PubMed

Wei, Zenghui; Yuan, Lulu; Liu, Baodong; Wei, Cunfeng; Sun, Cuili; Yin, Pengfei; Wei, Long

2017-11-01

The computed laminography (CL) method is preferable to computed tomography for the non-destructive testing of plate-like objects. A micro-CL system is developed for three-dimensional imaging of plate-like objects. The details of the micro-CL system are described, including the system architecture, scanning modes, and reconstruction algorithm. The experiment results of plate-like fossils, insulated gate bipolar translator module, ball grid array packaging, and printed circuit board are also presented to demonstrate micro-CL's ability for 3D imaging of flat specimens and universal applicability in various fields.

TSCA Chemical Data Reporting Fact Sheet: Byproducts Reporting for the Printed Circuit Board Industry

EPA Pesticide Factsheets

This fact sheet provides information on existing Chemical Data Reporting (CDR) rule requirements related to byproducts reporting by persons who manufacture printed circuit boards and may be subject to CDR.

Secure RFID tag or sensor with self-destruction mechanism upon tampering

DOE Office of Scientific and Technical Information (OSTI.GOV)

Nekoogar, Faranak; Dowla, Farid; Twogood, Richard

A circuit board anti-tamper mechanism comprises a circuit board having a frangible portion, a trigger having a trigger spring, a trigger arming mechanism actuated by the trigger wherein the trigger arming mechanism is initially non-actuated, a force producing mechanism, a latch providing mechanical communication between the trigger arming mechanism and the force producing mechanism, wherein the latch initially retains the force producing mechanism in a refracted position. Arming pressure applied to the trigger sufficient to overcome the trigger spring force will actuate the trigger arming mechanism, causing the anti-tamper mechanism to be armed. Subsequent tampering with the anti-tamper mechanism resultsmore » in a decrease of pressure on the trigger below the trigger spring force, thereby causing the trigger arming mechanism to actuate the latch, thereby releasing the force producing mechanism to apply force to the frangible portion of the circuit board, thereby breaking the circuit board.« less

Leaching of metals from large pieces of printed circuit boards using citric acid and hydrogen peroxide.

PubMed

Jadhav, Umesh; Su, C; Hocheng, Hong

2016-12-01

In the present study, the leaching of metals from large pieces of computer printed circuit boards (CPCBs) was studied. A combination of citric acid (0.5 M) and 1.76 M hydrogen peroxide (H 2 O 2 ) was used to leach the metals from CPCB piece. The influence of system variables such as H 2 O 2 concentration, concentration of citric acid, shaking speed, and temperature on the metal leaching process was investigated. The complete metal leaching was achieved in 4 h from a 4 × 4 cm CPCB piece. The presence of citric acid and H 2 O 2 together in the leaching solution is essential for complete metal leaching. The optimum addition amount of H 2 O 2 was 5.83 %. The citric acid concentration and shaking speed had an insignificant effect on the leaching of metals. The increase in the temperature above 30 °C showed a drastic effect on metal leaching process.

The Infrared Automatic Mass Screening (IRAMS) System For Printed Circuit Board Fault Detection

NASA Astrophysics Data System (ADS)

Hugo, Perry W.

1987-05-01

Office of the Program Manager for TMDE (OPM TMDE) has initiated a program to develop techniques for evaluating the performance of printed circuit boards (PCB's) using infrared thermal imaging. It is OPM TMDE's expectation that the standard thermal profile (STP) will become the basis for the future rapid automatic detection and isolation of gross failure mechanisms on units under test (UUT's). To accomplish this OPM TMDE has purchased two Infrared Automatic Mass Screening ( I RAMS) systems which are scheduled for delivery in 1987. The IRAMS system combines a high resolution infrared thermal imager with a test bench and diagnostic computer hardware and software. Its purpose is to rapidly and automatically compare the thermal profiles of a UUT with the STP of that unit, recalled from memory, in order to detect thermally responsive failure mechanisms in PCB's. This paper will review the IRAMS performance requirements, outline the plan for implementing the two systems and report on progress to date.

Lessons Learned Using COTS Electronics for the International Space Station Radiation Environment

NASA Technical Reports Server (NTRS)

Blumer, John H.; Roth, A. (Technical Monitor)

2001-01-01

The mantra of 'Faster, Better, Cheaper' has to a large degree been interpreted as using Commercial Off-the-Shelf (COTS) components and/or circuit boards. One of the first space applications to actually use COTS in space along with radiation performance requirements was the Expedite the Processing of Experiments to Space Station (EXPRESS) Rack program, for the International Space Station (ISS). In order to meet the performance, cost and schedule targets, military grade Versa Module Eurocard (VME) was selected as the baseline design for the main computer, the Rack Interface Controller (RIC). VME was chosen as the computer backplane because of the large variety of military grade boards available, which were designed to meet the military environmental specifications (thermal, shock, vibration, etc.). These boards also have a paper pedigree in regards to components. Since these boards exceeded most ISS environmental requirements, it was reasoned using COTS mid-grade VME boards, as opposed to designing custom boards could save significant time and money. It was recognized up front the radiation environment of ISS, while benign compared to many space flight applications, would be the main challenge to using COTS. Thus in addition to selecting vendors on how well their boards met the usual performance and environmental specifications, the board's parts lists were reviewed on how well they would perform in the ISS radiation environment. However, issues with verifying that the available radiation test data was applicable to the actual part used, vendor part design changes and the fact most parts did not have valid test data soon complicated board and part selection in regards to radiation.

Soldering Tool for Integrated Circuits

NASA Technical Reports Server (NTRS)

Takahashi, Ted H.

1987-01-01

Many connections soldered simultaneously in confined spaces. Improved soldering tool bonds integrated circuits onto printed-circuit boards. Intended especially for use with so-called "leadless-carrier" integrated circuits.

Alternatives Assessment: Partnership to Evaluate Flame Retardants in Printed Circuit Boards

EPA Pesticide Factsheets

The partnership project on flame retardants in printed circuit boards seeks to improve understanding of the environmental and human health impacts of new and current materials that can be used to meet fire safety standards

Flexible composite film for printed circuit board

NASA Technical Reports Server (NTRS)

Yabe, K.; Asakura, M.; Tanaka, H.; Soda, A.

1982-01-01

A flexible printed circuit for a printed circuit board in which layers of reaction product composed of a combination of phenoxy resin - polyisocyanate - brominated epoxy resin, and in which the equivalent ratio of those functional groups is hydroxyl group: isocyanate group: epoxy group - 1 : 0.2 to 2 : 0.5 to 3 are laminated on at least one side of saturated polyester film is discussed.

Separation and Recovery of Fine Particles from Waste Circuit Boards Using an Inflatable Tapered Diameter Separation Bed

PubMed Central

Sheng, Cheng; Wu, Lingling; Zhao, Yuemin; He, Jinfeng; Zhou, Enhui

2014-01-01

Recovering particle materials from discarded printed circuit boards can enhance resource recycling and reduce environmental pollution. Efficiently physically separating and recovering fine metal particles (−0.5 mm) from the circuit boards are a key recycling challenge. To do this, a new type of separator, an inflatable tapered diameter separation bed, was developed to study particle motion and separation mechanisms in the bed's fluid flow field. For 0.5–0.25 mm circuit board particles, metal recovery rates ranged from 87.56 to 94.17%, and separation efficiencies ranged from 87.71 to 94.20%. For 0.25–0.125 mm particles, metal recovery rates ranged from 84.76 to 91.97%, and separation efficiencies ranged from 84.74 to 91.86%. For superfine products (−0.125 mm), metal recovery rates ranged from 73.11 to 83.04%, and separation efficiencies ranged from 73.00 to 83.14%. This research showed that the inflatable tapered diameter separation bed achieved efficient particle separation and can be used to recover fine particles under a wide range of operational conditions. The bed offers a new mechanical technology to recycle valuable materials from discarded printed circuit boards, reducing environmental pollution. PMID:25379546

Circuit design of an EMCCD camera

NASA Astrophysics Data System (ADS)

Li, Binhua; Song, Qian; Jin, Jianhui; He, Chun

2012-07-01

EMCCDs have been used in the astronomical observations in many ways. Recently we develop a camera using an EMCCD TX285. The CCD chip is cooled to -100°C in an LN2 dewar. The camera controller consists of a driving board, a control board and a temperature control board. Power supplies and driving clocks of the CCD are provided by the driving board, the timing generator is located in the control board. The timing generator and an embedded Nios II CPU are implemented in an FPGA. Moreover the ADC and the data transfer circuit are also in the control board, and controlled by the FPGA. The data transfer between the image workstation and the camera is done through a Camera Link frame grabber. The software of image acquisition is built using VC++ and Sapera LT. This paper describes the camera structure, the main components and circuit design for video signal processing channel, clock driver, FPGA and Camera Link interfaces, temperature metering and control system. Some testing results are presented.

Computer-Aided Design and Fabrication of Wire-Wrap (Trademark) Type Circuit Boards: A New Symbolism and Its Implementation (Conception et Fabrication Automatisees de Circuits par Cablage Enroule: un Nouveau Symbolisme et son Application),

DTIC Science & Technology

1982-02-01

facilitant la transition entre les plans d’ing~nierie 6lectronique et la matrice pertinente d’interconnexions requise pour le montage par c~blage enroul6 Wire...Wrap. Le d~veloppement de prototypes 6lectroniques s’est vu consid6rablement acc6l6r6 par la preparation plus rapide des donn~es d’interconnexions...directory, all located in *APL files (Sect. 7.0). A matrix called BANQUE is also formed by the program L to regroup those chip descriptions of the main

Inexpensive Implementation of Many Strain Gauges

NASA Technical Reports Server (NTRS)

Berkun, Andrew C.

2010-01-01

It has been proposed to develop arrays of strain gauges as arrays of ordinary metal film resistors and associated electronic readout circuitry on printed circuit boards or other suitable substrates. This proposal is a by-product of a development of instrumentation utilizing metal film resistors on printed-circuit boards to measure temperatures at multiple locations. In the course of that development, it was observed that in addition to being sensitive to temperature, the metal film resistors were also sensitive to strains in the printed-circuit boards to which they were attached. Because of the low cost of ordinary metal film resistors (typically <$0.01 apiece at 2007 prices), the proposal could enable inexpensive implementation of arrays of many (e.g., 100 or more) strain gauges, possibly concentrated in small areas. For example, such an array could be designed for use as a computer keyboard with no moving parts, as a device for sensing the shape of an object resting on a surface, or as a device for measuring strains at many points on a mirror, a fuel tank, an airplane wing, or other large object. Ordinarily, the effect of strain on resistance would be regarded as a nuisance in a temperature-measuring application, and the effect of temperature on resistance would be regarded as a nuisance in a strain-measuring application. The strain-induced changes in resistance of the metal film resistors in question are less than those of films in traditional strain gauges. The main novel aspect of present proposal lies in the use of circuitry affording sufficient sensitivity to measure strain plus means for compensating for the effect of temperature. For an array of metal film resistors used as proposed, the readout circuits would include a high-accuracy analog-to-digital converter fed by a low noise current source, amplifier chain, and an analog multiplexer chain. Corrections would be provided by use of high-accuracy calibration resistors and a temperature sensor. By use of such readout circuitry, it would be possible to read the resistances of as many as 100 fixed resistors in a time interval of 1 second at a resolution much greater than 16 bits. The readout data would be processed, along with temperature calibration data, to deduce the strain on the printed-circuit board or other substrate in the areas around the resistors. It should also be possible to also deduce the temperature from the readings.

40 CFR 413.80 - Applicability: Description of the printed circuit board subcategory.

Code of Federal Regulations, 2010 CFR

2010-07-01

... 40 Protection of Environment 28 2010-07-01 2010-07-01 true Applicability: Description of the printed circuit board subcategory. 413.80 Section 413.80 Protection of Environment ENVIRONMENTAL PROTECTION AGENCY (CONTINUED) EFFLUENT GUIDELINES AND STANDARDS ELECTROPLATING POINT SOURCE CATEGORY Printed...

Self-shielding printed circuit boards for high frequency amplifiers and transmitters

NASA Technical Reports Server (NTRS)

Galvin, D.

1969-01-01

Printed circuit boards retaining as much copper as possible provide electromagnetic shielding between stages of the high frequency amplifiers and transmitters. Oscillation is prevented, spurious output signals are reduced, and multiple stages are kept isolated from each other, both thermally and electrically.

No-warp potted circuits

NASA Technical Reports Server (NTRS)

Robinson, W. W.

1979-01-01

Sponge inserts compensate for potting-compound expansion and relieve thermal stresses on circuit boards. Technique quality of production runs on PC boards intended for applications in environments less severe than those for aerospace equipment. Pads reduce weight of modules because they weigh far less than potting compound they displace.

78 FR 23591 - Certain Prepregs, Laminates, and Finished Circuit Boards

Federal Register 2010, 2011, 2012, 2013, 2014

2013-04-19

... INTERNATIONAL TRADE COMMISSION [Investigation No. 337-TA-659 (Enforcement)] Certain Prepregs... United States after importation of certain prepregs, laminates, and finished circuit boards that infringe... prepregs and laminates that are the subject of the investigation or that otherwise infringe, induce, and/or...

Beam forming network

NASA Technical Reports Server (NTRS)

Cramer, P. W., Jr. (Inventor)

1985-01-01

The network, which is connected to a layer of 134 feed elements that transmit and receive microwaves, consists of a pair of circuit boards parallel to the feed element layer. One of the two boards has 87 dividers that each divide a signal to be transmitted into seven portions, and the other board has 134 combiners that each collect seven transmit signal portions and deliver the sum to one of the feed elements. A similar arrangement is used to handle received signals. The large number of interconnections are made by printed circuit conductors radiating from each of the numerous dividers and combiners, and by providing interconnection pins that interconnect the ends of pairs of conductors lying on the two boards. The printed circuit conductors extend in undulating paths that provide maximum separation of conductors to minimize crosstalk.

The Development of an IMU Integrated Clothes for Postural Monitoring Using Conductive Yarn and Interconnecting Technology.

PubMed

Kang, Sung-Won; Choi, Hyeob; Park, Hyung-Il; Choi, Byoung-Gun; Im, Hyobin; Shin, Dongjun; Jung, Young-Giu; Lee, Jun-Young; Park, Hong-Won; Park, Sukyung; Roh, Jung-Sim

2017-11-07

Spinal disease is a common yet important condition that occurs because of inappropriate posture. Prevention could be achieved by continuous posture monitoring, but most measurement systems cannot be used in daily life due to factors such as burdensome wires and large sensing modules. To improve upon these weaknesses, we developed comfortable "smart wear" for posture measurement using conductive yarn for circuit patterning and a flexible printed circuit board (FPCB) for interconnections. The conductive yarn was made by twisting polyester yarn and metal filaments, and the resistance per unit length was about 0.05 Ω/cm. An embroidered circuit was made using the conductive yarn, which showed increased yield strength and uniform electrical resistance per unit length. Circuit networks of sensors and FPCBs for interconnection were integrated into clothes using a computer numerical control (CNC) embroidery process. The system was calibrated and verified by comparing the values measured by the smart wear with those measured by a motion capture camera system. Six subjects performed fixed movements and free computer work, and, with this system, we were able to measure the anterior/posterior direction tilt angle with an error of less than 4°. The smart wear does not have excessive wires, and its structure will be optimized for better posture estimation in a later study.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Maestas, J.H.

The Loopback Tester is an Intel SBC 86/12A Single Board Computer and an Intel SBC 534 Communications Expansion Board configured and programmed to perform various basic or less. These tests include: (1) Data Communications Equipment (DCE) transmit timing detection (2) data rate measurement (3) instantaneous loopback indication and (4) bit error rate testing. It requires no initial setup after plug in, and can be used to locate the source of communications loss in a circuit. It can also be used to determine when crypto variable mismatch problems are the source of communications loss. This report discusses the functionality of themore » Loopback Tester as a diagnostic device. It also discusses the hardware and software which implements this simple yet reliable device.« less

AUTOMATING THREE DIMENSIONAL (3D) MODEL CREATION OF CIRCUIT CARD ASSEMBLIES

DTIC Science & Technology

2017-07-01

are those of the author(s) and should not be construed as an official Department of the Army position, policy, or decision, unless so designated by...other documentation. The citation in this report of the names of commercial firms or commercially available products or services does not...document describes a method to export data from a printed wiring board computer-aided design (CAD) application and then import that data to a

An Exploratory Study of the Effect of Screen Size and Resolution on the Legibility of Graphics in Automated Job Performance Aids. Final Report.

ERIC Educational Resources Information Center

Dwyer, Daniel J.

Designed to assess the effect of alternative display (CRT) screen sizes and resolution levels on user ability to identify and locate printed circuit (PC) board points, this study is the first in a protracted research program on the legibility of graphics in computer-based job aids. Air Force maintenance training pipeline students (35 male and 1…

Teaching biomedical applications to secondary students.

PubMed

Openshaw, S; Fleisher, A; Ljunggren, C

1999-01-01

Certain aspects of biomedical engineering applications lend themselves well to experimentation that can be done by high school students. This paper describes two experiments done during a six-week summer internship program in which two high school students used electrodes, circuit boards, and computers to mimic a sophisticated heart monitor and also to control a robotic car. Our experience suggests that simple illustrations of complex instrumentation can be effective in introducing adolescents to the biomedical engineering field.

WDM package enabling high-bandwidth optical intrasystem interconnects for high-performance computer systems

NASA Astrophysics Data System (ADS)

Schrage, J.; Soenmez, Y.; Happel, T.; Gubler, U.; Lukowicz, P.; Mrozynski, G.

2006-02-01

From long haul, metro access and intersystem links the trend goes to applying optical interconnection technology at increasingly shorter distances. Intrasystem interconnects such as data busses between microprocessors and memory blocks are still based on copper interconnects today. This causes a bottleneck in computer systems since the achievable bandwidth of electrical interconnects is limited through the underlying physical properties. Approaches to solve this problem by embedding optical multimode polymer waveguides into the board (electro-optical circuit board technology, EOCB) have been reported earlier. The principle feasibility of optical interconnection technology in chip-to-chip applications has been validated in a number of projects. For reasons of cost considerations waveguides with large cross sections are used in order to relax alignment requirements and to allow automatic placement and assembly without any active alignment of components necessary. On the other hand the bandwidth of these highly multimodal waveguides is restricted due to mode dispersion. The advance of WDM technology towards intrasystem applications will provide sufficiently high bandwidth which is required for future high-performance computer systems: Assuming that, for example, 8 wavelength-channels with 12Gbps (SDR1) each are given, then optical on-board interconnects with data rates a magnitude higher than the data rates of electrical interconnects for distances typically found at today's computer boards and backplanes can be realized. The data rate will be twice as much, if DDR2 technology is considered towards the optical signals as well. In this paper we discuss an approach for a hybrid integrated optoelectronic WDM package which might enable the application of WDM technology to EOCB.

Testing of printed circuit board solder joints by optical correlation

NASA Technical Reports Server (NTRS)

Espy, P. N.

1975-01-01

An optical correlation technique for the nondestructive evaluation of printed circuit board solder joints was evaluated. Reliable indications of induced stress levels in solder joint lead wires are achievable. Definite relations between the inherent strength of a solder joint, with its associated ability to survive stress, are demonstrable.

Maze solving automatons for self-healing of open interconnects: Modular add-on for circuit boards

DOE Office of Scientific and Technical Information (OSTI.GOV)

Nair, Aswathi; Raghunandan, Karthik; Yaswant, Vaddi

We present the circuit board integration of a self-healing mechanism to repair open faults. The electric field driven mechanism physically restores fractured interconnects in electronic circuits and has the ability to solve mazes. The repair is performed by conductive particles dispersed in an insulating fluid. We demonstrate the integration of the healing module onto printed circuit boards and the ability of maze solving. We model and perform experiments on the influence of the geometry of conductive particles as well as the terminal impedances of the route on the healing efficiency. The typical heal rate is 10 μm/s with healed route havingmore » mean resistance of 8 kΩ across a 200 micron gap and depending on the materials and concentrations used.« less

Adaptive Signal Processing Testbed: VME-based DSP board market survey

NASA Astrophysics Data System (ADS)

Ingram, Rick E.

1992-04-01

The Adaptive Signal Processing Testbed (ASPT) is a real-time multiprocessor system utilizing digital signal processor technology on VMEbus based printed circuit boards installed on a Sun workstation. The ASPT has specific requirements, particularly as regards to the signal excision application, with respect to interfacing with current and planned data generation equipment, processing of the data, storage to disk of final and intermediate results, and the development tools for applications development and integration into the overall EW/COM computing environment. A prototype ASPT was implemented using three VME-C-30 boards from Applied Silicon. Experience gained during the prototype development led to the conclusions that interprocessor communications capability is the most significant contributor to overall ASPT performance. In addition, the host involvement should be minimized. Boards using different processors were evaluated with respect to the ASPT system requirements, pricing, and availability. Specific recommendations based on various priorities are made as well as recommendations concerning the integration and interaction of various tools developed during the prototype implementation.

Humidity Control in the U.S. Air Force Aircraft Service Shelter

DTIC Science & Technology

1988-06-30

printed circuit board control module , terminal boards, and blowt.r, etc.) are off-the-shelf commercial components. Only the humidifier ho:;Ift, I...indication of the shelter RH. - Circuit Breaker: A 20 amp, three pole breaker is providud fur equipment protection. o Water Storage Tank. A stainless...tapped into the shelter’s existing electrical system at the panelboard, on the load side of the 100 Amp main AC circuit breaker. Power is then

Direct Digital Boiler Control Systems for the Navy Small Boiler Equipment.

DTIC Science & Technology

1983-02-01

Hardware. Each full-size ACU a 6 caculation modules 30 arrme, modufes sation for dead time lag contains input/output circuit a 16 control mo uies a...along with lather modules of the DCS-1000 family. ’The complete instrument consists of plug-in circuit boards that allow easy Teplacement of a...Maintenance-Most systems indicate trouble areas with diagnostic routines or integral LED indicators so that circuit boards can be replaced to correct

Attachment method for stacked integrated circuit (IC) chips

DOEpatents

Bernhardt, Anthony F.; Malba, Vincent

1999-01-01

An attachment method for stacked integrated circuit (IC) chips. The method involves connecting stacked chips, such as DRAM memory chips, to each other and/or to a circuit board. Pads on the individual chips are rerouted to form pads on the side of the chip, after which the chips are stacked on top of each other whereby desired interconnections to other chips or a circuit board can be accomplished via the side-located pads. The pads on the side of a chip are connected to metal lines on a flexible plastic tape (flex) by anisotropically conductive adhesive (ACA). Metal lines on the flex are likewise connected to other pads on chips and/or to pads on a circuit board. In the case of a stack of DRAM chips, pads to corresponding address lines on the various chips may be connected to the same metal line on the flex to form an address bus. This method has the advantage of reducing the number of connections required to be made to the circuit board due to bussing; the flex can accommodate dimensional variation in the alignment of chips in the stack; bonding of the ACA is accomplished at low temperature and is otherwise simpler and less expensive than solder bonding; chips can be bonded to the ACA all at once if the sides of the chips are substantially coplanar, as in the case for stacks of identical chips, such as DRAM.

A compressed sensing X-ray camera with a multilayer architecture

NASA Astrophysics Data System (ADS)

Wang, Zhehui; Iaroshenko, O.; Li, S.; Liu, T.; Parab, N.; Chen, W. W.; Chu, P.; Kenyon, G. T.; Lipton, R.; Sun, K.-X.

2018-01-01

Recent advances in compressed sensing theory and algorithms offer new possibilities for high-speed X-ray camera design. In many CMOS cameras, each pixel has an independent on-board circuit that includes an amplifier, noise rejection, signal shaper, an analog-to-digital converter (ADC), and optional in-pixel storage. When X-ray images are sparse, i.e., when one of the following cases is true: (a.) The number of pixels with true X-ray hits is much smaller than the total number of pixels; (b.) The X-ray information is redundant; or (c.) Some prior knowledge about the X-ray images exists, sparse sampling may be allowed. Here we first illustrate the feasibility of random on-board pixel sampling (ROPS) using an existing set of X-ray images, followed by a discussion about signal to noise as a function of pixel size. Next, we describe a possible circuit architecture to achieve random pixel access and in-pixel storage. The combination of a multilayer architecture, sparse on-chip sampling, and computational image techniques, is expected to facilitate the development and applications of high-speed X-ray camera technology.

Using multiple sensors for printed circuit board insertion

NASA Technical Reports Server (NTRS)

Sood, Deepak; Repko, Michael C.; Kelley, Robert B.

1989-01-01

As more and more activities are performed in space, there will be a greater demand placed on the information handling capacity of people who are to direct and accomplish these tasks. A promising alternative to full-time human involvement is the use of semi-autonomous, intelligent robot systems. To automate tasks such as assembly, disassembly, repair and maintenance, the issues presented by environmental uncertainties need to be addressed. These uncertainties are introduced by variations in the computed position of the robot at different locations in its work envelope, variations in part positioning, and tolerances of part dimensions. As a result, the robot system may not be able to accomplish the desired task without the help of sensor feedback. Measurements on the environment allow real time corrections to be made to the process. A design and implementation of an intelligent robot system which inserts printed circuit boards into a card cage are presented. Intelligent behavior is accomplished by coupling the task execution sequence with information derived from three different sensors: an overhead three-dimensional vision system, a fingertip infrared sensor, and a six degree of freedom wrist-mounted force/torque sensor.

Logistics and Operational Effectiveness of the P-3 Aircraft.

DTIC Science & Technology

1977-03-01

Memory Module Tester for the AIMD at HAS Jacksonville Module Caddy utilization for the Position Indicator Failure rate and spares availability of the...into the P—3 aircraft • Investigated TRIAC failures in the AN/AQA-7(V) Sonar Computer Recorder Group • Identified and investigated incorrect use of...Magnetic Tape Transport: Replacement vacuum blower motors Piece parts for A7A1 circuit board • Investigated the availability of spare HI/LO Backward Wave

Advantages and Challenges of 10-Gbps Transmission on High-Density Interconnect Boards

NASA Astrophysics Data System (ADS)

Yee, Chang Fei; Jambek, Asral Bahari; Al-Hadi, Azremi Abdullah

2016-06-01

This paper provides a brief introduction to high-density interconnect (HDI) technology and its implementation on printed circuit boards (PCBs). The advantages and challenges of implementing 10-Gbps signal transmission on high-density interconnect boards are discussed in detail. The advantages (e.g., smaller via dimension and via stub removal) and challenges (e.g., crosstalk due to smaller interpair separation) of HDI are studied by analyzing the S-parameter, time-domain reflectometry (TDR), and transmission-line eye diagrams obtained by three-dimensional electromagnetic modeling (3DEM) and two-dimensional electromagnetic modeling (2DEM) using Mentor Graphics HyperLynx and Keysight Advanced Design System (ADS) electronic computer-aided design (ECAD) software. HDI outperforms conventional PCB technology in terms of signal integrity, but proper routing topology should be applied to overcome the challenge posed by crosstalk due to the tight spacing between traces.

Biodegradable materials for multilayer transient printed circuit boards.

PubMed

Huang, Xian; Liu, Yuhao; Hwang, Suk-Won; Kang, Seung-Kyun; Patnaik, Dwipayan; Cortes, Jonathan Fajardo; Rogers, John A

2014-11-19

Biodegradable printed circuit boards based on water-soluble materials are demonstrated. These systems can dissolve in water within 10 mins to yield end-products that are environmentally safe. These and related approaches have the potential to reduce hazardous waste streams associated with electronics disposal. © 2014 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

Circuit Board Analysis for Lead by Atomic Absorption Spectroscopy in a Course for Nonscience Majors

ERIC Educational Resources Information Center

Weidenhammer, Jeffrey D.

2007-01-01

A circuit board analysis of the atomic absorption spectroscopy, which is used to measure lead content in a course for nonscience majors, is being presented. The experiment can also be used to explain the potential environmental hazards of unsafe disposal of various used electronic equipments.

Testing Services

NASA Technical Reports Server (NTRS)

1993-01-01

Trace Laboratories is an independent testing laboratory specializing in testing printed circuit boards, automotive products and military hardware. Technical information from NASA Tech Briefs and two subsequent JPL Technical Support packages have assisted Trace in testing surface insulation resistance on printed circuit board materials. Testing time was reduced and customer service was improved because of Jet Propulsion Laboratory technical support packages.

An Integer Programming-Based Generalized Vehicle Routing Approach for Printed Circuit Board Assembly Optimization

ERIC Educational Resources Information Center

Seth, Anupam

2009-01-01

Production planning and scheduling for printed circuit, board assembly has so far defied standard operations research approaches due to the size and complexity of the underlying problems, resulting in unexploited automation flexibility. In this thesis, the increasingly popular collect-and-place machine configuration is studied and the assembly…

78 FR 75360 - Notice of Issuance of Final Determination Concerning Certain Ethernet Switches

Federal Register 2010, 2011, 2012, 2013, 2014

2013-12-11

... printed circuit board assembly (``PCBA''), chassis, top cover, power supply, and fans. The switches... printed circuit board is populated with various electronic components to make a PCBA. 2. The PCBA is... Singapore. You argue that without the EOS software, the units exported from Singapore lack the intelligence...

RGB-Stack Light Emitting Diode Modules with Transparent Glass Circuit Board and Oil Encapsulation

PubMed Central

Li, Ying-Chang; Chang, Yuan-Hsiao; Singh, Preetpal; Chang, Liann-Be; Yeh, Der-Hwa; Chao, Ting-Yu; Jian, Si-Yun; Li, Yu-Chi; Lai, Chao-Sung; Ying, Shang-Ping

2018-01-01

The light emitting diode (LED) is widely used in modern solid-state lighting applications, and its output efficiency is closely related to the submounts’ material properties. Most submounts used today, such as low-power printed circuit boards (PCBs) or high-power metal core printed circuit boards (MCPCBs), are not transparent and seriously decrease the output light extraction. To meet the requirements of high light output and better color mixing, a three-dimensional (3-D) stacked flip-chip (FC) LED module is proposed and demonstrated. To realize light penetration and mixing, the mentioned 3-D vertically stacking RGB LEDs use transparent glass as FC package submounts called glass circuit boards (GCB). Light emitted from each GCB stacked LEDs passes through each other and thus exhibits good output efficiency and homogeneous light-mixing characteristics. In this work, the parasitic problem of heat accumulation, which caused by the poor thermal conductivity of GCB and leads to a serious decrease in output efficiency, is solved by a proposed transparent cooling oil encapsulation (OCP) method. PMID:29494534

RGB-Stack Light Emitting Diode Modules with Transparent Glass Circuit Board and Oil Encapsulation.

PubMed

Li, Ying-Chang; Chang, Yuan-Hsiao; Singh, Preetpal; Chang, Liann-Be; Yeh, Der-Hwa; Chao, Ting-Yu; Jian, Si-Yun; Li, Yu-Chi; Tan, Cher Ming; Lai, Chao-Sung; Chow, Lee; Ying, Shang-Ping

2018-03-01

The light emitting diode (LED) is widely used in modern solid-state lighting applications, and its output efficiency is closely related to the submounts' material properties. Most submounts used today, such as low-power printed circuit boards (PCBs) or high-power metal core printed circuit boards (MCPCBs), are not transparent and seriously decrease the output light extraction. To meet the requirements of high light output and better color mixing, a three-dimensional (3-D) stacked flip-chip (FC) LED module is proposed and demonstrated. To realize light penetration and mixing, the mentioned 3-D vertically stacking RGB LEDs use transparent glass as FC package submounts called glass circuit boards (GCB). Light emitted from each GCB stacked LEDs passes through each other and thus exhibits good output efficiency and homogeneous light-mixing characteristics. In this work, the parasitic problem of heat accumulation, which caused by the poor thermal conductivity of GCB and leads to a serious decrease in output efficiency, is solved by a proposed transparent cooling oil encapsulation (OCP) method.

[Characterization of pyrolysis of waste printed circuit boards by high-resolution pyrolysis gas chromatography-mass spectrometry].

PubMed

Zhang, Yanhong; Huang, Hong; Xia, Zhengbin; Chen, Huanqin

2008-07-01

Thermal degradation of pyrolysis of waste circuit boards was investigated by high-resolution pyrolysis gas chromatography-mass spectrometry (PyGC-MS) and thermogravimetry (TG). In helium atmosphere, the products of FR-4 waste printed circuit board were pyrolyzed at 350, 450, 550, 650, and 750 degrees degrees C, separately, and the pyrolysis products were identified by online MS. The results indicated that the pyrolysis products of the FR-4 waste circuit board were three kinds of substances, such as the low boiling point products, phenol, bisphenol and their related products. Moreover, under 300 degrees degrees C, only observed less pyrolysis products. As the increase of pyrolysis temperature, the relative content of the low boiling point products increased. In the range of 450-650 degrees degrees C, the qualitative analysis and character were similar, and the relative contents of phenol and bisphenol were higher. The influence of pyrolysis temperature on pyrolyzate yields was studied. On the basis of the pyrolyzate profile and the dependence of pyrolyzate yields on pyrolysis temperature, the thermal degradation mechanism of brominated epoxy resin was proposed.

Physics Notes.

ERIC Educational Resources Information Center

School Science Review, 1980

1980-01-01

Outlines a variety of laboratory procedures, discussions, and demonstrations including a no-solder circuit board, damped to maintained oscillations with L-C circuits, polaroid strobe photos, resistive putty, soldering and circuit checking exercise, electromagnetic radiation, square pulses in C-R circuits, and testing an oscillating system. (GS)

Sampling and Control Circuit Board for an Inertial Measurement Unit

NASA Technical Reports Server (NTRS)

Chelmins, David; Powis, Rick

2012-01-01

Spacesuit navigation is one component of NASA s efforts to return humans to the Moon. Studies performed at the NASA Glenn Research Center (GRC) considered various navigation technologies and filtering approaches to enable navigation on the lunar surface. As part of this effort, microelectromechanical systems (MEMS) inertial measurement units (IMUs) were studied to determine if they could supplement a radiometric infrastructure. MEMS IMUs were included in the Lunar Extra-Vehicular Activity Crewmember Location Determination System (LECLDS) testbed during NASA s annual Desert Research and Technology Studies (D-RATS) event in 2009 and 2010. The testbed included one IMU in 2009 and three IMUs in 2010, along with a custom circuit board interfacing between the navigation processor and each IMU. The board was revised for the 2010 test, and this paper documents the design details of this latest revision of the interface circuit board and firmware.

Pressure-Sensor Assembly Technique

NASA Technical Reports Server (NTRS)

Pruzan, Daniel A.

2003-01-01

Nielsen Engineering & Research (NEAR) recently developed an ultrathin data acquisition system for use in turbomachinery testing at NASA Glenn Research Center. This system integrates a microelectromechanical- systems- (MEMS-) based absolute pressure sensor [0 to 50 psia (0 to 345 kPa)], temperature sensor, signal-conditioning application-specific integrated circuit (ASIC), microprocessor, and digital memory into a package which is roughly 2.8 in. (7.1 cm) long by 0.75 in. (1.9 cm) wide. Each of these components is flip-chip attached to a thin, flexible circuit board and subsequently ground and polished to achieve a total system thickness of 0.006 in. (0.15 mm). Because this instrument is so thin, it can be quickly adhered to any surface of interest where data can be collected without disrupting the flow being investigated. One issue in the development of the ultrathin data acquisition system was how to attach the MEMS pressure sensor to the circuit board in a manner which allowed the sensor s diaphragm to communicate with the ambient fluid while providing enough support for the chip to survive the grinding and polishing operations. The technique, developed by NEAR and Jabil Technology Services Group (San Jose, CA), is described below. In the approach developed, the sensor is attached to the specially designed circuit board, see Figure 1, using a modified flip-chip technique. The circular diaphragm on the left side of the sensor is used to actively measure the ambient pressure, while the diaphragm on the right is used to compensate for changes in output due to temperature variations. The circuit board is fabricated with an access hole through it so that when the completed system is installed onto a wind tunnel model (chip side down), the active diaphragm is exposed to the environment. After the sensor is flip-chip attached to the circuit board, the die is underfilled to support the chip during the subsequent grinding and polishing operations. To prevent this underfill material from getting onto the sensor s diaphragms, the circuit board is fabricated with two 25- micrometer-tall polymer rings, sized so that the diaphragms fit inside the rings once the chip is attached.

Double sided circuit board and a method for its manufacture

DOEpatents

Lindenmeyer, Carl W.

1989-01-01

Conductance between the sides of a large double sided printed circuit board is provided using a method which eliminates the need for chemical immersion or photographic exposure of the entire large board. A plurality of through-holes are drilled or punched in a substratum according to the desired pattern, conductive laminae are made to adhere to both sides of the substratum covering the holes and the laminae are pressed together and permanently joined within the holes, providing conductive paths.

Double sided circuit board and a method for its manufacture

DOEpatents

Lindenmeyer, C.W.

1988-04-14

Conductance between the sides of a large double sided printed circuit board is provided using a method which eliminates the need for chemical immersion or photographic exposure of the entire large board. A plurality of through-holes are drilled or punched in a substratum according to the desired pattern, conductive laminae are made to adhere to both sides of the substratum covering the holes and the laminae are pressed together and permanently joined within the holes, providing conductive paths. 4 figs.

Double sided circuit board and a method for its manufacture

DOEpatents

Lindenmeyer, Carl W.

1989-07-04

Conductance between the sides of a large double sided printed circuit board is provided using a method which eliminates the need for chemical immersion or photographic exposure of the entire large board. A plurality of through-holes are drilled or punched in a substratum according to the desired pattern, conductive laminae are made to adhere to both sides of the substratum covering the holes and the laminae are pressed together and permanently joined within the holes, providing conductive paths.

Circuit board routing attachment for Fermilab Gerber plotter

DOE Office of Scientific and Technical Information (OSTI.GOV)

Lindenmeyer, C.

1984-05-10

A new and potentially important method of producing large circuit boards has been developed at Fermilab. A Gerber Flat Bed Plotter with an active area of 5' x 16' has been fitted with a machining head to produce a circuit board without the use of photography or chemicals. The modifications of the Gerber Plotter do not impair its use as a photoplotter or pen plotter, the machining head is merely exchanged with the standard attachments. The modifications to the program are minimal; this will be described in another report. The machining head is fitted with an air bearing motorized spindlemore » driven at a speed of 40,000 rpm to 90,000 rpm. The spindle also is provided with air bearings on its outside diameter, offering frictionless vertical travel guidance. Vertical travel of the spindle is driven by a spring return single acting air cylinder. An adjustable hydraulic damper slows the spindle travel near the end of its downward stroke. Two programmable stops control spindle down stroke position, and limit switches are provided for position feedback to the control system. A vacuum system collects chips at the cutter head. No lubrication or regular maintenance is required. The circuit board to be fabricated is supported on a porous plastic mat which allows table vacuum to hold the board in place while allowing the cutters or drills to cut through the board without damaging the rubber platen of the plotter. The perimeter of the board must be covered to the limits of the table vacuum area used to prevent excessive leakage.« less

Glass Fibers for Printed Circuit Boards

NASA Astrophysics Data System (ADS)

Longobardo, Anthony V.

Fiberglass imparts numerous positive benefits to modern printed circuit boards. Reinforced laminate composites have an excellent cost-performance relationship that makes sense for most applications. At the leading edge of the technology, new glass fibers with improved properties, in combination with the best resin systems available, are able to meet very challenging performance, cost, and regulatory demands while remaining manufacturable.

Printed-Circuit-Board Soldering Training for Group IV Personnel.

ERIC Educational Resources Information Center

Hooprich, E. A.; Matlock, E. W.

As part of a larger program to determine which Navy skills can be learned by lower aptitude personnel, and which methods and techniques would be most effective, an experimental course in printed circuit board soldering was given to 186 Group IV students in 13 classes. Two different training approaches--one stressing instructor guidance and the…

The Development of an IMU Integrated Clothes for Postural Monitoring Using Conductive Yarn and Interconnecting Technology

PubMed Central

Kang, Sung-Won; Park, Hyung-Il; Choi, Byoung-Gun; Shin, Dongjun; Jung, Young-Giu; Lee, Jun-Young; Park, Hong-Won; Park, Sukyung

2017-01-01

Spinal disease is a common yet important condition that occurs because of inappropriate posture. Prevention could be achieved by continuous posture monitoring, but most measurement systems cannot be used in daily life due to factors such as burdensome wires and large sensing modules. To improve upon these weaknesses, we developed comfortable “smart wear” for posture measurement using conductive yarn for circuit patterning and a flexible printed circuit board (FPCB) for interconnections. The conductive yarn was made by twisting polyester yarn and metal filaments, and the resistance per unit length was about 0.05 Ω/cm. An embroidered circuit was made using the conductive yarn, which showed increased yield strength and uniform electrical resistance per unit length. Circuit networks of sensors and FPCBs for interconnection were integrated into clothes using a computer numerical control (CNC) embroidery process. The system was calibrated and verified by comparing the values measured by the smart wear with those measured by a motion capture camera system. Six subjects performed fixed movements and free computer work, and, with this system, we were able to measure the anterior/posterior direction tilt angle with an error of less than 4°. The smart wear does not have excessive wires, and its structure will be optimized for better posture estimation in a later study. PMID:29112125

Detection of Banned and Restricted Ozone-Depleting Chemicals in Printed Circuit Boards

DOE Office of Scientific and Technical Information (OSTI.GOV)

Lee, Richard N.; Wright, Bob W.

2008-12-01

A study directed toward the detection of halogenated solvents in the matrix of circuit boards has recently been completed. This work was undertaken to demonstrate the potential for reliable detection of solvents used during the fabrication of printed circuit boards (PCB). Since many of these solvents are now, or soon will be, restricted under the terms of legislation enacted in response to the Montreal Protocol and other international agreements, the work described here, conducted over a period of more that 4 years, has provided guidance for the development of chromatographic system and analytical protocol to assure compliance with regulations introducedmore » to control, or ban, industrial solvents associated with adverse environmental impact.« less

Attachment method for stacked integrated circuit (IC) chips

DOEpatents

Bernhardt, A.F.; Malba, V.

1999-08-03

An attachment method for stacked integrated circuit (IC) chips is disclosed. The method involves connecting stacked chips, such as DRAM memory chips, to each other and/or to a circuit board. Pads on the individual chips are rerouted to form pads on the side of the chip, after which the chips are stacked on top of each other whereby desired interconnections to other chips or a circuit board can be accomplished via the side-located pads. The pads on the side of a chip are connected to metal lines on a flexible plastic tape (flex) by anisotropically conductive adhesive (ACA). Metal lines on the flex are likewise connected to other pads on chips and/or to pads on a circuit board. In the case of a stack of DRAM chips, pads to corresponding address lines on the various chips may be connected to the same metal line on the flex to form an address bus. This method has the advantage of reducing the number of connections required to be made to the circuit board due to bussing; the flex can accommodate dimensional variation in the alignment of chips in the stack; bonding of the ACA is accomplished at low temperature and is otherwise simpler and less expensive than solder bonding; chips can be bonded to the ACA all at once if the sides of the chips are substantially coplanar, as in the case for stacks of identical chips, such as DRAM. 12 figs.

Planned development of a 3D computer based on free-space optical interconnects

NASA Astrophysics Data System (ADS)

Neff, John A.; Guarino, David R.

1994-05-01

Free-space optical interconnection has the potential to provide upwards of a million data channels between planes of electronic circuits. This may result in the planar board and backplane structures of today giving away to 3-D stacks of wafers or multi-chip modules interconnected via channels running perpendicular to the processor planes, thereby eliminating much of the packaging overhead. Three-dimensional packaging is very appealing for tightly coupled fine-grained parallel computing where the need for massive numbers of interconnections is severely taxing the capabilities of the planar structures. This paper describes a coordinated effort by four research organizations to demonstrate an operational fine-grained parallel computer that achieves global connectivity through the use of free space optical interconnects.

Interface Circuit Board For Space-Shuttle Communications

NASA Technical Reports Server (NTRS)

Parrish, Brett T.

1995-01-01

Report describes interface electronic circuit developed to enable ground controllers to send commands and data via Ku-band radio uplink to multiple circuits connected to standard IEEE-488 general-purpose interface bus in space shuttle. Design of circuit extends data-throughput capability of communication system.

Medical Equipment Tele- and Condition-Based Maintenance with Enhanced Remote Diagnostic Access (RDA) and Computer Vision

DTIC Science & Technology

2010-04-01

failing to comply with a collection of information if it does not display a currently valid OMB control number. 1. REPORT DATE APR 2010 2. REPORT...The second is a ‘mechanical’ part that is controlled by circuit boards and is accessible by the technician via the serial console and running...was the use of conventional remote access solution designed for telecommuters or teleworkers in the Information Technology (IT) world, such as a

Implementation of Wireless Input Methods (Game Controllers and Accelerometers) for Simulated Weapon Trigger Fire in the Computer Assisted Rehabilitation Environment (CAREN)

DTIC Science & Technology

2013-08-22

software. Using this weapon, two ways of sending trigger fire response to the D-Flow software were proposed. One was to integrate a wireless game...Logitech International, S.A., Romanel-sur- Morges, Switzerland) and the Xbox 360 wireless controller for Windows (Microsoft, Redmond, WA). The circuit board...power on and off the game controller so that the batteries do not drain (though these devices will time out after approximately 10 minutes of

Portable Speech Synthesizer

NASA Technical Reports Server (NTRS)

Leibfritz, Gilbert H.; Larson, Howard K.

1987-01-01

Compact speech synthesizer useful traveling companion to speech-handicapped. User simply enters statement on board, and synthesizer converts statement into spoken words. Battery-powered and housed in briefcase, easily carried on trips. Unit used on telephones and face-to-face communication. Synthesizer consists of micro-computer with memory-expansion module, speech-synthesizer circuit, batteries, recharger, dc-to-dc converter, and telephone amplifier. Components, commercially available, fit neatly in 17-by 13-by 5-in. briefcase. Weighs about 20 lb (9 kg) and operates and recharges from ac receptable.

System Measures Pressures Aboard A Compressor Rotor

NASA Technical Reports Server (NTRS)

Freedman, Robert J.; Senyitko, Richard G.; Blumenthal, Philip Z.

1994-01-01

Rotating pressure-measuring instrumentation includes on-board calibration standard. Computer-controlled, multichannel instrumentation system acquires pressure measurements from sensors mounted in 1.52-m-diameter rotor of compressor. Includes 5 miniature, electronically scanned pressure (ESP) modules, each containing 48 piezoresistive pressure sensors, pneumatic calibration valve, and electronic circuits for addressing and amplifying output of each sensor. Modules mounted on centerline of rotor, on instrumentation tower located inside nose cone of rotor. Subsystem designed to convert analog signal to distinct frequency without significantly affecting accuracy.

Computer Programs for Prediction of Lightning Induced Voltages in Aircraft Electrical Circuits

DTIC Science & Technology

1975-04-01

8217-Mnnmn " ■*> i ■ : mmmmim*mmemmmMmmmmmam*t*ammi m ■■>■ ■ ,-,.->»^~—~—-. ■ - m^m Test techniques and equipment have been designed for subjecting com...are still on the drawing board, when there is as yet no aircraft on which to run tests . To fulfill this need, a program was initiated by the Air...aluated by full-scale simulated lightning tests of the external assemblies in question. Government specifications for some of these devices or

KSC-03pd1137

NASA Image and Video Library

2003-04-15

KENNEDY SPACE CENTER, FLA. -- In the Payload Hazardous Servicing Facility, the lander petals of the Mars Exploration Rover 2 (MER-2) have been reopened to allow technicians access to one of the spacecraft's circuit boards. A concern arose during prelaunch testing regarding how the spacecraft interprets signals sent from its main computer to peripherals in the cruise stage, lander and small deep space transponder. The MER Mission consists of two identical rovers set to launch in June 2003. The problem will be fixed on both rovers.

KSC-03pd1135

NASA Image and Video Library

2003-04-15

KENNEDY SPACE CENTER, FLA. -- In the Payload Hazardous Servicing Facility, technicians reopen the lander petals of the Mars Exploration Rover 2 (MER-2) to allow access to one of the spacecraft's circuit boards. A concern arose during prelaunch testing regarding how the spacecraft interprets signals sent from its main computer to peripherals in the cruise stage, lander and small deep space transponder. The MER Mission consists of two identical rovers set to launch in June 2003. The problem will be fixed on both rovers.

KSC-03pd1136

NASA Image and Video Library

2003-04-15

KENNEDY SPACE CENTER, FLA. -- In the Payload Hazardous Servicing Facility, technicians reopen the lander petals of the Mars Exploration Rover 2 (MER-2) to allow access to one of the spacecraft's circuit boards. A concern arose during prelaunch testing regarding how the spacecraft interprets signals sent from its main computer to peripherals in the cruise stage, lander and small deep space transponder. The MER Mission consists of two identical rovers set to launch in June 2003. The problem will be fixed on both rovers.

High stability amplifier

NASA Technical Reports Server (NTRS)

Adams, W. A.; Reinhardt, V. S. (Inventor)

1983-01-01

An electrical RF signal amplifier for providing high temperature stability and RF isolation and comprised of an integrated circuit voltage regulator, a single transistor, and an integrated circuit operational amplifier mounted on a circuit board such that passive circuit elements are located on side of the circuit board while the active circuit elements are located on the other side is described. The active circuit elements are embedded in a common heat sink so that a common temperature reference is provided for changes in ambient temperature. The single transistor and operational amplifier are connected together to form a feedback amplifier powered from the voltage regulator with transistor implementing primarily the desired signal gain while the operational amplifier implements signal isolation. Further RF isolation is provided by the voltage regulator which inhibits cross-talk from other like amplifiers powered from a common power supply. Input and output terminals consisting of coaxial connectors are located on the sides of a housing in which all the circuit components and heat sink are located.

All-semiconductor metamaterial-based optical circuit board at the microscale

DOE Office of Scientific and Technical Information (OSTI.GOV)

Min, Li; Huang, Lirong, E-mail: lrhuang@hust.edu.cn

2015-07-07

The newly introduced metamaterial-based optical circuit, an analogue of electronic circuit, is becoming a forefront topic in the fields of electronics, optics, plasmonics, and metamaterials. However, metals, as the commonly used plasmonic elements in an optical circuit, suffer from large losses at the visible and infrared wavelengths. We propose here a low-loss, all-semiconductor metamaterial-based optical circuit board at the microscale by using interleaved intrinsic GaAs and doped GaAs, and present the detailed design process for various lumped optical circuit elements, including lumped optical inductors, optical capacitors, optical conductors, and optical insulators. By properly combining these optical circuit elements and arrangingmore » anisotropic optical connectors, we obtain a subwavelength optical filter, which can always hold band-stop filtering function for various polarization states of the incident electromagnetic wave. All-semiconductor optical circuits may provide a new opportunity in developing low-power and ultrafast components and devices for optical information processing.« less

Microfabricated field calibration assembly for analytical instruments

DOEpatents

Robinson, Alex L [Albuquerque, NM; Manginell, Ronald P [Albuquerque, NM; Moorman, Matthew W [Albuquerque, NM; Rodacy, Philip J [Albuquerque, NM; Simonson, Robert J [Cedar Crest, NM

2011-03-29

A microfabricated field calibration assembly for use in calibrating analytical instruments and sensor systems. The assembly comprises a circuit board comprising one or more resistively heatable microbridge elements, an interface device that enables addressable heating of the microbridge elements, and, in some embodiments, a means for positioning the circuit board within an inlet structure of an analytical instrument or sensor system.

Treatment of Wastewater from Electroplating, Metal Finishing and Printed Circuit Board Manufacturing. Operation of Wastewater Treatment Plants Volume 4.

ERIC Educational Resources Information Center

California State Univ., Sacramento. Dept. of Civil Engineering.

One of four manuals dealing with the operation of wastewater plants, this document was designed to address the treatment of wastewater from electroplating, metal finishing, and printed circuit board manufacturing. It emphasizes how to operate and maintain facilities which neutralize acidic and basic waters; treat waters containing metals; destroy…

Projects made with the Berkeley Lab Circuit Board

Science.gov Websites

dependence of cosmic rays. Greg Poe, a student at Travis High School in Richmond, Texas, received an the journal Physics Education. He used the Berkeley Lab circuit board together with spare parts from New York Schools Cosmic Particle Telescope workshop. Ken Cecire has created a web page which describes

[Newly leaching method of copper from waste print circuit board using hydrochloric acid/n-butylamine/copper sulfate].

PubMed

Wang, Hong-Yan; Cui, Zhao-Jie; Yao, Ya-Wei

2010-12-01

A newly leaching method of copper from waste print circuit board was established by using hydrochloric acid-n-butylamine-copper sulfate mixed solution. The conditions of leaching were optimized by changing the hydrochloric acid, n-butylamine, copper sulfate,temperature and other conditions using copper as target mimics. The results indicated that copper could be leached completely after 8 h at 50 degrees C, hydrochloric acid concentration of 1.75 mol/L, n-butylamine concentration of 0.25 mol/L, and copper sulfate mass of 0.96 g. Under the conditions, copper leaching rates in waste print circuit board samples was up to 95.31% after 9 h. It has many advantages such as better effects, low cost, mild reaction conditions, leaching solution recycling.

Coaxial connector for use with printed circuit board edge connector

DOEpatents

Howard, Donald R.; MacGill, Robert A.

1989-01-01

A coaxial cable connector for interfacing with an edge connector for a printed circuit board whereby a coaxial cable can be interconnected with a printed circuit board through the edge connector. The coaxial connector includes a body having two leg portions extending from one side for receiving the edge connector therebetween, and a tubular portion extending from an opposing side for receiving a coaxial cable. A cavity within the body receives a lug of the edge connector and the center conductor of the coaxial cable. Adjacent lugs of the edge connector can be bend around the edge connector housing to function as spring-loaded contacts for receiving the coaxial connector. The lugs also function to facilitate shielding of the center conductor where fastened to the edge connector lug.

Multi-Modulator for Bandwidth-Efficient Communication

NASA Technical Reports Server (NTRS)

Gray, Andrew; Lee, Dennis; Lay, Norman; Cheetham, Craig; Fong, Wai; Yeh, Pen-Shu; King, Robin; Ghuman, Parminder; Hoy, Scott; Fisher, Dave

2009-01-01

A modulator circuit board has recently been developed to be used in conjunction with a vector modulator to generate any of a large number of modulations for bandwidth-efficient radio transmission of digital data signals at rates than can exceed 100 Mb/s. The modulations include quadrature phaseshift keying (QPSK), offset quadrature phase-shift keying (OQPSK), Gaussian minimum-shift keying (GMSK), and octonary phase-shift keying (8PSK) with square-root raised-cosine pulse shaping. The figure is a greatly simplified block diagram showing the relationship between the modulator board and the rest of the transmitter. The role of the modulator board is to encode the incoming data stream and to shape the resulting pulses, which are fed as inputs to the vector modulator. The combination of encoding and pulse shaping in a given application is chosen to maximize the bandwidth efficiency. The modulator board includes gallium arsenide serial-to-parallel converters at its input end. A complementary metal oxide/semiconductor (CMOS) field-programmable gate array (FPGA) performs the coding and modulation computations and utilizes parallel processing in doing so. The results of the parallel computation are combined and converted to pulse waveforms by use of gallium arsenide parallel-to-serial converters integrated with digital-to-analog converters. Without changing the hardware, one can configure the modulator to produce any of the designed combinations of coding and modulation by loading the appropriate bit configuration file into the FPGA.

78 FR 57648 - Notice of Issuance of Final Determination Concerning Video Teleconferencing Server

Federal Register 2010, 2011, 2012, 2013, 2014

2013-09-19

... the Chinese- origin Video Board and the Filter Board, impart the essential character to the video... includes the codec; a network filter electronic circuit board (``Filter Board''); a housing case; a power... (``Linux software''). The Linux software allows the Filter Board to inspect each Ethernet packet of...

Development of an ADC radiation tolerance characterization system for the upgrade of the ATLAS LAr calorimeter

DOE Office of Scientific and Technical Information (OSTI.GOV)

Liu, Hong-Bin; Chen, Hu-Cheng; Chen, Kai

ATLAS LAr calorimeter will undergo its Phase-I upgrade during the long shutdown (LS2) in 2018, and a new LAr Trigger Digitizer Board (LTDB) will be designed and installed. Several commercial-off-the-shelf (COTS) multi-channel high-speed ADCs have been selected as possible backups of the radiation tolerant ADC ASICs for the LTDB. Here, to evaluate the radiation tolerance of these backup commercial ADCs, we developed an ADC radiation tolerance characterization system, which includes the ADC boards, data acquisition (DAQ) board, signal generator, external power supplies and a host computer. The ADC board is custom designed for different ADCs, with ADC drivers and clockmore » distribution circuits integrated on board. The Xilinx ZC706 FPGA development board is used as a DAQ board. The data from the ADC are routed to the FPGA through the FMC (FPGA Mezzanine Card) connector, de-serialized and monitored by the FPGA, and then transmitted to the host computer through the Gigabit Ethernet. A software program has been developed with Python, and all the commands are sent to the DAQ board through Gigabit Ethernet by this program. Two ADC boards have been designed for the ADC, ADS52J90 from Texas Instruments and AD9249 from Analog Devices respectively. TID tests for both ADCs have been performed at BNL, and an SEE test for the ADS52J90 has been performed at Massachusetts General Hospital (MGH). Test results have been analyzed and presented. The test results demonstrate that this test system is very versatile, and works well for the radiation tolerance characterization of commercial multi-channel high-speed ADCs for the upgrade of the ATLAS LAr calorimeter. It is applicable to other collider physics experiments where radiation tolerance is required as well.« less

Development of an ADC radiation tolerance characterization system for the upgrade of the ATLAS LAr calorimeter

DOE PAGES

Liu, Hong-Bin; Chen, Hu-Cheng; Chen, Kai; ...

2017-02-01

ATLAS LAr calorimeter will undergo its Phase-I upgrade during the long shutdown (LS2) in 2018, and a new LAr Trigger Digitizer Board (LTDB) will be designed and installed. Several commercial-off-the-shelf (COTS) multi-channel high-speed ADCs have been selected as possible backups of the radiation tolerant ADC ASICs for the LTDB. Here, to evaluate the radiation tolerance of these backup commercial ADCs, we developed an ADC radiation tolerance characterization system, which includes the ADC boards, data acquisition (DAQ) board, signal generator, external power supplies and a host computer. The ADC board is custom designed for different ADCs, with ADC drivers and clockmore » distribution circuits integrated on board. The Xilinx ZC706 FPGA development board is used as a DAQ board. The data from the ADC are routed to the FPGA through the FMC (FPGA Mezzanine Card) connector, de-serialized and monitored by the FPGA, and then transmitted to the host computer through the Gigabit Ethernet. A software program has been developed with Python, and all the commands are sent to the DAQ board through Gigabit Ethernet by this program. Two ADC boards have been designed for the ADC, ADS52J90 from Texas Instruments and AD9249 from Analog Devices respectively. TID tests for both ADCs have been performed at BNL, and an SEE test for the ADS52J90 has been performed at Massachusetts General Hospital (MGH). Test results have been analyzed and presented. The test results demonstrate that this test system is very versatile, and works well for the radiation tolerance characterization of commercial multi-channel high-speed ADCs for the upgrade of the ATLAS LAr calorimeter. It is applicable to other collider physics experiments where radiation tolerance is required as well.« less

Development of an ADC radiation tolerance characterization system for the upgrade of the ATLAS LAr calorimeter

NASA Astrophysics Data System (ADS)

Liu, Hong-Bin; Chen, Hu-Cheng; Chen, Kai; Kierstead, James; Lanni, Francesco; Takai, Helio; Jin, Ge

2017-02-01

ATLAS LAr calorimeter will undergo its Phase-I upgrade during the long shutdown (LS2) in 2018, and a new LAr Trigger Digitizer Board (LTDB) will be designed and installed. Several commercial-off-the-shelf (COTS) multi-channel high-speed ADCs have been selected as possible backups of the radiation tolerant ADC ASICs for the LTDB. To evaluate the radiation tolerance of these backup commercial ADCs, we developed an ADC radiation tolerance characterization system, which includes the ADC boards, data acquisition (DAQ) board, signal generator, external power supplies and a host computer. The ADC board is custom designed for different ADCs, with ADC drivers and clock distribution circuits integrated on board. The Xilinx ZC706 FPGA development board is used as a DAQ board. The data from the ADC are routed to the FPGA through the FMC (FPGA Mezzanine Card) connector, de-serialized and monitored by the FPGA, and then transmitted to the host computer through the Gigabit Ethernet. A software program has been developed with Python, and all the commands are sent to the DAQ board through Gigabit Ethernet by this program. Two ADC boards have been designed for the ADC, ADS52J90 from Texas Instruments and AD9249 from Analog Devices respectively. TID tests for both ADCs have been performed at BNL, and an SEE test for the ADS52J90 has been performed at Massachusetts General Hospital (MGH). Test results have been analyzed and presented. The test results demonstrate that this test system is very versatile, and works well for the radiation tolerance characterization of commercial multi-channel high-speed ADCs for the upgrade of the ATLAS LAr calorimeter. It is applicable to other collider physics experiments where radiation tolerance is required as well. Supported by the U. S. Department of Energy (DE-SC001270)

An Approach for Practical Use of Common-Mode Noise Reduction Technique for In-Vehicle Electronic Equipment

NASA Astrophysics Data System (ADS)

Uno, Takanori; Ichikawa, Kouji; Mabuchi, Yuichi; Nakamura, Atsushi; Okazaki, Yuji; Asai, Hideki

In this paper, we studied the use of common-mode noise reduction technique for in-vehicle electronic equipment in an actual instrument design. We have improved the circuit model of the common-mode noise that flows to the wire harness to add the effect of a bypass capacitor located near the LSI. We analyzed the improved circuit model using a circuit simulator and verified the effectiveness of the noise reduction condition derived from the circuit model. It was also confirmed that offsetting the impedance mismatch in the PCB section requires to make a circuit constant larger than that necessary for doing the impedance mismatch in the LSI section. An evaluation circuit board comprising an automotive microcomputer was prototyped to experiment on the common-mode noise reduction effect of the board. The experimental results showed the noise reduction effect of the board. The experimental results also revealed that the degree of impedance mismatch in the LSI section can be estimated by using a PCB having a known impedance. We further inquired into the optimization of impedance parameters, which is difficult for actual products at present. To satisfy the noise reduction condition composed of numerous parameters, we proposed a design method using an optimization algorithm and an electromagnetic field simulator, and confirmed its effectiveness.

Networked Rectenna Array for Smart Material Actuators

NASA Technical Reports Server (NTRS)

Choi, Sang H.; Golembiewski, Walter T.; Song, Kyo D.

2000-01-01

The concept of microwave-driven smart material actuators is envisioned as the best option to alleviate the complexity associated with hard-wired control circuitry. Networked rectenna patch array receives and converts microwave power into a DC power for an array of smart actuators. To use microwave power effectively, the concept of a power allocation and distribution (PAD) circuit is adopted for networking a rectenna/actuator patch array. The PAD circuit is imbedded into a single embodiment of rectenna and actuator array. The thin-film microcircuit embodiment of PAD circuit adds insignificant amount of rigidity to membrane flexibility. Preliminary design and fabrication of PAD circuitry that consists of a few nodal elements were made for laboratory testing. The networked actuators were tested to correlate the network coupling effect, power allocation and distribution, and response time. The features of preliminary design are 16-channel computer control of actuators by a PCI board and the compensator for a power failure or leakage of one or more rectennas.

Single Circuit Board Implementation of a Digitally Compensated SAW Oscillator (DCSO).

DTIC Science & Technology

1983-12-01

Through this project a design for a Digitally Compensated SAW Oscillator (DCSO) was developed and implemented on a single circuit board. The AFIT IC, which...is the heart of the design , did not function properly. Therefore, my work was halted after testing several of the subcircuits and assembling the...o.... -7 Standards ........ o..o....... -8 Approach-9 Sequence of Presentation .................. -10 II, Design

Music Generated by a Zn/Cu Electrochemical Cell, a Lemon Cell, and a Solar Cell: A Demonstration for General Chemistry

ERIC Educational Resources Information Center

Cady, Susan G.

2014-01-01

The circuit board found in a commercial musical greeting card is used to supply music for electrochemical cell demonstrations. Similar to a voltmeter, the "modified" musical device is connected to a chemical reaction that produces electricity. The commercial 1 V battery inside the greeting card circuit board can be replaced with an…

A compressed sensing X-ray camera with a multilayer architecture

DOE PAGES

Wang, Zhehui; Laroshenko, O.; Li, S.; ...

2018-01-25

Recent advances in compressed sensing theory and algorithms offer new possibilities for high-speed X-ray camera design. In many CMOS cameras, each pixel has an independent on-board circuit that includes an amplifier, noise rejection, signal shaper, an analog-to-digital converter (ADC), and optional in-pixel storage. When X-ray images are sparse, i.e., when one of the following cases is true: (a.) The number of pixels with true X-ray hits is much smaller than the total number of pixels; (b.) The X-ray information is redundant; or (c.) Some prior knowledge about the X-ray images exists, sparse sampling may be allowed. In this work, wemore » first illustrate the feasibility of random on-board pixel sampling (ROPS) using an existing set of X-ray images, followed by a discussion about signal to noise as a function of pixel size. Next, we describe a possible circuit architecture to achieve random pixel access and in-pixel storage. The combination of a multilayer architecture, sparse on-chip sampling, and computational image techniques, is expected to facilitate the development and applications of high-speed X-ray camera technology.« less

A novel dismantling process of waste printed circuit boards using water-soluble ionic liquid.

PubMed

Zeng, Xianlai; Li, Jinhui; Xie, Henghua; Liu, Lili

2013-10-01

Recycling processes for waste printed circuit boards (WPCBs) have been well established in terms of scientific research and field pilots. However, current dismantling procedures for WPCBs have restricted the recycling process, due to their low efficiency and negative impacts on environmental and human health. This work aimed to seek an environmental-friendly dismantling process through heating with water-soluble ionic liquid to separate electronic components and tin solder from two main types of WPCBs-cathode ray tubes and computer mainframes. The work systematically investigates the influence factors, heating mechanism, and optimal parameters for opening solder connections on WPCBs during the dismantling process, and addresses its environmental performance and economic assessment. The results obtained demonstrate that the optimal temperature, retention time, and turbulence resulting from impeller rotation during the dismantling process, were 250 °C, 12 min, and 45 rpm, respectively. Nearly 90% of the electronic components were separated from the WPCBs under the optimal experimental conditions. This novel process offers the possibility of large industrial-scale operations for separating electronic components and recovering tin solder, and for a more efficient and environmentally sound process for WPCBs recycling. Copyright © 2013 Elsevier Ltd. All rights reserved.

Characterization of Printed Circuit Boards for Metal and Energy Recovery after Milling and Mechanical Separation

PubMed Central

Bizzo, Waldir A.; Figueiredo, Renata A.; de Andrade, Valdelis F.

2014-01-01

The proper disposal of electrical and electronic waste is currently a concern of researchers and environmental managers not only because of the large volume of such waste generated, but also because of the heavy metals and toxic substances it contains. This study analyzed printed circuit boards (PCBs) from discarded computers to determine their metal content and characterized them as solid waste and fuel. The analysis showed that PCBs consist of approximately 26% metal, made up mainly of copper, lead, aluminum, iron and tin, as well as other heavy metals such as cadmium and nickel. Comparison with the results of other studies indicated that the concentration of precious metals (gold and silver) has declined over time. Analysis of the leachate revealed high concentrations of cadmium and lead, giving the residue the characteristics of hazardous waste. After milling the PCBs, we found that larger amounts of metal were concentrated in smaller fractions, while the lightest fraction, obtained by density separation, had a gross calorific value of approximately 11 MJ/kg, although with a high ash content. Milling followed by density separation proved potentially useful for recovery of metals and energy-rich fractions. PMID:28788692

Bioleaching of Gold and Silver from Waste Printed Circuit Boards by Pseudomonas balearica SAE1 Isolated from an e-Waste Recycling Facility.

PubMed

Kumar, Anil; Saini, Harvinder Singh; Kumar, Sudhir

2018-02-01

Indigenous bacterial strain Pseudomonas balearica SAE1, tolerant to e-waste toxicity was isolated from an e-waste recycling facility Exigo Recycling Pvt. Ltd., India. Toxicity tolerance of bacterial strain was analyzed using crushed (particle size ≤150 µm) waste computer printed circuit boards (PCBs)/liter (L) of culture medium. The EC 50 value for SAE1 was 325.7 g/L of the e-waste pulp density. Two-step bioleaching was then applied to achieve the dissolution of gold (Au) and silver (Ag) from the e-waste. To maximize precious metal dissolution, factors including pulp density, glycine concentration, pH level, and temperature were optimized. The optimization resulted in 68.5 and 33.8% of Au and Ag dissolution, respectively, at a pH of 9.0, a pulp density of 10 g/L, a temperature of 30 °C, and a glycine concentration of 5 g/L. This is the first study of Au and Ag bioleaching using indigenous e-waste bacteria and its analysis to determine e-waste toxicity tolerance.

A compressed sensing X-ray camera with a multilayer architecture

DOE Office of Scientific and Technical Information (OSTI.GOV)

Wang, Zhehui; Laroshenko, O.; Li, S.

Recent advances in compressed sensing theory and algorithms offer new possibilities for high-speed X-ray camera design. In many CMOS cameras, each pixel has an independent on-board circuit that includes an amplifier, noise rejection, signal shaper, an analog-to-digital converter (ADC), and optional in-pixel storage. When X-ray images are sparse, i.e., when one of the following cases is true: (a.) The number of pixels with true X-ray hits is much smaller than the total number of pixels; (b.) The X-ray information is redundant; or (c.) Some prior knowledge about the X-ray images exists, sparse sampling may be allowed. In this work, wemore » first illustrate the feasibility of random on-board pixel sampling (ROPS) using an existing set of X-ray images, followed by a discussion about signal to noise as a function of pixel size. Next, we describe a possible circuit architecture to achieve random pixel access and in-pixel storage. The combination of a multilayer architecture, sparse on-chip sampling, and computational image techniques, is expected to facilitate the development and applications of high-speed X-ray camera technology.« less

Cooling/grounding mount for hybrid circuits

NASA Technical Reports Server (NTRS)

Bagstad, B.; Estrada, R.; Mandel, H.

1981-01-01

Extremely short input and output connections, adequate grounding, and efficient heat removal for hybrid integrated circuits are possible with mounting. Rectangular clamp holds hybrid on printed-circuit board, in contact with heat-conductive ground plate. Clamp is attached to ground plane by bolts.

Programmable data communications controller requirements

NASA Technical Reports Server (NTRS)

1977-01-01

The design requirements for a Programmable Data Communications Controller (PDCC) that reduces the difficulties in attaching data terminal equipment to a computer are presented. The PDCC is an interface between the computer I/O channel and the bit serial communication lines. Each communication line is supported by a communication port that handles all line control functions and performs most terminal control functions. The port is fabricated on a printed circuit board that plugs into a card chassis, mating with a connector that is joined to all other card stations by a data bus. Ports are individually programmable; each includes a microprocessor, a programmable read-only memory for instruction storage, and a random access memory for data storage.

Experimental industrial signal acquisition board in a large scientific device

NASA Astrophysics Data System (ADS)

Zeng, Xiangzhen; Ren, Bin

2018-02-01

In order to measure the industrial signal of neutrino experiment, a set of general-purpose industrial data acquisition board has been designed. It includes the function of switch signal input and output, and the function of analog signal input. The main components are signal isolation amplifier and filter circuit, ADC circuit, microcomputer systems and isolated communication interface circuit. Through the practical experiments, it shows that the system is flexible, reliable, convenient and economical, and the system has characters of high definition and strong anti-interference ability. Thus, the system fully meets the design requirements.

Polymer waveguides for electro-optical integration in data centers and high-performance computers.

PubMed

Dangel, Roger; Hofrichter, Jens; Horst, Folkert; Jubin, Daniel; La Porta, Antonio; Meier, Norbert; Soganci, Ibrahim Murat; Weiss, Jonas; Offrein, Bert Jan

2015-02-23

To satisfy the intra- and inter-system bandwidth requirements of future data centers and high-performance computers, low-cost low-power high-throughput optical interconnects will become a key enabling technology. To tightly integrate optics with the computing hardware, particularly in the context of CMOS-compatible silicon photonics, optical printed circuit boards using polymer waveguides are considered as a formidable platform. IBM Research has already demonstrated the essential silicon photonics and interconnection building blocks. A remaining challenge is electro-optical packaging, i.e., the connection of the silicon photonics chips with the system. In this paper, we present a new single-mode polymer waveguide technology and a scalable method for building the optical interface between silicon photonics chips and single-mode polymer waveguides.

Federal Litigation Arising from Personnel Practices of Southern School Boards from 1970 through 1981 in the Fifth Circuit Court of Appeals Area.

ERIC Educational Resources Information Center

Sistrunk, Walter E.; Guin, Mary Linda

This paper offers administrators, teachers, and school boards an introduction to legal issues surrounding teacher dismissal and school desegregation and summarizes a study of all teacher dismissal cases heard from 1970 through 1981 in the Fifth Circuit Court of Appeals. Most of the report is devoted to an overview of the historical development of…

Design of micro-ring optical sensors and circuits for integration on optical printed circuit boards (O-PCBs)

NASA Astrophysics Data System (ADS)

Lee, El-Hang; Lee, Hyun S.; Lee, S. G.; O, B. H.; Park, S. G.; Kim, K. H.

2007-05-01

We report on the design of micro-ring resonator optical sensors for integration on what we call optical printed circuit boards (O-PCBs). The objective is to realize application-specific O-PCBs, either on hard board or on flexible board, by integrating micro/nano-scale optical sensors for compact, light-weight, low-energy, high-speed, intelligent, and environmentally friendly processing of information. The O-PCBs consist of two-dimensional planar arrays of micro/nano-scale optical wires, circuits and devices that are interconnected and integrated to perform the functions of sensing and then storing, transporting, processing, switching, routing and distributing optical signals that have been collected by means of sensors. For fabrication, the polymer and organic optical wires and waveguides are first fabricated on a board and are used to interconnect and integrate sensors and other micro/ nano-scale photonic devices. Here, in our study, we focus on the sensors based on the micro-ring structures. We designed bio-sensors using silicon based micro-ring resonator. We investigate the characteristics such as sensitivity and selectivity (or quality factor) of micro-ring resonator for their use in bio-sensing application. We performed simulation studies on the quality factor of micro-ring resonators by varying the radius of the ring resonators and the separation between adjacent waveguides. We introduce the effective coupling coefficient as a realistic value to describe the strength of the coupling in micro-ring resonators.

A personal computer-based nuclear magnetic resonance spectrometer

NASA Astrophysics Data System (ADS)

Job, Constantin; Pearson, Robert M.; Brown, Michael F.

1994-11-01

Nuclear magnetic resonance (NMR) spectroscopy using personal computer-based hardware has the potential of enabling the application of NMR methods to fields where conventional state of the art equipment is either impractical or too costly. With such a strategy for data acquisition and processing, disciplines including civil engineering, agriculture, geology, archaeology, and others have the possibility of utilizing magnetic resonance techniques within the laboratory or conducting applications directly in the field. Another aspect is the possibility of utilizing existing NMR magnets which may be in good condition but unused because of outdated or nonrepairable electronics. Moreover, NMR applications based on personal computer technology may open up teaching possibilities at the college or even secondary school level. The goal of developing such a personal computer (PC)-based NMR standard is facilitated by existing technologies including logic cell arrays, direct digital frequency synthesis, use of PC-based electrical engineering software tools to fabricate electronic circuits, and the use of permanent magnets based on neodymium-iron-boron alloy. Utilizing such an approach, we have been able to place essentially an entire NMR spectrometer console on two printed circuit boards, with the exception of the receiver and radio frequency power amplifier. Future upgrades to include the deuterium lock and the decoupler unit are readily envisioned. The continued development of such PC-based NMR spectrometers is expected to benefit from the fast growing, practical, and low cost personal computer market.

Unitary Shaft-Angle and Shaft-Speed Sensor Assemblies

NASA Technical Reports Server (NTRS)

Alhorn, Dean C.; Howard, David E.; Smith, Dennis A.

2006-01-01

The figure depicts a unit that contains a rotary-position or a rotary-speed sensor, plus electronic circuitry necessary for its operation, all enclosed in a single housing with a shaft for coupling to an external rotary machine. This rotation sensor unit is complete: when its shaft is mechanically connected to that of the rotary machine and it is supplied with electric power, it generates an output signal directly indicative of the rotary position or speed, without need for additional processing by other circuitry. The incorporation of all of the necessary excitatory and readout circuitry into the housing (in contradistinction to using externally located excitatory and/or readout circuitry) in a compact arrangement is the major difference between this unit and prior rotation-sensor units. The sensor assembly inside the housing includes excitatory and readout integrated circuits mounted on a circular printed-circuit board. In a typical case in which the angle or speed transducer(s) utilize electromagnetic induction, the assembly also includes another circular printed-circuit board on which the transducer windings are mounted. A sheet of high-magnetic permeability metal ("mu metal") is placed between the winding board and the electronic-circuit board to prevent spurious coupling of excitatory signals from the transducer windings to the readout circuits. The housing and most of the other mechanical hardware can be common to a variety of different sensor designs. Hence, the unit can be configured to generate any of variety of outputs by changing the interior sensor assembly. For example, the sensor assembly could contain an analog tachometer circuit that generates an output proportional (in both magnitude and sign or in magnitude only) to the speed of rotation.

Four-Channel PC/104 MIL-STD-1553 Circuit Board

NASA Technical Reports Server (NTRS)

Cox, Gary L.

2004-01-01

The mini bus interface card (miniBIC) is the first four-channel electronic circuit board that conforms to MIL-STD-1553 and to the electrical-footprint portion of PC/104. [MIL-STD-1553 is a military standard that encompasses a method of communication and electrical- interface requirements for digital electronic subsystems connected to a data bus. PC/104 is an industry standard for compact, stackable modules that are fully compatible (in architecture, hardware, and software) with personal-computer data- and power-bus circuitry.] Prior to the development of the miniBIC, only one- and two-channel PC/104 MIL-STD-1553 boards were available. To obtain four channels, it was necessary to include at least two boards in a PC/104 stack. In comparison with such a two-board stack, the miniBIC takes up less space, consumes less power, and is more reliable. In addition, the miniBIC includes 32 digital input/output channels. The miniBIC (see figure) contains four MIL-STD-1553B hybrid integrated circuits (ICs), four transformers, a field-programmable gate array (FPGA), and an Industry Standard Architecture (ISA) interface. Each hybrid IC includes a MILSTD-1553 dual transceiver, memory-management circuitry, processor interface logic circuitry, and 64Kx16 bits of shared static random access memory. The memory is used to configure message and data blocks. In addition, 23 16-bit registers are available for (1) configuring the hybrid IC for, and starting it in, various modes of operation; (2) reading the status of the functionality of the hybrid IC; and (3) resetting the hybrid IC to a known state. The miniBIC can operate as a remote terminal, bus controller, or bus monitor. The FPGA provides the chip-select and data-strobe signals needed for operation of the hybrid ICs. The FPGA also receives interruption signals and forwards them to the ISA bus. The ISA interface connects the address, data, and control interfaces of the hybrid ICs to the ISA backplane. Each channel is, in effect, a MIL-STD-1553 interface that can operate either independently of the others or else as a redundant version of one of the others. The transformer in each channel provides electrical isolation between the rest of the miniBIC circuitry and the bus to which that channel is connected.

Plant Habitat Telemetry / Command Interface and E-MIST

NASA Technical Reports Server (NTRS)

Walker, Uriae M.

2013-01-01

Plant Habitat (PH) is an experiment to be taken to the International Space Station (ISS) in 2016. It is critical that ground support computers have the ability to uplink commands to control PH, and that ISS computers have the ability to downlink PH telemetry data to ground support. This necessitates communication software that can send, receive, and process, PH specific commands and telemetry. The objective of the Plant Habitat Telemetry/ Command Interface is to provide this communication software, and to couple it with an intuitive Graphical User Interface (GUI). Initial investigation of the project objective led to the decision that code be written in C++ because of its compatibility with existing source code infrastructures and robustness. Further investigation led to a determination that multiple Ethernet packet structures would need to be created to effectively transmit data. Setting a standard for packet structures would allow us to distinguish these packets that would range from command type packets to sub categories of telemetry packets. In order to handle this range of packet types, the conclusion was made to take an object-oriented programming approach which complemented our decision to use the C++ programming language. In addition, extensive utilization of port programming concepts was required to implement the core functionality of the communication software. Also, a concrete understanding of a packet processing software was required in order to put aU the components of ISS-to-Ground Support Equipment (GSE) communication together and complete the objective. A second project discussed in this paper is Exposing Microbes to the Stratosphere (EMIST). This project exposes microbes into the stratosphere to observe how they are impacted by atmospheric effects. This paper focuses on the electrical and software expectations of the project, specifically drafting the printed circuit board, and programming the on-board sensors. The Eagle Computer-Aided Drafting (CAD) software was used to draft the E-MIST circuit. This required several component libraries to be created. Coding the sensors and obtaining sensor data involved using the Arduino Uno developmental board and coding language, and properly wiring peripheral sensors to the microcontroller (the central control unit of the experiment).

A microprogrammable radar controller

NASA Technical Reports Server (NTRS)

Law, D. C.

1986-01-01

The Wave Propagation Lab. has completed the design and construction of a microprogrammable radar controller for atmospheric wind profiling. Unlike some radar controllers using state machines or hardwired logic for radar timing, this design is a high speed programmable sequencer with signal processing resources. A block diagram of the device is shown. The device is a single 8 1/2 inch by 10 1/2 inch printed circuit board and consists of three main subsections: (1) the host computer interface; (2) the microprogram sequencer; and (3) the signal processing circuitry. Each of these subsections are described in detail.

Effect of Ground Layer Patterns with Slits on Conducted Noise Currents from Printed Circuit Board

NASA Astrophysics Data System (ADS)

Maeno, Tsuyoshi; Unou, Takanori; Ichikawa, Kouji; Fujiwara, Osamu

Electromagnetic disturbances for vehicle-mounted radios can be caused by conducted noise currents that flows out from electronic equipment for vehicles to wire-harnesses. In this paper, for reducing the conducted noise currents from electronic equipment for vehicles, we made a simulation and experiment on how ground patterns affect the noise currents from three-layer printed circuit boards (PCBs) with slit-types and plane-type ground patterns. As a result, we could confirm that slits on a ground pattern allow conducted noise currents to flow out from PCBs to wire-harnesses. For the PCBs with plane-type ground and one of three slit-type patterns, on the other hand, both the simulation and examination showed that resonance phenomena occur at unexpected low-frequencies. A circuit analysis revealed that the above phenomena can be caused by the imbalance of a bridge circuit consisting of the trace circuits on the PCB.

Modular and Reusable Power System Design for the BRRISON Balloon Telescope

NASA Astrophysics Data System (ADS)

Truesdale, Nicholas A.

High altitude balloons are emerging as low-cost alternatives to orbital satellites in the field of telescopic observation. The near-space environment of balloons allows optics to perform near their diffraction limit. In practice, this implies that a telescope similar to the Hubble Space Telescope could be flown for a cost of tens of millions as opposed to billions. While highly feasible, the design of a balloon telescope to rival Hubble is limited by funding. Until a prototype is proven and more support for balloon science is gained, projects remain limited in both hardware costs and man hours. Thus, to effectively create and support balloon payloads, engineering designs must be efficient, modular, and if possible reusable. This thesis focuses specifically on a modular power system design for the BRRISON comet-observing balloon telescope. Time- and cost-saving techniques are developed that can be used for future missions. A modular design process is achieved through the development of individual circuit elements that span a wide range of capabilities. Circuits for power conversion, switching and sensing are designed to be combined in any configuration. These include DC-DC regulators, MOSFET drivers for switching, isolated switches, current sensors and voltage sensing ADCs. Emphasis is also given to commercially available hardware. Pre-fabricated DC-DC converters and an Arduino microcontroller simplify the design process and offer proven, cost-effective performance. The design of the BRRISON power system is developed from these low-level circuits elements. A board for main power distribution supports the majority of flight electronics, and is extensible to additional hardware in future applications. An ATX computer power supply is developed, allowing the use of a commercial ATX motherboard as the flight computer. The addition of new capabilities is explored in the form of a heater control board. Finally, the power system as a whole is described, and its overall performance analyzed. The success of the BRRISON power system during testing and flight proves its utility, both for BRRISON and for future balloon telescopes.

Metals Recovery from Artificial Ore in Case of Printed Circuit Boards, Using Plasmatron Plasma Reactor

PubMed Central

Szałatkiewicz, Jakub

2016-01-01

This paper presents the investigation of metals production form artificial ore, which consists of printed circuit board (PCB) waste, processed in plasmatron plasma reactor. A test setup was designed and built that enabled research of plasma processing of PCB waste of more than 700 kg/day scale. The designed plasma process is presented and discussed. The process in tests consumed 2 kWh/kg of processed waste. Investigation of the process products is presented with their elemental analyses of metals and slag. The average recovery of metals in presented experiments is 76%. Metals recovered include: Ag, Au, Pd, Cu, Sn, Pb, and others. The chosen process parameters are presented: energy consumption, throughput, process temperatures, and air consumption. Presented technology allows processing of variable and hard-to-process printed circuit board waste that can reach up to 100% of the input mass. PMID:28773804

Metals Recovery from Artificial Ore in Case of Printed Circuit Boards, Using Plasmatron Plasma Reactor.

PubMed

Szałatkiewicz, Jakub

2016-08-10

This paper presents the investigation of metals production form artificial ore, which consists of printed circuit board (PCB) waste, processed in plasmatron plasma reactor. A test setup was designed and built that enabled research of plasma processing of PCB waste of more than 700 kg/day scale. The designed plasma process is presented and discussed. The process in tests consumed 2 kWh/kg of processed waste. Investigation of the process products is presented with their elemental analyses of metals and slag. The average recovery of metals in presented experiments is 76%. Metals recovered include: Ag, Au, Pd, Cu, Sn, Pb, and others. The chosen process parameters are presented: energy consumption, throughput, process temperatures, and air consumption. Presented technology allows processing of variable and hard-to-process printed circuit board waste that can reach up to 100% of the input mass.

Cleaning of printed circuit assemblies with surface-mounted components

NASA Astrophysics Data System (ADS)

Arzigian, J. S.

The need for ever-increasing miniaturization of airborne instrumentation through the use of surface mounted components closely placed on printed circuit boards highlights problems with traditional board cleaning methods. The reliability of assemblies which have been cleaned with vapor degreasing and spray cleaning can be seriously compromised by residual contaminants leading to solder joint failure, board corrosion, and even electrical failure of the mounted parts. In addition, recent government actions to eliminate fully halogenated chlorofluorocarbons (CFC) and chlorinated hydrocarbons from the industrial environment require the development of new cleaning materials and techniques. This paper discusses alternative cleaning materials and techniques and results that can be expected with them. Particular emphasis is placed on problems related to surface-mounted parts. These new techniques may lead to improved circuit reliability and, at the same time, be less expensive and less environmentally hazardous than the traditional systems.

Bioleaching of gold, copper and nickel from waste cellular phone PCBs and computer goldfinger motherboards by two Aspergillus nigerstrains

PubMed Central

Madrigal-Arias, Jorge Enrique; Argumedo-Delira, Rosalba; Alarcón, Alejandro; Mendoza-López, Ma. Remedios; García-Barradas, Oscar; Cruz-Sánchez, Jesús Samuel; Ferrera-Cerrato, Ronald; Jiménez-Fernández, Maribel

2015-01-01

In an effort to develop alternate techniques to recover metals from waste electrical and electronic equipment (WEEE), this research evaluated the bioleaching efficiency of gold (Au), copper (Cu) and nickel (Ni) by two strains of Aspergillus niger in the presence of gold-plated finger integrated circuits found in computer motherboards (GFICMs) and cellular phone printed circuit boards (PCBs). These three metals were analyzed for their commercial value and their diverse applications in the industry. Au-bioleaching ranged from 42 to 1% for Aspergillus niger strain MXPE6; with the combination of Aspergillus niger MXPE6 + Aspergillus niger MX7, the Au-bioleaching was 87 and 28% for PCBs and GFICMs, respectively. In contrast, the bioleaching of Cu by Aspergillus niger MXPE6 was 24 and 5%; using the combination of both strains, the values were 0.2 and 29% for PCBs and GFICMs, respectively. Fungal Ni-leaching was only found for PCBs, but with no significant differences among treatments. Improvement of the metal recovery efficiency by means of fungal metabolism is also discussed. PMID:26413051

Bioleaching of gold, copper and nickel from waste cellular phone PCBs and computer goldfinger motherboards by two Aspergillus nigerstrains.

PubMed

Madrigal-Arias, Jorge Enrique; Argumedo-Delira, Rosalba; Alarcón, Alejandro; Mendoza-López, Ma Remedios; García-Barradas, Oscar; Cruz-Sánchez, Jesús Samuel; Ferrera-Cerrato, Ronald; Jiménez-Fernández, Maribel

2015-01-01

In an effort to develop alternate techniques to recover metals from waste electrical and electronic equipment (WEEE), this research evaluated the bioleaching efficiency of gold (Au), copper (Cu) and nickel (Ni) by two strains of Aspergillus niger in the presence of gold-plated finger integrated circuits found in computer motherboards (GFICMs) and cellular phone printed circuit boards (PCBs). These three metals were analyzed for their commercial value and their diverse applications in the industry. Au-bioleaching ranged from 42 to 1% for Aspergillus niger strain MXPE6; with the combination of Aspergillus niger MXPE6 + Aspergillus niger MX7, the Au-bioleaching was 87 and 28% for PCBs and GFICMs, respectively. In contrast, the bioleaching of Cu by Aspergillus niger MXPE6 was 24 and 5%; using the combination of both strains, the values were 0.2 and 29% for PCBs and GFICMs, respectively. Fungal Ni-leaching was only found for PCBs, but with no significant differences among treatments. Improvement of the metal recovery efficiency by means of fungal metabolism is also discussed.

Evaluation of test equipment for the detection of contamination on electronic circuits

NASA Astrophysics Data System (ADS)

Bergendahl, C. G.; Dunn, B. D.

1984-08-01

The reproducibility, sensitivity and ease of operation of test equipment for the detection of ionizable contaminants on the surface of printed circuit assemblies were assessed. The characteristics of the test equipment are described. Soldering fluxes were chosen as contaminants and were applied in controlled amounts to printed-circuit board assemblies possessing two different component populations. Results show that the relationship between equipment readings varies with flux type. Each kind of test equipment gives a good measure of board cleanliness, although reservations exist concerning the interpretation of such results. A test method for the analysis of total (organic and inorganic) halides in solder fluxes is presented.

Introduction to the Special Issue on Digital Signal Processing in Radio Astronomy

NASA Astrophysics Data System (ADS)

Price, D. C.; Kocz, J.; Bailes, M.; Greenhill, L. J.

2016-03-01

Advances in astronomy are intimately linked to advances in digital signal processing (DSP). This special issue is focused upon advances in DSP within radio astronomy. The trend within that community is to use off-the-shelf digital hardware where possible and leverage advances in high performance computing. In particular, graphics processing units (GPUs) and field programmable gate arrays (FPGAs) are being used in place of application-specific circuits (ASICs); high-speed Ethernet and Infiniband are being used for interconnect in place of custom backplanes. Further, to lower hurdles in digital engineering, communities have designed and released general-purpose FPGA-based DSP systems, such as the CASPER ROACH board, ASTRON Uniboard, and CSIRO Redback board. In this introductory paper, we give a brief historical overview, a summary of recent trends, and provide an outlook on future directions.

Optical interconnect technologies for high-bandwidth ICT systems

NASA Astrophysics Data System (ADS)

Chujo, Norio; Takai, Toshiaki; Mizushima, Akiko; Arimoto, Hideo; Matsuoka, Yasunobu; Yamashita, Hiroki; Matsushima, Naoki

2016-03-01

The bandwidth of information and communication technology (ICT) systems is increasing and is predicted to reach more than 10 Tb/s. However, an electrical interconnect cannot achieve such bandwidth because of its density limits. To solve this problem, we propose two types of high-density optical fiber wiring for backplanes and circuit boards such as interface boards and switch boards. One type uses routed ribbon fiber in a circuit board because it has the ability to be formed into complex shapes to avoid interfering with the LSI and electrical components on the board. The backplane is required to exhibit high density and flexibility, so the second type uses loose fiber. We developed a 9.6-Tb/s optical interconnect demonstration system using embedded optical modules, optical backplane, and optical connector in a network apparatus chassis. We achieved 25-Gb/s transmission between FPGAs via the optical backplane.

Scrap computer recycling in Taiwan

DOE Office of Scientific and Technical Information (OSTI.GOV)

Lee, C.H.; Chang, S.L.; Wang, K.M.

1999-07-01

It is estimated that approximately 700,000 scrap personal computers will be generated each year in Taiwan. The disposal of such a huge amount of scrap computers presents a difficult task for the island due to the scarcity of landfills and incineration facilities available locally. Also, the hazardous materials contained in the scrap computers may cause serious pollution to the environment, if they are not properly disposed. Thus, EPA of Taiwan has declared scrap personal computers as a producer responsibility recycling product on July 1997 to mandate that the manufacturers, importers and sellers of personal computers have to recover and recyclemore » their scrap computers properly. Beginning on June 1, 1998, a scrap computer recycling plan is officially implemented on the island. Under this plan, consumers can deliver their unwanted personal computers to the designated collection points to receive reward money. Currently, only six items are mandated to be recycled in this recycling plan. They are notebooks, monitor and the hard disk, power supply, printed circuit board and shell of the main frame of the personal computer. This paper presents the current scrap computer recycling system in Taiwan.« less

In-line rotating torque sensor with on-board amplifier

DOEpatents

Kronberg, James W.

1990-01-01

A rotating torque sensor apparatus and method for measuring small torques comprising a shaft, a platform having a circuit board and a first moment arm attached to the shaft, a rotatable wheel coaxial with the shaft and having a second moment arm spaced apart from the first moment arm with a load cell therebetween for generating an electric signal as the torque is applied to the shaft and transferred through the moment arms to the load cell. The electrical signal is conducted from the load cell to the circuit board for filtering and amplification before being extracted from the torque assembly through a slip ring.

On-board computational efficiency in real time UAV embedded terrain reconstruction

NASA Astrophysics Data System (ADS)

Partsinevelos, Panagiotis; Agadakos, Ioannis; Athanasiou, Vasilis; Papaefstathiou, Ioannis; Mertikas, Stylianos; Kyritsis, Sarantis; Tripolitsiotis, Achilles; Zervos, Panagiotis

2014-05-01

In the last few years, there is a surge of applications for object recognition, interpretation and mapping using unmanned aerial vehicles (UAV). Specifications in constructing those UAVs are highly diverse with contradictory characteristics including cost-efficiency, carrying weight, flight time, mapping precision, real time processing capabilities, etc. In this work, a hexacopter UAV is employed for near real time terrain mapping. The main challenge addressed is to retain a low cost flying platform with real time processing capabilities. The UAV weight limitation affecting the overall flight time, makes the selection of the on-board processing components particularly critical. On the other hand, surface reconstruction, as a computational demanding task, calls for a highly demanding processing unit on board. To merge these two contradicting aspects along with customized development, a System on a Chip (SoC) integrated circuit is proposed as a low-power, low-cost processor, which natively supports camera sensors and positioning and navigation systems. Modern SoCs, such as Omap3530 or Zynq, are classified as heterogeneous devices and provide a versatile platform, allowing access to both general purpose processors, such as the ARM11, as well as specialized processors, such as a digital signal processor and floating field-programmable gate array. A UAV equipped with the proposed embedded processors, allows on-board terrain reconstruction using stereo vision in near real time. Furthermore, according to the frame rate required, additional image processing may concurrently take place, such as image rectification andobject detection. Lastly, the onboard positioning and navigation (e.g., GNSS) chip may further improve the quality of the generated map. The resulting terrain maps are compared to ground truth geodetic measurements in order to access the accuracy limitations of the overall process. It is shown that with our proposed novel system,there is much potential in computational efficiency on board and in optimized time constraints.

Bright Ideas for Measuring Light.

ERIC Educational Resources Information Center

Amend, John R.; Schuler, John A.

1983-01-01

Describes an inexpensive device (around $8.00) for measuring light. The circuit used includes five resistors, three small capacitors, a cadmium sulfide light sensor, two integrated circuits, and two light-emitting diodes. The unit is constructed on a small perforated circuit board and powered by a 9-V transistor radio battery. (JN)

Shock absorbing mount for electrical components

NASA Technical Reports Server (NTRS)

Dillon, R. F., Jr.; Mayne, R. C. (Inventor)

1975-01-01

A shock mount for installing electrical components on circuit boards is described. The shock absorber is made of viscoelastic material which interconnects the electrical components. With this system, shocks imposed on one component of the circuit are not transmitted to other components. A diagram of a typical circuit is provided.

Application of industrial robots in automatic disassembly line of waste LCD displays

NASA Astrophysics Data System (ADS)

Wang, Sujuan

2017-11-01

In the automatic disassembly line of waste LCD displays, LCD displays are disassembled into plastic shells, metal shields, circuit boards, and LCD panels. Two industrial robots are used to cut metal shields and remove circuit boards in this automatic disassembly line. The functions of these two industrial robots, and the solutions to the critical issues of model selection, the interfaces with PLCs and the workflows were described in detail in this paper.

Comparative analysis of single-walled and multi-walled carbon nanotubes for electrochemical sensing of glucose on gold printed circuit boards.

PubMed

Alhans, Ruby; Singh, Anukriti; Singhal, Chaitali; Narang, Jagriti; Wadhwa, Shikha; Mathur, Ashish

2018-09-01

In the present work, a comparative study was performed between single-walled carbon nanotubes and multi-walled carbon nanotubes coated gold printed circuit board electrodes for glucose detection. Various characterization techniques were demonstrated in order to compare the modified electrodes viz. cyclic voltammetry, electrochemical impedance spectroscopy and chrono-amperometry. Results revealed that single-walled carbon nanotubes outperformed multi-walled carbon nanotubes and proved to be a better sensing interface for glucose detection. The single-walled carbon nanotubes coated gold printed circuit board electrodes showed a wide linear sensing range (1 mM to 100 mM) with detection limit of 0.1 mM with response time of 5 s while multi-walled carbon nanotubes coated printed circuit board gold electrodes showed linear sensing range (1 mM to 100 mM) with detection limit of 0.1 mM with response time of 5 s. This work provided low cost sensors with enhanced sensitivity, fast response time and reliable results for glucose detection which increased the affordability of such tests in remote areas. In addition, the comparative results confirmed that single-walled carbon nanotubes modified electrodes can be exploited for better amplification signal as compared to multi-walled carbon nanotubes. Copyright © 2018. Published by Elsevier B.V.

Learning high-quality soldering

NASA Technical Reports Server (NTRS)

Read, W. S.

1981-01-01

Soldering techniques for high-reliability electronic equipment are taught in 5 day course at NASA's Jet Propulsion Laboratory. Topic covered include new circuit assembly, printed-wiring board reworking, circuit changes, wire routing, and component installation.

Optimizing the operating parameters of corona electrostatic separation for recycling waste scraped printed circuit boards by computer simulation of electric field.

PubMed

Li, Jia; Lu, Hongzhou; Liu, Shushu; Xu, Zhenming

2008-05-01

The printed circuit board (PCB) has a metal content of nearly 28% metal, including an abundance of nonferrous metals such as copper, lead, and tin. The purity of precious metals in PCBs is more than 10 times that of rich-content minerals. Therefore, the recycling of PCBs is an important subject, not only from the viewpoint of waste treatment, but also with respect to the recovery of valuable materials. Compared with traditional process the corona electrostatic separation (CES) had no waste water or gas during the process and it had high productivity with a low-energy cost. In this paper, the roll-type corona electrostatic separator was used to separate metals and nonmetals from scraped waste PCBs. The software MATLAB was used to simulate the distribution of electric field in separating space. It was found that, the variations of parameters of electrodes and applied voltages directly influenced the distribution of electric field. Through the correlation of simulated and experimental results, the good separation results were got under the optimized operating parameter: U=20-30 kV, L=L(1)=L(2)=0.21 m, R(1)=0.114, R(2)=0.019 m, theta(1)=20 degrees and theta(2)=60 degrees .

Real-time monitoring system for improving corona electrostatic separation in the process of recovering waste printed circuit boards.

PubMed

Li, Jia; Zhou, Quan; Xu, Zhenming

2014-12-01

Although corona electrostatic separation is successfully used in recycling waste printed circuit boards in industrial applications, there are problems that cannot be resolved completely, such as nonmetal particle aggregation and spark discharge. Both of these problems damage the process of separation and are not easy to identify during the process of separation in industrial applications. This paper provides a systematic study on a real-time monitoring system. Weight monitoring systems were established to continuously monitor the separation process. A Virtual Instrumentation program written by LabVIEW was utilized to sample and analyse the mass increment of the middling product. It includes four modules: historical data storage, steady-state analysis, data computing and alarm. Three kinds of operating conditions were used to verify the applicability of the monitoring system. It was found that the system achieved the goal of monitoring during the separation process and realized the function of real-time analysis of the received data. The system also gave comprehensible feedback on the accidents of material blockages in the feed inlet and high-voltage spark discharge. With the warning function of the alarm system, the whole monitoring system could save the human cost and help the new technology to be more easily applied in industry. © The Author(s) 2014.

Impact of VLSI/VHSIC on satellite on-board signal processing

NASA Astrophysics Data System (ADS)

Aanstoos, J. V.; Ruedger, W. H.; Snyder, W. E.; Kelly, W. L.

Forecasted improvements in IC fabrication techniques, such as the use of X-ray lithography, are expected to yield submicron circuit feature sizes within the decade of the 1980s. As dimensions decrease, reliability, cost, speed, power consumption and density improvements will be realized which have a significant impact on the capabilities of onboard spacecraft signal processing functions. This will in turn result in increases of the intelligence that may be deployed on spaceborne remote sensing platforms. Among programs oriented toward such goals are the silicon-based Very High Speed Integrated Circuit (VHSIC) researches sponsored by the U.S. Department of Defense, and efforts toward the development of GaAs devices which will compete with silicon VLSI technology for future applications. GaAs has an electron mobility which is five to six times that of silicon, and promises commensurate computation speed increases under low field conditions.

Real-time fast physical random number generator with a photonic integrated circuit.

PubMed

Ugajin, Kazusa; Terashima, Yuta; Iwakawa, Kento; Uchida, Atsushi; Harayama, Takahisa; Yoshimura, Kazuyuki; Inubushi, Masanobu

2017-03-20

Random number generators are essential for applications in information security and numerical simulations. Most optical-chaos-based random number generators produce random bit sequences by offline post-processing with large optical components. We demonstrate a real-time hardware implementation of a fast physical random number generator with a photonic integrated circuit and a field programmable gate array (FPGA) electronic board. We generate 1-Tbit random bit sequences and evaluate their statistical randomness using NIST Special Publication 800-22 and TestU01. All of the BigCrush tests in TestU01 are passed using 410-Gbit random bit sequences. A maximum real-time generation rate of 21.1 Gb/s is achieved for random bit sequences in binary format stored in a computer, which can be directly used for applications involving secret keys in cryptography and random seeds in large-scale numerical simulations.

46 CFR 28.370 - Wiring methods and materials.

Code of Federal Regulations, 2014 CFR

2014-10-01

... that affects one cable does not affect the other. (d) Cable and wire for power and lighting circuits... Operate With More Than 16 Individuals on Board § 28.370 Wiring methods and materials. (a) All cable and... circuit. (b) Each conductor must be No. 22 AWG or larger. Conductors in power and lighting circuits must...

46 CFR 28.370 - Wiring methods and materials.

Code of Federal Regulations, 2012 CFR

2012-10-01

... that affects one cable does not affect the other. (d) Cable and wire for power and lighting circuits... Operate With More Than 16 Individuals on Board § 28.370 Wiring methods and materials. (a) All cable and... circuit. (b) Each conductor must be No. 22 AWG or larger. Conductors in power and lighting circuits must...

46 CFR 28.370 - Wiring methods and materials.

Code of Federal Regulations, 2013 CFR

2013-10-01

... that affects one cable does not affect the other. (d) Cable and wire for power and lighting circuits... Operate With More Than 16 Individuals on Board § 28.370 Wiring methods and materials. (a) All cable and... circuit. (b) Each conductor must be No. 22 AWG or larger. Conductors in power and lighting circuits must...

Silicon Carbide Integrated Circuit Chip

NASA Image and Video Library

2015-02-17

A multilevel interconnect silicon carbide integrated circuit chip with co-fired ceramic package and circuit board recently developed at the NASA GRC Smart Sensors and Electronics Systems Branch for high temperature applications. High temperature silicon carbide electronics and compatible packaging technologies are elements of instrumentation for aerospace engine control and long term inner-solar planet explorations.

Flexible programmable logic module

DOEpatents

Robertson, Perry J.; Hutchinson, Robert L.; Pierson, Lyndon G.

2001-01-01

The circuit module of this invention is a VME board containing a plurality of programmable logic devices (PLDs), a controlled impedance clock tree, and interconnecting buses. The PLDs are arranged to permit systolic processing of a problem by offering wide data buses and a plurality of processing nodes. The board contains a clock reference and clock distribution tree that can drive each of the PLDs with two critically timed clock references. External clock references can be used to drive additional circuit modules all operating from the same synchronous clock reference.

Information Switching Processor (ISP) contention analysis and control

NASA Technical Reports Server (NTRS)

Inukai, Thomas

1995-01-01

In designing a satellite system with on-board processing, the selection of a switching architecture is often critical. The on-board switching function can be implemented by circuit switching or packet switching. Destination-directed packet switching has several attractive features, such as self-routing without on-board switch reconfiguration, no switch control memory requirement, efficient bandwidth utilization for packet switched traffic, and accommodation of circuit switched traffic. Destination-directed packet switching, however, has two potential concerns: (1) contention and (2) congestion. And this report specifically deals with the first problem. It includes a description and analysis of various self-routing switch structures, the nature of contention problems, and contention and resolution techniques.

Test Bench for Coupling and Shielding Magnetic Fields

NASA Astrophysics Data System (ADS)

Jordan, J.; Esteve, V.; Dede, E.; Sanchis, E.; Maset, E.; Ferreres, A.; Ejea, J. B.; Cases, C.

2016-05-01

This paper describes a test bench for training purposes, which uses a magnetic field generator to couple this magnetic field to a victim circuit. It can be very useful to test for magnetic susceptibility as well. The magnetic field generator consists of a board, which generates a variable current that flows into a printed circuit board with spiral tracks (noise generator). The victim circuit consists of a coaxial cable concentric with the spiral tracks and its generated magnetic field. The coaxial cable is part of a circuit which conducts a signal produced by a signal generator and a resistive load. In the paper three cases are studied. First, the transmitted signal from the signal generator uses the central conductor of the coaxial cable and the shield is floating. Second, the shield is short circuited at its ends (and thus forming a loop). Third, when connecting the shield in series with the inner conductor and therefore having the current flowing into the coax via the inner conductor and returning via the shield.

Computer hardware for radiologists: Part I

PubMed Central

Indrajit, IK; Alam, A

2010-01-01

Computers are an integral part of modern radiology practice. They are used in different radiology modalities to acquire, process, and postprocess imaging data. They have had a dramatic influence on contemporary radiology practice. Their impact has extended further with the emergence of Digital Imaging and Communications in Medicine (DICOM), Picture Archiving and Communication System (PACS), Radiology information system (RIS) technology, and Teleradiology. A basic overview of computer hardware relevant to radiology practice is presented here. The key hardware components in a computer are the motherboard, central processor unit (CPU), the chipset, the random access memory (RAM), the memory modules, bus, storage drives, and ports. The personnel computer (PC) has a rectangular case that contains important components called hardware, many of which are integrated circuits (ICs). The fiberglass motherboard is the main printed circuit board and has a variety of important hardware mounted on it, which are connected by electrical pathways called “buses”. The CPU is the largest IC on the motherboard and contains millions of transistors. Its principal function is to execute “programs”. A Pentium® 4 CPU has transistors that execute a billion instructions per second. The chipset is completely different from the CPU in design and function; it controls data and interaction of buses between the motherboard and the CPU. Memory (RAM) is fundamentally semiconductor chips storing data and instructions for access by a CPU. RAM is classified by storage capacity, access speed, data rate, and configuration. PMID:21042437

Programmable Pulse-Position-Modulation Encoder

NASA Technical Reports Server (NTRS)

Zhu, David; Farr, William

2006-01-01

A programmable pulse-position-modulation (PPM) encoder has been designed for use in testing an optical communication link. The encoder includes a programmable state machine and an electronic code book that can be updated to accommodate different PPM coding schemes. The encoder includes a field-programmable gate array (FPGA) that is programmed to step through the stored state machine and code book and that drives a custom high-speed serializer circuit board that is capable of generating subnanosecond pulses. The stored state machine and code book can be updated by means of a simple text interface through the serial port of a personal computer.

Conference Proceedings: Annual Review of Progress in Applied Computational Electromagnetics (ACES󈨢) (10th) Held in Monterey, California on March 21-26, 1994. Volume 2

DTIC Science & Technology

1994-01-01

These enhancements have allowed us to use GEMACS to model very small ( electrical ) features such as 0.1V pins on printed circuit boards without the...34Enhancements and Limitations of the Code NEC for Modeling Electrically Small Antennas," Lawrence Livermore National Laboratory, Report UCID-20970, January... electrical lengths of the coupling paths arc also shown in Figure 6. The "LB" indicates the large box dimensions (1/4.4 scale model ) and "SB" Indicates the

Application of M-JPEG compression hardware to dynamic stimulus production.

PubMed

Mulligan, J B

1997-01-01

Inexpensive circuit boards have appeared on the market which transform a normal micro-computer's disk drive into a video disk capable of playing extended video sequences in real time. This technology enables the performance of experiments which were previously impossible, or at least prohibitively expensive. The new technology achieves this capability using special-purpose hardware to compress and decompress individual video frames, enabling a video stream to be transferred over relatively low-bandwidth disk interfaces. This paper will describe the use of such devices for visual psychophysics and present the technical issues that must be considered when evaluating individual products.

Study of Photosensitive Dry Films Absorption for Printed Circuit Boards by Photoacoustic Technique

NASA Astrophysics Data System (ADS)

Hernández, R.; Zaragoza, J. A. Barrientos; Jiménez-Pérez, J. L.; Orea, A. Cruz; Correa-Pacheco, Z. N.

2017-08-01

In this work, the study of photosensitive dry-type films by photoacoustic technique is proposed. The dry film photoresist is resistant to chemical etching for printed circuit boards such as ferric chloride, sodium persulfate or ammonium, hydrochloric acid. It is capable of faithfully reproducing circuit pattern exposed to ultraviolet light (UV) through a negative. Once recorded, the uncured portion is removed with alkaline solution. It is possible to obtain good results in surface mount circuits with tracks of 5 mm. Furthermore, the solid resin films are formed by three layers, two protective layers and a UV-sensitive optical absorption layer in the range of 325 nm to 405 nm. By means of optical absorption of UV-visible rays emitted by a low-power Xe lamp, the films transform this energy into thermal waves generated by the absorption of optical radiation and subsequently no-radiative de-excitation occurs. The photoacoustic spectroscopy is a useful technique to measure the transmittance and absorption directly. In this study, the optical absorption spectra of the three layers of photosensitive dry-type films were obtained as a function of the wavelength, in order to have a knowledge of the absorber layer and the protective layers. These analyses will give us the physical properties of the photosensitive film, which are very important in curing the dry film for applications in printed circuit boards.

Feasibility Test of a Liquid Film Thickness Sensor on a Flexible Printed Circuit Board Using a Three-Electrode Conductance Method

PubMed Central

Lee, Kyu Byung; Kim, Jong Rok; Park, Goon Cherl; Cho, Hyoung Kyu

2016-01-01

Liquid film thickness measurements under temperature-varying conditions in a two-phase flow are of great importance to refining our understanding of two-phase flows. In order to overcome the limitations of the conventional electrical means of measuring the thickness of a liquid film, this study proposes a three-electrode conductance method, with the device fabricated on a flexible printed circuit board (FPCB). The three-electrode conductance method offers the advantage of applicability under conditions with varying temperatures in principle, while the FPCB has the advantage of usability on curved surfaces and in relatively high-temperature conditions in comparison with sensors based on a printed circuit board (PCB). Two types of prototype sensors were fabricated on an FPCB and the feasibility of both was confirmed in a calibration test conducted at different temperatures. With the calibrated sensor, liquid film thickness measurements were conducted via a falling liquid film flow experiment, and the working performance was tested. PMID:28036000

The separation of waste printed circuit board by dissolving bromine epoxy resin using organic solvent.

PubMed

Zhu, P; Chen, Y; Wang, L Y; Zhou, M; Zhou, J

2013-02-01

Separation of waste printed circuit boards (WPCBs) has been a bottleneck in WPCBs resource processing. In this study, the separation of WPCBs was performed using dimethyl sulfoxide (DMSO) as a solvent. Various parameters, which included solid to liquid ratio, temperature, WPCB sizes, and time, were studied to understand the separation of WPCBs by dissolving bromine epoxy resin using DMSO. Experimental results showed that the concentration of dissolving the bromine epoxy resin increased with increasing various parameters. The optimum condition of complete separation of WPCBs was solid to liquid ratio of 1:7 and WPCB sizes of 16 mm(2) at 145°C for 60 min. The used DMSO was vapored under the decompression, which obtained the regenerated DMSO and dissolved bromine epoxy resin. This clean and non-polluting technology offers a new way to separate valuable materials from WPCBs and prevent the environmental pollution of waste printed circuit boards effectively. Crown Copyright © 2012. Published by Elsevier Ltd. All rights reserved.

FPGA-Based, Self-Checking, Fault-Tolerant Computers

NASA Technical Reports Server (NTRS)

Some, Raphael; Rennels, David

2004-01-01

A proposed computer architecture would exploit the capabilities of commercially available field-programmable gate arrays (FPGAs) to enable computers to detect and recover from bit errors. The main purpose of the proposed architecture is to enable fault-tolerant computing in the presence of single-event upsets (SEUs). [An SEU is a spurious bit flip (also called a soft error) caused by a single impact of ionizing radiation.] The architecture would also enable recovery from some soft errors caused by electrical transients and, to some extent, from intermittent and permanent (hard) errors caused by aging of electronic components. A typical FPGA of the current generation contains one or more complete processor cores, memories, and highspeed serial input/output (I/O) channels, making it possible to shrink a board-level processor node to a single integrated-circuit chip. Custom, highly efficient microcontrollers, general-purpose computers, custom I/O processors, and signal processors can be rapidly and efficiently implemented by use of FPGAs. Unfortunately, FPGAs are susceptible to SEUs. Prior efforts to mitigate the effects of SEUs have yielded solutions that degrade performance of the system and require support from external hardware and software. In comparison with other fault-tolerant- computing architectures (e.g., triple modular redundancy), the proposed architecture could be implemented with less circuitry and lower power demand. Moreover, the fault-tolerant computing functions would require only minimal support from circuitry outside the central processing units (CPUs) of computers, would not require any software support, and would be largely transparent to software and to other computer hardware. There would be two types of modules: a self-checking processor module and a memory system (see figure). The self-checking processor module would be implemented on a single FPGA and would be capable of detecting its own internal errors. It would contain two CPUs executing identical programs in lock step, with comparison of their outputs to detect errors. It would also contain various cache local memory circuits, communication circuits, and configurable special-purpose processors that would use self-checking checkers. (The basic principle of the self-checking checker method is to utilize logic circuitry that generates error signals whenever there is an error in either the checker or the circuit being checked.) The memory system would comprise a main memory and a hardware-controlled check-pointing system (CPS) based on a buffer memory denoted the recovery cache. The main memory would contain random-access memory (RAM) chips and FPGAs that would, in addition to everything else, implement double-error-detecting and single-error-correcting memory functions to enable recovery from single-bit errors.

78 FR 69927 - SJI Board of Directors Meeting, Notice

Federal Register 2010, 2011, 2012, 2013, 2014

2013-11-21

... STATE JUSTICE INSTITUTE SJI Board of Directors Meeting, Notice AGENCY: State Justice Institute. ACTION: Notice of meeting. SUMMARY: The SJI Board of Directors will be meeting on Monday, December 9, 2013 at 1:00 p.m. The meeting will be held at the 9th Judicial Circuit of Florida in Orlando, Florida...

A space-efficient quantum computer simulator suitable for high-speed FPGA implementation

NASA Astrophysics Data System (ADS)

Frank, Michael P.; Oniciuc, Liviu; Meyer-Baese, Uwe H.; Chiorescu, Irinel

2009-05-01

Conventional vector-based simulators for quantum computers are quite limited in the size of the quantum circuits they can handle, due to the worst-case exponential growth of even sparse representations of the full quantum state vector as a function of the number of quantum operations applied. However, this exponential-space requirement can be avoided by using general space-time tradeoffs long known to complexity theorists, which can be appropriately optimized for this particular problem in a way that also illustrates some interesting reformulations of quantum mechanics. In this paper, we describe the design and empirical space/time complexity measurements of a working software prototype of a quantum computer simulator that avoids excessive space requirements. Due to its space-efficiency, this design is well-suited to embedding in single-chip environments, permitting especially fast execution that avoids access latencies to main memory. We plan to prototype our design on a standard FPGA development board.

Software algorithm and hardware design for real-time implementation of new spectral estimator

PubMed Central

2014-01-01

Background Real-time spectral analyzers can be difficult to implement for PC computer-based systems because of the potential for high computational cost, and algorithm complexity. In this work a new spectral estimator (NSE) is developed for real-time analysis, and compared with the discrete Fourier transform (DFT). Method Clinical data in the form of 216 fractionated atrial electrogram sequences were used as inputs. The sample rate for acquisition was 977 Hz, or approximately 1 millisecond between digital samples. Real-time NSE power spectra were generated for 16,384 consecutive data points. The same data sequences were used for spectral calculation using a radix-2 implementation of the DFT. The NSE algorithm was also developed for implementation as a real-time spectral analyzer electronic circuit board. Results The average interval for a single real-time spectral calculation in software was 3.29 μs for NSE versus 504.5 μs for DFT. Thus for real-time spectral analysis, the NSE algorithm is approximately 150× faster than the DFT. Over a 1 millisecond sampling period, the NSE algorithm had the capability to spectrally analyze a maximum of 303 data channels, while the DFT algorithm could only analyze a single channel. Moreover, for the 8 second sequences, the NSE spectral resolution in the 3-12 Hz range was 0.037 Hz while the DFT spectral resolution was only 0.122 Hz. The NSE was also found to be implementable as a standalone spectral analyzer board using approximately 26 integrated circuits at a cost of approximately $500. The software files used for analysis are included as a supplement, please see the Additional files 1 and 2. Conclusions The NSE real-time algorithm has low computational cost and complexity, and is implementable in both software and hardware for 1 millisecond updates of multichannel spectra. The algorithm may be helpful to guide radiofrequency catheter ablation in real time. PMID:24886214

Method for reworkable packaging of high speed, low electrical parasitic power electronics modules through gate drive integration

DOEpatents

Passmore, Brandon; Cole, Zach; Whitaker, Bret; Barkley, Adam; McNutt, Ty; Lostetter, Alexander

2016-08-02

A multichip power module directly connecting the busboard to a printed-circuit board that is attached to the power substrate enabling extremely low loop inductance for extreme environments such as high temperature operation. Wire bond interconnections are taught from the power die directly to the busboard further enabling enable low parasitic interconnections. Integration of on-board high frequency bus capacitors provide extremely low loop inductance. An extreme environment gate driver board allows close physical proximity of gate driver and power stage to reduce overall volume and reduce impedance in the control circuit. Parallel spring-loaded pin gate driver PCB connections allows a reliable and reworkable power module to gate driver interconnections.

Characterization and mechanical separation of metals from computer Printed Circuit Boards (PCBs) based on mineral processing methods.

PubMed

Sarvar, Mojtaba; Salarirad, Mohammad Mehdi; Shabani, Mohammad Amin

2015-11-01

In this paper, a novel mechanical process is proposed for enriching metal content of computer Printed Circuit Boards (PCBs). The PCBs are crushed and divided into three different size fractions namely: -0.59, +0.59 to 1.68 and +1.68 mm. Wet jigging and froth flotation methods are selected for metal enrichment. The coarse size fraction (+1.68 mm) is processed by jigging. The plastic free product is grinded and screened. The oversized product is separated as the first concentrate. It was rich of metal because the grinding process was selective. The undersized product is processed by froth flotation. Based on the obtained results, the middle size fraction (+0.59 to 1.68 mm) and the small size fraction (-0.59 mm) are processed by wet jigging and froth flotation respectively. The wet jigging process is optimized by investigating the effect of pulsation frequency and water flow rate. The results of examining the effect of particle size, solid to liquid ratio, conditioning time and using apolar collector showed that collectorless flotation is a promising method for separating nonmetals of PCBs. 95.6%, 97.5% and 85% of metal content of coarse size, middle size and small size fraction are recovered. The grades of obtained concentrates were 63.3%, 92.5% and 75% respectively. The total recovery is calculated as 95.64% and the grade of the final concentrate was 71.26%. Determining the grade of copper and gold in the final product reveals that 4.95% of copper and 24.46% of gold are lost during the concentration. The major part of the lost gold is accumulated in froth flotation tail. Copyright © 2015 Elsevier Ltd. All rights reserved.

Development of two-step process for enhanced biorecovery of Cu-Zn-Ni from computer printed circuit boards.

PubMed

Shah, Monal B; Tipre, Devayani R; Purohit, Mamta S; Dave, Shailesh R

2015-08-01

Metal pollution due to the huge electronic waste (E-waste) accumulation is widespread across the globe. Extraction of copper, zinc and nickel from computer printed circuit boards (c-PCB) with a two-step bleaching process using ferric sulphate generated by Leptospirillum ferriphilum dominated consortium and the factors influencing the process were investigated in the present study. The studied factors with 10 g/L pulp density showed that pH 2.0 was optimum which resulted in 87.50-97.80% Cu-Zn-Ni extraction. Pre-treatment of PCB powder with acidified distilled water and NaCl solution showed 3.80-7.98% increase in metal extraction corresponding to 94.08% Cu, 99.80% Zn and 97.99% Ni extraction. Particle size of 75 μm for Cu and Zn while 1680 μm for Ni showed 2-folds increase in metal extraction, giving 97.35-99.80% Cu-Zn-Ni extraction in 2-6 days of reaction time. Whereas; 2.76-3.12 folds increase in Cu and Zn extraction was observed with the addition of 0.1% chelating agents. When the studies were carried out with high pulp density, ferric iron concentration of 16.57 g/L was found to be optimum for metal extraction from 75 g/L c-PCB and c-PCB addition in multiple installments resulted in 8.81-26.35% increase in metal extraction compared to single addition. The studied factors can be implemented for the scale-up aimed at faster recovery of multimetals from E-waste and thereby providing a secondary source of metal in an eco-friendly manner. Copyright © 2014 The Society for Biotechnology, Japan. Published by Elsevier B.V. All rights reserved.

Qualitative and quantitative metals liberation assessment for characterization of various waste printed circuit boards for recycling.

PubMed

Priya, Anshu; Hait, Subrata

2017-12-01

Metals liberation and composition are decisive attributes in characterization of e-waste for metal recycling. Though end-of-life printed circuit board (PCB) is an integral part of e-waste as secondary resource reservoir, yet no standardized procedure exists for metals liberation and dissolution for its characterization. Thus, the paper aims at assessment of metals liberation upon comminution employing scanning electron microscopy with energy dispersive X-ray spectroscopy (SEM-EDS) followed by comparative assessment of the existing United States Environmental Protection Agency (USEPA) digestion procedures, viz., USEPA 3050B, USEPA 3051A, and USEPA 3052, in effective dissolution of metals from comminuted particles of waste PCBs of computer, laptop, mobile phone, and television. Effect of comminution and digestion conditions was assessed to have significant role in metal liberation and dissolution from PCBs. The SEM-EDS analysis demonstrated partial release of metals from the silica matrix of PCBs. The USEPA digestion methods showed statistically significant (P < 0.05) difference with greater dissolution of metals complexed to PCB matrix by the USEPA 3052 method owing to use of strong acid like hydrofluoric acid. Base metals like Cu and Zn and toxic metals such as Pb and Cd were present in abundance in PCBs and in general exceeded the total threshold limit concentration (TTLC). The maximum contents of Cu (20.13 ± 0.04 wt.%) and Zn (1.89 ± 0.05 wt.%) in laptop PCBs, Pb (2.26 ± 0.08 wt.%) in TV PCBs, and Cd (0.0812 ± 0.0008 wt.%) in computer PCBs were observed.

77 FR 7562 - Electronic On-Board Recorders and Hours of Service Supporting Documents

Federal Register 2010, 2011, 2012, 2013, 2014

2012-02-13

..., and 395 [Docket No. FMCSA-2010-0167] RIN 2126-AB20 Electronic On-Board Recorders and Hours of Service... intent. SUMMARY: FMCSA announces its intent to move forward with the Electronic On-Board Recorders and... Appeals for the Seventh Circuit. OOIDA raised several concerns relating to EOBRs and their potential use...

Electronic Circuit Analysis Language (ECAL)

NASA Astrophysics Data System (ADS)

Chenghang, C.

1983-03-01

The computer aided design technique is an important development in computer applications and it is an important component of computer science. The special language for electronic circuit analysis is the foundation of computer aided design or computer aided circuit analysis (abbreviated as CACD and CACA) of simulated circuits. Electronic circuit analysis language (ECAL) is a comparatively simple and easy to use circuit analysis special language which uses the FORTRAN language to carry out the explanatory executions. It is capable of conducting dc analysis, ac analysis, and transient analysis of a circuit. Futhermore, the results of the dc analysis can be used directly as the initial conditions for the ac and transient analyses.

Hazardous Waste Cleanup: Marlborough Press LTD in Plainview, New York

EPA Pesticide Factsheets

This parcel is located in an industrial park in Plainview, Nassau County, New York. It was operated as Three Dimensional Circuits from 1970 to 1984, manufacturing electronic circuit boards. During its operation, the site discharged metal plating solutions

Assembling surface mounted components on ink-jet printed double sided paper circuit board.

PubMed

Andersson, Henrik A; Manuilskiy, Anatoliy; Haller, Stefan; Hummelgård, Magnus; Sidén, Johan; Hummelgård, Christine; Olin, Håkan; Nilsson, Hans-Erik

2014-03-07

Printed electronics is a rapidly developing field where many components can already be manufactured on flexible substrates by printing or by other high speed manufacturing methods. However, the functionality of even the most inexpensive microcontroller or other integrated circuit is, at the present time and for the foreseeable future, out of reach by means of fully printed components. Therefore, it is of interest to investigate hybrid printed electronics, where regular electrical components are mounted on flexible substrates to achieve high functionality at a low cost. Moreover, the use of paper as a substrate for printed electronics is of growing interest because it is an environmentally friendly and renewable material and is, additionally, the main material used for many packages in which electronics functionalities could be integrated. One of the challenges for such hybrid printed electronics is the mounting of the components and the interconnection between layers on flexible substrates with printed conductive tracks that should provide as low a resistance as possible while still being able to be used in a high speed manufacturing process. In this article, several conductive adhesives are evaluated as well as soldering for mounting surface mounted components on a paper circuit board with ink-jet printed tracks and, in addition, a double sided Arduino compatible circuit board is manufactured and programmed.

Pyrolysis characteristics of integrated circuit boards at various particle sizes and temperatures.

PubMed

Chiang, Hung-Lung; Lin, Kuo-Hsiung; Lai, Mei-Hsiu; Chen, Ting-Chien; Ma, Sen-Yi

2007-10-01

A pyrolysis method was employed to recycle the metals and brominated compounds blended into printed circuit boards. This research investigated the effect of particle size and process temperature on the element composition of IC boards and pyrolytic residues, liquid products, and water-soluble ionic species in the exhaust, with the overall goal being to identify the pyrolysis conditions that will have the least impact on the environment. Integrated circuit (IC) boards were crushed into 5-40 mesh (0.71-4.4mm), and the crushed particles were pyrolyzed at temperatures ranging from 200 to 500 degrees C. The thermal decomposition kinetics were measured by a thermogravimetric (TG) analyzer. The composition of pyrolytic residues was analyzed by Energy Dispersive X-ray Spectrometer (EDS), Inductively Coupled Plasma Atomic Emission Spectrometer (ICP-AES) and Inductively Coupled Plasma-Mass Spectrometry (ICP-MS). In addition, the element compositions of liquid products were analyzed by ICP-AES and ICP-MS. Pyrolytic exhaust was collected by a water-absorption system in an ice-bath cooler, and IC analysis showed that the absorbed solution comprised 11 ionic species. Based on the pyrolytic kinetic parameters of TG analysis and pyrolytic residues at various temperatures for 30 min, the effect of particle size was insignificant in this study, and temperature was the key factor for the IC board pyrolysis. Two stages of decomposition were found for IC board pyrolysis under nitrogen atmosphere. The activation energy was 38-47 kcal/mol for the first-stage reaction and 5.2-9.4 kcal/mol for the second-stage reaction. Metal content was low in the liquid by-product of the IC board pyrolysis process, which is an advantage in that the liquid product could be used as a fuel. Brominate and ammonium were the main water-soluble ionic species of the pyrolytic exhaust. A plan for their safe and effective disposal must be developed if the pyrolytic recycling process is to be applied to IC boards.

Effects of mould on electrochemical migration behaviour of immersion silver finished printed circuit board.

PubMed

Yi, Pan; Xiao, Kui; Dong, Chaofang; Zou, Shiwen; Li, Xiaogang

2018-02-01

The role played by mould in the electrochemical migration (ECM) behaviour of an immersion silver finished printed circuit board (PCB-ImAg) under a direct current (DC) bias was investigated. An interesting phenomenon is found whereby mould, especially Aspergillus niger, can preferentially grow well on PCB-ImAg under electrical bias and then bridge integrated circuits and form a migration path. The cooperation of the mould and DC bias aggravates the ECM process occurring on PCB-ImAg. When the bias voltage is below 15V, ECM almost does not occur for Ag coating. Mechanisms that explain the ECM processes of PCB-ImAg in the presence of mould and DC bias are proposed. Copyright © 2017. Published by Elsevier B.V.

Estimation of Operating Condition of Appliances Using Circuit Current Data on Electric Distribution Boards

NASA Astrophysics Data System (ADS)

Iwafune, Yumiko; Ogimoto, Kazuhiko; Yagita, Yoshie

The Energy management systems (EMS) on demand sides are expected as a method to enhance the capability of supply and demand balancing of a power system under the anticipated penetration of renewable energy generation such as Photovoltaics (PV). Elucidation of energy consumption structure in a building is one of important elements for realization of EMS and contributes to the extraction of potential energy saving. In this paper, we propose the estimation method of operating condition of household appliances using circuit current data on an electric distribution board. Circuit current data are broken down by their shape using a self-organization map method and aggregated by appliance based on customers' information of appliance possessed. Proposed method is verified using residential energy consumption measurement survey data.

46 CFR 97.55-1 - Master's responsibility.

Code of Federal Regulations, 2010 CFR

2010-10-01

... OPERATIONS De-Energizing of Cargo Hold Lighting Circuits When Grain or Other Combustible Bulk Cargo Is... be loaded de-energized at the distribution panel or panel board. He shall thereafter have periodic... circuits remain de-energized while this bulk cargo remains within the vessel. ...

An advanced study on the hydrometallurgical processing of waste computer printed circuit boards to extract their valuable content of metals.

PubMed

Birloaga, Ionela; Coman, Vasile; Kopacek, Bernd; Vegliò, Francesco

2014-12-01

This study refers to two chemical leaching systems for the base and precious metals extraction from waste printed circuit boards (WPCBs); sulfuric acid with hydrogen peroxide have been used for the first group of metals, meantime thiourea with the ferric ion in sulfuric acid medium were employed for the second one. The cementation process with zinc, copper and iron metal powders was attempted for solutions purification. The effects of hydrogen peroxide volume in rapport with sulfuric acid concentration and temperature were evaluated for oxidative leaching process. 2M H2SO4 (98% w/v), 5% H2O2, 25 °C, 1/10 S/L ratio and 200 rpm were founded as optimal conditions for Cu extraction. Thiourea acid leaching process, performed on the solid filtrate obtained after three oxidative leaching steps, was carried out with 20 g/L of CS(NH2)2, 6g/L of Fe(3+), 0.5M H2SO4, The cross-leaching method was applied by reusing of thiourea liquid suspension and immersing 5 g/L of this reagent for each other experiment material of leaching. This procedure has lead to the doubling and, respectively, tripling, of gold and silver concentrations into solution. These results reveal a very efficient, promising and environmental friendly method for WPCBs processing. Copyright © 2014 Elsevier Ltd. All rights reserved.

Comprehensive characterization of printed circuit boards of various end-of-life electrical and electronic equipment for beneficiation investigation.

PubMed

Anshu Priya; Hait, Subrata

2018-05-01

Comprehensive characterization of printed circuit board (PCB) of end-of-life electrical and electronic equipment (EEE) is obligatory for prospective profitable beneficiation. In this study, beneficiation oriented comprehensive characterization of two brands of PCBs each of 16 end-of-life EEE was conducted in terms of their physicochemical characteristics with special emphasis on the content of 16 general elements, 2 precious metals and 15 rare earth elements (REEs). General elements and their highest weight percent composition found in different PCBs of the EEEs were Cu (23% in laptop), Al (6% in computer), Pb (15% in DVD player) and Ba (7% in TV). The high abundant of precious metals such as Au (316 g/ton) and Ag (636 g/ton) in mobile phone and laptop, respectively coupled with rapid obsolescence age makes waste PCBs of information technology and telecommunication equipment the most potent resource reservoir. Additionally, most of the waste PCBs were observed to contain REEs in considerable quantity with Sc up to 31 g/ton and Ce up to 13 g/ton being the major constituents. Comprehensive characterization of waste PCBs therefore will systematically help towards better understanding of e-waste recycling processes for beneficiation purpose and sustainable resource circulation and conservation. Copyright © 2018 Elsevier Ltd. All rights reserved.

Synthetic Analog and Digital Circuits for Cellular Computation and Memory

PubMed Central

Purcell, Oliver; Lu, Timothy K.

2014-01-01

Biological computation is a major area of focus in synthetic biology because it has the potential to enable a wide range of applications. Synthetic biologists have applied engineering concepts to biological systems in order to construct progressively more complex gene circuits capable of processing information in living cells. Here, we review the current state of computational genetic circuits and describe artificial gene circuits that perform digital and analog computation. We then discuss recent progress in designing gene circuits that exhibit memory, and how memory and computation have been integrated to yield more complex systems that can both process and record information. Finally, we suggest new directions for engineering biological circuits capable of computation. PMID:24794536

Design of a signal conditioner for the Fermilab Magnet Test Facility

DOE Office of Scientific and Technical Information (OSTI.GOV)

Giannelli, Pietro

2012-01-01

This thesis describes the design of a remotely-programmable signal conditioner for the harmonic measurement of accelerator magnets. A 10-channel signal conditioning circuit featuring bucking capabilities was designed from scratch and implemented to the level of the printed circuit board layout. Other system components were chosen from those available on the market. Software design was started with the definition of routine procedures. This thesis is part of an upgrade project for replacing obsolescent automated test equipment belonging to the Fermilab Magnet Test Facility. The design started with a given set of requirements. Using a top-down approach, all the circuits were designedmore » and their expected performances were theoretically predicted and simulated. A limited prototyping phase followed. The printed circuit boards were laid out and routed using a CAD software and focusing the design on maximum electromagnetic interference immunity. An embedded board was selected for controlling and interfacing the signal conditioning circuitry with the instrumentation network. Basic low level routines for hardware access were defined. This work covered the entire design process of the signal conditioner, resulting in a project ready for manufacturing. The expected performances are in line with the requirements and, in the cases where this was not possible, approval of trade-offs was sought and received from the end users. Part I deals with the global structure of the signal conditioner and the subdivision in functional macro-blocks. Part II treats the hardware design phase in detail, covering the analog and digital circuits, the printed circuit layouts, the embedded controller and the power supply selection. Part III deals with the basic hardware-related routines to be implemented in the final software.« less

Composition and Elution Behavior of Various Elements from Printed Circuit Boards, Cathode-ray Tube Glass, and Liquid-crystal Displays in Waste Consumer Electronics.

PubMed

Inaba, Kazuho; Murata, Tomoyoshi; Yamamura, Shigeki; Nagano, Masaaki; Iwasaki, Kazuhiro; Nakajima, Daisuke; Takigami, Hidetaka

2018-01-01

The contents and elution behavior of metals in consumer electronics parts were determined so as to understand their maximum environmental risk. Elements contained most in printed-circuit boards were Cu, Si, Br, Ca, Al, Sn, Pb, Sb, Ba, Fe, Ni, Ti, and Zn; in cathode-ray tube glass were Si, Pb, Ba, Sr, Zn, Zr, Ca, and Sb; in arsenic contained liquid-crystal displays were Si, Ca, Sr, Ba, As, and Fe; and in antimony contained liquid-crystal displays were Si, Ba, Ca, Sb, Sr, Fe, and Sn. The elements eluted most from printed-circuit boards were Zn, Pb, and Cu; from cathode-ray tube glass were Pb, Zn, B, Ba, and Si; and from liquid-crystal displays were B and Si, and the toxic As and Sb. The amount eluted was greatest at acidic pH. It was revealed that officially recommended 6-h-shaking with a pure water test was insufficient to understand the real environmental risk of waste electronics.

Examining the technology acceptance for dismantling of waste printed circuit boards in light of recycling and environmental concerns.

PubMed

Duan, Huabo; Hou, Kun; Li, Jinhui; Zhu, Xiaodong

2011-03-01

The dismantling of printed circuit board assemblies (PCBAs) and the recovery of their useful materials can lead to serious environmental impacts mainly due to their complicated physical structure and the variety of toxic elements contained in their material composition. So far, less attention has been paid to their responsible recycling compared to that of bare printed circuit boards. Combined with other materials recovery process, proper dismantling of PCBAs is beneficial to conserve scarce resources, reuse the components, and eliminate or safely dispose of hazardous materials. In analyzing the generation, resources potential and hazardous risk of scrap PCBAs, technologies used for the dismantling of waste PCBAs have been widely investigated and reviewed from the aspects of both industrial application and laboratory-scale studies. In addition, the feasibility of PCBA dismantling has been discussed, the determinants of which, including the heating conditions and mechanical properties have been identified. Moreover, this paper evaluates the environmental consequences caused by the dismantling of PCBAs. Copyright © 2010 Elsevier Ltd. All rights reserved.

Immobilization of Acidithiobacillus ferrooxidans on Cotton Gauze for the Bioleaching of Waste Printed Circuit Boards.

PubMed

Nie, Hongyan; Zhu, Nengwu; Cao, Yanlan; Xu, Zhiguo; Wu, Pingxiao

2015-10-01

The bioleaching parameters of metal concentrates from waste printed circuit boards by Acidithiobacillus ferrooxidans immobilized on cotton gauze in a two-step reactor were investigated in this study. The results indicated that an average ferrous iron oxidation rate of 0.54 g/(L·h) and a ferrous iron oxidation ratio of 96.90 % were obtained after 12 h at aeration rate of 1 L/min in bio-oxidation reactor. After 96 h, the highest leaching efficiency of copper reached 91.68 % under the conditions of the content of the metal powder 12 g/L, the retention time 6 h, and the aeration rate 1 L/min. The bioleaching efficiency of copper could be above 91.12 % under repeated continuous batch operation. Meanwhile, 95.32 % of zinc, 90.32 % of magnesium, 86.31 % of aluminum, and 59.07 % of nickel were extracted after 96 h. All the findings suggested that the recovery of metal concentrates from waste printed circuit boards via immobilization of A. ferrooxidans on cotton gauze was feasible.

Electrochemical Migration Behavior of Copper-Clad Laminate and Electroless Nickel/Immersion Gold Printed Circuit Boards under Thin Electrolyte Layers

PubMed Central

Yi, Pan; Xiao, Kui; Ding, Kangkang; Dong, Chaofang; Li, Xiaogang

2017-01-01

The electrochemical migration (ECM) behavior of copper-clad laminate (PCB-Cu) and electroless nickel/immersion gold printed circuit boards (PCB-ENIG) under thin electrolyte layers of different thicknesses containing 0.1 M Na2SO4 was studied. Results showed that, under the bias voltage of 12 V, the reverse migration of ions occurred. For PCB-Cu, both copper dendrites and sulfate precipitates were found on the surface of FR-4 (board material) between two plates. Moreover, the Cu dendrite was produced between the two plates and migrated toward cathode. Compared to PCB-Cu, PCB-ENIG exhibited a higher tendency of ECM failure and suffered from seriously short circuit failure under high relative humidity (RH) environment. SKP results demonstrated that surface potentials of the anode plates were greater than those of the cathode plates, and those potentials of the two plates exhibited a descending trend as the RH increased. At the end of the paper, an electrochemical migration corrosion failure model of PCB was proposed. PMID:28772497

Modular cryogenic interconnects for multi-qubit devices.

PubMed

Colless, J I; Reilly, D J

2014-11-01

We have developed a modular interconnect platform for the control and readout of multiple solid-state qubits at cryogenic temperatures. The setup provides 74 filtered dc-bias connections, 32 control and readout connections with -3 dB frequency above 5 GHz, and 4 microwave feed lines that allow low loss (less than 3 dB) transmission 10 GHz. The incorporation of a radio-frequency interposer enables the platform to be separated into two printed circuit boards, decoupling the simple board that is bonded to the qubit chip from the multilayer board that incorporates expensive connectors and components. This modular approach lifts the burden of duplicating complex interconnect circuits for every prototype device. We report the performance of this platform at milli-Kelvin temperatures, including signal transmission and crosstalk measurements.

Virtual Instrument for Determining Rate Constant of Second-Order Reaction by pX Based on LabVIEW 8.0.

PubMed

Meng, Hu; Li, Jiang-Yuan; Tang, Yong-Huai

2009-01-01

The virtual instrument system based on LabVIEW 8.0 for ion analyzer which can measure and analyze ion concentrations in solution is developed and comprises homemade conditioning circuit, data acquiring board, and computer. It can calibrate slope, temperature, and positioning automatically. When applied to determine the reaction rate constant by pX, it achieved live acquiring, real-time displaying, automatical processing of testing data, generating the report of results; and other functions. This method simplifies the experimental operation greatly, avoids complicated procedures of manual processing data and personal error, and improves veracity and repeatability of the experiment results.

24-channel dual microcontroller-based voltage controller for ion optics remote control

NASA Astrophysics Data System (ADS)

Bengtsson, L.

2018-05-01

The design of a 24-channel voltage control instrument for Wenzel Elektronik N1130 NIM modules is described. This instrument is remote controlled from a LabVIEW GUI on a host Windows computer and is intended for ion optics control in electron affinity measurements on negative ions at the CERN-ISOLDE facility. Each channel has a resolution of 12 bits and has a normally distributed noise with a standard deviation of <1 mV. The instrument is designed as a standard 2-unit NIM module where the electronic hardware consists of a printed circuit board with two asynchronously operating microcontrollers.

Wideband monolithically integrated front-end subsystems and components

NASA Astrophysics Data System (ADS)

Mruk, Joseph Rene

This thesis presents the analysis, design, and measurements of passive, monolithically integrated, wideband recta-coax and printed circuit board front-end components. Monolithic fabrication of antennas, impedance transformers, filters, and transitions lowers manufacturing costs by reducing assembly time and enhances performance by removing connectors and cabling between the devices. Computational design, fabrication, and measurements are used to demonstrate the capabilities of these front-end assemblies. Two-arm wideband planar log-periodic antennas fed using a horizontal feed that allows for filters and impedance transformers to be readily fabricated within the radiating region of the antenna are demonstrated. At microwave frequencies, low-cost printed circuit board processes are typically used to produce planar devices. A 1.8 to 11 GHz two-arm planar log-periodic antenna is designed with a monolithically integrated impedance transformer. Band rejection methods based on modifying the antenna aperture, use of an integrated filter, and the application of both methods are investigated with realized gain suppressions of over 25 dB achieved. The ability of standard circuit board technology to fabricate millimeter-wave devices up to 110 GHz is severely limited. Thin dielectrics are required to prevent the excitation of higher order modes in the microstrip substrate. Fabricating the thin line widths required for the antenna aperture also becomes prohibitively challenging. Surface micro-machining typically used in the fabrication of MEMS devices is capable of producing the extremely small features that can be used to fabricate antennas extending through W-band. A directly RF fed 18 to 110 GHz planar log-periodic antenna is developed. The antenna is fabricated with an integrated impedance transformer and additional transitions for measurement characterization. Singly terminated low-loss wideband millimeter-wave filters operating over V- and W- band are developed. High quality performance of an 18 to 100 GHz front-end is realized by dividing the single instantaneous antenna into two apertures operating from 18 to 50 and 50 to 100 GHz. Each channel features an impedance transformer, low-pass (low-frequency) or band-pass (high-frequency) filter, and grounded CPW launch. This dual-aperture front-end demonstrates that micromachining technology is now capable of fabricating broadband millimeter-wave components with a high degree of integration.

Design of Advanced Atmospheric Water Vapor Differential Absorption Lidar (DIAL) Detection System

NASA Technical Reports Server (NTRS)

Refaat, Tamer F.; Luck, William S., Jr.; DeYoung, Russell J.

1999-01-01

The measurement of atmospheric water vapor is very important for understanding the Earth's climate and water cycle. The lidar atmospheric sensing experiment (LASE) is an instrument designed and operated by the Langley Research Center for high precision water vapor measurements. The design details of a new water vapor lidar detection system that improves the measurement sensitivity of the LASE instrument by a factor of 10 are discussed. The new system consists of an advanced, very low noise, avalanche photodiode (APD) and a state-of-the-art signal processing circuit. The new low-power system is also compact and lightweight so that it would be suitable for space flight and unpiloted atmospheric vehicles (UAV) applications. The whole system is contained on one small printed circuit board (9 x 15 sq cm). The detection system is mounted at the focal plane of a lidar receiver telescope, and the digital output is read by a personal computer with a digital data acquisition card.

46 CFR 78.70-1 - Master's responsibility.

Code of Federal Regulations, 2010 CFR

2010-10-01

... Shipping COAST GUARD, DEPARTMENT OF HOMELAND SECURITY (CONTINUED) PASSENGER VESSELS OPERATIONS De... shall have the lighting circuits to cargo compartments in which the bulk cargo is to be loaded de... the panel or panel board as frequently as necessary to ascertain that the affected circuits remain de...

46 CFR 78.70-1 - Master's responsibility.

Code of Federal Regulations, 2011 CFR

2011-10-01

... Shipping COAST GUARD, DEPARTMENT OF HOMELAND SECURITY (CONTINUED) PASSENGER VESSELS OPERATIONS De... shall have the lighting circuits to cargo compartments in which the bulk cargo is to be loaded de... the panel or panel board as frequently as necessary to ascertain that the affected circuits remain de...

Modular control subsystems for use in solar heating systems for multi-family dwellings

NASA Technical Reports Server (NTRS)

1977-01-01

Progress in the development of solar heating modular control subsystems is reported. Circuit design, circuit drawings, and printed circuit board layout are discussed along with maintenance manuals, installation instructions, and verification and acceptance tests. Calculations made to determine the predicted performance of the differential thermostat are given including details and results of tests for the offset temperature, and boil and freeze protect points.

Phoenix Interferometer

DTIC Science & Technology

1975-06-01

proportioning circuit , Triac , and heater blankets. The significant features of the temperature controllers are small size, less than one half per...interferometer. The only change to the Firebird system needed to ac- commodate the new sensor is the replacement of several circuit boards. No hard wiring or...temperature at altitude (220oK). In addition to the sensor head, the Phoe- nix system also includes a set of plug-in printed circuit cards which

Effect of Bypass Capacitor in Common-mode Noise Reduction Technique for Automobile PCB

NASA Astrophysics Data System (ADS)

Uno, Takanori; Ichikawa, Kouji; Mabuchi, Yuichi; Nakamura, Atushi

In this letter, we studied the use of common mode noise reduction technique for in-vehicle electronic equipment, each comprising large-scale integrated circuit (LSI), printed circuit board (PCB), wiring harnesses, and ground plane. We have improved the model circuit of the common mode noise that flows to the wire harness to add the effect of by-pass capacitors located near an LSI.

A low-noise low-power EEG acquisition node for scalable brain-machine interfaces

NASA Astrophysics Data System (ADS)

Sullivan, Thomas J.; Deiss, Stephen R.; Cauwenberghs, Gert; Jung, Tzyy-Ping

2007-05-01

Electroencephalograph (EEG) recording systems offer a versatile, noninvasive window on the brain's spatio-temporal activity for many neuroscience and clinical applications. Our research aims at improving the spatial resolution and mobility of EEG recording by reducing the form factor, power drain and signal fanout of the EEG acquisition node in a scalable sensor array architecture. We present such a node integrated onto a dimesized circuit board that contains a sensor's complete signal processing front-end, including amplifier, filters, and analog-to-digital conversion. A daisy-chain configuration between boards with bit-serial output reduces the wiring needed. The circuit's low power consumption of 423 μW supports EEG systems with hundreds of electrodes to operate from small batteries for many hours. Coupling between the bit-serial output and the highly sensitive analog input due to dense integration of analog and digital functions on the circuit board results in a deterministic noise component in the output, larger than the intrinsic sensor and circuit noise. With software correction of this noise contribution, the system achieves an input-referred noise of 0.277 μVrms in the signal band of 1 to 100 Hz, comparable to the best medical-grade systems in use. A chain of seven nodes using EEG dry electrodes created in micro-electrical-mechanical system (MEMS) technology is demonstrated in a real-world setting.

Spatial part-set cuing facilitation.

PubMed

Kelley, Matthew R; Parasiuk, Yuri; Salgado-Benz, Jennifer; Crocco, Megan

2016-07-01

Cole, Reysen, and Kelley [2013. Part-set cuing facilitation for spatial information. Journal of Experimental Psychology: Learning, Memory, & Cognition, 39, 1615-1620] reported robust part-set cuing facilitation for spatial information using snap circuits (a colour-coded electronics kit designed for children to create rudimentary circuit boards). In contrast, Drinkwater, Dagnall, and Parker [2006. Effects of part-set cuing on experienced and novice chess players' reconstruction of a typical chess midgame position. Perceptual and Motor Skills, 102(3), 645-653] and Watkins, Schwartz, and Lane [1984. Does part-set cuing test for memory organization? Evidence from reconstructions of chess positions. Canadian Journal of Psychology/Revue Canadienne de Psychologie, 38(3), 498-503] showed no influence of part-set cuing for spatial information when using chess boards. One key difference between the two procedures was that the snap circuit stimuli were explicitly connected to one another, whereas chess pieces were not. Two experiments examined the effects of connection type (connected vs. unconnected) and cue type (cued vs. uncued) on memory for spatial information. Using chess boards (Experiment 1) and snap circuits (Experiment 2), part-set cuing facilitation only occurred when the stimuli were explicitly connected; there was no influence of cuing with unconnected stimuli. These results are potentially consistent with the retrieval strategy disruption hypothesis, as well as the two- and three-mechanism accounts of part-set cuing.

Recycling-oriented characterization of plastic frames and printed circuit boards from mobile phones by electronic and chemical imaging

DOE Office of Scientific and Technical Information (OSTI.GOV)

Palmieri, Roberta; Bonifazi, Giuseppe; Serranti, Silvia, E-mail: silvia.serranti@uniroma1.it

Highlights: • A recycling oriented characterization of end-of-life mobile phones was carried out. • Characterization was developed in a zero-waste-perspective, aiming to recover all the mobile phone materials. • Plastic frames and printed circuit boards were analyzed by electronic and chemical imaging. • Suitable milling/classification strategies were set up to define specialized-pre-concentrated-streams. • The proposed approach can improve the recovery of polymers, base/precious metals, rare earths and critical raw materials. - Abstract: This study characterizes the composition of plastic frames and printed circuit boards from end-of-life mobile phones. This knowledge may help define an optimal processing strategy for using thesemore » items as potential raw materials. Correct handling of such a waste is essential for its further “sustainable” recovery, especially to maximize the extraction of base, rare and precious metals, minimizing the environmental impact of the entire process chain. A combination of electronic and chemical imaging techniques was thus examined, applied and critically evaluated in order to optimize the processing, through the identification and the topological assessment of the materials of interest and their quantitative distribution. To reach this goal, end-of-life mobile phone derived wastes have been systematically characterized adopting both “traditional” (e.g. scanning electronic microscopy combined with microanalysis and Raman spectroscopy) and innovative (e.g. hyperspectral imaging in short wave infrared field) techniques, with reference to frames and printed circuit boards. Results showed as the combination of both the approaches (i.e. traditional and classical) could dramatically improve recycling strategies set up, as well as final products recovery.« less

PCBA depaneling stress minimization study

NASA Astrophysics Data System (ADS)

Darus, M. H. B. M.; Aziz, M. H. B. A.; Ong, N. R.; Alcain, J. B.; Retnasamy, V.

2017-09-01

Printed circuit board (PCB) is board that used to connect the electricity using the conductive pathways. The PCB that consists with electronic components was called as printed circuit board assembly (PCBA). Bending process has been used as one of the depaneling techniques may contribute to mechanical stress and the failure of capacitors and other components to function. As a result, the idea to create holes in particular location was implemented in order to absorb the stress. In this study, finite element analysis is demonstrated by using ANSYS software. Two PCBA design models are considered in order to investigate the effect of the hole and the stress response. The simulation results show that the hole on the PCBA has reduced the stress. For Design model 2, the stress response of the holes located vertically to the PCBA is lower than the holes located horizontally to the PCBA.

Compact low-noise preamplifier for noise spectroscopy with biased photodiodes in cargo inspection systems

NASA Astrophysics Data System (ADS)

Benetti, Bob; Langeveld, Willem G. J.

2013-09-01

Noise Spectroscopy, a.k.a. Z-determination by Statistical Count-rate ANalysis (Z-SCAN), is a statistical technique to determine a quantity called the "noise figure" from digitized waveforms of pulses of transmitted x-rays in cargo inspection systems. Depending only on quantities related to the x-ray energies, it measures a characteristic of the transmitted x-ray spectrum, which depends on the atomic number, Z, of the material penetrated. The noise figure can thus be used for material separation. In an 80-detector prototype, scintillators are used with large-area photodiodes biased at 80V and digitized using 50-MSPS 12-bit ADC boards. We present an ultra-compact low-noise preamplifier design, with one high-gain and one low-gain channel per detector for improved dynamic range. To achieve adequate detection sensitivity and spatial resolution each dual-gain preamplifier channel must fit within a 12.7 mm wide circuit board footprint and maintain adequate noise immunity to conducted and radiated interference from adjacent channels. The novel design included iterative SPICE analysis of transient response, dynamic range, frequency response, and noise analysis to optimize the selection and configuration of amplifiers and filter response. We discuss low-noise active and passive components and low-noise techniques for circuit board layout that are essential to achieving the design goals, and how the completed circuit board performed in comparison to the predicted responses.

Three-phase short circuit calculation method based on pre-computed surface for doubly fed induction generator

NASA Astrophysics Data System (ADS)

Ma, J.; Liu, Q.

2018-02-01

This paper presents an improved short circuit calculation method, based on pre-computed surface to determine the short circuit current of a distribution system with multiple doubly fed induction generators (DFIGs). The short circuit current, injected into power grid by DFIG, is determined by low voltage ride through (LVRT) control and protection under grid fault. However, the existing methods are difficult to calculate the short circuit current of DFIG in engineering practice due to its complexity. A short circuit calculation method, based on pre-computed surface, was proposed by developing the surface of short circuit current changing with the calculating impedance and the open circuit voltage. And the short circuit currents were derived by taking into account the rotor excitation and crowbar activation time. Finally, the pre-computed surfaces of short circuit current at different time were established, and the procedure of DFIG short circuit calculation considering its LVRT was designed. The correctness of proposed method was verified by simulation.

Zero Tolerance versus Privacy.

ERIC Educational Resources Information Center

Dowling-Sendor, Benjamin

2000-01-01

In a case involving questionable canine search-and-seizure practices, a circuit court upheld a school board's decision to terminate a teacher's contract. While touting zero tolerance, the board fired an honored teacher 3 years from retirement who may not have known about the marijuana cigarette in her car. (MLH)

78 FR 37203 - Authorization of Production Activity; Subzone 196A; TTI, Inc. (Electromechanical and Circuit...

Federal Register 2010, 2011, 2012, 2013, 2014

2013-06-20

... DEPARTMENT OF COMMERCE Foreign-Trade Zones Board [B-20-2013] Authorization of Production Activity; Subzone 196A; TTI, Inc. (Electromechanical and Circuit Protection Devices Production/Kitting); Fort Worth, Texas On February 13, 2013, TTI, Inc. submitted a notification of proposed production activity to the...

Capacitance discharge system for ignition of Single Bridge Apollo Standard Initiators (SBASI)

NASA Technical Reports Server (NTRS)

Ward, R. D.

1974-01-01

The design support data developed during the single bridge Apollo standard initiator (SBASI) program are presented. A circuit was designed and bread-board tested to verify operational capabilities of the circuit. Test data, design criteria, weight, and reliability trade-off considerations, and final design recommendations are reported.

Stable Polyurethane Coatings for Electronic Circuits

NASA Technical Reports Server (NTRS)

Morris, D. E.

1983-01-01

Alkane-based polyurethanes resist deterioration while maintaining good dielectric properties. Weight loss after prolonged immersion in hot water far less for alkane-based polyurethanes than for more common ether based polyurethanes, at any given oxygen content. Major uses of polyurethanes are as connector potting materials and conformal coatings for printed circuit boards.

Structural Dynamics of Electronic Systems

NASA Astrophysics Data System (ADS)

Suhir, E.

2013-03-01

The published work on analytical ("mathematical") and computer-aided, primarily finite-element-analysis (FEA) based, predictive modeling of the dynamic response of electronic systems to shocks and vibrations is reviewed. While understanding the physics of and the ability to predict the response of an electronic structure to dynamic loading has been always of significant importance in military, avionic, aeronautic, automotive and maritime electronics, during the last decade this problem has become especially important also in commercial, and, particularly, in portable electronics in connection with accelerated testing of various surface mount technology (SMT) systems on the board level. The emphasis of the review is on the nonlinear shock-excited vibrations of flexible printed circuit boards (PCBs) experiencing shock loading applied to their support contours during drop tests. At the end of the review we provide, as a suitable and useful illustration, the exact solution to a highly nonlinear problem of the dynamic response of a "flexible-and-heavy" PCB to an impact load applied to its support contour during drop testing.

Integrated testing system FiTest for diagnosis of PCBA

NASA Astrophysics Data System (ADS)

Bogdan, Arkadiusz; Lesniak, Adam

2016-12-01

This article presents the innovative integrated testing system FiTest for automatic, quick inspection of printed circuit board assemblies (PCBA) manufactured in Surface Mount Technology (SMT). Integration of Automatic Optical Inspection (AOI), In-Circuit Tests (ICT) and Functional Circuit Tests (FCT) resulted in universal hardware platform for testing variety of electronic circuits. The platform provides increased test coverage, decreased level of false calls and optimization of test duration. The platform is equipped with powerful algorithms performing tests in a stable and repetitive way and providing effective management of diagnosis.

Reusable vibration resistant integrated circuit mounting socket

DOEpatents

Evans, Craig N.

1995-01-01

This invention discloses a novel form of socket for integrated circuits to be mounted on printed circuit boards. The socket uses a novel contact which is fabricated out of a bimetallic strip with a shape which makes the end of the strip move laterally as temperature changes. The end of the strip forms a barb which digs into an integrated circuit lead at normal temperatures and holds it firmly in the contact, preventing loosening and open circuits from vibration. By cooling the contact containing the bimetallic strip the barb end can be made to release so that the integrated circuit lead can be removed from the socket without damage either to the lead or to the socket components.

Radome Positioner for the RFSS (Radio Frequency Simulation System).

DTIC Science & Technology

1978-02-27

its associated circuits contained on the Motorola M68MM01A-I micro- module (See Drawing 64). This board contains the 6800 microprocessor. Ik bytes of...D 00 1~ 0 41 + C.) ) -44 208 g. Small encoder diameter achieved by using integrated circuit modules . h. Stainless steel case. U...to the 30 integrated circuits which actually comprise the heart of the-microcomputer. This dramatic reduction in parts count re- sults in a similar

Arrays of Miniature Microphones for Aeroacoustic Testing

NASA Technical Reports Server (NTRS)

Shams, Qamar A.; Humphreys, William M.; Sealey, Bradley S.; Bartram, Scott M.; Zuckewar, Allan J.; Comeaux, Toby; Adams, James K.

2007-01-01

A phased-array system comprised of custom-made and commercially available microelectromechanical system (MEMS) silicon microphones and custom ancillary hardware has been developed for use in aeroacoustic testing in hard-walled and acoustically treated wind tunnels. Recent advances in the areas of multi-channel signal processing and beam forming have driven the construction of phased arrays containing ever-greater numbers of microphones. Traditional obstacles to this trend have been posed by (1) the high costs of conventional condenser microphones, associated cabling, and support electronics and (2) the difficulty of mounting conventional microphones in the precise locations required for high-density arrays. The present development overcomes these obstacles. One of the hallmarks of the new system is a series of fabricated platforms on which multiple microphones can be mounted. These mounting platforms, consisting of flexible polyimide circuit-board material (see left side of figure), include all the necessary microphone power and signal interconnects. A single bus line connects all microphones to a common power supply, while the signal lines terminate in one or more data buses on the sides of the circuit board. To minimize cross talk between array channels, ground lines are interposed as shields between all the data bus signal lines. The MEMS microphones are electrically connected to the boards via solder pads that are built into the printed wiring. These flexible circuit boards share many characteristics with their traditional rigid counterparts, but can be manufactured much thinner, as small as 0.1 millimeter, and much lighter with boards weighing as much as 75 percent less than traditional rigid ones. For a typical hard-walled wind-tunnel installation, the flexible printed-circuit board is bonded to the tunnel wall and covered with a face sheet that contains precise cutouts for the microphones. Once the face sheet is mounted, a smooth surface is established over the entire array due to the flush mounting of all microphones (see right side of figure). The face sheet is made from a continuous glass-woven-fabric base impregnated with an epoxy resin binder. This material offers a combination of high mechanical strength and low dielectric loss, making it suitable for withstanding the harsh test section environment present in many wind tunnels, while at the same time protecting the underlying polyimide board. Customized signal-conditioning hardware consisting of line drivers and antialiasing filters are coupled with the array. The line drivers are constructed using low-supply-current, high-gain-bandwidth operational amplifiers designed to transmit the microphone signals several dozen feet from the array to external acquisition hardware. The anti-alias filters consist of individual Chebyshev low-pass filters (one for each microphone channel) housed on small printed-circuit boards mounted on one or more motherboards. The mother/daughter board design results in a modular system, which is easy to debug and service and which enables the filter characteristics to be changed by swapping daughter boards with ones containing different filter parameters. The filter outputs are passed to commercially- available acquisition hardware to digitize and store the conditioned microphone signals. Wind-tunnel testing of the new MEMS microphone polyimide mounting system shows that the array performance is comparable to that of traditional arrays, but with significantly less cost of construction.

Microfluidic networks embedded in a printed circuit board

NASA Astrophysics Data System (ADS)

Dong, Liangwei; Hu, Yueli

2017-07-01

In order to improve the robustness of microfluidic networks in printed circuit board (PCB)-based microfluidic platforms, a new method was presented. A pattern in a PCB was formed using hollowed-out technology. Polydimethylsiloxane was partly filled in the hollowed-out fields after mounting an adhesive tape on the bottom of the PCB, and solidified in an oven. Then, microfluidic networks were built using soft lithography technology. Microfluidic transportation and dilution operations were demonstrated using the fabricated microfluidic platform. Results show that this method can embed microfluidic networks into a PCB, and microfluidic operations can be implemented in the microfluidic networks embedded into the PCB.

Housing And Mounting Structure

DOEpatents

Anderson, Gene R.; Armendariz, Marcelino G.; Baca, Johnny R.F.; Bryan, Robert P.; Carson, Richard F.; Duckett, III, Edwin B.; McCormick, Frederick B.; Miller, Gregory V.; Peterson, David W.; Smith, Terrance T.

2005-03-08

This invention relates to an optical transmitter, receiver or transceiver module, and more particularly, to an apparatus for connecting a first optical connector to a second optical connector. The apparatus comprises: (1) a housing having at least a first end and at least a second end, the first end of the housing capable of receiving the first optical connector, and the second end of the housing capable of receiving the second optical connector; (2) a longitudinal cavity extending from the first end of the housing to the second end of the housing; and (3) an electromagnetic shield comprising at least a portion of the housing. This invention also relates to an apparatus for housing a flexible printed circuit board, and this apparatus comprises: (1) a mounting structure having at least a first surface and a second surface; (2) alignment ridges along the first and second surfaces of the mounting structure, the alignment ridges functioning to align and secure a flexible printed circuit board that is wrapped around and attached to the first and second surfaces of the mounting structure; and (3) a series of heat sink ridges adapted to the mounting structure, the heat sink ridges functioning to dissipate heat that is generated from the flexible printed circuit board.

Toward environmentally-benign utilization of nonmetallic fraction of waste printed circuit boards as modifier and precursor.

PubMed

Hadi, Pejman; Ning, Chao; Ouyang, Weiyi; Xu, Meng; Lin, Carol S K; McKay, Gordon

2015-01-01

Electronic waste, including printed circuit boards, is growing at an alarming rate due to the accelerated technological progress and the shorter lifespan of the electronic equipment. In the past decades, due to the lack of proper economic and environmentally-benign recycling technologies, a major fraction of e-waste generated was either destined to landfills or incinerated with the sole intention of its disposal disregarding the toxic nature of this waste. Recently, with the increasing public awareness over their environment and health issues and with the enaction of more stringent regulations, environmentally-benign recycling has been driven to be an alternative option partially replacing the traditional eco-unfriendly disposal methods. One of the most favorable green technologies has been the mechanical separation of the metallic and nonmetallic fraction of the waste printed circuit boards. Although metallic fraction, as the most profitable component, is used to generate the revenue of the separation process, the nonmetallic fraction (NMF) has been left isolated. Herein, the recent developments in the application of NMF have been comprehensively reviewed and an eco-friendly emerging usage of NMF as a value-added material for sustainable remediation has been introduced. Copyright © 2014 Elsevier Ltd. All rights reserved.

Recycling-oriented characterization of plastic frames and printed circuit boards from mobile phones by electronic and chemical imaging.

PubMed

Palmieri, Roberta; Bonifazi, Giuseppe; Serranti, Silvia

2014-11-01

This study characterizes the composition of plastic frames and printed circuit boards from end-of-life mobile phones. This knowledge may help define an optimal processing strategy for using these items as potential raw materials. Correct handling of such a waste is essential for its further "sustainable" recovery, especially to maximize the extraction of base, rare and precious metals, minimizing the environmental impact of the entire process chain. A combination of electronic and chemical imaging techniques was thus examined, applied and critically evaluated in order to optimize the processing, through the identification and the topological assessment of the materials of interest and their quantitative distribution. To reach this goal, end-of-life mobile phone derived wastes have been systematically characterized adopting both "traditional" (e.g. scanning electronic microscopy combined with microanalysis and Raman spectroscopy) and innovative (e.g. hyperspectral imaging in short wave infrared field) techniques, with reference to frames and printed circuit boards. Results showed as the combination of both the approaches (i.e. traditional and classical) could dramatically improve recycling strategies set up, as well as final products recovery. Copyright © 2014 Elsevier Ltd. All rights reserved.

Ion chromatography in the manufacture of multilayer circuit boards

NASA Astrophysics Data System (ADS)

Smith, R. E.

1987-10-01

Ion chromatography (IC) has proven useful in analyzing chemical solutions used in the manufacture of multilayer circuit boards. IC provides results on ions not expected in the production solutions. Thus, solution contamination and breakdown products can be monitored in every phase of the circuit board manufacturing. During the first phase, epoxy laminates experience an etchback, first in chromic acid, which can be analyzed for trace chloride and sulfate, then in ammonium bifluoride/HCl, which can be analyzed for fluoride and chloride. Following a wet blasting to roughen up the surface, 20 mu in. of copper are deposited using an electroless bath. Again, IC is applicable for monitoring formate, tartarate, and sulfate levels. Next, an acid copper bath is used to electroplate the through holes with 0.001 in. of ductile copper. This bath is analyzed for trace chloride. Photoimaging is then performed, and the organic solvents used can be assayed for trace ionic chloride. Finally, a fluoroboric acid-based tin-lead bath is used to deposit a solderable alloy. This bath is analyzed for total fluoroborate, tin, and lead. In addition, mobile phase ion chromatography (MPIC) is used to monitor the nonionic organic brighteners in the baths.

Ion chromatography in the manufacture of multilayer circuit boards

NASA Astrophysics Data System (ADS)

Smith, Robert E.

1990-01-01

Ion chromatography (IC) has proven useful in analyzing chemical solutions used in the manufacture of multilayer circuit boards. Unlike other chemical quantification techniques, IC provides results on ions not expected in the production solutions. Thus, solution contamination and break-down products can be monitored in every phase of the circuit board manufacturing. During the first phase, epoxy laminates experience an etchback, first in chromic acid, which can be analyzed for trace chloride and sulfate, then in ammonium bifluoride/HCl, which can be analyzed for fluoride and chloride. Following a wet-blasting to roughen up the surface, 20 microinches of copper are deposited using an electroless bath. Again, IC is applicable for monitoring formate, tartarate, and sulfate levels. Next, an acid copper bath is used to electroplate the through holes with 0.001 inches of ductile copper. This bath is analyzed for trace chloride. Photoimaging is then performed, and the organic solvents used can be assayed for trace ionic chloride. Finally, a fluoroboric acid-based tin-lead bath is used to deposit a solderable alloy. This bath is analyzed for fluoroborate, tin, and lead. In addition, mobile phase ion chromatography (MPIC) is used to monitor the nonionic organic brighteners in the baths.

Synthetic analog and digital circuits for cellular computation and memory.

PubMed

Purcell, Oliver; Lu, Timothy K

2014-10-01

Biological computation is a major area of focus in synthetic biology because it has the potential to enable a wide range of applications. Synthetic biologists have applied engineering concepts to biological systems in order to construct progressively more complex gene circuits capable of processing information in living cells. Here, we review the current state of computational genetic circuits and describe artificial gene circuits that perform digital and analog computation. We then discuss recent progress in designing gene networks that exhibit memory, and how memory and computation have been integrated to yield more complex systems that can both process and record information. Finally, we suggest new directions for engineering biological circuits capable of computation. Copyright © 2014 The Authors. Published by Elsevier Ltd.. All rights reserved.

78 FR 21642 - Self-Regulatory Organizations; Chicago Board Options Exchange, Incorporated; Order Granting...

Federal Register 2010, 2011, 2012, 2013, 2014

2013-04-11

... securities suddenly declining by significant amounts in a very short time period before suddenly reversing to... circuit breaker pilot program, which was implemented through a series of rule filings by the equity exchanges and by FINRA.\\8\\ The single-stock circuit breaker was designed to reduce extraordinary market...

Creating a transducer electronic datasheet using I2C serial EEPROM memory and PIC32-based microcontroller development board

NASA Astrophysics Data System (ADS)

Croitoru, Bogdan; Tulbure, Adrian; Abrudean, Mihail; Secara, Mihai

2015-02-01

The present paper describes a software method for creating / managing one type of Transducer Electronic Datasheet (TEDS) according to IEEE 1451.4 standard in order to develop a prototype of smart multi-sensor platform (with up to ten different analog sensors simultaneously connected) with Plug and Play capabilities over ETHERNET and Wi-Fi. In the experiments were used: one analog temperature sensor, one analog light sensor, one PIC32-based microcontroller development board with analog and digital I/O ports and other computing resources, one 24LC256 I2C (Inter Integrated Circuit standard) serial Electrically Erasable Programmable Read Only Memory (EEPROM) memory with 32KB available space and 3 bytes internal buffer for page writes (1 byte for data and 2 bytes for address). It was developed a prototype algorithm for writing and reading TEDS information to / from I2C EEPROM memories using the standard C language (up to ten different TEDS blocks coexisting in the same EEPROM device at once). The algorithm is able to write and read one type of TEDS: transducer information with standard TEDS content. A second software application, written in VB.NET platform, was developed in order to access the EEPROM sensor information from a computer through a serial interface (USB).

System on a Chip (SoC) Overview

NASA Technical Reports Server (NTRS)

LaBel, Kenneth A.

2010-01-01

System-on-a-chip or system on chip (SoC or SOC) refers to integrating all components of a computer or other electronic system into a single integrated circuit (chip). It may contain digital, analog, mixed-signal, and often radio-frequency functions all on a single chip substrate. Complexity drives it all: Radiation tolerance and testability are challenges for fault isolation, propagation, and validation. Bigger single silicon die than flown before and technology is scaling below 90nm (new qual methods). Packages have changed and are bigger and more difficult to inspect, test, and understand. Add in embedded passives. Material interfaces are more complex (underfills, processing). New rules for board layouts. Mechanical and thermal designs, etc.

Virtual Instrument for Determining Rate Constant of Second-Order Reaction by pX Based on LabVIEW 8.0

PubMed Central

Meng, Hu; Li, Jiang-Yuan; Tang, Yong-Huai

2009-01-01

The virtual instrument system based on LabVIEW 8.0 for ion analyzer which can measure and analyze ion concentrations in solution is developed and comprises homemade conditioning circuit, data acquiring board, and computer. It can calibrate slope, temperature, and positioning automatically. When applied to determine the reaction rate constant by pX, it achieved live acquiring, real-time displaying, automatical processing of testing data, generating the report of results; and other functions. This method simplifies the experimental operation greatly, avoids complicated procedures of manual processing data and personal error, and improves veracity and repeatability of the experiment results. PMID:19730752

Thermal Analysis and Design of Air Cooled Electronic Circuit Boards Using a Desktop Computer.

DTIC Science & Technology

1980-06-01

pi rameter is" 3340 PRINT "as1gneid ,hii:h cauas;.es the progran to beg’ rat ’he section which a_=! for the" 3350 PRINT "geometric parieters of the...THERMELE:.: 1030 LiNE TYPE 3 1035 LruBdl N r I LR - LENGTH OF EACH PEGIr4t4 1040 HrmBdh- Hr I HP a HEIGHT OF EiCH PEG ;ION 1045 FOR 1-1 TO Ni.r-1 1650 MOVE I...PAGEHEAD 3345 ! 3350 Errin:1 THIS SECTION ALERTS THE USER TO AN ATTEtiFT TO INPUT SAD DATA 3355 BEEP 3360 DISP "INPUT OUT OF ’RNGE ............ TRY AGAIN

Packaging strategies for printed circuit board components. Volume I, materials & thermal stresses.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Neilsen, Michael K.; Austin, Kevin N.; Adolf, Douglas Brian

2011-09-01

Decisions on material selections for electronics packaging can be quite complicated by the need to balance the criteria to withstand severe impacts yet survive deep thermal cycles intact. Many times, material choices are based on historical precedence perhaps ignorant of whether those initial choices were carefully investigated or whether the requirements on the new component match those of previous units. The goal of this program focuses on developing both increased intuition for generic packaging guidelines and computational methodologies for optimizing packaging in specific components. Initial efforts centered on characterization of classes of materials common to packaging strategies and computational analysesmore » of stresses generated during thermal cycling to identify strengths and weaknesses of various material choices. Future studies will analyze the same example problems incorporating the effects of curing stresses as needed and analyzing dynamic loadings to compare trends with the quasi-static conclusions.« less

A brief perspective on computational electromagnetics

DOE Office of Scientific and Technical Information (OSTI.GOV)

Nachman, A.

1996-06-01

There is a growing interest in many quarters in acquiring the ability to predict all manner of electromagnetic (EM) effects. These effects include radar scattering attributes of objects (airplanes, missles, tanks, ships, etc.); the mutal interference of a multitude of antennas on board a single aircraft or ship; the performance of integrated circuits (IC); the propagation of waves (radio and radar) over long distances with the help of hindrance of complicated tomography and ionospheric/atmospheric ducting; and the propagation of pulses through dispersive media (soil, treetops, or concrete) to detect pollutants or hidden targets, or to assess the health of runways.more » All of the above require extensive computation and, despite the fact that Maxwell`s equations are linear in all these cases, codes do not exist which will do the job in a timely and error-controlled manner. This report briefly discusses how this can be rectified. 16 refs.« less

Elemental analysis of printed circuit boards considering the ROHS regulations

DOE Office of Scientific and Technical Information (OSTI.GOV)

Wienold, Julia, E-mail: julia.wienold@bam.de; Recknagel, Sebastian, E-mail: sebastian.recknagel@bam.de; Scharf, Holger, E-mail: holger.scharf@bam.de

2011-03-15

The EU RoHS Directive (2002/95/EC of the European Parliament and of the Council) bans the placing of new electrical and electronic equipment containing more than agreed levels of lead, cadmium, mercury, hexavalent chromium, polybrominated biphenyl (PBB) and polybrominated diphenyl ether (PBDE) flame retardants on the EU market. It necessitates methods for the evaluation of RoHS compliance of assembled electronic equipment. In this study mounted printed circuit boards from personal computers were analyzed on their content of the three elements Cd, Pb and Hg which were limited by the EU RoHS directive. Main focus of the investigations was the influence ofmore » sample pre-treatment on the precision and reproducibility of the results. The sample preparation steps used were based on the guidelines given in EN 62321. Five different types of dissolution procedures were tested on different subsequent steps of sample treatment like cutting and milling. Elemental analysis was carried out using ICP-OES, XRF and CV-AFS (Hg). The results obtained showed that for decision-making with respect to RoHS compliance a size reduction of the material to be analyzed to particles {<=}1.5 mm can already be sufficient. However, to ensure analytical results with relative standard deviations of less than 20%, as recommended by the EN 62321, a much larger effort for sample processing towards smaller particle sizes might be required which strongly depends on the mass fraction of the element under investigation.« less

Wideband characterization of printed circuit board materials up to 50 ghz

NASA Astrophysics Data System (ADS)

Rakov, Aleksei

A traveling-wave technique developed a few years ago in the Missouri S&T EMC Laboratory has been employed until now for characterization of PCB materials over a broad frequency range up to 30 GHz. This technique includes measuring S-parameters of the specially designed PCB test vehicles. An extension of the frequency range of printed circuit board laminate dielectric and copper foil characterization is an important problem. In this work, a new PCB test vehicle design for operating up to 50 GHz has been proposed. As the frequency range of measurements increases, the analysis of errors and uncertainties in measuring dielectric properties becomes increasingly important. Formulas for quantification of two major groups of errors, repeatability (manufacturing variability) and reproducibility (systematic) errors, in extracting dielectric constant (DK) and dissipation factor (DK) have been derived, and computations for a number of cases are presented. Conductor (copper foil) surface roughness of PCB interconnects is an important factor, which affects accuracy of DK and DF measurements. This work describes a new algorithm for semi-automatic characterization of copper foil profiles on optical or scanning electron microscopy (SEM) pictures of signal traces. The collected statistics of numerous copper foil roughness profiles allows for introducing a new metric for roughness characterization of PCB interconnects. This is an important step to refining the measured DK and DF parameters from roughness contributions. The collected foil profile data and its analysis allow for developing "design curves", which could be used by SI engineers and electronics developers in their designs.

Control over self-assembly of diblock copolymers on hexagonal and square templates for high area density circuit boards.

PubMed

Feng, Jie; Cavicchi, Kevin A; Heinz, Hendrik

2011-12-27

Self-assembled diblock copolymer melts on patterned substrates can induce a smaller characteristic domain spacing compared to predefined lithographic patterns and enable the manufacture of circuit boards with a high area density of computing and storage units. Monte Carlo simulation using coarse-grain models of polystyrene-b-polydimethylsiloxane shows that the generation of high-density hexagonal and square patterns is controlled by the ratio N(D) of the surface area per post and the surface area per spherical domain of neat block copolymer. N(D) represents the preferred number of block copolymer domains per post. Selected integer numbers support the formation of ordered structures on hexagonal (1, 3, 4, 7, 9) and square (1, 2, 5, 7) templates. On square templates, only smaller numbers of block copolymer domains per post support the formation of ordered arrays with significant stabilization energies relative to hexagonal morphology. Deviation from suitable integer numbers N(D) increases the likelihood of transitional morphologies between square and hexagonal. Upon increasing the spacing of posts on the substrate, square arrays, nested square arrays, and disordered hexagonal morphologies with multiple coordination numbers were identified, accompanied by a decrease in stabilization energy. Control over the main design parameter N(D) may allow an up to 7-fold increase in density of spherical block copolymer domains per surface area in comparison to the density of square posts and provide access to a wide range of high-density nanostructures to pattern electronic devices.

Arithmetic Circuit Verification Based on Symbolic Computer Algebra

NASA Astrophysics Data System (ADS)

Watanabe, Yuki; Homma, Naofumi; Aoki, Takafumi; Higuchi, Tatsuo

This paper presents a formal approach to verify arithmetic circuits using symbolic computer algebra. Our method describes arithmetic circuits directly with high-level mathematical objects based on weighted number systems and arithmetic formulae. Such circuit description can be effectively verified by polynomial reduction techniques using Gröbner Bases. In this paper, we describe how the symbolic computer algebra can be used to describe and verify arithmetic circuits. The advantageous effects of the proposed approach are demonstrated through experimental verification of some arithmetic circuits such as multiply-accumulator and FIR filter. The result shows that the proposed approach has a definite possibility of verifying practical arithmetic circuits.

Final Technical Report - 300°C Capable Electronics Platform and Temperature Sensor System For Enhanced Geothermal Systems

DOE Office of Scientific and Technical Information (OSTI.GOV)

Chen, Cheng-Po; Shaddock, David; Sandvik, Peter

2012-11-30

A silicon carbide (SiC) based electronic temperature sensor prototype has been demonstrated to operate at 300°C. We showed continuous operation of 1,000 hours with SiC operational amplifier and surface mounted discreet resistors and capacitors on a ceramic circuit board. This feasibility demonstration is a major milestone in the development of high temperature electronics in general and high temperature geothermal exploration and well management tools in particular. SiC technology offers technical advantages that are not found in competing technologies such as silicon-on-insulator (SOI) at high temperatures of 200°C to 300°C and beyond. The SiC integrated circuits and packaging methods can bemore » used in new product introduction by GE Oil and Gas for high temperature down-hole tools. The existing SiC fabrication facility at GE is sufficient to support the quantities currently demanded by the marketplace, and there are other entities in the United States and other countries capable of ramping up SiC technology manufacturing. The ceramic circuit boards are different from traditional organic-based electronics circuit boards, but the fabrication process is compatible with existing ceramic substrate manufacturing. This project has brought high temperature electronics forward, and brings us closer to commercializing tools that will enable and reduce the cost of enhanced geothermal technology to benefit the public in terms of providing clean renewable energy at lower costs.« less

Board-to-Board Free-Space Optical Interconnections Passing through Boards for a Bookshelf-Assembled Terabit-Per-Second-Class ATM Switch.

PubMed

Hirabayashi, K; Yamamoto, T; Matsuo, S; Hino, S

1998-05-10

We propose free-space optical interconnections for a bookshelf-assembled terabit-per-second-class ATM switch. Thousands of arrayed optical beams, each having a rate of a few gigabits per second, propagate vertically to printed circuit boards, passing through some boards, and are connected to arbitrary transmitters and receivers on boards by polarization controllers and prism arrays. We describe a preliminary experiment using a 1-mm-pitch 2 x 2 beam-collimator array that uses vertical-cavity surface-emitting laser diodes. These optical interconnections can be made quite stable in terms of mechanical shock and temperature fluctuation by the attachment of reinforcing frames to the boards and use of an autoalignment system.

PC board mount corrosion sensitive sensor

DOEpatents

Robinson, Alex L.; Casias, Adrian L.; Pfeifer, Kent B.; Laguna, George R.

2016-03-22

The present invention relates to surface mount structures including a capacitive element or a resistive element, where the element has a property that is responsive to an environmental condition. In particular examples, the structure can be optionally coupled to a printed circuit board. Other apparatuses, surface mountable structures, and methods of use are described herein.

Improved charge injection device and a focal plane interface electronics board for stellar tracking

NASA Technical Reports Server (NTRS)

Michon, G. J.; Burke, H. K.

1984-01-01

An improved Charge Injection Device (CID) stellar tracking sensor and an operating sensor in a control/readout electronics board were developed. The sensor consists of a shift register scanned, 256x256 CID array organized for readout of 4x4 subarrays. The 4x4 subarrays can be positioned anywhere within the 256x256 array with a 2 pixel resolution. This allows continuous tracking of a number of stars simultaneously since nine pixels (3x3) centered on any star can always be read out. Organization and operation of this sensor and the improvements in design and semiconductor processing are described. A hermetic package incorporating an internal thermoelectric cooler assembled using low temperature solders was developed. The electronics board, which contains the sensor drivers, amplifiers, sample hold circuits, multiplexer, analog to digital converter, and the sensor temperature control circuits, is also described. Packaged sensors were evaluated for readout efficiency, spectral quantum efficiency, temporal noise, fixed pattern noise, and dark current. Eight sensors along with two tracker electronics boards were completed, evaluated, and delivered.

Technology transfer of military space microprocessor developments

NASA Astrophysics Data System (ADS)

Gorden, C.; King, D.; Byington, L.; Lanza, D.

1999-01-01

Over the past 13 years the Air Force Research Laboratory (AFRL) has led the development of microprocessors and computers for USAF space and strategic missile applications. As a result of these Air Force development programs, advanced computer technology is available for use by civil and commercial space customers as well. The Generic VHSIC Spaceborne Computer (GVSC) program began in 1985 at AFRL to fulfill a deficiency in the availability of space-qualified data and control processors. GVSC developed a radiation hardened multi-chip version of the 16-bit, Mil-Std 1750A microprocessor. The follow-on to GVSC, the Advanced Spaceborne Computer Module (ASCM) program, was initiated by AFRL to establish two industrial sources for complete, radiation-hardened 16-bit and 32-bit computers and microelectronic components. Development of the Control Processor Module (CPM), the first of two ASCM contract phases, concluded in 1994 with the availability of two sources for space-qualified, 16-bit Mil-Std-1750A computers, cards, multi-chip modules, and integrated circuits. The second phase of the program, the Advanced Technology Insertion Module (ATIM), was completed in December 1997. ATIM developed two single board computers based on 32-bit reduced instruction set computer (RISC) processors. GVSC, CPM, and ATIM technologies are flying or baselined into the majority of today's DoD, NASA, and commercial satellite systems.

Difference-Equation/Flow-Graph Circuit Analysis

NASA Technical Reports Server (NTRS)

Mcvey, I. M.

1988-01-01

Numerical technique enables rapid, approximate analyses of electronic circuits containing linear and nonlinear elements. Practiced in variety of computer languages on large and small computers; for circuits simple enough, programmable hand calculators used. Although some combinations of circuit elements make numerical solutions diverge, enables quick identification of divergence and correction of circuit models to make solutions converge.

Compact fluid cooled power converter supporting multiple circuit boards

DOEpatents

Radosevich, Lawrence D.; Meyer, Andreas A.; Beihoff, Bruce C.; Kannenberg, Daniel G.

2005-03-08

A support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support, in conjunction with other packaging features may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.

Modeling and characteristic of the SMT Board Plug connector in high speed optical communication system

NASA Astrophysics Data System (ADS)

Wu, Haoran; Dong, Zhenzhen; Wang, Tanglin; Zhao, Heng; Feng, Junbo; Cui, Naidi; Teng, Jie; Guo, Jin

2015-04-01

Modeling and characteristic of the SMT Board Plug connector, which is used to connect micro optical transceiver to the main board, are proposed and analyzed in this paper. When the high speed signal transfers from the PCB of transceiver to main board through SMT Board Plug connector, the structure and material discontinuity of the connector causes insertion losses and impedance mismatches. This makes the performance of high speed digital system exacerbated. So it is essential to analyze the signal transfer characteristics of the connector and find out what factors affected the signal quality at the design stage of the digital system. To solve this problem, Ansoft's High Frequency Structure Simulator (HFSS), based on the finite element method, was employed to build accurate 3D models, analyze the effects of various structure parameters, and obtain the full-wave characteristics of the SMT Board Plug connectors in this paper. Then an equivalent circuit model was developed. The circuit parameters were extracted precisely in the frequency range of interests by using the curve fitting method in ADS software, and the result was in good agreement with HFSS simulations up to 8GHz with different structure parameters. At last, the measurement results of S-parameter and eye diagram were given and the S-parameters showed good coincidence between the measurement and HFSS simulation up to 4GHz.

Separation of the metallic and non-metallic fraction from printed circuit boards employing green technology.

PubMed

Estrada-Ruiz, R H; Flores-Campos, R; Gámez-Altamirano, H A; Velarde-Sánchez, E J

2016-07-05

The generation of electrical and electronic waste is increasing day by day; recycling is attractive because of the metallic fraction containing these. Nevertheless, conventional techniques are highly polluting. The comminution of the printed circuit boards followed by an inverse flotation process is a clean technique that allows one to separate the metallic fraction from the non-metallic fraction. It was found that particle size and superficial air velocity are the main variables in the separation of the different fractions. In this way an efficient separation is achieved by avoiding the environmental contamination coupled with the possible utilization of the different fractions obtained. Copyright © 2016 Elsevier B.V. All rights reserved.

Three-dimensionally deformable, highly stretchable, permeable, durable and washable fabric circuit boards.

PubMed

Li, Qiao; Tao, Xiao Ming

2014-11-08

This paper reports fabric circuit boards (FCBs), a new type of circuit boards, that are three-dimensionally deformable, highly stretchable, durable and washable ideally for wearable electronic applications. Fabricated by using computerized knitting technologies at ambient dry conditions, the resultant knitted FCBs exhibit outstanding electrical stability with less than 1% relative resistance change up to 300% strain in unidirectional tensile test or 150% membrane strain in three-dimensional ball punch test, extraordinary fatigue life of more than 1 000 000 loading cycles at 20% maximum strain, and satisfactory washing capability up to 30 times. To the best of our knowledge, the performance of new FCBs has far exceeded those of previously reported metal-coated elastomeric films or other organic materials in terms of changes in electrical resistance, stretchability, fatigue life and washing capability as well as permeability. Theoretical analysis and numerical simulation illustrate that the structural conversion of knitted fabrics is attributed to the effective mitigation of strain in the conductive metal fibres, hence the outstanding mechanical and electrical properties. Those distinctive features make the FCBs particularly suitable for next-to-skin electronic devices. This paper has further demonstrated the application potential of the knitted FCBs in smart protective apparel for in situ measurement during ballistic impact.

Removing lead from metallic mixture of waste printed circuit boards by vacuum distillation: factorial design and removal mechanism.

PubMed

Li, Xingang; Gao, Yujie; Ding, Hui

2013-10-01

The lead removal from the metallic mixture of waste printed circuit boards by vacuum distillation was optimized using experimental design, and a mathematical model was established to elucidate the removal mechanism. The variables studied in lead evaporation consisted of the chamber pressure, heating temperature, heating time, particle size and initial mass. The low-level chamber pressure was fixed at 0.1 Pa as the operation pressure. The application of two-level factorial design generated a first-order polynomial that agreed well with the data for evaporation efficiency of lead. The heating temperature and heating time exhibited significant effects on the efficiency, which was validated by means of the copper-lead mixture experiments. The optimized operating conditions within the region studied were the chamber pressure of 0.1 Pa, heating temperature of 1023 K and heating time of 120 min. After the conditions were employed to remove lead from the metallic mixture of waste printed circuit boards, the efficiency was 99.97%. The mechanism of the effects was elucidated by mathematical modeling that deals with evaporation, mass transfer and condensation, and can be applied to a wider range of metal removal by vacuum distillation. Copyright © 2013 Elsevier Ltd. All rights reserved.

Three-dimensionally deformable, highly stretchable, permeable, durable and washable fabric circuit boards

PubMed Central

Li, Qiao; Tao, Xiao Ming

2014-01-01

This paper reports fabric circuit boards (FCBs), a new type of circuit boards, that are three-dimensionally deformable, highly stretchable, durable and washable ideally for wearable electronic applications. Fabricated by using computerized knitting technologies at ambient dry conditions, the resultant knitted FCBs exhibit outstanding electrical stability with less than 1% relative resistance change up to 300% strain in unidirectional tensile test or 150% membrane strain in three-dimensional ball punch test, extraordinary fatigue life of more than 1 000 000 loading cycles at 20% maximum strain, and satisfactory washing capability up to 30 times. To the best of our knowledge, the performance of new FCBs has far exceeded those of previously reported metal-coated elastomeric films or other organic materials in terms of changes in electrical resistance, stretchability, fatigue life and washing capability as well as permeability. Theoretical analysis and numerical simulation illustrate that the structural conversion of knitted fabrics is attributed to the effective mitigation of strain in the conductive metal fibres, hence the outstanding mechanical and electrical properties. Those distinctive features make the FCBs particularly suitable for next-to-skin electronic devices. This paper has further demonstrated the application potential of the knitted FCBs in smart protective apparel for in situ measurement during ballistic impact. PMID:25383032

MEMS Technology for Space Applications

NASA Technical Reports Server (NTRS)

vandenBerg, A.; Spiering, V. L.; Lammerink, T. S. J.; Elwenspoek, M.; Bergveld, P.

1995-01-01

Micro-technology enables the manufacturing of all kinds of components for miniature systems or micro-systems, such as sensors, pumps, valves, and channels. The integration of these components into a micro-electro-mechanical system (MEMS) drastically decreases the total system volume and mass. These properties, combined with the increasing need for monitoring and control of small flows in (bio)chemical experiments, makes MEMS attractive for space applications. The level of integration and applied technology depends on the product demands and the market. The ultimate integration is process integration, which results in a one-chip system. An example of process integration is a dosing system of pump, flow sensor, micromixer, and hybrid feedback electronics to regulate the flow. However, for many applications, a hybrid integration of components is sufficient and offers the advantages of design flexibility and even the exchange of components in the case of a modular set up. Currently, we are working on hybrid integration of all kinds of sensors (physical and chemical) and flow system modules towards a modular system; the micro total analysis system (micro TAS). The substrate contains electrical connections as in a printed circuit board (PCB) as well as fluid channels for a circuit channel board (CCB) which, when integrated, form a mixed circuit board (MCB).

Solder Flux Residues and Humidity-Related Failures in Electronics: Relative Effects of Weak Organic Acids Used in No-Clean Flux Systems

NASA Astrophysics Data System (ADS)

Verdingovas, Vadimas; Jellesen, Morten Stendahl; Ambat, Rajan

2015-04-01

This paper presents the results of humidity testing of weak organic acids (WOAs), namely adipic, succinic, glutaric, dl-malic, and palmitic acids, which are commonly used as activators in no-clean solder fluxes. The study was performed under humidity conditions varying from 60% relative humidity (RH) to ˜99%RH at 25°C. The following parameters were used for characterization of WOAs: mass gain due to water adsorption and deliquescence of the WOA (by quartz crystal microbalance), resistivity of the water layer formed on the printed circuit board (by impedance spectroscopy), and leakage current measured using the surface insulation resistance pattern in the potential range from 0 V to 10 V. The combined results indicate the importance of the WOA chemical structure for the water adsorption and therefore conductive water layer formation on the printed circuit board assembly (PCBA). A substantial increase of leakage currents and probability of electrochemical migration was observed at humidity levels above the RH corresponding to the deliquescence point of WOAs present as contaminants on the printed circuit boards. The results suggest that use of solder fluxes with WOAs having higher deliquescence point could improve the reliability of electronics operating under circumstances in which exposure to high humidity is likely to occur.

Ultra-low current biosensor output detection using portable electronic reader

NASA Astrophysics Data System (ADS)

Yahaya, N. A. N.; Rajapaksha, R. D. A. A.; Uda, M. N. Afnan; Hashim, U.

2017-09-01

Generally, the electrical biosensor usually shows extremely low current signal output around pico ampere to microampere range. In this research, electronic reader with amplifier has been demonstrated to detect ultra low current via the biosensor. The operational amplifier Burr-Brown OPA 128 and Arduino Uno board were used to construct the portable electronic reader. There are two cascaded inverting amplifier were used to detect ultra low current through the biosensor from pico amperes (pA) to nano amperes ranges (nA). A small known input current was form by applying variable voltage between 0.1V to 5.0V across a 5GΩ high resistor to check the amplifier circuit. The amplifier operation was measured with the high impedance current source and has been compared with the theoretical measurement. The Arduino Uno was used to convert the analog signal to digital signal and process the data to display on reader screen. In this project, Proteus software was used to design and test the circuit. Then it was implemented together with Arduino Uno board. Arduino board was programmed using C programming language to make whole circuit communicate each order. The current was measured then it shows a small difference values compared to theoretical values, which is approximately 14pA.

Power Electronics Design Laboratory Exercise for Final-Year M.Sc. Students

ERIC Educational Resources Information Center

Max, L.; Thiringer, T.; Undeland, T.; Karlsson, R.

2009-01-01

This paper presents experiences and results from a project task in power electronics for students at Chalmers University of Technology, Goteborg, Sweden, based on a flyback test board. The board is used in the course Power Electronic Devices and Applications. In the project task, the students design snubber circuits, improve the control of the…

Science Notes.

ERIC Educational Resources Information Center

School Science Review, 1987

1987-01-01

Contains 31 activities and experiments from the biological and physical sciences. Addresses such areas as reproduction, biotechnology, ecology, proteins, nitrates, aerosols, metal crystallinity, circuit boards, and photoswitching. (ML)

SpaceHab 1 maintenance experiment

NASA Technical Reports Server (NTRS)

Bohannon, Jackie W.

1994-01-01

The SpaceHab 1 flight on STS-57 served as a test platform for evaluation of two space station payloads. The first payload evaluated a space station maintenance concept using a sweep signal generator and a 48-channel logic analyzer to perform fault detection and isolation. Crew procedures files, test setup diagram files, and software to configure the test equipment were created on the ground and uplinked on the astronauts' voice communication circuit to perform tests in flight. In order to use these files, the portable computer was operated in a multi-window configuration. The test data transmitted to the ground allowing the ground staff to identify the cause of the fault and provide the crew with the repair procedures and diagrams. The crew successfully repaired the system under test. The second payload investigated hand soldering and de-soldering of standard components on printed circuit (PC) boards in zero gravity. It also used a new type of intra-vehicular foot restraints which uses the neutral body posture in zero-g to provide retention of the crew without their conscious attention.

Compact Instruments Measure Helium-Leak Rates

NASA Technical Reports Server (NTRS)

Stout, Stephen; Immer, Christopher

2003-01-01

Compact, lightweight instruments have been developed for measuring small flows of helium and/or detecting helium leaks in solenoid valves when the valves are nominally closed. These instruments do not impede the flows when the valves are nominally open. They can be integrated into newly fabricated valves or retrofitted to previously fabricated valves. Each instrument includes an upstream and a downstream thermistor separated by a heater, plus associated analog and digital heater-control, signal- conditioning, and data-processing circuits. The thermistors and heater are off-the-shelf surface mount components mounted on a circuit board in the flow path. The operation of the instrument is based on a well-established thermal mass-flow-measurement technique: Convection by the flow that one seeks to measure gives rise to transfer of heat from the heater to the downstream thermistor. The temperature difference measured by the thermistors is directly related to the rate of flow. The calibration curve from temperature gradient to helium flow is closely approximated via fifth-order polynomial. A microprocessor that is part of the electronic circuitry implements the calibration curve to compute the flow rate from the thermistor readings.

Fault-tolerant computer study. [logic designs for building block circuits

NASA Technical Reports Server (NTRS)

Rennels, D. A.; Avizienis, A. A.; Ercegovac, M. D.

1981-01-01

A set of building block circuits is described which can be used with commercially available microprocessors and memories to implement fault tolerant distributed computer systems. Each building block circuit is intended for VLSI implementation as a single chip. Several building blocks and associated processor and memory chips form a self checking computer module with self contained input output and interfaces to redundant communications buses. Fault tolerance is achieved by connecting self checking computer modules into a redundant network in which backup buses and computer modules are provided to circumvent failures. The requirements and design methodology which led to the definition of the building block circuits are discussed.

A Spaceborne Synthetic Aperture Radar Partial Fixed-Point Imaging System Using a Field- Programmable Gate Array—Application-Specific Integrated Circuit Hybrid Heterogeneous Parallel Acceleration Technique

PubMed Central

Li, Bingyi; Chen, Liang; Wei, Chunpeng; Xie, Yizhuang; Chen, He; Yu, Wenyue

2017-01-01

With the development of satellite load technology and very large scale integrated (VLSI) circuit technology, onboard real-time synthetic aperture radar (SAR) imaging systems have become a solution for allowing rapid response to disasters. A key goal of the onboard SAR imaging system design is to achieve high real-time processing performance with severe size, weight, and power consumption constraints. In this paper, we analyse the computational burden of the commonly used chirp scaling (CS) SAR imaging algorithm. To reduce the system hardware cost, we propose a partial fixed-point processing scheme. The fast Fourier transform (FFT), which is the most computation-sensitive operation in the CS algorithm, is processed with fixed-point, while other operations are processed with single precision floating-point. With the proposed fixed-point processing error propagation model, the fixed-point processing word length is determined. The fidelity and accuracy relative to conventional ground-based software processors is verified by evaluating both the point target imaging quality and the actual scene imaging quality. As a proof of concept, a field- programmable gate array—application-specific integrated circuit (FPGA-ASIC) hybrid heterogeneous parallel accelerating architecture is designed and realized. The customized fixed-point FFT is implemented using the 130 nm complementary metal oxide semiconductor (CMOS) technology as a co-processor of the Xilinx xc6vlx760t FPGA. A single processing board requires 12 s and consumes 21 W to focus a 50-km swath width, 5-m resolution stripmap SAR raw data with a granularity of 16,384 × 16,384. PMID:28672813

A Spaceborne Synthetic Aperture Radar Partial Fixed-Point Imaging System Using a Field- Programmable Gate Array-Application-Specific Integrated Circuit Hybrid Heterogeneous Parallel Acceleration Technique.

PubMed

Yang, Chen; Li, Bingyi; Chen, Liang; Wei, Chunpeng; Xie, Yizhuang; Chen, He; Yu, Wenyue

2017-06-24

With the development of satellite load technology and very large scale integrated (VLSI) circuit technology, onboard real-time synthetic aperture radar (SAR) imaging systems have become a solution for allowing rapid response to disasters. A key goal of the onboard SAR imaging system design is to achieve high real-time processing performance with severe size, weight, and power consumption constraints. In this paper, we analyse the computational burden of the commonly used chirp scaling (CS) SAR imaging algorithm. To reduce the system hardware cost, we propose a partial fixed-point processing scheme. The fast Fourier transform (FFT), which is the most computation-sensitive operation in the CS algorithm, is processed with fixed-point, while other operations are processed with single precision floating-point. With the proposed fixed-point processing error propagation model, the fixed-point processing word length is determined. The fidelity and accuracy relative to conventional ground-based software processors is verified by evaluating both the point target imaging quality and the actual scene imaging quality. As a proof of concept, a field- programmable gate array-application-specific integrated circuit (FPGA-ASIC) hybrid heterogeneous parallel accelerating architecture is designed and realized. The customized fixed-point FFT is implemented using the 130 nm complementary metal oxide semiconductor (CMOS) technology as a co-processor of the Xilinx xc6vlx760t FPGA. A single processing board requires 12 s and consumes 21 W to focus a 50-km swath width, 5-m resolution stripmap SAR raw data with a granularity of 16,384 × 16,384.

Design and Analysis of Compact DNA Strand Displacement Circuits for Analog Computation Using Autocatalytic Amplifiers.

PubMed

Song, Tianqi; Garg, Sudhanshu; Mokhtar, Reem; Bui, Hieu; Reif, John

2018-01-19

A main goal in DNA computing is to build DNA circuits to compute designated functions using a minimal number of DNA strands. Here, we propose a novel architecture to build compact DNA strand displacement circuits to compute a broad scope of functions in an analog fashion. A circuit by this architecture is composed of three autocatalytic amplifiers, and the amplifiers interact to perform computation. We show DNA circuits to compute functions sqrt(x), ln(x) and exp(x) for x in tunable ranges with simulation results. A key innovation in our architecture, inspired by Napier's use of logarithm transforms to compute square roots on a slide rule, is to make use of autocatalytic amplifiers to do logarithmic and exponential transforms in concentration and time. In particular, we convert from the input that is encoded by the initial concentration of the input DNA strand, to time, and then back again to the output encoded by the concentration of the output DNA strand at equilibrium. This combined use of strand-concentration and time encoding of computational values may have impact on other forms of molecular computation.

At grade optical crossover for monolithic optial circuits

NASA Technical Reports Server (NTRS)

Jamieson, Robert S. (Inventor)

1983-01-01

Planar optical circuits may be made to cross through each other, (thus eliminating extra steps required to fabricate elevated, nonintersecting crossovers) by control of the dimensions of the crossing light conductors (10, 12) to be significantly greater than d=0.89.lambda. and the angle of crossing as nearly 90.degree. as conveniently possible. A light trap may be provided just ahead of the intersection to trap any light being reflected in the source conductor at angles greater than about 45.degree.. The light trap may take the form of triangular shaped portions (16a, 16b) on each side of the source conductor with the far side of the triangular portion receiving incident light at an angle so that incident light will be reflected to the other side, or it may take the form of windows (18a, 18b) in place of the triangular portions. Planar optical circuit boards (21-23) may be fabricated and stacked to form a keyboard (20) with intersecting conductors (26-29) and keyholes (0-9) where conductors merge at the broad side of the circuit boards. These keyholes may be prearranged to form an array or matrix of keyholes.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Tanaka, T.J.; Nowlen, S.P.; Anderson, D.J.

Smoke can adversely affect digital electronics; in the short term, it can lead to circuit bridging and in the long term to corrosion of metal parts. This report is a summary of the work to date and component-level tests by Sandia National Laboratories for the Nuclear Regulatory Commission to determine the impact of smoke on digital instrumentation and control equipment. The component tests focused on short-term effects such as circuit bridging in typical components and the factors that can influence how much the smoke will affect them. These factors include the component technology and packaging, physical board protection, and environmentalmore » conditions such as the amount of smoke, temperature of burn, and humidity level. The likelihood of circuit bridging was tested by measuring leakage currents and converting those currents to resistance in ohms. Hermetically sealed ceramic packages were more resistant to smoke than plastic packages. Coating the boards with an acrylic spray provided some protection against circuit bridging. The smoke generation factors that affect the resistance the most are humidity, fuel level, and burn temperature. The use of CO{sub 2} as a fire suppressant, the presence of galvanic metal, and the presence of PVC did not significantly affect the outcome of these results.« less

Developing and Evaluating a Flexible Wireless Microcoil Array Based Integrated Interface for Epidural Cortical Stimulation.

PubMed

Wang, Xing; Chaudhry, Sharjeel A; Hou, Wensheng; Jia, Xiaofeng

2017-02-05

Stroke leads to serious long-term disability. Electrical epidural cortical stimulation has made significant improvements in stroke rehabilitation therapy. We developed a preliminary wireless implantable passive interface, which consists of a stimulating surface electrode, receiving coil, and single flexible passive demodulated circuit printed by flexible printed circuit (FPC) technique and output pulse voltage stimulus by inductively coupling an external circuit. The wireless implantable board was implanted in cats' unilateral epidural space for electrical stimulation of the primary visual cortex (V1) while the evoked responses were recorded on the contralateral V1 using a needle electrode. The wireless implantable board output stable monophasic voltage stimuli. The amplitude of the monophasic voltage output could be adjusted by controlling the voltage of the transmitter circuit within a range of 5-20 V. In acute experiment, cortico-cortical evoked potential (CCEP) response was recorded on the contralateral V1. The amplitude of N2 in CCEP was modulated by adjusting the stimulation intensity of the wireless interface. These results demonstrated that a wireless interface based on a microcoil array can offer a valuable tool for researchers to explore electrical stimulation in research and the dura mater-electrode interface can effectively transmit electrical stimulation.

Electronic Jewelry

ERIC Educational Resources Information Center

Ward, Vesta

1972-01-01

Brightly banded resisters, condensers, diodes and transistors as well as printed circuit boards were used with the objective of discovering their potential in creating objects for personal adornment. (RB)

Cryogenic applications of commercial electronic components

NASA Astrophysics Data System (ADS)

Buchanan, Ernest D.; Benford, Dominic J.; Forgione, Joshua B.; Harvey Moseley, S.; Wollack, Edward J.

2012-10-01

We have developed a range of techniques useful for constructing analog and digital circuits for operation in a liquid Helium environment (4.2 K), using commercially available low power components. The challenges encountered in designing cryogenic electronics include finding components that can function usefully in the cold and possess low enough power dissipation so as not to heat the systems they are designed to measure. From design, test, and integration perspectives it is useful for components to operate similarly at room and cryogenic temperatures; however this is not a necessity. Some of the circuits presented here have been used successfully in the MUSTANG [1] and in the GISMO [2] camera to build a complete digital to analog multiplexer (which will be referred to as the Cryogenic Address Driver board). Many of the circuit elements described are of a more general nature rather than specific to the Cryogenic Address Driver board, and were studied as a part of a more comprehensive approach to addressing a larger set of cryogenic electronic needs.

Cryogenic Applications of Commercial Electronic Components

NASA Technical Reports Server (NTRS)

Buchanan, Ernest D.; Benford, Dominic J.; Forgione, Joshua B.; Moseley, S. Harvey; Wollack, Edward J.

2012-01-01

We have developed a range of techniques useful for constructing analog and digital circuits for operation in a liquid Helium environment (4.2K), using commercially available low power components. The challenges encountered in designing cryogenic electronics include finding components that can function usefully in the cold and possess low enough power dissipation so as not to heat the systems they are designed to measure. From design, test, and integration perspectives it is useful for components to operate similarly at room and cryogenic temperatures; however this is not a necessity. Some of the circuits presented here have been used successfully in the MUSTANG and in the GISMO camera to build a complete digital to analog multiplexer (which will be referred to as the Cryogenic Address Driver board). Many of the circuit elements described are of a more general nature rather than specific to the Cryogenic Address Driver board, and were studied as a part of a more comprehensive approach to addressing a larger set of cryogenic electronic needs.

Inductance optimization of miniature Broadband transformers with racetrack shaped ferrite cores for Ethernet applications

NASA Astrophysics Data System (ADS)

Bowen, David; Krafft, Charles; Mayergoyz, Isaak D.

2017-05-01

There is strong commercial interest in the ability to fabricate the windings of traditional miniature wire-wound inductive circuit components, such as Ethernet transformers, lithographically. For greater inductance devices, thick cores are required, making the process of embedding the ferrite material within circuit board one of few options for lithographic winding fabrication. In this paper, a non-traditional core shape, suitable for embedding in circuit board, is examined analytically and experimentally; the racetrack shape is two halves of a toroid connected by straight legs. With regard to the high inductance requirements for Ethernet applications (350μH), the racetrack transformer inductance is analytically optimized, determining the optimal physical dimensions. Two sizes of racetrack-core transformers were fabricated and measured. The measured inductance was in reasonable agreement with the analytical prediction, though large variations in material permeability are expected from the mechanical processing of the ferrite. Some of the experimental transformers were observed to satisfy the Ethernet inductance requirement.

Fabrication of universal serial bus flash disk type microfluidic chip electrophoresis and application for protein analysis under ultra low voltage

PubMed Central

Cong, Hailin; Xu, Xiaodan; Yu, Bing; Liu, Huwei

2016-01-01

A simple and effective universal serial bus (USB) flash disk type microfluidic chip electrophoresis (MCE) was developed by using poly(dimethylsiloxane) based soft lithography and dry film based printed circuit board etching techniques in this paper. The MCE had a microchannel diameter of 375 μm and an effective length of 25 mm. Equipped with a conventional online electrochemical detector, the device enabled effectively separation of bovine serum albumin, lysozyme, and cytochrome c in 80 s under the ultra low voltage from a computer USB interface. Compared with traditional capillary electrophoresis, the USB flash disk type MCE is not only portable and inexpensive but also fast with high separation efficiency. PMID:27042249

Sensing Passive Eye Response to Impact Induced Head Acceleration Using MEMS IMUs.

PubMed

Meng, Yuan; Bottenfield, Brent; Bolding, Mark; Liu, Lei; Adams, Mark L

2018-02-01

The eye may act as a surrogate for the brain in response to head acceleration during an impact. Passive eye movements in a dynamic system are sensed by microelectromechanical systems (MEMS) inertial measurement units (IMU) in this paper. The technique is validated using a three-dimensional printed scaled human skull model and on human volunteers by performing drop-and-impact experiments with ribbon-style flexible printed circuit board IMUs inserted in the eyes and reference IMUs on the heads. Data are captured by a microcontroller unit and processed using data fusion. Displacements are thus estimated and match the measured parameters. Relative accelerations and displacements of the eye to the head are computed indicating the influence of the concussion causing impacts.

Design principles and realization of electro-optical circuit boards

NASA Astrophysics Data System (ADS)

Betschon, Felix; Lamprecht, Tobias; Halter, Markus; Beyer, Stefan; Peterson, Harry

2013-02-01

The manufacturing of electro-optical circuit boards (EOCB) is based to a large extent on established technologies. First products with embedded polymer waveguides are currently produced in series. The range of applications within the sensor and data communication markets is growing with the increasing maturity level. EOCBs require design flows, processes and techniques similar to existing printed circuit board (PCB) manufacturing and appropriate for optical signal transmission. A key aspect is the precise and automated assembly of active and passive optical components to the optical waveguides which has to be supported by the technology. The design flow is described after a short introduction into the build-up of EOCBs and the motivation for the usage of this technology within the different application fields. Basis for the design of EOCBs are the required optical signal transmission properties. Thereafter, the devices for the electro-optical conversion are chosen and the optical coupling approach is defined. Then, the planar optical elements (waveguides, splitters, couplers) are designed and simulated. This phase already requires co-design of the optical and electrical domain using novel design flows. The actual integration of an optical system into a PCB is shown in the last part. The optical layer is thereby laminated to the purely electrical PCB using a conventional PCB-lamination process to form the EOCB. The precise alignment of the various electrical and optical layers is thereby essential. Electrical vias are then generated, penetrating also the optical layer, to connect the individual electrical layers. Finally, the board has to be tested electrically and optically.

The present triumphs and future problems with wave soldering

DOE Office of Scientific and Technical Information (OSTI.GOV)

Vianco, P.T.

1993-10-01

Nearly 40 years of experience with wave soldering have resulted in processes that routinely produce several thousand, defect-free solder joints per minute. However, the climate of electronics manufacturing has changed significantly over the past 10 to 15 years. Environmental restrictions as well as the high quality of products made offshore has placed new demands and challenges on the electronics industry, right down to the assembly process. The impact on wave soldering by environmental regulations and a need for more cost-competitive manufacturing processes has become a serious issue in terms of the economical well-being of the industry. In order to obtainmore » a clearer understanding of the situation, however, it is first most appropriate and necessary to examine the technology of wave soldering. Historically, wave soldering was developed as a refinement of the dip and drag soldering processes with the objective of reducing or eliminating many of the associated defects often present in these earlier processes. Wave soldering reduces the area of contact between the circuit board and the solder. This characteristic, coupled with the agitation generated in the solder, allows flux and its volatile by-products to readily escape from under the board, decreasing the number of skips, unfilled holes, and solder joint voids. The reduced contact area also lessens the potential for thermal damage to the circuit board laminate. Control of the wave profile at the exit point of the circuit board lessens the likelihood of icicles and bridges forming on the solder joints; this latitude is not available in the dip soldering process.« less

Elements configuration of the open lead test circuit

DOE Office of Scientific and Technical Information (OSTI.GOV)

Fukuzaki, Yumi, E-mail: 14514@sr.kagawa-nct.ac.jp; Ono, Akira

In the field of electronics, small electronic devices are widely utilized because they are easy to carry. The devices have various functions by user’s request. Therefore, the lead’s pitch or the ball’s pitch have been narrowed and high-density printed circuit board has been used in the devices. Use of the ICs which have narrow lead pitch makes normal connection difficult. When logic circuits in the devices are fabricated with the state-of-the-art technology, some faults have occurred more frequently. It can be divided into types of open faults and short faults. We have proposed a new test method using a testmore » circuit in the past. This paper propose elements configuration of the test circuit.« less

Reusable vibration resistant integrated circuit mounting socket

DOE Office of Scientific and Technical Information (OSTI.GOV)

Evans, C.N.

1993-12-31

This invention discloses a novel form of socket for integrated circuits to be mounted on printed circuit boards. The socket uses a novel contact which is fabricated out of a bimetallic strip with a shape which makes the end of the strip move laterally as temperature changes. The end of the strip forms a barb which digs into an integrated circuit lead at normal temperatures and hold it firmly in the contact, preventing loosening and open circuits from vibration. By cooling the contact containing the bimetallic strip the barb end can be made to release so that the integrated circuitmore » lead can be removed from the socket without damage either to the lead or to the socket components.« less

Reusable vibration resistant integrated circuit mounting socket

DOE Office of Scientific and Technical Information (OSTI.GOV)

Evans, C.N.

1995-08-29

This invention discloses a novel form of socket for integrated circuits to be mounted on printed circuit boards. The socket uses a novel contact which is fabricated out of a bimetallic strip with a shape which makes the end of the strip move laterally as temperature changes. The end of the strip forms a barb which digs into an integrated circuit lead at normal temperatures and holds it firmly in the contact, preventing loosening and open circuits from vibration. By cooling the contact containing the bimetallic strip the barb end can be made to release so that the integrated circuitmore » lead can be removed from the socket without damage either to the lead or to the socket components. 11 figs.« less

Universal programmable quantum circuit schemes to emulate an operator

DOE Office of Scientific and Technical Information (OSTI.GOV)

Daskin, Anmer; Grama, Ananth; Kollias, Giorgos

Unlike fixed designs, programmable circuit designs support an infinite number of operators. The functionality of a programmable circuit can be altered by simply changing the angle values of the rotation gates in the circuit. Here, we present a new quantum circuit design technique resulting in two general programmable circuit schemes. The circuit schemes can be used to simulate any given operator by setting the angle values in the circuit. This provides a fixed circuit design whose angles are determined from the elements of the given matrix-which can be non-unitary-in an efficient way. We also give both the classical and quantummore » complexity analysis for these circuits and show that the circuits require a few classical computations. For the electronic structure simulation on a quantum computer, one has to perform the following steps: prepare the initial wave function of the system; present the evolution operator U=e{sup -iHt} for a given atomic and molecular Hamiltonian H in terms of quantum gates array and apply the phase estimation algorithm to find the energy eigenvalues. Thus, in the circuit model of quantum computing for quantum chemistry, a crucial step is presenting the evolution operator for the atomic and molecular Hamiltonians in terms of quantum gate arrays. Since the presented circuit designs are independent from the matrix decomposition techniques and the global optimization processes used to find quantum circuits for a given operator, high accuracy simulations can be done for the unitary propagators of molecular Hamiltonians on quantum computers. As an example, we show how to build the circuit design for the hydrogen molecule.« less

Resistence seam welding thin copper foils

DOE Office of Scientific and Technical Information (OSTI.GOV)

Hollar, D.L. Jr.

1991-02-01

Use of flat flexible circuits in the electronics industry is expanding. The term flexible circuits'' is defined here as copper foil which has been bonded to an insulating film such as Kapton film. The foil is photo processed to produce individual circuit paths similar to printed circuit boards. Another insulating film is laminated over the conductors to complete the flexible circuit. Flexible circuits, like multiwire cables, are susceptible to electromagnetic radiation (EMR) interference. On multiwire cables the interference problem is mitigated by adding a woven wire braid shielding over the conductors. Shielding on flexible circuits is accomplished by enclosing themore » circuits in a copper foil envelope. However, the copper foil must be electrically sealed around the flexcircuit to be effective. Ultimately, a resistance seam welding process and appropriate equipment were developed which would provide the required electrical seal between two layers of 2-oz (0.0028-inch thick) copper foil on a 1.1-inch wide, 30-inch long, 0.040-inch thick flexible circuit. 4 refs., 19 figs.« less

Computer-aided engineering of semiconductor integrated circuits

NASA Astrophysics Data System (ADS)

Meindl, J. D.; Dutton, R. W.; Gibbons, J. F.; Helms, C. R.; Plummer, J. D.; Tiller, W. A.; Ho, C. P.; Saraswat, K. C.; Deal, B. E.; Kamins, T. I.

1980-07-01

Economical procurement of small quantities of high performance custom integrated circuits for military systems is impeded by inadequate process, device and circuit models that handicap low cost computer aided design. The principal objective of this program is to formulate physical models of fabrication processes, devices and circuits to allow total computer-aided design of custom large-scale integrated circuits. The basic areas under investigation are (1) thermal oxidation, (2) ion implantation and diffusion, (3) chemical vapor deposition of silicon and refractory metal silicides, (4) device simulation and analytic measurements. This report discusses the fourth year of the program.

Digital circuits for computer applications: A compilation

NASA Technical Reports Server (NTRS)

1972-01-01

The innovations in this updated series of compilations dealing with electronic technology represent a carefully selected collection of digital circuits which have direct application in computer oriented systems. In general, the circuits have been selected as representative items of each section and have been included on their merits of having universal applications in digital computers and digital data processing systems. As such, they should have wide appeal to the professional engineer and scientist who encounter the fundamentals of digital techniques in their daily activities. The circuits are grouped as digital logic circuits, analog to digital converters, and counters and shift registers.

Electromagnetic Compatibility Design of the Computer Circuits

NASA Astrophysics Data System (ADS)

Zitai, Hong

2018-02-01

Computers and the Internet have gradually penetrated into every aspect of people’s daily work. But with the improvement of electronic equipment as well as electrical system, the electromagnetic environment becomes much more complex. Electromagnetic interference has become an important factor to hinder the normal operation of electronic equipment. In order to analyse the computer circuit compatible with the electromagnetic compatibility, this paper starts from the computer electromagnetic and the conception of electromagnetic compatibility. And then, through the analysis of the main circuit and system of computer electromagnetic compatibility problems, we can design the computer circuits in term of electromagnetic compatibility. Finally, the basic contents and methods of EMC test are expounded in order to ensure the electromagnetic compatibility of equipment.

An easy-to-operate portable pulse-height analysis system for area monitoring with TEPC in radiation protection

NASA Astrophysics Data System (ADS)

Kunz, A.; Pihet, P.; Arend, E.; Menzel, H. G.

1990-12-01

A portable area monitor for the measurement of dose-equivalent quantities in practical radiation-protection work has been developed. The detector applied is a low-pressure proportional counter (TEPC) used in microdosimetry. The complex analysis system required has been optimized with regard to low power consumption and small size to achieve a real operational survey meter. The newly designed electronic includes complete analog, digital and microprocessor boards. It presents the characteristic of fast pulse-height processing over a large (5 decades) dynamic range. Three original circuits have been specifically developed, consisting of: (1) a miniaturized adjustable high-voltage power supply with low ripple and high stability; (2) a double spectroscopy amplifier with constant gain ratio and common pole-zero stage; and (3) an analog-to-digital converter with quasi-logarithmic characteristics based on a flash converter using fast comparators associated in parallel. With the incorporated single-board computer, the maximal total power consumption is 5 W, enabling 40 hours operation time with batteries. With minor adaptations the equipment is proposed as a low-cost solution for various measuring problems in environmental studies.

Evaluation of Electrochemical Migration on Printed Circuit Boards with Lead-Free and Tin-Lead Solder

NASA Astrophysics Data System (ADS)

He, Xiaofei; Azarian, Michael H.; Pecht, Michael G.

2011-09-01

To evaluate the current leakage and electrochemical migration behavior on printed circuit boards with eutectic tin-lead and lead-free solder, IPC B-24 comb structures were exposed to 65°C and 88% relative humidity conditions under direct-current (DC) bias for over 1500 h. These boards were processed with either Sn-3.0Ag-0.5Cu solder or Sn-37Pb solder. In addition to solder alloy, board finish (organic solderability preservative versus lead-free hot air solder leveling), spacing (25 mil versus 12.5 mil), and voltage (40 V versus 5 V bias) were also assessed by using in situ measurements of surface insulation resistance (SIR) and energy-dispersive spectroscopy after testing. It was shown that an initial increase of SIR was caused by consumption of electroactive species on the surface, intermittent drops of SIR were caused by dendritic growth, and a long-term SIR decline was caused by electrodeposition of a metallic layer. The prolonged SIR decline of Sn-3.0Ag-0.5Cu boards was simulated by three-dimensional (3D) progressive and instantaneous nucleation models, whose predictions were compared with experimental data. Sn-37Pb boards exhibited comigration of Sn, Pb, and Cu, while Sn-3.0Ag-0.5Cu boards incurred comigration of Sn, Ag, and Cu. Among the migrated species, Sn always dominated and was observed as either a layer or in polyhedral deposits, Pb was the most common element found in the dendrites, Cu was a minor constituent, and Ag migrated only occasionally. Compared with solder alloy, board finishes played a secondary role in affecting SIR due to their complexation with or dissolution into the solder. The competing effect between electric field and spacing was also investigated.

Packaging of electro-microfluidic devices

DOEpatents

Benavides, Gilbert L.; Galambos, Paul C.; Emerson, John A.; Peterson, Kenneth A.; Giunta, Rachel K.; Zamora, David Lee; Watson, Robert D.

2003-04-15

A new architecture for packaging surface micromachined electro-microfluidic devices is presented. This architecture relies on two scales of packaging to bring fluid to the device scale (picoliters) from the macro-scale (microliters). The architecture emulates and utilizes electronics packaging technology. The larger package consists of a circuit board with embedded fluidic channels and standard fluidic connectors (e.g. Fluidic Printed Wiring Board). The embedded channels connect to the smaller package, an Electro-Microfluidic Dual-Inline-Package (EMDIP) that takes fluid to the microfluidic integrated circuit (MIC). The fluidic connection is made to the back of the MIC through Bosch-etched holes that take fluid to surface micromachined channels on the front of the MIC. Electrical connection is made to bond pads on the front of the MIC.

Packaging of electro-microfluidic devices

DOEpatents

Benavides, Gilbert L.; Galambos, Paul C.; Emerson, John A.; Peterson, Kenneth A.; Giunta, Rachel K.; Watson, Robert D.

2002-01-01

A new architecture for packaging surface micromachined electro-microfluidic devices is presented. This architecture relies on two scales of packaging to bring fluid to the device scale (picoliters) from the macro-scale (microliters). The architecture emulates and utilizes electronics packaging technology. The larger package consists of a circuit board with embedded fluidic channels and standard fluidic connectors (e.g. Fluidic Printed Wiring Board). The embedded channels connect to the smaller package, an Electro-Microfluidic Dual-Inline-Package (EMDIP) that takes fluid to the microfluidic integrated circuit (MIC). The fluidic connection is made to the back of the MIC through Bosch-etched holes that take fluid to surface micromachined channels on the front of the MIC. Electrical connection is made to bond pads on the front of the MIC.

A process for preparing an ultra-thin, adhesiveless, multi-layered, patterned polymer substrate

NASA Technical Reports Server (NTRS)

Bryant, Robert G. (Inventor); Kruse, Nancy H. M. (Inventor); Fox, Robert L. (Inventor); Tran, Sang Q. (Inventor)

1995-01-01

A process for preparing an ultra-thin, adhesiveless, multi-layered, patterned polymer substrate is disclosed. The process may be used to prepare both rigid and flexible cables and circuit boards. A substrate is provided and a polymeric solution comprising a self-bonding, soluble polymer and a solvent is applied to the substrate. Next, the polymer solution is dried to form a polymer coated substrate. The polymer coated substrate is metallized and patterned. At least one additional coating of the polymeric solution is applied to the metallized, patterned, polymer coated substrate and the steps of metallizing and patterning are repeated. Lastly, a cover coat is applied. When preparing a flexible cable and flexible circuit board, the polymer coating is removed from the substrate.

Concepts for on-board satellite image registration. Volume 3: Impact of VLSI/VHSIC on satellite on-board signal processing

NASA Technical Reports Server (NTRS)

Aanstoos, J. V.; Snyder, W. E.

1981-01-01

Anticipated major advances in integrated circuit technology in the near future are described as well as their impact on satellite onboard signal processing systems. Dramatic improvements in chip density, speed, power consumption, and system reliability are expected from very large scale integration. Improvements are expected from very large scale integration enable more intelligence to be placed on remote sensing platforms in space, meeting the goals of NASA's information adaptive system concept, a major component of the NASA End-to-End Data System program. A forecast of VLSI technological advances is presented, including a description of the Defense Department's very high speed integrated circuit program, a seven-year research and development effort.

A programming language for composable DNA circuits

PubMed Central

Phillips, Andrew; Cardelli, Luca

2009-01-01

Recently, a range of information-processing circuits have been implemented in DNA by using strand displacement as their main computational mechanism. Examples include digital logic circuits and catalytic signal amplification circuits that function as efficient molecular detectors. As new paradigms for DNA computation emerge, the development of corresponding languages and tools for these paradigms will help to facilitate the design of DNA circuits and their automatic compilation to nucleotide sequences. We present a programming language for designing and simulating DNA circuits in which strand displacement is the main computational mechanism. The language includes basic elements of sequence domains, toeholds and branch migration, and assumes that strands do not possess any secondary structure. The language is used to model and simulate a variety of circuits, including an entropy-driven catalytic gate, a simple gate motif for synthesizing large-scale circuits and a scheme for implementing an arbitrary system of chemical reactions. The language is a first step towards the design of modelling and simulation tools for DNA strand displacement, which complements the emergence of novel implementation strategies for DNA computing. PMID:19535415

A programming language for composable DNA circuits.

PubMed

Phillips, Andrew; Cardelli, Luca

2009-08-06

Recently, a range of information-processing circuits have been implemented in DNA by using strand displacement as their main computational mechanism. Examples include digital logic circuits and catalytic signal amplification circuits that function as efficient molecular detectors. As new paradigms for DNA computation emerge, the development of corresponding languages and tools for these paradigms will help to facilitate the design of DNA circuits and their automatic compilation to nucleotide sequences. We present a programming language for designing and simulating DNA circuits in which strand displacement is the main computational mechanism. The language includes basic elements of sequence domains, toeholds and branch migration, and assumes that strands do not possess any secondary structure. The language is used to model and simulate a variety of circuits, including an entropy-driven catalytic gate, a simple gate motif for synthesizing large-scale circuits and a scheme for implementing an arbitrary system of chemical reactions. The language is a first step towards the design of modelling and simulation tools for DNA strand displacement, which complements the emergence of novel implementation strategies for DNA computing.

Logic circuits based on molecular spider systems.

PubMed

Mo, Dandan; Lakin, Matthew R; Stefanovic, Darko

2016-08-01

Spatial locality brings the advantages of computation speed-up and sequence reuse to molecular computing. In particular, molecular walkers that undergo localized reactions are of interest for implementing logic computations at the nanoscale. We use molecular spider walkers to implement logic circuits. We develop an extended multi-spider model with a dynamic environment wherein signal transmission is triggered via localized reactions, and use this model to implement three basic gates (AND, OR, NOT) and a cascading mechanism. We develop an algorithm to automatically generate the layout of the circuit. We use a kinetic Monte Carlo algorithm to simulate circuit computations, and we analyze circuit complexity: our design scales linearly with formula size and has a logarithmic time complexity. Copyright © 2016 Elsevier Ireland Ltd. All rights reserved.

Flame Retardancy of Chemically Modified Lignin as Functional Additive to Epoxy Nanocomposites

Treesearch

John A. Howarter; Gamini P. Mendis; Alex N. Bruce; Jeffrey P. Youngblood; Mark A. Dietenberger; Laura Hasburgh

2015-01-01

Epoxy printed circuit boards are used in a variety of electronics applications as rigid, thermally stable substrates. Due to the propensity of components on the boards, such as batteries and interconnects, to fail and ignite the epoxy, flame retardant additives are required to minimize fire risk. Currently, industry uses brominated flame retardants, such as TBBPA, to...

Piezoelectric Response of Ferroelectric Ceramics Under Mechanical Stress

DTIC Science & Technology

2015-09-17

dynamic response, and predict mechanical breakdown of electronic materials, numerous testing techniques such as very high-g machines , drop towers...James C. Hierholzer for building the custom test fixture, Michael D. Craft for his help with static capacitance measurements, Bryan J. Turner, Scott D...ISOLA 370HR Board Specimen Test Set-Up . . . . . . . . . . . . . . . . . . 59 3.3 Printed Circuit Board Electrical Layout

Silver Ink For Jet Printing

NASA Technical Reports Server (NTRS)

Vest, R. W.; Singaram, Saraswathi

1989-01-01

Metallo-organic ink containing silver (with some bismuth as adhesion agent) applied to printed-circuit boards and pyrolized in air to form electrically conductive patterns. Ink contains no particles of silver, does not have to be mixed during use to maintain homogeneity, and applied to boards by ink-jet printing heads. Consists of silver neodecanoate and bismuth 2-ethylhexanoate dissolved in xylene and/or toluene.

Measurement of luminescence decays: High performance at low cost

NASA Astrophysics Data System (ADS)

Sulkes, Mark; Sulkes, Zoe

2011-11-01

The availability of inexpensive ultra bright LEDs spanning the visible and near-ultraviolet combined with the availability of inexpensive electronics equipment makes it possible to construct a high performance luminescence lifetime apparatus (˜5 ns instrumental response or better) at low cost. A central need for time domain measurement systems is the ability to obtain short (˜1 ns or less) excitation light pulses from the LEDs. It is possible to build the necessary LED driver using a simple avalanche transistor circuit. We describe first a circuit to test for small signal NPN transistors that can avalanche. We then describe a final optimized avalanche mode circuit that we developed on a prototyping board by measuring driven light pulse duration as a function of the circuit on the board and passive component values. We demonstrate that the combination of the LED pulser and a 1P28 photomultiplier tube used in decay waveform acquisition has a time response that allows for detection and lifetime determination of luminescence decays down to ˜5 ns. The time response and data quality afforded with the same components in time-correlated single photon counting are even better. For time-correlated single photon counting an even simpler NAND-gate based LED driver circuit is also applicable. We also demonstrate the possible utility of a simple frequency domain method for luminescence lifetime determinations.

Study on the influence of various factors in the hydrometallurgical processing of waste printed circuit boards for copper and gold recovery.

PubMed

Birloaga, Ionela; De Michelis, Ida; Ferella, Francesco; Buzatu, Mihai; Vegliò, Francesco

2013-04-01

The present lab-scale experimental study presents the process of leaching waste printed circuit boards (WPCBs) in order to recover gold by thioureation. Preliminary tests have shown that copper adversely affects gold extraction; therefore an oxidative leaching pre-treatment was performed in order to remove base metals. The effects of sulfuric acid concentration, hydrogen peroxide volume and temperature on the metal extraction yield were studied by analysis of variance (ANOVA). The highest copper extraction yields were 76.12% for sample A and 18.29% for sample D, after leaching with 2M H2SO4, 20 ml of 30% H2O2 at 30°C for 3h. In order to improve Cu removal, a second leaching was performed only on sample A, resulting in a Cu extraction yield of 90%. Other experiments have shown the negative effect of the stirring rate on copper dissolution. The conditions used for the process of gold extraction by thiourea were: 20 g/L thiourea, 6g/L ferric ion, 10 g/L sulfuric acid, 600 rpm stirring rate. To study the influence of temperature and particle size, this process was tested on pins manually removed from computer central processing units (CPUs) and on waste CPU for 3½ h. A gold extraction yield of 69% was obtained after 75% of Cu was removed by a double oxidative leaching treatment of WPCBs with particle sizes smaller than 2 mm. Copyright © 2013 Elsevier Ltd. All rights reserved.

Plasticity in single neuron and circuit computations

NASA Astrophysics Data System (ADS)

Destexhe, Alain; Marder, Eve

2004-10-01

Plasticity in neural circuits can result from alterations in synaptic strength or connectivity, as well as from changes in the excitability of the neurons themselves. To better understand the role of plasticity in the brain, we need to establish how brain circuits work and the kinds of computations that different circuit structures achieve. By linking theoretical and experimental studies, we are beginning to reveal the consequences of plasticity mechanisms for network dynamics, in both simple invertebrate circuits and the complex circuits of mammalian cerebral cortex.

Non-unitary probabilistic quantum computing circuit and method

NASA Technical Reports Server (NTRS)

Williams, Colin P. (Inventor); Gingrich, Robert M. (Inventor)

2009-01-01

A quantum circuit performing quantum computation in a quantum computer. A chosen transformation of an initial n-qubit state is probabilistically obtained. The circuit comprises a unitary quantum operator obtained from a non-unitary quantum operator, operating on an n-qubit state and an ancilla state. When operation on the ancilla state provides a success condition, computation is stopped. When operation on the ancilla state provides a failure condition, computation is performed again on the ancilla state and the n-qubit state obtained in the previous computation, until a success condition is obtained.

Superior model for fault tolerance computation in designing nano-sized circuit systems

DOE Office of Scientific and Technical Information (OSTI.GOV)

Singh, N. S. S., E-mail: narinderjit@petronas.com.my; Muthuvalu, M. S., E-mail: msmuthuvalu@gmail.com; Asirvadam, V. S., E-mail: vijanth-sagayan@petronas.com.my

2014-10-24

As CMOS technology scales nano-metrically, reliability turns out to be a decisive subject in the design methodology of nano-sized circuit systems. As a result, several computational approaches have been developed to compute and evaluate reliability of desired nano-electronic circuits. The process of computing reliability becomes very troublesome and time consuming as the computational complexity build ups with the desired circuit size. Therefore, being able to measure reliability instantly and superiorly is fast becoming necessary in designing modern logic integrated circuits. For this purpose, the paper firstly looks into the development of an automated reliability evaluation tool based on the generalizationmore » of Probabilistic Gate Model (PGM) and Boolean Difference-based Error Calculator (BDEC) models. The Matlab-based tool allows users to significantly speed-up the task of reliability analysis for very large number of nano-electronic circuits. Secondly, by using the developed automated tool, the paper explores into a comparative study involving reliability computation and evaluation by PGM and, BDEC models for different implementations of same functionality circuits. Based on the reliability analysis, BDEC gives exact and transparent reliability measures, but as the complexity of the same functionality circuits with respect to gate error increases, reliability measure by BDEC tends to be lower than the reliability measure by PGM. The lesser reliability measure by BDEC is well explained in this paper using distribution of different signal input patterns overtime for same functionality circuits. Simulation results conclude that the reliability measure by BDEC depends not only on faulty gates but it also depends on circuit topology, probability of input signals being one or zero and also probability of error on signal lines.« less

Programmable logic devices

NASA Astrophysics Data System (ADS)

Jacobs, J. L.

1993-04-01

Erasable programmable logic devices (EPLD's) were investigated to determine their advantages and/or disadvantages in Test Equipment Engineering applications. It was found that EPLD's performed as well as or better than identical circuits using standard transistor transistor logic (TTL). The chip count in these circuits was reduced, saving printed circuit board space and shortening fabrication and prove-in time. Troubleshooting circuits of EPLD's was also easier with 10 to 100 times fewer wires needed. The reduced number of integrated circuits (IC's) contributed to faster system speeds and an overall lower power consumption. In some cases changes to the circuit became software changes using EPLD's instead of hardware changes for standard logic. Using EPLD's was fairly easy; however, as with any new technology, a learning curve must be overcome before EPLD's can be used efficiently. The many benefits of EPLD's outweighed this initial inconvenience.

The LANL P14 temperature control electronics for the waveshaping filter

DOE Office of Scientific and Technical Information (OSTI.GOV)

Nahman, N.S.

1993-12-17

The Pulse Waveform Standard is designed to be operated in a laboratory environment in which the temperature is controlled and maintained at 22 C. The temperature controller of the Pulse Waveform Standard must be set to operate at 30 C. This report gives information for calibrating and maintaining the temperature control electronics. Temperature controller circuit diagrams and temperature controller circuit board layouts are included.

Method of defining features on materials with a femtosecond laser

DOEpatents

Roos, Edward Victor [Los Altos, CA; Roeske, Franklin [Livermore, CA; Lee, Ronald S [Livermore, CA; Benterou, Jerry J [Livermore, CA

2006-05-23

The invention relates to a pulsed laser ablation method of metals and/or dielectric films from the surface of a wafer, printed circuit board or a hybrid substrate. By utilizing a high-energy ultra-short pulses of laser light, such a method can be used to manufacture electronic circuits and/or electro-mechanical assemblies without affecting the material adjacent to the ablation zone.

47 CFR 15.102 - CPU boards and power supplies used in personal computers.

Code of Federal Regulations, 2013 CFR

2013-10-01

... computers. 15.102 Section 15.102 Telecommunication FEDERAL COMMUNICATIONS COMMISSION GENERAL RADIO FREQUENCY DEVICES Unintentional Radiators § 15.102 CPU boards and power supplies used in personal computers. (a... modifications that must be made to a personal computer, peripheral device, CPU board or power supply during...

47 CFR 15.102 - CPU boards and power supplies used in personal computers.

Code of Federal Regulations, 2011 CFR

2011-10-01

... computers. 15.102 Section 15.102 Telecommunication FEDERAL COMMUNICATIONS COMMISSION GENERAL RADIO FREQUENCY DEVICES Unintentional Radiators § 15.102 CPU boards and power supplies used in personal computers. (a... modifications that must be made to a personal computer, peripheral device, CPU board or power supply during...

47 CFR 15.102 - CPU boards and power supplies used in personal computers.

Code of Federal Regulations, 2010 CFR

2010-10-01

... computers. 15.102 Section 15.102 Telecommunication FEDERAL COMMUNICATIONS COMMISSION GENERAL RADIO FREQUENCY DEVICES Unintentional Radiators § 15.102 CPU boards and power supplies used in personal computers. (a... modifications that must be made to a personal computer, peripheral device, CPU board or power supply during...

47 CFR 15.102 - CPU boards and power supplies used in personal computers.

Code of Federal Regulations, 2014 CFR

2014-10-01

... computers. 15.102 Section 15.102 Telecommunication FEDERAL COMMUNICATIONS COMMISSION GENERAL RADIO FREQUENCY DEVICES Unintentional Radiators § 15.102 CPU boards and power supplies used in personal computers. (a... modifications that must be made to a personal computer, peripheral device, CPU board or power supply during...

47 CFR 15.102 - CPU boards and power supplies used in personal computers.

Code of Federal Regulations, 2012 CFR

2012-10-01

... computers. 15.102 Section 15.102 Telecommunication FEDERAL COMMUNICATIONS COMMISSION GENERAL RADIO FREQUENCY DEVICES Unintentional Radiators § 15.102 CPU boards and power supplies used in personal computers. (a... modifications that must be made to a personal computer, peripheral device, CPU board or power supply during...

Analog Computation by DNA Strand Displacement Circuits.

PubMed

Song, Tianqi; Garg, Sudhanshu; Mokhtar, Reem; Bui, Hieu; Reif, John

2016-08-19

DNA circuits have been widely used to develop biological computing devices because of their high programmability and versatility. Here, we propose an architecture for the systematic construction of DNA circuits for analog computation based on DNA strand displacement. The elementary gates in our architecture include addition, subtraction, and multiplication gates. The input and output of these gates are analog, which means that they are directly represented by the concentrations of the input and output DNA strands, respectively, without requiring a threshold for converting to Boolean signals. We provide detailed domain designs and kinetic simulations of the gates to demonstrate their expected performance. On the basis of these gates, we describe how DNA circuits to compute polynomial functions of inputs can be built. Using Taylor Series and Newton Iteration methods, functions beyond the scope of polynomials can also be computed by DNA circuits built upon our architecture.

General purpose computer programs for numerically analyzing linear ac electrical and electronic circuits for steady-state conditions

NASA Technical Reports Server (NTRS)

Egebrecht, R. A.; Thorbjornsen, A. R.

1967-01-01

Digital computer programs determine steady-state performance characteristics of active and passive linear circuits. The ac analysis program solves the basic circuit parameters. The compiler program solves these circuit parameters and in addition provides a more versatile program by allowing the user to perform mathematical and logical operations.

Board-to-board optical interconnection using novel optical plug and slot

NASA Astrophysics Data System (ADS)

Cho, In K.; Yoon, Keun Byoung; Ahn, Seong H.; Kim, Jin Tae; Lee, Woo Jin; Shin, Kyoung Up; Heo, Young Un; Park, Hyo Hoon

2004-10-01

A novel optical PCB with transmitter/receiver system boards and optical bakcplane was prepared, which is board-to-board interconnection by optical plug and slot. We report an 8Gb/s PRBS NRZ data transmission between transmitter system board and optical backplane embedded multimode polymeric waveguide arrays. The basic concept of ETRI's optical PCB is as follows; 1) Metal optical bench is integrated with optoelectronic devices, driver and receiver circuits, polymeric waveguide and access line PCB module. 2) Multimode polymeric waveguide inside an optical backplane, which is embedded into PCB. 3) Optical slot and plug for high-density(channel pitch : 500um) board-to-board interconnection. The polymeric waveguide technology can be used for transmission of data on transmitter/ receiver system boards and for backplane interconnections. The main components are low-loss tapered polymeric waveguides and a novel optical plug and slot for board-to-board interconnections, respectively. The optical PCB is characteristic of low coupling loss, easy insertion/extraction of the boards and, especially, reliable optical coupling unaffected from external environment after board insertion.

Heavy metals concentrations of surface dust from e-waste recycling and its human health implications in southeast China.

PubMed

Leung, Anna O W; Duzgoren-Aydin, Nurdan S; Cheung, K C; Wong, Ming H

2008-04-01

The recycling of printed circuit boards in Guiyu, China, a village intensely involved in e-waste processing, may present a significant environmental and human health risk. To evaluate the extent of heavy metals (Cd, Co, Cr, Cu, Ni, Pb, Zn) contamination from printed circuit board recycling, surface dust samples were collected from recycling workshops, adjacent roads, a schoolyard, and an outdoor food market. ICP-OES analyses revealed elevated mean concentrations in workshop dust (Pb 110,000, Cu 8360, Zn 4420, and Ni 1500 mg/kg) and in dust of adjacent roads (Pb 22,600, Cu 6170, Zn 2370, and Ni 304 mg/kg). Lead and Cu in road dust were 330 and 106, and 371 and 155 times higher, respectively, than non e-waste sites located 8 and 30 km away. Levels at the schoolyard and food market showed that public places were adversely impacted. Risk assessment predicted that Pb and Cu originating from circuit board recycling have the potential to pose serious health risks to workers and local residents of Guiyu, especially children, and warrants an urgent investigation into heavy metal related health impacts. The potential environmental and human health consequences due to uncontrolled e-waste recycling in Guiyu serves as a case study for other countries involved in similar crude recycling activities.

Mineralogical analysis of dust collected from typical recycling line of waste printed circuit boards.

PubMed

Wang, Fangfang; Zhao, Yuemin; Zhang, Tao; Duan, Chenlong; Wang, Lizhang

2015-09-01

As dust is one of the byproducts originating in the mechanical recycling process of waste printed circuit boards such as crushing and separating, from the viewpoints of resource reuse and environmental protection, an effective recycling method to recover valuable materials from this kind of dust is in urgent need. In this paper, detailed mineralogical analysis on the dust collected from a typical recycling line of waste printed circuit boards is investigated by coupling several analytical techniques. The results demonstrate that there are 73.1wt.% organic matters, 4.65wt.% Al, 4.55wt.% Fe, 2.67wt.% Cu and 1.06wt.% Pb in the dust, which reveals the dust is worthy of reuse and harmful to environment. The concentration ratios of Fe, Mn and Zn can reach 12.35, 12.33 and 6.67 respectively by magnetic separation. The yield of dust in each size fraction is nonuniform, while the yield of -0.75mm size fraction is up to 51.15wt.%; as the particle size decreases, the content of liberated metals and magnetic materials increase, and metals are mainly in elemental forms. The F, Cl and Br elements combing to C in the dust would make thermal treatment dangerous to the environment. Based on these results, a flowsheet to recycle the dust is proposed. Copyright © 2015 Elsevier Ltd. All rights reserved.

Alumina Based 500 C Electronic Packaging Systems and Future Development

NASA Technical Reports Server (NTRS)

Chen, Liang-Yu

2012-01-01

NASA space and aeronautical missions for probing the inner solar planets as well as for in situ monitoring and control of next-generation aeronautical engines require high-temperature environment operable sensors and electronics. A 96% aluminum oxide and Au thick-film metallization based packaging system including chip-level packages, printed circuit board, and edge-connector is in development for high temperature SiC electronics. An electronic packaging system based on this material system was successfully tested and demonstrated with SiC electronics at 500 C for over 10,000 hours in laboratory conditions previously. In addition to the tests in laboratory environments, this packaging system has more recently been tested with a SiC junction field effect transistor (JFET) on low earth orbit through the NASA Materials on the International Space Station Experiment 7 (MISSE7). A SiC JFET with a packaging system composed of a 96% alumina chip-level package and an alumina printed circuit board mounted on a data acquisition circuit board was launched as a part of the MISSE7 suite to International Space Station via a Shuttle mission and tested on the orbit for eighteen months. A summary of results of tests in both laboratory and space environments will be presented. The future development of alumina based high temperature packaging using co-fired material systems for improved performance at high temperature and more feasible mass production will also be discussed.

Microstrip Butler matrix design and realization for 7 T MRI.

PubMed

Yazdanbakhsh, Pedram; Solbach, Klaus

2011-07-01

This article presents the design and realization of 8 × 8 and 16 × 16 Butler matrices for 7 T MRI systems. With the focus on low insertion loss and high amplitude/phase accuracy, the microstrip line integration technology (microwave-integrated circuit) was chosen for the realization. Laminate material of high permittivity (ε(r) = 11) and large thickness (h = 3.2 mm) is shown to allow the best trade-off of circuit board size versus insertion loss, saving circuit area by extensive folding of branch-line coupler topology and meandering phase shifter and connecting strip lines and reducing mutual coupling of neighboring strip lines by shield structures between strip lines. With this approach, 8 × 8 Butler matrices were produced in single boards of 310 mm × 530 mm, whereas the 16 × 16 Butler matrices combined two submatrices of 8 × 8 with two smaller boards. Insertion loss was found at 0.73 and 1.1 dB for an 8 × 8 matrix and 16 × 16 matrix, respectively. Measured amplitude and phase errors are shown to represent highly pure mode excitation with unwanted modes suppressed by 40 and 35 dB, respectively. Both types of matrices were implemented with a 7 T MRI system and 8- and 16-element coil arrays for RF mode shimming experiments and operated successfully with 8 kW of RF power. Copyright © 2011 Wiley-Liss, Inc.

Pattern classification using charge transfer devices

NASA Technical Reports Server (NTRS)

1980-01-01

The feasibility of using charge transfer devices in the classification of multispectral imagery was investigated by evaluating particular devices to determine their suitability in matrix multiplication subsystem of a pattern classifier and by designing a protype of such a system. Particular attention was given to analog-analog correlator devices which consist of two tapped delay lines, chip multipliers, and a summed output. The design for the classifier and a printed circuit layout for the analog boards were completed and the boards were fabricated. A test j:g for the board was built and checkout was begun.

Universal test system for system embedded optical interconnect

NASA Astrophysics Data System (ADS)

Pitwon, R.; Wang, K.; Immonen, M.; Schröder, H.; Neitz, M.

2018-02-01

We introduce a universal test and measurement system allowing comparative characterisation of optical transceivers, board-to-board optical connectors and both embedded and passive optical circuit boards. The system comprises a test enclosure with interlocking and interchangeable test cards, allowing different technologies spanning different Technology Readiness Levels to be both characterised alone and in combination with other technologies. They form part of the open test design standards portfolio developed on the FP7 PhoxTroT and H2020 COSMICC projects and allow testing on a common test platform.

Smart Board in the Music Classroom

ERIC Educational Resources Information Center

Baker, Jean

2007-01-01

A Smart Board is an interactive whiteboard connected to a computer and a data projector. Images can be projected on the board, and the Smart Board can be used as a computer. A person can control the computer using his finger, and can mark directly on the screen using various colors. Best of all, users can easily import many types of information,…

Phase-lock-loop application for fiber optic receiver

NASA Astrophysics Data System (ADS)

Ruggles, Stephen L.; Wills, Robert W.

1991-02-01

Phase-locked loop circuits are frequently employed in communication systems. In recent years, digital phase-locked loop circuits were utilized in optical communications systems. In an optical transceiver system, the digital phase-locked loop circuit is connected to the output of the receiver to extract a clock signal from the received coded data (NRZ, Bi-Phase, or Manchester). The clock signal is then used to reconstruct or recover the original data from the coded data. A theoretical approach to the design of a digital phase-locked loop circuit operation at 1 and 50 MHz is described. Hardware implementation of a breadboard design to function at 1 MHz and a printed-circuit board designed to function at 50 MHz were assembled using emitter coupled logic (ECL) to verify experimentally the theoretical design.

Phase-lock-loop application for fiber optic receiver

NASA Technical Reports Server (NTRS)

Ruggles, Stephen L.; Wills, Robert W.

1991-01-01

Phase-locked loop circuits are frequently employed in communication systems. In recent years, digital phase-locked loop circuits were utilized in optical communications systems. In an optical transceiver system, the digital phase-locked loop circuit is connected to the output of the receiver to extract a clock signal from the received coded data (NRZ, Bi-Phase, or Manchester). The clock signal is then used to reconstruct or recover the original data from the coded data. A theoretical approach to the design of a digital phase-locked loop circuit operation at 1 and 50 MHz is described. Hardware implementation of a breadboard design to function at 1 MHz and a printed-circuit board designed to function at 50 MHz were assembled using emitter coupled logic (ECL) to verify experimentally the theoretical design.

The Case of Dixon v. Alabama State Board of Education: From Civil Rights to Students' Rights and Back Again

ERIC Educational Resources Information Center

Lee, Philip

2014-01-01

Background/Context: Legal scholars have cited the Fifth Circuit's ruling in Dixon v. Alabama State Board of Education (1961) as the beginning of a revolution for students' rights that ended the in loco parentis relationship between colleges and their students. But little has been written about the students' activism that led to this seminal case.…

Demonstration of Inexact Computing Implemented in the JPEG Compression Algorithm using Probabilistic Boolean Logic applied to CMOS Components

DTIC Science & Technology

2015-12-24

Signal to Noise Ratio SPICE Simulation Program with Integrated Circuit Emphasis TIFF Tagged Image File Format USC University of Southern California xvii...sources can create errors in digital circuits. These effects can be simulated using Simulation Program with Integrated Circuit Emphasis ( SPICE ) or...compute summary statistics. 4.1 Circuit Simulations Noisy analog circuits can be simulated in SPICE or Cadence SpectreTM software via noisy voltage

Space Debris Detection on the HPDP, a Coarse-Grained Reconfigurable Array Architecture for Space

NASA Astrophysics Data System (ADS)

Suarez, Diego Andres; Bretz, Daniel; Helfers, Tim; Weidendorfer, Josef; Utzmann, Jens

2016-08-01

Stream processing, widely used in communications and digital signal processing applications, requires high- throughput data processing that is achieved in most cases using Application-Specific Integrated Circuit (ASIC) designs. Lack of programmability is an issue especially in space applications, which use on-board components with long life-cycles requiring applications updates. To this end, the High Performance Data Processor (HPDP) architecture integrates an array of coarse-grained reconfigurable elements to provide both flexible and efficient computational power suitable for stream-based data processing applications in space. In this work the capabilities of the HPDP architecture are demonstrated with the implementation of a real-time image processing algorithm for space debris detection in a space-based space surveillance system. The implementation challenges and alternatives are described making trade-offs to improve performance at the expense of negligible degradation of detection accuracy. The proposed implementation uses over 99% of the available computational resources. Performance estimations based on simulations show that the HPDP can amply match the application requirements.

Imaging and Analysis of Void-defects in Solder Joints Formed in Reduced Gravity using High-Resolution Computed Tomography

NASA Technical Reports Server (NTRS)

Easton, John W.; Struk, Peter M.; Rotella, Anthony

2008-01-01

As a part of efforts to develop an electronics repair capability for long duration space missions, techniques and materials for soldering components on a circuit board in reduced gravity must be developed. This paper presents results from testing solder joint formation in low gravity on a NASA Reduced Gravity Research Aircraft. The results presented include joints formed using eutectic tin-lead solder and one of the following fluxes: (1) a no-clean flux core, (2) a rosin flux core, and (3) a solid solder wire with external liquid no-clean flux. The solder joints are analyzed with a computed tomography (CT) technique which imaged the interior of the entire solder joint. This replaced an earlier technique that required the solder joint to be destructively ground down revealing a single plane which was subsequently analyzed. The CT analysis technique is described and results presented with implications for future testing as well as implications for the overall electronics repair effort discussed.

Computer-aided design of large-scale integrated circuits - A concept

NASA Technical Reports Server (NTRS)

Schansman, T. T.

1971-01-01

Circuit design and mask development sequence are improved by using general purpose computer with interactive graphics capability establishing efficient two way communications link between design engineer and system. Interactive graphics capability places design engineer in direct control of circuit development.

A spatially localized architecture for fast and modular DNA computing

NASA Astrophysics Data System (ADS)

Chatterjee, Gourab; Dalchau, Neil; Muscat, Richard A.; Phillips, Andrew; Seelig, Georg

2017-09-01

Cells use spatial constraints to control and accelerate the flow of information in enzyme cascades and signalling networks. Synthetic silicon-based circuitry similarly relies on spatial constraints to process information. Here, we show that spatial organization can be a similarly powerful design principle for overcoming limitations of speed and modularity in engineered molecular circuits. We create logic gates and signal transmission lines by spatially arranging reactive DNA hairpins on a DNA origami. Signal propagation is demonstrated across transmission lines of different lengths and orientations and logic gates are modularly combined into circuits that establish the universality of our approach. Because reactions preferentially occur between neighbours, identical DNA hairpins can be reused across circuits. Co-localization of circuit elements decreases computation time from hours to minutes compared to circuits with diffusible components. Detailed computational models enable predictive circuit design. We anticipate our approach will motivate using spatial constraints for future molecular control circuit designs.

Petri-net-based 2D design of DNA walker circuits.

PubMed

Gilbert, David; Heiner, Monika; Rohr, Christian

2018-01-01

We consider localised DNA computation, where a DNA strand walks along a binary decision graph to compute a binary function. One of the challenges for the design of reliable walker circuits consists in leakage transitions, which occur when a walker jumps into another branch of the decision graph. We automatically identify leakage transitions, which allows for a detailed qualitative and quantitative assessment of circuit designs, design comparison, and design optimisation. The ability to identify leakage transitions is an important step in the process of optimising DNA circuit layouts where the aim is to minimise the computational error inherent in a circuit while minimising the area of the circuit. Our 2D modelling approach of DNA walker circuits relies on coloured stochastic Petri nets which enable functionality, topology and dimensionality all to be integrated in one two-dimensional model. Our modelling and analysis approach can be easily extended to 3-dimensional walker systems.

VLSI circuits implementing computational models of neocortical circuits.

PubMed

Wijekoon, Jayawan H B; Dudek, Piotr

2012-09-15

This paper overviews the design and implementation of three neuromorphic integrated circuits developed for the COLAMN ("Novel Computing Architecture for Cognitive Systems based on the Laminar Microcircuitry of the Neocortex") project. The circuits are implemented in a standard 0.35 μm CMOS technology and include spiking and bursting neuron models, and synapses with short-term (facilitating/depressing) and long-term (STDP and dopamine-modulated STDP) dynamics. They enable execution of complex nonlinear models in accelerated-time, as compared with biology, and with low power consumption. The neural dynamics are implemented using analogue circuit techniques, with digital asynchronous event-based input and output. The circuits provide configurable hardware blocks that can be used to simulate a variety of neural networks. The paper presents experimental results obtained from the fabricated devices, and discusses the advantages and disadvantages of the analogue circuit approach to computational neural modelling. Copyright © 2012 Elsevier B.V. All rights reserved.

Method Of Packaging And Assembling Electro-Microfluidic Devices

DOEpatents

Benavides, Gilbert L.; Galambos, Paul C.; Emerson, John A.; Peterson, Kenneth A.; Giunta, Rachel K.; Zamora, David Lee; Watson, Robert D.

2004-11-23

A new architecture for packaging surface micromachined electro-microfluidic devices is presented. This architecture relies on two scales of packaging to bring fluid to the device scale (picoliters) from the macro-scale (microliters). The architecture emulates and utilizes electronics packaging technology. The larger package consists of a circuit board with embedded fluidic channels and standard fluidic connectors (e.g. Fluidic Printed Wiring Board). The embedded channels connect to the smaller package, an Electro-Microfluidic Dual-Inline-Package (EMDIP) that takes fluid to the microfluidic integrated circuit (MIC). The fluidic connection is made to the back of the MIC through Bosch-etched holes that take fluid to surface micromachined channels on the front of the MIC. Electrical connection is made to bond pads on the front of the MIC.

Development of a flexible circuit board for low-background experiments

NASA Astrophysics Data System (ADS)

Poon, Alan; Barton, Paul; Dhar, Ankur; Larsen, Joern; Loach, James

2017-01-01

Future underground rare-event search experiments, such as neutrinoless double-beta decay searches, have stringent requirements for the radiopurity of materials placed near the active detector medium. Parylene is a polymer that has a high chemical purity and the vapor deposition process by which it is laid down tends to purify it further. In this talk the technique to fabricate a low-mass, flexible circuit board, with conductive traces photoligthographically patterned on a parylene substrate, is discussed. The performance of a proof-of-principle temperature sensor is presented. This work was supported by the U.S. Department of Energy, Office of Science, Office of Nuclear Physics, under Contract No. DE-AC02-05CH11231 and by the Shanghai Key Lab for Particle Physics and Cosmology (SKLPPC), Grant No. 15DZ2272100.

Multipurpose microcontroller design for PUGAS 2

NASA Technical Reports Server (NTRS)

Weber, David M.; Deckard, Todd W.

1987-01-01

This paper will report on the past year's work on the development of the microcontroller design for the second Purdue University small self-contained payload. A first report on this effort was given at last year's conference by Ritter (1985). At that time, the project was still at the conceptual stage. Now a specific design has been set, prototyping has begun, and layout of the two-sided circuit board using CAD-techniques is nearing completion. A redesign of the overall concept of the circuit board was done to take advantage of the facilities available to students. An additional controller has been added to take large quantities of data concerning the shuttle environment during takeoff. The importance of setting a design time-line is discussed along with the electrical design considerations given to the controllers.

Design of a smart ECG garment based on conductive textile electrode and flexible printed circuit board.

PubMed

Cai, Zhipeng; Luo, Kan; Liu, Chengyu; Li, Jianqing

2017-08-09

A smart electrocardiogram (ECG) garment system was designed for continuous, non-invasive and comfortable ECG monitoring, which mainly consists of four components: Conductive textile electrode, garment, flexible printed circuit board (FPCB)-based ECG processing module and android application program. Conductive textile electrode and FPCB-based ECG processing module (6.8 g, 55 mm × 53 mm × 5 mm) are identified as two key techniques to improve the system's comfort and flexibility. Preliminary experimental results verified that the textile electrodes with circle shape, 40 mm size in diameter, and 5 mm thickness sponge are best suited for the long-term ECG monitoring application. The tests on the whole system confirmed that the designed smart garment can obtain long-term ECG recordings with high signal quality.

Surface Flashover on Epoxy-Resin Printed Circuit Boards in Vacuum under Electron Irradiation

NASA Astrophysics Data System (ADS)

Fujii, Haruhisa; Hasegawa, Taketoshi; Osuga, Hiroyuki; Matsui, Katsuaki

This paper deals with the surface flashover characteristics of dielectric material in vacuum during electron beam irradiation in order to design adequately the conductive patterns on printed circuit boards used inside a spacecraft. The dielectric material, glass-fiber reinforced epoxy resin, and the electrodes printed on it were irradiated with electrons of the energy of 3-10 keV. DC high voltage was applied between the two electrodes during electron irradiation. The voltage was increased stepwise until the surface flashover occurred on the dielectric material. We obtained the results that the surface flashover voltage increased with the insulation distance between the electrodes but electron irradiation made the flashover voltage lower. The flashover voltage characteristics were obtained as parameters of the electrode distance and the energy of the electron beam.

Design and implementation of a general and automatic test platform base on NI PXI system

NASA Astrophysics Data System (ADS)

Shi, Long

2018-05-01

Aiming at some difficulties of test equipment such as the short product life, poor generality and high development cost, a general and automatic test platform base on NI PXI system is designed in this paper, which is able to meet most test requirements of circuit boards. The test platform is devided into 5 layers, every layer is introduced in detail except for the "Equipment Under Test" layer. An output board of a track-side equipment, which is an important part of high speed train control system, is taken as an example to make the functional circuit test by the test platform. The results show that the test platform is easy to realize add-on functions development, automatic test, wide compatibility and strong generality.

Active alignment/contact verification system

DOEpatents

Greenbaum, William M.

2000-01-01

A system involving an active (i.e. electrical) technique for the verification of: 1) close tolerance mechanical alignment between two component, and 2) electrical contact between mating through an elastomeric interface. For example, the two components may be an alumina carrier and a printed circuit board, two mating parts that are extremely small, high density parts and require alignment within a fraction of a mil, as well as a specified interface point of engagement between the parts. The system comprises pairs of conductive structures defined in the surfaces layers of the alumina carrier and the printed circuit board, for example. The first pair of conductive structures relate to item (1) above and permit alignment verification between mating parts. The second pair of conductive structures relate to item (2) above and permit verification of electrical contact between mating parts.

3D Printed Fluidic Hardware for DNA Assembly

DTIC Science & Technology

2015-04-10

A3909 stepper motor driver, were soldered onto the milled circuit board (Supplementary Figure 8). Custom Arduino - based firmware was written to take...initiatives such as the FabLab Foundation10. Access to digital fabrication tools and open electronics, such as Arduino and Raspberry Pi, enables access to...hardware for assembly of DNA- based genetic circuits. Solid-phase DNA synthesis has declined in price, enabling researchers to routinely design and

Vision Technology for Automated Inspection of Hybrid Microelectronics Assemblies

DTIC Science & Technology

1988-06-01

circuits are a very efficient packaging technique, with the primary advantages of size, better resistance to environ - 0 ments, and the flexibility to...produced for the military are much more complex and have more stringent performance requirements, particularly in their resistance to environments and...boards, particularly because of the need to protect circuits from a hostile environment such as salt, heat, and moisture. Included among the major U.S

Expedition 18 Station Development Test Objectives (STDO) Session 1

NASA Image and Video Library

2009-02-19

ISS018-E-033816 (19 Feb. 2009) --- Astronaut Michael Fincke, Expedition 18 commander, removes, cleans and replaces electronic test components on a single test card using Component Repair Equipment (CRE-1) hardware in a portable glovebox facility in the Harmony node of the International Space Station. Fincke unsoldered 1 1/2 components from an integrated circuit board and re-soldered new components including an integrated circuit chip.

Expedition 18 Station Development Test Objectives (STDO) Session 1

NASA Image and Video Library

2009-02-19

ISS018-E-033818 (19 Feb. 2009) --- Astronaut Michael Fincke, Expedition 18 commander, removes, cleans and replaces electronic test components on a single test card using Component Repair Equipment (CRE-1) hardware in a portable glovebox facility in the Harmony node of the International Space Station. Fincke unsoldered 1 1/2 components from an integrated circuit board and re-soldered new components including an integrated circuit chip.

Electric Circuit Theory--Computer Illustrated Text.

ERIC Educational Resources Information Center

Riches, Brian

1990-01-01

Discusses the use of a computer-illustrated text (CIT) with integrated software to teach electric circuit theory to college students. Examples of software use are given, including simple animation, graphical displays, and problem-solving programs. Issues affecting electric circuit theory instruction are also addressed, including mathematical…

Simple proof of equivalence between adiabatic quantum computation and the circuit model.

PubMed

Mizel, Ari; Lidar, Daniel A; Mitchell, Morgan

2007-08-17

We prove the equivalence between adiabatic quantum computation and quantum computation in the circuit model. An explicit adiabatic computation procedure is given that generates a ground state from which the answer can be extracted. The amount of time needed is evaluated by computing the gap. We show that the procedure is computationally efficient.

Capacitive charge generation apparatus and method for testing circuits

DOEpatents

Cole, E.I. Jr.; Peterson, K.A.; Barton, D.L.

1998-07-14

An electron beam apparatus and method for testing a circuit are disclosed. The electron beam apparatus comprises an electron beam incident on an outer surface of an insulating layer overlying one or more electrical conductors of the circuit for generating a time varying or alternating current electrical potential on the surface; and a measurement unit connected to the circuit for measuring an electrical signal capacitively coupled to the electrical conductors to identify and map a conduction state of each of the electrical conductors, with or without an electrical bias signal being applied to the circuit. The electron beam apparatus can further include a secondary electron detector for forming a secondary electron image for registration with a map of the conduction state of the electrical conductors. The apparatus and method are useful for failure analysis or qualification testing to determine the presence of any open-circuits or short-circuits, and to verify the continuity or integrity of electrical conductors buried below an insulating layer thickness of 1-100 {micro}m or more without damaging or breaking down the insulating layer. The types of electrical circuits that can be tested include integrated circuits, multi-chip modules, printed circuit boards and flexible printed circuits. 7 figs.

Capacitive charge generation apparatus and method for testing circuits

DOEpatents

Cole, Jr., Edward I.; Peterson, Kenneth A.; Barton, Daniel L.

1998-01-01

An electron beam apparatus and method for testing a circuit. The electron beam apparatus comprises an electron beam incident on an outer surface of an insulating layer overlying one or more electrical conductors of the circuit for generating a time varying or alternating current electrical potential on the surface; and a measurement unit connected to the circuit for measuring an electrical signal capacitively coupled to the electrical conductors to identify and map a conduction state of each of the electrical conductors, with or without an electrical bias signal being applied to the circuit. The electron beam apparatus can further include a secondary electron detector for forming a secondary electron image for registration with a map of the conduction state of the electrical conductors. The apparatus and method are useful for failure analysis or qualification testing to determine the presence of any open-circuits or short-circuits, and to verify the continuity or integrity of electrical conductors buried below an insulating layer thickness of 1-100 .mu.m or more without damaging or breaking down the insulating layer. The types of electrical circuits that can be tested include integrated circuits, multi-chip modules, printed circuit boards and flexible printed circuits.

Impedance Discontinuity Reduction Between High-Speed Differential Connectors and PCB Interfaces

NASA Technical Reports Server (NTRS)

Navidi, Sal; Agdinaoay, Rodell; Walter, Keith

2013-01-01

High-speed serial communication (i.e., Gigabit Ethernet) requires differential transmission and controlled impedances. Impedance control is essential throughout cabling, connector, and circuit board construction. An impedance discontinuity arises at the interface of a high-speed quadrax and twinax connectors and the attached printed circuit board (PCB). This discontinuity usually is lower impedance since the relative dielectric constant of the board is higher (i.e., polyimide approx. = 4) than the connector (Teflon approx. = 2.25). The discontinuity can be observed in transmit or receive eye diagrams, and can reduce the effective link margin of serial data networks. High-speed serial data network transmission improvements can be made at the connector-to-board interfaces as well as improving differential via hole impedances. The impedance discontinuity was improved by 10 percent by drilling a 20-mil (approx. = 0.5-mm) hole in between the pin of a differential connector spaced 55 mils (approx. = 1.4 mm) apart as it is attached to the PCB. The effective dielectric constant of the board can be lowered by drilling holes into the board material between the differential lines in a quadrax or twinax connector attachment points. The differential impedance is inversely proportional to the square root of the relative dielectric constant. This increases the differential impedance and thus reduces the above described impedance discontinuity. The differential via hole impedance can also be increased in the same manner. This technique can be extended to multiple smaller drilled holes as well as tapered holes (i.e., big in the middle followed by smaller ones diagonally).

Bistable metamaterial for switching and cascading elastic vibrations

PubMed Central

Foehr, André; Daraio, Chiara

2017-01-01

The realization of acoustic devices analogous to electronic systems, like diodes, transistors, and logic elements, suggests the potential use of elastic vibrations (i.e., phonons) in information processing, for example, in advanced computational systems, smart actuators, and programmable materials. Previous experimental realizations of acoustic diodes and mechanical switches have used nonlinearities to break transmission symmetry. However, existing solutions require operation at different frequencies or involve signal conversion in the electronic or optical domains. Here, we show an experimental realization of a phononic transistor-like device using geometric nonlinearities to switch and amplify elastic vibrations, via magnetic coupling, operating at a single frequency. By cascading this device in a tunable mechanical circuit board, we realize the complete set of mechanical logic elements and interconnect selected ones to execute simple calculations. PMID:28416663

Wide-aperture aspherical lens for high-resolution terahertz imaging

NASA Astrophysics Data System (ADS)

Chernomyrdin, Nikita V.; Frolov, Maxim E.; Lebedev, Sergey P.; Reshetov, Igor V.; Spektor, Igor E.; Tolstoguzov, Viktor L.; Karasik, Valeriy E.; Khorokhorov, Alexei M.; Koshelev, Kirill I.; Schadko, Aleksander O.; Yurchenko, Stanislav O.; Zaytsev, Kirill I.

2017-01-01

In this paper, we introduce wide-aperture aspherical lens for high-resolution terahertz (THz) imaging. The lens has been designed and analyzed by numerical methods of geometrical optics and electrodynamics. It has been made of high-density polyethylene by shaping at computer-controlled lathe and characterized using a continuous-wave THz imaging setup based on a backward-wave oscillator and Golay detector. The concept of image contrast has been implemented to estimate image quality. According to the experimental data, the lens allows resolving two points spaced at 0.95λ distance with a contrast of 15%. To highlight high resolution in the THz images, the wide-aperture lens has been employed for studying printed electronic circuit board containing sub-wavelength-scale elements. The observed results justify the high efficiency of the proposed lens design.

Optical modular arithmetic

NASA Astrophysics Data System (ADS)

Pavlichin, Dmitri S.; Mabuchi, Hideo

2014-06-01

Nanoscale integrated photonic devices and circuits offer a path to ultra-low power computation at the few-photon level. Here we propose an optical circuit that performs a ubiquitous operation: the controlled, random-access readout of a collection of stored memory phases or, equivalently, the computation of the inner product of a vector of phases with a binary selector" vector, where the arithmetic is done modulo 2pi and the result is encoded in the phase of a coherent field. This circuit, a collection of cascaded interferometers driven by a coherent input field, demonstrates the use of coherence as a computational resource, and of the use of recently-developed mathematical tools for modeling optical circuits with many coupled parts. The construction extends in a straightforward way to the computation of matrix-vector and matrix-matrix products, and, with the inclusion of an optical feedback loop, to the computation of a weighted" readout of stored memory phases. We note some applications of these circuits for error correction and for computing tasks requiring fast vector inner products, e.g. statistical classification and some machine learning algorithms.

CIRCUS--A digital computer program for transient analysis of electronic circuits

NASA Technical Reports Server (NTRS)

Moore, W. T.; Steinbert, L. L.

1968-01-01

Computer program simulates the time domain response of an electronic circuit to an arbitrary forcing function. CIRCUS uses a charge-control parameter model to represent each semiconductor device. Given the primary photocurrent, the transient behavior of a circuit in a radiation environment is determined.

Modular integration of electronics and microfluidic systems using flexible printed circuit boards.

PubMed

Wu, Amy; Wang, Lisen; Jensen, Erik; Mathies, Richard; Boser, Bernhard

2010-02-21

Microfluidic systems offer an attractive alternative to conventional wet chemical methods with benefits including reduced sample and reagent volumes, shorter reaction times, high-throughput, automation, and low cost. However, most present microfluidic systems rely on external means to analyze reaction products. This substantially adds to the size, complexity, and cost of the overall system. Electronic detection based on sub-millimetre size integrated circuits (ICs) has been demonstrated for a wide range of targets including nucleic and amino acids, but deployment of this technology to date has been limited due to the lack of a flexible process to integrate these chips within microfluidic devices. This paper presents a modular and inexpensive process to integrate ICs with microfluidic systems based on standard printed circuit board (PCB) technology to assemble the independently designed microfluidic and electronic components. The integrated system can accommodate multiple chips of different sizes bonded to glass or PDMS microfluidic systems. Since IC chips and flex PCB manufacturing and assembly are industry standards with low cost, the integrated system is economical for both laboratory and point-of-care settings.

Digital data, composite video multiplexer and demultiplexer boards for an IBM PC/AT compatible computer

NASA Technical Reports Server (NTRS)

Smith, Dean Lance

1993-01-01

Work continued on the design of two IBM PC/AT compatible computer interface boards. The boards will permit digital data to be transmitted over a composite video channel from the Orbiter. One board combines data with a composite video signal. The other board strips the data from the video signal.

Management of Microcircuit Obsolescence in a Pre-Production ACAT-ID Missile Program

DTIC Science & Technology

2002-12-01

and Engineering Center ASIC Application Specific Integrated Circuit AVCOM Avionics Component Obsolescence Management BRU Battery Replaceable Unit...then just a paper qualification, e.g. Board or Battery Replaceable Unit ( BRU ) testing. 5 After-market Package The Die is Available and Can Be...Encapsulated Microcircuits (PEM), speed change, failure rate) 8 Emulation Manufacture or re-engineering of a FFF Replacement 9 CCA or BRU Redesign Board

77 FR 56989 - Airworthiness Directives; Bombardier Inc. Airplanes

Federal Register 2010, 2011, 2012, 2013, 2014

2012-09-17

... (TMU). Investigation has revealed that the failures were attributed to overstressed capacitors installed in the circuit board of the TMU ``Module 300'' power supply. The failure of the capacitors leads...

77 FR 16191 - Airworthiness Directives; Bombardier Inc. Airplanes

Federal Register 2010, 2011, 2012, 2013, 2014

2012-03-20

... (TMU). Investigation has revealed that the failures were attributed to overstressed capacitors installed in the circuit board of the TMU ``Module 300'' power supply. The failure of the capacitors leads...

GRC-2013-C-02448

NASA Image and Video Library

2009-06-23

Environmental Portrait, Electrical Power Systems Employee, hardware for the High Power 300-Volt Power Processing Unit (PPU). The Printed Circuit Boards (PCBs) are the Discharge Module Inverter and the Pulse Width Modulation (PWM) Controller

GaAs Optoelectronic Integrated-Circuit Neurons

NASA Technical Reports Server (NTRS)

Lin, Steven H.; Kim, Jae H.; Psaltis, Demetri

1992-01-01

Monolithic GaAs optoelectronic integrated circuits developed for use as artificial neurons. Neural-network computer contains planar arrays of optoelectronic neurons, and variable synaptic connections between neurons effected by diffraction of light from volume hologram in photorefractive material. Basic principles of neural-network computers explained more fully in "Optoelectronic Integrated Circuits For Neural Networks" (NPO-17652). In present circuits, devices replaced by metal/semiconductor field effect transistors (MESFET's), which consume less power.

Computer-aided linear-circuit design.

NASA Technical Reports Server (NTRS)

Penfield, P.

1971-01-01

Usually computer-aided design (CAD) refers to programs that analyze circuits conceived by the circuit designer. Among the services such programs should perform are direct network synthesis, analysis, optimization of network parameters, formatting, storage of miscellaneous data, and related calculations. The program should be embedded in a general-purpose conversational language such as BASIC, JOSS, or APL. Such a program is MARTHA, a general-purpose linear-circuit analyzer embedded in APL.

Life cycle assessment of a printed circuit board manufacturing plant in Turkey.

PubMed

Ozkan, Elif; Elginoz, Nilay; Germirli Babuna, Fatos

2017-09-29

The objective of this study is to investigate the environmental impacts of a printed circuit board (PCB) manufacturing plant through streamlined life cycle assessment approach. As a result, the most effective recommendations on minimizing the environmental impacts for the mentioned sector are revealed and first steps towards establishing a country specific database are taken. The whole PCB production consists of two consecutive stages: namely board fabrication followed by the manufacturing of PCB. Manufacturing of PCB contributes the highest shares to freshwater aquatic ecotoxicity potential (FAETP) and ozone layer depletion potential (ODP). Eighty-nine percent of FAETP is found to be generated from the manufacturing of PCB. Almost all of this contribution can be attributed to the disposal of copper containing wastewater treatment sludge from etching operations to incineration. On the other hand, PCB manufacturing has 73% share in total ODP. Within the manufacturing of PCB, as etching operations are found to be of importance for all the impact categories except eutrophication potential (EP), it is recommended to focus further studies on in-plant control of etching.

A Low-cost 4 Bit, 10 Giga-samples-per-second Analog-to-digital Converter Printed Circuit Board Assembly for FPGA-based Backends

NASA Astrophysics Data System (ADS)

Jiang, Homin; Yu, Chen-Yu; Kubo, Derek; Chen, Ming-Tang; Guzzino, Kim

2016-11-01

In this study, a 4 bit, 10 giga-samples-per-second analog-to-digital converter (ADC) printed circuit board assembly (PCBA) was designed, manufactured, and characterized for digitizing radio telescopes. For this purpose, an Adsantec ANST7120A-KMA flash ADC chip was used. Together with the field-programmable gate array platform, developed by the Collaboration for Astronomy Signal Processing and Electronics Research community, the PCBA enables data acquisition with a wide bandwidth and simplifies the intermediate frequency section. In the current version, the PCBA and the chip exhibit an analog bandwidth of 10 GHz (3 dB loss) and 20 GHz, respectively, which facilitates second, third, and even fourth Nyquist sampling. The following average performance parameters were obtained from the first and second Nyquist zones of the three boards: a spurious-free dynamic range of 31.35/30.45 dB, a signal-to-noise and distortion ratio of 22.95/21.83 dB, and an effective number of bits of 3.65/3.43, respectively.

Synthetic analog computation in living cells.

PubMed

Daniel, Ramiz; Rubens, Jacob R; Sarpeshkar, Rahul; Lu, Timothy K

2013-05-30

A central goal of synthetic biology is to achieve multi-signal integration and processing in living cells for diagnostic, therapeutic and biotechnology applications. Digital logic has been used to build small-scale circuits, but other frameworks may be needed for efficient computation in the resource-limited environments of cells. Here we demonstrate that synthetic analog gene circuits can be engineered to execute sophisticated computational functions in living cells using just three transcription factors. Such synthetic analog gene circuits exploit feedback to implement logarithmically linear sensing, addition, ratiometric and power-law computations. The circuits exhibit Weber's law behaviour as in natural biological systems, operate over a wide dynamic range of up to four orders of magnitude and can be designed to have tunable transfer functions. Our circuits can be composed to implement higher-order functions that are well described by both intricate biochemical models and simple mathematical functions. By exploiting analog building-block functions that are already naturally present in cells, this approach efficiently implements arithmetic operations and complex functions in the logarithmic domain. Such circuits may lead to new applications for synthetic biology and biotechnology that require complex computations with limited parts, need wide-dynamic-range biosensing or would benefit from the fine control of gene expression.

Effective algorithm for routing integral structures with twolayer switching

NASA Astrophysics Data System (ADS)

Nazarov, A. V.; Shakhnov, V. A.; Vlasov, A. I.; Novikov, A. N.

2018-05-01

The paper presents an algorithm for routing switching objects such as large-scale integrated circuits (LSICs) with two layers of metallization, embossed printed circuit boards, microboards with pairs of wiring layers on each side, and other similar constructs. The algorithm allows eliminating the effect of mutual blocking of routes in the classical wave algorithm by implementing a special circuit of digital wave motion in two layers of metallization, allowing direct intersections of all circuit conductors in a combined layer. However, information about the belonging of the topology elements to the circuits is sufficient for layering and minimizing the number of contact holes. In addition, the paper presents a specific example which shows that, in contrast to the known routing algorithms using a wave model, just one byte of memory per discrete of the work field is sufficient to implement the proposed algorithm.

The evolvability of programmable hardware.

PubMed

Raman, Karthik; Wagner, Andreas

2011-02-06

In biological systems, individual phenotypes are typically adopted by multiple genotypes. Examples include protein structure phenotypes, where each structure can be adopted by a myriad individual amino acid sequence genotypes. These genotypes form vast connected 'neutral networks' in genotype space. The size of such neutral networks endows biological systems not only with robustness to genetic change, but also with the ability to evolve a vast number of novel phenotypes that occur near any one neutral network. Whether technological systems can be designed to have similar properties is poorly understood. Here we ask this question for a class of programmable electronic circuits that compute digital logic functions. The functional flexibility of such circuits is important in many applications, including applications of evolutionary principles to circuit design. The functions they compute are at the heart of all digital computation. We explore a vast space of 10(45) logic circuits ('genotypes') and 10(19) logic functions ('phenotypes'). We demonstrate that circuits that compute the same logic function are connected in large neutral networks that span circuit space. Their robustness or fault-tolerance varies very widely. The vicinity of each neutral network contains circuits with a broad range of novel functions. Two circuits computing different functions can usually be converted into one another via few changes in their architecture. These observations show that properties important for the evolvability of biological systems exist in a commercially important class of electronic circuitry. They also point to generic ways to generate fault-tolerant, adaptable and evolvable electronic circuitry.

The evolvability of programmable hardware

PubMed Central

Raman, Karthik; Wagner, Andreas

2011-01-01

In biological systems, individual phenotypes are typically adopted by multiple genotypes. Examples include protein structure phenotypes, where each structure can be adopted by a myriad individual amino acid sequence genotypes. These genotypes form vast connected ‘neutral networks’ in genotype space. The size of such neutral networks endows biological systems not only with robustness to genetic change, but also with the ability to evolve a vast number of novel phenotypes that occur near any one neutral network. Whether technological systems can be designed to have similar properties is poorly understood. Here we ask this question for a class of programmable electronic circuits that compute digital logic functions. The functional flexibility of such circuits is important in many applications, including applications of evolutionary principles to circuit design. The functions they compute are at the heart of all digital computation. We explore a vast space of 1045 logic circuits (‘genotypes’) and 1019 logic functions (‘phenotypes’). We demonstrate that circuits that compute the same logic function are connected in large neutral networks that span circuit space. Their robustness or fault-tolerance varies very widely. The vicinity of each neutral network contains circuits with a broad range of novel functions. Two circuits computing different functions can usually be converted into one another via few changes in their architecture. These observations show that properties important for the evolvability of biological systems exist in a commercially important class of electronic circuitry. They also point to generic ways to generate fault-tolerant, adaptable and evolvable electronic circuitry. PMID:20534598

Rapid evolution of analog circuits configured on a field programmable transistor array

NASA Technical Reports Server (NTRS)

Stoica, A.; Ferguson, M. I.; Zebulum, R. S.; Keymeulen, D.; Duong, V.; Daud, T.

2002-01-01

The purpose of this paper is to illustrate evolution of analog circuits on a stand-alone board-level evolvable system (SABLES). SABLES is part of an effort to achieve integrated evolvable systems. SABLES provides autonomous, fast (tens to hundreds of seconds), on-chip circuit evolution involving about 100,000 circuit evaluations. Its main components are a JPL Field Programmable Transistor Array (FPTA) chip used as transistor-level reconfigurable hardware, and a TI DSP that implements the evolutionary algorithm controlling the FPTA reconfiguration. The paper details an example of evolution on SABLES and points out to certain transient and memory effects that affect the stability of solutions obtained reusing the same piece of hardware for rapid testing of individuals during evolution.

Wireless, intraoral hybrid electronics for real-time quantification of sodium intake toward hypertension management.

PubMed

Lee, Yongkuk; Howe, Connor; Mishra, Saswat; Lee, Dong Sup; Mahmood, Musa; Piper, Matthew; Kim, Youngbin; Tieu, Katie; Byun, Hun-Soo; Coffey, James P; Shayan, Mahdis; Chun, Youngjae; Costanzo, Richard M; Yeo, Woon-Hong

2018-05-22

Recent wearable devices offer portable monitoring of biopotentials, heart rate, or physical activity, allowing for active management of human health and wellness. Such systems can be inserted in the oral cavity for measuring food intake in regard to controlling eating behavior, directly related to diseases such as hypertension, diabetes, and obesity. However, existing devices using plastic circuit boards and rigid sensors are not ideal for oral insertion. A user-comfortable system for the oral cavity requires an ultrathin, low-profile, and soft electronic platform along with miniaturized sensors. Here, we introduce a stretchable hybrid electronic system that has an exceptionally small form factor, enabling a long-range wireless monitoring of sodium intake. Computational study of flexible mechanics and soft materials provides fundamental aspects of key design factors for a tissue-friendly configuration, incorporating a stretchable circuit and sensor. Analytical calculation and experimental study enables reliable wireless circuitry that accommodates dynamic mechanical stress. Systematic in vitro modeling characterizes the functionality of a sodium sensor in the electronics. In vivo demonstration with human subjects captures the device feasibility for real-time quantification of sodium intake, which can be used to manage hypertension.

New Discrete Fibonacci Charge Pump Design, Evaluation and Measurement

NASA Astrophysics Data System (ADS)

Matoušek, David; Hospodka, Jiří; Šubrt, Ondřej

2017-06-01

This paper focuses on the practical aspects of the realisation of Dickson and Fibonacci charge pumps. Standard Dickson charge pump circuit solution and new Fibonacci charge pump implementation are compared. Both charge pumps were designed and then evaluated by LTspice XVII simulations and realised in a discrete form on printed circuit board (PCB). Finally, the key parameters as the output voltage, efficiency, rise time, variable power supply and clock frequency effects were measured.

Designing an Electronics Data Package for Printed Circuit Boards (PCBs)

DTIC Science & Technology

2013-08-01

finished PCB flatness deviation should be less than 0.010 inches per inch. 4  The minimum copper wall thickness of plated-thru holes should be...Memory Card International Association)  IPC-6015 MCM-L (Multi-Chip Module – Laminated )  IPC-6016 HDI (High Density Interconnect)  IPC-6018...Interconnect ICT In Circuit Tester IPC Association Connecting Electronics Industries MCM-L Multi-Chip Module – Laminated MIL Military NEMA National

Catalytic nucleic acids (DNAzymes) as functional units for logic gates and computing circuits: from basic principles to practical applications.

PubMed

Orbach, Ron; Willner, Bilha; Willner, Itamar

2015-03-11

This feature article addresses the implementation of catalytic nucleic acids as functional units for the construction of logic gates and computing circuits, and discusses the future applications of these systems. The assembly of computational modules composed of DNAzymes has led to the operation of a universal set of logic gates, to field programmable logic gates and computing circuits, to the development of multiplexers/demultiplexers, and to full-adder systems. Also, DNAzyme cascades operating as logic gates and computing circuits were demonstrated. DNAzyme logic systems find important practical applications. These include the use of DNAzyme-based systems for sensing and multiplexed analyses, for the development of controlled release and drug delivery systems, for regulating intracellular biosynthetic pathways, and for the programmed synthesis and operation of cascades.

Equivalent circuit simulation of HPEM-induced transient responses at nonlinear loads

NASA Astrophysics Data System (ADS)

Kotzev, Miroslav; Bi, Xiaotang; Kreitlow, Matthias; Gronwald, Frank

2017-09-01

In this paper the equivalent circuit modeling of a nonlinearly loaded loop antenna and its transient responses to HPEM field excitations are investigated. For the circuit modeling the general strategy to characterize the nonlinearly loaded antenna by a linear and a nonlinear circuit part is pursued. The linear circuit part can be determined by standard methods of antenna theory and numerical field computation. The modeling of the nonlinear circuit part requires realistic circuit models of the nonlinear loads that are given by Schottky diodes. Combining both parts, appropriate circuit models are obtained and analyzed by means of a standard SPICE circuit simulator. It is the main result that in this way full-wave simulation results can be reproduced. Furthermore it is clearly seen that the equivalent circuit modeling offers considerable advantages with respect to computation speed and also leads to improved physical insights regarding the coupling between HPEM field excitation and nonlinearly loaded loop antenna.

41 CFR 60-20.5 - Discriminatory wages.

Code of Federal Regulations, 2011 CFR

2011-07-01

... functional units: One (assembly) all female; another (wiring), all male; and a third (circuit boards), also all male. The highest wage attainable in the assembly unit is considerably less than that in the...

Rover 2

NASA Image and Video Library

2003-11-07

In the Payload Hazardous Servicing Facility, the lander petals of the Mars Exploration Rover 2 MER-2 have been reopened and its solar panels deployed to allow technicians access to the spacecraft to remove one of its circuit boards.

Surface and Electrical Characterization of Ag/AgCl Pseudo-Reference Electrodes Manufactured with Commercially Available PCB Technologies

PubMed Central

Moschou, Despina; Trantidou, Tatiana; Regoutz, Anna; Carta, Daniela; Morgan, Hywel; Prodromakis, Themistoklis

2015-01-01

Lab-on-Chip is a technology that could potentially revolutionize medical Point-of-Care diagnostics. Considerable research effort is focused towards innovating production technologies that will make commercial upscaling financially viable. Printed circuit board manufacturing techniques offer several prospects in this field. Here, we present a novel approach to manufacturing Printed Circuit Board (PCB)-based Ag/AgCl reference electrodes, an essential component of biosensors. Our prototypes were characterized both structurally and electrically. Scanning Electron Microscopy (SEM) and X-Ray Photoelectron Spectroscopy (XPS) were employed to evaluate the electrode surface characteristics. Electrical characterization was performed to determine stability and pH dependency. Finally, we demonstrate utilization along with PCB pH sensors, as a step towards a fully integrated PCB platform, comparing performance with discrete commercial reference electrodes. PMID:26213940

Recovery of Precious and Base Metals from Waste Printed Circuit Boards Using a Sequential Leaching Procedure

NASA Astrophysics Data System (ADS)

Batnasan, Altansukh; Haga, Kazutoshi; Shibayama, Atsushi

2018-02-01

This paper considers the issue of recycling of waste printed circuit boards (WPCBs) containing precious and base metals in appreciable amounts. High-pressure oxidative leaching (HPOL) with dilute sulfuric acid resulted in removal of a significant amount of base metals from a WPCB ash sample obtained by incineration at 800°C. The parameters investigated in the precious metal leaching from WPCB residue after HPOL included the sulfuric acid concentration, thiourea concentration, oxidant concentration, leaching temperature, and leaching time. Recovery of gold, silver, and palladium of 100%, 81%, and 13% from the WPCB residue sample was achieved by thiourea leaching under optimized conditions. The results show that the efficiency of precious metal dissolution from the WPCB sample using thiourea solution depended strongly on the concentration of both thiourea and oxidant.

Recovery of Precious and Base Metals from Waste Printed Circuit Boards Using a Sequential Leaching Procedure

NASA Astrophysics Data System (ADS)

Batnasan, Altansukh; Haga, Kazutoshi; Shibayama, Atsushi

2017-12-01

This paper considers the issue of recycling of waste printed circuit boards (WPCBs) containing precious and base metals in appreciable amounts. High-pressure oxidative leaching (HPOL) with dilute sulfuric acid resulted in removal of a significant amount of base metals from a WPCB ash sample obtained by incineration at 800°C. The parameters investigated in the precious metal leaching from WPCB residue after HPOL included the sulfuric acid concentration, thiourea concentration, oxidant concentration, leaching temperature, and leaching time. Recovery of gold, silver, and palladium of 100%, 81%, and 13% from the WPCB residue sample was achieved by thiourea leaching under optimized conditions. The results show that the efficiency of precious metal dissolution from the WPCB sample using thiourea solution depended strongly on the concentration of both thiourea and oxidant.

A new strain for recovering precious metals from waste printed circuit boards.

PubMed

Ruan, Jujun; Zhu, Xingjiong; Qian, Yiming; Hu, Jian

2014-05-01

A new strain, Pseudomonas Chlororaphis (PC), was found for dissolving gold, silver, and copper from the metallic particles of crushed waste printed circuit boards (PCBs). The optimized conditions that greatly improved the ability of producing CN- (for dissolving metals) were obtained. Dissolving experiments of pure gold, silver, and copper showed that the metals could be changed into Au+, Ag+, and Cu2+. PC cells and their secreta would adsorb metallic ions. Meanwhile, metallic ions destroyed the growth of PC. Dissolving experiments of metallic particles from crushed waste PCBs were performed by PC. The results indicated that 8.2% of the gold, 12.1% silver, and 52.3% copper were dissolved into solution. This paper contributed significance information to recovering precious metals from waste PCBs by bioleaching. Copyright © 2014 Elsevier Ltd. All rights reserved.

Leaded electronic waste is a possible source material for lead-contaminated jewelry.

PubMed

Weidenhamer, Jeffrey D; Clement, Michael L

2007-10-01

Highly leaded jewelry, often imported from China, remains widely available in the United States. Leaded electronic waste is exported from the United States to several Asian countries where solder is recovered and circuit boards are stripped of parts in small workshops. To assess whether electronic waste is being recycled into the jewelry, lead, tin and copper content of highly leaded jewelry samples were determined by atomic absorption spectrometry. Sixteen jewelry items previously determined to contain 20-80% lead by weight were analyzed. Samples were digested in nitric acid for analysis of lead and copper, and in aqua regia for analysis of tin. Six samples contained significant amounts of tin, from 20.8% to 29.9% by weight. In addition, copper was a significant minor component of five of these samples (up to 4% by weight). Copper (present at 10-40% by weight in circuit boards) was shown to rapidly move into heated lead-tin solder. The combined lead-tin-copper content of these six items ranges from 93.5% to 100%, suggestive of a solder-based source material. These results are consistent with the hypothesis that recycled circuit board solders are being used to produce some of the heavily leaded imported jewelry sold in the United States. Should this hypothesis be substantiated, it suggests that environmental policies to protect children's health must address both proper recycling of source materials as well as restrictions of the lead content in consumer goods.

Selective separation of copper over solder alloy from waste printed circuit boards leach solution.

PubMed

Kavousi, Maryam; Sattari, Anahita; Alamdari, Eskandar Keshavarz; Firozi, Sadegh

2017-02-01

The printed circuit boards (PCBs) from electronic waste are important resource, since the PCBs contain precious metals such as gold, copper, tin, silver, platinum and so forth. In addition to the economic point of view, the presence of lead turns this scrap into dangerous to environment. This study was conducted as part of the development of a novel process for selective recovery of copper over tin and lead from printed circuit boards by HBF 4 leaching. In previous study, Copper with solder alloy was associated, simultaneously were leached in HBF 4 solution using hydrogen peroxide as an oxidant at room temperature. The objective of this study is the separation of copper from tin and lead from Fluoroborate media using CP-150 as an extractant. The influence of organic solvent's concentration, pH, temperature and A/O phase ratio was investigated. The possible extraction mechanism and the composition of the extracted species have been determined. The separation factors for these metals using this agent are reported, while efficient methods for separation of Cu (II) from other metal ions are proposed. The treatment of leach liquor for solvent extraction of copper with CP-150 revealed that 20% CP-150 in kerosene, a 30min period of contact time, and a pH of 3 were sufficient for the extraction of Cu(II) and 99.99% copper was recovered from the leached solution. Copyright © 2016. Published by Elsevier Ltd.

Hydrothermal modification and recycling of nonmetallic particles from waste print circuit boards.

PubMed

Gao, Xuehua; Li, Qisheng; Qiu, Jun

2018-04-01

Nonmetallic particles recycled from waste print circuit boards (NPRPs) were modified by a hydrothermal treatment method and the catalysts, solvents, temperature and time were investigated, which affected the modification effect of NPRPs. The mild hydrothermal treatment method does not need high temperature, and would not cause secondary pollution. Further, the modified NPRPs were used as the raw materials for the epoxy resin and glass fibers/epoxy resin composites, which were prepared by pouring and hot-pressing method. The mechanical properties and morphology of the composites were discussed. The results showed that relative intensity of the hydroxyl bonds on the surface of NPRPs increased 58.9% after modification. The mechanical tests revealed that both flexural and impact properties of the composites can be significantly improved by adding the modified NPRPs. Particularly, the maximum increment of flexural strength, flexural modulus and impact strength of the epoxy matrix composites with 30% modified NPRPs is 40.1%, 80.0% and 79.0%, respectively. Hydrothermal treatment can modify surface of NPRPs successfully and modified NPRPs can not only improve the properties of the composites, but also reduce the production cost of the composites and environmental pollution. Thus, we develop a new way to recycle nonmetallic materials of waste print circuit boards and the highest level of waste material recycling with the raw materials-products-raw materials closed cycle can be realized through the hydrothermal modification and reuse of NPRPs. Copyright © 2018 Elsevier Ltd. All rights reserved.

E-Learning System Using Segmentation-Based MR Technique for Learning Circuit Construction

ERIC Educational Resources Information Center

Takemura, Atsushi

2016-01-01

This paper proposes a novel e-Learning system using the mixed reality (MR) technique for technical experiments involving the construction of electronic circuits. The proposed system comprises experimenters' mobile computers and a remote analysis system. When constructing circuits, each learner uses a mobile computer to transmit image data from the…

State-variable analysis of non-linear circuits with a desk computer

NASA Technical Reports Server (NTRS)

Cohen, E.

1981-01-01

State variable analysis was used to analyze the transient performance of non-linear circuits on a desk top computer. The non-linearities considered were not restricted to any circuit element. All that is required for analysis is the relationship defining each non-linearity be known in terms of points on a curve.

Logic circuits from zero forcing.

PubMed

Burgarth, Daniel; Giovannetti, Vittorio; Hogben, Leslie; Severini, Simone; Young, Michael

We design logic circuits based on the notion of zero forcing on graphs; each gate of the circuits is a gadget in which zero forcing is performed. We show that such circuits can evaluate every monotone Boolean function. By using two vertices to encode each logical bit, we obtain universal computation. We also highlight a phenomenon of "back forcing" as a property of each function. Such a phenomenon occurs in a circuit when the input of gates which have been already used at a given time step is further modified by a computation actually performed at a later stage. Finally, we show that zero forcing can be also used to implement reversible computation. The model introduced here provides a potentially new tool in the analysis of Boolean functions, with particular attention to monotonicity. Moreover, in the light of applications of zero forcing in quantum mechanics, the link with Boolean functions may suggest a new directions in quantum control theory and in the study of engineered quantum spin systems. It is an open technical problem to verify whether there is a link between zero forcing and computation with contact circuits.

Vehicle to grid: electric vehicles as an energy storage solution

NASA Astrophysics Data System (ADS)

McGee, Rodney; Waite, Nicholas; Wells, Nicole; Kiamilev, Fouad E.; Kempton, Willett M.

2013-05-01

With increased focus on intermittent renewable energy sources such as wind turbines and photovoltaics, there comes a rising need for large-scale energy storage. The vehicle to grid (V2G) project seeks to meet this need using electric vehicles, whose high power capacity and existing power electronics make them a promising energy storage solution. This paper will describe a charging system designed by the V2G team that facilitates selective charging and backfeeding by electric vehicles. The system consists of a custom circuit board attached to an embedded linux computer that is installed both in the EVSE (electric vehicle supply equipment) and in the power electronics unit of the vehicle. The boards establish an in-band communication link between the EVSE and the vehicle, giving the vehicle internet connectivity and the ability to make intelligent decisions about when to charge and discharge. This is done while maintaining compliance with existing charging protocols (SAEJ1772, IEC62196) and compatibility with standard "nonintelligent" cars and chargers. Through this system, the vehicles in a test fleet have been able to successfully serve as portable temporary grid storage, which has implications for regulating the electrical grid, providing emergency power, or supplying power to forward military bases.

Two- and three-input TALE-based AND logic computation in embryonic stem cells.

PubMed

Lienert, Florian; Torella, Joseph P; Chen, Jan-Hung; Norsworthy, Michael; Richardson, Ryan R; Silver, Pamela A

2013-11-01

Biological computing circuits can enhance our ability to control cellular functions and have potential applications in tissue engineering and medical treatments. Transcriptional activator-like effectors (TALEs) represent attractive components of synthetic gene regulatory circuits, as they can be designed de novo to target a given DNA sequence. We here demonstrate that TALEs can perform Boolean logic computation in mammalian cells. Using a split-intein protein-splicing strategy, we show that a functional TALE can be reconstituted from two inactive parts, thus generating two-input AND logic computation. We further demonstrate three-piece intein splicing in mammalian cells and use it to perform three-input AND computation. Using methods for random as well as targeted insertion of these relatively large genetic circuits, we show that TALE-based logic circuits are functional when integrated into the genome of mouse embryonic stem cells. Comparing construct variants in the same genomic context, we modulated the strength of the TALE-responsive promoter to improve the output of these circuits. Our work establishes split TALEs as a tool for building logic computation with the potential of controlling expression of endogenous genes or transgenes in response to a combination of cellular signals.

STICAP: A linear circuit analysis program with stiff systems capability. Volume 1: Theory manual. [network analysis

NASA Technical Reports Server (NTRS)

Cooke, C. H.

1975-01-01

STICAP (Stiff Circuit Analysis Program) is a FORTRAN 4 computer program written for the CDC-6400-6600 computer series and SCOPE 3.0 operating system. It provides the circuit analyst a tool for automatically computing the transient responses and frequency responses of large linear time invariant networks, both stiff and nonstiff (algorithms and numerical integration techniques are described). The circuit description and user's program input language is engineer-oriented, making simple the task of using the program. Engineering theories underlying STICAP are examined. A user's manual is included which explains user interaction with the program and gives results of typical circuit design applications. Also, the program structure from a systems programmer's viewpoint is depicted and flow charts and other software documentation are given.

Computer aided design of monolithic microwave and millimeter wave integrated circuits and subsystems

NASA Astrophysics Data System (ADS)

Ku, Walter H.

1989-05-01

The objectives of this research are to develop analytical and computer aided design techniques for monolithic microwave and millimeter wave integrated circuits (MMIC and MIMIC) and subsystems and to design and fabricate those ICs. Emphasis was placed on heterojunction-based devices, especially the High Electron Mobility Transition (HEMT), for both low noise and medium power microwave and millimeter wave applications. Circuits to be considered include monolithic low noise amplifiers, power amplifiers, and distributed and feedback amplifiers. Interactive computer aided design programs were developed, which include large signal models of InP MISFETs and InGaAs HEMTs. Further, a new unconstrained optimization algorithm POSM was developed and implemented in the general Analysis and Design program for Integrated Circuit (ADIC) for assistance in the design of largesignal nonlinear circuits.

Compressed quantum computation using a remote five-qubit quantum computer

NASA Astrophysics Data System (ADS)

Hebenstreit, M.; Alsina, D.; Latorre, J. I.; Kraus, B.

2017-05-01

The notion of compressed quantum computation is employed to simulate the Ising interaction of a one-dimensional chain consisting of n qubits using the universal IBM cloud quantum computer running on log2(n ) qubits. The external field parameter that controls the quantum phase transition of this model translates into particular settings of the quantum gates that generate the circuit. We measure the magnetization, which displays the quantum phase transition, on a two-qubit system, which simulates a four-qubit Ising chain, and show its agreement with the theoretical prediction within a certain error. We also discuss the relevant point of how to assess errors when using a cloud quantum computer with a limited amount of runs. As a solution, we propose to use validating circuits, that is, to run independent controlled quantum circuits of similar complexity to the circuit of interest.

An Optimization System with Parallel Processing for Reducing Common-Mode Current on Electronic Control Unit

NASA Astrophysics Data System (ADS)

Okazaki, Yuji; Uno, Takanori; Asai, Hideki

In this paper, we propose an optimization system with parallel processing for reducing electromagnetic interference (EMI) on electronic control unit (ECU). We adopt simulated annealing (SA), genetic algorithm (GA) and taboo search (TS) to seek optimal solutions, and a Spice-like circuit simulator to analyze common-mode current. Therefore, the proposed system can determine the adequate combinations of the parasitic inductance and capacitance values on printed circuit board (PCB) efficiently and practically, to reduce EMI caused by the common-mode current. Finally, we apply the proposed system to an example circuit to verify the validity and efficiency of the system.

NASA Communications Division (NASCOM) Tracking and Data Relay Satellite System (TDRSS) shuttle multiplexer-demultiplexer data system (MDM) and supporting items

NASA Technical Reports Server (NTRS)

New, S. R.

1981-01-01

The multiplexer-demultiplexer (MDM) project included the design, documentation, manufacture, and testing of three MDM Data Systems. The equipment is contained in 59 racks, and includes more than 3,000 circuit boards and 600 microprocessors. Spares, circuit card testers, a master set of programmable integrated circuits, and a program development system were included as deliverables. All three MDM's were installed, and were operationally tested. The systems performed well with no major problems. The progress and problems analysis, addresses schedule conformance, new technology, items awaiting government approval, and project conclusions are summarized. All contract modifications are described.

NASA Communications Division (NASCOM) Tracking and Data Relay Satellite System (TDRSS) shuttle multiplexer-demultiplexer data system (MDM) and supporting items

NASA Astrophysics Data System (ADS)

New, S. R.

1981-06-01

The multiplexer-demultiplexer (MDM) project included the design, documentation, manufacture, and testing of three MDM Data Systems. The equipment is contained in 59 racks, and includes more than 3,000 circuit boards and 600 microprocessors. Spares, circuit card testers, a master set of programmable integrated circuits, and a program development system were included as deliverables. All three MDM's were installed, and were operationally tested. The systems performed well with no major problems. The progress and problems analysis, addresses schedule conformance, new technology, items awaiting government approval, and project conclusions are summarized. All contract modifications are described.

Flexible micro flow sensor for micro aerial vehicles

NASA Astrophysics Data System (ADS)

Zhu, Rong; Que, Ruiyi; Liu, Peng

2017-12-01

This article summarizes our studies on micro flow sensors fabricated on a flexible polyimide circuit board by a low-cost hybrid process of thin-film deposition and circuit printing. The micro flow sensor has merits of flexibility, structural simplicity, easy integrability with circuits, and good sensing performance. The sensor, which adheres to an object surface, can detect the surface flow around the object. In our study, we install the fabricated micro flow sensors on micro aerial vehicles (MAVs) to detect the surface flow variation around the aircraft wing and deduce the aerodynamic parameters of the MAVs in flight. Wind tunnel experiments using the sensors integrated with the MAVs are also conducted.

Presidential Green Chemistry Challenge: 2013 Academic Award

EPA Pesticide Factsheets

Presidential Green Chemistry Challenge 2013 award winner, Prof Richard P. Wool of the University of Delaware, created high-performance materials using vegetable oils, feathers, and flax. Can be used as adhesives, composites, foams, and circuit boards.

77 FR 46024 - Foreign-Trade Zone 8-Toledo, OH; Notification of Proposed Production Activity, Whirlpool...

Federal Register 2010, 2011, 2012, 2013, 2014

2012-08-02

..., AC motors, power supplies, heater tubs, LED light assemblies, triple level and push button switches, control panels, printed circuit boards, power cords, wire harnesses, EMI filters, pressure sensors...

Multi-lead heat sink

DOEpatents

Roose, L.D.

1984-07-03

The disclosure relates to a heat sink used to protect integrated circuits from the heat resulting from soldering them to circuit boards. A tubular housing contains a slidable member which engages somewhat inwardly extending connecting rods, each of which is rotatably attached at one end to the bottom of the housing. The other end of each rod is fastened to an expandable coil spring loop. As the member is pushed downward in the housing, its bottom edge engages and forces outward the connecting rods, thereby expanding the spring so that it will fit over an integrated circuit. After the device is in place, the member is slid upward and the spring contracts about the leads of the integrated circuit. Soldering is now conducted and the spring absorbs excess heat therefrom to protect the integrated circuit. The placement steps are repeated in reverse order to remove the heat sink for use again. 4 figs.