Process for preparing superconducting film having substantially uniform phase development

DOEpatents

Bharacharya, Raghuthan; Parilla, Philip A.; Blaugher, Richard D.

1995-01-01

A process for preparing a superconducting film, such as a thallium-barium-calcium-copper oxide superconducting film, having substantially uniform phase development. The process comprises providing an electrodeposition bath having one or more soluble salts of one or more respective potentially superconducting metals in respective amounts adequate to yield a superconducting film upon subsequent appropriate treatment. Should all of the metals required for producing a superconducting film not be made available in the bath, such metals can be a part of the ambient during a subsequent annealing process. A soluble silver salt in an amount between about 0.1% and about 4.0% by weight of the provided other salts is also provided to the bath, and the bath is electrically energized to thereby form a plated film. The film is annealed in ambient conditions suitable to cause formation of a superconductor film. Doping with silver reduces the temperature at which the liquid phase appears during the annealing step, initiates a liquid phase throughout the entire volume of deposited material, and influences the nucleation and growth of the deposited material.

Process for preparing superconducting film having substantially uniform phase development

DOEpatents

Bharacharya, R.; Parilla, P.A.; Blaugher, R.D.

1995-12-19

A process is disclosed for preparing a superconducting film, such as a thallium-barium-calcium-copper oxide superconducting film, having substantially uniform phase development. The process comprises providing an electrodeposition bath having one or more soluble salts of one or more respective potentially superconducting metals in respective amounts adequate to yield a superconducting film upon subsequent appropriate treatment. Should all of the metals required for producing a superconducting film not be made available in the bath, such metals can be a part of the ambient during a subsequent annealing process. A soluble silver salt in an amount between about 0.1% and about 4.0% by weight of the provided other salts is also provided to the bath, and the bath is electrically energized to thereby form a plated film. The film is annealed in ambient conditions suitable to cause formation of a superconductor film. Doping with silver reduces the temperature at which the liquid phase appears during the annealing step, initiates a liquid phase throughout the entire volume of deposited material, and influences the nucleation and growth of the deposited material. 3 figs.

Laser-induced selective metallization of polypropylene doped with multiwall carbon nanotubes

NASA Astrophysics Data System (ADS)

Ratautas, Karolis; Gedvilas, Mindaugas; Stankevičiene, Ina; Jagminienė, Aldona; Norkus, Eugenijus; Pira, Nello Li; Sinopoli, Stefano; Račiukaitis, Gediminas

2017-08-01

Moulded interconnect devices (MID) offer the material, weight and cost saving by integration electronic circuits directly into polymeric components used in automotive and other consumer products. Lasers are used to write circuits directly by modifying the surface of polymers followed by an electroless metal plating. A new composite material - the polypropylene doped with multiwall carbon nanotubes was developed for the laser-induced selective metallization. Mechanism of surface activation by laser irradiation was investigated in details utilising pico- and nanoseconds lasers. Deposition of copper was performed in the autocatalytic electroless plating bath. The laser-activated polymer surfaces have been studied using the Raman spectroscopy and scanning electron microscope (SEM). Microscopic images revealed that surface becomes active only after its melting by a laser. Alterations in the Raman spectra of the D and G bands indicated the clustering of carbon additives in the composite material. Optimal laser parameters for the surface activation were found by measuring a sheet resistance of the finally metal-plated samples. A spatially selective copper plating was achieved with the smallest conductor line width of 22 μm at the laser scanning speed of 3 m/s and the pulse repetition rate of 100 kHz. Finally, the technique was validated by making functional electronic circuits by this MID approach.

Magnetic Fe-Co films electroplated in a deep-eutectic-solvent-based plating bath

NASA Astrophysics Data System (ADS)

Yanai, T.; Shiraishi, K.; Watanabe, Y.; Ohgai, T.; Nakano, M.; Suzuki, K.; Fukunaga, H.

2015-05-01

We fabricated Fe-Co films from a deep eutectic solvent (DES)-based plating bath and investigated magnetic properties of the plated films. The plating baths were obtained by stirring the mixture of choline chloride, ethylene glycol, FeCl2.4H2O, and CoCl2.6H2O. The composition of the plated films depended on the amount of FeCl2.4H2O in the plating bath, and Fe content of the films was varied from 0 to 100 at. %. Depending on the Fe content, the saturation magnetization and the coercivity of the films varied. The Fe76Co24 film shows high saturation magnetization and smooth surface, and the change in the saturation magnetization shows good agreement with the expected change by the Slater-Pauling curve. High current efficiency (>90%) could be obtained in the wide film composition. From these results, we concluded that the DES-based plating bath is one of effective baths for the Fe-Co films with high current efficiency.

GOLD PLATING PROCESS

DOEpatents

Seegmiller, R.

1957-08-01

An improved bath is reported for plating gold on other metals. The composition of the plating bath is as follows: Gold cyanide from about 15 to about 50 grams, potassium cyanide from about 70 to about 125 grams, and sulfonated castor oil from about 0.1 to about 10 cc. The gold plate produced from this bath is smooth, semi-hard, and nonporous.

Cadmium plating replacements

NASA Technical Reports Server (NTRS)

Nelson, Mary J.; Groshart, Earl C.

1995-01-01

The Boeing Company has been searching for replacements to cadmium plate. Two alloy plating systems seem close to meeting the needs of a cadmium replacement. The two alloys, zinc-nickel and tin-zinc are from alloy plating baths; both baths are neutral pH. The alloys meet the requirements for salt fog corrosion resistance, and both alloys excel as a paint base. Currently, tests are being performed on standard fasteners to compare zinc-nickel and tin-zinc on threaded hardware where cadmium is heavily used. The Hydrogen embrittlement propensity of the zinc-nickel bath has been tested, and just beginning for the tin-zinc bath. Another area of interest is the electrical properties on aluminum for tin-zinc and will be discussed. The zinc-nickel alloy plating bath is in production in Boeing Commercial Airplane Group for non-critical low strength steels. The outlook is promising that these two coatings will help The Boeing Company significantly reduce its dependence on cadmium plating.

Preparation and characterization of Ni-P/Ni3.1B composite alloy coatings

NASA Astrophysics Data System (ADS)

Wang, Yurong; He, Jiawei; Wang, Wenchang; Shi, Jianhua; Mitsuzaki, Naotoshi; Chen, Zhidong

2014-02-01

The preparation of Ni-P/Ni3.1B composite alloy coating on the surface of copper was achieved by co-deposition of Ni3.1B nanoparticles with Ni-P coating during electroless plating. Ni-P-B alloy coating was obtained by heat-treating the as-plated Ni-P/Ni3.1B composite coating. The effect of the concentration of sodium alginate, borax, thiourea, Ni3.1B, temperature, and pH value on the deposition rate and B content were investigated and determined to be: 30 g L-1, 10 g L-1, 2 mg L-1, 20 mg L-1, 70 °C and 9.0 , respectively. Sodium alginate and thiourea were played as surfactant for coating Ni3.1B nanoparticles and stabilizer for the plating bath, respectively. Ni-P/Ni3.1B composite coating had good performance such as corrosion resistance and solderability.

Electroplated Fe-Co-Ni films prepared from deep-eutectic-solvent-based plating baths

NASA Astrophysics Data System (ADS)

Yanai, Takeshi; Shiraishi, Kotaro; Akiyoshi, Toshiki; Azuma, Keita; Watanabe, Yoshimasa; Ohgai, Takeshi; Morimura, Takao; Nakano, Masaki; Fukunaga, Hirotoshi

2016-05-01

We fabricated soft magnetic films from DES-based plating baths, and investigated magnetic properties of the plated films. The plating baths were obtained by stirring the mixture of choline chloride, ethylene glycol, FeCl2 ṡ 4H2O, NiCl2 ṡ 6H2O and CoCl2 ṡ 6H2O. The composition of the electroplated film depended on the amount of the reagent in the plating bath, and we consequently obtained the films with various composition. The current efficiency of the plating process shows high values (> 88 %) in the wide composition range. The soft magnetic films with low coercivity were obtained at the Fe compositions of ≈ 30 at.% and > 80 at.%, and we found that low coercivity could be realized by the control of the film composition. We also found that the Fe-rich films prepared from DES-based plating bath have some advantages as a soft magnetic phase for a nanocomposite magnet due to their high saturation magnetization and very fine crystal structure.

A Water Model Study on Mixing Behavior of the Two-Layered Bath in Bottom Blown Copper Smelting Furnace

NASA Astrophysics Data System (ADS)

Shui, Lang; Cui, Zhixiang; Ma, Xiaodong; Jiang, Xu; Chen, Mao; Xiang, Yong; Zhao, Baojun

2018-05-01

The bottom-blown copper smelting furnace is a novel copper smelter developed in recent years. Many advantages of this furnace have been found, related to bath mixing behavior under its specific gas injection scheme. This study aims to use an oil-water double-phased laboratory-scale model to investigate the impact of industry-adjustable variables on bath mixing time, including lower layer thickness, gas flow rate, upper layer thickness and upper layer viscosity. Based on experimental results, an overall empirical relationship of mixing time in terms of these variables has been correlated, which provides the methodology for industry to optimize mass transfer in the furnace.

Ion chromatography in the manufacture of multilayer circuit boards

NASA Astrophysics Data System (ADS)

Smith, R. E.

1987-10-01

Ion chromatography (IC) has proven useful in analyzing chemical solutions used in the manufacture of multilayer circuit boards. IC provides results on ions not expected in the production solutions. Thus, solution contamination and breakdown products can be monitored in every phase of the circuit board manufacturing. During the first phase, epoxy laminates experience an etchback, first in chromic acid, which can be analyzed for trace chloride and sulfate, then in ammonium bifluoride/HCl, which can be analyzed for fluoride and chloride. Following a wet blasting to roughen up the surface, 20 mu in. of copper are deposited using an electroless bath. Again, IC is applicable for monitoring formate, tartarate, and sulfate levels. Next, an acid copper bath is used to electroplate the through holes with 0.001 in. of ductile copper. This bath is analyzed for trace chloride. Photoimaging is then performed, and the organic solvents used can be assayed for trace ionic chloride. Finally, a fluoroboric acid-based tin-lead bath is used to deposit a solderable alloy. This bath is analyzed for total fluoroborate, tin, and lead. In addition, mobile phase ion chromatography (MPIC) is used to monitor the nonionic organic brighteners in the baths.

Ion chromatography in the manufacture of multilayer circuit boards

NASA Astrophysics Data System (ADS)

Smith, Robert E.

1990-01-01

Ion chromatography (IC) has proven useful in analyzing chemical solutions used in the manufacture of multilayer circuit boards. Unlike other chemical quantification techniques, IC provides results on ions not expected in the production solutions. Thus, solution contamination and break-down products can be monitored in every phase of the circuit board manufacturing. During the first phase, epoxy laminates experience an etchback, first in chromic acid, which can be analyzed for trace chloride and sulfate, then in ammonium bifluoride/HCl, which can be analyzed for fluoride and chloride. Following a wet-blasting to roughen up the surface, 20 microinches of copper are deposited using an electroless bath. Again, IC is applicable for monitoring formate, tartarate, and sulfate levels. Next, an acid copper bath is used to electroplate the through holes with 0.001 inches of ductile copper. This bath is analyzed for trace chloride. Photoimaging is then performed, and the organic solvents used can be assayed for trace ionic chloride. Finally, a fluoroboric acid-based tin-lead bath is used to deposit a solderable alloy. This bath is analyzed for fluoroborate, tin, and lead. In addition, mobile phase ion chromatography (MPIC) is used to monitor the nonionic organic brighteners in the baths.

Method of forming oxide coatings. [for solar collector heating panels

NASA Technical Reports Server (NTRS)

Mcdonald, G. E. (Inventor)

1983-01-01

This invention is concerned with an improved plating process for covering a substrate with a black metal oxide film. The invention is particularly directed to making a heating panel for a solar collector. A compound is electrodeposited from an aqueous solution containing cobalt metal salts onto a metal substrate. This compound is converted during plating into a black, highly absorbing oxide coating which contains hydrated oxides. This is achieved by the inclusion of an oxidizing agent in the plating bath. The inclusion of an oxidizing agent in the plating bath is contrary to standard electroplating practice. The hydrated oxides are converted to oxides by treatment in a hot bath, such as boiling water. An oxidizing agent may be added to the hot liquid treating bath.

Method for regeneration of electroless nickel plating solution

DOEpatents

Eisenmann, Erhard T.

1997-01-01

An electroless nickel(EN)/hypophosphite plating bath is provided employing acetic acid/acetate as a buffer and which is, as a result, capable of perpetual regeneration while avoiding the production of hazardous waste. A regeneration process is provided to process the spent EN plating bath solution. A concentrated starter and replenishment solution is provided for ease of operation of the plating bath. The regeneration process employs a chelating ion exchange system to remove nickel cations from spent EN plating solution. Phosphites are then removed from the solution by precipitation. The nickel cations are removed from the ion exchange system by elution with hypophosphorous acid and the nickel concentration of the eluate adjusted by addition of nickel salt. The treated solution and adjusted eluate are combined, stabilizer added, and the volume of resulting solution reduced by evaporation to form the bath starter and replenishing solution.

Method for regeneration of electroless nickel plating solution

DOEpatents

Eisenmann, E.T.

1997-03-11

An electroless nickel(EN)/hypophosphite plating bath is provided employing acetic acid/acetate as a buffer and which is, as a result, capable of perpetual regeneration while avoiding the production of hazardous waste. A regeneration process is provided to process the spent EN plating bath solution. A concentrated starter and replenishment solution is provided for ease of operation of the plating bath. The regeneration process employs a chelating ion exchange system to remove nickel cations from spent EN plating solution. Phosphites are then removed from the solution by precipitation. The nickel cations are removed from the ion exchange system by elution with hypophosphorus acid and the nickel concentration of the eluate adjusted by addition of nickel salt. The treated solution and adjusted eluate are combined, stabilizer added, and the volume of resulting solution reduced by evaporation to form the bath starter and replenishing solution. 1 fig.

METAL COATING BATHS

DOEpatents

Robinson, J.W.

1958-08-26

A method is presented for restoring the effectiveness of bronze coating baths used for hot dip coating of uranium. Such baths, containing a high proportion of copper, lose their ability to wet uranium surfaces after a period of use. The ability of such a bath to wet uranium can be restored by adding a small amount of metallic aluminum to the bath, and skimming the resultant hard alloy from the surface.

Apparatus and method for controlling plating uniformity

DOEpatents

Hachman Jr., John T.; Kelly, James J.; West, Alan C.

2004-10-12

The use of an insulating shield for improving the current distribution in an electrochemical plating bath is disclosed. Numerical analysis is used to evaluate the influence of shield shape and position on plating uniformity. Simulation results are compared to experimental data for nickel deposition from a nickel--sulfamate bath. The shield is shown to improve the average current density at a plating surface.

Efficacy of reducing agent and surfactant contacting pattern on the performance characteristics of nickel electroless plating baths coupled with and without ultrasound.

PubMed

Agarwal, Amrita; Pujari, Murali; Uppaluri, Ramgopal; Verma, Anil

2014-07-01

This article addresses furthering the role of sonication for the optimal fabrication of nickel ceramic composite membranes using electroless plating. Deliberating upon process modifications for surfactant induced electroless plating (SIEP) and combined surfactant and sonication induced electroless plating (SSOEP), this article highlights a novel method of contacting of the reducing agent and surfactant to the conventional electroless nickel plating baths. Rigorous experimental investigations indicated that the combination of ultrasound (in degas mode), surfactant and reducing agent pattern had a profound influence in altering the combinatorial plating characteristics. For comparison purpose, purely surfactant induced nickel ELP baths have also been investigated. These novel insights consolidate newer research horizons for the role of ultrasound to achieve dense metal ceramic composite membranes in a shorter span of total plating time. Surface and physical characterizations were carried out using BET, FTIR, XRD, FESEM and nitrogen permeation experiments. It has been analyzed that the SSOEP baths provided maximum ratio of percent pore densification per unit metal film thickness (PPDδ) and hold the key for further fine tuning of the associated degrees of freedom. On the other hand SIEP baths provided lower (PPDδ) ratio but higher PPD. For SSOEP baths with dropwise reducing agent and bulk surfactant, the PPD and metal film thickness values were 73.4% and 8.4 μm which varied to 66.9% and 13.3 μm for dropwise reducing agent and drop surfactant case. Copyright © 2014 Elsevier B.V. All rights reserved.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Sandoval-Paz, M.G., E-mail: myrnasandoval@udec.cl; Rodríguez, C.A.; Porcile-Saavedra, P.F.

Copper (I) selenide thin films with orthorhombic and cubic structure were deposited on glass substrates by using the chemical bath deposition technique. The effects of the solution pH on the films growth and subsequently the structural, optical and electrical properties of the films were studied. Films with orthorhombic structure were obtained from baths wherein both metal complex and hydroxide coexist; while films with cubic structure were obtained from baths where the metal hydroxide there is no present. The structural modifications are accompanied by changes in bandgap energy, morphology and electrical resistivity of the films. - Graphical abstract: “Study of themore » crystallographic phase change on copper (I) selenide thin films prepared through chemical bath deposition by varying the pH of the solution” by M. G. Sandoval-Paz, C. A. Rodríguez, P. F. Porcile-Saavedra, C. Trejo-Cruz. Display Omitted - Highlights: • Copper (I) selenide thin films were obtained by chemical bath deposition. • Orthorhombic to cubic phase change was induced by varying the reaction solution pH. • Orthorhombic phase is obtained mainly from a hydroxides cluster mechanism. • Cubic phase is obtained mainly from an ion by ion mechanism. • Structural, optical and electrical properties are presented as a function of pH.« less

Preparation of CIGS-based solar cells using a buffered electrodeposition bath

DOEpatents

Bhattacharya, Raghu Nath

2007-11-20

A photovoltaic cell exhibiting an overall conversion efficiency of at least 9.0% is prepared from a copper-indium-gallium-diselenide thin film. The thin film is prepared by simultaneously electroplating copper, indium, gallium, and selenium onto a substrate using a buffered electro-deposition bath. The electrodeposition is followed by adding indium to adjust the final stoichiometry of the thin film.

Oxidation kinetics of molten copper sulfide

NASA Astrophysics Data System (ADS)

Alyaser, A. H.; Brimacombe, J. K.

1995-02-01

The oxidation kinetics of molten Cu2S baths, during top lancing with oxygen/nitrogen (argon) mixtures, have been investigated as a function of oxygen partial pressure (0.2 to 0.78), bath temperature (1200 °C to 1300 °C), gas flow rate (1 to 4 L/min), and bath mixing. Surface-tension-driven flows (the Marangoni effect) were observed both visually and photographically. Thus, the oxidation of molten Cu2S was found to progress in two distinct stages, the kinetics of which are limited by the mass transfer of oxygen in the gas phase to the melt surface. During the primary stage, the melt is partially desulfurized while oxygen dissolves in the liquid sulfide. Upon saturation of the melt with oxygen, the secondary stage commences in which surface and bath reactions proceed to generate copper and SO2 electrochemically. A mathematical model of the reaction kinetics has been formulated and tested against the measurements. The results of this study shed light on the process kinetics of the copper blow in a Peirce-Smith converter or Mitsubishi reactor.

Copper Electrodeposition on a Magnesium Alloy (AZ80) with a U-Shaped Surface

PubMed Central

Huang, Ching An; Yeh, Yu Hu; Lin, Che Kuan; Hsieh, Chen Yun

2014-01-01

Cu electrodeposition was performed on a cylindrical AZ80 substrate with a U-shaped surface. A uniform deposition of Cu was achieved on an AZ80 electrode via galvanostatic etching, followed by Cu electrodeposition in an eco-friendly alkaline Cu plating bath. Improper wetting and lower rotational speeds of the AZ80 electrode resulted in an uneven Cu deposition at the inner upper site of the U-shaped surface during the Cu electroplating process. This wetting effect could be deduced from the variation in the anodic potential during the galvanostatic etching. The corrosion resistance of the Cu-deposited AZ80 electrode can be considerably improved after Ni electroplating. PMID:28788252

Electrodeposited Fe-Co films prepared from a citric-acid-based plating bath

NASA Astrophysics Data System (ADS)

Yanai, T.; Uto, H.; Shimokawa, T.; Nakano, M.; Fukunaga, H.; Suzuki, K.

2013-06-01

Electrodeposited Fe-Co films are commonly prepared in a boric-acid-based bath. In this research, we applied citric acid instead of boric acid for the plating of Fe-Co films because boron in the waste bath is restricted by environmental-protection regulations in Japan. We evaluated the effect of citric acid on the magnetic and structural properties of the films. The saturation magnetization of the Fe-Co films slightly increased while the Fe content in the Fe-Co films decreased with increasing citric acid concentration. The lowest coercivity value of 240 A/m was obtained at a citric acid concentration of 100 g/L. The plating bath with this citric acid concentration enabled us to obtain Fe-Co films with high saturation magnetizations and smooth surface morphologies.

Systems and Methods for the Electrodeposition of a Nickel-cobalt Alloy

NASA Technical Reports Server (NTRS)

Ogozalek, Nance Jo (Inventor); Wistrand, Richard E. (Inventor)

2013-01-01

Systems and methods for electrodepositing a nickel-cobalt alloy using a rotating cylinder electrode assembly with a plating surface and an electrical contact. The assembly is placed within a plating bath and rotated while running a plating cycle. Nickel-cobalt alloy deposition is selectively controlled by controlling current density distribution and/or cobalt content in the plating bath while running the plating cycle to deposit an alloy of a desired yield strength onto the plating surface in a single plating cycle. In various embodiments, the rotating cylinder may be used as an insitu monitoring method to assist in obtaining the properties desired.

INVESTIGATION INTO THE REJUVENATION OF SPENT ELECTROLESS NICKEL BATHS BY ELECTRODIALYSIS

EPA Science Inventory

Electroless nickel plating generates substantially more waste than other metal-finishing processes due to the inherent limited bath life and the need for regular bath disposal. Electrodialysis can be used to generate electroless nickel baths, but poor membrane permselectivity, l...

The Copper Sulfide Coating on Polyacrylonitrile with Chelating Agents by an Electroless Deposition Method and its EMI Shielding Effectiveness

DOE Office of Scientific and Technical Information (OSTI.GOV)

Roan, M.-L.; Chen, Y.-H.; Huang, C.-Y.

2008-08-28

In this study, a variety of concentrations of chelating agents were added to obtain the anchoring effect and chelating effect in the electroless plating bath. The mechanism of the Cu{sub x(x=1,2)}S growth and the electromagnetic interference shielding effectiveness (EMI SE) of the composite were studied. It was found that the vinyl acetate residued in PAN substrate would be purged due to the swelling effect by chelating agents solution. And then, the anchoring effect occurred due to the hydrogen bonding between the pits of PAN substrate and the chelating agent. Consequently, the copper sulfide layer deposited by the electroless plating reactionmore » with EDTA and TEA. The swelling degree (S{sub d}) was proposed and evaluated from the FT-IR spectra. The relationship between swelling degree of the PAN films and EDTA (C) is expressed as: S{sub d} = 0.13+0.90xe and (-15.15C). And TEA series is expressed as: S{sub d} = 0.07+1.00xe and (-15.15C). On the other hand, the FESEM micrograph showed that the average thickness of copper sulfide increased from 76 nm to 383 nm when the concentration of EDTA increased from 0.00M to 0.20M. Consequently, the EMI SE of the composites increased from 10{approx}12 dB to 25{approx}27 dB. The GIA-XRD analyze indicated that the deposited layer consisted of CuS and Cu{sub 2}S.« less

Understanding the antimicrobial activity behind thin- and thick-rolled copper plates.

PubMed

Yousuf, Basit; Ahire, Jayesh J; Dicks, Leon M T

2016-06-01

The aim of this study was to compare the antibacterial properties of the surfaces of copper plates that were rolled to a thickness of 25 and 100 μm. Differences in topology of 25- and 100-μm-thick copper plates were studied using scanning electron microscopy (SEM), atomic force microscopy (AFM), and X-ray diffraction (XRD). Antibacterial activity of the copper surfaces was tested against strains of Staphylococcus aureus, Escherichia coli, Klebsiella pneumoniae, Pseudomonas aeruginosa, Listeria monocytogenes, Salmonella typhimurium, Streptococcus sp. BY1, Enterococcus sp. BY2, and Bacillus cereus BY3. Changes in viable cell numbers were determined by plating onto optimal growth media and staining with LIVE/DEAD BacLight™. Changes in metabolic activity were recorded by expression of the luciferase (lux) gene. Cell morphology was studied using SEM. Accumulation and diffusion of copper from cells were recorded using inductively coupled plasma mass spectroscopy (ICP-MS). Lipid and protein oxidation were recorded spectrophotometrically. Surfaces of 25-μm-thick copper plates were rough compared to that of 100-μm-thick copper plates. For most species, a five-log reduction in cell numbers, cell membrane instability, and a decline in metabolic activity were recorded after 15 min of exposure to 25-μm-thick copper plates. Copper accumulated in the cells, and lipids and proteins were oxidized. The rough surface of thinner copper plates (25 μm thick) released more copper and was more antimicrobial compared to thicker (100 μm) copper plates. Cell death was attributed to destabilization of the cell membrane, lipid peroxidation, and protein oxidation.

40 CFR 63.341 - Definitions and nomenclature.

Code of Federal Regulations, 2013 CFR

2013-07-01

... control device or a chemical fume suppressant, that is used to reduce chromium emissions from chromium... workpiece. Bath component means the trade or brand name of each component(s) in trivalent chromium plating baths. For trivalent chromium baths, the bath composition is proprietary in most cases. Therefore, the...

40 CFR 63.341 - Definitions and nomenclature.

Code of Federal Regulations, 2014 CFR

2014-07-01

... control device or a chemical fume suppressant, that is used to reduce chromium emissions from chromium... workpiece. Bath component means the trade or brand name of each component(s) in trivalent chromium plating baths. For trivalent chromium baths, the bath composition is proprietary in most cases. Therefore, the...

Detection of Legionella species in environmental water by the quantitative PCR method in combination with ethidium monoazide treatment.

PubMed

Inoue, Hiroaki; Takama, Tomoko; Yoshizaki, Miwa; Agata, Kunio

2015-01-01

We detected Legionella species in 111 bath water samples and 95 cooling tower water samples by using a combination of conventional plate culture, quantitative polymerase chain reaction (qPCR) and qPCR combined with ethidium monoazide treatment (EMA-qPCR) methods. In the case of bath water samples, Legionella spp. were detected in 30 samples by plate culture, in 85 samples by qPCR, and in 49 samples by EMA-qPCR. Of 81 samples determined to be Legionella-negative by plate culture, 56 and 23 samples were positive by qPCR and EMA-qPCR, respectively. Therefore, EMA treatment decreased the number of Legionella-positive bath water samples detected by qPCR. In contrast, EMA treatment had no effect on cooling tower water samples. We therefore expect that EMA-qPCR is a useful method for the rapid detection of viable Legionella spp. from bath water samples.

Capable Copper Electrodeposition Process for Integrated Circuit - substrate Packaging Manufacturing

NASA Astrophysics Data System (ADS)

Ghanbari, Nasrin

This work demonstrates a capable reverse pulse deposition methodology to influence gap fill behavior inside microvia along with a uniform deposit in the fine line patterned regions for substrate packaging applications. Interconnect circuitry in IC substrate packages comprises of stacked microvia that varies in depth from 20microm to 100microm with an aspect ratio of 0.5 to 1.5 and fine line patterns defined by photolithography. Photolithography defined pattern regions incorporate a wide variety of feature sizes including large circular pad structures with diameter of 20microm - 200microm, fine traces with varying widths of 3microm - 30microm and additional planar regions to define a IC substrate package. Electrodeposition of copper is performed to establish the desired circuit. Electrodeposition of copper in IC substrate applications holds certain unique challenges in that they require a low cost manufacturing process that enables a void-free gap fill inside the microvia along with uniform deposition of copper on exposed patterned regions. Deposition time scales to establish the desired metal thickness for such packages could range from several minutes to few hours. This work showcases a reverse pulse electrodeposition methodology that achieves void-free gap fill inside the microvia and uniform plating in FLS (Fine Lines and Spaces) regions with significantly higher deposition rates than traditional approaches. In order to achieve this capability, systematic experimental and simulation studies were performed. A strong correlation of independent parameters that govern the electrodeposition process such as bath temperature, reverse pulse plating parameters and the ratio of electrolyte concentrations is shown to the deposition kinetics and deposition uniformity in fine patterned regions and gap fill rate inside the microvia. Additionally, insight into the physics of via fill process is presented with secondary and tertiary current simulation efforts. Such efforts lead to show "smart" control of deposition rate at the top and bottom of via to avoid void formation. Finally, a parametric effect on grain size and the ensuing copper metallurgical characteristics of bulk copper is also shown to enable high reliability substrate packages for the IC packaging industry.

Copper recovery and cyanide oxidation by electrowinning from a spent copper-cyanide electroplating electrolyte.

PubMed

Dutra, A J B; Rocha, G P; Pombo, F R

2008-04-01

Copper-cyanide bleed streams arise from contaminated baths from industrial electroplating processes due to the buildup of impurities during continuous operation. These streams present an elevated concentration of carbonate, cyanide and copper, constituting a heavy hazard, which has to be treated for cyanide destruction and heavy metals removal, according to the local environmental laws. In the Brazilian Mint, bleed streams are treated with sodium hypochlorite, to destroy cyanide and precipitate copper hydroxide, a solid hazardous waste that has to be disposed properly in a landfill or treated for metal recovery. In this paper, a laboratory-scale electrolytic cell was developed to remove the copper from the bleed stream of the electroplating unit of the Brazilian Mint, permitting its reutilization in the plant and decreasing the amount of sludge to waste. Under favorable conditions copper recoveries around 99.9% were achieved, with an energy consumption of about 11 kWh/kg, after a 5-h electrolysis of a bath containing copper and total cyanide concentrations of 26 and 27 g/L, respectively. Additionally, a substantial reduction of the cyanide concentration was also achieved, decreasing the pollution load and final treatment costs.

Experimental study of copper-alkali ion exchange in glass

NASA Astrophysics Data System (ADS)

Gonella, F.; Caccavale, F.; Bogomolova, L. D.; D'Acapito, F.; Quaranta, A.

1998-02-01

Copper-alkali ion exchange was performed by immersing different silicate glasses (soda-lime and BK7) in different molten eutectic salt baths (CuSO4:Na2SO4 and CuSO4:K2SO4). The obtained optical waveguides were characterized by m-lines spectroscopy for the determination of refractive index profiles, and by secondary ion mass spectrometry for the concentration profiles of the ion species involved in the exchange process. The different oxidation states of copper inside the glass structure were studied by electron paramagnetic resonance and x-ray absorption techniques. Interdiffusion copper coefficients were also determined. The Cu-alkali exchange was observed to give rise to local structural rearrangement of the atoms in the glass matrix. The Cu+ ion was found to mainly govern the exchange process, while competition between Cu-Na and K-Na exchanges occurred when a potassium sulfate bath was used. In this case, significant waveguide modal birefringence was observed.

Electroless deposition of Ni Cu P alloy and study of the influences of some parameters on the properties of deposits

NASA Astrophysics Data System (ADS)

Ashassi-Sorkhabi, H.; Dolati, H.; Parvini-Ahmadi, N.; Manzoori, J.

2002-01-01

Cupronickel alloys are known for their excellent corrosion resistance, especially in marine atmosphere. The development of an appropriate electroless bath involves the use of a reducing agent, complexing and stabilizing compounds and metallic salts. In this work, autocatalytic deposition of Ni-Cu-P alloys (28-95 wt.% Ni, 66-0 wt.% Cu, 7.5-3 wt.% P) has been carried out on 302 b steel sheets from bath containing: NiCl 2·6H 2O, CuCl 2·2H 2O, NaH 2PO 2, Na citrate, sulphosalicilic acid and triethanolamine. The effects of pH, temperature, and bath composition on the hardness and the composition of deposits have been studied. In addition, the deposition rates of alloy, nickel, copper and phosphorus were investigated and optimum conditions were obtained. The average rate of alloy deposition was 9 mg cm -2 h -1 and the optimum pH and temperature were 8.5 and 80 °C, respectively. The chemical stability of bath was desirable, and no spontaneous decomposition occurred. The changes in the structure of deposit by heat treatment were studied by the X-ray diffraction (XRD) method. The XRD patterns indicate that the copper content affects the structure changes. With increasing copper content, the phosphorus content decreased and the crystallinity of the deposits grew. After heat treatment of alloys with lower copper content at 400 °C for 1 h, the crystallization to Ni 3P was observed.

Depth profile composition studies of thin film CdS:Cu2S solar cells using XPS and AES

NASA Astrophysics Data System (ADS)

Bhide, V. G.; Salkalachen, S.; Rastogi, A. C.; Rao, C. N. R.; Hegde, M. S.

1981-09-01

Studies of the surface composition and depth profiles of thin film CdS:Cu2S solar cells based on the techniques of X-ray photoelectron spectroscopy (XPS) and Auger electron spectroscopy (AES) are reported. Specimens were fabricated by the thermal deposition of polycrystalline CdS films onto silver-backed electrodes predeposited on window glass substrates, followed by texturization in hot HCl and chemical plating in a hot CuCl(I) bath for a few seconds to achieve the topotaxial growth of CuS films. The XPS and AES studies indicate the junction to be fairly diffused in the as-prepared cell, with heat treatment in air at 210 C sharpening the junction, improving the stoichiometry of the Cu2S layer and thus improving cell performance. The top copper sulfide layer is found to contain impurities such as Cd, Cl, O and C, which may be removed by mild Ar(+) ion beam etching. The presence of copper deep in the junction is invariably detected, apparently in the grain boundary region in the form of CuS or Cu(2+) trapped in the lattice. It is also noted that the nominal valence state of copper changes abruptly from Cu(+) to Cu(2+) across the junction.

Image analysis for maintenance of coating quality in nickel electroplating baths--real time control.

PubMed

Vidal, M; Amigo, J M; Bro, R; van den Berg, F; Ostra, M; Ubide, C

2011-11-07

The aim of this paper is to show how it is possible to extract analytical information from images acquired with a flatbed scanner and make use of this information for real time control of a nickel plating process. Digital images of plated steel sheets in a nickel bath are used to follow the process under degradation of specific additives. Dedicated software has been developed for making the obtained results accessible to process operators. This includes obtaining the RGB image, to select the red channel data exclusively, to calculate the histogram of the red channel data and to calculate the mean colour value (MCV) and the standard deviation of the red channel data. MCV is then used by the software to determine the concentration of the additives Supreme Plus Brightner (SPB) and SA-1 (for confidentiality reasons, the chemical contents cannot be further detailed) present in the bath (these two additives degrade and their concentration changes during the process). Finally, the software informs the operator when the bath is generating unsuitable quality plating and suggests the amount of SPB and SA-1 to be added in order to recover the original plating quality. Copyright © 2011 Elsevier B.V. All rights reserved.

Fabrication of Aluminum-Based Thermal Radiation Plate for Thermoelectric Module Using Aluminum Anodic Oxidization and Copper Electroplating.

PubMed

Choi, Yi Taek; Bae, Sung Hwa; Son, Injoon; Sohn, Ho Sang; Kim, Kyung Tae; Ju, Young-Wan

2018-09-01

In this study, electrolytic etching, anodic oxidation, and copper electroplating were applied to aluminum to produce a plate on which a copper circuit for a thermoelectric module was formed. An oxide film insulating layer was formed on the aluminum through anodic oxidation, and platinum was coated by sputtering to produce conductivity. Finally, copper electroplating was performed directly on the substrate. In this structure, the copper plating layer on the insulating layer served as a conductive layer in the circuit. The adhesion of the copper plating layer was improved by electrolytic etching. As a result, the thermoelectric module fabricated in this study showed excellent adhesion and good insulation characteristics. It is expected that our findings can contribute to the manufacture of plates applicable to thermoelectric modules with high dissipation performance.

CURRENT AND EMERGING TECHNOLOGIES FOR EXTENDING THE LIFETIME OF ELECTROLESS NICKEL PLATING BATHS

EPA Science Inventory

The waste treatment and rejuvenation of spent electroless nickel baths has attracted a considerable amount of interest from electroplating shops, electroless nickel suppliers, universities and regulatory agencies due to the finite life of the baths and the associated waste that t...

40 CFR 420.81 - Specialized definitions.

Code of Federal Regulations, 2013 CFR

2013-07-01

...-finished steel products by the action of molten salt baths other than those containing sodium hydride. (b... the action of molten salt baths containing sodium hydride. (c) The term batch, sheet and plate means... STANDARDS IRON AND STEEL MANUFACTURING POINT SOURCE CATEGORY Salt Bath Descaling Subcategory § 420.81...

40 CFR 420.81 - Specialized definitions.

Code of Federal Regulations, 2014 CFR

2014-07-01

...-finished steel products by the action of molten salt baths other than those containing sodium hydride. (b... the action of molten salt baths containing sodium hydride. (c) The term batch, sheet and plate means... STANDARDS IRON AND STEEL MANUFACTURING POINT SOURCE CATEGORY Salt Bath Descaling Subcategory § 420.81...

40 CFR 63.341 - Definitions and nomenclature.

Code of Federal Regulations, 2012 CFR

2012-07-01

... air pollution control device or a chemical fume suppressant, that is used to reduce chromium emissions... trivalent chromium plating baths. For trivalent chromium baths, the bath composition is proprietary in most... to the surface tension. Trivalent chromium means the form of chromium in a valence state of +3...

Lightweight bipolar storage battery

NASA Technical Reports Server (NTRS)

Rowlette, John J. (Inventor)

1992-01-01

An apparatus [10] is disclosed for a lightweight bipolar battery of the end-plate cell stack design. Current flow through a bipolar cell stack [12] is collected by a pair of copper end-plates [16a,16b] and transferred edgewise out of the battery by a pair of lightweight, low resistance copper terminals [28a,28b]. The copper terminals parallel the surface of a corresponding copper end-plate [16a,16b] to maximize battery throughput. The bipolar cell stack [12], copper end-plates [16a,16b] and copper terminals [28a,28b] are rigidly sandwiched between a pair of nonconductive rigid end-plates [20] having a lightweight fiber honeycomb core which eliminates distortion of individual plates within the bipolar cell stack due to internal pressures. Insulating foam [30] is injected into the fiber honeycomb core to reduce heat transfer into and out of the bipolar cell stack and to maintain uniform cell performance. A sealed battery enclosure [ 22] exposes a pair of terminal ends [26a,26b] for connection with an external circuit.

Recovery process for electroless plating baths

DOEpatents

Anderson, Roger W.; Neff, Wayne A.

1992-01-01

A process for removing, from spent electroless metal plating bath solutions, accumulated byproducts and counter-ions that have deleterious effects on plating. The solution, or a portion thereof, is passed through a selected cation exchange resin bed in hydrogen form, the resin selected from strong acid cation exchangers and combinations of intermediate acid cation exchangers with strong acid cation exchangers. Sodium and nickel ions are sorbed in the selected cation exchanger, with little removal of other constituents. The remaining solution is subjected to sulfate removal through precipitation of calcium sulfate hemihydrate using, sequentially, CaO and then CaCO.sub.3. Phosphite removal from the solution is accomplished by the addition of MgO to form magnesium phosphite trihydrate. The washed precipitates of these steps can be safely discarded in nontoxic land fills, or used in various chemical industries. Finally, any remaining solution can be concentrated, adjusted for pH, and be ready for reuse. The plating metal can be removed from the exchanger with sulfuric acid or with the filtrate from the magnesium phosphite precipitation forming a sulfate of the plating metal for reuse. The process is illustrated as applied to processing electroless nickel plating baths.

Recovery process for electroless plating baths

DOEpatents

Anderson, R.W.; Neff, W.A.

1992-05-12

A process is described for removing, from spent electroless metal plating bath solutions, accumulated byproducts and counter-ions that have deleterious effects on plating. The solution, or a portion thereof, is passed through a selected cation exchange resin bed in hydrogen form, the resin selected from strong acid cation exchangers and combinations of intermediate acid cation exchangers with strong acid cation exchangers. Sodium and nickel ions are sorbed in the selected cation exchanger, with little removal of other constituents. The remaining solution is subjected to sulfate removal through precipitation of calcium sulfate hemihydrate using, sequentially, CaO and then CaCO[sub 3]. Phosphite removal from the solution is accomplished by the addition of MgO to form magnesium phosphite trihydrate. The washed precipitates of these steps can be safely discarded in nontoxic land fills, or used in various chemical industries. Finally, any remaining solution can be concentrated, adjusted for pH, and be ready for reuse. The plating metal can be removed from the exchanger with sulfuric acid or with the filtrate from the magnesium phosphite precipitation forming a sulfate of the plating metal for reuse. The process is illustrated as applied to processing electroless nickel plating baths. 18 figs.

ELECTRODIALYSIS AS A TECHNIQUE FOR EXTENDING ELECTROLESS NICKEL BATH LIFE-IMPROVING SELECTIVITY AND REDUCING LOSSES OF VALUABLE BATH COMPONENTS

EPA Science Inventory

Over the last decade electrodialysis has emerged as an effective technique for removing accumulated reactant counterions (sodium and sulfate) and reaction products (orthophosphite) that interfere with the electroless nickel plating process, thus extending bath life by up to 50 me...

40 CFR 420.81 - Specialized definitions.

Code of Federal Regulations, 2012 CFR

2012-07-01

... from semi-finished steel products by the action of molten salt baths other than those containing sodium... products by the action of molten salt baths containing sodium hydride. (c) The term batch, sheet and plate... AND STANDARDS IRON AND STEEL MANUFACTURING POINT SOURCE CATEGORY Salt Bath Descaling Subcategory § 420...

Effect of an annealing on magnetic properties of Fe-Ni films electroplated in citric-acid-based plating baths

NASA Astrophysics Data System (ADS)

Yanai, T.; Koda, K.; Eguchi, K.; Morimura, T.; Takashima, K.; Nakano, M.; Fukunaga, H.

2018-04-01

We have already reported Fe-Ni films with good soft magnetic properties prepared by using an electroplating method. In the present study, we employed an annealing for further improvement in soft magnetic properties of the electroplated Fe-Ni films. The annealing reduces the coercivity of the films, and the reduction rate of the coercivity depended on the Cl- ion concentration in the bath. The Fe22Ni78 films prepared in the plating bath with high Cl- ion concentration showed large reduction rate of the coercivity, and we found that the annealing is more effective for high Cl- ion concentration bath since much lower coercivity value can be obtained compared with that for low Cl- ion concentration one.

Effect of nanostructure on rapid boiling of water on a hot copper plate: a molecular dynamics study

NASA Astrophysics Data System (ADS)

Fu, Ting; Mao, Yijin; Tang, Yong; Zhang, Yuwen; Yuan, Wei

2016-08-01

Molecular dynamic simulations are performed to study the effects of nanostructure on rapid boiling of water that is suddenly heated by a hot copper plate. The results show that the nanostructure has significant effects on energy transfer from solid copper plate to liquid water and phase change process from liquid water to vapor. The liquid water on the solid surface rapidly boil after contacting with an extremely hot copper plate and consequently a cluster of liquid water moves upward during phase change. The temperature of the water film when it separates from solid surface and its final temperature when the system is at equilibrium strongly depend on the size of the nanostructure. These temperatures increase with increasing size of nanostructure. Furthermore, a non-vaporized molecular layer is formed on the surface of the copper plate even continuous heat flux is passing into water domain through the plate.

Polyfibroblast: A Self-Healing and Galvanic Protection Additive

DTIC Science & Technology

2011-04-25

of premature microcapsule rupture, and have shown that the microcapsules are resilient to solvent soaking. 2 Project Goals and Objectives This month...capability of Polyfibroblast microcapsules , we designed the following test. We short-circuited a A1008 steel specimen to a strip of polyurethane...pH New experiments have revealed that alkaline plating baths etch the polymer skin layer. Fresh microcapsules placed in plating baths with a pH of

40 CFR 63.11507 - What are my standards and management practices?

Code of Federal Regulations, 2010 CFR

2010-07-01

... chemistry ingredients that are added to replenish the tank bath, as in the original make-up of the tank. (iii) If a wetting agent/fume suppressant is included in the electrolytic process bath chemicals used... to be plated, as practicable. (8) Maintain quality control of chemicals, and chemical and other bath...

Thermal and Surface Evaluation on The Process of Forming a Cu2O/CuO Semiconductor Photocatalyst on a Thin Copper Plate

NASA Astrophysics Data System (ADS)

Zainul, R.; Oktavia, B.; Dewata, I.; Efendi, J.

2018-04-01

This research aims to investigate the process of forming a multi-scale copper oxide semiconductor (CuO/Cu2O) through a process of calcining a copper plate. The changes that occur during the formation of the oxide are thermally and surface evaluated. Evaluation using Differential Thermal Analysis (DTA) obtained by surface change of copper plate happened at temperature 380°C. Calcination of oxide formation was carried out at temperature 380°C for 1 hour. Surface evaluation process by using Scanning Electron Microscope (SEM) surface and cross-section, to determine diffusion of oxide formation on copper plate. The material composition is monitored by XRF and XRD to explain the process of structural and physical changes of the copper oxide plate formed during the heating process. The thickness of Cu plates used is 200-250 μm. SEM analysis results, the oxygen atom interruption region is in the range of 20-30 μm, and diffuses deeper during thermal oxidation process. The maximum diffusion depth of oxygen atoms reaches 129 μm.

Research on metal-plated cellulose nitrate flakes and their infrared / millimeter wave characteristics

NASA Astrophysics Data System (ADS)

Ye, Shu-qin; Zhu, Chen-guang; Wang, Li-hong; Ou'yang, De-hua; Pan, Gong-pei

2016-10-01

Copper-plated and silver-plated cellulose nitrate flakes, which were prepared by using chemical plating technology, were used to jam infrared detector and millimeter-wave radar. It was tested for the conductivity and infrared jamming performance of plating and also the RCS (Radar Cross Section) performance of millimeter-wave radar. Test results showed that the prepared metal-plated cellulose nitrate flakes have obvious conductivity, and infrared total radiation energy of silver plating and copper plating had approximately increased 32% and 21% respectively. Through determination, the millimeter-wave reflecting property and RCS of silver-plated cellulose nitrate flakes were higher than that of copper-plated cellulose nitrate flakes. Therefore, silver-plated cellulose nitrate flakes can be used as an effective infrared / millimeter wave composite jamming material.

Preparation of graphite dispersed copper composite on copper plate with CO2 laser

NASA Astrophysics Data System (ADS)

Yokoyama, S.; Ishikawa, Y.; Muizz, M. N. A.; Hisyamudin, M. N. N.; Nishiyama, K.; Sasano, J.; Izaki, M.

2018-01-01

It was tried in this work to prepare the graphite dispersed copper composite locally on a copper plate with a CO2 laser. The objectives of this study were to clear whether copper graphite composite was prepared on a copper plate and how the composite was prepared. The carbon content at the laser spot decreased with the laser irradiation time. This mainly resulted from the elimination by the laser trapping. The carbon content at the outside of the laser spot increased with time. Both the laser ablation and the laser trapping did not act on the graphite particles at the outside of the laser spot. Because the copper at the outside of the laser spot melted by the heat conduction from the laser spot, the particles were fixed by the wetting. However, the graphite particles were half-floated on the copper plate. The Vickers hardness decreased with an increase with laser irradiation time because of annealing.

Structural, optical and electrical properties of copper antimony sulfide thin films grown by a citrate-assisted single chemical bath deposition

NASA Astrophysics Data System (ADS)

Loranca-Ramos, F. E.; Diliegros-Godines, C. J.; Silva González, R.; Pal, Mou

2018-01-01

Copper antimony sulfide (CAS) has been proposed as low toxicity and earth abundant absorber materials for thin film photovoltaics due to their suitable optical band gap, high absorption coefficient and p-type electrical conductivity. The present work reports the formation of copper antimony sulfide by chemical bath deposition using sodium citrate as a complexing agent. We show that by tuning the annealing condition, one can obtain either chalcostibite or tetrahedrite phase. However, the main challenge was co-deposition of copper and antimony as ternary sulfides from a single chemical bath due to the distinct chemical behavior of these metals. The as-deposited films were subjected to several trials of thermal treatment using different temperatures and time to find the optimized annealing condition. The films were characterized by different techniques including Raman spectroscopy, X-ray diffraction (XRD), profilometer, scanning electron microscopy (SEM), UV-vis spectrophotometer, and Hall Effect measurements. The results show that the formation of chalcostibite and tetrahedrite phases is highly sensitive to annealing conditions. The electrical properties obtained for the chalcostibite films varied as the annealing temperature increases from 280 to 350 °C: hole concentration (n) = 1017-1018 cm-3, resistivity (ρ) = 1.74-2.14 Ωcm and carrier mobility (μ) = 4.7-9.26 cm2/Vseg. While for the tetrahedrite films, the electrical properties were n = 5 × 1019 cm-3, μ = 18.24 cm2/Vseg, and ρ = 5.8 × 10-3 Ωcm. A possible mechanism for the formation of ternary copper antimony sulfide has also been proposed.

Effect of primary amines on magnetic properties of Fe-Ni films electroplated in a DES-based plating bath

NASA Astrophysics Data System (ADS)

Yanai, T.; Akiyoshi, T.; Yamaguchi, T.; Takashima, K.; Morimura, T.; Nakano, M.; Fukunaga, H.

2018-05-01

Fe-Ni alloy films were electroplated in DES-based plating baths with various primary amines, and we investigated the effect of the primary amines on the magnetic and the structural properties of the films. The primary amines of ammonium sulfamate, DL-α-alanine and L-glutamic acid reduced the coercivity and the surface roughness of the Fe-rich films (Fe > 70 at.%), and the reduction tendencies of the coercivity and the roughness show good agreement with the result of our previous study on another primary amine of glycine. From the results for the TEM observation, we found that the texture of the Fe-rich film is clearly different from that for the Fe-poor one (Fe < 30 at.%), and we concluded that the primary amines are effective additives for the Fe-rich films electroplated in the DES-based plating baths.

46 CFR 114.600 - Incorporation by reference.

Code of Federal Regulations, 2014 CFR

2014-10-01

... Conshohocken, PA 19428-2959 ASTM B 96-93, Standard Specification for Copper-Silicon Alloy Plate, Sheet, Strip... Operating Salt Spray (Fog) Apparatus 114.400 ASTM B 122/B 122M-95, Standard Specification for Copper-Nickel-Tin Alloy , Copper-Nickel-Zinc Alloy (Nickel Silver), and Copper-Nickel Alloy Plate, Sheet, Strip, and...

46 CFR 114.600 - Incorporation by reference.

Code of Federal Regulations, 2013 CFR

2013-10-01

... Conshohocken, PA 19428-2959 ASTM B 96-93, Standard Specification for Copper-Silicon Alloy Plate, Sheet, Strip... Operating Salt Spray (Fog) Apparatus 114.400 ASTM B 122/B 122M-95, Standard Specification for Copper-Nickel-Tin Alloy , Copper-Nickel-Zinc Alloy (Nickel Silver), and Copper-Nickel Alloy Plate, Sheet, Strip, and...

Element Distribution in the Oxygen-Rich Side-Blow Bath Smelting of a Low-Grade Bismuth-Lead Concentrate

NASA Astrophysics Data System (ADS)

Yang, Tianzu; Xiao, Hui; Chen, Lin; Chen, Wei; Liu, Weifeng; Zhang, Duchao

2018-03-01

Oxygen-rich side-blow bath smelting (OSBS) technology offers an efficient method for processing complex bismuth-lead concentrates; however, the element distributions in the process remain unclear. This work determined the distributions of elements, i.e., bismuth, lead, silver, copper, arsenic and antimony, in an industrial-scale OSBS process. The feed, oxidized slag and final products were collected from the respective sampling points and analyzed. For the oxidative smelting process, 65% of bismuth and 76% of silver in the concentrate report to the metal alloy, whereas less lead reports to the metal ( 31%) than the oxidized slag ( 44%). Approximately 50% of copper enters the matte, while more than 63% of arsenic and antimony report to the slag. For the reductive smelting process, less than 4.5% of bismuth, lead, silver and copper in the oxidized slag enter the reduced slag, indicating high recoveries of these metal values.

Effect of Ultrasonic on Copper Electroplating from the Non-Cyanide Alkaline Baths

NASA Astrophysics Data System (ADS)

Li, Minggang; Hu, Shuangshuang; Yang, Yejiong; Xu, Shuhan; Zhao, Xixi; Wei, Guoying

2014-06-01

Effects of the different ultrasonic powers on copper electrodeposition from non-cyanide alkaline baths by using pyrophosphate as complexing agent were investigated by different electrochemical methods. Cyclic voltammetry and current transient measurements were used to characterize the nucleation and growth mechanism. It is very obvious that the reduction potential moves to more positive one as the ultrasonic power increases. The quartz crystal microbalance (QCM) and chronoamperometric method were used to study the relationship between the mass change and the deposition time. It was found that the current efficiency of electrolyte under 0, 60, 80 and 100 W is 91.95%, 92.14%, 89.25% and 96.11%, respectively measured by QCM measurements. The surface morphology of the electrodeposited Cu films is analyzed by scanning electron microscopy (SEM). The morphology of copper films electrodeposited under the power of 60 W and 80 W presents a compact surface and the grains are fine and uniform.

Element Distribution in the Oxygen-Rich Side-Blow Bath Smelting of a Low-Grade Bismuth-Lead Concentrate

NASA Astrophysics Data System (ADS)

Yang, Tianzu; Xiao, Hui; Chen, Lin; Chen, Wei; Liu, Weifeng; Zhang, Duchao

2018-06-01

Oxygen-rich side-blow bath smelting (OSBS) technology offers an efficient method for processing complex bismuth-lead concentrates; however, the element distributions in the process remain unclear. This work determined the distributions of elements, i.e., bismuth, lead, silver, copper, arsenic and antimony, in an industrial-scale OSBS process. The feed, oxidized slag and final products were collected from the respective sampling points and analyzed. For the oxidative smelting process, 65% of bismuth and 76% of silver in the concentrate report to the metal alloy, whereas less lead reports to the metal ( 31%) than the oxidized slag ( 44%). Approximately 50% of copper enters the matte, while more than 63% of arsenic and antimony report to the slag. For the reductive smelting process, less than 4.5% of bismuth, lead, silver and copper in the oxidized slag enter the reduced slag, indicating high recoveries of these metal values.

Improved black nickel coatings for flat plate solar collectors

NASA Technical Reports Server (NTRS)

Lin, J. H.; Peterson, R. E.

1977-01-01

A new black nickel formula was developed which had a solar absorptance of 0.92 and an infrared emittance (at 100 C) of less than 0.10 after 14 days at 38 C and 95 percent relative humidity. The electroplating bath and conditions were changed to obtain the more stable coating configuration. The effect of bath composition, temperature, pH, and plating current density and time on the coating composition, optical properties and durability were investigated.

Study of electroless Ni-W-P alloy coating on martensitic stainless steel

DOE Office of Scientific and Technical Information (OSTI.GOV)

Nikitasari, Arini, E-mail: arini-nikitasari@yahoo.com; Mabruri, Efendi, E-mail: efendi-lipi@yahoo.com

Electroless nickel phospor (Ni-P) is widely used in many industries due to their corrosion and wear resistance, coating uniformity, and ability to coat non-conductive surfaces. The unique properties of tungsten such as high hardness, higher melting point, lower coefficient of linear thermal expansion, and high tensile strength have created a lot of interest in developing ternary Ni-W-P alloys. This article presents the study of electroless Ni-W-P alloys coating using acid or alkaline bath on martensitic stainless steel. Nickel sulfate and sodium tungstate were used as nickel and tungsten sources, respectively, and sodium hypophosphite was used as a reducing agent. Acidmore » or alkaline bath refer to bath pH condition was adjusted by adding sulfuric acid. Martensitic stainless steel was immersed in Ni-W-P bath for 15, 30, and 60 minutes. The substrate of martensitic stainless steel was subjected to pre-treatment (polishing and cleaning) and activation prior to electroless plating. The plating characteristics were investigated for concentration ratio of nickel and hypophosphite (1:3), sodium tungstate concentration 0,1 M, immersion time (15 min, 30 min, 60 min), and bath condition (acid, alkaline). The electroless Ni-W-P plating was heat treated at 400°C for 1 hour. Deposits were characterized using scanning electron microscope (SEM) and corrosion measurement system (CMS).« less

Effect of thiourea on electrochemical nucleation and electrochemical impedance spectroscopy of electrodeposited tin on a copper substrate in a sulfate bath.

PubMed

Lee, Mi-Ri; Na, Seong-Hun; Park, Hwa-Sun; Suh, Su-Jeong

2014-12-01

The effect of thiourea on the electrochemical nucleation of tin on a copper substrate from a sulfate bath was studied using voltammetry, chronoamperometry, electrochemical impedance spectroscopy, and scanning electron microscopy. Without thiourea, electrodeposition of tin showed very poor surface coverage. However, re-nucleation and growth of tin occurred after the addition of thiourea. In particular, very rapid re-nucleation and growth behavior of tin were observed when up to 6 g/L of thiourea was added. Furthermore, impedance analysis allowed the estimation of the change in the growth behavior of tin when up to 6 g/L of thiourea was added.

Reduced temperature aluminum production in an electrolytic cell having an inert anode

DOEpatents

Dawless, Robert K.; Ray, Siba P.; Hosler, Robert B.; Kozarek, Robert L.; LaCamera, Alfred F.

2000-01-01

Aluminum is produced by electrolytic reduction of alumina in a cell having a cathode, an inert anode and a molten salt bath containing metal fluorides and alumina. The inert anode preferably contains copper, silver and oxides of iron and nickel. Reducing the molten salt bath temperature to about 900-950.degree. C. lowers corrosion on the inert anode constituents.

Staining human lymphocytes and onion root cell nuclei with madder root.

PubMed

Cücer, N; Guler, N; Demirtas, H; Imamoğlu, N

2005-01-01

We performed staining experiments on cells using natural dyes and different mordants using techniques that are used for wool and silk dyeing. The natural dye sources were madder root, daisy, corn cockle and yellow weed. Ferrous sulfate, copper sulfate, potassium tartrate, urea, potassium aluminum sulfate and potassium dichromate were used as mordants. Distilled water, distilled water plus ethanol, heptane, and distilled water plus methanol were used as solvents. All dye-mordant-solvent combinations were studied at pH 2.4, 3.2 and 4.2. The generic staining procedure was to boil 5-10 onion roots or stimulated human lymphocyte (SHL) preparations in a dye bath on a hot plate. Cells were examined at every half hour. For multicolor staining, madder-dyed lymphocytes were decolorized, then stained with Giemsa. The AgNOR technique was performed following the decolorization of Giemsa stained lymphocytes. Good results were obtained for both onion root cells and lymphocytes that were boiled for 3 h in a dye bath that included 4 g madder root, 4 g ferrous sulfate as mordant in 50 ml of 1:1 (v/v) methanol:distilled water. The pH was adjusted to 4.2 with 6 ml acetic acid. We conclude that madder root has potential as an alternative dye for staining biological materials.

Method for providing uranium with a protective copper coating

DOEpatents

Waldrop, Forrest B.; Jones, Edward

1981-01-01

The present invention is directed to a method for providing uranium metal with a protective coating of copper. Uranium metal is subjected to a conventional cleaning operation wherein oxides and other surface contaminants are removed, followed by etching and pickling operations. The copper coating is provided by first electrodepositing a thin and relatively porous flash layer of copper on the uranium in a copper cyanide bath. The resulting copper-layered article is then heated in an air or inert atmosphere to volatilize and drive off the volatile material underlying the copper flash layer. After the heating step an adherent and essentially non-porous layer of copper is electro-deposited on the flash layer of copper to provide an adherent, multi-layer copper coating which is essentially impervious to corrosion by most gases.

Preparation of cuxinygazsen precursor films and powders by electroless deposition

DOEpatents

Bhattacharya, Raghu N.; Batchelor, Wendi Kay; Wiesner, Holm; Ramanathan, Kannan; Noufi, Rommel

1999-01-01

A method for electroless deposition of Cu.sub.x In.sub.y Ga.sub.z Se.sub.n (x=0-2, y=0-2, z=0-2, n=0-3) precursor films and powders onto a metallic substrate comprising: preparing an aqueous bath solution of compounds selected from the group consisting of: I) a copper compound, a selenium compound, an indium compound and gallium compound; II) a copper compound, a selenium compound and an indium compound; III) a selenium compound, and indium compound and a gallium compound; IV) a selenium compound and a indium compound; and V) a copper compound and selenium compound; each compound being present in sufficient quantity to react with each other to produce Cu.sub.x In.sub.y Ga.sub.z Se.sub.n (x=0-2, y=0-2, z=0-2, n=0-3); adjusting the pH of the aqueous bath solution to an acidic value by the addition of a dilute acid; and initiating an electroless reaction with an oxidizing counterelectrode for a sufficient time to cause a deposit of Cu.sub.x In.sub.y Ga.sub.z Se.sub.n (x=0-2, y=0-2, z=0-2, n=0-3) from the aqueous bath solution onto a metallic substrate.

Brazing open cell reticulated copper foam to stainless steel tubing with vacuum furnace brazed gold/indium alloy plating

DOEpatents

Howard, Stanley R [Windsor, SC; Korinko, Paul S [Aiken, SC

2008-05-27

A method of fabricating a heat exchanger includes brush electroplating plated layers for a brazing alloy onto a stainless steel tube in thin layers, over a nickel strike having a 1.3 .mu.m thickness. The resultant Au-18 In composition may be applied as a first layer of indium, 1.47 .mu.m thick, and a second layer of gold, 2.54 .mu.m thick. The order of plating helps control brazing erosion. Excessive amounts of brazing material are avoided by controlling the electroplating process. The reticulated copper foam rings are interference fit to the stainless steel tube, and in contact with the plated layers. The copper foam rings, the plated layers for brazing alloy, and the stainless steel tube are heated and cooled in a vacuum furnace at controlled rates, forming a bond of the copper foam rings to the stainless steel tube that improves heat transfer between the tube and the copper foam.

Texture related unusual phenomena in electrodeposition and vapor deposition

NASA Astrophysics Data System (ADS)

Lee, D. N.; Han, H. N.

2015-04-01

The tensile strength of electrodeposits generally decreases with increasing bath temperature because the grain size increases and the dislocation density decreases with increasing bath temperature. Therefore, discontinuities observed in the tensile strength vs. bath temperature curves in electrodeposition of copper are unusual. The tensile strength of electrodeposits generally increases with increasing cathode current density because the rate of nucleation in electrodeposits increases with increasing current density, which in turn gives rise to a decrease in the grain size and in turn an increase in the strength. Therefore, a decrease in the tensile strength of copper electrodeposits at a high current density is unusual. The grain size of vapor deposits is expected to decrease with decreasing substrate temperature. However, rf sputtered Co-Cr deposits showed that deposits formed on water-cooled polyimide substrates had a larger grain size than deposits formed on polyimide substrates at 200 °C. These unusual phenomena can be explained by the preferred growth model for deposition texture evolution.

Combination for electrolytic reduction of alumina

DOEpatents

Brown, Craig W.; Brooks, Richard J.; Frizzle, Patrick B.; Juric, Drago D.

2002-04-30

An electrolytic bath for use during the electrolytic reduction of alumina to aluminum. The bath comprises molten electrolyte having the following ingredients: AlF.sub.3 and at least one salt selected from the group consisting of NaF, KF, and LiF; and about 0.004 wt. % to about 0.2 wt. %, based on total weight of the molten electrolyte, of at least one transition metal or at least one compound of the metal or both. The compound is, a fluoride; oxide, or carbonate. The metal is nickel, iron, copper, cobalt, or molybdenum. The bath is employed in a combination including a vessel for containing the bath and at least one non-consumable anode and at least one dimensionally stable cathode in the bath. Employing the instant bath during electrolytic reduction of alumina to aluminum improves the wetting of aluminum on a cathode by reducing or eliminating the formation of non-metallic deposits on the cathode.

Improved nickel plating of Inconel X-750

NASA Technical Reports Server (NTRS)

Farmer, M. E.; Feeney, J. E.; Kuster, C. A.

1969-01-01

Electroplating technique with acid pickling provides a method of applying nickel plating on Inconel X-750 tubing to serve as a wetting agent during brazing. Low-stress nickel-plating bath contains no organic wetting agents that cause the nickel to blister at high temperatures.

Preparation of graphite dispersed copper composite with intruding graphite particles in copper plate

NASA Astrophysics Data System (ADS)

Noor, Abdul Muizz Mohd; Ishikawa, Yoshikazu; Yokoyama, Seiji

2017-01-01

In this study, it was attempted that copper-graphite composite was prepared locally on the surface of a copper plate with using a spot welding machine. Experiments were carried out with changing the compressive load, the repetition number of the compression and the electrical current in order to study the effect of them on carbon content and Vickers hardness on the copper plate surface. When the graphite was pushed into copper plate only with the compressive load, the composite was mainly hardened by the work hardening. The Vickers hardness increased linearly with an increase in the carbon content. When an electrical current was energized through the composite at the compression, the copper around the graphite particles were heated to the temperature above approximately 2100 K and melted. The graphite particles partially or entirely dissolved into the melt. The graphite particles were precipitated from the melt under solidification. In addition, this high temperature caused the improvement of wetting of copper to graphite. This high temperature caused the annealing, and reduced the Vickers hardness. Even in this case, the Vickers hardness increased with an increase in the carbon content. This resulted from the dispersion hardening.

A Study on the Effect of Electrodeposition Parameters on the Morphology of Porous Nickel Electrodeposits

NASA Astrophysics Data System (ADS)

Sengupta, Srijan; Patra, Arghya; Jena, Sambedan; Das, Karabi; Das, Siddhartha

2018-03-01

In this study, the electrodeposition of nickel foam by dynamic hydrogen bubble-template method is optimized, and the effects of key deposition parameters (applied voltage and deposition time) and bath composition (concentration of Ni2+, pH of the bath, and roles of Cl- and SO4 2- ions) on pore size, distribution, and morphology and crystal structure are studied. Nickel deposit from 0.1 M NiCl2 bath concentration is able to produce the honeycomb-like structure with regular-sized holes. Honeycomb-like structure with cauliflower morphology is deposited at higher applied voltages of 7, 8, and 9 V; and a critical time (>3 minutes) is required for the development of the foamy structure. Compressive residual stresses are developed in the porous electrodeposits after 30 seconds of deposition time (-189.0 MPa), and the nature of the residual stress remains compressive upto 10 minutes of deposition time (-1098.6 MPa). Effect of pH is more pronounced in a chloride bath compared with a sulfate bath. The increasing nature of pore size in nickel electrodeposits plated from a chloride bath (varying from 21 to 48 μm), and the constant pore size (in the range of 22 to 24 μm) in deposits plated from a sulfate bath, can be ascribed to the striking difference in the magnitude of the corresponding current-time profiles.

Bath for electrolytic reduction of alumina and method therefor

DOEpatents

Brown, Craig W.; Brooks, Richard J.; Frizzle, Patrick B.; Juric, Drago D.

2001-07-10

An electrolytic bath for use during the electrolytic reduction of alumina to aluminum. The bath comprises a molten electrolyte having the following ingredients: (a) AlF.sub.3 and at least one salt selected from the group consisting of NaF, KF, and LiF; and (b) about 0.004 wt. % to about 0.2 wt. %, based on total weight of the molten electrolyte, of at least one transition metal or at least one compound of the metal or both. The compound may be, for example, a fluoride, oxide, or carbonate. The metal can be nickel, iron, copper, cobalt, or molybdenum. The bath can be employed in a combination that includes a vessel for containing the bath and at least one non-consumable anode and at least one dimensionally stable cathode in the bath. Employing the bath of the present invention during electrolytic reduction of alumina to aluminum can improve the wetting of aluminum on a cathode by reducing or eliminating the formation of non-metallic deposits on the cathode.

A Study on Characterization of Light-Induced Electroless Plated Ni Seed Layer and Silicide Formation for Solar Cell Application

NASA Astrophysics Data System (ADS)

Takaloo, Ashkan Vakilipour; Joo, Seung Ki; Es, Firat; Turan, Rasit; Lee, Doo Won

2018-03-01

Light-induced electroless plating (LIEP) is an easy and inexpensive method that has been widely used for seed layer deposition of Nickel/Copper (Ni/Cu)-based metallization in the solar cell. In this study, material characterization aspects of the Ni seed layer and Ni silicide formation at different bath conditions and annealing temperatures on the n-side of a silicon diode structure have been examined to achieve the optimum cell contacts. The effects of morphology and chemical composition of Ni film on its electrical conductivity were evaluated and described by a quantum mechanical model. It has been found that correlation exists between the theoretical and experimental conductivity of Ni film. Residual stress and phase transformation of Ni silicide as a function of annealing temperature were evaluated using Raman and XRD techniques. Finally, transmission line measurement (TLM) technique was employed to determine the contact resistance of Ni/Si stack after thermal treatment and to understand its correlation with the chemical-structural properties. Results indicated that low electrical resistive mono-silicide (NiSi) phase as low as 5 mΩ.cm2 was obtained.

Electroplated Fe-Co-Ni films prepared in ammonium-chloride-based plating baths

NASA Astrophysics Data System (ADS)

Yanai, T.; Koda, K.; Kaji, J.; Aramaki, H.; Eguchi, K.; Takashima, K.; Nakano, M.; Fukunaga, H.

2018-05-01

We electroplated Fe-Co-Ni films in ammonium-chloride-based plating baths, and investigated the effect of the Co content on the magnetic properties and the structural ones of the as-plated films. The coercivity increased abruptly when the Co content become more than 60 at.%. As the rough surfaces were observed in the high Co content region, we considered that degradation of the surface is a factor of the abrupt increase in the coercivity. From the XRD analysis, we found that another factor of the abrupt increase is fcc-bcc phase transformation, and concluded that we need to keep the fcc structure to obtain Fe-Co-Ni films with low coercivity.

Neutronics Benchmarks for the Utilization of Mixed-Oxide Fuel: Joint U.S./ Russian Progress Report for Fiscal Year 1997, Volume 4, Part 8 - Neutron Poison Plates in Assemblies Containing Homogeneous Mixtures of Polystyrene-Moderated Plutonium and Uranium Oxides

DOE Office of Scientific and Technical Information (OSTI.GOV)

Yavuz, M.

1999-05-01

In the 1970s at the Battelle Pacific Northwest Laboratory (PNL), a series of critical experiments using a remotely operated Split-Table Machine was performed with homogeneous mixtures of (Pu-U)O{sub 2}-polystyrene fuels in the form of square compacts having different heights. The experiments determined the critical geometric configurations of MOX fuel assemblies with and without neutron poison plates. With respect to PuO{sub 2} content and moderation [H/(Pu+U)atomic] ratio (MR), two different homogeneous (Pu-U) O{sub 2}-polystyrene mixtures were considered: Mixture (1) 14.62 wt% PuO{sub 2} with 30.6 MR, and Mixture (2) 30.3 wt% PuO{sub 2} with 2.8 MR. In all mixtures, the uraniummore » was depleted to about O.151 wt% U{sup 235}. Assemblies contained copper, copper-cadmium or aluminum neutron poison plates having thicknesses up to {approximately}2.5 cm. This evaluation contains 22 experiments for Mixture 1, and 10 for Mixture 2 compacts. For Mixture 1, there are 10 configurations with copper plates, 6 with aluminum, and 5 with copper-cadmium. One experiment contained no poison plate. For Mixture 2 compacts, there are 3 configurations with copper, 3 with aluminum, and 3 with copper-cadmium poison plates. One experiment contained no poison plate.« less

Electrodeposition of CuZn Alloys from the Non-Cyanide Alkaline Baths

NASA Astrophysics Data System (ADS)

Li, Minggang; Wei, Guoying; Hu, Shuangshuang; Xu, Shuhan; Yang, Yejiong; Miao, Qinfang

2015-10-01

Effect of copper sulfate on CuZn alloys electroplating from non-cyanide baths are investigated by different electrochemical methods. Cyclic voltammetry and current transient measurements are used to characterize the CuZn alloys electroplating system in order to analyze the nucleation and growth mechanism. The reduction of Cu and CuZn alloy on sheet iron substrates shows an instantaneous nucleation process. However, the reduction of Zn on sheet iron substrates shows a progressive nucleation process. The structure and surface morphology of CuZn alloys are analyzed by X-ray diffraction (XRD) and scanning electron microscopy (SEM). The morphology of CuZn alloys obtained with 50 g L-1 copper sulfate presents a smooth and compact deposit and the size of crystal particle is uniform.

Migration of copper and some other metals from copper tableware

DOE Office of Scientific and Technical Information (OSTI.GOV)

Ishiwata, H.; Inoue, T.; Yoshihira, K.

Intake of heavy metals is an important problem in human health. Certain heavy metals are avoided with regard to their use for utensils or tableware coming into contact with food, although copper is widely used in food processing factories or at home. The use of copper products for the processing, cooking or serving of foods and beverages is considered to be a cause of a copper contamination. Although copper is essential element, its excess ingestion is undesirable. In this study, the migration of copper from tin-plated or non-plated copperware under several experimental conditions was investigated using food-simulating solvents.

Annealing effects in plated-wire memory elements. I - Interdiffusion of copper and Permalloy.

NASA Technical Reports Server (NTRS)

Knudson, C. I.; Kench, J. R.

1971-01-01

Results of investigations using X-ray diffraction and electron-beam microprobe techniques have shown that copper and Permalloy platings interdiffuse at low temperatures when plated-wire memory elements are annealed for times as short as 50 hr. Measurable interdiffusion between Permalloy platings and gold substrates does not occur in similar conditions. Both magnetic and compositional changes during aging are found to occur by a thermally activated process with activation energies around 38 kcal/mol. It is shown, however, that copper-diffusion and magnetic-dispersion changes during aging are merely concurrent processes, neither being the other's cause.

Method for conducting electroless metal-plating processes

DOEpatents

Petit, George S.; Wright, Ralph R.

1978-01-01

This invention is an improved method for conducting electroless metal-plating processes in a metal tank which is exposed to the plating bath. The invention solves a problem commonly encountered in such processes: how to determine when it is advisable to shutdown the process in order to clean and/or re-passivate the tank. The new method comprises contacting the bath with a current-conducting, non-catalytic probe and, during plating operations, monitoring the gradually changing difference in electropotential between the probe and tank. It has been found that the value of this voltage is indicative of the extent to which nickel-bearing decomposition products accumulate on the tank. By utilizing the voltage to determine when shutdown for cleaning is advisable, the operator can avoid premature shutdown and at the same time avoid prolonging operations to the point that spontaneous decomposition occurs.

Volume holographic elements in Kodak 131 plates processed with SHSG method

NASA Astrophysics Data System (ADS)

Collados, Manuel V.; Atencia, Jesus; Lopez, Ana M.; Quintanilla, Manuel M.

2001-08-01

A SHSG procedure to register volume phase holograms in Kodak 131 plates is presented. We analyze the influence on the diffraction efficiency of the developing step and the temperature of the bleaching bath of usual SHSG processes. Applying a simple 12 steps process to form phase transmission holograms developing with D-19, bleaching with R-10 at 70 degrees C and removing the sensitizing dyes that remain in the emulsion with a diluted methanol bath after the fixation step, we obtain relative efficiencies of 100 percent and effective efficiencies of 70 percent.

Electrochemical Assay of Gold-Plating Solutions

NASA Technical Reports Server (NTRS)

Chiodo, R.

1982-01-01

Gold content of plating solution is assayed by simple method that required only ordinary electrochemical laboratory equipment and materials. Technique involves electrodeposition of gold from solution onto electrode, the weight gain of which is measured. Suitable fast assay methods are economically and practically necessary in electronics and decorative-plating industries. If gold content in plating bath is too low, poor plating may result, with consequent economic loss to user.

Coated Metal Articles and Method of Making

DOEpatents

Boller, Ernest R.; Eubank, Lowell D.

2004-07-06

The method of protectively coating metallic uranium which comprises dipping the metallic uranium in a molten alloy comprising about 20-75% of copper and about 80-25% of tin, dipping the coated uranium promptly into molten tin, withdrawing it from the molten tin and removing excess molten metal, thereupon dipping it into a molten metal bath comprising aluminum until it is coated with this metal, then promptly withdrawing it from the bath.

Nondestructive test method accurately sorts mixed bolts

NASA Technical Reports Server (NTRS)

Dezeih, C. J.

1966-01-01

Neutron activation analysis method sorts copper plated steel bolts from nickel plated steel bolts. Copper and nickel plated steel bolt specimens of the same configuration are irradiated with thermal neutrons in a test reactor for a short time. After thermal neutron irradiation, the bolts are analyzed using scintillation energy readout equipment.

Optimizing friction stir weld parameters of aluminum and copper using conventional milling machine

NASA Astrophysics Data System (ADS)

Manisegaran, Lohappriya V.; Ahmad, Nurainaa Ayuni; Nazri, Nurnadhirah; Noor, Amirul Syafiq Mohd; Ramachandran, Vignesh; Ismail, Muhammad Tarmizizulfika; Ahmad, Ku Zarina Ku; Daruis, Dian Darina Indah

2018-05-01

The joining of two of any particular materials through friction stir welding (FSW) are done by a rotating tool and the work piece material that generates heat which causes the region near the FSW tool to soften. This in return will mechanically intermix the work pieces. The first objective of this study is to join aluminum plates and copper plates by means of friction stir welding process using self-fabricated tools and conventional milling machine. This study also aims to investigate the optimum process parameters to produce the optimum mechanical properties of the welding joints for Aluminum plates and Copper plates. A suitable tool bit and a fixture is to be fabricated for the welding process. A conventional milling machine will be used to weld the aluminum and copper. The most important parameters to enable the process are speed and pressure of the tool (or tool design and alignment of the tool onto the work piece). The study showed that the best surface finish was produced from speed of 1150 rpm and tool bit tilted to 3°. For a 200mm × 100mm Aluminum 6061 with plate thickness of 2 mm at a speed of 1 mm/s, the time taken to complete the welding is only 200 seconds or equivalent to 3 minutes and 20 seconds. The Copper plates was successfully welded using FSW with tool rotation speed of 500 rpm, 700 rpm, 900 rpm, 1150 rpm and 1440 rpm and with welding traverse rate of 30 mm/min, 60 mm/min and 90 mm/min. As the conclusion, FSW using milling machine can be done on both Aluminum and Copper plates, however the weld parameters are different for the two types of plates.

Silver plating ensures reliable diffusion bonding of dissimilar metals

NASA Technical Reports Server (NTRS)

1967-01-01

Dissimilar metals are reliably joined by diffusion bonding when the surfaces are electroplated with silver. The process involves cleaning and etching, anodization, silver striking, and silver plating with a conventional plating bath. It minimizes the formation of detrimental intermetallic phases and provides greater tolerance of processing parameters.

40 CFR 471.85 - Pretreatment standards for new sources (PSNS).

Code of Federal Regulations, 2011 CFR

2011-07-01

... Copper 0.459 0.219 Cyanide 0.072 0.029 Zinc 0.365 0.151 (j) Alkaline cleaning spent baths. Subpart H—PSNS... million off-pounds) of zinc alkaline cleaned Chromium 0.002 0.0006 Copper 0.005 0.002 Cyanide 0.0007 0.0003 Zinc 0.004 0.002 (k) Alkaline cleaning rinse. Subpart H—PSNS Pollutant or pollutant property...

40 CFR 471.85 - Pretreatment standards for new sources (PSNS).

Code of Federal Regulations, 2010 CFR

2010-07-01

... Copper 0.459 0.219 Cyanide 0.072 0.029 Zinc 0.365 0.151 (j) Alkaline cleaning spent baths. Subpart H—PSNS... million off-pounds) of zinc alkaline cleaned Chromium 0.002 0.0006 Copper 0.005 0.002 Cyanide 0.0007 0.0003 Zinc 0.004 0.002 (k) Alkaline cleaning rinse. Subpart H—PSNS Pollutant or pollutant property...

Nickel cobalt phosphorous low stress electroplating

NASA Technical Reports Server (NTRS)

Engelhaupt, Darell E. (Inventor); Ramsey, Brian D. (Inventor)

2002-01-01

An electrolytic plating process is provided for electrodepositing a nickel or nickel cobalt alloy which contains at least about 2% to 25% by atomic volume of phosphorous. The process solutions contains nickel and optionally cobalt sulfate, hypophosphorous acid or a salt thereof, boric acid or a salt thereof, a monodentate organic acid or a salt thereof, and a multidentate organic acid or a salt thereof. The pH of the plating bath is from about 3.0 to about 4.5. An electroplating process is also provided which includes electroplating from the bath a nickel or nickel cobalt phosphorous alloy. This process can achieve a deposit with high microyield of at least about 84 kg/mm.sup.2 (120 ksi) and a density lower than pure nickel of about 8.0 gm/cc. This process can be used to plate a deposit of essentially zero stress at plating temperatures from ambient to 70.degree. C.

Finding Platinum-Coating Gaps On Titanium Anodes

NASA Technical Reports Server (NTRS)

Bodemeijer, Ronnald; Flowers, Cecil E.

1990-01-01

Simple procedure makes gaps visible to eye. New gap-detection method consists of plating thin layer of non-silver-colored metal like copper or gold on anode. Contrast in color between plated metal and bare anode material makes gaps stand out. If anode passes inspection, copper or gold plate removable by reversal of test-plating current. Remains to be determined whether test plating and removal damages anode. New method simpler and more economical than previous attempts to identify gaps in platinum.

COATING METHOD

DOEpatents

Townsend, R.G.

1959-08-25

A method is described for protectively coating beryllium metal by etching the metal in an acid bath, immersing the etched beryllium in a solution of sodium zincate for a brief period of time, immersing the beryllium in concentrated nitric acid, immersing the beryhlium in a second solution of sodium zincate, electroplating a thin layer of copper over the beryllium, and finally electroplating a layer of chromium over the copper layer.

Process for making diamonds

NASA Technical Reports Server (NTRS)

Rasquin, J. R.; Estes, M. F. (Inventor)

1973-01-01

A description is given of a device and process for making industrial diamonds. The device is composed of an exponential horn tapering from a large end to a small end, with a copper plate against the large end. A magnetic hammer abuts the copper plate. The copper plate and magnetic hammer function together to create a shock wave at the large end of the horn. As the wave propagates to the small end, the extreme pressure and temperature caused by the wave transforms the graphite, present in an anvil pocket at the small end, into diamonds.

Bath for electrolytic reduction of alumina and method therefor

DOEpatents

Brown, Craig W.; Brooks, Richard J.; Frizzle, Patrick B.; Juric, Drago D.

2002-11-26

An electrolytic bath for use during the electrolytic reduction of alumina to aluminum. The bath comprises a molten electrolyte having the following ingredients: (a) AlF.sub.3 and at least one salt selected from the group consisting of NaF, KF, and LiF; and (b) about 0.004 wt. % to about 0.2 wt. %, based on total weight of the molten electrolyte, of at least one transition metal or at least one compound of the metal or both. The compound may be, for example, a fluoride, oxide, or carbonate. The metal can be nickel, iron, copper, cobalt, or molybdenum. The bath can be employed in a combination that includes a vessel for containing the bath and at least one non-consumable anode and at least one dimensionally stable cathode in the bath. Employing the bath of the present invention during electrolytic reduction of alumina to aluminum can improve the wetting of aluminum on a cathode by reducing or eliminating the formation of non-metallic deposits on the cathode. Removing sulfur from the bath can also minimize cathode deposits. Aluminum formed on the cathode can be removed directly from the cathode.

Carbon black dispersion pre-plating technology for printed wire board manufacturing. Final technology evaluation report

DOE Office of Scientific and Technical Information (OSTI.GOV)

Folsom, D.W.; Gavaskar, A.R.; Jones, J.A.

1993-10-01

The project compared chemical use, waste generation, cost, and product quality between electroless copper and carbon-black-based preplating technologies at the printed wire board (PWB) manufacturing facility of McCurdy Circuits in Orange, CA. The carbon-black based preplating technology evaluated is used as an alternative process for electroless copper (EC) plating of through-holes before electrolytic copper plating. The specific process used at McCurdy is the BlackHole (BH) technology process, which uses a dispersion of carbon black in an aqueous solution to provide a conductive surface for subsequent electrolytic copper plating. The carbon-black dispersion technology provided effective waste reduction and long-term cost savings.more » The economic analysis determined that the new process was cost efficient because chemical use was reduced and the process proved more efficient; the payback period was less than 4 yrs.« less

Collapsed heteroclinic snaking near a heteroclinic chain in dragged meniscus problems.

PubMed

Tseluiko, D; Galvagno, M; Thiele, U

2014-04-01

A liquid film is studied that is deposited onto a flat plate that is inclined at a constant angle to the horizontal and is extracted from a liquid bath at a constant speed. We analyse steady-state solutions of a long-wave evolution equation for the film thickness. Using centre manifold theory, we first obtain an asymptotic expansion of solutions in the bath region. The presence of an additional temperature gradient along the plate that induces a Marangoni shear stress significantly changes these expansions and leads to the presence of logarithmic terms that are absent otherwise. Next, we numerically obtain steady solutions and analyse their behaviour as the plate velocity is changed. We observe that the bifurcation curve exhibits collapsed (or exponential) heteroclinic snaking when the plate inclination angle is above a certain critical value. Otherwise, the bifurcation curve is monotonic. The steady profiles along these curves are characterised by a foot-like structure that is formed close to the meniscus and is preceded by a thin precursor film further up the plate. The length of the foot increases along the bifurcation curve. Finally, we prove with a Shilnikov-type method that the snaking behaviour of the bifurcation curves is caused by the existence of an infinite number of heteroclinic orbits close to a heteroclinic chain that connects in an appropriate three-dimensional phase space the fixed point corresponding to the precursor film with the fixed point corresponding to the foot and then with the fixed point corresponding to the bath.

Shock induced spall fracture in polycrystalline copper

NASA Astrophysics Data System (ADS)

Mukherjee, D.; Rav, Amit; Sur, Amit; Joshi, K. D.; Gupta, Satish C.

2014-04-01

The plate impact experiments have been conducted on commercially available 99.99% pure polycrystalline samples of copper using single stage gas gun facility. The free surface velocity history of the sample plate measured using VISAR instrument is utilized to determine the dynamic yield strength and spall strength of copper. The dynamic yield strength and spall strength of polycrystalline copper sample has been determined to be 0.14 GPa and 1.32 GPa, respectively with corresponding strain rates of the order of 104/s.

Development of technique for AR coating and nickel and copper metallization of solar cells. FPS Project: Product development

NASA Technical Reports Server (NTRS)

Taylor, W.

1982-01-01

Printed nickel overplated with copper and applied on top of a predeposited silicon nitride antireflective coating system for metallizing solar cells was analyzed. The ESL D and E paste formulations, and the new formulations F, G, H, and D-1 were evaluated. The nickel thick films were tested after firing for stability in the cleaning and plating solutions used in the Vanguard-Pacific brush plating process. It was found that the films are very sensitive to the leaning and alkaline copper solutions. Less sensitivity was displayed to the neutral copper solution. Microscopic and SEM observations show segregation of frit at the silicon nitride thick film interface with loose frit residues after lifting off plated grid lines.

Pulsed Electrodeposition of Ni with Uniform Co-Deposition of Micron Sized Diamond Particles on Copper Substrate

NASA Astrophysics Data System (ADS)

Kumar, Prashant; Mahato, Neelima

Nanocrystalline nickel was deposited on annealed copper substrate of unit surface area (1 cm2) via pulsed electrodeposition technique using potentiostat (model 263A, Princeton Applied Research, USA) from Watts bath containing nickel sulfate, nickel chloride ,boric acid and sodium citrate. Diamond particles of three different dimensions, viz., 1, 3, and 6 micron were added separately (5 g/L) to the watts bath and co-deposited along with nanocrystalline nickel. The temperature was kept constant at 55 °C. The solution was ultrasonicated for 45-60 minutes prior to deposition to disperse the diamond particles uniformly in the bath. Depositions were carried out at different current densities, viz., 50, 100,150 and 200 mA/ cm2 for different durations, i.e.7, 14 and 21 minutes and best results are optimized for 200mA/cm2 so it is used for all process here .Scanning electron micrographs (SEM) show uniform deposition of microstructure of micron diamond on the surface of copper embedded in the nickel matrix. Elemental mapping confirmed uniform deposition of nickel and diamond with almost no cracks or pits. Mechanical properties of the sample such as, Vicker's hardness increased abruptly after the electrodeposition. Improved microstructural and mechanical properties were found in the case of electrodeposited surfaces containing followed by 3 and 6 micron diamond. The properties were also found better than those processed via stirring the solution during deposition.

Degradation of graphene coated copper in simulated proton exchange membrane fuel cell environment: Electrochemical impedance spectroscopy study

NASA Astrophysics Data System (ADS)

Ren, Y. J.; Anisur, M. R.; Qiu, W.; He, J. J.; Al-Saadi, S.; Singh Raman, R. K.

2017-09-01

Metallic materials are most suitable for bipolar plates of proton exchange membrane fuel cell (PEMFC) because they possess the required mechanical strength, durability, gas impermeability, acceptable cost and are suitable for mass production. However, metallic bipolar plates are prone to corrosion or they can passivate under PEMFC environment and interrupt the fuel cell operation. Therefore, it is highly attractive to develop corrosion resistance coating that is also highly conductive. Graphene fits these criteria. Graphene coating is developed on copper by chemical vapor deposition (CVD) with an aim to improving corrosion resistance of copper under PEMFC condition. The Raman Spectroscopy shows the graphene coating to be multilayered. The electrochemical degradation of graphene coated copper is investigated by electrochemical impedance spectroscopy (EIS) in 0.5 M H2SO4 solution at room temperature. After exposure to the electrolyte for up to 720 h, the charge transfer resistance (Rt) of the graphene coated copper is ∼3 times greater than that of the bare copper, indicating graphene coatings could improve the corrosion resistance of copper bipolar plates.

Conformal Electroless Nickel Plating on Silicon Wafers, Convex and Concave Pyramids, and Ultralong Nanowires.

PubMed

Gill, Thomas Mark; Zhao, Jiheng; Berenschot, Erwin J W; Tas, Niels; Zheng, Xiaolin

2018-06-25

Nickel (Ni) plating has garnered great commercial interest, as it provides excellent hardness, corrosion resistance, and electrical conductivity. Though Ni plating on conducting substrates is commonly employed via electrodeposition, plating on semiconductors and insulators often necessitates electroless approaches. Corresponding plating theory for deposition on planar substrates was developed as early as 1946, but for substrates with micro- and nanoscale features, very little is known of the relationships between plating conditions, Ni deposition quality, and substrate morphology. Herein, we describe the general theory and mechanisms of electroless Ni deposition on semiconducting silicon (Si) substrates, detailing plating bath failures and establishing relationships between critical plating bath parameters and the deposited Ni film quality. Through this theory, we develop two different plating recipes: galvanic displacement (GD) and autocatalytic deposition (ACD). Neither recipe requires pretreatment of the Si substrate, and both methods are capable of depositing uniform Ni films on planar Si substrates and convex Si pyramids. In comparison, ACD has better tunability than GD, and it provides a more conformal Ni coating on complex and high-aspect-ratio Si structures, such as inverse fractal Si pyramids and ultralong Si nanowires. Our methodology and theoretical analyses can be leveraged to develop electroless plating processes for other metals and metal alloys and to generally provide direction for the adaptation of electroless deposition to modern applications.

Plating methods, a survey

NASA Technical Reports Server (NTRS)

Berkowitz, J. B.; Emerson, N. H.

1972-01-01

Results are presented of a comprehensive search of the literature available, much of which has been generated by the research centers of NASA and its contractors, on plating and coating methods and techniques. Methods covered included: (1) electroplating from aqueous solutions; (2) electroplating from nonaqueous solutions; (3) electroplating from fused-salt baths; (4) electroforming; (5) electroless plating, immersion plating, and mirroring; (6) electroplating from gaseous plasmas; and (7) anodized films and conversion coatings.

Microstructure Evolution During Stainless Steel-Copper Vacuum Brazing with a Ag/Cu/Pd Filler Alloy: Effect of Nickel Plating

NASA Astrophysics Data System (ADS)

Choudhary, R. K.; Laik, A.; Mishra, P.

2017-03-01

Vacuum brazing of stainless steel and copper plates was done using a silver-based filler alloy. In one set of experiments, around 30-µm-thick nickel coatings were electrochemically applied on stainless steel plates before carrying out the brazing runs and its effect in making changes in the braze-zone microstructure was studied. For brazing temperature of 830 °C, scanning electron microscopy examination of the braze-zone revealed that relatively sound joints were obtained when brazing was done with nickel-coated stainless steel than with uncoated one. However, when brazing of nickel-coated stainless steel and copper plates was done at 860 °C, a wide crack appeared in the braze-zone adjacent to copper side. Energy-dispersive x-ray analysis and electron microprobe analysis confirmed that at higher temperature, the diffusion of Cu atoms from copper plate towards the braze-zone was faster than that of Ni atoms from nickel coating. Helium leak rate of the order 10-11 Pa m3/s was obtained for the crack-free joint, whereas this value was higher than 10-4 Pa m3/s for the joint having crack. The shear strength of the joint was found to decrease considerably due to the presence of crack.

Mechanical properties of Cr-Cu coatings produced by electroplating

NASA Astrophysics Data System (ADS)

Riyadi, Tri Widodo Besar; Sarjito, Masyrukan, Riswan, Ricky Ary

2017-06-01

Hard chromium coatings has long been considered as the most used electrodeposited coating in several industrial applications such as in petrochemistry, oil and gas industries. When hard coatings used in fastener components, the sliding contact during fastening operation produces high tensile stresses on the surface which can generate microcracks. For component used in high oxidation and corrosion environment, deep cracks cannot be tolerated. In this work, a laminated structure of Cr-Cu coating was prepared using electroplating on carbon steel substrates. Two baths of chrome and copper electrolyte solutions were prepared to deposit Cr as the first layer and Cu as the second layer. The effect of current voltages on the thickness, hardness and specific wear rate of the Cu layer was investigated. The results show that an increase of the current voltages increased the thickness and hardness of the Cu layer, but reduced the specific wear rate. This study showed that the use of Cu can be a potential candidate as a laminated structure Cr-Cu for chromium plating.

Preparation of superconductor precursor powders

DOEpatents

Bhattacharya, Raghunath; Blaugher, Richard D.

1995-01-01

A process for the preparation of a precursor metallic powder composition for use in the subsequent formation of a superconductor. The process comprises the steps of providing an electrodeposition bath comprising an electrolyte medium and a cathode substrate electrode, and providing to the bath one or more soluble salts of one or more respective metals, such as nitrate salts of thallium, barium, calcium, and copper, which are capable of exhibiting superconductor properties upon subsequent appropriate treatment. The bath is continually energized to cause the metallic particles formed at the electrode to drop as a powder from the electrode into the bath, and this powder, which is a precursor powder for superconductor production, is recovered from the bath for subsequent treatment. The process permits direct inclusion of thallium in the preparation of the precursor powder, and yields an amorphous product mixed on an atomic scale to thereby impart inherent high reactivity. Superconductors which can be formed from the precursor powder include pellet and powder-in-tube products.

7. INTERIOR VIEW OF THE MESTA CAROUSEL PICKLER, A SERIES ...

Library of Congress Historic Buildings Survey, Historic Engineering Record, Historic Landscapes Survey

7. INTERIOR VIEW OF THE MESTA CAROUSEL PICKLER, A SERIES OF ACID, WATER AND LIME BATHS WHICH REMOVE RUST AND SCALE FROM THE STEEL PLATE AND LUBRICATES PLATE FOR THE SHEARING PROCESS - LaBelle Iron Works, Thirtieth & Wood Streets, Wheeling, Ohio County, WV

Sulfidation treatment of copper-containing plating sludge towards copper resource recovery.

PubMed

Kuchar, D; Fukuta, T; Onyango, M S; Matsuda, H

2006-11-02

The present study is concerned with the sulfidation treatment of copper-containing plating sludge towards copper resource recovery by flotation of copper sulfide from treated sludge. The sulfidation treatment was carried out by contacting simulated or real copper plating sludge with Na(2)S solution for a period of 5 min to 24 h. The initial molar ratio of S(2-) to Cu(2+) (S(2-) to Me(2+) in the case of real sludge) was adjusted to 1.00, 1.25 or 1.50, while the solid to liquid ratio was set at 1:50. As a result, it was found that copper compounds were converted to various copper sulfides within the first 5 min. In the case of simulated copper sludge, CuS was identified as the main sulfidation product at the molar ratio of S(2-) to Cu(2+) of 1.00, while Cu(7)S(4) (Roxbyite) was mainly found at the molar ratios of S(2-) to Cu(2+) of 1.50 and 1.25. Based on the measurements of oxidation-reduction potential, the formation of either CuS or Cu(7)S(4) at different S(2-) to Cu(2+) molar ratios was attributed to the changes in the oxidation-reduction potential. By contrast, in the case of sulfidation treatment of real copper sludge, CuS was predominantly formed, irrespective of S(2-) to Me(2+) molar ratio.

Real time monitoring of electroless nickel plating

NASA Astrophysics Data System (ADS)

Rains, Aaron E.; Kline, Ronald A.

2013-01-01

This work deals with the design and manufacturing of the heat and chemical resistant transducer case required for on-line immersion testing, experimental design, data acquisition and signal processing. Results are presented for several depositions with an accuracy of two ten-thousandths of an inch in coating thickness obtained. Monitoring the deposition rate of Electroless Nickel (EN) plating in-situ will provide measurement of the accurate dimensions of the component being plated, in real time. EN is used as for corrosion and wear protection for automotive an - Electroless Nickel (EN) plating is commonly used for corrosion and wear protection for automotive and aerospace components. It plates evenly and symmetrically, theoretically allowing the part to be plated to its final dimension. Currently the standard approach to monitoring the thickness of the deposited nickel is to remove the component from the plating bath and physically measure the part. This can lead to plating problems such as pitting, non-adhesion of the deposit and contamination of the plating solution. The goal of this research effort is to demonstrate that plating thickness can be rapidly and accurately measured using ultrasonic testing. Here a special housing is designed to allow immersion of the ultrasonic transducers directly into the plating bath. An FFT based signal processing algorithm was developed to resolve closely spaced echoes for precise thickness determination. The technique in this research effort was found to be capable of measuring plating thicknesses to within 0.0002 inches. It is expected that this approach will lead to cost savings in many EN plating operations.

Development of technique for AR coating and nickel and copper metallization of solar cells: FPS project, product development

NASA Technical Reports Server (NTRS)

Rominger, C. G.

1981-01-01

Silicon nitride and nickel pastes are investigated in conjunction with a brush copper plating process for the purpose of identifying one or more fabrication sequences which yield at least 10 percent efficient N(+)/P(+) flat plate solar cells. The adhesion of all nickel pastes is reduced significantly when subjected to acidic and alkaline brush copper plating solutions as a result of a combination of thermally induced stress and chemical attack of the frit, which occurs at the interface with the silicon solar cell. The AgF is penetrating the 800 a of Si3N4 and ohmic contact is occurring at all fire-in tempertures. During the brush plating process, fingers and buss bars tend to spread.

Electrical Characterization of Spherical Copper Oxide Memristive Array Sensors

DTIC Science & Technology

2014-03-27

Quartz Tube Furnace . . . . . . . 37 3.3.2.2 Thermal Oxidation in Air on a Hot Plate . . . . . . . . . 38 3.4 Experimental Setup for Electrical...closed hot plate . . . 80 B.1 Oxidation rates for copper at 100 °C by two different formulas . . . . . . . . . 81 xi List of Tables Table Page 2.1 The... Tectonics Inc. and manufactured by Canfield Technologies using a proprietary fabrication method. As received, the copper spheres may have contaminants

High adherence copper plating process

DOEpatents

Nignardot, Henry

1993-01-01

A process for applying copper to a substrate of aluminum or steel by electrodeposition and for preparing an aluminum or steel substrate for electrodeposition of copper. Practice of the invention provides good adhesion of the copper layer to the substrate.

Rapid determination of trace copper in animal feed based on micro-plate colorimetric reaction and statistical partitioning correction.

PubMed

Niu, Yiming; Wang, Jiayi; Zhang, Chi; Chen, Yiqiang

2017-04-15

The objective of this study was to develop a micro-plate based colorimetric assay for rapid and high-throughput detection of copper in animal feed. Copper ion in animal feed was extracted by trichloroacetic acid solution and reduced to cuprous ion by hydroxylamine. The cuprous ion can chelate with 2,2'-bicinchoninic acid to form a Cu-BCA complex which was detected with high sensitivity by micro-plate reader at 354nm. The whole assay procedure can be completed within 20min. To eliminate matrix interference, a statistical partitioning correction approach was proposed, which makes the detection of copper in complex samples possible. The limit of detection was 0.035μg/mL and the detection range was 0.1-10μg/mL of copper in buffer solution. Actual sample analysis indicated that this colorimetric assay produced results consistent with atomic absorption spectrometry analysis. These results demonstrated that the developed assay can be used for rapid determination of copper in animal feed. Copyright © 2016 Elsevier Ltd. All rights reserved.

Flatbed scanners as a source of imaging. Brightness assessment and additives determination in a nickel electroplating bath.

PubMed

Vidal, M; Amigo, J M; Bro, R; Ostra, M; Ubide, C; Zuriarrain, J

2011-05-23

Desktop flatbed scanners are very well-known devices that can provide digitized information of flat surfaces. They are practically present in most laboratories as a part of the computer support. Several quality levels can be found in the market, but all of them can be considered as tools with a high performance and low cost. The present paper shows how the information obtained with a scanner, from a flat surface, can be used with fine results for exploratory and quantitative purposes through image analysis. It provides cheap analytical measurements for assessment of quality parameters of coated metallic surfaces and monitoring of electrochemical coating bath lives. The samples used were steel sheets nickel-plated in an electrodeposition bath. The quality of the final deposit depends on the bath conditions and, especially, on the concentration of the additives in the bath. Some additives become degraded with the bath life and so is the quality of the plate finish. Analysis of the scanner images can be used to follow the evolution of the metal deposit and the concentration of additives in the bath. Principal component analysis (PCA) is applied to find significant differences in the coating of sheets, to find directions of maximum variability and to identify odd samples. The results found are favorably compared with those obtained by means of specular reflectance (SR), which is here used as a reference technique. Also the concentration of additives SPB and SA-1 along a nickel bath life can be followed using image data handled with algorithms such as partial least squares (PLS) regression and support vector regression (SVR). The quantitative results obtained with these and other algorithms are compared. All this opens new qualitative and quantitative possibilities to flatbed scanners. Copyright © 2011 Elsevier B.V. All rights reserved.

Memristive Responses of Jammed Granular Copper Array Sensors to Mechanical Stress

DTIC Science & Technology

2014-03-27

called Industrial Tectonics Inc. (itiball.com) with the statement of 99.95% minimum copper; stating the residual is most likely silver [12]. Their...atmosphere hot plate and quartz tube furnace with controlled atmosphere were used to oxidize the spheres at various temperatures, the hot plate ...combination spheres, as was seen by Branly. Using a nitric acid etch and 15 minute (min.) hot plate oxidized sphere array consisting of four spheres

Cleaning and activation of beryllium-copper electron multiplier dynodes.

NASA Technical Reports Server (NTRS)

Pongratz, M. B.

1972-01-01

Description of a cleaning and activation procedure followed in preparing beryllium-copper dynodes for electron multipliers used in sounding-rocket experiments to detect auroral electrons. The initial degreasing step involved a 5-min bath in trichloroethylene in an ultrasonic cleaner. This was followed by an ultrasonic rinse in methanol and by a two-step acid pickling treatment to remove the oxides. Additional rinsing in water and methanol was followed by activation in a stainless-steel RF induction oven.

Radon daughter plate-out measurements at SNOLAB for polyethylene and copper

NASA Astrophysics Data System (ADS)

Stein, Matthew; Bauer, Dan; Bunker, Ray; Calkins, Rob; Cooley, Jodi; Loer, Ben; Scorza, Silvia

2018-02-01

Polyethylene and copper samples were exposed to the underground air at SNOLAB for approximately three months while several environmental factors were monitored. Predictions of the radon-daughter plate-out rate are compared to the resulting surface activities, obtained from high-sensitivity measurements of alpha emissivity using the XIA UltraLo-1800 spectrometer at Southern Methodist University. From these measurements, we determine an average 210Pb plate-out rate of 249 and 423 atoms/day/cm2 for polyethylene and copper, respectively, when exposed to radon activity concentration of 135 Bq/m3 at SNOLAB. A time-dependent model of alpha activity is discussed for these materials placed in similar environmental conditions.

Radon daughter plate-out measurements at SNOLAB for polyethylene and copper

DOE Office of Scientific and Technical Information (OSTI.GOV)

Stein, Matthew; Bauer, Dan; Bunker, Ray

2018-02-01

Polyethylene and copper samples were exposed to the underground air at SNOLAB for approximately three months while several environmental factors were monitored. Predictions of the radon-daughter plate-out rate are compared to the resulting surface activities, obtained from high-sensitivity measurements of alpha emissivity using the XIA UltraLo-1800 spectrometer at SMU. From these measurements, we determine an averagemore » $$^{210}$$Pb plate-out rate of 249 and 423~atoms/day/cm$$^{2}$$ for polyethylene and copper, respectively, when exposed to radon activity of 135 Bq/m$$^{3}$$ at SNOLAB. A time-dependent model of alpha activity is discussed for these materials placed in similar environmental conditions.« less

Closed loop oscillating heat pipe as heating device for copper plate

NASA Astrophysics Data System (ADS)

Kamonpet, Patrapon; Sangpen, Waranphop

2017-04-01

In manufacturing parts by molding method, temperature uniformity of the mold holds a very crucial aspect for the quality of the parts. Studies have been carried out in searching for effective method in controlling the mold temperature. Using of heat pipe is one of the many effective ways to control the temperature of the molding area to the right uniform level. Recently, there has been the development of oscillating heat pipe and its application is very promising. The semi-empirical correlation for closed-loop oscillating heat pipe (CLOHP) with the STD of ±30% was used in design of CLOHP in this study. By placing CLOHP in the copper plate at some distance from the plate surface and allow CLOHP to heat the plate up to the set surface temperature, the temperature of the plate was recorded. It is found that CLOHP can be effectively used as a heat source to transfer heat to copper plate with excellent temperature distribution. The STDs of heat rate of all experiments are well in the range of ±30% of the correlation used.

A novel method of reducing agent contacting pattern for metal ceramic composite membrane fabrication

NASA Astrophysics Data System (ADS)

Agarwal, Amrita; Pujari, Murali; Uppaluri, Ramgopal; Verma, Anil

2014-11-01

Deliberating upon process modifications for surfactant induced electroless plating (SIEP), this article highlights the plating bath performance characteristics for two distinct reducing agent contacting modes (bulk and drop wise). Eventually, the effect of reducing agent concentration (50, 100, 200% excess) suitable for electroless plating bath for a nickel concentration of 0.08 mol/L was investigated. Finally, the compatibility of variation in nickel concentration (0.08-0.24 mol/L) with respect to variation in reducing agent concentration (50, 100, 200% excess) was investigated. LPSA, BET, FTIR, XRD, FESEM and nitrogen permeation experiments were used for surface and physical characterization. It was observed that for the bulk addition of reducing agent, the PPD values were 84.5% which increased to 89.3% for dropwise addition case. Thus the optimal combinations of SIEP process parameters were identified as 0.08 mol/L of nickel metal solution concentration with 100% excess drop-wise reducing agent. These conditions provided a plating rate of 5.5 × 10-5 mol/m2 s, PPD of 89.3% and a metal film thickness of 15.7 μm respectively after 12 h of sequential plating.

High adherence copper plating process

DOEpatents

Nignardot, H.

1993-09-21

A process is described for applying copper to a substrate of aluminum or steel by electrodeposition and for preparing the surface of an aluminum or steel substrate for the electrodeposition of copper. Practice of the invention provides good adhesion of the copper layer to either substrate.

Colour-Difference Measurement Method for Evaluation of Quality of Electrolessly Deposited Copper on Polymer after Laser-Induced Selective Activation

PubMed Central

Gedvilas, Mindaugas; Ratautas, Karolis; Kacar, Elif; Stankevičienė, Ina; Jagminienė, Aldona; Norkus, Eugenijus; Li Pira, Nello; Račiukaitis, Gediminas

2016-01-01

In this work a novel colour-difference measurement method for the quality evaluation of copper deposited on a polymer is proposed. Laser-induced selective activation (LISA) was performed onto the surface of the polycarbonate/acrylonitrile butadiene styrene (PC/ABS) polymer by using nanosecond laser irradiation. The laser activated PC/ABS polymer was copper plated by using the electroless copper plating (ECP) procedure. The sheet resistance measured by using a four-point probe technique was found to decrease by the power law with the colour-difference of the sample images after LISA and ECP procedures. The percolation theory of the electrical conductivity of the insulator conductor mixture has been adopted in order to explain the experimental results. The new proposed method was used to determine an optimal set of the laser processing parameters for best plating conditions. PMID:26960432

Mixing Phenomena in a Bottom Blown Copper Smelter: A Water Model Study

NASA Astrophysics Data System (ADS)

Shui, Lang; Cui, Zhixiang; Ma, Xiaodong; Akbar Rhamdhani, M.; Nguyen, Anh; Zhao, Baojun

2015-03-01

The first commercial bottom blown oxygen copper smelting furnace has been installed and operated at Dongying Fangyuan Nonferrous Metals since 2008. Significant advantages have been demonstrated in this technology mainly due to its bottom blown oxygen-enriched gas. In this study, a scaled-down 1:12 model was set up to simulate the flow behavior for understanding the mixing phenomena in the furnace. A single lance was used in the present study for gas blowing to establish a reliable research technique and quantitative characterisation of the mixing behavior. Operating parameters such as horizontal distance from the blowing lance, detector depth, bath height, and gas flow rate were adjusted to investigate the mixing time under different conditions. It was found that when the horizontal distance between the lance and detector is within an effective stirring range, the mixing time decreases slightly with increasing the horizontal distance. Outside this range, the mixing time was found to increase with increasing the horizontal distance and it is more significant on the surface. The mixing time always decreases with increasing gas flow rate and bath height. An empirical relationship of mixing time as functions of gas flow rate and bath height has been established first time for the horizontal bottom blowing furnace.

Characterisation of a Zn / Ni Plating Bath

DTIC Science & Technology

2009-09-03

accelerated corrosion in the first stages which is then slowed down by its own product of corrosion, Zn(OH)212. Zinc hydroxide dehydrates in time to form ZnO ... Electrochemistry , 1991, 21, 642 [5] – Alfantasi, A.M., A study on the synthesis, characterization ans properties of pulse-plated ultrafine- grained Zn-Ni alloy

Chromium recovery from exhausted baths generated in plating processes and its reuse in the tanning industry.

PubMed

Torras, Josep; Buj, Irene; Rovira, Miquel; de Pablo, Joan

2012-03-30

Chromium plating used for functional purposes provides an extremely hard, wear and corrosion resistant layer by means of electrolytic deposition. Typical layer thicknesses range between 2.5 and 500 μm. Chromium electroplating baths contain high concentrations of Cr(VI) with chromium trioxide (CrO(3)) as the chromium source. When because of technical or economic reasons a bath gets exhausted, a waste containing mainly chromium as dichromate as well as other heavy metals is generated. Chromium may then be purified for use in other industrial processes with different requirements. In this work, a sustainable system for using galvanic wastes as reagents in the leather tanning industry, thus reducing quantity of wastes to be treated, is presented. Metal cations present in the chromium exhausted bath were precipitated with NaOH. Then, the solution containing mainly soluble Cr(VI) was separated. By means of sodium sulphite in acidic conditions, Cr(VI) was reduced to Cr(III) as chromium (III) sulphate. From chromium (III) sulphate a basic Cr(III) sulphate may be obtained, which is one of most used compounds in the tanning industry. Cr(III) concentration in the final solution allows its reuse without concentration, but with a slight dilution. Copyright © 2012 Elsevier B.V. All rights reserved.

High-strength braze joints between copper and steel

NASA Technical Reports Server (NTRS)

Kuhn, R. F.

1967-01-01

High-strength braze joints between copper and steel are produced by plating the faying surface of the copper with a layer of gold. This reduces porosity in the braze area and strengthens the resultant joint.

Radon daughter plate-out measurements at SNOLAB for polyethylene and copper

DOE Office of Scientific and Technical Information (OSTI.GOV)

Stein, Matthew; Bauer, Dan; Bunker, Ray

We report that polyethylene and copper samples were exposed to the underground air at SNOLAB for approximately three months while several environmental factors were monitored. Predictions of the radon-daughter plate-out rate are compared to the resulting surface activities, obtained from high-sensitivity measurements of alpha emissivity using the XIA UltraLo-1800 spectrometer at Southern Methodist University. From these measurements, we determine an average 210Pb plate-out rate of 249 and 423 atoms/day/cm 2 for polyethylene and copper, respectively, when exposed to radon activity concentration of 135 Bq/m 3 at SNOLAB. Finally, a time-dependent model of alpha activity is discussed for these materials placedmore » in similar environmental conditions.« less

Radon daughter plate-out measurements at SNOLAB for polyethylene and copper

DOE PAGES

Stein, Matthew; Bauer, Dan; Bunker, Ray; ...

2017-11-04

We report that polyethylene and copper samples were exposed to the underground air at SNOLAB for approximately three months while several environmental factors were monitored. Predictions of the radon-daughter plate-out rate are compared to the resulting surface activities, obtained from high-sensitivity measurements of alpha emissivity using the XIA UltraLo-1800 spectrometer at Southern Methodist University. From these measurements, we determine an average 210Pb plate-out rate of 249 and 423 atoms/day/cm 2 for polyethylene and copper, respectively, when exposed to radon activity concentration of 135 Bq/m 3 at SNOLAB. Finally, a time-dependent model of alpha activity is discussed for these materials placedmore » in similar environmental conditions.« less

An experimental attenuation plate to improve the dose distribution in intraoperative electron beam radiotherapy for breast cancer.

PubMed

Oshima, T; Aoyama, Y; Shimozato, T; Sawaki, M; Imai, T; Ito, Y; Obata, Y; Tabushi, K

2009-06-07

Intraoperative electron beam radiotherapy (IOERT) is a technique in which a single-fraction high dose is intraoperatively delivered to subclinical tumour cells using an electron beam after breast-conserving surgery. In IOERT, an attenuation plate consisting of a pair of metal disks is commonly used to protect the normal tissues posterior to the breast. However, the dose in front of the plate is affected by backscatter, resulting in an unpredictable delivered dose to the tumour cells. In this study, an experimental attenuation plate, termed a shielding plate, was designed using Monte Carlo simulation, which significantly diminished the electron beam without introducing any backscatter radiation. The plate's performance was verified by measurements. It was made of two layers, a first layer (source side) of polymethyl methacrylate (PMMA) and a second layer of copper, which was selected from among other metals (aluminium, copper and lead) after testing for shielding capability and the range and magnitude of backscatter. The optimal thicknesses of the PMMA (0.71 cm) and copper (0.3 cm) layers were determined by changing their thicknesses during simulations. On the basis of these results, a shielding plate was prototyped and depth doses with and without the plate were measured by radiophotoluminescence glass dosimeters using a conventional stationary linear accelerator and a mobile linear accelerator dedicated for IOERT. The trial shielding plate functioned as intended, indicating its applicability in clinical practice.

Investigation of copper sorption by sugar beet processing lime waste.

PubMed

Ippolito, J A; Strawn, D G; Scheckel, K G

2013-01-01

In the western United States, sugar beet processing for sugar recovery generates a lime-based waste product (∼250,000 Mg yr) that has little liming value in the region's calcareous soils. This area has recently experienced an increase in dairy production, with dairies using copper (Cu)-based hoof baths to prevent hoof diseases. A concern exists regarding soil Cu accumulation because spent hoof baths may be disposed of in waste ponds, with pond waters being used for irrigation. The objective of this preliminary study was to evaluate the ability of lime waste to sorb Cu. Lime waste was mixed with increasing Cu-containing solutions (up to 100,000 mg Cu kg lime waste) at various buffered pH values (pH 6, 7, 8, and 9) and shaken over various time periods (up to 30 d). Copper sorption phenomenon was quantified using sorption maximum fitting, and the sorption mechanism was investigated using X-ray absorption spectroscopy. Results showed that sorption onto lime waste increased with decreasing pH and that the maximum Cu sorption of ∼45,000 mg kg occurred at pH 6. X-ray absorption spectroscopy indicated that Cu(OH) was the probable species present, although the precipitate existed as small multinuclear precipitates on the surface of the lime waste. Such structures may be precursors for larger surface precipitates that develop over longer incubation times. Findings suggest that sugar beet processing lime waste can viably sorb Cu from liquid waste streams, and thus it may have the ability to remove Cu from spent hoof baths. Copyright © by the American Society of Agronomy, Crop Science Society of America, and Soil Science Society of America, Inc.

Copper-mercury film electrode for cathodic stripping voltammetric determination of Se(IV).

PubMed

Sladkov, Vladimir; David, François; Fourest, Blandine

2003-01-01

The copper-mercury film electrode has been suggested for the determination of Se(IV) in a wide range of concentration from 1x10(-9) to 1x10(-6) mol L(-1)by square-wave cathodic stripping voltammetry. Insufficient reproducibility and sensitivity of the mercury film electrode have been overcome by using copper(II) ions during the plating procedure. Copper(II) has been found to be reduced and form a reproducible copper-mercury film on a glassy carbon electrode surface. The plating potential and time, the concentration of copper(II) and the concentration of the supporting electrolyte have been optimised. Microscopy has been used for a study of the morphology of the copper-mercury film. It has been found that it is the same as for the mercury one. The preconcentration step consists in electrodeposition of copper selenide on the copper-mercury film. The relative standard deviation is 4.3% for 1x10(-6) mol L(-1) of Se(IV). The limit of detection is 8x10(-10) mol L(-1) for 5 min of accumulation.

Quenching characteristics of bathocuproinedisulfonic acid, disodium salt in aqueous solution and copper sulfate plating solution

NASA Astrophysics Data System (ADS)

Koga, Toshiaki; Hirakawa, Chieko; Takeshita, Michinori; Terasaki, Nao

2018-04-01

Bathocuproinedisulfonic acid, disodium salt (BCS) is generally used to detect Cu(I) through a color reaction. We newly found BCS fluorescence in the visible blue region in an aqueous solution. However, the fluorescence mechanism of BCS is not well known, so we should investigate its fundamental information. We confirmed that the characteristics of fluorescence are highly dependent on the molecular concentration and solvent properties. In particular, owing to the presence of the copper compound, the fluorescence intensity extremely decreases. By fluorescence quenching, we observed that a copper compound concentration of 10-6 mol/L or less could easily be measured in an aqueous solution. We also observed BCS fluorescence in copper sulfate plating solution and the possibility of detecting monovalent copper by fluorescence reabsorption.

Preparation and characterization of copper telluride thin films by modified chemical bath deposition (M-CBD) method

NASA Astrophysics Data System (ADS)

Pathan, H. M.; Lokhande, C. D.; Amalnerkar, D. P.; Seth, T.

2003-09-01

Copper telluride thin films were deposited using modified chemical method using copper(II) sulphate; pentahydrate [CuSO 4·5H 2O] and sodium tellurite [Na 2TeO 3] as cationic and anionic sources, respectively. Modified chemical method is based on the immersion of the substrate into separately placed cationic and anionic precursors. The preparative conditions such as concentration, pH, immersion time, immersion cycles, etc. were optimized to get good quality copper telluride thin films at room temperature. The films have been characterized for structural, compositional, optical and electrical transport properties by means of X-ray diffraction (XRD), scanning electron microscopy (SEM), energy dispersive X-ray analysis (EDAX), Rutherford back scattering (RBS), optical absorption/transmission, electrical resistivity and thermoemf measurement techniques.

Steel test panel helps control additives in pyrophosphate copper plating

NASA Technical Reports Server (NTRS)

Hollar, W. T.

1967-01-01

Test panel helps control maximum tolerance level for plating solution contaminants. It provides low, medium, and high-current density areas such as exist in production plating, and plating is examined for uniformity of texture and ductility.

Comparison of Spall Pullback Signals and X-ray Tomography Analysis in Copper

NASA Astrophysics Data System (ADS)

Gard, Marcie; Russell, Rod; Hanna, Romy; Bless, Stephan; InstituteAdvanced Technology Collaboration; Department of Geological Sciences-UT Austin Collaboration

2011-06-01

Spall experiments were conducted on electrolytic tough pitch C110 copper plates. Flyer plates half the target-plate thickness were launched with a single-stage compressed-gas gun. Pullback signals were measured with a photonic Doppler velocimeter (PDV). Spall stresses were determined and found to be about 1 GPa. In addition, damage on the spall plane for samples that failed to separate a spall plate was characterized by x-ray tomography. The paper will include a description of threshold damage. The threshold for appearance of a pullback signal corresponded to the initiation of tensile damage, not formation of a spall separation plane.

Submerged Gas Jet Penetration: A Study of Bubbling Versus Jetting and Side Versus Bottom Blowing in Copper Bath Smelting

NASA Astrophysics Data System (ADS)

Kapusta, Joël P. T.

2017-06-01

Although the bottom blowing ShuiKouShan process has now been widely implemented in China, in both lead and copper smelters, some doubts, questions, and concerns still seem to prevail in the metallurgical community outside China. In the author's opinion, part of these doubts and concerns could be addressed by a better general understanding of key concepts of submerged gas injection, including gas jet trajectory and penetration, and the concept, application, and benefits of sonic injection in jetting regime. To provide some answers, this article first offers a discussion on the historical developments of the theory and mathematical characterization of submerged gas jet trajectory, including the proposed criteria for the transition from bubbling to jetting regime and the application of the Prandtl-Meyer theory to submerged gas jets. A second part is devoted to a quantitative study of submerged gas jet penetration in copper bath smelting, including a comparison between bubbling and jetting regimes, and side versus bottom blowing. In the specific cases studied, the calculated gas jet axis trajectory length in jetting regime is 159 cm for bottom blowing, whereas it varies between 129 and 168 cm for side blowing for inclination angles of +18° to -30° to the horizontal. This means that side blowing in the jetting regime would provide a deeper penetration and longer gas jet trajectory than generally obtained by conventional bath smelting vessels such as the Noranda and Teniente reactors. The theoretical results of this study do corroborate the successful high-intensity practice of the slag make converting process at Glencore Nickel in Canada that operates under high oxygen shrouded injection in the jetting regime, and this would then suggest that retrofitting conventional low-pressure, side-blowing tuyeres of bath smelting and converting reactors with sonic injectors in jetting regime certainly appears as a valuable option for process intensification with higher oxygen enrichment, without major process changes or large capital expenditure, i.e., no need for full reactor replacement.

CorA Is a Copper Repressible Surface-Associated Copper(I)-Binding Protein Produced in Methylomicrobium album BG8

PubMed Central

Johnson, Kenneth A.; Ve, Thomas; Larsen, Øivind; Pedersen, Rolf B.; Lillehaug, Johan R.; Jensen, Harald B.; Helland, Ronny; Karlsen, Odd A.

2014-01-01

CorA is a copper repressible protein previously identified in the methanotrophic bacterium Methylomicrobium album BG8. In this work, we demonstrate that CorA is located on the cell surface and binds one copper ion per protein molecule, which, based on X-ray Absorption Near Edge Structure analysis, is in the reduced state (Cu(I)). The structure of endogenously expressed CorA was solved using X-ray crystallography. The 1.6 Å three-dimensional structure confirmed the binding of copper and revealed that the copper atom was coordinated in a mononuclear binding site defined by two histidines, one water molecule, and the tryptophan metabolite, kynurenine. This arrangement of the copper-binding site is similar to that of its homologous protein MopE* from Metylococcus capsulatus Bath, confirming the importance of kynurenine for copper binding in these proteins. Our findings show that CorA has an overall fold similar to MopE, including the unique copper(I)-binding site and most of the secondary structure elements. We suggest that CorA plays a role in the M. album BG8 copper acquisition. PMID:24498370

A Kinetic Study of the Reaction of Ch3 02 with N02. Volume I,

DTIC Science & Technology

1980-01-01

Ravishankara F.L. Eisele IP.H. Wine ABSTRACT The technique of pulsed laser photolysis-long path laser aborption is employed to study the kinetics of the...Inrad Corp.) which was housed in a gold plated copper block. This copper block was in snug contact with a gold plated pedestal which was backed by a

Electrochemical Migration Behavior of Copper-Clad Laminate and Electroless Nickel/Immersion Gold Printed Circuit Boards under Thin Electrolyte Layers

PubMed Central

Yi, Pan; Xiao, Kui; Ding, Kangkang; Dong, Chaofang; Li, Xiaogang

2017-01-01

The electrochemical migration (ECM) behavior of copper-clad laminate (PCB-Cu) and electroless nickel/immersion gold printed circuit boards (PCB-ENIG) under thin electrolyte layers of different thicknesses containing 0.1 M Na2SO4 was studied. Results showed that, under the bias voltage of 12 V, the reverse migration of ions occurred. For PCB-Cu, both copper dendrites and sulfate precipitates were found on the surface of FR-4 (board material) between two plates. Moreover, the Cu dendrite was produced between the two plates and migrated toward cathode. Compared to PCB-Cu, PCB-ENIG exhibited a higher tendency of ECM failure and suffered from seriously short circuit failure under high relative humidity (RH) environment. SKP results demonstrated that surface potentials of the anode plates were greater than those of the cathode plates, and those potentials of the two plates exhibited a descending trend as the RH increased. At the end of the paper, an electrochemical migration corrosion failure model of PCB was proposed. PMID:28772497

Metallization of Large Silicon Wafers

NASA Technical Reports Server (NTRS)

Pryor, R. A.

1978-01-01

A metallization scheme was developed which allows selective plating of silicon solar cell surfaces. The system is comprised of three layers. Palladium, through the formation of palladium silicide at 300 C in nitrogen, makes ohmic contact to the silicon surface. Nickel, plated on top of the palladium silicide layer, forms a solderable interface. Lead-tin solder on the nickel provides conductivity and allows a convenient means for interconnection of cells. To apply this metallization, three chemical plating baths are employed.

Effect of surfactant concentration in the electrolyte on the tribological properties of nickel-tungsten carbide composite coatings produced by pulse electro co-deposition

NASA Astrophysics Data System (ADS)

Kartal, Muhammet; Uysal, Mehmet; Gul, Harun; Alp, Ahmet; Akbulut, Hatem

2015-11-01

A nickel plating bath containing WC particles was used to obtain hard and wear-resistant particle reinforced Ni/WC MMCs on steel surfaces for anti-wear applications. Copper substrates were used for electro co-deposition of Ni matrix/WC with the particle size of <1 μm tungsten carbide reinforcements. The influence of surfactant (sodium dodecyl sulfate, SDS) concentration on particle distribution, microhardness and wear resistance of composite coatings has been studied. The nickel films were characterized by scanning electron microscopy (SEM) and X-ray diffraction (XRD). The effects of the surfactant on the zeta potential, co-deposition and distribution of WC particles in the nickel matrix, as well as the tribological properties of composite coatings were also investigated. The tribological behaviors of the electrodeposited WC composite coatings sliding against M50 steel ball (Ø 10 mm) were examined on a CSM Instrument. All friction and wear tests were performed without lubrication at room temperature and in the ambient air (relative humidity 55-65%).

Higher-resolution selective metallization on alumina substrate by laser direct writing and electroless plating

NASA Astrophysics Data System (ADS)

Lv, Ming; Liu, Jianguo; Wang, Suhuan; Ai, Jun; Zeng, Xiaoyan

2016-03-01

How to fabricate conductive patterns on ceramic boards with higher resolution is a challenge in the past years. The fabrication of copper patterns on alumina substrate by laser direct writing and electroless copper plating is a low cost and high efficiency method. Nevertheless, the lower resolution limits its further industrial applications in many fields. In this report, the mechanisms of laser direct writing and electroless copper plating were studied. The results indicated that as the decomposed products of precursor PdCl2 have different chemical states respectively in laser-irradiated zone (LIZ) and laser-affected zone (LAZ). This phenomenon was utilized and a special chemical cleaning method with aqua regia solution was taken to selectively remove the metallic Pd in LAZ, while kept the PdO in LIZ as the only active seeds. As a result, the resolution of subsequent copper patterns was improved significantly. This technique has a great significance to develop the microelectronics devices.

Rolling contact fatigue behavior of Cu and TiN coatings on bearing steel substrates

NASA Technical Reports Server (NTRS)

Hochman, R. F.; Erdemir, A.; Dolan, F. J.; Thom, R. L.

1985-01-01

The resistance of copper and TiN coatings on various bearing substrates to high-load rolling contact fatigue (RCF) is investigated. Special attention is given to the lubricating characteristics of copper deposited by ion plating, and the wear resistant characteristics of TiN deposited by ion plating and magnetron sputtering techniques. RCF samples of 440C and AMS 5749 bearing steels were coated. Sputter deposited and ion plated films were on the RCF samples in a range of thickness from about 2000 A to 2 microns. Results showed a marked improvement of the RCF for pure copper tested on 440C, but a degradation for copper on AMS 5749. It is also found that the 2000 A TiN films behave favorably on the 440C and AMS 5749 bearing steels at RCF stress levels of 786 ksi. Scanning electron microscopy, X-ray diffraction, and electron spectroscopy for chemical analysis were used during the investigation.

46 CFR 114.600 - Incorporation by reference.

Code of Federal Regulations, 2012 CFR

2012-10-01

... Storage Tank Water Heaters 119.320 UL 486A-1992—Wire Connectors and Soldering Lugs For Use With Copper...-93, Standard Specification for Copper-Silicon Alloy Plate, Sheet, Strip, and Rolled Bar for General...) Apparatus 114.400 ASTM B 122/B 122M-95, Standard Specification for Copper-Nickel-Tin Alloy , Copper-Nickel...

Improving wettability of photo-resistive film surface with plasma surface modification for coplanar copper pillar plating of IC substrates

NASA Astrophysics Data System (ADS)

Xiang, Jing; Wang, Chong; Chen, Yuanming; Wang, Shouxu; Hong, Yan; Zhang, Huaiwu; Gong, Lijun; He, Wei

2017-07-01

The wettability of the photo-resistive film (PF) surfaces undergoing different pretreatments including the O2sbnd CF4 low-pressure plasma (OCLP) and air plasma (AP), is investigated by water contact angle measurement instrument (WCAMI) before the bottom-up copper pillar plating. Chemical groups analysis performed by attenuated total reflectance Fourier transform infrared spectroscopy (ATR-FTIR) and X-ray photoelectron spectra (XPS) shows that after the OCLP and wash treatment, the wettability of PF surface is attenuated, because embedded fluorine and decreased oxygen content both enhance hydrophobicity. Compared with OCLP treatment, the PF surface treatment by non-toxic air plasma displays features of Csbnd O, Osbnd Cdbnd O, Cdbnd O and sbnd NO2 by AIR-FTIR and XPS, and a promoted wettability by WCAM. Under the identical electroplating condition, the surface with a better wettability allows electrolyte to spontaneously soak all the places of vias, resulting in improved copper pillar uniformity. Statistical analysis of metallographic data shows that more coplanar and flat copper pillars are achieved with the PF treatment of air plasma. Such modified copper-pillar-plating technology meets the requirement of accurate impedance, the high density interconnection for IC substrates.

Tectonic environments of South American porphyry copper magmatism through time revealed by spatiotemporal data mining

NASA Astrophysics Data System (ADS)

Butterworth, N.; Steinberg, D.; Müller, R. D.; Williams, S.; Merdith, A. S.; Hardy, S.

2016-12-01

Porphyry ore deposits are known to be associated with arc magmatism on the overriding plate at subduction zones. While general mechanisms for driving magmatism are well established, specific subduction-related parameters linking episodes of ore deposit formation to specific tectonic environments have only been qualitatively inferred and have not been formally tested. We develop a four-dimensional approach to reconstruct age-dated ore deposits, with the aim of isolating the tectonomagmatic parameters leading to the formation of copper deposits during subduction. We use a plate tectonic model with continuously closing plate boundaries, combined with reconstructions of the spatiotemporal distribution of the ocean floor, including subducted portions of the Nazca/Farallon plates. The models compute convergence rates and directions, as well as the age of the downgoing plate through time. To identify and quantify tectonic parameters that are robust predictors of Andean porphyry copper magmatism and ore deposit formation, we test two alternative supervised machine learning methods; the "random forest" (RF) ensemble and "support vector machines" (SVM). We find that a combination of rapid convergence rates ( 100 km/Myr), subduction obliquity of 15°, a subducting plate age between 25-70 Myr old, and a location far from the subducting trench boundary (>2000 km) represents favorable conditions for porphyry magmatism and related ore deposits to occur. These parameters are linked to the availability of oceanic sediments, the changing small-scale convection around the subduction zone, and the availability of the partial melt in the mantle wedge. When coupled, these parameters could influence the genesis and exhumation of porphyry copper deposits.

Nanocrystalline Cobalt-Phosphorous Electroplating as an Alternative to Hard Chromium Electroplating

DTIC Science & Technology

2012-08-01

Validate pulsed electrodeposition of Nanocrystalline Cobalt-Phosphorous (nCoP) alloy coatings as a Hard Chrome electroplating alternative for DoD...limits Cr+6  Cathode Efficiency Cr Plating *Co PEL is 20 µg/m3  ≈5X faster than Chrome plating  Increased throughput  One nCo-P tank can...replace several hard chrome tanks  Bath is Stable nCoP Plating Approaches 100% Efficiency  Process Comparison CoP Technical Approach

46 CFR 105.20-3 - Cargo tanks.

Code of Federal Regulations, 2010 CFR

2010-10-01

...) Construction and Materials. (1) The cargo tanks must be constructed of iron, steel, copper, nickel alloy, copper alloy; or aluminum. The tanks shall be designed to withstand the maximum head to which they may be... inches and gage number 2,3 Nickel copper B127, hot rolled sheet or plate 0.107 (USSG 12). Copper nickel 1...

Dynamic Shock Compression of Copper to Multi-Megabar Pressure

NASA Astrophysics Data System (ADS)

Haill, T. A.; Furnish, M. D.; Twyeffort, L. L.; Arrington, C. L.; Lemke, R. W.; Knudson, M. D.; Davis, J.-P.

2015-11-01

Copper is an important material for a variety of shock and high energy density applications and experiments. Copper is used as a standard reference material to determine the EOS properties of other materials. The high conductivity of copper makes it useful as an MHD driver layer in high current dynamic materials experiments on Sandia National Laboratories Z machine. Composite aluminum/copper flyer plates increase the dwell time in plate impact experiments by taking advantage of the slower wave speeds in copper. This presentation reports on recent efforts to reinstate a composite Al/Cu flyer capability on Z and to extend the range of equation-of-state shock compression data through the use of hyper-velocity composite flyers and symmetric planar impact with copper targets. We will present results from multi-dimensional ALEGRA MHD simulations, as well as experimental designs and methods of composite flyer fabrication. Sandia National Laboratories is a multi-program laboratory managed and operated by Sandia Corporation, a wholly owned subsidiary of Lockheed Martin Company, for the U.S. DOE's National Nuclear Security Administration under contract DE-AC04-94AL85000.

Thermal performance evaluation of the Semco (liquid) solar collector

NASA Technical Reports Server (NTRS)

1979-01-01

Procedures used and results obtained during the evaluation test program on a flat plate collector which uses water as the working fluid are discussed. The absorber plate is copper tube soldered to copper fin coated with flat black paint. The glazing consists of two plates of Lo-Iron glass; the insulation is polyurethane foam. The collector weight is 242.5 pounds with overall external dimensions of approximately 48.8 in. x 120.8 in. x 4.1 in. The test program was conducted to obtain thermal performance data before and after 34 days of weather exposure test.

Heat Sinking, Cross Talk, and Temperature Stability for Large, Close-Packed Arrays of Microcalorimeters

NASA Technical Reports Server (NTRS)

Imoto, Naoko; Bandler, SImon; Brekosky, Regis; Chervenak, James; Figueroa-Felicano, Enectali; Finkbeiner, Frederick; Kelley, Richard; Kilbourne, Caroline; Porter, Frederick; Sadleir, Jack;

Double coating protection of Nd-Fe-B magnets: Intergranular phosphating treatment and copper plating

NASA Astrophysics Data System (ADS)

Zheng, Jingwu; Chen, Haibo; Qiao, Liang; Lin, Min; Jiang, Liqiang; Che, Shenglei; Hu, Yangwu

2014-12-01

In this work, a double coating protection technique of phosphating treatment and copper plating was made to improve the corrosion resistance of sintered Nd-Fe-B magnets. In other words, the intergranular region of sintered Nd-Fe-B is allowed to generate passive phosphate conversion coating through phosphating treatment, followed by the copper coating on the surface of sintered Nd-Fe-B. The morphology and corrosion resistance of the phosphated sintered Nd-Fe-B were observed using SEM and electrochemical method respectively. The phosphate conversion coating was formed more preferably on the intergranular region of sintered Nd-Fe-B than on the main crystal region; just after a short time of phosphating treatment, the intergranular region of sintered Nd-Fe-B has been covered by the phosphate conversion coating and the corrosion resistance is significantly improved. With the synergistic protection of the intergranular phosphorization and the followed copper electrodeposition, the corrosion resistance of the sintered Nd-Fe-B is significantly better than that with a single phosphate film or single plating protection.

Solution-processed copper-nickel nanowire anodes for organic solar cells

NASA Astrophysics Data System (ADS)

Stewart, Ian E.; Rathmell, Aaron R.; Yan, Liang; Ye, Shengrong; Flowers, Patrick F.; You, Wei; Wiley, Benjamin J.

2014-05-01

This work describes a process to make anodes for organic solar cells from copper-nickel nanowires with solution-phase processing. Copper nanowire films were coated from solution onto glass and made conductive by dipping them in acetic acid. Acetic acid removes the passivating oxide from the surface of copper nanowires, thereby reducing the contact resistance between nanowires to nearly the same extent as hydrogen annealing. Films of copper nanowires were made as oxidation resistant as silver nanowires under dry and humid conditions by dipping them in an electroless nickel plating solution. Organic solar cells utilizing these completely solution-processed copper-nickel nanowire films exhibited efficiencies of 4.9%.This work describes a process to make anodes for organic solar cells from copper-nickel nanowires with solution-phase processing. Copper nanowire films were coated from solution onto glass and made conductive by dipping them in acetic acid. Acetic acid removes the passivating oxide from the surface of copper nanowires, thereby reducing the contact resistance between nanowires to nearly the same extent as hydrogen annealing. Films of copper nanowires were made as oxidation resistant as silver nanowires under dry and humid conditions by dipping them in an electroless nickel plating solution. Organic solar cells utilizing these completely solution-processed copper-nickel nanowire films exhibited efficiencies of 4.9%. Electronic supplementary information (ESI) available. See DOI: 10.1039/c4nr01024h

Development of Low Cost Contacts to Silicon Solar Cells

NASA Technical Reports Server (NTRS)

Iles, P. A.; Tanner, D. P.

1979-01-01

Different electroless plating systems were evaluated in conjunction with copper electroplating. All tests involved simultaneous deposition of front and back contacts using a standard cell materials. Cells with good adhesion and good curve fill factors were obtained using a palladium-chromium-copper metallization system. The final copper contact system was evaluated to determine if the copper would migrate at elevated temperatures. The copper migrated at elevated temperatures causing cell output degradation.

Textured carbon surfaces on copper by sputtering

NASA Technical Reports Server (NTRS)

Curren, A. N. (Inventor); Jensen, K. A. (Inventor); Roman, R. F. (Inventor)

1986-01-01

A very thin layer of highly textured carbon is applied to a copper surface by a triode sputtering process. A carbon target and a copper substrate are simultaneously exposed to an argon plasma in a vacuum chamber. The resulting carbon surface is characterized by a dense, random array of needle like spires or peaks which extend perpendicularly from the copper surface. The coated copper is especially useful for electrode plates in multistage depressed collectors.

Quick-Change Anode for Plating

NASA Technical Reports Server (NTRS)

Beasley, J. L.

1987-01-01

Proposed fastener for attaching electroplating anode improves quality of plating and increases productivity. Notches in twist-lock fastener mates with projections on end of anode bar. Fastener made of titanium for compatibility with copper-plating solution. Also constructed in snap-on, snap-off configuration.

Continuous process electrorefiner

DOEpatents

Herceg, Joseph E [Naperville, IL; Saiveau, James G [Hickory Hills, IL; Krajtl, Lubomir [Woodridge, IL

2006-08-29

A new device is provided for the electrorefining of uranium in spent metallic nuclear fuels by the separation of unreacted zirconium, noble metal fission products, transuranic elements, and uranium from spent fuel rods. The process comprises an electrorefiner cell. The cell includes a drum-shaped cathode horizontally immersed about half-way into an electrolyte salt bath. A conveyor belt comprising segmented perforated metal plates transports spent fuel into the salt bath. The anode comprises the conveyor belt, the containment vessel, and the spent fuel. Uranium and transuranic elements such as plutonium (Pu) are oxidized at the anode, and, subsequently, the uranium is reduced to uranium metal at the cathode. A mechanical cutter above the surface of the salt bath removes the deposited uranium metal from the cathode.

Perforated plates for cryogenic regenerators and method of fabrication

DOEpatents

Hendricks, J.B.

1994-03-29

Perforated plates having very small holes with a uniform diameter throughout the plate thickness are prepared by a [open quotes]wire drawing[close quotes] process in which a billet of sacrificial metal is disposed in an extrusion can of the plate metal, and the can is extruded and restacked repeatedly, converting the billet to a wire of the desired hole diameter. At final size, the rod is then sliced into wafers, and the wires are removed by selective etching. This process is useful for plate metals of interest for high performance regenerator applications, in particular, copper, niobium, molybdenum, erbium, and other rare earth metals. Er[sub 3]Ni, which has uniquely favorable thermophysical properties for such applications, may be incorporated in regions of the plates by providing extrusion cans containing erbium and nickel metals in a stacked array with extrusion cans of the plate metal, which may be copper. The array is heated to convert the erbium and nickel metals to Er[sub 3]Ni. Perforated plates having two sizes of perforations, one of which is small enough for storage of helium, are also disclosed. 10 figures.

Perforated plates for cryogenic regenerators and method of fabrication

DOEpatents

Hendricks, John B.

1994-01-01

Perforated plates (10) having very small holes (14) with a uniform diameter throughout the plate thickness are prepared by a "wire drawing" process in which a billet of sacrificial metal is disposed in an extrusion can of the plate metal, and the can is extruded and restacked repeatedly, converting the billet to a wire of the desired hole diameter. At final size, the rod is then sliced into wafers, and the wires are removed by selective etching. This process is useful for plate metals of interest for high performance regenerator applications, in particular, copper, niobium, molybdenum, erbium, and other rare earth metals. Er.sub.3 Ni, which has uniquely favorable thermophysical properties for such applications, may be incorporated in regions of the plates by providing extrusion cans (20) containing erbium and nickel metals in a stacked array (53) with extrusion cans of the plate metal, which may be copper. The array is heated to convert the erbium and nickel metals to Er.sub.3 Ni. Perforated plates having two sizes of perforations (38, 42), one of which is small enough for storage of helium, are also disclosed.

Electroplating and stripping copper on molybdenum and niobium

NASA Technical Reports Server (NTRS)

Power, J. L.

1978-01-01

Molybdenum and niobium are often electroplated and subsequently stripped of copper. Since general standard plating techniques produce poor quality coatings, general procedures have been optimized and specified to give good results.

Copper-zinc electrodeposition in alkaline-sorbitol medium: Electrochemical studies and structural, morphological and chemical composition characterization

NASA Astrophysics Data System (ADS)

de Almeida, M. R. H.; Barbano, E. P.; de Carvalho, M. F.; Tulio, P. C.; Carlos, I. A.

2015-04-01

The galvanostatic technique was used to analyze the electrodeposition of Cu-Zn on to AISI 1010 steel electrode from an alkaline-sorbitol bath with various proportions of the metal ions in the bath: Cu70/Zn30, Cu50/Zn50 and Cu30/Zn70. Coloration of Cu-Zn films were whitish golden, light golden, golden/gray depending on the Cu2+/Zn2+ ratios in the electrodeposition bath, deposition current density (jdep) and charge density (qdep). The highest current efficiency was ∼54.0%, at jdep -1.0 mA cm-2 and qdep 0.40 C cm-2 in the Cu70/Zn30 bath. Energy dispersive spectroscopy indicated that electrodeposits produced from the bath Cu70/Zn30 showed higher Cu content at lower jdep. Also, for same jdep the Cu content increased with qdep. Scanning electron microscopy showed that Cu-Zn electrodeposits of high quality were obtained from the Cu70/Zn30 bath, since the films were fine-grained, except the obtained at jdep -20.0 mA cm-2 and qdep 10.0 C cm-2. Also, these electrodeposits did not present cracks. X-ray analysis of the Cu-Zn electrodeposits obtained at jdep -8.0, -20.0 and -40.0 mA cm-2, in each case, with qdep 2.0 and 10.0 C cm-2, in the Cu70/Zn30 bath, suggested the occurrence of a mixture of the following phases, CuZn, CuZn5 and Cu5Zn8. Galvanostatic electrodeposits of Cu-Zn obtained from sorbitol-alkaline baths exhibited whitish golden color, with good prospects for industrial applications, especially for decorative purposes.

Absolute measurement of the Hugoniot and sound velocity of liquid copper at multimegabar pressures

DOE PAGES

McCoy, Chad August; Knudson, Marcus David; Root, Seth

2017-11-13

Measurement of the Hugoniot and sound velocity provides information on the bulk modulus and Grüneisen parameter of a material at extreme conditions. The capability to launch multilayered (copper/aluminum) flyer plates at velocities in excess of 20 km/s with the Sandia Z accelerator has enabled high-precision sound-velocity measurements at previously inaccessible pressures. For these experiments, the sound velocity of the copper flyer must be accurately known in the multi-Mbar regime. Here we describe the development of copper as an absolutely calibrated sound-velocity standard for high-precision measurements at pressures in excess of 400 GPa. Using multilayered flyer plates, we performed absolute measurementsmore » of the Hugoniot and sound velocity of copper for pressures from 500 to 1200 GPa. These measurements enabled the determination of the Grüneisen parameter for dense liquid copper, clearly showing a density dependence above the melt transition. As a result, combined with earlier data at lower pressures, these results constrain the sound velocity as a function of pressure, enabling the use of copper as a Hugoniot and sound-velocity standard for pressures up to 1200 GPa.« less

Absolute measurement of the Hugoniot and sound velocity of liquid copper at multimegabar pressures

DOE Office of Scientific and Technical Information (OSTI.GOV)

McCoy, Chad August; Knudson, Marcus David; Root, Seth

Measurement of the Hugoniot and sound velocity provides information on the bulk modulus and Grüneisen parameter of a material at extreme conditions. The capability to launch multilayered (copper/aluminum) flyer plates at velocities in excess of 20 km/s with the Sandia Z accelerator has enabled high-precision sound-velocity measurements at previously inaccessible pressures. For these experiments, the sound velocity of the copper flyer must be accurately known in the multi-Mbar regime. Here we describe the development of copper as an absolutely calibrated sound-velocity standard for high-precision measurements at pressures in excess of 400 GPa. Using multilayered flyer plates, we performed absolute measurementsmore » of the Hugoniot and sound velocity of copper for pressures from 500 to 1200 GPa. These measurements enabled the determination of the Grüneisen parameter for dense liquid copper, clearly showing a density dependence above the melt transition. As a result, combined with earlier data at lower pressures, these results constrain the sound velocity as a function of pressure, enabling the use of copper as a Hugoniot and sound-velocity standard for pressures up to 1200 GPa.« less

Copper circuit patterning on polymer using selective surface modification and electroless plating

NASA Astrophysics Data System (ADS)

Park, Sang Jin; Ko, Tae-Jun; Yoon, Juil; Moon, Myoung-Woon; Oh, Kyu Hwan; Han, Jun Hyun

2017-02-01

We have examined a potential new and simple method for patterning a copper circuit on PET substrate by copper electroless plating, without the pretreatment steps (i.e., sensitization and activation) for electroless plating as well as the etching processes of conventional circuit patterning. A patterned mask coated with a catalyst material, Ag, for the reduction of Cu ions, is placed on a PET substrate. Subsequent oxygen plasma treatment of the PET substrate covered with the mask promotes the selective generation of anisotropic pillar- or hair-like nanostructures coated with co-deposited nanoparticles of the catalyst material on PET. After oxygen plasma treatment, a Cu circuit is well formed just by dipping the plasma-treated PET into a Cu electroless plating solution. By increasing the oxygen gas pressure in the chamber, the height of the nanostructures increases and the Ag catalyst particles are coated on not only the top but also the side surfaces of the nanostructures. Strong mechanical interlocking between the Cu circuit and PET substrate is produced by the large surface area of the nanostructures, and enhances peel strength. Results indicate this new simple two step (plasma surface modification and pretreatment-free electroless plating) method can be used to produce a flexible Cu circuit with good adhesion.

Micro-Welding of Copper Plate by Frequency Doubled Diode Pumped Pulsed Nd:YAG Laser

NASA Astrophysics Data System (ADS)

Nakashiba, Shin-Ichi; Okamoto, Yasuhiro; Sakagawa, Tomokazu; Takai, Sunao; Okada, Akira

A pulsed laser of 532 nm wavelength with ms range pulse duration was newly developed by second harmonic generation of diode pumped pulsed Nd:YAG laser. High electro-optical conversion efficiency more than 13% could be achieved, and 1.5 kW peak power green laser pulse was put in optical fiber of 100 μm in diameter. In micro- welding of 1.0 mm thickness copper plate, a keyhole welding was successfully performed by 1.0 kW peak power at spot diameter less than 200 μm. The frequency doubled pulsed laser improved the processing efficiency of copper welding, and narrow and deep weld bead was stably obtained.

Multiple-layer printed-wiring trace connector

NASA Technical Reports Server (NTRS)

Pizzeck, D. E.

1977-01-01

Nickel-plated spring-steel foil connector is hollow pin, with lengthwise slit, that is inserted into improperly plated-through holes. Edges of connector make positive contact with copper pads within hole.

Energy Consumption in Copper Smelting: A New Asian Horse in the Race

NASA Astrophysics Data System (ADS)

Coursol, P.; Mackey, P. J.; Kapusta, J. P. T.; Valencia, N. Cardona

2015-05-01

After a marked improvement in energy consumption in copper smelting during the past few decades, technology development has been slowing down in the Americas and in Europe. Innovation, however, is still required to further reduce energy consumption while complying with stringent environmental regulations. The bottom blowing smelting technology being developed in China shows success and promise. The general configuration of the bath smelting vessel, the design of high-pressure injectors, and the concentrate addition system are described and discussed in this article with respect to those used in other technologies. The bottom blowing technology is shown to be operating at a temperature in the range of 1160-1180°C, which is the lowest reported temperature range for a modern copper smelting process. In this article, it is suggested that top feeding of filter cake concentrate, which is also used in other technologies, has a positive effect in reducing the oxidation potential of the slag ( p(O2)) while increasing the FeS solubility in slag. This reduction in p(O2) lowers the magnetite liquidus of the slag, while the increased solubility of FeS in slag helps toward reaching very low copper levels in flotation slag tailings. The application of high-pressure injectors allows for the use of high levels of oxygen enrichment with no requirements for punching. Using a standard modeling approach from the authors' previous studies, this article discusses these aspects and compares the energy consumption of the bottom blowing technology with that of other leading flash and bath smelting technologies, namely: flash smelting, Noranda/Teniente Converter, TSL (Isasmelt [Glencore Technology Pty. Ltd., Brisbane, Queensland, Australia]/Outotec), and the Mitsubishi Process (Mitsubishi Materials Corporation, Tokyo, Japan).

40 CFR 471.43 - New source performance standards (NSPS).

Code of Federal Regulations, 2013 CFR

2013-07-01

... to 10.0 at all times. (p) Alkaline cleaning spent baths. Subpart D—NSPS Pollutant or pollutant... precious metals alkaline cleaned Cadmium 0.021 0.009 Copper 0.114 0.060 Cyanide 0.018 0.007 Silver 0.025 0.... (q) Alkaline cleaning rinse. Subpart D—NSPS Pollutant or pollutant property Maximum for any 1 day...

40 CFR 471.53 - New source performance standards (NSPS).

Code of Federal Regulations, 2013 CFR

2013-07-01

....5 to 10.0 at all times. (n) Alkaline cleaning spent baths. Subpart E—NSPS Pollutant or pollutant... refractory metals alkaline cleaned Copper 0.428 0.204 Nickel .184 0.124 Fluoride 19.9 8.82 Molybdenum 1.68 0.... (o) Alkaline cleaning rinse. Subpart E—NSPS Pollutant or pollutant property Maximum for any 1 day...

40 CFR 471.43 - New source performance standards (NSPS).

Code of Federal Regulations, 2014 CFR

2014-07-01

... to 10.0 at all times. (p) Alkaline cleaning spent baths. Subpart D—NSPS Pollutant or pollutant... precious metals alkaline cleaned Cadmium 0.021 0.009 Copper 0.114 0.060 Cyanide 0.018 0.007 Silver 0.025 0.... (q) Alkaline cleaning rinse. Subpart D—NSPS Pollutant or pollutant property Maximum for any 1 day...

40 CFR 471.43 - New source performance standards (NSPS).

Code of Federal Regulations, 2012 CFR

2012-07-01

... to 10.0 at all times. (p) Alkaline cleaning spent baths. Subpart D—NSPS Pollutant or pollutant... precious metals alkaline cleaned Cadmium 0.021 0.009 Copper 0.114 0.060 Cyanide 0.018 0.007 Silver 0.025 0.... (q) Alkaline cleaning rinse. Subpart D—NSPS Pollutant or pollutant property Maximum for any 1 day...

Differential bacteriophage mortality on exposure to copper.

PubMed

Li, Jinyu; Dennehy, John J

2011-10-01

Many studies report that copper can be used to control microbial growth, including that of viruses. We determined the rates of copper-mediated inactivation for a wide range of bacteriophages. We used two methods to test the effect of copper on bacteriophage survival. One method involved placing small volumes of bacteriophage lysate on copper and stainless steel coupons. Following exposure, metal coupons were rinsed with lysogeny broth, and the resulting fluid was serially diluted and plated on agar with the corresponding bacterial host. The second method involved adding copper sulfate (CuSO(4)) to bacteriophage lysates to a final concentration of 5 mM. Aliquots were removed from the mixture, serially diluted, and plated with the appropriate bacterial host. Significant mortality was observed among the double-stranded RNA (dsRNA) bacteriophages Φ6 and Φ8, the single-stranded RNA (ssRNA) bacteriophage PP7, the ssDNA bacteriophage ΦX174, and the dsDNA bacteriophage PM2. However, the dsDNA bacteriophages PRD1, T4, and λ were relatively unaffected by copper. Interestingly, lipid-containing bacteriophages were most susceptible to copper toxicity. In addition, in the first experimental method, the pattern of bacteriophage Φ6 survival over time showed a plateau in mortality after lysates dried out. This finding suggests that copper's effect on bacteriophage is mediated by the presence of water.

Critical Evaluation of State-of-the-Art In Situ Thermal Treatment Technologies for DNAPL Source Zone Treatment. State-of-the-Practice Overview

DTIC Science & Technology

2009-05-01

recovery in their design. Electrodes have been constructed from steel pipe , copper plate for heating distinct zones, and sheet pile. Sheet pile...energy transfer/ heating in the subsurface) The components required to implement ERH include: • Electrodes (steel pipe , copper plate, well points...including piping , blower, and condenser • A vapor treatment system Electrical Resistance Heating (Smith) A-3 • An ERH power control unit to

Trapped Field Characteristics of Stacked YBCO Thin Plates for Compact NMR Magnets: Spatial Field Distribution and Temporal Stability

PubMed Central

Hahn, Seungyong; Kim, Seok Beom; Ahn, Min Cheol; Voccio, John; Bascuñán, Juan; Iwasa, Yukikazu

2010-01-01

This paper presents experimental and analytical results of trapped field characteristics of a stack of square YBCO thin film plates for compact NMR magnets. Each YBCO plate, 40 mm × 40 mm × 0.08 mm, has a 25-mm diameter hole at its center. A total of 500 stacked plates were used to build a 40-mm long magnet. Its trapped field, in a bath of liquid nitrogen, was measured for spatial field distribution and temporal stability. Comparison of measured and analytical results is presented: the effects on trapped field characteristics of the unsaturated nickel substrate and the non-uniform current distribution in the YBCO plate are discussed. PMID:20585463

Dichromated-gelatin hologram process for improved optical quality

NASA Technical Reports Server (NTRS)

Stewart, W. C.

1975-01-01

Optical distortions are eliminated by use of wetting agency followed by sequential immersion in several alcohol-water baths of increasing alcohol concentration. Dehydration proceeds uniformly over surface of gelatin. Dried plate is free of optically-distorting thickness variations.

Copper Hugoniot measurements to 2.8 TPa on Z.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Furnish, Michael D.; Haill, Thomas A

We conducted three Hugoniot and release experiments on copper on the Z machine at Hugoniot stress levels of 0.34 and 2.6 TPa, using two-layer copper/aluminum impactors travelling at 8 and 27 km/s and Z-quartz windows. Velocity histories were recorded for 4 samples of different thicknesses and 5 locations on the flyer plate (3 and 4 for the first two experiments). On-sample measurements provided Hugoniot points (via transit time) and partial release states (via Z-quartz wavespeed). Fabrication of the impactor required thick plating and several diamond-machining steps. The lower-pressure test was planned as a 2.5 TPa test, but a failure onmore » the Z machine degraded its performance; however, these results corroborated earlier Cu data in the same stress region. The second test suffered from significant flyer plate bowing, but the third did not. The Hugoniot data are compared with the APtshuler/Nellis nuclear-driven data, other data from Z and elsewhere, and representative Sesame models.« less

Lightweight porous plastic plaque. [nickel cadmium batteries

NASA Technical Reports Server (NTRS)

Reid, M.

1978-01-01

The porosity and platability of various materials were investigated to determine a suitable substrate for nickel-plated electrodes. Immersion, ultrasonics, and flow-through plating techniques were tried using nonproprietary formulations, and proprietary phosphide and boride baths. Modifications to the selected material include variations in formulation and treatment, carbon loading to increase conductivity, and the incorporation of a grid. Problems to be solved relate to determining conductivities and porosities as a function of amount of nickel plated on the plastics; loading; charge and discharge curves of electrodes at different current densities; cell performance; and long-term degradation of electrodes.

Deposition Time Dependent Properties of Copper Tin Telluride (Cu₂SnTe₃) Nanoparticles for Solar Absorber Applications.

PubMed

Rakspun, Jariya; Tubtimtae, Auttasit; Vailikhit, Veeramol; Teesetsopon, Pichanan; Choopun, Supab

2018-06-01

We report the growth of copper tin telluride nanoparticles as an absorber layer using a chemical bath deposition (CBD) process for solar selective applications. The XRD results showed the phase of Cu2SnTe3 with a cubical structure. The larger-sized nanoparticles resulted with increased absorption properties and the optical band gap ranging from 1.93, 1.90, 1.58 and 1.56 eV for deposition times of 20-120 min, respectively. Then, the electrical properties of Cu2SnTe3 nanoparticles were also provided a higher current (~6-8 mA) with bias potential of zero.

The effect of papaine on the time course of the end-plate current.

PubMed

Humar, M; Kordas, M; Melik, Z

1980-07-01

Papaine is known to detach cholinesterases from the synaptic cleft. It could be expected that this would result in an increase of the amplitude and half-time of the end-plate current. Thus, the effect of papaine on the end-plate current. Thus, the effect of papaine on the end-plate current should be similar to the effect of anticholinesterase methanesulfonylfluoride. The end-plate current was recorded in frog skeletal muscle at various levels of membrane potential, before and after papaine was added to the bath. The effect of papaine was an increase of the half-time of the end-plate current, similarly as after treatment of the muscle by methanesulfonylfluoride. It seems that both papaine and methanesulfonylfluoride have a similar mechanism of action. In either experimental condition hydrolysis of transmitter is decreased or abolished, which results in an increase of the half-time of the end-plate current.

An investigation of preload relaxation behaviour of three zinc- aluminum alloys

NASA Astrophysics Data System (ADS)

Mir, A. A.

2016-08-01

Zinc alloy castings are usually assembled together or mounted by screwed steel fasteners, and are tightened to a predetermined torque to develop the required tensile preload in the fastener. Due to relaxation processes in the castings, creep may cause a partial preload loss at an elevated temperature. The equipment used for load relaxation tests consists of a loadmonitoring device, an oil bath, and a data-acquisition system. A load cell monitoring device is used to monitor the load loss in an ISO-metric M6*1 steel screw set into sand castings made from alloys No. 3, No. 5 and No. 2 and tightened to produce an initial preload of 6 kN. The castings were held at constant temperature in the range 80 - 120°C in an oil bath. The oil bath maintains the desired test temperature throughout the experiment. All tests were conducted for periods of up to 160 h. For all alloys, the initial load loss was high, decreasing gradually with time, but not ceasing. The load loss increased rapidly with test temperature, and almost all of the relaxation curves approximated to a logarithmic decay of load with time. Alloy No. 2 had the best resistance to load loss, with No. 5 next and No. 3 worst at all temperatures. The lower resistance to relaxation of alloy No. 3 was mainly due to the lower relaxation strength of copper-free primary dendrites, whereas in alloys No. 5 and No. 2, the higher copper contents contribute greatly to their relaxation strength in the form of second-phase particles.

40 CFR 471.45 - Pretreatment standards for new sources (PSNS).

Code of Federal Regulations, 2012 CFR

2012-07-01

... Cyanide 0.179 0.074 Silver 0.253 0.105 (p) Alkaline cleaning spent baths. Subpart D—PSNS Pollutant or...-pounds) of precious metals alkaline cleaned Cadmium 0.021 0.009 Copper 0.114 0.060 Cyanide 0.018 0.007 Silver 0.025 0.010 (q) Alkaline cleaning rinse. Subpart D—PSNS Pollutant or pollutant property Maximum...

40 CFR 471.54 - Pretreatment standards for existing sources (PSES).

Code of Federal Regulations, 2010 CFR

2010-07-01

... 12.1 Nickel 23.3 15.4 Fluoride 720 320 Molybdenum 80.0 41.4 (n) Alkaline cleaning spent baths... (pounds per million off-pounds) of refractory metals alkaline cleaned Copper 0.635 0.334 Nickel 0.642 0.424 Fluoride 19.9 8.82 Molybdenum 2.21 1.14 (o) Alkaline cleaning rinse. Subpart E—PSES Pollutant or...

40 CFR 471.54 - Pretreatment standards for existing sources (PSES).

Code of Federal Regulations, 2011 CFR

2011-07-01

... 12.1 Nickel 23.3 15.4 Fluoride 720 320 Molybdenum 80.0 41.4 (n) Alkaline cleaning spent baths... (pounds per million off-pounds) of refractory metals alkaline cleaned Copper 0.635 0.334 Nickel 0.642 0.424 Fluoride 19.9 8.82 Molybdenum 2.21 1.14 (o) Alkaline cleaning rinse. Subpart E—PSES Pollutant or...

40 CFR 471.45 - Pretreatment standards for new sources (PSNS).

Code of Federal Regulations, 2014 CFR

2014-07-01

... Cyanide 0.179 0.074 Silver 0.253 0.105 (p) Alkaline cleaning spent baths. Subpart D—PSNS Pollutant or...-pounds) of precious metals alkaline cleaned Cadmium 0.021 0.009 Copper 0.114 0.060 Cyanide 0.018 0.007 Silver 0.025 0.010 (q) Alkaline cleaning rinse. Subpart D—PSNS Pollutant or pollutant property Maximum...

40 CFR 471.54 - Pretreatment standards for existing sources (PSES).

Code of Federal Regulations, 2012 CFR

2012-07-01

... 12.1 Nickel 23.3 15.4 Fluoride 720 320 Molybdenum 80.0 41.4 (n) Alkaline cleaning spent baths... (pounds per million off-pounds) of refractory metals alkaline cleaned Copper 0.635 0.334 Nickel 0.642 0.424 Fluoride 19.9 8.82 Molybdenum 2.21 1.14 (o) Alkaline cleaning rinse. Subpart E—PSES Pollutant or...

40 CFR 471.45 - Pretreatment standards for new sources (PSNS).

Code of Federal Regulations, 2011 CFR

2011-07-01

... Cyanide 0.179 0.074 Silver 0.253 0.105 (p) Alkaline cleaning spent baths. Subpart D—PSNS Pollutant or...-pounds) of precious metals alkaline cleaned Cadmium 0.021 0.009 Copper 0.114 0.060 Cyanide 0.018 0.007 Silver 0.025 0.010 (q) Alkaline cleaning rinse. Subpart D—PSNS Pollutant or pollutant property Maximum...

40 CFR 471.54 - Pretreatment standards for existing sources (PSES).

Code of Federal Regulations, 2013 CFR

2013-07-01

... 12.1 Nickel 23.3 15.4 Fluoride 720 320 Molybdenum 80.0 41.4 (n) Alkaline cleaning spent baths... (pounds per million off-pounds) of refractory metals alkaline cleaned Copper 0.635 0.334 Nickel 0.642 0.424 Fluoride 19.9 8.82 Molybdenum 2.21 1.14 (o) Alkaline cleaning rinse. Subpart E—PSES Pollutant or...

40 CFR 471.45 - Pretreatment standards for new sources (PSNS).

Code of Federal Regulations, 2013 CFR

2013-07-01

... Cyanide 0.179 0.074 Silver 0.253 0.105 (p) Alkaline cleaning spent baths. Subpart D—PSNS Pollutant or...-pounds) of precious metals alkaline cleaned Cadmium 0.021 0.009 Copper 0.114 0.060 Cyanide 0.018 0.007 Silver 0.025 0.010 (q) Alkaline cleaning rinse. Subpart D—PSNS Pollutant or pollutant property Maximum...

40 CFR 471.54 - Pretreatment standards for existing sources (PSES).

Code of Federal Regulations, 2014 CFR

2014-07-01

... 12.1 Nickel 23.3 15.4 Fluoride 720 320 Molybdenum 80.0 41.4 (n) Alkaline cleaning spent baths... (pounds per million off-pounds) of refractory metals alkaline cleaned Copper 0.635 0.334 Nickel 0.642 0.424 Fluoride 19.9 8.82 Molybdenum 2.21 1.14 (o) Alkaline cleaning rinse. Subpart E—PSES Pollutant or...

Structure and Microhardness of Cu-Ta Joints Produced by Explosive Welding

PubMed Central

Maliutina, Iu. N.; Mali, V. I.; Bataev, I. A.; Bataev, A. A.; Esikov, M. A.; Smirnov, A. I.; Skorokhod, K. A.

2013-01-01

The structure and microhardness of Cu-Ta joints produced by explosive welding were studied. It was found that, during explosive welding, an intermediate layer 20⋯40 μm thick with a finely dispersed heterophase structure, formed between the welded copper and tantalum plates. The structure of the layer was studied by scanning and transmission electron microscopy. Microvolumes with tantalum particles distributed in a copper matrix and microvolumes of copper particles in a tantalum matrix were detected. The tantalum particles in copper have a size of 5⋯500 nm, with a predominance of 5⋯50 nm particles. A mechanism for the formation of the finely dispersed heterophase structure in explosive welding is proposed. The microhardness of interlayers with the heterophase structure reaches 280 HV, which far exceeds the microhardness of copper (~130 HV) and tantalum (~160 HV). Many twins of deformation origin were found in the structure of the copper plate. The effect of heating temperature in the range from 100 to 900°C on the microhardness of copper, tantalum, and the Cu-Ta welded joint was studied. Upon heating to 900°C, the microhardness of the intermediate layer decreases from 280 to 150 HV. The reduction in the strength properties of the weld material is mainly due to structural transformations in copper. PMID:24453818

Fabrication of flower-like micro/nano dual scale structured copper oxide surfaces: Optimization of self-cleaning properties via Taguchi design

NASA Astrophysics Data System (ADS)

Moosavi, Saeideh Sadat; Norouzbeigi, Reza; Velayi, Elmira

2017-11-01

In the present work, copper oxide superhydrophobic surface is fabricated on a copper foil via the chemical bath deposition (CBD) method. The effects of some influential factors such as initial concentrations of Cu (II) ions and the surface energy modifier, solution pH, reaction and modification steps time on the wettability property of copper oxide surface were evaluated using Taguchi L16 experimental design. Results showed that the initial concentration of Cu (II) has the most significant impact on the water contact angle and wettability characteristics. The XRD, SEM, AFM and FTIR analyses were used to characterize the copper oxide surfaces. The Water contact angle (WCA) and contact angle hysteresis (CAH) were also measured. The SEM results indicated the formation of a flower-like micro/nano dual-scale structure of copper oxide on the substrate. This structure composed of numerous nano-petals with a thickness of about 50 nm. As a result, a copper oxide hierarchical surface with WCA of 168.4°± 3.5° and CAH of 2.73° exhibited the best superhydrophobicity under proposed optimum condition. This result has been obtained just by 10 min hydrolysis reaction. Besides, this surface showed a good stability under acidic and saline conditions.

Recycling Of Cis Photovoltaic Waste

DOEpatents

Drinkard, Jr., William F.; Long, Mark O.; Goozner; Robert E.

1998-07-14

A method for extracting and reclaiming metals from scrap CIS photovoltaic cells and associated photovoltaic manufacturing waste by leaching the waste with dilute nitric acid, skimming any plastic material from the top of the leaching solution, separating glass substrate from the leachate, electrolyzing the leachate to plate a copper and selenium metal mixture onto a first cathode, replacing the cathode with a second cathode, re-electrolyzing the leachate to plate cadmium onto the second cathode, separating the copper from selenium, and evaporating the depleted leachate to yield a zinc and indium containing solid.

Remediation System Evaluation, Peerless Plating Site

EPA Pesticide Factsheets

The Peerless Plating Superfund Site is located at 2554 South Getty Street, north of the intersection of South Getty Street and East Sherman Boulevard in Muskegon, Michigan. Copper, nickel, chromium, cadmium, and zinc electroplating operations as well as...

Hermetically sealable package for hybrid solid-state electronic devices and the like

NASA Technical Reports Server (NTRS)

Miller, Wilson N. (Inventor); Gray, Ormal E. (Inventor)

1988-01-01

A light-weight, inexpensively fabricated, hermetically sealable, repairable package for small electronic or electromechanical units, having multiple connections, is described. A molded ring frame of polyamide-imide plastic (Torlon) is attached along one edge to a base plate formed of a highly heat conducting material, such as aluminum or copper. Bores are placed through a base plate within the area of the edge surface of ring frame which result in an attachment of the ring frame to the base plate during molding. Electrical leads are molded into the ring frame. The leads are L-shaped gold-plated copper wires imbedded within widened portions of the side wall of the ring frame. Within the plastic ring frame wall the leads are bent (typically, though not necessarily at 90 deg) so that they project into the interior volume of the ring frame for connection to the solid state devices.

Dietary copper supplements modulate aortic superoxide dismutase, nitric oxide and atherosclerosis.

PubMed

Lamb, David J; Tickner, Michelle L; Hourani, Susanna M O; Ferns, Gordon A A

2005-08-01

The objective was to test the hypothesis that dietary copper inhibits atherosclerosis by inducing superoxide dismutase (SOD) and potentiating nitric oxide (NO). New Zealand White rabbits were fed either a cholesterol diet (n = 8) or a cholesterol diet containing 0.02% copper acetate (n = 8) for 13 weeks. We found that the intimal area was significantly smaller in the animals supplemented with copper (P < 0.005), although integrated plasma cholesterol levels were not significantly different. This was associated with a significant increase in aortic copper content (P < 0.05), SOD activity (P < 0.05) and Cu/Zn SOD mRNA (P < 0.05) and a significant decrease in nitrotyrosine content (P < 0.05). Furthermore, there was a positive correlation between aortic copper content and SOD activity (P < 0.005, R(2) = 0.83) and a negative correlation between aortic superoxide dimutase activity and nitrotyrosine content (P < 0.005, R(2) = 0.93). In organ bath experiments, the relaxation of precontracted carotid artery rings to calcium ionophore was greater in animals supplemented with copper. No difference in response to sodium nitroprusside was observed. These data suggest that in the cholesterol-fed rabbit, copper supplements inhibit the progression of atherosclerosis by increasing SOD expression, thereby reducing the interaction of NO with superoxide, and hence potentiating NO-mediated pathways that may protect against atherosclerosis.

Dietary copper supplements modulate aortic superoxide dismutase, nitric oxide and atherosclerosis

PubMed Central

Lamb, David J; Tickner, Michelle L; Hourani, Susanna M O; Ferns, Gordon A A

2005-01-01

The objective was to test the hypothesis that dietary copper inhibits atherosclerosis by inducing superoxide dismutase (SOD) and potentiating nitric oxide (NO). New Zealand White rabbits were fed either a cholesterol diet (n = 8) or a cholesterol diet containing 0.02% copper acetate (n = 8) for 13 weeks. We found that the intimal area was significantly smaller in the animals supplemented with copper (P < 0.005), although integrated plasma cholesterol levels were not significantly different. This was associated with a significant increase in aortic copper content (P < 0.05), SOD activity (P < 0.05) and Cu/Zn SOD mRNA (P < 0.05) and a significant decrease in nitrotyrosine content (P < 0.05). Furthermore, there was a positive correlation between aortic copper content and SOD activity (P < 0.005, R2 = 0.83) and a negative correlation between aortic superoxide dimutase activity and nitrotyrosine content (P < 0.005, R2 = 0.93). In organ bath experiments, the relaxation of precontracted carotid artery rings to calcium ionophore was greater in animals supplemented with copper. No difference in response to sodium nitroprusside was observed. These data suggest that in the cholesterol-fed rabbit, copper supplements inhibit the progression of atherosclerosis by increasing SOD expression, thereby reducing the interaction of NO with superoxide, and hence potentiating NO-mediated pathways that may protect against atherosclerosis. PMID:16045547

Survey of Naegleria fowleri in geothermal recreational waters of Guadeloupe (French West Indies).

PubMed

Moussa, Mirna; De Jonckheere, Johan F; Guerlotté, Jérôme; Richard, Vincent; Bastaraud, Alexandra; Romana, Marc; Talarmin, Antoine

2013-01-01

In 2008 a fatal case of primary amoebic meningoencephalitis, due to the amoeboflagellate Naegleria fowleri, occurred in Guadeloupe, French West Indies, after a child swam in a bath fed with geothermal water. In order to improve the knowledge on free-living amoebae in this tropical part of France, we investigated on a monthly basis, the presence of Naegleria spp. in the recreational baths, and stream waters which feed them. A total of 73 water samples, 48 sediments and 54 swabs samples were collected from 6 sampling points between June 2011 and July 2012. The water samples were filtered and the filters transferred to non-nutrient agar plates seeded with a heat-killed suspension of Escherichia coli while sediment and swab samples were placed directly on these plates. The plates were incubated at 44°C for the selective isolation of thermophilic Naegleria. To identify the Naegleria isolates the internal transcribed spacers, including the 5.8S rDNA, were amplified by polymerase chain reaction and the sequence of the PCR products was determined. Thermophilic amoebae were present at nearly all collection sites. The pathogenic N. fowleri was the most frequently encountered thermophilic species followed by N. lovaniensis. The concentration of N. fowleri was rather low in most water samples, ranging from 0 to 22 per liter. Sequencing revealed that all N. fowleri isolates belonged to a common Euro-American genotype, the same as detected in the human case in Guadeloupe. These investigations need to be continued in order to counsel the health authorities about prevention measures, because these recreational thermal baths are used daily by local people and tourists.

Survey of Naegleria fowleri in Geothermal Recreational Waters of Guadeloupe (French West Indies)

PubMed Central

Moussa, Mirna; De Jonckheere, Johan F.; Guerlotté, Jérôme; Richard, Vincent; Bastaraud, Alexandra; Romana, Marc; Talarmin, Antoine

2013-01-01

In 2008 a fatal case of primary amoebic meningoencephalitis, due to the amoeboflagellate Naegleria fowleri, occurred in Guadeloupe, French West Indies, after a child swam in a bath fed with geothermal water. In order to improve the knowledge on free-living amoebae in this tropical part of France, we investigated on a monthly basis, the presence of Naegleria spp. in the recreational baths, and stream waters which feed them. A total of 73 water samples, 48 sediments and 54 swabs samples were collected from 6 sampling points between June 2011 and July 2012. The water samples were filtered and the filters transferred to non-nutrient agar plates seeded with a heat-killed suspension of Escherichia coli while sediment and swab samples were placed directly on these plates. The plates were incubated at 44°C for the selective isolation of thermophilic Naegleria. To identify the Naegleria isolates the internal transcribed spacers, including the 5.8S rDNA, were amplified by polymerase chain reaction and the sequence of the PCR products was determined. Thermophilic amoebae were present at nearly all collection sites. The pathogenic N. fowleri was the most frequently encountered thermophilic species followed by N. lovaniensis. The concentration of N. fowleri was rather low in most water samples, ranging from 0 to 22 per liter. Sequencing revealed that all N. fowleri isolates belonged to a common Euro-American genotype, the same as detected in the human case in Guadeloupe. These investigations need to be continued in order to counsel the health authorities about prevention measures, because these recreational thermal baths are used daily by local people and tourists. PMID:23349880

Microstructure and Mechanical Properties of High Copper HSLA-100 Steel in 2-inch Plate Form

DTIC Science & Technology

1992-06-01

2. HSLA-100 Steel Continuous Cooling Transformation Diagram [Ref. 13:p. 262] One of the most desirable characteristics of the low -carbon, copper ...none V mild v.strong v. strong V. strong moderate The use of copper as an alloying element in low carbon HSLA steel has resulted in the following...HY-130 steel . In research presently being done, it has been determined that the high copper alloy has a highly dislocated martensitic /bainitic

Characteristics of coated copper wire specimens using high frequency ultrasonic complex vibration welding equipments.

PubMed

Tsujino, J; Ihara, S; Harada, Y; Kasahara, K; Sakamaki, N

2004-04-01

Welding characteristic of thin coated copper wires were studied using 40, 60, 100 kHz ultrasonic complex vibration welding equipments with elliptical to circular vibration locus. The complex vibration systems consisted of a longitudinal-torsional vibration converter and a driving longitudinal vibration system. Polyurethane coated copper wires of 0.036 mm outer diameter and copper plates of 0.3 mm thickness and the other dimension wires were used as welding specimens. The copper wire part is completely welded on the copper substrate and the insulated coating material is driven from welded area to outsides of the wire specimens by high frequency complex vibration.

Advances in the electrodeposition of aluminum from ionic liquid based electrolytes

NASA Astrophysics Data System (ADS)

Leadbetter, Kirt C.

Aluminum plating is of considerable technical and economic interest because it provides an eco-friendly substitute for cadmium coatings used on many military systems. However, cadmium has been determined to be a significant environmental safety and occupational health (ESOH) hazard because of its toxicity and carcinogenic nature. Furthermore, the cost of treating and disposing of generated wastes, which often contain cyanide, is costly and is becoming prohibitive in the face of increasingly stringent regulatory standards. The non-toxic alternative aluminum is equivalent or superior in performance to cadmium. In addition, it could serve to provide an alternative to hexavalent chromium coatings used on military systems for similar reasons to that of cadmium. Aluminum is a beneficial alternative in that it demonstrates self-healing corrosion resistance in the form of a tightly-bound, impervious oxide layer. A successfully plated layer would be serviceable over a wider temperature range, 925 °F for aluminum compared to 450 oF for cadmium. In addition, an aluminum layer can be anodized to make it non-conducting and colorable. In consideration of the plating process, aluminum cannot be deposited from aqueous solutions because of its reduction potential. Therefore, nonaqueous electrolytes are required for deposition. Currently, aluminum can be electrodeposited in nonaqueous processes that use hazardous chemicals such as toluene and pyrophoric aluminum alkyls. Electrodeposition from ionic liquids provides the potential for a safer method that could be easily scaled up for industrial application. The plating process could be performed at a lower temperature and higher current density than other commercially available aluminum electrodeposition processes; thus a reduced process cost could be possible. The current ionic liquid based electrolytes are more expensive; however production on a larger scale and a long electrolyte lifetime are associated with a reduction in price. Advancements of this nonaqueous aluminum plating process have the potential to lead to a novel and competitive commercial aluminum deposition process. In this investigation aluminum electrodeposition from ionic liquid based electrolytes onto steel, copper and magnesium substrates without conversion coatings or strike layers was evaluated in six different ionic liquid based electrolytes in two technical setups. Three of which are commercially available aluminum plating electrolytes, three of which, discussed in literature were created on site by research personnel in the laboratory. The three commercially available electrolytes were: 1-Butyl-3-methylimidazolium chloride ([BMIm]Cl) * 1.5 AlCl3 with proprietary additives from IoLiTec, 1-Ethyl-3-methylimidazolium chloride ([EMIm]Cl) * 1.5 AlCl3 with proprietary additives from IoLiTec, and BasionicsTM AL-02, an aluminum plating electrolyte containing [EMIm]Cl * 1.5 AlCl3 with additives from BASF. The three electrolytes created on site were based on the 1-ethyl-3-methylimidazolium chloride ionic liquid with added 1.5 AlCl3 and one with added sodium dodecyl sulfate. Small scale plating tests in a 25-mL plating cell were conducted to provide a comparative analysis of the six different electrolytes considered. From these investigations, two were chosen to be evaluated in a larger 1-liter plating cell; designed and constructed to provide a more realistic evaluation of plating parameters with selected electrolytes to better portray industrial electroplating conditions. The effect of current density (10-40 mA/cm 2), temperature (30-90° Celsius) and plating bath agitation on current efficiency, corrosion resistance by the ASTM B117 method, adhesion, microstructure, and chemical composition (evaluated with energy-dispersive x-ray spectroscopy) of the plated Al-layer was explored in both the 25-mL and 1-L plating cell investigations. In addition development of pre- and post-treatment processes for the metal substrates was attempted. While previous investigations focused on one or two of these topics, this research seeks to investigate all discussed phenomena and characteristics. Additionally, there is little research that reports on the adhesion performance of aluminum coatings from ionic liquids. Also, corrosion investigations are limited to all but a few publications. So too, the deposition of aluminum in a larger, more realistic plating cell has never been thoroughly investigated. This is key if a practical application of the technology is ever to be realized. In sum, correlations were drawn between electrolyte, current density, temperature and bath agitation with quality and characteristic of electrodeposited aluminum layers. The overriding goal to create an acceptably competitive aluminum coating process to replace cadmium and compete with other commercial aluminum deposition processes was not successful. Competitiveness was evaluated as per the discussed characteristics and so also, by a comparison to physical samples created in a more realistic plating cell to AlumiPlate aluminum coatings.

Improvement of black nickel coatings. [product development for use in solar collectors

NASA Technical Reports Server (NTRS)

Peterson, R. E.; Lin, J. H.

1976-01-01

Selectively absorbing black nickel coatings are among the most optically efficient low cost coatings for use on flat plate solar collectors. However, a current Ni-Zn-S-O coating in use is quite susceptible to a humid environment, degrading badly in less than ten days at 38 C (100 F) at 95 percent relative humidity. Therefore, a black nickel formula was developed which can withstand such exposures with no loss of optical efficiency, solar absorption of 0.92 and an infrared emittance (at 100 C) of 1.00 were still present after 14 days of humidity exposure. This compares to a solar absorptance of only 0.72 for the previous formula after a similar time period. The electroplating bath and conditions were changed to obtain the more stable coating configuration. The effect of bath composition, temperature, pH, and plating current density and time on the coating composition, spectral optical properties and durability were investigated systematically.

Silver and tin plating as medieval techniques of producing counterfeit coins and their identification by means of micro-XRF

NASA Astrophysics Data System (ADS)

Hložek, M.; Trojek, T.

2017-08-01

Archaeological surveys and metal detector prospecting yield a great amount of coins from the medieval period. Naturally, some of these are counterfeit which an experienced numismatist can determine without using chemical methods. The production of counterfeit coins in the middle ages took place in castles, caves or other remote areas where waste from this activity can still be found today - copper sheets, technical ceramics and counterfeit coins. Until recently, it has been assumed that medieval counterfeit coins are made by silver-plating copper blanks using an amalgam. However, the performed analyses reveal that there are many more techniques of counterfeiting of coins. Other techniques were based on e.g. tin amalgam plating of the blanks or alloying so-called white metal with silver-like appearance from which the coins were minted. Current chemical analyses indicate that the coins were often tinned by hot dipping with no amalgamation. Micro-X-ray fluorescence analysis has been chosen as a suitable non-destructive method to identify present chemical elements in investigated artifacts and to quantify their concentrations. In addition, a quick technique telltale the plating was applied. This technique utilizes the detected fluorescence ratio Kα/Kβ of copper, which is the main ingredient of a lot of historical metallic materials.

Development of ceramic-coated weld backing bars

DOE Office of Scientific and Technical Information (OSTI.GOV)

Eggleston, B.R.

1994-10-20

In shipbuilding and many other industries, copper weld backing bars are used to draw the heat out of the weld. The problem that some users of these bars encounter is that these bars, on occasion, actually melt in spots and become welded to the weld plates. After this happens a number of times, the backing bar becomes so degraded that it must be either discarded or machined, both of which are very costly and time-consuming actions. To avoid this fusion between the backing bar and the weld plate, the weld processes that are used cannot be ones of high beatmore » input. This requirement is very limiting when thick plates are being welded. The plates must be beveled, and more weld passes must be run. These problems are also costly and time consuming. The aim of this project is to find a way to produce backing bars with nearly the same `chilling` effect but with both a greater resistance to molten metal and resistance to arcing to the backing bar itself. A possible solution currently being tested is to coat the copper bars with a thin layer of a ceramic coating. The procedure used was to coat the copper bars with either alumina or spinel by a plasma spraying method.« less

40 CFR 471.42 - Effluent limitations representing the degree of effluent reduction attainable by the application...

Code of Federal Regulations, 2012 CFR

2012-07-01

... Cyanide 0.179 0.074 Silver 0.253 0.105 (p) Alkaline cleaning spent baths. Subpart D—BAT Pollutant or...-pounds) of precious metals alkaline cleaned Cadmium 0.021 0.009 Copper 0.114 0.060 Cyanide 0.018 0.007 Silver 0.025 0.010 (q) Alkaline cleaning rinse. Subpart D—BAT Pollutant or pollutant property Maximum for...

40 CFR 471.41 - Effluent limitations representing the degree of effluent reduction attainable by the application...

Code of Federal Regulations, 2012 CFR

2012-07-01

... at all times. (p) Alkaline cleaning spent baths. Subpart D—BPT Pollutant or pollutant property... metals alkaline cleaned Cadmium 0.021 0.009 Copper 0.114 0.060 Cyanide 0.018 0.007 Silver 0.025 0.010 Oil...) Alkaline cleaning rinse. Subpart D—BPT Pollutant or pollutant property Maximum for any 1 day Maximum for...

40 CFR 471.52 - Effluent limitations representing the degree of effluent reduction attainable by the application...

Code of Federal Regulations, 2012 CFR

2012-07-01

... 320 Molybdenum 60.9 27.0 (n) Alkaline cleaning spent baths. Subpart E—BAT Pollutant or pollutant... refractory metals alkaline cleaned Copper 0.428 0.204 Nickel 0.184 0.124 Fluoride 19.9 8.82 Molybdenum 1.68 0.745 (o) Alkaline cleaning rinse. Subpart E—BAT Pollutant or pollutant property Maximum for any 1 day...

40 CFR 471.41 - Effluent limitations representing the degree of effluent reduction attainable by the application...

Code of Federal Regulations, 2013 CFR

2013-07-01

... at all times. (p) Alkaline cleaning spent baths. Subpart D—BPT Pollutant or pollutant property... metals alkaline cleaned Cadmium 0.021 0.009 Copper 0.114 0.060 Cyanide 0.018 0.007 Silver 0.025 0.010 Oil...) Alkaline cleaning rinse. Subpart D—BPT Pollutant or pollutant property Maximum for any 1 day Maximum for...

40 CFR 471.42 - Effluent limitations representing the degree of effluent reduction attainable by the application...

Code of Federal Regulations, 2011 CFR

2011-07-01

... Cyanide 0.179 0.074 Silver 0.253 0.105 (p) Alkaline cleaning spent baths. Subpart D—BAT Pollutant or...-pounds) of precious metals alkaline cleaned Cadmium 0.021 0.009 Copper 0.114 0.060 Cyanide 0.018 0.007 Silver 0.025 0.010 (q) Alkaline cleaning rinse. Subpart D—BAT Pollutant or pollutant property Maximum for...

40 CFR 471.82 - Effluent limitations representing the degree of effluent reduction attainable by the application...

Code of Federal Regulations, 2011 CFR

2011-07-01

....151 (j) Alkaline cleaning spent baths. Subpart H—BAT Pollutant or pollutant property Maximum for any 1 day Maximum for monthly average mg/off-kg (pounds per million off-pounds) of zinc alkaline cleaned Chromium 0.002 0.0006 Copper 0.005 0.002 Cyanide 0.0007 0.0003 Zinc 0.004 0.002 (k) Alkaline cleaning rinse...

40 CFR 471.82 - Effluent limitations representing the degree of effluent reduction attainable by the application...

Code of Federal Regulations, 2014 CFR

2014-07-01

....072 0.029 Zinc 0.365 0.151 (j) Alkaline cleaning spent baths. Subpart H—BAT Pollutant or pollutant... zinc alkaline cleaned Chromium 0.002 0.0006 Copper 0.005 0.002 Cyanide 0.0007 0.0003 Zinc 0.004 0.002 (k) Alkaline cleaning rinse. Subpart H—BAT Pollutant or pollutant property Maximum for any 1 day...

40 CFR 471.42 - Effluent limitations representing the degree of effluent reduction attainable by the application...

Code of Federal Regulations, 2014 CFR

2014-07-01

... Cyanide 0.179 0.074 Silver 0.253 0.105 (p) Alkaline cleaning spent baths. Subpart D—BAT Pollutant or...-pounds) of precious metals alkaline cleaned Cadmium 0.021 0.009 Copper 0.114 0.060 Cyanide 0.018 0.007 Silver 0.025 0.010 (q) Alkaline cleaning rinse. Subpart D—BAT Pollutant or pollutant property Maximum for...

40 CFR 471.41 - Effluent limitations representing the degree of effluent reduction attainable by the application...

Code of Federal Regulations, 2014 CFR

2014-07-01

... at all times. (p) Alkaline cleaning spent baths. Subpart D—BPT Pollutant or pollutant property... metals alkaline cleaned Cadmium 0.021 0.009 Copper 0.114 0.060 Cyanide 0.018 0.007 Silver 0.025 0.010 Oil...) Alkaline cleaning rinse. Subpart D—BPT Pollutant or pollutant property Maximum for any 1 day Maximum for...

40 CFR 471.52 - Effluent limitations representating the degree of effluent reduction attainable by the...

Code of Federal Regulations, 2010 CFR

2010-07-01

... 320 Molybdenum 60.9 27.0 (n) Alkaline cleaning spent baths. Subpart E—BAT Pollutant or pollutant... refractory metals alkaline cleaned Copper 0.428 0.204 Nickel 0.184 0.124 Fluoride 19.9 8.82 Molybdenum 1.68 0.745 (o) Alkaline cleaning rinse. Subpart E—BAT Pollutant or pollutant property Maximum for any 1 day...

40 CFR 471.52 - Effluent limitations representing the degree of effluent reduction attainable by the application...

Code of Federal Regulations, 2014 CFR

2014-07-01

... 320 Molybdenum 60.9 27.0 (n) Alkaline cleaning spent baths. Subpart E—BAT Pollutant or pollutant... refractory metals alkaline cleaned Copper 0.428 0.204 Nickel 0.184 0.124 Fluoride 19.9 8.82 Molybdenum 1.68 0.745 (o) Alkaline cleaning rinse. Subpart E—BAT Pollutant or pollutant property Maximum for any 1 day...

40 CFR 471.52 - Effluent limitations representating the degree of effluent reduction attainable by the...

Code of Federal Regulations, 2011 CFR

2011-07-01

... 320 Molybdenum 60.9 27.0 (n) Alkaline cleaning spent baths. Subpart E—BAT Pollutant or pollutant... refractory metals alkaline cleaned Copper 0.428 0.204 Nickel 0.184 0.124 Fluoride 19.9 8.82 Molybdenum 1.68 0.745 (o) Alkaline cleaning rinse. Subpart E—BAT Pollutant or pollutant property Maximum for any 1 day...

40 CFR 471.51 - Effluent limitations representing the degree of effluent reduction attainable by the application...

Code of Federal Regulations, 2013 CFR

2013-07-01

... range of 7.5 to 10.0 at all times. (n) Alkaline cleaning spent baths. Subpart E—BPT Pollutant or...-pounds) of refractory metals alkaline cleaned Copper 0.635 0.334 Nickel 0.641 0.424 Fluoride 19.9 8.82... all times. (o) Alkaline cleaning rinse. Subpart E—BPT Pollutant or pollutant property Maximum for any...

40 CFR 471.82 - Effluent limitations representing the degree of effluent reduction attainable by the application...

Code of Federal Regulations, 2010 CFR

2010-07-01

....151 (j) Alkaline cleaning spent baths. Subpart H—BAT Pollutant or pollutant property Maximum for any 1 day Maximum for monthly average mg/off-kg (pounds per million off-pounds) of zinc alkaline cleaned Chromium 0.002 0.0006 Copper 0.005 0.002 Cyanide 0.0007 0.0003 Zinc 0.004 0.002 (k) Alkaline cleaning rinse...

40 CFR 471.82 - Effluent limitations representing the degree of effluent reduction attainable by the application...

Code of Federal Regulations, 2012 CFR

2012-07-01

....072 0.029 Zinc 0.365 0.151 (j) Alkaline cleaning spent baths. Subpart H—BAT Pollutant or pollutant... zinc alkaline cleaned Chromium 0.002 0.0006 Copper 0.005 0.002 Cyanide 0.0007 0.0003 Zinc 0.004 0.002 (k) Alkaline cleaning rinse. Subpart H—BAT Pollutant or pollutant property Maximum for any 1 day...

40 CFR 471.41 - Effluent limitations representing the degree of effluent reduction attainable by the application...

Code of Federal Regulations, 2010 CFR

2010-07-01

... at all times. (p) Alkaline cleaning spent baths. Subpart D—BPT Pollutant or pollutant property... metals alkaline cleaned Cadmium 0.021 0.009 Copper 0.114 0.060 Cyanide 0.018 0.007 Silver 0.025 0.010 Oil...) Alkaline cleaning rinse. Subpart D—BPT Pollutant or pollutant property Maximum for any 1 day Maximum for...

Production of Copper-Plated Beamline Bellows and Spools for LCLS-II

DOE Office of Scientific and Technical Information (OSTI.GOV)

Wilson, Katherine M.; Carpenter, Brian C.; Daly, Ed

The SLAC National Accelerator Laboratory is currently constructing a major upgrade to its accelerator, the Linac Coherent Light Source II (LCLS-II). Several Department of Energy national laboratories, including the Thomas Jefferson National Accelerator Facility (JLab) and Fermi National Accelerator Laboratory (FNAL), are participating in this project. The 1.3-GHz cryomodules for this project consist of eight cavities separated by bellows (expansion joints) and spools (tube sections), which are copper plated for RF conduction. JLab is responsible for procurement of these bellows and spools, which are delivered to JLab and FNAL for assembly into cryomodules. Achieving accelerator-grade copper plating is always amore » challenge and requires careful specification of requirements and application of quality control processes. Due to the demanding technical requirements of this part, JLab implemented procurement strategies to make the process more efficient as well as provide process redundancy. This paper discusses the manufacturing challenges that were encountered and resolved, as well as the strategies that were employed to minimize the impact of any technical issues.« less

Estimates of microbial quality and concentration of copper in distributed drinking water are highly dependent on sampling strategy.

PubMed

Lehtola, Markku J; Miettinen, Ilkka T; Hirvonen, Arja; Vartiainen, Terttu; Martikainen, Pertti J

2007-12-01

The numbers of bacteria generally increase in distributed water. Often household pipelines or water fittings (e.g., taps) represent the most critical location for microbial growth in water distribution systems. According to the European Union drinking water directive, there should not be abnormal changes in the colony counts in water. We used a pilot distribution system to study the effects of water stagnation on drinking water microbial quality, concentration of copper and formation of biofilms with two commonly used pipeline materials in households; copper and plastic (polyethylene). Water stagnation for more than 4h significantly increased both the copper concentration and the number of bacteria in water. Heterotrophic plate counts were six times higher in PE pipes and ten times higher in copper pipes after 16 h of stagnation than after only 40 min stagnation. The increase in the heterotrophic plate counts was linear with time in both copper and plastic pipelines. In the distribution system, bacteria originated mainly from biofilms, because in laboratory tests with water, there was only minor growth of bacteria after 16 h stagnation. Our study indicates that water stagnation in the distribution system clearly affects microbial numbers and the concentration of copper in water, and should be considered when planning the sampling strategy for drinking water quality control in distribution systems.

Glass-bead peen plating

NASA Technical Reports Server (NTRS)

Graves, J. R.

1974-01-01

Peen plating of aluminum, copper, and nickel powders was investigated. Only aluminum was plated successfully within the range of peen plating conditions studied. Optimum plating conditions for aluminum were found to be: (1) bead/powder mixture containing 25 to 35% powder by weight, (2) peening intensity of 0.007A as measured by Almen strip, and (3) glass impact bead diameter of at least 297 microns (0.0117 inches) for depositing-100 mesh aluminum powder. No extensive cleaning or substrate preparation is required beyond removing loose dirt or heavy oil.

The Influence of Impurities and Metallic Capping Layers on the Microstructure of Copper Interconnects

NASA Astrophysics Data System (ADS)

Rizzolo, Michael

As copper interconnects have scaled to ever smaller dimensions on semiconductor devices, the microstructure has become increasingly detrimental for performance and reliability. Small grains persist in interconnects despite annealing at high temperatures, leading to higher line resistance and more frequent electromigration-induced failures. Conventionally, it was believed that impurities from the electrodeposition pinned grain growth, but limitations in analytical techniques meant the effect was inferred rather than observed. Recent advances in analytical techniques, however, have enabled this work to quantify impurity content, location, and diffusion in relation to microstructural changes in electroplated copper. Surface segregation of impurities during the initial burst of grain growth was investigated. After no surface segregation was observed, a microfluidic plating cell was constructed to plate multilayer films with regions of intentionally high and low impurity concentrations to determine if grain growth could be pinned by the presence of impurities; it was not. An alternate mechanism for grain boundary pinning based on the texture of the seed layer is proposed, supported by time-resolved transmission electron microscopy and transmission electron backscatter diffraction data. The suggested model posits that the seed in narrow features has no preferred orientation, which results in rapid nucleation of subsurface grains in trench regions prior to recrystallization from the overburden down. These rapidly growing grains are able to block off several trenches from the larger overburden grains, inhibiting grain growth in narrow features. With this knowledge in hand, metallic capping layers were employed to address the problematic microstructure in 70nm lines. The capping layers (chromium, nickel, zinc, and tin) were plated on the copper overburden prior to annealing to manipulate the stress gradient and microstructural development during annealing. It appeared that regardless of as-plated stress, nickel capping altered the recrystallized texture of the copper over patterned features. The nickel capping also caused a 2x increase in the number of advantageous 'bamboo' grains that span the entire trench, which effectively block electromigration pathways. These data provides a more fundamental understanding of manipulating the microstructure in copper interconnects using pre-anneal capping layers, and demonstrates a strategy to improve the microstructure beyond the capabilities of simple annealing.

Fixation of the stressed state of glass plates by coating them with thin films using a plasma focus installation

NASA Astrophysics Data System (ADS)

Kolokoltsev, V. N.; Degtiarev, V. F.; Borovitskaya, I. V.; Nikulin, V. Ya.; Peregudova, E. N.; Silin, P. V.; Eriskin, A. A.

2018-01-01

Elastic deformation in transparent mediums is usually studied by the photoelasticity method. For opaque mediums the method of film coating and strain gauge method are used. After the external load was removed, the interference pattern corresponding to elastic deformation of the material disappears. It is found that the elastic deformation state of the thin glass plate under the action of concentrated load can be fixed during the deposition of a thin metal film. Deposition of thin copper films was carried out by passing of plasma through the copper tube installed inside the Plasma Focus installation. After removing of the load, interference pattern on the glass plates was observed in the form of Newton’s rings and isogers in non-monochromatic light on the CCD scanners which uses uorescent lamps with cold cathode. It is supposed that the copper film fixes the relief of the surface of the glass plate at the time of deformation and saves it when the load is removed. In the case of a concentrated load, this relief has the shape of a thin lens of large radius. For this reason, the interference of coherent light rays in a thin air gap between the glass of the scanners atbed and the lens surface has the shape of Newton's rings. In this case, when scanning the back side of the plate, isogyres are observed. The presented method can be used in the analysis of the mechanical stress in a various optical elements.

Bitter-type magnet plate design with compound conductor of ultrahigh mechanical strength

DOE Office of Scientific and Technical Information (OSTI.GOV)

Haubenberger, W.D.

1981-01-01

A Bitter-type magnet plate design based on a compound conductor of ultrahigh mechanical strength is described. An explosion-bonded and cold-worked copper-austenite compound is jointed by a special procedure with a soft compound sheet.

Boron-doped diamond microdisc arrays: electrochemical characterisation and their use as a substrate for the production of microelectrode arrays of diverse metals (Ag, Au, Cu)via electrodeposition.

PubMed

Simm, Andrew O; Banks, Craig E; Ward-Jones, Sarah; Davies, Trevor J; Lawrence, Nathan S; Jones, Timothy G J; Jiang, Li; Compton, Richard G

2005-09-01

A novel boron-doped diamond (BDD) microelectrode array is characterised with electrochemical and atomic force microscopic techniques. The array consists of 40 micron-diameter sized BDD discs which are separated by 250 microns from their nearest neighbour in a hexagonal arrangement. The conducting discs can be electroplated to produce arrays of copper, silver or gold for analytical purposes in addition to operating as an array of BDD-microelectrodes. Proof-of-concept is shown for four separate examples; a gold plated array for arsenic detection, a copper plated array for nitrate analysis, a silver plated array for hydrogen peroxide monitoring and last, cathodic stripping voltammetry for lead at the bare BDD-array.

Direct write of copper-graphene composite using micro-cold spray

DOE Office of Scientific and Technical Information (OSTI.GOV)

Dardona, Sameh, E-mail: dardona@utrc.utc.com; She, Ying; Schmidt, Wayde R.

Direct write of a new class of composite materials containing copper and graphene in the powder phase is described. The composite was synthesized using batch electroless plating of copper for various times onto Nano Graphene Platelets (NGP) to control the amount of copper deposited within the loosely aggregated graphene powder. Copper deposition was confirmed by both Focused Ion Beam (FIB) and Auger electron spectroscopic analysis. A micro-cold spray technique was used to deposit traces that are ∼230 μm wide and ∼5 μm thick of the formulated copper/graphene powder onto a glass substrate. The deposited traces were found to have goodmore » adhesion to the substrate with ∼65x the copper bulk resistivity.« less

Printed Nano Cu and NiSi Contacts and Metallization for Solar Cell Modules

DOE Office of Scientific and Technical Information (OSTI.GOV)

Carmody, Michael John

There has long been a desire to replace the front-side silver contacts in silicon solar cells. There are two driving forces to do this. First, silver is an expensive precious metal. Secondly, the process to use silver requires that it be formulated into screen print pastes that need a lead-containing glass frit, and the use of lead is forbidden in many parts of the world. Because of the difficulty in replacing these pastes and the attendant processes, lead exemptions have granted to solar cells. Copper has been the replacement metal of choice because it is significantly cheaper than silver andmore » is very close to silver in electrical conductivity. Using processes which do not use lead, obviates it as an environmental contaminant. However, copper cannot be in contact with the silicon of the cell since it migrates through the silicon and causes defects which severely damage the efficiency of the cell. Hence, a conductive barrier must be placed between the copper and silicon and nickel, and especially nickel silicide, have been shown to be materials of choice. However, nickel must be sputtered and annealed to create the nickel silicide barrier, and copper has either been sputtered or plated. All of these processes require expensive, specialized equipment and plating uses environmentally unfriendly chemicals. Therefore, Intrinsiq proposed using printed nano nickel silicide ink (which we had previously invented) and printed nano copper ink to create these electrodes and barriers. We found that nano copper ink could be readily printed and sintered under a reducing atmosphere to give highly conductive grids. We further showed that nano nickel silicide ink could be readily jetted into grids on top of the silicon cell. It could then be annealed to create a barrier. However, it was found that the combination of printed NiSi and printed Cu did not give contact resistivity good enough to produce efficient cells. Only plated copper on top of the printed NiSi gave useful contact resistivity, and that proved to five to ten times less conductive than the commercial silver grids. Even so, the NiSi layer was a very good barrier to copper migration, even under harsh environmental conditions. Additionally, both plated copper and printed copper could be soldered to. While it may be possible to produce an all printed copper/nickel silicide top electrode for silicon cells, it was not easily demonstrated within the time and monetary constraints of the present project. Additionally, potential customers have told us that having to laser ablate the anti-reflection coating of cells to create a connection for NiSi, and the addition of two printing and annealing (sintering for copper) steps, adds too much expense to compensate for any potential cost savings from using copper. The cost benefits of copper have been further eroded by the facts that over the lifetime of this project, the cost of silver electrodes decreased due to manufacturers finding ways to use less and less silver, and inventing pastes which use less costly silver materials to begin with. All of these factors were considered and led to the decision to stop the program before actual manufacturing scale was attempted.« less

Chemical Bath Deposited Zinc Sulfide Buffer Layers for Copper Indium Gallium Sulfur-selenide Solar Cells and Device Analysis

DOE Office of Scientific and Technical Information (OSTI.GOV)

Kundu, Sambhu N.; Olsen, Larry C.

2005-01-03

Cd free CIGSS thin film solar cell structures with a MgF2/TCO/CGD-ZnS/CIGSS/Mo/SLG structure have been fabricated using chemical bath deposited (CBD)-ZnS buffer layers and high quality CIGSS absorber layers supplied from Shell Solar Industries. The use of CBD-ZnS, which is a higher band gap materials than CdS, improved the quantum efficiency of fabricated cells at lower wavelengths, leading to an increase in short circuit current. The best cell to date yielded an active area (0.43 cm2) efficiency of 13.3%. This paper also presents a discussion of the issues relating to the use of the CBD-ZnS buffer materials for improving device performance.

A new capillary electrophoresis buffer for determining organic and inorganic anions in electroplating bath with surfactant additives.

PubMed

Sun, H; Lau, K M; Fung, Y S

2010-05-07

Monitoring of trace impurities in electroplating bath is needed to meet EU requirements for WEEE and RoHS and for quality control of electrodeposits. Methods using IC and 100% aqueous CE buffer were found producing non-repeatable results attributed to interference of surfactants and major methanesulphonate anion. A new CE buffer containing 1.5mM tetraethylenepentaamine, 3mM 1,3,5-benzenetricarboxylic acid and 15 mM Tris in 20% (v/v) methanol at pH=8.4 was shown to enhance the separation window, reduce interaction between buffer and bath constituents, and give satisfactory repeatability with baseline separation for 14 organic and inorganic anions within 14 min, good repeatability for migration time (0.32-0.57% RSD), satisfactory peak area and peak height (2.9-4.5 and 3-4.7% respectively), low detection limit (S/N=2, 20-150 ppb), and wide working ranges (0.1-100 ppm). The CE buffer with 20% (v/v) methanol has demonstrated its capability for identifying anion impurities causing problem in aged tin bath and the use of only 10-fold dilution to produce reliable results for quality assessment in plating bath containing high surfactant additives. Copyright (c) 2010 Elsevier B.V. All rights reserved.

Thermal conductance measurements of bolted copper joints for SuperCDMS

DOE Office of Scientific and Technical Information (OSTI.GOV)

Schmitt, R.; Tatkowski, Greg; Ruschman, M.

2015-09-01

Joint thermal conductance testing has been undertaken for bolted copper to copper connections from 60 mK to 26 K. This testing was performed to validate an initial design basis for the SuperCDMS experiment, where a dilution refrigerator will be coupled to a cryostat via multiple bolted connections. Copper used during testing was either gold plated or passivated with citric acid to prevent surface oxidation. Results obtained are well fit by a power law regression of joint thermal conductance to temperature and match well with data collected during a literature review.

Process Development for the Fabrication of Spheroidal Microdevice Packages Utilizing MEMS Technologies

DTIC Science & Technology

2014-03-27

in a thin conductive layer, the wafer surface can be made into the cathode while using a stainless steel plate as an anode. Bath temperature, voltage...beakers with polytetrafluoroethylene (PTFE) tools while under a fume hood, as HF is known to attack glass and polystyrene [62]. Additionally

40 CFR 471.81 - Effluent limitations representing the degree of effluent reduction attainable by the application...

Code of Federal Regulations, 2014 CFR

2014-07-01

... range of 7.5 to 10.0 at all times. (j) Alkaline cleaning spent baths. Subpart H—BPT Pollutant or...-pounds) of zinc alkaline cleaned Chromium 0.002 0.0007 Copper 0.007 0.004 Cyanide 0.001 0.0004 Zinc 0.005... times. (k) Alkaline cleaning rinse. Subpart H—BPT Pollutant or pollutant property Maximum for any 1 day...

40 CFR 471.81 - Effluent limitations representing the degree of effluent reduction attainable by the application...

Code of Federal Regulations, 2012 CFR

2012-07-01

... range of 7.5 to 10.0 at all times. (j) Alkaline cleaning spent baths. Subpart H—BPT Pollutant or...-pounds) of zinc alkaline cleaned Chromium 0.002 0.0007 Copper 0.007 0.004 Cyanide 0.001 0.0004 Zinc 0.005... times. (k) Alkaline cleaning rinse. Subpart H—BPT Pollutant or pollutant property Maximum for any 1 day...

40 CFR 471.81 - Effluent limitations representing the degree of effluent reduction attainable by the application...

Code of Federal Regulations, 2013 CFR

2013-07-01

... range of 7.5 to 10.0 at all times. (j) Alkaline cleaning spent baths. Subpart H—BPT Pollutant or...-pounds) of zinc alkaline cleaned Chromium 0.002 0.0007 Copper 0.007 0.004 Cyanide 0.001 0.0004 Zinc 0.005... times. (k) Alkaline cleaning rinse. Subpart H—BPT Pollutant or pollutant property Maximum for any 1 day...

Optimizing the recovery of copper from electroplating rinse bath solution by hollow fiber membrane.

PubMed

Oskay, Kürşad Oğuz; Kul, Mehmet

2015-01-01

This study aimed to recover and remove copper from industrial model wastewater solution by non-dispersive solvent extraction (NDSX). Two mathematical models were developed to simulate the performance of an integrated extraction-stripping process, based on the use of hollow fiber contactors using the response surface method. The models allow one to predict the time dependent efficiencies of the two phases involved in individual extraction or stripping processes. The optimal recovery efficiency parameters were determined as 227 g/L of H2SO4 concentration, 1.22 feed/strip ratio, 450 mL/min flow rate (115.9 cm/min. flow velocity) and 15 volume % LIX 84-I concentration in 270 min by central composite design (CCD). At these optimum conditions, the experimental value of recovery efficiency was 95.88%, which was in close agreement with the 97.75% efficiency value predicted by the model. At the end of the process, almost all the copper in the model wastewater solution was removed and recovered as CuSO4.5H2O salt, which can be reused in the copper electroplating industry.

Unusual behavior in magnesium-copper cluster matter produced by helium droplet mediated deposition.

PubMed

Emery, S B; Xin, Y; Ridge, C J; Buszek, R J; Boatz, J A; Boyle, J M; Little, B K; Lindsay, C M

2015-02-28

We demonstrate the ability to produce core-shell nanoclusters of materials that typically undergo intermetallic reactions using helium droplet mediated deposition. Composite structures of magnesium and copper were produced by sequential condensation of metal vapors inside the 0.4 K helium droplet baths and then gently deposited onto a substrate for analysis. Upon deposition, the individual clusters, with diameters ∼5 nm, form a cluster material which was subsequently characterized using scanning and transmission electron microscopies. Results of this analysis reveal the following about the deposited cluster material: it is in the un-alloyed chemical state, it maintains a stable core-shell 5 nm structure at sub-monolayer quantities, and it aggregates into unreacted structures of ∼75 nm during further deposition. Surprisingly, high angle annular dark field scanning transmission electron microscopy images revealed that the copper appears to displace the magnesium at the core of the composite cluster despite magnesium being the initially condensed species within the droplet. This phenomenon was studied further using preliminary density functional theory which revealed that copper atoms, when added sequentially to magnesium clusters, penetrate into the magnesium cores.

[Study on physical properties of titanium alloy sample fabricated with vacuum-sintered powder metallurgy].

PubMed

Ding, X; Liang, X; Chao, Y; Han, X

2000-06-01

To investigate the physical properties of titanium alloy fabricated with vacuum-sintered powder metallurgy. The titanium powders of three different particle sizes(-160mesh, -200 - +300mesh, -300mesh) were selected, and mixed with copper and aluminum powder in different proportions. Two other groups were made up of titanium powder(-200 - +300mesh) plated with copper and tin. The build-up and, condensation method and a double-direction press with a metal mold were used. The green compacts were sintered at 1000 degrees C for 15 minutes in a vacuum furnace at 0.025 Pa. In the double-direction press, the specimens were compacted at the pressure of 100 MPa, 200 MPa and 300 MPa respectively. Then the linear shrinkage ratio and the opening porosity of the sintered compacts were evaluated respectively. 1. The linear shrinkage ratio of specimens decreased with the increased compacted pressure(P < 0.05). There was no significant difference among the linear shrinkage ratios of three different titanium powders at the same compacted pressure(P > 0.05), but that of titanium powder plated with copper and tin was higher than those of other specimens without plating(P < 0.05). 2. The opening porosity of specimens decreased with the increased compacted pressure(P < 0.05). Three different sized particle of titanium powder did not affect the opening porosity at the same compacted pressure(P > 0.05). The composition of titanium-based metal powder mixtures and the compacted pressures affect the physical properties of sintered compacts. Titanium powder plated with copper and tin is compacted and sintered easily, and the physical properties of sintered compacts are greatly improved.

Large-displacement structural durability analyses of simple bend specimen emulating rocket nozzle liners

NASA Technical Reports Server (NTRS)

Arya, Vinod K.; Halford, Gary R.

1994-01-01

Large-displacement elastic and elastic-plastic, finite-element stress-strain analyses of an oxygen-tree high-conductivity (OFHC) copper plate specimen were performed using an updated Lagrangian formulation. The plate specimen is intended for low-cost experiments that emulate the most important thermomechanical loading and failure modes of a more complex rocket nozzle. The plate, which is loaded in bending at 593 C, contains a centrally located and internally pressurized channel. The cyclic crack initiation lives were estimated using the results from the analyses and isothermal strain-controlled low-cycle fatigue data for OFHC copper. A comparison of the predicted and experimental cyclic lives showed that an elastic analysis predicts a longer cyclic life than that observed in experiments by a factor greater than 4. The results from elastic-plastic analysis for the plate bend specimen, however, predicted a cyclic life in close agreement with experiment, thus justifying the need for the more rigorous stress-strain analysis.

Improved Cloud Condensation Nucleus Spectrometer

NASA Technical Reports Server (NTRS)

Leu, Ming-Taun

2010-01-01

An improved thermal-gradient cloud condensation nucleus spectrometer (CCNS) has been designed to provide several enhancements over prior thermal- gradient counters, including fast response and high-sensitivity detection covering a wide range of supersaturations. CCNSs are used in laboratory research on the relationships among aerosols, supersaturation of air, and the formation of clouds. The operational characteristics of prior counters are such that it takes long times to determine aerosol critical supersaturations. Hence, there is a need for a CCNS capable of rapid scanning through a wide range of supersaturations. The present improved CCNS satisfies this need. The improved thermal-gradient CCNS (see Figure 1) incorporates the following notable features: a) The main chamber is bounded on the top and bottom by parallel thick copper plates, which are joined by a thermally conductive vertical wall on one side and a thermally nonconductive wall on the opposite side. b) To establish a temperature gradient needed to establish a supersaturation gradient, water at two different regulated temperatures is pumped through tubes along the edges of the copper plates at the thermally-nonconductive-wall side. Figure 2 presents an example of temperature and supersaturation gradients for one combination of regulated temperatures at the thermally-nonconductive-wall edges of the copper plates. c) To enable measurement of the temperature gradient, ten thermocouples are cemented to the external surfaces of the copper plates (five on the top plate and five on the bottom plate), spaced at equal intervals along the width axis of the main chamber near the outlet end. d) Pieces of filter paper or cotton felt are cemented onto the interior surfaces of the copper plates and, prior to each experimental run, are saturated with water to establish a supersaturation field inside the main chamber. e) A flow of monodisperse aerosol and a dilution flow of humid air are introduced into the main chamber at the inlet end. The inlet assembly is designed to offer improved (relative to prior such assemblies) laminar-flow performance within the main chamber. Dry aerosols are subjected to activation and growth in the supersaturation field. f) After aerosol activation, at the outlet end of the main chamber, a polished stainless-steel probe is used to sample droplets into a laser particle counter. The probe features an improved design for efficient sampling. The counter has six channels with size bins in the range of 0.5- to 5.0-micron diameter. g) To enable efficient sampling, the probe is scanned along the width axis of the main chamber (thereby effecting scanning along the temperature gradient and thereby, further, effecting scanning along the supersaturation gradient) by means of a computer-controlled translation stage.

Ultrasound influence on the activation step before electroless coating.

PubMed

Touyeras, F; Hihn, J Y; Delalande, S; Viennet, R; Doche, M L

2003-10-01

This paper is devoted to the electroless plating of non-conductive substrates under ultrasound at 530 kHz. The ultrasonic irradiation is applied to the activation and to the plating steps. Effects are measured by following the final copper thickness obtained in 1 h of plating time, easily correlated to the average plating rate. It appears that ultrasound has a strong influence on the plating rates enhancement, and assumptions can be made that this increase could be linked to the catalyst cleaning. This is confirmed by XPS measurements.

Optimization of reaction parameters in hydrothermal synthesis: a strategy towards the formation of CuS hexagonal plates

PubMed Central

2013-01-01

Background For decades, copper sulphide has been renowned as the superior optical and semiconductor materials. Its potential applications can be ranged from solar cells, lithium-ion batteries, sensors, and catalyst systems. The synthesis methodologies of copper sulphide with different controlled morphology have been widely explored in the literature. Nevertheless, the understanding on the formation chemistry of CuS is still limited. The ultimate approach undertaking in this article is to investigate the formation of CuS hexagonal plates via the optimization of reaction parameters in hydrothermal reaction between copper (II) nitrate and sodium thiosulphate without appending any assistant agent. Results Covellite (CuS) hexagonal plates were formed at copper ion: thiosulphate ion (Cu2+:S2O32−) mole ratio of 1:2 under hydrothermal treatment of 155°C for 12 hours. For synthesis conducted at reaction temperature lower than 155°C, copper sulphate (CuSO4), krohnite (NaCu2(SO4)(H2O)2] and cyclooctasulphur (S8) were present as main impurities with covellite (CuS). When Cu2+:S2O32− mole ratio was varied to 1: 1 and 1: 1.5, phase pure plate-like natrochalcite [NaCu2(SO4)(H2O)] and digenite (Cu9S5) were produced respectively. Meanwhile, mixed phases of covellite (CuS) and cyclooctasulphur (S8) were both identified when Cu2+:S2O32− mole ratio was varied to 1: 2.5, 1: 3 and 1: 5 as well as when reaction time was shortened to 1 hour. Conclusions CuS hexagonal plates with a mean edge length of 1 μm, thickness of 100 nm and average crystallite size of approximately (45 ± 2) nm (Scherrer estimation) were successfully synthesized via assisting agent- free hydrothermal method. Under a suitable Cu2+:S2O32− mole ratio, we evidenced that the formation of covellite (CuS) is feasible regardless of the reaction temperature applied. However, a series of impurities were attested with CuS if reaction temperature was not elevated high enough for the additional crystallite phase decomposition. It was also identified that Cu2+:S2O32− mole ratio plays a vital role in controlling the amount of cyclooctasulphur (S8) in the final powder obtained. Finally, reaction time was recognized as an important parameter in impurity decomposition as well as increasing the crystallite size and crystallinity of the CuS hexagonal plates formed. PMID:23575312

Investigation of reliability attributes and accelerated stress factors on terrestrial solar cells

NASA Technical Reports Server (NTRS)

Lathrop, J. W.

1982-01-01

The accelerated stress test results obtained on all terrestrial solar cells since the inception of the program are summarized. Tested cells were grouped according to the method used to form the conductive metallization layer: solder dipped, vacuum deposited, screen printed, and copper plated. Although metallization systems within each group were quite similar, they differed in numerous details according to the procedures employed by each manufacturer. Test results were summarized for all cells according to both electrical degradation and catastrophic mechanical changes. These results indicated a variability within each metallization category which was dependent on the manufacturer. Only one manufacturer was represented in the copper plated category and, although these showed no signs of detrimental copper diffusion during high temperature testing, their metallization was removed easily during high humidity pressure cooker testing. Preliminary testing of encapsulated cells showed no major differences between encapsulated and unencapsulated cells when subjected to accelerated testing.

Synthesis of Copper Pigments, Malachite and Verdigris: Making Tempera Paint

ERIC Educational Resources Information Center

Solomon, Sally D.; Rutkowsky, Susan A.; Mahon, Megan L.; Halpern, Erica M.

2011-01-01

Malachite and verdigris, two copper-based pigments, are synthesized in this experiment intended for use in a general chemistry laboratory. The preparation of egg tempera paint from malachite is also described. All procedures can be done with a magnetic stir plate, standard glassware present in any first-year laboratory, and household chemicals.…

Weld Repair of Thin Aluminum Sheet

NASA Technical Reports Server (NTRS)

Beuyukian, C. S.; Mitchell, M. J.

1986-01-01

Weld repairing of thin aluminum sheets now possible, using niobium shield and copper heat sinks. Refractory niobium shield protects aluminum adjacent to hole, while copper heat sinks help conduct heat away from repair site. Technique limits tungsten/inert-gas (TIG) welding bombardment zone to melt area, leaving surrounding areas around weld unaffected. Used successfully to repair aluminum cold plates on Space Shuttle, Commercial applications, especially in sealing fractures, dents, and holes in thin aluminum face sheets or clad brazing sheet in cold plates, heat exchangers, coolers, and Solar panels. While particularly suited to thin aluminum sheet, this process also used in thicker aluminum material to prevent surface damage near weld area.

Modeling and Implementation of Solder-activated Joints for Single Actuator, Centimeter-Scale Robotic Mechanisms

DTIC Science & Technology

2010-06-01

Modulus Ratio Annealed Copper 1.0 1.0 1.0 6066 Aluminum 0.63 2.48 3.96 High-Temp Nitinol 0.68 16.8 24.7 1095 Spring Steel 1.82 16.5 9.08 106 5.2.2...were: copper, aluminum, Nitinol , and spring steel. The wetting ability of aluminum and Nitinol to lead-tin solders is poor. There are solders that have...32],[33]. Copper plating may be used to improve a material’s solderability. Nitinol and aluminum are not easily electroplated with copper. Steel and

Thermal conductance measurements of bolted copper joints for SuperCDMS

DOE PAGES

Schmitt, R. L.; Tatkowski, G.; Ruschman, M.; ...

2015-04-28

Joint thermal conductance testing has been undertaken for bolted copper to copper connections from 60 mK to 26 K. This testing was performed to validate an initial design basis for the SuperCDMS experiment, where a dilution refrigerator will be coupled to a cryostat via multiple bolted connections. Copper used during testing was either gold plated or passivated with citric acid to prevent surface oxidation. Finally, the results we obtained are well fit by a power law regression of joint thermal conductance to temperature and match well with data collected during a literature review.

Float processing of high-temperature complex silicate glasses and float baths used for same

NASA Technical Reports Server (NTRS)

Cooper, Reid Franklin (Inventor); Cook, Glen Bennett (Inventor)

2000-01-01

A float glass process for production of high melting temperature glasses utilizes a binary metal alloy bath having the combined properties of a low melting point, low reactivity with oxygen, low vapor pressure, and minimal reactivity with the silicate glasses being formed. The metal alloy of the float medium is exothermic with a solvent metal that does not readily form an oxide. The vapor pressure of both components in the alloy is low enough to prevent deleterious vapor deposition, and there is minimal chemical and interdiffusive interaction of either component with silicate glasses under the float processing conditions. Alloys having the desired combination of properties include compositions in which gold, silver or copper is the solvent metal and silicon, germanium or tin is the solute, preferably in eutectic or near-eutectic compositions.

Libbey-Owens-Ford solar collector static load test

NASA Technical Reports Server (NTRS)

1978-01-01

The test article is a flat plate solar collector that uses liquid as the heat transfer medium. The absorber plate is copper and has a double tempered glass cover. Test requirements and procedures are described and results are presented in a table. Results demonstrate that the collector performed satisfactorily.

Thermal treatment and mechanical properties of aluminum-2021

NASA Technical Reports Server (NTRS)

Brennecke, M. W.

1970-01-01

Mechanical properties, after thermal treatments, are summarized for sheet and plate of copper-rich, high-strength, heat-treatable aluminum-2021. The alloy is quench sensitive, quench rate and variations in aging affect corrosion behavior. Aging effects on yield strength, tensile strength, and elongation of sheet and plate are compared.

Pretinning Nickel-Plated Wire Shields

NASA Technical Reports Server (NTRS)

Igawa, J. A.

1985-01-01

Nickel-plated copper shielding for wires pretinned for subsequent soldering with help of activated rosin flux. Shield cut at point 0.25 to 0.375 in. (6 to 10 mm) from cut end of outer jacket. Loosened end of shield straightened and pulled toward cut end. Insulation of inner wires kept intact during pretinning.

Bitter-type toroidal field magnet for zephyr

DOE Office of Scientific and Technical Information (OSTI.GOV)

Nathrath, N.; Keinath, W.; Kobusch, W.

1981-09-01

A feasibility study concerning stress computations, design and material technology of a Bitter-type magnet for the ZEPHYR project conducted in West Germany is reported. The big overall dimensions of the magnet (6.50 m diam 2.80 m high), access for diagnostics and neutral injection (16 ports), the possibility of remote handling of activated parts and high forces form the main requirements for design and material. A design with 16 identical modules (coils) was chosen, each coil consisting of 16 Bitter plates, plate housings and one diagnostic/neutral injection wedge. The structural parts are connected by bolts and form the bending stiff structuremore » of the magnet. The most critical area of the magnet is the inner wedge-shaped part of the coils (''throat area'') with extremely high tension, compression and shear stress values, to which temperature effects contribute heavily. Steel-copper compounds are found to be the best Bitter-plate materials. Copper-plating austenitic steel can be done galvanically or by explosive techniques. Cold-worked austenitic steels fulfil the requirements in the throat, in the flat-plate region milder steels can be used. Different plate concepts are being considered. Plasma-sprayed Al/sub 2/O/sub 3//TiO/sub 2/ and reinforced epoxy layers are provided as insulating materials in different magnet areas.« less

Metal deposition by electroless plating on polydopamine functionalized micro- and nanoparticles.

PubMed

Mondin, Giovanni; Wisser, Florian M; Leifert, Annika; Mohamed-Noriega, Nasser; Grothe, Julia; Dörfler, Susanne; Kaskel, Stefan

2013-12-01

A novel approach for the fabrication of metal coated micro- and nanoparticles by functionalization with a thin polydopamine layer followed by electroless plating is reported. The particles are initially coated with polydopamine via self-polymerization. The resulting polydopamine coated particles have a surface rich in catechols and amino groups, resulting in a high affinity toward metal ions. Thus, they provide an effective platform for selective electroless metal deposition without further activation and sensitization steps. The combination of a polydopamine-based functionalization with electroless plating ensures a simple, scalable, and cost-effective metal coating strategy. Silver-plated tungsten carbide microparticles, copper-plated tungsten carbide microparticles, and copper-plated alumina nanoparticles were successfully fabricated, showing also the high versatility of the method, since the polymerization of dopamine leads to the formation of an adherent polydopamine layer on the surface of particles of any material and size. The metal coated particles produced with this process are particularly well suited for the production of metal matrix composites, since the metal coating increases the wettability of the particles by the metal, promoting their integration within the matrix. Such composite materials are used in a variety of applications including electrical contacts, components for the automotive industries, magnets, and electromagnetic interference shielding. Copyright © 2013 Elsevier Inc. All rights reserved.

Effect of Cerium Oxide on Morphologies and Electrochemical Properties of Ni-W-P Coating on AZ91D Magnesium

NASA Astrophysics Data System (ADS)

Sun, Wan-chang; Xu, Jia-Min; Wang, Yuan; Guo, Fang; Jia, Zong-Wei

2017-12-01

AZ91D magnesium alloy substrate was first pretreated in a phosphoric acid to obtain a phosphate coating, and then, the electroless ternary Ni-W-P coating was deposited using a sulfate nickel bath. The morphologies of the Ni-W-P coating were observed by using scanning electron microscope, the deposition rate of the coating was examined with the method of gravimetric analysis, and the phase analysis was identified by x-ray diffractometer. Electrochemical property was tested by means of an electrochemical analyzer. The results indicated that the addition of an optimum concentration of CeO2 (cerium oxide) particles could evidently improve the deposition rate and the stability of the plating bath. However, it acted as an inhibiting effect as the concentration of CeO2 particles exceeded to 8 mg/L in the sulfate nickel bath. The results also revealed that the morphology of Ni-W-P coating became more smooth, compact and uniform with the increase in the concentrations of CeO2 particles in the bath, but the corrosion resistance decreased due to the precipitation of crystal phases (Ni3P, Ni4W, etc.) after heat treatment.

Integral window/photon beam position monitor and beam flux detectors for x-ray beams

DOEpatents

Shu, Deming; Kuzay, Tuncer M.

1995-01-01

A monitor/detector assembly in a synchrotron for either monitoring the position of a photon beam or detecting beam flux may additionally function as a vacuum barrier between the front end and downstream segment of the beamline in the synchrotron. A base flange of the monitor/detector assembly is formed of oxygen free copper with a central opening covered by a window foil that is fused thereon. The window foil is made of man-made materials, such as chemical vapor deposition diamond or cubic boron nitrate and in certain configurations includes a central opening through which the beams are transmitted. Sensors of low atomic number materials, such as aluminum or beryllium, are laid on the window foil. The configuration of the sensors on the window foil may be varied depending on the function to be performed. A contact plate of insulating material, such as aluminum oxide, is secured to the base flange and is thereby clamped against the sensor on the window foil. The sensor is coupled to external electronic signal processing devices via a gold or silver lead printed onto the contact plate and a copper post screw or alternatively via a copper screw and a copper spring that can be inserted through the contact plate and coupled to the sensors. In an alternate embodiment of the monitor/detector assembly, the sensors are sandwiched between the window foil of chemical vapor deposition diamond or cubic boron nitrate and a front foil made of similar material.

Fabrication and Characteristics of High Capacitance Al Thin Films Capacitor Using a Polymer Inhibitor Bath in Electroless Plating Process.

PubMed

Cho, Young-Lae; Lee, Jung-Woo; Lee, Chang-Hyoung; Choi, Hyung-Seon; Kim, Sung-Su; Song, Young Il; Park, Chan; Suh, Su-Jeong

2015-10-01

An aluminum (Al) thin film capacitor was fabricated for a high capacitance capacitor using electrochemical etching, barrier-type anodizing, and electroless Ni-P plating. In this study, we focused on the bottom-up filling of Ni-P electrodes on Al2O3/Al with etched tunnels. The Al tunnel pits were irregularly distributed on the Al foil, diameters were in the range of about 0.5~1 μm, the depth of the tunnel pits was approximately 35~40 μm, and the complex structure was made full filled hard metal. To control the plating rate, the experiment was performed by adding polyethyleneimine (PEI, C2H5N), a high molecular substance. PEI forms a cross-link at the etching tunnel inlet, playing the role of delaying the inlet plating. When the PEI solution bath was used after activation, the Ni-P layer was deposited selectively on the bottoms of the tunnels. The characteristics were analyzed by adding the PEI addition quantity rate of 100~600 mg/L into the DI water. The capacitance of the Ni-P/Al2O3 (650~700 nm)/Al film was measured at 1 kHz using an impedance/gain phase analyzer. For the plane film without etch tunnels the capacitance was 12.5 nF/cm2 and for the etch film with Ni-P bottom-up filling the capacitance was 92 nF/cm2. These results illustrate a remarkable maximization of capacitance for thin film metal capacitors.

Energy Efficiency of the Outotec® Ausmelt Process for Primary Copper Smelting

NASA Astrophysics Data System (ADS)

Wood, Jacob; Hoang, Joey; Hughes, Stephen

2017-03-01

The global, non-ferrous smelting industry has witnessed the continual development and evolution of processing technologies in a bid to reduce operating costs and improve the safety and environmental performance of processing plants. This is particularly true in the copper industry, which has seen a number of bath smelting technologies developed and implemented during the past 30 years. The Outotec® Ausmelt Top Submerged Lance Process is one such example, which has been widely adopted in the modernisation of copper processing facilities in China and Russia. Despite improvements in the energy efficiency of modern copper smelting and converting technologies, additional innovation and development is required to further reduce energy consumption, whilst still complying with stringent environmental regulations. In response to this challenge, the Ausmelt Process has undergone significant change and improvement over the course of its history, in an effort to improve its overall competitiveness, particularly with respect to energy efficiency and operating costs. This paper covers a number of recent advances to the technology and highlights the impacts of these developments in reducing energy consumptions for a range of different copper flowsheets. It also compares the energy efficiency of the Ausmelt Process against the Bottom Blown Smelting process, which has become widely adopted in China over the past 5-10 years.

The Effect of Cu Powder During Friction Stir Welding on Microstructure and Mechanical Properties of AA3003-H18

NASA Astrophysics Data System (ADS)

Abnar, B.; Kazeminezhad, M.; Kokabi, A. H.

2014-08-01

Friction stir welding (FSW) was used to join 3003-H18 non-heat-treatable aluminum alloy plates by adding copper powder. The copper powder was first added to the gap (0.1 and 0.2 mm) between two plates and then the FSW was performed. The specimens were joined at various rotational speeds of 800, 1000, and 1200 rpm at traveling speeds of 70 and 100 mm/min. The effects of rotational speed, second pass of FSW, and direction of second pass also were studied on copper particle distribution and formation of Al-Cu intermetallic compounds in the stir zone. The second pass of FSW was carried out in two ways; in line with the first pass direction (2F) and in the reverse direction of the first pass (FB). The microstructure, mechanical properties, and formation of intermetallic compounds type were investigated. In high copper powder compaction into the gap, large clusters were formed in the stir zone, while fine clusters and sound copper particles distribution were obtained in low powder compaction. The copper particle distribution and amount of Al-Cu intermetallic compounds were increased in the stir zone with increasing the rotational speed and applying the second pass. Al2Cu and AlCu intermetallic phases were formed in the stir zone and consequently the hardness was significantly increased. The copper particles and in situ intermetallic compounds were symmetrically distributed in both advancing and retreating sides of weld zone after FB passes. Thus, the wider area was reinforced by the intermetallic compounds. Also, the tensile test specimens tend to fracture from the coarse copper aggregation at the low rotational speeds. At high rotational speeds, the fracture locations are placed in HAZ and TMAZ.

Evolution of the Large Copper Smelter — 1800s to 2013

NASA Astrophysics Data System (ADS)

Mackey, P. J.

Over the course of Dr. Robertson's career, the ferrous and non-ferrous plants have seen enormous changes in technology and increases in plant capacity, essentially amounting to a "technological revolution". In iron and steel, the "mega" blast furnace of some 6,000 m3 working volume is now standard ( 10,000 tonnes (mt) of pig iron/day). Similar huge changes in process technology and plant size have occurred in the non-ferrous industry. As an example, the fuel-fired reverberatory furnace, once the mainstay of the copper industry, has disappeared — replaced by large capacity flash and bath smelting technologies. The energy consumption per unit mass of metal produced has also been reduced considerably. Our understanding of the thermodynamics and mechanisms of metallurgical reactions, a field to which Dr. Robertson has significantly contributed, has made great strides. This paper reviews these changes with particular reference to the copper smelting industry, providing also comments on expected future trends.

Multi-dimensional modeling of atmospheric copper-sulfidation corrosion on non-planar substrates.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Chen, Ken Shuang

2004-11-01

This report documents the author's efforts in the deterministic modeling of copper-sulfidation corrosion on non-planar substrates such as diodes and electrical connectors. A new framework based on Goma was developed for multi-dimensional modeling of atmospheric copper-sulfidation corrosion on non-planar substrates. In this framework, the moving sulfidation front is explicitly tracked by treating the finite-element mesh as a pseudo solid with an arbitrary Lagrangian-Eulerian formulation and repeatedly performing re-meshing using CUBIT and re-mapping using MAPVAR. Three one-dimensional studies were performed for verifying the framework in asymptotic regimes. Limited model validation was also carried out by comparing computed copper-sulfide thickness with experimentalmore » data. The framework was first demonstrated in modeling one-dimensional copper sulfidation with charge separation. It was found that both the thickness of the space-charge layers and the electrical potential at the sulfidation surface decrease rapidly as the Cu{sub 2}S layer thickens initially but eventually reach equilibrium values as Cu{sub 2}S layer becomes sufficiently thick; it was also found that electroneutrality is a reasonable approximation and that the electro-migration flux may be estimated by using the equilibrium potential difference between the sulfidation and annihilation surfaces when the Cu{sub 2}S layer is sufficiently thick. The framework was then employed to model copper sulfidation in the solid-state-diffusion controlled regime (i.e. stage II sulfidation) on a prototypical diode until a continuous Cu{sub 2}S film was formed on the diode surface. The framework was also applied to model copper sulfidation on an intermittent electrical contact between a gold-plated copper pin and gold-plated copper pad; the presence of Cu{sub 2}S was found to raise the effective electrical resistance drastically. Lastly, future research needs in modeling atmospheric copper sulfidation are discussed.« less

Morphology of gold and copper ion-plated coatings

NASA Technical Reports Server (NTRS)

Spalvins, T.

1978-01-01

Copper and gold films (0.2 to 2 microns thick) were ion plated onto polished 304-stainless-steel, glass, mica surfaces. These coatings were examined by SEM for defects in their morphological growth. Three types of defects were distinguished: nodular growth, abnormal or runaway growth, and spits. The cause for each type of defect was investigated. Nodular growth is due to inherent substrate microdefects, abnormal or runaway growth is due to external surface inclusions, and spits are due to nonuniform evaporation (ejection of droplets). All these defects induce stresses and produce porosity in the coatings and thus weaken their mechanical properties. During surface rubbing, large nodules are pulled out, leaving vacancies in the coatings.

Development of Surfaces Optically Suitable for Flat Solar Panels. [using a reflectometer which separately evaluates spectral and diffuse reflectivities of surfaces

NASA Technical Reports Server (NTRS)

1979-01-01

A reflectometer which can separately evaluate the spectral and diffuse reflectivities of surfaces is described. A phase locked detection system for the reflectometer is also described. A selective coating on aluminum potentially useful for flat plate solar collector applications is presented. The coating is composed of strongly bound copper oxide (divalent) and is formed by an etching process performed on an aluminum alloy with high copper content. Fabrication costs are expected to be small due to the one stop fabrication process. A number of conclusions gathered from the literature as to the required optical properties of flat plate solar collectors are discussed.

Characterization of Crystallographic Structure and Internal Stress of Chromium Coatings Plated under Current Interruptions.

DTIC Science & Technology

1983-09-01

phase has a preferred orientation as most other electrodeposits, this peak found off the equatorial direction provided a way of measuring...40 (S)IoA) 1IliN3i0d , STANDARD HARD CHROM (KiC) INTERRUPTED PLATED CHROME (tC) -4’? 1001 1000X KC Chrome IC Chrome Bath Temperature *C 55 55 Current...COMMANDER ATTN: DRSNC- LC (D) I US ARMY TANK-AUTMV COWD DRSMC-LCE(D) 1 ATTN: DRSTA-RC DRSC-LCM(D) (BLDG 321) 1 WARREN, MI 48090 DRSMC- LCS (D) 1 DRSNC-LCU

Long-Term Effects of Soldering By-Products on Nickel-Coated Copper Wire

NASA Technical Reports Server (NTRS)

Rolin, T. D.; Hodge, R. E.

2008-01-01

An analysis of thirty-year-old, down graded flight cables was conducted to determine the makeup of a green material on the surface of the shielded wire near soldered areas and to ascertain if the green material had corroded the nickel-coated copper wire. Two likely candidates were possible due to the handling and environments to which these cables were exposed. The flux used to solder the cables is known to contain abietic acid, a carboxylic acid found in many pine rosins used for the soldering process. The resulting material copper abietate is green in color and is formed during the application of heat during soldering operations. Copper (II) chloride, which is also green in color is known to contaminate flight parts and is corrosive. Data is presented that shows the material is copper abietate, not copper (II) chloride, and more importantly that the abietate does not aggressively attack nickel-plated copper wire.

Automated Chromium Plating Line for Gun Barrels

DTIC Science & Technology

1979-09-01

consistent pretreatments and bath dwell times. Some of the advantages of automated processing include increased productivity (average of 20^) due to...when automated processing procedures’ are used. The current method of applying chromium electrodeposits to gun tubes is a manual, batch operation...currently practiced with rotary swaged gun tubes would substantially reduce the difficulties in automated processing . RECOMMENDATIONS

Multi-phase structures of boron-doped copper tin sulfide nanoparticles synthesized by chemical bath deposition for optoelectronic devices

NASA Astrophysics Data System (ADS)

Rakspun, Jariya; Kantip, Nathakan; Vailikhit, Veeramol; Choopun, Supab; Tubtimtae, Auttasit

2018-04-01

We investigated the influence of boron doping on the structural, optical, and electrical properties of copper tin sulfide (CTS) nanoparticles coated on a WO3 surface and synthesized using chemical bath deposition. Boron doping at concentrations of 0.5, 1.0, 1.5, and 2.0 wt% was investigated. The X-ray diffraction pattern of CTS showed the presence of monoclinic Cu2Sn3S7, cubic Cu2SnS3, and orthorhombic Cu4SnS4. Boron doping influenced the preferred orientation of the nanoparticles for all phase structures and produced a lattice strain effect and changes in the dislocation density. Increasing the concentration of boron in CTS from 0.5 wt% to 2.0 wt% reduced the band gap for all phases of CTS from 1.46 to 1.29 eV and reduced the optical transmittance. Optical constants, such as the refractive index, extinction coefficient, and dissipation factor, were also obtained for B-doped CTS. The dispersion behavior of the refractive index was investigated in terms of a single oscillator model and the physical parameters were determined. Fourier transform infrared spectroscopy confirmed the successful synthesis of CTS nanoparticles. Cyclic voltammetry indicated that optimum boron doping (<1.5 wt% for all phases) resulted in desirable p-n junction behavior for optoelectronic applications.

Chemical bath deposition of Cu{sub 3}BiS{sub 3} thin films

DOE Office of Scientific and Technical Information (OSTI.GOV)

Deshmukh, S.G., E-mail: deshmukhpradyumn@gmail.com; Vipul, Kheraj, E-mail: vipulkheraj@gmail.com; Panchal, A.K.

2016-05-06

First time, copper bismuth sulfide (Cu{sub 3}BiS{sub 3}) thin films were synthesized on the glass substrate using simple, low-cost chemical bath deposition (CBD) technique. The synthesized parameters such as temperature of bath, pH and concentration of precursors were optimized for the deposition of uniform, well adherent Cu{sub 3}BiS{sub 3} thin films. The optical, surface morphology and structural properties of the Cu{sub 3}BiS{sub 3} thin films were studied using UV-VIS-NIR spectra, scanning electron microscopy (SEM) and X-ray diffraction (XRD). The as- synthesized Cu{sub 3}BiS{sub 3} film exhibits a direct band gap 1.56 to 1.58 eV having absorption coefficient of the ordermore » of 10{sup 5} cm{sup −1}. The XRD declares the amorphous nature of the films. SEM images shows films were composed of close-packed fine spherical nanoparticles of 70-80 nm in diameter. The chemical composition of the film was almost stoichiometric. The optical study indicates that the Cu{sub 3}BiS{sub 3} films can be applied as an absorber layer for thin film solar cells.« less

Unusual behavior in magnesium-copper cluster matter produced by helium droplet mediated deposition

DOE Office of Scientific and Technical Information (OSTI.GOV)

Emery, S. B., E-mail: samuel.emery@navy.mil; Little, B. K.; Air Force Research Laboratory, Munitions Directorate, 2306 Perimeter Rd., Eglin AFB, Florida 32542

2015-02-28

We demonstrate the ability to produce core-shell nanoclusters of materials that typically undergo intermetallic reactions using helium droplet mediated deposition. Composite structures of magnesium and copper were produced by sequential condensation of metal vapors inside the 0.4 K helium droplet baths and then gently deposited onto a substrate for analysis. Upon deposition, the individual clusters, with diameters ∼5 nm, form a cluster material which was subsequently characterized using scanning and transmission electron microscopies. Results of this analysis reveal the following about the deposited cluster material: it is in the un-alloyed chemical state, it maintains a stable core-shell 5 nm structuremore » at sub-monolayer quantities, and it aggregates into unreacted structures of ∼75 nm during further deposition. Surprisingly, high angle annular dark field scanning transmission electron microscopy images revealed that the copper appears to displace the magnesium at the core of the composite cluster despite magnesium being the initially condensed species within the droplet. This phenomenon was studied further using preliminary density functional theory which revealed that copper atoms, when added sequentially to magnesium clusters, penetrate into the magnesium cores.« less

Soft X-ray absorption spectroscopy investigation of the surface chemistry and treatments of copper indium gallium diselenide (CIGS)

DOE PAGES

Schwartz, Craig; Nordlund, Dennis; Sokaras, Dimosthenis; ...

2017-02-01

The surface and near surface structure of copper-indium-gallium-selenide (CIGS) absorber layers is integral to the producing a high-quality photovoltaic junction. By using X-ray absorption spectroscopy (XAS) and monitoring multiple elemental absorption edges with both theory and experiment, we are able to identify several features of the surface of CIGS as a function of composition and surface treatments. The XAS data shows trends in the near surface region of oxygen, copper, indium and gallium species as the copper content is varied in the films. The oxygen surface species are also monitored through a series of experiments that systematically investigates the effectsmore » of water and various solutions of: ammonium hydroxide, cadmium sulfate, and thiourea. These being components of cadmium sulfide chemical bath deposition (CBD). Characteristics of the CBD are correlated with a restorative effect that produces as normalized, uniform surface chemistry as measured by XAS. This surface chemistry is found in CIGS solar cells with excellent power conversion efficiency (<19%). The results provide new insight for CIGS processing strategies that seek to replace CBD and/or cadmium sulfide.« less

Soft X-ray absorption spectroscopy investigation of the surface chemistry and treatments of copper indium gallium diselenide (CIGS)

DOE Office of Scientific and Technical Information (OSTI.GOV)

Schwartz, Craig; Nordlund, Dennis; Sokaras, Dimosthenis

The surface and near surface structure of copper-indium-gallium-selenide (CIGS) absorber layers is integral to the producing a high-quality photovoltaic junction. By using X-ray absorption spectroscopy (XAS) and monitoring multiple elemental absorption edges with both theory and experiment, we are able to identify several features of the surface of CIGS as a function of composition and surface treatments. The XAS data shows trends in the near surface region of oxygen, copper, indium and gallium species as the copper content is varied in the films. The oxygen surface species are also monitored through a series of experiments that systematically investigates the effectsmore » of water and various solutions of: ammonium hydroxide, cadmium sulfate, and thiourea. These being components of cadmium sulfide chemical bath deposition (CBD). Characteristics of the CBD are correlated with a restorative effect that produces as normalized, uniform surface chemistry as measured by XAS. This surface chemistry is found in CIGS solar cells with excellent power conversion efficiency (<19%). The results provide new insight for CIGS processing strategies that seek to replace CBD and/or cadmium sulfide.« less

Metal Alloy ICF Capsules Created by Electrodeposition

DOE Office of Scientific and Technical Information (OSTI.GOV)

Horwood, Corie; Stadermann, Michael; Bunn, Thomas L.

Electrochemical deposition is an attractive alternative to physical vapor deposition and micromachining to produce metal capsules for inertial confinement fusion (ICF). Electrochemical deposition (also referred to as electrodeposition or plating) is expected to produce full-density metal capsules without seams or inclusions of unwanted atomic constituents, the current shortcomings of micromachine and physical vapor deposition, respectively. In this paper, we discuss new cathode designs that allow for the rapid electrodeposition of gold and copper alloys on spherical mandrels by making transient contact with the constantly moving spheres. Electrodeposition of pure gold, copper, platinum, and alloys of gold-copper and gold-silver are demonstrated,more » with nonporous coatings of >40 µm achieved in only a few hours of plating. The surface roughness of the spheres after electrodeposition is comparable to the starting mandrel, and the coatings appear to be fully dense with no inclusions. A detailed understanding of the electrodeposition conditions that result in different alloy compositions and plating rates will allow for the electrodeposition of graded alloys on spheres in the near future. Finally, this report on the electrodeposition of metals on spherical mandrels is an important first step toward the fabrication of graded-density metal capsules for ICF experiments at the National Ignition Facility.« less

Metal Alloy ICF Capsules Created by Electrodeposition

DOE PAGES

Horwood, Corie; Stadermann, Michael; Bunn, Thomas L.

2017-12-04

Electrochemical deposition is an attractive alternative to physical vapor deposition and micromachining to produce metal capsules for inertial confinement fusion (ICF). Electrochemical deposition (also referred to as electrodeposition or plating) is expected to produce full-density metal capsules without seams or inclusions of unwanted atomic constituents, the current shortcomings of micromachine and physical vapor deposition, respectively. In this paper, we discuss new cathode designs that allow for the rapid electrodeposition of gold and copper alloys on spherical mandrels by making transient contact with the constantly moving spheres. Electrodeposition of pure gold, copper, platinum, and alloys of gold-copper and gold-silver are demonstrated,more » with nonporous coatings of >40 µm achieved in only a few hours of plating. The surface roughness of the spheres after electrodeposition is comparable to the starting mandrel, and the coatings appear to be fully dense with no inclusions. A detailed understanding of the electrodeposition conditions that result in different alloy compositions and plating rates will allow for the electrodeposition of graded alloys on spheres in the near future. Finally, this report on the electrodeposition of metals on spherical mandrels is an important first step toward the fabrication of graded-density metal capsules for ICF experiments at the National Ignition Facility.« less

Activity of two strobilurin fungicides against three species of decay fungi in agar plate tests

Treesearch

Juliet D. Tang; Tina Ciaramitaro; Maria Tomaso-Peterson; Susan V. Diehl

2017-01-01

The objective of this study was to examine the toxicity of strobilurin fungicides against wood decay fungi in order to assess their potential to act as a co-biocide for copper-based wood protection. Two strobilurin fungicides, Heritage (50% azoxystrobin active ingredient) and Insignia (20% pyraclostrobin active ingredients), and copper sulfate pentahydrate were tested...

Design and Fabrication of Smart Diapers with Antibacterial Yarn

PubMed Central

Lin, Jia-Horng; Shiu, Bing-Chiuan; Lou, Ching-Wen

2017-01-01

In this study, intelligent eco-diapers are made by combining antibacterial yarns coated with quaternary ammonium salts with conductive yarns to improve caretaking for urinary incontinence. The combination of conductive yarns and sensors can detect the moisture content in eco-diapers, and an alarm is sent when moisture is significant. A wireless module is used to send detected signals to a smartphone or tablet PC via the Internet. This concept is used for a scenario in which nurses do not randomly check on patients in a long-term care institution. When used offline, eco-diapers can send caregivers an alarm for the need to change diapers via cell phones. The diameters of the copper and silver-plated copper fibers are 0.08 and 0.10 mm, respectively. Cotton yarns are twisted with copper and silver-plated copper fibers to form the conductive yarns, which are 0.12 mm in diameter. Moreover, 30-count cotton and 150 D nylon yarns are coated with quaternary ammonium salt via dyeing and finishing processes to form antibacterial yarns. In the current study, intelligent eco-diapers are tested for their electrical and antibacterial properties as specified by AATC and JISL test standards. PMID:29065646

Effects of Metal Ions on the Aluminum Electrodeposition from Ionic Liquids

NASA Astrophysics Data System (ADS)

Caporali, Stefano; Martinuzzi, Stefano M.; Von Czarnecki, Peter; Schubert, Thomas J. S.; Bardi, Ugo

2017-02-01

In this study, we report on the effects of three common transition metal ions, i.e., Ni2+, Cu2+ and Fe3+ on the electrodeposition of aluminum from a chloroaluminate ionic liquid, evaluated by means of electrochemical and morphological investigation. Aiming at the determination of the morphological and chemical effects on the aluminum coatings, variable amounts of ions were introduced into the electroplating bath. Thick (about 20 μm) Al coatings were obtained by direct deposition (galvanostatic, 10 mA cm2, 2 h) on brass or carbon steel substrates (10 mm diameter disks), and their morphology was examined via rugosimetry, optical and electron microscopy. The chemical composition of the deposits was provided by EDX analysis. Nickel and iron resulted to have only moderate effects on the coatings properties, but copper affected the process even in tiny amounts being detected in the deposits for bath content as low as 10 ppm.

Effect of Injection Molding Melt Temperatures on PLGA Craniofacial Plate Properties during In Vitro Degradation.

PubMed

de Melo, Liliane Pimenta; Salmoria, Gean Vitor; Fancello, Eduardo Alberto; Roesler, Carlos Rodrigo de Mello

2017-01-01

The purpose of this article is to present mechanical and physicochemical properties during in vitro degradation of PLGA material as craniofacial plates based on different values of injection molded temperatures. Injection molded plates were submitted to in vitro degradation in a thermostat bath at 37 ± 1°C by 16 weeks. The material was removed after 15, 30, 60, and 120 days; then bending stiffness, crystallinity, molecular weights, and viscoelasticity were studied. A significant decrease of molecular weight and mechanical properties over time and a difference in FT-IR after 60 days showed faster degradation of the material in the geometry studied. DSC analysis confirmed that the crystallization occurred, especially in higher melt temperature condition. DMA analysis suggests a greater contribution of the viscous component of higher temperature than lower temperature in thermomechanical behavior. The results suggest that physical-mechanical properties of PLGA plates among degradation differ per injection molding temperatures.

Integral resistors and capacitors for mixed-signal packages using electroless plating and polymer-ceramic nanocomposites

NASA Astrophysics Data System (ADS)

Chahal, Premjeet

In this work, new approaches to achieving integral resistors and capacitors on large area substrates at low temperatures in a high density wiring (HDW) environment using non-vacuum deposition techniques are introduced. This includes the use of polymer-ceramic nanocomposites for integral capacitors and electroless plating for integral resistors. From the literature review it is believed that resistors in the range of 5--50 ohm/square and capacitors in the range of 1--20 nF/cm2 can satisfy most of the mixed-signal application needs. The proposed materials can satisfy this need as demonstrated in this work. Several test vehicles were fabricated and measured to characterize the material properties, and demonstrate conventional and novel circuits for mixed-signal applications. To begin with, several polymer-ceramic combinations were analyzed under varying conditions to gain a fundamental understanding of the material system. Experimental advances have been made to achieve high dielectric constant values for both epoxy-ceramic and polyimide-ceramic systems. These material systems in general can satisfy specific capacitances in the range of 1--22 nF/cm2. These materials were found to be stable into the GHz range and have low loss-tangent. For electroless resistors, several plating baths were studied and a combination of Ni-P/Ni-W-P was found to produce the best results. Uniform plating was achieved through better nucleation of PdCl2 catalyst through the use of organosilane surface treatment. The Ni-P/Ni-W-P films produced sheet resistance in the range of 5--50 ohm/square and TCR below 50 ppm/°C. The material is stable into the GHz range. Upon optimizing the electrical properties and processing of capacitors and resistors, several test vehicles were fabricated to demonstrate some conventional and novel passive structures for RF and mixed-signal applications (e.g., filters, delay lines, etc.). Some of the structures were modeled using MDS and PSPICE and a good correlation between measured and modeled results were obtained. Capacitors on large area PWB substrates using meniscus coating are also demonstrated with a typical capacitance of 10 nF/cm2. The yield of the capacitor structures is found to be affected by the surface roughness of the bottom copper electrode. Resistors have been demonstrated on 6″ x 6″ substrates using a simple set-up.

Experimental Investigation of Mechanical Properties of Welded Corten Steel A588 Grade Plate Using ER70S - 6 Filler Material for Construction Application

NASA Astrophysics Data System (ADS)

Deepak, J. R.; Bupesh Raja, V. K.; Janardhan Guptha, Mittapalli; Durga Prasad, Palaparthi Hari; Sriram, V.

2017-05-01

ASTM A588 Grade A steel plate is a high strength, low alloy structural steel with 0.19 % of carbon content. When exposed to the atmosphere, A588 Grade A is suitable for construction in the bare (paint - free) condition. The main problems are lack of fusion, lack of penetration and corrosion on heat affected zone. In this research work Corten ASTM A588 Grade steel of 3mm thickness is electroplated with copper and then both raw and copper electroplated are welded by GMAW welding process with ER70S-6 as a filler material. The welded ASTM A588 is cut according to ASTM size for further testing of mechanical properties. Considering its welding strength after the process of electroplating, this research clearly states the metal can be utilized for better results in any given field. Here both the tensile and hardness are higher in copper electroplated welded when compare to raw welded.

Manipulator having thermally conductive rotary joint for transferring heat from a test specimen

DOEpatents

Haney, Steven J.; Stulen, Richard H.; Toly, Norman F.

1985-01-01

A manipulator for rotatably moving a test specimen in an ultra-high vacuum chamber includes a translational unit movable in three mutually perpendicular directions. A manipulator frame is rigidly secured to the translational unit for rotatably supporting a rotary shaft. A first copper disc is rigidly secured to an end of the rotary shaft for rotary movement within the vacuum chamber. A second copper disc is supported upon the first disc. The second disc receives a cryogenic cold head and does not rotate with the first disc. A sapphire plate is interposed between the first and second discs to prevent galling of the copper material while maintaining high thermal conductivity between the first and second discs. A spring is disposed on the shaft to urge the second disc toward the first disc and compressingly engage the interposed sapphire plate. A specimen mount is secured to the first disc for rotation within the vacuum chamber. The specimen maintains high thermal conductivity with the second disc receiving the cryogenic transfer line.

Development of low cost contacts to silicon solar cells

NASA Technical Reports Server (NTRS)

Tanner, D. P.; Iles, P. A.

1980-01-01

A copper based contact system using plated Pd-Cr-Cu was developed. Good cells were made but cells degraded under low temperature (300 C) heat treatments. The degradation was identified as copper migration into the cells junction region. A paper study was conducted to find a proper barrier to the copper migration problem. Nickel was identified as the best candidate barrier and this was verified in a heat treatment study using evaporated metal layers. An electroless nickel solution was substituted for the electroless chromium solution in the original process.

Standardized performance tests of collectors of solar thermal energy - A flat-plate copper collector with parallel mylar striping

NASA Technical Reports Server (NTRS)

Johnson, S. M.

1976-01-01

Basic test results are reported for a flat plate solar collector whose performance was determined in a solar simulator. The collector was tested over ranges of inlet temperatures, fluxes and one coolant flow rate. Collector efficiency is correlated in terms of inlet temperature and flux level.

All-metal, compact heat exchanger for space cryocoolers

NASA Technical Reports Server (NTRS)

Swift, Walter L.; Valenzuela, Javier; Sixsmith, Herbert

1990-01-01

This report describes the development of a high performance, all metal compact heat exchanger. The device is designed for use in a reverse Brayton cryogenic cooler which provides five watts of refrigeration at 70 K. The heat exchanger consists of a stainless steel tube concentrically assembled within a second stainless steel tube. Approximately 300 pairs of slotted copper disks and matching annular slotted copper plates are positioned along the centerline axis of the concentric tubes. Each of the disks and plates has approximately 1200 precise slots machined by means of a special electric discharge process. Positioning of the disk and plate pairs is accomplished by means of dimples in the surface of the tubes. Mechanical and thermal connections between the tubes and plate/disk pairs are made by solder joints. The heat exchanger assembly is 9 cm in diameter by 50 cm in length and has a mass of 10 kg. The predicted thermal effectiveness is greater than 0.985 at design conditions. Pressure loss at design conditions is less than 5 kPa in both fluid passages. Tests were performed on a subassembly of plates integrally soldered to two end headers. The measured thermal effectiveness of the test article exceeded predicted levels. Pressure losses were negligibly higher than predictions.

Hydrodynamic modelling of the influence of stormwater and combined sewer overflows on receiving water quality: Benzo(a)pyrene and copper risks to recreational water.

PubMed

Björklund, Karin; Bondelind, Mia; Karlsson, Anna; Karlsson, Dick; Sokolova, Ekaterina

2018-02-01

The risk from chemical substances in surface waters is often increased during wet weather, due to surface runoff, combined sewer overflows (CSOs) and erosion of contaminated land. There are strong incentives to improve the quality of surface waters affected by human activities, not only from ecotoxicity and ecosystem health perspectives, but also for drinking water and recreational purposes. The aim of this study is to investigate the influence of urban stormwater discharges and CSOs on receiving water in the context of chemical health risks and recreational water quality. Transport of copper (Cu) and benzo[a]pyrene (BaP) in the Göta River (Sweden) was simulated using a hydrodynamic model. Within the 16 km modelled section, 35 CSO and 16 urban stormwater point discharges, as well as the effluent from a major wastewater treatment plant, were included. Pollutant concentrations in the river were simulated for two rain events and investigated at 13 suggested bathing sites. The simulations indicate that water quality guideline values for Cu are exceeded at several sites, and that stormwater discharges generally give rise to higher Cu and BaP concentrations than CSOs. Due to the location of point discharges and the river current inhibiting lateral mixing, the north shore of the river is better suited for bathing. Peak concentrations have a short duration; increased concentrations of the pollutants may however be present for several days after a rain event. Monitoring of river water quality indicates that simulated Cu and BaP concentrations are in the same order of magnitude as measured concentrations. It is concluded that hydrodynamic modelling is a useful tool for identifying suitable bathing sites in urban surface waters and areas of concern where mitigation measures should be implemented to improve water quality. Copyright © 2017 Elsevier Ltd. All rights reserved.

Removal of brownish-black tarnish on silver-copper alloy objects with sodium glycinate

NASA Astrophysics Data System (ADS)

de Figueiredo, João Cura D.'Ars; Asevedo, Samara Santos; Barbosa, João Henrique Ribeiro

2014-10-01

This article has the principal aim of presenting a new method of chemical cleaning of tarnished silver-copper alloy objects. The chemical cleaning must be harmless to the health, selective to tarnish removal, and easy to use. Sodium glycinate was selected for the study. The reactions of sodium glycinate with tarnish and the silver-copper alloy were evaluated. Products of the reaction, the lixiviated material, and the esthetics of silver-copper alloy coins (used as prototypes) were studied to evaluate if the proposed method can be applied to the cleaning of silver objects. Silver-copper alloys can be deteriorated through a uniform and superficial corrosion process that produces brownish-black tarnish. This tarnish alters the esthetic of the object. The cleaning of artistic and archeological objects requires more caution than regular cleaning, and it must take into account the procedures for the conservation and restoration of cultural heritage. There are different methods for cleaning silver-copper alloy objects, chemical cleaning is one of them. We studied two chemical cleaning methods that use sodium glycinate and sodium acetylglycinate solutions. Silver-copper alloy coins were artificially corroded in a basic thiourea solution and immersed in solutions of sodium glycinate and sodium acetylglycinate. After immersion, optical microscopy and scanning electron microscopy of the surfaces were studied. The sodium glycinate solution was shown to be very efficient in removing the brownish-black tarnish. Absorption spectroscopy measured the percentage of silver and copper lixiviated in immersion baths, and very small quantities of these metals were detected. Infrared absorption spectroscopy and X-ray fluorescence characterized the obtained products. The greater efficiency of the sodium glycinate solution compared to the sodium acetylglycinate solution was explained by chelation and Hard-Soft Acid-Base Theory with the aid of quantum chemical calculations.

Chemically modified Moringa oleifera seed husks as low cost adsorbent for removal of copper from aqueous solution

NASA Astrophysics Data System (ADS)

Ghafar, Faridah; Mohtar, Aminullah; Sapawe, Norzahir; Hadi, Norulakmal Nor; Salleh, Marmy Roshaidah Mohd

2017-12-01

Moringa oleifera husks (MOH) are an agricultural byproduct that may have potential as adsorbent for removal of heavy metal ions in wastewater such as copper (Cu2+). The release of Cu2+ to the environment by the mining and electroplating industries cause a major problem because it is toxic and can cause liver and kidney problems. Hence, it is important to remove copper before the wastewater can be discharged to the environment. In order to increase the adsorption capacity, the MOH was chemically modified using citric acid. The raw and modified MOH were analyzed using Fourier Transform Infra-Red (FTIR) for identification of functional groups present at the adsorbent surface. The adsorption study was carried out using the batch technique in water bath shaker investigating different parameters; adsorbent dosage (30 - 70 g/L), initial concentration of copper (30 - 150 mg/L), contact time (2 - 90 min), temperature (27 - 60 °C) at constant agitation of 100 rpm. The concentrations of copper in aqueous solution before and after the adsorption process was analyzed using Atomic Absorption Spectrum (AAS). The highest percentage removal of copper was found at 10g/L of adsorbent dosage with 30 mg/L of initial concentration and temperature 30 °C. It was also observed that the adsorption of copper by MOH was approaching to equilibrium at 60 min of reaction time. From the FTIR analysis, it was found that the MOH contains hydroxyl, carboxyl and amine groups. The high adsorption capacity of modified MOH to remove copper from aqueous solution makes it preferable and attractive alternative to commercial adsorbent.

Concept Feasibility Report for Electroplating Zirconium onto Uranium Foil - Year 2

DOE Office of Scientific and Technical Information (OSTI.GOV)

Coffey, Greg W.; Meinhardt, Kerry D.; Joshi, Vineet V.

2015-03-01

The Fuel Fabrication Capability within the U.S. High Performance Research Reactor Conversion Program is funded through the National Nuclear Security Administration (NNSA) NA-26 (Office of Material Management and Minimization). An investigation was commissioned to determine the feasibility of using electroplating techniques to apply a coating of zirconium onto depleted uranium/molybdenum alloy (U-10Mo). Electroplating would provide an alternative method to the existing process of hot roll-bonding zirconium foil onto the U-10Mo fuel foil during the fabrication of fuel elements for high-performance research reactors. The objective of this research was to develop a reproducible and scalable plating process that will produce amore » uniform, 25 μm thick zirconium metal coating on U-10Mo foil. In previous work, Pacific Northwest National Laboratory (PNNL) established a molten salt electroplating apparatus and protocol to plate zirconium metal onto molybdenum foil (Coffey 2015). During this second year of the research, PNNL furthered this work by moving to the U-10Mo alloy system (90 percent uranium:10 percent molybdenum). The original plating apparatus was disassembled and re-assembled in a laboratory capable of handling low-level radioactive materials. Initially, the work followed the previous year’s approach, and the salt bath composition was targeted at the eutectic composition (LiF:NaF:ZrF4 = 26:37:37 mol%). Early results indicated that the formation of uranium fluoride compounds would be problematic. Other salt bath compositions were investigated in order to eliminate the uranium fluoride production (LiF:NaF = 61:39 mol% and LiF:NaF:KF = 46.5:11.5:42 mol% ). Zirconium metal was used as the crucible for the molten salt. Three plating methods were used—isopotential, galvano static, and pulsed plating. The molten salt method for zirconium metal application provided high-quality plating on molybdenum in PNNL’s previous work. A key advantage of this approach is that plating can be performed under conditions that would greatly reduce the quantity of intermetallics that form at the interface between the zirconium and U-10Mo; unlike roll bonding, the molten salt plating approach would allow for complete coverage of the U-10Mo foil with zirconium. When utilizing the experimental parameters developed for zirconium plating onto molybdenum, a uranium fluoride reaction product was formed at the Zr/U-10Mo interface. By controlling the initial plating potential, the uranium fluoride could be prevented; however, the targeted zirconium thickness (25 ±12.5 μm) could not be achieved while maintaining 100% coverage.« less

Development of lightweight aluminum hollowcore solar cell array technology

NASA Technical Reports Server (NTRS)

Carlson, J. A.

1971-01-01

A baseline configuration for a three section folding array, with retraction capability, was developed which would utilize electroformed aluminum hollowcore substrates and beryllium frames. The three section array was not fabricated because of difficulties with impurities in the aluminum electroforming bath. A procedure was developed for etching the copper mandrel from virtually any size of aluminum hollowcore panel in approximately one hour. Procedures were developed for analyzing the content of peroxide, water, total aluminum, and lithium-aluminum-hydride in an aluminum electroforming solution.

Fabrication of durable copper plating superhydrophobic surface with improved corrosion resistance and oil-water separation properties

NASA Astrophysics Data System (ADS)

Zhao, Yichao; Xiao, Xinyan; Ye, Zhihao; Ji, Qiang; Xie, Wei

2018-02-01

A mechanical durable superhydrophobic copper-plated stainless steel mesh was successfully fabricated by an electrodeposition process and 1-octadecanethiol modification. The as-prepared superhydrophobic mesh displays water contact angle of 153° and shows excellent anti-corrosion and water-oil separation properties in the condition of 0.1 A/cm2 current density for 35 s. In comparison with bare stainless steel mesh, the corrosion current of the as-prepared superhydrophobic mesh is close to 1/6 of the former. Meanwhile, the as-prepared superhydrophobic mesh could continuously separate oil from oil-water mixtures. The separation efficiency of continuous separation is as high as 96% and shows less than 1% decrease after ten cycles.

ABSTRACTS OF RESEARCH REPORTS.

DTIC Science & Technology

Determination of the effect of cavity liner on retention of dental castings cemented in place with oxyphosphate cement; Determination of optimum pouring...on silver plating rubber base impression material in a high-speed commercial bath; Evaluation of the deterioration of carbon steel dental instruments...repairs; Evaluation of the sterilization of air-driven handpieces ; Incidence of accessory root canals in molars; Microscopic comparison of the ability of

Bacteria cut by 'up to 95%' in copper trial.

PubMed

2008-11-01

The first results from an 18-month trial at Birmingham's Selly Oak Hospital, which has seen a range of items in one ward, including taps, door handles, sink fittings, push plates and light switches made from "conventional" plastic and stainless steel materials substituted with copper replacements, has proven beyond doubt the metal's effectiveness in destroying pathogens in a clinical environment. Health Estate Journal reports.

Polyimide-glass multilayer printed wiring boards

NASA Astrophysics Data System (ADS)

Lula, J. W.

1984-07-01

Multilayer printed wiring boards (PWBs) from a polyimide/glass reinforced copper clad laminate and prepreg were manufactured. A lamination cycle and innerlayer copper surface treatment that gave satisfactory delamination resistance at soldering temperatures were developed. When compared to similar epoxy/glass multilayer PWBs, the polyimide PWBs had higher thermal stability, greater resistance to raised lands, fewer plating voids, less outgassing, and adhesion that was equivalent to urethane foam encapsulants.

iMAST Quarterly, Number 3, 2000

DTIC Science & Technology

2000-01-01

components which depend on evaporating unit capabilities. There are three components (EB-gun, water cooled copper crucible and vacuum chamber) in the EB-PVD...Ion Implantation and Ion Plating electromagnetic deflected through 180 or 2700. Similarly, evaporant material is placed in a water-cooled copper ... crucible , which could be either pocket type for small quantity evaporation application or continuous ingot feeding through the crucible for larger quantity

From micelles to bicelles: Effect of the membrane on particulate methane monooxygenase activity.

PubMed

Ro, Soo Y; Ross, Matthew O; Deng, Yue Wen; Batelu, Sharon; Lawton, Thomas J; Hurley, Joseph D; Stemmler, Timothy L; Hoffman, Brian M; Rosenzweig, Amy C

2018-05-08

Particulate methane monooxygenase (pMMO) is a copper-dependent, integral membrane metalloenzyme that converts methane to methanol in methanotrophic bacteria. Studies of isolated pMMO have been hindered by loss of enzymatic activity upon its removal from the native membrane. To characterize pMMO in a membrane-like environment, we reconstituted pMMOs from Methylococcus ( Mcc. ) capsulatus (Bath) and Methylomicrobium ( Mm. ) alcaliphilum 20Z into bicelles. Reconstitution into bicelles recovers methane oxidation activity lost upon detergent solubilization and purification without substantial alterations to copper content or copper electronic structure as observed by electron paramagnetic resonance (EPR) spectroscopy.. These findings suggest that loss of pMMO activity upon isolation is due to removal from the membranes rather than caused by loss of the catalytic copper ions. A 2.7 Å resolution crystal structure of pMMO from Mm. alcaliphilum 20Z revealed a mononuclear copper center in the PmoB subunit and indicated that the transmembrane PmoC subunit may be conformationally flexible. Finally, results from extended X-ray absorption fine structure (EXAFS) analysis of pMMO from Mm. alcaliphilum 20Z were consistent with the observed monocopper center in the PmoB subunit. These results underscore the importance of studying membrane proteins in a membrane-like environment, and provide valuable insight into pMMO function. Published under license by The American Society for Biochemistry and Molecular Biology, Inc.

Influence of nanomodification additives on the properties of multilayer composite coating obtained in laser surfacing

NASA Astrophysics Data System (ADS)

Cherepanov, A. N.; Orishich, A. M.; Ovcharenko, V. E.; Malikov, A. G.; Drozdov, V. O.; Pshenichnikov, A. P.

2017-10-01

The paper presents the results of numerical and experimental studies of the process of obtaining a permanent joint of two plates of heterogeneous metals that cannot be welded in the usual way: alloy Grade 4 and steel AISI 321 using a laser beam and an intermediate composite insert. The composite insert was obtained by explosion welding of four thin plates of titanium (Grade 4), niobium, copper, and steel (AISI 321). The insert was placed between the welded plates of titanium and steel, and the steel plate was welded with the steel part of the insert, and the titanium plate was welded with the titanium part of the insert. The plates were welded using a CO2 laser. The connection of metals with the help of explosion is carried out without their melting, so the formation of the brittle intermetallics does not occur in most cases. This ensures the greatest strength of the joints as compared to the joints obtained by other welding methods. To analyze the distribution of thermal fields in the composite insert and welded plates, a numerical study was conducted of the laser welding of steel and titanium plates with the corresponding parts of the insert. The purpose of the study was to determine the rational parameters of welding (laser beam power, speed of its movement, size and position of the focal spot), at which there was no complete melting of the steel and titanium parts of the insert during through penetration of the welded plates. The experimental part of the work is devoted to analysis of formation of the internal boundaries and microstructure of the composite insert and the strength of the permanent joint. It is shown that as a result of the explosion welding, weld seams of different wavelike configuration are formed. The most pronounced wavelike boundary is observed in the steel-copper connection, since these materials have a face-centered cubic lattice and are easily subjected to plastic deformation. At the contact boundaries of the plates, transition diffusion zones with different widths (from 5 to 40 μm) and element concentrations are formed. The hardness in the boundary diffusion zones is higher than in the connected metals, which is due to the diffusion interaction of the materials adjacent to each other. It has been established that the tensile strength of the composite insert is comparable to the maximum strength of Grade 4 alloy (456-511 MPa), and the failure in most cases occurred over the least durable component of the composite material, which is the copper plate, whose strength was significantly increased by cold hardening during explosion welding and diffusion of elements of the contacting plates.

Potential use of copper surfaces to reduce survival of epidemic meticillin-resistant Staphylococcus aureus in the healthcare environment.

PubMed

Noyce, J O; Michels, H; Keevil, C W

2006-07-01

Epidemic meticillin-resistant Staphylococcus aureus (EMRSA) emerged in the early 1980s with EMRSA-15 and -16 being the most prevalent strains within the UK. MRSA transmission between patients is largely via the hands of healthcare workers, and contamination of the hospital environment may occur. The objective of this study was to evaluate the effectiveness of copper and brass to reduce the viability of air-dried deposits of three MRSA strains [MRSA (NCTC 10442), EMRSA-1 (NCTC 11939) and EMRSA-16 (NCTC 13143)] compared with stainless steel. MRSA and EMRSA [10(7)colony-forming units (CFU)] were inoculated on to coupons (1 cm x 1 cm) of copper, brass or stainless steel and incubated at either 22 degrees C or 4 degrees C for various time periods. Viability was determined by resuspending removed CFUs and plating out on tryptone soy agar plates in addition to staining with the respiratory indicator fluorochrome 5-cyano-2,3-ditolyl tetrazolium. On pure copper surfaces, 10(7) MRSA, EMRSA-1 and EMRSA-16 were completely killed after 45, 60 and 90 min, respectively, at 22 degrees C. In contrast, viable organisms for all three strains were detected on stainless steel (grade 304) after 72 h at 22 degrees C. At 4 degrees C, complete kill was achieved on copper for all three strains within 6 h. The results demonstrate an antimicrobial effect of copper on MRSA, EMRSA-1 and -16 in contrast to stainless steel. Consequently, the contemporary application of stainless steel in hospital environments for work surfaces and door furniture is not recommended.

Thermal conductivity and thermal expansion of graphite fiber/copper matrix composites

NASA Technical Reports Server (NTRS)

Ellis, David L.; Mcdanels, David L.

1991-01-01

The high specific conductivity of graphite fiber/copper matrix (Gr/Cu) composites offers great potential for high heat flux structures operating at elevated temperatures. To determine the feasibility of applying Gr/Cu composites to high heat flux structures, composite plates were fabricated using unidirectional and cross-plied pitch-based P100 graphite fibers in a pure copper matrix. Thermal conductivity of the composites was measured from room temperature to 1073 K, and thermal expansion was measured from room temperature to 1050 K. The longitudinal thermal conductivity, parallel to the fiber direction, was comparable to pure copper. The transverse thermal conductivity, normal to the fiber direction, was less than that of pure copper and decreased with increasing fiber content. The longitudinal thermal expansion decreased with increasing fiber content. The transverse thermal expansion was greater than pure copper and nearly independent of fiber content.

Thermal conductivity and thermal expansion of graphite fiber-reinforced copper matrix composites

NASA Technical Reports Server (NTRS)

Ellis, David L.; Mcdanels, David L.

1993-01-01

The high specific conductivity of graphite fiber/copper matrix (Gr/Cu) composites offers great potential for high heat flux structures operating at elevated temperatures. To determine the feasibility of applying Gr/Cu composites to high heat flux structures, composite plates were fabricated using unidirectional and cross-plied pitch-based P100 graphite fibers in a pure copper matrix. Thermal conductivity of the composites was measured from room temperature to 1073 K, and thermal expansion was measured from room temperature to 1050 K. The longitudinal thermal conductivity, parallel to the fiber direction, was comparable to pure copper. The transverse thermal conductivity, normal to the fiber direction, was less than that of pure copper and decreased with increasing fiber content. The longitudinal thermal expansion decreased with increasing fiber content. The transverse thermal expansion was greater than pure copper and nearly independent of fiber content.

Effects of copper supplement on growth and viability of strains used as starters and adjunct cultures for Emmental cheese manufacture.

PubMed

Rodríguez, L Mato; Alatossava, T

2008-10-01

To determine the effects of supplemented copper (Cu2+) on growth and viability of strains used as starters and adjunct cultures for Emmental cheese manufacture. Thirteen strains belonging to Lactobacillus delbrueckii, Lactobacillus helveticus, Lactobacillus rhamnosus, Streptococcus thermophilus or Propionibacterium freudenreichii species were exposed to various copper concentrations in the proper growth medium at relevant growth temperatures, and the effects of supplemented copper on bacterial growth and cell viability were determined by optical density and pH measurements, also by platings. Among the species considered, L. delbrueckii was the most copper resistant and S. thermophilus the most sensitive to copper. Anaerobic conditions increased this sensitivity significantly. There was also a considerable amount of variation in copper resistance at strain level. Copper resistance is both a species- and strain-dependent property and may reflect variability in copper-binding capacities by cell wall components among species and strains. In addition, the chemical state of copper may be involved. This study revealed that copper resistance is a highly variable property among starter and adjunct strains, and this variability should be considered when strains are selected for Emmental cheese manufacture.

76 FR 75873 - Certain Helical Spring Lock Washers From Taiwan and the People's Republic of China: Continuation...

Federal Register 2010, 2011, 2012, 2013, 2014

2011-12-05

... or bolts; and (3) provide a hardened bearing surface. The scope does not include internal or external tooth washers, nor does it include spring lock washers made of other metals, such as copper. Lock..., or of stainless steel, heat-treated or non-heat-treated, plated or non-plated, with ends that are off...

Laser-induced selective copper plating of polypropylene surface

NASA Astrophysics Data System (ADS)

Ratautas, K.; Gedvilas, M.; Stankevičiene, I.; JagminienÄ--, A.; Norkus, E.; Li Pira, N.; Sinopoli, S.; Emanuele, U.; Račiukaitis, G.

2016-03-01

Laser writing for selective plating of electro-conductive lines for electronics has several significant advantages, compared to conventional printed circuit board technology. Firstly, this method is faster and cheaper at the prototyping stage. Secondly, material consumption is reduced, because it works selectively. However, the biggest merit of this method is potentiality to produce moulded interconnect device, enabling to create electronics on complex 3D surfaces, thus saving space, materials and cost of production. There are two basic techniques of laser writing for selective plating on plastics: the laser-induced selective activation (LISA) and laser direct structuring (LDS). In the LISA method, pure plastics without any dopant (filler) can be used. In the LDS method, special fillers are mixed in the polymer matrix. These fillers are activated during laser writing process, and, in the next processing step, the laser modified area can be selectively plated with metals. In this work, both methods of the laser writing for the selective plating of polymers were investigated and compared. For LDS approach, new material: polypropylene with carbon-based additives was tested using picosecond and nanosecond laser pulses. Different laser processing parameters (laser pulse energy, scanning speed, the number of scans, pulse durations, wavelength and overlapping of scanned lines) were applied in order to find out the optimal regime of activation. Areal selectivity tests showed a high plating resolution. The narrowest width of a copper-plated line was less than 23 μm. Finally, our material was applied to the prototype of the electronic circuit board on a 2D surface.

Conductive copper sulfide thin films on polyimide foils

NASA Astrophysics Data System (ADS)

Cardoso, J.; Gomez Daza, O.; Ixtlilco, L.; Nair, M. T. S.; Nair, P. K.

2001-02-01

Kapton polyimide is known for its high thermal stability, >400 °C. Copper sulfide thin films of 75 and 100 nm thickness were coated on DuPont Kapton HN polyimide foils of 25 µm thickness by floating them on a chemical bath containing copper complexes and thiourea. The coated foils were annealed at 150-400 °C in nitrogen, converting the coating from CuS to Cu1.8S. The sheet resistance of the annealed coatings (100 nm) is 10-50 Ω/□ and electrical conductivity, 2-10×103 Ω-1 cm- 1, which remain nearly constant even after the foils are immersed in 0.1-1 M HCl for 30-120 min. The coated polyimide has a transmittance (25-35%) peak located in the wavelength region 550-600 nm, with transmittance dropping to near zero below 450 nm and below 10% in the near-infrared spectral region. These characteristics are relevant in solar radiation control applications. The coated foils might also be used as conductive substrates for electrolytic deposition of metals and semiconductors and for optoelectronic device structures.

One-step internal-tin Nb/sub 3/Sn superconductor fabrication. Final report, June 1983-August 1984

DOE Office of Scientific and Technical Information (OSTI.GOV)

Marancik, W.

1985-03-01

The object of this research is to demonstrate the feasibility of producing a Nb/sub 3/Sn superconductor in a single extrusion process with a large number of filaments with internal tin. The technique chosen uses .010'-diameter Nb and tin-plated Cu wires formed into a solenoid. The solenoid is covered with tin-plated copper foil and isostatically compacted to a pressure of 17,000 psi. The solenoid is slit along its length. This results in a ribbon about 40 inches long by about 5-inches wide, with the Nb wires running across the 5-inch-width. The ribbon is then rolled up (Jelly Roll) around a 0.5more » inch diameter Ta covered copper rod to produce a composite of about 1.5 inches in diameter by 5 inches long. The composite geometry is now a cylindrical bundle of 0.010-inch-diameter Nb wire separated from each other by tin-plated copper. Each Nb wire is aligned with the axis of cylinder. The cylinder is slid into a Ta-lined copper extrusion can which is evacuated and sealed. The can is extruded at a low temperature and drawn to final wire size without intermediate annealing. The advantage of the process is that it is an internal tin process with the tin uniformly distributed through the matrix. The Nb is in a relatively soft state having been fully annealed at 0.020-inch diameter. Only one extrusion is required since the bundling technique allows a large number of wires to be precisely aligned and spaced in the matrix.« less

Development of low cost contacts to silicon solar cells

NASA Technical Reports Server (NTRS)

Tanner, D. P.

1980-01-01

The results of the second phase of the program of developing low cost contacts to silicon solar cells using copper are presented. Phase 1 yielded the development of a plated Pd-Cr-Cu contact system. This process produced cells with shunting problems when they were heated to 400 C for 5 minutes. Means of stopping the identified copper diffusion which caused the shunting were investigated. A contact heat treatment study was conducted with Pd-Ag, Ci-Ag, Pd-Cu, Cu-Cr, and Ci-Ni-Cu. Nickel is shown to be an effective diffusion barrier to copper.

A study of ignition by rifle bullets

Treesearch

Mark A. Finney; Trevor B. Maynard; Sara S. McAllister; Ian J. Grob

2013-01-01

Experiments were conducted to examine the potential for rifle bullets to ignite organic matter after impacting a hard surface. The tests were performed using a variety of common cartridges (7.62x51, 7.62x39, 7.62x54R, and 5.56x45) and bullet materials (steel core, lead core, solid copper, steel jacket, and copper jacket). Bullets were fired at a steel plate that...

Fabrication of Copper-Rich Cu-Al Alloy Using the Wire-Arc Additive Manufacturing Process

NASA Astrophysics Data System (ADS)

Dong, Bosheng; Pan, Zengxi; Shen, Chen; Ma, Yan; Li, Huijun

2017-12-01

An innovative wire-arc additive manufacturing (WAAM) process is used to fabricate Cu-9 at. pct Al on pure copper plates in situ, through separate feeding of pure Cu and Al wires into a molten pool, which is generated by the gas tungsten arc welding (GTAW) process. After overcoming several processing problems, such as opening the deposition molten pool on the extremely high-thermal conductive copper plate and conducting the Al wire into the molten pool with low feed speed, the copper-rich Cu-Al alloy was successfully produced with constant predesigned Al content above the dilution-affected area. Also, in order to homogenize the as-fabricated material and improve the mechanical properties, two further homogenization heat treatments at 1073 K (800 °C) and 1173 K (900 °C) were applied. The material and mechanical properties of as-fabricated and heat-treated samples were compared and analyzed in detail. With increased annealing temperatures, the content of precipitate phases decreased and the samples showed gradual improvements in both strength and ductility with little variation in microstructures. The present research opened a gate for in-situ fabrication of Cu-Al alloy with target chemical composition and full density using the additive manufacturing process.

Magnetic Catheter Manipulation in the Interventional MRI Environment

PubMed Central

Wilson, Mark W.; Martin, Alastair B.; Lillaney, Prasheel; Losey, Aaron D.; Yee, Erin J.; Bernhardt, Anthony; Malba, Vincent; Evans, Lee; Sincic, Ryan; Saeed, Maythem; Arenson, Ronald L.; Hetts, Steven W.

2013-01-01

Purpose To evaluate deflection capability of a prototype endovascular catheter, which is remotely magnetically steerable, for use in the interventional MRI environment. Materials and Methods Copper coils were mounted on the tips of commercially available 2.3 – 3.0 Fr microcatheters. The coils were fabricated in a novel manner by plasma vapor deposition of a copper layer followed by laser lithography of the layer into coils. Orthogonal helical (solenoid) and saddle-shaped (Helmholtz) coils were mounted on a single catheter tip. Microcatheters were tested in water bath phantoms in a 1.5T clinical MRI scanner, with variable simultaneous currents applied to the coils. Catheter tip deflection was imaged in the axial plane utilizing a “real-time” steady-state free precession (SSFP) MRI sequence. Degree of deflection and catheter tip orientation were measured for each current application. Results The catheter tip was clearly visible in the longitudinal and axial planes. Magnetic field artifacts were visible when the orthogonal coils at the catheter tip were energized. Variable amounts of current applied to a single coil demonstrated consistent catheter deflection in all water bath experiments. Changing current polarity reversed the observed direction of deflection, whereas current applied to two different coils resulted in deflection represented by the composite vector of individual coil activations. Microcatheter navigation through the vascular phantom was successful through control of applied current to one or more coils. Conclusion Controlled catheter deflection is possible with laser lithographed multi-axis coil tipped catheters in the MRI environment. PMID:23707097

Effect of Cu content on microstructure, mechanical and anti-fouling properties of TiSiN-Cu coating deposited by multi-arc ion plating

NASA Astrophysics Data System (ADS)

Bai, Xuebing; Li, Jinlong; Zhu, Lihui; Wang, Liping

2018-01-01

The copper-doped TiSiN coatings were deposited on 316L stainless steel by reactive co-sputtering in multi-arc ion plating. The surface morphology and structure of the coating were analyzed by scanning electron microcopies, X-ray diffraction and X-ray photoelectron spectroscopy. The hardness was tested using Nano-indentation. The influence of the copper content in the coatings on the structure and mechanical properties of TiSiN-Cu coatings was investigated. Antifouling behaviors of the coatings were evaluated by analyzing adhesion and propagation of P. tricornutum, N. closterium, and Chlorella sp. The TiSiN-Cu coatings had a unique structure of amorphous Si3N4 and nanocrystalline nc-TiN/nc-Cu. The Cu-TiSiN coatings can inhibit effectively attachment and colonization of the algae on the surface. When the copper content increases from 6.75 at.% to 25.15 at.%, the coatings show an obvious decrease in hardness, significantly increase in the surface roughness and greatly weaken in antifouling properties. When the copper content is 6.75 at.%, the coating has the highest hardness with 30 GPa, and the best reduction ratio with 89%, 93% and 57% attachment of P. triceratium, N. closterium and Chlorella sp., respectively. The TiSiN-Cu coating with a copper dosage of 6.75 at.% has the excellent mechanical properties and capability of killing effectively microalgae.

Structural, morphological, optical and electrical properties of Schottky diodes based on CBD deposited ZnO:Cu nanorods

NASA Astrophysics Data System (ADS)

Mwankemwa, Benard S.; Legodi, Matshisa J.; Mlambo, Mbuso; Nel, Jackie M.; Diale, Mmantsae

2017-07-01

Undoped and copper doped zinc oxide (ZnO) nanorods have been synthesized by a simple chemical bath deposition (CBD) method at a temperature of 90 °C. Structural, morphological, optical and electrical properties of the synthesized ZnO nanorods were found to be dependent on the Cu doping percentage. X-ray diffraction (XRD) patterns revealed strong diffraction peaks of hexagonal wurtzite of ZnO, and no impurity phases from metallic zinc or copper. Scanning electron microscopy (SEM) images showed changes in diameter and shape of nanorods, where by those doped with 2 at.% and 3 at.% aggregated and became compact. Selected area electron diffraction (SAED) patterns indicates high quality, single crystalline wurtzite structure ZnO and intensities of bright spots varied with copper doping concentration. UV-visible absorption peaks of ZnO red shifted with increasing copper doping concentration. Raman studies demonstrated among others, strong and sharp E2 (low) and E2 (high) optical phonon peaks confirming crystal structure of ZnO. Current-voltage measurements based on the gold/ZnO nanorods/ITO showed good rectifying behavior of the Schottky diode. The predicted Schottky barrier height of 0.60 eV was obtained which is not far from the theoretical Schottky-Mott value of 0.80 eV.

PLURAL METALLIC COATINGS ON URANIUM AND METHOD OF APPLYING SAME

DOEpatents

Gray, A.G.

1958-09-16

A method is described of applying protective coatings to uranlum articles. It consists in applying chromium plating to such uranium articles by electrolysis in a chromic acid bath and subsequently applying, to this minum containing alloy. This aluminum contalning alloy (for example one of aluminum and silicon) may then be used as a bonding alloy between the chromized surface and an aluminum can.

10. VIEW OF THE ADDITION TO BUILDING 883, REFERRED TO ...

Library of Congress Historic Buildings Survey, Historic Engineering Record, Historic Landscapes Survey

10. VIEW OF THE ADDITION TO BUILDING 883, REFERRED TO AS SIDE C. ARMOR PLATE MADE WITH DEPLETED URANIUM WAS HEATED IN A MOLTEN SALT BATH, THEN PROCESSED THROUGH THE ROLLING MILL TO FORM LARGE SHEETS. (9/16/85) - Rocky Flats Plant, Uranium Rolling & Forming Operations, Southeast section of plant, southeast quadrant of intersection of Central Avenue & Eighth Street, Golden, Jefferson County, CO

A Molecular MST Approach to Investigate Fecal Indicator Bacteria in Bioaerosols, Bathing Water, Seaweed Wrack, and Sand at Recreational Beaches

NASA Astrophysics Data System (ADS)

Thoren, K. M.; Sinigalliano, C. D.

2016-02-01

Despite numerous cases of beach bacteria affecting millions of people worldwide, the persistence of the bacteria populations in coastal areas is still not well understood. The purpose of this study was to test the levels of persistence of Fecal Indicating Bacteria (FIB) of enterococci, Escherichia coli, and Human-source Bacteroidales, within the intertidal "swash zone" and the deeper waist zone in which people commonly bathe and play. In addition, the study sought to determine if these bacterial contaminants may also be found in aerosols at the beach. Measuring solar insolation in relation to bacterial persistence in seaweed wrack was used to determine if sunlight plays a role in modifying concentrations of FIB at the beach. Light intensity measured by a solar photometer and air quality measured by aerosol plate counts and qPCR Microbial Source Tracking (MST) was compared to varying locations where the beach samples were collected. Results from water samples demonstrate that bacteria measured using plate counts and qPCR were indeed higher within the swash zone than in the waist zone. This is in contrast with the way that the EPA currently measures and determines the public safety of beach waters. They commonly measure the waist zone, but disregard the swash zone. Results from beach bio-aerosol samples showed a wide variety of fungi and bacteria in the beach air, and qPCR MST analysis of these bio-aerosols showed the presence of FIBs such as enterococci on several of the aerosol collection plates. This emphasizes the need to collect samples from the entire beach instead of just measuring at an isolated area, and that exposure to microbial contaminants may include bathing water, beach sand, seaweed wrack, and bio-aerosols. Thus, the data reveals a potential way to identify harmful levels of bacteria and dangerous levels of poor air quality at recreational beaches. These results expound the need for broader assessment of potential beach contamination, not only the swimming water, but also the beach air, shoreline, and also varying depths of water, which can be extremely beneficial to reduce people's risk from microbial contamination exposure.

Catalyst surfaces for the chromous/chromic redox couple

NASA Technical Reports Server (NTRS)

Giner, J. D.; Cahill, K. J. (Inventor)

1981-01-01

An electricity producing cell of the reduction-oxidation (REDOX) type divided into two compartments by a membrane is disclosed. A ferrous/ferric couple in a chloride solution serves as a cathode fluid to produce a positive electric potential. A chromic/chromous couple in a chloride solution serves as an anode fluid to produce a negative potential. The electrode is an electrically conductive, inert material plated with copper, silver or gold. A thin layer of lead plates onto the copper, silver or gold layer when the cell is being charged, the lead ions being available from lead chloride which has been added to the anode fluid. If the REDOX cell is then discharged, the lead deplates from the negative electrode and the metal coating on the electrode acts as a catalyst to increase current density.

Microbiological Analysis in Three Diverse Natural Geothermal Bathing Pools in Iceland

PubMed Central

Thorolfsdottir, Berglind Osk Th.; Marteinsson, Viggo Thor

2013-01-01

Natural thermal bathing pools contain geothermal water that is very popular to bathe in but the water is not sterilized, irradiated or treated in any way. Increasing tourism in Iceland will lead to increasing numbers of bath guests, which can in turn affect the microbial flora in the pools and therefore user safety. Today, there is no legislation that applies to natural geothermal pools in Iceland, as the water is not used for consumption and the pools are not defined as public swimming pools. In this study, we conducted a microbiological analysis on three popular but different natural pools in Iceland, located at Lýsuhóll, Hveravellir and Landmannalaugar. Total bacterial counts were performed by flow cytometry, and with plate count at 22 °C, 37 °C and 50 °C. The presence of viable coliforms, Enterococcus spp. and pseudomonads were investigated by growth experiments on selective media. All samples were screened for noroviruses by real time PCR. The results indicate higher fecal contamination in the geothermal pools where the geothermal water flow was low and bathing guest count was high during the day. The number of cultivated Pseudomonas spp. was high (13,000–40,000 cfu/100 mL) in the natural pools, and several strains were isolated and classified as opportunistic pathogens. Norovirus was not detected in the three pools. DNA was extracted from one-liter samples in each pool and analyzed by partial 16S rRNA gene sequencing. Microbial diversity analysis revealed different microbial communities between the pools and they were primarily composed of alpha-, beta- and gammaproteobacteria. PMID:23493033

Geiger Counter Technique

DTIC Science & Technology

1942-01-01

ONLY; ADMINISTRATIVE/OPERATIONAL USE; 03 MAR 1999. OTHER REQUESTS SHALL BE REFERRED THROUGH COMMANDING OFFICER, NAVAL RESEARCH LAB , WASHINGTON, DC 20375...Used as Glow Tube Voltage + " -- -+a...... .-..... . .... . . . . . .. . . Plate 41. Tar of aCotrolust Voltaep with Gas Pressure lab A-gtarator of’ Plate...construation cf vapor comatera. Acst Lay metal wll menru as cathode aterial, but oxidiste copper Lad bras han given beest res-ts. fe ride choice of

Dynamic High-Pressure Behavior of Hierarchical Heterogeneous Geological Materials

DTIC Science & Technology

2016-04-01

sandwiched between two 25µm FEP copolymer layers attached to the copper driver plate . The total package thickness with thin-film epoxy on all bonding...public release. 3 OUTLINE Page # ABSTRACT 2 1. BACKGROUND 4 2. CHARACTERISTICS OF SAND INVESTIGATED 8 3. PLATE ...constituents, phases, inter-phase boundaries ; distributions in shock states; as well as the structural evolutions which can result in strain

Manipulator having thermally conductive rotary joint for transferring heat from a test specimen

DOEpatents

Haney, S.J.; Stulen, R.H.; Toly, N.F.

1983-05-03

A manipulator for rotatably moving a test specimen in an ultra-high vacuum chamber includes a translational unit movable in three mutually perpendicular directions. A manipulator frame is rigidly secured to the translational unit for rotatably supporting a rotary shaft. A first copper disc is rigidly secured to an end of the rotary shaft for rotary movement within the vacuum chamber. A second copper disc is supported upon the first disc. The second disc receives a cryogenic cold head and does not rotate with the first disc. The second disc receives a cryogenic cold head and does not rotate with the first disc. A sapphire plate is interposed between the first and second discs to prevent galling of the copper material while maintaining high thermal conductivity between the first and second discs. A spring is disposed on the shaft to urge the second disc toward the first disc and compressingly engage the interposed sapphire plate. A specimen mount is secured to the first disc for rotation within the vacuum chamber. The specimen maintains high thermal conductivity with the second disc receiving the cryogenic transfer line.

Characterization and control of the microbial community affiliated with copper or aluminum heat exchangers of HVAC systems.

PubMed

Schmidt, Michael G; Attaway, Hubert H; Terzieva, Silva; Marshall, Anna; Steed, Lisa L; Salzberg, Deborah; Hamoodi, Hameed A; Khan, Jamil A; Feigley, Charles E; Michels, Harold T

2012-08-01

Microbial growth in heating ventilation and air-conditioning (HVAC) systems with the subsequent contamination of indoor air is of increasing concern. Microbes and the subsequent biofilms grow easily within heat exchangers. A comparative study where heat exchangers fabricated from antimicrobial copper were evaluated for their ability to limit microbial growth was conducted using a full-scale HVAC system under conditions of normal flow rates using single-pass outside air. Resident bacterial and fungal populations were quantitatively assessed by removing triplicate sets of coupons from each exchanger commencing the fourth week after their installation for the next 30 weeks. The intrinsic biofilm associated with each coupon was extracted and characterized using selective and differential media. The predominant organisms isolated from aluminum exchangers were species of Methylobacterium of which at least three colony morphologies and 11 distinct PFGE patterns we found; of the few bacteria isolated from the copper exchangers, the majority were species of Bacillus. The concentrations and type of bacteria recovered from the control, aluminum, exchangers were found to be dependent on the type of plating media used and were 11,411-47,257 CFU cm(-2) per coupon surface. The concentration of fungi was found to average 378 CFU cm(-2). Significantly lower concentrations of bacteria, 3 CFU cm(-2), and fungi, 1 CFU cm(-2), were recovered from copper exchangers regardless of the plating media used. Commonly used aluminum heat exchangers developed stable, mixed, bacterial/fungal biofilms in excess of 47,000 organisms per cm(2) within 4 weeks of operation, whereas the antimicrobial properties of metallic copper were able to limit the microbial load affiliated with the copper heat exchangers to levels 99.97 % lower during the same time period.

Oxidation of hydroxylamine by cytochrome P-460 of the obligate methylotroph Methylococcus capsulatus Bath.

PubMed Central

Zahn, J A; Duncan, C; DiSpirito, A A

1994-01-01

An enzyme capable of the oxidation of hydroxylamine to nitrite was isolated from the obligate methylotroph Methylococcus capsulatus Bath. The absorption spectra in cell extracts, electron paramagnetic resonance spectra, molecular weight, covalent attachment of heme group to polypeptide, and enzymatic activities suggest that the enzyme is similar to cytochrome P-460, a novel iron-containing protein previously observed only in Nitrosomonas europaea. The native and subunit molecular masses of the M. capsulatus Bath protein were 38,900 and 16,390 Da, respectively; the isoelectric point was 6.98. The enzyme has approximately one iron and one copper atom per subunit. The electron paramagnetic resonance spectrum of the protein showed evidence for a high-spin ferric heme. In contrast to the enzyme from N. europaea, a 13-nm blue shift in the soret band of the ferrocytochrome (463 nm in cell extracts to 450 nm in the final sample) occurred during purification. The amino acid composition and N-terminal amino acid sequence of the enzyme from M. capsulatus Bath was similar but not identical to those of cytochrome P-460 of N. europaea. In cell extracts, the identity of the biological electron acceptor is as yet unestablished. Cytochrome c-555 is able to accept electrons from cytochrome P-460, although the purified enzyme required phenazine methosulfate for maximum hydroxylamine oxidation activity (specific activity, 366 mol of O2 per s per mol of enzyme). Hydroxylamine oxidation rates were stimulated approximately 2-fold by 1 mM cyanide and 1.5-fold by 0.1 mM 8-hydroxyquinoline. Images PMID:7928947

Archeological Testing at Two Sites Near White Castle, Iberville Parish, Louisiana: 16 IV 147 and 16 IV 149

DTIC Science & Technology

1988-07-26

McIntire (1958: Plate 13) reported on work conducted at the Clara Murray Site (16 IV 12), also located just north of the town of Bayou Goula. Two...as early as 1750, but it only was applied as over-glaze decoration until post- 1760. This process started with a design engraved on copper plating ...Once the plate was covered with paint, tissue paper was placed over it, transferring the design to the paper, which in turn was transferred to the

Effect of Injection Molding Melt Temperatures on PLGA Craniofacial Plate Properties during In Vitro Degradation

PubMed Central

Fancello, Eduardo Alberto

2017-01-01

The purpose of this article is to present mechanical and physicochemical properties during in vitro degradation of PLGA material as craniofacial plates based on different values of injection molded temperatures. Injection molded plates were submitted to in vitro degradation in a thermostat bath at 37 ± 1°C by 16 weeks. The material was removed after 15, 30, 60, and 120 days; then bending stiffness, crystallinity, molecular weights, and viscoelasticity were studied. A significant decrease of molecular weight and mechanical properties over time and a difference in FT-IR after 60 days showed faster degradation of the material in the geometry studied. DSC analysis confirmed that the crystallization occurred, especially in higher melt temperature condition. DMA analysis suggests a greater contribution of the viscous component of higher temperature than lower temperature in thermomechanical behavior. The results suggest that physical-mechanical properties of PLGA plates among degradation differ per injection molding temperatures. PMID:29056968

A novel Ag catalyzation process using swelling impregnation method for electroless Ni deposition on Kevlar® fiber

NASA Astrophysics Data System (ADS)

Pang, Hongwei; Bai, Ruicheng; Shao, Qinsi; Gao, Yufang; Li, Aijun; Tang, Zhiyong

2015-12-01

A novel Ag catalyzation process using swelling impregnation pretreatment method was developed for electroless nickel (EN) deposition on Kevlar fiber. Firstly, the fiber was immersed into an aqueous dimethylsulfoxide (DMSO) solution of silver nitrate to impart silver nitrate into the inner part of the fiber near the surface. Subsequently silver nitrate was reduced to metal silver nanoparticles on the fiber surface by treatment with aqueous solution of sodium borohydride. After electroless plating, a dense and homogeneous nickel coating was obtained on the fiber surface. The silver nanoparticles formed at the fiber surface functioned as a catalyst for electroless deposition as well as an anchor for the plated layer. The study also revealed that the incorporation of surfactant sodium dodecyl sulfate (SDS) in electroless nickel plating bath can enhance the adhesion strength of EN layer with the fiber surface and minimize the surface roughness of the EN coating. The Ni plated Kevlar fiber possessed excellent corrosion resistance and high tensile strength.

A rapid detection method using flow cytometry to monitor the risk of Legionella in bath water.

PubMed

Taguri, Toshitsugu; Oda, Yasunori; Sugiyama, Kanji; Nishikawa, Toru; Endo, Takuro; Izumiyama, Shinji; Yamazaki, Masayuki; Kura, Fumiaki

2011-07-01

Legionella species are the causative agents of human legionellosis, and bathing facilities have been identified as the sources of infection in several outbreaks in Japan. Researchers in Japan have recently reported evidence of significant associations between bacterial counts and the occurrence of Legionella in bathing facilities and in a hot tub model. A convenient and quantitative bacterial enumeration method is therefore required as an indicator of Legionella contamination or disinfection to replace existing methods such as time-consuming Legionella culture and expensive Legionella-DNA amplification. In this study, we developed a rapid detection method (RDM) to monitor the risk of Legionella using an automated microbial analyzing device based on flow cytometry techniques to measure the total number of bacteria in water samples within two minutes, by detecting typical patterns of scattered light and fluorescence. We first compared the results of our RDM with plate counting results for five filtered hot spring water samples spiked with three species of bacteria, including Legionella. Inactivation of these samples by chlorine was also assessed by the RDM, a live/dead bacterial fluorescence assay and plate counting. Using the RDM, the lower limit of quantitative bacterial counts in the spiked samples was determined as 3.0×10(3)(3.48log)counts mL(-1). We then used a laboratory model of a hot tub and found that the RDM could monitor the growth curve of naturally occurring heterotrophic bacteria with 1 and 2 days' delayed growth of amoeba and Legionella, respectively, and could also determine the killing curve of these bacteria by chlorination. Finally, samples with ≥3.48 or <3.48log total bacterial counts mL(-1) were tested using the RDM from 149 different hot tubs, and were found to be significantly associated with the positive or negative detection of Legionella with 95% sensitivity and 84% specificity. These findings indicated that the RDM can be used for Legionella control at bathing facilities, especially those where the effectiveness of chlorine is reduced by the presence of Fe(2+), Mn(2+), NH(4)(+), skin debris, and/or biofilms in the water. Copyright © 2011 Elsevier B.V. All rights reserved.

Installation Restoration Program. Phase 1: Records Search, Williams AFB, Arizona

DTIC Science & Technology

1984-02-01

Minimum 4.5 Trace substances, maximum -. allowable limits, (mg/1) Arsenic 2.00 Boron 1.00 Cadmium 0.05 Chromium (hexavalent and trivalent ) 1.00 Copper...located in Building 32. Chromium , cadmium, and copper electroplating operations were conducted in a temporary building, T-31 . Paint stripping was... chromium plating wastes. The paint separator receives wastes from paint stri.pping operations that are performed in Buildings 25 and 1086. It also

46 CFR 182.440 - Independent fuel tanks.

Code of Federal Regulations, 2012 CFR

2012-10-01

...(150 gal) tanks Over 570 liter(150 gal) 2 tanks Nickel-copper B 127, hot rolled sheet or plate 0.94 (0.037) [USSG 20] 3 1.27 (0.050) [USSG 18] 2.72 (0.107) [USSG 12]. Copper-nickel 4 B 122, UNS alloy... C65100 and C65500 1.29 (0.051) [AWG 16] 1.63 (0.064) [AWG 14] 3.66 (0.144) [AWG 7]. Steel or iron 5,6 1...

46 CFR 182.440 - Independent fuel tanks.

Code of Federal Regulations, 2011 CFR

2011-10-01

...(150 gal) tanks Over 570 liter(150 gal) 2 tanks Nickel-copper B 127, hot rolled sheet or plate 0.94 (0.037) [USSG 20] 3 1.27 (0.050) [USSG 18] 2.72 (0.107) [USSG 12]. Copper-nickel 4 B 122, UNS alloy... C65100 and C65500 1.29 (0.051) [AWG 16] 1.63 (0.064) [AWG 14] 3.66 (0.144) [AWG 7]. Steel or iron 5,6 1...

Assessment of pollution prevention and control technology for plating operations

NASA Technical Reports Server (NTRS)

Chalmer, Paul D.; Sonntag, William A.; Cushnie, George C., Jr.

1995-01-01

The National Center for Manufacturing Sciences (NCMS) is sponsoring an on-going project to assess pollution prevention and control technology available to the plating industry and to make this information available to those who can benefit from it. Completed project activities include extensive surveys of the plating industry and vendors of technologies and an indepth literature review. The plating industry survey was performed in cooperation with the National Association of Metal Finishers. The contractor that conducted the surveys and prepared the project products was CAI Engineering. The initial products of the project were made available in April, 1994. These products include an extensive report that presents the results of the surveys and literature review and an electronic database. The project results are useful for all those associated with pollution prevention and control in the plating industry. The results show which treatment, recovery and bath maintenance technologies have been most successful for different plating processes and the costs for purchasing and operating these technologies. The project results also cover trends in chemical substitution, the identification of compliance-problem pollutants, sludge generation rates, off-site sludge recovery and disposal options, and many other pertinent topics.

Characterization of Pulse Reverses Electroforming on Hard Gold Coating.

PubMed

Byoun, Young-Min; Noh, Young-Tai; Kim, Young-Geun; Ma, Seung-Hwan; Kim, Gwan-Hoon

2018-03-01

Effect of pulse reverse current (PRC) method on brass coatings electroplated from gold solution was investigated by various plating parameters such as plating duration, the anodic duty cycle, the anodic current density and the cathodic current density. The reversed current results in a significant change in the morphology of electrodeposits, improvement of the overall current efficiency and reduction of deposit porosity. With longer pulses, hemispherical surface features are generated, while larger grains result from shorter pulse widths. The porosity of the plated samples is found to decrease compared with results at the same time-average plating rate obtained from DC or Pulse plating. A major impediment to reducing gold later thickness is the corrosion of the underlying substrate, which is affected by the porosity of the gold layer. Both the morphology and the hydrogen evolution reaction have significant impact on porosity. PRC plating affect hydrogen gold and may oxidize hydrogen produced during the cathodic portion of the waveform. Whether the dissolution of gold and oxidation of hydrogen occur depends on the type of plating bath and the plating conditions adapted. In reversed pulse plating, the amount of excess near-surface cyanide is changed after the cathodic current is applied, and the oxidation of gold under these conditions has not been fully addressed. The effects of the current density, pulse-reverse ratio and brightener concentration of the electroplating process were investigated and optimized for suitable performance.

Templated synthesis of cyclic [4]rotaxanes consisting of two stiff rods threaded through two bis-macrocycles with a large and rigid central plate as spacer.

PubMed

Collin, Jean-Paul; Durola, Fabien; Frey, Julien; Heitz, Valérie; Reviriego, Felipe; Sauvage, Jean-Pierre; Trolez, Yann; Rissanen, Kari

2010-05-19

Two related cyclic [4]rotaxanes consisting of double macrocycles and rigid rods incorporating two bidentate chelates have each been prepared in high yield. The first step is a multigathering and threading reaction driven by coordination of two different bidentate chelates (part of either the rings or the rods) to each copper(I) center so as to afford the desired precursor. In both cases, the assembly step is done under very mild conditions, and it is quantitative. The second key reaction is the stopper-attaching reaction, based on click chemistry. Even if the quadruple stoppering reaction is not quantitative, it is relatively high-yielding (60% and 95%), and the copper-driven assembly process is carried out at room temperature without any aggressive reagent. The final copper-complexed [4]rotaxanes obtained contain two aromatic plates roughly parallel to one another located at the center of each bis-macrocycle. In the most promising case in terms of host-guest properties, the plates are zinc(II) porphyrins of the tetra-aryl series. The compounds have been fully characterized by various spectroscopic techniques ((1)H NMR, mass spectrometry, and electronic absorption spectroscopy). Unexpectedly, the copper-complexed porphyrinic [4]rotaxane could be crystallized as its 4PF(6)(-) salt to afford X-ray quality crystals. The structure obtained is in perfect agreement with the postulated chemical structure of the compound. It is particularly attractive in terms of symmetry and molecular aesthetics. The distance between the zinc atoms of the two porphyrins is 8.673 A, which is sufficient to allow insertion between the two porphyrinic plates of small ditopic basic substrates able to interact with the central porphyrinic Zn atoms. This prediction has been confirmed by absorption spectroscopy measurements in the presence of various organic substrates. However, large substrates cannot be introduced in the corresponding recognition site and are thus complexed mostly in an exo fashion, being located outside the receptor cavity. Noteworthy, the stability constants of the 1:1 host-guest complexes are high (10(7) M(-1)).

Exploring the life cycle management of industrial solid waste in the case of copper slag.

PubMed

Song, Xiaolong; Yang, Jianxin; Lu, Bin; Li, Bo

2013-06-01

Industrial solid waste has potential impacts on soil, water and air quality, as well as human health, during its whole life stages. A framework for the life cycle management of industrial solid waste, which integrates the source reduction process, is presented and applied to copper slag management. Three management scenarios of copper slag are developed: (i) production of cement after electric furnace treatment, (ii) production of cement after flotation, and (iii) source reduction before the recycling process. A life cycle assessment is carried out to estimate the environmental burdens of these three scenarios. Life cycle assessment results showed that the environmental burdens of the three scenarios are 2710.09, 2061.19 and 2145.02 Pt respectively. In consideration of the closed-loop recycling process, the environmental performance of the flotation approach excelled that of the electric furnace approach. Additionally, although flash smelting promotes the source reduction of copper slag compared with bath smelting, it did not reduce the overall environmental burdens resulting from the complete copper slag management process. Moreover, it led to the shifting of environmental burdens from ecosystem quality damage and resources depletion to human health damage. The case study shows that it is necessary to integrate the generation process into the whole life cycle of industrial solid waste, and to make an integrated assessment for quantifying the contribution of source reduction, rather than to simply follow the priority of source reduction and the hierarchy of waste management.

Performance of three systems for warming intravenous fluids at different flow rates.

PubMed

Satoh, J; Yamakage, M; Wasaki, S I; Namiki, A

2006-02-01

This study compared the intravenous fluid warming capabilities of three systems at different flow rates. The devices studied were a water-bath warmer, a dry-heat plate warmer, and an intravenous fluid tube warmer Ambient temperature was controlled at 22 degrees to 24 degrees C. Normal saline (0.9% NaCl) at either room temperature (21 degrees to 23 degrees C) or at ice-cold temperature (3 degrees to 5 degrees C) was administered through each device at a range of flow rates (2 to 100 ml/min). To mimic clinical conditions, the temperature of the fluid was measured with thermocouples at the end of a one metre tube connected to the outflow of the warmer for the first two devices and at the end of the 1.2 m warming tubing for the intravenous fluid tube warmer The temperature of fluid delivered by the water bath warmer increased as the flow rate was increased up to 15 to 20 ml/min but decreased with greater flow rates. The temperature of the fluid delivered by the dry-heat plate warmer significantly increased as the flow rate was increased within the range tested (due to decreased cooling after leaving the device at higher flow rates). The temperature of fluid delivered by the intravenous fluid tube warmer did not depend on the flow rate up to 20 ml/min but significantly and fluid temperature-dependently decreased at higher flow rates (>30 ml/min). Under the conditions of our testing, the dry heat plate warmer delivered the highest temperature fluid at high flow rates.

Effect of сopper сoating on fibers made of aluminum alloy, titanium, and FeCrAl alloy on surface morphology and activity in CO oxidation

NASA Astrophysics Data System (ADS)

Lukiyanchuk, I. V.; Rudnev, V. S.; Serov, M. M.; Krit, B. L.; Lukiyanchuk, G. D.; Nedozorov, P. M.

2018-04-01

The catalytic activity of both copper fibers and copper-coated fibers of a diameter of 50-100 μm made of aluminum alloy, technical grade titanium, and FeCrAl alloy in CO oxidation has been estimated. Metal fibers have been fabricated by the method of pendant drop melt extraction (PDME). The fibers copper plating was carried out by chemical and electrochemical methods. The composition and structure of samples and coatings before and after catalytic tests have been characterized by the methods of scanning electron microscopy, energy-dispersive analysis, and X-ray fluorescence analysis. It has been shown that the catalytic activity of copper-coated fibers made of FeCrAl alloy in the reaction of CO oxidation is not inferior to that of copper fibers.

Status of CdS/CdTe solar cell research at NREL

NASA Astrophysics Data System (ADS)

Ramanathan, K.; Dhere, R. G.; Coutts, T. J.; Chu, T.; Chu, S.

1992-12-01

We report on the deposition of thin cadmium sulfide (CdS) layers from aqueous solutions and their optical properties. CdS layers have been deposited on soda lime glass, tin oxide coated glass and copper indium diselenide (CuInSe2) thin films. A systematic increase in the absorption is found to occur with increasing concentration of the buffer salt used in the bath. CdS/CdTe thin film solar cells have been fabricated by close spaced sublimation of CdTe, yielding 11.3% devices.

Preparation and Characterization of Ni Spines Grown on the Surface of Cubic Boron Nitride Grains by Electroplating Method

PubMed Central

Gui, Yanghai; Zhao, Jianbo; Chen, Jingbo; Jiang, Yuanli

2016-01-01

Cubic boron nitride (cBN) is widely applied in cutting and grinding tools. cBN grains plated by pure Ni and Ni/SiC composite were produced under the same conditions from an additive-free nickel Watts type bath. The processed electroplating products were characterized by the techniques of scanning electron microscopy (SEM), X-ray diffraction (XRD) and thermoanalysis (TG-DTA). Due to the presence of SiC particles, there are some additional nodules on the surface of Ni/SiC plated cBN compared with the pure Ni plated cBN. The unique morphology of Ni/SiC plated cBN should attain greater retention force in resin bond. Moreover, the coating weight of cBN grains could be controlled by regulating the plating time. cBN grains with 60% coating weight possess the optimum grinding performance due to their roughest and spiniest surface. In addition, Ni spines plated cBN grains show good thermal stability when temperature is lower than 464 °C. Therefore, the plated cBN grains are more stable and suitable for making resin bond abrasive tools below 225 °C. Finally, the formation mechanism of electroplating products is also discussed. PMID:28773283

The Myszkow porphyry copper-molybdenum deposit, Poland

USGS Publications Warehouse

Chaffee, M.A.; Eppinger, R.G.; Lason, K.; Slosarz, J.; Podemski, M.

1994-01-01

The porphyry copper-molybdenum deposit at Myszkow, south-central Poland, lies in the Cracow-Silesian orogenic belt, in the vicinity of a Paleozoic boundary between two tectonic plates. The deposit is hosted in a complex that includes early Paleozoic metasedimentary rocks intruded in the late Paleozoic by a predominantly granodioritic pluton. This deposit exhibits many features that are typical of porphyry copper deposits associated with calc-alkaline intrusive rocks, including ore- and alteration-mineral suites, zoning of ore and alteration minerals, fluid-inclusion chemistry, tectonic setting, and structural style of veining. Unusual features of the Myszkow deposit include high concentrations of tungsten and the late Paleozoic (Variscan) age. -Authors

Prevention of Post-Traumatic Epilepsy by Transcranial Direct Current Stimulation

DTIC Science & Technology

2014-09-01

epidural fluid percussion itself. As an improvement on the classic LFPI procedure, we designed and validated a new protocol, termed rapid fluid ...plated on an 8X8 micoelectrode array (left) and bathed in oxygenated artificial cerebrospinal fluid . Cortical excitability was measured as the magnitude...not be construed as an official Department of the Army position, policy or decision unless so designated by other documentation. 1 REPORT

A Comparison of Gravimetric and Photometric Aerosol Samplers

DTIC Science & Technology

2009-03-24

the potential to cause disease (Vincent, 2007; Meldrum , 1996; and ATSDR, 2001). f) Fog – discernible mist that floats in air and usually settles to...atomization, such as spraying or arising from acid baths in chrome plating. The droplets are homogenous with the parent material and range from xvi...Contaminant Control. Boston, Butterworth Publishers. Meldrum , M. (1996). Review of fibre toxicology. H.S.E. Report, London, UK, Health and Safety

Elimination of a pollution associated with chromic acid during the electro-deposition of Cr(III) using appropriate anodic and membrane materials in a double film bath.

PubMed

Jiang, Xiaojun; Chen, Wenchao; Xu, Hongbo

2009-01-01

A method using trivalent chromium has been used to replace hexavalent chromium for the electro-deposition of chromium. Using a tri-chamber bath system various anodic materials and membranes were evaluated to minimize the production of environmentally and health damaging chromic acid. By measuring the absorbance of Cr(VI) at 640 nm, the results indicate that the use of a titanium plated ruthenium (Ti-Ru) anode produces the least amount of chromic acid byproduct compared to lead-gold alloy and graphite anodes. The concentration of Cr(VI) in the immediate vicinity of the Ti-Ru anode decreased from 0.389 mg/L to 0 during a 40-min deposition period. The use of a Nafion(TM) quaternary cation exchange membrane portioning the buffer and anode selectively prevented Cr(III) from entering the anode compartment whilst allowing the migration of H(+) to maintain overall voltaic continuity. It has been demonstrated that the use of a Ti-Ru anode with a Nafion(TM) membrane can eliminate the production of chromic acid associated with the electro-deposition of chromium plate thereby preventing its health damaging exposure to plant operators and preventing discharge of Cr(VI) into the environment. Addition of a surfactant improved current efficiency by 34.7%.

Cantilever testing of sintered-silver interconnects

DOE PAGES

Wereszczak, Andrew A.; Chen, Branndon R.; Jadaan, Osama M.; ...

2017-10-19

Cantilever testing is an underutilized test method from which results and interpretations promote greater understanding of the tensile and shear failure responses of interconnects, metallizations, or bonded joints. The use and analysis of this method were pursued through the mechanical testing of sintered-silver interconnects that joined Ni/Au-plated copper pillars or Ti/Ni/Ag-plated silicon pillars to Ag-plated direct bonded copper substrates. Sintered-silver was chosen as the interconnect test medium because of its high electrical and thermal conductivities and high-temperature capability—attractive characteristics for a candidate interconnect in power electronic components and other devices. Deep beam theory was used to improve upon the estimationsmore » of the tensile and shear stresses calculated from classical beam theory. The failure stresses of the sintered-silver interconnects were observed to be dependent on test-condition and test-material-system. In conclusion, the experimental simplicity of cantilever testing, and the ability to analytically calculate tensile and shear stresses at failure, result in it being an attractive mechanical test method to evaluate the failure response of interconnects.« less

Cantilever testing of sintered-silver interconnects

DOE Office of Scientific and Technical Information (OSTI.GOV)

Wereszczak, Andrew A.; Chen, Branndon R.; Jadaan, Osama M.

Cantilever testing is an underutilized test method from which results and interpretations promote greater understanding of the tensile and shear failure responses of interconnects, metallizations, or bonded joints. The use and analysis of this method were pursued through the mechanical testing of sintered-silver interconnects that joined Ni/Au-plated copper pillars or Ti/Ni/Ag-plated silicon pillars to Ag-plated direct bonded copper substrates. Sintered-silver was chosen as the interconnect test medium because of its high electrical and thermal conductivities and high-temperature capability—attractive characteristics for a candidate interconnect in power electronic components and other devices. Deep beam theory was used to improve upon the estimationsmore » of the tensile and shear stresses calculated from classical beam theory. The failure stresses of the sintered-silver interconnects were observed to be dependent on test-condition and test-material-system. In conclusion, the experimental simplicity of cantilever testing, and the ability to analytically calculate tensile and shear stresses at failure, result in it being an attractive mechanical test method to evaluate the failure response of interconnects.« less

Effect of Current Density and Plating Time on Cu Electroplating in TSV and Low Alpha Solder Bumping

NASA Astrophysics Data System (ADS)

Jung, Do-Hyun; Sharma, Ashutosh; Kim, Keong-Heum; Choo, Yong-Chul; Jung, Jae-Pil

2015-03-01

In this study, copper filling in through-silicon via (TSV) by pulse periodic reverse electroplating and low alpha solder bumping on Cu-filled TSVs was investigated. The via diameter and depth of TSV were 60 and 120 µm, respectively. The experimental results indicated that the thickness of electrodeposited copper layer increased with increasing cathodic current density and plating time. The electroplated Cu in TSV showed a typical bottom-up filling. A defectless, complete, and fast 100% Cu-filled TSV was achieved at cathodic and anodic current densities of -8 and 16 mA/cm2 for a plating time of 4 h, respectively. A sound low alpha solder ball, Sn-1.0 wt.% Ag-0.5 wt.% Cu (SAC 105) with a diameter of 83 µm and height of 66 µm was reflow processed at 245 °C on Cu-filled TSV. The Cu/solder joint interface was subjected to high temperature aging at 85 °C for 150 h, which showed an excellent bonding characteristic with minimum Cu-Sn intermetallic compounds growth.

Standard performance tests of collectors of solar thermal energy: A selectively coated, flat-plate copper collector with one transparent cover and a tube-to-tube spacing of 3-7/8 inches

NASA Technical Reports Server (NTRS)

1976-01-01

Basic test results are given of a flat-plate solar collector whose performance was determined in the NASA-Lewis solar simulator. The collector was tested over ranges of inlet temperatures, fluxes, and coolant flow rates. Collector efficiency is correlated in terms of inlet temperature and flux level.

Sintering behavior and thermal conductivity of nickel-coated graphite flake/copper composites fabricated by spark plasma sintering

NASA Astrophysics Data System (ADS)

Xu, Hui; Chen, Jian-hao; Ren, Shu-bin; He, Xin-bo; Qu, Xuan-hui

2018-04-01

Nickel-coated graphite flakes/copper (GN/Cu) composites were fabricated by spark plasma sintering with the surface of graphite flakes (GFs) being modified by Ni-P electroless plating. The effects of the phase transition of the amorphous Ni-P plating and of Ni diffusion into the Cu matrix on the densification behavior, interfacial microstructure, and thermal conductivity (TC) of the GN/Cu composites were systematically investigated. The introduction of Ni-P electroless plating efficiently reduced the densification temperature of uncoated GF/Cu composites from 850 to 650°C and slightly increased the TC of the X-Y basal plane of the GF/Cu composites with 20vol%-30vol% graphite flakes. However, when the graphite flake content was greater than 30vol%, the TC of the GF/Cu composites decreased with the introduction of Ni-P plating as a result of the combined effect of the improved heat-transfer interface with the transition layer, P generated at the interface, and the diffusion of Ni into the matrix. Given the effect of the Ni content on the TC of the Cu matrix and on the interface thermal resistance, a modified effective medium approximation model was used to predict the TC of the prepared GF/Cu composites.

Seal Materials Compatible with the Electroplating Solvent Used in Constellation-X Mirrors

NASA Technical Reports Server (NTRS)

Pei, Xiong-Skiba

1999-01-01

The existing gasket seals used in electroplating of the Constellation-X mirrors are difficult to assemble, and the current seal material is hydrophobic and too thick. The combination of the above problems result in: 1) non-uniform plating; 2) defect sites such as pits on the mirror edges; 3) "bear claws" on the edges of the mandrels and mirrors causing difficulties in shell-mirror separations; and 4) leakage of the plating solution past the seals into the mandrel causing chemical etching of the mandrel interior. This paper reports the results of this summer study in searching for alternate seal materials chemically compatible with the electroplating solvent. Fifteen common elastomeric rubber seal materials made-by Parker Seals were investigated including butyl, ethylene propylene, fluorosilicone, nitrile, Viton fluorocarbon, and silicone. Test results showed that Viton fluorocarbon compounds as a group were superior to the other tested compounds for chemical compatibility with the plating bath.

Black chrome solar selective coating

DOE Office of Scientific and Technical Information (OSTI.GOV)

Pettit, R.B.; Sowell, R.R.

1980-01-01

Electrodeposited black chrome solar selective coatings have frequently experienced thermal stability problems when heated to temperatures above 250/sup 0/C (480/sup 0/F) in air. By reducing the trivalent chromium concentration in the standard black chrome plating bath, coatings on nickel substrates are obtained which are stable for thousands of hours at 350/sup 0/C (660/sup 0/F) and for hundreds of hours at 400/sup 0/C (750/sup 0/F). These results have been obtained consistently on a laboratory scale, but difficulty in reproducing the results has been encountered in a production environment. A current study of the effects of known plating variables on the opticalmore » properties and thermal stability of coatings is aimed at establishing an acceptable range for each plating parameter. A preliminary process specification for electroplating mild steel substrates with a stable black chrome coating is presented.« less

About one counterexample of applying method of splitting in modeling of plating processes

NASA Astrophysics Data System (ADS)

Solovjev, D. S.; Solovjeva, I. A.; Litovka, Yu V.; Korobova, I. L.

2018-05-01

The paper presents the main factors that affect the uniformity of the thickness distribution of plating on the surface of the product. The experimental search for the optimal values of these factors is expensive and time-consuming. The problem of adequate simulation of coating processes is very relevant. The finite-difference approximation using seven-point and five-point templates in combination with the splitting method is considered as solution methods for the equations of the model. To study the correctness of the solution of equations of the mathematical model by these methods, the experiments were conducted on plating with a flat anode and cathode, which relative position was not changed in the bath. The studies have shown that the solution using the splitting method was up to 1.5 times faster, but it did not give adequate results due to the geometric features of the task under the given boundary conditions.

High-speed off-axis holographic cinematography with a copper-vapor-pumped dye laser.

PubMed

Lauterborn, W; Judt, A; Schmitz, E

1993-01-01

A series of coherent light pulses is generated by pumping a dye laser with the pulsed output of a copper-vapor laser at rates of as much as 20 kHz. Holograms are recorded at this pulse rate on a rotating holographic plate. This technique of high-speed holographic cinematography is demonstrated by viewing the bubble filaments that appear in water under the action of a sound field of high intensity.

Deposit formation and heat transfer in hydrocarbon rocket fuels

NASA Technical Reports Server (NTRS)

Giovanetti, A. J.; Spadaccini, L. J.; Szetela, E. J.

1983-01-01

An experimental research program was undertaken to investigate the thermal stability and heat transfer characteristics of several hydrocarbon fuels under conditions that simulate high-pressure, rocket engine cooling systems. The rates of carbon deposition in heated copper and nickel-plated copper tubes were determined for RP-1, propane, and natural gas using a continuous flow test apparatus which permitted independent variation and evaluation of the effect on deposit formation of wall temperature, fuel pressure, and fuel velocity. In addition, the effects of fuel additives and contaminants, cryogenic fuel temperatures, and extended duration testing with intermittent operation were examined. Parametric tests to map the thermal stability characteristics of RP-1, commercial-grade propane, and natural gas were conducted at pressures of 6.9 to 13.8 MPa, bulk fuel velocities of 30 to 90 m/s, and tube wall temperatures in the range of 230 to 810 K. Also, tests were run in which propane and natural gas fuels were chilled to 230 and 160 K, respectively. Corrosion of the copper tube surface was detected for all fuels tested. Plating the inside of the copper tubes with nickel reduced deposit formation and eliminated tube corrosion in most cases. The lowest rates of carbon deposition were obtained for natural gas, and the highest rates were obtained for propane. For all fuels tested, the forced-convection heat transfer film coefficients were satisfactorily correlated using a Nusselt-Reynolds-Prandtl number equation.

Epitaxial-Growth-Induced Junction Welding of Silver Nanowire Network Electrodes.

PubMed

Kang, Hyungseok; Song, Sol-Ji; Sul, Young Eun; An, Byeong-Seon; Yin, Zhenxing; Choi, Yongsuk; Pu, Lyongsun; Yang, Cheol-Woong; Kim, Youn Sang; Cho, Sung Min; Kim, Jung-Gu; Cho, Jeong Ho

2018-05-22

In this study, we developed a roll-to-roll Ag electroplating process for metallic nanowire electrodes using a galvanostatic mode. Electroplating is a low-cost and facile method for deposition of metal onto a target surface with precise control of both the composition and the thickness. Metallic nanowire networks [silver nanowires (AgNWs) and copper nanowires (CuNWs)] coated onto a polyethylene terephthalate (PET) film were immersed directly in an electroplating bath containing AgNO 3 . Solvated silver ions (Ag + ions) were deposited onto the nanowire surface through application of a constant current via an external circuit between the nanowire networks (cathode) and a Ag plate (anode). The amount of electroplated Ag was systematically controlled by changing both the applied current density and the electroplating time, which enabled precise control of the sheet resistance and optical transmittance of the metallic nanowire networks. The optimized Ag-electroplated AgNW (Ag-AgNW) films exhibited a sheet resistance of ∼19 Ω/sq at an optical transmittance of 90% (550 nm). A transmission electron microscopy study confirmed that Ag grew epitaxially on the AgNW surface, but a polycrystalline Ag structure was formed on the CuNW surface. The Ag-electroplated metallic nanowire electrodes were successfully applied to various electronic devices such as organic light-emitting diodes, triboelectric nanogenerators, and a resistive touch panel. The proposed roll-to-roll Ag electroplating process provides a simple, low-cost, and scalable method for the fabrication of enhanced transparent conductive electrode materials for next-generation electronic devices.

Analysis of metals with luster: Roman brass and silver

NASA Astrophysics Data System (ADS)

Fajfar, H.; Rupnik, Z.; Šmit, Ž.

2015-11-01

Non-destructive PIXE analysis using in-air proton beam was used for the studies of earliest brass coins issued during the 1st century BC by Greek cities in Asia Minor, Romans and Celts, and for the studies of plated low grade silver coins of the 3rd century AD. The analysis determined the levels of zinc and important trace elements, notably selenium, which confirms spread of selenium-marked copper from the east. For plating, combined tinning and silvering was identified by the mapping technique for the mid 3rd century AD, which evolved into mere plating by 270 AD.

The design and evaluation of superconducting connectors

NASA Technical Reports Server (NTRS)

Payne, J. E.

1982-01-01

The development of a superconducting connector for superconducting circuits on space flights is described. It is proposed that such connectors be used between the superconducting readout loop and the SQUID magnetometer in the Gravity Probe B experiment. Two types of connectors were developed. One type employs gold plated niobium wires making pressure connections to gold plated niobium pads. Lead-plated beryllium-copper spring contacts can replace the niobium wires. The other type is a rigid solder or weld connection between the niobium wires and the niobium pads. A description of the methods used to produce these connectors is given and their performance analyzed.

Magnetic catheter manipulation in the interventional MR imaging environment.

PubMed

Wilson, Mark W; Martin, Alastair B; Lillaney, Prasheel; Losey, Aaron D; Yee, Erin J; Bernhardt, Anthony; Malba, Vincent; Evans, Lee; Sincic, Ryan; Saeed, Maythem; Arenson, Ronald L; Hetts, Steven W

2013-06-01

To evaluate deflection capability of a prototype endovascular catheter, which is remotely magnetically steerable, for use in the interventional magnetic resonance (MR) imaging environment. Copper coils were mounted on the tips of commercially available 2.3-3.0-F microcatheters. The coils were fabricated in a novel manner by plasma vapor deposition of a copper layer followed by laser lithography of the layer into coils. Orthogonal helical (ie, solenoid) and saddle-shaped (ie, Helmholtz) coils were mounted on a single catheter tip. Microcatheters were tested in water bath phantoms in a 1.5-T clinical MR scanner, with variable simultaneous currents applied to the coils. Catheter tip deflection was imaged in the axial plane by using a "real-time" steady-state free precession MR imaging sequence. Degree of deflection and catheter tip orientation were measured for each current application. The catheter tip was clearly visible in the longitudinal and axial planes. Magnetic field artifacts were visible when the orthogonal coils at the catheter tip were energized. Variable amounts of current applied to a single coil demonstrated consistent catheter deflection in all water bath experiments. Changing current polarity reversed the observed direction of deflection, whereas current applied to two different coils resulted in deflection represented by the composite vector of individual coil activations. Microcatheter navigation through the vascular phantom was successful through control of applied current to one or more coils. Controlled catheter deflection is possible with laser lithographed multiaxis coil-tipped catheters in the MR imaging environment. Copyright © 2013 SIR. Published by Elsevier Inc. All rights reserved.

Development of Low-Carbon, Copper-Strengthened HSLA Steel Plate for Naval Ship Construction

DTIC Science & Technology

1990-06-01

steel plate microstructures, 2% nital etch . ...................................................... 13 2. Charpy V-notch impact energy transition for...met a minimum yield strength requirement of 80 ksi yield strength through 3/4 inch gage, had high Charpy V-notch impact energy at low tempera- tures...tempered HSLA line-pipe steels, which typically could not meet the minimum Charpy V-notch impact toughness requirement of 35 ft-lb at -1 200 F. In 1984

Standardized performance tests of collectors of solar thermal energy: A selectively coated, flat-plate copper collector with one transparent cover and a tube-to-tube spacing of 5 5/8 inches

NASA Technical Reports Server (NTRS)

1976-01-01

This preliminary data report gives basic test results of a flat-plate solar collector whose performance was determined in the NASA-Lewis solar simulator. The collector was tested over ranges of inlet temperatures, fluxes and coolant flow rates. Collector efficiency is correlated in terms of inlet temperature and flux level.

Fire Resistance Testing of Bulkhead and Deck Penetrations. Phase 2

DTIC Science & Technology

1988-12-01

thick steel plate. All sample 12 construction was representative of Class A-0 construction. The UL staff secured insulation ( rockwool batts) to the...designated side of the steel plates and penetrants for testing as Class A-60 deck assemblies. The rockwool batts complied with the Class A-60...insulated with rockwool batts and tested for a Class A-60 rating. This group consisted of one steel penetration, eight copper penetrations, four PVC

Preparation of nano fluids by mechanical method

NASA Astrophysics Data System (ADS)

Boopathy, J.; Pari, R.; Kavitha, M.; Angelo, P. C.

2012-07-01

Nanofluids are conventional heat transfer fluids that contain nano particles of metals, oxides, carbides, nitrides, or nanotubes. Nanofluids exhibit enhanced thermal conductivity and heat transfer coefficients compared to the base fluids. This paper presents the procedure for preparing nanofluids consisting of Copper and Aluminium nano powders in base fluids. Copper and Aluminium nano powders were produced by planetary ball wet milling at 300rpm for 50hrs. Toluene was added to ensure wet milling. These powders were characterized in XRD and SEM for their purity, particle size and shape. The XRD results confirmed the final particle sizes of Copper and Aluminium in the nano range. Then the 0.01 gm of nano metal powders was added in 150 ml of double distilled water and magnetic stirring was done at 1500 rpm for 15 minutes. Sodium lauryl sulphate (0.05%) was added in water as surfactant to ensure the stability of the dispersion. Ultrasonication in the 3000 watts bath was done for 10 minutes to enhance the uniform dispersion of metal powders in water. The pH, dynamic viscosity, ionic conductivity and the stability of the fluids were determined for further usage of synthesized nanofluids as coolant during grinding operation.

Polyimide surface modification by using microwave plasma for adhesion enhancement of Cu electroless plating.

PubMed

Cho, Sang-Jin; Nguyen, Trieu; Boo, Jin-Hyo

2011-06-01

Microwave (MW) plasma was applied to the surface of polyimide (PI) films as a treatment to enhance the adhesion between copper deposition layer and PI surface for electroless plating. The influences of nitrogen MW plasma treatment on chemical composition of the PI surface were investigated by using X-Ray photoelectron spectroscopy (XPS). The wettability was also investigated by water contact angle measurement. The surface morphologies of PI films before and after treatment were characterized with atomic force microscopy (AFM). The contact angle results show that was dramatically decreased to 16.1 degrees at the optimal treatment condition from 72.1 degrees (untreated PI). However, the root mean square (RMS) roughness of treated PI film was almost unchanged. The AFM roughness was stayed from 1.0 to 1.2 with/without plasma treatment. XPS data show a nitrogen increase when PI films exposed to N2 MW plasma. Electroless copper depositions were carried out with the free-formaldehyde method using glyoxylic acid as the reducing reagent and mixture palladium chloride, tin chloride as activation solution. Adhesion property between polyimide surface and copper layer was investigated by tape test.

Experimental investigations of tungsten inert gas assisted friction stir welding of pure copper plates

NASA Astrophysics Data System (ADS)

Constantin, M. A.; Boșneag, A.; Nitu, E.; Iordache, M.

2017-10-01

Welding copper and its alloys is usually difficult to join by conventional fusion welding processes because of high thermal diffusivity of the copper, alloying elements, necessity of using a shielding gas and a clean surface. To overcome this inconvenience, Friction Stir Welding (FSW), a solid state joining process that relies on frictional heating and plastic deformation, is used as a feasible welding process. In order to achieve an increased welding speed and a reduction in tool wear, this process is assisted by another one (WIG) which generates and adds heat to the process. The aim of this paper is to identify the influence of the additional heat on the process parameters and on the welding joint properties (distribution of the temperature, hardness and roughness). The research includes two experiments for the FSW process and one experiment for tungsten inert gas assisted FSW process. The outcomes of the investigation are compared and analysed for both welding variants. Adding a supplementary heat source, the plates are preheated and are obtain some advantages such as reduced forces used in process and FSW tool wear, faster and better plasticization of the material, increased welding speed and a proper weld quality.

DCT-TCI: Real Gas Characterization of Plasma Flow Control - An Integrated Approach

DTIC Science & Technology

2011-12-23

as Navier-Stokes equations are solved in this study. We utilize the two-species basic model to reduce the computational complexity of plasma...constant of 3.0. Copper tape was first adhered to both sides of a 3 mm thick acrylic plate. A negative photo-resist, a transparent film and a UV light...ferric chloride. The reminiscence of the adhesive glue left behind by the copper tape was removed using a solvent such as methanol or acetone. The

Detection of lack of fusion using opaque additives, phase 2

NASA Technical Reports Server (NTRS)

Cook, J. L.

1973-01-01

Plasma-sprayed copper coatings were developed to protect the aluminum surfaces of spacecraft structures from oxidation, as well as to provide a means of reliable nondestructive X-ray inspection of possible incomplete weldment penetration. Sixty day storage tests of coated aluminum samples indicated the promise of long-term oxidation protection, but revealed no advantage in detecting penetration defects. Delta-scan techniques were used, and peen plating as a means of applying copper to the aluminum surface was investigated.

Suppressing tin whisker growth in lead-free solders and platings

DOEpatents

Hoffman, Elizabeth N; Lam, Poh-Sang

2014-04-29

A process of irradiation Sn containing Pb-free solder to mitigate whisker formation and growth thereon is provided. The use of gamma radiation such as cobalt-60 has been applied to a substrate of Sn on copper has been found to change the morphology of the crystalline whisker growth to a more truncated hillock pattern. The change in morphology greatly reduces the tendency of whiskers to contribute to electrical short-circuits being used as a Pb-free solder system on a copper substrate.

Mechanical properties and microstructure of copper alloys and copper alloy-stainless steel laminates for fusion reactor high heat flux applications

NASA Astrophysics Data System (ADS)

Leedy, Kevin Daniel

A select group of copper alloys and bonded copper alloy-stainless steel panels are under consideration for heat sink applications in first wall and divertor structures of a planned thermonuclear fusion reactor. Because these materials must retain high strengths and withstand high heat fluxes, their material properties and microstructures must be well understood. Candidate copper alloys include precipitate strengthened CuNiBe and CuCrZr and dispersion strengthened Cu-Alsb2Osb3 (CuAl25). In this study, uniaxial mechanical fatigue tests were conducted on bulk copper alloy materials at temperatures up to 500sp°C in air and vacuum environments. Based on standardized mechanical properties measurement techniques, a series of tests were also implemented to characterize copper alloy-316L stainless steel joints produced by hot isostatic pressing or by explosive bonding. The correlation between mechanical properties and the microstructure of fatigued copper alloys and the interface of copper alloy-stainless steel laminates was examined. Commercial grades of these alloys were used to maintain a degree of standardization in the materials testing. The commercial alloys used were OMG Americas Glidcop CuAl25 and CuAl15; Brush Wellman Hycon 3HP and Trefimetaux CuNiBe; and Kabelmetal Elbrodur and Trefimetaux CuCrZr. CuAl25 and CuNiBe alloys possessed the best combination of fatigue resistance and microstructural stability. The CuAl25 alloy showed only minimal microstructural changes following fatigue while the CuNiBe alloy consistently exhibited the highest fatigue strength. Transmission electron microscopy observations revealed that small matrix grain sizes and high densities of submicron strengthening phases promoted homogeneous slip deformation in the copper alloys. Thus, highly organized fatigue dislocation structure formation, as commonly found in oxygen-free high conductivity Cu, was inhibited. A solid plate of CuAl25 alloy hot isostatically pressed to a 316L stainless steel plate showed the best overall mechanical properties of the studied bi-metallic bonded panels. Bond properties were nominally inferior to constituent bulk material properties and fracture toughness values, in particular, were quite low for all bonded laminates. Delamination near the copper alloy-stainless steel interface was the dominate failure mode in the bi-metallic panels. The joining processes caused microstructural alterations in the bond interfacial regions including: microporosity, new precipitate formation, existing precipitate morphology changes and interdiffusion of constituent elements.

Combined Mini-Cylex & Disk Acceleration Tests in Type K Copper

DOE PAGES

Maines, Warren Russell; Kittell, David E.; Hobbs, Michael L.

2018-04-16

In this work, we combined the miniature cylinder expansion test (Mini-Cylex), with the Disk Acceleration Test (DAX) using Type K copper, Picatinny Liquid Explosive, and photonic Doppler velocimetry. We estimated the CJ state using plate reverberation methods at the test cap. We extracted velocities at 2, 7, and 10 volume expansions to fit Jones-Wilkins-Lee Equation of State and estimated Gurney velocity at the tube wall. The test also provides an additional method to estimate reaction products Hugoniot through knowledge of the copper test cap. Our experiments and simulations are within expected uncertainty. Lastly, the test and the analysis effectively reducemore » costs while keeping or increasing fidelity.« less

Combined Mini-Cylex & Disk Acceleration Tests in Type K Copper

DOE Office of Scientific and Technical Information (OSTI.GOV)

Maines, Warren Russell; Kittell, David E.; Hobbs, Michael L.

In this work, we combined the miniature cylinder expansion test (Mini-Cylex), with the Disk Acceleration Test (DAX) using Type K copper, Picatinny Liquid Explosive, and photonic Doppler velocimetry. We estimated the CJ state using plate reverberation methods at the test cap. We extracted velocities at 2, 7, and 10 volume expansions to fit Jones-Wilkins-Lee Equation of State and estimated Gurney velocity at the tube wall. The test also provides an additional method to estimate reaction products Hugoniot through knowledge of the copper test cap. Our experiments and simulations are within expected uncertainty. Lastly, the test and the analysis effectively reducemore » costs while keeping or increasing fidelity.« less

Interfacial microstructure and properties of copper clad steel produced using friction stir welding versus gas metal arc welding

DOE Office of Scientific and Technical Information (OSTI.GOV)

Shen, Z.; Chen, Y.; Haghshenas, M., E-mail: mhaghshe@uwaterloo.ca

A preliminary study compares the feasibility and microstructures of pure copper claddings produced on a pressure vessel A516 Gr. 70 steel plate, using friction stir welding versus gas metal arc welding. A combination of optical and scanning electron microscopy is used to characterize the grain structures in both the copper cladding and heat affected zone in the steel near the fusion line. The friction stir welding technique produces copper cladding with a grain size of around 25 μm, and no evidence of liquid copper penetration into the steel. The gas metal arc welding of copper cladding exhibits grain sizes overmore » 1 mm, and with surface microcracks as well as penetration of liquid copper up to 50 μm into the steel substrate. Transmission electron microscopy reveals that metallurgical bonding is produced in both processes. Increased diffusion of Mn and Si into the copper cladding occurs when using gas metal arc welding, although some nano-pores were detected in the FSW joint interface. - Highlights: • Cladding of steel with pure copper is possible using either FSW or GMAW. • The FSW yielded a finer grain structure in the copper, with no evidence of cracking. • The FSW joint contains some evidence of nano-pores at the interface of the steel/copper. • Copper cladding by GMAW contained surface cracks attributed to high thermal stresses. • The steel adjacent to the fusion line maintained a hardness value below 248 HV.« less

Studies on the reduction of radon plate-out

DOE Office of Scientific and Technical Information (OSTI.GOV)

Bruemmer, M.; Nakib, M.; Calkins, R.

The decay of common radioactive gases, such as radon, produces stable isotopes by a sequence of daughter particles with varied half-lives. These daughter particles are a significant source of gamma, neutron, and alpha (α) particle backgrounds that can mimic desired signals in dark matter and neutrinoless double beta decay experiments. In the LUMINA Laboratory at Southern Methodist University (SMU), studies of radon plate-out onto copper samples are conducted using one of XIA’s first five UltraLo 1800 alpha counters. We present results from investigations into various mitigation approaches. A custom-built copper holder (in either plastic or metal) has been designed andmore » produced to maximize the copper’s exposure to {sup 220}Rn. The {sup 220}Rn source is a collection of camping lantern mantles. We present the current status of control and experimental methods for addressing radon exposure levels.« less

Three-dimensional atlas of iron, copper, and zinc in the mouse cerebrum and brainstem.

PubMed

Hare, Dominic J; Lee, Jason K; Beavis, Alison D; van Gramberg, Amanda; George, Jessica; Adlard, Paul A; Finkelstein, David I; Doble, Philip A

2012-05-01

Atlases depicting molecular and functional features of the brain are becoming an integral part of modern neuroscience. In this study we used laser ablation-inductively coupled plasma-mass spectrometry (LA-ICPMS) to quantitatively measure iron (Fe), copper (Cu), and zinc (Zn) levels in a serially sectioned C57BL/6 mouse brain (cerebrum and brainstem). Forty-six sections were analyzed in a single experiment of approximately 158 h in duration. We constructed a 46-plate reference atlas by aligning quantified images of metal distribution with corresponding coronal sections from the Allen Mouse Brain Reference Atlas. The 46 plates were also used to construct three-dimensional models of Fe, Cu, and Zn distribution. This atlas represents the first reconstruction of quantitative trace metal distribution through the brain by LA-ICPMS and will facilitate the study of trace metals in the brain and help to elucidate their role in neurobiology.

Study on Temperature Control System Based on SG3525

NASA Astrophysics Data System (ADS)

Cheng, Cong; Zhu, Yifeng; Wu, Junfeng

2017-12-01

In this paper, it uses the way of dry bath temperature to heat the microfluidic chip directly by the heating plate and the liquid sample in microfluidic chip is heated through thermal conductivity, thus the liquid sample will maintain at target temperature. In order to improve the reliability of the whole machine, a temperature control system based on SG3525 is designed.SG3525 is the core of the system which uses PWM wave produced by itself to drive power tube to heat the heating plate. The bridge circuit consisted of thermistor and PID regulation ensure that the temperature can be controlled at 37 °C with a correctness of ± 0.2 °C and a fluctuation of ± 0.1 °C.

PROCESS OF ELECTROPLATING METALS WITH ALUMINUM

DOEpatents

Schickner, W.C.

1960-04-26

A process of electroplating aluminum on metals from a nonaqueous bath and a novel method of pretreating or conditioning the metal prior to electrodeposition of the aluminum are given. The process of this invention, as applied by way of example to the plating of uranium, comprises the steps of plating the uranium with the barrier inetal, immersing the barrier-coated uranium in fatty acid, and electrolyzing a water-free diethyl ether solution of aluminum chloride and lithium hydride while making the uranium the cathode until an aluminum deposit of the desired thickness has been formed. According to another preferred embodiment the barrier-coated uranium is immersed in an isopropyl alcohol solution of sterato chromic chloride prior to the fatty acid treatment of this invention.

Aluminum and Other Coatings for the Passivation of Tritium Storage Vessels

DOE Office of Scientific and Technical Information (OSTI.GOV)

Spencer, W.; Korinko, P.

Using a highly sensitive residual gas analyzer, the off-gassing of hydrogen, water, and hydrocarbons from surface-treated storage vessels containing deuterium was measured. The experimental storage vessels were compared to a low-off-gassing, electro-polished 304L canister. Alternative vessels were made out of aluminum, or were coatings on 304L steel. Coatings included powder pack aluminide, electro-plated aluminum, powder pack chromide, dense electro-plated chromium, copper plated, and copper plated with 25 and 50 percent nano-diamond. Vessels were loaded with low pressure deuterium to observe exchange with protium or hydrogen as observed with formation of HD and HDO. Off gas of D 2O or possiblemore » CD 4 was observed at mass 20. The main off-gas in all of the studies was H 2. The studies indicated that coatings required significant post-coating treatment to reduce off-gas and enhance the permeation barrier from gases likely added during the coating process. Dense packed aluminum coatings needed heating to drive off water. Electro-plated aluminum, chromium and copper coatings appeared to trap hydrogen from the plating process. Nano-diamond appeared to enhance the exchange rate with hydrogen off gas, and its coating process trapped significant amounts of hydrogen. Aluminum caused more protium exchange than chromium-treated surfaces. Aluminum coatings released more water, but pure aluminum vessels released small amounts of hydrogen, little water, and generally performed well. Chromium coating had residual hydrogen that was difficult to totally outgas but otherwise gave low residuals for water and hydrocarbons. Our studies indicated that simple coating of as received 304L metal will not adequately block hydrogen. The base vessel needs to be carefully out-gassed before applying a coating, and the coating process will likely add additional hydrogen that must be removed. Initial simple bake-out and leak checks up to 350° C for a few hours was found to be inadequate. All of the studies indicated that vessels needed several days of vacuum baking at 350-450° C to fully outgas the residual gases, which were mostly hydrogen. The current standard practice of out-gassing from ultra-clean, electro-polished 304L vessels with both vacuum bake-out and followed by an oxidative bake out to enhance the chromium surface performed the best in these studies.« less

Aluminum electroplating on steel from a fused bromide electrolyte

DOE Office of Scientific and Technical Information (OSTI.GOV)

Prabhat K. Tripathy; Laura A. Wurth; Eric J. Dufek

A quaternary bromide bath (LiBr–KBr–CsBr–AlBr3) was used to electro-coat aluminum on steel substrates. The electrolytewas prepared by the addition of AlBr3 into the eutectic LiBr–KBr–CsBr melt. A smooth, thick, adherent and shiny aluminum coating could be obtained with 80 wt.% AlBr3 in the ternary melt. The SEM photographs of the coated surfaces suggest the formation of thick and dense coatings with good aluminum coverage. Both salt immersion and open circuit potential measurement suggested that the coatings did display a good corrosionresistance behavior. Annealing of the coated surfaces, prior to corrosion tests, suggested the robustness of the metallic aluminum coating inmore » preventing the corrosion of the steel surfaces. Studies also indicated that the quaternary bromide plating bath can potentially provide a better aluminumcoating on both ferrous and non-ferrous metals, including complex surfaces/geometries.« less

Aluminium Electroplating on Steel from a Fused Bromide Electrolyte

DOE Office of Scientific and Technical Information (OSTI.GOV)

Prabhat Tripathy; Laura Wurth; Eric Dufek

A quaternary bromide bath (LiBr-KBr-CsBr-AlBr3) was used to electro-coat aluminium on steel substrates. The electrolyte was prepared by the addition of AlBr3 into the eutectic LiBr-KBr-CsBr melt. A smooth, thick, adherent and shiny aluminium coating could be obtained with 80 wt.% AlBr3 in the ternary melt. The SEM photographs of the coated surfaces suggest the formation of thick and dense coatings with good aluminium coverage. Both salt immersion and open circuit potential measurement suggest that the coatings did display good corrosion-resistance behavior. Annealing of the coated surfaces, prior to corrosion tests, suggested the robustness of the metallic aluminium coating inmore » preventing the corrosion of the steel surfaces. Studies also indicated that the quaternary bromide plating bath can potentially provide a better aluminium coating on both ferrous and non-ferrous metals, including complex surfaces/geometries.« less

Cleaning and passivation of copper surfaces to remove surface radioactivity and prevent oxide formation

NASA Astrophysics Data System (ADS)

Hoppe, E. W.; Seifert, A.; Aalseth, C. E.; Bachelor, P. P.; Day, A. R.; Edwards, D. J.; Hossbach, T. W.; Litke, K. E.; McIntyre, J. I.; Miley, H. S.; Schulte, S. M.; Smart, J. E.; Warren, G. A.

2007-08-01

High-purity copper is an attractive material for constructing ultra-low-background radiation measurement devices. Many low-background experiments using high-purity copper have indicated surface contamination emerges as the dominant background. Radon daughters plate out on exposed surfaces, leaving a residual 210Pb background that is difficult to avoid. Dust is also a problem; even under cleanroom conditions, the amount of U and Th deposited on surfaces can represent the largest remaining background. To control these backgrounds, a copper cleaning chemistry has been developed. Designed to replace an effective, but overly aggressive concentrated nitric acid etch, this peroxide-based solution allows for a more controlled cleaning of surfaces. The acidified hydrogen peroxide solution will generally target the Cu +/Cu 2+ species which are the predominant surface participants, leaving the bulk of copper metal intact. This preserves the critical tolerances of parts and eliminates significant waste disposal issues. Accompanying passivation chemistry has also been developed that protects copper surfaces from oxidation. Using a high-activity polonium surface spike, the most difficult-to-remove daughter isotope of radon, the performance of these methods are quantified.

Electroplating Gold-Silver Alloys for Spherical Capsules for NIF Double-Shell Targets

DOE Office of Scientific and Technical Information (OSTI.GOV)

Bhandarkar, N.; Horwood, C.; Bunn, T.

For Inertial Confinement Fusion (ICF) implosions, a design based on gradients of high and mid Z materials could potentially be more robust than single element capsule systems. To that end, gold and silver alloys were electroplated on 2.0 mm diameter surrogate brass spheres using a new flow–based pulsed plating method specifically designed to minimize surface roughness without reducing plating rates. The coatings were analyzed by scanning electron microscope (SEM) and white light interferometry for surface topography, and by energy dispersive x-ray spectroscopy (EDX) to determine near-surface gold and silver compositions. The alloy range attainable was 15 to 85 weight percentmore » gold using 1:1 and 1:3 silver to gold ratio plating baths at applied potentials of -0.7 volts to -1.8 volts. This range was bounded by the open circuit potential of the system and hydrogen evolution, and in theory could be extended by using ionic liquids or aprotic solutions. Preliminary gradient trials proved constant composition alloy data could be translated to smooth gradient plating, albeit at higher gold compositions.« less

The interaction of copper ions with Staphylococcus aureus, Pseudomonas aeruginosa, and Escherichia coli: an X-ray absorption near-edge structure (XANES) spectroscopy study.

PubMed

Zanzen, Ulrike; Bovenkamp-Langlois, Lisa; Klysubun, Wantana; Hormes, Josef; Prange, Alexander

2018-04-01

The antimicrobial properties of copper ions have been known for a long time. However, the exact mechanism of action of the transition metal on microorganisms has long been unclear. X-ray absorption near-edge structure (XANES) spectroscopy at the Cu K edge allows the determination of copper speciation in Staphylococcus aureus, Escherichia coli, and Pseudomonas aeruginosa that have been treated with Cu(II) and Cu(I) solutions. The death/inactivation of the bacteria was observed using plate counting and light microscopy. The Cu K-XANES spectra of the two Gram-negative bacteria are different than those of the Gram-positive strain. The results clearly show that the Cu + -S bond contributes to the antibacterial activity of copper, as in the case of silver. The detailed evaluation of the differentiated absorption spectra shows that Cu + (not Cu 2+ ) is the dominant ion that binds to the bacteria. Because Cu + is not the most common copper ion, copper is not as effective an antibacterial agent as silver, whose common valency is actually + 1. Any reaction of copper with phosphorus from the bacteria can be excluded after the evaluation of the absorption spectra.

Qualifications of Bonding Process of Temperature Sensors to Deep-Space Missions

NASA Technical Reports Server (NTRS)

Ramesham, Rajeshuni; Kitiyakara, Amarit; Redick, Richard W., III; Sunada, Eric T.

2011-01-01

A process has been examined for bonding a platinum resistance thermometer (PRT) onto potential aerospace materials such as flat aluminum surfaces and a flexible copper tube to simulate coaxial cables for flight applications. Primarily, PRTs were inserted into a silver-plated copper braid to avoid stresses on the sensor while the sensor was attached with the braid to the base material for long-duration, deep-space missions. A1-1145/graphite composite (planar substrate) and copper tube have been used in this study to assess the reliability of PRT bonding materials. A flexible copper tube was chosen to simulate the coaxial cable to attach PRTs. The substrate materials were cleaned with acetone wipes to remove oils and contaminants. Later, the surface was also cleaned with ethyl alcohol and was air-dried. The materials were gently abraded and then were cleaned again the same way as previously mentioned. Initially, shielded (silver plated copper braid) PRT (type X) test articles were fabricated and cleaned. The base antenna material was pretreated and shielded, and CV-2566 NuSil silicone was used to attach the shielded PRT to the base material. The test articles were cured at room temperature and humidity for seven days. The resistance of the PRTs was continuously monitored during the thermal cycling, and the test articles were inspected prior to, at various intermediate steps during, and at the end of the thermal cycling as well. All of the PRTs survived three times the expected mission life for the JUNO project. No adhesion problems were observed in the PRT sensor area, or under the shielded PRT. Furthermore, the PRT resistance accurately tracked the thermal cycling of the chamber.

Processing industrial wastes with the liquid-phase reduction romelt process

NASA Astrophysics Data System (ADS)

Romenets, V.; Valavin, V.; Pokhvisnev, Yu.; Vandariev, S.

1999-08-01

The Romelt technology for liquid-phase reduction has been developed for processing metallurgical wastes containing nonferrousmetal components. Thermodynamic calculations were made to investigate the behavior of silver, copper, zinc, manganese, vanadium, chrome, and silicon when reduced from the slag melt into the metallic solution containing iron. The process can be applied to all types of iron-bearing wastes, including electric arc furnace dust. The distribution of elements between the phases can be controlled by adjusting the slag bath temperature. Experiments at a pilot Romelt plant proved the possibility of recovering the metallurgical wastes and obtaining iron.

Rapid recovery of dilute copper from a simulated Cu-SDS solution with low-cost steel wool cathode reactor.

PubMed

Chang, Shih-Hsien; Wang, Kai-Sung; Hu, Pei-I; Lui, I-Chun

2009-04-30

Copper-surfactant wastewaters are often encountered in electroplating, printed circuit boards manufacturing, and metal finishing industries, as well as in retentates from micellar-enhanced ultrafiltration process. A low-cost three-dimensional steel wool cathode reactor was evaluated for electrolytic recovery of Cu ion from dilute copper solution (0.2mM) in the presence of sodium dodecyl sulfate (SDS), octylphenol poly (ethyleneglycol) 9.5 ether (TX), nonylphenol poly (oxyethylene) 9 ether (NP9) and polyoxyethylene (20) sorbitan monooleate (TW) and also mixed surfactants (anionic/nonionic). The reactor showed excellent copper recovery ability in comparison to a parallel-plate reactor. The reactor rapidly recovered copper with a reasonable current efficiency. 93% of copper was recovered at current density of 1 A m(-2) and pH 4 in the presence of 8.5mM SDS. Initial solution pH, cathodic current density, solution mixing condition, SDS concentration, and initial copper concentrations significantly influenced copper recovery. The copper recovery rate increased with an increase in aqueous SDS concentrations between 5 and 8.5mM. The influences of nonionic surfactants on Cu recovery from SDS-Cu solution depended not only on the type of surfactants used, but also on applied concentrations. From the copper recovery perspective, TX at 0.1mM or NP should be selected rather than TW, because they did not inhibit copper recovery from SDS-Cu solution.

Report on accelerated corrosion studies.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Mowry, Curtis Dale; Glass, Sarah Jill; Sorensen, Neil Robert

2011-03-01

Sandia National Laboratories (SNL) conducted accelerated atmospheric corrosion testing for the U.S. Consumer Product Safety Commission (CPSC) to help further the understanding of the development of corrosion products on conductor materials in household electrical components exposed to environmental conditions representative of homes constructed with problem drywall. The conditions of the accelerated testing were chosen to produce corrosion product growth that would be consistent with long-term exposure to environments containing humidity and parts per billion (ppb) levels of hydrogen sulfide (H{sub 2}S) that are thought to have been the source of corrosion in electrical components from affected homes. This report documentsmore » the test set-up, monitoring of electrical performance of powered electrical components during the exposure, and the materials characterization conducted on wires, screws, and contact plates from selected electrical components. No degradation in electrical performance (measured via voltage drop) was measured during the course of the 8-week exposure, which was approximately equivalent to 40 years of exposure in a light industrial environment. Analyses show that corrosion products consisting of various phases of copper sulfide, copper sulfate, and copper oxide are found on exposed surfaces of the conductor materials including wires, screws, and contact plates. The morphology and the thickness of the corrosion products showed a range of character. In some of the copper wires that were observed, corrosion product had flaked or spalled off the surface, exposing fresh metal to the reaction with the contaminant gasses; however, there was no significant change in the wire cross-sectional area.« less

78 FR 7394 - Foreign-Trade Zone 41-Milwaukee, WI; Notification of Proposed Production Activity; CNH America...

Federal Register 2010, 2011, 2012, 2013, 2014

2013-02-01

.... On its domestic sales, CNH would be able to choose the duty rates during customs entry procedures... hoses, copper alloy adapters, aluminum plates, feed filters, GPS kits including electrical connections...

Measurement of dew droplets in initial deposition at dew point by using a phase-shift interference microscope

NASA Astrophysics Data System (ADS)

Matsumoto, Shigeaki; Toyooka, Satoru; Hoshino, Mitsuo

2002-09-01

In order to measure the total mass per unit area of dew droplets deposited on a metal plate in the dew-point hygrometer, the shape of a dew droplet deposited on a copper plate was measured accurately by using an interference microscope that employed a phase-shift technique. The microscope was constructed by adding a piezoelectric transducer to an usual interference microscope. A simple method that uses a conventional speaker horn and an optical fiber cable was introduced to depress speckle noise. The shape of a dew droplet deposited on the copper plate surface with 0.1 μm in average roughness was measured with an accuracy of +/-3nm. The mass of a dew droplet could be calculated numerically from the volume of its shape and was of the order of 10-9 g. The total mass of dew droplets deposited per unit area and the deposition velocity were obtained under a gentle wind. The total mass was the order of 10-5 g/cm2 at the beginning of deposition and the deposition velocity was ranged from 2x10-6 to 6x10-5 g/cm2.min.

Adiabatic Compression Sensitivity of AF-M315E

DTIC Science & Technology

2015-07-01

the current work is to expand the knowledge base from previous experiments completed at AFRL for AF-M315E in stainless steel U-tubes at room...addressed, to some degree, with the use of clamps and a large stainless steel plate to dissipate any major vibrations. A large preheated bath of 50:50 v/v...autocatalytic chain decomposition in the propellant. This exothermic decomposition decreases the fume -off initiation temperature of the propellant and its

Mössbauer and X-ray Diffraction Investigations of Sn-containing Binary and Ternary Electrodeposited Alloys from a Gluconate Bath

NASA Astrophysics Data System (ADS)

Kuzmann, E.; Stichleutner, S.; Doyle, O.; Chisholm, C. U.; El-Sharif, M.; Homonnay, Z.; Vértes, A.

2005-04-01

Constant current technique was applied to electrodeposit tin-containing coatings such as tin-cobalt (Sn-Co), tin-iron (Sn-Fe) and a novel tin-cobalt-iron (Sn-Co-Fe) from a gluconate bath. The effect of plating parameters (current density, deposition time at an electrolyte temperature of 60°C and pH=7.0) on phase composition, crystal structure and magnetic anisotropy of alloy deposits has been investigated mainly by 57Fe CEMS, 119Sn CEMS and transmission Mössbauer Spectroscopy as well as XRD. 57Fe and 119Sn CEM spectra and XRD reflect that the dominant phases of the deposits are orthorhombic Co3Sn2, tetragonal FeSn2 or amorphous Fe-Sn and amorphous Sn-Co-Fe in Sn-Co, Sn-Fe and Sn-Co-Fe coatings, respectively. Furthermore, the relative area of the 2nd and 5th lines of the sextets representing the magnetic iron containing phases decreases continuously with increasing current density in all Fe-containing deposits. At the same time, no essential change in the magnetic anisotropy can be found with the plating time. 119Sn spectra reveal the presence of small amount of β-Sn besides the main phases in Sn-Fe and in the Sn-Co coatings. Magnetically split 119Sn spectra reflecting transferred hyperfine field were observed in the case of Co-Sn-Fe coatings.

Indoor test for thermal performance evaluation of Lenox-Honeywell solar collector. [conducted using Marshall Space Flight Center Solar Simulator

NASA Technical Reports Server (NTRS)

Shih, K.

1977-01-01

The test procedures used and the test results obtained from an evaluation test program conducted on a double-covered liquid solar collector under simulated conditions are presented. The test article was a flat plate solar collector using liquid as the heat transfer medium. The absorber plate was steel with the copper tubes bonded on the upper surface. The plate was coated with black chrome with an absorptivity factor of .95 and emissivity factor of .12. A time constant test and incident angle modifier test were conducted to determine the transient effect and the incident angle effect on the collector.

A Black Phosphate Conversion Coating on Steel Surface Using Antimony(III)-Tartrate as an Additive

NASA Astrophysics Data System (ADS)

Li, Feng; Wang, Guiping

2016-05-01

A novel black phosphate conversion coating was formed on steel surface through a Zn-Mn phosphating bath containing mainly ZnO, H3PO4, Mn(H2PO4)2, and Ca(NO3)2, where antimony(III)-tartrate was used as the blackening agent of phosphatization. The surface morphology and composition of the coating were characterized by scanning electron microscopy, energy dispersion spectroscopy, and x-ray photoelectron spectroscopy. Corrosion resistance of the coating was studied by potentiodynamic polarization curves and electrochemical impedance spectroscopy. The pH value of the solution had significant influence on the formation and corrosion resistance of the coating. The experimental results indicated that the Sb plays a vital role in the blackening of phosphate conversion coating. The optimal concentration of antimony(III)-tartrate in the phosphating bath used in this experiment was 1.0 g L-1, as higher values reduced the corrosion resistance of the coating. In addition, by saponification and oil seals, the corrosion duration of the black phosphate coating in a copper sulfate spot test can be as long as 20 min.

Survival of the faucet snail after chemical disinfection, pH extremes, and heated water bath treatments

USGS Publications Warehouse

Mitchell, A.J.; Cole, Rebecca A.

2008-01-01

The faucet snail Bithynia tentaculata, a nonindigenous aquatic snail from Eurasia, was introduced into Lake Michigan in 1871 and has spread to the mid-Atlantic states, the Great Lakes region, Montana, and most recently, the Mississippi River. The faucet snail serves as intermediate host for several trematodes that have caused large-scale mortality among water birds, primarily in the Great Lakes region and Montana. It is important to limit the spread of the faucet snail; small fisheries equipment can serve as a method of snail distribution. Treatments with chemical disinfection, pH extremes, and heated water baths were tested to determine their effectiveness as a disinfectant for small fisheries equipment. Two treatments eliminated all test snails: (1) a 24-h exposure to Hydrothol 191 at a concentration of at least 20 mg/L and (2) a treatment with 50°C heated water for 1 min or longer. Faucet snails were highly resistant to ethanol, NaCl, formalin, Lysol, potassium permanganate, copper sulfate, Baquacil, Virkon, household bleach, and pH extremes (as low as 1 and as high as 13).

Selective coating for collecting solar energy on aluminum

NASA Technical Reports Server (NTRS)

Lowery, J. R.

1974-01-01

Presently used coatings, which were originally developed for brass, copper, and steel substrates, yield relatively low absorptance/emittance ratios when applied to aluminum. Efficient, black-nickel plating applied to aluminum substrate enhances solar absorptance to 93% and reduces emittance to 6%.

77 FR 12556 - Certain Steel Nails From the People's Republic of China: Final Results and Final Partial...

Federal Register 2010, 2011, 2012, 2013, 2014

2012-03-01

..., respectively. Case History On September 12, 2011, the Department published in the Federal Register the... Comment 6: Stanley's Surrogate Values A. Copper Plated Steel Welding Wire B. Sodium Sulfate C. Glass Balls...

Transient thermal analysis during friction stir welding between AA2014-T6 and pure copper

NASA Astrophysics Data System (ADS)

Gadhavi, A. R.; Ghetiya, N. D.; Patel, K. M.

2018-04-01

AA2xxx-Cu alloys showed larger applications in the defence sectors and in aerospace industries due to high strength to weight ratio and toughness. FSW in a butt joint configuration was carried out between AA2014-T6 and pure Copper placing AA2014 on AS and Cu on RS. Temperature profiles were observed by inserting K-type thermocouples in the mid-thickness at various locations of the plate. A sharp decrease in temperature profiles was observed on Copper side due to its higher thermal conductivity. A thermal numerical model was prepared in ANSYS to compare the simulated temperature profiles with the experimental temperature profiles and both the temperature profiles were found to be in good agreement.

Model of the porphyry copper and polymetallic vein family of deposits - Applications in Slovakia, Hungary, and Romania

USGS Publications Warehouse

Drew, L.J.

2003-01-01

A tectonic model useful in estimating the occurrence of undiscovered porphyry copper and polymetallic vein systems has been developed. This model is based on the manner in which magmatic and hydrothermal fluids flow and are trapped in fault systems as far-field stress is released in tectonic strain features above subducting plates (e.g. strike-slip fault systems). The structural traps include preferred locations for stock emplacement and tensional-shear fault meshes within the step-overs that localize porphyry- and vein-style deposits. The application of the model is illustrated for the porphyry copper and polymetallic vein deposits in the Central Slovakian Volcanic Field, Slovakia; the Ma??tra Mountains, Hungary; and the Apuseni Mountains, Romania.

Star tracking reticles

NASA Technical Reports Server (NTRS)

Smith, W. O.; Toft, A. R. (Inventor)

1973-01-01

A method for the production of reticles, particularly those for use in outer space, where the product is a quartz base coated with highly adherent layers of chromium, chromium-silver, and silver vacuum deposited through a mask, and then coated with an electrodeposit of copper from a copper sulfate solution followed by an electrodeposit of black chromium is described. The masks are produced by coating a beryllium-copper alloy substrate with a positive working photoresist, developing the photoresist, according to a pattern to leave a positive mask, plating uncoated areas with gold, removing the photoresist, coating the substrate with a negative working photoresist, developing the negative working photoresist to expose the base metal of the pattern, and chemically etching the unplated side of the pattern to produce the mask.

Thermal conductance of gold plated metallic contacts at liquid helium temperatures

NASA Technical Reports Server (NTRS)

Kittel, Peter; Spivak, Alan L.; Salerno, Louis J.

1992-01-01

The thermal conductance of gold plated OFHC copper, 6061-T6 aluminum, free-machining brass, and 304 stainless steel contacts has been measured over the temperature range of 1.6 to 4.2 K, with applied forces from 22 N to 670 N. The contact surfaces were prepared with a 0.8 micron lapped finish prior to gold coating. It was found that for all materials, except stainless steel, the thermal conductance was significantly improved as the result of gold coating the contact surfaces.

Ionization chamber dosimeter

DOEpatents

Renner, Tim R.; Nyman, Mark A.; Stradtner, Ronald

1991-01-01

A method for fabricating an ion chamber dosimeter collecting array of the type utilizing plural discrete elements formed on a uniform collecting surface which includes forming a thin insulating layer over an aperture in a frame having surfaces, forming a predetermined pattern of through holes in the layer, plating both surfaces of the layer and simultaneously tilting and rotating the frame for uniform plate-through of the holes between surfaces. Aligned masking and patterned etching of the surfaces provides interconnects between the through holes and copper leads provided to external circuitry.

CALUTRON ION SOURCE

DOEpatents

Lofgren, E.J.

1959-02-17

An improvement is described in ion source mechanisms whereby the source structure is better adapted to withstanid the ravages of heat, erosion, and deterioration concomitant with operation of an ion source of the calutron type. A pair of molybdenum plates define the exit opening of the arc chamber and are in thermal contact with the walls of the chamber. These plates are maintained at a reduced temperature by a pair of copper blocks in thermal conducting contact therewith to form subsequent diverging margins for the exit opening.

Storing Drinking-water in Copper pots Kills Contaminating Diarrhoeagenic Bacteria

PubMed Central

Sudha, V.B. Preethi; Ganesan, Sheeba; Pazhani, G.P.; Ramamurthy, T.; Nair, G.B.

2012-01-01

Microbially-unsafe water is still a major concern in most developing countries. Although many water-purification methods exist, these are expensive and beyond the reach of many people, especially in rural areas. Ayurveda recommends the use of copper for storing drinking-water. Therefore, the objective of this study was to evaluate the effect of copper pot on microbially-contaminated drinking-water. The antibacterial effect of copper pot against important diarrhoeagenic bacteria, including Vibrio cholerae O1, Shigella flexneri 2a, enterotoxigenic Escherichia coli, enteropathogenic E. coli, Salmonella enterica Typhi, and Salmonella Paratyphi is reported. When drinking-water (pH 7.83±0.4; source: ground) was contaminated with 500 CFU/mL of the above bacteria and stored in copper pots for 16 hours at room temperature, no bacteria could be recovered on the culture medium. Recovery failed even after resuscitation in enrichment broth, followed by plating on selective media, indicating loss of culturability. This is the first report on the effect of copper on S. flexneri 2a, enteropathogenic E. coli, and Salmonella Paratyphi. After 16 hours, there was a slight increase in the pH of water from 7.83 to 7.93 in the copper pots while the other physicochemical parameters remained unchanged. Copper content (177±16 ppb) in water stored in copper pots was well within the permissible limits of the World Health Organization. Copper holds promise as a point-of-use solution for microbial purification of drinking-water, especially in developing countries. PMID:22524115

Storing drinking-water in copper pots kills contaminating diarrhoeagenic bacteria.

PubMed

Sudha, V B Preethi; Ganesan, Sheeba; Pazhani, G P; Ramamurthy, T; Nair, G B; Venkatasubramanian, Padma

2012-03-01

Microbially-unsafe water is still a major concern in most developing countries. Although many water-purification methods exist, these are expensive and beyond the reach of many people, especially in rural areas. Ayurveda recommends the use of copper for storing drinking-water. Therefore, the objective of this study was to evaluate the effect of copper pot on microbially-contaminated drinking-water. The antibacterial effect of copper pot against important diarrhoeagenic bacteria, including Vibrio cholerae O1, Shigella flexneri 2a, enterotoxigenic Escherichia coli, enteropathogenic E. coli, Salmonella enterica Typhi, and Salmonella Paratyphi is reported. When drinking-water (pH 7.83 +/- 0.4; source: ground) was contaminated with 500 CFU/mL of the above bacteria and stored in copper pots for 16 hours at room temperature, no bacteria could be recovered on the culture medium. Recovery failed even after resuscitation in enrichment broth, followed by plating on selective media, indicating loss of culturability. This is the first report on the effect of copper on S. flexneri 2a, enteropathogenic E. coli, and Salmonella Paratyphi. After 16 hours, there was a slight increase in the pH of water from 7.83 to 7.93 in the copper pots while the other physicochemical parameters remained unchanged. Copper content (177 +/- 16 ppb) in water stored in copper pots was well within the permissible limits of the World Health Organization. Copper holds promise as a point-of-use solution for microbial purification of drinking-water, especially in developing countries.

Development of technique for air coating and nickel and copper metalization of solar cells

NASA Technical Reports Server (NTRS)

1982-01-01

Solar cells were made with a variety of base metal screen printing inks applied over silicon nitride AR coating and copper electroplated. Fritted and fritless nickel and fritless tin base printing inks were evaluated. Conversion efficiencies as high as 9% were observed with fritted nickel ink contacts, however, curve shapes were generally poor, reflecting high series resistance. Problems encountered in addition to high series reistance included loss of adhesion of the nickel contacts during plating and poor adhesion, oxidation and inferior curve shapes with the tin base contacts.

85. HENNESSY'S DEPARTMENT STORE (130 NORTH MAIN, 18971898) IS A ...

Library of Congress Historic Buildings Survey, Historic Engineering Record, Historic Landscapes Survey

85. HENNESSY'S DEPARTMENT STORE (130 NORTH MAIN, 1897-1898) IS A STEEL FRAME AND BRICK STRUCTURE DESIGNED BY FREDERICK KEES OF MINNEAPOLIS. IT HAS INLAID MARBLE TILES IN THE HALLS, AND PLATE GLASS WINDOWS FRAMED IN COPPER ON THE FIRST AND SECOND FLOORS. THERE IS ALSO A CAST-IRON AND ORNAMENTAL GLASS LOWER LEVEL AND TERRA-COTTA DETAILING AROUND THE WINDOWS. THE ENTRANCE IS AN ELLIPTICAL ARCH WITH IRON GRILL WORK. - Butte Historic District, Bounded by Copper, Arizona, Mercury & Continental Streets, Butte, Silver Bow County, MT

61. Hennessy's Department Store (130 North Main, 18971898) is a ...

Library of Congress Historic Buildings Survey, Historic Engineering Record, Historic Landscapes Survey

61. Hennessy's Department Store (130 North Main, 1897-1898) is a steel frame and brick structure designed by Frederick Kees of Minneapolis. It has inlaid marble tiles in the halls, and plate glass windows framed in copper on the first and second floors. There is also a cast-iron and ornamental glass lower level and terra-cotta detailing around the windows. The entrance is an eliptical arch with iron grill work. - Butte Historic District, Bounded by Copper, Arizona, Mercury & Continental Streets, Butte, Silver Bow County, MT

High-current-density electrodeposition using pulsed and constant currents to produce thick CoPt magnetic films on silicon substrates

NASA Astrophysics Data System (ADS)

Ewing, Jacob; Wang, Yuzheng; Arnold, David P.

2018-05-01

This paper investigates methods for electroplating thick (>20 μm), high-coercivity CoPt films using high current densities (up to 1 A/cm2) and elevated bath temperatures (70 °C). Correlations are made tying current-density and temperature process parameters with plating rate, elemental ratio and magnetic properties of the deposited CoPt films. It also investigates how pulsed currents can increase the plating rate and film to substrate adhesion. Using 500 mA/cm2 and constant current, high-quality, dense CoPt films were successfully electroplated up to 20 μm thick in 1 hr on silicon substrates (0.35 μm/min plating rate). After standard thermal treatment (675°C, 30 min) to achieve the ordered L10 crystalline phase, strong magnetic properties were measured: coercivities up 850 kA/m, remanences >0.5 T, and maximum energy products up to 46 kJ/m3.

Metallization of Kevlar fibers with gold.

PubMed

Little, Brian K; Li, Yunfeng; Cammarata, V; Broughton, R; Mills, G

2011-06-01

Electrochemical gold plating processes were examined for the metallization of Kevlar yarn. Conventional Sn(2+)/Pd(2+) surface activation coupled with electroless Ni deposition rendered the fibers conductive enough to serve as cathodes for electrochemical plating. The resulting coatings were quantified gravimetrically and characterized via adhesion tests together with XRD, SEM, TEM; the coatings effect on fiber strength was also probed. XRD data showed that metallic Pd formed during surface activation whereas amorphous phases and trace amounts of pure Ni metal were plated via the electroless process. Electrodeposition in a thiosulfate bath was the most efficient Au coating process as compared with the analogous electroless procedure, and with electroplating using a commercial cyanide method. Strongly adhering coatings resulted upon metallization with three consecutive electrodepositions, which produced conductive fibers able to sustain power outputs in the range of 1 W. On the other hand, metallization affected the tensile strength of the fiber and defects present in the metal deposits make questionable the effectiveness of the coatings as protective barriers. © 2011 American Chemical Society

Thermal response of solar receiver aperture plates during sun walk-off

NASA Technical Reports Server (NTRS)

Wen, L.; Roschke, J.

1982-01-01

The tracking mechanism for a point-focusing concentrator may be subject to failure. If this should occur, the solar image will travel across the aperture plate, and it may also impinge on the adjacent support structure. Such an event is called 'sun walk-off'. The present investigation is concerned with the transient response of different aperture plate materials to the intense heating produced in a typical walk-off situation for parabolic dish concentrators. Receivers for two solar module systems are considered, including a high-temperature receiver that utilizes a 2-milliradian (mrad) concentrator, and a lower-temperature receiver which is coupled with a 4-mrad concentrator. It is found that during a walk-off situation the solar image travels in a straight line in the radial direction. The results obtained for a copper aperture plate were disappointing. It appears that passive metallic plates without cooling or other protective support cannot withstand the intense heating.

Selection of Fecal Enterococci Exhibiting tcrB-Mediated Copper Resistance in Pigs Fed Diets Supplemented with Copper † ▿

PubMed Central

Amachawadi, R. G.; Shelton, N. W.; Shi, X.; Vinasco, J.; Dritz, S. S.; Tokach, M. D.; Nelssen, J. L.; Scott, H. M.; Nagaraja, T. G.

2011-01-01

Copper, as copper sulfate, is increasingly used as an alternative to in-feed antibiotics for growth promotion in weaned piglets. Acquired copper resistance, conferred by a plasmid-borne, transferable copper resistance (tcrB) gene, has been reported in Enterococcus faecium and E. faecalis. A longitudinal field study was undertaken to determine the relationship between copper supplementation and the prevalence of tcrB-positive enterococci in piglets. The study was done with weaned piglets, housed in 10 pens with 6 piglets per pen, fed diets supplemented with a normal (16.5 ppm; control) or an elevated (125 ppm) level of copper. Fecal samples were randomly collected from three piglets per pen on days 0, 14, 28, and 42 and plated on M-Enterococcus agar, and three enterococcal isolates were obtained from each sample. The overall prevalence of tcrB-positive enterococci was 21.1% (38/180) in piglets fed elevated copper and 2.8% (5/180) in the control. Among the 43 tcrB-positive isolates, 35 were E. faecium and 8 were E. faecalis. The mean MICs of copper for tcrB-negative and tcrB-positive enterococci were 6.2 and 22.2 mM, respectively. The restriction digestion of the genomic DNA of E. faecium or E. faecalis with S1 nuclease yielded a band of ∼194-kbp size to which both tcrB and the erm(B) gene probes hybridized. A conjugation assay demonstrated cotransfer of tcrB and erm(B) genes between E. faecium and E. faecalis strains. The higher prevalence of tcrB-positive enterococci in piglets fed elevated copper compared to that in piglets fed normal copper suggests that supplementation of copper in swine diets selected for resistance. PMID:21705534

Palladium Nanoparticles Immobilized on Individual Calcium Carbonate Plates Derived from Mussel Shell Waste: An Ecofriendly Catalyst for the Copper-Free Sonogashira Coupling Reaction.

PubMed

Saetan, Trin; Lertvachirapaiboon, Chutiparn; Ekgasit, Sanong; Sukwattanasinitt, Mongkol; Wacharasindhu, Sumrit

2017-09-05

The conversion of waste into high-value materials is considered an important sustainability strategy in modern chemical industries. A large volume of shell waste is generated globally from mussel cultivation. In this work, mussel shell waste (Perna viridis) is transformed into individual calcium carbonate plates (ICCPs) and is applied as a support for a heterogeneous catalyst. Palladium nanoparticles (3-6 nm) are deposited with an even dispersion on the ICCP surface, as demonstrated by X-ray diffraction and scanning electron microscopy. Using this system, Sonogashira cross-coupling reactions between aryl iodides and terminal acetylenes were accomplished in high yields with the use of 1 % Pd/ICCP in the presence of potassium carbonate without the use of any copper metal or external ligand. The Pd/ICCP catalyst could also be reused up to three times and activity over 90 % was maintained with negligible Pd-metal leaching. This work demonstrates that mussel shell waste can be used as an inexpensive and effective support for metal catalysts in coupling reactions, as demonstrated by the successful performance of the Pd-catalyzed, copper-free Sonogashira cross-coupling process. © 2017 Wiley-VCH Verlag GmbH & Co. KGaA, Weinheim.

A novel graded density impactor

NASA Astrophysics Data System (ADS)

Winter, Ron; Cotton, Matthew; Harris, Ernest; Eakins, Daniel; Chapman, David

2013-06-01

Ramp loading using graded-density-impactors as flyers in plate impact experiments can yield useful information about the dynamic properties of the loaded material. Selective Laser Melting, an additive manufacture technique, was used to fabricate a graded-density flyer, termed the ``bed of nails'' (BON). A 2 mm thick x 100 mm diameter solid disc of stainless steel formed a base for an array of tapered spikes of length 6 mm and spaced 1 mm apart. Two experiments to test the concept were performed at impact velocities of 900 m/s and 1100 m/s using the 100 mm gas gun at The Institute of Shock Physics, Imperial College, London. In each experiment a BON flyer was impacted onto a copper buffer plate which helped to smooth out perturbations in the wave profile. The ramp delivered to the copper buffer was in turn transmitted to three tantalum targets of thicknesses 3, 5 and 7 mm, mounted in contact with the back face of the copper. Heterodyne velocimetry was used to measure the velocity-time history, at the back faces of the tantalum discs. The wave profiles display a smooth increase in free surface velocity over a period of about 2.5 microseconds. The measured profiles have been analysed to generate a stress vs. volume curve for tantalum.

Use of a modified hair strand test to assess the antifungal activity kinetics of dog hair after a 2% climbazole shampoo application.

PubMed

Petit, Jean Yanique; Cavana, Paola; Thoumire, Sandra; Guillot, Jacques; Perrot, Sébastien

2016-06-01

The "hair strand test" was first developed as a model to evaluate the antifungal activity of antidandruff shampoos. To assess the residual activity of an antifungal shampoo on the hair shafts of dogs after a single application, followed by bathing with a physiological shampoo one month later. Six beagles (two males and four females) from a research colony. Dogs were bathed with a 2% climbazole shampoo. Hairs were collected before application of the shampoo and at scheduled intervals for 30 days after treatment. A physiological shampoo was then applied to all dogs and hairs were collected following the same schedule. The inhibition zone around the hair shafts was measured after incubation on Sabouraud's dextrose agar plates streaked with three Malassezia pachydermatis strains. Inhibition zones around hairs collected from dogs bathed with 2% climbazole shampoo were significantly larger than those around hairs collected before shampooing at all time points (P = 0.003). An increase in the width of the inhibition zones around climbazole treated hairs was observed following physiological shampoo on Day 30 (P = 0.005). No significant differences were observed between Malassezia pachydermatis isolates (P = 0.571). No inhibition zones were seen around the hairs of dogs bathed with physiological shampoo only. The modified hair strand test is useful for the assessment of residual antifungal activity on animal hairs. Use of a physiological shampoo following antifungal shampoo therapy may increase the efficacy of the antifungal product for the control of Malassezia overgrowth. © 2016 ESVD and ACVD.

CARBON BLACK DISPERSION PRE-PLATING TECHNOLOGY FOR PRINTED WIRE BOARD MANUFACTURING

EPA Science Inventory

This evaluation addresses the product quality, waste reduction, and economic issues involved in replacing electroless copper with a carbon black dispersion technology. McCurdy Circuits of Orange County, California, currently has both processes in operation. McCurdy has found that...

Rupture testing for the quality control of electrodeposited copper interconnections in high-speed, high-density circuits

NASA Technical Reports Server (NTRS)

Zakraysek, Louis

1987-01-01

Printed Wiring Multilayer Board (PWMLB) structures for high speed, high density circuits are prone to failure due to the microcracking of electrolytic copper interconnections. The failure can occur in the foil that makes up the inner layer traces or in the plated through holes (PTH) deposit that forms the layer to layer interconnections. It is shown that there are some distinctive differences in the quality of Type E copper and that these differences can be detected before its use in a PWMLB. It is suggested that the strength of some Type E copper can be very low when the material is hot and that it is the use of this poor quality material in a PWMLB that results in PTH and inner layer microcracking. Since the PWMLB failure in question are induced by a thermal stress, and since the poorer grades of Type E materials used in these structures are susceptible to premature failure under thermal stress, the use of elevated temperature rupture and creep rupture testing is proposed as a means for screening copper foil, or its PTH equivalent, in order to eliminate the problem of Type E copper microcracking in advanced PWMLBs.

Cleaning and passivation of copper surfaces to remove surface radioactivity and prevent oxide formation

DOE Office of Scientific and Technical Information (OSTI.GOV)

Hoppe, Eric W.; Seifert, Allen; Aalseth, Craig E.

High-purity copper is an attractive material for constructing ultra-low-background radiation measurement devices. Many low-background experiments using high-purity copper have indicated surface contamination emerges as the dominant background. Radon daughters plate out on exposed surfaces, leaving a residual 210Pb background that is difficult to avoid. Dust is also a problem; even under cleanroom conditions, the amount of U and Th deposited on surfaces can represent the largest remaining background. To control these backgrounds, a copper cleaning chemistry has been developed. Designed to replace an effective, but overly aggressive concentrated nitric acid etch, this peroxide-based solution allows for a more controlled cleaningmore » of surfaces. The acidified hydrogen peroxide solution will generally target the Cu+/Cu2+ species which are the predominant surface participants, leaving the bulk of copper metal intact. This preserves the critical tolerances of parts and eliminates significant waste disposal issues. Accompanying passivation chemistry has also been developed that protects copper surfaces from oxidation. Using a high-activity polonium surface spike, the most difficult-to-remove daughter isotope of radon, the performance of these methods are quantified. © 2001 Elsevier Science. All rights reserved« less

Modeling pore corrosion in normally open gold- plated copper connectors.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Battaile, Corbett Chandler; Moffat, Harry K.; Sun, Amy Cha-Tien

2008-09-01

The goal of this study is to model the electrical response of gold plated copper electrical contacts exposed to a mixed flowing gas stream consisting of air containing 10 ppb H{sub 2}S at 30 C and a relative humidity of 70%. This environment accelerates the attack normally observed in a light industrial environment (essentially a simplified version of the Battelle Class 2 environment). Corrosion rates were quantified by measuring the corrosion site density, size distribution, and the macroscopic electrical resistance of the aged surface as a function of exposure time. A pore corrosion numerical model was used to predict bothmore » the growth of copper sulfide corrosion product which blooms through defects in the gold layer and the resulting electrical contact resistance of the aged surface. Assumptions about the distribution of defects in the noble metal plating and the mechanism for how corrosion blooms affect electrical contact resistance were needed to complete the numerical model. Comparisons are made to the experimentally observed number density of corrosion sites, the size distribution of corrosion product blooms, and the cumulative probability distribution of the electrical contact resistance. Experimentally, the bloom site density increases as a function of time, whereas the bloom size distribution remains relatively independent of time. These two effects are included in the numerical model by adding a corrosion initiation probability proportional to the surface area along with a probability for bloom-growth extinction proportional to the corrosion product bloom volume. The cumulative probability distribution of electrical resistance becomes skewed as exposure time increases. While the electrical contact resistance increases as a function of time for a fraction of the bloom population, the median value remains relatively unchanged. In order to model this behavior, the resistance calculated for large blooms has been weighted more heavily.« less

Bulk substrate porosity verification by applying Monte Carlo modeling and Castaing's formula using energy-dispersive x-rays

NASA Astrophysics Data System (ADS)

Yung, Lai Chin; Fei, Cheong Choke; Mandeep, Jit Singh; Amin, Nowshad; Lai, Khin Wee

2015-11-01

The leadframe fabrication process normally involves additional thin-metal layer plating on the bulk copper substrate surface for wire bonding purposes. Silver, tin, and copper flakes are commonly adopted as plating materials. It is critical to assess the density of the plated metal layer, and in particular to look for porosity or voids underneath the layer, which may reduce the reliability during high-temperature stress. A fast, reliable inspection technique is needed to assess the porosity or void weakness. To this end, the characteristics of x-rays generated from bulk samples were examined using an energy-dispersive x-ray (EDX) detector to examine the porosity percentage. Monte Carlo modeling was integrated with Castaing's formula to verify the integrity of the experimental data. Samples with different porosity percentages were considered to test the correlation between the intensity of the collected x-ray signal and the material density. To further verify the integrity of the model, conventional cross-sectional samples were also taken to observe the porosity percentage using Image J software measurement. A breakthrough in bulk substrate assessment was achieved by applying EDX for the first time to nonelemental analysis. The experimental data showed that the EDX features were not only useful for elemental analysis, but also applicable to thin-film metal layer thickness measurement and bulk material density determination. A detailed experiment was conducted using EDX to assess the plating metal layer and bulk material porosity.

Role of copper oxides in contact killing of bacteria.

PubMed

Hans, Michael; Erbe, Andreas; Mathews, Salima; Chen, Ying; Solioz, Marc; Mücklich, Frank

2013-12-31

The potential of metallic copper as an intrinsically antibacterial material is gaining increasing attention in the face of growing antibiotics resistance of bacteria. However, the mechanism of the so-called "contact killing" of bacteria by copper surfaces is poorly understood and requires further investigation. In particular, the influences of bacteria-metal interaction, media composition, and copper surface chemistry on contact killing are not fully understood. In this study, copper oxide formation on copper during standard antimicrobial testing was measured in situ by spectroscopic ellipsometry. In parallel, contact killing under these conditions was assessed with bacteria in phosphate buffered saline (PBS) or Tris-Cl. For comparison, defined Cu2O and CuO layers were thermally generated and characterized by grazing incidence X-ray diffraction. The antibacterial properties of these copper oxides were tested under the conditions used above. Finally, copper ion release was recorded for both buffer systems by inductively coupled plasma atomic absorption spectroscopy, and exposed copper samples were analyzed for topographical surface alterations. It was found that there was a fairly even growth of CuO under wet plating conditions, reaching 4-10 nm in 300 min, but no measurable Cu2O was formed during this time. CuO was found to significantly inhibit contact killing, compared to pure copper. In contrast, thermally generated Cu2O was essentially as effective in contact killing as pure copper. Copper ion release from the different surfaces roughly correlated with their antibacterial efficacy and was highest for pure copper, followed by Cu2O and CuO. Tris-Cl induced a 10-50-fold faster copper ion release compared to PBS. Since the Cu2O that primarily forms on copper under ambient conditions is as active in contact killing as pure copper, antimicrobial objects will retain their antimicrobial properties even after oxide formation.

Nanoscale coatings for erosion and corrosion protection of copper microchannel coolers for high powered laser diodes

NASA Astrophysics Data System (ADS)

Flannery, Matthew; Fan, Angie; Desai, Tapan G.

2014-03-01

High powered laser diodes are used in a wide variety of applications ranging from telecommunications to industrial applications. Copper microchannel coolers (MCCs) utilizing high velocity, de-ionized water coolant are used to maintain diode temperatures in the recommended range to produce stable optical power output and control output wavelength. However, aggressive erosion and corrosion attack from the coolant limits the lifetime of the cooler to only 6 months of operation. Currently, gold plating is the industry standard for corrosion and erosion protection in MCCs. However, this technique cannot perform a pin-hole free coating and furthermore cannot uniformly cover the complex geometries of current MCCs involving small diameter primary and secondary channels. Advanced Cooling Technologies, Inc., presents a corrosion and erosion resistant coating (ANCERTM) applied by a vapor phase deposition process for enhanced protection of MCCs. To optimize the coating formation and thickness, coated copper samples were tested in 0.125% NaCl solution and high purity de-ionized (DIW) flow loop. The effects of DIW flow rates and qualities on erosion and corrosion of the ANCERTM coated samples were evaluated in long-term erosion and corrosion testing. The robustness of the coating was also evaluated in thermal cycles between 30°C - 75°C. After 1000 hours flow testing and 30 thermal cycles, the ANCERTM coated copper MCCs showed a corrosion rate 100 times lower than the gold plated ones and furthermore were barely affected by flow rates or temperatures thus demonstrating superior corrosion and erosion protection and long term reliability.

Preparation of ultrafine grained copper nanoparticles via immersion deposit method

NASA Astrophysics Data System (ADS)

Abbasi-Kesbi, Fatemeh; Rashidi, Ali Mohammad; Astinchap, Bandar

2018-03-01

Today, the exploration about synthesis of nanoparticles is much of interest to materials scientists. In this work, copper nanoparticles have been successfully synthesized by immersion deposit method in the absence of any stabilizing and reducing agents. Copper (II) sulfate pentahydrate as precursor salt and distilled water and Ethylene glycol as solvents were used. The copper nanoparticles were deposited on plates of low carbon steel. The effects of copper sulfate concentrations and solvent type were investigated. X-ray diffraction, scanning electron microscopy and UV-Visible spectroscopy were taken to investigate the crystallite size, crystal structure, and morphology and size distribution and the growth process of the nanoparticles of obtained Cu particles. The results indicated that the immersion deposit method is a particularly suitable method for synthesis of semispherical copper nanoparticles with the crystallites size in the range of 22 to 37 nm. By increasing the molar concentration of copper sulfate in distilled water solvent from 0.04 to 0.2 M, the average particles size is increased from 57 to 81 nm. The better size distribution of Cu nanoparticles was achieved using a lower concentration of copper sulfate. By increasing the molar concentration of copper sulfate in water solvent from 0.04 to 0.2, the location of the SPR peak has shifted from 600 to 630 nm. The finer Cu nanoparticles were formed using ethylene glycol instead water as a solvent. Also, the agglomeration and overlapping of nanoparticles in ethylene glycol were less than that of water solvent.

Friction Stir Welding of GR-Cop 84 for Combustion Chamber Liners

NASA Technical Reports Server (NTRS)

Russell, Carolyn K.; Carter, Robert; Ellis, David L.; Goudy, Richard

2004-01-01

GRCop-84 is a copper-chromium-niobium alloy developed by the Glenn Research Center for liquid rocket engine combustion chamber liners. GRCop-84 exhibits superior properties over conventional copper-base alloys in a liquid hydrogen-oxygen operating environment. The Next Generation Launch Technology program has funded a program to demonstrate scale-up production capabilities of GR-Cop 84 to levels suitable for main combustion chamber production for the prototype rocket engine. This paper describes a novel method of manufacturing the main combustion chamber liner. The process consists of several steps: extrude the GR-Cop 84 powder into billets, roll the billets into plates, bump form the plates into cylinder halves and friction stir weld the halves into a cylinder. The cylinder is then metal spun formed to near net liner dimensions followed by finish machining to the final configuration. This paper describes the friction stir weld process development including tooling and non-destructive inspection techniques, culminating in the successful production of a liner preform completed through spin forming.

Catalyst surfaces for the chromous/chromic redox couple

NASA Technical Reports Server (NTRS)

Giner, J. D.; Cahill, K. J. (Inventor)

1980-01-01

An electricity producing cell of the reduction-oxidation (REDOX) type is described. The cell is divided into two compartments by a membrane, each compartment containing a solid inert electrode. A ferrous/ferric couple in a chloride solution serves as a cathode fluid which is circulated through one of the compartments to produce a positive electric potential disposed therein. A chromic/chromous couple in a chloride solution serves as an anode fluid which is circulated through the second compartment to produce a negative potential on an electrode disposed therein. The electrode is an electrically conductive, inert material plated with copper, silver or gold. A thin layer of lead plates onto the copper, silver or gold layer when the cell is being charged, the lead ions being available from lead chloride which was added to the anode fluid. If the REDOX cell is then discharged, the current flows between the electrodes causing the lead to deplate from the negative electrode and the metal coating on the electrode will act as a catalyst to cause increased current density.

Facile One-Pot Synthesis of Flower Like Cobalt Oxide Nanostructures on Nickel Plate and Its Supercapacitance Properties.

PubMed

Kandasamy, N; Venugopal, T; Kannan, K

2018-06-01

A flower like cobalt oxide nanostructured thin film (Co2O3) on Nickel (Ni) plate as have been successfully developed via alcoholic Seed Layer assisted chemical bath Deposition (SLD) process. Through the controlled alkaline electrolytes, the flower and paddles like Co2O3 nanoarchitectures were formed. The prepared thin film was characterized by X-ray diffraction (XRD), scanning electron microscope with energy dispersive X-ray (SEM and EDX), Atomic Force Microscope (AFM), Raman spectroscopy techniques. Electron micrograph reveals the flower and paddles like nanostructured Co2O3 thin film deposited on Ni plates. The electrochemical characteristics were investigated using cyclic voltammetry (CV), charge-discharge and AC impedance spectroscopy in different aqueous electrolytes such as NaOH, KOH, and LiOH. The maximum specific capacitance of 856 Fg-1 was attained with 2 M KOH electrolyte with 2 mVs-1 of the Co2O3 thin film coated Ni plate at 80 °C using SLD method. The capacitance values obtained with various electrolytes are in the order of KOH > NaOH > LiOH. The results indicate that the present method is economical and the material is ecofriendly with enhanced capacitance property.

Laser etching of polymer masked leadframes

NASA Astrophysics Data System (ADS)

Ho, C. K.; Man, H. C.; Yue, T. M.; Yuen, C. W.

1997-02-01

A typical electroplating production line for the deposition of silver pattern on copper leadframes in the semiconductor industry involves twenty to twenty five steps of cleaning, pickling, plating, stripping etc. This complex production process occupies large floor space and has also a number of problems such as difficulty in the production of rubber masks and alignment, generation of toxic fumes, high cost of water consumption and sometimes uncertainty on the cleanliness of the surfaces to be plated. A novel laser patterning process is proposed in this paper which can replace many steps in the existing electroplating line. The proposed process involves the application of high speed laser etching techniques on leadframes which were protected with polymer coating. The desired pattern for silver electroplating is produced by laser ablation of the polymer coating. Excimer laser was found to be most effective for this process as it can expose a pattern of clean copper substrate which can be silver plated successfully. Previous working of Nd:YAG laser ablation showed that 1.06 μm radiation was not suitable for this etching process because a thin organic and transparent film remained on the laser etched region. The effect of excimer pulse frequency and energy density upon the removal rate of the polymer coating was studied.

An inexpensive approach for bright-field and dark-field imaging by scanning transmission electron microscopy in scanning electron microscopy.

PubMed

Patel, Binay; Watanabe, Masashi

2014-02-01

Scanning transmission electron microscopy in scanning electron microscopy (STEM-in-SEM) is a convenient technique for soft materials characterization. Various specimen-holder geometries and detector arrangements have been used for bright-field (BF) STEM-in-SEM imaging. In this study, to further the characterization potential of STEM-IN-SEM, a new specimen holder has been developed to facilitate direct detection of BF signals and indirect detection of dark-field (DF) signals without the need for substantial instrument modification. DF imaging is conducted with the use of a gold (Au)-coated copper (Cu) plate attached to the specimen holder which directs highly scattered transmitted electrons to an off-axis yttrium-aluminum-garnet (YAG) detector. A hole in the copper plate allows for BF imaging with a transmission electron (TE) detector. The inclusion of an Au-coated Cu plate enhanced DF signal intensity. Experiments validating the acquisition of true DF signals revealed that atomic number (Z) contrast may be achieved for materials with large lattice spacing. However, materials with small lattice spacing still exhibit diffraction contrast effects in this approach. The calculated theoretical fine probe size is 1.8 nm. At 30 kV, in this indirect approach, DF spatial resolution is limited to 3.2 nm as confirmed experimentally.

High current capacity electrical connector

DOEpatents

Bettis, Edward S.; Watts, Harry L.

1976-01-13

An electrical connector is provided for coupling high current capacity electrical conductors such as copper busses or the like. The connector is arranged in a "sandwiched" configuration in which a conductor plate contacts the busses along major surfaces thereof clamped between two stainless steel backing plates. The conductor plate is provided with a plurality of contact buttons affixed therein in a spaced array such that the caps of the buttons extend above the conductor plate surface to contact the busses. When clamping bolts provided through openings in the sandwiched arrangement are tightened, Belleville springs provided under the rim of each button cap are compressed and resiliently force the caps into contact with the busses' contacting surfaces to maintain a predetermined electrical contact area provided by the button cap tops. The contact area does not change with changing thermal or mechanical stresses applied to the coupled conductors.

The role of defeathering in the contamination of turkey skin by Salmonella species and Listeria monocytogenes.

PubMed

Clouser, C S; Doores, S; Mast, M G; Knabel, S J

1995-04-01

This study was undertaken to determine whether the incidence of either Salmonella spp. or Listeria monocytogenes on turkeys at three commercial processors could be related to the type of defeathering system: 1) conventional, 58 C common bath scald; 2) kosher, 7 C common bath scald; or 3) steam-spray, 62 C nonimmersion scald. Flocks were sampled before defeathering, after defeathering, and after chill at each facility. The incidence of Salmonella-positive turkeys significantly increased subsequent to conventional defeathering (10 positive out of 14) as compared with before defeathering (3/14). The number of Salmonella-positive carcasses following kosher (0/14) and steam-spray (2/14) defeathering were similar to the number of Salmonella-positive carcasses found prior to defeathering (1/14 and 3/14, respectively). The incidence of Salmonella-positive carcasses following chill was slightly lower, but not significantly different than the number of Salmonella-positive carcasses found immediately following defeathering at all processors (8/14, 0/14, 1/14 for conventional, kosher, and steam-spray processors, respectively). Although L. monocytogenes was detected on turkeys sampled before chilling (2/10, kosher) and after chilling (8/14, kosher; 1/14, conventional), no L. monocytogenes was detected on turkeys at any of the processors prior to the evisceration process. Flocks with high aerobic plate counts prior to processing were more likely to contain Salmonella-positive birds throughout processing. Aerobic plate counts of all flocks were similar after chill whether or not Salmonella spp. and L. monocytogenes were detected.

Improving the Magnetic Damping of an AS-1 Seismometer

NASA Astrophysics Data System (ADS)

Marton, F.; Echreshzadeh, M.; Tokman, T. L.; Palaric, K. D.; Filippone, N. V.; Balzarette, M.; Sivo, J.

2016-12-01

Last year, students working on the SeismoSTEM project at Bergen Community College in New Jersey successfully manufactured and assembled an AS-1 seismometer1. For 2016, our objective has been to improve the magnetic damping mechanism invented by Chris Chapman2. As the mass on the boom is displaced by seismic waves, the spring will cause the mass to oscillate, therefore, damping is required. To achieve this, a paddle-shaped piece of copper, along with steel plates holding strong neodymium magnets are used. A localized eddy current is then induced, which then creates an opposing magnetic field. The challenges we faced for the summer internship was the fact that there was either too much or too little damping to distinguish the waves of an earthquake. However, we resolved the issue by designing our own prototype for moving the steel plates away and toward the copper paddle, to achieve critical damping. This was successfully completed by attaching two L-shaped pieces of aluminum, along with a cylindrical piece, to form a yoke. We then drilled a hole through the cylindrical piece and a plastic block for a bolt to slide through. Finally, the head of the bolt would then be used as a knob to shift the two plates away from and toward the paddle simultaneously. Although this was our solution for moving the plates horizontally, we also needed to find a way to lock the plates in place once we found the correct amount of damping. We accomplished this task by drilling two slotted holes on two symmetrical sheets of aluminum, which will allow us to slide the plates, and finally, lock them into place to avoid wobbling. References: 1Tokman, T.L. et al., What's shaking? Manufacturing & assembling an AS-1 educational seismometer for undergraduate stem research, Geological Society of America Abstracts with Programs. Vol. 47, No. 7, p.524, 2015. 2http://www.jclahr.com/science/psn/chapman/as1%20damping/

SFD-261 Crossed-Field Amplifier Manufacturing Technology Program.

DTIC Science & Technology

1979-09-28

microwave amplifier used to increase tet pow--rlel of pulses of energy by a factor of 20. It is used in the Aegis A4/SPY1V DD 1473 ECIIOwOF I MOV 65...transmitter. A single ship.,; complement without spares is seventy-six. Its internal parts are made from high purity copper and many are complex and...23 Cathode Support 39 24 Mounting Plate ’i 25 Support Plate 42 26 Tubing Support 43 27 SFD-261 High Voltage Can End 45 b 28 Comparison of MT Tube

Photoluminescence transient study of surface defects in ZnO nanorods grown by chemical bath deposition

NASA Astrophysics Data System (ADS)

Barbagiovanni, E. G.; Strano, V.; Franzò, G.; Crupi, I.; Mirabella, S.

2015-03-01

Two deep level defects (2.25 and 2.03 eV) associated with oxygen vacancies (Vo) were identified in ZnO nanorods (NRs) grown by low cost chemical bath deposition. A transient behaviour in the photoluminescence (PL) intensity of the two Vo states was found to be sensitive to the ambient environment and to NR post-growth treatment. The largest transient was found in samples dried on a hot plate with a PL intensity decay time, in air only, of 23 and 80 s for the 2.25 and 2.03 eV peaks, respectively. Resistance measurements under UV exposure exhibited a transient behaviour in full agreement with the PL transient, indicating a clear role of atmospheric O2 on the surface defect states. A model for surface defect transient behaviour due to band bending with respect to the Fermi level is proposed. The results have implications for a variety of sensing and photovoltaic applications of ZnO NRs.

Combined Mini-Cylex & Disk Acceleration Tests in Type K Copper.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Maines, Warren Russell; Kittell, David E.; Hobbs, Michael L.

We combined the miniature cylinder expansion test (Mini-Cylex), with the Disk Acceleration Test (DAX) using Type K copper, Picatinny Liquid Explosive, and photonic Doppler velocimetry. We estimated the CJ state using plate reverberation methods at the test cap. We extracted velocities at 2, 7, and 10 volume expansions to fit Jones-Wilkins-Lee Equation of State at the tube wall. And we estimated Gurney velocity both at the test cap and tube wall. Our experiments and simulations are within expected uncertainty. The test and the analysis effectively reduce costs while keeping similar fidelity compared with more expensive tests.

Development of Surfaces Optically Suitable for Flat Solar Panels

NASA Technical Reports Server (NTRS)

Desmet, D.; Jason, A.

1978-01-01

Three areas of research in the development of flat solar panels are described. (1) A reflectometer which can separately evaluate the spectral and diffuse reflectivities of surfaces was developed. The reflectometer has a phase locked detection system. (2) A coating composed of strongly bound copper oxide that is formed by an etching process performed on an aluminum alloy with high copper content was also developed. Because of this one step fabrication process, fabrication costs are expected to be small. (3) A literature search was conducted and conclusions on the required optical properties of flat plate solar collectors are presented.

Silver-free Metallization Technology for Producing High Efficiency, Industrial Silicon Solar Cells

DOE Office of Scientific and Technical Information (OSTI.GOV)

Michaelson, Lynne M.; Munoz, Krystal; Karas, Joseph

The goal of this project is to provide a commercially viable Ag-free metallization technology that will both reduce cost and increase efficiency of standard silicon solar cells. By removing silver from the front grid metallization and replacing it with lower cost nickel, copper, and tin metal, the front grid direct materials costs will decrease. This reduction in material costs should provide a path to meeting the Sunshot 2020 goal of 1 dollar / W DC. As of today, plated contacts are not widely implemented in large scale manufacturing. For organizations that wish to implement pilot scale manufacturing, only two equipmentmore » choices exist. These equipment manufacturers do not supply plating chemistry. The main goal of this project is to provide a chemistry and equipment solution to the industry that enables reliable manufacturing of plated contacts marked by passing reliability results and higher efficiencies than silver paste front grid contacts. To date, there have been several key findings that point to plated contacts performing equal to or better than the current state of the art silver paste contacts. Poor adhesion and reliability concerns are a few of the hurdles for plated contacts, specifically plated nickel directly on silicon. A key finding of the Phase 1 budget period is that the plated contacts have the same adhesion as the silver paste controls. This is a huge win for plated contacts. With very little optimization work, state of the art electrical results for plated contacts on laser ablated lines have been demonstrated with efficiencies up to 19.1% and fill factors ~80% on grid lines 40-50 um wide. The silver paste controls with similar line widths demonstrate similar electrical results. By optimizing the emitter and grid design for the plated contacts, it is expected that the electrical performance will exceed the silver paste controls. In addition, cells plated using Technic chemistry and equipment pass reliability testing; i.e. 1000 hours damp heat and 200 thermal cycles, with results similar to silver paste control cells. 100 cells have been processed through Technic’s novel demo plating tool built and installed during budget period 2. This plating tool performed consistently from cell to cell, providing gentle handling for the solar cells. An agreement has been signed with a cell manufacturer to process their cells through our plating chemistry and equipment. Their main focus for plated contacts is to reduce the direct materials cost by utilizing nickel, copper, and tin in place of silver paste. Based on current market conditions and cost model calculations, the overall savings offered by plated contacts is only 3.5% dollar/W versus silver paste contacts; however, the direct materials savings depend on the silver market. If silver prices increase, plated contacts may find a wider adoption in the solar industry in order to keep the direct materials costs down for front grid contacts.« less

Modeling of laser welding of steel and titanium plates with a composite insert

NASA Astrophysics Data System (ADS)

Isaev, V. I.; Cherepanov, A. N.; Shapeev, V. P.

2017-10-01

A 3D model of laser welding proposed before by the authors was extended to the case of welding of metallic plates made of dissimilar materials with a composite multilayer intermediate insert. The model simulates heat transfer in the welded plates and takes into account phase transitions. It was proposed to select the composition of several metals and dimensions of the insert to avoid the formation of brittle intermetallic phases in the weld joint negatively affecting its strength properties. The model accounts for key physical phenomena occurring during the complex process of laser welding. It is capable to calculate temperature regimes at each point of the plates. The model can be used to select the welding parameters reducing the risk of formation of intermetallic plates. It can forecast the dimensions and crystalline structure of the solidified melt. Based on the proposed model a numerical algorithm was constructed. Simulations were carried out for the welding of titanium and steel plates with a composite insert comprising four different metals: copper and niobium (intermediate plates) with steel and titanium (outer plates). The insert is produced by explosion welding. Temperature fields and the processes of melting, evaporation, and solidification were studied.

Cr13Ni5Si2-Based Composite Coating on Copper Deposited Using Pulse Laser Induction Cladding

PubMed Central

Wang, Ke; Wang, Hailin; Zhu, Guangzhi; Zhu, Xiao

2017-01-01

A Cr13Ni5Si2-based composite coating was successfully deposited on copper by pulse laser induction hybrid cladding (PLIC), and its high-temperature wear behavior was investigated. Temperature evolutions associated with crack behaviors in PLIC were analyzed and compared with pulse laser cladding (PLC) using the finite element method. The microstructure and present phases were analyzed using scanning electron microscopy and X-ray diffraction. Compared with continuous laser induction cladding, the higher peak power offered by PLIC ensures metallurgical bonding between highly reflective copper substrate and coating. Compared with a wear test at room temperature, at 500 °C the wear volume of the Cr13Ni5Si2-based composite coating increased by 21%, and increased by 225% for a NiCr/Cr3C2 coating deposited by plasma spray. This novel technology has good prospects for application with respect to the extended service life of copper mold plates for slab continuous casting. PMID:28772519

Metal copper films deposited on cenosphere particles by magnetron sputtering method

NASA Astrophysics Data System (ADS)

Yu, Xiaozheng; Xu, Zheng; Shen, Zhigang

2007-05-01

Metal copper films with thicknesses from several nanometres to several micrometres were deposited on the surface of cenosphere particles by the magnetron sputtering method under different working conditions. An ultrasonic vibrating generator equipped with a conventional magnetron sputtering apparatus was used to prevent the cenosphere substrates from accumulating during film growth. The surface morphology, the chemical composition, the average grain size and the crystallization of cenosphere particles were characterized by field emission scanning electron microscopy (FE-SEM), inductively coupled plasma-atom emission spectrometer, x-ray photoelectron spectroscopy and x-ray diffraction (XRD) analysis, respectively, before and after the plating process. The results indicate that the copper films were successfully deposited on cenosphere particles. It was found from the FE-SEM results that the films were well compacted and highly uniform in thickness. The XRD results show that the copper film coated on cenospheres has a face centred cubic structure and the crystallization of the film sample increases with increasing sputtering power.

Cr13Ni5Si2-Based Composite Coating on Copper Deposited Using Pulse Laser Induction Cladding.

PubMed

Wang, Ke; Wang, Hailin; Zhu, Guangzhi; Zhu, Xiao

2017-02-10

A Cr13Ni5Si2-based composite coating was successfully deposited on copper by pulse laser induction hybrid cladding (PLIC), and its high-temperature wear behavior was investigated. Temperature evolutions associated with crack behaviors in PLIC were analyzed and compared with pulse laser cladding (PLC) using the finite element method. The microstructure and present phases were analyzed using scanning electron microscopy and X-ray diffraction. Compared with continuous laser induction cladding, the higher peak power offered by PLIC ensures metallurgical bonding between highly reflective copper substrate and coating. Compared with a wear test at room temperature, at 500 °C the wear volume of the Cr13Ni5Si2-based composite coating increased by 21%, and increased by 225% for a NiCr/Cr3C2 coating deposited by plasma spray. This novel technology has good prospects for application with respect to the extended service life of copper mold plates for slab continuous casting.

Thermoelectric Mechanism and Interface Characteristics of Cyanide-Free Nanogold-Coated Silver Wire

NASA Astrophysics Data System (ADS)

Tseng, Yi-Wei; Hung, Fei-Yi; Lui, Truan-Sheng

2016-01-01

Traditional bath-plated gold contains a cyanide complex, which is an environmental hazard. In response, our study used a green plating process to produce cyanide-free gold-coated silver (cyanide-free ACA) bonding wire that has been proven to be a feasible alternative to gold bonding wire in semiconductor packaging. In this work, ACA wire annealed at 550°C was found to have stable microstructure and superior mechanical properties. Intermetallic compounds Ag2Al and AuAl2 grew from Ag-Au balls and Al pads after aging at 175°C for 500 h. After current testing, ACA wire was found to have improved electrical properties due to equiaxed grain growth. The gold nanolayer on the Ag surface increased the oxidation resistance. These results provide insights regarding the reliability of ACA wire in advanced bonding processes.

Copper Decoration of Carbon Nanotubes and High Resolution Electron Microscopy

NASA Astrophysics Data System (ADS)

Probst, Camille

A new process of decorating carbon nanotubes with copper was developed for the fabrication of nanocomposite aluminum-nanotubes. The process consists of three stages: oxidation, activation and electroless copper plating on the nanotubes. The oxidation step was required to create chemical function on the nanotubes, essential for the activation step. Then, catalytic nanoparticles of tin-palladium were deposited on the tubes. Finally, during the electroless copper plating, copper particles with a size between 20 and 60 nm were uniformly deposited on the nanotubes surface. The reproducibility of the process was shown by using another type of carbon nanotube. The fabrication of nanocomposites aluminum-nanotubes was tested by aluminum vacuum infiltration. Although the infiltration of carbon nanotubes did not produce the expected results, an interesting electron microscopy sample was discovered during the process development: the activated carbon nanotubes. Secondly, scanning transmitted electron microscopy (STEM) imaging in SEM was analysed. The images were obtained with a new detector on the field emission scanning electron microscope (Hitachi S-4700). Various parameters were analysed with the use of two different samples: the activated carbon nanotubes (previously obtained) and gold-palladium nanodeposits. Influences of working distance, accelerating voltage or sample used on the spatial resolution of images obtained with SMART (Scanning Microscope Assessment and Resolution Testing) were analysed. An optimum working distance for the best spatial resolution related to the sample analysed was found for the imaging in STEM mode. Finally, relation between probe size and spatial resolution of backscattered electrons (BSE) images was studied. An image synthesis method was developed to generate the BSE images from backscattered electrons coefficients obtained with CASINO software. Spatial resolution of images was determined using SMART. The analysis shown that using a probe size smaller than the size of the observed object (sample features) does not improve the spatial resolution. In addition, the effects of the accelerating voltage, the current intensity and the sample geometry and composition were analysed.

Processing, Microstructure, and Mechanical Properties of Interpenetrating Biomorphic Graphite/Copper Composites

NASA Astrophysics Data System (ADS)

Childers, Amanda Esther Sall

Composite properties can surpass those of the individual phases, allowing for the development of advanced, high-performance materials. Bio-inspired and naturally-derived materials have garnered attention as composite constituents due to their inherently efficient and complex structures. Wood-derived ceramics, produced by converting a wood precursor into a ceramic scaffold, can exhibit a wide range of microstructures depending on the wood species, including porosity, pore size and distribution, and connectivity. The focus of this work was to investigate the processing, microstructure, and properties of graphite/copper composites produced using wood-derived graphite scaffolds. Graphite/copper composites combine low specific gravity, high thermal conductivity, and tailorable thermal expansion properties, and due to the non-wetting behavior of copper to graphite, offer a unique system in which mechanically bonded interfaces in composites can be studied. Graphite scaffolds were produced from red oak, beech, and pine precursors using a catalytic pyrolyzation method, resulting in varying types of pore networks. Two infiltration methods were investigated to overcome challenges associated with non-wetting systems: copper electrodeposition and pressure-assisted melt infiltration. The phase distributions, constituent properties, interfacial characteristics, mechanical behavior, and load partitioning of these biomorphic graphite/copper composites were investigated, and were correlated to the wood species. The multi-domain feature sizes in the graphite scaffolds resulted in composites with copper relegated not only to the large, connected channels produced from the transport features in the wood, but also within the smaller, lower aspect ratio fibrous regions of the scaffold. Both features contributed to the mechanical behavior of the composites to varying degrees depending on the wood species. A multi-component predictive model also was developed and used to guide the additive-assisted electroplating of the graphitized scaffold, and helped illuminate the roles of plating additives in macro-sized channels. The model can be adapted for many material systems, sample geometries, and plating conditions to investigate the use of metal electrodeposition as a means of scaffold infiltration. Additionally, X-ray diffraction tomography was used to resolve position-dependent strain in a composite. The results of this nascent capability were discussed with respect to a two-component system under increasing uniaxial load, and compared to the results of conventional volume-averaged measurements.

Plasmonic nanostructures for surface-enhanced Raman spectroscopy

NASA Astrophysics Data System (ADS)

Jiang, Ruiqian

In the last three decades, a large number of different plasmonic nanostructures have attracted much attention due to their unique optical properties. Those plasmonic nanostructures include nanoparticles, nanoholes and metal nanovoids. They have been widely utilized in optical devices and sensors. When the plasmonic nanostructures interact with the electromagnetic wave and their surface plasmon frequency match with the light frequency, the electrons in plasmonic nanostructures will resonate with the same oscillation as incident light. In this case, the plasmonic nanostructures can absorb light and enhance the light scattering. Therefore, the plasmonic nanostructures can be used as substrate for surface-enhanced Raman spectroscopy to enhance the Raman signal. Using plasmonic nanostructures can significantly enhance Raman scattering of molecules with very low concentrations. In this thesis, two different plasmonic nanostructures Ag dendrites and Au/Ag core-shell nanoparticles are investigated. Simple methods were used to produce these two plasmonic nanostructures. Then, their applications in surface enhanced Raman scattering have been explored. Ag dendrites were produced by galvanic replacement reaction, which was conducted using Ag nitrate aqueous solution and copper metal. Metal copper layer was deposited at the bottom side of anodic aluminum oxide (AAO) membrane. Silver wires formed inside AAO channels connected Ag nitrate on the top of AAO membrane and copper layer at the bottom side of AAO. Silver dendrites were formed on the top side of AAO. The second plasmonic nanostructure is Au/Ag core-shell nanoparticles. They were fabricated by electroless plating (galvanic replacement) reaction in a silver plating solution. First, electrochemically evolved hydrogen bubbles were used as template through electroless deposition to produce hollow Au nanoparticles. Then, the Au nanoparticles were coated with Cu shells in a Cu plating solution. In the following step, a AgCN based plating solution was used to replace Cu shell to form Au/Ag core-shell nanoparticles. These two plasmonic nanostructures were tested as substrates for Raman spectroscopy. It demonstrated that these plasmonic nanostructures could enhance Raman signal from the molecules on their surface. The results indicate that these plasmonic nanostructures could be utilized in many fields, such as such as biological and environmental sensors.

Impact of metal matrix composite on the evolution and erosion performance characteristics of non lubricated-dry abrasive degradation of ternary composite coating for refineries system

NASA Astrophysics Data System (ADS)

Anawe, Paul Apeye Lucky; Fayomi, Ojo Sunday Isaac

2018-06-01

The application of rational design principles and process in electrodeposition can eliminate many engineering catastrophes related to corrosion and micromechanical failure in service. This has led to appreciate the need of surface modification on component for enhance life span. Admixed Zn-30Al-13Ti-chloride composite bath was electrolytically prepared and successfully deposited on UNS G10150 mild steel substrate by zinc dual anode deposition processes within an interval of applied current density, particle concentration and constant time. The codeposition of Zn-Al-Ti coating was studied in the presence of other bath ingredient. The effect of deposition current and particle concentration on structural property, adhesion behaviour, ideal crystal orientation, surface topography and electrochemical properties of Zn-Al-Ti alloy coating series on mild steel were analytically examined. The wear stability of the developed composite materials was examined via sliding reciprocating rig. The structural integrity was examined with scanning electron microscope equipped with EDS, X-ray diffraction; Atomic force microscope, dura scan micro-hardness tester and 3 μ metrohm Potentiostat/galvanostat. Interestingly the induced activity of the Zn-Al-Ti chloride composite alloy results into excellent structural modification and stable crystal precipitation within the structural interface as a result of Zn3Al, Zn2Ti and ZnAl3Ti2 intermetallic phase. The obtained results showed that the introduction of Ti particles in the presence of other bath additive in the plating bath mostly modified the surface and brings an increase in the microhardness, corrosion resistance and reduce wear deformation of Zn-Al-Ti chloride composite alloy.

Development of reinforced in-situ anti-corrosion and wear Zn-TiO2/ZnTiB2 coatings on mild steel

NASA Astrophysics Data System (ADS)

Fayomi, O. S. I.; Popoola, A. P. I.; Kanyane, L. R.; Monyai, T.

The development of reinforced composite coating has resulted into advanced engineering application because of the exceptional properties and increase service life. In this study, we investigated the effect of Solanum tuberosum (ST) as additive to Zn-TiO2/Zn-TiB2 sulphate bath coating by co-deposition route on mild steel. The structural characteristics and surface profile of the produced coating were examined using scanning electron microscope coupled with energy dispersive spectroscopy (SEM/EDS) and PosiTector (SPG) respectively. The anti-corrosion resistance activities of the deposited coatings were evaluated on a 101 AUTOLAB potentiostat/galvanostat device in a 3.65 wt% NaCl. The wear characteristics of the Zn-TiO2/TiB2 composite coatings were examined on a dry abrasive MTR-300 test rig. The thermal stability of the produced coatings was studied in an isothermal furnace at 600 °C and further characterized using a high tech optical microscope. From the results, it was found that Zn-TiO2/Zn-TiB2 were compassed with needle like pattern and perhaps a compact and distinctive structure was found with Zn-TiO2/Zn-TiB2/ST coatings. The microhardness deposited coatings increased with TiO2 and TiB2 interference in the plating bath, more significant improvement was noticed in the presence of natural bath-additive and the addition of ST lead to changes in the morphologies of the composite coatings. A massive decrease in corrosion and wear rate in all coatings produced as against the control sample was noticed. This was attributed to the dispersive strengthening activities of the embedded TiO2/TiB2/ST additive on the bath formed.

Prototype of a scaled‐up microbial fuel cell for copper recovery

PubMed Central

Rodenas Motos, Pau; Molina, Gonzalo; Sleutels, Tom; Saakes, Michel; Buisman, Cees

2017-01-01

Abstract Background Bioelectrochemical systems (BESs) enable recovery of electrical energy through oxidation of a wide range of substrates at an anode and simultaneous recovery of metals at a cathode. Scale‐up of BESs from the laboratory to pilot scale is a challenging step in the development of the process, and there are only a few successful experiences to build on. This paper presents a prototype BES for the recovery of copper. Results The cell design presented here had removable electrodes, similar to those in electroplating baths. The anode and cathode in this design could be replaced independently. The prototype bioelectrochemical cell consisted of an 835 cm2 bioanode fed with acetate, and a 700 cm2 cathode fed with copper. A current density of 1.2 A/−2 was achieved with 48 mW m−2 of power production. The contribution of each component (anode, electrolytes, cathode and membrane) was evaluated through the analysis of the internal resistance distribution. This revealed that major losses occurred at the anode, and that the design with removable electrodes results in higher internal resistance compared with other systems. To further assess the practical applicability of BES for copper recovery, an economic evaluation was performed. Conclusion Analysis shows that the internal resistance of several lab‐scale BESs is already sufficiently low to make the system economic, while the internal resistance for scaled‐up systems still needs to be improved considerably to become economically applicable.© 2017 The Authors. Journal of Chemical Technology & Biotechnology published by John Wiley & Sons Ltd on behalf of Society of Chemical Industry. PMID:29104342

Heat transfer from an oxidized large copper surface to liquid helium: Dependence on surface orientation and treatment

DOE Office of Scientific and Technical Information (OSTI.GOV)

Iwamoto, A.; Mito, T.; Takahata, K.

Heat transfer of large copper plates (18 x 76 mm) in liquid helium has been measured as a function of orientation and treatment of the heat transfer surface. The results relate to applications of large scale superconductors. In order to clarify the influence of the area where the surface treatment peels off, the authors studied five types of heat transfer surface areas including: (a) 100% polished copper sample, (b) and (c) two 50% oxidized copper samples having different patterns of oxidation, (d) 75% oxidized copper sample, (e) 90% oxidized copper sample, and (f) 100% oxidized copper sample. They observed thatmore » the critical heat flux depends on the heat transfer surface orientation. The critical heat flux is a maximum at angles of 0{degrees} - 30{degrees} and decreases monotonically with increasing angles above 30{degrees}, where the angle is taken in reference to the horizontal axis. On the other hand, the minimum heat flux is less dependent on the surface orientation. More than 75% oxidation on the surface makes the critical heat flux increase. The minimum heat fluxes of the 50 and 90% oxidized Cu samples approximately agree with that of the 100% oxidized Cu sample. Experiments and calculations show that the critical and the minimum heat fluxes are a bilinear function of the fraction of oxidized surface area.« less

Design, analyses, fabrication and characterization of Nb3Sn coil in 1 W pulse tube cryocooler

NASA Astrophysics Data System (ADS)

Kundu, Ananya; Das, Subrat Kumar; Bano, Anees; Kumar, Nitish; Pradhan, Subrata

2017-02-01

A laboratory scale Nb3Sn coil is designed, analysed, fabricated and characterized in 1 W pulse tube cryocooler in solid nitrogen cooling mode and in conduction cooling mode. The magnetic field profile in axial and radial direction, Lorentz force component across the winding volume in operational condition are estimated in COMSOL. The coil is designed for 1.5 T at 100 A. It is fabricated in wind and react method. Before winding, the insulated Nb3Sn strand is wound on a copper mandrel which is thermally anchored with the 2nd stage of the cold head unit via a 10 mm thick copper ‘Z’ shaped plate The temperature distribution in 2nd cold stage, copper z plate and coil is monitored in both solid nitrogen cooling and conduction cooling mode. In solid nitrogen cooling mode, the quench of the coil occurs at 150 A for 0.01 A/s current ramp rate. The magnetic field at the centre of the coil bore is measured using transverse Hall sensor. The measured magnetic field value is compared with the analytical field value and they are found to be deviating ∼5% in magnitude. Again the coil is tested in conduction cooling mode maintaining the same current ramp rate and it is observed that the coil gets quenched at 70 A at temperature ∼ 10K.

Copper extraction from ammoniacal medium in a pulsed sieve-plate column with LIX 84-I.

PubMed

Gameiro, M Lurdes F; Machado, Remígio M; Ismael, M Rosinda C; Reis, M Teresa A; Carvalho, Jorge M R

2010-11-15

This article reports on a study of copper removal from ammoniacal aqueous solution (1.0 kg m(-3) Cu, pH 9.5) by liquid-liquid extraction using a pulsed sieve-plate column. The extractant tested was the hydroxyoxime LIX 84-I (2-hydroxy-5-nonylacetophenone oxime) in the aliphatic diluent Shellsol D-70. The results of the pilot plant experiments demonstrated the feasibility of operating the extraction process in this type of column, with efficiencies of copper removal in the range of 90.5-99.5%. Several effects on the column performance were examined, namely the aqueous and organic flow rates and the pulse velocity. The axial dispersion model was applied to simulate the concentration profiles, which reasonably predicted the experimental data. The overall mass transfer coefficient was evaluated from the experimental data and was found to be between 9×10(-6) and 1.2×10(-5) m s(-1). These data were compared with the ones obtained from the resistances in series model, which indicated that the resistance due to chemical reaction was 84-91% of the overall resistance to mass transfer. The extraction using a hollow fiber contactor was also carried out to compare the membrane process performance with the one of conventional process. Copyright © 2010 Elsevier B.V. All rights reserved.

Survey of coatings for solar collectors

NASA Technical Reports Server (NTRS)

Mcdonald, G. E.

1975-01-01

Optimum solar selective properties of black chrome require some tailoring of current and time for plating solution being used. Black zinc is produced from high zinc electroplate by subsequent conversion with chromate dip. Measurements have also been made of reflectance of previously known solar selective coatings of black copper and electroplated black nickel.

Coating for prevention of titanium combustion

NASA Technical Reports Server (NTRS)

Anderson, V. G.; Funkhouser, M.; Mcdaniel, P.

1980-01-01

A limited number of coating options for titanium gas turbine engine components were explored with the objective of minimizing potential combustion initiation and propagation without adversely affecting component mechanical properties. Objectives were met by two of the coatings, ion-plated platinum plus electroplated copper plus electroplated nickel and ion vapor deposited aluminum.

Indoor thermal performance evaluation of Daystar solar collector

NASA Technical Reports Server (NTRS)

Shih, K., Sr.

1977-01-01

The test procedures used and results obtained from a test program to obtain thermal performance data on a Daystar Model 21B, S/N 02210, Unit 2, liquid solar collector under simulated conditions are described. The test article is a flat plate solar collector using liquid as a heat transfer medium. The absorber plate is copper and coated with black paint. Between the tempered low iron glass and absorber plate is a polycarbonate trap used to suppress convective heat loss. The collector incorporates a convector heat dump panel to limit temperature excursions during stagnation. The following tests were conducted: (1) collector thermal efficiency; (2) collector time constant; (3) collector incident angle modifier; (4) collector heat loss coefficient; and (5) collector stagnation.

Electrolytically deposited Cadmium Selenide Films for Photovoltaic Applications

NASA Astrophysics Data System (ADS)

Dervos, C. T.; Palaiologopoulou, M. D.

2012-10-01

CdSe films were electrodeposited on pure nickel substrates. The nickel substrate was polished to a mirror finish by Al2O3 paste, etched in 10% HCl solution for 40 s and rinsed thoroughly by de-ionized water. The deposition bath contained solutions with excessive Cd2+ (0.2M) from CdSO4 and small amounts of SeO2 (1x10-3 M). The pH of the bath was adjusted to a value of 2.2 at RT by adding 10% H2SO4. The bath was first thermostated at the required temperature, which varied from 55°C to 65°C. Plating was accomplished at deposition potential 1000 mV (vs. Hg/Hg2SO4). The films formed had a uniform thickness and it was found to be approximately 2.0 μm thick (for 20 min electrodeposition process. The produced CdSe films were characterized by X-Ray diffraction and SEM. The induced semiconductor doping effect by thermal annealing in pure dry nitrogen gas was also investigated. Gold contacts were placed on top of the CdSe films, either by evaporation, or mechanically. Depending on the deposition parameters the electrical characteristics of the Ni/CdSe/Au structures may exhibit rectification properties. The optical excitation of the structure was investigated for various CdSe thicknesses.

Fabrication of ZnO nanorod using spray-pyrolysis and chemical bath deposition method

DOE Office of Scientific and Technical Information (OSTI.GOV)

Ramadhani, Muhammad F., E-mail: brian@tf.itb.ac.id; Pasaribu, Maruli A. H., E-mail: brian@tf.itb.ac.id; Yuliarto, Brian, E-mail: brian@tf.itb.ac.id

2014-02-24

ZnO thin films with nanorod structure were deposited using Ultrasonic Spray Pyrolysis method for seed growth, and Chemical Bath Deposition (CBD) for nanorod growth. High purity Zn-hydrate and Urea are used to control Ph were dissolved in ethanol and aqua bidest in Ultrasonic Spray Pyrolysis process. Glass substrate was placed above the heater plate of reaction chamber, and subsequently sprayed with the range duration of 5, 10 and 20 minutes at the temperatures of 3500 C. As for the Chemical Bath Deposition, the glass substrate with ZnO seed on the surface was immerse to Zn-hydrate, HMTA (Hexa Methylene Tetra Amine)more » and deionized water solution for duration of 3, 5 and 7 hour and temperatures of 600 C, washed in distilled water, dried, and annealed at 3500 C for an hour. The characterization of samples was carried out to reveal the surface morphology using Scanning Electron Microscopy (SEM). From the data, the combination of 5 minutes of Ultrasonic Spray Pyrolysis process and 3 hour of CBD has showed the best structure of nanorod. Meanwhile the longer Spraying process and CBD yield the bigger nanorod structure that have been made, and it makes the films more dense which make the nanorod collide each other and as a result produce unsymetric nanorod structure.« less

One-Dimensional Thermal Violence Cook-Off Test

NASA Astrophysics Data System (ADS)

Cook, Malcolm; Stennett, Christopher; University of Cranfield, Shrivenham, Swindon, SN6 8LA Team; AWE plc, Aldermaston, Reading Bershire, RG7 4PR, UK Team

2017-06-01

The One-Dimensional Thermal Violence (ODTV) test is designed to quantify and rank the violence of HE charges when heated to elevated temperatures. The test design consists of a central spherical explosive pellet encased in two aluminium barrel shaped halves, fitted with a copper sealing ring, encased by two aluminium locking rings placed over them from either end. The outer surface of the capsule is heated uniformly by placing in a pre-heated molten solder bath. This allows the time-to-explosion to be recorded for different initial bath temperatures. The ODTV capsule can hold samples up to 30mm in diameter. Diagnostics include both thermocouples and Photon Dopler Velocimetry (PDV). A series of live firings have been carried out on a range of bespoke HMX/HTPB explosives. These include HMX/HTPB mix ratios of 95/5, 92/8, 90/10, 88/12 and 85/15. These tests showed that the ODTV capsule had sufficient confinement and size that it could capture the spectrum of events expected from these formulations. It has been demonstrated that the deformation of the heater cup (that houses the molten solder) can be used as an additional violence metric along with the fragmentation and PDV wall velocities of the aluminium ODTV capsule.

A-15 Superconducting composite wires and a method for making

DOEpatents

Suenaga, Masaki; Klamut, Carl J.; Luhman, Thomas S.

1984-01-01

A method for fabricating superconducting wires wherein a billet of copper containing filaments of niobium or vanadium is rolled to form a strip which is wrapped about a tin-alloy core to form a composite. The alloy is a tin-copper alloy for niobium filaments and a gallium-copper alloy for vanadium filaments. The composite is then drawn down to a desired wire size and heat treated. During the heat treatment process, the tin in the bronze reacts with the niobium to form the superconductor niobium tin. In the case where vanadium is used, the gallium in the gallium bronze reacts with the vanadium to form the superconductor vanadium gallium. This new process eliminates the costly annealing steps, external tin plating and drilling of bronze ingots required in a number of prior art processes.

Wrapping process for fabrication of A-15 superconducting composite wires

DOEpatents

Suenaga, M.; Klamut, C.J.; Luhman, T.S.

1980-08-15

A method for fabricating superconducting wires wherein a billet of copper containing filaments of niobium or vanadium is rolled to form a strip which is wrapped about a tin-alloy core to form a composite. The alloy is a tin-copper alloy for niobium filaments and a gallium-copper alloy for vanadium filaments. The composite is then drawn down to a desired wire size and heat treated. During the heat treatment process, the tin in the bronze reacts with the niobium to form the superconductor niobium tin. In the case where vanadium is used, the gallium in the gallium bronze reacts with the vanadium to form the superconductor vanadium gallium. This new process eliminates the costly annealing steps, external tin plating and drilling of bronze ingots required in a number of prior art processes.

METHOD OF APPLYING NICKEL COATINGS ON URANIUM

DOEpatents

Gray, A.G.

1959-07-14

A method is presented for protectively coating uranium which comprises etching the uranium in an aqueous etching solution containing chloride ions, electroplating a coating of nickel on the etched uranium and heating the nickel plated uranium by immersion thereof in a molten bath composed of a material selected from the group consisting of sodium chloride, potassium chloride, lithium chloride, and mixtures thereof, maintained at a temperature of between 700 and 800 deg C, for a time sufficient to alloy the nickel and uranium and form an integral protective coating of corrosion-resistant uranium-nickel alloy.

An Investigation of Technologies for Hazardous Sludge Reduction at AFLC (Air Force Logistics Command) Industrial Waste Treatment Plants. Volume 2. Literature Review of Available Technologies for Treating Heavy Metal Wastewaters.

DTIC Science & Technology

1983-12-01

plate quality. Dummying of chromium baths is used in the special case where high cathode-to-anode 15ea ratio has resulted in build up of trivalent ... chromium (Cr ).Dummying with a high anode -to-cat hode area ratio can be used to reoxidize the trivalent to hexavalent chromium (Cr +6 ). Proper...the trivalent state, which then can be precipitated as chromium hydroxide by alkali neutralization " Cyanide oxidation (if needed) of segregated

Apparatus and method for electroforming high aspect ratio micro-parts

DOEpatents

Hachman, John T [Stockton, CA; Losey, Matthew W [Rancho Cucamonga, CA; McLean, Dorrance E [Manteca, CA

2009-11-27

A fixture is disclosed to more easily affix a workpiece in the proper orientation and spacing with sealed electrical interconnection within an electrochemical plating bath. The workpiece can be any planar metallic or non-metallic substrate such as a silicon wafer commonly used in LIGA or microsystem fabrication. The fixture described allows the workpiece to be submerged deep within an electrolytic cell, facing upwards, and allows easy transfer from one cell to another. The edges, backside, and electrical connections are sealed and protected from the electrolyte.

Acoustic manipulation of bacteria cells suspensions

NASA Astrophysics Data System (ADS)

GutiéRrez-Ramos, Salomé; Hoyos, Mauricio; Aider, Jean Luc; Ruiz, Carlos; Acoustofluidics Team Team; Soft; Bio Group Collaboration

An acoustic contacless manipulation gives advantages in the exploration of the complex dynamics enviroment that active matter exhibits. Our works reports the control confinement and dispersion of Escherichia coliRP437-pZA3R-YFP suspensions (M9Glu-Ca) via acoustic levitation.The manipulation of the bacteria bath in a parallel plate resonator is achieved using the acoustic radiation force and the secondary radiation force. The primary radiation force generates levitation of the bacteria cells at the nodal plane of the ultrasonic standing wave generated inside the resonator. On the other side, secondary forces leads to the consolidation of stable aggregates. All the experiments were performed in the acoustic trap described, where we excite the emission plate with a continuous sinusoidal signal at a frequency in the order of MHz and a quartz slide as the reflector plate. In a typical experiment we observed that, before the input of the signal, the bacteria cells exhibit their typical run and tumble behavior and after the sound is turned on all of them displace towards the nodal plane, and instantaneously the aggregation begins in this region. CNRS French National Space Studies, CONACYT Mexico.

Hardening parts by chrome plating in manufacture and repair

NASA Astrophysics Data System (ADS)

Astanin, V. K.; Pukhov, E. V.; Stekolnikov, Y. A.; Emtsev, V. V.; Golikova, O. A.

2018-03-01

In the engineering industry, galvanic coatings are widely used to prolong the service life of the machines, which contribute to the increase in the strength of the parts and their resistance to environmental influences, temperature and pressure drops, wear and fretting corrosion. Galvanic coatings have been widely applied in engineering, including agriculture, aircraft building, mining, construction, and electronics. The article focuses on the manufacturing methods of new agricultural machinery parts and the repair techniques of worn parts by chrome plating. The main attention is paid to the unstable methods of chromium deposition (in pulsed and reversing modes) in low-concentration electrolytes, which makes it possible to increase the reliability and durability of the hardened parts operation by changing the conditions of electrocrystallization, that is, directed formation of the structure and texture, thickness, roughness and microhardness of chromium plating. The practical recommendations are given on the current and temperature regimes of chromium deposition and composition of baths used for the restoration and hardening of the machine parts. Moreover, the basic methods of machining allowances removal are analysed.

Indirect spectrophotometric determination of sodium ceftriaxone with n-propyl alcohol-ammonium sulfate-water system by extraction flotation of copper(II).

PubMed

Zhao, Wei; Zhang, Yan; Li, Quanmin

2008-05-01

Although the determination methods of sodium ceftriaxone has been increasingly reported, these methods have their inherent limits preventing them from being broadly applied in common laboratories. In order to circumvent this problem, a rapid and simple method for the indirect spectrophotometric determination of sodium ceftriaxone is reported. Sodium ceftriaxone was degraded completely in the presence of 0.20 mol/l sodium hydroxide in boiling water bath for 20 min. The thiol group (-SH) of the degradation product (I) of sodium ceftriaxone could reduce cupric to cuprous ions, and the resulting which was precipitated with the thiol group (-SH) of the degradation product (II) at pH 4.0. By determining the residual amount of copper (II), the indirect determination of sodium ceftriaxone can be achieved. Standard curve of sodium ceftriaxone versus the flotation yield of copper(II) showed that sodium ceftriaxone could be determined in low concentrations. The linear range of sodium ceftriaxone was 0.70-32 microg/ml and the detection limit evaluated by calibration curve (3sigma/k) was found to be 0.60 microg/ml. A simple and efficient method was developed and it has been successfully applied to the determination of sodium ceftriaxone in human serum and urine samples, respectively. It is expected that this method will find broad applications in the detection of cephalosporin derivatives with similar structure.

The characteristics of void distribution in spalled high purity copper cylinder under sweeping detonation

NASA Astrophysics Data System (ADS)

Yang, Yang; Jiang, Zhi; Chen, Jixinog; Guo, Zhaoliang; Tang, Tiegang; Hu, Haibo

2018-03-01

The effects of different peak compression stresses (2-5 GPa) on the spallation behaviour of high purity copper cylinder during sweeping detonation were examined by Electron Backscatter Diffraction Microscopy, Doppler Pins System and Optical Microscopy techniques. The velocity history of inner surface and the characteristics of void distributions in spalled copper cylinder were investigated. The results indicated that the spall strength of copper in these experiments was less than that revealed in previous reports concerning plate impact loading. The geometry of cylindrical copper and the obliquity of incident shock during sweeping detonation may be the main reasons. Different loading stresses seemed to be responsible for the characteristics of the resultant damage fields, and the maximum damage degree increased with increasing shock stress. Spall planes in different cross-sections of sample loaded with the same shock stress of 3.29 GPa were found, and the distance from the initiation end has little effect on the maximum damage degree (the maximum damage range from 12 to 14%), which means that the spallation behaviour was stable along the direction parallel to the detonation propagation direction under the same shock stress.

Microbiology, chemistry and biofilm development in a pilot drinking water distribution system with copper and plastic pipes.

PubMed

Lehtola, Markku J; Miettinen, Ilkka T; Keinänen, Minna M; Kekki, Tomi K; Laine, Olli; Hirvonen, Arja; Vartiainen, Terttu; Martikainen, Pertti J

2004-10-01

We studied the changes in water quality and formation of biofilms occurring in a pilot-scale water distribution system with two generally used pipe materials: copper and plastic (polyethylene, PE). The formation of biofilms with time was analysed as the number of total bacteria, heterotrophic plate counts and the concentration of ATP in biofilms. At the end of the experiment (after 308 days), microbial community structure, viable biomass and gram-negative bacterial biomass were analysed via lipid biomarkers (phospholipid fatty acids and lipopolysaccharide 3-hydroxy fatty acids), and the numbers of virus-like particles and total bacteria were enumerated by SYBR Green I staining. The formation of biofilm was slower in copper pipes than in the PE pipes, but after 200 days there was no difference in microbial numbers between the pipe materials. Copper ion led to lower microbial numbers in water during the first 200 days, but thereafter there were no differences between the two pipe materials. The number of virus-like particles was lower in biofilms and in outlet water from the copper pipes than PE pipes. Pipe material influenced also the microbial and gram-negative bacterial community structure in biofilms and water.

Colloidal and electrochemical aspects of copper-CMP

NASA Astrophysics Data System (ADS)

Sun, Yuxia

Copper based interconnects with low dielectric constant layers are currently used to increase interconnect densities and reduce interconnect time delays in integrated circuits. The technology used to develop copper interconnects involves Chemical Mechanical Planarization (CMP) of copper films deposited on low-k layers (silica or silica based films), which is carried out using slurries containing abrasive particles. One issue using such a structure is copper contamination over dielectric layers (SiO2 film), if not reduced, this contamination will cause current leakage. In this study, the conditions conducive to copper contamination onto SiO2 films during Cu-CMP process were studied, and a post-CMP cleaning technique was discussed based on experimental results. It was found that the adsorption of copper onto a silica surface is kinetically fast (<0.5 minute). The amount of copper absorbed is pH and concentration dependent and affected by presence of H2O2, complexing agents, and copper corrosion inhibitor Benzotrazole. Based on de-sorption results, DI water alone was unable to reduce adsorbed copper to an acceptable level, especially for adsorption that takes place at a higher pH condition. The addition of complex agent, citric acid, proved effective in suppressing copper adsorption onto oxide silica during polishing or post-CMP cleaning by forming stable copper-CA complexes. Surface Complexation Modeling was used to simulate copper adsorption isotherms and predict the copper contamination levels on SiO2 surfaces. Another issue with the application of copper CMP is its environmental impact. CMP is a costly process due to its huge consumption of pure water and slurry. Additionally, Cu-CMP processing generates a waste stream containing certain amounts of copper and abrasive slurry particles. In this study, the separation technique electrocoagulation was investigated to remove both copper and abrasive slurry particles simultaneously. For effluent containing ˜40 ppm dissolved copper, it was found that ˜90% dissolved copper was removed from the waste streams through electroplating and in-situ chemical precipitation. The amount of copper removed through plating is impacted by membrane surface charge, type/amount of complexing agents, and solid content in the slurry suspension. The slurry particles can be removed ˜90% within 2 hours of EC through multiple mechanisms.

Influence of clamping plate permeability and metal screen structures on three-dimensional magnetic field and eddy current loss in end region of a turbo-generator by numerical analysis

NASA Astrophysics Data System (ADS)

Likun, Wang; Weili, Li; Yi, Xue; Chunwei, Guan

2013-11-01

A significant problem of turbogenerators on complex end structures is overheating of local parts caused by end losses in the end region. Therefore, it is important to investigate the 3-D magnetic field and eddy current loss in the end. In end region of operating large turbogenerator at thermal power plants, magnetic leakage field distribution is complex. In this paper, a 3-D mathematical model used for the calculation of the electromagnetic field in the end region of large turbo-generators is given. The influence of spatial locations of end structures, the actual shape and material of end windings, clamping plate, and copper screen are considered. Adopting the time-step finite element (FE) method and taking the nonlinear characteristics of the core into consideration, a 3-D transient magnetic field is calculated. The objective of this paper is to investigate the influence of clamping plate permeability and metal screen structures on 3-D electromagnetic field distribution and eddy current loss in end region of a turbo-generator. To reduce the temperature of copper screen, a hollow metal screen is proposed. The eddy current loss, which is gained from the 3D transient magnetic field, is used as heat source for the thermal field of end region. The calculated temperatures are compared with test data.

Theory and performance of plated thermocouples.

NASA Technical Reports Server (NTRS)

Pesko, R. N.; Ash, R. L.; Cupschalk, S. G.; Germain, E. F.

1972-01-01

A theory has been developed to describe the performance of thermocouples which have been formed by electroplating portions of one thermoelectric material with another. The electroplated leg of the thermocouple was modeled as a collection of infinitesimally small homogeneous thermocouples connected in series. Experiments were performed using several combinations of Constantan wire sizes and copper plating thicknesses. A transient method was used to develop the thermoelectric calibrations, and the theory was found to be in quite good agreement with the experiments. In addition, data gathered in a Soviet experiment were also found to be in close agreement with the theory.

Experimental evaluation of a fixed collector employing vee-trough concentrator and vacuum tube receivers

NASA Technical Reports Server (NTRS)

Selcuk, M. K.

1977-01-01

A test bed for experimental evaluation of a fixed solar collector which combines an evacuated glass tube solar receiver with a flat plate/black chrome plated copper absorber and an asymmetric vee-trough concentrator was designed and constructed. Earlier predictions of thermal performance were compared with test data acquired for a bare vacuum tube receiver; and receiver tubes with Alzak aluminum, aluminized FEP Teflon film laminated sheet metal and second surface ordinary mirror reflectors. Test results and system economics as well as objectives of an ongoing program to obtain long-term performance data are discussed.

Better Ceramics Through Chemistry 4. Symposium Held in San Francisco, California on April 16 - 20, 1990. Volume 180

DTIC Science & Technology

1990-04-20

metal alkoxide precursors. For example, we only recently obtained the first X - ray crystallographic data on bismuth alkoxides, Bi(OR)3 (R = C(CH 3)3...OCMe3)6(u.O2CMe)4(J14-O2CMe)2. Complex I was fully characterized by single crystal X - ray crystallography. The six copper atoms are linked by six...hydrolyzed samples of 3 revealed stacks of plate-like particles with sizes up to 20 x 50 microns (Figure 3). X - ray analysis of these plates showed

DOE Office of Scientific and Technical Information (OSTI.GOV)

Maines, Warren Russell; Kittell, David E.; Hobbs, Michael L.

In this work, we combined the miniature cylinder expansion test (Mini-Cylex), with the Disk Acceleration Test (DAX) using Type K copper, Picatinny Liquid Explosive, and photonic Doppler velocimetry. We estimated the CJ state using plate reverberation methods at the test cap. We extracted velocities at 2, 7, and 10 volume expansions to fit Jones-Wilkins-Lee Equation of State and estimated Gurney velocity at the tube wall. The test also provides an additional method to estimate reaction products Hugoniot through knowledge of the copper test cap. Our experiments and simulations are within expected uncertainty. Lastly, the test and the analysis effectively reducemore » costs while keeping or increasing fidelity.« less

Organic Rankine cycle receiver development

NASA Technical Reports Server (NTRS)

Haskins, H. J.

1981-01-01

The selected receiver concept is a direct-heated, once-through, monotube boiler operated at supercritical pressure. The cavity is formed by a cylindrical copper shell and backwall, with stainless steel tubing brazed to the outside surface. This core is surrounded by lightweight refractory insulation, load-bearing struts, and an outer case. The aperture plate is made of copper to provide long life by conduction and reradiation of heat away from the aperture lip. The receiver thermal efficiency is estimated to be 97 percent at rated conditions (energy transferred to toluene divided by energy incident on aperture opening). Development of the core manufacturing and corrosion protection methods is complete.

Motel solar-hot-water system with nonpressurized storage--Jacksonville, Florida

NASA Technical Reports Server (NTRS)

1981-01-01

Modular roof-mounted copper-plated arrays collect solar energy; heated water drains from them into 1,000 gallon nonpressurized storage tank which supplies energy to existing pressurized motel hot water lines. System provides 65 percent of hot water demand. Report described systems parts and operation, maintenance, and performance and provides warranty information.

Initial evaluation of floor cooling on lactating sows under severe acute heat stress

USDA-ARS?s Scientific Manuscript database

The objective was to evaluate the effects of floor cooling on lactating sows under severe summer heat stress. Twelve multiparous sows were provided with a cooling pad built with an aluminum plate surface, high-density polyethylene base and copper pipes. Treatments were randomly allotted to sows to r...

Effect of floor cooling on late lactation sows under acute heat stress

USDA-ARS?s Scientific Manuscript database

The objective was to evaluate the effects of floor cooling on late lactation sows under severe summer heat stress. Ten multiparous sows were provided with a cooling pad built with an aluminum plate surface, high-density polyethylene base and copper pipes. Treatments were randomly allotted to sows to...

Effects of floor cooling on late lactation sows under severe acute heat stress

USDA-ARS?s Scientific Manuscript database

The objective was to evaluate the effects of floor cooling on late lactation sows under severe summer heat stress. Ten multiparous sows were provided with a cooling pad built with an aluminum plate surface, high-density polyethylene base and copper pipes. Treatments were randomly allotted to sows to...

Initial evaluation of floor cooling on lactating sows under severe acute heat stress

USDA-ARS?s Scientific Manuscript database

The objectives were to evaluate an acute heat stress protocol for lactating sows and evaluate preliminary estimates of water flow rates required to cool sows. Twelve multiparous sows were provided with a cooling pad built with an aluminum plate surface, high-density polyethylene base and copper pipe...

External Peltier Cooler For Low-Noise Amplifier

NASA Technical Reports Server (NTRS)

Soper, Terry A.

1990-01-01

Inexpensive Peltier-effect cooling module made of few commercially available parts used to reduce thermal noise in microwave amplifier. Retrofitted to almost any microwave low-noise amplifier or receiver preamplifier used in communication, telemetry, or radar. Includes copper or aluminum cold plate held tightly against unit to be cooled by strap-type worm-gear clamps.

Ultrasound Thermal Imaging and its application to Rayleigh-Bénard convection in mercury

NASA Astrophysics Data System (ADS)

Xu, Hongzhou; Andereck, C. David

2003-11-01

We have developed Ultrasound Thermal Imaging (UTI), a non-intrusive ultrasound technique for internal temperature measurement of opaque fluids, and have applied UTI to low Rayleigh number buoyancy driven convection in mercury. UTI relies upon the variation of sound speed with temperature of the fluid. An array of ultrasound transducers scanned electronically along the sidewall of a convection cell with aspect ratio of 6 yields a map of the thermal field over the chamber. The chamber has stainless steel sidewalls and molybdenum covered copper plates at the top and bottom. As the Rayleigh number increases slowly from zero, the data reveal the formation of a roll cell pattern and transitions between different cellular states. Based on standard deviation distributions of the temperature profile at the cell's mid-depth, the critical temperature difference agrees well with the theoretically predicted value. The heat flux through the horizontal mercury layer was determined by thermistors mounted at the exit and entrance of the internal channel in each copper plate through which flows warm/cool constant temperature water. Nusselt numbers and other experimental results will also be presented.

Apparatus for precision micromachining with lasers

DOEpatents

Chang, J.J.; Dragon, E.P.; Warner, B.E.

1998-04-28

A new material processing apparatus using a short-pulsed, high-repetition-rate visible laser for precision micromachining utilizes a near diffraction limited laser, a high-speed precision two-axis tilt-mirror for steering the laser beam, an optical system for either focusing or imaging the laser beam on the part, and a part holder that may consist of a cover plate and a back plate. The system is generally useful for precision drilling, cutting, milling and polishing of metals and ceramics, and has broad application in manufacturing precision components. Precision machining has been demonstrated through percussion drilling and trepanning using this system. With a 30 W copper vapor laser running at multi-kHz pulse repetition frequency, straight parallel holes with size varying from 500 microns to less than 25 microns and with aspect ratios up to 1:40 have been consistently drilled with good surface finish on a variety of metals. Micromilling and microdrilling on ceramics using a 250 W copper vapor laser have also been demonstrated with good results. Materialographic sections of machined parts show little (submicron scale) recast layer and heat affected zone. 1 fig.

Apparatus for precision micromachining with lasers

DOEpatents

Chang, Jim J.; Dragon, Ernest P.; Warner, Bruce E.

1998-01-01

A new material processing apparatus using a short-pulsed, high-repetition-rate visible laser for precision micromachining utilizes a near diffraction limited laser, a high-speed precision two-axis tilt-mirror for steering the laser beam, an optical system for either focusing or imaging the laser beam on the part, and a part holder that may consist of a cover plate and a back plate. The system is generally useful for precision drilling, cutting, milling and polishing of metals and ceramics, and has broad application in manufacturing precision components. Precision machining has been demonstrated through percussion drilling and trepanning using this system. With a 30 W copper vapor laser running at multi-kHz pulse repetition frequency, straight parallel holes with size varying from 500 microns to less than 25 microns and with aspect ratios up to 1:40 have been consistently drilled with good surface finish on a variety of metals. Micromilling and microdrilling on ceramics using a 250 W copper vapor laser have also been demonstrated with good results. Materialogroaphic sections of machined parts show little (submicron scale) recast layer and heat affected zone.

R245fa Flow Boiling inside a 4.2 mm ID Microfin Tube

NASA Astrophysics Data System (ADS)

Longo, G. A.; Mancin, S.; Righetti, G.; Zilio, C.

2017-11-01

This paper presents the R245fa flow boiling heat transfer and pressure drop measurements inside a mini microfin tube with internal diameter at the fin tip of 4.2 mm, having 40 fins, 0.15 mm high with a helix angle of 18°. The tube was brazed inside a copper plate and electrically heated from the bottom. Sixteen T-type thermocouples are located in the copper plate to monitor the wall temperature. The experimental measurements were carried out at constant mean saturation temperature of 30 °C, by varying the refrigerant mass velocity between 100 kg m-2 s-1 and 300 kg m-2 s-1, the vapour quality from 0.15 to 0.95, at two different heat fluxes: 30 and 60 kW m-2. The experimental results are presented in terms of two-phase heat transfer coefficient, onset dryout vapour quality, and frictional pressure drop. Moreover, the experimental measurements are compared against the most updated models for boiling heat transfer coefficient and frictional pressure drop estimations available in the open literature for microfin tubes.

Template-Free Electroless Plating of Gold Nanowires: Direct Surface Functionalization with Shape-Selective Nanostructures for Electrochemical Applications.

PubMed

Muench, Falk; Schaefer, Sandra; Hagelüken, Lorenz; Molina-Luna, Leopoldo; Duerrschnabel, Michael; Kleebe, Hans-Joachim; Brötz, Joachim; Vaskevich, Alexander; Rubinstein, Israel; Ensinger, Wolfgang

2017-09-13

Metal nanowires (NWs) represent a prominent nanomaterial class, the interest in which is fueled by their tunable properties as well as their excellent performance in, for example, sensing, catalysis, and plasmonics. Synthetic approaches to obtain metal NWs mostly produce colloids or rely on templates. Integrating such nanowires into devices necessitates additional fabrication steps, such as template removal, nanostructure purification, or attachment. Here, we describe the development of a facile electroless plating protocol for the direct deposition of gold nanowire films, requiring neither templates nor complex instrumentation. The method is general, producing three-dimensional nanowire structures on substrates of varying shape and composition, with different seed types. The aqueous plating bath is prepared by ligand exchange and partial reduction of tetrachloroauric acid in the presence of 4-dimethylaminopyridine and formaldehyde. Gold deposition proceeds by nucleation of new grains on existing nanostructure tips and thus selectively produces curvy, polycrystalline nanowires of high aspect ratio. The nanofabrication potential of this method is demonstrated by producing a sensor electrode, whose performance is comparable to that of known nanostructures and discussed in terms of the catalyst architecture. Due to its flexibility and simplicity, shape-selective electroless plating is a promising new tool for functionalizing surfaces with anisotropic metal nanostructures.

Enhanced gain and output power of a sealed-off rf-excited CO2 waveguide laser with gold-plated electrodes

NASA Astrophysics Data System (ADS)

Heeman-Ilieva, M. B.; Udalov, Yu. B.; Hoen, K.; Witteman, W. J.

1994-02-01

The small-signal gain and the laser output power have been measured in a cw sealed-off rf-excited CO2 waveguide laser for two different electrode materials, gold-plated copper and aluminum, at several excitation frequencies, gas pressures and mixture compositions. In the case of the gold-plated electrodes an enhancement of the gain up to a factor of 2 and the output power up to a factor of 1.4 with time at a frequency of 190 MHz and 60 Torr of 1:1:5+5% (CO2:N2:He+Xe) mixture is observed. This is believed to be the result of the gold catalytic activities which are favored by increased electrode temperatures and helium rich gas compositions.

Microcomponents manufacturing for precise devices by copper vapor laser

NASA Astrophysics Data System (ADS)

Gorny, Sergey; Nikonchuk, Michail O.; Polyakov, Igor V.

2001-06-01

This paper presents investigation results of drilling of metal microcomponents by copper vapor laser. The laser consists of master oscillator - spatial filter - amplifier system, electronics switching with digital control of laser pulse repetition rate and quantity of pulses, x-y stage with computer control system. Mass of metal, removed by one laser pulse, is measured and defined by means of diameter and depth of holes. Interaction of next pulses on drilled material is discussed. The difference between light absorption and metal evaporation processes is considered for drilling and cutting. Efficiency of drilling is estimated by ratio of evaporation heat and used laser energy. Maximum efficiency of steel cutting is calculated with experimental data of drilling. Applications of copper vapor laser for manufacturing is illustrated by such microcomponents as pin guide plate for printers, stents for cardio surgery, encoded disks for security systems and multiple slit masks for spectrophotometers.

Magnetic field sensor based on the Ampere's force using dual-polarization DBR fiber laser

NASA Astrophysics Data System (ADS)

Yao, Shuang; Zhang, Yang; Guan, Baiou

2015-08-01

A novel magnetic field sensor using distributed Bragg reflector (DBR) fiber laser by Ampere's force effect is proposed and experimentally demonstrated. The key sensing element, that is the dual-polarization DBR fiber laser, is fixed on the middle part of two copper plates which carry the current. Ampere's force is applied onto the coppers due to an external magnetic field generated by a DC solenoid. Thus, the lateral force from the coppers is converted to a corresponding beat frequency signal shift produced by the DBR laser. The electric current sensing is also realized by the same configuration and same principle simultaneously in an intuitive manner. Good agreement between the theory calculation and the experimental results is obtained, which shows a good linearity. This sensor's sensitivity to the magnetic field and to the electric current finally reaches ~258.92 kHz/mT and ~1.08727 MHz/A, respectively.

Structural and optical properties of copper-coated substrates for solar thermal absorbers

NASA Astrophysics Data System (ADS)

Pratesi, Stefano; De Lucia, Maurizio; Meucci, Marco; Sani, Elisa

2016-10-01

Spectral selectivity, i.e. merging a high absorbance at sunlight wavelengths to a low emittance at the wavelengths of thermal spectrum, is a key characteristics for materials to be used for solar thermal receivers. It is known that spectrally selective absorbers can raise the receiver efficiency for all solar thermal technologies. Tubular sunlight receivers for parabolic trough collector (PTC) systems can be improved by the use of spectrally selective coatings. Their absorbance is increased by deposing black films, while the thermal emittance is minimized by the use of properly-prepared substrates. In this work we describe the intermediate step in the fabrication of black-chrome coated solar absorbers, namely the fabrication and characterization of copper coatings on previously nickel-plated stainless steel substrates. We investigate the copper surface features and optical properties, correlating them to the coating thickness and to the deposition process, in the perspective to assess optimal conditions for solar absorber applications.

Relationship between porphyry copper occurrences, crustal preservation levels, and amount of exploration in magmatic belts of the Central Tethys region

USGS Publications Warehouse

Zürcher, Lukas; Bookstrom, Arthur A.; Hammarstrom, Jane M.; Mars, John; Ludington, Stephen; Zientek, Michael L.; Dunlap, Pamela; Wallis, John C.

2014-01-01

A probabilistic assessment of undiscovered resources in porphyry copper deposits in the Central Tethys region of Turkey, the Caucasus, Iran, western Pakistan, and southern Afghanistan was conducted as part of a U.S.G.S. global mineral resource assessment. The purpose was to delineate areas as permissive tracts for the occurrence of porphyry Cu-Mo and Cu-Au deposits, and to provide estimates of amounts of Cu, Mo, and Au likely to be contained in undiscovered porphyry deposits (Zürcher et al., 2013; Zürcher et al., in review). Tectonic, geologic, geochemical, geochronologic, and ore deposits data compiled and analyzed for this assessment show that magmatism in the region can be rationalized in terms of fundamental plate tectonic principles, including mantle-involved post-subduction processes. However, uplift, erosion, subsidence, and burial of porphyry copper deposits also played an important role in shaping the observed metallogenic patterns.

Silicon Sheet Growth Development for the Large Area Sheet Task of the Low Cost Solar Array Project. Heat Exchanger Method - Ingot Casting Fixed Abrasive Method - Multi-Wire Slicing

NASA Technical Reports Server (NTRS)

Schmid, F.; Khattak, C. P.

1978-01-01

Solar cells fabricated from HEM cast silicon yielded up to 15% conversion efficiencies. This was achieved in spite of using unpurified graphite parts in the HEM furnace and without optimization of material or cell processing parameters. Molybdenum retainers prevented SiC formation and reduced carbon content by 50%. The oxygen content of vacuum cast HEM silicon is lower than typical Czochralski grown silicon. Impregnation of 45 micrometers diamonds into 7.5 micrometers copper sheath showed distortion of the copper layer. However, 12.5 micrometers and 15 micrometers copper sheath can be impregnated with 45 micrometers diamonds to a high concentration. Electroless nickel plating of wires impregnated only in the cutting edge showed nickel concentration around the diamonds. This has the possibility of reducing kerf. The high speed slicer fabricated can achieve higher speed and longer stroke with vibration isolation.

Study on the effect of temperature rise on grain refining during fabrication of nanocrystalline copper under explosive loading

NASA Astrophysics Data System (ADS)

Wang, Jinxiang; Yang, Rui; Jiang, Li; Wang, Xiaoxu; Zhou, Nan

2013-11-01

Nanocrystalline (NC) copper was fabricated by severe plastic deformation of coarse-grained copper at a high strain rate under explosive loading. The feasibility of grain refinement under different explosive loading and the influence of overall temperature rise on grain refinement under impact compression were studied in this paper. The calculation model for the macroscopic temperature rise was established according to the adiabatic shock compression theory. The calculation model for coarse-grained copper was established by the Voronoi method and the microscopic temperature rise resulted from severe plastic deformation of grains was calculated by ANSYS/ls-dyna finite element software. The results show that it is feasible to fabricate NC copper by explosively dynamic deformation of coarse-grained copper and the average grain size of the NC copper can be controlled between 200˜400 nm. The whole temperature rise would increase with the increasing explosive thickness. Ammonium nitrate fuel oil explosive was adopted and five different thicknesses of the explosive, which are 20 mm, 25 mm, 30 mm, 35 mm, 45 mm, respectively, with the same diameter using 20 mm to the fly plate were adopted. The maximum macro and micro temperature rise is up to 532.4 K, 143.4 K, respectively, which has no great effect on grain refinement due to the whole temperature rise that is lower than grain growth temperature according to the high pressure melting theory.