Effect of primary amines on magnetic properties of Fe-Ni films electroplated in a DES-based plating bath

NASA Astrophysics Data System (ADS)

Yanai, T.; Akiyoshi, T.; Yamaguchi, T.; Takashima, K.; Morimura, T.; Nakano, M.; Fukunaga, H.

2018-05-01

Fe-Ni alloy films were electroplated in DES-based plating baths with various primary amines, and we investigated the effect of the primary amines on the magnetic and the structural properties of the films. The primary amines of ammonium sulfamate, DL-α-alanine and L-glutamic acid reduced the coercivity and the surface roughness of the Fe-rich films (Fe > 70 at.%), and the reduction tendencies of the coercivity and the roughness show good agreement with the result of our previous study on another primary amine of glycine. From the results for the TEM observation, we found that the texture of the Fe-rich film is clearly different from that for the Fe-poor one (Fe < 30 at.%), and we concluded that the primary amines are effective additives for the Fe-rich films electroplated in the DES-based plating baths.

Improvement of the tool life of a micro-end mill using nano-sized SiC/Ni electroplating method.

PubMed

Park, Shinyoung; Kim, Kwang-Su; Roh, Ji Young; Jang, Gyu-Beom; Ahn, Sung-Hoon; Lee, Caroline Sunyong

2012-04-01

High mechanical properties of a tungsten carbide micro-end-mill tool was achieved by extending its tool life by electroplating nano-sized SiC particles (< 100 nm) that had a hardness similar to diamond in a nickel-based material. The co-electroplating method on the surface of the micro-end-mill tool was applied using SiC particles and Ni particles. Organic additives (saccharin and ammonium chloride) were added in a Watts bath to improve the nickel matrix density in the electroplating bath and to smooth the surface of the co-electroplating. The morphology of the coated nano-sized SiC particles and the composition were measured using Scanning Electron Microscope and Energy Dispersive Spectrometer. As the Ni/SiC co-electroplating layer was applied, the hardness and friction coefficient improved by 50%. Nano-sized SiC particles with 7 wt% were deposited on the surface of the micro-end mill while the Ni matrix was smoothed by adding organic additives. The tool life of the Ni/SiC co-electroplating coating on the micro-end mill was at least 25% longer than that of the existing micro-end mills without Ni/SiC co-electroplating. Thus, nano-sized SiC/Ni coating by electroplating significantly improves the mechanical properties of tungsten carbide micro-end mills.

Effects of Metal Ions on the Aluminum Electrodeposition from Ionic Liquids

NASA Astrophysics Data System (ADS)

Caporali, Stefano; Martinuzzi, Stefano M.; Von Czarnecki, Peter; Schubert, Thomas J. S.; Bardi, Ugo

2017-02-01

In this study, we report on the effects of three common transition metal ions, i.e., Ni2+, Cu2+ and Fe3+ on the electrodeposition of aluminum from a chloroaluminate ionic liquid, evaluated by means of electrochemical and morphological investigation. Aiming at the determination of the morphological and chemical effects on the aluminum coatings, variable amounts of ions were introduced into the electroplating bath. Thick (about 20 μm) Al coatings were obtained by direct deposition (galvanostatic, 10 mA cm2, 2 h) on brass or carbon steel substrates (10 mm diameter disks), and their morphology was examined via rugosimetry, optical and electron microscopy. The chemical composition of the deposits was provided by EDX analysis. Nickel and iron resulted to have only moderate effects on the coatings properties, but copper affected the process even in tiny amounts being detected in the deposits for bath content as low as 10 ppm.

Mechanical properties of Cr-Cu coatings produced by electroplating

NASA Astrophysics Data System (ADS)

Riyadi, Tri Widodo Besar; Sarjito, Masyrukan, Riswan, Ricky Ary

2017-06-01

Hard chromium coatings has long been considered as the most used electrodeposited coating in several industrial applications such as in petrochemistry, oil and gas industries. When hard coatings used in fastener components, the sliding contact during fastening operation produces high tensile stresses on the surface which can generate microcracks. For component used in high oxidation and corrosion environment, deep cracks cannot be tolerated. In this work, a laminated structure of Cr-Cu coating was prepared using electroplating on carbon steel substrates. Two baths of chrome and copper electrolyte solutions were prepared to deposit Cr as the first layer and Cu as the second layer. The effect of current voltages on the thickness, hardness and specific wear rate of the Cu layer was investigated. The results show that an increase of the current voltages increased the thickness and hardness of the Cu layer, but reduced the specific wear rate. This study showed that the use of Cu can be a potential candidate as a laminated structure Cr-Cu for chromium plating.

Electroplating and stripping copper on molybdenum and niobium

NASA Technical Reports Server (NTRS)

Power, J. L.

1978-01-01

Molybdenum and niobium are often electroplated and subsequently stripped of copper. Since general standard plating techniques produce poor quality coatings, general procedures have been optimized and specified to give good results.

Crystal growth patterns in DC and pulsed plated galvanic copper films on (1 1 1), (1 0 0) and (1 1 0) copper surfaces

NASA Astrophysics Data System (ADS)

Brown, Delilah A.; Morgan, Sean; Peldzinski, Vera; Brüning, Ralf

2017-11-01

Copper films for printed circuit board applications have to be fine-grained to achieve even filling of vias. Electroplated Cu films on roll annealed Cu substrates may have unacceptably large epitaxial crystals. Here galvanic films were plated on oriented single-crystal Cu substrates from an additive-free electrolyte, as well as DC plating and pulse reverse (PR) plating with additives. The distribution of crystallite orientations was mapped with XRD and compared with the microstructure determined by SEM. For the additive-free bath on [1 1 1] and [1 0 0] oriented surfaces a gradual transition from epitaxial to polycrystalline is seen, while films on [1 1 0] substrates are persistently epitaxial. Without bath additives, twinning is the main mechanism for the transition to polycrystalline texture. For DC plating, additives (carriers, accelerators and levelers) promote fine-grained films with isotropic grain orientations, with films on [1 1 0] substrates being partially isotropic. Plating with carriers and accelerators (no leveler) yields films with many distinct crystallite orientations. These orientations result from up to five steps of recursive twinning. PR plating produces isotropic films with no or very few twins (〈1 1 1〉 and 〈1 0 0〉 substrates, respectively), while on 〈1 1 0〉 oriented surfaces the deposits are about 20% epitaxial.

Fabrication of Aluminum-Based Thermal Radiation Plate for Thermoelectric Module Using Aluminum Anodic Oxidization and Copper Electroplating.

PubMed

Choi, Yi Taek; Bae, Sung Hwa; Son, Injoon; Sohn, Ho Sang; Kim, Kyung Tae; Ju, Young-Wan

2018-09-01

In this study, electrolytic etching, anodic oxidation, and copper electroplating were applied to aluminum to produce a plate on which a copper circuit for a thermoelectric module was formed. An oxide film insulating layer was formed on the aluminum through anodic oxidation, and platinum was coated by sputtering to produce conductivity. Finally, copper electroplating was performed directly on the substrate. In this structure, the copper plating layer on the insulating layer served as a conductive layer in the circuit. The adhesion of the copper plating layer was improved by electrolytic etching. As a result, the thermoelectric module fabricated in this study showed excellent adhesion and good insulation characteristics. It is expected that our findings can contribute to the manufacture of plates applicable to thermoelectric modules with high dissipation performance.

CURRENT AND EMERGING TECHNOLOGIES FOR EXTENDING THE LIFETIME OF ELECTROLESS NICKEL PLATING BATHS

EPA Science Inventory

The waste treatment and rejuvenation of spent electroless nickel baths has attracted a considerable amount of interest from electroplating shops, electroless nickel suppliers, universities and regulatory agencies due to the finite life of the baths and the associated waste that t...

Audible monitor for electroplating

NASA Technical Reports Server (NTRS)

Burowick, E. A.

1979-01-01

"No buzzer" indicates early problem in electroplating when parts are properly immersed into electropolating bath. Buzzer sounds when current flows through part; however, if current is cut, buzzer stops warning that parts must be removed and refinished thus preventing unnecessary waste of electrical energy and labor.

Synthesis of Quaternary Ammonium Salts Based on Diketopyrrolopyrroles Skeletons and Their Applications in Copper Electroplating.

PubMed

Chen, Biao; Xu, Jie; Wang, Limin; Song, Longfeng; Wu, Shengying

2017-03-01

A series of DPP derivatives bearing quaternary ammonium salt centers with different lengths of carbon chains have been designed and synthesized. Their inhibition actions on copper electroplating were first investigated. A total of four diketopyrrolopyrrole (DPP) derivatives showed different inhibition capabilities on copper electroplating. To investigate interactions between metal surface and additives, we used quantum chemical calculations. Static and dynamic surface tension of four DPP derivatives had been measured, and the results showed DPP-10C (1c) with a faster-decreasing rate of dynamic surface tension among the four derivatives, which indicated higher adsorption rate of additive on the cathode surface and gives rise to stronger inhibiting effect of copper electrodeposition. Then, DPP-10C (1c) as the representative additive, was selected for the systematic study of the leveling influence during microvia filling through comprehensive electroplating tests. In addition, field-emission scanning electron microscope images and X-ray diffraction results showed the surface morphology, which indicated that addition of DPP derivative (1c) could lead a fine copper deposit and cause the preferential orientations of copper deposits to change from [220] to [111], which happened in particular at higher concentrations.

Nickel cobalt phosphorous low stress electroplating

NASA Technical Reports Server (NTRS)

Engelhaupt, Darell E. (Inventor); Ramsey, Brian D. (Inventor)

2002-01-01

An electrolytic plating process is provided for electrodepositing a nickel or nickel cobalt alloy which contains at least about 2% to 25% by atomic volume of phosphorous. The process solutions contains nickel and optionally cobalt sulfate, hypophosphorous acid or a salt thereof, boric acid or a salt thereof, a monodentate organic acid or a salt thereof, and a multidentate organic acid or a salt thereof. The pH of the plating bath is from about 3.0 to about 4.5. An electroplating process is also provided which includes electroplating from the bath a nickel or nickel cobalt phosphorous alloy. This process can achieve a deposit with high microyield of at least about 84 kg/mm.sup.2 (120 ksi) and a density lower than pure nickel of about 8.0 gm/cc. This process can be used to plate a deposit of essentially zero stress at plating temperatures from ambient to 70.degree. C.

Nanocrystalline Cobalt-Phosphorous Electroplating as an Alternative to Hard Chromium Electroplating

DTIC Science & Technology

2012-08-01

Validate pulsed electrodeposition of Nanocrystalline Cobalt-Phosphorous (nCoP) alloy coatings as a Hard Chrome electroplating alternative for DoD...limits Cr+6  Cathode Efficiency Cr Plating *Co PEL is 20 µg/m3  ≈5X faster than Chrome plating  Increased throughput  One nCo-P tank can...replace several hard chrome tanks  Bath is Stable nCoP Plating Approaches 100% Efficiency  Process Comparison CoP Technical Approach

Electroplated Fe-Co-Ni films prepared from deep-eutectic-solvent-based plating baths

NASA Astrophysics Data System (ADS)

Yanai, Takeshi; Shiraishi, Kotaro; Akiyoshi, Toshiki; Azuma, Keita; Watanabe, Yoshimasa; Ohgai, Takeshi; Morimura, Takao; Nakano, Masaki; Fukunaga, Hirotoshi

2016-05-01

We fabricated soft magnetic films from DES-based plating baths, and investigated magnetic properties of the plated films. The plating baths were obtained by stirring the mixture of choline chloride, ethylene glycol, FeCl2 ṡ 4H2O, NiCl2 ṡ 6H2O and CoCl2 ṡ 6H2O. The composition of the electroplated film depended on the amount of the reagent in the plating bath, and we consequently obtained the films with various composition. The current efficiency of the plating process shows high values (> 88 %) in the wide composition range. The soft magnetic films with low coercivity were obtained at the Fe compositions of ≈ 30 at.% and > 80 at.%, and we found that low coercivity could be realized by the control of the film composition. We also found that the Fe-rich films prepared from DES-based plating bath have some advantages as a soft magnetic phase for a nanocomposite magnet due to their high saturation magnetization and very fine crystal structure.

Electroplating on titanium alloy

NASA Technical Reports Server (NTRS)

Lowery, J. R.

1971-01-01

Activation process forms adherent electrodeposits of copper, nickel, and chromium on titanium alloy. Good adhesion of electroplated deposits is obtained by using acetic-hydrofluoric acid anodic activation process.

Experimental Investigation of Mechanical Properties of Welded Corten Steel A588 Grade Plate Using ER70S - 6 Filler Material for Construction Application

NASA Astrophysics Data System (ADS)

Deepak, J. R.; Bupesh Raja, V. K.; Janardhan Guptha, Mittapalli; Durga Prasad, Palaparthi Hari; Sriram, V.

2017-05-01

ASTM A588 Grade A steel plate is a high strength, low alloy structural steel with 0.19 % of carbon content. When exposed to the atmosphere, A588 Grade A is suitable for construction in the bare (paint - free) condition. The main problems are lack of fusion, lack of penetration and corrosion on heat affected zone. In this research work Corten ASTM A588 Grade steel of 3mm thickness is electroplated with copper and then both raw and copper electroplated are welded by GMAW welding process with ER70S-6 as a filler material. The welded ASTM A588 is cut according to ASTM size for further testing of mechanical properties. Considering its welding strength after the process of electroplating, this research clearly states the metal can be utilized for better results in any given field. Here both the tensile and hardness are higher in copper electroplated welded when compare to raw welded.

Solar cell contacts

NASA Technical Reports Server (NTRS)

Meier, D. L.; Campbell, R. B.; Davis, J. R., Jr.; Rai-Choudhury, P.; Sienkiewicz, L. J.

1982-01-01

Two experimental contact systems were examined and compared to a baseline contact system consisting of evaporated layers of titanium, palladium, and silver and an electroplated layer of copper. The first experimental contact system consisted of evaporated layers of titanium, nickel, and copper and an electroplated layer of copper. This system performed as well as the baseline system in all respects, including its response to temperature stress tests, to a humidity test, and to an accelerated aging test. In addition, the cost of this system is estimated to be only 43 percent of the cost of the baseline system at a production level of 25 MW/year. The second experimental contact system consisted of evaporated layers of nickel and copper and an electroplated layer of copper. Cells with this system show serious degradation in a temperature stress test at 350 C for 30 minutes. Auger electron spectroscopy was used to show that the evaporated nickel layer is not an adequate barrier to copper diffusion even at temperatures as low as 250 C. This fact brings into question the long-term reliability of this contact system.

IRON COATED URANIUM AND ITS PRODUCTION

DOEpatents

Gray, A.G.

1960-03-15

A method of applying a protective coating to a metallic uranium article is given. The method comprises etching the surface of the article with an etchant solution containlng chloride ions, such as a solution of phosphoric acid and hydrochloric acid, cleaning the etched surface, electroplating iron thereon from a ferrous ammonium sulfate electroplating bath, and soldering an aluminum sheath to the resultant iron layer.

Electroplated Fe-Co-Ni films prepared in ammonium-chloride-based plating baths

NASA Astrophysics Data System (ADS)

Yanai, T.; Koda, K.; Kaji, J.; Aramaki, H.; Eguchi, K.; Takashima, K.; Nakano, M.; Fukunaga, H.

2018-05-01

We electroplated Fe-Co-Ni films in ammonium-chloride-based plating baths, and investigated the effect of the Co content on the magnetic properties and the structural ones of the as-plated films. The coercivity increased abruptly when the Co content become more than 60 at.%. As the rough surfaces were observed in the high Co content region, we considered that degradation of the surface is a factor of the abrupt increase in the coercivity. From the XRD analysis, we found that another factor of the abrupt increase is fcc-bcc phase transformation, and concluded that we need to keep the fcc structure to obtain Fe-Co-Ni films with low coercivity.

Surface structure influences contact killing of bacteria by copper

PubMed Central

Zeiger, Marco; Solioz, Marc; Edongué, Hervais; Arzt, Eduard; Schneider, Andreas S

2014-01-01

Copper kills bacteria rapidly by a mechanism that is not yet fully resolved. The antibacterial property of copper has raised interest in its use in hospitals, in place of plastic or stainless steel. On the latter surfaces, bacteria can survive for days or even weeks. Copper surfaces could thus provide a powerful accessory measure to curb nosocomial infections. We here investigated the effect of the copper surface structure on the efficiency of contact killing of Escherichia coli, an aspect which so far has received very little attention. It was shown that electroplated copper surfaces killed bacteria more rapidly than either polished copper or native rolled copper. The release of ionic copper was also more rapid from electroplated copper compared to the other materials. Scanning electron microscopy revealed that the bacteria nudged into the grooves between the copper grains of deposited copper. The findings suggest that, in terms of contact killing, more efficient copper surfaces can be engineered. PMID:24740976

TREATMENT OF URANIUM SURFACES

DOEpatents

Slunder, C.J.

1959-02-01

An improved process is presented for prcparation of uranium surfaces prior to electroplating. The surfacc of the uranium to be electroplated is anodized in a bath comprising a solution of approximately 20 to 602 by weight of phosphoric acid which contains about 20 cc per liter of concentrated hydrochloric acid. Anodization is carried out for approximately 20 minutes at a current density of about 0.5 amperes per square inch at a temperature of about 35 to 45 C. The oxidic film produced by anodization is removed by dipping in strong nitric acid, followed by rinsing with water just prior to electroplating.

Polyurethane Masks Large Areas in Electroplating

NASA Technical Reports Server (NTRS)

Beasley, J. L.

1985-01-01

Polyurethane foam provides effective mask in electroplating of copper or nickel. Thin layer of Turco maskant painted on area to be masked: Layer ensures polyurethane foam removed easily after served its purpose. Component A, isocyanate, and component B, polyol, mixed together and brushed or sprayed on mask area. Mixture reacts, yielding polyurethane foam. Foam prevents deposition of nickel or copper on covered area. New method saves time, increases productivity and uses less material than older procedures.

Hollow spherical rotors fabricated by electroplating

NASA Technical Reports Server (NTRS)

Avery, H. W.; Conroy, T. F.

1966-01-01

Equatorial bands are fabricated to provide a locating fit for the hemispheres of hollow spherical rotors which are then jointed by electroplating. Several nonmagnetic materials may be used to form the joint, such as aluminum, copper, iron, gold, plantinum, and zinc.

A new capillary electrophoresis buffer for determining organic and inorganic anions in electroplating bath with surfactant additives.

PubMed

Sun, H; Lau, K M; Fung, Y S

2010-05-07

Monitoring of trace impurities in electroplating bath is needed to meet EU requirements for WEEE and RoHS and for quality control of electrodeposits. Methods using IC and 100% aqueous CE buffer were found producing non-repeatable results attributed to interference of surfactants and major methanesulphonate anion. A new CE buffer containing 1.5mM tetraethylenepentaamine, 3mM 1,3,5-benzenetricarboxylic acid and 15 mM Tris in 20% (v/v) methanol at pH=8.4 was shown to enhance the separation window, reduce interaction between buffer and bath constituents, and give satisfactory repeatability with baseline separation for 14 organic and inorganic anions within 14 min, good repeatability for migration time (0.32-0.57% RSD), satisfactory peak area and peak height (2.9-4.5 and 3-4.7% respectively), low detection limit (S/N=2, 20-150 ppb), and wide working ranges (0.1-100 ppm). The CE buffer with 20% (v/v) methanol has demonstrated its capability for identifying anion impurities causing problem in aged tin bath and the use of only 10-fold dilution to produce reliable results for quality assessment in plating bath containing high surfactant additives. Copyright (c) 2010 Elsevier B.V. All rights reserved.

Self-Junctioned Copper Nanofiber Transparent Flexible Conducting Film via Electrospinning and Electroplating.

PubMed

An, Seongpil; Jo, Hong Seok; Kim, Do-Yeon; Lee, Hyun Jun; Ju, Byeong-Kwon; Al-Deyab, Salem S; Ahn, Jong-Hyun; Qin, Yueling; Swihart, Mark T; Yarin, Alexander L; Yoon, Sam S

2016-09-01

Self-junctioned copper nanofiber transparent flexible films are produced using electrospinning and electroplating processes that provide high performances of T = 97% and Rs = 0.42 Ω sq(-1) by eliminating junction resistance at wire intersections. The film remains conductive after being stretched by up to 770% (films with T = 76%) and after 1000 cycles of bending to a 5 mm radius. © 2016 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

HEAT TREATMENT OF ELECTROPLATED URANIUM

DOEpatents

Hoglund, P.F.

1958-07-01

A method is described for improving electroplated coatings on uranium. Such coatings are often porous, and in an effort to remedy this, the coatings are heat treated by immersing the coated specimen ln a bath of fused salt or molten methl. Since the hase metal, uranium, is an active metal, such a procedure often results in reactions between the base metal and the heating medium. This difficulty can be overcome by using liquid organopolysiloxanes as the heating medium.

Zinc-based electrolyte compositions, and related electrochemical processes and articles

DOE Office of Scientific and Technical Information (OSTI.GOV)

Kniajanski, Sergei; Soloveichik, Grigorii Lev

An aqueous electrolyte composition is described, including a zinc salt based on zinc acetate or zinc glocolate. The saturation concentration of zinc in the electrolyte composition is in the range of about 2.5M to about 3.5M. The composition also contains at least one salt of a monovalent cation. The molar ratio of zinc to the monovalent cation is about 1:2. An aqueous zinc electroplating bath, containing the aqueous electrolyte composition, is also disclosed, along with a method for the electrochemical deposition of zinc onto a substrate surface, using the electroplating bath. Related flow batteries are also described, including a catholyte,more » as well as an anolyte based on the aqueous electrolyte composition, with a membrane between the catholyte and the anolyte.« less

Chemically modified Moringa oleifera seed husks as low cost adsorbent for removal of copper from aqueous solution

NASA Astrophysics Data System (ADS)

Ghafar, Faridah; Mohtar, Aminullah; Sapawe, Norzahir; Hadi, Norulakmal Nor; Salleh, Marmy Roshaidah Mohd

2017-12-01

Moringa oleifera husks (MOH) are an agricultural byproduct that may have potential as adsorbent for removal of heavy metal ions in wastewater such as copper (Cu2+). The release of Cu2+ to the environment by the mining and electroplating industries cause a major problem because it is toxic and can cause liver and kidney problems. Hence, it is important to remove copper before the wastewater can be discharged to the environment. In order to increase the adsorption capacity, the MOH was chemically modified using citric acid. The raw and modified MOH were analyzed using Fourier Transform Infra-Red (FTIR) for identification of functional groups present at the adsorbent surface. The adsorption study was carried out using the batch technique in water bath shaker investigating different parameters; adsorbent dosage (30 - 70 g/L), initial concentration of copper (30 - 150 mg/L), contact time (2 - 90 min), temperature (27 - 60 °C) at constant agitation of 100 rpm. The concentrations of copper in aqueous solution before and after the adsorption process was analyzed using Atomic Absorption Spectrum (AAS). The highest percentage removal of copper was found at 10g/L of adsorbent dosage with 30 mg/L of initial concentration and temperature 30 °C. It was also observed that the adsorption of copper by MOH was approaching to equilibrium at 60 min of reaction time. From the FTIR analysis, it was found that the MOH contains hydroxyl, carboxyl and amine groups. The high adsorption capacity of modified MOH to remove copper from aqueous solution makes it preferable and attractive alternative to commercial adsorbent.

Investigation the electroplating behavior of self formed CuMn barrier.

PubMed

Wu, Chia-Yang; Lee, Wen-Hsi; Chang, Shih-Chieh; Wang, Ying-Lang

2013-08-01

The electrical and material properties of Copper (Cu) mixed with [0-10 atomic% manganese (Mn)] and pure Cu films deposited on silicon oxide (SiO2)/silicon (Si) are explored. Cu electroplating on self formed CuMn barrier was investigated with different Mn content. The electrochemical deposition of the Cu thin film onto the electrode using CuMn barrier was investigated. Scanning electron microscopic (SEM) micrographs of copper electroplating on CuMn films were examined, and the copper nucleation behaviors changed with the Mn content. Since the electrochemical impedance spectroscopy (EIS) is widely recognized as a powerful tool for the investigation of electrochemical behaviors, the tool was also used to verify the phenomena during plating. It was found that the charge-trasfer impedance decrease with the rise in the Mn content below 5%, but increase with the rise in the Mn content higher than 5%. The result was corresponded to the surface energy, the surface morphology, the corrosion and the oxidation of the substrate.

A Novel Fabrication Method of Bi₂Te₃-Based Thermoelectric Modules by Indium Electroplating and Thermocompression Bonding.

PubMed

Yoon, Jongchan; Bae, Sung Hwa; Sohn, Ho-Sang; Son, Injoon; Kim, Kyung Tae; Ju, Young-Wan

2018-09-01

In this study, we devised a method to bond thermoelectric elements directly to copper electrodes by plating indium with a relatively low melting point. A coating of indium, ~30 μm in thickness, was fabricated by electroplating the surface of a Bi2Te3-based thermoelectric element with a nickel diffusion barrier layer. They were then subjected to direct thermocompression bonding at 453 K on a hotplate for 10 min at a pressure of 1.1 kPa. Scanning electron microscopy images confirmed that a uniform bond was formed at the copper electrode/thermoelectric element interface, and the melted/solidified indium layer was defect free. Thus, the proposed novel method of fabricating a thermoelectric module by electroplating indium on the surface of the thermoelectric element and directly bonding with the copper electrode can be used to obtain a uniformly bonded interface even at a relatively low temperature without the use of solder pastes.

Preelectroplating Treatment Of Titanium Honeycomb Core

NASA Technical Reports Server (NTRS)

Kelly, Michael L.; Harvey, James S.

1992-01-01

New technique used to treat titanium honeycomb core electrochemically by applying conversion coat to keep honeycomb active and receptive to electroplating with solution of sodium bichromate and hydrofluoric acid. Maskant permits electroplating of controlled amount of filler metal on edge of honeycomb. Eliminates excess copper filler.

Toxicity effects of nickel electroplating effluents treated by photoelectrooxidation in the industries of the Sinos River Basin.

PubMed

Benvenuti, T; Rodrigues, Mas; Arenzon, A; Bernardes, A M; Zoppas-Ferreira, J

2015-05-01

The Sinos river Basin is an industrial region with many tanneries and electroplating plants in southern Brazil. The wastewater generated by electroplating contains high loads of salts and metals that have to be treated before discharge. After conventional treatment, this study applied an advanced oxidative process to degrade organic additives in the electroplating bright nickel baths effluent. Synthetic rinsing water was submitted to physical-chemical coagulation for nickel removal. The sample was submitted to ecotoxicity tests, and the effluent was treated by photoelectrooxidation (PEO). The effects of current density and treatment time were evaluated. The concentration of total organic carbon (TOC) was 38% lower. The toxicity tests of the effluent treated using PEO revealed that the organic additives were partially degraded and the concentration that is toxic for test organisms was reduced.

Electrodes from carbon nanotubes/NiO nanocomposites synthesized in modified Watts bath for supercapacitors

NASA Astrophysics Data System (ADS)

Hakamada, Masataka; Abe, Tatsuhiko; Mabuchi, Mamoru

2016-09-01

A modified Watts bath coupled with pulsed current electroplating is used to uniformly deposit ultrafine nickel oxide particles (diameter < 4 nm) on multiwalled carbon nanotubes. The capacitance of the multiwalled carbon nanotubes/nickel oxide electrodes was as high as 2480 F g-1 (per mass of nickel oxide), which is close to the theoretical capacitance of NiO.

The effects of ultrasonic agitation on supercritical CO2 copper electroplating.

PubMed

Chuang, Ho-Chiao; Yang, Hsi-Min; Wu, Guan-Lin; Sánchez, Jorge; Shyu, Jenq-Huey

2018-01-01

Applying ultrasound to the electroplating process can improve mechanical properties and surface roughness of the coating. Supercritical electroplating process can refine grain to improve the surface roughness and hardness. However, so far there is no research combining the above two processes to explore its effect on the coating. This study aims to use ultrasound (42kHz) in supercritical CO 2 (SC-CO 2 ) electroplating process to investigate the effect of ultrasonic powers and supercritical pressures on the properties of copper films. From the results it was clear that higher ultrasonic irradiation resulted in higher current efficiency, grain refinement, higher hardness, better surface roughness and higher internal stress. SEM was also presented to verify the correctness of the measured data. The optimal parameters were set to obtain the deposit at pressure of 2000psi and ultrasonic irradiation of 0.157W/cm 3 . Compared with SC-CO 2 electroplating process, the current efficiency can be increased from 77.57% to 93.4%, the grain size decreases from 24.34nm to 22.45nm, the hardness increases from 92.87Hv to 174.18Hv, and the surface roughness decreases from 0.83μm to 0.28μm. Therefore, this study has successfully integrated advantages of ultrasound and SC-CO 2 electroplating, and proved that applied ultrasound to SC-CO 2 electroplating process can significantly improve the mechanical properties of the coating. Copyright © 2017 Elsevier B.V. All rights reserved.

Ink-jet printing technology enables self-aligned mould patterning for electroplating in a single step

NASA Astrophysics Data System (ADS)

Meissner, M. V.; Spengler, N.; Mager, D.; Wang, N.; Kiss, S. Z.; Höfflin, J.; While, P. T.; Korvink, J. G.

2015-06-01

We present a new self-aligned, mask-free micro-fabrication method with which to form thick-layered conductive metal micro-structures inside electroplating moulds. Seed layer patterning for electroplating was performed by ink-jet printing using a silver nano-particle ink deposited on SU-8 or Ordyl SY permanent resist. The silver ink contact angle on SU-8 was adjusted by oxygen plasma followed by a hard bake. Besides functioning as a seed layer, the printed structures further served as a shadow mask during patterning of electroplating moulds into negative photoresist. The printed silver tracks remained in strong adhesion to the substrate when exposed to the acidic chemistry of the electroplating bath. To demonstrate the process, we manufactured rectangular, low-resistivity planar micro-coils for use in magnetic resonance microscopy. MRI images of a spring onion with an in-plane resolution down to 10 µm × 10 µm were acquired using a micro-coil on an 11.7 T MRI scanner.

Influence of voltage input to heavy metal removal from electroplating wastewater using electrocoagulation process

NASA Astrophysics Data System (ADS)

Wulan, D. R.; Cahyaningsih, S.; Djaenudin

2017-03-01

In medium capacity, electroplating industry usually treats wastewater until 5 m3 per day. Heavy metal content becomes concern that should be reduced. Previous studies performed electrocoagulation method on laboratory scale, either batch or continuous. This study was aimed to compare the influence of voltage input variation into heavy metal removal in electroplating wastewater treatment using electrocoagulation process on laboratory-scale in order to determine the optimum condition for scaling up the reactor into pilot-scale. The laboratory study was performed in 1.5 L glass reactor in batch system using wastewater from electroplating industry, the voltage input varied at 20, 30 and 40 volt. The electrode consisted of aluminium 32 cm2 as sacrifice anode and copper 32 cm2 as cathode. During 120 min electrocoagulation process, the pH value was measured using pH meter, whereas the heavy metal of chromium, copper, iron, and zinc concentration were analysed using Atomic Absorption Spectrophotometer (AAS). Result showed that removal of heavy metals from wastewater increased due to the increasing of voltage input. Different initial concentration of heavy metals on wastewater, resulted the different detention time. At pilot-scale reactor with 30 V voltage input, chromium, iron, and zinc reached removal efficiency until 89-98%, when copper reached 79% efficiency. At 40V, removal efficiencies increased on same detention time, i.e. chromium, iron, and zinc reached 89-99%, whereas copper reached 85%. These removal efficiencies have complied the government standard except for copper that had higher initial concentration in wastewater. Kinetic rate also calculated in this study as the basic factor for scaling up the process.

Effect of tungsten (W) on structural and magnetic properties of electroplated NiFe thin films for MEMS applications

NASA Astrophysics Data System (ADS)

Kannan, R.; Devaki, P.; Premkumar, P. S.; Selvambikai, M.

2018-04-01

Electrodeposition of nanocrystalline NiFe and NiFeW thin films were carried out from ammonium citrate bath at a constant current density and controlled pH of 8 by varying the bath temperature from 40 °C to 70 °C. The surface morphology and chemical composition of the electrodeposited NiFe and NiFeW soft magnetic thin films were studied by using SEM and EDAX. The SEM micrographs of the films coated at higher electrodeposited bath temperature have no micro cracks and also the films have more uniform surface morphology. The existence of crystalline nature of the coated films were analysed by XRD. The presence of predominant peaks in x-ray diffraction pattern (compared with JCPDS data) reveal that the average crystalline size was in the order of few tens of nano meters. The magnetic properties such as coercivity, saturation magnetization and magnetic flux density have been calculated from vibrating sample magnetometer analysis. The VSM result shows that the NiFeW thin film synthesised at 70 °C exhibit the lower coercivity with higher saturation magnetization. The hardness and adhesion of the electroplated films have been investigated. Reasons for variation in magnetic properties and structural characteristics are also discussed. The electroplated NiFe and NiFeW thin films can be used for Micro Electro Mechanical System (MEMS) applications due to their excellent soft magnetic behaviour.

PRETREATING THORIUM FOR ELECTROPLATING

DOEpatents

Beach, J.G.; Schaer, G.R.

1959-07-28

A method is presented for pretreating a thorium surface prior to electroplating the surface. The pretreatment steps of the invention comprise cleaning by vapor blasting the surface, anodically pickling in a 5 to 15% by volume aqueous hydrochloric acid bath with a current of 125 to 250 amp/sq ft for 3 to 5 min at room temperature, chemically pickling the surface in a 5 to 15% by volume of aqueous sulfuric acid for 3 to 5 min at room temperature, and rinsing the surface with water.

Electrodeposition of amorphous Ni P coatings onto Nd Fe B permanent magnet substrates

NASA Astrophysics Data System (ADS)

Ma, C. B.; Cao, F. H.; Zhang, Z.; Zhang, J. Q.

2006-12-01

Decorative and protective Ni-P amorphous coatings were electroplated onto NdFeB permanent magnet from an ortho-phosphorous acid contained bath. The influences of the main electroplating technological parameters including current density, bath pH, bath temperature and H3PO3 on the structure and chemical composition of Ni-P coatings were investigated by potentiodynamic polarization and electrochemical impedance spectroscopy (EIS) techniques in conjunction with X-ray diffraction (XRD), scanning transmission electron microscopy (SEM) and X-ray energy-dispersive spectrometry (EDX). The optimized amorphous Ni-P coated NdFeB can stand for ca. 180 h against neutral 3.0 wt.% NaCl salt spray without any pitting corrosion. Meanwhile, the results also showed that large phosphorous content is the precondition for Ni-P coatings to possess the amorphous structure, but too much high phosphorous content can damage the amorphous structure due to the separation of superfluous P from Ni2P/Ni3P and the resultant formation of multi-phase coatings (such as Ni2P-P).

Effect of ultrasound sonication on electroplating of iridium.

PubMed

Ohsaka, Takashi; Isaka, Motohiro; Hirano, Katsuhiko; Ohishi, Tomoji

2008-04-01

Effect of ultrasound sonication was examined on the electroplating of iridium in aqueous hexabromoiridate(III) solution. The electrodeposits were evaluated by observing the defects of the iridium deposits by means of voltammetry, in which the current-potential curves of the iridium deposits on copper were measured. Applying ultrasound sonication to the electroplating of iridium decreased the defects including the cracks in the deposit whenever the glycerol as the additives was contained or not in the electrolyte.

Survey of coatings for solar collectors

NASA Technical Reports Server (NTRS)

Mcdonald, G. E.

1975-01-01

Optimum solar selective properties of black chrome require some tailoring of current and time for plating solution being used. Black zinc is produced from high zinc electroplate by subsequent conversion with chromate dip. Measurements have also been made of reflectance of previously known solar selective coatings of black copper and electroplated black nickel.

Coating for prevention of titanium combustion

NASA Technical Reports Server (NTRS)

Anderson, V. G.; Funkhouser, M.; Mcdaniel, P.

1980-01-01

A limited number of coating options for titanium gas turbine engine components were explored with the objective of minimizing potential combustion initiation and propagation without adversely affecting component mechanical properties. Objectives were met by two of the coatings, ion-plated platinum plus electroplated copper plus electroplated nickel and ion vapor deposited aluminum.

Anneal-Hardening Behavior of Cr-Fe-C Alloy Deposits Prepared in a Cr3+-Based Bath with Fe2+ Ions

PubMed Central

Huang, Ching An; Chen, Jhih You; Wang, Hai

2017-01-01

Cr-Fe-C alloy deposits were successfully prepared on high-carbon tool steel in a Cr3+-based electroplating bath containing Fe2+ ions and suitable complex agents. A Cr-based alloy deposit was obtained with an electroplating current density higher than 25 Adm−2, and a Fe-based alloy deposit was obtained using a current density of 20 Adm−2. Following electroplating, these alloy deposited specimens were annealed via rapid thermal annealing (RTA) at 500 °C for different periods up to 30 s. The experimental results show that Cr- and Fe-based alloy deposits could be significantly hardened after RTA at 500 °C for a few seconds. The maximum hardness was that of the Cr-Fe-C alloy deposit annealed at 500 °C for 10 s. The maximum hardness of 1205 Hv was detected from the annealed Cr-based alloy deposit prepared with 30 ASD. The hardening mechanism of annealed Cr- and Fe-based alloy deposits is attributed to the precipitation of C-related membranes. The hardness values of the annealed Cr- and Fe-based alloy deposits increase with the increasing degree of crystallization of the C-related membranes. PMID:29206206

The Use of Wetting Agents/Fume Supressants for Minimizing the Atmospheric Emissions from Hard Chromium Electroplating Baths

DTIC Science & Technology

2003-08-01

ESTCP FINAL REPORT For THE USE OF WETTING AGENTS/ FUME SUPPRESSANTS FOR MINIMIZING THE ATMOSPHERIC EMISSIONS FROM HARD CHROMIUM ...Introduction This project demonstrates that a “third” generation wetting agent / fume suppressant (WA/FS) chemical additive to hard chromium ...DOD operations fall in the same category.) Several papers, including Use of Fume Suppressants in Hard Chromium Baths - Quality Testing and Use

Fabrication of silicon-embedded low resistance high-aspect ratio planar copper microcoils

NASA Astrophysics Data System (ADS)

Syed Mohammed, Zishan Ali; Puiu, Poenar Daniel; Aditya, Sheel

2018-01-01

Low resistance is an important requirement for microcoils which act as a signal receiver to ensure low thermal noise during signal detection. High-aspect ratio (HAR) planar microcoils entrenched in blind silicon trenches have features that make them more attractive than their traditional counterparts employing electroplating through a patterned thick polymer or achieved through silicon vias. However, challenges met in fabrication of such coils have not been discussed in detail until now. This paper reports the realization of such HAR microcoils embedded in Si blind trenches, fabricated with a single lithography step by first etching blind trenches in the silicon substrate with an aspect ratio of almost 3∶1 and then filling them up using copper electroplating. The electroplating was followed by chemical wet etching as a faster way of removing excess copper than traditional chemical mechanical polishing. Electrical resistance was further reduced by annealing the microcoils. The process steps and challenges faced in the realization of such structures are reported here followed by their electrical characterization. The obtained electrical resistances are then compared with those of other similar microcoils embedded in blind vias.

High-Current Rotating Contactor

NASA Technical Reports Server (NTRS)

Hagan, David W.; Wolff, Edwin D.

1996-01-01

Rotating electrical contactor capable of carrying 1,000 amperes of current built for use in rotating large workpiece in electroplating bath. Electrical contact made by use of 24 automotive starter motor brushes adapted to match inside diameter of shell electrode.

Metallic copper corrosion rates, moisture content, and growth medium influence survival of copper-ion resistant bacteria

PubMed Central

Elguindi, Jutta; Moffitt, Stuart; Hasman, Henrik; Andrade, Cassandra; Raghavan, Srini; Rensing, Christopher

2013-01-01

The rapid killing of various bacteria in contact with metallic copper is thought to be influenced by influx of copper ions into the cells but the exact mechanism is not fully understood. This study showed that the kinetics of contact-killing of copper surfaces depended greatly on the amount of moisture present, copper content of alloys, type of medium used, and type of bacteria. We examined antibiotic- and copper-ion resistant strains of Escherichia coli and Enterococcus faecium isolated from pig farms following the use of copper sulfate as feed supplement. The results showed rapid killing of both copper-ion resistant E. coli and E. faecium strains when samples in rich medium were spread in a thin, moist layer on copper alloys with 85% or greater copper content. E. coli strains were rapidly killed under dry conditions while E. faecium strains were less affected. Electroplated copper surface corrosion rates were determined from electro-chemical polarization tests using the Stern-Geary method and revealed decreased corrosion rates with benzotriazole and thermal oxide coating. Copper-ion resistant E. coli and E. faecium cells suspended in 0.8% NaCl showed prolonged survival rates on electroplated copper surfaces with benzotriazole coating and thermal oxide coating compared to surfaces without anti-corrosion treatment. Control of surface corrosion affected the level of copper ion influx into bacterial cells which contributed directly to bacterial killing. PMID:21085951

Brazing open cell reticulated copper foam to stainless steel tubing with vacuum furnace brazed gold/indium alloy plating

DOEpatents

Howard, Stanley R [Windsor, SC; Korinko, Paul S [Aiken, SC

2008-05-27

A method of fabricating a heat exchanger includes brush electroplating plated layers for a brazing alloy onto a stainless steel tube in thin layers, over a nickel strike having a 1.3 .mu.m thickness. The resultant Au-18 In composition may be applied as a first layer of indium, 1.47 .mu.m thick, and a second layer of gold, 2.54 .mu.m thick. The order of plating helps control brazing erosion. Excessive amounts of brazing material are avoided by controlling the electroplating process. The reticulated copper foam rings are interference fit to the stainless steel tube, and in contact with the plated layers. The copper foam rings, the plated layers for brazing alloy, and the stainless steel tube are heated and cooled in a vacuum furnace at controlled rates, forming a bond of the copper foam rings to the stainless steel tube that improves heat transfer between the tube and the copper foam.

Short communication: Efficacy of copper sulfate hoof baths against digital dermatitis--Where is the evidence?

PubMed

Thomsen, Peter T

2015-04-01

Digital dermatitis is a major problem in modern dairy production because of decreased animal welfare and financial losses. Individual cow treatments are often seen as too time consuming by farmers, and walk-through hoof baths have therefore been used extensively to control digital dermatitis. For decades, copper sulfate hoof baths have been used to treat and prevent digital dermatitis. Copper sulfate has been referred to as the industry gold standard when it comes to hoof-bath chemicals. In several scientific studies testing the efficacy of other hoof-care products, copper sulfate has been used as a positive control, thereby indicating that copper sulfate has a known positive effect. However, this may not be the case. A dilemma may exist between (1) copper sulfate generally being perceived as being effective against digital dermatitis and (2) a possible lack of well-documented scientific evidence of this effect. The objective of this study was to evaluate the existing scientific literature to determine whether the efficacy of copper sulfate used in hoof baths against digital dermatitis has in fact been demonstrated scientifically. A systematic literature search identified 7 peer-reviewed journal articles describing the efficacy of copper sulfate in hoof baths as treatment or prevention of bovine digital dermatitis. Only 2 of the 7 studies compared copper sulfate to a negative control; most studies were relatively small, and often no clear positive effect of copper sulfate was demonstrated. In conclusion, the frequent claim that copper sulfate is widely reported to be effective is supported by little scientific evidence. Well-designed clinical trials evaluating the effect of copper sulfate against digital dermatitis compared with a negative control are needed. Until such studies have been made, the efficacy of copper sulfate in hoof baths against digital dermatitis remains largely unproven. Copyright © 2015 American Dairy Science Association. Published by Elsevier Inc. All rights reserved.

The Influence of Pulsed Electroplating Frequency and Duty Cycle on Copper Film Microstructure and Stress State

PubMed Central

Marro, James B.; Darroudi, Taghi; Okoro, Chukwudi A.; Obeng, Yaw S.; Richardson, Kathleen C.

2017-01-01

In this work we studied the impact of pulse electroplating parameters on the cross-sectional and surface microstructures of blanket copper films using electron backscattering diffraction and x-ray diffraction. The films evaluated were highly (111) textured in the direction perpendicular to the film surface. The degree of preferential orientation was found to decrease with longer pulse on-times, due to strain energy driven growth of other grain orientations. Residual biaxial stresses were also measured in the films and higher pulse frequencies during deposition led to smaller biaxial stresses in the films. Film stress was also found to correlate with the amount of twinning in the copper film cross-sections. This has been attributed to the twins’ thermal stability and mechanical properties. PMID:28239200

Improved black nickel coatings for flat plate solar collectors

NASA Technical Reports Server (NTRS)

Lin, J. H.; Peterson, R. E.

1977-01-01

A new black nickel formula was developed which had a solar absorptance of 0.92 and an infrared emittance (at 100 C) of less than 0.10 after 14 days at 38 C and 95 percent relative humidity. The electroplating bath and conditions were changed to obtain the more stable coating configuration. The effect of bath composition, temperature, pH, and plating current density and time on the coating composition, optical properties and durability were investigated.

Nickel electroplating on copper pre-activated Al alloy in the electrolyte containing PEG1000 as an additive

NASA Astrophysics Data System (ADS)

Guan, Jie; Wang, Jinwei; Zhang, Dawei

2018-06-01

Ni coatings are prepared on Cu-pretreated anodic Al alloy by electroplating technique in environment-friendly electrolytes with PEG1000 as an additive. Some defects like pores, cracks and even uncovered areas are observed for the sample of the Cu-pretreated anodic Al alloy, and these defects seem to be remedied with the following Ni electroplating as observed from their SEM images; while the covering effect of Ni onto the Cu layer is rather limited as judged by their corrosion current data of polarization test. After adding PEG1000 in the Ni electroplating electrolyte, the obtained coating surfaces are seen smoother and thicker; and most of the tiny particles are seen closely packed together with some bigger particles on them. The diffusion of nickel particles into copper layer are confirmed by the line and mapping mode of EDS element analysis for the Ni-Cu composite coating. Their much lower corrosion current density ( I corr) and higher micro-hardness support the fact that the addition of PEG1000 in Ni plating electrolyte has a function of promoting the refinement of Ni particles and the formation of more compacter, thicker and smoother Ni-Cu composite coating.

Method of forming oxide coatings. [for solar collector heating panels

NASA Technical Reports Server (NTRS)

Mcdonald, G. E. (Inventor)

1983-01-01

This invention is concerned with an improved plating process for covering a substrate with a black metal oxide film. The invention is particularly directed to making a heating panel for a solar collector. A compound is electrodeposited from an aqueous solution containing cobalt metal salts onto a metal substrate. This compound is converted during plating into a black, highly absorbing oxide coating which contains hydrated oxides. This is achieved by the inclusion of an oxidizing agent in the plating bath. The inclusion of an oxidizing agent in the plating bath is contrary to standard electroplating practice. The hydrated oxides are converted to oxides by treatment in a hot bath, such as boiling water. An oxidizing agent may be added to the hot liquid treating bath.

Development of Low Cost Contacts to Silicon Solar Cells

NASA Technical Reports Server (NTRS)

Iles, P. A.; Tanner, D. P.

1979-01-01

Different electroless plating systems were evaluated in conjunction with copper electroplating. All tests involved simultaneous deposition of front and back contacts using a standard cell materials. Cells with good adhesion and good curve fill factors were obtained using a palladium-chromium-copper metallization system. The final copper contact system was evaluated to determine if the copper would migrate at elevated temperatures. The copper migrated at elevated temperatures causing cell output degradation.

Improved nickel plating of Inconel X-750

NASA Technical Reports Server (NTRS)

Farmer, M. E.; Feeney, J. E.; Kuster, C. A.

1969-01-01

Electroplating technique with acid pickling provides a method of applying nickel plating on Inconel X-750 tubing to serve as a wetting agent during brazing. Low-stress nickel-plating bath contains no organic wetting agents that cause the nickel to blister at high temperatures.

Prototype of a scaled‐up microbial fuel cell for copper recovery

PubMed Central

Rodenas Motos, Pau; Molina, Gonzalo; Sleutels, Tom; Saakes, Michel; Buisman, Cees

2017-01-01

Abstract Background Bioelectrochemical systems (BESs) enable recovery of electrical energy through oxidation of a wide range of substrates at an anode and simultaneous recovery of metals at a cathode. Scale‐up of BESs from the laboratory to pilot scale is a challenging step in the development of the process, and there are only a few successful experiences to build on. This paper presents a prototype BES for the recovery of copper. Results The cell design presented here had removable electrodes, similar to those in electroplating baths. The anode and cathode in this design could be replaced independently. The prototype bioelectrochemical cell consisted of an 835 cm2 bioanode fed with acetate, and a 700 cm2 cathode fed with copper. A current density of 1.2 A/−2 was achieved with 48 mW m−2 of power production. The contribution of each component (anode, electrolytes, cathode and membrane) was evaluated through the analysis of the internal resistance distribution. This revealed that major losses occurred at the anode, and that the design with removable electrodes results in higher internal resistance compared with other systems. To further assess the practical applicability of BES for copper recovery, an economic evaluation was performed. Conclusion Analysis shows that the internal resistance of several lab‐scale BESs is already sufficiently low to make the system economic, while the internal resistance for scaled‐up systems still needs to be improved considerably to become economically applicable.© 2017 The Authors. Journal of Chemical Technology & Biotechnology published by John Wiley & Sons Ltd on behalf of Society of Chemical Industry. PMID:29104342

Fabrication of an electromagnetic actuator with the planar coil

NASA Astrophysics Data System (ADS)

Jeong, HyunKu; Jeong, OkChan; Yang, Sang S.

2000-06-01

This paper first presents the fabrication of an electromagnetic microactuator using an electroplated spiral copper coil on a parylene C diaphragm. The parylene is a bio-compatible material and has a very low Young's modulus less than 2.8 Gpa, which makes the large deflection for the low power consumption. The actuator consists of an electroplated coil on the parylene C diaphragm, a small-size permanent magnet and a core. The diaphragm is actuated by the Lorenz force generated by the current through the coil in the magnetic field of the magnet. The size of the actuator diaphragm is 4 by 4 mm2 and 5 micrometers thick. The resistance and inductance of the copper spiral coil are 2 (Omega) and 11 (mu) H at 100 Hz, respectively. The center deflection of the actuator diaphragm is measured with the laser vibrometer. Whenthe current through the coil is 380 mA, the peak-to-peak deflection of the actuator is 143 micrometers below the resonant frequency of 35 Hz. The mechanical sensitivity of the actuator diaphragm is 900 micrometers /A at 10 Hz and 35 Hz, respectively. An electromagnetic microactuator using the electroplated copper coil on the parylene diaphragm is expected to be useful in making a micropump for the bio-medical use.

Silver plating ensures reliable diffusion bonding of dissimilar metals

NASA Technical Reports Server (NTRS)

1967-01-01

Dissimilar metals are reliably joined by diffusion bonding when the surfaces are electroplated with silver. The process involves cleaning and etching, anodization, silver striking, and silver plating with a conventional plating bath. It minimizes the formation of detrimental intermetallic phases and provides greater tolerance of processing parameters.

Seal Materials Compatible with the Electroplating Solvent Used in Constellation-X Mirrors

NASA Technical Reports Server (NTRS)

Pei, Xiong-Skiba

1999-01-01

The existing gasket seals used in electroplating of the Constellation-X mirrors are difficult to assemble, and the current seal material is hydrophobic and too thick. The combination of the above problems result in: 1) non-uniform plating; 2) defect sites such as pits on the mirror edges; 3) "bear claws" on the edges of the mandrels and mirrors causing difficulties in shell-mirror separations; and 4) leakage of the plating solution past the seals into the mandrel causing chemical etching of the mandrel interior. This paper reports the results of this summer study in searching for alternate seal materials chemically compatible with the electroplating solvent. Fifteen common elastomeric rubber seal materials made-by Parker Seals were investigated including butyl, ethylene propylene, fluorosilicone, nitrile, Viton fluorocarbon, and silicone. Test results showed that Viton fluorocarbon compounds as a group were superior to the other tested compounds for chemical compatibility with the plating bath.

Magnetic Fe-Co films electroplated in a deep-eutectic-solvent-based plating bath

NASA Astrophysics Data System (ADS)

Yanai, T.; Shiraishi, K.; Watanabe, Y.; Ohgai, T.; Nakano, M.; Suzuki, K.; Fukunaga, H.

2015-05-01

We fabricated Fe-Co films from a deep eutectic solvent (DES)-based plating bath and investigated magnetic properties of the plated films. The plating baths were obtained by stirring the mixture of choline chloride, ethylene glycol, FeCl2.4H2O, and CoCl2.6H2O. The composition of the plated films depended on the amount of FeCl2.4H2O in the plating bath, and Fe content of the films was varied from 0 to 100 at. %. Depending on the Fe content, the saturation magnetization and the coercivity of the films varied. The Fe76Co24 film shows high saturation magnetization and smooth surface, and the change in the saturation magnetization shows good agreement with the expected change by the Slater-Pauling curve. High current efficiency (>90%) could be obtained in the wide film composition. From these results, we concluded that the DES-based plating bath is one of effective baths for the Fe-Co films with high current efficiency.

A REVIEW OF ACID COPPER PLATING BATH LIFE EXTENSION AND COPPER RECOVERY FROM ACID COPPER BATHS

EPA Science Inventory

Large quantities of hazardous waste, most in aqueous solution or sludges, are being produced at numerous metal plating and processing facilities in the U.S. Regulatory pressures, future liability, and limited landfill space have driven the cost of metal waste disposal to level...

40 CFR Appendix A to Part 122 - NPDES Primary Industry Categories

Code of Federal Regulations, 2013 CFR

2013-07-01

... coating Copper forming Electrical and electronic components Electroplating Explosives manufacturing... chemicals manufacturing Paint and ink formulation Pesticides Petroleum refining Pharmaceutical preparations...

40 CFR Appendix A to Part 122 - NPDES Primary Industry Categories

Code of Federal Regulations, 2012 CFR

2012-07-01

... coating Copper forming Electrical and electronic components Electroplating Explosives manufacturing... chemicals manufacturing Paint and ink formulation Pesticides Petroleum refining Pharmaceutical preparations...

40 CFR Appendix A to Part 122 - NPDES Primary Industry Categories

Code of Federal Regulations, 2014 CFR

2014-07-01

... coating Copper forming Electrical and electronic components Electroplating Explosives manufacturing... chemicals manufacturing Paint and ink formulation Pesticides Petroleum refining Pharmaceutical preparations...

40 CFR Appendix A to Part 122 - NPDES Primary Industry Categories

Code of Federal Regulations, 2011 CFR

2011-07-01

... coating Copper forming Electrical and electronic components Electroplating Explosives manufacturing... chemicals manufacturing Paint and ink formulation Pesticides Petroleum refining Pharmaceutical preparations...

Laser direct writing of thin-film copper structures as a modification of lithographic processes

NASA Astrophysics Data System (ADS)

Meyer, F.; Ostendorf, A.; Stute, U.

2007-04-01

This paper presents a flexible, mask-free and efficient technique for UV-laser micropatterning of photosensitive resist by laser direct writing (LDW). Photo resist spun on gold sputtered silicon wafers has been laser structured by a scanner guided 266nm DPSSL and electroplated. Ablation behaviour and optimum seed layer preparation in relation to parameters like pulse energy, scanning speed and number of scanned cycles and the electroplating results are discussed. The resulting adhesive strength was measured by a µ-sear device and the gold seed layer-plated copper interface investigated by SEM and EDX to explain correlation to identified bonding behaviour. Improved adhesive strength was observed with higher laser pulse energy and reduced number of cycle.

A Combined Theoretical and Experimental Study for Silver Electroplating

PubMed Central

Liu, Anmin; Ren, Xuefeng; An, Maozhong; Zhang, Jinqiu; Yang, Peixia; Wang, Bo; Zhu, Yongming; Wang, Chong

2014-01-01

A novel method combined theoretical and experimental study for environmental friendly silver electroplating was introduced. Quantum chemical calculations and molecular dynamic (MD) simulations were employed for predicting the behaviour and function of the complexing agents. Electronic properties, orbital information, and single point energies of the 5,5-dimethylhydantoin (DMH), nicotinic acid (NA), as well as their silver(I)-complexes were provided by quantum chemical calculations based on density functional theory (DFT). Adsorption behaviors of the agents on copper and silver surfaces were investigated using MD simulations. Basing on the data of quantum chemical calculations and MD simulations, we believed that DMH and NA could be the promising complexing agents for silver electroplating. The experimental results, including of electrochemical measurement and silver electroplating, further confirmed the above prediction. This efficient and versatile method thus opens a new window to study or design complexing agents for generalized metal electroplating and will vigorously promote the level of this research region. PMID:24452389

TREATMENT OF METALS PRIOR TO ELECTROPLATING

DOEpatents

Huddle, R.A.U.; Flint, O.

1958-05-20

The preparation of certain metal surfaces to receive electrodeposits is described. Surfaces of the metals are subjected to shot blasting by ferrous metal shot, and the surfaces then are given a coating of copper by displacement from a copper salt solution. The method applies to U, Zr, Ti, Ta, Ni, Mo, W, and V.

Effect of Current Density and Plating Time on Cu Electroplating in TSV and Low Alpha Solder Bumping

NASA Astrophysics Data System (ADS)

Jung, Do-Hyun; Sharma, Ashutosh; Kim, Keong-Heum; Choo, Yong-Chul; Jung, Jae-Pil

2015-03-01

In this study, copper filling in through-silicon via (TSV) by pulse periodic reverse electroplating and low alpha solder bumping on Cu-filled TSVs was investigated. The via diameter and depth of TSV were 60 and 120 µm, respectively. The experimental results indicated that the thickness of electrodeposited copper layer increased with increasing cathodic current density and plating time. The electroplated Cu in TSV showed a typical bottom-up filling. A defectless, complete, and fast 100% Cu-filled TSV was achieved at cathodic and anodic current densities of -8 and 16 mA/cm2 for a plating time of 4 h, respectively. A sound low alpha solder ball, Sn-1.0 wt.% Ag-0.5 wt.% Cu (SAC 105) with a diameter of 83 µm and height of 66 µm was reflow processed at 245 °C on Cu-filled TSV. The Cu/solder joint interface was subjected to high temperature aging at 85 °C for 150 h, which showed an excellent bonding characteristic with minimum Cu-Sn intermetallic compounds growth.

Production of Ultra-Light Normal Incidence Mirrors

NASA Technical Reports Server (NTRS)

Jones, Ruth; Muntele, Iulia; Muntele, Claudiu; Zimmerman, Robert L.; Ila, Daryush; Burdine, Robert V. (Technical Monitor)

2002-01-01

Mirrors fabrication for large aperture telescopes is an important aspect in space exploration programs. One of the cost effective techniques to obtain such mirrors is electroplating of Ni-Co alloys from sulfamate solution. The Center for Irradiation of Materials at Alabama A&M University - Research Institute has been involved in a NASA-MSFC project for producing ultra-light Ni-Co alloy mirrors since the summer of year 2000. The goal of this project is to obtain ultra-light, high strength electroformed large aperture normal incidence replicated mirrors, (weighting less than 5 kg/m2), free of stress, with a good figure and reproducible thickness variation. In order to simplify the control of parameters such as temperature gradient, concentration gradient, distribution of the electric field lines and flow control, the proposed geometry involves a cylindrical main tank contained in another cylindrical tank, which plays the role of a weir. Designs were created to accommodate the new horizontal position of the mandrel and the pipes fitting through the outer tank's lid. The inner tank contains the working electrodes and a series of sensors for monitoring temperature, flow, stress and pH. The outer tank holds the electric heaters, the filters and a part of the piping system. Another two tanks complete the setup and serve for rinsing/preheating and equilibrating the electroplating bath. This paper will describe advantages of the new experimental setup and the parameters achieved in the electroplating bath for the proposed geometry.

Status of black chrome coating research

DOE Office of Scientific and Technical Information (OSTI.GOV)

Pettit, R.B.; Sowell, R.R.

1983-01-01

Recent results regarding the optimization of electrodeposited black chrome solar selective coatings for operation in solar collectors to temperatures up to 300/sup 0/C are summarized. Careful control of the electroplating-bath composition and special regard for bath contamination are required in order to obtain coatings that will survive daily collector operation for tens of years. An accelerated temperature aging test is presented which can be used both to estimate the coating lifetime and to monitor the coating during production. Finally, the use of sol-gel protective films to extend the lifetime of the black chrome coating is also discussed.

40 CFR Appendix Xii to Part 266 - Nickel or Chromium-Bearing Materials that may be Processed in Exempt Nickel-Chromium Recovery...

Code of Federal Regulations, 2012 CFR

2012-07-01

... sweepings Air filters Electroplating bath filters Wastewater filter media Wood pallets Disposable clothing... cartridge filters Paper hand towels B. Exempt Nickel or Chromium-Bearing Materials when Generated by Any... Nickel, chromium, and iron catalysts Nickel-cadmium and nickel-iron batteries Filter cake from wet...

40 CFR Appendix Xii to Part 266 - Nickel or Chromium-Bearing Materials that may be Processed in Exempt Nickel-Chromium Recovery...

Code of Federal Regulations, 2014 CFR

2014-07-01

... sweepings Air filters Electroplating bath filters Wastewater filter media Wood pallets Disposable clothing... cartridge filters Paper hand towels B. Exempt Nickel or Chromium-Bearing Materials when Generated by Any... Nickel, chromium, and iron catalysts Nickel-cadmium and nickel-iron batteries Filter cake from wet...

40 CFR Appendix Xii to Part 266 - Nickel or Chromium-Bearing Materials that may be Processed in Exempt Nickel-Chromium Recovery...

Code of Federal Regulations, 2010 CFR

2010-07-01

... sweepings Air filters Electroplating bath filters Wastewater filter media Wood pallets Disposable clothing... cartridge filters Paper hand towels B. Exempt Nickel or Chromium-Bearing Materials when Generated by Any... Nickel, chromium, and iron catalysts Nickel-cadmium and nickel-iron batteries Filter cake from wet...

40 CFR Appendix Xii to Part 266 - Nickel or Chromium-Bearing Materials that may be Processed in Exempt Nickel-Chromium Recovery...

Code of Federal Regulations, 2013 CFR

2013-07-01

... sweepings Air filters Electroplating bath filters Wastewater filter media Wood pallets Disposable clothing... cartridge filters Paper hand towels B. Exempt Nickel or Chromium-Bearing Materials when Generated by Any... Nickel, chromium, and iron catalysts Nickel-cadmium and nickel-iron batteries Filter cake from wet...

40 CFR Appendix Xii to Part 266 - Nickel or Chromium-Bearing Materials that may be Processed in Exempt Nickel-Chromium Recovery...

Code of Federal Regulations, 2011 CFR

2011-07-01

... sweepings Air filters Electroplating bath filters Wastewater filter media Wood pallets Disposable clothing... cartridge filters Paper hand towels B. Exempt Nickel or Chromium-Bearing Materials when Generated by Any... Nickel, chromium, and iron catalysts Nickel-cadmium and nickel-iron batteries Filter cake from wet...

Structural, mechanical and magnetic study on galvanostatic electroplated nanocrystalline NiFeP thin films

NASA Astrophysics Data System (ADS)

Kalaivani, A.; Senguttuvan, G.; Kannan, R.

2018-03-01

Nickel based alloys has a huge applications in microelectronics and micro electromechanical systems owing to its superior soft magnetic properties. With the advantages of simplicity, cost-effectiveness and controllable patterning, electroplating processes has been chosen to fabricate thin films in our work. The soft magnetic NiFeP thin film was successfully deposited over the surface of copper plate through galvanostatic electroplating method by applying constant current density of 10 mA cm-2 for a deposition rate for half an hour. The properties of the deposited NiFeP thin films were analyzed by subjecting it into different physio-chemical characterization such as XRD, SEM, EDAX, AFM and VSM. XRD pattern confirms the formation of NiFeP particles and the structural analysis reveals that the NiFeP particles were uniformly deposited over the surface of copper substrate. The surface roughness analysis of the NiFeP films was done using AFM analysis. The magnetic studies and the hardness of the thin film were evaluated from the VSM and hardness test. The NiFeP thin films possess lower coercivity with higher magnetization value of 69. 36 × 10-3 and 431.92 Gauss.

PROCESS OF ELECTROPLATING METALS WITH ALUMINUM

DOEpatents

Schickner, W.C.

1960-04-26

A process of electroplating aluminum on metals from a nonaqueous bath and a novel method of pretreating or conditioning the metal prior to electrodeposition of the aluminum are given. The process of this invention, as applied by way of example to the plating of uranium, comprises the steps of plating the uranium with the barrier inetal, immersing the barrier-coated uranium in fatty acid, and electrolyzing a water-free diethyl ether solution of aluminum chloride and lithium hydride while making the uranium the cathode until an aluminum deposit of the desired thickness has been formed. According to another preferred embodiment the barrier-coated uranium is immersed in an isopropyl alcohol solution of sterato chromic chloride prior to the fatty acid treatment of this invention.

Investigation of the storage and release of oxygen in a Cu-Pt element of a high-temperature microcombustor

NASA Astrophysics Data System (ADS)

Khaji, Z.; Sturesson, P.; Hjort, K.; Klintberg, L.; Thornell, G.

2014-11-01

A miniature combustor for converting organic samples into CO2 with application in carbon isotopic measurements has been manufactured and evaluated. The combustor was made of High-Temperature Co-fired Ceramic (HTCC) alumina green tapes. The device has a built-in screen printed heater and a temperature sensor made of platinum, co-sintered with the ceramic. A copper oxide oxygen supply was added to the combustor after sintering by in-situ electroplating of copper on the heater pattern followed by thermal oxidation. Scanning Electron Microscopy (SEM), Energy Dispersive Spectroscopy (EDS) and Thermal Gravimetric Analysis (TGA) were used to study electroplating, oxidation and the oxide reduction processes. The temperature sensor was calibrated by use of a thermocouple. It demonstrates a temperature coefficient resistance of 4.66×10-3/°C between 32 and 660 °C. The heat characterization was done up to 1000 °C by using IR thermography, and the results were compared with the data from the temperature sensor. Combustion of starch confirmed the feasibility of using copper oxide as the source of oxygen of combustion.

Modeling and Implementation of Solder-activated Joints for Single Actuator, Centimeter-Scale Robotic Mechanisms

DTIC Science & Technology

2010-06-01

Modulus Ratio Annealed Copper 1.0 1.0 1.0 6066 Aluminum 0.63 2.48 3.96 High-Temp Nitinol 0.68 16.8 24.7 1095 Spring Steel 1.82 16.5 9.08 106 5.2.2...were: copper, aluminum, Nitinol , and spring steel. The wetting ability of aluminum and Nitinol to lead-tin solders is poor. There are solders that have...32],[33]. Copper plating may be used to improve a material’s solderability. Nitinol and aluminum are not easily electroplated with copper. Steel and

Application of three tailing-based composites in treating comprehensive electroplating wastewater.

PubMed

Liu, Hongbo; Zhu, Mengling; Gao, Saisai

2014-01-01

Heavy metals and chemical oxygen demand (COD) are major challenging pollutants for most electroplating wastewater treatment plants. A novel composite material, prepared with a mixture of calcium and sodium compounds and tailings, was simply mixed by ratios and used to treat a comprehensive electroplating wastewater with influent COD, total copper (T-Cu), and total nickel (T-Ni) respectively as 690, 4.01, and 20.60 mg/L on average. Operational parameters, i.e. the contact time, pH, mass ratio of calcium and sodium compounds and tailings, were optimized as 30 min, 10.0, and 4:2:1. Removal rates for COD, T-Cu, and T-Ni could reach 71.8, 90.5, and 98.1%, respectively. No significant effect of initial concentrations on removal of T-Cu and T-Ni was observed for the composite material. The adsorption of Cu(II) and Ni(II) on the material fitted Langmuir and Freundlich isotherms respectively. Weight of waste sludge from the calcium/sodium-tailing system after reaction was 10% less than that from the calcium-tailing system. The tailing-based composite is cost-effective in combating comprehensive electroplating pollution, which shows a possibility of applying the tailings in treating electroplating wastewater.

A Water Model Study on Mixing Behavior of the Two-Layered Bath in Bottom Blown Copper Smelting Furnace

NASA Astrophysics Data System (ADS)

Shui, Lang; Cui, Zhixiang; Ma, Xiaodong; Jiang, Xu; Chen, Mao; Xiang, Yong; Zhao, Baojun

2018-05-01

The bottom-blown copper smelting furnace is a novel copper smelter developed in recent years. Many advantages of this furnace have been found, related to bath mixing behavior under its specific gas injection scheme. This study aims to use an oil-water double-phased laboratory-scale model to investigate the impact of industry-adjustable variables on bath mixing time, including lower layer thickness, gas flow rate, upper layer thickness and upper layer viscosity. Based on experimental results, an overall empirical relationship of mixing time in terms of these variables has been correlated, which provides the methodology for industry to optimize mass transfer in the furnace.

Remediation System Evaluation, Peerless Plating Site

EPA Pesticide Factsheets

The Peerless Plating Superfund Site is located at 2554 South Getty Street, north of the intersection of South Getty Street and East Sherman Boulevard in Muskegon, Michigan. Copper, nickel, chromium, cadmium, and zinc electroplating operations as well as...

An investigation of supercritical-CO2 copper electroplating parameters for application in TSV chips

NASA Astrophysics Data System (ADS)

Chuang, Ho-Chiao; Lai, Wei-Hong; Sanchez, Jorge

2015-01-01

This study uses supercritical electroplating for the filling of through silicon vias (TSVs) in chips. The present study utilizes the inductively coupled plasma reactive ion etching (ICP RIE) process technique to etch the TSVs and discusses different supercritical-CO2 electroplating parameters, such as the supercritical pressure, the electroplating current density’s effect on the TSV Cu pillar filling time, the I-V curve, the electrical resistance and the hermeticity. In addition, the results for all the tests mentioned above have been compared to results from traditional electroplating techniques. For the testing, we will first discuss the hermeticity of the TSV Cu pillars, using a helium leaking test apparatus to assess the vacuum sealing of the fabricated TSV Cu pillars. In addition, this study also conducts tests for the electrical properties, which include the measurement of the electrical resistance of the TSV at both ends in the horizontal direction, followed by the passing of a high current (10 A, due to probe limitations) to check if the TSV can withstand it without burnout. Finally, the TSV is cut in half in cross-section to observe the filling of Cu pillars by the supercritical electroplating and check for voids. The important characteristic of this study is the use of the supercritical electroplating process without the addition of any surfactants to aid the filling of the TSVs, but by taking advantage of the high permeability and low surface tension of supercritical fluids to achieve our goal. The results of this investigation point to a supercritical pressure of 2000 psi and a current density of 3 A dm-2 giving off the best electroplating filling and hermeticity, while also being able to withstand a high current of 10 A, with a relatively short electroplating time of 3 h (when compared to our own traditional dc electroplating).

Laser etching of polymer masked leadframes

NASA Astrophysics Data System (ADS)

Ho, C. K.; Man, H. C.; Yue, T. M.; Yuen, C. W.

1997-02-01

A typical electroplating production line for the deposition of silver pattern on copper leadframes in the semiconductor industry involves twenty to twenty five steps of cleaning, pickling, plating, stripping etc. This complex production process occupies large floor space and has also a number of problems such as difficulty in the production of rubber masks and alignment, generation of toxic fumes, high cost of water consumption and sometimes uncertainty on the cleanliness of the surfaces to be plated. A novel laser patterning process is proposed in this paper which can replace many steps in the existing electroplating line. The proposed process involves the application of high speed laser etching techniques on leadframes which were protected with polymer coating. The desired pattern for silver electroplating is produced by laser ablation of the polymer coating. Excimer laser was found to be most effective for this process as it can expose a pattern of clean copper substrate which can be silver plated successfully. Previous working of Nd:YAG laser ablation showed that 1.06 μm radiation was not suitable for this etching process because a thin organic and transparent film remained on the laser etched region. The effect of excimer pulse frequency and energy density upon the removal rate of the polymer coating was studied.

Theory and performance of plated thermocouples.

NASA Technical Reports Server (NTRS)

Pesko, R. N.; Ash, R. L.; Cupschalk, S. G.; Germain, E. F.

1972-01-01

A theory has been developed to describe the performance of thermocouples which have been formed by electroplating portions of one thermoelectric material with another. The electroplated leg of the thermocouple was modeled as a collection of infinitesimally small homogeneous thermocouples connected in series. Experiments were performed using several combinations of Constantan wire sizes and copper plating thicknesses. A transient method was used to develop the thermoelectric calibrations, and the theory was found to be in quite good agreement with the experiments. In addition, data gathered in a Soviet experiment were also found to be in close agreement with the theory.

Quick-Change Anode for Plating

NASA Technical Reports Server (NTRS)

Beasley, J. L.

1987-01-01

Proposed fastener for attaching electroplating anode improves quality of plating and increases productivity. Notches in twist-lock fastener mates with projections on end of anode bar. Fastener made of titanium for compatibility with copper-plating solution. Also constructed in snap-on, snap-off configuration.

Installation Restoration Program. Phase 1: Records Search, Williams AFB, Arizona

DTIC Science & Technology

1984-02-01

Minimum 4.5 Trace substances, maximum -. allowable limits, (mg/1) Arsenic 2.00 Boron 1.00 Cadmium 0.05 Chromium (hexavalent and trivalent ) 1.00 Copper...located in Building 32. Chromium , cadmium, and copper electroplating operations were conducted in a temporary building, T-31 . Paint stripping was... chromium plating wastes. The paint separator receives wastes from paint stri.pping operations that are performed in Buildings 25 and 1086. It also

Copper stabilization in beneficial use of waterworks sludge and copper-laden electroplating sludge for ceramic materials.

PubMed

Tang, Yuanyuan; Chan, Siu-Wai; Shih, Kaimin

2014-06-01

A promising strategy for effectively incorporating metal-containing waste materials into a variety of ceramic products was devised in this study. Elemental analysis confirmed that copper was the predominant metal component in the collected electroplating sludge, and aluminum was the predominant constituent of waterworks sludge collected in Hong Kong. The use of waterworks sludge as an aluminum-rich precursor material to facilitate copper stabilization under thermal conditions provides a promising waste-to-resource strategy. When sintering the mixture of copper sludge and the 900 °C calcined waterworks sludge, the CuAl2O4 spinel phase was first detected at 650 °C and became the predominant product phase at temperatures higher than 850 °C. Quantification of the XRD pattern using the Rietveld refinement method revealed that the weight of the CuAl2O4 spinel phase reached over 50% at 850 °C. The strong signals of the CuAl2O4 phase continued until the temperature reached 1150 °C, and further sintering initiated the generation of the other copper-hosting phases (CuAlO2, Cu2O, and CuO). The copper stabilization effect was evaluated by the copper leachability of the CuAl2O4 and CuO via the prolonged leaching experiments at a pH value of 4.9. The leaching results showed that the CuAl2O4 phase was superior to the CuAlO2 and CuO phases for immobilizing hazardous copper over longer leaching periods. The findings clearly indicate that spinel formation is the most crucial metal stabilization mechanism when sintering multiphase copper sludge with aluminum-rich waterworks sludge, and suggest a promising and reliable technique for reusing both types of sludge waste for ceramic materials. Copyright © 2013 Elsevier Ltd. All rights reserved.

The influence of heavy metals on the polymorphs of dicalcium silicate in the belite-rich clinkers produced from electroplating sludge.

PubMed

Chen, Ying-Liang; Shih, Pai-Haung; Chiang, Li-Choung; Chang, Yi-Kuo; Lu, Hsing-Cheng; Chang, Juu-En

2009-10-15

The purpose of this study is to utilize an electroplating sludge for belite-rich clinker production and to observe the influence of heavy metals on the polymorphs of dicalcium silicate (C(2)S). Belite-rich clinkers prepared with 0.5-2% of NiO, ZnO, CuO, and Cr(2)O(3) were used to investigate the individual effects of the heavy metals in question. The Reference Intensity Ratio (RIR) method was employed to determine the weight fractions of gamma-C(2)S and beta-C(2)S in the clinkers, and their microstructures were examined by the transmission electron microscopy (TEM). The results showed that nickel, zinc, and chromium have positive effects on beta-C(2)S stabilization (Cr(3+)>Ni(2+)>Zn(2+)), whereas copper has a negative effect. The addition of up to 10% electroplating sludge did not have any negative influence on the formation of C(2)S. It was observed that gamma-C(2)S decreased while beta-C(2)S increased with a rise in the addition of the electroplating sludge. Moreover, nickel and chromium mainly contributed to stabilizing beta-C(2)S in the belite-rich clinkers produced from the electroplating sludge.

METAL COATING BATHS

DOEpatents

Robinson, J.W.

1958-08-26

A method is presented for restoring the effectiveness of bronze coating baths used for hot dip coating of uranium. Such baths, containing a high proportion of copper, lose their ability to wet uranium surfaces after a period of use. The ability of such a bath to wet uranium can be restored by adding a small amount of metallic aluminum to the bath, and skimming the resultant hard alloy from the surface.

Changes in the Strength of the Polymer Concrete Used in the Electroplating Vats Under Operational Load

NASA Astrophysics Data System (ADS)

Radna, Lidia; Sakharov, Volodymyr

2017-12-01

Due to the strong and aggressive electrolyte media and thermal load, design of the electroplating vats in the copper industry often relies on the resin concrete. The article presents the results of the strength tests of the polymer concrete based on the "Derakane" resin, used in the construction of electroplating vats. Samples were taken from the real vats - both new and 17-year old. Strength tests included compression and bending tensile strength test. To assess the effect of operational conditions the tests were performed on the same-age vats, some of which were never used while others were subjected to the operational load. During the operation, the vats sustained load of the anode and cathode weights, cyclic electrolyte loading with a temperatures up to 60°C. As a result, it was noted that the operational conditions led to the increased strength of the polymer concrete material.

Silicon dendritic web material

NASA Technical Reports Server (NTRS)

Meier, D. L.; Campbell, R. B.; Sienkiewicz, L. J.; Rai-Choudhury, P.

1982-01-01

The development of a low cost and reliable contact system for solar cells and the fabrication of several solar cell modules using ultrasonic bonding for the interconnection of cells and ethylene vinyl acetate as the potting material for module encapsulation are examined. The cells in the modules were made from dendritic web silicon. To reduce cost, the electroplated layer of silver was replaced with an electroplated layer of copper. The modules that were fabricated used the evaporated Ti, Pd, Ag and electroplated Cu (TiPdAg/Cu) system. Adherence of Ni to Si is improved if a nickel silicide can be formed by heat treatment. The effectiveness of Ni as a diffusion barrier to Cu and the ease with which nickel silicide is formed is discussed. The fabrication of three modules using dendritic web silicon and employing ultrasonic bonding for interconnecting calls and ethylene vinyl acetate as the potting material is examined.

Silicon dendritic web material

NASA Astrophysics Data System (ADS)

Meier, D. L.; Campbell, R. B.; Sienkiewicz, L. J.; Rai-Choudhury, P.

1982-03-01

The development of a low cost and reliable contact system for solar cells and the fabrication of several solar cell modules using ultrasonic bonding for the interconnection of cells and ethylene vinyl acetate as the potting material for module encapsulation are examined. The cells in the modules were made from dendritic web silicon. To reduce cost, the electroplated layer of silver was replaced with an electroplated layer of copper. The modules that were fabricated used the evaporated Ti, Pd, Ag and electroplated Cu (TiPdAg/Cu) system. Adherence of Ni to Si is improved if a nickel silicide can be formed by heat treatment. The effectiveness of Ni as a diffusion barrier to Cu and the ease with which nickel silicide is formed is discussed. The fabrication of three modules using dendritic web silicon and employing ultrasonic bonding for interconnecting calls and ethylene vinyl acetate as the potting material is examined.

Integrated on-chip inductors with electroplated magnetic yokes (invited)

NASA Astrophysics Data System (ADS)

Wang, Naigang; O'Sullivan, Eugene J.; Herget, Philipp; Rajendran, Bipin; Krupp, Leslie E.; Romankiw, Lubomyr T.; Webb, Bucknell C.; Fontana, Robert; Duch, Elizabeth A.; Joseph, Eric A.; Brown, Stephen L.; Hu, Xiaolin; Decad, Gary M.; Sturcken, Noah; Shepard, Kenneth L.; Gallagher, William J.

2012-04-01

Thin-film ferromagnetic inductors show great potential as the energy storage element for integrated circuits containing on-chip power management. In order to achieve the high energy storage required for power management, on-chip inductors require relatively thick magnetic yoke materials (several microns or more), which can be readily deposited by electroplating through a photoresist mask as demonstrated in this paper, the yoke material of choice being Ni45Fe55, whose properties of relatively high moment and electrical resistivity make it an attractive model yoke material for inductors. Inductors were designed with a variety of yoke geometries, and included both single-turn and multi-turn coil designs, which were fabricated on 200 mm silicon wafers in a CMOS back-end-of-line (BEOL) facility. Each inductor consisted of electroplated copper coils enclosed by the electroplated Ni45Fe55 yokes; aspects of the fabrication of the inductors are discussed. Magnetic properties of the electroplated yoke materials are described, including high frequency permeability measurements. The inductance of 2-turn coil inductors, for example, was enhanced up to about 6 times over the air core equivalent, with an inductance density of 130 nH/mm2 being achieved. The resistance of these non-laminated inductors was relatively large at high frequency due to magnetic and eddy current losses but is expected to improve as the yoke material/structure is further optimized, making electroplated yoke-containing inductors attractive for dc-dc power converters.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Sandoval-Paz, M.G., E-mail: myrnasandoval@udec.cl; Rodríguez, C.A.; Porcile-Saavedra, P.F.

Copper (I) selenide thin films with orthorhombic and cubic structure were deposited on glass substrates by using the chemical bath deposition technique. The effects of the solution pH on the films growth and subsequently the structural, optical and electrical properties of the films were studied. Films with orthorhombic structure were obtained from baths wherein both metal complex and hydroxide coexist; while films with cubic structure were obtained from baths where the metal hydroxide there is no present. The structural modifications are accompanied by changes in bandgap energy, morphology and electrical resistivity of the films. - Graphical abstract: “Study of themore » crystallographic phase change on copper (I) selenide thin films prepared through chemical bath deposition by varying the pH of the solution” by M. G. Sandoval-Paz, C. A. Rodríguez, P. F. Porcile-Saavedra, C. Trejo-Cruz. Display Omitted - Highlights: • Copper (I) selenide thin films were obtained by chemical bath deposition. • Orthorhombic to cubic phase change was induced by varying the reaction solution pH. • Orthorhombic phase is obtained mainly from a hydroxides cluster mechanism. • Cubic phase is obtained mainly from an ion by ion mechanism. • Structural, optical and electrical properties are presented as a function of pH.« less

Tested Demonstrations.

ERIC Educational Resources Information Center

Gilbert, George L., Ed.

1986-01-01

Outlines a simple, inexpensive way of demonstrating electroplating using the reaction between nickel ions and copper metal. Explains how to conduct a demonstration of the electrolysis of water by using a colored Na2SO4 solution as the electrolyte so that students can observe the pH changes. (TW)

Fabrication of through-silicon via arrays by photo-assisted electrochemical etching and supercritical electroplating

NASA Astrophysics Data System (ADS)

Chuang, Ho-Chiao; Yang, Hsi-Min; Wu, Cheng-Xiang; Sanchez, Jorge; Shyu, Jenq-Huey

2017-01-01

This paper aims to fabricate high aspect ratio through silicon via (TSV) by photo-assisted electrochemical etching (PAECE) and supercritical CO2 copper electroplating. A blind-holed silicon array was first fabricated by PAECE. By studying the etching parameters, including hydrofluoric acid concentration, etchant temperature, stirring speed, tetrabutylammonium perchlorate (TBAP) content, and Ohmic contact thickness, an array of pores with a 1∶45 aspect ratio (height=250 μm and diameter=5.5 μm) was obtained successfully. Moreover, TBAP and Kodak Photo-Flo (PF) solution were added into the etchant to acquire smooth sidewalls for the first time. TBAP was added for the first time to serve as an antistatic agent in deionized water-based etchant to prevent side-branch etching, and PF was used to degasify hydrogen bubbles in the etchant. The effect of gold thickness over Ohmic contact was investigated. Randomized etching was observed with an Au thickness of 200 Å, but it can be improved by increasing the etching voltage. The silicon mold of through-holes was filled with metal using supercritical CO2 copper electroplating, which features high diffusivity, permeability, and density. The TSV structure (aspect ratio=1∶35) was obtained at a supercritical pressure of 2000 psi, temperature of 50°C, and current density of 30 mA/cm2 in 2.5 h.

Uranium dioxide electrolysis

DOEpatents

Willit, James L [Batavia, IL; Ackerman, John P [Prescott, AZ; Williamson, Mark A [Naperville, IL

2009-12-29

This is a single stage process for treating spent nuclear fuel from light water reactors. The spent nuclear fuel, uranium oxide, UO.sub.2, is added to a solution of UCl.sub.4 dissolved in molten LiCl. A carbon anode and a metallic cathode is positioned in the molten salt bath. A power source is connected to the electrodes and a voltage greater than or equal to 1.3 volts is applied to the bath. At the anode, the carbon is oxidized to form carbon dioxide and uranium chloride. At the cathode, uranium is electroplated. The uranium chloride at the cathode reacts with more uranium oxide to continue the reaction. The process may also be used with other transuranic oxides and rare earth metal oxides.

Electroplating of aluminium microparticles with nickel to synthesise reactive core-shell structures for thermal joining applications

NASA Astrophysics Data System (ADS)

Schreiber, S.; Zaeh, M. F.

2018-06-01

Reactive particles represent a promising alternative for effectively joining components with freeform surfaces and different material properties. While the primary application of reactive systems is combustion synthesis for the production of high-performance alloys, the highly exothermic reaction can also be used to firmly bond thermosensitive joining partners. Core-shell structures are of special interest, since they function as separate microreactors. In this paper, a method to synthesise reactive nickel-aluminium core-shell structures via a two-step plating process is described. Based on an electroless process, the natural oxide layer of the aluminium particles is removed and substituted with a thin layer of nickel. Subsequently, the pre-treated particles are electroplated with nickel. The high reactivity of aluminium and the oxide layer play a significant role in adjusting the process parameters of the Watts bath. Additionally, the developed experimental set-up is introduced and the importance of process control is shown. In order to achieve reproducible results, the electroplating process was automated. Ignition tests with electromagnetic waves demonstrated that the particles undergo an exothermic reaction. Therefore, they can be used as a heat source in thermal joining applications.

Electroplating offers embrittlement protection

NASA Technical Reports Server (NTRS)

Daniels, C. M., Jr.

1970-01-01

Thin copper electrodeposited layer protects metal parts in environments with which they may be incompatible. Originally developed for main engine of Space Shuttle where high strength nickle alloy bellows must operate in high-pressure hydrogen, technique protects nickel and is unaffected by forming process or subsequent heat treatment and preinstallation processing.

New configuration for efficient and durable copper coating on the outer surface of a tube

DOE PAGES

Ahmad, Irfan; Chapman, Steven F.; Velas, Katherine M.; ...

2017-03-27

A well-adhered copper coating on stainless steel power coupler parts is required in superconducting radio frequency (SRF) accelerators. Radio frequency power coupler parts are complex, tubelike stainless steel structures, which require copper coating on their outer and inner surfaces. Conventional copper electroplating sometimes produces films with inadequate adhesion strength for SRF applications. Electroplating also requires a thin nickel strike layer under the copper coating, whose magnetic properties can be detrimental to SRF applications. Coaxial energetic deposition (CED) and sputtering methods have demonstrated efficient conformal coating on the inner surfaces of tubes but coating the outer surface of a tube ismore » challenging because these coating methods are line of sight. When the substrate is off axis and the plasma source is on axis, only a small section of the substrate’s outer surface is exposed to the source cathode. The conventional approach is to rotate the tube to achieve uniformity across the outer surface. This method results in poor film thickness uniformity and wastes most of the source plasma. Alameda Applied Sciences Corporation (AASC) has developed a novel configuration called hollow external cathode CED (HEC-CED) to overcome these issues. HEC-CED produces a film with uniform thickness and efficiently uses all eroded source material. Furthermore, the Cu film deposited on the outside of a stainless steel tube using the new HEC-CED configuration survived a high pressure water rinse adhesion test. HEC-CED can be used to coat the outside of any cylindrical structure.« less

New configuration for efficient and durable copper coating on the outer surface of a tube

DOE Office of Scientific and Technical Information (OSTI.GOV)

Ahmad, Irfan; Chapman, Steven F.; Velas, Katherine M.

A well-adhered copper coating on stainless steel power coupler parts is required in superconducting radio frequency (SRF) accelerators. Radio frequency power coupler parts are complex, tubelike stainless steel structures, which require copper coating on their outer and inner surfaces. Conventional copper electroplating sometimes produces films with inadequate adhesion strength for SRF applications. Electroplating also requires a thin nickel strike layer under the copper coating, whose magnetic properties can be detrimental to SRF applications. Coaxial energetic deposition (CED) and sputtering methods have demonstrated efficient conformal coating on the inner surfaces of tubes but coating the outer surface of a tube ismore » challenging because these coating methods are line of sight. When the substrate is off axis and the plasma source is on axis, only a small section of the substrate’s outer surface is exposed to the source cathode. The conventional approach is to rotate the tube to achieve uniformity across the outer surface. This method results in poor film thickness uniformity and wastes most of the source plasma. Alameda Applied Sciences Corporation (AASC) has developed a novel configuration called hollow external cathode CED (HEC-CED) to overcome these issues. HEC-CED produces a film with uniform thickness and efficiently uses all eroded source material. Furthermore, the Cu film deposited on the outside of a stainless steel tube using the new HEC-CED configuration survived a high pressure water rinse adhesion test. HEC-CED can be used to coat the outside of any cylindrical structure.« less

Oxidation kinetics of molten copper sulfide

NASA Astrophysics Data System (ADS)

Alyaser, A. H.; Brimacombe, J. K.

1995-02-01

The oxidation kinetics of molten Cu2S baths, during top lancing with oxygen/nitrogen (argon) mixtures, have been investigated as a function of oxygen partial pressure (0.2 to 0.78), bath temperature (1200 °C to 1300 °C), gas flow rate (1 to 4 L/min), and bath mixing. Surface-tension-driven flows (the Marangoni effect) were observed both visually and photographically. Thus, the oxidation of molten Cu2S was found to progress in two distinct stages, the kinetics of which are limited by the mass transfer of oxygen in the gas phase to the melt surface. During the primary stage, the melt is partially desulfurized while oxygen dissolves in the liquid sulfide. Upon saturation of the melt with oxygen, the secondary stage commences in which surface and bath reactions proceed to generate copper and SO2 electrochemically. A mathematical model of the reaction kinetics has been formulated and tested against the measurements. The results of this study shed light on the process kinetics of the copper blow in a Peirce-Smith converter or Mitsubishi reactor.

Isolation and characterization of Bacillus cereus IST105 from electroplating effluent for detoxification of hexavalent chromium.

PubMed

Naik, Umesh Chandra; Srivastava, Shaili; Thakur, Indu Shekhar

2011-08-01

Electroplating industries are the main sources of heavy metals, chromium, nickel, lead, zinc, cadmium and copper. The highest concentrations of chromium (VI) in the effluent cause a direct hazards to human and animals. Therefore, there is a need of an effective and affordable biotechnological solution for removal of chromium from electroplating effluent. Bacterial strains were isolated from electroplating effluent to find out higher tolerant isolate against chromate. The isolate was identified by 16S rDNA sequence analysis. Absorbed chromium level of bacterium was determined by inductively coupled plasma-atomic emission spectrometer (ICP-AES), atomic absorption spectrophotometer (AAS), scanning electron microscope (SEM), transmission electron microscope (TEM) and energy dispersive X-ray analysis (EDX). Removal of metals by bacterium from the electroplating effluent eventually led to the detoxification of effluent confirmed by MTT assay. Conformational changes of functional groups of bacterial cell surface were studied through Fourier transform infrared spectroscopy. The chromate tolerant isolate was identified as Bacillus cereus. Bacterium has potency to remove more than 75% of chromium as measured by ICP-AES and AAS. The study indicated the accumulation of chromium (VI) on bacterial cell surface which was confirmed by the SEM-EDX and TEM analysis. The biosorption of metals from the electroplating effluent eventually led to the detoxification of effluent. The increased survivability of Huh7 cells cultured with treated effluent also confirmed the detoxification as examined by MTT assay. Isolated strain B. cereus was able to remove and detoxify chromium (VI). It would be an efficient tool of the biotechnological approach in mitigating the heavy metal pollutants.

Navy Electroplating Pollution Control Technology Assessment Manual.

DTIC Science & Technology

1984-02-01

quality. Dummying of chromium baths is used in the special case where high cathode-to-anode 5ea ratio has resulted in build up of trivalent chromium (Cr...Dummying with a high anode -to-cat hode area ratio can be 6used to reoxidize the trivalent to hexavalent chromium (Cr ).Proper scheduling of work can...unit processes: * Chromium reduction (if needed) of segregated chromium waste streams to reduce the chromium from its hexavalent form to the trivalent

Risk of hydrocyanic acid release in the electroplating industry.

PubMed

Piccinini, N; Ruggiero, G N; Baldi, G; Robotto, A

2000-01-07

This paper suggests assessing the consequences of hydrocyanic acid (HCN) release into the air by aqueous cyanide solutions in abnormal situations such as the accidental introduction of an acid, or the insertion of a cyanide in a pickling bath. It provides a well-defined source model and its resolution by methods peculiar to mass transport phenomena. The procedure consists of four stages: calculation of the liquid phase concentration, estimate of the HCN liquid-vapour equilibrium, determination of the mass transfer coefficient at the liquid-vapour interface, evaluation of the air concentration of HCN and of the damage distances. The results show that small baths operating at high temperatures are the major sources of risk. The building up of lethal air concentrations, on the other hand, is governed by the values of the mass transfer coefficient, which is itself determined by the flow dynamics and bath geometry. Concerning the magnitude of the risk, the fallout for external emergency planning is slight in all the cases investigated.

Image analysis for maintenance of coating quality in nickel electroplating baths--real time control.

PubMed

Vidal, M; Amigo, J M; Bro, R; van den Berg, F; Ostra, M; Ubide, C

2011-11-07

The aim of this paper is to show how it is possible to extract analytical information from images acquired with a flatbed scanner and make use of this information for real time control of a nickel plating process. Digital images of plated steel sheets in a nickel bath are used to follow the process under degradation of specific additives. Dedicated software has been developed for making the obtained results accessible to process operators. This includes obtaining the RGB image, to select the red channel data exclusively, to calculate the histogram of the red channel data and to calculate the mean colour value (MCV) and the standard deviation of the red channel data. MCV is then used by the software to determine the concentration of the additives Supreme Plus Brightner (SPB) and SA-1 (for confidentiality reasons, the chemical contents cannot be further detailed) present in the bath (these two additives degrade and their concentration changes during the process). Finally, the software informs the operator when the bath is generating unsuitable quality plating and suggests the amount of SPB and SA-1 to be added in order to recover the original plating quality. Copyright © 2011 Elsevier B.V. All rights reserved.

Preparation of textural lamellar tin deposits via electrodeposition

NASA Astrophysics Data System (ADS)

Wen, Xiaoyu; Pan, Xiaona; Wu, Libin; Li, Ruinan; Wang, Dan; Zhang, Jinqiu; Yang, Peixia

2017-06-01

Lamellar tin deposits were prepared by galvanostatical electroplating from the aqueous acidic-sulfate bath, with gelatin and benzalacetone dissolved in ethanol (ABA+EtOH) as additive, and their morphologies were investigated by scanning electron microscopy. Cathodic polarization curves revealed that the absorbability of ABA+EtOH on the cathode surface was higher than that of gelatin. X-ray diffraction analysis indicated preferred orientations of tin growth led to the formation of lamellar structure and distortion of tin lattice. The growth mechanism of lamellar tin was also discussed.

Influence of Bond Coat on HVOF-Sprayed Gradient Cermet Coating on Copper Alloy

NASA Astrophysics Data System (ADS)

Ke, Peng; Cai, Fei; Chen, Wanglin; Wang, Shuoyu; Ni, Zhenhang; Hu, Xiaohong; Li, Mingxi; Zhu, Guanghong; Zhang, Shihong

2017-06-01

Coatings are required on mold copper plates to prolong their service life through enhanced hardness, wear resistance, and oxidation resistance. In the present study, NiCr-30 wt.%Cr3C2 ceramic-metallic (cermet) layers were deposited by high velocity oxy-fuel (HVOF) spraying on different designed bond layers, including electroplated Ni, HVOF-sprayed NiCr, and double-decker Ni-NiCr. Annealing was also conducted on the gradient coating (GC) with NiCr bond layer to improve the wear resistance and adhesion strength. Coating microstructure was investigated by scanning electron microscopy and x-ray diffraction analysis. Mechanical properties including microhardness, wear resistance, and adhesion strength of the different coatings were evaluated systematically. The results show that the types of metallic bond layer and annealing process had a significant impact on the mechanical properties of the GCs. The GCs with electroplated Ni bond layer exhibited the highest adhesion strength (about 70 MPa). However, the GC with HVOF-sprayed NiCr bond layer exhibited better wear resistance. The wear resistance and adhesion strength of the coating with NiCr metallic bond layer were enhanced after annealing.

Development of technique for air coating and nickel and copper metalization of solar cells

NASA Technical Reports Server (NTRS)

1982-01-01

Solar cells were made with a variety of base metal screen printing inks applied over silicon nitride AR coating and copper electroplated. Fritted and fritless nickel and fritless tin base printing inks were evaluated. Conversion efficiencies as high as 9% were observed with fritted nickel ink contacts, however, curve shapes were generally poor, reflecting high series resistance. Problems encountered in addition to high series reistance included loss of adhesion of the nickel contacts during plating and poor adhesion, oxidation and inferior curve shapes with the tin base contacts.

Co-electrodeposition of hard Ni-W/diamond nanocomposite coatings

PubMed Central

Zhang, Xinyu; Qin, Jiaqian; Das, Malay Kumar; Hao, Ruru; Zhong, Hua; Thueploy, Adisak; Limpanart, Sarintorn; Boonyongmaneerat, Yuttanant; Ma, Mingzhen; Liu, Riping

2016-01-01

Electroplated hard chrome coating is widely used as a wear resistant coating to prolong the life of mechanical components. However, the electroplating process generates hexavalent chromium ion which is known carcinogen. Hence, there is a major effort throughout the electroplating industry to replace hard chrome coating. Composite coating has been identified as suitable materials for replacement of hard chrome coating, while deposition coating prepared using traditional co-deposition techniques have relatively low particles content, but the content of particles incorporated into a coating may fundamentally affect its properties. In the present work, Ni-W/diamond composite coatings were prepared by sediment co-electrodeposition from Ni-W plating bath, containing suspended diamond particles. This study indicates that higher diamond contents could be successfully co-deposited and uniformly distributed in the Ni-W alloy matrix. The maximum hardness of Ni-W/diamond composite coatings is found to be 2249 ± 23 Hv due to the highest diamond content of 64 wt.%. The hardness could be further enhanced up to 2647 ± 25 Hv with heat treatment at 873 K for 1 h in Ar gas, which is comparable to hard chrome coatings. Moreover, the addition of diamond particles could significantly enhance the wear resistance of the coatings. PMID:26924136

Preparation and Characterization of Ni Spines Grown on the Surface of Cubic Boron Nitride Grains by Electroplating Method

PubMed Central

Gui, Yanghai; Zhao, Jianbo; Chen, Jingbo; Jiang, Yuanli

2016-01-01

Cubic boron nitride (cBN) is widely applied in cutting and grinding tools. cBN grains plated by pure Ni and Ni/SiC composite were produced under the same conditions from an additive-free nickel Watts type bath. The processed electroplating products were characterized by the techniques of scanning electron microscopy (SEM), X-ray diffraction (XRD) and thermoanalysis (TG-DTA). Due to the presence of SiC particles, there are some additional nodules on the surface of Ni/SiC plated cBN compared with the pure Ni plated cBN. The unique morphology of Ni/SiC plated cBN should attain greater retention force in resin bond. Moreover, the coating weight of cBN grains could be controlled by regulating the plating time. cBN grains with 60% coating weight possess the optimum grinding performance due to their roughest and spiniest surface. In addition, Ni spines plated cBN grains show good thermal stability when temperature is lower than 464 °C. Therefore, the plated cBN grains are more stable and suitable for making resin bond abrasive tools below 225 °C. Finally, the formation mechanism of electroplating products is also discussed. PMID:28773283

Stability of nicotinate and dodecyl sulfate in a Lewis acidic ionic liquid for aluminum electroplating and characterization of their degradation products.

PubMed

Kosmus, Patrick; Steiner, Oliver; Goessler, Walter; Gollas, Bernhard; Fauler, Gisela

2016-04-01

Plating bath additives are essential for optimization of the morphology of electroplated layers. The ionic liquid 1-ethyl-3-methylimidazolium (EMIM) chloride plus 1.5 mol equivalents of AlCl3 has great potential for electroplating of aluminum. In this study, the chemical and electrochemical stability of the additives EMIM-nicotinate and sodium dodecyl sulfate and their effect on the stability of EMIM was investigated and analyzed. Nicotinate and its electrochemical decomposition product β-picoline could be detected and we show with a single HPLC-UV-MS method that EMIM is not affected by the decomposition of this additive. An adapted standard HPLC-UV-MS method together with GC-MS and ion chromatography was used to analyze the decomposition products of SDS and possible realkylation products of EMIM. Several volatile medium and short chain-length alkanes as well as sulfate ions have been found as decomposition products of SDS. Alkenium ions formed as intermediates during the decomposition of SDS realkylate EMIM to produce mono- up to pentasubstituted alkyl-imidazoles. A reaction pathway involving Wagner-Meerwein rearrangements and Friedel-Crafts alkylations has been suggested to account for the formation of the detected products. © 2016 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

Co-electrodeposition of hard Ni-W/diamond nanocomposite coatings.

PubMed

Zhang, Xinyu; Qin, Jiaqian; Das, Malay Kumar; Hao, Ruru; Zhong, Hua; Thueploy, Adisak; Limpanart, Sarintorn; Boonyongmaneerat, Yuttanant; Ma, Mingzhen; Liu, Riping

2016-02-29

Electroplated hard chrome coating is widely used as a wear resistant coating to prolong the life of mechanical components. However, the electroplating process generates hexavalent chromium ion which is known carcinogen. Hence, there is a major effort throughout the electroplating industry to replace hard chrome coating. Composite coating has been identified as suitable materials for replacement of hard chrome coating, while deposition coating prepared using traditional co-deposition techniques have relatively low particles content, but the content of particles incorporated into a coating may fundamentally affect its properties. In the present work, Ni-W/diamond composite coatings were prepared by sediment co-electrodeposition from Ni-W plating bath, containing suspended diamond particles. This study indicates that higher diamond contents could be successfully co-deposited and uniformly distributed in the Ni-W alloy matrix. The maximum hardness of Ni-W/diamond composite coatings is found to be 2249 ± 23 Hv due to the highest diamond content of 64 wt.%. The hardness could be further enhanced up to 2647 ± 25 Hv with heat treatment at 873 K for 1 h in Ar gas, which is comparable to hard chrome coatings. Moreover, the addition of diamond particles could significantly enhance the wear resistance of the coatings.

Co-electrodeposition of hard Ni-W/diamond nanocomposite coatings

NASA Astrophysics Data System (ADS)

Zhang, Xinyu; Qin, Jiaqian; Das, Malay Kumar; Hao, Ruru; Zhong, Hua; Thueploy, Adisak; Limpanart, Sarintorn; Boonyongmaneerat, Yuttanant; Ma, Mingzhen; Liu, Riping

2016-02-01

Electroplated hard chrome coating is widely used as a wear resistant coating to prolong the life of mechanical components. However, the electroplating process generates hexavalent chromium ion which is known carcinogen. Hence, there is a major effort throughout the electroplating industry to replace hard chrome coating. Composite coating has been identified as suitable materials for replacement of hard chrome coating, while deposition coating prepared using traditional co-deposition techniques have relatively low particles content, but the content of particles incorporated into a coating may fundamentally affect its properties. In the present work, Ni-W/diamond composite coatings were prepared by sediment co-electrodeposition from Ni-W plating bath, containing suspended diamond particles. This study indicates that higher diamond contents could be successfully co-deposited and uniformly distributed in the Ni-W alloy matrix. The maximum hardness of Ni-W/diamond composite coatings is found to be 2249 ± 23 Hv due to the highest diamond content of 64 wt.%. The hardness could be further enhanced up to 2647 ± 25 Hv with heat treatment at 873 K for 1 h in Ar gas, which is comparable to hard chrome coatings. Moreover, the addition of diamond particles could significantly enhance the wear resistance of the coatings.

Electroplating targets for production of unique PET radionuclides

DOE Office of Scientific and Technical Information (OSTI.GOV)

Bui, V.; Sheh, Y.; Finn, R.

1994-12-31

The past decade has witnessed the applications of Positron Emission Tomography (PET) evolving from a purely research endeavour to a procedure which has specific clinical applications in the areas of cardiology, neurology and oncology. The growth of PET has been facilitated by developments in medical instrumentation and radiopharmaceutical chemistry efforts. Included in this latter effort has been the low energy accelerator production and processing of unique PET radionuclides appropriate for the radiolabeling of biomolecules i.e. monoclonal antibodies and pepetides. The development and application of electroplated targets of antimony and copper for the production of iodine-124 and gallium-66 respectively, utilizing themore » Memorial Sloan-Kettering Cancer Center cyclotron are examples of target design and development applicable to many medical accelerators.« less

Electroplated targets for production of unique PET radionuclides

NASA Astrophysics Data System (ADS)

Bui, V.; Sheh, Y.; Finn, R.; Francesconi, L.; Cai, S.; Schlyer, D.; Wieland, B.

1995-12-01

The past decade has witnessed the applications of positron emission tomography (PET) evolving from a purely research endeavor to a procedure which has specific clinical applications in the areas of cardiology, neurology and oncology. The growth of PET has been facilitated by developments in both medical instrumentation and radiopharmaceutical chemistry efforts. Included in this latter effort has been the low energy accelerator production and processing of unique PET radionuclides appropriate for the radiolabeling of biomolecules, i.e. monoclonal antibodies and peptides. The development and application of electroplated targets of antimony and copper for the production of iodine-124 and gallium-66 respectively, utilizing the Memorial Sloan-Kettering Cancer Center (MSKCC) cyclotron are examples of target design and development applicable to many medical accelerators.

[Heavy metals distribution characteristics and risk assessment of water below an electroplating factory].

PubMed

Hang, Xiao-Shuai; Wang, Huo-Yan; Zhou, Jian-Min

2008-10-01

Surface water and shallow groundwater within the flow of an electroplating factory was analyzed in order to study the resulting impact. The analysis method of ICP-AES was used to analyze content of zinc, manganese, chromium, copper and nickel in surface water and groundwater samples. The results indicate acidic pollutants of zinc, manganese, chromium, copper and nickel were discharged from the factory with concentrations of 1.34, 3.77, 28.1, 6.40 and 9.37 mg x L(-1), respectively; and pH was 2.32. They all exceeded permissible levels according to Integrated Wastewater Discharge Standard except zinc. Factory discharge is responsible for the longitudinal distribution characteristics of heavy metals in the stream water downstream from the factory. Heavy metals variations in the well water do not suggest they were affected by heavy metals in the stream, indicating that the migration rates of heavy metals in soils were relatively low. Risk assessment shows surface water quality significantly deteriorated. Nickel and manganese in the stream water exceeded the standard levels seriously, and chromium and copper in some samples were also above Grade III standard levels according to Environmental Quality Standard for Surface Water. Moreover, all studied heavy metals in 14 groundwater samples measured within drinking water standard, except manganese in 4 groundwater samples, which were Grade IV according to Quality Standard for Ground water.

Purity test for copper-plating solutions

NASA Technical Reports Server (NTRS)

Mansfeld, F. B.

1977-01-01

Electrode configuration can be used to measure extent of impurities in acid-copper plating solution. It can be inserted into any plating tank and will show whether bath is clean or contaminated, within fifteen minutes.

AN ENVIRONMENTAL AND ECONOMIC COMPARISON OF ION EXCHANGE AND RECENTLY COMMERCIALIZED ELECTROCHEMICAL TECHNOLOGIES FOR THE RECOVERY OF RINSE WATER IN BRIGHT NICKEL PLATING FACILITY

EPA Science Inventory

Researchers at USEPA are testing and evaluating two commercial electrochemical technologies for the purification of rinse water and the recovery of copper and nickel from a variety of electroplating processes. One of the investigated technologies is based on the application of hi...

High-current-density electrodeposition using pulsed and constant currents to produce thick CoPt magnetic films on silicon substrates

NASA Astrophysics Data System (ADS)

Ewing, Jacob; Wang, Yuzheng; Arnold, David P.

2018-05-01

This paper investigates methods for electroplating thick (>20 μm), high-coercivity CoPt films using high current densities (up to 1 A/cm2) and elevated bath temperatures (70 °C). Correlations are made tying current-density and temperature process parameters with plating rate, elemental ratio and magnetic properties of the deposited CoPt films. It also investigates how pulsed currents can increase the plating rate and film to substrate adhesion. Using 500 mA/cm2 and constant current, high-quality, dense CoPt films were successfully electroplated up to 20 μm thick in 1 hr on silicon substrates (0.35 μm/min plating rate). After standard thermal treatment (675°C, 30 min) to achieve the ordered L10 crystalline phase, strong magnetic properties were measured: coercivities up 850 kA/m, remanences >0.5 T, and maximum energy products up to 46 kJ/m3.

Hydration and leaching characteristics of cement pastes made from electroplating sludge

DOE Office of Scientific and Technical Information (OSTI.GOV)

Chen, Ying-Liang; Sustainable Environment Research Center, National Cheng Kung University, No. 1, University Rd., Tainan City 70101, Taiwan; Ko, Ming-Sheng

2011-06-15

The purpose of this study was to investigate the hydration and leaching characteristics of the pastes of belite-rich cements made from electroplating sludge. The compressive strength of the pastes cured for 1, 3, 7, 28, and 90 days was determined, and the condensation of silicate anions in hydrates was examined with the {sup 29}Si nuclear magnetic resonance (NMR) technology. The leachabilities of the electroplating sludge and the hardened pastes were studied with the multiple toxicity characteristic leaching procedure (MTCLP) and the tank leaching test (NEN 7345), respectively. The results showed that the electroplating sludge continued to leach heavy metals, includingmore » nickel, copper, and zinc, and posed a serious threat to the environment. The belite-rich cement made from the electroplating sludge was abundant in hydraulic {beta}-dicalcium silicate, and it performed well with regard to compressive-strength development when properly blended with ordinary Portland cements. The blended cement containing up to 40% the belite-rich cement can still satisfy the compressive-strength requirements of ASTM standards, and the pastes cured for 90 days had comparable compressive strength to an ordinary Portland cement paste. It was also found that the later hydration reaction of the blended cements was relatively more active, and high fractions of belite-rich cement increased the chain length of silicate hydrates. In addition, by converting the sludge into belite-rich cements, the heavy metals became stable in the hardened cement pastes. This study thus indicates a viable alternative approach to dealing with heavy metal bearing wastes, and the resulting products show good compressive strength and heavy-metal stability.« less

Experimental study of copper-alkali ion exchange in glass

NASA Astrophysics Data System (ADS)

Gonella, F.; Caccavale, F.; Bogomolova, L. D.; D'Acapito, F.; Quaranta, A.

1998-02-01

Copper-alkali ion exchange was performed by immersing different silicate glasses (soda-lime and BK7) in different molten eutectic salt baths (CuSO4:Na2SO4 and CuSO4:K2SO4). The obtained optical waveguides were characterized by m-lines spectroscopy for the determination of refractive index profiles, and by secondary ion mass spectrometry for the concentration profiles of the ion species involved in the exchange process. The different oxidation states of copper inside the glass structure were studied by electron paramagnetic resonance and x-ray absorption techniques. Interdiffusion copper coefficients were also determined. The Cu-alkali exchange was observed to give rise to local structural rearrangement of the atoms in the glass matrix. The Cu+ ion was found to mainly govern the exchange process, while competition between Cu-Na and K-Na exchanges occurred when a potassium sulfate bath was used. In this case, significant waveguide modal birefringence was observed.

METHOD OF APPLYING NICKEL COATINGS ON URANIUM

DOEpatents

Gray, A.G.

1959-07-14

A method is presented for protectively coating uranium which comprises etching the uranium in an aqueous etching solution containing chloride ions, electroplating a coating of nickel on the etched uranium and heating the nickel plated uranium by immersion thereof in a molten bath composed of a material selected from the group consisting of sodium chloride, potassium chloride, lithium chloride, and mixtures thereof, maintained at a temperature of between 700 and 800 deg C, for a time sufficient to alloy the nickel and uranium and form an integral protective coating of corrosion-resistant uranium-nickel alloy.

Chromium recovery from exhausted baths generated in plating processes and its reuse in the tanning industry.

PubMed

Torras, Josep; Buj, Irene; Rovira, Miquel; de Pablo, Joan

2012-03-30

Chromium plating used for functional purposes provides an extremely hard, wear and corrosion resistant layer by means of electrolytic deposition. Typical layer thicknesses range between 2.5 and 500 μm. Chromium electroplating baths contain high concentrations of Cr(VI) with chromium trioxide (CrO(3)) as the chromium source. When because of technical or economic reasons a bath gets exhausted, a waste containing mainly chromium as dichromate as well as other heavy metals is generated. Chromium may then be purified for use in other industrial processes with different requirements. In this work, a sustainable system for using galvanic wastes as reagents in the leather tanning industry, thus reducing quantity of wastes to be treated, is presented. Metal cations present in the chromium exhausted bath were precipitated with NaOH. Then, the solution containing mainly soluble Cr(VI) was separated. By means of sodium sulphite in acidic conditions, Cr(VI) was reduced to Cr(III) as chromium (III) sulphate. From chromium (III) sulphate a basic Cr(III) sulphate may be obtained, which is one of most used compounds in the tanning industry. Cr(III) concentration in the final solution allows its reuse without concentration, but with a slight dilution. Copyright © 2012 Elsevier B.V. All rights reserved.

A REVIEW OF NICKEL PLATING BATH LIFE EXTENSION, NICKEL RECOVERY & COPPER RECOVERY FROM NICKEL BATHS

EPA Science Inventory

For metal finishing operations to remain competitive and in compliance with environmental requirements, companies must focus their efforts on pollution prevention to reduce waste generation and disposal costs, limit liability and restore maximum profits. By applying the pollutio...

Concept Feasibility Report for Electroplating Zirconium onto Uranium Foil - Year 2

DOE Office of Scientific and Technical Information (OSTI.GOV)

Coffey, Greg W.; Meinhardt, Kerry D.; Joshi, Vineet V.

2015-03-01

The Fuel Fabrication Capability within the U.S. High Performance Research Reactor Conversion Program is funded through the National Nuclear Security Administration (NNSA) NA-26 (Office of Material Management and Minimization). An investigation was commissioned to determine the feasibility of using electroplating techniques to apply a coating of zirconium onto depleted uranium/molybdenum alloy (U-10Mo). Electroplating would provide an alternative method to the existing process of hot roll-bonding zirconium foil onto the U-10Mo fuel foil during the fabrication of fuel elements for high-performance research reactors. The objective of this research was to develop a reproducible and scalable plating process that will produce amore » uniform, 25 μm thick zirconium metal coating on U-10Mo foil. In previous work, Pacific Northwest National Laboratory (PNNL) established a molten salt electroplating apparatus and protocol to plate zirconium metal onto molybdenum foil (Coffey 2015). During this second year of the research, PNNL furthered this work by moving to the U-10Mo alloy system (90 percent uranium:10 percent molybdenum). The original plating apparatus was disassembled and re-assembled in a laboratory capable of handling low-level radioactive materials. Initially, the work followed the previous year’s approach, and the salt bath composition was targeted at the eutectic composition (LiF:NaF:ZrF4 = 26:37:37 mol%). Early results indicated that the formation of uranium fluoride compounds would be problematic. Other salt bath compositions were investigated in order to eliminate the uranium fluoride production (LiF:NaF = 61:39 mol% and LiF:NaF:KF = 46.5:11.5:42 mol% ). Zirconium metal was used as the crucible for the molten salt. Three plating methods were used—isopotential, galvano static, and pulsed plating. The molten salt method for zirconium metal application provided high-quality plating on molybdenum in PNNL’s previous work. A key advantage of this approach is that plating can be performed under conditions that would greatly reduce the quantity of intermetallics that form at the interface between the zirconium and U-10Mo; unlike roll bonding, the molten salt plating approach would allow for complete coverage of the U-10Mo foil with zirconium. When utilizing the experimental parameters developed for zirconium plating onto molybdenum, a uranium fluoride reaction product was formed at the Zr/U-10Mo interface. By controlling the initial plating potential, the uranium fluoride could be prevented; however, the targeted zirconium thickness (25 ±12.5 μm) could not be achieved while maintaining 100% coverage.« less

Electroless deposition of Ni Cu P alloy and study of the influences of some parameters on the properties of deposits

NASA Astrophysics Data System (ADS)

Ashassi-Sorkhabi, H.; Dolati, H.; Parvini-Ahmadi, N.; Manzoori, J.

2002-01-01

Cupronickel alloys are known for their excellent corrosion resistance, especially in marine atmosphere. The development of an appropriate electroless bath involves the use of a reducing agent, complexing and stabilizing compounds and metallic salts. In this work, autocatalytic deposition of Ni-Cu-P alloys (28-95 wt.% Ni, 66-0 wt.% Cu, 7.5-3 wt.% P) has been carried out on 302 b steel sheets from bath containing: NiCl 2·6H 2O, CuCl 2·2H 2O, NaH 2PO 2, Na citrate, sulphosalicilic acid and triethanolamine. The effects of pH, temperature, and bath composition on the hardness and the composition of deposits have been studied. In addition, the deposition rates of alloy, nickel, copper and phosphorus were investigated and optimum conditions were obtained. The average rate of alloy deposition was 9 mg cm -2 h -1 and the optimum pH and temperature were 8.5 and 80 °C, respectively. The chemical stability of bath was desirable, and no spontaneous decomposition occurred. The changes in the structure of deposit by heat treatment were studied by the X-ray diffraction (XRD) method. The XRD patterns indicate that the copper content affects the structure changes. With increasing copper content, the phosphorus content decreased and the crystallinity of the deposits grew. After heat treatment of alloys with lower copper content at 400 °C for 1 h, the crystallization to Ni 3P was observed.

Aluminum electroplating on steel from a fused bromide electrolyte

DOE Office of Scientific and Technical Information (OSTI.GOV)

Prabhat K. Tripathy; Laura A. Wurth; Eric J. Dufek

A quaternary bromide bath (LiBr–KBr–CsBr–AlBr3) was used to electro-coat aluminum on steel substrates. The electrolytewas prepared by the addition of AlBr3 into the eutectic LiBr–KBr–CsBr melt. A smooth, thick, adherent and shiny aluminum coating could be obtained with 80 wt.% AlBr3 in the ternary melt. The SEM photographs of the coated surfaces suggest the formation of thick and dense coatings with good aluminum coverage. Both salt immersion and open circuit potential measurement suggested that the coatings did display a good corrosionresistance behavior. Annealing of the coated surfaces, prior to corrosion tests, suggested the robustness of the metallic aluminum coating inmore » preventing the corrosion of the steel surfaces. Studies also indicated that the quaternary bromide plating bath can potentially provide a better aluminumcoating on both ferrous and non-ferrous metals, including complex surfaces/geometries.« less

Aluminium Electroplating on Steel from a Fused Bromide Electrolyte

DOE Office of Scientific and Technical Information (OSTI.GOV)

Prabhat Tripathy; Laura Wurth; Eric Dufek

A quaternary bromide bath (LiBr-KBr-CsBr-AlBr3) was used to electro-coat aluminium on steel substrates. The electrolyte was prepared by the addition of AlBr3 into the eutectic LiBr-KBr-CsBr melt. A smooth, thick, adherent and shiny aluminium coating could be obtained with 80 wt.% AlBr3 in the ternary melt. The SEM photographs of the coated surfaces suggest the formation of thick and dense coatings with good aluminium coverage. Both salt immersion and open circuit potential measurement suggest that the coatings did display good corrosion-resistance behavior. Annealing of the coated surfaces, prior to corrosion tests, suggested the robustness of the metallic aluminium coating inmore » preventing the corrosion of the steel surfaces. Studies also indicated that the quaternary bromide plating bath can potentially provide a better aluminium coating on both ferrous and non-ferrous metals, including complex surfaces/geometries.« less

Fundamental studies of tin whiskering in microelectronics finishes

NASA Astrophysics Data System (ADS)

Pinol, Lesly Agnes

Common electronics materials, such as tin, copper, steel, and brass, are ambient reactive under common use conditions, and as such are prone to corrosion. During the early 1940s, reports of failures due to electrical shorting of components caused by 'whisker' (i.e., filamentary surface protrusion) growth on many surface types---including the aforementioned metals---began to emerge. Lead alloying of tin (3--10% by weight, typically in the eutectic proportion) eliminated whiskering risk for decades, until the July 2006 adoption of the Restriction of Hazardous Substances (RoHS) directive was issued by the European Union. This directive, which has since been adopted by California and parts of China, severely restricted the use of lead (<1000 ppm) in all electrical and electronics equipment being placed on the EU market, imposing the need for developing reliable new "lead-free" alternatives to SnPb. In spite of the abundance of modern-day anecdotes chronicling whisker-related failures in satellites, nuclear power stations, missiles, pacemakers, and spacecraft navigation equipment, pure tin finishes are still increasingly being employed today, and the root cause(s) of tin whiskering remains elusive. This work describes a series of structured experiments exploring the fundamental relationships between the incidence of tin whiskering (as dependent variable) and numerous independent variables. These variables included deposition method (electroplating, electroless plating, template-based electrochemical synthesis, and various physical vapor deposition techniques, including resistive evaporation, electron beam evaporation, and sputtering), the inclusion of microparticles and organic contamination, the effects of sample geometry, and nanostructuring. Key findings pertain to correlations between sample geometry and whisker propensity, and also to the stress evolution across a series of 4"-diameter silicon wafers of varying thicknesses with respect to the degree of post-metallization whiskering. Regarding sample geometry, it was found that smaller, thinner substrates displayed a more rapid onset of whiskering immediately following metallization. Changes in wafer-level stress were not found to correlate with whiskering morphology (number, density, length) after 6 weeks of aging. This result points either to the irrelevance of macrostress in the substrate/film composite, or to a difference in whiskering mechanism for rigid substrates (whose stress gradient over time is significant) when compared with thinner, flexible substrates (whose stress is less variable with time). Organic contamination was found to have no appreciable effect when explicitly introduced. Furthermore, electron-beam evaporated films whiskered more readily than films deposited via electroplating from baths containing organic "brighteners." Beyond such findings, novel in themselves, our work is also unique in that we emphasize the "clean" deposition of tin (with chromium adhesion layers and copper underlayers) by vacuum-based physical vapor deposition, to circumvent the question of contamination entirely. By employing silicon substrates exclusively, we have distinguished ourselves from other works (which, for example, use copper coupons fabricated from rolled shim stock) because we have better sample-to-sample consistency in terms of material properties, machinability, and orientation.

Electro deposition of cuprous oxide for thin film solar cell applications

NASA Astrophysics Data System (ADS)

Shahrestani, Seyed Mohammad

p and n type copper oxide semiconductor layers were fabricated by electrochemistry using new approaches for photovoltaic applications. Thin films were electroplated by cathodic polarization on a copper foil or indium tin oxide (ITO) substrates. The optimum deposition conditions (composition, pH and temperature of the electrolyte and applied potential) of the layers as thin films have been identified; in particular the conditions that allow getting the n-type layers have been well identified for the first time. The configuration of a photo - electrochemical cell was used to characterize the spectral response of the layers. It was shown that the p type layers exhibit a photocurrent in the cathode potential region and n layers exhibit photo current in the anode potential region. Measurements of electrical resistivity of electro chemically deposited layers of p and n type Cu2O, showed that the resistivity of p-type Cu2O varies from 3.2 x 105 to 2.0 x 108 Ocm. These values depend the electrodepositing conditions such as the pH of the solution, the deposition potential and temperature. The influence of several plating parameters of the p type layers of Cu2O, such as applied potential, pH and temperature of the bath on the chemical composition, degree of crystallinity, grain size and orientation parameters of the sample was systematically studied using X-ray diffraction and scanning electron microscopy. Depending of the electro-deposition potential, two different surface morphologies with various preferential crystal orientations were obtained for the temperatures of the electro-deposition of 30 °C and pH 9. For the same temperature, the layers of p type Cu2O of highly crystalline p type are obtained at pH 12, indicating that the crystallinity depends on the pH of the bath. Also, it has been shown that the morphology of Cu2O layers was changed by varying the potential and the duration of deposition, as well as the temperature of the solution. The conditions for the electro-deposition of Cu2O n-type were identified consistently for the first time. The electro-deposition electrolyte is based 0.01M acetate copper and 0.1 M sodium acetate: it has a pH between 6.3 and 4, a potential of from 0 to -0.25 V vs. Ag / AgCl and a temperature of 60oC. The optimum annealing temperature of the n-type Cu2O layers is between 120-150oC for the annealing time of 30 to 120 minutes. Resistivity of the n-type films varies between 5 x 103 and 5 x 104 at pH 4 to pH 6.4. We have shown for the first time that bubbling nitrogen gas in the electroplating cell improves significantly the spectral response of the electro-deposited n-type thin film. A two steps electro-deposition process was implemented to make the p-n homojunction cuprous oxide. Indium tin oxide (ITO) was used as a transparent conductive oxide substrate. A p-Cu2O was electrodeposited on ITO. After heat treatment a thin film layer of n-Cu 2O was electrodeposited on top of previous layer. The performance of a p-n homojunction photovoltaic solar cell of Cu2O was determined. The short-circuit current and the open circuit voltage were respectively determined to be as 0.35 volts and 235 muA/cm2. The fill factor (FF) and conversion efficiency of light into electricity were respectively measured to be 0.305 and 0.082%.

Hydration and leaching characteristics of cement pastes made from electroplating sludge.

PubMed

Chen, Ying-Liang; Ko, Ming-Sheng; Lai, Yi-Chieh; Chang, Juu-En

2011-06-01

The purpose of this study was to investigate the hydration and leaching characteristics of the pastes of belite-rich cements made from electroplating sludge. The compressive strength of the pastes cured for 1, 3, 7, 28, and 90 days was determined, and the condensation of silicate anions in hydrates was examined with the (29)Si nuclear magnetic resonance (NMR) technology. The leachabilities of the electroplating sludge and the hardened pastes were studied with the multiple toxicity characteristic leaching procedure (MTCLP) and the tank leaching test (NEN 7345), respectively. The results showed that the electroplating sludge continued to leach heavy metals, including nickel, copper, and zinc, and posed a serious threat to the environment. The belite-rich cement made from the electroplating sludge was abundant in hydraulic β-dicalcium silicate, and it performed well with regard to compressive-strength development when properly blended with ordinary Portland cements. The blended cement containing up to 40% the belite-rich cement can still satisfy the compressive-strength requirements of ASTM standards, and the pastes cured for 90 days had comparable compressive strength to an ordinary Portland cement paste. It was also found that the later hydration reaction of the blended cements was relatively more active, and high fractions of belite-rich cement increased the chain length of silicate hydrates. In addition, by converting the sludge into belite-rich cements, the heavy metals became stable in the hardened cement pastes. This study thus indicates a viable alternative approach to dealing with heavy metal bearing wastes, and the resulting products show good compressive strength and heavy-metal stability. Copyright © 2011 Elsevier Ltd. All rights reserved.

19. VIEW OF THE PLATING BATHS AND CONTROL PANELS. GOLD ...

Library of Congress Historic Buildings Survey, Historic Engineering Record, Historic Landscapes Survey

19. VIEW OF THE PLATING BATHS AND CONTROL PANELS. GOLD AND SILVER WERE AMONG THE MATERIALS PLATED ONTO PARTS MADE OF COPPER, STAINLESS STEEL AND STEEL. (11/15/89) - Rocky Flats Plant, Non-Nuclear Production Facility, South of Cottonwood Avenue, west of Seventh Avenue & east of Building 460, Golden, Jefferson County, CO

Flatbed scanners as a source of imaging. Brightness assessment and additives determination in a nickel electroplating bath.

PubMed

Vidal, M; Amigo, J M; Bro, R; Ostra, M; Ubide, C; Zuriarrain, J

2011-05-23

Desktop flatbed scanners are very well-known devices that can provide digitized information of flat surfaces. They are practically present in most laboratories as a part of the computer support. Several quality levels can be found in the market, but all of them can be considered as tools with a high performance and low cost. The present paper shows how the information obtained with a scanner, from a flat surface, can be used with fine results for exploratory and quantitative purposes through image analysis. It provides cheap analytical measurements for assessment of quality parameters of coated metallic surfaces and monitoring of electrochemical coating bath lives. The samples used were steel sheets nickel-plated in an electrodeposition bath. The quality of the final deposit depends on the bath conditions and, especially, on the concentration of the additives in the bath. Some additives become degraded with the bath life and so is the quality of the plate finish. Analysis of the scanner images can be used to follow the evolution of the metal deposit and the concentration of additives in the bath. Principal component analysis (PCA) is applied to find significant differences in the coating of sheets, to find directions of maximum variability and to identify odd samples. The results found are favorably compared with those obtained by means of specular reflectance (SR), which is here used as a reference technique. Also the concentration of additives SPB and SA-1 along a nickel bath life can be followed using image data handled with algorithms such as partial least squares (PLS) regression and support vector regression (SVR). The quantitative results obtained with these and other algorithms are compared. All this opens new qualitative and quantitative possibilities to flatbed scanners. Copyright © 2011 Elsevier B.V. All rights reserved.

Effect of magnetic field on the electrodeposition of nickel

NASA Astrophysics Data System (ADS)

Subhachandhar, S.; Krishnan, A. Yaadhav; Sivabalan, S.; Narayanan, R.

2012-07-01

This paper investigates the effect of an external magnetic field in the electroplating of Ni, one of the four ferromagnetic materials at the room temperature. Nickel plating is done using Watts bath with a composition of 250g/L of Nickel sulphate, 35g/L of Nickel Chloride, 25g/L of Boric acid with pH between 5 and 6 at room temperature under a current density of 0.05-0.1 A/dm2 under the presence of an external magnetic field to obtain a coherent coating. The arrangement of the coated particles is studied by SEM analysis.

Structure zone diagram and particle incorporation of nickel brush plated composite coatings

PubMed Central

Isern, L.; Impey, S.; Almond, H.; Clouser, S. J.; Endrino, J. L.

2017-01-01

This work studies the deposition of aluminium-incorporated nickel coatings by brush electroplating, focusing on the electroplating setup and processing parameters. The setup was optimised in order to increase the volume of particle incorporation. The optimised design focused on increasing the plating solution flow to avoid sedimentation, and as a result the particle transport experienced a three-fold increase when compared with the traditional setup. The influence of bath load, current density and the brush material used was investigated. Both current density and brush material have a significant impact on the morphology and composition of the coatings. Higher current densities and non-abrasive brushes produce rough, particle-rich samples. Different combinations of these two parameters influence the surface characteristics differently, as illustrated in a Structure Zone Diagram. Finally, surfaces featuring crevices and peaks incorporate between 3.5 and 20 times more particles than smoother coatings. The presence of such features has been quantified using average surface roughness Ra and Abbott-Firestone curves. The combination of optimised setup and rough surface increased the particle content of the composite to 28 at.%. PMID:28300159

Electroplating Gold-Silver Alloys for Spherical Capsules for NIF Double-Shell Targets

DOE Office of Scientific and Technical Information (OSTI.GOV)

Bhandarkar, N.; Horwood, C.; Bunn, T.

For Inertial Confinement Fusion (ICF) implosions, a design based on gradients of high and mid Z materials could potentially be more robust than single element capsule systems. To that end, gold and silver alloys were electroplated on 2.0 mm diameter surrogate brass spheres using a new flow–based pulsed plating method specifically designed to minimize surface roughness without reducing plating rates. The coatings were analyzed by scanning electron microscope (SEM) and white light interferometry for surface topography, and by energy dispersive x-ray spectroscopy (EDX) to determine near-surface gold and silver compositions. The alloy range attainable was 15 to 85 weight percentmore » gold using 1:1 and 1:3 silver to gold ratio plating baths at applied potentials of -0.7 volts to -1.8 volts. This range was bounded by the open circuit potential of the system and hydrogen evolution, and in theory could be extended by using ionic liquids or aprotic solutions. Preliminary gradient trials proved constant composition alloy data could be translated to smooth gradient plating, albeit at higher gold compositions.« less

Structure zone diagram and particle incorporation of nickel brush plated composite coatings

NASA Astrophysics Data System (ADS)

Isern, L.; Impey, S.; Almond, H.; Clouser, S. J.; Endrino, J. L.

2017-03-01

This work studies the deposition of aluminium-incorporated nickel coatings by brush electroplating, focusing on the electroplating setup and processing parameters. The setup was optimised in order to increase the volume of particle incorporation. The optimised design focused on increasing the plating solution flow to avoid sedimentation, and as a result the particle transport experienced a three-fold increase when compared with the traditional setup. The influence of bath load, current density and the brush material used was investigated. Both current density and brush material have a significant impact on the morphology and composition of the coatings. Higher current densities and non-abrasive brushes produce rough, particle-rich samples. Different combinations of these two parameters influence the surface characteristics differently, as illustrated in a Structure Zone Diagram. Finally, surfaces featuring crevices and peaks incorporate between 3.5 and 20 times more particles than smoother coatings. The presence of such features has been quantified using average surface roughness Ra and Abbott-Firestone curves. The combination of optimised setup and rough surface increased the particle content of the composite to 28 at.%.

Structure zone diagram and particle incorporation of nickel brush plated composite coatings.

PubMed

Isern, L; Impey, S; Almond, H; Clouser, S J; Endrino, J L

2017-03-16

This work studies the deposition of aluminium-incorporated nickel coatings by brush electroplating, focusing on the electroplating setup and processing parameters. The setup was optimised in order to increase the volume of particle incorporation. The optimised design focused on increasing the plating solution flow to avoid sedimentation, and as a result the particle transport experienced a three-fold increase when compared with the traditional setup. The influence of bath load, current density and the brush material used was investigated. Both current density and brush material have a significant impact on the morphology and composition of the coatings. Higher current densities and non-abrasive brushes produce rough, particle-rich samples. Different combinations of these two parameters influence the surface characteristics differently, as illustrated in a Structure Zone Diagram. Finally, surfaces featuring crevices and peaks incorporate between 3.5 and 20 times more particles than smoother coatings. The presence of such features has been quantified using average surface roughness Ra and Abbott-Firestone curves. The combination of optimised setup and rough surface increased the particle content of the composite to 28 at.%.

Structural, optical and electrical properties of copper antimony sulfide thin films grown by a citrate-assisted single chemical bath deposition

NASA Astrophysics Data System (ADS)

Loranca-Ramos, F. E.; Diliegros-Godines, C. J.; Silva González, R.; Pal, Mou

2018-01-01

Copper antimony sulfide (CAS) has been proposed as low toxicity and earth abundant absorber materials for thin film photovoltaics due to their suitable optical band gap, high absorption coefficient and p-type electrical conductivity. The present work reports the formation of copper antimony sulfide by chemical bath deposition using sodium citrate as a complexing agent. We show that by tuning the annealing condition, one can obtain either chalcostibite or tetrahedrite phase. However, the main challenge was co-deposition of copper and antimony as ternary sulfides from a single chemical bath due to the distinct chemical behavior of these metals. The as-deposited films were subjected to several trials of thermal treatment using different temperatures and time to find the optimized annealing condition. The films were characterized by different techniques including Raman spectroscopy, X-ray diffraction (XRD), profilometer, scanning electron microscopy (SEM), UV-vis spectrophotometer, and Hall Effect measurements. The results show that the formation of chalcostibite and tetrahedrite phases is highly sensitive to annealing conditions. The electrical properties obtained for the chalcostibite films varied as the annealing temperature increases from 280 to 350 °C: hole concentration (n) = 1017-1018 cm-3, resistivity (ρ) = 1.74-2.14 Ωcm and carrier mobility (μ) = 4.7-9.26 cm2/Vseg. While for the tetrahedrite films, the electrical properties were n = 5 × 1019 cm-3, μ = 18.24 cm2/Vseg, and ρ = 5.8 × 10-3 Ωcm. A possible mechanism for the formation of ternary copper antimony sulfide has also been proposed.

Effects of chromium, copper, nickel, and zinc on survival and feeding of the cladoceran Moina macrocopa

DOE Office of Scientific and Technical Information (OSTI.GOV)

Wong, C.K.

1992-10-01

Heavy metals are widely recognized as highly toxic and dangerous. Past research activities on heavy metal pollution in Hong Kong have emphasized coastal environmentals. Since the main sources of heavy metals are the discharge and spillage of wastewater from electroplating factories, concentrations of heavy metals in streams and pools near industrial areas may be higher than those in coastal waters. Electroplating wastewater in Hong Kong contains high levels of chromium, copper, nickel and zinc. The toxicity of these heavy metals to the aquatic organisms has been extensively reviewed. Toxicity information for invertebrates shows that crustaceans are among the most sensitivemore » organisms. Of the crustacean species tested, cladocerans appear to be the most susceptibile. Cladocerans are important components of many aquatic ecosystems. Despite their importance in many freshwater communities and their sensitivity to heavy metal toxicity, information on the toxicity of heavy metals to cladocerans is limited except for several Daphnia species. In Hong Kong the freshwater cladoceran Moina macrocopa occurs in small ponds and rice paddies and is mass cultured by some farmers as a high quality fish food. The objectives of this study are to determine the effects of various heavy metals on the survival and feeding of M. macrocopa. 12 refs., 2 figs., 1 tab.« less

Element Distribution in the Oxygen-Rich Side-Blow Bath Smelting of a Low-Grade Bismuth-Lead Concentrate

NASA Astrophysics Data System (ADS)

Yang, Tianzu; Xiao, Hui; Chen, Lin; Chen, Wei; Liu, Weifeng; Zhang, Duchao

2018-03-01

Oxygen-rich side-blow bath smelting (OSBS) technology offers an efficient method for processing complex bismuth-lead concentrates; however, the element distributions in the process remain unclear. This work determined the distributions of elements, i.e., bismuth, lead, silver, copper, arsenic and antimony, in an industrial-scale OSBS process. The feed, oxidized slag and final products were collected from the respective sampling points and analyzed. For the oxidative smelting process, 65% of bismuth and 76% of silver in the concentrate report to the metal alloy, whereas less lead reports to the metal ( 31%) than the oxidized slag ( 44%). Approximately 50% of copper enters the matte, while more than 63% of arsenic and antimony report to the slag. For the reductive smelting process, less than 4.5% of bismuth, lead, silver and copper in the oxidized slag enter the reduced slag, indicating high recoveries of these metal values.

Element Distribution in the Oxygen-Rich Side-Blow Bath Smelting of a Low-Grade Bismuth-Lead Concentrate

NASA Astrophysics Data System (ADS)

Yang, Tianzu; Xiao, Hui; Chen, Lin; Chen, Wei; Liu, Weifeng; Zhang, Duchao

2018-06-01

Oxygen-rich side-blow bath smelting (OSBS) technology offers an efficient method for processing complex bismuth-lead concentrates; however, the element distributions in the process remain unclear. This work determined the distributions of elements, i.e., bismuth, lead, silver, copper, arsenic and antimony, in an industrial-scale OSBS process. The feed, oxidized slag and final products were collected from the respective sampling points and analyzed. For the oxidative smelting process, 65% of bismuth and 76% of silver in the concentrate report to the metal alloy, whereas less lead reports to the metal ( 31%) than the oxidized slag ( 44%). Approximately 50% of copper enters the matte, while more than 63% of arsenic and antimony report to the slag. For the reductive smelting process, less than 4.5% of bismuth, lead, silver and copper in the oxidized slag enter the reduced slag, indicating high recoveries of these metal values.

Removal of Cu(II) from acidic electroplating effluent by biochars generated from crop straws.

PubMed

Tong, Xuejiao; Xu, Renkou

2013-04-01

The removal efficiency of copper (Cu(II)) from an actual acidic electroplating effluent by biochars generated from canola, rice, soybean and peanut straws was investigated. The biochars simultaneously removed Cu(II) from the effluent, mainly through the mechanisms of adsorption and precipitation, and neutralized its acidity. The removal efficiency of Cu(II) by the biochars followed the order: peanut straw char > soybean straw char > canola straw char > rice straw char > a commercial activated carbonaceous material, which is consistent with the alkalinity of the biochars. The pH of the effluent was a key factor determining the removal efficiency of Cu(II) by biochars. Raising the initial pH of the effluent enhanced the removal of Cu(II) from it. The optimum pyrolysis temperature was 400 degrees C for producing biochar from crop straws for acidic wastewater treatment, and the optimum reaction time was 8 hr.

Improvement of black nickel coatings. [product development for use in solar collectors

NASA Technical Reports Server (NTRS)

Peterson, R. E.; Lin, J. H.

1976-01-01

Selectively absorbing black nickel coatings are among the most optically efficient low cost coatings for use on flat plate solar collectors. However, a current Ni-Zn-S-O coating in use is quite susceptible to a humid environment, degrading badly in less than ten days at 38 C (100 F) at 95 percent relative humidity. Therefore, a black nickel formula was developed which can withstand such exposures with no loss of optical efficiency, solar absorption of 0.92 and an infrared emittance (at 100 C) of 1.00 were still present after 14 days of humidity exposure. This compares to a solar absorptance of only 0.72 for the previous formula after a similar time period. The electroplating bath and conditions were changed to obtain the more stable coating configuration. The effect of bath composition, temperature, pH, and plating current density and time on the coating composition, spectral optical properties and durability were investigated systematically.

Effect of thiourea on electrochemical nucleation and electrochemical impedance spectroscopy of electrodeposited tin on a copper substrate in a sulfate bath.

PubMed

Lee, Mi-Ri; Na, Seong-Hun; Park, Hwa-Sun; Suh, Su-Jeong

2014-12-01

The effect of thiourea on the electrochemical nucleation of tin on a copper substrate from a sulfate bath was studied using voltammetry, chronoamperometry, electrochemical impedance spectroscopy, and scanning electron microscopy. Without thiourea, electrodeposition of tin showed very poor surface coverage. However, re-nucleation and growth of tin occurred after the addition of thiourea. In particular, very rapid re-nucleation and growth behavior of tin were observed when up to 6 g/L of thiourea was added. Furthermore, impedance analysis allowed the estimation of the change in the growth behavior of tin when up to 6 g/L of thiourea was added.

The Chemistry of Ultra-Radiopure Materials

DOE Office of Scientific and Technical Information (OSTI.GOV)

Miley, Harry S.; Aalseth, Craig E.; Day, Anthony R.

Ultra-pure materials are needed for the construction of the next generation of ultra-low level radiation detectors. These detectors are used for environmental research as well as rare nuclear decay experiments, e.g. probing the effective mass and character of the neutrino. Unfortunately, radioactive isotopes are found in most construction materials, either primordial isotopes, activation/spallation products from cosmic-ray exposure, or surface deposition of dust or radon progeny. Copper is an ideal candidate material for these applications. High-purity copper is commercially available and, when even greater radiopurity is needed, additional electrochemical purification can be combined with the final construction step, resulting in “electroformed”more » copper of extreme purity. Copper also offers desirable thermal, mechanical, and electrical properties. To bridge the gap between commercially-available high purity copper and the most stringent requirements of next-generation low-background experiments, a method of additional chemical purification is being developed based on well-known copper electrochemistry. This method is complemented with the co-development of surface cleaning techniques and more sensitive assay for both surface and bulk contamination. Developments in the electroplating of copper, surface cleaning, assay of U and Th in the bulk copper, and residual surface contamination will be discussed relative to goals of less than 1 microBq/kg Th.« less

Reduced temperature aluminum production in an electrolytic cell having an inert anode

DOEpatents

Dawless, Robert K.; Ray, Siba P.; Hosler, Robert B.; Kozarek, Robert L.; LaCamera, Alfred F.

2000-01-01

Aluminum is produced by electrolytic reduction of alumina in a cell having a cathode, an inert anode and a molten salt bath containing metal fluorides and alumina. The inert anode preferably contains copper, silver and oxides of iron and nickel. Reducing the molten salt bath temperature to about 900-950.degree. C. lowers corrosion on the inert anode constituents.

Knowledge-based and model-based hybrid methodology for comprehensive waste minimization in electroplating plants

NASA Astrophysics Data System (ADS)

Luo, Keqin

1999-11-01

The electroplating industry of over 10,000 planting plants nationwide is one of the major waste generators in the industry. Large quantities of wastewater, spent solvents, spent process solutions, and sludge are the major wastes generated daily in plants, which costs the industry tremendously for waste treatment and disposal and hinders the further development of the industry. It becomes, therefore, an urgent need for the industry to identify technically most effective and economically most attractive methodologies and technologies to minimize the waste, while the production competitiveness can be still maintained. This dissertation aims at developing a novel WM methodology using artificial intelligence, fuzzy logic, and fundamental knowledge in chemical engineering, and an intelligent decision support tool. The WM methodology consists of two parts: the heuristic knowledge-based qualitative WM decision analysis and support methodology and fundamental knowledge-based quantitative process analysis methodology for waste reduction. In the former, a large number of WM strategies are represented as fuzzy rules. This becomes the main part of the knowledge base in the decision support tool, WMEP-Advisor. In the latter, various first-principles-based process dynamic models are developed. These models can characterize all three major types of operations in an electroplating plant, i.e., cleaning, rinsing, and plating. This development allows us to perform a thorough process analysis on bath efficiency, chemical consumption, wastewater generation, sludge generation, etc. Additional models are developed for quantifying drag-out and evaporation that are critical for waste reduction. The models are validated through numerous industrial experiments in a typical plating line of an industrial partner. The unique contribution of this research is that it is the first time for the electroplating industry to (i) use systematically available WM strategies, (ii) know quantitatively and accurately what is going on in each tank, and (iii) identify all WM opportunities through process improvement. This work has formed a solid foundation for the further development of powerful WM technologies for comprehensive WM in the following decade.

Optimization of formaldehyde concentration on electroless copper deposition on alumina surface

NASA Astrophysics Data System (ADS)

Shahidin, S. A. M.; Fadil, N. A.; Yusop, M. Zamri; Tamin, M. N.; Osman, S. A.

2018-05-01

The effect of formaldehyde concentration on electroless copper plating on alumina wafer was studied. The main composition of plating bath was copper sulphate (CuSO4) as precursor and formaldehyde as a reducing agent. The copper deposition films were assessed by varying the ratio of CuSO4 and formaldehyde. The plating rate was calculated from the weight gained after plating process whilst the surface morphology was observed by field emission scanning electron microscopy (FESEM). The results show that 1:3 ratio of copper to formaldehyde is an optimum ratio to produce most uniform coating with good adhesion between copper layer and alumina wafer substrate.

Method for providing uranium with a protective copper coating

DOEpatents

Waldrop, Forrest B.; Jones, Edward

1981-01-01

The present invention is directed to a method for providing uranium metal with a protective coating of copper. Uranium metal is subjected to a conventional cleaning operation wherein oxides and other surface contaminants are removed, followed by etching and pickling operations. The copper coating is provided by first electrodepositing a thin and relatively porous flash layer of copper on the uranium in a copper cyanide bath. The resulting copper-layered article is then heated in an air or inert atmosphere to volatilize and drive off the volatile material underlying the copper flash layer. After the heating step an adherent and essentially non-porous layer of copper is electro-deposited on the flash layer of copper to provide an adherent, multi-layer copper coating which is essentially impervious to corrosion by most gases.

Preparation of cuxinygazsen precursor films and powders by electroless deposition

DOEpatents

Bhattacharya, Raghu N.; Batchelor, Wendi Kay; Wiesner, Holm; Ramanathan, Kannan; Noufi, Rommel

1999-01-01

A method for electroless deposition of Cu.sub.x In.sub.y Ga.sub.z Se.sub.n (x=0-2, y=0-2, z=0-2, n=0-3) precursor films and powders onto a metallic substrate comprising: preparing an aqueous bath solution of compounds selected from the group consisting of: I) a copper compound, a selenium compound, an indium compound and gallium compound; II) a copper compound, a selenium compound and an indium compound; III) a selenium compound, and indium compound and a gallium compound; IV) a selenium compound and a indium compound; and V) a copper compound and selenium compound; each compound being present in sufficient quantity to react with each other to produce Cu.sub.x In.sub.y Ga.sub.z Se.sub.n (x=0-2, y=0-2, z=0-2, n=0-3); adjusting the pH of the aqueous bath solution to an acidic value by the addition of a dilute acid; and initiating an electroless reaction with an oxidizing counterelectrode for a sufficient time to cause a deposit of Cu.sub.x In.sub.y Ga.sub.z Se.sub.n (x=0-2, y=0-2, z=0-2, n=0-3) from the aqueous bath solution onto a metallic substrate.

Texture related unusual phenomena in electrodeposition and vapor deposition

NASA Astrophysics Data System (ADS)

Lee, D. N.; Han, H. N.

2015-04-01

The tensile strength of electrodeposits generally decreases with increasing bath temperature because the grain size increases and the dislocation density decreases with increasing bath temperature. Therefore, discontinuities observed in the tensile strength vs. bath temperature curves in electrodeposition of copper are unusual. The tensile strength of electrodeposits generally increases with increasing cathode current density because the rate of nucleation in electrodeposits increases with increasing current density, which in turn gives rise to a decrease in the grain size and in turn an increase in the strength. Therefore, a decrease in the tensile strength of copper electrodeposits at a high current density is unusual. The grain size of vapor deposits is expected to decrease with decreasing substrate temperature. However, rf sputtered Co-Cr deposits showed that deposits formed on water-cooled polyimide substrates had a larger grain size than deposits formed on polyimide substrates at 200 °C. These unusual phenomena can be explained by the preferred growth model for deposition texture evolution.

Simultaneous bioaccumulation of multiple metals from electroplating effluent using Aspergillus lentulus.

PubMed

Mishra, Abhishek; Malik, Anushree

2012-10-15

Toxic impacts of heavy metals in the environment have lead to intensive research on various methods of heavy metal remediation. However, in spite of abundant work on heavy metals removal from simple synthetic solutions, a very few studies demonstrate the potential of microbial strains for the treatment of industrial effluents containing mixtures of metals. In the present study, the efficiency of an environmental isolate (Aspergillus lentulusFJ172995), for simultaneous removal of chromium, copper and lead from a small-scale electroplating industry effluent was investigated. Initial studies with synthetic solutions infer that A. lentulus has a remarkable tolerance against Cr, Cu, Pb and Ni. During its growth, a significant bioaccumulation of individual metal was recorded. After 5 d of growth, the removal of metals from synthetic solutions followed the trend Pb(2+) (100%) > Cr(3+) (79%) > Cu(2+) (78%), > Ni(2+) (42%). When this strain was applied to the treatment of multiple metal containing electroplating effluent (after pH adjustment), the metal concentrations decreased by 71%, 56% and 100% for Cr, Cu and Pb, respectively within 11 d. Based on our results, we propose that the simultaneous removal of hazardous metals from industrial effluents can be accomplished using A. lentulus. Copyright © 2012 Elsevier Ltd. All rights reserved.

Combination for electrolytic reduction of alumina

DOEpatents

Brown, Craig W.; Brooks, Richard J.; Frizzle, Patrick B.; Juric, Drago D.

2002-04-30

An electrolytic bath for use during the electrolytic reduction of alumina to aluminum. The bath comprises molten electrolyte having the following ingredients: AlF.sub.3 and at least one salt selected from the group consisting of NaF, KF, and LiF; and about 0.004 wt. % to about 0.2 wt. %, based on total weight of the molten electrolyte, of at least one transition metal or at least one compound of the metal or both. The compound is, a fluoride; oxide, or carbonate. The metal is nickel, iron, copper, cobalt, or molybdenum. The bath is employed in a combination including a vessel for containing the bath and at least one non-consumable anode and at least one dimensionally stable cathode in the bath. Employing the instant bath during electrolytic reduction of alumina to aluminum improves the wetting of aluminum on a cathode by reducing or eliminating the formation of non-metallic deposits on the cathode.

Aluminum and Other Coatings for the Passivation of Tritium Storage Vessels

DOE Office of Scientific and Technical Information (OSTI.GOV)

Spencer, W.; Korinko, P.

Using a highly sensitive residual gas analyzer, the off-gassing of hydrogen, water, and hydrocarbons from surface-treated storage vessels containing deuterium was measured. The experimental storage vessels were compared to a low-off-gassing, electro-polished 304L canister. Alternative vessels were made out of aluminum, or were coatings on 304L steel. Coatings included powder pack aluminide, electro-plated aluminum, powder pack chromide, dense electro-plated chromium, copper plated, and copper plated with 25 and 50 percent nano-diamond. Vessels were loaded with low pressure deuterium to observe exchange with protium or hydrogen as observed with formation of HD and HDO. Off gas of D 2O or possiblemore » CD 4 was observed at mass 20. The main off-gas in all of the studies was H 2. The studies indicated that coatings required significant post-coating treatment to reduce off-gas and enhance the permeation barrier from gases likely added during the coating process. Dense packed aluminum coatings needed heating to drive off water. Electro-plated aluminum, chromium and copper coatings appeared to trap hydrogen from the plating process. Nano-diamond appeared to enhance the exchange rate with hydrogen off gas, and its coating process trapped significant amounts of hydrogen. Aluminum caused more protium exchange than chromium-treated surfaces. Aluminum coatings released more water, but pure aluminum vessels released small amounts of hydrogen, little water, and generally performed well. Chromium coating had residual hydrogen that was difficult to totally outgas but otherwise gave low residuals for water and hydrocarbons. Our studies indicated that simple coating of as received 304L metal will not adequately block hydrogen. The base vessel needs to be carefully out-gassed before applying a coating, and the coating process will likely add additional hydrogen that must be removed. Initial simple bake-out and leak checks up to 350° C for a few hours was found to be inadequate. All of the studies indicated that vessels needed several days of vacuum baking at 350-450° C to fully outgas the residual gases, which were mostly hydrogen. The current standard practice of out-gassing from ultra-clean, electro-polished 304L vessels with both vacuum bake-out and followed by an oxidative bake out to enhance the chromium surface performed the best in these studies.« less

Bath for electrolytic reduction of alumina and method therefor

DOEpatents

Brown, Craig W.; Brooks, Richard J.; Frizzle, Patrick B.; Juric, Drago D.

2001-07-10

An electrolytic bath for use during the electrolytic reduction of alumina to aluminum. The bath comprises a molten electrolyte having the following ingredients: (a) AlF.sub.3 and at least one salt selected from the group consisting of NaF, KF, and LiF; and (b) about 0.004 wt. % to about 0.2 wt. %, based on total weight of the molten electrolyte, of at least one transition metal or at least one compound of the metal or both. The compound may be, for example, a fluoride, oxide, or carbonate. The metal can be nickel, iron, copper, cobalt, or molybdenum. The bath can be employed in a combination that includes a vessel for containing the bath and at least one non-consumable anode and at least one dimensionally stable cathode in the bath. Employing the bath of the present invention during electrolytic reduction of alumina to aluminum can improve the wetting of aluminum on a cathode by reducing or eliminating the formation of non-metallic deposits on the cathode.

The fabrication of a double-layer atom chip with through silicon vias for an ultra-high-vacuum cell

NASA Astrophysics Data System (ADS)

Chuang, Ho-Chiao; Lin, Yun-Siang; Lin, Yu-Hsin; Huang, Chi-Sheng

2014-04-01

This study presents a double-layer atom chip that provides users with increased diversity in the design of the wire patterns and flexibility in the design of the magnetic field. It is more convenient for use in atomic physics experiments. A negative photoresist, SU-8, was used as the insulating layer between the upper and bottom copper wires. The electrical measurement results show that the upper and bottom wires with a width of 100 µm can sustain a 6 A current without burnout. Another focus of this study is the double-layer atom chips integrated with the through silicon via (TSV) technique, and anodically bonded to a Pyrex glass cell, which makes it a desired vacuum chamber for atomic physics experiments. Thus, the bonded glass cell not only significantly reduces the overall size of the ultra-high-vacuum (UHV) chamber but also conducts the high current from the backside to the front side of the atom chip via the TSV under UHV (9.5 × 10-10 Torr). The TSVs with a diameter of 70 µm were etched through by the inductively coupled plasma ion etching and filled by the bottom-up copper electroplating method. During the anodic bonding process, the electroplated copper wires and TSVs on atom chips also need to pass the examination of the required bonding temperature of 250 °C, under an applied voltage of 1000 V. Finally, the UHV test of the double-layer atom chips with TSVs at room temperature can be reached at 9.5 × 10-10 Torr, thus satisfying the requirements of atomic physics experiments under an UHV environment.

Rapid recovery of dilute copper from a simulated Cu-SDS solution with low-cost steel wool cathode reactor.

PubMed

Chang, Shih-Hsien; Wang, Kai-Sung; Hu, Pei-I; Lui, I-Chun

2009-04-30

Copper-surfactant wastewaters are often encountered in electroplating, printed circuit boards manufacturing, and metal finishing industries, as well as in retentates from micellar-enhanced ultrafiltration process. A low-cost three-dimensional steel wool cathode reactor was evaluated for electrolytic recovery of Cu ion from dilute copper solution (0.2mM) in the presence of sodium dodecyl sulfate (SDS), octylphenol poly (ethyleneglycol) 9.5 ether (TX), nonylphenol poly (oxyethylene) 9 ether (NP9) and polyoxyethylene (20) sorbitan monooleate (TW) and also mixed surfactants (anionic/nonionic). The reactor showed excellent copper recovery ability in comparison to a parallel-plate reactor. The reactor rapidly recovered copper with a reasonable current efficiency. 93% of copper was recovered at current density of 1 A m(-2) and pH 4 in the presence of 8.5mM SDS. Initial solution pH, cathodic current density, solution mixing condition, SDS concentration, and initial copper concentrations significantly influenced copper recovery. The copper recovery rate increased with an increase in aqueous SDS concentrations between 5 and 8.5mM. The influences of nonionic surfactants on Cu recovery from SDS-Cu solution depended not only on the type of surfactants used, but also on applied concentrations. From the copper recovery perspective, TX at 0.1mM or NP should be selected rather than TW, because they did not inhibit copper recovery from SDS-Cu solution.

A Study of Testing Different Mandrels for Electroforming Nickel

NASA Astrophysics Data System (ADS)

Murrell, Alex D. G.

Material failure is a prevalent problem in all engineering industries, particularly aerospace and automotive. The demand high-performance materials is higher than ever. Nickel is a metal that is favoured greatly because of its ability to withstand harsh operating conditions such as corrosive environments and extreme temperatures. Nickel parts can be produced by electroforming, a unique process that requires a removable conductive mandrel. An electroplating apparatus was set up at Tennessee Technological University to deposit nickel onto these mandrels where different methods of removal would be explored. Various different mandrels - conductive and non-conductive - were tested by nickel electroplating in a Watts nickel bath to establish a firm testing procedure. The nickel coatings were retrieved where possible and were analysed with appropriate methods. It was found that tin was the best material to use for a substrate through performance ranking, and a conductive polycarbonate was the worst material choice for a substrate. The substrates that demonstrated the easiest method of removal were tin and wax. Different methods of increasing - and also inhibiting - conductivity were applied to various substrates, where it was found that the use of a conductive graphite paint was particularly beneficial to the plating potential of a substrate.

Direct electroplating of copper on tantalum from ionic liquids in high vacuum: origin of the tantalum oxide layer.

PubMed

Schaltin, Stijn; D'Urzo, Lucia; Zhao, Qiang; Vantomme, André; Plank, Harald; Kothleitner, Gerald; Gspan, Christian; Binnemans, Koen; Fransaer, Jan

2012-10-21

In this paper, it is shown that high vacuum conditions are not sufficient to completely remove water and oxygen from the ionic liquid 1-ethyl-3-methylimidazolium chloride. Complete removal of water demands heating above 150 °C under reduced pressure, as proven by Nuclear Reaction Analysis (NRA). Dissolved oxygen gas can only be removed by the use of an oxygen scavenger such as hydroquinone, despite the fact that calculations show that oxygen should be removed completely by the applied vacuum conditions. After applying a strict drying procedure and scavenging of molecular oxygen, it was possible to deposit copper directly on tantalum without the presence of an intervening oxide layer.

A base-metal conductor system for silicon solar cells

NASA Technical Reports Server (NTRS)

Coleman, M. G.; Pryor, R. A.; Sparks, T. G.

1980-01-01

Solder, copper, and silver are evaluated as conductor layer metals for silicon solar cell metallization on the basis of metal price stability and reliability under operating conditions. Due to its properties and cost, copper becomes an attractive candidate for the conductor layer. It is shown that nickel operates as an excellent diffusion barrier between copper and silicon while simultaneously serving as an electrical contact and mechanical contact to silicon. The nickel-copper system may be applied to the silicon by plating techniques utilizing a variety of plating bath compositions. Solar cells having excellent current-voltage characteristics are fabricated to demonstrate the nickel-copper metallization system.

Coated Metal Articles and Method of Making

DOEpatents

Boller, Ernest R.; Eubank, Lowell D.

2004-07-06

The method of protectively coating metallic uranium which comprises dipping the metallic uranium in a molten alloy comprising about 20-75% of copper and about 80-25% of tin, dipping the coated uranium promptly into molten tin, withdrawing it from the molten tin and removing excess molten metal, thereupon dipping it into a molten metal bath comprising aluminum until it is coated with this metal, then promptly withdrawing it from the bath.

40 CFR 471.85 - Pretreatment standards for new sources (PSNS).

Code of Federal Regulations, 2011 CFR

2011-07-01

... Copper 0.459 0.219 Cyanide 0.072 0.029 Zinc 0.365 0.151 (j) Alkaline cleaning spent baths. Subpart H—PSNS... million off-pounds) of zinc alkaline cleaned Chromium 0.002 0.0006 Copper 0.005 0.002 Cyanide 0.0007 0.0003 Zinc 0.004 0.002 (k) Alkaline cleaning rinse. Subpart H—PSNS Pollutant or pollutant property...

40 CFR 471.85 - Pretreatment standards for new sources (PSNS).

Code of Federal Regulations, 2010 CFR

2010-07-01

... Copper 0.459 0.219 Cyanide 0.072 0.029 Zinc 0.365 0.151 (j) Alkaline cleaning spent baths. Subpart H—PSNS... million off-pounds) of zinc alkaline cleaned Chromium 0.002 0.0006 Copper 0.005 0.002 Cyanide 0.0007 0.0003 Zinc 0.004 0.002 (k) Alkaline cleaning rinse. Subpart H—PSNS Pollutant or pollutant property...

Installation Assessment of Frankford Arsenal.

DTIC Science & Technology

1977-10-01

sulfate , sulfuric acid , ac ’solution 40 Hot water bath 41 Nickel plate Nickel sulfate and chloride sulfuric acid , acid ...solution 42 Chromium Copper plate Copper sulfate and sulfuric acid , acid solution 11-14 TABLE 11-2 (continued) Tank No. Plating Process Use Contents...46 Water rinse Water 47 Water rinse Water 48 Water rinse Water 49 Acid Chromic acid , acetic acid , nickel sulfate and sulfuric

Improving wettability of photo-resistive film surface with plasma surface modification for coplanar copper pillar plating of IC substrates

NASA Astrophysics Data System (ADS)

Xiang, Jing; Wang, Chong; Chen, Yuanming; Wang, Shouxu; Hong, Yan; Zhang, Huaiwu; Gong, Lijun; He, Wei

2017-07-01

The wettability of the photo-resistive film (PF) surfaces undergoing different pretreatments including the O2sbnd CF4 low-pressure plasma (OCLP) and air plasma (AP), is investigated by water contact angle measurement instrument (WCAMI) before the bottom-up copper pillar plating. Chemical groups analysis performed by attenuated total reflectance Fourier transform infrared spectroscopy (ATR-FTIR) and X-ray photoelectron spectra (XPS) shows that after the OCLP and wash treatment, the wettability of PF surface is attenuated, because embedded fluorine and decreased oxygen content both enhance hydrophobicity. Compared with OCLP treatment, the PF surface treatment by non-toxic air plasma displays features of Csbnd O, Osbnd Cdbnd O, Cdbnd O and sbnd NO2 by AIR-FTIR and XPS, and a promoted wettability by WCAM. Under the identical electroplating condition, the surface with a better wettability allows electrolyte to spontaneously soak all the places of vias, resulting in improved copper pillar uniformity. Statistical analysis of metallographic data shows that more coplanar and flat copper pillars are achieved with the PF treatment of air plasma. Such modified copper-pillar-plating technology meets the requirement of accurate impedance, the high density interconnection for IC substrates.

Vertically aligned CNT-Cu nano-composite material for stacked through-silicon-via interconnects.

PubMed

Sun, Shuangxi; Mu, Wei; Edwards, Michael; Mencarelli, Davide; Pierantoni, Luca; Fu, Yifeng; Jeppson, Kjell; Liu, Johan

2016-08-19

For future miniaturization of electronic systems using 3D chip stacking, new fine-pitch materials for through-silicon-via (TSV) applications are likely required. In this paper, we propose a novel carbon nanotube (CNT)/copper nanocomposite material consisting of high aspect ratio, vertically aligned CNT bundles coated with copper. These bundles, consisting of hundreds of tiny CNTs, were uniformly coated by copper through electroplating, and aspect ratios as high as 300:1 were obtained. The resistivity of this nanomaterial was found to be as low as ∼10(-8) Ω m, which is of the same order of magnitude as the resistivity of copper, and its temperature coefficient was found to be only half of that of pure copper. The main advantage of the composite TSV nanomaterial is that its coefficient of thermal expansion (CTE) is similar to that of silicon, a key reliability factor. A finite element model was set up to demonstrate the reliability of this composite material and thermal cycle simulations predicted very promising results. In conclusion, this composite nanomaterial appears to be a very promising material for future 3D TSV applications offering both a low resistivity and a low CTE similar to that of silicon.

Electroplating and magnetostructural characterization of multisegmented Co54Ni46/Co85Ni15 nanowires from single electrochemical bath in anodic alumina templates

PubMed Central

2013-01-01

Highly hexagonally ordered hard anodic aluminum oxide membranes, which have been modified by a thin cover layer of SiO2 deposited by atomic layer deposition method, were used as templates for the synthesis of electrodeposited magnetic Co-Ni nanowire arrays having diameters of around 180 to 200 nm and made of tens of segments with alternating compositions of Co54Ni46 and Co85Ni15. Each Co-Ni single segment has a mean length of around 290 nm for the Co54Ni46 alloy, whereas the length of the Co85Ni15 segments was around 430 nm. The composition and crystalline structure of each Co-Ni nanowire segment were determined by transmission electron microscopy and selected area electron diffraction techniques. The employed single-bath electrochemical nanowire growth method allows for tuning both the composition and crystalline structure of each individual Co-Ni segment. The room temperature magnetic behavior of the multisegmented Co-Ni nanowire arrays is also studied and correlated with their structural and morphological properties. PMID:23735184

Study on the removal of iron impurities in methanesulfonic acid tin plating bath

NASA Astrophysics Data System (ADS)

Hou-li, LIU; Jian-Jun, CHEN; Hong-Liang, PAN

2018-03-01

This thesis investigated the the influence of sodium sulfite as reducing agent on the recovery rate of tin ion. The approach is that HZ016 type cation exchange resin was used to adsorb Sn2+ and Fe2+ in electroplated tin solution first. After adsorption, the resin was removed by sulfuric acid, which was added with NaOH to adjust pH value to form precipitation and separate tin. X-ray diffraction (XRD) and energy spectrum (EDS) method were used to analyze the composition of the precipitates adjusted by pH. The results show that when the mass ratio of resin to bath is 1:2, the adsorption efficiency of resin reaches 98.3% and 97.1% respectively, and the elution efficiency of tin and iron reaches 95.1% and 94% respectively when the mass ratio of resin to eluent sulfuric acid is 1:4. Sodium sulfite was added to increase the efficiency of tin recovery by 8.1%. EDS and XRD atlas showed that after pH regulation, the main composition of the filtration precipitation was the hydroxides of tin.

Fabrication of hierarchically structured superhydrophobic PDMS surfaces by Cu and CuO casting

NASA Astrophysics Data System (ADS)

Migliaccio, Christopher P.; Lazarus, Nathan

2015-10-01

Poly(dimethylsiloxane) (PDMS) films decorated with hierarchically structured pillars are cast from large area copper and copper oxide negative molds. The molds are fabricated using a single patterning step and electroplating. The process of casting structured PDMS films is simpler and cheaper than alternatives based on deep reactive ion etching or laser roughening of bulk silicone. Texture imparted to the pillars from the mold walls renders the PDMS films superhydrophobic, with the contact angle/hysteresis of the most non-wetting surfaces measuring 164°/9° and 158°/10° for surfaces with and without application of a low surface energy coating. The usefulness of patterned PDMS films as a "self-cleaning" solar cell module covering is demonstrated and other applications are discussed.

Boron-doped diamond microdisc arrays: electrochemical characterisation and their use as a substrate for the production of microelectrode arrays of diverse metals (Ag, Au, Cu)via electrodeposition.

PubMed

Simm, Andrew O; Banks, Craig E; Ward-Jones, Sarah; Davies, Trevor J; Lawrence, Nathan S; Jones, Timothy G J; Jiang, Li; Compton, Richard G

2005-09-01

A novel boron-doped diamond (BDD) microelectrode array is characterised with electrochemical and atomic force microscopic techniques. The array consists of 40 micron-diameter sized BDD discs which are separated by 250 microns from their nearest neighbour in a hexagonal arrangement. The conducting discs can be electroplated to produce arrays of copper, silver or gold for analytical purposes in addition to operating as an array of BDD-microelectrodes. Proof-of-concept is shown for four separate examples; a gold plated array for arsenic detection, a copper plated array for nitrate analysis, a silver plated array for hydrogen peroxide monitoring and last, cathodic stripping voltammetry for lead at the bare BDD-array.

Bath for electrolytic reduction of alumina and method therefor

DOEpatents

Brown, Craig W.; Brooks, Richard J.; Frizzle, Patrick B.; Juric, Drago D.

2002-11-26

An electrolytic bath for use during the electrolytic reduction of alumina to aluminum. The bath comprises a molten electrolyte having the following ingredients: (a) AlF.sub.3 and at least one salt selected from the group consisting of NaF, KF, and LiF; and (b) about 0.004 wt. % to about 0.2 wt. %, based on total weight of the molten electrolyte, of at least one transition metal or at least one compound of the metal or both. The compound may be, for example, a fluoride, oxide, or carbonate. The metal can be nickel, iron, copper, cobalt, or molybdenum. The bath can be employed in a combination that includes a vessel for containing the bath and at least one non-consumable anode and at least one dimensionally stable cathode in the bath. Employing the bath of the present invention during electrolytic reduction of alumina to aluminum can improve the wetting of aluminum on a cathode by reducing or eliminating the formation of non-metallic deposits on the cathode. Removing sulfur from the bath can also minimize cathode deposits. Aluminum formed on the cathode can be removed directly from the cathode.

Synthesis and performance of Zn-Ni-P thin films

NASA Astrophysics Data System (ADS)

Soare, V.; Burada, M.; Constantin, I.; Ghita, M.; Constantin, V.; Miculescu, F.; Popescu, A. M.

2015-03-01

The electroplating of Zn-Ni-P thin film alloys from a sulfate bath containing phosphoric and phosphorous acid was investigated. The bath composition and the deposition parameters were optimized through Hull cell experiments, and the optimum experimental conditions were determined (pH = 2, temperature = 298-313 K, zinc sulfate concentration = 30 g·L-1, EDTA concentration = 15 g·L-1, and current density, = ,1.0-2.0 A·dm-2). The SEM analysis of the coating deposited from the optimum bath revealed fine-grained deposits of the alloy in the presence of EDTA. Optical microscopy analysis indicated an electrodeposited thin film with uniform thickness and good adhesion to the steel substrate. The good adherence of the coatings was also demonstrated by the scratch tests that were performed, with a maximum determined value of 25 N for the critical load. Corrosion resistance tests revealed good protection of the steel substrate by the obtained Zn-Ni-P coatings, with values up to 85.89% for samples with Ni contents higher than 76%. The surface analysis of the thin film samples before and after corrosion was performed by X-ray photoelectron spectroscopy (XPS). Project support by the Partnership Romanian Research Program (PNCDI2), CORZIFILM Project nr.72-221/2008-2011 and “EU (ERDF) and Romanian Government” that allowed for acquisition of the research infrastructure under POS-CEEO 2.2.1 project INFRANANOCHEM-Nr.19/01.03.2009.

Recovery of copper as zero-valent phase and/or copper oxide nanoparticles from wastewater by ferritization.

PubMed

Heuss-Aßbichler, Soraya; John, Melanie; Klapper, Daniel; Bläß, Ulrich W; Kochetov, Gennadii

2016-10-01

Recently the focus of interest changed from merely purification of the waste water to recover heavy metals. With the slightly modified ferritization process presented here it is possible to decrease initial Cu(2+) concentrations up to 10 g/l to values <0.3 mg/l. The recovery rates of copper of all experiments are in the rage of 99.98 to almost 100%. Copper can be precipitated as oxide or zero valent metal (almost) free of hydroxide. All precipitates are exclusively of nanoparticle size. The phase assemblage depends strongly on experimental conditions as e.g. reaction temperature, pH-value, initial concentration and ageing time and condition. Three different options were developed depending on the reaction conditions. Option 1.) copper incorporation into the ferrite structure ((Cu,Fe)Fe2O4) and/or precipitation as cuprite (Cu2O) and zero-valent copper, option 2.) copper incorporation into the ferrite structure and/or precipitation as cuprite and/or tenorite (CuO) and option 3.) copper precipitation as tenorite. Ferrite is formed by the oxidation of GR in alkaline solution without additional oxygen supply. The chemistry reaches from pure magnetite up to 45% copper ferrite component. First experiments with wastewater from electroplating industry confirm the results obtained from synthetic solutions. In all cases the volume of the precipitates is extremely low compared to typical wastewater treatment by hydroxide precipitation. Therefore, pollution and further dissipation of copper can be avoided using this simple and economic process. Copyright © 2016 Elsevier Ltd. All rights reserved.

Pulsed Electrodeposition of Ni with Uniform Co-Deposition of Micron Sized Diamond Particles on Copper Substrate

NASA Astrophysics Data System (ADS)

Kumar, Prashant; Mahato, Neelima

Nanocrystalline nickel was deposited on annealed copper substrate of unit surface area (1 cm2) via pulsed electrodeposition technique using potentiostat (model 263A, Princeton Applied Research, USA) from Watts bath containing nickel sulfate, nickel chloride ,boric acid and sodium citrate. Diamond particles of three different dimensions, viz., 1, 3, and 6 micron were added separately (5 g/L) to the watts bath and co-deposited along with nanocrystalline nickel. The temperature was kept constant at 55 °C. The solution was ultrasonicated for 45-60 minutes prior to deposition to disperse the diamond particles uniformly in the bath. Depositions were carried out at different current densities, viz., 50, 100,150 and 200 mA/ cm2 for different durations, i.e.7, 14 and 21 minutes and best results are optimized for 200mA/cm2 so it is used for all process here .Scanning electron micrographs (SEM) show uniform deposition of microstructure of micron diamond on the surface of copper embedded in the nickel matrix. Elemental mapping confirmed uniform deposition of nickel and diamond with almost no cracks or pits. Mechanical properties of the sample such as, Vicker's hardness increased abruptly after the electrodeposition. Improved microstructural and mechanical properties were found in the case of electrodeposited surfaces containing followed by 3 and 6 micron diamond. The properties were also found better than those processed via stirring the solution during deposition.

Survey of selective solar absorbers and their limitations

DOE Office of Scientific and Technical Information (OSTI.GOV)

Mattox, D.M.; Sowell, R.R.

1980-01-01

A number of selective absorber coating systems with high solar absorptance exist which may be used in the mid-temperature range. Some of the systems are more chemically and thermally stable than others. Unfortunately, there are large gaps in the stability data for a large number of the systems. In an inert environment, the principle degradation mechanisms are interdiffusion between the layers or phases and changes in surface morphology. These degradation mechanisms would be minimized by using refractory metals and compounds for the absorbing layer and using refractory materials or diffusion barriers for the underlayer. For use in a reactive environment,more » the choice of materials is much more restrictive since internal chemical reactions can change phase compositions and interfacial reactions can lead to loss of adhesion. For a coating process to be useful, it is necessary to determine what parameters influence the performance of the coating and the limits to these parameters. This process sensitivity has a direct influence on the production process controls necessary to produce a good product. Experience with electroplated black chrome has been rather disappointing. Electroplating should be a low cost deposition process but the extensive bath analysis and optical monitoring necessary to produce a thermally stable produce for use to 320/sup 0/C has increased cost signficantly. 49 references.« less

Study of corrosion behavior on the addition of sodium citrate in nickel electroplating on SPCC steel using EIS

NASA Astrophysics Data System (ADS)

Riastuti, R.; Ramadini, C.; Siallagan, S. T.; Rifki, A.; Herdino, F.

2018-04-01

The addition of sodium citrate to nickel electroplating process as additive is useful for refining the grain size of nickel deposit. The refining of grain size in nickel deposit as coating layer can improve surface performance, one of which corrosion resistance. This paper aims to investigate the effect of sodium citrate addition as grain refiner to promote corrosion resistance on SPCC steel. This experiment used Watt’s Bath solution of NiSO4 300 g/L, NiCl4 45 g/L, H3BO3 60 g/L, wetting agent 0.2 cc/L. Sodium citrate was added in composition of 45g/L and 60g/L. Nickel were deposited by direct current using current density on 6 A/dm2 at the acidity level of 5 for 30 minutes by keeping the operating temperature stable at 50°C. The grain size of nickel deposit was observed through Optical Microscope and Atomic Force Microscope (AFM). The corrosion behavior of SPCC was observed by linear polarization and Electrochemical Impedance Spectroscopy (EIS) methods using 3% NaCl solution. Based on the research, the addition of sodium citrate as grain refiner will increasing corrosion resistance on SPCC steel from 0.35 to 0.05 mm/year.

Industrial Implementation of Environmentally Friendly Nanometal Electroplating Process for Chromium and Copper Beryllium Replacement using Low Cost Pulse Current Power Supplies

DTIC Science & Technology

2014-09-10

Cr-Mo, and stainless steel have to some extent found acceptance in various military and commercial CuBe-replacement roles. 1.1.2 Proposed...including low and high strength steels , stainless steel , Inconel and nickel. Figure 4-8 Activation line used to prepare components for nCoP plating...size up to a maximum thickness of 0.012”, can be produced in the tank by electroforming onto a flat stainless steel mandrel and subsequently

Low energy sputtering of cobalt by cesium ions

NASA Technical Reports Server (NTRS)

Handoo, A.; Ray, Pradosh K.

1989-01-01

An experimental facility to investigate low energy (less than 500 eV) sputtering of metal surfaces with ions produced by an ion gun is described. Results are reported on the sputtering yield of cobalt by cesium ions in the 100 to 500 eV energy range at a pressure of 1 times 10(exp -6) Torr. The target was electroplated on a copper substrate. The sputtered atoms were collected on a cobalt foil surrounding the target. Co-57 was used as a tracer to determine the sputtering yield.

Recovery of copper and water from copper-electroplating wastewater by the combination process of electrolysis and electrodialysis.

PubMed

Peng, Changsheng; Liu, Yanyan; Bi, Jingjing; Xu, Huizhen; Ahmed, Abou-Shady

2011-05-30

In this paper, a laboratory-scale process which combined electrolysis (EL) and electrodialysis (ED) was developed to treat copper-containing wastewater. The feasibility of such process for copper recovery as well as water reuse was determined. Effects of three operating parameters, voltage, initial Cu(2+) concentration and water flux on the recovery of copper and water were investigated and optimized. The results showed that about 82% of copper could be recovered from high concentration wastewater (HCW, >400mg/L) by EL, at the optimal conditions of voltage 2.5 V/cm and water flux 4 L/h; while 50% of diluted water could be recycled from low concentration wastewater (LCW, <200mg/L) by ED, at the optimal conditions of voltage 40 V and water flux 4 L/h. However, because of the limitation of energy consumption (EC), LCW for EL and HCW for ED could not be treated effectively, and the effluent water of EL and concentrated water of ED should be further treated before discharged. Therefore, the combination process of EL and ED was developed to realize the recovery of copper and water simultaneously from both HCW and LCW. The results of the EL-ED process showed that almost 99.5% of copper and 100% of water could be recovered, with the energy consumption of EL ≈ 3 kW h/kg and ED ≈ 2 kW h/m(3). According to SEM and EDX analysis, the purity of recovered copper was as high as 97.9%. Copyright © 2011 Elsevier B.V. All rights reserved.

Testing Room-Temperature Ionic Liquid Solutions for Depot Repair of Aluminum Coatings

DTIC Science & Technology

2011-05-01

Ne 3 Na Mg IIIB IVB VB VIB VIIB ------ VIIIB ------ IB IIB Al Si P S Cl Ar 4 K Ca Sc Ti V Cr Mn Fe Co Ni Cu Zn Ga Ge As Se Br Kr 5 Rb Sr Y Zr Nb Mo Tc...Ru Rh Pd Ag Cd In Sn Sb Te I Xe 6 Cs Ba La Hf Ta W Re Os Ir Pt Au Hg Tl Pb Bi Po At Rn 7 Fr Ra Ac Ce Pr Nd Pm Sm Eu Gd Tb Dy Ho Er Tm Yb Lu Th Pa U Np...Electroplating Bath Lid Arrangement ;:::::::::::=== Thermometer Purge gas vent Anode lead Cathode lead (Extractable from the lid) Purge feed gas

Preparation of superconductor precursor powders

DOEpatents

Bhattacharya, Raghunath; Blaugher, Richard D.

1995-01-01

A process for the preparation of a precursor metallic powder composition for use in the subsequent formation of a superconductor. The process comprises the steps of providing an electrodeposition bath comprising an electrolyte medium and a cathode substrate electrode, and providing to the bath one or more soluble salts of one or more respective metals, such as nitrate salts of thallium, barium, calcium, and copper, which are capable of exhibiting superconductor properties upon subsequent appropriate treatment. The bath is continually energized to cause the metallic particles formed at the electrode to drop as a powder from the electrode into the bath, and this powder, which is a precursor powder for superconductor production, is recovered from the bath for subsequent treatment. The process permits direct inclusion of thallium in the preparation of the precursor powder, and yields an amorphous product mixed on an atomic scale to thereby impart inherent high reactivity. Superconductors which can be formed from the precursor powder include pellet and powder-in-tube products.

An application of computer image-processing and filmy replica technique to the copper electroplating method of stress analysis

NASA Astrophysics Data System (ADS)

Sugiura, M.; Seika, M.

1994-02-01

In this study, a new technique to measure the density of slip-bands automatically is developed, namely, a TV image of the slip-bands observed through a microscope is directly processed by an image-processing system using a personal computer and an accurate value of the density of slip-bands is measured quickly. In the case of measuring the local stresses in machine parts of large size with the copper plating foil, the direct observation of slip-bands through an optical microscope is difficult. In this study, to facilitate a technique close to the direct microscopic observation of slip-bands in the foil attached to a large-sized specimen, the replica method using a platic film of acetyl cellulose is applied to replicate the slip-bands in the attached foil.

Nuclear model calculation and targetry recipe for production of 110mIn.

PubMed

Kakavand, T; Mirzaii, M; Eslami, M; Karimi, A

2015-10-01

(110m)In is potentially an important positron emitting that can be used in positron emission tomography. In this work, the excitation functions and production yields of (110)Cd(d, 2n), (111)Cd(d, 3n), (nat)Cd(d, xn), (110)Cd(p, n), (111)Cd(p, 2n), (112)Cd(p, 3n) and (nat)Cd(p, xn) reactions to produce the (110m)In were calculated using nuclear model code TALYS and compared with the experimental data. The yield of isomeric state production of (110)In was also compared with ground state production ones to reach the optimal energy range of projectile for the high yield production of metastable state. The results indicate that the (110)Cd(p, n)(110m)In is a high yield reaction with an isomeric ratio (σ(m)/σ(g)) of about 35 within the optimal incident energy range of 15-5 MeV. To make the target, cadmium was electroplated on a copper substrate in varying electroplating conditions such as PH, DC current density, temperature and time. A set of cold tests were also performed on the final sample under several thermal shocks to verify target resistance. The best electroplated cadmium target was irradiated with 15 MeV protons at current of 100 µA for one hour and the production yield of (110m)In and other byproducts were measured. Copyright © 2015 Elsevier Ltd. All rights reserved.

Copper@carbon coaxial nanowires synthesized by hydrothermal carbonization process from electroplating wastewater and their use as an enzyme-free glucose sensor.

PubMed

Zhao, Yuxin; He, Zhaoyang; Yan, Zifeng

2013-01-21

In the pursuit of electrocatalysts with great economic and ecological values for non-enzymatic glucose sensors, one-dimensional copper@carbon (Cu@C) core-shell coaxial nanowires (NWs) have been successfully prepared via a simple continuous flow wet-chemistry approach from electroplating wastewater. The as-obtained products were characterized by X-ray powder diffraction, scanning electron microscopy, transmission electron microscopy, selected area electron diffraction, energy dispersive X-ray spectroscopy and Raman spectroscopy. The electrocatalytic activity of the modified electrodes by Cu@C NWs towards glucose oxidation was investigated by cyclic voltammetry and chronoamperometry. It was found that the as-obtained Cu@C NWs showed good electrochemical properties and could be used as an electrochemical sensor for the detection of glucose molecules. Compared to the other electrodes including the bare Nafion/glassy carbon electrode (GCE) and several hot hybrid nanostructures modified GCE, a substantial decrease in the overvoltage of the glucose oxidation was observed at the Cu@C NWs electrodes with oxidation starting at ca. 0.20 V vs. Ag/AgCl (3 M KCl). At an applied potential of 0.65 V, Cu@C NWs electrodes had a high and reproducible sensitivity of 437.8 µA cm(-2) mM(-1) to glucose. Linear responses were obtained with a detection limit of 50 nM. More importantly, the proposed electrode also had good stability, high resistance against poisoning by chloride ion and commonly interfering species. These good analytical performances make Cu@C NWs promising for the future development of enzyme-free glucose sensors.

Effect of cobalt content on wear and corrosion behaviors of electrodeposited Ni-Co/WC nano-composite coatings.

PubMed

Amadeh, A; Ebadpour, R

2013-02-01

Metal-ceramic composite coatings are widely used in automotive and aerospace industries as well as micro-electronic systems. Electrodeposition is an economic method for application of these coatings. In this research, nickel-cobalt coatings reinforced by nano WC particles were applied on carbon steel substrate by pulse electrodeposition from modified Watts bath containing different amounts of cobalt sulphate as an additive. Saccharin and sodium dodecyl sulphate (SDS) were also added to electroplating bath as grain refiner and surfactant, respectively. The effect of cobalt content on wear and corrosion behavior of the coatings was investigated. Wear and corrosion properties were assessed by pin-on-disk and potentiodynamic polarization methods, respectively. Phase analysis was performed by X-ray diffraction (XRD) using CuK(alpha) radiation and the worn surfaces were studied by means of Scanning Electron Microscopy (SEM). The results showed that the addition of cobalt improved the wear resistance of the coatings. In the presence of 18 g/L cobalt in electrodeposition bath, the wear rate of the coating decreased to 0.002 mg/m and the coefficient of friction reduced to 0.695 while they were 0.004 mg/m and 0.77 in the absence of cobalt, respectively. This improvement in wear properties can be attributed to the formation of hcp phase in metallic matrix. Meanwhile, the corrosion resistance of the coatings slightly reduced because cobalt is more active metal with respect to nickel.

Cleaning and activation of beryllium-copper electron multiplier dynodes.

NASA Technical Reports Server (NTRS)

Pongratz, M. B.

1972-01-01

Description of a cleaning and activation procedure followed in preparing beryllium-copper dynodes for electron multipliers used in sounding-rocket experiments to detect auroral electrons. The initial degreasing step involved a 5-min bath in trichloroethylene in an ultrasonic cleaner. This was followed by an ultrasonic rinse in methanol and by a two-step acid pickling treatment to remove the oxides. Additional rinsing in water and methanol was followed by activation in a stainless-steel RF induction oven.

Electroless Cu Plating on Anodized Al Substrate for High Power LED.

PubMed

Rha, Sa-Kyun; Lee, Youn-Seoung

2015-03-01

Area-selective copper deposition on screen printed Ag pattern/anodized Al/Al substrate was attempted using a neutral electroless plating processes for printed circuit boards (PCBs), according to a range of variation of pH 6.5-pH 8 at 70 °C. The utilized basic electroless solution consisted of copper(II) sulfate pentahydrate, sodium phosphinate monohydrate, sodium citrate tribasic dihydrate, ammonium chloride, and nickel(II) sulfate hexahydrate. The pH of the copper plating solutions was adjusted from pH 6.5 to pH 8 using NH4OH. Using electroless plating in pH 6.5 and pH 7 baths, surface damage to the anodized Al layer hardly occurred; the structure of the plated Cu-rich films was a typical fcc-Cu, but a small Ni component was co-deposited. In electroless plating at pH 8, the surface of the anodized Al layer was damaged and the Cu film was composed of a lot of Ni and P which were co-deposited with Cu. Finally, in a pH 7 bath, we can make a selectively electroless plated Cu film on a PCB without any lithography and without surface damage to the anodized Al layer.

Nuclear demagnetisation cooling of a nanoelectronic device

NASA Astrophysics Data System (ADS)

Jones, Alex; Bradley, Ian; Guénault, Tony; Gunnarsson, David; Haley, Richard; Holt, Stephen; Pashkin, Yuri; Penttilä, Jari; Prance, Jonathan; Prunnila, Mika; Roschier, Leif

We present a new technique for on-chip cooling of electrons in a nanostructure: nuclear demagnetisation of on-chip, thin-film copper refrigerant. We are motivated by the potential improvement in the operation of nanoelectronic devices below 10 mK . At these temperatures, weak electron-phonon coupling hinders traditional cooling, yet here gives the advantage of thermal isolation between the environment and the on-chip electrons, enabling cooling significantly below the base temperature of the host lattice. To demonstrate this we electroplate copper onto the metallic islands of a Coulomb blockade thermometer (CBT), and hence provide a direct thermal link between the cooled copper nuclei and the device electrons. The CBT provides primary thermometry of its internal electron temperature, and we use this to monitor the cooling. Using an optimised demagnetisation profile we observe the electrons being cooled from 9 mK to 4 . 5 mK , and remaining below 5 mK for an experimentally useful time of 1200 seconds. We also suggest how this technique can be used to achieve sub- 1 mK electron temperatures without the use of elaborate bulk demagnetisation stages.

Visualization of natural convection heat transfer on a sphere

NASA Astrophysics Data System (ADS)

Lee, Dong-Young; Chung, Bum-Jin

2017-12-01

Natural convection heat transfer phenomena on spheres were investigated by adopting mass transfer experiments based on analogy concept. The diameters of spheres were varied from 0.01 m to 0.12 m, which correspond to the Rayleigh numbers of 1.69×108-2.91×1011. The measured mass transfer coefficients agreed well with the existing correlations. The copper electroplating patterns on the spheres visualized the local heat transfer depending on angular distance. The streak plating patterns were observed on the upper part of the sphere, resulting from the wavy flow patterns caused by the instability.

Sputtering of cobalt and chromium by argon and xenon ions near the threshold energy region

NASA Technical Reports Server (NTRS)

Handoo, A. K.; Ray, P. K.

1993-01-01

Sputtering yields of cobalt and chromium by argon and xenon ions with energies below 50 eV are reported. The targets were electroplated on copper substrates. Measurable sputtering yields were obtained from cobalt with ion energies as low as 10 eV. The ion beams were produced by an ion gun. A radioactive tracer technique was used for the quantitative measurement of the sputtering yield. Co-57 and Cr-51 were used as tracers. The yield-energy curves are observed to be concave, which brings into question the practice of finding threshold energies by linear extrapolation.

Navy electroplating pollution control technology assessment manual

NASA Astrophysics Data System (ADS)

Cushnie, G. C., Jr.

1984-02-01

The report provides information on more than 27 separate technologies encompassing conventional treatment, alternate treatment, material recovery techniques and processes and new plating bath formulations. In addition, the incorporation of a section on in-plant process changes enhances the usefulness of the product in that it highlights noncapital-intensive changes to current practices and/or processes that may have significant bearing on reducing overall chemical and water usage costs as well as consequent wastewater treatment needs and disposal costs. This document was prepared as a joint Air Force-Navy effort. It is intended to serve as a guide for technical personnel making decisions on an appropriate means of meeting effluent limits. The selection of any of the described technologies should be done only after a rigorous identification of site requirements has been performed.

Mixing Phenomena in a Bottom Blown Copper Smelter: A Water Model Study

NASA Astrophysics Data System (ADS)

Shui, Lang; Cui, Zhixiang; Ma, Xiaodong; Akbar Rhamdhani, M.; Nguyen, Anh; Zhao, Baojun

2015-03-01

The first commercial bottom blown oxygen copper smelting furnace has been installed and operated at Dongying Fangyuan Nonferrous Metals since 2008. Significant advantages have been demonstrated in this technology mainly due to its bottom blown oxygen-enriched gas. In this study, a scaled-down 1:12 model was set up to simulate the flow behavior for understanding the mixing phenomena in the furnace. A single lance was used in the present study for gas blowing to establish a reliable research technique and quantitative characterisation of the mixing behavior. Operating parameters such as horizontal distance from the blowing lance, detector depth, bath height, and gas flow rate were adjusted to investigate the mixing time under different conditions. It was found that when the horizontal distance between the lance and detector is within an effective stirring range, the mixing time decreases slightly with increasing the horizontal distance. Outside this range, the mixing time was found to increase with increasing the horizontal distance and it is more significant on the surface. The mixing time always decreases with increasing gas flow rate and bath height. An empirical relationship of mixing time as functions of gas flow rate and bath height has been established first time for the horizontal bottom blowing furnace.

Electroformed Nickel Mirrors for the Next Generation Space Telescope

NASA Technical Reports Server (NTRS)

Redmon, John W.; Engelhaupt, Darrel

1998-01-01

This paper summarizes the work to date on a novel mirror fabrication technique being developed at the Marshall Space Flight Center for potential use on the Next Generation Space Telescope (NGST). This technique involves forming an extremely lightweight mirror by electroplating nickel and nickel based alloys onto a highly polished precision mandrel. The resulting mirror shell can then be backed up with or attached to a lightweight structure to produce a mirror element that is on the order of 15 kg/sq m areal density. Since the mirrors are fabricated from a mandrel (or master), subsequent mirrors can be made with very high economy; this technique is particularly suited to segmented mirrors schemes whereby large apertures are achieved through the deployment of smaller segments. Control of the electroplating process is the key element for producing high quality optics; bath chemistry and real time control of the plating current density yields uniform grained electroforms with zero residual stress. To accomplish this, a special electronic sensor was developed whereby the residual stress can be monitored as the nickel is electrolytically deposited. This information is used in a feedback loop to modulate current density which, in turn, directly governs the residual stress. Details pertaining to this and other aspects of the fabrication of a half meter mirror will be published along with test results and metrology data.

Characterization of Pulse Reverses Electroforming on Hard Gold Coating.

PubMed

Byoun, Young-Min; Noh, Young-Tai; Kim, Young-Geun; Ma, Seung-Hwan; Kim, Gwan-Hoon

2018-03-01

Effect of pulse reverse current (PRC) method on brass coatings electroplated from gold solution was investigated by various plating parameters such as plating duration, the anodic duty cycle, the anodic current density and the cathodic current density. The reversed current results in a significant change in the morphology of electrodeposits, improvement of the overall current efficiency and reduction of deposit porosity. With longer pulses, hemispherical surface features are generated, while larger grains result from shorter pulse widths. The porosity of the plated samples is found to decrease compared with results at the same time-average plating rate obtained from DC or Pulse plating. A major impediment to reducing gold later thickness is the corrosion of the underlying substrate, which is affected by the porosity of the gold layer. Both the morphology and the hydrogen evolution reaction have significant impact on porosity. PRC plating affect hydrogen gold and may oxidize hydrogen produced during the cathodic portion of the waveform. Whether the dissolution of gold and oxidation of hydrogen occur depends on the type of plating bath and the plating conditions adapted. In reversed pulse plating, the amount of excess near-surface cyanide is changed after the cathodic current is applied, and the oxidation of gold under these conditions has not been fully addressed. The effects of the current density, pulse-reverse ratio and brightener concentration of the electroplating process were investigated and optimized for suitable performance.

Multiple metal exposures and their correlation with monoamine neurotransmitter metabolism in Chinese electroplating workers.

PubMed

Wu, Lin-Lin; Gong, Wei; Shen, Si-Peng; Wang, Zhong-He; Yao, Jia-Xi; Wang, Jun; Yu, Jing; Gao, Rong; Wu, Gang

2017-09-01

Excessive metal exposure has been recognized as one of the detrimental factors for brain damage. However, the potential adverse effects induced by heavy metals on monoamine neurotransmitter pathways remains poorly understood. Our study aimed to investigate the possible association between metal exposure and neurotransmitter metabolism. By a cross-sectional investigation, 224 electroplating workers and 213 non-electroplating exposure workers were recruited in the exposure and control groups. Metal exposure levels were analyzed using inductively-coupled plasma mass spectrometry and monoamine neurotransmitter pathway metabolites were measured by ultra-performance liquid chromatography tandem mass spectrometry in human urine samples. Multivariate linear regression model was used to assess the dose-response relationships of urinary metals and neurotransmitter pathway metabolites. Significant dose-dependent trends of urinary vanadium quartiles with all metabolites were observed, and the trends demonstrated significance after multiple testing correction. It also showed that urinary chromium levels were significantly associated with decreased serotonin level and cadmium was positively associated with norepinephrine and epinephrine. In addition, arsenic was positively associated with tryptophan, serotonin, dopamine and norepinephrine. Iron was positively associated with increased homovanillic acid (HVA) and epinephrine while nickel was negatively associated with increased epinephrine levels. Zinc was positively related to tryptophan, kynurenin (KYN), 5-hydroxyindole acetic acid (5-HIAA), dopamine, HVA and norepinephrine. There was no significant association between urinary copper with any other metabolites after adjusting of multiple metal models. Metal exposure may be associated with neurotransmitter metabolism disturbances. The present work is expected to provide some support in the prevention and management of metal-associated neurological diseases. Copyright © 2017. Published by Elsevier Ltd.

Investigation of copper sorption by sugar beet processing lime waste.

PubMed

Ippolito, J A; Strawn, D G; Scheckel, K G

2013-01-01

In the western United States, sugar beet processing for sugar recovery generates a lime-based waste product (∼250,000 Mg yr) that has little liming value in the region's calcareous soils. This area has recently experienced an increase in dairy production, with dairies using copper (Cu)-based hoof baths to prevent hoof diseases. A concern exists regarding soil Cu accumulation because spent hoof baths may be disposed of in waste ponds, with pond waters being used for irrigation. The objective of this preliminary study was to evaluate the ability of lime waste to sorb Cu. Lime waste was mixed with increasing Cu-containing solutions (up to 100,000 mg Cu kg lime waste) at various buffered pH values (pH 6, 7, 8, and 9) and shaken over various time periods (up to 30 d). Copper sorption phenomenon was quantified using sorption maximum fitting, and the sorption mechanism was investigated using X-ray absorption spectroscopy. Results showed that sorption onto lime waste increased with decreasing pH and that the maximum Cu sorption of ∼45,000 mg kg occurred at pH 6. X-ray absorption spectroscopy indicated that Cu(OH) was the probable species present, although the precipitate existed as small multinuclear precipitates on the surface of the lime waste. Such structures may be precursors for larger surface precipitates that develop over longer incubation times. Findings suggest that sugar beet processing lime waste can viably sorb Cu from liquid waste streams, and thus it may have the ability to remove Cu from spent hoof baths. Copyright © by the American Society of Agronomy, Crop Science Society of America, and Soil Science Society of America, Inc.

Process for the Production of Star Tracklng [Tracking] Reticles

NASA Technical Reports Server (NTRS)

Smith, Wade O. (Inventor); Toft, Albert R. (Inventor)

1972-01-01

A method for the production of reticles, particularly those for use in outer space, wherein the product is a quartz base coated with highly adherent layers of chromium, chromium-silver, and silver vacuum deposited through a mask, and then coated with an electrodeposit of copper from a copper sulfate solution followed by an electrodeposit of black chromium. The masks are produced by coating a beryllium-copper alloy substrate with a positive working photoresist, developing the photoresist according to a pattern to leave a positive mask, plating uncoated areas with gold, removing the photoresist, coating the substrate with a negative working photoresist, developing the negative working photoresist to expose the base metal of the pattern, and chemically etching the unplated side of the pattern to produce the mask. The mask produced is then used in the vacuum deposition of: (1) chromium metal on the surface of a quartz base to obtain a highly adherent quartz-chromium interface; (2) silver on the chromium deposit, during the final stage of chromium deposit, to produce a silver chromium alloy layer; and (3) silver onto the surface of the alloy layer. The coated quartz base is then coated by electroplating utilizing an acid copper deposit followed by a black chromium electrodeposit to produce the product of the present invention.

Preparation and characterization of copper telluride thin films by modified chemical bath deposition (M-CBD) method

NASA Astrophysics Data System (ADS)

Pathan, H. M.; Lokhande, C. D.; Amalnerkar, D. P.; Seth, T.

2003-09-01

Copper telluride thin films were deposited using modified chemical method using copper(II) sulphate; pentahydrate [CuSO 4·5H 2O] and sodium tellurite [Na 2TeO 3] as cationic and anionic sources, respectively. Modified chemical method is based on the immersion of the substrate into separately placed cationic and anionic precursors. The preparative conditions such as concentration, pH, immersion time, immersion cycles, etc. were optimized to get good quality copper telluride thin films at room temperature. The films have been characterized for structural, compositional, optical and electrical transport properties by means of X-ray diffraction (XRD), scanning electron microscopy (SEM), energy dispersive X-ray analysis (EDAX), Rutherford back scattering (RBS), optical absorption/transmission, electrical resistivity and thermoemf measurement techniques.

40 CFR 413.10 - Applicability: Description of the electroplating of common metals subcategory.

Code of Federal Regulations, 2010 CFR

2010-07-01

... electroplating of common metals subcategory. 413.10 Section 413.10 Protection of Environment ENVIRONMENTAL PROTECTION AGENCY (CONTINUED) EFFLUENT GUIDELINES AND STANDARDS ELECTROPLATING POINT SOURCE CATEGORY Electroplating of Common Metals Subcategory § 413.10 Applicability: Description of the electroplating of common...

Burnout Test of First- and Second-Generation HTS Tapes in Liquid-Nitrogen Bath Cooling

NASA Astrophysics Data System (ADS)

Young, M. A.; Demko, J. A.; Duckworth, R. C.; Lue, J. W.; Gouge, M. J.; Pace, M. O.

2004-06-01

A series of BSCCO-2223 and YBCO tapes were subjected to burnout tests in a liquid-nitrogen bath to observe operational stability limits when different layers of dielectric tape are added to the sample surface. In this study, the BSCCO tapes were composed of a silver/alloy sheath with nickel/copper plating, while the YBCO tapes had a 50-μm layer of copper attached to the silver surface. After attaching the tapes to a thermally insulated G-10 holder, the stability of the tapes was found by applying current greater than the critical current and holding it constant for up to 1 min. If the sample voltage increased rapidly during this period, the tape was considered unstable at this current. This was repeated at different layers of Cryoflex™, and the results were compared to a numerical simulation of the energy balance equation. This simulation was also utilized to investigate the effect of the layers on the stability limit and estimate the thermal conductivity of the Cryoflex™.

Submerged Gas Jet Penetration: A Study of Bubbling Versus Jetting and Side Versus Bottom Blowing in Copper Bath Smelting

NASA Astrophysics Data System (ADS)

Kapusta, Joël P. T.

2017-06-01

Although the bottom blowing ShuiKouShan process has now been widely implemented in China, in both lead and copper smelters, some doubts, questions, and concerns still seem to prevail in the metallurgical community outside China. In the author's opinion, part of these doubts and concerns could be addressed by a better general understanding of key concepts of submerged gas injection, including gas jet trajectory and penetration, and the concept, application, and benefits of sonic injection in jetting regime. To provide some answers, this article first offers a discussion on the historical developments of the theory and mathematical characterization of submerged gas jet trajectory, including the proposed criteria for the transition from bubbling to jetting regime and the application of the Prandtl-Meyer theory to submerged gas jets. A second part is devoted to a quantitative study of submerged gas jet penetration in copper bath smelting, including a comparison between bubbling and jetting regimes, and side versus bottom blowing. In the specific cases studied, the calculated gas jet axis trajectory length in jetting regime is 159 cm for bottom blowing, whereas it varies between 129 and 168 cm for side blowing for inclination angles of +18° to -30° to the horizontal. This means that side blowing in the jetting regime would provide a deeper penetration and longer gas jet trajectory than generally obtained by conventional bath smelting vessels such as the Noranda and Teniente reactors. The theoretical results of this study do corroborate the successful high-intensity practice of the slag make converting process at Glencore Nickel in Canada that operates under high oxygen shrouded injection in the jetting regime, and this would then suggest that retrofitting conventional low-pressure, side-blowing tuyeres of bath smelting and converting reactors with sonic injectors in jetting regime certainly appears as a valuable option for process intensification with higher oxygen enrichment, without major process changes or large capital expenditure, i.e., no need for full reactor replacement.

CorA Is a Copper Repressible Surface-Associated Copper(I)-Binding Protein Produced in Methylomicrobium album BG8

PubMed Central

Johnson, Kenneth A.; Ve, Thomas; Larsen, Øivind; Pedersen, Rolf B.; Lillehaug, Johan R.; Jensen, Harald B.; Helland, Ronny; Karlsen, Odd A.

2014-01-01

CorA is a copper repressible protein previously identified in the methanotrophic bacterium Methylomicrobium album BG8. In this work, we demonstrate that CorA is located on the cell surface and binds one copper ion per protein molecule, which, based on X-ray Absorption Near Edge Structure analysis, is in the reduced state (Cu(I)). The structure of endogenously expressed CorA was solved using X-ray crystallography. The 1.6 Å three-dimensional structure confirmed the binding of copper and revealed that the copper atom was coordinated in a mononuclear binding site defined by two histidines, one water molecule, and the tryptophan metabolite, kynurenine. This arrangement of the copper-binding site is similar to that of its homologous protein MopE* from Metylococcus capsulatus Bath, confirming the importance of kynurenine for copper binding in these proteins. Our findings show that CorA has an overall fold similar to MopE, including the unique copper(I)-binding site and most of the secondary structure elements. We suggest that CorA plays a role in the M. album BG8 copper acquisition. PMID:24498370

Colloidal and electrochemical aspects of copper-CMP

NASA Astrophysics Data System (ADS)

Sun, Yuxia

Copper based interconnects with low dielectric constant layers are currently used to increase interconnect densities and reduce interconnect time delays in integrated circuits. The technology used to develop copper interconnects involves Chemical Mechanical Planarization (CMP) of copper films deposited on low-k layers (silica or silica based films), which is carried out using slurries containing abrasive particles. One issue using such a structure is copper contamination over dielectric layers (SiO2 film), if not reduced, this contamination will cause current leakage. In this study, the conditions conducive to copper contamination onto SiO2 films during Cu-CMP process were studied, and a post-CMP cleaning technique was discussed based on experimental results. It was found that the adsorption of copper onto a silica surface is kinetically fast (<0.5 minute). The amount of copper absorbed is pH and concentration dependent and affected by presence of H2O2, complexing agents, and copper corrosion inhibitor Benzotrazole. Based on de-sorption results, DI water alone was unable to reduce adsorbed copper to an acceptable level, especially for adsorption that takes place at a higher pH condition. The addition of complex agent, citric acid, proved effective in suppressing copper adsorption onto oxide silica during polishing or post-CMP cleaning by forming stable copper-CA complexes. Surface Complexation Modeling was used to simulate copper adsorption isotherms and predict the copper contamination levels on SiO2 surfaces. Another issue with the application of copper CMP is its environmental impact. CMP is a costly process due to its huge consumption of pure water and slurry. Additionally, Cu-CMP processing generates a waste stream containing certain amounts of copper and abrasive slurry particles. In this study, the separation technique electrocoagulation was investigated to remove both copper and abrasive slurry particles simultaneously. For effluent containing ˜40 ppm dissolved copper, it was found that ˜90% dissolved copper was removed from the waste streams through electroplating and in-situ chemical precipitation. The amount of copper removed through plating is impacted by membrane surface charge, type/amount of complexing agents, and solid content in the slurry suspension. The slurry particles can be removed ˜90% within 2 hours of EC through multiple mechanisms.

Process for forming a nickel foil with controlled and predetermined permeability to hydrogen

DOEpatents

Engelhaupt, Darell E.

1981-09-22

The present invention provides a novel process for forming a nickel foil having a controlled and predetermined hydrogen permeability. This process includes the steps of passing a nickel plating bath through a suitable cation exchange resin to provide a purified nickel plating bath free of copper and gold cations, immersing a nickel anode and a suitable cathode in the purified nickel plating bath containing a selected concentration of an organic sulfonic acid such as a napthalene-trisulfonic acid, electrodepositing a nickel layer having the thickness of a foil onto the cathode, and separating the nickel layer from the cathode to provide a nickel foil. The anode is a readily-corrodible nickel anode. The present invention also provides a novel nickel foil having a greater hydrogen permeability than palladium at room temperature.

Synthesis of nanocrystalline α-Fe2O3 by using thermal oxidation of Fe Films

NASA Astrophysics Data System (ADS)

Fortas, G.; Saidoun, I.; Abboud, H.; Gabouze, N.; Haine, N.; Manseri, A.; Zergoug, M.; Menari, H.; Sam, S.; Cheraga, H.; Bozetine, I.

2018-03-01

α-Fe2O3 hematite films were prepared by thermal oxidation from Fe films electroplated on silicon. Electrodeposition of Fe thin films was carried out from a sulfate bath containing an ammonium chloride complexing agent. The electrochemical study was performed by cyclic voltammetry. The SEM analysis of the films obtained at a -1.3 V constant polarization shows dendritic grains in the form of islet. The DRX spectra exhibit characteristic iron peaks according to the face centered cubic (Fcc) structure. These samples were annealed. At a temperature of 650 ° C, a single iron oxide phase was well formed, with the hematite structure. The SEM photos show a well-assembled columnar structure with formation of nanowires at the surface of the deposit. The absorbance spectra reveal an absorption features in the ultraviolet range

DOE Office of Scientific and Technical Information (OSTI.GOV)

Randolph, B.

Composite liners have been fabricated for the Los Alamos liner driven HEDP experiments using impactors formed by physical vapor deposition (PVD), electroplating, machining and shrink fitting. Chemical vapor deposition (CVD) has been proposed for some ATLAS liner applications. This paper describes the processes used to fabricate machined and shrink fitted impactors which have been used for copper impactors in 1100 aluminum liners and 6061 T-6 aluminum impactors in 1100 aluminum liners. The most successful processes have been largely empirically developed and rely upon a combination of shrink fitted and light press fitting. The processes used to date will be describedmore » along with some considerations for future composite liners requirements in the HEDP Program.« less

SUBSTITUTION OF CADMIUM CYANIDE ELECTROPLATING WITH ZINC CHLORIDE ELECTROPLATING

EPA Science Inventory

The study evaluated the zinc chloride electroplating process as a substitute for cadmium cyanide electroplating in the manufacture of industrial connectors and fittings at Aeroquip Corporation. The process substitution eliminates certain wastes, specifically cadmium and cyanide, ...

Biosorption of Heavy Metals from Aqueous Solution by Bacteria Isolated from Contaminated Soil.

PubMed

Dhanwal, Pradeep; Kumar, Anil; Dudeja, Shruti; Badgujar, Hemlata; Chauhan, Rohit; Kumar, Abhishek; Dhull, Poonam; Chhokar, Vinod; Beniwal, Vikas

2018-05-01

  This study was carried out to analyze the heavy metals biosorption potential of bacteria isolated from soil contaminated with electroplating industrial effluents. Bacterial isolates were screened for their multi-metal biosorption potential against copper, nickel, lead, and chromium. Bacterial isolate CU4A showed the maximum uptake of copper, nickel, lead, and chromium in aqueous solution, with a biosorption efficiency of 87.16 %, 79.62%, 84.92%, and 68.12%, respectively. The bacterial strain CU4A was identified as Bacillus cereus, following 16S rRNA gene sequence analysis. The surface chemical functional groups of bacterial biomass were identified by Fourier transform infrared (FTIR) spectroscopy as hydroxyl, carboxyl, amine, and halide, which may be involved in the biosorption of heavy metals. Analysis with scanning electron microscopy (SEM) and energy dispersive spectroscopy (EDS) confirmed the adsorption of metals on the bacterial cell mass. The results of this study are significant and could be further investigated for the removal of heavy metals from contaminated environments.

Heat Sinking, Cross Talk, and Temperature Stability for Large, Close-Packed Arrays of Microcalorimeters

NASA Technical Reports Server (NTRS)

Imoto, Naoko; Bandler, SImon; Brekosky, Regis; Chervenak, James; Figueroa-Felicano, Enectali; Finkbeiner, Frederick; Kelley, Richard; Kilbourne, Caroline; Porter, Frederick; Sadleir, Jack;

Process for preparing superconducting film having substantially uniform phase development

DOEpatents

Bharacharya, Raghuthan; Parilla, Philip A.; Blaugher, Richard D.

1995-01-01

A process for preparing a superconducting film, such as a thallium-barium-calcium-copper oxide superconducting film, having substantially uniform phase development. The process comprises providing an electrodeposition bath having one or more soluble salts of one or more respective potentially superconducting metals in respective amounts adequate to yield a superconducting film upon subsequent appropriate treatment. Should all of the metals required for producing a superconducting film not be made available in the bath, such metals can be a part of the ambient during a subsequent annealing process. A soluble silver salt in an amount between about 0.1% and about 4.0% by weight of the provided other salts is also provided to the bath, and the bath is electrically energized to thereby form a plated film. The film is annealed in ambient conditions suitable to cause formation of a superconductor film. Doping with silver reduces the temperature at which the liquid phase appears during the annealing step, initiates a liquid phase throughout the entire volume of deposited material, and influences the nucleation and growth of the deposited material.

Process for preparing superconducting film having substantially uniform phase development

DOEpatents

Bharacharya, R.; Parilla, P.A.; Blaugher, R.D.

1995-12-19

A process is disclosed for preparing a superconducting film, such as a thallium-barium-calcium-copper oxide superconducting film, having substantially uniform phase development. The process comprises providing an electrodeposition bath having one or more soluble salts of one or more respective potentially superconducting metals in respective amounts adequate to yield a superconducting film upon subsequent appropriate treatment. Should all of the metals required for producing a superconducting film not be made available in the bath, such metals can be a part of the ambient during a subsequent annealing process. A soluble silver salt in an amount between about 0.1% and about 4.0% by weight of the provided other salts is also provided to the bath, and the bath is electrically energized to thereby form a plated film. The film is annealed in ambient conditions suitable to cause formation of a superconductor film. Doping with silver reduces the temperature at which the liquid phase appears during the annealing step, initiates a liquid phase throughout the entire volume of deposited material, and influences the nucleation and growth of the deposited material. 3 figs.

40 CFR 413.01 - Applicability and compliance dates.

Code of Federal Regulations, 2010 CFR

2010-07-01

... GUIDELINES AND STANDARDS ELECTROPLATING POINT SOURCE CATEGORY General Provisions § 413.01 Applicability and compliance dates. (a) This part shall apply to electroplating operations in which metal is electroplated on..., whether such operations are conducted in conjunction with electroplating, independently, or as part of...

[Quantitative classification-based occupational health management for electroplating enterprises in Baoan District of Shenzhen, China].

PubMed

Zhang, Sheng; Huang, Jinsheng; Yang, Baigbing; Lin, Binjie; Xu, Xinyun; Chen, Jinru; Zhao, Zhuandi; Tu, Xiaozhi; Bin, Haihua

2014-04-01

To improve the occupational health management levels in electroplating enterprises with quantitative classification measures and to provide a scientific basis for the prevention and control of occupational hazards in electroplating enterprises and the protection of workers' health. A quantitative classification table was created for the occupational health management in electroplating enterprises. The evaluation indicators included 6 items and 27 sub-items, with a total score of 100 points. Forty electroplating enterprises were selected and scored according to the quantitative classification table. These electroplating enterprises were classified into grades A, B, and C based on the scores. Among 40 electroplating enterprises, 11 (27.5%) had scores of >85 points (grade A), 23 (57.5%) had scores of 60∼85 points (grade B), and 6 (15.0%) had scores of <60 points (grade C). Quantitative classification management for electroplating enterprises is a valuable attempt, which is helpful for the supervision and management by the health department and provides an effective method for the self-management of enterprises.

In-situ realtime monitoring of nanoscale gold electroplating using micro-electro-mechanical systems liquid cell operating in transmission electron microscopy

DOE Office of Scientific and Technical Information (OSTI.GOV)

Egawa, Minoru; Fujita, Hiroyuki; Ishida, Tadashi, E-mail: ishida.t.ai@m.titech.ac.jp

2016-01-11

The dynamics of nanoscale electroplating between gold electrodes was investigated using a microfabricated liquid cell mounted on a scanning transmission electron microscope. The electroplating was recorded in-situ for 10 min with a spatial resolution higher than 6 nm. At the beginning of the electroplating, gold spike-like structures of about 50 nm in size grew from an electrode, connected gold nanoclusters around them, and form three dimensional nanoscale structures. We visualized the elementary process of the gold electroplating, and believe that the results lead to the deeper understanding of electroplating at the nanoscale.

Black chrome solar selective coating

DOE Office of Scientific and Technical Information (OSTI.GOV)

Pettit, R.B.; Sowell, R.R.

1980-01-01

Electrodeposited black chrome solar selective coatings have frequently experienced thermal stability problems when heated to temperatures above 250/sup 0/C (480/sup 0/F) in air. By reducing the trivalent chromium concentration in the standard black chrome plating bath, coatings on nickel substrates are obtained which are stable for thousands of hours at 350/sup 0/C (660/sup 0/F) and for hundreds of hours at 400/sup 0/C (750/sup 0/F). These results have been obtained consistently on a laboratory scale, but difficulty in reproducing the results has been encountered in a production environment. A current study of the effects of known plating variables on the opticalmore » properties and thermal stability of coatings is aimed at establishing an acceptable range for each plating parameter. A preliminary process specification for electroplating mild steel substrates with a stable black chrome coating is presented.« less

NTP technical report on toxicity studies of cadmium oxide (Cas No. 1306-19-0) administered by inhalation to F344/N rats and B6C3f1 mice. Toxicity report series

DOE Office of Scientific and Technical Information (OSTI.GOV)

NONE

1995-03-01

Three thousand tons of cadmium are imported or produced annually in the United States, and approximately 90% of this is cadmium oxide. Cadmium oxide is used in batteries, electroplating baths, pigments, plastics, synthetic products, and a variety of other materials. Cadmium oxide was nominated for study by the National Cancer Institute because of its widespread use and to obtain toxicity and carcinogenicity information. This report describes toxicity studies of cadmium oxide aerosol in F344/N rats and B6C3F1 mice, including sperm motility and vaginal cytology evaluations, and developmental toxicity studies of cadmium oxide aerosol in Sprague-Dawley rats and Swiss (CD-1) mice.more » Genetic toxicology studies were done in Salmonella typhimurium and B6C3F1 mice erythrocytes.« less

Copper-zinc electrodeposition in alkaline-sorbitol medium: Electrochemical studies and structural, morphological and chemical composition characterization

NASA Astrophysics Data System (ADS)

de Almeida, M. R. H.; Barbano, E. P.; de Carvalho, M. F.; Tulio, P. C.; Carlos, I. A.

2015-04-01

The galvanostatic technique was used to analyze the electrodeposition of Cu-Zn on to AISI 1010 steel electrode from an alkaline-sorbitol bath with various proportions of the metal ions in the bath: Cu70/Zn30, Cu50/Zn50 and Cu30/Zn70. Coloration of Cu-Zn films were whitish golden, light golden, golden/gray depending on the Cu2+/Zn2+ ratios in the electrodeposition bath, deposition current density (jdep) and charge density (qdep). The highest current efficiency was ∼54.0%, at jdep -1.0 mA cm-2 and qdep 0.40 C cm-2 in the Cu70/Zn30 bath. Energy dispersive spectroscopy indicated that electrodeposits produced from the bath Cu70/Zn30 showed higher Cu content at lower jdep. Also, for same jdep the Cu content increased with qdep. Scanning electron microscopy showed that Cu-Zn electrodeposits of high quality were obtained from the Cu70/Zn30 bath, since the films were fine-grained, except the obtained at jdep -20.0 mA cm-2 and qdep 10.0 C cm-2. Also, these electrodeposits did not present cracks. X-ray analysis of the Cu-Zn electrodeposits obtained at jdep -8.0, -20.0 and -40.0 mA cm-2, in each case, with qdep 2.0 and 10.0 C cm-2, in the Cu70/Zn30 bath, suggested the occurrence of a mixture of the following phases, CuZn, CuZn5 and Cu5Zn8. Galvanostatic electrodeposits of Cu-Zn obtained from sorbitol-alkaline baths exhibited whitish golden color, with good prospects for industrial applications, especially for decorative purposes.

Energy Consumption in Copper Smelting: A New Asian Horse in the Race

NASA Astrophysics Data System (ADS)

Coursol, P.; Mackey, P. J.; Kapusta, J. P. T.; Valencia, N. Cardona

2015-05-01

After a marked improvement in energy consumption in copper smelting during the past few decades, technology development has been slowing down in the Americas and in Europe. Innovation, however, is still required to further reduce energy consumption while complying with stringent environmental regulations. The bottom blowing smelting technology being developed in China shows success and promise. The general configuration of the bath smelting vessel, the design of high-pressure injectors, and the concentrate addition system are described and discussed in this article with respect to those used in other technologies. The bottom blowing technology is shown to be operating at a temperature in the range of 1160-1180°C, which is the lowest reported temperature range for a modern copper smelting process. In this article, it is suggested that top feeding of filter cake concentrate, which is also used in other technologies, has a positive effect in reducing the oxidation potential of the slag ( p(O2)) while increasing the FeS solubility in slag. This reduction in p(O2) lowers the magnetite liquidus of the slag, while the increased solubility of FeS in slag helps toward reaching very low copper levels in flotation slag tailings. The application of high-pressure injectors allows for the use of high levels of oxygen enrichment with no requirements for punching. Using a standard modeling approach from the authors' previous studies, this article discusses these aspects and compares the energy consumption of the bottom blowing technology with that of other leading flash and bath smelting technologies, namely: flash smelting, Noranda/Teniente Converter, TSL (Isasmelt [Glencore Technology Pty. Ltd., Brisbane, Queensland, Australia]/Outotec), and the Mitsubishi Process (Mitsubishi Materials Corporation, Tokyo, Japan).

Water-Based Electroplating Maskant Is Safer

NASA Technical Reports Server (NTRS)

Pickett, Garry M.

1996-01-01

Report proposes use of commercial water-based electroplating maskant Tolber 0-18 as nontoxic alternative to commercial organic-solvent-based electroplating maskant Turco 531-A. Tolber 0-18 found to be equal or superior in key properties, including suitability for application by brushing, effectiveness of sealing, and durability. In addition, exerts no adverse effect on environment or on health of workers, and enables users to comply with local and federal antipollution laws. Use of maskant proves beneficial in most, if not all, electroplating applications involving brush application of maskants to areas not to be electroplated.

40 CFR 471.43 - New source performance standards (NSPS).

Code of Federal Regulations, 2013 CFR

2013-07-01

... to 10.0 at all times. (p) Alkaline cleaning spent baths. Subpart D—NSPS Pollutant or pollutant... precious metals alkaline cleaned Cadmium 0.021 0.009 Copper 0.114 0.060 Cyanide 0.018 0.007 Silver 0.025 0.... (q) Alkaline cleaning rinse. Subpart D—NSPS Pollutant or pollutant property Maximum for any 1 day...

40 CFR 471.53 - New source performance standards (NSPS).

Code of Federal Regulations, 2013 CFR

2013-07-01

....5 to 10.0 at all times. (n) Alkaline cleaning spent baths. Subpart E—NSPS Pollutant or pollutant... refractory metals alkaline cleaned Copper 0.428 0.204 Nickel .184 0.124 Fluoride 19.9 8.82 Molybdenum 1.68 0.... (o) Alkaline cleaning rinse. Subpart E—NSPS Pollutant or pollutant property Maximum for any 1 day...

40 CFR 471.43 - New source performance standards (NSPS).

Code of Federal Regulations, 2014 CFR

2014-07-01

... to 10.0 at all times. (p) Alkaline cleaning spent baths. Subpart D—NSPS Pollutant or pollutant... precious metals alkaline cleaned Cadmium 0.021 0.009 Copper 0.114 0.060 Cyanide 0.018 0.007 Silver 0.025 0.... (q) Alkaline cleaning rinse. Subpart D—NSPS Pollutant or pollutant property Maximum for any 1 day...

40 CFR 471.43 - New source performance standards (NSPS).

Code of Federal Regulations, 2012 CFR

2012-07-01

... to 10.0 at all times. (p) Alkaline cleaning spent baths. Subpart D—NSPS Pollutant or pollutant... precious metals alkaline cleaned Cadmium 0.021 0.009 Copper 0.114 0.060 Cyanide 0.018 0.007 Silver 0.025 0.... (q) Alkaline cleaning rinse. Subpart D—NSPS Pollutant or pollutant property Maximum for any 1 day...

Feasibility of Biological Effective Monitoring of Chrome Electroplaters to Chromium through Analysis of Serum Malondialdehyde.

PubMed

Mozafari, P; Rezazadeh Azari, M; Shokoohi, Y; Sayadi, M

2016-10-01

Great concern about occupational exposure to chromium (Cr [VI]) has been reported due to escalated risk of lung cancer in exposed workers. Consequences of occupational exposure to Cr (VI) have been reported as oxidative stress and lung tissue damage. To investigate the feasibility of biological effect monitoring of chrome electroplaters through analysis of serum malondialdehyde (MDA). 90 workers directly involved in chrome electroplating---categorized into three equal groups based on their job as near bath workers, degreaser, and washers---and 30 workers without exposure to Cr (VI), served as the control group, were studied. Personal samples were collected and analyzed according to NIOSH method 7600. Serum MDA level was measured by HPLC using a UV detector. Median Cr (VI) exposure level was 0.38 mg/m(3) in near bath workers, 0.20 mg/m(3) in degreasers, and 0.05 mg/m(3) in washers. The median serum MDA level of three exposed groups (2.76 μmol/L) was significantly (p<0.001) higher than that in the control group (2.00 μmol/L). There was a positive correlation between electroplaters' level of exposure to Cr (VI) and their serum MDA level (Spearman's ρ 0.806, p<0.001). Serum MDA level is a good biomarker for the level of occupational exposure to Cr (VI) in electroplaters.

[Hexavalent chromium pollution and exposure level in electroplating workplace].

PubMed

Zhang, Xu-hui; Zhang, Xuan; Yang, Zhang-ping; Jiang, Cai-xia; Ren, Xiao-bin; Wang, Qiang; Zhu, Yi-min

2012-08-01

To investigate the pollution of hexavalent chromium in the electroplating workplace and screen the biomarkers of chromium exposure. Field occupational health investigation was conducted in 25 electroplating workplaces. 157 electroplating workers and 93 healthy unexposed controls were recruited. The epidemiological information was collected with face to face interview. Chromium in erythrocytes was determined by graphite furnace atomic absorption spectrophotometer. The median of short-term exposure concentration of chromium in the air at electroplating workplace was 0.06 mg/m(3) (median) and ranging from 0.01 (detect limit) to 0.53 mg/m(3)). The median concentration of Cr (VI) in erythrocytes in electroplating workers was 4.41 (2.50 ∼ 5.29) µg/L, which was significantly higher than that in control subjects [1.54 (0.61 ∼ 2.98) µg/L, P < 0.01]. After stratified by potential confounding factors such as gender, age, smoking status and alcohol consumption, significant differences still existed between electroplating workers and control subjects, except for the subjects of age less than 30 years old (P = 0.11). There was hexavalent chromium pollution in electroplating workplace. Occupational hazards prevention measures should be taken to control the chromium pollution hazards.

Microstructure, thickness and sheet resistivity of Cu/Ni thin film produced by electroplating technique on the variation of electrolyte temperature

NASA Astrophysics Data System (ADS)

Toifur, M.; Yuningsih, Y.; Khusnani, A.

2018-03-01

In this research, it has been made Cu/Ni thin film produced with electroplating technique. The deposition process was done in the plating bath using Cu and Ni as cathode and anode respectively. The electrolyte solution was made from the mixture of HBrO3 (7.5g), NiSO4 (100g), NiCl2 (15g), and aquadest (250 ml). Electrolyte temperature was varied from 40°C up to 80°C, to make the Ni ions in the solution easy to move to Cu cathode. The deposition was done during 2 minutes on the potential of 1.5 volt. Many characterizations were done including the thickness of Ni film, microstructure, and sheet resistivity. The results showed that at all samples Ni had attacked on the Cu substrate to form Cu/Ni. The raising of electrolyte temperature affected the increasing of Ni thickness that is the Ni thickness increase with the increasing electrolyte temperature. From the EDS spectrum, it can be informed that samples already contain Ni and Cu elements and NiO and CuO compounds. Addition element and compound are found for sample Cu/Ni resulted from 70° electrolyte temperature of Ni deposition, that are Pt and PtO2. From XRD pattern, there are several phases which have crystal structure i.e. Cu, Ni, and NiO, while CuO and PtO2 have amorphous structure. The sheet resistivity linearly decreases with the increasing electrolyte temperature.

Superhydrophilicity and antibacterial property of a Cu-dotted oxide coating surface

PubMed Central

2010-01-01

Background Aluminum-made settings are widely used in healthcare, schools, public facilities and transit systems. Frequently-touched surfaces of those settings are likely to harbour bacteria and be a potential source of infection. One method to utilize the effectiveness of copper (Cu) in eliminating pathogens for these surfaces would be to coat the aluminum (Al) items with a Cu coating. However, such a combination of Cu and Al metals is susceptible to galvanic corrosion because of their different electrochemical potentials. Methods In this work, a new approach was proposed in which electrolytic plasma oxidation (EPO) of Al was used to form an oxide surface layer followed by electroplating of Cu metal on the top of the oxide layer. The oxide was designed to function as a corrosion protective and biocompatible layer, and the Cu in the form of dots was utilized as an antibacterial material. The antibacterial property enhanced by superhydrophilicity of the Cu-dotted oxide coating was evaluated. Results A superhydrophilic surface was successfully prepared using electrolytic plasma oxidation of aluminum (Al) followed by electroplating of copper (Cu) in a Cu-dotted form. Both Cu plate and Cu-dotted oxide surfaces had excellent antimicrobial activities against E. coli ATCC 25922, methicillin-resistant Staphylococcus aureus (MRSA) ATCC 43300 and vancomycin-resistant Enterococcus faecium (VRE) ATCC 51299. However, its Cu-dotted surface morphology allowed the Cu-dotted oxide surface to be more antibacterial than the smooth Cu plate surface. The enhanced antibacterial property was attributed to the superhydrophilic behaviour of the Cu-dotted oxide surface that allowed the bacteria to have a more effective killing contact with Cu due to spreading of the bacterial suspension media. Conclusion The superhydrophilic Cu-dotted oxide coating surface provided an effective method of controlling bacterial growth and survival on contact surfaces and thus reduces the risk of infection and spread of bacteria-related diseases particularly in moist or wet environments. PMID:20843373

Deposition Time Dependent Properties of Copper Tin Telluride (Cu₂SnTe₃) Nanoparticles for Solar Absorber Applications.

PubMed

Rakspun, Jariya; Tubtimtae, Auttasit; Vailikhit, Veeramol; Teesetsopon, Pichanan; Choopun, Supab

2018-06-01

We report the growth of copper tin telluride nanoparticles as an absorber layer using a chemical bath deposition (CBD) process for solar selective applications. The XRD results showed the phase of Cu2SnTe3 with a cubical structure. The larger-sized nanoparticles resulted with increased absorption properties and the optical band gap ranging from 1.93, 1.90, 1.58 and 1.56 eV for deposition times of 20-120 min, respectively. Then, the electrical properties of Cu2SnTe3 nanoparticles were also provided a higher current (~6-8 mA) with bias potential of zero.

40 CFR 413.11 - Specialized definitions.

Code of Federal Regulations, 2010 CFR

2010-07-01

... STANDARDS ELECTROPLATING POINT SOURCE CATEGORY Electroplating of Common Metals Subcategory § 413.11... electroplating process in which a metal is electrodeposited on a basis material and which is followed by a rinse...

40 CFR 413.21 - Specialized definitions.

Code of Federal Regulations, 2010 CFR

2010-07-01

... STANDARDS ELECTROPLATING POINT SOURCE CATEGORY Electroplating of Precious Metals Subcategory § 413.21... electroplating process in which a metal is electrodeposited on a basis material and which is followed by a rinse...

40 CFR 63.11504 - Am I subject to this subpart?

Code of Federal Regulations, 2010 CFR

2010-07-01

... the processes listed in paragraphs (a)(1)(i) through (vi) of this section. (i) Electroplating other than chromium electroplating (i.e., non-chromium electroplating). (ii) Electroless or non-eletrolytic...

Stabilization of chromium-bearing electroplating sludge with MSWI fly ash-based Friedel matrices.

PubMed

Qian, Guangren; Yang, Xiaoyan; Dong, Shixiang; Zhou, Jizhi; Sun, Ying; Xu, Yunfeng; Liu, Qiang

2009-06-15

This work investigated the feasibility and effectiveness of MSWI fly ash-based Friedel matrices on stabilizing/solidifying industrial chromium-bearing electroplating sludge using MSWI fly ash as the main raw material with a small addition of active aluminum. The compressive strength, leaching behavior and chemical speciation of heavy metals and hydration phases of matrices were characterized by TCLP, XRD, FTIR and other experimental methods. The results revealed that MSWI fly ash-based Friedel matrices could effectively stabilize chromium-bearing electroplating sludge, the formed ettringite and Friedel phases played a significant role in the fixation of heavy metals in electroplating sludge. The co-disposal of chromium-bearing electroplating sludge and MSWI fly ash-based Friedel matrices with a small addition of active aluminum is promising to be an effective way of stabilizing chromium-bearing electroplating sludge.

An investigation of preload relaxation behaviour of three zinc- aluminum alloys

NASA Astrophysics Data System (ADS)

Mir, A. A.

2016-08-01

Zinc alloy castings are usually assembled together or mounted by screwed steel fasteners, and are tightened to a predetermined torque to develop the required tensile preload in the fastener. Due to relaxation processes in the castings, creep may cause a partial preload loss at an elevated temperature. The equipment used for load relaxation tests consists of a loadmonitoring device, an oil bath, and a data-acquisition system. A load cell monitoring device is used to monitor the load loss in an ISO-metric M6*1 steel screw set into sand castings made from alloys No. 3, No. 5 and No. 2 and tightened to produce an initial preload of 6 kN. The castings were held at constant temperature in the range 80 - 120°C in an oil bath. The oil bath maintains the desired test temperature throughout the experiment. All tests were conducted for periods of up to 160 h. For all alloys, the initial load loss was high, decreasing gradually with time, but not ceasing. The load loss increased rapidly with test temperature, and almost all of the relaxation curves approximated to a logarithmic decay of load with time. Alloy No. 2 had the best resistance to load loss, with No. 5 next and No. 3 worst at all temperatures. The lower resistance to relaxation of alloy No. 3 was mainly due to the lower relaxation strength of copper-free primary dendrites, whereas in alloys No. 5 and No. 2, the higher copper contents contribute greatly to their relaxation strength in the form of second-phase particles.

40 CFR 471.45 - Pretreatment standards for new sources (PSNS).

Code of Federal Regulations, 2012 CFR

2012-07-01

... Cyanide 0.179 0.074 Silver 0.253 0.105 (p) Alkaline cleaning spent baths. Subpart D—PSNS Pollutant or...-pounds) of precious metals alkaline cleaned Cadmium 0.021 0.009 Copper 0.114 0.060 Cyanide 0.018 0.007 Silver 0.025 0.010 (q) Alkaline cleaning rinse. Subpart D—PSNS Pollutant or pollutant property Maximum...

40 CFR 471.54 - Pretreatment standards for existing sources (PSES).

Code of Federal Regulations, 2010 CFR

2010-07-01

... 12.1 Nickel 23.3 15.4 Fluoride 720 320 Molybdenum 80.0 41.4 (n) Alkaline cleaning spent baths... (pounds per million off-pounds) of refractory metals alkaline cleaned Copper 0.635 0.334 Nickel 0.642 0.424 Fluoride 19.9 8.82 Molybdenum 2.21 1.14 (o) Alkaline cleaning rinse. Subpart E—PSES Pollutant or...

40 CFR 471.54 - Pretreatment standards for existing sources (PSES).

Code of Federal Regulations, 2011 CFR

2011-07-01

... 12.1 Nickel 23.3 15.4 Fluoride 720 320 Molybdenum 80.0 41.4 (n) Alkaline cleaning spent baths... (pounds per million off-pounds) of refractory metals alkaline cleaned Copper 0.635 0.334 Nickel 0.642 0.424 Fluoride 19.9 8.82 Molybdenum 2.21 1.14 (o) Alkaline cleaning rinse. Subpart E—PSES Pollutant or...

40 CFR 471.45 - Pretreatment standards for new sources (PSNS).

Code of Federal Regulations, 2014 CFR

2014-07-01

... Cyanide 0.179 0.074 Silver 0.253 0.105 (p) Alkaline cleaning spent baths. Subpart D—PSNS Pollutant or...-pounds) of precious metals alkaline cleaned Cadmium 0.021 0.009 Copper 0.114 0.060 Cyanide 0.018 0.007 Silver 0.025 0.010 (q) Alkaline cleaning rinse. Subpart D—PSNS Pollutant or pollutant property Maximum...

40 CFR 471.54 - Pretreatment standards for existing sources (PSES).

Code of Federal Regulations, 2012 CFR

2012-07-01

... 12.1 Nickel 23.3 15.4 Fluoride 720 320 Molybdenum 80.0 41.4 (n) Alkaline cleaning spent baths... (pounds per million off-pounds) of refractory metals alkaline cleaned Copper 0.635 0.334 Nickel 0.642 0.424 Fluoride 19.9 8.82 Molybdenum 2.21 1.14 (o) Alkaline cleaning rinse. Subpart E—PSES Pollutant or...

40 CFR 471.45 - Pretreatment standards for new sources (PSNS).

Code of Federal Regulations, 2011 CFR

2011-07-01

... Cyanide 0.179 0.074 Silver 0.253 0.105 (p) Alkaline cleaning spent baths. Subpart D—PSNS Pollutant or...-pounds) of precious metals alkaline cleaned Cadmium 0.021 0.009 Copper 0.114 0.060 Cyanide 0.018 0.007 Silver 0.025 0.010 (q) Alkaline cleaning rinse. Subpart D—PSNS Pollutant or pollutant property Maximum...

40 CFR 471.54 - Pretreatment standards for existing sources (PSES).

Code of Federal Regulations, 2013 CFR

2013-07-01

... 12.1 Nickel 23.3 15.4 Fluoride 720 320 Molybdenum 80.0 41.4 (n) Alkaline cleaning spent baths... (pounds per million off-pounds) of refractory metals alkaline cleaned Copper 0.635 0.334 Nickel 0.642 0.424 Fluoride 19.9 8.82 Molybdenum 2.21 1.14 (o) Alkaline cleaning rinse. Subpart E—PSES Pollutant or...

40 CFR 471.45 - Pretreatment standards for new sources (PSNS).

Code of Federal Regulations, 2013 CFR

2013-07-01

... Cyanide 0.179 0.074 Silver 0.253 0.105 (p) Alkaline cleaning spent baths. Subpart D—PSNS Pollutant or...-pounds) of precious metals alkaline cleaned Cadmium 0.021 0.009 Copper 0.114 0.060 Cyanide 0.018 0.007 Silver 0.025 0.010 (q) Alkaline cleaning rinse. Subpart D—PSNS Pollutant or pollutant property Maximum...

40 CFR 471.54 - Pretreatment standards for existing sources (PSES).

Code of Federal Regulations, 2014 CFR

2014-07-01

... 12.1 Nickel 23.3 15.4 Fluoride 720 320 Molybdenum 80.0 41.4 (n) Alkaline cleaning spent baths... (pounds per million off-pounds) of refractory metals alkaline cleaned Copper 0.635 0.334 Nickel 0.642 0.424 Fluoride 19.9 8.82 Molybdenum 2.21 1.14 (o) Alkaline cleaning rinse. Subpart E—PSES Pollutant or...

Ultrastrong Graphene-Copper Core-Shell Wires for High-Performance Electrical Cables.

PubMed

Kim, Sang Jin; Shin, Dong Heon; Choi, Yong Seok; Rho, Hokyun; Park, Min; Moon, Byung Joon; Kim, Youngsoo; Lee, Seuoung-Ki; Lee, Dong Su; Kim, Tae-Wook; Lee, Sang Hyun; Kim, Keun Soo; Hong, Byung Hee; Bae, Sukang

2018-03-27

Recent development in mobile electronic devices and electric vehicles requires electrical wires with reduced weight as well as enhanced stability. In addition, since electric energy is mostly generated from power plants located far from its consuming places, mechanically stronger and higher electric power transmission cables are strongly demanded. However, there has been no alternative materials that can practically replace copper materials. Here, we report a method to prepare ultrastrong graphene fibers (GFs)-Cu core-shell wires with significantly enhanced electrical and mechanical properties. The core GFs are synthesized by chemical vapor deposition, followed by electroplating of Cu shells, where the large surface area of GFs in contact with Cu maximizes the mechanical toughness of the core-shell wires. At the same time, the unique electrical and thermal characteristics of graphene allow a ∼10 times higher current density limit, providing more efficient and reliable delivery of electrical energies through the GFs-Cu wires. We believe that our results would be useful to overcome the current limit in electrical wires and cables for lightweight, energy-saving, and high-power applications.

Biosorption of heavy metal copper (Cu2+) by Saccharomyces cerevisiae

NASA Astrophysics Data System (ADS)

Ririhena, S. A. J.; Astuti, A. D.; Fachrul, M. F.; Silalahi, M. D. S.; Hadisoebroto, R.; Rinanti, A.

2018-01-01

This research aims to study the optimum effect of contact time and pH adsorption of copper (Cu2+) from electroplating industry waste by dried beer waste S.cerevisiae. This research conducted using batch culture with pH variation 2,3,4,5, and 6, contact time variation 60, 90, 120, 150, 180 minutes, 150 rpm at room temperature (± 28°C), initial Cu2+ concentration 33,746 mg/l, and biosorbent mass 200 mg & 500 mg. The adsorption of heavy metal ions Cu2+ occurs in all variations of pH and contact time at optimum pH. The optimum adsorption occurs at pH 4 with contact time 120 minutes for both 200 mg (41.60%) and 500 mg (61.04%) beer waste biosorbent. Cell morphology seen with Scanning Electron Microscope (SEM) analysis shows the change of cell wall that gets damaged from Cu2+ adsorption. It also proved by the decreased concentration of initial high concentration carboxyl groups. The adsorption process of this research complies to Freundlich Isotherm with R2 value closest to 1 and followed first order kinetic.

Fabrication of flower-like micro/nano dual scale structured copper oxide surfaces: Optimization of self-cleaning properties via Taguchi design

NASA Astrophysics Data System (ADS)

Moosavi, Saeideh Sadat; Norouzbeigi, Reza; Velayi, Elmira

2017-11-01

In the present work, copper oxide superhydrophobic surface is fabricated on a copper foil via the chemical bath deposition (CBD) method. The effects of some influential factors such as initial concentrations of Cu (II) ions and the surface energy modifier, solution pH, reaction and modification steps time on the wettability property of copper oxide surface were evaluated using Taguchi L16 experimental design. Results showed that the initial concentration of Cu (II) has the most significant impact on the water contact angle and wettability characteristics. The XRD, SEM, AFM and FTIR analyses were used to characterize the copper oxide surfaces. The Water contact angle (WCA) and contact angle hysteresis (CAH) were also measured. The SEM results indicated the formation of a flower-like micro/nano dual-scale structure of copper oxide on the substrate. This structure composed of numerous nano-petals with a thickness of about 50 nm. As a result, a copper oxide hierarchical surface with WCA of 168.4°± 3.5° and CAH of 2.73° exhibited the best superhydrophobicity under proposed optimum condition. This result has been obtained just by 10 min hydrolysis reaction. Besides, this surface showed a good stability under acidic and saline conditions.

Microstructural characterization of ultra thin copper interconnects

NASA Astrophysics Data System (ADS)

Yang, Hee-Dong

The present study investigates the defects related to reliability issues, such as physical failures developed during processing and end use. In the first part of this study, kinetic analysis using the Johnson-Mehl-Avrami (JMA) model demonstrates that a self-annealing mechanism in electroplated Cu films depends on the film properties, such as thickness and the amount of crystal defects in an as-deposited state. In order to obtain the evidence of such defects, the microstructural characterization of defects in ultra thin copper interconnects using transmission electron microscopy (TEM) is presented. Examination of the defects using TEM reveals that voids filled with gas form as a lens shape along the {110} habit planes of the copper matrix. In the second part of this study, methodology and results of an electro-thermal-fatigue (ETF) testing, designed for early detection of process defects, are presented. Such ETF testing combines high-density current electrical stressing and thermal cycling to accelerate the evolution of defects in Cu interconnects. In ETF testing, the evolution of defects provides the nucleation sites for voids which open or close during thermal cycling. Then, the accumulation of voids creates the change in resistance when they reach a critical size. As a result of voids evolution, the high current density and high joule heating create a transient resistance increase. ETF testing reveals two failure modes, and the mode-I failure has the importance in detecting defects. The number of cycles to failure in ETF testing decreases with higher current density, but the rate of thermal cycling has no effect. Results from this investigation suggest that impurities in the copper electrodeposition process must be carefully controlled to achieve reliable ultra thin copper interconnects.

Characterization and environmental risk assessment of heavy metals in construction and demolition wastes from five sources (chemical, metallurgical and light industries, and residential and recycled aggregates).

PubMed

Gao, Xiaofeng; Gu, Yilu; Xie, Tian; Zhen, Guangyin; Huang, Sheng; Zhao, Youcai

2015-06-01

Total concentrations of heavy metals (Cu, Zn, Pb, Cr, Cd, and Ni) were measured among 63 samples of construction and demolition (C&D) wastes collected from chemical, metallurgical and light industries, and residential and recycled aggregates within China for risk assessment. The heavy metal contamination was primarily concentrated in the chemical and metallurgical industries, especially in the electroplating factory and zinc smelting plant. High concentrations of Cd were found in light industry samples, while the residential and recycled aggregate samples were severely polluted by Zn. Six most polluted samples were selected for deep research. Mineralogical analysis by X-ray fluorescence (XRF) spectrometry and X-ray diffraction (XRD), combined with element speciation through European Community Bureau of Reference (BCR) sequential extraction, revealed that a relatively slight corrosion happened in the four samples from electroplating plants but high transfer ability for large quantities of Zn and Cu. Lead arsenate existed in the acid extractable fraction in CI7-8 and potassium chromium oxide existed in the mobility fraction. High concentration of Cr could be in amorphous forms existing in CI9. The high content of sodium in the two samples from zinc smelter plants suggested severe deposition and erosion on the workshop floor. Large quantities of Cu existed as copper halide and most of the Zn appeared to be zinc, zinc oxide, barium zinc oxide, and zincite. From the results of the risk assessment code (RAC), the samples from the electroplating factory posed a very high risk of Zn, Cu, and Cr, a high risk of Ni, a middle risk of Pb, and a low risk of Cd. The samples from the zinc smelting plant presented a high risk of Zn, a middle risk of Cu, and a low risk of Pb, Cr, Cd, and Ni.

Dietary copper supplements modulate aortic superoxide dismutase, nitric oxide and atherosclerosis.

PubMed

Lamb, David J; Tickner, Michelle L; Hourani, Susanna M O; Ferns, Gordon A A

2005-08-01

The objective was to test the hypothesis that dietary copper inhibits atherosclerosis by inducing superoxide dismutase (SOD) and potentiating nitric oxide (NO). New Zealand White rabbits were fed either a cholesterol diet (n = 8) or a cholesterol diet containing 0.02% copper acetate (n = 8) for 13 weeks. We found that the intimal area was significantly smaller in the animals supplemented with copper (P < 0.005), although integrated plasma cholesterol levels were not significantly different. This was associated with a significant increase in aortic copper content (P < 0.05), SOD activity (P < 0.05) and Cu/Zn SOD mRNA (P < 0.05) and a significant decrease in nitrotyrosine content (P < 0.05). Furthermore, there was a positive correlation between aortic copper content and SOD activity (P < 0.005, R(2) = 0.83) and a negative correlation between aortic superoxide dimutase activity and nitrotyrosine content (P < 0.005, R(2) = 0.93). In organ bath experiments, the relaxation of precontracted carotid artery rings to calcium ionophore was greater in animals supplemented with copper. No difference in response to sodium nitroprusside was observed. These data suggest that in the cholesterol-fed rabbit, copper supplements inhibit the progression of atherosclerosis by increasing SOD expression, thereby reducing the interaction of NO with superoxide, and hence potentiating NO-mediated pathways that may protect against atherosclerosis.

Dietary copper supplements modulate aortic superoxide dismutase, nitric oxide and atherosclerosis

PubMed Central

Lamb, David J; Tickner, Michelle L; Hourani, Susanna M O; Ferns, Gordon A A

2005-01-01

The objective was to test the hypothesis that dietary copper inhibits atherosclerosis by inducing superoxide dismutase (SOD) and potentiating nitric oxide (NO). New Zealand White rabbits were fed either a cholesterol diet (n = 8) or a cholesterol diet containing 0.02% copper acetate (n = 8) for 13 weeks. We found that the intimal area was significantly smaller in the animals supplemented with copper (P < 0.005), although integrated plasma cholesterol levels were not significantly different. This was associated with a significant increase in aortic copper content (P < 0.05), SOD activity (P < 0.05) and Cu/Zn SOD mRNA (P < 0.05) and a significant decrease in nitrotyrosine content (P < 0.05). Furthermore, there was a positive correlation between aortic copper content and SOD activity (P < 0.005, R2 = 0.83) and a negative correlation between aortic superoxide dimutase activity and nitrotyrosine content (P < 0.005, R2 = 0.93). In organ bath experiments, the relaxation of precontracted carotid artery rings to calcium ionophore was greater in animals supplemented with copper. No difference in response to sodium nitroprusside was observed. These data suggest that in the cholesterol-fed rabbit, copper supplements inhibit the progression of atherosclerosis by increasing SOD expression, thereby reducing the interaction of NO with superoxide, and hence potentiating NO-mediated pathways that may protect against atherosclerosis. PMID:16045547

Electroplating eliminates gas leakage in brazed areas

NASA Technical Reports Server (NTRS)

Leigh, J. D.

1966-01-01

Electroplating method seals brazed or welded joints against gas leakage under high pressure. Any conventional electroplating process with many different metal anodes can be used, as well as the build up of layers of different metals to any required thickness.

Al2O3 and TiO2 atomic layer deposition on copper for water corrosion resistance.

PubMed

Abdulagatov, A I; Yan, Y; Cooper, J R; Zhang, Y; Gibbs, Z M; Cavanagh, A S; Yang, R G; Lee, Y C; George, S M

2011-12-01

Al(2)O(3) and TiO(2) atomic layer deposition (ALD) were employed to develop an ultrathin barrier film on copper to prevent water corrosion. The strategy was to utilize Al(2)O(3) ALD as a pinhole-free barrier and to protect the Al(2)O(3) ALD using TiO(2) ALD. An initial set of experiments was performed at 177 °C to establish that Al(2)O(3) ALD could nucleate on copper and produce a high-quality Al(2)O(3) film. In situ quartz crystal microbalance (QCM) measurements verified that Al(2)O(3) ALD nucleated and grew efficiently on copper-plated quartz crystals at 177 °C using trimethylaluminum (TMA) and water as the reactants. An electroplating technique also established that the Al(2)O(3) ALD films had a low defect density. A second set of experiments was performed for ALD at 120 °C to study the ability of ALD films to prevent copper corrosion. These experiments revealed that an Al(2)O(3) ALD film alone was insufficient to prevent copper corrosion because of the dissolution of the Al(2)O(3) film in water. Subsequently, TiO(2) ALD was explored on copper at 120 °C using TiCl(4) and water as the reactants. The resulting TiO(2) films also did not prevent the water corrosion of copper. Fortunately, Al(2)O(3) films with a TiO(2) capping layer were much more resilient to dissolution in water and prevented the water corrosion of copper. Optical microscopy images revealed that TiO(2) capping layers as thin as 200 Å on Al(2)O(3) adhesion layers could prevent copper corrosion in water at 90 °C for ~80 days. In contrast, the copper corroded almost immediately in water at 90 °C for Al(2)O(3) and ZnO films by themselves on copper. Ellipsometer measurements revealed that Al(2)O(3) films with a thickness of ~200 Å and ZnO films with a thickness of ~250 Å dissolved in water at 90 °C in ~10 days. In contrast, the ellipsometer measurements confirmed that the TiO(2) capping layers with thicknesses of ~200 Å on the Al(2)O(3) adhesion layers protected the copper for ~80 days in water at 90 °C. The TiO(2) ALD coatings were also hydrophilic and facilitated H(2)O wetting to copper wire mesh substrates. © 2011 American Chemical Society

Modeling of life limiting phenomena in the discharge chamber of an electron bombardment ion thruster

NASA Technical Reports Server (NTRS)

Handoo, Arvind K.; Ray, Pradosh K.

1991-01-01

An experimental facility to study the low energy sputtering of metal surfaces with ions produced by an ion gun is described. The energy of the ions ranged from 10 to 500 eV. Cesium ions with energies from 100 to 500 eV were used initially to characterize the operation of the ion gun. Next, argon and xenon ions were used to measure the sputtering yields of cobalt (Co), Cadmium (Cd), and Chromium (Cr) at an operating temperature of 2x10(exp -5) Torr. The ion current ranged from 0.0135 micro-A at 500 eV. The targets were electroplated on a copper substrate. The surface density of the electroplated material was approx. 50 micro-g/sq cm. The sputtered atoms were collected on an aluminum foil surrounding the target. Radioactive tracers were used to measure the sputtering yields. The sputtering yields of Cr were found to be much higher than those of Co and Cd. The yields of Co and Cd were comparable, with Co providing the higher yields. Co and Cd targets were observed to sputter at energies as low as 10 eV for both argon and xenon ions. The Cr yields could not be measured below 20 eV for argon ions and 15 eV for xenon ions. On a linear scale the yield energy curves near the threshold energies exhibit a concave nature.

40 CFR 471.42 - Effluent limitations representing the degree of effluent reduction attainable by the application...

Code of Federal Regulations, 2012 CFR

2012-07-01

... Cyanide 0.179 0.074 Silver 0.253 0.105 (p) Alkaline cleaning spent baths. Subpart D—BAT Pollutant or...-pounds) of precious metals alkaline cleaned Cadmium 0.021 0.009 Copper 0.114 0.060 Cyanide 0.018 0.007 Silver 0.025 0.010 (q) Alkaline cleaning rinse. Subpart D—BAT Pollutant or pollutant property Maximum for...

40 CFR 471.41 - Effluent limitations representing the degree of effluent reduction attainable by the application...

Code of Federal Regulations, 2012 CFR

2012-07-01

... at all times. (p) Alkaline cleaning spent baths. Subpart D—BPT Pollutant or pollutant property... metals alkaline cleaned Cadmium 0.021 0.009 Copper 0.114 0.060 Cyanide 0.018 0.007 Silver 0.025 0.010 Oil...) Alkaline cleaning rinse. Subpart D—BPT Pollutant or pollutant property Maximum for any 1 day Maximum for...

40 CFR 471.52 - Effluent limitations representing the degree of effluent reduction attainable by the application...

Code of Federal Regulations, 2012 CFR

2012-07-01

... 320 Molybdenum 60.9 27.0 (n) Alkaline cleaning spent baths. Subpart E—BAT Pollutant or pollutant... refractory metals alkaline cleaned Copper 0.428 0.204 Nickel 0.184 0.124 Fluoride 19.9 8.82 Molybdenum 1.68 0.745 (o) Alkaline cleaning rinse. Subpart E—BAT Pollutant or pollutant property Maximum for any 1 day...

40 CFR 471.41 - Effluent limitations representing the degree of effluent reduction attainable by the application...

Code of Federal Regulations, 2013 CFR

2013-07-01

... at all times. (p) Alkaline cleaning spent baths. Subpart D—BPT Pollutant or pollutant property... metals alkaline cleaned Cadmium 0.021 0.009 Copper 0.114 0.060 Cyanide 0.018 0.007 Silver 0.025 0.010 Oil...) Alkaline cleaning rinse. Subpart D—BPT Pollutant or pollutant property Maximum for any 1 day Maximum for...

40 CFR 471.42 - Effluent limitations representing the degree of effluent reduction attainable by the application...

Code of Federal Regulations, 2011 CFR

2011-07-01

... Cyanide 0.179 0.074 Silver 0.253 0.105 (p) Alkaline cleaning spent baths. Subpart D—BAT Pollutant or...-pounds) of precious metals alkaline cleaned Cadmium 0.021 0.009 Copper 0.114 0.060 Cyanide 0.018 0.007 Silver 0.025 0.010 (q) Alkaline cleaning rinse. Subpart D—BAT Pollutant or pollutant property Maximum for...

40 CFR 471.82 - Effluent limitations representing the degree of effluent reduction attainable by the application...

Code of Federal Regulations, 2011 CFR

2011-07-01

....151 (j) Alkaline cleaning spent baths. Subpart H—BAT Pollutant or pollutant property Maximum for any 1 day Maximum for monthly average mg/off-kg (pounds per million off-pounds) of zinc alkaline cleaned Chromium 0.002 0.0006 Copper 0.005 0.002 Cyanide 0.0007 0.0003 Zinc 0.004 0.002 (k) Alkaline cleaning rinse...

40 CFR 471.82 - Effluent limitations representing the degree of effluent reduction attainable by the application...

Code of Federal Regulations, 2014 CFR

2014-07-01

....072 0.029 Zinc 0.365 0.151 (j) Alkaline cleaning spent baths. Subpart H—BAT Pollutant or pollutant... zinc alkaline cleaned Chromium 0.002 0.0006 Copper 0.005 0.002 Cyanide 0.0007 0.0003 Zinc 0.004 0.002 (k) Alkaline cleaning rinse. Subpart H—BAT Pollutant or pollutant property Maximum for any 1 day...

40 CFR 471.42 - Effluent limitations representing the degree of effluent reduction attainable by the application...

Code of Federal Regulations, 2014 CFR

2014-07-01

... Cyanide 0.179 0.074 Silver 0.253 0.105 (p) Alkaline cleaning spent baths. Subpart D—BAT Pollutant or...-pounds) of precious metals alkaline cleaned Cadmium 0.021 0.009 Copper 0.114 0.060 Cyanide 0.018 0.007 Silver 0.025 0.010 (q) Alkaline cleaning rinse. Subpart D—BAT Pollutant or pollutant property Maximum for...

40 CFR 471.41 - Effluent limitations representing the degree of effluent reduction attainable by the application...

Code of Federal Regulations, 2014 CFR

2014-07-01

... at all times. (p) Alkaline cleaning spent baths. Subpart D—BPT Pollutant or pollutant property... metals alkaline cleaned Cadmium 0.021 0.009 Copper 0.114 0.060 Cyanide 0.018 0.007 Silver 0.025 0.010 Oil...) Alkaline cleaning rinse. Subpart D—BPT Pollutant or pollutant property Maximum for any 1 day Maximum for...

40 CFR 471.52 - Effluent limitations representating the degree of effluent reduction attainable by the...

Code of Federal Regulations, 2010 CFR

2010-07-01

... 320 Molybdenum 60.9 27.0 (n) Alkaline cleaning spent baths. Subpart E—BAT Pollutant or pollutant... refractory metals alkaline cleaned Copper 0.428 0.204 Nickel 0.184 0.124 Fluoride 19.9 8.82 Molybdenum 1.68 0.745 (o) Alkaline cleaning rinse. Subpart E—BAT Pollutant or pollutant property Maximum for any 1 day...

40 CFR 471.52 - Effluent limitations representing the degree of effluent reduction attainable by the application...

Code of Federal Regulations, 2014 CFR

2014-07-01

... 320 Molybdenum 60.9 27.0 (n) Alkaline cleaning spent baths. Subpart E—BAT Pollutant or pollutant... refractory metals alkaline cleaned Copper 0.428 0.204 Nickel 0.184 0.124 Fluoride 19.9 8.82 Molybdenum 1.68 0.745 (o) Alkaline cleaning rinse. Subpart E—BAT Pollutant or pollutant property Maximum for any 1 day...

40 CFR 471.52 - Effluent limitations representating the degree of effluent reduction attainable by the...

Code of Federal Regulations, 2011 CFR

2011-07-01

... 320 Molybdenum 60.9 27.0 (n) Alkaline cleaning spent baths. Subpart E—BAT Pollutant or pollutant... refractory metals alkaline cleaned Copper 0.428 0.204 Nickel 0.184 0.124 Fluoride 19.9 8.82 Molybdenum 1.68 0.745 (o) Alkaline cleaning rinse. Subpart E—BAT Pollutant or pollutant property Maximum for any 1 day...

40 CFR 471.51 - Effluent limitations representing the degree of effluent reduction attainable by the application...

Code of Federal Regulations, 2013 CFR

2013-07-01

... range of 7.5 to 10.0 at all times. (n) Alkaline cleaning spent baths. Subpart E—BPT Pollutant or...-pounds) of refractory metals alkaline cleaned Copper 0.635 0.334 Nickel 0.641 0.424 Fluoride 19.9 8.82... all times. (o) Alkaline cleaning rinse. Subpart E—BPT Pollutant or pollutant property Maximum for any...

40 CFR 471.82 - Effluent limitations representing the degree of effluent reduction attainable by the application...

Code of Federal Regulations, 2010 CFR

2010-07-01

....151 (j) Alkaline cleaning spent baths. Subpart H—BAT Pollutant or pollutant property Maximum for any 1 day Maximum for monthly average mg/off-kg (pounds per million off-pounds) of zinc alkaline cleaned Chromium 0.002 0.0006 Copper 0.005 0.002 Cyanide 0.0007 0.0003 Zinc 0.004 0.002 (k) Alkaline cleaning rinse...

40 CFR 471.82 - Effluent limitations representing the degree of effluent reduction attainable by the application...

Code of Federal Regulations, 2012 CFR

2012-07-01

....072 0.029 Zinc 0.365 0.151 (j) Alkaline cleaning spent baths. Subpart H—BAT Pollutant or pollutant... zinc alkaline cleaned Chromium 0.002 0.0006 Copper 0.005 0.002 Cyanide 0.0007 0.0003 Zinc 0.004 0.002 (k) Alkaline cleaning rinse. Subpart H—BAT Pollutant or pollutant property Maximum for any 1 day...

40 CFR 471.41 - Effluent limitations representing the degree of effluent reduction attainable by the application...

Code of Federal Regulations, 2010 CFR

2010-07-01

... at all times. (p) Alkaline cleaning spent baths. Subpart D—BPT Pollutant or pollutant property... metals alkaline cleaned Cadmium 0.021 0.009 Copper 0.114 0.060 Cyanide 0.018 0.007 Silver 0.025 0.010 Oil...) Alkaline cleaning rinse. Subpart D—BPT Pollutant or pollutant property Maximum for any 1 day Maximum for...

Black chrome on commercially electroplated tin as a solar selecting coating

NASA Technical Reports Server (NTRS)

Mcdonald, G. E.

1977-01-01

The reflectance properties of black chrome electroplated on commercially electroplated tin were measured for various black chrome plating times for both the solar and infrared spectrum. The values of absorptance and emittance were calculated from the measured reflectance values. The results indicate that the optimum combination of the highest absorptance in the solar region and the lowest emittance in the infrared of the black chrome plated on commercially electroplated tin is obtained for a black chrome plating time of between one and two minutes.

Electroplating wastes in marine environments: A case history at Quonset Point, Rhode Island

USGS Publications Warehouse

Eisler, Ronald; Hoffman, David J.; Rattner, Barnett A.; Burton, G. Allen; Cairns, John

1995-01-01

All U.S. Navy electroplating and metal-finishing wastes are now required to pass through industrial-wastewater treatment plants and other treatment facilities for the removal of heavy metals and other potentially hazardous materials. In 1984 a total of 235,191 metric tons (t) of electroplating and metal-finishing wastes from 70 U.S. Navy installations - primarily shipyards, aviation depots, air stations, and weapons plants - were treated.1 Electroplating wastes were not always fully treated.

Synthesis of copper coated carbon nanotubes for aluminium matrix composites

NASA Astrophysics Data System (ADS)

Maqbool, Adnan; Khalid, F. Ahmad; Hussain, M. Asif; Bakhsh, Nabi

2014-06-01

In this investigation copper coated carbon nanotubes (CNTs) were prepared to enhance the interfacial bonding between CNTs and aluminum matrix by the molecular-level mixing process. In optimized plating bath of (1:1) by wt. CNT with Cu, thickness of coated CNTs is reduced to 100 nm to promote uniform distribution of Cu nanoparticle on the surface of pretreated CNTs. The mixing of CNTs was accomplished by ultrasonication and ball milling. Scanning electron microscope analysis revealed the homogenous dispersion of Cu-coated CNTs in nanocomposites samples compared to the uncoated CNTs. The samples were pressureless sintered under vacuum. The densification increased with the increase in the CNTs content and is more pronounced in Cu-coated CNT nanocomposites.

Reliability design and assessment of a micro-probe using the results of a tensile test of a beryllium-copper alloy thin film

NASA Astrophysics Data System (ADS)

Park, Jun-Hyub; Shin, Myung-Soo

2011-09-01

This paper describes the results of tensile tests for a beryllium-copper (BeCu) alloy thin film and the application of the results to the design of a probe. The copper alloy films were fabricated by electroplating. To obtain the tensile characteristics of the film, the dog-bone type specimen was fabricated by the etching method. The tensile tests were performed with the specimen using a test machine developed by the authors. The BeCu alloy has an elastic modulus of 119 GPa and the 0.2% offset yield and ultimate tensile strengths of 1078 MPa and 1108 MPa, respectively. The design and manufacture of a smaller probe require higher pad density and smaller pad-pitch chips. It should be effective in high-frequency testing. For the design of a new micro-probe, we investigated several design parameters that may cause problems, such as the contact force and life, using the tensile properties and the design of experiment method in conjunction with finite element analysis. The optimal dimensions of the probe were found using the response surface method. The probe with optimal dimensions was manufactured by a precision press process. It was verified that the manufactured probe satisfied the life, the contact force and the over drive through the compression tests and the life tests of the probes.

40 CFR 413.04 - Standards for integrated facilities.

Code of Federal Regulations, 2010 CFR

2010-07-01

... GUIDELINES AND STANDARDS ELECTROPLATING POINT SOURCE CATEGORY General Provisions § 413.04 Standards for... § 403.6(e) of EPA's General Pretreatment Regulations. In cases where electroplating process wastewaters... average standard for the electroplating wastewaters must be used. The 30 day average shall be determined...

Drilling of optical glass with electroplated diamond tools

NASA Astrophysics Data System (ADS)

Wang, A. J.; Luan, C. G.; Yu, A. B.

2010-10-01

K9 optical glass drilling experiments were carried out. Bright nickel electroplated diamond tools with small slots and under heat treatment in different temperature were fabricated. Scan electro microscope was applied to analyze the wear of electroplated diamond tool. The material removal rate and grinding ratio were calculated. Machining quality was observed. Bond coating hardness was measured. The experimental results show that coolant is needed for the drilling processes of optical glasses. Heat treatment temperature of diamond tool has influence on wearability of diamond tool and grinding ratio. There were two wear types of electroplated diamond tool, diamond grit wear and bond wear. With the machining processes, wear of diamond grits included fracture, blunt and pull-out, and electroplated bond was gradually worn out. High material removal rates could be obtained by using diamond tool with suitable slot numbers. Bright nickel coating bond presents smallest grains and has better mechanical properties. Bright nickel electroplated diamond tool with slot structure and heat treatment under 200°C was suitable for optical glass drilling.

Study on electroplating technology of diamond tools for machining hard and brittle materials

NASA Astrophysics Data System (ADS)

Cui, Ying; Chen, Jian Hua; Sun, Li Peng; Wang, Yue

2016-10-01

With the development of the high speed cutting, the ultra-precision machining and ultrasonic vibration technique in processing hard and brittle material , the requirement of cutting tools is becoming higher and higher. As electroplated diamond tools have distinct advantages, such as high adaptability, high durability, long service life and good dimensional stability, the cutting tools are effective and extensive used in grinding hard and brittle materials. In this paper, the coating structure of electroplating diamond tool is described. The electroplating process flow is presented, and the influence of pretreatment on the machining quality is analyzed. Through the experimental research and summary, the reasonable formula of the electrolyte, the electroplating technologic parameters and the suitable sanding method were determined. Meanwhile, the drilling experiment on glass-ceramic shows that the electroplating process can effectively improve the cutting performance of diamond tools. It has laid a good foundation for further improving the quality and efficiency of the machining of hard and brittle materials.

Lung cancer mortality in nickel/chromium platers, 1946-95.

PubMed

Sorahan, T; Burges, D C; Hamilton, L; Harrington, J M

1998-04-01

To investigate mortality from lung cancer in nickel/chromium platers. The mortality experience of a cohort of 1762 chrome workers (812 men, 950 women) from a large electroplating and light engineering plant in the Midlands, United Kingdom, was investigated for the period 1946-95. All subjects were first employed in chrome work at the plant during the period 1946-75, and had at least six months employment in jobs associated with exposure to chromic acid mist (hexavalent chromium). Detailed job histories were abstracted from original company personnel records and individual cumulative durations of employment in three types of chrome work were derived as time dependent variables (chrome bath work, other chrome work, any chrome work). Two analytical approaches were used--indirect standardisation and Poisson regression. Based on mortalities for the general population of England and Wales, male workers with some period of chrome bath work had higher lung cancer mortalities (observed deaths 40, expected deaths 25.41, standardised mortality ratio (SMR) 157, 95% confidence interval (95% CI) 113 to 214, p < 0.01) than did other male chrome workers (observed 9, expected 13.70, SMR 66, 95% CI 30 to 125). Similar findings were shown for female workers (chrome bath workers: observed 15, expected 8.57, SMR 175, 95% CI 98 to 289, p = 0.06; other chrome workers: observed 1, expected 4.37, SMR 23, 95% CI 1 to 127). Poisson regression was used to investigate risks of lung cancer relative to four categories of cumulative duration of chrome bath work and four categories of cumulative duration of other chrome work (none, < 1 y, 1-4 y, > or = 5 y). After adjusting for sex, age, calendar period, year of starting chrome work, period from first chrome work, and employment status (still employed v left employment), there was a significant positive trend (p < 0.05) between duration of chrome bath work and risks of mortality for lung cancer. Relative to a risk of unity for those chrome workers without any period of chrome bath work, risks were 2.83 (95% CI 1.47 to 5.45), 1.61 (95% CI 0.75 to 3.44), and 4.25 (95% CI 1.83 to 9.87) for the second, third, and fourth exposure categories, respectively. Duration of other chrome work was not a useful predictor of risks of lung cancer. Similar findings for both variables were obtained when adjustment was made for sex and age only. Similar findings for both variables were obtained relative to risk of chrome nasal ulceration. The findings are consistent with the hypothesis that soluble hexavalent chromium compounds are potent human lung carcinogens.

Electrochemical and physical properties of electroplated CuO thin films.

PubMed

Dhanasekaran, V; Mahalingam, T

2013-01-01

Cupric oxide thin films have been prepared on ITO glass substrates from an aqueous electrolytic bath containing CuSO4 and tartaric acid. Growth mechanism has been analyzed using cyclic voltammetry. The role of pH on the structural, morphological, compositional, electrical and optical properties of CuO films is investigated. The structural studies revealed that the deposited films are polycrystalline in nature with a cubic structure. The preferential orientation of CuO thin films is found to be along (111) plane. X-ray line profile analysis has been carried out to determine the microstructural parameters of CuO thin films. The pyramid shaped grains are observed from SEM and AFM images. The optical band gap energy and electrical activation energy is found to be 1.45 and 0.37 eV, respectively. Also, the optical constants of CuO thin films such as refractive index (n), complex dielectric constant (epsilon) extinction coefficient (k) and optical conductivity (sigma) are evaluated.

Feasibility demonstration for electroplating ultra-thin polyimide film. [fabricating film for space erectable structures

NASA Technical Reports Server (NTRS)

Schneier, R.; Braswell, T. V.; Vaughn, R. W.

1978-01-01

The effect of electrodeposition variables on film thickness was investigated using a dilute polyimide solution as a bath into which aluminum (as foil or as a vapor deposited coating) was immersed. The electrodeposited film was dried for 2 hours at 93 C (primarily to remove solvent) and cured for 18 hours at 186 C. Infrared studies indicate that imide formation (curing) occurs at 149 C under vacuum. From a conceptual viewpoint, satisfactory film metallized on one side can be obtained by this method. The cured ultra thin polyimide film exhibits properties equivalent to those of commercial film, and the surface appearance of the strippable polyimide film compares favorably with that of a sample of commercial film of thicker gauge. The feasibility of manufacturing approximately one million sq m of ultra thin film capable of being joined to fabricate an 800 m by 9 800 m square from starting material 0.5 to 1 m wide for space erectable structures was demonstrated.

Metallization of Kevlar fibers with gold.

PubMed

Little, Brian K; Li, Yunfeng; Cammarata, V; Broughton, R; Mills, G

2011-06-01

Electrochemical gold plating processes were examined for the metallization of Kevlar yarn. Conventional Sn(2+)/Pd(2+) surface activation coupled with electroless Ni deposition rendered the fibers conductive enough to serve as cathodes for electrochemical plating. The resulting coatings were quantified gravimetrically and characterized via adhesion tests together with XRD, SEM, TEM; the coatings effect on fiber strength was also probed. XRD data showed that metallic Pd formed during surface activation whereas amorphous phases and trace amounts of pure Ni metal were plated via the electroless process. Electrodeposition in a thiosulfate bath was the most efficient Au coating process as compared with the analogous electroless procedure, and with electroplating using a commercial cyanide method. Strongly adhering coatings resulted upon metallization with three consecutive electrodepositions, which produced conductive fibers able to sustain power outputs in the range of 1 W. On the other hand, metallization affected the tensile strength of the fiber and defects present in the metal deposits make questionable the effectiveness of the coatings as protective barriers. © 2011 American Chemical Society

Chemical Bath Deposited Zinc Sulfide Buffer Layers for Copper Indium Gallium Sulfur-selenide Solar Cells and Device Analysis

DOE Office of Scientific and Technical Information (OSTI.GOV)

Kundu, Sambhu N.; Olsen, Larry C.

2005-01-03

Cd free CIGSS thin film solar cell structures with a MgF2/TCO/CGD-ZnS/CIGSS/Mo/SLG structure have been fabricated using chemical bath deposited (CBD)-ZnS buffer layers and high quality CIGSS absorber layers supplied from Shell Solar Industries. The use of CBD-ZnS, which is a higher band gap materials than CdS, improved the quantum efficiency of fabricated cells at lower wavelengths, leading to an increase in short circuit current. The best cell to date yielded an active area (0.43 cm2) efficiency of 13.3%. This paper also presents a discussion of the issues relating to the use of the CBD-ZnS buffer materials for improving device performance.

40 CFR 63.11509 - What are my notification, reporting, and recordkeeping requirements?

Code of Federal Regulations, 2010 CFR

2010-07-01

... with the deviation report. (1) If you own or operate an affected electroplating, electroforming, or... control system according to the manufacturer's specifications and instructions. (i) Electroplating...-term electroplating tank that is subject to the requirements in § 63.11507(b), “What are my standards...

40 CFR 63.11508 - What are my compliance requirements?

Code of Federal Regulations, 2010 CFR

2010-07-01

... electroplating, electroforming, or electropolishing tank that contains one or more of the plating and polishing... electroplating, electroforming, or electropolishing tank that contains one or more of the plating and polishing...) If you own or operate an affected flash or short-term electroplating tank that contains one or more...

Creating low-impedance tetrodes by electroplating with additives

PubMed Central

Ferguson, John E.; Boldt, Chris; Redish, A. David

2011-01-01

A tetrode is a bundle of four microwires that can record from multiple neurons simultaneously in the brain of a freely moving animal. Tetrodes are usually electroplated to reduce impedances from 2-3 MΩ to 200-500 kΩ (measured at 1 kHz), which increases the signal-to-noise ratio and allows for the recording of small amplitude signals. Tetrodes with even lower impedances could improve neural recordings but cannot be made using standard electroplating methods without shorting. We were able to electroplate tetrodes to 30-70 kΩ by adding polyethylene glycol (PEG) or multi-walled carbon nanotube (MWCNT) solutions to a commercial gold-plating solution. The MWCNTs and PEG acted as inhibitors in the electroplating process and created large-surface-area, low-impedance coatings on the tetrode tips. PMID:21379404

40 CFR 471.81 - Effluent limitations representing the degree of effluent reduction attainable by the application...

Code of Federal Regulations, 2014 CFR

2014-07-01

... range of 7.5 to 10.0 at all times. (j) Alkaline cleaning spent baths. Subpart H—BPT Pollutant or...-pounds) of zinc alkaline cleaned Chromium 0.002 0.0007 Copper 0.007 0.004 Cyanide 0.001 0.0004 Zinc 0.005... times. (k) Alkaline cleaning rinse. Subpart H—BPT Pollutant or pollutant property Maximum for any 1 day...

40 CFR 471.81 - Effluent limitations representing the degree of effluent reduction attainable by the application...

Code of Federal Regulations, 2012 CFR

2012-07-01

... range of 7.5 to 10.0 at all times. (j) Alkaline cleaning spent baths. Subpart H—BPT Pollutant or...-pounds) of zinc alkaline cleaned Chromium 0.002 0.0007 Copper 0.007 0.004 Cyanide 0.001 0.0004 Zinc 0.005... times. (k) Alkaline cleaning rinse. Subpart H—BPT Pollutant or pollutant property Maximum for any 1 day...

40 CFR 471.81 - Effluent limitations representing the degree of effluent reduction attainable by the application...

Code of Federal Regulations, 2013 CFR

2013-07-01

... range of 7.5 to 10.0 at all times. (j) Alkaline cleaning spent baths. Subpart H—BPT Pollutant or...-pounds) of zinc alkaline cleaned Chromium 0.002 0.0007 Copper 0.007 0.004 Cyanide 0.001 0.0004 Zinc 0.005... times. (k) Alkaline cleaning rinse. Subpart H—BPT Pollutant or pollutant property Maximum for any 1 day...

Highly Transparent and Conductive Metallized Nanofibers by Electrospinning and Electroplating

NASA Astrophysics Data System (ADS)

Yoon, Sam S.; Yarin, Alexander L.

2017-11-01

Transparent conducting films (TCFs) and transparent heaters (THs) are of interest for a wide variety of applications, from displays to window defrosters. Here, we demonstrate production of highly flexible, conducting, and transparent copper (Cu), nickel (Ni), platinum (Pt), and silver (Ag) nanofibers suitable for use not only in TCFs and THs but also in some other engineering applications. The merging of fibers at their intersections (i.e. self-junctioning) minimizes contact resistance in these films. These metallized nanofibers exhibited a remarkably low sheet resistance at a high optical transmittance. This low sheet resistance allows them to serve as low-voltage heaters, achieving a high heating temperature at a relatively low applied voltage. These nanofibers are free-standing, flexible, stretchable, and their mechanical reliability was confirmed through various mechanical endurance tests.

Unusual behavior in magnesium-copper cluster matter produced by helium droplet mediated deposition.

PubMed

Emery, S B; Xin, Y; Ridge, C J; Buszek, R J; Boatz, J A; Boyle, J M; Little, B K; Lindsay, C M

2015-02-28

We demonstrate the ability to produce core-shell nanoclusters of materials that typically undergo intermetallic reactions using helium droplet mediated deposition. Composite structures of magnesium and copper were produced by sequential condensation of metal vapors inside the 0.4 K helium droplet baths and then gently deposited onto a substrate for analysis. Upon deposition, the individual clusters, with diameters ∼5 nm, form a cluster material which was subsequently characterized using scanning and transmission electron microscopies. Results of this analysis reveal the following about the deposited cluster material: it is in the un-alloyed chemical state, it maintains a stable core-shell 5 nm structure at sub-monolayer quantities, and it aggregates into unreacted structures of ∼75 nm during further deposition. Surprisingly, high angle annular dark field scanning transmission electron microscopy images revealed that the copper appears to displace the magnesium at the core of the composite cluster despite magnesium being the initially condensed species within the droplet. This phenomenon was studied further using preliminary density functional theory which revealed that copper atoms, when added sequentially to magnesium clusters, penetrate into the magnesium cores.

Absorber Materials for Transition-Edge Sensor X-ray Microcalorimeters

NASA Technical Reports Server (NTRS)

Brown, Ari-David; Bandler, Simon; Brekosky, Regis; Chervenak, James; Figueroa-Feliciano, Enectali; Finkbeiner, Fred; Sadleir, Jack; Iyomoto, Naoko; Kelley, Richard; Kilbourne, Caroline;

Rule of formation of aluminum electroplating layer on Q235 steel.

PubMed

Ding, Zhimin; Feng, Qiuyuan; Shen, Changbin; Gao, Hong

2011-06-01

Aluminum electroplating layer on Q235 steel in AlCl3-NaCl-KCl molten salt was obtained, and the rule of its nucleation and growth were investigated. The results showed that aluminum electroplating layer formed through nucleating and growing of aluminum particles, and thickened by delaminating growth pattern. At low current density, the morphology of aluminum particles took on flake-like, while at high current density they changed to spherical. The thickness of plating layer increases with increasing current density and electroplating time. The relationship between the plating thickness (δ) and electroplating time (t) or current density (i) can be expressed as δ = 0.28f(137), and δ = 1.1i(1-39). Copyright © 2011 The Research Centre for Eco-Environmental Sciences, Chinese Academy of Sciences. Published by Elsevier B.V. All rights reserved.

Visibility and oxidation stability of hybrid-type copper mesh electrodes with combined nickel-carbon nanotube coating

NASA Astrophysics Data System (ADS)

Kim, Bu-Jong; Hwang, Young-Jin; Park, Jin-Seok

2017-04-01

Hybrid-type transparent conductive electrodes (TCEs) were fabricated by coating copper (Cu) meshes with carbon nanotube (CNT) via electrophoretic deposition, and with nickel (Ni) via electroplating. For the fabricated electrodes, the effects of the coating with CNT and Ni on their transmittance and reflectance in the visible-light range, electrical sheet resistance, and chromatic parameters (e.g., redness and yellowness) were characterized. Also, an oxidation stability test was performed by exposing the electrodes to air for 20 d at 85 °C and 85% temperature and humidity conditions, respectively. It was discovered that the CNT coating considerably reduced the reflectance of the Cu meshes, and that the Ni coating effectively protected the Cu meshes against oxidation. Furthermore, after the coating with CNT, both the redness and yellowness of the Cu mesh regardless of the Ni coating approached almost zero, indicating a natural color. The experiment results confirmed that the hybrid-type Cu meshes with combined Ni-CNT coating improved characteristics in terms of reflectance, sheet resistance, oxidation stability, and color, superior to those of the primitive Cu mesh, and also simultaneously satisfied most of the requirements for TCEs.

Frequency dependence of magnetic ac loss in a Roebel cable made of YBCO on a Ni-W substrate

NASA Astrophysics Data System (ADS)

Lakshmi, L. S.; Staines, M. P.; Badcock, R. A.; Long, N. J.; Majoros, M.; Collings, E. W.; Sumption, M. D.

2010-08-01

We have investigated the frequency dependent contributions to the magnetic ac loss in a 10 strand Roebel cable with 2 mm wide non-insulated strands and a transposition length of 90 mm. This cable is made from 40 mm wide YBCO coated conductor tape manufactured by AMSC and stabilized by electroplating 25 µm thick copper on either side prior to the mechanical punching of the cable strands. The measurements were carried out in both perpendicular and parallel field orientation, at frequencies in the range of 30-200 Hz. While the loss in the perpendicular orientation is predominantly hysteretic in nature, we observe some frequency dependence of the loss when the cable approaches full flux penetration at high field amplitudes. The magnitude is consistent with eddy current losses in the copper stabilization layer. This supports the fact that the inter-strand coupling loss is not significant in this frequency range. In the parallel field orientation, the hysteresis loss in the Ni-W alloy substrate dominates, but we see an unusually strong frequency dependent contribution to the loss which we attribute to intra-strand current loops.

3D electroplated inductors with thickness variation for improved broadband performance

NASA Astrophysics Data System (ADS)

Farm-Guoo Tseng, Victor; Bedair, Sarah S.; Lazarus, Nathan

2017-01-01

The performance of an RF spiral inductor is based on the balance between ohmic losses in the outer turns and eddy current losses dominant in the inner turns where the magnetic field is the strongest. In this work, air-core spiral inductors with winding trace thicknesses decreasing towards the center are demonstrated, achieving quality factor improvement over a wide frequency range compared to uniform thickness inductors. A custom 3D copper electroplating process was used to produce spiral inductors with varying winding thicknesses in a single plating step, with patterned gaps in a seed layer used to create delays in the vertical plating. The fabricated center-lowered coil inductors were 80 nH within a one square millimeter area with thickness varying from 60 µm to 10 µm from outer to inner winding. Within the 16 MHz-160 MHz range, the center-lowered inductors were shown to have a maximum to minimum quality factor improvement of 90%-10% when compared to uniform thickness inductors with thicknesses ranging from 60 µm to 10 µm. Compared to the 20 µm uniform thickness inductor which has the optimal performance among all uniform thickness inductors in this frequency range, the center-lowered inductors were shown to achieve a maximum quality factor improvement of 20% at the edge frequencies of 16 MHz and 160 MHz, and a minimum quality factor improvement of 10% near the geometric mean center frequency of 46 MHz.

Float processing of high-temperature complex silicate glasses and float baths used for same

NASA Technical Reports Server (NTRS)

Cooper, Reid Franklin (Inventor); Cook, Glen Bennett (Inventor)

2000-01-01

A float glass process for production of high melting temperature glasses utilizes a binary metal alloy bath having the combined properties of a low melting point, low reactivity with oxygen, low vapor pressure, and minimal reactivity with the silicate glasses being formed. The metal alloy of the float medium is exothermic with a solvent metal that does not readily form an oxide. The vapor pressure of both components in the alloy is low enough to prevent deleterious vapor deposition, and there is minimal chemical and interdiffusive interaction of either component with silicate glasses under the float processing conditions. Alloys having the desired combination of properties include compositions in which gold, silver or copper is the solvent metal and silicon, germanium or tin is the solute, preferably in eutectic or near-eutectic compositions.

Electroplating method for producing ultralow-mass fissionable deposits

DOEpatents

Ruddy, Francis H.

1989-01-01

A method for producing ultralow-mass fissionable deposits for nuclear reactor dosimetry is described, including the steps of holding a radioactive parent until the radioactive parent reaches secular equilibrium with a daughter isotope, chemically separating the daughter from the parent, electroplating the daughter on a suitable substrate, and holding the electroplated daughter until the daughter decays to the fissionable deposit.

Routine production of copper-64 using 11.7MeV protons

NASA Astrophysics Data System (ADS)

Jeffery, C. M.; Smith, S. V.; Asad, A. H.; Chan, S.; Price, R. I.

2012-12-01

Reliable production of copper-64 (64Cu) was achieved by irradiating enriched nickel-64 (64Ni, >94.8%) in an IBA 18/9 cyclotron. Nickel-64 (19.1 ± 3.0 mg) was electroplated onto an Au disc (125μm × 15mm). Targets were irradiated with 11.7 MeV protons for 2 hours at 40μA. Copper isotopes (60,61,62,64Cu) were separated from target nickel and cobalt isotopes (55,57,61Co) using a single ion exchange column, eluted with varying concentration of low HCl alcohol solutions. The 64Ni target material was recovered and reused. The 64Cu production rate was 1.46±0.3MBq/μA.hr/mg64Ni(n = 10) (with a maximum of 2.6GBq of 64Cu isolated after 2hr irradiation at 40uA. Radionuclidic purity of the 64Cu was 98.7 ± 1.6 % at end of separation. Cu content was < 6mg/L (n = 21). The specific activity of 64Cu was determined by ICP-MS and by titration with Diamsar to be 28.9±13.0GBq/μmol[0.70±0.35Ci/μmol]/(μA.hr/mg64Ni)(n = 10) and 13.1±12.0GBq/μmol[0.35±0.32Ci/μmol]/(μA.hr/mg64Ni)(n = 9), respectively; which are in agreement, however, further work is required.

The Design, Fabrication and Characterization of a Transparent Atom Chip

PubMed Central

Chuang, Ho-Chiao; Huang, Chia-Shiuan; Chen, Hung-Pin; Huang, Chi-Sheng; Lin, Yu-Hsin

2014-01-01

This study describes the design and fabrication of transparent atom chips for atomic physics experiments. A fabrication process was developed to define the wire patterns on a transparent glass substrate to create the desired magnetic field for atom trapping experiments. An area on the chip was reserved for the optical access, so that the laser light can penetrate directly through the glass substrate for the laser cooling process. Furthermore, since the thermal conductivity of the glass substrate is poorer than other common materials for atom chip substrate, for example silicon, silicon carbide, aluminum nitride. Thus, heat dissipation copper blocks are designed on the front and back of the glass substrate to improve the electrical current conduction. The testing results showed that a maximum burnout current of 2 A was measured from the wire pattern (with a width of 100 μm and a height of 20 μm) without any heat dissipation design and it can increase to 2.5 A with a heat dissipation design on the front side of the atom chips. Therefore, heat dissipation copper blocks were designed and fabricated on the back of the glass substrate just under the wire patterns which increases the maximum burnout current to 4.5 A. Moreover, a maximum burnout current of 6 A was achieved when the entire backside glass substrate was recessed and a thicker copper block was electroplated, which meets most requirements of atomic physics experiments. PMID:24922456

[Exposure to metal compounds in occupational galvanic processes].

PubMed

Surgiewicz, Jolanta; Domański, Wojciech

2006-01-01

Occupational galvanic processes are provided in more than 600 small and medium enterprises in Poland. Workers who deal with galvanic coating are exposed to heavy metal compounds: tin, silver, copper and zinc. Some of them are carcinogenic, for example, hexavalent chromium compounds, nickel and cadmium compounds. Research covered several tens of workstations involved in chrome, nickel, zinc, tin, silver, copper and cadmium plating. Compounds of metals present in the air were determined: Cr, Ni, Cd, Sn, Ag--by atomic absorption spectrometry with electrothermal atomization (ET-AAS) and Zn--by atomic absorption spectrometry with flame atomization (F-AAS). The biggest metal concentrations--of silver and copper--were found at workstations of copper, brass, cadmium, nickel and chrome plating, conducted at the same time. Significant concentrations of copper were found at workstations of maintenance bathing and neutralizing of sewage. The concentrations of metals did not exceed Polish MAC values. MAC values were not exceeded for carcinogenic chromium(VI), nickel or cadmium, either. In galvanic processes there was no hazard related to single metals or their compounds, even carcinogenic ones. Combined exposure indicators for metals at each workstation did not exceed 1, either. However, if there are even small quantities of carcinogenic agents, health results should always be taken into consideration.

Energy Efficiency of the Outotec® Ausmelt Process for Primary Copper Smelting

NASA Astrophysics Data System (ADS)

Wood, Jacob; Hoang, Joey; Hughes, Stephen

2017-03-01

The global, non-ferrous smelting industry has witnessed the continual development and evolution of processing technologies in a bid to reduce operating costs and improve the safety and environmental performance of processing plants. This is particularly true in the copper industry, which has seen a number of bath smelting technologies developed and implemented during the past 30 years. The Outotec® Ausmelt Top Submerged Lance Process is one such example, which has been widely adopted in the modernisation of copper processing facilities in China and Russia. Despite improvements in the energy efficiency of modern copper smelting and converting technologies, additional innovation and development is required to further reduce energy consumption, whilst still complying with stringent environmental regulations. In response to this challenge, the Ausmelt Process has undergone significant change and improvement over the course of its history, in an effort to improve its overall competitiveness, particularly with respect to energy efficiency and operating costs. This paper covers a number of recent advances to the technology and highlights the impacts of these developments in reducing energy consumptions for a range of different copper flowsheets. It also compares the energy efficiency of the Ausmelt Process against the Bottom Blown Smelting process, which has become widely adopted in China over the past 5-10 years.

Evolution of the Large Copper Smelter — 1800s to 2013

NASA Astrophysics Data System (ADS)

Mackey, P. J.

Over the course of Dr. Robertson's career, the ferrous and non-ferrous plants have seen enormous changes in technology and increases in plant capacity, essentially amounting to a "technological revolution". In iron and steel, the "mega" blast furnace of some 6,000 m3 working volume is now standard ( 10,000 tonnes (mt) of pig iron/day). Similar huge changes in process technology and plant size have occurred in the non-ferrous industry. As an example, the fuel-fired reverberatory furnace, once the mainstay of the copper industry, has disappeared — replaced by large capacity flash and bath smelting technologies. The energy consumption per unit mass of metal produced has also been reduced considerably. Our understanding of the thermodynamics and mechanisms of metallurgical reactions, a field to which Dr. Robertson has significantly contributed, has made great strides. This paper reviews these changes with particular reference to the copper smelting industry, providing also comments on expected future trends.

Corrosion Behavior of Sacrificial Coatings on Grade 10.9 Fasteners for Multimetal Armor Applications

DTIC Science & Technology

2013-08-01

hexavalent chromium , immersion, magniplate, trivalent chromium (TCP), bolts nonchromate, hexavalent chrome, grade 10.9 fasteners, bolt-on armor...for Testing and Materials (ASTM) B633 (4) electroplated zinc with hexavalent chromium conversion coating 2. Trivalent Chromium Process (TCP): ASTM...B633 (4) electroplated zinc with trivalent chromium conversion coating 3. AlumiPlate: Process details, entire surface electroplated with aluminum (Al

Multi-phase structures of boron-doped copper tin sulfide nanoparticles synthesized by chemical bath deposition for optoelectronic devices

NASA Astrophysics Data System (ADS)

Rakspun, Jariya; Kantip, Nathakan; Vailikhit, Veeramol; Choopun, Supab; Tubtimtae, Auttasit

2018-04-01

We investigated the influence of boron doping on the structural, optical, and electrical properties of copper tin sulfide (CTS) nanoparticles coated on a WO3 surface and synthesized using chemical bath deposition. Boron doping at concentrations of 0.5, 1.0, 1.5, and 2.0 wt% was investigated. The X-ray diffraction pattern of CTS showed the presence of monoclinic Cu2Sn3S7, cubic Cu2SnS3, and orthorhombic Cu4SnS4. Boron doping influenced the preferred orientation of the nanoparticles for all phase structures and produced a lattice strain effect and changes in the dislocation density. Increasing the concentration of boron in CTS from 0.5 wt% to 2.0 wt% reduced the band gap for all phases of CTS from 1.46 to 1.29 eV and reduced the optical transmittance. Optical constants, such as the refractive index, extinction coefficient, and dissipation factor, were also obtained for B-doped CTS. The dispersion behavior of the refractive index was investigated in terms of a single oscillator model and the physical parameters were determined. Fourier transform infrared spectroscopy confirmed the successful synthesis of CTS nanoparticles. Cyclic voltammetry indicated that optimum boron doping (<1.5 wt% for all phases) resulted in desirable p-n junction behavior for optoelectronic applications.

Chemical bath deposition of Cu{sub 3}BiS{sub 3} thin films

DOE Office of Scientific and Technical Information (OSTI.GOV)

Deshmukh, S.G., E-mail: deshmukhpradyumn@gmail.com; Vipul, Kheraj, E-mail: vipulkheraj@gmail.com; Panchal, A.K.

2016-05-06

First time, copper bismuth sulfide (Cu{sub 3}BiS{sub 3}) thin films were synthesized on the glass substrate using simple, low-cost chemical bath deposition (CBD) technique. The synthesized parameters such as temperature of bath, pH and concentration of precursors were optimized for the deposition of uniform, well adherent Cu{sub 3}BiS{sub 3} thin films. The optical, surface morphology and structural properties of the Cu{sub 3}BiS{sub 3} thin films were studied using UV-VIS-NIR spectra, scanning electron microscopy (SEM) and X-ray diffraction (XRD). The as- synthesized Cu{sub 3}BiS{sub 3} film exhibits a direct band gap 1.56 to 1.58 eV having absorption coefficient of the ordermore » of 10{sup 5} cm{sup −1}. The XRD declares the amorphous nature of the films. SEM images shows films were composed of close-packed fine spherical nanoparticles of 70-80 nm in diameter. The chemical composition of the film was almost stoichiometric. The optical study indicates that the Cu{sub 3}BiS{sub 3} films can be applied as an absorber layer for thin film solar cells.« less

Service Test Plan for A-10 Hydraulic Actuators

DTIC Science & Technology

2014-05-29

utilizes electroplated chrome as a wear coating on the actuator assembly. This actuator will be delta-qualified while two other actuators will be qualified...2730534-1 Similarity to (1) 3 Elevator Actuator Hydraulic Flight Control System 2730551-5 Similarity to (1) The current chrome electroplating ...process has been proven to be a significant health hazard, and it is anticipated that future Government regulation will make the use of electroplated

Quantitative Analysis of Electroplated Nickel Coating on Hard Metal

PubMed Central

Wahab, Hassan A.; Noordin, M. Y.; Izman, S.

2013-01-01

Electroplated nickel coating on cemented carbide is a potential pretreatment technique for providing an interlayer prior to diamond deposition on the hard metal substrate. The electroplated nickel coating is expected to be of high quality, for example, indicated by having adequate thickness and uniformity. Electroplating parameters should be set accordingly for this purpose. In this study, the gap distances between the electrodes and duration of electroplating process are the investigated variables. Their effect on the coating thickness and uniformity was analyzed and quantified using design of experiment. The nickel deposition was carried out by electroplating in a standard Watt's solution keeping other plating parameters (current: 0.1 Amp, electric potential: 1.0 V, and pH: 3.5) constant. The gap distance between anode and cathode varied at 5, 10, and 15 mm, while the plating time was 10, 20, and 30 minutes. Coating thickness was found to be proportional to the plating time and inversely proportional to the electrode gap distance, while the uniformity tends to improve at a large electrode gap. Empirical models of both coating thickness and uniformity were developed within the ranges of the gap distance and plating time settings, and an optimized solution was determined using these models. PMID:23997678

Unusual behavior in magnesium-copper cluster matter produced by helium droplet mediated deposition

DOE Office of Scientific and Technical Information (OSTI.GOV)

Emery, S. B., E-mail: samuel.emery@navy.mil; Little, B. K.; Air Force Research Laboratory, Munitions Directorate, 2306 Perimeter Rd., Eglin AFB, Florida 32542

2015-02-28

We demonstrate the ability to produce core-shell nanoclusters of materials that typically undergo intermetallic reactions using helium droplet mediated deposition. Composite structures of magnesium and copper were produced by sequential condensation of metal vapors inside the 0.4 K helium droplet baths and then gently deposited onto a substrate for analysis. Upon deposition, the individual clusters, with diameters ∼5 nm, form a cluster material which was subsequently characterized using scanning and transmission electron microscopies. Results of this analysis reveal the following about the deposited cluster material: it is in the un-alloyed chemical state, it maintains a stable core-shell 5 nm structuremore » at sub-monolayer quantities, and it aggregates into unreacted structures of ∼75 nm during further deposition. Surprisingly, high angle annular dark field scanning transmission electron microscopy images revealed that the copper appears to displace the magnesium at the core of the composite cluster despite magnesium being the initially condensed species within the droplet. This phenomenon was studied further using preliminary density functional theory which revealed that copper atoms, when added sequentially to magnesium clusters, penetrate into the magnesium cores.« less

Soft X-ray absorption spectroscopy investigation of the surface chemistry and treatments of copper indium gallium diselenide (CIGS)

DOE PAGES

Schwartz, Craig; Nordlund, Dennis; Sokaras, Dimosthenis; ...

2017-02-01

The surface and near surface structure of copper-indium-gallium-selenide (CIGS) absorber layers is integral to the producing a high-quality photovoltaic junction. By using X-ray absorption spectroscopy (XAS) and monitoring multiple elemental absorption edges with both theory and experiment, we are able to identify several features of the surface of CIGS as a function of composition and surface treatments. The XAS data shows trends in the near surface region of oxygen, copper, indium and gallium species as the copper content is varied in the films. The oxygen surface species are also monitored through a series of experiments that systematically investigates the effectsmore » of water and various solutions of: ammonium hydroxide, cadmium sulfate, and thiourea. These being components of cadmium sulfide chemical bath deposition (CBD). Characteristics of the CBD are correlated with a restorative effect that produces as normalized, uniform surface chemistry as measured by XAS. This surface chemistry is found in CIGS solar cells with excellent power conversion efficiency (<19%). The results provide new insight for CIGS processing strategies that seek to replace CBD and/or cadmium sulfide.« less

Soft X-ray absorption spectroscopy investigation of the surface chemistry and treatments of copper indium gallium diselenide (CIGS)

DOE Office of Scientific and Technical Information (OSTI.GOV)

Schwartz, Craig; Nordlund, Dennis; Sokaras, Dimosthenis

The surface and near surface structure of copper-indium-gallium-selenide (CIGS) absorber layers is integral to the producing a high-quality photovoltaic junction. By using X-ray absorption spectroscopy (XAS) and monitoring multiple elemental absorption edges with both theory and experiment, we are able to identify several features of the surface of CIGS as a function of composition and surface treatments. The XAS data shows trends in the near surface region of oxygen, copper, indium and gallium species as the copper content is varied in the films. The oxygen surface species are also monitored through a series of experiments that systematically investigates the effectsmore » of water and various solutions of: ammonium hydroxide, cadmium sulfate, and thiourea. These being components of cadmium sulfide chemical bath deposition (CBD). Characteristics of the CBD are correlated with a restorative effect that produces as normalized, uniform surface chemistry as measured by XAS. This surface chemistry is found in CIGS solar cells with excellent power conversion efficiency (<19%). The results provide new insight for CIGS processing strategies that seek to replace CBD and/or cadmium sulfide.« less

The Influence of Impurities and Metallic Capping Layers on the Microstructure of Copper Interconnects

NASA Astrophysics Data System (ADS)

Rizzolo, Michael

As copper interconnects have scaled to ever smaller dimensions on semiconductor devices, the microstructure has become increasingly detrimental for performance and reliability. Small grains persist in interconnects despite annealing at high temperatures, leading to higher line resistance and more frequent electromigration-induced failures. Conventionally, it was believed that impurities from the electrodeposition pinned grain growth, but limitations in analytical techniques meant the effect was inferred rather than observed. Recent advances in analytical techniques, however, have enabled this work to quantify impurity content, location, and diffusion in relation to microstructural changes in electroplated copper. Surface segregation of impurities during the initial burst of grain growth was investigated. After no surface segregation was observed, a microfluidic plating cell was constructed to plate multilayer films with regions of intentionally high and low impurity concentrations to determine if grain growth could be pinned by the presence of impurities; it was not. An alternate mechanism for grain boundary pinning based on the texture of the seed layer is proposed, supported by time-resolved transmission electron microscopy and transmission electron backscatter diffraction data. The suggested model posits that the seed in narrow features has no preferred orientation, which results in rapid nucleation of subsurface grains in trench regions prior to recrystallization from the overburden down. These rapidly growing grains are able to block off several trenches from the larger overburden grains, inhibiting grain growth in narrow features. With this knowledge in hand, metallic capping layers were employed to address the problematic microstructure in 70nm lines. The capping layers (chromium, nickel, zinc, and tin) were plated on the copper overburden prior to annealing to manipulate the stress gradient and microstructural development during annealing. It appeared that regardless of as-plated stress, nickel capping altered the recrystallized texture of the copper over patterned features. The nickel capping also caused a 2x increase in the number of advantageous 'bamboo' grains that span the entire trench, which effectively block electromigration pathways. These data provides a more fundamental understanding of manipulating the microstructure in copper interconnects using pre-anneal capping layers, and demonstrates a strategy to improve the microstructure beyond the capabilities of simple annealing.

Physical Properties of Pyridinium Fluorohydrogenate, [pyridine · H+][H2F3]-

NASA Astrophysics Data System (ADS)

Hulse, Ryan; Singh, Rajiv

2008-12-01

Ionic liquids (ILs), also referred to as molten salts, have found application as electrolytes for batteries and super-capacitors, in electroplating baths, as designer solvents, and as reaction media. A few of the desired properties of a super-capacitor electrolyte are nonflammability, thermal stability, and electrochemical stability. ILs containing aromatic cations have been shown to have low viscosity which results in a high electrochemical conductivity. There is a delicate balance between increasing the thermal stability, or decreasing the melting point, and increasing the electrochemical conductivity of the IL. This study focuses on pyridinium fluorohydrogenate, [pyridine · H+][H2F3]-. Pyridinium fluorohydrogenate has been synthesized by the reaction of pyridine and anhydrous hydrofluoric acid. This IL has a relatively high electrical conductivity (~98 mS · cm-1 at 23 °C), a wide electrochemical window, and a boiling point of 186 °C. A stable gel can also be formed by combining [pyridine · H+][H2F3]- and a super absorbent polymer such as polyacrylic acid. The gel adds mechanical stability to the matrix while not greatly affecting the conductivity of the IL.

Hydrodynamic modelling of the influence of stormwater and combined sewer overflows on receiving water quality: Benzo(a)pyrene and copper risks to recreational water.

PubMed

Björklund, Karin; Bondelind, Mia; Karlsson, Anna; Karlsson, Dick; Sokolova, Ekaterina

2018-02-01

The risk from chemical substances in surface waters is often increased during wet weather, due to surface runoff, combined sewer overflows (CSOs) and erosion of contaminated land. There are strong incentives to improve the quality of surface waters affected by human activities, not only from ecotoxicity and ecosystem health perspectives, but also for drinking water and recreational purposes. The aim of this study is to investigate the influence of urban stormwater discharges and CSOs on receiving water in the context of chemical health risks and recreational water quality. Transport of copper (Cu) and benzo[a]pyrene (BaP) in the Göta River (Sweden) was simulated using a hydrodynamic model. Within the 16 km modelled section, 35 CSO and 16 urban stormwater point discharges, as well as the effluent from a major wastewater treatment plant, were included. Pollutant concentrations in the river were simulated for two rain events and investigated at 13 suggested bathing sites. The simulations indicate that water quality guideline values for Cu are exceeded at several sites, and that stormwater discharges generally give rise to higher Cu and BaP concentrations than CSOs. Due to the location of point discharges and the river current inhibiting lateral mixing, the north shore of the river is better suited for bathing. Peak concentrations have a short duration; increased concentrations of the pollutants may however be present for several days after a rain event. Monitoring of river water quality indicates that simulated Cu and BaP concentrations are in the same order of magnitude as measured concentrations. It is concluded that hydrodynamic modelling is a useful tool for identifying suitable bathing sites in urban surface waters and areas of concern where mitigation measures should be implemented to improve water quality. Copyright © 2017 Elsevier Ltd. All rights reserved.

Removal of brownish-black tarnish on silver-copper alloy objects with sodium glycinate

NASA Astrophysics Data System (ADS)

de Figueiredo, João Cura D.'Ars; Asevedo, Samara Santos; Barbosa, João Henrique Ribeiro

2014-10-01

This article has the principal aim of presenting a new method of chemical cleaning of tarnished silver-copper alloy objects. The chemical cleaning must be harmless to the health, selective to tarnish removal, and easy to use. Sodium glycinate was selected for the study. The reactions of sodium glycinate with tarnish and the silver-copper alloy were evaluated. Products of the reaction, the lixiviated material, and the esthetics of silver-copper alloy coins (used as prototypes) were studied to evaluate if the proposed method can be applied to the cleaning of silver objects. Silver-copper alloys can be deteriorated through a uniform and superficial corrosion process that produces brownish-black tarnish. This tarnish alters the esthetic of the object. The cleaning of artistic and archeological objects requires more caution than regular cleaning, and it must take into account the procedures for the conservation and restoration of cultural heritage. There are different methods for cleaning silver-copper alloy objects, chemical cleaning is one of them. We studied two chemical cleaning methods that use sodium glycinate and sodium acetylglycinate solutions. Silver-copper alloy coins were artificially corroded in a basic thiourea solution and immersed in solutions of sodium glycinate and sodium acetylglycinate. After immersion, optical microscopy and scanning electron microscopy of the surfaces were studied. The sodium glycinate solution was shown to be very efficient in removing the brownish-black tarnish. Absorption spectroscopy measured the percentage of silver and copper lixiviated in immersion baths, and very small quantities of these metals were detected. Infrared absorption spectroscopy and X-ray fluorescence characterized the obtained products. The greater efficiency of the sodium glycinate solution compared to the sodium acetylglycinate solution was explained by chelation and Hard-Soft Acid-Base Theory with the aid of quantum chemical calculations.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Bhattacharya, Raghu N.

An electroplating solution and method for producing an electroplating solution containing a gallium salt, an ionic compound and a solvent that results in a gallium thin film that can be deposited on a substrate.

Development of lightweight aluminum hollowcore solar cell array technology

NASA Technical Reports Server (NTRS)

Carlson, J. A.

1971-01-01

A baseline configuration for a three section folding array, with retraction capability, was developed which would utilize electroformed aluminum hollowcore substrates and beryllium frames. The three section array was not fabricated because of difficulties with impurities in the aluminum electroforming bath. A procedure was developed for etching the copper mandrel from virtually any size of aluminum hollowcore panel in approximately one hour. Procedures were developed for analyzing the content of peroxide, water, total aluminum, and lithium-aluminum-hydride in an aluminum electroforming solution.

A comparison between destructive and non-destructive techniques in determining coating thickness

NASA Astrophysics Data System (ADS)

Haider, F. I.; Suryanto; Ani, M. H.; Mahmood, M. H.

2018-01-01

Measuring coating thickness is an important part in research works related to coating applications. In general, techniques for measuring coating thickness may be divided into destructive and non-destructive methods which are commonly used depending on the applications. The objective of this study is to compare two methods measuring the coating thickness of electroplating copper coating on the austenitic stainless-steel substrate. The electroplating was carried out in a solution containing 200 g/L CuSO4, 100 g/L H2SO4 at room temperature and current of 40mA/cm2 during 20, 40, 60, 80 and 100 mins as coating periods. And the coating thickness was measured by two methods, cross sectional analysis as a destructive technique and weight gain as a non-destructive technique. The results show that at 20 mins coating time interval, the thickness measured by cross sectional method was 16.67 μm and by weight gain method was 17.37 μm, with difference of 0.7 μm and percentage error of 4.11%. This error increased to 5.27% at 100mins time interval, where the values of the thickness measured by cross sectional and weight gain were 86.33 μm and 81.9 μm respectively, and the difference was 4.43 μm. Moreover, though the weight gain method is fast and gives the indication for the termination of a coating process, information regarding the uniformity, porosity and the presence of cracks cannot be obtained. On the other hand, determining the coating thickness using destructive method will damage the sample.

[Mortality study in metal electroplating workers in Bologna (Northern Italy)].

PubMed

Gerosa, Alberto; Scarnato, Corrado; Giacomozzi, Giuseppe; d'Errico, Angelo

2013-01-01

to investigate general and cause-specific mortality of workers exposed to metals and other chemicals in the electroplating industry in Bologna Province. factory records of workers employed in 90 electroplating companies present in 1995 were used to build a cohort of subjects potentially exposed to carcinogenic and other substances in this industry, defined as "revised cohort", which was followed-up for mortality from 1960, or since first employment in an electroplating company if later, to 2008. Mortality risk was also examined separately in a subset of the cohort, composed of workers with at least one year of employment in electroplating, denominated "final cohort". Death rates of residents in Emilia-Romagna Region (Northern Italy) were used as a reference. follow-up completeness was 99%. During the observation period, 533 deaths out of 2,983 subjects were observed in the revised cohort and 317 out of 1,739 in the final cohort. Significantly increased Standardized Mortality Ratios were estimated for overall mortality and for mortality from AIDS in the revised cohort and for bladder and rectal cancer in both cohorts. the present study is, to authors' knowledge, the largest mortality investigation conducted in Italy on electroplating workers, for both size and temporal extension. The presence of excess mortality from causes of death not consistently associated in the literature with exposure to agents in this industry suggests that further research is needed to confirm these associations.

Fabrication of a high aspect ratio thick silicon wafer mold and electroplating using flipchip bonding for MEMS applications

NASA Astrophysics Data System (ADS)

Kim, Bong-Hwan; Kim, Jong-Bok

2009-06-01

We have developed a microfabrication process for high aspect ratio thick silicon wafer molds and electroplating using flipchip bonding with THB 151N negative photoresist (JSR micro). This fabrication technique includes large area and high thickness silicon wafer mold electroplating. The process consists of silicon deep reactive ion etching (RIE) of the silicon wafer mold, photoresist bonding between the silicon mold and the substrate, nickel electroplating and a silicon removal process. High thickness silicon wafer molds were made by deep RIE and flipchip bonding. In addition, nickel electroplating was developed. Dry film resist (ORDYL MP112, TOK) and thick negative-tone photoresist (THB 151N, JSR micro) were used as bonding materials. In order to measure the bonding strength, the surface energy was calculated using a blade test. The surface energy of the bonding wafers was found to be 0.36-25.49 J m-2 at 60-180 °C for the dry film resist and 0.4-1.9 J m-2 for THB 151N in the same temperature range. Even though ORDYL MP112 has a better value of surface energy than THB 151N, it has a critical disadvantage when it comes to removing residue after electroplating. The proposed process can be applied to high aspect ratio MEMS structures, such as air gap inductors or vertical MEMS probe tips.

Lung cancer risk in the electroplating industry in Lombardy, Italy, using the Italian occupational cancer monitoring (OCCAM) information system.

PubMed

Panizza, Celestino; Bai, Edoardo; Oddone, Enrico; Scaburri, Alessandra; Massari, Stefania; Modonesi, Carlo; Contiero, Paolo; Marinaccio, Alessandro; Crosignani, Paolo

2012-01-01

Occupational Cancer Monitoring (OCCAM) is an Italian organization that monitors occupational cancers, by area and industrial sector, by retrieving cases and employment history from official databases. OCCAM previously estimated a relative risk (RR) of lung cancer of about 1.32 among "metal treatment" workers in Lombardy, northern Italy, potentially exposed to chrome and nickel. In the present study, lung cancer risk was estimated among electroplating workers only. Lombardy electroplating companies were identified from descriptions in Social Security files. Lung cancer risk was evaluated from 2001 to 2008 incident cases identified from hospital discharge records. The RR for lung cancer among electroplating workers was 2.03 (90% CI 1.33-3.10, 18 cases) for men; 3.00 (90% CI 1.38-9.03, 4 cases) for women. Electroplaters had higher risks than "metal treatment" workers. Although the risks were due to past exposure, case histories and recent acute effects indicate a present carcinogenic hazard in some Lombardy electroplating factories. Copyright © 2011 Wiley Periodicals, Inc.

Multi-technique characterization of gold electroplating on silver substrates for cultural heritage applications

NASA Astrophysics Data System (ADS)

Ortega-Feliu, I.; Ager, F. J.; Roldán, C.; Ferretti, M.; Juanes, D.; Scrivano, S.; Respaldiza, M. A.; Ferrazza, L.; Traver, I.; Grilli, M. L.

2017-09-01

This work presents a detailed study of a series of silver plates gilded via electroplating techniques in which the characteristics of the coating gold layers are investigated as a function of the electroplating variables (voltage, time, anode surface and temperature). Some reference samples were coated by radio frequency sputtering in order to compare gold layer homogeneity and effective density. Surface analysis was performed by means of atomic and nuclear techniques (SEM-EDX, EDXRF, PIXE and RBS) to obtain information about thickness, homogeneity, effective density, profile concentration of the gold layers and Au-Ag diffusion profiles. The gold layer thickness obtained by PIXE and EDXRF is consistent with the thickness obtained by means of RBS depth profiling. Electroplated gold mass thickness increases with electroplating time, anode area and voltage. However, electrodeposited samples present rough interfaces and gold layer effective densities lower than the nominal density of Au (19.3 g/cm3), whereas sputtering produces uniform layers with nominal density. These analyses provide valuable information to historians and curators and can help the restoration process of gold-plated silver objects.

From micelles to bicelles: Effect of the membrane on particulate methane monooxygenase activity.

PubMed

Ro, Soo Y; Ross, Matthew O; Deng, Yue Wen; Batelu, Sharon; Lawton, Thomas J; Hurley, Joseph D; Stemmler, Timothy L; Hoffman, Brian M; Rosenzweig, Amy C

2018-05-08

Particulate methane monooxygenase (pMMO) is a copper-dependent, integral membrane metalloenzyme that converts methane to methanol in methanotrophic bacteria. Studies of isolated pMMO have been hindered by loss of enzymatic activity upon its removal from the native membrane. To characterize pMMO in a membrane-like environment, we reconstituted pMMOs from Methylococcus ( Mcc. ) capsulatus (Bath) and Methylomicrobium ( Mm. ) alcaliphilum 20Z into bicelles. Reconstitution into bicelles recovers methane oxidation activity lost upon detergent solubilization and purification without substantial alterations to copper content or copper electronic structure as observed by electron paramagnetic resonance (EPR) spectroscopy.. These findings suggest that loss of pMMO activity upon isolation is due to removal from the membranes rather than caused by loss of the catalytic copper ions. A 2.7 Å resolution crystal structure of pMMO from Mm. alcaliphilum 20Z revealed a mononuclear copper center in the PmoB subunit and indicated that the transmembrane PmoC subunit may be conformationally flexible. Finally, results from extended X-ray absorption fine structure (EXAFS) analysis of pMMO from Mm. alcaliphilum 20Z were consistent with the observed monocopper center in the PmoB subunit. These results underscore the importance of studying membrane proteins in a membrane-like environment, and provide valuable insight into pMMO function. Published under license by The American Society for Biochemistry and Molecular Biology, Inc.

Processing, Microstructure, and Mechanical Properties of Interpenetrating Biomorphic Graphite/Copper Composites

NASA Astrophysics Data System (ADS)

Childers, Amanda Esther Sall

Composite properties can surpass those of the individual phases, allowing for the development of advanced, high-performance materials. Bio-inspired and naturally-derived materials have garnered attention as composite constituents due to their inherently efficient and complex structures. Wood-derived ceramics, produced by converting a wood precursor into a ceramic scaffold, can exhibit a wide range of microstructures depending on the wood species, including porosity, pore size and distribution, and connectivity. The focus of this work was to investigate the processing, microstructure, and properties of graphite/copper composites produced using wood-derived graphite scaffolds. Graphite/copper composites combine low specific gravity, high thermal conductivity, and tailorable thermal expansion properties, and due to the non-wetting behavior of copper to graphite, offer a unique system in which mechanically bonded interfaces in composites can be studied. Graphite scaffolds were produced from red oak, beech, and pine precursors using a catalytic pyrolyzation method, resulting in varying types of pore networks. Two infiltration methods were investigated to overcome challenges associated with non-wetting systems: copper electrodeposition and pressure-assisted melt infiltration. The phase distributions, constituent properties, interfacial characteristics, mechanical behavior, and load partitioning of these biomorphic graphite/copper composites were investigated, and were correlated to the wood species. The multi-domain feature sizes in the graphite scaffolds resulted in composites with copper relegated not only to the large, connected channels produced from the transport features in the wood, but also within the smaller, lower aspect ratio fibrous regions of the scaffold. Both features contributed to the mechanical behavior of the composites to varying degrees depending on the wood species. A multi-component predictive model also was developed and used to guide the additive-assisted electroplating of the graphitized scaffold, and helped illuminate the roles of plating additives in macro-sized channels. The model can be adapted for many material systems, sample geometries, and plating conditions to investigate the use of metal electrodeposition as a means of scaffold infiltration. Additionally, X-ray diffraction tomography was used to resolve position-dependent strain in a composite. The results of this nascent capability were discussed with respect to a two-component system under increasing uniaxial load, and compared to the results of conventional volume-averaged measurements.

40 CFR 63.11505 - What parts of my plant does this subpart cover?

Code of Federal Regulations, 2010 CFR

2010-07-01

... electroplating; electroforming; electropolishing; electroless plating or other non-electrolytic metal coating... Chromium Electroplating and Chromium Anodizing Tanks). (2) Research and development process units, as...

Enhanced Photoelectrocatalytic Decomplexation of Cu-EDTA and Cu Recovery by Persulfate Activated by UV and Cathodic Reduction.

PubMed

Zeng, Huabin; Liu, Shanshan; Chai, Buyu; Cao, Di; Wang, Yan; Zhao, Xu

2016-06-21

In order to enhance Cu-EDTA decomplexation and copper cathodic recovery via the photoelectrocatalytic (PEC) process, S2O8(2-) was introduced into the PEC system with a TiO2/Ti photoanode. At a current density of 0.2 mA/cm(2) and initial solution pH of 3.0, the decomplexation ratio of Cu complexes was increased from 47.5% in the PEC process to 98.4% with 5 mM S2O8(2-) addition into the PEC process (PEC/S2O8(2-)). Correspondently, recovery percentage of Cu was increased to 98.3% from 47.4% within 60 min. It was observed that nearly no copper recovery occurred within the initial reaction period of 10 min. Combined with the analysis of ESR and electrochemical LSV curves, it was concluded that activation of S2O8(2-) into SO4(·-) radicals by cathodic reduction occurred, which was prior to the reduction of liberated Cu(2+) ions. UV irradiation of S2O8(2-) also led to the production of SO4(·-). The generated SO4(·-) radicals enhanced the oxidation of Cu-EDTA. After the consumption of S2O8(2-), the Cu recovery via cathodic reduction proceeded quickly. Acidification induced by the transformation of SO4(·-) to OH· favored the copper cathodic recovery. The combined PEC/S2O8(2-) process was also efficient for the TOC removal from a real electroplating wastewater with the Cu recovery efficiency higher than 80%.

Synthesis of nanoparticles through x-ray radiolysis using synchrotron radiation

NASA Astrophysics Data System (ADS)

Yamaguchi, A.; Okada, I.; Fukuoka, T.; Ishihara, M.; Sakurai, I.; Utsumi, Y.

2016-09-01

The synthesis and deposition of nanoparticles consisting of Cu and Au in a CuSO4 solution with some kinds of alcohol and electroplating solution containing gold (I) trisodium disulphite under synchrotron X-ray radiation was investigated. The functional group of alcohol plays an important in nucleation, growth and aggregation process of copper and cupric oxide particles. We found that the laboratory X-ray source also enables us to synthesize the NPs from the metallic solution. As increasing X-ray exposure time, the full length at half width of particle size distribution is broader and higher-order nanostructure containing NPs clusters is formed. The surface-enhanced Raman scattering (SERS) of 4, 4'-bipyridine (4bpy) in aqueous solution was measured using higher-order nanostructure immobilized on silicon substrates under systematically-varied X-ray exposure. This demonstration provide a clue to develop a three-dimensional printing and sensor for environmental analyses and molecular detection through simple SERS measurements.

Five-centimeter diameter ion thruster development

NASA Technical Reports Server (NTRS)

Weigand, A. J.

1972-01-01

All system components were tested for endurance and steady state and cyclic operation. The following results were obtained: acceleration system (electrostatic type), 3100 hours continuous running; acceleration system (translation type), 2026 hours continuous running; cathode-isolator-vaporizer assembly, 5000 hours continuous operation and 190 restart cycles with 1750 hours operation; mercury expulsion system, 5000 hours continuous running; and neutralizer, 5100 hours continuous operation. The results of component optimization studies such as neutralizer position, neutralizer keeper hole, and screen grid geometry are included. Extensive mapping of the magnet field within and immediately outside the thruster are shown. A technique of electroplating the molybdenum accelerator grid with copper to study erosion patterns is described. Results of tests being conducted to more fully understand the operation of the hollow cathode are also given. This type of 5-cm thruster will be space tested on the Communication Technology Satellite in 1975.

Plants as useful vectors to reduce environmental toxic arsenic content.

PubMed

Mirza, Nosheen; Mahmood, Qaisar; Maroof Shah, Mohammad; Pervez, Arshid; Sultan, Sikander

2014-01-01

Arsenic (As) toxicity in soil and water is an increasing menace around the globe. Its concentration both in soil and environment is due to natural and anthropogenic activities. Rising arsenic concentrations in groundwater is alarming due to the health risks to plants, animals, and human beings. Anthropogenic As contamination of soil may result from mining, milling, and smelting of copper, lead, zinc sulfide ores, hide tanning waste, dyes, chemical weapons, electroplating, gas exhaust, application of municipal sludge on land, combustion of fossil fuels, As additives to livestock feed, coal fly ash, and use of arsenical pesticides in agricultural sector. Phytoremediation can be viewed as biological, solar-driven, pump-and-treat system with an extensive, self-extending uptake network (the root system) that enhances the natural ecosystems for subsequent productive use. The present review presents recent scientific developments regarding phytoremediation of arsenic contaminated environments and its possible detoxification mechanisms in plants.

Plants as Useful Vectors to Reduce Environmental Toxic Arsenic Content

PubMed Central

Mirza, Nosheen; Mahmood, Qaisar; Maroof Shah, Mohammad; Pervez, Arshid; Sultan, Sikander

2014-01-01

Arsenic (As) toxicity in soil and water is an increasing menace around the globe. Its concentration both in soil and environment is due to natural and anthropogenic activities. Rising arsenic concentrations in groundwater is alarming due to the health risks to plants, animals, and human beings. Anthropogenic As contamination of soil may result from mining, milling, and smelting of copper, lead, zinc sulfide ores, hide tanning waste, dyes, chemical weapons, electroplating, gas exhaust, application of municipal sludge on land, combustion of fossil fuels, As additives to livestock feed, coal fly ash, and use of arsenical pesticides in agricultural sector. Phytoremediation can be viewed as biological, solar-driven, pump-and-treat system with an extensive, self-extending uptake network (the root system) that enhances the natural ecosystems for subsequent productive use. The present review presents recent scientific developments regarding phytoremediation of arsenic contaminated environments and its possible detoxification mechanisms in plants. PMID:24526924

Influence of Na+, K+, Mn2+, Fe2+ and Zn2+ ions on the electrodeposition of Ni-Co alloys: Implications for the recycling of Ni-MH batteries

NASA Astrophysics Data System (ADS)

Blanco, S.; Orta-Rodriguez, R.; Delvasto, P.

2017-01-01

A hydrometallurgical recycling procedure for the recovery of a mixed rare earths sulfate and an electrodeposited Ni-Co alloy has been described. The latter step was found to be complex, due to the presence of several ions in the battery electrode materials. Electrochemical evaluation of the influence of the ions on the Ni-Co alloy deposition was carried out by cyclic voltammetry test. It was found that ions such as K+, Fe2+ and Mn2+ improved the current efficiency for the Ni-Co deposition process on a copper surface. On the other hand, Na+ and Zn2+ ions exhibited a deleterious behaviour, minimizing the values of the reduction current. The results were used to suggest the inclusion of additional steps in the process flow diagram of the recycling operation, in order to eliminate deleterious ions from the electroplating solution.

Over-limiting Current and Control of Dendritic Growth by Surface Conduction in Nanopores

PubMed Central

Han, Ji-Hyung; Khoo, Edwin; Bai, Peng; Bazant, Martin Z.

2014-01-01

Understanding over-limiting current (faster than diffusion) is a long-standing challenge in electrochemistry with applications in desalination and energy storage. Known mechanisms involve either chemical or hydrodynamic instabilities in unconfined electrolytes. Here, it is shown that over-limiting current can be sustained by surface conduction in nanopores, without any such instabilities, and used to control dendritic growth during electrodeposition. Copper electrodeposits are grown in anodized aluminum oxide membranes with polyelectrolyte coatings to modify the surface charge. At low currents, uniform electroplating occurs, unaffected by surface modification due to thin electric double layers, but the morphology changes dramatically above the limiting current. With negative surface charge, growth is enhanced along the nanopore surfaces, forming surface dendrites and nanotubes behind a deionization shock. With positive surface charge, dendrites avoid the surfaces and are either guided along the nanopore centers or blocked from penetrating the membrane. PMID:25394685

Micro-light-pipe array with an excitation attenuation filter for lensless digital enzyme-linked immunosorbent assay

NASA Astrophysics Data System (ADS)

Takehara, Hironari; Nagasaki, Mizuki; Sasagawa, Kiyotaka; Takehara, Hiroaki; Noda, Toshihiko; Tokuda, Takashi; Ohta, Jun

2016-03-01

Digital enzyme-linked immunosorbent assay (ELISA) is used for detecting various biomarkers with hypersensitivity. We have been developing compact systems by replacing the fluorescence microscope with a CMOS image sensor. Here, we propose a micro-light-pipe array structure made of metal filled with dye-doped resin, which can be used as a fabrication substrate of the micro-reaction-chamber array of digital ELISA. The possibility that this structure enhances the coupling efficiency for fluorescence was simulated using a simple model. To realize the structure, we fabricated a 30-µm-thick micropipe array by copper electroplating around a thick photoresist pattern. The typical diameter of each fabricated micropipe was 10 µm. The pipes were filled with yellow-dye-doped epoxy resin. The transmittance ratio of fluorescence and excitation light could be controlled by adjusting the doping concentration. We confirmed that an angled excitation light incidence suppressed the leakage of excitation light.

Fabrication and electrical characterization of sub-micron diameter through-silicon via for heterogeneous three-dimensional integrated circuits

NASA Astrophysics Data System (ADS)

Abbaspour, R.; Brown, D. K.; Bakir, M. S.

2017-02-01

This paper presents the fabrication and electrical characterization of high aspect-ratio (AR) sub-micron diameter through silicon vias (TSVs) for densely interconnected three-dimensional (3D) stacked integrated circuits (ICs). The fabricated TSV technology features an AR of 16:1 with 680 nm diameter copper (Cu) core and 920 nm overall diameter. To address the challenges in scaling TSVs, scallop-free low roughness nano-Bosch silicon etching and direct Cu electroplating on a titanium-nitride (TiN) diffusion barrier layer have been developed as key enabling modules. The electrical resistance of the sub-micron TSVs is measured to be on average 1.2 Ω, and the Cu resistivity is extracted to be approximately 2.95 µΩ cm. Furthermore, the maximum achievable current-carrying capacity (CCC) of the scaled TSVs is characterized to be approximately 360 µA for the 680 nm Cu core.

Conductive copper sulfide thin films on polyimide foils

NASA Astrophysics Data System (ADS)

Cardoso, J.; Gomez Daza, O.; Ixtlilco, L.; Nair, M. T. S.; Nair, P. K.

2001-02-01

Kapton polyimide is known for its high thermal stability, >400 °C. Copper sulfide thin films of 75 and 100 nm thickness were coated on DuPont Kapton HN polyimide foils of 25 µm thickness by floating them on a chemical bath containing copper complexes and thiourea. The coated foils were annealed at 150-400 °C in nitrogen, converting the coating from CuS to Cu1.8S. The sheet resistance of the annealed coatings (100 nm) is 10-50 Ω/□ and electrical conductivity, 2-10×103 Ω-1 cm- 1, which remain nearly constant even after the foils are immersed in 0.1-1 M HCl for 30-120 min. The coated polyimide has a transmittance (25-35%) peak located in the wavelength region 550-600 nm, with transmittance dropping to near zero below 450 nm and below 10% in the near-infrared spectral region. These characteristics are relevant in solar radiation control applications. The coated foils might also be used as conductive substrates for electrolytic deposition of metals and semiconductors and for optoelectronic device structures.

Magnetic Catheter Manipulation in the Interventional MRI Environment

PubMed Central

Wilson, Mark W.; Martin, Alastair B.; Lillaney, Prasheel; Losey, Aaron D.; Yee, Erin J.; Bernhardt, Anthony; Malba, Vincent; Evans, Lee; Sincic, Ryan; Saeed, Maythem; Arenson, Ronald L.; Hetts, Steven W.

2013-01-01

Purpose To evaluate deflection capability of a prototype endovascular catheter, which is remotely magnetically steerable, for use in the interventional MRI environment. Materials and Methods Copper coils were mounted on the tips of commercially available 2.3 – 3.0 Fr microcatheters. The coils were fabricated in a novel manner by plasma vapor deposition of a copper layer followed by laser lithography of the layer into coils. Orthogonal helical (solenoid) and saddle-shaped (Helmholtz) coils were mounted on a single catheter tip. Microcatheters were tested in water bath phantoms in a 1.5T clinical MRI scanner, with variable simultaneous currents applied to the coils. Catheter tip deflection was imaged in the axial plane utilizing a “real-time” steady-state free precession (SSFP) MRI sequence. Degree of deflection and catheter tip orientation were measured for each current application. Results The catheter tip was clearly visible in the longitudinal and axial planes. Magnetic field artifacts were visible when the orthogonal coils at the catheter tip were energized. Variable amounts of current applied to a single coil demonstrated consistent catheter deflection in all water bath experiments. Changing current polarity reversed the observed direction of deflection, whereas current applied to two different coils resulted in deflection represented by the composite vector of individual coil activations. Microcatheter navigation through the vascular phantom was successful through control of applied current to one or more coils. Conclusion Controlled catheter deflection is possible with laser lithographed multi-axis coil tipped catheters in the MRI environment. PMID:23707097

Structural, morphological, optical and electrical properties of Schottky diodes based on CBD deposited ZnO:Cu nanorods

NASA Astrophysics Data System (ADS)

Mwankemwa, Benard S.; Legodi, Matshisa J.; Mlambo, Mbuso; Nel, Jackie M.; Diale, Mmantsae

2017-07-01

Undoped and copper doped zinc oxide (ZnO) nanorods have been synthesized by a simple chemical bath deposition (CBD) method at a temperature of 90 °C. Structural, morphological, optical and electrical properties of the synthesized ZnO nanorods were found to be dependent on the Cu doping percentage. X-ray diffraction (XRD) patterns revealed strong diffraction peaks of hexagonal wurtzite of ZnO, and no impurity phases from metallic zinc or copper. Scanning electron microscopy (SEM) images showed changes in diameter and shape of nanorods, where by those doped with 2 at.% and 3 at.% aggregated and became compact. Selected area electron diffraction (SAED) patterns indicates high quality, single crystalline wurtzite structure ZnO and intensities of bright spots varied with copper doping concentration. UV-visible absorption peaks of ZnO red shifted with increasing copper doping concentration. Raman studies demonstrated among others, strong and sharp E2 (low) and E2 (high) optical phonon peaks confirming crystal structure of ZnO. Current-voltage measurements based on the gold/ZnO nanorods/ITO showed good rectifying behavior of the Schottky diode. The predicted Schottky barrier height of 0.60 eV was obtained which is not far from the theoretical Schottky-Mott value of 0.80 eV.

Electroplating of the superconductive boride MgB2 from molten salts

NASA Astrophysics Data System (ADS)

Abe, Hideki; Yoshii, Kenji; Nishida, Kenji; Imai, Motoharu; Kitazawa, Hideaki

2005-02-01

An electroplating technique of the superconductive boride MgB2 onto graphite substrates is reported. Films of MgB2 with a thickness of tens micrometer were fabricated on the planar and curved surfaces of graphite substrates by means of electrolysis on a mixture of magnesium chloride, potassium chloride, sodium chloride, and magnesium borate fused at 600 °C under an Ar atmosphere. The electrical resistivity and magnetization measurements revealed that the electroplated MgB2 films undergo a superconducting transition with the critical temperature (Tc) of 36 K.

Oxidation of hydroxylamine by cytochrome P-460 of the obligate methylotroph Methylococcus capsulatus Bath.

PubMed Central

Zahn, J A; Duncan, C; DiSpirito, A A

1994-01-01

An enzyme capable of the oxidation of hydroxylamine to nitrite was isolated from the obligate methylotroph Methylococcus capsulatus Bath. The absorption spectra in cell extracts, electron paramagnetic resonance spectra, molecular weight, covalent attachment of heme group to polypeptide, and enzymatic activities suggest that the enzyme is similar to cytochrome P-460, a novel iron-containing protein previously observed only in Nitrosomonas europaea. The native and subunit molecular masses of the M. capsulatus Bath protein were 38,900 and 16,390 Da, respectively; the isoelectric point was 6.98. The enzyme has approximately one iron and one copper atom per subunit. The electron paramagnetic resonance spectrum of the protein showed evidence for a high-spin ferric heme. In contrast to the enzyme from N. europaea, a 13-nm blue shift in the soret band of the ferrocytochrome (463 nm in cell extracts to 450 nm in the final sample) occurred during purification. The amino acid composition and N-terminal amino acid sequence of the enzyme from M. capsulatus Bath was similar but not identical to those of cytochrome P-460 of N. europaea. In cell extracts, the identity of the biological electron acceptor is as yet unestablished. Cytochrome c-555 is able to accept electrons from cytochrome P-460, although the purified enzyme required phenazine methosulfate for maximum hydroxylamine oxidation activity (specific activity, 366 mol of O2 per s per mol of enzyme). Hydroxylamine oxidation rates were stimulated approximately 2-fold by 1 mM cyanide and 1.5-fold by 0.1 mM 8-hydroxyquinoline. Images PMID:7928947

Strain relaxation in nm-thick Cu and Cu-alloy films bonded to a rigid substrate

NASA Astrophysics Data System (ADS)

Herrmann, Ashley Ann Elizabeth

In the wide scope of modern technology, nm-thick metallic films are increasingly used as lubrication layers, optical coatings, plating seeds, diffusion barriers, adhesion layers, metal contacts, reaction catalyzers, etc. A prominent example is the use of nm-thick Cu films as electroplating seed layers in the manufacturing of integrated circuits (ICs). These high density circuits are linked by on-chip copper interconnects, which are manufactured by filling Cu into narrow trenches by electroplating. The Cu fill by electroplating requires a thin Cu seed deposited onto high-aspect-ratio trenches. In modern ICs, these trenches are approaching 10 nm or less in width, and the seed layers less than 1 nm in thickness. Since nm-thick Cu seed layers are prone to agglomeration or delamination, achieving uniform, stable and highly-conductive ultra-thin seeds has become a major manufacturing challenge. A fundamental understanding of the strain behavior and thermal stability of nm-thick metal films adhered to a rigid substrate is thus critically needed. In this study, we focus on understanding the deformation modes of nm-thick Cu and Cu-alloy films bonded to a rigid Si substrate and under compressive stress. The strengthening of Cu films through alloying is also studied. In-situ transport measurements are used to monitor the deformation of such films as they are heated from room temperature to 400 °C. Ex-situ AFM is then used to help characterize the mode of strain relaxation. The relaxation modes are known to be sensitive to the wetting and adhesive properties of the film-substrate interface. We use four different liners (Ta, Ru, Mo and Co), interposed between the film and substrate to provide a wide range of interfacial properties to study their effect on the film's thermal stability. Our measurements indicate that when the film/liner interfacial energy is low, grain growth is the dominant relaxation mechanism. As the interface energy increases, grain growth is suppressed, and the strain is relaxed through hillock/island formation instead. The kinetics-limiting parameters for these relaxation modes are identified and used to simulate their kinetics, and a deformation map is then constructed to delineate the conditions under which each mode would prevail. Such a deformation map would prove useful when one seeks to optimize the thermal stability or other mechanical properties in any ultra-thin film system.

Exploring the life cycle management of industrial solid waste in the case of copper slag.

PubMed

Song, Xiaolong; Yang, Jianxin; Lu, Bin; Li, Bo

2013-06-01

Industrial solid waste has potential impacts on soil, water and air quality, as well as human health, during its whole life stages. A framework for the life cycle management of industrial solid waste, which integrates the source reduction process, is presented and applied to copper slag management. Three management scenarios of copper slag are developed: (i) production of cement after electric furnace treatment, (ii) production of cement after flotation, and (iii) source reduction before the recycling process. A life cycle assessment is carried out to estimate the environmental burdens of these three scenarios. Life cycle assessment results showed that the environmental burdens of the three scenarios are 2710.09, 2061.19 and 2145.02 Pt respectively. In consideration of the closed-loop recycling process, the environmental performance of the flotation approach excelled that of the electric furnace approach. Additionally, although flash smelting promotes the source reduction of copper slag compared with bath smelting, it did not reduce the overall environmental burdens resulting from the complete copper slag management process. Moreover, it led to the shifting of environmental burdens from ecosystem quality damage and resources depletion to human health damage. The case study shows that it is necessary to integrate the generation process into the whole life cycle of industrial solid waste, and to make an integrated assessment for quantifying the contribution of source reduction, rather than to simply follow the priority of source reduction and the hierarchy of waste management.

Literature review on pickling inhibitors and cadmium electroplating processes

NASA Technical Reports Server (NTRS)

Elsea, A. R.; Fletcher, E. E.; Groeneveld, T. P.

1969-01-01

Because introduction of hydrogen during bright-cadmium electroplating of high strength steels causes hydrogen-stress cracking, a program was undertaken to evaluate various processes and materials. Report describes effectiveness of inhibitors for reducing hydrogen absorption by steels.

EVALUATION OF THE ELECTRO-PL AND ELECTROKLEAN DUST COLLECTORS

DOE Office of Scientific and Technical Information (OSTI.GOV)

Dennis, R.; Kristal, E.; Silverman, L.

1958-07-21

Results are presented from performance tests on the Electro-PL and Electro-Klean air cleaning devices. Both devices were tested for moderate cleaning of low loadings such as those encountered in the atmospheric dust range. (C.H.)

Status of CdS/CdTe solar cell research at NREL

NASA Astrophysics Data System (ADS)

Ramanathan, K.; Dhere, R. G.; Coutts, T. J.; Chu, T.; Chu, S.

1992-12-01

We report on the deposition of thin cadmium sulfide (CdS) layers from aqueous solutions and their optical properties. CdS layers have been deposited on soda lime glass, tin oxide coated glass and copper indium diselenide (CuInSe2) thin films. A systematic increase in the absorption is found to occur with increasing concentration of the buffer salt used in the bath. CdS/CdTe thin film solar cells have been fabricated by close spaced sublimation of CdTe, yielding 11.3% devices.

Electroplating and Cyanide Waste.

ERIC Educational Resources Information Center

Torpy, Michael F.; Runke, Henry M.

1978-01-01

Presents a literature review of wastes from electroplating industry, covering publications of 1977. This review covers studies such as: (1) ion exchange treatment process; (2) use of reverse osmosis; and (3) cyanide removal and detection. A list of 75 references is also presented. (HM)

Fixture for multiple-FCC chemical stripping and plating

NASA Technical Reports Server (NTRS)

Angele, W.; Norton, W. E.

1971-01-01

For chemical stripping, lead tape applied near ends to be stripped protects insulation. Taped ends are submerged half way in stripping solution. For electroplating, both ends of FCC are stripped - top ends for electric contact, others for submersion in electroplating solution.

ENVIRONMENTAL REGULATIONS AND TECHNOLOGY - THE ELECTROPLATING INDUSTRY

EPA Science Inventory

This 44-page Technology Transfer Environmental Regulations and Technology publication is an update of a 1980 EPA publication that has been revised to reflect changes in the EPA regulations, as well as in the pollution control technologies that affect the electroplating industry. ...

Apparatus for electroplating particles of small dimension

DOEpatents

Yu, C.M.; Illige, J.D.

1980-09-19

The thickness, uniformity, and surface smoothness requirements for surface coatings of glass microspheres for use as targets for laser fusion research are critical. Because of thier minute size, the microspheres are difficult to manipulate and control in electroplating systems. The electroplating apparatus of the present invention addresses these problems by providing a cathode cell having a cell chamber, a cathode and an anode electrically isolated from each other and connected to an electrical power source. During the plating process, the cathode is controllably vibrated along with solution pulse to maintain the particles in random free motion so as to attain the desired properties.

Electroplating lithium transition metal oxides.

PubMed

Zhang, Huigang; Ning, Hailong; Busbee, John; Shen, Zihan; Kiggins, Chadd; Hua, Yuyan; Eaves, Janna; Davis, Jerome; Shi, Tan; Shao, Yu-Tsun; Zuo, Jian-Min; Hong, Xuhao; Chan, Yanbin; Wang, Shuangbao; Wang, Peng; Sun, Pengcheng; Xu, Sheng; Liu, Jinyun; Braun, Paul V

2017-05-01

Materials synthesis often provides opportunities for innovation. We demonstrate a general low-temperature (260°C) molten salt electrodeposition approach to directly electroplate the important lithium-ion (Li-ion) battery cathode materials LiCoO 2 , LiMn 2 O 4 , and Al-doped LiCoO 2 . The crystallinities and electrochemical capacities of the electroplated oxides are comparable to those of the powders synthesized at much higher temperatures (700° to 1000°C). This new growth method significantly broadens the scope of battery form factors and functionalities, enabling a variety of highly desirable battery properties, including high energy, high power, and unprecedented electrode flexibility.

Development of non-flammable lithium secondary battery with room-temperature ionic liquid electrolyte: Performance of electroplated Al film negative electrode

NASA Astrophysics Data System (ADS)

Ui, Koichi; Yamamoto, Keigo; Ishikawa, Kohei; Minami, Takuto; Takeuchi, Ken; Itagaki, Masayuki; Watanabe, Kunihiro; Koura, Nobuyuki

The negative electrode performance of the electroplated Al film electrode in the LiCl saturated AlCl 3-1-ethyl-3-methylimizadolium chloride (EMIC) + SOCl 2 melt as the electrolyte for use in non-flammable lithium secondary batteries was evaluated. In the cyclic voltammogram of the electroplated Al film electrode in the melt, the oxidation and reduction waves corresponding to the electrochemical insertion/extraction reactions of the Li + ion were observed at 0-0.80 V vs. Li +/Li, which suggested that the electroplated Al film electrode operated well in the electrolyte. The almost flat potential profiles at about 0.40 V vs. Li +/Li on discharging were shown. The discharge capacity and charge-discharge efficiency was 236 mAh g -1 and 79.2% for the 1st cycle and it maintained 232 mAh g -1 and 77.9% after the 10th cycle. In addition, the initial charge-discharge efficiencies of the electroplated Al film electrode were higher than that of carbon electrodes. The main cathodic polarization reaction was the insertion of Li + ions, and side reactions hardly occurred due to the decomposition reaction of the melt because the Li content corresponding to the electricity was almost totally inserted into the film after charging.

Cirrus Dopant Nano-Composite Coatings

DTIC Science & Technology

2014-11-01

100 200 300 400 500 600 HARDNESS (HV) MICROHARDNESS - ELECTROPLATED NICKEL STANDARD DC PLATED DOPED DC PLATED DOPED PULSE PLATED ↑48% 10...STANDARD COATING HARDNESS (HV) DOPED COATING MICROHARDNESS - ELECTROPLATED ZN NI ↑32% DC ZnNi Cirrus ZnNi Current Test Applications cirrus nano

RECYCLING NICKEL ELECTROPLATING RINSE WATERS BY LOW TEMPERATURE EVAPORATION AND REVERSE OSMOSIS

EPA Science Inventory

Low temperature evaporation and reverse osmosis systems were each evaluated (on a pilot scale) on their respective ability to process rinse water collected from a nickel electroplating operation. Each system offered advantages under specific operating conditions. The low temperat...

Magnetic catheter manipulation in the interventional MR imaging environment.

PubMed

Wilson, Mark W; Martin, Alastair B; Lillaney, Prasheel; Losey, Aaron D; Yee, Erin J; Bernhardt, Anthony; Malba, Vincent; Evans, Lee; Sincic, Ryan; Saeed, Maythem; Arenson, Ronald L; Hetts, Steven W

2013-06-01

To evaluate deflection capability of a prototype endovascular catheter, which is remotely magnetically steerable, for use in the interventional magnetic resonance (MR) imaging environment. Copper coils were mounted on the tips of commercially available 2.3-3.0-F microcatheters. The coils were fabricated in a novel manner by plasma vapor deposition of a copper layer followed by laser lithography of the layer into coils. Orthogonal helical (ie, solenoid) and saddle-shaped (ie, Helmholtz) coils were mounted on a single catheter tip. Microcatheters were tested in water bath phantoms in a 1.5-T clinical MR scanner, with variable simultaneous currents applied to the coils. Catheter tip deflection was imaged in the axial plane by using a "real-time" steady-state free precession MR imaging sequence. Degree of deflection and catheter tip orientation were measured for each current application. The catheter tip was clearly visible in the longitudinal and axial planes. Magnetic field artifacts were visible when the orthogonal coils at the catheter tip were energized. Variable amounts of current applied to a single coil demonstrated consistent catheter deflection in all water bath experiments. Changing current polarity reversed the observed direction of deflection, whereas current applied to two different coils resulted in deflection represented by the composite vector of individual coil activations. Microcatheter navigation through the vascular phantom was successful through control of applied current to one or more coils. Controlled catheter deflection is possible with laser lithographed multiaxis coil-tipped catheters in the MR imaging environment. Copyright © 2013 SIR. Published by Elsevier Inc. All rights reserved.

INTELLIGENT DECISION SUPPORT FOR WASTE MINIMIZATION IN ELECTROPLATING PLANTS. (R824732)

EPA Science Inventory

Abstract

Wastewater, spent solvent, spent process solutions, and sludge are the major waste streams generated in large volumes daily in electroplating plants. These waste streams can be significantly minimized through process modification and operational improvement. I...

40 CFR 63.344 - Performance test requirements and test methods.

Code of Federal Regulations, 2014 CFR

2014-07-01

... blanket type fume suppressants are used to control chromium emissions from a hard chromium electroplating... National Emission Standards for Chromium Emissions From Hard and Decorative Chromium Electroplating and Chromium Anodizing Tanks § 63.344 Performance test requirements and test methods. (a) Performance test...

40 CFR 63.344 - Performance test requirements and test methods.

Code of Federal Regulations, 2012 CFR

2012-07-01

... blanket type fume suppressants are used to control chromium emissions from a hard chromium electroplating... National Emission Standards for Chromium Emissions From Hard and Decorative Chromium Electroplating and Chromium Anodizing Tanks § 63.344 Performance test requirements and test methods. (a) Performance test...

40 CFR 63.346 - Recordkeeping requirements.

Code of Federal Regulations, 2014 CFR

2014-07-01

... Standards for Chromium Emissions From Hard and Decorative Chromium Electroplating and Chromium Anodizing... rectifier capacity of hard chromium electroplating tanks at a facility expended during each month of the....342(c)(2); (13) For sources using fume suppressants to comply with the standards, records of the date...

40 CFR 63.346 - Recordkeeping requirements.

Code of Federal Regulations, 2010 CFR

2010-07-01

... Standards for Chromium Emissions From Hard and Decorative Chromium Electroplating and Chromium Anodizing...) Records of the actual cumulative rectifier capacity of hard chromium electroplating tanks at a facility... size in accordance with § 63.342(c)(2); (13) For sources using fume suppressants to comply with the...

40 CFR 63.346 - Recordkeeping requirements.

Code of Federal Regulations, 2013 CFR

2013-07-01

... Standards for Chromium Emissions From Hard and Decorative Chromium Electroplating and Chromium Anodizing... rectifier capacity of hard chromium electroplating tanks at a facility expended during each month of the....342(c)(2); (13) For sources using fume suppressants to comply with the standards, records of the date...

40 CFR 63.346 - Recordkeeping requirements.

Code of Federal Regulations, 2012 CFR

2012-07-01

... Standards for Chromium Emissions From Hard and Decorative Chromium Electroplating and Chromium Anodizing...) Records of the actual cumulative rectifier capacity of hard chromium electroplating tanks at a facility... size in accordance with § 63.342(c)(2); (13) For sources using fume suppressants to comply with the...

40 CFR 63.344 - Performance test requirements and test methods.

Code of Federal Regulations, 2013 CFR

2013-07-01

... blanket type fume suppressants are used to control chromium emissions from a hard chromium electroplating... National Emission Standards for Chromium Emissions From Hard and Decorative Chromium Electroplating and Chromium Anodizing Tanks § 63.344 Performance test requirements and test methods. (a) Performance test...

40 CFR 63.346 - Recordkeeping requirements.

Code of Federal Regulations, 2011 CFR

2011-07-01

... Standards for Chromium Emissions From Hard and Decorative Chromium Electroplating and Chromium Anodizing...) Records of the actual cumulative rectifier capacity of hard chromium electroplating tanks at a facility... size in accordance with § 63.342(c)(2); (13) For sources using fume suppressants to comply with the...

Work Environment Factors and Their Influence on Urinary Chromium Levels in Informal Electroplating Workers

NASA Astrophysics Data System (ADS)

Setyaningsih, Yuliani; Husodo, Adi Heru; Astuti, Indwiani

2018-02-01

One of the informal sector which absorbs labor was electroplating business. This sector uses chromium as coating material because it was strong, corrosion resistant and strong. Nonetheless hexavalent chromium is highly toxic if inhaled, swallowed and contact with skin. Poor hygiene, the lack of work environment factors and sanitation conditions can increase the levels of chromium in the body. This aimed of this study was to analyze the association between work environment factors and levels of urinary chromium in informal electroplating worker. A Purposive study was conducted in Tegal Central Java. The research subjects were 66 male workers. Chi Square analysis was used to establish an association between work environment factors and level of urinary chromium. There is a relationship between heat stress and wind direction to the chromium levels in urine (p <0.05), but there is no relationship between humidity and levels of chromium in the urine (p> 0.05). This explains that work environment factors can increase chromium levels in the urine of informal electroplating workers.

Preparation of nano fluids by mechanical method

NASA Astrophysics Data System (ADS)

Boopathy, J.; Pari, R.; Kavitha, M.; Angelo, P. C.

2012-07-01

Nanofluids are conventional heat transfer fluids that contain nano particles of metals, oxides, carbides, nitrides, or nanotubes. Nanofluids exhibit enhanced thermal conductivity and heat transfer coefficients compared to the base fluids. This paper presents the procedure for preparing nanofluids consisting of Copper and Aluminium nano powders in base fluids. Copper and Aluminium nano powders were produced by planetary ball wet milling at 300rpm for 50hrs. Toluene was added to ensure wet milling. These powders were characterized in XRD and SEM for their purity, particle size and shape. The XRD results confirmed the final particle sizes of Copper and Aluminium in the nano range. Then the 0.01 gm of nano metal powders was added in 150 ml of double distilled water and magnetic stirring was done at 1500 rpm for 15 minutes. Sodium lauryl sulphate (0.05%) was added in water as surfactant to ensure the stability of the dispersion. Ultrasonication in the 3000 watts bath was done for 10 minutes to enhance the uniform dispersion of metal powders in water. The pH, dynamic viscosity, ionic conductivity and the stability of the fluids were determined for further usage of synthesized nanofluids as coolant during grinding operation.

Acoustically Enhanced Electroplating Being Developed

NASA Technical Reports Server (NTRS)

Oeftering, Richard C.

2002-01-01

In cooperation with the NASA Glenn Research Center, Alchemitron Corp. is developing the Acoustically Enhanced Electroplating Process (AEEP), a new technique of employing nonlinear ultrasonics to enhance electroplating. The applications range from electroplating full-panel electronic circuit boards to electroplating microelectronics and microelectromechanical systems (MEMS) devices. In a conventional plating process, the surface area to be plated is separated from the nonplated areas by a temporary mask. The mask may take many forms, from a cured liquid coating to a simple tape. Generally, the mask is discarded when the plating is complete, creating a solid waste product that is often an environmental hazard. The labor and materials involved with the layout, fabrication, and tooling of masks is a primary source of recurring and nonrecurring production costs. The objective of this joint effort, therefore, is to reduce or eliminate the need for masks. AEEP improves selective plating processes by using directed beams of high-intensity acoustic waves to create nonlinear effects that alter the fluid dynamic and thermodynamic behavior of the plating process. It relies on two effects: acoustic streaming and acoustic heating. Acoustic streaming is observed when a high-intensity acoustic beam creates a liquid current within the beam. The liquid current can be directed as the beam is directed and, thus, users can move liquid around as desired without using pumps and nozzles. The current of the electroplating electrolyte, therefore, can be directed at distinct target areas where electroplating is desired. The current delivers fresh electrolyte to the target area while flushing away the spent electrolyte. This dramatically increases the plating rate in the target area. In addition, acoustic heating of both the liquid in the beam and the target surface increases the chemical reaction rate, which further increases the plating rate. The combined effects of acoustic streaming and heating accelerate the deposition of plating in that area and, thus, provide an effect similar to a mask but without the costs of masking. AEEP further improves the plating process by clearing debris and bubbles from the surface by acoustic radiation pressure and acoustic streaming.

Non-permeable substrate carrier for electroplating

DOEpatents

Abas, Emmanuel Chua; Chen, Chen-An; Ma, Diana Xiaobing; Ganti, Kalyana Bhargava

2012-11-27

One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The substrate carrier comprises a non-conductive carrier body on which the substrates are to be held. Electrically-conductive lines are embedded within the carrier body, and a plurality of contact clips are coupled to the electrically-conductive lines embedded within the carrier body. The contact clips hold the substrates in place and electrically couple the substrates to the electrically-conductive lines. The non-conductive carrier body is continuous so as to be impermeable to flow of electroplating solution through the non-conductive carrier body. Other embodiments, aspects and features are also disclosed.

Electrochemical formation of field emitters

DOEpatents

Bernhardt, Anthony F.

1999-01-01

Electrochemical formation of field emitters, particularly useful in the fabrication of flat panel displays. The fabrication involves field emitting points in a gated field emitter structure. Metal field emitters are formed by electroplating and the shape of the formed emitter is controlled by the potential imposed on the gate as well as on a separate counter electrode. This allows sharp emitters to be formed in a more inexpensive and manufacturable process than vacuum deposition processes used at present. The fabrication process involves etching of the gate metal and the dielectric layer down to the resistor layer, and then electroplating the etched area and forming an electroplated emitter point in the etched area.

Apparatus for electroplating particles of small dimension

DOEpatents

Yu, Conrad M.; Illige, John D.

1982-01-01

The thickness, uniformity, and surface smoothness requirements for surface coatings of glass microspheres for use as targets for laser fusion research are critical. Because of their minute size, the microspheres are difficult to manipulate and control in electroplating systems. The electroplating apparatus (10) of the present invention addresses these problems by providing a cathode cell (20) having a cell chamber (22), a cathode (23) and an anode (26) electrically isolated from each other and connected to an electrical power source (24). During the plating process, the cathode (23) is controllably vibrated along with solution pulse to maintain the particles in random free motion so as to attain the desired properties.

Non-permeable substrate carrier for electroplating

DOEpatents

Abas, Emmanuel Chua; Chen, Chen-an; Ma, Diana Xiaobing; Ganti, Kalyana; Divino, Edmundo Anida; Ermita, Jake Randal G.; Capulong, Jose Francisco S.; Castillo, Arnold Villamor

2015-12-29

One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The substrate carrier comprises a non-conductive carrier body on which the substrates are to be held. Electrically-conductive lines are embedded within the carrier body, and a plurality of contact clips are coupled to the electrically-conductive lines embedded within the carrier body. The contact clips hold the substrates in place and electrically couple the substrates to the electrically-conductive lines. The non-conductive carrier body is continuous so as to be impermeable to flow of electroplating solution through the non-conductive carrier body. Other embodiments, aspects and features are also disclosed.

Electroplating lithium transition metal oxides

PubMed Central

Zhang, Huigang; Ning, Hailong; Busbee, John; Shen, Zihan; Kiggins, Chadd; Hua, Yuyan; Eaves, Janna; Davis, Jerome; Shi, Tan; Shao, Yu-Tsun; Zuo, Jian-Min; Hong, Xuhao; Chan, Yanbin; Wang, Shuangbao; Wang, Peng; Sun, Pengcheng; Xu, Sheng; Liu, Jinyun; Braun, Paul V.

2017-01-01

Materials synthesis often provides opportunities for innovation. We demonstrate a general low-temperature (260°C) molten salt electrodeposition approach to directly electroplate the important lithium-ion (Li-ion) battery cathode materials LiCoO2, LiMn2O4, and Al-doped LiCoO2. The crystallinities and electrochemical capacities of the electroplated oxides are comparable to those of the powders synthesized at much higher temperatures (700° to 1000°C). This new growth method significantly broadens the scope of battery form factors and functionalities, enabling a variety of highly desirable battery properties, including high energy, high power, and unprecedented electrode flexibility. PMID:28508061

40 CFR 413.22-413.23 - [Reserved

Code of Federal Regulations, 2010 CFR

2010-07-01

... 40 Protection of Environment 28 2010-07-01 2010-07-01 true [Reserved] 413.22-413.23 Section 413.22-413.23 Protection of Environment ENVIRONMENTAL PROTECTION AGENCY (CONTINUED) EFFLUENT GUIDELINES AND STANDARDS ELECTROPLATING POINT SOURCE CATEGORY Electroplating of Precious Metals Subcategory §§ 413.22-413...

40 CFR 413.12-413.13 - [Reserved

Code of Federal Regulations, 2010 CFR

2010-07-01

... 40 Protection of Environment 28 2010-07-01 2010-07-01 true [Reserved] 413.12-413.13 Section 413.12-413.13 Protection of Environment ENVIRONMENTAL PROTECTION AGENCY (CONTINUED) EFFLUENT GUIDELINES AND STANDARDS ELECTROPLATING POINT SOURCE CATEGORY Electroplating of Common Metals Subcategory §§ 413.12-413.13...

40 CFR 63.340 - Applicability and designation of sources.

Code of Federal Regulations, 2011 CFR

2011-07-01

... National Emission Standards for Chromium Emissions From Hard and Decorative Chromium Electroplating and Chromium Anodizing Tanks § 63.340 Applicability and designation of sources. (a) The affected source to which the provisions of this subpart apply is each chromium electroplating or chromium anodizing tank at...

40 CFR 63.340 - Applicability and designation of sources.

Code of Federal Regulations, 2010 CFR

2010-07-01

... National Emission Standards for Chromium Emissions From Hard and Decorative Chromium Electroplating and Chromium Anodizing Tanks § 63.340 Applicability and designation of sources. (a) The affected source to which the provisions of this subpart apply is each chromium electroplating or chromium anodizing tank at...

Impact of industrial effluents on the biochemical composition of fresh water fish Labeo rohita.

PubMed

Muley, D V; Karanjkar, D M; Maske, S V

2007-04-01

In acute toxicity (96 hr) experiment the fingerlings of freshwater fish Labeo rohita was exposed to tannery, electroplating and textile mill effluents. The LC0 and LC50 concentrations were 15% and 20% for tannery effluents, 3% and 6% for electroplating effluents and 18% and 22% for textile mill effluents respectively. It was found that, electroplating effluent was more toxic than tannery and textile mill wastes. After acute toxicity experiments for different industrial effluents, various tissues viz. gill, liver, muscle and kidney were obtained separately from control, LC0 and LC50 groups. These tissues were used for biochemical estimations. The glycogen content in all the tissues decreased considerably upon acute toxicity of three industrial effluents except muscle in LC50 group of tannery effluent and kidney in LC50 group of textile mill effluent, when compared to control group. The total protein content decreased in all tissues in three effluents except gills in LC50 group of tannery effluent, kidney in LC50 group of electroplating effluent and kidney in LC0 group of textile mill effluent. In general total lipid content decreased in all tissues after acute exposure when compared to control group. The results obtained in the present study showed that, the industrial effluents from tannery, electroplating and textile mills caused marked depletion in biochemical composition in various tissues of the fish Labeo rohita after acute exposure.

Air Pollution Potential from Electroplating Operations.

ERIC Educational Resources Information Center

Diamond, Philip

Measurements were made of emission rates from electroplating operations considered to have maximum air pollution potential. Sampling was performed at McClellan and additional data from a previous survey at Hill Air Force Base was used. Values obtained were extremely low. Based on existing Federal standards, no collectors are specifically required…

Metalizing Solar Cells by Selective Electroplating

NASA Technical Reports Server (NTRS)

Dutta, S.; Palaschak, P. A.

1986-01-01

Contact patterns traced by laser scanning. Conductor paths deposited on silicon solar-cell wafers by laser irradiation followed by electroplating. Laser-assisted metalization technique offers better resolution and lower contact resistance than does conventional metalization by screen printing. At the same time, less expensive than metalization with masks and photolithography.

40 CFR 63.345 - Provisions for new and reconstructed sources.

Code of Federal Regulations, 2010 CFR

2010-07-01

... electroplating, or chromium anodizing); (viii) A description of the air pollution control technique to be used to... National Emission Standards for Chromium Emissions From Hard and Decorative Chromium Electroplating and Chromium Anodizing Tanks § 63.345 Provisions for new and reconstructed sources. (a) This section identifies...

40 CFR 63.345 - Provisions for new and reconstructed sources.

Code of Federal Regulations, 2011 CFR

2011-07-01

... electroplating, or chromium anodizing); (viii) A description of the air pollution control technique to be used to... National Emission Standards for Chromium Emissions From Hard and Decorative Chromium Electroplating and Chromium Anodizing Tanks § 63.345 Provisions for new and reconstructed sources. (a) This section identifies...

40 CFR 413.20 - Applicability: Description of the electroplating of precious metals subcategory.

Code of Federal Regulations, 2010 CFR

2010-07-01

... resulting from the process in which a ferrous or nonferrous basis material is plated with gold, silver... 40 Protection of Environment 28 2010-07-01 2010-07-01 true Applicability: Description of the... PROTECTION AGENCY (CONTINUED) EFFLUENT GUIDELINES AND STANDARDS ELECTROPLATING POINT SOURCE CATEGORY...

PHYSICAL VAPOR DEPOSITION OF TANTALUM ON GUN BARREL STEEL (SYSTEMS ANLAYSIS BRANCH, SUSTAINABLE TECHNOLOGY DIVISION, NRMRL)

EPA Science Inventory

This project entails the development of an alternative technology for plating gun barrel steel to replace the process electroplating of chrome (Cr-electroplate) with physical vapor deposition of tantalum (Ta-PVD). Developed by Benet Laboratory at Watervliet Arsenal, this project'...

Helium Ion Beam Microscopy for Copper Grain Identification in BEOL Structures

NASA Astrophysics Data System (ADS)

van den Boom, Ruud J. J.; Parvaneh, Hamed; Voci, Dave; Huynh, Chuong; Stern, Lewis; Dunn, Kathleen A.; Lifshin, Eric

2009-09-01

Grain size determination in advanced metallization structures requires a technique with resolution ˜2 nm, with a high signal-to-noise ratio and high orientation-dependant contrast for unambiguous identification of grain boundaries. Ideally, such a technique would also be capable of high-throughput and rapid time-to-knowledge. The Helium Ion Microscope (HIM) offers one possibility for achieving these aims in a single platform. This article compares the performance of the HIM with Focused Ion Beam, Scanning Electron and Transmission Electron Microscopes, in terms of achievable image resolution and contrast, using plan-view and cross-sectional imaging of electroplated samples. Although the HIM is capable of sub-nanometer beam diameter, the low signal-to-noise ratio in the images necessitates signal averaging, which degrades the measured image resolution to 6-8 nm. Strategies for improving S/N are discussed in light of the trade-off between beam current and probe size, accelerating voltage, and dwell time.

Stress-driven lithium dendrite growth mechanism and dendrite mitigation by electroplating on soft substrates

NASA Astrophysics Data System (ADS)

Wang, Xu; Zeng, Wei; Hong, Liang; Xu, Wenwen; Yang, Haokai; Wang, Fan; Duan, Huigao; Tang, Ming; Jiang, Hanqing

2018-03-01

Problems related to dendrite growth on lithium-metal anodes such as capacity loss and short circuit present major barriers to next-generation high-energy-density batteries. The development of successful lithium dendrite mitigation strategies is impeded by an incomplete understanding of the Li dendrite growth mechanisms, and in particular, Li-plating-induced internal stress in Li metal and its effect on Li growth morphology are not well addressed. Here, we reveal the enabling role of plating residual stress in dendrite formation through depositing Li on soft substrates and a stress-driven dendrite growth model. We show that dendrite growth is mitigated on such soft substrates through surface-wrinkling-induced stress relaxation in the deposited Li film. We demonstrate that this dendrite mitigation mechanism can be utilized synergistically with other existing approaches in the form of three-dimensional soft scaffolds for Li plating, which achieves higher coulombic efficiency and better capacity retention than that for conventional copper substrates.

Processing industrial wastes with the liquid-phase reduction romelt process

NASA Astrophysics Data System (ADS)

Romenets, V.; Valavin, V.; Pokhvisnev, Yu.; Vandariev, S.

1999-08-01

The Romelt technology for liquid-phase reduction has been developed for processing metallurgical wastes containing nonferrousmetal components. Thermodynamic calculations were made to investigate the behavior of silver, copper, zinc, manganese, vanadium, chrome, and silicon when reduced from the slag melt into the metallic solution containing iron. The process can be applied to all types of iron-bearing wastes, including electric arc furnace dust. The distribution of elements between the phases can be controlled by adjusting the slag bath temperature. Experiments at a pilot Romelt plant proved the possibility of recovering the metallurgical wastes and obtaining iron.

Electrochemical formation of field emitters

DOEpatents

Bernhardt, A.F.

1999-03-16

Electrochemical formation of field emitters, particularly useful in the fabrication of flat panel displays is disclosed. The fabrication involves field emitting points in a gated field emitter structure. Metal field emitters are formed by electroplating and the shape of the formed emitter is controlled by the potential imposed on the gate as well as on a separate counter electrode. This allows sharp emitters to be formed in a more inexpensive and manufacturable process than vacuum deposition processes used at present. The fabrication process involves etching of the gate metal and the dielectric layer down to the resistor layer, and then electroplating the etched area and forming an electroplated emitter point in the etched area. 12 figs.

SITE CHARACTERIZATION OF A CHROMIUM SOURCE AREA AT THE USCG SUPPORT CENTER, ELIZABETH CITY, NC

EPA Science Inventory

The chrome source area is located beneath an old electroplating shop at the United States Coast Guard Support Center near Elizabeth City, NC . This electroplating shop was in
use for approximately 30 years until 1984 and was the source of discharges of chromic and sulfuric...

76 FR 35744 - Amendments to National Emission Standards for Hazardous Air Pollutants for Area Sources: Plating...

Federal Register 2010, 2011, 2012, 2013, 2014

2011-06-20

.... Regulated sources do not include chromium electroplating and chromium anodizing sources, as those sources are subject to 40 CFR part 63, subpart N, ``Chromium Emissions From Hard and Decorative Chromium Electroplating and Chromium Anodizing Tanks.'' Manufacturing 32, 33 Area source establishments engaged in one or...

Extracellular synthesis and characterization of nickel oxide nanoparticles from Microbacterium sp. MRS-1 towards bioremediation of nickel electroplating industrial effluent.

PubMed

Sathyavathi, S; Manjula, A; Rajendhran, J; Gunasekaran, P

2014-08-01

In the present study, a nickel resistant bacterium MRS-1 was isolated from nickel electroplating industrial effluent, capable of converting soluble NiSO4 into insoluble NiO nanoparticles and identified as Microbacterium sp. The formation of NiO nanoparticles in the form of pale green powder was observed on the bottom of the flask upon prolonged incubation of liquid nutrient medium containing high concentration of 2000ppm NiSO4. The properties of the produced NiO nanoparticles were characterized. NiO nanoparticles exhibited a maximum absorbance at 400nm. The NiO nanoparticles were 100-500nm in size with unique flower like structure. The elemental composition of the NiO nanoparticles was 44:39. The cells of MRS-1 were utilized for the treatment of nickel electroplating industrial effluent and showed nickel removal efficiency of 95%. Application of Microbacterium sp. MRS-1 would be a potential bacterium for bioremediation of nickel electroplating industrial waste water and simultaneous synthesis of NiO nanoparticles. Copyright © 2014 Elsevier Ltd. All rights reserved.

Complete Prevention of Dendrite Formation in Zn Metal Anodes by Means of Pulsed Charging Protocols.

PubMed

Garcia, Grecia; Ventosa, Edgar; Schuhmann, Wolfgang

2017-06-07

Zn metal as anode in rechargeable batteries, such as Zn/air or Zn/Ni, suffers from poor cyclability. The formation of Zn dendrites upon cycling is the key limiting step. We report a systematic study of the influence of pulsed electroplating protocols on the formation of Zn dendrites and in turn on strategies to completely prevent Zn dendrite formation. Because of the large number of variables in electroplating protocols, a scanning droplet cell technique was adapted as a high-throughput methodology in which a descriptor of the surface roughness can be in situ derived by means of electrochemical impedance spectroscopy. Upon optimizing the electroplating protocol by controlling nucleation, zincate ion depletion, and zincate ion diffusion, scanning electron microscopy and atomic force microscopy confirmed the growth of uniform and homogenous Zn deposits with a complete prevention of dendrite growth. The implementation of pulsed electroplating as the charging protocol for commercially available Ni-Zn batteries leads to substantially prolonged cyclability demonstrating the benefits of pulsed charging in Zn metal-based batteries.

A Black Phosphate Conversion Coating on Steel Surface Using Antimony(III)-Tartrate as an Additive

NASA Astrophysics Data System (ADS)

Li, Feng; Wang, Guiping

2016-05-01

A novel black phosphate conversion coating was formed on steel surface through a Zn-Mn phosphating bath containing mainly ZnO, H3PO4, Mn(H2PO4)2, and Ca(NO3)2, where antimony(III)-tartrate was used as the blackening agent of phosphatization. The surface morphology and composition of the coating were characterized by scanning electron microscopy, energy dispersion spectroscopy, and x-ray photoelectron spectroscopy. Corrosion resistance of the coating was studied by potentiodynamic polarization curves and electrochemical impedance spectroscopy. The pH value of the solution had significant influence on the formation and corrosion resistance of the coating. The experimental results indicated that the Sb plays a vital role in the blackening of phosphate conversion coating. The optimal concentration of antimony(III)-tartrate in the phosphating bath used in this experiment was 1.0 g L-1, as higher values reduced the corrosion resistance of the coating. In addition, by saponification and oil seals, the corrosion duration of the black phosphate coating in a copper sulfate spot test can be as long as 20 min.

Survival of the faucet snail after chemical disinfection, pH extremes, and heated water bath treatments

USGS Publications Warehouse

Mitchell, A.J.; Cole, Rebecca A.

2008-01-01

The faucet snail Bithynia tentaculata, a nonindigenous aquatic snail from Eurasia, was introduced into Lake Michigan in 1871 and has spread to the mid-Atlantic states, the Great Lakes region, Montana, and most recently, the Mississippi River. The faucet snail serves as intermediate host for several trematodes that have caused large-scale mortality among water birds, primarily in the Great Lakes region and Montana. It is important to limit the spread of the faucet snail; small fisheries equipment can serve as a method of snail distribution. Treatments with chemical disinfection, pH extremes, and heated water baths were tested to determine their effectiveness as a disinfectant for small fisheries equipment. Two treatments eliminated all test snails: (1) a 24-h exposure to Hydrothol 191 at a concentration of at least 20 mg/L and (2) a treatment with 50°C heated water for 1 min or longer. Faucet snails were highly resistant to ethanol, NaCl, formalin, Lysol, potassium permanganate, copper sulfate, Baquacil, Virkon, household bleach, and pH extremes (as low as 1 and as high as 13).

A Green Microbial Fuel Cell-Based Biosensor for In Situ Chromium (VI) Measurement in Electroplating Wastewater.

PubMed

Wu, Li-Chun; Tsai, Teh-Hua; Liu, Man-Hai; Kuo, Jui-Ling; Chang, Yung-Chu; Chung, Ying-Chien

2017-10-27

The extensive use of Cr(VI) in many industries and the disposal of Cr(VI)-containing wastes have resulted in Cr(VI)-induced environmental contamination. Cr(VI) compounds are associated with increased cancer risks; hence, the detection of toxic Cr(VI) compounds is crucial. Various methods have been developed for Cr(VI) measurement, but they are often conducted offsite and cannot provide real-time toxicity monitoring. A microbial fuel cell (MFC) is an eco-friendly and self-sustaining device that has great potential as a biosensor for in situ Cr(VI) measurement, especially for wastewater generated from different electroplating units. In this study, Exiguobacterium aestuarii YC211, a facultatively anaerobic, Cr(VI)-reducing, salt-tolerant, and exoelectrogenic bacterium, was isolated and inoculated into an MFC to evaluate its feasibility as a Cr(VI) biosensor. The Cr(VI) removal efficiency of E. aestuarii YC211 was not affected by the surrounding environment (pH 5-9, 20-35 °C, coexisting ions, and salinity of 0-15 g/L). The maximum power density of the MFC biosensor was 98.3 ± 1.5 mW/m² at 1500 Ω. A good linear relationship ( r ² = 0.997) was observed between the Cr(VI) concentration (2.5-60 mg/L) and the voltage output. The developed MFC biosensor is a simple device that can accurately measure Cr(VI) concentrations in the actual electroplating wastewater that is generated from different electroplating units within 30 min with low deviations (-6.1% to 2.2%). After treating the actual electroplating wastewater with the MFC, the predominant family in the biofilm was found to be Bacillaceae (95.3%) and was further identified as the originally inoculated E. aestuarii YC211 by next generation sequencing (NGS). Thus, the MFC biosensor can measure Cr(VI) concentrations in situ in the effluents from different electroplating units, and it can potentially help in preventing the violation of effluent regulations.

A Green Microbial Fuel Cell-Based Biosensor for In Situ Chromium (VI) Measurement in Electroplating Wastewater

PubMed Central

Wu, Li-Chun; Tsai, Teh-Hua; Liu, Man-Hai; Kuo, Jui-Ling; Chang, Yung-Chu

2017-01-01

The extensive use of Cr(VI) in many industries and the disposal of Cr(VI)-containing wastes have resulted in Cr(VI)-induced environmental contamination. Cr(VI) compounds are associated with increased cancer risks; hence, the detection of toxic Cr(VI) compounds is crucial. Various methods have been developed for Cr(VI) measurement, but they are often conducted offsite and cannot provide real-time toxicity monitoring. A microbial fuel cell (MFC) is an eco-friendly and self-sustaining device that has great potential as a biosensor for in situ Cr(VI) measurement, especially for wastewater generated from different electroplating units. In this study, Exiguobacterium aestuarii YC211, a facultatively anaerobic, Cr(VI)-reducing, salt-tolerant, and exoelectrogenic bacterium, was isolated and inoculated into an MFC to evaluate its feasibility as a Cr(VI) biosensor. The Cr(VI) removal efficiency of E. aestuarii YC211 was not affected by the surrounding environment (pH 5–9, 20–35 °C, coexisting ions, and salinity of 0–15 g/L). The maximum power density of the MFC biosensor was 98.3 ± 1.5 mW/m2 at 1500 Ω. A good linear relationship (r2 = 0.997) was observed between the Cr(VI) concentration (2.5–60 mg/L) and the voltage output. The developed MFC biosensor is a simple device that can accurately measure Cr(VI) concentrations in the actual electroplating wastewater that is generated from different electroplating units within 30 min with low deviations (−6.1% to 2.2%). After treating the actual electroplating wastewater with the MFC, the predominant family in the biofilm was found to be Bacillaceae (95.3%) and was further identified as the originally inoculated E. aestuarii YC211 by next generation sequencing (NGS). Thus, the MFC biosensor can measure Cr(VI) concentrations in situ in the effluents from different electroplating units, and it can potentially help in preventing the violation of effluent regulations. PMID:29076985

Enhanced chitosan beads-supported Fe(0)-nanoparticles for removal of heavy metals from electroplating wastewater in permeable reactive barriers.

PubMed

Liu, Tingyi; Yang, Xi; Wang, Zhong-Liang; Yan, Xiaoxing

2013-11-01

The removal of heavy metals from electroplating wastewater is a matter of paramount importance due to their high toxicity causing major environmental pollution problems. Nanoscale zero-valent iron (NZVI) became more effective to remove heavy metals from electroplating wastewater when enhanced chitosan (CS) beads were introduced as a support material in permeable reactive barriers (PRBs). The removal rate of Cr (VI) decreased with an increase of pH and initial Cr (VI) concentration. However, the removal rates of Cu (II), Cd (II) and Pb (II) increased with an increase of pH while decreased with an increase of their initial concentrations. The initial concentrations of heavy metals showed an effect on their removal sequence. Scanning electron microscope images showed that CS-NZVI beads enhanced by ethylene glycol diglycidyl ether (EGDE) had a loose and porous surface with a nucleus-shell structure. The pore size of the nucleus ranged from 19.2 to 138.6 μm with an average aperture size of around 58.6 μm. The shell showed a tube structure and electroplating wastewaters may reach NZVI through these tubes. X-ray photoelectron spectroscope (XPS) demonstrated that the reduction of Cr (VI) to Cr (III) was complete in less than 2 h. Cu (II) and Pb (II) were removed via predominant reduction and auxiliary adsorption. However, main adsorption and auxiliary reduction worked for the removal of Cd (II). The removal rate of total Cr, Cu (II), Cd (II) and Pb (II) from actual electroplating wastewater was 89.4%, 98.9%, 94.9% and 99.4%, respectively. The findings revealed that EGDE-CS-NZVI-beads PRBs had the capacity to remediate actual electroplating wastewater and may become an effective and promising technology for in situ remediation of heavy metals. Copyright © 2013 Elsevier Ltd. All rights reserved.

Toxicity assessment of heavy metal mixtures by Lemna minor L.

PubMed

Horvat, Tea; Vidaković-Cifrek, Zeljka; Orescanin, Visnja; Tkalec, Mirta; Pevalek-Kozlina, Branka

2007-10-01

The discharge of untreated electroplating wastewaters directly into the environment is a certain source of heavy metals in surface waters. Even though heavy metal discharge is regulated by environmental laws many small-scale electroplating facilities do not apply adequate protective measures. Electroplating wastewaters contain large amounts of various heavy metals (the composition depending on the facility) and the pH value often bellow 2. Such pollution diminishes the biodiversity of aquatic ecosystems and also endangers human health. The aim of our study was to observe/measure the toxic effects induced by a mixture of seven heavy metals on a bioindicator species Lemna minor L. Since artificial laboratory metal mixtures cannot entirely predict behaviour of metal mixtures nor provide us with informations relating to the specific conditions in the realistic environment we have used an actual electroplating wastewater sample discharged from a small electroplating facility. In order to obtain three more samples with the same composition of heavy metals but at different concentrations, the original electroplating wastewater sample has undergone a purification process. The purification process used was developed by Orescanin et al. [Orescanin V, Mikelić L, Lulić S, Nad K, Rubcić M, Pavlović G. Purification of electroplating wastewaters utilizing waste by-product ferrous sulphate and wood fly ash. J Environ Sci Health A 2004; 39 (9): 2437-2446.] in order to remove the heavy metals and adjust the pH value to acceptable values for discharge into the environment. Studies involving plants and multielemental waters are very rare because of the difficulty in explaining interactions of the combined toxicities. Regardless of the complexity in interpretation, Lemna bioassay can be efficiently used to assess combined effects of multimetal samples. Such realistic samples should not be avoided because they can provide us with a wide range of information which can help explain many different interactions of metals on plant growth and metabolism. In this study we have primarily evaluated classical toxicity endpoints (relative growth rate, Nfronds/Ncolonies ratio, dry to fresh weight ratio and frond area) and measured guaiacol peroxidase (GPX) activity as early indicator of oxidative stress. Also, we have measured metal accumulation in plants treated with waste ash water sample with EDXRF analysis and have used toxic unit (TU) approach to predict which metal will contribute the most to the general toxicity of the tested samples.

Reducing chromium losses from a chromium plating bath. 1987 summer intern report. Project conducted at New Dimension Plating, Hutchinson, Minnesota

DOE Office of Scientific and Technical Information (OSTI.GOV)

Achman, D.

1987-12-31

The company employs about forty people and operates for one or two eight hour shifts with an average of 315 racks of chrome plating per eight hour day. They plate a variety of metals including copper, nickel, gold, brass and chromium. Chromium is the major metal plated and is usually the last step in plating cycle. Most parts are copper plated and then nickel plated in preparation for chrome plating. The main difference between New Dimension Plating and other plating shops is the variety of parts plated. As New Dimension Plating is a job shop, a wide range of partsmore » such as motorcycle accessories, stove parts, and custom items are metal finished. The plating lines are manual, meaning employees dip the racks into the tanks by hand. This fact along with the fact that parts vary greatly in size and shape accounts for the significant drag-out on the chromium plating line.« less

Photoelectrochemical cell for simultaneous electricity generation and heavy metals recovery from wastewater.

PubMed

Wang, Dawei; Li, Yi; Li Puma, Gianluca; Lianos, Panagiotis; Wang, Chao; Wang, Peifang

2017-02-05

The feasibility of simultaneous recovery of heavy metals from wastewater (e.g., acid mining and electroplating) and production of electricity is demonstrated in a novel photoelectrochemical cell (PEC). The photoanode of the cell bears a nanoparticulate titania (TiO 2 ) film capped with the block copolymer [poly(ethylene glycol)-b-poly(propylene glycol)-b-poly(ethylene glycol)] hole scavenger, which consumed photogenerated holes, while the photogenerated electrons transferred to a copper cathode reducing dissolved metal ions and produced electricity. Dissolved silver Ag + , copper Cu 2+ , hexavalent chromium as dichromate Cr 2 O 7 2- and lead Pb 2+ ions in a mixture (0.2mM each) were removed at different rates, according to their reduction potentials. Reduced Ag + , Cu 2+ and Pb 2+ ions produced metal deposits on the cathode electrode which were mechanically recovered, while Cr 2 O 7 2- reduced to the less toxic Cr 3+ in solution. The cell produced a current density J sc of 0.23mA/cm 2 , an open circuit voltage V oc of 0.63V and a maximum power density of 0.084mW/cm 2 . A satisfactory performance of this PEC for the treatment of lead-acid battery wastewater was observed. The cathodic reduction of heavy metals was limited by the rate of electron-hole generation at the photoanode. The PEC performance decreased by 30% after 9 consecutive runs, caused by the photoanode progressive degradation. Copyright © 2016 Elsevier B.V. All rights reserved.

Advanced foil activation techniques for the measurement of within-pin distributions of the 63Cu(n,γ) 64Cu reaction rate in nuclear fuel

NASA Astrophysics Data System (ADS)

Macku, K.; Jatuff, F.; Murphy, M. F.; Joneja, O. P.; Bischofberger, R.; Chawla, R.

2006-06-01

Different foil activation techniques have been used for measuring spatial distributions of the 63Cu(n,γ) 64Cu reaction within two pins of a SVEA-96 Optima2 boiling water reactor fuel assembly, at the critical facility PROTEUS. This reaction is of interest because its 1/v cross-section gives it a good representation of the 235U fission rate. Initially, radial capture rate profiles were measured with mechanically punched copper foils. More detailed profiles were then determined by using a 0.2 mm copper wire spiral (˜200 μm resolution), as well as 5-, 10-, and 20-ring UV-lithography, electroplating, and molding (UV-LIGA) foils (up to a 100 μm resolution). For azimuthal measurements, apart from manually cut activation foils (into 8 sectors), 8- and 12-sector LIGA foils were used. The highly versatile LIGA foils have the additional advantage of being very easily separated into individual pieces after irradiation without the use of punches or other cutting tools. In order to account for the invasive character of the foil activation techniques, corrections to account for sample perturbations and for self-shielding effects were determined via simplified Monte Carlo (MCNP4C) modeling of the experimental setup. The final results from the various measurements of 63Cu(n,γ) 64Cu within-pin distributions have been compared with MCNP computations employing a detailed model of the full SVEA Optima2 fuel assembly.

Flight solar calibrations using the Mirror Attenuator Mosaic (MAM): Low scattering mirror

NASA Technical Reports Server (NTRS)

Lee, Robert B., III

1992-01-01

Measurements of solar radiances reflected from the mirror attenuator mosaic (MAM) were used to calibrate the shortwave portions of the Earth Radiation Budget Experiment (ERBE) thermistor bolometer scanning radiometers. The MAM is basically a low scattering mirror which has been used to attenuate and reflect solar radiation into the fields of view for the broadband shortwave (0.2 to 5 micrometers) and total (0.2 to 50.0+ micrometers) ERBE scanning radiometers. The MAM assembly consists of a tightly packed array of aluminum, 0.3175-cm diameter concave spherical mirrors and field of view limiting baffles. The spherical mirrors are masked by a copper plate, electro-plated with black chrome. Perforations (0.14 centimeter in diameter) in the copper plate serve as apertures for the mirrors. Black anodized aluminum baffles limit the MAM clear field of view to 7.1 degrees. The MAM assemblies are located on the Earth Radiation Budget Satellite (ERBS) and on the National Oceanic and Atmospheric Administration NOAA-9 and NOAA-10 spacecraft. The 1984-1985 ERBS and 1985-1986 NOAA-9 solar calibration datasets are presented. Analyses of the calibrations indicate that the MAM exhibited no detectable degradation in its reflectance properties and that the gains of the shortwave scanners did not change. The stability of the shortwave radiometers indicates that the transmission of the Suprasil W1 filters did not degrade detectably when exposed to Earth/atmosphere-reflected solar radiation.

Evaluation of materials and surface treatments for the DWPF melter pour spout bellows protective liner

DOE Office of Scientific and Technical Information (OSTI.GOV)

Imrich, K.J.; Bickford, D.F.; Wicks, G.G.

1997-06-27

A study was undertaken to evaluate a variety of materials and coatings for the DWPF pour spout bellows liner. The intent was to identify materials that would minimize or eliminate adherence of glass on the bellows liner wall and help minimize possible pluggage during glass pouring operations in DWPF. Glass has been observed adhering to the current bellow`s liner, which is made of 304L stainless steel. Materials were identified which successfully allowed molten glass to hit these surfaces and not adhere. Results of this study suggest that if these materials are used in the pouring system glass could still fallmore » into the canister without appreciable plugging, even if an unstable glass stream is produced. The materials should next be evaluated under the most realistic DWPF conditions possible. Other findings of this study include the following: (1) increasing coupon thickness produced a favorable increase in the glass sticking temperature; (2) highly polished surfaces, with the exception of the oxygen-free copper coupon coated with Armoloy dense chromium, did not produce a significant improvement in the glass sticking temperature, increasing angle of contact of the coupon to the falling glass did not yield a significant performance improvement; (3) electroplating with gold and silver and various diffusion coatings did not produce a significant increase in the glass sticking temperature. However, they may provide added oxidation and corrosion resistance for copper and bronze liners. Boron nitride coatings delaminated immediately after contact with the molten glass.« less

Depth profile composition studies of thin film CdS:Cu2S solar cells using XPS and AES

NASA Astrophysics Data System (ADS)

Bhide, V. G.; Salkalachen, S.; Rastogi, A. C.; Rao, C. N. R.; Hegde, M. S.

1981-09-01

Studies of the surface composition and depth profiles of thin film CdS:Cu2S solar cells based on the techniques of X-ray photoelectron spectroscopy (XPS) and Auger electron spectroscopy (AES) are reported. Specimens were fabricated by the thermal deposition of polycrystalline CdS films onto silver-backed electrodes predeposited on window glass substrates, followed by texturization in hot HCl and chemical plating in a hot CuCl(I) bath for a few seconds to achieve the topotaxial growth of CuS films. The XPS and AES studies indicate the junction to be fairly diffused in the as-prepared cell, with heat treatment in air at 210 C sharpening the junction, improving the stoichiometry of the Cu2S layer and thus improving cell performance. The top copper sulfide layer is found to contain impurities such as Cd, Cl, O and C, which may be removed by mild Ar(+) ion beam etching. The presence of copper deep in the junction is invariably detected, apparently in the grain boundary region in the form of CuS or Cu(2+) trapped in the lattice. It is also noted that the nominal valence state of copper changes abruptly from Cu(+) to Cu(2+) across the junction.

Treatment of Wastewater from Electroplating, Metal Finishing and Printed Circuit Board Manufacturing. Operation of Wastewater Treatment Plants Volume 4.

ERIC Educational Resources Information Center

California State Univ., Sacramento. Dept. of Civil Engineering.

One of four manuals dealing with the operation of wastewater plants, this document was designed to address the treatment of wastewater from electroplating, metal finishing, and printed circuit board manufacturing. It emphasizes how to operate and maintain facilities which neutralize acidic and basic waters; treat waters containing metals; destroy…

The use of bio-monitoring to assess exposure in the electroplating industry

PubMed Central

Beattie, Helen; Keen, Chris; Coldwell, Matthew; Tan, Emma; Morton, Jackie; McAlinden, John; Smith, Paul

2017-01-01

Workers in the electroplating industry are potentially exposed to a range of hazardous substances including nickel and hexavalent chromium (chromium VI) compounds. These can cause serious health effects, including cancer, asthma and dermatitis. This research aimed to investigate whether repeat biological monitoring (BM) over time could drive sustainable improvements in exposure control in the industry. BM was performed on multiple occasions over 3 years, at 53 electroplating companies in Great Britain. Surface and dermal contamination was also measured, and controls were assessed. Air monitoring was undertaken on repeat visits where previous BM results were of concern. There were significant reductions in urinary nickel and chromium levels over the lifetime of this work in the subset of companies where initially, control deficiencies were more significant. Increased risk awareness following provision of direct feedback to individual workers and targeted advice to companies is likely to have contributed to these reductions. This study has shown that exposures to chromium VI and nickel in the electroplating industry occur via a combination of inhalation, dermal and ingestion routes. Surface contamination found in areas such as canteens highlights the potential for transferral from work areas, and the importance of a regular cleaning regime. PMID:26627055

Apparatus and method for continuous electroplating. [Patent application

DOEpatents

Conlon, T.P. Jr.; Holmes, S.D.

1981-11-19

An apparatus and method are disclosed for performing a continuous electroplating process upon an elongate conductive stock article. A closed housing assembly retaining an electroplating solution and having a conductive housing body and flexible, nonconductive end walls is connected to the positive pole of a source of electromotive force. The end walls have an aperture for receiving the conducting stock article in sliding and sealing contact. The stock article is connected to the negative pole of the source of electromotive force. The conductive housing body and the section of the conductive stock article within the housing body are coextensive, coaxial and spaced a uniform distance apart. The housing body has an inlet at the bottom and an outlet at the top allowing the housing assembly to fill completely with plating solution. The inlet has a reduced nozzle to create turbulence and spiral circulating motion of the plating solution moved by a pump connected by nonconductive conduits. The solution is circulated through an open reservoir. A coolant may be conveyed through the interior in a hollow stock article to cool the surface being electroplated. Different sizes of coaxial metal insert sleeves may be telescopically received in the housing body.

Electroplated reticulated vitreous carbon current collectors for lead-acid batteries: opportunities and challenges

NASA Astrophysics Data System (ADS)

Gyenge, Elod; Jung, Joey; Mahato, Basanta

Reticulated, open-cell structures based on vitreous carbon substrates electroplated with a Pb-Sn (1 wt.%) alloy were investigated as current collectors for lead-acid batteries. Scanning and backscattered electron microscopy, cyclic voltammetry, anodic polarization and flooded 2 V single-cell battery testing was employed to characterize the performance of the proposed collectors. A battery equipped with pasted electroplated reticulated vitreous carbon (RVC) electrodes of 137 cm 2 geometric area, at the time of manuscript submission, completed 500 cycles and over 1500 h of continuous operation. The cycling involved discharges at 63 A kg PAM-1 corresponding to a nominal 0.75 h rate and a positive active mass (PAM) utilization efficiency of 21%. The charging protocol was composed of two voltage limited (i.e. 2.6 V/cell), constant current steps of 35 and 9.5 A kg PAM-1, respectively, with a total duration of about 2 h. The charge factor was 1.05-1.15. The observed cycling behavior in conjunction with the versatility of electrodeposition to produce application-dependent optimized lead alloy coating thickness and composition shows promise for the development of lead-acid batteries using electroplated reticulated vitreous carbon collectors.

The use of bio-monitoring to assess exposure in the electroplating industry.

PubMed

Beattie, Helen; Keen, Chris; Coldwell, Matthew; Tan, Emma; Morton, Jackie; McAlinden, John; Smith, Paul

2017-01-01

Workers in the electroplating industry are potentially exposed to a range of hazardous substances including nickel and hexavalent chromium (chromium VI) compounds. These can cause serious health effects, including cancer, asthma and dermatitis. This research aimed to investigate whether repeat biological monitoring (BM) over time could drive sustainable improvements in exposure control in the industry. BM was performed on multiple occasions over 3 years, at 53 electroplating companies in Great Britain. Surface and dermal contamination was also measured, and controls were assessed. Air monitoring was undertaken on repeat visits where previous BM results were of concern. There were significant reductions in urinary nickel and chromium levels over the lifetime of this work in the subset of companies where initially, control deficiencies were more significant. Increased risk awareness following provision of direct feedback to individual workers and targeted advice to companies is likely to have contributed to these reductions. This study has shown that exposures to chromium VI and nickel in the electroplating industry occur via a combination of inhalation, dermal and ingestion routes. Surface contamination found in areas such as canteens highlights the potential for transferral from work areas, and the importance of a regular cleaning regime.

Biosynthesis of silver nanoparticles by Pseudomonas spp. isolated from effluent of an electroplating industry.

PubMed

Punjabi, Kapil; Yedurkar, Snehal; Doshi, Sejal; Deshapnde, Sunita; Vaidya, Shashikant

2017-08-01

The aim of this study was to isolate and screen bacteria from soil and effluent of electroplating industries for the synthesis of silver nanoparticles and characterize the potential isolate. Soil and effluent of electroplating industries from Mumbai were screened for bacteria capable of synthesizing silver nanoparticles. From two soils and eight effluent samples 20 bacterial isolates were obtained, of these, one was found to synthesize silver nanoparticles. Synthesis of silver nanoparticle by bacteria was confirmed by undertaking characterization studies of nanoparticles that involved spectroscopy and electron microscopic techniques. The potential bacteria was found to be Gram-negative short rods with its biochemical test indicating Pseudomonas spp . Molecular characterization of the isolate by 16S r DNA sequencing was carried out which confirmed its relation to Pseudomonas hibiscicola ATCC 19867. Stable nanoparticles synthesized were 50 nm in size and variable shapes as seen in SEM micrographs. The XRD and FTIR confirmed the crystalline structure of nanoparticles and presence of biomolecules mainly proteins as agents for reduction and capping of nanoparticles. The study demonstrates synthesis of nanoparticles by bacteria from effluent of electroplating industry. This can be used for large scale synthesis of nanoparticles by cost effective and environmentally benign mode of synthesis.

Characterization and Prediction of Cracks in Coated Materials: Direction and Length of Crack Propagation in Bimaterials

PubMed Central

Azari, Z.; Pappalettere, C.

2015-01-01

The behaviour of materials is governed by the surrounding environment. The contact area between the material and the surrounding environment is the likely spot where different forms of degradation, particularly rust, may be generated. A rust prevention treatment, like bluing, inhibitors, humidity control, coatings, and galvanization, will be necessary. The galvanization process aims to protect the surface of the material by depositing a layer of metallic zinc by either hot-dip galvanizing or electroplating. In the hot-dip galvanizing process, a metallic bond between steel and metallic zinc is obtained by immersing the steel in a zinc bath at a temperature of around 460°C. Although the hot-dip galvanizing procedure is recognized to be one of the most effective techniques to combat corrosion, cracks can arise in the intermetallic δ layer. These cracks can affect the life of the coated material and decrease the lifetime service of the entire structure. In the present paper the mechanical response of hot-dip galvanized steel submitted to mechanical loading condition is investigated. Experimental tests were performed and corroborative numerical and analytical methods were then applied in order to describe both the mechanical behaviour and the processes of crack/cracks propagation in a bimaterial as zinc-coated material. PMID:27347531

Characterization and Prediction of Cracks in Coated Materials: Direction and Length of Crack Propagation in Bimaterials.

PubMed

Pruncu, C I; Azari, Z; Casavola, C; Pappalettere, C

2015-01-01

The behaviour of materials is governed by the surrounding environment. The contact area between the material and the surrounding environment is the likely spot where different forms of degradation, particularly rust, may be generated. A rust prevention treatment, like bluing, inhibitors, humidity control, coatings, and galvanization, will be necessary. The galvanization process aims to protect the surface of the material by depositing a layer of metallic zinc by either hot-dip galvanizing or electroplating. In the hot-dip galvanizing process, a metallic bond between steel and metallic zinc is obtained by immersing the steel in a zinc bath at a temperature of around 460°C. Although the hot-dip galvanizing procedure is recognized to be one of the most effective techniques to combat corrosion, cracks can arise in the intermetallic δ layer. These cracks can affect the life of the coated material and decrease the lifetime service of the entire structure. In the present paper the mechanical response of hot-dip galvanized steel submitted to mechanical loading condition is investigated. Experimental tests were performed and corroborative numerical and analytical methods were then applied in order to describe both the mechanical behaviour and the processes of crack/cracks propagation in a bimaterial as zinc-coated material.

The use of ionic liquids based on choline chloride for metal deposition: A green alternative?

PubMed

Haerens, Kurt; Matthijs, Edward; Chmielarz, Andrzej; Van der Bruggen, Bart

2009-08-01

Ionic liquids are studied intensively for different applications. They tend to be denoted as "green solvents", largely because of their low vapour pressure. In recent years toxicity and biotoxicity of ionic liquids have also been investigated, which proved that not all of these are "green". In this paper the use of ionic liquids based on choline chloride and ethylene glycol in electrochemistry is discussed in the context of their use as green solvents. Due to their low toxicity and ready biodegradability, these deep eutectic solvents are promising for the electrodeposition of metals. The influence of the use of these liquids as metal deposition baths on the waste water is investigated. Drag-out was found to be the most influencing parameter on the environmental impact of the process, as it is three times higher compared to classical solutions due to the higher viscosity of the ionic liquid. There are no major changes needed in the rinsing configuration of classic electroplating plants, and ion exchange to remove the metal out of the waste water was not hindered by the presence of the ionic liquid. The formation of by-products during the deposition of metals has to be further investigated and evaluated in consideration of the environmental impact.

Rapid determination of chromium(VI) in electroplating waste water by use of a spectrophotometric flow injection system.

PubMed

Yuan, Dong; Fu, Dayou; Wang, Rong; Yuan, Jigang

2008-11-01

A new rapid and sensitive FI method is reported for spectrophotometric determination of trace chromium(VI) in electroplating waste water. The method is based on the reaction of Cr(VI) with sodium diphenylamine sulfonate (DPH) in acidic medium to form a purple complex (lambda(max) = 550 nm). Under the optimized conditions, the calibration curve is linear in the range 0.04-3.8 microg ml(-1) at a sampling rate of 30 h(-1). The detection limit of the method is 0.0217 microg ml(-1), and the relative standard deviation is 1.1% for eight determinations of 2 microg ml(-1) Cr(VI). The proposed method was applied to the determination of chromium in electroplating waste water with satisfactory results.

Improvement in surface conditions of electroplated Fe-Pt thick-film magnets

NASA Astrophysics Data System (ADS)

Yanai, T.; Honda, J.; Hamamura, R.; Omagari, Y.; Yamada, H.; Fujita, N.; Takashima, K.; Nakano, M.; Fukunaga, H.

2018-05-01

Fe-Pt thick-films were electroplated on Ta, Ti, Co, Ni, and Cu plates (substrates) using a direct current, and the surface morphology, the magnetic properties, and the crystal structure of the films were evaluated. The films plated on the Co, Ni, and Cu substrates showed much smooth surface compared with those for the Ta and Ti ones, and we confirmed that the Cu plate was the most attractive substrate due to very small cracks after an annealing for L10 ordering. High coercivity (>800 kA/m) for the Cu substrate is almost the same as that for our previous study in which we employed the Ta substrate, and we found that the Cu plate is a hopeful substrate to improve the surface conditions of electroplated Fe-Pt thick-film magnets.

Wire blade development for Fixed Abrasive Slicing Technique (FAST) slicing

NASA Technical Reports Server (NTRS)

Khattak, C. P.; Schmid, F.; Smith, M. B.

1982-01-01

A low cost, effective slicing method is essential to make ingot technology viable for photovoltaics in terrestrial applications. The fixed abrasive slicing technique (FAST) combines the advantages of the three commercially developed techniques. In its development stage FAST demonstrated cutting effectiveness of 10 cm and 15 cm diameter workpieces. Wire blade development is still the critical element for commercialization of FAST technology. Both impregnated and electroplated wire blades have been developed; techniques have been developed to fix diamonds only in the cutting edge of the wire. Electroplated wires show the most near term promise and this approach is emphasized. With plated wires it has been possible to control the size and shape of the electroplating, it is expected that this feature reduces kerf and prolongs the life of the wirepack.

Plated lamination structures for integrated magnetic devices

DOEpatents

Webb, Bucknell C.

2014-06-17

Semiconductor integrated magnetic devices such as inductors, transformers, etc., having laminated magnetic-insulator stack structures are provided, wherein the laminated magnetic-insulator stack structures are formed using electroplating techniques. For example, an integrated laminated magnetic device includes a multilayer stack structure having alternating magnetic and insulating layers formed on a substrate, wherein each magnetic layer in the multilayer stack structure is separated from another magnetic layer in the multilayer stack structure by an insulating layer, and a local shorting structure to electrically connect each magnetic layer in the multilayer stack structure to an underlying magnetic layer in the multilayer stack structure to facilitate electroplating of the magnetic layers using an underlying conductive layer (magnetic or seed layer) in the stack as an electrical cathode/anode for each electroplated magnetic layer in the stack structure.

METHOD OF ELECTROPLATING ON URANIUM

DOEpatents

Rebol, E.W.; Wehrmann, R.F.

1959-04-28

This patent relates to a preparation of metallic uranium surfaces for receiving coatings, particularly in order to secure adherent electroplated coatings upon uranium metal. In accordance with the invention the uranium surface is pretreated by degreasing in trichloroethylene, followed by immersion in 25 to 50% nitric acid for several minutes, and then rinsed with running water, prior to pickling in trichloroacetic acid. The last treatment is best accomplished by making the uranium the anode in an aqueous solution of 50 per cent by weight trichloroacetic acid until work-distorted crystals or oxide present on the metal surface have been removed and the basic crystalline structure of the base metal has been exposed. Following these initial steps the metallic uranium is rinsed in dilute nitric acid and then electroplated with nickel. Adnerent firmly-bonded coatings of nickel are obtained.

Enhanced superconducting transition temperature in electroplated rhenium

NASA Astrophysics Data System (ADS)

Pappas, D. P.; David, D. E.; Lake, R. E.; Bal, M.; Goldfarb, R. B.; Hite, D. A.; Kim, E.; Ku, H.-S.; Long, J. L.; McRae, C. R. H.; Pappas, L. D.; Roshko, A.; Wen, J. G.; Plourde, B. L. T.; Arslan, I.; Wu, X.

2018-04-01

We show that electroplated Re films in multilayers with noble metals such as Cu, Au, and Pd have an enhanced superconducting critical temperature relative to previous methods of preparing Re. The dc resistance and magnetic susceptibility indicate a critical temperature of approximately 6 K. The magnetic response as a function of field at 1.8 K demonstrates type-II superconductivity, with an upper critical field on the order of 2.5 T. Critical current densities greater than 107 A/m2 were measured above liquid-helium temperature. Low-loss at radio frequency was obtained below the critical temperature for multilayers deposited onto resonators made with Cu traces on commercial circuit boards. These electroplated superconducting films can be integrated into a wide range of standard components for low-temperature electronics.

Assessment of the effectiveness of orange (Citrus reticulata) peel in the recovery of nickel from electroplating wastewater.

PubMed

Hussein, Rim A

2014-12-01

Wastewater discharged from electroplating industry contains different concentrations of heavy metals, which when released into the environment pose a health hazard to human beings. The aim of this study was to assess the effectiveness of orange peel as an adsorbent in the recovery of Nickel (Ni) from electroplating wastewater. The effectiveness of orange peel as an adsorbent was assessed by determining the optimum conditions of adsorption (adsorbent dose, pH, and contact time), calculating the recovery percentage, and characterizing the orange peel sludge resulting from adsorption/desorption process as being hazardous or not. Under optimum conditions for adsorption, orange peel was found to be an effective adsorbent of Ni from electroplating wastewater. It achieved 59.28% removal of the metal from a solution containing 528 mg/l, at a dose of 60 g/l, at pH 7, and for 1-h contact time. The nickel uptake capacity of orange peel was calculated to be 5.2 mg/g. Using HCl for desorption of adsorbed Ni, a recovery of 44.46% of Ni discharged in the wastewater could be reached. Orange peel resulting from the adsorption/desorption process was characterized as being nonhazardous. Orange peel was found to be effective in the recovery of nearly half of the amount of Ni discharged in electroplating wastewater. Further studies are required to determine (a) the impact of the recovered NiCl2 solution on the quality of the plated product, (b) the effect of activation of orange peel on the adsorption process, and (c) the number of cycles during which orange peel can be reused as an effective adsorbent.

Genotoxic Effects Due to Exposure to Chromium and Nickel Among Electroplating Workers.

PubMed

El Safty, Amal Mohamed Kamal; Samir, Aisha Mohamed; Mekkawy, Mona Kamal; Fouad, Marwa Mohamed

Using chromium and nickel for electroplating is important in many industries. This process induces variable adverse health effects among exposed workers. The aim of this study is to detect the genotoxic effects of combined exposure to chromium and nickel among electroplating workers. This study was conducted on 41 male workers occupationally exposed to chromium and nickel in the electroplating section of a factory compared to 41 male nonexposed individuals, where full history and clinical examination were performed. Laboratory investigations included measurement of serum chromium, nickel, 8-hydroxydeoxyguanosine (8-OHdG), and micronuclei were measured in buccal cells. In exposed workers, serum chromium ranged from 0.09 to 7.20 µg/L, serum nickel ranged from 1.20 to 28.00 µg/L, serum 8-OHdG ranged from 1.09 to12.60 ng/mL, and these results were statistically significantly increased compared to nonexposed group ( P < 0.001). Electroplaters showed higher frequencies of micronuclei in buccal cells when compared to nonexposed (ranged from 20.00 to 130.00 N/1,000 versus 2.00 to 28.00 N/1,000; P < 0.001). Linear regression models were done to detect independent predictors of 8-OHdG and micronucleus test by comparing exposed and nonexposed groups. The model found that exposure to chromium and nickel increases serum 8-OHdG by 4.754 (95% confidence interval [CI]: 3.54-5.96). The model found that exposure to chromium and nickel increases micronucleus by 35.927 (95% CI: 28.517-43.337). Serum 8-OHdG and micronucleus test in buccal cells were increased with combined exposure to chromium and nickel. The current research concluded that workers exposed to nickel and chromium in electroplating industry are at risk of significant cytogenetic damage.

[Study of lung cancer risk in the electroplating industry in Lombardy based on the OCCAM method].

PubMed

Panizza, C; Bai, E; Oddone, E; Scaburri, Alessandra; Massari, Stefania; Modonesi, C; Crosignani, P

2011-01-01

The OCCAM method consists of case-control studies aimed at estimating occupational risks by cancer site, by area and by economic sector, using available archives to identify cases and controls; for exposure definition each subject is assigned to the category code of the economic sector or company where he/she worked the longest, obtained by automatic link with the Social Security Institute (INPS) files. The reference category (unexposed) consists of service industry workers. The economic sector is given by the ATECO category that INPS assigns to each firm. In the Lombardy Region, lung cancer risk evaluated for the "metal treatment" industry as a whole was 1.32 (90% CI 1.33-3.10, 67 cases) for males and 1.33 (90% CI 0.51-3.59, 10 cases) for females. The aim of the study was to estimate lung cancer risk among metal electroplating workers only. The metal electroplating firms were identified according to the detailed description of production, data which was also contained in INPS files, instead of using the "metal treatment" ATECO code. Lung cancer risk was evaluated using 2001-2008 incident cases identified from hospital discharge records of residents in the Lombardy Region. Controls were a sample from National Health Service files. For the group of firms identified as metal electroplating industries the risk was 2.03 (90% CI 1.69-8.32, 18 cases) for males and 3.75 (90% CI 1.38-9.03, 4 cases) for females. Focusing on the true electroplating firms increased the risk estimates. Even though these risk were due to past exposures, case histories and recent acute effects indicate that, at least in some factories, a carcinogenic hazard still exists.

Biomonitoring of two types of chromium exposure in an electroplating shop.

PubMed

Pierre, Francis; Diebold, François; Baruthio, François

2008-01-01

This study is concerned with two specific chromium (Cr) exposure situations at a hard-process electroplating company. Its aims are to define variations in urinary Cr concentration and to clarify their exposure relationships. Airborne chromium exposure and urinary excretion were measured for a-one week period. The majority of the exposed population was divided into two groups distinguishing chromium plating and polishing functions. Analysis of airborne Cr distinguished water soluble Cr(VI), water total soluble Cr and water insoluble Cr. Volunteers provided 6-7 urine samples per day for a monitoring period of 7 days. Differences between the two groups appear in relation to the type of exposure. Low concentration water soluble Cr(VI) (5.3 microg/m3 maximum) in electroplating shops is practically undetected in other workshops. Water insoluble Cr present in low concentration in electroplating exceeds 1 mg/m3 in polishing shops. Total soluble Cr concentrations are similar in these two activities (3-10 microg/m3). In polishing, 0.4% of the Cr aerosol comprises soluble Cr. Urinary Cr varied according to a 24 h cycle in similar manner in both groups throughout the monitoring week. Minimum values (3-10 microg/g crea) occurred when starting a work shift, following by a rapid rise as soon as exposure commenced, whilst maximum values (12-30 microg/g crea) were recorded towards the end of the work shift. Although uncorrelated with soluble Cr(VI), urinary Cr (24 h) is effectively related to the soluble fraction of airborne chromium. In the case of chromium electroplating, correspondence between exposure and excretion appears to be governed by relationships different to those emerging from stainless steel welding, from which current biological limit values have been derived.

Spectral reflectance properties of electroplated and converted zinc for use as a solar selective coating

NASA Technical Reports Server (NTRS)

Mcdonald, G. E.; Curtis, H. B.; Gianelos, L.

1975-01-01

The spectral reflectance properties of electroplated and chemically converted zinc were measured for both chromate and chloride conversion coatings. The reflectance properties were measured for various times of conversion and for conversion at various chromate concentrations. The values of absorptance, integrated over the solar spectrum, and of infrared emittance, integrated over black body radiation at 250 F were then calculated from the measured reflectance values. The interdependent variations of absorptance and infrared emittance were plotted. The results indicate that the optimum combination of the highest absorptance in the solar spectrum and the lowest emittance in the infrared of the converted electroplated zinc is produced by chromate conversion at 1/2 concentration of the standard NEOSTAR chromate black solution for 0.50 minute or by chloride conversion for 0.50 minute.

Spectral reflectance properties of electroplated and converted zinc for use as a solar selective coating

NASA Technical Reports Server (NTRS)

Mcdonald, G. E.; Curtis, H. B.; Gianelos, L.

1975-01-01

The spectral reflectance properties of electroplated and chemically converted zinc were measured for both chromate and chloride conversion coatings. The reflectance properties were measured for various times of conversion and for conversion at various chromate concentrations. The values of absorptance, alpha, integrated over the solar spectrum, and of infrared emittance, epsilon, integrated over black body radiation at 250 F were then calculated from the measured reflectance values. The interdependent variations of alpha and epsilon were plotted. The results indicate that the optimum combination of the highest absorptance in the solar spectrum and the lowest emittance in the infrared of the converted electroplated zinc is produced by chromate conversion at 1/2 concentration of the standard NEOSTAR chromate black solution for 0.50 minute or by chloride conversion for 0.50 minute.

Castable plastic mold with electroplatable base

DOEpatents

Domeier, Linda A.; Morales, Alfredo M.; Gonzales, Marcela G.; Keifer, Patrick M.

2004-01-20

A sacrificial plastic mold having an electroplatable backing is provided as are methods of making such a mold via the infusion of a castable liquid formulation through a porous metal substrate (sheet, screen, mesh or foam) and into the features of a micro-scale master mold. Upon casting and demolding, the porous metal substrate is embedded within the cast formulation and projects a plastic structure with features determined by the mold tool. The plastic structure provides a sacrificial plastic mold mechanically bonded to the porous metal substrate, which provides a conducting support suitable for electroplating either contiguous or non-contiguous metal replicates. After electroplating and lapping, the sacrificial plastic can be dissolved, leaving the desired metal structure bonded to the porous metal substrate. Optionally, the electroplated structures may be debonded from the porous substrate by selective dissolution of the porous substrate or a coating thereon.

Cyclotron production of 61Cu using natural Zn & enriched 64Zn targets

NASA Astrophysics Data System (ADS)

Asad, A. H.; Smith, S. V.; Chan, S.; Jeffery, C. M.; Morandeau, L.; Price, R. I.

2012-12-01

Copper-61 (61Cu) shares with 64Cu certain advantages for PET diagnostic imaging, but has a shorter half-life (3.4hr vs. 12.7hr) and a greater probability of positron production per disintegration (61% vs. 17.9%). One important application is for in vivo imaging of hypoxic tissue. In this study 61Cu was produced using the 64Zn(p,α)61Cu reaction on natural Zn or enriched 64Zn targets. The enriched 64Zn (99.82%) was electroplated onto high purity gold or silver foils or onto thin Al discs. A typical target bombardment used 30μA; at 11.7, 14.5 or 17.6MeV over 30-60min. The 61Cu (radiochemical purity of >95%) was separated using a combination of cation and anion exchange columns. The 64Zn target material was recovered after each run, for re-use. In a direct comparison with enriched 64Zn-target results, 61Cu production using the cheaper natZn target proved to be an effective alternative.

Process for the displacement of cyanide ions from metal-cyanide complexes

DOEpatents

Smith, Barbara F.; Robinson, Thomas W.

1997-01-01

The present invention relates to water-soluble polymers and the use of such water-soluble polymers in a process for the displacement of the cyanide ions from the metal ions within metal-cyanide complexes. The process waste streams can include metal-cyanide containing electroplating waste streams, mining leach waste streams, mineral processing waste streams, and related metal-cyanide containing waste streams. The metal ions of interest are metals that give very strong complexes with cyanide, mostly iron, nickel, and copper. The physical separation of the water-soluble polymer-metal complex from the cyanide ions can be accomplished through the use of ultrafiltration. Once the metal-cyanide complex is disrupted, the freed cyanide ions can be recovered for reuse or destroyed using available oxidative processes rendering the cyanide nonhazardous. The metal ions are released from the polymer, using dilute acid, metal ion oxidation state adjustment, or competing chelating agents, and collected and recovered or disposed of by appropriate waste management techniques. The water-soluble polymer can then be recycled. Preferred water-soluble polymers include polyethyleneimine and polyethyleneimine having a catechol or hydroxamate group.

Fabrication of Electrophoretic Display Driven by Membrane Switch Array

NASA Astrophysics Data System (ADS)

Senda, Kazuo; Usui, Hiroaki

2010-04-01

Electrophoretic devices (EPDs) and organic light-emitting diodes (OLEDs) have potential application in a large-area flexible displays, such as digital signage. For this purpose, a new backplane is capable of driving a large unit is required instead of thin-film transistors. In this paper we describe the fabrication of a membrane switch array suitable for driving large-scale flat-panel displays. An array of membrane switches was prepared using flexible printed circuit (FPC) technology of polyimide films, by combining low-temperature processes of lamination and copper electroplating methods. An array of 256 matrix switches with a pixel size of 7 mm2 was prepared to drive the EPD front panel. The switches were driven at a voltage of about 40 V and a frequency of 10 Hz. The operation characteristics agreed well with the result of the theoretical calculation. The calculation also suggested that driving voltage can be lowered by increasing pixel size. The contact resistance of the membrane switch was as low as 0.2 Ω, which implies the wide applicability of this device for driving a variety of elements.

The use of trivalent chromium bath to obtain a solar selective black chromium coating

NASA Astrophysics Data System (ADS)

Survilienė, S.; Češūnienė, A.; Juškėnas, R.; Selskienė, A.; Bučinskienė, D.; Kalinauskas, P.; Juškevičius, K.; Jurevičiūtė, I.

2014-06-01

Black chromium coatings were electrodeposited from a trivalent chromium bath using a ZnO additive as a second main component. Black chromium was electrodeposited on steel and copper plates and substrates plated with bright nickel prior to black chromium electrodeposition. The black chromium coatings were characterized by XRD and SEM. The XRD data suggest that the phase structure of black chromium may be defined as a zinc solid solution in chromium or a chromium solid solution in zinc depending on the chromium/zinc ratio in the deposit. The role of substrate finish was evaluated through the corrosion resistance and reflectance of black chromium. According to corrosion tests the samples plated with bright nickel prior to black chromium deposition have shown the highest corrosion resistance. The electrodeposited black chromium possesses good optical properties for the absorption of solar energy. The absorption coefficient of black chromium was found to be over 0.99 for the samples obtained without the Ni undercoat and below 0.99 for those obtained with the use of Ni undercoat. However, the use of nickel undercoat before black chromium plating is recommended because it remarkably improves the corrosion resistance of samples.

One-Dimensional Thermal Violence Cook-Off Test

NASA Astrophysics Data System (ADS)

Cook, Malcolm; Stennett, Christopher; University of Cranfield, Shrivenham, Swindon, SN6 8LA Team; AWE plc, Aldermaston, Reading Bershire, RG7 4PR, UK Team

2017-06-01

The One-Dimensional Thermal Violence (ODTV) test is designed to quantify and rank the violence of HE charges when heated to elevated temperatures. The test design consists of a central spherical explosive pellet encased in two aluminium barrel shaped halves, fitted with a copper sealing ring, encased by two aluminium locking rings placed over them from either end. The outer surface of the capsule is heated uniformly by placing in a pre-heated molten solder bath. This allows the time-to-explosion to be recorded for different initial bath temperatures. The ODTV capsule can hold samples up to 30mm in diameter. Diagnostics include both thermocouples and Photon Dopler Velocimetry (PDV). A series of live firings have been carried out on a range of bespoke HMX/HTPB explosives. These include HMX/HTPB mix ratios of 95/5, 92/8, 90/10, 88/12 and 85/15. These tests showed that the ODTV capsule had sufficient confinement and size that it could capture the spectrum of events expected from these formulations. It has been demonstrated that the deformation of the heater cup (that houses the molten solder) can be used as an additional violence metric along with the fragmentation and PDV wall velocities of the aluminium ODTV capsule.

Indirect spectrophotometric determination of sodium ceftriaxone with n-propyl alcohol-ammonium sulfate-water system by extraction flotation of copper(II).

PubMed

Zhao, Wei; Zhang, Yan; Li, Quanmin

2008-05-01

Although the determination methods of sodium ceftriaxone has been increasingly reported, these methods have their inherent limits preventing them from being broadly applied in common laboratories. In order to circumvent this problem, a rapid and simple method for the indirect spectrophotometric determination of sodium ceftriaxone is reported. Sodium ceftriaxone was degraded completely in the presence of 0.20 mol/l sodium hydroxide in boiling water bath for 20 min. The thiol group (-SH) of the degradation product (I) of sodium ceftriaxone could reduce cupric to cuprous ions, and the resulting which was precipitated with the thiol group (-SH) of the degradation product (II) at pH 4.0. By determining the residual amount of copper (II), the indirect determination of sodium ceftriaxone can be achieved. Standard curve of sodium ceftriaxone versus the flotation yield of copper(II) showed that sodium ceftriaxone could be determined in low concentrations. The linear range of sodium ceftriaxone was 0.70-32 microg/ml and the detection limit evaluated by calibration curve (3sigma/k) was found to be 0.60 microg/ml. A simple and efficient method was developed and it has been successfully applied to the determination of sodium ceftriaxone in human serum and urine samples, respectively. It is expected that this method will find broad applications in the detection of cephalosporin derivatives with similar structure.

A Novel Method for Electroplating Ultra-High-Strength Glassy Metals

NASA Technical Reports Server (NTRS)

Ramsey, Brian; Engelhaupt, Darell; Six, N. Frank (Technical Monitor)

2002-01-01

A novel method for electroplating ultra-high-strength glassy metals, nickel-phosphorous and nickel-cobalt-phosphorous, has been developed at NASA Marshall Space Flight Center, cooperatively with the University of Alabama in Huntsville. Traditionally, thin coatings of these metals are achieved via electroless deposition. Benefits of the new electrolytic process include thick, low-stress deposits, free standing shapes, lower plating temperature, low maintenance, and safer operation with substantially lower cost.

Method of electroplating a conversion electron emitting source on implant

DOEpatents

Srivastava, Suresh C [Setauket, NY; Gonzales, Gilbert R [New York, NY; Adzic, Radoslav [East Setauket, NY; Meinken, George E [Middle Island, NY

2012-02-14

Methods for preparing an implant coated with a conversion electron emitting source (CEES) are disclosed. The typical method includes cleaning the surface of the implant; placing the implant in an activating solution comprising hydrochloric acid to activate the surface; reducing the surface by H.sub.2 evolution in H.sub.2SO.sub.4 solution; and placing the implant in an electroplating solution that includes ions of the CEES, HCl, H.sub.2SO.sub.4, and resorcinol, gelatin, or a combination thereof. Alternatively, before tin plating, a seed layer is formed on the surface. The electroplated CEES coating can be further protected and stabilized by annealing in a heated oven, by passivation, or by being covered with a protective film. The invention also relates to a holding device for holding an implant, wherein the device selectively prevents electrodeposition on the portions of the implant contacting the device.

Formation of nanofilament field emission devices

DOEpatents

Morse, Jeffrey D.; Contolini, Robert J.; Musket, Ronald G.; Bernhardt, Anthony F.

2000-01-01

A process for fabricating a nanofilament field emission device. The process enables the formation of high aspect ratio, electroplated nanofilament structure devices for field emission displays wherein a via is formed in a dielectric layer and is self-aligned to a via in the gate metal structure on top of the dielectric layer. The desired diameter of the via in the dielectric layer is on the order of 50-200 nm, with an aspect ratio of 5-10. In one embodiment, after forming the via in the dielectric layer, the gate metal is passivated, after which a plating enhancement layer is deposited in the bottom of the via, where necessary. The nanofilament is then electroplated in the via, followed by removal of the gate passification layer, etch back of the dielectric, and sharpening of the nanofilament. A hard mask layer may be deposited on top of the gate metal and removed following electroplating of the nanofilament.

Evaluation of a low-cost adsorbent for removal of toxic metal ions from wastewater of an electroplating factory.

PubMed

Sousa, Francisco W; Sousa, Marcelo James; Oliveira, Isadora R N; Oliveira, André G; Cavalcante, Rivelino M; Fechine, Pierre B A; Neto, Vicente O S; de Keukeleire, Denis; Nascimento, Ronaldo F

2009-08-01

In this study, sugar cane residue or bagasse was used for removal of toxic metal ions from wastewater of an electroplating factory located in northeast Brazil. Prior acid treatment increased the adsorption efficacies in batch wise experiments. The microstructure of the material before and after the treatment was investigated by X-ray diffraction, infrared spectroscopy and scanning electron microscopy. Column operations showed that removals of Cu(2+), Ni(2+) and Zn(2+) from wastewater (in the absence of cyanide) were 95.5%, 96.3.0%, and 97.1%, respectively. Regeneration of the adsorbent obtained in acid indicated that the efficiencies decreased only after the fourth cycle of re-use. Acid-treated sugar cane bagasse can be considered a viable alternative to common methods to remove toxic metal ions from aqueous effluents of electroplating industries.

Increased fracture depth range in controlled spalling of (100)-oriented germanium via electroplating

DOE PAGES

Crouse, Dustin; Simon, John; Schulte, Kevin L.; ...

2018-01-31

Controlled spalling in (100)-oriented germanium using a nickel stressor layer shows promise for semiconductor device exfoliation and kerfless wafering. Demonstrated spall depths of 7-60 um using DC sputtering to deposit the stressor layer are appropriate for the latter application but spall depths < 5 um may be required to minimize waste for device applications. This work investigates the effect of tuning both electroplating current density and electrolyte chemistry on the residual stress in the nickel and on the achievable spall depth range for the Ni/Ge system as a lower-cost, higher-throughput alternative to sputtering. By tuning current density and electrolyte phosphorousmore » concentration, it is shown that electroplating can successfully span the same range of spalled thicknesses as has previously been demonstrated by sputtering and can reach sufficiently high stresses to enter a regime of thickness (<7 um) appropriate to minimize substrate consumption for device applications.« less

Increased fracture depth range in controlled spalling of (100)-oriented germanium via electroplating

DOE Office of Scientific and Technical Information (OSTI.GOV)

Crouse, Dustin; Simon, John; Schulte, Kevin L.

Controlled spalling in (100)-oriented germanium using a nickel stressor layer shows promise for semiconductor device exfoliation and kerfless wafering. Demonstrated spall depths of 7-60 um using DC sputtering to deposit the stressor layer are appropriate for the latter application but spall depths < 5 um may be required to minimize waste for device applications. This work investigates the effect of tuning both electroplating current density and electrolyte chemistry on the residual stress in the nickel and on the achievable spall depth range for the Ni/Ge system as a lower-cost, higher-throughput alternative to sputtering. By tuning current density and electrolyte phosphorousmore » concentration, it is shown that electroplating can successfully span the same range of spalled thicknesses as has previously been demonstrated by sputtering and can reach sufficiently high stresses to enter a regime of thickness (<7 um) appropriate to minimize substrate consumption for device applications.« less

Sacrificial plastic mold with electroplatable base

DOEpatents

Domeier, Linda A.; Hruby, Jill M.; Morales, Alfredo M.

2002-01-01

A sacrificial plastic mold having an electroplatable backing is provided. One embodiment consists of the infusion of a softened or molten thermoplastic through a porous metal substrate (sheet, screen, mesh or foam) and into the features of a micro-scale molding tool contacting the porous metal substrate. Upon demolding, the porous metal substrate will be embedded within the thermoplastic and will project a plastic structure with features determined by the mold tool. This plastic structure, in turn, provides a sacrificial plastic mold mechanically bonded to the porous metal substrate which provides a conducting support suitable for electroplating either contiguous or non-contiguous metal replicates. After electroplating and lapping, the sacrificial plastic can be dissolved to leave the desired metal structure bonded to the porous metal substrate. Optionally, the electroplated structures may be debonded from the porous substrate by selective dissolution of the porous substrate or a coating thereon.

Sacrificial Plastic Mold With Electroplatable Base

DOEpatents

Domeier, Linda A.; Hruby, Jill M.; Morales, Alfredo M.

2005-08-16

A sacrificial plastic mold having an electroplatable backing is provided. One embodiment consists of the infusion of a softened or molten thermoplastic through a porous metal substrate (sheet, screen, mesh or foam) and into the features of a micro-scale molding tool contacting the porous metal substrate. Upon demolding, the porous metal substrate will be embedded within the thermoplastic and will project a plastic structure with features determined by the mold tool. This plastic structure, in turn, provides a sacrificial plastic mold mechanically bonded to the porous metal substrate which provides a conducting support suitable for electroplating either contiguous or non-contiguous metal replicates. After electroplating and lapping, the sacrificial plastic can be dissolved to leave the desired metal structure bonded to the porous metal substrate. Optionally, the electroplated structures may be debonded from the porous substrate by selective dissolution of the porous substrate or a coating thereon.

Biodegradation of Orthodontic Appliances and Their Effects on the Blood Level of Nickel and Chromium

DTIC Science & Technology

1990-05-01

production of stainless steels and other nickel alloys used for electroplating, battery manufacturing, in catalysts, coins and inorganic pigments . 1...as stainless steel, electroplating as a protective coating on other metals, in catalysts, in pigments , as a tanning agent for leather, textile...the earth’s crust. Titanium is 5 extensively used as a white pigment in paint, plastics and paper, in food as a coloring agent, in cosmetics and

Reliability and validity of expert assessment based on airborne and urinary measures of nickel and chromium exposure in the electroplating industry.

PubMed

Chen, Yu-Cheng; Coble, Joseph B; Deziel, Nicole C; Ji, Bu-Tian; Xue, Shouzheng; Lu, Wei; Stewart, Patricia A; Friesen, Melissa C

2014-11-01

The reliability and validity of six experts' exposure ratings were evaluated for 64 nickel-exposed and 72 chromium-exposed workers from six Shanghai electroplating plants based on airborne and urinary nickel and chromium measurements. Three industrial hygienists and three occupational physicians independently ranked the exposure intensity of each metal on an ordinal scale (1-4) for each worker's job in two rounds: the first round was based on responses to an occupational history questionnaire and the second round also included responses to an electroplating industry-specific questionnaire. The Spearman correlation (r(s)) was used to compare each rating's validity to its corresponding subject-specific arithmetic mean of four airborne or four urinary measurements. Reliability was moderately high (weighted kappa range=0.60-0.64). Validity was poor to moderate (r(s)=-0.37-0.46) for both airborne and urinary concentrations of both metals. For airborne nickel concentrations, validity differed by plant. For dichotomized metrics, sensitivity and specificity were higher based on urinary measurements (47-78%) than airborne measurements (16-50%). Few patterns were observed by metal, assessment round, or expert type. These results suggest that, for electroplating exposures, experts can achieve moderately high agreement and (reasonably) distinguish between low and high exposures when reviewing responses to in-depth questionnaires used in population-based case-control studies.

Influence of carbonation on the acid neutralization capacity of cements and cement-solidified/stabilized electroplating sludge.

PubMed

Chen, Quanyuan; Zhang, Lina; Ke, Yujuan; Hills, Colin; Kang, Yanming

2009-02-01

Portland cement (PC) and blended cements containing pulverized fuel ash (PFA) or granulated blast-furnace slag (GGBS) were used to solidify/stabilize an electroplating sludge in this work. The acid neutralization capacity (ANC) of the hydrated pastes increased in the order of PC > PC/GGBS > PC/PFA. The GGBS or PFA replacement (80 wt%) reduced the ANC of the hydrated pastes by 30-50%. The ANC of the blended cement-solidified electroplating sludge (cement/sludge 1:2) was 20-30% higher than that of the hydrated blended cement pastes. Upon carbonation, there was little difference in the ANC of the three cement pastes, but the presence of electroplating sludge (cement/sludge 1:2) increased the ANC by 20%. Blended cements were more effective binders for immobilization of Ni, Cr and Cu, compared with PC, whereas Zn was encapsulated more effectively in the latter. Accelerated carbonation improved the immobilization of Cr, Cu and Zn, but not Ni. The geochemical code PHREEQC, with the edited database from EQ3/6 and HATCHES, was used to calculate the saturation index and solubility of likely heavy metal precipitates in cement-based solidification/stabilization systems. The release of heavy metals could be related to the disruption of cement matrices and the remarkable variation of solubility of heavy metal precipitates at different pH values.

Reliability and validity of expert assessment based on airborne and urinary measures of nickel and chromium exposure in the electroplating industry

PubMed Central

Chen, Yu-Cheng; Coble, Joseph B; Deziel, Nicole C.; Ji, Bu-Tian; Xue, Shouzheng; Lu, Wei; Stewart, Patricia A; Friesen, Melissa C

2014-01-01

The reliability and validity of six experts’ exposure ratings were evaluated for 64 nickel-exposed and 72 chromium-exposed workers from six Shanghai electroplating plants based on airborne and urinary nickel and chromium measurements. Three industrial hygienists and three occupational physicians independently ranked the exposure intensity of each metal on an ordinal scale (1–4) for each worker's job in two rounds: the first round was based on responses to an occupational history questionnaire and the second round also included responses to an electroplating industry-specific questionnaire. Spearman correlation (rs) was used to compare each rating's validity to its corresponding subject-specific arithmetic mean of four airborne or four urinary measurements. Reliability was moderately-high (weighted kappa range=0.60–0.64). Validity was poor to moderate (rs= -0.37–0.46) for both airborne and urinary concentrations of both metals. For airborne nickel concentrations, validity differed by plant. For dichotomized metrics, sensitivity and specificity were higher based on urinary measurements (47–78%) than airborne measurements (16–50%). Few patterns were observed by metal, assessment round, or expert type. These results suggest that, for electroplating exposures, experts can achieve moderately-high agreement and (reasonably) distinguish between low and high exposures when reviewing responses to in-depth questionnaires used in population-based case-control studies. PMID:24736099

Improving Impedance of Implantable Microwire Multi-Electrode Arrays by Ultrasonic Electroplating of Durable Platinum Black

PubMed Central

Desai, Sharanya Arcot; Rolston, John D.; Guo, Liang; Potter, Steve M.

2010-01-01

Implantable microelectrode arrays (MEAs) have been a boon for neural stimulation and recording experiments. Commercially available MEAs have high impedances, due to their low surface area and small tip diameters, which are suitable for recording single unit activity. Lowering the electrode impedance, but preserving the small diameter, would provide a number of advantages, including reduced stimulation voltages, reduced stimulation artifacts and improved signal-to-noise ratio. Impedance reductions can be achieved by electroplating the MEAs with platinum (Pt) black, which increases the surface area but has little effect on the physical extent of the electrodes. However, because of the low durability of Pt black plating, this method has not been popular for chronic use. Sonicoplating (i.e. electroplating under ultrasonic agitation) has been shown to improve the durability of Pt black on the base metals of macro-electrodes used for cyclic voltammetry. This method has not previously been characterized for MEAs used in chronic neural implants. We show here that sonicoplating can lower the impedances of microwire multi-electrode arrays (MMEA) by an order of magnitude or more (depending on the time and voltage of electroplating), with better durability compared to pulsed plating or traditional DC methods. We also show the improved stimulation and recording performance that can be achieved in an in vivo implantation study with the sonicoplated low-impedance MMEAs, compared to high-impedance unplated electrodes. PMID:20485478

Fabrication of Cu-Ni mixed phase layer using DC electroplating and suppression of Kirkendall voids in Sn-Ag-Cu solder joints

NASA Astrophysics Data System (ADS)

Chee, Sang-Soo; Lee, Jong-Hyun

2014-05-01

A solderable layer concurrently containing Cu-rich and Ni-rich phases (mixed-phase layer, MPL) was fabricated by direct current electroplating under varying process conditions. Current density was considered as the main parameter to adjust the microstructure and composition of MPL during the electroplating process, and deposit thickness were evaluated as functions of plating time. As a result, it was observed that the coral-like structure that consisted of Cu-rich and Ni-rich phases grew in the thickness direction. The most desirable microstructure was obtained at a relatively low current density of 0.4 mA/cm2. In other words, the surface was the smoothest and defect-free at this current density. The electroplating rate was slightly enhanced with an increase in current density. Investigations of its solid-state reaction properties, including the formation of Kirkendall voids, were also carried out after reflow soldering with Sn-3.0 Ag-0.5 Cu solder balls. In the solid-state aging experiment at 125°C, Kirkendall voids at the normal Sn-3.0 Ag-0.5 Cu solder/Cu interface were easily formed after just 240 h. Meanwhile, the presence of an intermetallic compound (IMC) layer created in the solder/MPL interface indicated a slightly lower growth rate, and no Kirkendall voids were observed in the IMC layer even after 720 h.

In-plant testing of membranes to treat electroplating wastewater

NASA Technical Reports Server (NTRS)

Shah, D. B.; Talu, Orhan

1995-01-01

This is the final report submitted for the work performed under the NASA Cooperative Agreement NCC3-301 for the project entitled 'In-Plant Testing of Membranes To Treat Electroplating Waste water'. The main objective of the research project was to determine if the crosslinked polyacrylic acid salt films developed by NASA scientists could be used for heavy metal removal from the wastewater generated by the metals-finishing or electroplating industry. A variety of tasks identified in the original proposal were completed. These included: (1) analysis of our industrial partner Aetna Plating's zinc electroplating process and its wastewater treatment needs for zinc removal; (2) design and construction of a laboratory-scale unit to continuously supply and remove the ion exchange films from the zinc wastewater; (3) performance of a series of runs on such a unit to determine its operating characteristics; and (4) design of a prototype unit for use at the industrial site. In addition, there were a number of tasks that had not been identified in the original proposal but were later judged to be necessary for the successful completion of the project. These were: (1) batch equilibrium and kinetic experiments with analysis of the experimental results to accurately determine the equilibrium and kinetic parameters for the ion exchange films; (2 ) simulation studies for proper design of the prototype unit; and (3) preliminary runs to exchange the films from H form to Calcium form.

Study of Lightweight Ni-Co Alloy Mirrors Obtained by Electroforming Techniques

NASA Technical Reports Server (NTRS)

Jones, Ruth; Muntele, Iulia; Muntele, Claudiu; Zimmerman, Robert; Ila, Daryush; Smith, W. Scott (Technical Monitor)

2002-01-01

One contribution in reducing the costs of optics in space can be provided by production of ultralight mirrors. The decrease in the weight of the primary mirror of a telescope is anticipated to lead to the possibility of increasing the size of the telescopes, therefore increasing the amount and distance from which information is received. An electroplating process of ultralight replica mirrors from nickel sulfamate solution will be described. Based on an experimental setup with cylindrical symmetry, flat mirrors with a diameter of 7 inches and thickness of 1.5 mm are made from a Ni-Co alloy. The composition of the resulting deposit is analyzed using Rutherford Backscattering Spectrometry (RBS) and Proton Induced X-ray Emission (PIXE). In order to resolve Ni and Co, 10 MeV nitrogen ions are used as projectiles in the RBS measurements. Solution parameters monitored during the deposition process using optical absorption and polarography will be correlated with the final concentration of Ni and Co in the deposit. Bath parameters like temperature, current density, agitation level and acidity are chosen at certain values and maintained constant from one sample to another throughout the deposition process. The purpose of the experiment is to obtain mirrors with near zero stress, and predetermined composition and hardness. This study is an intermediate step in obtaining through the same process, but with a larger scale setup, ultralight large aperture replica mirrors.

Capable Copper Electrodeposition Process for Integrated Circuit - substrate Packaging Manufacturing

NASA Astrophysics Data System (ADS)

Ghanbari, Nasrin

This work demonstrates a capable reverse pulse deposition methodology to influence gap fill behavior inside microvia along with a uniform deposit in the fine line patterned regions for substrate packaging applications. Interconnect circuitry in IC substrate packages comprises of stacked microvia that varies in depth from 20microm to 100microm with an aspect ratio of 0.5 to 1.5 and fine line patterns defined by photolithography. Photolithography defined pattern regions incorporate a wide variety of feature sizes including large circular pad structures with diameter of 20microm - 200microm, fine traces with varying widths of 3microm - 30microm and additional planar regions to define a IC substrate package. Electrodeposition of copper is performed to establish the desired circuit. Electrodeposition of copper in IC substrate applications holds certain unique challenges in that they require a low cost manufacturing process that enables a void-free gap fill inside the microvia along with uniform deposition of copper on exposed patterned regions. Deposition time scales to establish the desired metal thickness for such packages could range from several minutes to few hours. This work showcases a reverse pulse electrodeposition methodology that achieves void-free gap fill inside the microvia and uniform plating in FLS (Fine Lines and Spaces) regions with significantly higher deposition rates than traditional approaches. In order to achieve this capability, systematic experimental and simulation studies were performed. A strong correlation of independent parameters that govern the electrodeposition process such as bath temperature, reverse pulse plating parameters and the ratio of electrolyte concentrations is shown to the deposition kinetics and deposition uniformity in fine patterned regions and gap fill rate inside the microvia. Additionally, insight into the physics of via fill process is presented with secondary and tertiary current simulation efforts. Such efforts lead to show "smart" control of deposition rate at the top and bottom of via to avoid void formation. Finally, a parametric effect on grain size and the ensuing copper metallurgical characteristics of bulk copper is also shown to enable high reliability substrate packages for the IC packaging industry.

Moisture Resistant Finishes for Airplane Woods

NASA Technical Reports Server (NTRS)

Dunlap, M E

1921-01-01

This report describes briefly a series of experiments made at the Forest Products Laboratory, Madison, Wisconsin, to determine the comparative moisture resistance of linseed oil, impregnation treatments, condensation varnishes, oil varnishes, enamels, cellulose varnishes, rubber, electroplated and sprayed metal coatings, and metal-leaf coatings when applied to wood. All coatings except rubber and electroplated metal coatings, which were not developed sufficiently to make them practical, admitted moisture in varying degrees. The most effective and most practical coating was found to be that of aluminum leaf.

Laser patterning of laminated structures for electroplating

DOEpatents

Mayer, Steven T.; Evans, Leland B.

1993-01-01

A process for laser patterning of a substrate so that it can be subsequently electroplated or electrolessly plated. The process utilizes a laser to treat an inactive (inert) layer formed over an active layer to either combine or remove the inactive layer to produce a patterned active layer on which electrodeposition can occur. The process is carried out by utilizing laser alloying and laser etching, and involves only a few relatively high yield steps and can be performed on a very small scale.

Laser patterning of laminated structures for electroplating

DOEpatents

Mayer, S.T.; Evans, L.B.

1993-11-23

A process for laser patterning of a substrate so that it can be subsequently electroplated or electrolessly plated. The process utilizes a laser to treat an inactive (inert) layer formed over an active layer to either combine or remove the inactive layer to produce a patterned active layer on which electrodeposition can occur. The process is carried out by utilizing laser alloying and laser etching, and involves only a few relatively high yield steps and can be performed on a very small scale. 9 figures.

METHOD OF JACKETING FISSIONABLE MATERIALS

DOEpatents

Foster, L.M.

1959-02-01

An improvement is presented in the jacketing of a metal body accomplished by electroplating upon that portion of the metal container to be protected from the bonding material a niatcrial such as Cr which is impermeable to the bonding material. After the bonding operation the electroplate is removed and the metal container surfuce, unimpaired, may be welded to a cap which effects a closure. Generally in such an operation the metal body is U, the metal container is Al and the bonding material is a Zn alloy.

Special Advanced Studies for Pollution Prevention. Delivery Order 0046: Advanced Studies in Pollution Prevention Chrome Replacements for Internal and Small Parts

DTIC Science & Technology

1999-01-01

Control Conference Proceedings, Orlando (1997), p 143. 5 US Patent # 5,196,109 (1993): " Trivalent chromium electrolytes and plating processes...Summary -Electroplating 7.1. Introduction 7.2. Process Description 7.2.1 Trivalent chrome plating 7.2.2. Composite electroplating 7.2.3. Alloy...requirements of chromium without the environmental and health hazards associated with chromic acid. Ideally, the process would not use any EPA 17

Primary effects of metals on osmoregulatory processes

DOE Office of Scientific and Technical Information (OSTI.GOV)

DiBona, D.R.; Kendall, L.K.; Ferreria, H.G.

1995-12-31

Isolated skins of the bullfrog, Rana catesbiana, were chamber-mounted as sheets, bathed on the inside (serosa) with a Ringer`s solution but on the outside with simulations of freshwater to mimic environmental conditions. An automatic voltage-clamping protocol measured short-circuit current (I{sub sc}), an index of transepithelial Na{sup +} transport, and total tissue conductance (G{sub t}). Aluminum, cadmium, chromium, copper, lead, mercury and zinc were studied separately as additives to the outer bath and yielded qualitatively similar results. Al has been most thoroughly examined. At 200 ppB (7.4 {micro}M) or more, and at pH 5.0 or below, Al inhibits both I{sub sc}more » and G{sub t}. Effects are precluded by the addition of amiloride, a diuretic that blocks Na{sup +} transport at the level of the Na{sup +} channel. Kinetic analysis reveals that Al and amiloride compete for a single binding site on the channel protein. At levels of 10 ppM, Al addition results in amiloride-insensitive increases in G{sub t} (10-fold or more) and I{sub sc} (20+ {micro}A/cm{sup 2}). Isotopic flux measurements suggest that these effects are due to an ``opening`` of epithelial tight junctions with passive, downhill diffusion of salt from inside to outside; the polarity of the resulting current reflects enhanced paracellular permeability with specificity for Cl{sup {minus}} over Na{sup +}. Varying medium pH indicates that Al{sup 3+} is the dominant species in each of the two effects. Al addition to the inner bathing medium was without effect despite access to the Na{sup +}-K{sup +}-ATPase. Contaminant metals may interfere with osmoregulation by impairing salt accumulation and by enlarging leak pathways through which solutes are lost to the environment.« less

[Effect of simulated inorganic anion leaching solution of electroplating sludge on the bioactivity of Acidithiobacillus ferrooxidans].

PubMed

Chen, Yan; Huang, Fang; Xie, Xin-Yuan

2014-04-01

An Acidithiobacillus ferrooxidans strain WZ-1 (GenBank sequence number: JQ968461) was used as the research object. The effects of Cl-, NO3-, F- and 4 kinds of simulated inorganic anions leaching solutions of electroplating sludge on the bioactivity of Fe2+ oxidation and apparent respiratory rate of WZ-1 were investigated. The results showed that Cl-, NO3(-)- didn't have any influence on the bioactivity of WZ-1 at concentrations of 5.0 g x L(-1), 1.0 g x L(-1), respectively. WZ-1 showed tolerance to high levels of Cl- and NO3- (about 10.0 g x L(-1), 5.0 g x L(-1), respectively), but it had lower tolerance to F- (25 mg x L(-1)). Different kinds of simulated inorganic anions leaching solutions of electroplating sludge had significant differences in terms of their effects on bioactivity of WZ-1 with a sequence of Cl-/NO3(-)/F(-) > or = NO3(-)/F(-) > Cl-/F(-) > Cl(-)/NO3(-).

Remediation of lead from lead electroplating industrial effluent using sago waste.

PubMed

Jeyanthi, G P; Shanthi, G

2007-01-01

Heavy metals are known toxicants, which inflict acute disorders to the living beings. Electroplating industries pose great threat to the environment through heavy load of metals in the wastewater discharged on land and water sources. In the present study, sago processing waste, which is both a waste and a pollutant, was used to adsorb lead ions from lead electroplating industrial effluent. Two types of sago wastes, namely, coarse sago waste and fine sago waste were used to study their adsorption capacity with the batch adsorption and Freundlich adsorption isotherm. The parameters that were considered for batch adsorption were pH (4, 5 and 6), time of contact (1, 2 and 3 hrs), temperature (30, 37 and 45 degrees C) and dosage of the adsorbent (2,4 and 6 g/L). The optimal condition for the effective removal of lead was found to be pH 5, time of contact 3 hrs, temperature 30 degrees C and dosage 4 g/L with coarse sago waste than fine sago waste.

Electroplating moulds using dry film thick negative photoresist

NASA Astrophysics Data System (ADS)

Kukharenka, E.; Farooqui, M. M.; Grigore, L.; Kraft, M.; Hollinshead, N.

2003-07-01

This paper reports on progress on the feasibility of fabricating moulds for electroplating using Ordyl P-50100 (negative) acrylate polymer based dry film photoresist, commercially available from Elga Europe (http://www.elgaeurope.it). We used this photoresist as an alternative to SU8 negative epoxy based photoresist, which is very difficult to process and remove after electroplating (Lorenz et al 1998 Microelectron. Eng. 41/42 371-4, Eyre et al 1998 Proc. MEMS'98 (Heidelberg) (Piscataway, NJ: IEEE) pp 218-22). Ordyl P-50100 is easy to work with and can be easily removed after processing. A single layer of Ordyl P-50100 was deposited by lamination up to 20 µm thickness. Thicker layers (200 µm and more) can be achieved with multilayer lamination using a manual laminator. For our applications we found that Ordyl P-50100 dry film photoresist is a very good alternative to SU8 for the realization of 100 µm high moulds. The results presented will open up new possibilities for low-cost LIGA-type processes for MEMS applications.

Microstructural Study on Oxidation Resistance of Nonmodified and Platinum Modified Aluminide Coating

NASA Astrophysics Data System (ADS)

Zagula-Yavorska, Maryana; Sieniawski, Jan

2014-03-01

Platinum electroplating layers (3 and 7 μm thick) were deposited on the surface of the Inconel 713 LC, CMSX 4, and Inconel 625 Ni-base superalloys. Diffusion treatment at 1050°C for 2 h under argon atmosphere was performed after electroplating. Diffusion treated samples were aluminized according to the low activity CVD process at 1050°C for 8 h. The nonmodified aluminide coatings consist of NiAl phase. Platinum modification let to obtain the (Ni,Pt)Al phase in coatings. The coated samples were subjected to cyclic oxidation testing at 1100°C. It was discovered that increase of the platinum electroplating thickness from 3 to 7 μm provides the improvement of oxidation resistance of aluminide coatings. Increase of the platinum thickness causes decreases in weight change and decreases in parabolic constant during oxidation. The platinum provides the pure Al2O3 oxide formation, slow growth oxide layer, and delay the oxide spalling during heating-cooling thermal cycles.

Electroplating chromium on CVD SiC and SiCf-SiC advanced cladding via PyC compatibility coating

NASA Astrophysics Data System (ADS)

Ang, Caen; Kemery, Craig; Katoh, Yutai

2018-05-01

Electroplating Cr on SiC using a pyrolytic carbon (PyC) bond coat is demonstrated as an innovative concept for coating of advanced fuel cladding. The quantification of coating stress, SEM morphology, XRD phase analysis, and debonding test of the coating on CVD SiC and SiCf-SiC is shown. The residual tensile stress (by ASTM B975) of electroplated Cr is > 1 GPa prior to stress relaxation by microcracking. The stress can remove the PyC/Cr layer from SiC. Surface etching of ∼20 μm and roughening to Ra > 2 μm (by SEM observation) was necessary for successful adhesion. The debonding strength (by ASTM D4541) of the coating on SiC slightly improved from 3.6 ± 1.4 MPa to 5.9 ± 0.8 MPa after surface etching or machining. However, this improvement is limited due to the absence of an interphase, and integrated CVI processing may be required for further advancement.

Influence of Annealing Temperature on Some Optical and Structural Properties of Cu2ZnSnS4 Deposited by CZT Co-Electrodeposition Coupled with Chemical Bath Technique

NASA Astrophysics Data System (ADS)

Okoth, Obila Jorim; Domtau, Dinfa Luka; Marina, Mukabi; John, Onyatta; Awuor, Ogacho Alex

Copper indium gallium selenide (CIGS) is currently most efficient thin film solar technology in use but it is faced with problems of material scarcity and toxicity. An alternative earth abundant and non-toxic materials consisting of Cu2ZnSnS4 (CZTS) have been investigated as a replacement for CIGS. In this work, CZTS thin films deposited by low cost co-electrodeposition, at a potential of -1.2V, coupled with chemical bath techniques at room temperature and then annealed under sulphur rich atmosphere were investigated. CZTS thin film quality determination was carried out using Raman spectroscopy which confirmed formation of quality CZTS film, main Raman peaks at 288cm-1 and 338cm-1 were observed. Electrical characterization was carried out using four-point probe instrument and the resistivity was in the order of ˜10-4Ω-cm. The optical characterization was done using UV-VIS-NIR spectrophotometer. The bandgaps of the annealed CZTS film ranged from 1.45 to 1.94eV with absorption coefficient of order ˜104cm-1 in the visible and near infrared range of the solar spectrum were observed.

Staining human lymphocytes and onion root cell nuclei with madder root.

PubMed

Cücer, N; Guler, N; Demirtas, H; Imamoğlu, N

2005-01-01

We performed staining experiments on cells using natural dyes and different mordants using techniques that are used for wool and silk dyeing. The natural dye sources were madder root, daisy, corn cockle and yellow weed. Ferrous sulfate, copper sulfate, potassium tartrate, urea, potassium aluminum sulfate and potassium dichromate were used as mordants. Distilled water, distilled water plus ethanol, heptane, and distilled water plus methanol were used as solvents. All dye-mordant-solvent combinations were studied at pH 2.4, 3.2 and 4.2. The generic staining procedure was to boil 5-10 onion roots or stimulated human lymphocyte (SHL) preparations in a dye bath on a hot plate. Cells were examined at every half hour. For multicolor staining, madder-dyed lymphocytes were decolorized, then stained with Giemsa. The AgNOR technique was performed following the decolorization of Giemsa stained lymphocytes. Good results were obtained for both onion root cells and lymphocytes that were boiled for 3 h in a dye bath that included 4 g madder root, 4 g ferrous sulfate as mordant in 50 ml of 1:1 (v/v) methanol:distilled water. The pH was adjusted to 4.2 with 6 ml acetic acid. We conclude that madder root has potential as an alternative dye for staining biological materials.

Heavy metal contamination and risk assessment in water, paddy soil, and rice around an electroplating plant.

PubMed

Liu, Jie; Zhang, Xue-Hong; Tran, Henry; Wang, Dun-Qiu; Zhu, Yi-Nian

2011-11-01

The objective of this paper is to assess the impact of long-term electroplating industrial activities on heavy metal contamination in agricultural soils and potential health risks for local residents. Water, soil, and rice samples were collected from sites upstream (control) and downstream of the electroplating wastewater outlet. The concentrations of heavy metals were determined by an atomic absorption spectrophotometer. Fractionation and risk assessment code (RAC) were used to evaluate the environmental risks of heavy metals in soils. The health risk index (HRI) and hazard index (HI) were calculated to assess potential health risks to local populations through rice consumption. Hazardous levels of Cu, Cr, and Ni were observed in water and paddy soils at sites near the plant. According to the RAC analysis, the soils showed a high risk for Ni and a medium risk for Cu and Cr at certain sites. The rice samples were primarily contaminated with Ni, followed by Cr and Cu. HRI values >1 were not found for any heavy metal. However, HI values for adults and children were 2.075 and 1.808, respectively. Water, paddy soil, and rice from the studied area have been contaminated by Cu, Cr, and Ni. The contamination of these elements is related to the electroplating wastewater. Although no single metal poses health risks for local residents through rice consumption, the combination of several metals may threaten the health of local residents. Cu and Ni are the key components contributing to the potential health risks.

Microbial Fuel Cell Inoculated with Ochrobactrum Tritici KCC210 for Chromium (VI) Measurement in Electroplating Wastewater

NASA Astrophysics Data System (ADS)

Kuo, Jongtar; Kuo, Juiling; Cheng, Chiuyu; Chung, Yingchien

2018-01-01

Many methods/techniques have been developed for Cr(VI) measurement, but they are often conducted offsite or/and cannot provide real-time for Cr(VI) monitoring. A microbial fuel cell (MFC) is a self-sustaining device and has great potential as a biosensor for in situ Cr(VI) measurement, especially for wastewater generated from different electroplating units. In this study, Ochrobactrum tritici KCC210, a facultatively anaerobic, Cr(VI)-reducing, and exoelectrogenic bacterium, was isolated and inoculated into the MFC to evaluate its feasibility as a Cr(VI) biosensor. The results indicated that O. tritici KCC210 exhibited high adaptability to pH, and temperature under anaerobic conditions. The maximum power density of the MFC biosensor was 17.5±0.9 mW/m2 at 2,000 Ω. A good linear relationship was observed between the Cr(VI) concentration (10-80 mg/L) and voltage output. The stable performance of the MFC biosensor indicated its potential as a reliable biosensor system. Moreover, the developed MFC biosensor is a simple device that can accurately measure Cr(VI) concentrations in the actual electroplating wastewater generated from different electroplating units within 15 min with low deviations (-1.8% to 7.8%) in comparison with the values determined using standard method. Thus, the MFC biosensor can measure Cr(VI) concentrations in situ in the effluents and has potential as an early warning detection device.

Total focusing method with correlation processing of antenna array signals

NASA Astrophysics Data System (ADS)

Kozhemyak, O. A.; Bortalevich, S. I.; Loginov, E. L.; Shinyakov, Y. A.; Sukhorukov, M. P.

2018-03-01

The article proposes a method of preliminary correlation processing of a complete set of antenna array signals used in the image reconstruction algorithm. The results of experimental studies of 3D reconstruction of various reflectors using and without correlation processing are presented in the article. Software ‘IDealSystem3D’ by IDeal-Technologies was used for experiments. Copper wires of different diameters located in a water bath were used as a reflector. The use of correlation processing makes it possible to obtain more accurate reconstruction of the image of the reflectors and to increase the signal-to-noise ratio. The experimental results were processed using an original program. This program allows varying the parameters of the antenna array and sampling frequency.

Heterogeneous Superconducting Low-Noise Sensing Coils

NASA Technical Reports Server (NTRS)

Hahn, Inseob; Penanen, Konstantin I.; Ho Eom, Byeong

2008-01-01

A heterogeneous material construction has been devised for sensing coils of superconducting quantum interference device (SQUID) magnetometers that are subject to a combination of requirements peculiar to some advanced applications, notably including low-field magnetic resonance imaging for medical diagnosis. The requirements in question are the following: The sensing coils must be large enough (in some cases having dimensions of as much as tens of centimeters) to afford adequate sensitivity; The sensing coils must be made electrically superconductive to eliminate Johnson noise (thermally induced noise proportional to electrical resistance); and Although the sensing coils must be cooled to below their superconducting- transition temperatures with sufficient cooling power to overcome moderate ambient radiative heat leakage, they must not be immersed in cryogenic liquid baths. For a given superconducting sensing coil, this combination of requirements can be satisfied by providing a sufficiently thermally conductive link between the coil and a cold source. However, the superconducting coil material is not suitable as such a link because electrically superconductive materials are typically poor thermal conductors. The heterogeneous material construction makes it possible to solve both the electrical- and thermal-conductivity problems. The basic idea is to construct the coil as a skeleton made of a highly thermally conductive material (typically, annealed copper), then coat the skeleton with an electrically superconductive alloy (typically, a lead-tin solder) [see figure]. In operation, the copper skeleton provides the required thermally conductive connection to the cold source, while the electrically superconductive coating material shields against Johnson noise that originates in the copper skeleton.

Transient Liquid Phase Bonding of Cu-Cr-Zr-Ti Alloy Using Ni and Mn Coatings: Microstructural Evolution and Mechanical Properties

NASA Astrophysics Data System (ADS)

Venkateswaran, T.; Ravi, K. R.; Sivakumar, D.; Pant, Bhanu; Janaki Ram, G. D.

2017-08-01

High-strength copper alloys are used extensively in the regenerative cooling parts of aerospace structures. Transient liquid phase (TLP) bonding of a Cu-Cr-Zr-Ti alloy was attempted in the present study using thin layers of elemental Ni and Mn coatings applied by electroplating. One of the base metals was given a Ni coating of 4 µm followed by a Mn coating of 15 µm, while the other base metal was given only the Ni coating (4 µm). The bonding cycle consisted of the following: TLP stage—heating to 1030 °C and holding for 15 min; homogenization stage—furnace cooling to 880 °C and holding for 2 h followed by argon quenching to room temperature. Detailed microscopy and electron probe microanalysis analysis of the brazed joints were carried out. The braze metal was found to undergo isothermal solidification within the 15 min of holding time at 1030 °C. At the end of TLP stage, the braze metal showed a composition of Cu-17Ni-9Mn (wt.%) at the center of the joint with a steep gradient in Ni and Mn concentrations from the center of the braze metal to the base metal interfaces. After holding for 2 h at 880 °C (homogenization stage), the compositional gradients were found to flatten significantly and the braze metal was found to develop a homogeneous composition of Cu-11Ni-7Mn (wt.%) at the center of the joint. In lap-shear tests, failures were always found to occur in the base metal away from the brazed region. The copper alloy base metal was found to undergo significant grain coarsening due to high-temperature exposure during brazing and, consequently, suffer considerable reduction in yield strength.

Investigation of Spray Cooling Schemes for Dynamic Thermal Management

NASA Astrophysics Data System (ADS)

Yata, Vishnu Vardhan Reddy

This study aims to investigate variable flow and intermittent flow spray cooling characteristics for efficiency improvement in active two-phase thermal management systems. Variable flow spray cooling scheme requires control of pump input voltage (or speed), while intermittent flow spray cooling scheme requires control of solenoid valve duty cycle and frequency. Several testing scenarios representing dynamic heat load conditions are implemented to characterize the overall performance of variable flow and intermittent flow spray cooling cases in comparison with the reference, steady flow spray cooling case with constant flowrate, continuous spray cooling. Tests are conducted on a small-scale, closed loop spray cooling system featuring a pressure atomized spray nozzle. HFE-7100 dielectric liquid is selected as the working fluid. Two types of test samples are prepared on 10 mm x 10 mm x 2 mm copper substrates with matching size thick film resistors attached onto the opposite side, to generate heat and simulate high heat flux electronic devices. The test samples include: (i) plain, smooth surface, and (ii) microporous surface featuring 100 ?m thick copper-based coating prepared by dual stage electroplating technique. Experimental conditions involve HFE-7100 at atmospheric pressure and 30°C and 10°C subcooling. Steady flow spray cooling tests are conducted at flow rates of 2-5 ml/cm2.s, by controlling the heat flux in increasing steps, and recording the corresponding steady-state temperatures to obtain cooling curves in the form of surface superheat vs. heat flux. Variable flow and intermittent flow spray cooling tests are done at selected flowrate and subcooling conditions to investigate the effects of dynamic flow conditions on maintaining the target surface temperatures defined based on reference steady flow spray cooling performance.

Study of the Fracture Mechanisms of Electroplated Metallization Systems Using In Situ Microtension Test

NASA Astrophysics Data System (ADS)

Msolli, Sabeur; Kim, Heung Soo

2018-07-01

This framework assesses the mechanical behavior of some potential thin/thick metallization systems in use as either ohmic contacts for diamond semi-conductors or for metallization on copper double bounded ceramic substrates present in the next-generation power electronics packaging. The interesting and unique characteristic of this packaging is the use of diamond as a semi-conductor material instead of silicon to increase the lifetime of embedded power converters for use in aeronautical applications. Theoretically, such packaging is able to withstand temperatures of up to 300 °C without breaking the semi-conductor, provided that the constitutive materials of the packaging are compatible. Metallization is very important to protect the chips and substrates. Therefore, we address this issue in the present work. The tested metallization systems are Ni/Au, Ni/Cr/Au and Ni/Cr. These specific systems were studied since they can be used in conjunction with existing bonding technologies, including AuGe soldering, Ag-In Transient liquid Phase Bonding and silver nanoparticle sintering. The metallization is achieved via electrodeposition, and a mechanical test, consisting of a microtension technique, is carried out at room temperature inside a scanning electron microscopy chamber. The technique permits observations the cracks initiation and growth in the metallization to locate the deformation zones and identify the fracture mechanisms. Different failure mechanisms were shown to occur depending on the metallic layers deposited on top of the copper substrate. The density of these cracks depends on the imposed load and the involved metallization. These observations will help choose the metallization that is compatible with the particular bonding material, and manage mechanical stress due to thermal cycling so that they can be used as a constitutive component for high-temperature power electronics packaging.

Study of the Fracture Mechanisms of Electroplated Metallization Systems Using In Situ Microtension Test

NASA Astrophysics Data System (ADS)

Msolli, Sabeur; Kim, Heung Soo

2018-03-01

This framework assesses the mechanical behavior of some potential thin/thick metallization systems in use as either ohmic contacts for diamond semi-conductors or for metallization on copper double bounded ceramic substrates present in the next-generation power electronics packaging. The interesting and unique characteristic of this packaging is the use of diamond as a semi-conductor material instead of silicon to increase the lifetime of embedded power converters for use in aeronautical applications. Theoretically, such packaging is able to withstand temperatures of up to 300 °C without breaking the semi-conductor, provided that the constitutive materials of the packaging are compatible. Metallization is very important to protect the chips and substrates. Therefore, we address this issue in the present work. The tested metallization systems are Ni/Au, Ni/Cr/Au and Ni/Cr. These specific systems were studied since they can be used in conjunction with existing bonding technologies, including AuGe soldering, Ag-In Transient liquid Phase Bonding and silver nanoparticle sintering. The metallization is achieved via electrodeposition, and a mechanical test, consisting of a microtension technique, is carried out at room temperature inside a scanning electron microscopy chamber. The technique permits observations the cracks initiation and growth in the metallization to locate the deformation zones and identify the fracture mechanisms. Different failure mechanisms were shown to occur depending on the metallic layers deposited on top of the copper substrate. The density of these cracks depends on the imposed load and the involved metallization. These observations will help choose the metallization that is compatible with the particular bonding material, and manage mechanical stress due to thermal cycling so that they can be used as a constitutive component for high-temperature power electronics packaging.

Facile fabrication of uniform hierarchical structured (UHS) nanocomposite surface with high water repellency and self-cleaning properties

NASA Astrophysics Data System (ADS)

Bagheri, H.; Aliofkhazraei, M.; Forooshani, H. Mojiri; Rouhaghdam, A. Sabour

2018-04-01

In the present study, two-stage process for the fabrication of superhydrophobic Ni-Cu-TiO2 nanocomposite coatings on the copper substrate has been introduced. Surface modification was performed on the electrodeposited coatings by myristic acid-ethanol solution to achieve superhydrophobicity. Additionally, in order to further study the roughness effect, instead of addition of copper ions in electrodeposition bath, three substrates were roughened by electrochemical etching method. Water repellency properties were studied through measurement of static and dynamic contact angles, and performing bouncing test, self-cleaning and water-jet evaluation. The samples were electrodeposited in various current densities, and the highest corrosion resistance and water repellency properties were obtained for the sample which was electrodeposited in two consecutive steps and modified by a fatty acid called myristic acid (which significantly reduces surface energy of the coating). The highest water contact angle (161°) and the lowest contact angle hysteresis (3°) were obtained for the sample which was coated by 10 mA/cm2 (144 min) and 20 mA/cm2 (18 min), respectively. Since this approach does not require any sophisticated equipment and materials, it shows promising future in the fabrication of superhydrophobic coatings.

Sealed substrate carrier for electroplating

DOEpatents

Ganti, Kalyana Bhargava [Fremont, CA

2012-07-17

One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The substrate carrier includes a non-conductive carrier body on which the substrates are held, and conductive lines are embedded within the carrier body. A conductive bus bar is embedded into a top side of the carrier body and is conductively coupled to the conductive lines. A thermoplastic overmold covers a portion of the bus bar, and there is a plastic-to-plastic bond between the thermoplastic overmold and the non-conductive carrier body. Other embodiments, aspects and features are also disclosed.

Electroplating method and apparatus

DOEpatents

Looney, Robert B.; Smith, William E. L.

1978-06-20

An apparatus for high speed electroplating or anodizing tubular members such as nuclear reactor fuel elements. A loading arm positions the member on a base for subsequent support by one of two sets of electrical contacts. A carriage assembly positions electrodes into and around the member. Electrolyte is pumped between the electrodes and the member while electric current is applied. Programmed controls sequentially employ each of the two sets of contacts to expose all surfaces of the member to the electrolyte. The member is removed from the apparatus by an unloading arm.

Cyclotron production of {sup 61}Cu using natural Zn and enriched {sup 64}Zn targets

DOE Office of Scientific and Technical Information (OSTI.GOV)

Asad, A. H.; Smith, S. V.; Chan, S.

2012-12-19

Copper-61 ({sup 61}Cu) shares with {sup 64}Cu certain advantages for PET diagnostic imaging, but has a shorter half-life (3.4hr vs. 12.7hr) and a greater probability of positron production per disintegration (61% vs. 17.9%). One important application is for in vivo imaging of hypoxic tissue. In this study {sup 61}Cu was produced using the {sup 64}Zn(p,{alpha}){sup 61}Cu reaction on natural Zn or enriched {sup 64}Zn targets. The enriched {sup 64}Zn (99.82%) was electroplated onto high purity gold or silver foils or onto thin Al discs. A typical target bombardment used 30{mu}A; at 11.7, 14.5 or 17.6MeV over 30-60min. The {sup 61}Cumore » (radiochemical purity of >95%) was separated using a combination of cation and anion exchange columns. The {sup 64}Zn target material was recovered after each run, for re-use. In a direct comparison with enriched {sup 64}Zn-target results, {sup 61}Cu production using the cheaper {sup nat}Zn target proved to be an effective alternative.« less

Effect of pulsed laser parameters on the corrosion limitation for electric connector coatings

NASA Astrophysics Data System (ADS)

Georges, C.; Semmar, N.; Boulmer-Leborgne, C.

2006-12-01

Materials used in electrical contact applications are usually constituted of multilayered compounds (e.g.: copper alloy electroplated with a nickel layer and finally by a gold layer). After the electro-deposition, micro-channels and pores within the gold layer allow undesirable corrosion of the underlying protection. In order to modify the gold-coating microstructure, a laser surface treatment was applied. The laser treatment suppressing porosity and smoothing the surface sealed the original open structure as a low roughness allows a good electrical contact. Corrosion tests were carried out in humid synthetic air containing three polluting gases. SEM characterization of cross-sections was performed to estimate the gold melting depth and to observe the modifications of gold structure obtained after laser treatment. The effects of the laser treatment were studied according to different surface parameters (roughness of the substrate and thickness of the gold layer) and different laser parameters (laser wavelength, laser fluence, pulse duration and number of pulses). A thermokinetic model was used to understand the heating and melting mechanism of the multilayered coating to optimize the process in terms of laser wavelength, energy and time of interaction.

Wolter-Schwarzschild optics for the extreme-ultraviolet - The Berkeley stellar spectrometer and the EUV Explorer

NASA Technical Reports Server (NTRS)

Malina, R. F.; Bowyer, S.; Finley, D.; Cash, W.

1979-01-01

The design, fabrication and performance of two Wolter-Schwarzschild grazing incidence optics are described. Both telescopes have been figured by single point diamond turning and have achieved better than 15-arcsec on-axis imaging. The telescope for the stellar spectrometer is an f/10 Type II system with an effective area of 225 sq cm at 250 A and 300 cm2 at 500 A. The primary has a maximum diameter of 38 cm and was fabricated in three elements. The copper-plated aluminum substrate was diamond turned; following nickel plating, the surface was polished and coated with evaporated gold. The performance during a sounding rocket flight is discussed. The prototype telescope for the Extreme Ultraviolet Explorer is an f/1.24 Type I system with an effective field of view of 5.0-deg diameter. The telescope has a maximum diameter of 40 cm and was fabricated as a single element. The aluminum substrate is to be diamond turned; the nickel plated surface will be polished and electroplated with gold. The design choice and defocusing optimization aimed at maximizing the field of view and number of image pixels is examined.

Development of High Power Density Micro-Thermoelectric Generators

NASA Astrophysics Data System (ADS)

Zhang, Wenhua

Thermoelectric generators (TEGs) are promising for the waste heat recovery in virtue of the ability to directly convert heat to electricity. Despite of their relatively low energy conversion efficiency, TEGs have many advantages including high reliability, long lifetime, and environmental friendliness. Especially, compared to conventional heat engines, TEGs are compact, scalable, and can be easily driven by small temperature differences. Potential applications of TEGs include thermal sensing, thermal management, and thermal energy harvesting to power wireless sensors and microelectronic devices such as wearable medical sensors and wristwatches. This dissertation presents my work on development of high power density non-flexible and flexible micro-TEGs for thermal energy harvesting in the ambient environment. Micro- TEGs are developed by a bottom-up approach combing electroplating and microfabrication processes. Pulsed electroplating is mainly adopted to deposit thermoelectric materials in the device fabrication. First, I collaborated with Dr. Zhou in our lab and systematically studied the effect of deposition parameters on composition, microstructure, and thermoelectric properties of the electroplated Bi2Te3 and Sb2 Te3 thin films. We demonstrated that thermoelectric properties of both Bi2Te3 and Sb2Te3 films can be enhanced by tuning the pulse off-to-on ratio. After the fundamental study on the deposition conditions, morphology, and thermoelectric properties of the electroplated materials, we fabricated a high power density cross-plane micro-TEG on the SiO2/Si substrate by integrating the pulsed electroplating with microfabrication processes. The TEG consists of a total of 127 pairs of n-type Bi2Te3 and ptype Sb2Te3 thermoelectric pillars embedded in a SU-8 matrix to enhance the overall mechanical strength of the device. Both bottom and top electrical connections are formed by electroplating, which is advantageous because of facile and low cost fabrication and low parasitic electrical resistances. The device demonstrates a maximum power of 2990 muW at a temperature difference of 52.5 K, corresponding to a power density as high as 9.2 mW cm-2. The power density of our device is more than two times the highest value reported for the electroplated micro-TEGs in the literature, which can be attributed to the low internal resistance and high packing density of thermoelectric pillars. Based on my work on non-flexible micro-TEGs, I further modified the device fabrication process and developed an ultra-light high power density flexible micro-TEG. The flexible TEG demonstrates excellent flexibility. No obvious electrical resistance change was observed after bending to a curvature as small as 5 mm for 600 times. The flexible micro-TEG we developed demonstrates a maximum power of 1.5 mW at a temperature difference of 50.7 K, corresponding to a power density of 4.5 mW cm-2. More importantly, the flexible TEG is ultra-light and an unprecedentedly high power per unit mass of 60 mW g-1 is achieved, which might be beneficial for wearable technology.

Chronic occupational exposure to hexavalent chromium causes DNA damage in electroplating workers.

PubMed

Zhang, Xu-Hui; Zhang, Xuan; Wang, Xu-Chu; Jin, Li-Fen; Yang, Zhang-Ping; Jiang, Cai-Xia; Chen, Qing; Ren, Xiao-Bin; Cao, Jian-Zhong; Wang, Qiang; Zhu, Yi-Min

2011-04-12

Occupational exposure to chromium compounds may result in adverse health effects. This study aims to investigate whether low-level hexavalent chromium (Cr(VI)) exposure can cause DNA damage in electroplating workers. 157 electroplating workers and 93 control subjects with no history of occupational exposure to chromium were recruited in Hangzhou, China. Chromium levels in erythrocytes were determined by graphite furnace atomic absorption spectrophotometer. DNA damage in peripheral lymphocytes was evaluated with the alkaline comet assay by three parameters: Olive tail moment, tail length and percent of DNA in the comet tail (tail DNA%). Urinary 8-OHdG levels were measured by ELISA. Chromium concentration in erythrocytes was about two times higher in electroplating workers (median: 4.41 μg/L) than that in control subjects (1.54 μg/L, P < 0.001). The medians (range) of Olive tail moment, tail length and tail DNA% in exposed workers were 1.13 (0.14-6.77), 11.17 (3.46-52.19) and 3.69 (0.65-16.20), and were significantly higher than those in control subjects (0.14 (0.01-0.39), 3.26 (3.00-4.00) and 0.69 (0.04-2.74), P < 0.001). Urinary 8-OHdG concentration was 13.65 (3.08-66.30) μg/g creatinine in exposed workers and 8.31 (2.94-30.83) μg/g creatinine in control subjects (P < 0.001). The differences of urinary 8-OHdG levels, Olive tail moment, tail length and tail DNA% between these two groups remained significant (P < 0.001) even after stratification by potential confounding factors such as age, gender, and smoking status. Chromium exposure was found to be positively associated with chromium levels in erythrocytes, urinary 8-OHdG levels, Olive tail moment, tail length and tail DNA%. Positive dose-response associations were also found between chromium levels in erythrocytes and Olive tail moment, tail length and tail DNA%. The findings in this study indicated that there was detectable chromium exposure in electroplating workers. Low-level occupational chromium exposure induced DNA damage.

Chronic occupational exposure to hexavalent chromium causes DNA damage in electroplating workers

PubMed Central

2011-01-01

Background Occupational exposure to chromium compounds may result in adverse health effects. This study aims to investigate whether low-level hexavalent chromium (Cr(VI)) exposure can cause DNA damage in electroplating workers. Methods 157 electroplating workers and 93 control subjects with no history of occupational exposure to chromium were recruited in Hangzhou, China. Chromium levels in erythrocytes were determined by graphite furnace atomic absorption spectrophotometer. DNA damage in peripheral lymphocytes was evaluated with the alkaline comet assay by three parameters: Olive tail moment, tail length and percent of DNA in the comet tail (tail DNA%). Urinary 8-OHdG levels were measured by ELISA. Results Chromium concentration in erythrocytes was about two times higher in electroplating workers (median: 4.41 μg/L) than that in control subjects (1.54 μg/L, P < 0.001). The medians (range) of Olive tail moment, tail length and tail DNA% in exposed workers were 1.13 (0.14-6.77), 11.17 (3.46-52.19) and 3.69 (0.65-16.20), and were significantly higher than those in control subjects (0.14 (0.01-0.39), 3.26 (3.00-4.00) and 0.69 (0.04-2.74), P < 0.001). Urinary 8-OHdG concentration was 13.65 (3.08-66.30) μg/g creatinine in exposed workers and 8.31 (2.94-30.83) μg/g creatinine in control subjects (P < 0.001). The differences of urinary 8-OHdG levels, Olive tail moment, tail length and tail DNA% between these two groups remained significant (P < 0.001) even after stratification by potential confounding factors such as age, gender, and smoking status. Chromium exposure was found to be positively associated with chromium levels in erythrocytes, urinary 8-OHdG levels, Olive tail moment, tail length and tail DNA%. Positive dose-response associations were also found between chromium levels in erythrocytes and Olive tail moment, tail length and tail DNA%. Conclusion The findings in this study indicated that there was detectable chromium exposure in electroplating workers. Low-level occupational chromium exposure induced DNA damage. PMID:21481275

Feasibility of constructed wetland planted with Leersia hexandra Swartz for removing Cr, Cu and Ni from electroplating wastewater.

PubMed

You, Shao-Hong; Zhang, Xue-Hong; Liu, Jie; Zhu, Yi-Nian; Gu, Chen

2014-01-01

As a low-cost treatment technology for effluent, the constructed wetlands can be applied to remove the heavy metals from wastewater. Leersia hexandra Swartz is a metal-accumulating hygrophyte with great potential to remove heavy metal from water. In this study, two pilot-scale constructed wetlands planted with L. hexandra (CWL) were set up in greenhouse to treat electroplating wastewater containing Cr, Cu and Ni. The treatment performance of CWL under different hydraulic loading rates (HLR) and initial metal concentrations were also evaluated. The results showed that CWL significantly reduced the concentrations of Cr, Cu and Ni in wastewater by 84.4%, 97.1% and 94.3%, respectively. High HLR decreased the removal efficiencies of Cr, Cu and Ni; however, the heavy metal concentrations in effluent met Emission Standard of Pollutants for Electroplating in China (ESPE) at HLR less than 0.3 m3/m2 d. For the influent of 5 mg/L Cr, 10 mg/L Cu and 8 mg/L Ni, effluent concentrations were below maximum allowable concentrations in ESPE, indicating that the removal of Cr, Cu and Ni by CWL was feasible at considerably high influent metal concentrations. Mass balance showed that the primary sink for the retention of contaminants within the constructed wetland system was the sediment, which accounted for 59.5%, 83.5%, and 73.9% of the Cr, Cu and Ni, respectively. The data from the pilot wetlands support the view that CWL could be used to successfully remove Cr, Cu and Ni from electroplating wastewater.

Biomarkers of oxidative stress in electroplating workers exposed to hexavalent chromium.

PubMed

Pan, Chih-Hong; Jeng, Hueiwang Anna; Lai, Ching-Huang

2018-01-01

This study evaluates levels of biomarkers of oxidative DNA damage and lipid peroxidation in 105 male workers at 16 electroplating companies who had been exposed to hexavalent chromium (Cr(VI)). The study participants were 230 non-smoking male workers, comprising 105 electroplating workers who had been exposed to chromium and 125 control subjects who performed office tasks. Personal air samples, spot urine samples, hair samples, fingernail samples and questionnaires were used to quantify exposure to Cr(VI), oxidative DNA damage, lipid peroxidation, and environmental pollutants. Both the geometric mean personal concentrations of Cr(VI) of the Cr-exposed workers and the total Cr concentrations in the air to which they were exposed significantly exceeded those for the control subjects. The geometric mean concentrations of Cr in urine, hair and fingernails, and the urinary 8-hydroxy-2'-deoxyguanosine (8-OHdG), and malondialdehyde (MDA) levels in the Cr(VI) exposed workers exceeded those in the control subjects. Daily cumulative Cr(VI) exposure and urinary Cr were significantly correlated with urinary 8-OHdG levels following adjustments for covariates. A ten-fold increase in urinary Cr level was associated with a 1.73-fold increase in urinary 8-OHdG level. Daily cumulative Cr(VI) exposure and urinary Cr level were significantly correlated with urinary MDA level following adjustments for covariates. A ten-fold increase in urinary Cr was associated with a 1.45-fold increase in urinary MDA. Exposure to Cr(VI) increased oxidative DNA injury and the oxidative deterioration of lipids in electroplating workers.

Multiple heavy metals extraction and recovery from hazardous electroplating sludge waste via ultrasonically enhanced two-stage acid leaching.

PubMed

Li, Chuncheng; Xie, Fengchun; Ma, Yang; Cai, Tingting; Li, Haiying; Huang, Zhiyuan; Yuan, Gaoqing

2010-06-15

An ultrasonically enhanced two-stage acid leaching process on extracting and recovering multiple heavy metals from actual electroplating sludge was studied in lab tests. It provided an effective technique for separation of valuable metals (Cu, Ni and Zn) from less valuable metals (Fe and Cr) in electroplating sludge. The efficiency of the process had been measured with the leaching efficiencies and recovery rates of the metals. Enhanced by ultrasonic power, the first-stage acid leaching demonstrated leaching rates of 96.72%, 97.77%, 98.00%, 53.03%, and 0.44% for Cu, Ni, Zn, Cr, and Fe respectively, effectively separated half of Cr and almost all of Fe from mixed metals. The subsequent second-stage leaching achieved leaching rates of 75.03%, 81.05%, 81.39%, 1.02%, and 0% for Cu, Ni, Zn, Cr, and Fe that further separated Cu, Ni, and Zn from mixed metals. With the stabilized two-stage ultrasonically enhanced leaching, the resulting over all recovery rates of Cu, Ni, Zn, Cr and Fe from electroplating sludge could be achieved at 97.42%, 98.46%, 98.63%, 98.32% and 100% respectively, with Cr and Fe in solids and the rest of the metals in an aqueous solution discharged from the leaching system. The process performance parameters studied were pH, ultrasonic power, and contact time. The results were also confirmed in an industrial pilot-scale test, and same high metal recoveries were performed. Copyright 2010 Elsevier B.V. All rights reserved.

Efficient removal of sulfur hexafluoride (SF6) through reacting with recycled electroplating sludge.

PubMed

Zhang, Jia; Zhou, Ji Zhi; Liu, Qiang; Qian, Guangren; Xu, Zhi Ping

2013-06-18

This paper reports that recycled electroplating sludge is able to efficiently remove greenhouse gas sulfur hexafluoride (SF6). The removal process involves various reactions of SF6 with the recycled sludge. Remarkably, the sludge completely removed SF6 at a capacity of 1.10 mmol/g (SF6/sludge) at 600 °C. More importantly, the evolved gases were SO2, SiF4, and a limited amount of HF, with no toxic SOF4, SO2F2, or SF4 being detected. These generated gases can be readily captured and removed by NaOH solution. The reacted solids were further found to be various metal fluorides, thus revealing that SF6 removal takes place by reacting with various metal oxides and silicate in the sludge. Moreover, the kinetic investigation revealed that the SF6 reaction with the sludge is a first-order chemically controlled process. This research thus demonstrates that the waste electroplating sludge can be potentially used as an effective removal agent for one of the notorious greenhouse gases, SF6.