Science.gov

Sample records for cleaning packaged semiconductor

  1. Characterization of an oxygen plasma process for cleaning packaged semiconductor devices. Final report

    SciTech Connect

    Adams, B.E.

    1996-11-01

    The purpose of this research was to experimentally determine the operating {open_quotes}window{close_quotes} for an oxygen plasma cleaning process to be used on microelectronics components just prior to wire bonding. The process was being developed to replace one that used vapor degreasing with trichlorotrifluoroethane, an ozone-depleting substance. A Box-Behnken experimental design was used to generate data from which the oxygen plasma cleaning process could be characterized. Auger electron spectrophotometry was used to measure the contamination thickness on the dice after cleaning. An empirical equation correlating the contamination thickness on the die surface with the operating parameters of the plasma system was developed from the collected Auger data, and optimum settings for cleaning semiconductor devices were determined. Devices were also tested for undesirable changes in electrical parameters resulting from cleaning in the plasma system. An increase in leakage current occurred for bipolar transistors and diodes after exposure to the oxygen plasma. Although an increase in leakage current occurred, each device`s parameter remained well below the acceptable specification limit. Based upon the experimental results, the optimum settings for the plasma cleaning process were determined to be 200 watts of power applied for five minutes in an enclosure maintained at 0.7 torr. At these settings, all measurable contamination was removed without compromising the reliability of the devices.

  2. Space station power semiconductor package

    NASA Technical Reports Server (NTRS)

    Balodis, Vilnis; Berman, Albert; Devance, Darrell; Ludlow, Gerry; Wagner, Lee

    1987-01-01

    A package of high-power switching semiconductors for the space station have been designed and fabricated. The package includes a high-voltage (600 volts) high current (50 amps) NPN Fast Switching Power Transistor and a high-voltage (1200 volts), high-current (50 amps) Fast Recovery Diode. The package features an isolated collector for the transistors and an isolated anode for the diode. Beryllia is used as the isolation material resulting in a thermal resistance for both devices of .2 degrees per watt. Additional features include a hermetical seal for long life -- greater than 10 years in a space environment. Also, the package design resulted in a low electrical energy loss with the reduction of eddy currents, stray inductances, circuit inductance, and capacitance. The required package design and device parameters have been achieved. Test results for the transistor and diode utilizing the space station package is given.

  3. Reliability of Semiconductor Laser Packaging in Space Applications

    NASA Technical Reports Server (NTRS)

    Gontijo, Ivair; Qiu, Yueming; Shapiro, Andrew A.

    2008-01-01

    A typical set up used to perform lifetime tests of packaged, fiber pigtailed semiconductor lasers is described, as well as tests performed on a set of four pump lasers. It was found that two lasers failed after 3200, and 6100 hours under device specified bias conditions at elevated temperatures. Failure analysis of the lasers indicates imperfections and carbon contamination of the laser metallization, possibly from improperly cleaned photo resist. SEM imaging of the front facet of one of the lasers, although of poor quality due to the optical fiber charging effects, shows evidence of catastrophic damage at the facet. More stringent manufacturing controls with 100% visual inspection of laser chips are needed to prevent imperfect lasers from proceeding to packaging and ending up in space applications, where failure can result in the loss of a space flight mission.

  4. Ultraviolet-Ozone Cleaning of Semiconductor Surfaces

    DTIC Science & Technology

    1992-10-01

    cleaning; (b) after UV/ozone cleaning. 4 3. Absorption spectrum of oxygen . 7 4. Absorption spectrum of ozone. 7 5. Schematic drawing of a UV/ozone...A clean glass surface was obtained after 15 hours of exposure to the UV radiation in air. In a vacuum system at 104 torr of oxygen , clean gold... oxygen . It took 60 minutes in 20 torr of oxygen , and no cleaning effect was observed in 1 torr after 60 minutes of cleaning (47). (It should be noted

  5. Ultraviolet-Ozone Cleaning of Semiconductor Surfaces

    DTIC Science & Technology

    1992-01-01

    to the UV radiation in air. In a vacuum system at 10-4 tort of oxygen , clean gold surfaces were produced after about two hours of UV exposure. During...torr of oxygen , and no cleaning effect was observed in 1 torr after 60 minutes of cleaning (46). (It should be noted, however, that the cleaning...source can be used as an "ozone killer." For example, in one cryopumped vacuum system, UV/ozone cleaning was performed in up to 20 torr of oxygen . After

  6. 78 FR 53479 - Certain Laundry and Household Cleaning Products and Related Packaging

    Federal Register 2010, 2011, 2012, 2013, 2014

    2013-08-29

    ... From the Federal Register Online via the Government Publishing Office ] INTERNATIONAL TRADE COMMISSION Certain Laundry and Household Cleaning Products and Related Packaging AGENCY: U.S. International... States after importation of certain laundry and household cleaning products and packaging thereof...

  7. 78 FR 54274 - Certain Laundry and Household Cleaning Products and Related Packaging; Institution of...

    Federal Register 2010, 2011, 2012, 2013, 2014

    2013-09-03

    ... COMMISSION Certain Laundry and Household Cleaning Products and Related Packaging; Institution of... United States after importation of certain laundry and household cleaning products and packaging thereof... Commission institute an investigation and, after the investigation, issue a limited exclusion order and...

  8. Glass, Plastic and Semiconductors: Packaging Techniques for Miniature Optoelectric Components

    SciTech Connect

    Pocha, M.D.; Garrett, H.E.; Patel, R.R.; Jones II, L.M.; Larson, M.C.; Emanuel, M.A.; Bond, S.W.; Deri, R.J.; Drayton, R.F.; Peterson, H.E.; Lowry, M.E.

    1999-12-20

    At Lawrence Livermore National Laboratory, they have extensive experience with the design and development of miniature photonic systems which require novel packaging schemes. Over the years they have developed silicon micro-optical benches to serve as a stable platform for precision mounting of optical and electronic components. They have developed glass ball lenses that can be fabricated in-situ on the microbench substrate. They have modified commercially available molded plastic fiber ribbon connectors (MT) and added thin film multilayer semiconductor coatings to create potentially low-cost wavelength combiners and wavelength selective filters. They have fabricated both vertical-cavity and in-plane semiconductor lasers and amplifiers, and have packaged these and other components into several miniature photonics systems. For example, they have combined the silicon optical bench with standard electronic packaging techniques and the custom-made wavelength-selective filters to develop a four-wavelength wavelength-division-multiplexing transmitter module mounted in a standard 120-pin ceramic PGA package that couples light from several vertical-cavity-surface-emitting-laser arrays into one multimode fiber-ribbon array. The coupling loss can be as low as 2dB, and the transmitters can be operated at over 1.25 GHz. While these systems were not designed for biomedical or environmental applications, the concepts and techniques are general and widely applicable.

  9. The development of ultraviolet-ozone cleaning as a production process in the packaging of integrated circuits

    SciTech Connect

    Garrett, S.E.

    1990-03-01

    Ultraviolet-ozone (UV-ozone) cleaning was implemented as a production process to improve the cleanliness of metallized ceramic parts before a hermetic solder-sealing operation. The UV-ozone cleaning was developed as an in-situ process that maintained a low moisture content in the sealed package. Sealing yields were improved by as much as 30% with this procedure. Seal quality and therefore, reliability, were also increased. Possible detrimental effects caused by UV-ozone cleaning were investigated. In particular, the possibility for silver from the silver-filled epoxy to electromigrate was studied. UV-ozone cleaning was not found to be a factor in this phenomena. Qualification lots were given Electrical, Group B, Group D, and Life Tests to determine if the UV-ozone cleaning had any detrimental effects on the parts' reliability. No detrimental effects were found on standard complementary metal oxide semiconductor technology integrated circuits. Some evidence has shown, however, that the memory retention of both large-scale integrated and discrete silicon nitride oxide semiconductor structures degrade(s) after UV-ozone cleaning. 6 refs., 8 figs., 2 tabs.

  10. The development of ultraviolet-ozone cleaning as a production process in the packaging of integrated circuits

    NASA Astrophysics Data System (ADS)

    Garrett, S. E.

    1990-03-01

    Ultraviolet-ozone (UV-ozone) cleaning was implemented as a production process to improve the cleanliness of metallized ceramic parts before a hermetic solder-sealing operation. The UV-ozone cleaning was developed as an in situ process that maintained a low moisture content in the sealed package. Sealing yields were improved by as much as 30 pct with this procedure. Seal quality and therefore, reliability, were also increased. Possible detrimental effects caused by UV-ozone cleaning were investigated. In particular, the possibility for silver from the silver-filled epoxy to electromigrate was studied. UV-ozone cleaning was not found to be a factor in this phenomena. Qualification lots were given Electrical, Group B, Group D, and Life Tests to determine if the UV-ozone cleaning had any detrimental effects on the parts' reliability. No detrimental effects were found on standard complementary metal oxide semiconductor technology integrated circuits. Some evidence has shown, however, that the memory retention of both large-scale integrated and discrete silicon nitride oxide semiconductor structures degrade(s) after UV-ozone cleaning.

  11. 78 FR 46367 - Certain Laundry and Household Cleaning Products and Related Packaging; Notice of Receipt of...

    Federal Register 2010, 2011, 2012, 2013, 2014

    2013-07-31

    ... COMMISSION Certain Laundry and Household Cleaning Products and Related Packaging; Notice of Receipt of... Laundry and Household Cleaning Products and Related Packaging, DN 2969; the Commission is soliciting comments on any public interest issues raised by the complaint or complainant's filing under section...

  12. 75 FR 447 - In the Matter of Certain Semiconductor Chips With Minimized Chip Package Size and Products...

    Federal Register 2010, 2011, 2012, 2013, 2014

    2010-01-05

    ... Certain Semiconductor Chips With Minimized Chip Package Size and Products Containing Same (III); Notice of... States after importation of certain semiconductor chips with minimized chip package size or products... Semiconductor Corporation of Hsinchu, Taiwan; ProMOS Technologies, Inc. of Hsinchu, Taiwan; Ramaxel...

  13. High-power semiconductor laser array packaged on microchannel cooler using gold-tin soldering technology

    NASA Astrophysics Data System (ADS)

    Wang, Jingwei; Kang, Lijun; Zhang, Pu; Nie, Zhiqiang; Li, Xiaoning; Xiong, Lingling; Liu, Xingsheng

    2012-03-01

    High power semiconductor laser arrays have found increased applications in many fields. In this work, a hard soldering microchannel cooler (HSMCC) technology was developed for packaging high power diode laser array. Numerical simulations of the thermal behavior characteristics of hard solder and indium solder MCC-packaged diode lasers were conducted and analyzed. Based on the simulated results, a series of high power HSMCC packaged diode laser arrays were fabricated and characterized. The test and statistical results indicated that under the same output power the HSMCC packaged laser bar has lower smile and high reliability in comparison with the conventional copper MCC packaged laser bar using indium soldering technology.

  14. REVIEW OF CLEANING SOLUTIONS FOR USE ON COMPONENTS OF THE 9975 SHIPPING PACKAGE

    SciTech Connect

    Daugherty, W.

    2013-09-30

    Several candidate cleaning products have been reviewed for use as a disinfectant on 9975 shipping package components which contain or have contacted mold. Following review of the compatibility of these products with each component, ammonia (ammonium hydroxide diluted to 1.5 wt% concentration) appears compatible with all package components that it might contact. Each of the other candidate products is incompatible with one or more package components. Accordingly, ammonia is recommended for this purpose. It is further recommended that all components which are disinfected be subsequently rinsed with di-ionized or distilled water.

  15. TO packaged 650nm red semiconductor laser with transparent window

    NASA Astrophysics Data System (ADS)

    Xia, Wei; Zhu, Zhen; Li, Peixu; Su, Jian; Zhang, Xin; Xu, Xiangang

    2016-11-01

    Highly uniform solid-phase Zn-diffusion technique was developed to fabricate transparent windows for 650 nm red laser diodes (LDs). The maximum output power was up to 120 mW, which is three times higher than that for LDs without window structure. The LDs showed excellent thermal characteristics and aging reliability with TO-can package. The characteristic temperature was estimated to be 85 K in the temperature range of 25 65 °C. The LDs showed stable operation of 10 mW at a high temperature of 75 °C. After aging test of 2000 h, the elevated operation current was less than 3%, compared to the initial value. The predicted life time was over 10000 h for 10 mW operation at 75 °C.

  16. Aluminum-Scandium: A Material for Semiconductor Packaging

    NASA Astrophysics Data System (ADS)

    Geissler, Ute; Thomas, Sven; Schneider-Ramelow, Martin; Mukhopadhyay, Biswajit; Lang, Klaus-Dieter

    2016-10-01

    A well-known aluminum-scandium (Al-Sc) alloy, already used in lightweight sports equipment, is about to be established for use in electronic packaging. One application for Al-Sc alloy is manufacture of bonding wires. The special feature of the alloy is its ability to harden by precipitation. The new bonding wires with electrical conductivity similar to pure Al wires can be processed on common wire bonders for aluminum wedge/wedge (w/w) bonding. The wires exhibit very fine-grained microstructure. Small Al3Sc particles are the main reason for its high strength and prevent recrystallization and grain growth at higher temperatures (>150°C). After the wire-bonding process, the interface is well closed. Reliability investigations by active power cycling demonstrated considerably improved lifetime compared with pure Al heavy wires. Furthermore, the Al-Sc alloy was sputter-deposited onto silicon wafer to test it as chip metallization in copper (Cu) ball/wedge bonding technology. After deposition, the layers exhibited fine-grained columnar structure and small coherent Al3Sc particles with dimensions of a few nanometers. These particles inhibit softening processes such as Al splashing in fine wire bonding processes and increase the thickness of remnant Al under the copper balls to 85% of the initial thickness.

  17. Standard semiconductor packaging for high-reliability low-cost MEMS applications

    NASA Astrophysics Data System (ADS)

    Harney, Kieran P.

    2005-01-01

    Microelectronic packaging technology has evolved over the years in response to the needs of IC technology. The fundamental purpose of the package is to provide protection for the silicon chip and to provide electrical connection to the circuit board. Major change has been witnessed in packaging and today wafer level packaging technology has further revolutionized the industry. MEMS (Micro Electro Mechanical Systems) technology has created new challenges for packaging that do not exist in standard ICs. However, the fundamental objective of MEMS packaging is the same as traditional ICs, the low cost and reliable presentation of the MEMS chip to the next level interconnect. Inertial MEMS is one of the best examples of the successful commercialization of MEMS technology. The adoption of MEMS accelerometers for automotive airbag applications has created a high volume market that demands the highest reliability at low cost. The suppliers to these markets have responded by exploiting standard semiconductor packaging infrastructures. However, there are special packaging needs for MEMS that cannot be ignored. New applications for inertial MEMS devices are emerging in the consumer space that adds the imperative of small size to the need for reliability and low cost. These trends are not unique to MEMS accelerometers. For any MEMS technology to be successful the packaging must provide the basic reliability and interconnection functions, adding the least possible cost to the product. This paper will discuss the evolution of MEMS packaging in the accelerometer industry and identify the main issues that needed to be addressed to enable the successful commercialization of the technology in the automotive and consumer markets.

  18. Standard semiconductor packaging for high-reliability low-cost MEMS applications

    NASA Astrophysics Data System (ADS)

    Harney, Kieran P.

    2004-12-01

    Microelectronic packaging technology has evolved over the years in response to the needs of IC technology. The fundamental purpose of the package is to provide protection for the silicon chip and to provide electrical connection to the circuit board. Major change has been witnessed in packaging and today wafer level packaging technology has further revolutionized the industry. MEMS (Micro Electro Mechanical Systems) technology has created new challenges for packaging that do not exist in standard ICs. However, the fundamental objective of MEMS packaging is the same as traditional ICs, the low cost and reliable presentation of the MEMS chip to the next level interconnect. Inertial MEMS is one of the best examples of the successful commercialization of MEMS technology. The adoption of MEMS accelerometers for automotive airbag applications has created a high volume market that demands the highest reliability at low cost. The suppliers to these markets have responded by exploiting standard semiconductor packaging infrastructures. However, there are special packaging needs for MEMS that cannot be ignored. New applications for inertial MEMS devices are emerging in the consumer space that adds the imperative of small size to the need for reliability and low cost. These trends are not unique to MEMS accelerometers. For any MEMS technology to be successful the packaging must provide the basic reliability and interconnection functions, adding the least possible cost to the product. This paper will discuss the evolution of MEMS packaging in the accelerometer industry and identify the main issues that needed to be addressed to enable the successful commercialization of the technology in the automotive and consumer markets.

  19. More Efficient Power Conversion for EVs: Gallium-Nitride Advanced Power Semiconductor and Packaging

    SciTech Connect

    2010-02-01

    Broad Funding Opportunity Announcement Project: Delphi is developing power converters that are smaller and more energy efficient, reliable, and cost-effective than current power converters. Power converters rely on power transistors which act like a very precisely controlled on-off switch, controlling the electrical energy flowing through an electrical circuit. Most power transistors today use silicon (Si) semiconductors. However, Delphi is using semiconductors made with a thin layer of gallium-nitride (GaN) applied on top of the more conventional Si material. The GaN layer increases the energy efficiency of the power transistor and also enables the transistor to operate at much higher temperatures, voltages, and power-density levels compared to its Si counterpart. Delphi is packaging these high-performance GaN semiconductors with advanced electrical connections and a cooling system that extracts waste heat from both sides of the device to further increase the device’s efficiency and allow more electrical current to flow through it. When combined with other electronic components on a circuit board, Delphi’s GaN power transistor package will help improve the overall performance and cost-effectiveness of HEVs and EVs.

  20. PRECISION CLEANING OF SEMICONDUCTOR SURFACES USING CARBON DIOXIDE-BASED FLUIDS

    SciTech Connect

    J. RUBIN; L. SIVILS; A. BUSNAINA

    1999-07-01

    The Los Alamos National Laboratory, on behalf of the Hewlett-Packard Company, is conducting tests of a closed-loop CO{sub 2}-based supercritical fluid process, known as Supercritical CO{sub 2} Resist Remover (SCORR). We have shown that this treatment process is effective in removing hard-baked, ion-implanted photoresists, and appears to be fully compatible with metallization systems. We are now performing experiments on production wafers to assess not only photoresist removal, but also residual surface contamination due to particulate and trace metals. Dense-phase (liquid or supercritical) CO{sub 2}, since it is non-polar, acts like an organic solvent and therefore has an inherently high volubility for organic compounds such as oils and greases. Also, dense CO{sub 2} has a low-viscosity and a low dielectric constant. Finally, CO{sub 2} in the liquid and supercritical fluid states can solubilize metal completing agents and surfactants. This combination of properties has interesting implications for the removal not only of organic films, but also trace metals and inorganic particulate. In this paper we discuss the possibility of using CO{sub 2} as a precision-cleaning solvent, with particular emphasis on semiconductor surfaces.

  1. Processing and packaging of semiconductor lasers and optoelectronic devices; Proceedings of the Meeting, Los Angeles, CA, Jan. 20, 21, 1993

    NASA Astrophysics Data System (ADS)

    Temkin, Henryk

    1993-06-01

    Various papers on processing and packaging of semiconductor laser and optoelectronic devices are presented. Individual topics addressed include: buried heterostructure lasers based on InGaAsP/InP, fabrication processes for GaAs-based high-power diode lasers, fast and reliable processing of high-performance InGaAs 0.98 micron laser diodes, 1.3 micron InGaAsP/InP buried-crescent lasers with narrow spread of threshold currents, Si-based laser subassembly for telecommunications, inexpensive packaging techniques of fiber pigtailed laser diodes, high-performance packaging of gigabit data communication optical modules, applications of diamond made by chemical-vapor deposition for semiconductor laser submounts. Also discussed are: packaging of optical interconnect arrays for optical signal processing and computing, coupling 4 W cw from a diode-pumped Nd:YAG laser through a 5-micron-core single-mode fiber, microoptic and microelectronic infrared packaging of vertical-cavity laser arrays, vertical-cavity surface-emitting laser technology, direct contact-type image sensor unit.

  2. Synthesis of a Nano-Silver Metal Ink for Use in Thick Conductive Film Fabrication Applied on a Semiconductor Package

    PubMed Central

    Yung, Lai Chin; Fei, Cheong Choke; Mandeep, JS; Binti Abdullah, Huda; Wee, Lai Khin

    2014-01-01

    The success of printing technology in the electronics industry primarily depends on the availability of metal printing ink. Various types of commercially available metal ink are widely used in different industries such as the solar cell, radio frequency identification (RFID) and light emitting diode (LED) industries, with limited usage in semiconductor packaging. The use of printed ink in semiconductor IC packaging is limited by several factors such as poor electrical performance and mechanical strength. Poor adhesion of the printed metal track to the epoxy molding compound is another critical factor that has caused a decline in interest in the application of printing technology to the semiconductor industry. In this study, two different groups of adhesion promoters, based on metal and polymer groups, were used to promote adhesion between the printed ink and the epoxy molding substrate. The experimental data show that silver ink with a metal oxide adhesion promoter adheres better than silver ink with a polymer adhesion promoter. This result can be explained by the hydroxyl bonding between the metal oxide promoter and the silane grouping agent on the epoxy substrate, which contributes a greater adhesion strength compared to the polymer adhesion promoter. Hypotheses of the physical and chemical functions of both adhesion promoters are described in detail. PMID:24830317

  3. Synthesis of a nano-silver metal ink for use in thick conductive film fabrication applied on a semiconductor package.

    PubMed

    Yung, Lai Chin; Fei, Cheong Choke; Mandeep, Js; Binti Abdullah, Huda; Wee, Lai Khin

    2014-01-01

    The success of printing technology in the electronics industry primarily depends on the availability of metal printing ink. Various types of commercially available metal ink are widely used in different industries such as the solar cell, radio frequency identification (RFID) and light emitting diode (LED) industries, with limited usage in semiconductor packaging. The use of printed ink in semiconductor IC packaging is limited by several factors such as poor electrical performance and mechanical strength. Poor adhesion of the printed metal track to the epoxy molding compound is another critical factor that has caused a decline in interest in the application of printing technology to the semiconductor industry. In this study, two different groups of adhesion promoters, based on metal and polymer groups, were used to promote adhesion between the printed ink and the epoxy molding substrate. The experimental data show that silver ink with a metal oxide adhesion promoter adheres better than silver ink with a polymer adhesion promoter. This result can be explained by the hydroxyl bonding between the metal oxide promoter and the silane grouping agent on the epoxy substrate, which contributes a greater adhesion strength compared to the polymer adhesion promoter. Hypotheses of the physical and chemical functions of both adhesion promoters are described in detail.

  4. Effects of buffered HF cleaning on metal-oxide-semiconductor interface properties of Al2O3/InAs/GaSb structures

    NASA Astrophysics Data System (ADS)

    Nishi, Koichi; Yokoyama, Masafumi; Yokoyama, Haruki; Hoshi, Takuya; Sugiyama, Hiroki; Takenaka, Mitsuru; Takagi, Shinichi

    2015-06-01

    We studied the impact of buffered HF (BHF) cleaning on the interface properties of Al2O3/InAs/GaSb metal-oxide-semiconductor (MOS) structures fabricated by the ex-situ surface cleaning process. The Al2O3/InAs/GaSb MOS structures fabricated with BHF cleaning exhibited lower Dit values than those fabricated with sulfur passivation. In addition, the Al2O3/InAs/GaSb MOS structures fabricated with BHF cleaning were robust with respect to the MOS field-effect transistor fabrication process by using W gate metal with PMA in the 250-300 °C range.

  5. STUDY OF SURFACE PROPERTIES OF ATOMICALLY-CLEAN METALS AND SEMICONDUCTORS.

    DTIC Science & Technology

    photosorptive effects were observed. In cadmium selenide clean (0001)Cd surfaces were prepared whose properties and chemisorptive behavior were similar to those observed on Cd surfaces of cadmium sulfide. (Author)

  6. Synthesis and performance of antifouling and self-cleaning polyethersulfone/graphene oxide composite membrane functionalized with photoactive semiconductor catalyst.

    PubMed

    Dizge, Nadir; Gonuldas, Hakan; Ozay, Yasin; Ates, Hasan; Ocakoglu, Kasim; Harputlu, Ersan; Yildirimcan, Saadet; Unyayar, Ali

    2017-02-01

    This study was performed to synthesize membranes of polyethersulfone (PES) blended with graphene oxide (GO) and PES blended with GO functionalized with photoactive semiconductor catalyst (TiO2 and ZnO). The antifouling and self-cleaning properties of composite membranes were also investigated. The GO was prepared from natural graphite powder by oxidation method at low temperature. TiO2 and ZnO nanopowders were synthesized by anhydrous sol-gel method. The surface of TiO2 and ZnO nanopowders was modified by a surfactant (myristic acid) to obtain a homogeneously dispersed mixture in a solvent, and then GO was functionalized by loading with these metal oxide nanopowders. The PES membranes blended with GO and functionalized GO into the casting solution were prepared via phase inversion method and tested for their antifouling as well as self-cleaning properties. The composite membranes were synthesized as 14%wt. of PES polymer with three different concentrations (0.5, 1.0, and 2.0%wt.) of GO, GO-TiO2, and GO-ZnO. The functionalization of membranes improved hydrophilicity property of membranes as compared to neat PES membrane. However, the lowest flux was obtained by functionalized membranes with GO-TiO2. The results showed that functionalized membranes demonstrated better self-cleaning property than neat PES membrane. Moreover, the flux recovery rate of functionalized membranes over five cycles was higher than that of neat membrane.

  7. The role of vacuum bakeout and uv-ozone cleaning in the sealing of IC packages

    SciTech Connect

    Garrett, S.E.

    1988-01-01

    Low production yields were being experienced at an integrated circuit packaging lab operated jointly by the Allied-Signal Albuquerque Microelectronic Operation and the Packaging Technology Division of Sandia National Laboratories. It was suspected that organic contamination of the sealing surfaces was causing the low yields. These low yields were not only undesirable, but also raised questions about the quality of the parts that did pass the yield tests. The reliability of these parts was therefore questionable and efforts were taken to improve both the yield and the quality of the hermetic sealing operation.

  8. Assuring ultra-clean environments in microsystem packages : irreversible and reversible getters.

    SciTech Connect

    Zifer, Thomas; Whinnery, LeRoy L., Jr.; Hollenshead, Jeromy Todd; Buffleben, George M.; McElhanon, James Ross; Nilson, Robert H.

    2003-11-01

    A new generation of irreversible, chemically reacting getters specifically targeted toward assuring the integrity of the local environment within microsystem packages were developed and evaluated. These reactive getters incorporate volatile species into a polymer through covalent bonds, thus producing a non-volatile product. These reactive getters will be combined with getters that rely on absorption media (e.g. zeolites and high surface area carbon fibers) to scavenge non-reactive species, like solvents. Our getter systems will rely on device packaging to limit exchange between the microsystem and the global environment. Thus, the internal getters need only provide local environmental control within the microsystem package. A series of experiments were conducted to determine uptake rates and capacities absorption and reactive-based getters. Diffusion rates through the binder used to hold the getter particles together were also investigated. Getters were evaluated in environments with a saturated headspace and with a limited amount of the volatile species of interest. One- and two-dimensional numerical models and analysis techniques have been developed and used to predict the transport of contaminant species within a representative microsystem package consisting of an open gas-filled volume adjacent to a polymer layer containing embedded particles of getter. The two-dimensional model features explicit representation of the individual getter particles while the one-dimensional treatment assumes a homogeneous distribution of getter material within the getterlpolymer layer. Example calculations illustrate the dependence of getter performance on reaction rates, polymer diffusivity, and getter particle volume fraction. In addition, the model is used to deduce surface reaction rates, solid phase diffusivities, and maximum-loading densities by least-squares fitting of model predictions to measured histories of gas-phase contaminant concentration and getter weight gain.

  9. Corrosion Behavior of Copper Thin Films in Organic HF-Containing Cleaning Solution for Semiconductor Applications

    SciTech Connect

    Nabil G. Mistkawi,a,b Makarem A. Hussein,b Malgorzata Ziomek-Moroz,c and Shankar B. Rananavarea,z

    2009-11-13

    The corrosion behavior of electrochemically deposited copper thin films in deaerated and non-deaerated commercial cleaning solutions containing HF was investigated. Potentiodynamic polarization experiments were carried out to determine active, active-passive, passive, and transpassive regions. Corrosion rates were calculated from Tafel slopes. The addition of hydrogen peroxide to the solution and its influence on corrosion was also investigated by employing inductively coupled plasma-mass spectroscopy (ICP-MS) and X-ray photoelectron spectroscopy (XPS). The ICP-MS and potentiodynamic methods yielded comparable Cu dissolution rates. Surface analysis using atomic force microscopy and scanning electron microscopy, performed before and after the cleaning solution treatment, did not reveal any indication of pitting corrosion. The presence of hydrogen peroxide in the cleaning solution led to more than an order of magnitude suppression of copper dissolution rate. We ascribe this phenomenon to the formation of interfacial CuO detected by XPS on the wafer surface that dissolves at a slower rate in dilute HF.

  10. Structural Studies of Clean Semiconductor Surfaces and Metal-Semiconductor Interfaces by Photoemission Extended X-Ray Absorption Fine Structure Spectroscopy.

    NASA Astrophysics Data System (ADS)

    Mangat, Pawitterjit Singh

    We determined the atomic geometries for clean InP(110)-(1 x 1) and Si(111)-(2 x 1) surfaces and Al/InP(110), Ag/InP(110), Bi/InP(110), Na/InP(110) and Al/Si(111) interfaces by photoemission extended x-ray absorption fine structure (PEXAFS) spectroscopy to understand the correlation between electrical Schottky barrier heights and interfacial structure. P 2p PEXAFS for the InP(110) surface and Si 2p PEXAFS for the Si(111) surface were acquired which yielded information on the short range order of substrate atoms on the surface or at the interface. For Al/Si(111) interfaces, we also obtained Al 2p PEXAFS. The data analyzed by Fourier analysis and curve-fitting procedures. The theoretical backscattering phase function of McKale et al. (J. Am. Chem. Soc. 110, 3763 (1988)) and absorber phase function of Teo and Lee (J. Am. Chem. Soc. 101, 2815 (1979)) were used for phase analysis to determine the interatomic bond lengths. For the clean InP(110) surface, we observed surface relaxation. For the Si(111)-(2 x 1) surface, we found 10% contraction in the second near neighborhood Si-Si distance which is not reported in any model. For low coverage reactive metal (Al, Na)/InP(110) interfaces, we observed metal induced surface structural changes which involve removal of relaxation and change in the basis of the surface unit mesh of the substrate. For Ag/InP(110) interfaces, the noble metal atoms were found to remove the relaxation of the first P-In bond length at the interface. These changes in the substrate might bring in interface states within the semiconductor band gap and, consequently, influencing Fermi-level pinning during the Schottky barrier formation. For the Bi/InP(110) interfaces, the relaxation of the clean InP(110) surface is not removed by the deposited Bi atoms. Hence, the Bi/InP(110) interface might not have Fermi-level pinning by interface states due to the interfacial structure of InP. For Al/Si(111) interfaces, the Al atoms do not induce drastic surface

  11. ADVANCED ELECTRONIC PACKAGING TECHNIQUES

    DTIC Science & Technology

    MICROMINIATURIZATION (ELECTRONICS), *PACKAGED CIRCUITS, CIRCUITS, EXPERIMENTAL DATA, MANUFACTURING, NONDESTRUCTIVE TESTING, RESISTANCE (ELECTRICAL), SEMICONDUCTORS, TESTS, THIN FILMS (STORAGE DEVICES), WELDING.

  12. Stress-induced Effects Caused by 3D IC TSV Packaging in Advanced Semiconductor Device Performance

    NASA Astrophysics Data System (ADS)

    Sukharev, V.; Kteyan, A.; Choy, J.-H.; Hovsepyan, H.; Markosian, A.; Zschech, E.; Huebner, R.

    2011-11-01

    Potential challenges with managing mechanical stress and the consequent effects on device performance for advanced 3D through-silicon-via (TSV) based technologies are outlined. The paper addresses the growing need in a simulation-based design verification flow capable to analyze a design of 3D IC stacks and to determine across-die out-of-spec variations in device electrical characteristics caused by the layout and through-silicon-via (TSV)/package-induced mechanical stress. The limited characterization/measurement capabilities for 3D IC stacks and a strict "good die" requirement make this type of analysis critical for the achievement of an acceptable level of functional and parametric yield and reliability. The paper focuses on the development of a design-for-manufacturability (DFM) type of methodology for managing mechanical stresses during a sequence of designs of 3D TSV-based dies, stacks and packages. A set of physics-based compact models for a multi-scale simulation to assess the mechanical stress across the device layers in silicon chips stacked and packaged with the 3D TSV technology is proposed. A calibration technique based on fitting to measured stress components and electrical characteristics of the test-chip devices is presented. A strategy for generation of a simulation feeding data and respective materials characterization approach are proposed, with the goal to generate a database for multi-scale material parameters of wafer-level and package-level structures. For model validation, high-resolution strain measurements in Si channels of the test-chip devices are needed. At the nanoscale, the transmission electron microscopy (TEM) is the only technique available for sub-10 nm strain measurements so far.

  13. Occupational hazards control of hazardous substances in clean room of semiconductor manufacturing plant using CFD analysis.

    PubMed

    Li, Jianfeng; Zhou, Ya-Fei

    2015-02-01

    The manufacturing processes in chip industries are complex, and many kinds of raw materials and solvents of different nature are used, most of which are highly toxic and dangerous. During the machine preventive maintenance period, these toxic and harmful substances will escape from the sealed reaction chamber to the clean workshop environment and endanger the health of the workers on-site, resulting in occupational diseases. From the perspective of prevention, the spread and prediction of hydrochloric acid (HCl) that escaped from the metal-etching chamber during maintenance were studied in this article. The computational fluid dynamics technology was used for a three-dimensional numerical simulation of the indoor air velocity field and the HCl concentration field, and the simulation results were then compared with the on-site monitoring data to verify the correctness and feasibility. The occupational hazards and control measures were analyzed based on the numerical simulation, and the optimal control measure was obtained. In this article, using the method of ambient air to analyze the occupational exposure can provide a new idea to the field of occupational health research in the integrated circuit industry and had theoretical and practical significance.

  14. Surface cleaning for enhanced adhesion to packaging surfaces: Effect of oxygen and ammonia plasma

    SciTech Connect

    Gaddam, Sneha; Dong, Bin; Driver, Marcus; Kelber, Jeffry; Kazi, Haseeb

    2015-03-15

    The effects of direct plasma chemistries on carbon removal from silicon nitride (SiN{sub x}) and oxynitride (SiO{sub x}N{sub y}) surfaces have been studied by in-situ x-ray photoelectron spectroscopy (XPS) and ex-situ contact angle measurements. The data indicate that O{sub 2} and NH{sub 3} capacitively coupled plasmas are effective at removing adventitious carbon from silicon nitride (SiN{sub x}) and Si oxynitride (SiO{sub x}N{sub y}) surfaces. O{sub 2} plasma treatment results in the formation of a silica overlayer. In contrast, the exposure to NH{sub 3} plasma results in negligible additional oxidation of the SiN{sub x} or SiO{sub x}N{sub y} surface. Ex-situ contact angle measurements show that SiN{sub x} and SiO{sub x}N{sub y} surfaces exposed to oxygen plasma are initially more hydrophilic than surfaces exposed to NH{sub 3} plasma, indicating that the O{sub 2} plasma-induced SiO{sub 2} overlayer is highly reactive toward ambient. At longer ambient exposures (≳10 h), however, surfaces treated by either O{sub 2} or NH{sub 3} plasma exhibit similar steady state contact angles, correlated with rapid uptake of adventitious carbon, as determined by XPS. Surface passivation by exposure to molecular hydrogen prior to ambient exposure significantly retards the increase in contact angle upon exposure to ambient. The results suggest a practical route to enhancing the time available for effective bonding to surfaces in microelectronics packaging applications.

  15. Precision depth measurement of through silicon vias (TSVs) on 3D semiconductor packaging process.

    PubMed

    Jin, Jonghan; Kim, Jae Wan; Kang, Chu-Shik; Kim, Jong-Ahn; Lee, Sunghun

    2012-02-27

    We have proposed and demonstrated a novel method to measure depths of through silicon vias (TSVs) at high speed. TSVs are fine and deep holes fabricated in silicon wafers for 3D semiconductors; they are used for electrical connections between vertically stacked wafers. Because the high-aspect ratio hole of the TSV makes it difficult for light to reach the bottom surface, conventional optical methods using visible lights cannot determine the depth value. By adopting an optical comb of a femtosecond pulse laser in the infra-red range as a light source, the depths of TSVs having aspect ratio of about 7 were measured. This measurement was done at high speed based on spectral resolved interferometry. The proposed method is expected to be an alternative method for depth inspection of TSVs.

  16. SEMICONDUCTOR TECHNOLOGY A new cleaning process for the metallic contaminants on a post-CMP wafer's surface

    NASA Astrophysics Data System (ADS)

    Baohong, Gao; Yuling, Liu; Chenwei, Wang; Yadong, Zhu; Shengli, Wang; Qiang, Zhou; Baimei, Tan

    2010-10-01

    This paper presents a new cleaning process using boron-doped diamond (BDD) film anode electrochemical oxidation for metallic contaminants on polished silicon wafer surfaces. The BDD film anode electrochemical oxidation can efficiently prepare pyrophosphate peroxide, pyrophosphate peroxide can oxidize organic contaminants, and pyrophosphate peroxide is deoxidized into pyrophosphate. Pyrophosphate, a good complexing agent, can form a metal complex, which is a structure consisting of a copper ion, bonded to a surrounding array of two pyrophosphate anions. Three polished wafers were immersed in the 0.01 mol/L CuSO4 solution for 2 h in order to make comparative experiments. The first one was cleaned by pyrophosphate peroxide, the second by RCA (Radio Corporation of America) cleaning, and the third by deionized (DI) water. The XPS measurement result shows that the metallic contaminants on wafers cleaned by the RCA method and by pyrophosphate peroxide is less than the XPS detection limits of 1 ppm. And the wafer's surface cleaned by pyrophosphate peroxide is more efficient in removing organic carbon residues than RCA cleaning. Therefore, BDD film anode electrochemical oxidation can be used for microelectronics cleaning, and it can effectively remove organic contaminants and metallic contaminants in one step. It also achieves energy saving and environmental protection.

  17. Reliability Assessment and Activation Energy Study of Au and Pd-Coated Cu Wires Post High Temperature Aging in Nanoscale Semiconductor Packaging.

    PubMed

    Gan, C L; Hashim, U

    2013-06-01

    Wearout reliability and high temperature storage life (HTSL) activation energy of Au and Pd-coated Cu (PdCu) ball bonds are useful technical information for Cu wire deployment in nanoscale semiconductor device packaging. This paper discusses the influence of wire type on the wearout reliability performance of Au and PdCu wire used in fine pitch BGA package after HTSL stress at various aging temperatures. Failure analysis has been conducted to identify the failure mechanism after HTSL wearout conditions for Au and PdCu ball bonds. Apparent activation energies (Eaa) of both wire types are investigated after HTSL test at 150 °C, 175 °C and 200 °C aging temperatures. Arrhenius plot has been plotted for each ball bond types and the calculated Eaa of PdCu ball bond is 0.85 eV and 1.10 eV for Au ball bond in 110 nm semiconductor device. Obviously Au ball bond is identified with faster IMC formation rate with IMC Kirkendall voiding while PdCu wire exhibits equivalent wearout and or better wearout reliability margin compare to conventional Au wirebond. Lognormal plots have been established and its mean to failure (t50) have been discussed in this paper.

  18. SEMICONDUCTOR TECHNOLOGY: GaAs surface wet cleaning by a novel treatment in revolving ultrasonic atomization solution

    NASA Astrophysics Data System (ADS)

    Zaijin, Li; Liming, Hu; Ye, Wang; Ye, Yang; Hangyu, Peng; Jinlong, Zhang; Li, Qin; Yun, Liu; Lijun, Wang

    2010-03-01

    A novel process for the wet cleaning of GaAs surface is presented. It is designed for technological simplicity and minimum damage generated within the GaAs surface. It combines GaAs cleaning with three conditions consisting of (1) removal of thermodynamically unstable species and (2) surface oxide layers must be completely removed after thermal cleaning, and (3) a smooth surface must be provided. Revolving ultrasonic atomization technology is adopted in the cleaning process. At first impurity removal is achieved by organic solvents; second NH4OH:H2O2:H2O = 1:1:10 solution and HCl: H2O2:H2O = 1:1:20 solution in succession to etch a very thin GaAs layer, the goal of the step is removing metallic contaminants and forming a very thin oxidation layer on the GaAs wafer surface; NH4OH:H2O = 1:5 solution is used as the removed oxide layers in the end. The effectiveness of the process is demonstrated by the operation of the GaAs wafer. Characterization of the oxide composition was carried out by X-ray photoelectron spectroscopy. Metal-contamination and surface morphology was observed by a total reflection X-ray fluorescence spectroscopy and atomic force microscope. The research results show that the cleaned surface is without contamination or metal contamination. Also, the GaAs substrates surface is very smooth for epitaxial growth using the rotary ultrasonic atomization technology.

  19. Determination of isopropyl-9H-thioxanthen-9-one in packaged beverages by solid-phase extraction clean-up and liquid chromatography with tandem mass spectrometry detection.

    PubMed

    Sun, Cuilian; Chan, Sheot Harn; Lu, Dan; Lee, Hui Min Wendy; Bloodworth, Bosco Chen

    2007-03-02

    A simple method was developed and validated for the trace determination of 2-isopropylthioxanthone (ITX) in packaged drinks. Samples were extracted from the food matrix using acetonitrile:water (60:40, v/v), and further subjected to clean-up and preconcentration using solid-phase extraction prior to analysis by liquid chromatography-tandem mass spectrometry using multiple reaction monitoring (MRM) mode. The use of 2-isopropyl-[(2)H7]thioxanthen-9-one was incorporated into the method as an internal standard. Excellent 3-day interday precision data (RSD 0.72%, n=10), and intraday precision data (RSD 0.52%, n=10) were obtained on a 0.10 microg/L standard solution. Spiked samples (n=8) were used to gauge the accuracy of the method at the concentration levels of 2.5, 100, and 500 microg/kg in food; recoveries ranged from 97.0 to 103.0%. These excellent validation data suggest the exciting possibility of using this method for the determination of low levels of ITX migrating from printed food packaging materials into beverages with a method quantitation limit of 0.50 microg/kg. For the first time, analysis on a range of milk, juice, tea and yoghurt drinks, as well as their respective food packaging materials were performed for comparative studies on their ITX content.

  20. Electrical characteristics and thermal stability of HfO{sub 2} metal-oxide-semiconductor capacitors fabricated on clean reconstructed GaSb surfaces

    SciTech Connect

    Miyata, Noriyuki Mori, Takahiro; Yasuda, Tetsuji; Ohtake, Akihiro; Ichikawa, Masakazu

    2014-06-09

    HfO{sub 2}/GaSb interfaces fabricated by high-vacuum HfO{sub 2} deposition on clean reconstructed GaSb surfaces were examined to explore a thermally stable GaSb metal-oxide-semiconductor structure with low interface-state density (D{sub it}). Interface Sb-O bonds were electrically and thermally unstable, and post-metallization annealing at temperatures higher than 200 °C was required to stabilize the HfO{sub 2}/GaSb interfaces. However, the annealing led to large D{sub it} in the upper-half band gap. We propose that the decomposition products that are associated with elemental Sb atoms act as interface states, since a clear correlation between the D{sub it} and the Sb coverage on the initial GaSb surfaces was observed.

  1. The effects of the Fermi level on ion induced electron emission from chemically and sputter cleaned semiconductors

    NASA Astrophysics Data System (ADS)

    Urrabazo, David; Overzet, Lawrence J.

    2015-09-01

    Plasma interactions with semiconductors comprise a variety of interesting phenomena in addition to etching and deposition. One such phenomenon is the process of low energy ion induced electron emission (IIEE). IIEE has historically been viewed as extremely surface sensitive; but recent measurements have suggested that the IIEE yield from semiconductors, unlike metals, may in fact depend on the sub-surface properties as well. We investigated the effects of the surface and sub-surface properties (doping type, Fermi level, cleanliness level) on the relative IIEE yields from Si and Ge. Our measurements found that the relative IIEE yields did not depend on the doping type to a significant degree independent of the level of cleanliness.

  2. Utilization of Clean and Safe Delivery Service Package of Health Services Extension Program and Associated Factors in Rural Kebeles of Kafa Zone, Southwest Ethiopia

    PubMed Central

    Bayou, Negalign Berhanu; Gacho, Yohannes Haile Michael

    2013-01-01

    Background In Ethiopia, 94% of births take place at home unattended by trained persons. The government introduced an innovative strategy, Health Services Extension Program in 2003. Clean and safe delivery service is a component of maternal and child healthcare package of the program. However, little is known about the status of uptake of the service. This study thus aimed to assess utilization of clean and safe delivery service and associated factors in rural kebeles of Kafa Zone, Ethiopia. Methods A community based cross sectional survey was conducted in rural kebeles of Kefa Zone from January 21st to February 25th, 2009 using a sample of 229 mothers. Kafa Zone is located 465 kilometres away from Addis Ababa to southwest of Ethiopia. Data were collected using a structured questionnaire and analyzed using SPSS for windows version 16. OR and 95% CI were calculated. P< 0.05 was considered statistically significant. Results Utilization of clean and safe delivery service was 43(19%). Women with formal schooling and those who knew at least two danger signs of pregnancy and labor were more likely to use the service than their counterparts; (AOR=5.8, 95% CI=2.1, 16) and (AOR=3.0, 95% CI=2.2, 10.6), respectively. Of 108(47.8%) mothers who had at least one antenatal care visit, 36(33.3%), were not advised about danger signs. Women who had at least one ANC visit and those who were advised about the danger signs of pregnancy and labor appeared to be more likely to use the service than their counterparts; (AOR=6.1, 95% CI=1.9, 21.3), and (AOR=5.4, 95%CI= 1.4, 21.7), respectively. Conclusion Utilization of the service is low and was determined by women's educational status, history of abortion, knowledge of danger signs and antenatal care attendance. Educating women and improving their knowledge about danger signs of pregnancy and labor is recommended. Health extension workers should consider antenatal care visits as opportunities for this purpose. PMID:23950624

  3. A comparison of dose results from the Clean Air Act Assessment Package-1988, personal computer (CAP88-PC), version 3 to previous versions.

    PubMed

    Rhoads, Kathleen; Snyder, Sandra; Staven, Lissa

    2013-08-01

    Computer software packages approved by the U.S. Environmental Protection Agency (U.S. EPA), including CAP88-PC, are used by U.S. Department of Energy (U.S. DOE) sites to demonstrate compliance with the radionuclide air emission standard under the Clean Air Act. CAP88-PC version 3, was approved by the U.S. EPA in February 2006 for use by U.S. DOE facilities. Version 3 incorporates several major changes that have the potential to affect calculated doses relative to calculations using earlier versions. This analysis examined the types and magnitudes of changes to dose estimates for specific radionuclides calculated using the version 3 software compared with the previous versions. For parent radionuclides and for the total dose from radionuclide chains, total effective dose calculated with version 3 was compared to effective dose equivalent calculated with previous versions. Various comparisons were also performed to determine which of the updates in version 3 accounted for changes in overall dose estimates. CAP88-PC version 3 would produce substantially different results relative to previous versions of the code for a number of radionuclides, including some isotopes that may be present at U.S. DOE facilities, as well as those used for industrial and medical applications. In general, doses for many radionuclides were lower using version 3 but doses for a few key radionuclides increased relative to the previous versions.

  4. Health-related external cost assessment in Europe: methodological developments from ExternE to the 2013 Clean Air Policy Package.

    PubMed

    van der Kamp, Jonathan; Bachmann, Till M

    2015-03-03

    "Getting the prices right" through internalizing external costs is a guiding principle of environmental policy making, one recent example being the EU Clean Air Policy Package released at the end of 2013. It is supported by impact assessments, including monetary valuation of environmental and health damages. For over 20 years, related methodologies have been developed in Europe in the Externalities of Energy (ExternE) project series and follow-up activities. In this study, we aim at analyzing the main methodological developments over time from the 1990s until today with a focus on classical air pollution-induced human health damage costs. An up-to-date assessment including the latest European recommendations is also applied. Using a case from the energy sector, we identify major influencing parameters: differences in exposure modeling and related data lead to variations in damage costs of up to 21%; concerning risk assessment and monetary valuation, differences in assessing long-term exposure mortality risks together with assumptions on particle toxicity explain most of the observed changes in damage costs. These still debated influencing parameters deserve particular attention when damage costs are used to support environmental policy making.

  5. A COMPARISON OF DOSE RESULTS FROM THE CLEAN AIR ACT ASSESSMENT PACKAGE-1988, PERSONAL COMPUTER (CAP88-PC), VERSION 3 TO PREVIOUS VERSIONS

    SciTech Connect

    Rhoads, Kathleen; Snyder, Sandra F.; Staven, Lissa H.

    2013-08-01

    EPA-approved computer software packages, including CAP88-PC, are used by Department of Energy sites to demonstrate compliance with the radionuclide air emission standard under the Clean Air Act. The most recent update, CAP88-PC version 3, was approved by EPA in February 2006 for use by Department of Energy facilities. Version 3 incorporates several major changes that have the potential to affect calculated doses relative to calculations using earlier versions. This analysis examined the types and magnitudes of changes to dose estimates for specific radionuclides calculated using the version 3 software compared with the previous versions. Total effective dose calculated with version 3 was compared to effective dose equivalent calculated with previous versions for parent radionuclides and for the total dose from radionuclide chains. Various comparisons were also performed to determine which of the updates in version 3 accounted for changes in overall dose estimates. CAP88-PC version 3 would produce substantially different results relative to previous versions of the code for a number of radionuclides, including some isotopes that may be present at Department of Energy facilities, as well as those used for industrial and medical applications. In general, doses for many radionuclides are lower using version 3 but doses for a few key radionuclides would be higher.

  6. Hose- and Tube-Cleaning Module

    NASA Technical Reports Server (NTRS)

    Rollins, F. P.; Glass, J. S.

    1986-01-01

    Self-contained, single-use module enables hose or tube to be cleaned thoroughly in field, in one operation, using water of unknown or questionable quality. Previously, chemicals for flow cleaning had to be mixed, diluted and pumped through tubes and hoses in many successive steps; deionizers, water-treatment facilities, and chemical storage required. With proposed device cleaning performed safely, without special training. Ready to use, device packaged as cleaning kit with tube to be cleaned.

  7. Semiconductor heterostructure

    NASA Technical Reports Server (NTRS)

    Hovel, Harold John (Inventor); Woodall, Jerry MacPherson (Inventor)

    1978-01-01

    A technique for fabricating a semiconductor heterostructure by growth of a ternary semiconductor on a binary semiconductor substrate from a melt of the ternary semiconductor containing less than saturation of at least one common ingredient of both the binary and ternary semiconductors wherein in a single temperature step the binary semiconductor substrate is etched, a p-n junction with specific device characteristics is produced in the binary semiconductor substrate by diffusion of a dopant from the melt and a region of the ternary semiconductor of precise conductivity type and thickness is grown by virtue of a change in the melt characteristics when the etched binary semiconductor enters the melt.

  8. Semiconductor structure

    NASA Technical Reports Server (NTRS)

    Hovel, Harold J. (Inventor); Woodall, Jerry M. (Inventor)

    1979-01-01

    A technique for fabricating a semiconductor heterostructure by growth of a ternary semiconductor on a binary semiconductor substrate from a melt of the ternary semiconductor containing less than saturation of at least one common ingredient of both the binary and ternary semiconductors wherein in a single temperature step the binary semiconductor substrate is etched, a p-n junction with specific device characteristics is produced in the binary semiconductor substrate by diffusion of a dopant from the melt and a region of the ternary semiconductor of precise conductivity type and thickness is grown by virtue of a change in the melt characteristics when the etched binary semiconductor enters the melt.

  9. Integration of a nonmetallic electrostatic precipitator and a wet scrubber for improved removal of particles and corrosive gas cleaning in semiconductor manufacturing industries.

    PubMed

    Kim, Hak-Joon; Han, Bangwoo; Kim, Yong-Jin; Yoa, Seok-Jun; Oda, Tetsuji

    2012-08-01

    To remove particles in corrosive gases generated by semiconductor industries, we have developed a novel non-metallic, two-stage electrostatic precipitator (ESP). Carbon brush electrodes and grounded carbon fiber-reinforced polymer (CFRP) form the ionization stage, and polyvinyl chloride collection plates are used in the collection stage of the ESP The collection performance of the ESP downstream of a wet scrubber was evaluated with KC1, silica, and mist particles (0.01-10 pm), changing design and operation parameters such as the ESP length, voltage, and flow rate. A long-term and regeneration performance (12-hr) test was conducted at the maximum operation conditions of the scrubber and ESP and the performance was then demonstrated for 1 month with exhaust gases from wet scrubbers at the rooftop of a semiconductor manufacturing plant in Korea. The results showed that the electrical and collection performance of the ESP (16 channels, 400x400 mm2) was maintained with different grounded plate materials (stainless steel and CFRP) and different lengths of the ionization stage. The collection efficiency of the ESP at high air velocity was enhanced with increases in applied voltages and collection plate lengths. The ESP (16 channels with 100 mm length, 400x400 mm2x540 mm with a 10-mm gap) removed more than 90% of silica and mistparticles with 10 and 12 kV applied to the ESPat the air velocity of 2 m/s and liquid-to-gas ratio of 3.6 L/m3. Decreased performance after 13 hours ofcontinuous operation was recovered to the initial performance level by 5 min of water washing. Moreover during the 1-month operation at the demonstration site, the ESP showed average collection efficiencies of 97% based on particle number and 92% based on total particle mass, which were achieved with a much smaller specific corona power of 0.28 W/m3/hr compared with conventional ESPs.

  10. Plasma Cleaning

    NASA Technical Reports Server (NTRS)

    Hintze, Paul E.

    2016-01-01

    NASA's Kennedy Space Center has developed two solvent-free precision cleaning techniques: plasma cleaning and supercritical carbon dioxide (SCCO2), that has equal performance, cost parity, and no environmental liability, as compared to existing solvent cleaning methods.

  11. High-performance semiconductor optical amplifier array for self-aligned packaging using Si V-groove flip-chip technique

    NASA Astrophysics Data System (ADS)

    Leclerc, D.; Brosson, P.; Pommereau, F.; Ngo, R.; Doussiere, P.; Mallecot, F.; Gavignet, P.; Wamsler, I.; Laube, G.; Hunziker, W.

    1995-05-01

    A high performance four-tilted stripe semiconductor optical amplifier array, with low polarization sensitivity and very low-gain ripple, compatible with self-aligned flip-chip mounting on a Si motherboard is reported. Up to 32 dB of internal gain with 2-dB polarization sensitivity is obtained. A multifiber module has been realized, following an almost static optical alignment procedure, showing no degradation of the SOA array performances. Fiber-to-fiber gain, measured on the four stripes, is 14.4 +/- 1.3 dB with a gain ripple below +/- 0.1 dB.

  12. Low interface defect density of atomic layer deposition BeO with self-cleaning reaction for InGaAs metal oxide semiconductor field effect transistors

    SciTech Connect

    Shin, H. S.; Yum, J. H.; Johnson, D. W.; Harris, H. R.; Hudnall, Todd W.; Oh, J.; Kirsch, P.; Wang, W.-E.; Bielawski, C. W.; Banerjee, S. K.; Lee, J. C.; Lee, H. D.

    2013-11-25

    In this paper, we discuss atomic configuration of atomic layer deposition (ALD) beryllium oxide (BeO) using the quantum chemistry to understand the theoretical origin. BeO has shorter bond length, higher reaction enthalpy, and larger bandgap energy compared with those of ALD aluminum oxide. It is shown that the excellent material properties of ALD BeO can reduce interface defect density due to the self-cleaning reaction and this contributes to the improvement of device performance of InGaAs MOSFETs. The low interface defect density and low leakage current of InGaAs MOSFET were demonstrated using X-ray photoelectron spectroscopy and the corresponding electrical results.

  13. Cleaning Up.

    ERIC Educational Resources Information Center

    Walker, John

    2002-01-01

    Offers strategies to make schools' cleaning operations run more smoothly. Discusses how to estimate the amount of space that needs cleaning and how long it should take, the benefits of team cleaning versus zone cleaning, and the importance of monitoring complaints and overtime to ensure staff is performing efficiently. (EV)

  14. Development of a magnetic liquid seal for clean robots

    NASA Astrophysics Data System (ADS)

    Mizumoto, M.; Inoue, H.

    1987-03-01

    A magnetic liquid seal is developed for clean robots used in semiconductor producing factories. This seal is made of a O-ring type elastic magnet in which magnetic liquid is attracted to the magnet directly. The results of experimental tests prove that the newly developed seal affords reliable sealing performance for clean robots in a cleanness class of 10 or less.

  15. Advances in high power semiconductor diode lasers

    NASA Astrophysics Data System (ADS)

    Ma, Xiaoyu; Zhong, Li

    2008-03-01

    High power semiconductor lasers have broad applications in the fields of military and industry. Recent advances in high power semiconductor lasers are reviewed mainly in two aspects: improvements of diode lasers performance and optimization of packaging architectures of diode laser bars. Factors which determine the performance of diode lasers, such as power conversion efficiency, temperature of operation, reliability, wavelength stabilization etc., result from a combination of new semiconductor materials, new diode structures, careful material processing of bars. The latest progress of today's high-power diode lasers at home and abroad is briefly discussed and typical data are presented. The packaging process is of decisive importance for the applicability of high-power diode laser bars, not only technically but also economically. The packaging techniques include the material choosing and the structure optimizing of heat-sinks, the bonding between the array and the heat-sink, the cooling and the fiber coupling, etc. The status of packaging techniques is stressed. There are basically three different diode package architectural options according to the integration grade. Since the package design is dominated by the cooling aspect, different effective cooling techniques are promoted by different package architectures and specific demands. The benefit and utility of each package are strongly dependent upon the fundamental optoelectronic properties of the individual diode laser bars. Factors which influence these properties are outlined and comparisons of packaging approaches for these materials are made. Modularity of package for special application requirements is an important developing tendency for high power diode lasers.

  16. 49 CFR 174.57 - Cleaning cars.

    Code of Federal Regulations, 2013 CFR

    2013-10-01

    ... 49 Transportation 2 2013-10-01 2013-10-01 false Cleaning cars. 174.57 Section 174.57... and Loading Requirements § 174.57 Cleaning cars. All hazardous material which has leaked from a package in any rail car or on other railroad property must be carefully removed....

  17. 49 CFR 174.57 - Cleaning cars.

    Code of Federal Regulations, 2011 CFR

    2011-10-01

    ... 49 Transportation 2 2011-10-01 2011-10-01 false Cleaning cars. 174.57 Section 174.57... and Loading Requirements § 174.57 Cleaning cars. All hazardous material which has leaked from a package in any rail car or on other railroad property must be carefully removed....

  18. 49 CFR 174.57 - Cleaning cars.

    Code of Federal Regulations, 2012 CFR

    2012-10-01

    ... 49 Transportation 2 2012-10-01 2012-10-01 false Cleaning cars. 174.57 Section 174.57... and Loading Requirements § 174.57 Cleaning cars. All hazardous material which has leaked from a package in any rail car or on other railroad property must be carefully removed....

  19. 49 CFR 174.57 - Cleaning cars.

    Code of Federal Regulations, 2014 CFR

    2014-10-01

    ... 49 Transportation 2 2014-10-01 2014-10-01 false Cleaning cars. 174.57 Section 174.57... and Loading Requirements § 174.57 Cleaning cars. All hazardous material which has leaked from a package in any rail car or on other railroad property must be carefully removed....

  20. 49 CFR 174.57 - Cleaning cars.

    Code of Federal Regulations, 2010 CFR

    2010-10-01

    ... 49 Transportation 2 2010-10-01 2010-10-01 false Cleaning cars. 174.57 Section 174.57... and Loading Requirements § 174.57 Cleaning cars. All hazardous material which has leaked from a package in any rail car or on other railroad property must be carefully removed....

  1. Clean then Assemble Versus Assemble then Clean: Several Comparisons

    NASA Technical Reports Server (NTRS)

    Welker, Roger W.

    2004-01-01

    Cleanliness of manufactured parts and assemblies is a significant issue in many industries including disk drives, semiconductors, aerospace, and medical devices. Clean manufacturing requires cleanroom floor space and cleaning technology that are both expensive to own and expensive to operate. Strategies to reduce these costs are an important consideration. One strategy shown to be effective at reducing costs is to assemble parts into subassemblies and then clean the subassembly, rather than clean the individual parts first and then assemble them. One advantage is that assembly outside of the cleanroom reduces the amount of cleanroom floor space and its associated operating cost premium. A second advantage is that this strategy reduces the number of individual parts that must be cleaned prior to assembly, reducing the number of cleaning baskets, handling and, possibly, reducing the number of cleaners. The assemble then clean strategy also results in a part that is significantly cleaner because contamination generated during the assembly steps are more effectively removed that normally can be achieved by hand wiping after assembly in the cleanroom.

  2. Clean Room Apparel

    NASA Technical Reports Server (NTRS)

    1989-01-01

    American Hospital Supply Corporation (AHSC), Baxter Healthcare Corporation's predecessor, used the NASA informational base on contamination control technology to improve industrial contamination control technology. When a study determined that microscopic body particles escaping through tiny "windows" in woven garments worn by workers were the greatest source of contamination, AHSC developed TYVEK. This non-woven material filters 99% of all particulate matter larger than half a micron. Baxter Healthcare added a polyimide coating which seals and ties down any loose fibers, providing greater durability. Stress points along seams have been minimized to make the garment almost tearproof. Micro-Clean 212 garments are individually packaged and disposable.

  3. Clean Diesel

    EPA Pesticide Factsheets

    The Clean Diesel Program offers DERA funding in the form of grants and rebates as well as other support for projects that protect human health and improve air quality by reducing harmful emissions from diesel engines.

  4. Microwave semiconductor devices

    NASA Astrophysics Data System (ADS)

    Sitch, J. E.

    1985-03-01

    The state of the art of microwave semiconductor design is reviewed, with emphasis on developments of the past 10-12 years. Consideration is given to: varistor diodes; varactor diodes; and transit time negative diodes. The design principles of bipolar and unipolar transistors are discussed, with reference to power FETs, traveling-wave FETs, and camel or planar-doped barrier transistors. Recent innovations in the field of fabrication technology are also considered, including: crystal growth; doping; and packaging. Several schematic drawings and photographs of the different devices are provided.

  5. Semiconductor sensors

    NASA Technical Reports Server (NTRS)

    Gatos, Harry C. (Inventor); Lagowski, Jacek (Inventor)

    1977-01-01

    A semiconductor sensor adapted to detect with a high degree of sensitivity small magnitudes of a mechanical force, presence of traces of a gas or light. The sensor includes a high energy gap (i.e., .about. 1.0 electron volts) semiconductor wafer. Mechanical force is measured by employing a non-centrosymmetric material for the semiconductor. Distortion of the semiconductor by the force creates a contact potential difference (cpd) at the semiconductor surface, and this cpd is determined to give a measure of the force. When such a semiconductor is subjected to illumination with an energy less than the energy gap of the semiconductors, such illumination also creates a cpd at the surface. Detection of this cpd is employed to sense the illumination itself or, in a variation of the system, to detect a gas. When either a gas or light is to be detected and a crystal of a non-centrosymmetric material is employed, the presence of gas or light, in appropriate circumstances, results in a strain within the crystal which distorts the same and the distortion provides a mechanism for qualitative and quantitative evaluation of the gas or the light, as the case may be.

  6. Semiconductor photoelectrochemistry

    NASA Technical Reports Server (NTRS)

    Buoncristiani, A. M.; Byvik, C. E.

    1983-01-01

    Semiconductor photoelectrochemical reactions are investigated. A model of the charge transport processes in the semiconductor, based on semiconductor device theory, is presented. It incorporates the nonlinear processes characterizing the diffusion and reaction of charge carriers in the semiconductor. The model is used to study conditions limiting useful energy conversion, specifically the saturation of current flow due to high light intensity. Numerical results describing charge distributions in the semiconductor and its effects on the electrolyte are obtained. Experimental results include: an estimate rate at which a semiconductor photoelectrode is capable of converting electromagnetic energy into chemical energy; the effect of cell temperature on the efficiency; a method for determining the point of zero zeta potential for macroscopic semiconductor samples; a technique using platinized titanium dioxide powders and ultraviolet radiation to produce chlorine, bromine, and iodine from solutions containing their respective ions; the photoelectrochemical properties of a class of layered compounds called transition metal thiophosphates; and a technique used to produce high conversion efficiency from laser radiation to chemical energy.

  7. Packaged bulk micromachined triglyceride biosensor

    NASA Astrophysics Data System (ADS)

    Mohanasundaram, S. V.; Mercy, S.; Harikrishna, P. V.; Rani, Kailash; Bhattacharya, Enakshi; Chadha, Anju

    2010-02-01

    Estimation of triglyceride concentration is important for the health and food industries. Use of solid state biosensors like Electrolyte Insulator Semiconductor Capacitors (EISCAP) ensures ease in operation with good accuracy and sensitivity when compared to conventional sensors. In this paper we report on packaging of miniaturized EISCAP sensors on silicon. The packaging involves glass to silicon bonding using adhesive. Since this kind of packaging is done at room temperature, it cannot damage the thin dielectric layers on the silicon wafer unlike the high temperature anodic bonding technique and can be used for sensors with immobilized enzyme without denaturing the enzyme. The packaging also involves a teflon capping arrangement which helps in easy handling of the bio-analyte solutions. The capping solves two problems. Firstly, it helps in the immobilization process where it ensures the enzyme immobilization happens only on one pit and secondly it helps with easy transport of the bio-analyte into the sensor pit for measurements.

  8. Cleaning devices

    NASA Technical Reports Server (NTRS)

    Schneider, Horst W. (Inventor)

    1981-01-01

    Cleaning devices are described which include a vacuum cleaner nozzle with a sharp rim for directing incoming air down against the floor; a vacuum cleaner wherein electrostatically charged brushes that brush dirt off a floor, are electrically grounded to remove charges that could tend to hold dirt to the brushes; a vacuum cleaner head having slots that form a pair of counter-rotating vortices, and that includes an outlet that blows a stream of air at the floor region which lies between the vortices; a cleaning device that sweeps a group of brushes against the ground along a first direction, and then sweeps them along the same ground area but in a second direction angled from the first by an amount such as 90.degree., to sweep up particles lying in crevices extending along any direction; a device that gently cleans a surface to remove bacteria for analysis, including an inclined wall along which cleaning fluid flows onto the surface, a vacuum chamber for drawing in the cleaning fluid, and a dividing wall spaced slightly from the surface to separate the fluid source from the vacuum cleaner chamber; and a device for providing pulses of pressured air including a chamber to which pressured air is supplied, a ball that circulates around the chamber to repeatedly close an outlet, and an air source that directs air circumferentially to move the ball around the chamber.

  9. Decontamination of Genesis Array Materials by UV Ozone Cleaning

    NASA Astrophysics Data System (ADS)

    Calaway, M. J.; Burnett, D. S.; Rodriguez, M. C.; Sestak, S.; Allton, J. H.; Stansbery, E. K.

    2007-03-01

    XPS and spectroscopic ellipsometry are used to evaluate the effectiveness of UV ozone cleaning for removing a carbon based surface contaminate on silicon and sapphire semiconductor materials from NASA's Genesis solar wind sample return mission.

  10. Precision Cleaning - Path to Premier

    NASA Technical Reports Server (NTRS)

    Mackler, Scott E.

    2008-01-01

    ITT Space Systems Division s new Precision Cleaning facility provides critical cleaning and packaging of aerospace flight hardware and optical payloads to meet customer performance requirements. The Precision Cleaning Path to Premier Project was a 2007 capital project and is a key element in the approved Premier Resource Management - Integrated Supply Chain Footprint Optimization Project. Formerly precision cleaning was located offsite in a leased building. A new facility equipped with modern precision cleaning equipment including advanced process analytical technology and improved capabilities was designed and built after outsourcing solutions were investigated and found lacking in ability to meet quality specifications and schedule needs. SSD cleans parts that can range in size from a single threaded fastener all the way up to large composite structures. Materials that can be processed include optics, composites, metals and various high performance coatings. We are required to provide verification to our customers that we have met their particulate and molecular cleanliness requirements and we have that analytical capability in this new facility. The new facility footprint is approximately half the size of the former leased operation and provides double the amount of throughput. Process improvements and new cleaning equipment are projected to increase 1st pass yield from 78% to 98% avoiding $300K+/yr in rework costs. Cost avoidance of $350K/yr will result from elimination of rent, IT services, transportation, and decreased utility costs. Savings due to reduced staff expected to net $4-500K/yr.

  11. Scoring Package

    National Institute of Standards and Technology Data Gateway

    NIST Scoring Package (PC database for purchase)   The NIST Scoring Package (Special Database 1) is a reference implementation of the draft Standard Method for Evaluating the Performance of Systems Intended to Recognize Hand-printed Characters from Image Data Scanned from Forms.

  12. fsclean: Faraday Synthesis CLEAN imager

    NASA Astrophysics Data System (ADS)

    Bell, M. R.; Ensslin, T. A.

    2015-06-01

    Fsclean produces 3D Faraday spectra using the Faraday synthesis method, transforming directly from multi-frequency visibility data to the Faraday depth-sky plane space. Deconvolution is accomplished using the CLEAN algorithm, and the package includes Clark and Högbom style CLEAN algorithms. Fsclean reads in MeasurementSet visibility data and produces HDF5 formatted images; it handles images and data of arbitrary size, using scratch HDF5 files as buffers for data that is not being immediately processed, and is limited only by available disk space.

  13. 7 CFR 58.413 - Cutting and packaging rooms.

    Code of Federal Regulations, 2011 CFR

    2011-01-01

    ... 7 Agriculture 3 2011-01-01 2011-01-01 false Cutting and packaging rooms. 58.413 Section 58.413....413 Cutting and packaging rooms. When small packages of cheese are cut and wrapped, separate rooms shall be provided for the cleaning and preparation of the bulk cheese and for the cutting and...

  14. Fluidized-Bed Cleaning of Silicon Particles

    NASA Technical Reports Server (NTRS)

    Rohatgi, Naresh K.; Hsu, George C.

    1987-01-01

    Fluidized-bed chemical cleaning process developed to remove metallic impurities from small silicon particles. Particles (250 micrometer in size) utilized as seed material in silane pyrolysis process for production of 1-mm-size silicon. Product silicon (1 mm in size) used as raw material for fabrication of solar cells and other semiconductor devices. Principal cleaning step is wash in mixture of hydrochloric and nitric acids, leaching out metals and carrying them away as soluble chlorides. Particles fluidized by cleaning solution to assure good mixing and uniform wetting.

  15. Cleaning of optical surfaces with photogenerated reactants

    NASA Astrophysics Data System (ADS)

    Hansen, Roger W. C.; Wolske, Jeff; Wallace, Dan; Bissen, Mark

    1994-08-01

    Cleaning of synchrotron radiation optics with photogenerated reactants has several advantages over discharge cleaning methods. In discharge cleaning, reactive species from the discharge must react with contamination on the surface while the surface is shielded from the harsher elements of the discharge which can contaminate or degrade the surface. In contrast, if reactive species can be generated near the surface by photons, the problem of shielding can be eliminated and in some cases higher cleaning rates can be obtained. Different cleaning methods were evaluated by measuring the rates of removal of polymethylmethacrylate films with a thickness monitor. A number of different light sources and geometries were tested. The highest cleaning rates were observed with atmospheric-pressure UV/ozone cleaning. This method has been extensively investigated for cleaning of hydrocarbon contamination from semiconductor surfaces. Our studies indicate that it is also effective in removing the graphite-like contamination from synchrotron radiation optics. Compared to lower pressure methods it is simple, low cost, faster, and more selective. It does require venting of vacuum chambers; however, in many cases optics can be cleaned without demounting, saving considerable time and effort. This method has been used successfully to clean gratings and mirrors in several beamlines.

  16. Automated carbon dioxide cleaning system

    NASA Technical Reports Server (NTRS)

    Hoppe, David T.

    1991-01-01

    Solidified CO2 pellets are an effective blast media for the cleaning of a variety of materials. CO2 is obtained from the waste gas streams generated from other manufacturing processes and therefore does not contribute to the greenhouse effect, depletion of the ozone layer, or the environmental burden of hazardous waste disposal. The system is capable of removing as much as 90 percent of the contamination from a surface in one pass or to a high cleanliness level after multiple passes. Although the system is packaged and designed for manual hand held cleaning processes, the nozzle can easily be attached to the end effector of a robot for automated cleaning of predefined and known geometries. Specific tailoring of cleaning parameters are required to optimize the process for each individual geometry. Using optimum cleaning parameters the CO2 systems were shown to be capable of cleaning to molecular levels below 0.7 mg/sq ft. The systems were effective for removing a variety of contaminants such as lubricating oils, cutting oils, grease, alcohol residue, biological films, and silicone. The system was effective on steel, aluminum, and carbon phenolic substrates.

  17. Polymer Composites for Intelligent Food Packaging

    NASA Astrophysics Data System (ADS)

    He, Jiating; Yap, Ray Chin Chong; Wong, Siew Yee; Li, Xu

    2015-09-01

    Over the last 50 years, remarkable improvements in mechanical and barrier properties of polymer composites have been realized. Their improved properties have been widely studied and employed for food packaging to keep food fresh, clean and suitable for consumption over sufficiently long storage period. In this paper, the current progress of science and technology development of polymer composites for intelligent food packaging will be highlighted. Future directions and perspectives for exploring polymer composites for intelligent food packaging to reveal freshness and quality of food packaged will also be put forward.

  18. Sintered silver joints via controlled topography of electronic packaging subcomponents

    DOEpatents

    Wereszczak, Andrew A.

    2014-09-02

    Disclosed are sintered silver bonded electronic package subcomponents and methods for making the same. Embodiments of the sintered silver bonded EPSs include topography modification of one or more metal surfaces of semiconductor devices bonded together by the sintered silver joint. The sintered silver bonded EPSs include a first semiconductor device having a first metal surface, the first metal surface having a modified topography that has been chemically etched, grit blasted, uniaxial ground and/or grid sliced connected to a second semiconductor device which may also include a first metal surface with a modified topography, a silver plating layer on the first metal surface of the first semiconductor device and a silver plating layer on the first metal surface of the second semiconductor device and a sintered silver joint between the silver plating layers of the first and second semiconductor devices which bonds the first semiconductor device to the second semiconductor device.

  19. Clean catch urine sample

    MedlinePlus

    ... specimen; Urine collection - clean catch; UTI - clean catch; Urinary tract infection - clean catch; Cystitis - clean catch ... LE, Norrby SR. Approach to the patient with urinary tract infection. In: Goldman L, Schafer AI, eds. Goldman-Cecil ...

  20. Chip packaging technique

    NASA Technical Reports Server (NTRS)

    Jayaraj, Kumaraswamy (Inventor); Noll, Thomas E. (Inventor); Lockwood, Harry F. (Inventor)

    2001-01-01

    A hermetically sealed package for at least one semiconductor chip is provided which is formed of a substrate having electrical interconnects thereon to which the semiconductor chips are selectively bonded, and a lid which preferably functions as a heat sink, with a hermetic seal being formed around the chips between the substrate and the heat sink. The substrate is either formed of or includes a layer of a thermoplastic material having low moisture permeability which material is preferably a liquid crystal polymer (LCP) and is a multiaxially oriented LCP material for preferred embodiments. Where the lid is a heat sink, the heat sink is formed of a material having high thermal conductivity and preferably a coefficient of thermal expansion which substantially matches that of the chip. A hermetic bond is formed between the side of each chip opposite that connected to the substrate and the heat sink. The thermal bond between the substrate and the lid/heat sink may be a pinched seal or may be provided, for example by an LCP frame which is hermetically bonded or sealed on one side to the substrate and on the other side to the lid/heat sink. The chips may operate in the RF or microwave bands with suitable interconnects on the substrate and the chips may also include optical components with optical fibers being sealed into the substrate and aligned with corresponding optical components to transmit light in at least one direction. A plurality of packages may be physically and electrically connected together in a stack to form a 3D array.

  1. Seafood Packaging

    NASA Technical Reports Server (NTRS)

    1996-01-01

    NASA's Technology Transfer Office at Stennis Space Center worked with a New Orleans seafood packaging company to develop a container to improve the shipping longevity of seafood, primarily frozen and fresh fish, while preserving the taste. A NASA engineer developed metalized heat resistant polybags with thermal foam liners using an enhanced version of the metalized mylar commonly known as 'space blanket material,' which was produced during the Apollo era.

  2. Packaged Food

    NASA Technical Reports Server (NTRS)

    1976-01-01

    After studies found that many elderly persons don't eat adequately because they can't afford to, they have limited mobility, or they just don't bother, Innovated Foods, Inc. and JSC developed shelf-stable foods processed and packaged for home preparation with minimum effort. Various food-processing techniques and delivery systems are under study and freeze dried foods originally used for space flight are being marketed. (See 77N76140)

  3. Microelectronic device package with an integral window

    DOEpatents

    Peterson, Kenneth A.; Watson, Robert D.

    2002-01-01

    An apparatus for packaging of microelectronic devices, including an integral window. The microelectronic device can be a semiconductor chip, a CCD chip, a CMOS chip, a VCSEL chip, a laser diode, a MEMS device, or a IMEMS device. The package can include a cofired ceramic frame or body. The package can have an internal stepped structure made of one or more plates, with apertures, which are patterned with metallized conductive circuit traces. The microelectronic device can be flip-chip bonded on the plate to these traces, and oriented so that the light-sensitive side is optically accessible through the window. A cover lid can be attached to the opposite side of the package. The result is a compact, low-profile package, having an integral window that can be hermetically-sealed. The package body can be formed by low-temperature cofired ceramic (LTCC) or high-temperature cofired ceramic (HTCC) multilayer processes with the window being simultaneously joined (e.g. cofired) to the package body during LTCC or HTCC processing. Multiple chips can be located within a single package. The cover lid can include a window. The apparatus is particularly suited for packaging of MEMS devices, since the number of handling steps is greatly reduced, thereby reducing the potential for contamination.

  4. Bi-level microelectronic device package with an integral window

    DOEpatents

    Peterson, Kenneth A.; Watson, Robert D.

    2004-01-06

    A package with an integral window for housing a microelectronic device. The integral window is bonded directly to the package without having a separate layer of adhesive material disposed in-between the window and the package. The device can be a semiconductor chip, CCD chip, CMOS chip, VCSEL chip, laser diode, MEMS device, or IMEMS device. The multilayered package can be formed of a LTCC or HTCC cofired ceramic material, with the integral window being simultaneously joined to the package during LTCC or HTCC processing. The microelectronic device can be flip-chip bonded so that the light-sensitive side is optically accessible through the window. The package has at least two levels of circuits for making electrical interconnections to a pair of microelectronic devices. The result is a compact, low-profile package having an integral window that is hermetically sealed to the package prior to mounting and interconnecting the microelectronic device(s).

  5. Clean coal

    SciTech Connect

    Liang-Shih Fan; Fanxing Li

    2006-07-15

    The article describes the physics-based techniques that are helping in clean coal conversion processes. The major challenge is to find a cost- effective way to remove carbon dioxide from the flue gas of power plants. One industrially proven method is to dissolve CO{sub 2} in the solvent monoethanolamine (MEA) at a temperature of 38{sup o}C and then release it from the solvent in another unit when heated to 150{sup o}C. This produces CO{sub 2} ready for sequestration. Research is in progress with alternative solvents that require less energy. Another technique is to use enriched oxygen in place of air in the combustion process which produces CO{sub 2} ready for sequestration. A process that is more attractive from an energy management viewpoint is to gasify coal so that it is partially oxidized, producing a fuel while consuming significantly less oxygen. Several IGCC schemes are in operation which produce syngas for use as a feedstock, in addition to electricity and hydrogen. These schemes are costly as they require an air separation unit. Novel approaches to coal gasification based on 'membrane separation' or chemical looping could reduce the costs significantly while effectively capturing carbon dioxide. 1 ref., 2 figs., 1 photo.

  6. Clean Cities Fact Sheet

    SciTech Connect

    Not Available

    2004-01-01

    This fact sheet explains the Clean Cities Program and provides contact information for all coalitions and regional offices. It answers key questions such as: What is the Clean Cities Program? What are alternative fuels? How does the Clean Cities Program work? What sort of assistance does Clean Cities offer? What has Clean Cities accomplished? What is Clean Cities International? and Where can I find more information?

  7. Reflective Packaging

    NASA Technical Reports Server (NTRS)

    1994-01-01

    The aluminized polymer film used in spacecraft as a radiation barrier to protect both astronauts and delicate instruments has led to a number of spinoff applications. Among them are aluminized shipping bags, food cart covers and medical bags. Radiant Technologies purchases component materials and assembles a barrier made of layers of aluminized foil. The packaging reflects outside heat away from the product inside the container. The company is developing new aluminized lines, express mailers, large shipping bags, gel packs and insulated panels for the building industry.

  8. Tractor Mechanics: Learning Activity Packages 1-19.

    ERIC Educational Resources Information Center

    Clemson Univ., SC. Vocational Education Media Center.

    Learning activity packages are presented for teaching tractor mechanics. The first of two sections deals with miscellaneous tasks and contains learning activity packages on cleaning the tractor and receiving new tractor parts. Section 2 is concerned with maintaining and servicing the electrical system, and it includes the following learning…

  9. Protecting integrated circuits from excessive charge accumulation during plasma cleaning of multichip modules

    SciTech Connect

    Rodenbeck, Christopher T; Girardi, Michael

    2015-04-21

    Internal nodes of a constituent integrated circuit (IC) package of a multichip module (MCM) are protected from excessive charge during plasma cleaning of the MCM. The protected nodes are coupled to an internal common node of the IC package by respectively associated discharge paths. The common node is connected to a bond pad of the IC package. During MCM assembly, and before plasma cleaning, this bond pad receives a wire bond to a ground bond pad on the MCM substrate.

  10. The How To Clean Kit. Making Easier Work of Laundering, Cleaning and Dishwashing.

    ERIC Educational Resources Information Center

    Procter and Gamble Educational Services, Cincinnati, OH.

    This package contains a handbook explaining how to make laundering, cleaning, and dishwashing easier; a guide for using the handbook with secondary students, youth groups, adult groups, and students enrolled in teacher preparatory classes; a set of worksheets designed to reinforce concepts introduced in the guide; and four charts. The following…

  11. Single level microelectronic device package with an integral window

    DOEpatents

    Peterson, Kenneth A.; Watson, Robert D.

    2003-12-09

    A package with an integral window for housing a microelectronic device. The integral window is bonded directly to the package without having a separate layer of adhesive material disposed in-between the window and the package. The device can be a semiconductor chip, CCD chip, CMOS chip, VCSEL chip, laser diode, MEMS device, or IMEMS device. The package can be formed of a multilayered LTCC or HTCC cofired ceramic material, with the integral window being simultaneously joined to the package during cofiring. The microelectronic device can be flip-chip interconnected so that the light-sensitive side is optically accessible through the window. A glob-top encapsulant or protective cover can be used to protect the microelectronic device and electrical interconnections. The result is a compact, low profile package having an integral window that is hermetically sealed to the package prior to mounting and interconnecting the microelectronic device.

  12. Packaging Your Training Materials

    ERIC Educational Resources Information Center

    Espeland, Pamela

    1977-01-01

    The types of packaging and packaging materials to use for training materials should be determined during the planning of the training programs, according to the packaging market. Five steps to follow in shopping for packaging are presented, along with a list of packaging manufacturers. (MF)

  13. Taguchi Experimental Design for Cleaning PWAs with Ball Grid Arrays

    NASA Technical Reports Server (NTRS)

    Bonner, J. K.; Mehta, A.; Walton, S.

    1997-01-01

    Ball grid arrays (BGAs), and other area array packages, are becoming more prominent as a way to increase component pin count while avoiding the manufacturing difficulties inherent in processing quad flat packs (QFPs)...Cleaning printed wiring assemblies (PWAs) with BGA components mounted on the surface is problematic...Currently, a low flash point semi-aqueous material, in conjunction with a batch cleaning unit, is being used to clean PWAs. The approach taken at JPL was to investigate the use of (1) semi-aqueous materials having a high flash point and (2) aqueous cleaning involving a saponifier.

  14. Chemical-free cleaning using excimer lasers

    NASA Astrophysics Data System (ADS)

    Lizotte, Todd E.; O'Keeffe, Terence R.

    1996-04-01

    A critical requirement in many industrial processes is the cleaning of oils and grease, oxides, solvent residues, particles, thin films and other contaminants from surfaces. There is a particularly acute need in the electronics industry for cleaning semiconductor wafers and computer chips and in the metals industry for removing oxides and other contaminants. Cleaning traditionally is done by various wet chemical processes, almost all consuming large amounts of water and producing large amounts of hazardous wastes. To further complicate this, some of these cleaning agents and vast water consumption are undergoing stringent restrictions. The Radiance ProcessSM is a novel, patented Excimer Laser approach to dry surface cleaning. The process has removed particles from 80 microns to submicron sizes, paints, inks, oxides, fingerprints, hazes, parts of molecules and metallic ions in fingerprints. The process does not ablate, melt or damage the underlying surface. Micro-roughening on some Silicon and Gallium Arsenide is on the order of 1A or less. This paper will discuss the various applications with this process and the latest results from a beta wafer cleaning prototype test bed system that is being built under an EPA grant and joint partnership between Radiance Services Company, Neuman Micro Technologies, Inc. and the Microelectronics Research Laboratory.

  15. Science packages

    NASA Astrophysics Data System (ADS)

    1997-01-01

    Primary science teachers in Scotland have a new updating method at their disposal with the launch of a package of CDi (Compact Discs Interactive) materials developed by the BBC and the Scottish Office. These were a response to the claim that many primary teachers felt they had been inadequately trained in science and lacked the confidence to teach it properly. Consequently they felt the need for more in-service training to equip them with the personal understanding required. The pack contains five disks and a printed user's guide divided up as follows: disk 1 Investigations; disk 2 Developing understanding; disks 3,4,5 Primary Science staff development videos. It was produced by the Scottish Interactive Technology Centre (Moray House Institute) and is available from BBC Education at £149.99 including VAT. Free Internet distribution of science education materials has also begun as part of the Global Schoolhouse (GSH) scheme. The US National Science Teachers' Association (NSTA) and Microsoft Corporation are making available field-tested comprehensive curriculum material including 'Micro-units' on more than 80 topics in biology, chemistry, earth and space science and physics. The latter are the work of the Scope, Sequence and Coordination of High School Science project, which can be found at http://www.gsh.org/NSTA_SSandC/. More information on NSTA can be obtained from its Web site at http://www.nsta.org.

  16. Extreme temperature packaging: challenges and opportunities

    NASA Astrophysics Data System (ADS)

    Johnson, R. Wayne

    2016-05-01

    Consumer electronics account for the majority of electronics manufactured today. Given the temperature limits of humans, consumer electronics are typically rated for operation from -40°C to +85°C. Military applications extend the range to -65°C to +125°C while underhood automotive electronics may see +150°C. With the proliferation of the Internet of Things (IoT), the goal of instrumenting (sensing, computation, transmission) to improve safety and performance in high temperature environments such as geothermal wells, nuclear reactors, combustion chambers, industrial processes, etc. requires sensors, electronics and packaging compatible with these environments. Advances in wide bandgap semiconductors (SiC and GaN) allow the fabrication of high temperature compatible sensors and electronics. Integration and packaging of these devices is required for implementation into actual applications. The basic elements of packaging are die attach, electrical interconnection and the package or housing. Consumer electronics typically use conductive adhesives or low melting point solders for die attach, wire bonds or low melting solder for electrical interconnection and epoxy for the package. These materials melt or decompose in high temperature environments. This paper examines materials and processes for high temperature packaging including liquid transient phase and sintered nanoparticle die attach, high melting point wires for wire bonding and metal and ceramic packages. The limitations of currently available solutions will also be discussed.

  17. Copper post-CMP cleaning process on a dry-in/dry-out tool

    NASA Astrophysics Data System (ADS)

    Basak, Sanjay; Grief, Malcolm; Gupta, Anand; Murella, Krishna; VanDevender, Barrie

    1998-09-01

    Metal Chemical Mechanical Planarization (CMP) and post CMP cleaning have continued to increase in importance in semiconductor manufacturing. The introduction of copper metallization into semiconductor manufacturing processes has created a need for integrating CMP and cleaning tools, as well as a demand for the development of novel cleaning solutions. One system designed for integrated CMP processing and cleaning, commonly referred to as dry-in/dry-out CMP, is the SpeedFam Auriga C. The Auriga C integrates a widely used polishing tool together with a proven cleaning technique. The key to the operation of the Auriga C cleaning process is the effective operation of the PVA brush cleaners, water track transport, final jet rinse and high-speed spinner dryer. The effective operation of the cleaning mechanism for copper post- CMP cleaning requires the use of new chemical solutions. Typical solutions used for post process cleaning of more mature CMP processes are either ineffective for cleaning or chemically incompatible with the copper process. This paper discusses the cleaning mechanism used in an integrated dry- in/dry-out tool and demonstrates an effective and novel cleaning solution for use with this type of post-CMP cleaning process.

  18. Hybrid system of semiconductor and photosynthetic protein

    NASA Astrophysics Data System (ADS)

    Kim, Younghye; Shin, Seon Ae; Lee, Jaehun; Yang, Ki Dong; Nam, Ki Tae

    2014-08-01

    Photosynthetic protein has the potential to be a new attractive material for solar energy absorption and conversion. The development of semiconductor/photosynthetic protein hybrids is an example of recent progress toward efficient, clean and nanostructured photoelectric systems. In the review, two biohybrid systems interacting through different communicating methods are addressed: (1) a photosynthetic protein immobilized semiconductor electrode operating via electron transfer and (2) a hybrid of semiconductor quantum dots and photosynthetic protein operating via energy transfer. The proper selection of materials and functional and structural modification of the components and optimal conjugation between them are the main issues discussed in the review. In conclusion, we propose the direction of future biohybrid systems for solar energy conversion systems, optical biosensors and photoelectric devices.

  19. Hybrid system of semiconductor and photosynthetic protein.

    PubMed

    Kim, Younghye; Shin, Seon Ae; Lee, Jaehun; Yang, Ki Dong; Nam, Ki Tae

    2014-08-29

    Photosynthetic protein has the potential to be a new attractive material for solar energy absorption and conversion. The development of semiconductor/photosynthetic protein hybrids is an example of recent progress toward efficient, clean and nanostructured photoelectric systems. In the review, two biohybrid systems interacting through different communicating methods are addressed: (1) a photosynthetic protein immobilized semiconductor electrode operating via electron transfer and (2) a hybrid of semiconductor quantum dots and photosynthetic protein operating via energy transfer. The proper selection of materials and functional and structural modification of the components and optimal conjugation between them are the main issues discussed in the review. In conclusion, we propose the direction of future biohybrid systems for solar energy conversion systems, optical biosensors and photoelectric devices.

  20. Substrate solder barriers for semiconductor epilayer growth

    DOEpatents

    Drummond, T.J.; Ginley, D.S.; Zipperian, T.E.

    1989-05-09

    During the growth of compound semiconductors by epitaxial processes, substrates are typically mounted to a support. In modular beam epitaxy, mounting is done using indium as a solder. This method has two drawbacks: the indium reacts with the substrate, and it is difficult to uniformly wet the back of a large diameter substrate. Both of these problems have been successfully overcome by sputter coating the back of the substrate with a thin layer of tungsten carbide or tungsten carbide and gold. In addition to being compatible with the growth of high quality semiconductor epilayers this coating is also inert in all standard substrate cleaning etchants used for compound semiconductors, and provides uniform distribution of energy in radiant heating.

  1. Substrate solder barriers for semiconductor epilayer growth

    DOEpatents

    Drummond, Timothy J.; Ginley, David S.; Zipperian, Thomas E.

    1989-01-01

    During the growth of compound semiconductors by epitaxial processes, substrates are typically mounted to a support. In modular beam epitaxy, mounting is done using indium as a solder. This method has two drawbacks: the indium reacts with the substrate, and it is difficult to uniformly wet the back of a large diameter substrate. Both of these problems have been successfully overcome by sputter coating the back of the substrate with a thin layer of tungsten carbide or tungsten carbide and gold. In addition to being compatible with the growth of high quality semiconductor epilayers this coating is also inert in all standard substrate cleaning etchants used for compound semiconductors, and provides uniform distribution of energy in radiant heating.

  2. Substrate solder barriers for semiconductor epilayer growth

    DOEpatents

    Drummond, T.J.; Ginley, D.S.; Zipperian, T.E.

    1987-10-23

    During the growth of compound semiconductors by epitaxial processes, substrates are typically mounted to a support. In molecular beam epitaxy, mounting is done using indium as a solder. This method has two drawbacks: the indium reacts with the substrate, and it is difficult to uniformly wet the back of a large diameter substrate. Both of these problems have been successfully overcome by sputter coating the back of the substrate with a thin layer of tungsten carbide or tungsten carbide and gold. In addition to being compatible with the growth of high quality semiconductor epilayers this coating is also inert in all standard substate cleaning etchants used for compound semiconductors, and provides uniform distribution of energy in radiant heating. 1 tab.

  3. Clean Watersheds Needs Survey

    EPA Pesticide Factsheets

    The Clean Watershed Needs Survey is a national assessment of the future capital cost for publicly owned wastewater collection and treatment facilities to meet the Clean Water Act's water quality goals.

  4. California Clean Tech

    EPA Pesticide Factsheets

    The CA Clean Air Technology Initiative is an EPA/state partnership to develop clean air technologies for the San Joaquin Valley and South Coast Air Basins through collaborative projects in technology research, development, demonstration, and deployment.

  5. What Is Clean Cities?

    SciTech Connect

    Not Available

    2007-08-01

    This Clean Cities Program fact sheet describes the purpose and scope of this DOE program. Clean Cities facilitates the use of alternative and advanced fuels and vehicles to displace petroleum in the transportation sector.

  6. Cleaning supplies and equipment

    MedlinePlus

    ... gov/ency/patientinstructions/000443.htm Cleaning supplies and equipment To use the sharing features on this page, ... to clean supplies and equipment. Disinfecting Supplies and Equipment Start by wearing the right personal protective equipment ( ...

  7. Setting the Cleaning Standard.

    ERIC Educational Resources Information Center

    Milshtein, Amy

    1998-01-01

    Explains how well-defined cleaning and maintenance standards helped a community school system resolve problems with custodial staff apportionments. Cleaning time, frequency, and cleanliness levels are combined to create a formula that helps economize custodial care. (GR)

  8. Emission factors of air toxics from semiconductor manufacturing in Korea.

    PubMed

    Eom, Yun-Sung; Hong, Ji-Hyung; Lee, Suk-Jo; Lee, Eun-Jung; Cha, Jun-Seok; Lee, Dae-Gyun; Bang, Sun-Ae

    2006-11-01

    The development of local, accurate emission factors is very important for the estimation of reliable national emissions and air quality management. For that, this study is performed for pollutants released to the atmosphere with source-specific emission tests from the semiconductor manufacturing industry. The semiconductor manufacturing industry is one of the major sources of air toxics or hazardous air pollutants (HAPs); thus, understanding the emission characteristics of the emission source is a very important factor in the development of a control strategy. However, in Korea, there is a general lack of information available on air emissions from the semiconductor industry. The major emission sources of air toxics examined from the semiconductor manufacturing industry were wet chemical stations, coating applications, gaseous operations, photolithography, and miscellaneous devices in the wafer fabrication and semiconductor packaging processes. In this study, analyses of emission characteristics, and the estimations of emission data and factors for air toxics, such as acids, bases, heavy metals, and volatile organic compounds from the semiconductor manufacturing process have been performed. The concentration of hydrogen chloride from the packaging process was the highest among all of the processes. In addition, the emission factor of total volatile organic compounds (TVOCs) for the packaging process was higher than that of the wafer fabrication process. Emission factors estimated in this study were compared with those of Taiwan for evaluation, and they were found to be of similar level in the case of TVOCs and fluorine compounds.

  9. Clean room wiping liquids

    SciTech Connect

    Harding, W.B.

    1991-12-01

    A water-based liquid containing isopropyl alcohol, ammonium hydroxide, and surfactants was developed to replace 1,1,2-trichlorotrifluoroethane for the dampening of clean room wiping cloths used to wipe clean benches, clean room equipment, and latex finger cots and gloves.

  10. A Green Clean

    ERIC Educational Resources Information Center

    Kravitz, Robert

    2006-01-01

    In the professional cleaning industry, green cleaning has been much discussed in the past few years. Usually, the information pertains to the many reasons why a green cleaning program should be started, the steps involved to get the program off the ground, and the potential benefits. However, although many facility managers and school…

  11. Challenges and opportunities in chemical functionalization of semiconductor surfaces

    NASA Astrophysics Data System (ADS)

    Gao, Fei; Teplyakov, Andrew V.

    2017-03-01

    The field of chemical functionalization of semiconductor surfaces has developed tremendously over the last several decades. Since silicon occupied the main portion of the industrial applications of semiconductors, understanding its surface chemistry at a molecular level is very advanced. This particular field has also benefited from combining the work on well-defined clean silicon surfaces in vacuum, well-characterized chemically-passivated surfaces in ambient, and current and potential applications of the resulting interfaces. This article will use this work to build a generalized evaluation of the developments in surface chemical functionalization, specifically addressing organic functionalization of semiconductors, and consider the challenges and opportunities for further evolution of the field.

  12. Photoelectrosynthesis at semiconductor electrodes

    SciTech Connect

    Nozik, A. J.

    1980-12-01

    The general principles of photoelectrochemistry and photoelectrosynthesis are reviewed and some new developments in photoelectrosynthesis are discussed. Topics include energetics of semiconductor-electrolyte interfaces(band-edge unpinning); hot carrier injection at illuminated semiconductor-electrolyte junctions; derivatized semiconductor electrodes; particulate photoelectrochemical systems; layered compounds and other new materials; and dye sensitization. (WHK)

  13. Semiconductor lasers for space beacons and communications

    NASA Astrophysics Data System (ADS)

    Kung, H.; Worland, D. P.; Nguyen, H.; Streifer, W.; Scifres, D. R.

    1989-06-01

    Semiconductor lasers have been packaged and qualified for various applications in space. In this paper two subsystems are discussed, both of which will be launched shortly. The first subsystem employs a partially coherent semiconductor laser array coupled to an optical fiber, and monitored by a photo-diode.This package is used in a highly reliable, moderate data rate, moderate length communications link. The fiber coupled output power is 28 mW and the package has been fully space qualified. That is, it is free of organics, hermetically sealed, and has been subjected to die shear, acceleration, thermal cycling, and other tests. The laser longevity exceeds 10 years of continuous operation. The second subsystem consists of 27 fiber coupled space qualified packaged lasers of the same type as above, but designed to operate at 200 mW power output from the fiber. Twenty-seven fibers are bundled to produce a source with a total power emission in excess of 5 watts cw. The subsystem is part of a beacon, which will be used very shortly in a polar satellite experiment. The lasers employed in the two subsystems described above are only partially coherent and therefore are insufficiently bright to operate in a long distance, high data rate link, except with a prohibitively large lens.

  14. Quality Control On Strained Semiconductor Devices

    SciTech Connect

    Dommann, Alex; Neels, Antonia

    2010-11-24

    New semiconductor devices are based very often on strained silicon which promises to squeeze more device performance out of current devices. With strained silicon it is possible to get the same device performance using less power. The technique is using strain as a 'design element' for silicon to improve the device performance and has become a hot topic in semiconductor research in the past years. However in the same time topics like 'System in Package'(SiP) on thin wafers are getting more and more important. The chips of thin wafers in advanced packaging are extremely sensitive to induced stresses due to packaging issues. If we are using now strain as a design element for improving device performance we increase the sensitivity again and therefore also the risk of aging of such SiP's. High Resolution X-ray diffraction (HRXRD) techniques such as Rocking Curves (RC's) and Reciprocal Space Mapping (RSM) are therefore very powerful tools to study the stresses in packaged devices.

  15. Clean Watersheds for a Clean Bay Project

    EPA Pesticide Factsheets

    Information about the SFBWQPClean Watersheds for a Clean Bay Project: Implementing the PCB TMDL, part of an EPA competitive grant program to improve SF Bay water quality focused on restoring impaired waters and enhancing aquatic resources.

  16. Knack for reticle cleaning

    NASA Astrophysics Data System (ADS)

    Takahashi, Masumi; Handa, Hitoshi; Shirai, Hisatsugu

    2000-07-01

    Cleaning is one of the most important processes in mask making, because it decides final quality. In cleaning process, it is necessary for reticle cleanliness to not only remove particles from reticle but also prevent adsorption and re-deposition onto reticle. There is the knack for reticle cleaning, and we introduce three keys in this paper. The first key is the rinse after chemical treatment. By the rinse sequence modification, the cleaner was refined and the particle removal ability was improved. The second key is quality control to grasp the situation of cleaner. By the daily check, cleaner's abnormal condition is found at an early stage, quick action is taken, and then stable cleaning quality is kept every day. And the third key is proper choice of cleaners. We have adopted pre-cleaning process and selected the adequate cleaner for each cleaning level and improved cleaning yield and quality.

  17. Airing 'clean air' in Clean India Mission.

    PubMed

    Banerjee, T; Kumar, M; Mall, R K; Singh, R S

    2016-12-30

    The submission explores the possibility of a policy revision for considering clean air quality in recently launched nationwide campaign, Clean India Mission (CIM). Despite of several efforts for improving availability of clean household energy and sanitation facilities, situation remain still depressing as almost half of global population lacks access to clean energy and proper sanitation. Globally, at least 2.5 billion people do not have access to basic sanitation facilities. There are also evidences of 7 million premature deaths by air pollution in year 2012. The situation is even more disastrous for India especially in rural areas. Although, India has reasonably progressed in developing sanitary facilities and disseminating clean fuel to its urban households, the situation in rural areas is still miserable and needs to be reviewed. Several policy interventions and campaigns were made to improve the scenario but outcomes were remarkably poor. Indian census revealed a mere 31% sanitation coverage (in 2011) compared to 22% in 2001 while 60% of population (700 million) still use solid biofuels and traditional cook stoves for household cooking. Further, last decade (2001-2011) witnessed the progress decelerating down with rural households without sanitation facilities increased by 8.3 million while minimum progress has been made in conversion of conventional to modern fuels. To revamp the sanitation coverage, an overambitious nationwide campaign CIM was initiated in 2014 and present submission explores the possibility of including 'clean air' considerations within it. The article draws evidence from literatures on scenarios of rural sanitation, energy practises, pollution induced mortality and climatic impacts of air pollution. This subsequently hypothesised with possible modification in available technologies, dissemination modes, financing and implementation for integration of CIM with 'clean air' so that access to both sanitation and clean household energy may be

  18. The MSFC complementary metal oxide semiconductor (including multilevel interconnect metallization) process handbook

    NASA Technical Reports Server (NTRS)

    Bouldin, D. L.; Eastes, R. W.; Feltner, W. R.; Hollis, B. R.; Routh, D. E.

    1979-01-01

    The fabrication techniques for creation of complementary metal oxide semiconductor integrated circuits at George C. Marshall Space Flight Center are described. Examples of C-MOS integrated circuits manufactured at MSFC are presented with functional descriptions of each. Typical electrical characteristics of both p-channel metal oxide semiconductor and n-channel metal oxide semiconductor discrete devices under given conditions are provided. Procedures design, mask making, packaging, and testing are included.

  19. Unitary lens semiconductor device

    DOEpatents

    Lear, K.L.

    1997-05-27

    A unitary lens semiconductor device and method are disclosed. The unitary lens semiconductor device is provided with at least one semiconductor layer having a composition varying in the growth direction for unitarily forming one or more lenses in the semiconductor layer. Unitary lens semiconductor devices may be formed as light-processing devices such as microlenses, and as light-active devices such as light-emitting diodes, photodetectors, resonant-cavity light-emitting diodes, vertical-cavity surface-emitting lasers, and resonant cavity photodetectors. 9 figs.

  20. Unitary lens semiconductor device

    DOEpatents

    Lear, Kevin L.

    1997-01-01

    A unitary lens semiconductor device and method. The unitary lens semiconductor device is provided with at least one semiconductor layer having a composition varying in the growth direction for unitarily forming one or more lenses in the semiconductor layer. Unitary lens semiconductor devices may be formed as light-processing devices such as microlenses, and as light-active devices such as light-emitting diodes, photodetectors, resonant-cavity light-emitting diodes, vertical-cavity surface-emitting lasers, and resonant cavity photodetectors.

  1. Semiconductor electrochemistry of coal pyrite

    SciTech Connect

    Osseo-Asare, K.

    1992-05-01

    This project seeks to advance the fundamental understanding of the physicochemical processes occurring at the pyrite/aqueous interface, in the context of coal cleaning, coal desulfurization, and acid mine drainage. A novel approach to the study of pyrite aqueous electrochemistry is proposed, based on the use of both synthetic and natural (i.e. coal-derived) pyrite specimens, the utilization of pyrite both in the form of micro (i.e. colloidal and subcolloidal) and macro (i.e. rotating ring disk)-electrodes, and the application of in-situ direct electroanalytical and spectroelectrochemical characterization techniques. Central to this research is the recognition that pyrite is a semiconductor material. (Photo)electrochemical experiments will be conducted to unravel the mechanisms of anodic and cathodic processes such as those associated with pyrite decomposition and the reduction of oxidants such as molecular oxygen and the ferric ion.

  2. Packaging for Food Service

    NASA Technical Reports Server (NTRS)

    Stilwell, E. J.

    1985-01-01

    Most of the key areas of concern in packaging the three principle food forms for the space station were covered. It can be generally concluded that there are no significant voids in packaging materials availability or in current packaging technology. However, it must also be concluded that the process by which packaging decisions are made for the space station feeding program will be very synergistic. Packaging selection will depend heavily on the preparation mechanics, the preferred presentation and the achievable disposal systems. It will be important that packaging be considered as an integral part of each decision as these systems are developed.

  3. Packaging of MEMS microphones

    NASA Astrophysics Data System (ADS)

    Feiertag, Gregor; Winter, Matthias; Leidl, Anton

    2009-05-01

    To miniaturize MEMS microphones we have developed a microphone package using flip chip technology instead of chip and wire bonding. In this new packaging technology MEMS and ASIC are flip chip bonded on a ceramic substrate. The package is sealed by a laminated polymer foil and by a metal layer. The sound port is on the bottom side in the ceramic substrate. In this paper the packaging technology is explained in detail and results of electro-acoustic characterization and reliability testing are presented. We will also explain the way which has led us from the packaging of Surface Acoustic Wave (SAW) components to the packaging of MEMS microphones.

  4. Compostability of bioplastic packaging materials: an overview.

    PubMed

    Kale, Gaurav; Kijchavengkul, Thitisilp; Auras, Rafael; Rubino, Maria; Selke, Susan E; Singh, Sher Paul

    2007-03-08

    . Although recycling could be energetically more favorable than composting for these materials, it may not be practical because of excessive sorting and cleaning requirements. Therefore, the main focus is to dispose them by composting. So far, there is no formal agreement between companies, governments and consumers as to how this packaging composting will take place; therefore, the main drivers for their use have been green marketing and pseudo-environmental consciousness related to high fuel prices. Packaging compostability could be an alternative for the disposal of biobased materials as long as society as a whole is willing to formally address the challenge to clearly understand the cradle-to-grave life of a compostable package, and to include these new compostable polymers in food, manure, or yard waste composting facilities.

  5. Mechanical cleaning of graphene

    NASA Astrophysics Data System (ADS)

    Goossens, A. M.; Calado, V. E.; Barreiro, A.; Watanabe, K.; Taniguchi, T.; Vandersypen, L. M. K.

    2012-02-01

    Contamination of graphene due to residues from nanofabrication often introduces background doping and reduces electron mobility. For samples of high electronic quality, post-lithography cleaning treatments are therefore needed. We report that mechanical cleaning based on contact mode atomic force microscopy removes residues and significantly improves the electronic properties. A mechanically cleaned dual-gated bilayer graphene transistor with hexagonal boron nitride dielectrics exhibited a mobility of ˜36 000 cm2/Vs at low temperature.

  6. Clean Air Excellence Awards

    EPA Pesticide Factsheets

    These non-monetary awards honor sustainable efforts toward pollutant emissions reduction from innovators in clean air technology, community action and outreach, policy development, and transportation efficiency.

  7. Cleaning Products Pilot Project

    EPA Pesticide Factsheets

    This 1997 case study documents a three-year effort to identify and compare environmentally preferable commercial cleaning products and to implement the Environmentally Preferable Purchasing Program (EPP).

  8. CH Packaging Operations Manual

    SciTech Connect

    Washington TRU Solutions LLC

    2005-06-13

    This procedure provides instructions for assembling the CH Packaging Drum payload assembly, Standard Waste Box (SWB) assembly, Abnormal Operations and ICV and OCV Preshipment Leakage Rate Tests on the packaging seals, using a nondestructive Helium (He) Leak Test.

  9. Comparative Packaging Study

    NASA Technical Reports Server (NTRS)

    Perchonok, Michele; Antonini, David

    2008-01-01

    This viewgraph presentation describes a comparative packaging study for use on long duration space missions. The topics include: 1) Purpose; 2) Deliverables; 3) Food Sample Selection; 4) Experimental Design Matrix; 5) Permeation Rate Comparison; and 6) Packaging Material Information.

  10. Safety Evaluation for Packaging (onsite) T Plant Canyon Items

    SciTech Connect

    OBRIEN, J.H.

    2000-07-14

    This safety evaluation for packaging (SEP) evaluates and documents the ability to safely ship mostly unique inventories of miscellaneous T Plant canyon waste items (T-P Items) encountered during the canyon deck clean off campaign. In addition, this SEP addresses contaminated items and material that may be shipped in a strong tight package (STP). The shipments meet the criteria for onsite shipments as specified by Fluor Hanford in HNF-PRO-154, Responsibilities and Procedures for all Hazardous Material Shipments.

  11. Optical packaging activities at Institute of Microelectronics (IME), Singapore

    NASA Astrophysics Data System (ADS)

    Teo, Keng-Hwa; Sudharsanam, Krishnamachari; Pamidighantam, Ramana V.; Yeo, Yongkee; Iyer, Mahadevan K.

    2002-08-01

    The development of optoelectronic components for gigabit Ethernet communications is converging towards access networks where the cost of device makes a significant impact on the market acceptance. Device fabrication and packaging cost have to be brought down with novel assembly and packaging methods. Singapore has established a reputation in semiconductor device development and fabrication with excellent process and packaging facilities. Institute of Microelectronics (IME) was founded in 1991 to add value to the Singapore electronics industry. IME is involved in the development of active and passive photonics components using Silicon and polymer materials. We present a brief report on the development activities taking place in the field of optical component packaging at IME in recent years. We present a review of our competence and some of the optical device packaging activities that are being undertaken.

  12. Laser beam shaping and packaging system

    NASA Astrophysics Data System (ADS)

    Luo, Daxin; Zhao, Baiqin

    2012-10-01

    This paper presents a semiconductor laser beam shaping system, that can collimate the irradiance profile effectively and package the laser diode(LD) at the same time. Due to the semiconductor LD is a kind of line source, a particular ellipsoidal lens is designed after both the fast-axis and the slow-axis of the laser beam analyzed. Geometrical optics analysis based on the ray tracing method is done and the formulas to calculate the shape of the lens are given. Both the theoretical and experimental result show that the laser beam system works effectively; the divergence angle is reduced to less than 0.5 degree in the fast-axial direction and 1.8 degree in the slow-axial direction. In addition, it is the same process that makes the laser beam shaper and packages the LD by using epoxy resin, which simplifies the manufacturing process and reduces the LD volume greatly. Because of the advantages of small volume, low-cost, high rigidity and easy fabrication, the shaper is of great value in the field of semiconductor LD applications.

  13. Trends in Food Packaging.

    ERIC Educational Resources Information Center

    Ott, Dana B.

    1988-01-01

    This article discusses developments in food packaging, processing, and preservation techniques in terms of packaging materials, technologies, consumer benefits, and current and potential food product applications. Covers implications due to consumer life-style changes, cost-effectiveness of packaging materials, and the ecological impact of…

  14. 9 CFR 590.548 - Drying, blending, packaging, and heat treatment rooms and facilities.

    Code of Federal Regulations, 2013 CFR

    2013-01-01

    ... maintained in a clean condition and free of flies, insects, and rodents. The drying, blending, and packaging... given quantities of product into the containers. Scales shall be provided to accurately check the...

  15. 9 CFR 590.548 - Drying, blending, packaging, and heat treatment rooms and facilities.

    Code of Federal Regulations, 2014 CFR

    2014-01-01

    ... maintained in a clean condition and free of flies, insects, and rodents. The drying, blending, and packaging... given quantities of product into the containers. Scales shall be provided to accurately check the...

  16. 9 CFR 590.548 - Drying, blending, packaging, and heat treatment rooms and facilities.

    Code of Federal Regulations, 2012 CFR

    2012-01-01

    ... maintained in a clean condition and free of flies, insects, and rodents. The drying, blending, and packaging... given quantities of product into the containers. Scales shall be provided to accurately check the...

  17. 9 CFR 590.548 - Drying, blending, packaging, and heat treatment rooms and facilities.

    Code of Federal Regulations, 2011 CFR

    2011-01-01

    ... maintained in a clean condition and free of flies, insects, and rodents. The drying, blending, and packaging... given quantities of product into the containers. Scales shall be provided to accurately check the...

  18. Coherent spectroscopy of semiconductors.

    PubMed

    Cundiff, Steven T

    2008-03-31

    The coherent optical response of semiconductors has been the subject of substantial research over the last couple of decades. The interest has been motivated by unique aspects of the interaction between light and semiconductors that are revealed by coherent techniques. The ability to probe the dynamics of charge carriers has been a significant driver. This paper presents a review of selected results in coherent optical spectroscopy of semiconductors.

  19. Semiconductor microcavity lasers

    SciTech Connect

    Gourley, P.L.; Wendt, J.R.; Vawter, G.A.; Warren, M.E.; Brennan, T.M.; Hammons, B.E.

    1994-02-01

    New kinds of semiconductor microcavity lasers are being created by modern semiconductor technologies like molecular beam epitaxy and electron beam lithography. These new microcavities exploit 3-dimensional architectures possible with epitaxial layering and surface patterning. The physical properties of these microcavities are intimately related to the geometry imposed on the semiconductor materials. Among these microcavities are surface-emitting structures which have many useful properties for commercial purposes. This paper reviews the basic physics of these microstructured lasers.

  20. Green Cleaning Label Power

    ERIC Educational Resources Information Center

    Balek, Bill

    2012-01-01

    Green cleaning plays a significant and supportive role in helping education institutions meet their sustainability goals. However, identifying cleaning products, supplies and equipment that truly are environmentally preferable can be daunting. The marketplace is inundated with products and services purporting to be "green" or environmentally…

  1. Cleaning Physical Education Areas.

    ERIC Educational Resources Information Center

    Griffin, William R.

    1999-01-01

    Discusses techniques to help create clean and inviting school locker rooms. Daily, weekly or monthly, biannual, and annual cleaning strategies for locker room showers are highlighted as are the specialized maintenance needs for aerobic and dance areas, running tracks, and weight training areas. (GR)

  2. Clean Energy Manufacturing Initiative

    SciTech Connect

    2013-04-01

    The initiative will strategically focus and rally EERE’s clean energy technology offices and Advanced Manufacturing Office around the urgent competitive opportunity for the United States to be the leader in the clean energy manufacturing industries and jobs of today and tomorrow.

  3. Laser surface cleaning

    SciTech Connect

    Freiwald, J.G.; Freiwald, D.A.

    1994-12-31

    The objective of this work is a laboratory demonstration that red-lead primer and two-part epoxy paints can be stripped from concrete and metal surfaces using surface cleaning systems based on pulsed-repetition CO{sub 2} lasers. The three goals are to: (1) demonstrate coatings removal, including surface pore cleaning; (2) demonstrate that there is negligible release of ablated contaminants to the environment; and (3) demonstrate that the process will generate negligible amounts of additional waste compared to competing technologies. Phase 1 involved site visits to RMI and Fernald to assess the cleaning issues for buildings and parts. In addition, Phase 1 included detailed designs of a more powerful system for industrial cleaning rates, including laser, articulating optics, ablated-material capture suction nozzle attached to a horizontal raster scanner for floor cleaning, and filtration system. Some concept development is also being done for using robots, and for parts cleaning. In Phase 2 a transportable 6 kW system will be built and tested, with a horizontal surface scanner for cleaning paint from floors. The laboratory tests will again be instrumented. Some concept development will continue for using robots, and for parts cleaning. This report describes Phase 1 results.

  4. Clean Air Act Text

    EPA Pesticide Factsheets

    The Clean Air Act is the law that defines EPA's responsibilities for protecting and improving the nation's air quality and the stratospheric ozone layer. The last major change in the law, the Clean Air Act Amendments of 1990, enacted in 1990 by Congress.

  5. Cleaning agents and asthma.

    PubMed

    Quirce, S; Barranco, P

    2010-01-01

    Although cleaners represent a significant part of the working population worldwide, they remain a relatively understudied occupational group. Epidemiological studies have shown an association between cleaning work and asthma, but the risk factors are uncertain. Cleaning workers are exposed to a large variety of cleaning products containing both irritants and sensitizers, as well as to common indoor allergens and pollutants. Thus, the onset or aggravation of asthma in this group could be related to an irritant-induced mechanism or to specific sensitization. The main sensitizers contained in cleaning products are disinfectants, quaternary ammonium compounds (such as benzalkonium chloride), amine compounds, and fragrances.The strongest airway irritants in cleaning products are bleach (sodium hypochlorite), hydrochloric acid, and alkaline agents (ammonia and sodium hydroxide), which are commonly mixed together. Exposure to the ingredients of cleaning products may give rise to both new-onset asthma, with or without a latency period, and work-exacerbated asthma. High-level exposure to irritants may induce reactive airways dysfunction syndrome. Cleaning workers may also have a greater relative risk of developing asthma due to prolonged low-to-moderate exposure to respiratory irritants. In addition, asthma-like symptoms without confirmed asthma are also common after exposure to cleaning agents. In many cleaners, airway symptoms induced by chemicals and odors cannot be explained by allergic or asthmatic reactions. These patients may have increased sensitivity to inhaled capsaicin, which is known to reflect sensory reactivity, and this condition is termed airway sensory hyperreactivity.

  6. Building Successful Cleaning Processes.

    ERIC Educational Resources Information Center

    Walker, John P.

    2002-01-01

    Discusses how to build a successful cleaning process in order to most effectively maintain school facilities, explaining that the cleaning processes used plays a critical role in productivity. Focuses on: developing a standardized system; making sure that employees have the right tools for the work they perform; training employees; tracking and…

  7. REPLACING SOLVENT CLEANING WITH AQUEOUS CLEANING

    EPA Science Inventory

    The report documents actions taken by Robert Bosch Corp., Charleston, SC, in replacing the cleaning solvents 1, 1, 2- trichloro-1, 2, 2-trifluoroethane (CFC-113) and trichloroethylene (TCE) with aqueous solutions. Bosch has succeeded in eliminating all their CFC-113 use and so f...

  8. Semiconductor bridge (SCB) detonator

    DOEpatents

    Bickes, Jr., Robert W.; Grubelich, Mark C.

    1999-01-01

    The present invention is a low-energy detonator for high-density secondary-explosive materials initiated by a semiconductor bridge igniter that comprises a pair of electrically conductive lands connected by a semiconductor bridge. The semiconductor bridge is in operational or direct contact with the explosive material, whereby current flowing through the semiconductor bridge causes initiation of the explosive material. Header wires connected to the electrically-conductive lands and electrical feed-throughs of the header posts of explosive devices, are substantially coaxial to the direction of current flow through the SCB, i.e., substantially coaxial to the SCB length.

  9. Semiconductor bridge (SCB) detonator

    DOEpatents

    Bickes, R.W. Jr.; Grubelich, M.C.

    1999-01-19

    The present invention is a low-energy detonator for high-density secondary-explosive materials initiated by a semiconductor bridge (SCB) igniter that comprises a pair of electrically conductive lands connected by a semiconductor bridge. The semiconductor bridge is in operational or direct contact with the explosive material, whereby current flowing through the semiconductor bridge causes initiation of the explosive material. Header wires connected to the electrically-conductive lands and electrical feed-throughs of the header posts of explosive devices, are substantially coaxial to the direction of current flow through the SCB, i.e., substantially coaxial to the SCB length. 3 figs.

  10. Interconnected semiconductor devices

    DOEpatents

    Grimmer, Derrick P.; Paulson, Kenneth R.; Gilbert, James R.

    1990-10-23

    Semiconductor layer and conductive layer formed on a flexible substrate, divided into individual devices and interconnected with one another in series by interconnection layers and penetrating terminals.

  11. Multilayered microelectronic device package with an integral window

    DOEpatents

    Peterson, Kenneth A.; Watson, Robert D.

    2003-01-01

    An apparatus for packaging of microelectronic devices is disclosed, wherein the package includes an integral window. The microelectronic device can be a semiconductor chip, a CCD chip, a CMOS chip, a VCSEL chip, a laser diode, a MEMS device, or a IMEMS device. The package can comprise, for example, a cofired ceramic frame or body. The package has an internal stepped structure made of a plurality of plates, with apertures, which are patterned with metallized conductive circuit traces. The microelectronic device can be flip-chip bonded on the plate to these traces, and oriented so that the light-sensitive side is optically accessible through the window. A cover lid can be attached to the opposite side of the package. The result is a compact, low-profile package, having an integral window that can be hermetically-sealed. The package body can be formed by low-temperature cofired ceramic (LTCC) or high-temperature cofired ceramic (HTCC) multilayer processes with the window being simultaneously joined (e.g. cofired) to the package body during LTCC or HTCC processing. Multiple chips can be located within a single package, according to some embodiments. The cover lid can include a window. The apparatus is particularly suited for packaging of MEMS devices, since the number of handling steps is greatly reduced, thereby reducing the potential for contamination. The integral window can further include a lens for optically transforming light passing through the window. The package can include an array of binary optic lenslets made integral with the window. The package can include an electrically-switched optical modulator, such as a lithium niobate window attached to the package, for providing a very fast electrically-operated shutter.

  12. Laser Cleaning of Gildings

    NASA Astrophysics Data System (ADS)

    Panzner, M.; Wiedemann, G.; Meier, M.; Conrad, W.; Kempe, A.; Hutsch, T.

    Results of laser cleaning experiments on different gilding types like leaf gilding and fire gilding are presented in this contribution by means of three tested art objects. The reflectivity of gold is advantageously high for the typical laser cleaning wavelength of 1,064 nm. Additionally, to avoid damage like gold loss, the transfer of the absorbed laser pulse energy into the art object by thermal conduction is considered. Fire gilded surfaces are most easily cleaned because of the good heat transfer conditions which imply a high threshold intensity with respect to damage. This is different for leaf gilded surfaces but suitable laser cleaning parameters have also been found for this case. The results of laser cleaning experiments are presented by photography, microscopy, SEM and EDX analysis.

  13. Correlating Cleaning Thoroughness with Effectiveness and Briefly Intervening to Affect Cleaning Outcomes: How Clean Is Cleaned?

    PubMed Central

    Hosford, Eve; Ong, Ana; Richesson, Douglas; Fraser, Susan; Kwak, Yoon; Miller, Sonia; Julius, Michael; McGann, Patrick; Lesho, Emil

    2016-01-01

    Objectives The most efficient approach to monitoring and improving cleaning outcomes remains unresolved. We sought to extend the findings of a previous study by determining whether cleaning thoroughness (dye removal) correlates with cleaning efficacy (absence of molecular or cultivable biomaterial) and whether one brief educational intervention improves cleaning outcomes. Design Before-after trial. Setting Newly built community hospital. Intervention 90 minute training refresher with surface-specific performance results. Methods Dye removal, measured by fluorescence, and biomaterial removal and acquisition, measured with culture and culture-independent PCR-based assays, were clandestinely assessed for eight consecutive months. At this midpoint, results were presented to the cleaning staff (intervention) and assessments continued for another eight consecutive months. Results 1273 surfaces were sampled before and after terminal room cleaning. In the short-term, dye removal increased from 40.3% to 50.0% (not significant). For the entire study period, dye removal also improved but not significantly. After the intervention, the number of rooms testing positive for specific pathogenic species by culturing decreased from 55.6% to 36.6% (not significant), and those testing positive by PCR fell from 80.6% to 53.7% (P = 0.016). For nonspecific biomaterial on surfaces: a) removal of cultivable Gram-negatives (GN) trended toward improvement (P = 0.056); b) removal of any cultivable growth was unchanged but acquisition (detection of biomaterial on post-cleaned surfaces that were contaminant-free before cleaning) worsened (P = 0.017); c) removal of PCR-based detection of bacterial DNA improved (P = 0.046), but acquisition worsened (P = 0.003); d) cleaning thoroughness and efficacy were not correlated. Conclusion At this facility, a minor intervention or minimally more aggressive cleaning may reduce pathogen-specific contamination, but not without unintended consequences. PMID

  14. Edible packaging materials.

    PubMed

    Janjarasskul, Theeranun; Krochta, John M

    2010-01-01

    Research groups and the food and pharmaceutical industries recognize edible packaging as a useful alternative or addition to conventional packaging to reduce waste and to create novel applications for improving product stability, quality, safety, variety, and convenience for consumers. Recent studies have explored the ability of biopolymer-based food packaging materials to carry and control-release active compounds. As diverse edible packaging materials derived from various by-products or waste from food industry are being developed, the dry thermoplastic process is advancing rapidly as a feasible commercial edible packaging manufacturing process. The employment of nanocomposite concepts to edible packaging materials promises to improve barrier and mechanical properties and facilitate effective incorporation of bioactive ingredients and other designed functions. In addition to the need for a more fundamental understanding to enable design to desired specifications, edible packaging has to overcome challenges such as regulatory requirements, consumer acceptance, and scaling-up research concepts to commercial applications.

  15. Needleless Electrospinning Experimental Study and Nanofiber Application in Semiconductor Packaging

    NASA Astrophysics Data System (ADS)

    Sun, Tianwei

    Electronics especially mobile electronics such as smart phones, tablet PCs, notebooks and digital cameras are undergoing rapid development nowadays and have thoroughly changed our lives. With the requirement of more transistors, higher power, smaller size, lighter weight and even bendability, thermal management of these devices became one of the key challenges. Compared to active heat management system, heat pipe, which is a passive fluidic system, is considered promising to solve this problem. However, traditional heat pipes have size, weight and capillary limitation. Thus new type of heat pipe with smaller size, lighter weight and higher capillary pressure is needed. Nanofiber has been proved with superior properties and has been applied in multiple areas. This study discussed the possibility of applying nanofiber in heat pipe as new wick structure. In this study, a needleless electrospinning device with high productivity rate was built onsite to systematically investigate the effect of processing parameters on fiber properties as well as to generate nanofiber mat to evaluate its capability in electronics cooling. Polyethylene oxide (PEO) and Polyvinyl Alcohol (PVA) nanofibers were generated. Tensiometer was used for wettability measurement. The results show that independent parameters including spinneret type, working distance, solution concentration and polymer type are strongly correlated with fiber morphology compared to other parameters. The results also show that the fabricated nanofiber mat has high capillary pressure.

  16. Semiconductor nanowire optical antenna solar absorbers.

    PubMed

    Cao, Linyou; Fan, Pengyu; Vasudev, Alok P; White, Justin S; Yu, Zongfu; Cai, Wenshan; Schuller, Jon A; Fan, Shanhui; Brongersma, Mark L

    2010-02-10

    Photovoltaic (PV) cells can serve as a virtually unlimited clean source of energy by converting sunlight into electrical power. Their importance is reflected in the tireless efforts that have been devoted to improving the electrical and structural properties of PV materials. More recently, photon management (PM) has emerged as a powerful additional means to boost energy conversion efficiencies. Here, we demonstrate an entirely new PM strategy that capitalizes on strong broad band optical antenna effects in one-dimensional semiconductor nanostructures to dramatically enhance absorption of sunlight. We show that the absorption of sunlight in Si nanowires (Si NWs) can be significantly enhanced over the bulk. The NW's optical properties also naturally give rise to an improved angular response. We propose that by patterning the silicon layer in a thin film PV cell into an array of NWs, one can boost the absorption for solar radiation by 25% while utilizing less than half of the semiconductor material (250% increase in the light absorption per unit volume of material). These results significantly advance our understanding of the way sunlight is absorbed by one-dimensional semiconductor nanostructures and provide a clear, intuitive guidance for the design of efficient NW solar cells. The presented approach is universal to any semiconductor and a wide range of nanostructures; as such, it provides a new PV platform technology.

  17. Supercritical fluids cleaning

    SciTech Connect

    Butner, S.; Hjeresen, D.; Silva, L.; Spall, D.; Stephenson, R.

    1991-01-01

    This paper discusses a proposed multi-party research and development program which seeks to develop supercritical fluid cleaning technology as an alternative to existing solvent cleaning applications. While SCF extraction technology has been in commercial use for several years, the use of these fluids as cleaning agents poses several new technical challenges. Problems inherent in the commercialization of SCF technology include: the cleaning efficacy and compatibility of supercritical working fluids with the parts to be cleaned must be assessed for a variety of materials and components; process parameters and equipment design Have been optimized for extractive applications and must be reconsidered for application to cleaning; and co-solvents and entrainers must be identified to facilitate the removal of polar inorganic and organic contaminants, which are often not well solvated in supercritical systems. The proposed research and development program would address these issues and lead to the development and commercialization of viable SCF-based technology for precision cleaning applications. This paper provides the technical background, program scope, and delineates the responsibilities of each principal participant in the program.

  18. Molecular Semiconductors: An Introduction

    NASA Astrophysics Data System (ADS)

    de Mello, John; Halls, Jonathan James Michael

    2005-10-01

    Introducing the fundamental ideas and concepts behind organic semiconductors, this book provides a clear impression of the broad range of research activities currently underway. Aimed specifically at new entrant doctoral students from a wide variety of backgrounds, including chemistry, physics, electrical engineering and materials science, it also represents an ideal companion text to undergraduate courses in organic semiconductors.

  19. Precision Cleaning Titanium Components

    SciTech Connect

    Hand, T.E.; Bohnert, G.W.

    2000-02-02

    Clean bond surfaces are critical to the operation of diffusion bonded titanium engine components. These components can be contaminated with machining coolant, shop dirt, and fingerprints during normal processing and handling. These contaminants must be removed to achieve acceptable bond quality. As environmental concerns become more important in manufacturing, elimination of the use of hazardous materials is desired. For this reason, another process (not using nitric-hydrofluoric acid solution) to clean titanium parts before bonding was sought. Initial cleaning trials were conducted at Honeywell to screen potential cleaning techniques and chemistries. During the initial cleaning process screening phase, Pratt and Whitney provided Honeywell with machined 3 inch x 3 inch x 1 inch titanium test blocks. These test blocks were machined with a water-based machining coolant and exposed to a normal shop environment and handling. (Honeywell sectioned one of these blocks into smaller samples to be used for additional cleanliness verification analyses.) The sample test blocks were ultrasonically cleaned in alkaline solutions and AUGER analysis was used by Honeywell FM and T to validate their cleanliness. This information enabled selection of final cleaning techniques and solutions to be used for the bonding trials. To validate Honeywell's AUGER data and to verify the cleaning processes in actual situations, additional sample blocks were cleaned (using the chosen processes) and then bonded. The bond quality of the test blocks was analyzed according to Pratt and Whitney's requirements. The Charpy impact testing was performed according to ASTM procedure {number_sign}E-23. Bond quality was determined by examining metallographic samples of the bonded test blocks for porosity along the bondline.

  20. Active cleaning technique device

    NASA Technical Reports Server (NTRS)

    Shannon, R. L.; Gillette, R. B.

    1973-01-01

    The objective of this program was to develop a laboratory demonstration model of an active cleaning technique (ACT) device. The principle of this device is based primarily on the technique for removing contaminants from optical surfaces. This active cleaning technique involves exposing contaminated surfaces to a plasma containing atomic oxygen or combinations of other reactive gases. The ACT device laboratory demonstration model incorporates, in addition to plasma cleaning, the means to operate the device as an ion source for sputtering experiments. The overall ACT device includes a plasma generation tube, an ion accelerator, a gas supply system, a RF power supply and a high voltage dc power supply.

  1. Cleaning method and apparatus

    DOEpatents

    Jackson, D.D.; Hollen, R.M.

    1981-02-27

    A method of very thoroughly and quikcly cleaning a guaze electrode used in chemical analyses is given, as well as an automobile cleaning apparatus which makes use of the method. The method generates very little waste solution, and this is very important in analyzing radioactive materials, especially in aqueous solutions. The cleaning apparatus can be used in a larger, fully automated controlled potential coulometric apparatus. About 99.98% of a 5 mg plutonium sample was removed in less than 3 minutes, using only about 60 ml of rinse solution and two main rinse steps.

  2. Keeping condensers clean

    SciTech Connect

    Wicker, K.

    2006-04-15

    The humble condenser is among the biggest contributors to a steam power plant's efficiency. But although a clean condenser can provide great economic benefit, a dirty one can raise plant heat rate, resulting in large losses of generation revenue and/or unnecessarily high fuel bills. Conventional methods for cleaning fouled tubes range form chemicals to scrapers to brushes and hydro-blasters. This article compares the available options and describes how one power station, Omaha Public Power District's 600 MW North Omaha coal-fired power station, cleaned up its act. The makeup and cooling water of all its five units comes from the Missouri River. 6 figs.

  3. 7 CFR 58.211 - Packaging room for bulk products.

    Code of Federal Regulations, 2013 CFR

    2013-01-01

    ... facilitate cleaning. An adequate exhaust system shall be provided to minimize the accumulation of product... 7 Agriculture 3 2013-01-01 2013-01-01 false Packaging room for bulk products. 58.211 Section 58... AND STANDARDS UNDER THE AGRICULTURAL MARKETING ACT OF 1946 AND THE EGG PRODUCTS INSPECTION...

  4. Smart packaging for photonics

    SciTech Connect

    Smith, J.H.; Carson, R.F.; Sullivan, C.T.; McClellan, G.; Palmer, D.W.

    1997-09-01

    Unlike silicon microelectronics, photonics packaging has proven to be low yield and expensive. One approach to make photonics packaging practical for low cost applications is the use of {open_quotes}smart{close_quotes} packages. {open_quotes}Smart{close_quotes} in this context means the ability of the package to actuate a mechanical change based on either a measurement taken by the package itself or by an input signal based on an external measurement. One avenue of smart photonics packaging, the use of polysilicon micromechanical devices integrated with photonic waveguides, was investigated in this research (LDRD 3505.340). The integration of optical components with polysilicon surface micromechanical actuation mechanisms shows significant promise for signal switching, fiber alignment, and optical sensing applications. The optical and stress properties of the oxides and nitrides considered for optical waveguides and how they are integrated with micromechanical devices were investigated.

  5. Clean Fleet Final Report

    DOE Alternative Fuels and Advanced Vehicles Data Center

    ... and parts and to account for certain types of missing data. ... time that a vehicle is available for use, whether or not ... &23; Adjust the idle speed &23; Clean the throttle body &23; Replace ...

  6. Clean Cookstove Research

    EPA Pesticide Factsheets

    EPA is an international leader in clean cookstove research and provides independent scientific data on cookstove emissions and energy efficiency to support the development of cleaner sustainable cooking technologies.

  7. Learn About Clean Diesel

    EPA Pesticide Factsheets

    The clean diesel program is designed to aggressively reduce the pollution emitted from diesel engines across the country through the implementation of varied control strategies and the aggressive involvement of national, state, and local partners.

  8. Clean Energy Financing Programs

    EPA Pesticide Factsheets

    This page introduces resources that state and local governments can use to develop Clean Energy Finance Programs and reduce the financial barriers to implementing energy efficiency and renewable energy in their communities.

  9. Effective Cleaning Radius Studies

    SciTech Connect

    Churnetski, B.V.

    2001-10-15

    This report discusses results of testing done in the Savannah River Laboratory half tank and full tank mockup facilities using kaolin clay slurries and the relationship between cleaning radius and pump and slurry characteristics.

  10. Gasification: redefining clean energy

    SciTech Connect

    2008-05-15

    This booklet gives a comprehensive overview of how gasification is redefining clean energy, now and in the future. It informs the general public about gasification in a straight-forward, non-technical manner.

  11. Cleaning up Floor Care.

    ERIC Educational Resources Information Center

    Carr, Richard; McLean, Doug

    1995-01-01

    Discusses how educational-facility maintenance departments can cut costs in floor cleaning through careful evaluation of floor equipment and products. Tips for choosing carpet detergents are highlighted. (GR)

  12. Clean Power Plan Toolbox

    EPA Pesticide Factsheets

    These are resources to help states as they develop state implementation plans under section 111(d) of the Clean Air Act to meet EPA's carbon pollution standards for existing power plants. Supplements www2.epa.gov/carbon-pollution-standards.

  13. Walnut Hulls Clean Aluminum

    NASA Technical Reports Server (NTRS)

    Colberg, W. R.; Gordon, G. H.; Jackson, C. H.

    1984-01-01

    Hulls inflict minimal substrate damage. Walnut hulls found to be best abrasive for cleaning aluminum surfaces prior to painting. Samples blasted with walnut hulls showed no compressive stress of surface.

  14. Midwest Clean Diesel Initiative

    EPA Pesticide Factsheets

    The Midwest Clean Diesel Initiative (MCDI) is a collaboration of federal, state and local agencies, along with communities, non-profit organizations and private companies working together by reducing exposure to emissions from diesel engines

  15. Clean Diesel Tribal Grants

    EPA Pesticide Factsheets

    The DERA Tribal Program awards clean diesel grants specifically for tribal nations. The Diesel Emissions Reduction Act (DERA) appropriates funds for these projects. Publication Numbers: EPA-420-B-13-025 and EPA-420-P-11-001.

  16. Clean Diesel National Grants

    EPA Pesticide Factsheets

    National Funding Assistance Program administers competitive grants for clean diesel projects. The Diesel Emissions Reduction Act (DERA) appropriates funds for these projects. Publication numbers: EPA-420-B-13-025 and EPA-420-P-11-001.

  17. #CleanTechNow

    ScienceCinema

    Moniz, Ernest

    2016-07-12

    Over the past four years, America's clean energy future has come into sharper focus. Yesterday's visionary goals are now hard data -- tangible evidence that our energy system is undergoing a transformation. The Energy Department's new paper "Revolution Now: The Future Arrives for Four Clean Energy Technologies" highlights these changes and shows how cost reductions and product improvements have sparked a surge in consumer demand for wind turbines, solar panels, electric cars and super efficient lighting.

  18. #CleanTechNow

    SciTech Connect

    Moniz, Ernest

    2013-09-17

    Over the past four years, America's clean energy future has come into sharper focus. Yesterday's visionary goals are now hard data -- tangible evidence that our energy system is undergoing a transformation. The Energy Department's new paper "Revolution Now: The Future Arrives for Four Clean Energy Technologies" highlights these changes and shows how cost reductions and product improvements have sparked a surge in consumer demand for wind turbines, solar panels, electric cars and super efficient lighting.

  19. GENERAL PURPOSE ADA PACKAGES

    NASA Technical Reports Server (NTRS)

    Klumpp, A. R.

    1994-01-01

    Ten families of subprograms are bundled together for the General-Purpose Ada Packages. The families bring to Ada many features from HAL/S, PL/I, FORTRAN, and other languages. These families are: string subprograms (INDEX, TRIM, LOAD, etc.); scalar subprograms (MAX, MIN, REM, etc.); array subprograms (MAX, MIN, PROD, SUM, GET, and PUT); numerical subprograms (EXP, CUBIC, etc.); service subprograms (DATE_TIME function, etc.); Linear Algebra II; Runge-Kutta integrators; and three text I/O families of packages. In two cases, a family consists of a single non-generic package. In all other cases, a family comprises a generic package and its instances for a selected group of scalar types. All generic packages are designed to be easily instantiated for the types declared in the user facility. The linear algebra package is LINRAG2. This package includes subprograms supplementing those in NPO-17985, An Ada Linear Algebra Package Modeled After HAL/S (LINRAG). Please note that LINRAG2 cannot be compiled without LINRAG. Most packages have widespread applicability, although some are oriented for avionics applications. All are designed to facilitate writing new software in Ada. Several of the packages use conventions introduced by other programming languages. A package of string subprograms is based on HAL/S (a language designed for the avionics software in the Space Shuttle) and PL/I. Packages of scalar and array subprograms are taken from HAL/S or generalized current Ada subprograms. A package of Runge-Kutta integrators is patterned after a built-in MAC (MIT Algebraic Compiler) integrator. Those packages modeled after HAL/S make it easy to translate existing HAL/S software to Ada. The General-Purpose Ada Packages program source code is available on two 360K 5.25" MS-DOS format diskettes. The software was developed using VAX Ada v1.5 under DEC VMS v4.5. It should be portable to any validated Ada compiler and it should execute either interactively or in batch. The largest package

  20. The ZOOM minimization package

    SciTech Connect

    Fischler, Mark S.; Sachs, D.; /Fermilab

    2004-11-01

    A new object-oriented Minimization package is available for distribution in the same manner as CLHEP. This package, designed for use in HEP applications, has all the capabilities of Minuit, but is a re-write from scratch, adhering to modern C++ design principles. A primary goal of this package is extensibility in several directions, so that its capabilities can be kept fresh with as little maintenance effort as possible. This package is distinguished by the priority that was assigned to C++ design issues, and the focus on producing an extensible system that will resist becoming obsolete.

  1. Cleaning without chlorinated solvents

    SciTech Connect

    Thompson, L.M.; Simandl, R.F.

    1994-12-31

    Because of health and environmental concerns, many regulations have been passed in recent years regarding the use of chlorinated solvents. The Oak Ridge Y-12 Plant has had an active program to find alternatives for these solvents used in cleaning applications for the past 7 years. During this time frame, the quantity of solvents purchased has been reduced by 92%. The program has been a twofold effort. Vapor degreasers used in batch cleaning-operations have been replaced by ultrasonic cleaning with aqueous detergent, and other organic solvents have been identified for use in hand-wiping or specialty operations. In order to qualify these alternatives for use, experimentation was conducted on cleaning ability as well as effects on subsequent operations such as welding, painting and bonding. Cleaning ability was determined using techniques such as X-ray photoelectron spectroscopy (XPS) and Fourier Transform Infrared Spectroscopy (FTIR) which are capable of examining monolayer levels of contamination on a surface. Solvents have been identified for removal of rust preventative oils, lapping oils, machining coolants, lubricants, greases, and mold releases. Solvents have also been evaluated for cleaning urethane foam spray guns, swelling of urethanes and swelling of epoxies.

  2. Cleaning without chlorinated solvents

    NASA Technical Reports Server (NTRS)

    Thompson, L. M.; Simandl, R. F.

    1995-01-01

    Because of health and environmental concerns, many regulations have been passed in recent years regarding the use of chlorinated solvents. The Oak Ridge Y-12 Plant has had an active program to find alternatives for these solvents used in cleaning applications for the past 7 years. During this time frame, the quantity of solvents purchased has been reduced by 92 percent. The program has been a twofold effort. Vapor degreasers used in batch cleaning operations have been replaced by ultrasonic cleaning with aqueous detergent, and other organic solvents have been identified for use in hand-wiping or specialty operations. In order to qualify these alternatives for use, experimentation was conducted on cleaning ability as well as effects on subsequent operations such as welding, painting, and bonding. Cleaning ability was determined using techniques such as x-ray photoelectron spectroscopy (XPS) and Fourier transform infrared spectroscopy (FTIR) which are capable of examining monolayer levels of contamination on a surface. Solvents have been identified for removal of rust preventative oils, lapping oils, machining coolants, lubricants, greases, and mold releases. Solvents have also been evaluated for cleaning urethane foam spray guns, swelling of urethanes, and swelling of epoxies.

  3. Ultrasonic cleaning of conveyor belt materials using Listeria monocytogenes as a model organism.

    PubMed

    Tolvanén, Riina; Lunden, Janne; Korkeala, Hannu; Wirtanen, Gun

    2007-03-01

    Persistent Listeria monocytogenes contamination of food industry equipment is a difficult problem to solve. Ultrasonic cleaning offers new possibilities for cleaning conveyors and other equipment that are not easy to clean. Ultrasonic cleaning was tested on three conveyor belt materials: polypropylene, acetal, and stainless steel (cold-rolled, AISI 304). Cleaning efficiency was tested at two temperatures (30 and 45 degrees C) and two cleaning times (30 and 60 s) with two cleaning detergents (KOH, and NaOH combined with KOH). Conveyor belt materials were soiled with milk-based soil and L. monocytogenes strains V1, V3, and B9, and then incubated for 72 h to attach bacteria to surfaces. Ultrasonic cleaning treatments reduced L. monocytogenes counts on stainless steel 4.61 to 5.90 log units; on acetal, 3.37 to 5.55 log units; and on polypropylene, 2.31 to 4.40 log units. The logarithmic reduction differences were statistically analyzed by analysis of variance using Statistical Package for the Social Sciences software. The logarithmic reduction was significantly greater in stainless steel than in plastic materials (P < 0.001 for polypropylene, P = 0.023 for acetal). Higher temperatures enhanced the cleaning efficiency in tested materials. No significant difference occurred between cleaning times. The logarithmic reduction was significantly higher (P = 0.013) in cleaning treatments with potassium hydroxide detergent. In this study, ultrasonic cleaning was efficient for cleaning conveyor belt materials.

  4. Next generation power electronics for space and aircraft. II - Packaging

    NASA Astrophysics Data System (ADS)

    Iversen, Arthur

    A class of semiconductor packaging incorporating a novel type of heat exchange process is described. The packaging technology is characterized by high power density, 0.005 kg/kW with beryllium construction, low junction to fluid specific thermal resistance 0.1-0.3 C/W(sq cm) for lower junction temperatures, and consequent improved reliability and increased efficiency, and rugged, hermetic, and low-cost construction. A curved surface cooling technology is incorporated into several package designs. Initial experiments with curved surface cooling have demonstrated a dissipation of 472 W/sq cm at rated junction temperature (150 C) for power MOSFETs. More important for high-reliability and high-efficiency applications is the demonstrated 60 C junction temperature at 200 W/sq cm dissipation. The packaging technology is substantially device transparent.

  5. Book of Knowledge (BOK) for NASA Electronic Packaging Roadmap

    NASA Technical Reports Server (NTRS)

    Ghaffarian, Reza

    2015-01-01

    The objective of this document is to update the NASA roadmap on packaging technologies (initially released in 2007) and to present the current trends toward further reducing size and increasing functionality. Due to the breadth of work being performed in the area of microelectronics packaging, this report presents only a number of key packaging technologies detailed in three industry roadmaps for conventional microelectronics and a more recently introduced roadmap for organic and printed electronics applications. The topics for each category were down-selected by reviewing the 2012 reports of the International Technology Roadmap for Semiconductor (ITRS), the 2013 roadmap reports of the International Electronics Manufacturing Initiative (iNEMI), the 2013 roadmap of association connecting electronics industry (IPC), the Organic Printed Electronics Association (OE-A). The report also summarizes the results of numerous articles and websites specifically discussing the trends in microelectronics packaging technologies.

  6. Multilayered Microelectronic Device Package With An Integral Window

    DOEpatents

    Peterson, Kenneth A.; Watson, Robert D.

    2004-10-26

    A microelectronic package with an integral window mounted in a recessed lip for housing a microelectronic device. The device can be a semiconductor chip, a CCD chip, a CMOS chip, a VCSEL chip, a laser diode, a MEMS device, or a IMEMS device. The package can be formed of a low temperature co-fired ceramic (LTCC) or high temperature cofired ceramic (HTCC) multilayered material, with the integral window being simultaneously joined (e.g. co-fired) to the package body during LTCC or HTCC processing. The microelectronic device can be flip-chip bonded and oriented so that a light-sensitive side is optically accessible through the window. The result is a compact, low profile package, having an integral window mounted in a recessed lip, that can be hermetically sealed.

  7. Sealed symmetric multilayered microelectronic device package with integral windows

    DOEpatents

    Peterson, Kenneth A.; Watson, Robert D.

    2002-01-01

    A sealed symmetric multilayered package with integral windows for housing one or more microelectronic devices. The devices can be a semiconductor chip, a CCD chip, a CMOS chip, a VCSEL chip, a laser diode, a MEMS device, or a IMEMS device. The multilayered package can be formed of a low-temperature cofired ceramic (LTCC) or high-temperature cofired ceramic (HTCC) multilayer processes with the windows being simultaneously joined (e.g. cofired) to the package body during LTCC or HTCC processing. The microelectronic devices can be flip-chip bonded and oriented so that the light-sensitive sides are optically accessible through the windows. The result is a compact, low-profile, sealed symmetric package, having integral windows that can be hermetically-sealed.

  8. Developing Large CAI Packages.

    ERIC Educational Resources Information Center

    Reed, Mary Jac M.; Smith, Lynn H.

    1983-01-01

    When developing large computer-assisted instructional (CAI) courseware packages, it is suggested that there be more attentive planning to the overall package design before actual lesson development is begun. This process has been simplified by modifying the systems approach used to develop single CAI lessons, followed by planning for the…

  9. WASTE PACKAGE TRANSPORTER DESIGN

    SciTech Connect

    D.C. Weddle; R. Novotny; J. Cron

    1998-09-23

    The purpose of this Design Analysis is to develop preliminary design of the waste package transporter used for waste package (WP) transport and related functions in the subsurface repository. This analysis refines the conceptual design that was started in Phase I of the Viability Assessment. This analysis supports the development of a reliable emplacement concept and a retrieval concept for license application design. The scope of this analysis includes the following activities: (1) Assess features of the transporter design and evaluate alternative design solutions for mechanical components. (2) Develop mechanical equipment details for the transporter. (3) Prepare a preliminary structural evaluation for the transporter. (4) Identify and recommend the equipment design for waste package transport and related functions. (5) Investigate transport equipment interface tolerances. This analysis supports the development of the waste package transporter for the transport, emplacement, and retrieval of packaged radioactive waste forms in the subsurface repository. Once the waste containers are closed and accepted, the packaged radioactive waste forms are termed waste packages (WP). This terminology was finalized as this analysis neared completion; therefore, the term disposal container is used in several references (i.e., the System Description Document (SDD)) (Ref. 5.6). In this analysis and the applicable reference documents, the term ''disposal container'' is synonymous with ''waste package''.

  10. Project Information Packages: Overview.

    ERIC Educational Resources Information Center

    RMC Research Corp., Mountain View, CA.

    This brochure describes a new series of Project Information Packages, a U.S. Office of Education response to the need for a systematic approach to disseminating exemplary projects. The packages describe procedures for developing the necessary administrative support and management framework, as well as instructional methods and techniques. The six…

  11. Packaging issues: avoiding delamination.

    PubMed

    Hall, R

    2005-10-01

    Manufacturers can minimise delamination occurrence by applying the appropriate packaging design and process features. The end user can minimise the impact of fibre tear and reduce subsequent delamination by careful package opening. The occasional inconvenient delamination is a small price to pay for the high level of sterility assurance that comes with the use of Tyvek.

  12. Enhanced thermaly managed packaging for III-nitride light emitters

    NASA Astrophysics Data System (ADS)

    Kudsieh, Nicolas

    In this Dissertation our work on `enhanced thermally managed packaging of high power semiconductor light sources for solid state lighting (SSL)' is presented. The motivation of this research and development is to design thermally high stable cost-efficient packaging of single and multi-chip arrays of III-nitrides wide bandgap semiconductor light sources through mathematical modeling and simulations. Major issues linked with this technology are device overheating which causes serious degradation in their illumination intensity and decrease in the lifetime. In the introduction the basics of III-nitrides WBG semiconductor light emitters are presented along with necessary thermal management of high power cingulated and multi-chip LEDs and laser diodes. This work starts at chip level followed by its extension to fully packaged lighting modules and devices. Different III-nitride structures of multi-quantum well InGaN/GaN and AlGaN/GaN based LEDs and LDs were analyzed using advanced modeling and simulation for different packaging designs and high thermal conductivity materials. Study started with basic surface mounted devices using conventional packaging strategies and was concluded with the latest thermal management of chip-on-plate (COP) method. Newly discovered high thermal conductivity materials have also been incorporated for this work. Our study also presents the new approach of 2D heat spreaders using such materials for SSL and micro LED array packaging. Most of the work has been presented in international conferences proceedings and peer review journals. Some of the latest work has also been submitted to well reputed international journals which are currently been reviewed for publication. .

  13. Semiconductor Solar Superabsorbers

    PubMed Central

    Yu, Yiling; Huang, Lujun; Cao, Linyou

    2014-01-01

    Understanding the maximal enhancement of solar absorption in semiconductor materials by light trapping promises the development of affordable solar cells. However, the conventional Lambertian limit is only valid for idealized material systems with weak absorption, and cannot hold for the typical semiconductor materials used in solar cells due to the substantial absorption of these materials. Herein we theoretically demonstrate the maximal solar absorption enhancement for semiconductor materials and elucidate the general design principle for light trapping structures to approach the theoretical maximum. By following the principles, we design a practical light trapping structure that can enable an ultrathin layer of semiconductor materials, for instance, 10 nm thick a-Si, absorb > 90% sunlight above the bandgap. The design has active materials with one order of magnitude less volume than any of the existing solar light trapping designs in literature. This work points towards the development of ultimate solar light trapping techniques. PMID:24531211

  14. Isotopically controlled semiconductors

    SciTech Connect

    Haller, E.E.

    2004-11-15

    A review of recent research involving isotopically controlled semiconductors is presented. Studies with isotopically enriched semiconductor structures experienced a dramatic expansion at the end of the Cold War when significant quantities of enriched isotopes of elements forming semiconductors became available for worldwide collaborations. Isotopes of an element differ in nuclear mass, may have different nuclear spins and undergo different nuclear reactions. Among the latter, the capture of thermal neutrons which can lead to neutron transmutation doping, can be considered the most important one for semiconductors. Experimental and theoretical research exploiting the differences in all the properties has been conducted and will be illustrated with selected examples. Manuel Cardona, the longtime editor-in-chief of Solid State Communications has been and continues to be one of the major contributors to this field of solid state physics and it is a great pleasure to dedicate this review to him.

  15. Aqueous cleaning design presentation

    NASA Technical Reports Server (NTRS)

    Maltby, Peter F.

    1995-01-01

    The phase-out of CFC's and other ozone depleting chemicals has prompted industries to re-evaluate their present methods of cleaning. It has become necessary to find effective substitutes for their processes as well as to meet the new cleaning challenges of improved levels of cleanliness and to satisfy concerns about environmental impact of any alternative selected. One of the most popular alternatives being selected is aqueous cleaning. This method offers an alternative for removal of flux, grease/oil, buffing compound, particulates and other soils while minimizing environmental impact. What I will show are methods that can be employed in an aqueous cleaning system that will make it environmentally friendly, relatively simple to maintain and capable of yielding an even higher quality of cleanliness than previously obtained. I will also explore several drying techniques available for these systems and other alternatives along with recent improvements made in this technology. When considering any type of cleaning system, a number of variables should be determined before selecting the basic configuration. Some of these variables are: (1) Soil or contaminants being removed from your parts; (2) The level of cleanliness required; (3) The environmental considerations of your area; (4) Maintenance requirements; and (5) Operating costs.

  16. Semiconductor Nanocrystal Photonics

    DTIC Science & Technology

    2005-08-31

    D. Krauss, C. B. Poitras, and M. Lipson, " Energy transfer between colloidal semiconductor quantum dots in an optical microcavity," (submitted, 2006...Phys. Lett. 82, 4032 (2003). J. J. Peterson and T. D. Krauss, "Fluorescence Spectroscopy of Single Lead Sulfide Quantum Dots ," Nano Lett. (in press...Guo, Xiaowei Teng, Hong Yang, Todd D. Krauss, Carl B. Poitras, and Michal Lipson, "Enhanced Energy Transfer between Colloidal Semiconductor Quantum

  17. SILICON CARBIDE FOR SEMICONDUCTORS

    DTIC Science & Technology

    This state-of-the-art survey on silicon carbide for semiconductors includes a bibliography of the most important references published as of the end...of 1964. The various methods used for growing silicon carbide single crystals are reviewed, as well as their properties and devices fabricated from...them. The fact that the state of-the-art of silicon carbide semiconductors is not further advanced may be attributed to the difficulties of growing

  18. Aging of clean foams

    NASA Astrophysics Data System (ADS)

    Weon, Byung Mook; Stewart, Peter S.

    2014-11-01

    Aging is an inevitable process in living systems. Here we show how clean foams age with time through sequential coalescence events: in particular, foam aging resembles biological aging. We measure population dynamics of bubbles in clean foams through numerical simulations with a bubble network model. We demonstrate that death rates of individual bubbles increase exponentially with time, independent on initial conditions, which is consistent with the Gompertz mortality law as usually found in biological aging. This consistency suggests that clean foams as far-from-equilibrium dissipative systems are useful to explore biological aging. This work (NRF-2013R1A22A04008115) was supported by Mid-career Researcher Program through NRF grant funded by the MEST.

  19. Packaging Concerns/Techniques for Large Devices

    NASA Technical Reports Server (NTRS)

    Sampson, Michael J.

    2009-01-01

    This slide presentation reviews packaging challenges and options for electronic parts. The presentation includes information about non-hermetic packages, space challenges for packaging and complex package variations.

  20. UV/Ozone Cleaning For Organics Removal On Silicon Wafers

    NASA Astrophysics Data System (ADS)

    Zafonte, Leo; Chiu, Rafael

    1984-06-01

    The feasibility for using a combination of ultraviolet light and ozone - UV/Ozone Cleaning - for organics removal and photoresist residue cleaning from silicon semiconductor wafers was investigated. The process generates a highly oxidative atmosphere that is specific for removing trace organic residues. Product of the reactions are carbon dioxide and water. In most cases, stable inorganic materials such as oxide coatings remain unaffected. UV/Ozone exposure of silicon causes formation of a thin layer of silicon oxide that tends to retard further oxidation of the silicon. Based on the expected photochemistry o," this process, specific enhancements to accelerate the cleaning rates were tested. The enhancements involved the use of both gas phase and liquio phase additives, and comparative rates of removal were determined. The technique was tested on several photoresists, potential organic residues, and common solvent systems. The photoresists studies were primarily positive resists and were tested at several levels of ion implantation. The results of the testing suggests that the highest potential applications of UV/Ozone Cleaning in the processing of semiconductor wafers include: a) Removal of solvent residues and process contaminants. b) A pre-process step to insure cleanliness by removal of residual organic or airborne organic contaminants. c) As a post-process step to insure cleanliness or to remove trace organics.

  1. Alternative Packaging for Back-Illuminated Imagers

    NASA Technical Reports Server (NTRS)

    Pain, Bedabrata

    2009-01-01

    An alternative scheme has been conceived for packaging of silicon-based back-illuminated, back-side-thinned complementary metal oxide/semiconductor (CMOS) and charge-coupled-device image-detector integrated circuits, including an associated fabrication process. This scheme and process are complementary to those described in "Making a Back-Illuminated Imager With Back-Side Connections" (NPO-42839), NASA Tech Briefs, Vol. 32, No. 7 (July 2008), page 38. To avoid misunderstanding, it should be noted that in the terminology of imaging integrated circuits, "front side" or "back side" does not necessarily refer to the side that, during operation, faces toward or away from a source of light or other object to be imaged. Instead, "front side" signifies that side of a semiconductor substrate upon which the pixel pattern and the associated semiconductor devices and metal conductor lines are initially formed during fabrication, and "back side" signifies the opposite side. If the imager is of the type called "back-illuminated," then the back side is the one that faces an object to be imaged. Initially, a back-illuminated, back-side-thinned image-detector is fabricated with its back side bonded to a silicon handle wafer. At a subsequent stage of fabrication, the front side is bonded to a glass wafer (for mechanical support) and the silicon handle wafer is etched away to expose the back side. The frontside integrated circuitry includes metal input/output contact pads, which are rendered inaccessible by the bonding of the front side to the glass wafer. Hence, one of the main problems is to make the input/output contact pads accessible from the back side, which is ultimately to be the side accessible to the external world. The present combination of an alternative packaging scheme and associated fabrication process constitute a solution of the problem.

  2. Acceptance Data Package: SXI Stepper Motor/Encoder. Aeroflex P/N 16187. A; Engineering Drawings and Associated Lists

    NASA Technical Reports Server (NTRS)

    1994-01-01

    Acceptance data package - engineering drawings and associated lists for fabrication, assembly and maintenance (cleaning, fluidized bed coating, bounding and staking) motor/encoded solar x-ray imager (SXI) (Aeroflex p/n 16187) were given.

  3. Thermally robust semiconductor optical amplifiers and laser diodes

    DOEpatents

    Dijaili, Sol P.; Patterson, Frank G.; Walker, Jeffrey D.; Deri, Robert J.; Petersen, Holly; Goward, William

    2002-01-01

    A highly heat conductive layer is combined with or placed in the vicinity of the optical waveguide region of active semiconductor components. The thermally conductive layer enhances the conduction of heat away from the active region, which is where the heat is generated in active semiconductor components. This layer is placed so close to the optical region that it must also function as a waveguide and causes the active region to be nearly the same temperature as the ambient or heat sink. However, the semiconductor material itself should be as temperature insensitive as possible and therefore the invention combines a highly thermally conductive dielectric layer with improved semiconductor materials to achieve an overall package that offers improved thermal performance. The highly thermally conductive layer serves two basic functions. First, it provides a lower index material than the semiconductor device so that certain kinds of optical waveguides may be formed, e.g., a ridge waveguide. The second and most important function, as it relates to this invention, is that it provides a significantly higher thermal conductivity than the semiconductor material, which is the principal material in the fabrication of various optoelectronic devices.

  4. STRUMPACK -- STRUctured Matrices PACKage

    SciTech Connect

    2014-12-01

    STRUMPACK - STRUctured Matrices PACKage - is a package for computations with sparse and dense structured matrix, i.e., matrices that exhibit some kind of low-rank property, in particular Hierarchically Semi Separable structure (HSS). Such matrices appear in many applications, e.g., FEM, BEM, Integral equations. etc. Exploiting this structure using certain compression algorithms allow for fast solution of linear systems and/or fast computation of matrix-vector products, which are the two main building blocks of matrix computations. STRUMPACK has presently two main components: a distributed-memory dense matrix computations package and a shared-memory sparse direct solver.

  5. Precision cleaning apparatus and method

    DOEpatents

    Schneider, T.W.; Frye, G.C.; Martin, S.J.

    1998-01-13

    A precision cleaning apparatus and method are disclosed. The precision cleaning apparatus includes a cleaning monitor further comprising an acoustic wave cleaning sensor such as a quartz crystal microbalance (QCM), a flexural plate wave (FPW) sensor, a shear horizontal acoustic plate mode (SH--APM) sensor, or a shear horizontal surface acoustic wave (SH--SAW) sensor; and measurement means connectable to the sensor for measuring in-situ one or more electrical response characteristics that vary in response to removal of one or more contaminants from the sensor and a workpiece located adjacent to the sensor during cleaning. Methods are disclosed for precision cleaning of one or more contaminants from a surface of the workpiece by means of the cleaning monitor that determines a state of cleanliness and any residual contamination that may be present after cleaning; and also for determining an effectiveness of a cleaning medium for removing one or more contaminants from a workpiece. 11 figs.

  6. Precision cleaning apparatus and method

    DOEpatents

    Schneider, Thomas W.; Frye, Gregory C.; Martin, Stephen J.

    1998-01-01

    A precision cleaning apparatus and method. The precision cleaning apparatus includes a cleaning monitor further comprising an acoustic wave cleaning sensor such as a quartz crystal microbalance (QCM), a flexural plate wave (FPW) sensor, a shear horizontal acoustic plate mode (SH--APM) sensor, or a shear horizontal surface acoustic wave (SH--SAW) sensor; and measurement means connectable to the sensor for measuring in-situ one or more electrical response characteristics that vary in response to removal of one or more contaminants from the sensor and a workpiece located adjacent to the sensor during cleaning. Methods are disclosed for precision cleaning of one or more contaminants from a surface of the workpiece by means of the cleaning monitor that determines a state of cleanliness and any residual contamination that may be present after cleaning; and also for determining an effectiveness of a cleaning medium for removing one or more contaminants from a workpiece.

  7. Active and Intelligent Packaging: The Indication of Quality and Safety.

    PubMed

    Janjarasskul, Theeranun; Suppakul, Panuwat

    2016-09-19

    The food industry has been under growing pressure to feed an exponentially increasing world population and challenged to meet rigorous food safety law and regulation. The plethora of media consumption has provoked consumer demand for safe, sustainable, organic, and wholesome products with "clean" labels. The application of active and intelligent packaging has been commercially adopted by food and pharmaceutical industries as a solution for the future for extending shelf life and simplifying production processes; facilitating complex distribution logistics; reducing, if not eliminating the need for preservatives in food formulations; enabling restricted food packaging applications; providing convenience, improving quality, variety and marketing features; as well as providing essential information to ensure consumer safety. This chapter reviews innovations of active and intelligent packaging which advance packaging technology through both scavenging and releasing systems for shelf life extension, and through diagnostic and identification systems for communicating quality, tracking and brand protection.

  8. A benchmark investigation on cleaning photomasks using wafer cleaning technologies

    NASA Astrophysics Data System (ADS)

    Kindt, Louis; Burnham, Jay; Marmillion, Pat

    2004-12-01

    As new technologies are developed for smaller linewidths, the specifications for mask cleanliness become much stricter. Not only must the particle removal efficiency increase, but the largest allowable particle size decreases. Specifications for film thickness and surface roughness are becoming tighter and consequently the integrity of these films must be maintained in order to preserve the functionality of the masks. Residual contamination remaining on the surface of the mask after cleaning processes can lead to subpellicle defect growth once the mask is exposed in a stepper environment. Only during the last several years, has an increased focus been put on improving mask cleaning. Over the years, considerably more effort has been put into developing advanced wafer cleaning technologies. However, because of the small market involved with mask cleaning, wafer cleaning equipment vendors have been reluctant to invest time and effort into developing cleaning processes and adapting their toolset to accommodate masks. With the advent of 300 mm processing, wafer cleaning tools are now more easily adapted to processing masks. These wafer cleaning technologies may offer a solution to the difficulties of mask cleaning and need to be investigated to determine whether or not they warrant continued investigation. This paper focuses on benchmarking advanced wafer cleaning technologies applied to mask cleaning. Ozonated water, hydrogenated water, super critical fluids, and cryogenic cleaning have been investigated with regards to stripping resist and cleaning particles from masks. Results that include film thickness changes, surface contamination, and particle removal efficiency will be discussed.

  9. Metal Contacts on Semiconductors.

    DTIC Science & Technology

    1987-04-01

    alkali metal Na. The transition metals are all highly reactive with clean InP, and give a range of Schottky barriers between ohmic and 0.4 eV. We have...also investigated Schottky barriers for thick films of these metals deposited on clean cleaved (110) InP, surfaces, by I-V and C-V technLqueSg) This...interesting case. When deposited on clean GaAs (110) surfaces it yields a Schottky barrier height comparable with those for metals such as A, Ni, Ap and Au

  10. The Clean Air Game.

    ERIC Educational Resources Information Center

    Avalone-King, Deborah

    2000-01-01

    Introduces the Clean Air game which teaches about air quality and its vital importance for life. Introduces students to air pollutants, health of people and environment, and possible actions individuals can take to prevent air pollution. Includes directions for the game. (YDS)

  11. Acrylic vessel cleaning tests

    SciTech Connect

    Earle, D.; Hahn, R.L.; Boger, J.; Bonvin, E.

    1997-02-26

    The acrylic vessel as constructed is dirty. The dirt includes blue tape, Al tape, grease pencil, gemak, the glue or residue form these tapes, finger prints and dust of an unknown composition but probably mostly acrylic dust. This dirt has to be removed and once removed, the vessel has to be kept clean or at least to be easily cleanable at some future stage when access becomes much more difficult. The authors report on the results of a series of tests designed: (a) to prepare typical dirty samples of acrylic; (b) to remove dirt stuck to the acrylic surface; and (c) to measure the optical quality and Th concentration after cleaning. Specifications of the vessel call for very low levels of Th which could come from tape residues, the grease pencil, or other sources of dirt. This report does not address the concerns of how to keep the vessel clean after an initial cleaning and during the removal of the scaffolding. Alconox is recommended as the cleaner of choice. This acrylic vessel will be used in the Sudbury Neutrino Observatory.

  12. Keep It Clean.

    ERIC Educational Resources Information Center

    Griffin, William R.

    1998-01-01

    Offers ideas for cleaning and maintenance management of school food service areas to avoid possible waste, injuries, unsanitary conditions, and unnecessary risk to those using the facilities. Includes a self-inspection checklist and a list of the 12 essentials for managing toward cleaner facilities. (GR)

  13. Clean Cities Tools

    SciTech Connect

    2014-12-19

    The U.S. Department of Energy's Clean Cities offers a large collection of Web-based tools on the Alternative Fuels Data Center. These calculators, interactive maps, and data searches can assist fleets, fuels providers, and other transportation decision makers in their efforts to reduce petroleum use.

  14. Clean, Agile Processing Technology.

    DTIC Science & Technology

    1997-12-01

    Research ltr dtd 10 Jun 98 THIS PAGE IS UNCLASSIFIED FINAL REPORT CLEAN, AGILE PROCESSING TECHNOLOGY Contract # N00014-96-C-0139 PI: S. W . Sinton...Agile Processing Technology . T UNCLAS I N Sinton, S. W.IN S REQUIRED FOR (Explain needin detaiO E C This document is requested by the Canadian Department

  15. Road-Cleaning Device

    ERIC Educational Resources Information Center

    Roman, Harry T.

    2014-01-01

    Roadways are literally soaked with petrochemical byproducts, oils, gasoline, and other volatile substances that eventually run off into sewers and end up in rivers, waterways, and other undesirable places. Can the roads be cleaned of these wastes, with their proper disposal? Can vehicles, robots, or other devices be designed that could be driven…

  16. Super Clean, Super Safe

    NASA Technical Reports Server (NTRS)

    2002-01-01

    The Supersonic Gas/Liquid Cleaning System (SS-GLCS) has applications ranging from cleaning circuit boards to scouring building exteriors. The system does not abrade the surface of the hardware being cleaned, and it requires much lower levels of pressure while using very little water. An alternative to CFC-based solvents, the system mixes air and water from separate pressurized tanks, ejecting the gas- liquid mixture at supersonic speeds from a series of nozzles at the end of a hand-held wand. The water droplets have the kinetic energy to forcibly remove the contaminant material. The system leaves very little fluid that must be handled as contaminated waste. It can be applied in the aerospace, automotive, and medical industries, as well as to circuit boards, electronics, machinery, metals, plastics, and optics. With a nozzle that can be oriented in any direction, the system is adjustable to allow all sides of a part to be cleaned without reorientation. It requires minimal training and is easily moved on built-in casters

  17. Method of doping a semiconductor

    DOEpatents

    Yang, Chiang Y.; Rapp, Robert A.

    1983-01-01

    A method for doping semiconductor material. An interface is established between a solid electrolyte and a semiconductor to be doped. The electrolyte is chosen to be an ionic conductor of the selected impurity and the semiconductor material and electrolyte are jointly chosen so that any compound formed from the impurity and the semiconductor will have a free energy no lower than the electrolyte. A potential is then established across the interface so as to allow the impurity ions to diffuse into the semiconductor. In one embodiment the semiconductor and electrolyte may be heated so as to increase the diffusion coefficient.

  18. Packaging for Posterity.

    ERIC Educational Resources Information Center

    Sias, Jim

    1990-01-01

    A project in which students designed environmentally responsible food packaging is described. The problem definition; research on topics such as waste paper, plastic, metal, glass, incineration, recycling, and consumer preferences; and the presentation design are provided. (KR)

  19. Pipe Cleaning Operating Procedures

    SciTech Connect

    Clark, D.; Wu, J.; /Fermilab

    1991-01-24

    This cleaning procedure outlines the steps involved in cleaning the high purity argon lines associated with the DO calorimeters. The procedure is broken down into 7 cycles: system setup, initial flush, wash, first rinse, second rinse, final rinse and drying. The system setup involves preparing the pump cart, line to be cleaned, distilled water, and interconnecting hoses and fittings. The initial flush is an off-line flush of the pump cart and its plumbing in order to preclude contaminating the line. The wash cycle circulates the detergent solution (Micro) at 180 degrees Fahrenheit through the line to be cleaned. The first rinse is then intended to rid the line of the majority of detergent and only needs to run for 30 minutes and at ambient temperature. The second rinse (if necessary) should eliminate the remaining soap residue. The final rinse is then intended to be a check that there is no remaining soap or other foreign particles in the line, particularly metal 'chips.' The final rinse should be run at 180 degrees Fahrenheit for at least 90 minutes. The filters should be changed after each cycle, paying particular attention to the wash cycle and the final rinse cycle return filters. These filters, which should be bagged and labeled, prove that the pipeline is clean. Only distilled water should be used for all cycles, especially rinsing. The level in the tank need not be excessive, merely enough to cover the heater float switch. The final rinse, however, may require a full 50 gallons. Note that most of the details of the procedure are included in the initial flush description. This section should be referred to if problems arise in the wash or rinse cycles.

  20. Battery packaging - Technology review

    SciTech Connect

    Maiser, Eric

    2014-06-16

    This paper gives a brief overview of battery packaging concepts, their specific advantages and drawbacks, as well as the importance of packaging for performance and cost. Production processes, scaling and automation are discussed in detail to reveal opportunities for cost reduction. Module standardization as an additional path to drive down cost is introduced. A comparison to electronics and photovoltaics production shows 'lessons learned' in those related industries and how they can accelerate learning curves in battery production.

  1. Electronic Packaging Techniques

    NASA Technical Reports Server (NTRS)

    1979-01-01

    A characteristic of aerospace system design is that equipment size and weight must always be kept to a minimum, even in small components such as electronic packages. The dictates of spacecraft design have spawned a number of high-density packaging techniques, among them methods of connecting circuits in printed wiring boards by processes called stitchbond welding and parallel gap welding. These processes help designers compress more components into less space; they also afford weight savings and lower production costs.

  2. Optical Design of Plant Canopy Measurement System and Fabrication of Two-Dimensional High-Speed Metal-Semiconductor-Metal Photodetector Arrays

    NASA Technical Reports Server (NTRS)

    Sarto, Anthony; VanZeghbroeck, Bart; Vanderbilt, Vern C.

    1996-01-01

    Electrical and optical designs for the prototype plant canopy architecture measurement system, including specified component and parts lists, are presented. Six single Metal-Semiconductor-Metal (MSM) detectors are mounted in high-speed packages.

  3. Comparative Packaging Study

    NASA Technical Reports Server (NTRS)

    Perchonok, Michele H.; Oziomek, Thomas V.

    2009-01-01

    Future long duration manned space flights beyond low earth orbit will require the food system to remain safe, acceptable and nutritious. Development of high barrier food packaging will enable this requirement by preventing the ingress and egress of gases and moisture. New high barrier food packaging materials have been identified through a trade study. Practical application of this packaging material within a shelf life test will allow for better determination of whether this material will allow the food system to meet given requirements after the package has undergone processing. The reason to conduct shelf life testing, using a variety of packaging materials, stems from the need to preserve food used for mission durations of several years. Chemical reactions that take place during longer durations may decrease food quality to a point where crew physical or psychological well-being is compromised. This can result in a reduction or loss of mission success. The rate of chemical reactions, including oxidative rancidity and staling, can be controlled by limiting the reactants, reducing the amount of energy available to drive the reaction, and minimizing the amount of water available. Water not only acts as a media for microbial growth, but also as a reactant and means by which two reactants may come into contact with each other. The objective of this study is to evaluate three packaging materials for potential use in long duration space exploration missions.

  4. a Study of Some Metal-Semiconductor Interfaces.

    NASA Astrophysics Data System (ADS)

    Maani, Colette

    Available from UMI in association with The British Library. The aim of this study was to investigate a number of specific metal-semiconductor interfaces with the goal of understanding the mechanism responsible for Schottky barrier formation at these interfaces. Metal contacts of group III, gallium, and group V, antimony were evaporated onto the clean cleaved indium phosphide(110) surface. Techniques of low energy electron defraction, Auger electron spectroscopy, ultra violet and X-ray photoelectric spectroscopy, current-voltage and capacitance -voltage measurements were used to probe the structural, chemical and electronic nature of the metal-semiconductor interfaces formed. In addition metal contacts of Al, Ag, Au and Sn were evaporated onto the clean cleaved gallium phosphide(110) surface. Techniques of current-voltage, capacitance-voltage and photoresponse measurements were used in order to determine barrier height. The study of Ga and Sb on InP(110) was used to investigate the importance of chemical reactivity, growth mode, defect formation and interdiffusion at the interface. The investigation of a range of metals on GaP(110) was an attempt to understand metal-semiconductor Schottky barrier formation in terms of this wide band gap material. Both studies were used to test the relevance of various proposed models of Schottky barrier formation at metal-semiconductor interfaces. (Abstract shortened by UMI.).

  5. A microwave plasma cleaning apparatus

    NASA Technical Reports Server (NTRS)

    Tsai, C. C.; Nelson, W. D.; Schechter, D. E.; Thompson, L. M.; Glover, A. L.

    1995-01-01

    In a microwave electron cyclotron resonance plasma source, reactive plasmas of oxygen and its mixtures of argon have been used for evaluating plasma cleaning technologies. Small aluminum samples (0.95 x 1.9 cm) were coated with thin films (less than or equal to 20 micrometers in thickness) of Shell Vitrea oil and cleaned with reactive plasmas. The discharge parameters, such as gas pressure, magnetic field, substrate biasing, and microwave power, were varied to change cleaning conditions. A mass spectroscopy (or residual gas analyzer) was used to monitor the status of plasma cleaning. Mass loss of the samples after plasma cleaning was measured to estimate cleaning rates. Measured cleaning rates of low-pressure (0.5-m torr) argon/oxygen plasmas were as high as 2.7 micrometers/min. X-ray photoelectron spectroscopy was used to determine cleanliness of the sample surfaces. In this paper, significant results of the plasma cleaning are reported and discussed.

  6. Mouse Cleaning Apparatus and Method

    NASA Technical Reports Server (NTRS)

    Williams, Glenn L. (Inventor)

    2005-01-01

    The method of using the mouse pad cleaning apparatus is disclosed and claimed. The method comprises the steps of uncovering the mouse cleaning surface, applying the mouse and ball of the mouse to the cleaning surface, moving the mouse in a rotational pattern on the mouse cleaning surface, removing the mouse form the mouse cleaning surface, washing the cleaning surface, and covering the mouse cleaning surface. A mouse pad cleaning apparatus comprising a plurality of substrates, each said substrate having adhesive thereon, said plurality of substrates residing in and affixed to a receptacle. A single substrate having adhesive, which may be washable or non-washable, thereon may be employed. The washable adhesive may be an organopolysiloxane or gelatinous elastomer.

  7. Automated cleaning of electronic components

    SciTech Connect

    Drotning, W.; Meirans, L.; Wapman, W.; Hwang, Y.; Koenig, L.; Petterson, B.

    1994-07-01

    Environmental and operator safety concerns are leading to the elimination of trichloroethylene and chlorofluorocarbon solvents in cleaning processes that remove rosin flux, organic and inorganic contamination, and particulates from electronic components. Present processes depend heavily on these solvents for manual spray cleaning of small components and subassemblies. Use of alternative solvent systems can lead to longer processing times and reduced quality. Automated spray cleaning can improve the quality of the cleaning process, thus enabling the productive use of environmentally conscious materials, while minimizing personnel exposure to hazardous materials. We describe the development of a prototype robotic system for cleaning electronic components in a spray cleaning workcell. An important feature of the prototype system is the capability to generate the robot paths and motions automatically from the CAD models of the part to be cleaned, and to embed cleaning process knowledge into the automatically programmed operations.

  8. Clean Energy Solutions Center Services

    SciTech Connect

    2016-03-01

    The Solutions Center offers no-cost expert policy assistance, webinars and training forums, clean energy policy reports, data, and tools provided in partnership with more than 35 leading international and regional clean energy organizations.

  9. RH Packaging Program Guidance

    SciTech Connect

    Washington TRU Solutions LLC

    2008-01-12

    The purpose of this program guidance document is to provide the technical requirements for use, operation, inspection, and maintenance of the RH-TRU 72-B Waste Shipping Package (also known as the "RH-TRU 72-B cask") and directly related components. This document complies with the requirements as specified in the RH-TRU 72-B Safety Analysis Report for Packaging (SARP), and Nuclear Regulatory Commission (NRC) Certificate of Compliance (C of C) 9212. If there is a conflict between this document and the SARP and/or C of C, the C of C shall govern. The C of C states: "...each package must be prepared for shipment and operated in accordance with the procedures described in Chapter 7.0, Operating Procedures, of the application." It further states: "...each package must be tested and maintained in accordance with the procedures described in Chapter 8.0, Acceptance Tests and Maintenance Program of the Application." Chapter 9.0 of the SARP tasks the Waste Isolation Pilot Plant (WIPP) Management and Operating (M&O) Contractor with assuring the packaging is used in accordance with the requirements of the C of C. Because the packaging is NRC-approved, users need to be familiar with Title 10 Code of Federal Regulations (CFR) §71.8, "Deliberate Misconduct." Any time a user suspects or has indications that the conditions of approval in the C of C were not met, the U.S. Department of Energy (DOE) Carlsbad Field Office (CBFO) shall be notified immediately. The CBFO will evaluate the issue and notify the NRC if required.In accordance with 10 CFR Part 71, "Packaging and Transportation of Radioactive Material," certificate holders, packaging users, and contractors or subcontractors who use, design, fabricate, test, maintain, or modify the packaging shall post copies of (1) 10 CFR Part 21, "Reporting of Defects and Noncompliance," regulations, (2) Section 206 of the Energy Reorganization Act of 1974, and (3) NRC Form 3, Notice to Employees. These documents must be posted in a

  10. CH Packaging Program Guidance

    SciTech Connect

    None, None

    2008-09-11

    The purpose of this document is to provide the technical requirements for preparation for use, operation, inspection, and maintenance of a Transuranic Package Transporter Model II (TRUPACT-II), a HalfPACT shipping package, and directly related components. This document complies with the minimum requirements as specified in the TRUPACT-II Safety Analysis Report for Packaging (SARP), HalfPACT SARP, and U.S. Nuclear Regulatory Commission (NRC) Certificates of Compliance (C of C) 9218 and 9279, respectively. In the event of a conflict between this document and the SARP or C of C, the C of C shall govern. The C of Cs state: "each package must be prepared for shipment and operated in accordance with the procedures described in Chapter 7.0, Operating Procedures, of the pplication." They further state: "each package must be tested and maintained in accordance with the procedures described in Chapter 8.0, Acceptance Tests and Maintenance Program of the Application." Chapter 9.0 of the SARP charges the U.S. Department of Energy (DOE) or the Waste Isolation Pilot Plant (WIPP) management and operating (M&O) contractor with assuring packaging is used in accordance with the requirements of the C of C. Because the packaging is NRC-approved, users need to be familiar with Title 10 Code of Federal Regulations (CFR) §71.8. Any time a user suspects or has indications that the conditions of approval in the C of C were not met, the Carlsbad Field Office (CBFO) shall be notified immediately. The CBFO will evaluate the issue and notify the NRC if required. In accordance with 10 CFR Part 71, certificate holders, packaging users, and contractors or subcontractors who use, design, fabricate, test, maintain, or modify the packaging shall post copies of (1) 10 CFR Part 21 regulations, (2) Section 206 of the Energy Reorganization Act of 1974, and (3) NRC Form 3, Notice to Employees. These documents must be posted in a conspicuous location where the activities subject to these regulations are

  11. CH Packaging Program Guidance

    SciTech Connect

    None, None

    2009-06-01

    The purpose of this document is to provide the technical requirements for preparation for use, operation, inspection, and maintenance of a Transuranic Package Transporter Model II (TRUPACT-II), a HalfPACT shipping package, and directly related components. This document complies with the minimum requirements as specified in the TRUPACT-II Safety Analysis Report for Packaging (SARP), HalfPACT SARP, and U.S. Nuclear Regulatory Commission (NRC) Certificates of Compliance (C of C) 9218 and 9279, respectively. In the event of a conflict between this document and the SARP or C of C, the C of C shall govern. The C of Cs state: "each package must be prepared for shipment and operated in accordance with the procedures described in Chapter 7.0, Operating Procedures, of the application." They further state: "each package must be tested and maintained in accordance with the procedures described in Chapter 8.0, Acceptance Tests and Maintenance Program of the Application." Chapter 9.0 of the SARP charges the U.S. Department of Energy (DOE) or the Waste Isolation Pilot Plant (WIPP) management and operating (M&O) contractor with assuring packaging is used in accordance with the requirements of the C of C. Because the packaging is NRC-approved, users need to be familiar with Title 10 Code of Federal Regulations (CFR) §71.8. Any time a user suspects or has indications that the conditions of approval in the C of C were not met, the Carlsbad Field Office (CBFO) shall be notified immediately. The CBFO will evaluate the issue and notify the NRC if required. In accordance with 10 CFR Part 71, certificate holders, packaging users, and contractors or subcontractors who use, design, fabricate, test, maintain, or modify the packaging shall post copies of (1) 10 CFR Part 21 regulations, (2) Section 206 of the Energy Reorganization Act of 1974, and (3) NRC Form 3, Notice to Employees. These documents must be posted in a conspicuous location where the activities subject to these regulations are

  12. Semiconductor surface protection material

    NASA Technical Reports Server (NTRS)

    Packard, R. D. (Inventor)

    1973-01-01

    A method and a product for protecting semiconductor surfaces is disclosed. The protective coating material is prepared by heating a suitable protective resin with an organic solvent which is solid at room temperature and converting the resulting solution into sheets by a conventional casting operation. Pieces of such sheets of suitable shape and thickness are placed on the semiconductor areas to be coated and heat and vacuum are then applied to melt the sheet and to drive off the solvent and cure the resin. A uniform adherent coating, free of bubbles and other defects, is thus obtained exactly where it is desired.

  13. Quantum Transport in Semiconductors

    DTIC Science & Technology

    1991-10-01

    SRS i 91 4. TITLE AND SUBTITLE Quantum Transport in Semiconductors 5. FUNDING NUMBER söMtos-rizk-ooss 6. AUTHOR(S) D. K. Ferry ©fte ELECTE...OF ABSTRACT UL NSN 7540-01-280-5500 O 1 9 Standard Form 298 (Rev. 2-89) Presented by ANSI Std «9-18 298-102 Final Report Quantum Transport in... Quantum Transport in Semiconductor Devices This final report describes a program of research investigating quantum effects which become important in

  14. GUARD RING SEMICONDUCTOR JUNCTION

    DOEpatents

    Goulding, F.S.; Hansen, W.L.

    1963-12-01

    A semiconductor diode having a very low noise characteristic when used under reverse bias is described. Surface leakage currents, which in conventional diodes greatly contribute to noise, are prevented from mixing with the desired signal currents. A p-n junction is formed with a thin layer of heavily doped semiconductor material disposed on a lightly doped, physically thick base material. An annular groove cuts through the thin layer and into the base for a short distance, dividing the thin layer into a peripheral guard ring that encircles the central region. Noise signal currents are shunted through the guard ring, leaving the central region free from such currents. (AEC)

  15. New unorthodox semiconductor devices

    NASA Astrophysics Data System (ADS)

    Board, K.

    1985-12-01

    A range of new semiconductor devices, including a number of structures which rely entirely upon new phenomena, are discussed. Unipolar two-terminal devices, including impurity-controlled barriers and graded composition barriers, are considered, as are new transistor structures, including the hot-electron camel transistor, the planar-doped barrier transistor, the thermionic emission transistor, and the permeable base transistor. Regenerative switching devices are addressed, including the metal-tunnel insulator-semiconductor switch, the polysilicon switch, MIS, and MISIM switching structures, and the triangular-barrier switch. Heterostructure devices are covered, including the heterojunction bipolar transistor, the selectively doped heterojunction transistor, heterojunction lasers, and quantum-well structures.

  16. Sustainable development with clean coal

    SciTech Connect

    1997-08-01

    This paper discusses the opportunities available with clean coal technologies. Applications include new power plants, retrofitting and repowering of existing power plants, steelmaking, cement making, paper manufacturing, cogeneration facilities, and district heating plants. An appendix describes the clean coal technologies. These include coal preparation (physical cleaning, low-rank upgrading, bituminous coal preparation); combustion technologies (fluidized-bed combustion and NOx control); post-combustion cleaning (particulate control, sulfur dioxide control, nitrogen oxide control); and conversion with the integrated gasification combined cycle.

  17. CH Packaging Program Guidance

    SciTech Connect

    Washington TRU Solutions LLC

    2005-02-28

    The purpose of this document is to provide the technical requirements for preparation for use, operation, inspection, and maintenance of a Transuranic Package Transporter Model II (TRUPACT-II), a HalfPACT shipping package, and directly related components. This document complies with the minimum requirements as specified in the TRUPACT-II Safety Analysis Report for Packaging (SARP), HalfPACT SARP, and U.S. Nuclear Regulatory Commission (NRC) Certificates of Compliance (C of C) 9218 and 9279, respectively. In the event of a conflict between this document and the SARP or C of C, the C of C shall govern. The C of Cs state: "each package must be prepared for shipment and operated in accordance with the procedures described in Chapter 7.0, Operating Procedures, of the application." They further state: "each package must be tested and maintained in accordance with the procedures described in Chapter 8.0, Acceptance Tests and Maintenance Program of the Application." Chapter 9.0 of the SARP charges the Waste Isolation Pilot Plant (WIPP) management and operating (M&O) contractor with assuring packaging is used in accordance with the requirements of the C of C. Because the packaging is NRC-approved, users need to be familiar with Title 10 Code of Federal Regulations (CFR) §71.8. Any time a user suspects or has indications that the conditions of approval in the C of C were not met, the Carlsbad Field Office (CBFO) shall be notified immediately. The CBFO will evaluate the issue and notify the NRC if required.

  18. Food Packaging Materials

    NASA Technical Reports Server (NTRS)

    1978-01-01

    The photos show a few of the food products packaged in Alure, a metallized plastic material developed and manufactured by St. Regis Paper Company's Flexible Packaging Division, Dallas, Texas. The material incorporates a metallized film originally developed for space applications. Among the suppliers of the film to St. Regis is King-Seeley Thermos Company, Winchester, Ma'ssachusetts. Initially used by NASA as a signal-bouncing reflective coating for the Echo 1 communications satellite, the film was developed by a company later absorbed by King-Seeley. The metallized film was also used as insulating material for components of a number of other spacecraft. St. Regis developed Alure to meet a multiple packaging material need: good eye appeal, product protection for long periods and the ability to be used successfully on a wide variety of food packaging equipment. When the cost of aluminum foil skyrocketed, packagers sought substitute metallized materials but experiments with a number of them uncovered problems; some were too expensive, some did not adequately protect the product, some were difficult for the machinery to handle. Alure offers a solution. St. Regis created Alure by sandwiching the metallized film between layers of plastics. The resulting laminated metallized material has the superior eye appeal of foil but is less expensive and more easily machined. Alure effectively blocks out light, moisture and oxygen and therefore gives the packaged food long shelf life. A major packaging firm conducted its own tests of the material and confirmed the advantages of machinability and shelf life, adding that it runs faster on machines than materials used in the past and it decreases product waste; the net effect is increased productivity.

  19. Electrostatically clean solar array

    NASA Technical Reports Server (NTRS)

    Stern, Theodore Garry (Inventor); Krumweide, Duane Eric (Inventor)

    2004-01-01

    Provided are methods of manufacturing an electrostatically clean solar array panel and the products resulting from the practice of these methods. The preferred method uses an array of solar cells, each with a coverglass where the method includes machining apertures into a flat, electrically conductive sheet so that each aperture is aligned with and undersized with respect to its matched coverglass sheet and thereby fashion a front side shield with apertures (FSA). The undersized portion about each aperture of the bottom side of the FSA shield is bonded to the topside portions nearest the edges of each aperture's matched coverglass. Edge clips are attached to the front side aperture shield edges with the edge clips electrically and mechanically connecting the tops of the coverglasses to the solar panel substrate. The FSA shield, edge clips and substrate edges are bonded so as to produce a conductively grounded electrostatically clean solar array panel.

  20. Water-based cleaning fundamentals

    SciTech Connect

    Harding, W.B.

    1991-12-01

    A basic description of water-based alkaline cleaning is presented, The nature of soils is described. The compositions of conventional cleaning compounds are given with descriptions of the functions of the ingredients. The mechanisms by which soil is removed are explained. The degrees of cleanliness required, along with the influence of the material being cleaned, are discussed. Tests for cleanliness are described.

  1. Cleaning Processes across NASA Centers

    NASA Technical Reports Server (NTRS)

    Hammond, John M.

    2010-01-01

    All significant surfaces of the hardware must be pre-cleaned to remove dirt, grit, scale, corrosion, grease, oil and other foreign matter prior to any final precision cleaning process. Metallic parts shall be surface treated (cleaned, passivated, pickled and/or coated) as necessary to prevent latent corrosion and contamination.

  2. Cleaning of Free Machining Brass

    SciTech Connect

    Shen, T

    2005-12-29

    We have investigated four brightening treatments proposed by two cleaning vendors for cleaning free machining brass. The experimental results showed that none of the proposed brightening treatments passed the swipe test. Thus, we maintain the recommendation of not using the brightening process in the cleaning of free machining brass for NIF application.

  3. Detecting small holes in packages

    DOEpatents

    Kronberg, J.W.; Cadieux, J.R.

    1996-03-19

    A package containing a tracer gas, and a method for determining the presence of a hole in the package by sensing the presence of the gas outside the package are disclosed. The preferred tracer gas, especially for food packaging, is sulfur hexafluoride. A quantity of the gas is added to the package and the package is closed. The concentration of the gas in the atmosphere outside the package is measured and compared to a predetermined value of the concentration of the gas in the absence of the package. A measured concentration greater than the predetermined value indicates the presence of a hole in the package. Measuring may be done in a chamber having a lower pressure than that in the package. 3 figs.

  4. Detecting small holes in packages

    DOEpatents

    Kronberg, James W.; Cadieux, James R.

    1996-01-01

    A package containing a tracer gas, and a method for determining the presence of a hole in the package by sensing the presence of the gas outside the package. The preferred tracer gas, especially for food packaging, is sulfur hexafluoride. A quantity of the gas is added to the package and the package is closed. The concentration of the gas in the atmosphere outside the package is measured and compared to a predetermined value of the concentration of the gas in the absence of the package. A measured concentration greater than the predetermined value indicates the presence of a hole in the package. Measuring may be done in a chamber having a lower pressure than that in the package.

  5. Clean room wiping cloths

    SciTech Connect

    Harding, W.B.

    1981-01-01

    The suitability of various fabrics for use as clean room wiping cloths was investigated. These fabrics included knit polyester, knit nylon, urethane foam, woven cotton, nonwoven polyester, nonwoven rayon, nonwoven polyethylene and polypropylene, and woven nylon. These materials were tested for detachable lint and fibers, deterioration, and oil content which could leave contaminating films on wiped surfaces. Well-laundered nylon and polyester cloths knitted from filamentary yarn, with hems, were found to be suitable. (LCL)

  6. Saltstone Clean Cap Formulation

    SciTech Connect

    Langton, C

    2005-04-22

    The current operation strategy for using Saltstone Vault 4 to receive 0.2 Ci/gallon salt solution waste involves pouring a clean grout layer over the radioactive grout prior to initiating pour into another cell. This will minimize the radiating surface area and reduce the dose rate at the vault and surrounding area. The Clean Cap will be used to shield about four feet of Saltstone poured into a Z-Area vault cell prior to moving to another cell. The minimum thickness of the Clean Cap layer will be determined by the cesium concentration and resulting dose levels and it is expected to be about one foot thick based on current calculations for 0.1 Ci Saltstone that is produced in the Saltstone process by stabilization of 0.2 Ci salt solution. This report documents experiments performed to identify a formulation for the Clean Cap. Thermal transient calculations, adiabatic temperature rise measurements, pour height, time between pour calculations and shielding calculations were beyond the scope and time limitations of this study. However, data required for shielding calculations (composition and specific gravity) are provided for shielding calculations. The approach used to design a Clean Cap formulation was to produce a slurry from the reference premix (10/45/45 weight percent cement/slag/fly ash) and domestic water that resembled as closely as possible the properties of the Saltstone slurry. In addition, options were investigated that may offer advantages such as less bleed water and less heat generation. The options with less bleed water required addition of dispersants. The options with lower heat contained more fly ash and less slag. A mix containing 10/45/45 weight percent cement/slag/fly ash with a water to premix ratio of 0.60 is recommended for the Clean Cap. Although this mix may generate more than 3 volume percent standing water (bleed water), it has rheological, mixing and flow properties that are similar to previously processed Saltstone. The recommended

  7. CH Packaging Program Guidance

    SciTech Connect

    None, None

    2006-04-25

    The purpose of this document is to provide the technical requirements for preparation for use, operation, inspection, and maintenance of a Transuranic Package TransporterModel II (TRUPACT-II), a HalfPACT shipping package, and directly related components. This document complies with the minimum requirements as specified in the TRUPACT-II Safety Analysis Report for Packaging (SARP), HalfPACT SARP, and U.S. Nuclear Regulatory Commission (NRC) Certificates of Compliance (C of C) 9218 and 9279, respectively. In the event of a conflict between this document and the SARP or C of C, the C of C shall govern. The C of Cs state: "each package must be prepared for shipment and operated in accordance with the procedures described in Chapter 7.0, Operating Procedures, of the application." They further state: "each package must be tested and maintained in accordance with the procedures described in Chapter 8.0, Acceptance Tests and Maintenance Program of the Application." Chapter 9.0 of the SARP charges the U.S. Department of Energy (DOE) or the Waste Isolation Pilot Plant| (WIPP) management and operating (M&O) contractor with assuring packaging is used in accordance with the requirements of the C of C. Because the packaging is NRC-approved, users need to be familiar with Title 10 Code of Federal Regulations(CFR) §71.8. Any time a user suspects or has indications that the conditions ofapproval in the C of C were not met, the Carlsbad Field Office (CBFO) shall be notified immediately. The CBFO will evaluate the issue and notify the NRC if required.In accordance with 10 CFR Part 71, certificate holders, packaging users, and contractors or subcontractors who use, design, fabricate, test, maintain, or modify the packaging shall post copies of (1) 10 CFR Part 21 regulations, (2) Section 206 of the Energy Reorganization Act of 1974, and (3) NRC Form 3, Notice to Employees. These documents must be posted in a conspicuous location where the activities subject to these regulations are

  8. CH Packaging Program Guidance

    SciTech Connect

    None, None

    2007-12-13

    The purpose of this document is to provide the technical requirements for preparation for use, operation, inspection, and maintenance of a Transuranic Package Transporter Model II (TRUPACT-II), a HalfPACT shipping package, and directly related components. This document complies with the minimum requirements as specified in the TRUPACT-II Safety Analysis Report for Packaging (SARP), HalfPACT SARP, and U.S. Nuclear Regulatory Commission (NRC) Certificates of Compliance (C of C) 9218 and 9279, respectively. In the event of a conflict between this document and the SARP or C of C, the C of C shall govern. The C of Cs state: "each package must be prepared for shipment and operated in accordance with the procedures described in Chapter 7.0, Operating Procedures, of the application." They further state: "each package must be tested and maintained in accordance with the procedures described in Chapter 8.0, Acceptance Tests and Maintenance Program of the Application." Chapter 9.0 of the SARP charges the U.S. Department of Energy (DOE) or the Waste Isolation Pilot Plant (WIPP) management and operating (M&O) contractor with assuring packaging is used in accordance with the requirements of the C of C. Because the packaging is NRC-approved, users need to be familiar with Title 10 Code of Federal Regulations (CFR) §71.8. Any time a user suspects or has indications that the conditions of approval in the C of C were not met, the Carlsbad Field Office (CBFO) shall be notified immediately. The CBFO will evaluate the issue and notify the NRC if required.In accordance with 10 CFR Part 71, certificate holders, packaging users, and contractors or subcontractors who use, design, fabricate, test, maintain, or modify the packaging shall post copies of (1) 10 CFR Part 21 regulations, (2) Section 206 of the Energy Reorganization Act of 1974, and (3) NRC Form 3, Notice to Employees. These documents must be posted in a conspicuous location where the activities subject to these regulations are

  9. Genesis Spacecraft Science Canister Preliminary Inspection and Cleaning

    NASA Technical Reports Server (NTRS)

    Hittle, J. D.; Calaway, M. J.; Allton, J. H.; Warren, J. L.; Schwartz, C. M.; Stansbery, E. K.

    2006-01-01

    The Genesis science canister is an aluminum cylinder (75 cm diameter and 35 cm tall) hinged at the mid-line for opening. This canister was cleaned and assembled in an ISO level 4 (Class 10) clean room at Johnson Space Center (JSC) prior to launch. The clean solar collectors were installed and the canister closed in the cleanroom to preserve collector cleanliness. The canister remained closed until opened on station at Earth-Sun L1 for solar wind collection. At the conclusion of collection, the canister was again closed to preserve collector cleanliness during Earth return and re-entry. Upon impacting the dry Utah lakebed at 300 kph the science canister integrity was breached. The canister was returned to JSC. The canister shell was briefly examined, imaged, gently cleaned of dust and packaged for storage in anticipation of future detailed examination. The condition of the science canister shell noted during this brief examination is presented here. The canister interior components were packaged and stored without imaging due to time constraints.

  10. Kansas Advanced Semiconductor Project

    SciTech Connect

    Baringer, P.; Bean, A.; Bolton, T.; Horton-Smith, G.; Maravin, Y.; Ratra, B.; Stanton, N.; von Toerne, E.; Wilson, G.

    2007-09-21

    KASP (Kansas Advanced Semiconductor Project) completed the new Layer 0 upgrade for D0, assumed key electronics projects for the US CMS project, finished important new physics measurements with the D0 experiment at Fermilab, made substantial contributions to detector studies for the proposed e+e- international linear collider (ILC), and advanced key initiatives in non-accelerator-based neutrino physics.

  11. Chemically Derivatized Semiconductor Photoelectrodes.

    ERIC Educational Resources Information Center

    Wrighton, Mark S.

    1983-01-01

    Deliberate modification of semiconductor photoelectrodes to improve durability and enhance rate of desirable interfacial redox processes is discussed for a variety of systems. Modification with molecular-based systems or with metals/metal oxides yields results indicating an important role for surface modification in devices for fundamental study…

  12. Physics of Organic Semiconductors

    NASA Astrophysics Data System (ADS)

    Brütting, Wolfgang

    2004-05-01

    Organic semiconductors are of steadily growing interest as active components in electronics and optoelectronics. Due to their flexibility, low cost and ease-of-production they represent a valid alternative to conventional inorganic semiconductor technology in a number of applications, such as flat panel displays and illumination, plastic integrated circuits or solar energy conversion. Although first commercial applications of this technology are being realized nowadays, there is still the need for a deeper scientific understanding in order to achieve optimum device performance.This special issue of physica status solidi (a) tries to give an overview of our present-day knowledge of the physics behind organic semiconductor devices. Contributions from 17 international research groups cover various aspects of this field ranging from the growth of organic layers and crystals, their electronic properties at interfaces, their photophysics and electrical transport properties to the application of these materials in different devices like organic field-effect transistors, photovoltaic cells and organic light-emitting diodes.Putting together such a special issue one soon realizes that it is simply impossible to fully cover the whole area of organic semiconductors. Nevertheless, we hope that the reader will find the collection of topics in this issue useful for getting an up-to-date review of a field which is still developing very dynamically.

  13. Gas cleaning system and method

    DOEpatents

    Newby, Richard Allen

    2006-06-06

    A gas cleaning system for removing at least a portion of contaminants, such as halides, sulfur, particulates, mercury, and others, from a synthesis gas (syngas). The gas cleaning system may include one or more filter vessels coupled in series for removing halides, particulates, and sulfur from the syngas. The gas cleaning system may be operated by receiving gas at a first temperature and pressure and dropping the temperature of the syngas as the gas flows through the system. The gas cleaning system may be used for an application requiring clean syngas, such as, but not limited to, fuel cell power generation, IGCC power generation, and chemical synthesis.

  14. MMIC packaging with Waffleline

    NASA Astrophysics Data System (ADS)

    Perry, R. W.; Ellis, T. T.; Schineller, E. R.

    1990-06-01

    The design principle of Waffleline, a patented MMIC packaging technology, is discussed, and several recent applications are described and illustrated with drawings, diagrams, and photographs. Standard Waffleline is a foil-covered waffle-iron-like grid with dielectric-coated signal and power wires running in the channels and foil-removed holes for mounting prepackaged chips or chip carriers. With spacing of 50 mils between center conductors, this material is applicable at frequencies up to 40 GHz; EHF devices require Waffleline with 25-mil spacing. Applications characterized include a subassembly for a man-transportable SHF satellite-communication terminal, a transmitter driver for a high-power TWT, and a 60-GHz receiver front end (including an integrated monolithic microstrip antenna, a low-noise amplifier, a mixer, and an IF amplifier in a 0.25-inch-thick 1.6-inch-diameter package). The high package density and relatively low cost of Waffleline are emphasized.

  15. Ada Namelist Package

    NASA Technical Reports Server (NTRS)

    Klumpp, Allan R.

    1991-01-01

    Ada Namelist Package, developed for Ada programming language, enables calling program to read and write FORTRAN-style namelist files. Features are: handling of any combination of types defined by user; ability to read vectors, matrices, and slices of vectors and matrices; handling of mismatches between variables in namelist file and those in programmed list of namelist variables; and ability to avoid searching entire input file for each variable. Principle benefits derived by user: ability to read and write namelist-readable files, ability to detect most file errors in initialization phase, and organization keeping number of instantiated units to few packages rather than to many subprograms.

  16. SPHINX experimenters information package

    SciTech Connect

    Zarick, T.A.

    1996-08-01

    This information package was prepared for both new and experienced users of the SPHINX (Short Pulse High Intensity Nanosecond X-radiator) flash X-Ray facility. It was compiled to help facilitate experiment design and preparation for both the experimenter(s) and the SPHINX operational staff. The major areas covered include: Recording Systems Capabilities,Recording System Cable Plant, Physical Dimensions of SPHINX and the SPHINX Test cell, SPHINX Operating Parameters and Modes, Dose Rate Map, Experiment Safety Approval Form, and a Feedback Questionnaire. This package will be updated as the SPHINX facilities and capabilities are enhanced.

  17. Bubble size distribution analysis and control in high frequency ultrasonic cleaning processes

    NASA Astrophysics Data System (ADS)

    Hauptmann, M.; Struyf, H.; Mertens, P.; Heyns, M.; De Gendt, S.; Glorieux, C.; Brems, S.

    2012-12-01

    In the semiconductor industry, the ongoing down-scaling of nanoelectronic elements has lead to an increasing complexity of their fabrication. Hence, the individual fabrication processes become increasingly difficult to handle. To minimize cross-contamination, intermediate surface cleaning and preparation steps are inevitable parts of the semiconductor process chain. Here, one major challenge is the removal of residual nano-particulate contamination resulting from abrasive processes such as polishing and etching. In the past, physical cleaning techniques such as megasonic cleaning have been proposed as suitable solutions. However, the soaring fragility of the smallest structures is constraining the forces of the involved physical removal mechanisms. In the case of "megasonic" cleaning -cleaning with ultrasound in the MHz-domain - the main cleaning action arises from strongly oscillating microbubbles which emerge from the periodically changing tensile strain in the cleaning liquid during sonication. These bubbles grow, oscillate and collapse due to a complex interplay of rectified diffusion, bubble coalescence, non-linear pulsation and the onset of shape instabilities. Hence, the resulting bubble size distribution does not remain static but alternates continuously. Only microbubbles in this distribution that show a high oscillatory response are responsible for the cleaning action. Therefore, the cleaning process efficiency can be improved by keeping the majority of bubbles around their resonance size. In this paper, we propose a method to control and characterize the bubble size distribution by means of "pulsed" sonication and measurements of acoustic cavitation spectra, respectively. We show that the so-obtained bubble size distributions can be related to theoretical predictions of the oscillatory responses of and the onset of shape instabilities for the respective bubbles. We also propose a mechanism to explain the enhancement of both acoustic and cleaning activity

  18. AN ADA NAMELIST PACKAGE

    NASA Technical Reports Server (NTRS)

    Klumpp, A. R.

    1994-01-01

    The Ada Namelist Package, developed for the Ada programming language, enables a calling program to read and write FORTRAN-style namelist files. A namelist file consists of any number of assignment statements in any order. Features of the Ada Namelist Package are: the handling of any combination of user-defined types; the ability to read vectors, matrices, and slices of vectors and matrices; the handling of mismatches between variables in the namelist file and those in the programmed list of namelist variables; and the ability to avoid searching the entire input file for each variable. The principle user benefits of this software are the following: the ability to write namelist-readable files, the ability to detect most file errors in the initialization phase, a package organization that reduces the number of instantiated units to a few packages rather than to many subprograms, a reduced number of restrictions, and an increased execution speed. The Ada Namelist reads data from an input file into variables declared within a user program. It then writes data from the user program to an output file, printer, or display. The input file contains a sequence of assignment statements in arbitrary order. The output is in namelist-readable form. There is a one-to-one correspondence between namelist I/O statements executed in the user program and variables read or written. Nevertheless, in the input file, mismatches are allowed between assignment statements in the file and the namelist read procedure statements in the user program. The Ada Namelist Package itself is non-generic. However, it has a group of nested generic packages following the nongeneric opening portion. The opening portion declares a variety of useraccessible constants, variables and subprograms. The subprograms are procedures for initializing namelists for reading, reading and writing strings. The subprograms are also functions for analyzing the content of the current dataset and diagnosing errors. Two nested

  19. Diesel injector additives for a clean exhaust

    SciTech Connect

    Herbstman, S.; Virk, K.S.

    1988-08-01

    Increased public awareness of clean air is causing closer examination of potential health problems associated with diesel exhaust particulates. Recently, the EPA published standards mandating a sixfold reduction in diesel exhaust particulates for heavy duty engines from 0.60 gm/bhp-hr in 1988-1990 to 0.10 gm/bhp-hr in 1994. NOx exhaust concentrations were also reduced. For some time now, we have been interested in ways to reduce black smoke from diesel engines since it is one of the prime contributors to exhaust particulates. One of its causes is dirty or clogged fuel injectors due to deposit buildup. During operation with dirty injectors, the spray pattern of fuel into the combustion chamber is distorted, usually resulting in a fuel-rich environment. Incomplete burning of the rich fuel mixture results in an excess of carbonaceous material which is discharged in the exhaust as black smoke. We are engaged in evaluating additives with detergency and antioxidant properties to reduce deposit buildup in the injectors. Long chain alkylamines, and other types of surfactant molecules have been reported as active in preventing deposit buildup. However, little practical information was available concerning structure-activity relationships for use in developing a commercially acceptable additive package. We decided to investigate additives which are active either as gasoline carburetor detergents or as lubricant dispersants; both categories appear to have the necessary surfactant behavior and oil solubility to satisfy our needs for a diesel injector keep clean agent. Our approach to the problem was to develop an additive package for future use in Texaco fuels to reduce black smoke.

  20. Clean fuels from biomass

    NASA Technical Reports Server (NTRS)

    Hsu, Y.-Y.

    1976-01-01

    The paper discusses the U.S. resources to provide fuels from agricultural products, the present status of conversion technology of clean fuels from biomass, and a system study directed to determine the energy budget, and environmental and socioeconomic impacts. Conversion processes are discussed relative to pyrolysis and anaerobic fermentation. Pyrolysis breaks the cellulose molecules to smaller molecules under high temperature in the absence of oxygen, wheras anaerobic fermentation is used to convert biomass to methane by means of bacteria. Cost optimization and energy utilization are also discussed.

  1. Reliability evaluation of CIF (chip-in-flex) and COF (chip-on-flex) packages

    NASA Astrophysics Data System (ADS)

    Jang, Jae-Won; Suk, Kyoung-Lim; Paik, Kyung-Wook; Lee, Soon-Bok

    2010-03-01

    CIF (chip-in-flex) and COF (chip-on-flex) packages have the advantages of fine pitch capability, and flexibility. Anisotropic conductive films (ACFs) are used for the interconnection between chip and substrate. Display, mobile device, and semiconductor industry require for smaller and more integrated packages. Both CIF and COF packages are an alternative for the demands. However, there are some reliability problems of interconnection between the chip and substrate because the packages are subjected to various loading conditions. These may degrade the functionality of the packages. Therefore, reliability assessment of both packages is necessary. In this study, experimental tests were performed to evaluate the reliability of interconnection between the chip and substrate of CIF and COF packages. Thermal cycling tests were performed to evaluate the resistance against thermal fatigue. The shape and warpage of the chip of CIF and COF packages were observed using optical methods (e.g., shadow Moiré and Twyman/Green interferometry). These optical Moiré techniques are widely used for measuring small deformations in microelectronic packages. The stress distribution around the chip was evaluated through FEA (finite element analysis). In addition, we suggested modifying design parameter of CIF packages for the reliability enhancement.

  2. Reliability evaluation of CIF (chip-in-flex) and COF (chip-on-flex) packages

    NASA Astrophysics Data System (ADS)

    Jang, Jae-Won; Suk, Kyoung-Lim; Paik, Kyung-Wook; Lee, Soon-Bok

    2009-12-01

    CIF (chip-in-flex) and COF (chip-on-flex) packages have the advantages of fine pitch capability, and flexibility. Anisotropic conductive films (ACFs) are used for the interconnection between chip and substrate. Display, mobile device, and semiconductor industry require for smaller and more integrated packages. Both CIF and COF packages are an alternative for the demands. However, there are some reliability problems of interconnection between the chip and substrate because the packages are subjected to various loading conditions. These may degrade the functionality of the packages. Therefore, reliability assessment of both packages is necessary. In this study, experimental tests were performed to evaluate the reliability of interconnection between the chip and substrate of CIF and COF packages. Thermal cycling tests were performed to evaluate the resistance against thermal fatigue. The shape and warpage of the chip of CIF and COF packages were observed using optical methods (e.g., shadow Moiré and Twyman/Green interferometry). These optical Moiré techniques are widely used for measuring small deformations in microelectronic packages. The stress distribution around the chip was evaluated through FEA (finite element analysis). In addition, we suggested modifying design parameter of CIF packages for the reliability enhancement.

  3. Waste disposal package

    DOEpatents

    Smith, M.J.

    1985-06-19

    This is a claim for a waste disposal package including an inner or primary canister for containing hazardous and/or radioactive wastes. The primary canister is encapsulated by an outer or secondary barrier formed of a porous ceramic material to control ingress of water to the canister and the release rate of wastes upon breach on the canister. 4 figs.

  4. Radioactive waste disposal package

    DOEpatents

    Lampe, Robert F.

    1986-11-04

    A radioactive waste disposal package comprising a canister for containing vitrified radioactive waste material and a sealed outer shell encapsulating the canister. A solid block of filler material is supported in said shell and convertible into a liquid state for flow into the space between the canister and outer shell and subsequently hardened to form a solid, impervious layer occupying such space.

  5. Radioactive waste disposal package

    DOEpatents

    Lampe, Robert F.

    1986-01-01

    A radioactive waste disposal package comprising a canister for containing vitrified radioactive waste material and a sealed outer shell encapsulating the canister. A solid block of filler material is supported in said shell and convertible into a liquid state for flow into the space between the canister and outer shell and subsequently hardened to form a solid, impervious layer occupying such space.

  6. Automatic Differentiation Package

    SciTech Connect

    Gay, David M.; Phipps, Eric; Bratlett, Roscoe

    2007-03-01

    Sacado is an automatic differentiation package for C++ codes using operator overloading and C++ templating. Sacado provide forward, reverse, and Taylor polynomial automatic differentiation classes and utilities for incorporating these classes into C++ codes. Users can compute derivatives of computations arising in engineering and scientific applications, including nonlinear equation solving, time integration, sensitivity analysis, stability analysis, optimization and uncertainity quantification.

  7. Learning Activity Package, Algebra.

    ERIC Educational Resources Information Center

    Evans, Diane

    A set of ten teacher-prepared Learning Activity Packages (LAPs) in beginning algebra and nine in intermediate algebra, these units cover sets, properties of operations, number systems, open expressions, solution sets of equations and inequalities in one and two variables, exponents, factoring and polynomials, relations and functions, radicals,…

  8. YWCA Vocational Readiness Package.

    ERIC Educational Resources Information Center

    Scott, Jeanne

    This document outlines, in detail, the Vocational Readiness Package for young girls, which is a week-long program utilizing simulation games and role-playing, while employing peer group counseling techniques to dramatize the realities concerning women in marriage and careers today. After three years of using this program, the authors have compiled…

  9. Radiographic film package

    SciTech Connect

    Muylle, W. E.

    1985-08-27

    A radiographic film package for non-destructive testing, comprising a radiographic film sheet, an intensifying screen with a layer of lead bonded to a paper foil, and a vacuum heat-sealed wrapper with a layer of aluminum and a heat-sealed easy-peelable thermoplastic layer.

  10. Project Information Packages Kit.

    ERIC Educational Resources Information Center

    RMC Research Corp., Mountain View, CA.

    Presented are an overview booklet, a project selection guide, and six Project Information Packages (PIPs) for six exemplary projects serving underachieving students in grades k through 9. The overview booklet outlines the PIP projects and includes a chart of major project features. A project selection guide reviews the PIP history, PIP contents,…

  11. Packaging, transportation of LLW

    SciTech Connect

    Shelton, P.

    1994-12-31

    This presentation is an overview of the regulations and requirements for the packaging and transportation of low-level radioactive wastes. United States Environmental Protection Agency and Department of Transportation regulations governing the classification of wastes and the transport documentation are also described.

  12. Nutrition Learning Packages.

    ERIC Educational Resources Information Center

    World Health Organization, Geneva (Switzerland).

    This book presents nine packages of learning materials for trainers to use in teaching community health workers to carry out the nutrition element of their jobs. Lessons are intended to help health workers acquire skill in presenting to communities the principles and practice of good nutrition. Responding to the most common causes of poor…

  13. Jpetra Kernel Package

    SciTech Connect

    Heroux, Michael A.

    2004-03-01

    A package of classes for constructing and using distributed sparse and dense matrices, vectors and graphs, written in Java. Jpetra is intended to provide the foundation for basic matrix and vector operations for Java developers. Jpetra provides distributed memory operations via an abstract parallel machine interface. The most common implementation of this interface will be Java sockets.

  14. Electro-Microfluidic Packaging

    NASA Astrophysics Data System (ADS)

    Benavides, G. L.; Galambos, P. C.

    2002-06-01

    There are many examples of electro-microfluidic products that require cost effective packaging solutions. Industry has responded to a demand for products such as drop ejectors, chemical sensors, and biological sensors. Drop ejectors have consumer applications such as ink jet printing and scientific applications such as patterning self-assembled monolayers or ejecting picoliters of expensive analytes/reagents for chemical analysis. Drop ejectors can be used to perform chemical analysis, combinatorial chemistry, drug manufacture, drug discovery, drug delivery, and DNA sequencing. Chemical and biological micro-sensors can sniff the ambient environment for traces of dangerous materials such as explosives, toxins, or pathogens. Other biological sensors can be used to improve world health by providing timely diagnostics and applying corrective measures to the human body. Electro-microfluidic packaging can easily represent over fifty percent of the product cost and, as with Integrated Circuits (IC), the industry should evolve to standard packaging solutions. Standard packaging schemes will minimize cost and bring products to market sooner.

  15. Process waste assessment: Petroleum jelly removal from semiconductor die using trichloroethylene

    SciTech Connect

    Curtin, D.P.

    1993-05-01

    The process analyzed involves non-production, laboratory environment use of trichloroethylene for the cleaning of semiconductor devices. The option selection centered on the replacement of the trichloroethylene with a non-hazardous material. This process waste assessment was performed as part of a pilot project.

  16. Semiconductor electrochemistry of coal pyrite. Final technical report, September 1990--September 1995

    SciTech Connect

    Osseo-Asare, K.; Wei, D.

    1996-01-01

    This project is concerned with the physiochemical processes occuring at the pyrite/aqueous interface, in the context of coal cleaning, desulfurization, and acid mine drainage. The use of synthetic particles of pyrite as model electrodes to investigate the semiconductor electrochemistry of pyrite is employed.

  17. High Efficiency Integrated Package

    SciTech Connect

    Ibbetson, James

    2013-09-15

    Solid-state lighting based on LEDs has emerged as a superior alternative to inefficient conventional lighting, particularly incandescent. LED lighting can lead to 80 percent energy savings; can last 50,000 hours – 2-50 times longer than most bulbs; and contains no toxic lead or mercury. However, to enable mass adoption, particularly at the consumer level, the cost of LED luminaires must be reduced by an order of magnitude while achieving superior efficiency, light quality and lifetime. To become viable, energy-efficient replacement solutions must deliver system efficacies of ≥ 100 lumens per watt (LPW) with excellent color rendering (CRI > 85) at a cost that enables payback cycles of two years or less for commercial applications. This development will enable significant site energy savings as it targets commercial and retail lighting applications that are most sensitive to the lifetime operating costs with their extended operating hours per day. If costs are reduced substantially, dramatic energy savings can be realized by replacing incandescent lighting in the residential market as well. In light of these challenges, Cree proposed to develop a multi-chip integrated LED package with an output of > 1000 lumens of warm white light operating at an efficacy of at least 128 LPW with a CRI > 85. This product will serve as the light engine for replacement lamps and luminaires. At the end of the proposed program, this integrated package was to be used in a proof-of-concept lamp prototype to demonstrate the component’s viability in a common form factor. During this project Cree SBTC developed an efficient, compact warm-white LED package with an integrated remote color down-converter. Via a combination of intensive optical, electrical, and thermal optimization, a package design was obtained that met nearly all project goals. This package emitted 1295 lm under instant-on, room-temperature testing conditions, with an efficacy of 128.4 lm/W at a color temperature of ~2873

  18. Mechanisms for enhanced packaging and/or burn-in total dose sensitivity in microelectronics

    SciTech Connect

    Pease, R.L.; Shaneyfelt, M.; Winokur, P.

    1997-03-01

    The ionizing radiation response of several semiconductor process technologies has been shown to be enhanced by plastic packaging and/or pre-conditioning (burn-in). Potential mechanisms for this effect are discussed and data on bipolar linear circuits are presented.

  19. Device Technology Investigation: Subsystems Packaging Study: Feasibility of PCSS - Based Pulser for Highly Portable Platforms

    SciTech Connect

    MAR, ALAN; BACON, LARRY D.; LOUBRIEL, GUILLERMO M.

    2002-07-01

    This report summarizes an investigation of the use of high-gain Photo-Conductive Semiconductor Switch (PCSS) technology for a deployable impulse source. This includes a discussion of viability, packaging, and antennas. High gain GaAs PCSS-based designs offer potential advantages in terms of compactness, repetition rate, and cost.

  20. Semiconductor radiation detector

    DOEpatents

    Patt, Bradley E.; Iwanczyk, Jan S.; Tull, Carolyn R.; Vilkelis, Gintas

    2002-01-01

    A semiconductor radiation detector is provided to detect x-ray and light photons. The entrance electrode is segmented by using variable doping concentrations. Further, the entrance electrode is physically segmented by inserting n+ regions between p+ regions. The p+ regions and the n+ regions are individually biased. The detector elements can be used in an array, and the p+ regions and the n+ regions can be biased by applying potential at a single point. The back side of the semiconductor radiation detector has an n+ anode for collecting created charges and a number of p+ cathodes. Biased n+ inserts can be placed between the p+ cathodes, and an internal resistor divider can be used to bias the n+ inserts as well as the p+ cathodes. A polysilicon spiral guard can be implemented surrounding the active area of the entrance electrode or surrounding an array of entrance electrodes.

  1. Three dimensional strained semiconductors

    DOEpatents

    Voss, Lars; Conway, Adam; Nikolic, Rebecca J.; Leao, Cedric Rocha; Shao, Qinghui

    2016-11-08

    In one embodiment, an apparatus includes a three dimensional structure comprising a semiconductor material, and at least one thin film in contact with at least one exterior surface of the three dimensional structure for inducing a strain in the structure, the thin film being characterized as providing at least one of: an induced strain of at least 0.05%, and an induced strain in at least 5% of a volume of the three dimensional structure. In another embodiment, a method includes forming a three dimensional structure comprising a semiconductor material, and depositing at least one thin film on at least one surface of the three dimensional structure for inducing a strain in the structure, the thin film being characterized as providing at least one of: an induced strain of at least 0.05%, and an induced strain in at least 5% of a volume of the structure.

  2. Stretchable Organic Semiconductor Devices.

    PubMed

    Qian, Yan; Zhang, Xinwen; Xie, Linghai; Qi, Dianpeng; Chandran, Bevita K; Chen, Xiaodong; Huang, Wei

    2016-11-01

    Stretchable electronics are essential for the development of intensely packed collapsible and portable electronics, wearable electronics, epidermal and bioimplanted electronics, 3D surface compliable devices, bionics, prosthesis, and robotics. However, most stretchable devices are currently based on inorganic electronics, whose high cost of fabrication and limited processing area make it difficult to produce inexpensive, large-area devices. Therefore, organic stretchable electronics are highly attractive due to many advantages over their inorganic counterparts, such as their light weight, flexibility, low cost and large-area solution-processing, the reproducible semiconductor resources, and the easy tuning of their properties via molecular tailoring. Among them, stretchable organic semiconductor devices have become a hot and fast-growing research field, in which great advances have been made in recent years. These fantastic advances are summarized here, focusing on stretchable organic field-effect transistors, light-emitting devices, solar cells, and memory devices.

  3. International Clean Energy Coalition

    SciTech Connect

    Erin Skootsky; Matt Gardner; Bevan Flansburgh

    2010-09-28

    In 2003, the National Association of Regulatory Utility Commissioners (NARUC) and National Energy Technology Laboratories (NETL) collaboratively established the International Clean Energy Coalition (ICEC). The coalition consisting of energy policy-makers, technologists, and financial institutions was designed to assist developing countries in forming and supporting local approaches to greenhouse gas mitigation within the energy sector. ICEC's work focused on capacity building and clean energy deployment in countries that rely heavily on fossil-based electric generation. Under ICEC, the coalition formed a steering committee consisting of NARUC members and held a series of meetings to develop and manage the workplan and define successful outcomes for the projects. ICEC identified India as a target country for their work and completed a country assessment that helped ICEC build a framework for discussion with Indian energy decisionmakers including two follow-on in-country workshops. As of the conclusion of the project in 2010, ICEC had also conducted outreach activities conducted during United Nations Framework Convention on Climate Change (UNFCCC) Ninth Conference of Parties (COP 9) and COP 10. The broad goal of this project was to develop a coalition of decision-makers, technologists, and financial institutions to assist developing countries in implementing affordable, effective and resource appropriate technology and policy strategies to mitigate greenhouse gas emissions. Project goals were met through international forums, a country assessment, and in-country workshops. This project focused on countries that rely heavily on fossil-based electric generation.

  4. Isotopically controlled semiconductors

    SciTech Connect

    Haller, Eugene E.

    2006-06-19

    The following article is an edited transcript based on the Turnbull Lecture given by Eugene E. Haller at the 2005 Materials Research Society Fall Meeting in Boston on November 29, 2005. The David Turnbull Lectureship is awarded to recognize the career of a scientist who has made outstanding contributions to understanding materials phenomena and properties through research, writing, and lecturing, as exemplified by the life work of David Turnbull. Haller was named the 2005 David Turnbull Lecturer for his 'pioneering achievements and leadership in establishing the field of isotopically engineered semiconductors; for outstanding contributions to materials growth, doping and diffusion; and for excellence in lecturing, writing, and fostering international collaborations'. The scientific interest, increased availability, and technological promise of highly enriched isotopes have led to a sharp rise in the number of experimental and theoretical studies with isotopically controlled semiconductor crystals. This article reviews results obtained with isotopically controlled semiconductor bulk and thin-film heterostructures. Isotopic composition affects several properties such as phonon energies, band structure, and lattice constant in subtle, but, for their physical understanding, significant ways. Large isotope-related effects are observed for thermal conductivity in local vibrational modes of impurities and after neutron transmutation doping. Spectacularly sharp photoluminescence lines have been observed in ultrapure, isotopically enriched silicon crystals. Isotope multilayer structures are especially well suited for simultaneous self- and dopant-diffusion studies. The absence of any chemical, mechanical, or electrical driving forces makes possible the study of an ideal random-walk problem. Isotopically controlled semiconductors may find applications in quantum computing, nanoscience, and spintronics.

  5. Metal Contacts in Semiconductors.

    DTIC Science & Technology

    1983-11-01

    surfaces, Pnotoelectron spe troscopy, Auger electron spectro- I scopy, Schottky barriers, ohmic contacts, Defects in semiconductors, Cadmium * telluride...Indium phosphide, Gallium arsenide, Gallium Selenide . j 20. ABSTR ACT (roothat ow rees esh " neceay and td..ity by block -. b*w) SThe application of...angstroms. Also, provided one eliminates the systems where cadmium outdiffusion into high work function metals occurs then good agreement between the

  6. Tunable semiconductor lasers

    NASA Technical Reports Server (NTRS)

    Taghavi-Larigani, Shervin (Inventor); Vanzyl, Jakob J. (Inventor); Yariv, Amnon (Inventor)

    2006-01-01

    Tunable semiconductor lasers are disclosed requiring minimized coupling regions. Multiple laser embodiments employ ring resonators or ring resonator pairs using only a single coupling region with the gain medium are detailed. Tuning can be performed by changing the phase of the coupling coefficient between the gain medium and a ring resonator of the laser. Another embodiment provides a tunable laser including two Mach-Zehnder interferometers in series and a reflector coupled to a gain medium.

  7. Semiconductor Ion Implanters

    NASA Astrophysics Data System (ADS)

    MacKinnon, Barry A.; Ruffell, John P.

    2011-06-01

    In 1953 the Raytheon CK722 transistor was priced at 7.60. Based upon this, an Intel Xeon Quad Core processor containing 820,000,000 transistors should list at 6.2 billion! Particle accelerator technology plays an important part in the remarkable story of why that Intel product can be purchased today for a few hundred dollars. Most people of the mid twentieth century would be astonished at the ubiquity of semiconductors in the products we now buy and use every day. Though relatively expensive in the nineteen fifties they now exist in a wide range of items from high-end multicore microprocessors like the Intel product to disposable items containing `only' hundreds or thousands like RFID chips and talking greeting cards. This historical development has been fueled by continuous advancement of the several individual technologies involved in the production of semiconductor devices including Ion Implantation and the charged particle beamlines at the heart of implant machines. In the course of its 40 year development, the worldwide implanter industry has reached annual sales levels around 2B, installed thousands of dedicated machines and directly employs thousands of workers. It represents in all these measures, as much and possibly more than any other industrial application of particle accelerator technology. This presentation discusses the history of implanter development. It touches on some of the people involved and on some of the developmental changes and challenges imposed as the requirements of the semiconductor industry evolved.

  8. Semiconductor Ion Implanters

    SciTech Connect

    MacKinnon, Barry A.; Ruffell, John P.

    2011-06-01

    In 1953 the Raytheon CK722 transistor was priced at $7.60. Based upon this, an Intel Xeon Quad Core processor containing 820,000,000 transistors should list at $6.2 billion. Particle accelerator technology plays an important part in the remarkable story of why that Intel product can be purchased today for a few hundred dollars. Most people of the mid twentieth century would be astonished at the ubiquity of semiconductors in the products we now buy and use every day. Though relatively expensive in the nineteen fifties they now exist in a wide range of items from high-end multicore microprocessors like the Intel product to disposable items containing 'only' hundreds or thousands like RFID chips and talking greeting cards. This historical development has been fueled by continuous advancement of the several individual technologies involved in the production of semiconductor devices including Ion Implantation and the charged particle beamlines at the heart of implant machines. In the course of its 40 year development, the worldwide implanter industry has reached annual sales levels around $2B, installed thousands of dedicated machines and directly employs thousands of workers. It represents in all these measures, as much and possibly more than any other industrial application of particle accelerator technology. This presentation discusses the history of implanter development. It touches on some of the people involved and on some of the developmental changes and challenges imposed as the requirements of the semiconductor industry evolved.

  9. New Semiconductor Devices

    NASA Astrophysics Data System (ADS)

    Balestra, F.

    2008-11-01

    A review of recently emerging semiconductor devices for nanoelectronic applications is given. For the end of the international technology roadmap for semiconductors, very innovative materials, technologies and nanodevice architectures will be needed. Silicon on insulator-based devices seem to be the best candidates for the ultimate integration of integrated circuits on silicon. The flexibility of the silicon on insulator-based structure and the possibility to realize new device architectures allow to obtain optimum electrical properties for low power and high performance circuits. These transistors are also very interesting for high frequency and memory applications. The performance and physical mechanisms are addressed in single- and multi-gate thin film Si, SiGe and Ge metal-oxide-semiconductor field-effect-transistors. The impact of tensile or compressive uniaxial and biaxial strains in the channel, of high k materials and metal gates as well as metallic Schottky source-drain architectures are discussed. Finally, the interest of advanced beyond-CMOS (complementary MOS) nanodevices for long term applications, based on nanowires, carbon electronics or small slope switch structures are presented.

  10. Power module packaging with double sided planar interconnection and heat exchangers

    DOEpatents

    Liang, Zhenxian; Marlino, Laura D.; Ning, Puqi; Wang, Fei

    2015-05-26

    A double sided cooled power module package having a single phase leg topology includes two IGBT and two diode semiconductor dies. Each IGBT die is spaced apart from a diode semiconductor die, forming a switch unit. Two switch units are placed in a planar face-up and face-down configuration. A pair of DBC or other insulated metallic substrates is affixed to each side of the planar phase leg semiconductor dies to form a sandwich structure. Attachment layers are disposed on outer surfaces of the substrates and two heat exchangers are affixed to the substrates by rigid bond layers. The heat exchangers, made of copper or aluminum, have passages for carrying coolant. The power package is manufactured in a two-step assembly and heating process where direct bonds are formed for all bond layers by soldering, sintering, solid diffusion bonding or transient liquid diffusion bonding, with a specially designed jig and fixture.

  11. Food packaging history and innovations.

    PubMed

    Risch, Sara J

    2009-09-23

    Food packaging has evolved from simply a container to hold food to something today that can play an active role in food quality. Many packages are still simply containers, but they have properties that have been developed to protect the food. These include barriers to oxygen, moisture, and flavors. Active packaging, or that which plays an active role in food quality, includes some microwave packaging as well as packaging that has absorbers built in to remove oxygen from the atmosphere surrounding the product or to provide antimicrobials to the surface of the food. Packaging has allowed access to many foods year-round that otherwise could not be preserved. It is interesting to note that some packages have actually allowed the creation of new categories in the supermarket. Examples include microwave popcorn and fresh-cut produce, which owe their existence to the unique packaging that has been developed.

  12. Packaging legislation. Objectives and consequences.

    PubMed

    Christmann, H

    1995-05-01

    The recently published Directive on packaging and packaging waste makes new demands on the industry. This article highlights the key areas and raises some of the issues that must be confronted in the future.

  13. Bi-level multilayered microelectronic device package with an integral window

    DOEpatents

    Peterson, Kenneth A.; Watson, Robert D.

    2002-01-01

    A bi-level, multilayered package with an integral window for housing a microelectronic device. The device can be a semiconductor chip, a CCD chip, a CMOS chip, a VCSEL chip, a laser diode, a MEMS device, or a IMEMS device. The multilayered package can be formed of a low-temperature cofired ceramic (LTCC) or high-temperature cofired ceramic (HTCC) multilayer processes with the window being simultaneously joined (e.g. cofired) to the package body during LTCC or HTCC processing. The microelectronic device can be flip-chip bonded and oriented so that the light-sensitive side is optically accessible through the window. A second chip can be bonded to the backside of the first chip, with the second chip being wirebonded to the second level of the bi-level package. The result is a compact, low-profile package, having an integral window that can be hermetically-sealed.

  14. Automated cleaning of electronic components

    SciTech Connect

    Drotning, W.

    1994-03-01

    Environmental and operator safety concerns are leading to the elimination of trichloroethylene (TCE) and chlorofluorocarbon (CFC) solvents in electronic component cleaning processes that remove rosin flux, organic and inorganic contamination, and particulates. Present processes depend heavily on these solvents for manual spray cleaning of small components and subassemblies. Use of alternative solvent systems can lead to longer processing times and reduced quality. Automated spray cleaning can improve the quality of the cleaning process, thus enabling the productive use of environmentally conscious materials, while minimizing personnel exposure to hazardous materials. In addition, the use of robotic and automated systems can reduce the manual handling of parts that necessitates additional cleaning. We describe the development of a prototype robotic system for cleaning electronic components in a spray cleaning workcell. An important feature of the prototype system is the capability to generate the robot paths and motions automatically from the CAD models of the part to be cleaned, and to embed cleaning process knowledge into the automatically programmed operations.

  15. Sustainable Library Development Training Package

    ERIC Educational Resources Information Center

    Peace Corps, 2012

    2012-01-01

    This Sustainable Library Development Training Package supports Peace Corps' Focus In/Train Up strategy, which was implemented following the 2010 Comprehensive Agency Assessment. Sustainable Library Development is a technical training package in Peace Corps programming within the Education sector. The training package addresses the Volunteer…

  16. Gas-Liquid Supersonic Cleaning and Cleaning Verification Spray System

    NASA Technical Reports Server (NTRS)

    Parrish, Lewis M.

    2009-01-01

    NASA Kennedy Space Center (KSC) recently entered into a nonexclusive license agreement with Applied Cryogenic Solutions (ACS), Inc. (Galveston, TX) to commercialize its Gas-Liquid Supersonic Cleaning and Cleaning Verification Spray System technology. This technology, developed by KSC, is a critical component of processes being developed and commercialized by ACS to replace current mechanical and chemical cleaning and descaling methods used by numerous industries. Pilot trials on heat exchanger tubing components have shown that the ACS technology provides for: Superior cleaning in a much shorter period of time. Lower energy and labor requirements for cleaning and de-scaling uper.ninih. Significant reductions in waste volumes by not using water, acidic or basic solutions, organic solvents, or nonvolatile solid abrasives as components in the cleaning process. Improved energy efficiency in post-cleaning heat exchanger operations. The ACS process consists of a spray head containing supersonic converging/diverging nozzles, a source of liquid gas; a novel, proprietary pumping system that permits pumping liquid nitrogen, liquid air, or supercritical carbon dioxide to pressures in the range of 20,000 to 60,000 psi; and various hoses, fittings, valves, and gauges. The size and number of nozzles can be varied so the system can be built in configurations ranging from small hand-held spray heads to large multinozzle cleaners. The system also can be used to verify if a part has been adequately cleaned.

  17. Clean Salt integrated flowsheet

    SciTech Connect

    Lunsford, T.R.

    1994-09-27

    The Clean Salt Process (CSP) is a novel waste management scheme that removes sodium nitrate and aluminum nitrate nonahydrate as decontaminated (low specific activity) salts from Hanford`s high-level waste (HLW). The full scale process will separate the bulk of the waste that exists as sodium salts from the small portion of the waste that is by definition radioactive and dangerous. This report presents initial conceptual CSP flowsheets and demonstrates the benefit of integrating the process into the Tank Waste Remediation Systems (TWRS) Reference Flowsheet. Total HLW and low-level (LLW) volumes are reported for two different CSP integration options and are compared to the TWRS Reference Flowsheet values. The results for a single glass option eliminating LLW disposal are also reported.

  18. Anticounterfeit packaging technologies

    PubMed Central

    Shah, Ruchir Y.; Prajapati, Prajesh N.; Agrawal, Y. K.

    2010-01-01

    Packaging is the coordinated system that encloses and protects the dosage form. Counterfeit drugs are the major cause of morbidity, mortality, and failure of public interest in the healthcare system. High price and well-known brands make the pharma market most vulnerable, which accounts for top priority cardiovascular, obesity, and antihyperlipidemic drugs and drugs like sildenafil. Packaging includes overt and covert technologies like barcodes, holograms, sealing tapes, and radio frequency identification devices to preserve the integrity of the pharmaceutical product. But till date all the available techniques are synthetic and although provide considerable protection against counterfeiting, have certain limitations which can be overcome by the application of natural approaches and utilization of the principles of nanotechnology. PMID:22247875

  19. RH Packaging Program Guidance

    SciTech Connect

    Washington TRU Solutions, LLC

    2003-08-25

    The purpose of this program guidance document is to provide technical requirements for use, operation, inspection, and maintenance of the RH-TRU 72-B Waste Shipping Package and directly related components. This document complies with the requirements as specified in the RH-TRU 72-B Safety Analysis Report for Packaging (SARP), and Nuclear Regulatory Commission (NRC) Certificate of Compliance (C of C) 9212. If there is a conflict between this document and the SARP and/or C of C, the SARP and/or C of C shall govern. The C of C states: ''...each package must be prepared for shipment and operated in accordance with the procedures described in Chapter 7.0, ''Operating Procedures,'' of the application.'' It further states: ''...each package must be tested and maintained in accordance with the procedures described in Chapter 8.0, ''Acceptance Tests and Maintenance Program of the Application.'' Chapter 9.0 of the SARP tasks the Waste Isolation Pilot Plant (WIPP) Management and Operating (M&O) contractor with assuring the packaging is used in accordance with the requirements of the C of C. Because the packaging is NRC approved, users need to be familiar with 10 CFR {section} 71.11, ''Deliberate Misconduct.'' Any time a user suspects or has indications that the conditions of approval in the C of C were not met, the Carlsbad Field Office (CBFO) shall be notified immediately. CBFO will evaluate the issue and notify the NRC if required. This document details the instructions to be followed to operate, maintain, and test the RH-TRU 72-B packaging. This Program Guidance standardizes instructions for all users. Users shall follow these instructions. Following these instructions assures that operations are safe and meet the requirements of the SARP. This document is available on the Internet at: ttp://www.ws/library/t2omi/t2omi.htm. Users are responsible for ensuring they are using the current revision and change notices. Sites may prepare their own document using the word

  20. TIDEV: Tidal Evolution package

    NASA Astrophysics Data System (ADS)

    Cuartas-Restrepo, P.; Melita, M.; Zuluaga, J.; Portilla, B.; Sucerquia, M.; Miloni, O.

    2016-09-01

    TIDEV (Tidal Evolution package) calculates the evolution of rotation for tidally interacting bodies using Efroimsky-Makarov-Williams (EMW) formalism. The package integrates tidal evolution equations and computes the rotational and dynamical evolution of a planet under tidal and triaxial torques. TIDEV accounts for the perturbative effects due to the presence of the other planets in the system, especially the secular variations of the eccentricity. Bulk parameters include the mass and radius of the planet (and those of the other planets involved in the integration), the size and mass of the host star, the Maxwell time and Andrade's parameter. TIDEV also calculates the time scale that a planet takes to be tidally locked as well as the periods of rotation reached at the end of the spin-orbit evolution.

  1. Fair Package Assignment

    NASA Astrophysics Data System (ADS)

    Lahaie, Sébastien; Parkes, David C.

    We consider the problem of fair allocation in the package assignment model, where a set of indivisible items, held by single seller, must be efficiently allocated to agents with quasi-linear utilities. A fair assignment is one that is efficient and envy-free. We consider a model where bidders have superadditive valuations, meaning that items are pure complements. Our central result is that core outcomes are fair and even coalition-fair over this domain, while fair distributions may not even exist for general valuations. Of relevance to auction design, we also establish that the core is equivalent to the set of anonymous-price competitive equilibria, and that superadditive valuations are a maximal domain that guarantees the existence of anonymous-price competitive equilibrium. Our results are analogs of core equivalence results for linear prices in the standard assignment model, and for nonlinear, non-anonymous prices in the package assignment model with general valuations.

  2. Limonene and tetrahydrofurfuryl alcohol cleaning agent

    DOEpatents

    Bohnert, G.W.; Carter, R.D.; Hand, T.E.; Powers, M.T.

    1996-05-07

    The present invention is a tetrahydrofurfuryl alcohol and limonene or terpineol cleaning agent and method for formulating and/or using the cleaning agent. This cleaning agent effectively removes both polar and nonpolar contaminants from various electrical and mechanical parts and is readily used without surfactants, thereby reducing the need for additional cleaning operations. The cleaning agent is warm water rinsable without the use of surfactants. The cleaning agent can be azeotropic, enhancing ease of use in cleaning operations and ease of recycling.

  3. Limonene and tetrahydrofurfuryl alcohol cleaning agent

    DOEpatents

    Bohnert, G.W.; Carter, R.D.; Hand, T.E.; Powers, M.T.

    1997-10-21

    The present invention is a tetrahydrofurfuryl alcohol and limonene cleaning agent and method for formulating and/or using the cleaning agent. This cleaning agent effectively removes both polar and nonpolar contaminants from various electrical and mechanical parts and is readily used without surfactants, thereby reducing the need for additional cleaning operations. The cleaning agent is warm water rinsable without the use of surfactants. The cleaning agent can be azeotropic, enhancing ease of use in cleaning operations and ease of recycling.

  4. Limonene and tetrahydrofurfurly alcohol cleaning agent

    DOEpatents

    Bohnert, George W.; Carter, Richard D.; Hand, Thomas E.; Powers, Michael T.

    1997-10-21

    The present invention is a tetrahydrofurfuryl alcohol and limonene cleaning agent and method for formulating and/or using the cleaning agent. This cleaning agent effectively removes both polar and nonpolar contaminants from various electrical and mechanical parts and is readily used without surfactants, thereby reducing the need for additional cleaning operations. The cleaning agent is warm water rinsable without the use of surfactants. The cleaning agent can be azeotropic, enhancing ease of use in cleaning operations and ease of recycling.

  5. Tunable High Brightness Semiconductor Sources

    DTIC Science & Technology

    2015-05-01

    AFRL-RY-WP-TR-2015-0066 TUNABLE HIGH BRIGHTNESS SEMICONDUCTOR SOURCES Robert Bedford, Saima Husaini, Charles Reyner, and Tuoc Dang...3. DATES COVERED (From - To) May 2015 Final 5 November 2010 – 1 February 2015 4. TITLE AND SUBTITLE TUNABLE HIGH BRIGHTNESS SEMICONDUCTOR SOURCES 5a...included within the Tunable High Brightness Semiconductor Sources work unit includes several technology advancements. First, theoretical advances in mid

  6. New developments in power semiconductors

    NASA Technical Reports Server (NTRS)

    Sundberg, G. R.

    1983-01-01

    This paper represents an overview of some recent power semiconductor developments and spotlights new technologies that may have significant impact for aircraft electric secondary power. Primary emphasis will be on NASA-Lewis-supported developments in transistors, diodes, a new family of semiconductors, and solid-state remote power controllers. Several semiconductor companies that are moving into the power arena with devices rated at 400 V and 50 A and above are listed, with a brief look at a few devices.

  7. Software packager user's guide

    NASA Technical Reports Server (NTRS)

    Callahan, John R.

    1995-01-01

    Software integration is a growing area of concern for many programmers and software managers because the need to build new programs quickly from existing components is greater than ever. This includes building versions of software products for multiple hardware platforms and operating systems, building programs from components written in different languages, and building systems from components that must execute on different machines in a distributed network. The goal of software integration is to make building new programs from existing components more seamless -- programmers should pay minimal attention to the underlying configuration issues involved. Libraries of reusable components and classes are important tools but only partial solutions to software development problems. Even though software components may have compatible interfaces, there may be other reasons, such as differences between execution environments, why they cannot be integrated. Often, components must be adapted or reimplemented to fit into another application because of implementation differences -- they are implemented in different programming languages, dependent on different operating system resources, or must execute on different physical machines. The software packager is a tool that allows programmers to deal with interfaces between software components and ignore complex integration details. The packager takes modular descriptions of the structure of a software system written in the package specification language and produces an integration program in the form of a makefile. If complex integration tools are needed to integrate a set of components, such as remote procedure call stubs, their use is implied by the packager automatically and stub generation tools are invoked in the corresponding makefile. The programmer deals only with the components themselves and not the details of how to build the system on any given platform.

  8. Aquaculture information package

    SciTech Connect

    Boyd, T.; Rafferty, K.

    1998-08-01

    This package of information is intended to provide background information to developers of geothermal aquaculture projects. The material is divided into eight sections and includes information on market and price information for typical species, aquaculture water quality issues, typical species culture information, pond heat loss calculations, an aquaculture glossary, regional and university aquaculture offices and state aquaculture permit requirements. A bibliography containing 68 references is also included.

  9. Trilinos Web Interface Package

    SciTech Connect

    Hu, Jonathan; Phenow, Michael N.; Sala, Marzio; Tuminaro, Ray S.

    2006-09-01

    WebTrilinos is a scientific portal, a web-based environment to use several Trilinos packages through the web. If you are a teaching sparse linear algebra, you can use WebTrilinos to present code snippets and simple scripts, and let the students execute them from their browsers. If you want to test linear algebra solvers, you can use the MatrixPortal module, and you just have to select problems and options, then plot the results in nice graphs.

  10. Water splitting on semiconductor catalysts under visible-light irradiation.

    PubMed

    Navarro Yerga, Rufino M; Alvarez Galván, M Consuelo; del Valle, F; Villoria de la Mano, José A; Fierro, José L G

    2009-01-01

    Sustainable hydrogen production is a key target for the development of alternative, future energy systems that will provide a clean and affordable energy supply. The Sun is a source of silent and precious energy that is distributed fairly all over the Earth daily. However, its tremendous potential as a clean, safe, and economical energy source cannot be exploited unless the energy is accumulated or converted into more useful forms. The conversion of solar energy into hydrogen via the water-splitting process, assisted by photo-semiconductor catalysts, is one of the most promising technologies for the future because large quantities of hydrogen can potentially be generated in a clean and sustainable manner. This Minireview provides an overview of the principles, approaches, and research progress on solar hydrogen production via the water-splitting reaction on photo-semiconductor catalysts. It presents a survey of the advances made over the last decades in the development of catalysts for photochemical water splitting under visible-light irradiation. The Minireview also analyzes the energy requirements and main factors that determine the activity of photocatalysts in the conversion of water into hydrogen and oxygen using sunlight. Remarkable progress has been made since the pioneering work by Fujishima and Honda in 1972, but he development of photocatalysts with improved efficiencies for hydrogen production from water using solar energy still faces major challenges. Research strategies and approaches adopted in the search for active and efficient photocatalysts, for example through new materials and synthesis methods, are presented and analyzed.

  11. Method of passivating semiconductor surfaces

    DOEpatents

    Wanlass, M.W.

    1990-06-19

    A method is described for passivating Group III-V or II-VI semiconductor compound surfaces. The method includes selecting a passivating material having a lattice constant substantially mismatched to the lattice constant of the semiconductor compound. The passivating material is then grown as an ultrathin layer of passivating material on the surface of the Group III-V or II-VI semiconductor compound. The passivating material is grown to a thickness sufficient to maintain a coherent interface between the ultrathin passivating material and the semiconductor compound. In addition, a device formed from such method is also disclosed.

  12. Electrodes for Semiconductor Gas Sensors.

    PubMed

    Lee, Sung Pil

    2017-03-25

    The electrodes of semiconductor gas sensors are important in characterizing sensors based on their sensitivity, selectivity, reversibility, response time, and long-term stability. The types and materials of electrodes used for semiconductor gas sensors are analyzed. In addition, the effect of interfacial zones and surface states of electrode-semiconductor interfaces on their characteristics is studied. This study describes that the gas interaction mechanism of the electrode-semiconductor interfaces should take into account the interfacial zone, surface states, image force, and tunneling effect.

  13. Method of passivating semiconductor surfaces

    DOEpatents

    Wanlass, Mark W.

    1990-01-01

    A method of passivating Group III-V or II-VI semiconductor compound surfaces. The method includes selecting a passivating material having a lattice constant substantially mismatched to the lattice constant of the semiconductor compound. The passivating material is then grown as an ultrathin layer of passivating material on the surface of the Group III-V or II-VI semiconductor compound. The passivating material is grown to a thickness sufficient to maintain a coherent interface between the ultrathin passivating material and the semiconductor compound. In addition, a device formed from such method is also disclosed.

  14. 78 FR 19007 - Certain Products Having Laminated Packaging, Laminated Packaging, and Components Thereof...

    Federal Register 2010, 2011, 2012, 2013, 2014

    2013-03-28

    ... COMMISSION Certain Products Having Laminated Packaging, Laminated Packaging, and Components Thereof.... 1337, on behalf of Lamina Packaging Innovations LLC of Longview, Texas. An amended complaint was filed... importation of certain products having laminated packaging, laminated packaging, and components thereof...

  15. Keeping an Uphill Edge: Managing Cleaning Behaviors at a Ski Shop

    ERIC Educational Resources Information Center

    Doll, Jessica; Livesey, Josh; McHaffie, Elizabeth; Ludwig, Timothy D.

    2007-01-01

    Several behaviors in a ski shop were identified as being deficient using Austin's Performance Diagnostic Checklist (2000) and Daniels and Daniels' PIC/NIC Analysis (2004). During a 4-week baseline, 7 cleaning behaviors were monitored and 5 were subsequently targeted in an intervention package using an ABC design. The intervention included: a task…

  16. Industrial Technologies Program - Manufacturing Workforce for a Clean Energy Economy (Green Jobs)

    SciTech Connect

    2010-05-01

    Making the transition to a clean energy economy will strengthen our energy security, improve the environment, and create jobs. In 2009, Congress passed a stimulus package to help jump-start all sectors of the U.S. economy and accelerate this transition.

  17. 21 CFR 355.20 - Packaging conditions.

    Code of Federal Regulations, 2013 CFR

    2013-04-01

    ... (toothpastes and tooth powders) packages shall not contain more than 276 milligrams (mg) total fluorine per... packages shall not contain more than 120 mg total fluorine per package. (3) Exception. Package...

  18. 21 CFR 355.20 - Packaging conditions.

    Code of Federal Regulations, 2014 CFR

    2014-04-01

    ... (toothpastes and tooth powders) packages shall not contain more than 276 milligrams (mg) total fluorine per... packages shall not contain more than 120 mg total fluorine per package. (3) Exception. Package...

  19. 21 CFR 355.20 - Packaging conditions.

    Code of Federal Regulations, 2012 CFR

    2012-04-01

    ... (toothpastes and tooth powders) packages shall not contain more than 276 milligrams (mg) total fluorine per... packages shall not contain more than 120 mg total fluorine per package. (3) Exception. Package...

  20. 21 CFR 355.20 - Packaging conditions.

    Code of Federal Regulations, 2011 CFR

    2011-04-01

    ... (toothpastes and tooth powders) packages shall not contain more than 276 milligrams (mg) total fluorine per... packages shall not contain more than 120 mg total fluorine per package. (3) Exception. Package...

  1. Packaging commercial CMOS chips for lab on a chip integration.

    PubMed

    Datta-Chaudhuri, Timir; Abshire, Pamela; Smela, Elisabeth

    2014-05-21

    Combining integrated circuitry with microfluidics enables lab-on-a-chip (LOC) devices to perform sensing, freeing them from benchtop equipment. However, this integration is challenging with small chips, as is briefly reviewed with reference to key metrics for package comparison. In this paper we present a simple packaging method for including mm-sized, foundry-fabricated dies containing complementary metal oxide semiconductor (CMOS) circuits within LOCs. The chip is embedded in an epoxy handle wafer to yield a level, large-area surface, allowing subsequent photolithographic post-processing and microfluidic integration. Electrical connection off-chip is provided by thin film metal traces passivated with parylene-C. The parylene is patterned to selectively expose the active sensing area of the chip, allowing direct interaction with a fluidic environment. The method accommodates any die size and automatically levels the die and handle wafer surfaces. Functionality was demonstrated by packaging two different types of CMOS sensor ICs, a bioamplifier chip with an array of surface electrodes connected to internal amplifiers for recording extracellular electrical signals and a capacitance sensor chip for monitoring cell adhesion and viability. Cells were cultured on the surface of both types of chips, and data were acquired using a PC. Long term culture (weeks) showed the packaging materials to be biocompatible. Package lifetime was demonstrated by exposure to fluids over a longer duration (months), and the package was robust enough to allow repeated sterilization and re-use. The ease of fabrication and good performance of this packaging method should allow wide adoption, thereby spurring advances in miniaturized sensing systems.

  2. The Clean Air Mercury Rule

    SciTech Connect

    Michael Rossler

    2005-07-01

    Coming into force on July 15, 2005, the US Clean Air Mercury Rule will use a market-based cap-and-trade approach under Section 111 of the Clean Air Act to reduce mercury emissions from the electric power sector. This article provides a comprehensive summary of the new rule. 14 refs., 2 tabs.

  3. Ultra-clean CCD Cryostats

    NASA Astrophysics Data System (ADS)

    Deiries, S.; Iwert, O.; Cavadore, C.; Geimer, C.; Hummel, E.

    A reproducible method to achieve ultra-clean CCD cryostats is presented, including a list of suitable materials and necessary treatments. In addition, proper handling under clean-room conditions and suitable molecular sieves to eliminate contamination on the detector surface in cold cryostats for years are described.

  4. Collodion technique of mirror cleaning

    NASA Technical Reports Server (NTRS)

    Tyndall, J. B.

    1970-01-01

    Cleaning method is modified by addition of a layer of cheesecloth between thin coatings of U.S.P. collodion. After drying, the collodion is peeled off by an even pull on the cheesecloth, leaving the mirror clean and ready for use.

  5. Aqueous-Spray Cleaning System

    NASA Technical Reports Server (NTRS)

    Morgan, Gene E.; Hoult, William S.; Simpson, Gareth L.

    1996-01-01

    Simple aqueous-spray cleaning system with overall dimensions comparable to large kitchen refrigerator constructed for use in cleaning hardware in shop. Made of commercially available parts and materials. Incorporates economical cleaner-and-rinse-recycling subsystem, as well as programmable logic-controller device for either manual or automatic operation.

  6. Programmed Cleaning and Environmental Sanitation.

    ERIC Educational Resources Information Center

    Gardner, John C., Ed.

    Maintenance of sanitation in buildings, plants, offices, and institutions; the selection of cleaning materials for these purposes; and the organization and supervision of the cleaning program are becoming increasingly complex and needful of a higher cost of handling. This book describes these problems and gives helpful information and guidance for…

  7. Clean Energy Business Plan Competition

    SciTech Connect

    Maxted, Sara Jane; Lojewski, Brandon; Scherson, Yaniv

    2012-01-01

    Top Students Pitch Clean Energy Business Plans The six regional finalists of the National Clean Energy Business Plan Competition pitched their business plans to a panel of judges June 13 in Washington, D.C. The expert judges announced NuMat Technologies from Northwestern University as the grand prize winner.

  8. Clean Energy Business Plan Competition

    ScienceCinema

    Maxted, Sara Jane; Lojewski, Brandon; Scherson, Yaniv

    2016-07-12

    Top Students Pitch Clean Energy Business Plans The six regional finalists of the National Clean Energy Business Plan Competition pitched their business plans to a panel of judges June 13 in Washington, D.C. The expert judges announced NuMat Technologies from Northwestern University as the grand prize winner.

  9. Cleaning of boiler heating surfaces

    SciTech Connect

    Maidanik, M. N.; Vasil'ev, V. V.

    2006-09-15

    Basic methods and facilities for the external cleaning of the heating surfaces of boilers designed for the combustion of low-grade solid fuels are discussed. Water and steam blastings, which are the basic means of cleaning furnace shields, and semi-radiative and convective heating surfaces have the greatest range of application.

  10. Optimal segmentation and packaging process

    DOEpatents

    Kostelnik, Kevin M.; Meservey, Richard H.; Landon, Mark D.

    1999-01-01

    A process for improving packaging efficiency uses three dimensional, computer simulated models with various optimization algorithms to determine the optimal segmentation process and packaging configurations based on constraints including container limitations. The present invention is applied to a process for decontaminating, decommissioning (D&D), and remediating a nuclear facility involving the segmentation and packaging of contaminated items in waste containers in order to minimize the number of cuts, maximize packaging density, and reduce worker radiation exposure. A three-dimensional, computer simulated, facility model of the contaminated items are created. The contaminated items are differentiated. The optimal location, orientation and sequence of the segmentation and packaging of the contaminated items is determined using the simulated model, the algorithms, and various constraints including container limitations. The cut locations and orientations are transposed to the simulated model. The contaminated items are actually segmented and packaged. The segmentation and packaging may be simulated beforehand. In addition, the contaminated items may be cataloged and recorded.

  11. Nanoscale Semiconductor Electronics

    DTIC Science & Technology

    2015-02-25

    MONITOR’S REPORT Kirtland AFB, NM 87117-5776 NUMBER(S) AFRL -RV-PS-TR-2014-0202 12. DISTRIBUTION / AVAILABILITY STATEMENT Approved for public release...Kingman Rd, Suite 0944 Ft Belvoir, VA 22060-6218 1 cy AFRL /RVIL Kirtland AFB, NM 87117-5776 2 cys Official Record Copy AFRL /RVSE/Jesse Mee 1 cy ... AFRL -RV-PS- AFRL -RV-PS- TR-2014-0202 TR-2014-0202 NANOSCALE SEMICONDUCTOR ELECTRONICS Steven R. J. Brueck and Ganesh Balakrishnan University of New

  12. Electrowetting on semiconductors

    NASA Astrophysics Data System (ADS)

    Palma, Cesar; Deegan, Robert

    2015-01-01

    Applying a voltage difference between a conductor and a sessile droplet sitting on a thin dielectric film separating it from the conductor will cause the drop to spread. When the conductor is a good metal, the change of the drop's contact angle due to the voltage is given by the Young-Lippmann (YL) equation. Here, we report experiments with lightly doped, single crystal silicon as the conductive electrode. We derive a modified YL equation that includes effects due to the semiconductor and contact line pinning. We show that light induces a non-reversible wetting transition, and that our model agrees well with our experimental results.

  13. Semiconductor cooling apparatus

    NASA Technical Reports Server (NTRS)

    Banks, Bruce A. (Inventor); Gaier, James R. (Inventor)

    1993-01-01

    Gas derived graphite fibers generated by the decomposition of an organic gas are joined with a suitable binder. This produces a high thermal conductivity composite material which passively conducts heat from a source, such as a semiconductor, to a heat sink. The fibers may be intercalated. The intercalate can be halogen or halide salt, alkaline metal, or any other species which contributes to the electrical conductivity improvement of the graphite fiber. The fibers are bundled and joined with a suitable binder to form a high thermal conductivity composite material device. The heat transfer device may also be made of intercalated highly oriented pyrolytic graphite and machined, rather than made of fibers.

  14. Semiconductor Terahertz Technology

    DTIC Science & Technology

    2009-06-15

    COVERED (From - To) 15-June-2009 Final Report 12 Apr 07 - 15 Apr 09 4. TITLE AND SUBTITLE Sa. CONTRACT NUMBER FA8718-07-C-0030 Semiconductor Terahertz ...and the other for the phononic waveguides. 15. SUBJECT TERMS Quantum cascade laser, gennanium, gennanium-tin, terahertz 16. SECURITY CLASStFICATION OF...7 Figure 7 lllustration of a GaAs-based active region waveguide with either Ga or Au as cladding operating in the Restrahlen band of GaN . 10 Figure 8

  15. Chemically Derivatized Semiconductor Photoelectrodes.

    DTIC Science & Technology

    1982-01-04

    as Si, Ge, and GaAs derivatized with reagents based on ferrocene such as those represented by I and II. Work with p-type semiconductor photoelectrode...Concerning n-type Si it was found that EtOH/0.1 M En-Bu4N)C104 solutions containing A = ferrocene and A+ = ferri-- cinium result in a constant output of...electrical energy from an illuminated photoelectrochemical device configured as in Scheme II.(20) The ferrocene captures the photogenerated h+ at a rate -4

  16. Layered semiconductor neutron detectors

    DOEpatents

    Mao, Samuel S; Perry, Dale L

    2013-12-10

    Room temperature operating solid state hand held neutron detectors integrate one or more relatively thin layers of a high neutron interaction cross-section element or materials with semiconductor detectors. The high neutron interaction cross-section element (e.g., Gd, B or Li) or materials comprising at least one high neutron interaction cross-section element can be in the form of unstructured layers or micro- or nano-structured arrays. Such architecture provides high efficiency neutron detector devices by capturing substantially more carriers produced from high energy .alpha.-particles or .gamma.-photons generated by neutron interaction.

  17. Power semiconductor controlled drives

    NASA Astrophysics Data System (ADS)

    Dubey, Gopal K.

    This book presents power semiconductor controlled drives employing dc motors, induction motors, and synchronous motors. The dynamics of motor and load systems are covered. Open-loop and closed-loop drives are considered, and thyristor, power transistor, and GTO converters are discussed. In-depth coverage is given to ac drives, particularly those fed by voltage and current source inverters and cycloconverters. Full coverage is given to brushless and commutatorless dc drives, including load-commuted synchronous motor drives. Rectifier-controlled dc drives are presented in detail.

  18. High Efficiency, Clean Combustion

    SciTech Connect

    Donald Stanton

    2010-03-31

    Energy use in trucks has been increasing at a faster rate than that of automobiles within the U.S. transportation sector. According to the Energy Information Administration (EIA) Annual Energy Outlook (AEO), a 23% increase in fuel consumption for the U.S. heavy duty truck segment is expected between 2009 to 2020. The heavy duty vehicle oil consumption is projected to grow between 2009 and 2050 while light duty vehicle (LDV) fuel consumption will eventually experience a decrease. By 2050, the oil consumption rate by LDVs is anticipated to decrease below 2009 levels due to CAFE standards and biofuel use. In contrast, the heavy duty oil consumption rate is anticipated to double. The increasing trend in oil consumption for heavy trucks is linked to the vitality, security, and growth of the U.S. economy. An essential part of a stable and vibrant U.S. economy is a productive U.S. trucking industry. Studies have shown that the U.S. gross domestic product (GDP) is strongly correlated to freight transport. Over 90% of all U.S. freight tonnage is transported by diesel power and over 75% is transported by trucks. Given the vital role that the trucking industry plays in the economy, improving the efficiency of the transportation of goods was a central focus of the Cummins High Efficient Clean Combustion (HECC) program. In a commercial vehicle, the diesel engine remains the largest source of fuel efficiency loss, but remains the greatest opportunity for fuel efficiency improvements. In addition to reducing oil consumption and the dependency on foreign oil, this project will mitigate the impact on the environment by meeting US EPA 2010 emissions regulations. Innovation is a key element in sustaining a U.S. trucking industry that is competitive in global markets. Unlike passenger vehicles, the trucking industry cannot simply downsize the vehicle and still transport the freight with improved efficiency. The truck manufacturing and supporting industries are faced with numerous

  19. Automated Facility For Cleaning Large Flex Hoses

    NASA Technical Reports Server (NTRS)

    Landry, Louis E.

    1995-01-01

    Technicians no longer exposed to hazardous cleaning materials. Proposed computer-controlled facility cleans bellow-type expansion joints and large flex hoses. Major portions of automated cleaning facility contained in clean room. One piece of equipment in clean room tower in which hose or expansion joint to be cleaned hoisted by hydraulic machinery and hung vertically. Once hose or expansion joint hung in required position, technician initiates programmed cleaning procedure from console on computer monitoring system. Procedure includes degreasing, cleaning with detergents, rinsing, pickling, and passivating operations. After cleaning completed, technician removes hose or expansion joint from tower and wraps open ends to prevent recontamination of interior.

  20. Air Cleaning Technologies

    PubMed Central

    2005-01-01

    Executive Summary Objective This health technology policy assessment will answer the following questions: When should in-room air cleaners be used? How effective are in-room air cleaners? Are in-room air cleaners that use combined HEPA and UVGI air cleaning technology more effective than those that use HEPA filtration alone? What is the Plasmacluster ion air purifier in the pandemic influenza preparation plan? The experience of severe acute respiratory syndrome (SARS) locally, nationally, and internationally underscored the importance of administrative, environmental, and personal protective infection control measures in health care facilities. In the aftermath of the SARS crisis, there was a need for a clearer understanding of Ontario’s capacity to manage suspected or confirmed cases of airborne infectious diseases. In so doing, the Walker Commission thought that more attention should be paid to the potential use of new technologies such as in-room air cleaning units. It recommended that the Medical Advisory Secretariat of the Ontario Ministry of Health and Long-Term Care evaluate the appropriate use and effectiveness of such new technologies. Accordingly, the Ontario Health Technology Advisory Committee asked the Medical Advisory Secretariat to review the literature on the effectiveness and utility of in-room air cleaners that use high-efficiency particle air (HEPA) filters and ultraviolet germicidal irradiation (UVGI) air cleaning technology. Additionally, the Ontario Health Technology Advisory Committee prioritized a request from the ministry’s Emergency Management Unit to investigate the possible role of the Plasmacluster ion air purifier manufactured by Sharp Electronics Corporation, in the pandemic influenza preparation plan. Clinical Need Airborne transmission of infectious diseases depends in part on the concentration of breathable infectious pathogens (germs) in room air. Infection control is achieved by a combination of administrative, engineering

  1. Semiconductor devices incorporating multilayer interference regions

    DOEpatents

    Biefeld, R.M.; Drummond, T.J.; Gourley, P.L.; Zipperian, T.E.

    1987-08-31

    A semiconductor high reflector comprising a number of thin alternating layers of semiconductor materials is electrically tunable and may be used as a temperature insensitive semiconductor laser in a Fabry-Perot configuration. 8 figs.

  2. Semiconductor devices incorporating multilayer interference regions

    DOEpatents

    Biefeld, Robert M.; Drummond, Timothy J.; Gourley, Paul L.; Zipperian, Thomas E.

    1990-01-01

    A semiconductor high reflector comprising a number of thin alternating layers of semiconductor materials is electrically tunable and may be used as a temperature insensitive semiconductor laser in a Fabry-Perot configuration.

  3. Technological and organizational diversity and technical advance in the early history of the American semiconductor industry

    NASA Astrophysics Data System (ADS)

    Cohen, W.; Holbrook, D.; Klepper, S.

    1994-06-01

    This study examines the early years of the semiconductor industry and focuses on the roles played by different size firms in technologically innovative processes. A large and diverse pool of firms participated in the growth of the industry. Three related technological areas were chosen for in-depth analysis: integrated circuits, materials technology, and device packaging. Large business producing vacuum tubes dominated the early production of semiconductor devices. As the market for new devices grew during the 1950's, new firms were founded and existing firms from other industries, e.g. aircraft builders and instrument makers, began to pursue semiconductor electronics. Small firms began to cater to the emerging industry by supplying materials and equipment. These firms contributed to the development of certain aspects of one thousand firms that were playing some part in the semiconductor industry.

  4. Molecular ion sources for low energy semiconductor ion implantation (invited)

    NASA Astrophysics Data System (ADS)

    Hershcovitch, A.; Gushenets, V. I.; Seleznev, D. N.; Bugaev, A. S.; Dugin, S.; Oks, E. M.; Kulevoy, T. V.; Alexeyenko, O.; Kozlov, A.; Kropachev, G. N.; Kuibeda, R. P.; Minaev, S.; Vizir, A.; Yushkov, G. Yu.

    2016-02-01

    Smaller semiconductors require shallow, low energy ion implantation, resulting space charge effects, which reduced beam currents and production rates. To increase production rates, molecular ions are used. Boron and phosphorous (or arsenic) implantation is needed for P-type and N-type semiconductors, respectively. Carborane, which is the most stable molecular boron ion leaves unacceptable carbon residue on extraction grids. A self-cleaning carborane acid compound (C4H12B10O4) was synthesized and utilized in the ITEP Bernas ion source resulting in large carborane ion output, without carbon residue. Pure gaseous processes are desired to enable rapid switch among ion species. Molecular phosphorous was generated by introducing phosphine in dissociators via 4PH3 = P4 + 6H2; generated molecular phosphorous in a pure gaseous process was then injected into the HCEI Calutron-Bernas ion source, from which P4+ ion beams were extracted. Results from devices and some additional concepts are described.

  5. Molecular ion sources for low energy semiconductor ion implantation (invited).

    PubMed

    Hershcovitch, A; Gushenets, V I; Seleznev, D N; Bugaev, A S; Dugin, S; Oks, E M; Kulevoy, T V; Alexeyenko, O; Kozlov, A; Kropachev, G N; Kuibeda, R P; Minaev, S; Vizir, A; Yushkov, G Yu

    2016-02-01

    Smaller semiconductors require shallow, low energy ion implantation, resulting space charge effects, which reduced beam currents and production rates. To increase production rates, molecular ions are used. Boron and phosphorous (or arsenic) implantation is needed for P-type and N-type semiconductors, respectively. Carborane, which is the most stable molecular boron ion leaves unacceptable carbon residue on extraction grids. A self-cleaning carborane acid compound (C4H12B10O4) was synthesized and utilized in the ITEP Bernas ion source resulting in large carborane ion output, without carbon residue. Pure gaseous processes are desired to enable rapid switch among ion species. Molecular phosphorous was generated by introducing phosphine in dissociators via 4PH3 = P4 + 6H2; generated molecular phosphorous in a pure gaseous process was then injected into the HCEI Calutron-Bernas ion source, from which P4(+) ion beams were extracted. Results from devices and some additional concepts are described.

  6. Computer simulation of gamma-ray spectra from semiconductor detectors

    NASA Astrophysics Data System (ADS)

    Lund, Jim C.; Olschner, Fred; Shah, Kanai S.

    1992-12-01

    Traditionally, researchers developing improved gamma ray detectors have used analytical techniques or, rarely, computer simulations to predict the performance of new detectors. However, with the advent of inexpensive personal computers, it is now possible for virtually all detector researchers to perform some form of numerical computation to predict detector performance. Although general purpose code systems for semiconductor detector performance do not yet exist, it is possible to perform many useful calculations using commercially available, general purpose numerical software packages (such as `spreadsheet' programs intended for business use). With a knowledge of the rudimentary mechanics of detector simulation most researchers, including those with no programming skills, can effectively use numerical simulation methods to predict gamma ray detector performance. In this paper we discuss the details of the numerical simulation of gamma ray detectors with the hope of communicating the simplicity and effectiveness of these methods. In particular, we discuss the steps involved in simulating the pulse height spectrum produced by a semiconductor detector.

  7. Fibre ring cavity semiconductor laser

    SciTech Connect

    Duraev, V P; Medvedev, S V

    2013-10-31

    This paper presents a study of semiconductor lasers having a polarisation maintaining fibre ring cavity. We examine the operating principle and report main characteristics of a semiconductor ring laser, in particular in single- and multiple-frequency regimes, and discuss its application areas. (lasers)

  8. Process for producing chalcogenide semiconductors

    DOEpatents

    Noufi, Rommel; Chen, Yih-Wen

    1987-01-01

    A process for producing chalcogenide semiconductor material is disclosed. The process includes forming a base metal layer and then contacting this layer with a solution having a low pH and containing ions from at least one chalcogen to chalcogenize the layer and form the chalcogenide semiconductor material.

  9. Process for producing chalcogenide semiconductors

    DOEpatents

    Noufi, R.; Chen, Y.W.

    1985-04-30

    A process for producing chalcogenide semiconductor material is disclosed. The process includes forming a base metal layer and then contacting this layer with a solution having a low pH and containing ions from at least one chalcogen to chalcogenize the layer and form the chalcogenide semiconductor material.

  10. Variable temperature semiconductor film deposition

    DOEpatents

    Li, Xiaonan; Sheldon, Peter

    1998-01-01

    A method of depositing a semiconductor material on a substrate. The method sequentially comprises (a) providing the semiconductor material in a depositable state such as a vapor for deposition on the substrate; (b) depositing the semiconductor material on the substrate while heating the substrate to a first temperature sufficient to cause the semiconductor material to form a first film layer having a first grain size; (c) continually depositing the semiconductor material on the substrate while cooling the substrate to a second temperature sufficient to cause the semiconductor material to form a second film layer deposited on the first film layer and having a second grain size smaller than the first grain size; and (d) raising the substrate temperature, while either continuing or not continuing to deposit semiconductor material to form a third film layer, to thereby anneal the film layers into a single layer having favorable efficiency characteristics in photovoltaic applications. A preferred semiconductor material is cadmium telluride deposited on a glass/tin oxide substrate already having thereon a film layer of cadmium sulfide.

  11. Variable temperature semiconductor film deposition

    DOEpatents

    Li, X.; Sheldon, P.

    1998-01-27

    A method of depositing a semiconductor material on a substrate is disclosed. The method sequentially comprises (a) providing the semiconductor material in a depositable state such as a vapor for deposition on the substrate; (b) depositing the semiconductor material on the substrate while heating the substrate to a first temperature sufficient to cause the semiconductor material to form a first film layer having a first grain size; (c) continually depositing the semiconductor material on the substrate while cooling the substrate to a second temperature sufficient to cause the semiconductor material to form a second film layer deposited on the first film layer and having a second grain size smaller than the first grain size; and (d) raising the substrate temperature, while either continuing or not continuing to deposit semiconductor material to form a third film layer, to thereby anneal the film layers into a single layer having favorable efficiency characteristics in photovoltaic applications. A preferred semiconductor material is cadmium telluride deposited on a glass/tin oxide substrate already having thereon a film layer of cadmium sulfide.

  12. Progress in semiconductor drift detectors

    SciTech Connect

    Rehak, P.; Walton, J.; Gatti, E.; Longoni, A.; Sanpietro, M.; Kemmer, J.; Dietl, H.; Holl, P.; Klanner, R.; Lutz, G.

    1985-01-01

    Progress in testing semiconductor drift detectors is reported. Generally better position and energy resolutions were obtained than resolutions published previously. The improvement is mostly due to new electronics better matched to different detectors. It is shown that semiconductor drift detectors are becoming versatile and reliable detectors for position and energy measurements.

  13. Coal cleaning process

    SciTech Connect

    Kindig, J.K.

    1994-01-11

    Fine particle coal is beneficiated in specially designed dense medium cyclones to improve particle acceleration and enhance separation efficiency. Raw coal feed is first sized to remove fine coal particles. The coarse fraction is then separated into clean coal, middlings, and refuse. Middlings are comminuted for beneficiation with the fine fraction. The fine fraction is deslimed in a countercurrent cyclone circuit and then separated as multiple fractions of different size specifications in dense medium cyclones. The dense medium contains ultra-fine magnetite particles of a narrow size distribution which aid separation and improves magnetite recovery. Magnetite is recovered from each separated fraction independently, with non-magnetic effluent water from one fraction diluting feed to a smaller-size fraction, and improving both overall coal and magnetite recovery. Magnetite recovery is in specially designed recovery units, based on particle size, with final separation in a rougher-cleaner-scavenger circuit of magnetic drum separators incorporating a high strength rare earth magnet. 12 figs.

  14. Clean Metal Casting

    SciTech Connect

    Makhlouf M. Makhlouf; Diran Apelian

    2002-02-05

    The objective of this project is to develop a technology for clean metal processing that is capable of consistently providing a metal cleanliness level that is fit for a given application. The program has five tasks: Development of melt cleanliness assessment technology, development of melt contamination avoidance technology, development of high temperature phase separation technology, establishment of a correlation between the level of melt cleanliness and as cast mechanical properties, and transfer of technology to the industrial sector. Within the context of the first task, WPI has developed a standardized Reduced Pressure Test that has been endorsed by AFS as a recommended practice. In addition, within the context of task1, WPI has developed a melt cleanliness sensor based on the principles of electromagnetic separation. An industrial partner is commercializing the sensor. Within the context of the second task, WPI has developed environmentally friendly fluxes that do not contain fluorine. Within the context of the third task, WPI modeled the process of rotary degassing and verified the model predictions with experimental data. This model may be used to optimize the performance of industrial rotary degassers. Within the context of the fourth task, WPI has correlated the level of melt cleanliness at various foundries, including a sand casting foundry, a permanent mold casting foundry, and a die casting foundry, to the casting process and the resultant mechanical properties. This is useful in tailoring the melt cleansing operations at foundries to the particular casting process and the desired properties of cast components.

  15. Packaging - Materials review

    SciTech Connect

    Herrmann, Matthias

    2014-06-16

    Nowadays, a large number of different electrochemical energy storage systems are known. In the last two decades the development was strongly driven by a continuously growing market of portable electronic devices (e.g. cellular phones, lap top computers, camcorders, cameras, tools). Current intensive efforts are under way to develop systems for automotive industry within the framework of electrically propelled mobility (e.g. hybrid electric vehicles, plug-in hybrid electric vehicles, full electric vehicles) and also for the energy storage market (e.g. electrical grid stability, renewable energies). Besides the different systems (cell chemistries), electrochemical cells and batteries were developed and are offered in many shapes, sizes and designs, in order to meet performance and design requirements of the widespread applications. Proper packaging is thereby one important technological step for designing optimum, reliable and safe batteries for operation. In this contribution, current packaging approaches of cells and batteries together with the corresponding materials are discussed. The focus is laid on rechargeable systems for industrial applications (i.e. alkaline systems, lithium-ion, lead-acid). In principle, four different cell types (shapes) can be identified - button, cylindrical, prismatic and pouch. Cell size can be either in accordance with international (e.g. International Electrotechnical Commission, IEC) or other standards or can meet application-specific dimensions. Since cell housing or container, terminals and, if necessary, safety installations as inactive (non-reactive) materials reduce energy density of the battery, the development of low-weight packages is a challenging task. In addition to that, other requirements have to be fulfilled: mechanical stability and durability, sealing (e.g. high permeation barrier against humidity for lithium-ion technology), high packing efficiency, possible installation of safety devices (current interrupt device

  16. Packaging - Materials review

    NASA Astrophysics Data System (ADS)

    Herrmann, Matthias

    2014-06-01

    Nowadays, a large number of different electrochemical energy storage systems are known. In the last two decades the development was strongly driven by a continuously growing market of portable electronic devices (e.g. cellular phones, lap top computers, camcorders, cameras, tools). Current intensive efforts are under way to develop systems for automotive industry within the framework of electrically propelled mobility (e.g. hybrid electric vehicles, plug-in hybrid electric vehicles, full electric vehicles) and also for the energy storage market (e.g. electrical grid stability, renewable energies). Besides the different systems (cell chemistries), electrochemical cells and batteries were developed and are offered in many shapes, sizes and designs, in order to meet performance and design requirements of the widespread applications. Proper packaging is thereby one important technological step for designing optimum, reliable and safe batteries for operation. In this contribution, current packaging approaches of cells and batteries together with the corresponding materials are discussed. The focus is laid on rechargeable systems for industrial applications (i.e. alkaline systems, lithium-ion, lead-acid). In principle, four different cell types (shapes) can be identified - button, cylindrical, prismatic and pouch. Cell size can be either in accordance with international (e.g. International Electrotechnical Commission, IEC) or other standards or can meet application-specific dimensions. Since cell housing or container, terminals and, if necessary, safety installations as inactive (non-reactive) materials reduce energy density of the battery, the development of low-weight packages is a challenging task. In addition to that, other requirements have to be fulfilled: mechanical stability and durability, sealing (e.g. high permeation barrier against humidity for lithium-ion technology), high packing efficiency, possible installation of safety devices (current interrupt device

  17. Components of Adenovirus Genome Packaging

    PubMed Central

    Ahi, Yadvinder S.; Mittal, Suresh K.

    2016-01-01

    Adenoviruses (AdVs) are icosahedral viruses with double-stranded DNA (dsDNA) genomes. Genome packaging in AdV is thought to be similar to that seen in dsDNA containing icosahedral bacteriophages and herpesviruses. Specific recognition of the AdV genome is mediated by a packaging domain located close to the left end of the viral genome and is mediated by the viral packaging machinery. Our understanding of the role of various components of the viral packaging machinery in AdV genome packaging has greatly advanced in recent years. Characterization of empty capsids assembled in the absence of one or more components involved in packaging, identification of the unique vertex, and demonstration of the role of IVa2, the putative packaging ATPase, in genome packaging have provided compelling evidence that AdVs follow a sequential assembly pathway. This review provides a detailed discussion on the functions of the various viral and cellular factors involved in AdV genome packaging. We conclude by briefly discussing the roles of the empty capsids, assembly intermediates, scaffolding proteins, portal vertex and DNA encapsidating enzymes in AdV assembly and packaging. PMID:27721809

  18. Packaging Technology Developed for High-Temperature Silicon Carbide Microsystems

    NASA Technical Reports Server (NTRS)

    Chen, Liang-Yu; Hunter, Gary W.; Neudeck, Philip G.

    2001-01-01

    High-temperature electronics and sensors are necessary for harsh-environment space and aeronautical applications, such as sensors and electronics for space missions to the inner solar system, sensors for in situ combustion and emission monitoring, and electronics for combustion control for aeronautical and automotive engines. However, these devices cannot be used until they can be packaged in appropriate forms for specific applications. Suitable packaging technology for operation temperatures up to 500 C and beyond is not commercially available. Thus, the development of a systematic high-temperature packaging technology for SiC-based microsystems is essential for both in situ testing and commercializing high-temperature SiC sensors and electronics. In response to these needs, researchers at Glenn innovatively designed, fabricated, and assembled a new prototype electronic package for high-temperature electronic microsystems using ceramic substrates (aluminum nitride and aluminum oxide) and gold (Au) thick-film metallization. Packaging components include a ceramic packaging frame, thick-film metallization-based interconnection system, and a low electrical resistance SiC die-attachment scheme. Both the materials and fabrication process of the basic packaging components have been tested with an in-house-fabricated SiC semiconductor test chip in an oxidizing environment at temperatures from room temperature to 500 C for more than 1000 hr. These test results set lifetime records for both high-temperature electronic packaging and high-temperature electronic device testing. As required, the thick-film-based interconnection system demonstrated low (2.5 times of the room-temperature resistance of the Au conductor) and stable (decreased 3 percent in 1500 hr of continuous testing) electrical resistance at 500 C in an oxidizing environment. Also as required, the electrical isolation impedance between printed wires that were not electrically joined by a wire bond remained high

  19. Aristos Optimization Package

    SciTech Connect

    Ridzal, Danis

    2007-03-01

    Aristos is a Trilinos package for nonlinear continuous optimization, based on full-space sequential quadratic programming (SQP) methods. Aristos is specifically designed for the solution of large-scale constrained optimization problems in which the linearized constraint equations require iterative (i.e. inexact) linear solver techniques. Aristos' unique feature is an efficient handling of inexactness in linear system solves. Aristos currently supports the solution of equality-constrained convex and nonconvex optimization problems. It has been used successfully in the area of PDE-constrained optimization, for the solution of nonlinear optimal control, optimal design, and inverse problems.

  20. Safety Analysis Report for packaging (onsite) steel waste package

    SciTech Connect

    BOEHNKE, W.M.

    2000-07-13

    The steel waste package is used primarily for the shipment of remote-handled radioactive waste from the 324 Building to the 200 Area for interim storage. The steel waste package is authorized for shipment of transuranic isotopes. The maximum allowable radioactive material that is authorized is 500,000 Ci. This exceeds the highway route controlled quantity (3,000 A{sub 2}s) and is a type B packaging.

  1. Physics with isotopically controlled semiconductors

    SciTech Connect

    Haller, E. E.

    2010-07-15

    This paper is based on a tutorial presentation at the International Conference on Defects in Semiconductors (ICDS-25) held in Saint Petersburg, Russia in July 2009. The tutorial focused on a review of recent research involving isotopically controlled semiconductors. Studies with isotopically enriched semiconductor structures experienced a dramatic expansion at the end of the Cold War when significant quantities of enriched isotopes of elements forming semiconductors became available for worldwide collaborations. Isotopes of an element differ in nuclear mass, may have different nuclear spins and undergo different nuclear reactions. Among the latter, the capture of thermal neutrons which can lead to neutron transmutation doping, is the most prominent effect for semiconductors. Experimental and theoretical research exploiting the differences in all the properties has been conducted and will be illustrated with selected examples.

  2. Materials for high-density electronic packaging and interconnection

    NASA Technical Reports Server (NTRS)

    1990-01-01

    Electronic packaging and interconnections are the elements that today limit the ultimate performance of advanced electronic systems. Materials in use today and those becoming available are critically examined to ascertain what actions are needed for U.S. industry to compete favorably in the world market for advanced electronics. Materials and processes are discussed in terms of the final properties achievable and systems design compatibility. Weak points in the domestic industrial capability, including technical, industrial philosophy, and political, are identified. Recommendations are presented for actions that could help U.S. industry regain its former leadership position in advanced semiconductor systems production.

  3. All inorganic semiconductor nanowire mesh for direct solar water splitting.

    PubMed

    Liu, Bin; Wu, Cheng-Hao; Miao, Jianwei; Yang, Peidong

    2014-11-25

    The generation of chemical fuels via direct solar-to-fuel conversion from a fully integrated artificial photosynthetic system is an attractive approach for clean and sustainable energy, but so far there has yet to be a system that would have the acceptable efficiency, durability and can be manufactured at a reasonable cost. Here, we show that a semiconductor mesh made from all inorganic nanowires can achieve unassisted solar-driven, overall water-splitting without using any electron mediators. Free-standing nanowire mesh networks could be made in large scales using solution synthesis and vacuum filtration, making this approach attractive for low cost implementation.

  4. Degreasing and cleaning superconducting RF Niobium cavities

    SciTech Connect

    Rauchmiller, Michael; Kellett, Ron; /Fermilab

    2011-09-01

    The purpose and scope of this report is to detail the steps necessary for degreasing and cleaning of superconducting RF Niobium cavities in the A0 clean room. It lists the required equipment and the cleaning procedure.

  5. 21 CFR 800.12 - Contact lens solutions and tablets; tamper-resistant packaging.

    Code of Federal Regulations, 2011 CFR

    2011-04-01

    ... 21 Food and Drugs 8 2011-04-01 2011-04-01 false Contact lens solutions and tablets; tamper....12 Contact lens solutions and tablets; tamper-resistant packaging. (a) General. Unless contact lens solutions used, for example, to clean, disinfect, wet, lubricate, rinse, soak, or store contact lenses...

  6. 21 CFR 800.12 - Contact lens solutions and tablets; tamper-resistant packaging.

    Code of Federal Regulations, 2014 CFR

    2014-04-01

    ... 21 Food and Drugs 8 2014-04-01 2014-04-01 false Contact lens solutions and tablets; tamper....12 Contact lens solutions and tablets; tamper-resistant packaging. (a) General. Unless contact lens solutions used, for example, to clean, disinfect, wet, lubricate, rinse, soak, or store contact lenses...

  7. 21 CFR 800.12 - Contact lens solutions and tablets; tamper-resistant packaging.

    Code of Federal Regulations, 2010 CFR

    2010-04-01

    ... 21 Food and Drugs 8 2010-04-01 2010-04-01 false Contact lens solutions and tablets; tamper....12 Contact lens solutions and tablets; tamper-resistant packaging. (a) General. Unless contact lens solutions used, for example, to clean, disinfect, wet, lubricate, rinse, soak, or store contact lenses...

  8. 21 CFR 800.12 - Contact lens solutions and tablets; tamper-resistant packaging.

    Code of Federal Regulations, 2012 CFR

    2012-04-01

    ... 21 Food and Drugs 8 2012-04-01 2012-04-01 false Contact lens solutions and tablets; tamper....12 Contact lens solutions and tablets; tamper-resistant packaging. (a) General. Unless contact lens solutions used, for example, to clean, disinfect, wet, lubricate, rinse, soak, or store contact lenses...

  9. 21 CFR 800.12 - Contact lens solutions and tablets; tamper-resistant packaging.

    Code of Federal Regulations, 2013 CFR

    2013-04-01

    ... 21 Food and Drugs 8 2013-04-01 2013-04-01 false Contact lens solutions and tablets; tamper....12 Contact lens solutions and tablets; tamper-resistant packaging. (a) General. Unless contact lens solutions used, for example, to clean, disinfect, wet, lubricate, rinse, soak, or store contact lenses...

  10. Industrial packaging and assembly infrastructure for MOEMS

    NASA Astrophysics Data System (ADS)

    van Heeren, Henne

    2004-01-01

    , packaging and assembly is from nature application specific and solutions found are not always transferable from one product to another. But designers can often benefit from experience from other and general available technologies. A number of companies offer packaging and assembly services for MEMS/MST and this report give typical examples of those commercial services. The companies range from small start-ups, offering very specialized services, to large semiconductor packaging companies, having production lines for microsystem based products. Selecting the proper packaging method may tip the scales towards a product success or towards a product failure, while it nearly always present s a substantial part of the cost of the product. This is therefore is not a marginal concern, but a crucial part of the product design. The presentation will also address mayor trends and technologies. Finally, the article provides sufficient levels of classification and categorisation for various aspects for the technologies, in specific, and the industry, in general, to provide particularly useful insights into the activities and the developments in this market. With over 50 companies studied and assessed, it provides an up to date account of the state of this business and its future potential.

  11. METHOD OF CLEANING METAL SURFACES

    DOEpatents

    Winkler, H.W.; Morfitt, J.W.; Little, T.H.

    1959-05-19

    Cleaning fluids for removing deposits from metal surfaces are described. The cleaning agents of the invention consist of aqueous nitric acid and an amhydrous nitrate salt of a metal which is lower in the electromotive series than the element of the deposit to be removed. In general, the salt content of thc cleaning agents ranged from 10 to 90%, preferably from 10 to 40% by weight; and the balance of the composition comprises nitric acid of any strength from extremely dilute up to concentrated strength.

  12. Dry-cleaning of graphene

    SciTech Connect

    Algara-Siller, Gerardo; Lehtinen, Ossi; Kaiser, Ute; Turchanin, Andrey

    2014-04-14

    Studies of the structural and electronic properties of graphene in its pristine state are hindered by hydrocarbon contamination on the surfaces. Also, in many applications, contamination reduces the performance of graphene. Contamination is introduced during sample preparation and is adsorbed also directly from air. Here, we report on the development of a simple dry-cleaning method for producing large atomically clean areas in free-standing graphene. The cleanness of graphene is proven using aberration-corrected high-resolution transmission electron microscopy and electron spectroscopy.

  13. Methods for detecting residues of cleaning agents during cleaning validation.

    PubMed

    Westman, L; Karlsson, G

    2000-01-01

    Cleaning validation procedures are carried out in order to assure that residues of cleaning agents are within acceptable limits after the cleaning process. Cleaning agents often consist of a mixture of various surfactants which are in a highly diluted state after the water rinsing procedure has been completed. This makes it difficult to find appropriate analytical methods that are sensitive enough to detect the cleaning agents. In addition, it is advantageous for the analytical methods to be simple to perform and to give results quickly. In this study, four different analytical methods are compared: visual detection of foam, pH, conductivity measurements, and analysis of total organic carbon (TOC). TOC was used as a reference method when evaluating the other three potential methods. The analyses were performed on different dilutions of the cleaning agents Vips Neutral, RBS-25, Debisan and Perform. The results demonstrated that the most sensitive method for analysis of Vips Neutral, Debisan and Perform is visual detection of foam, by which it is possible to detect concentrations of cleaning agents down to 10 micrograms/mL. RBS-25 was not detected below 200 micrograms/mL, probably because it is formulated with low-foaming surfactants. TOC analysis is less sensitive but has the advantage of being a quantitative analysis, while visual detection of foam is a semi-quantitative method. Visual detection of foam is easy to perform, gives a quick result, and requires no expensive instrumentation. The sensitivity of each method was found to be dependent upon the type of cleaning agent that was analyzed.

  14. CH Packaging Operations Manual

    SciTech Connect

    None, None

    2009-05-27

    This document provides the user with instructions for assembling a payload. All the steps in Subsections 1.2, Preparing 55-Gallon Drum Payload Assembly; 1.3, Preparing "Short" 85-Gallon Drum Payload Assembly (TRUPACT-II and HalfPACT); 1.4, Preparing "Tall" 85-Gallon Drum Payload Assembly (HalfPACT only); 1.5, Preparing 100-Gallon Drum Payload Assembly; 1.6, Preparing Shielded Container Payload Assembly; 1.7, Preparing SWB Payload Assembly; and 1.8, Preparing TDOP Payload Assembly, must be completed, but may be performed in any order as long as radiological control steps are not bypassed. Transport trailer operations, package loading and unloading from transport trailers, hoisting and rigging activities such as ACGLF operations, equipment checkout and shutdown, and component inspection activities must be performed, but may be performed in any order and in parallel with other activities as long as radiological control steps are not bypassed. Steps involving OCA/ICV lid removal/installation and payload removal/loading may be performed in parallel if there are multiple operators working on the same packaging. Steps involving removal/installation of OCV/ICV upper and lower main O-rings must be performed in sequence, except as noted.

  15. CH Packaging Operations Manual

    SciTech Connect

    None, None

    2008-09-11

    This document provides the user with instructions for assembling a payload. All the steps in Subsections 1.2, Preparing 55-Gallon Drum Payload Assembly; 1.3, Preparing "Short" 85-Gallon Drum Payload Assembly (TRUPACT-II and HalfPACT); 1.4, Preparing "Tall" 85-gallon Drum Payload Assembly (HalfPACT only); 1.5, Preparing 100-Gallon Drum Payload Assembly; 1.6, Preparing SWB Payload Assembly; and 1.7, Preparing TDOP Payload Assembly, must be completed, but may be performed in any order as long as radiological control steps are not bypassed. Transport trailer operations, package loading and unloading from transport trailers, hoisting and rigging activities such as ACGLF operations, equipment checkout and shutdown, and component inspection activities must be performed, but may be performed in any order and in parallel with other activities as long as radiological control steps are not bypassed. Steps involving OCA/ICV lid removal/installation and payload removal/loading may be performed in parallel if there are multiple operators working on the same packaging. Steps involving removal/installation of OCV/ICV upper and lower main O-rings must be performed in sequence.

  16. Japan's electronic packaging technologies

    NASA Technical Reports Server (NTRS)

    Tummala, Rao R.; Pecht, Michael

    1995-01-01

    The JTEC panel found Japan to have significant leadership over the United States in the strategic area of electronic packaging. Many technologies and products once considered the 'heart and soul' of U.S. industry have been lost over the past decades to Japan and other Asian countries. The loss of consumer electronics technologies and products is the most notable of these losses, because electronics is the United States' largest employment sector and is critical for growth businesses in consumer products, computers, automobiles, aerospace, and telecommunications. In the past there was a distinction between consumer and industrial product technologies. While Japan concentrated on the consumer market, the United States dominated the industrial sector. No such distinction is anticipated in the future; the consumer-oriented technologies Japan has dominated are expected to characterize both domains. The future of U.S. competitiveness will, therefore, depend on the ability of the United States to rebuild its technological capabilities in the area of portable electronic packaging.

  17. Japan's electronic packaging technologies

    NASA Astrophysics Data System (ADS)

    Tummala, Rao R.; Pecht, Michael

    1995-02-01

    The JTEC panel found Japan to have significant leadership over the United States in the strategic area of electronic packaging. Many technologies and products once considered the 'heart and soul' of U.S. industry have been lost over the past decades to Japan and other Asian countries. The loss of consumer electronics technologies and products is the most notable of these losses, because electronics is the United States' largest employment sector and is critical for growth businesses in consumer products, computers, automobiles, aerospace, and telecommunications. In the past there was a distinction between consumer and industrial product technologies. While Japan concentrated on the consumer market, the United States dominated the industrial sector. No such distinction is anticipated in the future; the consumer-oriented technologies Japan has dominated are expected to characterize both domains. The future of U.S. competitiveness will, therefore, depend on the ability of the United States to rebuild its technological capabilities in the area of portable electronic packaging.

  18. Signal processor packaging design

    NASA Astrophysics Data System (ADS)

    McCarley, Paul L.; Phipps, Mickie A.

    1993-10-01

    The Signal Processor Packaging Design (SPPD) program was a technology development effort to demonstrate that a miniaturized, high throughput programmable processor could be fabricated to meet the stringent environment imposed by high speed kinetic energy guided interceptor and missile applications. This successful program culminated with the delivery of two very small processors, each about the size of a large pin grid array package. Rockwell International's Tactical Systems Division in Anaheim, California developed one of the processors, and the other was developed by Texas Instruments' (TI) Defense Systems and Electronics Group (DSEG) of Dallas, Texas. The SPPD program was sponsored by the Guided Interceptor Technology Branch of the Air Force Wright Laboratory's Armament Directorate (WL/MNSI) at Eglin AFB, Florida and funded by SDIO's Interceptor Technology Directorate (SDIO/TNC). These prototype processors were subjected to rigorous tests of their image processing capabilities, and both successfully demonstrated the ability to process 128 X 128 infrared images at a frame rate of over 100 Hz.

  19. IN-PACKAGE CHEMISTRY ABSTRACTION

    SciTech Connect

    E. Thomas

    2005-07-14

    This report was developed in accordance with the requirements in ''Technical Work Plan for Postclosure Waste Form Modeling'' (BSC 2005 [DIRS 173246]). The purpose of the in-package chemistry model is to predict the bulk chemistry inside of a breached waste package and to provide simplified expressions of that chemistry as a function of time after breach to Total Systems Performance Assessment for the License Application (TSPA-LA). The scope of this report is to describe the development and validation of the in-package chemistry model. The in-package model is a combination of two models, a batch reactor model, which uses the EQ3/6 geochemistry-modeling tool, and a surface complexation model, which is applied to the results of the batch reactor model. The batch reactor model considers chemical interactions of water with the waste package materials, and the waste form for commercial spent nuclear fuel (CSNF) waste packages and codisposed (CDSP) waste packages containing high-level waste glass (HLWG) and DOE spent fuel. The surface complexation model includes the impact of fluid-surface interactions (i.e., surface complexation) on the resulting fluid composition. The model examines two types of water influx: (1) the condensation of water vapor diffusing into the waste package, and (2) seepage water entering the waste package as a liquid from the drift. (1) Vapor-Influx Case: The condensation of vapor onto the waste package internals is simulated as pure H{sub 2}O and enters at a rate determined by the water vapor pressure for representative temperature and relative humidity conditions. (2) Liquid-Influx Case: The water entering a waste package from the drift is simulated as typical groundwater and enters at a rate determined by the amount of seepage available to flow through openings in a breached waste package.

  20. Indium phosphide negative electron affinity photocathodes: Surface cleaning and activation

    NASA Astrophysics Data System (ADS)

    Sun, Yun

    InP(100) is a very important semi-conductor for many applications. When activated by Cs and oxygen, the InP surface achieves the state of Negative Electron Affinity (NEA) making the Cs+O/InP system a very efficient electron source. Despite many years of study, the chemical cleaning and activation of InP are still not well understood. In our work, we have established an understanding of the basic physics and chemistry for the chemical cleaning and activation of the InP(100) surface. Synchrotron Radiation Photoelectron Spectroscopy is the main technique used in this study because of its high surface sensitivity and ability to identify chemical species present on the surface at each stage of our process. A clean, stoichiometric InP(100) surface is crucial for obtaining high performance of NEA photocathodes. Therefore, the first part of our study focused on the chemical cleaning of InP(100). We found that hydrogen peroxide based solutions alone, originally developed to clean GaAs(100) surfaces and widely used for InP(100), do not result in clean InP(I00) surfaces because oxide is left on the surface. A second cleaning step, which uses acid solutions like HCl or H2SO4, can remove all the oxide and leave a 0.4 ML protective layer of elemental phosphorous on the surface. The elemental phosphorous can be removed by annealing at 330°C and a clean InP(100) surface can be obtained. Cs deposition on InP(100) surface shows clear charge transfer from the Cs ad-atoms to the substrate. When the Cs/InP(100) surface is dosed with oxygen, the charge transfer from the Cs to substrate is reduced and substrate is oxidized. The activation of InP as a NEA photocathode is carried out by an alternating series of steps consisting of Cs deposition and Cs+O co-deposition. Two types of oxygen are found after activation. The first is dissociated oxygen and the other is a di-oxygen species (peroxide or superoxide). The decay of quantum-yield with time and with annealing is studied and changes in

  1. The role of environmental cleaning in the control of hospital-acquired infection.

    PubMed

    Dancer, S J

    2009-12-01

    Increasing numbers of hospital-acquired infections have generated much attention over the last decade. The public has linked the so-called 'superbugs' with their experience of dirty hospitals but the precise role of environmental cleaning in the control of these organisms remains unknown. Until cleaning becomes an evidence-based science, with established methods for assessment, the importance of a clean environment is likely to remain speculative. This review will examine the links between the hospital environment and various pathogens, including meticillin-resistant Staphylococcus aureus, vancomycin-resistant enterococci, norovirus, Clostridium difficile and acinetobacter. These organisms may be able to survive in healthcare environments but there is evidence to support their vulnerability to the cleaning process. Removal with, or without, disinfectants, appears to be associated with reduced infection rates for patients. Unfortunately, cleaning is often delivered as part of an overall infection control package in response to an outbreak and the importance of cleaning as a single intervention remains controversial. Recent work has shown that hand-touch sites are habitually contaminated by hospital pathogens, which are then delivered to patients on hands. It is possible that prioritising the cleaning of these sites might offer a useful adjunct to the current preoccupation with hand hygiene, since hand-touch sites comprise the less well-studied side of the hand-touch site equation. In addition, using proposed standards for hospital hygiene could provide further evidence that cleaning is a cost-effective intervention for controlling hospital-acquired infection.

  2. Semiconductor nanowire lasers

    NASA Astrophysics Data System (ADS)

    Eaton, Samuel W.; Fu, Anthony; Wong, Andrew B.; Ning, Cun-Zheng; Yang, Peidong

    2016-06-01

    The discovery and continued development of the laser has revolutionized both science and industry. The advent of miniaturized, semiconductor lasers has made this technology an integral part of everyday life. Exciting research continues with a new focus on nanowire lasers because of their great potential in the field of optoelectronics. In this Review, we explore the latest advancements in the development of nanowire lasers and offer our perspective on future improvements and trends. We discuss fundamental material considerations and the latest, most effective materials for nanowire lasers. A discussion of novel cavity designs and amplification methods is followed by some of the latest work on surface plasmon polariton nanowire lasers. Finally, exciting new reports of electrically pumped nanowire lasers with the potential for integrated optoelectronic applications are described.

  3. Photocatalysis Using Semiconductor Nanoclusters

    SciTech Connect

    Thurston, T.R.; Wilcoxon,J.P.

    1999-01-21

    We report on experiments using nanosize MoS{sub 2} to photo-oxidize organic pollutants in water using visible light as the energy source. We have demonstrated that we can vary the redox potentials and absorbance characteristics of these small semiconductors by adjusting their size, and our studies of the photooxidation of organic molecules have revealed that the rate of oxidation increases with increasing bandgap (i.e. more positive valence band and more negative conduction band potentials). Because these photocatalysis reactions can be performed with the nanoclusters fully dispersed and stable in solution, liquid chromatography can be used to determine both the intermediate reaction products and the state of the nanoclusters during the reaction. We have demonstrated that the MoS{sub 2} nanoclusters remain unchanged during the photooxidation process by this technique. We also report on studies of MoS{sub 2} nanoclusters deposited on TiO{sub 2} powder.

  4. Semiconductor adiabatic qubits

    DOEpatents

    Carroll, Malcolm S.; Witzel, Wayne; Jacobson, Noah Tobias; Ganti, Anand; Landahl, Andrew J.; Lilly, Michael; Nguyen, Khoi Thi; Bishop, Nathaniel; Carr, Stephen M.; Bussmann, Ezra; Nielsen, Erik; Levy, James Ewers; Blume-Kohout, Robin J.; Rahman, Rajib

    2016-12-27

    A quantum computing device that includes a plurality of semiconductor adiabatic qubits is described herein. The qubits are programmed with local biases and coupling terms between qubits that represent a problem of interest. The qubits are initialized by way of a tuneable parameter, a local tunnel coupling within each qubit, such that the qubits remain in a ground energy state, and that initial state is represented by the qubits being in a superposition of |0> and |1> states. The parameter is altered over time adiabatically or such that relaxation mechanisms maintain a large fraction of ground state occupation through decreasing the tunnel coupling barrier within each qubit with the appropriate schedule. The final state when tunnel coupling is effectively zero represents the solution state to the problem represented in the |0> and |1> basis, which can be accurately read at each qubit location.

  5. Semiconductor radiation detector

    DOEpatents

    Bell, Zane W.; Burger, Arnold

    2010-03-30

    A semiconductor detector for ionizing electromagnetic radiation, neutrons, and energetic charged particles. The detecting element is comprised of a compound having the composition I-III-VI.sub.2 or II-IV-V.sub.2 where the "I" component is from column 1A or 1B of the periodic table, the "II" component is from column 2B, the "III" component is from column 3A, the "IV" component is from column 4A, the "V" component is from column 5A, and the "VI" component is from column 6A. The detecting element detects ionizing radiation by generating a signal proportional to the energy deposited in the element, and detects neutrons by virtue of the ionizing radiation emitted by one or more of the constituent materials subsequent to capture. The detector may contain more than one neutron-sensitive component.

  6. Naval Waste Package Design Report

    SciTech Connect

    M.M. Lewis

    2004-03-15

    A design methodology for the waste packages and ancillary components, viz., the emplacement pallets and drip shields, has been developed to provide designs that satisfy the safety and operational requirements of the Yucca Mountain Project. This methodology is described in the ''Waste Package Design Methodology Report'' Mecham 2004 [DIRS 166168]. To demonstrate the practicability of this design methodology, four waste package design configurations have been selected to illustrate the application of the methodology. These four design configurations are the 21-pressurized water reactor (PWR) Absorber Plate waste package, the 44-boiling water reactor (BWR) waste package, the 5-defense high-level waste (DHLW)/United States (U.S.) Department of Energy (DOE) spent nuclear fuel (SNF) Co-disposal Short waste package, and the Naval Canistered SNF Long waste package. Also included in this demonstration is the emplacement pallet and continuous drip shield. The purpose of this report is to document how that design methodology has been applied to the waste package design configurations intended to accommodate naval canistered SNF. This demonstrates that the design methodology can be applied successfully to this waste package design configuration and support the License Application for construction of the repository.

  7. Hazardous materials package performance regulations

    SciTech Connect

    Russell, N. A.; Glass, R. E.; McClure, J. D.; Finley, N. C.

    1991-01-01

    This paper discusses a hazardous materials Hazmat Packaging Performance Evaluation (HPPE) project being conducted at Sandia National Laboratories for the US Department of Transportation Research Special Programs Administration (DOT-RSPA) to look at the subset of bulk packagings that are larger than 2000 gallons. The objectives of this project are to evaluate current hazmat specification packagings and develop supporting documentation for determining performance requirements for packagings in excess of 2000 gallons that transport hazardous materials that have been classified as extremely toxic by inhalation (METBI).

  8. About the ZOOM minimization package

    SciTech Connect

    Fischler, M.; Sachs, D.; /Fermilab

    2004-11-01

    A new object-oriented Minimization package is available for distribution in the same manner as CLHEP. This package, designed for use in HEP applications, has all the capabilities of Minuit, but is a re-write from scratch, adhering to modern C++ design principles. A primary goal of this package is extensibility in several directions, so that its capabilities can be kept fresh with as little maintenance effort as possible. This package is distinguished by the priority that was assigned to C++ design issues, and the focus on producing an extensible system that will resist becoming obsolete.

  9. New material options for light-emitting diode packaging

    NASA Astrophysics Data System (ADS)

    Zweben, Carl H.

    2004-06-01

    As light-emitting diode (LED) power levels and chip sizes increase, thermal management and thermal stresses, which affect performance, power conversion efficiency nad lifetime, are becoming increasingly serious problems. Traditional materials have serious deficiencies in meeting requirements for thermal management and minimization of thermal stresses in high-brightness (HB) LED packaging. Copper, the standard material for applications requiring high thermal conductivity, has a coefficient of thermal expansion (CTE) that is much larger than those of ceramics and semiconductor materials, giving rise to thermal stresses when packages are subjected to thermal excursions. Aluminum has a larger CTE than copper. Traditional materials with low CTEs have thermal conductivites that are little or no better than that of aluminum. There are an increasing number of new packaging materials with low, tailorable CTEs and thermal conductivities up to four times those of copper that overcome thise limitations. The ability to tailor material CTE has been used to solve critical warping problems in manufacturing, increasing yield from 5% to over 99%. Advanced materials fall into six categories: monolithic carbonaceous materials, metal matrix compsites, carbon/carbon composites, ceramic matrix composites, polymer matrix composites, and advanced metallic alloys. This paper provides an overview of the state of the art of advanced packaging materials, including their key properties, state of maturity, cost and applications.

  10. Clean Air Excellence Award Recipients

    EPA Pesticide Factsheets

    Recipients are organized by award category within each year: Clean Air Technology, Community Action, Education/Outreach, Regulatory/Policy Innovations, Transportation Efficiency Innovations, Thomas W. Zosel individual, and Gregg Cooke Visionary Program.

  11. Clean Air Technology Center Products

    EPA Pesticide Factsheets

    The Clean Air Technology Center provides resources for emerging and existing air pollution prevention and control technologies and provides public access to data and information on their use, effectiveness and cost.

  12. Handwashing: Clean Hands Save Lives

    MedlinePlus

    ... CDC Cancel Submit Search The CDC Handwashing: Clean Hands Save Lives Note: Javascript is disabled or is ... Facebook Tweet Share Compartir When & How to Wash Hands: Key Times and Tips Show Me the Science: ...

  13. Clean Water Act Analytical Methods

    EPA Pesticide Factsheets

    EPA publishes laboratory analytical methods (test procedures) that are used by industries and municipalities to analyze the chemical, physical and biological components of wastewater and other environmental samples required by the Clean Water Act.

  14. Clean Water State Revolving Fund

    EPA Pesticide Factsheets

    How the Clean Water State Revolving Fund works, how to obtain funding, program eligibility, innovative ways to use the funds to get the greatest water quality benefits and leverage financial resources of the program, and share success stories.

  15. A survey of packages for large linear systems

    SciTech Connect

    Wu, Kesheng; Milne, Brent

    2000-02-11

    This paper evaluates portable software packages for the iterative solution of very large sparse linear systems on parallel architectures. While we cannot hope to tell individual users which package will best suit their needs, we do hope that our systematic evaluation provides essential unbiased information about the packages and the evaluation process may serve as an example on how to evaluate these packages. The information contained here include feature comparisons, usability evaluations and performance characterizations. This review is primarily focused on self-contained packages that can be easily integrated into an existing program and are capable of computing solutions to very large sparse linear systems of equations. More specifically, it concentrates on portable parallel linear system solution packages that provide iterative solution schemes and related preconditioning schemes because iterative methods are more frequently used than competing schemes such as direct methods. The eight packages evaluated are: Aztec, BlockSolve,ISIS++, LINSOL, P-SPARSLIB, PARASOL, PETSc, and PINEAPL. Among the eight portable parallel iterative linear system solvers reviewed, we recommend PETSc and Aztec for most application programmers because they have well designed user interface, extensive documentation and very responsive user support. Both PETSc and Aztec are written in the C language and are callable from Fortran. For those users interested in using Fortran 90, PARASOL is a good alternative. ISIS++is a good alternative for those who prefer the C++ language. Both PARASOL and ISIS++ are relatively new and are continuously evolving. Thus their user interface may change. In general, those packages written in Fortran 77 are more cumbersome to use because the user may need to directly deal with a number of arrays of varying sizes. Languages like C++ and Fortran 90 offer more convenient data encapsulation mechanisms which make it easier to implement a clean and intuitive user

  16. Coal cleaning: progress and potential

    SciTech Connect

    Livengood, C.D.; Doctor, R.D.

    1985-01-01

    Results from a detailed analysis of sulfur dioxide (SO/sub 2/) reductions achievable through ''deep'' physical coal cleaning (PCC) at 20 coal-fired power plants in the Ohio-Indiana-Illinois region are presented here. These plants all have capacities larger than 500 MWe, are currently without any flue-gas-desulfurization (FGD) systems, and burn coal of greater than 1% sulfur content (in 1980). Their aggregate emissions of 2.4 million tons of SO/sub 2/ per year represents 55% of the SO/sub 2/ inventory for these states. The principal coal supplies for each power plant were identified and characterized as to coal seam and county of origin, so that published coal-washability data could be matched to each supplier. The SO/sub 2/ reductions that would result from deep cleaning (Level 4) and moderate cleaning (Level 3) of each coal were calculated using a PCC computer model. For deep cleaning, percentage reductions in sulfur content ranged from zero to 52%, with a mean value of 29% and costs ranged from a low of 364/ton SO/sub 2/ removed to over $2000/ton SO/sub 2/ removed. Because coal suppliers to these power plants employ some voluntary coal cleaning, the anticipated emissions reduction from current levels if deep cleaning were used should be near 20%. These emissions reductions were projected using conventional coal cleaning circuit designs. The basic elements of typical commercial PCC designs are briefly described and current research and development activities in physical, chemical, and biological desulfurization of coal are reviewed. Possible governmental actions to either encourage or mandate coal cleaning are identified and evaluated. 13 refs., 5 figs., 3 tabs.

  17. Clean power generation from coal

    SciTech Connect

    Butler, J.W.; Basu, P.

    2007-09-15

    The chapter gives an overview of power generation from coal, describing its environmental impacts, methods of cleaning coal before combustion, combustion methods, and post-combustion cleanup. It includes a section on carbon dioxide capture, storage and utilization. Physical, chemical and biological cleaning methods are covered. Coal conversion techniques covered are: pulverized coal combustion, fluidized-bed combustion, supercritical boilers, cyclone combustion, magnetohydrodynamics and gasification. 66 refs., 29 figs., 8 tabs.

  18. Energy 101: Clean Energy Manufacturing

    ScienceCinema

    None

    2016-07-12

    Most of us have a basic understanding of manufacturing. It's how we convert raw materials, components, and parts into finished goods that meet our essential needs and make our lives easier. But what about clean energy manufacturing? Clean energy and advanced manufacturing have the potential to rejuvenate the U.S. manufacturing industry and open pathways to increased American competitiveness. Watch this video to learn more about this exciting movement and to see some of these innovations in action.

  19. Clean access platform for orbiter

    NASA Technical Reports Server (NTRS)

    Morrison, H.; Harris, J.

    1990-01-01

    The design of the Clean Access Platform at the Kennedy Space Center, beginning with the design requirements and tracing the effort throughout development and manufacturing is described. Also examined are: (1) A system description; (2) Testing requirements and conclusions; (3) Safety and reliability features; (4) Major problems experienced during the project; and (5) Lessons learned, including features necessary for the effective design of mechanisms used in clean systems.

  20. Energy 101: Clean Energy Manufacturing

    SciTech Connect

    2015-07-09

    Most of us have a basic understanding of manufacturing. It's how we convert raw materials, components, and parts into finished goods that meet our essential needs and make our lives easier. But what about clean energy manufacturing? Clean energy and advanced manufacturing have the potential to rejuvenate the U.S. manufacturing industry and open pathways to increased American competitiveness. Watch this video to learn more about this exciting movement and to see some of these innovations in action.

  1. Clean Energy Solutions Center (Presentation)

    SciTech Connect

    Reategui, S.

    2012-07-01

    The Clean Energy Ministerial launched the Clean Energy Solutions Center in April, 2011 for major economy countries, led by Australia and U.S. with other CEM partners. Partnership with UN-Energy is extending scope to support all developing countries: 1. Enhance resources on policies relating to energy access, small to medium enterprises (SMEs), and financing programs; 2. Offer expert policy assistance to all countries; 3. Expand peer to peer learning, training, and deployment and policy data for developing countries.

  2. Advanced cleaning by mass finishing

    NASA Astrophysics Data System (ADS)

    McCoy, M. W.

    1983-10-01

    The effectiveness of vibratory finishing for removing a variety of radioactively contaminated soils was investigated by measuring the radiation levels of the test material, the lining of the vibratory finishing tub, and the media. Many soils including corrosion products, scale, oil, grease and paint were removed from steels, aluminum, polyvinyl chloride, plexiglass, glass and flexible materials such as rubber. Zinc, copper, and lead were not cleaned. Results indicate that vibratory finishing should be an effective cleaning process or a variety of manufacturing operations.

  3. Package Up Your Troubles--An Introduction to Package Libraries

    ERIC Educational Resources Information Center

    Frank, Colin

    1978-01-01

    Discusses a "package deal" library--a prefabricated building including interior furnishing--in terms of costs, fitness for purpose, and interior design, i.e., shelving, flooring, heating, lighting, and humidity. Advantages and disadvantages of the package library are also considered. (Author/MBR)

  4. The Packaging Handbook -- A guide to package design

    SciTech Connect

    Shappert, L.B.

    1995-12-31

    The Packaging Handbook is a compilation of 14 technical chapters and five appendices that address the life cycle of a packaging which is intended to transport radioactive material by any transport mode in normal commerce. Although many topics are discussed in depth, this document focuses on the design aspects of a packaging. The Handbook, which is being prepared under the direction of the US Department of Energy, is intended to provide a wealth of technical guidance that will give designers a better understanding of the regulatory approval process, preferences of regulators in specific aspects of packaging design, and the types of analyses that should be seriously considered when developing the packaging design. Even though the Handbook is concerned with all packagings, most of the emphasis is placed on large packagings that are capable of transporting large radioactive sources that are also fissile (e.g., spent fuel). These are the types of packagings that must address the widest range of technical topics in order to meet domestic and international regulations. Most of the chapters in the Handbook have been drafted and submitted to the Oak Ridge National Laboratory for editing; the majority of these have been edited. This report summarizes the contents.

  5. Anhydrous Ammonia Training Module. Trainer's Package. Participant's Package.

    ERIC Educational Resources Information Center

    Beaudin, Bart; And Others

    This document contains a trainer's and a participant's package for teaching employees on site safe handling procedures for working with anhydrous ammonia, especially on farms. The trainer's package includes the following: a description of the module; a competency; objectives; suggested instructional aids; a training outline (or lesson plan) for…

  6. Towards expanding megasonic cleaning capability

    NASA Astrophysics Data System (ADS)

    Han, Zhenxing; Ferstl, Berthold; Oetter, Günter; Dietze, Uwe; Samayoa, Martin; Dattilo, Davide

    2016-10-01

    Megasonic cleaning remains the industry's workhorse technology for particle removal on advanced 193i and extreme ultraviolet (EUV) photomasks. Several megasonic cleaning technologies and chemistries have been proposed and implemented over the years in diverse production environments. The operational range of these process technologies, over a wide array of applications, is ultimately defined by measurable capability limits. As geometries continue to scale-down and new materials are introduced, existing cleaning technologies will naturally fade out of range and new capability is ultimately required. This paper presents a novel fundamental approach for expanding cleaning capability by use of high-frequency megasonics and tenside-based additives (BASF SELECTIPUR C-series). To this end, a sonoluminescence-based experimental test bench was configured to characterize and study the effects of various process parameters on cleaning performance, with a particular emphasis on cavitation-induced damage and enhancement of particle removal capabilities. The results from the fundamental studies provide a path forward towards delivering new cleaning capability by enabling high-frequency megasonic systems and tenside-based additives.

  7. Clean Energy Application Center

    SciTech Connect

    Freihaut, Jim

    2013-09-30

    The Mid Atlantic Clean Energy Application Center (MACEAC), managed by The Penn State College of Engineering, serves the six states in the Mid-Atlantic region (Pennsylvania, New Jersey, Delaware, Maryland, Virginia and West Virginia) plus the District of Columbia. The goals of the Mid-Atlantic CEAC are to promote the adoption of Combined Heat and Power (CHP), Waste Heat Recovery (WHR) and District Energy Systems (DES) in the Mid Atlantic area through education and technical support to more than 1,200 regional industry and government representatives in the region. The successful promotion of these technologies by the MACEAC was accomplished through the following efforts; (1)The MACEAC developed a series of technology transfer networks with State energy and environmental offices, Association of Energy Engineers local chapters, local community development organizations, utilities and, Penn State Department of Architectural Engineering alumni and their firms to effectively educate local practitioners about the energy utilization, environmental and economic advantages of CHP, WHR and DES; (2) Completed assessments of the regional technical and market potential for CHP, WHR and DE technologies application in the context of state specific energy prices, state energy and efficiency portfolio development. The studies were completed for Pennsylvania, New Jersey and Maryland and included a set of incentive adoption probability models used as a to guide during implementation discussions with State energy policy makers; (3) Using the technical and market assessments and adoption incentive models, the Mid Atlantic CEAC developed regional strategic action plans for the promotion of CHP Application technology for Pennsylvania, New Jersey and Maryland; (4) The CHP market assessment and incentive adoption model information was discussed, on a continuing basis, with relevant state agencies, policy makers and Public Utility Commission organizations resulting in CHP favorable incentive

  8. Semiconductor Nanocrystals for Biological Imaging

    SciTech Connect

    Fu, Aihua; Gu, Weiwei; Larabell, Carolyn; Alivisatos, A. Paul

    2005-06-28

    Conventional organic fluorophores suffer from poor photo stability, narrow absorption spectra and broad emission feature. Semiconductor nanocrystals, on the other hand, are highly photo-stable with broad absorption spectra and narrow size-tunable emission spectra. Recent advances in the synthesis of these materials have resulted in bright, sensitive, extremely photo-stable and biocompatible semiconductor fluorophores. Commercial availability facilitates their application in a variety of unprecedented biological experiments, including multiplexed cellular imaging, long-term in vitro and in vivo labeling, deep tissue structure mapping and single particle investigation of dynamic cellular processes. Semiconductor nanocrystals are one of the first examples of nanotechnology enabling a new class of biomedical applications.

  9. Wafer-level packaging with compression-controlled seal ring bonding

    DOEpatents

    Farino, Anthony J

    2013-11-05

    A device may be provided in a sealed package by aligning a seal ring provided on a first surface of a first semiconductor wafer in opposing relationship with a seal ring that is provided on a second surface of a second semiconductor wafer and surrounds a portion of the second wafer that contains the device. Forcible movement of the first and second wafer surfaces toward one another compresses the first and second seal rings against one another. A physical barrier against the movement, other than the first and second seal rings, is provided between the first and second wafer surfaces.

  10. Tantalum-based semiconductors for solar water splitting.

    PubMed

    Zhang, Peng; Zhang, Jijie; Gong, Jinlong

    2014-07-07

    Solar energy utilization is one of the most promising solutions for the energy crises. Among all the possible means to make use of solar energy, solar water splitting is remarkable since it can accomplish the conversion of solar energy into chemical energy. The produced hydrogen is clean and sustainable which could be used in various areas. For the past decades, numerous efforts have been put into this research area with many important achievements. Improving the overall efficiency and stability of semiconductor photocatalysts are the research focuses for the solar water splitting. Tantalum-based semiconductors, including tantalum oxide, tantalate and tantalum (oxy)nitride, are among the most important photocatalysts. Tantalum oxide has the band gap energy that is suitable for the overall solar water splitting. The more negative conduction band minimum of tantalum oxide provides photogenerated electrons with higher potential for the hydrogen generation reaction. Tantalates, with tunable compositions, show high activities owning to their layered perovskite structure. (Oxy)nitrides, especially TaON and Ta3N5, have small band gaps to respond to visible-light, whereas they can still realize overall solar water splitting with the proper positions of conduction band minimum and valence band maximum. This review describes recent progress regarding the improvement of photocatalytic activities of tantalum-based semiconductors. Basic concepts and principles of solar water splitting will be discussed in the introduction section, followed by the three main categories regarding to the different types of tantalum-based semiconductors. In each category, synthetic methodologies, influencing factors on the photocatalytic activities, strategies to enhance the efficiencies of photocatalysts and morphology control of tantalum-based materials will be discussed in detail. Future directions to further explore the research area of tantalum-based semiconductors for solar water splitting

  11. Silicon Metal-Oxide-Semiconductor Quantum Devices

    NASA Astrophysics Data System (ADS)

    Nordberg, Eric

    This thesis presents stable quantum dots in a double gated silicon metal-oxide-semiconductor (MOS) system with an open-lateral geometry. In recent years, semiconductor lateral quantum dots have emerged as an appealing approach to quantum computing. Silicon offers the potential for very long electron spin decoherence times in these dots. Several important steps toward a functioning silicon-based electron spin qubit are presented, including stable Coulomb blockade within a quantum dot, a tunable double quantum dot, and integrated charge sensing. A fabrication process has been created to make low-disorder constrictions on relatively high mobility Si-MOS material and to facilitate essentially arbitrary gate geometries. Within this process, changes in mobility and charge defect densities are measured for critical process steps. This data was used to guide the fabrication of devices culminating, in this work, with a clean, stable quantum dot in a double-gated MOS system. Stable Coulomb-blockade behavior showing single-period conductance oscillations was observed in MOS quantum dots. Measured capacitances within each device and capacitances calculated via modeling are compared, showing that the measured Coulomb-blockade is consistent with a lithographically defined quantum dot, as opposed to a disorder dot within a single constriction. A tunable double dot is also observed. Laterally coupled charge sensing of quantum dots is highly desirable because it enables measurement even when conduction through the quantum dot itself is suppressed. Such charge sensing is demonstrated in this system. The current through a point contact constriction located near a quantum dot shows sharp 2% changes corresponding to charge transitions between the dot and a nearby lead. The coupling capacitance between the charge sensor and the quantum dot is extracted and agrees well with a capacitance model of the integrated sensor and quantum dot system.

  12. Space Research Results Purify Semiconductor Materials

    NASA Technical Reports Server (NTRS)

    2010-01-01

    While President Obama's news that NASA would encourage private companies to develop vehicles to take NASA into space may have come as a surprise to some, NASA has always encouraged private companies to invest in space. More than two decades ago, NASA established Commercial Space Centers across the United States to encourage industry to use space as a place to conduct research and to apply NASA technology to Earth applications. Although the centers are no longer funded by NASA, the advances enabled by that previous funding are still impacting us all today. For example, the Space Vacuum Epitaxy Center (SVEC) at the University of Houston, one of the 17 Commercial Space Centers, had a mission to create advanced thin film semiconductor materials and devices through the use of vacuum growth technologies both on Earth and in space. Making thin film materials in a vacuum (low-pressure environment) is advantageous over making them in normal atmospheric pressures, because contamination floating in the air is lessened in a vacuum. To grow semiconductor crystals, researchers at SVEC utilized epitaxy the process of depositing a thin layer of material on top of another thin layer of material. On Earth, this process took place in a vacuum chamber in a clean room lab. For space, the researchers developed something called the Wake Shield Facility (WSF), a 12-foot-diameter disk-shaped platform designed to grow thin film materials using the low-pressure environment in the wake of the space shuttle. Behind an orbiting space shuttle, the vacuum levels are thousands of times better than in the best vacuum chambers on Earth. Throughout the 1990s, the WSF flew on three space shuttle missions as a series of proof-of-concept missions. These experiments are a lasting testament to the success of the shuttle program and resulted in the development of the first thin film materials made in the vacuum of space, helping to pave the way for better thin film development on Earth.

  13. Tritium waste package

    DOEpatents

    Rossmassler, Rich; Ciebiera, Lloyd; Tulipano, Francis J.; Vinson, Sylvester; Walters, R. Thomas

    1995-01-01

    A containment and waste package system for processing and shipping tritium xide waste received from a process gas includes an outer drum and an inner drum containing a disposable molecular sieve bed (DMSB) seated within outer drum. The DMSB includes an inlet diffuser assembly, an outlet diffuser assembly, and a hydrogen catalytic recombiner. The DMSB absorbs tritium oxide from the process gas and converts it to a solid form so that the tritium is contained during shipment to a disposal site. The DMSB is filled with type 4A molecular sieve pellets capable of adsorbing up to 1000 curies of tritium. The recombiner contains a sufficient amount of catalyst to cause any hydrogen add oxygen present in the process gas to recombine to form water vapor, which is then adsorbed onto the DMSB.

  14. Tritium waste package

    DOEpatents

    Rossmassler, R.; Ciebiera, L.; Tulipano, F.J.; Vinson, S.; Walters, R.T.

    1995-11-07

    A containment and waste package system for processing and shipping tritium oxide waste received from a process gas includes an outer drum and an inner drum containing a disposable molecular sieve bed (DMSB) seated within the outer drum. The DMSB includes an inlet diffuser assembly, an outlet diffuser assembly, and a hydrogen catalytic recombiner. The DMSB absorbs tritium oxide from the process gas and converts it to a solid form so that the tritium is contained during shipment to a disposal site. The DMSB is filled with type 4A molecular sieve pellets capable of adsorbing up to 1000 curies of tritium. The recombiner contains a sufficient amount of catalyst to cause any hydrogen and oxygen present in the process gas to recombine to form water vapor, which is then adsorbed onto the DMSB. 1 fig.

  15. The LISA Technology Package

    NASA Technical Reports Server (NTRS)

    Livas, Jeff

    2009-01-01

    The LISA Technology Package (LTP) is the payload of the European Space Agency's LISA Pathfinder mission. LISA Pathfinder was instigated to test, in a flight environment, the critical technologies required by LISA; namely, the inertial sensing subsystem and associated control laws and micro-Newton thrusters required to place a macroscopic test mass in pure free-fall. The UP is in the late stages of development -- all subsystems are currently either in the final stages of manufacture or in test. Available flight units are being integrated into the real-time testbeds for system verification tests. This poster will describe the UP and its subsystems, give the current status of the hardware and test campaign, and outline the future milestones leading to the UP delivery.

  16. Balloon gondola diagnostics package

    NASA Astrophysics Data System (ADS)

    Cantor, K. M.

    1986-10-01

    In order to define a new gondola structural specification and to quantify the balloon termination environment, NASA developed a balloon gondola diagnostics package (GDP). This addition to the balloon flight train is comprised of a large array of electronic sensors employed to define the forces and accelerations imposed on a gondola during the termination event. These sensors include the following: a load cell, a three-axis accelerometer, two three-axis rate gyros, two magnetometers, and a two axis inclinometer. A transceiver couple allows the data to be telemetered across any in-line rotator to the gondola-mounted memory system. The GDP is commanded 'ON' just prior to parachute deployment in order to record the entire event.

  17. Semiconductor device PN junction fabrication using optical processing of amorphous semiconductor material

    SciTech Connect

    Sopori, Bhushan; Rangappan, Anikara

    2014-11-25

    Systems and methods for semiconductor device PN junction fabrication are provided. In one embodiment, a method for fabricating an electrical device having a P-N junction comprises: depositing a layer of amorphous semiconductor material onto a crystalline semiconductor base, wherein the crystalline semiconductor base comprises a crystalline phase of a same semiconductor as the amorphous layer; and growing the layer of amorphous semiconductor material into a layer of crystalline semiconductor material that is epitaxially matched to the lattice structure of the crystalline semiconductor base by applying an optical energy that penetrates at least the amorphous semiconductor material.

  18. Electro-Microfluidic Packaging

    SciTech Connect

    BENAVIDES, GILBERT L.; GALAMBOS, PAUL C.

    2002-06-01

    Electro-microfluidics is experiencing explosive growth in new product developments. There are many commercial applications for electro-microfluidic devices such as chemical sensors, biological sensors, and drop ejectors for both printing and chemical analysis. The number of silicon surface micromachined electro-microfluidic products is likely to increase. Manufacturing efficiency and integration of microfluidics with electronics will become important. Surface micromachined microfluidic devices are manufactured with the same tools as IC's (integrated circuits) and their fabrication can be incorporated into the IC fabrication process. In order to realize applications for devices must be developed. An Electro-Microfluidic Dual In-line Package (EMDIP{trademark}) was developed surface micromachined electro-microfluidic devices, a practical method for getting fluid into these to be a standard solution that allows for both the electrical and the fluidic connections needed to operate a great variety of electro-microfluidic devices. The EMDIP{trademark} includes a fan-out manifold that, on one side, mates directly with the 200 micron diameter Bosch etched holes found on the device, and, on the other side, mates to lager 1 mm diameter holes. To minimize cost the EMDIP{trademark} can be injection molded in a great variety of thermoplastics which also serve to optimize fluid compatibility. The EMDIP{trademark} plugs directly into a fluidic printed wiring board using a standard dual in-line package pattern for the electrical connections and having a grid of multiple 1 mm diameter fluidic connections to mate to the underside of the EMDIP{trademark}.

  19. State of the art in semiconductor detectors

    SciTech Connect

    Rehak, P. ); Gatti, E. )

    1989-01-01

    The state of the art in semiconductor detectors for elementary particle physics and x-ray astronomy is briefly reviewed. Semiconductor detectors are divided into two groups; classical semiconductor diode detectors; and semiconductor memory detectors. Principles of signal formation for both groups of detectors are described and their performance is compared. New developments of silicon detectors are reported here. 13 refs., 8 figs.

  20. Megasonic cleaning: effect of dissolved gas properties on cleaning

    NASA Astrophysics Data System (ADS)

    Shende, Hrishi; Singh, Sherjang; Baugh, James; Dietze, Uwe; Dress, Peter

    2013-06-01

    Current and future lithography techniques require complex imaging improvement strategies. These imaging improvement strategies require printing of sub-resolution assist-features (SRAF) on photomasks. The size of SRAF's has proven to be the main limiting factor in using high power Megasonic cleaning process on photomasks. These features, due to high aspect ratio are more prone to damage at low Megasonic frequencies and at high Megasonic powers. Additionally the non-uniformity of energy dissipated during Megasonic cleaning is a concern for exceeding the damage threshold of the SRAFs. If the cavitation events during Megasonic cleaning are controlled in way to dissipate uniform energy, better process control can be achieved to clean without damage. The amount and type of gas dissolved in the cleaning liquid defines the cavitation behavior. Some of the gases possess favourable solubility and adiabatic properties for stable and controlled cavitation behaviour. This paper particularly discusses the effects of dissolved Ar gas on Megasonic characteristics. The effect of Ar Gas is characterized by measuring acoustic energy and Sonoluminscense. The phenomenon is further verified with pattern damage studies.

  1. Solar water heater design package

    NASA Technical Reports Server (NTRS)

    1981-01-01

    Package describes commercial domestic-hot-water heater with roof or rack mounted solar collectors. System is adjustable to pre-existing gas or electric hot-water house units. Design package includes drawings, description of automatic control logic, evaluation measurements, possible design variations, list of materials and installation tools, and trouble-shooting guide and manual.

  2. Individualized Learning Package about Etching.

    ERIC Educational Resources Information Center

    Sauer, Michael J.

    An individualized learning package provides step-by-step instruction in the fundamentals of the etching process. Thirteen specific behavioral objectives are listed. A pretest, consisting of matching 15 etching terms with their definitions, is provided along with an answer key. The remainder of the learning package teaches the 13 steps of the…

  3. The Macro - TIPS Course Package.

    ERIC Educational Resources Information Center

    Heriot-Watt Univ., Edinburgh (Scotland). Esmee Fairbairn Economics Research Centre.

    The TIPS (Teaching Information Processing System) Course Package was designed to be used with the Macro-Games Course Package (SO 011 930) in order to train college students to apply the tools of economic analysis to current problems. TIPS is used to provide feedback and individualized assignments to students, as well as information about the…

  4. Chemical Energy: A Learning Package.

    ERIC Educational Resources Information Center

    Cohen, Ita; Ben-Zvi, Ruth

    1982-01-01

    A comprehensive teaching/learning chemical energy package was developed to overcome conceptual/experimental difficulties and time required for calculation of enthalpy changes. The package consists of five types of activities occuring in repeated cycles: group activities, laboratory experiments, inquiry questionnaires, teacher-led class…

  5. Microelectronics/electronic packaging potential

    NASA Technical Reports Server (NTRS)

    Sandeau, R. F.

    1977-01-01

    The trend toward smaller and lighter electronic packages was examined. It is suggested that electronic packaging engineers and microelectronic designers closely associate and give full attention to optimization of both disciplines on all product lines. Extensive research and development work underway to explore innovative ideas and make new inroads into the technology base, is expected to satisfy the demands of the 1980's.

  6. Oral Hygiene. Learning Activity Package.

    ERIC Educational Resources Information Center

    Hime, Kirsten

    This learning activity package on oral hygiene is one of a series of 12 titles developed for use in health occupations education programs. Materials in the package include objectives, a list of materials needed, a list of definitions, information sheets, reviews (self evaluations) of portions of the content, and answers to reviews. These topics…

  7. 49 CFR 173.63 - Packaging exceptions.

    Code of Federal Regulations, 2010 CFR

    2010-10-01

    ... 49 Transportation 2 2010-10-01 2010-10-01 false Packaging exceptions. 173.63 Section 173.63... SHIPMENTS AND PACKAGINGS Definitions, Classification and Packaging for Class 1 § 173.63 Packaging exceptions... which are used to project fastening devices. (2) Packaging for cartridges, small arms, and...

  8. 49 CFR 173.411 - Industrial packagings.

    Code of Federal Regulations, 2010 CFR

    2010-10-01

    ... record retention applicable to Industrial Packaging Type 1 (IP-1), Industrial Packaging Type 2 (IP-2), and Industrial Packaging Type 3 (IP-3). (b) Industrial packaging certification and tests. (1) Each IP... specified in § 173.412(a) through (j). (4) Tank containers may be used as Industrial package Types 2 or...

  9. 19 CFR 191.13 - Packaging materials.

    Code of Federal Regulations, 2010 CFR

    2010-04-01

    ... 19 Customs Duties 2 2010-04-01 2010-04-01 false Packaging materials. 191.13 Section 191.13 Customs... (CONTINUED) DRAWBACK General Provisions § 191.13 Packaging materials. (a) Imported packaging material... packaging material when used to package or repackage merchandise or articles exported or destroyed...

  10. 19 CFR 191.13 - Packaging materials.

    Code of Federal Regulations, 2012 CFR

    2012-04-01

    ... 19 Customs Duties 2 2012-04-01 2012-04-01 false Packaging materials. 191.13 Section 191.13 Customs... (CONTINUED) DRAWBACK General Provisions § 191.13 Packaging materials. (a) Imported packaging material... packaging material when used to package or repackage merchandise or articles exported or destroyed...

  11. Post-Cleaning Effect on a HfO2 Gate Stack Using a NF3/NH3 Plasma.

    PubMed

    Lee, Min-Seon; Oh, Hoon-Jung; Lee, Joo-Hee; Lee, In-Geun; Shin, Woo-Gon; Kim, Kyu-Dong; Park, Jin-Gu; Ko, Dae-Hong

    2016-05-01

    The effects of dry cleaning of a HfO2 gate stack using NF3 only and a NF3/NH3 gas mixture plasma were investigated. The plasma dry cleaning process was carried out after HfO2 deposition using an indirect down-flow capacitively coupled plasma (CCP) system. An analysis of the chemical composition of the HfO2 gate stacks by XPS indicated that fluorine was incorporated into the HfO2 films during the plasma dry cleaning. Significant changes in the HfO2 chemical composition were observed as a result of the NF3 dry cleaning, while they were not observed in this case of NF3/NH3 dry cleaning. TEM results showed that the interfacial layer (IL) between the HfO2 and Si thickness was increased by the plasma dry cleaning. However, in the case of NF3/NH3 dry cleaning using 150 W, the IL thickness was suppressed significantly compared to the sample that had not been dry cleaned. Its electrical properties were also improved, including the low gate leakage currents, and reduced EOT. Finally, the finding show that the IL thickness of the HfO2 gate stack can be controlled by using the novel NF3/NH3 dry cleaning process technique without any the significant changes in chemical composition and metal-oxide-semiconductor (MOS) capacitor characteristics.

  12. Semiconductor technology program. Progress briefs

    NASA Technical Reports Server (NTRS)

    Bullis, W. M.

    1980-01-01

    Measurement technology for semiconductor materials, process control, and devices is reviewed. Activities include: optical linewidth and thermal resistance measurements; device modeling; dopant density profiles; resonance ionization spectroscopy; and deep level measurements. Standardized oxide charge terminology is also described.

  13. Metal-Insulator-Semiconductor Photodetectors

    PubMed Central

    Lin, Chu-Hsuan; Liu, Chee Wee

    2010-01-01

    The major radiation of the Sun can be roughly divided into three regions: ultraviolet, visible, and infrared light. Detection in these three regions is important to human beings. The metal-insulator-semiconductor photodetector, with a simpler process than the pn-junction photodetector and a lower dark current than the MSM photodetector, has been developed for light detection in these three regions. Ideal UV photodetectors with high UV-to-visible rejection ratio could be demonstrated with III–V metal-insulator-semiconductor UV photodetectors. The visible-light detection and near-infrared optical communications have been implemented with Si and Ge metal-insulator-semiconductor photodetectors. For mid- and long-wavelength infrared detection, metal-insulator-semiconductor SiGe/Si quantum dot infrared photodetectors have been developed, and the detection spectrum covers atmospheric transmission windows. PMID:22163382

  14. Signal processing for semiconductor detectors

    SciTech Connect

    Goulding, F.S.; Landis, D.A.

    1982-02-01

    A balanced perspective is provided on the processing of signals produced by semiconductor detectors. The general problems of pulse shaping to optimize resolution with constraints imposed by noise, counting rate and rise time fluctuations are discussed.

  15. Optical properties of semiconductor microcavities

    NASA Astrophysics Data System (ADS)

    Son, Joong-Kon

    Thanks to the difference in energy gap between two semiconductors and to their different indices of refraction, semiconductor heterostructures can confine electrons as well as photons. This property makes it possible to build semiconductor-based optical resonators (microcavities) with a radiation dipole (a quantum well) in its midst to investigate the coupling between the optical modes of the microcavity with the exciton modes of the quantum well. Such an interaction, besides its intrinsic interest, is relevant to vertically-emitting semiconductor lasers, based on the quantum well- microcavity system. In this thesis, we will present experimental evidence of temperature and electric-field dependent exciton-cavity coupling in GaAs-GaAlAs microcavities.

  16. Electromagnetically Clean Solar Arrays

    NASA Technical Reports Server (NTRS)

    Stem, Theodore G.; Kenniston, Anthony E.

    2008-01-01

    The term 'electromagnetically clean solar array' ('EMCSA') refers to a panel that contains a planar array of solar photovoltaic cells and that, in comparison with a functionally equivalent solar-array panel of a type heretofore used on spacecraft, (1) exhibits less electromagnetic interferences to and from other nearby electrical and electronic equipment and (2) can be manufactured at lower cost. The reduction of electromagnetic interferences is effected through a combination of (1) electrically conductive, electrically grounded shielding and (2) reduction of areas of current loops (in order to reduce magnetic moments). The reduction of cost is effected by designing the array to be fabricated as a more nearly unitary structure, using fewer components and fewer process steps. Although EMCSAs were conceived primarily for use on spacecraft they are also potentially advantageous for terrestrial applications in which there are requirements to limit electromagnetic interference. In a conventional solar panel of the type meant to be supplanted by an EMCSA panel, the wiring is normally located on the back side, separated from the cells, thereby giving rise to current loops having significant areas and, consequently, significant magnetic moments. Current-loop geometries are chosen in an effort to balance opposing magnetic moments to limit far-0field magnetic interactions, but the relatively large distances separating current loops makes full cancellation of magnetic fields problematic. The panel is assembled from bare photovoltaic cells by means of multiple sensitive process steps that contribute significantly to cost, especially if electomagnetic cleanliness is desired. The steps include applying a cover glass and electrical-interconnect-cell (CIC) sub-assemble, connecting the CIC subassemblies into strings of series-connected cells, laying down and adhesively bonding the strings onto a panel structure that has been made in a separate multi-step process, and mounting the

  17. Nanocomposite Sensors for Food Packaging

    NASA Astrophysics Data System (ADS)

    Avella, Maurizio; Errico, Maria Emanuela; Gentile, Gennaro; Volpe, Maria Grazia

    Nowadays nanotechnologies applied to the food packaging sector find always more applications due to a wide range of benefits that they can offer, such as improved barrier properties, improved mechanical performance, antimicrobial properties and so on. Recently many researches are addressed to the set up of new food packaging materials, in which polymer nanocomposites incorporate nanosensors, developing the so-called "smart" packaging. Some examples of nanocomposite sensors specifically realised for the food packaging industry are reported. The second part of this work deals with the preparation and characterisation of two new polymer-based nanocomposite systems that can be used as food packaging materials. Particularly the results concerning the following systems are illustrated: isotactic polypropylene (iPP) filled with CaCO3 nanoparticles and polycaprolactone (PCL) filled with SiO2 nanoparticles.

  18. 46 CFR 153.1106 - Cleaning agents.

    Code of Federal Regulations, 2012 CFR

    2012-10-01

    ... 46 Shipping 5 2012-10-01 2012-10-01 false Cleaning agents. 153.1106 Section 153.1106 Shipping... Handling of Categories A, B, C, and D Cargo and Nls Residue § 153.1106 Cleaning agents. No tank cleaning agent other than water or steam may be used to clean an NLS residue from a cargo tank except...

  19. 46 CFR 153.1106 - Cleaning agents.

    Code of Federal Regulations, 2014 CFR

    2014-10-01

    ... 46 Shipping 5 2014-10-01 2014-10-01 false Cleaning agents. 153.1106 Section 153.1106 Shipping... Handling of Categories A, B, C, and D Cargo and Nls Residue § 153.1106 Cleaning agents. No tank cleaning agent other than water or steam may be used to clean an NLS residue from a cargo tank except...

  20. 46 CFR 153.1106 - Cleaning agents.

    Code of Federal Regulations, 2010 CFR

    2010-10-01

    ... 46 Shipping 5 2010-10-01 2010-10-01 false Cleaning agents. 153.1106 Section 153.1106 Shipping... Handling of Categories A, B, C, and D Cargo and Nls Residue § 153.1106 Cleaning agents. No tank cleaning agent other than water or steam may be used to clean an NLS residue from a cargo tank except...

  1. 46 CFR 153.1106 - Cleaning agents.

    Code of Federal Regulations, 2011 CFR

    2011-10-01

    ... 46 Shipping 5 2011-10-01 2011-10-01 false Cleaning agents. 153.1106 Section 153.1106 Shipping... Handling of Categories A, B, C, and D Cargo and Nls Residue § 153.1106 Cleaning agents. No tank cleaning agent other than water or steam may be used to clean an NLS residue from a cargo tank except...

  2. 46 CFR 153.1106 - Cleaning agents.

    Code of Federal Regulations, 2013 CFR

    2013-10-01

    ... 46 Shipping 5 2013-10-01 2013-10-01 false Cleaning agents. 153.1106 Section 153.1106 Shipping... Handling of Categories A, B, C, and D Cargo and Nls Residue § 153.1106 Cleaning agents. No tank cleaning agent other than water or steam may be used to clean an NLS residue from a cargo tank except...

  3. Ultrasonic cleaning: Fundamental theory and application

    NASA Technical Reports Server (NTRS)

    Fuchs, F. John

    1995-01-01

    This presentation describes: the theory of ultrasonics, cavitation and implosion; the importance and application of ultrasonics in precision cleaning; explanations of ultrasonic cleaning equipment options and their application; process parameters for ultrasonic cleaning; and proper operation of ultrasonic cleaning equipment to achieve maximum results.

  4. Dye Sensitization of Semiconductor Particles

    SciTech Connect

    Hartland, G. V.

    2003-01-13

    In this project electron transfer at semiconductor liquid interfaces was examined by ultrafast time-resolved and steady-state optical techniques. The experiments primarily yielded information about the electron transfer from titanium dioxide semiconductor particles to absorbed molecules. The results show that the rate of electron transfer depends on the structure of the molecule, and the crystalline phase of the particle. These results can be qualitatively explained by Marcus theory for electron transfer.

  5. Semiconductor crystal high resolution imager

    NASA Technical Reports Server (NTRS)

    Levin, Craig S. (Inventor); Matteson, James (Inventor)

    2011-01-01

    A radiation imaging device (10). The radiation image device (10) comprises a subject radiation station (12) producing photon emissions (14), and at least one semiconductor crystal detector (16) arranged in an edge-on orientation with respect to the emitted photons (14) to directly receive the emitted photons (14) and produce a signal. The semiconductor crystal detector (16) comprises at least one anode and at least one cathode that produces the signal in response to the emitted photons (14).

  6. Laser Assisted Semiconductor Device Processing

    DTIC Science & Technology

    1980-11-30

    In strongly absorbing semiconductors, the dominant absorption mechanism at frequencies higher than the bandgap frequency is interband transitions. The...current). The solution for miconductors. In strongly absorbing semiconductors, the n(x,t ) is a closed-form expression consisting of complemen- dominant 0...representative profles are shown in Fis. $-12. o -- For Nd: YAG in silicon. E, _0.99hv and the profiks are therefore and-gap recombination dominated

  7. Are Breast Surgical Operations Clean or Clean Contaminated?

    PubMed

    Kataria, Kamal; Bagdia, Amit; Srivastava, Anurag

    2015-12-01

    The breast surgeries are classically taught as clean surgical procedures. The infection rates following breast surgery ranges from 3 to 15 %, which is much higher than infection rates after clean surgery (ranging from 1.5 to 3 %). This high infection rate following breast surgery can be explained by opening of the ductal system to outside world through nipple similar to the gastrointestinal and genitourinary system. We conducted a systematic review of infection following breast surgeries. We searched various randomized controlled trials, meta-analysis, and Cochrane Reviews over PubMed and Medline via the Internet. These evidences were found to support the thesis, "Breast surgeries need to be reclassified as clean-contaminated". We recommend the use of prophylactic antibiotics in breast surgery.

  8. Development of cost-effective biocompatible packaging for microelectronic devices.

    PubMed

    Qian, Karen; Malachowski, Karl; Fiorini, Paolo; Velenis, Dimitrios; de Beeck, Maaike Op; Van Hoof, Chris

    2011-01-01

    A cost-effective, miniaturized and biocompatible packaging method for medical devices is proposed, resulting in a small, soft and comfortable implantable package. Towards this end, the barrier materials and fabrication process for the individual die encapsulation are largely explored. We demonstrate that various common clean room materials are good candidates for preventing metal leaching into body. In accelerated tests at higher temperature, several conductive barrier materials are damaged by the test bio-fluid, suggesting insufficient resistance to body fluids in long term. Covering electrodes by noble metals will solve this problem. For metallization, noble metals as Pt are best candidates. CoO calculations showed that selective plating of Pt is more cost-effective than sputtering. To reduce the cost of a sputter process, Pt recycling is very important.

  9. CURE: Clean use of reactor energy

    SciTech Connect

    1990-05-01

    This paper presents the results of a joint Westinghouse Hanford Company (Westinghouse Hanford)-Pacific Northwest Laboratory (PNL) study that considered the feasibility of treating radioactive waste before disposal to reduce the inventory of long-lived radionuclides, making the waste more suitable for geologic disposal. The treatment considered here is one in which waste would be chemically separated so that long-lived radionuclides can be treated using specific processes appropriate for the nuclide. The technical feasibility of enhancing repository performance by this type of treatment is considered in this report. A joint Westinghouse Hanford-PNL study group developed a concept called the Clean Use of Reactor Energy (CURE), and evaluated the potential of current technology to reduce the long-lived radionuclide content in waste from the nuclear power industry. The CURE process consists of three components: chemical separation of elements that have significant quantities of long-lived radioisotopes in the waste, exposure in a neutron flux to transmute the radioisotopes to stable nuclides, and packaging of radionuclides that cannot be transmuted easily for storage or geologic disposal. 76 refs., 32 figs., 24 tabs.

  10. Waste management: the cleaning of America

    SciTech Connect

    Melosi, M.V.

    1981-10-01

    The history of solid waste collection and disposal is traced from the 19th Century, when public health was the major factor, to modern programs. Once regarded as a nuisance, solid wastes are now looked upon as the third pollutant and an ecological hazard because they are so closely interrelated with air and water pollution. Solid wastes were recognized as a national problem that was not responding to current treatment in 1965 with the passage of the Solid Waste Disposal Act. This Act focused on disposal, however, and is weak in the area of collection and its failure to mandate a regulatory authority. Efforts to correct these weaknesses led to the Resource Recovery Act of 1970, which shifted the emphasis from disposal to recycling, conversion to energy, and hazardous waste storage. The Office of Solid Waste was created in 1970, but federal and state interest and involvement in street cleaning and sanitation has been inconsistent. New technologies, such as in-house garbage grinders and compacters have not resolved the basic political and economic problems of collection and treatment or of the wasteful packaging and overconsumption habits of Americans and the associated litter epidemic. 49 references. (DCK)

  11. Survey of cryogenic semiconductor devices

    SciTech Connect

    Talarico, L.J.; McKeever, J.W.

    1996-04-01

    Improved reliability and electronic performance can be achieved in a system operated at cryogenic temperatures because of the reduction in mechanical insult and in disruptive effects of thermal energy on electronic devices. Continuing discoveries of new superconductors with ever increasing values of T{sub c} above that of liquid nitrogen temperature (LNT) have provided incentive for developing semiconductor electronic systems that may also operate in the superconductor`s liquid nitrogen bath. Because of the interest in high-temperature superconductor (HTS) devices, liquid nitrogen is the cryogen of choice and LNT is the temperature on which this review is focused. The purpose of this survey is to locate and assemble published information comparing the room temperature (298 K), performance of commercially available conventional and hybrid semiconductor device with their performance at LNT (77K), to help establish their candidacy as cryogenic electronic devices specifically for use at LNT. The approach to gathering information for this survey included the following activities. Periodicals and proceedings were searched for information on the behavior of semiconductor devices at LNT. Telephone calls were made to representatives of semiconductor industries, to semiconductor subcontractors, to university faculty members prominent for their research in the area of cryogenic semiconductors, and to representatives of the National Aeronautics and Space Administration (NASA) and NASA subcontractors. The sources and contacts are listed with their responses in the introduction, and a list of references appears at the end of the survey.

  12. Solar Energy Conversion and Environmental Remediation Using Inorganic Semiconductor-Liquid Interfaces: The Road Traveled and the Way Forward.

    PubMed

    Rajeshwar, Krishnan

    2011-06-02

    Unlike their solid-state counterparts, semiconductor-liquid junctions are versatile in that the incident solar energy can be stored in the form of chemical fuels. Another attractive application is the use of irradiated oxide semiconductor-coated surfaces for self-cleaning and antifogging. The theme of this history-tinged Guest Commentary centers on the question of what has been accomplished in the above "photoelectrochemical" schemes over the 35 year time frame from 1975 to 2010. Progress in this field was aided by the infusion of new concepts and contributions from the materials chemistry and physics communities. A related aspect of discussion is how the active semiconductor material has evolved both chemically and morphologically in these applications. It is shown that despite impressive research advances, only a handful of the above concepts (e.g., dye-sensitized solar photon conversion and self-cleaning and antifogging surfaces) have made the successful transition from the laboratory to the marketplace.

  13. Impurity gettering in semiconductors

    DOEpatents

    Sopori, Bhushan L.

    1995-01-01

    A process for impurity gettering in a semiconductor substrate or device such as a silicon substrate or device. The process comprises hydrogenating the substrate or device at the back side thereof with sufficient intensity and for a time period sufficient to produce a damaged back side. Thereafter, the substrate or device is illuminated with electromagnetic radiation at an intensity and for a time period sufficient to cause the impurities to diffuse to the back side and alloy with a metal there present to form a contact and capture the impurities. The impurity gettering process also can function to simultaneously passivate defects within the substrate or device, with the defects likewise diffusing to the back side for simultaneous passivation. Simultaneously, substantially all hydrogen-induced damage on the back side of the substrate or device is likewise annihilated. Also taught is an alternate process comprising thermal treatment after hydrogenation of the substrate or device at a temperature of from about 500.degree. C. to about 700.degree. C. for a time period sufficient to cause the impurities to diffuse to the damaged back side thereof for subsequent capture by an alloying metal.

  14. Impurity gettering in semiconductors

    DOEpatents

    Sopori, B.L.

    1995-06-20

    A process for impurity gettering in a semiconductor substrate or device such as a silicon substrate or device is disclosed. The process comprises hydrogenating the substrate or device at the back side thereof with sufficient intensity and for a time period sufficient to produce a damaged back side. Thereafter, the substrate or device is illuminated with electromagnetic radiation at an intensity and for a time period sufficient to cause the impurities to diffuse to the back side and alloy with a metal there present to form a contact and capture the impurities. The impurity gettering process also can function to simultaneously passivate defects within the substrate or device, with the defects likewise diffusing to the back side for simultaneous passivation. Simultaneously, substantially all hydrogen-induced damage on the back side of the substrate or device is likewise annihilated. Also taught is an alternate process comprising thermal treatment after hydrogenation of the substrate or device at a temperature of from about 500 C to about 700 C for a time period sufficient to cause the impurities to diffuse to the damaged back side thereof for subsequent capture by an alloying metal. 1 fig.

  15. MacXAFS: An EXAFS analysis package for the Macintosh

    NASA Astrophysics Data System (ADS)

    Bouldin, C.; Furenlid, L.; Elam, T.

    1995-02-01

    We present an EXAFS analysis package that runs on the Apple Macintosh. (Certain commercial products are identified in the article for the sake of completeness. This does not constitute and endorsement by the National Institute of Standards and Technology, the Naval Research Laboratory, or Broohaven National Lab.) The MacXAFS package is derived from a suite of EXAFS analysis programs originally written at the University of Washington. The MacXAFS package preserves the portable computational kernel of this well-tested group of programs and adds a graphical interface by using HyperCard. Communication between the core analysis programs and the HyperCard interface is done by using ASCII script files that direct the execution of the FORTRAN-based analysis programs. The user is largely insulated from the FORTRAN code, but instead interacts with the more intuitive Hypercard interface. This implementation preserves the portability of the ANSI FORTRAN programs, while taking full advantage of the platform-specific user interface features of the Macintosh. Computationally intensive programs, such as the ab initio XAFS calculation program FEFF can be executed remotely via a TCP/IP connection. Due to the clean separation of the interface and the computational kernel, this package is readily extensible by writing new programs, in FORTRAN or any other language, and adding the corresponding interface element in the HyperCard stack.

  16. Guideline implementation: surgical instrument cleaning.

    PubMed

    Cowperthwaite, Liz; Holm, Rebecca L

    2015-05-01

    Cleaning, decontaminating, and handling instructions for instruments vary widely based on the type of instrument and the manufacturer. Processing instruments in accordance with the manufacturer's instructions can help prevent damage and keep devices in good working order. Most importantly, proper cleaning and disinfection may prevent transmission of pathogenic organisms from a contaminated device to a patient or health care worker. The updated AORN "Guideline for cleaning and care of surgical instruments" provides guidance on cleaning, decontaminating, transporting, inspecting, and storing instruments. This article focuses on key points of the guideline to help perioperative personnel implement appropriate instrument care protocols in their practice settings. The key points address timely cleaning and decontamination of instruments after use; appropriate heating, ventilation, and air conditioning parameters for the decontamination area; processing of ophthalmic instruments and laryngoscopes; and precautions to take with instruments used in cases of suspected prion disease. Perioperative RNs should review the complete guideline for additional information and for guidance when writing and updating policies and procedures.

  17. Optimization of Ultrasonic Fabric Cleaning

    SciTech Connect

    Hand, T.E.

    1998-05-13

    The fundamental purpose of this project was to research and develop a process that would reduce the cost and improve the environmental efficiency of the present dry-cleaning industry. This second phase of research (see report KCP-94-1006 for information gathered during the first phase) was intended to allow the optimal integration of all factors of ultrasonic fabric cleaning. For this phase, Garment Care performed an extensive literature search and gathered data from other researchers worldwide. The Garment Care-AlliedSignal team developed the requirements for a prototype cleaning tank for studies and acquired that tank and the additional equipment required to use it properly. Garment Care and AlliedSignal acquired the transducers and generators from Surftran Martin-Walter in Sterling Heights, Michigan. Amway's Kelly Haley developed the test protocol, supplied hundreds of test swatches, gathered the data on the swatches before and after the tests, assisted with the cleaning tests, and prepared the final analysis of the results. AlliedSignal personnel, in conjunction with Amway and Garment Care staff, performed all the tests. Additional planning is under way for future testing by outside research facilities. The final results indicated repeatable performance and good results for single layered fabric swatches. Swatches that were cleaned as a ''sandwich,'' that is, three or more layers.

  18. EDITORIAL: Oxide semiconductors

    NASA Astrophysics Data System (ADS)

    Kawasaki, M.; Makino, T.

    2005-04-01

    Blue or ultraviolet semiconducting light-emitting diodes have the potential to revolutionize illumination systems in the near-future. Such industrial need has propelled the investigation of several wide-gap semiconducting materials in recent years. Commercial applications include blue lasers for DVD memory and laser printers, while military applications are also expected. Most of the material development has so far been focused on GaN (band gap 3.5 eV at 2 K), and ZnSe (2.9 eV) because these two representative direct transition semiconductors are known to be bright emitting sources. GaN and GaN-based alloys are emerging as the winners in this field because ZnSe is subject to defect formation under high current drive. On the other hand, another II-VI compound, ZnO, has also excited substantial interest in the optoelectronics-oriented research communities because it is the brightest emitter of all, owing to the fact that its excitons have a 60 meV binding energy. This is compared with 26 meV for GaN and 20 meV for ZnSe. The stable excitons could lead to laser action based on their recombination even at temperatures well above room temperature. ZnO has additional major properties that are more advantageous than other wide-gap materials: availability of large area substrates, higher energy radiation stability, environmentally-friendly ingredients, and amenability to wet chemical etching. However, ZnO is not new to the semiconductor field as exemplified by several studies made during the 1960s on structural, vibrational, optical and electrical properties (Mollwo E 1982 Landolt-Boernstein New Series vol 17 (Berlin: Springer) p 35). In terms of devices, the luminescence from light-emitting diode structures was demonstrated in which Cu2O was used as the p-type material (Drapak I T 1968 Semiconductors 2 624). The main obstacle to the development of ZnO has been the lack of reproducible p-type ZnO. The possibility of achieving epitaxial p-type layers with the aid of thermal

  19. 75 FR 49526 - Freescale Semiconductor, Inc., Technical Information Center, Tempe, AZ; Freescale Semiconductor...

    Federal Register 2010, 2011, 2012, 2013, 2014

    2010-08-13

    ... Employment and Training Administration Freescale Semiconductor, Inc., Technical Information Center, Tempe, AZ; Freescale Semiconductor, Inc., Technical Information Center, Woburn, MA; Amended Certification Regarding... Semiconductor, Inc., Technical Information Center, Tempe, Arizona. The notice was published in the...

  20. 49 CFR 178.602 - Preparation of packagings and packages for testing.

    Code of Federal Regulations, 2011 CFR

    2011-10-01

    ... testing at periodic intervals only (i.e., other than initial design qualification testing), at ambient... 49 Transportation 3 2011-10-01 2011-10-01 false Preparation of packagings and packages for testing...) SPECIFICATIONS FOR PACKAGINGS Testing of Non-bulk Packagings and Packages § 178.602 Preparation of packagings...

  1. 49 CFR 178.602 - Preparation of packagings and packages for testing.

    Code of Federal Regulations, 2012 CFR

    2012-10-01

    ... testing at periodic intervals only (i.e., other than initial design qualification testing), at ambient... 49 Transportation 3 2012-10-01 2012-10-01 false Preparation of packagings and packages for testing...) SPECIFICATIONS FOR PACKAGINGS Testing of Non-bulk Packagings and Packages § 178.602 Preparation of packagings...

  2. 49 CFR 178.602 - Preparation of packagings and packages for testing.

    Code of Federal Regulations, 2014 CFR

    2014-10-01

    ... testing at periodic intervals only (i.e., other than initial design qualification testing), at ambient... 49 Transportation 3 2014-10-01 2014-10-01 false Preparation of packagings and packages for testing...) SPECIFICATIONS FOR PACKAGINGS Testing of Non-bulk Packagings and Packages § 178.602 Preparation of packagings...

  3. 40 CFR 157.27 - Unit packaging.

    Code of Federal Regulations, 2011 CFR

    2011-07-01

    ... Protection of Environment ENVIRONMENTAL PROTECTION AGENCY (CONTINUED) PESTICIDE PROGRAMS PACKAGING REQUIREMENTS FOR PESTICIDES AND DEVICES Child-Resistant Packaging § 157.27 Unit packaging. Pesticide products... for risk reduction....

  4. 40 CFR 157.27 - Unit packaging.

    Code of Federal Regulations, 2012 CFR

    2012-07-01

    ... Protection of Environment ENVIRONMENTAL PROTECTION AGENCY (CONTINUED) PESTICIDE PROGRAMS PACKAGING REQUIREMENTS FOR PESTICIDES AND DEVICES Child-Resistant Packaging § 157.27 Unit packaging. Pesticide products... for risk reduction....

  5. 40 CFR 157.27 - Unit packaging.

    Code of Federal Regulations, 2014 CFR

    2014-07-01

    ... Protection of Environment ENVIRONMENTAL PROTECTION AGENCY (CONTINUED) PESTICIDE PROGRAMS PACKAGING REQUIREMENTS FOR PESTICIDES AND DEVICES Child-Resistant Packaging § 157.27 Unit packaging. Pesticide products... for risk reduction....

  6. 40 CFR 157.27 - Unit packaging.

    Code of Federal Regulations, 2013 CFR

    2013-07-01

    ... Protection of Environment ENVIRONMENTAL PROTECTION AGENCY (CONTINUED) PESTICIDE PROGRAMS PACKAGING REQUIREMENTS FOR PESTICIDES AND DEVICES Child-Resistant Packaging § 157.27 Unit packaging. Pesticide products... for risk reduction....

  7. In-Package Chemistry Abstraction

    SciTech Connect

    E. Thomas

    2004-11-09

    This report was developed in accordance with the requirements in ''Technical Work Plan for: Regulatory Integration Modeling and Analysis of the Waste Form and Waste Package'' (BSC 2004 [DIRS 171583]). The purpose of the in-package chemistry model is to predict the bulk chemistry inside of a breached waste package and to provide simplified expressions of that chemistry as function of time after breach to Total Systems Performance Assessment for the License Application (TSPA-LA). The scope of this report is to describe the development and validation of the in-package chemistry model. The in-package model is a combination of two models, a batch reactor model that uses the EQ3/6 geochemistry-modeling tool, and a surface complexation model that is applied to the results of the batch reactor model. The batch reactor model considers chemical interactions of water with the waste package materials and the waste form for commercial spent nuclear fuel (CSNF) waste packages and codisposed waste packages that contain both high-level waste glass (HLWG) and DOE spent fuel. The surface complexation model includes the impact of fluid-surface interactions (i.e., surface complexation) on the resulting fluid composition. The model examines two types of water influx: (1) the condensation of water vapor that diffuses into the waste package, and (2) seepage water that enters the waste package from the drift as a liquid. (1) Vapor Influx Case: The condensation of vapor onto the waste package internals is simulated as pure H2O and enters at a rate determined by the water vapor pressure for representative temperature and relative humidity conditions. (2) Water Influx Case: The water entering a waste package from the drift is simulated as typical groundwater and enters at a rate determined by the amount of seepage available to flow through openings in a breached waste package. TSPA-LA uses the vapor influx case for the nominal scenario for simulations where the waste package has been

  8. Plasma-produced nanocrystals enable new insights in semiconductor physics

    NASA Astrophysics Data System (ADS)

    Greenberg, Benjamin; Robinson, Zachary; Gorynski, Claudia; Voigt, Bryan; Francis, Lorraine; Aydil, Eray; Kortshagen, Uwe

    2016-09-01

    The transition from semiconducting (insulating) to metallic behavior is a central problem of semiconductor physics. In bulk semiconductors, this insulator-to-metal transition is described by the well-known Mott criterion. However, in films of semiconductor nanocrystals the Mott criterion fails completely. Recent progress in the nonthermal plasma synthesis of films of highly doped silicon nanocrystals has contributed to the development of a new theory that presents a consistent analog to the Mott criterion for nanocrystal materials. Here, we study films of nonthermal plasma produced zinc oxide (ZnO) nanocrystals to in detail investigate the insulator-to-metal transition. We produce high-purity monodisperse ZnO nanocrystals in a nonthermal plasma and form dense films via supersonic impact deposition. We then modulate the free carrier density, n, and nanocrystal contact facet radius, ρ, via xenon-flashlamp intense pulsed light annealing, which induces necking between the clean surfaces of adjacent nanocrystals. Preliminary electrical measurements indicate that the electron mobility can be finely tuned and that the films cross the insulator-to-metal transition for sufficiently high n and ρ. This work was supported by the MRSEC program of the U.S. National Science Foundation under grant DMR-1420013.

  9. Emission characteristics of volatile organic compounds from semiconductor manufacturing.

    PubMed

    Chein, HungMin; Chen, Tzu Ming

    2003-08-01

    A huge amount of volatile organic compounds (VOCs) is produced and emitted with waste gases from semiconductor manufacturing processes, such as cleaning, etching, and developing. VOC emissions from semiconductor factories located at Science-Based Industrial Park, Hsin-chu, Taiwan, were measured and characterized in this study. A total of nine typical semiconductor fabricators (fabs) were monitored over a 12-month period (October 2000-September 2001). A flame ionization analyzer was employed to measure the VOC emission rate continuously in a real-time fashion. The amount of chemical use was adopted from the data that were reported to the Environmental Protection Bureau in Hsin-chu County as per the regulation of the Taiwan Environmental Protection Administration. The VOC emission factor, defined as the emission rate (kg/month) divided by the amount of chemical use (L/month), was determined to be 0.038 +/- 0.016 kg/L. A linear regression equation is proposed to fit the data with the correlation coefficient (R2)=0.863. The emission profiles of VOCs, which were drawn using the gas chromatograph/mass spectrometer analysis method, show that isopropyl alcohol is the dominant compound in most of the fabs.

  10. Laser Welding in Electronic Packaging

    NASA Technical Reports Server (NTRS)

    2000-01-01

    The laser has proven its worth in numerous high reliability electronic packaging applications ranging from medical to missile electronics. In particular, the pulsed YAG laser is an extremely flexible and versatile too] capable of hermetically sealing microelectronics packages containing sensitive components without damaging them. This paper presents an overview of details that must be considered for successful use of laser welding when addressing electronic package sealing. These include; metallurgical considerations such as alloy and plating selection, weld joint configuration, design of optics, use of protective gases and control of thermal distortions. The primary limitations on use of laser welding electronic for packaging applications are economic ones. The laser itself is a relatively costly device when compared to competing welding equipment. Further, the cost of consumables and repairs can be significant. These facts have relegated laser welding to use only where it presents a distinct quality or reliability advantages over other techniques of electronic package sealing. Because of the unique noncontact and low heat inputs characteristics of laser welding, it is an ideal candidate for sealing electronic packages containing MEMS devices (microelectromechanical systems). This paper addresses how the unique advantages of the pulsed YAG laser can be used to simplify MEMS packaging and deliver a product of improved quality.

  11. Naval Waste Package Design Sensitivity

    SciTech Connect

    T. Schmitt

    2006-12-13

    The purpose of this calculation is to determine the sensitivity of the structural response of the Naval waste packages to varying inner cavity dimensions when subjected to a comer drop and tip-over from elevated surface. This calculation will also determine the sensitivity of the structural response of the Naval waste packages to the upper bound of the naval canister masses. The scope of this document is limited to reporting the calculation results in terms of through-wall stress intensities in the outer corrosion barrier. This calculation is intended for use in support of the preliminary design activities for the license application design of the Naval waste package. It examines the effects of small changes between the naval canister and the inner vessel, and in these dimensions, the Naval Long waste package and Naval Short waste package are similar. Therefore, only the Naval Long waste package is used in this calculation and is based on the proposed potential designs presented by the drawings and sketches in References 2.1.10 to 2.1.17 and 2.1.20. All conclusions are valid for both the Naval Long and Naval Short waste packages.

  12. Optimal segmentation and packaging process

    DOEpatents

    Kostelnik, K.M.; Meservey, R.H.; Landon, M.D.

    1999-08-10

    A process for improving packaging efficiency uses three dimensional, computer simulated models with various optimization algorithms to determine the optimal segmentation process and packaging configurations based on constraints including container limitations. The present invention is applied to a process for decontaminating, decommissioning (D and D), and remediating a nuclear facility involving the segmentation and packaging of contaminated items in waste containers in order to minimize the number of cuts, maximize packaging density, and reduce worker radiation exposure. A three-dimensional, computer simulated, facility model of the contaminated items are created. The contaminated items are differentiated. The optimal location, orientation and sequence of the segmentation and packaging of the contaminated items is determined using the simulated model, the algorithms, and various constraints including container limitations. The cut locations and orientations are transposed to the simulated model. The contaminated items are actually segmented and packaged. The segmentation and packaging may be simulated beforehand. In addition, the contaminated items may be cataloged and recorded. 3 figs.

  13. Hybrid silicon wafer-scale packaging technology

    SciTech Connect

    Johnson, R.W.

    1987-01-01

    Wafer-scale integration (WSI) approaches the packaging problem by attempting to fabricate the system monolithically utilizing semiconductor techniques. However, WSI has been plagued by yield problems and the need for redundancy. This study demonstrates the feasibility of a novel hybrid technique that uses pretested integrated circuits mounted into holes etched in a master wafer. The chips are interconnected with planar, thin-film metallization. This approach achieves near WSI density, while allowing the use of separately fabricated and tested devices. Test wafers with three monolithic chips and one chip mounted in a hole were fabricated as proof of concept. The key processes developed include fabrication of metallized and patterned wafers with etched holes, mounting of die in etched holes with planar topside topology, and deposition and patterning of interlevel dielectric and metal links. Selection of suitable materials for die attach and for use as an interlevel dielectric was critical. Wafers were thermally cycled to evaluate the compatibility of the materials and the process. No cracks or chip movement were observed after 50 cycles from -25 to +85/sup 0/C.

  14. Coal cleaning: Progress and potential

    SciTech Connect

    Livengood, C.D.; Doctor, R.D.

    1985-01-01

    Results from a detailed analysis of sulfur dioxide (SO/sub 2/) reductions achievable through ''deep'' physical coal cleaning (PCC) at 20 coal-fired power plants in the Ohio-Indiana-Illinois region are presented in this paper. These plants all have capacities larger than 500 MWe are currently without any flue-gas-desulfurization (FGD) systems, and burn coal of greater than 1% sulfur content (in 1980). Their aggregate emissions of 2.4 million tons of SO/sub 2/ per year represents 55% of the SO/sub 2/ inventory for these states. The principal coal supplies for each power plant were identified and characterized as to coal seam and county of origin, so that published coal-washability data could be matched to each supplier. The SO/sub 2/ reductions that would result from deep cleaning and moderate cleaning of each coal were calculated using a PCC computer model.

  15. Laser cleaning of tungsten ribbon

    NASA Astrophysics Data System (ADS)

    Kumar, Aniruddha; Sonar, V. R.; Das, D. K.; Bhatt, R. B.; Behere, P. G.; Afzal, Mohd.; Kumar, Arun; Nilaya, J. P.; Biswas, D. J.

    2014-07-01

    Removal of a thin oxide layer from a tungsten ribbon was achieved using the fundamental, second and third harmonic radiation from a Q- switched Nd-YAG laser. It was found that beyond the threshold, oxide removal was achieved at all wavelengths for a wide range of fluence values. The removal mechanism of the oxide layer was found to be critically dependent on both wavelength and fluence of the incident radiation and has been identified as ejection or sublimation. The un-cleaned and cleaned surfaces were analyzed by scanning electron microscopy (SEM), energy dispersive X-ray analysis (EDS) and atomic force microscopy (AFM). Laser cleaned tungsten ribbons were used in a thermal ionization mass spectrometer (TIMS) to determine isotopic composition of Neodymium atoms.

  16. Clean-room robot implementation

    SciTech Connect

    Comeau, J.L.

    1982-07-14

    A robot has been incorporated in a clean room operation in which vacuum tube parts are cleaned just prior to final assembly with a 60 lb/in/sup 2/ blast of argon gas. The robot is programmed to pick up the parts, manipulate/rotate them as necessary in the jet pattern and deposit them in a tray precleaned by the robot. A carefully studied implementation plan was followed in the procurement, installation, modification and programming of the robot facility. An unusual configuration of one tube part required a unique gripper design. A study indicated that the tube parts processed by the robot are 12% cleaner than those manually cleaned by an experienced operator.

  17. Clean Coal Diesel Demonstration Project

    SciTech Connect

    Robert Wilson

    2006-10-31

    A Clean Coal Diesel project was undertaken to demonstrate a new Clean Coal Technology that offers technical, economic and environmental advantages over conventional power generating methods. This innovative technology (developed to the prototype stage in an earlier DOE project completed in 1992) enables utilization of pre-processed clean coal fuel in large-bore, medium-speed, diesel engines. The diesel engines are conventional modern engines in many respects, except they are specially fitted with hardened parts to be compatible with the traces of abrasive ash in the coal-slurry fuel. Industrial and Municipal power generating applications in the 10 to 100 megawatt size range are the target applications. There are hundreds of such reciprocating engine power-plants operating throughout the world today on natural gas and/or heavy fuel oil.

  18. Vacuum Packaging for Microelectromechanical Systems (MEMS)

    DTIC Science & Technology

    2002-10-01

    The Vacuum Packaging for MEMS Program focused on the development of an integrated set of packaging technologies which in totality provide a low cost...high volume product-neutral vacuum packaging capability which addresses all MEMS vacuum packaging requirements. The program balanced the need for...near term component and wafer-level vacuum packaging with the development of advanced high density wafer-level packaging solutions. Three vacuum

  19. Laser-assisted ultrathin bare die packaging: a route to a new class of microelectronic devices

    NASA Astrophysics Data System (ADS)

    Marinov, Val R.; Swenson, Orven; Atanasov, Yuriy; Schneck, Nathan

    2013-03-01

    Ultrathin flip-chip semiconductor die packaging on paper substrates is an enabling technology for a variety of extremely low-cost electronic devices with huge market potential such as RFID smart forms, smart labels, smart tickets, banknotes, security documents, etc. Highly flexible and imperceptible dice are possible only at a thickness of less than 50 μm, preferably down to 10-20 μm or less. Several cents per die cost is achievable only if the die size is <= 500 μm/side. Such ultrathin, ultra-small dice provide the flexibility and low cost required, but no conventional technology today can package such die onto a flexible substrate at low cost and high rate. The laser-enabled advanced packaging (LEAP) technology has been developed at the Center for Nanoscale Science and Engineering, North Dakota State University in Fargo, North Dakota, to accomplish this objective. Presented are results using LEAP to assemble dice with various thicknesses, including 350 μm/side dice as thin as 20 μm and less. To the best of our knowledge, this is the first report of using a laser to package conventional silicon dice with such small size and thickness. LEAP-packaged RFID-enabled paper for financial and security applications is also demonstrated. The cost of packaging using LEAP is lower compared to the conventional pick-and-place methods while the rate of packaging is much higher and independent of the die size.

  20. High-Temperature Electronics: A Role for Wide Bandgap Semiconductors?

    NASA Technical Reports Server (NTRS)

    Neudeck, Philip G.; Okojie, Robert S.; Chen, Liang-Yu

    2002-01-01

    It is increasingly recognized that semiconductor based electronics that can function at ambient temperatures higher than 150 C without external cooling could greatly benefit a variety of important applications, especially-in the automotive, aerospace, and energy production industries. The fact that wide bandgap semiconductors are capable of electronic functionality at much higher temperatures than silicon has partially fueled their development, particularly in the case of SiC. It appears unlikely that wide bandgap semiconductor devices will find much use in low-power transistor applications until the ambient temperature exceeds approximately 300 C, as commercially available silicon and silicon-on-insulator technologies are already satisfying requirements for digital and analog very large scale integrated circuits in this temperature range. However, practical operation of silicon power devices at ambient temperatures above 200 C appears problematic, as self-heating at higher power levels results in high internal junction temperatures and leakages. Thus, most electronic subsystems that simultaneously require high-temperature and high-power operation will necessarily be realized using wide bandgap devices, once the technology for realizing these devices become sufficiently developed that they become widely available. Technological challenges impeding the realization of beneficial wide bandgap high ambient temperature electronics, including material growth, contacts, and packaging, are briefly discussed.

  1. Green Solvents for Precision Cleaning

    NASA Technical Reports Server (NTRS)

    Grandelli, Heather; Maloney, Phillip; DeVor, Robert; Surma, Jan; Hintze, Paul

    2013-01-01

    Aerospace machinery used in liquid oxygen (LOX) fuel systems must be precision cleaned to achieve a very low level of non-volatile residue (< 1 mg0.1 m2), especially flammable residue. Traditionally chlorofluorocarbons (CFCs) have been used in the precision cleaning of LOX systems, specifically CFC 113 (C2Cl3F3). CFCs have been known to cause the depletion of ozone and in 1987, were banned by the Montreal Protocol due to health, safety and environmental concerns. This has now led to the development of new processes in the precision cleaning of aerospace components. An ideal solvent-replacement is non-flammable, environmentally benign, non-corrosive, inexpensive, effective and evaporates completely, leaving no residue. Highlighted is a green precision cleaning process, which is contaminant removal using supercritical carbon dioxide as the environmentally benign solvent. In this process, the contaminant is dissolved in carbon dioxide, and the parts are recovered at the end of the cleaning process completely dry and ready for use. Typical contaminants of aerospace components include hydrocarbon greases, hydraulic fluids, silicone fluids and greases, fluorocarbon fluids and greases and fingerprint oil. Metallic aerospace components range from small nuts and bolts to much larger parts, such as butterfly valves 18 in diameter. A fluorinated grease, Krytox, is investigated as a model contaminant in these preliminary studies, and aluminum coupons are employed as a model aerospace component. Preliminary studies are presented in which the experimental parameters are optimized for removal of Krytox from aluminum coupons in a stirred-batch process. The experimental conditions investigated are temperature, pressure, exposure time and impeller speed. Temperatures of 308 - 423 K, pressures in the range of 8.3 - 41.4 MPa, exposure times between 5 - 60 min and impeller speeds of 0 - 1000 rpm were investigated. Preliminary results showed up to 86 cleaning efficiency with the

  2. Carbon dioxide cleaning pilot project

    SciTech Connect

    Knight, L.; Blackman, T.E.

    1994-01-21

    In 1989, radioactive-contaminated metal at the Rocky Flats Plant (RFP) was cleaned using a solvent paint stripper (Methylene chloride). One-third of the radioactive material was able to be recycled; two-thirds went to the scrap pile as low-level mixed waste. In addition, waste solvent solutions also required disposal. Not only was this an inefficient process, it was later prohibited by the Resource Conservation and Recovery Act (RCRA), 40 CFR 268. A better way of doing business was needed. In the search for a solution to this situation, it was decided to study the advantages of using a new technology - pelletized carbon dioxide cleaning. A proof of principle demonstration occurred in December 1990 to test whether such a system could clean radioactive-contaminated metal. The proof of principle demonstration was expanded in June 1992 with a pilot project. The purpose of the pilot project was three fold: (1) to clean metal so that it can satisfy free release criteria for residual radioactive contamination at the Rocky Flats Plant (RFP); (2) to compare two different carbon dioxide cleaning systems; and (3) to determine the cost-effectiveness of decontamination process in a production situation and compare the cost of shipping the metal off site for waste disposal. The pilot project was completed in August 1993. The results of the pilot project were: (1) 90% of those items which were decontaminated, successfully met the free release criteria , (2) the Alpheus Model 250 was selected to be used on plantsite and (3) the break even cost of decontaminating the metal vs shipping the contaminated material offsite for disposal was a cleaning rate of 90 pounds per hour, which was easily achieved.

  3. Safety evaluation for packaging (onsite) concrete-lined waste packaging

    SciTech Connect

    Romano, T.

    1997-09-25

    The Pacific Northwest National Laboratory developed a package to ship Type A, non-transuranic, fissile excepted quantities of liquid or solid radioactive material and radioactive mixed waste to the Central Waste Complex for storage on the Hanford Site.

  4. Testing methodologies and systems for semiconductor optical amplifiers

    NASA Astrophysics Data System (ADS)

    Wieckowski, Michael

    Semiconductor optical amplifiers (SOA's) are gaining increased prominence in both optical communication systems and high-speed optical processing systems, due primarily to their unique nonlinear characteristics. This in turn, has raised questions regarding their lifetime performance reliability and has generated a demand for effective testing techniques. This is especially critical for industries utilizing SOA's as components for system-in-package products. It is important to note that very little research to date has been conducted in this area, even though production volume and market demand has continued to increase. In this thesis, the reliability of dilute-mode InP semiconductor optical amplifiers is studied experimentally and theoretically. The aging characteristics of the production level devices are demonstrated and the necessary techniques to accurately characterize them are presented. In addition, this work proposes a new methodology for characterizing the optical performance of these devices using measurements in the electrical domain. It is shown that optical performance degradation, specifically with respect to gain, can be directly qualified through measurements of electrical subthreshold differential resistance. This metric exhibits a linear proportionality to the defect concentration in the active region, and as such, can be used for prescreening devices before employing traditional optical testing methods. A complete theoretical analysis is developed in this work to explain this relationship based upon the device's current-voltage curve and its associated leakage and recombination currents. These results are then extended to realize new techniques for testing semiconductor optical amplifiers and other similarly structured devices. These techniques can be employed after fabrication and during packaged operation through the use of a proposed stand-alone testing system, or using a proposed integrated CMOS self-testing circuit. Both methods are capable

  5. Packaging of solid state devices

    DOEpatents

    Glidden, Steven C.; Sanders, Howard D.

    2006-01-03

    A package for one or more solid state devices in a single module that allows for operation at high voltage, high current, or both high voltage and high current. Low thermal resistance between the solid state devices and an exterior of the package and matched coefficient of thermal expansion between the solid state devices and the materials used in packaging enables high power operation. The solid state devices are soldered between two layers of ceramic with metal traces that interconnect the devices and external contacts. This approach provides a simple method for assembling and encapsulating high power solid state devices.

  6. Method for cleaning fine coal

    SciTech Connect

    Smit, F.J.

    1985-07-16

    A method for cleaning fine coal is provided which includes: mixing the coal with a fluid of such a specific gravity that clean coal particles would float while refuse particles would sink therein, pretreating the coalfluid slurry by adding a surfactant, subjecting the mixture to ultrasonic dispersion, and separating the entire mixture into higher and lower specific gravity fluid streams by means of centrifugal separation. The fluid of the chosen specific gravity and the surfactant may be recovered from the fluid streams and recycled if desired.

  7. A Clean Adirondack (3-D)

    NASA Technical Reports Server (NTRS)

    2004-01-01

    This is a 3-D anaglyph showing a microscopic image taken of an area measuring 3 centimeters (1.2 inches) across on the rock called Adirondack. The image was taken at Gusev Crater on the 33rd day of the Mars Exploration Rover Spirit's journey (Feb. 5, 2004), after the rover used its rock abrasion tool brush to clean the surface of the rock. Dust, which was pushed off to the side during cleaning, can still be seen to the left and in low areas of the rock.

  8. Chemical cleaning re-invented: clean, lean and green.

    PubMed

    Hanson, Margaret; Vangeel, Michel

    2014-01-01

    A project undertaken in the Central Cleaning Department of Janssen, a Johnson and Johnson pharmaceutical company, demonstrates how ergonomics, environmental and industrial hygiene risks and quality concerns can be tackled simultaneously. The way equipment was cleaned was re-designed by an in-house cross-functional team to ensure a 'clean, lean and green' process. Initiatives included a new layout of the area, and new work processes and equipment to facilitate cleaning and handling items. This resulted in significant improvements: all ergonomics high risk tasks were reduced to moderate or low risk; hearing protection was no longer required; respirator requirement reduced by 67%; solvent use reduced by 73%; productivity improved, with 55% fewer operator hours required; and quality improved 40-fold. The return on investment was estimated at 3.125 years based on an investment of over €1.5 million (2008 prices). This win-win intervention allowed ergonomics, environmental, industrial hygiene, productivity and quality concerns all to be addressed.

  9. Laser paper cleaning: the method of cleaning historical books

    NASA Astrophysics Data System (ADS)

    Zekou, Evangelini; Tsilikas, Ioannis; Chatzitheodoridis, Elias; Serafetinides, Alexander A.

    2016-01-01

    Conservation of cultural heritage treasures is the most important issue for transferring knowledge to the public through the next generation of students, academics, and researchers. Although this century is authenticating e-books and information by means of electronic text, still historical manuscripts as content as well as objects are the main original recourses of keeping a record of this transformation. The current work focuses on cleaning paper samples by the application of pulsed light, which is interventional. Experiments carried out using paper samples that are artificially colonized with Ulocladium chartarum. Paper is treated by Nd:YAG laser light. The available wavelength is 1064 nm, at various fluences, repetition rates and number of pulses. Two types of paper are stained with fungi colonies, which grow on substrates of clean paper, as well as on paper with ink text. The first type of paper is Whatman No.1056, which is closer to pure cellulose. The second type of paper is a page of a cultural heritage book published in 1926. Cleaning is performed using laser irradiation, thus defining the damage threshold of each sample. The treatment on paper Watman showed a yellowing, especially on areas with high concentration of fungi. The second sample was more durable to the exposure, performing the best results at higher fluences. Eventually, the paper samples are characterized, with optical microscopy and SEM/EDX analyses, prior to and after cleaning.

  10. Wide-Bandgap Semiconductors

    SciTech Connect

    Chinthavali, M.S.

    2005-11-22

    With the increase in demand for more efficient, higher-power, and higher-temperature operation of power converters, design engineers face the challenge of increasing the efficiency and power density of converters [1, 2]. Development in power semiconductors is vital for achieving the design goals set by the industry. Silicon (Si) power devices have reached their theoretical limits in terms of higher-temperature and higher-power operation by virtue of the physical properties of the material. To overcome these limitations, research has focused on wide-bandgap materials such as silicon carbide (SiC), gallium nitride (GaN), and diamond because of their superior material advantages such as large bandgap, high thermal conductivity, and high critical breakdown field strength. Diamond is the ultimate material for power devices because of its greater than tenfold improvement in electrical properties compared with silicon; however, it is more suited for higher-voltage (grid level) higher-power applications based on the intrinsic properties of the material [3]. GaN and SiC power devices have similar performance improvements over Si power devices. GaN performs only slightly better than SiC. Both SiC and GaN have processing issues that need to be resolved before they can seriously challenge Si power devices; however, SiC is at a more technically advanced stage than GaN. SiC is considered to be the best transition material for future power devices before high-power diamond device technology matures. Since SiC power devices have lower losses than Si devices, SiC-based power converters are more efficient. With the high-temperature operation capability of SiC, thermal management requirements are reduced; therefore, a smaller heat sink would be sufficient. In addition, since SiC power devices can be switched at higher frequencies, smaller passive components are required in power converters. Smaller heat sinks and passive components result in higher-power-density power converters

  11. Microelectronics packaging research directions for aerospace applications

    NASA Technical Reports Server (NTRS)

    Galbraith, L.

    2003-01-01

    The Roadmap begins with an assessment of needs from the microelectronics for aerospace applications viewpoint. Needs Assessment is divided into materials, packaging components, and radiation characterization of packaging.

  12. Technical Challenges in Reliable Microelectronics Packaging of Microelectromechanical Systems (MEMS) for Space Applications

    NASA Technical Reports Server (NTRS)

    Ramesham, Rajeshuni

    2000-01-01

    MEMS have shown a significant promise in the last decade for a variety of applications such as air-bag, pressure sensors, accelerometer, microgyro, chemical sensors, artificial nose, etc. Standard semiconductor microelectronics packaging needs the integrated circuits (IC) to be protected from the harsh environment, and provide electrical communication with the other parts of the circuit, facilitate thermal dissipation efficiently, and impart mechanical strength to the silicon die. Microelectronics packaging involves wafer dicing, bonding, lead attachment, encapsulation to protect from the environment, electrical integrity, and package leak tests to assure the reliable IC packaging technology. Active elements or microstructures in MEMS devices often interfaces with the hostile environment where packaging leak tests and testing of such devices using chemical and mechanical parameters will be very difficult and expensive. Packaging of MEMS is significantly complex as they serve to protect from the environment and microstructures interact with the same environment to measure or affect the desired physical or chemical parameters. The most of the silicon circuitry is sensitive to temperature, moisture, magnetic field, light, and electromagnetic interference. The package must then protect the on-board silicon circuitry while simultaneously exposing the microsensor to the effect it measures to assure the packaging technology of MEMS. MEMS technology has a major application in developing a microspacecraft for space systems provided reliability of MEMS packaging technology is sufficiently addressed. This MEMS technology would eventually miniaturize many of the components of the spacecraft to reach the NASA's goal by building faster, cheaper, better, smaller spacecraft to explore the space more effectively. This paper discusses the latest developments in the MEMS technology and challenging technical issues in the packaging of hermetically sealed and non-hermetically sealed

  13. Dielectric screening in semiconductors

    NASA Astrophysics Data System (ADS)

    Harrison, Walter A.; Klepeis, John E.

    1988-01-01

    Intra-atomic and interatomic Coulomb interactions are incorporated into bond-orbital theory, based upon universal tight-binding parameters, in order to treat the effects of charge redistribution in semiconductor bonds. The dielectric function ɛ(q) is obtained for wave numbers in a [100] direction. The screening of differences in average hybrid energy across a heterojunction is calculated in detail, indicating that the decay length for the potential depends upon the relative values of Madelung and intra-atomic Coulomb terms. The parameters used here predict an imaginary decay length and thus an oscillating potential near the interface. The same theory is applied to point defects by imbedding a cluster in a matrix lattice, taking charges in that lattice to be consistent with continuum theory. Illustrating the theory with a phosphorus impurity in silicon, it is seen that the impurity and its neighboring atoms have charges on the order of only one-tenth of an electronic charge, alternating in sign from neighbor to neighbor as for planar defects. Although there are shifts in the term values on the order of a volt, the difference in these shifts for neighboring atoms is much smaller so that the effect on the bonds is quite small. This behavior is analogous to the response of a dielectric continuum to a point charge: The medium is locally neutral except at the center of the cluster and there are slowly varying potentials e2/ɛr. Because of this slow variation, free-atom term values should ordinarily suffice for the calculation of bond properties and bond lengths at impurities. Corrections are larger for homovalent substitutions such as carbon in silicon.

  14. TECHNICAL AND REGULATORY CONSIDERATIONS IN USING FREIGHT CONTAINERS AS INDUSTRIAL PACKAGES

    SciTech Connect

    Opperman, E; Mark Hawk, M; Ron Natali, R

    2007-10-16

    The United States (US) Department of Energy (DOE), Office of Environmental Management (EM), is actively pursuing activities to reduce the radiological risk and clean up the environmental legacy of the nation's nuclear weapons programs. EM has made significant progress in recent years in the clean-up and closure of sites and is also focusing on longer-term activities necessary for the completion of the clean-up program. The packaging and transportation of contaminated demolition debris and low-level waste (LLW) materials in a safe and cost-effective manner are essential in completing this mission. Toward this end, the US Department of Transportation's (DOT) Final Rule on Hazardous Materials Regulation Final Rule issued January 26, 2004, included a new provision authorizing the use of Freight Containers (e.g., 20 and 40-foot ISO Containers) as Industrial Packages Type 1, 2, or 3 (IP-1, IP-2, and IP-3). This paper will discuss the technical and regulatory considerations in using these newly authorized and large packages for the packaging and transportation of LLW materials.

  15. Alternate cleaning methods for LCCAs. Final report

    SciTech Connect

    Adams, B.E.

    1993-04-01

    The purpose of this project was to evaluate DI water followed by isopropyl alcohol (IPA) cleaning and no cleaning of leadless chip carriers (LCCs). Both environmentally safe methods were to be tested against the current chlorofluorocarbon (CFC) material cleaning baseline. Several experiments were run to compare production and electrical yields of LCCs cleaned by all three methods. The critical process steps most affected by cleaning were wire bonding, sealing, particle induced noise detection (PIND), moisture content, and electrical. Yields for the experimental lots cleaned by CFC, DI water plus IPA, and no cleaning were 56%, 72%, and 75%, respectively. The overall results indicated that vapor degreasing/ultrasonic cleaning in CFCs could be replaced by the aqueous method. No cleaning could also be considered if an effective dry method of particle removal could be developed.

  16. Large area LED package

    NASA Astrophysics Data System (ADS)

    Goullon, L.; Jordan, R.; Braun, T.; Bauer, J.; Becker, F.; Hutter, M.; Schneider-Ramelow, M.; Lang, K.-D.

    2015-03-01

    Solid state lighting using LED-dies is a rapidly growing market. LED-dies with the needed increasing luminous flux per chip area produce a lot of heat. Therefore an appropriate thermal management is required for general lighting with LEDdies. One way to avoid overheating and shorter lifetime is the use of many small LED-dies on a large area heat sink (down to 70 μm edge length), so that heat can spread into a large area while at the same time light also appears on a larger area. The handling with such small LED-dies is very difficult because they are too small to be picked with common equipment. Therefore a new concept called collective transfer bonding using a temporary carrier chip was developed. A further benefit of this new technology is the high precision assembly as well as the plane parallel assembly of the LED-dies which is necessary for wire bonding. It has been shown that hundred functional LED-dies were transferred and soldered at the same time. After the assembly a cost effective established PCB-technology was applied to produce a large-area light source consisting of many small LED-dies and electrically connected on a PCB-substrate. The top contacts of the LED-dies were realized by laminating an adhesive copper sheet followed by LDI structuring as known from PCB-via-technology. This assembly can be completed by adding converting and light forming optical elements. In summary two technologies based on standard SMD and PCB technology have been developed for panel level LED packaging up to 610x 457 mm2 area size.

  17. New Packaging for Amplifier Slabs

    SciTech Connect

    Riley, M.; Thorsness, C.; Suratwala, T.; Steele, R.; Rogowski, G.

    2015-03-18

    The following memo provides a discussion and detailed procedure for a new finished amplifier slab shipping and storage container. The new package is designed to maintain an environment of <5% RH to minimize weathering.

  18. Spack: the Supercomputing Package Manager

    SciTech Connect

    Gamblin, T.

    2013-11-09

    The HPC software ecosystem is growing larger and more complex, but software distribution mechanisms have not kept up with this trend. Tools, Libraries, and applications need to run on multiple platforms and build with multiple compliers. Increasingly, packages leverage common software components, and building any one component requires building all of its dependencies. In HPC environments, ABI-incompatible interfaces (likeMPI), binary-incompatible compilers, and cross-compiled environments converge to make the build process a combinatoric nightmare. This obstacle deters many users from adopting useful tools, and others waste countless hours building and rebuilding tools. Many package managers exist to solve these problems for typical desktop environments, but none suits the unique needs of supercomputing facilities or users. To address these problems, we have Spack, a package manager that eases the task of managing software for end-users, across multiple platforms, package versions, compilers, and ABI incompatibilities.

  19. High Frequency Electronic Packaging Technology

    NASA Technical Reports Server (NTRS)

    Herman, M.; Lowry, L.; Lee, K.; Kolawa, E.; Tulintseff, A.; Shalkhauser, K.; Whitaker, J.; Piket-May, M.

    1994-01-01

    Commercial and government communication, radar, and information systems face the challenge of cost and mass reduction via the application of advanced packaging technology. A majority of both government and industry support has been focused on low frequency digital electronics.

  20. Handling difficult materials: Aseptic packaging

    SciTech Connect

    Lieb, K.

    1994-03-01

    Since aseptic packages, or drink boxes, were introduced in the US in the early 1980s, they have been praised for their convenience and berated for their lack of recyclability. As a result, aseptic packaging collection has been linked with that of milk cartons to increase the volume. The intervening years since the introduction of aseptic packaging have seen the drink box industry aggressively trying to create a recycling market for the boxes. Communities and schools have initiated programs, and recycling firms have allocated resources to see whether recycling aseptic packaging can work. Drink boxes are now recycled in 2.3 million homes in 15 states, and in 1,655 schools in 17 states. They are typically collected in school and curbside programs with other polyethylene coated (laminated) paperboard products such a milk cartons, and then baled and shipped to five major paper companies for recycling at eight facilities.