Leaching Studies for Copper and Solder Alloy Recovery from Shredded Particles of Waste Printed Circuit Boards

NASA Astrophysics Data System (ADS)

Kavousi, Maryam; Sattari, Anahita; Alamdari, Eskandar Keshavarz; Fatmehsari, Davoud Haghshenas

2018-03-01

Printed circuit boards (PCBs) comprise various metals such as Cu, Sn, and Pb, as well as platinum group metals. The recovery of metals from PCBs is important not only due to the waste treatment but also for recycling of valuable metals. In the present work, the leaching process of Cu, Sn, and Pb from PCBs was studied using fluoroboric acid and hydrogen peroxide as the leaching agent and oxidant, respectively. Pertinent factors including concentration of acid, temperature, liquid-solid ratio, and concentration of oxidizing agent were evaluated. The results showed 99 pct of copper and 90 pct solder alloy were dissolved at a temperature of 298 K (25 °C) for 180 minutes using 0.6 M HBF4 for the particle size range of 0.15 to 0.4 mm. Moreover, solid/liquid ratio had insignificant effect on the recovery of metals. Kinetics analysis revealed that the chemical control regime governs the process with activation energy 41.25 and 38.9 kJ/mol for copper and lead leaching reactions, respectively.

Leaching Studies for Copper and Solder Alloy Recovery from Shredded Particles of Waste Printed Circuit Boards

NASA Astrophysics Data System (ADS)

Kavousi, Maryam; Sattari, Anahita; Alamdari, Eskandar Keshavarz; Fatmehsari, Davoud Haghshenas

2018-06-01

Printed circuit boards (PCBs) comprise various metals such as Cu, Sn, and Pb, as well as platinum group metals. The recovery of metals from PCBs is important not only due to the waste treatment but also for recycling of valuable metals. In the present work, the leaching process of Cu, Sn, and Pb from PCBs was studied using fluoroboric acid and hydrogen peroxide as the leaching agent and oxidant, respectively. Pertinent factors including concentration of acid, temperature, liquid-solid ratio, and concentration of oxidizing agent were evaluated. The results showed 99 pct of copper and 90 pct solder alloy were dissolved at a temperature of 298 K (25 °C) for 180 minutes using 0.6 M HBF4 for the particle size range of 0.15 to 0.4 mm. Moreover, solid/liquid ratio had insignificant effect on the recovery of metals. Kinetics analysis revealed that the chemical control regime governs the process with activation energy 41.25 and 38.9 kJ/mol for copper and lead leaching reactions, respectively.

Reduction Characteristics of FM-Band Cross-Talks between Two Parallel Signal Traces on Printed Circuit Boards for Vehicles

NASA Astrophysics Data System (ADS)

Maeno, Tsuyoshi; Ueyama, Hiroya; Iida, Michihira; Fujiwara, Osamu

It is well known that electromagnetic disturbances in vehicle-mounted radios are mainly caused by conducted noise currents flowing through wiring-harnesses from vehicle-mounted printed circuit boards (PCBs) with common ground patterns with slits. To suppress the noise current outflows from the PCBs of this kind, we previously measured noise current outflows from simple two-layer PCBs having two parallel signal traces and different ground patterns with/without slits, which revealed that making slits with open ends on the ground patterns in parallel with the traces can reduce the conducted noise currents. In the present study, with the FDTD simulation, we investigated reduction characteristics of the FM-band cross-talk noise levels between two parallel signal traces for eighteen PCBs, which have different ground patterns with/without slits parallel to the traces and dielectric layers with different thickness. As a result, we found that the cross-talk reduction effect due to slits is obtained by 3.6-5.3dB, while the cross-talks between signal traces are reduced in inverse proportion to the square of the dielectric-layer thickness and in proportion to the square of the trace interval and, which can quantitatively be explained from an inductive coupling theory.

Qualitative and quantitative metals liberation assessment for characterization of various waste printed circuit boards for recycling.

PubMed

Priya, Anshu; Hait, Subrata

2017-12-01

Metals liberation and composition are decisive attributes in characterization of e-waste for metal recycling. Though end-of-life printed circuit board (PCB) is an integral part of e-waste as secondary resource reservoir, yet no standardized procedure exists for metals liberation and dissolution for its characterization. Thus, the paper aims at assessment of metals liberation upon comminution employing scanning electron microscopy with energy dispersive X-ray spectroscopy (SEM-EDS) followed by comparative assessment of the existing United States Environmental Protection Agency (USEPA) digestion procedures, viz., USEPA 3050B, USEPA 3051A, and USEPA 3052, in effective dissolution of metals from comminuted particles of waste PCBs of computer, laptop, mobile phone, and television. Effect of comminution and digestion conditions was assessed to have significant role in metal liberation and dissolution from PCBs. The SEM-EDS analysis demonstrated partial release of metals from the silica matrix of PCBs. The USEPA digestion methods showed statistically significant (P < 0.05) difference with greater dissolution of metals complexed to PCB matrix by the USEPA 3052 method owing to use of strong acid like hydrofluoric acid. Base metals like Cu and Zn and toxic metals such as Pb and Cd were present in abundance in PCBs and in general exceeded the total threshold limit concentration (TTLC). The maximum contents of Cu (20.13 ± 0.04 wt.%) and Zn (1.89 ± 0.05 wt.%) in laptop PCBs, Pb (2.26 ± 0.08 wt.%) in TV PCBs, and Cd (0.0812 ± 0.0008 wt.%) in computer PCBs were observed.

FDTD Calculation of FM-Band Crosstalks between Perpendicular Traces on Printed Circuit Board with Ground-Pattern Slits

NASA Astrophysics Data System (ADS)

Ueyama, Hiroya; Maeno, Tsuyoshi; Hirata, Akimasa; Wang, Jianqing; Fujiwara, Osamu

Electromagnetic disturbances for vehicle-mounted radios are well known to be caused mainly by conduction noise currents flowing out wire harnesses from printed circuit boards (PCBs) having a common ground layer with slits. In this study, in order to investigate how ground-layer slits affect the above conduction noise currents, we paid FM band induced voltages or crosstalks on the trace connected to the wire harnesss, and simulated with the FDTD method the crosstalk levels between two traces perpendicularly fabricated on three kinds of simple PCBs with different ground-layer slits, which were compared with measurement in the frequency range from 10 MHz to 1 GHz. As a result, we could confirm that the FDTD calculation approximately agrees with the measured results, and also that the crosstalk levels do not always increase with the slit number, which can be reduced by the slit layout.

Bioleaching of gold, copper and nickel from waste cellular phone PCBs and computer goldfinger motherboards by two Aspergillus nigerstrains

PubMed Central

Madrigal-Arias, Jorge Enrique; Argumedo-Delira, Rosalba; Alarcón, Alejandro; Mendoza-López, Ma. Remedios; García-Barradas, Oscar; Cruz-Sánchez, Jesús Samuel; Ferrera-Cerrato, Ronald; Jiménez-Fernández, Maribel

2015-01-01

In an effort to develop alternate techniques to recover metals from waste electrical and electronic equipment (WEEE), this research evaluated the bioleaching efficiency of gold (Au), copper (Cu) and nickel (Ni) by two strains of Aspergillus niger in the presence of gold-plated finger integrated circuits found in computer motherboards (GFICMs) and cellular phone printed circuit boards (PCBs). These three metals were analyzed for their commercial value and their diverse applications in the industry. Au-bioleaching ranged from 42 to 1% for Aspergillus niger strain MXPE6; with the combination of Aspergillus niger MXPE6 + Aspergillus niger MX7, the Au-bioleaching was 87 and 28% for PCBs and GFICMs, respectively. In contrast, the bioleaching of Cu by Aspergillus niger MXPE6 was 24 and 5%; using the combination of both strains, the values were 0.2 and 29% for PCBs and GFICMs, respectively. Fungal Ni-leaching was only found for PCBs, but with no significant differences among treatments. Improvement of the metal recovery efficiency by means of fungal metabolism is also discussed. PMID:26413051

Bioleaching of gold, copper and nickel from waste cellular phone PCBs and computer goldfinger motherboards by two Aspergillus nigerstrains.

PubMed

Madrigal-Arias, Jorge Enrique; Argumedo-Delira, Rosalba; Alarcón, Alejandro; Mendoza-López, Ma Remedios; García-Barradas, Oscar; Cruz-Sánchez, Jesús Samuel; Ferrera-Cerrato, Ronald; Jiménez-Fernández, Maribel

2015-01-01

In an effort to develop alternate techniques to recover metals from waste electrical and electronic equipment (WEEE), this research evaluated the bioleaching efficiency of gold (Au), copper (Cu) and nickel (Ni) by two strains of Aspergillus niger in the presence of gold-plated finger integrated circuits found in computer motherboards (GFICMs) and cellular phone printed circuit boards (PCBs). These three metals were analyzed for their commercial value and their diverse applications in the industry. Au-bioleaching ranged from 42 to 1% for Aspergillus niger strain MXPE6; with the combination of Aspergillus niger MXPE6 + Aspergillus niger MX7, the Au-bioleaching was 87 and 28% for PCBs and GFICMs, respectively. In contrast, the bioleaching of Cu by Aspergillus niger MXPE6 was 24 and 5%; using the combination of both strains, the values were 0.2 and 29% for PCBs and GFICMs, respectively. Fungal Ni-leaching was only found for PCBs, but with no significant differences among treatments. Improvement of the metal recovery efficiency by means of fungal metabolism is also discussed.

Characterization of Printed Circuit Boards for Metal and Energy Recovery after Milling and Mechanical Separation

PubMed Central

Bizzo, Waldir A.; Figueiredo, Renata A.; de Andrade, Valdelis F.

2014-01-01

The proper disposal of electrical and electronic waste is currently a concern of researchers and environmental managers not only because of the large volume of such waste generated, but also because of the heavy metals and toxic substances it contains. This study analyzed printed circuit boards (PCBs) from discarded computers to determine their metal content and characterized them as solid waste and fuel. The analysis showed that PCBs consist of approximately 26% metal, made up mainly of copper, lead, aluminum, iron and tin, as well as other heavy metals such as cadmium and nickel. Comparison with the results of other studies indicated that the concentration of precious metals (gold and silver) has declined over time. Analysis of the leachate revealed high concentrations of cadmium and lead, giving the residue the characteristics of hazardous waste. After milling the PCBs, we found that larger amounts of metal were concentrated in smaller fractions, while the lightest fraction, obtained by density separation, had a gross calorific value of approximately 11 MJ/kg, although with a high ash content. Milling followed by density separation proved potentially useful for recovery of metals and energy-rich fractions. PMID:28788692

Supergravity separation of Pb and Sn from waste printed circuit boards at different temperatures

NASA Astrophysics Data System (ADS)

Meng, Long; Wang, Zhe; Zhong, Yi-wei; Chen, Kui-yuan; Guo, Zhan-cheng

2018-02-01

Printed circuit boards (PCBs) contain many toxic substances as well as valuable metals, e.g., lead (Pb) and tin (Sn). In this study, a novel technology, named supergravity, was used to separate different mass ratios of Pb and Sn from Pb-Sn alloys in PCBs. In a supergravity field, the liquid metal phase can permeate from solid particles. Hence, temperatures of 200, 280, and 400°C were chosen to separate Pb and Sn from PCBs. The results depicted that gravity coefficient only affected the recovery rates of Pb and Sn, whereas it had little effect on the mass ratios of Pb and Sn in the obtained alloys. With an increase in gravity coefficient, the recovery values of Pb and Sn in each step of the separation process increased. In the single-step separation process, the mass ratios of Pb and Sn in Pb-Sn alloys were 0.55, 0.40, and 0.64 at 200, 280, and 400°C, respectively. In the two-step separation process, the mass ratios were 0.12 and 0.55 at 280 and 400°C, respectively. Further, the mass ratio was observed to be 0.76 at 400°C in the three-step separation process. This process provides an innovative approach to the recycling mechanism of Pb and Sn from PCBs.

Leaching of Au, Ag, and Pd from waste printed circuit boards of mobile phone by iodide lixiviant after supercritical water pre-treatment.

PubMed

Xiu, Fu-Rong; Qi, Yingying; Zhang, Fu-Shen

2015-07-01

Precious metals are the most attractive resources in waste printed circuit boards (PCBs) of mobile phones. In this work, an alternative process for recovering Au, Ag, and Pd from waste PCBs of mobile phones by supercritical water oxidation (SCWO) pre-treatment combined with iodine-iodide leaching process was developed. In the process, the waste PCBs of mobile phones were pre-treated in supercritical water, then a diluted hydrochloric acid leaching (HL) process was used to recovery the Cu, whose leaching efficiency was approximately 100%, finally the resulting residue was subjected to the iodine-iodide leaching process for recovering the Au, Ag, and Pd. Experimental results indicated that SCWO pre-treatment temperature, time, and pressure had significant influence on the Au, Ag, and Pd leaching from (SCWO+HL)-treated waste PCBs. The optimal SCWO pre-treatment conditions were 420°C and 60min for Au and Pd, and 410°C and 30min for Ag. The optimum dissolution parameters for Au, Pd, and Ag in (SCWO+HL)-treated PCBs with iodine-iodide system were leaching time of 120min (90min for Ag), iodine/iodide mole ratio of 1:5 (1:6 for Ag), solid-to-liquid ratio (S/L) of 1:10g/mL (1:8g/mL for Ag), and pH of 9, respectively. It is believed that the process developed in this study is environment friendly for the recovery of Au, Ag, and Pd from waste PCBs of mobile phones by SCWO pre-treatment combined with iodine-iodide leaching process. Copyright © 2015 Elsevier Ltd. All rights reserved.

Analysis of Multilayered Printed Circuit Boards using Computed Tomography

DTIC Science & Technology

2014-05-01

complex PCBs that present a challenge for any testing or fault analysis. Set-to- work testing and fault analysis of any electronic circuit require...Electronic Warfare and Radar Division in December 2010. He is currently in Electro- Optic Countermeasures Group. Samuel works on embedded system design...and software optimisation of complex electro-optical systems, including the set to work and characterisation of these systems. He has a Bachelor of

Optimizing the operating parameters of corona electrostatic separation for recycling waste scraped printed circuit boards by computer simulation of electric field.

PubMed

Li, Jia; Lu, Hongzhou; Liu, Shushu; Xu, Zhenming

2008-05-01

The printed circuit board (PCB) has a metal content of nearly 28% metal, including an abundance of nonferrous metals such as copper, lead, and tin. The purity of precious metals in PCBs is more than 10 times that of rich-content minerals. Therefore, the recycling of PCBs is an important subject, not only from the viewpoint of waste treatment, but also with respect to the recovery of valuable materials. Compared with traditional process the corona electrostatic separation (CES) had no waste water or gas during the process and it had high productivity with a low-energy cost. In this paper, the roll-type corona electrostatic separator was used to separate metals and nonmetals from scraped waste PCBs. The software MATLAB was used to simulate the distribution of electric field in separating space. It was found that, the variations of parameters of electrodes and applied voltages directly influenced the distribution of electric field. Through the correlation of simulated and experimental results, the good separation results were got under the optimized operating parameter: U=20-30 kV, L=L(1)=L(2)=0.21 m, R(1)=0.114, R(2)=0.019 m, theta(1)=20 degrees and theta(2)=60 degrees .

Performance and thermal behavior of wood plastic composite produced by nonmetals of pulverized waste printed circuit boards.

PubMed

Guo, Jie; Tang, Yinen; Xu, Zhenming

2010-07-15

A new kind of wood plastic composite (WPC) was produced by compounding nonmetals from waste printed circuit boards (PCBs), recycled high-density polyethylene (HDPE), wood flour and other additives. The blended granules were then extruded to profile WPC products by a conical counter-rotating twin-screw extruder. The results showed that the addition of nonmetals in WPC improved the flexural strength and tensile strength and reduced screw withdrawal strength. When the added content of nonmetals was 40%, the flexural strength of WPC was 23.4 MPa, tensile strength was 9.6 MPa, impact strength was 3.03 J/m(2) and screw withdrawal strength was 1755 N. Dimensional stability and fourier transform infrared spectroscopy (FTIR) of WPC panels were also investigated. Furthermore, thermogravimetric analysis showed that thermal degradation of WPC mainly included two steps. The first step was the decomposition of wood flour and nonmetals from 260 to 380 degrees C, and the second step was the decomposition of HDPE from 440 to 500 degrees C. The performance and thermal behavior of WPC produced by nonmetals from PCBs achieves the standard of WPC. It offers a novel method to treat nonmetals from PCBs. 2010 Elsevier B.V. All rights reserved.

Size Effect of Ground Patterns on FM-Band Cross-Talks between Two Parallel Signal Traces of Printed Circuit Boards for Vehicles

NASA Astrophysics Data System (ADS)

Iida, Michihira; Maeno, Tsuyoshi; Wang, Jianqing; Fujiwara, Osamu

Electromagnetic disturbances in vehicle-mounted radios are mainly caused by conducted noise currents flowing through wiring-harnesses from vehicle-mounted printed circuit boards (PCBs) with common slitting ground patterns. To suppress these kinds of noise currents, we previously measured them for simple two-layer PCBs with two parallel signal traces and slitting or non-slitting ground patterns, and then investigated by the FDTD simulation the reduction characteristics of the FM-band cross-talk noise levels between two parallel signal traces on six simple PCB models having different slitting ground or different divided ground patterns parallel to the traces. As a result, we found that the contributory factor for the FM-band cross-talk reduction is the reduction of mutual inductance between the two parallel traces, and also the noise currents from PCBs can rather be suppressed even if the size of the return ground becomes small. In this study, to investigate this finding, we further simulated the frequency characteristics of cross-talk reduction for additional six simple PCB models with different dividing dimensions ground patterns parallel to the traces, which revealed an interesting phenomenon that cross-talk reduction characteristics do not always decrease with increasing the width between the divided ground patterns.

Stretchable electronics based on Ag-PDMS composites

PubMed Central

Larmagnac, Alexandre; Eggenberger, Samuel; Janossy, Hanna; Vörös, Janos

2014-01-01

Patterned structures of flexible, stretchable, electrically conductive materials on soft substrates could lead to novel electronic devices with unique mechanical properties allowing them to bend, fold, stretch or conform to their environment. For the last decade, research on improving the stretchability of circuits on elastomeric substrates has made significant progresses but designing printed circuit assemblies on elastomers remains challenging. Here we present a simple, cost-effective, cleanroom-free process to produce large scale soft electronic hardware where standard surface-mounted electrical components were directly bonded onto all-elastomeric printed circuit boards, or soft PCBs. Ag-PDMS tracks were stencil printed onto a PDMS substrate and soft PCBs were made by bonding the top and bottom layers together and filling punched holes with Ag-PDMS to create vias. Silver epoxy was used to bond commercial electrical components and no mechanical failure was observed after hundreds of stretching cycles. We also demonstrate the fabrication of a stretchable clock generator. PMID:25434843

Effect of Ground Patterns Size on FM-Band Cross-Talks between Two Parallel Signal Traces of Printed Circuit Boards for Vehicles

NASA Astrophysics Data System (ADS)

Iida, Michihira; Maeno, Tsuyoshi; Fujiwara, Osamu

It is well known that electromagnetic disturbances in vehicle-mounted radios are mainly caused by conducted noise currents flowing through wiring-harnesses from vehicle-mounted printed circuit boards (PCBs) with common ground patterns containing slits. To suppress the noise currents outflow from PCBs of these kinds, we previously measured noise currents outflow from simple two-layer PCBs having two parallel signal traces and different ground patterns with/without slits to reveal that making slits with open ends on the ground patterns in parallel with the traces can reduce the conducted noise currents. In the present study, with FDTD simulation, we investigated reduction effects of ground patterns size on the FM-band cross-talk noise levels between two parallel signal traces, by using four types of simple PCB models having different ground patterns formed in different numbers but containing the same planar dimension slits parallel to the traces, in addition to two types of PCB models with different ground patterns divided into two parts parallel to the traces. As a result, we found that the cross-talk noise currents for the above six types of PCBs decrease by 6.9-8.5dB compared to the PCB which has a plain ground with no slits. From this study, we got the finding that the contributing factor for the above mentioned cross-talk reduction relies on the reduction of mutual inductance between the two parallel traces. In addition, in case of this study, it is interesting to note that the noise currents outflow from PCBs can rather be suppressed when the size of the return ground of each signal trace is small.

Designing an Electronics Data Package for Printed Circuit Boards (PCBs)

DTIC Science & Technology

2013-08-01

finished PCB flatness deviation should be less than 0.010 inches per inch. 4  The minimum copper wall thickness of plated-thru holes should be...Memory Card International Association)  IPC-6015 MCM-L (Multi-Chip Module – Laminated )  IPC-6016 HDI (High Density Interconnect)  IPC-6018...Interconnect ICT In Circuit Tester IPC Association Connecting Electronics Industries MCM-L Multi-Chip Module – Laminated MIL Military NEMA National

RGB-Stack Light Emitting Diode Modules with Transparent Glass Circuit Board and Oil Encapsulation

PubMed Central

Li, Ying-Chang; Chang, Yuan-Hsiao; Singh, Preetpal; Chang, Liann-Be; Yeh, Der-Hwa; Chao, Ting-Yu; Jian, Si-Yun; Li, Yu-Chi; Lai, Chao-Sung; Ying, Shang-Ping

2018-01-01

The light emitting diode (LED) is widely used in modern solid-state lighting applications, and its output efficiency is closely related to the submounts’ material properties. Most submounts used today, such as low-power printed circuit boards (PCBs) or high-power metal core printed circuit boards (MCPCBs), are not transparent and seriously decrease the output light extraction. To meet the requirements of high light output and better color mixing, a three-dimensional (3-D) stacked flip-chip (FC) LED module is proposed and demonstrated. To realize light penetration and mixing, the mentioned 3-D vertically stacking RGB LEDs use transparent glass as FC package submounts called glass circuit boards (GCB). Light emitted from each GCB stacked LEDs passes through each other and thus exhibits good output efficiency and homogeneous light-mixing characteristics. In this work, the parasitic problem of heat accumulation, which caused by the poor thermal conductivity of GCB and leads to a serious decrease in output efficiency, is solved by a proposed transparent cooling oil encapsulation (OCP) method. PMID:29494534

RGB-Stack Light Emitting Diode Modules with Transparent Glass Circuit Board and Oil Encapsulation.

PubMed

Li, Ying-Chang; Chang, Yuan-Hsiao; Singh, Preetpal; Chang, Liann-Be; Yeh, Der-Hwa; Chao, Ting-Yu; Jian, Si-Yun; Li, Yu-Chi; Tan, Cher Ming; Lai, Chao-Sung; Chow, Lee; Ying, Shang-Ping

2018-03-01

The light emitting diode (LED) is widely used in modern solid-state lighting applications, and its output efficiency is closely related to the submounts' material properties. Most submounts used today, such as low-power printed circuit boards (PCBs) or high-power metal core printed circuit boards (MCPCBs), are not transparent and seriously decrease the output light extraction. To meet the requirements of high light output and better color mixing, a three-dimensional (3-D) stacked flip-chip (FC) LED module is proposed and demonstrated. To realize light penetration and mixing, the mentioned 3-D vertically stacking RGB LEDs use transparent glass as FC package submounts called glass circuit boards (GCB). Light emitted from each GCB stacked LEDs passes through each other and thus exhibits good output efficiency and homogeneous light-mixing characteristics. In this work, the parasitic problem of heat accumulation, which caused by the poor thermal conductivity of GCB and leads to a serious decrease in output efficiency, is solved by a proposed transparent cooling oil encapsulation (OCP) method.

Leaching of Au, Ag, and Pd from waste printed circuit boards of mobile phone by iodide lixiviant after supercritical water pre-treatment

DOE Office of Scientific and Technical Information (OSTI.GOV)

Xiu, Fu-Rong, E-mail: xiu_chem@hotmail.com; Qi, Yingying; Zhang, Fu-Shen

Highlights: • We report a novel process for recovering Au, Ag, and Pd from waste PCBs. • The effect of SCWO on the leaching of Au, Ag, and Pd in waste PCBs was studied. • SCWO was highly efficient for enhancing the leaching of Au, Ag, and Pd. • The optimum leaching parameters for Au, Ag, and Pd in iodine–iodide were studied. - Abstract: Precious metals are the most attractive resources in waste printed circuit boards (PCBs) of mobile phones. In this work, an alternative process for recovering Au, Ag, and Pd from waste PCBs of mobile phones by supercriticalmore » water oxidation (SCWO) pre-treatment combined with iodine–iodide leaching process was developed. In the process, the waste PCBs of mobile phones were pre-treated in supercritical water, then a diluted hydrochloric acid leaching (HL) process was used to recovery the Cu, whose leaching efficiency was approximately 100%, finally the resulting residue was subjected to the iodine–iodide leaching process for recovering the Au, Ag, and Pd. Experimental results indicated that SCWO pre-treatment temperature, time, and pressure had significant influence on the Au, Ag, and Pd leaching from (SCWO + HL)-treated waste PCBs. The optimal SCWO pre-treatment conditions were 420 °C and 60 min for Au and Pd, and 410 °C and 30 min for Ag. The optimum dissolution parameters for Au, Pd, and Ag in (SCWO + HL)-treated PCBs with iodine–iodide system were leaching time of 120 min (90 min for Ag), iodine/iodide mole ratio of 1:5 (1:6 for Ag), solid-to-liquid ratio (S/L) of 1:10 g/mL (1:8 g/mL for Ag), and pH of 9, respectively. It is believed that the process developed in this study is environment friendly for the recovery of Au, Ag, and Pd from waste PCBs of mobile phones by SCWO pre-treatment combined with iodine–iodide leaching process.« less

Effects of PCB Substrate Surface Finish, Flux, and Phosphorus Content on Ionic Contamination

NASA Astrophysics Data System (ADS)

Bacior, M.; Sobczak, N.; Siewiorek, A.; Kudyba, A.; Homa, M.; Nowak, R.; Dziula, M.; Masłoń, S.

2015-02-01

The ionic contamination on printed circuit boards (PCB) having different surface finishes was examined using ionograph. The study was performed at the RT on three types of PCBs covered with: (i) hot air solder leveling (HASL LF), (ii) electroless nickel immersion gold (ENIG), and (iii) organic surface protectant (OSP), all on Cu substrates, as well as two types of fluxes, namely EF2202 and RF800. In the group of boards without soldered components, the lowest average value of contamination was for the ENIG 18 µm surface (0.01 μg NaCl/cm2). Boards with soldered components were more contaminated (from 0.29 μg NaCl/cm2 for the HASL LF 18 µm surface). After spraying boards with fluxing agents, the values of contaminants were the highest. The influence of phosphorus content in Ni-P layer of ENIG finish on ionic contamination was examined. In the group of PCBs with Au coating, the smallest amount of surface contaminants (0.32 μg NaCl/cm2) was for Ni-2-5%P layer. PCBs with Ni-11%P layer were higher contaminated (0.47 μg NaCl/cm2), and another with Ni-8%P layer had 0.81 μg NaCl/cm2. PCBs without Au coating, had the lowest contamination (0.48 μg NaCl/cm2) at phosphorous content equal 11%P. Higher contamination (0.67 μg NaCl/cm2) was at 2-5%P, up to 1.98 μg NaCl/cm2 for 8% of P. Boards with Au finish have lower value of contamination than identical boards without Au layer thus contributing to better reliability of electronic assemblies, since its failures due to current leakage and corrosion can be caused by contaminants.

Prioritizing material recovery for end-of-life printed circuit boards

DOE Office of Scientific and Technical Information (OSTI.GOV)

Wang Xue, E-mail: xxw6590@rit.edu; Gaustad, Gabrielle, E-mail: gabrielle.gaustad@rit.edu

2012-10-15

Highlights: Black-Right-Pointing-Pointer Material recovery driven by composition, choice of ranking, and weighting. Black-Right-Pointing-Pointer Economic potential for new recycling technologies quantified for several metrics. Black-Right-Pointing-Pointer Indicators developed for materials incurring high eco-toxicity costs. Black-Right-Pointing-Pointer Methodology useful for a variety of stakeholders, particularly policy-makers. - Abstract: The increasing growth in generation of electronic waste (e-waste) motivates a variety of waste reduction research. Printed circuit boards (PCBs) are an important sub-set of the overall e-waste stream due to the high value of the materials contained within them and potential toxicity. This work explores several environmental and economic metrics for prioritizing the recovery ofmore » materials from end-of-life PCBs. A weighted sum model is used to investigate the trade-offs among economic value, energy saving potentials, and eco-toxicity. Results show that given equal weights for these three sustainability criteria gold has the highest recovery priority, followed by copper, palladium, aluminum, tin, lead, platinum, nickel, zinc, and silver. However, recovery priority will change significantly due to variation in the composition of PCBs, choice of ranking metrics, and weighting factors when scoring multiple metrics. These results can be used by waste management decision-makers to quantify the value and environmental savings potential for recycling technology development and infrastructure. They can also be extended by policy-makers to inform possible penalties for land-filling PCBs or exporting to the informal recycling sector. The importance of weighting factors when examining recovery trade-offs, particularly for policies regarding PCB collection and recycling are explored further.« less

Selective separation of copper over solder alloy from waste printed circuit boards leach solution.

PubMed

Kavousi, Maryam; Sattari, Anahita; Alamdari, Eskandar Keshavarz; Firozi, Sadegh

2017-02-01

The printed circuit boards (PCBs) from electronic waste are important resource, since the PCBs contain precious metals such as gold, copper, tin, silver, platinum and so forth. In addition to the economic point of view, the presence of lead turns this scrap into dangerous to environment. This study was conducted as part of the development of a novel process for selective recovery of copper over tin and lead from printed circuit boards by HBF 4 leaching. In previous study, Copper with solder alloy was associated, simultaneously were leached in HBF 4 solution using hydrogen peroxide as an oxidant at room temperature. The objective of this study is the separation of copper from tin and lead from Fluoroborate media using CP-150 as an extractant. The influence of organic solvent's concentration, pH, temperature and A/O phase ratio was investigated. The possible extraction mechanism and the composition of the extracted species have been determined. The separation factors for these metals using this agent are reported, while efficient methods for separation of Cu (II) from other metal ions are proposed. The treatment of leach liquor for solvent extraction of copper with CP-150 revealed that 20% CP-150 in kerosene, a 30min period of contact time, and a pH of 3 were sufficient for the extraction of Cu(II) and 99.99% copper was recovered from the leached solution. Copyright © 2016. Published by Elsevier Ltd.

Selective thermal transformation of old computer printed circuit boards to Cu-Sn based alloy.

PubMed

Shokri, Ali; Pahlevani, Farshid; Cole, Ivan; Sahajwalla, Veena

2017-09-01

This study investigates, verifies and determines the optimal parameters for the selective thermal transformation of problematic electronic waste (e-waste) to produce value-added copper-tin (Cu-Sn) based alloys; thereby demonstrating a novel new pathway for the cost-effective recovery of resources from one of the world's fastest growing and most challenging waste streams. Using outdated computer printed circuit boards (PCBs), a ubiquitous component of e-waste, we investigated transformations across a range of temperatures and time frames. Results indicate a two-step heat treatment process, using a low temperature step followed by a high temperature step, can be used to produce and separate off, first, a lead (Pb) based alloy and, subsequently, a Cu-Sn based alloy. We also found a single-step heat treatment process at a moderate temperature of 900 °C can be used to directly transform old PCBs to produce a Cu-Sn based alloy, while capturing the Pb and antimony (Sb) as alloying elements to prevent the emission of these low melting point elements. These results demonstrate old computer PCBs, large volumes of which are already within global waste stockpiles, can be considered a potential source of value-added metal alloys, opening up a new opportunity for utilizing e-waste to produce metal alloys in local micro-factories. Copyright © 2017 Elsevier Ltd. All rights reserved.

A model for simulating the grinding and classification cyclic system of waste PCBs recycling production line.

PubMed

Yang, Deming; Xu, Zhenming

2011-09-15

Crushing and separating technology is widely used in waste printed circuit boards (PCBs) recycling process. A set of automatic line without negative impact to environment for recycling waste PCBs was applied in industry scale. Crushed waste PCBs particles grinding and classification cyclic system is the most important part of the automatic production line, and it decides the efficiency of the whole production line. In this paper, a model for computing the process of the system was established, and matrix analysis method was adopted. The result showed that good agreement can be achieved between the simulation model and the actual production line, and the system is anti-jamming. This model possibly provides a basis for the automatic process control of waste PCBs production line. With this model, many engineering problems can be reduced, such as metals and nonmetals insufficient dissociation, particles over-pulverizing, incomplete comminuting, material plugging and equipment fever. Copyright © 2011 Elsevier B.V. All rights reserved.

Assessment of gold and silver in assorted mobile phone printed circuit boards (PCBs): Original article.

PubMed

Vats, M C; Singh, S K

2015-11-01

Demand for gold and silver has been escalating with increasing usage of electronic equipment globally. Around 267.3 MT of gold and 7275 MT of silver are being consumed annually for manufacturing mobile phones, laptops and other electronic equipment. However, only 15% is recuperated from these equipment; the remainder lies in the storage yards or landfills. The waste comprise glass, plastics, wires, batteries, PCBs, metal casing, etc. The PCB is composed of precious metals, which creates immense purpose for recycling and recovery. This paper characterises and assesses the recoverable metallic fraction of gold and silver from PCBs of mobile phones. The methodology is based on dismantling of the mobile handset and subjecting the PCBs to roasting and acid digestion. The digested samples were analysed by atomic absorption spectroscopy and the content of gold and silver in the PCBs was to be found in the range of 0.009-0.017% and 0.25-0.79% by weight respectively. Copyright © 2015 Elsevier Ltd. All rights reserved.

Optimized Signaling Method for High-Speed Transmission Channels with Higher Order Transfer Function

NASA Astrophysics Data System (ADS)

Ševčík, Břetislav; Brančík, Lubomír; Kubíček, Michal

2017-08-01

In this paper, the selected results from testing of optimized CMOS friendly signaling method for high-speed communications over cables and printed circuit boards (PCBs) are presented and discussed. The proposed signaling scheme uses modified concept of pulse width modulated (PWM) signal which enables to better equalize significant channel losses during data high-speed transmission. Thus, the very effective signaling method to overcome losses in transmission channels with higher order transfer function, typical for long cables and multilayer PCBs, is clearly analyzed in the time and frequency domain. Experimental results of the measurements include the performance comparison of conventional PWM scheme and clearly show the great potential of the modified signaling method for use in low power CMOS friendly equalization circuits, commonly considered in modern communication standards as PCI-Express, SATA or in Multi-gigabit SerDes interconnects.

Characterization and mechanical separation of metals from computer Printed Circuit Boards (PCBs) based on mineral processing methods.

PubMed

Sarvar, Mojtaba; Salarirad, Mohammad Mehdi; Shabani, Mohammad Amin

2015-11-01

In this paper, a novel mechanical process is proposed for enriching metal content of computer Printed Circuit Boards (PCBs). The PCBs are crushed and divided into three different size fractions namely: -0.59, +0.59 to 1.68 and +1.68 mm. Wet jigging and froth flotation methods are selected for metal enrichment. The coarse size fraction (+1.68 mm) is processed by jigging. The plastic free product is grinded and screened. The oversized product is separated as the first concentrate. It was rich of metal because the grinding process was selective. The undersized product is processed by froth flotation. Based on the obtained results, the middle size fraction (+0.59 to 1.68 mm) and the small size fraction (-0.59 mm) are processed by wet jigging and froth flotation respectively. The wet jigging process is optimized by investigating the effect of pulsation frequency and water flow rate. The results of examining the effect of particle size, solid to liquid ratio, conditioning time and using apolar collector showed that collectorless flotation is a promising method for separating nonmetals of PCBs. 95.6%, 97.5% and 85% of metal content of coarse size, middle size and small size fraction are recovered. The grades of obtained concentrates were 63.3%, 92.5% and 75% respectively. The total recovery is calculated as 95.64% and the grade of the final concentrate was 71.26%. Determining the grade of copper and gold in the final product reveals that 4.95% of copper and 24.46% of gold are lost during the concentration. The major part of the lost gold is accumulated in froth flotation tail. Copyright © 2015 Elsevier Ltd. All rights reserved.

Disassembly and physical separation of electric/electronic components layered in printed circuit boards (PCB).

PubMed

Lee, Jaeryeong; Kim, Youngjin; Lee, Jae-chun

2012-11-30

Although printed circuit boards (PCBs) contain various elements, only the major elements (i.e., those with content levels in wt% or over grade) of and precious metals (e.g., Ag, Au, and platinum groups) contained within PCBs can be recycled. To recover other elements from PCBs, the PCBs should be properly disassembled as the first step of the recycling process. The recovery of these other elements would be beneficial for efforts to conserve scarce resources, reuse electric/electronic components (EECs), and eliminate environmental problems. This paper examines the disassembly of EECs from wasted PCBs (WPCBs) and the physical separation of these EECs using a self-designed disassembling apparatus and a 3-step separation process of sieving, magnetic separation, and dense medium separation. The disassembling efficiencies were evaluated by using the ratio of grinding area (E(area)) and the weight ratio of the detached EECs (E(weight)). In the disassembly treatment, these efficiencies were improved with an increase of grinder speed and grinder height. 97.7% (E(area)) and 98% (E(weight)) could be accomplished ultimately by 3 repetitive treatments at a grinder speed of 5500 rpm and a grinder height of 1.5mm. Through a series of physical separations, most groups of the EECs (except for the diode, transistor, and IC chip groups) could be sorted at a relatively high separation efficiency of about 75% or more. To evaluate the separation efficiency with regard to the elemental composition, the distribution ratio (R(dis)) and the concentration ratio (R(conc)) were used. 15 elements could be separated with the highest R(dis) and R(conc) in the same separated division. This result implies that the recyclability of the elements is highly feasible, even though the initial content in EECs is lower than several tens of mg/kg. Copyright © 2012 Elsevier B.V. All rights reserved.

Comparative bioleaching of metals from pulverized and non-pulverized PCBs of cell phone charger: advantages of non-pulverized PCBs.

PubMed

Joshi, Vyenkatesh; Shah, Neha; Wakte, Prashant; Dhakephalkar, Prashant; Dhakephalkar, Anita; Khobragade, Rahul; Naphade, Bhushan; Shaikh, Sajid; Deshmukh, Arvind; Adhapure, Nitin

2017-12-01

Sample inhomogeneity is a severe issue in printed circuit boards especially when we are comparing the bioleaching efficiency. To avoid the ambiguous results obtained due to inhomogeneity in PCBs, 12 similar cell phone chargers (of renowned company) having same make and batch number were collected from scrap market. PCBs obtained from them were used in present studies. Out of these 12, three PCBs were used separately for chemical analysis of PCBs with prior acid digestion in aqua regia. It was found that, 10.8, 68.0, and 710.9 mg/l of Zn, Pb, and Cu were present in it, respectively. Six PCBs were used for bioleaching experiment with two variations, pulverized and non-pulverized. Though the pulverized sample have shown better leaching than non-pulverized one, former has some disadvantages if overall recycling of e-waste (metallic and nonmetallic fraction) is to be addressed. At the end of leaching experiments, copper was recovered using a simple setup of electrodeposition and 92.85% recovery was attained. The acidophiles involved in bioleaching were identified by culture dependent and culture independent techniques such as DGGE and species specific primers in PCR.

Printed circuit board recycling: Physical processing and copper extraction by selective leaching.

PubMed

Silvas, Flávia P C; Correa, Mónica M Jiménez; Caldas, Marcos P K; de Moraes, Viviane T; Espinosa, Denise C R; Tenório, Jorge A S

2015-12-01

Global generation of waste electrical and electronic equipment (WEEE) is about 40 million tons per year. Constant increase in WEEE generation added to international legislations has improved the development of processes for materials recovery and sustainability of electrical and electronic industry. This paper describes a new hydrometallurgical route (leaching process) to recycle printed circuit boards (PCBs) from printers to recover copper. Methodology included PCBs characterization and a combined route of physical and hydrometallurgical processing. Magnetic separation, acid digestion and chemical analysis by ICP-OES were performed. On leaching process were used two stages: the first one in a sulfuric media and the second in an oxidant media. The results showed that the PCBs composition was 74.6 wt.% of non-magnetic material and 25.4 wt.% of magnetic one. The metallic fraction corresponded to 44.0 wt.%, the polymeric to 28.5 wt.% and the ceramic to 27.5 wt.%. The main metal was copper and its initial content was 32.5 wt.%. On sulfuric leaching 90 wt.% of Al, 40 wt.% of Zn and 8.6 wt.% of Sn were extracted, whereas on oxidant leaching tests the extraction percentage of Cu was 100 wt.%, of Zn 60 wt.% and of Al 10 wt.%. At the end of the hydrometallurgical processing was obtained 100% of copper extraction and the recovery factor was 98.46%, which corresponds to a 32 kg of Cu in 100 kg of PCB. Copyright © 2015 Elsevier Ltd. All rights reserved.

Soft-Matter Printed Circuit Board with UV Laser Micropatterning.

PubMed

Lu, Tong; Markvicka, Eric J; Jin, Yichu; Majidi, Carmel

2017-07-05

When encapsulated in elastomer, micropatterned traces of Ga-based liquid metal (LM) can function as elastically deformable circuit wiring that provides mechanically robust electrical connectivity between solid-state elements (e.g., transistors, processors, and sensor nodes). However, LM-microelectronics integration is currently limited by challenges in rapid fabrication of LM circuits and the creation of vias between circuit terminals and the I/O pins of packaged electronics. In this study, we address both with a unique layup for soft-matter electronics in which traces of liquid-phase Ga-In eutectic (EGaIn) are patterned with UV laser micromachining (UVLM). The terminals of the elastomer-sealed LM circuit connect to the surface mounted chips through vertically aligned columns of EGaIn-coated Ag-Fe 2 O 3 microparticles that are embedded within an interfacial elastomer layer. The processing technique is compatible with conventional UVLM printed circuit board (PCB) prototyping and exploits the photophysical ablation of EGaIn on an elastomer substrate. Potential applications to wearable computing and biosensing are demonstrated with functional implementations in which soft-matter PCBs are populated with surface-mounted microelectronics.

A Novel Designed Bioreactor for Recovering Precious Metals from Waste Printed Circuit Boards

PubMed Central

Jujun, Ruan; Jie, Zheng; Jian, Hu; Zhang, Jianwen

2015-01-01

For recovering precious metals from waste printed circuit boards (PCBs), a novel hybrid technology including physical and biological methods was developed. It consisted of crushing, corona-electrostatic separation, and bioleaching. Bioleaching process is the focus of this paper. A novel bioreactor for bioleaching was designed. Bioleaching was carried out using Pseudomonas chlororaphis. Bioleaching experiments using mixed particles of Au and Cu were performed and leachate contained 0.006 mg/L, 2823 mg/L Au+ and Cu2+ respectively. It showed when Cu existed, the concentrations of Au were extremely small. This provided the feasibility to separate Cu from Au. The method of orthogonal experimental design was employed in the simulation bioleaching experiments. Experimental results showed the optimized parameters for separating Cu from Au particles were pH 7.0, temperature 22.5 °C, and rotation speed 80 r/min. Based on the optimized parameters obtained, the bioreactor was operated for recovering mixed Au and Cu particles. 88.1 wt.% of Cu and 76.6 wt.% of Au were recovered. The paper contributed important information to recover precious metals from waste PCBs. PMID:26316021

Packaging Technologies for High Temperature Electronics and Sensors

NASA Technical Reports Server (NTRS)

Chen, Liang-Yu; Hunter, Gary W.; Neudeck, Philip G.; Beheim, Glenn M.; Spry, David J.; Meredith, Roger D.

2013-01-01

This paper reviews ceramic substrates and thick-film metallization based packaging technologies in development for 500 C silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chip-level packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550 C. A 96% alumina based edge connector for a PCB level subsystem interconnection has also been demonstrated recently. The 96% alumina packaging system composed of chip-level packages and PCBs has been tested with high temperature SiC devices at 500 C for over 10,000 hours. In addition to tests in a laboratory environment, a SiC JFET with a packaging system composed of a 96% alumina chip-level package and an alumina printed circuit board mounted on a data acquisition circuit board was launched as a part of the MISSE-7 suite to the International Space Station via a Shuttle mission. This packaged SiC transistor was successfully tested in orbit for eighteen months. A spark-plug type sensor package designed for high temperature SiC capacitive pressure sensors was developed. This sensor package combines the high temperature interconnection system with a commercial high temperature high pressure stainless steel seal gland (electrical feed-through). Test results of a packaged high temperature capacitive pressure sensor at 500 C are also discussed. In addition to the pressure sensor package, efforts for packaging high temperature SiC diode-based gas chemical sensors are in process.

Packaging Technologies for High Temperature Electronics and Sensors

NASA Technical Reports Server (NTRS)

Chen, Liangyu; Hunter, Gary W.; Neudeck, Philip G.; Beheim, Glenn M.; Spry, David J.; Meredith, Roger D.

2013-01-01

This paper reviews ceramic substrates and thick-film metallization based packaging technologies in development for 500degC silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chiplevel packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550degC. A 96% alumina based edge connector for a PCB level subsystem interconnection has also been demonstrated recently. The 96% alumina packaging system composed of chip-level packages and PCBs has been tested with high temperature SiC devices at 500degC for over 10,000 hours. In addition to tests in a laboratory environment, a SiC JFET with a packaging system composed of a 96% alumina chip-level package and an alumina printed circuit board mounted on a data acquisition circuit board was launched as a part of the MISSE-7 suite to the International Space Station via a Shuttle mission. This packaged SiC transistor was successfully tested in orbit for eighteen months. A spark-plug type sensor package designed for high temperature SiC capacitive pressure sensors was developed. This sensor package combines the high temperature interconnection system with a commercial high temperature high pressure stainless steel seal gland (electrical feed-through). Test results of a packaged high temperature capacitive pressure sensor at 500degC are also discussed. In addition to the pressure sensor package, efforts for packaging high temperature SiC diode-based gas chemical sensors are in process.

Recovering metallic fractions from waste electrical and electronic equipment by a novel vibration system.

PubMed

Habib, Muddasar; Miles, Nicholas J; Hall, Philip

2013-03-01

The need to recover and recycle valuable resources from Waste Electrical and Electronic Equipment (WEEE) is of growing importance as increasing amounts are generated due to shorter product life cycles, market expansions, new product developments and, higher consumption and production rates. The European Commission (EC) directive, 2002/96/EC, on WEEE became law in UK in January 2007 setting targets to recover up to 80% of all WEEE generated. Printed Wire Board (PWB) and/or Printed Circuit Board (PCB) is an important component of WEEE with an ever increasing tonnage being generated. However, the lack of an accurate estimate for PCB production, future supply and uncertain demands of its recycled materials in international markets has provided the motivation to explore different approaches to recycle PCBs. The work contained in this paper focuses on a novel, dry separation methodology in which vertical vibration is used to separate the metallic and non-metallic fractions of PCBs. When PCBs were comminuted to less than 1mm in size, metallic grades as high as 95% (measured by heavy liquid analysis) could be achieved in the recovered products. Copyright © 2012 Elsevier Ltd. All rights reserved.

Characterization of the non-metal fraction of the processed waste printed circuit boards.

PubMed

Kumar, Amit; Holuszko, Maria E; Janke, Travis

2018-05-01

Electronic waste is one the fastest growing waste streams in the world and waste printed circuit boards (PCB) are the most valuable part of this stream due to the presence of gold, silver, copper, and palladium. The metal present in PCBs is mostly recovered for the market value whereas the nonmetal fractions are often ignored. This research explored the characteristics of the non-metal fraction (NMF) obtained after the processing of milled waste PCBs with a focus on responsible end-of-life solutions, in the form of non-hazardous landfilling or incineration. The NMF was characterized using sizing, assaying, loss on ignition, calorific value measurement, and thermogravimetric analysis (TGA). The result showed that the metal content in the NMF increased with decrease in the particle size for most of the metals except antimony and the result from loss on ignition (LOI) also showed that over 50% of the coarser fraction represented organic matter compared to less than 30% for the finest fraction. The study also showed that after the recovery of metals from the waste PCBs, landfill leaching for most of the metal is reduced below the environmental limits, with lead being the only exception. The lead leachate concentration of 18 mg/L was observed, which requires further treatment prior to landfilling. With an energy value of 16 GJ/t, the NMF could provide high energy recovery if incinerated but 194 mg/kg of hazardous flame retardants present in the NMF might be released if the combustion process is not closely monitored. Copyright © 2018 Elsevier Ltd. All rights reserved.

Advanced degradation of brominated epoxy resin and simultaneous transformation of glass fiber from waste printed circuit boards by improved supercritical water oxidation processes.

PubMed

Liu, Kang; Zhang, Zhiyuan; Zhang, Fu-Shen

2016-10-01

This work investigated various supercritical water oxidation (SCWO) systems, i.e. SCWO1 (only water), SCWO2 (water+H2O2) and SCWO3 (water+H2O2/NaOH), for waste printed circuit boards (PCBs) detoxification and recycling. Response surface methodology (RSM) was applied to optimize the operating conditions of the optimal SCWO3 systems. The optimal reaction conditions for debromination were found to be the NaOH of 0.21g, the H2O2 volume of 9.04mL, the time of 39.7min, maximum debromination efficiency of 95.14%. Variance analysis indicated that the factors influencing debromination efficiency was in the sequence of NaOH>H2O2>time. Mechanism studies indicated that the dissociated ions from NaOH in supercritical water promoted the debromination of brominated epoxy resins (BERs) through an elimination reaction and nucleophilic substitution. HO2, produced by H2O2 could induce the oxidation of phenol ring to open (intermediates of BERs), which were thoroughly degraded to form hydrocarbons, CO2, H2O and NaBr. In addition, the alkali-silica reaction between OH(-) and SiO2 induced the phase transformation of glass fibers, which were simultaneously converted into anorthite and albite. Waste PCBs in H2O2/NaOH improved SCWO system were fully degraded into useful products and simultaneously transformed into functional materials. These findings are helpful for efficient recycling of waste PCBs. Copyright © 2016 Elsevier Ltd. All rights reserved.

Status of electronic waste recycling techniques: a review.

PubMed

Abdelbasir, Sabah M; Hassan, Saad S M; Kamel, Ayman H; El-Nasr, Rania Seif

2018-05-08

The increasing use of electrical and electronic equipment leads to a huge generation of electronic waste (e-waste). It is the fastest growing waste stream in the world. Almost all electrical and electronic equipment contain printed circuit boards as an essential part. Improper handling of these electronic wastes could bring serious risk to human health and the environment. On the other hand, proper handling of this waste requires a sound management strategy for awareness, collection, recycling, and reuse. Nowadays, the effective recycling of this type of waste has been considered as a main challenge for any society. Printed circuit boards (PCBs), which are the base of many electronic industries, are rich in valuable heavy metals and toxic halogenated organic substances. In this review, the composition of different PCBs and their harmful effects are discussed. Various techniques in common use for recycling the most important metals from the metallic fractions of e-waste are illustrated. The recovery of metals from e-waste material after physical separation through pyrometallurgical, hydrometallurgical, or biohydrometallurgical routes is also discussed, along with alternative uses of non-metallic fraction. The data are explained and compared with the current e-waste management efforts done in Egypt. Future perspectives and challenges facing Egypt for proper e-waste recycling are also discussed.

Examining the evolution of metals utilized in printed circuit boards.

PubMed

Adie, Gilbert Umaye; Sun, Lingyu; Zeng, Xianlai; Zheng, Lixia; Osibanjo, Oladele; Li, Jinhui

2017-07-01

Management of waste electrical and electronic equipment (WEEE) has recently attracted worldwide attention because of high metal concentrations in them. Evolution of toxic and precious metals utilized in WEEE can not only reflect the adventure of eco-design, but can also guide the final recycling option. Pb, As, Cu, Au, Sn and Ag were determined in 10 composite samples of printed circuit boards of cathode ray tube televisions (TV-PCBs) that were produced between 1980 and 2005. The obtained results indicated that average metal concentrations in all TV-PCBs were - Cu: 10.6 ± 4.1%, Sn: 4.21 ± 0.90%, Pb: 3.15 ± 0.54%, Ag: 0.0215 ± 0.0068%, Au: 0.0068 ± 0.0049% and As: 0.0007 ± 0.0004%. No remarkable difference was found in compositions of Pb and Sn over the years, suggesting that there were no major modifications of Sn/Pb solder used in joining the circuitry system. The average composition of Cu fluctuated between 5.10% in 1980 and 12.8% in the mid-1990s and decreased afterwards. The decreases in Ag and Cu compositions could possibly be associated with thinner layers of these metals in newer model products.

Generation of copper rich metallic phases from waste printed circuit boards.

PubMed

Cayumil, R; Khanna, R; Ikram-Ul-Haq, M; Rajarao, R; Hill, A; Sahajwalla, V

2014-10-01

The rapid consumption and obsolescence of electronics have resulted in e-waste being one of the fastest growing waste streams worldwide. Printed circuit boards (PCBs) are among the most complex e-waste, containing significant quantities of hazardous and toxic materials leading to high levels of pollution if landfilled or processed inappropriately. However, PCBs are also an important resource of metals including copper, tin, lead and precious metals; their recycling is appealing especially as the concentration of these metals in PCBs is considerably higher than in their ores. This article is focused on a novel approach to recover copper rich phases from waste PCBs. Crushed PCBs were heat treated at 1150°C under argon gas flowing at 1L/min into a horizontal tube furnace. Samples were placed into an alumina crucible and positioned in the cold zone of the furnace for 5 min to avoid thermal shock, and then pushed into the hot zone, with specimens exposed to high temperatures for 10 and 20 min. After treatment, residues were pulled back to the cold zone and kept there for 5 min to avoid thermal cracking and re-oxidation. This process resulted in the generation of a metallic phase in the form of droplets and a carbonaceous residue. The metallic phase was formed of copper-rich red droplets and tin-rich white droplets along with the presence of several precious metals. The carbonaceous residue was found to consist of slag and ∼30% carbon. The process conditions led to the segregation of hazardous lead and tin clusters in the metallic phase. The heat treatment temperature was chosen to be above the melting point of copper; molten copper helped to concentrate metallic constituents and their separation from the carbonaceous residue and the slag. Inert atmosphere prevented the re-oxidation of metals and the loss of carbon in the gaseous fraction. Recycling e-waste is expected to lead to enhanced metal recovery, conserving natural resources and providing an environmentally sustainable solution to the management of waste products. Copyright © 2014 Elsevier Ltd. All rights reserved.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Cayumil, R.; Khanna, R., E-mail: ritakhanna@unsw.edu.au; Ikram-Ul-Haq, M.

Highlights: • Recycling and material recovery from waste printed circuit boards is very complex. • Thermoset polymers, ceramics and metals are present simultaneously in waste PCBs. • Heat treatment of PCBs was carried out at 1150 °C under inert conditions. • Various metallic phases could be segregated out as copper based metallic droplets. • Carbon and ceramics residues can be further recycled in a range of applications. - Abstract: The rapid consumption and obsolescence of electronics have resulted in e-waste being one of the fastest growing waste streams worldwide. Printed circuit boards (PCBs) are among the most complex e-waste, containingmore » significant quantities of hazardous and toxic materials leading to high levels of pollution if landfilled or processed inappropriately. However, PCBs are also an important resource of metals including copper, tin, lead and precious metals; their recycling is appealing especially as the concentration of these metals in PCBs is considerably higher than in their ores. This article is focused on a novel approach to recover copper rich phases from waste PCBs. Crushed PCBs were heat treated at 1150 °C under argon gas flowing at 1 L/min into a horizontal tube furnace. Samples were placed into an alumina crucible and positioned in the cold zone of the furnace for 5 min to avoid thermal shock, and then pushed into the hot zone, with specimens exposed to high temperatures for 10 and 20 min. After treatment, residues were pulled back to the cold zone and kept there for 5 min to avoid thermal cracking and re-oxidation. This process resulted in the generation of a metallic phase in the form of droplets and a carbonaceous residue. The metallic phase was formed of copper-rich red droplets and tin-rich white droplets along with the presence of several precious metals. The carbonaceous residue was found to consist of slag and ∼30% carbon. The process conditions led to the segregation of hazardous lead and tin clusters in the metallic phase. The heat treatment temperature was chosen to be above the melting point of copper; molten copper helped to concentrate metallic constituents and their separation from the carbonaceous residue and the slag. Inert atmosphere prevented the re-oxidation of metals and the loss of carbon in the gaseous fraction. Recycling e-waste is expected to lead to enhanced metal recovery, conserving natural resources and providing an environmentally sustainable solution to the management of waste products.« less

Superconducting Multilayer High-Density Flexible Printed Circuit Board for Very High Thermal Resistance Interconnections

NASA Astrophysics Data System (ADS)

de la Broïse, Xavier; Le Coguie, Alain; Sauvageot, Jean-Luc; Pigot, Claude; Coppolani, Xavier; Moreau, Vincent; d'Hollosy, Samuel; Knarosovski, Timur; Engel, Andreas

2018-05-01

We have successively developed two superconducting flexible PCBs for cryogenic applications. The first one is monolayer, includes 552 tracks (10 µm wide, 20 µm spacing), and receives 24 wire-bonded integrated circuits. The second one is multilayer, with one track layer between two shielding layers interconnected by microvias, includes 37 tracks, and can be interconnected at both ends by wire bonding or by connectors. The first cold measurements have been performed and show good performances. The novelty of these products is, for the first one, the association of superconducting materials with very narrow pitch and bonded integrated circuits and, for the second one, the introduction of a superconducting multilayer structure interconnected by vias which is, to our knowledge, a world-first.

Optimization of Cvd Diamond Coating Type on Micro Drills in Pcb Machining

NASA Astrophysics Data System (ADS)

Lei, X. L.; He, Y.; Sun, F. H.

2016-12-01

The demand for better tools for machining printed circuit boards (PCBs) is increasing due to the extensive usage of these boards in digital electronic products. This paper is aimed at optimizing coating type on micro drills in order to extend their lifetime in PCB machining. First, the tribotests involving micro crystalline diamond (MCD), nano crystalline diamond (NCD) and bare tungsten carbide (WC-Co) against PCBs show that NCD-PCB tribopair exhibits the lowest friction coefficient (0.35) due to the unique nano structure and low surface roughness of NCD films. Thereafter, the dry machining performance of the MCD- and NCD-coated micro drills on PCBs is systematically studied, using diamond-like coating (DLC) and TiAlN-coated micro drills as comparison. The experiments show that the working lives of these micro drills can be ranked as: NCD>TiAlN>DLC>MCD>bare WC-Co. The superior cutting performance of NCD-coated micro drills in terms of the lowest flank wear growth rate, no tool degradation (e.g. chipping, tool tipping) appearance, the best hole quality as well as the lowest feed force may come from the excellent wear resistance, lower friction coefficient against PCB as well as the high adhesive strength on the underneath substrate of NCD films.

Tailored benzoxazines as novel resin systems for printed circuit boards in high temperature e-mobility applications

NASA Astrophysics Data System (ADS)

Troeger, K.; Darka, R. Khanpour; Neumeyer, T.; Altstaedt, V.

2014-05-01

This study focuses on the development of Bisphenol-F-benzoxazine resins blended with different ratios of a trifunctional epoxy resin suitable as matrix for substrates for high temperature printed circuit board (HT-PCB) applications. With the benzoxazine blends glass transition temperatures of more than 190 °C could be achieved in combination with a coefficient of thermal expansion in thickness direction (z-CTE) of less than 60 ppm/K without adding any fillers. This shows the high potential of the benzoxazine-epoxy blend systems as substrate materials for HT-PCBs. To understand the thermal behavior of the different formulations, the apparent crosslink density was calculated based on data from Dynamic Mechanical Analysis. Laminates in laboratory scale were prepared and characterized to demonstrate the transformation of the neat resin properties into real electronic substrate properties. The produced laminates exhibit a z-CTE below 40 ppm/K.

Thermal decomposition of electronic wastes: Mobile phone case and other parts

DOE Office of Scientific and Technical Information (OSTI.GOV)

Molto, Julia, E-mail: julia.molto@ua.es; Egea, Silvia; Conesa, Juan Antonio

Highlights: > Pyrolysis and combustion of different parts of mobile phones produce important quantities of CO and CO{sub 2}. > Naphthalene is the most abundant PAH obtained in the thermal treatment of mobile phones. > Higher combustion temperature increases the chlorinated species evolved. - Abstract: Pyrolysis and combustion runs at 850 {sup o}C in a horizontal laboratory furnace were carried out on different parts of a mobile phone (printed circuit board, mobile case and a mixture of both materials). The analyses of the carbon oxides, light hydrocarbons, polycyclic aromatic hydrocarbons (PAHs), polychlorodibenzo-p-dioxin, polychlorodibenzofurans (PCDD/Fs), and dioxin-like PCBs are shown. Regardingmore » semivolatile compounds, phenol, styrene, and its derivatives had the highest yields. In nearly all the runs the same PAHs were identified, naphthalene being the most common component obtained. Combustion of the printed circuit board produced the highest emission factor of PCDD/Fs, possibly due to the high copper content.« less

Tailored benzoxazines as novel resin systems for printed circuit boards in high temperature e-mobility applications

DOE Office of Scientific and Technical Information (OSTI.GOV)

Troeger, K., E-mail: altstaedt@uni-bayreuth.de; Darka, R. Khanpour, E-mail: altstaedt@uni-bayreuth.de; Neumeyer, T., E-mail: altstaedt@uni-bayreuth.de

2014-05-15

This study focuses on the development of Bisphenol-F-benzoxazine resins blended with different ratios of a trifunctional epoxy resin suitable as matrix for substrates for high temperature printed circuit board (HT-PCB) applications. With the benzoxazine blends glass transition temperatures of more than 190 °C could be achieved in combination with a coefficient of thermal expansion in thickness direction (z-CTE) of less than 60 ppm/K without adding any fillers. This shows the high potential of the benzoxazine-epoxy blend systems as substrate materials for HT-PCBs. To understand the thermal behavior of the different formulations, the apparent crosslink density was calculated based on datamore » from Dynamic Mechanical Analysis. Laminates in laboratory scale were prepared and characterized to demonstrate the transformation of the neat resin properties into real electronic substrate properties. The produced laminates exhibit a z-CTE below 40 ppm/K.« less

Characterization and recovery of polymers from mobile phone scrap.

PubMed

Kasper, Angela C; Bernardes, Andréa M; Veit, Hugo M

2011-07-01

Electronic scrap is part of a universally wide range of obsolete, defective, or used materials that need to be disposed of or recycled in an ecologically friendly manner. The present study focused on the polymers present in mobile phone scrap. In mobile phones, polymers are found in frames and in printed circuit boards (PCBs). The frames are mainly made of polymers whereas PCBs use a variety of material (polymers, ceramics, and metals) which makes recycling more difficult. As a first step, mobile phones were collected, separated by manufacturer/model, and weighed, and the principal polymer types identified. The frames and PCBs were processed separately. The metals in PCBs were separated out by an electrostatic separation process. The resulting polymeric material was identified and mixed with the polymers of frames to fabricate the samples. Two types of samples were made: one with polymeric frames, and the other with a mixture of frames and polymeric fraction from the PCBs. Both kinds of sample were fabricated by injection moulding. The samples were evaluated by mechanical tests (tensile, impact, and hardness) to verify the feasibility of recycling the polymers present in mobile phone scrap. The results demonstrated the technical viability of recovering polymers using mechanical processing followed by an injection process.

Impact of Data Transmission over 10 Gbps on High-Density and Low-Cost Optoelectronic Module with Polynorbornene Waveguides

NASA Astrophysics Data System (ADS)

Ito, Yuka; Terada, Shinsuke; Arai, Shinya; Fujiwara, Makoto; Mori, Tetsuya; Choki, Koji; Fukushima, Takafumi; Koyanagi, Mitsumasa

2012-04-01

We proposed a rigid/flex optoelectronic (O/E) module with 48-channel polymeric waveguides for short-distance board-level optical interconnection. A flexible O/E test module was fabricated in the following two steps by using standard packaging processes. First, two vertical cavity surface emitting laser diodes (VCSELs) and one VCSEL driver (VD) were flip-chip bonded to a completed flexible printed circuit board (PCB), and two photodiodes (PDs) and one transimpedance amplifier/limiting amplifier (TIA/LA) to another flexible PCB. Second, the two flexible PCBs were attached with a polynorbornene (PNB) sheet in which high-density PNB waveguides were formed by UV exposure. Active areas of VCSELs and PDs on the flexible PCBs were aligned to micromirrors of the waveguides with -6 µm offset toward the signal propagation direction. We successfully demonstrated data transmission over 10 Gbps and low inter-channel crosstalk of less than -20 dB was achieved in the flexible O/E test module with 120-mm-long and 62.5-µm-pitch waveguides.

PCB Fault Detection Using Image Processing

NASA Astrophysics Data System (ADS)

Nayak, Jithendra P. R.; Anitha, K.; Parameshachari, B. D., Dr.; Banu, Reshma, Dr.; Rashmi, P.

2017-08-01

The importance of the Printed Circuit Board inspection process has been magnified by requirements of the modern manufacturing environment where delivery of 100% defect free PCBs is the expectation. To meet such expectations, identifying various defects and their types becomes the first step. In this PCB inspection system the inspection algorithm mainly focuses on the defect detection using the natural images. Many practical issues like tilt of the images, bad light conditions, height at which images are taken etc. are to be considered to ensure good quality of the image which can then be used for defect detection. Printed circuit board (PCB) fabrication is a multidisciplinary process, and etching is the most critical part in the PCB manufacturing process. The main objective of Etching process is to remove the exposed unwanted copper other than the required circuit pattern. In order to minimize scrap caused by the wrongly etched PCB panel, inspection has to be done in early stage. However, all of the inspections are done after the etching process where any defective PCB found is no longer useful and is simply thrown away. Since etching process costs 0% of the entire PCB fabrication, it is uneconomical to simply discard the defective PCBs. In this paper a method to identify the defects in natural PCB images and associated practical issues are addressed using Software tools and some of the major types of single layer PCB defects are Pattern Cut, Pin hole, Pattern Short, Nick etc., Therefore the defects should be identified before the etching process so that the PCB would be reprocessed. In the present approach expected to improve the efficiency of the system in detecting the defects even in low quality images

Liquid oil and residual characteristics of printed circuit board recycle by pyrolysis.

PubMed

Lin, Kuo-Hsiung; Chiang, Hung-Lung

2014-04-30

Non-metal fractions of waste printed circuit boards (PCBs) were thermally treated (200-500°C) under nitrogen atmosphere. Carbon, hydrogen, and nitrogen were determined by elemental analyzer, bromine by instrumental neutron activation analysis (INAA), phosphorus by energy dispersive X-ray spectrometer (EDX), and 29 trace elements by inductively coupled plasma atomic emission spectrometer (ICP-AES) and mass spectrometry (ICP-MS) for raw material and pyrolysis residues. Organic compositions of liquid oil were identified by GC (gas chromatography)-MS, trace element composition by ICP system, and 12 water-soluble ions by IC (ionic chromatography). Elemental content of carbon was >450 mg/g, oxygen 300 mg/g, bromine and hydrogen 60 mg/g, nitrogen 30 mg/g, and phosphorus 28 mg/g. Sulfur was trace in PCBs. Copper content was 25-28 mg/g, iron 1.3-1.7 mg/g, tin 0.8-1.0mg/g and magnesium 0.4-1.0mg/g; those were the main metals in the raw materials and pyrolytic residues. In the liquid products, carbon content was 68-73%, hydrogen was 10-14%, nitrogen was 4-5%, and sulfur was less than 0.05% at pyrolysis temperatures from 300 to 500°C. Phenol, 3-bromophenol, 2-methylphenol and 4-propan-2-ylphenol were major species in liquid products, accounting for >50% of analyzed organic species. Bromides, ammonium and phosphate were the main species in water sorption samples for PCB pyrolysis exhaust. Copyright © 2014 Elsevier B.V. All rights reserved.

Theoretic model and computer simulation of separating mixture metal particles from waste printed circuit board by electrostatic separator.

PubMed

Li, Jia; Xu, Zhenming; Zhou, Yaohe

2008-05-30

Traditionally, the mixture metals from waste printed circuit board (PCB) were sent to the smelt factory to refine pure copper. Some valuable metals (aluminum, zinc and tin) with low content in PCB were lost during smelt. A new method which used roll-type electrostatic separator (RES) to recovery low content metals in waste PCB was presented in this study. The theoretic model which was established from computing electric field and the analysis of forces on the particles was used to write a program by MATLAB language. The program was design to simulate the process of separating mixture metal particles. Electrical, material and mechanical factors were analyzed to optimize the operating parameters of separator. The experiment results of separating copper and aluminum particles by RES had a good agreement with computer simulation results. The model could be used to simulate separating other metal (tin, zinc, etc.) particles during the process of recycling waste PCBs by RES.

Combustion and inorganic bromine emission of waste printed circuit boards in a high temperature furnace

DOE Office of Scientific and Technical Information (OSTI.GOV)

Ni Mingjiang, E-mail: xiaohanxi_2@163.com; Xiao Hanxi; Chemistry and Chemical Engineering School, Hunan University of Science and Technology, Xiangtan

2012-03-15

Highlights: Black-Right-Pointing-Pointer The combustion efficiency of waste printed circuit boards (PCBs) depends on temperature, excess air factor, and high temperature zone residence time. Temperature has the most significant impact. Under the proposed condition, combustion of waste PCBs alone is quite complete within the furnace. Black-Right-Pointing-Pointer High temperature prompts a more complete bromine release and conversion. When temperature is high enough, 99.9% organobrominated compounds, the potential precursors for brominated dixoins formation, are destroyed efficiently and convert to inorganic bromine in flue gas, as HBr and Br{sub 2}. Black-Right-Pointing-Pointer Temperature has crucial influence over the inhibition of HBr conversion to Br{sub 2},more » while the oxygen partial pressure plays a reverse role in the conversion to a very small extent. Increasing temperature will decrease the volume percentage ratio of Br{sub 2}/HBr in flue gas greatly. Black-Right-Pointing-Pointer The thermodynamic equilibrium approach of bromine conversion was investigated. The two forms of inorganic bromine in flue gas substantially reach thermodynamic equilibrium within 0.25 s. Under the proposed operating condition, the reaction of Br transfer and conversion finish. - Abstract: High temperature combustion experiments of waste printed circuit boards (PCBs) were conducted using a lab-scale system featuring a continuously-fed drop tube furnace. Combustion efficiency and the occurrence of inorganic bromine (HBr and Br{sub 2}) were systematically studied by monitoring the main combustion products continuously. The influence of furnace temperature (T) was studied from 800 to 1400 Degree-Sign C, the excess air factor (EAF) was varied from 1.2 to 1.9 and the residence time in the high temperature zone (RT{sub HT}) was set at 0.25, 0.5, or 0.75 s. Combustion efficiency depends on temperature, EAF and RT{sub HT}; temperature has the most significant effect. Conversion of organic bromine from flame retardants into HBr and Br{sub 2} depends on temperature and EAF. Temperature has crucial influence over the ratio of HBr to Br{sub 2}, whereas oxygen partial pressure plays a minor role. The two forms of inorganic bromine seem substantially to reach thermodynamic equilibrium within 0.25 s. High temperature is required to improve the combustion performance: at 1200 Degree-Sign C or higher, an EAF of 1.3 or more, and a RT{sub HT} exceeding 0.75 s, combustion is quite complete, the CO concentration in flue gas and remained carbon in ash are sufficiently low, and organobrominated compounds are successfully decomposed (more than 99.9%). According to these results, incineration of waste PCBs without preliminary separation and without additives would perform very well under certain conditions; the potential precursors for brominated dioxins formation could be destroyed efficiently. Increasing temperature could decrease the volume percentage ratio of Br{sub 2}/HBr in flue gas greatly.« less

Environmental risk related to specific processes during scrap computer recycling and disposal.

PubMed

Li, Jinhui; Shi, Pixing; Shan, Hongshan; Xie, Yijun

2012-12-01

The purpose of this work was to achieve a better understanding of the generation of toxic chemicals related to specific processes in scrap computer recycling and disposal, such as thermal recycling of printed circuit boards (PCBs) and the landfilling or dumping of cathode ray tubes (CRTs). Tube furnace pyrolysis was carried out to simulate different thermal treatment conditions for the identification of the by-products and potential environmental risk from thermal recycling ofPCBs. The Toxicity Characteristic Leaching Procedure (TCLP) and a column test were used to study the leaching characteristics of lead from waste CRT glass, which is one of the most important environmental concerns arising from the disposal of e-waste. The results indicate that more attention should be paid to the benzene series when recycling PCBs under thermal conditions, especially for workers without any personal protection equipment. The impact of immersion on the leaching of lead from CRT leaded glass was more effective than the impact of washing only by acid rain. Thus when waste leaded glass has to be stored for some reason, the storage facility should be dry.

Thiosulfate leaching of gold from waste mobile phones.

PubMed

Ha, Vinh Hung; Lee, Jae-chun; Jeong, Jinki; Hai, Huynh Trung; Jha, Manis K

2010-06-15

The present communication deals with the leaching of gold from the printed circuit boards (PCBs) of waste mobile phones using an effective and less hazardous system, i.e., a copper-ammonia-thiosulfate solution, as an alternative to the conventional and toxic cyanide leaching of gold. The influence of thiosulfate, ammonia and copper sulfate concentrations on the leaching of gold from PCBs of waste mobile phones was investigated. Gold extraction was found to be enhanced with solutions containing 15-20 mM cupric, 0.1-0.14 M thiosulfate, and 0.2-0.3 M ammonia. Similar trends were obtained for the leaching of gold from two different types of scraps and PCBs of waste mobile phones. From the scrap samples, 98% of the gold was leached out using a solution containing 20 mM copper, 0.12 M thiosulfate and 0.2 M ammonia. Similarly, the leaching of gold from the PCBs samples was also found to be good, but it was lower than that of scrap samples in similar experimental conditions. In this case, only 90% of the gold was leached, even with a contact time of 10h. The obtained data will be useful for the development of processes for the recycling of gold from waste mobile phones. Copyright 2010 Elsevier B.V. All rights reserved.

Analysis of complex environment effect on near-field emission

NASA Astrophysics Data System (ADS)

Ravelo, B.; Lalléchère, S.; Bonnet, P.; Paladian, F.

2014-10-01

The article is dealing with uncertainty analyses of radiofrequency circuits electromagnetic compatibility emission based on the near-field/near-field (NF/NF) transform combined with stochastic approach. By using 2D data corresponding to electromagnetic (EM) field (X=E or H) scanned in the observation plane placed at the position z0 above the circuit under test (CUT), the X field map was extracted. Then, uncertainty analyses were assessed via the statistical moments from X component. In addition, stochastic collocation based was considered and calculations were applied to planar EM NF radiated by the CUTs as Wilkinson power divider and a microstrip line operating at GHz levels. After Matlab implementation, the mean and standard deviation were assessed. The present study illustrates how the variations of environmental parameters may impact EM fields. The NF uncertainty methodology can be applied to any physical parameter effects in complex environment and useful for printed circuit board (PCBs) design guideline.

Assessment of Pb, Cd, Cr and Ag leaching from electronics waste using four extraction methods.

PubMed

Keith, Ashley; Keesling, Kara; Fitzwater, Kendra K; Pichtel, John; Houy, Denise

2008-12-01

Heavy metals present in electronic components may leach upon disposal and therefore pose significant environmental hazards. The potential leaching of Pb, Cd, Cr and Ag from PC cathode ray tubes, printed circuit boards (PCBs), PC mice, TV remote controls, and mobile phones was assessed. After controlled crushing, each component was extracted using the Toxicity Characteristic Leaching Procedure (TCLP), EPA Method 1312 (SPLP), NEN 7371 (Dutch Environmental Agency), and DIN S4 (Germany). The TCLP consistently leached the greatest amounts of Pb from all components. The SPLP, NEN 7371 and DIN S4 extracted relatively small amounts of metals compared with the TCLP and were not considered effective as leaching tests for e-waste. The smallest size fraction (< 2 mm) of CRT glass and PCBs leached significantly (p < 0.05) highest Pb via the TCLP. A modified TCLP removed 50.9% more extractable Pb compared with the conventional procedure.

Evaluation of gold and silver leaching from printed circuit board of cellphones

DOE Office of Scientific and Technical Information (OSTI.GOV)

Petter, P.M.H., E-mail: patymhp@yahoo.com.br; Veit, H.M.; Bernardes, A.M.

2014-02-15

Highlights: • Printed circuit boards (PCB) of mobile phones have large amounts of metals with high economic value such as gold and silver. • Dissolution of gold was done with a cyanide-based reagent and silver with nitric acid. • Leaching of PCB with Na{sub 2}S{sub 2}O{sub 3} and (NH{sub 4}){sub 2}S{sub 2}O{sub 3} to examine the feasibility of using these reagents was done. - Abstract: Electronic waste has been increasing proportionally with the technology. So, nowadays, it is necessary to consider the useful life, recycling, and final disposal of these equipment. Metals, such as Au, Ag, Cu, Sn and Nimore » can be found in the printed circuit boards (PCB). According to this, the aims of this work is to characterize the PCBs of mobile phones with aqua regia; obtaining “reference” values of leaching, to gold and silver, with cyanide and nitric acid, respectively; and study the process of leaching of these metals in alternative leaching with sodium thiosulfate and ammonium thiosulfate. The metals were characterized by digesting the sample with aqua regia for 1 and 2 h at 60 °C and 80 °C. The leaching of Au with a commercial reagent (cyanide) and the Ag with HNO{sub 3}were made. The leaching of Au and Ag with alternative reagents: Na{sub 2}S{sub 2}O{sub 3,} and (NH{sub 4}){sub 2}S{sub 2}O{sub 3} in 0.1 M concentration with the addition of CuSO{sub 4}, NH{sub 4}OH, and H{sub 2}O{sub 2}, was also studied. The results show that the digestion with aqua regia was efficient to characterize the metals present in the PCBs of mobile phones. However, the best method to solubilize silver was by digesting the sample with nitric acid. The leaching process using sodium thiosulfate was more efficient when an additional concentration of 0.015 and 0.030 M of the CuSO{sub 4} was added.« less

Advantages and Challenges of 10-Gbps Transmission on High-Density Interconnect Boards

NASA Astrophysics Data System (ADS)

Yee, Chang Fei; Jambek, Asral Bahari; Al-Hadi, Azremi Abdullah

2016-06-01

This paper provides a brief introduction to high-density interconnect (HDI) technology and its implementation on printed circuit boards (PCBs). The advantages and challenges of implementing 10-Gbps signal transmission on high-density interconnect boards are discussed in detail. The advantages (e.g., smaller via dimension and via stub removal) and challenges (e.g., crosstalk due to smaller interpair separation) of HDI are studied by analyzing the S-parameter, time-domain reflectometry (TDR), and transmission-line eye diagrams obtained by three-dimensional electromagnetic modeling (3DEM) and two-dimensional electromagnetic modeling (2DEM) using Mentor Graphics HyperLynx and Keysight Advanced Design System (ADS) electronic computer-aided design (ECAD) software. HDI outperforms conventional PCB technology in terms of signal integrity, but proper routing topology should be applied to overcome the challenge posed by crosstalk due to the tight spacing between traces.

Evaluation of gold and silver leaching from printed circuit board of cellphones.

PubMed

Petter, P M H; Veit, H M; Bernardes, A M

2014-02-01

Electronic waste has been increasing proportionally with the technology. So, nowadays, it is necessary to consider the useful life, recycling, and final disposal of these equipment. Metals, such as Au, Ag, Cu, Sn and Ni can be found in the printed circuit boards (PCB). According to this, the aims of this work is to characterize the PCBs of mobile phones with aqua regia; obtaining "reference" values of leaching, to gold and silver, with cyanide and nitric acid, respectively; and study the process of leaching of these metals in alternative leaching with sodium thiosulfate and ammonium thiosulfate. The metals were characterized by digesting the sample with aqua regia for 1 and 2h at 60°C and 80°C. The leaching of Au with a commercial reagent (cyanide) and the Ag with HNO3were made. The leaching of Au and Ag with alternative reagents: Na2S2O3, and (NH4)2S2O3 in 0.1M concentration with the addition of CuSO4, NH4OH, and H2O2, was also studied. The results show that the digestion with aqua regia was efficient to characterize the metals present in the PCBs of mobile phones. However, the best method to solubilize silver was by digesting the sample with nitric acid. The leaching process using sodium thiosulfate was more efficient when an additional concentration of 0.015 and 0.030 M of the CuSO4 was added. Copyright © 2013 Elsevier Ltd. All rights reserved.

Packaging Technologies for 500 C SiC Electronics and Sensors: Challenges in Material Science and Technology

NASA Technical Reports Server (NTRS)

Chen, Liang-Yu; Neudeck, Philip G.; Behelm, Glenn M.; Spry, David J.; Meredith, Roger D.; Hunter, Gary W.

2015-01-01

This paper presents ceramic substrates and thick-film metallization based packaging technologies in development for 500C silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chip-level packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550C. The 96 alumina packaging system composed of chip-level packages and PCBs has been successfully tested with high temperature SiC discrete transistor devices at 500C for over 10,000 hours. In addition to tests in a laboratory environment, a SiC junction field-effect-transistor (JFET) with a packaging system composed of a 96 alumina chip-level package and an alumina printed circuit board was tested on low earth orbit for eighteen months via a NASA International Space Station experiment. In addition to packaging systems for electronics, a spark-plug type sensor package based on this high temperature interconnection system for high temperature SiC capacitive pressure sensors was also developed and tested. In order to further significantly improve the performance of packaging system for higher packaging density, higher operation frequency, power rating, and even higher temperatures, some fundamental material challenges must be addressed. This presentation will discuss previous development and some of the challenges in material science (technology) to improve high temperature dielectrics for packaging applications.

Environmental risk assessment of wastewaters from printed circuit board production: A multibiomarker approach using human cells.

PubMed

Gerić, Marko; Gajski, Goran; Oreščanin, Višnja; Domijan, Ana-Marija; Kollar, Robert; Garaj-Vrhovac, Vera

2017-02-01

Since the production of printed circuit boards (PCBs) generates wastewater contaminated with heavy metals and organic matter, PCB factories represent potential pollution sites. The wastewater toxicologically tested in this study contained several metals and the most abundant were copper and iron. At two exposure times tested (4 and 24 h) PCB wastewater (PCBW) proved to be cytotoxic (decreased cell viability) and genotoxic (increased comet assay tail intensity and tail moment) to human blood peripheral lymphocytes in vitro, and the oxidative stress parameter (malondialdehyde concentration) was also found to be higher. After application of combined treatment by waste base, ozone and waste sludge methods, concentrations of metals in purified PCBW were below the upper permitted levels and all tested toxicological parameters did not differ compared to the negative control. Taken together, similar methods could be implemented in PCB factories before discharging potentially toxic wastewater into the environment because purified PCBW does not represent a threat from the aspect of cytotoxicity and genotoxicity. Copyright © 2016 Elsevier Ltd. All rights reserved.

Assessment of noise and heavy metals (Cr, Cu, Cd, Pb) in the ambience of the production line for recycling waste printed circuit boards.

PubMed

Xue, Mianqiang; Yang, Yichen; Ruan, Jujun; Xu, Zhenming

2012-01-03

The crush-pneumatic separation-corona electrostatic separation production line provides a feasible method for industrialization of waste printed circuit boards (PCBs) recycling. To determine the potential environmental contamination in the automatic line workshop, noise and heavy metals (Cr, Cu, Cd, Pb) in the ambience of the production line have been evaluated in this paper. The mean noise level in the workshop has been reduced from 96.4 to 79.3 dB since the engineering noise control measures were employed. Noise whose frequency ranged from 500 to 1000 Hz is controlled effectively. The mass concentrations of TSP and PM(10) in the workshop are 282.6 and 202.0 μg/m(3), respectively. Pb (1.40 μg/m(3)) and Cu (1.22 μg/m(3)) are the most enriched metals in TSP samples followed by Cr (0.17 μg/m(3)) and Cd (0.028 μg/m(3)). The concentrations of Cu, Pb, Cr, and Cd in PM(10) are 0.88, 0.56, 0.12, and 0.88 μg/m(3), respectively. Among the four metals, Cr and Pb are released into the ambience of the automatic line more easily in the crush and separation process. Health risk assessment shows that noncancerous effects might be possible for Pb (HI = 1.45), and noncancerous effects are unlikely for Cr, Cu, and Cd. The carcinogenic risks for Cr and Cd are 3.29 × 10(-8) and 1.61 × 10(-9), respectively. It indicates that carcinogenic risks on workers are relatively light in the workshop. These findings suggest that this technology is advanced from the perspective of environmental protection in the waste PCBs recycling industry.

Characterization of PCBs from computers and mobile phones, and the proposal of newly developed materials for substitution of gold, lead and arsenic.

PubMed

Dervišević, Irma; Minić, Duško; Kamberović, Željko; Ćosović, Vladan; Ristić, Mirjana

2013-06-01

In this paper, we have analyzed parts of printed circuit board (PCB) and liquid crystal display (LCD) screens of mobile phones and computers, quantitative and qualitative chemical compositions of individual components, and complete PCBs were determined. Differential thermal analysis (DTA) and differential scanning calorimetry (DSC) methods were used to determine the temperatures of phase transformations, whereas qualitative and quantitative compositions of the samples were determined by X-ray fluorescence spectrometry (XRF), inductively coupled plasma optical emission spectrometry (ICP-OES), and scanning electron microscopy (SEM)-energy dispersive X-ray spectrometry (EDS) analyses. The microstructure of samples was studied by optical microscopy. Based on results of the analysis, a procedure for recycling PCBs is proposed. The emphasis was on the effects that can be achieved in the recycling process by extraction of some parts before the melting process. In addition, newly developed materials can be an adequate substitute for some of the dangerous and harmful materials, such as lead and arsenic are proposed, which is in accordance with the European Union (EU) Restriction of the use of certain hazardous substances (RoHS) directive as well as some alternative materials for use in the electronics industry instead of gold and gold alloys.

Bioleaching of Gold and Silver from Waste Printed Circuit Boards by Pseudomonas balearica SAE1 Isolated from an e-Waste Recycling Facility.

PubMed

Kumar, Anil; Saini, Harvinder Singh; Kumar, Sudhir

2018-02-01

Indigenous bacterial strain Pseudomonas balearica SAE1, tolerant to e-waste toxicity was isolated from an e-waste recycling facility Exigo Recycling Pvt. Ltd., India. Toxicity tolerance of bacterial strain was analyzed using crushed (particle size ≤150 µm) waste computer printed circuit boards (PCBs)/liter (L) of culture medium. The EC 50 value for SAE1 was 325.7 g/L of the e-waste pulp density. Two-step bioleaching was then applied to achieve the dissolution of gold (Au) and silver (Ag) from the e-waste. To maximize precious metal dissolution, factors including pulp density, glycine concentration, pH level, and temperature were optimized. The optimization resulted in 68.5 and 33.8% of Au and Ag dissolution, respectively, at a pH of 9.0, a pulp density of 10 g/L, a temperature of 30 °C, and a glycine concentration of 5 g/L. This is the first study of Au and Ag bioleaching using indigenous e-waste bacteria and its analysis to determine e-waste toxicity tolerance.

Fully optical backplane system using novel optical plug and slot

NASA Astrophysics Data System (ADS)

Cho, In-Kui; Ahn, Seung-Ho; Lee, Woo-Jin; Han, Sang-Pil; Kim, Jin-Tae; Choi, Chun-Ki; Shin, Kyung-Up; Yoon, Keun Byoung; Jeong, Myung-Yung; Park, Hyo Hoon

2005-10-01

A fully optical PCB with transmitter/receiver system boards and optical bakcplane was prepared, which is board-to-board interconnection by an optical slot. We report a 10 Gb/s PRBS NRZ data transmission between transmitter system board and optical backplane embedded multimode polymeric waveguide arrays. The basic concept of the optical PCB is as follows; 1) Metal optical bench is integrated with optoelectronic devices, driver and receiver circuits, polymeric waveguide and access line PCB module. 2) Multimode polymeric waveguide inside an optical backplane, which is embedded into PCB, 3) Optical slot and plug for high-density (channel pitch : 500 um) board-to-board interconnection. The polymeric waveguide technology can be used for transmission of data between transmitter/receiver processing boards and backplane boards. The main components are low-loss tapered polymeric waveguides and a novel optical plug and slot for board-to-board interconnections, respectively. The transmitter/receiver processing boards are designed as plug types, and can be easily plugged-in and -out at an optical backplane board. The optical backplane boards are prepared by employing the lamination processes for conventional electrical PCBs. A practical optical backplane system was implemented with two processing boards and an optical backplane. As connection components between the transmitter/receiver processing boards and backplane board, optical slots made of a 90°-bending structure-embedded optical plug was used. A 10 Gb/s data link was successfully demonstrated. The bit error rate (BER) was determined and is 5.6×10 -9(@10Gb/s) and the BER of 8 Gb/s is < 10 -12.

Enhancement of simultaneous gold and copper recovery from discarded mobile phone PCBs using Bacillus megaterium: RSM based optimization of effective factors and evaluation of their interactions.

PubMed

Arshadi, M; Mousavi, S M; Rasoulnia, P

2016-11-01

Bioleaching of Au from mobile phone printed circuit boards (MPPCBs) was studied, using Bacillus megaterium which is a cyanogenic bacterium. To maximize Au extraction, initial pH, pulp density, and glycine concentration were optimized via response surface methodology (RSM). Bioleaching of Cu, an important inhibitor on Au recovery, was also examined. To maximize Au recovery, the optimal condition suggested by the models was initial pH of 10, pulp density of 8.13g/l, and glycine concentration of 10g/l. Under the optimal condition, approximately 72% of Cu and 65g Au/ton MPPCBs, which is 7 times greater than the recovery from gold mines, was extracted. Cu elimination from the MPPCBs having a rich content of Au did not cause a significant effect on Au recovery. It was found that when the ratio of Cu to Au is high, Cu elimination can considerably improve Au recovery. B. megaterium could extract the total Au from PCBs containing 130g Au/ton MPPCBs. Copyright © 2016 Elsevier Ltd. All rights reserved.

Waste printed circuit board recycling techniques and product utilization.

PubMed

Hadi, Pejman; Xu, Meng; Lin, Carol S K; Hui, Chi-Wai; McKay, Gordon

2015-01-01

E-waste, in particular waste PCBs, represents a rapidly growing disposal problem worldwide. The vast diversity of highly toxic materials for landfill disposal and the potential of heavy metal vapors and brominated dioxin emissions in the case of incineration render these two waste management technologies inappropriate. Also, the shipment of these toxic wastes to certain areas of the world for eco-unfriendly "recycling" has recently generated a major public outcry. Consequently, waste PCB recycling should be adopted by the environmental communities as an ultimate goal. This article reviews the recent trends and developments in PCB waste recycling techniques, including both physical and chemical recycling. It is concluded that the physical recycling techniques, which efficiently separate the metallic and nonmetallic fractions of waste PCBs, offer the most promising gateways for the environmentally-benign recycling of this waste. Moreover, although the reclaimed metallic fraction has gained more attention due to its high value, the application of the nonmetallic fraction has been neglected in most cases. Hence, several proposed applications of this fraction have been comprehensively examined. Copyright © 2014 Elsevier B.V. All rights reserved.

Novel waste printed circuit board recycling process with molten salt.

PubMed

Riedewald, Frank; Sousa-Gallagher, Maria

2015-01-01

The objective of the method was to prove the concept of a novel waste PCBs recycling process which uses inert, stable molten salts as the direct heat transfer fluid and, simultaneously, uses this molten salt to separate the metal products in either liquid (solder, zinc, tin, lead, etc.) or solid (copper, gold, steel, palladium, etc.) form at the operating temperatures of 450-470 °C. The PCB recovery reactor is essentially a U-shaped reactor with the molten salt providing a continuous fluid, allowing molten salt access from different depths for metal recovery. A laboratory scale batch reactor was constructed using 316L as suitable construction material. For safety reasons, the inert, stable LiCl-KCl molten salts were used as direct heat transfer fluid. Recovered materials were washed with hot water to remove residual salt before metal recovery assessment. The impact of this work was to show metal separation using molten salts in one single unit, by using this novel reactor methodology. •The reactor is a U-shaped reactor filled with a continuous liquid with a sloped bottom representing a novel reactor concept.•This method uses large PCB pieces instead of shredded PCBs as the reactor volume is 2.2 L.•The treated PCBs can be removed via leg B while the process is on-going.

Novel waste printed circuit board recycling process with molten salt

PubMed Central

Riedewald, Frank; Sousa-Gallagher, Maria

2015-01-01

The objective of the method was to prove the concept of a novel waste PCBs recycling process which uses inert, stable molten salts as the direct heat transfer fluid and, simultaneously, uses this molten salt to separate the metal products in either liquid (solder, zinc, tin, lead, etc.) or solid (copper, gold, steel, palladium, etc.) form at the operating temperatures of 450–470 °C. The PCB recovery reactor is essentially a U-shaped reactor with the molten salt providing a continuous fluid, allowing molten salt access from different depths for metal recovery. A laboratory scale batch reactor was constructed using 316L as suitable construction material. For safety reasons, the inert, stable LiCl–KCl molten salts were used as direct heat transfer fluid. Recovered materials were washed with hot water to remove residual salt before metal recovery assessment. The impact of this work was to show metal separation using molten salts in one single unit, by using this novel reactor methodology. • The reactor is a U-shaped reactor filled with a continuous liquid with a sloped bottom representing a novel reactor concept. • This method uses large PCB pieces instead of shredded PCBs as the reactor volume is 2.2 L. • The treated PCBs can be removed via leg B while the process is on-going. PMID:26150977

Residual Strain in PCBs with Cu-Plated Holes

NASA Astrophysics Data System (ADS)

Rudajevova, A.; Dušek, K.

2017-12-01

The residual strain in pure printed circuit boards (PCBs) and PCBs with Cu-plated holes has been obtained by measurement of the temperature dependence of their dilatational characteristics in the x, y, and z directions up to 240°C. Shrinkage in all directions was observed for all samples of both materials in the first thermal cycle. No permanent length changes were observed in the second or subsequent thermal cycles. The residual strain was determined from the difference in relative elongation between the first and second thermal cycles. Relaxation of residual strain occurred only in the first thermal cycle, as a thermally activated process. The highest value of relaxed residual strain was found in the z direction for both materials. Relaxation of residual strain in the z direction of the pure PCB occurred only in the negative strain range, whereas relaxation of the PCB with Cu-plated holes occurred in both the positive and negative strain ranges. The relaxation of the positive strain in the PCB with Cu-plated holes in the z direction implies that this part of the PCB was under pressure during its preparation. This relaxation is a consequence of the high coefficient of thermal expansion of PCB laminate in this direction, which can also lead to cracks in Cu holes when the material is heated above the glass-transition temperature.

Innovative materials tailored for advanced micro-optic applications

NASA Astrophysics Data System (ADS)

Himmelhuber, Roland; Fink, Marion; Pfeiffer, Karl; Ostrzinski, Ute; Klukowska, Anna; Gruetzner, Gabi; Houbertz, Ruth; Wolter, Herbert

2007-02-01

The handling of a continuously increasing amount of data leads to a strong need for high-speed short-range connections. Conventional Cu technology between chips on a board is limited. Optical interconnects will dominate the market, since they can overcome the limitations. One of the issues for materials used, e.g., for waveguides embedded in printed circuit boards (PCBs) is the compatibility with standard epoxies used for PCBs during the entire board fabrication process. Materials applied for optical interconnects should be mechanically and optically reliable, and also allow low-cost production. From the material production side, the process should be easy to up-scale. Therefore, anticipatory research strategy and suitable tailoring is asked for. The handling of light in the UV and visible range often requires the use of specially designed materials. Most polymer materials show an increased yellowing effect upon being exposed to shorter wavelength light. The major influence on the absorption in the UV and visible range of a UV curable material is related to the UV initiator, beside any other chromophores formed mainly during the exposure. Different material approaches will be presented which fulfil the requirements for highly sophisticated applications in optics / optical packaging technology. Firstly, an epoxy-based material system for optical chip-to-chip interconnection will be introduced. Secondly, the adaptation of a UV patternable inorganic-organic hybrid material (ORMOCER ®) originally developed for waveguide applications in the data and telecom regime, will be discussed with respect to applications in the visible regime. Spectroscopy and UV-DSC measurements were carried out to investigate the influence of standard photoinitiators on the optical properties for an ORMOCER ® system suitable for microoptic applications. The results show that the resulting material properties were significantly improved by exchange of the initiators compared to the originally incorporated one.

PVC-based composite material containing recycled non-metallic printed circuit board (PCB) powders.

PubMed

Wang, Xinjie; Guo, Yuwen; Liu, Jingyang; Qiao, Qi; Liang, Jijun

2010-12-01

The study is directed to the use of non-metallic powders obtained from comminuted recycled paper-based printed circuit boards (PCBs) as an additive to polyvinyl chloride (PVC) substrate. The physical properties of the non-metallic PCB (NMPCB) powders were measured, and the morphological, mechanical and thermal properties of the NMPCB/PVC composite material were investigated. The results show that recycled NMPCB powders, when added below a threshold, tended to increase the tensile strength and bending strength of PVC. When 20 wt% NMPCB powders (relative to the substrate PVC) of an average diameter of 0.08 mm were added, the composite tensile strength and bending strength reached 22.6 MPa and 39.83 MPa, respectively, representing 107.2% and 123.1% improvement over pure PVC. The elongation at break of the composite material reached 151.94% of that of pure PVC, while the Vicat softening temperature of the composite material did not increase significantly compared to the pure PVC. The above results suggest that paper-based NMPCB powders, when used at appropriate amounts, can be effective for toughening PVC. Thus, this study suggests a new route for reusing paper-based NMPCB, which may have a significant beneficial environmental impact. Copyright © 2010 Elsevier Ltd. All rights reserved.

Application of lower aliphatic alcohols as reducing agents for increasing efficiency of the LCLD process

NASA Astrophysics Data System (ADS)

Semenok, Dmitrii

2014-05-01

A method is described that is promising for application metal conductors on ceramic substrates during printed-circuit boards (PCBs) production without masking plate. The main idea of laser-induced metal deposition from solution (LCLD) consists of implementation of chemical micro reactor by using a focused laser beam. In this reactor the red/ox reaction would be initiated due to heating of a reaction medium. We used a 532 nm DPSS laser (power: 2100 mW) and water solutions of organic alcohols with low molecular weight, ethanol and isopropanol as reductants. The results of deposition were studied using the SEM, EDX methods and impedance spectroscopy. The equivalent resistance-capacitance circuit of copper tracks was constructed. The experiments showed that increasing the rate of deposition of nanostructured copper tracks up to 50 μm/s with electrical resistivity 5 Ohm/cm is possible by replacing the well-known reductants such as formaldehyde and D-sorbitol with iso-propanol.

Structural Dynamics of Electronic Systems

NASA Astrophysics Data System (ADS)

Suhir, E.

2013-03-01

The published work on analytical ("mathematical") and computer-aided, primarily finite-element-analysis (FEA) based, predictive modeling of the dynamic response of electronic systems to shocks and vibrations is reviewed. While understanding the physics of and the ability to predict the response of an electronic structure to dynamic loading has been always of significant importance in military, avionic, aeronautic, automotive and maritime electronics, during the last decade this problem has become especially important also in commercial, and, particularly, in portable electronics in connection with accelerated testing of various surface mount technology (SMT) systems on the board level. The emphasis of the review is on the nonlinear shock-excited vibrations of flexible printed circuit boards (PCBs) experiencing shock loading applied to their support contours during drop tests. At the end of the review we provide, as a suitable and useful illustration, the exact solution to a highly nonlinear problem of the dynamic response of a "flexible-and-heavy" PCB to an impact load applied to its support contour during drop testing.

Characterization of brominated flame retardants from e-waste components in China.

PubMed

Yu, Danfeng; Duan, Huabo; Song, Qingbin; Liu, Yicheng; Li, Ying; Li, Jinhui; Shen, Weijun; Luo, Jiahui; Wang, Jinben

2017-10-01

Many studies show that high levels of many toxic metals and persistent and bio-accumulative chemicals have been found in electronic waste (e-waste) dismantling sites and their surrounding environmental media. Both flame-retardant plastic housing materials and printed circuit boards (PCBs) could be the major contributors. However, relatively little work has focused on the use or content of toxic substances and their changing in scrap housing materials and PCBs from home appliances. This study evaluated the existence of brominated flame retardants (BFRs, including polybrominated diphenyl ethers (PBDEs) and Tetrabromobisphenol-A (TBBPA)) in housing plastics and PCBs from home appliances collected from various e-waste recyclers in China. These were then analyzed for the potential migration of BFRs from the e-waste components into their recycled products. The results show that both PBDEs and TBBPA were found with high level in most of e-waste samples, indicating that the widespread use of BFRs in home appliances are entering into the end-of-life stage. For the plastics samples, CRT TVs and LCD monitors should be given priority for the control of BFRs. Regarding PBDEs, the dominant congeners of BDE-209 in the plastics samples contributed 90.72-93.54% to the total concentrations of PBDEs, yet there are large variations for PCBs samples: BDE-28, -47, -99, and -153 were also important congeners compositions, except for BDE-209. Compared with previous studies, the BFRs concentrations in current Chinese e-waste are trending to decline. This study also found that BFRs in housing plastics and PCBs will be transferred into the recycled products with other purpose use, and the new products could have highly enriched capacities for BFRs. The obtained results could be helpful to manage e-waste and their components properly in order to minimize associated environmental and health risks of BFRs, particularly for their further reuse. Copyright © 2017 Elsevier Ltd. All rights reserved.

Disruptive Technologies in Workmanship: pH-neutral Flux, CDM ESD Events, HDI PCBs

NASA Technical Reports Server (NTRS)

Plante, Jeannette F.

2010-01-01

This slide presentation describes what it calls "disruptive technologies", i.e., "Low-end disruption" occurs when the rate at which products improve exceeds the rate at which customers can adopt the new performance. Therefore, at some point the performance of the product overshoots the needs of certain customer segments. At this point, a disruptive technology may enter the market and provide a product which has lower performance than the incumbent but which exceeds the requirements of certain segments, thereby gaining a foothold in the market. This concept is viewed in impacting incumbent technologies Rosin Flux, with a pH-neutral water soluble Flux; electrostatic discharge models being disrupted by the charge device model (CDM) concept; and High Density Interconnect Printed Circuit Boards (HDI PCB).

Printed Circuit Board Surface Finish and Effects of Chloride Contamination, Electric Field, and Humidity on Corrosion Reliability

NASA Astrophysics Data System (ADS)

Conseil-Gudla, Hélène; Jellesen, Morten S.; Ambat, Rajan

2017-02-01

Corrosion reliability is a serious issue today for electronic devices, components, and printed circuit boards (PCBs) due to factors such as miniaturization, globalized manufacturing practices which can lead to process-related residues, and global usage effects such as bias voltage and unpredictable user environments. The investigation reported in this paper focuses on understanding the synergistic effect of such parameters, namely contamination, humidity, PCB surface finish, pitch distance, and potential bias on leakage current under different humidity levels, and electrochemical migration probability under condensing conditions. Leakage currents were measured on interdigitated comb test patterns with three different types of surface finish typically used in the electronics industry, namely gold, copper, and tin. Susceptibility to electrochemical migration was studied under droplet conditions. The level of base leakage current (BLC) was similar for the different surface finishes and NaCl contamination levels up to relative humidity (RH) of 65%. A significant increase in leakage current was found for comb patterns contaminated with NaCl above 70% to 75% RH, close to the deliquescent RH of NaCl. Droplet tests on Cu comb patterns with varying pitch size showed that the initial BLC before dendrite formation increased with increasing NaCl contamination level, whereas electrochemical migration and the frequency of dendrite formation increased with bias voltage. The effect of different surface finishes on leakage current under humid conditions was not very prominent.

Experimental results on the influence of fluxes on partial discharge onset in PCB solder joints

NASA Astrophysics Data System (ADS)

Bulletti, Andrea; Capineri, Lorenzo; Materassi, Maurizio

2003-09-01

This work concerns the development of an experimental set-up for assessing the influence of fluxes on Partial Discharge (PD) onset in High Voltage (HV) devices soldered on Printed Circuit Boards (PCBs). In particular, the work considered the effects of three types of fluxes chosen in agreement with the directions of the Materials and Processes Division at ESA/ESTEC. Contaminated samples are formed by a standard FR-4 PCB board with a pair of copper electrodes and a protocol of contamination has been applied for all samples. The measuring system is placed inside a shielded chamber and provides measurements of Corona Inception Voltage (CIV), Corona Extinction Voltage (CEV) and PD amplitudes collected in a vacuum chamber with controlled temperature fixture. The results shows that flux Alpha 850-33 has the mean CIV smaller than other types of fluxes and the same result is observed for the mean CEV. Also the PD amplitudes are greater for samples contaminated with flux Alpha 850-33 than the other two types and similar in value for samples without flux.

Effects of particle size of fiberglass-resin powder from PCBs on the properties and volatile behavior of phenolic molding compound.

PubMed

Guo, Jie; Rao, Qunli; Xu, Zhenming

2010-03-15

Fiberglass-resin powder (FR powder), a mixture of resin powder and glass fibers reclaimed from pulverized waste printed circuit boards (PCBs), is used as a partial substitute of wood flour in the production of modified phenolic molding compound (MPMC). The results show that incorporation of FR powder into MPMC as a filler enhances the thermal stability represented by heat deflection temperature (HDT). MPMC with FR powder smaller than 0.07 mm shows better properties, with a flexural strength of 73 MPa, a charpy notched impact strength of 3.0 kJ/m(2), a HDT of 167 degrees C, and a dielectric strength of 3.7 MV/m, all of which meet the standard data. Thermogravimetric analysis shows that thermal degradation of MPMC mainly includes three steps, and over 55% weight loss of MPMC occurs between temperatures of 370 degrees C and 575 degrees C. Phenol is the main volatile compound released from molding powder during the production of molding product. After molding powder cures to molding product, low level of residual phenol is detected. All the results indicate that the MPMC can be used as a new type of molding compound. (c) 2009 Elsevier B.V. All rights reserved.

A device-specific prioritization strategy based on the potential for harm to human health in informal WEEE recycling.

PubMed

Cesaro, Alessandra; Belgiorno, Vincenzo; Vaccari, Mentore; Jandric, Aleksander; Chung, Tran Duc; Dias, Maria Isabel; Hursthouse, Andrew; Salhofer, Stefan

2018-01-01

In developing countries, the recovery of valuable materials from Waste Electrical and Electronic Equipment (WEEE) is carried out via uncontrolled practices, posing potentially severe risks both to human health and the environment. The assessment of the risk, which depends on both the kind and hazardous properties of the substances contained in WEEE, is currently limited as the exposure scenario for the single informal practice cannot be fully characterized for this purpose. In this context, this work proposes and evaluates a strategy to identify the relative potential harm of different kinds of WEEE by their content in metals, selected as the target substances of concern. This was based on the individual metal content, primarily located in the printed circuit boards (PCBs) of the different devices. The metal composition of the individual PCBs was identified and the dominant unregulated metal recovery practices were reviewed to identify the most suitable parameter to express the toxicity of these metals. Based on a mass-normalized cumulative toxicity, via the inhalation route, individual components were assessed from compositional variation found in the literature. The results is a semiquantitative ranking of individual components, revealing significant differences in potential harm posed by different electronic appliances and an opportunity to provide prioritization strategies in future management.

Power converter using near-load output capacitance, direct inductor contact, and/or remote current sense

DOE Office of Scientific and Technical Information (OSTI.GOV)

Coteus, Paul W.; Ferencz, Andrew; Hall, Shawn A.

An apparatus includes a first circuit board including first components including a load, and a second circuit board including second components including switching power devices and an output inductor. Ground and output voltage contacts between the circuit boards are made through soldered or connectorized interfaces. Certain components on the first circuit board and certain components, including the output inductor, on the second circuit board act as a DC-DC voltage converter for the load. An output capacitance for the conversion is on the first circuit board with no board-to-board interface between the output capacitance and the load. The inductance of themore » board-to-board interface functions as part of the output inductor's inductance and not as a parasitic inductance. Sense components for sensing current through the output inductor are located on the first circuit board. Parasitic inductance of the board-to-board interface has less effect on a sense signal provided to a controller.« less

Concentration of precious metals during their recovery from electronic waste.

PubMed

Cayumil, R; Khanna, R; Rajarao, R; Mukherjee, P S; Sahajwalla, V

2016-11-01

The rapid growth of electronic devices, their subsequent obsolescence and disposal has resulted in electronic waste (e-waste) being one of the fastest increasing waste streams worldwide. The main component of e-waste is printed circuit boards (PCBs), which contain substantial quantities of precious metals in concentrations significantly higher than those typically found in corresponding ores. The high value and limited reserves of minerals containing these metals makes urban mining of precious metals very attractive. This article is focused on the concentration and recovery of precious metals during pyro-metallurgical recycling of waste PCBs. High temperature pyrolysis was carried out for ten minutes in a horizontal tube furnace in the temperature range 800-1350°C under Argon gas flowing at 1L/min. These temperatures were chosen to lie below and above the melting point (1084.87°C) of copper, the main metal in PCBs, to study the influence of its physical state on the recovery of precious metals. The heat treatment of waste PCBs resulted in two different types of solid products, namely a carbonaceous non-metallic fraction (NMFs) and metallic products, composed of copper rich foils and/or droplets and tin-lead rich droplets and some wires. Significant proportions of Ag, Au, Pd and Pt were found concentrated within two types of metallic phases, with very limited quantities retained by the NMFs. This process was successful in concentrating several precious metals such as Ag, Au, Pd and Pt in a small volume fraction, and reduced volumes for further processing/refinement by up to 75%. The amounts of secondary wastes produced were also minimised to a great extent. The generation of precious metals rich metallic phases demonstrates high temperature pyrolysis as a viable approach towards the recovery of precious metals from e-waste. Copyright © 2015 Elsevier Ltd. All rights reserved.

Recycling of WEEE: characterization of spent printed circuit boards from mobile phones and computers.

PubMed

Yamane, Luciana Harue; de Moraes, Viviane Tavares; Espinosa, Denise Crocce Romano; Tenório, Jorge Alberto Soares

2011-12-01

This paper presents a comparison between printed circuit boards from computers and mobile phones. Since printed circuits boards are becoming more complex and smaller, the amount of materials is constantly changing. The main objective of this work was to characterize spent printed circuit boards from computers and mobile phones applying mineral processing technique to separate the metal, ceramic, and polymer fractions. The processing was performed by comminution in a hammer mill, followed by particle size analysis, and by magnetic and electrostatic separation. Aqua regia leaching, loss-on-ignition and chemical analysis (inductively coupled plasma atomic emission spectroscopy - ICP-OES) were carried out to determine the composition of printed circuit boards and the metal rich fraction. The composition of the studied mobile phones printed circuit boards (PCB-MP) was 63 wt.% metals; 24 wt.% ceramics and 13 wt.% polymers; and of the printed circuit boards from studied personal computers (PCB-PC) was 45 wt.% metals; 27 wt.% polymers and ceramics 28 wt.% ceramics. The chemical analysis showed that copper concentration in printed circuit boards from personal computers was 20 wt.% and in printed circuit boards from mobile phones was 34.5 wt.%. According to the characteristics of each type of printed circuit board, the recovery of precious metals may be the main goal of the recycling process of printed circuit boards from personal computers and the recovery of copper should be the main goal of the recycling process of printed circuit boards from mobile phones. Hence, these printed circuit boards would not be mixed prior treatment. The results of this paper show that copper concentration is increasing in mobile phones and remaining constant in personal computers. Copyright © 2011 Elsevier Ltd. All rights reserved.

Recycling of WEEE: Characterization of spent printed circuit boards from mobile phones and computers

DOE Office of Scientific and Technical Information (OSTI.GOV)

Yamane, Luciana Harue, E-mail: lucianayamane@uol.com.br; Tavares de Moraes, Viviane, E-mail: tavares.vivi@gmail.com; Crocce Romano Espinosa, Denise, E-mail: espinosa@usp.br

Highlights: > This paper presents new and important data on characterization of wastes of electric and electronic equipments. > Copper concentration is increasing in mobile phones and remaining constant in personal computers. > Printed circuit boards from mobile phones and computers would not be mixed prior treatment. - Abstract: This paper presents a comparison between printed circuit boards from computers and mobile phones. Since printed circuits boards are becoming more complex and smaller, the amount of materials is constantly changing. The main objective of this work was to characterize spent printed circuit boards from computers and mobile phones applying mineralmore » processing technique to separate the metal, ceramic, and polymer fractions. The processing was performed by comminution in a hammer mill, followed by particle size analysis, and by magnetic and electrostatic separation. Aqua regia leaching, loss-on-ignition and chemical analysis (inductively coupled plasma atomic emission spectroscopy - ICP-OES) were carried out to determine the composition of printed circuit boards and the metal rich fraction. The composition of the studied mobile phones printed circuit boards (PCB-MP) was 63 wt.% metals; 24 wt.% ceramics and 13 wt.% polymers; and of the printed circuit boards from studied personal computers (PCB-PC) was 45 wt.% metals; 27 wt.% polymers and ceramics 28 wt.% ceramics. The chemical analysis showed that copper concentration in printed circuit boards from personal computers was 20 wt.% and in printed circuit boards from mobile phones was 34.5 wt.%. According to the characteristics of each type of printed circuit board, the recovery of precious metals may be the main goal of the recycling process of printed circuit boards from personal computers and the recovery of copper should be the main goal of the recycling process of printed circuit boards from mobile phones. Hence, these printed circuit boards would not be mixed prior treatment. The results of this paper show that copper concentration is increasing in mobile phones and remaining constant in personal computers.« less

Pollutant emissions during pyrolysis and combustion of waste printed circuit boards, before and after metal removal.

PubMed

Ortuño, Nuria; Conesa, Juan A; Moltó, Julia; Font, Rafael

2014-11-15

The constant increase in the production of electronic devices implies the need for an appropriate management of a growing number of waste electrical and electronic equipment. Thermal treatments represent an interesting alternative to recycle this kind of waste, but particular attention has to be paid to the potential emissions of toxic by-products. In this study, the emissions from thermal degradation of printed circuit boards (with and without metals) have been studied using a laboratory scale reactor, under oxidizing and inert atmosphere at 600 and 850 °C. Apart from carbon oxides, HBr was the main decomposition product, followed by high amounts of methane, ethylene, propylene, phenol and benzene. The maximum formation of PAHs was found in pyrolysis at 850 °C, naphthalene being the most abundant. High levels of 2-, 4-, 2,4-, 2,6- and 2,4,6-bromophenols were found, especially at 600 °C. Emissions of PCDD/Fs and dioxin-like PCBs were quite low and much lower than that of PBDD/Fs, due to the higher bromine content of the samples. Combustion at 600 °C was the run with the highest PBDD/F formation: the total content of eleven 2,3,7,8-substituted congeners (tetra- through heptaBDD/Fs) was 7240 and 3250 ng WHO2005-TEQ/kg sample, corresponding to the sample with and without metals, respectively. Copyright © 2014 Elsevier B.V. All rights reserved.

High density printed electrical circuit board card connection system

DOEpatents

Baumbaugh, Alan E.

1997-01-01

A zero insertion/extraction force printed circuit board card connection system comprises a cam-operated locking mechanism disposed along an edge portion of the printed circuit board. The extrusions along the circuit board mate with an extrusion fixed to the card cage having a plurality of electrical connectors. The card connection system allows the connectors to be held away from the circuit board during insertion/extraction and provides a constant mating force once the circuit board is positioned. The card connection system provides a simple solution to the need for a greater number of electrical signal connections.

Electronic inverter assembly

DOE Office of Scientific and Technical Information (OSTI.GOV)

Singh, Brij N.; Schmit, Christopher J.

A first driver portion comprises a set of first components mounted on or associated with a first circuit board. A second circuit board is spaced apart from the first circuit board. A second driver portion comprises a set of second components mounted on or associated with the second circuit board, where the first driver portion and the second driver portion collectively are adapted to provide input signals to the control terminal of each semiconductor switch of an inverter. A first edge connector is mounted on the first circuit board. A second edge connector is mounted on the second circuit board.more » An interface board has mating edges that mate with the first edge connector and the second edge connector.« less

Physically separating printed circuit boards with a resilient, conductive contact

NASA Technical Reports Server (NTRS)

Baker, John D. (Inventor); Montalvo, Alberto (Inventor)

1999-01-01

A multi-board module provides high density electronic packaging in which multiple printed circuit boards are stacked. Electrical power, or signals, are conducted between the boards through a resilient contact. One end of the contact is located at a via in the lower circuit board and soldered to a pad near the via. The top surface of the contact rests against a via of the facing printed circuit board.

Improving Heat Transfer Performance of Printed Circuit Boards

NASA Technical Reports Server (NTRS)

Schatzel, Donald V.

2009-01-01

This paper will explore the ability of printed circuit boards laminated with a Carbon Core Laminate to transfer heat vs. standard printed circuit boards that use only thick layers of copper. The paper will compare the differences in heat transfer performance of printed circuit boards with and without CCL.

Printed wiring board system programmer's manual

NASA Technical Reports Server (NTRS)

Brinkerhoff, C. D.

1973-01-01

The printed wiring board system provides automated techniques for the design of printed circuit boards and hybrid circuit boards. The system consists of four programs: (1) the preprocessor program combines user supplied data and pre-defined library data to produce the detailed circuit description data; (2) the placement program assigns circuit components to specific areas of the board in a manner that optimizes the total interconnection length of the circuit; (3) the organizer program assigns pin interconnections to specific board levels and determines the optimal order in which the router program should attempt to layout the paths connecting the pins; and (4) the router program determines the wire paths which are to be used to connect each input pin pair on the circuit board. This document is intended to serve as a programmer's reference manual for the printed wiring board system. A detailed description of the internal logic and flow of the printed wiring board programs is included.

Biomedical Implementation of Liquid Metal Ink as Drawable ECG Electrode and Skin Circuit

PubMed Central

Yu, Yang; Zhang, Jie; Liu, Jing

2013-01-01

Background Conventional ways of making bio-electrodes are generally complicated, expensive and unconformable. Here we describe for the first time the method of applying Ga-based liquid metal ink as drawable electrocardiogram (ECG) electrodes. Such material owns unique merits in both liquid phase conformability and high electrical conductivity, which provides flexible ways for making electrical circuits on skin surface and a prospective substitution of conventional rigid printed circuit boards (PCBs). Methods Fundamental measurements of impedance and polarization voltage of the liquid metal ink were carried out to evaluate its basic electrical properties. Conceptual experiments were performed to draw the alloy as bio-electrodes to acquire ECG signals from both rabbit and human via a wireless module developed on the mobile phone. Further, a typical electrical circuit was drawn in the palm with the ink to demonstrate its potential of implementing more sophisticated skin circuits. Results With an oxide concentration of 0.34%, the resistivity of the liquid metal ink was measured as 44.1 µΩ·cm with quite low reactance in the form of straight line. Its peak polarization voltage with the physiological saline was detected as −0.73 V. The quality of ECG wave detected from the liquid metal electrodes was found as good as that of conventional electrodes, from both rabbit and human experiments. In addition, the circuit drawn with the liquid metal ink in the palm also runs efficiently. When the loop was switched on, all the light emitting diodes (LEDs) were lit and emitted colorful lights. Conclusions The liquid metal ink promises unique printable electrical properties as both bio-electrodes and electrical wires. The implemented ECG measurement on biological surface and the successfully run skin circuit demonstrated the conformability and attachment of the liquid metal. The present method is expected to innovate future physiological measurement and biological circuit manufacturing technique in a large extent. PMID:23472220

Biomedical implementation of liquid metal ink as drawable ECG electrode and skin circuit.

PubMed

Yu, Yang; Zhang, Jie; Liu, Jing

2013-01-01

Conventional ways of making bio-electrodes are generally complicated, expensive and unconformable. Here we describe for the first time the method of applying Ga-based liquid metal ink as drawable electrocardiogram (ECG) electrodes. Such material owns unique merits in both liquid phase conformability and high electrical conductivity, which provides flexible ways for making electrical circuits on skin surface and a prospective substitution of conventional rigid printed circuit boards (PCBs). Fundamental measurements of impedance and polarization voltage of the liquid metal ink were carried out to evaluate its basic electrical properties. Conceptual experiments were performed to draw the alloy as bio-electrodes to acquire ECG signals from both rabbit and human via a wireless module developed on the mobile phone. Further, a typical electrical circuit was drawn in the palm with the ink to demonstrate its potential of implementing more sophisticated skin circuits. With an oxide concentration of 0.34%, the resistivity of the liquid metal ink was measured as 44.1 µΩ·cm with quite low reactance in the form of straight line. Its peak polarization voltage with the physiological saline was detected as -0.73 V. The quality of ECG wave detected from the liquid metal electrodes was found as good as that of conventional electrodes, from both rabbit and human experiments. In addition, the circuit drawn with the liquid metal ink in the palm also runs efficiently. When the loop was switched on, all the light emitting diodes (LEDs) were lit and emitted colorful lights. The liquid metal ink promises unique printable electrical properties as both bio-electrodes and electrical wires. The implemented ECG measurement on biological surface and the successfully run skin circuit demonstrated the conformability and attachment of the liquid metal. The present method is expected to innovate future physiological measurement and biological circuit manufacturing technique in a large extent.

Apparatus And Method Of Using Flexible Printed Circuit Board In Optical Transceiver Device

DOEpatents

Anderson, Gene R.; Armendariz, Marcelino G.; Bryan, Robert P.; Carson, Richard F.; Duckett, III, Edwin B.; McCormick, Frederick B.; Peterson, David W.; Peterson, Gary D.; Reysen, Bill H.

2005-03-15

This invention relates to a flexible printed circuit board that is used in connection with an optical transmitter, receiver or transceiver module. In one embodiment, the flexible printed circuit board has flexible metal layers in between flexible insulating layers, and the circuit board comprises: (1) a main body region orientated in a first direction having at least one electrical or optoelectronic device; (2) a plurality of electrical contact pads integrated into the main body region, where the electrical contact pads function to connect the flexible printed circuit board to an external environment; (3) a buckle region extending from one end of the main body region; and (4) a head region extending from one end of the buckle region, and where the head region is orientated so that it is at an angle relative to the direction of the main body region. The electrical contact pads may be ball grid arrays, solder balls or land-grid arrays, and they function to connect the circuit board to an external environment. A driver or amplifier chip may be adapted to the head region of the flexible printed circuit board. In another embodiment, a heat spreader passes along a surface of the head region of the flexible printed circuit board, and a window is formed in the head region of the flexible printed circuit board. Optoelectronic devices are adapted to the head spreader in such a manner that they are accessible through the window in the flexible printed circuit board.

29 CFR 1915.181 - Electrical circuits and distribution boards.

Code of Federal Regulations, 2010 CFR

2010-07-01

... 29 Labor 7 2010-07-01 2010-07-01 false Electrical circuits and distribution boards. 1915.181... Electrical Machinery § 1915.181 Electrical circuits and distribution boards. (a) The provisions of this... employee is permitted to work on an electrical circuit, except when the circuit must remain energized for...

Device serves as hinge and electrical connector for circuit boards

NASA Technical Reports Server (NTRS)

Bethel, P. G.; Harris, G. G.

1966-01-01

Hinge makes both sides of electrical circuit boards readily accessible for component checkout and servicing. The hinge permits mounting of two circuit boards and incorporates connectors to maintain continuous electrical contact between the components on both boards.

Experimental study on the heat transfer characteristics of waste printed circuit boards pyrolysis.

PubMed

Ma, Hongting; Du, Na; Lin, Xueyin; Li, Chen; Lai, Junwen; Li, Zihao

2018-08-15

In order to study the appropriate and advanced technology for recycling waste printed circuit boards (PCBs), a fixed bed pyrolysis device with stirring function has been designed and developed. The effect of rotating speed on the temperature distribution and mass change in the pyrolysis process of FR-4 PCB has been analyzed. The heat transfer and pyrolysis characteristics of different granular layers with and without stirring have been investigated. The results indicate that the stirring can change the main way of heat transfer from conduction to convection in the PCB layers. As the increase of rotating speed, the temperature rising rate of material at the bottom of the pyrolysis furnace gradually decreases, while the heating rate is increasing at the upper layer, and the temperature difference between the upper and bottom layers is gradually reduced. When the rotating speed varies from 0r/min to 18r/min, the weight loss of the material increases from 3.97% to 6.76%, and the overall pyrolysis degree is improved. During the pyrolysis process, the material layer can be divided into three zones along the vertical direction, namely complete pyrolysis zone, partial pyrolysis zone and non-pyrolysis zone. As the rotating speed is 0r/min, the thickness of each zones is 6cm, 6cm and 3cm, respectively. However, when the rotating speed is increased to 18r/min, the non-pyrolysis zone disappears, and the thickness of complete pyrolysis zone and partial pyrolysis zone increase to 9cm and 6cm, respectively. Copyright © 2018 Elsevier B.V. All rights reserved.

Exhaust constituent emission factors of printed circuit board pyrolysis processes and its exhaust control.

PubMed

Chiang, Hung-Lung; Lin, Kuo-Hsiung

2014-01-15

The printed circuit board (PCB) is an important part of electrical and electronic equipment, and its disposal and the recovery of useful materials from waste PCBs (WPCBs) are key issues for waste electrical and electronic equipment. Waste PCB compositions and their pyrolysis characteristics were analyzed in this study. In addition, the volatile organic compound (VOC) exhaust was controlled by an iron-impregnated alumina oxide catalyst. Results indicated that carbon and oxygen were the dominant components (hundreds mg/g) of the raw materials, and other elements such as nitrogen, bromine, and copper were several decades mg/g. Exhaust constituents of CO, H2, CH4, CO2, and NOx, were 60-115, 0.4-4.0, 1.1-10, 30-95, and 0-0.7mg/g, corresponding to temperatures ranging from 200 to 500°C. When the pyrolysis temperature was lower than 300°C, aromatics and paraffins were the major species, contributing 90% of ozone precursor VOCs, and an increase in the pyrolysis temperature corresponded to a decrease in the fraction of aromatic emission factors. Methanol, ethylacetate, acetone, dichloromethane, tetrachloromethane and acrylonitrile were the main species of oxygenated and chlorinated VOCs. The emission factors of some brominated compounds, i.e., bromoform, bromophenol, and dibromophenol, were higher at temperatures over 400°C. When VOC exhaust was flowed through the bed of Fe-impregnated Al2O3, the emission of ozone precursor VOCs could be reduced by 70-80%. Copyright © 2013 Elsevier B.V. All rights reserved.

Localized radio frequency communication using asynchronous transfer mode protocol

DOEpatents

Witzke, Edward L [Edgewood, NM; Robertson, Perry J [Albuquerque, NM; Pierson, Lyndon G [Albuquerque, NM

2007-08-14

A localized wireless communication system for communication between a plurality of circuit boards, and between electronic components on the circuit boards. Transceivers are located on each circuit board and electronic component. The transceivers communicate with one another over spread spectrum radio frequencies. An asynchronous transfer mode protocol controls communication flow with asynchronous transfer mode switches located on the circuit boards.

Packaging Of Control Circuits In A Robot Arm

NASA Technical Reports Server (NTRS)

Kast, William

1994-01-01

Packaging system houses and connects control circuitry mounted on circuit boards within shoulder, upper section, and lower section of seven-degree-of-freedom robot arm. Has modular design that incorporates surface-mount technology, multilayer circuit boards, large-scale integrated circuits, and multi-layer flat cables between sections for compactness. Three sections of robot arm contain circuit modules in form of stardardized circuit boards. Each module contains two printed-circuit cards, one of each face.

High density electrical card connector system

DOEpatents

Haggard, J. Eric; Trotter, Garrett R.

2000-01-01

An electrical circuit board card connection system is disclosed which comprises a wedge-operated locking mechanism disposed along an edge portion of the printed circuit board. An extrusion along the edge of the circuit board mates with an extrusion fixed to the card cage having a plurality of electrical connectors. The connection system allows the connectors to be held away from the circuit board during insertion/extraction and provides a constant mating force once the circuit board is positioned and the wedge inserted. The disclosed connection system is a simple solution to the need for a greater number of electrical signal connections.

Sampling and Control Circuit Board for an Inertial Measurement Unit

NASA Technical Reports Server (NTRS)

Chelmins, David T (Inventor); Sands, Obed (Inventor); Powis, Richard T., Jr. (Inventor)

2016-01-01

A circuit board that serves as a control and sampling interface to an inertial measurement unit ("IMU") is provided. The circuit board is also configured to interface with a local oscillator and an external trigger pulse. The circuit board is further configured to receive the external trigger pulse from an external source that time aligns the local oscillator and initiates sampling of the inertial measurement device for data at precise time intervals based on pulses from the local oscillator. The sampled data may be synchronized by the circuit board with other sensors of a navigation system via the trigger pulse.

Mechanically-reattachable liquid-cooled cooling apparatus

DOEpatents

Arney, Susanne; Cheng, Jen-Hau; Kolodner, Paul R; Kota-Venkata, Krishna-Murty; Scofield, William; Salamon, Todd R; Simon, Maria E

2013-09-24

An apparatus comprising a rack having a row of shelves, each shelf supporting an electronics circuit board, each one of the circuit boards being manually removable from the shelve supporting the one of the circuit boards and having a local heat source thereon. The apparatus also comprises a cooler attached to the rack and being able to circulate a cooling fluid around a channel forming a closed loop. The apparatus further comprises a plurality of heat conduits, each heat conduit being located over a corresponding one of the circuit boards and forming a path to transport heat from the local heat source of the corresponding one of the circuit boards to the cooler. Each heat conduit is configured to be manually detachable from the cooler or the circuit board, without breaking a circulation pathway of the fluid through the cooler.

Developing 300°C Ceramic Circuit Boards

DOE Office of Scientific and Technical Information (OSTI.GOV)

Normann, Randy A

2015-02-15

This paper covers the development of a geothermal ceramic circuit board technology using 3D traces in a machinable ceramic. Test results showing the circuit board to be operational to at least 550°C. Discussion on producing this type of board is outlined along with areas needing improvement.

47 CFR 15.32 - Test procedures for CPU boards and computer power supplies.

Code of Federal Regulations, 2011 CFR

2011-10-01

... result in a complete personal computer system. If the oscillator and the microprocessor circuits are... microprocessor circuits are contained on separate circuit boards, both boards, typical of the combination that...

47 CFR 15.32 - Test procedures for CPU boards and computer power supplies.

Code of Federal Regulations, 2013 CFR

2013-10-01

... result in a complete personal computer system. If the oscillator and the microprocessor circuits are... microprocessor circuits are contained on separate circuit boards, both boards, typical of the combination that...

47 CFR 15.32 - Test procedures for CPU boards and computer power supplies.

Code of Federal Regulations, 2014 CFR

2014-10-01

... result in a complete personal computer system. If the oscillator and the microprocessor circuits are... microprocessor circuits are contained on separate circuit boards, both boards, typical of the combination that...

47 CFR 15.32 - Test procedures for CPU boards and computer power supplies.

Code of Federal Regulations, 2012 CFR

2012-10-01

... result in a complete personal computer system. If the oscillator and the microprocessor circuits are... microprocessor circuits are contained on separate circuit boards, both boards, typical of the combination that...

47 CFR 15.32 - Test procedures for CPU boards and computer power supplies.

Code of Federal Regulations, 2010 CFR

2010-10-01

... result in a complete personal computer system. If the oscillator and the microprocessor circuits are... microprocessor circuits are contained on separate circuit boards, both boards, typical of the combination that...

Microchannel cooling of face down bonded chips

DOEpatents

Bernhardt, Anthony F.

1993-01-01

Microchannel cooling is applied to flip-chip bonded integrated circuits, in a manner which maintains the advantages of flip-chip bonds, while overcoming the difficulties encountered in cooling the chips. The technique is suited to either multichip integrated circuit boards in a plane, or to stacks of circuit boards in a three dimensional interconnect structure. Integrated circuit chips are mounted on a circuit board using flip-chip or control collapse bonds. A microchannel structure is essentially permanently coupled with the back of the chip. A coolant delivery manifold delivers coolant to the microchannel structure, and a seal consisting of a compressible elastomer is provided between the coolant delivery manifold and the microchannel structure. The integrated circuit chip and microchannel structure are connected together to form a replaceable integrated circuit module which can be easily decoupled from the coolant delivery manifold and the circuit board. The coolant supply manifolds may be disposed between the circuit boards in a stack and coupled to supplies of coolant through a side of the stack.

Microchannel cooling of face down bonded chips

DOEpatents

Bernhardt, A.F.

1993-06-08

Microchannel cooling is applied to flip-chip bonded integrated circuits, in a manner which maintains the advantages of flip-chip bonds, while overcoming the difficulties encountered in cooling the chips. The technique is suited to either multi chip integrated circuit boards in a plane, or to stacks of circuit boards in a three dimensional interconnect structure. Integrated circuit chips are mounted on a circuit board using flip-chip or control collapse bonds. A microchannel structure is essentially permanently coupled with the back of the chip. A coolant delivery manifold delivers coolant to the microchannel structure, and a seal consisting of a compressible elastomer is provided between the coolant delivery manifold and the microchannel structure. The integrated circuit chip and microchannel structure are connected together to form a replaceable integrated circuit module which can be easily decoupled from the coolant delivery manifold and the circuit board. The coolant supply manifolds may be disposed between the circuit boards in a stack and coupled to supplies of coolant through a side of the stack.

Characterization of CNRS Fizeau wedge laser tuner

DOE Office of Scientific and Technical Information (OSTI.GOV)

Not Available

A fringe detection and measurement system was constructed for use with the CNRS Fizeau wedge laser tuner, consisting of three circuit boards. The first board is a standard Reticon RC-100 B motherboard which is used to provide the timing, video processing, and housekeeping functions required by the Reticon RL-512 G photodiode array used in the system. The sampled and held video signal from the motherboard is processed by a second, custom-fabricated circuit board which contains a high-speed fringe detection and locating circuit. This board includes a dc level-discriminator-type fringe detector, a counter circuit to determine fringe center, a pulsed lasermore » triggering circuit, and a control circuit to operate the shutter for the He-Ne reference laser beam. The fringe center information is supplied to the third board, a commercial single board computer, which governs the data-collection process and interprets the results.« less

Characterization of CNRS Fizeau wedge laser tuner

NASA Technical Reports Server (NTRS)

1984-01-01

A fringe detection and measurement system was constructed for use with the CNRS Fizeau wedge laser tuner, consisting of three circuit boards. The first board is a standard Reticon RC-100 B motherboard which is used to provide the timing, video processing, and housekeeping functions required by the Reticon RL-512 G photodiode array used in the system. The sampled and held video signal from the motherboard is processed by a second, custom fabricated circuit board which contains a high speed fringe detection and locating circuit. This board includes a dc level discriminator type fringe detector, a counter circuit to determine fringe center, a pulsed laser triggering circuit, and a control circuit to operate the shutter for the He-Ne reference laser beam. The fringe center information is supplied to the third board, a commercial single board computer, which governs the data collection process and interprets the results.

Protective Socket For Integrated Circuits

NASA Technical Reports Server (NTRS)

Wilkinson, Chris; Henegar, Greg

1988-01-01

Socket for intergrated circuits (IC's) protects from excessive voltages and currents or from application of voltages and currents in wrong sequence during insertion or removal. Contains built-in switch that opens as IC removed, disconnecting leads from signals and power. Also protects other components on circuit board from transients produced by insertion and removal of IC. Makes unnecessary to turn off power to entire circuit board so other circuits on board continue to function.

Evaluating waste printed circuit boards recycling: Opportunities and challenges, a mini review.

PubMed

Awasthi, Abhishek Kumar; Zlamparet, Gabriel Ionut; Zeng, Xianlai; Li, Jinhui

2017-04-01

Rapid generation of waste printed circuit boards has become a very serious issue worldwide. Numerous techniques have been developed in the last decade to resolve the pollution from waste printed circuit boards, and also recover valuable metals from the waste printed circuit boards stream on a large-scale. However, these techniques have their own certain specific drawbacks that need to be rectified properly. In this review article, these recycling technologies are evaluated based on a strength, weaknesses, opportunities and threats analysis. Furthermore, it is warranted that, the substantial research is required to improve the current technologies for waste printed circuit boards recycling in the outlook of large-scale applications.

Board Saver for Use with Developmental FPGAs

NASA Technical Reports Server (NTRS)

Berkun, Andrew

2009-01-01

A device denoted a board saver has been developed as a means of reducing wear and tear of a printed-circuit board onto which an antifuse field programmable gate array (FPGA) is to be eventually soldered permanently after a number of design iterations. The need for the board saver or a similar device arises because (1) antifuse-FPGA design iterations are common and (2) repeated soldering and unsoldering of FPGAs on the printed-circuit board to accommodate design iterations can wear out the printed-circuit board. The board saver is basically a solderable/unsolderable FPGA receptacle that is installed temporarily on the printed-circuit board. The board saver is, more specifically, a smaller, square-ring-shaped, printed-circuit board (see figure) that contains half via holes one for each contact pad along its periphery. As initially fabricated, the board saver is a wider ring containing full via holes, but then it is milled along its outer edges, cutting the via holes in half and laterally exposing their interiors. The board saver is positioned in registration with the designated FPGA footprint and each via hole is soldered to the outer portion of the corresponding FPGA contact pad on the first-mentioned printed-circuit board. The via-hole/contact joints can be inspected visually and can be easily unsoldered later. The square hole in the middle of the board saver is sized to accommodate the FPGA, and the thickness of the board saver is the same as that of the FPGA. Hence, when a non-final FPGA is placed in the square hole, the combination of the non-final FPGA and the board saver occupy no more area and thickness than would a final FPGA soldered directly into its designated position on the first-mentioned circuit board. The contact leads of a non-final FPGA are not bent and are soldered, at the top of the board saver, to the corresponding via holes. A non-final FPGA can readily be unsoldered from the board saver and replaced by another one. Once the final FPGA design has been determined, the board saver can be unsoldered from the contact pads on the first-mentioned printed-circuit board and replaced by the final FPGA.

Vibration analysis of printed circuit boards: Effect of boundary condition

NASA Astrophysics Data System (ADS)

Prashanth, M. D.

2018-04-01

A spacecraft consists of a number of electronic packages to meet the functional requirements. An electronic package is generally an assembly of printed circuit boards placed in a mechanical housing. A number of electronic components are mounted on the printed circuit board (PCB). A spacecraft experiences various types of loads during its launch such as vibration, acoustic and shock loads. Prediction of response for printed circuit boards due to vibration loads is important for mechanical design and reliability of electronic packages. The modeling and analysis of printed circuit boards is required for accurate prediction of response due to vibration loads. The response of PCB is highly dependent on the mounting configuration of PCB. In addition, anti-vibration mounts or stiffeners are used to reduce the PCB response. Vibration analysis of printed circuit boards is carried out using finite element method. The objective of this paper is to determine the dynamic characteristics of a printed circuit board. Modeling and analysis of PCB shall be carried out to study the effect of boundary conditions on the vibration response. The modeling of stiffeners or ribs shall also be considered in detail. The analysis results shall be validated using vibration tests of PCB.

Environmental impacts and benefits of state-of-the-art technologies for E-waste management.

PubMed

Ikhlayel, Mahdi

2017-10-01

This study aims to evaluate the environmental impacts and benefits of state-of-the-art technologies for proper e-waste handling using Jordan as a case study. Life Cycle Assessment (LCA) was employed to evaluate five advanced management systems represent state-of-the-art treatment technologies, including sanitary landfilling; proper recycling of metals, materials, and precious metals (PMs); and incineration of plastic and the hazardous portion of printed circuit boards (PCBs). Six e-waste products that contribute the most to the e-waste in Jordan were included in the assessment of each scenario, which resulted in 30 total cases of e-waste management. The findings indicated that landfills for the entire components of the e-waste stream are the worst option and should be avoided. The most promising e-waste management scenario features integrated e-waste processes based on the concept of Integrated Waste Management (IWM), including recycling materials such as non-PMs and PMs, incinerating plastic and the hazardous content of PCBs using the energy recovered from incineration, and using sanitary landfills of residues. For this scenario, the best environmental performance was obtained for the treatment of mobile phones. Incineration of the portion of hazardous waste using energy recovery is an option that deserves attention. Because scenario implementation depends on more than just the environmental benefits (e.g., economic cost and technical aspects), the study proposes a systematic approach founded on the IWM concept for e-waste management scenario selection. Copyright © 2017 Elsevier Ltd. All rights reserved.

Ultrasonic pulser-receiver

DOEpatents

Taylor, Steven C.

2006-09-12

Ultrasonic pulser-receiver circuitry, for use with an ultrasonic transducer, the circuitry comprising a circuit board; ultrasonic pulser circuitry supported by the circuit board and configured to be coupled to an ultrasonic transducer and to cause the ultrasonic transducer to emit an ultrasonic output pulse; receiver circuitry supported by the circuit board, coupled to the pulser circuitry, including protection circuitry configured to protect against the ultrasonic pulse and including amplifier circuitry configured to amplify an echo, received back by the transducer, of the output pulse; and a connector configured to couple the ultrasonic transducer directly to the circuit board, to the pulser circuitry and receiver circuitry, wherein impedance mismatches that would result if the transducer was coupled to the circuit board via a cable can be avoided.

Fixture aids soldering of electronic components on circuit board

NASA Technical Reports Server (NTRS)

Ross, M. H.

1966-01-01

Spring clamp fixture holds small electronic components in a desired position while they are being soldered on a circuit board. The spring clamp is clipped on the edge of the circuit board and an adjustable spring-steel boom holds components against the board. The felt pad at the end of the boom is replaced with different attachments for other holding tasks.

Copper sludge from printed circuit board production/recycling for ceramic materials: a quantitative analysis of copper transformation and immobilization.

PubMed

Tang, Yuanyuan; Lee, Po-Heng; Shih, Kaimin

2013-08-06

The fast development of electronic industries and stringent requirement of recycling waste electronics have produced a large amount of metal-containing waste sludge. This study developed a waste-to-resource strategy to beneficially use such metal-containing sludge from the production and recycling processes of printed circuit board (PCBs). To observe the metal incorporation mechanisms and phase transformation processes, mixtures of copper industrial waste sludge and kaolinite-based materials (kaolinite and mullite) were fired between 650 and 1250 °C for 3 h. The different copper-hosting phases were identified by powder X-ray diffraction (XRD) in the sintered products, and CuAl2O4 was found to be the predominant hosting phase throughout the reactions, regardless of the strong reduction potential of copper expected at high temperatures. The experimental results indicated that CuAl2O4 was generated more easily and in larger quantities at low-temperature processing when using the kaolinite precursor. Maximum copper transformations reached 86% and 97% for kaolinite and mullite systems, respectively, when sintering at 1000 °C. To monitor the stabilization effect after thermal process, prolonged leaching tests were carried out using acetic acid with an initial pH value of 2.9 to leach the sintered products for 20 days. The results demonstrated the decrease of copper leachability with the formation of CuAl2O4, despite different sintering behavior in kaolinite and mullite systems. This study clearly indicates spinel formation as the most crucial metal stabilization mechanism when sintering copper sludge with aluminosilicate materials, and suggests a promising and reliable technique for reusing metal-containing sludge as ceramic materials.

An innovative approach to predict technology evolution for the desoldering of printed circuit boards: A perspective from China and America.

PubMed

Wang, Chen; Zhao, Wu; Wang, Jie; Chen, Ling; Luo, Chun-Jing

2016-06-01

The printed circuit boards basis of electronic equipment have seen a rapid growth in recent years and played a significant role in modern life. Nowadays, the fact that electronic devices upgrade quickly necessitates a proper management of waste printed circuit boards. Non-destructive desoldering of waste printed circuit boards becomes the first and the most crucial step towards recycling electronic components. Owing to the diversity of materials and components, the separation process is difficult, which results in complex and expensive recovery of precious materials and electronic components from waste printed circuit boards. To cope with this problem, we proposed an innovative approach integrating Theory of Inventive Problem Solving (TRIZ) evolution theory and technology maturity mapping system to forecast the evolution trends of desoldering technology of waste printed circuit boards. This approach can be applied to analyse the technology evolution, as well as desoldering technology evolution, then research and development strategy and evolution laws can be recommended. As an example, the maturity of desoldering technology is analysed with a technology maturity mapping system model. What is more, desoldering methods in different stages are analysed and compared. According to the analysis, the technological evolution trends are predicted to be 'the law of energy conductivity' and 'increasing the degree of idealisation'. And the potential technology and evolutionary state of waste printed circuit boards are predicted, offering reference for future waste printed circuit boards recycling. © The Author(s) 2016.

Packaging Technologies for 500C SiC Electronics and Sensors

NASA Technical Reports Server (NTRS)

Chen, Liang-Yu

2013-01-01

Various SiC electronics and sensors are currently under development for applications in 500C high temperature environments such as hot sections of aerospace engines and the surface of Venus. In order to conduct long-term test and eventually commercialize these SiC devices, compatible packaging technologies for the SiC electronics and sensors are required. This presentation reviews packaging technologies developed for 500C SiC electronics and sensors to address both component and subsystem level packaging needs for high temperature environments. The packaging system for high temperature SiC electronics includes ceramic chip-level packages, ceramic printed circuit boards (PCBs), and edge-connectors. High temperature durable die-attach and precious metal wire-bonding are used in the chip-level packaging process. A high temperature sensor package is specifically designed to address high temperature micro-fabricated capacitive pressure sensors for high differential pressure environments. This presentation describes development of these electronics and sensor packaging technologies, including some testing results of SiC electronics and capacitive pressure sensors using these packaging technologies.

Three dimensional, multi-chip module

DOEpatents

Bernhardt, A.F.; Petersen, R.W.

1993-08-31

A plurality of multi-chip modules are stacked and bonded around the perimeter by sold-bump bonds to adjacent modules on, for instance, three sides of the perimeter. The fourth side can be used for coolant distribution, for more interconnect structures, or other features, depending on particular design considerations of the chip set. The multi-chip modules comprise a circuit board, having a planarized interconnect structure formed on a first major surface, and integrated circuit chips bonded to the planarized interconnect surface. Around the periphery of each circuit board, long, narrow dummy chips'' are bonded to the finished circuit board to form a perimeter wall. The wall is higher than any of the chips on the circuit board, so that the flat back surface of the board above will only touch the perimeter wall. Module-to-module interconnect is laser-patterned on the sides of the boards and over the perimeter wall in the same way and at the same time that chip to board interconnect may be laser-patterned.

Three dimensional, multi-chip module

DOEpatents

Bernhardt, Anthony F.; Petersen, Robert W.

1993-01-01

A plurality of multi-chip modules are stacked and bonded around the perimeter by sold-bump bonds to adjacent modules on, for instance, three sides of the perimeter. The fourth side can be used for coolant distribution, for more interconnect structures, or other features, depending on particular design considerations of the chip set. The multi-chip modules comprise a circuit board, having a planarized interconnect structure formed on a first major surface, and integrated circuit chips bonded to the planarized interconnect surface. Around the periphery of each circuit board, long, narrow "dummy chips" are bonded to the finished circuit board to form a perimeter wall. The wall is higher than any of the chips on the circuit board, so that the flat back surface of the board above will only touch the perimeter wall. Module-to-module interconnect is laser-patterned o the sides of the boards and over the perimeter wall in the same way and at the same time that chip to board interconnect may be laser-patterned.

PERSONAL COMPUTER MONITORS: A SCREENING EVALUATION OF VOLATILE ORGANIC EMISSIONS FROM EXISTING PRINTED CIRCUIT BOARD LAMINATES AND POTENTIAL POLLUTION PREVENTION ALTERNATIVES

EPA Science Inventory

The report gives results of a screening evaluation of volatile organic emissions from printed circuit board laminates and potential pollution prevention alternatives. In the evaluation, printed circuit board laminates, without circuitry, commonly found in personal computer (PC) m...

Aluminum heat sink enables power transistors to be mounted integrally with printed circuit board

NASA Technical Reports Server (NTRS)

Seaward, R. C.

1967-01-01

Power transistor is provided with an integral flat plate aluminum heat sink which mounts directly on a printed circuit board containing associated circuitry. Standoff spacers are used to attach the heat sink to the printed circuit board containing the remainder of the circuitry.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Fulkerson, Edward; Lanning, Rodney K.; Telford, Steven

A device includes a u-channel shaped member and a printed circuit board including a plurality of capacitors. Each of the plurality of capacitors has a mounting surface mounted to the printed circuit board and an opposing heat transfer surface thermally coupled to the u-channel shaped member. The device also includes an output cable coupled to the printed circuit board and a return cable coupled to the printed circuit board. The device further includes a control transistor disposed inside the u-channel shaped member and a current sensing resistor disposed inside the u-channel shaped member.

47 CFR 2.925 - Identification of equipment.

Code of Federal Regulations, 2014 CFR

2014-10-01

... sections assembled in a common enclosure, on a common chassis or circuit board, and with common frequency controlling circuits. Devices to which a single FCC Identifier has been assigned shall be identified pursuant... circuit boards with independent frequency controlling circuits. The FCC Identifier assigned to any...

47 CFR 2.925 - Identification of equipment.

Code of Federal Regulations, 2011 CFR

2011-10-01

... common chassis or circuit board, and with common frequency controlling circuits. Devices to which a... common enclosure, but constructed on separate sub-units or circuit boards with independent frequency controlling circuits. The FCC Identifier assigned to any transmitter section shall be preceded by the term TX...

47 CFR 2.925 - Identification of equipment.

Code of Federal Regulations, 2013 CFR

2013-10-01

... common chassis or circuit board, and with common frequency controlling circuits. Devices to which a... common enclosure, but constructed on separate sub-units or circuit boards with independent frequency controlling circuits. The FCC Identifier assigned to any transmitter section shall be preceded by the term TX...

47 CFR 2.925 - Identification of equipment.

Code of Federal Regulations, 2012 CFR

2012-10-01

... common chassis or circuit board, and with common frequency controlling circuits. Devices to which a... common enclosure, but constructed on separate sub-units or circuit boards with independent frequency controlling circuits. The FCC Identifier assigned to any transmitter section shall be preceded by the term TX...

47 CFR 2.925 - Identification of equipment.

Code of Federal Regulations, 2010 CFR

2010-10-01

... common chassis or circuit board, and with common frequency controlling circuits. Devices to which a... common enclosure, but constructed on separate sub-units or circuit boards with independent frequency controlling circuits. The FCC Identifier assigned to any transmitter section shall be preceded by the term TX...

Effects of Smoke on Functional Circuits

DTIC Science & Technology

1997-10-01

functional boards consisted of four layers ; that is, there were two pieces of FR-4* insulated circuit board material that were laminated together, each with...traces on both sides (three layers of dielectric in all). The layers were electrically connected by drilling holes into the circuit board and...allowing solder to flow through the holes and form "vias." For many of the circuits, one of the middle layers served as a ground plane, while the other

Fate of bromine in pyrolysis of printed circuit board wastes.

PubMed

Chien, Y C; Wang, H P; Lin, K S; Huang, Y J; Yang, Y W

2000-02-01

Behavior of Br in pyrolysis of the printed circuit board waste with valuable copper and oil recycling has been studied in the present work. Experimentally, pyrolysis of the printed circuit board waste generated approximately 40.6% of oils, 24.9% of noncondensible gases and 34.5% of solid residues that enriched in copper (90-95%). The cuts of the oils produced from pyrolysis of the printed circuit board waste into weighted boiling fraction were primarily light naphtha and heavy gas oil. Approximately 72.3% of total Br in the printed circuit board waste were found in product gas mainly as HBr and bromobenzene. However, by extended X-ray absorption fine structural (EXAFS) spectroscopy, Cu-O and Cu-(O)-Cu species with bond distance of 1.87 and 2.95 A, respectively, were observed in the solid residues. Essentially, no Cu-Br species was found.

Optical waveguide circuit board with a surface-mounted optical receiver array

NASA Astrophysics Data System (ADS)

Thomson, J. E.; Levesque, Harold; Savov, Emil; Horwitz, Fred; Booth, Bruce L.; Marchegiano, Joseph E.

1994-03-01

A photonic circuit board is fabricated for potential application to interchip and interboard parallel optical links. The board comprises photolithographically patterned polymer optical waveguides on a conventional glass-epoxy electrical circuit board and a surface-mounted integrated circuit (IC) package that optically and electrically couples to an optoelectronic IC. The waveguide circuits include eight-channel arrays of straights, cross-throughs, curves, self- aligning interconnects to multi-fiber ribbon, and out-of-plane turning mirrors. A coherent, fused bundle of optical fibers couples light between 45-deg waveguide mirrors and a GaAs receiver array in the IC package. The fiber bundle is easily aligned to the mirrors and the receivers and is amenable to surface mounting and hermetic sealing. The waveguide-receiver- array board achieved error-free data rates up to 1.25 Gbits/s per channel, and modal noise was shown to be negligible.

Packaging system with cleaning channel and method of making the same

DOE Office of Scientific and Technical Information (OSTI.GOV)

Fang, Lu

A packaging structure and method for surface mount integrated circuits reduces electrochemical migration (ECM) problems by including one or more cleaning channels to effectively and efficiently remove flux residue that may otherwise remain lodged in gaps between the surface mount package and the printed circuit board. A cleaning channel may be formed along a bottom surface of the surface mount package (i.e., the surface facing the printed circuit board), or along a portion of a top surface of the printed circuit board. In either case, the inclusion of a cleaning channel enlarges the gap between the bottom surface of themore » surface mount package and the printed circuit board and creates a path for contaminants to be flushed out during a cleaning process.« less

Image dissector control and data system electronics, part 1, part 2, and part 3

NASA Technical Reports Server (NTRS)

1975-01-01

The operating and calibration procedures, design details, and maintenance information for the control console and the associated electronics are presented. Detailed circuit connector information is included which describes the destination of each wire leaving each pin of each circuit board. The schematic diagrams of the circuit boards in the system and of the interconnection between boards and consoles are presented.

Method for Designing Electronic Assemblies without Potting for Gun Launched Applications Through the Use of Additive Manufacturing

DTIC Science & Technology

2016-12-01

easily would be preferred. Many studies have been conducted to model the effects of potting materials on PCBs and their components: two such studies ...catch (SCAT) gun Guidance electronics On -board recorder (OBR) Precision guided munition (PGM) 16. SECURITY CLASSIFICATION OF: 17... On -board Recorder 2 Initial Method - Modeling Assumptions 2 Initial Method - Parts, Instances, and Simplifications in the Model 3 Initial Method

Development of a highly reliable composite board for printed circuitry for use in space environment

NASA Technical Reports Server (NTRS)

Bradbury, E. J.; Markle, R. A.; Dunnavant, W. R.; Stickney, P. B.

1971-01-01

Materials, processes and fabrication techniques have been investigated for the development of a high-temperature circuit-board laminate. High quality, void-free copper-clad laminates have been made using 7628/HS-1 style fiberglas reinforcements with filled polyimide matrices. The fabricating characteristics of P13N resin appear suitable for use as a filled matrix in this circuit board development. High-fired, ball-milled alumina appears to be necessary to obtain the desired effects in the circuit board system. Nickel-clad copper foil bonding surfaces appear to be another requirement for retention of good bond strengths after art work and plating sequences. The fabrication cycle for this circuit board system is very dependent on the heating profile. Very rapid heating with quick loading is recommended. A stack approach to lamination was successfully used.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Scott, Jeffrey Wayne

An RFID backscatter interrogator for transmitting data to an RFID tag, generating a carrier for the tag, and receiving data from the tag modulated onto the carrier, the interrogator including a single grounded-coplanar wave-guide circuit board and at least one surface mount integrated circuit supported by the circuit board.

Circuit-lead trimming template

NASA Technical Reports Server (NTRS)

Ofarrell, K.; Winn, E.

1979-01-01

Template for use in trimming leads on production wiring boards is low-cost means for eliminating rejections for short leads and improving lead-strength uniformity. Template is simply unclad piece of printed-circuit board material that is drilled using same drill control tape used in making original production board. Revisions in component layout of board can therefore be made simultaneously in template.

Reliability Assessment of Critical Electronic Components

DTIC Science & Technology

1992-07-01

Failures FLHP - Full Horse Power FSN - Federal Stock Number I Current IC - Integrated Circuit IPB - Illustrated Parts Breakdown K - Boltzmans Constant L...Classified P - Power PC - Printed Circuit PCB - Printed Circuit Board PGA - Pin Grid Array PPM - Parts Per Million PWB - Printed Wiring Board 0...4-59 4.4.3.2.3 Circuit Brcakers ......................................................... 4-59 4.4.3.2.4 Thermal

Fluid Power Multi-actuator Circuit Board with Microcomputer Control Option.

ERIC Educational Resources Information Center

McKechnie, R. E.; Vickers, G. W.

1981-01-01

Describes a portable fluid power engineering laboratory and class demonstration apparatus designed to enable students to design, build, and test multi-actuator circuits. Features a variety of standard pneumatic values and actuators fitted with quick disconnect couplings. Discusses sequencing circuit boards, microcomputer control, cost, and…

Reducing Printed Circuit Board Emissions with Low-Noise Design Practices

NASA Technical Reports Server (NTRS)

Bradley, Arthur T.; Fowler, Jennifer; Yavoich, Brian J.; Jennings, Stephen A.

2012-01-01

This paper presents the results of an experiment designed to determine the effectiveness of adopting several low-noise printed circuit board (PCB) design practices. Two boards were designed and fabricated, each consisting of identical mixed signal circuitry. Several important differences were introduced between the board layouts: one board was constructed using recommended low-noise practices and the other constructed without such attention. The emissions from the two boards were then measured and compared, demonstrating an improvement in radiated emissions of up to 22 dB.

A Circuit Board Using a Sheet of Thick Paper and Aluminium Tape

ERIC Educational Resources Information Center

Kamata, Masahiro; Honda, Motoshi

2003-01-01

We have developed a circuit board using materials that are inexpensive and familiar to elementary school students. Most of the responses from students who made this board were relatively positive and we observed them enjoy making the boards at a Science Festival in Japan and in elementary school. As an application, we also developed a tiny torch…

Adaptable Transponder for Multiple Telemetry Systems

NASA Technical Reports Server (NTRS)

Sims, William Herbert, III (Inventor); Varnavas, Kosta A. (Inventor)

2014-01-01

The present invention is a stackable telemetry circuit board for use in telemetry systems for satellites and other purposes. The present invention incorporates previously-qualified interchangeable circuit boards, or "decks," that perform functions such as power, signal receiving and transmission, and processing. Each deck is adapted to serve a range of telemetry applications. This provides flexibility in the construction of the stackable telemetry circuit board and significantly reduces the cost and time necessary to develop a telemetry system.

Heat sinking for printed circuitry

DOEpatents

Wilson, S.K.; Richardson, G.; Pinkerton, A.L.

1984-09-11

A flat pak or other solid-state device mounted on a printed circuit board directly over a hole extends therethrough so that the bottom of the pak or device extends beyond the bottom of the circuit board. A heat sink disposed beneath the circuit board contacts the bottom of the pak or device and provides direct heat sinking thereto. Pressure may be applied to the top of the pak or device to assure good mechanical and thermal contact with the heat sink.

Degradation of organic pollutants by Ag, Cu and Sn doped waste non-metallic printed circuit boards.

PubMed

Ramaswamy, Kadari; Radha, Velchuri; Malathi, M; Vithal, Muga; Munirathnam, Nagegownivari R

2017-02-01

The disposal and reuse of waste printed circuit boards have been the major global concerns. Printed circuit boards, a form of Electronic waste (hereafter e-waste), have been chemically processed, doped with Ag + , Cu 2+ and Sn 2+ , and used as visible light photocatalysts against the degradation of methylene blue and methyl violet. The elemental analyses of pristine and metal doped printed circuit board were obtained using energy dispersive X-ray fluorescence (EDXRF) spectra and inductively coupled plasma optical emission spectroscopy (ICP-OES). The morphology of parent and doped printed circuit board was obtained from scanning electron microscopy (SEM) measurements. The photocatalytic activity of parent and metal doped samples was carried out for the decomposition of organic pollutants, methylene blue and methyl violet, under visible light irradiation. Metal doped waste printed circuit boards (WPCBs) have shown higher photocatalytic activity against the degradation of methyl violet and methylene blue under visible light irradiation. Scavenger experiments were performed to identify the reactive intermediates responsible for the degradation of methylene blue and methyl violet. The reactive species responsible for the degradation of MV and MB were found to be holes and hydroxyl radicals. A possible mechanism of degradation of methylene blue and methyl violet is given. The stability and reusability of the catalysts are also investigated. Copyright © 2016. Published by Elsevier Ltd.

Printed circuit board impedance matching step for microwave (millimeter wave) devices

DOEpatents

Pao, Hsueh-Yuan; Aguirre, Jerardo; Sargis, Paul

2013-10-01

An impedance matching ground plane step, in conjunction with a quarter wave transformer section, in a printed circuit board provides a broadband microwave matching transition from board connectors or other elements that require thin substrates to thick substrate (>quarter wavelength) broadband microwave (millimeter wave) devices. A method of constructing microwave and other high frequency electrical circuits on a substrate of uniform thickness, where the circuit is formed of a plurality of interconnected elements of different impedances that individually require substrates of different thicknesses, by providing a substrate of uniform thickness that is a composite or multilayered substrate; and forming a pattern of intermediate ground planes or impedance matching steps interconnected by vias located under various parts of the circuit where components of different impedances are located so that each part of the circuit has a ground plane substrate thickness that is optimum while the entire circuit is formed on a substrate of uniform thickness.

A Compact Cosmic Ray Telescope using Silicon Photomultipliers for use in High Schools

NASA Astrophysics Data System (ADS)

Castro, Luis; Elizondo, Leonardo; Shelor, Mark; Cervantes, Omar; Fan, Sewan; Ritt, Stefan

2016-03-01

Over the years, the QuarkNet and the LBL Cosmic Ray Project have helped trained thousands of high school students and teachers to explore cosmic ray physics. To get high school students in the Salinas, CA area also excited about cosmic rays, we constructed a cosmic ray telescope as a physics outreach apparatus. Our apparatus includes a pair of plastic scintillators coupled to silicon photomultipliers (SiPM) and a coincidence circuit board. We designed and constructed custom circuit boards for mounting the SiPM detectors, the high voltage power supplies and coincidence AND circuit. The AND logic signals can be used for triggering data acquisition devices including an oscilloscope, a waveform digitizer or an Arduino microcontroller. To properly route the circuit wire traces, the circuit boards were layout in Eagle and fabricated in-house using a circuit board maker from LPKF LASER, model Protomat E33. We used a Raspberry Pi computer to control a fast waveform sampler, the DRS4 to digitize the SiPM signal waveforms. The CERN PAW software package was used to analyze the amplitude and time distributions of SiPM detector signals. At this conference, we present our SiPM experimental setup, circuit board fabrication procedures and the data analysis work flow. AIP Megger's Award, Dept. of Ed. Title V Grant PO31S090007.

Evaluation of Cleanliness Test Methods for Spacecraft PCB Assemblies

NASA Astrophysics Data System (ADS)

Tegehall, P.-E.; Dunn, B. D.

2006-10-01

Ionic contamination on printed-circuit-board assemblies may cause current leakage and short-circuits. The present cleanliness requirement in ECSS-Q-70-08, "The manual soldering of high-reliability electrical connections", is that the ionic contamination shall be less than 1.56 fl-glcm2 NaCI equivalents. The relevance of the method used for measurement of the ionic contamination level, resistivity of solvent extract, has been questioned. Alternative methods are ion chromatography and measurement of surface insulation resistance, but these methods also have their drawbacks. These methods are first described and their advantages and drawbacks are discussed. This is followed by an experimental evaluation of the three methods. This was done by soldering test vehicles at four manufacturers of space electronics using their ordinary processes for soldering and cleaning printed board assemblies. The experimental evaluation showed that the ionic contamination added by the four assemblers was very small and well below the acceptance criterion in ECSS-Q-70-80. Ion-chromatography analysis showed that most of the ionic contamination on the cleaned assembled boards originated from the hot-oil fusing of the printed circuit boards. Also, the surface insulation resistance was higher on the assembled boards compared to the bare printed circuit boards. Since strongly activated fluxes are normally used when printed circuit boards are hot-oil fused, it is essential that they are thoroughly cleaned in order to achieve low contamination levels on the final printed-board assemblies.

Printed circuit boards: a review on the perspective of sustainability.

PubMed

Canal Marques, André; Cabrera, José-María; Malfatti, Célia de Fraga

2013-12-15

Modern life increasingly requires newer equipments and more technology. In addition, the fact that society is highly consumerist makes the amount of discarded equipment as well as the amount of waste from the manufacture of new products increase at an alarming rate. Printed circuit boards, which form the basis of the electronics industry, are technological waste of difficult disposal whose recycling is complex and expensive due to the diversity of materials and components and their difficult separation. Currently, printed circuit boards have a fixing problem, which is migrating from traditional Pb-Sn alloys to lead-free alloys without definite choice. This replacement is an attempt to minimize the problem of Pb toxicity, but it does not change the problem of separation of the components for later reuse and/or recycling and leads to other problems, such as temperature rise, delamination, flaws, risks of mechanical shocks and the formation of "whiskers". This article presents a literature review on printed circuit boards, showing their structure and materials, the environmental problem related to the board, some the different alternatives for recycling, and some solutions that are being studied to reduce and/or replace the solder, in order to minimize the impact of solder on the printed circuit boards. Copyright © 2013 Elsevier Ltd. All rights reserved.

Modular chassis simplifies packaging and interconnecting of circuit boards

NASA Technical Reports Server (NTRS)

Arens, W. E.; Boline, K. G.

1964-01-01

A system of modular chassis structures has simplified the design for mounting a number of printed circuit boards. This design is structurally adaptable to computer and industrial control system applications.

Front-Side Microstrip Line Feeding a Raised Antenna Patch

NASA Technical Reports Server (NTRS)

Hodges, Richard; Hoppe, Daniel

2005-01-01

An improved design concept for a printed-circuit patch antenna and the transmission line that feeds the patch calls for (1) a microstrip transmission line on the front (radiative) side of a printed-circuit board based on a thin, high-permittivity dielectric substrate; (2) using the conductor covering the back side of the circuit board as a common ground plane for both the microstrip line and the antenna patch; (3) supporting the antenna patch in front of the circuit board on a much thicker, lower-permittivity dielectric spacer layer; and (4) connecting the microstrip transmission line to the patch by use of a thin wire or narrow ribbon that extends through the thickness of the spacer and is oriented perpendicularly to the circuit-board plane. The thickness of the substrate is typically chosen so that a microstrip transmission line of practical width has an impedance between 50 and 100 ohms. The advantages of this design concept are best understood in the context of the disadvantages of prior design concepts, as explained

DOE Office of Scientific and Technical Information (OSTI.GOV)

Hadi, Pejman; Ning, Chao; Ouyang, Weiyi

Highlights: • Environmental impacts of electronic waste and specifically waste printed circuit boards. • Review of the recycling techniques of waste printed circuit boards. • Advantages of physico-mechanical recycling techniques over chemical methods. • Utilization of nonmetallic fraction of waste printed circuit boards as modifier/filler. • Recent advances in the use of nonmetallic fraction of waste printed circuit boards as precursor. - Abstract: Electronic waste, including printed circuit boards, is growing at an alarming rate due to the accelerated technological progress and the shorter lifespan of the electronic equipment. In the past decades, due to the lack of proper economicmore » and environmentally-benign recycling technologies, a major fraction of e-waste generated was either destined to landfills or incinerated with the sole intention of its disposal disregarding the toxic nature of this waste. Recently, with the increasing public awareness over their environment and health issues and with the enaction of more stringent regulations, environmentally-benign recycling has been driven to be an alternative option partially replacing the traditional eco-unfriendly disposal methods. One of the most favorable green technologies has been the mechanical separation of the metallic and nonmetallic fraction of the waste printed circuit boards. Although metallic fraction, as the most profitable component, is used to generate the revenue of the separation process, the nonmetallic fraction (NMF) has been left isolated. Herein, the recent developments in the application of NMF have been comprehensively reviewed and an eco-friendly emerging usage of NMF as a value-added material for sustainable remediation has been introduced.« less

Advanced Packaging for VLSI/VHSIC (Very Large Scale Integrated Circuits/Very High Speed Integrated Circuits) Applications: Electrical, Thermal, and Mechanical Considerations - An IR&D Report.

DTIC Science & Technology

1987-11-01

developed that can be used by circuit engineers to extract the maximum performance from the devices on various board technologies including multilayer ceramic...Design guidelines have been developed that can be used by circuit engineers to extract the maxi- mum performance from the devices on various board...25 Attenuation and Dispersion Effects ......................................... 27 Skin Effect

Separation and recovery of fine particles from waste circuit boards using an inflatable tapered diameter separation bed.

PubMed

Duan, Chenlong; Sheng, Cheng; Wu, Lingling; Zhao, Yuemin; He, Jinfeng; Zhou, Enhui

2014-01-01

Recovering particle materials from discarded printed circuit boards can enhance resource recycling and reduce environmental pollution. Efficiently physically separating and recovering fine metal particles (-0.5 mm) from the circuit boards are a key recycling challenge. To do this, a new type of separator, an inflatable tapered diameter separation bed, was developed to study particle motion and separation mechanisms in the bed's fluid flow field. For 0.5-0.25 mm circuit board particles, metal recovery rates ranged from 87.56 to 94.17%, and separation efficiencies ranged from 87.71 to 94.20%. For 0.25-0.125 mm particles, metal recovery rates ranged from 84.76 to 91.97%, and separation efficiencies ranged from 84.74 to 91.86%. For superfine products (-0.125 mm), metal recovery rates ranged from 73.11 to 83.04%, and separation efficiencies ranged from 73.00 to 83.14%. This research showed that the inflatable tapered diameter separation bed achieved efficient particle separation and can be used to recover fine particles under a wide range of operational conditions. The bed offers a new mechanical technology to recycle valuable materials from discarded printed circuit boards, reducing environmental pollution.

Bioextraction of Copper from Printed Circuit Boards: Influence of Initial Concentration of Ferrous Iron

NASA Astrophysics Data System (ADS)

Yamane, Luciana Harue; Espinosa, Denise Crocce Romano; Tenório, Jorge Alberto Soares

Printed circuit boards are found in all electric and electronic equipment and are particularly problematic to recycle because of the heterogeneous mix of organic material, metals, and fiberglass. Additionally, printed circuit boards can be considered a secondary source of copper and bacterial leaching can be applied to copper recovery. This study investigated the influence of initial concentration of ferrous iron on bacterial leaching to recover copper from printed circuit boards using Acidithiobacillus ferrooxidans-LR. Printed circuit boards from computers were comminuted using a hammer mill. The powder obtained was magnetically separated and the non magnetic material used in this study. A shake flask study was carried out on the non magnetic material using a rotary shaker at 30°C, 170 rpm and different initial concentrations of ferrous iron (gL-1): 6.75; 13.57 and 16.97. Abiotic controls were also run in parallel. The monitored parameters were pH, Eh, ferrous iron concentration and copper extraction (spectroscopy of atomic absorption). The results showed that using initial concentration of ferrous iron of 6.75gL-1 were extracted 99% of copper by bacterial leaching.

High stability buffered phase comparator

NASA Technical Reports Server (NTRS)

Adams, W. A.; Reinhardt, V. S. (Inventor)

1984-01-01

A low noise RF signal phase comparator comprised of two high stability driver buffer amplifiers driving a double balanced mixer which operate to generate a beat frequency between the two RF input signals coupled to the amplifiers from the RF sources is described. The beat frequency output from the mixer is applied to a low noise zero crossing detector which is the phase difference between the two RF inputs. Temperature stability is provided by mounting the amplifiers and mixer on a common circuit board with the active circuit elements located on one side of a circuit board and the passive circuit elements located on the opposite side. A common heat sink is located adjacent the circuit board. The active circuit elements are embedded into the bores of the heat sink which slows the effect of ambient temperature changes and reduces the temperature gradients between the active circuit elements, thus improving the cancellation of temperature effects. The two amplifiers include individual voltage regulators, which increases RF isolation.

Hybrid stretchable circuits on silicone substrate

DOE Office of Scientific and Technical Information (OSTI.GOV)

Robinson, A., E-mail: adam.1.robinson@nokia.com; Aziz, A., E-mail: a.aziz1@lancaster.ac.uk; Liu, Q.

When rigid and stretchable components are integrated onto a single elastic carrier substrate, large strain heterogeneities appear in the vicinity of the deformable-non-deformable interfaces. In this paper, we report on a generic approach to manufacture hybrid stretchable circuits where commercial electronic components can be mounted on a stretchable circuit board. Similar to printed circuit board development, the components are electrically bonded on the elastic substrate and interconnected with stretchable electrical traces. The substrate—a silicone matrix carrying concentric rigid disks—ensures both the circuit elasticity and the mechanical integrity of the most fragile materials.

Detection of circuit-board components with an adaptive multiclass correlation filter

NASA Astrophysics Data System (ADS)

Diaz-Ramirez, Victor H.; Kober, Vitaly

2008-08-01

A new method for reliable detection of circuit-board components is proposed. The method is based on an adaptive multiclass composite correlation filter. The filter is designed with the help of an iterative algorithm using complex synthetic discriminant functions. The impulse response of the filter contains information needed to localize and classify geometrically distorted circuit-board components belonging to different classes. Computer simulation results obtained with the proposed method are provided and compared with those of known multiclass correlation based techniques in terms of performance criteria for recognition and classification of objects.

TSCA Chemical Data Reporting Fact Sheet: Byproducts Reporting for the Printed Circuit Board Industry

EPA Pesticide Factsheets

This fact sheet provides information on existing Chemical Data Reporting (CDR) rule requirements related to byproducts reporting by persons who manufacture printed circuit boards and may be subject to CDR.

Secure RFID tag or sensor with self-destruction mechanism upon tampering

DOE Office of Scientific and Technical Information (OSTI.GOV)

Nekoogar, Faranak; Dowla, Farid; Twogood, Richard

A circuit board anti-tamper mechanism comprises a circuit board having a frangible portion, a trigger having a trigger spring, a trigger arming mechanism actuated by the trigger wherein the trigger arming mechanism is initially non-actuated, a force producing mechanism, a latch providing mechanical communication between the trigger arming mechanism and the force producing mechanism, wherein the latch initially retains the force producing mechanism in a refracted position. Arming pressure applied to the trigger sufficient to overcome the trigger spring force will actuate the trigger arming mechanism, causing the anti-tamper mechanism to be armed. Subsequent tampering with the anti-tamper mechanism resultsmore » in a decrease of pressure on the trigger below the trigger spring force, thereby causing the trigger arming mechanism to actuate the latch, thereby releasing the force producing mechanism to apply force to the frangible portion of the circuit board, thereby breaking the circuit board.« less

Stripline/Microstrip Transition in Multilayer Circuit Board

NASA Technical Reports Server (NTRS)

Epp, Larry; Khan, Abdur

2005-01-01

A stripline-to-microstrip transition has been incorporated into a multilayer circuit board that supports a distributed solid-state microwave power amplifier, for the purpose of coupling the microwave signal from a buried-layer stripline to a top-layer microstrip. The design of the transition could be adapted to multilayer circuit boards in such products as cellular telephones (for connecting between circuit-board signal lines and antennas), transmitters for Earth/satellite communication systems, and computer mother boards (if processor speeds increase into the range of tens of gigahertz). The transition is designed to satisfy the following requirements in addition to the basic coupling requirement described above: (1) The transition must traverse multiple layers, including intermediate layers that contain DC circuitry. (2) The transition must work at a frequency of 32 GHz with low loss and low reflection. (3) The power delivered by the transition to top-layer microstrip must be split equally in opposite directions along the microstrip. Referring to the figure, this amounts to a requirement that when power is supplied to input port 1, equal amounts of power flow through output ports 2 and 3. (4) The signal-line via that is necessarily a part of such a transition must not be what is known in the art as a blind via; that is, it must span the entire thickness of the circuit board.

Soldering Tool for Integrated Circuits

NASA Technical Reports Server (NTRS)

Takahashi, Ted H.

1987-01-01

Many connections soldered simultaneously in confined spaces. Improved soldering tool bonds integrated circuits onto printed-circuit boards. Intended especially for use with so-called "leadless-carrier" integrated circuits.

Alternatives Assessment: Partnership to Evaluate Flame Retardants in Printed Circuit Boards

EPA Pesticide Factsheets

The partnership project on flame retardants in printed circuit boards seeks to improve understanding of the environmental and human health impacts of new and current materials that can be used to meet fire safety standards

Flexible composite film for printed circuit board

NASA Technical Reports Server (NTRS)

Yabe, K.; Asakura, M.; Tanaka, H.; Soda, A.

1982-01-01

A flexible printed circuit for a printed circuit board in which layers of reaction product composed of a combination of phenoxy resin - polyisocyanate - brominated epoxy resin, and in which the equivalent ratio of those functional groups is hydroxyl group: isocyanate group: epoxy group - 1 : 0.2 to 2 : 0.5 to 3 are laminated on at least one side of saturated polyester film is discussed.

Separation and Recovery of Fine Particles from Waste Circuit Boards Using an Inflatable Tapered Diameter Separation Bed

PubMed Central

Sheng, Cheng; Wu, Lingling; Zhao, Yuemin; He, Jinfeng; Zhou, Enhui

2014-01-01

Recovering particle materials from discarded printed circuit boards can enhance resource recycling and reduce environmental pollution. Efficiently physically separating and recovering fine metal particles (−0.5 mm) from the circuit boards are a key recycling challenge. To do this, a new type of separator, an inflatable tapered diameter separation bed, was developed to study particle motion and separation mechanisms in the bed's fluid flow field. For 0.5–0.25 mm circuit board particles, metal recovery rates ranged from 87.56 to 94.17%, and separation efficiencies ranged from 87.71 to 94.20%. For 0.25–0.125 mm particles, metal recovery rates ranged from 84.76 to 91.97%, and separation efficiencies ranged from 84.74 to 91.86%. For superfine products (−0.125 mm), metal recovery rates ranged from 73.11 to 83.04%, and separation efficiencies ranged from 73.00 to 83.14%. This research showed that the inflatable tapered diameter separation bed achieved efficient particle separation and can be used to recover fine particles under a wide range of operational conditions. The bed offers a new mechanical technology to recycle valuable materials from discarded printed circuit boards, reducing environmental pollution. PMID:25379546

Atmospheric occurrence, transport and gas-particle partitioning of polychlorinated biphenyls over the northwestern Pacific Ocean

NASA Astrophysics Data System (ADS)

Wu, Zilan; Lin, Tian; Li, Zhongxia; Li, Yuanyuan; Guo, Tianfeng; Guo, Zhigang

2017-10-01

Ship-board air samples were collected during March to May 2015 from the East China Sea (ECS) to the northwestern Pacific Ocean (NWP) to explore the atmospheric occurrence and gas-particle partitioning of polychlorinated biphenyls (PCBs) when the westerly East Asian Monsoon prevailed. Total PCB concentrations in the atmosphere ranged from 56.8 to 261 pg m-3. Higher PCB levels were observed off the coast and minor temperature-induced changes showed that continuous emissions from East Asia remain as an important source to the regional atmosphere. A significant relationship between Koa (octanol-air partition coefficient) and KP (gas-particle partition coefficient) for PCBs was observed under continental air masses, suggesting that land-derived organic aerosols affected the PCB gas-particle partitioning after long-range transport, while an absence of this correlation was identified in marine air masses. The PCB partitioning cannot be fully explained by the absorptive mechanism as the predicted KP were found to be 2-3 orders of magnitude lower than the measured Kp, while the prediction was closely matched when soot adsorption was considered. The results suggested the importance of soot carbon as a transport medium for PCBs during their long-range transport and considerable impacts of continental outflows on PCBs across the downwind area. The estimated transport mass of particulate PCBs into the ECS and NWP totals 2333 kg during the spring, constituting ca. 17% of annual emission inventories of unintentionally produced PCB in China.

Circuit design of an EMCCD camera

NASA Astrophysics Data System (ADS)

Li, Binhua; Song, Qian; Jin, Jianhui; He, Chun

2012-07-01

EMCCDs have been used in the astronomical observations in many ways. Recently we develop a camera using an EMCCD TX285. The CCD chip is cooled to -100°C in an LN2 dewar. The camera controller consists of a driving board, a control board and a temperature control board. Power supplies and driving clocks of the CCD are provided by the driving board, the timing generator is located in the control board. The timing generator and an embedded Nios II CPU are implemented in an FPGA. Moreover the ADC and the data transfer circuit are also in the control board, and controlled by the FPGA. The data transfer between the image workstation and the camera is done through a Camera Link frame grabber. The software of image acquisition is built using VC++ and Sapera LT. This paper describes the camera structure, the main components and circuit design for video signal processing channel, clock driver, FPGA and Camera Link interfaces, temperature metering and control system. Some testing results are presented.

Plasma methods for metals recovery from metal-containing waste.

PubMed

Changming, Du; Chao, Shang; Gong, Xiangjie; Ting, Wang; Xiange, Wei

2018-04-27

Metal-containing waste, a kind of new wastes, has a great potential for recycling and is also difficult to deal with. Many countries pay more and more attention to develop the metal recovery process and equipment of this kind of waste as raw material, so as to solve the environmental pollution and comprehensively utilize the discarded metal resources. Plasma processing is an efficient and environmentally friendly way for metal-containing waste. This review mainly discuss various metal-containing waste types, such as printed circuit boards (PCBs), red mud, galvanic sludge, Zircon, aluminium dross and incinerated ash, and the corresponding plasma methods, which include DC extended transferred arc plasma reactor, DC non-transferred arc plasma torch, RF thermal plasma reactor and argon and argon-hydrogen plasma jets. In addition, the plasma arc melting technology has a better purification effect on the extraction of useful metals from metal-containing wastes, a great capacity of volume reduction of waste materials, and a low leaching toxicity of solid slag, which can also be used to deal with all kinds of metal waste materials, having a wide range of applications. Copyright © 2018 Elsevier Ltd. All rights reserved.

Effect of Plasma Surface Finish on Wettability and Mechanical Properties of SAC305 Solder Joints

NASA Astrophysics Data System (ADS)

Kim, Kyoung-Ho; Koike, Junichi; Yoon, Jeong-Won; Yoo, Sehoon

2016-12-01

The wetting behavior, interfacial reactions, and mechanical reliability of Sn-Ag-Cu solder on a plasma-coated printed circuit board (PCB) substrate were evaluated under multiple heat-treatments. Conventional organic solderability preservative (OSP) finished PCBs were used as a reference. The plasma process created a dense and highly cross-linked polymer coating on the Cu substrates. The plasma finished samples had higher wetting forces and shorter zero-cross times than those with OSP surface finish. The OSP sample was degraded after sequential multiple heat treatments and reflow processes, whereas the solderability of the plasma finished sample was retained after multiple heat treatments. After the soldering process, similar microstructures were observed at the interfaces of the two solder joints, where the development of intermetallic compounds was observed. From ball shear tests, it was found that the shear force for the plasma substrate was consistently higher than that for the OSP substrate. Deterioration of the OSP surface finish was observed after multiple heat treatments. Overall, the plasma surface finish was superior to the conventional OSP finish with respect to wettability and joint reliability, indicating that it is a suitable material for the fabrication of complex electronic devices.

Electroless Cu Plating on Anodized Al Substrate for High Power LED.

PubMed

Rha, Sa-Kyun; Lee, Youn-Seoung

2015-03-01

Area-selective copper deposition on screen printed Ag pattern/anodized Al/Al substrate was attempted using a neutral electroless plating processes for printed circuit boards (PCBs), according to a range of variation of pH 6.5-pH 8 at 70 °C. The utilized basic electroless solution consisted of copper(II) sulfate pentahydrate, sodium phosphinate monohydrate, sodium citrate tribasic dihydrate, ammonium chloride, and nickel(II) sulfate hexahydrate. The pH of the copper plating solutions was adjusted from pH 6.5 to pH 8 using NH4OH. Using electroless plating in pH 6.5 and pH 7 baths, surface damage to the anodized Al layer hardly occurred; the structure of the plated Cu-rich films was a typical fcc-Cu, but a small Ni component was co-deposited. In electroless plating at pH 8, the surface of the anodized Al layer was damaged and the Cu film was composed of a lot of Ni and P which were co-deposited with Cu. Finally, in a pH 7 bath, we can make a selectively electroless plated Cu film on a PCB without any lithography and without surface damage to the anodized Al layer.

Environmental risk assessment of CRT and PCB workshops in a mobile e-waste recycling plant.

PubMed

Song, Qingbin; Zeng, Xianlai; Li, Jinhui; Duan, Huabo; Yuan, Wenyi

2015-08-01

The mobile e-waste recycling equipment was chosen as the object of this study, including manual dismantling, mechanical separation of cathode ray tubes (CRTs), and printed circuit boards (PCBs) in the two independent workshops. To determine the potential environmental contamination, the noise, the heavy metals (Cu, Cd, Pb), and the environmental impacts of the e-waste recycling processes in the two workshops of the mobile plant have been evaluated in this paper. This study determined that when control measures are employed, the noise within the two workshops (<80 dB) will meet the national standards. In the CRT workshop, Pb was the most polluting metal, with 2.3 μg/m(3) and 10.53 mg/g in the air and floor dust, respectively. The result of a health risk assessment shows that noncancerous effects are possible for Pb (hazard index (HI) = 3.54 in the CRT workshop and HI = 1.27 in the PCB workshop). The carcinogenic risks to workers for Cd are relatively light in both the workshops. From the results of life cycle assessment (LCA), it can be seen that there was an environmental benefit from the e-waste recycling process as a whole.

A Project Course Sequence in Innovation and Commercialization of Medical Devices.

PubMed

Eberhardt, Alan W; Tillman, Shea; Kirkland, Brandon; Sherrod, Brandon

2017-07-01

There exists a need for educational processes in which students gain experience with design and commercialization of medical devices. This manuscript describes the implementation of, and assessment results from, the first year offering of a project course sequence in Master of Engineering (MEng) in Design and Commercialization at our institution. The three-semester course sequence focused on developing and applying hands-on skills that contribute to product development to address medical device needs found within our university hospital and local community. The first semester integrated computer-aided drawing (CAD) as preparation for manufacturing of device-related components (hand machining, computer numeric control (CNC), three-dimensional (3D) printing, and plastics molding), followed by an introduction to microcontrollers (MCUs) and printed circuit boards (PCBs) for associated electronics and control systems. In the second semester, the students applied these skills on a unified project, working together to construct and test multiple weighing scales for wheelchair users. In the final semester, the students applied industrial design concepts to four distinct device designs, including user and context reassessment, human factors (functional and aesthetic) design refinement, and advanced visualization for commercialization. The assessment results are described, along with lessons learned and plans for enhancement of the course sequence.

40 CFR 413.80 - Applicability: Description of the printed circuit board subcategory.

Code of Federal Regulations, 2010 CFR

2010-07-01

... 40 Protection of Environment 28 2010-07-01 2010-07-01 true Applicability: Description of the printed circuit board subcategory. 413.80 Section 413.80 Protection of Environment ENVIRONMENTAL PROTECTION AGENCY (CONTINUED) EFFLUENT GUIDELINES AND STANDARDS ELECTROPLATING POINT SOURCE CATEGORY Printed...

Self-shielding printed circuit boards for high frequency amplifiers and transmitters

NASA Technical Reports Server (NTRS)

Galvin, D.

1969-01-01

Printed circuit boards retaining as much copper as possible provide electromagnetic shielding between stages of the high frequency amplifiers and transmitters. Oscillation is prevented, spurious output signals are reduced, and multiple stages are kept isolated from each other, both thermally and electrically.

No-warp potted circuits

NASA Technical Reports Server (NTRS)

Robinson, W. W.

1979-01-01

Sponge inserts compensate for potting-compound expansion and relieve thermal stresses on circuit boards. Technique quality of production runs on PC boards intended for applications in environments less severe than those for aerospace equipment. Pads reduce weight of modules because they weigh far less than potting compound they displace.

78 FR 23591 - Certain Prepregs, Laminates, and Finished Circuit Boards

Federal Register 2010, 2011, 2012, 2013, 2014

2013-04-19

... INTERNATIONAL TRADE COMMISSION [Investigation No. 337-TA-659 (Enforcement)] Certain Prepregs... United States after importation of certain prepregs, laminates, and finished circuit boards that infringe... prepregs and laminates that are the subject of the investigation or that otherwise infringe, induce, and/or...

Beam forming network

NASA Technical Reports Server (NTRS)

Cramer, P. W., Jr. (Inventor)

1985-01-01

The network, which is connected to a layer of 134 feed elements that transmit and receive microwaves, consists of a pair of circuit boards parallel to the feed element layer. One of the two boards has 87 dividers that each divide a signal to be transmitted into seven portions, and the other board has 134 combiners that each collect seven transmit signal portions and deliver the sum to one of the feed elements. A similar arrangement is used to handle received signals. The large number of interconnections are made by printed circuit conductors radiating from each of the numerous dividers and combiners, and by providing interconnection pins that interconnect the ends of pairs of conductors lying on the two boards. The printed circuit conductors extend in undulating paths that provide maximum separation of conductors to minimize crosstalk.

Space shuttle main engine controller assembly, phase C-D. [with lagging system design and analysis

NASA Technical Reports Server (NTRS)

1973-01-01

System design and system analysis and simulation are slightly behind schedule, while design verification testing has improved. Input/output circuit design has improved, but digital computer unit (DCU) and mechanical design continue to lag. Part procurement was impacted by delays in printed circuit board, assembly drawing releases. These are the result of problems in generating suitable printed circuit artwork for the very complex and high density multilayer boards.

Testing of printed circuit board solder joints by optical correlation

NASA Technical Reports Server (NTRS)

Espy, P. N.

1975-01-01

An optical correlation technique for the nondestructive evaluation of printed circuit board solder joints was evaluated. Reliable indications of induced stress levels in solder joint lead wires are achievable. Definite relations between the inherent strength of a solder joint, with its associated ability to survive stress, are demonstrable.

Maze solving automatons for self-healing of open interconnects: Modular add-on for circuit boards

DOE Office of Scientific and Technical Information (OSTI.GOV)

Nair, Aswathi; Raghunandan, Karthik; Yaswant, Vaddi

We present the circuit board integration of a self-healing mechanism to repair open faults. The electric field driven mechanism physically restores fractured interconnects in electronic circuits and has the ability to solve mazes. The repair is performed by conductive particles dispersed in an insulating fluid. We demonstrate the integration of the healing module onto printed circuit boards and the ability of maze solving. We model and perform experiments on the influence of the geometry of conductive particles as well as the terminal impedances of the route on the healing efficiency. The typical heal rate is 10 μm/s with healed route havingmore » mean resistance of 8 kΩ across a 200 micron gap and depending on the materials and concentrations used.« less

Humidity Control in the U.S. Air Force Aircraft Service Shelter

DTIC Science & Technology

1988-06-30

printed circuit board control module , terminal boards, and blowt.r, etc.) are off-the-shelf commercial components. Only the humidifier ho:;Ift, I...indication of the shelter RH. - Circuit Breaker: A 20 amp, three pole breaker is providud fur equipment protection. o Water Storage Tank. A stainless...tapped into the shelter’s existing electrical system at the panelboard, on the load side of the 100 Amp main AC circuit breaker. Power is then

Direct Digital Boiler Control Systems for the Navy Small Boiler Equipment.

DTIC Science & Technology

1983-02-01

Hardware. Each full-size ACU a 6 caculation modules 30 arrme, modufes sation for dead time lag contains input/output circuit a 16 control mo uies a...along with lather modules of the DCS-1000 family. ’The complete instrument consists of plug-in circuit boards that allow easy Teplacement of a...Maintenance-Most systems indicate trouble areas with diagnostic routines or integral LED indicators so that circuit boards can be replaced to correct

Attachment method for stacked integrated circuit (IC) chips

DOEpatents

Bernhardt, Anthony F.; Malba, Vincent

1999-01-01

An attachment method for stacked integrated circuit (IC) chips. The method involves connecting stacked chips, such as DRAM memory chips, to each other and/or to a circuit board. Pads on the individual chips are rerouted to form pads on the side of the chip, after which the chips are stacked on top of each other whereby desired interconnections to other chips or a circuit board can be accomplished via the side-located pads. The pads on the side of a chip are connected to metal lines on a flexible plastic tape (flex) by anisotropically conductive adhesive (ACA). Metal lines on the flex are likewise connected to other pads on chips and/or to pads on a circuit board. In the case of a stack of DRAM chips, pads to corresponding address lines on the various chips may be connected to the same metal line on the flex to form an address bus. This method has the advantage of reducing the number of connections required to be made to the circuit board due to bussing; the flex can accommodate dimensional variation in the alignment of chips in the stack; bonding of the ACA is accomplished at low temperature and is otherwise simpler and less expensive than solder bonding; chips can be bonded to the ACA all at once if the sides of the chips are substantially coplanar, as in the case for stacks of identical chips, such as DRAM.

PUZZLE - A program for computer-aided design of printed circuit artwork

NASA Technical Reports Server (NTRS)

Harrell, D. A. W.; Zane, R.

1971-01-01

Program assists in solving spacing problems encountered in printed circuit /PC/ design. It is intended to have maximum use for two-sided PC boards carrying integrated circuits, and also aids design of discrete component circuits.

Biodegradable materials for multilayer transient printed circuit boards.

PubMed

Huang, Xian; Liu, Yuhao; Hwang, Suk-Won; Kang, Seung-Kyun; Patnaik, Dwipayan; Cortes, Jonathan Fajardo; Rogers, John A

2014-11-19

Biodegradable printed circuit boards based on water-soluble materials are demonstrated. These systems can dissolve in water within 10 mins to yield end-products that are environmentally safe. These and related approaches have the potential to reduce hazardous waste streams associated with electronics disposal. © 2014 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

Circuit Board Analysis for Lead by Atomic Absorption Spectroscopy in a Course for Nonscience Majors

ERIC Educational Resources Information Center

Weidenhammer, Jeffrey D.

2007-01-01

A circuit board analysis of the atomic absorption spectroscopy, which is used to measure lead content in a course for nonscience majors, is being presented. The experiment can also be used to explain the potential environmental hazards of unsafe disposal of various used electronic equipments.

Testing Services

NASA Technical Reports Server (NTRS)

1993-01-01

Trace Laboratories is an independent testing laboratory specializing in testing printed circuit boards, automotive products and military hardware. Technical information from NASA Tech Briefs and two subsequent JPL Technical Support packages have assisted Trace in testing surface insulation resistance on printed circuit board materials. Testing time was reduced and customer service was improved because of Jet Propulsion Laboratory technical support packages.

An Integer Programming-Based Generalized Vehicle Routing Approach for Printed Circuit Board Assembly Optimization

ERIC Educational Resources Information Center

Seth, Anupam

2009-01-01

Production planning and scheduling for printed circuit, board assembly has so far defied standard operations research approaches due to the size and complexity of the underlying problems, resulting in unexploited automation flexibility. In this thesis, the increasingly popular collect-and-place machine configuration is studied and the assembly…

78 FR 75360 - Notice of Issuance of Final Determination Concerning Certain Ethernet Switches

Federal Register 2010, 2011, 2012, 2013, 2014

2013-12-11

... printed circuit board assembly (``PCBA''), chassis, top cover, power supply, and fans. The switches... printed circuit board is populated with various electronic components to make a PCBA. 2. The PCBA is... Singapore. You argue that without the EOS software, the units exported from Singapore lack the intelligence...

[Characterization of pyrolysis of waste printed circuit boards by high-resolution pyrolysis gas chromatography-mass spectrometry].

PubMed

Zhang, Yanhong; Huang, Hong; Xia, Zhengbin; Chen, Huanqin

2008-07-01

Thermal degradation of pyrolysis of waste circuit boards was investigated by high-resolution pyrolysis gas chromatography-mass spectrometry (PyGC-MS) and thermogravimetry (TG). In helium atmosphere, the products of FR-4 waste printed circuit board were pyrolyzed at 350, 450, 550, 650, and 750 degrees degrees C, separately, and the pyrolysis products were identified by online MS. The results indicated that the pyrolysis products of the FR-4 waste circuit board were three kinds of substances, such as the low boiling point products, phenol, bisphenol and their related products. Moreover, under 300 degrees degrees C, only observed less pyrolysis products. As the increase of pyrolysis temperature, the relative content of the low boiling point products increased. In the range of 450-650 degrees degrees C, the qualitative analysis and character were similar, and the relative contents of phenol and bisphenol were higher. The influence of pyrolysis temperature on pyrolyzate yields was studied. On the basis of the pyrolyzate profile and the dependence of pyrolyzate yields on pyrolysis temperature, the thermal degradation mechanism of brominated epoxy resin was proposed.

Process development for recovery of copper and precious metals from waste printed circuit boards with emphasize on palladium and gold leaching and precipitation.

PubMed

Behnamfard, Ali; Salarirad, Mohammad Mehdi; Veglio, Francesco

2013-11-01

A novel hydrometallurgical process was proposed for selective recovery of Cu, Ag, Au and Pd from waste printed circuit boards (PCBs). More than 99% of copper content was dissolved by using two consecutive sulfuric acid leaching steps in the presence of H2O2 as oxidizing agents. The solid residue of 2nd leaching step was treated by acidic thiourea in the presence of ferric iron as oxidizing agent and 85.76% Au and 71.36% Ag dissolution was achieved. The precipitation of Au and Ag from acidic thiourea leachate was investigated by using different amounts of sodium borohydride (SBH) as a reducing agent. The leaching of Pd and remained gold from the solid reside of 3rd leaching step was performed in NaClO-HCl-H2O2 leaching system and the effect of different parameters was investigated. The leaching of Pd and specially Au increased by increasing the NaClO concentration up to 10V% and any further increasing the NaClO concentration has a negligible effect. The leaching of Pd and Au increased by increasing the HCl concentration from 2.5 to 5M. The leaching of Pd and Au were endothermic and raising the temperature had a positive effect on leaching efficiency. The kinetics of Pd leaching was quite fast and after 30min complete leaching of Pd was achieved, while the leaching of Au need a longer contact time. The best conditions for leaching of Pd and Au in NaClO-HCl-H2O2 leaching system were determined to be 5M HCl, 1V% H2O2, 10V% NaClO at 336K for 3h with a solid/liquid ratio of 1/10. 100% of Pd and Au of what was in the chloride leachate were precipitated by using 2g/L SBH. Finally, a process flow sheet for the recovery of Cu, Ag, Au and Pd from PCB was proposed. Copyright © 2013 Elsevier Ltd. All rights reserved.

Physics Notes.

ERIC Educational Resources Information Center

School Science Review, 1980

1980-01-01

Outlines a variety of laboratory procedures, discussions, and demonstrations including a no-solder circuit board, damped to maintained oscillations with L-C circuits, polaroid strobe photos, resistive putty, soldering and circuit checking exercise, electromagnetic radiation, square pulses in C-R circuits, and testing an oscillating system. (GS)

Sampling and Control Circuit Board for an Inertial Measurement Unit

NASA Technical Reports Server (NTRS)

Chelmins, David; Powis, Rick

2012-01-01

Spacesuit navigation is one component of NASA s efforts to return humans to the Moon. Studies performed at the NASA Glenn Research Center (GRC) considered various navigation technologies and filtering approaches to enable navigation on the lunar surface. As part of this effort, microelectromechanical systems (MEMS) inertial measurement units (IMUs) were studied to determine if they could supplement a radiometric infrastructure. MEMS IMUs were included in the Lunar Extra-Vehicular Activity Crewmember Location Determination System (LECLDS) testbed during NASA s annual Desert Research and Technology Studies (D-RATS) event in 2009 and 2010. The testbed included one IMU in 2009 and three IMUs in 2010, along with a custom circuit board interfacing between the navigation processor and each IMU. The board was revised for the 2010 test, and this paper documents the design details of this latest revision of the interface circuit board and firmware.

Pressure-Sensor Assembly Technique

NASA Technical Reports Server (NTRS)

Pruzan, Daniel A.

2003-01-01

Nielsen Engineering & Research (NEAR) recently developed an ultrathin data acquisition system for use in turbomachinery testing at NASA Glenn Research Center. This system integrates a microelectromechanical- systems- (MEMS-) based absolute pressure sensor [0 to 50 psia (0 to 345 kPa)], temperature sensor, signal-conditioning application-specific integrated circuit (ASIC), microprocessor, and digital memory into a package which is roughly 2.8 in. (7.1 cm) long by 0.75 in. (1.9 cm) wide. Each of these components is flip-chip attached to a thin, flexible circuit board and subsequently ground and polished to achieve a total system thickness of 0.006 in. (0.15 mm). Because this instrument is so thin, it can be quickly adhered to any surface of interest where data can be collected without disrupting the flow being investigated. One issue in the development of the ultrathin data acquisition system was how to attach the MEMS pressure sensor to the circuit board in a manner which allowed the sensor s diaphragm to communicate with the ambient fluid while providing enough support for the chip to survive the grinding and polishing operations. The technique, developed by NEAR and Jabil Technology Services Group (San Jose, CA), is described below. In the approach developed, the sensor is attached to the specially designed circuit board, see Figure 1, using a modified flip-chip technique. The circular diaphragm on the left side of the sensor is used to actively measure the ambient pressure, while the diaphragm on the right is used to compensate for changes in output due to temperature variations. The circuit board is fabricated with an access hole through it so that when the completed system is installed onto a wind tunnel model (chip side down), the active diaphragm is exposed to the environment. After the sensor is flip-chip attached to the circuit board, the die is underfilled to support the chip during the subsequent grinding and polishing operations. To prevent this underfill material from getting onto the sensor s diaphragms, the circuit board is fabricated with two 25- micrometer-tall polymer rings, sized so that the diaphragms fit inside the rings once the chip is attached.

Double sided circuit board and a method for its manufacture

DOEpatents

Lindenmeyer, Carl W.

1989-01-01

Conductance between the sides of a large double sided printed circuit board is provided using a method which eliminates the need for chemical immersion or photographic exposure of the entire large board. A plurality of through-holes are drilled or punched in a substratum according to the desired pattern, conductive laminae are made to adhere to both sides of the substratum covering the holes and the laminae are pressed together and permanently joined within the holes, providing conductive paths.

Double sided circuit board and a method for its manufacture

DOEpatents

Lindenmeyer, C.W.

1988-04-14

Conductance between the sides of a large double sided printed circuit board is provided using a method which eliminates the need for chemical immersion or photographic exposure of the entire large board. A plurality of through-holes are drilled or punched in a substratum according to the desired pattern, conductive laminae are made to adhere to both sides of the substratum covering the holes and the laminae are pressed together and permanently joined within the holes, providing conductive paths. 4 figs.

Double sided circuit board and a method for its manufacture

DOEpatents

Lindenmeyer, Carl W.

1989-07-04

Conductance between the sides of a large double sided printed circuit board is provided using a method which eliminates the need for chemical immersion or photographic exposure of the entire large board. A plurality of through-holes are drilled or punched in a substratum according to the desired pattern, conductive laminae are made to adhere to both sides of the substratum covering the holes and the laminae are pressed together and permanently joined within the holes, providing conductive paths.

Circuit board routing attachment for Fermilab Gerber plotter

DOE Office of Scientific and Technical Information (OSTI.GOV)

Lindenmeyer, C.

1984-05-10

A new and potentially important method of producing large circuit boards has been developed at Fermilab. A Gerber Flat Bed Plotter with an active area of 5' x 16' has been fitted with a machining head to produce a circuit board without the use of photography or chemicals. The modifications of the Gerber Plotter do not impair its use as a photoplotter or pen plotter, the machining head is merely exchanged with the standard attachments. The modifications to the program are minimal; this will be described in another report. The machining head is fitted with an air bearing motorized spindlemore » driven at a speed of 40,000 rpm to 90,000 rpm. The spindle also is provided with air bearings on its outside diameter, offering frictionless vertical travel guidance. Vertical travel of the spindle is driven by a spring return single acting air cylinder. An adjustable hydraulic damper slows the spindle travel near the end of its downward stroke. Two programmable stops control spindle down stroke position, and limit switches are provided for position feedback to the control system. A vacuum system collects chips at the cutter head. No lubrication or regular maintenance is required. The circuit board to be fabricated is supported on a porous plastic mat which allows table vacuum to hold the board in place while allowing the cutters or drills to cut through the board without damaging the rubber platen of the plotter. The perimeter of the board must be covered to the limits of the table vacuum area used to prevent excessive leakage.« less

Glass Fibers for Printed Circuit Boards

NASA Astrophysics Data System (ADS)

Longobardo, Anthony V.

Fiberglass imparts numerous positive benefits to modern printed circuit boards. Reinforced laminate composites have an excellent cost-performance relationship that makes sense for most applications. At the leading edge of the technology, new glass fibers with improved properties, in combination with the best resin systems available, are able to meet very challenging performance, cost, and regulatory demands while remaining manufacturable.

Printed-Circuit-Board Soldering Training for Group IV Personnel.

ERIC Educational Resources Information Center

Hooprich, E. A.; Matlock, E. W.

As part of a larger program to determine which Navy skills can be learned by lower aptitude personnel, and which methods and techniques would be most effective, an experimental course in printed circuit board soldering was given to 186 Group IV students in 13 classes. Two different training approaches--one stressing instructor guidance and the…

Interface between a printed circuit board computer aided design tool (Tektronix 4051 based) and a numerical paper tape controlled drill press (Slo-Syn 530: 100 w/ Dumore Automatic Head Number 8391)

DOE Office of Scientific and Technical Information (OSTI.GOV)

Heckman, B.K.; Chinn, V.K.

1981-01-01

The development and use of computer programs written to produce the paper tape needed for the automation, or numeric control, of drill presses employed to fabricate computed-designed printed circuit boards are described. (LCL)

Detection of Banned and Restricted Ozone-Depleting Chemicals in Printed Circuit Boards

DOE Office of Scientific and Technical Information (OSTI.GOV)

Lee, Richard N.; Wright, Bob W.

2008-12-01

A study directed toward the detection of halogenated solvents in the matrix of circuit boards has recently been completed. This work was undertaken to demonstrate the potential for reliable detection of solvents used during the fabrication of printed circuit boards (PCB). Since many of these solvents are now, or soon will be, restricted under the terms of legislation enacted in response to the Montreal Protocol and other international agreements, the work described here, conducted over a period of more that 4 years, has provided guidance for the development of chromatographic system and analytical protocol to assure compliance with regulations introducedmore » to control, or ban, industrial solvents associated with adverse environmental impact.« less

Advanced On-Board Processor (AOP). [for future spacecraft applications

NASA Technical Reports Server (NTRS)

1973-01-01

Advanced On-board Processor the (AOP) uses large scale integration throughout and is the most advanced space qualified computer of its class in existence today. It was designed to satisfy most spacecraft requirements which are anticipated over the next several years. The AOP design utilizes custom metallized multigate arrays (CMMA) which have been designed specifically for this computer. This approach provides the most efficient use of circuits, reduces volume, weight, assembly costs and provides for a significant increase in reliability by the significant reduction in conventional circuit interconnections. The required 69 CMMA packages are assembled on a single multilayer printed circuit board which together with associated connectors constitutes the complete AOP. This approach also reduces conventional interconnections thus further reducing weight, volume and assembly costs.

A Formal Algorithm for Routing Traces on a Printed Circuit Board

NASA Technical Reports Server (NTRS)

Hedgley, David R., Jr.

1996-01-01

This paper addresses the classical problem of printed circuit board routing: that is, the problem of automatic routing by a computer other than by brute force that causes the execution time to grow exponentially as a function of the complexity. Most of the present solutions are either inexpensive but not efficient and fast, or efficient and fast but very costly. Many solutions are proprietary, so not much is written or known about the actual algorithms upon which these solutions are based. This paper presents a formal algorithm for routing traces on a print- ed circuit board. The solution presented is very fast and efficient and for the first time speaks to the question eloquently by way of symbolic statements.

Attachment method for stacked integrated circuit (IC) chips

DOEpatents

Bernhardt, A.F.; Malba, V.

1999-08-03

An attachment method for stacked integrated circuit (IC) chips is disclosed. The method involves connecting stacked chips, such as DRAM memory chips, to each other and/or to a circuit board. Pads on the individual chips are rerouted to form pads on the side of the chip, after which the chips are stacked on top of each other whereby desired interconnections to other chips or a circuit board can be accomplished via the side-located pads. The pads on the side of a chip are connected to metal lines on a flexible plastic tape (flex) by anisotropically conductive adhesive (ACA). Metal lines on the flex are likewise connected to other pads on chips and/or to pads on a circuit board. In the case of a stack of DRAM chips, pads to corresponding address lines on the various chips may be connected to the same metal line on the flex to form an address bus. This method has the advantage of reducing the number of connections required to be made to the circuit board due to bussing; the flex can accommodate dimensional variation in the alignment of chips in the stack; bonding of the ACA is accomplished at low temperature and is otherwise simpler and less expensive than solder bonding; chips can be bonded to the ACA all at once if the sides of the chips are substantially coplanar, as in the case for stacks of identical chips, such as DRAM. 12 figs.

New Platforms for Suborbital Astronomical Observations and In Situ Atmospheric Measurements: Spacecraft, Instruments, and Facilities

NASA Astrophysics Data System (ADS)

Rodway, K.; DeForest, C. E.; Diller, J.; Vilas, F.; Sollitt, L. S.; Reyes, M. F.; Filo, A. S.; Anderson, E.

2014-12-01

Suborbital astronomical observations have over 50 years' history using NASA's sounding rockets and experimental space planes. The new commercial space industry is developing suborbital reusable launch vehicles (sRLV's) to provide low-cost, flexible, and frequent access to space at ~100 km altitude. In the case of XCOR Aerospace's Lynx spacecraft, the vehicle design and capabilities work well for hosting specially designed experiments that can be flown with a human-tended researcher or alone with the pilot on a customized mission. Some of the first-generation instruments and facilities that will conduct solar observations on dedicated Lynx science missions include the SwRI Solar Instrument Pointing Platform (SSIPP) and Atsa Suborbital Observatory, as well as KickSat sprites, which are picosatellites for in situ atmospheric and solar phenomena measurements. The SSIPP is a demonstration two-stage pointed solar observatory that operates inside the Lynx cockpit. The coarse pointing stage includes the pilot in the feedback loop, and the fine stage stabilizes the solar image to achieve arcsecond class pointing. SSIPP is a stepping-stone to future external instruments that can operate with larger apertures and shorter wavelengths in the solar atmosphere. The Planetary Science Institute's Atsa Suborbital Observatory combines the strengths of ground-based observatories and space-based observing to create a facility where a telescope is maintained and used interchangeably with either in-house facility instruments or user-provided instruments. The Atsa prototype is a proof of concept, hand-guided camera that mounts on the interior of the Lynx cockpit to test target acquisition and tracking for human-operated suborbital astronomy. KickSat sprites are mass-producible, one inch printed circuit boards (PCBs) populated by programmable off the shelf microprocessors and radios for real time data transmission. The sprite PCBs can integrate chip-based radiometers, magnetometers, accelerometers, etc. This low-cost, customizable platform provides researchers the ability to design immediately responsive, repeatable, high resolution experiments.

Interface Circuit Board For Space-Shuttle Communications

NASA Technical Reports Server (NTRS)

Parrish, Brett T.

1995-01-01

Report describes interface electronic circuit developed to enable ground controllers to send commands and data via Ku-band radio uplink to multiple circuits connected to standard IEEE-488 general-purpose interface bus in space shuttle. Design of circuit extends data-throughput capability of communication system.

High stability amplifier

NASA Technical Reports Server (NTRS)

Adams, W. A.; Reinhardt, V. S. (Inventor)

1983-01-01

An electrical RF signal amplifier for providing high temperature stability and RF isolation and comprised of an integrated circuit voltage regulator, a single transistor, and an integrated circuit operational amplifier mounted on a circuit board such that passive circuit elements are located on side of the circuit board while the active circuit elements are located on the other side is described. The active circuit elements are embedded in a common heat sink so that a common temperature reference is provided for changes in ambient temperature. The single transistor and operational amplifier are connected together to form a feedback amplifier powered from the voltage regulator with transistor implementing primarily the desired signal gain while the operational amplifier implements signal isolation. Further RF isolation is provided by the voltage regulator which inhibits cross-talk from other like amplifiers powered from a common power supply. Input and output terminals consisting of coaxial connectors are located on the sides of a housing in which all the circuit components and heat sink are located.

All-semiconductor metamaterial-based optical circuit board at the microscale

DOE Office of Scientific and Technical Information (OSTI.GOV)

Min, Li; Huang, Lirong, E-mail: lrhuang@hust.edu.cn

2015-07-07

The newly introduced metamaterial-based optical circuit, an analogue of electronic circuit, is becoming a forefront topic in the fields of electronics, optics, plasmonics, and metamaterials. However, metals, as the commonly used plasmonic elements in an optical circuit, suffer from large losses at the visible and infrared wavelengths. We propose here a low-loss, all-semiconductor metamaterial-based optical circuit board at the microscale by using interleaved intrinsic GaAs and doped GaAs, and present the detailed design process for various lumped optical circuit elements, including lumped optical inductors, optical capacitors, optical conductors, and optical insulators. By properly combining these optical circuit elements and arrangingmore » anisotropic optical connectors, we obtain a subwavelength optical filter, which can always hold band-stop filtering function for various polarization states of the incident electromagnetic wave. All-semiconductor optical circuits may provide a new opportunity in developing low-power and ultrafast components and devices for optical information processing.« less

A filter circuit board for the Earthworm Seismic Data Acquisition System

USGS Publications Warehouse

Jensen, Edward Gray

2000-01-01

The Earthworm system is a seismic network data acquisition and processing system used by the Northern California Seismic Network as well as many other seismic networks. The input to the system is comprised of many realtime electronic waveforms fed to a multi-channel digitizer on a PC platform. The digitizer consists of one or more National Instruments Corp. AMUX–64T multiplexer boards attached to an A/D converter board located in the computer. Originally, passive filters were installed on the multiplexers to eliminate electronic noise picked up in cabling. It was later discovered that a small amount of crosstalk occurred between successive channels in the digitizing sequence. Though small, this crosstalk will cause what appear to be small earthquake arrivals at the wrong time on some channels. This can result in erroneous calculation of earthquake arrival times, particularly by automated algorithms. To deal with this problem, an Earthworm filter board was developed to provide the needed filtering while eliminating crosstalk. This report describes the tests performed to find a suitable solution, and the design of the circuit board. Also included are all the details needed to build and install this board in an Earthworm system or any other system using the AMUX–64T board. Available below is the report in PDF format as well as an archive file containing the circuit board manufacturing information.

Microfabricated field calibration assembly for analytical instruments

DOEpatents

Robinson, Alex L [Albuquerque, NM; Manginell, Ronald P [Albuquerque, NM; Moorman, Matthew W [Albuquerque, NM; Rodacy, Philip J [Albuquerque, NM; Simonson, Robert J [Cedar Crest, NM

2011-03-29

A microfabricated field calibration assembly for use in calibrating analytical instruments and sensor systems. The assembly comprises a circuit board comprising one or more resistively heatable microbridge elements, an interface device that enables addressable heating of the microbridge elements, and, in some embodiments, a means for positioning the circuit board within an inlet structure of an analytical instrument or sensor system.

Treatment of Wastewater from Electroplating, Metal Finishing and Printed Circuit Board Manufacturing. Operation of Wastewater Treatment Plants Volume 4.

ERIC Educational Resources Information Center

California State Univ., Sacramento. Dept. of Civil Engineering.

One of four manuals dealing with the operation of wastewater plants, this document was designed to address the treatment of wastewater from electroplating, metal finishing, and printed circuit board manufacturing. It emphasizes how to operate and maintain facilities which neutralize acidic and basic waters; treat waters containing metals; destroy…

Projects made with the Berkeley Lab Circuit Board

Science.gov Websites

dependence of cosmic rays. Greg Poe, a student at Travis High School in Richmond, Texas, received an the journal Physics Education. He used the Berkeley Lab circuit board together with spare parts from New York Schools Cosmic Particle Telescope workshop. Ken Cecire has created a web page which describes

Flip-chip bonded optoelectronic integration based on ultrathin silicon (UTSi) CMOS

NASA Astrophysics Data System (ADS)

Hong, Sunkwang; Ho, Tawei; Zhang, Liping; Sawchuk, Alexander A.

2003-06-01

We describe the design and test of flip-chip bonded optoelectronic CMOS devices based on Peregrine Semiconductor's 0.5 micron Ultra-Thin Silicon on sapphire (UTSi) technology. The UTSi process eliminates the substrate leakage that typically results in crosstalk and reduces parasitic capacitance to the substrate, providing many benefits compared to bulk silicon CMOS. The low-loss synthetic sapphire substrate is optically transparent and has a coefficient of thermal expansion suitable for flip-chip bonding of vertical cavity surface emitting lasers (VCSELs) and detectors. We have designed two different UTSi CMOS chips. One contains a flip-chip bonded 1 x 4 photodiode array, a receiver array, a double edge triggered D-flip flop-based 2047-pattern pseudo random bit stream (PRBS) generator and a quadrature-phase LC-voltage controlled oscillator (VCO). The other chip contains a flip-chip bonded 1 x 4 VCSEL array, a driver array based on high-speed low-voltage differential signals (LVDS) and a full-balanced differential LC-VCO. Each VCSEL driver and receiver has individual input and bias voltage adjustments. Each UTSi chip is mounted on different printed circuit boards (PCBs) which have holes with about 1 mm radius for optical output and input paths through the sapphire substrate. We discuss preliminary testing of these chips.

Design of inductive sensors for tongue control system for computers and assistive devices.

PubMed

Lontis, Eugen R; Struijk, Lotte N S A

2010-07-01

The paper introduces a novel design of air-core inductive sensors in printed circuit board (PCB) technology for a tongue control system. The tongue control system provides a quadriplegic person with a keyboard and a joystick type of mouse for interaction with a computer or for control of an assistive device. Activation of inductive sensors was performed with a cylindrical, soft ferromagnetic material (activation unit). Comparative analysis of inductive sensors in PCB technology with existing hand-made inductive sensors was performed with respect to inductance, resistance, and sensitivity to activation when the activation unit was placed in the center of the sensor. Optimisation of the activation unit was performed in a finite element model. PCBs with air-core inductive sensors were manufactured in a 10 layers, 100 microm and 120 microm line width technology. These sensors provided quality signals that could drive the electronics of the hand-made sensors. Furthermore, changing the geometry of the sensors allowed generation of variable signals correlated with the 2D movement of the activation unit at the sensors' surface. PCB technology for inductive sensors allows flexibility in design, automation of production and ease of possible integration with supplying electronics. The basic switch function of the inductive sensor can be extended to two-dimensional movement detection for pointing devices.

Decontamination of blood soaked electronic devices using ultrasonic technology.

PubMed

Dudeck, Kimberly C; Brennan, Tamara C; Embury, Daniel J

2012-01-10

With advancements in technology allowing for the miniaturization of consumer electronics, criminal investigations of all types frequently involve the forensic examination of electronic devices, such as cellular telephones, smartphones, and portable flash memory; in some extreme, violent cases, these devices are found covered in blood. Due to the complexity of such devices, standard operating procedures for the complete removal of blood had not previously been established by the Royal Canadian Mounted Police prior to this study. The electronics industry has adopted the use of the ultrasonic cleaner for sanitizing printed circuit boards (PCBs) by removing residues and contaminants. High frequency sound waves created by the machine penetrate and remove dirt and residues; however, early research during the 1950s recorded these sound waves breaking the internal bonds of integrated circuit chips. Experimentation with modern ultrasonic technology was used to determine if internal components were damaged, as well as if ultrasonic cleaning was the most suitable method for the removal of dried and liquid blood from a PCB. Several disinfectant solutions were compared against the 0.5% Triton(®) X-100 detergent solution in the ultrasonic cleaner, including: 10% sodium hypochlorite bleach, 85% isopropyl alcohol, and Conflikt(®) disinfectant spray. The results not only demonstrated that the ultrasonic cleaner did not damage the vital memory chip on the PCB, but also, with the assistance of Conflikt(®), was able to remove all traces of blood as indicated by Hemastix(®) reagent strips. Of five methods experimented with, two cycles of ultrasonic cleaning followed by sanitization with Conflikt(®) proved to be the only procedure capable of removing all traces of blood, as confirmed with both Hemastix(®) reagent strips and the hemochromogen test. Crown Copyright © 2011. Published by Elsevier Ireland Ltd. All rights reserved.

[Newly leaching method of copper from waste print circuit board using hydrochloric acid/n-butylamine/copper sulfate].

PubMed

Wang, Hong-Yan; Cui, Zhao-Jie; Yao, Ya-Wei

2010-12-01

A newly leaching method of copper from waste print circuit board was established by using hydrochloric acid-n-butylamine-copper sulfate mixed solution. The conditions of leaching were optimized by changing the hydrochloric acid, n-butylamine, copper sulfate,temperature and other conditions using copper as target mimics. The results indicated that copper could be leached completely after 8 h at 50 degrees C, hydrochloric acid concentration of 1.75 mol/L, n-butylamine concentration of 0.25 mol/L, and copper sulfate mass of 0.96 g. Under the conditions, copper leaching rates in waste print circuit board samples was up to 95.31% after 9 h. It has many advantages such as better effects, low cost, mild reaction conditions, leaching solution recycling.

Coaxial connector for use with printed circuit board edge connector

DOEpatents

Howard, Donald R.; MacGill, Robert A.

1989-01-01

A coaxial cable connector for interfacing with an edge connector for a printed circuit board whereby a coaxial cable can be interconnected with a printed circuit board through the edge connector. The coaxial connector includes a body having two leg portions extending from one side for receiving the edge connector therebetween, and a tubular portion extending from an opposing side for receiving a coaxial cable. A cavity within the body receives a lug of the edge connector and the center conductor of the coaxial cable. Adjacent lugs of the edge connector can be bend around the edge connector housing to function as spring-loaded contacts for receiving the coaxial connector. The lugs also function to facilitate shielding of the center conductor where fastened to the edge connector lug.

78 FR 57648 - Notice of Issuance of Final Determination Concerning Video Teleconferencing Server

Federal Register 2010, 2011, 2012, 2013, 2014

2013-09-19

... the Chinese- origin Video Board and the Filter Board, impart the essential character to the video... includes the codec; a network filter electronic circuit board (``Filter Board''); a housing case; a power... (``Linux software''). The Linux software allows the Filter Board to inspect each Ethernet packet of...

An Approach for Practical Use of Common-Mode Noise Reduction Technique for In-Vehicle Electronic Equipment

NASA Astrophysics Data System (ADS)

Uno, Takanori; Ichikawa, Kouji; Mabuchi, Yuichi; Nakamura, Atsushi; Okazaki, Yuji; Asai, Hideki

In this paper, we studied the use of common-mode noise reduction technique for in-vehicle electronic equipment in an actual instrument design. We have improved the circuit model of the common-mode noise that flows to the wire harness to add the effect of a bypass capacitor located near the LSI. We analyzed the improved circuit model using a circuit simulator and verified the effectiveness of the noise reduction condition derived from the circuit model. It was also confirmed that offsetting the impedance mismatch in the PCB section requires to make a circuit constant larger than that necessary for doing the impedance mismatch in the LSI section. An evaluation circuit board comprising an automotive microcomputer was prototyped to experiment on the common-mode noise reduction effect of the board. The experimental results showed the noise reduction effect of the board. The experimental results also revealed that the degree of impedance mismatch in the LSI section can be estimated by using a PCB having a known impedance. We further inquired into the optimization of impedance parameters, which is difficult for actual products at present. To satisfy the noise reduction condition composed of numerous parameters, we proposed a design method using an optimization algorithm and an electromagnetic field simulator, and confirmed its effectiveness.

Single Circuit Board Implementation of a Digitally Compensated SAW Oscillator (DCSO).

DTIC Science & Technology

1983-12-01

Through this project a design for a Digitally Compensated SAW Oscillator (DCSO) was developed and implemented on a single circuit board. The AFIT IC, which...is the heart of the design , did not function properly. Therefore, my work was halted after testing several of the subcircuits and assembling the...o.... -7 Standards ........ o..o....... -8 Approach-9 Sequence of Presentation .................. -10 II, Design

Music Generated by a Zn/Cu Electrochemical Cell, a Lemon Cell, and a Solar Cell: A Demonstration for General Chemistry

ERIC Educational Resources Information Center

Cady, Susan G.

2014-01-01

The circuit board found in a commercial musical greeting card is used to supply music for electrochemical cell demonstrations. Similar to a voltmeter, the "modified" musical device is connected to a chemical reaction that produces electricity. The commercial 1 V battery inside the greeting card circuit board can be replaced with an…

Cooling/grounding mount for hybrid circuits

NASA Technical Reports Server (NTRS)

Bagstad, B.; Estrada, R.; Mandel, H.

1981-01-01

Extremely short input and output connections, adequate grounding, and efficient heat removal for hybrid integrated circuits are possible with mounting. Rectangular clamp holds hybrid on printed-circuit board, in contact with heat-conductive ground plate. Clamp is attached to ground plane by bolts.

Experimental industrial signal acquisition board in a large scientific device

NASA Astrophysics Data System (ADS)

Zeng, Xiangzhen; Ren, Bin

2018-02-01

In order to measure the industrial signal of neutrino experiment, a set of general-purpose industrial data acquisition board has been designed. It includes the function of switch signal input and output, and the function of analog signal input. The main components are signal isolation amplifier and filter circuit, ADC circuit, microcomputer systems and isolated communication interface circuit. Through the practical experiments, it shows that the system is flexible, reliable, convenient and economical, and the system has characters of high definition and strong anti-interference ability. Thus, the system fully meets the design requirements.

Federal Litigation Arising from Personnel Practices of Southern School Boards from 1970 through 1981 in the Fifth Circuit Court of Appeals Area.

ERIC Educational Resources Information Center

Sistrunk, Walter E.; Guin, Mary Linda

This paper offers administrators, teachers, and school boards an introduction to legal issues surrounding teacher dismissal and school desegregation and summarizes a study of all teacher dismissal cases heard from 1970 through 1981 in the Fifth Circuit Court of Appeals. Most of the report is devoted to an overview of the historical development of…

Unitary Shaft-Angle and Shaft-Speed Sensor Assemblies

NASA Technical Reports Server (NTRS)

Alhorn, Dean C.; Howard, David E.; Smith, Dennis A.

2006-01-01

The figure depicts a unit that contains a rotary-position or a rotary-speed sensor, plus electronic circuitry necessary for its operation, all enclosed in a single housing with a shaft for coupling to an external rotary machine. This rotation sensor unit is complete: when its shaft is mechanically connected to that of the rotary machine and it is supplied with electric power, it generates an output signal directly indicative of the rotary position or speed, without need for additional processing by other circuitry. The incorporation of all of the necessary excitatory and readout circuitry into the housing (in contradistinction to using externally located excitatory and/or readout circuitry) in a compact arrangement is the major difference between this unit and prior rotation-sensor units. The sensor assembly inside the housing includes excitatory and readout integrated circuits mounted on a circular printed-circuit board. In a typical case in which the angle or speed transducer(s) utilize electromagnetic induction, the assembly also includes another circular printed-circuit board on which the transducer windings are mounted. A sheet of high-magnetic permeability metal ("mu metal") is placed between the winding board and the electronic-circuit board to prevent spurious coupling of excitatory signals from the transducer windings to the readout circuits. The housing and most of the other mechanical hardware can be common to a variety of different sensor designs. Hence, the unit can be configured to generate any of variety of outputs by changing the interior sensor assembly. For example, the sensor assembly could contain an analog tachometer circuit that generates an output proportional (in both magnitude and sign or in magnitude only) to the speed of rotation.

Metals Recovery from Artificial Ore in Case of Printed Circuit Boards, Using Plasmatron Plasma Reactor

PubMed Central

Szałatkiewicz, Jakub

2016-01-01

This paper presents the investigation of metals production form artificial ore, which consists of printed circuit board (PCB) waste, processed in plasmatron plasma reactor. A test setup was designed and built that enabled research of plasma processing of PCB waste of more than 700 kg/day scale. The designed plasma process is presented and discussed. The process in tests consumed 2 kWh/kg of processed waste. Investigation of the process products is presented with their elemental analyses of metals and slag. The average recovery of metals in presented experiments is 76%. Metals recovered include: Ag, Au, Pd, Cu, Sn, Pb, and others. The chosen process parameters are presented: energy consumption, throughput, process temperatures, and air consumption. Presented technology allows processing of variable and hard-to-process printed circuit board waste that can reach up to 100% of the input mass. PMID:28773804

Metals Recovery from Artificial Ore in Case of Printed Circuit Boards, Using Plasmatron Plasma Reactor.

PubMed

Szałatkiewicz, Jakub

2016-08-10

This paper presents the investigation of metals production form artificial ore, which consists of printed circuit board (PCB) waste, processed in plasmatron plasma reactor. A test setup was designed and built that enabled research of plasma processing of PCB waste of more than 700 kg/day scale. The designed plasma process is presented and discussed. The process in tests consumed 2 kWh/kg of processed waste. Investigation of the process products is presented with their elemental analyses of metals and slag. The average recovery of metals in presented experiments is 76%. Metals recovered include: Ag, Au, Pd, Cu, Sn, Pb, and others. The chosen process parameters are presented: energy consumption, throughput, process temperatures, and air consumption. Presented technology allows processing of variable and hard-to-process printed circuit board waste that can reach up to 100% of the input mass.

Cleaning of printed circuit assemblies with surface-mounted components

NASA Astrophysics Data System (ADS)

Arzigian, J. S.

The need for ever-increasing miniaturization of airborne instrumentation through the use of surface mounted components closely placed on printed circuit boards highlights problems with traditional board cleaning methods. The reliability of assemblies which have been cleaned with vapor degreasing and spray cleaning can be seriously compromised by residual contaminants leading to solder joint failure, board corrosion, and even electrical failure of the mounted parts. In addition, recent government actions to eliminate fully halogenated chlorofluorocarbons (CFC) and chlorinated hydrocarbons from the industrial environment require the development of new cleaning materials and techniques. This paper discusses alternative cleaning materials and techniques and results that can be expected with them. Particular emphasis is placed on problems related to surface-mounted parts. These new techniques may lead to improved circuit reliability and, at the same time, be less expensive and less environmentally hazardous than the traditional systems.

Testing interconnected VLSI circuits in the Big Viterbi Decoder

NASA Technical Reports Server (NTRS)

Onyszchuk, I. M.

1991-01-01

The Big Viterbi Decoder (BVD) is a powerful error-correcting hardware device for the Deep Space Network (DSN), in support of the Galileo and Comet Rendezvous Asteroid Flyby (CRAF)/Cassini Missions. Recently, a prototype was completed and run successfully at 400,000 or more decoded bits per second. This prototype is a complex digital system whose core arithmetic unit consists of 256 identical very large scale integration (VLSI) gate-array chips, 16 on each of 16 identical boards which are connected through a 28-layer, printed-circuit backplane using 4416 wires. Special techniques were developed for debugging, testing, and locating faults inside individual chips, on boards, and within the entire decoder. The methods are based upon hierarchical structure in the decoder, and require that chips or boards be wired themselves as Viterbi decoders. The basic procedure consists of sending a small set of known, very noisy channel symbols through a decoder, and matching observables against values computed by a software simulation. Also, tests were devised for finding open and short-circuited wires which connect VLSI chips on the boards and through the backplane.

Evaluation of test equipment for the detection of contamination on electronic circuits

NASA Astrophysics Data System (ADS)

Bergendahl, C. G.; Dunn, B. D.

1984-08-01

The reproducibility, sensitivity and ease of operation of test equipment for the detection of ionizable contaminants on the surface of printed circuit assemblies were assessed. The characteristics of the test equipment are described. Soldering fluxes were chosen as contaminants and were applied in controlled amounts to printed-circuit board assemblies possessing two different component populations. Results show that the relationship between equipment readings varies with flux type. Each kind of test equipment gives a good measure of board cleanliness, although reservations exist concerning the interpretation of such results. A test method for the analysis of total (organic and inorganic) halides in solder fluxes is presented.

Optical interconnect technologies for high-bandwidth ICT systems

NASA Astrophysics Data System (ADS)

Chujo, Norio; Takai, Toshiaki; Mizushima, Akiko; Arimoto, Hideo; Matsuoka, Yasunobu; Yamashita, Hiroki; Matsushima, Naoki

2016-03-01

The bandwidth of information and communication technology (ICT) systems is increasing and is predicted to reach more than 10 Tb/s. However, an electrical interconnect cannot achieve such bandwidth because of its density limits. To solve this problem, we propose two types of high-density optical fiber wiring for backplanes and circuit boards such as interface boards and switch boards. One type uses routed ribbon fiber in a circuit board because it has the ability to be formed into complex shapes to avoid interfering with the LSI and electrical components on the board. The backplane is required to exhibit high density and flexibility, so the second type uses loose fiber. We developed a 9.6-Tb/s optical interconnect demonstration system using embedded optical modules, optical backplane, and optical connector in a network apparatus chassis. We achieved 25-Gb/s transmission between FPGAs via the optical backplane.

In-line rotating torque sensor with on-board amplifier

DOEpatents

Kronberg, James W.

1990-01-01

A rotating torque sensor apparatus and method for measuring small torques comprising a shaft, a platform having a circuit board and a first moment arm attached to the shaft, a rotatable wheel coaxial with the shaft and having a second moment arm spaced apart from the first moment arm with a load cell therebetween for generating an electric signal as the torque is applied to the shaft and transferred through the moment arms to the load cell. The electrical signal is conducted from the load cell to the circuit board for filtering and amplification before being extracted from the torque assembly through a slip ring.

Bright Ideas for Measuring Light.

ERIC Educational Resources Information Center

Amend, John R.; Schuler, John A.

1983-01-01

Describes an inexpensive device (around $8.00) for measuring light. The circuit used includes five resistors, three small capacitors, a cadmium sulfide light sensor, two integrated circuits, and two light-emitting diodes. The unit is constructed on a small perforated circuit board and powered by a 9-V transistor radio battery. (JN)

Shock absorbing mount for electrical components

NASA Technical Reports Server (NTRS)

Dillon, R. F., Jr.; Mayne, R. C. (Inventor)

1975-01-01

A shock mount for installing electrical components on circuit boards is described. The shock absorber is made of viscoelastic material which interconnects the electrical components. With this system, shocks imposed on one component of the circuit are not transmitted to other components. A diagram of a typical circuit is provided.

Application of industrial robots in automatic disassembly line of waste LCD displays

NASA Astrophysics Data System (ADS)

Wang, Sujuan

2017-11-01

In the automatic disassembly line of waste LCD displays, LCD displays are disassembled into plastic shells, metal shields, circuit boards, and LCD panels. Two industrial robots are used to cut metal shields and remove circuit boards in this automatic disassembly line. The functions of these two industrial robots, and the solutions to the critical issues of model selection, the interfaces with PLCs and the workflows were described in detail in this paper.

Comparative analysis of single-walled and multi-walled carbon nanotubes for electrochemical sensing of glucose on gold printed circuit boards.

PubMed

Alhans, Ruby; Singh, Anukriti; Singhal, Chaitali; Narang, Jagriti; Wadhwa, Shikha; Mathur, Ashish

2018-09-01

In the present work, a comparative study was performed between single-walled carbon nanotubes and multi-walled carbon nanotubes coated gold printed circuit board electrodes for glucose detection. Various characterization techniques were demonstrated in order to compare the modified electrodes viz. cyclic voltammetry, electrochemical impedance spectroscopy and chrono-amperometry. Results revealed that single-walled carbon nanotubes outperformed multi-walled carbon nanotubes and proved to be a better sensing interface for glucose detection. The single-walled carbon nanotubes coated gold printed circuit board electrodes showed a wide linear sensing range (1 mM to 100 mM) with detection limit of 0.1 mM with response time of 5 s while multi-walled carbon nanotubes coated printed circuit board gold electrodes showed linear sensing range (1 mM to 100 mM) with detection limit of 0.1 mM with response time of 5 s. This work provided low cost sensors with enhanced sensitivity, fast response time and reliable results for glucose detection which increased the affordability of such tests in remote areas. In addition, the comparative results confirmed that single-walled carbon nanotubes modified electrodes can be exploited for better amplification signal as compared to multi-walled carbon nanotubes. Copyright © 2018. Published by Elsevier B.V.

Learning high-quality soldering

NASA Technical Reports Server (NTRS)

Read, W. S.

1981-01-01

Soldering techniques for high-reliability electronic equipment are taught in 5 day course at NASA's Jet Propulsion Laboratory. Topic covered include new circuit assembly, printed-wiring board reworking, circuit changes, wire routing, and component installation.

Chemical and biological processes for multi-metal extraction from waste printed circuit boards of computers and mobile phones.

PubMed

Shah, Monal B; Tipre, Devayani R; Dave, Shailesh R

2014-11-01

E-waste printed circuit boards (PCB) of computers, mobile-phones, televisions, LX (LongXiang) PCB in LED lights and bulbs, and tube-lights were crushed to ≥250 µm particle size and 16 different metals were analysed. A comparative study has been carried out to evaluate the extraction of Cu-Zn-Ni from computer printed circuit boards (c-PCB) and mobile-phone printed circuit boards (m-PCB) by chemical and biological methods. Chemical process showed the extraction of Cu-Zn-Ni by ferric sulphate was best among the studied chemical lixiviants. Bioleaching experiments were carried out with the iron oxidising consortium, which showed that when E-waste and inoculum were added simultaneously in the medium (one-step process); 60.33% and 87.50% Cu, 75.67% and 85.67% Zn and 71.09% and 81.87% Ni were extracted from 10 g L(-1) of c-PCB and m-PCB, respectively, within 10-15 days of reaction time. Whereas, E-waste added after the complete oxidation of Fe(2+) to Fe(3+) iron containing medium (two-step process) showed 85.26% and 99.99% Cu, 96.75% and 99.49% Zn and 93.23% and 84.21% Ni extraction from c-PCB and m-PCB, respectively, only in 6-8 days. Influence of varying biogenerated Fe(3+) and c-PCB concentrations showed that 16.5 g L(-1) of Fe(3+) iron was optimum up to 100 g L(-1) of c-PCB. Changes in pH, acid consumed and redox potential during the process were also studied. The present study shows the ability of an eco-friendly process for the recovery of multi-metals from E-waste even at 100 g L(-1) printed circuit boards concentration. © The Author(s) 2014.

Advances in LED packaging and thermal management materials

NASA Astrophysics Data System (ADS)

Zweben, Carl

2008-02-01

Heat dissipation, thermal stresses and cost are key light-emitting diode (LED) packaging issues. Heat dissipation limits power levels. Thermal stresses affect performance and reliability. Copper, aluminum and conventional polymeric printed circuit boards (PCBs) have high coefficients of thermal expansion, which can cause high thermal stresses. Most traditional low-coefficient-of-thermal-expansion (CTE) materials like tungsten/copper, which date from the mid 20th century, have thermal conductivities that are no better than those of aluminum alloys, about 200 W/m-K. An OIDA LED workshop cited a need for better thermal materials. There are an increasing number of low-CTE materials with thermal conductivities ranging between that of copper (400 W/m-K) and 1700 W/m-K, and many other low-CTE materials with lower thermal conductivities. Some of these materials are low cost. Others have the potential to be low cost in high-volume production. High-thermal-conductivity materials enable higher power levels, potentially reducing the number of required LEDs. Advanced thermal materials can constrain PCB CTE and greatly increase thermal conductivity. This paper reviews traditional packaging materials and advanced thermal management materials. The latter provide the packaging engineer with a greater range of options than in the past. Topics include properties, status, applications, cost, using advanced materials to fix manufacturing problems, and future directions, including composites reinforced with carbon nanotubes and other thermally conductive materials.

46 CFR 28.370 - Wiring methods and materials.

Code of Federal Regulations, 2014 CFR

2014-10-01

... that affects one cable does not affect the other. (d) Cable and wire for power and lighting circuits... Operate With More Than 16 Individuals on Board § 28.370 Wiring methods and materials. (a) All cable and... circuit. (b) Each conductor must be No. 22 AWG or larger. Conductors in power and lighting circuits must...

46 CFR 28.370 - Wiring methods and materials.

Code of Federal Regulations, 2012 CFR

2012-10-01

... that affects one cable does not affect the other. (d) Cable and wire for power and lighting circuits... Operate With More Than 16 Individuals on Board § 28.370 Wiring methods and materials. (a) All cable and... circuit. (b) Each conductor must be No. 22 AWG or larger. Conductors in power and lighting circuits must...

46 CFR 28.370 - Wiring methods and materials.

Code of Federal Regulations, 2013 CFR

2013-10-01

... that affects one cable does not affect the other. (d) Cable and wire for power and lighting circuits... Operate With More Than 16 Individuals on Board § 28.370 Wiring methods and materials. (a) All cable and... circuit. (b) Each conductor must be No. 22 AWG or larger. Conductors in power and lighting circuits must...

Silicon Carbide Integrated Circuit Chip

NASA Image and Video Library

2015-02-17

A multilevel interconnect silicon carbide integrated circuit chip with co-fired ceramic package and circuit board recently developed at the NASA GRC Smart Sensors and Electronics Systems Branch for high temperature applications. High temperature silicon carbide electronics and compatible packaging technologies are elements of instrumentation for aerospace engine control and long term inner-solar planet explorations.

Flexible programmable logic module

DOEpatents

Robertson, Perry J.; Hutchinson, Robert L.; Pierson, Lyndon G.

2001-01-01

The circuit module of this invention is a VME board containing a plurality of programmable logic devices (PLDs), a controlled impedance clock tree, and interconnecting buses. The PLDs are arranged to permit systolic processing of a problem by offering wide data buses and a plurality of processing nodes. The board contains a clock reference and clock distribution tree that can drive each of the PLDs with two critically timed clock references. External clock references can be used to drive additional circuit modules all operating from the same synchronous clock reference.

Information Switching Processor (ISP) contention analysis and control

NASA Technical Reports Server (NTRS)

Inukai, Thomas

1995-01-01

In designing a satellite system with on-board processing, the selection of a switching architecture is often critical. The on-board switching function can be implemented by circuit switching or packet switching. Destination-directed packet switching has several attractive features, such as self-routing without on-board switch reconfiguration, no switch control memory requirement, efficient bandwidth utilization for packet switched traffic, and accommodation of circuit switched traffic. Destination-directed packet switching, however, has two potential concerns: (1) contention and (2) congestion. And this report specifically deals with the first problem. It includes a description and analysis of various self-routing switch structures, the nature of contention problems, and contention and resolution techniques.

Test Bench for Coupling and Shielding Magnetic Fields

NASA Astrophysics Data System (ADS)

Jordan, J.; Esteve, V.; Dede, E.; Sanchis, E.; Maset, E.; Ferreres, A.; Ejea, J. B.; Cases, C.

2016-05-01

This paper describes a test bench for training purposes, which uses a magnetic field generator to couple this magnetic field to a victim circuit. It can be very useful to test for magnetic susceptibility as well. The magnetic field generator consists of a board, which generates a variable current that flows into a printed circuit board with spiral tracks (noise generator). The victim circuit consists of a coaxial cable concentric with the spiral tracks and its generated magnetic field. The coaxial cable is part of a circuit which conducts a signal produced by a signal generator and a resistive load. In the paper three cases are studied. First, the transmitted signal from the signal generator uses the central conductor of the coaxial cable and the shield is floating. Second, the shield is short circuited at its ends (and thus forming a loop). Third, when connecting the shield in series with the inner conductor and therefore having the current flowing into the coax via the inner conductor and returning via the shield.

Study of Photosensitive Dry Films Absorption for Printed Circuit Boards by Photoacoustic Technique

NASA Astrophysics Data System (ADS)

Hernández, R.; Zaragoza, J. A. Barrientos; Jiménez-Pérez, J. L.; Orea, A. Cruz; Correa-Pacheco, Z. N.

2017-08-01

In this work, the study of photosensitive dry-type films by photoacoustic technique is proposed. The dry film photoresist is resistant to chemical etching for printed circuit boards such as ferric chloride, sodium persulfate or ammonium, hydrochloric acid. It is capable of faithfully reproducing circuit pattern exposed to ultraviolet light (UV) through a negative. Once recorded, the uncured portion is removed with alkaline solution. It is possible to obtain good results in surface mount circuits with tracks of 5 mm. Furthermore, the solid resin films are formed by three layers, two protective layers and a UV-sensitive optical absorption layer in the range of 325 nm to 405 nm. By means of optical absorption of UV-visible rays emitted by a low-power Xe lamp, the films transform this energy into thermal waves generated by the absorption of optical radiation and subsequently no-radiative de-excitation occurs. The photoacoustic spectroscopy is a useful technique to measure the transmittance and absorption directly. In this study, the optical absorption spectra of the three layers of photosensitive dry-type films were obtained as a function of the wavelength, in order to have a knowledge of the absorber layer and the protective layers. These analyses will give us the physical properties of the photosensitive film, which are very important in curing the dry film for applications in printed circuit boards.

Feasibility Test of a Liquid Film Thickness Sensor on a Flexible Printed Circuit Board Using a Three-Electrode Conductance Method

PubMed Central

Lee, Kyu Byung; Kim, Jong Rok; Park, Goon Cherl; Cho, Hyoung Kyu

2016-01-01

Liquid film thickness measurements under temperature-varying conditions in a two-phase flow are of great importance to refining our understanding of two-phase flows. In order to overcome the limitations of the conventional electrical means of measuring the thickness of a liquid film, this study proposes a three-electrode conductance method, with the device fabricated on a flexible printed circuit board (FPCB). The three-electrode conductance method offers the advantage of applicability under conditions with varying temperatures in principle, while the FPCB has the advantage of usability on curved surfaces and in relatively high-temperature conditions in comparison with sensors based on a printed circuit board (PCB). Two types of prototype sensors were fabricated on an FPCB and the feasibility of both was confirmed in a calibration test conducted at different temperatures. With the calibrated sensor, liquid film thickness measurements were conducted via a falling liquid film flow experiment, and the working performance was tested. PMID:28036000

The separation of waste printed circuit board by dissolving bromine epoxy resin using organic solvent.

PubMed

Zhu, P; Chen, Y; Wang, L Y; Zhou, M; Zhou, J

2013-02-01

Separation of waste printed circuit boards (WPCBs) has been a bottleneck in WPCBs resource processing. In this study, the separation of WPCBs was performed using dimethyl sulfoxide (DMSO) as a solvent. Various parameters, which included solid to liquid ratio, temperature, WPCB sizes, and time, were studied to understand the separation of WPCBs by dissolving bromine epoxy resin using DMSO. Experimental results showed that the concentration of dissolving the bromine epoxy resin increased with increasing various parameters. The optimum condition of complete separation of WPCBs was solid to liquid ratio of 1:7 and WPCB sizes of 16 mm(2) at 145°C for 60 min. The used DMSO was vapored under the decompression, which obtained the regenerated DMSO and dissolved bromine epoxy resin. This clean and non-polluting technology offers a new way to separate valuable materials from WPCBs and prevent the environmental pollution of waste printed circuit boards effectively. Crown Copyright © 2012. Published by Elsevier Ltd. All rights reserved.

78 FR 69927 - SJI Board of Directors Meeting, Notice

Federal Register 2010, 2011, 2012, 2013, 2014

2013-11-21

... STATE JUSTICE INSTITUTE SJI Board of Directors Meeting, Notice AGENCY: State Justice Institute. ACTION: Notice of meeting. SUMMARY: The SJI Board of Directors will be meeting on Monday, December 9, 2013 at 1:00 p.m. The meeting will be held at the 9th Judicial Circuit of Florida in Orlando, Florida...

Method for reworkable packaging of high speed, low electrical parasitic power electronics modules through gate drive integration

DOEpatents

Passmore, Brandon; Cole, Zach; Whitaker, Bret; Barkley, Adam; McNutt, Ty; Lostetter, Alexander

2016-08-02

A multichip power module directly connecting the busboard to a printed-circuit board that is attached to the power substrate enabling extremely low loop inductance for extreme environments such as high temperature operation. Wire bond interconnections are taught from the power die directly to the busboard further enabling enable low parasitic interconnections. Integration of on-board high frequency bus capacitors provide extremely low loop inductance. An extreme environment gate driver board allows close physical proximity of gate driver and power stage to reduce overall volume and reduce impedance in the control circuit. Parallel spring-loaded pin gate driver PCB connections allows a reliable and reworkable power module to gate driver interconnections.

Recovery of gold from computer circuit board scrap using aqua regia.

PubMed

Sheng, Peter P; Etsell, Thomas H

2007-08-01

Computer circuit board scrap was first treated with one part concentrated nitric acid and two parts water at 70 degrees C for 1 h. This step dissolved the base metals, thereby liberating the chips from the boards. After solid-liquid separation, the chips, intermixed with some metallic flakes and tin oxide precipitate, were mechanically crushed to liberate the base and precious metals contained within the protective plastic or ceramic chip cases. The base metals in this crushed product were dissolved by leaching again with the same type of nitric acid-water solution. The remaining solid constituents, crushed chips and resin, plus solid particles of gold, were leached with aqua regia at various times and temperatures. Gold was precipitated from the leachate with ferrous sulphate.

Electro-optical line cards with multimode polymer waveguides for chip-to-chip interconnects

NASA Astrophysics Data System (ADS)

Zhu, Long Xiu; Immonen, Marika; Wu, Jinhua; Yan, Hui Juan; Shi, Ruizhi; Chen, Peifeng; Rapala-Virtanen, Tarja

2014-10-01

In this paper, we report developments of electro-optical PCBs (EO-PCB) with low-loss (<0.05dB/cm) polymer waveguides. Our results shows successful fabrication of complex waveguide structures part of hybrid EO-PCBs utilizing production scale process on standard board panels. Test patterns include 90° bends of varying radii (40mm - 2mm), waveguide crossing with varied crossing angles (90°-20°), cascaded bends with varying radii, splitters and tapered waveguides. Full ranges of geometric configurations are required to meet practical optical routing functions and layouts. Moreover, we report results obtained to realize structures to integrate optical connectors with waveguides. Experimental results are shown for MT in-plane and 90° out-of-plane optical connectors realized with coupling loss < 2dB and < 2.5 dB, respectively. These connectors are crucial to realize efficient light coupling from/to TX/RX chip-to-waveguide and within waveguide-to-fiber connections in practical optical PCBs. Furthermore, we show results for fabricating electrical interconnect structures e.g. tracing layers, vias, plated vias top/bottom and through optical layers. Process compatibility with accepted practices and production scale up for high volumes are key concerns to meet the yield target and cost efficiency. Results include waveguide characterization, transmission loss, misalignment tolerance, and effect of lamination. Critical link metrics are reported.

77 FR 7562 - Electronic On-Board Recorders and Hours of Service Supporting Documents

Federal Register 2010, 2011, 2012, 2013, 2014

2012-02-13

..., and 395 [Docket No. FMCSA-2010-0167] RIN 2126-AB20 Electronic On-Board Recorders and Hours of Service... intent. SUMMARY: FMCSA announces its intent to move forward with the Electronic On-Board Recorders and... Appeals for the Seventh Circuit. OOIDA raised several concerns relating to EOBRs and their potential use...

Hazardous Waste Cleanup: Marlborough Press LTD in Plainview, New York

EPA Pesticide Factsheets

This parcel is located in an industrial park in Plainview, Nassau County, New York. It was operated as Three Dimensional Circuits from 1970 to 1984, manufacturing electronic circuit boards. During its operation, the site discharged metal plating solutions

Assembling surface mounted components on ink-jet printed double sided paper circuit board.

PubMed

Andersson, Henrik A; Manuilskiy, Anatoliy; Haller, Stefan; Hummelgård, Magnus; Sidén, Johan; Hummelgård, Christine; Olin, Håkan; Nilsson, Hans-Erik

2014-03-07

Printed electronics is a rapidly developing field where many components can already be manufactured on flexible substrates by printing or by other high speed manufacturing methods. However, the functionality of even the most inexpensive microcontroller or other integrated circuit is, at the present time and for the foreseeable future, out of reach by means of fully printed components. Therefore, it is of interest to investigate hybrid printed electronics, where regular electrical components are mounted on flexible substrates to achieve high functionality at a low cost. Moreover, the use of paper as a substrate for printed electronics is of growing interest because it is an environmentally friendly and renewable material and is, additionally, the main material used for many packages in which electronics functionalities could be integrated. One of the challenges for such hybrid printed electronics is the mounting of the components and the interconnection between layers on flexible substrates with printed conductive tracks that should provide as low a resistance as possible while still being able to be used in a high speed manufacturing process. In this article, several conductive adhesives are evaluated as well as soldering for mounting surface mounted components on a paper circuit board with ink-jet printed tracks and, in addition, a double sided Arduino compatible circuit board is manufactured and programmed.

Spacecube V2.0 Micro Single Board Computer

NASA Technical Reports Server (NTRS)

Petrick, David J. (Inventor); Geist, Alessandro (Inventor); Lin, Michael R. (Inventor); Crum, Gary R. (Inventor)

2017-01-01

A single board computer system radiation hardened for space flight includes a printed circuit board having a top side and bottom side; a reconfigurable field programmable gate array (FPGA) processor device disposed on the top side; a connector disposed on the top side; a plurality of peripheral components mounted on the bottom side; and wherein a size of the single board computer system is not greater than approximately 7 cm.times.7 cm.

Pyrolysis characteristics of integrated circuit boards at various particle sizes and temperatures.

PubMed

Chiang, Hung-Lung; Lin, Kuo-Hsiung; Lai, Mei-Hsiu; Chen, Ting-Chien; Ma, Sen-Yi

2007-10-01

A pyrolysis method was employed to recycle the metals and brominated compounds blended into printed circuit boards. This research investigated the effect of particle size and process temperature on the element composition of IC boards and pyrolytic residues, liquid products, and water-soluble ionic species in the exhaust, with the overall goal being to identify the pyrolysis conditions that will have the least impact on the environment. Integrated circuit (IC) boards were crushed into 5-40 mesh (0.71-4.4mm), and the crushed particles were pyrolyzed at temperatures ranging from 200 to 500 degrees C. The thermal decomposition kinetics were measured by a thermogravimetric (TG) analyzer. The composition of pyrolytic residues was analyzed by Energy Dispersive X-ray Spectrometer (EDS), Inductively Coupled Plasma Atomic Emission Spectrometer (ICP-AES) and Inductively Coupled Plasma-Mass Spectrometry (ICP-MS). In addition, the element compositions of liquid products were analyzed by ICP-AES and ICP-MS. Pyrolytic exhaust was collected by a water-absorption system in an ice-bath cooler, and IC analysis showed that the absorbed solution comprised 11 ionic species. Based on the pyrolytic kinetic parameters of TG analysis and pyrolytic residues at various temperatures for 30 min, the effect of particle size was insignificant in this study, and temperature was the key factor for the IC board pyrolysis. Two stages of decomposition were found for IC board pyrolysis under nitrogen atmosphere. The activation energy was 38-47 kcal/mol for the first-stage reaction and 5.2-9.4 kcal/mol for the second-stage reaction. Metal content was low in the liquid by-product of the IC board pyrolysis process, which is an advantage in that the liquid product could be used as a fuel. Brominate and ammonium were the main water-soluble ionic species of the pyrolytic exhaust. A plan for their safe and effective disposal must be developed if the pyrolytic recycling process is to be applied to IC boards.

Effects of mould on electrochemical migration behaviour of immersion silver finished printed circuit board.

PubMed

Yi, Pan; Xiao, Kui; Dong, Chaofang; Zou, Shiwen; Li, Xiaogang

2018-02-01

The role played by mould in the electrochemical migration (ECM) behaviour of an immersion silver finished printed circuit board (PCB-ImAg) under a direct current (DC) bias was investigated. An interesting phenomenon is found whereby mould, especially Aspergillus niger, can preferentially grow well on PCB-ImAg under electrical bias and then bridge integrated circuits and form a migration path. The cooperation of the mould and DC bias aggravates the ECM process occurring on PCB-ImAg. When the bias voltage is below 15V, ECM almost does not occur for Ag coating. Mechanisms that explain the ECM processes of PCB-ImAg in the presence of mould and DC bias are proposed. Copyright © 2017. Published by Elsevier B.V.

Estimation of Operating Condition of Appliances Using Circuit Current Data on Electric Distribution Boards

NASA Astrophysics Data System (ADS)

Iwafune, Yumiko; Ogimoto, Kazuhiko; Yagita, Yoshie

The Energy management systems (EMS) on demand sides are expected as a method to enhance the capability of supply and demand balancing of a power system under the anticipated penetration of renewable energy generation such as Photovoltaics (PV). Elucidation of energy consumption structure in a building is one of important elements for realization of EMS and contributes to the extraction of potential energy saving. In this paper, we propose the estimation method of operating condition of household appliances using circuit current data on an electric distribution board. Circuit current data are broken down by their shape using a self-organization map method and aggregated by appliance based on customers' information of appliance possessed. Proposed method is verified using residential energy consumption measurement survey data.

46 CFR 97.55-1 - Master's responsibility.

Code of Federal Regulations, 2010 CFR

2010-10-01

... OPERATIONS De-Energizing of Cargo Hold Lighting Circuits When Grain or Other Combustible Bulk Cargo Is... be loaded de-energized at the distribution panel or panel board. He shall thereafter have periodic... circuits remain de-energized while this bulk cargo remains within the vessel. ...

Design and construction of a high frame rate imaging system

NASA Astrophysics Data System (ADS)

Wang, Jing; Waugaman, John L.; Liu, Anjun; Lu, Jian-Yu

2002-05-01

A new high frame rate imaging method has been developed recently [Jian-yu Lu, ``2D and 3D high frame rate imaging with limited diffraction beams,'' IEEE Trans. Ultrason. Ferroelectr. Freq. Control 44, 839-856 (1997)]. This method may have a clinical application for imaging of fast moving objects such as human hearts, velocity vector imaging, and low-speckle imaging. To implement the method, an imaging system has been designed. The system consists of one main printed circuit board (PCB) and 16 channel boards (each channel board contains 8 channels), in addition to a set-top box for connections to a personal computer (PC), a front panel board for user control and message display, and a power control and distribution board. The main board contains a field programmable gate array (FPGA) and controls all channels (each channel has also an FPGA). We will report the analog and digital circuit design and simulations, multiplayer PCB designs with commercial software (Protel 99), PCB signal integrity testing and system RFI/EMI shielding, and the assembly and construction of the entire system. [Work supported in part by Grant 5RO1 HL60301 from NIH.

Design of a signal conditioner for the Fermilab Magnet Test Facility

DOE Office of Scientific and Technical Information (OSTI.GOV)

Giannelli, Pietro

2012-01-01

This thesis describes the design of a remotely-programmable signal conditioner for the harmonic measurement of accelerator magnets. A 10-channel signal conditioning circuit featuring bucking capabilities was designed from scratch and implemented to the level of the printed circuit board layout. Other system components were chosen from those available on the market. Software design was started with the definition of routine procedures. This thesis is part of an upgrade project for replacing obsolescent automated test equipment belonging to the Fermilab Magnet Test Facility. The design started with a given set of requirements. Using a top-down approach, all the circuits were designedmore » and their expected performances were theoretically predicted and simulated. A limited prototyping phase followed. The printed circuit boards were laid out and routed using a CAD software and focusing the design on maximum electromagnetic interference immunity. An embedded board was selected for controlling and interfacing the signal conditioning circuitry with the instrumentation network. Basic low level routines for hardware access were defined. This work covered the entire design process of the signal conditioner, resulting in a project ready for manufacturing. The expected performances are in line with the requirements and, in the cases where this was not possible, approval of trade-offs was sought and received from the end users. Part I deals with the global structure of the signal conditioner and the subdivision in functional macro-blocks. Part II treats the hardware design phase in detail, covering the analog and digital circuits, the printed circuit layouts, the embedded controller and the power supply selection. Part III deals with the basic hardware-related routines to be implemented in the final software.« less

Composition and Elution Behavior of Various Elements from Printed Circuit Boards, Cathode-ray Tube Glass, and Liquid-crystal Displays in Waste Consumer Electronics.

PubMed

Inaba, Kazuho; Murata, Tomoyoshi; Yamamura, Shigeki; Nagano, Masaaki; Iwasaki, Kazuhiro; Nakajima, Daisuke; Takigami, Hidetaka

2018-01-01

The contents and elution behavior of metals in consumer electronics parts were determined so as to understand their maximum environmental risk. Elements contained most in printed-circuit boards were Cu, Si, Br, Ca, Al, Sn, Pb, Sb, Ba, Fe, Ni, Ti, and Zn; in cathode-ray tube glass were Si, Pb, Ba, Sr, Zn, Zr, Ca, and Sb; in arsenic contained liquid-crystal displays were Si, Ca, Sr, Ba, As, and Fe; and in antimony contained liquid-crystal displays were Si, Ba, Ca, Sb, Sr, Fe, and Sn. The elements eluted most from printed-circuit boards were Zn, Pb, and Cu; from cathode-ray tube glass were Pb, Zn, B, Ba, and Si; and from liquid-crystal displays were B and Si, and the toxic As and Sb. The amount eluted was greatest at acidic pH. It was revealed that officially recommended 6-h-shaking with a pure water test was insufficient to understand the real environmental risk of waste electronics.

Examining the technology acceptance for dismantling of waste printed circuit boards in light of recycling and environmental concerns.

PubMed

Duan, Huabo; Hou, Kun; Li, Jinhui; Zhu, Xiaodong

2011-03-01

The dismantling of printed circuit board assemblies (PCBAs) and the recovery of their useful materials can lead to serious environmental impacts mainly due to their complicated physical structure and the variety of toxic elements contained in their material composition. So far, less attention has been paid to their responsible recycling compared to that of bare printed circuit boards. Combined with other materials recovery process, proper dismantling of PCBAs is beneficial to conserve scarce resources, reuse the components, and eliminate or safely dispose of hazardous materials. In analyzing the generation, resources potential and hazardous risk of scrap PCBAs, technologies used for the dismantling of waste PCBAs have been widely investigated and reviewed from the aspects of both industrial application and laboratory-scale studies. In addition, the feasibility of PCBA dismantling has been discussed, the determinants of which, including the heating conditions and mechanical properties have been identified. Moreover, this paper evaluates the environmental consequences caused by the dismantling of PCBAs. Copyright © 2010 Elsevier Ltd. All rights reserved.

Immobilization of Acidithiobacillus ferrooxidans on Cotton Gauze for the Bioleaching of Waste Printed Circuit Boards.

PubMed

Nie, Hongyan; Zhu, Nengwu; Cao, Yanlan; Xu, Zhiguo; Wu, Pingxiao

2015-10-01

The bioleaching parameters of metal concentrates from waste printed circuit boards by Acidithiobacillus ferrooxidans immobilized on cotton gauze in a two-step reactor were investigated in this study. The results indicated that an average ferrous iron oxidation rate of 0.54 g/(L·h) and a ferrous iron oxidation ratio of 96.90 % were obtained after 12 h at aeration rate of 1 L/min in bio-oxidation reactor. After 96 h, the highest leaching efficiency of copper reached 91.68 % under the conditions of the content of the metal powder 12 g/L, the retention time 6 h, and the aeration rate 1 L/min. The bioleaching efficiency of copper could be above 91.12 % under repeated continuous batch operation. Meanwhile, 95.32 % of zinc, 90.32 % of magnesium, 86.31 % of aluminum, and 59.07 % of nickel were extracted after 96 h. All the findings suggested that the recovery of metal concentrates from waste printed circuit boards via immobilization of A. ferrooxidans on cotton gauze was feasible.

Electrochemical Migration Behavior of Copper-Clad Laminate and Electroless Nickel/Immersion Gold Printed Circuit Boards under Thin Electrolyte Layers

PubMed Central

Yi, Pan; Xiao, Kui; Ding, Kangkang; Dong, Chaofang; Li, Xiaogang

2017-01-01

The electrochemical migration (ECM) behavior of copper-clad laminate (PCB-Cu) and electroless nickel/immersion gold printed circuit boards (PCB-ENIG) under thin electrolyte layers of different thicknesses containing 0.1 M Na2SO4 was studied. Results showed that, under the bias voltage of 12 V, the reverse migration of ions occurred. For PCB-Cu, both copper dendrites and sulfate precipitates were found on the surface of FR-4 (board material) between two plates. Moreover, the Cu dendrite was produced between the two plates and migrated toward cathode. Compared to PCB-Cu, PCB-ENIG exhibited a higher tendency of ECM failure and suffered from seriously short circuit failure under high relative humidity (RH) environment. SKP results demonstrated that surface potentials of the anode plates were greater than those of the cathode plates, and those potentials of the two plates exhibited a descending trend as the RH increased. At the end of the paper, an electrochemical migration corrosion failure model of PCB was proposed. PMID:28772497

Modular cryogenic interconnects for multi-qubit devices.

PubMed

Colless, J I; Reilly, D J

2014-11-01

We have developed a modular interconnect platform for the control and readout of multiple solid-state qubits at cryogenic temperatures. The setup provides 74 filtered dc-bias connections, 32 control and readout connections with -3 dB frequency above 5 GHz, and 4 microwave feed lines that allow low loss (less than 3 dB) transmission 10 GHz. The incorporation of a radio-frequency interposer enables the platform to be separated into two printed circuit boards, decoupling the simple board that is bonded to the qubit chip from the multilayer board that incorporates expensive connectors and components. This modular approach lifts the burden of duplicating complex interconnect circuits for every prototype device. We report the performance of this platform at milli-Kelvin temperatures, including signal transmission and crosstalk measurements.

Sensor Authentication: Embedded Processor Code

DOE Office of Scientific and Technical Information (OSTI.GOV)

Svoboda, John

2012-09-25

Described is the c code running on the embedded Microchip 32bit PIC32MX575F256H located on the INL developed noise analysis circuit board. The code performs the following functions: Controls the noise analysis circuit board preamplifier voltage gains of 1, 10, 100, 000 Initializes the analog to digital conversion hardware, input channel selection, Fast Fourier Transform (FFT) function, USB communications interface, and internal memory allocations Initiates high resolution 4096 point 200 kHz data acquisition Computes complex 2048 point FFT and FFT magnitude. Services Host command set Transfers raw data to Host Transfers FFT result to host Communication error checking

RF Device for Acquiring Images of the Human Body

NASA Technical Reports Server (NTRS)

Gaier, Todd C.; McGrath, William R.

2010-01-01

A safe, non-invasive method for forming images through clothing of large groups of people, in order to search for concealed weapons either made of metal or not, has been developed. A millimeter wavelength scanner designed in a unique, ring-shaped configuration can obtain a full 360 image of the body with a resolution of less than a millimeter in only a few seconds. Millimeter waves readily penetrate normal clothing, but are highly reflected by the human body and concealed objects. Millimeter wave signals are nonionizing and are harmless to human tissues when used at low power levels. The imager (see figure) consists of a thin base that supports a small-diameter vertical post about 7 ft (=2.13 m) tall. Attached to the post is a square-shaped ring 2 in. (=5 cm) wide and 3 ft (=91 cm) on a side. The ring is oriented horizontally, and is supported halfway along one side by a connection to a linear bearing on the vertical post. A planar RF circuit board is mounted to the inside of each side of the ring. Each circuit board contains an array of 30 receivers, one transmitter, and digitization electronics. Each array element has a printed-circuit patch antenna coupled to a pair of mixers by a 90 coupler. The mixers receive a reference local oscillator signal to a subharmonic of the transmitter frequency. A single local oscillator line feeds all 30 receivers on the board. The resulting MHz IF signals are amplified and carried to the edge of the board where they are demodulated and digitized. The transmitted signal is derived from the local oscillator at a frequency offset determined by a crystal oscillator. One antenna centrally located on each side of the square ring provides the source illumination power. The total transmitted power is less than 100 mW, resulting in an exposure level that is completely safe to humans. The output signals from all four circuit boards are fed via serial connection to a data processing computer. The computer processes the approximately 1-MB data set into a three-dimensional image in a matter of seconds. The innovation is to configure the receiver array in a ring topology surrounding the scanned object. The ring is then scanned vertically to cover the necessary two-dimensional surface. This fabrication of the ring is made possible by using planar antenna and circuit technology. A planar circuit board serves as a medium for both antennas and signal processing components. Using this technique, parts counts are kept low, and the cost per element is a small fraction of a waveguide-based system.

Advances in photonics thermal management and packaging materials

NASA Astrophysics Data System (ADS)

Zweben, Carl

2008-02-01

Heat dissipation, thermal stresses, and cost are key packaging design issues for virtually all semiconductors, including photonic applications such as diode lasers, light-emitting diodes (LEDs), solid state lighting, photovoltaics, displays, projectors, detectors, sensors and laser weapons. Heat dissipation and thermal stresses affect performance and reliability. Copper, aluminum and conventional polymeric printed circuit boards (PCBs) have high coefficients of thermal expansion, which can cause high thermal stresses. Most traditional low-coefficient-of-thermal-expansion (CTE) materials like tungsten/copper, which date from the mid 20 th century, have thermal conductivities that are no better than those of aluminum alloys, about 200 W/m-K. There are an increasing number of low-CTE materials with thermal conductivities ranging between that of copper (400 W/m-K) and 1700 W/m-K, and many other new low-CTE materials with lower thermal conductivities. An important benefit of low-CTE materials is that they allow use of hard solders. Some advanced materials are low cost. Others have the potential to be low cost in high-volume production. High-thermal-conductivity materials enable higher power levels, potentially reducing the number of required devices. Advanced thermal materials can constrain PCB CTE and greatly increase thermal conductivity. This paper reviews traditional packaging materials and advanced thermal management materials. The latter provide the packaging engineer with a greater range of options than in the past. Topics include properties, status, applications, cost, using advanced materials to fix manufacturing problems, and future directions, including composites reinforced with carbon nanotubes and other thermally conductive materials.

Multichannel micromanipulator and chamber system for recording multineuronal activity in alert, non-human primates.

PubMed

Gray, Charles M; Goodell, Baldwin; Lear, Alex

2007-07-01

We describe the design and performance of an electromechanical system for conducting multineuron recording experiments in alert non-human primates. The system is based on a simple design, consisting of a microdrive, control electronics, software, and a unique type of recording chamber. The microdrive consists of an aluminum frame, a set of eight linear actuators driven by computer-controlled miniature stepping motors, and two printed circuit boards (PCBs) that provide connectivity to the electrodes and the control electronics. The control circuitry is structured around an Atmel RISC-based microcontroller, which sends commands to as many as eight motor control cards, each capable of controlling eight motors. The microcontroller is programmed in C and uses serial communication to interface with a host computer. The graphical user interface for sending commands is written in C and runs on a conventional personal computer. The recording chamber is low in profile, mounts within a circular craniotomy, and incorporates a removable internal sleeve. A replaceable Sylastic membrane can be stretched across the bottom opening of the sleeve to provide a watertight seal between the cranial cavity and the external environment. This greatly reduces the susceptibility to infection, nearly eliminates the need for routine cleaning, and permits repeated introduction of electrodes into the brain at the same sites while maintaining the watertight seal. The system is reliable, easy to use, and has several advantages over other commercially available systems with similar capabilities.

46 CFR 78.70-1 - Master's responsibility.

Code of Federal Regulations, 2010 CFR

2010-10-01

... Shipping COAST GUARD, DEPARTMENT OF HOMELAND SECURITY (CONTINUED) PASSENGER VESSELS OPERATIONS De... shall have the lighting circuits to cargo compartments in which the bulk cargo is to be loaded de... the panel or panel board as frequently as necessary to ascertain that the affected circuits remain de...

46 CFR 78.70-1 - Master's responsibility.

Code of Federal Regulations, 2011 CFR

2011-10-01

... Shipping COAST GUARD, DEPARTMENT OF HOMELAND SECURITY (CONTINUED) PASSENGER VESSELS OPERATIONS De... shall have the lighting circuits to cargo compartments in which the bulk cargo is to be loaded de... the panel or panel board as frequently as necessary to ascertain that the affected circuits remain de...

Modular control subsystems for use in solar heating systems for multi-family dwellings

NASA Technical Reports Server (NTRS)

1977-01-01

Progress in the development of solar heating modular control subsystems is reported. Circuit design, circuit drawings, and printed circuit board layout are discussed along with maintenance manuals, installation instructions, and verification and acceptance tests. Calculations made to determine the predicted performance of the differential thermostat are given including details and results of tests for the offset temperature, and boil and freeze protect points.

Phoenix Interferometer

DTIC Science & Technology

1975-06-01

proportioning circuit , Triac , and heater blankets. The significant features of the temperature controllers are small size, less than one half per...interferometer. The only change to the Firebird system needed to ac- commodate the new sensor is the replacement of several circuit boards. No hard wiring or...temperature at altitude (220oK). In addition to the sensor head, the Phoe- nix system also includes a set of plug-in printed circuit cards which

Effect of Bypass Capacitor in Common-mode Noise Reduction Technique for Automobile PCB

NASA Astrophysics Data System (ADS)

Uno, Takanori; Ichikawa, Kouji; Mabuchi, Yuichi; Nakamura, Atushi

In this letter, we studied the use of common mode noise reduction technique for in-vehicle electronic equipment, each comprising large-scale integrated circuit (LSI), printed circuit board (PCB), wiring harnesses, and ground plane. We have improved the model circuit of the common mode noise that flows to the wire harness to add the effect of by-pass capacitors located near an LSI.

A low-noise low-power EEG acquisition node for scalable brain-machine interfaces

NASA Astrophysics Data System (ADS)

Sullivan, Thomas J.; Deiss, Stephen R.; Cauwenberghs, Gert; Jung, Tzyy-Ping

2007-05-01

Electroencephalograph (EEG) recording systems offer a versatile, noninvasive window on the brain's spatio-temporal activity for many neuroscience and clinical applications. Our research aims at improving the spatial resolution and mobility of EEG recording by reducing the form factor, power drain and signal fanout of the EEG acquisition node in a scalable sensor array architecture. We present such a node integrated onto a dimesized circuit board that contains a sensor's complete signal processing front-end, including amplifier, filters, and analog-to-digital conversion. A daisy-chain configuration between boards with bit-serial output reduces the wiring needed. The circuit's low power consumption of 423 μW supports EEG systems with hundreds of electrodes to operate from small batteries for many hours. Coupling between the bit-serial output and the highly sensitive analog input due to dense integration of analog and digital functions on the circuit board results in a deterministic noise component in the output, larger than the intrinsic sensor and circuit noise. With software correction of this noise contribution, the system achieves an input-referred noise of 0.277 μVrms in the signal band of 1 to 100 Hz, comparable to the best medical-grade systems in use. A chain of seven nodes using EEG dry electrodes created in micro-electrical-mechanical system (MEMS) technology is demonstrated in a real-world setting.

Spatial part-set cuing facilitation.

PubMed

Kelley, Matthew R; Parasiuk, Yuri; Salgado-Benz, Jennifer; Crocco, Megan

2016-07-01

Cole, Reysen, and Kelley [2013. Part-set cuing facilitation for spatial information. Journal of Experimental Psychology: Learning, Memory, & Cognition, 39, 1615-1620] reported robust part-set cuing facilitation for spatial information using snap circuits (a colour-coded electronics kit designed for children to create rudimentary circuit boards). In contrast, Drinkwater, Dagnall, and Parker [2006. Effects of part-set cuing on experienced and novice chess players' reconstruction of a typical chess midgame position. Perceptual and Motor Skills, 102(3), 645-653] and Watkins, Schwartz, and Lane [1984. Does part-set cuing test for memory organization? Evidence from reconstructions of chess positions. Canadian Journal of Psychology/Revue Canadienne de Psychologie, 38(3), 498-503] showed no influence of part-set cuing for spatial information when using chess boards. One key difference between the two procedures was that the snap circuit stimuli were explicitly connected to one another, whereas chess pieces were not. Two experiments examined the effects of connection type (connected vs. unconnected) and cue type (cued vs. uncued) on memory for spatial information. Using chess boards (Experiment 1) and snap circuits (Experiment 2), part-set cuing facilitation only occurred when the stimuli were explicitly connected; there was no influence of cuing with unconnected stimuli. These results are potentially consistent with the retrieval strategy disruption hypothesis, as well as the two- and three-mechanism accounts of part-set cuing.

Recycling-oriented characterization of plastic frames and printed circuit boards from mobile phones by electronic and chemical imaging

DOE Office of Scientific and Technical Information (OSTI.GOV)

Palmieri, Roberta; Bonifazi, Giuseppe; Serranti, Silvia, E-mail: silvia.serranti@uniroma1.it

Highlights: • A recycling oriented characterization of end-of-life mobile phones was carried out. • Characterization was developed in a zero-waste-perspective, aiming to recover all the mobile phone materials. • Plastic frames and printed circuit boards were analyzed by electronic and chemical imaging. • Suitable milling/classification strategies were set up to define specialized-pre-concentrated-streams. • The proposed approach can improve the recovery of polymers, base/precious metals, rare earths and critical raw materials. - Abstract: This study characterizes the composition of plastic frames and printed circuit boards from end-of-life mobile phones. This knowledge may help define an optimal processing strategy for using thesemore » items as potential raw materials. Correct handling of such a waste is essential for its further “sustainable” recovery, especially to maximize the extraction of base, rare and precious metals, minimizing the environmental impact of the entire process chain. A combination of electronic and chemical imaging techniques was thus examined, applied and critically evaluated in order to optimize the processing, through the identification and the topological assessment of the materials of interest and their quantitative distribution. To reach this goal, end-of-life mobile phone derived wastes have been systematically characterized adopting both “traditional” (e.g. scanning electronic microscopy combined with microanalysis and Raman spectroscopy) and innovative (e.g. hyperspectral imaging in short wave infrared field) techniques, with reference to frames and printed circuit boards. Results showed as the combination of both the approaches (i.e. traditional and classical) could dramatically improve recycling strategies set up, as well as final products recovery.« less

PCBA depaneling stress minimization study

NASA Astrophysics Data System (ADS)

Darus, M. H. B. M.; Aziz, M. H. B. A.; Ong, N. R.; Alcain, J. B.; Retnasamy, V.

2017-09-01

Printed circuit board (PCB) is board that used to connect the electricity using the conductive pathways. The PCB that consists with electronic components was called as printed circuit board assembly (PCBA). Bending process has been used as one of the depaneling techniques may contribute to mechanical stress and the failure of capacitors and other components to function. As a result, the idea to create holes in particular location was implemented in order to absorb the stress. In this study, finite element analysis is demonstrated by using ANSYS software. Two PCBA design models are considered in order to investigate the effect of the hole and the stress response. The simulation results show that the hole on the PCBA has reduced the stress. For Design model 2, the stress response of the holes located vertically to the PCBA is lower than the holes located horizontally to the PCBA.

Evaluation of a recycling process for printed circuit board by physical separation and heat treatment.

PubMed

Fujita, Toyohisa; Ono, Hiroyuki; Dodbiba, Gjergj; Yamaguchi, Kunihiko

2014-07-01

Printed circuit boards (PCBs) from discarded personal computer (PC) and hard disk drive were crushed by explosion in water or mechanical comminution in order to disintegrate the attached parts. More parts were stripped from PCB of PC, composed of epoxy resin; than from PCB of household appliance, composed of phenol resin. In an attempt to raise the copper grade of PCB by removing other components, a carbonization treatment was investigated. The crushed PCB without surface-mounted parts was carbonized under a nitrogen atmosphere at 873-1073 K. After screening, the char was classified by size into oversized pieces, undersized pieces and powder. The copper foil and glass fiber pieces were liberated and collected in undersized fraction. The copper foil was liberated easily from glass fiber by stamping treatment. As one of the mounted parts, the multi-layered ceramic capacitors (MLCCs), which contain nickel, were carbonized at 873 K. The magnetic separation is carried out at a lower magnetic field strength of 0.1T and then at 0.8 T. In the +0.5mm size fraction the nickel grade in magnetic product was increased from 0.16% to 6.7% and the nickel recovery is 74%. The other useful mounted parts are tantalum capacitors. The tantalum capacitors were collected from mounted parts. The tantalum-sintered bodies were separated from molded resins by heat treatment at 723-773 K in air atmosphere and screening of 0.5mm. Silica was removed and 70% of tantalum grade was obtained after more than 823K heating and separation. Next, the evaluation of Cu recycling in PCB is estimated. Energy consumption of new process increased and the treatment cost becomes 3 times higher comparing the conventional process, while the environmental burden of new process decreased comparing conventional process. The nickel recovery process in fine ground particles increased energy and energy cost comparing those of the conventional process. However, the environmental burden decreased than the conventional one. The process for recovering tantalum used more heat for the treatment and therefore the energy consumption increased by 50%, when comparing with conventional process. However, the market price for tantalum is very large; the profit for tantalum recovery is added. Also the environmental burden decreased by the recycling of tantalum recovery. Therefore, the tantalum recovery is very important step in the PCB recycling. If there is no tantalum, the consumed energy and treatment cost increase in the new process, though the environmental burden decreases. Copyright © 2014 Elsevier Ltd. All rights reserved.

Compact low-noise preamplifier for noise spectroscopy with biased photodiodes in cargo inspection systems

NASA Astrophysics Data System (ADS)

Benetti, Bob; Langeveld, Willem G. J.

2013-09-01

Noise Spectroscopy, a.k.a. Z-determination by Statistical Count-rate ANalysis (Z-SCAN), is a statistical technique to determine a quantity called the "noise figure" from digitized waveforms of pulses of transmitted x-rays in cargo inspection systems. Depending only on quantities related to the x-ray energies, it measures a characteristic of the transmitted x-ray spectrum, which depends on the atomic number, Z, of the material penetrated. The noise figure can thus be used for material separation. In an 80-detector prototype, scintillators are used with large-area photodiodes biased at 80V and digitized using 50-MSPS 12-bit ADC boards. We present an ultra-compact low-noise preamplifier design, with one high-gain and one low-gain channel per detector for improved dynamic range. To achieve adequate detection sensitivity and spatial resolution each dual-gain preamplifier channel must fit within a 12.7 mm wide circuit board footprint and maintain adequate noise immunity to conducted and radiated interference from adjacent channels. The novel design included iterative SPICE analysis of transient response, dynamic range, frequency response, and noise analysis to optimize the selection and configuration of amplifiers and filter response. We discuss low-noise active and passive components and low-noise techniques for circuit board layout that are essential to achieving the design goals, and how the completed circuit board performed in comparison to the predicted responses.

Zero Tolerance versus Privacy.

ERIC Educational Resources Information Center

Dowling-Sendor, Benjamin

2000-01-01

In a case involving questionable canine search-and-seizure practices, a circuit court upheld a school board's decision to terminate a teacher's contract. While touting zero tolerance, the board fired an honored teacher 3 years from retirement who may not have known about the marijuana cigarette in her car. (MLH)

78 FR 37203 - Authorization of Production Activity; Subzone 196A; TTI, Inc. (Electromechanical and Circuit...

Federal Register 2010, 2011, 2012, 2013, 2014

2013-06-20

... DEPARTMENT OF COMMERCE Foreign-Trade Zones Board [B-20-2013] Authorization of Production Activity; Subzone 196A; TTI, Inc. (Electromechanical and Circuit Protection Devices Production/Kitting); Fort Worth, Texas On February 13, 2013, TTI, Inc. submitted a notification of proposed production activity to the...

Capacitance discharge system for ignition of Single Bridge Apollo Standard Initiators (SBASI)

NASA Technical Reports Server (NTRS)

Ward, R. D.

1974-01-01

The design support data developed during the single bridge Apollo standard initiator (SBASI) program are presented. A circuit was designed and bread-board tested to verify operational capabilities of the circuit. Test data, design criteria, weight, and reliability trade-off considerations, and final design recommendations are reported.

Stable Polyurethane Coatings for Electronic Circuits

NASA Technical Reports Server (NTRS)

Morris, D. E.

1983-01-01

Alkane-based polyurethanes resist deterioration while maintaining good dielectric properties. Weight loss after prolonged immersion in hot water far less for alkane-based polyurethanes than for more common ether based polyurethanes, at any given oxygen content. Major uses of polyurethanes are as connector potting materials and conformal coatings for printed circuit boards.

Integrated testing system FiTest for diagnosis of PCBA

NASA Astrophysics Data System (ADS)

Bogdan, Arkadiusz; Lesniak, Adam

2016-12-01

This article presents the innovative integrated testing system FiTest for automatic, quick inspection of printed circuit board assemblies (PCBA) manufactured in Surface Mount Technology (SMT). Integration of Automatic Optical Inspection (AOI), In-Circuit Tests (ICT) and Functional Circuit Tests (FCT) resulted in universal hardware platform for testing variety of electronic circuits. The platform provides increased test coverage, decreased level of false calls and optimization of test duration. The platform is equipped with powerful algorithms performing tests in a stable and repetitive way and providing effective management of diagnosis.

Reusable vibration resistant integrated circuit mounting socket

DOEpatents

Evans, Craig N.

1995-01-01

This invention discloses a novel form of socket for integrated circuits to be mounted on printed circuit boards. The socket uses a novel contact which is fabricated out of a bimetallic strip with a shape which makes the end of the strip move laterally as temperature changes. The end of the strip forms a barb which digs into an integrated circuit lead at normal temperatures and holds it firmly in the contact, preventing loosening and open circuits from vibration. By cooling the contact containing the bimetallic strip the barb end can be made to release so that the integrated circuit lead can be removed from the socket without damage either to the lead or to the socket components.

Radome Positioner for the RFSS (Radio Frequency Simulation System).

DTIC Science & Technology

1978-02-27

its associated circuits contained on the Motorola M68MM01A-I micro- module (See Drawing 64). This board contains the 6800 microprocessor. Ik bytes of...D 00 1~ 0 41 + C.) ) -44 208 g. Small encoder diameter achieved by using integrated circuit modules . h. Stainless steel case. U...to the 30 integrated circuits which actually comprise the heart of the-microcomputer. This dramatic reduction in parts count re- sults in a similar

Arrays of Miniature Microphones for Aeroacoustic Testing

NASA Technical Reports Server (NTRS)

Shams, Qamar A.; Humphreys, William M.; Sealey, Bradley S.; Bartram, Scott M.; Zuckewar, Allan J.; Comeaux, Toby; Adams, James K.

2007-01-01

A phased-array system comprised of custom-made and commercially available microelectromechanical system (MEMS) silicon microphones and custom ancillary hardware has been developed for use in aeroacoustic testing in hard-walled and acoustically treated wind tunnels. Recent advances in the areas of multi-channel signal processing and beam forming have driven the construction of phased arrays containing ever-greater numbers of microphones. Traditional obstacles to this trend have been posed by (1) the high costs of conventional condenser microphones, associated cabling, and support electronics and (2) the difficulty of mounting conventional microphones in the precise locations required for high-density arrays. The present development overcomes these obstacles. One of the hallmarks of the new system is a series of fabricated platforms on which multiple microphones can be mounted. These mounting platforms, consisting of flexible polyimide circuit-board material (see left side of figure), include all the necessary microphone power and signal interconnects. A single bus line connects all microphones to a common power supply, while the signal lines terminate in one or more data buses on the sides of the circuit board. To minimize cross talk between array channels, ground lines are interposed as shields between all the data bus signal lines. The MEMS microphones are electrically connected to the boards via solder pads that are built into the printed wiring. These flexible circuit boards share many characteristics with their traditional rigid counterparts, but can be manufactured much thinner, as small as 0.1 millimeter, and much lighter with boards weighing as much as 75 percent less than traditional rigid ones. For a typical hard-walled wind-tunnel installation, the flexible printed-circuit board is bonded to the tunnel wall and covered with a face sheet that contains precise cutouts for the microphones. Once the face sheet is mounted, a smooth surface is established over the entire array due to the flush mounting of all microphones (see right side of figure). The face sheet is made from a continuous glass-woven-fabric base impregnated with an epoxy resin binder. This material offers a combination of high mechanical strength and low dielectric loss, making it suitable for withstanding the harsh test section environment present in many wind tunnels, while at the same time protecting the underlying polyimide board. Customized signal-conditioning hardware consisting of line drivers and antialiasing filters are coupled with the array. The line drivers are constructed using low-supply-current, high-gain-bandwidth operational amplifiers designed to transmit the microphone signals several dozen feet from the array to external acquisition hardware. The anti-alias filters consist of individual Chebyshev low-pass filters (one for each microphone channel) housed on small printed-circuit boards mounted on one or more motherboards. The mother/daughter board design results in a modular system, which is easy to debug and service and which enables the filter characteristics to be changed by swapping daughter boards with ones containing different filter parameters. The filter outputs are passed to commercially- available acquisition hardware to digitize and store the conditioned microphone signals. Wind-tunnel testing of the new MEMS microphone polyimide mounting system shows that the array performance is comparable to that of traditional arrays, but with significantly less cost of construction.

Altered fine motor function at school age in Inuit children exposed to PCBs, methylmercury, and lead.

PubMed

Boucher, Olivier; Muckle, Gina; Ayotte, Pierre; Dewailly, Eric; Jacobson, Sandra W; Jacobson, Joseph L

2016-10-01

Motor deficits have frequently been reported in methylmercury (MeHg) poisoning in adults. However, whether exposure to neurotoxic contaminants from environmental sources early in life is associated with neuromotor impairments has received relatively little attention. This study examines the relation of developmental exposure to MeHg, polychlorinated biphenyls (PCBs), and lead to motor function in school-age Inuit children exposed through their traditional diet. In a prospective study in Nunavik, children (mean age=11.3years) were assessed on a battery of fine motor tasks, namely the Stanford-Binet Copying subtest (N=262), the Santa Ana Form Board, and the Finger Tapping Test (N=215). The relation of mercury (Hg; as an index of MeHg exposure), PCB congener 153 (PCB153), and lead concentrations in cord and current blood samples to task performance was examined using linear regression analyses. After adjustment for potential confounders and control for the other contaminants, higher current PCB concentrations were associated with poorer Santa Ana Form Board and Finger Tapping performance. Results were virtually identical when PCB153 was replaced by other PCB congeners. Higher current Hg levels were independently associated with poorer Finger Tapping performance. This is the first prospective longitudinal study in children to provide evidence of neuromotor impairments associated with postnatal exposure to seafood contaminants from environmental sources. Fine motor speed appears particularly sensitive to the effects of postnatal PCB exposure, which is unusually high in this population. Results with postnatal MeHg are concordant with previous cross-sectional studies with children and adults. Copyright © 2016 Elsevier Ltd. All rights reserved.

Microfluidic networks embedded in a printed circuit board

NASA Astrophysics Data System (ADS)

Dong, Liangwei; Hu, Yueli

2017-07-01

In order to improve the robustness of microfluidic networks in printed circuit board (PCB)-based microfluidic platforms, a new method was presented. A pattern in a PCB was formed using hollowed-out technology. Polydimethylsiloxane was partly filled in the hollowed-out fields after mounting an adhesive tape on the bottom of the PCB, and solidified in an oven. Then, microfluidic networks were built using soft lithography technology. Microfluidic transportation and dilution operations were demonstrated using the fabricated microfluidic platform. Results show that this method can embed microfluidic networks into a PCB, and microfluidic operations can be implemented in the microfluidic networks embedded into the PCB.

Housing And Mounting Structure

DOEpatents

Anderson, Gene R.; Armendariz, Marcelino G.; Baca, Johnny R.F.; Bryan, Robert P.; Carson, Richard F.; Duckett, III, Edwin B.; McCormick, Frederick B.; Miller, Gregory V.; Peterson, David W.; Smith, Terrance T.

2005-03-08

This invention relates to an optical transmitter, receiver or transceiver module, and more particularly, to an apparatus for connecting a first optical connector to a second optical connector. The apparatus comprises: (1) a housing having at least a first end and at least a second end, the first end of the housing capable of receiving the first optical connector, and the second end of the housing capable of receiving the second optical connector; (2) a longitudinal cavity extending from the first end of the housing to the second end of the housing; and (3) an electromagnetic shield comprising at least a portion of the housing. This invention also relates to an apparatus for housing a flexible printed circuit board, and this apparatus comprises: (1) a mounting structure having at least a first surface and a second surface; (2) alignment ridges along the first and second surfaces of the mounting structure, the alignment ridges functioning to align and secure a flexible printed circuit board that is wrapped around and attached to the first and second surfaces of the mounting structure; and (3) a series of heat sink ridges adapted to the mounting structure, the heat sink ridges functioning to dissipate heat that is generated from the flexible printed circuit board.

Characterization of shredded television scrap and implications for materials recovery.

PubMed

Cui, Jirang; Forssberg, Eric

2007-01-01

Characterization of TV scrap was carried out by using a variety of methods, such as chemical analysis, particle size and shape analysis, liberation degree analysis, thermogravimetric analysis, sink-float test, and IR spectrometry. A comparison of TV scrap, personal computer scrap, and printed circuit board scrap shows that the content of non-ferrous metals and precious metals in TV scrap is much lower than that in personal computer scrap or printed circuit board scrap. It is expected that recycling of TV scrap will not be cost-effective by utilizing conventional manual disassembly. The result of particle shape analysis indicates that the non-ferrous metal particles in TV scrap formed as a variety of shapes; it is much more heterogeneous than that of plastics and printed circuit boards. Furthermore, the separability of TV scrap using density-based techniques was evaluated by the sink-float test. The result demonstrates that a high recovery of copper could be obtained by using an effective gravity separation process. Identification of plastics shows that the major plastic in TV scrap is high impact polystyrene. Gravity separation of plastics may encounter some challenges in separation of plastics from TV scrap because of specific density variations.

Toward environmentally-benign utilization of nonmetallic fraction of waste printed circuit boards as modifier and precursor.

PubMed

Hadi, Pejman; Ning, Chao; Ouyang, Weiyi; Xu, Meng; Lin, Carol S K; McKay, Gordon

2015-01-01

Electronic waste, including printed circuit boards, is growing at an alarming rate due to the accelerated technological progress and the shorter lifespan of the electronic equipment. In the past decades, due to the lack of proper economic and environmentally-benign recycling technologies, a major fraction of e-waste generated was either destined to landfills or incinerated with the sole intention of its disposal disregarding the toxic nature of this waste. Recently, with the increasing public awareness over their environment and health issues and with the enaction of more stringent regulations, environmentally-benign recycling has been driven to be an alternative option partially replacing the traditional eco-unfriendly disposal methods. One of the most favorable green technologies has been the mechanical separation of the metallic and nonmetallic fraction of the waste printed circuit boards. Although metallic fraction, as the most profitable component, is used to generate the revenue of the separation process, the nonmetallic fraction (NMF) has been left isolated. Herein, the recent developments in the application of NMF have been comprehensively reviewed and an eco-friendly emerging usage of NMF as a value-added material for sustainable remediation has been introduced. Copyright © 2014 Elsevier Ltd. All rights reserved.

Recycling-oriented characterization of plastic frames and printed circuit boards from mobile phones by electronic and chemical imaging.

PubMed

Palmieri, Roberta; Bonifazi, Giuseppe; Serranti, Silvia

2014-11-01

This study characterizes the composition of plastic frames and printed circuit boards from end-of-life mobile phones. This knowledge may help define an optimal processing strategy for using these items as potential raw materials. Correct handling of such a waste is essential for its further "sustainable" recovery, especially to maximize the extraction of base, rare and precious metals, minimizing the environmental impact of the entire process chain. A combination of electronic and chemical imaging techniques was thus examined, applied and critically evaluated in order to optimize the processing, through the identification and the topological assessment of the materials of interest and their quantitative distribution. To reach this goal, end-of-life mobile phone derived wastes have been systematically characterized adopting both "traditional" (e.g. scanning electronic microscopy combined with microanalysis and Raman spectroscopy) and innovative (e.g. hyperspectral imaging in short wave infrared field) techniques, with reference to frames and printed circuit boards. Results showed as the combination of both the approaches (i.e. traditional and classical) could dramatically improve recycling strategies set up, as well as final products recovery. Copyright © 2014 Elsevier Ltd. All rights reserved.

Ion chromatography in the manufacture of multilayer circuit boards

NASA Astrophysics Data System (ADS)

Smith, R. E.

1987-10-01

Ion chromatography (IC) has proven useful in analyzing chemical solutions used in the manufacture of multilayer circuit boards. IC provides results on ions not expected in the production solutions. Thus, solution contamination and breakdown products can be monitored in every phase of the circuit board manufacturing. During the first phase, epoxy laminates experience an etchback, first in chromic acid, which can be analyzed for trace chloride and sulfate, then in ammonium bifluoride/HCl, which can be analyzed for fluoride and chloride. Following a wet blasting to roughen up the surface, 20 mu in. of copper are deposited using an electroless bath. Again, IC is applicable for monitoring formate, tartarate, and sulfate levels. Next, an acid copper bath is used to electroplate the through holes with 0.001 in. of ductile copper. This bath is analyzed for trace chloride. Photoimaging is then performed, and the organic solvents used can be assayed for trace ionic chloride. Finally, a fluoroboric acid-based tin-lead bath is used to deposit a solderable alloy. This bath is analyzed for total fluoroborate, tin, and lead. In addition, mobile phase ion chromatography (MPIC) is used to monitor the nonionic organic brighteners in the baths.

Ion chromatography in the manufacture of multilayer circuit boards

NASA Astrophysics Data System (ADS)

Smith, Robert E.

1990-01-01

Ion chromatography (IC) has proven useful in analyzing chemical solutions used in the manufacture of multilayer circuit boards. Unlike other chemical quantification techniques, IC provides results on ions not expected in the production solutions. Thus, solution contamination and break-down products can be monitored in every phase of the circuit board manufacturing. During the first phase, epoxy laminates experience an etchback, first in chromic acid, which can be analyzed for trace chloride and sulfate, then in ammonium bifluoride/HCl, which can be analyzed for fluoride and chloride. Following a wet-blasting to roughen up the surface, 20 microinches of copper are deposited using an electroless bath. Again, IC is applicable for monitoring formate, tartarate, and sulfate levels. Next, an acid copper bath is used to electroplate the through holes with 0.001 inches of ductile copper. This bath is analyzed for trace chloride. Photoimaging is then performed, and the organic solvents used can be assayed for trace ionic chloride. Finally, a fluoroboric acid-based tin-lead bath is used to deposit a solderable alloy. This bath is analyzed for fluoroborate, tin, and lead. In addition, mobile phase ion chromatography (MPIC) is used to monitor the nonionic organic brighteners in the baths.

Packaging printed circuit boards: A production application of interactive graphics

NASA Technical Reports Server (NTRS)

Perrill, W. A.

1975-01-01

The structure and use of an Interactive Graphics Packaging Program (IGPP), conceived to apply computer graphics to the design of packaging electronic circuits onto printed circuit boards (PCB), were described. The intent was to combine the data storage and manipulative power of the computer with the imaginative, intuitive power of a human designer. The hardware includes a CDC 6400 computer and two CDC 777 terminals with CRT screens, light pens, and keyboards. The program is written in FORTRAN 4 extended with the exception of a few functions coded in COMPASS (assembly language). The IGPP performs four major functions for the designer: (1) data input and display, (2) component placement (automatic or manual), (3) conductor path routing (automatic or manual), and (4) data output. The most complex PCB packaged to date measured 16.5 cm by 19 cm and contained 380 components, two layers of ground planes and four layers of conductors mixed with ground planes.

78 FR 21642 - Self-Regulatory Organizations; Chicago Board Options Exchange, Incorporated; Order Granting...

Federal Register 2010, 2011, 2012, 2013, 2014

2013-04-11

... securities suddenly declining by significant amounts in a very short time period before suddenly reversing to... circuit breaker pilot program, which was implemented through a series of rule filings by the equity exchanges and by FINRA.\\8\\ The single-stock circuit breaker was designed to reduce extraordinary market...

Easy-to-Implement Project Integrates Basic Electronics and Computer Programming

ERIC Educational Resources Information Center

Johnson, Richard; Shackelford, Ray

2008-01-01

The activities described in this article give students excellent experience with both computer programming and basic electronics. During the activities, students will work in small groups, using a BASIC Stamp development board to fabricate digital circuits and PBASIC to write program code that will control the circuits they have built. The…

System architecture of a gallium arsenide one-gigahertz digital IC tester

NASA Technical Reports Server (NTRS)

Fouts, Douglas J.; Johnson, John M.; Butner, Steven E.; Long, Stephen I.

1987-01-01

The design for a 1-GHz digital integrated circuit tester for the evaluation of custom GaAs chips and subsystems is discussed. Technology-related problems affecting the design of a GaAs computer are discussed, with emphasis on the problems introduced by long printed-circuit-board interconnect. High-speed interface modules provide a link between the low-speed microprocessor and the chip under test. Memory-multiplexer and memory-shift register architectures for the storage of test vectors are described in addition to an architecture for local data storage consisting of a long chain of GaAs shift registers. The tester is constructed around a VME system card cage and backplane, and very little high-speed interconnect exists between boards. The tester has a three part self-test consisting of a CPU board confidence test, a main memory confidence test, and a high-speed interface module functional test.

Design, Construction and Testing of a Prototype Holonomic Autonomous Vehicle

DTIC Science & Technology

2007-12-01

Circuit A simple 100 kHz crystal oscillator tank circuit using an LM741 opamp was fed to a LM393N comparator . The circuit’s schematic is provided...research in areas that support development of unmanned ground and air battlefield vehicles. Little attention has been paid to applying robotics to...motion control using a single board computer, a pulse width modulation (PWM) and optical isolation circuit, and a low-cost inertial measurement unit

Final Technical Report - 300°C Capable Electronics Platform and Temperature Sensor System For Enhanced Geothermal Systems

DOE Office of Scientific and Technical Information (OSTI.GOV)

Chen, Cheng-Po; Shaddock, David; Sandvik, Peter

2012-11-30

A silicon carbide (SiC) based electronic temperature sensor prototype has been demonstrated to operate at 300°C. We showed continuous operation of 1,000 hours with SiC operational amplifier and surface mounted discreet resistors and capacitors on a ceramic circuit board. This feasibility demonstration is a major milestone in the development of high temperature electronics in general and high temperature geothermal exploration and well management tools in particular. SiC technology offers technical advantages that are not found in competing technologies such as silicon-on-insulator (SOI) at high temperatures of 200°C to 300°C and beyond. The SiC integrated circuits and packaging methods can bemore » used in new product introduction by GE Oil and Gas for high temperature down-hole tools. The existing SiC fabrication facility at GE is sufficient to support the quantities currently demanded by the marketplace, and there are other entities in the United States and other countries capable of ramping up SiC technology manufacturing. The ceramic circuit boards are different from traditional organic-based electronics circuit boards, but the fabrication process is compatible with existing ceramic substrate manufacturing. This project has brought high temperature electronics forward, and brings us closer to commercializing tools that will enable and reduce the cost of enhanced geothermal technology to benefit the public in terms of providing clean renewable energy at lower costs.« less

Board-to-Board Free-Space Optical Interconnections Passing through Boards for a Bookshelf-Assembled Terabit-Per-Second-Class ATM Switch.

PubMed

Hirabayashi, K; Yamamoto, T; Matsuo, S; Hino, S

1998-05-10

We propose free-space optical interconnections for a bookshelf-assembled terabit-per-second-class ATM switch. Thousands of arrayed optical beams, each having a rate of a few gigabits per second, propagate vertically to printed circuit boards, passing through some boards, and are connected to arbitrary transmitters and receivers on boards by polarization controllers and prism arrays. We describe a preliminary experiment using a 1-mm-pitch 2 x 2 beam-collimator array that uses vertical-cavity surface-emitting laser diodes. These optical interconnections can be made quite stable in terms of mechanical shock and temperature fluctuation by the attachment of reinforcing frames to the boards and use of an autoalignment system.

PC board mount corrosion sensitive sensor

DOEpatents

Robinson, Alex L.; Casias, Adrian L.; Pfeifer, Kent B.; Laguna, George R.

2016-03-22

The present invention relates to surface mount structures including a capacitive element or a resistive element, where the element has a property that is responsive to an environmental condition. In particular examples, the structure can be optionally coupled to a printed circuit board. Other apparatuses, surface mountable structures, and methods of use are described herein.

Improved charge injection device and a focal plane interface electronics board for stellar tracking

NASA Technical Reports Server (NTRS)

Michon, G. J.; Burke, H. K.

1984-01-01

An improved Charge Injection Device (CID) stellar tracking sensor and an operating sensor in a control/readout electronics board were developed. The sensor consists of a shift register scanned, 256x256 CID array organized for readout of 4x4 subarrays. The 4x4 subarrays can be positioned anywhere within the 256x256 array with a 2 pixel resolution. This allows continuous tracking of a number of stars simultaneously since nine pixels (3x3) centered on any star can always be read out. Organization and operation of this sensor and the improvements in design and semiconductor processing are described. A hermetic package incorporating an internal thermoelectric cooler assembled using low temperature solders was developed. The electronics board, which contains the sensor drivers, amplifiers, sample hold circuits, multiplexer, analog to digital converter, and the sensor temperature control circuits, is also described. Packaged sensors were evaluated for readout efficiency, spectral quantum efficiency, temporal noise, fixed pattern noise, and dark current. Eight sensors along with two tracker electronics boards were completed, evaluated, and delivered.

Compact fluid cooled power converter supporting multiple circuit boards

DOEpatents

Radosevich, Lawrence D.; Meyer, Andreas A.; Beihoff, Bruce C.; Kannenberg, Daniel G.

2005-03-08

A support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support, in conjunction with other packaging features may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.

PCBs and OH-PCBs in Serum from Children and Mothers in Urban and Rural U.S. Communities

PubMed Central

Marek, Rachel F.; Thorne, Peter S.; Wang, Kai; DeWall, Jeanne; Hornbuckle, Keri C.

2013-01-01

East Chicago, Indiana is a heavily-industrialized community bisected by the Indiana Harbor and Ship Canal, which volatilizes ~7.5 kg/yr polychlorinated biphenyls (PCBs). In contrast, the rural Columbus Junction, Iowa area has no known current or past PCB industrial sources. Blood from children and their mothers from these communities were collected April 2008-January 2009 (n=177). Sera were analyzed for all 209 PCBs and 4 hydroxylated PCBs (OH-PCBs). Sum PCBs ranged from non-detect to 658 ng/g lw (median = 33.5 ng/g lw). Sum OH-PCBs ranged from non-detect to 1.2 ng/g fw (median = 0.07 ng/g fw). These concentrations are similar to those reported in other populations without high dietary PCB intake. Differences between the two communities were subtle. PCBs were detected in more East Chicago mothers and children than Columbus Junction mothers and children, and children from East Chicago were enriched in lower-molecular weight PCBs. East Chicago and Columbus Junction residents had similar levels of total and individual PCBs and OH-PCBs in their blood. Concentrations of parent PCBs correlated with concentrations of OH-PCBs. This is the first temporally- and methodologically-consistent study to evaluate all 209 PCBs and major metabolites in two generations of people living in urban and rural areas of the United States. PMID:23452180

Multi-level Simulation of a Real Time Vibration Monitoring System Component

NASA Technical Reports Server (NTRS)

Robertson, Bryan A.; Wilkerson, Delisa

2005-01-01

This paper describes the development of a custom built Digital Signal Processing (DSP) printed circuit board designed to implement the Advanced Real Time Vibration Monitoring Subsystem proposed by Marshall Space Flight Center (MSFC) Transportation Directorate in 2000 for the Space Shuttle Main Engine Advanced Health Management System (AHMS). This Real Time Vibration Monitoring System (RTVMS) is being developed for ground use as part of the AHMS Health Management Computer-Integrated Rack Assembly (HMC-IRA). The HMC-IRA RTVMS design contains five DSPs which are highly interconnected through individual communication ports, shared memory, and a unique communication router that allows all the DSPs to receive digitized data fiom two multi-channel analog boards simultaneously. This paper will briefly cover the overall board design but will focus primarily on the state-of-the-art simulation environment within which this board was developed. This 16-layer board with over 1800 components and an additional mezzanine card has been an extremely challenging design. Utilization of a Mentor Graphics simulation environment provided the unique board and system level simulation capability to ascertain any timing or functional concerns before production. By combining VHDL, Synopsys Software and Hardware Models, and the Mentor Design Capture Environment, multiple simulations were developed to verify the RTVMS design. This multi-level simulation allowed the designers to achieve complete operability without error the first time the RTVMS printed circuit board was powered. The HMC-IRA design has completed all engineering and deliverable unit testing. P

Multi-level Simulation of a Real Time Vibration Monitoring System Component

NASA Technical Reports Server (NTRS)

Roberston, Bryan; Wilkerson, DeLisa

2004-01-01

This paper describes the development of a custom built Digital Signal Processing (DSP) printed circuit board designed to implement the Advanced Real Time Vibration Monitoring Subsystem proposed by MSFC Transportation Directorate in 2000 for the Space Shuttle Main Engine Advanced Health Management System (AHMS). This Real Time Vibration Monitoring System (RTVMS) is being developed for ground use as part of the AHMS Health Management Computer-Integrated Rack Assembly (HMC-IRA). The HMC-IRA RTVMS design contains five DSPs which are highly interconnected through individual communication ports, shared memory, and a unique communication router that allows all the DSPs to receive digitized data from two multi-channel analog boards simultaneously. This paper will briefly cover the overall board design but will focus primarily on the state-of-the-art simulation environment within which this board was developed. This 16-layer board with over 1800 components and an additional mezzanine card has been an extremely challenging design. Utilization of a Mentor Graphics simulation environment provided the unique board and system level simulation capability to ascertain any timing or functional concerns before production. By combining VHDL, Synopsys Software and Hardware Models, and the Mentor Design Capture Environment, multiple simulations were developed to verify the RTVMS design. This multi-level simulation allowed the designers to achieve complete operability without error the first time the RTVMS printed circuit board was powered. The HMCIRA design has completed all engineering unit testing and the deliverable unit is currently under development.

Modeling and characteristic of the SMT Board Plug connector in high speed optical communication system

NASA Astrophysics Data System (ADS)

Wu, Haoran; Dong, Zhenzhen; Wang, Tanglin; Zhao, Heng; Feng, Junbo; Cui, Naidi; Teng, Jie; Guo, Jin

2015-04-01

Modeling and characteristic of the SMT Board Plug connector, which is used to connect micro optical transceiver to the main board, are proposed and analyzed in this paper. When the high speed signal transfers from the PCB of transceiver to main board through SMT Board Plug connector, the structure and material discontinuity of the connector causes insertion losses and impedance mismatches. This makes the performance of high speed digital system exacerbated. So it is essential to analyze the signal transfer characteristics of the connector and find out what factors affected the signal quality at the design stage of the digital system. To solve this problem, Ansoft's High Frequency Structure Simulator (HFSS), based on the finite element method, was employed to build accurate 3D models, analyze the effects of various structure parameters, and obtain the full-wave characteristics of the SMT Board Plug connectors in this paper. Then an equivalent circuit model was developed. The circuit parameters were extracted precisely in the frequency range of interests by using the curve fitting method in ADS software, and the result was in good agreement with HFSS simulations up to 8GHz with different structure parameters. At last, the measurement results of S-parameter and eye diagram were given and the S-parameters showed good coincidence between the measurement and HFSS simulation up to 4GHz.

Separation of the metallic and non-metallic fraction from printed circuit boards employing green technology.

PubMed

Estrada-Ruiz, R H; Flores-Campos, R; Gámez-Altamirano, H A; Velarde-Sánchez, E J

2016-07-05

The generation of electrical and electronic waste is increasing day by day; recycling is attractive because of the metallic fraction containing these. Nevertheless, conventional techniques are highly polluting. The comminution of the printed circuit boards followed by an inverse flotation process is a clean technique that allows one to separate the metallic fraction from the non-metallic fraction. It was found that particle size and superficial air velocity are the main variables in the separation of the different fractions. In this way an efficient separation is achieved by avoiding the environmental contamination coupled with the possible utilization of the different fractions obtained. Copyright © 2016 Elsevier B.V. All rights reserved.

Simultaneous extraction and clean-up of polychlorinated biphenyls and their metabolites from small tissue samples using pressurized liquid extraction

PubMed Central

Kania-Korwel, Izabela; Zhao, Hongxia; Norstrom, Karin; Li, Xueshu; Hornbuckle, Keri C.; Lehmler, Hans-Joachim

2008-01-01

A pressurized liquid extraction-based method for the simultaneous extraction and in situ clean-up of polychlorinated biphenyls (PCBs), hydroxylated (OH)-PCBs and methylsulfonyl (MeSO2)-PCBs from small (< 0.5 gram) tissue samples was developed and validated. Extraction of a laboratory reference material with hexane:dichloromethane:methanol (48:43:9, v/v) and Florisil as fat retainer allowed an efficient recovery of PCBs (78–112%; RSD: 13–37%), OH-PCBs (46±2%; RSD: 4%) and MeSO2-PCBs (89±21%; RSD: 24%). Comparable results were obtained with an established analysis method for PCBs, OH-PCBs and MeSO2-PCBs. PMID:19019378

Three-dimensionally deformable, highly stretchable, permeable, durable and washable fabric circuit boards.

PubMed

Li, Qiao; Tao, Xiao Ming

2014-11-08

This paper reports fabric circuit boards (FCBs), a new type of circuit boards, that are three-dimensionally deformable, highly stretchable, durable and washable ideally for wearable electronic applications. Fabricated by using computerized knitting technologies at ambient dry conditions, the resultant knitted FCBs exhibit outstanding electrical stability with less than 1% relative resistance change up to 300% strain in unidirectional tensile test or 150% membrane strain in three-dimensional ball punch test, extraordinary fatigue life of more than 1 000 000 loading cycles at 20% maximum strain, and satisfactory washing capability up to 30 times. To the best of our knowledge, the performance of new FCBs has far exceeded those of previously reported metal-coated elastomeric films or other organic materials in terms of changes in electrical resistance, stretchability, fatigue life and washing capability as well as permeability. Theoretical analysis and numerical simulation illustrate that the structural conversion of knitted fabrics is attributed to the effective mitigation of strain in the conductive metal fibres, hence the outstanding mechanical and electrical properties. Those distinctive features make the FCBs particularly suitable for next-to-skin electronic devices. This paper has further demonstrated the application potential of the knitted FCBs in smart protective apparel for in situ measurement during ballistic impact.

Removing lead from metallic mixture of waste printed circuit boards by vacuum distillation: factorial design and removal mechanism.

PubMed

Li, Xingang; Gao, Yujie; Ding, Hui

2013-10-01

The lead removal from the metallic mixture of waste printed circuit boards by vacuum distillation was optimized using experimental design, and a mathematical model was established to elucidate the removal mechanism. The variables studied in lead evaporation consisted of the chamber pressure, heating temperature, heating time, particle size and initial mass. The low-level chamber pressure was fixed at 0.1 Pa as the operation pressure. The application of two-level factorial design generated a first-order polynomial that agreed well with the data for evaporation efficiency of lead. The heating temperature and heating time exhibited significant effects on the efficiency, which was validated by means of the copper-lead mixture experiments. The optimized operating conditions within the region studied were the chamber pressure of 0.1 Pa, heating temperature of 1023 K and heating time of 120 min. After the conditions were employed to remove lead from the metallic mixture of waste printed circuit boards, the efficiency was 99.97%. The mechanism of the effects was elucidated by mathematical modeling that deals with evaporation, mass transfer and condensation, and can be applied to a wider range of metal removal by vacuum distillation. Copyright © 2013 Elsevier Ltd. All rights reserved.

Three-dimensionally deformable, highly stretchable, permeable, durable and washable fabric circuit boards

PubMed Central

Li, Qiao; Tao, Xiao Ming

2014-01-01

This paper reports fabric circuit boards (FCBs), a new type of circuit boards, that are three-dimensionally deformable, highly stretchable, durable and washable ideally for wearable electronic applications. Fabricated by using computerized knitting technologies at ambient dry conditions, the resultant knitted FCBs exhibit outstanding electrical stability with less than 1% relative resistance change up to 300% strain in unidirectional tensile test or 150% membrane strain in three-dimensional ball punch test, extraordinary fatigue life of more than 1 000 000 loading cycles at 20% maximum strain, and satisfactory washing capability up to 30 times. To the best of our knowledge, the performance of new FCBs has far exceeded those of previously reported metal-coated elastomeric films or other organic materials in terms of changes in electrical resistance, stretchability, fatigue life and washing capability as well as permeability. Theoretical analysis and numerical simulation illustrate that the structural conversion of knitted fabrics is attributed to the effective mitigation of strain in the conductive metal fibres, hence the outstanding mechanical and electrical properties. Those distinctive features make the FCBs particularly suitable for next-to-skin electronic devices. This paper has further demonstrated the application potential of the knitted FCBs in smart protective apparel for in situ measurement during ballistic impact. PMID:25383032

MEMS Technology for Space Applications

NASA Technical Reports Server (NTRS)

vandenBerg, A.; Spiering, V. L.; Lammerink, T. S. J.; Elwenspoek, M.; Bergveld, P.

1995-01-01

Micro-technology enables the manufacturing of all kinds of components for miniature systems or micro-systems, such as sensors, pumps, valves, and channels. The integration of these components into a micro-electro-mechanical system (MEMS) drastically decreases the total system volume and mass. These properties, combined with the increasing need for monitoring and control of small flows in (bio)chemical experiments, makes MEMS attractive for space applications. The level of integration and applied technology depends on the product demands and the market. The ultimate integration is process integration, which results in a one-chip system. An example of process integration is a dosing system of pump, flow sensor, micromixer, and hybrid feedback electronics to regulate the flow. However, for many applications, a hybrid integration of components is sufficient and offers the advantages of design flexibility and even the exchange of components in the case of a modular set up. Currently, we are working on hybrid integration of all kinds of sensors (physical and chemical) and flow system modules towards a modular system; the micro total analysis system (micro TAS). The substrate contains electrical connections as in a printed circuit board (PCB) as well as fluid channels for a circuit channel board (CCB) which, when integrated, form a mixed circuit board (MCB).

Solder Flux Residues and Humidity-Related Failures in Electronics: Relative Effects of Weak Organic Acids Used in No-Clean Flux Systems

NASA Astrophysics Data System (ADS)

Verdingovas, Vadimas; Jellesen, Morten Stendahl; Ambat, Rajan

2015-04-01

This paper presents the results of humidity testing of weak organic acids (WOAs), namely adipic, succinic, glutaric, dl-malic, and palmitic acids, which are commonly used as activators in no-clean solder fluxes. The study was performed under humidity conditions varying from 60% relative humidity (RH) to ˜99%RH at 25°C. The following parameters were used for characterization of WOAs: mass gain due to water adsorption and deliquescence of the WOA (by quartz crystal microbalance), resistivity of the water layer formed on the printed circuit board (by impedance spectroscopy), and leakage current measured using the surface insulation resistance pattern in the potential range from 0 V to 10 V. The combined results indicate the importance of the WOA chemical structure for the water adsorption and therefore conductive water layer formation on the printed circuit board assembly (PCBA). A substantial increase of leakage currents and probability of electrochemical migration was observed at humidity levels above the RH corresponding to the deliquescence point of WOAs present as contaminants on the printed circuit boards. The results suggest that use of solder fluxes with WOAs having higher deliquescence point could improve the reliability of electronics operating under circumstances in which exposure to high humidity is likely to occur.

Ultra-low current biosensor output detection using portable electronic reader

NASA Astrophysics Data System (ADS)

Yahaya, N. A. N.; Rajapaksha, R. D. A. A.; Uda, M. N. Afnan; Hashim, U.

2017-09-01

Generally, the electrical biosensor usually shows extremely low current signal output around pico ampere to microampere range. In this research, electronic reader with amplifier has been demonstrated to detect ultra low current via the biosensor. The operational amplifier Burr-Brown OPA 128 and Arduino Uno board were used to construct the portable electronic reader. There are two cascaded inverting amplifier were used to detect ultra low current through the biosensor from pico amperes (pA) to nano amperes ranges (nA). A small known input current was form by applying variable voltage between 0.1V to 5.0V across a 5GΩ high resistor to check the amplifier circuit. The amplifier operation was measured with the high impedance current source and has been compared with the theoretical measurement. The Arduino Uno was used to convert the analog signal to digital signal and process the data to display on reader screen. In this project, Proteus software was used to design and test the circuit. Then it was implemented together with Arduino Uno board. Arduino board was programmed using C programming language to make whole circuit communicate each order. The current was measured then it shows a small difference values compared to theoretical values, which is approximately 14pA.

Power Electronics Design Laboratory Exercise for Final-Year M.Sc. Students

ERIC Educational Resources Information Center

Max, L.; Thiringer, T.; Undeland, T.; Karlsson, R.

2009-01-01

This paper presents experiences and results from a project task in power electronics for students at Chalmers University of Technology, Goteborg, Sweden, based on a flyback test board. The board is used in the course Power Electronic Devices and Applications. In the project task, the students design snubber circuits, improve the control of the…

PCBs and OH-PCBs in polar bear mother-cub pairs: a comparative study based on plasma levels in 1998 and 2008.

PubMed

Bytingsvik, Jenny; Lie, Elisabeth; Aars, Jon; Derocher, Andrew E; Wiig, Øystein; Jenssen, Bjørn M

2012-02-15

The aim of this study was to examine the plasma concentrations and prevalence of polychlorinated biphenyls (PCBs) and hydroxylated PCB-metabolites (OH-PCBs) in polar bear (Ursus maritimus) mothers (n=26) and their 4 months old cubs-of-the-year (n=38) from Svalbard to gain insight into the mother-cub transfer, biotransformation and to evaluate the health risk associated with the exposure to these contaminants. As samplings were performed in 1997/1998 and 2008, we further investigated the differences in levels and pattern of PCBs between the two sampling years. The plasma concentrations of Σ(21)PCBs (1997/1998: 5710 ± 3090 ng/g lipid weight [lw], 2008: 2560 ± 1500 ng/g lw) and Σ(6)OH-PCBs (1997/1998: 228 ± 60 ng/g wet weight [ww], 2008: 80 ± 38 ng/g ww) in mothers were significantly lower in 2008 compared to in 1997/1998. In cubs, the plasma concentrations of Σ(21)PCBs (1997/1998: 14680 ± 5350 ng/g lw, 2008: 6070 ± 2590 ng/g lw) and Σ(6)OH-PCBs (1997/1998: 98 ± 23 ng/g ww, 2008: 49 ± 21 ng/g ww) were also significantly lower in 2008 than in 1997/1998. Σ(21)PCBs in cubs was 2.7 ± 0.7 times higher than in their mothers. This is due to a significant maternal transfer of these contaminants. In contrast, Σ(6)OH-PCBs in cubs were approximately 0.53 ± 0.16 times the concentration in their mothers. This indicates a lower maternal transfer of OH-PCBs compared to PCBs. The majority of the metabolite/precursor-ratios were lower in cubs compared to mothers. This may indicate that cubs have a lower endogenous capacity to biotransform PCBs to OH-PCBs than polar bear mothers. Exposure to PCBs and OH-PCBs is a potential health risk for polar bears, and the levels of PCBs and OH-PCBs in cubs from 2008 were still above levels associated with health effects in humans and wildlife. Copyright © 2012 Elsevier B.V. All rights reserved.

A dual RF resonator system for high-field functional magnetic resonance imaging of small animals.

PubMed

Ludwig, R; Bodgdanov, G; King, J; Allard, A; Ferris, C F

2004-01-30

A new apparatus has been developed that integrates an animal restrainer arrangement for small animals with an actively tunable/detunable dual radio-frequency (RF) coil system for in vivo anatomical and functional magnetic resonance imaging of small animals at 4.7 T. The radio-frequency coil features an eight-element microstrip line configuration that, in conjunction with a segmented outer copper shield, forms a transversal electromagnetic (TEM) resonator structure. Matching and active tuning/detuning is achieved through fixed/variable capacitors and a PIN diode for each resonator element. These components along with radio-frequency chokes (RFCs) and blocking capacitors are placed on two printed circuit boards (PCBs) whose copper coated ground planes form the front and back of the volume coil and are therefore an integral part of the resonator structure. The magnetic resonance signal response is received with a dome-shaped single-loop surface coil that can be height-adjustable with respect to the animal's head. The conscious animal is immobilized through a mechanical arrangement that consists of a Plexiglas body tube and a head restrainer. This restrainer has a cylindrical holder with a mouthpiece and position screws to receive and restrain the head of the animal. The apparatus is intended to perform anatomical and functional magnetic resonance imaging in conscious animals such as mice, rats, hamsters, and marmosets. Cranial images acquired from fully conscious rats in a 4.7 T Bruker 40 cm bore animal scanner underscore the feasibility of this approach and bode well to extend this system to the imaging of other animals.

Wafer-level radiometric performance testing of uncooled microbolometer arrays

NASA Astrophysics Data System (ADS)

Dufour, Denis G.; Topart, Patrice; Tremblay, Bruno; Julien, Christian; Martin, Louis; Vachon, Carl

2014-03-01

A turn-key semi-automated test system was constructed to perform on-wafer testing of microbolometer arrays. The system allows for testing of several performance characteristics of ROIC-fabricated microbolometer arrays including NETD, SiTF, ROIC functionality, noise and matrix operability, both before and after microbolometer fabrication. The system accepts wafers up to 8 inches in diameter and performs automated wafer die mapping using a microscope camera. Once wafer mapping is completed, a custom-designed quick insertion 8-12 μm AR-coated Germanium viewport is placed and the chamber is pumped down to below 10-5 Torr, allowing for the evaluation of package-level focal plane array (FPA) performance. The probe card is electrically connected to an INO IRXCAM camera core, a versatile system that can be adapted to many types of ROICs using custom-built interface printed circuit boards (PCBs). We currently have the capability for testing 384x288, 35 μm pixel size and 160x120, 52 μm pixel size FPAs. For accurate NETD measurements, the system is designed to provide an F/1 view of two rail-mounted blackbodies seen through the Germanium window by the die under test. A master control computer automates the alignment of the probe card to the dies, the positioning of the blackbodies, FPA image frame acquisition using IRXCAM, as well as data analysis and storage. Radiometric measurement precision has been validated by packaging dies measured by the automated probing system and re-measuring the SiTF and Noise using INO's pre-existing benchtop system.

Science Notes.

ERIC Educational Resources Information Center

School Science Review, 1987

1987-01-01

Contains 31 activities and experiments from the biological and physical sciences. Addresses such areas as reproduction, biotechnology, ecology, proteins, nitrates, aerosols, metal crystallinity, circuit boards, and photoswitching. (ML)

Detection and measurement of the agonistic activities of PCBs and mono-hydroxylated PCBs to the constitutive androstane receptor using a recombinant yeast assay.

PubMed

Kamata, Ryo; Shiraishi, Fujio; Kageyama, Shiho; Nakajima, Daisuke

2015-10-01

Polychlorinated biphenyls (PCBs) are thought to exert their toxicities mainly by binding to the aryl hydrocarbon receptor and by stimulating transcription of various genes, notably metabolizing enzymes including the cytochrome P450 (CYP) 1 family. However, PCBs and their metabolites could have potential to activate other nuclear receptors and subsequent events. We focused on the constitutive androstane receptor (CAR) inducing CYP2B and measured the agonistic activity of PCBs and mono-hydroxylated PCBs (OH-PCBs) to the CAR using yeast cells transduced with the human CAR and its response pathway. Twenty-nine of 34 tested PCBs and 72 of 91 OH-PCBs exhibited CAR agonistic effects. Of 41 OH-PCBs that had the same chlorination patterns as the tested PCBs, 9 had activities more than twice those of their non-hydroxylated analogs. In particular, 2',4',6'-trichlorobiphenyl-4-ol and 2,2',4',6'-tetrachlorobiphenyl-4-ol were 332- and 22-fold more potent than their analogs and were 15 times and 2.8 times, respectively, as active as a reference substance, 4-tert-octylphenol. The activities of 17 of the OH-PCBs were reduced to less than half those of their non-hydroxylated analogs. Four OH-PCBs derived from 3 active PCBs were inactive. However, a consistent relationship between hydroxyl substituent position and activity could not be discerned. Comprehensive evaluation of the toxic potential of PCBs and their hydroxylated metabolites and their concentrations in the environment are required. Copyright © 2015 Elsevier Ltd. All rights reserved.

An interactive wire-wrap board layout program

NASA Technical Reports Server (NTRS)

Schlutsmeyer, A.

1987-01-01

An interactive computer-graphics-based tool for specifying the placement of electronic parts on a wire-wrap circuit board is presented. Input is a data file (currently produced by a commercial logic design system) which describes the parts used and their interconnections. Output includes printed reports describing the parts and wire paths, parts counts, placement lists, board drawing, and a tape to send to the wire-wrap vendor. The program should reduce the engineer's layout time by a factor of 3 to 5 as compared to manual methods.

At grade optical crossover for monolithic optial circuits

NASA Technical Reports Server (NTRS)

Jamieson, Robert S. (Inventor)

1983-01-01

Planar optical circuits may be made to cross through each other, (thus eliminating extra steps required to fabricate elevated, nonintersecting crossovers) by control of the dimensions of the crossing light conductors (10, 12) to be significantly greater than d=0.89.lambda. and the angle of crossing as nearly 90.degree. as conveniently possible. A light trap may be provided just ahead of the intersection to trap any light being reflected in the source conductor at angles greater than about 45.degree.. The light trap may take the form of triangular shaped portions (16a, 16b) on each side of the source conductor with the far side of the triangular portion receiving incident light at an angle so that incident light will be reflected to the other side, or it may take the form of windows (18a, 18b) in place of the triangular portions. Planar optical circuit boards (21-23) may be fabricated and stacked to form a keyboard (20) with intersecting conductors (26-29) and keyholes (0-9) where conductors merge at the broad side of the circuit boards. These keyholes may be prearranged to form an array or matrix of keyholes.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Tanaka, T.J.; Nowlen, S.P.; Anderson, D.J.

Smoke can adversely affect digital electronics; in the short term, it can lead to circuit bridging and in the long term to corrosion of metal parts. This report is a summary of the work to date and component-level tests by Sandia National Laboratories for the Nuclear Regulatory Commission to determine the impact of smoke on digital instrumentation and control equipment. The component tests focused on short-term effects such as circuit bridging in typical components and the factors that can influence how much the smoke will affect them. These factors include the component technology and packaging, physical board protection, and environmentalmore » conditions such as the amount of smoke, temperature of burn, and humidity level. The likelihood of circuit bridging was tested by measuring leakage currents and converting those currents to resistance in ohms. Hermetically sealed ceramic packages were more resistant to smoke than plastic packages. Coating the boards with an acrylic spray provided some protection against circuit bridging. The smoke generation factors that affect the resistance the most are humidity, fuel level, and burn temperature. The use of CO{sub 2} as a fire suppressant, the presence of galvanic metal, and the presence of PVC did not significantly affect the outcome of these results.« less

Developing and Evaluating a Flexible Wireless Microcoil Array Based Integrated Interface for Epidural Cortical Stimulation.

PubMed

Wang, Xing; Chaudhry, Sharjeel A; Hou, Wensheng; Jia, Xiaofeng

2017-02-05

Stroke leads to serious long-term disability. Electrical epidural cortical stimulation has made significant improvements in stroke rehabilitation therapy. We developed a preliminary wireless implantable passive interface, which consists of a stimulating surface electrode, receiving coil, and single flexible passive demodulated circuit printed by flexible printed circuit (FPC) technique and output pulse voltage stimulus by inductively coupling an external circuit. The wireless implantable board was implanted in cats' unilateral epidural space for electrical stimulation of the primary visual cortex (V1) while the evoked responses were recorded on the contralateral V1 using a needle electrode. The wireless implantable board output stable monophasic voltage stimuli. The amplitude of the monophasic voltage output could be adjusted by controlling the voltage of the transmitter circuit within a range of 5-20 V. In acute experiment, cortico-cortical evoked potential (CCEP) response was recorded on the contralateral V1. The amplitude of N2 in CCEP was modulated by adjusting the stimulation intensity of the wireless interface. These results demonstrated that a wireless interface based on a microcoil array can offer a valuable tool for researchers to explore electrical stimulation in research and the dura mater-electrode interface can effectively transmit electrical stimulation.

Electronic Jewelry

ERIC Educational Resources Information Center

Ward, Vesta

1972-01-01

Brightly banded resisters, condensers, diodes and transistors as well as printed circuit boards were used with the objective of discovering their potential in creating objects for personal adornment. (RB)

Cryogenic applications of commercial electronic components

NASA Astrophysics Data System (ADS)

Buchanan, Ernest D.; Benford, Dominic J.; Forgione, Joshua B.; Harvey Moseley, S.; Wollack, Edward J.

2012-10-01

We have developed a range of techniques useful for constructing analog and digital circuits for operation in a liquid Helium environment (4.2 K), using commercially available low power components. The challenges encountered in designing cryogenic electronics include finding components that can function usefully in the cold and possess low enough power dissipation so as not to heat the systems they are designed to measure. From design, test, and integration perspectives it is useful for components to operate similarly at room and cryogenic temperatures; however this is not a necessity. Some of the circuits presented here have been used successfully in the MUSTANG [1] and in the GISMO [2] camera to build a complete digital to analog multiplexer (which will be referred to as the Cryogenic Address Driver board). Many of the circuit elements described are of a more general nature rather than specific to the Cryogenic Address Driver board, and were studied as a part of a more comprehensive approach to addressing a larger set of cryogenic electronic needs.

Cryogenic Applications of Commercial Electronic Components

NASA Technical Reports Server (NTRS)

Buchanan, Ernest D.; Benford, Dominic J.; Forgione, Joshua B.; Moseley, S. Harvey; Wollack, Edward J.

2012-01-01

We have developed a range of techniques useful for constructing analog and digital circuits for operation in a liquid Helium environment (4.2K), using commercially available low power components. The challenges encountered in designing cryogenic electronics include finding components that can function usefully in the cold and possess low enough power dissipation so as not to heat the systems they are designed to measure. From design, test, and integration perspectives it is useful for components to operate similarly at room and cryogenic temperatures; however this is not a necessity. Some of the circuits presented here have been used successfully in the MUSTANG and in the GISMO camera to build a complete digital to analog multiplexer (which will be referred to as the Cryogenic Address Driver board). Many of the circuit elements described are of a more general nature rather than specific to the Cryogenic Address Driver board, and were studied as a part of a more comprehensive approach to addressing a larger set of cryogenic electronic needs.

Inductance optimization of miniature Broadband transformers with racetrack shaped ferrite cores for Ethernet applications

NASA Astrophysics Data System (ADS)

Bowen, David; Krafft, Charles; Mayergoyz, Isaak D.

2017-05-01

There is strong commercial interest in the ability to fabricate the windings of traditional miniature wire-wound inductive circuit components, such as Ethernet transformers, lithographically. For greater inductance devices, thick cores are required, making the process of embedding the ferrite material within circuit board one of few options for lithographic winding fabrication. In this paper, a non-traditional core shape, suitable for embedding in circuit board, is examined analytically and experimentally; the racetrack shape is two halves of a toroid connected by straight legs. With regard to the high inductance requirements for Ethernet applications (350μH), the racetrack transformer inductance is analytically optimized, determining the optimal physical dimensions. Two sizes of racetrack-core transformers were fabricated and measured. The measured inductance was in reasonable agreement with the analytical prediction, though large variations in material permeability are expected from the mechanical processing of the ferrite. Some of the experimental transformers were observed to satisfy the Ethernet inductance requirement.

Design principles and realization of electro-optical circuit boards

NASA Astrophysics Data System (ADS)

Betschon, Felix; Lamprecht, Tobias; Halter, Markus; Beyer, Stefan; Peterson, Harry

2013-02-01

The manufacturing of electro-optical circuit boards (EOCB) is based to a large extent on established technologies. First products with embedded polymer waveguides are currently produced in series. The range of applications within the sensor and data communication markets is growing with the increasing maturity level. EOCBs require design flows, processes and techniques similar to existing printed circuit board (PCB) manufacturing and appropriate for optical signal transmission. A key aspect is the precise and automated assembly of active and passive optical components to the optical waveguides which has to be supported by the technology. The design flow is described after a short introduction into the build-up of EOCBs and the motivation for the usage of this technology within the different application fields. Basis for the design of EOCBs are the required optical signal transmission properties. Thereafter, the devices for the electro-optical conversion are chosen and the optical coupling approach is defined. Then, the planar optical elements (waveguides, splitters, couplers) are designed and simulated. This phase already requires co-design of the optical and electrical domain using novel design flows. The actual integration of an optical system into a PCB is shown in the last part. The optical layer is thereby laminated to the purely electrical PCB using a conventional PCB-lamination process to form the EOCB. The precise alignment of the various electrical and optical layers is thereby essential. Electrical vias are then generated, penetrating also the optical layer, to connect the individual electrical layers. Finally, the board has to be tested electrically and optically.

The present triumphs and future problems with wave soldering

DOE Office of Scientific and Technical Information (OSTI.GOV)

Vianco, P.T.

1993-10-01

Nearly 40 years of experience with wave soldering have resulted in processes that routinely produce several thousand, defect-free solder joints per minute. However, the climate of electronics manufacturing has changed significantly over the past 10 to 15 years. Environmental restrictions as well as the high quality of products made offshore has placed new demands and challenges on the electronics industry, right down to the assembly process. The impact on wave soldering by environmental regulations and a need for more cost-competitive manufacturing processes has become a serious issue in terms of the economical well-being of the industry. In order to obtainmore » a clearer understanding of the situation, however, it is first most appropriate and necessary to examine the technology of wave soldering. Historically, wave soldering was developed as a refinement of the dip and drag soldering processes with the objective of reducing or eliminating many of the associated defects often present in these earlier processes. Wave soldering reduces the area of contact between the circuit board and the solder. This characteristic, coupled with the agitation generated in the solder, allows flux and its volatile by-products to readily escape from under the board, decreasing the number of skips, unfilled holes, and solder joint voids. The reduced contact area also lessens the potential for thermal damage to the circuit board laminate. Control of the wave profile at the exit point of the circuit board lessens the likelihood of icicles and bridges forming on the solder joints; this latitude is not available in the dip soldering process.« less

Elements configuration of the open lead test circuit

DOE Office of Scientific and Technical Information (OSTI.GOV)

Fukuzaki, Yumi, E-mail: 14514@sr.kagawa-nct.ac.jp; Ono, Akira

In the field of electronics, small electronic devices are widely utilized because they are easy to carry. The devices have various functions by user’s request. Therefore, the lead’s pitch or the ball’s pitch have been narrowed and high-density printed circuit board has been used in the devices. Use of the ICs which have narrow lead pitch makes normal connection difficult. When logic circuits in the devices are fabricated with the state-of-the-art technology, some faults have occurred more frequently. It can be divided into types of open faults and short faults. We have proposed a new test method using a testmore » circuit in the past. This paper propose elements configuration of the test circuit.« less

Reusable vibration resistant integrated circuit mounting socket

DOE Office of Scientific and Technical Information (OSTI.GOV)

Evans, C.N.

1993-12-31

This invention discloses a novel form of socket for integrated circuits to be mounted on printed circuit boards. The socket uses a novel contact which is fabricated out of a bimetallic strip with a shape which makes the end of the strip move laterally as temperature changes. The end of the strip forms a barb which digs into an integrated circuit lead at normal temperatures and hold it firmly in the contact, preventing loosening and open circuits from vibration. By cooling the contact containing the bimetallic strip the barb end can be made to release so that the integrated circuitmore » lead can be removed from the socket without damage either to the lead or to the socket components.« less

Reusable vibration resistant integrated circuit mounting socket

DOE Office of Scientific and Technical Information (OSTI.GOV)

Evans, C.N.

1995-08-29

This invention discloses a novel form of socket for integrated circuits to be mounted on printed circuit boards. The socket uses a novel contact which is fabricated out of a bimetallic strip with a shape which makes the end of the strip move laterally as temperature changes. The end of the strip forms a barb which digs into an integrated circuit lead at normal temperatures and holds it firmly in the contact, preventing loosening and open circuits from vibration. By cooling the contact containing the bimetallic strip the barb end can be made to release so that the integrated circuitmore » lead can be removed from the socket without damage either to the lead or to the socket components. 11 figs.« less

Resistence seam welding thin copper foils

DOE Office of Scientific and Technical Information (OSTI.GOV)

Hollar, D.L. Jr.

1991-02-01

Use of flat flexible circuits in the electronics industry is expanding. The term flexible circuits'' is defined here as copper foil which has been bonded to an insulating film such as Kapton film. The foil is photo processed to produce individual circuit paths similar to printed circuit boards. Another insulating film is laminated over the conductors to complete the flexible circuit. Flexible circuits, like multiwire cables, are susceptible to electromagnetic radiation (EMR) interference. On multiwire cables the interference problem is mitigated by adding a woven wire braid shielding over the conductors. Shielding on flexible circuits is accomplished by enclosing themore » circuits in a copper foil envelope. However, the copper foil must be electrically sealed around the flexcircuit to be effective. Ultimately, a resistance seam welding process and appropriate equipment were developed which would provide the required electrical seal between two layers of 2-oz (0.0028-inch thick) copper foil on a 1.1-inch wide, 30-inch long, 0.040-inch thick flexible circuit. 4 refs., 19 figs.« less

Metamorphosis increases biotransformation of polychlorinated biphenyls: a comparative study of polychlorinated biphenyl metabolism in green frogs (Rana clamitans) and leopard frogs (Rana pipiens) at various life stages.

PubMed

Leney, Jocelyn L; Drouillard, Ken G; Haffner, G Douglas

2006-11-01

Polychlorinated biphenyl (PCB) elimination rates were used to determine whether green frogs (Rana clamitans) and leopard frogs (Rana pipiens) at three life stages (tadpole, metamorph, and adult) were capable of metabolic biotransformation of PCBs. Polychlorinated biphenyls were grouped according to their structural properties to determine whether congeners with specific structures were eliminated more rapidly than others, which would suggest the occurrence of metabolic biotransformation. For both species and at all life stages studied, PCBs with adjacent unsubstituted meta-para sites (group-2 PCBs) were eliminated significantly faster than PCBs with adjacent unsubstituted ortho-meta sites (group-3 PCBs). Because these groups of PCBs span similar hydrophobicity ranges, it was concluded that green and leopard frogs can selectively metabolize group-2 PCBs. Metabolic activity was more pronounced in the metamorph stage than in any other life stage. In green frog metamorphs, the average elimination rate of the group-2 PCBs was 4.9-fold greater than that of the group-3 PCBs. By contrast, in green frog tadpoles, group-2 PCBs were eliminated 1.9-fold faster than group-3 PCBs, and in green frog adults, group-2 PCBs were eliminated 1.5-fold faster than group-3 PDBs.

Evaluation of Electrochemical Migration on Printed Circuit Boards with Lead-Free and Tin-Lead Solder

NASA Astrophysics Data System (ADS)

He, Xiaofei; Azarian, Michael H.; Pecht, Michael G.

2011-09-01

To evaluate the current leakage and electrochemical migration behavior on printed circuit boards with eutectic tin-lead and lead-free solder, IPC B-24 comb structures were exposed to 65°C and 88% relative humidity conditions under direct-current (DC) bias for over 1500 h. These boards were processed with either Sn-3.0Ag-0.5Cu solder or Sn-37Pb solder. In addition to solder alloy, board finish (organic solderability preservative versus lead-free hot air solder leveling), spacing (25 mil versus 12.5 mil), and voltage (40 V versus 5 V bias) were also assessed by using in situ measurements of surface insulation resistance (SIR) and energy-dispersive spectroscopy after testing. It was shown that an initial increase of SIR was caused by consumption of electroactive species on the surface, intermittent drops of SIR were caused by dendritic growth, and a long-term SIR decline was caused by electrodeposition of a metallic layer. The prolonged SIR decline of Sn-3.0Ag-0.5Cu boards was simulated by three-dimensional (3D) progressive and instantaneous nucleation models, whose predictions were compared with experimental data. Sn-37Pb boards exhibited comigration of Sn, Pb, and Cu, while Sn-3.0Ag-0.5Cu boards incurred comigration of Sn, Ag, and Cu. Among the migrated species, Sn always dominated and was observed as either a layer or in polyhedral deposits, Pb was the most common element found in the dendrites, Cu was a minor constituent, and Ag migrated only occasionally. Compared with solder alloy, board finishes played a secondary role in affecting SIR due to their complexation with or dissolution into the solder. The competing effect between electric field and spacing was also investigated.

Packaging of electro-microfluidic devices

DOEpatents

Benavides, Gilbert L.; Galambos, Paul C.; Emerson, John A.; Peterson, Kenneth A.; Giunta, Rachel K.; Zamora, David Lee; Watson, Robert D.

2003-04-15

A new architecture for packaging surface micromachined electro-microfluidic devices is presented. This architecture relies on two scales of packaging to bring fluid to the device scale (picoliters) from the macro-scale (microliters). The architecture emulates and utilizes electronics packaging technology. The larger package consists of a circuit board with embedded fluidic channels and standard fluidic connectors (e.g. Fluidic Printed Wiring Board). The embedded channels connect to the smaller package, an Electro-Microfluidic Dual-Inline-Package (EMDIP) that takes fluid to the microfluidic integrated circuit (MIC). The fluidic connection is made to the back of the MIC through Bosch-etched holes that take fluid to surface micromachined channels on the front of the MIC. Electrical connection is made to bond pads on the front of the MIC.

Packaging of electro-microfluidic devices

DOEpatents

Benavides, Gilbert L.; Galambos, Paul C.; Emerson, John A.; Peterson, Kenneth A.; Giunta, Rachel K.; Watson, Robert D.

2002-01-01

A new architecture for packaging surface micromachined electro-microfluidic devices is presented. This architecture relies on two scales of packaging to bring fluid to the device scale (picoliters) from the macro-scale (microliters). The architecture emulates and utilizes electronics packaging technology. The larger package consists of a circuit board with embedded fluidic channels and standard fluidic connectors (e.g. Fluidic Printed Wiring Board). The embedded channels connect to the smaller package, an Electro-Microfluidic Dual-Inline-Package (EMDIP) that takes fluid to the microfluidic integrated circuit (MIC). The fluidic connection is made to the back of the MIC through Bosch-etched holes that take fluid to surface micromachined channels on the front of the MIC. Electrical connection is made to bond pads on the front of the MIC.

A process for preparing an ultra-thin, adhesiveless, multi-layered, patterned polymer substrate

NASA Technical Reports Server (NTRS)

Bryant, Robert G. (Inventor); Kruse, Nancy H. M. (Inventor); Fox, Robert L. (Inventor); Tran, Sang Q. (Inventor)

1995-01-01

A process for preparing an ultra-thin, adhesiveless, multi-layered, patterned polymer substrate is disclosed. The process may be used to prepare both rigid and flexible cables and circuit boards. A substrate is provided and a polymeric solution comprising a self-bonding, soluble polymer and a solvent is applied to the substrate. Next, the polymer solution is dried to form a polymer coated substrate. The polymer coated substrate is metallized and patterned. At least one additional coating of the polymeric solution is applied to the metallized, patterned, polymer coated substrate and the steps of metallizing and patterning are repeated. Lastly, a cover coat is applied. When preparing a flexible cable and flexible circuit board, the polymer coating is removed from the substrate.

Loopback Tester: a synchronous communications circuit diagnostic device

DOE Office of Scientific and Technical Information (OSTI.GOV)

Maestas, J.H.

1986-07-01

The Loopback Tester is an Intel SBC 86/12A Single Board Computer and an Intel SBC 534 Communications Expansion Board configured and programmed to perform various basic or less. These tests include: (1) Data Communications Equipment (DCE) transmit timing detection (2) data rate measurement (3) instantaneous loopback indication and (4) bit error rate testing. It requires no initial setup after plug in, and can be used to locate the source of communications loss in a circuit. It can also be used to determine when crypto variable mismatch problems are the source of communications loss. This report discusses the functionality of themore » Loopback Tester as a diagnostic device. It also discusses the hardware and software which implements this simple yet reliable device.« less

Concepts for on-board satellite image registration. Volume 3: Impact of VLSI/VHSIC on satellite on-board signal processing

NASA Technical Reports Server (NTRS)

Aanstoos, J. V.; Snyder, W. E.

1981-01-01

Anticipated major advances in integrated circuit technology in the near future are described as well as their impact on satellite onboard signal processing systems. Dramatic improvements in chip density, speed, power consumption, and system reliability are expected from very large scale integration. Improvements are expected from very large scale integration enable more intelligence to be placed on remote sensing platforms in space, meeting the goals of NASA's information adaptive system concept, a major component of the NASA End-to-End Data System program. A forecast of VLSI technological advances is presented, including a description of the Defense Department's very high speed integrated circuit program, a seven-year research and development effort.

Flame Retardancy of Chemically Modified Lignin as Functional Additive to Epoxy Nanocomposites

Treesearch

John A. Howarter; Gamini P. Mendis; Alex N. Bruce; Jeffrey P. Youngblood; Mark A. Dietenberger; Laura Hasburgh

2015-01-01

Epoxy printed circuit boards are used in a variety of electronics applications as rigid, thermally stable substrates. Due to the propensity of components on the boards, such as batteries and interconnects, to fail and ignite the epoxy, flame retardant additives are required to minimize fire risk. Currently, industry uses brominated flame retardants, such as TBBPA, to...

Piezoelectric Response of Ferroelectric Ceramics Under Mechanical Stress

DTIC Science & Technology

2015-09-17

dynamic response, and predict mechanical breakdown of electronic materials, numerous testing techniques such as very high-g machines , drop towers...James C. Hierholzer for building the custom test fixture, Michael D. Craft for his help with static capacitance measurements, Bryan J. Turner, Scott D...ISOLA 370HR Board Specimen Test Set-Up . . . . . . . . . . . . . . . . . . 59 3.3 Printed Circuit Board Electrical Layout

Silver Ink For Jet Printing

NASA Technical Reports Server (NTRS)

Vest, R. W.; Singaram, Saraswathi

1989-01-01

Metallo-organic ink containing silver (with some bismuth as adhesion agent) applied to printed-circuit boards and pyrolized in air to form electrically conductive patterns. Ink contains no particles of silver, does not have to be mixed during use to maintain homogeneity, and applied to boards by ink-jet printing heads. Consists of silver neodecanoate and bismuth 2-ethylhexanoate dissolved in xylene and/or toluene.

Evaluation of a recycling process for printed circuit board by physical separation and heat treatment

DOE Office of Scientific and Technical Information (OSTI.GOV)

Fujita, Toyohisa, E-mail: tfujita@sys.t.u-tokyo.ac.jp; Ono, Hiroyuki; Dodbiba, Gjergj

Highlights: • The parts mounted on printed circuit board (PCB) were liberated by underwater explosion and mechanical crushing. • The crushed PCB without surface-mounted parts was carbonized under inert atmosphere at 873 K to recover copper. • The multi-layered ceramic capacitors including nickel was carbonized at 873 K to recover nickel by the magnetic separation. • The tantalum powders were recovered from the molded resins by heat treatment at 723 and 823 K in air atmosphere and screening. • Energy and treatment cost of new process increased, however, the environmental burden decreased comparing conventional one. - Abstract: Printed circuit boardsmore » (PCBs) from discarded personal computer (PC) and hard disk drive were crushed by explosion in water or mechanical comminution in order to disintegrate the attached parts. More parts were stripped from PCB of PC, composed of epoxy resin; than from PCB of household appliance, composed of phenol resin. In an attempt to raise the copper grade of PCB by removing other components, a carbonization treatment was investigated. The crushed PCB without surface-mounted parts was carbonized under a nitrogen atmosphere at 873–1073 K. After screening, the char was classified by size into oversized pieces, undersized pieces and powder. The copper foil and glass fiber pieces were liberated and collected in undersized fraction. The copper foil was liberated easily from glass fiber by stamping treatment. As one of the mounted parts, the multi-layered ceramic capacitors (MLCCs), which contain nickel, were carbonized at 873 K. The magnetic separation is carried out at a lower magnetic field strength of 0.1 T and then at 0.8 T. In the +0.5 mm size fraction the nickel grade in magnetic product was increased from 0.16% to 6.7% and the nickel recovery is 74%. The other useful mounted parts are tantalum capacitors. The tantalum capacitors were collected from mounted parts. The tantalum-sintered bodies were separated from molded resins by heat treatment at 723–773 K in air atmosphere and screening of 0.5 mm. Silica was removed and 70% of tantalum grade was obtained after more than 823 K heating and separation. Next, the evaluation of Cu recycling in PCB is estimated. Energy consumption of new process increased and the treatment cost becomes 3 times higher comparing the conventional process, while the environmental burden of new process decreased comparing conventional process. The nickel recovery process in fine ground particles increased energy and energy cost comparing those of the conventional process. However, the environmental burden decreased than the conventional one. The process for recovering tantalum used more heat for the treatment and therefore the energy consumption increased by 50%, when comparing with conventional process. However, the market price for tantalum is very large; the profit for tantalum recovery is added. Also the environmental burden decreased by the recycling of tantalum recovery. Therefore, the tantalum recovery is very important step in the PCB recycling. If there is no tantalum, the consumed energy and treatment cost increase in the new process, though the environmental burden decreases.« less

Measurement of luminescence decays: High performance at low cost

NASA Astrophysics Data System (ADS)

Sulkes, Mark; Sulkes, Zoe

2011-11-01

The availability of inexpensive ultra bright LEDs spanning the visible and near-ultraviolet combined with the availability of inexpensive electronics equipment makes it possible to construct a high performance luminescence lifetime apparatus (˜5 ns instrumental response or better) at low cost. A central need for time domain measurement systems is the ability to obtain short (˜1 ns or less) excitation light pulses from the LEDs. It is possible to build the necessary LED driver using a simple avalanche transistor circuit. We describe first a circuit to test for small signal NPN transistors that can avalanche. We then describe a final optimized avalanche mode circuit that we developed on a prototyping board by measuring driven light pulse duration as a function of the circuit on the board and passive component values. We demonstrate that the combination of the LED pulser and a 1P28 photomultiplier tube used in decay waveform acquisition has a time response that allows for detection and lifetime determination of luminescence decays down to ˜5 ns. The time response and data quality afforded with the same components in time-correlated single photon counting are even better. For time-correlated single photon counting an even simpler NAND-gate based LED driver circuit is also applicable. We also demonstrate the possible utility of a simple frequency domain method for luminescence lifetime determinations.

Hydroxylated polychlorinated biphenyls in the environment: sources, fate, and toxicities.

PubMed

Tehrani, Rouzbeh; Van Aken, Benoit

2014-05-01

Hydroxylated polychlorinated biphenyls (OH-PCBs) are produced in the environment by the oxidation of PCBs through a variety of mechanisms, including metabolic transformation in living organisms and abiotic reactions with hydroxyl radicals. As a consequence, OH-PCBs have been detected in a wide range of environmental samples, including animal tissues, water, and sediments. OH-PCBs have recently raised serious environmental concerns because they exert a variety of toxic effects at lower doses than the parent PCBs and they are disruptors of the endocrine system. Although evidence about the widespread dispersion of OH-PCBs in various compartments of the ecosystem has accumulated, little is currently known about their biodegradation and behavior in the environment. OH-PCBs are, today, increasingly considered as a new class of environmental contaminants that possess specific chemical, physical, and biological properties not shared with the parent PCBs. This article reviews recent findings regarding the sources, fate, and toxicities of OH-PCBs in the environment.

Programmable logic devices

NASA Astrophysics Data System (ADS)

Jacobs, J. L.

1993-04-01

Erasable programmable logic devices (EPLD's) were investigated to determine their advantages and/or disadvantages in Test Equipment Engineering applications. It was found that EPLD's performed as well as or better than identical circuits using standard transistor transistor logic (TTL). The chip count in these circuits was reduced, saving printed circuit board space and shortening fabrication and prove-in time. Troubleshooting circuits of EPLD's was also easier with 10 to 100 times fewer wires needed. The reduced number of integrated circuits (IC's) contributed to faster system speeds and an overall lower power consumption. In some cases changes to the circuit became software changes using EPLD's instead of hardware changes for standard logic. Using EPLD's was fairly easy; however, as with any new technology, a learning curve must be overcome before EPLD's can be used efficiently. The many benefits of EPLD's outweighed this initial inconvenience.

The LANL P14 temperature control electronics for the waveshaping filter

DOE Office of Scientific and Technical Information (OSTI.GOV)

Nahman, N.S.

1993-12-17

The Pulse Waveform Standard is designed to be operated in a laboratory environment in which the temperature is controlled and maintained at 22 C. The temperature controller of the Pulse Waveform Standard must be set to operate at 30 C. This report gives information for calibrating and maintaining the temperature control electronics. Temperature controller circuit diagrams and temperature controller circuit board layouts are included.

Method of defining features on materials with a femtosecond laser

DOEpatents

Roos, Edward Victor [Los Altos, CA; Roeske, Franklin [Livermore, CA; Lee, Ronald S [Livermore, CA; Benterou, Jerry J [Livermore, CA

2006-05-23

The invention relates to a pulsed laser ablation method of metals and/or dielectric films from the surface of a wafer, printed circuit board or a hybrid substrate. By utilizing a high-energy ultra-short pulses of laser light, such a method can be used to manufacture electronic circuits and/or electro-mechanical assemblies without affecting the material adjacent to the ablation zone.

Particle size distribution and gas-particle partitioning of polychlorinated biphenyls in the atmosphere in Beijing, China.

PubMed

Zhu, Qingqing; Zheng, Minghui; Liu, Guorui; Zhang, Xian; Dong, Shujun; Gao, Lirong; Liang, Yong

2017-01-01

Size-fractionated samples of urban particulate matter (PM; ≤1.0, 1.0-2.5, 2.5-10, and >10 μm) and gaseous samples were simultaneously obtained to study the distribution of polychlorinated biphenyls (PCBs) in the atmosphere in Beijing, China. Most recent investigations focused on the analysis of gaseous PCBs, and much less attention has been paid to the occurrence of PCBs among different PM fractions. In the present study, the gas-particle partitioning and size-specific distribution of PCBs in atmosphere were investigated. The total concentrations (gas + particle phase fractions) of Σ 12 dioxin-like PCBs, Σ 7 indicator PCBs, and ΣPCBs were 1.68, 42.1, and 345 pg/m 3 , respectively. PCBs were predominantly in the gas phase (86.8-99.0 % of the total concentrations). The gas-particle partition coefficients (K p ) of PCBs were found to be a significant linear correlated with the subcooled liquid vapor pressures (P L 0 ) (R 2  = 0.83, P < 0.01). The slope (m r ) implied that the gas-particle partitioning of PCBs was affected both by the mechanisms of adsorption and absorption. In addition, the concentrations of PCBs increased as the particle size decreased (>10, 2.5-10, 1.0-2.5, and ≤1.0 μm), with most of the PCBs contained in the fraction of ≤1.0 μm (53.4 % of the total particulate concentrations). Tetra-CBs were the main homolog in the air samples in the gas phase and PM fractions, followed by tri-CBs. This work will contribute to the knowledge of PCBs among different PM fractions and fill the gap of the size distribution of particle-bound dioxin-like PCBs in the air.

Variability in PCB and OH-PCB Serum Levels in Children and Their Mothers in Urban and Rural U.S. Communities

PubMed Central

2015-01-01

Environmental exposures that affect accumulation of polychlorinated biphenyls (PCBs) in humans are complex and not fully understood. One challenge in linking environmental exposure to accumulation is determining variability of PCB concentrations in samples collected from the same person at different times. We hypothesized that PCBs in human blood serum are consistent from year to year in people who live in the same environment between sampling. We analyzed blood serum from children and their mothers from urban and rural U.S. communities (n = 200) for all 209 PCBs (median ∑PCBs = 45 ng/g lw) and 12 hydroxylated PCBs (median ∑OH-PCBs = 0.09 ng/g fw). A subset of these participants (n = 155) also had blood PCB and OH-PCB concentrations analyzed during the previous calendar year. Although many participants had similar levels of PCBs and OH-PCBs in their blood from one year to the next, some participants had surprisingly different levels. Year-to-year variability in ∑PCBs ranged from −87% to 567% and in ∑OH-PCBs ranged from −51 to 358% (5th–95th percentile). This is the first study to report variability of all PCBs and major metabolites in two generations of people and suggests short-term exposures to PCBs may be a significant component of what is measured in human serum. PMID:25300024

Detection of methoxylated and hydroxylated polychlorinated biphenyls in sewage sludge in China with evidence for their microbial transformation

PubMed Central

Sun, Jianteng; Zhu, Lizhong; Pan, Lili; Wei, Zi; Song, Yao; Zhang, Yuduo; Qu, Liping; Zhan, Yu

2016-01-01

The concentrations of methoxylated polychlorinated biphenyls (MeO-PCBs) and hydroxylated polychlorinated biphenyls (OH-PCBs) were measured in the sewage sludge samples collected from twelve wastewater treatment plants in China. Two MeO-PCB congeners, including 3′-MeO-CB-65 and 4′-MeO-CB-101, were detected in three sludge with mean concentrations of 0.58 and 0.52 ng/g dry weight, respectively. OH-PCBs were detected in eight sludge samples, with an average total concentration of 4.2 ng/g dry weight. Furthermore, laboratory exposure was conducted to determine the possible source of OH-PCBs and MeO-PCBs in the sewage sludge, and their metabolism by the microbes. Both 4′-OH-CB-101 and 4′-MeO-CB-101 were detected as metabolites of CB-101 at a limited conversion rate after 5 days. Importantly, microbial interconversion between OH-PCBs and MeO-PCBs was observed in sewage sludge. Demethylation of MeO-PCBs was favored over methylation of OH-PCBs. The abundant and diverse microbes in sludge play a key role in the transformation processes of the PCB analogues. To our knowledge, this is the first report on MeO-PCBs in environmental matrices and on OH-PCBs in sewage sludge. The findings are important to understand the environmental fate of PCBs. PMID:27417462

Detection of methoxylated and hydroxylated polychlorinated biphenyls in sewage sludge in China with evidence for their microbial transformation

NASA Astrophysics Data System (ADS)

Sun, Jianteng; Zhu, Lizhong; Pan, Lili; Wei, Zi; Song, Yao; Zhang, Yuduo; Qu, Liping; Zhan, Yu

2016-07-01

The concentrations of methoxylated polychlorinated biphenyls (MeO-PCBs) and hydroxylated polychlorinated biphenyls (OH-PCBs) were measured in the sewage sludge samples collected from twelve wastewater treatment plants in China. Two MeO-PCB congeners, including 3‧-MeO-CB-65 and 4‧-MeO-CB-101, were detected in three sludge with mean concentrations of 0.58 and 0.52 ng/g dry weight, respectively. OH-PCBs were detected in eight sludge samples, with an average total concentration of 4.2 ng/g dry weight. Furthermore, laboratory exposure was conducted to determine the possible source of OH-PCBs and MeO-PCBs in the sewage sludge, and their metabolism by the microbes. Both 4‧-OH-CB-101 and 4‧-MeO-CB-101 were detected as metabolites of CB-101 at a limited conversion rate after 5 days. Importantly, microbial interconversion between OH-PCBs and MeO-PCBs was observed in sewage sludge. Demethylation of MeO-PCBs was favored over methylation of OH-PCBs. The abundant and diverse microbes in sludge play a key role in the transformation processes of the PCB analogues. To our knowledge, this is the first report on MeO-PCBs in environmental matrices and on OH-PCBs in sewage sludge. The findings are important to understand the environmental fate of PCBs.

Polychlorinated Biphenyls (PCBs)

EPA Pesticide Factsheets

To provide regulatory information to the regulated community (those using, storing, or disposing of PCBs), and to provide risk/background information to those researching PCBs and/or concerned about potential exposure to PCBs.

Board-to-board optical interconnection using novel optical plug and slot

NASA Astrophysics Data System (ADS)

Cho, In K.; Yoon, Keun Byoung; Ahn, Seong H.; Kim, Jin Tae; Lee, Woo Jin; Shin, Kyoung Up; Heo, Young Un; Park, Hyo Hoon

2004-10-01

A novel optical PCB with transmitter/receiver system boards and optical bakcplane was prepared, which is board-to-board interconnection by optical plug and slot. We report an 8Gb/s PRBS NRZ data transmission between transmitter system board and optical backplane embedded multimode polymeric waveguide arrays. The basic concept of ETRI's optical PCB is as follows; 1) Metal optical bench is integrated with optoelectronic devices, driver and receiver circuits, polymeric waveguide and access line PCB module. 2) Multimode polymeric waveguide inside an optical backplane, which is embedded into PCB. 3) Optical slot and plug for high-density(channel pitch : 500um) board-to-board interconnection. The polymeric waveguide technology can be used for transmission of data on transmitter/ receiver system boards and for backplane interconnections. The main components are low-loss tapered polymeric waveguides and a novel optical plug and slot for board-to-board interconnections, respectively. The optical PCB is characteristic of low coupling loss, easy insertion/extraction of the boards and, especially, reliable optical coupling unaffected from external environment after board insertion.

Inexpensive Implementation of Many Strain Gauges

NASA Technical Reports Server (NTRS)

Berkun, Andrew C.

2010-01-01

It has been proposed to develop arrays of strain gauges as arrays of ordinary metal film resistors and associated electronic readout circuitry on printed circuit boards or other suitable substrates. This proposal is a by-product of a development of instrumentation utilizing metal film resistors on printed-circuit boards to measure temperatures at multiple locations. In the course of that development, it was observed that in addition to being sensitive to temperature, the metal film resistors were also sensitive to strains in the printed-circuit boards to which they were attached. Because of the low cost of ordinary metal film resistors (typically <$0.01 apiece at 2007 prices), the proposal could enable inexpensive implementation of arrays of many (e.g., 100 or more) strain gauges, possibly concentrated in small areas. For example, such an array could be designed for use as a computer keyboard with no moving parts, as a device for sensing the shape of an object resting on a surface, or as a device for measuring strains at many points on a mirror, a fuel tank, an airplane wing, or other large object. Ordinarily, the effect of strain on resistance would be regarded as a nuisance in a temperature-measuring application, and the effect of temperature on resistance would be regarded as a nuisance in a strain-measuring application. The strain-induced changes in resistance of the metal film resistors in question are less than those of films in traditional strain gauges. The main novel aspect of present proposal lies in the use of circuitry affording sufficient sensitivity to measure strain plus means for compensating for the effect of temperature. For an array of metal film resistors used as proposed, the readout circuits would include a high-accuracy analog-to-digital converter fed by a low noise current source, amplifier chain, and an analog multiplexer chain. Corrections would be provided by use of high-accuracy calibration resistors and a temperature sensor. By use of such readout circuitry, it would be possible to read the resistances of as many as 100 fixed resistors in a time interval of 1 second at a resolution much greater than 16 bits. The readout data would be processed, along with temperature calibration data, to deduce the strain on the printed-circuit board or other substrate in the areas around the resistors. It should also be possible to also deduce the temperature from the readings.

PCBs-high-fat diet interactions as mediators of gut microbiota dysbiosis and abdominal fat accumulation in female mice.

PubMed

Chi, Yulang; Lin, Yi; Zhu, Huimin; Huang, Qiansheng; Ye, Guozhu; Dong, Sijun

2018-04-16

Polychlorinated biphenyls (PCBs), one type of lipophilic pollutant, are ubiquitous in daily life. PCBs exposure has been implicated in the alterations of gut microbial community which is profoundly associated with diverse metabolic disorders, including obesity. High-fat diet (H) is a dietary pattern characterized by a high percentage of fat. According to the theory that similarities can be easily solvable in each other, PCBs and H exposures are inevitably and objectively coexistent in a real living environment, prompting great concerns about their individual and combined effects on hosts. However, the effects of PCBs-H interactions on gut microbiota and obesity are still incompletely understood. In the present study, the effects of PCBs and/or H on the gut microbiota alteration and obesity risk in mice were examined and the interactions between PCBs and H were investigated. Obtained results showed that PCBs and/or H exposure induced prominent variations in the gut microbiota composition and diversity. Exposure to PCBs also resulted in higher body fat percentage, greater size of abdominal subcutaneous adipocytes and increased expression of proinflammatory cytokines including TNF-α, iNOS and IL-6. Such PCBs-induced changes could be further enhanced upon the co-exposure of H, implying that obese individuals may be vulnerable to PCBs exposure. Taken together, the present study is helpful for a better understanding of the gut microbiota variation influenced by PCBs and/or H exposure, and furthermore, provides a novel insight into the mechanism of PCBs-H interactions on host adiposity. Copyright © 2018 Elsevier Ltd. All rights reserved.

Heavy metals concentrations of surface dust from e-waste recycling and its human health implications in southeast China.

PubMed

Leung, Anna O W; Duzgoren-Aydin, Nurdan S; Cheung, K C; Wong, Ming H

2008-04-01

The recycling of printed circuit boards in Guiyu, China, a village intensely involved in e-waste processing, may present a significant environmental and human health risk. To evaluate the extent of heavy metals (Cd, Co, Cr, Cu, Ni, Pb, Zn) contamination from printed circuit board recycling, surface dust samples were collected from recycling workshops, adjacent roads, a schoolyard, and an outdoor food market. ICP-OES analyses revealed elevated mean concentrations in workshop dust (Pb 110,000, Cu 8360, Zn 4420, and Ni 1500 mg/kg) and in dust of adjacent roads (Pb 22,600, Cu 6170, Zn 2370, and Ni 304 mg/kg). Lead and Cu in road dust were 330 and 106, and 371 and 155 times higher, respectively, than non e-waste sites located 8 and 30 km away. Levels at the schoolyard and food market showed that public places were adversely impacted. Risk assessment predicted that Pb and Cu originating from circuit board recycling have the potential to pose serious health risks to workers and local residents of Guiyu, especially children, and warrants an urgent investigation into heavy metal related health impacts. The potential environmental and human health consequences due to uncontrolled e-waste recycling in Guiyu serves as a case study for other countries involved in similar crude recycling activities.

Mineralogical analysis of dust collected from typical recycling line of waste printed circuit boards.

PubMed

Wang, Fangfang; Zhao, Yuemin; Zhang, Tao; Duan, Chenlong; Wang, Lizhang

2015-09-01

As dust is one of the byproducts originating in the mechanical recycling process of waste printed circuit boards such as crushing and separating, from the viewpoints of resource reuse and environmental protection, an effective recycling method to recover valuable materials from this kind of dust is in urgent need. In this paper, detailed mineralogical analysis on the dust collected from a typical recycling line of waste printed circuit boards is investigated by coupling several analytical techniques. The results demonstrate that there are 73.1wt.% organic matters, 4.65wt.% Al, 4.55wt.% Fe, 2.67wt.% Cu and 1.06wt.% Pb in the dust, which reveals the dust is worthy of reuse and harmful to environment. The concentration ratios of Fe, Mn and Zn can reach 12.35, 12.33 and 6.67 respectively by magnetic separation. The yield of dust in each size fraction is nonuniform, while the yield of -0.75mm size fraction is up to 51.15wt.%; as the particle size decreases, the content of liberated metals and magnetic materials increase, and metals are mainly in elemental forms. The F, Cl and Br elements combing to C in the dust would make thermal treatment dangerous to the environment. Based on these results, a flowsheet to recycle the dust is proposed. Copyright © 2015 Elsevier Ltd. All rights reserved.

Alumina Based 500 C Electronic Packaging Systems and Future Development

NASA Technical Reports Server (NTRS)

Chen, Liang-Yu

2012-01-01

NASA space and aeronautical missions for probing the inner solar planets as well as for in situ monitoring and control of next-generation aeronautical engines require high-temperature environment operable sensors and electronics. A 96% aluminum oxide and Au thick-film metallization based packaging system including chip-level packages, printed circuit board, and edge-connector is in development for high temperature SiC electronics. An electronic packaging system based on this material system was successfully tested and demonstrated with SiC electronics at 500 C for over 10,000 hours in laboratory conditions previously. In addition to the tests in laboratory environments, this packaging system has more recently been tested with a SiC junction field effect transistor (JFET) on low earth orbit through the NASA Materials on the International Space Station Experiment 7 (MISSE7). A SiC JFET with a packaging system composed of a 96% alumina chip-level package and an alumina printed circuit board mounted on a data acquisition circuit board was launched as a part of the MISSE7 suite to International Space Station via a Shuttle mission and tested on the orbit for eighteen months. A summary of results of tests in both laboratory and space environments will be presented. The future development of alumina based high temperature packaging using co-fired material systems for improved performance at high temperature and more feasible mass production will also be discussed.

Microstrip Butler matrix design and realization for 7 T MRI.

PubMed

Yazdanbakhsh, Pedram; Solbach, Klaus

2011-07-01

This article presents the design and realization of 8 × 8 and 16 × 16 Butler matrices for 7 T MRI systems. With the focus on low insertion loss and high amplitude/phase accuracy, the microstrip line integration technology (microwave-integrated circuit) was chosen for the realization. Laminate material of high permittivity (ε(r) = 11) and large thickness (h = 3.2 mm) is shown to allow the best trade-off of circuit board size versus insertion loss, saving circuit area by extensive folding of branch-line coupler topology and meandering phase shifter and connecting strip lines and reducing mutual coupling of neighboring strip lines by shield structures between strip lines. With this approach, 8 × 8 Butler matrices were produced in single boards of 310 mm × 530 mm, whereas the 16 × 16 Butler matrices combined two submatrices of 8 × 8 with two smaller boards. Insertion loss was found at 0.73 and 1.1 dB for an 8 × 8 matrix and 16 × 16 matrix, respectively. Measured amplitude and phase errors are shown to represent highly pure mode excitation with unwanted modes suppressed by 40 and 35 dB, respectively. Both types of matrices were implemented with a 7 T MRI system and 8- and 16-element coil arrays for RF mode shimming experiments and operated successfully with 8 kW of RF power. Copyright © 2011 Wiley-Liss, Inc.

Pattern classification using charge transfer devices

NASA Technical Reports Server (NTRS)

1980-01-01

The feasibility of using charge transfer devices in the classification of multispectral imagery was investigated by evaluating particular devices to determine their suitability in matrix multiplication subsystem of a pattern classifier and by designing a protype of such a system. Particular attention was given to analog-analog correlator devices which consist of two tapped delay lines, chip multipliers, and a summed output. The design for the classifier and a printed circuit layout for the analog boards were completed and the boards were fabricated. A test j:g for the board was built and checkout was begun.

Universal test system for system embedded optical interconnect

NASA Astrophysics Data System (ADS)

Pitwon, R.; Wang, K.; Immonen, M.; Schröder, H.; Neitz, M.

2018-02-01

We introduce a universal test and measurement system allowing comparative characterisation of optical transceivers, board-to-board optical connectors and both embedded and passive optical circuit boards. The system comprises a test enclosure with interlocking and interchangeable test cards, allowing different technologies spanning different Technology Readiness Levels to be both characterised alone and in combination with other technologies. They form part of the open test design standards portfolio developed on the FP7 PhoxTroT and H2020 COSMICC projects and allow testing on a common test platform.

Microbial polychlorinated biphenyl dechlorination in sediments by electrical stimulation: The effect of adding acetate and nonionic surfactant.

PubMed

Yu, Hui; Wan, Hui; Feng, Chunhua; Yi, Xiaoyun; Liu, Xiaoping; Ren, Yuan; Wei, Chaohai

2017-02-15

The necessity for developing an efficient and cost-effective in situ bioremediation technology for sediments contaminated with polychlorinated biphenyls (PCBs) has prompted the application of low-voltage electrical fields to anaerobic digestion systems. Here we show that the use of a sediment-based bio-electrochemical reactor (BER) poised at a potential of -0.50V (vs. a standard calomel electrode, SCE) substantially enhanced the reduction of 2,3,4,5-tetrachlorobiphenyl (PCB 61) when acetate was added as a carbon source. The addition of surfactant Tween 80 to the BER further accelerated the PCB 61 transformation. The comparative study of closed- and open-circuit reactors demonstrated the enrichment conditions affecting the bacterial community structure, the dominant dechlorination metabolisms, and thus the extent, the rate and the products of the reduction of PCBs. The dominant bacterial dechlorinators detected in the BERs in the presence of acetate and Tween 80 are Dehalogenimonas, Dehalobacter, Sulfuricurvum, Dechloromonas and Geobacter, which should be responsible for PCB dechlorination. This study improves understanding of the key factors influencing dechlorination activity in sediment-based BERs polarized at a low potential, as well as the metabolic mechanisms dominating in the PCB dechlorination process. Copyright © 2016 Elsevier B.V. All rights reserved.

Phase-lock-loop application for fiber optic receiver

NASA Astrophysics Data System (ADS)

Ruggles, Stephen L.; Wills, Robert W.

1991-02-01

Phase-locked loop circuits are frequently employed in communication systems. In recent years, digital phase-locked loop circuits were utilized in optical communications systems. In an optical transceiver system, the digital phase-locked loop circuit is connected to the output of the receiver to extract a clock signal from the received coded data (NRZ, Bi-Phase, or Manchester). The clock signal is then used to reconstruct or recover the original data from the coded data. A theoretical approach to the design of a digital phase-locked loop circuit operation at 1 and 50 MHz is described. Hardware implementation of a breadboard design to function at 1 MHz and a printed-circuit board designed to function at 50 MHz were assembled using emitter coupled logic (ECL) to verify experimentally the theoretical design.

Phase-lock-loop application for fiber optic receiver

NASA Technical Reports Server (NTRS)

Ruggles, Stephen L.; Wills, Robert W.

1991-01-01

Phase-locked loop circuits are frequently employed in communication systems. In recent years, digital phase-locked loop circuits were utilized in optical communications systems. In an optical transceiver system, the digital phase-locked loop circuit is connected to the output of the receiver to extract a clock signal from the received coded data (NRZ, Bi-Phase, or Manchester). The clock signal is then used to reconstruct or recover the original data from the coded data. A theoretical approach to the design of a digital phase-locked loop circuit operation at 1 and 50 MHz is described. Hardware implementation of a breadboard design to function at 1 MHz and a printed-circuit board designed to function at 50 MHz were assembled using emitter coupled logic (ECL) to verify experimentally the theoretical design.

The Case of Dixon v. Alabama State Board of Education: From Civil Rights to Students' Rights and Back Again

ERIC Educational Resources Information Center

Lee, Philip

2014-01-01

Background/Context: Legal scholars have cited the Fifth Circuit's ruling in Dixon v. Alabama State Board of Education (1961) as the beginning of a revolution for students' rights that ended the in loco parentis relationship between colleges and their students. But little has been written about the students' activism that led to this seminal case.…

Hydroxylated Polychlorinated Biphenyls in the Environment: Sources, Fate, and Toxicities

PubMed Central

Tehrani, Rouzbeh; Van Aken, Benoit

2013-01-01

Hydroxylated polychlorinated biphenyls (OH-PCBs) are produced in the environment by the oxidation of PCBs through a variety of mechanisms, including metabolic transformation in living organisms and abiotic reactions with hydroxyl radicals. As a consequence, OH-PCBs have been detected in a wide range of environmental samples, including animal tissues, water, and sediments. OH-PCBs have recently raised serious environmental concerns because they exert a variety of toxic effects at lower doses than the parent PCBs and they are disruptors of the endocrine system. Although evidence has accumulated about the widespread dispersion of OH-PCBs in various compartments of the ecosystem, little is currently known about their biodegradation and behavior in the environment. OH-PCBs are today increasingly considered as a new class of environmental contaminants that possess specific chemical, physical, and biological properties not shared with the parent PCBs. This article reviews recent findings regarding the sources, fate, and toxicities of OH-PCBs in the environment. PMID:23636595

[Polychlorinated biphenyls in fractions of wheat grains and in selected bakery products].

PubMed

Brandt, Elzbieta; Pietrzak-Fiećko, Renata; Smoczyński, S S

2012-01-01

Polychlorinated biphenyls (PCBs) form a group of synthetic aromatic chemical compounds, commonly occurring in the environment as a result of industrialisation. Despite the ban on PCBs production, their wide application in the past resulted in their common occurrence in all elements of the environment. The lipophilic nature of the compounds resulting in their accumulation in live organisms and in the human body may trigger many harmful effects. The aim of this study was to determine the PCBs content in the selected species of wheat and in bakery products. The studies aiming at confirming possible correlation between the size of the grain of the selected species of wheat and the content of polychlorinated biphenyls were presented in this paper. Moreover, PCBs concentration in cereals' grains and in bread was compared. The PCBs content was defined in different sizes of grains species of wheat i.e. Opatka, Zyta, Elena and Almari. The study included also two kinds of wheat bread. PCBs were determined after the extraction with n-hexane followed by sulphuric acid hydrolysis. Gas chromatography analysis was conducted on a PU 4600 Unicam apparatus with an electron capture detector. The large variations in PCBs content depending on the grain size were confirmed. In the Opatka species the increase in the content of all determined congeners and the size of grain was confirmed. The lowest PCBs concentrations were in smallest grains (0,0090 mg/kg of fat), and the highest in the largest grains (0,0264 mg/kg of fat). In Zyta species PCBs content was also lowest in the smallest grains, however these results were not statistically significant. In the Elena species the increase in the PCBs content together with the increase in the grain size was confirmed. Basing on the determination coefficient it was found that the concentration of PCBs depends on the size of grains in 24%. The highest concentration of PCBs (0,0366 mg/kg of fat) was found in the largest grains, however differences between the examined fractions were not statistically significant. Similar tendencies were observed in Almari species. PCBs content in wheat bread was on lower level than in all of the examined species. It was confirmed that fraction 2,8 x 25 mm of all species of wheat grain had the highest PCBs content. The tendency to decrease of PCBs content with the decrease of the grain in size was observed. The relation between qualitative class of species and PCBs content was not confirmed. There were statistically significant differences in the PCBs concentrations between the wheat species within one size fraction. The results of PCBs content in wheat bread were lower than in all examined species of wheat. One can assume that for the production of bread collected for the study, the wheat originating from areas with low PCBs contamination was used. Somewhat higher PCBs content was observed in the wheat bread with bran added, probably due to higher PCBs accumulation in the bran, which contain higher fat and contribute therefore to the overall PCBs in the bran containing bread.

Historical sediment record and levels of PCBs in sediments and mangroves of Jobos Bay, Puerto Rico.

PubMed

Alegria, Henry; Martinez-Colon, Michael; Birgul, Askin; Brooks, Gregg; Hanson, Lindsey; Kurt-Karakus, Perihan

2016-12-15

Polychlorinated biphenyls (PCBs) were quantified in 18 surface sediment samples, 1 sediment core, and several mangrove tissue samples collected in Jobos Bay, Puerto Rico in September 2013. Total PCBs in surface sediments ranged from 0.42 to 1232ngg -1 dw. Generally, higher levels were observed near-shore close to urban and industrial areas. The levels suggest significant pollution in Jobos Bay with respect to PCBs. Two-thirds of the sites were dominated by lighter PCB congeners (tri- to penta-chlorinated PCBs) while one-third had heavy PCB congeners (hexa- to octa-chlorinated PCBs) dominant. Total PCBs in a sediment core indicated levels fluctuating according to historical usage patterns. Total PCBs were measured in mangal leaves (14-747ngg -1 dw), roots (0.26-120ngg -1 dw), and seeds (16-93ngg -1 dw), suggesting bioaccumulation from sediments. This is the first report of a historical profile of PCBs in the study area and of PCB bioaccumulation in mangroves. This article provides new and useful information on PCBs in the Caribbean area of the GRULAC region. Copyright © 2016 Elsevier B.V. All rights reserved.

Tracing the biotransformation of polychlorinated biphenyls (PCBs) in common carp (Cryprinus carpio): Enantiomeric fraction and compound-specific stable carbon isotope analyses.

PubMed

Tang, Bin; Luo, Xiao-Jun; Zeng, Yan-Hong; Sun, Run-Xia; Chen, Hua-Shan; Li, Zong-Rui; Mai, Bi-Xian

2016-09-01

Metabolites of polychlorinated biphenyls (PCBs) in fish are difficult to detect in vivo due to the complexity of biometabolism. In the present study, atropisomeric fraction analysis of chiral PCB congeners and compound-specific isotopic analysis (CSIA) were applied to trace the biotransformation of PCBs in fish by exposure of common carp (Cryprinus carpio) to the commercial PCB mixture Aroclor 1242. Stereoselective elimination of the chiral PCB congeners 91, 95, and 136 was observed, indicating a stereoselective biotransformation process. The δ(13)C values of PCBs 5/8, 18, and 20/33 in fish were increased compared with those in the spiked food, while PCBs 47/48 and 49 showed significant heavy isotope depletion. These results suggested a significant biotransformation of the corresponding individual PCB congeners although the potential PCB metabolites, hydroxylated PCBs (OH-PCBs) and methylsulfone PCBs (MeSO2-PCBs), were not detected in the fish tissue samples throughout this experiment. The results of the present study demonstrated that a combination of chiral analysis and CSIA is a promising new approach for investigating the biotransformation of PCBs in biota. Copyright © 2016 Elsevier Ltd. All rights reserved.

Design of the Wind Tunnel Model Communication Controller Board. Degree awarded by Christopher Newport Univ. on Dec. 1998

NASA Technical Reports Server (NTRS)

Wilson, William C.

1999-01-01

The NASA Langley Research Center's Wind Tunnel Reinvestment project plans to shrink the existing data acquisition electronics to fit inside a wind tunnel model. Space limitations within a model necessitate a distributed system of Application Specific Integrated Circuits (ASICs) rather than a centralized system based on PC boards. This thesis will focus on the design of the prototype of the communication Controller board. A portion of the communication Controller board is to be used as the basis of an ASIC design. The communication Controller board will communicate between the internal model modules and the external data acquisition computer. This board is based around an Field Programmable Gate Array (FPGA), to allow for reconfigurability. In addition to the FPGA, this board contains buffer Random Access Memory (RAM), configuration memory (EEPROM), drivers for the communications ports, and passive components.

Method Of Packaging And Assembling Electro-Microfluidic Devices

DOEpatents

Benavides, Gilbert L.; Galambos, Paul C.; Emerson, John A.; Peterson, Kenneth A.; Giunta, Rachel K.; Zamora, David Lee; Watson, Robert D.

2004-11-23

A new architecture for packaging surface micromachined electro-microfluidic devices is presented. This architecture relies on two scales of packaging to bring fluid to the device scale (picoliters) from the macro-scale (microliters). The architecture emulates and utilizes electronics packaging technology. The larger package consists of a circuit board with embedded fluidic channels and standard fluidic connectors (e.g. Fluidic Printed Wiring Board). The embedded channels connect to the smaller package, an Electro-Microfluidic Dual-Inline-Package (EMDIP) that takes fluid to the microfluidic integrated circuit (MIC). The fluidic connection is made to the back of the MIC through Bosch-etched holes that take fluid to surface micromachined channels on the front of the MIC. Electrical connection is made to bond pads on the front of the MIC.

Development of a flexible circuit board for low-background experiments

NASA Astrophysics Data System (ADS)

Poon, Alan; Barton, Paul; Dhar, Ankur; Larsen, Joern; Loach, James

2017-01-01

Future underground rare-event search experiments, such as neutrinoless double-beta decay searches, have stringent requirements for the radiopurity of materials placed near the active detector medium. Parylene is a polymer that has a high chemical purity and the vapor deposition process by which it is laid down tends to purify it further. In this talk the technique to fabricate a low-mass, flexible circuit board, with conductive traces photoligthographically patterned on a parylene substrate, is discussed. The performance of a proof-of-principle temperature sensor is presented. This work was supported by the U.S. Department of Energy, Office of Science, Office of Nuclear Physics, under Contract No. DE-AC02-05CH11231 and by the Shanghai Key Lab for Particle Physics and Cosmology (SKLPPC), Grant No. 15DZ2272100.

Advanced Atmospheric Water Vapor DIAL Detection System

NASA Technical Reports Server (NTRS)

Refaat, Tamer F.; Elsayed-Ali, Hani E.; DeYoung, Russell J. (Technical Monitor)

2000-01-01

Measurement of atmospheric water vapor is very important for understanding the Earth's climate and water cycle. The remote sensing Differential Absorption Lidar (DIAL) technique is a powerful method to perform such measurement from aircraft and space. This thesis describes a new advanced detection system, which incorporates major improvements regarding sensitivity and size. These improvements include a low noise advanced avalanche photodiode detector, a custom analog circuit, a 14-bit digitizer, a microcontroller for on board averaging and finally a fast computer interface. This thesis describes the design and validation of this new water vapor DIAL detection system which was integrated onto a small Printed Circuit Board (PCB) with minimal weight and power consumption. Comparing its measurements to an existing DIAL system for aerosol and water vapor profiling validated the detection system.

Multipurpose microcontroller design for PUGAS 2

NASA Technical Reports Server (NTRS)

Weber, David M.; Deckard, Todd W.

1987-01-01

This paper will report on the past year's work on the development of the microcontroller design for the second Purdue University small self-contained payload. A first report on this effort was given at last year's conference by Ritter (1985). At that time, the project was still at the conceptual stage. Now a specific design has been set, prototyping has begun, and layout of the two-sided circuit board using CAD-techniques is nearing completion. A redesign of the overall concept of the circuit board was done to take advantage of the facilities available to students. An additional controller has been added to take large quantities of data concerning the shuttle environment during takeoff. The importance of setting a design time-line is discussed along with the electrical design considerations given to the controllers.

Design of a smart ECG garment based on conductive textile electrode and flexible printed circuit board.

PubMed

Cai, Zhipeng; Luo, Kan; Liu, Chengyu; Li, Jianqing

2017-08-09

A smart electrocardiogram (ECG) garment system was designed for continuous, non-invasive and comfortable ECG monitoring, which mainly consists of four components: Conductive textile electrode, garment, flexible printed circuit board (FPCB)-based ECG processing module and android application program. Conductive textile electrode and FPCB-based ECG processing module (6.8 g, 55 mm × 53 mm × 5 mm) are identified as two key techniques to improve the system's comfort and flexibility. Preliminary experimental results verified that the textile electrodes with circle shape, 40 mm size in diameter, and 5 mm thickness sponge are best suited for the long-term ECG monitoring application. The tests on the whole system confirmed that the designed smart garment can obtain long-term ECG recordings with high signal quality.

Surface Flashover on Epoxy-Resin Printed Circuit Boards in Vacuum under Electron Irradiation

NASA Astrophysics Data System (ADS)

Fujii, Haruhisa; Hasegawa, Taketoshi; Osuga, Hiroyuki; Matsui, Katsuaki

This paper deals with the surface flashover characteristics of dielectric material in vacuum during electron beam irradiation in order to design adequately the conductive patterns on printed circuit boards used inside a spacecraft. The dielectric material, glass-fiber reinforced epoxy resin, and the electrodes printed on it were irradiated with electrons of the energy of 3-10 keV. DC high voltage was applied between the two electrodes during electron irradiation. The voltage was increased stepwise until the surface flashover occurred on the dielectric material. We obtained the results that the surface flashover voltage increased with the insulation distance between the electrodes but electron irradiation made the flashover voltage lower. The flashover voltage characteristics were obtained as parameters of the electrode distance and the energy of the electron beam.

Design and implementation of a general and automatic test platform base on NI PXI system

NASA Astrophysics Data System (ADS)

Shi, Long

2018-05-01

Aiming at some difficulties of test equipment such as the short product life, poor generality and high development cost, a general and automatic test platform base on NI PXI system is designed in this paper, which is able to meet most test requirements of circuit boards. The test platform is devided into 5 layers, every layer is introduced in detail except for the "Equipment Under Test" layer. An output board of a track-side equipment, which is an important part of high speed train control system, is taken as an example to make the functional circuit test by the test platform. The results show that the test platform is easy to realize add-on functions development, automatic test, wide compatibility and strong generality.

Active alignment/contact verification system

DOEpatents

Greenbaum, William M.

2000-01-01

A system involving an active (i.e. electrical) technique for the verification of: 1) close tolerance mechanical alignment between two component, and 2) electrical contact between mating through an elastomeric interface. For example, the two components may be an alumina carrier and a printed circuit board, two mating parts that are extremely small, high density parts and require alignment within a fraction of a mil, as well as a specified interface point of engagement between the parts. The system comprises pairs of conductive structures defined in the surfaces layers of the alumina carrier and the printed circuit board, for example. The first pair of conductive structures relate to item (1) above and permit alignment verification between mating parts. The second pair of conductive structures relate to item (2) above and permit verification of electrical contact between mating parts.

Polychlorinated biphenyls and their hydroxylated metabolites (OH-PCBs) in the blood of toothed and baleen whales stranded along Japanese coastal waters.

PubMed

Nomiyama, Kei; Murata, Satoko; Kunisue, Tatsuya; Yamada, Tadasu K; Mizukawa, Hazuki; Takahashi, Shin; Tanabe, Shinsuke

2010-05-15

In this study, we determined the residue levels and patterns of polychlorinated biphenyls (PCBs) and hydroxylated PCBs (OH-PCBs) in the blood from eight species of toothed whales and three species of baleen whales stranded along the Japanese coast during 1999-2007. Penta- through hepta-chlorinated PCB congeners were the dominant homologue groups in all cetaceans. In contrast, specific differences in the distribution of dominant OH-PCB isomers and homologues were found among the cetacean species. In five species of toothed whales (melon-headed whale, Stejneger's beaked whale, Pacific white-sided dolphin, Blainville's beaked whale, and killer whale), the predominant homologues were OH-penta-PCBs followed by OH-tetra-PCBs and OH-tri-PCBs. The predominant homologues of finless porpoise and beluga whale were OH-penta-PCBs followed by OH-hexa-PCBs and OH-tri-PCBs. The predominant OH-PCB isomers were para-OH-PCBs such as 4OH-CB26, 4'OH-CB25/4'OH-CB26/4OH-CB31, 4OH-CB70, 4'OH-CB72, 4'OH-CB97, 4'OH-CB101/4'OH-CB120, and 4OH-CB107/4'OH-CB108 in toothed whales. In three baleen whales (common minke whale, Bryde's whale, and humpback whale) and in sperm whale (which is a toothed whale), OH-octa-PCB (4OH-CB202) was the predominant homologue group accounting for 40-80% of the total OH-PCB concentrations. The differences in concentrations and profiles of OH-PCBs may suggest species-specific diets, metabolic capability, and the transthyretin (TTR) binding specificity. These results reveal that the accumulation profiles of OH-PCBs in cetacean blood are entirely different from the profiles found in pinnipeds, polar bear, and humans.

Toxicity of electronic waste leachates to Daphnia magna: screening and toxicity identification evaluation of different products, components, and materials.

PubMed

Lithner, Delilah; Halling, Maja; Dave, Göran

2012-05-01

Electronic waste has become one of the fastest growing waste problems in the world. It contains both toxic metals and toxic organics. The aim of this study was to (1) investigate to what extent toxicants can leach from different electronic products, components, and materials into water and (2) identify which group of toxicants (metals or hydrophobic organics) that is causing toxicity. Components from five discarded electronic products (cell phone, computer, phone modem, keyboard, and computer mouse) were leached in deionised water for 3 days at 23°C in concentrations of 25 g/l for metal components, 50 g/l for mixed-material components, and 100 g/l for plastic components. The water phase was tested for acute toxicity to Daphnia magna. Eighteen of 68 leachates showed toxicity (with immobility of D. magna ≥ 50% after 48 h) and came from metal or mixed-material components. The 8 most toxic leachates, with 48 h EC(50)s ranging from 0.4 to 20 g/l, came from 2 circuit sheets (key board), integrated drive electronics (IDE) cable clips (computer), metal studs (computer), a circuit board (computer mouse), a cord (phone modem), mixed parts (cell phone), and a circuit board (key board). All 5 electronic products were represented among them. Toxicity identification evaluations (with C18 and CM resins filtrations and ethylenediaminetetraacetic acid addition) indicated that metals caused the toxicity in the majority of the most toxic leachates. Overall, this study has shown that electronic waste can leach toxic compounds also during short-term leaching with pure water.

Spacelab, Spacehab, and Space Station Freedom payload interface projects

NASA Technical Reports Server (NTRS)

Smith, Dean Lance

1992-01-01

Contributions were made to several projects. Howard Nguyen was assisted in developing the Space Station RPS (Rack Power Supply). The RPS is a computer controlled power supply that helps test equipment used for experiments before the equipment is installed on Space Station Freedom. Ron Bennett of General Electric Government Services was assisted in the design and analysis of the Standard Interface Rack Controller hardware and software. An analysis was made of the GPIB (General Purpose Interface Bus), looking for any potential problems while transmitting data across the bus, such as the interaction of the bus controller with a data talker and its listeners. An analysis was made of GPIB bus communications in general, including any negative impact the bus may have on transmitting data back to Earth. A study was made of transmitting digital data back to Earth over a video channel. A report was written about the study and a revised version of the report will be submitted for publication. Work was started on the design of a PC/AT compatible circuit board that will combine digital data with a video signal. Another PC/AT compatible circuit board is being designed to recover the digital data from the video signal. A proposal was submitted to support the continued development of the interface boards after the author returns to Memphis State University in the fall. A study was also made of storing circuit board design software and data on the hard disk server of a LAN (Local Area Network) that connects several IBM style PCs. A report was written that makes several recommendations. A preliminary design review was started of the AIVS (Automatic Interface Verification System). The summer was over before any significant contribution could be made to this project.

3D Printed Fluidic Hardware for DNA Assembly

DTIC Science & Technology

2015-04-10

A3909 stepper motor driver, were soldered onto the milled circuit board (Supplementary Figure 8). Custom Arduino - based firmware was written to take...initiatives such as the FabLab Foundation10. Access to digital fabrication tools and open electronics, such as Arduino and Raspberry Pi, enables access to...hardware for assembly of DNA- based genetic circuits. Solid-phase DNA synthesis has declined in price, enabling researchers to routinely design and

Vision Technology for Automated Inspection of Hybrid Microelectronics Assemblies

DTIC Science & Technology

1988-06-01

circuits are a very efficient packaging technique, with the primary advantages of size, better resistance to environ - 0 ments, and the flexibility to...produced for the military are much more complex and have more stringent performance requirements, particularly in their resistance to environments and...boards, particularly because of the need to protect circuits from a hostile environment such as salt, heat, and moisture. Included among the major U.S

Expedition 18 Station Development Test Objectives (STDO) Session 1

NASA Image and Video Library

2009-02-19

ISS018-E-033816 (19 Feb. 2009) --- Astronaut Michael Fincke, Expedition 18 commander, removes, cleans and replaces electronic test components on a single test card using Component Repair Equipment (CRE-1) hardware in a portable glovebox facility in the Harmony node of the International Space Station. Fincke unsoldered 1 1/2 components from an integrated circuit board and re-soldered new components including an integrated circuit chip.

Expedition 18 Station Development Test Objectives (STDO) Session 1

NASA Image and Video Library

2009-02-19

ISS018-E-033818 (19 Feb. 2009) --- Astronaut Michael Fincke, Expedition 18 commander, removes, cleans and replaces electronic test components on a single test card using Component Repair Equipment (CRE-1) hardware in a portable glovebox facility in the Harmony node of the International Space Station. Fincke unsoldered 1 1/2 components from an integrated circuit board and re-soldered new components including an integrated circuit chip.

What determines PCB concentrations in soils in rural and urban areas? Insights from a multi-media fate model for Switzerland as a case study.

PubMed

Glüge, Juliane; Bogdal, Christian; Scheringer, Martin; Hungerbühler, Konrad

2016-04-15

Polychlorinated biphenyls (PCBs) are banned worldwide under the Stockholm Convention on Persistent Organic Pollutants. However, PCBs are still emitted in appreciable amounts from remaining primary sources in urban areas or landfills and are ubiquitous environmental contaminants, inter alia in soil and air. Concentrations of PCBs have been measured in various media by numerous studies worldwide. However, monitoring data do not always provide quantitative information about transport processes between different media, deposition fluxes to ground, or distribution of PCBs between environmental compartments. Also future trends in environmental contamination by PCBs cannot be predicted from monitoring data, but such information is highly relevant for decision-makers. Here, we present a new regionally resolved dynamic multimedia mass balance model for Switzerland to investigate the origin of PCBs in air and to investigate their long-term fate and mass balance in the environment. The model was validated with existing field data for PCBs. We find that advective inflow of PCBs from outside Switzerland into the atmospheric boundary layer is responsible for 80% of PCBs present in air in Switzerland, whereas Swiss emissions cause the remaining 20%. Furthermore, we show that the atmospheric deposition of the higher-chlorinated PCBs is dominated by particle-bound deposition, whereas the deposition of the lower-chlorinated PCBs is a combination of particle-bound and gaseous deposition. The volume fraction of particles in air is in both cases an important factor driving the deposition of PCBs to ground and, thus, contributing to the higher concentrations of PCBs generally observed in populated and polluted areas. Regional emissions influence the deposition fluxes only to a limited extent. We also find that secondary emissions from environmental reservoirs do not exceed primary emissions for all PCB congeners until at least 2036. Finally, we use our model to evaluate the effect of chemical regulation on future environmental contamination by PCBs. Copyright © 2016 Elsevier B.V. All rights reserved.

PCBs in various Schools

EPA Science Inventory

Characterize primary and secondary sources of PCBs in school buildings Characterize levels of PCBs in air, dust, soil and on surfaces; investigate relationships between sources and environmental levels Apply an exposure model for estimating children’s exposures to PCBs in schools...

SEASONAL INFLUENCES ON PCB RETENTION AND BIOTRANSFORMATION IN FISH

PubMed Central

James, Margaret O.; Kleinow, Kevin M.

2013-01-01

There is extensive evidence that fish from waters with PCB-contaminated sediments accumulate PCBs and related chemicals, and that people who eat fish from contaminated waters have higher body burdens of PCBs and PCB metabolites than those who do not. PCBs and their metabolites are potentially toxic, thus it is important to human health to understand the uptake, biotransformation and elimination of PCBs in fish, since these processes determine the extent of accumulation. The intestinal uptake of PCBs present in the diet of fish into fish tissues is a process that is influenced by the lipid composition of the diet. Biotransformation of PCBs in fish, as in mammals, facilitates elimination, although many PCB congeners are recalcitrant to biotransformation in fish and mammals. Sequential biotransformation of PCBs by cytochrome P450 and conjugation pathways is even less efficient in fish than in mammalian species, thus contributing to the retention of PCBs in fish tissues. A very important factor influencing overall PCB disposition in fish is water temperature. Seasonal changes in water temperature produce adaptive physiological and biochemical changes in fish. While uptake of PCBs from the diet is similar in fish acclimated to winter or summer temperatures, there is evidence that elimination of PCBs occurs much more slowly when the fish is acclimated at low temperatures than at warmer temperatures. Research to date suggests that the processes of elimination of PCBs are modulated by several factors in fish including seasonal changes in water temperature. Thus, the body burden of PCBs in fish from a contaminated location is likely to vary with season. PMID:23494683

Capacitive charge generation apparatus and method for testing circuits

DOEpatents

Cole, E.I. Jr.; Peterson, K.A.; Barton, D.L.

1998-07-14

An electron beam apparatus and method for testing a circuit are disclosed. The electron beam apparatus comprises an electron beam incident on an outer surface of an insulating layer overlying one or more electrical conductors of the circuit for generating a time varying or alternating current electrical potential on the surface; and a measurement unit connected to the circuit for measuring an electrical signal capacitively coupled to the electrical conductors to identify and map a conduction state of each of the electrical conductors, with or without an electrical bias signal being applied to the circuit. The electron beam apparatus can further include a secondary electron detector for forming a secondary electron image for registration with a map of the conduction state of the electrical conductors. The apparatus and method are useful for failure analysis or qualification testing to determine the presence of any open-circuits or short-circuits, and to verify the continuity or integrity of electrical conductors buried below an insulating layer thickness of 1-100 {micro}m or more without damaging or breaking down the insulating layer. The types of electrical circuits that can be tested include integrated circuits, multi-chip modules, printed circuit boards and flexible printed circuits. 7 figs.

Capacitive charge generation apparatus and method for testing circuits

DOEpatents

Cole, Jr., Edward I.; Peterson, Kenneth A.; Barton, Daniel L.

1998-01-01

An electron beam apparatus and method for testing a circuit. The electron beam apparatus comprises an electron beam incident on an outer surface of an insulating layer overlying one or more electrical conductors of the circuit for generating a time varying or alternating current electrical potential on the surface; and a measurement unit connected to the circuit for measuring an electrical signal capacitively coupled to the electrical conductors to identify and map a conduction state of each of the electrical conductors, with or without an electrical bias signal being applied to the circuit. The electron beam apparatus can further include a secondary electron detector for forming a secondary electron image for registration with a map of the conduction state of the electrical conductors. The apparatus and method are useful for failure analysis or qualification testing to determine the presence of any open-circuits or short-circuits, and to verify the continuity or integrity of electrical conductors buried below an insulating layer thickness of 1-100 .mu.m or more without damaging or breaking down the insulating layer. The types of electrical circuits that can be tested include integrated circuits, multi-chip modules, printed circuit boards and flexible printed circuits.

Impedance Discontinuity Reduction Between High-Speed Differential Connectors and PCB Interfaces

NASA Technical Reports Server (NTRS)

Navidi, Sal; Agdinaoay, Rodell; Walter, Keith

2013-01-01

High-speed serial communication (i.e., Gigabit Ethernet) requires differential transmission and controlled impedances. Impedance control is essential throughout cabling, connector, and circuit board construction. An impedance discontinuity arises at the interface of a high-speed quadrax and twinax connectors and the attached printed circuit board (PCB). This discontinuity usually is lower impedance since the relative dielectric constant of the board is higher (i.e., polyimide approx. = 4) than the connector (Teflon approx. = 2.25). The discontinuity can be observed in transmit or receive eye diagrams, and can reduce the effective link margin of serial data networks. High-speed serial data network transmission improvements can be made at the connector-to-board interfaces as well as improving differential via hole impedances. The impedance discontinuity was improved by 10 percent by drilling a 20-mil (approx. = 0.5-mm) hole in between the pin of a differential connector spaced 55 mils (approx. = 1.4 mm) apart as it is attached to the PCB. The effective dielectric constant of the board can be lowered by drilling holes into the board material between the differential lines in a quadrax or twinax connector attachment points. The differential impedance is inversely proportional to the square root of the relative dielectric constant. This increases the differential impedance and thus reduces the above described impedance discontinuity. The differential via hole impedance can also be increased in the same manner. This technique can be extended to multiple smaller drilled holes as well as tapered holes (i.e., big in the middle followed by smaller ones diagonally).

[Pollution characteristics of PCBs in electronic waste dismantling areas of Zhejiang province].

PubMed

Wang, Xiaofeng; Lou, Xiaoming; Han, Guangen; Shen, Haitao; Ding, Gangqiang

2011-09-01

To study the pollution level and distribution pattern of polychlorinated biphenyls (PCBs) in the environment media in electronic waste dismantling area of Zhejiang province. Water, soil and PM10 were sampled in electronic waste dismantling areas. The contents, distribution characteristics and toxic equivalents (TEQs) of PCBs in local environment were evaluated by ultra-trace detection methods. The PCBs contents of water, soil and PM10 in Luqiao and Zhenhai, the relatively high polluted areas, were higher than those in Longyou, the control area. The dominant PCBs detected from the environment in Luqiao were hexa-CBs (PCB138 and PCB153), while penta-CBs were dominant in Zhenhai and Longyou. TEQs in electronic waste recycling area were higher than those in control areas. The TEQs of PCBs in water and soil were the highest in Zhenhai, while the TEQs of PM10 were the highest in Luqiao. The local environment has been polluted by PCBs emitted from electronic waste recycling. PCBs pollution monitoring in electronic waste recycling area should be strengthened to prevent PCBs-induced health effects.

Neuroprotective Effect of Melatonin Against PCBs Induced Behavioural, Molecular and Histological Changes in Cerebral Cortex of Adult Male Wistar Rats.

PubMed

Bavithra, S; Selvakumar, K; Sundareswaran, L; Arunakaran, J

2017-02-01

There is ample evidence stating Polychlorinated biphenyls (PCBs) as neurotoxins. In the current study, we have analyzed the behavioural impact of PCBs exposure in adult rats and assessed the simultaneous effect of antioxidant melatonin against the PCBs action. The rats were grouped into four and treated intraperitoneally with vehicle, PCBs, PCBs + melatonin and melatonin alone for 30 days, respectively. After the treatment period the rats were tested for locomotor activity and anxiety behaviour analysis. We confirmed the neuronal damage in the cerebral cortex by molecular and histological analysis. Our data indicates that there is impairment in locomotor activity and behaviour of PCBs treated rats compared to control. The simultaneous melatonin treated rat shows increased motor coordination and less anxiety like behaviour compared to PCBs treated rats. Molecular and histological analysis supports that, the impaired motor coordination in PCBs treated rats is due to neurodegeneration in motor cortex region. The results proved that melatonin treatment improved the motor co-ordination and reduced anxiety behaviour, prevented neurodegeneration in the cerebral cortex of PCBs-exposed adult male rats.

Agent-based services for B2B electronic commerce

NASA Astrophysics Data System (ADS)

Fong, Elizabeth; Ivezic, Nenad; Rhodes, Tom; Peng, Yun

2000-12-01

The potential of agent-based systems has not been realized yet, in part, because of the lack of understanding of how the agent technology supports industrial needs and emerging standards. The area of business-to-business electronic commerce (b2b e-commerce) is one of the most rapidly developing sectors of industry with huge impact on manufacturing practices. In this paper, we investigate the current state of agent technology and the feasibility of applying agent-based computing to b2b e-commerce in the circuit board manufacturing sector. We identify critical tasks and opportunities in the b2b e-commerce area where agent-based services can best be deployed. We describe an implemented agent-based prototype system to facilitate the bidding process for printed circuit board manufacturing and assembly. These activities are taking place within the Internet Commerce for Manufacturing (ICM) project, the NIST- sponsored project working with industry to create an environment where small manufacturers of mechanical and electronic components may participate competitively in virtual enterprises that manufacture printed circuit assemblies.

Modular integration of electronics and microfluidic systems using flexible printed circuit boards.

PubMed

Wu, Amy; Wang, Lisen; Jensen, Erik; Mathies, Richard; Boser, Bernhard

2010-02-21

Microfluidic systems offer an attractive alternative to conventional wet chemical methods with benefits including reduced sample and reagent volumes, shorter reaction times, high-throughput, automation, and low cost. However, most present microfluidic systems rely on external means to analyze reaction products. This substantially adds to the size, complexity, and cost of the overall system. Electronic detection based on sub-millimetre size integrated circuits (ICs) has been demonstrated for a wide range of targets including nucleic and amino acids, but deployment of this technology to date has been limited due to the lack of a flexible process to integrate these chips within microfluidic devices. This paper presents a modular and inexpensive process to integrate ICs with microfluidic systems based on standard printed circuit board (PCB) technology to assemble the independently designed microfluidic and electronic components. The integrated system can accommodate multiple chips of different sizes bonded to glass or PDMS microfluidic systems. Since IC chips and flex PCB manufacturing and assembly are industry standards with low cost, the integrated system is economical for both laboratory and point-of-care settings.

Management of Microcircuit Obsolescence in a Pre-Production ACAT-ID Missile Program

DTIC Science & Technology

2002-12-01

and Engineering Center ASIC Application Specific Integrated Circuit AVCOM Avionics Component Obsolescence Management BRU Battery Replaceable Unit...then just a paper qualification, e.g. Board or Battery Replaceable Unit ( BRU ) testing. 5 After-market Package The Die is Available and Can Be...Encapsulated Microcircuits (PEM), speed change, failure rate) 8 Emulation Manufacture or re-engineering of a FFF Replacement 9 CCA or BRU Redesign Board

77 FR 56989 - Airworthiness Directives; Bombardier Inc. Airplanes

Federal Register 2010, 2011, 2012, 2013, 2014

2012-09-17

... (TMU). Investigation has revealed that the failures were attributed to overstressed capacitors installed in the circuit board of the TMU ``Module 300'' power supply. The failure of the capacitors leads...

77 FR 16191 - Airworthiness Directives; Bombardier Inc. Airplanes

Federal Register 2010, 2011, 2012, 2013, 2014

2012-03-20

... (TMU). Investigation has revealed that the failures were attributed to overstressed capacitors installed in the circuit board of the TMU ``Module 300'' power supply. The failure of the capacitors leads...

Direct and indirect effects of different types of microplastics on freshwater prey (Corbicula fluminea) and their predator (Acipenser transmontanus)

PubMed Central

Parnis, J. Mark; Browne, Mark A.; Serrato, Sebastian; Reiner, Eric J.; Robson, Matthew; Young, Thomas; Diamond, Miriam L.; Teh, Swee J.

2017-01-01

We examined whether environmentally relevant concentrations of different types of microplastics, with or without PCBs, directly affect freshwater prey and indirectly affect their predators. Asian clams (Corbicula fluminea) were exposed to environmentally relevant concentrations of polyethylene terephthalate (PET), polyethylene, polyvinylchloride (PVC) or polystyrene with and without polychlorinated biphenyls (PCBs) for 28 days. Their predators, white sturgeon (Acipenser transmontanus), were exposed to clams from each treatment for 28 days. In both species, we examined bioaccumulation of PCBs and effects (i.e., immunohistochemistry, histology, behavior, condition, mortality) across several levels of biological organization. PCBs were not detected in prey or predator, and thus differences in bioaccumulation of PCBs among polymers and biomagnification in predators could not be measured. One of the main objectives of this study was to test the hypothesis that bioaccumulation of PCBs would differ among polymer types. Because we could not answer this question experimentally, a bioaccumulation model was run and predicted that concentrations of PCBs in clams exposed to polyethylene and polystyrene would be greater than PET and PVC. Observed effects, although subtle, seemed to be due to microplastics rather than PCBs alone. For example, histopathology showed tubular dilation in clams exposed to microplastics with PCBs, with only mild effects in clams exposed to PCBs alone. PMID:29108004

Life cycle assessment of a printed circuit board manufacturing plant in Turkey.

PubMed

Ozkan, Elif; Elginoz, Nilay; Germirli Babuna, Fatos

2017-09-29

The objective of this study is to investigate the environmental impacts of a printed circuit board (PCB) manufacturing plant through streamlined life cycle assessment approach. As a result, the most effective recommendations on minimizing the environmental impacts for the mentioned sector are revealed and first steps towards establishing a country specific database are taken. The whole PCB production consists of two consecutive stages: namely board fabrication followed by the manufacturing of PCB. Manufacturing of PCB contributes the highest shares to freshwater aquatic ecotoxicity potential (FAETP) and ozone layer depletion potential (ODP). Eighty-nine percent of FAETP is found to be generated from the manufacturing of PCB. Almost all of this contribution can be attributed to the disposal of copper containing wastewater treatment sludge from etching operations to incineration. On the other hand, PCB manufacturing has 73% share in total ODP. Within the manufacturing of PCB, as etching operations are found to be of importance for all the impact categories except eutrophication potential (EP), it is recommended to focus further studies on in-plant control of etching.

A Low-cost 4 Bit, 10 Giga-samples-per-second Analog-to-digital Converter Printed Circuit Board Assembly for FPGA-based Backends

NASA Astrophysics Data System (ADS)

Jiang, Homin; Yu, Chen-Yu; Kubo, Derek; Chen, Ming-Tang; Guzzino, Kim

2016-11-01

In this study, a 4 bit, 10 giga-samples-per-second analog-to-digital converter (ADC) printed circuit board assembly (PCBA) was designed, manufactured, and characterized for digitizing radio telescopes. For this purpose, an Adsantec ANST7120A-KMA flash ADC chip was used. Together with the field-programmable gate array platform, developed by the Collaboration for Astronomy Signal Processing and Electronics Research community, the PCBA enables data acquisition with a wide bandwidth and simplifies the intermediate frequency section. In the current version, the PCBA and the chip exhibit an analog bandwidth of 10 GHz (3 dB loss) and 20 GHz, respectively, which facilitates second, third, and even fourth Nyquist sampling. The following average performance parameters were obtained from the first and second Nyquist zones of the three boards: a spurious-free dynamic range of 31.35/30.45 dB, a signal-to-noise and distortion ratio of 22.95/21.83 dB, and an effective number of bits of 3.65/3.43, respectively.

Comparison of an enzyme-linked immunosorbent assay (ELISA) to gas chromatography (GC) - measurement of polychlorinated biphenyls (PCBs) in selected US fish extracts

USGS Publications Warehouse

Zajicek, J.L.; Tillitt, D.E.; Schwartz, T.R.; Schmitt, C.J.; Harrison, R.O.

2000-01-01

The analysis of PCBs in fish tissues by immunoassay methods was evaluated using fish collected from a US monitoring program, the National Contaminant Biomonitoring Program of the US Department of Interior, Fish and Wildlife Service. Selected composite whole fish samples, which represented widely varying concentrations and sources of PCBs, were extracted and subjected to congener PCB analysis by gas chromatography (GC) and total PCB analysis using an ELISA (ePCBs) calibrated against technical Aroclor 1248. PCB congener patterns in these fishes were different from the patterns found in commercial Aroclors or their combinations as demonstrated by principal component analysis of normalized GC congener data. The sum of the PCB congeners measured by GC (total-PCBs) ranged from 37 to 4600 ng/g (wet weight). Concentrations of PCBs as determined by the ELISA method were positively correlated with total-PCBs and the ePCBs/total-PCBs ratios for individual samples ranged from 1 to 6. Ratios of ePCBs/total-PCBs for dilutions of Aroclors 1242, 1254, and 1260 and for matrix spikes range from 0.6 for 1242 to 2.5 for 1254 and 1260. These results suggest that higher chlorinated PCB congeners have higher affinity for the anti-PCB antibodies. Partial least squares with latent variable analysis of GC and ELISA data of selected Aroclors and fish samples also support the conclusion that ELISA derived PCB concentrations are dependent on the degree on chlorination.

Effects of polychlorinated biphenyls on maternal odor conditioning in rat pups.

PubMed

Cromwell, Howard C; Johnson, Asia; McKnight, Logan; Horinek, Maegan; Asbrock, Christina; Burt, Shannon; Jolous-Jamshidi, Banafsheh; Meserve, Lee A

2007-08-15

Polychlorinated biphenyls (PCBs) are pervasive environmental contaminants that can have damaging effects on physiologic, motoric and cognitive function. Results from studies on PCBs and behavior have shown that exposure can alter learning and memory processes and that these shifts in cognitive abilities can be related to changes in hormonal and neural function. Little experimentation has been done on the impact of exposure to PCBs on social and emotional development. Previous work has shown that exposure to PCBs in children can alter play behavior. Importantly, exposure to PCBs has been found to change aspects of maternal-offspring interactions in rodents. The present study examined the impact of PCBs on maternal odor conditioning in rat pups 12-14 days of age. A modified version of the conditioned place preference paradigm was used that incorporated a maternal-associated odor cue (lemon scent) as the conditioned stimulus. PCBs significantly depressed the preference for the maternal-associated cue but did not impair discrimination for a novel odor. These effects could arise due to changes in the social dynamics between the dam and offspring after co-exposure to PCBs. For example, dams exposed to PCBs during gestation have been found to show elevated grooming directed towards pups exposed to PCBs. This change in maternal care can have dramatic effects on behavioral and hormonal systems in the developing rat pup. In conclusion, perinatal PCBs alter important social behaviors of both the mother and pup, and these alterations could have long-lasting effects on behavioral, cognitive and emotional development.

Effective algorithm for routing integral structures with twolayer switching

NASA Astrophysics Data System (ADS)

Nazarov, A. V.; Shakhnov, V. A.; Vlasov, A. I.; Novikov, A. N.

2018-05-01

The paper presents an algorithm for routing switching objects such as large-scale integrated circuits (LSICs) with two layers of metallization, embossed printed circuit boards, microboards with pairs of wiring layers on each side, and other similar constructs. The algorithm allows eliminating the effect of mutual blocking of routes in the classical wave algorithm by implementing a special circuit of digital wave motion in two layers of metallization, allowing direct intersections of all circuit conductors in a combined layer. However, information about the belonging of the topology elements to the circuits is sufficient for layering and minimizing the number of contact holes. In addition, the paper presents a specific example which shows that, in contrast to the known routing algorithms using a wave model, just one byte of memory per discrete of the work field is sufficient to implement the proposed algorithm.

Distribution of copper, silver and gold during thermal treatment with brominated flame retardants.

PubMed

Oleszek, Sylwia; Grabda, Mariusz; Shibata, Etsuro; Nakamura, Takashi

2013-09-01

The growing consumption of electric and electronic equipment results in creating an increasing amount of electronic waste. The most economically and environmentally advantageous methods for the treatment and recycling of waste electric and electronic equipment (WEEE) are the thermal techniques such as direct combustion, co-combustion with plastic wastes, pyrolysis and gasification. Nowadays, this kind of waste is mainly thermally treated in incinerators (e.g. rotary kilns) to decompose the plastics present, and to concentrate metals in bottom ash. The concentrated metals (e.g. copper, precious metals) can be supplied as a secondary raw material to metal smelters, while the pyrolysis of plastics allows the recovery of fuel gases, volatilising agents and, eventually, energy. Indeed, WEEE, such as a printed circuit boards (PCBs) usually contains brominated flame retardants (BFRs). From these materials, hydrobromic acid (HBr) is formed as a product of their thermal decomposition. In the present work, the bromination was studied of copper, silver and gold by HBr, originating from BFRs, such as Tetrabromobisphenol A (TBBPA) and Tetrabromobisphenol A-Tetrabromobisophenol A diglycidyl ether (TTDE) polymer; possible volatilization of the bromides formed was monitored using a thermo-gravimetric analyzer (TGA) and a laboratory-scale furnace for treating samples of metals and BFRs under an inert atmosphere and at a wide range of temperatures. The results obtained indicate that up to about 50% of copper and silver can evolve from sample residues in the form of volatile CuBr and AgBr above 600 and 1000°C, respectively. The reactions occur in the molten resin phase simultaneously with the decomposition of the brominated resin. Gold is resistant to HBr and remains unchanged in the residue. Copyright © 2013 Elsevier Ltd. All rights reserved.

[PHAHs levels in soil samples from the E-waste disassembly sites and their sources allocation].

PubMed

Zhao, Gao-Feng; Wang, Zi-Jian

2009-06-15

Soil samples (each with 3 replicates of - 1 kg, at the top 0-5 cm layer) were collected from each of the e-waste disassembly sites and the control site. Also obtained from each disassembly site were samples (each weighing - 0.2 kg) of cable coating,stuffing powder, and circuit boards chipping. The contents of 23 PBB congeners, 12 PBDE congeners, and 27 PCB congeners in soil and in their potential sources, including e-waste residues, were measured using the GC-MS5975B technique. The highest level of PBBs was found in the cable coating among the three e-waste residues, with a concentration of 35.25 ng x g(-1). The contents of low-brominated PBBs (including monobromobiphenyls and dibromobiphenyls) accounted for 38% of the total PBBs concentration observed in cable coating sample. The highest levels of PBDEs and PBDE209 were found in the stuffing powder for electronic component among the collected e-waste residues, with a concentration of 29.71 and 4.19 x 10(3) ng x g(-1). PBDE153 and PBDE183 were the most predominant PBDE congeners, with their concentration accounting for 43% and 24% of the total PBDEs concentration observed in the stuffing powder sample, respectively. Levels of PCBs in cable coating were the highest in these e-waste residues, with a concentration of 680.02 ngx g(-1). The observed values of the three PHAHs in soils from the disassembly site were considerably higher than their corresponding values observed in the control site (p < 0.05), which indicates that these PHAHs from e-waste is the pollution source of local environment.

355 nm UV laser patterning and post-processing of FR4 PCB for fine pitch components integration

NASA Astrophysics Data System (ADS)

Dupont, F.; Stoukatch, S.; Laurent, P.; Dricot, S.; Kraft, M.

2018-01-01

Laser direct patterning of fine pitch features on standard PCB (Printed Circuit Board) was investigated. As a feasibility study, eight parameter sets were selected and the smallest achievable grooves and tracks were determined. Three regular FR4 (Flame Resistant 4) PCB substrates have been experimented with. The first two have respectively 18 μm and 35 μm bare copper conductive layer without finish while the third one has a 18 μm copper layer with ENIG (Electroless Nickel Immersion Gold) finish. Laser patterning of PCB conductive structure is a single step, maskless and purely dry operation expected to allow reaching fine pitch features, even on thick copper layers (≥ 18 μm) for which the traditional chemical wet processes encounter underetch problems. Aside PCB complete structuring, a second objective is to evaluate laser post-processing of standard patterned PCB as an economically viable technique to integrate a few fine pitch components on low cost PCBs. This process is suitable for prototyping and for small and medium series. The widths of the smallest grooves and tracks that we achieved were measured about 11 μm and 19 μm on 18 μm thick cooper layer, 13 μm and 39 μm on 35 μm thick cooper layer, and 11 μm and 38 μm on 18 μm cooper layer with ENIG finish. These values are well below what can be achieved with a wet process. Etching results are presented at high magnification both from the top and from a cross-sectioning perspective. The latter allows observation of the TAZ (Thermal Affected Zone) in the conductive layer and the damages in the FR4.

Inactivation modeling of human enteric virus surrogates, MS2, Qβ, and ΦX174, in water using UVC-LEDs, a novel disinfecting system.

PubMed

Kim, Do-Kyun; Kim, Soo-Ji; Kang, Dong-Hyun

2017-01-01

In order to assure the microbial safety of drinking water, UVC-LED treatment has emerged as a possible technology to replace the use of conventional low pressure (LP) mercury vapor UV lamps. In this investigation, inactivation of Human Enteric Virus (HuEV) surrogates with UVC-LEDs was investigated in a water disinfection system, and kinetic model equations were applied to depict the surviving infectivities of the viruses. MS2, Qβ, and ΦX 174 bacteriophages were inoculated into sterile distilled water (DW) and irradiated with UVC-LED printed circuit boards (PCBs) (266nm and 279nm) or conventional LP lamps. Infectivities of bacteriophages were effectively reduced by up to 7-log after 9mJ/cm 2 treatment for MS2 and Qβ, and 1mJ/cm 2 for ΦX 174. UVC-LEDs showed a superior viral inactivation effect compared to conventional LP lamps at the same dose (1mJ/cm 2 ). Non-log linear plot patterns were observed, so that Weibull, Biphasic, Log linear-tail, and Weibull-tail model equations were used to fit the virus survival curves. For MS2 and Qβ, Weibull and Biphasic models fit well with R 2 values approximately equal to 0.97-0.99, and the Weibull-tail equation accurately described survival of ΦX 174. The level of UV-susceptibility among coliphages measured by the inactivation rate constant, k, was statistically different (ΦX 174 (ssDNA)>MS2, Qβ (ssRNA)), and indicated that sensitivity to UV was attributed to viral genetic material. Copyright © 2016 Elsevier Ltd. All rights reserved.

Development of a technology for fabricating low-cost parallel optical interconnects

NASA Astrophysics Data System (ADS)

Van Steenberge, Geert; Hendrickx, Nina; Geerinck, Peter; Bosman, Erwin; Van Put, Steven; Van Daele, Peter

2006-04-01

We present a fabrication technology for integrating polymer waveguides and 45° micromirror couplers into standard electrical printed circuit boards (PCBs). The most critical point that is being addressed is the low-cost manufacturing and the compatibility with current PCB production. The latter refers to the processes as well as material compatibility. In the fist part the waveguide fabrication technology is discussed, both photo lithography and laser ablation are proposed. It is shown that a frequency tripled Nd-YAG laser (355 nm) offers a lot of potential for defining single mode interconnections. Emphasis is on multimode waveguides, defined by KrF excimer laser (248 nm) ablation using acrylate polymers. The first conclusion out of loss spectrum measurements is a 'yellowing effect' of laser ablated waveguides, leading to an increased loss at shorter wavelengths. The second important conclusion is a potential low loss at a wavelength of 850 nm, 980 nm and 1310 nm. This is verified at 850 nm by cut-back measurements on 10-cm-long waveguides showing an average propagation loss of 0.13 dB/cm. Photo lithographically defined waveguides using inorganic-organic hybrid polymers show an attenuation loss of 0.15 dB/cm at 850 nm. The generation of debris and the presence of microstructures are two main concerns for KrF excimer laser ablation of hybrid polymers. In the second part a process for embedding metal coated 45° micromirrors in optical waveguiding layers is described. Mirrors are selectively metallized using a lift-off process. Filling up the angled via without the presence of air bubbles and providing a flat surface above the mirror is only possible by enhancing the cladding deposition process with ultrasound agitation. Initial loss measurements indicate an excess mirror loss of 1.5 dB.

Diagrams Showing Actions for Reducing Exposures to Polychlorinated Biphenyls (PCBs) in Indoor Building Environments

EPA Pesticide Factsheets

This diagram compliments the document, PCBs in Building Materials: Q's & A's, on how exposure to PCBs can be assessed and reduced in school buildings. It describes actions for reducing exposures to PCBs in indoor school building environments.

High-bandwidth and low-loss multimode polymer waveguides and waveguide components for high-speed board-level optical interconnects

NASA Astrophysics Data System (ADS)

Bamiedakis, N.; Chen, J.; Penty, R. V.; White, I. H.

2016-03-01

Multimode polymer waveguides are being increasingly considered for use in short-reach board-level optical interconnects as they exhibit favourable optical properties and allow direct integration onto standard PCBs with conventional methods of the electronics industry. Siloxane-based multimode waveguides have been demonstrated with excellent optical transmission performance, while a wide range of passive waveguide components that offer routing flexibility and enable the implementation of complex on-board interconnection architectures has been reported. In recent work, we have demonstrated that these polymer waveguides can exhibit very high bandwidth-length products in excess of 30 GHz×m despite their highly-multimoded nature, while it has been shown that even larger values of > 60 GHz×m can be achieved by adjusting their refractive index profile. Furthermore, the combination of refractive index engineering and launch conditioning schemes can ensure high bandwidth (> 100 GHz×m) and high coupling efficiency (<1 dB) with standard multimode fibre inputs with relatively large alignment tolerances (~17×15 μm2). In the work presented here, we investigate the effects of refractive index engineering on the performance of passive waveguide components (crossings, bends) and provide suitable design rules for their on-board use. It is shown that, depending on the interconnection layout and link requirements, appropriate choice of refractive index profile can provide enhanced component performance, ensuring low loss interconnection and adequate link bandwidth. The results highlight the strong potential of this versatile optical technology for the formation of high-performance board-level optical interconnects with high routing flexibility.

Rapid evolution of analog circuits configured on a field programmable transistor array

NASA Technical Reports Server (NTRS)

Stoica, A.; Ferguson, M. I.; Zebulum, R. S.; Keymeulen, D.; Duong, V.; Daud, T.

2002-01-01

The purpose of this paper is to illustrate evolution of analog circuits on a stand-alone board-level evolvable system (SABLES). SABLES is part of an effort to achieve integrated evolvable systems. SABLES provides autonomous, fast (tens to hundreds of seconds), on-chip circuit evolution involving about 100,000 circuit evaluations. Its main components are a JPL Field Programmable Transistor Array (FPTA) chip used as transistor-level reconfigurable hardware, and a TI DSP that implements the evolutionary algorithm controlling the FPTA reconfiguration. The paper details an example of evolution on SABLES and points out to certain transient and memory effects that affect the stability of solutions obtained reusing the same piece of hardware for rapid testing of individuals during evolution.

Fetal exposure markers of dioxins and dioxin-like PCBs.

PubMed

Lampa, Erik; Eguchi, Akifumi; Todaka, Emiko; Mori, Chisato

2018-04-01

Fetal exposure to polychlorinated biphenyls (PCBs), polychlorinated-p-dibenzodioxins (PCDDs), and polychlorinated dibenzofurans (PCDFs) have been associated with a number of adverse health outcomes. Although the placenta acts as a barrier between the mother and the fetus, these contaminants transfer through the placenta exposing the fetus. Several studies have investigated placental transfer, but few have assessed the co-variation among these contaminants. Maternal blood, cord blood, and cord tissue were collected from 41 Japanese mother-infant pairs and analyzed for dioxin-like PCBs and PCDD/Fs. Hierarchical cluster analysis followed by principal component analysis were used to assess the co-variation. Two stable clusters of dioxin-like PCBs were found in maternal and cord blood. One cluster of low/medium chlorinated dioxin-like PCBs was present in all three matrices with 2,3',4,4',5-PeCB(#118) and 3,3',4,4',5-PeCB(#126) explaining the majority of the clusters' variances. Medium/high chlorinated dioxin-like PCBs clustered in maternal blood and cord blood but not in cord tissue. 2,3,4,4',5-PeCB(#114) and 2,3,3',4,4',5,5'-HpCB(#189) explained the majority of the clusters' variances. There was a substantial correlation between the sum of dioxin-like PCBs and total PCDD/F in all three matrices. The sum of the four suggested PCBs plus 3,3',4,4'-TeCB(#77) correlated well with total PCDD/F in all three matrices. Apart from the dioxin-like PCBs, little co-variation existed among the studied contaminants. The five PCBs can be used as fetal exposure markers for dioxin and dioxin-like PCBs in maternal and cord blood respectively. In cord tissue, more higher chlorinated dioxin-like PCBs need to be measured as well.

New Discrete Fibonacci Charge Pump Design, Evaluation and Measurement

NASA Astrophysics Data System (ADS)

Matoušek, David; Hospodka, Jiří; Šubrt, Ondřej

2017-06-01

This paper focuses on the practical aspects of the realisation of Dickson and Fibonacci charge pumps. Standard Dickson charge pump circuit solution and new Fibonacci charge pump implementation are compared. Both charge pumps were designed and then evaluated by LTspice XVII simulations and realised in a discrete form on printed circuit board (PCB). Finally, the key parameters as the output voltage, efficiency, rise time, variable power supply and clock frequency effects were measured.

Dietary uptake of polychlorinated biphenyls (PCBs) by rainbow trout

USGS Publications Warehouse

Carline, Robert F.; Barry, Patrick M.; Ketola, H. George

2004-01-01

The presence of detectable levels of polychlorinated biphenyls (PCBs) in commercially produced fish feed has raised a concern about the degree of biomagnification of these contaminants in hatchery-reared trout. Our objectives were to (1) define the relationship between concentrations of PCBs in fish feed and in fish tissue and (2) estimate the relative contributions of feed and hatchery supply water to PCB concentrations in fish. We conducted a 6-month feeding trial with fingerling rainbow trout Oncorhynchus mykiss fed commercial diets with four concentrations of PCBs: a low-PCB diet (69 ng/g); a typical commercial diet (126 ng/g); and the typical diet spiked with PCBs at two levels (220 and 280 ng/g). The concentrations of PCBs in fillets after 1 month were commensurate with those in the feeds and remained relatively stable for the next 5 months; mean PCB concentrations in fillets ranged from 54 to 94 ng/g. Low levels of PCBs were detected in the hatchery supply water. We used the concentrations of PCBs in the feeds, absorption rates of PCBs, and two different rates of PCB depuration to estimate the potential uptake of PCBs from supply water. When we used a low depuration rate (half-life = 219 d), the computed body burdens of PCBs could be entirely attributed to the feeds. When a high depuration rate (half-life = 66 d) was used, some uptake of PCBs from the supply water was likely, but most of the total body burden originated from the feeds. We concluded that rainbow trout fed a diet with 126 ng/g PCBs would have a PCB concentration of about 60 ng/g in their fillets, which is high enough to warrant issuance of a consumption advisory (no more than one meal of fish per week) under a protocol adopted by some Great Lakes states.

Polychlorinated dioxins, furans (PCDD/Fs), dioxin-like polychlorinated biphenyls (dl-PCBs) and indicator PCBs (ind-PCBs) in egg and egg products in Turkey.

PubMed

Olanca, Burcu; Cakirogullari, Gul Celik; Ucar, Yunus; Kirisik, Dursun; Kilic, Devrim

2014-01-01

The aim of the study is to determine concentrations of polychlorinated dibenzo-p-dioxins (PCDDs), polychlorinated dibenzofurans (PCDFs), dioxin-like polychlorinated biphenyls (dl-PCBs) and indicator PCBs (ind-PCBs) in eggs from cage hens without soil contact, pasteurized egg samples and imported egg yolk powder samples in Turkey. Concentrations of PCDD/Fs, PCDD/Fs and dl-PCBs, and ind-PCBs in eggs and pasteurized egg samples are in the range of 0.247-1.527 pg WHO-TEQ(2005)g(-1) fat, 0.282-1.762 pg WHO-TEQ(2005)g(-1) fat and 202-1,235 pg g(-1) fat, respectively. For egg yolk powder samples, concentrations of PCDD/Fs, PCDD/Fs and dl-PCBs, and ind-PCBs are in the range of 0.122-0.494 pg WHO-TEQ(2005)g(-1) fat, 0.214-0.640 pg WHO-TEQ(2005)g(-1) fat and 217-1,498 pg g(-1) fat, respectively. All results for PCDD/Fs, PCDD/Fs and dl-PCBs, and ind-PCBs are below the values of 2.5 pg WHO-TEQ(2005)g(-1) fat, 5.0 pg WHO-TEQ(2005)g(-1) fat and 40 ng g(-1) fat imposed in Turkish Regulation for eggs and egg products, respectively. In all samples 2,3,4,7,8-PeCDF, 2,3,7,8-TCDD, 1,2,3,7,8-PeCDD and PCB126 are the most prominent congeners. Mean estimated daily exposure to PCDD/Fs and dl-PCBs for Turkish population from egg is 0.011 pg WHO-TEQ(2005)d(-1)kg body weight (bw)(-1). Although the exposure levels are below the TDI of 2 pg WHO-TEQ(1998)kg bw(-1), the results were based only on consumption of egg. In order to estimate total dietary intake for Turkish population, various food items should be investigated. Copyright © 2013 Elsevier Ltd. All rights reserved.

TOXICOKINETICS OF CHIRAL POLYCHLORINATED BIPHENYLS ACROSS DIFFERENT SPECIES—A REVIEW

PubMed Central

Kania-Korwel, Izabela; Lehmler, Hans-Joachim

2015-01-01

Nineteen PCBs (chiral or C-PCBs) exist as two stable rotational isomers (atropisomers) that are non-superimposable mirror images of each other. C-PCBs are released into the environment as racemic (i.e., equal) mixtures of both atropisomers and undergo atropisomeric enrichment due to biological, but not abiotic processes. In particular toxicokinetic studies provide important, initial insights into atropselective processes involved in the disposition (i.e., absorption, distribution, biotransformation and excretion) of C-PCBs. The toxicokinetic of C-PCBs is highly congener and species dependent. In particular at lower trophic levels, abiotic processes play a predominant role in C-PCB toxicokinetics. Biotransformation plays an important role in the elimination of C-PCBs in mammals. The elimination of C-PCB follows the approximate order mammals > birds > amphibians > fish, mostly due to a corresponding decrease in metabolic capacity. A few studies have shown differences in the toxicokinetics of C-PCB atropisomers; however, more work in needed to understand the toxicokinetics of C-PCBs and the underlying biological processes. Such studies will not only contribute to our understanding of the fate of C-PCBs in aquatic and terrestrial food webs, but also facilitate our understanding of human exposures to C-PCBs. PMID:25824003

41 CFR 60-20.5 - Discriminatory wages.

Code of Federal Regulations, 2011 CFR

2011-07-01

... functional units: One (assembly) all female; another (wiring), all male; and a third (circuit boards), also all male. The highest wage attainable in the assembly unit is considerably less than that in the...

Rover 2

NASA Image and Video Library

2003-11-07

In the Payload Hazardous Servicing Facility, the lander petals of the Mars Exploration Rover 2 MER-2 have been reopened and its solar panels deployed to allow technicians access to the spacecraft to remove one of its circuit boards.

The bioaccessibility of polychlorinated biphenyls (PCBs) and polychlorinated dibenzo-p-dioxins/furans (PCDD/Fs) in cooked plant and animal origin foods.

PubMed

Shen, Haitao; Starr, James; Han, Jianlong; Zhang, Lei; Lu, Dasheng; Guan, Rongfa; Xu, Xiaomin; Wang, Xiaofeng; Li, Jingguang; Li, Weiwei; Zhang, Yanjun; Wu, Yongning

2016-09-01

In this study, we compared the effect of boiling and frying food preparation methods in determining the bioaccessibility of polychlorinated biphenyls (PCBs) and polychlorinated dibenzo-p-dioxins/furans (PCDD/Fs) in rice, cabbage, milk powder, eggs, beef, and fresh water fish. We then used these data to calculate a toxic equivalent (TEQ) for risk assessment and compared it to published values that did not account for bioaccessibility. When the foods were prepared by boiling, the mean bioaccessibility (%) in rice (PCBs: 16.5±1.0, PCDD/Fs: 4.9±0.3) and cabbage (PCBs: 4.2±0.9, PCDD/Fs: 1.9±0.7) were lower than in animal origin foods (beef, PCBs: 49.0±3.3, PCDD/Fs: 7.8±0.9; egg, PCBs: 29.7±3.1, PCDD/Fs: 8.6±1.3; fish, PCBs: 26.9±2.5, PCDD/Fs: 7.9±1.3; milk powder, PCBs: 72.3±1.6, PCDD/Fs: 28.4±1.2). When fried in cooking oil, the bioaccessibilities of all analytes in all foods increased, but the increase in plant based foods (rice, PCBs: 3.4×, PCDD/Fs: 3.6×; cabbage, PCBs: 10.3×, PCDD/Fs: 7.9×) was greater than that of animal origin foods (beef, PCBs: 1.6×, PCDD/Fs: 3.4×; egg, PCBs: 2.1×, PCDD/Fs: 1.8×; fish, PCBs: 2.8, PCDD/Fs: 3.2×). Comparison of PCBs/PCDD/Fs bioaccessibility in rice and cabbage showed that bioaccessibility was greater in the low fat, high carbohydrate/protein content food (rice) than in the low carbohydrate/protein, low fat content food (cabbage), regardless of the method used to prepare the food. Adjusting for bioaccessibility reduced the gross estimated daily intake (EDI) of 112pgWHO-TEQ/day, by 88% and 63% respectively for foods prepared by boiling and frying. Our results indicate that: 1) The method used for cooking is an important determinant of PCBs/PCDD/Fs bioaccessibility, especially for plant origin foods, 2) there might be a joint fat, carbohydrate and protein effect that influences the bioaccessibilities of PCBs/PCDD/Fs in foods, and 3) use of bioaccessibility estimates would reduce the uncertainty in TEQ calculations. Copyright © 2016 Elsevier Ltd. All rights reserved.

Surface and Electrical Characterization of Ag/AgCl Pseudo-Reference Electrodes Manufactured with Commercially Available PCB Technologies

PubMed Central

Moschou, Despina; Trantidou, Tatiana; Regoutz, Anna; Carta, Daniela; Morgan, Hywel; Prodromakis, Themistoklis

2015-01-01

Lab-on-Chip is a technology that could potentially revolutionize medical Point-of-Care diagnostics. Considerable research effort is focused towards innovating production technologies that will make commercial upscaling financially viable. Printed circuit board manufacturing techniques offer several prospects in this field. Here, we present a novel approach to manufacturing Printed Circuit Board (PCB)-based Ag/AgCl reference electrodes, an essential component of biosensors. Our prototypes were characterized both structurally and electrically. Scanning Electron Microscopy (SEM) and X-Ray Photoelectron Spectroscopy (XPS) were employed to evaluate the electrode surface characteristics. Electrical characterization was performed to determine stability and pH dependency. Finally, we demonstrate utilization along with PCB pH sensors, as a step towards a fully integrated PCB platform, comparing performance with discrete commercial reference electrodes. PMID:26213940

Recovery of Precious and Base Metals from Waste Printed Circuit Boards Using a Sequential Leaching Procedure

NASA Astrophysics Data System (ADS)

Batnasan, Altansukh; Haga, Kazutoshi; Shibayama, Atsushi

2018-02-01

This paper considers the issue of recycling of waste printed circuit boards (WPCBs) containing precious and base metals in appreciable amounts. High-pressure oxidative leaching (HPOL) with dilute sulfuric acid resulted in removal of a significant amount of base metals from a WPCB ash sample obtained by incineration at 800°C. The parameters investigated in the precious metal leaching from WPCB residue after HPOL included the sulfuric acid concentration, thiourea concentration, oxidant concentration, leaching temperature, and leaching time. Recovery of gold, silver, and palladium of 100%, 81%, and 13% from the WPCB residue sample was achieved by thiourea leaching under optimized conditions. The results show that the efficiency of precious metal dissolution from the WPCB sample using thiourea solution depended strongly on the concentration of both thiourea and oxidant.

Recovery of Precious and Base Metals from Waste Printed Circuit Boards Using a Sequential Leaching Procedure

NASA Astrophysics Data System (ADS)

Batnasan, Altansukh; Haga, Kazutoshi; Shibayama, Atsushi

2017-12-01

This paper considers the issue of recycling of waste printed circuit boards (WPCBs) containing precious and base metals in appreciable amounts. High-pressure oxidative leaching (HPOL) with dilute sulfuric acid resulted in removal of a significant amount of base metals from a WPCB ash sample obtained by incineration at 800°C. The parameters investigated in the precious metal leaching from WPCB residue after HPOL included the sulfuric acid concentration, thiourea concentration, oxidant concentration, leaching temperature, and leaching time. Recovery of gold, silver, and palladium of 100%, 81%, and 13% from the WPCB residue sample was achieved by thiourea leaching under optimized conditions. The results show that the efficiency of precious metal dissolution from the WPCB sample using thiourea solution depended strongly on the concentration of both thiourea and oxidant.

Volumetric segmentation of range images for printed circuit board inspection

NASA Astrophysics Data System (ADS)

Van Dop, Erik R.; Regtien, Paul P. L.

1996-10-01

Conventional computer vision approaches towards object recognition and pose estimation employ 2D grey-value or color imaging. As a consequence these images contain information about projections of a 3D scene only. The subsequent image processing will then be difficult, because the object coordinates are represented with just image coordinates. Only complicated low-level vision modules like depth from stereo or depth from shading can recover some of the surface geometry of the scene. Recent advances in fast range imaging have however paved the way towards 3D computer vision, since range data of the scene can now be obtained with sufficient accuracy and speed for object recognition and pose estimation purposes. This article proposes the coded-light range-imaging method together with superquadric segmentation to approach this task. Superquadric segments are volumetric primitives that describe global object properties with 5 parameters, which provide the main features for object recognition. Besides, the principle axes of a superquadric segment determine the phase of an object in the scene. The volumetric segmentation of a range image can be used to detect missing, false or badly placed components on assembled printed circuit boards. Furthermore, this approach will be useful to recognize and extract valuable or toxic electronic components on printed circuit boards scrap that currently burden the environment during electronic waste processing. Results on synthetic range images with errors constructed according to a verified noise model illustrate the capabilities of this approach.

Leaded electronic waste is a possible source material for lead-contaminated jewelry.

PubMed

Weidenhamer, Jeffrey D; Clement, Michael L

2007-10-01

Highly leaded jewelry, often imported from China, remains widely available in the United States. Leaded electronic waste is exported from the United States to several Asian countries where solder is recovered and circuit boards are stripped of parts in small workshops. To assess whether electronic waste is being recycled into the jewelry, lead, tin and copper content of highly leaded jewelry samples were determined by atomic absorption spectrometry. Sixteen jewelry items previously determined to contain 20-80% lead by weight were analyzed. Samples were digested in nitric acid for analysis of lead and copper, and in aqua regia for analysis of tin. Six samples contained significant amounts of tin, from 20.8% to 29.9% by weight. In addition, copper was a significant minor component of five of these samples (up to 4% by weight). Copper (present at 10-40% by weight in circuit boards) was shown to rapidly move into heated lead-tin solder. The combined lead-tin-copper content of these six items ranges from 93.5% to 100%, suggestive of a solder-based source material. These results are consistent with the hypothesis that recycled circuit board solders are being used to produce some of the heavily leaded imported jewelry sold in the United States. Should this hypothesis be substantiated, it suggests that environmental policies to protect children's health must address both proper recycling of source materials as well as restrictions of the lead content in consumer goods.

Hydrothermal modification and recycling of nonmetallic particles from waste print circuit boards.

PubMed

Gao, Xuehua; Li, Qisheng; Qiu, Jun

2018-04-01

Nonmetallic particles recycled from waste print circuit boards (NPRPs) were modified by a hydrothermal treatment method and the catalysts, solvents, temperature and time were investigated, which affected the modification effect of NPRPs. The mild hydrothermal treatment method does not need high temperature, and would not cause secondary pollution. Further, the modified NPRPs were used as the raw materials for the epoxy resin and glass fibers/epoxy resin composites, which were prepared by pouring and hot-pressing method. The mechanical properties and morphology of the composites were discussed. The results showed that relative intensity of the hydroxyl bonds on the surface of NPRPs increased 58.9% after modification. The mechanical tests revealed that both flexural and impact properties of the composites can be significantly improved by adding the modified NPRPs. Particularly, the maximum increment of flexural strength, flexural modulus and impact strength of the epoxy matrix composites with 30% modified NPRPs is 40.1%, 80.0% and 79.0%, respectively. Hydrothermal treatment can modify surface of NPRPs successfully and modified NPRPs can not only improve the properties of the composites, but also reduce the production cost of the composites and environmental pollution. Thus, we develop a new way to recycle nonmetallic materials of waste print circuit boards and the highest level of waste material recycling with the raw materials-products-raw materials closed cycle can be realized through the hydrothermal modification and reuse of NPRPs. Copyright © 2018 Elsevier Ltd. All rights reserved.

Chiral Polychlorinated Biphenyls: Absorption, Metabolism and Excretion – A Review

PubMed Central

Kania-Korwel, Izabela; Lehmler, Hans-Joachim

2015-01-01

Seventy eight out of the 209 possible polychlorinated biphenyl (PCB) congeners are chiral, nineteen of which exist under ambient conditions as stable rotational isomers that are non-superimposable mirror images of each other. These congeners (C-PCBs) represent up to 6% by weight of technical PCB mixtures and undergo considerable atropisomeric enrichment in wildlife, laboratory animals and humans. The objective of this review is to summarize our current knowledge of the processes involved in the absorption, metabolism and excretion of C-PCBs and their metabolites in laboratory animals and humans. C-PCBs are absorbed and excreted by passive diffusion, a process that, like other physicochemical processes, is inherently not atropselective. In mammals, metabolism by cytochrome P450 (P450) enzymes represents a major route of elimination for many C-PCBs. In vitro studies demonstrate that C-PCBs with a 2,3,6-trichlorosubstituion pattern in one phenyl ring are readily oxidized to hydroxylated PCB metabolites (HO-PCBs) by P450 enzymes, such as rat CYP2B1, human CYP2B6 and dog CYP2B11. The oxidation of C-PCBs is atropselective, thus resulting in a species and congener-dependent atropisomeric enrichment of C-PCBs and their metabolites. This atropisomeric enrichment of C-PCBs and their metabolites likely plays a poorly understood role in the atropselective toxicity of C-PCBs and, therefore, warrants further investigation. PMID:25651810

40 CFR 761.274 - Reporting PCB concentrations in samples.

Code of Federal Regulations, 2013 CFR

2013-07-01

...) TOXIC SUBSTANCES CONTROL ACT POLYCHLORINATED BIPHENYLS (PCBs) MANUFACTURING, PROCESSING, DISTRIBUTION IN... concentrations for non-liquid PCBs on a dry weight basis as micrograms of PCBs per gram of sample (ppm by weight... quotient by the total number of micrograms of PCBs on the surface to obtain the equivalent measurement of...

40 CFR 761.274 - Reporting PCB concentrations in samples.

Code of Federal Regulations, 2010 CFR

2010-07-01

...) TOXIC SUBSTANCES CONTROL ACT POLYCHLORINATED BIPHENYLS (PCBs) MANUFACTURING, PROCESSING, DISTRIBUTION IN... concentrations for non-liquid PCBs on a dry weight basis as micrograms of PCBs per gram of sample (ppm by weight... quotient by the total number of micrograms of PCBs on the surface to obtain the equivalent measurement of...

An Optimization System with Parallel Processing for Reducing Common-Mode Current on Electronic Control Unit

NASA Astrophysics Data System (ADS)

Okazaki, Yuji; Uno, Takanori; Asai, Hideki

In this paper, we propose an optimization system with parallel processing for reducing electromagnetic interference (EMI) on electronic control unit (ECU). We adopt simulated annealing (SA), genetic algorithm (GA) and taboo search (TS) to seek optimal solutions, and a Spice-like circuit simulator to analyze common-mode current. Therefore, the proposed system can determine the adequate combinations of the parasitic inductance and capacitance values on printed circuit board (PCB) efficiently and practically, to reduce EMI caused by the common-mode current. Finally, we apply the proposed system to an example circuit to verify the validity and efficiency of the system.

NASA Communications Division (NASCOM) Tracking and Data Relay Satellite System (TDRSS) shuttle multiplexer-demultiplexer data system (MDM) and supporting items

NASA Technical Reports Server (NTRS)

New, S. R.

1981-01-01

The multiplexer-demultiplexer (MDM) project included the design, documentation, manufacture, and testing of three MDM Data Systems. The equipment is contained in 59 racks, and includes more than 3,000 circuit boards and 600 microprocessors. Spares, circuit card testers, a master set of programmable integrated circuits, and a program development system were included as deliverables. All three MDM's were installed, and were operationally tested. The systems performed well with no major problems. The progress and problems analysis, addresses schedule conformance, new technology, items awaiting government approval, and project conclusions are summarized. All contract modifications are described.

NASA Communications Division (NASCOM) Tracking and Data Relay Satellite System (TDRSS) shuttle multiplexer-demultiplexer data system (MDM) and supporting items

NASA Astrophysics Data System (ADS)

New, S. R.

1981-06-01

The multiplexer-demultiplexer (MDM) project included the design, documentation, manufacture, and testing of three MDM Data Systems. The equipment is contained in 59 racks, and includes more than 3,000 circuit boards and 600 microprocessors. Spares, circuit card testers, a master set of programmable integrated circuits, and a program development system were included as deliverables. All three MDM's were installed, and were operationally tested. The systems performed well with no major problems. The progress and problems analysis, addresses schedule conformance, new technology, items awaiting government approval, and project conclusions are summarized. All contract modifications are described.

Flexible micro flow sensor for micro aerial vehicles

NASA Astrophysics Data System (ADS)

Zhu, Rong; Que, Ruiyi; Liu, Peng

2017-12-01

This article summarizes our studies on micro flow sensors fabricated on a flexible polyimide circuit board by a low-cost hybrid process of thin-film deposition and circuit printing. The micro flow sensor has merits of flexibility, structural simplicity, easy integrability with circuits, and good sensing performance. The sensor, which adheres to an object surface, can detect the surface flow around the object. In our study, we install the fabricated micro flow sensors on micro aerial vehicles (MAVs) to detect the surface flow variation around the aircraft wing and deduce the aerodynamic parameters of the MAVs in flight. Wind tunnel experiments using the sensors integrated with the MAVs are also conducted.

Coplanar PCB distribution between chorioallantoic membranes and eggs of alligators and Loggerhead sea turtles

DOE Office of Scientific and Technical Information (OSTI.GOV)

Bargar, T.A.; Cobb, G.P.

1995-12-31

The relative distribution of coplanar polychlorinated biphenyls (PCBs) between chorioallantoic membranes (CAMS) and eggs was investigated in inviable American alligator (Alligator mississippiensis) and Loggerhead sea turtle (Caretta caretra) eggs. Cam and egg extracts were fractionated by HPLC using a porous graphitic column (PGC) and an in line switching valve to separate coplanar from non-coplanar PCBs. The fractions were collected, concentrated by nitrogen evaporation, and injected on GC-ECD (60M DB-5 capillary column) for quantification. Alligator and Loggerhead sea turtle eggs contain toxicologically significant coplanar PCBs. Mono-ortho substituted PCBs were present with greater frequency relative to non-ortho substituted PCBs in both eggsmore » and CAMS. The presence of coplanar PCBs in eggs appears to be correlated to coplanar PCB presence in CAMS. The chorioallantoic membrane could serve as a biomarker of embryo exposure to coplanar PCBs.« less

USING STABLE ISOTOPES TO TRACK BIOMAGNIFICATION OF POLYCHLORINATED BIPHENYLS (PCBS) THROUGH STREAM FOOD WEBS

EPA Science Inventory

Biomagnification studies of PCBs in streams are rare, even though PCBs are known to biomagnify and persist in aquatic ecosystems. We investigated PCB contamination in Twelve Mile Creek (Clemson, South Carolina, U.S.A.), a stream that received >400,000 lbs. of PCBs from 1955-1978...

That Elusive, Eclectic Thing Called Thermal Environment: What a Board Should Know About It

ERIC Educational Resources Information Center

Schutte, Frederick

1970-01-01

Discussion of proper thermal environment for protection of sophisticated educational equipment such as computer and data-processing machines, magnetic tapes, closed-circuit television and video tape communications systems.

Presidential Green Chemistry Challenge: 2013 Academic Award

EPA Pesticide Factsheets

Presidential Green Chemistry Challenge 2013 award winner, Prof Richard P. Wool of the University of Delaware, created high-performance materials using vegetable oils, feathers, and flax. Can be used as adhesives, composites, foams, and circuit boards.

77 FR 46024 - Foreign-Trade Zone 8-Toledo, OH; Notification of Proposed Production Activity, Whirlpool...

Federal Register 2010, 2011, 2012, 2013, 2014

2012-08-02

..., AC motors, power supplies, heater tubs, LED light assemblies, triple level and push button switches, control panels, printed circuit boards, power cords, wire harnesses, EMI filters, pressure sensors...

Multi-lead heat sink

DOEpatents

Roose, L.D.

1984-07-03

The disclosure relates to a heat sink used to protect integrated circuits from the heat resulting from soldering them to circuit boards. A tubular housing contains a slidable member which engages somewhat inwardly extending connecting rods, each of which is rotatably attached at one end to the bottom of the housing. The other end of each rod is fastened to an expandable coil spring loop. As the member is pushed downward in the housing, its bottom edge engages and forces outward the connecting rods, thereby expanding the spring so that it will fit over an integrated circuit. After the device is in place, the member is slid upward and the spring contracts about the leads of the integrated circuit. Soldering is now conducted and the spring absorbs excess heat therefrom to protect the integrated circuit. The placement steps are repeated in reverse order to remove the heat sink for use again. 4 figs.

Multi-lead heat sink

DOEpatents

Roose, Lars D.

1984-01-01

The disclosure relates to a heat sink used to protect integrated circuits from the heat resulting from soldering them to circuit boards. A tubular housing contains a slidable member which engages somewhat inwardly extending connecting rods, each of which is rotatably attached at one end to the bottom of the housing. The other end of each rod is fastened to an expandable coil spring loop. As the member is pushed downward in the housing, its bottom edge engages and forces outward the connecting rods, thereby expanding the spring so that it will fit over an integrated circuit. After the device is in place, the member is slid upward and the spring contracts about the leads of the integrated circuit. Soldering is now conducted and the spring absorbs excess heat therefrom to protect the integrated circuit. The placement steps are repeated in reverse order to remove the heat sink for use again.

Multi-lead heat sink

DOEpatents

Roose, L.D.

1982-08-25

The disclosure relates to a heat sink used to protect integrated circuits from the heat resulting from soldering them to circuit boards. A tubular housing contains a slidable member which engages somewhat inwardly extending connecting rods, each of which is rotatably attached at one end to the bottom of the housing. The other end of each rod is fastened to an expandable coil spring loop. As the member is pushed downward in the housing, its bottom edge engages and forces outward the connecting rods, thereby expanding the spring so that it will fit over an integrated circuit. After the device is in place, the member is slid upward and the spring contracts about the leads of the integrated circuit. Soldering is now conducted and the spring absorbs excess heat therefrom to protect the integrated circuit. The placement steps are repeated in reverse order to remove the heat sink for use again.

Cables and crosstalk

NASA Astrophysics Data System (ADS)

Paul, Clayton R.

1991-06-01

Crosstalk is the unintentional electromagnetic coupling between circuits which are connected by parallel conductors that lie in close proximity to each other. Some examples are wires in cable harnesses or metallic lands on printed-circuit boards (PCB's). This unintended interaction between two or more circuits via their electromagnetic fields can cause interference problems. Signals from one circuit that couple to another circuit appear at the terminals of the devices that are interconnected by the wires. If these signals are of sufficient magnitude or spectral content, they may cause unintended operation of the device or a degradation in its performance. A summary of the standard models used for predicting crosstalk in various types of configurations is presented. The discussion focusses on the relative accuracies, regions of applicability, and computational complexity of the models. A simple explanation of the ability (or inability) of shielded wires and twisted pairs of wires to reduce the crosstalk is also given.

Report of the Odyssey FPGA Independent Assessment Team

NASA Technical Reports Server (NTRS)

Mayer, Donald C.; Katz, Richard B.; Osborn, Jon V.; Soden, Jerry M.; Barto, R.; Day, John H. (Technical Monitor)

2001-01-01

An independent assessment team (IAT) was formed and met on April 2, 2001, at Lockheed Martin in Denver, Colorado, to aid in understanding a technical issue for the Mars Odyssey spacecraft scheduled for launch on April 7, 2001. An RP1280A field-programmable gate array (FPGA) from a lot of parts common to the SIRTF, Odyssey, and Genesis missions had failed on a SIRTF printed circuit board. A second FPGA from an earlier Odyssey circuit board was also known to have failed and was also included in the analysis by the IAT. Observations indicated an abnormally high failure rate for flight RP1280A devices (the first flight lot produced using this flow) at Lockheed Martin and the causes of these failures were not determined. Standard failure analysis techniques were applied to these parts, however, additional diagnostic techniques unique for devices of this class were not used, and the parts were prematurely submitted to a destructive physical analysis, making a determination of the root cause of failure difficult. Any of several potential failure scenarios may have caused these failures, including electrostatic discharge, electrical overstress, manufacturing defects, board design errors, board manufacturing errors, FPGA design errors, or programmer errors. Several of these mechanisms would have relatively benign consequences for disposition of the parts currently installed on boards in the Odyssey spacecraft if established as the root cause of failure. However, other potential failure mechanisms could have more dire consequences. As there is no simple way to determine the likely failure mechanisms with reasonable confidence before Odyssey launch, it is not possible for the IAT to recommend a disposition for the other parts on boards in the Odyssey spacecraft based on sound engineering principles.

PCBs contamination in seafood species at the Eastern Coast of Thailand.

PubMed

Jaikanlaya, Chate; Settachan, Daam; Denison, Michael S; Ruchirawat, Mathuros; van den Berg, Martin

2009-06-01

Polychlorinated biphenyls (PCBs) are a large group of persistent organic substances spread throughout the world. The most toxic PCBs are those that are dioxin-like (dl-PCBs). Environmental studies on PCBs in Thailand are limited, especially with regards to dl-PCBs. This study is one of the first in this country that demonstrates contamination of seafood with PCBs and determines the levels of PCBs and total dioxin like activity in mussels, oysters and shrimp, from the Eastern Coast of Thailand. Sixty pooled samples of mussels and twenty-seven pooled samples of oysters were collected from cultivation farms and twenty-one pooled samples of shrimp were collected from fisherman piers. Qualitative and quantitative measurements of 49 PCB congeners was obtained by HRGC-ECD analysis and total dioxin-like activity using the CAFLUX bioassay. Total PCB concentrations varied between three species, ranging between 19 and 1100 ng g(-1) lipid adjusted weight, and the levels of PCBs in shrimp was three time higher than that in mussels and oysters. With respected to the pattern of PCB congeners, it implied that the source of PCBs exposure in this area could be from the regional contamination. The calculated CAFLUX bioanalytical equivalents (BEQs) values ranged between 0.8 and 18 pg BEQ g(-1) lipid adjusted weight, and showed a good relationship with the chemical-derived TEQs. Therefore, the CAFLUX bioassay can be used for effective screening of dioxin-like activity in marine species effectively.

PCBs contamination in seafood species at the Eastern Coast of Thailand

PubMed Central

Jaikanlaya, Chate; Settachan, Daam; Denison, Michael S.; Ruchirawat, Mathuros; van den Berg, Martin

2010-01-01

Polychlorinated biphenyls (PCBs) are a large group of persistent organic substances spread throughout the world. The most toxic PCBs are those that are dioxin-like (dl-PCBs). Environmental studies on PCBs in Thailand are limited, especially with regards to dl-PCBs. This study is one of the first in this country that demonstrates contamination of seafood with PCBs and determines the levels of PCBs and total dioxin like activity in mussels, oysters and shrimp, from the Eastern Coast of Thailand. Sixty pooled samples of mussels and twenty-seven pooled samples of oysters were collected from cultivation farms and twenty-one pooled samples of shrimp were collected from fisherman piers. Qualitative and quantitative measurements of 49 PCB congeners was obtained by HRGC-ECD analysis and total dioxin-like activity using the CAFLUX bioassay. Total PCB concentrations varied between three species, ranging between 19 and 1100 ng g−1 lipid adjusted weight, and the levels of PCBs in shrimp was three time higher than that in mussels and oysters. With respected to the pattern of PCB congeners, it implied that the source of PCBs exposure in this area could be from the regional contamination. The calculated CAFLUX bioanalytical equivalents (BEQs) values ranged between 0.8 and 18 pg BEQ g−1 lipid adjusted weight, and showed a good relationship with the chemical-derived TEQs. Therefore, the CAFLUX bioassay can be used for effective screening of dioxin-like activity in marine species effectively. PMID:19375780

Polychlorinated biphenyls in Nepalese surface soils: Spatial distribution, air-soil exchange, and soil-air partitioning.

PubMed

Yadav, Ishwar Chandra; Devi, Ningombam Linthoingambi; Li, Jun; Zhang, Gan

2017-10-01

Regardless of the ban on the polychlorinated biphenyls (PCBs) decade ago, significant measures of PCBs are still transmitted from essential sources in cities and are all inclusive ecological contaminants around the world. In this study, the concentrations of PCBs in soil, the air-soil exchange of PCBs, and the soil-air partitioning coefficient (K SA ) of PCBs were investigated in four noteworthy urban areas in Nepal. Overall, the concentrations of ∑ 30 PCBs ranged from 10 to 59.4ng/g dry weight; dw (mean 12.2ng/g ±11.2ng/g dw). The hexa-CBs (22-31%) was most dominant among several PCB-homologues, followed by tetra-CBs (20-29%), hepta-CBs (12-21%), penta-CBs (15-17%) and tri-CBs (9-19%). The sources of elevated level of PCBs discharge in Nepalese soil was identified as emission from transformer oil, lubricants, breaker oil, cutting oil and paints, and cable insulation. Slightly strong correlation of PCBs with TOC than BC demonstrated that amorphous organic matter (AOM) assumes a more critical part in holding of PCBs than BC in Nepalese soil. The fugacity fraction (ff) results indicated the soil being the source of PCB in air through volatilization and net transport from soil to air. The soil-air partitioning coefficient study suggests the absorption by soil organic matter control soil-air partitioning of PCBs. Slightly weak but positive correlation of measured Log K SA with Log K OA (R 2 = 0.483) and Log K BC-A (R 2 = 0.438) suggests that both Log K OA and Log K BC-A can predict soil-air partitioning to lesser extent for PCBs. Copyright © 2017 Elsevier Inc. All rights reserved.

Gaseous and Freely-Dissolved PCBs in the Lower Great Lakes Based on Passive Sampling: Spatial Trends and Air-Water Exchange.

PubMed

Liu, Ying; Wang, Siyao; McDonough, Carrie A; Khairy, Mohammed; Muir, Derek C G; Helm, Paul A; Lohmann, Rainer

2016-05-17

Polyethylene passive sampling was performed to quantify gaseous and freely dissolved polychlorinated biphenyls (PCBs) in the air and water of Lakes Erie and Ontario during 2011-2012. In view of differing physical characteristics and the impacts of historical contamination by PCBs within these lakes, spatial variation of PCB concentrations and air-water exchange across these lakes may be expected. Both lakes displayed statistically similar aqueous and atmospheric PCB concentrations. Total aqueous concentrations of 29 PCBs ranged from 1.5 pg L(-1) in the open lake of Lake Erie (site E02) in 2011 spring to 105 pg L(-1) in Niagara (site On05) in 2012 summer, while total atmospheric concentrations were 7.7-634 pg m(-3) across both lakes. A west-to-east gradient was observed for aqueous PCBs in Lake Erie. River discharge and localized influences (e.g., sediment resuspension and regional alongshore transport) likely dominated spatial trends of aqueous PCBs in both lakes. Air-water exchange fluxes of Σ7PCBs ranged from -2.4 (±1.9) ng m(-2) day(-1) (deposition) in Sheffield (site E03) to 9.0 (±3.1) ng m(-2) day(-1) (volatilization) in Niagara (site On05). Net volatilization of PCBs was the primary trend across most sites and periods. Almost half of variation in air-water exchange fluxes was attributed to the difference in aqueous concentrations of PCBs. Uncertainty analysis in fugacity ratios and mass fluxes in air-water exchange of PCBs indicated that PCBs have reached or approached equilibrium only at the eastern Lake Erie and along the Canadian shore of Lake Ontario sites, where air-water exchange fluxes dominated atmospheric concentrations.

Stereoselective Formation of Mono- and Di-Hydroxylated Polychlorinated Biphenyls by Rat Cytochrome P450 2B1

PubMed Central

Lehmler, Hans-Joachim; Wong, Charles S.

2013-01-01

Changes in atropisomer composition of chiral polychlorinated biphenyls (PCBs) and their mono- and di- hydroxylated metabolites (OH- and diOH-PCBs) via rat cytochrome P450 2B1 (CYP2B1) mediated biotransformation were investigated in vitro. Rat CYP2B1 could stereoselectively biotransform chiral PCBs to generate meta-OH-PCBs as the major metabolites after 60 min incubations. Non-racemic enantiomer fractions (EFs: concentration ratios of the (+)-atropisomer or the first-eluting atropisomer over the total concentrations of two atropisomers) of 5-OH-PCBs, were 0.17, 0.20, 0.85, 0.77 and 0.41 for incubations with PCBs 91, 95, 132, 136 and 149, respectively. CYP-mediated stereoselective formation of diOH-PCBs from OH-PCBs was observed for the first time. After 60 min stereoselective biotransformation, the EFs of both 4-OH-PCB 95 and 5-OH-PCB 95 changed from racemic (i.e., 0.50) to 0.62 and 0.46, respectively. These transformations generated statistically non-racemic 4,5-diOH-PCB 95, with EFs of 0.53 and 0.58 for 4-OH-PCB 95 and 5-OH-PCB 95 incubations, respectively. Biotransformation of PCBs 91 and 136 also generated 4,5-diOH-PCB 91 and 4,5-diOH-PCB 136, respectively. These in vitro results were consistent with that observed for stereoselective PCB biotransformation by rat liver microsomes and in vivo. Biotransformation interference between two atropisomers of PCB 136 was investigated for the first time in this study. The biotransformation process of (−)-PCB 136 was significantly disrupted by the presence of (+)-PCB 136, but not the other way around. Thus, stereoselective metabolism of chiral PCBs and OH-PCBs by CYPs is a major mechanism for atropisomer composition change of PCBs and their metabolites in the environment, with the degree of composition change dependent, at least in part, on stereoselective interference of atropisomers with each other at the enzyme level. PMID:24060104

Analysis of hydroxylated metabolites of PCBs (OH-PCBs) and other chlorinated phenolic compounds in whole blood from Canadian inuit.

PubMed Central

Sandau, C D; Ayotte, P; Dewailly, E; Duffe, J; Norstrom, R J

2000-01-01

In this study, we identified the main hydroxylated polychlorinated biphenyls (OH-PCBs) and other chlorinated phenolic compounds and we determined their relative concentrations in whole blood from 13 male and 17 female Inuit from northern Quebec, Canada, and from a pooled whole blood sample from southern Quebec. We also determined concentrations of polychlorinated biphenyls (PCBs). Total OH-PCB concentrations were variable among the Inuit samples, ranging over 2 orders of magnitude (0.117-11.6 ng/g whole blood wet weight). These concentrations were equal to and up to 70 times those found for the southern Quebec pooled whole blood sample. Geometric mean concentrations of total OH-PCBs were 1.73 and 1.01 ng/g whole blood for Inuit men and women, respectively, and 0.161 ng/g whole blood for the southern population pool. There are limited data available for comparison, but the levels of OH-PCBs in Inuit are higher than those previously reported in the literature for other populations. There was a significant correlation (p < 0.005) between OH-PCBs and PCBs (r = 0.84) and both correlated significantly (p < 0.005) with age (r = 0.68 and 0.78, respectively). The ratio of OH-PCBs to PCBs was lower in Inuit (0.11) than in the southern Quebec pool (0.33). There is no apparent explanation for the difference. There was considerable variability in the congener pattern of the identified OH-PCBs. The main metabolite, 4-OH-CB109 (4-OH-2,3,3',4', 5-pentachlorobiphenyl), constituted 12-62% of the total OH-PCBs in the samples. Pentachlorophenol (PCP) was the dominant phenolic compound in blood, constituting 46% (geometric mean) of the total quantitated chlorinated phenolic compounds. PCP concentrations in Inuit blood ranged from 0.558 to 7.77 ng/g on a wet weight basis. All but two Inuit samples had lower concentrations than the southern Quebec pool (6.29 ng/g). The possible role of OH-PCBs in mediating PCB-induced adverse effects needs to be investigated further. Images Figure 1 Figure 2 Figure 3 Figure 4 PMID:10903613

Cross-sectional Associations between Exposure to Persistent Organic Pollutants and Leukocyte Telomere Length among U.S. Adults in NHANES, 2001–2002

PubMed Central

Mitro, Susanna D.; Birnbaum, Linda S.; Needham, Belinda L.; Zota, Ami R.

2015-01-01

Background: Exposure to persistent organic pollutants (POPs) such as dioxins, furans, and polychlorinated biphenyls (PCBs) may influence leukocyte telomere length (LTL), a biomarker associated with chronic disease. In vitro research suggests dioxins may bind to the aryl hydrocarbon receptor (AhR) and induce telomerase activity, which elongates LTL. However, few epidemiologic studies have investigated associations between POPs and LTL. Objectives: We examined the association between 18 PCBs, 7 dioxins, and 9 furans and LTL among 1,330 U.S. adults from NHANES 2001–2002. Methods: We created three summed POP metrics based on toxic equivalency factor (TEF), a potency measure including affinity for the AhR: a) non–dioxin-like PCBs (composed of 10 non–dioxin-like PCBs; no AhR affinity and no TEF); b) non-ortho PCBs (composed of 2 non–ortho-substituted PCBs with high TEFs); and c) toxic equivalency (TEQ) (composed of 7 dioxins, 9 furans, 2 non–ortho-substituted PCBs, and 6 mono–ortho-substituted PCBs; weighted by TEF). We tested the association between each metric and LTL using linear regression, adjusting for demographics, blood cell count and distribution, and another metric with a different TEF (i.e., non-ortho PCBs and TEQ adjusted for non–dioxin-like PCBs; non–dioxin-like PCBs adjusted for non-ortho PCBs). Results: In adjusted models, each doubling of serum concentrations of non-ortho PCBs and TEQ was associated with 3.74% (95% CI: 2.10, 5.40) and 5.29% (95% CI: 1.66, 9.05) longer LTLs, respectively. Compared with the lowest quartile, the highest quartile of exposure was associated with 9.16% (95% CI: 2.96, 15.73) and 7.84% (95% CI: –0.53, 16.92) longer LTLs, respectively. Non–dioxin-like PCBs were not associated with LTL. Conclusions: POPs with high TEFs and AhR affinity were associated with longer LTL. Because many dioxin-associated cancers are also associated with longer LTL, these results may provide insight into the mechanisms underlying PCB- and dioxin-related carcinogenesis. Citation: Mitro SD, Birnbaum LS, Needham BL, Zota AR. 2016. Cross-sectional associations between exposure to persistent organic pollutants and leukocyte telomere length among U.S. adults in NHANES, 2001–2002. Environ Health Perspect 124:651–658; http://dx.doi.org/10.1289/ehp.1510187 PMID:26452299

Biological data on PCBs in animals other than man

USGS Publications Warehouse

Stickel, L.F.

1972-01-01

SUMMARY: Polychlorinated biphenyls have become ubiquitous in the world ecosystem in quantities similar to those of DDE. Experimental studies have shown that PCBs have a toxicity to mallards, pheasants, bobwhite quail, coturnix quail, red-winged blackbirds, starlings, cowbirds, and grackles that is of the same order as the toxicity of DDE to these species. Overt signs of poisoning also are similar to those caused by compounds of the DDT group. Toxic effects of DDE and Aroclor 1254 to coturnix chicks were additive, but not synergistic. PCBs containing higher percentages of chlorine are more toxic to birds than those containing lower percentages. PCBs of foreign manufacture contained contaminants to an extent that greatly increased their toxicity. Residues of PCBs in the brains of birds killed by these compounds measure in the hundreds of parts per million. PCBs may have contributed to mortality of some birds in the field. Toxicity to insects of PCBs of different degrees of chlorination is the reverse of the pattern in birds: the lower chlorinations are more toxic to insects. PCBs enhanced the toxicity of dieldrin and DDT to insects. Shrimp are very sensitive to PCBs and most will die as a result of 20-day exposure to a concentration of 5 ppb. PCBs also inhibit shell growth of oysters. Crabs are less sensitive; all accumulate residues to many times the concentrations in the water, and a test with crabs showed that they lost the residues very slowly. Growth of certain species of marine diatoms was experimentally inhibited by PCBs, but algae were not affected. The small marine crustacean, Gammarus, is sensitive to PCBs in concentrations of thousandths to tenths of a part per billion. Exposure to 5 ppb of Aroclor 1254 caused mortality of two species of fish in 14-45 days. Onset of death was delayed and was accompanied by fungus-like lesions. Rainbow trout were quickly killed by terphenyls at 10 ppb under normal oxygen conditions and at 2 ppb with reduced oxygen. Metabolic changes of PCBs have been suggested by environmental observations of different isomeric patterns in animals of different trophic levels. Quantitative differences also are pronounced, with magnifications of hundreds to thousands of times. Laboratory studies have shown no metabolic changes of PCBs by crabs and shrimps, minimal changes by fish, and pronounced changes by birds. PCBs induce microsomal enzyme activity in birds. Exposure to PCBs increased the susceptibility of mallard ducklings to duck hepatitis virus. Offspring of pheasants whose parents received high dosages of PCBs made poor choices in visual cliff tests. Egg production and hatching after pipping also were affected. Migratory restlessness was increased in English robins exposed to PCBs. Long-term studies of the reproductive effects of Aroclor 1254 on mallards and bobwhite quail and of Aroclor 1254 plus DDE on quail showed no significant differences from controls. In studies of chickens, however, egg production and hatchability were impaired by high doses of Aroclor 1254 and by low doses of Aroclor 1242. Statistical evaluations of the role that different chemicals may play in thinning eggshells of brown pelicans showed that DDE residues correlate better with shell thinning than do residues of dieldrin or PCBs, confirming observations with cormorants and white pelicans.

The Air Force Geophysics Laboratory Standalone Data Acquisition System: A Functional Description.

DTIC Science & Technology

1980-10-09

the board are a buffer for the RUN/HALT front panel switch and a retriggerable oneshot multivibrator. This latter circuit senses the SRUN pulse train...recording on the data tapes, and providing the master timing source for data acquisition. An Electronic Research Company (ERC) model 2446 digital...the computer is fed to a retriggerable oneshot multivibrator on the board. (SRUN consists of a pulse train that is present when the computer is running

Contract Quality Assurance and Pricing Practices for Patriot Missile Procurements

DTIC Science & Technology

1995-06-26

The audit objectives were to evaluate DoD and Raytheon quality assurance and pricing practices for Patriot missile circuit boards. We also evaluated the management control program as it applied to the audit objectives.

Anvil for Flaring PCB Guide Pins

NASA Technical Reports Server (NTRS)

Winn, E.; Turner, R.

1985-01-01

Spring-loaded anvil results in fewer fractured pins. New anvil for flaring guide pins in printed-circuit boards absorbs approximately 80 percent of press force. As result fewer pins damaged, and work output of flaring press greatly increased.

Apple's Macintosh.

ERIC Educational Resources Information Center

Miller, Michael J.

1984-01-01

Description of the Macintosh personal, educational, and business computer produced by Apple covers cost; physical characteristics including display devices, circuit boards, and built-in features; company-produced software; third-party produced software; memory and storage capacity; word-processing features; and graphics capabilities. (MBR)

Integrated bioleaching of copper metal from waste printed circuit board-a comprehensive review of approaches and challenges.

PubMed

Awasthi, Abhishek Kumar; Zeng, Xianlai; Li, Jinhui

2016-11-01

Waste electrical and electronic equipment (e-waste) is the most rapidly growing waste stream in the world, and the majority of the residues are openly disposed of in developing countries. Waste printed circuit boards (WPCBs) make up the major portion of e-waste, and their informal recycling can cause environmental pollution and health risks. Furthermore, the conventional disposal and recycling techniques-mechanical treatments used to recover valuable metals, including copper-are not sustainable in the long term. Chemical leaching is rapid and efficient but causes secondary pollution. Bioleaching is a promising approach, eco-friendly and economically feasible, but it is slower process. This review considers the recycling potential of microbes and suggests an integrated bioleaching approach for Cu extraction and recovery from WPCBs. The proposed recycling system should be more effective, efficient and both technically and economically feasible.

3-D Packaging: A Technology Review

NASA Technical Reports Server (NTRS)

Strickland, Mark; Johnson, R. Wayne; Gerke, David

2005-01-01

Traditional electronics are assembled as a planar arrangement of components on a printed circuit board (PCB) or other type of substrate. These planar assemblies may then be plugged into a motherboard or card cage creating a volume of electronics. This architecture is common in many military and space electronic systems as well as large computer and telecommunications systems and industrial electronics. The individual PCB assemblies can be replaced if defective or for system upgrade. Some applications are constrained by the volume or the shape of the system and are not compatible with the motherboard or card cage architecture. Examples include missiles, camcorders, and digital cameras. In these systems, planar rigid-flex substrates are folded to create complex 3-D shapes. The flex circuit serves the role of motherboard, providing interconnection between the rigid boards. An example of a planar rigid - flex assembly prior to folding is shown. In both architectures, the interconnection is effectively 2-D.

Waste Printed Circuit Board (PCB) Recycling Techniques.

PubMed

Ning, Chao; Lin, Carol Sze Ki; Hui, David Chi Wai; McKay, Gordon

2017-04-01

With the development of technologies and the change of consumer attitudes, the amount of waste electrical and electronic equipment (WEEE) is increasing annually. As the core part of WEEE, the waste printed circuit board (WPCB) is a dangerous waste but at the same time a rich resource for various kinds of materials. In this work, various WPCB treatment methods as well as WPCB recycling techniques divided into direct treatment (landfill and incineration), primitive recycling technology (pyrometallurgy, hydrometallurgy, biometallurgy and primitive full recovery of NMF-non metallic fraction), and advanced recycling technology (mechanical separation, direct use and modification of NMF) are reviewed and analyzed based on their advantages and disadvantages. Also, the evaluation criteria are discussed including economic, environmental, and gate-to-market ability. This review indicates the future research direction of WPCB recycling should focus on a combination of several techniques or in series recycling to maximize the benefits of process.

Powerful timing generator using mono-chip timers: An application to pulsed nuclear magnetic resonance

NASA Astrophysics Data System (ADS)

Saint-Jalmes, Hervé; Barjhoux, Yves

1982-01-01

We present a 10 line-7 MHz timing generator built on a single board around two LSI timer chips interfaced to a 16-bit microcomputer. Once programmed from the host computer, this device is able to generate elaborate logic sequences on its 10 output lines without further interventions from the CPU. Powerful architecture introduces new possibilities over conventional memory-based timing simulators and word generators. Loop control on a given sequence of events, loop nesting, and various logic combinations can easily be implemented through a software interface, using a symbolic command language. Typical applications of such a device range from development, emulation, and test of integrated circuits, circuit boards, and communication systems to pulse-controlled instrumentation (radar, ultrasonic systems). A particular application to a pulsed Nuclear Magnetic Resonance (NMR) spectrometer is presented, along with customization of the device for generating four-channel radio-frequency pulses and the necessary sequence for subsequent data acquisition.

Ab initio surface properties of Ag-Sn alloys: implications for lead-free soldering.

PubMed

Saleh, Gabriele; Xu, Chen; Sanvito, Stefano

2018-02-07

Ag and Sn are the major components of solder alloys adopted to assemble printed circuit boards. The qualities that make them the alloys of choice for the modern electronic industry are related to their physical and chemical properties. For corrosion resistance and solderability, surface properties are particularly important. Yet, atomic-level information about the surfaces of these alloys is not known. Here we fill this gap by presenting an extensive ab initio investigation of composition, energetics, structure and reactivity of Ag-Sn alloy surfaces. The structure and stability of various surfaces is evaluated, and the main factors determining the energetics of surface formation are uncovered. Oxygen and sulphur chemisorptions are studied and discussed in the framework of corrosion tendency, an important issue for printed circuit boards. Adsorption energy trends are rationalized based on the analysis of structural and electronic features.

A wide-range programmable frequency synthesizer based on a finite state machine filter

NASA Astrophysics Data System (ADS)

Alser, Mohammed H.; Assaad, Maher M.; Hussin, Fawnizu A.

2013-11-01

In this article, an FPGA-based design and implementation of a fully digital wide-range programmable frequency synthesizer based on a finite state machine filter is presented. The advantages of the proposed architecture are that, it simultaneously generates a high frequency signal from a low frequency reference signal (i.e. synthesising), and synchronising the two signals (signals have the same phase, or a constant difference) without jitter accumulation issue. The architecture is portable and can be easily implemented for various platforms, such as FPGAs and integrated circuits. The frequency synthesizer circuit can be used as a part of SERDES devices in intra/inter chip communication in system-on-chip (SoC). The proposed circuit is designed using Verilog language and synthesized for the Altera DE2-70 development board, with the Cyclone II (EP2C35F672C6) device on board. Simulation and experimental results are included; they prove the synthesizing and tracking features of the proposed architecture. The generated clock signal frequency of a range from 19.8 MHz to 440 MHz is synchronized to the input reference clock with a frequency step of 0.12 MHz.

Merging parallel optics packaging and surface mount technologies

NASA Astrophysics Data System (ADS)

Kopp, Christophe; Volpert, Marion; Routin, Julien; Bernabé, Stéphane; Rossat, Cyrille; Tournaire, Myriam; Hamelin, Régis

2008-02-01

Optical links are well known to present significant advantages over electrical links for very high-speed data rate at 10Gpbs and above per channel. However, the transition towards optical interconnects solutions for short and very short reach applications requires the development of innovative packaging solutions that would deal with very high volume production capability and very low cost per unit. Moreover, the optoelectronic transceiver components must be able to move from the edge to anywhere on the printed circuit board, for instance close to integrated circuits with high speed IO. In this paper, we present an original packaging design to manufacture parallel optic transceivers that are surface mount devices. The package combines highly integrated Multi-Chip-Module on glass and usual IC ceramics packaging. The use of ceramic and the development of sealing technologies achieve hermetic requirements. Moreover, thanks to a chip scale package approach the final device exhibits a much minimized footprint. One of the main advantages of the package is its flexibility to be soldered or plugged anywhere on the printed circuit board as any other electronic device. As a demonstrator we present a 2 by 4 10Gbps transceiver operating at 850nm.

Biomonitoring of Non-Dioxin-Like Polychlorinated Biphenyls in Transgenic Arabidopsis Using the Mammalian Pregnane X Receptor System: A Role of Pectin in Pollutant Uptake

PubMed Central

Bao, Lieming; Gao, Chen; Li, Miaomiao; Chen, Yong; Lin, Weiqiang; Yang, Yanjun; Han, Ning; Bian, Hongwu; Zhu, Muyuan; Wang, Junhui

2013-01-01

Polychlorinated biphenyls (PCBs) are persistent organic pollutants damaging to human health and the environment. Techniques to indicate PCB contamination in planta are of great interest to phytoremediation. Monitoring of dioxin-like PCBs in transgenic plants carrying the mammalian aryl hydrocarbon receptor (AHR) has been reported previously. Herein, we report the biomonitoring of non-dioxin-like PCBs (NDL-PCBs) using the mammalian pregnane X receptor (PXR). In the transgenic Arabidopsis designated NDL-PCB Reporter, the EGFP-GUS reporter gene was driven by a promoter containing 18 repeats of the xenobiotic response elements, while PXR and its binding partner retinoid X receptor (RXR) were coexpressed. Results showed that, in live cells, the expression of reporter gene was insensitive to endogenous lignans, carotenoids and flavonoids, but responded to all tested NDL-PCBs in a dose- and time- dependent manner. Two types of putative PCB metabolites, hydroxy- PCBs and methoxy- PCBs, displayed different activation properties. The vascular tissues seemed unable to transport NDL-PCBs, whereas mutation in QUASIMODO1 encoding a 1,4-galacturonosyltransferase led to reduced PCB accumulation in Arabidopsis, revealing a role for pectin in the control of PCB translocation. Taken together, the reporter system may serve as a useful tool to biomonitor the uptake and metabolism of NDL-PCBs in plants. PMID:24236133

A Timer for Synchronous Digital Systems

NASA Technical Reports Server (NTRS)

McKenney, Elizabeth; Irwin, Philip

2003-01-01

The Real-Time Interferometer Control Systems Testbed (RICST) timing board is a VersaModule Eurocard (VME)-based board that can generate up to 16 simultaneous, phase-locked timing signals at a rate defined by the user. It can also generate all seven VME interrupt requests (IRQs). The RICST timing board is suitable mainly for robotic, aerospace, and real-time applications. Several circuit boards on the market are capable of generating periodic IRQs. Most are associated with Global Positioning System (GPS) receivers and Inter Range Instrumentation Group (IRIG) time-code generators, whereas this board uses either an internal VME clock or an externally generated clock signal to synchronize multiple components of the system. The primary advantage of this board is that there is no discernible jitter in the output clock waveforms because the signals are divided down from a high-frequency clock signal instead of being phase-locked from a lower frequency. The primary disadvantage to this board, relative to other periodic-IRQ-generating boards, is that it is more difficult to synchronize the system to wall clock time.

Simultaneous enantioselective separation of polychlorinated biphenyls and their methyl sulfone metabolites by heart-cut MDGC: determination of enantiomeric fractions in fish oils and cow liver samples.

PubMed

Pérez-Fernández, Virginia; Castro-Puyana, María; González, María José; Marina, María Luisa; García, María Ángeles; Gómara, Belén

2012-07-01

The potential of three capillary columns based on β-cyclodextrin (i.e., Chirasil-Dex, BGB-172, and BGB-176SE) has been studied for the simultaneous enantiomeric separation of polychlorinated biphenyls (PCBs) and methylsulfonyl metabolites of PCBs (MeSO(2)-PCBs) employing a heart-cut multidimensional gas chromatographic system (heart-cut MDGC). Among the columns studied, the BGB-176SE capillary column provided the best results, allowing the simultaneous enantioselective resolution of six MeSO(2)-PCBs and six chiral PCBs; the Chirasil-Dex column did not resolve any of the studied MeSO(2)-PCBs; and a poor resolution was obtained for three MeSO(2)-PCBs when the BGB-172 column was employed. The developed method was successfully applied to two fish oil and one cow liver samples commercially available, which showed different enantioselective pattern. PCBs 91 and 176 presented a clear enrichment of the second eluted atropisomer in codfish oil, whereas in fish oil sample, slight enrichment of the first eluted atropisomer of CB45 and the second eluted atropisomer of CB136 were observed. © 2012 Wiley Periodicals, Inc.