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Sample records for complementary metal-oxide-semiconductor biosensor

  1. Real-time, multiplexed electrochemical DNA detection using an active complementary metal-oxide-semiconductor biosensor array with integrated sensor electronics.

    PubMed

    Levine, Peter M; Gong, Ping; Levicky, Rastislav; Shepard, Kenneth L

    2009-03-15

    Optical biosensing based on fluorescence detection has arguably become the standard technique for quantifying extents of hybridization between surface-immobilized probes and fluorophore-labeled analyte targets in DNA microarrays. However, electrochemical detection techniques are emerging which could eliminate the need for physically bulky optical instrumentation, enabling the design of portable devices for point-of-care applications. Unlike fluorescence detection, which can function well using a passive substrate (one without integrated electronics), multiplexed electrochemical detection requires an electronically active substrate to analyze each array site and benefits from the addition of integrated electronic instrumentation to further reduce platform size and eliminate the electromagnetic interference that can result from bringing non-amplified signals off chip. We report on an active electrochemical biosensor array, constructed with a standard complementary metal-oxide-semiconductor (CMOS) technology, to perform quantitative DNA hybridization detection on chip using targets conjugated with ferrocene redox labels. A 4 x 4 array of gold working electrodes and integrated potentiostat electronics, consisting of control amplifiers and current-input analog-to-digital converters, on a custom-designed 5 mm x 3 mm CMOS chip drive redox reactions using cyclic voltammetry, sense DNA binding, and transmit digital data off chip for analysis. We demonstrate multiplexed and specific detection of DNA targets as well as real-time monitoring of hybridization, a task that is difficult, if not impossible, with traditional fluorescence-based microarrays.

  2. Real-time, multiplexed electrochemical DNA detection using an active complementary metal-oxide-semiconductor biosensor array with integrated sensor electronics

    PubMed Central

    Levine, Peter M.; Gong, Ping; Levicky, Rastislav; Shepard, Kenneth L.

    2009-01-01

    Optical biosensing based on fluorescence detection has arguably become the standard technique for quantifying extents of hybridization between surface-immobilized probes and fluorophore-labeled analyte targets in DNA microarrays. However, electrochemical detection techniques are emerging which could eliminate the need for physically bulky optical instrumentation, enabling the design of portable devices for point-of-care applications. Unlike fluorescence detection, which can function well using a passive substrate (one without integrated electronics), multiplexed electrochemical detection requires an electronically-active substrate to analyze each array site and benefits from the addition of integrated electronic instrumentation to further reduce platform size and eliminate the electromagnetic interference that can result from bringing non-amplified signals off chip. We report on an active electrochemical biosensor array, constructed with a standard complementary metal-oxide-semiconductor (CMOS) technology, to perform quantitative DNA hybridization detection on chip using targets conjugated with ferrocene redox labels. A 4×4 array of gold working electrodes and integrated potentiostat electronics, consisting of control amplifiers and current-input analog-to-digital converters, on a custom-designed 5×3 mm2 CMOS chip drive redox reactions using cyclic voltammetry, sense DNA binding, and transmit digital data off chip for analysis. We demonstrate multiplexed and specific detection of DNA targets as well as real-time monitoring of hybridization, a task that is difficult, if not impossible, with traditional fluorescence-based microarrays. PMID:19054661

  3. High-temperature Complementary Metal Oxide Semiconductors (CMOS)

    NASA Technical Reports Server (NTRS)

    Mcbrayer, J. D.

    1981-01-01

    The results of an investigation into the possibility of using complementary metal oxide semiconductor (CMOS) technology for high temperature electronics are presented. A CMOS test chip was specifically developed as the test bed. This test chip incorporates CMOS transistors that have no gate protection diodes; these diodes are the major cause of leakage in commercial devices.

  4. The MSFC complementary metal oxide semiconductor (including multilevel interconnect metallization) process handbook

    NASA Technical Reports Server (NTRS)

    Bouldin, D. L.; Eastes, R. W.; Feltner, W. R.; Hollis, B. R.; Routh, D. E.

    1979-01-01

    The fabrication techniques for creation of complementary metal oxide semiconductor integrated circuits at George C. Marshall Space Flight Center are described. Examples of C-MOS integrated circuits manufactured at MSFC are presented with functional descriptions of each. Typical electrical characteristics of both p-channel metal oxide semiconductor and n-channel metal oxide semiconductor discrete devices under given conditions are provided. Procedures design, mask making, packaging, and testing are included.

  5. Single-photon imaging in complementary metal oxide semiconductor processes

    PubMed Central

    Charbon, E.

    2014-01-01

    This paper describes the basics of single-photon counting in complementary metal oxide semiconductors, through single-photon avalanche diodes (SPADs), and the making of miniaturized pixels with photon-counting capability based on SPADs. Some applications, which may take advantage of SPAD image sensors, are outlined, such as fluorescence-based microscopy, three-dimensional time-of-flight imaging and biomedical imaging, to name just a few. The paper focuses on architectures that are best suited to those applications and the trade-offs they generate. In this context, architectures are described that efficiently collect the output of single pixels when designed in large arrays. Off-chip readout circuit requirements are described for a variety of applications in physics, medicine and the life sciences. Owing to the dynamic nature of SPADs, designs featuring a large number of SPADs require careful analysis of the target application for an optimal use of silicon real estate and of limited readout bandwidth. The paper also describes the main trade-offs involved in architecting such chips and the solutions adopted with focus on scalability and miniaturization. PMID:24567470

  6. Extended-Gate Metal Oxide Semiconductor Field Effect Transistor-Based Biosensor for Detection of Deoxynivalenol

    NASA Astrophysics Data System (ADS)

    Kwon, Insu; Lee, Hee-Ho; Choi, Jinhyeon; Shin, Jang-Kyoo; Seo, Sang-Ho; Choi, Sung-Wook; Chun, Hyang Sook

    2011-06-01

    In this work, we present an extended-gate metal oxide semiconductor field effect transistor (MOSFET)-based biosensor for the detection of deoxynivalenol using a null-balancing circuit. An extended-gate MOSFET-based biosensor was fabricated by a standard complementary metal oxide semiconductor (CMOS) process and its characteristics were measured. A null-balancing circuit was used to measure the output voltage of the sensor directly, instead of measuring the drain current of the sensor. Au was used as the gate metal, which has a chemical affinity with thiol, which leads to the immobilization of a self-assembled monolayer (SAM) of mercaptohexadecanoic acid (MHDA). The SAM was used to immobilize the anti-deoxynivalenol antibody. The carboxyl group of the SAM was bound to the anti-deoxynivalenol antibody. The anti-deoxynivalenol antibody and deoxynivalenol were bound by their antigen-antibody reaction. The measurements were performed in phosphate buffered saline (PBS; pH 7.4) solution. A standard Ag/AgCl electrode was employed as a reference electrode. The bindings of a SAM, anti-deoxynivalenol antibody, and deoxynivalenol caused a variation in the output voltage of the extended-gate MOSFET-based biosensor. Surface plasmon resonance (SPR) measurement was performed to verify the interaction among the SAM, deoxynivalenol-antibody, and deoxynivalenol.

  7. Printing Peptide arrays with a complementary metal oxide semiconductor chip.

    PubMed

    Loeffler, Felix F; Cheng, Yun-Chien; Muenster, Bastian; Striffler, Jakob; Liu, Fanny C; Ralf Bischoff, F; Doersam, Edgar; Breitling, Frank; Nesterov-Mueller, Alexander

    2013-01-01

    : In this chapter, we discuss the state-of-the-art peptide array technologies, comparing the spot technique, lithographical methods, and microelectronic chip-based approaches. Based on this analysis, we describe a novel peptide array synthesis method with a microelectronic chip printer. By means of a complementary metal oxide semiconductor chip, charged bioparticles can be patterned on its surface. The bioparticles serve as vehicles to transfer molecule monomers to specific synthesis spots. Our chip offers 16,384 pixel electrodes on its surface with a spot-to-spot pitch of 100 μm. By switching the voltage of each pixel between 0 and 100 V separately, it is possible to generate arbitrary particle patterns for combinatorial molecule synthesis. Afterwards, the patterned chip surface serves as a printing head to transfer the particle pattern from its surface to a synthesis substrate. We conducted a series of proof-of-principle experiments to synthesize high-density peptide arrays. Our solid phase synthesis approach is based on the 9-fluorenylmethoxycarbonyl protection group strategy. After melting the particles, embedded monomers diffuse to the surface and participate in the coupling reaction to the surface. The method demonstrated herein can be easily extended to the synthesis of more complicated artificial molecules by using bioparticles with artificial molecular building blocks. The possibility of synthesizing artificial peptides was also shown in an experiment in which we patterned biotin particles in a high-density array format. These results open the road to the development of peptide-based functional modules for diverse applications in biotechnology.

  8. Printable Ultrathin Metal Oxide Semiconductor-Based Conformal Biosensors.

    PubMed

    Rim, You Seung; Bae, Sang-Hoon; Chen, Huajun; Yang, Jonathan L; Kim, Jaemyung; Andrews, Anne M; Weiss, Paul S; Yang, Yang; Tseng, Hsian-Rong

    2015-12-22

    Conformal bioelectronics enable wearable, noninvasive, and health-monitoring platforms. We demonstrate a simple and straightforward method for producing thin, sensitive In2O3-based conformal biosensors based on field-effect transistors using facile solution-based processing. One-step coating via aqueous In2O3 solution resulted in ultrathin (3.5 nm), high-density, uniform films over large areas. Conformal In2O3-based biosensors on ultrathin polyimide films displayed good device performance, low mechanical stress, and highly conformal contact determined using polydimethylsiloxane artificial skin having complex curvilinear surfaces or an artificial eye. Immobilized In2O3 field-effect transistors with self-assembled monolayers of NH2-terminated silanes functioned as pH sensors. Functionalization with glucose oxidase enabled d-glucose detection at physiologically relevant levels. The conformal ultrathin field-effect transistor biosensors developed here offer new opportunities for future wearable human technologies.

  9. Retinal Stimulation on Rabbit Using Complementary Metal Oxide Semiconductor Based Multichip Flexible Stimulator toward Retinal Prosthesis

    NASA Astrophysics Data System (ADS)

    Tokuda, Takashi; Asano, Ryosuke; Sugitani, Sachie; Taniyama, Mari; Terasawa, Yasuo; Nunoshita, Masahiro; Nakauchi, Kazuaki; Fujikado, Takashi; Tano, Yasuo; Ohta, Jun

    2008-04-01

    The Functionality of a complementary metal oxide semiconductor (CMOS) LSI-based, multichip flexible retinal stimulator was demonstrated in retinal stimulation experiments on rabbits. A 1×4-configured multichip stimulator was fabricated for application to experiments on animals. An experimental procedure including surgical operations was developed, and retinal stimulation was performed with the fabricated multichip stimulator. Neural responses on the visual cortex were successfully evoked by the fabricated stimulator. The stimulator is confirmed to be applicable to acute animal experiments.

  10. DNA detection using a complementary metal-oxide semiconductor ring oscillator circuit

    NASA Astrophysics Data System (ADS)

    Kocanda, Martin; Abdel-Motaleb, Ibrahim

    2010-10-01

    A DNA detection scheme has been implemented that utilizes a simple complementary metal-oxide semiconductor (CMOS) ring oscillator circuit. The detector oscillates at a fundamental frequency when using a nonhybridized single-strand DNA probe layer. Upon hybridization with a complimentary DNA strand, the oscillator output exhibits an increased frequency shift, indicating a genetic match. The probe assembly consists of a p-GaAs substrate containing a pulsed laser deposition-applied barium strontium titanate layer and an overlying sodium dodecyl sulfate lipid layer that serves to anchor a functionalized oligonucleotide probe. The oscillator circuit consisting of cascaded discrete complimentary n-channel and p-channel metal-oxide-semiconductor field-effect transistors was implemented using passive components arranged in a T-network to provide the associated fundamental time constant.

  11. Radiation induced failures of complementary metal oxide semiconductor containing pacemakers: a potentially lethal complication

    SciTech Connect

    Lewin, A.A.; Serago, C.F.; Schwade, J.G.; Abitbol, A.A.; Margolis, S.C.

    1984-10-01

    New multi-programmable pacemakers frequently employ complementary metal oxide semiconductors (CMOS). This circuitry appears more sensitive to the effects of ionizing radiation when compared to the semiconductor circuits used in older pacemakers. A case of radiation induced runaway pacemaker in a CMOS device is described. Because of this and other recent reports of radiation therapy-induced CMOS type pacemaker failure, these pacemakers should not be irradiated. If necessary, the pacemaker can be shielded or moved to a site which can be shielded before institution of radiation therapy. This is done to prevent damage to the CMOS circuit and the life threatening arrythmias which may result from such damage.

  12. Ultrasensitive mass sensor fully integrated with complementary metal-oxide-semiconductor circuitry

    NASA Astrophysics Data System (ADS)

    Forsen, E.; Abadal, G.; Ghatnekar-Nilsson, S.; Teva, J.; Verd, J.; Sandberg, R.; Svendsen, W.; Perez-Murano, F.; Esteve, J.; Figueras, E.; Campabadal, F.; Montelius, L.; Barniol, N.; Boisen, A.

    2005-07-01

    Nanomechanical resonators have been monolithically integrated on preprocessed complementary metal-oxide-semiconductor (CMOS) chips. Fabricated resonator systems have been designed to have resonance frequencies up to 1.5 MHz. The systems have been characterized in ambient air and vacuum conditions and display ultrasensitive mass detection in air. A mass sensitivity of 4ag/Hz has been determined in air by placing a single glycerine drop, having a measured weight of 57 fg, at the apex of a cantilever and subsequently measuring a frequency shift of 14.8 kHz. CMOS integration enables electrostatic excitation, capacitive detection, and amplification of the resonance signal directly on the chip.

  13. Implementation of Surface Acoustic Wave Vapor Sensor Using Complementary Metal-Oxide-Semiconductor Amplifiers

    NASA Astrophysics Data System (ADS)

    Chiu, Chia-Sung; Chang, Ching-Chun; Ku, Chia-Lin; Peng, Kang-Ming; Jeng, Erik S.; Chen, Wen-Lin; Huang, Guo-Wei; Wu, Lin-Kun

    2009-04-01

    A surface acoustic wave (SAW) vapor sensor is presented in this work. A SAW delay line oscillator on quartz substrate with the high gain complementary metal-oxide-semiconductor (CMOS) amplifier using a two-poly-two-metal (2P2M) 0.35 µm process was designed. The gain of the CMOS amplifier and its total power consumption are 20 dB and 70 mW, respectively. The achieved phase noise of this SAW oscillator is -150 dBc/Hz at 100 kHz offset. The sensing is successfully demonstrated by a thin poly(epichlorohydrin) (PECH) polymer film on a SAW oscillator with alcohol vapor. This two-in-one sensor unit includes the SAW device and the CMOS amplifier provides designers with comprehensive model for using these components for sensor circuit fabrication. Furthermore it will be promising for future chemical and biological sensing applications.

  14. Energy Harvesting Thermoelectric Generators Manufactured Using the Complementary Metal Oxide Semiconductor Process

    PubMed Central

    Yang, Ming-Zhi; Wu, Chyan-Chyi; Dai, Ching-Liang; Tsai, Wen-Jung

    2013-01-01

    This paper presents the fabrication and characterization of energy harvesting thermoelectric micro generators using the commercial complementary metal oxide semiconductor (CMOS) process. The micro generator consists of 33 thermocouples in series. Thermocouple materials are p-type and n-type polysilicon since they have a large Seebeck coefficient difference. The output power of the micro generator depends on the temperature difference in the hot and cold parts of the thermocouples. In order to increase this temperature difference, the hot part of the thermocouples is suspended to reduce heat-sinking. The micro generator needs a post-CMOS process to release the suspended structures of hot part, which the post-process includes an anisotropic dry etching to etch the sacrificial oxide layer and an isotropic dry etching to remove the silicon substrate. Experiments show that the output power of the micro generator is 9.4 μW at a temperature difference of 15 K. PMID:23396193

  15. Dimensional optimization of nanowire--complementary metal oxide--semiconductor inverter.

    PubMed

    Hashim, Yasir; Sidek, Othman

    2013-01-01

    This study is the first to demonstrate dimensional optimization of nanowire-complementary metal-oxide-semiconductor inverter. Noise margins and inflection voltage of transfer characteristics are used as limiting factors in this optimization. Results indicate that optimization depends on both dimensions ratio and digital voltage level (Vdd). Diameter optimization reveals that when Vdd increases, the optimized value of (Dp/Dn) decreases. Channel length optimization results show that when Vdd increases, the optimized value of Ln decreases and that of (Lp/Ln) increases. Dimension ratio optimization reveals that when Vdd increases, the optimized value of Kp/Kn decreases, and silicon nanowire transistor with suitable dimensions (higher Dp and Ln with lower Lp and Dn) can be fabricated.

  16. High-Performance WSe2 Complementary Metal Oxide Semiconductor Technology and Integrated Circuits.

    PubMed

    Yu, Lili; Zubair, Ahmad; Santos, Elton J G; Zhang, Xu; Lin, Yuxuan; Zhang, Yuhao; Palacios, Tomás

    2015-08-12

    Because of their extraordinary structural and electrical properties, two-dimensional materials are currently being pursued for applications such as thin-film transistors and integrated circuit. One of the main challenges that still needs to be overcome for these applications is the fabrication of air-stable transistors with industry-compatible complementary metal oxide semiconductor (CMOS) technology. In this work, we experimentally demonstrate a novel high performance air-stable WSe2 CMOS technology with almost ideal voltage transfer characteristic, full logic swing and high noise margin with different supply voltages. More importantly, the inverter shows large voltage gain (∼38) and small static power (picowatts), paving the way for low power electronic system in 2D materials.

  17. Novel Sensor Structure and Its Evaluation for Integrated Complementary Metal Oxide Semiconductor Microelectromechanical Systems Accelerometer

    NASA Astrophysics Data System (ADS)

    Konishi, Toshifumi; Yamane, Daisuke; Matsushima, Takaaki; Motohashi, Ghou; Kagaya, Ken; Ito, Hiroyuki; Ishihara, Noboru; Toshiyoshi, Hiroshi; Machida, Katsuyuki; Masu, Kazuya

    2013-06-01

    This paper reports a novel sensor structure and its evaluation results for an integrated complementary metal oxide semiconductor (CMOS) microelectromechanical systems (MEMS) accelerometer with a wide detection range on a chip. The proposed sensor structure has the following features: i) a layer separation technique between the proof mass and the mechanical suspensions, ii) mechanical stoppers for the proof mass to avoid destruction, and iii) a SiO2 film underneath the proof mass to prevent stiction and electrical short. Gold was used as the MEMS structure material to reduce the proof mass size and to lower the Brownian noise to below 100 µg/√Hz. Furthermore, the micro fabrication was carried out below 310 °C for the CMOS devices to remain intact. The evaluation results indicate that the Brownian noise was 90.6 µg/√Hz. Thus, we have confirmed that the proposed MEMS structure has the potential for use in future integrated CMOS-MEMS accelerometers.

  18. DNA-decorated carbon-nanotube-based chemical sensors on complementary metal oxide semiconductor circuitry.

    PubMed

    Chen, Chia-Ling; Yang, Chih-Feng; Agarwal, Vinay; Kim, Taehoon; Sonkusale, Sameer; Busnaina, Ahmed; Chen, Michelle; Dokmeci, Mehmet R

    2010-03-05

    We present integration of single-stranded DNA (ss-DNA)-decorated single-walled carbon nanotubes (SWNTs) onto complementary metal oxide semiconductor (CMOS) circuitry as nanoscale chemical sensors. SWNTs were assembled onto CMOS circuitry via a low voltage dielectrophoretic (DEP) process. Besides, bare SWNTs are reported to be sensitive to various chemicals, and functionalization of SWNTs with biomolecular complexes further enhances the sensing specificity and sensitivity. After decorating ss-DNA on SWNTs, we have found that the sensing response of the gas sensor was enhanced (up to approximately 300% and approximately 250% for methanol vapor and isopropanol alcohol vapor, respectively) compared with bare SWNTs. The SWNTs coupled with ss-DNA and their integration on CMOS circuitry demonstrates a step towards realizing ultra-sensitive electronic nose applications.

  19. Modeling boron dose loss in sidewall spacer stacks of complementary metal oxide semiconductor transistors

    NASA Astrophysics Data System (ADS)

    Essa, Z.; Pelletier, B.; Morin, P.; Boulenc, P.; Pakfar, A.; Tavernier, C.; Wacquant, F.; Zechner, C.; Juhel, M.; Autran, J. L.; Cristiano, F.

    2016-12-01

    The presence of capping materials during annealing (activation for example) can substantially impact the silicon junction profiles of Complementary Metal Oxide Semiconductor Field Effect Transistors (CMOSFET), depending on the nature of these layers. In this paper we specifically investigated the boron out-diffusion from a silicon junction into the silicon oxide in presence of a silicon oxide/silicon nitride capping bi-layer similar to the stacks used to form sidewall spacers. After 120 s anneal we observed with secondary ion mass spectrometry (SIMS) substantial boron dose loss in silicon and segregation at the silicon oxide interface related to oxide and nitride material properties, in particular to the hydrogen concentration. We then modeled the boron profiles in both silicon and oxide as a function of the hydrogen static and dynamic in the materials. The exponential-like boron diffusion profiles observed in oxide are reproduced by introducing a long hop mechanism mediated with hydrogen-related defects (HRDs).

  20. Laser Doppler blood flow complementary metal oxide semiconductor imaging sensor with analog on-chip processing

    SciTech Connect

    Gu Quan; Hayes-Gill, Barrie R.; Morgan, Stephen P

    2008-04-20

    A 4x4 pixel array with analog on-chip processing has been fabricated within a 0.35 {mu}m complementary metal oxide semiconductor process as a prototype sensor for laser Doppler blood flow imaging. At each pixel the bandpass and frequency weighted filters necessary for processing laser Doppler blood flow signals have been designed and fabricated. Because of the space constraints of implementing an accurate {omega}{sup 0.5} filter at the pixel level, this has been approximated using the ''roll off'' of a high-pass filter with a cutoff frequency set at 10 kHz. The sensor has been characterized using a modulated laser source. Fixed pattern noise is present that is demonstrated to be repeatable across the array and can be calibrated. Preliminary blood flow results on a finger before and after occlusion demonstrate that the sensor array provides the potential for a system that can be scaled to a larger number of pixels for blood flow imaging.

  1. Polycrystalline silicon ring resonator photodiodes in a bulk complementary metal-oxide-semiconductor process.

    PubMed

    Mehta, Karan K; Orcutt, Jason S; Shainline, Jeffrey M; Tehar-Zahav, Ofer; Sternberg, Zvi; Meade, Roy; Popović, Miloš A; Ram, Rajeev J

    2014-02-15

    We present measurements on resonant photodetectors utilizing sub-bandgap absorption in polycrystalline silicon ring resonators, in which light is localized in the intrinsic region of a p+/p/i/n/n+ diode. The devices, operating both at λ=1280 and λ=1550  nm and fabricated in a complementary metal-oxide-semiconductor (CMOS) dynamic random-access memory emulation process, exhibit detection quantum efficiencies around 20% and few-gigahertz response bandwidths. We observe this performance at low reverse biases in the range of a few volts and in devices with dark currents below 50 pA at 10 V. These results demonstrate that such photodetector behavior, previously reported by Preston et al. [Opt. Lett. 36, 52 (2011)], is achievable in bulk CMOS processes, with significant improvements with respect to the previous work in quantum efficiency, dark current, linearity, bandwidth, and operating bias due to additional midlevel doping implants and different material deposition. The present work thus offers a robust realization of a fully CMOS-fabricated all-silicon photodetector functional across a wide wavelength range.

  2. Depletion-mode polysilicon optical modulators in a bulk complementary metal-oxide semiconductor process.

    PubMed

    Shainline, Jeffrey M; Orcutt, Jason S; Wade, Mark T; Nammari, Kareem; Tehar-Zahav, Ofer; Sternberg, Zvi; Meade, Roy; Ram, Rajeev J; Stojanović, Vladimir; Popović, Miloš A

    2013-08-01

    We demonstrate depletion-mode carrier-plasma optical modulators fabricated in a bulk complementary metal-oxide semiconductor (CMOS), DRAM-emulation process. To the best of our knowledge, these are the first depletion-mode modulators demonstrated in polycrystalline silicon and in bulk CMOS. The modulators are based on novel optical microcavities that utilize periodic spatial interference of two guided modes to create field nulls along waveguide sidewalls. At these nulls, electrical contacts can be placed while preserving a high optical Q. These cavities enable active devices in a process with no partial silicon etch and with lateral p-n junctions. We demonstrate two device variants at 5 Gbps data modulation rate near 1610 nm wavelength. One design shows 3.1 dB modulation depth with 1.5 dB insertion loss and an estimated 160 fJ/bit energy consumption, while a more compact device achieves 4.2 dB modulation depth with 4.0 dB insertion loss and 60 fJ/bit energy consumption. These modulators represent a significant breakthrough in enabling active photonics in bulk silicon CMOS--the platform of the majority of microelectronic logic and DRAM processes--and lay the groundwork for monolithically integrated CMOS-to-DRAM photonic links.

  3. Laser Doppler blood flow complementary metal oxide semiconductor imaging sensor with analog on-chip processing.

    PubMed

    Gu, Quan; Hayes-Gill, Barrie R; Morgan, Stephen P

    2008-04-20

    A 4 x 4 pixel array with analog on-chip processing has been fabricated within a 0.35 mum complementary metal oxide semiconductor process as a prototype sensor for laser Doppler blood flow imaging. At each pixel the bandpass and frequency weighted filters necessary for processing laser Doppler blood flow signals have been designed and fabricated. Because of the space constraints of implementing an accurate omega(0.5) filter at the pixel level, this has been approximated using the "roll off" of a high-pass filter with a cutoff frequency set at 10 kHz. The sensor has been characterized using a modulated laser source. Fixed pattern noise is present that is demonstrated to be repeatable across the array and can be calibrated. Preliminary blood flow results on a finger before and after occlusion demonstrate that the sensor array provides the potential for a system that can be scaled to a larger number of pixels for blood flow imaging.

  4. Silicon-on-insulator-based complementary metal oxide semiconductor integrated optoelectronic platform for biomedical applications

    NASA Astrophysics Data System (ADS)

    Mujeeb-U-Rahman, Muhammad; Scherer, Axel

    2016-12-01

    Microscale optical devices enabled by wireless power harvesting and telemetry facilitate manipulation and testing of localized biological environments (e.g., neural recording and stimulation, targeted delivery to cancer cells). Design of integrated microsystems utilizing optical power harvesting and telemetry will enable complex in vivo applications like actuating a single nerve, without the difficult requirement of extreme optical focusing or use of nanoparticles. Silicon-on-insulator (SOI)-based platforms provide a very powerful architecture for such miniaturized platforms as these can be used to fabricate both optoelectronic and microelectronic devices on the same substrate. Near-infrared biomedical optics can be effectively utilized for optical power harvesting to generate optimal results compared with other methods (e.g., RF and acoustic) at submillimeter size scales intended for such designs. We present design and integration techniques of optical power harvesting structures with complementary metal oxide semiconductor platforms using SOI technologies along with monolithically integrated electronics. Such platforms can become the basis of optoelectronic biomedical systems including implants and lab-on-chip systems.

  5. Silicon-on-insulator-based complementary metal oxide semiconductor integrated optoelectronic platform for biomedical applications.

    PubMed

    Mujeeb-U-Rahman, Muhammad; Scherer, Axel

    2016-12-01

    Microscale optical devices enabled by wireless power harvesting and telemetry facilitate manipulation and testing of localized biological environments (e.g., neural recording and stimulation, targeted delivery to cancer cells). Design of integrated microsystems utilizing optical power harvesting and telemetry will enable complex in vivo applications like actuating a single nerve, without the difficult requirement of extreme optical focusing or use of nanoparticles. Silicon-on-insulator (SOI)-based platforms provide a very powerful architecture for such miniaturized platforms as these can be used to fabricate both optoelectronic and microelectronic devices on the same substrate. Near-infrared biomedical optics can be effectively utilized for optical power harvesting to generate optimal results compared with other methods (e.g., RF and acoustic) at submillimeter size scales intended for such designs. We present design and integration techniques of optical power harvesting structures with complementary metal oxide semiconductor platforms using SOI technologies along with monolithically integrated electronics. Such platforms can become the basis of optoelectronic biomedical systems including implants and lab-on-chip systems.

  6. Integrated Active Magnetic Probe in Silicon-on-Insulator Complementary Metal-Oxide-Semiconductor Technology

    NASA Astrophysics Data System (ADS)

    Aoyama, Satoshi; Kawahito, Shoji; Yamaguchi, Masahiro

    2006-09-01

    A novel magnetic probe has been designed and fabricated by 0.15 μm five-metal (4M + thick metal) silicon-on-insulator (SOI) complementary metal-oxide-semiconductor (CMOS) technology to achieve both a high sensitivity and a high spatial resolution. A detecting coil having metal multilayers, a two-stage differential amplifier, a differential-to-single-ended converter, and an output buffer are integrated on a single chip. The probe is referred to as an active probe, and it has a feature to distinguish magnetic field from detected electromagnetic emissions by means of a two-turn differential coil structure and a circuit technique using a wideband differential-to-single-ended converter with a high common-mode rejection. Measurement results show the effectiveness of the active magnetic probe with the function of on-chip amplification and electric field suppression, as well as electrical switching with common-mode voltage (Vcom). Moreover, for the first time, a magnetic field distribution is visualized with an active probe.

  7. Ultralow power, high fill factor smart complementary metal oxide semiconductor image sensor with motion detection capability

    NASA Astrophysics Data System (ADS)

    Mahbod, Abbas; Karimiyan, Hossein

    2016-11-01

    Bandwidth saving, power consumption, and fill factor improvement are known as vitally important challenges image sensor designers face in order to accomplish high-performance imaging systems. This paper presents an ultralow power, high fill factor smart complementary metal oxide semiconductor (CMOS) image sensor with motion detection capability. In this efficient methodology, the amount of redundant data processed in unimportant frames has been reduced significantly, and therefore, the proposed imaging system consumes less power compared with counterpart imagers. Furthermore, a pixel structure is introduced that outputs two consecutive frame voltages in series, with the result that the pixel size is minimized and a higher fill factor is achieved. In order to simulate the image capturing procedure, a state-of-the-art approach based on MATLAB and HSPICE software is devised, which is another important achievement of this paper. The performance of this technique is demonstrated using a 64×64 pixel sensor designed in a 0.18-μm standard CMOS technology. The sensor chip consumes 0.2 mW of power while operating at 100 fps with a fill factor of 45%.

  8. Transport properties of silicon complementary-metal-oxide semiconductor quantum well field-effect transistors

    NASA Astrophysics Data System (ADS)

    Naquin, Clint Alan

    Introducing explicit quantum transport into silicon (Si) transistors in a manner compatible with industrial fabrication has proven challenging, yet has the potential to transform the performance horizons of large scale integrated Si devices and circuits. Explicit quantum transport as evidenced by negative differential transconductances (NDTCs) has been observed in a set of quantum well (QW) n-channel metal-oxide-semiconductor (NMOS) transistors fabricated using industrial silicon complementary MOS processing. The QW potential was formed via lateral ion implantation doping on a commercial 45 nm technology node process line, and measurements of the transfer characteristics show NDTCs up to room temperature. Detailed gate length and temperature dependence characteristics of the NDTCs in these devices have been measured. Gate length dependence of NDTCs shows a correlation of the interface channel length with the number of NDTCs formed as well as with the gate voltage (VG) spacing between NDTCs. The VG spacing between multiple NDTCs suggests a quasi-parabolic QW potential profile. The temperature dependence is consistent with partial freeze-out of carrier concentration against a degenerately doped background. A folding amplifier frequency multiplier circuit using a single QW NMOS transistor to generate a folded current-voltage transfer function via a NDTC was demonstrated. Time domain data shows frequency doubling in the kHz range at room temperature, and Fourier analysis confirms that the output is dominated by the second harmonic of the input. De-embedding the circuit response characteristics from parasitic cable and contact impedances suggests that in the absence of parasitics the doubling bandwidth could be as high as 10 GHz in a monolithic integrated circuit, limited by the transresistance magnitude of the QW NMOS. This is the first example of a QW device fabricated by mainstream Si CMOS technology being used in a circuit application and establishes the feasibility

  9. Multichannel, time-resolved picosecond laser ultrasound imaging and spectroscopy with custom complementary metal-oxide-semiconductor detector

    SciTech Connect

    Smith, Richard J.; Light, Roger A.; Johnston, Nicholas S.; Pitter, Mark C.; Somekh, Mike G.; Sharples, Steve D.

    2010-02-15

    This paper presents a multichannel, time-resolved picosecond laser ultrasound system that uses a custom complementary metal-oxide-semiconductor linear array detector. This novel sensor allows parallel phase-sensitive detection of very low contrast modulated signals with performance in each channel comparable to that of a discrete photodiode and a lock-in amplifier. Application of the instrument is demonstrated by parallelizing spatial measurements to produce two-dimensional thickness maps on a layered sample, and spectroscopic parallelization is demonstrated by presenting the measured Brillouin oscillations from a gallium arsenide wafer. This paper demonstrates the significant advantages of our approach to pump probe systems, especially picosecond ultrasonics.

  10. Multichannel, time-resolved picosecond laser ultrasound imaging and spectroscopy with custom complementary metal-oxide-semiconductor detector.

    PubMed

    Smith, Richard J; Light, Roger A; Sharples, Steve D; Johnston, Nicholas S; Pitter, Mark C; Somekh, Mike G

    2010-02-01

    This paper presents a multichannel, time-resolved picosecond laser ultrasound system that uses a custom complementary metal-oxide-semiconductor linear array detector. This novel sensor allows parallel phase-sensitive detection of very low contrast modulated signals with performance in each channel comparable to that of a discrete photodiode and a lock-in amplifier. Application of the instrument is demonstrated by parallelizing spatial measurements to produce two-dimensional thickness maps on a layered sample, and spectroscopic parallelization is demonstrated by presenting the measured Brillouin oscillations from a gallium arsenide wafer. This paper demonstrates the significant advantages of our approach to pump probe systems, especially picosecond ultrasonics.

  11. Improved Radio Frequency Power Characteristics of Complementary Metal-Oxide-Semiconductor-Compatible Asymmetric-Lightly-Doped-Drain Metal-Oxide-Semiconductor Transistor

    NASA Astrophysics Data System (ADS)

    Chang, Tsu; Kao, Hsuan-ling; Chen, Y. J.; Chin, Albert

    2010-03-01

    We have characterized and modeled the radio frequency (RF) power performance of a 0.18 µm asymmetric-lightly-doped-drain metal-oxide-semiconductor field-effect transistor (LDD MOSFET). In comparison with the conventional 0.18 µm MOSFET, this asymmetric-LDD device shows a larger power density of 0.54 W/mm, and 8 dB better adjacent channel power ratio (ACPR) linearity at 2.4 GHz from the improved twice DC breakdown voltage of 6.9 V. These significant improvements of RF power performance in the asymmetric-LDD transistor are important for the medium RF power amplifier application.

  12. Improved Radio Frequency Power Characteristics of Complementary Metal-Oxide-Semiconductor-Compatible Asymmetric-Lightly-Doped-Drain Metal-Oxide-Semiconductor Transistor

    NASA Astrophysics Data System (ADS)

    Tsu Chang,; Hsuan-ling Kao,; Y. J. Chen,; Albert Chin,

    2010-03-01

    We have characterized and modeled the radio frequency (RF) power performance of a 0.18 μm asymmetric-lightly-doped-drain metal-oxide-semiconductor field-effect transistor (LDD MOSFET). In comparison with the conventional 0.18 μm MOSFET, this asymmetric-LDD device shows a larger power density of 0.54 W/mm, and 8 dB better adjacent channel power ratio (ACPR) linearity at 2.4 GHz from the improved twice DC breakdown voltage of 6.9 V. These significant improvements of RF power performance in the asymmetric-LDD transistor are important for the medium RF power amplifier application.

  13. Near-infrared fluorescence goggle system with complementary metal-oxide-semiconductor imaging sensor and see-through display.

    PubMed

    Liu, Yang; Njuguna, Raphael; Matthews, Thomas; Akers, Walter J; Sudlow, Gail P; Mondal, Suman; Tang, Rui; Gruev, Viktor; Achilefu, Samuel

    2013-10-01

    We have developed a near-infrared (NIR) fluorescence goggle system based on the complementary metal-oxide-semiconductor active pixel sensor imaging and see-through display technologies. The fluorescence goggle system is a compact wearable intraoperative fluorescence imaging and display system that can guide surgery in real time. The goggle is capable of detecting fluorescence of indocyanine green solution in the picomolar range. Aided by NIR quantum dots, we successfully used the fluorescence goggle to guide sentinel lymph node mapping in a rat model. We further demonstrated the feasibility of using the fluorescence goggle in guiding surgical resection of breast cancer metastases in the liver in conjunction with NIR fluorescent probes. These results illustrate the diverse potential use of the goggle system in surgical procedures.

  14. Ratiometric, filter-free optical sensor based on a complementary metal oxide semiconductor buried double junction photodiode.

    PubMed

    Yung, Ka Yi; Zhan, Zhiyong; Titus, Albert H; Baker, Gary A; Bright, Frank V

    2015-07-16

    We report a complementary metal oxide semiconductor integrated circuit (CMOS IC) with a buried double junction (BDJ) photodiode that (i) provides a real-time output signal that is related to the intensity ratio at two emission wavelengths and (ii) simultaneously eliminates the need for an optical filter to block Rayleigh scatter. We demonstrate the BDJ platform performance for gaseous NH3 and aqueous pH detection. We also compare the BDJ performance to parallel results obtained by using a slew scanned fluorimeter (SSF). The BDJ results are functionally equivalent to the SSF results without the need for any wavelength filtering or monochromators and the BDJ platform is not prone to errors associated with source intensity fluctuations or sensor signal drift. Copyright © 2015 Elsevier B.V. All rights reserved.

  15. A Very Low Dark Current Temperature-Resistant, Wide Dynamic Range, Complementary Metal Oxide Semiconductor Image Sensor

    NASA Astrophysics Data System (ADS)

    Mizobuchi, Koichi; Adachi, Satoru; Tejada, Jose; Oshikubo, Hiromichi; Akahane, Nana; Sugawa, Shigetoshi

    2008-07-01

    A very low dark current (VLDC) temperature-resistant approach which best suits a wide dynamic range (WDR) complementary metal oxide semiconductor (CMOS) image sensor with a lateral over-flow integration capacitor (LOFIC) has been developed. By implementing a low electric field photodiode without a trade-off of full well-capacity, reduced plasma damage, re-crystallization, and termination of silicon-silicon dioxide interface states in the front end of line and back end of line (FEOL and BEOL) in a 0.18 µm, two polycrystalline silicon, three metal (2P3M) process, the dark current is reduced to 11 e-/s/pixel (0.35 e-/s/µm2: pixel area normalized) at 60 °C, which is the lowest value ever reported. For further robustness at low and high temperatures, 1/3-in., 5.6-µm pitch, 800×600 pixel sensor chips with low noise readout circuits designed for a signal and noise hold circuit and a programmable gain amplifier (PGA) have also been deposited with an inorganic cap layer on a micro-lens and covered with a metal hermetically sealed package assembly. Image sensing performance results in 2.4 e-rms temporal noise and 100 dB dynamic range (DR) with 237 ke- full well-capacity. The operating temperature range is extended from -40 to 85 °C while retaining good image quality.

  16. 32×32 pixel array complementary metal-oxide semiconductor imaging sensor for laser Doppler blood-flow measurement

    NASA Astrophysics Data System (ADS)

    He, Diwei; Kongsavatsak, Chayut; Hayes-Gill, Barrie R.; Crowe, John A.; Morgan, Stephen P.

    2011-05-01

    A 32×32 pixel array has been fabricated in a 0.35-μm complementary metal-oxide semiconductor process with the aim of producing two-dimensional laser Doppler blood-flow images. In the design, each pixel contains five basic elements: a photodiode, a front-end consisting of a current to voltage converter, voltage amplifier, antialiasing filter, and buffer. The analog design is optimized for the detection of laser Doppler blood-flow signals and thus offers advantages over conventional sensors. The analog outputs are passed through an on-chip multiplexer and digitized by an external analog-to-digital converter. The sensor has been fully characterized electrically and optically using modulated electrical and optical signals. A calibration process for fixed pattern noise reduces the standard deviation of the ac gain by a factor of 2. The imaging response is tested by imaging a vibrating test structure and a rotating diffuser. Blood-flow measurements on a finger before and after occlusion demonstrate that the sensor array is capable of detecting blood-flow signals from tissue. The knowledge gained from the characterization of the design can be used to develop a fully integrated laser Doppler blood-flow sensors with a higher number of pixels.

  17. Exploiting sub-20-nm complementary metal-oxide semiconductor technology challenges to design affordable systems-on-chip

    NASA Astrophysics Data System (ADS)

    Vaidyanathan, Kaushik; Zhu, Qiuling; Liebmann, Lars; Lai, Kafai; Wu, Stephen; Liu, Renzhi; Liu, Yandong; Strojwas, Andzrej; Pileggi, Larry

    2015-01-01

    For the past four decades, cost and features have driven complementary metal-oxide semiconductor (CMOS) scaling. Severe lithography and material limitations seen below the 20-nm node, however, are challenging the fundamental premise of affordable CMOS scaling. Just continuing to co-optimize leaf cell circuit and layout designs with process technology does not enable us to exploit the challenges of sub-20-nm CMOS. For affordable scaling, it is imperative to work past sub-20-nm technology impediments while exploiting its features. To this end, we propose to broaden the scope of design technology co-optimization (DTCO) to be more holistic by including microarchitecture design and computer-aided design, along with circuits, layout, and process technology. Furthermore, we undertook such a holistic DTCO for all critical design elements such as embedded memory, standard cell logic, analog components, and physical synthesis in a 14-nm process. Measurements results from experimental designs in a representative 14-nm process from IBM demonstrate the efficacy of the proposed approach.

  18. Photosystem I Bio-Photosensor Integrated with Complementary Metal-Oxide-Semiconductor Source-Drain Follower on a Chip

    NASA Astrophysics Data System (ADS)

    Tsukada, Junichi; Ozawa, Hiroaki; Uno, Shigeyasu; Nakazato, Kazuo; Terasaki, Nao; Yamamoto, Noritaka; Hiraga, Takashi; Iwai, Masako; Konno, Masae; Ito, Kohsuke; Inoue, Yasunori

    2010-01-01

    A new bio-photosensor where photons are converted to electrons by photosystem I (PSI) of Thermosynechococcus elongatus is described; in this bio-photosensor, the converted electronic charge is sensed by a complementary metal-oxide-semiconductor (CMOS) source-drain follower circuit fabricated by the 1.2 µm standard CMOS process. Thin Au/Ti films are deposited and patterned with a 4.255×4.255 µm2 extended-gate electrode, and an SU-8 layer is formed, with the exception of the electrode, to reduce the light-induced drift of silicon nitride. As a result, only the Au electrode and the SU-8 layer come into contact with the electrolyte. The PSI is immobilized on the electrode, and the photoresponse due to the photovoltaic effect of PSI is measured as the output voltage of the CMOS source-drain follower. The action spectrum from the light source is consistent with the PSI absorption spectrum. In addition, the selectivity of the photoresponse between two adjacent sensor cells is confirmed, which is promising for ultrasensitive bioimage sensing.

  19. Performance characterization of microtomography with complementary metal-oxide-semiconductor detectors for computer-aided defect inspection

    SciTech Connect

    Kim, Ho Kyung; Yun, Seungman; Han, Jong Chul; Youn, Hanbean; Cho, Min Kook; Lim, Chang Hwy; Heo, Sung Kyn; Shon, Cheol-Soon; Kim, Seong-Sik; Cho, Bong Hae; Achterkirchen, Thorsten Graeve

    2009-05-01

    We developed a computer-aided defect inspection system based on computed tomography (CT). The system consists of a homemade small cone-beam CT (CBCT) system and a graphical toolbox, which is used to extract a computer-aided design (CAD) model from the CT data. In the small CBCT system, the x-ray imaging detector is based on a complementary metal-oxide-semiconductor photodiode array in conjunction with a scintillator. Imaging performance of the detector was evaluated in terms of modulation-transfer function, noise-power spectrum, and detective quantum efficiency. The tomographic imaging performance of the small CBCT system was evaluated in terms of signal-to-noise ratio and contrast-to-noise ratio. The graphical toolbox to support defect inspection incorporates various functional tools such as volume rendering, segmentation, triangular-mesh data generation, and data reduction. All the tools have been integrated in a graphical-user interface form. The developed system can provide rapid visual inspection as well as quantitative evaluation of defects by comparing the extracted CAD file with the original file, if available, of an object. The performance of the developed system is demonstrated with experimental CT volume data.

  20. An optical relay approach to very low cost hybrid polymer-complementary metal-oxide semiconductor electrophoresis instrumentation.

    PubMed

    Hall, Gordon H; Sloan, David L; Ma, Tianchi; Couse, Madeline H; Martel, Stephane; Elliott, Duncan G; Glerum, D Moira; Backhouse, Christopher J

    2014-07-04

    Electrophoresis is an integral part of many molecular diagnostics protocols and an inexpensive implementation would greatly facilitate point-of-care (POC) applications. However, the high instrumentation cost presents a substantial barrier, much of it associated with fluorescence detection. The cost of such systems could be substantially reduced by placing the fluidic channel and photodiode directly above the detector in order to collect a larger portion of the fluorescent light. In future, this could be achieved through the integration and monolithic fabrication of photoresist microchannels on complementary metal-oxide semiconductor microelectronics (CMOS). However, the development of such a device is expensive due to high non-recurring engineering costs. To facilitate that development, we present a system that utilises an optical relay to integrate low-cost polymeric microfluidics with a CMOS chip that provides a photodiode, analog-digital conversion and a standard serial communication interface. This system embodies an intermediate level of microelectronic integration, and significantly decreases development costs. With a limit of detection of 1.3±0.4nM of fluorescently end-labeled deoxyribonucleic acid (DNA), it is suitable for diagnostic applications.

  1. A Three-Stage Inverter-Based Stacked Power Amplifier in 65 nm Complementary Metal Oxide Semiconductor Process

    NASA Astrophysics Data System (ADS)

    Kiumarsi, Hamid; Mizuochi, Yutaka; Ito, Hiroyuki; Ishihara, Noboru; Masu, Kazuya

    2012-02-01

    A three-stage inverter-based stacked power amplifier (PA) in complementary metal oxide semiconductor (CMOS) process is proposed to overcome low breakdown voltage problem of scaled CMOS technologies. Unlike previous reported stacked PAs which radio frequency choke (RFC) was inevitable, we proposed stacked nMOS and pMOS transistors which effectively eliminates use of RFC. By properly setting self-biased circuits' and transistors' parameters, output impedance could reach up to 50 Ω which together with not employing the RFC makes this topology very appealing for the scalable PA realization. As a proof of concept, a three-stage PA using 65 nm CMOS technology is implemented. With a 6 V power supply for the third stage, the fabricated PA shows a small-signal gain of 36 dB, a saturated output power of 16 dBm and a maximum power added efficiency of 10% at 1 GHz. Using a 7.5 V of power supply, saturated output power reaches 18 dBm. To the best of our knowledge, this is the first reported inverter-based stacked PA.

  2. Ultrasonic fingerprint sensor using a piezoelectric micromachined ultrasonic transducer array integrated with complementary metal oxide semiconductor electronics

    SciTech Connect

    Lu, Y.; Fung, S.; Wang, Q.; Horsley, D. A.; Tang, H.; Boser, B. E.; Tsai, J. M.; Daneman, M.

    2015-06-29

    This paper presents an ultrasonic fingerprint sensor based on a 24 × 8 array of 22 MHz piezoelectric micromachined ultrasonic transducers (PMUTs) with 100 μm pitch, fully integrated with 180 nm complementary metal oxide semiconductor (CMOS) circuitry through eutectic wafer bonding. Each PMUT is directly bonded to a dedicated CMOS receive amplifier, minimizing electrical parasitics and eliminating the need for through-silicon vias. The array frequency response and vibration mode-shape were characterized using laser Doppler vibrometry and verified via finite element method simulation. The array's acoustic output was measured using a hydrophone to be ∼14 kPa with a 28 V input, in reasonable agreement with predication from analytical calculation. Pulse-echo imaging of a 1D steel grating is demonstrated using electronic scanning of a 20 × 8 sub-array, resulting in 300 mV maximum received amplitude and 5:1 contrast ratio. Because the small size of this array limits the maximum image size, mechanical scanning was used to image a 2D polydimethylsiloxane fingerprint phantom (10 mm × 8 mm) at a 1.2 mm distance from the array.

  3. Ultrasonic fingerprint sensor using a piezoelectric micromachined ultrasonic transducer array integrated with complementary metal oxide semiconductor electronics

    NASA Astrophysics Data System (ADS)

    Lu, Y.; Tang, H.; Fung, S.; Wang, Q.; Tsai, J. M.; Daneman, M.; Boser, B. E.; Horsley, D. A.

    2015-06-01

    This paper presents an ultrasonic fingerprint sensor based on a 24 × 8 array of 22 MHz piezoelectric micromachined ultrasonic transducers (PMUTs) with 100 μm pitch, fully integrated with 180 nm complementary metal oxide semiconductor (CMOS) circuitry through eutectic wafer bonding. Each PMUT is directly bonded to a dedicated CMOS receive amplifier, minimizing electrical parasitics and eliminating the need for through-silicon vias. The array frequency response and vibration mode-shape were characterized using laser Doppler vibrometry and verified via finite element method simulation. The array's acoustic output was measured using a hydrophone to be ˜14 kPa with a 28 V input, in reasonable agreement with predication from analytical calculation. Pulse-echo imaging of a 1D steel grating is demonstrated using electronic scanning of a 20 × 8 sub-array, resulting in 300 mV maximum received amplitude and 5:1 contrast ratio. Because the small size of this array limits the maximum image size, mechanical scanning was used to image a 2D polydimethylsiloxane fingerprint phantom (10 mm × 8 mm) at a 1.2 mm distance from the array.

  4. Chemistry integrated circuit: chemical system on a complementary metal oxide semiconductor integrated circuit

    PubMed Central

    Nakazato, Kazuo

    2014-01-01

    By integrating chemical reactions on a large-scale integration (LSI) chip, new types of device can be created. For biomedical applications, monolithically integrated sensor arrays for potentiometric, amperometric and impedimetric sensing of biomolecules have been developed. The potentiometric sensor array detects pH and redox reaction as a statistical distribution of fluctuations in time and space. For the amperometric sensor array, a microelectrode structure for measuring multiple currents at high speed has been proposed. The impedimetric sensor array is designed to measure impedance up to 10 MHz. The multimodal sensor array will enable synthetic analysis and make it possible to standardize biosensor chips. Another approach is to create new functional devices by integrating molecular systems with LSI chips, for example image sensors that incorporate biological materials with a sensor array. The quantum yield of the photoelectric conversion of photosynthesis is 100%, which is extremely difficult to achieve by artificial means. In a recently developed process, a molecular wire is plugged directly into a biological photosynthetic system to efficiently conduct electrons to a gold electrode. A single photon can be detected at room temperature using such a system combined with a molecular single-electron transistor. PMID:24567475

  5. Chemistry integrated circuit: chemical system on a complementary metal oxide semiconductor integrated circuit.

    PubMed

    Nakazato, Kazuo

    2014-03-28

    By integrating chemical reactions on a large-scale integration (LSI) chip, new types of device can be created. For biomedical applications, monolithically integrated sensor arrays for potentiometric, amperometric and impedimetric sensing of biomolecules have been developed. The potentiometric sensor array detects pH and redox reaction as a statistical distribution of fluctuations in time and space. For the amperometric sensor array, a microelectrode structure for measuring multiple currents at high speed has been proposed. The impedimetric sensor array is designed to measure impedance up to 10 MHz. The multimodal sensor array will enable synthetic analysis and make it possible to standardize biosensor chips. Another approach is to create new functional devices by integrating molecular systems with LSI chips, for example image sensors that incorporate biological materials with a sensor array. The quantum yield of the photoelectric conversion of photosynthesis is 100%, which is extremely difficult to achieve by artificial means. In a recently developed process, a molecular wire is plugged directly into a biological photosynthetic system to efficiently conduct electrons to a gold electrode. A single photon can be detected at room temperature using such a system combined with a molecular single-electron transistor.

  6. Transistor sizing in the design of high-speed CMOS (complementary-symmetry metal-oxide-semiconductor) super buffers. Master's thesis

    SciTech Connect

    Steele, G.R.

    1988-03-01

    An algorithm for sizing transistors for static Complementary-symmetry Metal-Oxide-Semiconductor (CMOS) integrated-circuit logic design using silicon-gate enhancement-mode Field-Effect Transistors (FET) is derived and implemented in software. The algorithm is applied to the mask-level hardware design of a three-micron-minimum feature-size p-well high-speed super buffer. A software representation of the super buffer can be used for the automated design of custom Very-Large-Scale Integrated (VLSI) circuits.

  7. Self-aligned silicides for Ohmic contacts in complementary metal-oxide-semiconductor technology: TiSi2, CoSi2, and NiSi

    NASA Astrophysics Data System (ADS)

    Zhang, S.-L.; Smith, U.

    2004-07-01

    Metal silicides continue to play an indispensable role during the remarkable development of microelectronics. Along with several other technological innovations, the implementation of the self-aligned silicide technology paved the way for a rapid and successful miniaturization of device dimensions for metal-oxide-semiconductor field-effect transistors (MOSFETs) in pace with the Moore's law. The use of silicides has also evolved from creating reliable contacts for diodes, to generating high-conductivity current paths for local wiring, and lately to forming low-resistivity electrical contacts for MOSFETs. With respect to the choice of silicides for complementary metal-oxide-semiconductor (CMOS) technology, a convergence has become clear with the self-alignment technology using only a limited number of silicides, namely TiSi2, CoSi2, and NiSi. The present work discusses the advantages and limitations of TiSi2, CoSi2, and NiSi using the development trend of CMOS technology as a measure. Specifically, the reactive diffusion and phase formation of these silicides in the three terminals of a MOSFET, i.e., gate, source, and drain, are analyzed. This work ends with a brief discussion about future trends of metal silicides in micro/nanoelectronics with reference to potential material aspects and device structures outlined in the International Technology Roadmap for Semiconductors. .

  8. Single carrier trapping and de-trapping in scaled silicon complementary metal-oxide-semiconductor field-effect transistors at low temperatures

    NASA Astrophysics Data System (ADS)

    Li, Zuo; Khaled Husain, Muhammad; Yoshimoto, Hiroyuki; Tani, Kazuki; Sasago, Yoshitaka; Hisamoto, Digh; Fletcher, Jonathan David; Kataoka, Masaya; Tsuchiya, Yoshishige; Saito, Shinichi

    2017-07-01

    The scaling of Silicon (Si) technology is approaching the physical limit, where various quantum effects such as direct tunnelling and quantum confinement are observed, even at room temperatures. We have measured standard complementary metal-oxide-semiconductor field-effect-transistors (CMOSFETs) with wide and short channels at low temperatures to observe single electron/hole characteristics due to local structural disturbances such as roughness and defects. In fact, we observed Coulomb blockades in sub-threshold regimes of both p-type and n-type Si CMOSFETs, showing the presence of quantum dots in the channels. The stability diagrams for the Coulomb blockade were explained by the potential minima due to poly-Si grains. We have also observed sharp current peaks at narrow bias windows at the edges of the Coulomb diamonds, showing resonant tunnelling of single carriers through charge traps.

  9. Thick detection zone single-photon avalanche diode fabricated in 0.35 μm complementary metal-oxide semiconductors

    NASA Astrophysics Data System (ADS)

    Steindl, Bernhard; Enne, Reinhard; Zimmermann, Horst

    2015-05-01

    An avalanche photodiode (APD) fabricated in 0.35 μm high-voltage complementary metal-oxide semiconductor (CMOS) technology, which was originally optimized for linear mode applications, is characterized in Geiger mode operation. This work shows that the used design concept is also suitable for single-photon detection applications and achieves a photon detection efficiency of 22.1% at 785 nm due to a thick detection zone and 3.5 V excess bias. At this operation point, the single-photon APD achieves good results regarding afterpulsing probability (3.4%) and dark count rate (46 kHz) with respect to the large active diameter of 86 μm.

  10. Analysis, Design, and Optimization of Matched-Impedance Wide-Band Amplifiers With Multiple Feedback Loops Using 0.18 μm Complementary Metal Oxide Semiconductor Technology

    NASA Astrophysics Data System (ADS)

    Lin, Yo-Sheng; Lee, Tai-Hsing

    2004-10-01

    The realization of matched-impedance wide-band amplifier fabricated by 0.18 μm complementary metal oxide semiconductor (CMOS) process is reported. The technique of multiple feedback loops was used in the amplifier for terminal impedance matching and wide bandwidth simultaneously. The experimental results show that 3-dB bandwidth of 3 GHz and a gain of 10.7 dB with in-band input/output return loss more than 10 dB are obtained. These values agree well with those predicted from the analytic expressions derived for voltage gain, trans-impedance gain, bandwidth, and input/output return loss and impedance. In addition, the use of source capacitive peaking technique can improve the intrinsic over-damped characteristic of this amplifier.

  11. Mechanical stress effects on Pb(Zr,Ti)O3 thin-film ferroelectric capacitors embedded in a standard complementary metal-oxide-semiconductor process

    NASA Astrophysics Data System (ADS)

    Acosta, Antonio G.; Rodriguez, John A.; Nishida, Toshikazu

    2014-06-01

    We report experimental investigations of externally applied mechanical stress on 70 nm Pb(Zr,Ti)O3 ferroelectric capacitors embedded within a 130 nm complementary metal-oxide-semiconductor manufacturing process. An average increase in the remnant polarization of 3.37% per 100 MPa compressive uniaxial stress was observed. The maximum polarization increased by 2.68% per 100 MPa, while the cycling endurance was not affected by stress. The significant difference between experiment and the lattice distortion model suggests that two mechanisms are responsible for the polarization change. These results indicate that stress engineering may be used to enhance the signal margin in ferroelectric random access memory and enable technology scaling.

  12. Note: A disposable x-ray camera based on mass produced complementary metal-oxide-semiconductor sensors and single-board computers

    NASA Astrophysics Data System (ADS)

    Hoidn, Oliver R.; Seidler, Gerald T.

    2015-08-01

    We have integrated mass-produced commercial complementary metal-oxide-semiconductor (CMOS) image sensors and off-the-shelf single-board computers into an x-ray camera platform optimized for acquisition of x-ray spectra and radiographs at energies of 2-6 keV. The CMOS sensor and single-board computer are complemented by custom mounting and interface hardware that can be easily acquired from rapid prototyping services. For single-pixel detection events, i.e., events where the deposited energy from one photon is substantially localized in a single pixel, we establish ˜20% quantum efficiency at 2.6 keV with ˜190 eV resolution and a 100 kHz maximum detection rate. The detector platform's useful intrinsic energy resolution, 5-μm pixel size, ease of use, and obvious potential for parallelization make it a promising candidate for many applications at synchrotron facilities, in laser-heating plasma physics studies, and in laboratory-based x-ray spectrometry.

  13. Development of a Fully Integrated Complementary Metal-Oxide-Semiconductor Image Sensor-Based Device for Real-Time In vivo Fluorescence Imaging inside the Mouse Hippocampus

    NASA Astrophysics Data System (ADS)

    Ng, David C.; Nakagawa, Takuma; Tokuda, Takashi; Nunoshita, Masahiro; Tamura, Hideki; Ishikawa, Yasuyuki; Shiosaka, Sadao; Ohta, Jun

    2007-04-01

    In our previous work, we demonstrated the potential of a complementary metal-oxide-semiconductor (CMOS) imaging device for use in imaging of the mouse brain. We showed that the device is capable of detecting fluorescence signal inside the mouse brain and successfully imaged real-time protease activity inside the hippocampus. In this work, we have improved the imaging device by integrating an excitation light source in the form of an ultraviolet light-emitting diode chip and an injection needle onto the sensor chip. This results in a compact single device imaging system for minimal invasive imaging inside the mouse brain. Also experimental repeatability is improved which enabled us to successful perform calibration of fluorophore concentration using the device. Fluorescence imaging experiments inside the brain phantom as well as in the mouse brain show that the device is capable of real time fluorescence detection. Using the device, we found that diffusion rate of chemical injected into the brain is smaller than 10 pmol/min. This work is expected to lead to the successful use of a CMOS imaging device for the study of the functions of the brain.

  14. Three-Dimensional Flexible Complementary Metal-Oxide-Semiconductor Logic Circuits Based On Two-Layer Stacks of Single-Walled Carbon Nanotube Networks.

    PubMed

    Zhao, Yudan; Li, Qunqing; Xiao, Xiaoyang; Li, Guanhong; Jin, Yuanhao; Jiang, Kaili; Wang, Jiaping; Fan, Shoushan

    2016-02-23

    We have proposed and fabricated stable and repeatable, flexible, single-walled carbon nanotube (SWCNT) thin film transistor (TFT) complementary metal-oxide-semiconductor (CMOS) integrated circuits based on a three-dimensional (3D) structure. Two layers of SWCNT-TFT devices were stacked, where one layer served as n-type devices and the other one served as p-type devices. On the basis of this method, it is able to save at least half of the area required to construct an inverter and make large-scale and high-density integrated CMOS circuits easier to design and manufacture. The 3D flexible CMOS inverter gain can be as high as 40, and the total noise margin is more than 95%. Moreover, the input and output voltage of the inverter are exactly matched for cascading. 3D flexible CMOS NOR, NAND logic gates, and 15-stage ring oscillators were fabricated on PI substrates with high performance as well. Stable electrical properties of these circuits can be obtained with bending radii as small as 3.16 mm, which shows that such a 3D structure is a reliable architecture and suitable for carbon nanotube electrical applications in complex flexible and wearable electronic devices.

  15. 2 Gbit/s 0.5 μm complementary metal-oxide semiconductor optical transceiver with event-driven dynamic power-on capability

    NASA Astrophysics Data System (ADS)

    Wang, Xingle; Kiamilev, Fouad; Gui, Ping; Wang, Xiaoqing; Ekman, Jeremy; Zuo, Yongrong; Blankenberg, Jason; Haney, Michael

    2006-06-01

    A 2 Gb/s0.5 μm complementary metal-oxide semiconductor optical transceiver designed for board- or backplane level power-efficient interconnections is presented. The transceiver supports optical wake-on-link (OWL), an event-driven dynamic power-on technique. Depending on external events, the transceiver resides in either the active mode or the sleep mode and switches accordingly. The active-to-sleep transition shuts off the normal, gigabit link and turns on dedicated circuits to establish a low-power (~1.8 mW), low data rate (less than 100 Mbits/s) link. In contrast the normal, gigabit link consumes over 100 mW. Similarly the sleep-to-active transition shuts off the low-power link and turns on the normal, gigabit link. The low-power link, sharing the same optical channel with the normal, gigabit link, is used to achieve transmitter/receiver pair power-on synchronization and greatly reduces the power consumption of the transceiver. A free-space optical platform was built to evaluate the transceiver performance. The experiment successfully demonstrated the event-driven dynamic power-on operation. To our knowledge, this is the first time a dynamic power-on scheme has been implemented for optical interconnects. The areas of the circuits that implement the low-power link are approximately one-tenth of the areas of the gigabit link circuits.

  16. Potentiometric Dye Imaging for Pheochromocytoma and Cortical Neurons with a Novel Measurement System Using an Integrated Complementary Metal-Oxide-Semiconductor Imaging Device

    NASA Astrophysics Data System (ADS)

    Kobayashi, Takuma; Tagawa, Ayato; Noda, Toshihiko; Sasagawa, Kiyotaka; Tokuda, Takashi; Hatanaka, Yumiko; Tamura, Hideki; Ishikawa, Yasuyuki; Shiosaka, Sadao; Ohta, Jun

    2010-11-01

    The combination of optical imaging with voltage-sensitive dyes is a powerful tool for studying the spatiotemporal patterns of neural activity and understanding the neural networks of the brain. To visualize the potential status of multiple neurons simultaneously using a compact instrument with high density and a wide range, we present a novel measurement system using an implantable biomedical photonic LSI device with a red absorptive light filter for voltage-sensitive dye imaging (BpLSI-red). The BpLSI-red was developed for sensing fluorescence by the on-chip LSI, which was designed by using complementary metal-oxide-semiconductor (CMOS) technology. A micro-electro-mechanical system (MEMS) microfabrication technique was used to postprocess the CMOS sensor chip; light-emitting diodes (LEDs) were integrated for illumination and to enable long-term cell culture. Using the device, we succeeded in visualizing the membrane potential of 2000-3000 cells and the process of depolarization of pheochromocytoma cells (PC12 cells) and mouse cerebral cortical neurons in a primary culture with cellular resolution. Therefore, our measurement application enables the detection of multiple neural activities simultaneously.

  17. Note: A disposable x-ray camera based on mass produced complementary metal-oxide-semiconductor sensors and single-board computers.

    PubMed

    Hoidn, Oliver R; Seidler, Gerald T

    2015-08-01

    We have integrated mass-produced commercial complementary metal-oxide-semiconductor (CMOS) image sensors and off-the-shelf single-board computers into an x-ray camera platform optimized for acquisition of x-ray spectra and radiographs at energies of 2-6 keV. The CMOS sensor and single-board computer are complemented by custom mounting and interface hardware that can be easily acquired from rapid prototyping services. For single-pixel detection events, i.e., events where the deposited energy from one photon is substantially localized in a single pixel, we establish ∼20% quantum efficiency at 2.6 keV with ∼190 eV resolution and a 100 kHz maximum detection rate. The detector platform's useful intrinsic energy resolution, 5-μm pixel size, ease of use, and obvious potential for parallelization make it a promising candidate for many applications at synchrotron facilities, in laser-heating plasma physics studies, and in laboratory-based x-ray spectrometry.

  18. Complementary metal-oxide semiconductor-compatible detector materials with enhanced 1550 nm responsivity via Sn-doping of Ge/Si(100)

    NASA Astrophysics Data System (ADS)

    Roucka, Radek; Beeler, Richard; Mathews, Jay; Ryu, Mee-Yi; Kee Yeo, Yung; Menéndez, José; Kouvetakis, John

    2011-05-01

    Previously developed methods used to grow Ge1-ySny alloys on Si are extended to Sn concentrations in the 1019-1020 cm-3 range. These concentrations are shown to be sufficient to engineer large increases in the responsivity of detectors operating at 1550 nm. The dopant levels of Sn are incorporated at temperatures in the 370-390 °C range, yielding atomically smooth layers devoid of threading defects at high growth rates of 15-30 nm/min. These conditions are far more compatible with complementary metal-oxide semiconductor processing than the high growth and processing temperatures required to achieve the same responsivity via tensile strain in pure Ge on Si. A detailed study of a detector based on a Sn-doped Ge layer with 0.25% (1.1 × 1020 cm-3) Sn range demonstrates the responsivity enhancement and shows much better I-V characteristics than previously fabricated detectors based on Ge1-ySny alloys with y = 0.02.

  19. Monolithic integration of a silicon nanowire field-effect transistors array on a complementary metal-oxide semiconductor chip for biochemical sensor applications.

    PubMed

    Livi, Paolo; Kwiat, Moria; Shadmani, Amir; Pevzner, Alexander; Navarra, Giulio; Rothe, Jörg; Stettler, Alexander; Chen, Yihui; Patolsky, Fernando; Hierlemann, Andreas

    2015-10-06

    We present a monolithic complementary metal-oxide semiconductor (CMOS)-based sensor system comprising an array of silicon nanowire field-effect transistors (FETs) and the signal-conditioning circuitry on the same chip. The silicon nanowires were fabricated by chemical vapor deposition methods and then transferred to the CMOS chip, where Ti/Pd/Ti contacts had been patterned via e-beam lithography. The on-chip circuitry measures the current flowing through each nanowire FET upon applying a constant source-drain voltage. The analog signal is digitized on chip and then transmitted to a receiving unit. The system has been successfully fabricated and tested by acquiring I-V curves of the bare nanowire-based FETs. Furthermore, the sensing capabilities of the complete system have been demonstrated by recording current changes upon nanowire exposure to solutions of different pHs, as well as by detecting different concentrations of Troponin T biomarkers (cTnT) through antibody-functionalized nanowire FETs.

  20. Real time in vivo imaging and measurement of serine protease activity in the mouse hippocampus using a dedicated complementary metal-oxide semiconductor imaging device.

    PubMed

    Ng, David C; Tamura, Hideki; Tokuda, Takashi; Yamamoto, Akio; Matsuo, Masamichi; Nunoshita, Masahiro; Ishikawa, Yasuyuki; Shiosaka, Sadao; Ohta, Jun

    2006-09-30

    The aim of the present study is to demonstrate the application of complementary metal-oxide semiconductor (CMOS) imaging technology for studying the mouse brain. By using a dedicated CMOS image sensor, we have successfully imaged and measured brain serine protease activity in vivo, in real-time, and for an extended period of time. We have developed a biofluorescence imaging device by packaging the CMOS image sensor which enabled on-chip imaging configuration. In this configuration, no optics are required whereby an excitation filter is applied onto the sensor to replace the filter cube block found in conventional fluorescence microscopes. The fully packaged device measures 350 microm thick x 2.7 mm wide, consists of an array of 176 x 144 pixels, and is small enough for measurement inside a single hemisphere of the mouse brain, while still providing sufficient imaging resolution. In the experiment, intraperitoneally injected kainic acid induced upregulation of serine protease activity in the brain. These events were captured in real time by imaging and measuring the fluorescence from a fluorogenic substrate that detected this activity. The entire device, which weighs less than 1% of the body weight of the mouse, holds promise for studying freely moving animals.

  1. A 3.5-4.5 GHz Complementary Metal-Oxide-Semiconductor Ultrawideband Receiver Frontend Low-Noise Amplifier with On-Chip Integrated Antenna for Interchip Communication

    NASA Astrophysics Data System (ADS)

    Azhari, Afreen; Kimoto, Kentaro; Sasaki, Nobuo; Kikkawa, Takamaro

    2010-04-01

    Chip-to-chip ultrawideband (UWB) wireless interconnections are essential for reducing resistance capacitance (RC) delay in wired interconnections and three-dimensional (3D) highly integrated packaging. In this study, we demonstrated a wireless interchip signal transmission between two on-chip meander antennas on printed circuit board (PCB) for 1 to 20 mm transmission distances where the low power gain of each antenna due to a lossy Si substrate has been amplified by a low-noise amplifier (LNA). The measured result shows that the LNA produces 26 dB of improvement in antenna power gain at 4.5 GHz on a lossy Si substrate. Moreover, a Gaussian monocycle pulse with a center frequency of 2.75 GHz was also received by an on-chip antenna and amplified by the LNA. The LNA was integrated with an on-chip antenna on a Si substrate with a resistivity of 10 Ω·cm using 180 nm complementary metal-oxide-semiconductor (CMOS) technology. The investigated system is required for future single chip transceiver front ends, integrated with an on-chip antenna for 3D mounting on a printed circuit (PC) board.

  2. Optoelectronic Systems Based on InGaAs Complementary-Metal-Oxide-Semiconductor Smart-Pixel Arrays and Free-Space Optical Interconnects

    NASA Astrophysics Data System (ADS)

    Walker, Andrew C.; Yang, Tsung-Yi; Gourlay, James; Dines, Julian A. B.; Forbes, Mark G.; Prince, Simon M.; Baillie, Douglas A.; Neilson, David T.; Williams, Rhys; Wilkinson, Lucy C.; Smith, George R.; Desmulliez, Mark P. Y.; Buller, Gerald S.; Taghizadeh, Mohammad R.; Waddie, Andrew; Underwood, Ian; Stanley, Colin R.; Pottier, Francois; Vgele, Brigitte; Sibbett, Wilson

    1998-05-01

    Free-space optical interconnects have been identified as a potentially important technology for future massively parallel-computing systems. The development of optoelectronic smart pixels based on InGaAs AlGaAs multiple-quantum-well modulators and detectors flip-chip solder-bump bonded onto complementary-metal-oxide-semiconductor (CMOS) circuits and the design and construction of an experimental processor in which the devices are linked by free-space optical interconnects are described. For demonstrating the capabilities of the technology, a parallel data-sorting system has been identified as an effective demonstrator. By use of Batcher s bitonic sorting algorithm and exploitation of a perfect-shuffle optical interconnection, the system has the potential to perform a full sort on 1024, 16-bit words in less than 16 s. We describe the design, testing, and characterization of the smart-pixel devices and free-space optical components. InGaAs CMOS smart-pixel, chip-to-chip communication has been demonstrated at 50 Mbits s. It is shown that the initial system specifications can be met by the component technologies.

  3. Note: A disposable x-ray camera based on mass produced complementary metal-oxide-semiconductor sensors and single-board computers

    SciTech Connect

    Hoidn, Oliver R.; Seidler, Gerald T.

    2015-08-15

    We have integrated mass-produced commercial complementary metal-oxide-semiconductor (CMOS) image sensors and off-the-shelf single-board computers into an x-ray camera platform optimized for acquisition of x-ray spectra and radiographs at energies of 2–6 keV. The CMOS sensor and single-board computer are complemented by custom mounting and interface hardware that can be easily acquired from rapid prototyping services. For single-pixel detection events, i.e., events where the deposited energy from one photon is substantially localized in a single pixel, we establish ∼20% quantum efficiency at 2.6 keV with ∼190 eV resolution and a 100 kHz maximum detection rate. The detector platform’s useful intrinsic energy resolution, 5-μm pixel size, ease of use, and obvious potential for parallelization make it a promising candidate for many applications at synchrotron facilities, in laser-heating plasma physics studies, and in laboratory-based x-ray spectrometry.

  4. Monolithic Integration of a Silicon Nanowire Field-Effect Transistors Array on a Complementary Metal-Oxide Semiconductor Chip for Biochemical Sensor Applications

    PubMed Central

    Livi, Paolo; Kwiat, Moria; Shadmani, Amir; Pevzner, Alexander; Navarra, Giulio; Rothe, Jörg; Stettler, Alexander; Chen, Yihui; Patolsky, Fernando; Hierlemann, Andreas

    2017-01-01

    We present a monolithic complementary metal-oxide semiconductor (CMOS)-based sensor system comprising an array of silicon nanowire field-effect transistors (FETs) and the signal-conditioning circuitry on the same chip. The silicon nanowires were fabricated by chemical vapor deposition methods and then transferred to the CMOS chip, where Ti/Pd/Ti contacts had been patterned via e-beam lithography. The on-chip circuitry measures the current flowing through each nanowire FET upon applying a constant source-drain voltage. The analog signal is digitized on chip and then transmitted to a receiving unit. The system has been successfully fabricated and tested by acquiring I−V curves of the bare nanowire-based FETs. Furthermore, the sensing capabilities of the complete system have been demonstrated by recording current changes upon nanowire exposure to solutions of different pHs, as well as by detecting different concentrations of Troponin T biomarkers (cTnT) through antibody-functionalized nanowire FETs. PMID:26348408

  5. Integration of crystalline orientated γ-Al2O3 films and complementary metal-oxide-semiconductor circuits on Si(1 0 0) substrate

    NASA Astrophysics Data System (ADS)

    Oishi, Koji; Akai, Daisuke; Ishida, Makoto

    2015-01-01

    In this paper, integration of crystalline orientated γ-Al2O3 films and complementary metal-oxide-semiconductor (CMOS) circuits on Si(1 0 0) substrate was reported. In this integration processes, crystalline γ-Al2O3 films need to be preserved their crystallinity during high temperature annealing processes of CMOS fabrication in order to prevent surface condition changes. The γ-Al2O3 films grown on Si substrates are annealed in the CMOS fabrication process conditions, drive-in annealing at 1150 °C in O2 atmosphere and wet annealing 1000 °C in H2O vapor atmosphere. Reflection high energy electron diffraction (RHEED) and x-ray diffraction (XRD) were used to characterize the crystallinity of γ-Al2O3 films after the annealing processes. Surface conditions of the films are analyzed and observed with X-ray photoelectron spectroscopy (XPS) and scanning electron microscope (SEM). As a result, RHEED patterns of the γ-Al2O3 films indicated that wet oxidation annealing was a critical process severally inferior surface condition of crystalline γ-Al2O3 films. XRD, XPS, and SEM investigation unveiled further details of the crystallinity changes on γ-Al2O3 films for each process. These results indicated passivation films were required to integrate γ-Al2O3 films with CMOS fabrication process. Therefore we proposed and introduced Si3N4/TEOS passivation films on γ-Al2O3 films in CMOS fabrication processes. At last, MOSFETs on γ-Al2O3 integrated Si(1 0 0) substrate were fabricated and characterized. The designed characteristics of MOSFETs were obtained on γ-Al2O3 integrated Si substrate.

  6. Fluorescence-suppressed time-resolved Raman spectroscopy of pharmaceuticals using complementary metal-oxide semiconductor (CMOS) single-photon avalanche diode (SPAD) detector.

    PubMed

    Rojalin, Tatu; Kurki, Lauri; Laaksonen, Timo; Viitala, Tapani; Kostamovaara, Juha; Gordon, Keith C; Galvis, Leonardo; Wachsmann-Hogiu, Sebastian; Strachan, Clare J; Yliperttula, Marjo

    2016-01-01

    In this work, we utilize a short-wavelength, 532-nm picosecond pulsed laser coupled with a time-gated complementary metal-oxide semiconductor (CMOS) single-photon avalanche diode (SPAD) detector to acquire Raman spectra of several drugs of interest. With this approach, we are able to reveal previously unseen Raman features and suppress the fluorescence background of these drugs. Compared to traditional Raman setups, the present time-resolved technique has two major improvements. First, it is possible to overcome the strong fluorescence background that usually interferes with the much weaker Raman spectra. Second, using the high photon energy excitation light source, we are able to generate a stronger Raman signal compared to traditional instruments. In addition, observations in the time domain can be performed, thus enabling new capabilities in the field of Raman and fluorescence spectroscopy. With this system, we demonstrate for the first time the possibility of recording fluorescence-suppressed Raman spectra of solid, amorphous and crystalline, and non-photoluminescent and photoluminescent drugs such as caffeine, ranitidine hydrochloride, and indomethacin (amorphous and crystalline forms). The raw data acquired by utilizing only the picosecond pulsed laser and a CMOS SPAD detector could be used for identifying the compounds directly without any data processing. Moreover, to validate the accuracy of this time-resolved technique, we present density functional theory (DFT) calculations for a widely used gastric acid inhibitor, ranitidine hydrochloride. The obtained time-resolved Raman peaks were identified based on the calculations and existing literature. Raman spectra using non-time-resolved setups with continuous-wave 785- and 532-nm excitation lasers were used as reference data. Overall, this demonstration of time-resolved Raman and fluorescence measurements with a CMOS SPAD detector shows promise in diverse areas, including fundamental chemical research, the

  7. Dual Metal/High-k Gate-Last Complementary Metal-Oxide-Semiconductor Field-Effect Transistor with SiBN Film and Characteristic Behavior In Sub-1-nm Equivalent Oxide Thickness

    NASA Astrophysics Data System (ADS)

    Kikuchi, Yoshiaki; Wakabayashi, Hitoshi; Tsukamoto, Masanori; Nagashima, Naoki

    2011-08-01

    For the first time, dual metal/high-k gate-last complementary metal-oxide-semiconductor field-effect transistors (CMOSFETs) with low-dielectric-constant-material offset spacers and several gate oxide thicknesses were fabricated to improve CMOSFETs characteristics. Improvements of 23 aF/µm in parasitic capacitances were confirmed with a low-dielectric-constant material, and drive current improvements were also achieved with a thin gate oxide. The drive currents at 100 nA/µm off leakages in n-type metal-oxide-semiconductor (NMOS) were improved from 830 to 950 µA/µm and that in p-type metal-oxide-semiconductor (PMOS) were from 405 to 450 µA/µm with a reduction in gate oxide thickness. The thin gate oxide in PMOS was thinner than that in NMOS and the gate leakage was increased. However the gate leakage did not affect the off leakage below a gate length of about 44 nm. On the basis of this result, in these gate-last CMOSFETs, it is concluded that the transistors have potential for further reduction of the equivalent oxide thickness without an increase in off leakages at short gate lengths for high off leakage CMOSFETs. For low off leakage CMOSFETs, the optimization of wet process condition is needed to prevent the reduction of the 2 nm HfO2 thickness in PMOS during a wet process.

  8. Nanometer-Thick Single-Crystal Hexagonal Gd2 O3 on GaN for Advanced Complementary Metal-Oxide-Semiconductor Technology.

    PubMed

    Chang, Wen Hsin; Lee, Chih Hsun; Chang, Yao Chung; Chang, Pen; Huang, Mao Lin; Lee, Yi Jun; Hsu, Chia-Hung; Hong, J Minghuang; Tsai, Chiung Chi; Kwo, J Raynien; Hong, Minghwei

    2009-12-28

    Hexagonal-phase single-crystal Gd2 O3 is deposited on GaN in a molecular beam epitaxy system. The dielectric constant is about twice that of its cubic counterpart when deposited on InGaAs or Si. The capacitive effective thickness of 0.5 nm in hexagonal Gd2 O3 is perhaps the lowest on GaN-metal-oxide-semiconductor devices. The heterostructure is thermo dynamically stable at high temperatures and exhibits low interfacial densities of states after high-temperature annealing. Copyright © 2009 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

  9. Demonstration and Architectural Analysis of Complementary Metal-Oxide Semiconductor Multiple-Quantum-Well Smart-Pixel Array Cellular Logic Processors for Single-Instruction Multiple-Data Parallel-Pipeline Processing

    NASA Astrophysics Data System (ADS)

    Wu, Jen-Ming; Kuznia, Charles B.; Hoanca, Bogdan; Chen, Chih-Hao; Sawchuk, Alexander A.

    1999-04-01

    We present an optoelectronic-VLSI system that integrates complementary metal-oxide semiconductor multiple-quantum-well smart pixels for high-throughput computation and signal processing. The system uses 5 10 cellular smart-pixel arrays with intrachip electrical mesh interconnections and interchip optical point-to-point interconnections. Each smart pixel is a fine grain microprocessor that executes binary image algebra instructions. There is one dual-rail optical modulator output and one dual-rail optical detector input in each pixel. These optical input output arrays provide chip-to-chip optical interconnects. Cascading these smart-pixel array chips permits direct transfer of two-dimensional data or images in parallel. We present laboratory demonstrations of the system for digital image edge detection and digital video motion estimation. We also analyze the performance of the system compared with that of conventional single-instruction multiple-data processors.

  10. Demonstration and architectural analysis of complementary metal-oxide semiconductor /multiple-quantum-well smart-pixel array cellular logic processors for single-instruction multiple-data parallel-pipeline processing.

    PubMed

    Wu, J M; Kuznia, C B; Hoanca, B; Chen, C H; Sawchuk, A A

    1999-04-10

    We present an optoelectronic-VLSI system that integrates complementary metal-oxide semiconductor/multiple-quantum-well smart pixels for high-throughput computation and signal processing. The system uses 5 x 10 cellular smart-pixel arrays with intrachip electrical mesh interconnections and interchip optical point-to-point interconnections. Each smart pixel is a fine grain microprocessor that executes binary image algebra instructions. There is one dual-rail optical modulator output and one dual-rail optical detector input in each pixel. These optical input-output arrays provide chip-to-chip optical interconnects. Cascading these smart-pixel array chips permits direct transfer of two-dimensional data or images in parallel. We present laboratory demonstrations of the system for digital image edge detection and digital video motion estimation. We also analyze the performance of the system compared with that of conventional single-instruction-multiple-data processors.

  11. Metal oxide semiconductor thin-film transistors for flexible electronics

    SciTech Connect

    Petti, Luisa; Vogt, Christian; Büthe, Lars; Cantarella, Giuseppe; Tröster, Gerhard; Münzenrieder, Niko; Faber, Hendrik; Bottacchi, Francesca; Anthopoulos, Thomas D.

    2016-06-15

    The field of flexible electronics has rapidly expanded over the last decades, pioneering novel applications, such as wearable and textile integrated devices, seamless and embedded patch-like systems, soft electronic skins, as well as imperceptible and transient implants. The possibility to revolutionize our daily life with such disruptive appliances has fueled the quest for electronic devices which yield good electrical and mechanical performance and are at the same time light-weight, transparent, conformable, stretchable, and even biodegradable. Flexible metal oxide semiconductor thin-film transistors (TFTs) can fulfill all these requirements and are therefore considered the most promising technology for tomorrow's electronics. This review reflects the establishment of flexible metal oxide semiconductor TFTs, from the development of single devices, large-area circuits, up to entirely integrated systems. First, an introduction on metal oxide semiconductor TFTs is given, where the history of the field is revisited, the TFT configurations and operating principles are presented, and the main issues and technological challenges faced in the area are analyzed. Then, the recent advances achieved for flexible n-type metal oxide semiconductor TFTs manufactured by physical vapor deposition methods and solution-processing techniques are summarized. In particular, the ability of flexible metal oxide semiconductor TFTs to combine low temperature fabrication, high carrier mobility, large frequency operation, extreme mechanical bendability, together with transparency, conformability, stretchability, and water dissolubility is shown. Afterward, a detailed analysis of the most promising metal oxide semiconducting materials developed to realize the state-of-the-art flexible p-type TFTs is given. Next, the recent progresses obtained for flexible metal oxide semiconductor-based electronic circuits, realized with both unipolar and complementary technology, are reported. In particular

  12. Metal oxide semiconductor thin-film transistors for flexible electronics

    NASA Astrophysics Data System (ADS)

    Petti, Luisa; Münzenrieder, Niko; Vogt, Christian; Faber, Hendrik; Büthe, Lars; Cantarella, Giuseppe; Bottacchi, Francesca; Anthopoulos, Thomas D.; Tröster, Gerhard

    2016-06-01

    The field of flexible electronics has rapidly expanded over the last decades, pioneering novel applications, such as wearable and textile integrated devices, seamless and embedded patch-like systems, soft electronic skins, as well as imperceptible and transient implants. The possibility to revolutionize our daily life with such disruptive appliances has fueled the quest for electronic devices which yield good electrical and mechanical performance and are at the same time light-weight, transparent, conformable, stretchable, and even biodegradable. Flexible metal oxide semiconductor thin-film transistors (TFTs) can fulfill all these requirements and are therefore considered the most promising technology for tomorrow's electronics. This review reflects the establishment of flexible metal oxide semiconductor TFTs, from the development of single devices, large-area circuits, up to entirely integrated systems. First, an introduction on metal oxide semiconductor TFTs is given, where the history of the field is revisited, the TFT configurations and operating principles are presented, and the main issues and technological challenges faced in the area are analyzed. Then, the recent advances achieved for flexible n-type metal oxide semiconductor TFTs manufactured by physical vapor deposition methods and solution-processing techniques are summarized. In particular, the ability of flexible metal oxide semiconductor TFTs to combine low temperature fabrication, high carrier mobility, large frequency operation, extreme mechanical bendability, together with transparency, conformability, stretchability, and water dissolubility is shown. Afterward, a detailed analysis of the most promising metal oxide semiconducting materials developed to realize the state-of-the-art flexible p-type TFTs is given. Next, the recent progresses obtained for flexible metal oxide semiconductor-based electronic circuits, realized with both unipolar and complementary technology, are reported. In particular

  13. Selective Conversion from p-Type to n-Type of Printed Bottom-Gate Carbon Nanotube Thin-Film Transistors and Application in Complementary Metal-Oxide-Semiconductor Inverters.

    PubMed

    Xu, Qiqi; Zhao, Jianwen; Pecunia, Vincenzo; Xu, Wenya; Zhou, Chunshan; Dou, Junyan; Gu, Weibing; Lin, Jian; Mo, Lixin; Zhao, Yanfei; Cui, Zheng

    2017-04-12

    The fabrication of printed high-performance and environmentally stable n-type single-walled carbon nanotube (SWCNT) transistors and their integration into complementary (i.e., complementary metal-oxide-semiconductor, CMOS) circuits are widely recognized as key to achieving the full potential of carbon nanotube electronics. Here, we report a simple, efficient, and robust method to convert the polarity of SWCNT thin-film transistors (TFTs) using cheap and readily available ethanolamine as an electron doping agent. Printed p-type bottom-gate SWCNT TFTs can be selectively converted into n-type by deposition of ethanolamine inks on the transistor active region via aerosol jet printing. Resulted n-type TFTs show excellent electrical properties with an on/off ratio of 10(6), effective mobility up to 30 cm(2) V(-1) s(-1), small hysteresis, and small subthreshold swing (90-140 mV dec(-1)), which are superior compared to the original p-type SWCNT devices. The n-type SWCNT TFTs also show good stability in air, and any deterioration of performance due to shelf storage can be fully recovered by a short low-temperature annealing. The easy polarity conversion process allows construction of CMOS circuitry. As an example, CMOS inverters were fabricated using printed p-type and n-type TFTs and exhibited a large noise margin (50 and 103% of 1/2 Vdd = 1 V) and a voltage gain as high as 30 (at Vdd = 1 V). Additionally, the CMOS inverters show full rail-to-rail output voltage swing and low power dissipation (0.1 μW at Vdd = 1 V). The new method paves the way to construct fully functional complex CMOS circuitry by printed TFTs.

  14. Demonstration of Y1Ba2Cu3O(7-delta) and complementary metal-oxide-semiconductor device fabrication on the same sapphire substrate

    NASA Technical Reports Server (NTRS)

    Burns, M. J.; De La Houssaye, P. R.; Russell, S. D.; Garcia, G. A.; Clayton, S. R.; Ruby, W. S.; Lee, L. P.

    1993-01-01

    We report the first fabrication of active semiconductor and high-temperature superconducting devices on the same substrate. Test structures of complementary MOS transistors were fabricated on the same sapphire substrate as test structures of Y1Ba2Cu3O(7-delta) flux-flow transistors, and separately, Y1Ba2Cu3O(7-delta) superconducting quantum interference devices utilizing both biepitaxial and step-edge Josephson junctions. Both semiconductor and superconductor devices were operated at 77 K. The cofabrication of devices using these disparate yet complementary electronic technologies on the same substrate opens the door for the fabrication of true semiconductive/superconductive hybrid integrated circuits capable of exploiting the best features of each of these technologies.

  15. Complementary Metal Oxide Semiconductor-Compatible, High-Mobility, ⟨111⟩-Oriented GaSb Nanowires Enabled by Vapor-Solid-Solid Chemical Vapor Deposition.

    PubMed

    Yang, Zai-Xing; Liu, Lizhe; Yip, SenPo; Li, Dapan; Shen, Lifan; Zhou, Ziyao; Han, Ning; Hung, Tak Fu; Pun, Edwin Yue-Bun; Wu, Xinglong; Song, Aimin; Ho, Johnny C

    2017-04-05

    Using CMOS-compatible Pd catalysts, we demonstrated the formation of high-mobility ⟨111⟩-oriented GaSb nanowires (NWs) via vapor-solid-solid (VSS) growth by surfactant-assisted chemical vapor deposition through a complementary experimental and theoretical approach. In contrast to NWs formed by the conventional vapor-liquid-solid (VLS) mechanism, cylindrical-shaped Pd5Ga4 catalytic seeds were present in our Pd-catalyzed VSS-NWs. As solid catalysts, stoichiometric Pd5Ga4 was found to have the lowest crystal surface energy and thus giving rise to a minimal surface diffusion as well as an optimal in-plane interface orientation at the seed/NW interface for efficient epitaxial NW nucleation. These VSS characteristics led to the growth of slender NWs with diameters down to 26.9 ± 3.5 nm. Over 95% high crystalline quality NWs were grown in ⟨111⟩ orientation for a wide diameter range of between 10 and 70 nm. Back-gated field-effect transistors (FETs) fabricated using the Pd-catalyzed GaSb NWs exhibit a superior peak hole mobility of ∼330 cm(2) V(-1) s(-1), close to the mobility limit for a NW channel diameter of ∼30 nm with a free carrier concentration of ∼10(18) cm(-3). This suggests that the NWs have excellent homogeneity in phase purity, growth orientation, surface morphology and electrical characteristics. Contact printing process was also used to fabricate large-scale assembly of Pd-catalyzed GaSb NW parallel arrays, confirming the potential constructions and applications of these high-performance electronic devices.

  16. Nanoscale Metal Oxide Semiconductors for Gas Sensing

    NASA Technical Reports Server (NTRS)

    Hunter, Gary W.; Evans, Laura; Xu, Jennifer C.; VanderWal, Randy L.; Berger, Gordon M.; Kulis, Michael J.

    2011-01-01

    A report describes the fabrication and testing of nanoscale metal oxide semiconductors (MOSs) for gas and chemical sensing. This document examines the relationship between processing approaches and resulting sensor behavior. This is a core question related to a range of applications of nanotechnology and a number of different synthesis methods are discussed: thermal evaporation- condensation (TEC), controlled oxidation, and electrospinning. Advantages and limitations of each technique are listed, providing a processing overview to developers of nanotechnology- based systems. The results of a significant amount of testing and comparison are also described. A comparison is made between SnO2, ZnO, and TiO2 single-crystal nanowires and SnO2 polycrystalline nanofibers for gas sensing. The TECsynthesized single-crystal nanowires offer uniform crystal surfaces, resistance to sintering, and their synthesis may be done apart from the substrate. The TECproduced nanowire response is very low, even at the operating temperature of 200 C. In contrast, the electrospun polycrystalline nanofiber response is high, suggesting that junction potentials are superior to a continuous surface depletion layer as a transduction mechanism for chemisorption. Using a catalyst deposited upon the surface in the form of nanoparticles yields dramatic gains in sensitivity for both nanostructured, one-dimensional forms. For the nanowire materials, the response magnitude and response rate uniformly increase with increasing operating temperature. Such changes are interpreted in terms of accelerated surface diffusional processes, yielding greater access to chemisorbed oxygen species and faster dissociative chemisorption, respectively. Regardless of operating temperature, sensitivity of the nanofibers is a factor of 10 to 100 greater than that of nanowires with the same catalyst for the same test condition. In summary, nanostructure appears critical to governing the reactivity, as measured by electrical

  17. Integrated photo-responsive metal oxide semiconductor circuit

    NASA Technical Reports Server (NTRS)

    Jhabvala, Murzban D. (Inventor); Dargo, David R. (Inventor); Lyons, John C. (Inventor)

    1987-01-01

    An infrared photoresponsive element (RD) is monolithically integrated into a source follower circuit of a metal oxide semiconductor device by depositing a layer of a lead chalcogenide as a photoresistive element forming an ohmic bridge between two metallization strips serving as electrodes of the circuit. Voltage from the circuit varies in response to illumination of the layer by infrared radiation.

  18. Multilevel metallization method for fabricating a metal oxide semiconductor device

    NASA Technical Reports Server (NTRS)

    Hollis, B. R., Jr.; Feltner, W. R.; Bouldin, D. L.; Routh, D. E. (Inventor)

    1978-01-01

    An improved method is described of constructing a metal oxide semiconductor device having multiple layers of metal deposited by dc magnetron sputtering at low dc voltages and low substrate temperatures. The method provides multilevel interconnections and cross over between individual circuit elements in integrated circuits without significantly reducing the reliability or seriously affecting the yield.

  19. CMOS array design automation techniques. [metal oxide semiconductors

    NASA Technical Reports Server (NTRS)

    Ramondetta, P.; Feller, A.; Noto, R.; Lombardi, T.

    1975-01-01

    A low cost, quick turnaround technique for generating custom metal oxide semiconductor arrays using the standard cell approach was developed, implemented, tested and validated. Basic cell design topology and guidelines are defined based on an extensive analysis that includes circuit, layout, process, array topology and required performance considerations particularly high circuit speed.

  20. Large Lateral Photovoltaic Effect in Metal-(Oxide-) Semiconductor Structures

    PubMed Central

    Yu, Chongqi; Wang, Hui

    2010-01-01

    The lateral photovoltaic effect (LPE) can be used in position-sensitive detectors to detect very small displacements due to its output of lateral photovoltage changing linearly with light spot position. In this review, we will summarize some of our recent works regarding LPE in metal-semiconductor and metal-oxide-semiconductor structures, and give a theoretical model of LPE in these two structures. PMID:22163463

  1. New Performance Indicators of Metal-Oxide-Semiconductor Field-Effect Transistors for High-Frequency Power-Conscious Design

    NASA Astrophysics Data System (ADS)

    Katayama, Kosuke; Fujishima, Minoru

    2012-02-01

    With the progress of complementary metal-oxide-semiconductor (CMOS) process technology, it is possible to apply CMOS devices to millimeter-wave amplifier design. However, the power consumption of the system becomes higher in proportion to its target frequency. Moreover, CMOS devices are biased at a point where the device achieves the highest gain and consumes much power. In order to reduce the power consumption without any compromise, we introduce two types of indicator. One works towards achieving the highest gain with the lowest power consumption. The other works towards achieving the highest linearity with consideration of the power consumption. In this work, we have shown the effectiveness of those indicators by applying measured data of the fabricated metal-oxide-semiconductor field-effect transistors (MOSFETs) to cascade common-source amplifiers.

  2. Bistability in a complementary metal oxide semiconductor inverter circuit.

    PubMed

    Carroll, Thomas L

    2005-09-01

    Radiofrequency signals can disrupt the operation of low frequency circuits. A digital inverter circuit would seem to be immune to such disruption, because its output state usually jumps abruptly between 0 and 5 V. Nevertheless, when driven with a high frequency signal, the inverter can have two coexisting stable states (which are not at 0 and 5 V). Slow switching between these states (by changing the rf signal) will produce a low frequency signal. I demonstrate the bistability in a circuit experiment and in a simple model of the circuit.

  3. Multiparameter admittance spectroscopy for metal-oxide-semiconductor systems

    NASA Astrophysics Data System (ADS)

    Piscator, J.; Raeissi, B.; Engström, O.

    2009-09-01

    Admittance spectroscopy is extended for measuring capacitance and conductance on metal-oxide-semiconductor (MOS) structures as a function of gate voltage, frequency, and temperature. An automatic setup has been designed for collecting data along these dimensions in one measurement cycle. The theory for admittance spectroscopy has been developed by starting from basic charge carrier statistics. Using numerical integration of energy dependent parameters instead of the commonly used analytical solution, conductance dispersion curves are obtained which do not need to be adjusted by assuming lateral surface potential variations at the oxide-semiconductor interface. Also, we find that interface state densities extracted by using traditional methods are four times lower than those obtained by using our theory. Experimental data presented in three-dimensional plots are compared with theoretical calculations, revealing the possibilities and limitations of the conductance method.

  4. NO2 sensitive Au gate metal-oxide-semiconductor capacitors

    NASA Astrophysics Data System (ADS)

    Filippini, D.; Aragón, R.; Weimar, U.

    2001-08-01

    Au gate metal-oxide-semiconductor capacitors are sensitive to NO2 in air up to 200 ppm, depending on operating temperature (100 °C to 200 °C), gate thickness (50 to 900 nm), and morphology. In the absence of catalytic properties or lattice diffusivity, a model invoking molecular surface adsorption and grain boundary diffusion is proposed, which quantitatively describes the transient and steady state response of the devices. Sensitivity is given by the arrival of the diffusing species to the gate-dielectric interface, where capacitive coupling of the adsorbed molecules induces work function changes, which shift the flat band voltage positively, opposite that observed for H2 with Pd gates, consistently with an oxidizing, rather than reducing, character.

  5. Waveguide biosensor with integrated detector array for tuberculosis testing

    NASA Astrophysics Data System (ADS)

    Yan, Rongjin; Lynn, N. Scott; Kingry, Luke C.; Yi, Zhangjing; Slayden, Richard A.; Dandy, David S.; Lear, Kevin L.

    2011-01-01

    A label-free immunoassay using a local evanescent array coupled (LEAC) biosensor is reported. Complementary metal oxide semiconductor chips with integrated photoconductor arrays are used to detect an antibody to a M. tuberculosis protein antigen, HspX. The metrology limits of the LEAC sensor using dc and ac measurement systems correspond to average film thicknesses of 28 and 14 pm, respectively. Limits of detection are 87 and 108 pm, respectively, for mouse immunoglobulin G antibody patterning and antigen detection.

  6. Effect of edge roughness on electronic transport in graphene nanoribbon channel metal-oxide-semiconductor field-effect transistors

    NASA Astrophysics Data System (ADS)

    Basu, D.; Gilbert, M. J.; Register, L. F.; Banerjee, S. K.; MacDonald, A. H.

    2008-01-01

    Results of quantum mechanical simulations of the influence of edge disorder on transport in graphene nanoribbon metal-oxide-semiconductor field-effect transistors (MOSFETs) are reported. The addition of edge disorder significantly reduces ON-state currents and increases OFF-state currents, and introduces wide variability across devices. These effects decrease as ribbon widths increase and as edges become smoother. However, the band gap decreases with increasing width, thereby increasing the band-to-band tunneling mediated subthreshold leakage current even with perfect nanoribbons. These results suggest that without atomically precise edge control during fabrication, MOSFET performance gains through use of graphene will be difficult to achieve in complementary MOS applications.

  7. Plasmonic nanostructured metal-oxide-semiconductor reflection modulators.

    PubMed

    Olivieri, Anthony; Chen, Chengkun; Hassan, Sa'ad; Lisicka-Skrzek, Ewa; Tait, R Niall; Berini, Pierre

    2015-04-08

    We propose a plasmonic surface that produces an electrically controlled reflectance as a high-speed intensity modulator. The device is conceived as a metal-oxide-semiconductor capacitor on silicon with its metal structured as a thin patch bearing a contiguous nanoscale grating. The metal structure serves multiple functions as a driving electrode and as a grating coupler for perpendicularly incident p-polarized light to surface plasmons supported by the patch. Modulation is produced by charging and discharging the capacitor and exploiting the carrier refraction effect in silicon along with the high sensitivity of strongly confined surface plasmons to index perturbations. The area of the modulator is set by the area of the incident beam, leading to a very compact device for a strongly focused beam (∼2.5 μm in diameter). Theoretically, the modulator can operate over a broad electrical bandwidth (tens of gigahertz) with a modulation depth of 3 to 6%, a loss of 3 to 4 dB, and an optical bandwidth of about 50 nm. About 1000 modulators can be integrated over a 50 mm(2) area producing an aggregate electro-optic modulation rate in excess of 1 Tb/s. We demonstrate experimentally modulators operating at telecommunications wavelengths, fabricated as nanostructured Au/HfO2/p-Si capacitors. The modulators break conceptually from waveguide-based devices and belong to the same class of devices as surface photodetectors and vertical cavity surface-emitting lasers.

  8. A comparison of imaging methods for use in an array biosensor.

    PubMed

    Golden, Joel P; Ligler, Frances S

    2002-09-01

    An array biosensor has been developed which uses an actively-cooled, charge-coupled device (CCD) imager. In an effort to save money and space, a complementary metal-oxide semiconductor (CMOS) camera and photodiode were tested as replacements for the cooled CCD imager. Different concentrations of CY5 fluorescent dye in glycerol were imaged using the three different detection systems with the same imaging optics. Signal discrimination above noise was compared for each of the three systems.

  9. A comparison of imaging methods for use in an array biosensor

    NASA Technical Reports Server (NTRS)

    Golden, Joel P.; Ligler, Frances S.

    2002-01-01

    An array biosensor has been developed which uses an actively-cooled, charge-coupled device (CCD) imager. In an effort to save money and space, a complementary metal-oxide semiconductor (CMOS) camera and photodiode were tested as replacements for the cooled CCD imager. Different concentrations of CY5 fluorescent dye in glycerol were imaged using the three different detection systems with the same imaging optics. Signal discrimination above noise was compared for each of the three systems.

  10. A comparison of imaging methods for use in an array biosensor

    NASA Technical Reports Server (NTRS)

    Golden, Joel P.; Ligler, Frances S.

    2002-01-01

    An array biosensor has been developed which uses an actively-cooled, charge-coupled device (CCD) imager. In an effort to save money and space, a complementary metal-oxide semiconductor (CMOS) camera and photodiode were tested as replacements for the cooled CCD imager. Different concentrations of CY5 fluorescent dye in glycerol were imaged using the three different detection systems with the same imaging optics. Signal discrimination above noise was compared for each of the three systems.

  11. Metal-oxide-semiconductor plasmonic nanorod lasers (Conference Presentation)

    NASA Astrophysics Data System (ADS)

    Gwo, Shangjr

    2017-02-01

    Scaling down semiconductor lasers in all three dimensions hold the key to the developments of compact, low-threshold, and ultrafast coherent light sources, as well as photonic integrated circuits. However, the minimum size of conventional semiconductor lasers utilizing dielectric cavity resonators (photonic cavities) is constrained to the diffraction limit. In the past few years, it has been experimentally demonstrated that the use of plasmonic cavities based on metal-oxide-semiconductor (MOS) structures can break this limit. In this presentation, I will report on the recent progress of plasmonic nanolasers using MOS structures. In particular, by using alloy-composition-varied indium gallium nitride/gallium nitride (InGaN/GaN) core-shell nanorods as the nanolaser gain media in the full visible spectrum, we are able to demonstrate full-color nanolasers that can be operated with ultralow CW lasing thresholds and single lasing modes. Full-color lasing in these subdiffraction plasmonic cavities is achieved via a unique autotuning mechanism based on a property of weak size dependence inherent in plasmonic nanolasers. As for choice of metals in the MOS structures, epitaxial Ag films and giant colloidal Ag crystals have been shown by us to be the superior constituent materials for plasmonic cavities due to their low plasmonic losses in the visible spectral range. Recently, we have also succeeded in developing InGaN/GaN nanorod array plasmonic lasers based on a metal (Au)-all-around MOS structure, which can be fabricated easily on a wafer scale. I will present the latest results in these developments.

  12. A biristor based on a floating-body silicon nanowire for biosensor applications

    NASA Astrophysics Data System (ADS)

    Moon, Dong-Il; Peycelon, Maxime; Kim, Jee-Yeon; Ahn, Jae-Hyuk; Jung Park, Tae; Choi, Yang-Kyu

    2013-01-01

    A silicon nanowire (SiNW), which has been named "biristor" (bistable resistor), is demonstrated for biosensor applications. The SiNW is composed of three segments: n-type (source), p-type (floating-body), and n-type (drain). Its structure is based on a metal-oxide-semiconductor field-effect transistor without a gate. The biristor uses the uncovered floating-body as a sensing site, and it is triggered by impact ionization. A charge effect arising from biomolecules influences the triggering voltage, which is a sensing metric and changes the resistance of the SiNW. The biristor can be a promising candidate for biosensors in terms of complementary metal-oxide-semiconductor compatibility, low-cost, and compact density.

  13. Challenges of Electrical Measurements of Advanced Gate Dielectrics in Metal-Oxide-Semiconductor Devices

    NASA Astrophysics Data System (ADS)

    Vogel, Eric M.; Brown, George A.

    2003-09-01

    Experimental measurements and simulations are used to provide an overview of key issues with the electrical characterization of metal-oxide-semiconductor (MOS) devices with ultra-thin oxide and alternate gate dielectrics. Experimental issues associated with the most common electrical characterization method, capacitance-voltage (C-V), are first described. Issues associated with equivalent oxide thickness extraction and comparison, interface state measurement, extrinsic defects, and defect generation are then overviewed.

  14. High temperature behavior of multi-region direct current current-voltage spectroscopy and relationship with shallow-trench-isolation-based high-voltage laterally diffused metal-oxide-semiconductor field-effect-transistors reliability

    NASA Astrophysics Data System (ADS)

    He, Yandong; Zhang, Ganggang; Zhang, Xing

    2014-01-01

    With the process compatibility with the mainstream standard complementary metal-oxide-semiconductor (CMOS), shallow trench isolation (STI) based laterally diffused metal-oxide-semiconductor (LDMOS) devices have become popular for its better tradeoff between breakdown voltage and performance, especially for smart power applications. A multi-region direct current current-voltage (MR-DCIV) technique with spectroscopic features was demonstrated to map the interface state generation in the channel, accumulation and STI drift regions. High temperature behavior of MR-DCIV spectroscopy was analyzed and a physical model was verified. Degradation of STI-based LDMOS transistors under high temperature reverse bias (HTRB) stress is experimentally studied by MR-DCIV spectroscopy. The impact of interface state location on device electrical characteristics was investigated. Our results show that the major contribution to HTRB degradation, in term of the on-resistance degradation, was attributed to interface state generation under STI drift region.

  15. CMOS Electrochemical Instrumentation for Biosensor Microsystems: A Review

    PubMed Central

    Li, Haitao; Liu, Xiaowen; Li, Lin; Mu, Xiaoyi; Genov, Roman; Mason, Andrew J.

    2016-01-01

    Modern biosensors play a critical role in healthcare and have a quickly growing commercial market. Compared to traditional optical-based sensing, electrochemical biosensors are attractive due to superior performance in response time, cost, complexity and potential for miniaturization. To address the shortcomings of traditional benchtop electrochemical instruments, in recent years, many complementary metal oxide semiconductor (CMOS) instrumentation circuits have been reported for electrochemical biosensors. This paper provides a review and analysis of CMOS electrochemical instrumentation circuits. First, important concepts in electrochemical sensing are presented from an instrumentation point of view. Then, electrochemical instrumentation circuits are organized into functional classes, and reported CMOS circuits are reviewed and analyzed to illuminate design options and performance tradeoffs. Finally, recent trends and challenges toward on-CMOS sensor integration that could enable highly miniaturized electrochemical biosensor microsystems are discussed. The information in the paper can guide next generation electrochemical sensor design. PMID:28042860

  16. CMOS Electrochemical Instrumentation for Biosensor Microsystems: A Review.

    PubMed

    Li, Haitao; Liu, Xiaowen; Li, Lin; Mu, Xiaoyi; Genov, Roman; Mason, Andrew J

    2016-12-31

    Modern biosensors play a critical role in healthcare and have a quickly growing commercial market. Compared to traditional optical-based sensing, electrochemical biosensors are attractive due to superior performance in response time, cost, complexity and potential for miniaturization. To address the shortcomings of traditional benchtop electrochemical instruments, in recent years, many complementary metal oxide semiconductor (CMOS) instrumentation circuits have been reported for electrochemical biosensors. This paper provides a review and analysis of CMOS electrochemical instrumentation circuits. First, important concepts in electrochemical sensing are presented from an instrumentation point of view. Then, electrochemical instrumentation circuits are organized into functional classes, and reported CMOS circuits are reviewed and analyzed to illuminate design options and performance tradeoffs. Finally, recent trends and challenges toward on-CMOS sensor integration that could enable highly miniaturized electrochemical biosensor microsystems are discussed. The information in the paper can guide next generation electrochemical sensor design.

  17. Spin dependent charge pumping in SiC metal-oxide-semiconductor field-effect-transistors

    NASA Astrophysics Data System (ADS)

    Bittel, B. C.; Lenahan, P. M.; Ryan, J. T.; Fronheiser, J.; Lelis, A. J.

    2011-08-01

    We demonstrate a very powerful electrically detected magnetic resonance (EDMR) technique, spin dependent charge pumping (SDCP) and apply it to 4H SiC metal-oxide-semiconductor field-effect-transistors. SDCP combines a widely used electrical characterization tool with the most powerful analytical technique for providing atomic scale structure of point defects in electronic materials. SDCP offers a large improvement in sensitivity over the previously established EDMR technique called spin dependent recombination, offering higher sensitivity and accessing a wider energy range within the bandgap.

  18. Anomalous quantum efficiency for photoconduction and its power dependence in metal oxide semiconductor nanowires.

    PubMed

    Chen, R S; Wang, W C; Lu, M L; Chen, Y F; Lin, H C; Chen, K H; Chen, L C

    2013-08-07

    The quantum efficiency and carrier lifetime that decide the photoconduction (PC) efficiencies in the metal oxide semiconductor nanowires (NWs) have been investigated. The experimental result surprisingly shows that the SnO2, TiO2, WO3, and ZnO NWs reveal extraordinary quantum efficiencies in common, which are over one to three orders of magnitude lower than the theoretical expectation. The surface depletion region (SDR)-controlled photoconductivity is proposed to explain the anomalous quantum efficiency and its power dependence. The inherent difference between the metal oxide nanostructures such as carrier lifetime, carrier concentration, and dielectric constant leading to the distinct PC performance and behavior are also discussed.

  19. Metal-oxide-semiconductor field effect transistor humidity sensor using surface conductance

    NASA Astrophysics Data System (ADS)

    Song, Seok-Ho; Yang, Hyun-Ho; Han, Chang-Hoon; Ko, Seung-Deok; Lee, Seok-Hee; Yoon, Jun-Bo

    2012-03-01

    This letter presents a metal-oxide-semiconductor field effect transistor based humidity sensor which does not use any specific materials to sense the relative humidity. We simply make use of the low pressure chemical vapor deposited (LPCVD) silicon dioxide's surface conductance change. When the gate is biased and then floated, the electrical charge in the gate is dissipated through the LPCVD silicon dioxide's surface to the surrounding ground with a time constant depending on the surface conductance which, in turn, varies with humidity. With this method, extremely high sensitivity was achieved—the charge dissipation speed increased thousand times as the relative humidity increased.

  20. Surface Preparation and Deposited Gate Oxides for Gallium Nitride Based Metal Oxide Semiconductor Devices

    PubMed Central

    Long, Rathnait D.; McIntyre, Paul C.

    2012-01-01

    The literature on polar Gallium Nitride (GaN) surfaces, surface treatments and gate dielectrics relevant to metal oxide semiconductor devices is reviewed. The significance of the GaN growth technique and growth parameters on the properties of GaN epilayers, the ability to modify GaN surface properties using in situ and ex situ processes and progress on the understanding and performance of GaN metal oxide semiconductor (MOS) devices are presented and discussed. Although a reasonably consistent picture is emerging from focused studies on issues covered in each of these topics, future research can achieve a better understanding of the critical oxide-semiconductor interface by probing the connections between these topics. The challenges in analyzing defect concentrations and energies in GaN MOS gate stacks are discussed. Promising gate dielectric deposition techniques such as atomic layer deposition, which is already accepted by the semiconductor industry for silicon CMOS device fabrication, coupled with more advanced physical and electrical characterization methods will likely accelerate the pace of learning required to develop future GaN-based MOS technology.

  1. Anomalous quantum efficiency for photoconduction and its power dependence in metal oxide semiconductor nanowires

    NASA Astrophysics Data System (ADS)

    Chen, R. S.; Wang, W. C.; Lu, M. L.; Chen, Y. F.; Lin, H. C.; Chen, K. H.; Chen, L. C.

    2013-07-01

    The quantum efficiency and carrier lifetime that decide the photoconduction (PC) efficiencies in the metal oxide semiconductor nanowires (NWs) have been investigated. The experimental result surprisingly shows that the SnO2, TiO2, WO3, and ZnO NWs reveal extraordinary quantum efficiencies in common, which are over one to three orders of magnitude lower than the theoretical expectation. The surface depletion region (SDR)-controlled photoconductivity is proposed to explain the anomalous quantum efficiency and its power dependence. The inherent difference between the metal oxide nanostructures such as carrier lifetime, carrier concentration, and dielectric constant leading to the distinct PC performance and behavior are also discussed.The quantum efficiency and carrier lifetime that decide the photoconduction (PC) efficiencies in the metal oxide semiconductor nanowires (NWs) have been investigated. The experimental result surprisingly shows that the SnO2, TiO2, WO3, and ZnO NWs reveal extraordinary quantum efficiencies in common, which are over one to three orders of magnitude lower than the theoretical expectation. The surface depletion region (SDR)-controlled photoconductivity is proposed to explain the anomalous quantum efficiency and its power dependence. The inherent difference between the metal oxide nanostructures such as carrier lifetime, carrier concentration, and dielectric constant leading to the distinct PC performance and behavior are also discussed. Electronic supplementary information (ESI) available. See DOI: 10.1039/c3nr01635h

  2. Fabrication and characterization of spiral interdigitated electrodes based biosensor for salivary glucose detection

    NASA Astrophysics Data System (ADS)

    Adelyn, P. Y. P.; Hashim, U.; Arshad, M. K. Md; Voon, C. H.; Liu, Wei-Wen; Kahar, S. M.; Huda, A. R. N.; Lee, H. Cheun

    2017-03-01

    This work introduces the non-invasive glucose monitoring technique by using the Complementary Metal Oxide Semiconductor (CMOS) technologically fabricated spiral Interdigitated Electrodes (IDE) based biosensor. Scanning Electron Microscopy (SEM) image explores the morphology of spiral IDE while Energy Dispersive X-Ray (EDX) determines the elements induced in spiral IDE. Oral saliva of two patients are collected and tested on the spiral IDE sensor with electrical characterization as glucose detection results. However, both patients exhibit their glucose level characteristics inconsistently. Therefore, this work could be extended and enhanced by adding Glutaraldehyde in between 3-Aminoproply)triethoxysilane (APTES) modified and glucose oxidase (GOD) enzyme immobilized layer with FTIR validation for bonding attachment.

  3. Influence of extrinsic factors on accuracy of mobility extraction in graphene metal-oxide-semiconductor field effect transistors

    NASA Astrophysics Data System (ADS)

    Gon Lee, Young; Ji Kim, Yun; Goo Kang, Chang; Cho, Chunhum; Lee, Sangchul; Jun Hwang, Hyeon; Jung, Ukjin; Hun Lee, Byoung

    2013-03-01

    Graphene has attracted attention because of its extraordinarily high mobility. However, procedures to extract mobility from graphene metal-oxide semiconductor transistors have not been systematically established because the accuracy of mobility value is affected by many extrinsic parameters. In this work, the influence of extrinsic parameters, such as contact resistance, transient charging effect, measurement temperature, and ambient on mobility are examined in order to provide a protocol capable of accurately assessing the mobility of graphene metal-oxide-semiconductor field effect transistors. Using a well controlled test protocol, the mobility of graphene is found to be temperature independent up to 450 K.

  4. CMOS biosensors for in vitro diagnosis - transducing mechanisms and applications.

    PubMed

    Lei, Ka-Meng; Mak, Pui-In; Law, Man-Kay; Martins, Rui P

    2016-09-21

    Complementary metal oxide semiconductor (CMOS) technology enables low-cost and large-scale integration of transistors and physical sensing materials on tiny chips (e.g., <1 cm(2)), seamlessly combining the two key functions of biosensors: transducing and signal processing. Recent CMOS biosensors unified different transducing mechanisms (impedance, fluorescence, and nuclear spin) and readout electronics have demonstrated competitive sensitivity for in vitro diagnosis, such as detection of DNA (down to 10 aM), protein (down to 10 fM), or bacteria/cells (single cell). Herein, we detail the recent advances in CMOS biosensors, centering on their key principles, requisites, and applications. Together, these may contribute to the advancement of our healthcare system, which should be decentralized by broadly utilizing point-of-care diagnostic tools.

  5. High and low threshold P-channel metal oxide semiconductor process and description of microelectronics facility

    NASA Technical Reports Server (NTRS)

    Bouldin, D. L.; Feltner, W. R.; Hollis, B. R.; Routh, D. E.

    1976-01-01

    The fabrication techniques and detail procedures for creating P-channel Metal-Oxide-Semiconductor (P-MOS) integrated circuits at George C. Marshall Space Flight Center (MSFC) are described. Examples of P-MOS integrated circuits fabricated at MSFC together with functional descriptions of each are given. Typical electrical characteristics of high and low threshold P-MOS discrete devices under given conditions are provided. A general description of MSFC design, mask making, packaging, and testing procedures is included. The capabilities described in this report are being utilized in: (1) research and development of new technology, (2) education of individuals in the various disciplines and technologies of the field of microelectronics, and (3) fabrication of many types of specially designed integrated circuits which are not commercially feasible in small quantities for in-house research and development programs.

  6. Metal-oxide-semiconductor capacitors on GaAs with germanium nitride passivation layer

    NASA Astrophysics Data System (ADS)

    Zhao, Han; Kim, Hyoung-Sub; Zhu, Feng; Zhang, Manhong; OK, Injo; Park, Sung Il; Yum, Jung Hwan; Lee, Jack C.

    2007-10-01

    We present gallium arsenide (GaAs) metal-oxide-semiconductor capacitors (MOSCAPs) with a thin HfO2 gate dielectric and a thin germanium nitride (GexNy) interfacial passivation layer (IPL). TaN /HfO2/GexNy/GaAs MOSCAPs show a low interface state density and a thin equivalent oxide thickness (1.6nm). Compared to GaAs MOSCAPs with germanium (Ge) IPL, the GexNy IPL has a smaller slow trap density, which is confirmed by improved C-V characteristics without humps near the flatband voltage. The lower rate of flatband voltage shift and gate leakage decreasing under constant gate voltage stress were also demonstrated in GaAs MOSCAPs with GexNy IPL than the Ge IPL.

  7. Field-induced activation of metal oxide semiconductor for low temperature flexible transparent electronic device applications

    NASA Astrophysics Data System (ADS)

    Pudasaini, Pushpa Raj; Noh, Joo Hyon; Wong, Anthony; Haglund, Amada; Ward, Thomas Zac; Mandrus, David; Rack, Philip

    Amorphous metal-oxide semiconductors have been extensively studied as an active channel material in thin film transistors due to their high carrier mobility, and excellent large-area uniformity. Here, we report the athermal activation of amorphous indium gallium zinc oxide semiconductor channels by an electric field-induced oxygen migration via gating through an ionic liquid. Using field-induced activation, a transparent flexible thin film transistor is demonstrated on a polyamide substrate with transistor characteristics having a current ON-OFF ratio exceeding 108, and saturation field effect mobility of 8.32 cm2/(V.s) without a post-deposition thermal treatment. This study demonstrates the potential of field-induced activation as an athermal alternative to traditional post-deposition thermal annealing for metal oxide electronic devices suitable for transparent and flexible polymer substrates. Materials Science and Technology Division, ORBL, Oak Ridge, TN 37831, USA.

  8. Photoconduction efficiencies of metal oxide semiconductor nanowires: The material's inherent properties

    NASA Astrophysics Data System (ADS)

    Chen, R. S.; Wang, W. C.; Chan, C. H.; Lu, M. L.; Chen, Y. F.; Lin, H. C.; Chen, K. H.; Chen, L. C.

    2013-11-01

    The photoconduction (PC) efficiencies of various single-crystalline metal oxide semiconductor nanowires (NWs) have been investigated and compared based on the materials' inherent properties. The defined PC efficiency (normalized gain) of SnO2 NWs is over one to five orders of magnitude higher than that of its highly efficient counterparts such as ZnO, TiO2, WO3, and GaN. The inherent property of the material allowed the photoconductive gain of an SnO2 single-NW photodetector to easily reach 8 × 108 at a low bias of 3.0 V and a low light intensity of 0.05 Wm-2, which is the optimal reported value so far for the single-NW photodetectors. The probable physical origins, such as charged surface state density and surface band bending, that caused the differences in PC efficiencies and carrier lifetimes are also discussed.

  9. Effect of Temperature on GaGdO/GaN Metal Oxide Semiconductor Field Effect Transistors

    SciTech Connect

    Abernathy, C.R.; Baca, A.; Chu, S.N.G.; Hong, M.; Lothian, J.R.; Marcus, M.A.; Pearton, S.J.; Ren, F.; Schurman, M.J.

    1998-10-14

    GaGdO was deposited on GaN for use as a gate dielectric in order to fabricate a depletion metal oxide semiconductor field effect transistor (MOSFET). This is the fmt demonstration of such a device in the III-Nitride system. Analysis of the effect of temperature on the device shows that gate leakage is significantly reduced at elevated temperature relative to a conventional metal semiconductor field effeet transistor (MESFET) fabricated on the same GaN layer. MOSFET device operation in fact improved upon heating to 400 C. Modeling of the effeet of temperature on contact resistance suggests that the improvement is due to a reduction in the parasitic resistances present in the device.

  10. Coaxial metal-oxide-semiconductor (MOS) Au/Ga2O3/GaN nanowires.

    PubMed

    Hsieh, Chin-Hua; Chang, Mu-Tung; Chien, Yu-Jen; Chou, Li-Jen; Chen, Lih-Juann; Chen, Chii-Dong

    2008-10-01

    Coaxial metal-oxide-semiconductor (MOS) Au-Ga2O3-GaN heterostructure nanowires were successfully fabricated by an in situ two-step process. The Au-Ga2O3 core-shell nanowires were first synthesized by the reaction of Ga powder, a mediated Au thin layer, and a SiO2 substrate at 800 degrees C. Subsequently, these core-shell nanowires were nitridized in ambient ammonia to form a GaN coating layer at 600 degrees C. The GaN shell is a single crystal, an atomic flat interface between the oxide and semiconductor that ensures that the high quality of the MOS device is achieved. These novel 1D nitride-based MOS nanowires may have promise as building blocks to the future nitride-based vertical nanodevices.

  11. Optimal design of an electret microphone metal-oxide-semiconductor field-effect transistor preamplifier.

    PubMed

    van der Donk, A G; Bergveld, P

    1992-04-01

    A theoretical noise analysis of the combination of a capacitive microphone and a preamplifier containing a metal-oxide-semiconductor field-effect transistor (MOSFET) and a high-value resistive bias element is given. It is found that the output signal-to-noise ratio for a source follower and for a common-source circuit is almost the same. It is also shown that the output noise can be reduced by making the microphone capacitance as well as the bias resistor as large as possible, and furthermore by keeping the parasitic gate capacitances as low as possible and finally by using an optimum value for the gate area of the MOSFET. The main noise source is the thermal noise of the gate leakage resistance of the MOSFET. It is also shown that short-channel MOSFETs produce more thermal channel noise than longer channel devices.

  12. A novel lateral diffused metal oxide semiconductor (LDMOS) by attracting the electric field Lines

    NASA Astrophysics Data System (ADS)

    Orouji, Ali A.; Hanaei, Mahsa

    2015-11-01

    In this paper, a novel silicon on insulator (SOI) lateral diffused metal oxide semiconductor (LDMOS) transistor with high voltage and high frequency performance is presented. In this work we try to reduce the electric field crowding in the drift region. The proposed structure consists of a metal in the buried oxide and also connected to the source. The inserted metal attracts the electric field lines in the buried oxide. It causes 67% improvement in the breakdown voltage in comparison with a conventional SOI-LDMOS (C-LDMOS). Our simulations with two dimensional ATLAS simulator show that the gate-drain capacitance improves in the proposed structure. The unilateral power gain also enhances. So, the proposed structure is suitable for high voltage and high frequency applications.

  13. Modeling of n-InAs metal oxide semiconductor capacitors with high-κ gate dielectric

    SciTech Connect

    Babadi, A. S. Lind, E.; Wernersson, L. E.

    2014-12-07

    A qualitative analysis on capacitance-voltage and conductance data for high-κ/InAs capacitors is presented. Our measured data were evaluated with a full equivalent circuit model, including both majority and minority carriers, as well as interface and border traps, formulated for narrow band gap metal-oxide-semiconductor capacitors. By careful determination of interface trap densities, distribution of border traps across the oxide thickness, and taking into account the bulk semiconductor response, it is shown that the trap response has a strong effect on the measured capacitances. Due to the narrow bandgap of InAs, there can be a large surface concentration of electrons and holes even in depletion, so a full charge treatment is necessary.

  14. Charge sensed Pauli blockade in a metal-oxide-semiconductor lateral double quantum dot.

    PubMed

    Nguyen, Khoi T; Lilly, Michael P; Nielsen, Erik; Bishop, Nathan; Rahman, Rajib; Young, Ralph; Wendt, Joel; Dominguez, Jason; Pluym, Tammy; Stevens, Jeffery; Lu, Tzu-Ming; Muller, Richard; Carroll, Malcolm S

    2013-01-01

    We report Pauli blockade in a multielectron silicon metal-oxide-semiconductor double quantum dot with an integrated charge sensor. The current is rectified up to a blockade energy of 0.18 ± 0.03 meV. The blockade energy is analogous to singlet-triplet splitting in a two electron double quantum dot. Built-in imbalances of tunnel rates in the MOS DQD obfuscate some edges of the bias triangles. A method to extract the bias triangles is described, and a numeric rate-equation simulation is used to understand the effect of tunneling imbalances and finite temperature on charge stability (honeycomb) diagram, in particular the identification of missing and shifting edges. A bound on relaxation time of the triplet-like state is also obtained from this measurement.

  15. Impedance analysis of Al2O3/H-terminated diamond metal-oxide-semiconductor structures

    NASA Astrophysics Data System (ADS)

    Liao, Meiyong; Liu, Jiangwei; Sang, Liwen; Coathup, David; Li, Jiangling; Imura, Masataka; Koide, Yasuo; Ye, Haitao

    2015-02-01

    Impedance spectroscopy (IS) analysis is carried out to investigate the electrical properties of the metal-oxide-semiconductor (MOS) structure fabricated on hydrogen-terminated single crystal diamond. The low-temperature atomic layer deposition Al2O3 is employed as the insulator in the MOS structure. By numerically analysing the impedance of the MOS structure at various biases, the equivalent circuit of the diamond MOS structure is derived, which is composed of two parallel capacitive and resistance pairs, in series connection with both resistance and inductance. The two capacitive components are resulted from the insulator, the hydrogenated-diamond surface, and their interface. The physical parameters such as the insulator capacitance are obtained, circumventing the series resistance and inductance effect. By comparing the IS and capacitance-voltage measurements, the frequency dispersion of the capacitance-voltage characteristic is discussed.

  16. Gate tunneling current and quantum capacitance in metal-oxide-semiconductor devices with graphene gate electrodes

    NASA Astrophysics Data System (ADS)

    An, Yanbin; Shekhawat, Aniruddh; Behnam, Ashkan; Pop, Eric; Ural, Ant

    2016-11-01

    Metal-oxide-semiconductor (MOS) devices with graphene as the metal gate electrode, silicon dioxide with thicknesses ranging from 5 to 20 nm as the dielectric, and p-type silicon as the semiconductor are fabricated and characterized. It is found that Fowler-Nordheim (F-N) tunneling dominates the gate tunneling current in these devices for oxide thicknesses of 10 nm and larger, whereas for devices with 5 nm oxide, direct tunneling starts to play a role in determining the total gate current. Furthermore, the temperature dependences of the F-N tunneling current for the 10 nm devices are characterized in the temperature range 77-300 K. The F-N coefficients and the effective tunneling barrier height are extracted as a function of temperature. It is found that the effective barrier height decreases with increasing temperature, which is in agreement with the results previously reported for conventional MOS devices with polysilicon or metal gate electrodes. In addition, high frequency capacitance-voltage measurements of these MOS devices are performed, which depict a local capacitance minimum under accumulation for thin oxides. By analyzing the data using numerical calculations based on the modified density of states of graphene in the presence of charged impurities, it is shown that this local minimum is due to the contribution of the quantum capacitance of graphene. Finally, the workfunction of the graphene gate electrode is extracted by determining the flat-band voltage as a function of oxide thickness. These results show that graphene is a promising candidate as the gate electrode in metal-oxide-semiconductor devices.

  17. Speed-Up Techniques for Complementary Metal Oxide Semiconductor Very Large Scale Integration.

    DTIC Science & Technology

    1984-12-14

    low density) circuits. As the size of a circuit increases due to its complexity , the density of the chip per given unit area increases. Since...requirement for complex timing schemes and reportedly taking advantage of the inherent speed of the CMOS gates. Specific application of their domino circuit...elaborate circuit was used to demonstrate the applic- ations of precharging techniques to elements within a more complex circuit. The applications

  18. Analysis of the Capability to Effectively Design Complementary Metal Oxide Semiconductor Integrated Circuits.

    DTIC Science & Technology

    1984-12-01

    that were designed and completely tested by following this "flowchart". Also designed was an ar ithmetic logic unit as a more complex test of the CMOS...speed and design complexity to the same type of circuit implemented ii NM S (4:480) Currently, CMOS technology is being applied to microprocessors...are latch-up improvements, speed enhancements, design complexity improvements as compared to NMOS and CMOS/SOS, and current advancements in CMOS/SOS at

  19. Low Temperature Processed Complementary Metal Oxide Semiconductor (CMOS) Device by Oxidation Effect from Capping Layer

    PubMed Central

    Wang, Zhenwei; Al-Jawhari, Hala A.; Nayak, Pradipta K.; Caraveo-Frescas, J. A.; Wei, Nini; Hedhili, M. N.; Alshareef, H. N.

    2015-01-01

    In this report, both p- and n-type tin oxide thin-film transistors (TFTs) were simultaneously achieved using single-step deposition of the tin oxide channel layer. The tuning of charge carrier polarity in the tin oxide channel is achieved by selectively depositing a copper oxide capping layer on top of tin oxide, which serves as an oxygen source, providing additional oxygen to form an n-type tin dioxide phase. The oxidation process can be realized by annealing at temperature as low as 190°C in air, which is significantly lower than the temperature generally required to form tin dioxide. Based on this approach, CMOS inverters based entirely on tin oxide TFTs were fabricated. Our method provides a solution to lower the process temperature for tin dioxide phase, which facilitates the application of this transparent oxide semiconductor in emerging electronic devices field. PMID:25892711

  20. One-micrometer, radiation-hardened complementary metal oxide semiconductor for cryogenic analog applications

    NASA Astrophysics Data System (ADS)

    Groves, Imelda; Brown, George; Pollack, G.; Green, K.; Dawson, L.; D'Souza, Arvind; Lin, C.; Song, M.; Hwang, C.; Woo, Jason C.; Macwilliams, Kenneth P.

    1994-06-01

    Results are presented of a process-development effort to achieve a 1-Mrad silicon (Si) radiation-hardening capability at temperatures down to 40 K, using Texas Instruments high volume, 1-micrometer commercial process. The one-micrometer process was characterized at 77 K and 40 K: radiation effects on the baseline SiO(subscript 2) gate dielectric and N-channel field effect transistor edges were observed, as were freeze-out and hot-carrier effects of the lightly doped drain implants. These freeze-out phenomena were confirmed, using SUPREM, MINIMOS, and MEDICI. The simulated data compared favorably with measured results. Simulations were run, using various implant doses and profiles to eliminate the freeze-out and hot-carrier effects in the new process. Devices having these simulated profiles were processed, and the results are presented.

  1. Note: Complementary metal-oxide-semiconductor high voltage pulse generation circuits

    NASA Astrophysics Data System (ADS)

    Sun, Jiwei; Wang, Pingshan

    2013-10-01

    We present two types of on-chip pulse generation circuits. The first is based on CMOS pulse-forming-lines (PFLs). It includes a four-stage charge pump, a four-stacked-MOSFET switch and a 5 mm long PFL. The circuit is implemented in a 0.13 μm CMOS process. Pulses of ˜1.8 V amplitude with ˜135 ps duration on a 50 Ω load are obtained. The obtained voltage is higher than 1.6 V, the rated operating voltage of the process. The second is a high-voltage Marx generator which also uses stacked MOSFETs as high voltage switches. The output voltage is 11.68 V, which is higher than the highest breakdown voltage (˜10 V) of the CMOS process. These results significantly extend high-voltage pulse generation capabilities of CMOS technologies.

  2. Metal oxide-based monolithic complementary metal oxide semiconductor gas sensor microsystem.

    PubMed

    Graf, Markus; Barrettino, Diego; Taschini, Stefano; Hagleitner, Christoph; Hierlemann, Andreas; Baltes, Henry

    2004-08-01

    A fully integrated gas sensor microsystem is presented, which comprises for the first time a micro hot plate as well as advanced analog and digital circuitry on a single chip. The micro hot plate is coated with a nanocrystalline SnO2 thick film. The sensor chip is produced in an industrial 0.8-microm CMOS process with subsequent micromachining steps. A novel circular micro hot plate, which is 500 x 500 microm(2) in size, features an excellent temperature homogeneity of +/-2% over the heated area (300-microm diameter) and a high thermal efficiency of 6.0 degrees C/mW. A robust prototype package was developed, which relies on standard microelectronic packaging methods. Apart from a microcontroller board for managing chip communication and providing power supply and reference signals, no additional measurement equipment is needed. The on-chip digital temperature controller can accurately adjust the membrane temperature between 170 and 300 degrees C with an error of +/-2 degrees C. The on-chip logarithmic converter covers a wide measurement range between 1 kOmega and 10 MOmega. CO concentrations in the sub-parts-per-million range are detectable, and a resolution of +/-0.1 ppm CO was achieved, which renders the sensor capable of measuring CO concentrations at threshold levels.

  3. Experimental investigation of a shielded complementary Metal-Oxide Semiconductor (MOS) structure

    NASA Technical Reports Server (NTRS)

    Lin, H. C.; Halsor, J. L.

    1974-01-01

    A shielded integrated complimentary MOS transistor structure is described which is used to prevent field inversion in the region not occupied by the gates and which permits the use of a thinner field oxide, reduces the chip area, and has provision for simplified multilayer connections. The structure is used in the design of a static shift register and results in a 20% reduction in area.

  4. Note: Complementary metal-oxide-semiconductor high voltage pulse generation circuits.

    PubMed

    Sun, Jiwei; Wang, Pingshan

    2013-10-01

    We present two types of on-chip pulse generation circuits. The first is based on CMOS pulse-forming-lines (PFLs). It includes a four-stage charge pump, a four-stacked-MOSFET switch and a 5 mm long PFL. The circuit is implemented in a 0.13 μm CMOS process. Pulses of ~1.8 V amplitude with ~135 ps duration on a 50 Ω load are obtained. The obtained voltage is higher than 1.6 V, the rated operating voltage of the process. The second is a high-voltage Marx generator which also uses stacked MOSFETs as high voltage switches. The output voltage is 11.68 V, which is higher than the highest breakdown voltage (~10 V) of the CMOS process. These results significantly extend high-voltage pulse generation capabilities of CMOS technologies.

  5. Image quality evaluation of eight complementary metal-oxide semiconductor intraoral digital X-ray sensors.

    PubMed

    Teich, Sorin; Al-Rawi, Wisam; Heima, Masahiro; Faddoul, Fady F; Goldzweig, Gil; Gutmacher, Zvi; Aizenbud, Dror

    2016-10-01

    To evaluate the image quality generated by eight commercially available intraoral sensors. Eighteen clinicians ranked the quality of a bitewing acquired from one subject using eight different intraoral sensors. Analytical methods used to evaluate clinical image quality included the Visual Grading Characteristics method, which helps to quantify subjective opinions to make them suitable for analysis. The Dexis sensor was ranked significantly better than Sirona and Carestream-Kodak sensors; and the image captured using the Carestream-Kodak sensor was ranked significantly worse than those captured using Dexis, Schick and Cyber Medical Imaging sensors. The Image Works sensor image was rated the lowest by all clinicians. Other comparisons resulted in non-significant results. None of the sensors was considered to generate images of significantly better quality than the other sensors tested. Further research should be directed towards determining the clinical significance of the differences in image quality reported in this study. © 2016 FDI World Dental Federation.

  6. Characterization of Interface State in Silicon Carbide Metal Oxide Semiconductor Capacitors

    NASA Astrophysics Data System (ADS)

    Kao, Wei-Chieh

    Silicon carbide (SiC) has always been considered as an excellent material for high temperature and high power devices. Since SiC is the only compound semiconductor whose native oxide is silicon dioxide (SiO2), it puts SiC in a unique position. Although SiC metal oxide semiconductor (MOS) technology has made significant progress in recent years, there are still a number of issues to be overcome before more commercial SiC devices can enter the market. The prevailing issues surrounding SiC MOSFET devices are the low channel mobility, the low quality of the oxide layer and the high interface state density at the SiC/SiO2 interface. Consequently, there is a need for research to be performed in order to have a better understanding of the factors causing the poor SiC/SiO2 interface properties. In this work, we investigated the generation lifetime in SiC materials by using the pulsed metal oxide semiconductor (MOS) capacitor method and measured the interface state density distribution at the SiC/SiO2 interface by using the conductance measurement and the high-low frequency capacitance technique. These measurement techniques have been performed on n-type and p-type SiC MOS capacitors. In the course of our investigation, we observed fast interface states at semiconductor-dielectric interfaces in SiC MOS capacitors that underwent three different interface passivation processes, such states were detected in the nitrided samples but not observed in PSG-passivated samples. This result indicate that the lack of fast states at PSG-passivated interface is one of the main reasons for higher channel mobility in PSG MOSFETs. In addition, the effect of mobile ions in the oxide on the response time of interface states has been investigated. In the last chapter we propose additional methods of investigation that can help elucidate the origin of the particular interface states, enabling a more complete understanding of the SiC/SiO2 material system.

  7. Rapid Bacterial Detection via an All-Electronic CMOS Biosensor.

    PubMed

    Nikkhoo, Nasim; Cumby, Nichole; Gulak, P Glenn; Maxwell, Karen L

    2016-01-01

    The timely and accurate diagnosis of infectious diseases is one of the greatest challenges currently facing modern medicine. The development of innovative techniques for the rapid and accurate identification of bacterial pathogens in point-of-care facilities using low-cost, portable instruments is essential. We have developed a novel all-electronic biosensor that is able to identify bacteria in less than ten minutes. This technology exploits bacteriocins, protein toxins naturally produced by bacteria, as the selective biological detection element. The bacteriocins are integrated with an array of potassium-selective sensors in Complementary Metal Oxide Semiconductor technology to provide an inexpensive bacterial biosensor. An electronic platform connects the CMOS sensor to a computer for processing and real-time visualization. We have used this technology to successfully identify both Gram-positive and Gram-negative bacteria commonly found in human infections.

  8. Rapid Bacterial Detection via an All-Electronic CMOS Biosensor

    PubMed Central

    Nikkhoo, Nasim; Cumby, Nichole; Gulak, P. Glenn; Maxwell, Karen L.

    2016-01-01

    The timely and accurate diagnosis of infectious diseases is one of the greatest challenges currently facing modern medicine. The development of innovative techniques for the rapid and accurate identification of bacterial pathogens in point-of-care facilities using low-cost, portable instruments is essential. We have developed a novel all-electronic biosensor that is able to identify bacteria in less than ten minutes. This technology exploits bacteriocins, protein toxins naturally produced by bacteria, as the selective biological detection element. The bacteriocins are integrated with an array of potassium-selective sensors in Complementary Metal Oxide Semiconductor technology to provide an inexpensive bacterial biosensor. An electronic platform connects the CMOS sensor to a computer for processing and real-time visualization. We have used this technology to successfully identify both Gram-positive and Gram-negative bacteria commonly found in human infections. PMID:27618185

  9. Characteristics of Superjunction Lateral-Double-Diffusion Metal Oxide Semiconductor Field Effect Transistor and Degradation after Electrical Stress

    NASA Astrophysics Data System (ADS)

    Lin, Jyh‑Ling; Lin, Ming‑Jang; Lin, Li‑Jheng

    2006-04-01

    The superjunction lateral double diffusion metal oxide semiconductor field effect has recently received considerable attention. Introducing heavily doped p-type strips to the n-type drift region increases the horizontal depletion capability. Consequently, the doping concentration of the drift region is higher and the conduction resistance is lower than those of conventional lateral-double-diffusion metal oxide semiconductor field effect transistors (LDMOSFETs). These characteristics may increase breakdown voltage (\\mathit{BV}) and reduce specific on-resistance (Ron,sp). In this study, we focus on the electrical characteristics of conventional LDMOSFETs on silicon bulk, silicon-on-insulator (SOI) LDMOSFETs and superjunction LDMOSFETs after bias stress. Additionally, the \\mathit{BV} and Ron,sp of superjunction LDMOSFETs with different N/P drift region widths and different dosages are discussed. Simulation tools, including two-dimensional (2-D) TSPREM-4/MEDICI and three-dimensional (3-D) DAVINCI, were employed to determine the device characteristics.

  10. Real-space electron transfer in III-nitride metal-oxide-semiconductor-heterojunction structures

    NASA Astrophysics Data System (ADS)

    Saygi, S.; Koudymov, A.; Adivarahan, V.; Yang, J.; Simin, G.; Khan, M. Asif; Deng, J.; Gaska, R.; Shur, M. S.

    2005-07-01

    The real-space transfer effect in a SiO2/AlGaN /GaN metal-oxide-semiconductor heterostructure (MOSH) from the two-dimensional (2D) electron gas at the heterointerface to the oxide-semiconductor interface has been demonstrated and explained. The effect occurs at high positive gate bias and manifests itself as an additional step in the capacitance-voltage (C-V) characteristic. The real-space transfer effect limits the achievable maximum 2D electron gas density in the device channel. We show that in MOSH structures the maximum electron gas density exceeds up to two times that at the equilibrium (zero bias) condition. Correspondingly, a significant increase in the maximum channel current (up to two times compared to conventional Schottky-gate structures) can be achieved. The real-space charge transfer effect in MOSH structures also opens up a way to design novel devices such as variable capacitors, multistate switches, memory cells, etc.

  11. Silicon Metal-oxide-semiconductor Quantum Dots for Single-electron Pumping

    PubMed Central

    Rossi, Alessandro; Tanttu, Tuomo; Hudson, Fay E.; Sun, Yuxin; Möttönen, Mikko; Dzurak, Andrew S.

    2015-01-01

    As mass-produced silicon transistors have reached the nano-scale, their behavior and performances are increasingly affected, and often deteriorated, by quantum mechanical effects such as tunneling through single dopants, scattering via interface defects, and discrete trap charge states. However, progress in silicon technology has shown that these phenomena can be harnessed and exploited for a new class of quantum-based electronics. Among others, multi-layer-gated silicon metal-oxide-semiconductor (MOS) technology can be used to control single charge or spin confined in electrostatically-defined quantum dots (QD). These QD-based devices are an excellent platform for quantum computing applications and, recently, it has been demonstrated that they can also be used as single-electron pumps, which are accurate sources of quantized current for metrological purposes. Here, we discuss in detail the fabrication protocol for silicon MOS QDs which is relevant to both quantum computing and quantum metrology applications. Moreover, we describe characterization methods to test the integrity of the devices after fabrication. Finally, we give a brief description of the measurement set-up used for charge pumping experiments and show representative results of electric current quantization. PMID:26067215

  12. Analysis of Interface Charge Densities for High-k Dielectric Materials based Metal Oxide Semiconductor Devices

    NASA Astrophysics Data System (ADS)

    Maity, N. P.; Thakur, R. R.; Maity, Reshmi; Thapa, R. K.; Baishya, S.

    2016-10-01

    In this paper, the interface charge densities (Dit) are studied and analyzed for ultra thin dielectric metal oxide semiconductor (MOS) devices using different high-k dielectric materials such as Al2O3, ZrO2 and HfO2. The Dit have been calculated by a new approach using conductance method and it indicates that by reducing the thickness of the oxide, the Dit increases and similar increase is also found by replacing SiO2 with high-k. For the same oxide thickness, SiO2 has the lowest Dit and found to be the order of 1011cm-2eV-1. Linear increase in Dit has been observed as the dielectric constant of the oxide increases. The Dit is found to be in good agreement with published fabrication results at p-type doping level of 1×1017cm-3. Numerical calculations and solutions are performed by MATLAB and device simulation is done by ATLAS.

  13. Inversion channel diamond metal-oxide-semiconductor field-effect transistor with normally off characteristics

    NASA Astrophysics Data System (ADS)

    Matsumoto, Tsubasa; Kato, Hiromitsu; Oyama, Kazuhiro; Makino, Toshiharu; Ogura, Masahiko; Takeuchi, Daisuke; Inokuma, Takao; Tokuda, Norio; Yamasaki, Satoshi

    2016-08-01

    We fabricated inversion channel diamond metal-oxide-semiconductor field-effect transistors (MOSFETs) with normally off characteristics. At present, Si MOSFETs and insulated gate bipolar transistors (IGBTs) with inversion channels are widely used because of their high controllability of electric power and high tolerance. Although a diamond semiconductor is considered to be a material with a strong potential for application in next-generation power devices, diamond MOSFETs with an inversion channel have not yet been reported. We precisely controlled the MOS interface for diamond by wet annealing and fabricated p-channel and planar-type MOSFETs with phosphorus-doped n-type body on diamond (111) substrate. The gate oxide of Al2O3 was deposited onto the n-type diamond body by atomic layer deposition at 300 °C. The drain current was controlled by the negative gate voltage, indicating that an inversion channel with a p-type character was formed at a high-quality n-type diamond body/Al2O3 interface. The maximum drain current density and the field-effect mobility of a diamond MOSFET with a gate electrode length of 5 μm were 1.6 mA/mm and 8.0 cm2/Vs, respectively, at room temperature.

  14. Inversion channel diamond metal-oxide-semiconductor field-effect transistor with normally off characteristics.

    PubMed

    Matsumoto, Tsubasa; Kato, Hiromitsu; Oyama, Kazuhiro; Makino, Toshiharu; Ogura, Masahiko; Takeuchi, Daisuke; Inokuma, Takao; Tokuda, Norio; Yamasaki, Satoshi

    2016-08-22

    We fabricated inversion channel diamond metal-oxide-semiconductor field-effect transistors (MOSFETs) with normally off characteristics. At present, Si MOSFETs and insulated gate bipolar transistors (IGBTs) with inversion channels are widely used because of their high controllability of electric power and high tolerance. Although a diamond semiconductor is considered to be a material with a strong potential for application in next-generation power devices, diamond MOSFETs with an inversion channel have not yet been reported. We precisely controlled the MOS interface for diamond by wet annealing and fabricated p-channel and planar-type MOSFETs with phosphorus-doped n-type body on diamond (111) substrate. The gate oxide of Al2O3 was deposited onto the n-type diamond body by atomic layer deposition at 300 °C. The drain current was controlled by the negative gate voltage, indicating that an inversion channel with a p-type character was formed at a high-quality n-type diamond body/Al2O3 interface. The maximum drain current density and the field-effect mobility of a diamond MOSFET with a gate electrode length of 5 μm were 1.6 mA/mm and 8.0 cm(2)/Vs, respectively, at room temperature.

  15. Inversion channel diamond metal-oxide-semiconductor field-effect transistor with normally off characteristics

    PubMed Central

    Matsumoto, Tsubasa; Kato, Hiromitsu; Oyama, Kazuhiro; Makino, Toshiharu; Ogura, Masahiko; Takeuchi, Daisuke; Inokuma, Takao; Tokuda, Norio; Yamasaki, Satoshi

    2016-01-01

    We fabricated inversion channel diamond metal-oxide-semiconductor field-effect transistors (MOSFETs) with normally off characteristics. At present, Si MOSFETs and insulated gate bipolar transistors (IGBTs) with inversion channels are widely used because of their high controllability of electric power and high tolerance. Although a diamond semiconductor is considered to be a material with a strong potential for application in next-generation power devices, diamond MOSFETs with an inversion channel have not yet been reported. We precisely controlled the MOS interface for diamond by wet annealing and fabricated p-channel and planar-type MOSFETs with phosphorus-doped n-type body on diamond (111) substrate. The gate oxide of Al2O3 was deposited onto the n-type diamond body by atomic layer deposition at 300 °C. The drain current was controlled by the negative gate voltage, indicating that an inversion channel with a p-type character was formed at a high-quality n-type diamond body/Al2O3 interface. The maximum drain current density and the field-effect mobility of a diamond MOSFET with a gate electrode length of 5 μm were 1.6 mA/mm and 8.0 cm2/Vs, respectively, at room temperature. PMID:27545201

  16. Metal-oxide-semiconductor capacitors and Schottky diodes studied with scanning microwave microscopy at 18 GHz

    NASA Astrophysics Data System (ADS)

    Kasper, M.; Gramse, G.; Hoffmann, J.; Gaquiere, C.; Feger, R.; Stelzer, A.; Smoliner, J.; Kienberger, F.

    2014-11-01

    We measured the DC and RF impedance characteristics of micrometric metal-oxide-semiconductor (MOS) capacitors and Schottky diodes using scanning microwave microscopy (SMM). The SMM consisting of an atomic force microscopy (AFM) interfaced with a vector network analyser (VNA) was used to measure the reflection S11 coefficient of the metallic MOS and Schottky contact pads at 18 GHz as a function of the tip bias voltage. By controlling the SMM biasing conditions, the AFM tip was used to bias the Schottky contacts between reverse and forward mode. In reverse bias direction, the Schottky contacts showed mostly a change in the imaginary part of the admittance while in forward bias direction the change was mostly in the real part of the admittance. Reference MOS capacitors which are next to the Schottky diodes on the same sample were used to calibrate the SMM S11 data and convert it into capacitance values. Calibrated capacitance between 1-10 fF and 1/C2 spectroscopy curves were acquired on the different Schottky diodes as a function of the DC bias voltage following a linear behavior. Additionally, measurements were done directly with the AFM-tip in contact with the silicon substrate forming a nanoscale Schottky contact. Similar capacitance-voltage curves were obtained but with smaller values (30-300 aF) due to the corresponding smaller AFM-tip diameter. Calibrated capacitance images of both the MOS and Schottky contacts were acquired with nanoscale resolution at different tip-bias voltages.

  17. High-resolution electrohydrodynamic inkjet printing of stretchable metal oxide semiconductor transistors with high performance.

    PubMed

    Kim, S-Y; Kim, K; Hwang, Y H; Park, J; Jang, J; Nam, Y; Kang, Y; Kim, M; Park, H J; Lee, Z; Choi, J; Kim, Y; Jeong, S; Bae, B-S; Park, J-U

    2016-10-06

    As demands for high pixel densities and wearable forms of displays increase, high-resolution printing technologies to achieve high performance transistors beyond current amorphous silicon levels and to allow low-temperature solution processability for plastic substrates have been explored as key processes in emerging flexible electronics. This study describes electrohydrodynamic inkjet (e-jet) technology for direct printing of oxide semiconductor thin film transistors (TFTs) with high resolution (minimum line width: 2 μm) and superb performance, including high mobility (∼230 cm(2) V(-1) s(-1)). Logic operations of the amplifier circuits composed of these e-jet-printed metal oxide semiconductor (MOS) TFTs demonstrate their high performance. Printed In2O TFTs with e-jet printing-assisted high-resolution S/D electrodes were prepared, and the direct printing of passivation layers on these channels enhanced their gate-bias stabilities significantly. Moreover, low process temperatures (<250 °C) enable the use of thin plastic substrates; highly flexible and stretchable TFT arrays have been demonstrated, suggesting promise for next-generation printed electronics.

  18. Electrical properties of inalp native oxides for metal-oxide-semiconductor device applications

    SciTech Connect

    Cao, Y.; Zhang, J.; Li, X.; Kosel, T.H.; Fay, P.; Hall, D.C.; Zhang, X.B.; Dupuis, R.D.; Jasinski, J.B.; Liliental-Weber, Z.

    2004-09-01

    Data are presented on the insulating properties and capacitance-voltage (CV) characteristics of metal-oxide-semiconductor (MOS) device-thickness (below approx. 100 nm) native oxides formed by wet thermal oxidation of thin InAlP epilayers lattice matched to GaAs. Low leakage current densities of J=1.4 x 10-9 A/cm2 and J=8.7 x 10-11 A/cm2 are observed at an applied field of 1 MV/cm for MOS capacitors fabricated with 17 nm and 48 nm oxides, respectively. TEM images show that the In-rich interfacial particles which exist in 110 nm oxides are absent in 17 nm oxide films. Quasi-static capacitance-voltage measurements of MOS capacitors fabricated on both n-type and p-type GaAs show that the InAlP oxide-GaAs interface is sufficiently free of traps to support inversion, indicating an unpinned Fermi level. These data suggest that InAlP native oxides may be a viable insulator for GaAs MOS device applications.

  19. Ionic Liquid Activation of Amorphous Metal-Oxide Semiconductors for Flexible Transparent Electronic Devices

    DOE PAGES

    Pudasaini, Pushpa Raj; Noh, Joo Hyon; Wong, Anthony T.; ...

    2016-02-09

    To begin this abstract, amorphous metal-oxide semiconductors offer the high carrier mobilities and excellent large-area uniformity required for high performance, transparent, flexible electronic devices; however, a critical bottleneck to their widespread implementation is the need to activate these materials at high temperatures which are not compatible with flexible polymer substrates. The highly controllable activation of amorphous indium gallium zinc oxide semiconductor channels using ionic liquid gating at room temperature is reported. Activation is controlled by electric field-induced oxygen migration across the ionic liquid-semiconductor interface. In addition to activation of unannealed devices, it is shown that threshold voltages of a transistormore » can be linearly tuned between the enhancement and depletion modes. Finally, the first ever example of transparent flexible thin film metal oxide transistor on a polyamide substrate created using this simple technique is demonstrated. Finally, this study demonstrates the potential of field-induced activation as a promising alternative to traditional postdeposition thermal annealing which opens the door to wide scale implementation into flexible electronic applications.« less

  20. Silicon carbide: A unique platform for metal-oxide-semiconductor physics

    SciTech Connect

    Liu, Gang; Tuttle, Blair R.; Dhar, Sarit

    2015-06-15

    A sustainable energy future requires power electronics that can enable significantly higher efficiencies in the generation, distribution, and usage of electrical energy. Silicon carbide (4H-SiC) is one of the most technologically advanced wide bandgap semiconductor that can outperform conventional silicon in terms of power handling, maximum operating temperature, and power conversion efficiency in power modules. While SiC Schottky diode is a mature technology, SiC power Metal Oxide Semiconductor Field Effect Transistors are relatively novel and there is large room for performance improvement. Specifically, major initiatives are under way to improve the inversion channel mobility and gate oxide stability in order to further reduce the on-resistance and enhance the gate reliability. Both problems relate to the defects near the SiO{sub 2}/SiC interface, which have been the focus of intensive studies for more than a decade. Here we review research on the SiC MOS physics and technology, including its brief history, the state-of-art, and the latest progress in this field. We focus on the two main scientific problems, namely, low channel mobility and bias temperature instability. The possible mechanisms behind these issues are discussed at the device physics level as well as the atomic scale, with the support of published physical analysis and theoretical studies results. Some of the most exciting recent progress in interface engineering for improving the channel mobility and fundamental understanding of channel transport is reviewed.

  1. Core/shell nano-structuring of metal oxide semiconductors and their photocatalytic studies

    NASA Astrophysics Data System (ADS)

    Balakumar, S.; Rakkesh, R. Ajay

    2013-02-01

    Core/Shell Nanostructures of Metal Oxide Semiconductors (MOS) have attracted much attention because of their most fascinating tunable applications. These core shell morphologies can be easily engineered to enhance the unique properties of the metal-oxide nanostructures, which make them suitable as photocatalyst due to their high catalytic activity, substantial stability, and brilliant perspective in applications. This paper provides an overview on our work on the synthesis of some interesting core/ shell nanostructures of MOS such as ZnO-TiO2, ZnO-MoO3, and V2O5-TiO2 using a low temperature wet chemical route and hydrothermal techniques and their photocatalytic properties from the aspects of different shell materials and shell thicknesses. The effect of process parameters such as pH, temperature, and ratio of core and shell materials, was systematically studied. Here the evidence for the core shell formation with different shell thicknesses came from the X-ray diffraction peak intensities. The shell thickness variation was also confirmed by Transmission Electron Microscopic studies. Effect of shell thickness on optical band gap of the core shell fabricated was also investigated using DRS UV-Visible spectroscopy. A comprehensive study was carried out for the photocatalytic efficiency of core shell nanostructures by evaluating the photo-degradation of Acridine Orange (AO) dye in aqueous solution under visible and solar light irradiations. These results offered simple approaches to the nanoscale engineering and synthesis of MOS hybrid systems to serve as better photocatalytic materials.

  2. Silicon Metal-oxide-semiconductor Quantum Dots for Single-electron Pumping.

    PubMed

    Rossi, Alessandro; Tanttu, Tuomo; Hudson, Fay E; Sun, Yuxin; Möttönen, Mikko; Dzurak, Andrew S

    2015-06-03

    As mass-produced silicon transistors have reached the nano-scale, their behavior and performances are increasingly affected, and often deteriorated, by quantum mechanical effects such as tunneling through single dopants, scattering via interface defects, and discrete trap charge states. However, progress in silicon technology has shown that these phenomena can be harnessed and exploited for a new class of quantum-based electronics. Among others, multi-layer-gated silicon metal-oxide-semiconductor (MOS) technology can be used to control single charge or spin confined in electrostatically-defined quantum dots (QD). These QD-based devices are an excellent platform for quantum computing applications and, recently, it has been demonstrated that they can also be used as single-electron pumps, which are accurate sources of quantized current for metrological purposes. Here, we discuss in detail the fabrication protocol for silicon MOS QDs which is relevant to both quantum computing and quantum metrology applications. Moreover, we describe characterization methods to test the integrity of the devices after fabrication. Finally, we give a brief description of the measurement set-up used for charge pumping experiments and show representative results of electric current quantization.

  3. Ionic behavior of organic-inorganic metal halide perovskite based metal-oxide-semiconductor capacitors.

    PubMed

    Wang, Yucheng; Zhang, Yuming; Pang, Tiqiang; Xu, Jie; Hu, Ziyang; Zhu, Yuejin; Tang, Xiaoyan; Luan, Suzhen; Jia, Renxu

    2017-05-24

    Organic-inorganic metal halide perovskites are promising semiconductors for optoelectronic applications. Despite the achievements in device performance, the electrical properties of perovskites have stagnated. Ion migration is speculated to be the main contributing factor for the many unusual electrical phenomena in perovskite-based devices. Here, to understand the intrinsic electrical behavior of perovskites, we constructed metal-oxide-semiconductor (MOS) capacitors based on perovskite films and performed capacitance-voltage (C-V) and current-voltage (I-V) measurements of the capacitors. The results provide direct evidence for the mixed ionic-electronic transport behavior within perovskite films. In the dark, there is electrical hysteresis in both the C-V and I-V curves because the mobile negative ions take part in charge transport despite frequency modulation. However, under illumination, the large amount of photoexcited free carriers screens the influence of the mobile ions with a low concentration, which is responsible for the normal C-V properties. Validation of ion migration for the gate-control ability of MOS capacitors is also helpful for the investigation of perovskite MOS transistors and other gate-control photovoltaic devices.

  4. Metal oxide semiconductors for dye- and quantum-dot-sensitized solar cells.

    PubMed

    Concina, Isabella; Vomiero, Alberto

    2015-04-17

    This Review provides a brief summary of the most recent research developments in the synthesis and application of nanostructured metal oxide semiconductors for dye sensitized and quantum dot sensitized solar cells. In these devices, the wide bandgap semiconducting oxide acts as the photoanode, which provides the scaffold for light harvesters (either dye molecules or quantum dots) and electron collection. For this reason, proper tailoring of the optical and electronic properties of the photoanode can significantly boost the functionalities of the operating device. Optimization of the functional properties relies with modulation of the shape and structure of the photoanode, as well as on application of different materials (TiO2, ZnO, SnO2) and/or composite systems, which allow fine tuning of electronic band structure. This aspect is critical because it determines exciton and charge dynamics in the photoelectrochemical system and is strictly connected to the photoconversion efficiency of the solar cell. The different strategies for increasing light harvesting and charge collection, inhibiting charge losses due to recombination phenomena, are reviewed thoroughly, highlighting the benefits of proper photoanode preparation, and its crucial role in the development of high efficiency dye sensitized and quantum dot sensitized solar cells. © 2014 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

  5. Experimental characterization of a metal-oxide-semiconductor field-effect transistor-based Coulter counter

    PubMed Central

    Sridhar, Manoj; Xu, Dongyan; Kang, Yuejun; Hmelo, Anthony B.; Feldman, Leonard C.; Li, Dongqing; Li, Deyu

    2008-01-01

    We report the detailed characterization of an ultrasensitive microfluidic device used to detect the translocation of small particles through a sensing microchannel. The device connects a fluidic circuit to the gate of a metal-oxide-semiconductor field-effect transistor (MOSFET) and detects particles by monitoring the MOSFET drain current modulation instead of the modulation in the ionic current through the sensing channel. The minimum volume ratio of the particle to the sensing channel detected is 0.006%, which is about ten times smaller than the lowest detected volume ratio previously reported in the literature. This volume ratio is detected at a noise level of about 0.6% of the baseline MOSFET drain current, clearly showing the amplification effects from the fluidic circuits and the MOSFETs. We characterize the device sensitivity as a function of the MOSFET gate potential and show that its sensitivity is higher when the MOSFET is operating below its threshold gate voltage than when it is operating above the threshold voltage. In addition, we demonstrate that the device sensitivity linearly increases with the applied electrical bias across the fluidic circuit. Finally, we show that polystyrene beads and glass beads with similar sizes can be distinguished from each other based on their different translocation times, and the size distribution of microbeads can be obtained with accuracy comparable to that of direct scanning electron microscopy measurements. PMID:19479001

  6. Metal-oxide-semiconductor field-effect transistor with a vacuum channel.

    PubMed

    Srisonphan, Siwapon; Jung, Yun Suk; Kim, Hong Koo

    2012-08-01

    High-speed electronic devices rely on short carrier transport times, which are usually achieved by decreasing the channel length and/or increasing the carrier velocity. Ideally, the carriers enter into a ballistic transport regime in which they are not scattered. However, it is difficult to achieve ballistic transport in a solid-state medium because the high electric fields used to increase the carrier velocity also increase scattering. Vacuum is an ideal medium for ballistic transport, but vacuum electronic devices commonly suffer from low emission currents and high operating voltages. Here, we report the fabrication of a low-voltage field-effect transistor with a vertical vacuum channel (channel length of ~20 nm) etched into a metal-oxide-semiconductor substrate. We measure a transconductance of 20 nS µm(-1), an on/off ratio of 500 and a turn-on gate voltage of 0.5 V under ambient conditions. Coulombic repulsion in the two-dimensional electron system at the interface between the oxide and the metal or the semiconductor reduces the energy barrier to electron emission, leading to a high emission current density (~1 × 10(5) A cm(-2)) under a bias of only 1 V. The emission of two-dimensional electron systems into vacuum channels could enable a new class of low-power, high-speed transistors.

  7. Silicon carbide: A unique platform for metal-oxide-semiconductor physics

    NASA Astrophysics Data System (ADS)

    Liu, Gang; Tuttle, Blair R.; Dhar, Sarit

    2015-06-01

    A sustainable energy future requires power electronics that can enable significantly higher efficiencies in the generation, distribution, and usage of electrical energy. Silicon carbide (4H-SiC) is one of the most technologically advanced wide bandgap semiconductor that can outperform conventional silicon in terms of power handling, maximum operating temperature, and power conversion efficiency in power modules. While SiC Schottky diode is a mature technology, SiC power Metal Oxide Semiconductor Field Effect Transistors are relatively novel and there is large room for performance improvement. Specifically, major initiatives are under way to improve the inversion channel mobility and gate oxide stability in order to further reduce the on-resistance and enhance the gate reliability. Both problems relate to the defects near the SiO2/SiC interface, which have been the focus of intensive studies for more than a decade. Here we review research on the SiC MOS physics and technology, including its brief history, the state-of-art, and the latest progress in this field. We focus on the two main scientific problems, namely, low channel mobility and bias temperature instability. The possible mechanisms behind these issues are discussed at the device physics level as well as the atomic scale, with the support of published physical analysis and theoretical studies results. Some of the most exciting recent progress in interface engineering for improving the channel mobility and fundamental understanding of channel transport is reviewed.

  8. Ionic Liquid Activation of Amorphous Metal-Oxide Semiconductors for Flexible Transparent Electronic Devices

    SciTech Connect

    Pudasaini, Pushpa Raj; Noh, Joo Hyon; Wong, Anthony T.; Ovchinnikova, Olga S.; Haglund, Amanda V.; Dai, Sheng; Ward, Thomas Zac; Mandrus, David; Rack, Philip D.

    2016-02-09

    To begin this abstract, amorphous metal-oxide semiconductors offer the high carrier mobilities and excellent large-area uniformity required for high performance, transparent, flexible electronic devices; however, a critical bottleneck to their widespread implementation is the need to activate these materials at high temperatures which are not compatible with flexible polymer substrates. The highly controllable activation of amorphous indium gallium zinc oxide semiconductor channels using ionic liquid gating at room temperature is reported. Activation is controlled by electric field-induced oxygen migration across the ionic liquid-semiconductor interface. In addition to activation of unannealed devices, it is shown that threshold voltages of a transistor can be linearly tuned between the enhancement and depletion modes. Finally, the first ever example of transparent flexible thin film metal oxide transistor on a polyamide substrate created using this simple technique is demonstrated. Finally, this study demonstrates the potential of field-induced activation as a promising alternative to traditional postdeposition thermal annealing which opens the door to wide scale implementation into flexible electronic applications.

  9. Infrared rectification in a nanoantenna-coupled metal-oxide-semiconductor tunnel diode

    NASA Astrophysics Data System (ADS)

    Davids, Paul S.; Jarecki, Robert L.; Starbuck, Andrew; Burckel, D. Bruce; Kadlec, Emil A.; Ribaudo, Troy; Shaner, Eric A.; Peters, David W.

    2015-12-01

    Direct rectification of electromagnetic radiation is a well-established method for wireless power conversion in the microwave region of the spectrum, for which conversion efficiencies in excess of 84% have been demonstrated. Scaling to the infrared or optical part of the spectrum requires ultrafast rectification that can only be obtained by direct tunnelling. Many research groups have looked to plasmonics to overcome antenna-scaling limits and to increase the confinement. Recently, surface plasmons on heavily doped Si surfaces were investigated as a way of extending surface-mode confinement to the thermal infrared region. Here we combine a nanostructured metallic surface with a heavily doped Si infrared-reflective ground plane designed to confine infrared radiation in an active electronic direct-conversion device. The interplay of strong infrared photon-phonon coupling and electromagnetic confinement in nanoscale devices is demonstrated to have a large impact on ultrafast electronic tunnelling in metal-oxide-semiconductor (MOS) structures. Infrared dispersion of SiO2 near a longitudinal optical (LO) phonon mode gives large transverse-field confinement in a nanometre-scale oxide-tunnel gap as the wavelength-dependent permittivity changes from 1 to 0, which leads to enhanced electromagnetic fields at material interfaces and a rectified displacement current that provides a direct conversion of infrared radiation into electric current. The spectral and electrical signatures of the nanoantenna-coupled tunnel diodes are examined under broadband blackbody and quantum-cascade laser (QCL) illumination. In the region near the LO phonon resonance, we obtained a measured photoresponsivity of 2.7 mA W-1 cm-2 at -0.1 V.

  10. Infrared rectification in a nanoantenna-coupled metal-oxide-semiconductor tunnel diode.

    PubMed

    Davids, Paul S; Jarecki, Robert L; Starbuck, Andrew; Burckel, D Bruce; Kadlec, Emil A; Ribaudo, Troy; Shaner, Eric A; Peters, David W

    2015-12-01

    Direct rectification of electromagnetic radiation is a well-established method for wireless power conversion in the microwave region of the spectrum, for which conversion efficiencies in excess of 84% have been demonstrated. Scaling to the infrared or optical part of the spectrum requires ultrafast rectification that can only be obtained by direct tunnelling. Many research groups have looked to plasmonics to overcome antenna-scaling limits and to increase the confinement. Recently, surface plasmons on heavily doped Si surfaces were investigated as a way of extending surface-mode confinement to the thermal infrared region. Here we combine a nanostructured metallic surface with a heavily doped Si infrared-reflective ground plane designed to confine infrared radiation in an active electronic direct-conversion device. The interplay of strong infrared photon-phonon coupling and electromagnetic confinement in nanoscale devices is demonstrated to have a large impact on ultrafast electronic tunnelling in metal-oxide-semiconductor (MOS) structures. Infrared dispersion of SiO2 near a longitudinal optical (LO) phonon mode gives large transverse-field confinement in a nanometre-scale oxide-tunnel gap as the wavelength-dependent permittivity changes from 1 to 0, which leads to enhanced electromagnetic fields at material interfaces and a rectified displacement current that provides a direct conversion of infrared radiation into electric current. The spectral and electrical signatures of the nanoantenna-coupled tunnel diodes are examined under broadband blackbody and quantum-cascade laser (QCL) illumination. In the region near the LO phonon resonance, we obtained a measured photoresponsivity of 2.7 mA W(-1) cm(-2) at -0.1 V.

  11. Effects of oxide traps, interface traps, and border traps'' on metal-oxide-semiconductor devices

    SciTech Connect

    Fleetwood, D.M.; Winokur, P.S.; Reber, R.A. Jr.; Meisenheimer, T.L.; Schwank, J.R.; Shaneyfelt, M.R.; Riewe, L.C. )

    1993-05-15

    We have identified several features of the 1/[ital f] noise and radiation response of metal-oxide-semiconductor (MOS) devices that are difficult to explain with standard defect models. To address this issue, and in response to ambiguities in the literature, we have developed a revised nomenclature for defects in MOS devices that clearly distinguishes the language used to describe the physical location of defects from that used to describe their electrical response. In this nomenclature, oxide traps'' are simply defects in the SiO[sub 2] layer of the MOS structure, and interface traps'' are defects at the Si/SiO[sub 2] interface. Nothing is presumed about how either type of defect communicates with the underlying Si. Electrically, fixed states'' are defined as trap levels that do not communicate with the Si on the time scale of the measurements, but switching states'' can exchange charge with the Si. Fixed states presumably are oxide traps in most types of measurements, but switching states can either be interface traps or near-interfacial oxide traps that can communicate with the Si, i.e., border traps'' [D. M. Fleetwood, IEEE Trans. Nucl. Sci. [bold NS]-[bold 39], 269 (1992)]. The effective density of border traps depends on the time scale and bias conditions of the measurements. We show the revised nomenclature can provide focus to discussions of the buildup and annealing of radiation-induced charge in non-radiation-hardened MOS transistors, and to changes in the 1/[ital f] noise of MOS devices through irradiation and elevated-temperature annealing.

  12. Scanning internal photoemission studies of sodium-contaminated metal-oxide-semiconductor capacitors

    NASA Astrophysics Data System (ADS)

    Bouthillier, T. M.; Young, L.; Tsoi, H. Y.

    1983-02-01

    Following DiStefano and also Williams and Woods we have used scanning internal photoemission to map barrier inhomogeneities in sodium-contaminated Al/SiO2/Si Metal-Oxide-Semiconductor capacitors. A computer controlled system was used with a He/Cd laser. A well-known and striking result of the previous work is that peaks tend to be found in the internal photoemission. In some cases these peaks have been attributed to the segregation of an initially uniform sodium ion distribution into clusters of a few μm diameter. This clustering occurred during a low temperature anneal under positive gate bias. The mechanism for the supposed segregation is of considerable interest. One possibility is that the segregation maps pre-existing inhomogeneities either in the silicon substrate or in the oxide. Another mechanism, proposed by Williams and Woods, involves the image force lowering of the potential energy of the sodium ions. The lowering is increased as the induced electron charge density in the silicon increases with progressive clustering. This positive feedback was proposed to lead to instability. A thermodynamic development of the model by Wojtowcz led to the concept of two-dimensional phase transitions in the sodium distribution. In the present work we report the result that peaks can be produced by a low temperature anneal with the sodium either at the Al/SiO2 interface or drifted to the Si/SiO2 interface. In the first case, the sodium must be drifted to the silicon side before the peaks appear. This may show that nucleation centers are produced by the anneal and mapped by the sodium. Alternatively, if un-nucleated segregation occurs it must be a function of sodium in SiO2 rather than of sodium near the Si/SiO2 interface. Correlation with weak spot breakdown was again observed and the effects of using HCl oxides were studied.

  13. Metal-oxide-semiconductor based gas sensors: screening, preparation, and integration.

    PubMed

    Zhang, Jian; Qin, Ziyu; Zeng, Dawen; Xie, Changsheng

    2017-03-01

    Metal-oxide-semiconductor (MOS) based gas sensors have been considered a promising candidate for gas detection over the past few years. However, the sensing properties of MOS-based gas sensors also need to be further enhanced to satisfy the higher requirements for specific applications, such as medical diagnosis based on human breath, gas detection in harsh environments, etc. In these fields, excellent selectivity, low power consumption, a fast response/recovery rate, low humidity dependence and a low limit of detection concentration should be fulfilled simultaneously, which pose great challenges to the MOS-based gas sensors. Recently, in order to improve the sensing performances of MOS-based gas sensors, more and more researchers have carried out extensive research from theory to practice. For a similar purpose, on the basis of the whole fabrication process of gas sensors, this review gives a presentation of the important role of screening and the recent developments in high throughput screening. Subsequently, together with the sensing mechanism, the factors influencing the sensing properties of MOSs involved in material preparation processes were also discussed in detail. It was concluded that the sensing properties of MOSs not only depend on the morphological structure (particle size, morphology, pore size, etc.), but also rely on the defect structure and heterointerface structure (grain boundaries, heterointerfaces, defect concentrations, etc.). Therefore, the material-sensor integration was also introduced to maintain the structural stability in the sensor fabrication process, ensuring the sensing stability of MOS-based gas sensors. Finally, the perspectives of the MOS-based gas sensors in the aspects of fundamental research and the improvements in the sensing properties are pointed out.

  14. Technology breakthroughs in high performance metal-oxide-semiconductor devices for ultra-high density, low power non-volatile memory applications

    NASA Astrophysics Data System (ADS)

    Hong, Augustin Jinwoo

    Non-volatile memory devices have attracted much attention because data can be retained without power consumption more than a decade. Therefore, non-volatile memory devices are essential to mobile electronic applications. Among state of the art non-volatile memory devices, NAND flash memory has earned the highest attention because of its ultra-high scalability and therefore its ultra-high storage capacity. However, human desire as well as market competition requires not only larger storage capacity but also lower power consumption for longer battery life time. One way to meet this human desire and extend the benefits of NAND flash memory is finding out new materials for storage layer inside the flash memory, which is called floating gate in the state of the art flash memory device. In this dissertation, we study new materials for the floating gate that can lower down the power consumption and increase the storage capacity at the same time. To this end, we employ various materials such as metal nanodot, metal thin film and graphene incorporating complementary-metal-oxide-semiconductor (CMOS) compatible processes. Experimental results show excellent memory effects at relatively low operating voltages. Detailed physics and analysis on experimental results are discussed. These new materials for data storage can be promising candidates for future non-volatile memory application beyond the state of the art flash technologies.

  15. Gate length and temperature dependence of negative differential transconductance in silicon quantum well metal-oxide-semiconductor field-effect transistors

    NASA Astrophysics Data System (ADS)

    Naquin, Clint; Lee, Mark; Edwards, Hal; Mathur, Guru; Chatterjee, Tathagata; Maggio, Ken

    2015-09-01

    Introducing quantum transport into silicon transistors in a manner compatible with industrial fabrication has the potential to transform the performance horizons of large scale integrated silicon devices and circuits. Explicit quantum transport as evidenced by negative differential transconductances (NDTCs) has been observed in a set of quantum well (QW) transistors fabricated using industrial silicon complementary metal-oxide-semiconductor processing. Detailed gate length and temperature dependence characteristics of the NDTCs in these devices have been measured. The QW potential was formed via lateral ion implantation doping on a commercial 45 nm technology node process line, and measurements of the transfer characteristics show NDTCs up to room temperature. Gate length dependence of NDTCs shows a correlation of the interface channel length with the number of NDTCs formed as well as with the gate voltage (VG) spacing between NDTCs. The VG spacing between multiple NDTCs suggests a quasi-parabolic QW potential profile. The temperature dependence is consistent with partial freeze-out of carrier concentration against a degenerately doped background.

  16. Gate length and temperature dependence of negative differential transconductance in silicon quantum well metal-oxide-semiconductor field-effect transistors

    SciTech Connect

    Naquin, Clint; Lee, Mark; Edwards, Hal; Mathur, Guru; Chatterjee, Tathagata; Maggio, Ken

    2015-09-28

    Introducing quantum transport into silicon transistors in a manner compatible with industrial fabrication has the potential to transform the performance horizons of large scale integrated silicon devices and circuits. Explicit quantum transport as evidenced by negative differential transconductances (NDTCs) has been observed in a set of quantum well (QW) transistors fabricated using industrial silicon complementary metal-oxide-semiconductor processing. Detailed gate length and temperature dependence characteristics of the NDTCs in these devices have been measured. The QW potential was formed via lateral ion implantation doping on a commercial 45 nm technology node process line, and measurements of the transfer characteristics show NDTCs up to room temperature. Gate length dependence of NDTCs shows a correlation of the interface channel length with the number of NDTCs formed as well as with the gate voltage (V{sub G}) spacing between NDTCs. The V{sub G} spacing between multiple NDTCs suggests a quasi-parabolic QW potential profile. The temperature dependence is consistent with partial freeze-out of carrier concentration against a degenerately doped background.

  17. Models of second-order effects in metal-oxide-semiconductor field-effect transistors for computer applications

    NASA Technical Reports Server (NTRS)

    Benumof, Reuben; Zoutendyk, John; Coss, James

    1988-01-01

    Second-order effects in metal-oxide-semiconductor field-effect transistors (MOSFETs) are important for devices with dimensions of 2 microns or less. The short and narrow channel effects and drain-induced barrier lowering primarily affect threshold voltage, but formulas for drain current must also take these effects into account. In addition, the drain current is sensitive to channel length modulation due to pinch-off or velocity saturation and is diminished by electron mobility degradation due to normal and lateral electric fields in the channel. A model of a MOSFET including these considerations and emphasizing charge conservation is discussed.

  18. Memory effects in a Al/Ti:HfO2/CuPc metal-oxide-semiconductor device

    NASA Astrophysics Data System (ADS)

    Tripathi, Udbhav; Kaur, Ramneek

    2016-05-01

    Metal oxide semiconductor structured organic memory device has been successfully fabricated. Ti doped hafnium oxide (Ti:HfO2) nanoparticles has been fabricated by precipitation method and further calcinated at 800 °C. Copper phthalocyanine, a hole transporting material has been utilized as an organic semiconductor. The electrical properties of the fabricated device have been studied by measuring the current-voltage and capacitance-voltage characteristics. The amount of charge stored in the nanoparticles has been calculated by using flat band condition. This simple approach for fabricating MOS memory device has opens up opportunities for the development of next generation memory devices.

  19. Nondestructive measurement of thermal contact resistance for the power vertical double-diffused metal-oxide-semiconductor

    NASA Astrophysics Data System (ADS)

    Li, Rui; Guo, Chun-Sheng; Feng, Shi-Wei; Shi, Lei; Zhu, Hui; Wang, Lin

    2015-07-01

    To obtain thermal contact resistance (TCR) between the vertical double-diffused metal-oxide-semiconductor (VDMOS) and the heat sink, we derived the relationship between the total thermal resistance and the contact force imposed on the VDMOS. The total thermal resistance from the chip to the heat sink is measured under different contact forces, and the TCR can be extracted nondestructively from the derived relationship. Finally, the experimental results are compared with the simulation results. Project supported by the National Natural Science Foundation of China (Grant No. 61204081).

  20. Memory effects in a Al/Ti:HfO{sub 2}/CuPc metal-oxide-semiconductor device

    SciTech Connect

    Tripathi, Udbhav Kaur, Ramneek

    2016-05-23

    Metal oxide semiconductor structured organic memory device has been successfully fabricated. Ti doped hafnium oxide (Ti:HfO{sub 2}) nanoparticles has been fabricated by precipitation method and further calcinated at 800 °C. Copper phthalocyanine, a hole transporting material has been utilized as an organic semiconductor. The electrical properties of the fabricated device have been studied by measuring the current-voltage and capacitance-voltage characteristics. The amount of charge stored in the nanoparticles has been calculated by using flat band condition. This simple approach for fabricating MOS memory device has opens up opportunities for the development of next generation memory devices.

  1. Reliability properties of metal-oxide-semiconductor capacitors using LaAlO3 high-k dielectric

    NASA Astrophysics Data System (ADS)

    Yeh, Lingyen; Chang, Ingram Yin-Ku; Chen, Chun-Heng; Lee, Joseph Ya-Min

    2009-10-01

    In this study, metal-oxide-semiconductor (MOS) capacitors with high dielectric constant LaAlO3 film were fabricated. Furthermore, the characteristic time-to-breakdown, TBD, of the MOS capacitors was investigated. The TBD was measured and the corresponding Weibull slopes, β, of the MOS capacitors with various LaAlO3 thicknesses were calculated. In addition, a modified percolation model was proposed to consider the extrinsic factors of breakdown. These extrinsic factors were described by an equivalent reduction of the path-to-breakdown, tex, in the model. Using this model, the calculated tex of the MOS capacitor was 5.8 nm.

  2. Turn-off Transient Analysis of a Double Diffused Metal-Oxide-Semiconductor Device Considering Quasi Saturation

    NASA Astrophysics Data System (ADS)

    Liu, Chung-Min; Kuo, James

    1995-02-01

    This paper reports the turn-off transient of a double diffused metal-oxide-semiconductor (DMOS) device considering the quasi-saturation behavior. Based on the two-dimensional (2D) simulation result, during the input ramp-down period of 100 ps, the accumulated electrons below the gate oxide are pushed toward the p region below the lateral channel toward the source, causing a surge in source current. After the input ramp-down period, these electrons are withdrawn from the drain by the quasi-saturation current.

  3. Models of second-order effects in metal-oxide-semiconductor field-effect transistors for computer applications

    NASA Technical Reports Server (NTRS)

    Benumof, Reuben; Zoutendyk, John; Coss, James

    1988-01-01

    Second-order effects in metal-oxide-semiconductor field-effect transistors (MOSFETs) are important for devices with dimensions of 2 microns or less. The short and narrow channel effects and drain-induced barrier lowering primarily affect threshold voltage, but formulas for drain current must also take these effects into account. In addition, the drain current is sensitive to channel length modulation due to pinch-off or velocity saturation and is diminished by electron mobility degradation due to normal and lateral electric fields in the channel. A model of a MOSFET including these considerations and emphasizing charge conservation is discussed.

  4. Plasmonic nanohole arrays on Si-Ge heterostructures: an approach for integrated biosensors

    NASA Astrophysics Data System (ADS)

    Augel, L.; Fischer, I. A.; Dunbar, L. A.; Bechler, S.; Berrier, A.; Etezadi, D.; Hornung, F.; Kostecki, K.; Ozdemir, C. I.; Soler, M.; Altug, H.; Schulze, J.

    2016-03-01

    Nanohole array surface plasmon resonance (SPR) sensors offer a promising platform for high-throughput label-free biosensing. Integrating nanohole arrays with group-IV semiconductor photodetectors could enable low-cost and disposable biosensors compatible to Si-based complementary metal oxide semiconductor (CMOS) technology that can be combined with integrated circuitry for continuous monitoring of biosamples and fast sensor data processing. Such an integrated biosensor could be realized by structuring a nanohole array in the contact metal layer of a photodetector. We used Fouriertransform infrared spectroscopy to investigate nanohole arrays in a 100 nm Al film deposited on top of a vertical Si-Ge photodiode structure grown by molecular beam epitaxy (MBE). We find that the presence of a protein bilayer, constitute of protein AG and Immunoglobulin G (IgG), leads to a wavelength-dependent absorptance enhancement of ~ 8 %.

  5. CMOS capacitive biosensors for highly sensitive biosensing applications.

    PubMed

    Chang, An-Yu; Lu, Michael S-C

    2013-01-01

    Magnetic microbeads are widely used in biotechnology and biomedical research for manipulation and detection of cells and biomolecules. Most lab-on-chip systems capable of performing manipulation and detection require external instruments to perform one of the functions, leading to increased size and cost. This work aims at developing an integrated platform to perform these two functions by implementing electromagnetic microcoils and capacitive biosensors on a CMOS (complementary metal oxide semiconductor) chip. Compared to most magnetic-type sensors, our detection method requires no externally applied magnetic fields and the associated fabrication is less complicated. In our experiment, microbeads coated with streptavidin were driven to the sensors located in the center of microcoils with functionalized anti-streptavidin antibody. Detection of a single microbead was successfully demonstrated using a capacitance-to-frequency readout. The average capacitance changes for the experimental and control groups were -5.3 fF and -0.2 fF, respectively.

  6. Characterization of metal oxide semiconductor field effect transistor dosimeters for application in clinical mammography.

    PubMed

    Benevides, Luis A; Hintenlang, David E

    2006-02-01

    Five high-sensitivity metal oxide semiconductor field effect transistor dosimeters in the TN-502 and 1002 series (Thomson Nielsen Electronics Ltd., 25B, Northside Road, Ottawa, ON K2H8S1, Canada) were evaluated for use in the mammography x-ray energy range (22-50 kVp) as a tool to assist in the documentation of patient specific average glandular dose. The dosimeters were interfaced with the Patient Dose Verification System, model No. TN-RD 15, which consisted of a dosimeter reader and up to four dual bias power supplies. Two different dual bias power supplies were evaluated in this study, model No. TN-RD 22 in high-sensitivity mode and a very-high sensitivity prototype. Each bias supply accommodates up to five dosimeters for 20 dosimeters per system. Sensitivity of detectors, defined as the mV/C kg(-1), was measured free in air with the bubble side of the dosimeter facing the x-ray field with a constant exposure. All dosimeter models' angular response showed a marked decrease in response when oriented between 120 degrees and 150 degrees and between at 190 degrees and 220 degrees relative to the incident beam. Sensitivity was evaluated for Mo/Mo, Mo/Rh, and Rh/Rh target-filter combinations. The individual dosimeter model sensitiVity was 4.45 x 10(4) mV/C kg(-1) (11.47 mV R(-1)) for TN-502RDS(micro); 5.93 x 10(4) mV per C kg(-1) (15.31 mV R(-1)) for TN-1002RD; 6.06 x 10(4) mV/C kg(-1) (15.63 mV R(-1)) for TN-1002RDI; 9.49 x 10(4) mV per C kg(-1) (24.49 mV R(-1)) for TN-1002RDM (micro); and 11.20 x 10(4) mV/C kg(-1) (28.82 mV R(-1)) for TN-1002RDS (micro). The energy response is presented and is observed to vary with dosimeter model, generally increasing with tube potential through the mammography energy range. An intercomparison of the high-sensitivity mode of TN-RD-22 was made to the very-high sensitivity bias power supply using a Mo/Mo target-filter. The very-high sensitivity-bias power supply increased dosimeter response by 1.45 +/- 0.04 for dosimeter models TN

  7. Drift region doping effects on characteristics and reliability of high-voltage n-type metal-oxide-semiconductor transistors

    NASA Astrophysics Data System (ADS)

    Chen, Jone F.; Chang, Chun-Po; Liu, Yu Ming; Tsai, Yan-Lin; Hsu, Hao-Tang; Chen, Chih-Yuan; Hwang, Hann-Ping

    2016-01-01

    In this study, off-state breakdown voltage (VBD) and hot-carrier-induced degradation in high-voltage n-type metal-oxide-semiconductor transistors with various BF2 implantation doses in the n- drift region are investigated. Results show that a higher BF2 implantation dose results in a higher VBD but leads to a greater hot-carrier-induced device degradation. Experimental data and technology computer-aided design simulations suggest that the higher VBD is due to the suppression of gate-induced drain current. On the other hand, the greater hot-carrier-induced device degradation can be explained by a lower net donor concentration and a different current-flow path, which is closer to the Si-SiO2 interface.

  8. Interface states and internal photoemission in p-type GaAs metal-oxide-semiconductor surfaces

    NASA Technical Reports Server (NTRS)

    Kashkarov, P. K.; Kazior, T. E.; Lagowski, J.; Gatos, H. C.

    1983-01-01

    An interface photodischarge study of p-type GaAs metal-oxide-semiconductor (MOS) structures revealed the presence of deep interface states and shallow donors and acceptors which were previously observed in n-type GaAs MOS through sub-band-gap photoionization transitions. For higher photon energies, internal photoemission was observed, i.e., injection of electrons to the conduction band of the oxide from either the metal (Au) or from the GaAs valence band; the threshold energies were found to be 3.25 and 3.7 + or - 0.1 eV, respectively. The measured photoemission current exhibited a thermal activation energy of about 0.06 eV, which is consistent with a hopping mechanism of electron transport in the oxide.

  9. Anomalous degradation of low-field mobility in short-channel metal-oxide-semiconductor field-effect transistors

    NASA Astrophysics Data System (ADS)

    Natori, Kenji; Iwai, Hiroshi; Kakushima, Kuniyuki

    2015-12-01

    The anomalous degradation of the low-field mobility observed in short-channel metal-oxide-semiconductor field-effect transistors is analyzed by collating various reported data in experiments and simulations. It is inferred that the degradation is not caused by the channel scattering of the carriers. The origin is proposed to be the backscattering of channel carriers on injection into the drain. The expression of the low-field mobility, including the backscattering effect, is derived. The inverse of the low-field mobility is a linear function of the inverse of channel length, the expression of which reproduces that empirically derived by Bidal's group. By fitting the expression to simulated as well as experimental data, we can estimate the value of parameters related to the channel scattering and also to the backscattering from the drain. We find that these values are in reasonable magnitude.

  10. Experimental study on vertical scaling of InAs-on-insulator metal-oxide-semiconductor field-effect transistors

    SciTech Connect

    Kim, SangHyeon E-mail: sh-kim@kist.re.kr; Yokoyama, Masafumi; Nakane, Ryosho; Takenaka, Mitsuru; Takagi, Shinichi; Ichikawa, Osamu; Osada, Takenori; Hata, Masahiko

    2014-06-30

    We have investigated effects of the vertical scaling on electrical properties in extremely thin-body InAs-on-insulator (-OI) metal-oxide-semiconductor field-effect transistors (MOSFETs). It is found that the body thickness (T{sub body}) scaling provides better short channel effect (SCE) control, whereas the T{sub body} scaling also causes the reduction of the mobility limited by channel thickness fluctuation (δT{sub body}) scattering (μ{sub fluctuation}). Also, in order to achieve better SCEs control, the thickness of InAs channel layer (T{sub channel}) scaling is more favorable than the thickness of MOS interface buffer layer (T{sub buffer}) scaling from a viewpoint of a balance between SCEs control and μ{sub fluctuation} reduction. These results indicate necessity of quantum well channel structure in InAs-OI MOSFETs and these should be considered in future transistor design.

  11. Semi-classical noise investigation for sub-40nm metal-oxide-semiconductor field-effect transistors

    SciTech Connect

    Spathis, C. Birbas, A.; Georgakopoulou, K.

    2015-08-15

    Device white noise levels in short channel Metal-Oxide-Semiconductor Field-Effect Transistors (MOSFETs) dictate the performance and reliability of high-frequency circuits ranging from high-speed microprocessors to Low-Noise Amplifiers (LNAs) and microwave circuits. Recent experimental noise measurements with very short devices demonstrate the existence of suppressed shot noise, contrary to the predictions of classical channel thermal noise models. In this work we show that, as the dimensions continue to shrink, shot noise has to be considered when the channel resistance becomes comparable to the barrier resistance at the source-channel junction. By adopting a semi-classical approach and taking retrospectively into account transport, short-channel and quantum effects, we investigate the partitioning between shot and thermal noise, and formulate a predictive model that describes the noise characteristics of modern devices.

  12. Monolithic integration of GaN-based light-emitting diodes and metal-oxide-semiconductor field-effect transistors.

    PubMed

    Lee, Ya-Ju; Yang, Zu-Po; Chen, Pin-Guang; Hsieh, Yung-An; Yao, Yung-Chi; Liao, Ming-Han; Lee, Min-Hung; Wang, Mei-Tan; Hwang, Jung-Min

    2014-10-20

    In this study, we report a novel monolithically integrated GaN-based light-emitting diode (LED) with metal-oxide-semiconductor field-effect transistor (MOSFET). Without additionally introducing complicated epitaxial structures for transistors, the MOSFET is directly fabricated on the exposed n-type GaN layer of the LED after dry etching, and serially connected to the LED through standard semiconductor-manufacturing technologies. Such monolithically integrated LED/MOSFET device is able to circumvent undesirable issues that might be faced by other kinds of integration schemes by growing a transistor on an LED or vice versa. For the performances of resulting device, our monolithically integrated LED/MOSFET device exhibits good characteristics in the modulation of gate voltage and good capability of driving injected current, which are essential for the important applications such as smart lighting, interconnection, and optical communication.

  13. Metallic precipitate contribution to carrier generation in metal-oxide-semiconductor capacitors due to the Schottky effect

    NASA Astrophysics Data System (ADS)

    Negoita, M. D.; Tan, T. Y.

    2004-01-01

    The contribution of metallic precipitates to carrier generation has been modeled for metal-oxide-semiconductor (MOS) capacitor devices fabricated using Si, with the precipitate located in the depletion region of the device. The physical mechanism responsible for the electrical activity of the metallic precipitate is attributed to the Schottky junction property between the precipitate and the Si matrix materials. The precipitate serves as a highly effective carrier generation center when the capacitor is switched from the accumulation mode to the deep depletion mode. As a practical case, the electrical activity of the Cu3Si precipitate is investigated and the impact of the precipitate located at different positions within the depleted region of the MOS capacitor on the device performance degradation is analyzed.

  14. Modeling of graphene metal-oxide-semiconductor field-effect transistors with gapless large-area graphene channels

    NASA Astrophysics Data System (ADS)

    Thiele, S. A.; Schaefer, J. A.; Schwierz, F.

    2010-05-01

    A quasianalytical modeling approach for graphene metal-oxide-semiconductor field-effect transistors (MOSFETs) with gapless large-area graphene channels is presented. The model allows the calculation of the I-V characteristics, the small-signal behavior, and the cutoff frequency of graphene MOSFETs. It applies a correct formulation of the density of states in large-area graphene to calculate the carrier-density-dependent quantum capacitance, a steady-state velocity-field characteristics with soft saturation to describe the carrier transport, and takes the source/drain series resistances into account. The modeled drain currents and transconductances show very good agreement with experimental data taken from the literature {Meric et al., [Nat. Nanotechnol. 3, 654 (2008)] and Kedzierski et al., [IEEE Electron Device Lett. 30, 745 (2009)]}. In particular, the model properly reproduces the peculiar saturation behavior of graphene MOSFETs with gapless channels.

  15. SOI metal-oxide-semiconductor field-effect transistor photon detector based on single-hole counting.

    PubMed

    Du, Wei; Inokawa, Hiroshi; Satoh, Hiroaki; Ono, Atsushi

    2011-08-01

    In this Letter, a scaled-down silicon-on-insulator (SOI) metal-oxide-semiconductor field-effect transistor (MOSFET) is characterized as a photon detector, where photogenerated individual holes are trapped below the negatively biased gate and modulate stepwise the electron current flowing in the bottom channel induced by the positive substrate bias. The output waveforms exhibit clear separation of current levels corresponding to different numbers of trapped holes. Considering this capability of single-hole counting, a small dark count of less than 0.02 s(-1) at room temperature, and low operation voltage of 1 V, SOI MOSFET could be a unique photon-number-resolving detector if the small quantum efficiency were improved.

  16. Hydrogen-terminated diamond vertical-type metal oxide semiconductor field-effect transistors with a trench gate

    NASA Astrophysics Data System (ADS)

    Inaba, Masafumi; Muta, Tsubasa; Kobayashi, Mikinori; Saito, Toshiki; Shibata, Masanobu; Matsumura, Daisuke; Kudo, Takuya; Hiraiwa, Atsushi; Kawarada, Hiroshi

    2016-07-01

    The hydrogen-terminated diamond surface (C-H diamond) has a two-dimensional hole gas (2DHG) layer independent of the crystal orientation. A 2DHG layer is ubiquitously formed on the C-H diamond surface covered by atomic-layer-deposited-Al2O3. Using Al2O3 as a gate oxide, C-H diamond metal oxide semiconductor field-effect transistors (MOSFETs) operate in a trench gate structure where the diamond side-wall acts as a channel. MOSFETs with a side-wall channel exhibit equivalent performance to the lateral C-H diamond MOSFET without a side-wall channel. Here, a vertical-type MOSFET with a drain on the bottom is demonstrated in diamond with channel current modulation by the gate and pinch off.

  17. A compact quantum correction model for symmetric double gate metal-oxide-semiconductor field-effect transistor

    SciTech Connect

    Cho, Edward Namkyu; Shin, Yong Hyeon; Yun, Ilgu

    2014-11-07

    A compact quantum correction model for a symmetric double gate (DG) metal-oxide-semiconductor field-effect transistor (MOSFET) is investigated. The compact quantum correction model is proposed from the concepts of the threshold voltage shift (ΔV{sub TH}{sup QM}) and the gate capacitance (C{sub g}) degradation. First of all, ΔV{sub TH}{sup QM} induced by quantum mechanical (QM) effects is modeled. The C{sub g} degradation is then modeled by introducing the inversion layer centroid. With ΔV{sub TH}{sup QM} and the C{sub g} degradation, the QM effects are implemented in previously reported classical model and a comparison between the proposed quantum correction model and numerical simulation results is presented. Based on the results, the proposed quantum correction model can be applicable to the compact model of DG MOSFET.

  18. Charge-flow structures as polymeric early-warning fire alarm devices. M.S. Thesis; [metal oxide semiconductors

    NASA Technical Reports Server (NTRS)

    Sechen, C. M.; Senturia, S. D.

    1977-01-01

    The charge-flow transistor (CFT) and its applications for fire detection and gas sensing were investigated. The utility of various thin film polymers as possible sensing materials was determined. One polymer, PAPA, showed promise as a relative humidity sensor; two others, PFI and PSB, were found to be particularly suitable for fire detection. The behavior of the charge-flow capacitor, which is basically a parallel-plate capacitor with a polymer-filled gap in the metallic tip electrode, was successfully modeled as an RC transmission line. Prototype charge-flow transistors were fabricated and tested. The effective threshold voltage of this metal oxide semiconductor was found to be dependent on whether surface or bulk conduction in the thin film was dominant. Fire tests with a PFI-coated CFT indicate good sensitivity to smouldering fires.

  19. Nanowire Metal-Oxide-Semiconductor Field-Effect Transistors with Small Subthreshold Swing Driven by Body-Bias Effect

    NASA Astrophysics Data System (ADS)

    Nishiguchi, Katsuhiko; Fujiwara, Akira

    2012-08-01

    We demonstrate metal-oxide-semiconductor field-effect transistors (MOSFETs) with small subthreshold swing (SS). The MOSFETs have a nanowire channel and three gates. A parasitic bipolar transistor formed in a fully depleted silicon-on-insulator MOSFET applies body bias to the MOSFET's channel and thus reduces the SS. Additionally, triple-gate operation makes the drain voltage smaller and provides current characteristics with a high on/off ratio and small hysteresis. As a result, SSs of the n- and p-type MOSFETs reach 6.6 and 5.2 mV/dec, respectively, in the range of current of six orders of magnitude. These features promise MOSFETs with low power consumption.

  20. HfxAlyO ternary dielectrics for InGaAs based metal-oxide-semiconductor capacitors

    NASA Astrophysics Data System (ADS)

    Krylov, Igor; Ritter, Dan; Eizenberg, Moshe

    2017-07-01

    The electrical properties of HfxAlyO compound dielectric films and the HfxAlyO/InGaAs interface are reported for various dielectric film compositions. Despite the same trimethylaluminum (TMA) pre-deposition treatment, dispersion in accumulation and capacitance-voltage (C-V) hysteresis increased with hafnium content. Different kinds of border traps were identified as being responsible for the phenomena. After anneal, the density of states in the HfxAlyO/InGaAs interface varied quite weakly with dielectric film composition. The optimal composition for obtaining high inversion charge density in metal oxide semiconductor gate stacks is determined by a tradeoff between leakage and dielectric constant, with the optimum atomic cation ratio ([Hf]/[Al]) of ˜1.

  1. Hydrogen-terminated diamond vertical-type metal oxide semiconductor field-effect transistors with a trench gate

    SciTech Connect

    Inaba, Masafumi Muta, Tsubasa; Kobayashi, Mikinori; Saito, Toshiki; Shibata, Masanobu; Matsumura, Daisuke; Kudo, Takuya; Hiraiwa, Atsushi; Kawarada, Hiroshi

    2016-07-18

    The hydrogen-terminated diamond surface (C-H diamond) has a two-dimensional hole gas (2DHG) layer independent of the crystal orientation. A 2DHG layer is ubiquitously formed on the C-H diamond surface covered by atomic-layer-deposited-Al{sub 2}O{sub 3}. Using Al{sub 2}O{sub 3} as a gate oxide, C-H diamond metal oxide semiconductor field-effect transistors (MOSFETs) operate in a trench gate structure where the diamond side-wall acts as a channel. MOSFETs with a side-wall channel exhibit equivalent performance to the lateral C-H diamond MOSFET without a side-wall channel. Here, a vertical-type MOSFET with a drain on the bottom is demonstrated in diamond with channel current modulation by the gate and pinch off.

  2. Ultraviolet-visible electroluminescence from metal-oxide-semiconductor devices with CeO{sub 2} films on silicon

    SciTech Connect

    Lv, Chunyan; Zhu, Chen; Wang, Canxing; Li, Dongsheng; Ma, Xiangyang Yang, Deren

    2015-03-15

    We report on ultraviolet-visible (UV-Vis) electroluminescence (EL) from metal-oxide-semiconductor (MOS) devices with the CeO{sub 2} films annealed at low temperatures. At the same injection current, the UV-Vis EL from the MOS device with the 550 °C-annealed CeO{sub 2} film is much stronger than that from the counterpart with the 450 °C-annealed CeO{sub 2} film. This is due to that the 550 °C-annealed CeO{sub 2} film contains more Ce{sup 3+} ions and oxygen vacancies. It is tentatively proposed that the recombination of the electrons in multiple oxygen-vacancy–related energy levels with the holes in Ce 4f{sup 1} energy band pertaining to Ce{sup 3+} ions leads to the UV-Vis EL.

  3. Nonvolatile Memory Effect in Indium Gallium Arsenide-Based Metal-Oxide-Semiconductor Devices Using II-VI Tunnel Insulators

    NASA Astrophysics Data System (ADS)

    Chan, P.-Y.; Gogna, M.; Suarez, E.; Karmakar, S.; Al-Amoody, F.; Miller, B. I.; Jain, F. C.

    2011-08-01

    This paper reports the successful use of ZnSe/ZnS/ZnMgS/ZnS/ZnSe as a gate insulator stack for an InGaAs-based metal-oxide-semiconductor (MOS) device, and demonstrates the threshold voltage shift required in nonvolatile memory devices using a floating gate quantum dot layer. An InGaAs-based nonvolatile memory MOS device was fabricated using a high- κ II-VI tunnel insulator stack and self-assembled GeO x -cladded Ge quantum dots as the charge storage units. A Si3N4 layer was used as the control gate insulator. Capacitance-voltage data showed that, after applying a positive voltage to the gate of a MOS device, charges were being stored in the quantum dots. This was shown by the shift in the flat-band/threshold voltage, simulating the write process of a nonvolatile memory device.

  4. Effective control on flat band voltage of epitaxial lanthanide oxide based metal oxide semiconductor capacitors by interfacial carbon

    NASA Astrophysics Data System (ADS)

    Laha, Apurba; Fissel, A.; Osten, H. J.

    2013-05-01

    Present work addresses the issue of flat band voltage instability engendered by the presence of large number of fixed charges and interface traps at and close to the interface of metal oxide semiconductor capacitors. We show that submonolayer of C incorporation onto Si surface prior to epitaxial lanthanide oxides (Ln2O3: Gd2O3, Nd2O3) deposition can significantly improve their electrical properties. Ultraviolet photoelectric spectroscopy shows that most of the intrinsic surface states that stem from the dangling bonds on Si surface disappear after passivation with C. The flat band voltage of Pt/Gd2O3/Si MOS capacitors can be tuned in a controlled manner by systematic incorporation of C onto Si surface, effectively at Gd2O3-Si interface.

  5. Interface states and internal photoemission in p-type GaAs metal-oxide-semiconductor surfaces

    NASA Technical Reports Server (NTRS)

    Kashkarov, P. K.; Kazior, T. E.; Lagowski, J.; Gatos, H. C.

    1983-01-01

    An interface photodischarge study of p-type GaAs metal-oxide-semiconductor (MOS) structures revealed the presence of deep interface states and shallow donors and acceptors which were previously observed in n-type GaAs MOS through sub-band-gap photoionization transitions. For higher photon energies, internal photoemission was observed, i.e., injection of electrons to the conduction band of the oxide from either the metal (Au) or from the GaAs valence band; the threshold energies were found to be 3.25 and 3.7 + or - 0.1 eV, respectively. The measured photoemission current exhibited a thermal activation energy of about 0.06 eV, which is consistent with a hopping mechanism of electron transport in the oxide.

  6. Semi-classical noise investigation for sub-40nm metal-oxide-semiconductor field-effect transistors

    NASA Astrophysics Data System (ADS)

    Spathis, C.; Birbas, A.; Georgakopoulou, K.

    2015-08-01

    Device white noise levels in short channel Metal-Oxide-Semiconductor Field-Effect Transistors (MOSFETs) dictate the performance and reliability of high-frequency circuits ranging from high-speed microprocessors to Low-Noise Amplifiers (LNAs) and microwave circuits. Recent experimental noise measurements with very short devices demonstrate the existence of suppressed shot noise, contrary to the predictions of classical channel thermal noise models. In this work we show that, as the dimensions continue to shrink, shot noise has to be considered when the channel resistance becomes comparable to the barrier resistance at the source-channel junction. By adopting a semi-classical approach and taking retrospectively into account transport, short-channel and quantum effects, we investigate the partitioning between shot and thermal noise, and formulate a predictive model that describes the noise characteristics of modern devices.

  7. Impedance analysis of Al{sub 2}O{sub 3}/H-terminated diamond metal-oxide-semiconductor structures

    SciTech Connect

    Liao, Meiyong; Liu, Jiangwei; Imura, Masataka; Koide, Yasuo; Sang, Liwen; Coathup, David; Li, Jiangling; Ye, Haitao

    2015-02-23

    Impedance spectroscopy (IS) analysis is carried out to investigate the electrical properties of the metal-oxide-semiconductor (MOS) structure fabricated on hydrogen-terminated single crystal diamond. The low-temperature atomic layer deposition Al{sub 2}O{sub 3} is employed as the insulator in the MOS structure. By numerically analysing the impedance of the MOS structure at various biases, the equivalent circuit of the diamond MOS structure is derived, which is composed of two parallel capacitive and resistance pairs, in series connection with both resistance and inductance. The two capacitive components are resulted from the insulator, the hydrogenated-diamond surface, and their interface. The physical parameters such as the insulator capacitance are obtained, circumventing the series resistance and inductance effect. By comparing the IS and capacitance-voltage measurements, the frequency dispersion of the capacitance-voltage characteristic is discussed.

  8. Fabrication and characterization on width of spiral interdigitated electrodes based biosensors

    NASA Astrophysics Data System (ADS)

    Adelyn, P. Y. P.; Hashim, U.; Arshad, M. K. Md; Ruslinda, A. R.; Voon, C. H.; Ayub, R. M.; Gopinath, Subash C. B.; Liu, Wei-Wen; Kahar, S. M.; Huda, A. R. N.; Lee, H. Cheun

    2017-03-01

    Simple and inexpensive mask layout design on a transparency film were demonstrated using the conventional complementary metal oxide semiconductor (CMOS) technique to produce interdigitated electrodes (IDEs) for biomedical biosensors applications. Lift-off techniques were implemented during photolithography process in order to pattern an electrode widths of 200µm, 300µm, 400µm and 500µm, respectively with a standardized 400µm gap spacing spiral IDEs. Due to the effect of the transparent mask, a fabrication of these spiral IDEs resulted in shrinkage of electrode width and increment of the gap spacing. Among these electrode sizes, the conductance of 300µm, 400µm and 500µm electrode width were successfully examined as compared to 200µm.

  9. Biodegradable elastomers and silicon nanomembranes/nanoribbons for stretchable, transient electronics, and biosensors.

    PubMed

    Hwang, Suk-Won; Lee, Chi Hwan; Cheng, Huanyu; Jeong, Jae-Woong; Kang, Seung-Kyun; Kim, Jae-Hwan; Shin, Jiho; Yang, Jian; Liu, Zhuangjian; Ameer, Guillermo A; Huang, Yonggang; Rogers, John A

    2015-05-13

    Transient electronics represents an emerging class of technology that exploits materials and/or device constructs that are capable of physically disappearing or disintegrating in a controlled manner at programmed rates or times. Inorganic semiconductor nanomaterials such as silicon nanomembranes/nanoribbons provide attractive choices for active elements in transistors, diodes and other essential components of overall systems that dissolve completely by hydrolysis in biofluids or groundwater. We describe here materials, mechanics, and design layouts to achieve this type of technology in stretchable configurations with biodegradable elastomers for substrate/encapsulation layers. Experimental and theoretical results illuminate the mechanical properties under large strain deformation. Circuit characterization of complementary metal-oxide-semiconductor inverters and individual transistors under various levels of applied loads validates the design strategies. Examples of biosensors demonstrate possibilities for stretchable, transient devices in biomedical applications.

  10. A Programmable Difference-of-Gaussian Analog Complementary Metal Oxide Semiconductor Image Sensor Operating in the Subthreshold Regime

    NASA Astrophysics Data System (ADS)

    Wang, Zheye; Shibata, Tadashi

    2013-04-01

    A difference-of-Gaussian (DoG) analog CMOS image sensor architecture in which the kernel size and shape are made arbitrarily programmable has been developed based on the MOS subthreshold characteristics. The variability of MOS transistor threshold voltage causes a serious problem in the circuits operating in the subthreshold regime because the current varies exponentially depending on the threshold voltage. The problem has been alleviated by introducing a cancellation scheme employing a switched floating-gate MOS (neuMOS) circuitry. A proof-of-concept chip was designed in a 0.18-µm CMOS technology. The operation of the designed circuits was investigated by SPICE (simulation program with integrated circuit emphasis) simulation and their basic functions were demonstrated. A part of the core function, i.e., the generation of the Gaussian function profile, was confirmed by the measurement of a fabricated test circuit.

  11. Organic CuTCNQ integrated in complementary metal oxide semiconductor copper back end-of-line for nonvolatile memories

    NASA Astrophysics Data System (ADS)

    Müller, R.; De Jonge, S.; Myny, K.; Wouters, D. J.; Genoe, J.; Heremans, P.

    2006-11-01

    Nanowires of the organometallic semiconductor CuTCNQ were grown from TCNQ vapor in 250nm diameter vias of a Cu back end-of-line process. Corresponding prototypes of cross-point Cu /CuTCNQ nanowire/Al memories exhibited nonvolatile bistable conductive switching for several ten write-erase cycles with switching currents below 10μA and current densities 1000 times higher than for large-area devices. Scaling of memory elements was also investigated.

  12. An ultrasensitive method of real time pH monitoring with complementary metal oxide semiconductor image sensor.

    PubMed

    Devadhasan, Jasmine Pramila; Kim, Sanghyo

    2015-02-09

    CMOS sensors are becoming a powerful tool in the biological and chemical field. In this work, we introduce a new approach on quantifying various pH solutions with a CMOS image sensor. The CMOS image sensor based pH measurement produces high-accuracy analysis, making it a truly portable and user friendly system. pH indicator blended hydrogel matrix was fabricated as a thin film to the accurate color development. A distinct color change of red, green and blue (RGB) develops in the hydrogel film by applying various pH solutions (pH 1-14). The semi-quantitative pH evolution was acquired by visual read out. Further, CMOS image sensor absorbs the RGB color intensity of the film and hue value converted into digital numbers with the aid of an analog-to-digital converter (ADC) to determine the pH ranges of solutions. Chromaticity diagram and Euclidean distance represent the RGB color space and differentiation of pH ranges, respectively. This technique is applicable to sense the various toxic chemicals and chemical vapors by situ sensing. Ultimately, the entire approach can be integrated into smartphone and operable with the user friendly manner. Copyright © 2014 Elsevier B.V. All rights reserved.

  13. A hybrid magnetic/complementary metal oxide semiconductor three-context memory bit cell for non-volatile circuit design

    NASA Astrophysics Data System (ADS)

    Jovanović, B.; Brum, R. M.; Torres, L.

    2014-04-01

    After decades of continued scaling to the beat of Moore's law, it now appears that conventional silicon based devices are approaching their physical limits. In today's deep-submicron nodes, a number of short-channel and quantum effects are emerging that affect the manufacturing process, as well as, the functionality of the microelectronic systems-on-chip. Spintronics devices that exploit both the intrinsic spin of the electron and its associated magnetic moment, in addition to its fundamental electronic charge, are promising solutions to circumvent these scaling threats. Being compatible with the CMOS technology, such devices offer a promising synergy of radiation immunity, infinite endurance, non-volatility, increased density, etc. In this paper, we present a hybrid (magnetic/CMOS) cell that is able to store and process data both electrically and magnetically. The cell is based on perpendicular spin-transfer torque magnetic tunnel junctions (STT-MTJs) and is suitable for use in magnetic random access memories and reprogrammable computing (non-volatile registers, processor cache memories, magnetic field-programmable gate arrays, etc). To demonstrate the potential our hybrid cell, we physically implemented a small hybrid memory block using 45 nm × 45 nm round MTJs for the magnetic part and 28 nm fully depleted silicon on insulator (FD-SOI) technology for the CMOS part. We also report the cells measured performances in terms of area, robustness, read/write speed and energy consumption.

  14. Image stacking approach to increase sensitivity of fluorescence detection using a low cost complementary metal-oxide-semiconductor (CMOS) webcam

    PubMed Central

    Balsam, Joshua; Bruck, Hugh Alan; Kostov, Yordan; Rasooly, Avraham

    2013-01-01

    Optical technologies are important for biological analysis. Current biomedical optical analyses rely on high-cost, high-sensitivity optical detectors such as photomultipliers, avalanched photodiodes or cooled CCD cameras. In contrast, Webcams, mobile phones and other popular consumer electronics use lower-sensitivity, lower-cost optical components such as photodiodes or CMOS sensors. In order for consumer electronics devices, such as webcams, to be useful for biomedical analysis, they must have increased sensitivity. We combined two strategies to increase the sensitivity of CMOS-based fluorescence detector. We captured hundreds of low sensitivity images using a Webcam in video mode, instead of a single image typically used in cooled CCD devices.We then used a computational approach consisting of an image stacking algorithm to remove the noise by combining all of the images into a single image. While video mode is widely used for dynamic scene imaging (e.g. movies or time-lapse photography), it is not used to capture a single static image, which removes noise and increases sensitivity by more than thirty fold. The portable, battery-operated Webcam-based fluorometer system developed here consists of five modules: (1) a low cost CMOS Webcam to monitor light emission, (2) a plate to perform assays, (3) filters and multi-wavelength LED illuminator for fluorophore excitation, (4) a portable computer to acquire and analyze images, and (5) image stacking software for image enhancement. The samples consisted of various concentrations of fluorescein, ranging from 30 μM to 1000 μM, in a 36-well miniature plate. In the single frame mode, the fluorometer's limit-of-detection (LOD) for fluorescein is ∼1000 μM, which is relatively insensitive. However, when used in video mode combined with image stacking enhancement, the LOD is dramatically reduced to 30 μM, sensitivity which is similar to that of state-of-the-art ELISA plate photomultiplier-based readers. Numerous medical diagnostics assays rely on optical and fluorescence readers. Our novel combination of detection technologies, which is new to biodetection may enable the development of new low cost optical detectors based on an inexpensive Webcam (<$10). It has the potential to form the basis for high sensitivity, low cost medical diagnostics in resource-poor settings. PMID:23990697

  15. A hybrid magnetic/complementary metal oxide semiconductor three-context memory bit cell for non-volatile circuit design

    SciTech Connect

    Jovanović, B. E-mail: lionel.torres@lirmm.fr; Brum, R. M.; Torres, L.

    2014-04-07

    After decades of continued scaling to the beat of Moore's law, it now appears that conventional silicon based devices are approaching their physical limits. In today's deep-submicron nodes, a number of short-channel and quantum effects are emerging that affect the manufacturing process, as well as, the functionality of the microelectronic systems-on-chip. Spintronics devices that exploit both the intrinsic spin of the electron and its associated magnetic moment, in addition to its fundamental electronic charge, are promising solutions to circumvent these scaling threats. Being compatible with the CMOS technology, such devices offer a promising synergy of radiation immunity, infinite endurance, non-volatility, increased density, etc. In this paper, we present a hybrid (magnetic/CMOS) cell that is able to store and process data both electrically and magnetically. The cell is based on perpendicular spin-transfer torque magnetic tunnel junctions (STT-MTJs) and is suitable for use in magnetic random access memories and reprogrammable computing (non-volatile registers, processor cache memories, magnetic field-programmable gate arrays, etc). To demonstrate the potential our hybrid cell, we physically implemented a small hybrid memory block using 45 nm × 45 nm round MTJs for the magnetic part and 28 nm fully depleted silicon on insulator (FD-SOI) technology for the CMOS part. We also report the cells measured performances in terms of area, robustness, read/write speed and energy consumption.

  16. Characterization of near-terahertz complementary metal-oxide semiconductor circuits using a Fourier-transform interferometer

    DOE PAGES

    Arenas, D. J.; Shim, Dongha; Koukis, D. I.; ...

    2011-10-24

    Optical methods for measuring of the emission spectra of oscillator circuits operating in the 400-600 GHz range are described. The emitted power from patch antennas included in the circuits is measured by placing the circuit in the source chamber of a Fourier-transform interferometric spectrometer. The results show that this optical technique is useful for measuring circuits pushing the frontier in operating frequency. The technique also allows the characterization of the circuit by measuring the power radiated in the fundamental and in the harmonics. This capability is useful for oscillator architectures designed to cancel the fundamental and use higher harmonics. Themore » radiated power was measured using two techniques: direct measurement of the power by placing the device in front of a bolometer of known responsivity, and by comparison to the estimated power from blackbody sources. The latter technique showed that these circuits have higher emission than blackbody sources at the operating frequencies, and, therefore, offer potential spectroscopy applications.« less

  17. Characterization of near-terahertz complementary metal-oxide semiconductor circuits using a Fourier-transform interferometer

    SciTech Connect

    Arenas, D. J.; Shim, Dongha; Koukis, D. I.; Seok, Eunyoung; Tanner, D. B.; O, Kenneth K.

    2011-10-24

    Optical methods for measuring of the emission spectra of oscillator circuits operating in the 400-600 GHz range are described. The emitted power from patch antennas included in the circuits is measured by placing the circuit in the source chamber of a Fourier-transform interferometric spectrometer. The results show that this optical technique is useful for measuring circuits pushing the frontier in operating frequency. The technique also allows the characterization of the circuit by measuring the power radiated in the fundamental and in the harmonics. This capability is useful for oscillator architectures designed to cancel the fundamental and use higher harmonics. The radiated power was measured using two techniques: direct measurement of the power by placing the device in front of a bolometer of known responsivity, and by comparison to the estimated power from blackbody sources. The latter technique showed that these circuits have higher emission than blackbody sources at the operating frequencies, and, therefore, offer potential spectroscopy applications.

  18. Modeling the dark current histogram induced by gold contamination in complementary-metal-oxide-semiconductor image sensors

    SciTech Connect

    Domengie, F. Morin, P.; Bauza, D.

    2015-07-14

    We propose a model for dark current induced by metallic contamination in a CMOS image sensor. Based on Shockley-Read-Hall kinetics, the expression of dark current proposed accounts for the electric field enhanced emission factor due to the Poole-Frenkel barrier lowering and phonon-assisted tunneling mechanisms. To that aim, we considered the distribution of the electric field magnitude and metal atoms in the depth of the pixel. Poisson statistics were used to estimate the random distribution of metal atoms in each pixel for a given contamination dose. Then, we performed a Monte-Carlo-based simulation for each pixel to set the number of metal atoms the pixel contained and the enhancement factor each atom underwent, and obtained a histogram of the number of pixels versus dark current for the full sensor. Excellent agreement with the dark current histogram measured on an ion-implanted gold-contaminated imager has been achieved, in particular, for the description of the distribution tails due to the pixel regions in which the contaminant atoms undergo a large electric field. The agreement remains very good when increasing the temperature by 15 °C. We demonstrated that the amplification of the dark current generated for the typical electric fields encountered in the CMOS image sensors, which depends on the nature of the metal contaminant, may become very large at high electric field. The electron and hole emissions and the resulting enhancement factor are described as a function of the trap characteristics, electric field, and temperature.

  19. Nonvolatile and tunable switching of lateral photo-voltage triggered by laser and electric pulse in metal dusted metal-oxide-semiconductor structures

    PubMed Central

    Zhou, Peiqi; Gan, Zhikai; Huang, Xu; Mei, Chunlian; Huang, Meizhen; Xia, Yuxing; Wang, Hui

    2016-01-01

    Owing to the innate stabilization of built-in potential in p–n junction or metal-oxide-semiconductor structure, the sensitivity and linearity of most lateral photovoltaic effect (LPE) devices is always fixed after fabrication. Here we report a nonvolatile and tunable switching effect of lateral photo-voltage (LPV) in Cu dusted ultrathin metal-oxide-semiconductor structure. With the stimulation of electric pulse and local illumination, the sensitivity and linearity of LPV can be adjusted up and down in a nonvolatile manner. This phenomenon is attributed to a controllable change of the Schottky barrier formed between the metal layer and silicon substrate, including the consequent change of film resistivity. This work may widely improve the performance of existing LPE-based devices and suggest new applications for LPE in other areas. PMID:27535351

  20. Nonvolatile and tunable switching of lateral photo-voltage triggered by laser and electric pulse in metal dusted metal-oxide-semiconductor structures.

    PubMed

    Zhou, Peiqi; Gan, Zhikai; Huang, Xu; Mei, Chunlian; Huang, Meizhen; Xia, Yuxing; Wang, Hui

    2016-08-18

    Owing to the innate stabilization of built-in potential in p-n junction or metal-oxide-semiconductor structure, the sensitivity and linearity of most lateral photovoltaic effect (LPE) devices is always fixed after fabrication. Here we report a nonvolatile and tunable switching effect of lateral photo-voltage (LPV) in Cu dusted ultrathin metal-oxide-semiconductor structure. With the stimulation of electric pulse and local illumination, the sensitivity and linearity of LPV can be adjusted up and down in a nonvolatile manner. This phenomenon is attributed to a controllable change of the Schottky barrier formed between the metal layer and silicon substrate, including the consequent change of film resistivity. This work may widely improve the performance of existing LPE-based devices and suggest new applications for LPE in other areas.

  1. Proposal of Trench-Oxide Metal-Oxide-Semiconductor Structure and Computer Simulation of Silicon Quantum-Wire Characteristics

    NASA Astrophysics Data System (ADS)

    Tsukui, Tetsuya; Oda, Shunri

    1993-12-01

    We propose “trench-oxide metal-oxide-semiconductor (MOS)” structures as a novel formation method of silicon-based low-dimensional quantum structures, which are considered to be basic elements of future ultrahigh-speed and ultralarge-scale integrated devices. In this method, the applied gate voltage forms the potential well confined in an additional direction defined by ultrafine “trenches” on the oxide layer of the MOS structure. We characterize “trench-oxide MOS” quantum wire structures by two-dimensional numerical calculation of the shape of the potential well, the subband energy levels and the electron density, and investigate the possibility of the experimental observation of quantized density of states peculiar to quantum wires, by measuring capacitance-gate voltage (C-V) characteristics of “trench-oxide MOS capacitors.” We also have successfully fabricated “trench-oxide MOS” quantum wires with the width of 16 nm using electron beam (EB) lithography and electron cyclotron resonance reactive ion etching (ECR-RIE).

  2. Improved interface properties of GaN-based metal-oxide-semiconductor devices with thin Ga-oxide interlayers

    NASA Astrophysics Data System (ADS)

    Yamada, Takahiro; Ito, Joyo; Asahara, Ryohei; Watanabe, Kenta; Nozaki, Mikito; Hosoi, Takuji; Shimura, Takayoshi; Watanabe, Heiji

    2017-06-01

    The impact of thin Ga-oxide (GaOx) interlayers on the electrical properties of GaN-based metal-oxide-semiconductor (MOS) devices was systematically investigated. Thin thermal oxides formed at around 900 °C were found to be beneficial for improving the electrical properties of insulator/GaN interfaces, despite the fact that thermal oxidation of GaN surfaces at high temperatures proceeds by means of grain growth. Consequently, well-behaved capacitance-voltage characteristics of SiO2/GaOx/n-GaN stacked MOS capacitors with an interface state density (Dit) as low as 1.7 × 1011 cm-2 eV-1 were demonstrated. Moreover, the Dit value was further reduced for the SiO2/GaOx/GaN capacitor with a 2-nm-thick sputter-deposited GaOx interlayer. These results clearly indicate the intrinsically superior nature of the oxide/GaN interfaces and provide plausible guiding principles for fabricating high-performance GaN-MOS devices with thin GaOx interlayers.

  3. Single-electron regime and Pauli spin blockade in a silicon metal-oxide-semiconductor double quantum dot

    NASA Astrophysics Data System (ADS)

    Rochette, Sophie; Ten Eyck, Gregory A.; Pluym, Tammy; Lilly, Michael P.; Carroll, Malcolm S.; Pioro-Ladrière, Michel

    2015-03-01

    Silicon quantum dots are promising candidates for quantum information processing as spin qubits with long coherence time. We present electrical transport measurements on a silicon metal-oxide-semiconductor (MOS) double quantum dot (DQD). First, Coulomb diamonds measurements demonstrate the one-electron regime at a relatively high temperature of 1.5 K. Then, the 8 mK stability diagram shows Pauli spin blockade with a large singlet-triplet separation of approximatively 0.40 meV, pointing towards a strong lifting of the valley degeneracy. Finally, numerical simulations indicate that by integrating a micro-magnet to those devices, we could achieve fast spin rotations of the order of 30 ns. Those results are part of the recent body of work demonstrating the potential of Si MOS DQD as reliable and long-lived spin qubits that could be ultimately integrated into modern electronic facilities. Sandia National Laboratories is a multi-program laboratory managed and operated by Sandia Corporation, a wholly owned subsidiary of Lockheed Martin Corporation, for the U.S. DOE's National Nuclear Security Administration under Contract DE-AC04-94AL85000.

  4. A customized metal oxide semiconductor-based gas sensor array for onion quality evaluation: system development and characterization.

    PubMed

    Konduru, Tharun; Rains, Glen C; Li, Changying

    2015-01-12

    A gas sensor array, consisting of seven Metal Oxide Semiconductor (MOS) sensors that are sensitive to a wide range of organic volatile compounds was developed to detect rotten onions during storage. These MOS sensors were enclosed in a specially designed Teflon chamber equipped with a gas delivery system to pump volatiles from the onion samples into the chamber. The electronic circuit mainly comprised a microcontroller, non-volatile memory chip, and trickle-charge real time clock chip, serial communication chip, and parallel LCD panel. User preferences are communicated with the on-board microcontroller through a graphical user interface developed using LabVIEW. The developed gas sensor array was characterized and the discrimination potential was tested by exposing it to three different concentrations of acetone (ketone), acetonitrile (nitrile), ethyl acetate (ester), and ethanol (alcohol). The gas sensor array could differentiate the four chemicals of same concentrations and different concentrations within the chemical with significant difference. Experiment results also showed that the system was able to discriminate two concentrations (196 and 1964 ppm) of methlypropyl sulfide and two concentrations (145 and 1452 ppm) of 2-nonanone, two key volatile compounds emitted by rotten onions. As a proof of concept, the gas sensor array was able to achieve 89% correct classification of sour skin infected onions. The customized low-cost gas sensor array could be a useful tool to detect onion postharvest diseases in storage.

  5. Electroluminescence from metal-oxide-semiconductor devices with erbium-doped CeO{sub 2} films on silicon

    SciTech Connect

    Lv, Chunyan; Zhu, Chen; Wang, Canxing; Gao, Yuhan; Ma, Xiangyang Yang, Deren

    2015-04-06

    We report on erbium (Er)-related electroluminescence (EL) in the visible and near-infrared (NIR) from metal-oxide-semiconductor (MOS) devices with Er-doped CeO{sub 2} (CeO{sub 2}:Er) films on silicon. The onset voltage of such EL under either forward or reverse bias is smaller than 10 V. Moreover, the EL quenching can be avoidable for the CeO{sub 2}:Er-based MOS devices. Analysis on the current-voltage characteristic of the device indicates that the electron transportation at the EL-enabling voltages under either forward or reverse bias is dominated by trap-assisted tunneling mechanism. Namely, electrons in n{sup +}-Si/ITO can tunnel into the conduction band of CeO{sub 2} host via defect states at sufficiently high forward/reverse bias voltages. Then, a fraction of such electrons are accelerated by electric field to become hot electrons, which impact-excite the Er{sup 3+} ions, thus leading to characteristic emissions. It is believed that this work has laid the foundation for developing viable silicon-based emitters using CeO{sub 2}:Er films.

  6. Vertical InAs/InGaAs Heterostructure Metal-Oxide-Semiconductor Field-Effect Transistors on Si.

    PubMed

    Kilpi, Olli-Pekka; Svensson, Johannes; Wu, Jun; Persson, Axel R; Wallenberg, Reine; Lind, Erik; Wernersson, Lars-Erik

    2017-09-14

    III-V compound semiconductors offer a path to continue Moore's law due to their excellent electron transport properties. One major challenge, integrating III-V's on Si, can be addressed by using vapor-liquid-solid grown vertical nanowires. InAs is an attractive material due to its superior mobility, although InAs metal-oxide-semiconductor field-effect transistors (MOSFETs) typically suffer from band-to-band tunneling caused by its narrow band gap, which increases the off-current and therefore the power consumption. In this work, we present vertical heterostructure InAs/InGaAs nanowire MOSFETs with low off-currents provided by the wider band gap material on the drain side suppressing band-to-band tunneling. We demonstrate vertical III-V MOSFETs achieving off-current below 1 nA/μm while still maintaining on-performance comparable to InAs MOSFETs; therefore, this approach opens a path to address not only high-performance applications but also Internet-of-Things applications that require low off-state current levels.

  7. Theoretical Study of Triboelectric-Potential Gated/Driven Metal-Oxide-Semiconductor Field-Effect Transistor.

    PubMed

    Peng, Wenbo; Yu, Ruomeng; He, Yongning; Wang, Zhong Lin

    2016-04-26

    Triboelectric nanogenerator has drawn considerable attentions as a potential candidate for harvesting mechanical energies in our daily life. By utilizing the triboelectric potential generated through the coupling of contact electrification and electrostatic induction, the "tribotronics" has been introduced to tune/control the charge carrier transport behavior of silicon-based metal-oxide-semiconductor field-effect transistor (MOSFET). Here, we perform a theoretical study of the performances of tribotronic MOSFET gated by triboelectric potential in two working modes through finite element analysis. The drain-source current dependence on contact-electrification generated triboelectric charges, gap separation distance, and externally applied bias are investigated. The in-depth physical mechanism of the tribotronic MOSFET operations is thoroughly illustrated by calculating and analyzing the charge transfer process, voltage relationship to gap separation distance, and electric potential distribution. Moreover, a tribotronic MOSFET working concept is proposed, simulated and studied for performing self-powered FET and logic operations. This work provides a deep understanding of working mechanisms and design guidance of tribotronic MOSFET for potential applications in micro/nanoelectromechanical systems (MEMS/NEMS), human-machine interface, flexible electronics, and self-powered active sensors.

  8. Anomalous wear-out phenomena of europium-implanted light emitters based on a metal-oxide-semiconductor structure

    NASA Astrophysics Data System (ADS)

    Rebohle, L.; Lehmann, J.; Prucnal, S.; Nazarov, A.; Tyagulskii, I.; Tyagulskii, S.; Kanjilal, A.; Voelskow, M.; Grambole, D.; Skorupa, W.; Helm, M.

    2009-12-01

    The anomalous wear-out phenomena of Eu-implanted metal-oxide-semiconductor devices were investigated. It will be shown that in contrast to other rare earth elements the electroluminescence (EL) intensity of Eu-implanted SiO2 layers can rise under constant current injection before the known EL quenching will start. Under certain circumstances, this rise may amount up to two orders of magnitude. The EL behavior will be correlated with the microstructural and electrical properties of the devices. Transmission electron microscopy and Rutherford backscattering spectroscopy were applied to trace the development of Eu/Eu oxide clusters and the diffusion of Eu to the interfaces of the gate oxide layer. The hydrogen profile within the SiO2-SiON interface region was determined by nuclear reaction analysis. Current-voltage characteristics, EL decay times, and the progression of the voltage and the EL spectrum with increasing charge injection were measured to study charge and trapping phenomena in the oxide layer to reveal details of the EL excitation mechanism. A first qualitative model for the anomalous life time behavior is proposed.

  9. Functional integrity of flexible n-channel metal-oxide-semiconductor field-effect transistors on a reversibly bistable platform

    NASA Astrophysics Data System (ADS)

    Alfaraj, Nasir; Hussain, Aftab M.; Torres Sevilla, Galo A.; Ghoneim, Mohamed T.; Rojas, Jhonathan P.; Aljedaani, Abdulrahman B.; Hussain, Muhammad M.

    2015-10-01

    Flexibility can bring a new dimension to state-of-the-art electronics, such as rollable displays and integrated circuit systems being transformed into more powerful resources. Flexible electronics are typically hosted on polymeric substrates. Such substrates can be bent and rolled up, but cannot be independently fixed at the rigid perpendicular position necessary to realize rollable display-integrated gadgets and electronics. A reversibly bistable material can assume two stable states in a reversible way: flexibly rolled state and independently unbent state. Such materials are used in cycling and biking safety wristbands and a variety of ankle bracelets for orthopedic healthcare. They are often wrapped around an object with high impulsive force loading. Here, we study the effects of cumulative impulsive force loading on thinned (25 μm) flexible silicon-based n-channel metal-oxide-semiconductor field-effect transistor devices housed on a reversibly bistable flexible platform. We found that the transistors have maintained their high performance level up to an accumulated 180 kN of impact force loading. The gate dielectric layers have maintained their reliability, which is evidenced by the low leakage current densities. Also, we observed low variation in the effective electron mobility values, which manifests that the device channels have maintained their carrier transport properties.

  10. On trapping mechanisms at oxide-traps in Al2O3/GaN metal-oxide-semiconductor capacitors

    NASA Astrophysics Data System (ADS)

    Bisi, D.; Chan, S. H.; Liu, X.; Yeluri, R.; Keller, S.; Meneghini, M.; Meneghesso, G.; Zanoni, E.; Mishra, U. K.

    2016-03-01

    By means of combined current-voltage and capacitance-voltage sweep and transient measurements, we present the effects of forward-bias stress and charge trapping mechanisms at oxide traps in Al2O3/GaN metal-oxide-semiconductor capacitors grown in-situ by metalorganic chemical vapor deposition. Two main current-voltage regimes have been identified: a low-field regime characterized by low gate-current and low flat-band voltage instabilities, and a high-field regime triggered for oxide field greater than 3.3 MV/cm and characterized by the onset of parasitic leakage current and positive flat-band shift. In the low-voltage regime, gate current transients convey stress/relaxation kinetics based on a power-law, suggesting that tunneling trapping mechanisms occur at near-interface traps aligned with the GaN conduction-band minimum. In the high-voltage regime, devices experience parasitic conduction mechanisms and enhanced charge-trapping at oxide-traps revealed by very slow recovery transients.

  11. Investigation of structural and electrical properties on substrate material for high frequency metal-oxide-semiconductor (MOS) devices

    NASA Astrophysics Data System (ADS)

    Kumar, M.; Yang, Sung-Hyun; Janardhan Reddy, K.; JagadeeshChandra, S. V.

    2017-04-01

    Hafnium oxide (HfO2) thin films were grown on cleaned P-type <1 0 0> Ge and Si substrates by using atomic layer deposition technique (ALD) with thickness of 8 nm. The composition analysis of as-deposited and annealed HfO2 films was characterized by XPS, further electrical measurements; we fabricated the metal-oxide-semiconductor (MOS) devices with Pt electrode. Post deposition annealing in O2 ambient at 500 °C for 30 min was carried out on both Ge and Si devices. Capacitance-voltage (C-V) and conductance-voltage (G-V) curves measured at 1 MHz. The Ge MOS devices showed improved interfacial and electrical properties, high dielectric constant (~19), smaller EOT value (0.7 nm), and smaller D it value as Si MOS devices. The C-V curves shown significantly high accumulation capacitance values from Ge devices, relatively when compare with the Si MOS devices before and after annealing. It could be due to the presence of very thin interfacial layer at HfO2/Ge stacks than HfO2/Si stacks conformed by the HRTEM images. Besides, from current-voltage (I-V) curves of the Ge devices exhibited similar leakage current as Si devices. Therefore, Ge might be a reliable substrate material for structural, electrical and high frequency applications.

  12. Study of Strain Induction for Metal-Oxide-Semiconductor Field-Effect Transistors using Transparent Dummy Gates and Stress Liners

    NASA Astrophysics Data System (ADS)

    Kosemura, Daisuke; Takei, Munehisa; Nagata, Kohki; Akamatsu, Hiroaki; Kohno, Masayuki; Nishita, Tatsuo; Nakanishi, Toshio; Ogura, Atsushi

    2009-06-01

    Strain induction was studied on a sample that had a dummy gate tetraethyl orthosilicate-silicon dioxide (TEOS-SiO2) and SiN film by UV-Raman spectroscopy with high spatial and high wave-number resolution. The UV laser penetrated through the dummy gate that was transparent to UV light, which enabled us to evaluate strain in the channel of the metal-oxide-semiconductor field-effect transistor (MOSFET) model. Furthermore, we compared stress profiles obtained by finite element (FE) calculations with those obtained by UV-Raman measurements. There was a difference between the stress profiles in the line-and-space pattern sample and in the dummy-gate sample; large compressive (tensile) strains were concentrated at the channel edges in the dummy-gate sample with the compressive (tensile) stress liner, although both tensile and compressive strains existed at the channel edge in the line-and-space pattern sample. The results from UV-Raman spectroscopy were consistent with those obtained by the FE calculation.

  13. A Customized Metal Oxide Semiconductor-Based Gas Sensor Array for Onion Quality Evaluation: System Development and Characterization

    PubMed Central

    Konduru, Tharun; Rains, Glen C.; Li, Changying

    2015-01-01

    A gas sensor array, consisting of seven Metal Oxide Semiconductor (MOS) sensors that are sensitive to a wide range of organic volatile compounds was developed to detect rotten onions during storage. These MOS sensors were enclosed in a specially designed Teflon chamber equipped with a gas delivery system to pump volatiles from the onion samples into the chamber. The electronic circuit mainly comprised a microcontroller, non-volatile memory chip, and trickle-charge real time clock chip, serial communication chip, and parallel LCD panel. User preferences are communicated with the on-board microcontroller through a graphical user interface developed using LabVIEW. The developed gas sensor array was characterized and the discrimination potential was tested by exposing it to three different concentrations of acetone (ketone), acetonitrile (nitrile), ethyl acetate (ester), and ethanol (alcohol). The gas sensor array could differentiate the four chemicals of same concentrations and different concentrations within the chemical with significant difference. Experiment results also showed that the system was able to discriminate two concentrations (196 and 1964 ppm) of methlypropyl sulfide and two concentrations (145 and 1452 ppm) of 2-nonanone, two key volatile compounds emitted by rotten onions. As a proof of concept, the gas sensor array was able to achieve 89% correct classification of sour skin infected onions. The customized low-cost gas sensor array could be a useful tool to detect onion postharvest diseases in storage. PMID:25587975

  14. Anomalous wear-out phenomena of europium-implanted light emitters based on a metal-oxide-semiconductor structure

    SciTech Connect

    Rebohle, L.; Lehmann, J.; Prucnal, S.; Nazarov, A.; Tyagulskii, I.; Tyagulskii, S.; Kanjilal, A.; Voelskow, M.; Grambole, D.; Skorupa, W.; Helm, M.

    2009-12-15

    The anomalous wear-out phenomena of Eu-implanted metal-oxide-semiconductor devices were investigated. It will be shown that in contrast to other rare earth elements the electroluminescence (EL) intensity of Eu-implanted SiO{sub 2} layers can rise under constant current injection before the known EL quenching will start. Under certain circumstances, this rise may amount up to two orders of magnitude. The EL behavior will be correlated with the microstructural and electrical properties of the devices. Transmission electron microscopy and Rutherford backscattering spectroscopy were applied to trace the development of Eu/Eu oxide clusters and the diffusion of Eu to the interfaces of the gate oxide layer. The hydrogen profile within the SiO{sub 2}-SiON interface region was determined by nuclear reaction analysis. Current-voltage characteristics, EL decay times, and the progression of the voltage and the EL spectrum with increasing charge injection were measured to study charge and trapping phenomena in the oxide layer to reveal details of the EL excitation mechanism. A first qualitative model for the anomalous life time behavior is proposed.

  15. Real-time, continuous, fluorescence sensing in a freely-moving subject with an implanted hybrid VCSEL/CMOS biosensor

    PubMed Central

    O’Sullivan, Thomas D.; Heitz, Roxana T.; Parashurama, Natesh; Barkin, David B.; Wooley, Bruce A.; Gambhir, Sanjiv S.; Harris, James S.; Levi, Ofer

    2013-01-01

    Performance improvements in instrumentation for optical imaging have contributed greatly to molecular imaging in living subjects. In order to advance molecular imaging in freely moving, untethered subjects, we designed a miniature vertical-cavity surface-emitting laser (VCSEL)-based biosensor measuring 1cm3 and weighing 0.7g that accurately detects both fluorophore and tumor-targeted molecular probes in small animals. We integrated a critical enabling component, a complementary metal-oxide semiconductor (CMOS) read-out integrated circuit, which digitized the fluorescence signal to achieve autofluorescence-limited sensitivity. After surgical implantation of the lightweight sensor for two weeks, we obtained continuous and dynamic fluorophore measurements while the subject was un-anesthetized and mobile. The technology demonstrated here represents a critical step in the path toward untethered optical sensing using an integrated optoelectronic implant. PMID:24009996

  16. Metal-oxide-semiconductor diodes containing C60 fullerenes for non-volatile memory applications

    NASA Astrophysics Data System (ADS)

    Beckmeier, Daniel; Baumgärtner, Hermann

    2013-01-01

    For non-volatile memories, silicon-oxide-nitride-oxide-silicon or floating gate structures are used to store information by charging and discharging electronic states reversibly. In this article, we propose to replace the floating gate by C60 molecules. This would allow more defined programming voltages because of the discrete molecular energy levels and a higher resistance to tunneling oxide defects because of the weak electrical connection between the single molecules. Such C60 MOS diode structures are produced and their electrical properties are analyzed regarding current transport and charging mechanism of the molecules. To create the MOS structures, C60 molecules (5% of a monolayer) are evaporated onto a part of a clean silicon wafer and covered by amorphous silicon in situ in an ultra high vacuum system. Then the wafer is oxidized in wet atmosphere at just 710 °C through the C60 layer. The goal is to produce a clean oxide above and under the molecules without destroying them. Aluminum gate contacts are defined on top of these layers to perform complementary capacitance voltage (CV) and current voltage (IV) measurements. First, the gate voltage is swept to analyze the injection current, then CV measurements are performed after each sweep to analyze the charge state of the C60 layer and the oxide quality. Reference diodes without C60 on the same wafer show an identical Fowler-Nordheim (FN) tunneling behavior for currents injected from silicon or from aluminum, respectively. In the CV curves, no pronounced flatband voltage shift is observable. In diodes with C60, for negative gate voltages, a classical FN tunneling is observed and compared to theory. The electron injection from silicon shows a different tunneling current behavior. It starts at a lower electric field and has a smaller slope then a FN current would have. It is identified as a trap-assisted tunneling (TAT) current caused by oxidation-induced traps under the C60 layer. It is modeled by an

  17. Practical Use of Metal Oxide Semiconductor Gas Sensors for Measuring Nitrogen Dioxide and Ozone in Urban Environments

    PubMed Central

    Peterson, Philip J. D.; Aujla, Amrita; Brundle, Alex G.; Thompson, Martin R.; Vande Hey, Josh; Leigh, Roland J.

    2017-01-01

    The potential of inexpensive Metal Oxide Semiconductor (MOS) gas sensors to be used for urban air quality monitoring has been the topic of increasing interest in the last decade. This paper discusses some of the lessons of three years of experience working with such sensors on a novel instrument platform (Small Open General purpose Sensor (SOGS)) in the measurement of atmospheric nitrogen dioxide and ozone concentrations. Analytic methods for increasing long-term accuracy of measurements are discussed, which permit nitrogen dioxide measurements with 95% confidence intervals of 20.0 μg m−3 and ozone precision of 26.8 μg m−3, for measurements over a period one month away from calibration, averaged over 18 months of such calibrations. Beyond four months from calibration, sensor drift becomes significant, and accuracy is significantly reduced. Successful calibration schemes are discussed with the use of controlled artificial atmospheres complementing deployment on a reference weather station exposed to the elements. Manufacturing variation in the attributes of individual sensors are examined, an experiment possible due to the instrument being equipped with pairs of sensors of the same kind. Good repeatability (better than 0.7 correlation) between individual sensor elements is shown. The results from sensors that used fans to push air past an internal sensor element are compared with mounting the sensors on the outside of the enclosure, the latter design increasing effective integration time to more than a day. Finally, possible paths forward are suggested for improving the reliability of this promising sensor technology for measuring pollution in an urban environment. PMID:28753910

  18. Metal-oxide-semiconductor capacitors and Schottky diodes studied with scanning microwave microscopy at 18 GHz

    SciTech Connect

    Kasper, M.; Gramse, G.; Hoffmann, J.; Gaquiere, C.; Feger, R.; Stelzer, A.; Smoliner, J.; Kienberger, F.

    2014-11-14

    We measured the DC and RF impedance characteristics of micrometric metal-oxide-semiconductor (MOS) capacitors and Schottky diodes using scanning microwave microscopy (SMM). The SMM consisting of an atomic force microscopy (AFM) interfaced with a vector network analyser (VNA) was used to measure the reflection S11 coefficient of the metallic MOS and Schottky contact pads at 18 GHz as a function of the tip bias voltage. By controlling the SMM biasing conditions, the AFM tip was used to bias the Schottky contacts between reverse and forward mode. In reverse bias direction, the Schottky contacts showed mostly a change in the imaginary part of the admittance while in forward bias direction the change was mostly in the real part of the admittance. Reference MOS capacitors which are next to the Schottky diodes on the same sample were used to calibrate the SMM S11 data and convert it into capacitance values. Calibrated capacitance between 1–10 fF and 1/C{sup 2} spectroscopy curves were acquired on the different Schottky diodes as a function of the DC bias voltage following a linear behavior. Additionally, measurements were done directly with the AFM-tip in contact with the silicon substrate forming a nanoscale Schottky contact. Similar capacitance-voltage curves were obtained but with smaller values (30–300 aF) due to the corresponding smaller AFM-tip diameter. Calibrated capacitance images of both the MOS and Schottky contacts were acquired with nanoscale resolution at different tip-bias voltages.

  19. Design of nanophotonic, hot-electron solar-blind ultraviolet detectors with a metal-oxide-semiconductor structure

    NASA Astrophysics Data System (ADS)

    Wang, Zhiyuan; Wang, Xiaoxin; Liu, Jifeng

    2014-12-01

    Solar-blind ultraviolet (UV) detection refers to photon detection specifically in the wavelength range of 200 nm-320 nm. Without background noises from solar radiation, it has broad applications from homeland security to environmental monitoring. The most commonly used solid state devices for this application are wide band gap (WBG) semiconductor photodetectors (Eg > 3.5 eV). However, WBG semiconductors are difficult to grow and integrate with Si readout integrated circuits (ROICs). In this paper, we design a nanophotonic metal-oxide-semiconductor structure on Si for solar-blind UV detectors. Instead of using semiconductors as the active absorber, we use Sn nano-grating structures to absorb UV photons and generate hot electrons for internal photoemission across the Sn/SiO2 interfacial barrier, thereby generating photocurrent between the metal and the n-type Si region upon UV excitation. Moreover, the transported hot electron has an excess kinetic energy >3 eV, large enough to induce impact ionization and generate another free electron in the conduction band of n-Si. This process doubles the quantum efficiency. On the other hand, the large metal/oxide interfacial energy barrier (>3.5 eV) also enables solar-blind UV detection by blocking the less energetic electrons excited by visible photons. With optimized design, ˜75% UV absorption and hot electron excitation can be achieved within the mean free path of ˜20 nm from the metal/oxide interface. This feature greatly enhances hot electron transport across the interfacial barrier to generate photocurrent. The simple geometry of the Sn nano-gratings and the MOS structure make it easy to fabricate and integrate with Si ROICs compared to existing solar-blind UV detection schemes. The presented device structure also breaks through the conventional notion that photon absorption by metal is always a loss in solid-state photodetectors, and it can potentially be extended to other active metal photonic devices.

  20. Verification of the plan dosimetry for high dose rate brachytherapy using metal-oxide-semiconductor field effect transistor detectors

    SciTech Connect

    Qi Zhenyu; Deng Xiaowu; Huang Shaomin; Lu Jie; Lerch, Michael; Cutajar, Dean; Rosenfeld, Anatoly

    2007-06-15

    The feasibility of a recently designed metal-oxide-semiconductor field effect transistor (MOSFET) dosimetry system for dose verification of high dose rate (HDR) brachytherapy treatment planning was investigated. MOSFET detectors were calibrated with a 0.6 cm{sup 3} NE-2571 Farmer-type ionization chamber in water. Key characteristics of the MOSFET detectors, such as the energy dependence, that will affect phantom measurements with HDR {sup 192}Ir sources were measured. The MOSFET detector was then applied to verify the dosimetric accuracy of HDR brachytherapy treatments in a custom-made water phantom. Three MOSFET detectors were calibrated independently, with the calibration factors ranging from 0.187 to 0.215 cGy/mV. A distance dependent energy response was observed, significant within 2 cm from the source. The new MOSFET detector has a good reproducibility (<3%), small angular effect (<2%), and good dose linearity (R{sup 2}=1). It was observed that the MOSFET detectors had a linear response to dose until the threshold voltage reached approximately 24 V for {sup 192}Ir source measurements. Further comparison of phantom measurements using MOSFET detectors with dose calculations by a commercial treatment planning system for computed tomography-based brachytherapy treatment plans showed that the mean relative deviation was 2.2{+-}0.2% for dose points 1 cm away from the source and 2.0{+-}0.1% for dose points located 2 cm away. The percentage deviations between the measured doses and the planned doses were below 5% for all the measurements. The MOSFET detector, with its advantages of small physical size and ease of use, is a reliable tool for quality assurance of HDR brachytherapy. The phantom verification method described here is universal and can be applied to other HDR brachytherapy treatments.

  1. Are dangling bond centers important interface traps in 4H-SiC metal oxide semiconductor field effect transistors?

    NASA Astrophysics Data System (ADS)

    Anders, M. A.; Lenahan, P. M.; Lelis, A. J.

    2016-10-01

    Silicon carbide (SiC) based metal-oxide-semiconductor field-effect transistors (MOSFETs) have great promise in high power and high temperature applications. Unfortunately, effective channel mobilities remain disappointingly low, typically about 30 cm2/Vs. A major contributor to the disappointing effective channel mobilities is the presence of substantial densities of interface traps at the SiC/SiO2 interface. Many investigators have invoked silicon or carbon dangling bonds to be the dominating source of these interface defects, but very little, if any, direct experimental evidence exists to support this assumption in the SiC/SiO2 system. Cantin et al. [Phys. Rev. Lett. 92, 1 (2004)] have used conventional electron paramagnetic resonance measurements on porous oxidized SiC structures to measure the g tensor for the SiC/SiO2 interface carbon dangling bond. These results provide a particularly straightforward means to search for the presence of carbon dangling bonds in fully processed SiC MOSFETs using electrically detected magnetic resonance. Additionally, simple theory provides guidance to search for silicon dangling bond defects. In this study, we utilize K band electrically detected magnetic resonance via spin dependent charge pumping measurements in which almost all of the SiC band gap at the SiC/SiO2 interface is accessed. Although quite high signal to noise measurements are achieved, we are unable to detect any trace of the carbon dangling bond spectra. However, in very poor quality p-channel devices, we observe a spectrum which could be consistent with silicon dangling bonds. Other defect centers are clearly present and we conclude that these other centers dominate the interface trap density of states.

  2. Practical Use of Metal Oxide Semiconductor Gas Sensors for Measuring Nitrogen Dioxide and Ozone in Urban Environments.

    PubMed

    Peterson, Philip J D; Aujla, Amrita; Grant, Kirsty H; Brundle, Alex G; Thompson, Martin R; Vande Hey, Josh; Leigh, Roland J

    2017-07-19

    The potential of inexpensive Metal Oxide Semiconductor (MOS) gas sensors to be used for urban air quality monitoring has been the topic of increasing interest in the last decade. This paper discusses some of the lessons of three years of experience working with such sensors on a novel instrument platform (Small Open General purpose Sensor (SOGS)) in the measurement of atmospheric nitrogen dioxide and ozone concentrations. Analytic methods for increasing long-term accuracy of measurements are discussed, which permit nitrogen dioxide measurements with 95% confidence intervals of 20.0 μ g m - 3 and ozone precision of 26.8 μ g m - 3 , for measurements over a period one month away from calibration, averaged over 18 months of such calibrations. Beyond four months from calibration, sensor drift becomes significant, and accuracy is significantly reduced. Successful calibration schemes are discussed with the use of controlled artificial atmospheres complementing deployment on a reference weather station exposed to the elements. Manufacturing variation in the attributes of individual sensors are examined, an experiment possible due to the instrument being equipped with pairs of sensors of the same kind. Good repeatability (better than 0.7 correlation) between individual sensor elements is shown. The results from sensors that used fans to push air past an internal sensor element are compared with mounting the sensors on the outside of the enclosure, the latter design increasing effective integration time to more than a day. Finally, possible paths forward are suggested for improving the reliability of this promising sensor technology for measuring pollution in an urban environment.

  3. Flatband voltage control in p-metal gate metal-oxide-semiconductor field effect transistor by insertion of TiO2 layer

    NASA Astrophysics Data System (ADS)

    Maeng, W. J.; Kim, Woo-Hee; Koo, Ja Hoon; Lim, S. J.; Lee, Chang-Soo; Lee, Taeyoon; Kim, Hyungjun

    2010-02-01

    Titanium oxide (TiO2) layer was used to control the flatband voltage (VFB) of p-type metal-oxide-semiconductor field effect transistors. TiO2 was deposited by plasma enhanced atomic layer deposition (PE-ALD) on hafnium oxide (HfO2) gate dielectrics. Comparative studies between TiO2 and Al2O3 as capping layer have shown that improved device properties with lower capacitance equivalent thickness (CET), interface state density (Dit), and flatband voltage (VFB) shift were achieved by PE-ALD TiO2 capping layer.

  4. A New Analytical Subthreshold Behavior Model for Single-Halo, Dual-Material Gate Silicon-on-Insulator Metal Oxide Semiconductor Field Effect Transistor

    NASA Astrophysics Data System (ADS)

    Chiang, Te-Kuang

    2008-11-01

    On the basis of the exact solution of the two-dimensional Poisson equation, a new analytical subthreshold behavior model consisting of the two-dimensional potential, threshold voltage, and subthreshold current for the single-halo, dual-material gate (SHDMG) silicon-on-insulator (SOI) metal oxide semiconductor field effect transistor (MOSFET) is developed. The model is verified by the good agreement with a numerical simulation using the device simulator MEDICI. The model not only offers a physical insight into device physics but is also an efficient device model for the circuit simulation.

  5. Ballistic performance comparison of monolayer transition metal dichalcogenide MX{sub 2} (M = Mo, W; X = S, Se, Te) metal-oxide-semiconductor field effect transistors

    SciTech Connect

    Chang, Jiwon; Register, Leonard F.; Banerjee, Sanjay K.

    2014-02-28

    We study the transport properties of monolayer MX{sub 2} (M = Mo, W; X = S, Se, Te) n- and p-channel metal-oxide-semiconductor field effect transistors (MOSFETs) using full-band ballistic non-equilibrium Green's function simulations with an atomistic tight-binding Hamiltonian with hopping potentials obtained from density functional theory. We discuss the subthreshold slope, drain-induced barrier lowering (DIBL), as well as gate-induced drain leakage (GIDL) for different monolayer MX{sub 2} MOSFETs. We also report the possibility of negative differential resistance behavior in the output characteristics of nanoscale monolayer MX{sub 2} MOSFETs.

  6. Ballistic performance comparison of monolayer transition metal dichalcogenide MX2 (M = Mo, W; X = S, Se, Te) metal-oxide-semiconductor field effect transistors

    NASA Astrophysics Data System (ADS)

    Chang, Jiwon; Register, Leonard F.; Banerjee, Sanjay K.

    2014-02-01

    We study the transport properties of monolayer MX2 (M = Mo, W; X = S, Se, Te) n- and p-channel metal-oxide-semiconductor field effect transistors (MOSFETs) using full-band ballistic non-equilibrium Green's function simulations with an atomistic tight-binding Hamiltonian with hopping potentials obtained from density functional theory. We discuss the subthreshold slope, drain-induced barrier lowering (DIBL), as well as gate-induced drain leakage (GIDL) for different monolayer MX2 MOSFETs. We also report the possibility of negative differential resistance behavior in the output characteristics of nanoscale monolayer MX2 MOSFETs.

  7. Detailed investigation of InSb p-channel metal-oxide-semiconductor field effect transistor prepared by photo-enhanced chemical vapor deposition

    NASA Astrophysics Data System (ADS)

    Liu, Biing-Der; Lee, Si-Chen; Sun, Tai-Ping; Yang, Sheng-Jenn

    1995-05-01

    The InSb metal-oxide-semiconductor field effect transistor (MOSFET) with three different channel lengths 5, 15, and 30 micron were fabricated successfully. The SiO2 prepared by photo-enhanced chemical vapor deposition was used both as the gate insulator and the source/drain passivation layer to reduce the source/drain pn junction surface leakage current. The common-source current-voltage characteristics show a breakdown voltage exceeding 2 V indicating an excellent pn junction reverse characteristics. The capacitance-voltage and the transferred current versus gate voltage characteristics are discussed in detail to explain the geometry effect on the device performance.

  8. Stress Characterization of 4H-SiC Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET) using Raman Spectroscopy and the Finite Element Method.

    PubMed

    Yoshikawa, Masanobu; Kosaka, Kenichi; Seki, Hirohumi; Kimoto, Tsunenobu

    2016-07-01

    We measured the depolarized and polarized Raman spectra of a 4H-SiC metal-oxide-semiconductor field-effect transistor (MOSFET) and found that compressive stress of approximately 20 MPa occurs under the source and gate electrodes and tensile stress of approximately 10 MPa occurs between the source and gate electrodes. The experimental result was in close agreement with the result obtained by calculation using the finite element method (FEM). A combination of Raman spectroscopy and FEM provides much data on the stresses in 4H-SiC MOSFET.

  9. Anomalous output characteristic shift for the n-type lateral diffused metal-oxide-semiconductor transistor with floating P-top layer

    SciTech Connect

    Liu, Siyang; Zhang, Chunwei; Sun, Weifeng; Su, Wei; Wang, Shaorong; Ma, Shulang; Huang, Yu

    2014-04-14

    Anomalous output characteristic shift of the n-type lateral diffused metal-oxide-semiconductor transistor with floating P-top layer is investigated. It shows that the linear drain current has obvious decrease when the output characteristic of fresh device is measured for two consecutive times. The charge pumping experiments demonstrate that the decrease is not from hot-carrier degradation. The reduction of cross section area for the current flowing, which results from the squeezing of the depletion region surrounding the P-top layer, is responsible for the shift. Consequently, the current capability of this special device should be evaluated by the second measured output characteristic.

  10. Effects of buffered HF cleaning on metal-oxide-semiconductor interface properties of Al2O3/InAs/GaSb structures

    NASA Astrophysics Data System (ADS)

    Nishi, Koichi; Yokoyama, Masafumi; Yokoyama, Haruki; Hoshi, Takuya; Sugiyama, Hiroki; Takenaka, Mitsuru; Takagi, Shinichi

    2015-06-01

    We studied the impact of buffered HF (BHF) cleaning on the interface properties of Al2O3/InAs/GaSb metal-oxide-semiconductor (MOS) structures fabricated by the ex-situ surface cleaning process. The Al2O3/InAs/GaSb MOS structures fabricated with BHF cleaning exhibited lower Dit values than those fabricated with sulfur passivation. In addition, the Al2O3/InAs/GaSb MOS structures fabricated with BHF cleaning were robust with respect to the MOS field-effect transistor fabrication process by using W gate metal with PMA in the 250-300 °C range.

  11. A Novel Gate Electrode Structure for Reduction of Gate Resistance of Sub-0.1 µm RF/Mixed-Signal Metal Oxide Semiconductor Field-Effect Transistors

    NASA Astrophysics Data System (ADS)

    Nagase, Hirokazu; Tanabe, Akira; Umeda, Kyoko; Watanabe, Takashi; Hayashi, Yoshihiro

    2009-04-01

    To reduce noise and enhance gain for scaled-down metal oxide semiconductor field-effect transistors (MOSFETs), a novel gate electrode structure “direct finger contact (DFC)” is proposed. The DFC structure reduces the gate electrode resistance by 40%. NF50 (noise figure when the input impedance is 50 Ω) is reduced by 4% with the gate length L = 48 nm, the gate width Wfinger =1 µm, and the number of finger N =20. This structure is suitable for low-noise sub-0.1 µm RF/mixed-signal system on chips (SoCs).

  12. High resolution imaging in cross-section of a metal-oxide-semiconductor field-effect-transistor using super-higher-order nonlinear dielectric microscopy

    NASA Astrophysics Data System (ADS)

    Chinone, N.; Yamasue, K.; Honda, K.; Cho, Y.

    2013-11-01

    Scanning nonlinear dielectric microscopy (SNDM) can evaluate carrier or charge distribution in semiconductor devices. High sensitivity to capacitance variation enables SNDM to measure the super-high-order (higher than 3rd) derivative of local capacitance-voltage (C-V) characteristics directly under the tip (dnC/dVn,n = 3, 4, ...). We demonstrate improvement of carrier density resolution by measurement of dnC/dVn,n = 1, 2, 3, 4 (super-higher-order method) in the cross-sectional observation of metal-oxide-semiconductor field-effect-transistor.

  13. Evaluation of Interface Property and DC Characteristics Enhancement in Nanoscale n-Channel Metal-Oxide-Semiconductor Field-Effect Transistor Using Stress Memorization Technique

    NASA Astrophysics Data System (ADS)

    Huang, Po Chin; Lein Wu, San; Jinn Chang, Shoou; Huang, Yao Tsung; Kuo, Cheng Wen; Chang, Ching Yao; Cheng, Yao Chin; Cheng, Osbert

    2010-09-01

    In this letter, the advanced 40 nm technology n-channel metal-oxide-semiconductor field-effect transistor devices using the stress memorization technique (SMT) are presented. We demonstrate that SMT process would not affect the electrical characteristics of devices and can introduce higher tensile stress on channels, which enhances drive current. Through charge pumping measurement, it can be verified that SMT does not affect Si/SiO2 interface quality. Moreover, SMT-induced higher tensile stress decreases not only scattering coefficient but also tunneling attenuation length, resulting in smaller input-referred noise, which represents an intrinsic advantage of low-frequency noise performance.

  14. Improvement of charge-pumping electrically detected magnetic resonance and its application to silicon metal-oxide-semiconductor field-effect transistor

    NASA Astrophysics Data System (ADS)

    Hori, Masahiro; Tsuchiya, Toshiaki; Ono, Yukinori

    2017-01-01

    Charge-pumping electrically detected magnetic resonance (CP EDMR), or EDMR in the CP mode, is improved and applied to a silicon metal-oxide-semiconductor field-effect transistor (MOSFET). Real-time monitoring of the CP process reveals that high-frequency transient currents are an obstacle to signal amplification for EDMR. Therefore, we introduce cutoff circuitry, leading to a detection limit for the number of spins as low as 103 for Si MOS interface defects. With this improved method, we demonstrate that CP EDMR inherits one of the most important features of the CP method: the gate control of the energy window of the detectable interface defects for spectroscopy.

  15. Determination of Fowler-Nordheim tunneling parameters in Metal-Oxide-Semiconductor structure including oxide field correction using a vertical optimization method

    NASA Astrophysics Data System (ADS)

    Toumi, S.; Ouennoughi, Z.; Strenger, K. C.; Frey, L.

    2016-08-01

    Current conduction mechanisms through a Metal-Oxide-Semiconductor structure are characterized via Fowler-Nordheim (FN) plots. The extraction of the FN parameters like the electron/hole effective mass in oxide mox and in semiconductor msc, the barrier height at the semiconductor-oxide interface ϕB, and the correction oxide voltage Vcorr for a MOS structure is made using a vertical optimization process on the current density without any assumption about ϕB or mox. An excellent agreement is obtained between the FN plots calculated with the FN parameters extracted using a vertical optimization process with the experimental one.

  16. An Analytical Model of Surface Electric Field Distributions in Ultrahigh-Voltage Buried P-Top Lateral Diffused Metal-Oxide-Semiconductor Devices

    NASA Astrophysics Data System (ADS)

    Gene Sheu,; Shao-Ming Yang,; Yi-Fong Chang,; Shyh Chang Tsaur,

    2010-07-01

    In this paper, we present an analytical model for determining surface electric field distributions in buried P-top lateral-diffused metal-oxide-semiconductor (LDMOS) devices with dual conduction and an enhanced dual conduction layer. The model is based on Poisson’s two-dimensional solution and gives closed-form solutions for the surface potential and electric field distributions as functions of structural parameters and drain bias. All analytical results are verified by simulation results obtained from MEDICI and previous experimental data, confirming the validity of the model. In addition, a novel 800 V diffused metal-oxide-semiconductor (DMOS) with enhanced dual conduction paths above a buried P-top device is also presented. The enhanced dual conduction paths reduce on-state resistance by 22% as compared with state-of-the-art dual conduction paths and thin silicon-on-insulator (SOI) technologies. An Ron of less than 125 mΩ cm2 is achieved with 809 and 782 V off- and on-states breakdown voltages, respectively, at Vg = 5 V.

  17. An Analytical Model of Surface Electric Field Distributions in Ultrahigh-Voltage Buried P-Top Lateral Diffused Metal-Oxide-Semiconductor Devices

    NASA Astrophysics Data System (ADS)

    Sheu, Gene; Yang, Shao-Ming; Chang, Yi-Fong; Tsaur, Shyh Chang

    2010-07-01

    In this paper, we present an analytical model for determining surface electric field distributions in buried P-top lateral-diffused metal-oxide-semiconductor (LDMOS) devices with dual conduction and an enhanced dual conduction layer. The model is based on Poisson's two-dimensional solution and gives closed-form solutions for the surface potential and electric field distributions as functions of structural parameters and drain bias. All analytical results are verified by simulation results obtained from MEDICI and previous experimental data, confirming the validity of the model. In addition, a novel 800 V diffused metal-oxide-semiconductor (DMOS) with enhanced dual conduction paths above a buried P-top device is also presented. The enhanced dual conduction paths reduce on-state resistance by 22% as compared with state-of-the-art dual conduction paths and thin silicon-on-insulator (SOI) technologies. An Ron of less than 125 mΩ cm2 is achieved with 809 and 782 V off- and on-states breakdown voltages, respectively, at Vg = 5 V.

  18. Correlations between structural and electrical properties of nitrided SiOx thin films used as power metal oxide semiconductor field effect transistor gate dielectric

    NASA Astrophysics Data System (ADS)

    Fazio, E.; Neri, F.; Camalleri, G. Curró M.; Calí, D.

    2008-11-01

    Correlations between the interface states and trap densities, in particular, the defect types that may be more or less strongly involved in power vertically diffused metal oxide semiconductor reliability performances, and the fine interface chemistry of the Ox-N-Siy bonds have been studied. The oxide preparation process is extracted from an STMicroelectronics proprietary standard for low voltage vertically diffused power metal oxide semiconductor field effect transistors with logic level gate driving. The oxynitride films were grown in N2O environment at temperatures equal to or higher than 900 °C and optionally subjected to a 1000 °C short annealing. Informations about the sample stoichiometry and the nitrogen bonding configurations were obtained by means of x-ray photoelectron spectroscopy. The results show that some peculiar linear and antilinear correlations exist between carrier traps across the oxide or at its interface and the amount of specific nitrogen bonding configurations. In particular, the role of the substitutional N(-SiO3)x bond as a marker of the electrical quality of Si/SiO2 interface is highlighted.

  19. An electrically detected magnetic resonance study of performance limiting defects in SiC metal oxide semiconductor field effect transistors

    NASA Astrophysics Data System (ADS)

    Cochrane, C. J.; Lenahan, P. M.; Lelis, A. J.

    2011-01-01

    In this study, we utilize electrically detected magnetic resonance (EDMR) techniques and electrical measurements to study defects in SiC based metal oxide semiconductor field effect transistors (MOSFETs). We compare results on a series of SiC MOSFETs prepared with significantly different processing parameters. The EDMR is detected through spin dependent recombination (SDR) in most cases. However, in some devices at a fairly high negative bias, the EDMR likely also involves spin dependent trap-assisted tunneling (SDT) between defects on both sides of the SiC/SiO2 interface. At least three different defects have been detected in the magnetic resonance measurements. The defects observed include two at the SiC/SiO2 interface or on the SiC side of the SiC/SiO2 interface: one is very likely a vacancy center with a distribution which extends into the bulk of the SiC and the other is likely a "dangling bond" defect. A third defect, located on the SiO2 side of the SiC/SiO2 interface, has a spectrum very similar to that previously reported for an oxygen deficient silicon coupled to a hydrogen atom. In nearly all cases, we observe a strong dominating single line EDMR spectrum with an isotropic g≈2.0027. In some samples, this strong central line is accompanied by two pairs of considerably weaker side peaks which we link to hyperfine interactions with nearby Si and C atoms. The pattern is physically reasonable for a silicon vacancy in SiC. We therefore tentatively assign it to a silicon vacancy or silicon vacancy associated defect in the SiC. In one set of devices with very high interface trap density we observe another dominating spectrum with g∥=2.0026 and g⊥=2.0010 with the symmetry axis coincident with the [0001] and nearly the SiC/SiO2 interface normal. We ascribe this EDMR spectrum to a "dangling bond" defect. A third EDMR spectrum shows up in some devices at a fairly large negative gate bias. The phase of this spectrum is quite consistently opposite to that of the

  20. Electron spectroscopic analysis of the SiO2/Si system and correlation with metal-oxide-semiconductor device characteristics

    NASA Astrophysics Data System (ADS)

    Iwata, Seiichi; Ishizaka, Akitoshi

    1996-05-01

    ESCA (electron spectroscopy for chemical analysis) measurement results on thin SiO2/Si samples are examined comprehensively, critically, and in detail to show that it is possible to correlate these results with MOS (metal-oxide-semiconductor) device characteristics such as flatband (threshold) voltage, oxide breakdown field, mobile-ion density, hole and electron trap density, and hot-carrier lifetime. Up to now, much effort has been made to detect SiOx phases at SiO2/Si interfaces since they are thought to have a significant effect on MOS device characteristics. However, correlating the SiOx phases with device characteristics is difficult and involves overcoming two problems. First, the chemical state is difficult to determine exactly due to x-ray irradiation effects. Second, the amount of defects and impurities which influence device characteristics is usually below the ESCA detection limit (1012-1013 cm-2) in device-quality SiO2/Si samples. Investigation of the first problem led to the conclusion that it is possible to correct for these effects from the x-ray intensity or oxide thickness dependence of the chemical shift. However, accurate (better than ±0.2 eV) chemical state determination is not easy. It is therefore necessary to approach this detection problem from a different viewpoint. Our first attempt involves measuring the ESCA thickness, which decreases when oxide defects like unoxidized Si or uneven thickness (or pinholes) are present, resulting in breakdown field degradation. Our second attempt started while we were studying how to interpret the measured chemical shift. The photoelectron peaks of the SiO2 and the Si can be observed to shift due to small amounts of charged defects and impurities, although they cannot be detected as peaks. This method is considered to be especially useful for characterizing ultrathin (a few nm thick) SiO2/Si samples which are difficult to characterize using conventional C-V (capacitance-voltage) measurements because of

  1. Magnetically modulated laser-induced resistance effect observed in Metal-Oxide-Semiconductor structure of Cr/SiO(2)/Si.

    PubMed

    Xie, Xin; Liu, Shuai; Huang, Meizhen; Wang, Hui

    2015-09-21

    In this study, we report our finding of laser-induced resistance effect in metal-oxide-semiconductor (MOS) structure of Cr/SiO(2)/Si. Under the irradiation of a laser beam, the effect shows a large linear resistance change ratio of 92% with a spatial sensitivity of 0.79 MΩ/mm. In particular, by the application of an external magnetic field perpendicular to the Cr film, the resistance change ratio is increased to 110%. This effect is attributed to the Lorentz force acting on the photo-generated carriers in the inversion layer of MOS structures. The work suggests an approach for the development of new type magnetically modulated photoelectric devices.

  2. 0.5 μm Silicon-on-Sapphire Metal Oxide Semiconductor Field Effect Transistor for RF Power Amplifier Applications

    NASA Astrophysics Data System (ADS)

    Tsui, Kenneth; Chen, Kevin J.; Lam, Sang; Chan, Mansun

    2003-08-01

    0.5 μm thin-film silicon-on-sapphire (SOS) metal oxide semiconductor field effect transistors (MOSFETs) are investigated for applications in RF power amplifiers. Detailed static and pulsed I-V characteristics are measured to distinguish between fully depleted and partially depleted SOS MOSFETs. We have performed the first detailed large-signal load-pull characterization of SOS MOSFETs at 2 GHz with a Maury load-pull system with automated tuners. The maximum output power (Pout) of 18 dBm, maximum gain (G) of 12.5 dB and maximum power-added efficiency (PAE) of 55% were achieved. Third-order intermodulation (IM3) and adjacent channel power ratio (ACPR) were measured to characterize the linearity of an SOS MOSFET power amplifier. For the optimum design of RF power amplifiers, impedance matching information is essential as revealed by the large-signal load-pull measurements.

  3. A reliable extraction method for source and drain series resistances in silicon nanowire metal-oxide-semiconductor field-effect-transistors (MOSFETs) based on radio-frequency analysis.

    PubMed

    Hwa, Jae Hwa; Yoon, Young Jun; Lee, Hwan Gi; Yoo, Gwan Min; Cho, Eou-Sik; Cho, Seongjae; Lee, Jung-Hee; Kang, In Man

    2014-11-01

    This paper presents a new extraction method for source and drain (S/D) series resistances of silicon nanowire (SNW) metal-oxide-semiconductor field-effect transistors (MOSFETs) based on small-signal radio-frequency (RF) analysis. The proposed method can be applied to the extraction of S/D series resistances for SNW MOSFETs with finite off-state channel resistance as well as gate bias-dependent on-state resistive components realized by 3-dimensional (3-D) device simulation. The series resistances as a function of frequency and gate voltage are presented and compared with the results obtained by an existing method with infinite off-state channel resistance model. The accuracy of the newly proposed parameter extraction method has been successfully verified by Z22- and Y-parameters up to 100 GHz operation frequency.

  4. Radio Frequency Performance Improvement with Drain Bias and Limiting Factors of 65-nm-Node Radio Frequency Metal-Oxide-Semiconductor Field-Effect Transistors

    NASA Astrophysics Data System (ADS)

    Kao, Hsuan-ling; Lu, Chia-Ling; Chang, Yung-Cheng

    2009-01-01

    With the continuous down scaling of radio frequency metal-oxide-semiconductor field-effect transistors (RF MOSFETs) into a 65 nm node, the RF performance of unity-gain cutoff frequency ( fT), the maximum frequency of oscillation ( fmax), and the minimum noise figure (NFmin) show much smaller dependences on short-channel effects due to increases in drain current and transconductance (gm), which originate from the short-channel effects. We have studied the effect of drain bias on the RF performance of 65-nm-node MOSFETs. Both the fT and NFmin improve linearly with increasing drain voltage, in contrast with their independence on drain bias in longer-channel devices. Additionally, although fT improves continuously in sub-65-nm node devices, fmax and NFmin deteriorate more in 65-nm-node transistors than in 90-nm-node devices owing to a limiting parasitic effect.

  5. Influence of interface traps inside the conduction band on the capacitance-voltage characteristics of InGaAs metal-oxide-semiconductor capacitors

    NASA Astrophysics Data System (ADS)

    Taoka, Noriyuki; Yokoyama, Masafumi; Kim, Sang Hyeon; Suzuki, Rena; Iida, Ryo; Takenaka, Mitsuru; Takagi, Shinichi

    2016-11-01

    We investigated the influences of the AC response with interface/bulk-oxide traps near the conduction band (CB) and a low effective density of states (DOS) on the accumulation capacitance C acc of an n-type InGaAs metal-oxide-semiconductor (MOS) capacitor. We found that the capacitance associated with the interface traps inside the CB significantly increases C acc compared to the C acc value constrained by a low DOS. These results indicate that accurate characterization inside the CB and considering the capacitance due to the interface traps inside the CB in the MOS capacitance-voltage curves are indispensable for accurate characterization of InGaAs MOS interface properties.

  6. P-Channel InGaN/GaN heterostructure metal-oxide-semiconductor field effect transistor based on polarization-induced two-dimensional hole gas.

    PubMed

    Zhang, Kexiong; Sumiya, Masatomo; Liao, Meiyong; Koide, Yasuo; Sang, Liwen

    2016-03-29

    The concept of p-channel InGaN/GaN heterostructure field effect transistor (FET) using a two-dimensional hole gas (2DHG) induced by polarization effect is demonstrated. The existence of 2DHG near the lower interface of InGaN/GaN heterostructure is verified by theoretical simulation and capacitance-voltage profiling. The metal-oxide-semiconductor FET (MOSFET) with Al2O3 gate dielectric shows a drain-source current density of 0.51 mA/mm at the gate voltage of -2 V and drain bias of -15 V, an ON/OFF ratio of two orders of magnitude and effective hole mobility of 10 cm(2)/Vs at room temperature. The normal operation of MOSFET without freeze-out at 8 K further proves that the p-channel behavior is originated from the polarization-induced 2DHG.

  7. Investigation on edge fringing effect and oxide thickness dependence of inversion current in metal-oxide-semiconductor tunneling diodes with comb-shaped electrodes

    SciTech Connect

    Lin, Chien-Chih; Hsu, Pei-Lun; Lin, Li; Hwu, Jenn-Gwo

    2014-03-28

    A particular edge-dependent inversion current behavior of metal-oxide-semiconductor (MOS) tunneling diodes was investigated utilizing square and comb-shaped electrodes. The inversion tunneling current exhibits the strong dependence on the tooth size of comb-shaped electrodes and oxide thickness. Detailed illustrations of current conduction mechanism are developed by simulation and experimental measurement results. It is found that the electron diffusion current and Schottky barrier height lowering for hole tunneling current both contribute on inversion current conduction. In MOS tunneling photodiode applications, the photoresponse can be improved by decreasing SiO{sub 2} thickness and using comb-shaped electrodes with smaller tooth spacing. Meantime, the high and steady photosensitivity can also be approached by introducing HfO{sub 2} into dielectric stacks.

  8. New Analytical Model for Short-Channel Fully Depleted Dual-Material-Gate Silicon-on-Insulator Metal-Oxide-Semiconductor Field-Effect Transistors

    NASA Astrophysics Data System (ADS)

    Te-Kuang Chiang,

    2010-07-01

    Using the exact solution of the two-dimensional Poisson equation, a new analytical model comprising two-dimensional potential and threshold voltage for short-channel fully depleted dual-material-gate silicon-on-insulator (SOI) metal-oxide-semiconductor field-effect transistors (MOSFETs) is developed. The model shows that the minimum acceptable channel length can be sustained while repressing the short-channel effects if a thin gate oxide and a thin silicon body are employed in the device. Moreover, by increasing the ratio of the screen gate length to control gate length, the threshold voltage roll-off can be more effectively reduced. The model is verified by the close agreement of its results with those of a numerical simulation using the device simulator MEDICI. The model not only offers an insight into the device physics but is also an efficient model for circuit simulation.

  9. Impact of drift gap, N-layer, and deep N+ sinker on breakdown voltage and saturation current of lateral double-diffused metal oxide semiconductor transistor.

    PubMed

    Sung, Kunsik; Won, Taeyoung

    2011-08-01

    In this paper, we discuss on the optimal design of a High-Side n-channel Lateral Double-diffused Metal Oxide Semiconductor Field Effect Transistor (LDMOSFET) whose breakdown voltage is over 100 V with 0.35 microm Bipolar-CMOS-DMOS (BCD) process. The proposed nLDMOSFET has been fabricated and tested in order to confirm the features of a deep N+ sinker and a gap of between the drift region (DEEP N-WELL) and the center of the source. The surface is implanted by the N-layer for high breakdown voltage and simultaneously the low specific on-resistance. The computer simulation of the proposed High-Side LDMOS exhibits BVdss of 115 V and Ron,sp of as low as 2.20 m ohms cm2, which is consistent with the experimental results.

  10. Multi-frequency inversion-charge pumping for charge separation and mobility analysis in high-k/InGaAs metal-oxide-semiconductor field-effect transistors

    SciTech Connect

    Djara, V.; Cherkaoui, K.; Negara, M. A.; Hurley, P. K.

    2015-11-28

    An alternative multi-frequency inversion-charge pumping (MFICP) technique was developed to directly separate the inversion charge density (N{sub inv}) from the trapped charge density in high-k/InGaAs metal-oxide-semiconductor field-effect transistors (MOSFETs). This approach relies on the fitting of the frequency response of border traps, obtained from inversion-charge pumping measurements performed over a wide range of frequencies at room temperature on a single MOSFET, using a modified charge trapping model. The obtained model yielded the capture time constant and density of border traps located at energy levels aligned with the InGaAs conduction band. Moreover, the combination of MFICP and pulsed I{sub d}-V{sub g} measurements enabled an accurate effective mobility vs N{sub inv} extraction and analysis. The data obtained using the MFICP approach are consistent with the most recent reports on high-k/InGaAs.

  11. Direct observation of both contact and remote oxygen scavenging of GeO{sub 2} in a metal-oxide-semiconductor stack

    SciTech Connect

    Fadida, S. Shekhter, P.; Eizenberg, M.; Cvetko, D.; Floreano, L.; Verdini, A.; Kymissis, I.

    2014-10-28

    In the path to incorporating Ge based metal-oxide-semiconductor into modern nano-electronics, one of the main issues is the oxide-semiconductor interface quality. Here, the reactivity of Ti on Ge stacks and the scavenging effect of Ti were studied using synchrotron X-ray photoelectron spectroscopy measurements, with an in-situ metal deposition and high resolution transmission electron microscopy imaging. Oxygen removal from the Ge surface was observed both in direct contact as well as remotely through an Al{sub 2}O{sub 3} layer. The scavenging effect was studied in situ at room temperature and after annealing. We find that the reactivity of Ti can be utilized for improved scaling of Ge based devices.

  12. Electrical hysteresis in p-GaN metal-oxide-semiconductor capacitor with atomic-layer-deposited Al2O3 as gate dielectric

    NASA Astrophysics Data System (ADS)

    Zhang, Kexiong; Liao, Meiyong; Imura, Masataka; Nabatame, Toshihide; Ohi, Akihiko; Sumiya, Masatomo; Koide, Yasuo; Sang, Liwen

    2016-12-01

    The electrical hysteresis in current-voltage (I-V) and capacitance-voltage characteristics was observed in an atomic-layer-deposited Al2O3/p-GaN metal-oxide-semiconductor capacitor (PMOSCAP). The absolute minimum leakage currents of the PMOSCAP for forward and backward I-V scans occurred not at 0 V but at -4.4 and +4.4 V, respectively. A negative flat-band voltage shift of 5.5 V was acquired with a capacitance step from +4.4 to +6.1 V during the forward scan. Mg surface accumulation on p-GaN was demonstrated to induce an Mg-Ga-Al-O oxidized layer with a trap density on the order of 1013 cm-2. The electrical hysteresis is attributed to the hole trapping and detrapping process in the traps of the Mg-Ga-Al-O layer via the Poole-Frenkel mechanism.

  13. Interface states in Al2O3/AlGaN/GaN metal-oxide-semiconductor structure by frequency dependent conductance technique

    NASA Astrophysics Data System (ADS)

    Liao, Xue-Yang; Zhang, Kai; Zeng, Chang; Zheng, Xue-Feng; En, Yun-Fei; Lai, Ping; Hao, Yue

    2014-05-01

    Frequency dependent conductance measurements are implemented to investigate the interface states in Al2O3/AlGaN/GaN metal-oxide-semiconductor (MOS) structures. Two types of device structures, namely, the recessed gate structure (RGS) and the normal gate structure (NGS), are studied in the experiment. Interface trap parameters including trap density Dit, trap time constant τit, and trap state energy ET in both devices have been determined. Furthermore, the obtained results demonstrate that the gate recess process can induce extra traps with shallower energy levels at the Al2O3/AlGaN interface due to the damage on the surface of the AlGaN barrier layer resulting from reactive ion etching (RIE).

  14. Interface trap density and mobility extraction in InGaAs buried quantum well metal-oxide-semiconductor field-effect-transistors by gated Hall method

    SciTech Connect

    Chidambaram, Thenappan; Madisetti, Shailesh; Greene, Andrew; Yakimov, Michael; Tokranov, Vadim; Oktyabrsky, Serge; Veksler, Dmitry; Hill, Richard

    2014-03-31

    In this work, we are using a gated Hall method for measurement of free carrier density and electron mobility in buried InGaAs quantum well metal-oxide-semiconductor field-effect-transistor channels. At room temperature, mobility over 8000 cm{sup 2}/Vs is observed at ∼1.4 × 10{sup 12} cm{sup −2}. Temperature dependence of the electron mobility gives the evidence that remote Coulomb scattering dominates at electron density <2 × 10{sup 11} cm{sup −2}. Spectrum of the interface/border traps is quantified from comparison of Hall data with capacitance-voltage measurements or electrostatic modeling. Above the threshold voltage, gate control is strongly limited by fast traps that cannot be distinguished from free channel carriers just by capacitance-based methods and can be the reason for significant overestimation of channel density and underestimation of carrier mobility from transistor measurements.

  15. Improvement in C-V characteristics of Ge metal-oxide semiconductor capacitor by H2O2 incorporated HCl pretreatment

    NASA Astrophysics Data System (ADS)

    Kamata, Yoshiki; Ino, Tsunehiro; Koyama, Masato; Nishiyama, Akira

    2008-02-01

    Electrical characteristics of high-κ /Ge metal-oxide semiconductor (MOS) capacitors pretreated with HCl or HF solutions are investigated, including the effect of H2O2 incorporation. HCl treatment is more effective than HF treatment for decreasing equivalent oxide thickness. H2O2 incorporation into HCl solution leads to dramatic decrease in the capacitance at inversion side. We have confirmed that residual metal impurities are reduced below 1010atoms/cm2 on the Ge surface after pretreatment with mixed solution of HCl and H2O2. We conclude that decrease in metal impurities at Ge surface is responsible for the superior C-V characteristic of Ge MOS capacitor.

  16. Evaluation of a gate-first process for AlGaN/GaN metal-oxide-semiconductor heterostructure field-effect transistors with low ohmic annealing temperature

    NASA Astrophysics Data System (ADS)

    Liuan, Li; Jiaqi, Zhang; Yang, Liu; Jin-Ping, Ao

    2016-03-01

    In this paper, TiN/AlOx gated AlGaN/GaN metal-oxide-semiconductor heterostructure field-effect transistors (MOS-HFETs) were fabricated for gate-first process evaluation. By employing a low temperature ohmic process, ohmic contact can be obtained by annealing at 600 °C with the contact resistance approximately 1.6 Ω·mm. The ohmic annealing process also acts as a post-deposition annealing on the oxide film, resulting in good device performance. Those results demonstrated that the TiN/AlOx gated MOS-HFETs with low temperature ohmic process can be applied for self-aligned gate AlGaN/GaN MOS-HFETs. Project supported by the International Science and Technology Collaboration Program of China (Grant No. 2012DFG52260).

  17. Origin of the performances degradation of two-dimensional-based metal-oxide-semiconductor field effect transistors in the sub-10 nm regime: A first-principles study

    NASA Astrophysics Data System (ADS)

    Lu, Anh Khoa Augustin; Pourtois, Geoffrey; Agarwal, Tarun; Afzalian, Aryan; Radu, Iuliana P.; Houssa, Michel

    2016-01-01

    The impact of the scaling of the channel length on the performances of metal-oxide-semiconductor field effect transistors, based on two-dimensional (2D) channel materials, is theoretically investigated, using density functional theory combined with the non-equilibrium Green's function method. It is found that the scaling of the channel length below 10 nm leads to strong device performance degradations. Our simulations reveal that this degradation is essentially due to the tunneling current flowing between the source and the drain in these aggressively scaled devices. It is shown that this electron tunneling process is modulated by the effective mass of the 2D channel material, and sets the limit of the scaling in future transistor designs.

  18. Quasi-two-dimensional threshold voltage model for junctionless cylindrical surrounding gate metal-oxide-semiconductor field-effect transistor with dual-material gate

    NASA Astrophysics Data System (ADS)

    Li, Cong; Zhuang, Yi-Qi; Zhang, Li; Jin, Gang

    2014-01-01

    Based on the quasi-two-dimensional (2D) solution of Poisson's equation in two continuous channel regions, an analytical threshold voltage model for short-channel junctionless dual-material cylindrical surrounding-gate (JLDMCSG) metal-oxide-semiconductor field-effect transistor (MOSFET) is developed. Using the derived model, channel potential distribution, horizontal electrical field distribution, and threshold voltage roll-off of JLDMCSG MOSFET are investigated. Compared with junctionless single-material CSG (JLSGCSG) MOSFET, JLDMCSG MOSFET can effectively suppress short-channel effects and simultaneously improve carrier transport efficiency. It is also revealed that threshold voltage roll-off of JLDMCSG can be significantly reduced by adopting both a small oxide thickness and a small silicon channel radius. The model is verified by comparing its calculated results with that obtained from three-dimensional (3D) numerical device simulator ISE.

  19. Spin-dependent transport properties of a GaMnAs-based vertical spin metal-oxide-semiconductor field-effect transistor structure

    SciTech Connect

    Kanaki, Toshiki Asahara, Hirokatsu; Ohya, Shinobu Tanaka, Masaaki

    2015-12-14

    We fabricate a vertical spin metal-oxide-semiconductor field-effect transistor (spin-MOSFET) structure, which is composed of an epitaxial single-crystal heterostructure with a ferromagnetic-semiconductor GaMnAs source/drain, and investigate its spin-dependent transport properties. We modulate the drain-source current I{sub DS} by ∼±0.5% with a gate-source voltage of ±10.8 V and also modulate I{sub DS} by up to 60% with changing the magnetization configuration of the GaMnAs source/drain at 3.5 K. The magnetoresistance ratio is more than two orders of magnitude higher than that obtained in the previous studies on spin MOSFETs. Our result shows that a vertical structure is one of the hopeful candidates for spin MOSFET when the device size is reduced to a sub-micron or nanometer scale.

  20. Operation of the GaSb p-channel metal-oxide-semiconductor field-effect transistors fabricated on (111)A surfaces

    NASA Astrophysics Data System (ADS)

    Nishi, K.; Yokoyama, M.; Yokoyama, H.; Hoshi, T.; Sugiyama, H.; Takenaka, M.; Takagi, S.

    2014-12-01

    We demonstrate the operation of GaSb p-channel metal-oxide-semiconductor field-effect transistors (p-MOSFETs) on (111)A surfaces with Al2O3 gate dielectrics formed by atomic-layer deposition at 150 °C. The p-MOSFETs on (111)A surfaces exhibit higher drain current and lower subthreshold swing than those on (100) surfaces. We find that the interface-state density (Dit) values at the Al2O3/GaSb MOS interfaces on the (111)A surfaces are lower than those on the (100) surfaces, which can lead to performance enhancement of the GaSb p-MOSFETs on (111)A surfaces. The mobility of the GaSb p-MOSFETs on (111)A surfaces is 80% higher than that on (100) surfaces.

  1. Electrical characteristics and thermal stability of HfO{sub 2} metal-oxide-semiconductor capacitors fabricated on clean reconstructed GaSb surfaces

    SciTech Connect

    Miyata, Noriyuki Mori, Takahiro; Yasuda, Tetsuji; Ohtake, Akihiro; Ichikawa, Masakazu

    2014-06-09

    HfO{sub 2}/GaSb interfaces fabricated by high-vacuum HfO{sub 2} deposition on clean reconstructed GaSb surfaces were examined to explore a thermally stable GaSb metal-oxide-semiconductor structure with low interface-state density (D{sub it}). Interface Sb-O bonds were electrically and thermally unstable, and post-metallization annealing at temperatures higher than 200 °C was required to stabilize the HfO{sub 2}/GaSb interfaces. However, the annealing led to large D{sub it} in the upper-half band gap. We propose that the decomposition products that are associated with elemental Sb atoms act as interface states, since a clear correlation between the D{sub it} and the Sb coverage on the initial GaSb surfaces was observed.

  2. INTERDISCIPLINARY PHYSICS AND RELATED AREAS OF SCIENCE AND TECHNOLOGY: Quantum-Mechanical Study on Surrounding-Gate Metal-Oxide-Semiconductor Field-Effect Transistors

    NASA Astrophysics Data System (ADS)

    Hu, Guang-Xi; Wang, Ling-Li; Liu, Ran; Tang, Ting-Ao; Qiu, Zhi-Jun

    2010-10-01

    As the channel length of metal-oxide-semiconductor field-effect transistors (MOSFETs) scales into the nanometer regime, quantum mechanical effects are becoming more and more significant. In this work, a model for the surrounding-gate (SG) nMOSFET is developed. The Schrödinger equation is solved analytically. Some of the solutions are verified via results obtained from simulations. It is found that the percentage of the electrons with lighter conductivity mass increases as the silicon body radius decreases, or as the gate voltage reduces, or as the temperature decreases. The centroid of inversion-layer is driven away from the silicon-oxide interface towards the silicon body, therefore the carriers will suffer less scattering from the interface and the electrons effective mobility of the SG nMOSFETs will be enhanced.

  3. Investigation on edge fringing effect and oxide thickness dependence of inversion current in metal-oxide-semiconductor tunneling diodes with comb-shaped electrodes

    NASA Astrophysics Data System (ADS)

    Lin, Chien-Chih; Hsu, Pei-Lun; Lin, Li; Hwu, Jenn-Gwo

    2014-03-01

    A particular edge-dependent inversion current behavior of metal-oxide-semiconductor (MOS) tunneling diodes was investigated utilizing square and comb-shaped electrodes. The inversion tunneling current exhibits the strong dependence on the tooth size of comb-shaped electrodes and oxide thickness. Detailed illustrations of current conduction mechanism are developed by simulation and experimental measurement results. It is found that the electron diffusion current and Schottky barrier height lowering for hole tunneling current both contribute on inversion current conduction. In MOS tunneling photodiode applications, the photoresponse can be improved by decreasing SiO2 thickness and using comb-shaped electrodes with smaller tooth spacing. Meantime, the high and steady photosensitivity can also be approached by introducing HfO2 into dielectric stacks.

  4. Effect of nitrogen incorporation into Al-based gate insulators in AlON/AlGaN/GaN metal-oxide-semiconductor structures

    NASA Astrophysics Data System (ADS)

    Asahara, Ryohei; Nozaki, Mikito; Yamada, Takahiro; Ito, Joyo; Nakazawa, Satoshi; Ishida, Masahiro; Ueda, Tetsuzo; Yoshigoe, Akitaka; Hosoi, Takuji; Shimura, Takayoshi; Watanabe, Heiji

    2016-10-01

    The superior physical and electrical properties of aluminum oxynitride (AlON) gate dielectrics on AlGaN/GaN substrates in terms of thermal stability, reliability, and interface quality were demonstrated by direct AlON deposition and subsequent annealing. Nitrogen incorporation into alumina was proven to be beneficial both for suppressing intermixing at the insulator/AlGaN interface and reducing the number of electrical defects in Al2O3 films. Consequently, we achieved high-quality AlON/AlGaN/GaN metal-oxide-semiconductor capacitors with improved stability against charge injection and a reduced interface state density as low as 1.2 × 1011 cm-2 eV-1. The impact of nitrogen incorporation into the insulator will be discussed on the basis of experimental findings.

  5. III-V-on-nothing metal-oxide-semiconductor field-effect transistors enabled by top-down nanowire release process: Experiment and simulation

    NASA Astrophysics Data System (ADS)

    Gu, J. J.; Koybasi, O.; Wu, Y. Q.; Ye, P. D.

    2011-09-01

    III-V-on-nothing (III-VON) metal-oxide-semiconductor field-effect transistors (MOSFETs) are experimentally demonstrated with In0.53Ga0.47As as channel and atomic layer deposited Al2O3 as gate dielectric. A hydrochloric acid based release process has been developed to create an air gap beneath the InGaAs channel layer, forming the nanowire channel with width down to 40 nm. III-VON MOSFETs with channel lengths down to 50 nm are fabricated and show promising improvement in drain-induced barrier lowering, due to suppressed short-channel effects. The top-down processing technique provides a viable pathway towards fully gate-all-around III-V MOSFETs.

  6. Device and Circuit Codesign Strategy for Application to Low-Noise Amplifier Based on Silicon Nanowire Metal-Oxide-Semiconductor Field Effect Transistors

    NASA Astrophysics Data System (ADS)

    Seongjae Cho,; Hee-Sauk Jhon,; Jung Hoon Lee,; Se Hwan Park,; Hyungcheol Shin,; Byung-Gook Park,

    2010-04-01

    In this study, a full-range approach from device level to circuit level design is performed for RF application of silicon nanowire (SNW) metal-oxide-semiconductor field effect transistors (MOSFETs). Both DC and AC analyses have been conducted to confirm the advantages of an SNW MOSFET over the conventional planar (CPL) MOSFET device having dimensional equivalence. Besides the intrinsic characteristic parameters, the extrinsic resistance and capacitance caused by wiring components are extracted from each device. On the basis of these intrinsic and extrinsic parameters, a multi-fingered 5.8 GHz low-noise amplifier (LNA) design adopting SNW MOSFETs has been achieved, which shows an improved gain of 17.5 dB and a noise figure of 3.1 dB over a CPL MOSFET LNA.

  7. Effects of stress annealing in nitrogen on the index of refraction of silicon dioxide layers in metal-oxide-semiconductor devices

    NASA Astrophysics Data System (ADS)

    Massoud, Hisham Z.; Przewlocki, Henryk M.

    2002-08-01

    In this article, we report the results of a study of the effects of high-temperature stress annealing in nitrogen on the index of refraction of SiO2 layers in metal/oxide/semiconductor (MOS) devices. In this study, we have experimentally characterized the dependence of mechanical stress in the Si-SiO2 system on the oxidation and annealing conditions and correlated such properties with the dependence of the index of refraction on processing conditions and oxide thickness. We consider the contributions of the thermal-relaxation and nitrogen-incorporation processes in determining changes in the index of refraction with annealing time. This description is consistent with other annealing studies carried out in argon where only the thermal-relaxation process is present. Correlations of these experimental observations with the electrical properties of the same MOS devices are presented in a companion article.

  8. Achieving low parasitic resistance in Ge p-channel metal-oxide-semiconductor field-effect transistors by ion implantation after germanidation

    NASA Astrophysics Data System (ADS)

    Hsin Chang, Wen; Ota, Hiroyuki; Maeda, Tatsuro

    2015-05-01

    The parasitic resistance (Rpara) of Ge p-channel metal-oxide-semiconductor field-effect transistors (p-MOSFETs) fabricated by ion implantation after germanidation (IAG) has been investigated by varying the drive-in annealing temperature. The lowest Rpara of 835 Ω µm was achieved after 450 °C drive-in annealing for 1 min. Boron segregation between NiGe and Ge induced by drive-in annealing has advantages in forming an abrupt metallic source/drain (S/D) junction and contributes to the decrease in Rpara. The appropriate process window for fabricating Ge p-MOSFETs by IAG was also given. IAG, a pathway for introducing a Ge channel into CMOS technology beyond the 10 nm node, was proved to be effective for reducing Rpara.

  9. Direct x-ray imaging system using an amplified metal-oxide-semiconductor imager in the 4-13-nm wavelength region

    NASA Astrophysics Data System (ADS)

    Haga, Tsuneyuki; Kinoshita, Hiroo

    1995-10-01

    We describe a direct x-ray imaging system that uses an amplified metal-oxide-semiconductor imager to detect soft x rays directly for real-time imaging. From the absolute sensitivity of this system as measured through the use of a monochromatic synchrotron radiation beam and a GaAsP Schottky-type photodiode, the minimum sensitivity at a wavelength of 13 nm was estimated to be greater than 108 photons mm-2. This is sufficient to detect soft x rays directly for real-time imaging. Onion cell observations at wavelengths of 4.3 and 4.6 nm indicate that x-ray absorption by the carbon in the cells was detected. This is a promising imaging system for the soft x-ray region in which conventional CCD's are difficult to use.

  10. Anomalous increase in hot-carrier-induced threshold voltage shift in n-type drain extended metal-oxide-semiconductor transistors

    NASA Astrophysics Data System (ADS)

    Chen, Jone F.; Chen, Shiang-Yu; Lee, J. R.; Wu, Kuo-Ming; Huang, Tsung-Yi; Liu, C. M.

    2008-03-01

    Anomalous increase in positive threshold voltage shift (ΔVT) in n-type drain extended metal-oxide-semiconductor (DEMOS) transistors stressed under high drain voltage and gate voltage is observed. Charge pumping data and technology computer-aided-design simulations reveal that hot-electron injection and trapping in the gate oxide above channel region is responsible for ΔVT. Enhanced impact ionization rate resulted from the presence of large amount of negative oxide charge in channel region is identified to be the main mechanism for anomalous increase in ΔVT. From the results presented in this letter, hot-carrier-induced anomalous increase in ΔVT can become a serious reliability concern in DEMOS transistors.

  11. Performance enhancement of multiple-gate ZnO metal-oxide-semiconductor field-effect transistors fabricated using self-aligned and laser interference photolithography techniques

    PubMed Central

    2014-01-01

    The simple self-aligned photolithography technique and laser interference photolithography technique were proposed and utilized to fabricate multiple-gate ZnO metal-oxide-semiconductor field-effect transistors (MOSFETs). Since the multiple-gate structure could improve the electrical field distribution along the ZnO channel, the performance of the ZnO MOSFETs could be enhanced. The performance of the multiple-gate ZnO MOSFETs was better than that of the conventional single-gate ZnO MOSFETs. The higher the drain-source saturation current (12.41 mA/mm), the higher the transconductance (5.35 mS/mm) and the lower the anomalous off-current (5.7 μA/mm) for the multiple-gate ZnO MOSFETs were obtained. PMID:24948884

  12. The influence of electron energy quantization in a space-charge region on the accumulation capacitance of InAs metal-oxide-semiconductor capacitors

    SciTech Connect

    Kovchavtsev, A. P. Tsarenko, A. V.; Guzev, A. A.; Polovinkin, V. G.; Nastovjak, A. E.; Valisheva, N. A.; Aksenov, M. S.

    2015-09-28

    The influence of electron energy quantization in a space-charge region on the accumulation capacitance of the InAs-based metal-oxide-semiconductor capacitors (MOSCAPs) has been investigated by modeling and comparison with the experimental data from Au/anodic layer(4-20 nm)/n-InAs(111)A MOSCAPs. The accumulation capacitance for MOSCAPs has been calculated by the solution of Poisson equation with different assumptions and the self-consistent solution of Schrödinger and Poisson equations with quantization taken into account. It was shown that the quantization during the MOSCAPs accumulation capacitance calculations should be taken into consideration for the correct interface states density determination by Terman method and the evaluation of gate dielectric thickness from capacitance-voltage measurements.

  13. Investigation of Stress Memorization Process on Low-Frequency Noise Performance for Strained Si n-Type Metal-Oxide-Semiconductor Field-Effect Transistors

    NASA Astrophysics Data System (ADS)

    Kuo, Cheng-Wen; Wu, San-Lein; Lin, Hau-Yu; Huang, Yao-Tsung; Chang, Shoou-Jinn; Hong, De-Gong; Wu, Chung-Yi; Cheng, Yao-Chin; Cheng, Osbert

    2011-04-01

    The use of low-frequency (1/f) noise to evaluate low-cost stress-memorization technique (SMT) induced-stress in n-type metal-oxide-semiconductor field-effect transistors has been investigated. As compared to device without SMT process, the comparable 1/f noise level obtained for strained Si devices with the low-cost SMT process indicates that adding the low-cost SMT process will not affect the Si/SiO2 interface quality. Moreover, through observing experiment result and Hooge's parameter αH, the mechanism of 1/f noise in the both devices can be properly interpreted by the carrier number fluctuations correlated mobility fluctuations (unified model).

  14. Temperature-independent switching rates for a random telegraph signal in a silicon metal-oxide-semiconductor field-effect transistor at low temperatures

    SciTech Connect

    Scofield, John H.; Borland, Nick; Fleetwood, D. M.

    2000-05-29

    We have observed discrete random telegraph signals (RTSs) in the drain voltages of three, nominally 1.25 {mu}mx1.25 {mu}m, enhancement-mode p-channel metal-oxide-semiconductor transistors operated in strong inversion in their linear regimes with constant drain-current and gate-voltage bias, for temperatures ranging from 4.2 to 300 K. The switching rates for all RTSs observed above 30 K were thermally activated. The switching rate for the only RTS observed below 30 K was thermally activated above 30 K but temperature independent below 10 K. This response is consistent with a crossover from thermal activation to tunneling at low temperatures. Implications are discussed for models of change exchange between the Si and the near-interfacial SiO{sub 2}. (c) 2000 American Institute of Physics.

  15. New Compact and Time-Efficient Reliability Physics Model for p-Type Metal-Oxide-Semiconductor Field-Effect Transistors

    NASA Astrophysics Data System (ADS)

    Sheu, Chorng-Jye

    2010-11-01

    In this paper, we present a new compact and time-efficient reliability physics model of drain, substrate, and gate currents for p-type metal-oxide-semiconductor field-effect transistors (pMOSFETs). The pre-stress drain current and channel electric field are first calculated, and the spatial distribution of electron temperature along the channel is then derived using a simplified energy balance equation. Having calculated the nonlocal impact ionization coefficient and electron temperature, and modified the lucky-electron concept, the nonlocal electron substrate and gate currents can be derived. We use an oxide-trapping mechanism for calculating the spatial distribution of oxide-trapping charges, which are substituted into the damaged pMOSFETs drain current model; then we can model the hot-carrier-damaged drain current. This model is a time-saving computer-aided-design (CAD) model and is physics transparent for pMOSFETs.

  16. Commercialisation of CMOS Integrated Circuit Technology in Multi-Electrode Arrays for Neuroscience and Cell-Based Biosensors

    PubMed Central

    Graham, Anthony H. D.; Robbins, Jon; Bowen, Chris R.; Taylor, John

    2011-01-01

    The adaptation of standard integrated circuit (IC) technology as a transducer in cell-based biosensors in drug discovery pharmacology, neural interface systems and electrophysiology requires electrodes that are electrochemically stable, biocompatible and affordable. Unfortunately, the ubiquitous Complementary Metal Oxide Semiconductor (CMOS) IC technology does not meet the first of these requirements. For devices intended only for research, modification of CMOS by post-processing using cleanroom facilities has been achieved. However, to enable adoption of CMOS as a basis for commercial biosensors, the economies of scale of CMOS fabrication must be maintained by using only low-cost post-processing techniques. This review highlights the methodologies employed in cell-based biosensor design where CMOS-based integrated circuits (ICs) form an integral part of the transducer system. Particular emphasis will be placed on the application of multi-electrode arrays for in vitro neuroscience applications. Identifying suitable IC packaging methods presents further significant challenges when considering specific applications. The various challenges and difficulties are reviewed and some potential solutions are presented. PMID:22163884

  17. Commercialisation of CMOS integrated circuit technology in multi-electrode arrays for neuroscience and cell-based biosensors.

    PubMed

    Graham, Anthony H D; Robbins, Jon; Bowen, Chris R; Taylor, John

    2011-01-01

    The adaptation of standard integrated circuit (IC) technology as a transducer in cell-based biosensors in drug discovery pharmacology, neural interface systems and electrophysiology requires electrodes that are electrochemically stable, biocompatible and affordable. Unfortunately, the ubiquitous Complementary Metal Oxide Semiconductor (CMOS) IC technology does not meet the first of these requirements. For devices intended only for research, modification of CMOS by post-processing using cleanroom facilities has been achieved. However, to enable adoption of CMOS as a basis for commercial biosensors, the economies of scale of CMOS fabrication must be maintained by using only low-cost post-processing techniques. This review highlights the methodologies employed in cell-based biosensor design where CMOS-based integrated circuits (ICs) form an integral part of the transducer system. Particular emphasis will be placed on the application of multi-electrode arrays for in vitro neuroscience applications. Identifying suitable IC packaging methods presents further significant challenges when considering specific applications. The various challenges and difficulties are reviewed and some potential solutions are presented.

  18. Spectroscopic analysis on metal-oxide-semiconductor light-emitting diodes with buried Si nanocrystals and nano-pyramids in SiO(x) film.

    PubMed

    Lin, Gong-Ru

    2008-03-01

    The difference between the white and near-infrared electroluminescence of metal-oxide-semiconductor light-emitting diodes fabricated on 1,100 degrees C-annealed Si-rich SiO(x)/p-Si substrate with interfacial pyramidal Si dots (Si nano-pyramids) was characterized. By changing the substrate temperature and induced coupled plasma power during the plasma enhanced chemical vapor deposition of Si-rich SiO(x) films, the effects of the growth conditions on the defect- and Si nano-pyramid-related carrier transport and Si nanocrystal-related electroluminescence spectroscopy were also investigated. The annealed Si-rich SiO(x)/p-Si films grown at higher synthesized substrate temperate (350 degrees C) show the larger Si nano-pyramids precipitating near the Si/SiO2 interface. The indium tin oxide/Si-rich SiO(x)/p-Si/Al metal-oxide-semiconductor light-emitting diodes with Si-rich SiO(x) films exhibit different white-light electroluminescence spectra at wavelengths from 400 to 650 nm. The Si nanocrystal-related electroluminescence spectra at 650-850 nm are confirmed, whereas the electroluminescence spectra are shorter wavelengths is attributed to oxygen related defects. These defects become an electron-preferred transporting path within the Si-rich SiO(x) film, whose densities are decreased by increasing the substrate temperature or reducing the induced coupled plasma power. Defect-related white-light electroluminescence emits power for a relatively short lifetime. The lifetime can be lengthened and the electroluminescence power can be raised simultaneously by increasing deposition temperature to 350 degrees C and adjusting the induced coupled plasma power to a threshold of 30 W, which effectively increases the densities of Si nanocrystals and nano-pyramids in the Si-rich SiO(x) film with Si concentration of up to 40 at%. A nearly defect-free Si-rich SiO(x) sample can be grown under such conditions, which contributes to the most stable and largest near-infrared electroluminescence

  19. Biosensors.

    ERIC Educational Resources Information Center

    Rechnitz, Garry A.

    1988-01-01

    Describes theory and principles behind biosensors that incorporate biological components as part of a sensor or probe. Projects major applications in medicine and veterinary medicine, biotechnology, food and agriculture, environmental studies, and the military. Surveys current use of biosensors. (ML)

  20. Biosensors.

    ERIC Educational Resources Information Center

    Rechnitz, Garry A.

    1988-01-01

    Describes theory and principles behind biosensors that incorporate biological components as part of a sensor or probe. Projects major applications in medicine and veterinary medicine, biotechnology, food and agriculture, environmental studies, and the military. Surveys current use of biosensors. (ML)

  1. Trap state passivation improved hot-carrier instability by zirconium-doping in hafnium oxide in a nanoscale n-metal-oxide semiconductor-field effect transistors with high-k/metal gate

    SciTech Connect

    Liu, Hsi-Wen; Tsai, Jyun-Yu; Liu, Kuan-Ju; Lu, Ying-Hsin; Chang, Ting-Chang; Chen, Ching-En; Tseng, Tseung-Yuen; Lin, Chien-Yu; Cheng, Osbert; Huang, Cheng-Tung; Ye, Yi-Han

    2016-04-25

    This work investigates the effect on hot carrier degradation (HCD) of doping zirconium into the hafnium oxide high-k layer in the nanoscale high-k/metal gate n-channel metal-oxide-semiconductor field-effect-transistors. Previous n-metal-oxide semiconductor-field effect transistor studies demonstrated that zirconium-doped hafnium oxide reduces charge trapping and improves positive bias temperature instability. In this work, a clear reduction in HCD is observed with zirconium-doped hafnium oxide because channel hot electron (CHE) trapping in pre-existing high-k bulk defects is the main degradation mechanism. However, this reduced HCD became ineffective at ultra-low temperature, since CHE traps in the deeper bulk defects at ultra-low temperature, while zirconium-doping only passivates shallow bulk defects.

  2. Role of fringing field on the electrical characteristics of metal-oxide-semiconductor capacitors with co-planar and edge-removed oxides

    NASA Astrophysics Data System (ADS)

    Yang, Chang-Feng; Hwu, Jenn-Gwo

    2016-12-01

    Due to the simplicity of the fabrication process, the ultra-thin oxide metal-oxide-semiconductor capacitors (MOSCAPs) can be a promising device for sensing, memory, and transconductance applications. The investigation of the fundamental electrical characteristics of ultra-thin oxide MOSCAPs is still of importance. In this work, the influence of the removal of the surrounded gate oxide was studied to know the role of fringing field. For edge-removed oxide, the tunneling saturation current shows no oxide thickness dependency and exhibits a low current level of 9.4×10-11 at 2V (dox=2.3 nm). Also, its deep depletion occurs earlier when biasing. In contrast, for the device without oxide removing, i.e., co-planar oxide, the saturation current is strongly related to the oxide thickness and exhibits a high current level of 3.5×10-6 at 2V (dox=2.3 nm) due to regular oxide voltage drop modulation effect on effective Schottky barrier height. For the thick oxide of 4.2 nm the inversion capacitances are frequency dependant for CP-OX but are independent for ER-OX MOSCAPs. These characteristics are mainly caused by the different fringing fields and the defect densities at device edge between two structures.

  3. Analytical modeling to design the vertically aligned Si-nanowire metal-oxide-semiconductor photosensors for direct color sensing with high spectral resolution

    NASA Astrophysics Data System (ADS)

    Sikdar, Subhrajit; Chowdhury, Basudev Nag; Ghosh, Ajay; Chattopadhyay, Sanatan

    2017-03-01

    In the current work, an analytical model for the design of vertically aligned silicon (Si) nanowire metal-oxide-semiconductor (MOS) capacitor based multi-color photodetectors has been developed for the detection of entire visible spectrum with high spectral resolution. The photogeneration phenomena within the nanostructures are analyzed in detail by developing a quantum field model associated with second quantization electron-photon field operators. The non-equilibrium Green's function (NEGF) formalism is employed to solve the relevant equations. The study shows that the proposed device with specified design of diameter-voltage combinations is capable of detecting 64 spectral bands of the entire visible spectrum (380 nm to700 nm) directly with a very high resolution of 5 nm wavelength. Such direct sensing of each wavelength is observed to be independent of the fluctuations of illumination intensity. The device is designed to obtain a full-width-at-half-maximum (FWHM) smaller than the spectral resolution (5 nm) for each wavelength of the visible range, which indicates a very high quality digital imaging/sensing method. Such devices may be a potential alternative for the future nanoelectronics based photodevices for superior sensing/imaging applications.

  4. P-Channel InGaN/GaN heterostructure metal-oxide-semiconductor field effect transistor based on polarization-induced two-dimensional hole gas

    PubMed Central

    Zhang, Kexiong; Sumiya, Masatomo; Liao, Meiyong; Koide, Yasuo; Sang, Liwen

    2016-01-01

    The concept of p-channel InGaN/GaN heterostructure field effect transistor (FET) using a two-dimensional hole gas (2DHG) induced by polarization effect is demonstrated. The existence of 2DHG near the lower interface of InGaN/GaN heterostructure is verified by theoretical simulation and capacitance-voltage profiling. The metal-oxide-semiconductor FET (MOSFET) with Al2O3 gate dielectric shows a drain-source current density of 0.51 mA/mm at the gate voltage of −2 V and drain bias of −15 V, an ON/OFF ratio of two orders of magnitude and effective hole mobility of 10 cm2/Vs at room temperature. The normal operation of MOSFET without freeze-out at 8 K further proves that the p-channel behavior is originated from the polarization-induced 2DHG. PMID:27021054

  5. AlGaN/GaN Metal-Oxide-Semiconductor High-Electron-Mobility Transistor with Polarized P(VDF-TrFE) Ferroelectric Polymer Gating.

    PubMed

    Liu, Xinke; Lu, Youming; Yu, Wenjie; Wu, Jing; He, Jiazhu; Tang, Dan; Liu, Zhihong; Somasuntharam, Pannirselvam; Zhu, Deliang; Liu, Wenjun; Cao, Peijiang; Han, Sun; Chen, Shaojun; Tan, Leng Seow

    2015-09-14

    Effect of a polarized P(VDF-TrFE) ferroelectric polymer gating on AlGaN/GaN metal-oxide-semiconductor high-electron-mobility transistors (MOS-HEMTs) was investigated. The P(VDF-TrFE) gating in the source/drain access regions of AlGaN/GaN MOS-HEMTs was positively polarized (i.e., partially positively charged hydrogen were aligned to the AlGaN surface) by an applied electric field, resulting in a shift-down of the conduction band at the AlGaN/GaN interface. This increases the 2-dimensional electron gas (2-DEG) density in the source/drain access region of the AlGaN/GaN heterostructure, and thereby reduces the source/drain series resistance. Detailed material characterization of the P(VDF-TrFE) ferroelectric film was also carried out using the atomic force microscopy (AFM), X-ray Diffraction (XRD), and ferroelectric hysteresis loop measurement.

  6. AlGaN/GaN Metal-Oxide-Semiconductor High-Electron-Mobility Transistor with Polarized P(VDF-TrFE) Ferroelectric Polymer Gating

    PubMed Central

    Liu, Xinke; Lu, Youming; Yu, Wenjie; Wu, Jing; He, Jiazhu; Tang, Dan; Liu, Zhihong; Somasuntharam, Pannirselvam; Zhu, Deliang; Liu, Wenjun; Cao, Peijiang; Han, Sun; Chen, Shaojun; Seow Tan, Leng

    2015-01-01

    Effect of a polarized P(VDF-TrFE) ferroelectric polymer gating on AlGaN/GaN metal-oxide-semiconductor high-electron-mobility transistors (MOS-HEMTs) was investigated. The P(VDF-TrFE) gating in the source/drain access regions of AlGaN/GaN MOS-HEMTs was positively polarized (i.e., partially positively charged hydrogen were aligned to the AlGaN surface) by an applied electric field, resulting in a shift-down of the conduction band at the AlGaN/GaN interface. This increases the 2-dimensional electron gas (2-DEG) density in the source/drain access region of the AlGaN/GaN heterostructure, and thereby reduces the source/drain series resistance. Detailed material characterization of the P(VDF-TrFE) ferroelectric film was also carried out using the atomic force microscopy (AFM), X-ray Diffraction (XRD), and ferroelectric hysteresis loop measurement. PMID:26364872

  7. Atomic Layer Deposition of Gallium Oxide Films as Gate Dielectrics in AlGaN/GaN Metal-Oxide-Semiconductor High-Electron-Mobility Transistors.

    PubMed

    Shih, Huan-Yu; Chu, Fu-Chuan; Das, Atanu; Lee, Chia-Yu; Chen, Ming-Jang; Lin, Ray-Ming

    2016-12-01

    In this study, films of gallium oxide (Ga2O3) were prepared through remote plasma atomic layer deposition (RP-ALD) using triethylgallium and oxygen plasma. The chemical composition and optical properties of the Ga2O3 thin films were investigated; the saturation growth displayed a linear dependence with respect to the number of ALD cycles. These uniform ALD films exhibited excellent uniformity and smooth Ga2O3-GaN interfaces. An ALD Ga2O3 film was then used as the gate dielectric and surface passivation layer in a metal-oxide-semiconductor high-electron-mobility transistor (MOS-HEMT), which exhibited device performance superior to that of a corresponding conventional Schottky gate HEMT. Under similar bias conditions, the gate leakage currents of the MOS-HEMT were two orders of magnitude lower than those of the conventional HEMT, with the power-added efficiency enhanced by up to 9 %. The subthreshold swing and effective interfacial state density of the MOS-HEMT were 78 mV decade(-1) and 3.62 × 10(11) eV(-1) cm(-2), respectively. The direct-current and radio-frequency performances of the MOS-HEMT device were greater than those of the conventional HEMT. In addition, the flicker noise of the MOS-HEMT was lower than that of the conventional HEMT.

  8. In Situ XPS Chemical Analysis of MnSiO3 Copper Diffusion Barrier Layer Formation and Simultaneous Fabrication of Metal Oxide Semiconductor Electrical Test MOS Structures.

    PubMed

    Byrne, Conor; Brennan, Barry; McCoy, Anthony P; Bogan, Justin; Brady, Anita; Hughes, Greg

    2016-02-03

    Copper/SiO2/Si metal-oxide-semiconductor (MOS) devices both with and without a MnSiO3 barrier layer at the Cu/SiO2 interface have been fabricated in an ultrahigh vacuum X-ray photoelectron spectroscopy (XPS) system, which allows interface chemical characterization of the barrier formation process to be directly correlated with electrical testing of barrier layer effectiveness. Capacitance voltage (CV) analysis, before and after tube furnace anneals of the fabricated MOS structures showed that the presence of the MnSiO3 barrier layer significantly improved electric stability of the device structures. Evidence of improved adhesion of the deposited copper layer to the MnSiO3 surface compared to the clean SiO2 surface was apparent both from tape tests and while probing the samples during electrical testing. Secondary ion mass spectroscopy (SIMS) depth profiling measurements of the MOS test structures reveal distinct differences of copper diffusion into the SiO2 dielectric layers following the thermal anneal depending on the presence of the MnSiO3 barrier layer.

  9. Tunneling-injection-induced turnaround behavior of threshold voltage in thermally nitrided oxide n-channel metal-oxide-semiconductor field-effect transistors

    NASA Astrophysics Data System (ADS)

    Ma, Z. J.; Lai, P. T.; Liu, Z. H.; Fleischer, S.; Cheng, Y. C.

    1990-12-01

    The threshold voltage (VT) degradation metal-oxide-semiconductor field-effect transistors (MOSFETs) with thermally nitrided oxide or pure oxide as gate dielectric was determined under Fowler-Nordheim (FN) stressing. A typical VT turnaround behavior was observed for both kinds of devices. The VT for nitrided oxide MOSFETs shifts more negatively than that for pure oxide MOSFETs during the initial period of FN stressing whereas the opposite is true for the positive shift after the critical time at turnaround point. The discovery that the shift of substrate current peak exhibits similar turnaround behavior reinforces the above results. In the meantime, the field-effect electron mobility and the maximum transconductance in the channel for nitrided oxide MOSFETs are only slightly degraded by stressing as compared to that for pure oxide MOSFETs. The VT turnaround behavior can be explained as follows: Net trapped charges in the oxide are initially positive (due to hole traps in the oxide) and result in the negative shift of VT. With increasing injection time, trapped electrons in the oxide as well as acceptortype interface states increase. This results in the positive shift in VT. It is revealed that VT degradation in MOSFETs is dominated by the generation of acceptortype interface states rather than electron trapping in the oxide after the critical time.

  10. Ultrathin body GaSb-on-insulator p-channel metal-oxide-semiconductor field-effect transistors on Si fabricated by direct wafer bonding

    SciTech Connect

    Yokoyama, Masafumi Takenaka, Mitsuru; Takagi, Shinichi; Yokoyama, Haruki

    2015-02-16

    We have realized ultrathin body GaSb-on-insulator (GaSb-OI) on Si wafers by direct wafer bonding technology using atomic-layer deposition (ALD) Al{sub 2}O{sub 3} and have demonstrated GaSb-OI p-channel metal-oxide-semiconductor field-effect transistors (p-MOSFETs) on Si. A 23-nm-thick GaSb-OI p-MOSFET exhibits the peak effective mobility of ∼76 cm{sup 2}/V s. We have found that the effective hole mobility of the thin-body GaSb-OI p-MOSFETs decreases with a decrease in the GaSb-OI thickness or with an increase in Al{sub 2}O{sub 3} ALD temperature. The InAs passivation of GaSb-OI MOS interfaces can enhance the peak effective mobility up to 159 cm{sup 2}/V s for GaSb-OI p-MOSFETs with the 20-nm-thick GaSb layer.

  11. Impact of mechanical stress on gate tunneling currents of germanium and silicon p-type metal-oxide-semiconductor field-effect transistors and metal gate work function

    NASA Astrophysics Data System (ADS)

    Choi, Youn Sung; Numata, Toshinori; Nishida, Toshikazu; Harris, Rusty; Thompson, Scott E.

    2008-03-01

    Uniaxial four-point wafer bending stress-altered gate tunneling currents are measured for germanium (Ge)/silicon (Si) channel metal-oxide-semiconductor field-effect transistors (MOSFETs) with HfO2/SiO2 gate dielectrics and TiN/P+ poly Si electrodes. Carrier separation is used to measure electron and hole currents. The strain-altered hole tunneling current from the p-type inversion layer of Ge is measured to be ˜4 times larger than that for the Si channel MOSFET, since the larger strain-induced valence band-edge splitting in Ge results in more hole repopulation into a subband with a smaller out-of-plane effective mass and a lower tunneling barrier height. The strain-altered electron tunneling current from the metal gate is measured and shown to change due to strain altering the metal work function as quantified by flatband voltage shift measurements of Si MOS capacitors with TaN electrodes.

  12. Novel Bulk Silicon Lateral Double-Diffused Metal-Oxide-Semiconductor Field-Effect Transistors Using Step Thickness Technology in Drift Region

    NASA Astrophysics Data System (ADS)

    Huang, Shi; Guo, Yufeng; Yao, Jiafei; Hua, Tingting; Zhang, Jun; Zhang, Changchun; Ji, Xincun

    2013-12-01

    In this paper, a novel bulk silicon lateral double-diffused metal-oxide-semiconductor field-effect transistors (LDMOS) using step thickness technology in drift region is proposed. The drift region is divided into several zones with different thicknesses increasing from source to drain. Owing to modulation effect of the step thickness drift region, new additional electric field peaks are introduced in the drift region, thus leading to the reduction of the surface electric fields and the increase of the breakdown voltage. The influences of device parameters on breakdown voltage and specific on-resistance are investigated using semiconductor device simulator, MEDICI. The simulation results indicate that an 18.4% increase in the breakdown voltage and a 42.5% increase in the figure of merit (FOM) are obtained in the novel device in comparison with the conventional LDMOS. Furthermore, single step can lead to approximately ideal FOM in comparison with the multiple steps, so that can obtain a suitable trade-off between fabrication costs and performance.

  13. Optimization of Vertical Double-Diffused Metal-Oxide Semiconductor (VDMOS) Power Transistor Structure for Use in High Frequencies and Medical Devices.

    PubMed

    Farhadi, Rozita; Farhadi, Bita

    2014-01-01

    Power transistors, such as the vertical, double-diffused, metal-oxide semiconductor (VDMOS), are used extensively in the amplifier circuits of medical devices. The aim of this research was to construct a VDMOS power transistor with an optimized structure to enhance the operation of medical devices. First, boron was implanted in silicon by implanting unclamped inductive switching (UIS) and a Faraday shield. The Faraday shield was implanted in order to replace the gate-field parasitic capacitor on the entry part of the device. Also, implanting the UIS was used in order to decrease the effect of parasitic bipolar junction transistor (BJT) of the VDMOS power transistor. The research tool used in this study was Silvaco software. By decreasing the transistor entry resistance in the optimized VDMOS structure, power losses and noise at the entry of the transistor were decreased, and, by increasing the breakdown voltage, the lifetime of the VDMOS transistor lifetime was increased, which resulted in increasing drain flow and decreasing Ron. This consequently resulted in enhancing the operation of high-frequency medical devices that use transistors, such as Radio Frequency (RF) and electrocardiograph machines.

  14. Modeling of anisotropic two-dimensional materials monolayer HfS{sub 2} and phosphorene metal-oxide semiconductor field effect transistors

    SciTech Connect

    Chang, Jiwon

    2015-06-07

    Ballistic transport characteristics of metal-oxide semiconductor field effect transistors (MOSFETs) based on anisotropic two-dimensional materials monolayer HfS{sub 2} and phosphorene are explored through quantum transport simulations. We focus on the effects of the channel crystal orientation and the channel length scaling on device performances. Especially, the role of degenerate conduction band (CB) valleys in monolayer HfS{sub 2} is comprehensively analyzed. Benchmarking monolayer HfS{sub 2} with phosphorene MOSFETs, we predict that the effect of channel orientation on device performances is much weaker in monolayer HfS{sub 2} than in phosphorene due to the degenerate CB valleys of monolayer HfS{sub 2}. Our simulations also reveal that at 10 nm channel length scale, phosphorene MOSFETs outperform monolayer HfS{sub 2} MOSFETs in terms of the on-state current. However, it is observed that monolayer HfS{sub 2} MOSFETs may offer comparable, but a little bit degraded, device performances as compared with phosphorene MOSFETs at 5 nm channel length.

  15. Mechanical Stress Evaluation of Si Metal-Oxide-Semiconductor Field-Effect Transistor Structure Using Polarized Ultraviolet Raman Spectroscopy Measurements and Calibrated Technology-Computer-Aided-Design Simulations

    NASA Astrophysics Data System (ADS)

    Satoh, Akira; Tada, Tetsuya; Poborchii, Vladimir; Kanayama, Toshihiko; Satoh, Shigeo; Arimoto, Hiroshi

    2012-01-01

    The mechanical stresses in Si metal-oxide-semiconductor field-effect transistors (MOSFETs) were evaluated by polarized UV Raman spectroscopy measurements and stress simulations. To calibrate stress parameters of the materials used in the Si MOSFETs, we compared measured and simulated Raman frequency shifts on the cleaved Si(110) surfaces of the MOSFETs. Consequently, we extracted intrinsic stress values of -400 MPa for a SiO2, -200 MPa for polycrystalline Si (poly-Si), 700 MPa for Ni silicide, 1250 MPa for a SiN tensile stress liner, and -3500 MPa for a SiN compressive stress liner by finding good agreement between the measured and simulated Raman shift distributions. To verify our stress simulation, we investigated the source/drain width dependences of Raman frequency shifts near the channel regions of Si MOSFETs by top-view Raman measurements. The calculated Raman frequency shifts agreed well with the results of polarized Raman measurements in terms of not only relative tendencies but also absolute Raman shift values.

  16. High quality HfO{sub 2}/p-GaSb(001) metal-oxide-semiconductor capacitors with 0.8 nm equivalent oxide thickness

    SciTech Connect

    Barth, Michael; Datta, Suman; Bruce Rayner, G.; McDonnell, Stephen; Wallace, Robert M.; Bennett, Brian R.; Engel-Herbert, Roman

    2014-12-01

    We investigate in-situ cleaning of GaSb surfaces and its effect on the electrical performance of p-type GaSb metal-oxide-semiconductor capacitor (MOSCAP) using a remote hydrogen plasma. Ultrathin HfO{sub 2} films grown by atomic layer deposition were used as a high permittivity gate dielectric. Compared to conventional ex-situ chemical cleaning methods, the in-situ GaSb surface treatment resulted in a drastic improvement in the impedance characteristics of the MOSCAPs, directly evidencing a much lower interface trap density and enhanced Fermi level movement efficiency. We demonstrate that by using a combination of ex-situ and in-situ surface cleaning steps, aggressively scaled HfO{sub 2}/p-GaSb MOSCAP structures with a low equivalent oxide thickness of 0.8 nm and efficient gate modulation of the surface potential are achieved, allowing to push the Fermi level far away from the valence band edge high up into the band gap of GaSb.

  17. Low- and high-resistivity silicon substrate characterization using the Al/silicon-rich oxide/Si structure with comparison to the metal oxide semiconductor technique

    NASA Astrophysics Data System (ADS)

    Luna-López, A.; Aceves-Mijares, M.; Malik, O.; Glaenzer, R.

    2005-05-01

    High-resistivity silicon substrates (HRS, NB<1014 cm-3) are commonly used, especially in optoelectronic integrated circuits. However, standard metal oxide semiconductor (MOS) characterization methods fail to predict correctly the dopant concentration and lifetime. This is due to the high resistance in series with the MOS capacitor, which causes an erroneous capacitance measurement at high frequency. To overcome this restriction, a different characterization method is proposed, using the electronic transport property of silicon-rich oxide (SRO) films, with aluminum/silicon-rich oxide (Al/SRO/Si) devices and using capacitance-voltage (C-V) and current-voltage (I-V) characteristics, the dopant concentration and lifetime can be estimated with these method. In addition, using low/high-frequency C-V measurements in MOS structure on HRS can be used to determine the dopant concentration. In this work, low-resistivity silicon and HRS substrates are characterized. The results for both type of substrates and for the different methods are compared. It is shown that the results are similar and any of these methods produce reliable results, but the Al/SRO/Si structure has the advantage that the generation lifetime is easily obtained.

  18. A Compact Half Select Disturb Free Static Random Access Memory Cell with Stacked Vertical Metal-Oxide-Semiconductor Field-Effect Transistor

    NASA Astrophysics Data System (ADS)

    Na, Hyoungjun; Endoh, Tetsuo

    2012-02-01

    In this paper, a half select disturb free compact static random access memory (SRAM) cell with the stacked vertical metal-oxide-semiconductor field-effect transistor (MOSFET) is proposed, and the impacts on its cell size, stability and speed performance are evaluated. The proposed SRAM cell has a small cell size, which is 67% of the conventional eight-transistor (8T) SRAM cell, because of its stacked vertical MOSFET structure. It realizes a half select disturb free SRAM operation; therefore, a larger static noise margin of 5.9 times is achieved in comparison with the conventional 8T SRAM cell. It suppresses the degradation of the write margin, thus its write margin is 84.2% of the conventional 8T SRAM cell. Furthermore, it suppresses the degradation of the write time by 39% (0.249 ns). The proposed compact SRAM cell with the stacked vertical MOSFET is a suitable SRAM cell with a small cell size, immunity to the half select disturb, wide write margin and fast write time.

  19. High-performance GaAs metal-oxide-semiconductor capacitor by using NbAlON as high-k gate dielectric

    NASA Astrophysics Data System (ADS)

    Liu, L. N.; Choi, H. W.; Xu, J. P.; Lai, P. T.

    2017-03-01

    A GaAs metal-oxide-semiconductor (MOS) capacitor using NbAlON as a gate dielectric with different Nb contents is fabricated. Experimental results show that the k value and crystallization temperature of the AlON dielectric can be improved by Nb incorporation, together with reduction in negative oxide charges. However, the interface quality and gate leakage become poorer as the Nb content increases, as confirmed by TEM and X-ray photoelectron spectroscopy results. Therefore, through comprehensively considering the advantages and disadvantages, the sample with a Nb/(Al+Nb) atomic ratio of 62.5% exhibits the best characteristics: high k value (23.3), low interface-state density (2.7 × 1012 cm-2/eV), small hysteresis (55 mV), small frequency dispersion, and low gate leakage current (2.66 × 10-5A/cm2 at Vfb + 1 V). By comparing with reported GaAs MOS devices with different high-k gate dielectrics, it can be suggested that NbAlON is a promising gate dielectric material to achieve excellent electrical performance for GaAs MOS devices.

  20. Investigation of Device Performance and Negative Bias Temperature Instability of Plasma Nitrided Oxide in Nanoscale p-Channel Metal-Oxide-Semiconductor Field-Effect Transistor's

    NASA Astrophysics Data System (ADS)

    Han, In-Shik; Ji, Hee-Hwan; Goo, Tae-Gyu; Yoo, Ook-Sang; Choi, Won-Ho; Na, Min-Ki; Kim, Yong-Goo; Park, Sung-Hyung; Lee, Heui-Seung; Kang, Young-Seok; Kim, Dae-Byung; Lee, Hi-Deok

    2008-04-01

    In this paper, we investigated the device performance and negative bias temperature instability (NBTI) degradation for thermally nitrided oxide (TNO) and plasma nitrided oxide (PNO) in nanoscale p-channel metal oxide semiconductor field effect transistor (PMOSFET). PNOs show the improvement of dielectric performance compared to TNO with no change of the device performance. PNOs also show the improvement of NBTI immunity than TNO at low temperature stress, whereas NBTI immunity of PNO with high N concentration can be worse than TNO at high temperature stress. Recovery effect of NBTI degradation of PNO is lower than that of TNO and it is increased as the N concentration is increased in PNO because the dissociated Si dangling bonds and generated positive oxide charges are repassivated and neutralized, respectively. Moreover, complete recovery of ΔVth is dominated by neutralization of positive oxide charges. Therefore, N contents at polycrystalline Si/SiO2 interface as well as N contents at Si/SiO2 interface can affect significantly on NBTI degradation and recovery effect.

  1. Effects of substrate voltage on noise characteristics and hole lifetime in SOI metal-oxide-semiconductor field-effect transistor photon detector.

    PubMed

    Putranto, Dedy Septono Catur; Priambodo, Purnomo Sidi; Hartanto, Djoko; Du, Wei; Satoh, Hiroaki; Ono, Atsushi; Inokawa, Hiroshi

    2014-09-08

    Low-frequency noise and hole lifetime in silicon-on-insulator (SOI) metal-oxide-semiconductor field-effect transistors (MOSFETs) are analyzed, considering their use in photon detection based on single-hole counting. The noise becomes minimum at around the transition point between front- and back-channel operations when the substrate voltage is varied, and increases largely on both negative and positive sides of the substrate voltage showing peculiar Lorentzian (generation-recombination) noise spectra. Hole lifetime is evaluated by the analysis of drain current histogram at different substrate voltages. It is found that the peaks in the histogram corresponding to the larger number of stored holes become higher as the substrate bias becomes larger. This can be attributed to the prolonged lifetime caused by the higher electric field inside the body of SOI MOSFET. It can be concluded that, once the inversion channel is induced for detection of the photo-generated holes, the small absolute substrate bias is favorable for short lifetime and low noise, leading to high-speed operation.

  2. Passivation of oxide traps and interface states in GaAs metal-oxide-semiconductor capacitor by LaTaON passivation layer and fluorine incorporation

    SciTech Connect

    Liu, L. N.; Choi, H. W.; Lai, P. T.; Xu, J. P.

    2015-11-23

    GaAs metal-oxide-semiconductor capacitor with TaYON/LaTaON gate-oxide stack and fluorine-plasma treatment is fabricated and compared with its counterparts without the LaTaON passivation interlayer or the fluorine treatment. Experimental results show that the sample exhibits better characteristics: low interface-state density (8 × 10{sup 11 }cm{sup −2}/eV), small flatband voltage (0.69 V), good capacitance-voltage behavior, small frequency dispersion, and small gate leakage current (6.35 × 10{sup −6} A/cm{sup 2} at V{sub fb} + 1 V). These should be attributed to the suppressed growth of unstable Ga and As oxides on the GaAs surface during gate-oxide annealing by the LaTaON interlayer and fluorine incorporation, and the passivating effects of fluorine atoms on the acceptor-like interface and near-interface traps.

  3. Impact of boron diffusion on oxynitrided gate oxides in 4H-SiC metal-oxide-semiconductor field-effect transistors

    NASA Astrophysics Data System (ADS)

    Cabello, M.; Soler, V.; Montserrat, J.; Rebollo, J.; Rafí, J. M.; Godignon, P.

    2017-07-01

    An alternative gate oxide configuration is proposed to enhance the SiO2/SiC interface quality, enabling high mobility 4H-SiC lateral metal-oxide-semiconductor field-effect transistors (MOSFETs). The gate oxide is prepared by the combination of rapid thermal oxidation in N2O ambient, boron diffusion into SiO2, and plasma enhanced chemical vapor deposition of tetraethyl orthosilicate oxide. Capacitance-voltage (C-V) and conductance-voltage (G-V) measurements on fabricated capacitors reveal a reduction of both interface trap and near interface oxide trap densities. The fabrication of MOSFETs with very high field-effect mobility (μfe) values, up to 160 cm2/V s, is enabled. Several channel orientations, with respect to the wafer flat {11 2 ¯ 0}, have been studied to check μfe values and isotropy. Higher μfe values are obtained for a channel orientation of 90°. Boron distribution is studied by secondary ion mass spectrometry (SIMS) and time of flight SIMS. We propose that the combination of boron and nitrogen induces changes in the structure of the gate oxide which are positive in terms of the SiO2/SiC interface quality.

  4. Impacts of Ti on electrical properties of Ge metal-oxide-semiconductor capacitors with ultrathin high- k LaTiON gate dielectric

    NASA Astrophysics Data System (ADS)

    Xu, H. X.; Xu, J. P.; Li, C. X.; Chan, C. L.; Lai, P. T.

    2010-06-01

    Ge Metal-Oxide-Semiconductor (MOS) capacitors with LaON gate dielectric incorporating different Ti contents are fabricated and their electrical properties are measured and compared. It is found that Ti incorporation can increase the dielectric permittivity, and the higher the Ti content, the larger is the permittivity. However, the interfacial and gate-leakage properties become poorer as the Ti content increases. Therefore, optimization of Ti content is important in order to obtain a good trade-off among the electrical properties of the device. For the studied range of the Ti/La2O3 ratio, a suitable Ti/La2O3 ratio of 14.7% results in a high relative permittivity of 24.6, low interface-state density of 3.1×1011 eV-1 cm-2, and relatively low gate-leakage current density of 2.0×10-3 A cm-2 at a gate voltage of 1 V.

  5. Temperature dependence of frequency dispersion in III–V metal-oxide-semiconductor C-V and the capture/emission process of border traps

    SciTech Connect

    Vais, Abhitosh Martens, Koen; DeMeyer, Kristin; Lin, Han-Chung; Ivanov, Tsvetan; Collaert, Nadine; Thean, Aaron; Dou, Chunmeng; Xie, Qi; Maes, Jan; Tang, Fu; Givens, Michael; Raskin, Jean-Pierre

    2015-08-03

    This paper presents a detailed investigation of the temperature dependence of frequency dispersion observed in capacitance-voltage (C-V) measurements of III-V metal-oxide-semiconductor (MOS) devices. The dispersion in the accumulation region of the capacitance data is found to change from 4%–9% (per decade frequency) to ∼0% when the temperature is reduced from 300 K to 4 K in a wide range of MOS capacitors with different gate dielectrics and III-V substrates. We show that such significant temperature dependence of C-V frequency dispersion cannot be due to the temperature dependence of channel electrostatics, i.e., carrier density and surface potential. We also show that the temperature dependence of frequency dispersion, and hence, the capture/emission process of border traps can be modeled by a combination of tunneling and a “temperature-activated” process described by a non-radiative multi-phonon model, instead of a widely believed single-step elastic tunneling process.

  6. Impact of oxygen plasma postoxidation process on Al2O3/n-In0.53Ga0.47As metal-oxide-semiconductor capacitors

    NASA Astrophysics Data System (ADS)

    Lechaux, Y.; Fadjie-Djomkam, A. B.; Bollaert, S.; Wichmann, N.

    2016-09-01

    Capacitance-voltage (C-V) measurements and x-ray photoelectron spectroscopy (XPS) analysis were performed in order to investigate the effect of a oxygen (O2) plasma after oxide deposition on the Al2O3/n-In0.53Ga0.47As metal-oxide-semiconductor structure passivated with ammonia NH4OH solution. From C-V measurements, an improvement of charge control is observed using the O2 plasma postoxidation process on In0.53Ga0.47As, while the minimum of interface trap density remains at a good value lower than 1 × 1012 cm-2 eV-1. From XPS measurements, we found that NH4OH passivation removes drastically the Ga and As native oxides on the In0.53Ga0.47As surface and the O2 plasma postoxidation process enables the reduction of interface re-oxidation after post deposition annealing (PDA) of the oxide. The advanced hypothesis is the formation of interfacial barrier between Al2O3 and In0.53Ga0.47As which prevents the diffusion of oxygen species into the semiconductor surface during PDA.

  7. Improved interface properties of GaN metal-oxide-semiconductor device with non-polar plane and AlN passivation layer

    NASA Astrophysics Data System (ADS)

    Wu, Xian; Liang, Renrong; Guo, Lei; Liu, Lei; Xiao, Lei; Shen, Shanshan; Xu, Jun; Wang, Jing

    2016-12-01

    Utilizing a non-polar plane substrate and an ultra-thin AlN passivation layer results in significantly improved interface properties of a GaN metal-oxide-semiconductor (MOS) device. After depositing an Al2O3 gate dielectric layer on GaN substrates with polar c-plane and non-polar m-plane surfaces, it is found that the devices on the non-polar surface show much better interface properties than those on the polar surface. To further improve the interface properties, an amorphous ultra-thin AlN layer is deposited on the substrate before the Al2O3 deposition. The interface properties of both devices on the c-plane and m-plane are dramatically improved by the AlN passivation layer. The interface trap density of the Al/Al2O3/AlN/GaN MOS capacitor on the non-polar surface is reduced by two orders of magnitude compared to that on the polar surface.

  8. Control of Subthreshold Characteristics of Narrow-Channel Silicon-on-Insulator n-Type Metal-Oxide-Semiconductor Transistor with Additional Side Gate Electrodes

    NASA Astrophysics Data System (ADS)

    Okuyama, Kiyoshi; Yoshikawa, Koji; Sunami, Hideo

    2007-04-01

    A silicon-on-insulator (SOI) n-type metal-oxide-semiconductor (MOS) transistor with additional side gate electrodes is fabricated and its subthreshold characteristics are discussed. Since its device structure provides independent biasing to gates, flexible device-characteristic control for the respective device is expected. The key fabrication process is the formation of transistor gates. Additional side gate electrodes are formed by reactive ion etching (RIE) with a SiO2-covered top gate as an etching mask. Subthreshold characteristics are improved by negative side-gate biasing. In addition, the side-gate voltage VSG required to decrease off-leakage current by one decade is around 100 mV. Since the sidewall oxide thickness is chosen to be 5 nm, which is the same as the top-oxide thickness, rather sensitive subthreshold-characteristic control compared with that of biasing through a thick buried-oxide layer is achieved in response to performance requirement. In the viewpoint of stand-by-power suppression, these provide a certain controllability to a circuit operation.

  9. An accurate simulation study on capacitance-voltage characteristics of metal-oxide-semiconductor field-effect transistors in novel structures

    NASA Astrophysics Data System (ADS)

    Yu, Eunseon; Cho, Seongjae; Park, Byung-Gook

    2017-09-01

    An essential and important method for physical and electrical characterization of a metal-oxide-semiconductor (MOS) structure is the capacitance-voltage (C-V) measurement. Judging from the C-V characteristics of a MOS structure, we are allowed to predict the DC and AC behaviors of the field-effect transistor and extract a set of primary parameters. The MOS field-effect transistor (MOSFET) technology has evolved to enhance the gate controllability over the channel in order for effectively suppressing the short-channel effects (SCEs) unwantedly taking place as device scaling progresses. For the goal, numerous novel structures have been suggested for the advanced MOSFET devices. However, the C-V characteristics of such novel MOS structures have not been seldom studied in depth. In this work, we report the C-V characteristics of ultra-thin-body (UTB) MOSFETs on the bulk Si and silicon-on-insulator (SOI) substrates by rigorous technology computer-aided design (TCAD) simulation. For higher credibility and accuracy, quantum-mechanical models are activated and empirical material parameters are employed from the existing literature. The MOSFET structure and the material configurations are schemed referring advanced logic technology suggested by the most recent technology roadmap. The C-V characteristics of UTB MOSFETs having a floating body with extremely small volume are closely investigated.

  10. Structural Dependence of Source-and-Drain Series Resistance on Saturation Drain Current for Sub-20 nm Metal-Oxide-Semiconductor Field-Effect Transistors

    NASA Astrophysics Data System (ADS)

    Yoon, JongChul; Hiroki, Akira; Kobayashi, Kazutoshi

    2013-07-01

    The structural dependence of series-resistance effects on the saturation current is investigated in sub-20 nm metal-oxide-semiconductor field-effect transistors (MOSFETs). For planer bulk, silicon-on-insulator (SOI), and multi gate (MG) MOSFETs, the reduction rate of the saturation current is calculated using an analytical current model in high-performance (HP), low-operating-power (LOP), and low-standby-power (LSTP) technologies. In HP technology, the reduction rates are 29.0, 25.3, and 22.1% for bulk, SOI, and MG MOSFETs, respectively. In LOP technology, the reduction rates are 23.8, 21.5, and 20.7% for bulk, SOI, and MG MOSFETs, respectively. In LSTP technology, the reduction rates are about 17% for all devices. In HP technology, the ratio of the series resistance to the channel resistance is the dominant factor for the reduction rate. In LOP technology, the ratio of the over drive voltage to the supply voltage is the dominant factor. In LSTP technology, both the resistance and voltage ratios are the dominant factors.

  11. Pattern dependency in selective epitaxy of B-doped SiGe layers for advanced metal oxide semiconductor field effect transistors

    NASA Astrophysics Data System (ADS)

    Hâllstedt, J.; Kolahdouz, M.; Ghandi, R.; Radamson, H. H.; Wise, R.

    2008-03-01

    This study presents investigations about the physical mechanisms, origin, and methods to control the pattern dependency in selective epitaxial growth of Si1-xGex (x=0.14-0.32) layers. It is shown with a comprehensive experimental study that the local Si coverage of individual chips on patterned wafers is the main parameter for the layer profile in the epitaxial growth. This was explained by the gas depletion of the growth species in the low velocity boundary layer over the wafer. The gas depletion radius around each oxide opening was in the centimeter range which is related to the boundary layer thickness. The results from these experiments were applied to grow Si0.75Ge0.25 layers with B concentration of 4×1020cm-3 selectively for elevated source and drains in fully depleted ultrathin body silicon on insulator p metal oxide semiconductor field effect transistor (p-MOSFET) devices. The epitaxy control was maintained over a wide range of device sizes by optimized process parameters in combination with a wafer pattern design consisting of dummy features causing a uniform gas depletion over the chips on the wafer.

  12. Anomalous Increase in Effective Channel Mobility on Gamma-Irradiated p-Channel SiC Metal-Oxide-Semiconductor Field-Effect Transistors Containing Step Bunching

    NASA Astrophysics Data System (ADS)

    Lee, Kin Kiong; Ohshima, Takeshi; Ohi, Akihiko; Itoh, Hisayoshi; Pensl, Gerhard

    2006-09-01

    The influence of gamma-radiation on the electrical characteristics of 6H-SiC p-channel metal-oxide-semiconductor field effect transistors (MOSFETs) containing step bunching is reported. The formation of step bunching perpendicular to the channel inhibited the current flow, whereas such an effect was not seen in devices with step bunching formed parallel to the channel. The effective channel mobility in the latter devices increases with gamma-radiation. This improvement of the hole mobility is attributed partially to the positively trapped charges screened the holes from approaching too close to the surface and partially to the effect of position of these charges, resulting in a reduction of scattering and capture of holes. No enhancement in the effective channel mobility was observed for devices with no step bunching or with root mean square roughness in the channel region less than 4 nm. Further irradiation leads to a decrease in the effective channel mobility due to both the formation of latent interface traps and electrostatics repulsion of holes.

  13. Improved interface properties of Ge metal-oxide-semiconductor capacitor with TaTiO gate dielectric by using in situ TaON passivation interlayer

    NASA Astrophysics Data System (ADS)

    Ji, F.; Xu, J. P.; Liu, J. G.; Li, C. X.; Lai, P. T.

    2011-05-01

    TaON is in situ formed as a passivating interlayer in Ge metal-oxide-semiconductor (MOS) capacitors with high-k TaTiO gate dielectric fabricated simply by alternate sputtering of Ta and Ti. Also, postdeposition annealing is performed in wet N2 to suppress the growth of unstable GeOx at the Ge surface. As a result, excellent electrical properties of the Ge MOS devices are demonstrated, such as high equivalent dielectric constant (22.1), low interface-state density (7.3×1011 cm-2 eV), small gate leakage current (8.6×10-4 A cm-2 at Vg-Vfb=1 V), and high device reliability. Transmission electron microscopy and x-ray photoelectron spectroscopy support that all these should be attributed to the fact that the nitrogen barrier in the TaON interlayer can effectively block the interdiffusions of Ge and Ta, and the wet-N2 anneal can significantly suppress the growth of unstable low-k GeOx.

  14. Positive bias temperature instability in p-type metal-oxide-semiconductor devices with HfSiON/SiO{sub 2} gate dielectrics

    SciTech Connect

    Samanta, Piyas; Huang, Heng-Sheng; Chen, Shuang-Yuan; Liu, Chuan-Hsi; Cheng, Li-Wei

    2014-02-21

    We present a detailed investigation on positive-bias temperature stress (PBTS) induced degradation of nitrided hafnium silicate (HfSiON)/SiO{sub 2} gate stack in n{sup +}-poly crystalline silicon (polySi) gate p-type metal-oxide-semiconductor (pMOS) devices. The measurement results indicate that gate dielectric degradation is a composite effect of electron trapping in as-fabricated as well as newly generated neutral traps, resulting a significant amount of stress-induced leakage current and generation of surface states at the Si/SiO{sub 2} interface. Although, a significant amount of interface states are created during PBTS, the threshold voltage (V{sub T}) instability of the HfSiON based pMOS devices is primarily caused by electron trapping and detrapping. It is also shown that PBTS creates both acceptor- and donor-like interface traps via different depassivation mechanisms of the Si{sub 3} ≡ SiH bonds at the Si/SiO{sub 2} interface in pMOS devices. However, the number of donor-like interface traps ΔN{sub it}{sup D} is significantly greater than that of acceptor-like interface traps ΔN{sup A}{sub it}, resulting the PBTS induced net interface traps as donor-like.

  15. Light-Induced Carrier Transfer in NiSi-Nanodots/Si-Quantum-Dots Hybrid Floating Gate in Metal-Oxide-Semiconductor Structures

    NASA Astrophysics Data System (ADS)

    Morisawa, Naoya; Ikeda, Mitsuhisa; Nakanishi, Sho; Kawanami, Akira; Makihara, Katsunori; Miyazaki, Seiichi

    2010-04-01

    We have fabricated a metal-oxide-semiconductor (MOS) capacitor with a hybrid floating gate stack consisting of silicon quantum dots (Si-QDs) and NiSi Nanodots (NiSi-NDs) with a 3-nm-thick interlayer SiO2, and studied the effect of 1310 nm light irradiation on charge distribution in a hybrid floating gate. The light irradiation resulted in a reduced flat-band voltage shift due to the charging of the hybrid floating gate under the application of gate biases in comparison to the shift in the dark. This result can be interpreted in terms of the shift of the charge centroid toward the gate side in the hybrid floating gate caused by the photoexcitation of electrons in NiSi-NDs and the subsequent electron tunneling to Si-QDs. When the light irradiation was turned off, the transferred charges moved back from the Si-QDs to the NiSi-NDs without being emitted to the Si substrate.

  16. Optimization of Vertical Double-Diffused Metal-Oxide Semiconductor (VDMOS) Power Transistor Structure for Use in High Frequencies and Medical Devices

    PubMed Central

    Farhadi, Rozita; Farhadi, Bita

    2014-01-01

    Power transistors, such as the vertical, double-diffused, metal-oxide semiconductor (VDMOS), are used extensively in the amplifier circuits of medical devices. The aim of this research was to construct a VDMOS power transistor with an optimized structure to enhance the operation of medical devices. First, boron was implanted in silicon by implanting unclamped inductive switching (UIS) and a Faraday shield. The Faraday shield was implanted in order to replace the gate-field parasitic capacitor on the entry part of the device. Also, implanting the UIS was used in order to decrease the effect of parasitic bipolar junction transistor (BJT) of the VDMOS power transistor. The research tool used in this study was Silvaco software. By decreasing the transistor entry resistance in the optimized VDMOS structure, power losses and noise at the entry of the transistor were decreased, and, by increasing the breakdown voltage, the lifetime of the VDMOS transistor lifetime was increased, which resulted in increasing drain flow and decreasing Ron. This consequently resulted in enhancing the operation of high-frequency medical devices that use transistors, such as Radio Frequency (RF) and electrocardiograph machines. PMID:25763152

  17. Experimental Study of Floating-Gate-Type Metal-Oxide-Semiconductor Capacitors with Nanosize Triangular Cross-Sectional Tunnel Areas for Low Operating Voltage Flash Memory Application

    NASA Astrophysics Data System (ADS)

    Liu, Yongxun; Guo, Ruofeng; Kamei, Takahiro; Matsukawa, Takashi; Endo, Kazuhiko; O'uchi, Shinichi; Tsukada, Junichi; Yamauchi, Hiromi; Ishikawa, Yuki; Hayashida, Tetsuro; Sakamoto, Kunihiro; Ogura, Atsushi; Masahara, Meishoku

    2012-06-01

    The floating-gate (FG)-type metal-oxide-semiconductor (MOS) capacitors with planar (planar-MOS) and three-dimensional (3D) nanosize triangular cross-sectional tunnel areas (3D-MOS) have successfully been fabricated by introducing rapid thermal oxidation (RTO) and postdeposition annealing (PDA), and their electrical characteristics between the control gate (CG) and FG have been systematically compared. It was experimentally found in both planar- and 3D-MOS capacitors that the uniform and higher breakdown voltages are obtained by introducing RTO owing to the high-quality thermal oxide formation on the surface and etched edge regions of the n+ polycrystalline silicon (poly-Si) FG, and the leakage current is highly suppressed after PDA owing to the improved quality of the tetraethylorthosilicate (TEOS) silicon dioxide (SiO2) between CG and FG. Moreover, a lower breakdown voltage between CG and FG was obtained in the fabricated 3D-MOS capacitors as compared with that of planar-MOS capacitors thanks to the enhanced local electric field at the tips of triangular tunnel areas. The developed nanosize triangular cross-sectional tunnel area is useful for the fabrication of low operating voltage flash memories.

  18. Interface States and Trapping Effects in Al2O3- and ZrO2/InAlN/AlN/GaN Metal-Oxide-Semiconductor Heterostructures

    NASA Astrophysics Data System (ADS)

    Ťapajna, Milan; Kuzmík, Jan; Čičo, Karol; Pogany, Dionyz; Pozzovivo, Gianmauro; Strasser, Gottfried; Abermann, Stephan; Bertagnolli, Emmerich; Carlin, Jean-François; Grandjean, Nicolas; Fröhlich, Karol

    2009-09-01

    We investigate Al2O3- and ZrO2/InAlN/GaN metal-oxide-semiconductor heterostructures (MOS-H) using capacitance-time transients in the temperature range of 25-300 °C. A deep-level transient spectroscopy based analysis revealed the maximum interface state density distributions Dit(E) up to 3×1013 and 1×1013 eV-1 cm-2 for the Al2O3/InAlN and ZrO2/InAlN interface, respectively. The integral densities of interface states correlate well with the trapping-related gate-lag effect in corresponding InAlN/GaN MOS high electron mobility transistors (HEMTs). This explains the strongly reduced lag effect in ZrO2 MOS HEMTs. We assume hole trapping at oxide/InAlN interface to be a dominant effect responsible for the gate-lag effect in InAlN/GaN MOS HEMTs.

  19. Interface States and Trapping Effects in Al2O3- and ZrO2/InAlN/AlN/GaN Metal-Oxide-Semiconductor Heterostructures

    NASA Astrophysics Data System (ADS)

    Ťapajna, Milan; Kuzmík, Jan; Čičo, Karol; Pogany, Dionyz; Pozzovivo, Gianmauro; Strasser, Gottfried; Abermann, Stephan; Bertagnolli, Emmerich; Carlin, Jean-François; Grandjean, Nicolas; Fröhlich, Karol

    2009-09-01

    We investigate Al2O3- and ZrO2/InAlN/GaN metal-oxide-semiconductor heterostructures (MOS-H) using capacitance-time transients in the temperature range of 25-300 °C. A deep-level transient spectroscopy based analysis revealed the maximum interface state density distributions Dit(E) up to 3× 1013 and 1× 1013 eV-1 cm-2 for the Al2O3/InAlN and ZrO2/InAlN interface, respectively. The integral densities of interface states correlate well with the trapping-related gate-lag effect in corresponding InAlN/GaN MOS high electron mobility transistors (HEMTs). This explains the strongly reduced lag effect in ZrO2 MOS HEMTs. We assume hole trapping at oxide/InAlN interface to be a dominant effect responsible for the gate-lag effect in InAlN/GaN MOS HEMTs.

  20. AlGaN/GaN metal oxide semiconductor heterostructure field-effect transistors with 4 nm thick Al2O3 gate oxide

    NASA Astrophysics Data System (ADS)

    Gregušová, D.; Stoklas, R.; Čičo, K.; Lalinský, T.; Kordoš, P.

    2007-08-01

    AlGaN/GaN metal-oxide-semiconductor heterostructure field-effect transistors (MOSHFETs) with 4 nm thick Al2O3 gate oxide were prepared and their performance was compared with that of AlGaN/GaN HFETs. The MOSHFETs yielded ~40% increase of the saturation drain current compared with the HFETs, which is larger than expected due to the gate oxide passivation. Despite a larger gate-channel separation in the MOSHFETs, a higher extrinsic transconductance than that of the HFETs was measured. The drift mobility of the MOSHFETs, evaluated on large-gate FET structures, was significantly higher than that of the HFETs. The zero-bias mobility for MOSHFETs and HFETs was 1950 cm2 V-1 s-1 and 1630 cm2 V-1 s-1, respectively. These features indicate an increase of the drift velocity and/or a decrease of the parasitic series resistance in the MOSHFETs. The current collapse, evaluated from pulsed I-V measurements, was highly suppressed in the MOSHFETs with 4 nm thick Al2O3 gate oxide. This result, together with the suppressed frequency dispersion of the capacitance, indicates that the density of traps in the Al2O3/AlGaN/GaN MOSHFETs was significantly reduced.

  1. Studies of Electron Beam Evaporated SiO2/AlGaN/GaN Metal-Oxide-Semiconductor High-Electron-Mobility Transistors

    NASA Astrophysics Data System (ADS)

    Arulkumaran, Subramaniam; Egawa, Takashi; Ishikawa, Hiroyasu

    2005-06-01

    The metal-oxide-semiconductor high-electron-mobility transistors (MOSHEMTs) have been demonstrated and its dc characteristics were examined and compared with the conventional AlGaN/GaN HEMTs. The electron beam (EB) evaporated SiO2 layers were used as a gate-insulator. Capacitance-voltage plot of MOS contacts revealed the existence of injection type complete accumulation up to +4.0 V. The fabricated MOSHEMTs have exhibited better dc characteristics when compared with the conventional AlGaN/GaN HEMTs. The MOSHEMTs could operate at positive gate-biases as high as +4.0 V. The 2.0-μm-gate-length EB-SiO2 MOSHEMTs exhibited higher drain current density and extrinsic transconductance of 856 mA/mm and 145 mS/mm when compared to the conventional AlGaN/GaN HEMTs. The gate leakage current (IgLeak) was three orders of magnitude lower than that of the conventional AlGaN/GaN HEMTs. The stable device operations at high operating voltages with low IgLeak and high gmmax values leads to the occurrence of low trap density at EB-SiO2/AlGaN interface.

  2. Electron valence-band tunneling-induced Lorentzian noise in deep submicron silicon-on-insulator metal-oxide-semiconductor field-effect transistors

    NASA Astrophysics Data System (ADS)

    Lukyanchikova, N. B.; Petrichuk, M. V.; Garbar, N.; Mercha, A.; Simoen, E.; Claeys, C.

    2003-10-01

    In this article, the impact of several electrical and technological parameters on a particular type of Lorentzian noise, occurring in deep submicron silicon-on-insulator (SOI) metal-oxide-semiconductor field-effect transistors with an ultrathin gate dielectric is described and a semi-empirical model is proposed that captures the main features of the experimental behavior. It is shown that the noise takes place in both n- and p-channel partially depleted SOI transistors. The excess Lorentzians are also found in the n-channel fully depleted devices studied, whereby the noise plateau amplitude [SI(0)] increases for a more negative back-gate bias, putting the back interface into stronger accumulation. The dependence of the characteristic time constant τ and SI(0) on transistor length, drain, front- and back-gate bias is reported, where from a first-order model is derived. The latter is based on the idea that the excess Lorentzian noise originates from filtered shot noise induced by majority carriers, that are injected in the floating body of the transistors by electron valence-band tunneling across the ultrathin (2.5 nm) gate oxide.

  3. Oxide-free InAs(111)A interface in metal-oxide-semiconductor structure with very low density of states prepared by anodic oxidation

    SciTech Connect

    Valisheva, N. A. Aksenov, M. S.; Golyashov, V. A.; Levtsova, T. A.; Kovchavtsev, A. P.; Gutakovskii, A. K.; Tereshchenko, O. E.; Khandarkhaeva, S. E.; Kalinkin, A. V.; Prosvirin, I. P.; Bukhtiyarov, V. I.

    2014-10-20

    In this letter, we present structural, compositional, and electrical characteristics of anodic oxide layer-based metal-oxide-semiconductor (MOS) capacitors on n-type InAs(111)A, along with the effect of a thin fluorinated interfacial passivation layer. Electrochemical oxidation in acid electrolyte with addition of fluorine (NH{sub 4}F) led to the formation of oxygen free well-ordered wide gap fluorinated interfacial layer at InAs(111)A with the fixed charge (Q{sub fix}) and density of interface states (D{sub it}) in the range of (4–6) × 10{sup 10 }cm{sup −2} and (2–12) × 10{sup 10 }eV{sup −1 }cm{sup −2}, respectively. We found that MOS capacitors showed excellent capacitance-voltage characteristics with very small frequency dispersion (<1% and <15 mV). Fluorinated interfacial layer consists of crystalline isostructural compound with the InAs substrate, which remains intact with the atomic smoothness and sharpness that explain unpinned behavior of the Fermi level.

  4. The role of the substrate on the dispersion in accumulation in III-V compound semiconductor based metal-oxide-semiconductor gate stacks

    SciTech Connect

    Krylov, Igor; Ritter, Dan; Eizenberg, Moshe

    2015-09-07

    Dispersion in accumulation is a widely observed phenomenon in metal-oxide-semiconductor gate stacks based on III-V compound semiconductors. The physical origin of this phenomenon is attributed to border traps located in the dielectric material adjacent to the semiconductor. Here, we study the role of the semiconductor substrate on the electrical quality of the first layers at atomic layer deposited (ALD) dielectrics. For this purpose, either Al{sub 2}O{sub 3} or HfO{sub 2} dielectrics with variable thicknesses were deposited simultaneously on two technology important semiconductors—InGaAs and InP. Significantly larger dispersion was observed in InP based gate stacks compared to those based on InGaAs. The observed difference is attributed to a higher border trap density in dielectrics deposited on InP compared to those deposited on InGaAs. We therefore conclude that the substrate plays an important role in the determination of the electrical quality of the first dielectric monolayers deposited by ALD. An additional observation is that larger dispersion was obtained in HfO{sub 2} based capacitors compared to Al{sub 2}O{sub 3} based capacitors, deposited on the same semiconductor. This phenomenon is attributed to the lower conduction band offset rather than to a higher border trap density.

  5. GaAs metal-oxide-semiconductor based non-volatile flash memory devices with InAs quantum dots as charge storage nodes

    SciTech Connect

    Islam, Sk Masiul Chowdhury, Sisir; Sarkar, Krishnendu; Nagabhushan, B.; Banerji, P.; Chakraborty, S.

    2015-06-24

    Ultra-thin InP passivated GaAs metal-oxide-semiconductor based non-volatile flash memory devices were fabricated using InAs quantum dots (QDs) as charge storing elements by metal organic chemical vapor deposition technique to study the efficacy of the QDs as charge storage elements. The grown QDs were embedded between two high-k dielectric such as HfO{sub 2} and ZrO{sub 2}, which were used for tunneling and control oxide layers, respectively. The size and density of the QDs were found to be 5 nm and 1.8×10{sup 11} cm{sup −2}, respectively. The device with a structure Metal/ZrO{sub 2}/InAs QDs/HfO{sub 2}/GaAs/Metal shows maximum memory window equivalent to 6.87 V. The device also exhibits low leakage current density of the order of 10{sup −6} A/cm{sup 2} and reasonably good charge retention characteristics. The low value of leakage current in the fabricated memory device is attributed to the Coulomb blockade effect influenced by quantum confinement as well as reduction of interface trap states by ultra-thin InP passivation on GaAs prior to HfO{sub 2} deposition.

  6. Investigation of 'surface donors' in Al2O3/AlGaN/GaN metal-oxide-semiconductor heterostructures: Correlation of electrical, structural, and chemical properties

    NASA Astrophysics Data System (ADS)

    Ťapajna, M.; Stoklas, R.; Gregušová, D.; Gucmann, F.; Hušeková, K.; Haščík, Š.; Fröhlich, K.; Tóth, L.; Pécz, B.; Brunner, F.; Kuzmík, J.

    2017-12-01

    III-N surface polarization compensating charge referred here to as 'surface donors' (SD) was analyzed in Al2O3/AlGaN/GaN metal-oxide-semiconductor (MOS) heterojunctions using scaled oxide films grown by metal-organic chemical vapor deposition at 600 °C. We systematically investigated impact of HCl pre-treatment prior to oxide deposition and post-deposition annealing (PDA) at 700 °C. SD density was reduced down to 1.9 × 1013 cm-2 by skipping HCl pre-treatment step as compared to 3.3 × 1013 cm-2 for structures with HCl pre-treatment followed by PDA. The nature and origin of SD was then analyzed based on the correlation between electrical, micro-structural, and chemical properties of the Al2O3/GaN interfaces with different SD density (NSD). From the comparison between distributions of interface traps of MOS heterojunction with different NSD, it is demonstrated that SD cannot be attributed to interface trapped charge. Instead, variation in the integrity of the GaOx interlayer confirmed by X-ray photoelectron spectroscopy is well correlated with NSD, indicating SD may be formed by border traps at the Al2O3/GaOx interface.

  7. Determination of active doping in highly resistive boron doped silicon nanocrystals embedded in SiO2 by capacitance voltage measurement on inverted metal oxide semiconductor structure

    NASA Astrophysics Data System (ADS)

    Zhang, Tian; Puthen-Veettil, Binesh; Wu, Lingfeng; Jia, Xuguang; Lin, Ziyun; Yang, Terry Chien-Jen; Conibeer, Gavin; Perez-Wurfl, Ivan

    2015-10-01

    We investigate the Capacitance-Voltage (CV) measurement to study the electrically active boron doping in Si nanocrystals (ncSi) embedded in SiO2. The ncSi thin films with high resistivity (200-400 Ω cm) can be measured by using an inverted metal oxide semiconductor (MOS) structure (Al/ncSi (B)/SiO2/Si). This device structure eliminates the complications from the effects of lateral current flow and the high sheet resistance in standard lateral MOS structures. The characteristic MOS CV curves observed are consistent with the effective p-type doping. The CV modeling method is presented and used to evaluate the electrically active doping concentration. We find that the highly boron doped ncSi films have electrically active doping of 1018-1019 cm-3 despite their high resistivity. The saturation of doping at about 1.4 × 1019 cm-3 and the low doping efficiency less than 5% are observed and discussed. The calculated effective mobility is in the order of 10-3 cm2/V s, indicating strong impurity/defect scattering effect that hinders carriers transport.

  8. Determination of active doping in highly resistive boron doped silicon nanocrystals embedded in SiO{sub 2} by capacitance voltage measurement on inverted metal oxide semiconductor structure

    SciTech Connect

    Zhang, Tian Puthen-Veettil, Binesh; Wu, Lingfeng; Jia, Xuguang; Lin, Ziyun; Yang, Terry Chien-Jen; Conibeer, Gavin; Perez-Wurfl, Ivan

    2015-10-21

    We investigate the Capacitance-Voltage (CV) measurement to study the electrically active boron doping in Si nanocrystals (ncSi) embedded in SiO{sub 2}. The ncSi thin films with high resistivity (200–400 Ω cm) can be measured by using an inverted metal oxide semiconductor (MOS) structure (Al/ncSi (B)/SiO{sub 2}/Si). This device structure eliminates the complications from the effects of lateral current flow and the high sheet resistance in standard lateral MOS structures. The characteristic MOS CV curves observed are consistent with the effective p-type doping. The CV modeling method is presented and used to evaluate the electrically active doping concentration. We find that the highly boron doped ncSi films have electrically active doping of 10{sup 18}–10{sup 19 }cm{sup −3} despite their high resistivity. The saturation of doping at about 1.4 × 10{sup 19 }cm{sup −3} and the low doping efficiency less than 5% are observed and discussed. The calculated effective mobility is in the order of 10{sup −3} cm{sup 2}/V s, indicating strong impurity/defect scattering effect that hinders carriers transport.

  9. Achievement of low parasitic resistance in Ge n-channel metal-oxide-semiconductor field-effect transistor using an embedded TiN-source/drain structure

    NASA Astrophysics Data System (ADS)

    Nagatomi, Y.; Tateyama, T.; Tanaka, S.; Yamamoto, K.; Wang, D.; Nakashima, H.

    2017-03-01

    We investigated the source/drain (S/D) parasitic resistance (R P) of a Ge n-channel metal-oxide-semiconductor field-effect transistor (n-MOSFET) with TiN-S/D. The R P was as high as ˜1400 Ω, which is attributed to a very thin amorphous interlayer (a-IL) at a TiN/Ge interface. To solve this problem, n-MOSFETs with an embedded S/D structure were fabricated, of which the S/D was formed by the etching of a Ge layer using 0.03%-H2O2 solution followed by TiN sputter deposition. The electrical performances were investigated for devices with etching depths in the range of 2-22 nm. The devices with etching depths of 2-5 nm did not work. The devices with etching depths of 12-15 nm showed a quite normal transistor operation, and the R P was as low as ˜130 Ω, which is comparable to that of a p-MOSFET with PtGe-S/D. However, R Ps of the devices with etching depths of ˜22 nm was considerably high. The reason for these results is discussed on the basis of an a-IL formation at the sidewall of the engraved S/D region.

  10. Electron Substrate and Gate Current Modeling for Single-Drain Buried-Channel p-Type Metal-Oxide-Semiconductor Field-Effect Transistors Including Tunneling Mechanisms

    NASA Astrophysics Data System (ADS)

    Sheu, Chorng-Jye

    2008-11-01

    A model of nonlocal electron substrate and gate currents is presented for single-drain (SD) buried-channel (BC) p-type metal-oxide-semiconductor field-effect transistors (pMOSFETs). A nonlocal impact ionization coefficient with characteristic length dependence both in the exponential term and the pre-exponential factor is used in the electron substrate current model. The gate current model is developed by originating a modified lucky electron concept that includes quantum-mechanical tunneling effects in parallel. The channel electric field is first calculated by using an analytical pseudo-two-dimensional MOSFET model, and the spatial distribution of electron temperature along the channel is then derived using a simplified energy balance equation. Having calculated the nonlocal impact ionization coefficient and electron temperature, and modified the lucky electron concept, the nonlocal electron substrate and gate currents can be derived. This model is a time-saving computer-aided-design (CAD) model and is physics transparent for SD BC pMOSFETs.

  11. Impact of GaN cap on charges in Al₂O₃/(GaN/)AlGaN/GaN metal-oxide-semiconductor heterostructures analyzed by means of capacitance measurements and simulations

    SciTech Connect

    Ťapajna, M. Jurkovič, M.; Válik, L.; Haščík, Š.; Gregušová, D.; Kuzmík, J.; Brunner, F.; Cho, E.-M.; Hashizume, T.

    2014-09-14

    Oxide/semiconductor interface trap density (D{sub it}) and net charge of Al₂O₃/(GaN)/AlGaN/GaN metal-oxide-semiconductor high-electron mobility transistor (MOS-HEMT) structures with and without GaN cap were comparatively analyzed using comprehensive capacitance measurements and simulations. D{sub it} distribution was determined in full band gap of the barrier using combination of three complementary capacitance techniques. A remarkably higher D{sub it} (∼5–8 × 10¹²eV⁻¹ cm⁻²) was found at trap energies ranging from EC-0.5 to 1 eV for structure with GaN cap compared to that (D{sub it} ∼ 2–3 × 10¹²eV⁻¹ cm⁻²) where the GaN cap was selectively etched away. D{sub it} distributions were then used for simulation of capacitance-voltage characteristics. A good agreement between experimental and simulated capacitance-voltage characteristics affected by interface traps suggests (i) that very high D{sub it} (>10¹³eV⁻¹ cm⁻²) close to the barrier conduction band edge hampers accumulation of free electron in the barrier layer and (ii) the higher D{sub it} centered about EC-0.6 eV can solely account for the increased C-V hysteresis observed for MOS-HEMT structure with GaN cap. Analysis of the threshold voltage dependence on Al₂O₃ thickness for both MOS-HEMT structures suggests that (i) positive charge, which compensates the surface polarization, is not necessarily formed during the growth of III-N heterostructure, and (ii) its density is similar to the total surface polarization charge of the GaN/AlGaN barrier, rather than surface polarization of the top GaN layer only. Some constraints for the positive surface compensating charge are discussed.

  12. A 94GHz Temperature Compensated Low Noise Amplifier in 45nm Silicon-on-Insulator Complementary Metal-Oxide Semiconductor (SOI CMOS)

    DTIC Science & Technology

    2014-01-01

    discovering techniques to build wide temperature range electronics for millimeter wave imaging applications. Realization of this plan has resulted in a...State Circuits. 41.12 (December 2006): 2992-2997. 8. De Vida , G., and G. Iannaccone. “An Ultra-Low Power, Temperature Compensated Voltage

  13. Ultra-low power high temperature and radiation hard complementary metal-oxide-semiconductor (CMOS) silicon-on-insulator (SOI) voltage reference.

    PubMed

    Boufouss, El Hafed; Francis, Laurent A; Kilchytska, Valeriya; Gérard, Pierre; Simon, Pascal; Flandre, Denis

    2013-12-13

    This paper presents an ultra-low power CMOS voltage reference circuit which is robust under biomedical extreme conditions, such as high temperature and high total ionized dose (TID) radiation. To achieve such performances, the voltage reference is designed in a suitable 130 nm Silicon-on-Insulator (SOI) industrial technology and is optimized to work in the subthreshold regime of the transistors. The design simulations have been performed over the temperature range of -40-200 °C and for different process corners. Robustness to radiation was simulated using custom model parameters including TID effects, such as mobilities and threshold voltages degradation. The proposed circuit has been tested up to high total radiation dose, i.e., 1 Mrad (Si) performed at three different temperatures (room temperature, 100 °C and 200 °C). The maximum drift of the reference voltage V(REF) depends on the considered temperature and on radiation dose; however, it remains lower than 10% of the mean value of 1.5 V. The typical power dissipation at 2.5 V supply voltage is about 20 μW at room temperature and only 75 μW at a high temperature of 200 °C. To understand the effects caused by the combination of high total ionizing dose and temperature on such voltage reference, the threshold voltages of the used SOI MOSFETs were extracted under different conditions. The evolution of V(REF) and power consumption with temperature and radiation dose can then be explained in terms of the different balance between fixed oxide charge and interface states build-up. The total occupied area including pad-ring is less than 0.09 mm2.

  14. A novel way to improve the quantum efficiency of silicon light-emitting diode in a standard silicon complementary metal-oxide-semiconductor technology

    NASA Astrophysics Data System (ADS)

    Xu, Kaikai; Li, G. P.

    2013-03-01

    Silicon diode at avalanche breakdown has visible light emission in the depletion region. It is believed that this optical radiation comes from the kinetic energy loss of carriers generated by impact ionization colliding with immobile charge centers in the avalanche region. A theoretical model is presented to show the correlation of the hot carrier effect with the related photonic emission in high field. Meanwhile, a PMOSFET-like silicon light source device fabricated completely in the standard silicon CMOS process technology is measured to demonstrate that avalanching current is linearly proportional to optical emission power whether this light source acts as a two-terminal device (i.e., diode, the "p+ Source/Drain to n-Substrate junction" with floating the gate) or acts as a three-terminal device (i.e., gate-diode, the "p+ Source/Drain to n-Substrate junction" in the course of varying the gate voltage). Such linearity implies that control of the increasing current is a significant way to enhance the quantum efficiency of this light source device no matter what the physical structure (i.e., two terminals or three terminals) of this device is. For the first time, it has been discovered that, at the same avalanching current, the optical output power in gate-diode structure is higher than the optical output power in diode structure. In other words, for this PMOSFET-like device, the three-terminal operating mode is more efficient than the two-terminal operating mode.

  15. Novel High-Performance Analog Devices for Advanced Low-Power High-k Metal Gate Complementary Metal-Oxide-Semiconductor Technology

    NASA Astrophysics Data System (ADS)

    Han, Jin-Ping; Shimizu, Takashi; Pan, Li-Hong; Voelker, Moritz; Bernicot, Christophe; Arnaud, Franck; Mocuta, Anda; Stahrenberg, Knut; Azuma, Atsushi; Eller, Manfred; Yang, Guoyong; Jaeger, Daniel; Zhuang, Haoren; Miyashita, Katsura; Stein, Kenneth; Nair, Deleep; Hoo Park, Jae; Kohler, Sabrina; Hamaguchi, Masafumi; Li, Weipeng; Kim, Kisang; Chanemougame, Daniel; Kim, Nam Sung; Uchimura, Sadaharu; Tsutsui, Gen; Wiedholz, Christian; Miyake, Shinich; van Meer, Hans; Liang, Jewel; Ostermayr, Martin; Lian, Jenny; Celik, Muhsin; Donaton, Ricardo; Barla, Kathy; Na, MyungHee; Goto, Yoshiro; Sherony, Melanie; Johnson, Frank S.; Wachnik, Richard; Sudijono, John; Kaste, Ed; Sampson, Ron; Ku, Ja-Hum; Steegen, An; Neumueller, Walter

    2011-04-01

    High performance analog (HPA) devices in high-k metal gate (HKMG) scheme with innovative halo engineering have been successfully demonstrated to produce superior analog and digital performance for low power applications. HPA device was processed “freely” with no extra mask, no extra litho, and no extra process step. This paper details a comprehensive study of the analog and digital characteristics of these HPA devices in comparison with analog control (conventional digital devices with matched geometry). Analog properties such as output voltage gain (also called self-gain), trans-conductance Gm, conductance Gds, Gm/Id, mismatching (MM) behavior, flicker noise (1/f noise) and current linearity have clearly reflected the advantage of HPA devices over analog control, while DC performance (e.g., Ion-Ioff, Ioff-Vtsat, DIBL, Cjswg) and reliability (HCI) have also shown the comparability of HPA devices over control.

  16. WE-G-204-04: Focal Spot Deblurring For High Resolution Amorphous Selenium (aSe) Complementary Metal Oxide Semiconductor (CMOS) X-Ray Detector

    SciTech Connect

    Nagesh, S Setlur; Rana, R; Russ, M; Ionita, C; Bednarek, D; Rudin, S

    2015-06-15

    Purpose: CMOS-based aSe detectors compared to CsI-TFT-based flat panels have the advantages of higher spatial sampling due to smaller pixel size and decreased blurring characteristic of direct rather than indirect detection. For systems with such detectors, the limiting factor degrading image resolution then becomes the focal-spot geometric unsharpness. This effect can seriously limit the use of such detectors in areas such as cone beam computed tomography, clinical fluoroscopy and angiography. In this work a technique to remove the effect of focal-spot blur is presented for a simulated aSe detector. Method: To simulate images from an aSe detector affected with focal-spot blur, first a set of high-resolution images of a stent (FRED from Microvention, Inc.) were acquired using a 75µm pixel size Dexela-Perkin-Elmer detector and averaged to reduce quantum noise. Then the averaged image was blurred with a known Gaussian blur at two different magnifications to simulate an idealized focal spot. The blurred images were then deconvolved with a set of different Gaussian blurs to remove the effect of focal-spot blurring using a threshold-based, inverse-filtering method. Results: The blur was removed by deconvolving the images using a set of Gaussian functions for both magnifications. Selecting the correct function resulted in an image close to the original; however, selection of too wide a function would cause severe artifacts. Conclusion: Experimentally, focal-spot blur at different magnifications can be measured using a pin hole with a high resolution detector. This spread function can be used to deblur the input images that are acquired at corresponding magnifications to correct for the focal spot blur. For CBCT applications, the magnification of specific objects can be obtained using initial reconstructions then corrected for focal-spot blurring to improve resolution. Similarly, if object magnification can be determined such correction may be applied in fluoroscopy and angiography.

  17. A hybrid magnetic/complementary metal oxide semiconductor process design kit for the design of low-power non-volatile logic circuits

    NASA Astrophysics Data System (ADS)

    Di Pendina, G.; Prenat, G.; Dieny, B.; Torki, K.

    2012-04-01

    Since the advent of the MOS transistor, the performance of microelectronic circuits has followed Moore's law, stating that their speed and density would double every 18 months. Today, this trend tends to get out of breath: the continuously decreasing size of devices and increasing operation frequency result in power consumption and heating issues. Among the solutions investigated to circumvent these limitations, the use of non-volatile devices appears particularly promising. It allows easing, for example, the power gating technique, which consists in cutting-off the power supply of inactive blocks without losing information, drastically reducing the standby power consumption. In this approach, the advantages of magnetic tunnel junctions (MTJs) compared with other non-volatile devices allow one to design hybrid CMOS/magnetic circuits with high performance and new functionalities. Designing such circuits requires integrating MTJs in standard microelectronics design suites. This is performed by means of a process design kit (PDK) for the hybrid CMOS/magnetic technology. We present here a full magnetic PDK, which contains a compact model of the MTJ for electrical simulation, technology files for layout and physical verifications, and standard cells for the design of complex logic circuits and which is compatible with standard design suites. This PDK allows designers to accurately and comfortably design high-performance hybrid CMOS/magnetic logic circuits in the same way as standard CMOS circuits.

  18. Ultra-Low Power High Temperature and Radiation Hard Complementary Metal-Oxide-Semiconductor (CMOS) Silicon-on-Insulator (SOI) Voltage Reference

    PubMed Central

    Boufouss, El Hafed; Francis, Laurent A.; Kilchytska, Valeriya; Gérard, Pierre; Simon, Pascal; Flandre, Denis

    2013-01-01

    This paper presents an ultra-low power CMOS voltage reference circuit which is robust under biomedical extreme conditions, such as high temperature and high total ionized dose (TID) radiation. To achieve such performances, the voltage reference is designed in a suitable 130 nm Silicon-on-Insulator (SOI) industrial technology and is optimized to work in the subthreshold regime of the transistors. The design simulations have been performed over the temperature range of −40–200 °C and for different process corners. Robustness to radiation was simulated using custom model parameters including TID effects, such as mobilities and threshold voltages degradation. The proposed circuit has been tested up to high total radiation dose, i.e., 1 Mrad (Si) performed at three different temperatures (room temperature, 100 °C and 200 °C). The maximum drift of the reference voltage VREF depends on the considered temperature and on radiation dose; however, it remains lower than 10% of the mean value of 1.5 V. The typical power dissipation at 2.5 V supply voltage is about 20 μW at room temperature and only 75 μW at a high temperature of 200 °C. To understand the effects caused by the combination of high total ionizing dose and temperature on such voltage reference, the threshold voltages of the used SOI MOSFETs were extracted under different conditions. The evolution of VREF and power consumption with temperature and radiation dose can then be explained in terms of the different balance between fixed oxide charge and interface states build-up. The total occupied area including pad-ring is less than 0.09 mm2. PMID:24351635

  19. A third-order complementary metal-oxide-semiconductor sigma-delta modulator operating between 4.2 K and 300 K.

    PubMed

    Okcan, Burak; Gielen, Georges; Van Hoof, Chris

    2012-02-01

    This paper presents a third-order switched-capacitor sigma-delta modulator implemented in a standard 0.35-μm CMOS process. It operates from 300 K down to 4.2 K, achieving 70.8 dB signal-to-noise-plus-distortion ratio (SNDR) in a signal bandwidth of 5 kHz with a sampling frequency of 500 kHz at 300 K. The modulator utilizes an operational transconductance amplifier in its loop filter, whose architecture has been optimized in order to eliminate the cryogenic anomalies below the freeze-out temperature. At 4.2 K, the modulator achieves 67.7 dB SNDR consuming 21.17 μA current from a 3.3 V supply.

  20. A third-order complementary metal-oxide-semiconductor sigma-delta modulator operating between 4.2 K and 300 K

    NASA Astrophysics Data System (ADS)

    Okcan, Burak; Gielen, Georges; Van Hoof, Chris

    2012-02-01

    This paper presents a third-order switched-capacitor sigma-delta modulator implemented in a standard 0.35-μm CMOS process. It operates from 300 K down to 4.2 K, achieving 70.8 dB signal-to-noise-plus-distortion ratio (SNDR) in a signal bandwidth of 5 kHz with a sampling frequency of 500 kHz at 300 K. The modulator utilizes an operational transconductance amplifier in its loop filter, whose architecture has been optimized in order to eliminate the cryogenic anomalies below the freeze-out temperature. At 4.2 K, the modulator achieves 67.7 dB SNDR consuming 21.17 μA current from a 3.3 V supply.

  1. Effect of proton irradiation dose on InAlN/GaN metal-oxide semiconductor high electron mobility transistors with Al2O3 gate oxide

    DOE PAGES

    Ahn, Shihyun; Kim, Byung -Jae; Lin, Yi -Hsuan; ...

    2016-07-26

    The effects of proton irradiation on the dc performance of InAlN/GaN metal-oxide-semiconductor high electron mobility transistors (MOSHEMTs) with Al2O3 as the gate oxide were investigated. The InAlN/GaN MOSHEMTs were irradiated with doses ranging from 1×1013 to 1×1015cm–2 at a fixed energy of 5MeV. There was minimal damage induced in the two dimensional electron gas at the lowest irradiation dose with no measurable increase in sheet resistance, whereas a 9.7% increase of the sheet resistance was observed at the highest irradiation dose. By sharp contrast, all irradiation doses created more severe degradation in the Ohmic metal contacts, with increases of specificmore » contact resistance from 54% to 114% over the range of doses investigated. These resulted in source-drain current–voltage decreases ranging from 96 to 242 mA/mm over this dose range. The trap density determined from temperature dependent drain current subthreshold swing measurements increased from 1.6 × 1013 cm–2 V–1 for the reference MOSHEMTs to 6.7 × 1013 cm–2 V–1 for devices irradiated with the highest dose. In conclusion, the carrier removal rate was 1287 ± 64 cm–1, higher than the authors previously observed in AlGaN/GaN MOSHEMTs for the same proton energy and consistent with the lower average bond energy of the InAlN.« less

  2. Comparison of modification strategies towards enhanced charge carrier separation and photocatalytic degradation activity of metal oxide semiconductors (TiO2, WO3 and ZnO)

    NASA Astrophysics Data System (ADS)

    Kumar, S. Girish; Rao, K. S. R. Koteswara

    2017-01-01

    Metal oxide semiconductors (TiO2, WO3 and ZnO) finds unparalleled opportunity in wastewater purification under UV/visible light, largely encouraged by their divergent admirable features like stability, non-toxicity, ease of preparation, suitable band edge positions and facile generation of active oxygen species in the aqueous medium. However, the perennial failings of these photocatalysts emanates from the stumbling blocks like rapid charge carrier recombination and meager visible light response. In this review, tailoring the surface-bulk electronic structure through the calibrated and veritable approaches such as impurity doping, deposition with noble metals, sensitizing with other compounds (dyes, polymers, inorganic complexes and simple chelating ligands), hydrogenation process (annealing under hydrogen atmosphere), electronic integration with other semiconductors, modifying with carbon nanostructures, designing with exposed facets and tailoring with hierarchical morphologies to overcome their critical drawbacks are summarized. Taking into account the materials intrinsic properties, the pros and cons together with similarities and striking differences for each strategy in specific to TiO2, WO3 & ZnO are highlighted. These subtlety enunciates the primacy for improving the structure-electronic properties of metal oxides and credence to its fore in the practical applications. Future research must focus on comparing the performances of ZnO, TiO2 and WO3 in parallel to get insight into their photocatalytic behaviors. Such comparisons not only reveal the changed surface-electronic structure upon various modifications, but also shed light on charge carrier dynamics, free radical generation, structural stability and compatibility for photocatalytic reactions. It is envisioned that these cardinal tactics have profound implications and can be replicated to other semiconductor photocatalysts like CeO2, In2O3, Bi2O3, Fe2O3, BiVO4, AgX, BiOX (X = Cl, Br & I), Bi2WO6, Bi2MoO6

  3. Sample size requirements for estimating effective dose from computed tomography using solid-state metal-oxide-semiconductor field-effect transistor dosimetry

    SciTech Connect

    Trattner, Sigal; Cheng, Bin; Pieniazek, Radoslaw L.; Hoffmann, Udo; Douglas, Pamela S.; Einstein, Andrew J.

    2014-04-15

    Purpose: Effective dose (ED) is a widely used metric for comparing ionizing radiation burden between different imaging modalities, scanners, and scan protocols. In computed tomography (CT), ED can be estimated by performing scans on an anthropomorphic phantom in which metal-oxide-semiconductor field-effect transistor (MOSFET) solid-state dosimeters have been placed to enable organ dose measurements. Here a statistical framework is established to determine the sample size (number of scans) needed for estimating ED to a desired precision and confidence, for a particular scanner and scan protocol, subject to practical limitations. Methods: The statistical scheme involves solving equations which minimize the sample size required for estimating ED to desired precision and confidence. It is subject to a constrained variation of the estimated ED and solved using the Lagrange multiplier method. The scheme incorporates measurement variation introduced both by MOSFET calibration, and by variation in MOSFET readings between repeated CT scans. Sample size requirements are illustrated on cardiac, chest, and abdomen–pelvis CT scans performed on a 320-row scanner and chest CT performed on a 16-row scanner. Results: Sample sizes for estimating ED vary considerably between scanners and protocols. Sample size increases as the required precision or confidence is higher and also as the anticipated ED is lower. For example, for a helical chest protocol, for 95% confidence and 5% precision for the ED, 30 measurements are required on the 320-row scanner and 11 on the 16-row scanner when the anticipated ED is 4 mSv; these sample sizes are 5 and 2, respectively, when the anticipated ED is 10 mSv. Conclusions: Applying the suggested scheme, it was found that even at modest sample sizes, it is feasible to estimate ED with high precision and a high degree of confidence. As CT technology develops enabling ED to be lowered, more MOSFET measurements are needed to estimate ED with the same

  4. A methodology to identify and quantify mobility-reducing defects in 4H-silicon carbide power metal-oxide-semiconductor field-effect transistors

    SciTech Connect

    Ettisserry, D. P. Goldsman, N.; Lelis, A.

    2014-03-14

    In this paper, we present a methodology for the identification and quantification of defects responsible for low channel mobility in 4H-Silicon Carbide (SiC) power metal-oxide-semiconductor field-effect transistors (MOSFETs). To achieve this, we use an algorithm based on 2D-device simulations of a power MOSFET, density functional simulations, and measurement data. Using physical modeling of carrier mobility and interface traps, we reproduce the experimental I-V characteristics of a 4H-SiC doubly implanted MOSFET through drift-diffusion simulation. We extract the position of Fermi level and the occupied trap density as a function of applied bias and temperature. Using these inputs, our algorithm estimates the number of possible trap types, their energy levels, and concentrations at 4H-SiC/SiO{sub 2} interface. Subsequently, we use density functional theory (DFT)-based ab initio simulations to identify the atomic make-up of defects causing these trap levels. We study silicon vacancy and carbon di-interstitial defects in the SiC side of the interface. Our algorithm indicates that the D{sub it} spectrum near the conduction band edge (3.25 eV) is composed of three trap types located at 2.8–2.85 eV, 3.05 eV, and 3.1–3.2 eV, and also calculates their densities. Based on DFT simulations, this work attributes the trap levels very close to the conduction band edge to the C di-interstitial defect.

  5. Ultra-low specific on-resistance high-voltage vertical double diffusion metal-oxide-semiconductor field-effect transistor with continuous electron accumulation layer

    NASA Astrophysics Data System (ADS)

    Da, Ma; Xiao-Rong, Luo; Jie, Wei; Qiao, Tan; Kun, Zhou; Jun-Feng, Wu

    2016-04-01

    A new ultra-low specific on-resistance (R on,sp) vertical double diffusion metal-oxide-semiconductor field-effect transistor (VDMOS) with continuous electron accumulation (CEA) layer, denoted as CEA-VDMOS, is proposed and its new current transport mechanism is investigated. It features a trench gate directly extended to the drain, which includes two PN junctions. In on-state, the electron accumulation layers are formed along the sides of the extended gate and introduce two continuous low-resistance current paths from the source to the drain in a cell pitch. This mechanism not only dramatically reduces the R on,sp but also makes the R on,sp almost independent of the n-pillar doping concentration (N n). In off-state, the depletion between the n-pillar and p-pillar within the extended trench gate increases the N n, and further reduces the R on,sp. Especially, the two PN junctions within the trench gate support a high gate-drain voltage in the off-state and on-state, respectively. However, the extended gate increases the gate capacitance and thus weakens the dynamic performance to some extent. Therefore, the CEA-VDMOS is more suitable for low and medium frequencies application. Simulation indicates that the CEA-VDMOS reduces the R on,sp by 80% compared with the conventional super-junction VDMOS (CSJ-VDMOS) at the same high breakdown voltage (BV). Project supported by the National Natural Science Foundation of China (Grant Nos. 61176069 and 61376079) and the Fundamental Research Funds for the Central Universities, China (Grant No. ZYGX2014Z006).

  6. Fabrication and characterization of the normally-off N-channel lateral 4H-SiC metal-oxide-semiconductor field-effect transistors

    NASA Astrophysics Data System (ADS)

    Qing-Wen, Song; Xiao-Yan, Tang; Yan-Jing, He; Guan-Nan, Tang; Yue-Hu, Wang; Yi-Meng, Zhang; Hui, Guo; Ren-Xu, Jia; Hong-Liang, Lv; Yi-Men, Zhang; Yu-Ming, Zhang

    2016-03-01

    In this paper, the normally-off N-channel lateral 4H-SiC metal-oxide-semiconductor field-effect transistors (MOSFFETs) have been fabricated and characterized. A sandwich- (nitridation-oxidation-nitridation) type process was used to grow the gate dielectric film to obtain high channel mobility. The interface properties of 4H-SiC/SiO2 were examined by the measurement of HF I-V, G-V, and C-V over a range of frequencies. The ideal C-V curve with little hysteresis and the frequency dispersion were observed. As a result, the interface state density near the conduction band edge of 4H-SiC was reduced to 2 × 1011 eV-1·cm-2, the breakdown field of the grown oxides was about 9.8 MV/cm, the median peak field-effect mobility is about 32.5 cm2·V-1·s-1, and the maximum peak field-effect mobility of 38 cm2·V-1·s-1 was achieved in fabricated lateral 4H-SiC MOSFFETs. Projcet supported by the National Natural Science Foundation of China (Grant Nos. 61404098, 61176070, and 61274079), the Doctoral Fund of Ministry of Education of China (Grant Nos. 20110203110010 and 20130203120017), the National Key Basic Research Program of China (Grant No. 2015CB759600), and the Key Specific Projects of Ministry of Education of China (Grant No. 625010101).

  7. Effective passivation and high-performance metal-oxide-semiconductor devices using ultra-high-vacuum deposited high- κ dielectrics on Ge without interfacial layers

    NASA Astrophysics Data System (ADS)

    Chu, L. K.; Chu, R. L.; Lin, T. D.; Lee, W. C.; Lin, C. A.; Huang, M. L.; Lee, Y. J.; Kwo, J.; Hong, M.

    2010-09-01

    Without using any interfacial passivation layers, high- κ dielectric Y 2O 3, HfO 2, and Ga 2O 3(Gd 2O 3) [GGO], by electron beam evaporation in ultra-high-vacuum (UHV), have been directly deposited on Ge substrate. Comprehensive investigations have been carried out to study the oxide/Ge interfaces chemically, structurally, and electronically: hetero-structures of all the studied oxides on Ge are highly thermally stable with annealing to 500 °C, and their interfaces remain atomically sharp. The electrical analyses have been conducted on metal-oxide-semiconductor (MOS) devices, i.e. MOS capacitors (MOSCAPs) and MOS field-effect-transistors (MOSFETs). Dielectrics constants of the Y 2O 3, HfO 2, and GGO have been extracted to be ˜17, 20, and 13-15, respectively, indicating no interfacial layer formation with 500 °C annealing. A low interfacial density of states ( Dits), as low as 3 × 10 11 cm -2 eV -1, has been achieved for GGO/Ge near mid-gap along with a high Fermi-level movement efficiency as high as 80%. The GGO/Ge pMOSFETs with TiN as the metal gate have yielded very high-performances, in terms of 496 μA/μm, 178 μS/μm, and 389 cm 2/V s in saturation drain current density, maximum transconductance, and effective hole mobility, respectively. The gate width and gate length of the MOSFET are 10 μm and 1 μm.

  8. Effect of NO annealing on charge traps in oxide insulator and transition layer for 4H-SiC metal-oxide-semiconductor devices

    NASA Astrophysics Data System (ADS)

    Jia, Yifan; Lv, Hongliang; Niu, Yingxi; Li, Ling; Song, Qingwen; Tang, Xiaoyan; Li, Chengzhan; Zhao, Yanli; Xiao, Li; Wang, Liangyong; Tang, Guangming; Zhang, Yimen; Zhang, Yuming

    2016-09-01

    The effect of nitric oxide (NO) annealing on charge traps in the oxide insulator and transition layer in n-type 4H-SiC metal-oxide-semiconductor (MOS) devices has been investigated using the time-dependent bias stress (TDBS), capacitance-voltage (C-V), and secondary ion mass spectroscopy (SIMS). It is revealed that two main categories of charge traps, near interface oxide traps (Nniot) and oxide traps (Not), have different responses to the TDBS and C-V characteristics in NO-annealed and Ar-annealed samples. The Nniot are mainly responsible for the hysteresis occurring in the bidirectional C-V characteristics, which are very close to the semiconductor interface and can readily exchange charges with the inner semiconductor. However, Not is mainly responsible for the TDBS induced C-V shifts. Electrons tunneling into the Not are hardly released quickly when suffering TDBS, resulting in the problem of the threshold voltage stability. Compared with the Ar-annealed sample, Nniot can be significantly suppressed by the NO annealing, but there is little improvement of Not. SIMS results demonstrate that the Nniot are distributed within the transition layer, which correlated with the existence of the excess silicon. During the NO annealing process, the excess Si atoms incorporate into nitrogen in the transition layer, allowing better relaxation of the interface strain and effectively reducing the width of the transition layer and the density of Nniot. Project supported by the National Natural Science Foundation of China (Grant Nos. 61404098 and 61274079), the Doctoral Fund of Ministry of Education of China (Grant No. 20130203120017), the National Key Basic Research Program of China (Grant No. 2015CB759600), the National Grid Science & Technology Project, China (Grant No. SGRI-WD-71-14-018), and the Key Specific Project in the National Science & Technology Program, China (Grant Nos. 2013ZX02305002-002 and 2015CB759600).

  9. Robust ultrasensitive tunneling-FET biosensor for point-of-care diagnostics.

    PubMed

    Gao, Anran; Lu, Na; Wang, Yuelin; Li, Tie

    2016-03-02

    For point-of-care (POC) applications, robust, ultrasensitive, small, rapid, low-power, and low-cost sensors are highly desirable. Here, we present a novel biosensor based on a complementary metal oxide semiconductor (CMOS)-compatible silicon nanowire tunneling field-effect transistor (SiNW-TFET). They were fabricated "top-down" with a low-cost anisotropic self-stop etching technique. Notably, the SiNW-TFET device provided strong anti-interference capacity by applying the inherent ambipolarity via both pH and CYFRA21-1 sensing. This offered a more robust and portable general protocol. The specific label-free detection of CYFRA21-1 down to 0.5 fgml(-1) or ~12.5 aM was achieved using a highly responsive SiNW-TFET device with a minimum sub-threshold slope (SS) of 37 mVdec(-1). Furthermore, real-time measurements highlighted the ability to use clinically relevant samples such as serum. The developed high performance diagnostic system is expected to provide a generic platform for numerous POC applications.

  10. Highly strained channel with low-resistivity carbon-doped source/drain formed by cascade C7Hx implantation followed by rapid solid-phase epitaxy and laser annealing for n-channel metal-oxide-semiconductor field-effect transistor

    NASA Astrophysics Data System (ADS)

    Yamaguchi, Tadashi; Kawasaki, Yoji; Yamashita, Tomohiro; Nishida, Yukio; Mizuo, Mariko; Maekawa, Kazuyoshi; Fujisawa, Masahiko

    2015-03-01

    We show the systematical investigation results of the effects of the implanted ion dose of P or As under various solid-phase epitaxy (SPE) conditions on the local stress in channel regions in metal-oxide-semiconductor field-effect transistor (MOSFET) structures, and on sheet resistance and strain in carbon-doped source/drain (Si:C-S/D) layers. P or As substitution is in conflict with C substitution in Si:C layers during SPE. Furthermore, the amount of P incorporated instead of C into the Si lattice site is larger than that of As incorporated instead of C. Therefore, low-resistivity Si:C layers with low stress in the case of using P and high-resistivity Si:C layers with high stress in the case of using As are formed by single-step C7Hx implantation with rapid thermal annealing and nonmelt laser annealing, respectively. As a countermeasure, we demonstrate that cascade C7Hx implantation to control the C profiles in Si:C layers is effective for achieving high-strain channels and low-resistivity Si:C-S/D layers. Control of C profiles is a key technology for state-of-the-art complementary MOS devices with Si:C-S/D.

  11. Ultraviolet-assisted oxidation and nitridation of hafnium and hafnium aluminum alloys as potential gate dielectrics for metal oxide semiconductor applications

    NASA Astrophysics Data System (ADS)

    Essary, Chad Robert

    The continued miniaturization of silicon-based complimentary metal oxide semiconductor (CMOS) devices is pushing the limits of the silicon dioxide (SiO2) gate dielectric. As the channel widths are decreased to increase packing densities and functionality of new chips, proportional vertical scaling of the dielectric must be maintained to keep constant capacitances. Silicon dioxide is approaching its fundamental limit in which it can be used as the gate dielectric due to high leakage currents resulting from direct tunneling through the layer. In order for the continued use of current CMOS gate design, an alternative material with a higher dielectric constant must be found. Several materials have been proposed but are still not providing the electrical characteristics favorable for use in the devices due to problems with excessive leakage and hysteresis resulting from the quality of the film and oxygen defects. The goal of this study is to create higher quality films at lower processing temperatures with low leakage and less hysteresis than has been achieved with hafnium oxide films. This study first examines the formation of the interfacial layer in pulsed laser deposited hafnium oxide films to understand the kinetics behind its formation. The second section focuses on the oxidation of pulsed laser deposited (PLD) hafnium metal thin films using ultraviolet (UV) assisted post-deposition annealing. Another set of samples was deposited in an ammonia atmosphere in order to incorporate nitrogen into the films. Comparisons of microstructure and stoichiometry of oxidized hafnium and oxy-nitride films were made using x-ray photospectroscopy, variable angle spectroscopic ellipsometry, glancing angle x-ray spectroscopy, x-ray reflectivity, and atomic force microscopy. Analysis of the interface between the films and the silicon substrate was carried out using x-ray reflectivity. The electrical characteristics of the films were characterized using capacitance-voltage and current

  12. Effect of H and OH desorption and diffusion on electronic structure in amorphous In-Ga-Zn-O metal-oxide-semiconductor diodes with various gate insulators

    NASA Astrophysics Data System (ADS)

    Hino, Aya; Morita, Shinya; Yasuno, Satoshi; Kishi, Tomoya; Hayashi, Kazushi; Kugimiya, Toshihiro

    2012-12-01

    Metal-oxide-semiconductor (MOS) diodes with various gate insulators (G/Is) were characterized by capacitance-voltage characteristics and isothermal capacitance transient spectroscopy (ICTS) to evaluate the effect of H and OH desorption and diffusion on the electronic structures in amorphous In-Ga-Zn-O (a-IGZO) thin films. The density and the distribution of the space charge were found to be varied depending on the nature of the G/I. In the case of thermally grown SiO2 (thermal SiO2) G/Is, a high space-charge region was observed near the a-IGZO and G/I interface. After thermal annealing, the space-charge density in the deeper region of the film decreased, whereas remained unchanged near the interface region. The ICTS spectra obtained from the MOS diodes with the thermal SiO2 G/Is consisted of two broad peaks at around 5 × 10-4 and 3 × 10-2 s before annealing, while one broad peak was observed at around 1 × 10-4 s at the interface and at around 1 × 10-3 s in the bulk after annealing. Further, the trap density was considerably high near the interface. In contrast, the space-charge density was high throughout the bulk region of the MOS diode when the G/I was deposited by chemical vapor deposition (CVD). The ICTS spectra from the MOS diodes with the CVD G/Is revealed the existence of continuously distributed trap states, suggesting formations of high-density tail states below the conduction band minimum. According to secondary ion mass spectroscopy analyses, desorption and outdiffusion of H and OH were clearly observed in the CVD G/I sample. These phenomena could introduce structural fluctuations in the a-IGZO films, resulting in the formation of the conduction band tail states. Thin-film transistors (TFTs) with the same gate structure as the MOS diodes were fabricated to correlate the electronic properties with the TFT performance, and it was found that TFTs with the CVD G/I showed a reduced saturation mobility. These results indicate that the electronic structures

  13. Effective dose assessment in the maxillofacial region using thermoluminescent (TLD) and metal oxide semiconductor field-effect transistor (MOSFET) dosemeters: a comparative study

    PubMed Central

    Schulze, D; Wolff, J; Rottke, D

    2014-01-01

    Objectives: The objective of this study was to compare the performance of metal oxide semiconductor field-effect transistor (MOSFET) technology dosemeters with thermoluminescent dosemeters (TLDs) (TLD 100; Thermo Fisher Scientific, Waltham, MA) in the maxillofacial area. Methods: Organ and effective dose measurements were performed using 40 TLD and 20 MOSFET dosemeters that were alternately placed in 20 different locations in 1 anthropomorphic RANDO® head phantom (the Phantom Laboratory, Salem, NY). The phantom was exposed to four different CBCT default maxillofacial protocols using small (4 × 5 cm) to full face (20 × 17 cm) fields of view (FOVs). Results: The TLD effective doses ranged between 7.0 and 158.0 µSv and the MOSFET doses between 6.1 and 175.0 µSv. The MOSFET and TLD effective doses acquired using four different (FOV) protocols were as follows: face maxillofacial (FOV 20 × 17 cm) (MOSFET, 83.4 µSv; TLD, 87.6 µSv; −5%); teeth, upper jaw (FOV, 8.5 × 5.0 cm) (MOSFET, 6.1 µSv; TLD, 7.0 µSv; −14%); tooth, mandible and left molar (FOV, 4 × 5 cm) (MOSFET, 10.3 µSv; TLD, 12.3 µSv; −16%) and teeth, both jaws (FOV, 10 × 10 cm) (MOSFET, 175 µSv; TLD, 158 µSv; +11%). The largest variation in organ and effective dose was recorded in the small FOV protocols. Conclusions: Taking into account the uncertainties of both measurement methods and the results of the statistical analysis, the effective doses acquired using MOSFET dosemeters were found to be in good agreement with those obtained using TLD dosemeters. The MOSFET dosemeters constitute a feasible alternative for TLDs for the effective dose assessment of CBCT devices in the maxillofacial region. PMID:25143020

  14. Interfacial band configuration and electrical properties of LaAlO3/Al2O3/hydrogenated-diamond metal-oxide-semiconductor field effect transistors

    NASA Astrophysics Data System (ADS)

    Liu, J. W.; Liao, M. Y.; Imura, M.; Oosato, H.; Watanabe, E.; Tanaka, A.; Iwai, H.; Koide, Y.

    2013-08-01

    In order to search a gate dielectric with high permittivity on hydrogenated-diamond (H-diamond), LaAlO3 films with thin Al2O3 buffer layers are fabricated on the H-diamond epilayers by sputtering-deposition (SD) and atomic layer deposition (ALD) techniques, respectively. Interfacial band configuration and electrical properties of the SD-LaAlO3/ALD-Al2O3/H-diamond metal-oxide-semiconductor field effect transistors (MOSFETs) with gate lengths of 10, 20, and 30 μm have been investigated. The valence and conduction band offsets of the SD-LaAlO3/ALD-Al2O3 structure are measured by X-ray photoelectron spectroscopy to be 1.1 ± 0.2 and 1.6 ± 0.2 eV, respectively. The valence band discontinuity between H-diamond and LaAlO3 is evaluated to be 4.0 ± 0.2 eV, showing that the MOS structure acts as the gate which controls a hole carrier density. The leakage current density of the SD-LaAlO3/ALD-Al2O3/H-diamond MOS diode is smaller than 10-8 A cm-2 at gate bias from -4 to 2 V. The capacitance-voltage curve in the depletion mode shows sharp dependence, small flat band voltage, and small hysteresis shift, which implies low positive and trapped charge densities. The MOSFETs show p-type channel and complete normally off characteristics with threshold voltages changing from -3.6 ± 0.1 to -5.0 ± 0.1 V dependent on the gate length. The drain current maximum and the extrinsic transconductance of the MOSFET with gate length of 10 μm are -7.5 mA mm-1 and 2.3 ± 0.1 mS mm-1, respectively. The enhancement mode SD-LaAlO3/ALD-Al2O3/H-diamond MOSFET is concluded to be suitable for the applications of high power and high frequency electrical devices.

  15. Effective dose assessment in the maxillofacial region using thermoluminescent (TLD) and metal oxide semiconductor field-effect transistor (MOSFET) dosemeters: a comparative study.

    PubMed

    Koivisto, J; Schulze, D; Wolff, J; Rottke, D

    2014-01-01

    The objective of this study was to compare the performance of metal oxide semiconductor field-effect transistor (MOSFET) technology dosemeters with thermoluminescent dosemeters (TLDs) (TLD 100; Thermo Fisher Scientific, Waltham, MA) in the maxillofacial area. Organ and effective dose measurements were performed using 40 TLD and 20 MOSFET dosemeters that were alternately placed in 20 different locations in 1 anthropomorphic RANDO(®) head phantom (the Phantom Laboratory, Salem, NY). The phantom was exposed to four different CBCT default maxillofacial protocols using small (4 × 5 cm) to full face (20 × 17 cm) fields of view (FOVs). The TLD effective doses ranged between 7.0 and 158.0 µSv and the MOSFET doses between 6.1 and 175.0 µSv. The MOSFET and TLD effective doses acquired using four different (FOV) protocols were as follows: face maxillofacial (FOV 20 × 17 cm) (MOSFET, 83.4 µSv; TLD, 87.6 µSv; -5%); teeth, upper jaw (FOV, 8.5 × 5.0 cm) (MOSFET, 6.1 µSv; TLD, 7.0 µSv; -14%); tooth, mandible and left molar (FOV, 4 × 5 cm) (MOSFET, 10.3 µSv; TLD, 12.3 µSv; -16%) and teeth, both jaws (FOV, 10 × 10 cm) (MOSFET, 175 µSv; TLD, 158 µSv; +11%). The largest variation in organ and effective dose was recorded in the small FOV protocols. Taking into account the uncertainties of both measurement methods and the results of the statistical analysis, the effective doses acquired using MOSFET dosemeters were found to be in good agreement with those obtained using TLD dosemeters. The MOSFET dosemeters constitute a feasible alternative for TLDs for the effective dose assessment of CBCT devices in the maxillofacial region.

  16. Temperature-Independent Switching Rates for a Random Telegraph Signal in a Silicon Metal-Oxide-Semiconductor Field-Effect Transistor at Low Temperatures

    SciTech Connect

    Borland, Nick; Fleetwood, D.M.; Scofield, John H.

    1999-07-19

    We have observed discrete random telegraph signals (RTS'S) in the drain voltages of three, observed above 30 K were thermally activated. The switching rate for the only RTS observed below 30 K was thermally activated above 30 K but temperature-independent below 10 K. To our knowledge, this cross-over from thermal activation to tunneling behavior has not been previously observed for RTS's Metal-oxide-semiconductor field-effect transistors (MCEWETS) often exhibit relatively large levels of low-frequency (1/fl noise) [1,2]. Much evidence suggests that this noise is related to the capture all cases, switching rates have been thermally activated, often with different activation energies for capture and/or emission is accompanied by lattice relaxation. Though thermally activated behavior has sufficiently low temperatures [7,9]. While not observed in MOSFETS, cross-over from thermal activation to configurational tunneling has been observed for RTS's in junctions [13]. drain voltage was observed to randomly switch between two discrete levels, designated as Vup and Vdn, similar to RTS's reported by others [2,7'- 11 ]. We have characterized six RTS `S for temperatures above 30 K where thermally activated switching rates are observed. The properties of five of these have been the trap, i.e., the mean time a captured charge carrier spends in the trap before it is emitted. Similarly, we identify the mean time in the low resistance state ( trup in state Vup) as the capture time rc. F@ure 1 shows a typical time trace of the drain-voltage fluctuation &d(t)= Vd(t)+Vd>. This indicate that both the mean capture and emission times become independent of Tat low temperatures and where a= capture or emission, is temperature independent. The solid curve in Figure 3(a) (mean capture time) was obtained using a weighted nonlinear charge carriers are not in thermal equilibrium with the lattice, i.e., that while the lattice is being cooled Instead, we believe that the transition from thermally

  17. Charge trapping induced drain-induced-barrier-lowering in HfO2/TiN p-channel metal-oxide-semiconductor-field-effect-transistors under hot carrier stress

    NASA Astrophysics Data System (ADS)

    Lo, Wen-Hung; Chang, Ting-Chang; Tsai, Jyun-Yu; Dai, Chih-Hao; Chen, Ching-En; Ho, Szu-Han; Chen, Hua-Mao; Cheng, Osbert; Huang, Cheng-Tung

    2012-04-01

    This letter studies the channel hot carrier stress (CHCS) behaviors on high dielectric constant insulator and metal gate HfO2/TiN p-channel metal-oxide-semiconductor field effect transistors. It can be found that the degradation is associated with electron trapping, resulting in Gm decrease and positive Vth shift. However, Vth under saturation region shows an insignificant degradation during stress. To compare that, the CHC-induced electron trapping induced DIBL is proposed to demonstrate the different behavior of Vth between linear and saturation region. The devices with different channel length are used to evidence the trapping-induced DIBL behavior.

  18. Additional-Body Effects in a Self-Aligned Deca-Nanometer Ultrathin-Body and Buried Oxide Silicon-on-Insulator Metal-Oxide-Semiconductor Field-Effect Transistor: A Three-Dimensional Simulation Study

    NASA Astrophysics Data System (ADS)

    Lin, Jyi-Tsong; Eng, Yi-Chuen; Chen, Cheng-Hsin; Fan, Yi-Hsuan

    2011-11-01

    In this paper, we numerically investigate the additional-body effects (ABEs) created by the isolation-last fabrication process of a self-aligned deca-nanometer ultrathin-body and buried oxide (UTBB) silicon-on-insulator (SOI) metal-oxide-semiconductor field-effect transistor (MOSFET). The reasons for the device's new electrical characteristics are also explained in detail. The additional silicon body volumes of the UTBB SOI MOSFET are found to improve the subthreshold swing and the on/off current ratio. The additional body has a negative effect, however, upon both the gate leakage current and the total gate capacitance, when compared with a standard UTBB SOI MOSFET.

  19. Study of gate oxide traps in HfO2/AlGaN/GaN metal-oxide-semiconductor high-electron-mobility transistors by use of ac transconductance method

    NASA Astrophysics Data System (ADS)

    Sun, X.; Saadat, O. I.; Chang-Liao, K. S.; Palacios, T.; Cui, S.; Ma, T. P.

    2013-03-01

    We introduce an ac-transconductance method to profile the gate oxide traps in a HfO2 gated AlGaN/GaN Metal-Oxide-Semiconductor High-Electron-Mobility Transistors (MOS-HEMTs) that can exchange carriers with metal gates, which in turn causes changes in analog and pulsed channel currents. The method extracts energy and spacial distributions of the oxide and interface traps under the gate from the frequency dependence of ac transconductance. We demonstrate the method using MOS-HEMTs with gate oxides that were annealed at different temperatures.

  20. A complementary MOS process

    NASA Technical Reports Server (NTRS)

    Jhabvala, M. D.

    1977-01-01

    The complete sequence used to manufacture complementary metal oxide semiconductor (CMOS) integrated circuits is described. The fixed-gate array concept is presented as a means of obtaining CMOS integrated circuits in a fast and reliable fashion. Examples of CMOS circuits fabricated by both the conventional method and the fixed-gate array method are included. The electrical parameter specifications and characteristics are given along with typical values used to produce CMOS circuits. Temperature-bias stressing data illustrating the thermal stability of devices manufactured by this process are presented. Results of a preliminary study on the radiation sensitivity of circuits manufactured by this process are discussed. Some process modifications are given which have improved the radiation hardness of our CMOS devices. A formula description of the chemicals and gases along with the gas flow rates is also included.

  1. Enhanced sensing of dengue virus DNA detection using O2 plasma treated-silicon nanowire based electrical biosensor.

    PubMed

    Rahman, S F A; Yusof, N A; Hashim, U; Hushiarian, R; M N, M Nuzaihan; Hamidon, M N; Zawawi, R M; Fathil, M F M

    2016-10-26

    Dengue Virus (DENV) has become one of the most serious arthropod-borne viral diseases, causing death globally. The existing methods for DENV detection suffer from the late stage treatment due to antibodies-based detection which is feasible only after five days following the onset of the illness. Here, we demonstrated the highly effective molecular electronic based detection utilizing silicon nanowire (SiNW) integrated with standard complementary metal-oxide-semiconductor (CMOS) process as a sensing device for detecting deoxyribonucleic acid (DNA) related to DENV in an early stage diagnosis. To transform the fabricated devices as a functional sensing element, three-step procedure consist of SiNW surface modification, DNA immobilization and DNA hybridization were employed. The detection principle works by detecting the changes in current of SiNW which bridge the source and drain terminal to sense the immobilization of probe DNA and their hybridization with target DNA. The oxygen (O2) plasma was proposed as an effective strategy for increasing the binding amounts of target DNA by modified the SiNW surface. It was found that the detection limit of the optimized O2 plasma treated-SiNW device could be reduced to 1.985 × 10(-14) M with a linear detection range of the sequence-specific DNA from 1.0 × 10(-9) M to 1.0 × 10(-13) M. In addition, the developed biosensor device was able to discriminate between complementary, single mismatch and non-complementary DNA sequences. This highly sensitive assay was then applied to the detection of reverse transcription-polymerase chain reaction (RT-PCR) product of DENV-DNA, making it as a potential method for disease diagnosis through electrical biosensor. Copyright © 2016 Elsevier B.V. All rights reserved.

  2. Design, experimental verification, and analysis of a 1.8-V-input-range voltage-to-current converter using source degeneration for low-noise multimodal CMOS biosensor array

    NASA Astrophysics Data System (ADS)

    Niitsu, Kiichi; Ikeda, Kei; Muto, Keita; Nakazato, Kazuo

    2017-01-01

    A multimodal complementary metal-oxide semiconductor (CMOS) biosensor array manufactured using measurement methods such as potentiometry, amperometry, and impedimetry improves its cost competitiveness and measurement accuracy. In addition, it provides a wider range of application because it can obtain signals from multiple aspects. To develop high-signal-to-noise ratio (SNR) multimodal biosensor arrays, time-domain current integration was proposed in the literature and found to be effective. In addition to amperometry and impedimetry, it is possible to perform current integration using the potentiometry output by employing a voltage-to-current converter (VCC). However, a conventional VCC with a fixed transconductance mode does not provide a sufficient input range (<0.6 V) and its noise property has not been investigated. In this work, we investigate the design and noise property of a newly proposed VCC with source degeneration that enhances the input range. For evaluating the proposed method, a test chip was fabricated in a 0.6 µm CMOS. The measured results successfully demonstrate that the input range was enhanced from 0.6 to 1.8 V. Autonomous current limitation was also confirmed. The measured total input-referred noise was 0.445 mV (from 10 Hz to 10 kHz, assuming current integration at every 1 ms).

  3. A smartphone imaging-based label-free and dual-wavelength fluorescent biosensor with high sensitivity and accuracy.

    PubMed

    Lee, Won-Il; Shrivastava, Sajal; Duy, Le-Thai; Yeong Kim, Bo; Son, Young-Min; Lee, Nae-Eung

    2017-08-15

    The accuracy of a bioassay based on smartphone-integrated fluorescent biosensors has been limited due to the occurrence of false signals from non-specific reactions as well as a high background and low signal-to-noise ratios for complementary metal oxide semiconductor image sensors. To overcome this problem, we demonstrate dual-wavelength fluorescent detection of biomolecules with high accuracy. Fluorescent intensity can be quantified using dual wavelengths simultaneously, where one decreases and the other increases, as the target analytes bind to the split capture and detection aptamer probes. To do this, we performed smartphone imaging-based fluorescence microscopy using a microarray platform on a substrate with metal-enhanced fluorescence (MEF) using Ag film and Al2O3 nano-spacer. The results showed that the sensitivity and specificity of the dual-wavelength fluorescent quantitative assay for the target biomolecule 17-β-estradiol in water were significantly increased through the elimination of false signals. The detection limit was 1pg/mL and the area under the receiver operating characteristic curve of the proposed assay (0.922) was comparable to that of an enzyme-linked immunosorbent assay (0.956) from statistical accuracy tests using spiked wastewater samples. This novel method has great potential as an accurate point-of-care testing technology based on mobile platforms for clinical diagnostics and environmental monitoring. Copyright © 2017 Elsevier B.V. All rights reserved.

  4. Damage free Ar ion plasma surface treatment on In{sub 0.53}Ga{sub 0.47}As-on-silicon metal-oxide-semiconductor device

    SciTech Connect

    Koh, Donghyi; Shin, Seung Heon; Ahn, Jaehyun; Sonde, Sushant; Banerjee, Sanjay K.; Kwon, Hyuk-Min; Orzali, Tommaso; Kim, Tae-Woo; Kim, Dae-Hyun

    2015-11-02

    In this paper, we investigated the effect of in-situ Ar ion plasma surface pre-treatment in order to improve the interface properties of In{sub 0.53}Ga{sub 0.47}As for high-κ top-gate oxide deposition. X-ray photoelectron spectroscopy (XPS) and metal-oxide-semiconductor capacitors (MOSCAPs) demonstrate that Ar ion treatment removes the native oxide on In{sub 0.53}Ga{sub 0.47}As. The XPS spectra of Ar treated In{sub 0.53}Ga{sub 0.47}As show a decrease in the AsO{sub x} and GaO{sub x} signal intensities, and the MOSCAPs show higher accumulation capacitance (C{sub acc}), along with reduced frequency dispersion. In addition, Ar treatment is found to suppress the interface trap density (D{sub it}), which thereby led to a reduction in the threshold voltage (V{sub th}) degradation during constant voltage stress and relaxation. These results outline the potential of surface treatment for III-V channel metal-oxide-semiconductor devices and application to non-planar device process.

  5. Complementary field-effect transistors for flexible electronics

    NASA Astrophysics Data System (ADS)

    Hilleringmann, Ulrich; Vidor, Fábio F.; Meyers, Thorsten

    2016-02-01

    Key issues for flexible complementary electronics are low temperature processing, sufficient performance of the integrated p- and n-type FET devices, and cheap semiconducting and dielectric materials. Organic semiconductors commonly depict p-type behavior, whereas metal oxide semiconductors show n-type characteristics. This paper presents a new approach for common integration of organic and ZnO transistors on transparent substrates for complementary transistor electronics. The gate dielectric consists of a special high-k resin, the metallization utilizes Au and Al films. The thermal budget for processing of the devices is limited to 120°C to enable foil substrates.

  6. A comparison between HfO2/Al2O3 nano-laminates and ternary HfxAlyO compound as the dielectric material in InGaAs based metal-oxide-semiconductor (MOS) capacitors

    NASA Astrophysics Data System (ADS)

    Krylov, Igor; Pokroy, Boaz; Eizenberg, Moshe; Ritter, Dan

    2016-09-01

    We compare the electrical properties of HfO2/Al2O3 nano-laminates with those of the ternary HfxAlyO compound in metal oxide semiconductor (MOS) capacitors. The dielectrics were deposited by atomic layer deposition on InGaAs. Water, ozone, and oxygen plasma were tested as oxygen precursors, and best results were obtained using water. The total dielectric thickness was kept constant in our experiments. It was found that the effective dielectric constant increased and the leakage current decreased with the number of periods. Best results were obtained for the ternary compound. The effect of the sublayer thicknesses on the electrical properties of the interface was carefully investigated, as well as the role of post-metallization annealing. Possible explanations for the observed trends are provided. We conclude that the ternary HfxAlyO compound is more favorable than the nano-laminates approach for InGaAs based MOS transistor applications.

  7. Influence of the substrate orientation on the electrical and material properties of GaAs metal-oxide-semiconductor capacitors and self-aligned transistors using HfO2 and silicon interface passivation layer

    NASA Astrophysics Data System (ADS)

    Ok, InJo; Kim, H.; Zhang, M.; Zhu, F.; Park, S.; Yum, J.; Zhao, H.; Garcia, Domingo; Majhi, Prashant; Lee, Jack C.

    2008-05-01

    In this work, we studied the effects of postdeposition anneal (PDA) time and Si interface passivation layer on the material and electrical characteristics of the metal-oxide-semiconductor (MOS) capacitor with high-k (HfO2) material on different orientation substrates with (100), (110), and (311). The interfacial change of HfO2/Si /GaAs gate stacks after PDA has been characterized using x-ray photoelectron spectroscopy (XPS) and Dit measurement using conductance method and frequency dispersion. XPS measurement shows the formation of gallium and arsenic oxides with increasing annealing temperature. Unoxidized Si and gallium and arsenic oxides formation in the interface might act as traps. Self-aligned MOS field effect transistors using PDA at 600°C and post-metal-annealing at 800°C have also been fabricated and characterized. The (100) substrate has lower density of interface traps and higher mobility due to reduced Ga2O3 formation.

  8. Improved electrical properties of Ge metal-oxide-semiconductor capacitors with high-k HfO2 gate dielectric by using La2O3 interlayer sputtered with/without N2 ambient

    NASA Astrophysics Data System (ADS)

    Xu, H. X.; Xu, J. P.; Li, C. X.; Lai, P. T.

    2010-07-01

    The electrical properties of n-Ge metal-oxide-semiconductor (MOS) capacitors with HfO2/LaON or HfO2/La2O3 stacked gate dielectric (LaON or La2O3 as interlayer) are investigated. It is found that better electrical performances, including lower interface-state density, smaller gate leakage current, smaller capacitance equivalent thickness, larger k value, and negligible C-V frequency dispersion, can be achieved for the MOS device with LaON interlayer. The involved mechanism lies in that the LaON interlayer can effectively block the interdiffusions of Ge, O, and Hf, thus suppressing the growth of unstable GeOx interlayer and improving the dielectric/Ge interface quality.

  9. Origin of the performances degradation of two-dimensional-based metal-oxide-semiconductor field effect transistors in the sub-10 nm regime: A first-principles study

    SciTech Connect

    Lu, Anh Khoa Augustin; Pourtois, Geoffrey; Agarwal, Tarun; Afzalian, Aryan; Radu, Iuliana P.; Houssa, Michel

    2016-01-25

    The impact of the scaling of the channel length on the performances of metal-oxide-semiconductor field effect transistors, based on two-dimensional (2D) channel materials, is theoretically investigated, using density functional theory combined with the non-equilibrium Green's function method. It is found that the scaling of the channel length below 10 nm leads to strong device performance degradations. Our simulations reveal that this degradation is essentially due to the tunneling current flowing between the source and the drain in these aggressively scaled devices. It is shown that this electron tunneling process is modulated by the effective mass of the 2D channel material, and sets the limit of the scaling in future transistor designs.

  10. Inversion in the In0.53Ga0.47As metal-oxide-semiconductor system: Impact of the In0.53Ga0.47As doping concentration

    NASA Astrophysics Data System (ADS)

    O'Connor, É.; Cherkaoui, K.; Monaghan, S.; Sheehan, B.; Povey, I. M.; Hurley, P. K.

    2017-01-01

    In0.53Ga0.47As metal-oxide-semiconductor (MOS) capacitors with an Al2O3 gate oxide and a range of n and p-type In0.53Ga0.47As epitaxial concentrations were examined. Multi-frequency capacitance-voltage and conductance-voltage characterization exhibited minority carrier responses consistent with surface inversion. The measured minimum capacitance at high frequency (1 MHz) was in excellent agreement with the theoretical minimum capacitance calculated assuming an inverted surface. Minority carrier generation lifetimes, τg, extracted from experimentally measured transition frequencies, ωm, using physics based a.c. simulations, demonstrated a reduction in τg with increasing epitaxial doping concentration. The frequency scaled conductance, G/ω, in strong inversion allowed the estimation of accurate Cox values for these MOS devices.

  11. Comparison between chemical vapor deposited and physical vapor deposited WSi{sub 2} metal gate for InGaAs n-metal-oxide-semiconductor field-effect transistors

    SciTech Connect

    Ong, B. S.; Pey, K. L.; Ong, C. Y.; Tan, C. S.; Antoniadis, D. A.; Fitzgerald, E. A.

    2011-05-02

    We compare chemical vapor deposition (CVD) and physical vapor deposition (PVD) WSi{sub 2} metal gate process for In{sub 0.53}Ga{sub 0.47}As n-metal-oxide-semiconductor field-effect transistors using 10 and 6.5 nm Al{sub 2}O{sub 3} as dielectric layer. The CVD-processed metal gate device with 6.5 nm Al{sub 2}O{sub 3} shows enhanced transistor performance such as drive current, maximum transconductance and maximum effective mobility. These values are relatively better than the PVD-processed counterpart device with improvement of 51.8%, 46.4%, and 47.8%, respectively. The improvement for the performance of the CVD-processed metal gate device is due to the fluorine passivation at the oxide/semiconductor interface and a nondestructive deposition process.

  12. Bulk and interface trap generation under negative bias temperature instability stress of p-channel metal-oxide-semiconductor field-effect transistors with nitrogen and silicon incorporated HfO2 gate dielectrics

    NASA Astrophysics Data System (ADS)

    Choi, Changhwan; Lee, Jack C.

    2011-02-01

    Negative bias temperature instabilities (NBTIs) of p-channel metal-oxide-semiconductor field-effect-transistor with HfO2, HfOxNy, and HfSiON were investigated. Higher bulk trap generation (ΔNot) is mainly attributed to threshold voltage shift rather than interface trap generation (ΔNit). ΔNit, ΔNot, activation energy (Ea), and lifetime were exacerbated with incorporated nitrogen while improved with adding Si into gate dielectrics. Compared to HfO2, HfOxNy showed worse NBTI due to nitrogen pile-up at Si interface. However, adding Si into HfOxNy placed nitrogen peak profile away from Si/oxide interface and NBTI was reduced. This improvement is ascribed to reduced ΔNot and ΔNit, resulting from less nitrogen at Si interface.

  13. Investigation of an anomalous hump in gate current after negative-bias temperature-instability in HfO2/metal gate p-channel metal-oxide-semiconductor field-effect transistors

    NASA Astrophysics Data System (ADS)

    Ho, Szu-Han; Chang, Ting-Chang; Wu, Chi-Wei; Lo, Wen-Hung; Chen, Ching-En; Tsai, Jyun-Yu; Liu, Guan-Ru; Chen, Hua-Mao; Lu, Ying-Shin; Wang, Bin-Wei; Tseng, Tseung-Yuen; Cheng, Osbert; Huang, Cheng-Tung; Sze, Simon M.

    2013-01-01

    This Letter investigates a hump in gate current after negative-bias temperature-instability (NBTI) in HfO2/metal gate p-channel metal-oxide-semiconductor field-effect transistors. Measuring gate current at initial through body floating and source/drain floating shows that hole current flows from source/drain. The fitting of gate current (Ig)-gate voltage (Vg) characteristic curves demonstrates that the Frenkel-Poole mechanism dominates the conduction. Next, by fitting the gate current after NBTI, in the order of Frenkel-Poole then tunneling, the Frenkel-Poole mechanism can be confirmed. These phenomena can be attributed to hole trapping in high-k bulk and the electric field formula Ehigh-k ɛhigh-k = Q + Esio2ɛsio2.

  14. Analysis of an anomalous hump in gate current after dynamic negative bias stress in HfxZr1-xO2/metal gate p-channel metal-oxide-semiconductor field-effect transistors

    NASA Astrophysics Data System (ADS)

    Ho, Szu-Han; Chang, Ting-Chang; Wu, Chi-Wei; Lo, Wen-Hung; Chen, Ching-En; Tsai, Jyun-Yu; Luo, Hung-Ping; Tseng, Tseung-Yuen; Cheng, Osbert; Huang, Cheng-Tung; Sze, Simon M.

    2012-07-01

    This letter investigates a hump in gate current after dynamic negative bias stress (NBS) in HfxZr1-xO2/metal gate p-channel metal-oxide-semiconductor field-effect transistors. By measuring gate current under initial through body floating and source/drain floating, it shows that hole current flows from source/drain. The fitting of gate current-gate voltage characteristic curve demonstrates that Frenkel-Poole mechanism dominates the conduction. Next, by fitting the gate current after dynamic NBS, in the order of Frenkel-Poole then tunneling, the Frenkel-Poole mechanism can be confirmed. These phenomena can be attributed to hole trapping in high-k bulk and the electric field formula Ehigh-k ɛhigh-k = Q + Esio2ɛsio2.

  15. The influences of surface treatment and gas annealing conditions on the inversion behaviors of the atomic-layer-deposition Al2O3/n-In0.53Ga0.47As metal-oxide-semiconductor capacitor

    NASA Astrophysics Data System (ADS)

    Trinh, H. D.; Chang, E. Y.; Wu, P. W.; Wong, Y. Y.; Chang, C. T.; Hsieh, Y. F.; Yu, C. C.; Nguyen, H. Q.; Lin, Y. C.; Lin, K. L.; Hudait, M. K.

    2010-07-01

    The inversion behaviors of atomic-layer-deposition Al2O3/n-In0.53Ga0.47As metal-oxide-semiconductor capacitors are studied by various surface treatments and postdeposition annealing using different gases. By using the combination of wet sulfide and dry trimethyl aluminum surface treatment along with pure hydrogen annealing, a strong inversion capacitance-voltage (C-V) response is observed, indicating a remarkable reduction in interface trap state density (Dit) at lower half-part of In0.53Ga0.47As band gap. This low Dit was confirmed by the temperature independent C-V stretch-out and horizontal C-V curves. The x-ray photoelectron spectroscopy spectra further confirm the effectiveness of hydrogen annealing on the reduction of native oxides.

  16. Design and control of interface reaction between Al-based dielectrics and AlGaN layer in AlGaN/GaN metal-oxide-semiconductor structures

    NASA Astrophysics Data System (ADS)

    Watanabe, Kenta; Nozaki, Mikito; Yamada, Takahiro; Nakazawa, Satoshi; Anda, Yoshiharu; Ishida, Masahiro; Ueda, Tetsuzo; Yoshigoe, Akitaka; Hosoi, Takuji; Shimura, Takayoshi; Watanabe, Heiji

    2017-07-01

    Important clues for achieving well-behaved AlGaN/GaN metal-oxide-semiconductor (MOS) devices with Al-based gate dielectrics were systematically investigated on the basis of electrical and physical characterizations. We found that low-temperature deposition of alumina insulators on AlGaN surfaces is crucial to improve the interface quality, thermal stability, and variability of MOS devices by suppressing Ga diffusion into the gate oxides. Moreover, aluminum oxynitride grown in a reactive nitric atmosphere was proven to expand the optimal process window that would improve the interface quality and to enhance immunity against charge injection into the gate dielectrics. The results constitute common guidelines for achieving high-performance and reliable AlGaN/GaN MOS devices.

  17. Effects of stress annealing in nitrogen on the effective contact-potential difference, charges, and traps at the Si/SiO2 interface of metal-oxide-semiconductor devices

    NASA Astrophysics Data System (ADS)

    Przewlocki, Henryk M.; Massoud, Hisham Z.

    2002-08-01

    In this article, we report the results of a study of the effects of high-temperature stress annealing in nitrogen on the electrical properties of metal/oxide/semiconductor devices. In this study, we have experimentally characterized the dependence of the reduced effective contact-potential difference, the effective oxide charge (Neff), and the midgap interface trap density (Dit) on the annealing conditions in nitrogen. We have correlated such properties with the dependence of the index of refraction and oxide stress on the annealing conditions and oxide thickness in a companion article. We consider the contributions of the thermal-relaxation and nitrogen-incorporation processes in determining changes in the electrical properties with annealing time. This model description is consistent with other annealing studies carried out in argon where only the thermal-relaxation process is present.

  18. Investigation of trap properties in high-k/metal gate p-type metal-oxide-semiconductor field-effect-transistors with aluminum ion implantation using random telegraph noise analysis

    SciTech Connect

    Kao, Tsung-Hsien; Chang, Shoou-Jinn Fang, Yean-Kuen; Huang, Po-Chin; Wu, Chung-Yi; Wu, San-Lein

    2014-08-11

    In this study, the impact of aluminum ion implantation (Al I/I) on random telegraph noise (RTN) in high-k/metal gate (HK/MG) p-type metal-oxide-semiconductor field-effect-transistors (pMOSFETs) was investigated. The trap parameters of HK/MG pMOSFETs with Al I/I, such as trap energy level, capture time and emission time, activation energies for capture and emission, and trap location in the gate dielectric, were determined. The configuration coordinate diagram was also established. It was observed that the implanted Al could fill defects and form a thin Al{sub 2}O{sub 3} layer and thus increase the tunneling barrier height for holes. It was also observed that the trap position in the Al I/I samples was lower due to the Al I/I-induced dipole at the HfO{sub 2}/SiO{sub 2} interface.

  19. Tinv Scaling and Gate Leakage Reduction for n-Type Metal Oxide Semiconductor Field Effect Transistor with HfSix/HfO2 Gate Stack by Interfacial Layer Formation Using Ozone-Water-Last Treatment

    NASA Astrophysics Data System (ADS)

    Oshiyama, Itaru; Tai, Kaori; Hirano, Tomoyuki; Yamaguchi, Shinpei; Tanaka, Kazuaki; Hagimoto, Yoshiya; Uemura, Takayuki; Ando, Takashi; Watanabe, Koji; Yamamoto, Ryo; Kanda, Saori; Wang, Junli; Tateshita, Yasushi; Wakabayashi, Hitoshi; Tagawa, Yukio; Tsukamoto, Masanori; Iwamoto, Hayato; Saito, Masaki; Oshima, Masaharu; Toyoda, Satoshi; Nagashima, Naoki; Kadomura, Shingo

    2008-04-01

    In this paper, we demonstrate a wet treatment for the HfSix/HfO2 gate stack of n-type metal oxide semiconductor field effect transistor (nMOSFET) fabricated by a gate-last process in order to scale down the electrical thickness at inversion state Tinv value and reduce the gate leakage Jg. As a result, we succeeded in scaling down Tinv to 1.41 nm without mobility or Jg degradation by ozone-water-last treatment. We found that a high-density interfacial layer (IFL) is formed owing to the ozone-water-last treatment, and Hf diffusion to the IFL is suppressed, which was analyzed by high-resolution angle-resolved spectroscopy.

  20. Near interface traps in SiO2/4H-SiC metal-oxide-semiconductor field effect transistors monitored by temperature dependent gate current transient measurements

    NASA Astrophysics Data System (ADS)

    Fiorenza, Patrick; La Magna, Antonino; Vivona, Marilena; Roccaforte, Fabrizio

    2016-07-01

    This letter reports on the impact of gate oxide trapping states on the conduction mechanisms in SiO2/4H-SiC metal-oxide-semiconductor field effect transistors (MOSFETs). The phenomena were studied by gate current transient measurements, performed on n-channel MOSFETs operated in "gate-controlled-diode" configuration. The measurements revealed an anomalous non-steady conduction under negative bias (VG > |20 V|) through the SiO2/4H-SiC interface. The phenomenon was explained by the coexistence of a electron variable range hopping and a hole Fowler-Nordheim (FN) tunnelling. A semi-empirical modified FN model with a time-depended electric field is used to estimate the near interface traps in the gate oxide (Ntrap ˜ 2 × 1011 cm-2).

  1. Fabricating metal-oxide-semiconductor field-effect transistors on a polyethylene terephthalate substrate by applying low-temperature layer transfer of a single-crystalline silicon layer by meniscus force

    SciTech Connect

    Sakaike, Kohei; Akazawa, Muneki; Nakamura, Shogo; Higashi, Seiichiro

    2013-12-02

    A low-temperature local-layer technique for transferring a single-crystalline silicon (c-Si) film by using a meniscus force was proposed, and an n-channel metal-oxide-semiconductor field-effect transistor (MOSFET) was fabricated on polyethylene terephthalate (PET) substrate. It was demonstrated that it is possible to transfer and form c-Si films in the required shape at the required position on PET substrates at extremely low temperatures by utilizing a meniscus force. The proposed technique for layer transfer was applied for fabricating high-performance c-Si MOSFETs on a PET substrate. The fabricated MOSFET showed a high on/off ratio of more than 10{sup 8} and a high field-effect mobility of 609 cm{sup 2} V{sup −1} s{sup −1}.

  2. Near infrared biosensor based on Classical Electromagnetically Induced Reflectance (Cl-EIR) in a planar complementary metamaterial

    NASA Astrophysics Data System (ADS)

    Vafapour, Zohreh

    2017-03-01

    In the field of plasmonic metamaterials (MMs), the sub-wavelength metallic structures play a role similar to atoms in nature. Classical electromagnetically induced reflectance (Cl-EIR) is a classical phenomenon which is analogue to the EIR quantum phenomenon in atomic systems. A sensitive control of the Cl-EIR is crucial to a range of potential applications such as slowing light and biosensor. Here we report on our three-dimensional nanophotonic complementary planar metamaterial consisting of an array of three slot strips plasmonic that exhibits Cl-EIR phenomenon with magnetic and electric dipolar and quadruplar interaction between the plasmonic molecules. Simply by introducing symmetry broken of the proposed MM, the Cl-EIR can be dynamically tuned. We further demonstrate using a numerical simulation that the coupling between the plasmonic modes in one asymmetric case with changing the dielectric surrounding of the nano-structure to prove our design has a great potential for near-infrared localized surface plasmon resonance (LSPR) sensing applications. The changing of the used metal in thin-film was also proposed to explain the coupling effects between the bright and dark modes of the Cl-EIR electromagnetic spectra on sensitivity of our proposed nano-structure in plasmonic sensing. This work paves a promising approach to achieve plasmonic sensing devices. Actually, the reflection of more than 97% is observed which is very high for the EIR effect. Furthermore, the figure of merit (FOM) of 17.3 and the group index of 413 are obtained. These mentioned characteristics make the proposed metamaterial with potential to apply for ultrafast switches, bio-sensors, and slow-light devices.

  3. High-performance, mechanically flexible, and vertically integrated 3D carbon nanotube and InGaZnO complementary circuits with a temperature sensor.

    PubMed

    Honda, Wataru; Harada, Shingo; Ishida, Shohei; Arie, Takayuki; Akita, Seiji; Takei, Kuniharu

    2015-08-26

    A vertically integrated inorganic-based flexible complementary metal-oxide-semiconductor (CMOS) inverter with a temperature sensor with a high inverter gain of ≈50 and a low power consumption of <7 nW mm(-1) is demonstrated using a layer-by-layer assembly process. In addition, the negligible influence of the mechanical flexibility on the performance of the CMOS inverter and the temperature dependence of the CMOS inverter characteristics are discussed.

  4. Near interface traps in SiO{sub 2}/4H-SiC metal-oxide-semiconductor field effect transistors monitored by temperature dependent gate current transient measurements

    SciTech Connect

    Fiorenza, Patrick; La Magna, Antonino; Vivona, Marilena; Roccaforte, Fabrizio

    2016-07-04

    This letter reports on the impact of gate oxide trapping states on the conduction mechanisms in SiO{sub 2}/4H-SiC metal-oxide-semiconductor field effect transistors (MOSFETs). The phenomena were studied by gate current transient measurements, performed on n-channel MOSFETs operated in “gate-controlled-diode” configuration. The measurements revealed an anomalous non-steady conduction under negative bias (V{sub G} > |20 V|) through the SiO{sub 2}/4H-SiC interface. The phenomenon was explained by the coexistence of a electron variable range hopping and a hole Fowler-Nordheim (FN) tunnelling. A semi-empirical modified FN model with a time-depended electric field is used to estimate the near interface traps in the gate oxide (N{sub trap} ∼ 2 × 10{sup 11} cm{sup −2}).

  5. Electrically detected magnetic resonance study of defects created by hot carrier stress at the SiC/SiO2 interface of a SiC n-channel metal-oxide-semiconductor field-effect transistor

    NASA Astrophysics Data System (ADS)

    Gruber, G.; Hadley, P.; Koch, M.; Aichinger, T.

    2014-07-01

    This Letter reports electrical measurements as well as electrically detected magnetic resonance (EDMR) studies of defects created at the SiC/SiO2 interface of a lateral 4H-SiC n-channel metal-oxide-semiconductor field-effect transistor (MOSFET) by hot carrier stress (HCS). Both charge pumping (CP) and mobility measurements indicate severe device degradation due to the electrical stress. In accordance with the electrical measurements, a large increase in the EDMR amplitude by a factor of 27 was observed after 106 s of HCS. The defect observed in the unstressed device is anisotropic with gB||c = 2.0045(4) and gB⊥c = 2.0020(4). After the stress, the g-value changes to gB||c = 2.0059(4) and gB⊥c = 2.0019(4). During HCS, most defects are created near the n-doped drain region of the device. In this region, the crystalline structure of the SiC is distorted due to incorporation of N close to the amorphous dose. The distortion could explain the slight change in the g-value with the dominating defect or defect family remaining the same before and after stress. Although the precise structure of the defect could not be identified due to overlapping spectra and limited measurement resolution, the strong hyperfine side peaks suggest a N related defect.

  6. Perfecting the Al2O3/In0.53Ga0.47As interfacial electronic structure in pushing metal-oxide-semiconductor field-effect-transistor device limits using in-situ atomic-layer-deposition

    NASA Astrophysics Data System (ADS)

    Hong, M.; Wan, H. W.; Lin, K. Y.; Chang, Y. C.; Chen, M. H.; Lin, Y. H.; Lin, T. D.; Pi, T. W.; Kwo, J.

    2017-09-01

    We performed interfacial electric and electronic studies of both in-situ and ex-situ atomic-layer deposited (ALD) Al2O3 films on InGaAs. Self-aligned inversion-channel metal-oxide-semiconductor field-effect-transistors (MOSFETs) with a 1 μm gate length (Lg) from the in-situ sample have extrinsic drain currents (Id) of 1.8 mA/μm, transconductances (Gm) of 0.98 mS/μm, and an effective mobility (μeff) of 1250 cm2/V s. MOSFETs that employ ex-situ ALD-Al2O3 have an Id of 0.56 mA/μm, Gm of 0.28 mS/μm, and μeff of 410 cm2/V s. Synchrotron radiation photoemission reveals no AsOx residue at the Al2O3/InGaAs interface using the in-situ approach, whereas some AsOx residue is detected using the ex-situ method.

  7. Zero Additional Process, Local Charge Trap, Embedded Flash Memory with Drain-Side Assisted Erase Scheme Using Minimum Channel Length/Width Standard Complemental Metal-Oxide-Semiconductor Single Transistor Cell

    NASA Astrophysics Data System (ADS)

    Miyaji, Kousuke; Shinozuka, Yasuhiro; Takeuchi, Ken

    2012-04-01

    This paper proposes for the first time the completely complemental metal-oxide-semiconductor (CMOS) compatible embedded flash memory with the small cell size as well as the lowest process cost. The single transistor cell with the minimum channel length and width realizes the ideal smallest cell. The non-volatile memory operation is realized with locally injected electrons at the drain-edge by the hot electron injection. This paper also proposes the novel forward-bias assisted erase. The proposed memory is experimentally demonstrated with the 65 nm standard CMOS process without additional process or mask. The cell size is 10F2 with the 65 nm CMOS logic design rule. The excellent reliability such as 100-times program/erase endurance, 10-year data retention and high immunity to the read/program/erase disturb is also experimentally demonstrated. The proposed cell is the ideal candidate for the code-storage embedded non-volatile memories in system-on-chip and microcontroller unit.

  8. Assessment of radiation exposure in dental cone-beam computerized tomography with the use of metal-oxide semiconductor field-effect transistor (MOSFET) dosimeters and Monte Carlo simulations.

    PubMed

    Koivisto, J; Kiljunen, T; Tapiovaara, M; Wolff, J; Kortesniemi, M

    2012-09-01

    The aims of this study were to assess the organ and effective dose (International Commission on Radiological Protection (ICRP) 103) resulting from dental cone-beam computerized tomography (CBCT) imaging using a novel metal-oxide semiconductor field-effect transistor (MOSFET) dosimeter device, and to assess the reliability of the MOSFET measurements by comparing the results with Monte Carlo PCXMC simulations. Organ dose measurements were performed using 20 MOSFET dosimeters that were embedded in the 8 most radiosensitive organs in the maxillofacial and neck area. The dose-area product (DAP) values attained from CBCT scans were used for PCXMC simulations. The acquired MOSFET doses were then compared with the Monte Carlo simulations. The effective dose measurements using MOSFET dosimeters yielded, using 0.5-cm steps, a value of 153 μSv and the PCXMC simulations resulted in a value of 136 μSv. The MOSFET dosimeters placed in a head phantom gave results similar to Monte Carlo simulations. Minor vertical changes in the positioning of the phantom had a substantial affect on the overall effective dose. Therefore, the MOSFET dosimeters constitute a feasible method for dose assessment of CBCT units in the maxillofacial region. Copyright © 2012 Elsevier Inc. All rights reserved.

  9. Systematical Study of Reliability Issues in Plasma-Nitrided and Thermally Nitrided Oxides for Advanced Dual-Gate Oxide p-Channel Metal-Oxide-Semiconductor Field-Effect Transistors

    NASA Astrophysics Data System (ADS)

    Lo, Wen-Cheng; Wu, Shien-Yang; Chang, Sun-Jay; Chiang, Mu-Chi; Lin, Chih-Yung; Chao, Tien-Sheng; Chang, Chun-Yen

    2007-03-01

    In this study, we compared the effects of negative-bias temperature instability (NBTI) and hot-carrier injection (HCI) on the core and input/output (I/O) p-channel metal-oxide-semiconductor field-effect transistor (PMOSFET) fabricated using the different gate dielectrics of plasma nitrided oxide (PNO) and thermally nitrided oxide (TNO). The mobility and constant overdrive current of the PMOSFETs fabricated using PNO as a gate oxide material are about 30 and 23% higher than those of the devices fabricated using TNO, respectively. The core PMOSFETs fabricated using PNO show a better NBTI and HCI immunity than those fabricated using TNO owing to the lower nitrogen concentration at the SiO2/Si-substrate interface. However, the I/O PMOSFETs fabricated using PNO show a higher HCI-induced degradation rate because of a higher oxide bulk trap density but a better NBTI than the devices fabricated using TNO at a normal stressed bias due to a low interface trap density.

  10. Measurement of n-type Dry Thermally Oxidized 6H-SiC Metal-oxide Semiconductor Diodes by Quasistatic and High-Frequency Capacitance Versus Voltage and Capacitance Transient Techniques

    NASA Technical Reports Server (NTRS)

    Neudeck, P.; Kang, S.; Petit, J.; Tabib-Azar, M.

    1994-01-01

    Dry-oxidized n-type 6H-SiC metal-oxide-semiconductor capacitors are investigated using quasistatic capacitance versus voltage (C-V), high-frequency C-V, and pulsed high-frequency capacitance transient (C-t) analysis over the temperature range from 297 to 573 K. The quasistatic C - V characteristics presented are the first reported for 6H-SiC MOS capacitors, and exhibit startling nonidealities due to nonequilibrium conditions that arise from the fact that the recombination/generation process in 6H-SiC is extraordinarily slow even at the highest measurement temperature employed. The high-frequency dark C-V characteristics all showed deep depletion with no observable hysteresis. The recovery of the high-frequency capacitance from deep depletion to inversion was used to characterize the minority-carrier generation process as a function of temperature. Zerbst analysis conducted on the resulting C-t transients, which were longer than 1000 s at 573 K, showed a generation lifetime thermal activation energy of 0.49 eV.

  11. High quality PECVD SiO2 process for recessed MOS-gate of AlGaN/GaN-on-Si metal-oxide-semiconductor heterostructure field-effect transistors

    NASA Astrophysics Data System (ADS)

    Lee, Jae-Gil; Kim, Hyun-Seop; Seo, Kwang-Seok; Cho, Chun-Hyung; Cha, Ho-Young

    2016-08-01

    A high quality SiO2 deposition process using a plasma enhanced chemical vapor deposition system has been developed for the gate insulator process of normally-off recessed-gate AlGaN/GaN metal-oxide-semiconductor-heterostructure field-effect transistors (MOS-HFETs). SiO2 films were deposited by using SiH4 and N2O mixtures as reactant gases. The breakdown field increased with increasing the N2O flow rate. The optimum SiH4/N2O ratio was 0.05, which resulted in a maximum breakdown field of 11 MV/cm for the SiO2 film deposited on recessed GaN surface. The deposition conditions were optimized as follows; a gas flow rate of SiH4/N2O (=27/540 sccm), a source RF power of 100 W, a pressure of 2 Torr, and a deposition temperature of 350 °C. A fabricated normally-off MOS-HFET exhibited a threshold voltage of 3.2 V, a specific on-resistance of 4.46 mΩ cm2, and a breakdown voltage of 810 V.

  12. Negative bias-and-temperature stress-assisted activation of oxygen-vacancy hole traps in 4H-silicon carbide metal-oxide-semiconductor field-effect transistors

    SciTech Connect

    Ettisserry, D. P. E-mail: neil@umd.edu; Goldsman, N. E-mail: neil@umd.edu; Akturk, A.; Lelis, A. J.

    2015-07-28

    We use hybrid-functional density functional theory-based Charge Transition Levels (CTLs) to study the electrical activity of near-interfacial oxygen vacancies located in the oxide side of 4H-Silicon Carbide (4H-SiC) power Metal-Oxide-Semiconductor Field-Effect Transistors (MOSFETs). Based on the “amorphousness” of their local atomic environment, oxygen vacancies are shown to introduce their CTLs either within (permanently electrically active) or outside of (electrically inactive) the 4H-SiC bandgap. The “permanently electrically active” centers are likely to cause threshold voltage (V{sub th}) instability at room temperature. On the other hand, we show that the “electrically inactive” defects could be transformed into various “electrically active” configurations under simultaneous application of negative bias and high temperature stresses. Based on this observation, we present a model for plausible oxygen vacancy defects that could be responsible for the recently observed excessive worsening of V{sub th} instability in 4H-SiC power MOSFETs under high temperature-and-gate bias stress. This model could also explain the recent electrically detected magnetic resonance observations in 4H-SiC MOSFETs.

  13. Effect of barrier recess on transport and electrostatic interface properties of GaN-based normally-off and normally-on metal oxide semiconductor heterostructure field effect transistors

    NASA Astrophysics Data System (ADS)

    Capriotti, M.; Bahat Treidel, E.; Fleury, C.; Bethge, O.; Ostermaier, C.; Rigato, M.; Lancaster, S. L. C.; Brunner, F.; Detz, H.; Hilt, O.; Würfl, J.; Pogany, D.; Strasser, G.

    2016-11-01

    We perform a comprehensive electrical transport and physical characterization of metal oxide semiconductor heterostructure field effect transistors with ZrO2 gate dielectrics, having partially (referred here as MOS-HFET) and fully (here called true-MOS-FET) recessed GaN/AlGaN/GaN barrier, giving normally-on and normally-off behavior, respectively. The mobility of the MOS-HFETs decreases with the proximity of the Coulomb scattering centers, situated at the ZrO2/AlGaN interface. The effect of the etching procedure and ZrO2 deposition on the formation of the interfacial charges, Nint, is evaluated by X-ray Photoelectron Spectroscopy and by fitting the threshold voltage values to numerical model. For the both device types, the extracted value of Nint lies within 15% around 2.8 × 1013 cm-2, which is of the order of polarization charge, showing that our low-damage three step etching procedure does not introduce extra interface states.

  14. Ultra-low temperature radio-frequency performance of partially depleted silicon-on-insulator n-type metal-oxide-semiconductor field-effect transistors with tunnel diode body contact structures

    NASA Astrophysics Data System (ADS)

    Lu, Kai; Chen, Jing; Huang, Yuping; Liu, Jun; Luo, Jiexin; Wang, Xi

    2016-11-01

    Radio-frequency (RF) characteristics under ultra-low temperature of multi-finger partially depleted silicon-on-insulator (PD SOI) n-type metal-oxide-semiconductor field-effect transistors (nMOSFETs) with tunnel diode body-contact (TDBC) structure and T-gate body-contact (TB) structure are investigated in this paper. When operating at 77 K, TDBC device suppresses floating-body effect (FBE) as well as the TB device. For TB device and TDBC device, cut-off frequency (f T) improves as the temperature decreases to liquid-helium temperature (77 K) while that of the maximum oscillation frequency (f MAX) is opposite due to the decrease of the unilateral power gain. While operating under 77 K, f T and f MAX of TDBC device reach to 125 GHz and 77 GHz, representing 8% and 15% improvements compared with those of TB device, respectively, which is mainly due to the lower parasitic resistances and capacitances. The results indicate that TDBC SOI MOSFETs could be considered as promising candidates for analog and RF applications over a wide range of temperatures and there is immense potential for the development of RF CMOS integrated circuits for cryogenic applications.

  15. Post-Annealing Effects on Fixed Charge and Slow/Fast Interface States of TiN/Al2O3/p-Si Metal-Oxide-Semiconductor Capacitor

    NASA Astrophysics Data System (ADS)

    Jeon, In Sang; Park, Jaehoo; Eom, Dail; Hwang, Cheol Seong; Kim, Hyeong Joon; Park, Chan Jin; Cho, Hoon Young; Lee, Jong-Ho; Lee, Nae-In; Kang, Ho-Kyu

    2003-03-01

    The fixed charges (Nf) and the “slow” (Nsi) and “fast” (Dit) interface states of TiN/Al2O3/p-Si metal-oxide-semiconductor (MOS) capacitors were investigated by the capacitance-voltage and deep level transient spectroscopy (DLTS) method. In addition, small pulse DLTS (SP-DLTS) analysis was performed for a more precise estimation of energies and capture cross sections of the interface states. The variations in the Nf, Nsi and Dit with various post-annealing conditions were evaluated. Annealing under a H2 atmosphere effectively reduced the Nf, Nsi, and Dit. The Dit at an energy of 0.35 eV from the valence band decreased from 1× 1012 cm-2eV-1 at the as-fabricated state to 4× 1011 cm-2eV-1 after annealing at 450°C. A large peak related to minority carrier capture was detected in the high temperature region of the DLTS results. The peak intensity also decreased after hydrogen annealing. This suggests that the interface states in the upper half of the Si band-gap decrease with H2 annealing.

  16. On the distribution of oxide defect levels in Al2O3 and HfO2 high-k dielectrics deposited on InGaAs metal-oxide-semiconductor devices studied by capacitance-voltage hysteresis

    NASA Astrophysics Data System (ADS)

    Vais, Abhitosh; Franco, Jacopo; Lin, Dennis; Putcha, Vamsi; Sioncke, Sonja; Mocuta, Anda; Collaert, Nadine; Thean, Aaron; De Meyer, Kristin

    2017-04-01

    In this work, we study oxide defects in various III-V/high-k metal-oxide-semiconductor (MOS) stacks. We show that the choice of a given starting measurement voltage with respect to the MOS flat-band voltage affects the observed capacitance-voltage hysteresis. We discuss how this behavior can be used to study the distribution of oxide defect levels. With the help of comprehensive experimental data, we show that Al2O3 and HfO2 have different hysteresis characteristics related to different oxide defect distributions. In case of an Al2O3/HfO2 bilayer stack with Al2O3 on the channel side (interfacial layer, IL), as the IL thickness reduces from 3 nm to 0 nm, the hysteresis behavior switches from the typical Al2O3 behavior to the one corresponding to HfO2. We link the characteristic behavior of two dielectrics to the defect level distributions inside their respective band-gaps through a simple energy-driven charging model. Based on the experimental data and simulation results, we show that Al2O3, despite having a lower peak defect density as compared to HfO2, shows a very wide, almost continuous distribution of defect levels across and around the InGaAs channel energy band gap. These results explain the often reported poor reliability of III-V devices with Al2O3-based gate stacks.

  17. Investigation of DC Hot-Carrier Degradation at Elevated Temperatures for n-Channel Metal-Oxide-Semiconductor Field-Effect-Transistor of 0.13 μm Technology

    NASA Astrophysics Data System (ADS)

    Lin, Jung‑Chun; Chen, Shuang‑Yuan; Chen, Hung‑Wen; Jhou, Ze‑Wei; Lin, Hung‑Chuan; Chou, Sam; Ko, Joe; Lei, Tien‑Fu; Haung, Heng‑Sheng

    2006-04-01

    In this study, n-channel metal-oxide-semiconductor field-effect transistors (nMOSFETs) having 20 and 32 Å gate oxide thicknesses of 0.13 μm technology were used to investigate DC hot-carrier reliability at elevated temperatures up to 125 °C. The research also focused on the degradation of analog properties after hot-carrier injection. On the basis of the results of experiments, the hot-carrier degradation of Id,op (drain current defined on the basis of analog applications) is found to be the worst case among those of three types of drain current from room temperature to 125 °C. This result should provide valuable insight to analog circuit designers. As to the reverse temperature effect, the substrate current (Ib) commonly accepted as the parameter for monitoring the drain-avalanche-hot-carrier (DAHC) effect should be modified since the drain current (Id) degradation and Ib variations versus temperature have different trends. For the devices having a gate oxide thinner than 20 Å, we suggest that the worst condition in considering hot-carrier reliability should be placed at elevated temperatures.

  18. Low Threshold Voltage and High Mobility N-Channel Metal-Oxide-Semiconductor Field-Effect Transistor Using Hf-Si/HfO2 Gate Stack Fabricated by Gate-Last Process

    NASA Astrophysics Data System (ADS)

    Ando, Takashi; Hirano, Tomoyuki; Tai, Kaori; Yamaguchi, Shinpei; Yoshida, Shinichi; Iwamoto, Hayato; Kadomura, Shingo; Watanabe, Heiji

    2010-01-01

    Systematic characterization of Hf-Si/HfO2 gate stacks revealed two mobility degradation modes. One is carrier scattering by fixed charges and/or trapped charges induced by the crystallization in the thick HfO2 case (inversion oxide thickness, Tinv> 1.6 nm). The other is the Hf penetration into the interfacial layer with the Si substrate in the thin HfO2 case (Tinv< 1.6 nm) for the Hf-rich electrode. It was demonstrated that careful optimization of the HfO2 thickness and the Hf-Si composition can suppress both modes. As a result, a high electron mobility equivalent to that of n+polycrystalline silicon (poly-Si)/SiO2 (248 cm2 V-1 s-1 at Eeff=1 MV/cm) was obtained at Tinv of 1.47 nm. Moreover, the effective work function of the optimized Hf-Si/HfO2 gate stack is located within 50 mV from the Si band edge (Ec). An extremely high Ion of 1165 µA/µm (at Ioff = 81 nA/µm) at Vdd=1.0 V was demonstrated for a 45 nm gate n-channel metal-oxide-semiconductor field-effect transistor (n-MOSFET) without strain enhanced technology.

  19. Nitride passivation reduces interfacial traps in atomic-layer-deposited Al{sub 2}O{sub 3}/GaAs (001) metal-oxide-semiconductor capacitors using atmospheric metal-organic chemical vapor deposition

    SciTech Connect

    Aoki, T. Fukuhara, N.; Osada, T.; Sazawa, H.; Hata, M.; Inoue, T.

    2014-07-21

    Using an atmospheric metal-organic chemical vapor deposition system, we passivated GaAs with AlN prior to atomic layer deposition of Al{sub 2}O{sub 3}. This AlN passivation incorporated nitrogen at the Al{sub 2}O{sub 3}/GaAs interface, improving the capacitance-voltage (C–V) characteristics of the resultant metal-oxide-semiconductor capacitors (MOSCAPs). The C–V curves of these devices showed a remarkable reduction in the frequency dispersion of the accumulation capacitance. Using the conductance method at various temperatures, we extracted the interfacial density of states (D{sub it}). The D{sub it} was reduced over the entire GaAs band gap. In particular, these devices exhibited D{sub it} around the midgap of less than 4 × 10{sup 12} cm{sup −2}eV{sup −1}, showing that AlN passivation effectively reduced interfacial traps in the MOS structure.

  20. Blue/pink/purple electroluminescence from metal-oxide-semiconductor devices fabricated by spin-coating of [tantalum:(gadolinium/praseodymium)] and (praseodymium:cerium) organic compounds on silicon

    NASA Astrophysics Data System (ADS)

    Ohzone, Takashi; Matsuda, Toshihiro; Fukuoka, Ryouhei; Hattori, Fumihiro; Iwata, Hideyuki

    2016-08-01

    Blue/pink/purple electroluminescence (EL) from metal-oxide-semiconductor (MOS) devices with an indium tin oxide (ITO)/[Gd/(Ta + Gd/Pr)/(Pr + Ce)-Si-O] insulator layer/n+-Si substrate surface is reported. The insulator layers were fabricated from organic liquid sources of Gd or (Ta + Gd/Pr)/(Pr + Ce) mixtures, which were spin-coated on the n+-Si substrate and annealed at 950 °C for 30 min in air. The EL emission could be observed by the naked eye in the dark in the Fowler-Nordheim (FN) tunnel current regions. Peak wavelengths in the measured EL spectra were independent of the positive current. The EL intensity ratio of ultraviolet (UV) to the visible range varied with the composition ratio of the (Ta + Gd) liquids, and an optimum Ta to Gd ratio existed for the strongest blue emission, which could be attributed to the Ta-related oxide/silicate. The pink EL of the device fabricated with the (\\text{Ta}:\\text{Pr} = 6:4) mixture ratio can be explained by EL emission peaks related to the Pr3+ ions. The purple EL observed from the (\\text{Pr}:\\text{Ce} = 6:4) device corresponds to the strong and broad emission profile near the 357 nm peak, which cannot be assigned to Ce3+ ions. The results suggest that the EL can be attributed to the double-layer oxides with different compositions in the MOS devices. The upper layer consists of various Ta-, Gd-, Pr-, and Ce-related oxides and their silicates, while the lower SiO x -rich layer contributes to the FN current due to the high electric field, and thus the various EL colors.

  1. Effect of proton irradiation dose on InAlN/GaN metal-oxide semiconductor high electron mobility transistors with Al2O3 gate oxide

    SciTech Connect

    Ahn, Shihyun; Kim, Byung -Jae; Lin, Yi -Hsuan; Ren, Fan; Pearton, Stephen J.; Yang, Gwangseok; Kim, Jihyun; Kravchenko, Ivan I.

    2016-07-26

    The effects of proton irradiation on the dc performance of InAlN/GaN metal-oxide-semiconductor high electron mobility transistors (MOSHEMTs) with Al2O3 as the gate oxide were investigated. The InAlN/GaN MOSHEMTs were irradiated with doses ranging from 1×1013 to 1×1015cm–2 at a fixed energy of 5MeV. There was minimal damage induced in the two dimensional electron gas at the lowest irradiation dose with no measurable increase in sheet resistance, whereas a 9.7% increase of the sheet resistance was observed at the highest irradiation dose. By sharp contrast, all irradiation doses created more severe degradation in the Ohmic metal contacts, with increases of specific contact resistance from 54% to 114% over the range of doses investigated. These resulted in source-drain current–voltage decreases ranging from 96 to 242 mA/mm over this dose range. The trap density determined from temperature dependent drain current subthreshold swing measurements increased from 1.6 × 1013 cm–2 V–1 for the reference MOSHEMTs to 6.7 × 1013 cm–2 V–1 for devices irradiated with the highest dose. In conclusion, the carrier removal rate was 1287 ± 64 cm–1, higher than the authors previously observed in AlGaN/GaN MOSHEMTs for the same proton energy and consistent with the lower average bond energy of the InAlN.

  2. Phosphorus and boron diffusion paths in polycrystalline silicon gate of a trench-type three-dimensional metal-oxide-semiconductor field effect transistor investigated by atom probe tomography

    SciTech Connect

    Han, Bin Takamizawa, Hisashi Shimizu, Yasuo; Inoue, Koji; Nagai, Yasuyoshi; Yano, Fumiko; Kunimune, Yorinobu; Inoue, Masao; Nishida, Akio

    2015-07-13

    The dopant (P and B) diffusion path in n- and p-types polycrystalline-Si gates of trench-type three-dimensional (3D) metal-oxide-semiconductor field-effect transistors (MOSFETs) were investigated using atom probe tomography, based on the annealing time dependence of the dopant distribution at 900 °C. Remarkable differences were observed between P and B diffusion behavior. In the initial stage of diffusion, P atoms diffuse into deeper regions from the implanted region along grain boundaries in the n-type polycrystalline-Si gate. With longer annealing times, segregation of P on the grain boundaries was observed; however, few P atoms were observed within the large grains or on the gate/gate oxide interface distant from grain boundaries. These results indicate that P atoms diffuse along grain boundaries much faster than through the bulk or along the gate/gate oxide interface. On the other hand, in the p-type polycrystalline-Si gate, segregation of B was observed only at the initial stage of diffusion. After further annealing, the B atoms became uniformly distributed, and no clear segregation of B was observed. Therefore, B atoms diffuse not only along the grain boundary but also through the bulk. Furthermore, B atoms diffused deeper than P atoms along the grain boundaries under the same annealing conditions. This information on the diffusion behavior of P and B is essential for optimizing annealing conditions in order to control the P and B distributions in the polycrystalline-Si gates of trench-type 3D MOSFETs.

  3. Phosphorus and boron diffusion paths in polycrystalline silicon gate of a trench-type three-dimensional metal-oxide-semiconductor field effect transistor investigated by atom probe tomography

    NASA Astrophysics Data System (ADS)

    Han, Bin; Takamizawa, Hisashi; Shimizu, Yasuo; Inoue, Koji; Nagai, Yasuyoshi; Yano, Fumiko; Kunimune, Yorinobu; Inoue, Masao; Nishida, Akio

    2015-07-01

    The dopant (P and B) diffusion path in n- and p-types polycrystalline-Si gates of trench-type three-dimensional (3D) metal-oxide-semiconductor field-effect transistors (MOSFETs) were investigated using atom probe tomography, based on the annealing time dependence of the dopant distribution at 900 °C. Remarkable differences were observed between P and B diffusion behavior. In the initial stage of diffusion, P atoms diffuse into deeper regions from the implanted region along grain boundaries in the n-type polycrystalline-Si gate. With longer annealing times, segregation of P on the grain boundaries was observed; however, few P atoms were observed within the large grains or on the gate/gate oxide interface distant from grain boundaries. These results indicate that P atoms diffuse along grain boundaries much faster than through the bulk or along the gate/gate oxide interface. On the other hand, in the p-type polycrystalline-Si gate, segregation of B was observed only at the initial stage of diffusion. After further annealing, the B atoms became uniformly distributed, and no clear segregation of B was observed. Therefore, B atoms diffuse not only along the grain boundary but also through the bulk. Furthermore, B atoms diffused deeper than P atoms along the grain boundaries under the same annealing conditions. This information on the diffusion behavior of P and B is essential for optimizing annealing conditions in order to control the P and B distributions in the polycrystalline-Si gates of trench-type 3D MOSFETs.

  4. Effect of proton irradiation dose on InAlN/GaN metal-oxide semiconductor high electron mobility transistors with Al2O3 gate oxide

    SciTech Connect

    Ahn, Shihyun; Kim, Byung -Jae; Lin, Yi -Hsuan; Ren, Fan; Pearton, Stephen J.; Yang, Gwangseok; Kim, Jihyun; Kravchenko, Ivan I.

    2016-07-26

    The effects of proton irradiation on the dc performance of InAlN/GaN metal-oxide-semiconductor high electron mobility transistors (MOSHEMTs) with Al2O3 as the gate oxide were investigated. The InAlN/GaN MOSHEMTs were irradiated with doses ranging from 1×1013 to 1×1015cm–2 at a fixed energy of 5MeV. There was minimal damage induced in the two dimensional electron gas at the lowest irradiation dose with no measurable increase in sheet resistance, whereas a 9.7% increase of the sheet resistance was observed at the highest irradiation dose. By sharp contrast, all irradiation doses created more severe degradation in the Ohmic metal contacts, with increases of specific contact resistance from 54% to 114% over the range of doses investigated. These resulted in source-drain current–voltage decreases ranging from 96 to 242 mA/mm over this dose range. The trap density determined from temperature dependent drain current subthreshold swing measurements increased from 1.6 × 1013 cm–2 V–1 for the reference MOSHEMTs to 6.7 × 1013 cm–2 V–1 for devices irradiated with the highest dose. In conclusion, the carrier removal rate was 1287 ± 64 cm–1, higher than the authors previously observed in AlGaN/GaN MOSHEMTs for the same proton energy and consistent with the lower average bond energy of the InAlN.

  5. Electrical properties of GaAs metal-oxide-semiconductor structure comprising Al2O3 gate oxide and AlN passivation layer fabricated in situ using a metal-organic vapor deposition/atomic layer deposition hybrid system

    NASA Astrophysics Data System (ADS)

    Aoki, Takeshi; Fukuhara, Noboru; Osada, Takenori; Sazawa, Hiroyuki; Hata, Masahiko; Inoue, Takayuki

    2015-08-01

    This paper presents a compressive study on the fabrication and optimization of GaAs metal-oxide-semiconductor (MOS) structures comprising a Al2O3 gate oxide, deposited via atomic layer deposition (ALD), with an AlN interfacial passivation layer prepared in situ via metal-organic chemical vapor deposition (MOCVD). The established protocol afforded self-limiting growth of Al2O3 in the atmospheric MOCVD reactor. Consequently, this enabled successive growth of MOCVD-formed AlN and ALD-formed Al2O3 layers on the GaAs substrate. The effects of AlN thickness, post-deposition anneal (PDA) conditions, and crystal orientation of the GaAs substrate on the electrical properties of the resulting MOS capacitors were investigated. Thin AlN passivation layers afforded incorporation of optimum amounts of nitrogen, leading to good capacitance-voltage (C-V) characteristics with reduced frequency dispersion. In contrast, excessively thick AlN passivation layers degraded the interface, thereby increasing the interfacial density of states (Dit) near the midgap and reducing the conduction band offset. To further improve the interface with the thin AlN passivation layers, the PDA conditions were optimized. Using wet nitrogen at 600 °C was effective to reduce Dit to below 2 × 1012 cm-2 eV-1. Using a (111)A substrate was also effective in reducing the frequency dispersion of accumulation capacitance, thus suggesting the suppression of traps in GaAs located near the dielectric/GaAs interface. The current findings suggest that using an atmosphere ALD process with in situ AlN passivation using the current MOCVD system could be an efficient solution to improving GaAs MOS interfaces.

  6. Reduction in the interface-states density of metal-oxide-semiconductor field-effect transistors fabricated on high-index Si (114) surfaces by using an external magnetic field

    SciTech Connect

    Molina, J. De La Hidalga, J.; Gutierrez, E.

    2014-08-14

    After fabrication of Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET) devices on high-index silicon (114) surfaces, their threshold voltage (Vth) and interface-states density (Dit) characteristics were measured under the influence of an externally applied magnetic field of B = 6 μT at room temperature. The electron flow of the MOSFET's channel presents high anisotropy on Si (114), and this effect is enhanced by using an external magnetic field B, applied parallel to the Si (114) surface but perpendicular to the electron flow direction. This special configuration results in the channel electrons experiencing a Lorentzian force which pushes the electrons closer to the Si (114)-SiO{sub 2} interface and therefore to the special morphology of the Si (114) surface. Interestingly, Dit evaluation of n-type MOSFETs fabricated on Si (114) surfaces shows that the Si (114)-SiO{sub 2} interface is of high quality so that Dit as low as ∼10{sup 10 }cm{sup −2}·eV{sup −1} are obtained for MOSFETs with channels aligned at specific orientations. Additionally, using both a small positive Vds ≤ 100 mV and B = 6 μT, the former Dit is reduced by 35% in MOSFETs whose channels are aligned parallel to row-like nanostructures formed atop Si (114) surfaces (channels having a 90° rotation), whereas Dit is increased by 25% in MOSFETs whose channels are aligned perpendicular to these nanostructures (channels having a 0° rotation). From these results, the special morphology of a high-index Si (114) plane having nanochannels on its surface opens the possibility to reduce the electron-trapping characteristics of MOSFET devices having deep-submicron features and operating at very high frequencies.

  7. High-performance self-aligned inversion-channel In0.53Ga0.47As metal-oxide-semiconductor field-effect-transistors by in-situ atomic-layer-deposited HfO2

    NASA Astrophysics Data System (ADS)

    Lin, T. D.; Chang, W. H.; Chu, R. L.; Chang, Y. C.; Chang, Y. H.; Lee, M. Y.; Hong, P. F.; Chen, Min-Cheng; Kwo, J.; Hong, M.

    2013-12-01

    Self-aligned inversion-channel In0.53Ga0.47As metal-oxide-semiconductor field-effect-transistors (MOSFETs) have been fabricated using the gate dielectrics of in-situ directly atomic-layer-deposited (ALD) HfO2 followed by ALD-Al2O3. There were no surface pretreatments and no interfacial passivation/barrier layers prior to the ALD. TiN/Al2O3 (4 nm)/HfO2 (1 nm)/In0.53Ga0.47As/InP MOS capacitors exhibited well-behaved capacitance-voltage characteristics with true inversion behavior, low leakage current densities of ˜10-8 A/cm2 at ±1 MV/cm, and thermodynamic stability at high temperatures. Al2O3 (3 nm)/HfO2 (1 nm)/In0.53Ga0.47As MOSFETs of 1 μm gate length, with 700 °C-800 °C rapid thermal annealing in source/drain activation, have exhibited high extrinsic drain current (ID) of 1.5 mA/μm, transconductance (Gm) of 0.84 mS/μm, ION/IOFF of ˜104, low sub-threshold swing of 103 mV/decade, and field-effect electron mobility of 1100 cm2/V . s. The devices have also achieved very high intrinsic ID and Gm of 2 mA/μm and 1.2 mS/μm, respectively.

  8. Enhanced two dimensional electron gas transport characteristics in Al{sub 2}O{sub 3}/AlInN/GaN metal-oxide-semiconductor high-electron-mobility transistors on Si substrate

    SciTech Connect

    Freedsman, J. J. Watanabe, A.; Urayama, Y.; Egawa, T.

    2015-09-07

    The authors report on Al{sub 2}O{sub 3}/Al{sub 0.85}In{sub 0.15}N/GaN Metal-Oxide-Semiconductor High-Electron-Mobility Transistor (MOS-HEMT) on Si fabricated by using atomic layer deposited Al{sub 2}O{sub 3} as gate insulator and passivation layer. The MOS-HEMT with the gate length of 2 μm exhibits excellent direct-current (dc) characteristics with a drain current maximum of 1270 mA/mm at a gate bias of 3 V and an off-state breakdown voltage of 180 V for a gate-drain spacing of 4 μm. Also, the 1 μm-gate MOS-HEMT shows good radio-frequency (rf) response such as current gain and maximum oscillation cut-off frequencies of 10 and 34 GHz, respectively. The capacitance-voltage characteristics at 1 MHz revealed significant increase in two-dimensional electron gas (2DEG) density for the MOS-HEMT compared to conventional Schottky barrier HEMTs. Analyses using drain-source conductivity measurements showed improvements in 2DEG transport characteristics for the MOS-HEMT. The enhancements in dc and rf performances of the Al{sub 2}O{sub 3}/Al{sub 0.85}In{sub 0.15}N/GaN MOS-HEMT are attributed to the improvements in 2DEG characteristics.

  9. Hole injection and dielectric breakdown in 6H-SiC and 4H-SiC metal-oxide-semiconductor structures during substrate electron injection via Fowler-Nordheim tunneling

    NASA Astrophysics Data System (ADS)

    Samanta, Piyas; Mandal, Krishna C.

    2015-12-01

    Hole injection into silicon dioxide (SiO2) films (8-40 nm thick) is investigated for the first time during substrate electron injection via Fowler-Nordheim (FN) tunneling in n-type 4H- and 6H-SiC (silicon carbide) based metal-oxide-semiconductor (MOS) structures at a wide range of temperatures (T) between 298 and 598 K and oxide electric fields Eox from 6 to 10 MV/cm. Holes are generated in heavily doped n-type polycrystalline silicon (n+ -polySi) gate serving as the anode as well as in the bulk silicon dioxide (SiO2) film via hot-electron initiated band-to-band ionization (BTBI). In absence of oxide trapped charges, it is shown that at a given temperature, the hole injection rates from either of the above two mechanisms are higher in n-4H-SiC MOS devices than those in n-6H-SiC MOS structures when compared at a given Eox and SiO2 thickness (tox). On the other hand, relative to n-4H-SiC devices, n-6H-SiC structures exhibit higher hole injection rates for a given tox during substrate electron injection at a given FN current density je,FN throughout the temperature range studied here. These two observations clearly reveal that the substrate material (n-6H-SiC and n-4H-SiC) dependencies on time-to-breakdown (tBD) or injected charge (electron) to breakdown (QBD) of the SiO2 film depend on the mode of FN injections (constant field/voltage and current) from the substrate which is further verified from the rigorous device simulation as well.

  10. Ultraviolet GaN photodetectors on Si via oxide buffer heterostructures with integrated short period oxide-based distributed Bragg reflectors and leakage suppressing metal-oxide-semiconductor contacts

    SciTech Connect

    Szyszka, A. E-mail: adam.szyszka@pwr.wroc.pl; Haeberlen, M.; Storck, P.; Thapa, S. B.; Schroeder, T.

    2014-08-28

    Based on a novel double step oxide buffer heterostructure approach for GaN integration on Si, we present an optimized Metal-Semiconductor-Metal (MSM)-based Ultraviolet (UV) GaN photodetector system with integrated short-period (oxide/Si) Distributed Bragg Reflector (DBR) and leakage suppressing Metal-Oxide-Semiconductor (MOS) electrode contacts. In terms of structural properties, it is demonstrated by in-situ reflection high energy electron diffraction and transmission electron microscopy-energy dispersive x-ray studies that the DBR heterostructure layers grow with high thickness homogeneity and sharp interface structures sufficient for UV applications; only minor Si diffusion into the Y{sub 2}O{sub 3} films is detected under the applied thermal growth budget. As revealed by comparative high resolution x-ray diffraction studies on GaN/oxide buffer/Si systems with and without DBR systems, the final GaN layer structure quality is not significantly influenced by the growth of the integrated DBR heterostructure. In terms of optoelectronic properties, it is demonstrated that—with respect to the basic GaN/oxide/Si system without DBR—the insertion of (a) the DBR heterostructures and (b) dark current suppressing MOS contacts enhances the photoresponsivity below the GaN band-gap related UV cut-off energy by almost up to two orders of magnitude. Given the in-situ oxide passivation capability of grown GaN surfaces and the one order of magnitude lower number of superlattice layers in case of higher refractive index contrast (oxide/Si) systems with respect to classical III-N DBR superlattices, virtual GaN substrates on Si via functional oxide buffer systems are thus a promising robust approach for future GaN-based UV detector technologies.

  11. Ge{sub 0.83}Sn{sub 0.17} p-channel metal-oxide-semiconductor field-effect transistors: Impact of sulfur passivation on gate stack quality

    SciTech Connect

    Lei, Dian; Wang, Wei; Gong, Xiao E-mail: yeo@ieee.org; Liang, Gengchiau; Yeo, Yee-Chia E-mail: yeo@ieee.org; Zhang, Zheng; Pan, Jisheng; Tok, Eng-Soon

    2016-01-14

    The effect of room temperature sulfur passivation of the surface of Ge{sub 0.83}Sn{sub 0.17} prior to high-k dielectric (HfO{sub 2}) deposition is investigated. X-ray photoelectron spectroscopy (XPS) was used to examine the chemical bonding at the interface of HfO{sub 2} and Ge{sub 0.83}Sn{sub 0.17}. Sulfur passivation is found to be effective in suppressing the formation of both Ge oxides and Sn oxides. A comparison of XPS results for sulfur-passivated and non-passivated Ge{sub 0.83}Sn{sub 0.17} samples shows that sulfur passivation of the GeSn surface could also suppress the surface segregation of Sn atoms. In addition, sulfur passivation reduces the interface trap density D{sub it} at the high-k dielectric/Ge{sub 0.83}Sn{sub 0.17} interface from the valence band edge to the midgap of Ge{sub 0.83}Sn{sub 0.17}, as compared with a non-passivated control. The impact of the improved D{sub it} is demonstrated in Ge{sub 0.83}Sn{sub 0.17} p-channel metal-oxide-semiconductor field-effect transistors (p-MOSFETs). Ge{sub 0.83}Sn{sub 0.17} p-MOSFETs with sulfur passivation show improved subthreshold swing S, intrinsic transconductance G{sub m,int}, and effective hole mobility μ{sub eff} as compared with the non-passivated control. At a high inversion carrier density N{sub inv} of 1 × 10{sup 13 }cm{sup −2}, sulfur passivation increases μ{sub eff} by 25% in Ge{sub 0.83}Sn{sub 0.17} p-MOSFETs.

  12. Aptamer/Au nanoparticles/cobalt sulfide nanosheets biosensor for 17β-estradiol detection using a guanine-rich complementary DNA sequence for signal amplification.

    PubMed

    Huang, Ke-Jing; Liu, Yu-Jie; Zhang, Ji-Zong; Cao, Jun-Tao; Liu, Yan-Ming

    2015-05-15

    We have developed a sensitive sensing platform for 17β-estradiol by combining the aptamer probe and hybridization reaction. In this assay, 2-dimensional cobalt sulfide nanosheet (CoS) was synthesized by a simple hydrothermal method with L-cysteine as sulfur donor. An electrochemical aptamer biosensor was constructed by assembling a thiol group tagged 17β-estradiol aptamer on CoS and gold nanoparticles (AuNPs) modified electrode. Methylene blue was applied as a tracer and a guanine-rich complementary DNA sequence was designed to bind with the unbound 17β-estradiol aptamer for signal amplification. The binding of guanine-rich DNA to the aptamer was inhibited when the aptamer captured 17β-estradiol. Using guanine-rich DNA in the assay greatly amplified the redox signal of methylene blue bound to the detection probe. The CoS/AuNPs film formed on the biosensor surface appeared to be a good conductor for accelerating the electron transfer. The method demonstrated a high sensitivity of detection with the dynamic concentration range spanning from 1.0×10(-9) to 1.0×10(-12) M and a detection limit of 7.0×10(-13) M. Besides, the fabricated biosensor exhibited good selectivity toward 17β-estradiol even when interferents were presented at 100-fold concentrations. Our attempt will extend the application of the CoS nanosheet and this signal amplification assay to biosensing areas. Copyright © 2014 Elsevier B.V. All rights reserved.

  13. Metal oxide semiconductors for dye degradation

    SciTech Connect

    Adhikari, Sangeeta; Sarkar, Debasish

    2015-12-15

    Highlights: • Hydrothermal synthesis of monoclinic and hexagonal WO{sub 3} nanostructures. • Nanocuboid and nanofiber growth using different structure directing agents. • WO{sub 3}–ZnO nanocomposites for dye degradation under UV and visible light. • High photocatalytic efficiency is achieved by 10 wt% monoclinic WO{sub 3}. • WO{sub 3} assists to trap hole in UV and arrests electron in visible light irradiation. - Abstract: Organic contaminants are a growing threat to the environment that widely demands their degradation by high efficient photocatalysts. Thus, the proposed research work primely focuses on the efficient degradation of methyl orange using designed WO{sub 3}–ZnO photocatalysts under both UV and visible light irradiation. Two different sets of WO{sub 3} nanostructures namely, monoclinic WO{sub 3} (m-WO{sub 3}) and hexagonal WO{sub 3} (h-WO{sub 3}) synthesizes in presence of a different structure directing agents. A specific dispersion technique allows the intimate contact of as-synthesized WO{sub 3} and ultra-violet active commercial ZnO photocatalyst in different weight variations. ZnO nanocrystal in presence of an optimum 10 wt% m-WO{sub 3} shows a high degree of photocatalytic activity under both UV and visible light irradiation compared to counterpart h-WO{sub 3}. Symmetrical monoclinic WO{sub 3} assists to trap hole in UV, but electron arresting mechanism predominates in visible irradiation. Coupling of monoclinic nanocuboid WO{sub 3} with ZnO proves to be a promising photocatalyst in both wavelengths.

  14. Parasitic analysis and π-type Butterworth-Van Dyke model for complementary-metal-oxide-semiconductor Lamb wave resonator with accurate two-port Y-parameter characterizations

    NASA Astrophysics Data System (ADS)

    Wang, Yong; Goh, Wang Ling; Chai, Kevin T.-C.; Mu, Xiaojing; Hong, Yan; Kropelnicki, Piotr; Je, Minkyu

    2016-04-01

    The parasitic effects from electromechanical resonance, coupling, and substrate losses were collected to derive a new two-port equivalent-circuit model for Lamb wave resonators, especially for those fabricated on silicon technology. The proposed model is a hybrid π-type Butterworth-Van Dyke (PiBVD) model that accounts for the above mentioned parasitic effects which are commonly observed in Lamb-wave resonators. It is a combination of interdigital capacitor of both plate capacitance and fringe capacitance, interdigital resistance, Ohmic losses in substrate, and the acoustic motional behavior of typical Modified Butterworth-Van Dyke (MBVD) model. In the case studies presented in this paper using two-port Y-parameters, the PiBVD model fitted significantly better than the typical MBVD model, strengthening the capability on characterizing both magnitude and phase of either Y11 or Y21. The accurate modelling on two-port Y-parameters makes the PiBVD model beneficial in the characterization of Lamb-wave resonators, providing accurate simulation to Lamb-wave resonators and oscillators.

  15. Parasitic analysis and π-type Butterworth-Van Dyke model for complementary-metal-oxide-semiconductor Lamb wave resonator with accurate two-port Y-parameter characterizations.

    PubMed

    Wang, Yong; Goh, Wang Ling; Chai, Kevin T-C; Mu, Xiaojing; Hong, Yan; Kropelnicki, Piotr; Je, Minkyu

    2016-04-01

    The parasitic effects from electromechanical resonance, coupling, and substrate losses were collected to derive a new two-port equivalent-circuit model for Lamb wave resonators, especially for those fabricated on silicon technology. The proposed model is a hybrid π-type Butterworth-Van Dyke (PiBVD) model that accounts for the above mentioned parasitic effects which are commonly observed in Lamb-wave resonators. It is a combination of interdigital capacitor of both plate capacitance and fringe capacitance, interdigital resistance, Ohmic losses in substrate, and the acoustic motional behavior of typical Modified Butterworth-Van Dyke (MBVD) model. In the case studies presented in this paper using two-port Y-parameters, the PiBVD model fitted significantly better than the typical MBVD model, strengthening the capability on characterizing both magnitude and phase of either Y11 or Y21. The accurate modelling on two-port Y-parameters makes the PiBVD model beneficial in the characterization of Lamb-wave resonators, providing accurate simulation to Lamb-wave resonators and oscillators.

  16. Functionalization and Characterization of Nanomaterial Gated Field-Effect Transistor-Based Biosensors and the Design of a Multi-Analyte Implantable Biosensing Platform

    NASA Astrophysics Data System (ADS)

    Croce, Robert A., Jr.

    Advances in semiconductor research and complementary-metal-oxide semiconductor fabrication allow for the design and implementation of miniaturized metabolic monitoring systems, as well as advanced biosensor design. The first part of this dissertation will focus on the design and fabrication of nanomaterial (single-walled carbon nanotube and quantum dot) gated field-effect transistors configured as protein sensors. These novel device structures have been functionalized with single-stranded DNA aptamers, and have shown sensor operation towards the protein Thrombin. Such advanced transistor-based sensing schemes present considerable advantages over traditional sensing methodologies in view of its miniaturization, low cost, and facile fabrication, paving the way for the ultimate realization of a multi-analyte lab-on-chip. The second part of this dissertation focuses on the design and fabrication of a needle-implantable glucose sensing platform which is based solely on photovoltaic powering and optical communication. By employing these powering and communication schemes, this design negates the need for bulky on-chip RF-based transmitters and batteries in an effort to attain extreme miniaturization required for needle-implantable/extractable applications. A complete single-sensor system coupled with a miniaturized amperometric glucose sensor has been demonstrated to exhibit reality of this technology. Furthermore, an optical selection scheme of multiple potentiostats for four different analytes (glucose, lactate, O 2 and CO2) as well as the optical transmission of sensor data has been designed for multi-analyte applications. The last part of this dissertation will focus on the development of a computational model for the amperometric glucose sensors employed in the aforementioned implantable platform. This model has been applied to single-layer single-enzyme systems, as well as multi-layer (single enzyme) systems utilizing glucose flux limiting layer-by-layer assembled

  17. Gate-Leakage and Carrier-Transport Mechanisms for Plasma-PH3 Passivated InGaAs N-Channel Metal-Oxide-Semiconductor Field-Effect Transistors

    NASA Astrophysics Data System (ADS)

    Azzah Bte Suleiman, Sumarlina; Lee, Sungjoo

    2012-02-01

    Gate leakage mechanism of the HfAlO plasma-PH3 passivated and non-passivated In0.53Ga0.47As N-channel metal-oxide-semiconductor field-effect transistors (N-MOSFETs) have been evaluated, in order to correlate the quality of the oxide deposited with the gate leakage mechanisms observed. At temperatures higher than 300 K, trap-free space charge limited conduction (SCLC) mechanism dominates the gate leakage of passivated device but non-passivated device consists of exponentially distributed SCLC mechanism at low electric field and Frenkel-Poole emission at high electric field. This Frenkel-Poole emission is associated with energy trap levels of ˜0.95 to 1.3 eV and is responsible for the increased gate leakage of non-passivated device. In addition, the electrical properties of the non-passivated device has also been extracted from the SCLC mechanism, with the average trap concentration of the shallow traps given as 1.3×1019 cm-3 and the average activation energy given as ˜0.22 to 0.27 eV. The existence of these defect levels in non-passivated device can be attributed to the interdiffusion of Ga/As/O elements across the HfAlO/In0.53Ga0.47As interface. On the other hand, passivated device does not contain Frenkel-Poole emission nor exponentially distributed SCLC mechanism, indicating a reduction in traps in the bulk of the oxide. In addition, the temperature dependent characteristics of off-state leakage have also been evaluated to provide insight into the off-state mechanism. The off-state leakage of both passivated and non-passivated device is determined by junction leakage, with Shockley-Read-Hall mechanism being its main contributor, and has activation energy of 0.38 eV for passivated device and 0.4 eV for non-passivated device. From Id∝T-0.37 observed for passivated device, in comparison to Id∝T-0.18 for non-passivated device, we have further confirmed the phonon scattering dominance of the passivated device at high electric field.

  18. Gate-Leakage and Carrier-Transport Mechanisms for Plasma-PH3 Passivated InGaAs N-Channel Metal--Oxide--Semiconductor Field-Effect Transistors

    NASA Astrophysics Data System (ADS)

    Suleiman, Sumarlina Azzah Bte; Lee, Sungjoo

    2012-02-01

    Gate leakage mechanism of the HfAlO plasma-PH3 passivated and non-passivated In0.53Ga0.47As N-channel metal--oxide--semiconductor field-effect transistors (N-MOSFETs) have been evaluated, in order to correlate the quality of the oxide deposited with the gate leakage mechanisms observed. At temperatures higher than 300 K, trap-free space charge limited conduction (SCLC) mechanism dominates the gate leakage of passivated device but non-passivated device consists of exponentially distributed SCLC mechanism at low electric field and Frenkel--Poole emission at high electric field. This Frenkel--Poole emission is associated with energy trap levels of ˜0.95 to 1.3 eV and is responsible for the increased gate leakage of non-passivated device. In addition, the electrical properties of the non-passivated device has also been extracted from the SCLC mechanism, with the average trap concentration of the shallow traps given as 1.3× 1019 cm-3 and the average activation energy given as ˜0.22 to 0.27 eV. The existence of these defect levels in non-passivated device can be attributed to the interdiffusion of Ga/As/O elements across the HfAlO/In0.53Ga0.47As interface. On the other hand, passivated device does not contain Frenkel--Poole emission nor exponentially distributed SCLC mechanism, indicating a reduction in traps in the bulk of the oxide. In addition, the temperature dependent characteristics of off-state leakage have also been evaluated to provide insight into the off-state mechanism. The off-state leakage of both passivated and non-passivated device is determined by junction leakage, with Shockley--Read--Hall mechanism being its main contributor, and has activation energy of 0.38 eV for passivated device and 0.4 eV for non-passivated device. From Id\\propto T-0.37 observed for passivated device, in comparison to Id\\propto T-0.18 for non-passivated device, we have further confirmed the phonon scattering dominance of the passivated device at high electric field.

  19. Interfacial band configuration and electrical properties of LaAlO{sub 3}/Al{sub 2}O{sub 3}/hydrogenated-diamond metal-oxide-semiconductor field effect transistors

    SciTech Connect

    Liu, J. W.; Liao, M. Y.; Imura, M.; Oosato, H.; Watanabe, E.; Tanaka, A.; Iwai, H.; Koide, Y.

    2013-08-28

    In order to search a gate dielectric with high permittivity on hydrogenated-diamond (H-diamond), LaAlO{sub 3} films with thin Al{sub 2}O{sub 3} buffer layers are fabricated on the H-diamond epilayers by sputtering-deposition (SD) and atomic layer deposition (ALD) techniques, respectively. Interfacial band configuration and electrical properties of the SD-LaAlO{sub 3}/ALD-Al{sub 2}O{sub 3}/H-diamond metal-oxide-semiconductor field effect transistors (MOSFETs) with gate lengths of 10, 20, and 30 μm have been investigated. The valence and conduction band offsets of the SD-LaAlO{sub 3}/ALD-Al{sub 2}O{sub 3} structure are measured by X-ray photoelectron spectroscopy to be 1.1 ± 0.2 and 1.6 ± 0.2 eV, respectively. The valence band discontinuity between H-diamond and LaAlO{sub 3} is evaluated to be 4.0 ± 0.2 eV, showing that the MOS structure acts as the gate which controls a hole carrier density. The leakage current density of the SD-LaAlO{sub 3}/ALD-Al{sub 2}O{sub 3}/H-diamond MOS diode is smaller than 10{sup −8} A cm{sup −2} at gate bias from −4 to 2 V. The capacitance-voltage curve in the depletion mode shows sharp dependence, small flat band voltage, and small hysteresis shift, which implies low positive and trapped charge densities. The MOSFETs show p-type channel and complete normally off characteristics with threshold voltages changing from −3.6 ± 0.1 to −5.0 ± 0.1 V dependent on the gate length. The drain current maximum and the extrinsic transconductance of the MOSFET with gate length of 10 μm are −7.5 mA mm{sup −1} and 2.3 ± 0.1 mS mm{sup −1}, respectively. The enhancement mode SD-LaAlO{sub 3}/ALD-Al{sub 2}O{sub 3}/H-diamond MOSFET is concluded to be suitable for the applications of high power and high frequency electrical devices.

  20. Subnanowatt carbon nanotube complementary logic enabled by threshold voltage control.

    PubMed

    Geier, Michael L; Prabhumirashi, Pradyumna L; McMorrow, Julian J; Xu, Weichao; Seo, Jung-Woo T; Everaerts, Ken; Kim, Chris H; Marks, Tobin J; Hersam, Mark C

    2013-10-09

    In this Letter, we demonstrate thin-film single-walled carbon nanotube (SWCNT) complementary metal-oxide-semiconductor (CMOS) logic devices with subnanowatt static power consumption and full rail-to-rail voltage transfer characteristics as is required for logic gate cascading. These results are enabled by a local metal gate structure that achieves enhancement-mode p-type and n-type SWCNT thin-film transistors (TFTs) with widely separated and symmetric threshold voltages. These complementary SWCNT TFTs are integrated to demonstrate CMOS inverter, NAND, and NOR logic gates at supply voltages as low as 0.8 V with ideal rail-to-rail operation, subnanowatt static power consumption, high gain, and excellent noise immunity. This work provides a direct pathway for solution processable, large area, power efficient SWCNT advanced logic circuits and systems.

  1. A molybdenum disulfide/carbon nanotube heterogeneous complementary inverter.

    PubMed

    Huang, Jun; Somu, Sivasubramanian; Busnaina, Ahmed

    2012-08-24

    We report a simple, bottom-up/top-down approach for integrating drastically different nanoscale building blocks to form a heterogeneous complementary inverter circuit based on layered molybdenum disulfide and carbon nanotube (CNT) bundles. The fabricated CNT/MoS(2) inverter is composed of n-type molybdenum disulfide (MOS(2)) and p-type CNT transistors, with a high voltage gain of 1.3. The CNT channels are fabricated using directed assembly while the layered molybdenum disulfide channels are fabricated by mechanical exfoliation. This bottom-up fabrication approach for integrating various nanoscale elements with unique characteristics provides an alternative cost-effective methodology to complementary metal-oxide-semiconductors, laying the foundation for the realization of high performance logic circuits.

  2. Scaling carbon nanotube complementary transistors to 5-nm gate lengths

    NASA Astrophysics Data System (ADS)

    Qiu, Chenguang; Zhang, Zhiyong; Xiao, Mengmeng; Yang, Yingjun; Zhong, Donglai; Peng, Lian-Mao

    2017-01-01

    High-performance top-gated carbon nanotube field-effect transistors (CNT FETs) with a gate length of 5 nanometers can be fabricated that perform better than silicon complementary metal-oxide semiconductor (CMOS) FETs at the same scale. A scaling trend study revealed that the scaled CNT-based devices, which use graphene contacts, can operate much faster and at much lower supply voltage (0.4 versus 0.7 volts) and with much smaller subthreshold slope (typically 73 millivolts per decade). The 5-nanometer CNT FETs approached the quantum limit of FETs by using only one electron per switching operation. In addition, the contact length of the CNT CMOS devices was also scaled down to 25 nanometers, and a CMOS inverter with a total pitch size of 240 nanometers was also demonstrated.

  3. Random depth access full-field heterodyne low-coherence interferometry utilizing acousto-optic modulation and a complementary metaloxide semiconductor camera.

    PubMed

    Egan, Patrick; Connelly, Michael J; Lakestani, Fereydoun; Whelan, Maurice P

    2006-04-01

    With analog scanning, time-domain low-coherence interferometry lacks precise depth information, and optical carrier generation demands a linear scanning speed. Full-field heterodyne low-coherence interferometry that uses a logarithmic complementary metal-oxide semiconductor camera, acousto-optic modulation, and digital depth stepping is reported, with which random regions of interest, lateral and axial, can be accessed. Furthermore, nanometer profilometry is possible through heterodyne phase retrieval of the interference signal. The approach demonstrates inexpensive yet high-precision functional machine vision offering true digital random access in three dimensions.

  4. Investigation of dielectric modulated (DM) double gate (DG) junctionless MOSFETs for application as a biosensors

    NASA Astrophysics Data System (ADS)

    Ajay; Narang, Rakhi; Saxena, Manoj; Gupta, Mridula

    2015-09-01

    In this paper, an analytical model for Junctionless (JL) Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET) based biosensor for label free electrical detection of biomolecules like enzyme, cell, DNA etc. using the Dielectric Modulation (DM) technique has been developed. The analytical results are validated with the help of "Sentaurus" device simulation software. For the biomolecule immobilization, nanogap cavity is formed in the JL MOSFET by etching gate oxide layer from both source as well as drain end of the channel. As a result, the surface potential in the channel underneath the nanogap cavity region is affected by the neutral and charged biomolecules that binds to SiO2 adhesion layer in the cavity. The surface potential solution is obtained by solving a 2-D Poisson's equation assuming parabolic potential profile in the channel. The shift in threshold voltage and drain current of the device has been considered as the sensing metric for detection of biomolecules under dry environment condition.

  5. L{sub g} = 100 nm In{sub 0.7}Ga{sub 0.3}As quantum well metal-oxide semiconductor field-effect transistors with atomic layer deposited beryllium oxide as interfacial layer

    SciTech Connect

    Koh, D. E-mail: Taewoo.Kim@sematech.org; Kwon, H. M.; Kim, T.-W. E-mail: Taewoo.Kim@sematech.org; Veksler, D.; Gilmer, D.; Kirsch, P. D.; Kim, D.-H.; Hudnall, Todd W.; Bielawski, Christopher W.; Maszara, W.; Banerjee, S. K.

    2014-04-21

    In this study, we have fabricated nanometer-scale channel length quantum-well (QW) metal-oxide-semiconductor field effect transistors (MOSFETs) incorporating beryllium oxide (BeO) as an interfacial layer. BeO has high thermal stability, excellent electrical insulating characteristics, and a large band-gap, which make it an attractive candidate for use as a gate dielectric in making MOSFETs. BeO can also act as a good diffusion barrier to oxygen owing to its small atomic bonding length. In this work, we have fabricated In{sub 0.53}Ga{sub 0.47}As MOS capacitors with BeO and Al{sub 2}O{sub 3} and compared their electrical characteristics. As interface passivation layer, BeO/HfO{sub 2} bilayer gate stack presented effective oxide thickness less 1 nm. Furthermore, we have demonstrated In{sub 0.7}Ga{sub 0.3}As QW MOSFETs with a BeO/HfO{sub 2} dielectric, showing a sub-threshold slope of 100 mV/dec, and a transconductance (g{sub m,max}) of 1.1 mS/μm, while displaying low values of gate leakage current. These results highlight the potential of atomic layer deposited BeO for use as a gate dielectric or interface passivation layer for III–V MOSFETs at the 7 nm technology node and/or beyond.

  6. Passivation of GaSb using molecular beam epitaxy Y{sub 2}O{sub 3} to achieve low interfacial trap density and high-performance self-aligned inversion-channel p-metal-oxide-semiconductor field-effect-transistors

    SciTech Connect

    Chu, R. L.; Chiang, T. H.; Hsueh, W. J.; Chyi, J. I.; Chen, K. H.; Lin, K. Y.; Hong, M. E-mail: mhong@phys.ntu.edu.tw; Brown, G. J.; Kwo, J. E-mail: mhong@phys.ntu.edu.tw

    2014-11-03

    Molecular beam epitaxy deposited rare-earth oxide of Y{sub 2}O{sub 3} has effectively passivated GaSb, leading to low interfacial trap densities of (1–4) × 10{sup 12 }cm{sup −2} eV{sup −1} across the energy bandgap of GaSb. A high saturation drain current density of 130 μA/μm, a peak transconductance of 90 μS/μm, a low subthreshold slope of 147 mV/decade, and a peak field-effect hole mobility of 200 cm{sup 2}/V-s were obtained in 1 μm-gate-length self-aligned inversion-channel GaSb p-Metal-Oxide-Semiconductor Field-Effect-Transistors (MOSFETs). In this work, high-κ/GaSb interfacial properties were better in samples with a high substrate temperature of 200 °C than in those with high κ's deposited at room temperature, in terms of the interfacial electrical properties, particularly, the reduction of interfacial trap densities near the conduction band and the MOSFET device performance.

  7. A commercial MOSFET-based biosensor with a gold extended gate electrode

    NASA Astrophysics Data System (ADS)

    Lyu, Hong-Kun; Choi, Young-Sam; Shin, Jang-Kyoo; Kim, Jae-Hyun

    2009-05-01

    This paper presents a commercial metal-oxide-semiconductor field-effect transistor (MOSFET)-based biosensor with a gold extended-gate electrode for the electronic detection of C-reactive protein (CRP). From a component point of view, the commercial MOSFET-based biosensor consists of a commercial MOSFET with a socket for connecting the gold electrode which was fixed on a printed circuit board (PCB) and a reaction-vessel module which was assembled with the gold electrode and the Ag/AgCl reference electrode. The gold electrode with only one gold layer was fabricated on a glass substrate simply and it was used as the extended-gate metal to form a self-assembled monolayer (SAM). The binding of the CRP to anti-CRP was detected by measuring the electrical characteristics of the biosensor. Variation of the drain current before and after the interaction of CRP and anti-CRP was about 1.2mA on the measured IDS-VDS and real-time characteristics. The concentration of the CRP solution was adjusted to 10μg/ml by dissolving in PBS. The change of surface voltage of the gold extended-gate electrode was about 30mV by IDS-VGS characteristic curve of the commercial MOSFET. Therefore, it is confirmed that the detection of CRP is possible by measuring the drain current of the commercial MOSFET. The proposed biosensor might open up a new possibility for FET-based biosensors with lowcost and simple construction. It is expected that the commercial MOSFET-based biosensor with the gold extended-gate electrode could also be used for detecting various biomarkers by modifying the surface of the gold extended-gate electrode.

  8. High-performance carbon-nanotube-based complementary field-effect-transistors and integrated circuits with yttrium oxide

    SciTech Connect

    Liang, Shibo; Zhang, Zhiyong Si, Jia; Zhong, Donglai; Peng, Lian-Mao

    2014-08-11

    High-performance p-type carbon nanotube (CNT) transistors utilizing yttrium oxide as gate dielectric are presented by optimizing oxidization and annealing processes. Complementary metal-oxide-semiconductor (CMOS) field-effect-transistors (FETs) are then fabricated on CNTs, and the p- and n-type devices exhibit symmetrical high performances, especially with low threshold voltage near to zero. The corresponding CMOS CNT inverter is demonstrated to operate at an ultra-low supply voltage down to 0.2 V, while displaying sufficient voltage gain, high noise margin, and low power consumption. Yttrium oxide is proven to be a competitive gate dielectric for constructing high-performance CNT CMOS FETs and integrated circuits.

  9. Biosensor commercialization strategy - a theoretical approach.

    PubMed

    Lin, Chin-Tsai; Wang, Su-Man

    2005-01-01

    Biosensors are analytical devices, which use biological interactions to provide either qualitative or quantitative results. They are extensively employed in many fields such as clinical diagnosis and biomedicine, military applications, anti-terrorism, farm, garden and veterinary analysis, process control, fermentation control and analysis, pharmaceutical and drug analysis, food and drink production and analysis, pollution control and monitoring, microbiology, bacterial and viral analysis, mining, and industrial and toxic gases. The biosensor market has significantly increased and will be mushrooming in the next decade. The total biosensor market is estimated to be 10.8 billion dollars by 2007. The emerging biosensor market presents both opportunities and obstacles to start-up biosensor entrepreneurs. The major challenge and threat for these entrepreneurs is how to predict the biosensor market and how to convert promising biosensor technology into commercialized biosensors. By adopting a simple commercialization strategy framework, we identify two key elements of biosensor commercialization strategy: excludability and complementary asset. We further divide biosensor commercialization environments into four distinct sub-environments: the Attacker's Advantage, Reputation-Based Idea Trading, Greenfield Competition and Ideas Factories. This paper explains how the interaction between these two key elements shapes biosensor commercialization strategy and biosensor industry dynamics. This paper also discusses alternative commercialization strategies for each specific commercialization environment and how to choose from these alternatives. The analysis of this study further provides a good reference for start-up biosensor entrepreneurs to formulate effective biosensor commercialization strategy.

  10. Wireless Charge Based Capacitance Measurement Circuits with On-Chip Spiral Inductor for Radio Frequency Identification Biosensor

    NASA Astrophysics Data System (ADS)

    Kim, Boram; Uno, Shigeyasu; Nakazato, Kazuo

    2012-04-01

    A wireless measuring system of charge based capacitance measurement (CBCM) circuit has been designed and demonstrated for biomedical applications. The radio frequency identification (RFID) chip that includes on-chip spiral inductor tag antenna, and RFID circuit, and CBCM sensor chip are fabricated within standard complementary metal oxide semiconductor (CMOS) process. The capacitance change caused by DNA detection can be converted into the voltage output using capacitance-to-voltage conversion circuit. To confirm the transmission of the capacitance, the poly-capacitor of fixed capacitance and on-chip spiral inductor tag antenna were fabricated using 1.2 µm, 2-metal, 2-poly CMOS technology. As a result of measurement, three different capacitances (34, 141, 564 fF) were detected wirelessly.

  11. Self-aligned inversion n-channel In 0.2Ga 0.8As/GaAs metal-oxide-semiconductor field-effect-transistors with TiN gate and Ga 2O 3(Gd 2O 3) dielectric

    NASA Astrophysics Data System (ADS)

    Chen, C. P.; Lin, T. D.; Lee, Y. J.; Chang, Y. C.; Hong, M.; Kwo, J.

    2008-10-01

    A self-aligned process for fabricating inversion n-channel metal-oxide-semiconductor field-effect-transistors (MOSFET's) of strained In 0.2Ga 0.8As on GaAs using TiN as gate metal and Ga 2O 3(Gd 2O 3) as high κ gate dielectric has been developed. A MOSFET with a 4 μm gate length and a 100 μm gate width exhibits a drain current of 1.5 mA/mm at Vg = 4 V and Vd = 2 V, a low gate leakage of <10 -7 A/cm 2 at 1 MV/cm, an extrinsic transconductance of 1.7 mS/mm at Vg = 3 V, Vd = 2 V, and an on/off ratio of ˜10 5 in drain current. For comparison, a TiN/Ga 2O 3(Gd 2O 3)/In 0.2Ga 0.8As MOS diode after rapid thermal annealing (RTA) to high temperatures of 750 °C exhibits excellent electrical and structural performances: a low leakage current density of 10 -8-10 -9 A/cm 2, well-behaved capacitance-voltage ( C- V) characteristics giving a high dielectric constant of ˜16 and a low interfacial density of state of ˜(2˜6) × 10 11 cm -2 eV -1, and an atomically sharp smooth Ga 2O 3(Gd 2O 3)/In 0.2Ga 0.8As interface.

  12. Optical biosensors.

    PubMed

    Damborský, Pavel; Švitel, Juraj; Katrlík, Jaroslav

    2016-06-30

    Optical biosensors represent the most common type of biosensor. Here we provide a brief classification, a description of underlying principles of operation and their bioanalytical applications. The main focus is placed on the most widely used optical biosensors which are surface plasmon resonance (SPR)-based biosensors including SPR imaging and localized SPR. In addition, other optical biosensor systems are described, such as evanescent wave fluorescence and bioluminescent optical fibre biosensors, as well as interferometric, ellipsometric and reflectometric interference spectroscopy and surface-enhanced Raman scattering biosensors. The optical biosensors discussed here allow the sensitive and selective detection of a wide range of analytes including viruses, toxins, drugs, antibodies, tumour biomarkers and tumour cells. © 2016 The Author(s). Published by Portland Press Limited on behalf of the Biochemical Society.

  13. Optical biosensors

    PubMed Central

    Damborský, Pavel; Švitel, Juraj

    2016-01-01

    Optical biosensors represent the most common type of biosensor. Here we provide a brief classification, a description of underlying principles of operation and their bioanalytical applications. The main focus is placed on the most widely used optical biosensors which are surface plasmon resonance (SPR)-based biosensors including SPR imaging and localized SPR. In addition, other optical biosensor systems are described, such as evanescent wave fluorescence and bioluminescent optical fibre biosensors, as well as interferometric, ellipsometric and reflectometric interference spectroscopy and surface-enhanced Raman scattering biosensors. The optical biosensors discussed here allow the sensitive and selective detection of a wide range of analytes including viruses, toxins, drugs, antibodies, tumour biomarkers and tumour cells. PMID:27365039

  14. Metal oxide semiconductors in PEC splitting of water

    NASA Astrophysics Data System (ADS)

    Satsangi, Vibha R.

    2007-09-01

    With hydrogen being accepted as fuel for the future, the world is looking forward to development of clean and sustainable methods of its production from renewable energy. In this context, area of research in the PEC splitting of water assumes great significance and the challenge is to develop corrosion resistant, chemically stable semiconductor that absorbs sunlight in the visible region and also has the band edges matching to the redox level of water. The advent of nanotechnology has opened new vistas in the production of semiconductor with large surface area for solar energy absorption and other favourable properties, which has lead to restudy the old workhorses, viz α-Fe IIO 3 and TiO II in the PEC splitting of water. This communication reports the study on metal oxides, towards the photoelectrochemical splitting of water as function of material properties and characteristics of semiconductor- electrolyte junction, viz; particle size, suitable dopants, crystalline phase, surface morphology, resistivity, bandgap, donor density and flatband potential. Effect of sensitizers and surface modification has also been investigated. Both the techniques of surface modification: (i) depositing metal dots and (ii) swift heavy ion irradiation in α-Fe IIO 3 were observed to be much effective in improving the photoresponse of the material. α-Fe IIO 3 thin films prepared using spray pyrolysis having Zn dots (dot height: 260 Å) on its surface exhibited the best of photocurrent density (1.82 mA/cm2), at 0.6 V applied bias. Nitrogen doped nanostructured TiO II prepared by sol gel method exhibited much better photoresponse as compared to any other dopant.

  15. Complimentary Metal Oxide Semiconductor (CMOS)-Memristor Hybrid Nanoelectronics

    DTIC Science & Technology

    2011-06-01

    N+ N+ M1M1 P+ N- P- P N+ N M1M1 (d) TEOS open (e) SiN open with TEOS as hardmask (f) Oxidation N-Well P-Well P P+ N N+ M1M1 P+ N-Well P-Well P N...N+ M1M1 P+ N- P- P N+ N M1M1 (d) TEOS open (e) SiN open with TEOS as hardmask (f) Oxidation N-Well P-Well P+ P+ N+ N+ M1M1 N-Well P-Well P+ P+ N

  16. Impact of La{sub 2}O{sub 3} interfacial layers on InGaAs metal-oxide-semiconductor interface properties in Al{sub 2}O{sub 3}/La{sub 2}O{sub 3}/InGaAs gate stacks deposited by atomic-layer-deposition

    SciTech Connect

    Chang, C.-Y. Takenaka, M.; Takagi, S.; Ichikawa, O.; Osada, T.; Hata, M.; Yamada, H.

    2015-08-28

    We examine the electrical properties of atomic layer deposition (ALD) La{sub 2}O{sub 3}/InGaAs and Al{sub 2}O{sub 3}/La{sub 2}O{sub 3}/InGaAs metal-oxide-semiconductor (MOS) capacitors. It is found that the thick ALD La{sub 2}O{sub 3}/InGaAs interface provides low interface state density (D{sub it}) with the minimum value of ∼3 × 10{sup 11} cm{sup −2} eV{sup −1}, which is attributable to the excellent La{sub 2}O{sub 3} passivation effect for InGaAs surfaces. It is observed, on the other hand, that there are a large amount of slow traps and border traps in La{sub 2}O{sub 3}. In order to simultaneously satisfy low D{sub it} and small hysteresis, the effectiveness of Al{sub 2}O{sub 3}/La{sub 2}O{sub 3}/InGaAs gate stacks with ultrathin La{sub 2}O{sub 3} interfacial layers is in addition evaluated. The reduction of the La{sub 2}O{sub 3} thickness to 0.4 nm in Al{sub 2}O{sub 3}/La{sub 2}O{sub 3}/InGaAs gate stacks leads to the decrease in hysteresis. On the other hand, D{sub it} of the Al{sub 2}O{sub 3}/La{sub 2}O{sub 3}/InGaAs interfaces becomes higher than that of the La{sub 2}O{sub 3}/InGaAs ones, attributable to the diffusion of Al{sub 2}O{sub 3} through La{sub 2}O{sub 3} into InGaAs and resulting modification of the La{sub 2}O{sub 3}/InGaAs interface structure. As a result of the effective passivation effect of La{sub 2}O{sub 3} on InGaAs, however, the Al{sub 2}O{sub 3}/10 cycle (0.4 nm) La{sub 2}O{sub 3}/InGaAs gate stacks can realize still lower D{sub it} with maintaining small hysteresis and low leakage current than the conventional Al{sub 2}O{sub 3}/InGaAs MOS interfaces.

  17. High-throughput impedance spectroscopy biosensor array chip.

    PubMed

    Liu, Xiaowen; Li, Lin; Mason, Andrew J

    2014-03-28

    Impedance spectroscopy is a powerful tool for characterizing materials that exhibit a frequency dependent behaviour to an applied electric field. This paper introduces a fully integrated multi-channel impedance extraction circuit that can both generate AC stimulus signals over a broad frequency range and also measure and digitize the real and imaginary components of the impedance response. The circuit was fabricated in a 0.5 μm complementary metal-oxide semiconductor. Tailored for cellular membrane interface characterization, the signal generator produces sinusoidal waves from 10 mHz to 10 kHz. To suit a variety of applications, the impedance extraction circuit provides a programmable current measurement range from 100 pA to 100 nA with a measured resolution of approximately 100 fA. Occupying only 0.045 mm(2) per measurement channel, the circuit is compact enough to include nearly 200 channels in a 3×3 mm(2) die area.

  18. A high-performance complementary inverter based on transition metal dichalcogenide field-effect transistors.

    PubMed

    Cho, Ah-Jin; Park, Kee Chan; Kwon, Jang-Yeon

    2015-01-01

    For several years, graphene has been the focus of much attention due to its peculiar characteristics, and it is now considered to be a representative 2-dimensional (2D) material. Even though many research groups have studied on the graphene, its intrinsic nature of a zero band-gap, limits its use in practical applications, particularly in logic circuits. Recently, transition metal dichalcogenides (TMDs), which are another type of 2D material, have drawn attention due to the advantage of having a sizable band-gap and a high mobility. Here, we report on the design of a complementary inverter, one of the most basic logic elements, which is based on a MoS2 n-type transistor and a WSe2 p-type transistor. The advantages provided by the complementary metal-oxide-semiconductor (CMOS) configuration and the high-performance TMD channels allow us to fabricate a TMD complementary inverter that has a high-gain of 13.7. This work demonstrates the operation of the MoS2 n-FET and WSe2 p-FET on the same substrate, and the electrical performance of the CMOS inverter, which is based on a different driving current, is also measured.

  19. Scanning tunneling microscopy studies of growth medium & temperature dependent structural phases of alkanethiol self-assembled monolayers, reactive self-assembled monolayers, & flat gold nanoparticle/indium tin oxide substrates and a scanning surface photovoltage microscopy study for local mechanical stress characterization in complementary metal oxide semiconductor devices

    NASA Astrophysics Data System (ADS)

    Dahanayaka, Dahanayaka Liyanage Daminda Hemal

    Self-assembled monolayers (SAMs) of alkanethiolates on Au(111) represent promising platforms to study the molecular surfaces and interfaces for applications ranging from molecular electronics, nanophotonics to biology. Understanding the effect of growth conditions on SAMs particularly on their structural features is important from both fundamental and applied points of view. Knowledge of SAM structural features and structural phase transitions provides important insights into molecular packing for the control of the molecular self-assembly. We compared SAMs grown from different media, from 1 mM C10 solution in decalin, hexadecane and triethylene glycol and from C10 vapor. We present a molecularly-resolved scanning tunneling microscopy study showing the dependence of the SAM structure on the growth conditions. We have established conditions for making samples almost vacancy islands (VI) free with very large SAM domains of (2✓3 x 3)rect. superstructure and (✓3 x 4✓3)R30° striped-phase and investigated the orientation of low-index step edges of Au(111) for normal and striped-phase SAMs. We showed that the striped phase is stable to converting to (2✓3 x 3)rect. below 40°C. We demonstrate that flat gold nanoparticles (FGNPs) supported on indium tin oxide glass (ITO) are excellent substrates for molecularly-resolved STM imaging of alkanethiol SAMs. Nanoparticles were characterized using STM, TEM, and SEM techniques. Surface treatment techniques, Ar/O2 and H 2 plasma treatments, dry thermal annealing and exposures to UV/O 3, were used to prepare the surfaces of FGNPs supported on ITO and Au/mica substrates for high-resolution STM imaging of alkanethiol SAMs. We developed a convergent approach to functionalize SAM surfaces. Ordered mixed monolayers comprised of alkanethiols and azidoalkanethiols islands are formed and subsequent IMesCuIBr catalyzed [3+2] "click" cycloaddition reaction with substituted alkyne introduced dilute substituent onto the ordered surface. Mechanical stress is one of the major factors in current design and manufacture of very large scale integrated (VLSI) devices. Mechanical stress in deep sub-micron silicon technologies can drastically alter carrier mobility (e.g., approximately 25% dependent on device geometry). This affects the device performance. Current in-line production stress metrology is conducted only at a wafer monitor level. The available stress measurement techniques such as micro-Raman spectroscopy, nano beam diffraction (NBD), converging electron beam diffraction (CEBD) either do not have required resolution or they require complex data interpretation. We present a method for measuring mechanical stress in deep submicron silicon devices with high spatial resolution using scanning Kelvin probe force microscopy and scanning surface photovoltage (SSPVM) techniques.

  20. Biomimetic Trehalose Biosensor Using Gustatory Receptor (Gr5a) Expressed in Drosophila Cells and Ion-Sensitive Field-Effect Transistor

    NASA Astrophysics Data System (ADS)

    Lau, Hui-Chong; Bae, Tae-Eon; Jang, Hyun-June; Kwon, Jae-Young; Cho, Won-Ju; Lim, Jeong-Ok

    2013-04-01

    The development of potential applications of biosensors using the sensory systems of vertebrates and invertebrates has progressed rapidly, especially in clinical diagnosis. The biosensor developed here involves the use of Drosophila cells expressing the gustatory receptor Gr5a and an ion-sensitive field-effect transistor (ISFET) sensor device. Gustatory receptor Gr5a is expressed abundantly in gustatory neurons and acts as a primary marker for tastants, especially sugar, in Drosophila. As a result, it could potentially serve as a good candidate for potential biomarkers of diseases in which the current knowledge of the cause and treatment is limited. The developed ISFET was based on the outstanding electrical characteristics of the metal-oxide-semiconductor field-effect transistor (MOSFET) with a subthreshold swing of 85 mV/dec, low leakage current of <10-12 and high on/off current ratio of 7.3×106. The SiO2 sensing membrane with a pH sensitivity of 34.9 mV/pH and drift rate 1.17 mV/h was sufficient for biosensing applications. In addition, the sensor device also showed significant compatibility with the Drosophila cells expressing Gr5a and their response to sugar, particularly trehalose. Moreover, the interactions between the transfected Drosophila cells and trehalose were consistent and reliable. This suggests that the developed ISFET sensor device could have potential use in the future as a screening device in diagnosis.

  1. Complementary Treatment

    MedlinePlus

    ... in mind, learn more about some complementary medicines: Antioxidants Vitamin C and E, the Mediterranean Diet Calcium ... Motor Symptoms Surgical Treatment Options Exercise Complementary Treatment Antioxidants: Vitamin C and E, Mediterranean Diet Calcium and ...

  2. Complementary medicine.

    PubMed

    Ernst, E

    2003-03-01

    Complementary medicine has become an important subject for rheumatologists, not least because many patients try complementary treatments. Recent clinical trials yield promising results. In particular, evidence suggests that several herbal medicines and dietary supplements can alleviate the pain of osteoarthritis and rheumatoid arthritis. Clearly, rigorous testing of complementary treatments is possible, and considering their popularity, should be encouraged.

  3. Ultralow power complementary inverter circuits using axially doped p- and n-channel Si nanowire field effect transistors

    NASA Astrophysics Data System (ADS)

    van, Ngoc Huynh; Lee, Jae-Hyun; Whang, Dongmok; Kang, Dae Joon

    2016-06-01

    We have successfully synthesized axially doped p- and n-type regions on a single Si nanowire (NW). Diodes and complementary metal-oxide-semiconductor (CMOS) inverter devices using single axial p- and n-channel Si NW field-effect transistors (FETs) were fabricated. We show that the threshold voltages of both p- and n-channel Si NW FETs can be lowered to nearly zero by effectively controlling the doping concentration. Because of the high performance of the p- and n-type Si NW channel FETs, especially with regard to the low threshold voltage, the fabricated NW CMOS inverters have a low operating voltage (<3 V) while maintaining a high voltage gain (~6) and ultralow static power dissipation (<=0.3 pW) at an input voltage of +/-3 V. This result offers a viable way for the fabrication of a high-performance high-density logic circuit using a low-temperature fabrication process, which makes it suitable for flexible electronics.We have successfully synthesized axially doped p- and n-type regions on a single Si nanowire (NW). Diodes and complementary metal-oxide-semiconductor (CMOS) inverter devices using single axial p- and n-channel Si NW field-effect transistors (FETs) were fabricated. We show that the threshold voltages of both p- and n-channel Si NW FETs can be lowered to nearly zero by effectively controlling the doping concentration. Because of the high performance of the p- and n-type Si NW channel FETs, especially with regard to the low threshold voltage, the fabricated NW CMOS inverters have a low operating voltage (<3 V) while maintaining a high voltage gain (~6) and ultralow static power dissipation (<=0.3 pW) at an input voltage of +/-3 V. This result offers a viable way for the fabrication of a high-performance high-density logic circuit using a low-temperature fabrication process, which makes it suitable for flexible electronics. Electronic supplementary information (ESI) available. See DOI: 10.1039/c6nr01040g

  4. Plasmonic Biosensors

    PubMed Central

    Hill, Ryan T.

    2015-01-01

    The unique optical properties of plasmon resonant nanostructures enable exploration of nanoscale environments using relatively simple optical characterization techniques. For this reason, the field of plasmonics continues to garner the attention of the biosensing community. Biosensors based on propagating surface plasmon resonances (SPRs) in films are the most well-recognized plasmonic biosensors, but there is great potential for the new, developing technologies to surpass the robustness and popularity of film-based SPR sensing. This review surveys the current plasmonic biosensor landscape with emphasis on the basic operating principles of each plasmonic sensing technique and the practical considerations when developing a sensing platform with the various techniques. The “gold standard” film SPR technique is reviewed briefly, but special emphasis is devoted to the up-and-coming LSPR-based and plasmonically coupled sensor technology. PMID:25377594

  5. Cantilever biosensors.

    PubMed

    Fritz, Jürgen

    2008-07-01

    This review will provide a general introduction to the field of cantilever biosensors by discussing the basic principles and the basic technical background necessary to understand and evaluate this class of sensors. Microfabricated cantilever sensors respond to changes in their environment or changes on their surface with a mechanical bending in the order of nanometers which can easily be detected. They are able to detect pH and temperature changes, the formation of self-assembled monolayers, DNA hybridization, antibody-antigen interactions, or the adsorption of bacteria. The review will focus on the surface stress mode of microfabricated cantilever arrays and their application as biosensors in molecular life science. A general background on biosensors, an overview of the different modes of operation of cantilever sensors and some details on sensor functionalization will be given. Finally, key experiments and current theoretical efforts to describe the surface stress mode of cantilever sensors will be discussed.

  6. Complementary Treatment.

    PubMed

    Berlin, Joey

    2016-10-01

    As the debate over complementary and alternative medicine's place in medicine continues, Texas Medical Association policy recommends physicians stay on top of evidence-based studies of complementary and alternative therapies and routinely ask patients about their use of such therapies.

  7. Complementary actions.

    PubMed

    Sartori, Luisa; Betti, Sonia

    2015-01-01

    Complementary colors are color pairs which, when combined in the right proportions, produce white or black. Complementary actions refer here to forms of social interaction wherein individuals adapt their joint actions according to a common aim. Notably, complementary actions are incongruent actions. But being incongruent is not sufficient to be complementary (i.e., to complete the action of another person). Successful complementary interactions are founded on the abilities: (i) to simulate another person's movements, (ii) to predict another person's future action/s, (iii) to produce an appropriate incongruent response which differ, while interacting, with observed ones, and (iv) to complete the social interaction by integrating the predicted effects of one's own action with those of another person. This definition clearly alludes to the functional importance of complementary actions in the perception-action cycle and prompts us to scrutinize what is taking place behind the scenes. Preliminary data on this topic have been provided by recent cutting-edge studies utilizing different research methods. This mini-review aims to provide an up-to-date overview of the processes and the specific activations underlying complementary actions.

  8. Complementary actions

    PubMed Central

    Sartori, Luisa; Betti, Sonia

    2015-01-01

    Complementary colors are color pairs which, when combined in the right proportions, produce white or black. Complementary actions refer here to forms of social interaction wherein individuals adapt their joint actions according to a common aim. Notably, complementary actions are incongruent actions. But being incongruent is not sufficient to be complementary (i.e., to complete the action of another person). Successful complementary interactions are founded on the abilities: (i) to simulate another person’s movements, (ii) to predict another person’s future action/s, (iii) to produce an appropriate incongruent response which differ, while interacting, with observed ones, and (iv) to complete the social interaction by integrating the predicted effects of one’s own action with those of another person. This definition clearly alludes to the functional importance of complementary actions in the perception–action cycle and prompts us to scrutinize what is taking place behind the scenes. Preliminary data on this topic have been provided by recent cutting-edge studies utilizing different research methods. This mini-review aims to provide an up-to-date overview of the processes and the specific activations underlying complementary actions. PMID:25983717

  9. Complementary Study

    SciTech Connect

    Yamada, H.

    2009-02-19

    In this lecture, it is emphasized that sufficient resolution of scientific issues for a fusion energy reactor can be given by complementary studies. Key scientific issues for a fusion energy reactor and ITER addressed by a complementary study in the Large Helical Device (LHD) are discussed. It should be noted that ITER is definitely a necessary condition but not a sufficient condition. Helical systems including stellarators and heliotrons are defined as alternative concepts. These approaches also aim at a fusion energy reactor based on their own concept and simultaneously benefit progress in tokamaks, more specifically ITER itself. The exact science to manage a 3-D geometry has been being developed in helical systems. A physical model with much accuracy and breadth will demonstrate its applicability to ITER. Topics to validate ''complementary'' approaches such as 3-D equilibrium, interchange MHD mode, control of radial electric field and structure formation, dynamics of a magnetic island, density limit and edge plasmas are discussed. Complementary is not Supplementary. ITER is complementary to development of a helical fusion energy reactor as well. Complementary approaches transcend existing disciplinary horizons and enable big challenges.

  10. Mitochondrial biosensors.

    PubMed

    De Michele, Roberto; Carimi, Francesco; Frommer, Wolf B

    2014-03-01

    Biosensors offer an innovative tool for measuring the dynamics of a wide range of metabolites in living organisms. Biosensors are genetically encoded, and thus can be specifically targeted to specific compartments of organelles by fusion to proteins or targeting sequences. Mitochondria are central to eukaryotic cell metabolism and present a complex structure with multiple compartments. Over the past decade, genetically encoded sensors for molecules involved in energy production, reactive oxygen species and secondary messengers have helped to unravel key aspects of mitochondrial physiology. To date, sensors for ATP, NADH, pH, hydrogen peroxide, superoxide anion, redox state, cAMP, calcium and zinc have been used in the matrix, intermembrane space and in the outer membrane region of mitochondria of animal and plant cells. This review summarizes the different types of sensors employed in mitochondria and their main limits and advantages, and it provides an outlook for the future application of biosensor technology in studying mitochondrial biology. Copyright © 2014 Elsevier Ltd. All rights reserved.

  11. Durability-enhanced two-dimensional hole gas of C-H diamond surface for complementary power inverter applications.

    PubMed

    Kawarada, Hiroshi; Yamada, Tetsuya; Xu, Dechen; Tsuboi, Hidetoshi; Kitabayashi, Yuya; Matsumura, Daisuke; Shibata, Masanobu; Kudo, Takuya; Inaba, Masafumi; Hiraiwa, Atsushi

    2017-02-20

    Complementary power field effect transistors (FETs) based on wide bandgap materials not only provide high-voltage switching capability with the reduction of on-resistance and switching losses, but also enable a smart inverter system by the dramatic simplification of external circuits. However, p-channel power FETs with equivalent performance to those of n-channel FETs are not obtained in any wide bandgap material other than diamond. Here we show that a breakdown voltage of more than 1600 V has been obtained in a diamond metal-oxide-semiconductor (MOS) FET with a p-channel based on a two-dimensional hole gas (2DHG). Atomic layer deposited (ALD) Al2O3 induces the 2DHG ubiquitously on a hydrogen-terminated (C-H) diamond surface and also acts as both gate insulator and passivation layer. The high voltage performance is equivalent to that of state-of-the-art SiC planar n-channel FETs and AlGaN/GaN FETs. The drain current density in the on-state is also comparable to that of these two FETs with similar device size and VB.

  12. Ultralow power complementary inverter circuits using axially doped p- and n-channel Si nanowire field effect transistors.

    PubMed

    Van, Ngoc Huynh; Lee, Jae-Hyun; Whang, Dongmok; Kang, Dae Joon

    2016-06-09

    We have successfully synthesized axially doped p- and n-type regions on a single Si nanowire (NW). Diodes and complementary metal-oxide-semiconductor (CMOS) inverter devices using single axial p- and n-channel Si NW field-effect transistors (FETs) were fabricated. We show that the threshold voltages of both p- and n-channel Si NW FETs can be lowered to nearly zero by effectively controlling the doping concentration. Because of the high performance of the p- and n-type Si NW channel FETs, especially with regard to the low threshold voltage, the fabricated NW CMOS inverters have a low operating voltage (<3 V) while maintaining a high voltage gain (∼6) and ultralow static power dissipation (≤0.3 pW) at an input voltage of ±3 V. This result offers a viable way for the fabrication of a high-performance high-density logic circuit using a low-temperature fabrication process, which makes it suitable for flexible electronics.

  13. Durability-enhanced two-dimensional hole gas of C-H diamond surface for complementary power inverter applications

    NASA Astrophysics Data System (ADS)

    Kawarada, Hiroshi; Yamada, Tetsuya; Xu, Dechen; Tsuboi, Hidetoshi; Kitabayashi, Yuya; Matsumura, Daisuke; Shibata, Masanobu; Kudo, Takuya; Inaba, Masafumi; Hiraiwa, Atsushi

    2017-02-01

    Complementary power field effect transistors (FETs) based on wide bandgap materials not only provide high-voltage switching capability with the reduction of on-resistance and switching losses, but also enable a smart inverter system by the dramatic simplification of external circuits. However, p-channel power FETs with equivalent performance to those of n-channel FETs are not obtained in any wide bandgap material other than diamond. Here we show that a breakdown voltage of more than 1600 V has been obtained in a diamond metal-oxide-semiconductor (MOS) FET with a p-channel based on a two-dimensional hole gas (2DHG). Atomic layer deposited (ALD) Al2O3 induces the 2DHG ubiquitously on a hydrogen-terminated (C-H) diamond surface and also acts as both gate insulator and passivation layer. The high voltage performance is equivalent to that of state-of-the-art SiC planar n-channel FETs and AlGaN/GaN FETs. The drain current density in the on-state is also comparable to that of these two FETs with similar device size and VB.

  14. Durability-enhanced two-dimensional hole gas of C-H diamond surface for complementary power inverter applications

    PubMed Central

    Kawarada, Hiroshi; Yamada, Tetsuya; Xu, Dechen; Tsuboi, Hidetoshi; Kitabayashi, Yuya; Matsumura, Daisuke; Shibata, Masanobu; Kudo, Takuya; Inaba, Masafumi; Hiraiwa, Atsushi

    2017-01-01

    Complementary power field effect transistors (FETs) based on wide bandgap materials not only provide high-voltage switching capability with the reduction of on-resistance and switching losses, but also enable a smart inverter system by the dramatic simplification of external circuits. However, p-channel power FETs with equivalent performance to those of n-channel FETs are not obtained in any wide bandgap material other than diamond. Here we show that a breakdown voltage of more than 1600 V has been obtained in a diamond metal-oxide-semiconductor (MOS) FET with a p-channel based on a two-dimensional hole gas (2DHG). Atomic layer deposited (ALD) Al2O3 induces the 2DHG ubiquitously on a hydrogen-terminated (C-H) diamond surface and also acts as both gate insulator and passivation layer. The high voltage performance is equivalent to that of state-of-the-art SiC planar n-channel FETs and AlGaN/GaN FETs. The drain current density in the on-state is also comparable to that of these two FETs with similar device size and VB. PMID:28218234

  15. High-Performance Complementary Transistors and Medium-Scale Integrated Circuits Based on Carbon Nanotube Thin Films.

    PubMed

    Yang, Yingjun; Ding, Li; Han, Jie; Zhang, Zhiyong; Peng, Lian-Mao

    2017-03-29

    Solution-derived carbon nanotube (CNT) network films with high semiconducting purity are suitable materials for the wafer-scale fabrication of field-effect transistors (FETs) and integrated circuits (ICs). However, it is challenging to realize high-performance complementary metal-oxide semiconductor (CMOS) FETs with high yield and stability on such CNT network films, and this difficulty hinders the development of CNT-film-based ICs. In this work, we developed a doping-free process for the fabrication of CMOS FETs based on solution-processed CNT network films, in which the polarity of the FETs was controlled using Sc or Pd as the source/drain contacts to selectively inject carriers into the channels. The fabricated top-gated CMOS FETs showed high symmetry between the characteristics of n- and p-type devices and exhibited high-performance uniformity and excellent scalability down to a gate length of 1 μm. Many common types of CMOS ICs, including typical logic gates, sequential circuits, and arithmetic units, were constructed based on CNT films, and the fabricated ICs exhibited rail-to-rail outputs because of the high noise margin of CMOS circuits. In particular, 4-bit full adders consisting of 132 CMOS FETs were realized with 100% yield, thereby demonstrating that this CMOS technology shows the potential to advance the development of medium-scale CNT-network-film-based ICs.

  16. Symmetric complementary logic inverter using integrated black phosphorus and MoS2 transistors

    NASA Astrophysics Data System (ADS)

    Su, Yang; Kshirsagar, Chaitanya U.; Robbins, Matthew C.; Haratipour, Nazila; Koester, Steven J.

    2016-03-01

    The operation of an integrated two-dimensional complementary metal-oxide-semiconductor inverter with well-matched input/output voltages is reported. The circuit combines a few-layer MoS2 n-MOSFET and a black phosphorus (BP) p-MOSFET fabricated using a common local backgate electrode with thin (20 nm) HfO2 gate dielectric. The constituent devices have linear threshold voltages of -0.8 V and +0.8 V and produce peak transconductances of 16 μS μm-1 and 41 μS μm-1 for the MoS2 n-MOSFET and BP p-MOSFET, respectively. The inverter shows a voltage gain of 3.5 at a supply voltage, V DD = 2.5 V, and has peak switching current of 108 μA and off-state current of 8.4 μA (2.4 μA) at V IN = 0 (V IN = 2.5 V). In addition, the inverter has voltage gain greater than unity for V DD ≥ 0.5 V, has open butterfly curves for V DD ≥ 1 V, and achieves static noise margin over 500 mV at V DD = 2.5 V. The voltage gain was found to be insensitive to temperature between 270 and 340 K, and AC large and small-signal operation was demonstrated at frequencies up to 100 kHz. The demonstration of a complementary 2D inverter which operates in a symmetric voltage window suitable for driving a subsequent logic stage is a significant step forward in developing practical applications for devices based upon 2D materials.

  17. Detection of typhoid fever by diatom-based optical biosensor.

    PubMed

    Selvaraj, Viji; Muthukumar, Anbazhagi; Nagamony, Ponpandian; Chinnuswamy, Viswanathan

    2017-06-02

    Surface-modified diatom substrates are employed for the development of immunocomplex-based optical biosensor for diagnosis of typhoid. Biosensor has been prepared by covalent immobilization of Salmonella typhi antibody onto the crosslinked diatom substrates via glutaraldehyde. Photoluminescent (PL) studies revealed good specificity and ability of conjugated diatom substrates to distinguish complementary (S. typhi) and non-complementary (Escherichia coli) antigens. The immunocomplexed biosensor showed detection limit of 10 pg. The excellent performance of biosensor is associated to its large surface-to-volume ratio, good photoluminescent property, and biocompatibility of diatom frustules, which enhances the antibody immobilization and facilitates the nucleophilic electron transfer between antibody and conjugated diatom surface. Hence, immunocomplexed diatom substrates are considered to be a suitable platform for the environmental monitoring of water-borne pathogen S. typhi.

  18. Biosensors: Development status

    NASA Astrophysics Data System (ADS)

    Hilpert, R.

    The progress achieved in the field of biosensors is described. Following a definition of the concept, the main function of biosensors is explained, using an example. Several measuring transformers and their functions are presented. The proper methods of connection between biological constituents and measuring transformers are indicated. Possible uses, biosensor markets, currently available commercial biosensors are mentioned. Main problems and their solutions in the framework of biosensor develoment are outlined. National and international centers of development are indicated. A project concerning biosensors for water supervision is described.

  19. Nanotechnology and biosensors.

    PubMed

    Jianrong, Chen; Yuqing, Miao; Nongyue, He; Xiaohua, Wu; Sijiao, Li

    2004-09-01

    Nanotechnology is playing an increasingly important role in the development of biosensors. The sensitivity and performance of biosensors is being improved by using nanomaterials for their construction. The use of these nanomaterials has allowed the introduction of many new signal transduction technologies in biosensors. Because of their submicron dimensions, nanosensors, nanoprobes and other nanosystems have allowed simple and rapid analyses in vivo. Portable instruments capable of analyzing multiple components are becoming available. This work reviews the status of the various nanostructure-based biosensors. Use of the self-assembly techniques and nano-electromechanical systems (NEMS) in biosensors is discussed.

  20. Trends in tactile biosensors, smell-sensitive biosensors

    NASA Astrophysics Data System (ADS)

    Higuchi, K.; Kawana, Y.; Kimura, J.

    1986-03-01

    Biosensors, whch combine substances from living organisms such as enzymes with electrochemical transducers, are considered taste-sensitive biosensors. Touch sensors were analyzed using various pressure-sensitive elements, but no attempts were made to use substances from organisms. The sense of smell is a gase sensor for the body; there are numerous uncertainties about the meaning of smell-sensitive biosensors. Tactile biosensors and olfactor biosensors were examined. Biosensors include sensors directly apply materials extracted from organisms and sensors which copy sensors.

  1. CMOS Active-Pixel Image Sensor With Simple Floating Gates

    NASA Technical Reports Server (NTRS)

    Fossum, Eric R.; Nakamura, Junichi; Kemeny, Sabrina E.

    1996-01-01

    Experimental complementary metal-oxide/semiconductor (CMOS) active-pixel image sensor integrated circuit features simple floating-gate structure, with metal-oxide/semiconductor field-effect transistor (MOSFET) as active circuit element in each pixel. Provides flexibility of readout modes, no kTC noise, and relatively simple structure suitable for high-density arrays. Features desirable for "smart sensor" applications.

  2. CMOS Active-Pixel Image Sensor With Simple Floating Gates

    NASA Technical Reports Server (NTRS)

    Fossum, Eric R.; Nakamura, Junichi; Kemeny, Sabrina E.

    1996-01-01

    Experimental complementary metal-oxide/semiconductor (CMOS) active-pixel image sensor integrated circuit features simple floating-gate structure, with metal-oxide/semiconductor field-effect transistor (MOSFET) as active circuit element in each pixel. Provides flexibility of readout modes, no kTC noise, and relatively simple structure suitable for high-density arrays. Features desirable for "smart sensor" applications.

  3. Photo-Patternable ZnO Thin Films Based on Cross-Linked Zinc Acrylate for Organic/Inorganic Hybrid Complementary Inverters.

    PubMed

    Jeong, Yong Jin; An, Tae Kyu; Yun, Dong-Jin; Kim, Lae Ho; Park, Seonuk; Kim, Yebyeol; Nam, Sooji; Lee, Keun Hyung; Kim, Se Hyun; Jang, Jaeyoung; Park, Chan Eon

    2016-03-02

    Complementary inverters consisting of p-type organic and n-type metal oxide semiconductors have received considerable attention as key elements for realizing low-cost and large-area future electronics. Solution-processed ZnO thin-film transistors (TFTs) have great potential for use in hybrid complementary inverters as n-type load transistors because of the low cost of their fabrication process and natural abundance of active materials. The integration of a single ZnO TFT into an inverter requires the development of a simple patterning method as an alternative to conventional time-consuming and complicated photolithography techniques. In this study, we used a photocurable polymer precursor, zinc acrylate (or zinc diacrylate, ZDA), to conveniently fabricate photopatternable ZnO thin films for use as the active layers of n-type ZnO TFTs. UV-irradiated ZDA thin films became insoluble in developing solvent as the acrylate moiety photo-cross-linked; therefore, we were able to successfully photopattern solution-processed ZDA thin films using UV light. We studied the effects of addition of a tiny amount of indium dopant on the transistor characteristics of the photopatterned ZnO thin films and demonstrated low-voltage operation of the ZnO TFTs within ±3 V by utilizing Al2O3/TiO2 laminate thin films or ion-gels as gate dielectrics. By combining the ZnO TFTs with p-type pentacene TFTs, we successfully fabricated organic/inorganic hybrid complementary inverters using solution-processed and photopatterned ZnO TFTs.

  4. DETECTION OF DNA DAMAGE USING A FIBEROPTIC BIOSENSOR

    EPA Science Inventory

    A rapid and sensitive fiber optic biosensor assay for radiation-induced DNA damage is reported. For this assay, a biotin-labeled capture oligonucleotide (38 mer) was immobilized to an avidin-coated quartz fiber. Hybridization of a dye-labeled complementary sequence was observed...

  5. DETECTION OF DNA DAMAGE USING A FIBEROPTIC BIOSENSOR

    EPA Science Inventory

    A rapid and sensitive fiber optic biosensor assay for radiation-induced DNA damage is reported. For this assay, a biotin-labeled capture oligonucleotide (38 mer) was immobilized to an avidin-coated quartz fiber. Hybridization of a dye-labeled complementary sequence was observed...

  6. Electrochemical application of DNA biosensors

    NASA Astrophysics Data System (ADS)

    Mascini, M.; Lucarelli, F.; Palchetti, I.; Marrazza, G.

    2001-09-01

    Disposable electrochemical DNA-based biosensors are reviewed; they have been used for the determination of low- molecular weight compounds with affinity for nucleic acids and for the detection of hybridization reaction. The first application is related to the molecular interaction between surface-linked DNA and pollutants or drugs, in order to develop a simple device for rapid screening of toxic compounds. The determination of such compounds was measured by their effect simple device for rapid screening of toxic compounds. The determination of such compounds was measured by their effect on the oxidation signal of the guanine peak of calf thymus DNA immobilized on the electrode surface and investigated by chronopotentiometric or voltammetric analysis. Applicability to river and wastewater sample is demonstrated. Moreover, disposable electrochemical sensors for the detection of a specific sequence of DNA were realized by immobilizing synthetic single-stranded oligonucleotides onto a graphite screen-printed electrode. The probes because hybridized with different concentrations of complementary sequences present in the sample. The hybrids formed on the electrode surface were evaluated by chronopotentiometric analysis using daunomycin as the indicator of the hybridization reaction. The hybridization was also performed using real samples. Application to apolipoprotein E is described, in this case samples have to be amplified by PCR and then analyzed by the DNA biosensor. The extension of such procedures to samples of environmental interest or to contamination of food is discussed.

  7. Biosensors for Cell Analysis.

    PubMed

    Zhou, Qing; Son, Kyungjin; Liu, Ying; Revzin, Alexander

    2015-01-01

    Biosensors first appeared several decades ago to address the need for monitoring physiological parameters such as oxygen or glucose in biological fluids such as blood. More recently, a new wave of biosensors has emerged in order to provide more nuanced and granular information about the composition and function of living cells. Such biosensors exist at the confluence of technology and medicine and often strive to connect cell phenotype or function to physiological or pathophysiological processes. Our review aims to describe some of the key technological aspects of biosensors being developed for cell analysis. The technological aspects covered in our review include biorecognition elements used for biosensor construction, methods for integrating cells with biosensors, approaches to single-cell analysis, and the use of nanostructured biosensors for cell analysis. Our hope is that the spectrum of possibilities for cell analysis described in this review may pique the interest of biomedical scientists and engineers and may spur new collaborations in the area of using biosensors for cell analysis.

  8. Charge transport and storage in ion implanted metal-oxide-semiconductor structures

    NASA Astrophysics Data System (ADS)

    Augulis, L.; Pranevičius, L.; Vosylius, J.

    A physical model that predicts charge accumulation in MOS structures with implanted SiO 2 is investigated theoretically and experimentally. It is shown that, to achieve memory effects, MOS structures have to include a SiO 2 layer with different conduction mechanism along its thickness. The sign of the flat-band voltage shift depends on the localization of traps in oxide created by ion implantation. The time characteristics of charge accumulation and discharging of implanted SiO 2 by the pulses of applied voltage are similar to those observed in MNOS structures.

  9. Experimental characterization of the dominant multiple nodes charge collection mechanism in metal oxide-semiconductor transistors

    NASA Astrophysics Data System (ADS)

    Song, Ruiqiang; Chen, Shuming; Chi, Yaqing; Wu, Zhenyu; Liang, Bin; Chen, Jianjun; Xu, Jingyan; Hao, Peipei; Yu, Junting

    2017-06-01

    We propose an experimental method to investigate the dominant multiple node charge collection mechanism. A transistor array-based test structure is used to distinguish charge collection owing to the drift-diffusion and parasitic bipolar amplification effect. Heavy ion experimental results confirm that drift-diffusion dominates multiple node charge collection at low linear energy transfer (LET). However, the parasitic bipolar amplification effect dominates it at high LET. We also propose simple equations to determine the critical LET which may change the dominant multiple node charge collection mechanism. The calculated LET value is consistent with the heavy ion experimental results.

  10. Π Band Dispersion along Conjugated Organic Nanowires Synthesized on a Metal Oxide Semiconductor

    PubMed Central

    2016-01-01

    Surface-confined dehalogenation reactions are versatile bottom-up approaches for the synthesis of carbon-based nanostructures with predefined chemical properties. However, for devices generally requiring low-conductivity substrates, potential applications are so far severely hampered by the necessity of a metallic surface to catalyze the reactions. In this work we report the synthesis of ordered arrays of poly(p-phenylene) chains on the surface of semiconducting TiO2(110) via a dehalogenative homocoupling of 4,4″-dibromoterphenyl precursors. The supramolecular phase is clearly distinguished from the polymeric one using low-energy electron diffraction and scanning tunneling microscopy as the substrate temperature used for deposition is varied. X-ray photoelectron spectroscopy of C 1s and Br 3d core levels traces the temperature of the onset of dehalogenation to around 475 K. Moreover, angle-resolved photoemission spectroscopy and tight-binding calculations identify a highly dispersive band characteristic of a substantial overlap between the precursor’s π states along the polymer, considered as the fingerprint of a successful polymerization. Thus, these results establish the first spectroscopic evidence that atomically precise carbon-based nanostructures can readily be synthesized on top of a transition-metal oxide surface, opening the prospect for the bottom-up production of novel molecule–semiconductor devices. PMID:27115554

  11. Synthesis Methods, Microscopy Characterization and Device Integration of Nanoscale Metal Oxide Semiconductors for Gas Sensing

    PubMed Central

    Vander Wal, Randy L.; Berger, Gordon M.; Kulis, Michael J.; Hunter, Gary W.; Xu, Jennifer C.; Evans, Laura

    2009-01-01

    A comparison is made between SnO2, ZnO, and TiO2 single-crystal nanowires and SnO2 polycrystalline nanofibers for gas sensing. Both nanostructures possess a one-dimensional morphology. Different synthesis methods are used to produce these materials: thermal evaporation-condensation (TEC), controlled oxidation, and electrospinning. Advantages and limitations of each technique are listed. Practical issues associated with harvesting, purification, and integration of these materials into sensing devices are detailed. For comparison to the nascent form, these sensing materials are surface coated with Pd and Pt nanoparticles. Gas sensing tests, with respect to H2, are conducted at ambient and elevated temperatures. Comparative normalized responses and time constants for the catalyst and noncatalyst systems provide a basis for identification of the superior metal-oxide nanostructure and catalyst combination. With temperature-dependent data, Arrhenius analyses are made to determine activation energies for the catalyst-assisted systems. PMID:22408484

  12. Development of a Silicon Metal-Oxide-Semiconductor-Based Qubit Using Spin Exchange Interactions Alone

    DTIC Science & Technology

    2016-03-31

    platform. The logic qubit is formed by three individual spins in electrostatically-defined quantum dots. The gate operations are carried out by spin...compatible with commercial Si CMOS technology. During the funding period, we have successfully developed an array of highly stable Si MOS triple quantum ...ADDRESS (ES) U.S. Army Research Office P.O. Box 12211 Research Triangle Park, NC 27709-2211 quantum computing, Si qubits, Si MOS quantum dots, ESR

  13. Metal oxide semiconductor gas sensors utilizing a Cr-zeolite catalytic layer for improved selectivity

    NASA Astrophysics Data System (ADS)

    Mann, D. P.; Paraskeva, T.; Pratt, K. F. E.; Parkin, I. P.; Williams, D. E.

    2005-05-01

    A novel method of improving the selectivity of metal oxide sensors has been developed. The addition of zeolites, catalytically modified with chromium, results in controlled selectivity to alkanes based on shape and size effects. The cracking patterns of n-alkanes over Cr-zeolite Y and Cr-zeolite β between 200 °C and 400 °C have been ascertained using a novel system involving a heated zeolite bed, thermal desorber and GC/MS. The findings correlate with discrimination shown when the respective zeolites are incorporated as a catalytic layer on chromium titanium oxide (CTO) gas sensors used in a proprietary sensor array system to ascertain their suitability for inclusion into an electronic nose.

  14. Defect-driven interfacial electronic structures at an organic/metal-oxide semiconductor heterojunction.

    PubMed

    Winget, Paul; Schirra, Laura K; Cornil, David; Li, Hong; Coropceanu, Veaceslav; Ndione, Paul F; Sigdel, Ajaya K; Ginley, David S; Berry, Joseph J; Shim, Jaewon; Kim, Hyungchui; Kippelen, Bernard; Brédas, Jean-Luc; Monti, Oliver L A

    2014-07-16

    The electronic structure of the hybrid interface between ZnO and the prototypical organic semiconductor PTCDI is investigated via a combination of ultraviolet and X-ray photoelectron spectroscopy (UPS/XPS) and density functional theory (DFT) calculations. The interfacial electronic interactions lead to a large interface dipole due to substantial charge transfer from ZnO to 3,4,9,10-perylenetetracarboxylicdiimide (PTCDI), which can be properly described only when accounting for surface defects that confer ZnO its n-type properties.

  15. Thin germanium carbon layers deposited directly on silicon for metal oxide semiconductor devices

    NASA Astrophysics Data System (ADS)

    Kelly, D. Q.; Wiedmann, I.; García-Gutierrez, D. I.; José-Yacamán, M.; Banerjee, S. K.

    2007-01-01

    We report the growth process and materials characterization of germanium-carbon alloys (Ge1-xCx) deposited directly on Si (1 0 0) substrates by ultra-high-vacuum chemical vapour deposition. The Ge1-xCx films are characterized by transmission electron microscopy, etch-pit density, x-ray diffraction, secondary ion mass spectrometry and electron energy loss spectroscopy. The results show that the films exhibit low threading dislocation densities despite significant strain relaxation. We also present evidence for carbon segregation in the Ge1-xCx and interpret these results as a strain relaxation mechanism.

  16. Electrosprayed metal oxide semiconductor films for sensitive and selective detection of hydrogen sulfide.

    PubMed

    Ghimbeu, Camelia Matei; Lumbreras, Martine; Schoonman, Joop; Siadat, Maryam

    2009-01-01

    Semiconductor metal oxide films of copper-doped tin oxide (Cu-SnO(2)), tungsten oxide (WO(3)) and indium oxide (In(2)O(3)) were deposited on a platinum coated alumina substrate employing the electrostatic spray deposition technique (ESD). The morphology studied with scanning electron microscopy (SEM) and atomic force microscopy (AFM) shows porous homogeneous films comprising uniformly distributed aggregates of nano particles. The X-ray diffraction technique (XRD) proves the formation of crystalline phases with no impurities. Besides, the Raman cartographies provided information about the structural homogeneity. Some of the films are highly sensitive to low concentrations of H(2)S (10 ppm) at low operating temperatures (100 and 200 °C) and the best response in terms of R(air)/R(gas) is given by Cu-SnO(2) films (2500) followed by WO(3) (1200) and In(2)O(3) (75). Moreover, all the films exhibit no cross-sensitivity to other reducing (SO(2)) or oxidizing (NO(2)) gases.

  17. Atomic origin of high-temperature electron trapping in metal-oxide-semiconductor devices

    SciTech Connect

    Shen, Xiao; Dhar, Sarit; Pantelides, Sokrates T.

    2015-04-06

    MOSFETs based on wide-band-gap semiconductors are suitable for operation at high temperature, at which additional atomic-scale processes that are benign at lower temperatures can get activated, resulting in device degradation. Recently, significant enhancement of electron trapping was observed under positive bias in SiC MOSFETs at temperatures higher than 150 °C. Here, we report first-principles calculations showing that the enhanced electron trapping is associated with thermally activated capturing of a second electron by an oxygen vacancy in SiO{sub 2} by which the vacancy transforms into a structure that comprises one Si dangling bond and a bond between a five-fold and a four-fold Si atoms. The results suggest a key role of oxygen vacancies and their structural reconfigurations in the reliability of high-temperature MOS devices.

  18. Technology of GaAs metal-oxide-semiconductor solar cells

    NASA Technical Reports Server (NTRS)

    Stirn, R. J.; Yeh, Y. C. M.

    1977-01-01

    The growth of an oxide interfacial layer was recently found to increase the open-circuit voltage (OCV) and efficiency by up to 60 per cent in GaAs metal-semiconductor solar cells. Details of oxidation techniques to provide the necessary oxide thickness and chemical structure and using ozone, water-vapor-saturated oxygen, or oxygen gas discharges are described, as well as apparent crystallographic orientation effects. Preliminary results of the oxide chemistry obtained from X-ray, photoelectron spectroscopy are given. Ratios of arsenic oxide to gallium oxide of unity or less seem to be preferable. Samples with the highest OVC predominantly have As(+3) in the arsenic oxide rather than As(+5). A major difficulty at this time is a reduction in OCV by 100-200 mV when the antireflection coating is vacuum deposited.

  19. Single Event Effects (SEE) for Power Metal-Oxide-Semiconductor Field-Effect Transistors (MOSFETs)

    NASA Technical Reports Server (NTRS)

    Lauenstein, Jean-Marie

    2011-01-01

    Single-event gate rupture (SEGR) continues to be a key failure mode in power MOSFETs. (1) SEGR is complex, making rate prediction difficult SEGR mechanism has two main components: (1) Oxide damage-- Reduces field required for rupture (2) Epilayer response -- Creates transient high field across the oxide.

  20. Permanent optical doping of amorphous metal oxide semiconductors by deep ultraviolet irradiation at room temperature

    SciTech Connect

    Seo, Hyungtak; Cho, Young-Je; Bobade, Santosh M.; Park, Kyoung-Youn; Choi, Duck-Kyun; Kim, Jinwoo; Lee, Jaegab

    2010-05-31

    We report an investigation of two photon ultraviolet (UV) irradiation induced permanent n-type doping of amorphous InGaZnO (a-IGZO) at room temperature. The photoinduced excess electrons were donated to change the Fermi-level to a conduction band edge under the UV irradiation, owing to the hole scavenging process at the oxide interface. The use of optically n-doped a-IGZO channel increased the carrier density to approx10{sup 18} cm{sup -3} from the background level of 10{sup 16} cm{sup -3}, as well as the comprehensive enhancement upon UV irradiation of a-IGZO thin film transistor parameters, such as an on-off current ratio at approx10{sup 8} and field-effect mobility at 22.7 cm{sup 2}/V s.

  1. Electrosprayed Metal Oxide Semiconductor Films for Sensitive and Selective Detection of Hydrogen Sulfide

    PubMed Central

    Ghimbeu, Camelia Matei; Lumbreras, Martine; Schoonman, Joop; Siadat, Maryam

    2009-01-01

    Semiconductor metal oxide films of copper-doped tin oxide (Cu-SnO2), tungsten oxide (WO3) and indium oxide (In2O3) were deposited on a platinum coated alumina substrate employing the electrostatic spray deposition technique (ESD). The morphology studied with scanning electron microscopy (SEM) and atomic force microscopy (AFM) shows porous homogeneous films comprising uniformly distributed aggregates of nano particles. The X-ray diffraction technique (XRD) proves the formation of crystalline phases with no impurities. Besides, the Raman cartographies provided information about the structural homogeneity. Some of the films are highly sensitive to low concentrations of H2S (10 ppm) at low operating temperatures (100 and 200 °C) and the best response in terms of Rair/Rgas is given by Cu-SnO2 films (2500) followed by WO3 (1200) and In2O3 (75). Moreover, all the films exhibit no cross-sensitivity to other reducing (SO2) or oxidizing (NO2) gases. PMID:22291557

  2. Solar water splitting with a composite silicon/metal oxide semiconductor electrode

    NASA Astrophysics Data System (ADS)

    Nakato, Yoshihiro; Kato, Naoaki; Imanishi, Akihito; Sugiura, Takashi; Ogawa, Shunsuke; Yoshida, Norimitsu; Nonomura, Shuichi

    2006-08-01

    We have studied solar water splitting with a composite semiconductor electrode, composed of an n-i-p junction amorphous silicon (a-Si, E g~ 1.7 eV) layer, an indium tin oxide (ITO) layer, and a tungsten trioxide (WO 3, E g 2.8 eV) particulate layer. The n-i-p a-Si layer, which had more accurately a structure of n-type microcrystalline ( c) 3C-SiC:H (25 nm)/i-type a-Si:H (400 nm)/p-type a-SiC x:H (25 nm), was prepared on a TiO II-covered F-doped SnO II (FTO)/glass plate by a Hot-Wire CVD method. The ITO layer (100 nm thick) was deposited on the p-type a-Si by the DC magnetron sputtering method, and the WO3 particulate layer was formed by a doctor-blade method, using a colloidal solution of commercial WO 3 powder of 10-30 nm in diameter. The composite electrode thus prepared was finally heat-treated at 300°C for 1 h. The anodic (water oxidation) photocurrent for the composite electrode in 0.1 M Na IISO 4 yielded an IPCE (incident photon to current efficiency) of about 6 % at 400 nm and was stable for more than 24 h. Besides, the onset potential lay a little (by about 0.05 V) more negative than the equilibrium hydrogen evolution potential, indicating a possibility of solar water splitting with no external bias. A preliminary result for the water photooxidation with an "n- GaP/p-Si/Pt dot" electrode is also reported briefly.

  3. Metal Oxide/Semiconductor Heterojunctions as Carrier-Selective Contacts for Photovoltaic Applications

    NASA Astrophysics Data System (ADS)

    Man, Gabriel Jen Shi

    Solar radiation is a vast, distributed, and renewable energy source which Humanity can utilize via the photovoltaic effect. The goal of photovoltaic technology is to minimize the true costs, while maximizing the power conversion efficiency and lifetime of the cell/module. Interface-related approaches to achieving this goal are explored here, for two technologically-important classes of light absorbers: crystalline-silicon (c-Si) and metal halide perovskite (MHP). The simplest solar cell consists of a light absorber, sandwiched between two metals with dissimilar work functions. Carrier-selective contacts (CSC's), which are ubiquitous in modern solar cells, are added to improve the electrical performance. Solar cells require asymmetric carrier transport within the cell, which can be effected via electrostatic and/or effective fields, and CSC's augment the asymmetry by selectively transporting holes to one contact, and electrons to the other contact. The proper design and implementation of a CSC is crucial, as the performance, lifetime, and/or cost reduction of a solar cell can be hampered by a single interface or layer. A framework, consisting of eight core requirements, was developed from first-principles to evaluate the effectiveness of a given CSC. The framework includes some requirements which are well-recognized, such as the need for appropriate band offsets, and some requirements which are not well-recognized at the moment, such as the need for effective valence/conduction band density of states matching between the absorber and CSC. The application of the framework to multiple silicon-based and MHP-based CSC's revealed the difficulties of effectively designing and implementing a CSC. A poly(3-hexylthiophene)/c-Si heterojunction was found to be a near ideal hole-selective contact (HSC). Three metal oxide/c-Si heterojunctions initially expected to yield comparable electron-selective contacts (ESC's), titanium dioxide/c-Si (TiO2/c-Si), zinc oxide/c-Si (ZnO/c-Si), and tin dioxide/c-Si (SnO2/c-Si), were instead discovered to be widely different. The TiO2/MHP heterojunction was found to be a moderately ideal ESC, and the nickel oxide/MHP (NiOX/MHP) heterojunction is expected to be a good HSC. If interfacial lead di-iodide (PbI2) is intentionally or unintentionally deposited at the interfaces of a MHP solar cell, it is expected to be detrimental to the operation of the NiOX/MHP HSC, but not to the TiO2/MHP ESC.

  4. Highly mobile and reactive state of hydrogen in metal oxide semiconductors at room temperature

    PubMed Central

    Chen, Wan Ping; He, Ke Feng; Wang, Yu; Chan, Helen Lai Wah; Yan, Zijie

    2013-01-01

    Hydrogen in metal oxides usually strongly associates with a neighboring oxygen ion through an O-H bond and thus displays a high stability. Here we report a novel state of hydrogen with unusually high mobility and reactivity in metal oxides at room temperature. We show that freshly doped hydrogen in Nb2O5 and WO3 polycrystals via electrochemical hydrogenation can reduce Cu2+ ions into Cu0 if the polycrystals are immersed in a CuSO4 solution, while this would not happen if the hydrogenated polycrystals have been placed in air for several hours before the immersion. Time-dependent studies of electrochemically hydrogenated rutile single crystals reveal two distinct states of hydrogen: one as protons covalently bonded to oxygen ions, while the other one is highly unstable with a lifetime of just a few hours. Observation of this mobile and reactive state of hydrogen will provide new insight into numerous moderate and low temperature interactions between metal oxides and hydrogen. PMID:24193143

  5. Modeling the Effects of Heavy Charged Particles on MOSFETs (Metal-Oxide-Semiconductor Field Effect Transistors).

    DTIC Science & Technology

    1988-03-01

    Prefareace.P.e... e.a...........................................................................5 Listol oflag vsg ...energies from 2-16 MeV. The angle between the proton track and the electric field was varied, and data collected for the cases of 0, 45, and 80...anomaly, the data was replotted in a different format, shown in Figures 5, 6, and 7. Figure 5 shows the change in threshold voltage as a function of

  6. Localized dielectric breakdown and antireflection coating in metal-oxide-semiconductor photoelectrodes

    NASA Astrophysics Data System (ADS)

    Ji, Li; Hsu, Hsien-Yi; Li, Xiaohan; Huang, Kai; Zhang, Ye; Lee, Jack C.; Bard, Allen J.; Yu, Edward T.

    2017-01-01

    Silicon-based photoelectrodes for solar fuel production have attracted great interest over the past decade, with the major challenge being silicon's vulnerability to corrosion. A metal-insulator-semiconductor architecture, in which an insulator film serves as a protection layer, can prevent corrosion but must also allow low-resistance carrier transport, generally leading to a trade-off between stability and efficiency. In this work, we propose and demonstrate a general method to decouple the two roles of the insulator by employing localized dielectric breakdown. This approach allows the insulator to be thick, which enhances stability, while enabling low-resistance carrier transport as required for efficiency. This method can be applied to various oxides, such as SiO2 and Al2O3. In addition, it is suitable for silicon, III-V compounds, and other optical absorbers for both photocathodes and photoanodes. Finally, the thick metal-oxide layer can serve as a thin-film antireflection coating, which increases light absorption efficiency.

  7. Band structure engineering strategies of metal oxide semiconductor nanowires and related nanostructures: A review

    NASA Astrophysics Data System (ADS)

    Piyadasa, Adimali; Wang, Sibo; Gao, Pu-Xian

    2017-07-01

    The electronic band structure of a solid state semiconductor determines many of its physical and chemical characteristics such as electrical, optical, physicochemical, and catalytic activity. Alteration or modification of the band structure could lead to significant changes in these physical and chemical characteristics, therefore we introduce new mechanisms of creating novel solid state materials with interesting properties. Over the past three decades, research on band structure engineering has allowed development of various methods to modify the band structure of engineered materials. Compared to bulk counterparts, nanostructures generally exhibit higher band structure modulation capabilities due to the quantum confinement effect, prominent surface effect, and higher strain limit. In this review we will discuss various band structure engineering strategies in semiconductor nanowires and other related nanostructures, mostly focusing on metal oxide systems. Several important strategies of band structure modulation are discussed in detail, such as doping, alloying, straining, interface and core-shell nanostructuring.

  8. Technology of GaAs metal-oxide-semiconductor solar cells

    NASA Technical Reports Server (NTRS)

    Stirn, R. J.; Yeh, Y. C. M.

    1977-01-01

    The growth of an oxide interfacial layer was recently found to increase the open-circuit voltage (OCV) and efficiency by up to 60 per cent in GaAs metal-semiconductor solar cells. Details of oxidation techniques to provide the necessary oxide thickness and chemical structure and using ozone, water-vapor-saturated oxygen, or oxygen gas discharges are described, as well as apparent crystallographic orientation effects. Preliminary results of the oxide chemistry obtained from X-ray, photoelectron spectroscopy are given. Ratios of arsenic oxide to gallium oxide of unity or less seem to be preferable. Samples with the highest OVC predominantly have As(+3) in the arsenic oxide rather than As(+5). A major difficulty at this time is a reduction in OCV by 100-200 mV when the antireflection coating is vacuum deposited.

  9. Theoretical Analyses of Oxide-Bypassed Superjunction Power Metal Oxide Semiconductor Field Effect Transistor Devices

    NASA Astrophysics Data System (ADS)

    Chen, Yu; Liang, Yung C.; Samudra, Ganesh S.

    2005-02-01

    The performance merit of silicon unipolar power devices is best described by a trade-off relationship between specific on-state resistance (Ron,sp) and breakdown voltage (Vbr), which leads to the establishment of an ideal unipolar limit on device performance. Recently, engineering the electric field in the device drift region to break this unipolar silicon limit for superior performance has become an important research topic. The superjunction (SJ) structure achieves this by paralleling precisely matched higher doping alternate p--n layers to replace the typically low doping drift region. Alternatively, for fabrication simplicity in an oxide-bypassed (OB) structure, an oxide layer of predetermined thickness together with a polycontact is used to replace the p-column of the SJ structure to modulate the electric field. The further improved gradient OB (GOB) structure with slanted oxide sidewalls delivers a performance similar to ideal SJ devices. In this paper, detailed theoretical analyses in closed-form equations on OB and GOB devices are made for the first time to model the performance in various operating regions. The theoretical analyses were also carefully verified through two-dimensional numerical simulations.

  10. An oxide/silicon core/shell nanowire metal-oxide semiconductor field-effect transistor

    NASA Astrophysics Data System (ADS)

    Zhang, Li-Ning; He, Jin; Zhou, Wang; Chen, Lin; Xu, Yi-Wen

    2010-04-01

    This paper studies an oxide/silicon core/shell nanowire MOSFET (OS-CSNM). Through three-dimensional device simulations, we have demonstrated that the OS-CSNM has a lower leakage current and higher Ion/Ioff ratio after introducing the oxide core into a traditional nanowire MOSFET (TNM). The oxide/silicon OS-CSNM structure suppresses threshold voltage roll-off, drain induced barrier lowering and subthreshold swing degradation. Smaller intrinsic device delay is also observed in OS-CSNM in comparison with that of TNM.

  11. Fast 1 kV metal-oxide-semiconductor field-effect transistor switch

    NASA Astrophysics Data System (ADS)

    Dedman, C. J.; Roberts, E. H.; Gibson, S. T.; Lewis, B. R.

    2001-09-01

    A fast, high-voltage switch based on cheap and readily available components is described. This simple circuit can switch 1 kV to ground with a fall time of ˜2.5 ns, and has proved a cost-effective means of driving electrostatic gating and rereferencing devices in pulsed ion-beam experiments.

  12. A novel RF-insensitive EED utilizing an integrated metal-oxide-semiconductor structure

    NASA Astrophysics Data System (ADS)

    Baginski, Thomas A.; Baginski, Michael E.

    1990-05-01

    The description and characterization of an electroexplosive device (EED) are presented. The structure is designed, using microelectric fabrication techniques, to be inherently immune to radio frequency (RF) radiation and also offers protection against stray signals associated with RF-induced arcing. A detailed discussion of the structure, which includes the fundamental mechanisms of operation, fabrication techniques, the device's frequency response and sensitivity to RF-induced arcing, and its compatibility with present fire control systems, is provided. Preliminary test results of the prototype device are discussed and show a significant improvement in the system's overall EMI immunity. These results include bench and field measurements of the structure's RF response for frequencies of 10-225 MHz and field measurements of the device's sensitivity to RF-induced arcing. The measurements indicate a significant reduction in real power dissipated by an EED employing the structure over an EED employing a conventional bridgewire (20 dB at 90 MHz).

  13. Complementary Paired G4FETs as Voltage-Controlled NDR Device

    NASA Technical Reports Server (NTRS)

    Mojarradi, Mohammad; Chen, Suheng; Blalock, Ben; Britton, Chuck; Prothro, Ben; Vandersand, James; Schrimph, Ron; Cristoloveanu, Sorin; Akavardar, Kerem; Gentil, P.

    2009-01-01

    It is possible to synthesize a voltage-controlled negative-differential-resistance (NDR) device or circuit by use of a pair of complementary G4FETs (four-gate field-effect transistors). [For more information about G4FETs, please see the immediately preceding article]. As shown in Figure 1, the present voltage-controlled NDR device or circuit is an updated version of a prior NDR device or circuit, known as a lambda diode, that contains a pair of complementary junction field-effect transistors (JFETs). (The lambda diode is so named because its current-versus- voltage plot bears some resemblance to an upper-case lambda.) The present version can be derived from the prior version by substituting G4FETs for the JFETs and connecting both JFET gates of each G4FET together. The front gate terminals of the G4FETs constitute additional terminals (that is, terminals not available in the older JFET version) to which one can apply control voltages VN and VP. Circuits in which NDR devices have been used include (1) Schmitt triggers and (2) oscillators containing inductance/ capacitance (LC) resonant circuits. Figure 2 depicts such circuits containing G4FET NDR devices like that of Figure 1. In the Schmitt trigger shown here, the G4FET NDR is loaded with an ordinary inversion-mode, p-channel, metal oxide/semiconductor field-effect transistor (inversion-mode PMOSFET), the VN terminal of the G4FET NDR device is used as an input terminal, and the input terminals of the PMOSFET and the G4FET NDR device are connected. VP can be used as an extra control voltage (that is, a control voltage not available in a typical prior Schmitt trigger) for adjusting the pinch-off voltage of the p-channel G4FET and thereby adjusting the trigger-voltage window. In the oscillator, a G4FET NDR device is loaded with a conventional LC tank circuit. As in other LC NDR oscillators, oscillation occurs because the NDR counteracts the resistance in the tank circuit. The advantage of this G4FET-NDR LC oscillator

  14. Genomagnetic Electrochemical Biosensors

    NASA Astrophysics Data System (ADS)

    Wang, Joseph; Erdem, Arzum

    The use of nucleic acid technologies has significantly improved preparation and diagnostic procedures in life sciences. Nucleic acid layers combined with electrochemical or optical transducers produce a new kind of affinity biosensors as DNA Biosensor for small molecular weight molecules. Electrochemical DNA biosensors are attractive devices for converting the hybridization event into an analytical signal for obtaining sequence-specific information in connection with clinical, environmental or forensic investigations. DNA hybridization biosensors, based on electrochemical transduction of hybridization, couple the high specificity of hybridization reactions with the excellent sensitivity and portability of electrochemical transducers. The main goal in all researches is to design DNA biosensors for preparing a basis for the future DNA microarray system. DNA chip has now become a powerful tool in biological research, however the real clinic assay is still under development. Recently, there has been a great interest to the magnetic beads and/or nanoparticles labelled with metals such as gold, cadmium, silver, etc. for designing of novel electrochemical DNA biosensor approaches resulting in efficient separation. The attractive features of this technology include simple approach, rapid results, multi-analyte detection, low-cost per measurument, stable, and non-hazardous reagents, and reduced waste handling. Some of these new approaches and applications of the electrochemical DNA biosensors based on magnetic beads and its combining with nanoparticles labelled with metals are described and discussed.

  15. Introduction to biosensors

    PubMed Central

    Bhalla, Nikhil; Jolly, Pawan; Formisano, Nello

    2016-01-01

    Biosensors are nowadays ubiquitous in biomedical diagnosis as well as a wide range of other areas such as point-of-care monitoring of treatment and disease progression, environmental monitoring, food control, drug discovery, forensics and biomedical research. A wide range of techniques can be used for the development of biosensors. Their coupling with high-affinity biomolecules allows the sensitive and selective detection of a range of analytes. We give a general introduction to biosensors and biosensing technologies, including a brief historical overview, introducing key developments in the field and illustrating the breadth of biomolecular sensing strategies and the expansion of nanotechnological approaches that are now available. PMID:27365030

  16. Biosensors Incorporating Bimetallic Nanoparticles.

    PubMed

    Rick, John; Tsai, Meng-Che; Hwang, Bing Joe

    2015-12-31

    This article presents a review of electrochemical bio-sensing for target analytes based on the use of electrocatalytic bimetallic nanoparticles (NPs), which can improve both the sensitivity and selectivity of biosensors. The review moves quickly from an introduction to the field of bio-sensing, to the importance of biosensors in today's society, the nature of the electrochemical methods employed and the attendant problems encountered. The role of electrocatalysts is introduced with reference to the three generations of biosensors. The contributions made by previous workers using bimetallic constructs, grouped by target analyte, are then examined in detail; following which, the synthesis and characterization of the catalytic particles is examined prior to a summary of the current state of endeavor. Finally, some perspectives for the future of bimetallic NPs in biosensors are given.

  17. Biosensors in clinical chemistry.

    PubMed

    D'Orazio, Paul

    2003-08-01

    Biosensors are analytical devices composed of a recognition element of biological origin and a physico-chemical transducer. The biological element is capable of sensing the presence, activity or concentration of a chemical analyte in solution. The sensing takes place either as a binding event or a biocatalytical event. These interactions produce a measurable change in a solution property, which the transducer converts into a quantifiable electrical signal. Present-day applications of biosensors to clinical chemistry are reviewed, including basic and applied research, commercial applications and fabrication techniques. Recognition elements include enzymes as biocatalytic recognition elements and immunoagents and DNA segments as affinity ligand recognition elements, coupled to electrochemical and optical modes of transduction. The future will include biosensors based on synthetic recognition elements to allow broad applicability to different classes of analytes and modes of transduction extending lower limits of sensitivity. Microfabrication will permit biosensors to be constructed as arrays and incorporated into lab-on-a-chip devices.

  18. BIOSENSORS FOR ENVIRONMENTAL APPLICATIONS

    EPA Science Inventory

    A review, with 19 references, is given on challenges and possible opportunities for the development of biosensors for environmental monitoring applications. The high cost and slow turnaround times typically associated with the measurement of regulated pollutants clearly indicates...

  19. Biosensors Incorporating Bimetallic Nanoparticles

    PubMed Central

    Rick, John; Tsai, Meng-Che; Hwang, Bing Joe

    2015-01-01

    This article presents a review of electrochemical bio-sensing for target analytes based on the use of electrocatalytic bimetallic nanoparticles (NPs), which can improve both the sensitivity and selectivity of biosensors. The review moves quickly from an introduction to the field of bio-sensing, to the importance of biosensors in today’s society, the nature of the electrochemical methods employed and the attendant problems encountered. The role of electrocatalysts is introduced with reference to the three generations of biosensors. The contributions made by previous workers using bimetallic constructs, grouped by target analyte, are then examined in detail; following which, the synthesis and characterization of the catalytic particles is examined prior to a summary of the current state of endeavor. Finally, some perspectives for the future of bimetallic NPs in biosensors are given. PMID:28344262

  20. Triggered optical biosensor

    DOEpatents

    Song, Xuedong; Swanson, Basil I.

    2001-10-02

    An optical biosensor is provided for the detection of a multivalent target biomolecule, the biosensor including a substrate having a bilayer membrane thereon, a recognition molecule situated at the surface, the recognition molecule capable of binding with the multivalent target biomolecule, the recognition molecule further characterized as including a fluorescence label thereon and as being movable at the surface and a device for measuring a fluorescence change in response to binding between the recognition molecule and the multivalent target biomolecule.