Textured carbon surfaces on copper by sputtering

NASA Technical Reports Server (NTRS)

Curren, A. N. (Inventor); Jensen, K. A. (Inventor); Roman, R. F. (Inventor)

1986-01-01

A very thin layer of highly textured carbon is applied to a copper surface by a triode sputtering process. A carbon target and a copper substrate are simultaneously exposed to an argon plasma in a vacuum chamber. The resulting carbon surface is characterized by a dense, random array of needle like spires or peaks which extend perpendicularly from the copper surface. The coated copper is especially useful for electrode plates in multistage depressed collectors.

Production of Copper-Plated Beamline Bellows and Spools for LCLS-II

DOE Office of Scientific and Technical Information (OSTI.GOV)

Wilson, Katherine M.; Carpenter, Brian C.; Daly, Ed

The SLAC National Accelerator Laboratory is currently constructing a major upgrade to its accelerator, the Linac Coherent Light Source II (LCLS-II). Several Department of Energy national laboratories, including the Thomas Jefferson National Accelerator Facility (JLab) and Fermi National Accelerator Laboratory (FNAL), are participating in this project. The 1.3-GHz cryomodules for this project consist of eight cavities separated by bellows (expansion joints) and spools (tube sections), which are copper plated for RF conduction. JLab is responsible for procurement of these bellows and spools, which are delivered to JLab and FNAL for assembly into cryomodules. Achieving accelerator-grade copper plating is always amore » challenge and requires careful specification of requirements and application of quality control processes. Due to the demanding technical requirements of this part, JLab implemented procurement strategies to make the process more efficient as well as provide process redundancy. This paper discusses the manufacturing challenges that were encountered and resolved, as well as the strategies that were employed to minimize the impact of any technical issues.« less

Electroless Cu Plating on Anodized Al Substrate for High Power LED.

PubMed

Rha, Sa-Kyun; Lee, Youn-Seoung

2015-03-01

Area-selective copper deposition on screen printed Ag pattern/anodized Al/Al substrate was attempted using a neutral electroless plating processes for printed circuit boards (PCBs), according to a range of variation of pH 6.5-pH 8 at 70 °C. The utilized basic electroless solution consisted of copper(II) sulfate pentahydrate, sodium phosphinate monohydrate, sodium citrate tribasic dihydrate, ammonium chloride, and nickel(II) sulfate hexahydrate. The pH of the copper plating solutions was adjusted from pH 6.5 to pH 8 using NH4OH. Using electroless plating in pH 6.5 and pH 7 baths, surface damage to the anodized Al layer hardly occurred; the structure of the plated Cu-rich films was a typical fcc-Cu, but a small Ni component was co-deposited. In electroless plating at pH 8, the surface of the anodized Al layer was damaged and the Cu film was composed of a lot of Ni and P which were co-deposited with Cu. Finally, in a pH 7 bath, we can make a selectively electroless plated Cu film on a PCB without any lithography and without surface damage to the anodized Al layer.

Fabrication of Aluminum-Based Thermal Radiation Plate for Thermoelectric Module Using Aluminum Anodic Oxidization and Copper Electroplating.

PubMed

Choi, Yi Taek; Bae, Sung Hwa; Son, Injoon; Sohn, Ho Sang; Kim, Kyung Tae; Ju, Young-Wan

2018-09-01

In this study, electrolytic etching, anodic oxidation, and copper electroplating were applied to aluminum to produce a plate on which a copper circuit for a thermoelectric module was formed. An oxide film insulating layer was formed on the aluminum through anodic oxidation, and platinum was coated by sputtering to produce conductivity. Finally, copper electroplating was performed directly on the substrate. In this structure, the copper plating layer on the insulating layer served as a conductive layer in the circuit. The adhesion of the copper plating layer was improved by electrolytic etching. As a result, the thermoelectric module fabricated in this study showed excellent adhesion and good insulation characteristics. It is expected that our findings can contribute to the manufacture of plates applicable to thermoelectric modules with high dissipation performance.

Micro-Welding of Copper Plate by Frequency Doubled Diode Pumped Pulsed Nd:YAG Laser

NASA Astrophysics Data System (ADS)

Nakashiba, Shin-Ichi; Okamoto, Yasuhiro; Sakagawa, Tomokazu; Takai, Sunao; Okada, Akira

A pulsed laser of 532 nm wavelength with ms range pulse duration was newly developed by second harmonic generation of diode pumped pulsed Nd:YAG laser. High electro-optical conversion efficiency more than 13% could be achieved, and 1.5 kW peak power green laser pulse was put in optical fiber of 100 μm in diameter. In micro- welding of 1.0 mm thickness copper plate, a keyhole welding was successfully performed by 1.0 kW peak power at spot diameter less than 200 μm. The frequency doubled pulsed laser improved the processing efficiency of copper welding, and narrow and deep weld bead was stably obtained.

Lightweight bipolar storage battery

NASA Technical Reports Server (NTRS)

Rowlette, John J. (Inventor)

1992-01-01

An apparatus [10] is disclosed for a lightweight bipolar battery of the end-plate cell stack design. Current flow through a bipolar cell stack [12] is collected by a pair of copper end-plates [16a,16b] and transferred edgewise out of the battery by a pair of lightweight, low resistance copper terminals [28a,28b]. The copper terminals parallel the surface of a corresponding copper end-plate [16a,16b] to maximize battery throughput. The bipolar cell stack [12], copper end-plates [16a,16b] and copper terminals [28a,28b] are rigidly sandwiched between a pair of nonconductive rigid end-plates [20] having a lightweight fiber honeycomb core which eliminates distortion of individual plates within the bipolar cell stack due to internal pressures. Insulating foam [30] is injected into the fiber honeycomb core to reduce heat transfer into and out of the bipolar cell stack and to maintain uniform cell performance. A sealed battery enclosure [ 22] exposes a pair of terminal ends [26a,26b] for connection with an external circuit.

Use of Electrodeposition for Sample Preparation and Rejection Rate Prediction for Assay of Electroformed Ultra High Purity Copper for 232Th and 238U Prior to Inductively Coupled Plasma Mass Spectrometry (ICP/MS)

DOE Office of Scientific and Technical Information (OSTI.GOV)

Hoppe, Eric W.; Aalseth, Craig E.; Brodzinski, Ronald L.

The search for neutrinoless double beta decay in 76Ge has driven the need for ultra-low background Ge detectors shielded by electroformed copper of ultra-high radiopurity (<0.1µBq/kg). Although electrodeposition processes are almost sophisticated enough to produce copper of this purity, to date there are no methods sensitive enough to assay it. Inductively-coupled plasma mass spectrometry (ICP/MS) can detect thorium and uranium at femtogram levels, but in the past, this assay has been hindered by high copper concentrations in the sample. Electrodeposition of copper samples removes copper from the solution while selectively concentrating thorium and uranium contaminants to be assayed by ICP/MS.more » Spiking 232Th and 238U into the plating bath simulates low purity copper and allows for the calculation of the electrochemical rejection rate of thorium and uranium in the electroplating system. This rejection value will help to model plating bath chemistry.« less

[Exposure to metal compounds in occupational galvanic processes].

PubMed

Surgiewicz, Jolanta; Domański, Wojciech

2006-01-01

Occupational galvanic processes are provided in more than 600 small and medium enterprises in Poland. Workers who deal with galvanic coating are exposed to heavy metal compounds: tin, silver, copper and zinc. Some of them are carcinogenic, for example, hexavalent chromium compounds, nickel and cadmium compounds. Research covered several tens of workstations involved in chrome, nickel, zinc, tin, silver, copper and cadmium plating. Compounds of metals present in the air were determined: Cr, Ni, Cd, Sn, Ag--by atomic absorption spectrometry with electrothermal atomization (ET-AAS) and Zn--by atomic absorption spectrometry with flame atomization (F-AAS). The biggest metal concentrations--of silver and copper--were found at workstations of copper, brass, cadmium, nickel and chrome plating, conducted at the same time. Significant concentrations of copper were found at workstations of maintenance bathing and neutralizing of sewage. The concentrations of metals did not exceed Polish MAC values. MAC values were not exceeded for carcinogenic chromium(VI), nickel or cadmium, either. In galvanic processes there was no hazard related to single metals or their compounds, even carcinogenic ones. Combined exposure indicators for metals at each workstation did not exceed 1, either. However, if there are even small quantities of carcinogenic agents, health results should always be taken into consideration.

Experimental investigations of tungsten inert gas assisted friction stir welding of pure copper plates

NASA Astrophysics Data System (ADS)

Constantin, M. A.; Boșneag, A.; Nitu, E.; Iordache, M.

2017-10-01

Welding copper and its alloys is usually difficult to join by conventional fusion welding processes because of high thermal diffusivity of the copper, alloying elements, necessity of using a shielding gas and a clean surface. To overcome this inconvenience, Friction Stir Welding (FSW), a solid state joining process that relies on frictional heating and plastic deformation, is used as a feasible welding process. In order to achieve an increased welding speed and a reduction in tool wear, this process is assisted by another one (WIG) which generates and adds heat to the process. The aim of this paper is to identify the influence of the additional heat on the process parameters and on the welding joint properties (distribution of the temperature, hardness and roughness). The research includes two experiments for the FSW process and one experiment for tungsten inert gas assisted FSW process. The outcomes of the investigation are compared and analysed for both welding variants. Adding a supplementary heat source, the plates are preheated and are obtain some advantages such as reduced forces used in process and FSW tool wear, faster and better plasticization of the material, increased welding speed and a proper weld quality.

Fabrication of Copper-Rich Cu-Al Alloy Using the Wire-Arc Additive Manufacturing Process

NASA Astrophysics Data System (ADS)

Dong, Bosheng; Pan, Zengxi; Shen, Chen; Ma, Yan; Li, Huijun

2017-12-01

An innovative wire-arc additive manufacturing (WAAM) process is used to fabricate Cu-9 at. pct Al on pure copper plates in situ, through separate feeding of pure Cu and Al wires into a molten pool, which is generated by the gas tungsten arc welding (GTAW) process. After overcoming several processing problems, such as opening the deposition molten pool on the extremely high-thermal conductive copper plate and conducting the Al wire into the molten pool with low feed speed, the copper-rich Cu-Al alloy was successfully produced with constant predesigned Al content above the dilution-affected area. Also, in order to homogenize the as-fabricated material and improve the mechanical properties, two further homogenization heat treatments at 1073 K (800 °C) and 1173 K (900 °C) were applied. The material and mechanical properties of as-fabricated and heat-treated samples were compared and analyzed in detail. With increased annealing temperatures, the content of precipitate phases decreased and the samples showed gradual improvements in both strength and ductility with little variation in microstructures. The present research opened a gate for in-situ fabrication of Cu-Al alloy with target chemical composition and full density using the additive manufacturing process.

Development of Surfaces Optically Suitable for Flat Solar Panels. [using a reflectometer which separately evaluates spectral and diffuse reflectivities of surfaces

NASA Technical Reports Server (NTRS)

1979-01-01

A reflectometer which can separately evaluate the spectral and diffuse reflectivities of surfaces is described. A phase locked detection system for the reflectometer is also described. A selective coating on aluminum potentially useful for flat plate solar collector applications is presented. The coating is composed of strongly bound copper oxide (divalent) and is formed by an etching process performed on an aluminum alloy with high copper content. Fabrication costs are expected to be small due to the one stop fabrication process. A number of conclusions gathered from the literature as to the required optical properties of flat plate solar collectors are discussed.

Research on metal-plated cellulose nitrate flakes and their infrared / millimeter wave characteristics

NASA Astrophysics Data System (ADS)

Ye, Shu-qin; Zhu, Chen-guang; Wang, Li-hong; Ou'yang, De-hua; Pan, Gong-pei

2016-10-01

Copper-plated and silver-plated cellulose nitrate flakes, which were prepared by using chemical plating technology, were used to jam infrared detector and millimeter-wave radar. It was tested for the conductivity and infrared jamming performance of plating and also the RCS (Radar Cross Section) performance of millimeter-wave radar. Test results showed that the prepared metal-plated cellulose nitrate flakes have obvious conductivity, and infrared total radiation energy of silver plating and copper plating had approximately increased 32% and 21% respectively. Through determination, the millimeter-wave reflecting property and RCS of silver-plated cellulose nitrate flakes were higher than that of copper-plated cellulose nitrate flakes. Therefore, silver-plated cellulose nitrate flakes can be used as an effective infrared / millimeter wave composite jamming material.

Preparation of graphite dispersed copper composite on copper plate with CO2 laser

NASA Astrophysics Data System (ADS)

Yokoyama, S.; Ishikawa, Y.; Muizz, M. N. A.; Hisyamudin, M. N. N.; Nishiyama, K.; Sasano, J.; Izaki, M.

2018-01-01

It was tried in this work to prepare the graphite dispersed copper composite locally on a copper plate with a CO2 laser. The objectives of this study were to clear whether copper graphite composite was prepared on a copper plate and how the composite was prepared. The carbon content at the laser spot decreased with the laser irradiation time. This mainly resulted from the elimination by the laser trapping. The carbon content at the outside of the laser spot increased with time. Both the laser ablation and the laser trapping did not act on the graphite particles at the outside of the laser spot. Because the copper at the outside of the laser spot melted by the heat conduction from the laser spot, the particles were fixed by the wetting. However, the graphite particles were half-floated on the copper plate. The Vickers hardness decreased with an increase with laser irradiation time because of annealing.

Printed Nano Cu and NiSi Contacts and Metallization for Solar Cell Modules

DOE Office of Scientific and Technical Information (OSTI.GOV)

Carmody, Michael John

There has long been a desire to replace the front-side silver contacts in silicon solar cells. There are two driving forces to do this. First, silver is an expensive precious metal. Secondly, the process to use silver requires that it be formulated into screen print pastes that need a lead-containing glass frit, and the use of lead is forbidden in many parts of the world. Because of the difficulty in replacing these pastes and the attendant processes, lead exemptions have granted to solar cells. Copper has been the replacement metal of choice because it is significantly cheaper than silver andmore » is very close to silver in electrical conductivity. Using processes which do not use lead, obviates it as an environmental contaminant. However, copper cannot be in contact with the silicon of the cell since it migrates through the silicon and causes defects which severely damage the efficiency of the cell. Hence, a conductive barrier must be placed between the copper and silicon and nickel, and especially nickel silicide, have been shown to be materials of choice. However, nickel must be sputtered and annealed to create the nickel silicide barrier, and copper has either been sputtered or plated. All of these processes require expensive, specialized equipment and plating uses environmentally unfriendly chemicals. Therefore, Intrinsiq proposed using printed nano nickel silicide ink (which we had previously invented) and printed nano copper ink to create these electrodes and barriers. We found that nano copper ink could be readily printed and sintered under a reducing atmosphere to give highly conductive grids. We further showed that nano nickel silicide ink could be readily jetted into grids on top of the silicon cell. It could then be annealed to create a barrier. However, it was found that the combination of printed NiSi and printed Cu did not give contact resistivity good enough to produce efficient cells. Only plated copper on top of the printed NiSi gave useful contact resistivity, and that proved to five to ten times less conductive than the commercial silver grids. Even so, the NiSi layer was a very good barrier to copper migration, even under harsh environmental conditions. Additionally, both plated copper and printed copper could be soldered to. While it may be possible to produce an all printed copper/nickel silicide top electrode for silicon cells, it was not easily demonstrated within the time and monetary constraints of the present project. Additionally, potential customers have told us that having to laser ablate the anti-reflection coating of cells to create a connection for NiSi, and the addition of two printing and annealing (sintering for copper) steps, adds too much expense to compensate for any potential cost savings from using copper. The cost benefits of copper have been further eroded by the facts that over the lifetime of this project, the cost of silver electrodes decreased due to manufacturers finding ways to use less and less silver, and inventing pastes which use less costly silver materials to begin with. All of these factors were considered and led to the decision to stop the program before actual manufacturing scale was attempted.« less

46 CFR 114.600 - Incorporation by reference.

Code of Federal Regulations, 2014 CFR

2014-10-01

... Conshohocken, PA 19428-2959 ASTM B 96-93, Standard Specification for Copper-Silicon Alloy Plate, Sheet, Strip... Operating Salt Spray (Fog) Apparatus 114.400 ASTM B 122/B 122M-95, Standard Specification for Copper-Nickel-Tin Alloy , Copper-Nickel-Zinc Alloy (Nickel Silver), and Copper-Nickel Alloy Plate, Sheet, Strip, and...

46 CFR 114.600 - Incorporation by reference.

Code of Federal Regulations, 2013 CFR

2013-10-01

... Conshohocken, PA 19428-2959 ASTM B 96-93, Standard Specification for Copper-Silicon Alloy Plate, Sheet, Strip... Operating Salt Spray (Fog) Apparatus 114.400 ASTM B 122/B 122M-95, Standard Specification for Copper-Nickel-Tin Alloy , Copper-Nickel-Zinc Alloy (Nickel Silver), and Copper-Nickel Alloy Plate, Sheet, Strip, and...

Purity test for copper-plating solutions

NASA Technical Reports Server (NTRS)

Mansfeld, F. B.

1977-01-01

Electrode configuration can be used to measure extent of impurities in acid-copper plating solution. It can be inserted into any plating tank and will show whether bath is clean or contaminated, within fifteen minutes.

Copper circuit patterning on polymer using selective surface modification and electroless plating

NASA Astrophysics Data System (ADS)

Park, Sang Jin; Ko, Tae-Jun; Yoon, Juil; Moon, Myoung-Woon; Oh, Kyu Hwan; Han, Jun Hyun

2017-02-01

We have examined a potential new and simple method for patterning a copper circuit on PET substrate by copper electroless plating, without the pretreatment steps (i.e., sensitization and activation) for electroless plating as well as the etching processes of conventional circuit patterning. A patterned mask coated with a catalyst material, Ag, for the reduction of Cu ions, is placed on a PET substrate. Subsequent oxygen plasma treatment of the PET substrate covered with the mask promotes the selective generation of anisotropic pillar- or hair-like nanostructures coated with co-deposited nanoparticles of the catalyst material on PET. After oxygen plasma treatment, a Cu circuit is well formed just by dipping the plasma-treated PET into a Cu electroless plating solution. By increasing the oxygen gas pressure in the chamber, the height of the nanostructures increases and the Ag catalyst particles are coated on not only the top but also the side surfaces of the nanostructures. Strong mechanical interlocking between the Cu circuit and PET substrate is produced by the large surface area of the nanostructures, and enhances peel strength. Results indicate this new simple two step (plasma surface modification and pretreatment-free electroless plating) method can be used to produce a flexible Cu circuit with good adhesion.

Experimental Investigation of Mechanical Properties of Welded Corten Steel A588 Grade Plate Using ER70S - 6 Filler Material for Construction Application

NASA Astrophysics Data System (ADS)

Deepak, J. R.; Bupesh Raja, V. K.; Janardhan Guptha, Mittapalli; Durga Prasad, Palaparthi Hari; Sriram, V.

2017-05-01

ASTM A588 Grade A steel plate is a high strength, low alloy structural steel with 0.19 % of carbon content. When exposed to the atmosphere, A588 Grade A is suitable for construction in the bare (paint - free) condition. The main problems are lack of fusion, lack of penetration and corrosion on heat affected zone. In this research work Corten ASTM A588 Grade steel of 3mm thickness is electroplated with copper and then both raw and copper electroplated are welded by GMAW welding process with ER70S-6 as a filler material. The welded ASTM A588 is cut according to ASTM size for further testing of mechanical properties. Considering its welding strength after the process of electroplating, this research clearly states the metal can be utilized for better results in any given field. Here both the tensile and hardness are higher in copper electroplated welded when compare to raw welded.

Preparation of graphite dispersed copper composite with intruding graphite particles in copper plate

NASA Astrophysics Data System (ADS)

Noor, Abdul Muizz Mohd; Ishikawa, Yoshikazu; Yokoyama, Seiji

2017-01-01

In this study, it was attempted that copper-graphite composite was prepared locally on the surface of a copper plate with using a spot welding machine. Experiments were carried out with changing the compressive load, the repetition number of the compression and the electrical current in order to study the effect of them on carbon content and Vickers hardness on the copper plate surface. When the graphite was pushed into copper plate only with the compressive load, the composite was mainly hardened by the work hardening. The Vickers hardness increased linearly with an increase in the carbon content. When an electrical current was energized through the composite at the compression, the copper around the graphite particles were heated to the temperature above approximately 2100 K and melted. The graphite particles partially or entirely dissolved into the melt. The graphite particles were precipitated from the melt under solidification. In addition, this high temperature caused the improvement of wetting of copper to graphite. This high temperature caused the annealing, and reduced the Vickers hardness. Even in this case, the Vickers hardness increased with an increase in the carbon content. This resulted from the dispersion hardening.

Weld Repair of Thin Aluminum Sheet

NASA Technical Reports Server (NTRS)

Beuyukian, C. S.; Mitchell, M. J.

1986-01-01

Weld repairing of thin aluminum sheets now possible, using niobium shield and copper heat sinks. Refractory niobium shield protects aluminum adjacent to hole, while copper heat sinks help conduct heat away from repair site. Technique limits tungsten/inert-gas (TIG) welding bombardment zone to melt area, leaving surrounding areas around weld unaffected. Used successfully to repair aluminum cold plates on Space Shuttle, Commercial applications, especially in sealing fractures, dents, and holes in thin aluminum face sheets or clad brazing sheet in cold plates, heat exchangers, coolers, and Solar panels. While particularly suited to thin aluminum sheet, this process also used in thicker aluminum material to prevent surface damage near weld area.

Laser-induced selective copper plating of polypropylene surface

NASA Astrophysics Data System (ADS)

Ratautas, K.; Gedvilas, M.; Stankevičiene, I.; JagminienÄ--, A.; Norkus, E.; Li Pira, N.; Sinopoli, S.; Emanuele, U.; Račiukaitis, G.

2016-03-01

Laser writing for selective plating of electro-conductive lines for electronics has several significant advantages, compared to conventional printed circuit board technology. Firstly, this method is faster and cheaper at the prototyping stage. Secondly, material consumption is reduced, because it works selectively. However, the biggest merit of this method is potentiality to produce moulded interconnect device, enabling to create electronics on complex 3D surfaces, thus saving space, materials and cost of production. There are two basic techniques of laser writing for selective plating on plastics: the laser-induced selective activation (LISA) and laser direct structuring (LDS). In the LISA method, pure plastics without any dopant (filler) can be used. In the LDS method, special fillers are mixed in the polymer matrix. These fillers are activated during laser writing process, and, in the next processing step, the laser modified area can be selectively plated with metals. In this work, both methods of the laser writing for the selective plating of polymers were investigated and compared. For LDS approach, new material: polypropylene with carbon-based additives was tested using picosecond and nanosecond laser pulses. Different laser processing parameters (laser pulse energy, scanning speed, the number of scans, pulse durations, wavelength and overlapping of scanned lines) were applied in order to find out the optimal regime of activation. Areal selectivity tests showed a high plating resolution. The narrowest width of a copper-plated line was less than 23 μm. Finally, our material was applied to the prototype of the electronic circuit board on a 2D surface.

Neutronics Benchmarks for the Utilization of Mixed-Oxide Fuel: Joint U.S./ Russian Progress Report for Fiscal Year 1997, Volume 4, Part 8 - Neutron Poison Plates in Assemblies Containing Homogeneous Mixtures of Polystyrene-Moderated Plutonium and Uranium Oxides

DOE Office of Scientific and Technical Information (OSTI.GOV)

Yavuz, M.

1999-05-01

In the 1970s at the Battelle Pacific Northwest Laboratory (PNL), a series of critical experiments using a remotely operated Split-Table Machine was performed with homogeneous mixtures of (Pu-U)O{sub 2}-polystyrene fuels in the form of square compacts having different heights. The experiments determined the critical geometric configurations of MOX fuel assemblies with and without neutron poison plates. With respect to PuO{sub 2} content and moderation [H/(Pu+U)atomic] ratio (MR), two different homogeneous (Pu-U) O{sub 2}-polystyrene mixtures were considered: Mixture (1) 14.62 wt% PuO{sub 2} with 30.6 MR, and Mixture (2) 30.3 wt% PuO{sub 2} with 2.8 MR. In all mixtures, the uraniummore » was depleted to about O.151 wt% U{sup 235}. Assemblies contained copper, copper-cadmium or aluminum neutron poison plates having thicknesses up to {approximately}2.5 cm. This evaluation contains 22 experiments for Mixture 1, and 10 for Mixture 2 compacts. For Mixture 1, there are 10 configurations with copper plates, 6 with aluminum, and 5 with copper-cadmium. One experiment contained no poison plate. For Mixture 2 compacts, there are 3 configurations with copper, 3 with aluminum, and 3 with copper-cadmium poison plates. One experiment contained no poison plate.« less

One-step internal-tin Nb/sub 3/Sn superconductor fabrication. Final report, June 1983-August 1984

DOE Office of Scientific and Technical Information (OSTI.GOV)

Marancik, W.

1985-03-01

The object of this research is to demonstrate the feasibility of producing a Nb/sub 3/Sn superconductor in a single extrusion process with a large number of filaments with internal tin. The technique chosen uses .010'-diameter Nb and tin-plated Cu wires formed into a solenoid. The solenoid is covered with tin-plated copper foil and isostatically compacted to a pressure of 17,000 psi. The solenoid is slit along its length. This results in a ribbon about 40 inches long by about 5-inches wide, with the Nb wires running across the 5-inch-width. The ribbon is then rolled up (Jelly Roll) around a 0.5more » inch diameter Ta covered copper rod to produce a composite of about 1.5 inches in diameter by 5 inches long. The composite geometry is now a cylindrical bundle of 0.010-inch-diameter Nb wire separated from each other by tin-plated copper. Each Nb wire is aligned with the axis of cylinder. The cylinder is slid into a Ta-lined copper extrusion can which is evacuated and sealed. The can is extruded at a low temperature and drawn to final wire size without intermediate annealing. The advantage of the process is that it is an internal tin process with the tin uniformly distributed through the matrix. The Nb is in a relatively soft state having been fully annealed at 0.020-inch diameter. Only one extrusion is required since the bundling technique allows a large number of wires to be precisely aligned and spaced in the matrix.« less

METHOD OF APPLYING COPPER COATINGS TO URANIUM

DOEpatents

Gray, A.G.

1959-07-14

A method is presented for protecting metallic uranium, which comprises anodic etching of the uranium in an aqueous phosphoric acid solution containing chloride ions, cleaning the etched uranium in aqueous nitric acid solution, promptly electro-plating the cleaned uranium in a copper electro-plating bath, and then electro-plating thereupon lead, tin, zinc, cadmium, chromium or nickel from an aqueous electro-plating bath.

Nondestructive test method accurately sorts mixed bolts

NASA Technical Reports Server (NTRS)

Dezeih, C. J.

1966-01-01

Neutron activation analysis method sorts copper plated steel bolts from nickel plated steel bolts. Copper and nickel plated steel bolt specimens of the same configuration are irradiated with thermal neutrons in a test reactor for a short time. After thermal neutron irradiation, the bolts are analyzed using scintillation energy readout equipment.

Development of ceramic-coated weld backing bars

DOE Office of Scientific and Technical Information (OSTI.GOV)

Eggleston, B.R.

1994-10-20

In shipbuilding and many other industries, copper weld backing bars are used to draw the heat out of the weld. The problem that some users of these bars encounter is that these bars, on occasion, actually melt in spots and become welded to the weld plates. After this happens a number of times, the backing bar becomes so degraded that it must be either discarded or machined, both of which are very costly and time-consuming actions. To avoid this fusion between the backing bar and the weld plate, the weld processes that are used cannot be ones of high beatmore » input. This requirement is very limiting when thick plates are being welded. The plates must be beveled, and more weld passes must be run. These problems are also costly and time consuming. The aim of this project is to find a way to produce backing bars with nearly the same `chilling` effect but with both a greater resistance to molten metal and resistance to arcing to the backing bar itself. A possible solution currently being tested is to coat the copper bars with a thin layer of a ceramic coating. The procedure used was to coat the copper bars with either alumina or spinel by a plasma spraying method.« less

Development of low cost contacts to silicon solar cells

NASA Technical Reports Server (NTRS)

Tanner, D. P.; Iles, P. A.

1980-01-01

A copper based contact system using plated Pd-Cr-Cu was developed. Good cells were made but cells degraded under low temperature (300 C) heat treatments. The degradation was identified as copper migration into the cells junction region. A paper study was conducted to find a proper barrier to the copper migration problem. Nickel was identified as the best candidate barrier and this was verified in a heat treatment study using evaporated metal layers. An electroless nickel solution was substituted for the electroless chromium solution in the original process.

Laser etching of polymer masked leadframes

NASA Astrophysics Data System (ADS)

Ho, C. K.; Man, H. C.; Yue, T. M.; Yuen, C. W.

1997-02-01

A typical electroplating production line for the deposition of silver pattern on copper leadframes in the semiconductor industry involves twenty to twenty five steps of cleaning, pickling, plating, stripping etc. This complex production process occupies large floor space and has also a number of problems such as difficulty in the production of rubber masks and alignment, generation of toxic fumes, high cost of water consumption and sometimes uncertainty on the cleanliness of the surfaces to be plated. A novel laser patterning process is proposed in this paper which can replace many steps in the existing electroplating line. The proposed process involves the application of high speed laser etching techniques on leadframes which were protected with polymer coating. The desired pattern for silver electroplating is produced by laser ablation of the polymer coating. Excimer laser was found to be most effective for this process as it can expose a pattern of clean copper substrate which can be silver plated successfully. Previous working of Nd:YAG laser ablation showed that 1.06 μm radiation was not suitable for this etching process because a thin organic and transparent film remained on the laser etched region. The effect of excimer pulse frequency and energy density upon the removal rate of the polymer coating was studied.

Electroless plating Cu-Co-P polyalloy on UV/ozonolysis irradiated polyethylene terephthalate film and its corrosion resistance

NASA Astrophysics Data System (ADS)

Hou, Lei; Bi, Siyi; Zhao, Hang; Xu, Yumeng; Mu, Yuhang; Lu, Yinxiang

2017-05-01

High corrosion resistant Cu-Co-P coatings were firstly prepared on polyethylene terephthalate (PET) substrate by electroless plating in combination with UV/ozonolysis irradiation under optimized cobalt sulfate heptahydrate concentration, pH value, plating temperature and time. The copper polyalloy/PET composite can be obtained in three steps, namely: (i) the generation of oxygen-containing functionalities (carboxylic groups) onto PET surface through UV irradiation combined with ozone, (ii) Cu seeding catalysts were obtained after being immersed into cupric citrate and NaBH4 solutions subsequently, and (iii) Cu-Co-P polyalloy metallization using electroless plating bath. Attenuated total reflection fourier transformation infrared spectrometer (ATR-FTIR), X-ray photoelectron spectroscopy (XPS), water contact angle measurement and energy dispersive X-ray analysis (EDAX) were utilized to track the surface changes during the whole process. The electroless plating conditions were optimized by an orthogonal experiment (L9(3)4) for Cu-Co-P coating as follows: CoSO4·7H2O addition of 0.08 M, pH value, plating temperature and time were set on 10.0, 35 °C and 25 min, respectively. Under the optimal conditions, copper polyalloy possessed high adhesive strength and the lowest surface resistance (8.06 Ω/sq), while maintaining reliability even after over 1000 times of bending and mechanical stress. The results of scanning electron microscope (SEM) and atomic force microscope (AFM) measurements showed that Cu-Co-P layer formed on PET surface was imparted with fine uniformity and high compactness. Electrochemical test revealed the optimized Cu-Co-P coatings exhibited high corrosion resistance in NaCl, NaOH and HCl solutions, respectively. The excellent electromagnetic interference shielding effectiveness (EMI SE >99.999% at frequency ranging from 30 MHz to 1000 MHz) of copper polyalloy/PET composites was confirmed by the spectrum analyzer. Therefore, this copper polyalloy will have potential applications in microelectronics packaging and coatings for anti-corrosion and electromagnetic interference shielding.

Finding Platinum-Coating Gaps On Titanium Anodes

NASA Technical Reports Server (NTRS)

Bodemeijer, Ronnald; Flowers, Cecil E.

1990-01-01

Simple procedure makes gaps visible to eye. New gap-detection method consists of plating thin layer of non-silver-colored metal like copper or gold on anode. Contrast in color between plated metal and bare anode material makes gaps stand out. If anode passes inspection, copper or gold plate removable by reversal of test-plating current. Remains to be determined whether test plating and removal damages anode. New method simpler and more economical than previous attempts to identify gaps in platinum.

Wrapping process for fabrication of A-15 superconducting composite wires

DOEpatents

Suenaga, M.; Klamut, C.J.; Luhman, T.S.

1980-08-15

A method for fabricating superconducting wires wherein a billet of copper containing filaments of niobium or vanadium is rolled to form a strip which is wrapped about a tin-alloy core to form a composite. The alloy is a tin-copper alloy for niobium filaments and a gallium-copper alloy for vanadium filaments. The composite is then drawn down to a desired wire size and heat treated. During the heat treatment process, the tin in the bronze reacts with the niobium to form the superconductor niobium tin. In the case where vanadium is used, the gallium in the gallium bronze reacts with the vanadium to form the superconductor vanadium gallium. This new process eliminates the costly annealing steps, external tin plating and drilling of bronze ingots required in a number of prior art processes.

Long-Term Effects of Soldering By-Products on Nickel-Coated Copper Wire

NASA Technical Reports Server (NTRS)

Rolin, T. D.; Hodge, R. E.

2008-01-01

An analysis of thirty-year-old, down graded flight cables was conducted to determine the makeup of a green material on the surface of the shielded wire near soldered areas and to ascertain if the green material had corroded the nickel-coated copper wire. Two likely candidates were possible due to the handling and environments to which these cables were exposed. The flux used to solder the cables is known to contain abietic acid, a carboxylic acid found in many pine rosins used for the soldering process. The resulting material copper abietate is green in color and is formed during the application of heat during soldering operations. Copper (II) chloride, which is also green in color is known to contaminate flight parts and is corrosive. Data is presented that shows the material is copper abietate, not copper (II) chloride, and more importantly that the abietate does not aggressively attack nickel-plated copper wire.

Shock induced spall fracture in polycrystalline copper

NASA Astrophysics Data System (ADS)

Mukherjee, D.; Rav, Amit; Sur, Amit; Joshi, K. D.; Gupta, Satish C.

2014-04-01

The plate impact experiments have been conducted on commercially available 99.99% pure polycrystalline samples of copper using single stage gas gun facility. The free surface velocity history of the sample plate measured using VISAR instrument is utilized to determine the dynamic yield strength and spall strength of copper. The dynamic yield strength and spall strength of polycrystalline copper sample has been determined to be 0.14 GPa and 1.32 GPa, respectively with corresponding strain rates of the order of 104/s.

Aluminum and Other Coatings for the Passivation of Tritium Storage Vessels

DOE Office of Scientific and Technical Information (OSTI.GOV)

Spencer, W.; Korinko, P.

Using a highly sensitive residual gas analyzer, the off-gassing of hydrogen, water, and hydrocarbons from surface-treated storage vessels containing deuterium was measured. The experimental storage vessels were compared to a low-off-gassing, electro-polished 304L canister. Alternative vessels were made out of aluminum, or were coatings on 304L steel. Coatings included powder pack aluminide, electro-plated aluminum, powder pack chromide, dense electro-plated chromium, copper plated, and copper plated with 25 and 50 percent nano-diamond. Vessels were loaded with low pressure deuterium to observe exchange with protium or hydrogen as observed with formation of HD and HDO. Off gas of D 2O or possiblemore » CD 4 was observed at mass 20. The main off-gas in all of the studies was H 2. The studies indicated that coatings required significant post-coating treatment to reduce off-gas and enhance the permeation barrier from gases likely added during the coating process. Dense packed aluminum coatings needed heating to drive off water. Electro-plated aluminum, chromium and copper coatings appeared to trap hydrogen from the plating process. Nano-diamond appeared to enhance the exchange rate with hydrogen off gas, and its coating process trapped significant amounts of hydrogen. Aluminum caused more protium exchange than chromium-treated surfaces. Aluminum coatings released more water, but pure aluminum vessels released small amounts of hydrogen, little water, and generally performed well. Chromium coating had residual hydrogen that was difficult to totally outgas but otherwise gave low residuals for water and hydrocarbons. Our studies indicated that simple coating of as received 304L metal will not adequately block hydrogen. The base vessel needs to be carefully out-gassed before applying a coating, and the coating process will likely add additional hydrogen that must be removed. Initial simple bake-out and leak checks up to 350° C for a few hours was found to be inadequate. All of the studies indicated that vessels needed several days of vacuum baking at 350-450° C to fully outgas the residual gases, which were mostly hydrogen. The current standard practice of out-gassing from ultra-clean, electro-polished 304L vessels with both vacuum bake-out and followed by an oxidative bake out to enhance the chromium surface performed the best in these studies.« less

Development of low cost contacts to silicon solar cells

NASA Technical Reports Server (NTRS)

Tanner, D. P.

1980-01-01

The results of the second phase of the program of developing low cost contacts to silicon solar cells using copper are presented. Phase 1 yielded the development of a plated Pd-Cr-Cu contact system. This process produced cells with shunting problems when they were heated to 400 C for 5 minutes. Means of stopping the identified copper diffusion which caused the shunting were investigated. A contact heat treatment study was conducted with Pd-Ag, Ci-Ag, Pd-Cu, Cu-Cr, and Ci-Ni-Cu. Nickel is shown to be an effective diffusion barrier to copper.

Fabrication of durable copper plating superhydrophobic surface with improved corrosion resistance and oil-water separation properties

NASA Astrophysics Data System (ADS)

Zhao, Yichao; Xiao, Xinyan; Ye, Zhihao; Ji, Qiang; Xie, Wei

2018-02-01

A mechanical durable superhydrophobic copper-plated stainless steel mesh was successfully fabricated by an electrodeposition process and 1-octadecanethiol modification. The as-prepared superhydrophobic mesh displays water contact angle of 153° and shows excellent anti-corrosion and water-oil separation properties in the condition of 0.1 A/cm2 current density for 35 s. In comparison with bare stainless steel mesh, the corrosion current of the as-prepared superhydrophobic mesh is close to 1/6 of the former. Meanwhile, the as-prepared superhydrophobic mesh could continuously separate oil from oil-water mixtures. The separation efficiency of continuous separation is as high as 96% and shows less than 1% decrease after ten cycles.

Degradation of graphene coated copper in simulated proton exchange membrane fuel cell environment: Electrochemical impedance spectroscopy study

NASA Astrophysics Data System (ADS)

Ren, Y. J.; Anisur, M. R.; Qiu, W.; He, J. J.; Al-Saadi, S.; Singh Raman, R. K.

2017-09-01

Metallic materials are most suitable for bipolar plates of proton exchange membrane fuel cell (PEMFC) because they possess the required mechanical strength, durability, gas impermeability, acceptable cost and are suitable for mass production. However, metallic bipolar plates are prone to corrosion or they can passivate under PEMFC environment and interrupt the fuel cell operation. Therefore, it is highly attractive to develop corrosion resistance coating that is also highly conductive. Graphene fits these criteria. Graphene coating is developed on copper by chemical vapor deposition (CVD) with an aim to improving corrosion resistance of copper under PEMFC condition. The Raman Spectroscopy shows the graphene coating to be multilayered. The electrochemical degradation of graphene coated copper is investigated by electrochemical impedance spectroscopy (EIS) in 0.5 M H2SO4 solution at room temperature. After exposure to the electrolyte for up to 720 h, the charge transfer resistance (Rt) of the graphene coated copper is ∼3 times greater than that of the bare copper, indicating graphene coatings could improve the corrosion resistance of copper bipolar plates.

Archeological Testing at Two Sites Near White Castle, Iberville Parish, Louisiana: 16 IV 147 and 16 IV 149

DTIC Science & Technology

1988-07-26

McIntire (1958: Plate 13) reported on work conducted at the Clara Murray Site (16 IV 12), also located just north of the town of Bayou Goula. Two...as early as 1750, but it only was applied as over-glaze decoration until post- 1760. This process started with a design engraved on copper plating ...Once the plate was covered with paint, tissue paper was placed over it, transferring the design to the paper, which in turn was transferred to the

Microstructure Evolution During Stainless Steel-Copper Vacuum Brazing with a Ag/Cu/Pd Filler Alloy: Effect of Nickel Plating

NASA Astrophysics Data System (ADS)

Choudhary, R. K.; Laik, A.; Mishra, P.

2017-03-01

Vacuum brazing of stainless steel and copper plates was done using a silver-based filler alloy. In one set of experiments, around 30-µm-thick nickel coatings were electrochemically applied on stainless steel plates before carrying out the brazing runs and its effect in making changes in the braze-zone microstructure was studied. For brazing temperature of 830 °C, scanning electron microscopy examination of the braze-zone revealed that relatively sound joints were obtained when brazing was done with nickel-coated stainless steel than with uncoated one. However, when brazing of nickel-coated stainless steel and copper plates was done at 860 °C, a wide crack appeared in the braze-zone adjacent to copper side. Energy-dispersive x-ray analysis and electron microprobe analysis confirmed that at higher temperature, the diffusion of Cu atoms from copper plate towards the braze-zone was faster than that of Ni atoms from nickel coating. Helium leak rate of the order 10-11 Pa m3/s was obtained for the crack-free joint, whereas this value was higher than 10-4 Pa m3/s for the joint having crack. The shear strength of the joint was found to decrease considerably due to the presence of crack.

Metal deposition by electroless plating on polydopamine functionalized micro- and nanoparticles.

PubMed

Mondin, Giovanni; Wisser, Florian M; Leifert, Annika; Mohamed-Noriega, Nasser; Grothe, Julia; Dörfler, Susanne; Kaskel, Stefan

2013-12-01

A novel approach for the fabrication of metal coated micro- and nanoparticles by functionalization with a thin polydopamine layer followed by electroless plating is reported. The particles are initially coated with polydopamine via self-polymerization. The resulting polydopamine coated particles have a surface rich in catechols and amino groups, resulting in a high affinity toward metal ions. Thus, they provide an effective platform for selective electroless metal deposition without further activation and sensitization steps. The combination of a polydopamine-based functionalization with electroless plating ensures a simple, scalable, and cost-effective metal coating strategy. Silver-plated tungsten carbide microparticles, copper-plated tungsten carbide microparticles, and copper-plated alumina nanoparticles were successfully fabricated, showing also the high versatility of the method, since the polymerization of dopamine leads to the formation of an adherent polydopamine layer on the surface of particles of any material and size. The metal coated particles produced with this process are particularly well suited for the production of metal matrix composites, since the metal coating increases the wettability of the particles by the metal, promoting their integration within the matrix. Such composite materials are used in a variety of applications including electrical contacts, components for the automotive industries, magnets, and electromagnetic interference shielding. Copyright © 2013 Elsevier Inc. All rights reserved.

A-15 Superconducting composite wires and a method for making

DOEpatents

Suenaga, Masaki; Klamut, Carl J.; Luhman, Thomas S.

1984-01-01

A method for fabricating superconducting wires wherein a billet of copper containing filaments of niobium or vanadium is rolled to form a strip which is wrapped about a tin-alloy core to form a composite. The alloy is a tin-copper alloy for niobium filaments and a gallium-copper alloy for vanadium filaments. The composite is then drawn down to a desired wire size and heat treated. During the heat treatment process, the tin in the bronze reacts with the niobium to form the superconductor niobium tin. In the case where vanadium is used, the gallium in the gallium bronze reacts with the vanadium to form the superconductor vanadium gallium. This new process eliminates the costly annealing steps, external tin plating and drilling of bronze ingots required in a number of prior art processes.

A base-metal conductor system for silicon solar cells

NASA Technical Reports Server (NTRS)

Coleman, M. G.; Pryor, R. A.; Sparks, T. G.

1980-01-01

Solder, copper, and silver are evaluated as conductor layer metals for silicon solar cell metallization on the basis of metal price stability and reliability under operating conditions. Due to its properties and cost, copper becomes an attractive candidate for the conductor layer. It is shown that nickel operates as an excellent diffusion barrier between copper and silicon while simultaneously serving as an electrical contact and mechanical contact to silicon. The nickel-copper system may be applied to the silicon by plating techniques utilizing a variety of plating bath compositions. Solar cells having excellent current-voltage characteristics are fabricated to demonstrate the nickel-copper metallization system.

Development of Surfaces Optically Suitable for Flat Solar Panels

NASA Technical Reports Server (NTRS)

Desmet, D.; Jason, A.

1978-01-01

Three areas of research in the development of flat solar panels are described. (1) A reflectometer which can separately evaluate the spectral and diffuse reflectivities of surfaces was developed. The reflectometer has a phase locked detection system. (2) A coating composed of strongly bound copper oxide that is formed by an etching process performed on an aluminum alloy with high copper content was also developed. Because of this one step fabrication process, fabrication costs are expected to be small. (3) A literature search was conducted and conclusions on the required optical properties of flat plate solar collectors are presented.

Sulfidation treatment of copper-containing plating sludge towards copper resource recovery.

PubMed

Kuchar, D; Fukuta, T; Onyango, M S; Matsuda, H

2006-11-02

The present study is concerned with the sulfidation treatment of copper-containing plating sludge towards copper resource recovery by flotation of copper sulfide from treated sludge. The sulfidation treatment was carried out by contacting simulated or real copper plating sludge with Na(2)S solution for a period of 5 min to 24 h. The initial molar ratio of S(2-) to Cu(2+) (S(2-) to Me(2+) in the case of real sludge) was adjusted to 1.00, 1.25 or 1.50, while the solid to liquid ratio was set at 1:50. As a result, it was found that copper compounds were converted to various copper sulfides within the first 5 min. In the case of simulated copper sludge, CuS was identified as the main sulfidation product at the molar ratio of S(2-) to Cu(2+) of 1.00, while Cu(7)S(4) (Roxbyite) was mainly found at the molar ratios of S(2-) to Cu(2+) of 1.50 and 1.25. Based on the measurements of oxidation-reduction potential, the formation of either CuS or Cu(7)S(4) at different S(2-) to Cu(2+) molar ratios was attributed to the changes in the oxidation-reduction potential. By contrast, in the case of sulfidation treatment of real copper sludge, CuS was predominantly formed, irrespective of S(2-) to Me(2+) molar ratio.

Integral window/photon beam position monitor and beam flux detectors for x-ray beams

DOEpatents

Shu, Deming; Kuzay, Tuncer M.

1995-01-01

A monitor/detector assembly in a synchrotron for either monitoring the position of a photon beam or detecting beam flux may additionally function as a vacuum barrier between the front end and downstream segment of the beamline in the synchrotron. A base flange of the monitor/detector assembly is formed of oxygen free copper with a central opening covered by a window foil that is fused thereon. The window foil is made of man-made materials, such as chemical vapor deposition diamond or cubic boron nitrate and in certain configurations includes a central opening through which the beams are transmitted. Sensors of low atomic number materials, such as aluminum or beryllium, are laid on the window foil. The configuration of the sensors on the window foil may be varied depending on the function to be performed. A contact plate of insulating material, such as aluminum oxide, is secured to the base flange and is thereby clamped against the sensor on the window foil. The sensor is coupled to external electronic signal processing devices via a gold or silver lead printed onto the contact plate and a copper post screw or alternatively via a copper screw and a copper spring that can be inserted through the contact plate and coupled to the sensors. In an alternate embodiment of the monitor/detector assembly, the sensors are sandwiched between the window foil of chemical vapor deposition diamond or cubic boron nitrate and a front foil made of similar material.

Design and Fabrication of Smart Diapers with Antibacterial Yarn

PubMed Central

Lin, Jia-Horng; Shiu, Bing-Chiuan; Lou, Ching-Wen

2017-01-01

In this study, intelligent eco-diapers are made by combining antibacterial yarns coated with quaternary ammonium salts with conductive yarns to improve caretaking for urinary incontinence. The combination of conductive yarns and sensors can detect the moisture content in eco-diapers, and an alarm is sent when moisture is significant. A wireless module is used to send detected signals to a smartphone or tablet PC via the Internet. This concept is used for a scenario in which nurses do not randomly check on patients in a long-term care institution. When used offline, eco-diapers can send caregivers an alarm for the need to change diapers via cell phones. The diameters of the copper and silver-plated copper fibers are 0.08 and 0.10 mm, respectively. Cotton yarns are twisted with copper and silver-plated copper fibers to form the conductive yarns, which are 0.12 mm in diameter. Moreover, 30-count cotton and 150 D nylon yarns are coated with quaternary ammonium salt via dyeing and finishing processes to form antibacterial yarns. In the current study, intelligent eco-diapers are tested for their electrical and antibacterial properties as specified by AATC and JISL test standards. PMID:29065646

Electrical Characterization of Spherical Copper Oxide Memristive Array Sensors

DTIC Science & Technology

2014-03-27

Quartz Tube Furnace . . . . . . . 37 3.3.2.2 Thermal Oxidation in Air on a Hot Plate . . . . . . . . . 38 3.4 Experimental Setup for Electrical...closed hot plate . . . 80 B.1 Oxidation rates for copper at 100 °C by two different formulas . . . . . . . . . 81 xi List of Tables Table Page 2.1 The... Tectonics Inc. and manufactured by Canfield Technologies using a proprietary fabrication method. As received, the copper spheres may have contaminants

Rapid determination of trace copper in animal feed based on micro-plate colorimetric reaction and statistical partitioning correction.

PubMed

Niu, Yiming; Wang, Jiayi; Zhang, Chi; Chen, Yiqiang

2017-04-15

The objective of this study was to develop a micro-plate based colorimetric assay for rapid and high-throughput detection of copper in animal feed. Copper ion in animal feed was extracted by trichloroacetic acid solution and reduced to cuprous ion by hydroxylamine. The cuprous ion can chelate with 2,2'-bicinchoninic acid to form a Cu-BCA complex which was detected with high sensitivity by micro-plate reader at 354nm. The whole assay procedure can be completed within 20min. To eliminate matrix interference, a statistical partitioning correction approach was proposed, which makes the detection of copper in complex samples possible. The limit of detection was 0.035μg/mL and the detection range was 0.1-10μg/mL of copper in buffer solution. Actual sample analysis indicated that this colorimetric assay produced results consistent with atomic absorption spectrometry analysis. These results demonstrated that the developed assay can be used for rapid determination of copper in animal feed. Copyright © 2016 Elsevier Ltd. All rights reserved.

Suppressing tin whisker growth in lead-free solders and platings

DOEpatents

Hoffman, Elizabeth N; Lam, Poh-Sang

2014-04-29

A process of irradiation Sn containing Pb-free solder to mitigate whisker formation and growth thereon is provided. The use of gamma radiation such as cobalt-60 has been applied to a substrate of Sn on copper has been found to change the morphology of the crystalline whisker growth to a more truncated hillock pattern. The change in morphology greatly reduces the tendency of whiskers to contribute to electrical short-circuits being used as a Pb-free solder system on a copper substrate.

CARBON BLACK DISPERSION PRE-PLATING TECHNOLOGY FOR PRINTED WIRE BOARD MANUFACTURING

EPA Science Inventory

This evaluation addresses the product quality, waste reduction, and economic issues involved in replacing electroless copper with a carbon black dispersion technology. McCurdy Circuits of Orange County, California, currently has both processes in operation. McCurdy has found that...

Copper Decoration of Carbon Nanotubes and High Resolution Electron Microscopy

NASA Astrophysics Data System (ADS)

Probst, Camille

A new process of decorating carbon nanotubes with copper was developed for the fabrication of nanocomposite aluminum-nanotubes. The process consists of three stages: oxidation, activation and electroless copper plating on the nanotubes. The oxidation step was required to create chemical function on the nanotubes, essential for the activation step. Then, catalytic nanoparticles of tin-palladium were deposited on the tubes. Finally, during the electroless copper plating, copper particles with a size between 20 and 60 nm were uniformly deposited on the nanotubes surface. The reproducibility of the process was shown by using another type of carbon nanotube. The fabrication of nanocomposites aluminum-nanotubes was tested by aluminum vacuum infiltration. Although the infiltration of carbon nanotubes did not produce the expected results, an interesting electron microscopy sample was discovered during the process development: the activated carbon nanotubes. Secondly, scanning transmitted electron microscopy (STEM) imaging in SEM was analysed. The images were obtained with a new detector on the field emission scanning electron microscope (Hitachi S-4700). Various parameters were analysed with the use of two different samples: the activated carbon nanotubes (previously obtained) and gold-palladium nanodeposits. Influences of working distance, accelerating voltage or sample used on the spatial resolution of images obtained with SMART (Scanning Microscope Assessment and Resolution Testing) were analysed. An optimum working distance for the best spatial resolution related to the sample analysed was found for the imaging in STEM mode. Finally, relation between probe size and spatial resolution of backscattered electrons (BSE) images was studied. An image synthesis method was developed to generate the BSE images from backscattered electrons coefficients obtained with CASINO software. Spatial resolution of images was determined using SMART. The analysis shown that using a probe size smaller than the size of the observed object (sample features) does not improve the spatial resolution. In addition, the effects of the accelerating voltage, the current intensity and the sample geometry and composition were analysed.

Reducing chromium losses from a chromium plating bath. 1987 summer intern report. Project conducted at New Dimension Plating, Hutchinson, Minnesota

DOE Office of Scientific and Technical Information (OSTI.GOV)

Achman, D.

1987-12-31

The company employs about forty people and operates for one or two eight hour shifts with an average of 315 racks of chrome plating per eight hour day. They plate a variety of metals including copper, nickel, gold, brass and chromium. Chromium is the major metal plated and is usually the last step in plating cycle. Most parts are copper plated and then nickel plated in preparation for chrome plating. The main difference between New Dimension Plating and other plating shops is the variety of parts plated. As New Dimension Plating is a job shop, a wide range of partsmore » such as motorcycle accessories, stove parts, and custom items are metal finished. The plating lines are manual, meaning employees dip the racks into the tanks by hand. This fact along with the fact that parts vary greatly in size and shape accounts for the significant drag-out on the chromium plating line.« less

Memristive Responses of Jammed Granular Copper Array Sensors to Mechanical Stress

DTIC Science & Technology

2014-03-27

called Industrial Tectonics Inc. (itiball.com) with the statement of 99.95% minimum copper; stating the residual is most likely silver [12]. Their...atmosphere hot plate and quartz tube furnace with controlled atmosphere were used to oxidize the spheres at various temperatures, the hot plate ...combination spheres, as was seen by Branly. Using a nitric acid etch and 15 minute (min.) hot plate oxidized sphere array consisting of four spheres

Ion Beam Processing.

DTIC Science & Technology

1987-03-13

guides Taps for plastics Orthopedic implants (hip and knee joints, etc.) Extrusion spinnerettes Finishing rolls for copper rod Extrusion nozzles...detail in following sections. C. Comparison to Coating Techniques -,* Because ion implantation is a process that modifies surface properties it is often...Therefore, it is important to understand the differences between ion implantation and coating techniques, especially ion plating. The result of ion

Capable Copper Electrodeposition Process for Integrated Circuit - substrate Packaging Manufacturing

NASA Astrophysics Data System (ADS)

Ghanbari, Nasrin

This work demonstrates a capable reverse pulse deposition methodology to influence gap fill behavior inside microvia along with a uniform deposit in the fine line patterned regions for substrate packaging applications. Interconnect circuitry in IC substrate packages comprises of stacked microvia that varies in depth from 20microm to 100microm with an aspect ratio of 0.5 to 1.5 and fine line patterns defined by photolithography. Photolithography defined pattern regions incorporate a wide variety of feature sizes including large circular pad structures with diameter of 20microm - 200microm, fine traces with varying widths of 3microm - 30microm and additional planar regions to define a IC substrate package. Electrodeposition of copper is performed to establish the desired circuit. Electrodeposition of copper in IC substrate applications holds certain unique challenges in that they require a low cost manufacturing process that enables a void-free gap fill inside the microvia along with uniform deposition of copper on exposed patterned regions. Deposition time scales to establish the desired metal thickness for such packages could range from several minutes to few hours. This work showcases a reverse pulse electrodeposition methodology that achieves void-free gap fill inside the microvia and uniform plating in FLS (Fine Lines and Spaces) regions with significantly higher deposition rates than traditional approaches. In order to achieve this capability, systematic experimental and simulation studies were performed. A strong correlation of independent parameters that govern the electrodeposition process such as bath temperature, reverse pulse plating parameters and the ratio of electrolyte concentrations is shown to the deposition kinetics and deposition uniformity in fine patterned regions and gap fill rate inside the microvia. Additionally, insight into the physics of via fill process is presented with secondary and tertiary current simulation efforts. Such efforts lead to show "smart" control of deposition rate at the top and bottom of via to avoid void formation. Finally, a parametric effect on grain size and the ensuing copper metallurgical characteristics of bulk copper is also shown to enable high reliability substrate packages for the IC packaging industry.

All-metal, compact heat exchanger for space cryocoolers

NASA Technical Reports Server (NTRS)

Swift, Walter L.; Valenzuela, Javier; Sixsmith, Herbert

1990-01-01

This report describes the development of a high performance, all metal compact heat exchanger. The device is designed for use in a reverse Brayton cryogenic cooler which provides five watts of refrigeration at 70 K. The heat exchanger consists of a stainless steel tube concentrically assembled within a second stainless steel tube. Approximately 300 pairs of slotted copper disks and matching annular slotted copper plates are positioned along the centerline axis of the concentric tubes. Each of the disks and plates has approximately 1200 precise slots machined by means of a special electric discharge process. Positioning of the disk and plate pairs is accomplished by means of dimples in the surface of the tubes. Mechanical and thermal connections between the tubes and plate/disk pairs are made by solder joints. The heat exchanger assembly is 9 cm in diameter by 50 cm in length and has a mass of 10 kg. The predicted thermal effectiveness is greater than 0.985 at design conditions. Pressure loss at design conditions is less than 5 kPa in both fluid passages. Tests were performed on a subassembly of plates integrally soldered to two end headers. The measured thermal effectiveness of the test article exceeded predicted levels. Pressure losses were negligibly higher than predictions.

Friction Stir Welding of GR-Cop 84 for Combustion Chamber Liners

NASA Technical Reports Server (NTRS)

Russell, Carolyn K.; Carter, Robert; Ellis, David L.; Goudy, Richard

2004-01-01

GRCop-84 is a copper-chromium-niobium alloy developed by the Glenn Research Center for liquid rocket engine combustion chamber liners. GRCop-84 exhibits superior properties over conventional copper-base alloys in a liquid hydrogen-oxygen operating environment. The Next Generation Launch Technology program has funded a program to demonstrate scale-up production capabilities of GR-Cop 84 to levels suitable for main combustion chamber production for the prototype rocket engine. This paper describes a novel method of manufacturing the main combustion chamber liner. The process consists of several steps: extrude the GR-Cop 84 powder into billets, roll the billets into plates, bump form the plates into cylinder halves and friction stir weld the halves into a cylinder. The cylinder is then metal spun formed to near net liner dimensions followed by finish machining to the final configuration. This paper describes the friction stir weld process development including tooling and non-destructive inspection techniques, culminating in the successful production of a liner preform completed through spin forming.

Copper extraction from ammoniacal medium in a pulsed sieve-plate column with LIX 84-I.

PubMed

Gameiro, M Lurdes F; Machado, Remígio M; Ismael, M Rosinda C; Reis, M Teresa A; Carvalho, Jorge M R

2010-11-15

This article reports on a study of copper removal from ammoniacal aqueous solution (1.0 kg m(-3) Cu, pH 9.5) by liquid-liquid extraction using a pulsed sieve-plate column. The extractant tested was the hydroxyoxime LIX 84-I (2-hydroxy-5-nonylacetophenone oxime) in the aliphatic diluent Shellsol D-70. The results of the pilot plant experiments demonstrated the feasibility of operating the extraction process in this type of column, with efficiencies of copper removal in the range of 90.5-99.5%. Several effects on the column performance were examined, namely the aqueous and organic flow rates and the pulse velocity. The axial dispersion model was applied to simulate the concentration profiles, which reasonably predicted the experimental data. The overall mass transfer coefficient was evaluated from the experimental data and was found to be between 9×10(-6) and 1.2×10(-5) m s(-1). These data were compared with the ones obtained from the resistances in series model, which indicated that the resistance due to chemical reaction was 84-91% of the overall resistance to mass transfer. The extraction using a hollow fiber contactor was also carried out to compare the membrane process performance with the one of conventional process. Copyright © 2010 Elsevier B.V. All rights reserved.

Radon daughter plate-out measurements at SNOLAB for polyethylene and copper

NASA Astrophysics Data System (ADS)

Stein, Matthew; Bauer, Dan; Bunker, Ray; Calkins, Rob; Cooley, Jodi; Loer, Ben; Scorza, Silvia

2018-02-01

Polyethylene and copper samples were exposed to the underground air at SNOLAB for approximately three months while several environmental factors were monitored. Predictions of the radon-daughter plate-out rate are compared to the resulting surface activities, obtained from high-sensitivity measurements of alpha emissivity using the XIA UltraLo-1800 spectrometer at Southern Methodist University. From these measurements, we determine an average 210Pb plate-out rate of 249 and 423 atoms/day/cm2 for polyethylene and copper, respectively, when exposed to radon activity concentration of 135 Bq/m3 at SNOLAB. A time-dependent model of alpha activity is discussed for these materials placed in similar environmental conditions.

Radon daughter plate-out measurements at SNOLAB for polyethylene and copper

DOE Office of Scientific and Technical Information (OSTI.GOV)

Stein, Matthew; Bauer, Dan; Bunker, Ray

2018-02-01

Polyethylene and copper samples were exposed to the underground air at SNOLAB for approximately three months while several environmental factors were monitored. Predictions of the radon-daughter plate-out rate are compared to the resulting surface activities, obtained from high-sensitivity measurements of alpha emissivity using the XIA UltraLo-1800 spectrometer at SMU. From these measurements, we determine an averagemore » $$^{210}$$Pb plate-out rate of 249 and 423~atoms/day/cm$$^{2}$$ for polyethylene and copper, respectively, when exposed to radon activity of 135 Bq/m$$^{3}$$ at SNOLAB. A time-dependent model of alpha activity is discussed for these materials placed in similar environmental conditions.« less

Closed loop oscillating heat pipe as heating device for copper plate

NASA Astrophysics Data System (ADS)

Kamonpet, Patrapon; Sangpen, Waranphop

2017-04-01

In manufacturing parts by molding method, temperature uniformity of the mold holds a very crucial aspect for the quality of the parts. Studies have been carried out in searching for effective method in controlling the mold temperature. Using of heat pipe is one of the many effective ways to control the temperature of the molding area to the right uniform level. Recently, there has been the development of oscillating heat pipe and its application is very promising. The semi-empirical correlation for closed-loop oscillating heat pipe (CLOHP) with the STD of ±30% was used in design of CLOHP in this study. By placing CLOHP in the copper plate at some distance from the plate surface and allow CLOHP to heat the plate up to the set surface temperature, the temperature of the plate was recorded. It is found that CLOHP can be effectively used as a heat source to transfer heat to copper plate with excellent temperature distribution. The STDs of heat rate of all experiments are well in the range of ±30% of the correlation used.

Process for forming a nickel foil with controlled and predetermined permeability to hydrogen

DOEpatents

Engelhaupt, Darell E.

1981-09-22

The present invention provides a novel process for forming a nickel foil having a controlled and predetermined hydrogen permeability. This process includes the steps of passing a nickel plating bath through a suitable cation exchange resin to provide a purified nickel plating bath free of copper and gold cations, immersing a nickel anode and a suitable cathode in the purified nickel plating bath containing a selected concentration of an organic sulfonic acid such as a napthalene-trisulfonic acid, electrodepositing a nickel layer having the thickness of a foil onto the cathode, and separating the nickel layer from the cathode to provide a nickel foil. The anode is a readily-corrodible nickel anode. The present invention also provides a novel nickel foil having a greater hydrogen permeability than palladium at room temperature.

Qualifications of Bonding Process of Temperature Sensors to Deep-Space Missions

NASA Technical Reports Server (NTRS)

Ramesham, Rajeshuni; Kitiyakara, Amarit; Redick, Richard W., III; Sunada, Eric T.

2011-01-01

A process has been examined for bonding a platinum resistance thermometer (PRT) onto potential aerospace materials such as flat aluminum surfaces and a flexible copper tube to simulate coaxial cables for flight applications. Primarily, PRTs were inserted into a silver-plated copper braid to avoid stresses on the sensor while the sensor was attached with the braid to the base material for long-duration, deep-space missions. A1-1145/graphite composite (planar substrate) and copper tube have been used in this study to assess the reliability of PRT bonding materials. A flexible copper tube was chosen to simulate the coaxial cable to attach PRTs. The substrate materials were cleaned with acetone wipes to remove oils and contaminants. Later, the surface was also cleaned with ethyl alcohol and was air-dried. The materials were gently abraded and then were cleaned again the same way as previously mentioned. Initially, shielded (silver plated copper braid) PRT (type X) test articles were fabricated and cleaned. The base antenna material was pretreated and shielded, and CV-2566 NuSil silicone was used to attach the shielded PRT to the base material. The test articles were cured at room temperature and humidity for seven days. The resistance of the PRTs was continuously monitored during the thermal cycling, and the test articles were inspected prior to, at various intermediate steps during, and at the end of the thermal cycling as well. All of the PRTs survived three times the expected mission life for the JUNO project. No adhesion problems were observed in the PRT sensor area, or under the shielded PRT. Furthermore, the PRT resistance accurately tracked the thermal cycling of the chamber.

High-strength braze joints between copper and steel

NASA Technical Reports Server (NTRS)

Kuhn, R. F.

1967-01-01

High-strength braze joints between copper and steel are produced by plating the faying surface of the copper with a layer of gold. This reduces porosity in the braze area and strengthens the resultant joint.

Radon daughter plate-out measurements at SNOLAB for polyethylene and copper

DOE Office of Scientific and Technical Information (OSTI.GOV)

Stein, Matthew; Bauer, Dan; Bunker, Ray

We report that polyethylene and copper samples were exposed to the underground air at SNOLAB for approximately three months while several environmental factors were monitored. Predictions of the radon-daughter plate-out rate are compared to the resulting surface activities, obtained from high-sensitivity measurements of alpha emissivity using the XIA UltraLo-1800 spectrometer at Southern Methodist University. From these measurements, we determine an average 210Pb plate-out rate of 249 and 423 atoms/day/cm 2 for polyethylene and copper, respectively, when exposed to radon activity concentration of 135 Bq/m 3 at SNOLAB. Finally, a time-dependent model of alpha activity is discussed for these materials placedmore » in similar environmental conditions.« less

Radon daughter plate-out measurements at SNOLAB for polyethylene and copper

DOE PAGES

Stein, Matthew; Bauer, Dan; Bunker, Ray; ...

2017-11-04

We report that polyethylene and copper samples were exposed to the underground air at SNOLAB for approximately three months while several environmental factors were monitored. Predictions of the radon-daughter plate-out rate are compared to the resulting surface activities, obtained from high-sensitivity measurements of alpha emissivity using the XIA UltraLo-1800 spectrometer at Southern Methodist University. From these measurements, we determine an average 210Pb plate-out rate of 249 and 423 atoms/day/cm 2 for polyethylene and copper, respectively, when exposed to radon activity concentration of 135 Bq/m 3 at SNOLAB. Finally, a time-dependent model of alpha activity is discussed for these materials placedmore » in similar environmental conditions.« less

An experimental attenuation plate to improve the dose distribution in intraoperative electron beam radiotherapy for breast cancer.

PubMed

Oshima, T; Aoyama, Y; Shimozato, T; Sawaki, M; Imai, T; Ito, Y; Obata, Y; Tabushi, K

2009-06-07

Intraoperative electron beam radiotherapy (IOERT) is a technique in which a single-fraction high dose is intraoperatively delivered to subclinical tumour cells using an electron beam after breast-conserving surgery. In IOERT, an attenuation plate consisting of a pair of metal disks is commonly used to protect the normal tissues posterior to the breast. However, the dose in front of the plate is affected by backscatter, resulting in an unpredictable delivered dose to the tumour cells. In this study, an experimental attenuation plate, termed a shielding plate, was designed using Monte Carlo simulation, which significantly diminished the electron beam without introducing any backscatter radiation. The plate's performance was verified by measurements. It was made of two layers, a first layer (source side) of polymethyl methacrylate (PMMA) and a second layer of copper, which was selected from among other metals (aluminium, copper and lead) after testing for shielding capability and the range and magnitude of backscatter. The optimal thicknesses of the PMMA (0.71 cm) and copper (0.3 cm) layers were determined by changing their thicknesses during simulations. On the basis of these results, a shielding plate was prototyped and depth doses with and without the plate were measured by radiophotoluminescence glass dosimeters using a conventional stationary linear accelerator and a mobile linear accelerator dedicated for IOERT. The trial shielding plate functioned as intended, indicating its applicability in clinical practice.

Copper-mercury film electrode for cathodic stripping voltammetric determination of Se(IV).

PubMed

Sladkov, Vladimir; David, François; Fourest, Blandine

2003-01-01

The copper-mercury film electrode has been suggested for the determination of Se(IV) in a wide range of concentration from 1x10(-9) to 1x10(-6) mol L(-1)by square-wave cathodic stripping voltammetry. Insufficient reproducibility and sensitivity of the mercury film electrode have been overcome by using copper(II) ions during the plating procedure. Copper(II) has been found to be reduced and form a reproducible copper-mercury film on a glassy carbon electrode surface. The plating potential and time, the concentration of copper(II) and the concentration of the supporting electrolyte have been optimised. Microscopy has been used for a study of the morphology of the copper-mercury film. It has been found that it is the same as for the mercury one. The preconcentration step consists in electrodeposition of copper selenide on the copper-mercury film. The relative standard deviation is 4.3% for 1x10(-6) mol L(-1) of Se(IV). The limit of detection is 8x10(-10) mol L(-1) for 5 min of accumulation.

Modeling of laser welding of steel and titanium plates with a composite insert

NASA Astrophysics Data System (ADS)

Isaev, V. I.; Cherepanov, A. N.; Shapeev, V. P.

2017-10-01

A 3D model of laser welding proposed before by the authors was extended to the case of welding of metallic plates made of dissimilar materials with a composite multilayer intermediate insert. The model simulates heat transfer in the welded plates and takes into account phase transitions. It was proposed to select the composition of several metals and dimensions of the insert to avoid the formation of brittle intermetallic phases in the weld joint negatively affecting its strength properties. The model accounts for key physical phenomena occurring during the complex process of laser welding. It is capable to calculate temperature regimes at each point of the plates. The model can be used to select the welding parameters reducing the risk of formation of intermetallic plates. It can forecast the dimensions and crystalline structure of the solidified melt. Based on the proposed model a numerical algorithm was constructed. Simulations were carried out for the welding of titanium and steel plates with a composite insert comprising four different metals: copper and niobium (intermediate plates) with steel and titanium (outer plates). The insert is produced by explosion welding. Temperature fields and the processes of melting, evaporation, and solidification were studied.

Quenching characteristics of bathocuproinedisulfonic acid, disodium salt in aqueous solution and copper sulfate plating solution

NASA Astrophysics Data System (ADS)

Koga, Toshiaki; Hirakawa, Chieko; Takeshita, Michinori; Terasaki, Nao

2018-04-01

Bathocuproinedisulfonic acid, disodium salt (BCS) is generally used to detect Cu(I) through a color reaction. We newly found BCS fluorescence in the visible blue region in an aqueous solution. However, the fluorescence mechanism of BCS is not well known, so we should investigate its fundamental information. We confirmed that the characteristics of fluorescence are highly dependent on the molecular concentration and solvent properties. In particular, owing to the presence of the copper compound, the fluorescence intensity extremely decreases. By fluorescence quenching, we observed that a copper compound concentration of 10-6 mol/L or less could easily be measured in an aqueous solution. We also observed BCS fluorescence in copper sulfate plating solution and the possibility of detecting monovalent copper by fluorescence reabsorption.

Effect of Current Density and Plating Time on Cu Electroplating in TSV and Low Alpha Solder Bumping

NASA Astrophysics Data System (ADS)

Jung, Do-Hyun; Sharma, Ashutosh; Kim, Keong-Heum; Choo, Yong-Chul; Jung, Jae-Pil

2015-03-01

In this study, copper filling in through-silicon via (TSV) by pulse periodic reverse electroplating and low alpha solder bumping on Cu-filled TSVs was investigated. The via diameter and depth of TSV were 60 and 120 µm, respectively. The experimental results indicated that the thickness of electrodeposited copper layer increased with increasing cathodic current density and plating time. The electroplated Cu in TSV showed a typical bottom-up filling. A defectless, complete, and fast 100% Cu-filled TSV was achieved at cathodic and anodic current densities of -8 and 16 mA/cm2 for a plating time of 4 h, respectively. A sound low alpha solder ball, Sn-1.0 wt.% Ag-0.5 wt.% Cu (SAC 105) with a diameter of 83 µm and height of 66 µm was reflow processed at 245 °C on Cu-filled TSV. The Cu/solder joint interface was subjected to high temperature aging at 85 °C for 150 h, which showed an excellent bonding characteristic with minimum Cu-Sn intermetallic compounds growth.

Steel test panel helps control additives in pyrophosphate copper plating

NASA Technical Reports Server (NTRS)

Hollar, W. T.

1967-01-01

Test panel helps control maximum tolerance level for plating solution contaminants. It provides low, medium, and high-current density areas such as exist in production plating, and plating is examined for uniformity of texture and ductility.

Comparison of Spall Pullback Signals and X-ray Tomography Analysis in Copper

NASA Astrophysics Data System (ADS)

Gard, Marcie; Russell, Rod; Hanna, Romy; Bless, Stephan; InstituteAdvanced Technology Collaboration; Department of Geological Sciences-UT Austin Collaboration

2011-06-01

Spall experiments were conducted on electrolytic tough pitch C110 copper plates. Flyer plates half the target-plate thickness were launched with a single-stage compressed-gas gun. Pullback signals were measured with a photonic Doppler velocimeter (PDV). Spall stresses were determined and found to be about 1 GPa. In addition, damage on the spall plane for samples that failed to separate a spall plate was characterized by x-ray tomography. The paper will include a description of threshold damage. The threshold for appearance of a pullback signal corresponded to the initiation of tensile damage, not formation of a spall separation plane.

A Kinetic Study of the Reaction of Ch3 02 with N02. Volume I,

DTIC Science & Technology

1980-01-01

Ravishankara F.L. Eisele IP.H. Wine ABSTRACT The technique of pulsed laser photolysis-long path laser aborption is employed to study the kinetics of the...Inrad Corp.) which was housed in a gold plated copper block. This copper block was in snug contact with a gold plated pedestal which was backed by a

Electrochemical Migration Behavior of Copper-Clad Laminate and Electroless Nickel/Immersion Gold Printed Circuit Boards under Thin Electrolyte Layers

PubMed Central

Yi, Pan; Xiao, Kui; Ding, Kangkang; Dong, Chaofang; Li, Xiaogang

2017-01-01

The electrochemical migration (ECM) behavior of copper-clad laminate (PCB-Cu) and electroless nickel/immersion gold printed circuit boards (PCB-ENIG) under thin electrolyte layers of different thicknesses containing 0.1 M Na2SO4 was studied. Results showed that, under the bias voltage of 12 V, the reverse migration of ions occurred. For PCB-Cu, both copper dendrites and sulfate precipitates were found on the surface of FR-4 (board material) between two plates. Moreover, the Cu dendrite was produced between the two plates and migrated toward cathode. Compared to PCB-Cu, PCB-ENIG exhibited a higher tendency of ECM failure and suffered from seriously short circuit failure under high relative humidity (RH) environment. SKP results demonstrated that surface potentials of the anode plates were greater than those of the cathode plates, and those potentials of the two plates exhibited a descending trend as the RH increased. At the end of the paper, an electrochemical migration corrosion failure model of PCB was proposed. PMID:28772497

Higher-resolution selective metallization on alumina substrate by laser direct writing and electroless plating

NASA Astrophysics Data System (ADS)

Lv, Ming; Liu, Jianguo; Wang, Suhuan; Ai, Jun; Zeng, Xiaoyan

2016-03-01

How to fabricate conductive patterns on ceramic boards with higher resolution is a challenge in the past years. The fabrication of copper patterns on alumina substrate by laser direct writing and electroless copper plating is a low cost and high efficiency method. Nevertheless, the lower resolution limits its further industrial applications in many fields. In this report, the mechanisms of laser direct writing and electroless copper plating were studied. The results indicated that as the decomposed products of precursor PdCl2 have different chemical states respectively in laser-irradiated zone (LIZ) and laser-affected zone (LAZ). This phenomenon was utilized and a special chemical cleaning method with aqua regia solution was taken to selectively remove the metallic Pd in LAZ, while kept the PdO in LIZ as the only active seeds. As a result, the resolution of subsequent copper patterns was improved significantly. This technique has a great significance to develop the microelectronics devices.

Rolling contact fatigue behavior of Cu and TiN coatings on bearing steel substrates

NASA Technical Reports Server (NTRS)

Hochman, R. F.; Erdemir, A.; Dolan, F. J.; Thom, R. L.

1985-01-01

The resistance of copper and TiN coatings on various bearing substrates to high-load rolling contact fatigue (RCF) is investigated. Special attention is given to the lubricating characteristics of copper deposited by ion plating, and the wear resistant characteristics of TiN deposited by ion plating and magnetron sputtering techniques. RCF samples of 440C and AMS 5749 bearing steels were coated. Sputter deposited and ion plated films were on the RCF samples in a range of thickness from about 2000 A to 2 microns. Results showed a marked improvement of the RCF for pure copper tested on 440C, but a degradation for copper on AMS 5749. It is also found that the 2000 A TiN films behave favorably on the 440C and AMS 5749 bearing steels at RCF stress levels of 786 ksi. Scanning electron microscopy, X-ray diffraction, and electron spectroscopy for chemical analysis were used during the investigation.

46 CFR 114.600 - Incorporation by reference.

Code of Federal Regulations, 2012 CFR

2012-10-01

... Storage Tank Water Heaters 119.320 UL 486A-1992—Wire Connectors and Soldering Lugs For Use With Copper...-93, Standard Specification for Copper-Silicon Alloy Plate, Sheet, Strip, and Rolled Bar for General...) Apparatus 114.400 ASTM B 122/B 122M-95, Standard Specification for Copper-Nickel-Tin Alloy , Copper-Nickel...

Improving wettability of photo-resistive film surface with plasma surface modification for coplanar copper pillar plating of IC substrates

NASA Astrophysics Data System (ADS)

Xiang, Jing; Wang, Chong; Chen, Yuanming; Wang, Shouxu; Hong, Yan; Zhang, Huaiwu; Gong, Lijun; He, Wei

2017-07-01

The wettability of the photo-resistive film (PF) surfaces undergoing different pretreatments including the O2sbnd CF4 low-pressure plasma (OCLP) and air plasma (AP), is investigated by water contact angle measurement instrument (WCAMI) before the bottom-up copper pillar plating. Chemical groups analysis performed by attenuated total reflectance Fourier transform infrared spectroscopy (ATR-FTIR) and X-ray photoelectron spectra (XPS) shows that after the OCLP and wash treatment, the wettability of PF surface is attenuated, because embedded fluorine and decreased oxygen content both enhance hydrophobicity. Compared with OCLP treatment, the PF surface treatment by non-toxic air plasma displays features of Csbnd O, Osbnd Cdbnd O, Cdbnd O and sbnd NO2 by AIR-FTIR and XPS, and a promoted wettability by WCAM. Under the identical electroplating condition, the surface with a better wettability allows electrolyte to spontaneously soak all the places of vias, resulting in improved copper pillar uniformity. Statistical analysis of metallographic data shows that more coplanar and flat copper pillars are achieved with the PF treatment of air plasma. Such modified copper-pillar-plating technology meets the requirement of accurate impedance, the high density interconnection for IC substrates.

3 kW single stage all-fiber Yb-doped single-mode fiber laser for highly reflective and highly thermal conductive materials processing

NASA Astrophysics Data System (ADS)

Ikoma, S.; Nguyen, H. K.; Kashiwagi, M.; Uchiyama, K.; Shima, K.; Tanaka, D.

2017-02-01

A 3 kW single stage all-fiber Yb-doped single-mode fiber laser with bi-directional pumping configuration has been demonstrated. Our newly developed high-power LD modules are employed for a high available pump power of 4.9 kW. The length of the delivery fiber is 20 m which is long enough to be used in most of laser processing machines. An output power of 3 kW was achieved at a pump power of 4.23 kW. The slope efficiency was 70%. SRS was able to be suppressed at the same output power by increasing ratio of backward pump power. The SRS level was improved by 5dB when 57% backward pump ratio was adopted compared with the case of 50%. SRS was 35dB below the laser power at the output power of 3 kW even with a 20-m delivery fiber. The M-squared factor was 1.3. Single-mode beam quality was obtained. To evaluate practical utility of the 3 kW single-mode fiber laser, a Bead-on-Plate (BoP) test onto a pure copper plate was executed. The BoP test onto a copper plate was made without stopping or damaging the laser system. That indicates our high power single-mode fiber lasers can be used practically in processing of materials with high reflectivity and high thermal conductivity.

Tectonic environments of South American porphyry copper magmatism through time revealed by spatiotemporal data mining

NASA Astrophysics Data System (ADS)

Butterworth, N.; Steinberg, D.; Müller, R. D.; Williams, S.; Merdith, A. S.; Hardy, S.

2016-12-01

Porphyry ore deposits are known to be associated with arc magmatism on the overriding plate at subduction zones. While general mechanisms for driving magmatism are well established, specific subduction-related parameters linking episodes of ore deposit formation to specific tectonic environments have only been qualitatively inferred and have not been formally tested. We develop a four-dimensional approach to reconstruct age-dated ore deposits, with the aim of isolating the tectonomagmatic parameters leading to the formation of copper deposits during subduction. We use a plate tectonic model with continuously closing plate boundaries, combined with reconstructions of the spatiotemporal distribution of the ocean floor, including subducted portions of the Nazca/Farallon plates. The models compute convergence rates and directions, as well as the age of the downgoing plate through time. To identify and quantify tectonic parameters that are robust predictors of Andean porphyry copper magmatism and ore deposit formation, we test two alternative supervised machine learning methods; the "random forest" (RF) ensemble and "support vector machines" (SVM). We find that a combination of rapid convergence rates ( 100 km/Myr), subduction obliquity of 15°, a subducting plate age between 25-70 Myr old, and a location far from the subducting trench boundary (>2000 km) represents favorable conditions for porphyry magmatism and related ore deposits to occur. These parameters are linked to the availability of oceanic sediments, the changing small-scale convection around the subduction zone, and the availability of the partial melt in the mantle wedge. When coupled, these parameters could influence the genesis and exhumation of porphyry copper deposits.

46 CFR 105.20-3 - Cargo tanks.

Code of Federal Regulations, 2010 CFR

2010-10-01

...) Construction and Materials. (1) The cargo tanks must be constructed of iron, steel, copper, nickel alloy, copper alloy; or aluminum. The tanks shall be designed to withstand the maximum head to which they may be... inches and gage number 2,3 Nickel copper B127, hot rolled sheet or plate 0.107 (USSG 12). Copper nickel 1...

Colloidal and electrochemical aspects of copper-CMP

NASA Astrophysics Data System (ADS)

Sun, Yuxia

Copper based interconnects with low dielectric constant layers are currently used to increase interconnect densities and reduce interconnect time delays in integrated circuits. The technology used to develop copper interconnects involves Chemical Mechanical Planarization (CMP) of copper films deposited on low-k layers (silica or silica based films), which is carried out using slurries containing abrasive particles. One issue using such a structure is copper contamination over dielectric layers (SiO2 film), if not reduced, this contamination will cause current leakage. In this study, the conditions conducive to copper contamination onto SiO2 films during Cu-CMP process were studied, and a post-CMP cleaning technique was discussed based on experimental results. It was found that the adsorption of copper onto a silica surface is kinetically fast (<0.5 minute). The amount of copper absorbed is pH and concentration dependent and affected by presence of H2O2, complexing agents, and copper corrosion inhibitor Benzotrazole. Based on de-sorption results, DI water alone was unable to reduce adsorbed copper to an acceptable level, especially for adsorption that takes place at a higher pH condition. The addition of complex agent, citric acid, proved effective in suppressing copper adsorption onto oxide silica during polishing or post-CMP cleaning by forming stable copper-CA complexes. Surface Complexation Modeling was used to simulate copper adsorption isotherms and predict the copper contamination levels on SiO2 surfaces. Another issue with the application of copper CMP is its environmental impact. CMP is a costly process due to its huge consumption of pure water and slurry. Additionally, Cu-CMP processing generates a waste stream containing certain amounts of copper and abrasive slurry particles. In this study, the separation technique electrocoagulation was investigated to remove both copper and abrasive slurry particles simultaneously. For effluent containing ˜40 ppm dissolved copper, it was found that ˜90% dissolved copper was removed from the waste streams through electroplating and in-situ chemical precipitation. The amount of copper removed through plating is impacted by membrane surface charge, type/amount of complexing agents, and solid content in the slurry suspension. The slurry particles can be removed ˜90% within 2 hours of EC through multiple mechanisms.

Crystal growth patterns in DC and pulsed plated galvanic copper films on (1 1 1), (1 0 0) and (1 1 0) copper surfaces

NASA Astrophysics Data System (ADS)

Brown, Delilah A.; Morgan, Sean; Peldzinski, Vera; Brüning, Ralf

2017-11-01

Copper films for printed circuit board applications have to be fine-grained to achieve even filling of vias. Electroplated Cu films on roll annealed Cu substrates may have unacceptably large epitaxial crystals. Here galvanic films were plated on oriented single-crystal Cu substrates from an additive-free electrolyte, as well as DC plating and pulse reverse (PR) plating with additives. The distribution of crystallite orientations was mapped with XRD and compared with the microstructure determined by SEM. For the additive-free bath on [1 1 1] and [1 0 0] oriented surfaces a gradual transition from epitaxial to polycrystalline is seen, while films on [1 1 0] substrates are persistently epitaxial. Without bath additives, twinning is the main mechanism for the transition to polycrystalline texture. For DC plating, additives (carriers, accelerators and levelers) promote fine-grained films with isotropic grain orientations, with films on [1 1 0] substrates being partially isotropic. Plating with carriers and accelerators (no leveler) yields films with many distinct crystallite orientations. These orientations result from up to five steps of recursive twinning. PR plating produces isotropic films with no or very few twins (〈1 1 1〉 and 〈1 0 0〉 substrates, respectively), while on 〈1 1 0〉 oriented surfaces the deposits are about 20% epitaxial.

Dynamic Shock Compression of Copper to Multi-Megabar Pressure

NASA Astrophysics Data System (ADS)

Haill, T. A.; Furnish, M. D.; Twyeffort, L. L.; Arrington, C. L.; Lemke, R. W.; Knudson, M. D.; Davis, J.-P.

2015-11-01

Copper is an important material for a variety of shock and high energy density applications and experiments. Copper is used as a standard reference material to determine the EOS properties of other materials. The high conductivity of copper makes it useful as an MHD driver layer in high current dynamic materials experiments on Sandia National Laboratories Z machine. Composite aluminum/copper flyer plates increase the dwell time in plate impact experiments by taking advantage of the slower wave speeds in copper. This presentation reports on recent efforts to reinstate a composite Al/Cu flyer capability on Z and to extend the range of equation-of-state shock compression data through the use of hyper-velocity composite flyers and symmetric planar impact with copper targets. We will present results from multi-dimensional ALEGRA MHD simulations, as well as experimental designs and methods of composite flyer fabrication. Sandia National Laboratories is a multi-program laboratory managed and operated by Sandia Corporation, a wholly owned subsidiary of Lockheed Martin Company, for the U.S. DOE's National Nuclear Security Administration under contract DE-AC04-94AL85000.

Thermal performance evaluation of the Semco (liquid) solar collector

NASA Technical Reports Server (NTRS)

1979-01-01

Procedures used and results obtained during the evaluation test program on a flat plate collector which uses water as the working fluid are discussed. The absorber plate is copper tube soldered to copper fin coated with flat black paint. The glazing consists of two plates of Lo-Iron glass; the insulation is polyurethane foam. The collector weight is 242.5 pounds with overall external dimensions of approximately 48.8 in. x 120.8 in. x 4.1 in. The test program was conducted to obtain thermal performance data before and after 34 days of weather exposure test.

AN ENVIRONMENTAL AND ECONOMIC COMPARISON OF ION EXCHANGE AND RECENTLY COMMERCIALIZED ELECTROCHEMICAL TECHNOLOGIES FOR THE RECOVERY OF RINSE WATER IN BRIGHT NICKEL PLATING FACILITY

EPA Science Inventory

Researchers at USEPA are testing and evaluating two commercial electrochemical technologies for the purification of rinse water and the recovery of copper and nickel from a variety of electroplating processes. One of the investigated technologies is based on the application of hi...

Impact of nanosecond proton beam processing on nanoblocks of copper

NASA Astrophysics Data System (ADS)

Borodin, Y. V.; Mantina, A. Y.; Pak, V.; Zhang, X. X.

2017-01-01

X-ray studies in conjunction with the method of recoil nuclei and electron microscopy of irradiated plates polycrystalline Cu by nanosecond high power density proton beams (E = 120 keV; I = 80 A/cm2, t = 50 ns) showed nano block nature of the formation of structure in the surface layer target and condensed-formed film.

Friction Stir Processing of Copper-Coated SiC Particulate-Reinforced Aluminum Matrix Composite

PubMed Central

Huang, Chih-Wei; Aoh, Jong-Ning

2018-01-01

In the present work, we proposed a novel friction stir processing (FSP) to produce a locally reinforced aluminum matrix composite (AMC) by stirring copper-coated SiC particulate reinforcement into Al6061 alloy matrix. Electroless-plating process was applied to deposit the copper surface coating on the SiC particulate reinforcement for the purpose of improving the interfacial adhesion between SiC particles and Al matrix. The core-shell SiC structure provides a layer for the atomic diffusion between aluminum and copper to enhance the cohesion between reinforcing particles and matrix on one hand, the dispersion of fine copper in the Al matrix during FSP provides further dispersive strengthening and solid solution strengthening, on the other hand. Hardness distribution and tensile results across the stir zone validated the novel concept in improving the mechanical properties of AMC that was realized via FSP. Optical microscope (OM) and Transmission Electron Microscopy (TEM) investigations were conducted to investigate the microstructure. Energy dispersive spectrometer (EDS), electron probe micro-analyzer (EPMA), and X-ray diffraction (XRD) were explored to analyze the atomic inter-diffusion and the formation of intermetallic at interface. The possible strengthening mechanisms of the AMC containing Cu-coated SiC particulate reinforcement were interpreted. The concept of strengthening developed in this work may open a new way of fabricating of particulate reinforced metal matrix composites. PMID:29652846

Double coating protection of Nd-Fe-B magnets: Intergranular phosphating treatment and copper plating

NASA Astrophysics Data System (ADS)

Zheng, Jingwu; Chen, Haibo; Qiao, Liang; Lin, Min; Jiang, Liqiang; Che, Shenglei; Hu, Yangwu

2014-12-01

In this work, a double coating protection technique of phosphating treatment and copper plating was made to improve the corrosion resistance of sintered Nd-Fe-B magnets. In other words, the intergranular region of sintered Nd-Fe-B is allowed to generate passive phosphate conversion coating through phosphating treatment, followed by the copper coating on the surface of sintered Nd-Fe-B. The morphology and corrosion resistance of the phosphated sintered Nd-Fe-B were observed using SEM and electrochemical method respectively. The phosphate conversion coating was formed more preferably on the intergranular region of sintered Nd-Fe-B than on the main crystal region; just after a short time of phosphating treatment, the intergranular region of sintered Nd-Fe-B has been covered by the phosphate conversion coating and the corrosion resistance is significantly improved. With the synergistic protection of the intergranular phosphorization and the followed copper electrodeposition, the corrosion resistance of the sintered Nd-Fe-B is significantly better than that with a single phosphate film or single plating protection.

Development of Low Cost Contacts to Silicon Solar Cells

NASA Technical Reports Server (NTRS)

Iles, P. A.; Tanner, D. P.

1979-01-01

Different electroless plating systems were evaluated in conjunction with copper electroplating. All tests involved simultaneous deposition of front and back contacts using a standard cell materials. Cells with good adhesion and good curve fill factors were obtained using a palladium-chromium-copper metallization system. The final copper contact system was evaluated to determine if the copper would migrate at elevated temperatures. The copper migrated at elevated temperatures causing cell output degradation.

Influence of nanomodification additives on the properties of multilayer composite coating obtained in laser surfacing

NASA Astrophysics Data System (ADS)

Cherepanov, A. N.; Orishich, A. M.; Ovcharenko, V. E.; Malikov, A. G.; Drozdov, V. O.; Pshenichnikov, A. P.

2017-10-01

The paper presents the results of numerical and experimental studies of the process of obtaining a permanent joint of two plates of heterogeneous metals that cannot be welded in the usual way: alloy Grade 4 and steel AISI 321 using a laser beam and an intermediate composite insert. The composite insert was obtained by explosion welding of four thin plates of titanium (Grade 4), niobium, copper, and steel (AISI 321). The insert was placed between the welded plates of titanium and steel, and the steel plate was welded with the steel part of the insert, and the titanium plate was welded with the titanium part of the insert. The plates were welded using a CO2 laser. The connection of metals with the help of explosion is carried out without their melting, so the formation of the brittle intermetallics does not occur in most cases. This ensures the greatest strength of the joints as compared to the joints obtained by other welding methods. To analyze the distribution of thermal fields in the composite insert and welded plates, a numerical study was conducted of the laser welding of steel and titanium plates with the corresponding parts of the insert. The purpose of the study was to determine the rational parameters of welding (laser beam power, speed of its movement, size and position of the focal spot), at which there was no complete melting of the steel and titanium parts of the insert during through penetration of the welded plates. The experimental part of the work is devoted to analysis of formation of the internal boundaries and microstructure of the composite insert and the strength of the permanent joint. It is shown that as a result of the explosion welding, weld seams of different wavelike configuration are formed. The most pronounced wavelike boundary is observed in the steel-copper connection, since these materials have a face-centered cubic lattice and are easily subjected to plastic deformation. At the contact boundaries of the plates, transition diffusion zones with different widths (from 5 to 40 μm) and element concentrations are formed. The hardness in the boundary diffusion zones is higher than in the connected metals, which is due to the diffusion interaction of the materials adjacent to each other. It has been established that the tensile strength of the composite insert is comparable to the maximum strength of Grade 4 alloy (456-511 MPa), and the failure in most cases occurred over the least durable component of the composite material, which is the copper plate, whose strength was significantly increased by cold hardening during explosion welding and diffusion of elements of the contacting plates.

Quick-Change Anode for Plating

NASA Technical Reports Server (NTRS)

Beasley, J. L.

1987-01-01

Proposed fastener for attaching electroplating anode improves quality of plating and increases productivity. Notches in twist-lock fastener mates with projections on end of anode bar. Fastener made of titanium for compatibility with copper-plating solution. Also constructed in snap-on, snap-off configuration.

An application of computer image-processing and filmy replica technique to the copper electroplating method of stress analysis

NASA Astrophysics Data System (ADS)

Sugiura, M.; Seika, M.

1994-02-01

In this study, a new technique to measure the density of slip-bands automatically is developed, namely, a TV image of the slip-bands observed through a microscope is directly processed by an image-processing system using a personal computer and an accurate value of the density of slip-bands is measured quickly. In the case of measuring the local stresses in machine parts of large size with the copper plating foil, the direct observation of slip-bands through an optical microscope is difficult. In this study, to facilitate a technique close to the direct microscopic observation of slip-bands in the foil attached to a large-sized specimen, the replica method using a platic film of acetyl cellulose is applied to replicate the slip-bands in the attached foil.

Interfacial microstructure and properties of copper clad steel produced using friction stir welding versus gas metal arc welding

DOE Office of Scientific and Technical Information (OSTI.GOV)

Shen, Z.; Chen, Y.; Haghshenas, M., E-mail: mhaghshe@uwaterloo.ca

A preliminary study compares the feasibility and microstructures of pure copper claddings produced on a pressure vessel A516 Gr. 70 steel plate, using friction stir welding versus gas metal arc welding. A combination of optical and scanning electron microscopy is used to characterize the grain structures in both the copper cladding and heat affected zone in the steel near the fusion line. The friction stir welding technique produces copper cladding with a grain size of around 25 μm, and no evidence of liquid copper penetration into the steel. The gas metal arc welding of copper cladding exhibits grain sizes overmore » 1 mm, and with surface microcracks as well as penetration of liquid copper up to 50 μm into the steel substrate. Transmission electron microscopy reveals that metallurgical bonding is produced in both processes. Increased diffusion of Mn and Si into the copper cladding occurs when using gas metal arc welding, although some nano-pores were detected in the FSW joint interface. - Highlights: • Cladding of steel with pure copper is possible using either FSW or GMAW. • The FSW yielded a finer grain structure in the copper, with no evidence of cracking. • The FSW joint contains some evidence of nano-pores at the interface of the steel/copper. • Copper cladding by GMAW contained surface cracks attributed to high thermal stresses. • The steel adjacent to the fusion line maintained a hardness value below 248 HV.« less

Templated synthesis of cyclic [4]rotaxanes consisting of two stiff rods threaded through two bis-macrocycles with a large and rigid central plate as spacer.

PubMed

Collin, Jean-Paul; Durola, Fabien; Frey, Julien; Heitz, Valérie; Reviriego, Felipe; Sauvage, Jean-Pierre; Trolez, Yann; Rissanen, Kari

2010-05-19

Two related cyclic [4]rotaxanes consisting of double macrocycles and rigid rods incorporating two bidentate chelates have each been prepared in high yield. The first step is a multigathering and threading reaction driven by coordination of two different bidentate chelates (part of either the rings or the rods) to each copper(I) center so as to afford the desired precursor. In both cases, the assembly step is done under very mild conditions, and it is quantitative. The second key reaction is the stopper-attaching reaction, based on click chemistry. Even if the quadruple stoppering reaction is not quantitative, it is relatively high-yielding (60% and 95%), and the copper-driven assembly process is carried out at room temperature without any aggressive reagent. The final copper-complexed [4]rotaxanes obtained contain two aromatic plates roughly parallel to one another located at the center of each bis-macrocycle. In the most promising case in terms of host-guest properties, the plates are zinc(II) porphyrins of the tetra-aryl series. The compounds have been fully characterized by various spectroscopic techniques ((1)H NMR, mass spectrometry, and electronic absorption spectroscopy). Unexpectedly, the copper-complexed porphyrinic [4]rotaxane could be crystallized as its 4PF(6)(-) salt to afford X-ray quality crystals. The structure obtained is in perfect agreement with the postulated chemical structure of the compound. It is particularly attractive in terms of symmetry and molecular aesthetics. The distance between the zinc atoms of the two porphyrins is 8.673 A, which is sufficient to allow insertion between the two porphyrinic plates of small ditopic basic substrates able to interact with the central porphyrinic Zn atoms. This prediction has been confirmed by absorption spectroscopy measurements in the presence of various organic substrates. However, large substrates cannot be introduced in the corresponding recognition site and are thus complexed mostly in an exo fashion, being located outside the receptor cavity. Noteworthy, the stability constants of the 1:1 host-guest complexes are high (10(7) M(-1)).

Electroplating and stripping copper on molybdenum and niobium

NASA Technical Reports Server (NTRS)

Power, J. L.

1978-01-01

Molybdenum and niobium are often electroplated and subsequently stripped of copper. Since general standard plating techniques produce poor quality coatings, general procedures have been optimized and specified to give good results.

Rapid recovery of dilute copper from a simulated Cu-SDS solution with low-cost steel wool cathode reactor.

PubMed

Chang, Shih-Hsien; Wang, Kai-Sung; Hu, Pei-I; Lui, I-Chun

2009-04-30

Copper-surfactant wastewaters are often encountered in electroplating, printed circuit boards manufacturing, and metal finishing industries, as well as in retentates from micellar-enhanced ultrafiltration process. A low-cost three-dimensional steel wool cathode reactor was evaluated for electrolytic recovery of Cu ion from dilute copper solution (0.2mM) in the presence of sodium dodecyl sulfate (SDS), octylphenol poly (ethyleneglycol) 9.5 ether (TX), nonylphenol poly (oxyethylene) 9 ether (NP9) and polyoxyethylene (20) sorbitan monooleate (TW) and also mixed surfactants (anionic/nonionic). The reactor showed excellent copper recovery ability in comparison to a parallel-plate reactor. The reactor rapidly recovered copper with a reasonable current efficiency. 93% of copper was recovered at current density of 1 A m(-2) and pH 4 in the presence of 8.5mM SDS. Initial solution pH, cathodic current density, solution mixing condition, SDS concentration, and initial copper concentrations significantly influenced copper recovery. The copper recovery rate increased with an increase in aqueous SDS concentrations between 5 and 8.5mM. The influences of nonionic surfactants on Cu recovery from SDS-Cu solution depended not only on the type of surfactants used, but also on applied concentrations. From the copper recovery perspective, TX at 0.1mM or NP should be selected rather than TW, because they did not inhibit copper recovery from SDS-Cu solution.

Absolute measurement of the Hugoniot and sound velocity of liquid copper at multimegabar pressures

DOE PAGES

McCoy, Chad August; Knudson, Marcus David; Root, Seth

2017-11-13

Measurement of the Hugoniot and sound velocity provides information on the bulk modulus and Grüneisen parameter of a material at extreme conditions. The capability to launch multilayered (copper/aluminum) flyer plates at velocities in excess of 20 km/s with the Sandia Z accelerator has enabled high-precision sound-velocity measurements at previously inaccessible pressures. For these experiments, the sound velocity of the copper flyer must be accurately known in the multi-Mbar regime. Here we describe the development of copper as an absolutely calibrated sound-velocity standard for high-precision measurements at pressures in excess of 400 GPa. Using multilayered flyer plates, we performed absolute measurementsmore » of the Hugoniot and sound velocity of copper for pressures from 500 to 1200 GPa. These measurements enabled the determination of the Grüneisen parameter for dense liquid copper, clearly showing a density dependence above the melt transition. As a result, combined with earlier data at lower pressures, these results constrain the sound velocity as a function of pressure, enabling the use of copper as a Hugoniot and sound-velocity standard for pressures up to 1200 GPa.« less

Absolute measurement of the Hugoniot and sound velocity of liquid copper at multimegabar pressures

DOE Office of Scientific and Technical Information (OSTI.GOV)

McCoy, Chad August; Knudson, Marcus David; Root, Seth

Measurement of the Hugoniot and sound velocity provides information on the bulk modulus and Grüneisen parameter of a material at extreme conditions. The capability to launch multilayered (copper/aluminum) flyer plates at velocities in excess of 20 km/s with the Sandia Z accelerator has enabled high-precision sound-velocity measurements at previously inaccessible pressures. For these experiments, the sound velocity of the copper flyer must be accurately known in the multi-Mbar regime. Here we describe the development of copper as an absolutely calibrated sound-velocity standard for high-precision measurements at pressures in excess of 400 GPa. Using multilayered flyer plates, we performed absolute measurementsmore » of the Hugoniot and sound velocity of copper for pressures from 500 to 1200 GPa. These measurements enabled the determination of the Grüneisen parameter for dense liquid copper, clearly showing a density dependence above the melt transition. As a result, combined with earlier data at lower pressures, these results constrain the sound velocity as a function of pressure, enabling the use of copper as a Hugoniot and sound-velocity standard for pressures up to 1200 GPa.« less

Determination of the natural convection coefficient in low-gravity

NASA Technical Reports Server (NTRS)

Goldmeer, J.; Motevalli, V.; Haghdoust, M.; Jumper, G.

1992-01-01

Fire safety is an important issue in the current space program; ignition in low-g needs to be studied. The reduction in the gravitational acceleration causes changes in the ignition process. This paper examines the effect of gravity on natural convection, which is one of the important parameters in the ignition process. The NASA-Lewis 2.2 Second Drop Tower provided the low-gravity environment for the experiments. A series of experiments was conducted to measure the temperature of a small copper plate which was heated by a high intensity lamp. These experiments verified that in low-gravity the plate temperature increased faster than in the corresponding 1-g cases, and that the natural convection coefficient rapidly decreased in the low-gravity environment.

Processing, Microstructure, and Mechanical Properties of Interpenetrating Biomorphic Graphite/Copper Composites

NASA Astrophysics Data System (ADS)

Childers, Amanda Esther Sall

Composite properties can surpass those of the individual phases, allowing for the development of advanced, high-performance materials. Bio-inspired and naturally-derived materials have garnered attention as composite constituents due to their inherently efficient and complex structures. Wood-derived ceramics, produced by converting a wood precursor into a ceramic scaffold, can exhibit a wide range of microstructures depending on the wood species, including porosity, pore size and distribution, and connectivity. The focus of this work was to investigate the processing, microstructure, and properties of graphite/copper composites produced using wood-derived graphite scaffolds. Graphite/copper composites combine low specific gravity, high thermal conductivity, and tailorable thermal expansion properties, and due to the non-wetting behavior of copper to graphite, offer a unique system in which mechanically bonded interfaces in composites can be studied. Graphite scaffolds were produced from red oak, beech, and pine precursors using a catalytic pyrolyzation method, resulting in varying types of pore networks. Two infiltration methods were investigated to overcome challenges associated with non-wetting systems: copper electrodeposition and pressure-assisted melt infiltration. The phase distributions, constituent properties, interfacial characteristics, mechanical behavior, and load partitioning of these biomorphic graphite/copper composites were investigated, and were correlated to the wood species. The multi-domain feature sizes in the graphite scaffolds resulted in composites with copper relegated not only to the large, connected channels produced from the transport features in the wood, but also within the smaller, lower aspect ratio fibrous regions of the scaffold. Both features contributed to the mechanical behavior of the composites to varying degrees depending on the wood species. A multi-component predictive model also was developed and used to guide the additive-assisted electroplating of the graphitized scaffold, and helped illuminate the roles of plating additives in macro-sized channels. The model can be adapted for many material systems, sample geometries, and plating conditions to investigate the use of metal electrodeposition as a means of scaffold infiltration. Additionally, X-ray diffraction tomography was used to resolve position-dependent strain in a composite. The results of this nascent capability were discussed with respect to a two-component system under increasing uniaxial load, and compared to the results of conventional volume-averaged measurements.

Review of the Potential of the Ni/Cu Plating Technique for Crystalline Silicon Solar Cells

PubMed Central

Rehman, Atteq ur; Lee, Soo Hong

2014-01-01

Developing a better method for the metallization of silicon solar cells is integral part of realizing superior efficiency. Currently, contact realization using screen printing is the leading technology in the silicon based photovoltaic industry, as it is simple and fast. However, the problem with metallization of this kind is that it has a lower aspect ratio and higher contact resistance, which limits solar cell efficiency. The mounting cost of silver pastes and decreasing silicon wafer thicknesses encourages silicon solar cell manufacturers to develop fresh metallization techniques involving a lower quantity of silver usage and not relying pressing process of screen printing. In recent times nickel/copper (Ni/Cu) based metal plating has emerged as a metallization method that may solve these issues. This paper offers a detailed review and understanding of a Ni/Cu based plating technique for silicon solar cells. The formation of a Ni seed layer by adopting various deposition techniques and a Cu conducting layer using a light induced plating (LIP) process are appraised. Unlike screen-printed metallization, a step involving patterning is crucial for opening the masking layer. Consequently, experimental procedures involving patterning methods are also explicated. Lastly, the issues of adhesion, back ground plating, process complexity and reliability for industrial applications are also addressed. PMID:28788516

Review of the Potential of the Ni/Cu Plating Technique for Crystalline Silicon Solar Cells.

PubMed

Rehman, Atteq Ur; Lee, Soo Hong

2014-02-18

Developing a better method for the metallization of silicon solar cells is integral part of realizing superior efficiency. Currently, contact realization using screen printing is the leading technology in the silicon based photovoltaic industry, as it is simple and fast. However, the problem with metallization of this kind is that it has a lower aspect ratio and higher contact resistance, which limits solar cell efficiency. The mounting cost of silver pastes and decreasing silicon wafer thicknesses encourages silicon solar cell manufacturers to develop fresh metallization techniques involving a lower quantity of silver usage and not relying pressing process of screen printing. In recent times nickel/copper (Ni/Cu) based metal plating has emerged as a metallization method that may solve these issues. This paper offers a detailed review and understanding of a Ni/Cu based plating technique for silicon solar cells. The formation of a Ni seed layer by adopting various deposition techniques and a Cu conducting layer using a light induced plating (LIP) process are appraised. Unlike screen-printed metallization, a step involving patterning is crucial for opening the masking layer. Consequently, experimental procedures involving patterning methods are also explicated. Lastly, the issues of adhesion, back ground plating, process complexity and reliability for industrial applications are also addressed.

Process for producing silicon

DOEpatents

Olson, J.M.; Carleton, K.L.

1982-06-10

A process of producing silicon includes forming an alloy of copper and silicon and positioning the alloy in a dried, molten salt electrolyte to form a solid anode structure therein. An electrically conductive cathode is placed in the electrolyte for plating silicon thereon. The electrolyte is then purified to remove dissolved oxides. Finally, an electrical potential is applied between the anode and cathode in an amount sufficient to form substantially pure silicon on the cathode in the form of substantially dense, coherent deposits.

Process for producing silicon

DOEpatents

Olson, Jerry M.; Carleton, Karen L.

1984-01-01

A process for producing silicon includes forming an alloy of copper and silicon and positioning the alloy in a dried, molten salt electrolyte to form a solid anode structure therein. An electrically conductive cathode is placed in the electrolyte for plating silicon thereon. The electrolyte is then purified to remove dissolved oxides. Finally, an electrical potential is applied between the anode and cathode in an amount sufficient to form substantially pure silicon on the cathode in the form of substantially dense, coherent deposits.

Palladium Nanoparticles Immobilized on Individual Calcium Carbonate Plates Derived from Mussel Shell Waste: An Ecofriendly Catalyst for the Copper-Free Sonogashira Coupling Reaction.

PubMed

Saetan, Trin; Lertvachirapaiboon, Chutiparn; Ekgasit, Sanong; Sukwattanasinitt, Mongkol; Wacharasindhu, Sumrit

2017-09-05

The conversion of waste into high-value materials is considered an important sustainability strategy in modern chemical industries. A large volume of shell waste is generated globally from mussel cultivation. In this work, mussel shell waste (Perna viridis) is transformed into individual calcium carbonate plates (ICCPs) and is applied as a support for a heterogeneous catalyst. Palladium nanoparticles (3-6 nm) are deposited with an even dispersion on the ICCP surface, as demonstrated by X-ray diffraction and scanning electron microscopy. Using this system, Sonogashira cross-coupling reactions between aryl iodides and terminal acetylenes were accomplished in high yields with the use of 1 % Pd/ICCP in the presence of potassium carbonate without the use of any copper metal or external ligand. The Pd/ICCP catalyst could also be reused up to three times and activity over 90 % was maintained with negligible Pd-metal leaching. This work demonstrates that mussel shell waste can be used as an inexpensive and effective support for metal catalysts in coupling reactions, as demonstrated by the successful performance of the Pd-catalyzed, copper-free Sonogashira cross-coupling process. © 2017 Wiley-VCH Verlag GmbH & Co. KGaA, Weinheim.

Multiple-layer printed-wiring trace connector

NASA Technical Reports Server (NTRS)

Pizzeck, D. E.

1977-01-01

Nickel-plated spring-steel foil connector is hollow pin, with lengthwise slit, that is inserted into improperly plated-through holes. Edges of connector make positive contact with copper pads within hole.

Metal copper films deposited on cenosphere particles by magnetron sputtering method

NASA Astrophysics Data System (ADS)

Yu, Xiaozheng; Xu, Zheng; Shen, Zhigang

2007-05-01

Metal copper films with thicknesses from several nanometres to several micrometres were deposited on the surface of cenosphere particles by the magnetron sputtering method under different working conditions. An ultrasonic vibrating generator equipped with a conventional magnetron sputtering apparatus was used to prevent the cenosphere substrates from accumulating during film growth. The surface morphology, the chemical composition, the average grain size and the crystallization of cenosphere particles were characterized by field emission scanning electron microscopy (FE-SEM), inductively coupled plasma-atom emission spectrometer, x-ray photoelectron spectroscopy and x-ray diffraction (XRD) analysis, respectively, before and after the plating process. The results indicate that the copper films were successfully deposited on cenosphere particles. It was found from the FE-SEM results that the films were well compacted and highly uniform in thickness. The XRD results show that the copper film coated on cenospheres has a face centred cubic structure and the crystallization of the film sample increases with increasing sputtering power.

Differential bacteriophage mortality on exposure to copper.

PubMed

Li, Jinyu; Dennehy, John J

2011-10-01

Many studies report that copper can be used to control microbial growth, including that of viruses. We determined the rates of copper-mediated inactivation for a wide range of bacteriophages. We used two methods to test the effect of copper on bacteriophage survival. One method involved placing small volumes of bacteriophage lysate on copper and stainless steel coupons. Following exposure, metal coupons were rinsed with lysogeny broth, and the resulting fluid was serially diluted and plated on agar with the corresponding bacterial host. The second method involved adding copper sulfate (CuSO(4)) to bacteriophage lysates to a final concentration of 5 mM. Aliquots were removed from the mixture, serially diluted, and plated with the appropriate bacterial host. Significant mortality was observed among the double-stranded RNA (dsRNA) bacteriophages Φ6 and Φ8, the single-stranded RNA (ssRNA) bacteriophage PP7, the ssDNA bacteriophage ΦX174, and the dsDNA bacteriophage PM2. However, the dsDNA bacteriophages PRD1, T4, and λ were relatively unaffected by copper. Interestingly, lipid-containing bacteriophages were most susceptible to copper toxicity. In addition, in the first experimental method, the pattern of bacteriophage Φ6 survival over time showed a plateau in mortality after lysates dried out. This finding suggests that copper's effect on bacteriophage is mediated by the presence of water.

Critical Evaluation of State-of-the-Art In Situ Thermal Treatment Technologies for DNAPL Source Zone Treatment. State-of-the-Practice Overview

DTIC Science & Technology

2009-05-01

recovery in their design. Electrodes have been constructed from steel pipe , copper plate for heating distinct zones, and sheet pile. Sheet pile...energy transfer/ heating in the subsurface) The components required to implement ERH include: • Electrodes (steel pipe , copper plate, well points...including piping , blower, and condenser • A vapor treatment system Electrical Resistance Heating (Smith) A-3 • An ERH power control unit to

The automated array assembly task of the low-cost silicon solar array project, phase 2

NASA Technical Reports Server (NTRS)

Coleman, M. G.; Pryor, R. A.; Sparks, T. G.; Legge, R.; Saltzman, D. L.

1980-01-01

Several specific processing steps as part of a total process sequence for manufacturing silicon solar cells were studied. Ion implantation was identified as the preferred process step for impurity doping. Unanalyzed beam ion implantation was shown to have major cost advantages over analyzed beam implantation. Further, high quality cells were fabricated using a high current unanalyzed beam. Mechanically masked plasma patterning of silicon nitride was shown to be capable of forming fine lines on silicon surfaces with spacings between mask and substrate as great as 250 micrometers. Extensive work was performed on advances in plated metallization. The need for the thick electroless palladium layer was eliminated. Further, copper was successfully utilized as a conductor layer utilizing nickel as a barrier to copper diffusion into the silicon. Plasma etching of silicon for texturing and saw damage removal was shown technically feasible but not cost effective compared to wet chemical etching techniques.

Copper Hugoniot measurements to 2.8 TPa on Z.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Furnish, Michael D.; Haill, Thomas A

We conducted three Hugoniot and release experiments on copper on the Z machine at Hugoniot stress levels of 0.34 and 2.6 TPa, using two-layer copper/aluminum impactors travelling at 8 and 27 km/s and Z-quartz windows. Velocity histories were recorded for 4 samples of different thicknesses and 5 locations on the flyer plate (3 and 4 for the first two experiments). On-sample measurements provided Hugoniot points (via transit time) and partial release states (via Z-quartz wavespeed). Fabrication of the impactor required thick plating and several diamond-machining steps. The lower-pressure test was planned as a 2.5 TPa test, but a failure onmore » the Z machine degraded its performance; however, these results corroborated earlier Cu data in the same stress region. The second test suffered from significant flyer plate bowing, but the third did not. The Hugoniot data are compared with the APtshuler/Nellis nuclear-driven data, other data from Z and elsewhere, and representative Sesame models.« less

Silver-free Metallization Technology for Producing High Efficiency, Industrial Silicon Solar Cells

DOE Office of Scientific and Technical Information (OSTI.GOV)

Michaelson, Lynne M.; Munoz, Krystal; Karas, Joseph

The goal of this project is to provide a commercially viable Ag-free metallization technology that will both reduce cost and increase efficiency of standard silicon solar cells. By removing silver from the front grid metallization and replacing it with lower cost nickel, copper, and tin metal, the front grid direct materials costs will decrease. This reduction in material costs should provide a path to meeting the Sunshot 2020 goal of 1 dollar / W DC. As of today, plated contacts are not widely implemented in large scale manufacturing. For organizations that wish to implement pilot scale manufacturing, only two equipmentmore » choices exist. These equipment manufacturers do not supply plating chemistry. The main goal of this project is to provide a chemistry and equipment solution to the industry that enables reliable manufacturing of plated contacts marked by passing reliability results and higher efficiencies than silver paste front grid contacts. To date, there have been several key findings that point to plated contacts performing equal to or better than the current state of the art silver paste contacts. Poor adhesion and reliability concerns are a few of the hurdles for plated contacts, specifically plated nickel directly on silicon. A key finding of the Phase 1 budget period is that the plated contacts have the same adhesion as the silver paste controls. This is a huge win for plated contacts. With very little optimization work, state of the art electrical results for plated contacts on laser ablated lines have been demonstrated with efficiencies up to 19.1% and fill factors ~80% on grid lines 40-50 um wide. The silver paste controls with similar line widths demonstrate similar electrical results. By optimizing the emitter and grid design for the plated contacts, it is expected that the electrical performance will exceed the silver paste controls. In addition, cells plated using Technic chemistry and equipment pass reliability testing; i.e. 1000 hours damp heat and 200 thermal cycles, with results similar to silver paste control cells. 100 cells have been processed through Technic’s novel demo plating tool built and installed during budget period 2. This plating tool performed consistently from cell to cell, providing gentle handling for the solar cells. An agreement has been signed with a cell manufacturer to process their cells through our plating chemistry and equipment. Their main focus for plated contacts is to reduce the direct materials cost by utilizing nickel, copper, and tin in place of silver paste. Based on current market conditions and cost model calculations, the overall savings offered by plated contacts is only 3.5% dollar/W versus silver paste contacts; however, the direct materials savings depend on the silver market. If silver prices increase, plated contacts may find a wider adoption in the solar industry in order to keep the direct materials costs down for front grid contacts.« less

Bulk substrate porosity verification by applying Monte Carlo modeling and Castaing's formula using energy-dispersive x-rays

NASA Astrophysics Data System (ADS)

Yung, Lai Chin; Fei, Cheong Choke; Mandeep, Jit Singh; Amin, Nowshad; Lai, Khin Wee

2015-11-01

The leadframe fabrication process normally involves additional thin-metal layer plating on the bulk copper substrate surface for wire bonding purposes. Silver, tin, and copper flakes are commonly adopted as plating materials. It is critical to assess the density of the plated metal layer, and in particular to look for porosity or voids underneath the layer, which may reduce the reliability during high-temperature stress. A fast, reliable inspection technique is needed to assess the porosity or void weakness. To this end, the characteristics of x-rays generated from bulk samples were examined using an energy-dispersive x-ray (EDX) detector to examine the porosity percentage. Monte Carlo modeling was integrated with Castaing's formula to verify the integrity of the experimental data. Samples with different porosity percentages were considered to test the correlation between the intensity of the collected x-ray signal and the material density. To further verify the integrity of the model, conventional cross-sectional samples were also taken to observe the porosity percentage using Image J software measurement. A breakthrough in bulk substrate assessment was achieved by applying EDX for the first time to nonelemental analysis. The experimental data showed that the EDX features were not only useful for elemental analysis, but also applicable to thin-film metal layer thickness measurement and bulk material density determination. A detailed experiment was conducted using EDX to assess the plating metal layer and bulk material porosity.

Synthesis of copper coated carbon nanotubes for aluminium matrix composites

NASA Astrophysics Data System (ADS)

Maqbool, Adnan; Khalid, F. Ahmad; Hussain, M. Asif; Bakhsh, Nabi

2014-06-01

In this investigation copper coated carbon nanotubes (CNTs) were prepared to enhance the interfacial bonding between CNTs and aluminum matrix by the molecular-level mixing process. In optimized plating bath of (1:1) by wt. CNT with Cu, thickness of coated CNTs is reduced to 100 nm to promote uniform distribution of Cu nanoparticle on the surface of pretreated CNTs. The mixing of CNTs was accomplished by ultrasonication and ball milling. Scanning electron microscope analysis revealed the homogenous dispersion of Cu-coated CNTs in nanocomposites samples compared to the uncoated CNTs. The samples were pressureless sintered under vacuum. The densification increased with the increase in the CNTs content and is more pronounced in Cu-coated CNT nanocomposites.

Electroless deposition process for zirconium and zirconium alloys

DOEpatents

Donaghy, R. E.; Sherman, A. H.

1981-08-18

A method is disclosed for preventing stress corrosion cracking or metal embrittlement of a zirconium or zirconium alloy container that is to be coated on the inside surface with a layer of a metal such as copper, a copper alloy, nickel, or iron and used for holding nuclear fuel material as a nuclear fuel element. The zirconium material is etched in an etchant solution, desmutted mechanically or ultrasonically, oxidized to form an oxide coating on the zirconium, cleaned in an aqueous alkaline cleaning solution, activated for electroless deposition of a metal layer and contacted with an electroless metal plating solution. This method provides a boundary layer of zirconium oxide between the zirconium container and the metal layer. 1 fig.

Electroless deposition process for zirconium and zirconium alloys

DOEpatents

Donaghy, Robert E.; Sherman, Anna H.

1981-01-01

A method is disclosed for preventing stress corrosion cracking or metal embrittlement of a zirconium or zirconium alloy container that is to be coated on the inside surface with a layer of a metal such as copper, a copper alloy, nickel, or iron and used for holding nuclear fuel material as a nuclear fuel element. The zirconium material is etched in an etchant solution, desmutted mechanically or ultrasonically, oxidized to form an oxide coating on the zirconium, cleaned in an aqueous alkaline cleaning solution, activated for electroless deposition of a metal layer and contacted with an electroless metal plating solution. This method provides a boundary layer of zirconium oxide between the zirconium container and the metal layer.

Microcomponents manufacturing for precise devices by copper vapor laser

NASA Astrophysics Data System (ADS)

Gorny, Sergey; Nikonchuk, Michail O.; Polyakov, Igor V.

2001-06-01

This paper presents investigation results of drilling of metal microcomponents by copper vapor laser. The laser consists of master oscillator - spatial filter - amplifier system, electronics switching with digital control of laser pulse repetition rate and quantity of pulses, x-y stage with computer control system. Mass of metal, removed by one laser pulse, is measured and defined by means of diameter and depth of holes. Interaction of next pulses on drilled material is discussed. The difference between light absorption and metal evaporation processes is considered for drilling and cutting. Efficiency of drilling is estimated by ratio of evaporation heat and used laser energy. Maximum efficiency of steel cutting is calculated with experimental data of drilling. Applications of copper vapor laser for manufacturing is illustrated by such microcomponents as pin guide plate for printers, stents for cardio surgery, encoded disks for security systems and multiple slit masks for spectrophotometers.

Structural and optical properties of copper-coated substrates for solar thermal absorbers

NASA Astrophysics Data System (ADS)

Pratesi, Stefano; De Lucia, Maurizio; Meucci, Marco; Sani, Elisa

2016-10-01

Spectral selectivity, i.e. merging a high absorbance at sunlight wavelengths to a low emittance at the wavelengths of thermal spectrum, is a key characteristics for materials to be used for solar thermal receivers. It is known that spectrally selective absorbers can raise the receiver efficiency for all solar thermal technologies. Tubular sunlight receivers for parabolic trough collector (PTC) systems can be improved by the use of spectrally selective coatings. Their absorbance is increased by deposing black films, while the thermal emittance is minimized by the use of properly-prepared substrates. In this work we describe the intermediate step in the fabrication of black-chrome coated solar absorbers, namely the fabrication and characterization of copper coatings on previously nickel-plated stainless steel substrates. We investigate the copper surface features and optical properties, correlating them to the coating thickness and to the deposition process, in the perspective to assess optimal conditions for solar absorber applications.

Relationship between porphyry copper occurrences, crustal preservation levels, and amount of exploration in magmatic belts of the Central Tethys region

USGS Publications Warehouse

Zürcher, Lukas; Bookstrom, Arthur A.; Hammarstrom, Jane M.; Mars, John; Ludington, Stephen; Zientek, Michael L.; Dunlap, Pamela; Wallis, John C.

2014-01-01

A probabilistic assessment of undiscovered resources in porphyry copper deposits in the Central Tethys region of Turkey, the Caucasus, Iran, western Pakistan, and southern Afghanistan was conducted as part of a U.S.G.S. global mineral resource assessment. The purpose was to delineate areas as permissive tracts for the occurrence of porphyry Cu-Mo and Cu-Au deposits, and to provide estimates of amounts of Cu, Mo, and Au likely to be contained in undiscovered porphyry deposits (Zürcher et al., 2013; Zürcher et al., in review). Tectonic, geologic, geochemical, geochronologic, and ore deposits data compiled and analyzed for this assessment show that magmatism in the region can be rationalized in terms of fundamental plate tectonic principles, including mantle-involved post-subduction processes. However, uplift, erosion, subsidence, and burial of porphyry copper deposits also played an important role in shaping the observed metallogenic patterns.

Silicon Sheet Growth Development for the Large Area Sheet Task of the Low Cost Solar Array Project. Heat Exchanger Method - Ingot Casting Fixed Abrasive Method - Multi-Wire Slicing

NASA Technical Reports Server (NTRS)

Schmid, F.; Khattak, C. P.

1978-01-01

Solar cells fabricated from HEM cast silicon yielded up to 15% conversion efficiencies. This was achieved in spite of using unpurified graphite parts in the HEM furnace and without optimization of material or cell processing parameters. Molybdenum retainers prevented SiC formation and reduced carbon content by 50%. The oxygen content of vacuum cast HEM silicon is lower than typical Czochralski grown silicon. Impregnation of 45 micrometers diamonds into 7.5 micrometers copper sheath showed distortion of the copper layer. However, 12.5 micrometers and 15 micrometers copper sheath can be impregnated with 45 micrometers diamonds to a high concentration. Electroless nickel plating of wires impregnated only in the cutting edge showed nickel concentration around the diamonds. This has the possibility of reducing kerf. The high speed slicer fabricated can achieve higher speed and longer stroke with vibration isolation.

Structure and Microhardness of Cu-Ta Joints Produced by Explosive Welding

PubMed Central

Maliutina, Iu. N.; Mali, V. I.; Bataev, I. A.; Bataev, A. A.; Esikov, M. A.; Smirnov, A. I.; Skorokhod, K. A.

2013-01-01

The structure and microhardness of Cu-Ta joints produced by explosive welding were studied. It was found that, during explosive welding, an intermediate layer 20⋯40 μm thick with a finely dispersed heterophase structure, formed between the welded copper and tantalum plates. The structure of the layer was studied by scanning and transmission electron microscopy. Microvolumes with tantalum particles distributed in a copper matrix and microvolumes of copper particles in a tantalum matrix were detected. The tantalum particles in copper have a size of 5⋯500 nm, with a predominance of 5⋯50 nm particles. A mechanism for the formation of the finely dispersed heterophase structure in explosive welding is proposed. The microhardness of interlayers with the heterophase structure reaches 280 HV, which far exceeds the microhardness of copper (~130 HV) and tantalum (~160 HV). Many twins of deformation origin were found in the structure of the copper plate. The effect of heating temperature in the range from 100 to 900°C on the microhardness of copper, tantalum, and the Cu-Ta welded joint was studied. Upon heating to 900°C, the microhardness of the intermediate layer decreases from 280 to 150 HV. The reduction in the strength properties of the weld material is mainly due to structural transformations in copper. PMID:24453818

Separating and recycling metals from mixed metallic particles of crushed electronic wastes by vacuum metallurgy.

PubMed

Zhan, Lu; Xu, Zhenming

2009-09-15

During the treatment of electronic wastes, a crushing process is usually used to strip metals from various base plates. Several methods have been applied to separate metals from nonmetals. However, mixed metallic particles obtained from these processes are still a mixture of various metals, including some toxic heavy metals such as lead and cadmium. With emphasis on recovering copper and other precious metals, there have hitherto been no satisfactory methods to recover these toxic metals. In this paper, the criterion of separating metals from mixed metallic particles by vacuum metallurgy is built. The results show that the metals with high vapor pressure have been almost recovered completely, leading to a considerable reduction of environmental pollution. In addition, the purity of copper in mixed particles has been improved from about 80 wt % to over 98 wt %.

Preparation of ultrafine grained copper nanoparticles via immersion deposit method

NASA Astrophysics Data System (ADS)

Abbasi-Kesbi, Fatemeh; Rashidi, Ali Mohammad; Astinchap, Bandar

2018-03-01

Today, the exploration about synthesis of nanoparticles is much of interest to materials scientists. In this work, copper nanoparticles have been successfully synthesized by immersion deposit method in the absence of any stabilizing and reducing agents. Copper (II) sulfate pentahydrate as precursor salt and distilled water and Ethylene glycol as solvents were used. The copper nanoparticles were deposited on plates of low carbon steel. The effects of copper sulfate concentrations and solvent type were investigated. X-ray diffraction, scanning electron microscopy and UV-Visible spectroscopy were taken to investigate the crystallite size, crystal structure, and morphology and size distribution and the growth process of the nanoparticles of obtained Cu particles. The results indicated that the immersion deposit method is a particularly suitable method for synthesis of semispherical copper nanoparticles with the crystallites size in the range of 22 to 37 nm. By increasing the molar concentration of copper sulfate in distilled water solvent from 0.04 to 0.2 M, the average particles size is increased from 57 to 81 nm. The better size distribution of Cu nanoparticles was achieved using a lower concentration of copper sulfate. By increasing the molar concentration of copper sulfate in water solvent from 0.04 to 0.2, the location of the SPR peak has shifted from 600 to 630 nm. The finer Cu nanoparticles were formed using ethylene glycol instead water as a solvent. Also, the agglomeration and overlapping of nanoparticles in ethylene glycol were less than that of water solvent.

19. VIEW OF THE PLATING BATHS AND CONTROL PANELS. GOLD ...

Library of Congress Historic Buildings Survey, Historic Engineering Record, Historic Landscapes Survey

19. VIEW OF THE PLATING BATHS AND CONTROL PANELS. GOLD AND SILVER WERE AMONG THE MATERIALS PLATED ONTO PARTS MADE OF COPPER, STAINLESS STEEL AND STEEL. (11/15/89) - Rocky Flats Plant, Non-Nuclear Production Facility, South of Cottonwood Avenue, west of Seventh Avenue & east of Building 460, Golden, Jefferson County, CO

Nanoscale coatings for erosion and corrosion protection of copper microchannel coolers for high powered laser diodes

NASA Astrophysics Data System (ADS)

Flannery, Matthew; Fan, Angie; Desai, Tapan G.

2014-03-01

High powered laser diodes are used in a wide variety of applications ranging from telecommunications to industrial applications. Copper microchannel coolers (MCCs) utilizing high velocity, de-ionized water coolant are used to maintain diode temperatures in the recommended range to produce stable optical power output and control output wavelength. However, aggressive erosion and corrosion attack from the coolant limits the lifetime of the cooler to only 6 months of operation. Currently, gold plating is the industry standard for corrosion and erosion protection in MCCs. However, this technique cannot perform a pin-hole free coating and furthermore cannot uniformly cover the complex geometries of current MCCs involving small diameter primary and secondary channels. Advanced Cooling Technologies, Inc., presents a corrosion and erosion resistant coating (ANCERTM) applied by a vapor phase deposition process for enhanced protection of MCCs. To optimize the coating formation and thickness, coated copper samples were tested in 0.125% NaCl solution and high purity de-ionized (DIW) flow loop. The effects of DIW flow rates and qualities on erosion and corrosion of the ANCERTM coated samples were evaluated in long-term erosion and corrosion testing. The robustness of the coating was also evaluated in thermal cycles between 30°C - 75°C. After 1000 hours flow testing and 30 thermal cycles, the ANCERTM coated copper MCCs showed a corrosion rate 100 times lower than the gold plated ones and furthermore were barely affected by flow rates or temperatures thus demonstrating superior corrosion and erosion protection and long term reliability.

Mechanical properties and microstructure of copper alloys and copper alloy-stainless steel laminates for fusion reactor high heat flux applications

NASA Astrophysics Data System (ADS)

Leedy, Kevin Daniel

A select group of copper alloys and bonded copper alloy-stainless steel panels are under consideration for heat sink applications in first wall and divertor structures of a planned thermonuclear fusion reactor. Because these materials must retain high strengths and withstand high heat fluxes, their material properties and microstructures must be well understood. Candidate copper alloys include precipitate strengthened CuNiBe and CuCrZr and dispersion strengthened Cu-Alsb2Osb3 (CuAl25). In this study, uniaxial mechanical fatigue tests were conducted on bulk copper alloy materials at temperatures up to 500sp°C in air and vacuum environments. Based on standardized mechanical properties measurement techniques, a series of tests were also implemented to characterize copper alloy-316L stainless steel joints produced by hot isostatic pressing or by explosive bonding. The correlation between mechanical properties and the microstructure of fatigued copper alloys and the interface of copper alloy-stainless steel laminates was examined. Commercial grades of these alloys were used to maintain a degree of standardization in the materials testing. The commercial alloys used were OMG Americas Glidcop CuAl25 and CuAl15; Brush Wellman Hycon 3HP and Trefimetaux CuNiBe; and Kabelmetal Elbrodur and Trefimetaux CuCrZr. CuAl25 and CuNiBe alloys possessed the best combination of fatigue resistance and microstructural stability. The CuAl25 alloy showed only minimal microstructural changes following fatigue while the CuNiBe alloy consistently exhibited the highest fatigue strength. Transmission electron microscopy observations revealed that small matrix grain sizes and high densities of submicron strengthening phases promoted homogeneous slip deformation in the copper alloys. Thus, highly organized fatigue dislocation structure formation, as commonly found in oxygen-free high conductivity Cu, was inhibited. A solid plate of CuAl25 alloy hot isostatically pressed to a 316L stainless steel plate showed the best overall mechanical properties of the studied bi-metallic bonded panels. Bond properties were nominally inferior to constituent bulk material properties and fracture toughness values, in particular, were quite low for all bonded laminates. Delamination near the copper alloy-stainless steel interface was the dominate failure mode in the bi-metallic panels. The joining processes caused microstructural alterations in the bond interfacial regions including: microporosity, new precipitate formation, existing precipitate morphology changes and interdiffusion of constituent elements.

Macro controlling of copper oxide deposition processes and spray mode by using home-made fully computerized spray pyrolysis system

NASA Astrophysics Data System (ADS)

Essa, Mohammed Sh.; Chiad, Bahaa T.; Shafeeq, Omer Sh.

2017-09-01

Thin Films of Copper Oxide (CuO) absorption layer have been deposited using home-made Fully Computerized Spray Pyrolysis Deposition system FCSPD on glass substrates, at the nozzle to substrate distance equal to 20,35 cm, and computerized spray mode (continues spray, macro-control spray). The substrate temperature has been kept at 450 °c with the optional user can enter temperature tolerance values ± 5 °C. Also that fixed molar concentration of 0.1 M, and 2D platform speed or deposition platform speed of 4mm/s. more than 1000 instruction program code, and specific design of graphical user interface GUI to fully control the deposition process and real-time monitoring and controlling the deposition temperature at every 200 ms. The changing in the temperature has been recorded during deposition processes, in addition to all deposition parameters. The films have been characterized to evaluate the thermal distribution over the X, Y movable hot plate, the structure and optical energy gap, thermal and temperature distribution exhibited a good and uniform distribution over 20 cm2 hot plate area, X-ray diffraction (XRD) measurement revealed that the films are polycrystalline in nature and can be assigned to monoclinic CuO structure. Optical band gap varies from 1.5-1.66 eV depending on deposition parameter.

Recycling Of Cis Photovoltaic Waste

DOEpatents

Drinkard, Jr., William F.; Long, Mark O.; Goozner; Robert E.

1998-07-14

A method for extracting and reclaiming metals from scrap CIS photovoltaic cells and associated photovoltaic manufacturing waste by leaching the waste with dilute nitric acid, skimming any plastic material from the top of the leaching solution, separating glass substrate from the leachate, electrolyzing the leachate to plate a copper and selenium metal mixture onto a first cathode, replacing the cathode with a second cathode, re-electrolyzing the leachate to plate cadmium onto the second cathode, separating the copper from selenium, and evaporating the depleted leachate to yield a zinc and indium containing solid.

Remediation System Evaluation, Peerless Plating Site

EPA Pesticide Factsheets

The Peerless Plating Superfund Site is located at 2554 South Getty Street, north of the intersection of South Getty Street and East Sherman Boulevard in Muskegon, Michigan. Copper, nickel, chromium, cadmium, and zinc electroplating operations as well as...

Hermetically sealable package for hybrid solid-state electronic devices and the like

NASA Technical Reports Server (NTRS)

Miller, Wilson N. (Inventor); Gray, Ormal E. (Inventor)

1988-01-01

A light-weight, inexpensively fabricated, hermetically sealable, repairable package for small electronic or electromechanical units, having multiple connections, is described. A molded ring frame of polyamide-imide plastic (Torlon) is attached along one edge to a base plate formed of a highly heat conducting material, such as aluminum or copper. Bores are placed through a base plate within the area of the edge surface of ring frame which result in an attachment of the ring frame to the base plate during molding. Electrical leads are molded into the ring frame. The leads are L-shaped gold-plated copper wires imbedded within widened portions of the side wall of the ring frame. Within the plastic ring frame wall the leads are bent (typically, though not necessarily at 90 deg) so that they project into the interior volume of the ring frame for connection to the solid state devices.

Copper Deposits in Sedimentary and Volcanogenic Rocks

USGS Publications Warehouse

Tourtelot, Elizabeth B.; Vine, James David

1976-01-01

Copper deposits occur in sedimentary and volcanogenic rocks within a wide variety of geologic environments where there may be little or no evidence of hydrothermal alteration. Some deposits may be hypogene and have a deep-seated source for the ore fluids, but because of rapid cooling and dilution during syngenetic deposition on the ocean floor, the resulting deposits are not associated with hydrothermal alteration. Many of these deposits are formed at or near major tectonic features on the Earth's crust, including plate boundaries, rift valleys, and island arcs. The resulting ore bodies may be stratabound and either massive or disseminated. Other deposits form in rocks deposited in shallow-marine, deltaic, and nonmarine environments by the movement and reaction of interstratal brines whose metal content is derived from buried sedimentary and volcanic rocks. Some of the world's largest copper deposits were probably formed in this manner. This process we regard as diagenetic, but some would regard it as syngenetic, if the ore metals are derived from disseminated metal in the host-rock sequence, and others would regard the process as epigenetic, if there is demonstrable evidence of ore cutting across bedding. Because the oxidation associated with diagenetic red beds releases copper to ground-water solutions, red rocks and copper deposits are commonly associated. However, the ultimate size, shape, and mineral zoning of a deposit result from local conditions at the site of deposition - a logjam in fluvial channel sandstone may result in an irregular tabular body of limited size; a petroleum-water interface in an oil pool may result in a copper deposit limited by the size and shape of the petroleum reservoir; a persistent thin bed of black shale may result in a copper deposit the size and shape of that single bed. The process of supergene enrichment has been largely overlooked in descriptions of copper deposits in sedimentary rocks. However, supergene processes may be involved during erosion of any primary ore body and its ultimate displacement and redeposition as a secondary deposit. Bleached sandstone at the surface may indicate significant ore deposits near the water table.

Apparatus for precision micromachining with lasers

DOEpatents

Chang, J.J.; Dragon, E.P.; Warner, B.E.

1998-04-28

A new material processing apparatus using a short-pulsed, high-repetition-rate visible laser for precision micromachining utilizes a near diffraction limited laser, a high-speed precision two-axis tilt-mirror for steering the laser beam, an optical system for either focusing or imaging the laser beam on the part, and a part holder that may consist of a cover plate and a back plate. The system is generally useful for precision drilling, cutting, milling and polishing of metals and ceramics, and has broad application in manufacturing precision components. Precision machining has been demonstrated through percussion drilling and trepanning using this system. With a 30 W copper vapor laser running at multi-kHz pulse repetition frequency, straight parallel holes with size varying from 500 microns to less than 25 microns and with aspect ratios up to 1:40 have been consistently drilled with good surface finish on a variety of metals. Micromilling and microdrilling on ceramics using a 250 W copper vapor laser have also been demonstrated with good results. Materialographic sections of machined parts show little (submicron scale) recast layer and heat affected zone. 1 fig.

Apparatus for precision micromachining with lasers

DOEpatents

Chang, Jim J.; Dragon, Ernest P.; Warner, Bruce E.

1998-01-01

A new material processing apparatus using a short-pulsed, high-repetition-rate visible laser for precision micromachining utilizes a near diffraction limited laser, a high-speed precision two-axis tilt-mirror for steering the laser beam, an optical system for either focusing or imaging the laser beam on the part, and a part holder that may consist of a cover plate and a back plate. The system is generally useful for precision drilling, cutting, milling and polishing of metals and ceramics, and has broad application in manufacturing precision components. Precision machining has been demonstrated through percussion drilling and trepanning using this system. With a 30 W copper vapor laser running at multi-kHz pulse repetition frequency, straight parallel holes with size varying from 500 microns to less than 25 microns and with aspect ratios up to 1:40 have been consistently drilled with good surface finish on a variety of metals. Micromilling and microdrilling on ceramics using a 250 W copper vapor laser have also been demonstrated with good results. Materialogroaphic sections of machined parts show little (submicron scale) recast layer and heat affected zone.

Microstructure and Mechanical Properties of High Copper HSLA-100 Steel in 2-inch Plate Form

DTIC Science & Technology

1992-06-01

2. HSLA-100 Steel Continuous Cooling Transformation Diagram [Ref. 13:p. 262] One of the most desirable characteristics of the low -carbon, copper ...none V mild v.strong v. strong V. strong moderate The use of copper as an alloying element in low carbon HSLA steel has resulted in the following...HY-130 steel . In research presently being done, it has been determined that the high copper alloy has a highly dislocated martensitic /bainitic

Characteristics of coated copper wire specimens using high frequency ultrasonic complex vibration welding equipments.

PubMed

Tsujino, J; Ihara, S; Harada, Y; Kasahara, K; Sakamaki, N

2004-04-01

Welding characteristic of thin coated copper wires were studied using 40, 60, 100 kHz ultrasonic complex vibration welding equipments with elliptical to circular vibration locus. The complex vibration systems consisted of a longitudinal-torsional vibration converter and a driving longitudinal vibration system. Polyurethane coated copper wires of 0.036 mm outer diameter and copper plates of 0.3 mm thickness and the other dimension wires were used as welding specimens. The copper wire part is completely welded on the copper substrate and the insulated coating material is driven from welded area to outsides of the wire specimens by high frequency complex vibration.

Silver and tin plating as medieval techniques of producing counterfeit coins and their identification by means of micro-XRF

NASA Astrophysics Data System (ADS)

Hložek, M.; Trojek, T.

2017-08-01

Archaeological surveys and metal detector prospecting yield a great amount of coins from the medieval period. Naturally, some of these are counterfeit which an experienced numismatist can determine without using chemical methods. The production of counterfeit coins in the middle ages took place in castles, caves or other remote areas where waste from this activity can still be found today - copper sheets, technical ceramics and counterfeit coins. Until recently, it has been assumed that medieval counterfeit coins are made by silver-plating copper blanks using an amalgam. However, the performed analyses reveal that there are many more techniques of counterfeiting of coins. Other techniques were based on e.g. tin amalgam plating of the blanks or alloying so-called white metal with silver-like appearance from which the coins were minted. Current chemical analyses indicate that the coins were often tinned by hot dipping with no amalgamation. Micro-X-ray fluorescence analysis has been chosen as a suitable non-destructive method to identify present chemical elements in investigated artifacts and to quantify their concentrations. In addition, a quick technique telltale the plating was applied. This technique utilizes the detected fluorescence ratio Kα/Kβ of copper, which is the main ingredient of a lot of historical metallic materials.

Solid-phase materials for chelating metal ions and methods of making and using same

DOEpatents

Harrup, Mason K.; Wey, John E.; Peterson, Eric S.

2003-06-10

A solid material for recovering metal ions from aqueous streams, and methods of making and using the solid material, are disclosed. The solid material is made by covalently bonding a chelating agent to a silica-based solid, or in-situ condensing ceramic precursors along with the chelating agent to accomplish the covalent bonding. The chelating agent preferably comprises a oxime type chelating head, preferably a salicylaldoxime-type molecule, with an organic tail covalently bonded to the head. The hydrocarbon tail includes a carbon-carbon double bond, which is instrumental in the step of covalently bonding the tail to the silica-based solid or the in-situ condensation. The invented solid material may be contacted directly with aqueous streams containing metal ions, and is selective to ions such as copper (II) even in the presence of such ions as iron (III) and other materials that are present in earthen materials. The solid material with high selectivity to copper may be used to recover copper from mining and plating industry streams, to replace the costly and toxic solvent extraction steps of conventional copper processing.

Estimates of microbial quality and concentration of copper in distributed drinking water are highly dependent on sampling strategy.

PubMed

Lehtola, Markku J; Miettinen, Ilkka T; Hirvonen, Arja; Vartiainen, Terttu; Martikainen, Pertti J

2007-12-01

The numbers of bacteria generally increase in distributed water. Often household pipelines or water fittings (e.g., taps) represent the most critical location for microbial growth in water distribution systems. According to the European Union drinking water directive, there should not be abnormal changes in the colony counts in water. We used a pilot distribution system to study the effects of water stagnation on drinking water microbial quality, concentration of copper and formation of biofilms with two commonly used pipeline materials in households; copper and plastic (polyethylene). Water stagnation for more than 4h significantly increased both the copper concentration and the number of bacteria in water. Heterotrophic plate counts were six times higher in PE pipes and ten times higher in copper pipes after 16 h of stagnation than after only 40 min stagnation. The increase in the heterotrophic plate counts was linear with time in both copper and plastic pipelines. In the distribution system, bacteria originated mainly from biofilms, because in laboratory tests with water, there was only minor growth of bacteria after 16 h stagnation. Our study indicates that water stagnation in the distribution system clearly affects microbial numbers and the concentration of copper in water, and should be considered when planning the sampling strategy for drinking water quality control in distribution systems.

On the Prediction of Hot Tearing in Al-to-Steel Welding by Friction Melt Bonding

NASA Astrophysics Data System (ADS)

Jimenez-Mena, N.; Jacques, P. J.; Drezet, J. M.; Simar, A.

2018-07-01

Aluminum alloy AA6061 was welded to dual-phase steel 980 (DP980) by the friction melt bonding (FMB) process. Hot tears have been suppressed by controlling the thermomechanical cycle. In particular, the welding speed and the thermal conductivity of the backing plate have been optimized. A finite-element thermomechanical model coupled with the Rappaz-Drezet-Gremaud (RDG) criterion has been used to explain these experimental observations. The hot tear susceptibility has been reduced with large thermal gradients and with the formation of a cellular microstructure. Both effects are favored by a backing plate made of a material with high thermal conductivity, such as copper.

On the Prediction of Hot Tearing in Al-to-Steel Welding by Friction Melt Bonding

NASA Astrophysics Data System (ADS)

Jimenez-Mena, N.; Jacques, P. J.; Drezet, J. M.; Simar, A.

2018-04-01

Aluminum alloy AA6061 was welded to dual-phase steel 980 (DP980) by the friction melt bonding (FMB) process. Hot tears have been suppressed by controlling the thermomechanical cycle. In particular, the welding speed and the thermal conductivity of the backing plate have been optimized. A finite-element thermomechanical model coupled with the Rappaz-Drezet-Gremaud (RDG) criterion has been used to explain these experimental observations. The hot tear susceptibility has been reduced with large thermal gradients and with the formation of a cellular microstructure. Both effects are favored by a backing plate made of a material with high thermal conductivity, such as copper.

Glass-bead peen plating

NASA Technical Reports Server (NTRS)

Graves, J. R.

1974-01-01

Peen plating of aluminum, copper, and nickel powders was investigated. Only aluminum was plated successfully within the range of peen plating conditions studied. Optimum plating conditions for aluminum were found to be: (1) bead/powder mixture containing 25 to 35% powder by weight, (2) peening intensity of 0.007A as measured by Almen strip, and (3) glass impact bead diameter of at least 297 microns (0.0117 inches) for depositing-100 mesh aluminum powder. No extensive cleaning or substrate preparation is required beyond removing loose dirt or heavy oil.

The Influence of Impurities and Metallic Capping Layers on the Microstructure of Copper Interconnects

NASA Astrophysics Data System (ADS)

Rizzolo, Michael

As copper interconnects have scaled to ever smaller dimensions on semiconductor devices, the microstructure has become increasingly detrimental for performance and reliability. Small grains persist in interconnects despite annealing at high temperatures, leading to higher line resistance and more frequent electromigration-induced failures. Conventionally, it was believed that impurities from the electrodeposition pinned grain growth, but limitations in analytical techniques meant the effect was inferred rather than observed. Recent advances in analytical techniques, however, have enabled this work to quantify impurity content, location, and diffusion in relation to microstructural changes in electroplated copper. Surface segregation of impurities during the initial burst of grain growth was investigated. After no surface segregation was observed, a microfluidic plating cell was constructed to plate multilayer films with regions of intentionally high and low impurity concentrations to determine if grain growth could be pinned by the presence of impurities; it was not. An alternate mechanism for grain boundary pinning based on the texture of the seed layer is proposed, supported by time-resolved transmission electron microscopy and transmission electron backscatter diffraction data. The suggested model posits that the seed in narrow features has no preferred orientation, which results in rapid nucleation of subsurface grains in trench regions prior to recrystallization from the overburden down. These rapidly growing grains are able to block off several trenches from the larger overburden grains, inhibiting grain growth in narrow features. With this knowledge in hand, metallic capping layers were employed to address the problematic microstructure in 70nm lines. The capping layers (chromium, nickel, zinc, and tin) were plated on the copper overburden prior to annealing to manipulate the stress gradient and microstructural development during annealing. It appeared that regardless of as-plated stress, nickel capping altered the recrystallized texture of the copper over patterned features. The nickel capping also caused a 2x increase in the number of advantageous 'bamboo' grains that span the entire trench, which effectively block electromigration pathways. These data provides a more fundamental understanding of manipulating the microstructure in copper interconnects using pre-anneal capping layers, and demonstrates a strategy to improve the microstructure beyond the capabilities of simple annealing.

Fixation of the stressed state of glass plates by coating them with thin films using a plasma focus installation

NASA Astrophysics Data System (ADS)

Kolokoltsev, V. N.; Degtiarev, V. F.; Borovitskaya, I. V.; Nikulin, V. Ya.; Peregudova, E. N.; Silin, P. V.; Eriskin, A. A.

2018-01-01

Elastic deformation in transparent mediums is usually studied by the photoelasticity method. For opaque mediums the method of film coating and strain gauge method are used. After the external load was removed, the interference pattern corresponding to elastic deformation of the material disappears. It is found that the elastic deformation state of the thin glass plate under the action of concentrated load can be fixed during the deposition of a thin metal film. Deposition of thin copper films was carried out by passing of plasma through the copper tube installed inside the Plasma Focus installation. After removing of the load, interference pattern on the glass plates was observed in the form of Newton’s rings and isogers in non-monochromatic light on the CCD scanners which uses uorescent lamps with cold cathode. It is supposed that the copper film fixes the relief of the surface of the glass plate at the time of deformation and saves it when the load is removed. In the case of a concentrated load, this relief has the shape of a thin lens of large radius. For this reason, the interference of coherent light rays in a thin air gap between the glass of the scanners atbed and the lens surface has the shape of Newton's rings. In this case, when scanning the back side of the plate, isogyres are observed. The presented method can be used in the analysis of the mechanical stress in a various optical elements.

Bitter-type magnet plate design with compound conductor of ultrahigh mechanical strength

DOE Office of Scientific and Technical Information (OSTI.GOV)

Haubenberger, W.D.

1981-01-01

A Bitter-type magnet plate design based on a compound conductor of ultrahigh mechanical strength is described. An explosion-bonded and cold-worked copper-austenite compound is jointed by a special procedure with a soft compound sheet.

Superhydrophobic coatings on wood substrate for self-cleaning and EMI shielding

NASA Astrophysics Data System (ADS)

Xing, Yingjie; Xue, Yaping; Song, Jinlong; Sun, Yankui; Huang, Liu; Liu, Xin; Sun, Jing

2018-04-01

A layer of superhydrophobic coating having good electromagnetic shielding and self-cleaning performance was fabricated on a wood surface through an electroless copper plated process. The superhydrophobic property of the wood surface was measured by contact angle (CA) and roll-off angle (RA) measurements. The microstructure and chemical composition of the superhydrophobic coating were analyzed by scanning electron microscopy (SEM), energy dispersive spectrometer (EDS) and X-ray diffraction (XRD). The analysis revealed that the microscale particles were uniformly distributed on the wood surface and the main component of the coating is metallic copper. The as-prepared Cu coatings on wood substrate exhibit a good superhydrophobicity with water contact angle about 160° and rolling angle less than 5°.

Laser direct writing of thin-film copper structures as a modification of lithographic processes

NASA Astrophysics Data System (ADS)

Meyer, F.; Ostendorf, A.; Stute, U.

2007-04-01

This paper presents a flexible, mask-free and efficient technique for UV-laser micropatterning of photosensitive resist by laser direct writing (LDW). Photo resist spun on gold sputtered silicon wafers has been laser structured by a scanner guided 266nm DPSSL and electroplated. Ablation behaviour and optimum seed layer preparation in relation to parameters like pulse energy, scanning speed and number of scanned cycles and the electroplating results are discussed. The resulting adhesive strength was measured by a µ-sear device and the gold seed layer-plated copper interface investigated by SEM and EDX to explain correlation to identified bonding behaviour. Improved adhesive strength was observed with higher laser pulse energy and reduced number of cycle.

Boron-doped diamond microdisc arrays: electrochemical characterisation and their use as a substrate for the production of microelectrode arrays of diverse metals (Ag, Au, Cu)via electrodeposition.

PubMed

Simm, Andrew O; Banks, Craig E; Ward-Jones, Sarah; Davies, Trevor J; Lawrence, Nathan S; Jones, Timothy G J; Jiang, Li; Compton, Richard G

2005-09-01

A novel boron-doped diamond (BDD) microelectrode array is characterised with electrochemical and atomic force microscopic techniques. The array consists of 40 micron-diameter sized BDD discs which are separated by 250 microns from their nearest neighbour in a hexagonal arrangement. The conducting discs can be electroplated to produce arrays of copper, silver or gold for analytical purposes in addition to operating as an array of BDD-microelectrodes. Proof-of-concept is shown for four separate examples; a gold plated array for arsenic detection, a copper plated array for nitrate analysis, a silver plated array for hydrogen peroxide monitoring and last, cathodic stripping voltammetry for lead at the bare BDD-array.

Direct write of copper-graphene composite using micro-cold spray

DOE Office of Scientific and Technical Information (OSTI.GOV)

Dardona, Sameh, E-mail: dardona@utrc.utc.com; She, Ying; Schmidt, Wayde R.

Direct write of a new class of composite materials containing copper and graphene in the powder phase is described. The composite was synthesized using batch electroless plating of copper for various times onto Nano Graphene Platelets (NGP) to control the amount of copper deposited within the loosely aggregated graphene powder. Copper deposition was confirmed by both Focused Ion Beam (FIB) and Auger electron spectroscopic analysis. A micro-cold spray technique was used to deposit traces that are ∼230 μm wide and ∼5 μm thick of the formulated copper/graphene powder onto a glass substrate. The deposited traces were found to have goodmore » adhesion to the substrate with ∼65x the copper bulk resistivity.« less

Thermal conductance measurements of bolted copper joints for SuperCDMS

DOE Office of Scientific and Technical Information (OSTI.GOV)

Schmitt, R.; Tatkowski, Greg; Ruschman, M.

2015-09-01

Joint thermal conductance testing has been undertaken for bolted copper to copper connections from 60 mK to 26 K. This testing was performed to validate an initial design basis for the SuperCDMS experiment, where a dilution refrigerator will be coupled to a cryostat via multiple bolted connections. Copper used during testing was either gold plated or passivated with citric acid to prevent surface oxidation. Results obtained are well fit by a power law regression of joint thermal conductance to temperature and match well with data collected during a literature review.

[Study on physical properties of titanium alloy sample fabricated with vacuum-sintered powder metallurgy].

PubMed

Ding, X; Liang, X; Chao, Y; Han, X

2000-06-01

To investigate the physical properties of titanium alloy fabricated with vacuum-sintered powder metallurgy. The titanium powders of three different particle sizes(-160mesh, -200 - +300mesh, -300mesh) were selected, and mixed with copper and aluminum powder in different proportions. Two other groups were made up of titanium powder(-200 - +300mesh) plated with copper and tin. The build-up and, condensation method and a double-direction press with a metal mold were used. The green compacts were sintered at 1000 degrees C for 15 minutes in a vacuum furnace at 0.025 Pa. In the double-direction press, the specimens were compacted at the pressure of 100 MPa, 200 MPa and 300 MPa respectively. Then the linear shrinkage ratio and the opening porosity of the sintered compacts were evaluated respectively. 1. The linear shrinkage ratio of specimens decreased with the increased compacted pressure(P < 0.05). There was no significant difference among the linear shrinkage ratios of three different titanium powders at the same compacted pressure(P > 0.05), but that of titanium powder plated with copper and tin was higher than those of other specimens without plating(P < 0.05). 2. The opening porosity of specimens decreased with the increased compacted pressure(P < 0.05). Three different sized particle of titanium powder did not affect the opening porosity at the same compacted pressure(P > 0.05). The composition of titanium-based metal powder mixtures and the compacted pressures affect the physical properties of sintered compacts. Titanium powder plated with copper and tin is compacted and sintered easily, and the physical properties of sintered compacts are greatly improved.

Large-displacement structural durability analyses of simple bend specimen emulating rocket nozzle liners

NASA Technical Reports Server (NTRS)

Arya, Vinod K.; Halford, Gary R.

1994-01-01

Large-displacement elastic and elastic-plastic, finite-element stress-strain analyses of an oxygen-tree high-conductivity (OFHC) copper plate specimen were performed using an updated Lagrangian formulation. The plate specimen is intended for low-cost experiments that emulate the most important thermomechanical loading and failure modes of a more complex rocket nozzle. The plate, which is loaded in bending at 593 C, contains a centrally located and internally pressurized channel. The cyclic crack initiation lives were estimated using the results from the analyses and isothermal strain-controlled low-cycle fatigue data for OFHC copper. A comparison of the predicted and experimental cyclic lives showed that an elastic analysis predicts a longer cyclic life than that observed in experiments by a factor greater than 4. The results from elastic-plastic analysis for the plate bend specimen, however, predicted a cyclic life in close agreement with experiment, thus justifying the need for the more rigorous stress-strain analysis.

Improved Cloud Condensation Nucleus Spectrometer

NASA Technical Reports Server (NTRS)

Leu, Ming-Taun

2010-01-01

An improved thermal-gradient cloud condensation nucleus spectrometer (CCNS) has been designed to provide several enhancements over prior thermal- gradient counters, including fast response and high-sensitivity detection covering a wide range of supersaturations. CCNSs are used in laboratory research on the relationships among aerosols, supersaturation of air, and the formation of clouds. The operational characteristics of prior counters are such that it takes long times to determine aerosol critical supersaturations. Hence, there is a need for a CCNS capable of rapid scanning through a wide range of supersaturations. The present improved CCNS satisfies this need. The improved thermal-gradient CCNS (see Figure 1) incorporates the following notable features: a) The main chamber is bounded on the top and bottom by parallel thick copper plates, which are joined by a thermally conductive vertical wall on one side and a thermally nonconductive wall on the opposite side. b) To establish a temperature gradient needed to establish a supersaturation gradient, water at two different regulated temperatures is pumped through tubes along the edges of the copper plates at the thermally-nonconductive-wall side. Figure 2 presents an example of temperature and supersaturation gradients for one combination of regulated temperatures at the thermally-nonconductive-wall edges of the copper plates. c) To enable measurement of the temperature gradient, ten thermocouples are cemented to the external surfaces of the copper plates (five on the top plate and five on the bottom plate), spaced at equal intervals along the width axis of the main chamber near the outlet end. d) Pieces of filter paper or cotton felt are cemented onto the interior surfaces of the copper plates and, prior to each experimental run, are saturated with water to establish a supersaturation field inside the main chamber. e) A flow of monodisperse aerosol and a dilution flow of humid air are introduced into the main chamber at the inlet end. The inlet assembly is designed to offer improved (relative to prior such assemblies) laminar-flow performance within the main chamber. Dry aerosols are subjected to activation and growth in the supersaturation field. f) After aerosol activation, at the outlet end of the main chamber, a polished stainless-steel probe is used to sample droplets into a laser particle counter. The probe features an improved design for efficient sampling. The counter has six channels with size bins in the range of 0.5- to 5.0-micron diameter. g) To enable efficient sampling, the probe is scanned along the width axis of the main chamber (thereby effecting scanning along the temperature gradient and thereby, further, effecting scanning along the supersaturation gradient) by means of a computer-controlled translation stage.

Ultrasound influence on the activation step before electroless coating.

PubMed

Touyeras, F; Hihn, J Y; Delalande, S; Viennet, R; Doche, M L

2003-10-01

This paper is devoted to the electroless plating of non-conductive substrates under ultrasound at 530 kHz. The ultrasonic irradiation is applied to the activation and to the plating steps. Effects are measured by following the final copper thickness obtained in 1 h of plating time, easily correlated to the average plating rate. It appears that ultrasound has a strong influence on the plating rates enhancement, and assumptions can be made that this increase could be linked to the catalyst cleaning. This is confirmed by XPS measurements.

Optimization of reaction parameters in hydrothermal synthesis: a strategy towards the formation of CuS hexagonal plates

PubMed Central

2013-01-01

Background For decades, copper sulphide has been renowned as the superior optical and semiconductor materials. Its potential applications can be ranged from solar cells, lithium-ion batteries, sensors, and catalyst systems. The synthesis methodologies of copper sulphide with different controlled morphology have been widely explored in the literature. Nevertheless, the understanding on the formation chemistry of CuS is still limited. The ultimate approach undertaking in this article is to investigate the formation of CuS hexagonal plates via the optimization of reaction parameters in hydrothermal reaction between copper (II) nitrate and sodium thiosulphate without appending any assistant agent. Results Covellite (CuS) hexagonal plates were formed at copper ion: thiosulphate ion (Cu2+:S2O32−) mole ratio of 1:2 under hydrothermal treatment of 155°C for 12 hours. For synthesis conducted at reaction temperature lower than 155°C, copper sulphate (CuSO4), krohnite (NaCu2(SO4)(H2O)2] and cyclooctasulphur (S8) were present as main impurities with covellite (CuS). When Cu2+:S2O32− mole ratio was varied to 1: 1 and 1: 1.5, phase pure plate-like natrochalcite [NaCu2(SO4)(H2O)] and digenite (Cu9S5) were produced respectively. Meanwhile, mixed phases of covellite (CuS) and cyclooctasulphur (S8) were both identified when Cu2+:S2O32− mole ratio was varied to 1: 2.5, 1: 3 and 1: 5 as well as when reaction time was shortened to 1 hour. Conclusions CuS hexagonal plates with a mean edge length of 1 μm, thickness of 100 nm and average crystallite size of approximately (45 ± 2) nm (Scherrer estimation) were successfully synthesized via assisting agent- free hydrothermal method. Under a suitable Cu2+:S2O32− mole ratio, we evidenced that the formation of covellite (CuS) is feasible regardless of the reaction temperature applied. However, a series of impurities were attested with CuS if reaction temperature was not elevated high enough for the additional crystallite phase decomposition. It was also identified that Cu2+:S2O32− mole ratio plays a vital role in controlling the amount of cyclooctasulphur (S8) in the final powder obtained. Finally, reaction time was recognized as an important parameter in impurity decomposition as well as increasing the crystallite size and crystallinity of the CuS hexagonal plates formed. PMID:23575312

Nanostructured copper-coated solid-phase microextraction fiber for gas chromatographic analysis of dibutyl phthalate and diethylhexyl phthalate environmental estrogens.

PubMed

Feng, Juanjuan; Sun, Min; Bu, Yanan; Luo, Chuannan

2015-01-01

A novel nanostructured copper-based solid-phase microextraction fiber was developed and applied for determining the two most common types of phthalate environmental estrogens (dibutyl phthalate and diethylhexyl phthalate) in aqueous samples, coupled to gas chromatography with flame ionization detection. The copper film was coated onto a stainless-steel wire via an electroless plating process, which involved a surface activation process to improve the surface properties of the fiber. Several parameters affecting extraction efficiency such as extraction time, extraction temperature, ionic strength, desorption temperature, and desorption time were optimized by a factor-by-factor procedure to obtain the highest extraction efficiency. The as-established method showed wide linear ranges (0.05-250 μg/L). Precision of single fiber repeatability was <7.0%, and fiber-to-fiber repeatability was <10%. Limits of detection were 0.01 μg/L. The proposed method exhibited better or comparable extraction performance compared with commercial and other lab-made fibers, and excellent thermal stability and durability. The proposed method was applied successfully for the determination of model analytes in plastic soaking water. © 2014 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

Investigation of reliability attributes and accelerated stress factors on terrestrial solar cells

NASA Technical Reports Server (NTRS)

Lathrop, J. W.

1982-01-01

The accelerated stress test results obtained on all terrestrial solar cells since the inception of the program are summarized. Tested cells were grouped according to the method used to form the conductive metallization layer: solder dipped, vacuum deposited, screen printed, and copper plated. Although metallization systems within each group were quite similar, they differed in numerous details according to the procedures employed by each manufacturer. Test results were summarized for all cells according to both electrical degradation and catastrophic mechanical changes. These results indicated a variability within each metallization category which was dependent on the manufacturer. Only one manufacturer was represented in the copper plated category and, although these showed no signs of detrimental copper diffusion during high temperature testing, their metallization was removed easily during high humidity pressure cooker testing. Preliminary testing of encapsulated cells showed no major differences between encapsulated and unencapsulated cells when subjected to accelerated testing.

Synthesis of Copper Pigments, Malachite and Verdigris: Making Tempera Paint

ERIC Educational Resources Information Center

Solomon, Sally D.; Rutkowsky, Susan A.; Mahon, Megan L.; Halpern, Erica M.

2011-01-01

Malachite and verdigris, two copper-based pigments, are synthesized in this experiment intended for use in a general chemistry laboratory. The preparation of egg tempera paint from malachite is also described. All procedures can be done with a magnetic stir plate, standard glassware present in any first-year laboratory, and household chemicals.…

High resolution, low cost solar cell contact development

NASA Technical Reports Server (NTRS)

Mardesich, N.

1979-01-01

The experimental work demonstrating the feasibility of the MIDFILM process as a low cost means of applying solar cell collector metallization as reported. Cell efficiencies of above 14% (AMl, 28 C) were achieved with fritted silver metallization. Environmental tests suggest that the metallization is slightly humidity sensitive and degradation is observed on cells with high series resistance. The major yield loss in the fabrication of cells was due to discontinuous grid lines, resulting in high series resitance. Standard lead-tin solder plated interconnections do not appear compatible with the MIDFILM contact. Copper, nickel and molybdemun base powder were investigated as low cost metallization systems. The copper based powder degraded the cell response. The nickel and molybdenum base powders oxidized when sintered in the oxidizing atmosphere necessary to ash the photoresin.

Modeling and Implementation of Solder-activated Joints for Single Actuator, Centimeter-Scale Robotic Mechanisms

DTIC Science & Technology

2010-06-01

Modulus Ratio Annealed Copper 1.0 1.0 1.0 6066 Aluminum 0.63 2.48 3.96 High-Temp Nitinol 0.68 16.8 24.7 1095 Spring Steel 1.82 16.5 9.08 106 5.2.2...were: copper, aluminum, Nitinol , and spring steel. The wetting ability of aluminum and Nitinol to lead-tin solders is poor. There are solders that have...32],[33]. Copper plating may be used to improve a material’s solderability. Nitinol and aluminum are not easily electroplated with copper. Steel and

Thermal conductance measurements of bolted copper joints for SuperCDMS

DOE PAGES

Schmitt, R. L.; Tatkowski, G.; Ruschman, M.; ...

2015-04-28

Joint thermal conductance testing has been undertaken for bolted copper to copper connections from 60 mK to 26 K. This testing was performed to validate an initial design basis for the SuperCDMS experiment, where a dilution refrigerator will be coupled to a cryostat via multiple bolted connections. Copper used during testing was either gold plated or passivated with citric acid to prevent surface oxidation. Finally, the results we obtained are well fit by a power law regression of joint thermal conductance to temperature and match well with data collected during a literature review.

Libbey-Owens-Ford solar collector static load test

NASA Technical Reports Server (NTRS)

1978-01-01

The test article is a flat plate solar collector that uses liquid as the heat transfer medium. The absorber plate is copper and has a double tempered glass cover. Test requirements and procedures are described and results are presented in a table. Results demonstrate that the collector performed satisfactorily.

Thermal treatment and mechanical properties of aluminum-2021

NASA Technical Reports Server (NTRS)

Brennecke, M. W.

1970-01-01

Mechanical properties, after thermal treatments, are summarized for sheet and plate of copper-rich, high-strength, heat-treatable aluminum-2021. The alloy is quench sensitive, quench rate and variations in aging affect corrosion behavior. Aging effects on yield strength, tensile strength, and elongation of sheet and plate are compared.

Pretinning Nickel-Plated Wire Shields

NASA Technical Reports Server (NTRS)

Igawa, J. A.

1985-01-01

Nickel-plated copper shielding for wires pretinned for subsequent soldering with help of activated rosin flux. Shield cut at point 0.25 to 0.375 in. (6 to 10 mm) from cut end of outer jacket. Loosened end of shield straightened and pulled toward cut end. Insulation of inner wires kept intact during pretinning.

Bitter-type toroidal field magnet for zephyr

DOE Office of Scientific and Technical Information (OSTI.GOV)

Nathrath, N.; Keinath, W.; Kobusch, W.

1981-09-01

A feasibility study concerning stress computations, design and material technology of a Bitter-type magnet for the ZEPHYR project conducted in West Germany is reported. The big overall dimensions of the magnet (6.50 m diam 2.80 m high), access for diagnostics and neutral injection (16 ports), the possibility of remote handling of activated parts and high forces form the main requirements for design and material. A design with 16 identical modules (coils) was chosen, each coil consisting of 16 Bitter plates, plate housings and one diagnostic/neutral injection wedge. The structural parts are connected by bolts and form the bending stiff structuremore » of the magnet. The most critical area of the magnet is the inner wedge-shaped part of the coils (''throat area'') with extremely high tension, compression and shear stress values, to which temperature effects contribute heavily. Steel-copper compounds are found to be the best Bitter-plate materials. Copper-plating austenitic steel can be done galvanically or by explosive techniques. Cold-worked austenitic steels fulfil the requirements in the throat, in the flat-plate region milder steels can be used. Different plate concepts are being considered. Plasma-sprayed Al/sub 2/O/sub 3//TiO/sub 2/ and reinforced epoxy layers are provided as insulating materials in different magnet areas.« less

The Effect of Cu Powder During Friction Stir Welding on Microstructure and Mechanical Properties of AA3003-H18

NASA Astrophysics Data System (ADS)

Abnar, B.; Kazeminezhad, M.; Kokabi, A. H.

2014-08-01

Friction stir welding (FSW) was used to join 3003-H18 non-heat-treatable aluminum alloy plates by adding copper powder. The copper powder was first added to the gap (0.1 and 0.2 mm) between two plates and then the FSW was performed. The specimens were joined at various rotational speeds of 800, 1000, and 1200 rpm at traveling speeds of 70 and 100 mm/min. The effects of rotational speed, second pass of FSW, and direction of second pass also were studied on copper particle distribution and formation of Al-Cu intermetallic compounds in the stir zone. The second pass of FSW was carried out in two ways; in line with the first pass direction (2F) and in the reverse direction of the first pass (FB). The microstructure, mechanical properties, and formation of intermetallic compounds type were investigated. In high copper powder compaction into the gap, large clusters were formed in the stir zone, while fine clusters and sound copper particles distribution were obtained in low powder compaction. The copper particle distribution and amount of Al-Cu intermetallic compounds were increased in the stir zone with increasing the rotational speed and applying the second pass. Al2Cu and AlCu intermetallic phases were formed in the stir zone and consequently the hardness was significantly increased. The copper particles and in situ intermetallic compounds were symmetrically distributed in both advancing and retreating sides of weld zone after FB passes. Thus, the wider area was reinforced by the intermetallic compounds. Also, the tensile test specimens tend to fracture from the coarse copper aggregation at the low rotational speeds. At high rotational speeds, the fracture locations are placed in HAZ and TMAZ.

Multi-dimensional modeling of atmospheric copper-sulfidation corrosion on non-planar substrates.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Chen, Ken Shuang

2004-11-01

This report documents the author's efforts in the deterministic modeling of copper-sulfidation corrosion on non-planar substrates such as diodes and electrical connectors. A new framework based on Goma was developed for multi-dimensional modeling of atmospheric copper-sulfidation corrosion on non-planar substrates. In this framework, the moving sulfidation front is explicitly tracked by treating the finite-element mesh as a pseudo solid with an arbitrary Lagrangian-Eulerian formulation and repeatedly performing re-meshing using CUBIT and re-mapping using MAPVAR. Three one-dimensional studies were performed for verifying the framework in asymptotic regimes. Limited model validation was also carried out by comparing computed copper-sulfide thickness with experimentalmore » data. The framework was first demonstrated in modeling one-dimensional copper sulfidation with charge separation. It was found that both the thickness of the space-charge layers and the electrical potential at the sulfidation surface decrease rapidly as the Cu{sub 2}S layer thickens initially but eventually reach equilibrium values as Cu{sub 2}S layer becomes sufficiently thick; it was also found that electroneutrality is a reasonable approximation and that the electro-migration flux may be estimated by using the equilibrium potential difference between the sulfidation and annihilation surfaces when the Cu{sub 2}S layer is sufficiently thick. The framework was then employed to model copper sulfidation in the solid-state-diffusion controlled regime (i.e. stage II sulfidation) on a prototypical diode until a continuous Cu{sub 2}S film was formed on the diode surface. The framework was also applied to model copper sulfidation on an intermittent electrical contact between a gold-plated copper pin and gold-plated copper pad; the presence of Cu{sub 2}S was found to raise the effective electrical resistance drastically. Lastly, future research needs in modeling atmospheric copper sulfidation are discussed.« less

Electronically conducting polymers with silver grains

NASA Technical Reports Server (NTRS)

Murphy, Oliver J. (Inventor); Hitchens, G. Duncan (Inventor); Hodko, Dolibor (Inventor)

1999-01-01

The present invention provides electronically conducting polymer films formed from photosensitive formulations of pyrrole and an electron acceptor that have been selectively exposed to UV light, laser light, or electron beams. The formulations may include photoinitiators, flexibilizers, solvents and the like. These solutions can be used in applications including printed circuit boards and through-hole plating and enable direct metallization processes on non-conducting substrates. After forming the conductive polymer patterns, a printed wiring board can be formed by sensitizing the polymer with palladium and electrolytically depositing copper.

Morphology of gold and copper ion-plated coatings

NASA Technical Reports Server (NTRS)

Spalvins, T.

1978-01-01

Copper and gold films (0.2 to 2 microns thick) were ion plated onto polished 304-stainless-steel, glass, mica surfaces. These coatings were examined by SEM for defects in their morphological growth. Three types of defects were distinguished: nodular growth, abnormal or runaway growth, and spits. The cause for each type of defect was investigated. Nodular growth is due to inherent substrate microdefects, abnormal or runaway growth is due to external surface inclusions, and spits are due to nonuniform evaporation (ejection of droplets). All these defects induce stresses and produce porosity in the coatings and thus weaken their mechanical properties. During surface rubbing, large nodules are pulled out, leaving vacancies in the coatings.

Development of a highly reliable composite board for printed circuitry for use in space environment

NASA Technical Reports Server (NTRS)

Bradbury, E. J.; Markle, R. A.; Dunnavant, W. R.; Stickney, P. B.

1971-01-01

Materials, processes and fabrication techniques have been investigated for the development of a high-temperature circuit-board laminate. High quality, void-free copper-clad laminates have been made using 7628/HS-1 style fiberglas reinforcements with filled polyimide matrices. The fabricating characteristics of P13N resin appear suitable for use as a filled matrix in this circuit board development. High-fired, ball-milled alumina appears to be necessary to obtain the desired effects in the circuit board system. Nickel-clad copper foil bonding surfaces appear to be another requirement for retention of good bond strengths after art work and plating sequences. The fabrication cycle for this circuit board system is very dependent on the heating profile. Very rapid heating with quick loading is recommended. A stack approach to lamination was successfully used.

Metal Alloy ICF Capsules Created by Electrodeposition

DOE Office of Scientific and Technical Information (OSTI.GOV)

Horwood, Corie; Stadermann, Michael; Bunn, Thomas L.

Electrochemical deposition is an attractive alternative to physical vapor deposition and micromachining to produce metal capsules for inertial confinement fusion (ICF). Electrochemical deposition (also referred to as electrodeposition or plating) is expected to produce full-density metal capsules without seams or inclusions of unwanted atomic constituents, the current shortcomings of micromachine and physical vapor deposition, respectively. In this paper, we discuss new cathode designs that allow for the rapid electrodeposition of gold and copper alloys on spherical mandrels by making transient contact with the constantly moving spheres. Electrodeposition of pure gold, copper, platinum, and alloys of gold-copper and gold-silver are demonstrated,more » with nonporous coatings of >40 µm achieved in only a few hours of plating. The surface roughness of the spheres after electrodeposition is comparable to the starting mandrel, and the coatings appear to be fully dense with no inclusions. A detailed understanding of the electrodeposition conditions that result in different alloy compositions and plating rates will allow for the electrodeposition of graded alloys on spheres in the near future. Finally, this report on the electrodeposition of metals on spherical mandrels is an important first step toward the fabrication of graded-density metal capsules for ICF experiments at the National Ignition Facility.« less

Metal Alloy ICF Capsules Created by Electrodeposition

DOE PAGES

Horwood, Corie; Stadermann, Michael; Bunn, Thomas L.

2017-12-04

Electrochemical deposition is an attractive alternative to physical vapor deposition and micromachining to produce metal capsules for inertial confinement fusion (ICF). Electrochemical deposition (also referred to as electrodeposition or plating) is expected to produce full-density metal capsules without seams or inclusions of unwanted atomic constituents, the current shortcomings of micromachine and physical vapor deposition, respectively. In this paper, we discuss new cathode designs that allow for the rapid electrodeposition of gold and copper alloys on spherical mandrels by making transient contact with the constantly moving spheres. Electrodeposition of pure gold, copper, platinum, and alloys of gold-copper and gold-silver are demonstrated,more » with nonporous coatings of >40 µm achieved in only a few hours of plating. The surface roughness of the spheres after electrodeposition is comparable to the starting mandrel, and the coatings appear to be fully dense with no inclusions. A detailed understanding of the electrodeposition conditions that result in different alloy compositions and plating rates will allow for the electrodeposition of graded alloys on spheres in the near future. Finally, this report on the electrodeposition of metals on spherical mandrels is an important first step toward the fabrication of graded-density metal capsules for ICF experiments at the National Ignition Facility.« less

Activity of two strobilurin fungicides against three species of decay fungi in agar plate tests

Treesearch

Juliet D. Tang; Tina Ciaramitaro; Maria Tomaso-Peterson; Susan V. Diehl

2017-01-01

The objective of this study was to examine the toxicity of strobilurin fungicides against wood decay fungi in order to assess their potential to act as a co-biocide for copper-based wood protection. Two strobilurin fungicides, Heritage (50% azoxystrobin active ingredient) and Insignia (20% pyraclostrobin active ingredients), and copper sulfate pentahydrate were tested...

Manipulator having thermally conductive rotary joint for transferring heat from a test specimen

DOEpatents

Haney, Steven J.; Stulen, Richard H.; Toly, Norman F.

1985-01-01

A manipulator for rotatably moving a test specimen in an ultra-high vacuum chamber includes a translational unit movable in three mutually perpendicular directions. A manipulator frame is rigidly secured to the translational unit for rotatably supporting a rotary shaft. A first copper disc is rigidly secured to an end of the rotary shaft for rotary movement within the vacuum chamber. A second copper disc is supported upon the first disc. The second disc receives a cryogenic cold head and does not rotate with the first disc. A sapphire plate is interposed between the first and second discs to prevent galling of the copper material while maintaining high thermal conductivity between the first and second discs. A spring is disposed on the shaft to urge the second disc toward the first disc and compressingly engage the interposed sapphire plate. A specimen mount is secured to the first disc for rotation within the vacuum chamber. The specimen maintains high thermal conductivity with the second disc receiving the cryogenic transfer line.

Study on Properties of CoNi Films with mn Doping Prepared by Magnetic Fields Induced Codeposition Technology

NASA Astrophysics Data System (ADS)

Gang, Liang; Yu, Yundan; Ge, Hongliang; Wei, Guoying; Jiang, Li; Sun, Lixia

Magnetic field parallel to electric field was induced during plating process to prepare CoNiMn alloy films on copper substrate. Electrochemistry mechanism and properties of CoNiMn alloy films were investigated in this paper. Micro magnetohydrodynamic convection phenomenon caused by vertical component of current density and parallel magnetic field due to deformation of current distribution contributed directly to the improvement of cathode current and deposition rate. Cathode current of the CoNiMn plating system increased about 30% with 1T magnetic field induced. It was found that CoNiMn films electrodeposited with magnetic fields basically belonged to a kind of progressive nucleation mode. Higher magnetic intensity intended to obtain CoNiMn films with good crystal structures and highly preferred orientations. With the increase of magnetic intensities, surface morphology of CoNiMn alloy films changed from typically nodular to needle-like structures. Compared with coatings electrodeposited without magnetic field, CoNiMn alloy films prepared with magnetic fields possessed better magnetic properties. Coercivity, remanence and saturation magnetization of samples increased sharply when 1T magnetic field was induced during plating process.

Standardized performance tests of collectors of solar thermal energy - A flat-plate copper collector with parallel mylar striping

NASA Technical Reports Server (NTRS)

Johnson, S. M.

1976-01-01

Basic test results are reported for a flat plate solar collector whose performance was determined in a solar simulator. The collector was tested over ranges of inlet temperatures, fluxes and one coolant flow rate. Collector efficiency is correlated in terms of inlet temperature and flux level.

Effect of anode material on the breakdown in low-pressure helium gas

NASA Astrophysics Data System (ADS)

Demidov, V. I.; Adams, S. F.; Kudryavtsev, A. A.; Kurlyandskaya, I. P.; Miles, J. A.; Tolson, B. A.

2017-10-01

The electric breakdown of gases is one of the fundamental phenomena of gas discharge physics. It has been studied for a long time but still attracts incessant interest of researchers. Besides the interesting physics, breakdown is important for many applications including development of reliable electric insulation in electric grids and the study of different aspects of gas discharge physics. In this work an experimental study of the electric breakdown in helium gas for the plane-parallel electrode configuration has been conducted using a copper cathode and a variety of anode materials: copper, aluminum, stainless steel, graphite, platinum-plated aluminum and gold-plated aluminum. According to the Paschen law for studied electrode configuration, the breakdown voltage is a function of the product of gas pressure and inter-electrode gap. The breakdown processes on the left, lower pressure side of the Paschen curve have been the subject of this investigation. For those pressures, the Paschen curve may become multi-valued, where any given pressure corresponds to three breakdown voltage values. It was experimentally demonstrated that the form of the Paschen curve might strongly depend on the material of the anode and the cleanness of the anode surface. A possible explanation for this phenomenon is that electrons streaming from the cathode are reflected by the surface of the anode.

Influences of surface hydrophilicity on frost formation on a vertical cold plate under natural convection conditions

DOE Office of Scientific and Technical Information (OSTI.GOV)

Liu, Zhongliang; Zhang, Xinghua; Wang, Hongyan

2007-07-15

Surface hydrophilicity has a strong influence on frost nucleation according to phase transition theory. To study this effect, a close observation of frost formation and deposition processes on a vertical plate was made under free convection conditions. The formation and shape variation of frost crystals during the initial period are described and the frost thickness variation with time on both hydrophobic and plain copper cold surfaces are presented. The various influencing factors are discussed in depth. The mechanism of surface hydrophilicity influence on frost formation was analyzed theoretically. This revealed that increasing the contact angle can increase the potential barriermore » and restrain crystal nucleation and growth and thus frost deposition. The experimental results show that the initial water drops formed on a hydrophobic surface are smaller and remain in the liquid state for a longer time compared with ones formed on a plain copper surface. It is also observed that the frost layer deposited on a hydrophobic surface is loose and weak. Though the hydrophobic surface can retard frost formation to a certain extent and causes a looser frost layer, our experimental results show that it does not depress the growth of the frost layer. (author)« less

Process for the Production of Star Tracklng [Tracking] Reticles

NASA Technical Reports Server (NTRS)

Smith, Wade O. (Inventor); Toft, Albert R. (Inventor)

1972-01-01

A method for the production of reticles, particularly those for use in outer space, wherein the product is a quartz base coated with highly adherent layers of chromium, chromium-silver, and silver vacuum deposited through a mask, and then coated with an electrodeposit of copper from a copper sulfate solution followed by an electrodeposit of black chromium. The masks are produced by coating a beryllium-copper alloy substrate with a positive working photoresist, developing the photoresist according to a pattern to leave a positive mask, plating uncoated areas with gold, removing the photoresist, coating the substrate with a negative working photoresist, developing the negative working photoresist to expose the base metal of the pattern, and chemically etching the unplated side of the pattern to produce the mask. The mask produced is then used in the vacuum deposition of: (1) chromium metal on the surface of a quartz base to obtain a highly adherent quartz-chromium interface; (2) silver on the chromium deposit, during the final stage of chromium deposit, to produce a silver chromium alloy layer; and (3) silver onto the surface of the alloy layer. The coated quartz base is then coated by electroplating utilizing an acid copper deposit followed by a black chromium electrodeposit to produce the product of the present invention.

Microplate-reader method for the rapid analysis of copper in natural waters with chemiluminescence detection.

PubMed

Durand, Axel; Chase, Zanna; Remenyi, Tomas; Quéroué, Fabien

2012-01-01

We have developed a method for the determination of copper in natural waters at nanomolar levels. The use of a microplate-reader minimizes sample processing time (~25 s per sample), reagent consumption (~120 μL per sample), and sample volume (~700 μL). Copper is detected by chemiluminescence. This technique is based on the formation of a complex between copper and 1,10-phenanthroline and the subsequent emission of light during the oxidation of the complex by hydrogen peroxide. Samples are acidified to pH 1.7 and then introduced directly into a 24-well plate. Reagents are added during data acquisition via two reagent injectors. When trace metal clean protocols are employed, the reproducibility is generally less than 7% on blanks and the detection limit is 0.7 nM for seawater and 0.4 nM for freshwater. More than 100 samples per hour can be analyzed with this technique, which is simple, robust, and amenable to at-sea analysis. Seawater samples from Storm Bay in Tasmania illustrate the utility of the method for environmental science. Indeed other trace metals for which optical detection methods exist (e.g., chemiluminescence, fluorescence, and absorbance) could be adapted to the microplate-reader.

Bacteria cut by 'up to 95%' in copper trial.

PubMed

2008-11-01

The first results from an 18-month trial at Birmingham's Selly Oak Hospital, which has seen a range of items in one ward, including taps, door handles, sink fittings, push plates and light switches made from "conventional" plastic and stainless steel materials substituted with copper replacements, has proven beyond doubt the metal's effectiveness in destroying pathogens in a clinical environment. Health Estate Journal reports.

Polyimide-glass multilayer printed wiring boards

NASA Astrophysics Data System (ADS)

Lula, J. W.

1984-07-01

Multilayer printed wiring boards (PWBs) from a polyimide/glass reinforced copper clad laminate and prepreg were manufactured. A lamination cycle and innerlayer copper surface treatment that gave satisfactory delamination resistance at soldering temperatures were developed. When compared to similar epoxy/glass multilayer PWBs, the polyimide PWBs had higher thermal stability, greater resistance to raised lands, fewer plating voids, less outgassing, and adhesion that was equivalent to urethane foam encapsulants.

iMAST Quarterly, Number 3, 2000

DTIC Science & Technology

2000-01-01

components which depend on evaporating unit capabilities. There are three components (EB-gun, water cooled copper crucible and vacuum chamber) in the EB-PVD...Ion Implantation and Ion Plating electromagnetic deflected through 180 or 2700. Similarly, evaporant material is placed in a water-cooled copper ... crucible , which could be either pocket type for small quantity evaporation application or continuous ingot feeding through the crucible for larger quantity

Potential use of copper surfaces to reduce survival of epidemic meticillin-resistant Staphylococcus aureus in the healthcare environment.

PubMed

Noyce, J O; Michels, H; Keevil, C W

2006-07-01

Epidemic meticillin-resistant Staphylococcus aureus (EMRSA) emerged in the early 1980s with EMRSA-15 and -16 being the most prevalent strains within the UK. MRSA transmission between patients is largely via the hands of healthcare workers, and contamination of the hospital environment may occur. The objective of this study was to evaluate the effectiveness of copper and brass to reduce the viability of air-dried deposits of three MRSA strains [MRSA (NCTC 10442), EMRSA-1 (NCTC 11939) and EMRSA-16 (NCTC 13143)] compared with stainless steel. MRSA and EMRSA [10(7)colony-forming units (CFU)] were inoculated on to coupons (1 cm x 1 cm) of copper, brass or stainless steel and incubated at either 22 degrees C or 4 degrees C for various time periods. Viability was determined by resuspending removed CFUs and plating out on tryptone soy agar plates in addition to staining with the respiratory indicator fluorochrome 5-cyano-2,3-ditolyl tetrazolium. On pure copper surfaces, 10(7) MRSA, EMRSA-1 and EMRSA-16 were completely killed after 45, 60 and 90 min, respectively, at 22 degrees C. In contrast, viable organisms for all three strains were detected on stainless steel (grade 304) after 72 h at 22 degrees C. At 4 degrees C, complete kill was achieved on copper for all three strains within 6 h. The results demonstrate an antimicrobial effect of copper on MRSA, EMRSA-1 and -16 in contrast to stainless steel. Consequently, the contemporary application of stainless steel in hospital environments for work surfaces and door furniture is not recommended.

Thermal conductivity and thermal expansion of graphite fiber/copper matrix composites

NASA Technical Reports Server (NTRS)

Ellis, David L.; Mcdanels, David L.

1991-01-01

The high specific conductivity of graphite fiber/copper matrix (Gr/Cu) composites offers great potential for high heat flux structures operating at elevated temperatures. To determine the feasibility of applying Gr/Cu composites to high heat flux structures, composite plates were fabricated using unidirectional and cross-plied pitch-based P100 graphite fibers in a pure copper matrix. Thermal conductivity of the composites was measured from room temperature to 1073 K, and thermal expansion was measured from room temperature to 1050 K. The longitudinal thermal conductivity, parallel to the fiber direction, was comparable to pure copper. The transverse thermal conductivity, normal to the fiber direction, was less than that of pure copper and decreased with increasing fiber content. The longitudinal thermal expansion decreased with increasing fiber content. The transverse thermal expansion was greater than pure copper and nearly independent of fiber content.

Thermal conductivity and thermal expansion of graphite fiber-reinforced copper matrix composites

NASA Technical Reports Server (NTRS)

Ellis, David L.; Mcdanels, David L.

1993-01-01

The high specific conductivity of graphite fiber/copper matrix (Gr/Cu) composites offers great potential for high heat flux structures operating at elevated temperatures. To determine the feasibility of applying Gr/Cu composites to high heat flux structures, composite plates were fabricated using unidirectional and cross-plied pitch-based P100 graphite fibers in a pure copper matrix. Thermal conductivity of the composites was measured from room temperature to 1073 K, and thermal expansion was measured from room temperature to 1050 K. The longitudinal thermal conductivity, parallel to the fiber direction, was comparable to pure copper. The transverse thermal conductivity, normal to the fiber direction, was less than that of pure copper and decreased with increasing fiber content. The longitudinal thermal expansion decreased with increasing fiber content. The transverse thermal expansion was greater than pure copper and nearly independent of fiber content.

Directional emittance surface measurement system and process

NASA Technical Reports Server (NTRS)

Puram, Chith K. (Inventor); Daryabeigi, Kamran (Inventor); Wright, Robert (Inventor); Alderfer, David W. (Inventor)

1994-01-01

Apparatus and process for measuring the variation of directional emittance of surfaces at various temperatures using a radiometric infrared imaging system. A surface test sample is coated onto a copper target plate provided with selective heating within the desired incremental temperature range to be tested and positioned onto a precision rotator to present selected inclination angles of the sample relative to the fixed positioned and optically aligned infrared imager. A thermal insulator holder maintains the target plate on the precision rotator. A screen display of the temperature obtained by the infrared imager, and inclination readings are provided with computer calculations of directional emittance being performed automatically according to equations provided to convert selected incremental target temperatures and inclination angles to relative target directional emittance values. The directional emittance of flat black lacquer and an epoxy resin measurements obtained are in agreement with the predictions of the electromagnetic theory and with directional emittance data inferred from directional reflectance measurements made on a spectrophotometer.

Effects of copper supplement on growth and viability of strains used as starters and adjunct cultures for Emmental cheese manufacture.

PubMed

Rodríguez, L Mato; Alatossava, T

2008-10-01

To determine the effects of supplemented copper (Cu2+) on growth and viability of strains used as starters and adjunct cultures for Emmental cheese manufacture. Thirteen strains belonging to Lactobacillus delbrueckii, Lactobacillus helveticus, Lactobacillus rhamnosus, Streptococcus thermophilus or Propionibacterium freudenreichii species were exposed to various copper concentrations in the proper growth medium at relevant growth temperatures, and the effects of supplemented copper on bacterial growth and cell viability were determined by optical density and pH measurements, also by platings. Among the species considered, L. delbrueckii was the most copper resistant and S. thermophilus the most sensitive to copper. Anaerobic conditions increased this sensitivity significantly. There was also a considerable amount of variation in copper resistance at strain level. Copper resistance is both a species- and strain-dependent property and may reflect variability in copper-binding capacities by cell wall components among species and strains. In addition, the chemical state of copper may be involved. This study revealed that copper resistance is a highly variable property among starter and adjunct strains, and this variability should be considered when strains are selected for Emmental cheese manufacture.

Method of forming electronically conducting polymers on conducting and nonconducting substrates

NASA Technical Reports Server (NTRS)

Hodko, Dalibor (Inventor); Clarke, Eric T. (Inventor); Miller, David L. (Inventor); Murphy, Oliver J. (Inventor); Hitchens, G. Duncan (Inventor); Parker, Donald L. (Inventor)

2001-01-01

The present invention provides electronically conducting polymer films formed from photosensitive formulations of pyrrole and an electron acceptor that have been selectively exposed to UV light, laser light, or electron beams. The formulations may include photoinitiators, flexibilizers, solvents and the like. These solutions can be used in applications including printed circuit boards and through-hole plating and enable direct metallization processes on non-conducting substrates. After forming the conductive polymer patterns, a printed wiring board can be formed by sensitizing the polymer with palladium and electrolytically depositing copper.

Industrial Implementation of Environmentally Friendly Nanometal Electroplating Process for Chromium and Copper Beryllium Replacement using Low Cost Pulse Current Power Supplies

DTIC Science & Technology

2014-09-10

Cr-Mo, and stainless steel have to some extent found acceptance in various military and commercial CuBe-replacement roles. 1.1.2 Proposed...including low and high strength steels , stainless steel , Inconel and nickel. Figure 4-8 Activation line used to prepare components for nCoP plating...size up to a maximum thickness of 0.012”, can be produced in the tank by electroforming onto a flat stainless steel mandrel and subsequently

76 FR 75873 - Certain Helical Spring Lock Washers From Taiwan and the People's Republic of China: Continuation...

Federal Register 2010, 2011, 2012, 2013, 2014

2011-12-05

... or bolts; and (3) provide a hardened bearing surface. The scope does not include internal or external tooth washers, nor does it include spring lock washers made of other metals, such as copper. Lock..., or of stainless steel, heat-treated or non-heat-treated, plated or non-plated, with ends that are off...

Clean solutions to the incoming wafer quality impact on lithography process yield limits in a dynamic copper/low-k research and development environment

NASA Astrophysics Data System (ADS)

Lysaght, Patrick S.; Ybarra, Israel; Sax, Harry; Gupta, Gaurav; West, Michael; Doros, Theodore G.; Beach, James V.; Mello, Jim

2000-06-01

The continued growth of the semiconductor manufacturing industry has been due, in large part, to improved lithographic resolution and overlay across increasingly larger chip areas. Optical lithography continues to be the mainstream technology for the industry with extensions of optical lithography being employed to support 180 nm product and process development. While the industry momentum is behind optical extensions to 130 nm, the key challenge will be maintaining an adequate and affordable process latitude (depth of focus/exposure window) necessary for 10% post-etch critical dimension (CD) control. If the full potential of optical lithography is to be exploited, the current lithographic systems can not be compromised by incoming wafer quality. Impurity specifications of novel Low-k dielectric materials, plating solutions, chemical-mechanical planarization (CMP) slurries, and chemical vapor deposition (CVD) precursors are not well understood and more stringent control measures will be required to meet defect density targets as identified in the National Technology Roadmap for Semiconductors (NTRS). This paper identifies several specific poor quality wafer issues that have been effectively addressed as a result of the introduction of a set of flexible and reliable wafer back surface clean processes developed on the SEZ Spin-Processor 203 configured for processing of 200 mm diameter wafers. Patterned wafers have been back surface etched by means of a novel spin process contamination elimination (SpCE) technique with the wafer suspended by a dynamic nitrogen (N2) flow, device side down, via the Bernoulli effect. Figure 1 illustrates the wafer-chuck orientation within the process chamber during back side etch processing. This paper addresses a number of direct and immediate benefits to the MicraScan IIITM deep-ultraviolet (DUV) step-and-scan system at SEMATECH. These enhancements have resulted from the resolution of three significant problems: (1) back surface particle/residual contamination, (2) wafer flatness, and (3) control of contaminant materials such as copper (Cu). Data associated with the SpCE process, optimized for flatness improvement, particle removal, and Cu contamination control is presented in this paper, as it relates to excessive consumption of the usable depth of focus (UDOF) and comprehensive yield enhancement in photolithography. Additionally, data illustrating a highly effective means of eliminating copper from the wafer backside, bevel/edge, and frontside edge exclusion zone (0.5 mm - 3 mm), is presented. The data, obtained within the framework of standard and experimental copper/low-k device production at SEMATECH, quantifies the benefits of implementing the SEZ SpCE clean operation. Furthermore, this data confirms the feasibility of utilizing existing (non-copper) process equipment in conjunction with the development of copper applications by verifying the reliability and cost effectiveness of SpCE functionality.

A study of ignition by rifle bullets

Treesearch

Mark A. Finney; Trevor B. Maynard; Sara S. McAllister; Ian J. Grob

2013-01-01

Experiments were conducted to examine the potential for rifle bullets to ignite organic matter after impacting a hard surface. The tests were performed using a variety of common cartridges (7.62x51, 7.62x39, 7.62x54R, and 5.56x45) and bullet materials (steel core, lead core, solid copper, steel jacket, and copper jacket). Bullets were fired at a steel plate that...

Effect of Cu content on microstructure, mechanical and anti-fouling properties of TiSiN-Cu coating deposited by multi-arc ion plating

NASA Astrophysics Data System (ADS)

Bai, Xuebing; Li, Jinlong; Zhu, Lihui; Wang, Liping

2018-01-01

The copper-doped TiSiN coatings were deposited on 316L stainless steel by reactive co-sputtering in multi-arc ion plating. The surface morphology and structure of the coating were analyzed by scanning electron microcopies, X-ray diffraction and X-ray photoelectron spectroscopy. The hardness was tested using Nano-indentation. The influence of the copper content in the coatings on the structure and mechanical properties of TiSiN-Cu coatings was investigated. Antifouling behaviors of the coatings were evaluated by analyzing adhesion and propagation of P. tricornutum, N. closterium, and Chlorella sp. The TiSiN-Cu coatings had a unique structure of amorphous Si3N4 and nanocrystalline nc-TiN/nc-Cu. The Cu-TiSiN coatings can inhibit effectively attachment and colonization of the algae on the surface. When the copper content increases from 6.75 at.% to 25.15 at.%, the coatings show an obvious decrease in hardness, significantly increase in the surface roughness and greatly weaken in antifouling properties. When the copper content is 6.75 at.%, the coating has the highest hardness with 30 GPa, and the best reduction ratio with 89%, 93% and 57% attachment of P. triceratium, N. closterium and Chlorella sp., respectively. The TiSiN-Cu coating with a copper dosage of 6.75 at.% has the excellent mechanical properties and capability of killing effectively microalgae.

Catalyst surfaces for the chromous/chromic redox couple

NASA Technical Reports Server (NTRS)

Giner, J. D.; Cahill, K. J. (Inventor)

1981-01-01

An electricity producing cell of the reduction-oxidation (REDOX) type divided into two compartments by a membrane is disclosed. A ferrous/ferric couple in a chloride solution serves as a cathode fluid to produce a positive electric potential. A chromic/chromous couple in a chloride solution serves as an anode fluid to produce a negative potential. The electrode is an electrically conductive, inert material plated with copper, silver or gold. A thin layer of lead plates onto the copper, silver or gold layer when the cell is being charged, the lead ions being available from lead chloride which has been added to the anode fluid. If the REDOX cell is then discharged, the lead deplates from the negative electrode and the metal coating on the electrode acts as a catalyst to increase current density.

Advanced Vacuum Plasma Spray (VPS) for a Robust, Longlife and Safe Space Shuttle Main Engine (SSME)

NASA Technical Reports Server (NTRS)

Holmes, Richard R.; Elam, Sandra K.; McKechnie, Timothy N.; Power, Christopher A.

2010-01-01

In 1984, the Vacuum Plasma Spray Lab was built at NASA/Marshall Space Flight Center for applying durable, protective coatings to turbine blades for the space shuttle main engine (SSME) high pressure fuel turbopump. Existing turbine blades were cracking and breaking off after five hot fire tests while VPS coated turbine blades showed no wear or cracking after 40 hot fire tests. Following that, a major manufacturing problem of copper coatings peeling off the SSME Titanium Main Fuel Valve Housing was corrected with a tenacious VPS copper coating. A patented VPS process utilizing Functional Gradient Material (FGM) application was developed to build ceramic lined metallic cartridges for space furnace experiments, safely containing gallium arsenide at 1260 degrees centigrade. The VPS/FGM process was then translated to build robust, long life, liquid rocket combustion chambers for the space shuttle main engine. A 5K (5,000 Lb. thrust) thruster with the VPS/FGM protective coating experienced 220 hot firing tests in pristine condition with no wear compared to the SSME which showed blanching (surface pulverization) and cooling channel cracks in less than 30 of the same hot firing tests. After 35 of the hot firing tests, the injector face plates disintegrated. The VPS/FGM process was then applied to spraying protective thermal barrier coatings on the face plates which showed 50% cooler operating temperature, with no wear after 50 hot fire tests. Cooling channels were closed out in two weeks, compared to one year for the SSME. Working up the TRL (Technology Readiness Level) to establish the VPS/FGM process as viable technology, a 40K thruster was built and is currently being tested. Proposed is to build a J-2X size liquid rocket engine as the final step in establishing the VPS/FGM process TRL for space flight.

High performance alloy electroforming

NASA Technical Reports Server (NTRS)

Malone, G. A.; Winkelman, D. M.

1989-01-01

Electroformed copper and nickel are used in structural applications for advanced propellant combustion chambers. An improved process has been developed by Bell Aerospace Textron, Inc. wherein electroformed nickel-manganese alloy has demonstrated superior mechanical and thermal stability when compared to previously reported deposits from known nickel plating processes. Solution chemistry and parametric operating procedures are now established and material property data is established for deposition of thick, large complex shapes such as the Space Shuttle Main Engine. The critical operating variables are those governing the ratio of codeposited nickel and manganese. The deposition uniformity which in turn affects the manganese concentration distribution is affected by solution resistance and geometric effects as well as solution agitation. The manganese concentration in the deposit must be between 2000 and 3000 ppm for optimum physical properties to be realized. The study also includes data regarding deposition procedures for achieving excellent bond strength at an interface with copper, nickel-manganese or INCONEL 718. Applications for this electroformed material include fabrication of complex or re-entry shapes which would be difficult or impossible to form from high strength alloys such as INCONEL 718.

Geiger Counter Technique

DTIC Science & Technology

1942-01-01

ONLY; ADMINISTRATIVE/OPERATIONAL USE; 03 MAR 1999. OTHER REQUESTS SHALL BE REFERRED THROUGH COMMANDING OFFICER, NAVAL RESEARCH LAB , WASHINGTON, DC 20375...Used as Glow Tube Voltage + " -- -+a...... .-..... . .... . . . . . .. . . Plate 41. Tar of aCotrolust Voltaep with Gas Pressure lab A-gtarator of’ Plate...construation cf vapor comatera. Acst Lay metal wll menru as cathode aterial, but oxidiste copper Lad bras han given beest res-ts. fe ride choice of

Dynamic High-Pressure Behavior of Hierarchical Heterogeneous Geological Materials

DTIC Science & Technology

2016-04-01

sandwiched between two 25µm FEP copolymer layers attached to the copper driver plate . The total package thickness with thin-film epoxy on all bonding...public release. 3 OUTLINE Page # ABSTRACT 2 1. BACKGROUND 4 2. CHARACTERISTICS OF SAND INVESTIGATED 8 3. PLATE ...constituents, phases, inter-phase boundaries ; distributions in shock states; as well as the structural evolutions which can result in strain

Manipulator having thermally conductive rotary joint for transferring heat from a test specimen

DOEpatents

Haney, S.J.; Stulen, R.H.; Toly, N.F.

1983-05-03

A manipulator for rotatably moving a test specimen in an ultra-high vacuum chamber includes a translational unit movable in three mutually perpendicular directions. A manipulator frame is rigidly secured to the translational unit for rotatably supporting a rotary shaft. A first copper disc is rigidly secured to an end of the rotary shaft for rotary movement within the vacuum chamber. A second copper disc is supported upon the first disc. The second disc receives a cryogenic cold head and does not rotate with the first disc. The second disc receives a cryogenic cold head and does not rotate with the first disc. A sapphire plate is interposed between the first and second discs to prevent galling of the copper material while maintaining high thermal conductivity between the first and second discs. A spring is disposed on the shaft to urge the second disc toward the first disc and compressingly engage the interposed sapphire plate. A specimen mount is secured to the first disc for rotation within the vacuum chamber. The specimen maintains high thermal conductivity with the second disc receiving the cryogenic transfer line.

Characterization and control of the microbial community affiliated with copper or aluminum heat exchangers of HVAC systems.

PubMed

Schmidt, Michael G; Attaway, Hubert H; Terzieva, Silva; Marshall, Anna; Steed, Lisa L; Salzberg, Deborah; Hamoodi, Hameed A; Khan, Jamil A; Feigley, Charles E; Michels, Harold T

2012-08-01

Microbial growth in heating ventilation and air-conditioning (HVAC) systems with the subsequent contamination of indoor air is of increasing concern. Microbes and the subsequent biofilms grow easily within heat exchangers. A comparative study where heat exchangers fabricated from antimicrobial copper were evaluated for their ability to limit microbial growth was conducted using a full-scale HVAC system under conditions of normal flow rates using single-pass outside air. Resident bacterial and fungal populations were quantitatively assessed by removing triplicate sets of coupons from each exchanger commencing the fourth week after their installation for the next 30 weeks. The intrinsic biofilm associated with each coupon was extracted and characterized using selective and differential media. The predominant organisms isolated from aluminum exchangers were species of Methylobacterium of which at least three colony morphologies and 11 distinct PFGE patterns we found; of the few bacteria isolated from the copper exchangers, the majority were species of Bacillus. The concentrations and type of bacteria recovered from the control, aluminum, exchangers were found to be dependent on the type of plating media used and were 11,411-47,257 CFU cm(-2) per coupon surface. The concentration of fungi was found to average 378 CFU cm(-2). Significantly lower concentrations of bacteria, 3 CFU cm(-2), and fungi, 1 CFU cm(-2), were recovered from copper exchangers regardless of the plating media used. Commonly used aluminum heat exchangers developed stable, mixed, bacterial/fungal biofilms in excess of 47,000 organisms per cm(2) within 4 weeks of operation, whereas the antimicrobial properties of metallic copper were able to limit the microbial load affiliated with the copper heat exchangers to levels 99.97 % lower during the same time period.

Installation Restoration Program. Phase 1: Records Search, Williams AFB, Arizona

DTIC Science & Technology

1984-02-01

Minimum 4.5 Trace substances, maximum -. allowable limits, (mg/1) Arsenic 2.00 Boron 1.00 Cadmium 0.05 Chromium (hexavalent and trivalent ) 1.00 Copper...located in Building 32. Chromium , cadmium, and copper electroplating operations were conducted in a temporary building, T-31 . Paint stripping was... chromium plating wastes. The paint separator receives wastes from paint stri.pping operations that are performed in Buildings 25 and 1086. It also

46 CFR 182.440 - Independent fuel tanks.

Code of Federal Regulations, 2012 CFR

2012-10-01

...(150 gal) tanks Over 570 liter(150 gal) 2 tanks Nickel-copper B 127, hot rolled sheet or plate 0.94 (0.037) [USSG 20] 3 1.27 (0.050) [USSG 18] 2.72 (0.107) [USSG 12]. Copper-nickel 4 B 122, UNS alloy... C65100 and C65500 1.29 (0.051) [AWG 16] 1.63 (0.064) [AWG 14] 3.66 (0.144) [AWG 7]. Steel or iron 5,6 1...

46 CFR 182.440 - Independent fuel tanks.

Code of Federal Regulations, 2011 CFR

2011-10-01

...(150 gal) tanks Over 570 liter(150 gal) 2 tanks Nickel-copper B 127, hot rolled sheet or plate 0.94 (0.037) [USSG 20] 3 1.27 (0.050) [USSG 18] 2.72 (0.107) [USSG 12]. Copper-nickel 4 B 122, UNS alloy... C65100 and C65500 1.29 (0.051) [AWG 16] 1.63 (0.064) [AWG 14] 3.66 (0.144) [AWG 7]. Steel or iron 5,6 1...

Experimental Investigation on Laser Impact Welding of Fe-Based Amorphous Alloys to Crystalline Copper

PubMed Central

Wang, Xiao; Luo, Yapeng; Huang, Tao; Liu, Huixia

2017-01-01

Recently, amorphous alloys have attracted many researchers’ attention for amorphous structures and excellent properties. However, the welding of amorphous alloys to traditional metals in the microscale is not easy to realize in the process with amorphous structures unchanged, which restrains the application in industry. In this paper, a new method of welding Fe-based amorphous alloys (GB1K101) to crystalline copper by laser impact welding (LIW) is investigated. A series of experiments was conducted under different laser energies, during which Fe-based amorphous alloys and crystalline copper were welded successfully by LIW. In addition, the microstructure and mechanical properties of welding joints were observed and measured, respectively. The results showed that the surface wave and springback were observed on the flyer plate after LIW. The welding interface was straight or wavy due to different plastic deformation under different laser energies. The welding interface was directly bonded tightly without visible defects. No visible element diffusion and intermetallic phases were found in the welding interface. The Fe-based amorphous alloys retained amorphous structures after LIW under the laser energy of 835 mJ. The nanoindentation hardness across the welding interface showed an increase on both sides of the welding interface. The results of the lap shearing test showed that the fracture position was on the side of copper coil. PMID:28772886

Experimental Investigation on Laser Impact Welding of Fe-Based Amorphous Alloys to Crystalline Copper.

PubMed

Wang, Xiao; Luo, Yapeng; Huang, Tao; Liu, Huixia

2017-05-12

Recently, amorphous alloys have attracted many researchers' attention for amorphous structures and excellent properties. However, the welding of amorphous alloys to traditional metals in the microscale is not easy to realize in the process with amorphous structures unchanged, which restrains the application in industry. In this paper, a new method of welding Fe-based amorphous alloys (GB1K101) to crystalline copper by laser impact welding (LIW) is investigated. A series of experiments was conducted under different laser energies, during which Fe-based amorphous alloys and crystalline copper were welded successfully by LIW. In addition, the microstructure and mechanical properties of welding joints were observed and measured, respectively. The results showed that the surface wave and springback were observed on the flyer plate after LIW. The welding interface was straight or wavy due to different plastic deformation under different laser energies. The welding interface was directly bonded tightly without visible defects. No visible element diffusion and intermetallic phases were found in the welding interface. The Fe-based amorphous alloys retained amorphous structures after LIW under the laser energy of 835 mJ. The nanoindentation hardness across the welding interface showed an increase on both sides of the welding interface. The results of the lap shearing test showed that the fracture position was on the side of copper coil.

Effect of сopper сoating on fibers made of aluminum alloy, titanium, and FeCrAl alloy on surface morphology and activity in CO oxidation

NASA Astrophysics Data System (ADS)

Lukiyanchuk, I. V.; Rudnev, V. S.; Serov, M. M.; Krit, B. L.; Lukiyanchuk, G. D.; Nedozorov, P. M.

2018-04-01

The catalytic activity of both copper fibers and copper-coated fibers of a diameter of 50-100 μm made of aluminum alloy, technical grade titanium, and FeCrAl alloy in CO oxidation has been estimated. Metal fibers have been fabricated by the method of pendant drop melt extraction (PDME). The fibers copper plating was carried out by chemical and electrochemical methods. The composition and structure of samples and coatings before and after catalytic tests have been characterized by the methods of scanning electron microscopy, energy-dispersive analysis, and X-ray fluorescence analysis. It has been shown that the catalytic activity of copper-coated fibers made of FeCrAl alloy in the reaction of CO oxidation is not inferior to that of copper fibers.

Optimization of metals and plastics recovery from electric cable wastes using a plate-type electrostatic separator.

PubMed

Richard, Gontran; Touhami, Seddik; Zeghloul, Thami; Dascalescu, Lucien

2017-02-01

Plate-type electrostatic separators are commonly employed for the selective sorting of conductive and non-conductive granular materials. The aim of this work is to identify the optimal operating conditions of such equipment, when employed for separating copper and plastics from either flexible or rigid electric wire wastes. The experiments are performed according to the response surface methodology, on samples composed of either "calibrated" particles, obtained by manually cutting of electric wires at a predefined length (4mm), or actual machine-grinded scraps, characterized by a relatively-wide size distribution (1-4mm). The results point out the effect of particle size and shape on the effectiveness of the electrostatic separation. Different optimal operating conditions are found for flexible and rigid wires. A separate processing of the two classes of wire wastes is recommended. Copyright © 2016 Elsevier Ltd. All rights reserved.

The Myszkow porphyry copper-molybdenum deposit, Poland

USGS Publications Warehouse

Chaffee, M.A.; Eppinger, R.G.; Lason, K.; Slosarz, J.; Podemski, M.

1994-01-01

The porphyry copper-molybdenum deposit at Myszkow, south-central Poland, lies in the Cracow-Silesian orogenic belt, in the vicinity of a Paleozoic boundary between two tectonic plates. The deposit is hosted in a complex that includes early Paleozoic metasedimentary rocks intruded in the late Paleozoic by a predominantly granodioritic pluton. This deposit exhibits many features that are typical of porphyry copper deposits associated with calc-alkaline intrusive rocks, including ore- and alteration-mineral suites, zoning of ore and alteration minerals, fluid-inclusion chemistry, tectonic setting, and structural style of veining. Unusual features of the Myszkow deposit include high concentrations of tungsten and the late Paleozoic (Variscan) age. -Authors

Cantilever testing of sintered-silver interconnects

DOE PAGES

Wereszczak, Andrew A.; Chen, Branndon R.; Jadaan, Osama M.; ...

2017-10-19

Cantilever testing is an underutilized test method from which results and interpretations promote greater understanding of the tensile and shear failure responses of interconnects, metallizations, or bonded joints. The use and analysis of this method were pursued through the mechanical testing of sintered-silver interconnects that joined Ni/Au-plated copper pillars or Ti/Ni/Ag-plated silicon pillars to Ag-plated direct bonded copper substrates. Sintered-silver was chosen as the interconnect test medium because of its high electrical and thermal conductivities and high-temperature capability—attractive characteristics for a candidate interconnect in power electronic components and other devices. Deep beam theory was used to improve upon the estimationsmore » of the tensile and shear stresses calculated from classical beam theory. The failure stresses of the sintered-silver interconnects were observed to be dependent on test-condition and test-material-system. In conclusion, the experimental simplicity of cantilever testing, and the ability to analytically calculate tensile and shear stresses at failure, result in it being an attractive mechanical test method to evaluate the failure response of interconnects.« less

Cantilever testing of sintered-silver interconnects

DOE Office of Scientific and Technical Information (OSTI.GOV)

Wereszczak, Andrew A.; Chen, Branndon R.; Jadaan, Osama M.

Cantilever testing is an underutilized test method from which results and interpretations promote greater understanding of the tensile and shear failure responses of interconnects, metallizations, or bonded joints. The use and analysis of this method were pursued through the mechanical testing of sintered-silver interconnects that joined Ni/Au-plated copper pillars or Ti/Ni/Ag-plated silicon pillars to Ag-plated direct bonded copper substrates. Sintered-silver was chosen as the interconnect test medium because of its high electrical and thermal conductivities and high-temperature capability—attractive characteristics for a candidate interconnect in power electronic components and other devices. Deep beam theory was used to improve upon the estimationsmore » of the tensile and shear stresses calculated from classical beam theory. The failure stresses of the sintered-silver interconnects were observed to be dependent on test-condition and test-material-system. In conclusion, the experimental simplicity of cantilever testing, and the ability to analytically calculate tensile and shear stresses at failure, result in it being an attractive mechanical test method to evaluate the failure response of interconnects.« less

Standard performance tests of collectors of solar thermal energy: A selectively coated, flat-plate copper collector with one transparent cover and a tube-to-tube spacing of 3-7/8 inches

NASA Technical Reports Server (NTRS)

1976-01-01

Basic test results are given of a flat-plate solar collector whose performance was determined in the NASA-Lewis solar simulator. The collector was tested over ranges of inlet temperatures, fluxes, and coolant flow rates. Collector efficiency is correlated in terms of inlet temperature and flux level.

Laser-induced selective metallization of polypropylene doped with multiwall carbon nanotubes

NASA Astrophysics Data System (ADS)

Ratautas, Karolis; Gedvilas, Mindaugas; Stankevičiene, Ina; Jagminienė, Aldona; Norkus, Eugenijus; Pira, Nello Li; Sinopoli, Stefano; Račiukaitis, Gediminas

2017-08-01

Moulded interconnect devices (MID) offer the material, weight and cost saving by integration electronic circuits directly into polymeric components used in automotive and other consumer products. Lasers are used to write circuits directly by modifying the surface of polymers followed by an electroless metal plating. A new composite material - the polypropylene doped with multiwall carbon nanotubes was developed for the laser-induced selective metallization. Mechanism of surface activation by laser irradiation was investigated in details utilising pico- and nanoseconds lasers. Deposition of copper was performed in the autocatalytic electroless plating bath. The laser-activated polymer surfaces have been studied using the Raman spectroscopy and scanning electron microscope (SEM). Microscopic images revealed that surface becomes active only after its melting by a laser. Alterations in the Raman spectra of the D and G bands indicated the clustering of carbon additives in the composite material. Optimal laser parameters for the surface activation were found by measuring a sheet resistance of the finally metal-plated samples. A spatially selective copper plating was achieved with the smallest conductor line width of 22 μm at the laser scanning speed of 3 m/s and the pulse repetition rate of 100 kHz. Finally, the technique was validated by making functional electronic circuits by this MID approach.

Sintering behavior and thermal conductivity of nickel-coated graphite flake/copper composites fabricated by spark plasma sintering

NASA Astrophysics Data System (ADS)

Xu, Hui; Chen, Jian-hao; Ren, Shu-bin; He, Xin-bo; Qu, Xuan-hui

2018-04-01

Nickel-coated graphite flakes/copper (GN/Cu) composites were fabricated by spark plasma sintering with the surface of graphite flakes (GFs) being modified by Ni-P electroless plating. The effects of the phase transition of the amorphous Ni-P plating and of Ni diffusion into the Cu matrix on the densification behavior, interfacial microstructure, and thermal conductivity (TC) of the GN/Cu composites were systematically investigated. The introduction of Ni-P electroless plating efficiently reduced the densification temperature of uncoated GF/Cu composites from 850 to 650°C and slightly increased the TC of the X-Y basal plane of the GF/Cu composites with 20vol%-30vol% graphite flakes. However, when the graphite flake content was greater than 30vol%, the TC of the GF/Cu composites decreased with the introduction of Ni-P plating as a result of the combined effect of the improved heat-transfer interface with the transition layer, P generated at the interface, and the diffusion of Ni into the matrix. Given the effect of the Ni content on the TC of the Cu matrix and on the interface thermal resistance, a modified effective medium approximation model was used to predict the TC of the prepared GF/Cu composites.

High-speed off-axis holographic cinematography with a copper-vapor-pumped dye laser.

PubMed

Lauterborn, W; Judt, A; Schmitz, E

1993-01-01

A series of coherent light pulses is generated by pumping a dye laser with the pulsed output of a copper-vapor laser at rates of as much as 20 kHz. Holograms are recorded at this pulse rate on a rotating holographic plate. This technique of high-speed holographic cinematography is demonstrated by viewing the bubble filaments that appear in water under the action of a sound field of high intensity.

Deposit formation and heat transfer in hydrocarbon rocket fuels

NASA Technical Reports Server (NTRS)

Giovanetti, A. J.; Spadaccini, L. J.; Szetela, E. J.

1983-01-01

An experimental research program was undertaken to investigate the thermal stability and heat transfer characteristics of several hydrocarbon fuels under conditions that simulate high-pressure, rocket engine cooling systems. The rates of carbon deposition in heated copper and nickel-plated copper tubes were determined for RP-1, propane, and natural gas using a continuous flow test apparatus which permitted independent variation and evaluation of the effect on deposit formation of wall temperature, fuel pressure, and fuel velocity. In addition, the effects of fuel additives and contaminants, cryogenic fuel temperatures, and extended duration testing with intermittent operation were examined. Parametric tests to map the thermal stability characteristics of RP-1, commercial-grade propane, and natural gas were conducted at pressures of 6.9 to 13.8 MPa, bulk fuel velocities of 30 to 90 m/s, and tube wall temperatures in the range of 230 to 810 K. Also, tests were run in which propane and natural gas fuels were chilled to 230 and 160 K, respectively. Corrosion of the copper tube surface was detected for all fuels tested. Plating the inside of the copper tubes with nickel reduced deposit formation and eliminated tube corrosion in most cases. The lowest rates of carbon deposition were obtained for natural gas, and the highest rates were obtained for propane. For all fuels tested, the forced-convection heat transfer film coefficients were satisfactorily correlated using a Nusselt-Reynolds-Prandtl number equation.

Guided Inquiry Learning With Sea Water Battery Project

NASA Astrophysics Data System (ADS)

Mashudi, A.

2017-02-01

Science learning process is expected to produce valuable product, innovative and real learning environment, and provide memorable learning experience. That orientation can be contained in Inquiry Based Learning. SMP N 4 Juwana is located close to the beach. That’s why, Sea Water Battery Project is very suitable to be applied in learning activity as an effort to fulfill the renewable energy based on local wisdom. This study aims to increase interest, activity and achievement of students. Learning implementation stage, namely : Constructing Sea Water Battery project, observation, group presentations, and feedback. Sea Water Battery is renewable energy battery from materials easily found around the learner. The materials used are copper plate as the anode, zinc plate as the cathode and sea water as the electrolyte. Average score of students Interest on the first cycle 76, while on the second cycle 85. Average score of students Activity on the first cycle 76 and on the second cycle 86. Average score of students achievement on the first cycle 75, while on the second cycle 84. This learning process gave nurturant effect for students to keep innovating and construct engineering technology for the future.

Metal Nanowires: Synthesis, Processing, and Structure-Property Relationships in the Context of Flexible Transparent Conducting Films

NASA Astrophysics Data System (ADS)

Rathmell, Aaron R.

The demand for flat-panel televisions, e-readers, smart-phones, and touch-screens has been increasing over the past few years and will continue to increase for the foreseeable future. Each of these devices contains a transparent conductor, which is usually indium tin oxide (ITO) because of its high transparency and low sheet resistance. ITO films, however, are brittle, expensive, and difficult to deposit, and because of these problems, alternative transparent electrodes are being studied. One cheap and flexible alternative to ITO is films of randomly oriented copper nanowires. We have developed a synthesis to make long, thin, and well-dispersed copper nanowires that can be suspended in an ink and coated onto a substrate to make flexible transparent films. These films are then made conductive by annealing in a hydrogen atmosphere or by a solution processing technique that can be done in air at room temperature. The resulting flexible transparent conducting films display transparencies and sheet resistance values comparable to ITO. Since it is well known that copper oxidizes, we also developed a synthesis to coat the copper nanowires with a layer of nickel in solution. Our measurements indicated that copper nanowires would double their sheet resistance in 3 months, but the sheet resistance of cupronickel nanowire films containing 20 mole% nickel will double in about 400 years. The addition of nickel to the copper nanowires also gave the film a more neutral grey appearance. The nickel coating can also be applied to the copper nanowires after the film is formed via an electroless plating method. To further optimize the properties of our transparent conductors we developed a framework to understand how the dimensions and area coverage of the nanowires affect the overall film properties. To quantify the effect of length on the sheet resistance and transmittance, wires with different lengths but the same diameter were synthesized to make transparent conducting films and finite-difference time-domain calculations were used to determine the effect of the nanowire diameter on the film's transmittance. The experimental data and calculations were then incorporated into random resistor network simulations that demonstrated that wires with an aspect ratio of 400 or higher are required to make a network that transmits >90% of visible light while maintaining a sheet resistance below 100 O/sq-1. These properties, and the fact that copper and nickel are 1000 times more abundant than indium or silver, make copper and cupronickel nanowire films a promising alternative for the sustainable, efficient production of transparent conductors.

Analysis of metals with luster: Roman brass and silver

NASA Astrophysics Data System (ADS)

Fajfar, H.; Rupnik, Z.; Šmit, Ž.

2015-11-01

Non-destructive PIXE analysis using in-air proton beam was used for the studies of earliest brass coins issued during the 1st century BC by Greek cities in Asia Minor, Romans and Celts, and for the studies of plated low grade silver coins of the 3rd century AD. The analysis determined the levels of zinc and important trace elements, notably selenium, which confirms spread of selenium-marked copper from the east. For plating, combined tinning and silvering was identified by the mapping technique for the mid 3rd century AD, which evolved into mere plating by 270 AD.

The design and evaluation of superconducting connectors

NASA Technical Reports Server (NTRS)

Payne, J. E.

1982-01-01

The development of a superconducting connector for superconducting circuits on space flights is described. It is proposed that such connectors be used between the superconducting readout loop and the SQUID magnetometer in the Gravity Probe B experiment. Two types of connectors were developed. One type employs gold plated niobium wires making pressure connections to gold plated niobium pads. Lead-plated beryllium-copper spring contacts can replace the niobium wires. The other type is a rigid solder or weld connection between the niobium wires and the niobium pads. A description of the methods used to produce these connectors is given and their performance analyzed.

Development of Low-Carbon, Copper-Strengthened HSLA Steel Plate for Naval Ship Construction

DTIC Science & Technology

1990-06-01

steel plate microstructures, 2% nital etch . ...................................................... 13 2. Charpy V-notch impact energy transition for...met a minimum yield strength requirement of 80 ksi yield strength through 3/4 inch gage, had high Charpy V-notch impact energy at low tempera- tures...tempered HSLA line-pipe steels, which typically could not meet the minimum Charpy V-notch impact toughness requirement of 35 ft-lb at -1 200 F. In 1984

Standardized performance tests of collectors of solar thermal energy: A selectively coated, flat-plate copper collector with one transparent cover and a tube-to-tube spacing of 5 5/8 inches

NASA Technical Reports Server (NTRS)

1976-01-01

This preliminary data report gives basic test results of a flat-plate solar collector whose performance was determined in the NASA-Lewis solar simulator. The collector was tested over ranges of inlet temperatures, fluxes and coolant flow rates. Collector efficiency is correlated in terms of inlet temperature and flux level.

Fire Resistance Testing of Bulkhead and Deck Penetrations. Phase 2

DTIC Science & Technology

1988-12-01

thick steel plate. All sample 12 construction was representative of Class A-0 construction. The UL staff secured insulation ( rockwool batts) to the...designated side of the steel plates and penetrants for testing as Class A-60 deck assemblies. The rockwool batts complied with the Class A-60...insulated with rockwool batts and tested for a Class A-60 rating. This group consisted of one steel penetration, eight copper penetrations, four PVC

Polyimide surface modification by using microwave plasma for adhesion enhancement of Cu electroless plating.

PubMed

Cho, Sang-Jin; Nguyen, Trieu; Boo, Jin-Hyo

2011-06-01

Microwave (MW) plasma was applied to the surface of polyimide (PI) films as a treatment to enhance the adhesion between copper deposition layer and PI surface for electroless plating. The influences of nitrogen MW plasma treatment on chemical composition of the PI surface were investigated by using X-Ray photoelectron spectroscopy (XPS). The wettability was also investigated by water contact angle measurement. The surface morphologies of PI films before and after treatment were characterized with atomic force microscopy (AFM). The contact angle results show that was dramatically decreased to 16.1 degrees at the optimal treatment condition from 72.1 degrees (untreated PI). However, the root mean square (RMS) roughness of treated PI film was almost unchanged. The AFM roughness was stayed from 1.0 to 1.2 with/without plasma treatment. XPS data show a nitrogen increase when PI films exposed to N2 MW plasma. Electroless copper depositions were carried out with the free-formaldehyde method using glyoxylic acid as the reducing reagent and mixture palladium chloride, tin chloride as activation solution. Adhesion property between polyimide surface and copper layer was investigated by tape test.

DCT-TCI: Real Gas Characterization of Plasma Flow Control - An Integrated Approach

DTIC Science & Technology

2011-12-23

as Navier-Stokes equations are solved in this study. We utilize the two-species basic model to reduce the computational complexity of plasma...constant of 3.0. Copper tape was first adhered to both sides of a 3 mm thick acrylic plate. A negative photo-resist, a transparent film and a UV light...ferric chloride. The reminiscence of the adhesive glue left behind by the copper tape was removed using a solvent such as methanol or acetone. The

Detection of lack of fusion using opaque additives, phase 2

NASA Technical Reports Server (NTRS)

Cook, J. L.

1973-01-01

Plasma-sprayed copper coatings were developed to protect the aluminum surfaces of spacecraft structures from oxidation, as well as to provide a means of reliable nondestructive X-ray inspection of possible incomplete weldment penetration. Sixty day storage tests of coated aluminum samples indicated the promise of long-term oxidation protection, but revealed no advantage in detecting penetration defects. Delta-scan techniques were used, and peen plating as a means of applying copper to the aluminum surface was investigated.

Reduction of liquid metal embrittlement in copper-brazed stainless steel joints

NASA Astrophysics Data System (ADS)

Uhlig, T.; Fedorov, V.; Elßner, M.; Wagner, G.; Weis, S.

2017-03-01

Due to its very good formability and the low raw material cost, pure copper in form of foils is commonly used to braze plate heat exchangers made of stainless steel. The difference in the electrochemical potentials of brazing filler and base material leads to corrosion effects in contact with electrolytes. This may lead to leakages, which decrease the reliability of the heat exchanger during service in potable water. The dissolution of the emerging corrosion products of brazing filler and base material induces the migration of heavy metal ions, such as Cu2+ and Ni2+, into the potable water. The so-called liquid metal embrittlement, which takes place during the brazing process, may intensify the corrosion. The brazing filler infiltrates the stainless steel along the grain boundaries and causes an embrittlement. This paper deals with the determination of the grain boundary erosion dependent on the degree of deformation and heat treatment of the stainless steel AISI 316L.

Thin semi-rigid coaxial cables for cryogenics applications

NASA Astrophysics Data System (ADS)

Kushino, Akihiro; Kasai, Soichi

2013-03-01

We have developed cryogenic coaxial cables for low temperature signal readout from sensitive devices, such as transition edge sensors, superconducting tunnel junctions, and kinetic inductance detectors. In order to reduce heat penetration into cryogenic stages, low thermal conductivity metals were chosen for both center and outer electrical conductors. Various types of coaxial cables, employing stainless-steel, cupro-nickel, brass, beryllium-copper, phosphor-bronze, niobium, and niobium-titanium, were manufactured using drawing dies. Thermal and electrical properties were investigated between 1 and 8 K. Coaxial cables made of copper alloys showed thermal conductance roughly consistent with literature, meanwhile Nb coaxial cable must be affected by the drawing process and thermal conductance was lowered. Attenuation of superconducting Nb and NbTi coaxial cables were observed to be adequately small up to above 10 GHz compared to those of normal conducting coaxial cables, which are subject to the Wiedemann-Franz law. We also measured normal conducting coaxial cables with silver-plated center conductors to improve high frequency performance.

Vacancy clustering and its dissociation process in electroless deposited copper films studied by monoenergetic positron beams

NASA Astrophysics Data System (ADS)

Uedono, A.; Yamashita, Y.; Tsutsui, T.; Dordi, Y.; Li, S.; Oshima, N.; Suzuki, R.

2012-05-01

Positron annihilation was used to probe vacancy-type defects in electroless deposited copper films. For as-deposited films, two different types of vacancy-type defects were found to coexist; these were identified as vacancy aggregates (V3-V4) and larger vacancy clusters (˜V10). After annealing at about 200 °C, the defects started to diffuse toward the surface and aggregate. The same tendency has been observed for sulfur only, suggesting the formation of complexes between sulfur and vacancies. The defect concentration near the Cu/barrier-metal interface was high even after annealing above 600 °C, and this was attributed to an accumulation of vacancy-impurity complexes. The observed defect reactions were attributed to suppression of the vacancy diffusion to sinks through the formation of impurity-vacancy complexes. It was shown that electroless plating has a high potential to suppress the formation of voids/hillocks caused by defect migration.

Application of lower aliphatic alcohols as reducing agents for increasing efficiency of the LCLD process

NASA Astrophysics Data System (ADS)

Semenok, Dmitrii

2014-05-01

A method is described that is promising for application metal conductors on ceramic substrates during printed-circuit boards (PCBs) production without masking plate. The main idea of laser-induced metal deposition from solution (LCLD) consists of implementation of chemical micro reactor by using a focused laser beam. In this reactor the red/ox reaction would be initiated due to heating of a reaction medium. We used a 532 nm DPSS laser (power: 2100 mW) and water solutions of organic alcohols with low molecular weight, ethanol and isopropanol as reductants. The results of deposition were studied using the SEM, EDX methods and impedance spectroscopy. The equivalent resistance-capacitance circuit of copper tracks was constructed. The experiments showed that increasing the rate of deposition of nanostructured copper tracks up to 50 μm/s with electrical resistivity 5 Ohm/cm is possible by replacing the well-known reductants such as formaldehyde and D-sorbitol with iso-propanol.

Reliability analysis of different structure parameters of PCBA under drop impact

NASA Astrophysics Data System (ADS)

Liu, P. S.; Fan, G. M.; Liu, Y. H.

2018-03-01

The establishing process of PCBA is modelled by finite element analysis software ABAQUS. Firstly, introduce the Input-G method and the fatigue life under drop impact are introduced and the mechanism of the solder joint failure in the process of drop is analysed. The main reason of solder joint failure is that the PCB component is suffering repeated tension and compression stress during the drop impact. Finally, the equivalent stress and peel stress of different solder joint and plate-level components under different impact acceleration are also analysed. The results show that the reliability of tin-silver copper joint is better than that of tin- lead solder joint, and the fatigue life of solder joint expectancy decrease as the impact pulse amplitude increases.

High performance fuel electrodes fabricated by electroless plating of copper on BaZr0.8Ce0.1Y0.1O3-δ proton-conducting ceramic

NASA Astrophysics Data System (ADS)

Patki, Neil S.; Way, J. Douglas; Ricote, Sandrine

2017-10-01

The stability of copper at high temperatures in reducing and hydrocarbon-containing atmospheres makes it a good candidate for fabricating fuel electrodes on proton-conducting ceramics, such as BaZr0.9-xCexY0.1O3-δ (BZCY). In this work, the electrochemical performance of Cu-based electrodes fabricated by electroless plating (ELP) on BaZr0.8Ce0.1Y0.1O3-δ is studied with impedance spectroscopy. Three activation catalysts (Pd, Ru, and Cu) are investigated and ELP is compared to a commercial Cu paste (ESL 2312-G) for electrode fabrication. The area specific resistances (ASR) for Pd, Ru, and Cu activations at 700 °C in moist 5% H2 in Ar are 2.1, 3.2, and 13.4 Ω cm2, respectively. That is a 1-2 orders of magnitude improvement over the commercial Cu paste (192 Ω cm2). Furthermore, the ASR has contributions from electrode processes and charge transfer at the electrode/electrolyte interface. Additionally, the morphology of the as-fabricated electrode is unaffected by the activation catalyst. However, heat treatment at 750 °C in H2 for 24 h leads to sintering and large reorganization of the electrode fabricated with Cu activation (micron sized pores seen in the tested sample), while Pd and Ru activations are immune to such reorganization. Thus, Pd and Ru are identified as candidates for future work with improvements to charge transfer required for the former, and better electrode processes required for the latter.

Combined Mini-Cylex & Disk Acceleration Tests in Type K Copper

DOE PAGES

Maines, Warren Russell; Kittell, David E.; Hobbs, Michael L.

2018-04-16

In this work, we combined the miniature cylinder expansion test (Mini-Cylex), with the Disk Acceleration Test (DAX) using Type K copper, Picatinny Liquid Explosive, and photonic Doppler velocimetry. We estimated the CJ state using plate reverberation methods at the test cap. We extracted velocities at 2, 7, and 10 volume expansions to fit Jones-Wilkins-Lee Equation of State and estimated Gurney velocity at the tube wall. The test also provides an additional method to estimate reaction products Hugoniot through knowledge of the copper test cap. Our experiments and simulations are within expected uncertainty. Lastly, the test and the analysis effectively reducemore » costs while keeping or increasing fidelity.« less

Combined Mini-Cylex & Disk Acceleration Tests in Type K Copper

DOE Office of Scientific and Technical Information (OSTI.GOV)

Maines, Warren Russell; Kittell, David E.; Hobbs, Michael L.

In this work, we combined the miniature cylinder expansion test (Mini-Cylex), with the Disk Acceleration Test (DAX) using Type K copper, Picatinny Liquid Explosive, and photonic Doppler velocimetry. We estimated the CJ state using plate reverberation methods at the test cap. We extracted velocities at 2, 7, and 10 volume expansions to fit Jones-Wilkins-Lee Equation of State and estimated Gurney velocity at the tube wall. The test also provides an additional method to estimate reaction products Hugoniot through knowledge of the copper test cap. Our experiments and simulations are within expected uncertainty. Lastly, the test and the analysis effectively reducemore » costs while keeping or increasing fidelity.« less

Fabrication of GRCop-84 Rocket Thrust Chambers

NASA Technical Reports Server (NTRS)

Loewenthal, William; Ellis, David

2006-01-01

GRCop-84, a copper alloy, Cu-8 at% Cr-4 at% Nb developed at NASA Glenn Research Center for regenerative1y cooled rocket engine liners has excellent combinations of elevated temperature strength, creep resistance, thermal conductivity and low cycle fatigue. GRCop-84 is produced from pre-alloyed atomized powder and has been fabricated into plate, sheet and tube forms as well as near net shapes. Fabrication processes to produce demonstration rocket combustion chambers will be presented and includes powder production, extruding, rolling, forming, friction stir welding, and metal spinning. GRCop-84 has excellent workability and can be readily fabricated into complex components using conventional powder and wrought metallurgy processes. Rolling was examined in detail for process sensitivity at various levels of total reduction, rolling speed and rolling temperature representing extremes of commercial processing conditions. Results indicate that process conditions can range over reasonable levels without any negative impact to properties.

Fabrication of GRCop-84 Rocket Thrust Chambers

NASA Technical Reports Server (NTRS)

Loewenthal, William S.; Ellis, David L.

2005-01-01

GRCop-84, a copper alloy, Cu-8 at% Cr-4 at% Nb developed at NASA Glenn Research Center for regeneratively cooled rocket engine liners has excellent combinations of elevated temperature strength, creep resistance, thermal conductivity and low cycle fatigue. GRCop-84 is produced from prealloyed atomized powder and has been fabricated into plate, sheet and tube forms as well as near net shapes. Fabrication processes to produce demonstration rocket combustion chambers will be presented and includes powder production, extruding, rolling, forming, friction stir welding, and metal spinning. GRCop-84 has excellent workability and can be readily fabricated into complex components using conventional powder and wrought metallurgy processes. Rolling was examined in detail for process sensitivity at various levels of total reduction, rolling speed and rolling temperature representing extremes of commercial processing conditions. Results indicate that process conditions can range over reasonable levels without any negative impact to properties.

Studies on the reduction of radon plate-out

DOE Office of Scientific and Technical Information (OSTI.GOV)

Bruemmer, M.; Nakib, M.; Calkins, R.

The decay of common radioactive gases, such as radon, produces stable isotopes by a sequence of daughter particles with varied half-lives. These daughter particles are a significant source of gamma, neutron, and alpha (α) particle backgrounds that can mimic desired signals in dark matter and neutrinoless double beta decay experiments. In the LUMINA Laboratory at Southern Methodist University (SMU), studies of radon plate-out onto copper samples are conducted using one of XIA’s first five UltraLo 1800 alpha counters. We present results from investigations into various mitigation approaches. A custom-built copper holder (in either plastic or metal) has been designed andmore » produced to maximize the copper’s exposure to {sup 220}Rn. The {sup 220}Rn source is a collection of camping lantern mantles. We present the current status of control and experimental methods for addressing radon exposure levels.« less

Three-dimensional atlas of iron, copper, and zinc in the mouse cerebrum and brainstem.

PubMed

Hare, Dominic J; Lee, Jason K; Beavis, Alison D; van Gramberg, Amanda; George, Jessica; Adlard, Paul A; Finkelstein, David I; Doble, Philip A

2012-05-01

Atlases depicting molecular and functional features of the brain are becoming an integral part of modern neuroscience. In this study we used laser ablation-inductively coupled plasma-mass spectrometry (LA-ICPMS) to quantitatively measure iron (Fe), copper (Cu), and zinc (Zn) levels in a serially sectioned C57BL/6 mouse brain (cerebrum and brainstem). Forty-six sections were analyzed in a single experiment of approximately 158 h in duration. We constructed a 46-plate reference atlas by aligning quantified images of metal distribution with corresponding coronal sections from the Allen Mouse Brain Reference Atlas. The 46 plates were also used to construct three-dimensional models of Fe, Cu, and Zn distribution. This atlas represents the first reconstruction of quantitative trace metal distribution through the brain by LA-ICPMS and will facilitate the study of trace metals in the brain and help to elucidate their role in neurobiology.

Cleaning and passivation of copper surfaces to remove surface radioactivity and prevent oxide formation

NASA Astrophysics Data System (ADS)

Hoppe, E. W.; Seifert, A.; Aalseth, C. E.; Bachelor, P. P.; Day, A. R.; Edwards, D. J.; Hossbach, T. W.; Litke, K. E.; McIntyre, J. I.; Miley, H. S.; Schulte, S. M.; Smart, J. E.; Warren, G. A.

2007-08-01

High-purity copper is an attractive material for constructing ultra-low-background radiation measurement devices. Many low-background experiments using high-purity copper have indicated surface contamination emerges as the dominant background. Radon daughters plate out on exposed surfaces, leaving a residual 210Pb background that is difficult to avoid. Dust is also a problem; even under cleanroom conditions, the amount of U and Th deposited on surfaces can represent the largest remaining background. To control these backgrounds, a copper cleaning chemistry has been developed. Designed to replace an effective, but overly aggressive concentrated nitric acid etch, this peroxide-based solution allows for a more controlled cleaning of surfaces. The acidified hydrogen peroxide solution will generally target the Cu +/Cu 2+ species which are the predominant surface participants, leaving the bulk of copper metal intact. This preserves the critical tolerances of parts and eliminates significant waste disposal issues. Accompanying passivation chemistry has also been developed that protects copper surfaces from oxidation. Using a high-activity polonium surface spike, the most difficult-to-remove daughter isotope of radon, the performance of these methods are quantified.

Qualification of Bonding Process of Temperature Sensors to Extreme Temperature Deep Space Missions

NASA Technical Reports Server (NTRS)

Ramesham, Rajeshuni; Kitiyakara, Amarit; Redick, Richard; Sunada, Eric T.

2011-01-01

A process has been explored based on the state-of-the-art technology to bond the platinum resistance thermometer (PRT) on to potential aerospace material such as a flat aluminum surface and a flexible copper tube to simulate coaxial cable for the flight applications. Primarily, PRTs were inserted into a metal plated copper braid to avoid stresses on the sensor while attaching the sensor with braid to the base material for long duration deep space missions. Appropriate pretreatment has been implemented in this study to enhance the adhesion of the PRTs to the base material. NuSil product has been chosen in this research to attach PRT to the base materials. The resistance (approx.1.1 k(Omega)) of PRTs has been electrically monitored continuously during the qualification thermal cycling testing from -150 C to +120 C and -100 C to -35 C. The test hardware has been thermal cycled three times the mission life per JPL design principles for JUNO project. No PRT failures were observed during and after the PRT thermal cycling qualification test for extreme temperature environments. However, there were some failures associated with staking of the PRT pig tails as a result of thermal cycling qualification test.

The interaction of copper ions with Staphylococcus aureus, Pseudomonas aeruginosa, and Escherichia coli: an X-ray absorption near-edge structure (XANES) spectroscopy study.

PubMed

Zanzen, Ulrike; Bovenkamp-Langlois, Lisa; Klysubun, Wantana; Hormes, Josef; Prange, Alexander

2018-04-01

The antimicrobial properties of copper ions have been known for a long time. However, the exact mechanism of action of the transition metal on microorganisms has long been unclear. X-ray absorption near-edge structure (XANES) spectroscopy at the Cu K edge allows the determination of copper speciation in Staphylococcus aureus, Escherichia coli, and Pseudomonas aeruginosa that have been treated with Cu(II) and Cu(I) solutions. The death/inactivation of the bacteria was observed using plate counting and light microscopy. The Cu K-XANES spectra of the two Gram-negative bacteria are different than those of the Gram-positive strain. The results clearly show that the Cu + -S bond contributes to the antibacterial activity of copper, as in the case of silver. The detailed evaluation of the differentiated absorption spectra shows that Cu + (not Cu 2+ ) is the dominant ion that binds to the bacteria. Because Cu + is not the most common copper ion, copper is not as effective an antibacterial agent as silver, whose common valency is actually + 1. Any reaction of copper with phosphorus from the bacteria can be excluded after the evaluation of the absorption spectra.

Fabrication of a highly oriented line structure on an aluminum surface and the nanoscale patterning on the nanoscale structure using highly functional molecules

DOE Office of Scientific and Technical Information (OSTI.GOV)

Watanabe, Y.; Kato, H.; Takemura, S.

2009-07-15

The surface of an Al plate was treated with a combination of chemical and electrochemical processes for fabrication of surface nanoscale structures on Al plates. Chemical treatments by using acetone and pure water under supersonic waves were conducted on an Al surface. Additional electrochemical process in H{sub 2}SO{sub 4} solution created a finer and oriented nanoscale structure on the Al surface. Dynamic force microscopy (DFM) measurement clarified that the nanoscale highly oriented line structure was successfully created on the Al surface. The line distance was estimated approximately 30-40 nm. At the next stage, molecular patterning on the highly oriented linemore » structure by functional molecules such as copper phthalocyanine (CuPc) and fullerene C{sub 60} was also conducted. CuPc or C{sub 60} molecules were deposited on the highly oriented line structure on Al. A toluene droplet containing CuPc molecules was cast on the nanostructured Al plate and was extended on the surface. CuPc or C{sub 60} deposition on the nanostructured Al surface proceeded by evaporation of toluene. DFM and x-ray photoemission spectroscopy measurements demonstrated that a unique molecular pattern was fabricated so that the highly oriented groove channels were filled with the functional molecules.« less

Report on accelerated corrosion studies.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Mowry, Curtis Dale; Glass, Sarah Jill; Sorensen, Neil Robert

2011-03-01

Sandia National Laboratories (SNL) conducted accelerated atmospheric corrosion testing for the U.S. Consumer Product Safety Commission (CPSC) to help further the understanding of the development of corrosion products on conductor materials in household electrical components exposed to environmental conditions representative of homes constructed with problem drywall. The conditions of the accelerated testing were chosen to produce corrosion product growth that would be consistent with long-term exposure to environments containing humidity and parts per billion (ppb) levels of hydrogen sulfide (H{sub 2}S) that are thought to have been the source of corrosion in electrical components from affected homes. This report documentsmore » the test set-up, monitoring of electrical performance of powered electrical components during the exposure, and the materials characterization conducted on wires, screws, and contact plates from selected electrical components. No degradation in electrical performance (measured via voltage drop) was measured during the course of the 8-week exposure, which was approximately equivalent to 40 years of exposure in a light industrial environment. Analyses show that corrosion products consisting of various phases of copper sulfide, copper sulfate, and copper oxide are found on exposed surfaces of the conductor materials including wires, screws, and contact plates. The morphology and the thickness of the corrosion products showed a range of character. In some of the copper wires that were observed, corrosion product had flaked or spalled off the surface, exposing fresh metal to the reaction with the contaminant gasses; however, there was no significant change in the wire cross-sectional area.« less

78 FR 7394 - Foreign-Trade Zone 41-Milwaukee, WI; Notification of Proposed Production Activity; CNH America...

Federal Register 2010, 2011, 2012, 2013, 2014

2013-02-01

.... On its domestic sales, CNH would be able to choose the duty rates during customs entry procedures... hoses, copper alloy adapters, aluminum plates, feed filters, GPS kits including electrical connections...

Measurement of dew droplets in initial deposition at dew point by using a phase-shift interference microscope

NASA Astrophysics Data System (ADS)

Matsumoto, Shigeaki; Toyooka, Satoru; Hoshino, Mitsuo

2002-09-01

In order to measure the total mass per unit area of dew droplets deposited on a metal plate in the dew-point hygrometer, the shape of a dew droplet deposited on a copper plate was measured accurately by using an interference microscope that employed a phase-shift technique. The microscope was constructed by adding a piezoelectric transducer to an usual interference microscope. A simple method that uses a conventional speaker horn and an optical fiber cable was introduced to depress speckle noise. The shape of a dew droplet deposited on the copper plate surface with 0.1 μm in average roughness was measured with an accuracy of +/-3nm. The mass of a dew droplet could be calculated numerically from the volume of its shape and was of the order of 10-9 g. The total mass of dew droplets deposited per unit area and the deposition velocity were obtained under a gentle wind. The total mass was the order of 10-5 g/cm2 at the beginning of deposition and the deposition velocity was ranged from 2x10-6 to 6x10-5 g/cm2.min.

Electroless Plating of Copper on Polyimide Film Modified by 50 Hz Plasma Graft Polymerization with 1-Vinylimidazole

NASA Astrophysics Data System (ADS)

Wong, Chiow San; Lem, Hon Pong; Goh, Boon Tong; Wong, Cin Wie

2009-03-01

This paper reports on the proof of concept work on the novel process of producing metalized polyimide (PI) film by coating a layer of copper (Cu) thin film on the surface of the PI film without using any adhesive. The method which is employed to produce a metalized PI film used in flexible printed circuit (FPC) is based on plasma graft polymerization of 1-vinlyimidazole (VIDz) on plasma pre-treated PI surface. The plasma grafted PI film (VIDz-g-PI) surfaces are characterized by X-ray photoelectron spectroscopy (XPS), atomic force microscopy (AFM), and scanning electron microscopy (SEM). AFM results show that the PI film surface has been successfully treated and grafted with VIDz. As post-thermal treatment is known to promote adhesion strength between the metallic film and the PI surface, the effects of post-thermal treatment environment and temperature on the adhesion property of Cu plated VIDz-g-PI (Cu/VIDz-g-PI) are evaluated. Post-thermal treatment in air shows better adhesion strength than in vacuum. The adhesion strength decreases as the post-thermal treatment temperature is increased. In the present development work, the adhesion strength obtained has met the initial market targeted 9-10 N/cm adhesion strength. Samples obtained at a pre-selected plasma power and time window are able to maintain their adhesion strength after being subjected to ageing at 100 °C for 168 h.

Indoor test for thermal performance evaluation of Lenox-Honeywell solar collector. [conducted using Marshall Space Flight Center Solar Simulator

NASA Technical Reports Server (NTRS)

Shih, K.

1977-01-01

The test procedures used and the test results obtained from an evaluation test program conducted on a double-covered liquid solar collector under simulated conditions are presented. The test article was a flat plate solar collector using liquid as the heat transfer medium. The absorber plate was steel with the copper tubes bonded on the upper surface. The plate was coated with black chrome with an absorptivity factor of .95 and emissivity factor of .12. A time constant test and incident angle modifier test were conducted to determine the transient effect and the incident angle effect on the collector.

Systems design of transformation toughened blast-resistant naval hull steels

NASA Astrophysics Data System (ADS)

Saha, Arup

A systems approach to computational materials design has demonstrated a new class of ultratough, weldable secondary hardened plate steels combining new levels of strength and toughness while meeting processability requirements. A first prototype alloy has achieved property goals motivated by projected naval hull applications requiring extreme fracture toughness (Cv > 85 ft-lbs (115 J) corresponding to KId > 200 ksi.in1/2 (220 MPa.m1/2)) at strength levels of 150--180 ksi (1034--1241 MPa) yield strength in weldable, formable plate steels. A theoretical design concept was explored integrating the mechanism of precipitated nickel-stabilized dispersed austenite for transformation toughening in an alloy strengthened by combined precipitation of M2C carbides and BCC copper both at an optimal ˜3nm particle size for efficient strengthening. This concept was adapted to plate steel design by employing a mixed bainitic/martensitic matrix microstructure produced by air-cooling after solution-treatment and constraining the composition to low carbon content for weldability. With optimized levels of copper and M2C carbide formers based on a quantitative strength model, a required alloy nickel content of 6.5 wt% was predicted for optimal austenite stability for transformation toughening at the desired strength level of 160 ksi (1100 MPa) yield strength. A relatively high Cu level of 3.65 wt% was employed to allow a carbon limit of 0.05 wt% for good weldability. Hardness and tensile tests conducted on the designed prototype confirmed predicted precipitation strengthening behavior in quench and tempered material. Multi-step tempering conditions were employed to achieve the optimal austenite stability resulting in significant increase of impact toughness to 130 ft-lb (176 J) at a strength level of 160 ksi (1100 MPa). Comparison with the baseline toughness-strength combination determined by isochronal tempering studies indicates a transformation toughening increment of 60% in Charpy energy. Predicted Cu particle number densities and the heterogeneous nucleation of optimal stability high Ni 5 nm austenite on nanometer-scale copper precipitates in the multi-step tempered samples was confirmed using three-dimensional atom probe microscopy. Charpy impact tests and fractography demonstrate ductile fracture with C v > 90 ft-lbs (122 J) down to -40°C, with a substantial toughness peak at 25°C consistent with designed transformation toughening behavior. The properties demonstrated in this first prototype represent a substantial advance over existing naval hull steels.

Welding of titanium and nickel alloy by combination of explosive welding and spark plasma sintering technologies

NASA Astrophysics Data System (ADS)

Malyutina, Yu. N.; Bataev, A. A.; Mali, V. I.; Anisimov, A. G.; Shevtsova, L. I.

2015-10-01

A possibility of titanium and nickel-based alloys composite materials formation using combination of explosive welding and spark plasma sintering technologies was demonstrated in the current research. An employment of interlayer consisting of copper and tantalum thin plates makes possible to eliminate a contact between metallurgical incompatible titanium and nickel that are susceptible to intermetallic compounds formation during their interaction. By the following spark plasma sintering process the bonding has been received between titanium and titanium alloy VT20 through the thin powder layer of pure titanium that is distinguished by low defectiveness and fine dispersive structure.

Welding of titanium and nickel alloy by combination of explosive welding and spark plasma sintering technologies

DOE Office of Scientific and Technical Information (OSTI.GOV)

Malyutina, Yu. N., E-mail: iuliiamaliutina@gmail.com; Bataev, A. A., E-mail: bataev@adm.nstu.ru; Shevtsova, L. I., E-mail: edeliya2010@mail.ru

A possibility of titanium and nickel-based alloys composite materials formation using combination of explosive welding and spark plasma sintering technologies was demonstrated in the current research. An employment of interlayer consisting of copper and tantalum thin plates makes possible to eliminate a contact between metallurgical incompatible titanium and nickel that are susceptible to intermetallic compounds formation during their interaction. By the following spark plasma sintering process the bonding has been received between titanium and titanium alloy VT20 through the thin powder layer of pure titanium that is distinguished by low defectiveness and fine dispersive structure.

Oscillation effects upon film boiling from a sphere.

NASA Technical Reports Server (NTRS)

Schmidt, W. E.; Witte, L. C.

1972-01-01

Heat transfer rates from a silver-plated copper sphere, 0.75 in. in diameter, were studied by high speed photography during oscillations of the sphere in saturated liquid nitrogen and Freon-11. The oscillation frequencies ranged from zero to 13 Hz, and the amplitude-to-diameter ratio varied from zero to 2.67. The sphere was supported by a thin-walled stainless steel tube and carried a thermocouple attached near the lower stagnation point. A Fastax WF-3 16mm movie camera was used at about 2000 frames/sec. The differences in the vapor removal process at lower and higher oscillation frequencies are discussed.

An Insoluble Titanium-Lead Anode for Sulfate Electrolytes

DOE Office of Scientific and Technical Information (OSTI.GOV)

Ferdman, Alla

2005-05-11

The project is devoted to the development of novel insoluble anodes for copper electrowinning and electrolytic manganese dioxide (EMD) production. The anodes are made of titanium-lead composite material produced by techniques of powder metallurgy, compaction of titanium powder, sintering and subsequent lead infiltration. The titanium-lead anode combines beneficial electrochemical behavior of a lead anode with high mechanical properties and corrosion resistance of a titanium anode. In the titanium-lead anode, the titanium stabilizes the lead, preventing it from spalling, and the lead sheathes the titanium, protecting it from passivation. Interconnections between manufacturing process, structure, composition and properties of the titanium-lead compositemore » material were investigated. The material containing 20-30 vol.% of lead had optimal combination of mechanical and electrochemical properties. Optimal process parameters to manufacture the anodes were identified. Prototypes having optimized composition and structure were produced for testing in operating conditions of copper electrowinning and EMD production. Bench-scale, mini-pilot scale and pilot scale tests were performed. The test anodes were of both a plate design and a flow-through cylindrical design. The cylindrical anodes were composed of cylinders containing titanium inner rods and fitting over titanium-lead bushings. The cylindrical design allows the electrolyte to flow through the anode, which enhances diffusion of the electrolyte reactants. The cylindrical anodes demonstrate higher mass transport capabilities and increased electrical efficiency compared to the plate anodes. Copper electrowinning represents the primary target market for the titanium-lead anode. A full-size cylindrical anode performance in copper electrowinning conditions was monitored over a year. The test anode to cathode voltage was stable in the 1.8 to 2.0 volt range. Copper cathode morphology was very smooth and uniform. There was no measurable anode weight loss during this time period. Quantitative chemical analysis of the anode surface showed that the lead content after testing remained at its initial level. No lead dissolution or transfer from the anode to the product occurred.A key benefit of the titanium-lead anode design is that cobalt additions to copper electrolyte should be eliminated. Cobalt is added to the electrolyte to help stabilize the lead oxide surface of conventional lead anodes. The presence of the titanium intimately mixed with the lead should eliminate the need for cobalt stabilization of the lead surface. The anode should last twice as long as the conventional lead anode. Energy savings should be achieved due to minimizing and stabilizing the anode-cathode distance in the electrowinning cells. The anode is easily substitutable into existing tankhouses without a rectifier change.The copper electrowinning test data indicate that the titanium-lead anode is a good candidate for further testing as a possible replacement for a conventional lead anode. A key consideration is the cost. Titanium costs have increased. One of the ways to get the anode cost down is manufacturing the anodes with fewer cylinders. Additional prototypes having different number of cylinders were constructed for a long-term commercial testing in a circuit without cobalt. The objective of the testing is to evaluate the need for cobalt, investigate the effect of decreasing the number of cylinders on the anode performance, and to optimize further the anode design in order to meet the operating requirements, minimize the voltage, maximize the life of the anode, and to balance this against a reasonable cost for the anode. It is anticipated that after testing of the additional prototypes, a whole cell commercial test will be conducted to complete evaluation of the titanium-lead anode costs/benefits.« less

Three reversible polymorphic copper(I) complexes triggered by ligand conformation: insights into polymorphic crystal habit and luminescent properties.

PubMed

Chai, Wenxiang; Hong, Mingwei; Song, Li; Jia, Guohua; Shi, Hongsheng; Guo, Jiayu; Shu, Kangying; Guo, Bing; Zhang, Yicheng; You, Wenwu; Chen, Xueyuan

2015-05-04

Three luminescent polymorphs based on a new copper(I) complex Cu(2-QBO)(PPh3)PF6 (1, PPh3 = triphenylphosphine, 2-QBO = 2-(2'-quinolyl)benzoxazole) have been synthesized and characterized by FT-IR, UV-vis, elemental analyses, and single-crystal X-ray diffraction analyses. Each polymorph can reversibly convert from one to another through appropriate procedures. Interestingly, such interconversion can be distinguished by their intrinsic crystal morphologies and colors (namely α, dark yellow plate, β, orange block, γ, light yellow needle) as well as photoluminescent (PL) properties. X-ray crystal structure analyses of these three polymorphs show three different supramolecular structures from 1D to 3D, which are expected to be responsible for the formation of three different crystal morphologies such as needle, plate, and block. Combination of the experimental data with DFT calculations on these three polymorphs reveals that the polymorphic interconversion is triggered by the conformation isomerization of the 2-QBO ligand and can be successfully controlled by the polarity of the process solvents (affecting the molecular dipole moment) and thermodynamics (affecting the molecular total energy). It is also found that the different crystal colors of polymorphs and their PL properties are derived from different θ values (dihedral angle between benzoxazolyl and quinolyl group of the 2-QBO ligand) and P-Cu-P angles based on TD-DFT calculations. Moreover, an interesting phase interconversion between γ and β has also been found under different temperature, and this result is consistent with the DFT calculations in which the total energy of β is larger than that of γ. This polymorphism provides a good model to study the relationship between the structure and the physical properties in luminescent copper(I) complexes as well as some profound insights into their PL properties.

Selective coating for collecting solar energy on aluminum

NASA Technical Reports Server (NTRS)

Lowery, J. R.

1974-01-01

Presently used coatings, which were originally developed for brass, copper, and steel substrates, yield relatively low absorptance/emittance ratios when applied to aluminum. Efficient, black-nickel plating applied to aluminum substrate enhances solar absorptance to 93% and reduces emittance to 6%.

77 FR 12556 - Certain Steel Nails From the People's Republic of China: Final Results and Final Partial...

Federal Register 2010, 2011, 2012, 2013, 2014

2012-03-01

..., respectively. Case History On September 12, 2011, the Department published in the Federal Register the... Comment 6: Stanley's Surrogate Values A. Copper Plated Steel Welding Wire B. Sodium Sulfate C. Glass Balls...

Transient thermal analysis during friction stir welding between AA2014-T6 and pure copper

NASA Astrophysics Data System (ADS)

Gadhavi, A. R.; Ghetiya, N. D.; Patel, K. M.

2018-04-01

AA2xxx-Cu alloys showed larger applications in the defence sectors and in aerospace industries due to high strength to weight ratio and toughness. FSW in a butt joint configuration was carried out between AA2014-T6 and pure Copper placing AA2014 on AS and Cu on RS. Temperature profiles were observed by inserting K-type thermocouples in the mid-thickness at various locations of the plate. A sharp decrease in temperature profiles was observed on Copper side due to its higher thermal conductivity. A thermal numerical model was prepared in ANSYS to compare the simulated temperature profiles with the experimental temperature profiles and both the temperature profiles were found to be in good agreement.

Model of the porphyry copper and polymetallic vein family of deposits - Applications in Slovakia, Hungary, and Romania

USGS Publications Warehouse

Drew, L.J.

2003-01-01

A tectonic model useful in estimating the occurrence of undiscovered porphyry copper and polymetallic vein systems has been developed. This model is based on the manner in which magmatic and hydrothermal fluids flow and are trapped in fault systems as far-field stress is released in tectonic strain features above subducting plates (e.g. strike-slip fault systems). The structural traps include preferred locations for stock emplacement and tensional-shear fault meshes within the step-overs that localize porphyry- and vein-style deposits. The application of the model is illustrated for the porphyry copper and polymetallic vein deposits in the Central Slovakian Volcanic Field, Slovakia; the Ma??tra Mountains, Hungary; and the Apuseni Mountains, Romania.

Star tracking reticles

NASA Technical Reports Server (NTRS)

Smith, W. O.; Toft, A. R. (Inventor)

1973-01-01

A method for the production of reticles, particularly those for use in outer space, where the product is a quartz base coated with highly adherent layers of chromium, chromium-silver, and silver vacuum deposited through a mask, and then coated with an electrodeposit of copper from a copper sulfate solution followed by an electrodeposit of black chromium is described. The masks are produced by coating a beryllium-copper alloy substrate with a positive working photoresist, developing the photoresist, according to a pattern to leave a positive mask, plating uncoated areas with gold, removing the photoresist, coating the substrate with a negative working photoresist, developing the negative working photoresist to expose the base metal of the pattern, and chemically etching the unplated side of the pattern to produce the mask.

Thermal conductance of gold plated metallic contacts at liquid helium temperatures

NASA Technical Reports Server (NTRS)

Kittel, Peter; Spivak, Alan L.; Salerno, Louis J.

1992-01-01

The thermal conductance of gold plated OFHC copper, 6061-T6 aluminum, free-machining brass, and 304 stainless steel contacts has been measured over the temperature range of 1.6 to 4.2 K, with applied forces from 22 N to 670 N. The contact surfaces were prepared with a 0.8 micron lapped finish prior to gold coating. It was found that for all materials, except stainless steel, the thermal conductance was significantly improved as the result of gold coating the contact surfaces.

Ionization chamber dosimeter

DOEpatents

Renner, Tim R.; Nyman, Mark A.; Stradtner, Ronald

1991-01-01

A method for fabricating an ion chamber dosimeter collecting array of the type utilizing plural discrete elements formed on a uniform collecting surface which includes forming a thin insulating layer over an aperture in a frame having surfaces, forming a predetermined pattern of through holes in the layer, plating both surfaces of the layer and simultaneously tilting and rotating the frame for uniform plate-through of the holes between surfaces. Aligned masking and patterned etching of the surfaces provides interconnects between the through holes and copper leads provided to external circuitry.

CALUTRON ION SOURCE

DOEpatents

Lofgren, E.J.

1959-02-17

An improvement is described in ion source mechanisms whereby the source structure is better adapted to withstanid the ravages of heat, erosion, and deterioration concomitant with operation of an ion source of the calutron type. A pair of molybdenum plates define the exit opening of the arc chamber and are in thermal contact with the walls of the chamber. These plates are maintained at a reduced temperature by a pair of copper blocks in thermal conducting contact therewith to form subsequent diverging margins for the exit opening.

Storing Drinking-water in Copper pots Kills Contaminating Diarrhoeagenic Bacteria

PubMed Central

Sudha, V.B. Preethi; Ganesan, Sheeba; Pazhani, G.P.; Ramamurthy, T.; Nair, G.B.

2012-01-01

Microbially-unsafe water is still a major concern in most developing countries. Although many water-purification methods exist, these are expensive and beyond the reach of many people, especially in rural areas. Ayurveda recommends the use of copper for storing drinking-water. Therefore, the objective of this study was to evaluate the effect of copper pot on microbially-contaminated drinking-water. The antibacterial effect of copper pot against important diarrhoeagenic bacteria, including Vibrio cholerae O1, Shigella flexneri 2a, enterotoxigenic Escherichia coli, enteropathogenic E. coli, Salmonella enterica Typhi, and Salmonella Paratyphi is reported. When drinking-water (pH 7.83±0.4; source: ground) was contaminated with 500 CFU/mL of the above bacteria and stored in copper pots for 16 hours at room temperature, no bacteria could be recovered on the culture medium. Recovery failed even after resuscitation in enrichment broth, followed by plating on selective media, indicating loss of culturability. This is the first report on the effect of copper on S. flexneri 2a, enteropathogenic E. coli, and Salmonella Paratyphi. After 16 hours, there was a slight increase in the pH of water from 7.83 to 7.93 in the copper pots while the other physicochemical parameters remained unchanged. Copper content (177±16 ppb) in water stored in copper pots was well within the permissible limits of the World Health Organization. Copper holds promise as a point-of-use solution for microbial purification of drinking-water, especially in developing countries. PMID:22524115

Storing drinking-water in copper pots kills contaminating diarrhoeagenic bacteria.

PubMed

Sudha, V B Preethi; Ganesan, Sheeba; Pazhani, G P; Ramamurthy, T; Nair, G B; Venkatasubramanian, Padma

2012-03-01

Microbially-unsafe water is still a major concern in most developing countries. Although many water-purification methods exist, these are expensive and beyond the reach of many people, especially in rural areas. Ayurveda recommends the use of copper for storing drinking-water. Therefore, the objective of this study was to evaluate the effect of copper pot on microbially-contaminated drinking-water. The antibacterial effect of copper pot against important diarrhoeagenic bacteria, including Vibrio cholerae O1, Shigella flexneri 2a, enterotoxigenic Escherichia coli, enteropathogenic E. coli, Salmonella enterica Typhi, and Salmonella Paratyphi is reported. When drinking-water (pH 7.83 +/- 0.4; source: ground) was contaminated with 500 CFU/mL of the above bacteria and stored in copper pots for 16 hours at room temperature, no bacteria could be recovered on the culture medium. Recovery failed even after resuscitation in enrichment broth, followed by plating on selective media, indicating loss of culturability. This is the first report on the effect of copper on S. flexneri 2a, enteropathogenic E. coli, and Salmonella Paratyphi. After 16 hours, there was a slight increase in the pH of water from 7.83 to 7.93 in the copper pots while the other physicochemical parameters remained unchanged. Copper content (177 +/- 16 ppb) in water stored in copper pots was well within the permissible limits of the World Health Organization. Copper holds promise as a point-of-use solution for microbial purification of drinking-water, especially in developing countries.

Development of technique for air coating and nickel and copper metalization of solar cells

NASA Technical Reports Server (NTRS)

1982-01-01

Solar cells were made with a variety of base metal screen printing inks applied over silicon nitride AR coating and copper electroplated. Fritted and fritless nickel and fritless tin base printing inks were evaluated. Conversion efficiencies as high as 9% were observed with fritted nickel ink contacts, however, curve shapes were generally poor, reflecting high series resistance. Problems encountered in addition to high series reistance included loss of adhesion of the nickel contacts during plating and poor adhesion, oxidation and inferior curve shapes with the tin base contacts.

85. HENNESSY'S DEPARTMENT STORE (130 NORTH MAIN, 18971898) IS A ...

Library of Congress Historic Buildings Survey, Historic Engineering Record, Historic Landscapes Survey

85. HENNESSY'S DEPARTMENT STORE (130 NORTH MAIN, 1897-1898) IS A STEEL FRAME AND BRICK STRUCTURE DESIGNED BY FREDERICK KEES OF MINNEAPOLIS. IT HAS INLAID MARBLE TILES IN THE HALLS, AND PLATE GLASS WINDOWS FRAMED IN COPPER ON THE FIRST AND SECOND FLOORS. THERE IS ALSO A CAST-IRON AND ORNAMENTAL GLASS LOWER LEVEL AND TERRA-COTTA DETAILING AROUND THE WINDOWS. THE ENTRANCE IS AN ELLIPTICAL ARCH WITH IRON GRILL WORK. - Butte Historic District, Bounded by Copper, Arizona, Mercury & Continental Streets, Butte, Silver Bow County, MT

61. Hennessy's Department Store (130 North Main, 18971898) is a ...

Library of Congress Historic Buildings Survey, Historic Engineering Record, Historic Landscapes Survey

61. Hennessy's Department Store (130 North Main, 1897-1898) is a steel frame and brick structure designed by Frederick Kees of Minneapolis. It has inlaid marble tiles in the halls, and plate glass windows framed in copper on the first and second floors. There is also a cast-iron and ornamental glass lower level and terra-cotta detailing around the windows. The entrance is an eliptical arch with iron grill work. - Butte Historic District, Bounded by Copper, Arizona, Mercury & Continental Streets, Butte, Silver Bow County, MT

Through-silicon via plating void metrology using focused ion beam mill

NASA Astrophysics Data System (ADS)

Rudack, A. C.; Nadeau, J.; Routh, R.; Young, R. J.

2012-03-01

3D IC integration continues to increase in complexity, employing advanced interconnect technologies such as throughsilicon vias (TSVs), wafer-to-wafer (W2W) bonding, and multi-chip stacking. As always, the challenge with developing new processes is to get fast, effective feedback to the integration engineer. Ideally this data is provided by nondestructive in-line metrology, but this is not always possible. For example, some form of physical cross-sectioning is still the most practical way to detect and characterize TSV copper plating voids. This can be achieved by cleaving, followed by scanning electron microscope (SEM) inspection. A more effective physical cross-sectioning method has been developed using an automated dual-beam focused ion beam (FIB)-SEM system, in which multiple locations can be sectioned and imaged while leaving the wafer intact. This method has been used routinely to assess copper plating voids over the last 24 months at SEMATECH. FIB-SEM feedback has been used to evaluate new plating chemistries, plating recipes, and process tool requalification after downtime. The dualbeam FIB-SEM used for these studies employs a gallium-based liquid metal ion source (LMIS). The overall throughput of relatively large volumes being milled is limited to 3-4 hours per section due to the maximum available beam current of 20 nA. Despite the larger volumetric removal rates of other techniques (e.g., mechanical polishing, broad-ion milling, and laser ablation), the value of localized, site-specific, and artifact-free FIB milling is well appreciated. The challenge, therefore, has been to reap the desired FIB benefits, but at faster volume removal rates. This has led to several system and technology developments for improving the throughput of the FIB technique, the most recent being the introduction of FIBs based on an inductively coupled plasma (ICP) ion source. The ICP source offers much better performance than the LMIS at very high beam currents, enabling more than 1 μA of ion beam current for fast material removal. At a lower current, the LMIS outperforms the ICP source, but imaging resolution below 30 nm has been demonstrated with ICP-based systems. In addition, the ICP source allows a wide range of possible ion species, with Xe currently the milling species of choice, due to its high mass and favorable ion source performance parameters. Using a 1 μA Xe beam will have an overall milling rate for silicon some 20X higher than a Ga beam operating at 65 nA. This paper will compare the benefits already seen using the Ga-based FIB-SEM approach to TSV metrology, with the improvements in throughput and time-to-data obtained by using the faster material removal capabilities of a FIB based on an ICP ion source. Plasma FIB (PFIB) is demonstrated to be a feasible tool for TSV plating void metrology.

Thermal response of solar receiver aperture plates during sun walk-off

NASA Technical Reports Server (NTRS)

Wen, L.; Roschke, J.

1982-01-01

The tracking mechanism for a point-focusing concentrator may be subject to failure. If this should occur, the solar image will travel across the aperture plate, and it may also impinge on the adjacent support structure. Such an event is called 'sun walk-off'. The present investigation is concerned with the transient response of different aperture plate materials to the intense heating produced in a typical walk-off situation for parabolic dish concentrators. Receivers for two solar module systems are considered, including a high-temperature receiver that utilizes a 2-milliradian (mrad) concentrator, and a lower-temperature receiver which is coupled with a 4-mrad concentrator. It is found that during a walk-off situation the solar image travels in a straight line in the radial direction. The results obtained for a copper aperture plate were disappointing. It appears that passive metallic plates without cooling or other protective support cannot withstand the intense heating.

Selection of Fecal Enterococci Exhibiting tcrB-Mediated Copper Resistance in Pigs Fed Diets Supplemented with Copper † ▿

PubMed Central

Amachawadi, R. G.; Shelton, N. W.; Shi, X.; Vinasco, J.; Dritz, S. S.; Tokach, M. D.; Nelssen, J. L.; Scott, H. M.; Nagaraja, T. G.

2011-01-01

Copper, as copper sulfate, is increasingly used as an alternative to in-feed antibiotics for growth promotion in weaned piglets. Acquired copper resistance, conferred by a plasmid-borne, transferable copper resistance (tcrB) gene, has been reported in Enterococcus faecium and E. faecalis. A longitudinal field study was undertaken to determine the relationship between copper supplementation and the prevalence of tcrB-positive enterococci in piglets. The study was done with weaned piglets, housed in 10 pens with 6 piglets per pen, fed diets supplemented with a normal (16.5 ppm; control) or an elevated (125 ppm) level of copper. Fecal samples were randomly collected from three piglets per pen on days 0, 14, 28, and 42 and plated on M-Enterococcus agar, and three enterococcal isolates were obtained from each sample. The overall prevalence of tcrB-positive enterococci was 21.1% (38/180) in piglets fed elevated copper and 2.8% (5/180) in the control. Among the 43 tcrB-positive isolates, 35 were E. faecium and 8 were E. faecalis. The mean MICs of copper for tcrB-negative and tcrB-positive enterococci were 6.2 and 22.2 mM, respectively. The restriction digestion of the genomic DNA of E. faecium or E. faecalis with S1 nuclease yielded a band of ∼194-kbp size to which both tcrB and the erm(B) gene probes hybridized. A conjugation assay demonstrated cotransfer of tcrB and erm(B) genes between E. faecium and E. faecalis strains. The higher prevalence of tcrB-positive enterococci in piglets fed elevated copper compared to that in piglets fed normal copper suggests that supplementation of copper in swine diets selected for resistance. PMID:21705534

A novel graded density impactor

NASA Astrophysics Data System (ADS)

Winter, Ron; Cotton, Matthew; Harris, Ernest; Eakins, Daniel; Chapman, David

2013-06-01

Ramp loading using graded-density-impactors as flyers in plate impact experiments can yield useful information about the dynamic properties of the loaded material. Selective Laser Melting, an additive manufacture technique, was used to fabricate a graded-density flyer, termed the ``bed of nails'' (BON). A 2 mm thick x 100 mm diameter solid disc of stainless steel formed a base for an array of tapered spikes of length 6 mm and spaced 1 mm apart. Two experiments to test the concept were performed at impact velocities of 900 m/s and 1100 m/s using the 100 mm gas gun at The Institute of Shock Physics, Imperial College, London. In each experiment a BON flyer was impacted onto a copper buffer plate which helped to smooth out perturbations in the wave profile. The ramp delivered to the copper buffer was in turn transmitted to three tantalum targets of thicknesses 3, 5 and 7 mm, mounted in contact with the back face of the copper. Heterodyne velocimetry was used to measure the velocity-time history, at the back faces of the tantalum discs. The wave profiles display a smooth increase in free surface velocity over a period of about 2.5 microseconds. The measured profiles have been analysed to generate a stress vs. volume curve for tantalum.

Rupture testing for the quality control of electrodeposited copper interconnections in high-speed, high-density circuits

NASA Technical Reports Server (NTRS)

Zakraysek, Louis

1987-01-01

Printed Wiring Multilayer Board (PWMLB) structures for high speed, high density circuits are prone to failure due to the microcracking of electrolytic copper interconnections. The failure can occur in the foil that makes up the inner layer traces or in the plated through holes (PTH) deposit that forms the layer to layer interconnections. It is shown that there are some distinctive differences in the quality of Type E copper and that these differences can be detected before its use in a PWMLB. It is suggested that the strength of some Type E copper can be very low when the material is hot and that it is the use of this poor quality material in a PWMLB that results in PTH and inner layer microcracking. Since the PWMLB failure in question are induced by a thermal stress, and since the poorer grades of Type E materials used in these structures are susceptible to premature failure under thermal stress, the use of elevated temperature rupture and creep rupture testing is proposed as a means for screening copper foil, or its PTH equivalent, in order to eliminate the problem of Type E copper microcracking in advanced PWMLBs.

Cleaning and passivation of copper surfaces to remove surface radioactivity and prevent oxide formation

DOE Office of Scientific and Technical Information (OSTI.GOV)

Hoppe, Eric W.; Seifert, Allen; Aalseth, Craig E.

High-purity copper is an attractive material for constructing ultra-low-background radiation measurement devices. Many low-background experiments using high-purity copper have indicated surface contamination emerges as the dominant background. Radon daughters plate out on exposed surfaces, leaving a residual 210Pb background that is difficult to avoid. Dust is also a problem; even under cleanroom conditions, the amount of U and Th deposited on surfaces can represent the largest remaining background. To control these backgrounds, a copper cleaning chemistry has been developed. Designed to replace an effective, but overly aggressive concentrated nitric acid etch, this peroxide-based solution allows for a more controlled cleaningmore » of surfaces. The acidified hydrogen peroxide solution will generally target the Cu+/Cu2+ species which are the predominant surface participants, leaving the bulk of copper metal intact. This preserves the critical tolerances of parts and eliminates significant waste disposal issues. Accompanying passivation chemistry has also been developed that protects copper surfaces from oxidation. Using a high-activity polonium surface spike, the most difficult-to-remove daughter isotope of radon, the performance of these methods are quantified. © 2001 Elsevier Science. All rights reserved« less

Modeling pore corrosion in normally open gold- plated copper connectors.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Battaile, Corbett Chandler; Moffat, Harry K.; Sun, Amy Cha-Tien

2008-09-01

The goal of this study is to model the electrical response of gold plated copper electrical contacts exposed to a mixed flowing gas stream consisting of air containing 10 ppb H{sub 2}S at 30 C and a relative humidity of 70%. This environment accelerates the attack normally observed in a light industrial environment (essentially a simplified version of the Battelle Class 2 environment). Corrosion rates were quantified by measuring the corrosion site density, size distribution, and the macroscopic electrical resistance of the aged surface as a function of exposure time. A pore corrosion numerical model was used to predict bothmore » the growth of copper sulfide corrosion product which blooms through defects in the gold layer and the resulting electrical contact resistance of the aged surface. Assumptions about the distribution of defects in the noble metal plating and the mechanism for how corrosion blooms affect electrical contact resistance were needed to complete the numerical model. Comparisons are made to the experimentally observed number density of corrosion sites, the size distribution of corrosion product blooms, and the cumulative probability distribution of the electrical contact resistance. Experimentally, the bloom site density increases as a function of time, whereas the bloom size distribution remains relatively independent of time. These two effects are included in the numerical model by adding a corrosion initiation probability proportional to the surface area along with a probability for bloom-growth extinction proportional to the corrosion product bloom volume. The cumulative probability distribution of electrical resistance becomes skewed as exposure time increases. While the electrical contact resistance increases as a function of time for a fraction of the bloom population, the median value remains relatively unchanged. In order to model this behavior, the resistance calculated for large blooms has been weighted more heavily.« less

Industrial Tests to Modify Molten Copper Slag for Improvement of Copper Recovery

NASA Astrophysics Data System (ADS)

Guo, Zhengqi; Zhu, Deqing; Pan, Jian; Zhang, Feng; Yang, Congcong

2018-04-01

In this article, to improve the recovery of copper from copper slag by flotation process, industrial tests of the modification process involving addition of a composite additive into molten copper slag were conducted, and the modified slag was subjected to the flotation process to confirm the modification effect. The phase evolution of the slag in the modification process was revealed by thermodynamic calculations, x-ray diffraction, optical microscopy and scanning electron microscopy. The results show that more copper was transformed and enriched in copper sulfide phases. The magnetite content in the modified slag decreased, and that of "FeO" increased correspondingly, leading to a better fluidity of the molten slag, which improved the aggregation and growth of fine particles of the copper sulfide minerals. Closed-circuit flotation tests of the original and modified slags were conducted, and the results show that the copper recovery increased obviously from 69.15% to 73.38%, and the copper grade of concentrates was elevated slightly from 20.24% to 21.69%, further confirming that the industrial tests of the modification process were successful. Hence, the modification process has a bright future in industrial applications for enhancing the recovery of copper from the copper slag.

Role of copper oxides in contact killing of bacteria.

PubMed

Hans, Michael; Erbe, Andreas; Mathews, Salima; Chen, Ying; Solioz, Marc; Mücklich, Frank

2013-12-31

The potential of metallic copper as an intrinsically antibacterial material is gaining increasing attention in the face of growing antibiotics resistance of bacteria. However, the mechanism of the so-called "contact killing" of bacteria by copper surfaces is poorly understood and requires further investigation. In particular, the influences of bacteria-metal interaction, media composition, and copper surface chemistry on contact killing are not fully understood. In this study, copper oxide formation on copper during standard antimicrobial testing was measured in situ by spectroscopic ellipsometry. In parallel, contact killing under these conditions was assessed with bacteria in phosphate buffered saline (PBS) or Tris-Cl. For comparison, defined Cu2O and CuO layers were thermally generated and characterized by grazing incidence X-ray diffraction. The antibacterial properties of these copper oxides were tested under the conditions used above. Finally, copper ion release was recorded for both buffer systems by inductively coupled plasma atomic absorption spectroscopy, and exposed copper samples were analyzed for topographical surface alterations. It was found that there was a fairly even growth of CuO under wet plating conditions, reaching 4-10 nm in 300 min, but no measurable Cu2O was formed during this time. CuO was found to significantly inhibit contact killing, compared to pure copper. In contrast, thermally generated Cu2O was essentially as effective in contact killing as pure copper. Copper ion release from the different surfaces roughly correlated with their antibacterial efficacy and was highest for pure copper, followed by Cu2O and CuO. Tris-Cl induced a 10-50-fold faster copper ion release compared to PBS. Since the Cu2O that primarily forms on copper under ambient conditions is as active in contact killing as pure copper, antimicrobial objects will retain their antimicrobial properties even after oxide formation.

A REVIEW OF NICKEL PLATING BATH LIFE EXTENSION, NICKEL RECOVERY & COPPER RECOVERY FROM NICKEL BATHS

EPA Science Inventory

For metal finishing operations to remain competitive and in compliance with environmental requirements, companies must focus their efforts on pollution prevention to reduce waste generation and disposal costs, limit liability and restore maximum profits. By applying the pollutio...

Polyurethane Filler for Electroplating

NASA Technical Reports Server (NTRS)

Beasley, J. L.

1984-01-01

Polyurethane foam proves suitable as filler for slots in parts electroplated with copper or nickel. Polyurethane causes less contamination of plating bath and of cleaning and filtering tanks than wax fillers used previously. Direct cost of maintenance and indirect cost of reduced operating time during tank cleaning also reduced.

Catalyst surfaces for the chromous/chromic redox couple

NASA Technical Reports Server (NTRS)

Giner, J. D.; Cahill, K. J. (Inventor)

1980-01-01

An electricity producing cell of the reduction-oxidation (REDOX) type is described. The cell is divided into two compartments by a membrane, each compartment containing a solid inert electrode. A ferrous/ferric couple in a chloride solution serves as a cathode fluid which is circulated through one of the compartments to produce a positive electric potential disposed therein. A chromic/chromous couple in a chloride solution serves as an anode fluid which is circulated through the second compartment to produce a negative potential on an electrode disposed therein. The electrode is an electrically conductive, inert material plated with copper, silver or gold. A thin layer of lead plates onto the copper, silver or gold layer when the cell is being charged, the lead ions being available from lead chloride which was added to the anode fluid. If the REDOX cell is then discharged, the current flows between the electrodes causing the lead to deplate from the negative electrode and the metal coating on the electrode will act as a catalyst to cause increased current density.

An inexpensive approach for bright-field and dark-field imaging by scanning transmission electron microscopy in scanning electron microscopy.

PubMed

Patel, Binay; Watanabe, Masashi

2014-02-01

Scanning transmission electron microscopy in scanning electron microscopy (STEM-in-SEM) is a convenient technique for soft materials characterization. Various specimen-holder geometries and detector arrangements have been used for bright-field (BF) STEM-in-SEM imaging. In this study, to further the characterization potential of STEM-IN-SEM, a new specimen holder has been developed to facilitate direct detection of BF signals and indirect detection of dark-field (DF) signals without the need for substantial instrument modification. DF imaging is conducted with the use of a gold (Au)-coated copper (Cu) plate attached to the specimen holder which directs highly scattered transmitted electrons to an off-axis yttrium-aluminum-garnet (YAG) detector. A hole in the copper plate allows for BF imaging with a transmission electron (TE) detector. The inclusion of an Au-coated Cu plate enhanced DF signal intensity. Experiments validating the acquisition of true DF signals revealed that atomic number (Z) contrast may be achieved for materials with large lattice spacing. However, materials with small lattice spacing still exhibit diffraction contrast effects in this approach. The calculated theoretical fine probe size is 1.8 nm. At 30 kV, in this indirect approach, DF spatial resolution is limited to 3.2 nm as confirmed experimentally.

Influence of Bond Coat on HVOF-Sprayed Gradient Cermet Coating on Copper Alloy

NASA Astrophysics Data System (ADS)

Ke, Peng; Cai, Fei; Chen, Wanglin; Wang, Shuoyu; Ni, Zhenhang; Hu, Xiaohong; Li, Mingxi; Zhu, Guanghong; Zhang, Shihong

2017-06-01

Coatings are required on mold copper plates to prolong their service life through enhanced hardness, wear resistance, and oxidation resistance. In the present study, NiCr-30 wt.%Cr3C2 ceramic-metallic (cermet) layers were deposited by high velocity oxy-fuel (HVOF) spraying on different designed bond layers, including electroplated Ni, HVOF-sprayed NiCr, and double-decker Ni-NiCr. Annealing was also conducted on the gradient coating (GC) with NiCr bond layer to improve the wear resistance and adhesion strength. Coating microstructure was investigated by scanning electron microscopy and x-ray diffraction analysis. Mechanical properties including microhardness, wear resistance, and adhesion strength of the different coatings were evaluated systematically. The results show that the types of metallic bond layer and annealing process had a significant impact on the mechanical properties of the GCs. The GCs with electroplated Ni bond layer exhibited the highest adhesion strength (about 70 MPa). However, the GC with HVOF-sprayed NiCr bond layer exhibited better wear resistance. The wear resistance and adhesion strength of the coating with NiCr metallic bond layer were enhanced after annealing.

High current capacity electrical connector

DOEpatents

Bettis, Edward S.; Watts, Harry L.

1976-01-13

An electrical connector is provided for coupling high current capacity electrical conductors such as copper busses or the like. The connector is arranged in a "sandwiched" configuration in which a conductor plate contacts the busses along major surfaces thereof clamped between two stainless steel backing plates. The conductor plate is provided with a plurality of contact buttons affixed therein in a spaced array such that the caps of the buttons extend above the conductor plate surface to contact the busses. When clamping bolts provided through openings in the sandwiched arrangement are tightened, Belleville springs provided under the rim of each button cap are compressed and resiliently force the caps into contact with the busses' contacting surfaces to maintain a predetermined electrical contact area provided by the button cap tops. The contact area does not change with changing thermal or mechanical stresses applied to the coupled conductors.

Copper Electrodeposition on a Magnesium Alloy (AZ80) with a U-Shaped Surface

PubMed Central

Huang, Ching An; Yeh, Yu Hu; Lin, Che Kuan; Hsieh, Chen Yun

2014-01-01

Cu electrodeposition was performed on a cylindrical AZ80 substrate with a U-shaped surface. A uniform deposition of Cu was achieved on an AZ80 electrode via galvanostatic etching, followed by Cu electrodeposition in an eco-friendly alkaline Cu plating bath. Improper wetting and lower rotational speeds of the AZ80 electrode resulted in an uneven Cu deposition at the inner upper site of the U-shaped surface during the Cu electroplating process. This wetting effect could be deduced from the variation in the anodic potential during the galvanostatic etching. The corrosion resistance of the Cu-deposited AZ80 electrode can be considerably improved after Ni electroplating. PMID:28788252

Improving the Magnetic Damping of an AS-1 Seismometer

NASA Astrophysics Data System (ADS)

Marton, F.; Echreshzadeh, M.; Tokman, T. L.; Palaric, K. D.; Filippone, N. V.; Balzarette, M.; Sivo, J.

2016-12-01

Last year, students working on the SeismoSTEM project at Bergen Community College in New Jersey successfully manufactured and assembled an AS-1 seismometer1. For 2016, our objective has been to improve the magnetic damping mechanism invented by Chris Chapman2. As the mass on the boom is displaced by seismic waves, the spring will cause the mass to oscillate, therefore, damping is required. To achieve this, a paddle-shaped piece of copper, along with steel plates holding strong neodymium magnets are used. A localized eddy current is then induced, which then creates an opposing magnetic field. The challenges we faced for the summer internship was the fact that there was either too much or too little damping to distinguish the waves of an earthquake. However, we resolved the issue by designing our own prototype for moving the steel plates away and toward the copper paddle, to achieve critical damping. This was successfully completed by attaching two L-shaped pieces of aluminum, along with a cylindrical piece, to form a yoke. We then drilled a hole through the cylindrical piece and a plastic block for a bolt to slide through. Finally, the head of the bolt would then be used as a knob to shift the two plates away from and toward the paddle simultaneously. Although this was our solution for moving the plates horizontally, we also needed to find a way to lock the plates in place once we found the correct amount of damping. We accomplished this task by drilling two slotted holes on two symmetrical sheets of aluminum, which will allow us to slide the plates, and finally, lock them into place to avoid wobbling. References: 1Tokman, T.L. et al., What's shaking? Manufacturing & assembling an AS-1 educational seismometer for undergraduate stem research, Geological Society of America Abstracts with Programs. Vol. 47, No. 7, p.524, 2015. 2http://www.jclahr.com/science/psn/chapman/as1%20damping/

SFD-261 Crossed-Field Amplifier Manufacturing Technology Program.

DTIC Science & Technology

1979-09-28

microwave amplifier used to increase tet pow--rlel of pulses of energy by a factor of 20. It is used in the Aegis A4/SPY1V DD 1473 ECIIOwOF I MOV 65...transmitter. A single ship.,; complement without spares is seventy-six. Its internal parts are made from high purity copper and many are complex and...23 Cathode Support 39 24 Mounting Plate ’i 25 Support Plate 42 26 Tubing Support 43 27 SFD-261 High Voltage Can End 45 b 28 Comparison of MT Tube

Combined Mini-Cylex & Disk Acceleration Tests in Type K Copper.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Maines, Warren Russell; Kittell, David E.; Hobbs, Michael L.

We combined the miniature cylinder expansion test (Mini-Cylex), with the Disk Acceleration Test (DAX) using Type K copper, Picatinny Liquid Explosive, and photonic Doppler velocimetry. We estimated the CJ state using plate reverberation methods at the test cap. We extracted velocities at 2, 7, and 10 volume expansions to fit Jones-Wilkins-Lee Equation of State at the tube wall. And we estimated Gurney velocity both at the test cap and tube wall. Our experiments and simulations are within expected uncertainty. The test and the analysis effectively reduce costs while keeping similar fidelity compared with more expensive tests.

Advances in the electrodeposition of aluminum from ionic liquid based electrolytes

NASA Astrophysics Data System (ADS)

Leadbetter, Kirt C.

Aluminum plating is of considerable technical and economic interest because it provides an eco-friendly substitute for cadmium coatings used on many military systems. However, cadmium has been determined to be a significant environmental safety and occupational health (ESOH) hazard because of its toxicity and carcinogenic nature. Furthermore, the cost of treating and disposing of generated wastes, which often contain cyanide, is costly and is becoming prohibitive in the face of increasingly stringent regulatory standards. The non-toxic alternative aluminum is equivalent or superior in performance to cadmium. In addition, it could serve to provide an alternative to hexavalent chromium coatings used on military systems for similar reasons to that of cadmium. Aluminum is a beneficial alternative in that it demonstrates self-healing corrosion resistance in the form of a tightly-bound, impervious oxide layer. A successfully plated layer would be serviceable over a wider temperature range, 925 °F for aluminum compared to 450 oF for cadmium. In addition, an aluminum layer can be anodized to make it non-conducting and colorable. In consideration of the plating process, aluminum cannot be deposited from aqueous solutions because of its reduction potential. Therefore, nonaqueous electrolytes are required for deposition. Currently, aluminum can be electrodeposited in nonaqueous processes that use hazardous chemicals such as toluene and pyrophoric aluminum alkyls. Electrodeposition from ionic liquids provides the potential for a safer method that could be easily scaled up for industrial application. The plating process could be performed at a lower temperature and higher current density than other commercially available aluminum electrodeposition processes; thus a reduced process cost could be possible. The current ionic liquid based electrolytes are more expensive; however production on a larger scale and a long electrolyte lifetime are associated with a reduction in price. Advancements of this nonaqueous aluminum plating process have the potential to lead to a novel and competitive commercial aluminum deposition process. In this investigation aluminum electrodeposition from ionic liquid based electrolytes onto steel, copper and magnesium substrates without conversion coatings or strike layers was evaluated in six different ionic liquid based electrolytes in two technical setups. Three of which are commercially available aluminum plating electrolytes, three of which, discussed in literature were created on site by research personnel in the laboratory. The three commercially available electrolytes were: 1-Butyl-3-methylimidazolium chloride ([BMIm]Cl) * 1.5 AlCl3 with proprietary additives from IoLiTec, 1-Ethyl-3-methylimidazolium chloride ([EMIm]Cl) * 1.5 AlCl3 with proprietary additives from IoLiTec, and BasionicsTM AL-02, an aluminum plating electrolyte containing [EMIm]Cl * 1.5 AlCl3 with additives from BASF. The three electrolytes created on site were based on the 1-ethyl-3-methylimidazolium chloride ionic liquid with added 1.5 AlCl3 and one with added sodium dodecyl sulfate. Small scale plating tests in a 25-mL plating cell were conducted to provide a comparative analysis of the six different electrolytes considered. From these investigations, two were chosen to be evaluated in a larger 1-liter plating cell; designed and constructed to provide a more realistic evaluation of plating parameters with selected electrolytes to better portray industrial electroplating conditions. The effect of current density (10-40 mA/cm 2), temperature (30-90° Celsius) and plating bath agitation on current efficiency, corrosion resistance by the ASTM B117 method, adhesion, microstructure, and chemical composition (evaluated with energy-dispersive x-ray spectroscopy) of the plated Al-layer was explored in both the 25-mL and 1-L plating cell investigations. In addition development of pre- and post-treatment processes for the metal substrates was attempted. While previous investigations focused on one or two of these topics, this research seeks to investigate all discussed phenomena and characteristics. Additionally, there is little research that reports on the adhesion performance of aluminum coatings from ionic liquids. Also, corrosion investigations are limited to all but a few publications. So too, the deposition of aluminum in a larger, more realistic plating cell has never been thoroughly investigated. This is key if a practical application of the technology is ever to be realized. In sum, correlations were drawn between electrolyte, current density, temperature and bath agitation with quality and characteristic of electrodeposited aluminum layers. The overriding goal to create an acceptably competitive aluminum coating process to replace cadmium and compete with other commercial aluminum deposition processes was not successful. Competitiveness was evaluated as per the discussed characteristics and so also, by a comparison to physical samples created in a more realistic plating cell to AlumiPlate aluminum coatings.

Cr13Ni5Si2-Based Composite Coating on Copper Deposited Using Pulse Laser Induction Cladding

PubMed Central

Wang, Ke; Wang, Hailin; Zhu, Guangzhi; Zhu, Xiao

2017-01-01

A Cr13Ni5Si2-based composite coating was successfully deposited on copper by pulse laser induction hybrid cladding (PLIC), and its high-temperature wear behavior was investigated. Temperature evolutions associated with crack behaviors in PLIC were analyzed and compared with pulse laser cladding (PLC) using the finite element method. The microstructure and present phases were analyzed using scanning electron microscopy and X-ray diffraction. Compared with continuous laser induction cladding, the higher peak power offered by PLIC ensures metallurgical bonding between highly reflective copper substrate and coating. Compared with a wear test at room temperature, at 500 °C the wear volume of the Cr13Ni5Si2-based composite coating increased by 21%, and increased by 225% for a NiCr/Cr3C2 coating deposited by plasma spray. This novel technology has good prospects for application with respect to the extended service life of copper mold plates for slab continuous casting. PMID:28772519

Cr13Ni5Si2-Based Composite Coating on Copper Deposited Using Pulse Laser Induction Cladding.

PubMed

Wang, Ke; Wang, Hailin; Zhu, Guangzhi; Zhu, Xiao

2017-02-10

A Cr13Ni5Si2-based composite coating was successfully deposited on copper by pulse laser induction hybrid cladding (PLIC), and its high-temperature wear behavior was investigated. Temperature evolutions associated with crack behaviors in PLIC were analyzed and compared with pulse laser cladding (PLC) using the finite element method. The microstructure and present phases were analyzed using scanning electron microscopy and X-ray diffraction. Compared with continuous laser induction cladding, the higher peak power offered by PLIC ensures metallurgical bonding between highly reflective copper substrate and coating. Compared with a wear test at room temperature, at 500 °C the wear volume of the Cr13Ni5Si2-based composite coating increased by 21%, and increased by 225% for a NiCr/Cr3C2 coating deposited by plasma spray. This novel technology has good prospects for application with respect to the extended service life of copper mold plates for slab continuous casting.

Flat plate solar collector for water pre-heating using concentrated solar power (CSP)

NASA Astrophysics Data System (ADS)

Peris, Leonard Sunny; Shekh, Md. Al Amin; Sarker, Imran

2017-12-01

Numerous attempt and experimental conduction on different methods to harness energy from renewable sources are being conducted. This study is a contribution to the purpose of harnessing solar energy as a renewable source by using flat plate solar collector medium to preheat water. Basic theory of solar radiation and heat convection in water (working fluid) has been combined with heat conduction process by using copper tubes and aluminum absorber plate in a closed conduit, covered with a glazed through glass medium. By this experimental conduction, a temperature elevation of 35°C in 10 minutes duration which is of 61.58% efficiency range (maximum) has been achieved. The obtained data and experimental findings are validated with the theoretical formulation and an experimental demonstration model. A cost effective and simple form of heat energy extraction method for space heating/power generation has been thoroughly discussed with possible industrial implementation possibilities. Under-developed and developing countries can take this work as an illustration for renewable energy utilization for sustainable energy prospect. Also a full structure based data to derive concentrated solar energy in any geographical location of Bangladesh has been outlined in this study. These research findings can contribute to a large extent for setting up any solar based power plant in Bangladesh irrespective of its installation type.

Geologic map of the Wrangell-Saint Elias National Park and Reserve, Alaska

USGS Publications Warehouse

Richter, Donald H.; Preller, Cindi C.; Labay, Keith A.; Shew, Nora B.

2006-01-01

Wrangell-Saint Elias National Park and Preserve, the largest national park within the U.S. National Park Service system, extends from the northern Pacific Ocean to beyond the eastern Alaska Range into interior Alaska. It features impressively spectacular scenery such as high and craggy mountains, active and ancient volcanoes, expansive ice fields, immense tidewater glaciers, and a myriad of alpine glaciers. The park also includes the famous Kennecott Mine, a world-class copper deposit that was mined from 1911 to 1938, and remnant ghost town, which is now a National Historic Landmark. Geologic investigations encompassing Wrangell-Saint Elias National Park and Preserve began in 1796, with Dmitriv Tarkhanov, a Russian mining engineer, who unsuccessfully ventured up the Copper River in search of rumored copper. Lieutenant H.T. Allen (1897) of the U.S. Army made a successful epic summer journey with a limited military crew up the Copper River in 1885, across the Alaska Range, and down the Tanana and Yukon Rivers. Allen?s crew was supported by a prospector named John Bremner and local Eyak and Ahtna native guides whose tribes controlled access into the Copper River basin. Allen witnessed the Ahtnas? many uses of the native copper. His stories about the copper prompted prospectors to return to this area in search of the rich copper ore in the years following his journey. The region boasts a rich mining and exploration history prior to becoming a park in 1980. Several U.S. Geological Survey geologists have conducted reconnaissance surveys in the area since Allen?s explorations. This map is the result of their work and is enhanced by more detailed investigations, which began in the late 1950s and are still continuing. For a better understanding of the processes that have shaped the geology of the park and a history of the geologic investigations in the area, we recommend U.S. Geological Survey Professional Paper 1616, ?A Geologic Guide to Wrangell-Saint Elias National Park and Preserve, Alaska,? an exceptionally well illustrated and informative book by Gary R. Winkler, 2000. Geologically, the park consists of a collage of seven tectonostratigraphic terranes that formed south in the equatorial Pacific Ocean and rafted northward on oceanic plates, eventually accreting to Alaska and the North American continent. Each terrane features a distinct stratigraphy and is separated from neighboring terranes by major strike-slip or thrust faults.

Reflow-oven-processing of pressureless sintered-silver interconnects

DOE Office of Scientific and Technical Information (OSTI.GOV)

Wereszczak, Andrew A.; Chen, Branndon R.; Oistad, Brian A.

Here, a method was developed to pressurelessly fabricate strong and consistent sinterable-silver joints or interconnects using reflow oven heating. Circular sinterable-silver interconnects, having nominal diameter of 5 mm and 0.1 mm thickness were stencil printed, contact-dried, and then pressurelessly sinter-bonded to Au-plated direct copper bonded ceramic substrates at 250 °C in ambient air. That sintering was done in either a reflow oven or a convective oven (latter being a conventional heating source for processing sinterable-silver). Consistently strong (>40 MPa) interconnects were produced with reflow oven heating and were as strong as those produced with convective oven heating. This is significantmore » because reflow oven technology affords better potential for continuous mass production and it was shown that strong sintered-silver bonds can indeed be achieved with its use.« less

Reflow-oven-processing of pressureless sintered-silver interconnects

DOE PAGES

Wereszczak, Andrew A.; Chen, Branndon R.; Oistad, Brian A.

2018-01-04

Here, a method was developed to pressurelessly fabricate strong and consistent sinterable-silver joints or interconnects using reflow oven heating. Circular sinterable-silver interconnects, having nominal diameter of 5 mm and 0.1 mm thickness were stencil printed, contact-dried, and then pressurelessly sinter-bonded to Au-plated direct copper bonded ceramic substrates at 250 °C in ambient air. That sintering was done in either a reflow oven or a convective oven (latter being a conventional heating source for processing sinterable-silver). Consistently strong (>40 MPa) interconnects were produced with reflow oven heating and were as strong as those produced with convective oven heating. This is significantmore » because reflow oven technology affords better potential for continuous mass production and it was shown that strong sintered-silver bonds can indeed be achieved with its use.« less

Plasmonic nanostructures for surface-enhanced Raman spectroscopy

NASA Astrophysics Data System (ADS)

Jiang, Ruiqian

In the last three decades, a large number of different plasmonic nanostructures have attracted much attention due to their unique optical properties. Those plasmonic nanostructures include nanoparticles, nanoholes and metal nanovoids. They have been widely utilized in optical devices and sensors. When the plasmonic nanostructures interact with the electromagnetic wave and their surface plasmon frequency match with the light frequency, the electrons in plasmonic nanostructures will resonate with the same oscillation as incident light. In this case, the plasmonic nanostructures can absorb light and enhance the light scattering. Therefore, the plasmonic nanostructures can be used as substrate for surface-enhanced Raman spectroscopy to enhance the Raman signal. Using plasmonic nanostructures can significantly enhance Raman scattering of molecules with very low concentrations. In this thesis, two different plasmonic nanostructures Ag dendrites and Au/Ag core-shell nanoparticles are investigated. Simple methods were used to produce these two plasmonic nanostructures. Then, their applications in surface enhanced Raman scattering have been explored. Ag dendrites were produced by galvanic replacement reaction, which was conducted using Ag nitrate aqueous solution and copper metal. Metal copper layer was deposited at the bottom side of anodic aluminum oxide (AAO) membrane. Silver wires formed inside AAO channels connected Ag nitrate on the top of AAO membrane and copper layer at the bottom side of AAO. Silver dendrites were formed on the top side of AAO. The second plasmonic nanostructure is Au/Ag core-shell nanoparticles. They were fabricated by electroless plating (galvanic replacement) reaction in a silver plating solution. First, electrochemically evolved hydrogen bubbles were used as template through electroless deposition to produce hollow Au nanoparticles. Then, the Au nanoparticles were coated with Cu shells in a Cu plating solution. In the following step, a AgCN based plating solution was used to replace Cu shell to form Au/Ag core-shell nanoparticles. These two plasmonic nanostructures were tested as substrates for Raman spectroscopy. It demonstrated that these plasmonic nanostructures could enhance Raman signal from the molecules on their surface. The results indicate that these plasmonic nanostructures could be utilized in many fields, such as such as biological and environmental sensors.

Heat transfer from an oxidized large copper surface to liquid helium: Dependence on surface orientation and treatment

DOE Office of Scientific and Technical Information (OSTI.GOV)

Iwamoto, A.; Mito, T.; Takahata, K.

Heat transfer of large copper plates (18 x 76 mm) in liquid helium has been measured as a function of orientation and treatment of the heat transfer surface. The results relate to applications of large scale superconductors. In order to clarify the influence of the area where the surface treatment peels off, the authors studied five types of heat transfer surface areas including: (a) 100% polished copper sample, (b) and (c) two 50% oxidized copper samples having different patterns of oxidation, (d) 75% oxidized copper sample, (e) 90% oxidized copper sample, and (f) 100% oxidized copper sample. They observed thatmore » the critical heat flux depends on the heat transfer surface orientation. The critical heat flux is a maximum at angles of 0{degrees} - 30{degrees} and decreases monotonically with increasing angles above 30{degrees}, where the angle is taken in reference to the horizontal axis. On the other hand, the minimum heat flux is less dependent on the surface orientation. More than 75% oxidation on the surface makes the critical heat flux increase. The minimum heat fluxes of the 50 and 90% oxidized Cu samples approximately agree with that of the 100% oxidized Cu sample. Experiments and calculations show that the critical and the minimum heat fluxes are a bilinear function of the fraction of oxidized surface area.« less

Design, analyses, fabrication and characterization of Nb3Sn coil in 1 W pulse tube cryocooler

NASA Astrophysics Data System (ADS)

Kundu, Ananya; Das, Subrat Kumar; Bano, Anees; Kumar, Nitish; Pradhan, Subrata

2017-02-01

A laboratory scale Nb3Sn coil is designed, analysed, fabricated and characterized in 1 W pulse tube cryocooler in solid nitrogen cooling mode and in conduction cooling mode. The magnetic field profile in axial and radial direction, Lorentz force component across the winding volume in operational condition are estimated in COMSOL. The coil is designed for 1.5 T at 100 A. It is fabricated in wind and react method. Before winding, the insulated Nb3Sn strand is wound on a copper mandrel which is thermally anchored with the 2nd stage of the cold head unit via a 10 mm thick copper ‘Z’ shaped plate The temperature distribution in 2nd cold stage, copper z plate and coil is monitored in both solid nitrogen cooling and conduction cooling mode. In solid nitrogen cooling mode, the quench of the coil occurs at 150 A for 0.01 A/s current ramp rate. The magnetic field at the centre of the coil bore is measured using transverse Hall sensor. The measured magnetic field value is compared with the analytical field value and they are found to be deviating ∼5% in magnitude. Again the coil is tested in conduction cooling mode maintaining the same current ramp rate and it is observed that the coil gets quenched at 70 A at temperature ∼ 10K.

Survey of coatings for solar collectors

NASA Technical Reports Server (NTRS)

Mcdonald, G. E.

1975-01-01

Optimum solar selective properties of black chrome require some tailoring of current and time for plating solution being used. Black zinc is produced from high zinc electroplate by subsequent conversion with chromate dip. Measurements have also been made of reflectance of previously known solar selective coatings of black copper and electroplated black nickel.

Coating for prevention of titanium combustion

NASA Technical Reports Server (NTRS)

Anderson, V. G.; Funkhouser, M.; Mcdaniel, P.

1980-01-01

A limited number of coating options for titanium gas turbine engine components were explored with the objective of minimizing potential combustion initiation and propagation without adversely affecting component mechanical properties. Objectives were met by two of the coatings, ion-plated platinum plus electroplated copper plus electroplated nickel and ion vapor deposited aluminum.

Indoor thermal performance evaluation of Daystar solar collector

NASA Technical Reports Server (NTRS)

Shih, K., Sr.

1977-01-01

The test procedures used and results obtained from a test program to obtain thermal performance data on a Daystar Model 21B, S/N 02210, Unit 2, liquid solar collector under simulated conditions are described. The test article is a flat plate solar collector using liquid as a heat transfer medium. The absorber plate is copper and coated with black paint. Between the tempered low iron glass and absorber plate is a polycarbonate trap used to suppress convective heat loss. The collector incorporates a convector heat dump panel to limit temperature excursions during stagnation. The following tests were conducted: (1) collector thermal efficiency; (2) collector time constant; (3) collector incident angle modifier; (4) collector heat loss coefficient; and (5) collector stagnation.

Friction Stir Weld Tooling Development for Application on the 2195 Al-Cu-Li Space Transportation System External Tank

NASA Technical Reports Server (NTRS)

Loftus, Zachary; Arbegast, W. J.; Hartley, P. J.

1998-01-01

Friction Stir Welding (FSW) is a new and innovative solid-state joining process which can be applied to difficult-to- weld aluminum alloys. However, the large forces involved with the process have posed a production tooling challenge. Lockheed Martin Michoud Space Systems has overcome many of these challenges on the Super Lightweight External Tank (ET) program. Utilizing Aluminum-Copper-Lithium alloy 2195 in the form of plate and extrusions, investigations of FSW process parameters have been completed. Major loading mechanisms are discussed in conjunction with deflection measurements. Since the ET program is a cryogenic application, a brief comparison of cryogenic material properties with room temperature material properties is offered for both FSW and fusion welds. Finally, a new approach to controlling the FSW process from a load perspective is introduced. Emphasis will be put on tooling development, as well as the impact of tooling design and philosophy on Friction Stir Weld success probability.

The characteristics of void distribution in spalled high purity copper cylinder under sweeping detonation

NASA Astrophysics Data System (ADS)

Yang, Yang; Jiang, Zhi; Chen, Jixinog; Guo, Zhaoliang; Tang, Tiegang; Hu, Haibo

2018-03-01

The effects of different peak compression stresses (2-5 GPa) on the spallation behaviour of high purity copper cylinder during sweeping detonation were examined by Electron Backscatter Diffraction Microscopy, Doppler Pins System and Optical Microscopy techniques. The velocity history of inner surface and the characteristics of void distributions in spalled copper cylinder were investigated. The results indicated that the spall strength of copper in these experiments was less than that revealed in previous reports concerning plate impact loading. The geometry of cylindrical copper and the obliquity of incident shock during sweeping detonation may be the main reasons. Different loading stresses seemed to be responsible for the characteristics of the resultant damage fields, and the maximum damage degree increased with increasing shock stress. Spall planes in different cross-sections of sample loaded with the same shock stress of 3.29 GPa were found, and the distance from the initiation end has little effect on the maximum damage degree (the maximum damage range from 12 to 14%), which means that the spallation behaviour was stable along the direction parallel to the detonation propagation direction under the same shock stress.

Microbiology, chemistry and biofilm development in a pilot drinking water distribution system with copper and plastic pipes.

PubMed

Lehtola, Markku J; Miettinen, Ilkka T; Keinänen, Minna M; Kekki, Tomi K; Laine, Olli; Hirvonen, Arja; Vartiainen, Terttu; Martikainen, Pertti J

2004-10-01

We studied the changes in water quality and formation of biofilms occurring in a pilot-scale water distribution system with two generally used pipe materials: copper and plastic (polyethylene, PE). The formation of biofilms with time was analysed as the number of total bacteria, heterotrophic plate counts and the concentration of ATP in biofilms. At the end of the experiment (after 308 days), microbial community structure, viable biomass and gram-negative bacterial biomass were analysed via lipid biomarkers (phospholipid fatty acids and lipopolysaccharide 3-hydroxy fatty acids), and the numbers of virus-like particles and total bacteria were enumerated by SYBR Green I staining. The formation of biofilm was slower in copper pipes than in the PE pipes, but after 200 days there was no difference in microbial numbers between the pipe materials. Copper ion led to lower microbial numbers in water during the first 200 days, but thereafter there were no differences between the two pipe materials. The number of virus-like particles was lower in biofilms and in outlet water from the copper pipes than PE pipes. Pipe material influenced also the microbial and gram-negative bacterial community structure in biofilms and water.

Development of copper recovery process from flotation tailings by a combined method of high‒pressure leaching‒solvent extraction.

PubMed

Han, Baisui; Altansukh, Batnasan; Haga, Kazutoshi; Stevanović, Zoran; Jonović, Radojka; Avramović, Ljiljana; Urosević, Daniela; Takasaki, Yasushi; Masuda, Nobuyuki; Ishiyama, Daizo; Shibayama, Atsushi

2018-06-15

Sulfide copper mineral, typically Chalcopyrite (CuFeS 2 ), is one of the most common minerals for producing metallic copper via the pyrometallurgical process. Generally, flotation tailings are produced as a byproduct of flotation and still consist of un‒recovered copper. In addition, it is expected that more tailings will be produced in the coming years due to the increased exploration of low‒grade copper ores. Therefore, this research aims to develop a copper recovery process from flotation tailings using high‒pressure leaching (HPL) followed by solvent extraction. Over 94.4% copper was dissolved from the sample (CuFeS 2 as main copper mineral) by HPL in a H 2 O media in the presence of pyrite, whereas the iron was co‒dissolved with copper according to an equation given as C Cu  = 38.40 × C Fe . To avoid co‒dissolved iron giving a negative effect on the subsequent process of electrowinning, solvent extraction was conducted on the pregnant leach solution for improving copper concentration. The result showed that 91.3% copper was recovered in a stripped solution and 98.6% iron was removed under the optimal extraction conditions. As a result, 86.2% of copper was recovered from the concentrate of flotation tailings by a proposed HPL‒solvent extraction process. Copyright © 2018 Elsevier B.V. All rights reserved.

Influence of clamping plate permeability and metal screen structures on three-dimensional magnetic field and eddy current loss in end region of a turbo-generator by numerical analysis

NASA Astrophysics Data System (ADS)

Likun, Wang; Weili, Li; Yi, Xue; Chunwei, Guan

2013-11-01

A significant problem of turbogenerators on complex end structures is overheating of local parts caused by end losses in the end region. Therefore, it is important to investigate the 3-D magnetic field and eddy current loss in the end. In end region of operating large turbogenerator at thermal power plants, magnetic leakage field distribution is complex. In this paper, a 3-D mathematical model used for the calculation of the electromagnetic field in the end region of large turbo-generators is given. The influence of spatial locations of end structures, the actual shape and material of end windings, clamping plate, and copper screen are considered. Adopting the time-step finite element (FE) method and taking the nonlinear characteristics of the core into consideration, a 3-D transient magnetic field is calculated. The objective of this paper is to investigate the influence of clamping plate permeability and metal screen structures on 3-D electromagnetic field distribution and eddy current loss in end region of a turbo-generator. To reduce the temperature of copper screen, a hollow metal screen is proposed. The eddy current loss, which is gained from the 3D transient magnetic field, is used as heat source for the thermal field of end region. The calculated temperatures are compared with test data.

Shock Initiation of Secondary Explosives by MicroSlapper

NASA Astrophysics Data System (ADS)

Mendes, Ricardo; Campos, Jose; Plaksin, Igor; Ribeiro, Jose

2001-06-01

Using the well known Exploding Foil Initiator (EFI) also called slapper detonator the shock to Detonation Wave (DW) transition in a low dense secondary explosive like PETN and RDX is presented in this study. The EFI formed by a capacitor with capacity up to 0.2μF charged until 3kV was used to burst copper bridges with 0.3x0.3mm and 0.4x0.3mm with 5μm of thickness, and to accelerate Kapton flyer plates with 25μm of thickness until 5mm/μs. The process of Shock to Detonation Transition (SDT) in explosive samples with 5mm of diameter by 10mm of height was characterized by an optical method based on 64 optical fibbers ribbon (250mm of diameter each fibber) connected to a fast electronic streak camera. The obtained results, (x,t) diagrams, with 1ns resolution, show continuously the shock to detonation transition regime and allowed the evaluation of the detonation velocity and the detonation wave front curvature. In that regime DW propagation presents the oscillations in detonation velocity. The results also show the influence of the flyer plate velocity and the initial density of the explosive sample in the process of SDT and front oscillations.

Theory and performance of plated thermocouples.

NASA Technical Reports Server (NTRS)

Pesko, R. N.; Ash, R. L.; Cupschalk, S. G.; Germain, E. F.

1972-01-01

A theory has been developed to describe the performance of thermocouples which have been formed by electroplating portions of one thermoelectric material with another. The electroplated leg of the thermocouple was modeled as a collection of infinitesimally small homogeneous thermocouples connected in series. Experiments were performed using several combinations of Constantan wire sizes and copper plating thicknesses. A transient method was used to develop the thermoelectric calibrations, and the theory was found to be in quite good agreement with the experiments. In addition, data gathered in a Soviet experiment were also found to be in close agreement with the theory.

Experimental evaluation of a fixed collector employing vee-trough concentrator and vacuum tube receivers

NASA Technical Reports Server (NTRS)

Selcuk, M. K.

1977-01-01

A test bed for experimental evaluation of a fixed solar collector which combines an evacuated glass tube solar receiver with a flat plate/black chrome plated copper absorber and an asymmetric vee-trough concentrator was designed and constructed. Earlier predictions of thermal performance were compared with test data acquired for a bare vacuum tube receiver; and receiver tubes with Alzak aluminum, aluminized FEP Teflon film laminated sheet metal and second surface ordinary mirror reflectors. Test results and system economics as well as objectives of an ongoing program to obtain long-term performance data are discussed.

Better Ceramics Through Chemistry 4. Symposium Held in San Francisco, California on April 16 - 20, 1990. Volume 180

DTIC Science & Technology

1990-04-20

metal alkoxide precursors. For example, we only recently obtained the first X - ray crystallographic data on bismuth alkoxides, Bi(OR)3 (R = C(CH 3)3...OCMe3)6(u.O2CMe)4(J14-O2CMe)2. Complex I was fully characterized by single crystal X - ray crystallography. The six copper atoms are linked by six...hydrolyzed samples of 3 revealed stacks of plate-like particles with sizes up to 20 x 50 microns (Figure 3). X - ray analysis of these plates showed

DOE Office of Scientific and Technical Information (OSTI.GOV)

Maines, Warren Russell; Kittell, David E.; Hobbs, Michael L.

In this work, we combined the miniature cylinder expansion test (Mini-Cylex), with the Disk Acceleration Test (DAX) using Type K copper, Picatinny Liquid Explosive, and photonic Doppler velocimetry. We estimated the CJ state using plate reverberation methods at the test cap. We extracted velocities at 2, 7, and 10 volume expansions to fit Jones-Wilkins-Lee Equation of State and estimated Gurney velocity at the tube wall. The test also provides an additional method to estimate reaction products Hugoniot through knowledge of the copper test cap. Our experiments and simulations are within expected uncertainty. Lastly, the test and the analysis effectively reducemore » costs while keeping or increasing fidelity.« less

Organic Rankine cycle receiver development

NASA Technical Reports Server (NTRS)

Haskins, H. J.

1981-01-01

The selected receiver concept is a direct-heated, once-through, monotube boiler operated at supercritical pressure. The cavity is formed by a cylindrical copper shell and backwall, with stainless steel tubing brazed to the outside surface. This core is surrounded by lightweight refractory insulation, load-bearing struts, and an outer case. The aperture plate is made of copper to provide long life by conduction and reradiation of heat away from the aperture lip. The receiver thermal efficiency is estimated to be 97 percent at rated conditions (energy transferred to toluene divided by energy incident on aperture opening). Development of the core manufacturing and corrosion protection methods is complete.

Motel solar-hot-water system with nonpressurized storage--Jacksonville, Florida

NASA Technical Reports Server (NTRS)

1981-01-01

Modular roof-mounted copper-plated arrays collect solar energy; heated water drains from them into 1,000 gallon nonpressurized storage tank which supplies energy to existing pressurized motel hot water lines. System provides 65 percent of hot water demand. Report described systems parts and operation, maintenance, and performance and provides warranty information.

Initial evaluation of floor cooling on lactating sows under severe acute heat stress

USDA-ARS?s Scientific Manuscript database

The objective was to evaluate the effects of floor cooling on lactating sows under severe summer heat stress. Twelve multiparous sows were provided with a cooling pad built with an aluminum plate surface, high-density polyethylene base and copper pipes. Treatments were randomly allotted to sows to r...

Effect of floor cooling on late lactation sows under acute heat stress

USDA-ARS?s Scientific Manuscript database

The objective was to evaluate the effects of floor cooling on late lactation sows under severe summer heat stress. Ten multiparous sows were provided with a cooling pad built with an aluminum plate surface, high-density polyethylene base and copper pipes. Treatments were randomly allotted to sows to...

Effects of floor cooling on late lactation sows under severe acute heat stress

USDA-ARS?s Scientific Manuscript database

The objective was to evaluate the effects of floor cooling on late lactation sows under severe summer heat stress. Ten multiparous sows were provided with a cooling pad built with an aluminum plate surface, high-density polyethylene base and copper pipes. Treatments were randomly allotted to sows to...

Initial evaluation of floor cooling on lactating sows under severe acute heat stress

USDA-ARS?s Scientific Manuscript database

The objectives were to evaluate an acute heat stress protocol for lactating sows and evaluate preliminary estimates of water flow rates required to cool sows. Twelve multiparous sows were provided with a cooling pad built with an aluminum plate surface, high-density polyethylene base and copper pipe...

External Peltier Cooler For Low-Noise Amplifier

NASA Technical Reports Server (NTRS)

Soper, Terry A.

1990-01-01

Inexpensive Peltier-effect cooling module made of few commercially available parts used to reduce thermal noise in microwave amplifier. Retrofitted to almost any microwave low-noise amplifier or receiver preamplifier used in communication, telemetry, or radar. Includes copper or aluminum cold plate held tightly against unit to be cooled by strap-type worm-gear clamps.

Ultrasound Thermal Imaging and its application to Rayleigh-Bénard convection in mercury

NASA Astrophysics Data System (ADS)

Xu, Hongzhou; Andereck, C. David

2003-11-01

We have developed Ultrasound Thermal Imaging (UTI), a non-intrusive ultrasound technique for internal temperature measurement of opaque fluids, and have applied UTI to low Rayleigh number buoyancy driven convection in mercury. UTI relies upon the variation of sound speed with temperature of the fluid. An array of ultrasound transducers scanned electronically along the sidewall of a convection cell with aspect ratio of 6 yields a map of the thermal field over the chamber. The chamber has stainless steel sidewalls and molybdenum covered copper plates at the top and bottom. As the Rayleigh number increases slowly from zero, the data reveal the formation of a roll cell pattern and transitions between different cellular states. Based on standard deviation distributions of the temperature profile at the cell's mid-depth, the critical temperature difference agrees well with the theoretically predicted value. The heat flux through the horizontal mercury layer was determined by thermistors mounted at the exit and entrance of the internal channel in each copper plate through which flows warm/cool constant temperature water. Nusselt numbers and other experimental results will also be presented.

R245fa Flow Boiling inside a 4.2 mm ID Microfin Tube

NASA Astrophysics Data System (ADS)

Longo, G. A.; Mancin, S.; Righetti, G.; Zilio, C.

2017-11-01

This paper presents the R245fa flow boiling heat transfer and pressure drop measurements inside a mini microfin tube with internal diameter at the fin tip of 4.2 mm, having 40 fins, 0.15 mm high with a helix angle of 18°. The tube was brazed inside a copper plate and electrically heated from the bottom. Sixteen T-type thermocouples are located in the copper plate to monitor the wall temperature. The experimental measurements were carried out at constant mean saturation temperature of 30 °C, by varying the refrigerant mass velocity between 100 kg m-2 s-1 and 300 kg m-2 s-1, the vapour quality from 0.15 to 0.95, at two different heat fluxes: 30 and 60 kW m-2. The experimental results are presented in terms of two-phase heat transfer coefficient, onset dryout vapour quality, and frictional pressure drop. Moreover, the experimental measurements are compared against the most updated models for boiling heat transfer coefficient and frictional pressure drop estimations available in the open literature for microfin tubes.

An evaluation of a hybrid ion exchange electrodialysis process in the recovery of heavy metals from simulated dilute industrial wastewater.

PubMed

Mahmoud, Akrama; Hoadley, Andrew F A

2012-06-15

Hybrid ion exchange electrodialysis, also called electrodeionization (IXED), is a technology in which a conventional ion exchange (IX) is combined with electrodialysis (ED) to intensify mass transfer and to increase the limiting current density and therefore to carry out the treatment process more effectively. It allows the purification of metal-containing waters, as well as the production of concentrated metal salt solutions, which could be recycled. The objective of this paper was to investigate the ability of the IXED technique for the treatment of acidified copper sulphate solutions simulating rinsing water of copper plating lines. A single-stage IXED process at lab-scale with a small bed of ion exchanger resin with a uniform composition was evaluated, and the treatment performance of the process was thoroughly investigated. The IXED stack was assembled as a bed layered with the ion exchanger resin (strong acid cation-exchange Dowex™) and inert materials. The stack configuration was designed to prevent a non-uniform distribution of the current in the bed and to allow faster establishment of steady-state in the cell for IXED operation. The influence of operating conditions (e.g. ion exchanger resin with a cross-linking degree from 2 to 8% DVB, and current density) on IXED performance was examined. A response surface methodology (RSM) was used to evaluate the effects of the processing parameters of IXED on (i) the abatement yield of the metal cation, which is a fundamental purification parameter and an excellent indicator of the extent of IXED, (ii) the current yield or the efficiency of copper transport induced by the electrical field and (iii) the energy consumption. The experimental results showed that the performance at steady-state of the IXED operation with a layered bed remained modest, because of the small dimension of the bed and notably the current efficiency varied from 25 to 47% depending on the conditions applied. The feasibility of using the IXED in operations for removal of heavy metals from moderately dilute rinsing waters was successfully demonstrated. Copyright © 2012 Elsevier Ltd. All rights reserved.

Enhanced gain and output power of a sealed-off rf-excited CO2 waveguide laser with gold-plated electrodes

NASA Astrophysics Data System (ADS)

Heeman-Ilieva, M. B.; Udalov, Yu. B.; Hoen, K.; Witteman, W. J.

1994-02-01

The small-signal gain and the laser output power have been measured in a cw sealed-off rf-excited CO2 waveguide laser for two different electrode materials, gold-plated copper and aluminum, at several excitation frequencies, gas pressures and mixture compositions. In the case of the gold-plated electrodes an enhancement of the gain up to a factor of 2 and the output power up to a factor of 1.4 with time at a frequency of 190 MHz and 60 Torr of 1:1:5+5% (CO2:N2:He+Xe) mixture is observed. This is believed to be the result of the gold catalytic activities which are favored by increased electrode temperatures and helium rich gas compositions.

Synthesis of Commercial Products from Copper Wire-Drawing Waste

NASA Astrophysics Data System (ADS)

Ayala, J.; Fernández, B.

2014-06-01

Copper powder and copper sulfate pentahydrate were obtained from copper wire-drawing scale. The hydrometallurgical recycling process proposed in this article yields a high-purity copper powder and analytical grade copper sulfate pentahydrate. In the first stage of this process, the copper is dissolved in sulfuric acid media via dismutation of the scale. In the second stage, copper sulfate pentahydrate is precipitated using ethanol. Effects such as pH, reaction times, stirring speed, initial copper concentration, and ethanol/solution volume ratio were studied during the precipitation from solution reaction. The proposed method is technically straightforward and provides efficient recovery of Cu from wire-drawing scale.

Magnetic field sensor based on the Ampere's force using dual-polarization DBR fiber laser

NASA Astrophysics Data System (ADS)

Yao, Shuang; Zhang, Yang; Guan, Baiou

2015-08-01

A novel magnetic field sensor using distributed Bragg reflector (DBR) fiber laser by Ampere's force effect is proposed and experimentally demonstrated. The key sensing element, that is the dual-polarization DBR fiber laser, is fixed on the middle part of two copper plates which carry the current. Ampere's force is applied onto the coppers due to an external magnetic field generated by a DC solenoid. Thus, the lateral force from the coppers is converted to a corresponding beat frequency signal shift produced by the DBR laser. The electric current sensing is also realized by the same configuration and same principle simultaneously in an intuitive manner. Good agreement between the theory calculation and the experimental results is obtained, which shows a good linearity. This sensor's sensitivity to the magnetic field and to the electric current finally reaches ~258.92 kHz/mT and ~1.08727 MHz/A, respectively.

Study on the effect of temperature rise on grain refining during fabrication of nanocrystalline copper under explosive loading

NASA Astrophysics Data System (ADS)

Wang, Jinxiang; Yang, Rui; Jiang, Li; Wang, Xiaoxu; Zhou, Nan

2013-11-01

Nanocrystalline (NC) copper was fabricated by severe plastic deformation of coarse-grained copper at a high strain rate under explosive loading. The feasibility of grain refinement under different explosive loading and the influence of overall temperature rise on grain refinement under impact compression were studied in this paper. The calculation model for the macroscopic temperature rise was established according to the adiabatic shock compression theory. The calculation model for coarse-grained copper was established by the Voronoi method and the microscopic temperature rise resulted from severe plastic deformation of grains was calculated by ANSYS/ls-dyna finite element software. The results show that it is feasible to fabricate NC copper by explosively dynamic deformation of coarse-grained copper and the average grain size of the NC copper can be controlled between 200˜400 nm. The whole temperature rise would increase with the increasing explosive thickness. Ammonium nitrate fuel oil explosive was adopted and five different thicknesses of the explosive, which are 20 mm, 25 mm, 30 mm, 35 mm, 45 mm, respectively, with the same diameter using 20 mm to the fly plate were adopted. The maximum macro and micro temperature rise is up to 532.4 K, 143.4 K, respectively, which has no great effect on grain refinement due to the whole temperature rise that is lower than grain growth temperature according to the high pressure melting theory.

The role of copper in the manufacture of Finnish Emmental cheese.

PubMed

Mato Rodriguez, L; Ritvanen, T; Joutsjoki, V; Rekonen, J; Alatossava, T

2011-10-01

The effects of added copper in the manufacture of Finnish Emmental cheese were studied. Consequently, cheeses were produced with or without the copper supplement and a facultative heterofermentative strain, Lactobacillus rhamnosus Lc705, which is currently utilized as a protective culture in large-scale manufacture in Finland. Cheeses were examined at 1, 7, 30, 60, and 90 d from the microbiological, chemical, and sensory points of view. Organic acid production was affected by the presence of copper in the cheeses. The addition of copper to cheesemilk increased the level of primary proteolysis and slowed secondary proteolysis as measured by nitrogen content in different extracts after citrate fractionation of cheeses, in pH 4.4-soluble nitrogen and 5% phosphotungstic acid-soluble nitrogen, respectively. The presence of copper appears to positively regulate the sensory characteristics of the cheese produced in our conditions; in particular, consistency was affected significantly. The role of the Lb. rhamnosus Lc705 protective strain has not been shown to have important effects on most of the parameters that influence the final quality of the cheeses. Although the traditional plating systems for revealing bacterial populations during cheese manufacture did not reveal any drastic differences caused by the presence of copper, the results from chemical and sensory analyses suggest that its use plays a significant role in the regulation of bacterial physiological and biochemical activities, which in turn affect the sensory quality of Emmental cheese. Copyright © 2011 American Dairy Science Association. Published by Elsevier Inc. All rights reserved.

Study on copper kinetics in processing sulphide ore mixed with copper and zinc with sulfuric acid leaching under pressure

NASA Astrophysics Data System (ADS)

Wen-bo, LUO; Ji-kun, WANG; Yin, GAN

2018-01-01

Sulphide ore mixed with copper and zinc is processed with pressure acid leaching. Research is conducted on the copper kinetic. The stirring rate is set at 600 rpm which could eliminate the influence of external diffusions. Research is conducted on the factors affecting the copper leaching kinetic are temperature, pressure, concentration of sulfuric acid, particle size. The result shows that the apparent activity energy is 50.7 KJ/mol. We could determine that the copper leaching process is shrinking core model of chemical reaction control and work out the leaching equation.

Protective hybrid coating containing silver, copper and zinc cations effective against human immunodeficiency virus and other enveloped viruses.

PubMed

Hodek, Jan; Zajícová, Veronika; Lovětinská-Šlamborová, Irena; Stibor, Ivan; Müllerová, Jana; Weber, Jan

2016-04-01

Healthcare-acquired infections by pathogenic microorganisms including viruses represent significant health concern worldwide. Next to direct transmission from person-to-person also indirect transmission from contaminated surfaces is well documented and important route of infections. Here, we tested antiviral properties of hybrid coating containing silver, copper and zinc cations that was previously shown to be effective against pathogenic bacteria including methicillin-resistant Staphylococcus aureus. Hybrid coatings containing silver, copper and zinc cations were prepared through radical polymerization via sol-gel method and applied on glass slides or into the wells of polymethylmethacrylate plates. A 10 μl droplet of several viruses such as human immunodeficiency virus type 1 (HIV-1), influenza, dengue virus, herpes simplex virus, and coxsackievirus was added to coated and uncoated slides or plates, incubated usually from 5 to 240 min and followed by titer determination of recovered virus. Scanning electron microscopy analysis showed better adhesion of coatings on glass surfaces, which resulted in 99.5-100 % HIV-1 titer reduction (3.1 ± 0.8 log10TCID50, n = 3) already after 20 min of exposure to coatings, than on coated polymethylmethacrylate plates with 75-100 % (1.7 ± 1.1 log10TCID50, n = 3) and 98-100 % (2.3 ± 0.5 log10TCID50, n = 3) HIV-1 titer reduction after 20 and 120 min of exposure, respectively. Slower virucidal kinetics was observed with other enveloped viruses, where 240 min exposure to coated slides lead to 97 % (dengue), 100 % (herpes simplex) and 77 % (influenza) reduction in virus titers. Interestingly, only marginal reduction in viral titer after 240 min of exposure was noticed for non-enveloped coxsackie B3 virus. Our hybrid coatings showed virucidal activity against HIV and other enveloped viruses thus providing further findings towards development of broad-spectrum antimicrobial coating suitable for surfaces in healthcare settings.

Fabricating Copper Nanotubes by Electrodeposition

NASA Technical Reports Server (NTRS)

Yang, E. H.; Ramsey, Christopher; Bae, Youngsam; Choi, Daniel

2009-01-01

Copper tubes having diameters between about 100 and about 200 nm have been fabricated by electrodeposition of copper into the pores of alumina nanopore membranes. Copper nanotubes are under consideration as alternatives to copper nanorods and nanowires for applications involving thermal and/or electrical contacts, wherein the greater specific areas of nanotubes could afford lower effective thermal and/or electrical resistivities. Heretofore, copper nanorods and nanowires have been fabricated by a combination of electrodeposition and a conventional expensive lithographic process. The present electrodeposition-based process for fabricating copper nanotubes costs less and enables production of copper nanotubes at greater rate.

GRCop-84: A High Temperature Copper-based Alloy For High Heat Flux Applications

NASA Technical Reports Server (NTRS)

Ellis, David L.

2005-01-01

While designed for rocket engine main combustion chamber liners, GRCop-84 (Cu-8 at.% Cr-4 at.% Nb) offers potential for high heat flux applications in industrial applications requiring a temperature capability up to approximately 700 C (1292 F). GRCop-84 is a copper-based alloy with excellent elevated temperature strength, good creep resistance, long LCF lives and enhanced oxidation resistance. It also has a lower thermal expansion than copper and many other low alloy copper-based alloys. GRCop-84 can be manufactured into a variety of shapes such as tubing, bar, plate and sheet using standard production techniques and requires no special production techniques. GRCop-84 forms well, so conventional fabrication methods including stamping and bending can be used. GRCop-84 has demonstrated an ability to be friction stir welded, brazed, inertia welded, diffusion bonded and electron beam welded for joining to itself and other materials. Potential applications include plastic injection molds, resistance welding electrodes and holders, permanent metal casting molds, vacuum plasma spray nozzles and high temperature heat exchanger applications.

A dynamic tester to evaluate the thermal and moisture behaviour of the surface of textiles.

PubMed

Li, Wenbin; Xu, Weilin; Wang, Hao; Wang, Xin

2016-01-01

The thermal and moisture behaviour of the microclimate of textiles is crucial in determining the physiological comfort of apparel, but it has not been investigated sufficiently due to the lack of particular evaluation techniques. Based on sensing, temperature controlling and wireless communicating technology, a specially designed tester has been developed in this study to evaluate the thermal and moisture behaviour of the surface of textiles in moving status. A temperature acquisition system and a temperature controllable hotplate have been established to test temperature and simulate the heat of human body, respectively. Relative humidity of the surface of fabric in the dynamic process has been successfully tested through sensing. Meanwhile, wireless communication technology was applied to transport the acquired data of temperature and humidity to computer for further processing. Continuous power supply was achieved by intensive contact between an elastic copper plate and copper ring on the rotating shaft. This tester provides the platform to evaluate the thermal and moisture behaviour of textiles. It enables users to conduct a dynamic analysis on the temperature and humidity together with the thermal and moisture transport behaviour of the surface of fabric in moving condition. Development of this tester opens the door of investigation on the micro-climate of textiles in real time service, and eventually benefits the understanding of the sensation comfort and wellbeing of apparel wearers. Copyright © 2015 Elsevier Ltd. All rights reserved.

A tectonic model for the spatial occurrence of porphyry copper and polymetallic vein deposits - applications to Central Europe

USGS Publications Warehouse

Drew, Lawrence J.

2006-01-01

A structural-tectonic model, which was developed to assess the occurrence of undiscovered porphyry copper deposits and associated polymetallic vein systems for the Matra Mountains, Hungary, has been expanded here and applied to other parts of central Europe. The model explains how granitoid stocks are emplaced and hydrothermal fluids flow within local strain features (duplexes) within strike-slip fault systems that develop in continental crust above subducting plates. Areas of extension that lack shear at the corners and along the edges of the fault duplexes are structural traps for the granitoid stocks associated with porphyry copper deposits. By contrast, polymetallic vein deposits are emplaced where shear and extension are prevalent in the interior of the duplexes. This model was applied to the Late Cretaceous-age porphyry copper and polymetallic vein deposits in the Banat-Timok-Srednogorie region of Romania-Serbia-Bulgaria and the middle Miocene-age deposits in Romania and Slovakia. In the first area, porphyry copper deposits are most commonly located at the corners, and occasionally along the edges, of strike-slip fault duplexes, and the few polymetallic vein deposits identified are located at interior sites of the duplexes. In the second area, the model accounts for the preferred sites of porphyry copper and polymetallic vein deposits in the Apuseni Mountains (Romania) and central Slovakian volcanic field (Slovakia).

Metal-enhanced fluorescence platforms based on plasmonic ordered copper arrays: wavelength dependence of quenching and enhancement effects.

PubMed

Sugawa, Kosuke; Tamura, Takahiro; Tahara, Hironobu; Yamaguchi, Daisuke; Akiyama, Tsuyoshi; Otsuki, Joe; Kusaka, Yasuyuki; Fukuda, Nobuko; Ushijima, Hirobumi

2013-11-26

Ordered arrays of copper nanostructures were fabricated and modified with porphyrin molecules in order to evaluate fluorescence enhancement due to the localized surface plasmon resonance. The nanostructures were prepared by thermally depositing copper on the upper hemispheres of two-dimensional silica colloidal crystals. The wavelength at which the surface plasmon resonance of the nanostructures was generated was tuned to a longer wavelength than the interband transition region of copper (>590 nm) by controlling the diameter of the underlying silica particles. Immobilization of porphyrin monolayers onto the nanostructures was achieved via self-assembly of 16-mercaptohexadecanoic acid, which also suppressed the oxidation of the copper surface. The maximum fluorescence enhancement of porphyrin by a factor of 89.2 was achieved as compared with that on a planar Cu plate (CuP) due to the generation of the surface plasmon resonance. Furthermore, it was found that while the fluorescence from the porphyrin was quenched within the interband transition region, it was efficiently enhanced at longer wavelengths. It was demonstrated that the enhancement induced by the proximity of the fluorophore to the nanostructures was enough to overcome the highly efficient quenching effects of the metal. From these results, it is speculated that the surface plasmon resonance of copper has tremendous potential for practical use as high functional plasmonic sensor and devices.

Parabolic solar cooker: Cooking with heat pipe vs direct spiral copper tubes

NASA Astrophysics Data System (ADS)

Craig, Omotoyosi O.; Dobson, Robert T.

2016-05-01

Cooking with solar energy has been seen by many researchers as a solution to the challenges of poverty and hunger in the world. This is no exception in Africa, as solar coking is viewed as an avenue to eliminate the problem of food insecurity, insufficient energy supply for household and industrial cooking. There are several types of solar cookers that have been manufactured and highlighted in literature. The parabolic types of solar cookers are known to reach higher temperatures and therefore cook faster. These cookers are currently being developed for indoor cooking. This technology has however suffered low cooking efficiency and thus leads to underutilization of the high heat energy captured from the sun in the cooking. This has made parabolic solar cookers unable to compete with other conventional types of cookers. Several methods to maximize heat from the sun for indirect cooking has been developed, and the need to improve on them of utmost urgency. This paper investigates how to optimize the heat collected from the concentrating types of cookers by proposing and comparing two types of cooking sections: the spiral hot plate copper tube and the heat pipe plate. The system uses the concentrating solar parabolic dish technology to focus the sun on a conical cavity of copper tubes and the heat is stored inside an insulated tank which acts both as storage and cooking plate. The use of heat pipes to transfer heat between the oil storage and the cooking pot was compared to the use of a direct natural syphon principle which is achieved using copper tubes in spiral form like electric stove. An accurate theoretical analysis for the heat pipe cooker was achieved by solving the boiling and vaporization in the evaporator side and then balancing it with the condensation and liquid-vapour interaction in the condenser part while correct heat transfer, pressure and height balancing was calculated in the second experiment. The results show and compare the cooking time, boiling characteristics, overall utilisation efficiencies and necessary comparison between the two system and other existing systems. AIP Proceedings article template has many predefined paragraph styles for you to use/apply as you write your paper. To format your abstract, use the Microsoft Word template style.

CNC Machining Of The Complex Copper Electrodes

NASA Astrophysics Data System (ADS)

Popan, Ioan Alexandru; Balc, Nicolae; Popan, Alina

2015-07-01

This paper presents the machining process of the complex copper electrodes. Machining of the complex shapes in copper is difficult because this material is soft and sticky. This research presents the main steps for processing those copper electrodes at a high dimensional accuracy and a good surface quality. Special tooling solutions are required for this machining process and optimal process parameters have been found for the accurate CNC equipment, using smart CAD/CAM software.

A novel graded density impactor

NASA Astrophysics Data System (ADS)

Winter, R. E.; Cotton, M.; Harris, E. J.; Chapman, D. J.; Eakins, D.

2014-05-01

Ramp loading using graded-density-impactors as flyers in gas-gun-driven plate impact experiments can yield new and useful information about the equation of state and the strength properties of the loaded material. Selective Laser Melting, an additive manufacture technique, was used to manufacture a graded density flyer, termed the "bed of nails" (BON). A 2 mm thick × 100 mm diameter solid disc of stainless steel formed a base for an array of tapered spikes of length 6 mm and spaced 1 mm apart. The two experiments to test the concept were performed at impact velocities of 900 m/s and 1100 m/s using the 100 mm gas gun at the Institute of Shock Physics at Imperial College, London. In each experiment a BON flyer was impacted onto a copper buffer plate which helped to smooth out perturbations in the wave profile. The ramp delivered to the copper buffer was in turn transmitted to three tantalum targets of thicknesses 3, 5 and 7 mm, which were mounted in contact with the back face of the copper. Heterodyne velocimetry was used to measure the velocity-time history, at the back faces of the tantalum discs. The wave profiles display a smooth increase in velocity over a period of ~2.5 us, with no indication of a shock jump. The measured profiles have been analysed to generate a stress strain curve for tantalum. The results have been compared with the predictions of the Sandia National Laboratories hydrocode, CTH.

Structural, mechanical and magnetic study on galvanostatic electroplated nanocrystalline NiFeP thin films

NASA Astrophysics Data System (ADS)

Kalaivani, A.; Senguttuvan, G.; Kannan, R.

2018-03-01

Nickel based alloys has a huge applications in microelectronics and micro electromechanical systems owing to its superior soft magnetic properties. With the advantages of simplicity, cost-effectiveness and controllable patterning, electroplating processes has been chosen to fabricate thin films in our work. The soft magnetic NiFeP thin film was successfully deposited over the surface of copper plate through galvanostatic electroplating method by applying constant current density of 10 mA cm-2 for a deposition rate for half an hour. The properties of the deposited NiFeP thin films were analyzed by subjecting it into different physio-chemical characterization such as XRD, SEM, EDAX, AFM and VSM. XRD pattern confirms the formation of NiFeP particles and the structural analysis reveals that the NiFeP particles were uniformly deposited over the surface of copper substrate. The surface roughness analysis of the NiFeP films was done using AFM analysis. The magnetic studies and the hardness of the thin film were evaluated from the VSM and hardness test. The NiFeP thin films possess lower coercivity with higher magnetization value of 69. 36 × 10-3 and 431.92 Gauss.

Investigation of the decolorization efficiency of two pin-to-plate corona discharge plasma system for industrial wastewater treatment

DOE Office of Scientific and Technical Information (OSTI.GOV)

El-Tayeb, A., E-mail: ahmed.khalil@ejust.edu.eg; El-Shazly, A. H.; Elkady, M. F.

In this article, a dual pin-to-plate high-voltage corona discharge system is introduced to study experimentally the gap distance, the contact time, the effect of pin and plate materials, the thickness of ground plate and the conductivity on the amount of Acid Blue 25 dye color removal efficiency from polluted water. A study for the optimum air gap distance between dual pin and surface of Acid Blue 25 dye solution is carried out using 3D-EM simulator to find maximum electric field intensity at the tip of both pins. The outcomes display that the best gap for corona discharge is approximately 5more » mm for 15-kV source. This separation is constant during the study of other factors. In addition, an investigation of the essential reactive species responsible for oxidation of the dye organic compounds (O{sub 3} in air discharge, O{sub 3} in water, and H{sub 2}O{sub 2}) during the experimental time is conducted. Three various materials such as: stainless steel, copper and aluminum are used for pins and plate. The maximum color removal efficiencies of Acid Blue 25 dyes are 99.03, 82.04, and 90.78% after treatment time 15 min for stainless steel, copper, and aluminum, respectively. Measurement results for the impact of thickness of an aluminum ground plate on color removal competence show color removal efficiencies of 86.3, 90.78, and 98.06% after treatment time 15 min for thicknesses of 2, 0.5, and 0.1 mm, respectively. The increasing of the solution conductivity leads to the reduction of decolorization efficiency. A kinetic model is used to define the performance of corona discharge system. The models of pseudo-zero-order, pseudo-first-order, and pseudo-second-order reaction kinetics are utilized to investigate the decolorization of Acid Blue 25 dye. The rate of degradation of Acid Blue 25 dye follows the pseudo-first-order kinetics in the dye concentration.« less

Laser Brazing with Beam Scanning: Experimental and Simulative Analysis

NASA Astrophysics Data System (ADS)

Heitmanek, M.; Dobler, M.; Graudenz, M.; Perret, W.; Göbel, G.; Schmidt, M.; Beyer, E.

Laser beam brazing with copper based filler wire is a widely established technology for joining zinc-coated steel plates in the body-shop. Successful applications are the divided tailgate or the zero-gap joint, which represents the joint between the side panel and the roof-top of the body-in-white. These joints are in direct view to the customer, and therefore have to fulfil highest optical quality requirements. For this reason a stable and efficient laser brazing process is essential. In this paper the current results on quality improvement due to one dimensional laser beam deflections in feed direction are presented. Additionally to the experimental results a transient three-dimensional simulation model for the laser beam brazing process is taken into account. With this model the influence of scanning parameters on filler wire temperature and melt pool characteristics is analyzed. The theoretical predictions are in good accordance with the experimental results. They show that the beam scanning approach is a very promising method to increase process stability and seam quality.

Counter-current acid leaching process for copper azole treated wood waste.

PubMed

Janin, Amélie; Riche, Pauline; Blais, Jean-François; Mercier, Guy; Cooper, Paul; Morris, Paul

2012-09-01

This study explores the performance of a counter-current leaching process (CCLP) for copper extraction from copper azole treated wood waste for recycling of wood and copper. The leaching process uses three acid leaching steps with 0.1 M H2SO4 at 75degrees C and 15% slurry density followed by three rinses with water. Copper is recovered from the leachate using electrodeposition at 5 amperes (A) for 75 min. Ten counter-current remediation cycles were completed achieving > or = 94% copper extraction from the wood during the 10 cycles; 80-90% of the copper was recovered from the extract solution by electrodeposition. The counter-current leaching process reduced acid consumption by 86% and effluent discharge volume was 12 times lower compared with the same process without use of counter-current leaching. However, the reuse of leachates from one leaching step to another released dissolved organic carbon and caused its build-up in the early cycles.

Laser synthesis of a copper-single-walled carbon nanotube nanocomposite via molecular-level mixing and non-equilibrium solidification

NASA Astrophysics Data System (ADS)

Tu, Jay F.; Rajule, Nilesh; Molian, Pal; Liu, Yi

2016-12-01

A copper-single-walled carbon nanotube (Cu-SWCNT) metal nanocomposite could be an ideal material if it can substantially improve the strength of copper while preserving the metal’s excellent thermal and electrical properties. However, synthesis of such a nanocomposite is highly challenging, because copper and SWCNTs do not form intermetallic compounds and are insoluble; as a result, there are serious issues regarding wettability and fine dispersion of SWCNTs within the copper matrix. In this paper we present a novel wet process, called the laser surface implantation process (LSI), to synthesize Cu-SWCNT nanocomposites by mixing SWCNTs into molten copper. The LSI process includes drilling several microholes on a copper substrate, filling the microholes with SWCNTs suspended in solution, and melting the copper substrate to create a micro-well of molten copper. The molten copper advances radially outward to engulf the microholes with pre-deposited SWCNTs to form the Cu-SWCNT implant upon solidification. Rapid and non-equilibrium solidification is achieved due to copper’s excellent heat conductivity, so that SWCNTs are locked in position within the copper matrix without agglomerating into large clusters. This wet process is very different from the typical dry processes used in powder metallurgy. Very high hardness improvement, up to 527% over pure copper, was achieved, confirmed by micro-indentation tests, with only a 0.23% SWCNT volume fraction. The nanostructure of the nanocomposite was characterized by TEM imaging, energy-dispersive x-ray spectroscopy mapping and spectroscopy measurements. The SWCNTs were found to be finely dispersed within the copper matrix with cluster sizes in the range of nanometers, achieving the goal of molecular-level mixing.

Process for removing copper in a recoverable form from solid scrap metal

DOEpatents

Hartman, Alan D.; Oden, Laurance L.; White, Jack C.

1995-01-01

A process for removing copper in a recoverable form from a copper/solid ferrous scrap metal mix is disclosed. The process begins by placing a copper/solid ferrous scrap metal mix into a reactor vessel. The atmosphere within the reactor vessel is purged with an inert gas or oxidizing while the reactor vessel is heated in the area of the copper/solid ferrous scrap metal mix to raise the temperature within the reactor vessel to a selected elevated temperature. Air is introduced into the reactor vessel and thereafter hydrogen chloride is introduced into the reactor vessel to obtain a desired air-hydrogen chloride mix. The air-hydrogen chloride mix is operable to form an oxidizing and chloridizing atmosphere which provides a protective oxide coating on the surface of the solid ferrous scrap metal in the mix and simultaneously oxidizes/chloridizes the copper in the mix to convert the copper to a copper monochloride gas for transport away from the solid ferrous scrap metal. After the copper is completely removed from the copper/solid ferrous scrap metal mix, the flows of air and hydrogen chloride are stopped and the copper monochloride gas is collected for conversion to a recoverable copper species.

Recovery of Silver and Gold from Copper Anode Slimes

NASA Astrophysics Data System (ADS)

Chen, Ailiang; Peng, Zhiwei; Hwang, Jiann-Yang; Ma, Yutian; Liu, Xuheng; Chen, Xingyu

2015-02-01

Copper anode slimes, produced from copper electrolytic refining, are important industrial by-products containing several valuable metals, particularly silver and gold. This article provides a comprehensive overview of the development of the extraction processes for recovering silver and gold from conventional copper anode slimes. Existing processes, namely pyrometallurgical processes, hydrometallurgical processes, and hybrid processes involving the combination of pyrometallurgical and hydrometallurgical technologies, are discussed based in part on a review of the form and characteristics of silver and gold in copper anode slimes. The recovery of silver and gold in pyrometallurgical processes is influenced in part by the slag and matte/metal chemistry and related characteristics, whereas the extraction of these metals in hydrometallurgical processes depends on the leaching reagents used to break the structure of the silver- and gold-bearing phases, such as selenides. By taking advantage of both pyrometallurgical and hydrometallurgical techniques, high extraction yields of silver and gold can be obtained using such combined approaches that appear promising for efficient extraction of silver and gold from copper anode slimes.

The Introduction and Early Use of Lithography in the United States.

ERIC Educational Resources Information Center

Barnhill, Georgia B.

This paper discusses the use of lithography in the United States in the early 1800s. Highlights include: the development of lithography in Germany between 1796 and 1798; early expectations for lithography; competition against the existing technology for the production of images--relief prints and copper-plate engravings; examples of 18th-century…

Effects of ultra-vacuum and space environment on contact ohmic resistance: LDEF experiment AO 138-11

NASA Technical Reports Server (NTRS)

Assie, Jean-Pierre; Perotto, Alfred

1992-01-01

The FRECOPA experimentation of chemical resistance of electrical connector contacts, as described, has evidenced the detrimental time variations of nickel plated conductors and gilded copper contacts, irrespective of crimping storage or metal peening conditions. With a view to reorient aluminum technology a silvered aluminum conductor/gilded aluminum contact solution was evaluated.

Report on Northwestern's Air-cooled, Copper Precipitation Hardened, High Strength, Weldable Steel Cast and Hot Rolled at Oregon Steel Mills

DOT National Transportation Integrated Search

1996-09-27

This research has shown that a Grade 70 construction steel of 1/2- to 1-inch plate thicknesses can be produced without a quench and temper or accelerated cooling from hot-rolling if the Cu content in the steel is sufficiently high. Coherent very fine...

Standardized performance tests of collectors of solar thermal energy: An evacuated flatplate copper collector with a serpentine flow distribution

NASA Technical Reports Server (NTRS)

Johnson, S. M.

1976-01-01

Basic test results are given for a flat plate solar collector whose performance was determined in the NASA-Lewis solar simulator. The collector was tested over ranges of inlet temperatures, fluxes and one coolant flow rate. Collector efficiency is correlated in terms of inlet temperature and flux level.

Apparatus and method for removing mercury vapor from a gas stream

DOEpatents

Ganesan, Kumar [Butte, MT

2008-01-01

A metallic filter effectively removes mercury vapor from gas streams. The filter captures the mercury which then can be released and collected as product. The metallic filter is a copper mesh sponge plated with a six micrometer thickness of gold. The filter removes up to 90% of mercury vapor from a mercury contaminated gas stream.

Copper-Sulfate Pentahydrate as a Product of the Waste Sulfuric Acid Solution Treatment

NASA Astrophysics Data System (ADS)

Marković, Radmila; Stevanović, Jasmina; Avramović, Ljiljana; Nedeljković, Dragutin; Jugović, Branimir; Stajić-Trošić, Jasna; Gvozdenović, Milica

2012-12-01

The aim of this study is synthesis of copper-sulfate pentahydrate from the waste sulfuric acid solution-mother liquor generated during the regeneration process of copper bleed solution. Copper is removed from the mother liquor solution in the process of the electrolytic treatment using the insoluble lead anodes alloyed with 6 mass pct of antimony on the industrial-scale equipment. As the result of the decopperization process, copper is removed in the form of the cathode sludge and is precipitated at the bottom of the electrolytic cell. By this procedure, the content of copper could be reduced to the 20 mass pct of the initial value. Chemical characterization of the sludge has shown that it contains about 90 mass pct of copper. During the decopperization process, the very strong poison, arsine, can be formed, and the process is in that case terminated. The copper leaching degree of 82 mass pct is obtained using H2SO4 aqueous solution with the oxygen addition during the cathode sludge chemical treatment at 80 °C ± 5 °C. Obtained copper salt satisfies the requirements of the Serbian Standard for Pesticide, SRPS H.P1. 058. Therefore, the treatment of waste sulfuric acid solutions is of great economic and environmental interest.

Passive Gas-Gap Heat Switches for Use in Adiabatic Demagnetization Refrigerators

NASA Technical Reports Server (NTRS)

Shirron, P. J.; Canavan, E. R.; DiPirro, M. J.; Jackson, M.; Panek, J.; Tuttle, J. G.; Krebs, Carolyn (Technical Monitor)

2001-01-01

We have designed, built, and tested a gas gap heat switch that works passively, without the need for a separate, thermally activated getter. This switch uses He-3 condensed as a thin film on alternating plates of copper. The switch is thermally conductive at temperatures above about 0.2 K, and is insulating if either end of the switch is below about 0.15 K. The "on" conductance (7 mW/K at 0.25K) is limited by the surface area and gap between the copper leaves, the saturated vapor pressure of the He-3, and the Kapitza boundary resistance between the He-3 and the copper. The "off" conductance is determined by the helium containment shell which physically supports the two conductive ends. We have also designed and are building passive gas gap heat switches which will passively turn off near 1 K and 4 K. For these switches we rely on the rapidly changing vapor pressure of He-4 above neon or copper substrates, respectively, when the coverage is less than one monolayer. The different binding energies of the He-4 to the neon or copper give rise to the different temperatures where the switches transition between the on and off states.

Paintings on copper by the Flemish artist Frans Francken II: PIXE characterization by external microbeam

NASA Astrophysics Data System (ADS)

Corregidor, V.; Oliveira, A. R.; Rodrigues, P. A.; Alves, L. C.

2015-04-01

Resorting to an external proton microbeam, PIXE analyses of three oil paintings on copper support dated from the XVII century and attributed to the Flemish artist Frans Francken II, were undertaken. The present work aims to contribute to the compositional study of the painting materials employed by XVII century artists that exploited copper as a support for oil painting, and specifically the materials used by Francken's workshop, particularly copper plates. Because of the low thickness of the pictorial layers of this type of paintings and its non-destructive character, PIXE is the ideal technique to study the elemental composition of the paintings. Several spots in each painting were chosen for analysis in order to cover almost all the pigments used in the colour palette. Lead and calcium were detected in practically every analysed regions, probably related to the presence of lead white and chalk, usually used as ground layer on copper paintings. Small quantities of gold were also detected, which is present in many of this artist's works to embellish some details of the representations. Also this work reports the first application of the external proton microbeam set-up available at CTN/IST in Portugal for the characterization of oil paintings.

40 CFR 421.60 - Applicability: Description of the secondary copper subcategory.

Code of Federal Regulations, 2011 CFR

2011-07-01

... secondary copper subcategory. 421.60 Section 421.60 Protection of Environment ENVIRONMENTAL PROTECTION... CATEGORY Secondary Copper Subcategory § 421.60 Applicability: Description of the secondary copper..., processing, and remelting of new and used copper scrap and residues to produce copper metal and copper alloys...

40 CFR 421.60 - Applicability: Description of the secondary copper subcategory.

Code of Federal Regulations, 2010 CFR

2010-07-01

... secondary copper subcategory. 421.60 Section 421.60 Protection of Environment ENVIRONMENTAL PROTECTION... CATEGORY Secondary Copper Subcategory § 421.60 Applicability: Description of the secondary copper..., processing, and remelting of new and used copper scrap and residues to produce copper metal and copper alloys...

Porphyry copper deposits distribution along the western Tethyan and Andean subductions: insights from a paleogeographic approach

NASA Astrophysics Data System (ADS)

Bertrand, G.

2012-12-01

The genesis of many types of mineral deposits is closely linked to tectonic and petrographic conditions resulting from specific geodynamic contexts. Porphyry deposits, for instance, are associated to calc-alkaline magmatism of subduction zones. In order to better understand the relationships between ore deposit distribution and their tectonic context, and help identifying geodynamic-related criteria of favorability that would, in turn, help mineral exploration, we propose a paleogeographic approach. Paleogeographic reconstructions, based on global or regional plate tectonic models, are crucial tools to assess tectonic and kinematic contexts of the past. We use this approach to study the distribution of porphyry copper deposits along the western Tethyan and Andean subductions since Lower Cretaceous and Paleocene, respectively. For both convergent contexts, databases of porphyry copper deposits, including, among other data, their age and location, were compiled. Spatial and temporal distribution of the deposits is not random and show that they were emplaced in distinct clusters. Five clusters are identified along the western Tethyan suture, from Lower Cretaceous to Pleistocene, and at least three along the Andes, from Paleocene to Miocene. Two clusters in the Aegean-Balkan-Carpathian area, that were emplaced in Upper Cretaceous and Oligo-Miocene, and two others in the Andes, that were emplaced in late Eocene and Miocene, are studied in details and correlated with the past kinematics of the Africa-Eurasia and Nazca-South America plate convergences, respectively. All these clusters are associated with a similar polyphased kinematic context that is closely related to the dynamics of the subductions. This context is characterized by 1) a relatively fast convergence rate, shortly followed by 2) a drastic decrease of this rate. To explain these results, we propose a polyphased genetic model for porphyry copper deposits with 1) a first stage of rapid subduction rate, favoring high melt production in the mantle wedge, by dehydration of the subducted oceanic crust, and increased influx of mafic magmas in the MASH (Melting, Assimilation, Storage, Homogenization) zone, and 2) a subsequent significant decrease in subduction rate, favoring extensional regime within the upper plate and easing upward migration of fertile magmas to the upper crust. This second effect seems to be confirmed in the Aegean-Balkan-Carpathian area where the two clusters are spatially and temporally correlated with known extensional regimes. Although preliminary, these results highlight the control of the geodynamic context, and especially the subduction kinematics, on the spatial and temporal distribution of porphyry copper deposits. This study also confirms that the paleogeographic approach is a promising tool that could help identifying geodynamic and tectonic criteria favoring the genesis of various ore deposit types. Correlatively, ore deposits may be considered, in future studies, as possible markers of past geodynamic contexts.

Development of a Contactless Technique for Electrodeposition and Porous Silicon Formation

NASA Astrophysics Data System (ADS)

Zhao, Mingrui

One of the key active manufacturing technologies for 3D integration is through silicon vias (TSVs), which involves etching of deep vias in a silicon substrate that are filled with an electrodeposited metal, and subsequent removal of excess metal by chemical mechanical planarization (CMP). Electrodeposition often results in undesired voids in the TSV metal fill as well as a thick overburden layer. These via plating defects can severely degrade interconnect properties and lead to variation in via resistance, electrically open vias, and trapped plating chemicals that present a reliability hazard. Thick overburden layers result in lengthy and expensive CMP processing. We are proposing a technique that pursues a viable method of depositing a high quality metal inside vias with true bottom-up filling, using an additive-free deposition solution. The mechanism is based on a novel concept of electrochemical oxidation of backside silicon that releases electrons, and subsequent chemical etching of silicon dioxide for regeneration of the surface. Electrons are transported through the bulk silicon to the interface of the via bottom and the deposition solution, where the metal ions accept these electrons and electrodeposit resulting in the bottom-up filling of the large aspect ratio vias. With regions outside the vias covered bydielectric, no metal electrodeposition should occur in these regions. Our new bottom-up technique was initially examined and successfully demonstrated on blanket silicon wafers and shown to supply electrons to provide bottom-up filling advantage of through-hole plating and the depth tailorability of blind vias. We have also conducted a fundamental study that investigated the effect of various process parameters on the characteristics of deposited Cu and Ni and established correlations between metal filling properties and various electrochemical and solution variables. A copper sulfate solution with temperature of about 65°C was shown to be suitable for achieving stable and high values of current density that translated to copper deposition rates of 2.4 mum/min with good deposition uniformity. The importance of backside silicon oxidation and subsequent oxide etching on the kinetics of metal deposition on front side silicon has also been highlighted. Further, a process model was also developed to simulate the through silicon via copper filling process using conventional and contactless electrodeposition methods with no additives being used in the electrolyte solution. A series of electrochemical measurements were employed and integrated in the development of the comprehensive process simulator. The experimental data not only provided the necessary parameters for the model but also validated the simulation accuracy. From the simulation results, the "pinch-off" effect was observed for the additive-free conventional deposition process, which further causes partial filling and void formation. By contrast, a void-free filling with higher deposition rates was achieved by the use of the contactless technique. Moreover, experimental results of contactless electrodeposition on patterned wafers showed fast rate bottom-up filling ( 3.3 mum/min) in vias of 4 mum diameter and 50 mum depth (aspect ratio = 12.5) without void formation and no copper overburden in the regions outside the vias. Efforts were also made to extend the use of the contactless technique to other applications such as synthesis of porous silicon. We were able to fabricate porous silicon with a morphological gradient using a novel design of the experimental cell. The resulted porous silicon layers show a large distribution in porosity, pore size and depth along the radius of the samples. Symmetrical arrangements were attributed to decreasing current density radially inward on the silicon surface exposed to surfactant containing HF based etchant solution. The formation mechanism as well as morphological properties and their dependence on different process parameters has been investigated in detail. In the presence of surfactants, an increase in the distribution range of porosity, pore diameter and depth was observed by increasing HF concentration or lowering pH of the etchant solution, as the formation of pores was considered to be limited by the etch rates of silicon dioxide. Gradient porous silicon was also found to be successfully formulated both at high and low current densities. Interestingly, the morphological gradient was not developed when dimethyl sulfoxide (instead of surfactants) was used in etchant solution potentially due to limitations in the availability of oxidizing species at the silicon-etchant solution interface. In the last part of the dissertation, we have discussed the gradient bottom up filling of Cu in porous silicon substrates using the contactless electrochemical method. The radially symmetric current that gradually varied across the radius of the sample area was achieved by utilizing the modified cell design, which resulted in gradient filling in the vias. Effect of different deposition parameters such as applied current density, copper sulfate concentration and etching to deposition area ratio has been examined and discussed. (Abstract shortened by ProQuest.).

Millimeter-wave surface resistance of laser-ablated YBa2Cu3O(7-delta) superconducting films

NASA Technical Reports Server (NTRS)

Miranda, F. A.; Gordon, W. L.; Bhasin, K. B.; Warner, J. D.

1990-01-01

The millimeter-wave surface resistance of YBa2Cu3O(7-delta) superconducting films was measured in a gold-plated copper host cavity at 58.6 GHz between 25 and 300 K. High-quality laser-ablated films of 1.2-micron thickness were deposited on SrTiO3 and LaGaO3 substrates. Their transition temperatures were 90.0 and 88.9 K, with a surface resistance at 70 K of 82 and 116 milliohms, respectively. These values are better than the values for the gold-plated cavity at the same temperature and frequency.

Radiated flow of chemically reacting nanoliquid with an induced magnetic field across a permeable vertical plate

NASA Astrophysics Data System (ADS)

Mahanthesh, B.; Gireesha, B. J.; Athira, P. R.

Impact of induced magnetic field over a flat porous plate by utilizing incompressible water-copper nanoliquid is examined analytically. Flow is supposed to be laminar, steady and two-dimensional. The plate is subjected to a regular free stream velocity as well as suction velocity. Flow formulation is developed by considering Maxwell-Garnetts (MG) and Brinkman models of nanoliquid. Impacts of thermal radiation, viscous dissipation, temperature dependent heat source/sink and first order chemical reaction are also retained. The subjected non-linear problems are non-dimensionalized and analytic solutions are presented via series expansion method. The graphs are plotted to analyze the influence of pertinent parameters on flow, magnetism, heat and mass transfer fields as well as friction factor, current density, Nusselt and Sherwood numbers. It is found that friction factor at the plate is more for larger magnetic Prandtl number. Also the rate of heat transfer decayed with increasing nanoparticles volume fraction and the strength of magnetism.

Eco-friendly copper recovery process from waste printed circuit boards using Fe{sup 3+}/Fe{sup 2+} redox system

DOE Office of Scientific and Technical Information (OSTI.GOV)

Fogarasi, Szabolcs; Imre-Lucaci, Florica; Egedy, Attila

2015-06-15

Highlights: • We developed an ecofriendly mediated electrochemical process for copper recovery. • The recovery of copper was achieved without mechanical pretreatment of the samples. • We identified the optimal flow rate for the leaching and electrowinning of copper. • The copper content of the obtained cathodic deposits was over 99.9%. - Abstract: The present study aimed at developing an original and environmentally friendly process for the recovery of copper from waste printed circuit boards (WPCBs) by chemical dissolution with Fe{sup 3+} combined with the simultaneous electrowinning of copper and oxidant regeneration. The recovery of copper was achieved in anmore » original set-up consisting of a three chamber electrochemical reactor (ER) connected in series with a chemical reactor (CR) equipped with a perforated rotating drum. Several experiments were performed in order to identify the optimal flow rate for the dissolution of copper in the CR and to ensure the lowest energy consumption for copper electrodeposition in the ER. The optimal hydrodynamic conditions were provided at 400 mL/min, leading to the 75% dissolution of metals and to a low specific energy consumption of 1.59 kW h/kg Cu for the electrodeposition process. In most experiments, the copper content of the obtained cathodic deposits was over 99.9%.« less

DOE Office of Scientific and Technical Information (OSTI.GOV)

Swain, Basudev, E-mail: swain@iae.re.kr; Mishra, Chinmayee; Hong, Hyun Seon

Sustainable valorization processes for selective recovery of pure copper nanopowder from Indium-Tin-Oxide (ITO) etching wastewater by various wet chemical reduction processes, their chemistry has been investigated and compared. After the indium recovery by solvent extraction from ITO etching wastewater, the same is also an environmental challenge, needs to be treated before disposal. After the indium recovery, ITO etching wastewater contains 6.11 kg/m{sup 3} of copper and 1.35 kg/m{sup 3} of aluminum, pH of the solution is very low converging to 0 and contain a significant amount of chlorine in the media. In this study, pure copper nanopowder was recovered usingmore » various reducing reagents by wet chemical reduction and characterized. Different reducing agents like a metallic, an inorganic acid and an organic acid were used to understand reduction behavior of copper in the presence of aluminum in a strong chloride medium of the ITO etching wastewater. The effect of a polymer surfactant Polyvinylpyrrolidone (PVP), which was included to prevent aggregation, to provide dispersion stability and control the size of copper nanopowder was investigated and compared. The developed copper nanopowder recovery techniques are techno-economical feasible processes for commercial production of copper nanopowder in the range of 100–500 nm size from the reported facilities through a one-pot synthesis. By all the process reported pure copper nanopowder can be recovered with>99% efficiency. After the copper recovery, copper concentration in the wastewater reduced to acceptable limit recommended by WHO for wastewater disposal. The process is not only beneficial for recycling of copper, but also helps to address environment challenged posed by ITO etching wastewater. From a complex wastewater, synthesis of pure copper nanopowder using various wet chemical reduction route and their comparison is the novelty of this recovery process. - Highlights: • From the Indium-Tin-Oxide etching wastewater, copper nanopowder was synthesized. • Solution chemistry of ITO etching wastewater is addressed. • A techno-economical feasible, environment friendly and occupational safe process. • Brings back the material to production stream and address the circular economy. • A cradle to cradle technology management lowers the futuristic carbon economy.« less

Shape effects of nanoparticles on the squeezed flow between two Riga plates in the presence of thermal radiation

NASA Astrophysics Data System (ADS)

Ahmed, Naveed; Adnan; Khan, Umar; Tauseef Mohyud-Din, Syed; Waheed, Asif

2017-07-01

This paper aims to explore the flow of water saturated with copper nanoparticles of different shapes between parallel Riga plates. The plates are placed horizontally in the coordinate axis. Influence of the linear thermal radiation is also taken into account. The equations governing the flow have been transformed into a nondimensional form by employing a set of similarity transformations. The obtained system is solved analytically (variation-of-parameters method) and numerically (Runge-Kutta scheme). Under certain conditions, a special case of the model is also explored. Furthermore, influences of the physical quantities on velocity and thermal fields are discussed with the graphical aid over the domain of interest. The quantities of engineering and practical interest (skin friction coefficient and local rate of heat transfer) are also explored graphically.

Laser-Launched Flyer Plates and Direct Laser Shocks for Dynamic Material Property Measurements

NASA Astrophysics Data System (ADS)

Paisley, D. L.; Swift, D. C.; Johnson, R. P.; Kopp, R. A.; Kyrala, G. A.

2002-07-01

The Trident laser at Los Alamos was used to impart known and controlled shocks in various materials by launching flyer plates or by irradiating the sample directly. Materials investigated include copper, gold, NiTi, SS316, and other metals and alloys. Tensile spall strength, elastic-plastic transition, phase boundaries, and equation of state can be determined with small samples. Using thin samples (0.1 - 1.0 mm thick) as targets, high pressure gradients can be generated with relatively low pressures, resulting in high tensile strain rates (105 to 108 s-1). Free surface and interface velocities are recorded with point- and line-imaging VISARs. The flexible spatial and temporal pulse profiles of Trident, coupled with the use of laser-launched flyer plates, provides capabilities which complement experiments conducted using gas guns and tensile bars.

Geochemical constraints on adakites of different origins and copper mineralization

USGS Publications Warehouse

Sun, W.-D.; Ling, M.-X.; Chung, S.-L.; Ding, X.; Yang, X.-Y.; Liang, H.-Y.; Fan, W.-M.; Goldfarb, R.; Yin, Q.-Z.

2012-01-01

The petrogenesis of adakites holds important clues to the formation of the continental crust and copper ?? gold porphyry mineralization. However, it remains highly debated as to whether adakites form by slab melting, by partial melting of the lower continental crust, or by fractional crystallization of normal arc magmas. Here, we show that to form adakitic signature, partial melting of a subducting oceanic slab would require high pressure at depths of >50 km, whereas partial melting of the lower continental crust would require the presence of plagioclase and thus shallower depths and additional water. These two types of adakites can be discriminated using geochemical indexes. Compiled data show that adakites from circum-Pacific regions, which have close affinity to subduction of young hot oceanic plate, can be clearly discriminated from adakites from the Dabie Mountains and the Tibetan Plateau, which have been attributed to partial melting of continental crust, in Sr/Y-versus-La/Yb diagram. Given that oceanic crust has copper concentrations about two times higher than those in the continental crust, whereas the high oxygen fugacity in the subduction environment promotes the release of copper during partial melting, slab melting provides the most efficient mechanism to concentrate copper and gold; slab melts would be more than two times greater in copper (and also gold) concentrations than lower continental crust melts and normal arc magmas. Thus, identification of slab melt adakites is important for predicting exploration targets for copper- and gold-porphyry ore deposits. This explains the close association of ridge subduction with large porphyry copper deposits because ridge subduction is the most favorable place for slab melting. ?? 2012 by The University of Chicago.

Flight solar calibrations using the Mirror Attenuator Mosaic (MAM): Low scattering mirror

NASA Technical Reports Server (NTRS)

Lee, Robert B., III

1992-01-01

Measurements of solar radiances reflected from the mirror attenuator mosaic (MAM) were used to calibrate the shortwave portions of the Earth Radiation Budget Experiment (ERBE) thermistor bolometer scanning radiometers. The MAM is basically a low scattering mirror which has been used to attenuate and reflect solar radiation into the fields of view for the broadband shortwave (0.2 to 5 micrometers) and total (0.2 to 50.0+ micrometers) ERBE scanning radiometers. The MAM assembly consists of a tightly packed array of aluminum, 0.3175-cm diameter concave spherical mirrors and field of view limiting baffles. The spherical mirrors are masked by a copper plate, electro-plated with black chrome. Perforations (0.14 centimeter in diameter) in the copper plate serve as apertures for the mirrors. Black anodized aluminum baffles limit the MAM clear field of view to 7.1 degrees. The MAM assemblies are located on the Earth Radiation Budget Satellite (ERBS) and on the National Oceanic and Atmospheric Administration NOAA-9 and NOAA-10 spacecraft. The 1984-1985 ERBS and 1985-1986 NOAA-9 solar calibration datasets are presented. Analyses of the calibrations indicate that the MAM exhibited no detectable degradation in its reflectance properties and that the gains of the shortwave scanners did not change. The stability of the shortwave radiometers indicates that the transmission of the Suprasil W1 filters did not degrade detectably when exposed to Earth/atmosphere-reflected solar radiation.

Effect of decomposition and organic residues on resistivity of copper films fabricated via low-temperature sintering of complex particle mixed dispersions

NASA Astrophysics Data System (ADS)

Yong, Yingqiong; Nguyen, Mai Thanh; Tsukamoto, Hiroki; Matsubara, Masaki; Liao, Ying-Chih; Yonezawa, Tetsu

2017-03-01

Mixtures of a copper complex and copper fine particles as copper-based metal-organic decomposition (MOD) dispersions have been demonstrated to be effective for low-temperature sintering of conductive copper film. However, the copper particle size effect on decomposition process of the dispersion during heating and the effect of organic residues on the resistivity have not been studied. In this study, the decomposition process of dispersions containing mixtures of a copper complex and copper particles with various sizes was studied. The effect of organic residues on the resistivity was also studied using thermogravimetric analysis. In addition, the choice of copper salts in the copper complex was also discussed. In this work, a low-resistivity sintered copper film (7 × 10-6 Ω·m) at a temperature as low as 100 °C was achieved without using any reductive gas.

Copper import in Escherichia coli by the yersiniabactin metallophore system

PubMed Central

Koh, Eun-Ik; Robinson, Anne E.; Bandara, Nilantha; Rogers, Buck E.; Henderson, Jeffrey P.

2017-01-01

Copper plays a dual role as nutrient and toxin during bacterial infections. While uropathogenic Escherichia coli (UPEC) strains can use the copper-binding metallophore yersiniabactin (Ybt) to resist copper toxicity, Ybt also converts bioavailable copper to Cu(II)-Ybt in low copper conditions. Although E. coli have long been considered to lack a copper import pathway, we observed Ybt-mediated copper import in UPEC using canonical Fe(III)-Ybt transport proteins. UPEC removed copper from Cu(II)-Ybt with subsequent re-export of metal-free Ybt to the extracellular space. Copper released through this process became available to an E. coli cuproenzyme (the amine oxidase TynA), linking this import pathway to a nutrient acquisition function. Ybt-expressing E. coli thus engage in nutritional passivation, a strategy of minimizing a metal ion's toxicity while preserving its nutritional availability. Copper acquisition through this process may contribute to the marked virulence defect of Ybt transport-deficient UPEC. PMID:28759019

ELECTROLYSIS AND ION EXCHANGE FOR THE IN PROCESS RECYCLING OF COPPER FROM SEMI-CONDUCTOR PROCESSING SOLUTIONS

EPA Science Inventory

The objectives of the study are to develop an understanding of the electrodeposition of copper onto extended-area electrodes, and of the adsorption/desorption of copper onto ion exchange resins with a high affinity for copper. The principles elucidated in this work will pave the ...

Direct patterning of highly-conductive graphene@copper composites using copper naphthenate as a resist for graphene device applications.

PubMed

Bi, Kaixi; Xiang, Quan; Chen, Yiqin; Shi, Huimin; Li, Zhiqin; Lin, Jun; Zhang, Yongzhe; Wan, Qiang; Zhang, Guanhua; Qin, Shiqiao; Zhang, Xueao; Duan, Huigao

2017-11-09

We report an electron-beam lithography process to directly fabricate graphene@copper composite patterns without involving metal deposition, lift-off and etching processes using copper naphthenate as a high-resolution negative-tone resist. As a commonly used industrial painting product, copper naphthenate is extremely cheap with a long shelf time but demonstrates an unexpected patterning resolution better than 10 nm. With appropriate annealing under a hydrogen atmosphere, the produced graphene@copper composite patterns show high conductivity of ∼400 S cm -1 . X-ray diffraction, conformal Raman spectroscopy and X-ray photoelectron spectroscopy were used to analyze the chemical composition of the final patterns. With the properties of high resolution and high conductivity, the patterned graphene@copper composites could be used as conductive pads and interconnects for graphene electronic devices with ohmic contacts. Compared to common fabrication processes involving metal evaporation and lift-off steps, this pattern-transfer-free fabrication process using copper naphthenate resist is direct and simple but allows comparable device performance in practical device applications.

Direct Machining of Low-Loss THz Waveguide Components With an RF Choke.

PubMed

Lewis, Samantha M; Nanni, Emilio A; Temkin, Richard J

2014-12-01

We present results for the successful fabrication of low-loss THz metallic waveguide components using direct machining with a CNC end mill. The approach uses a split-block machining process with the addition of an RF choke running parallel to the waveguide. The choke greatly reduces coupling to the parasitic mode of the parallel-plate waveguide produced by the split-block. This method has demonstrated loss as low as 0.2 dB/cm at 280 GHz for a copper WR-3 waveguide. It has also been used in the fabrication of 3 and 10 dB directional couplers in brass, demonstrating excellent agreement with design simulations from 240-260 GHz. The method may be adapted to structures with features on the order of 200 μm.

Preparation of Trivalent Chromium and Rare Earth Composite Conversion Coating on Aluminum Alloy Surface

NASA Astrophysics Data System (ADS)

Huang, Jianzhen

2018-01-01

In this paper, the surface conversion film on 6063 aluminum alloy was prepared by chemical plating process with chromium sulfate, lanthanum sulfate and sodium phosphate as film forming agent. The corrosion resistance and surface morphology of the conversion film were analyzed by pitting corrosion test of copper sulfate and SEM. The results show that when Cr2(SO4)3 is 10 g/L, La2(SO4)3 is 2 g/L, Na3PO4 is 8 g/L, pH value is 3, temperature is 40 °C, reaction time is 10 min, the corrosion resistance of the surface conversion film is the best. The conversion coating is light green, composed of Cr, La, P, Al, O and other elements.

The Use of Tribocharging in the Electrostatic Beneficiation of Lunar Simulant

NASA Technical Reports Server (NTRS)

Trigwell, S.; Captain, J. G.; Arens, E. E.; Captain, J. E.; Quinn, J. W.; Calle, C. I.

2007-01-01

Any future lunar base and habitat must be constructed from strong dense materials in order to provide for thermal and radiation protection. Lunar soil may meet this need. Lunar regolith has high concentrations of aluminum, silicon, calcium, iron, sodium, and titanium oxides. Refinement or enrichment of specific minerals in the soil before it is chemically processed may be more desirable as it would reduce the size and energy requirements required to produce the virgin material and it may significantly reduce the process' complexity. Also, investigations into the potential production of breathable oxygen from oxidized mineral components are a major research initiative by NASA. In this study. the objective was to investigate the use of tribocharging to charge lunar simulants and pass them through a parallel plate separator to enrich different mineral fractions. This technique takes advantage of the high Lunar vacuum in which much higher voltages can be used on the separation plates than in air. Additionally, the Lunar g1avity, only being 1/6 that of Earth, allows the particles more separation time between the plates and therefore enhances separation. For the separation studies, two lunar stimulants were used. The first simulant was created in-house, labeled KSC-1. using commercially supplied (sieved to 325 mesh) materials, and was composed of 40 wt. % feldspar ((Na,K,Ca)AlSi3O8;SiO2), 40 wt. % olivine ((Mg,Fe)2SiO4), 10 wt. % ilmenite (FeTiO3). and 10 wt. % spodumene (LiAlSi2O6) (pyroxene). The advantage of the in-house mixture is that the composition can he varied to simulate different soil compositions from different areas on the moon. This simulant was used to show proof-of-concept using the designed separator in air. The second stimulant was JSC-1. used for the vacuum experiments. JSC-1 is principally basalts, containing phases of plagioclase. pyroxene. olivine, and ilmenite. The JSC-1 was sieved to provide a 50-75 micron size range to correlate with the mean grain size found on the moon's surface [1]. Four different materials were investigated for the triboelectrification process; aluminum, copper. stainless steel, and PTFE. These materials were selected because they offer a wide variation in work functions (aluminum 4.28 eV, copper 4.65 eV. stainless steel 5.04 eV, and PTFE 5.75 eV). The difference between the work function of each material and the simulant influences the charge obtained by the grains. Each simulant was analyzed before and after separation using X-ray Photoelectron Spectroscopy (XPS) to determine mineral surface composition. In addition. Raman spectroscopy was performed on the JSC-1 before and after separation in vacuum to determine the mineral composition. Charge-to-mass (Q/M) measurements were performed using a fluidizing bed in air and passing the simulant through a static mixer of a particular material and collecting it in a Faraday pail grounded through an electrometer. To measure the Q/M in vacuum, a special device was constructed consisting of a heater/shaker cup that fed into a solid block of material (either PTFE, copper, or aluminum) in which a channel composed of a "zig-zag" series of inclines greater than 50 degrees has been cut. The voltage to the vibrating motor can be varied to control the amount of simulant passing through the channel. Figure I shows the Q/M measurements for JSC-1 tribocharged using the static mixers and the incline plane chargers in air, and the incline plane chargers in vacuum.

Process Of Bonding Copper And Tungsten

DOEpatents

Slattery, Kevin T.; Driemeyer, Daniel E.; Davis, John W.

2000-07-18

Process for bonding a copper substrate to a tungsten substrate by providing a thin metallic adhesion promoting film bonded to a tungsten substrate and a functionally graded material (FGM) interlayer bonding the thin metallic adhesion promoting film to the copper substrate. The FGM interlayer is formed by sintering a stack of individual copper and tungsten powder blend layers having progressively higher copper content/tungsten content, by volume, ratio values in successive powder blend layers in a lineal direction extending from the tungsten substrate towards the copper substrate. The resulting copper to tungsten joint well accommodates the difference in the coefficient of thermal expansion of the materials.

Effects of Volar Tilt, Wrist Extension, and Plate Position on Contact Between Flexor Pollicis Longus Tendon and Volar Plate.

PubMed

Wurtzel, Caroline N Wolfe; Burns, Geoffrey T; Zhu, Andy F; Ozer, Kagan

2017-12-01

Volar plates positioned at, or distal to, the watershed line have been shown to have a higher incidence of attritional rupture of the flexor pollicis longus (FPL). In this study, we aimed to evaluate the effect of wrist extension and volar tilt on the contact between the plate and the FPL tendon in a cadaver model. We hypothesized that, following volar plate application, loss of native volar tilt increases the contact between the FPL and the plate at lower degrees of wrist extension. A volar locking plate was applied on 6 fresh-frozen cadavers. To determine the contact between the plate and the FPL tendon, both structures were wrapped with copper wire and circuit conductivity was monitored throughout wrist motion. A lateral wrist radiograph was obtained at each circuit closure, indicating tendon-plate contact. Baseline measurements were obtained with plate positioned at Soong grades 0, 1, and 2. An extra-articular osteotomy was made and contact was recorded at various volar tilt angles (+5°, 0°, -5°, -10°, -15°, and -20°) in 3 different plate positions. A blinded observer measured the degree of wrist extension on all lateral radiographs. Data were analyzed using linear mixed-effects regression model. Plates placed distal to the watershed line had the most contact throughout wrist range of motion. Significantly, less wrist extension was required for contact in wrists with neutral or dorsal tilt and in distally placed volar plates. Volar tilt, wrist extension, and plate position were 3 independent risk factors determining contact between plate and tendon. Loss of volar tilt, increased wrist extension, and higher Soong grade plate position result in greater contact between wire-wrapped FPL tendon and plate. The FPL/plate contact chart generated in this study may be used to assess the risk of rupture in the clinical setting. Copyright © 2017 American Society for Surgery of the Hand. Published by Elsevier Inc. All rights reserved.

Droplet impact on regular micro-grooved surfaces

NASA Astrophysics Data System (ADS)

Hu, Hai-Bao; Huang, Su-He; Chen, Li-Bin

2013-08-01

We have investigated experimentally the process of a droplet impact on a regular micro-grooved surface. The target surfaces are patterned such that micro-scale spokes radiate from the center, concentric circles, and parallel lines on the polishing copper plate, using Quasi-LIGA molding technology. The dynamic behavior of water droplets impacting on these structured surfaces is examined using a high-speed camera, including the drop impact processes, the maximum spreading diameters, and the lengths and numbers of fingers at different values of Weber number. Experimental results validate that the spreading processes are arrested on all target surfaces at low velocity. Also, the experimental results at higher impact velocity demonstrate that the spreading process is conducted on the surface parallel to the micro-grooves, but is arrested in the direction perpendicular to the micro-grooves. Besides, the lengths of fingers increase observably, even when they are ejected out as tiny droplets along the groove direction, at the same time the drop recoil velocity is reduced by micro-grooves which are parallel to the spreading direction, but not by micro-grooves which are vertical to the spreading direction.

Process for preparing superconducting film having substantially uniform phase development

DOEpatents

Bharacharya, Raghuthan; Parilla, Philip A.; Blaugher, Richard D.

1995-01-01

A process for preparing a superconducting film, such as a thallium-barium-calcium-copper oxide superconducting film, having substantially uniform phase development. The process comprises providing an electrodeposition bath having one or more soluble salts of one or more respective potentially superconducting metals in respective amounts adequate to yield a superconducting film upon subsequent appropriate treatment. Should all of the metals required for producing a superconducting film not be made available in the bath, such metals can be a part of the ambient during a subsequent annealing process. A soluble silver salt in an amount between about 0.1% and about 4.0% by weight of the provided other salts is also provided to the bath, and the bath is electrically energized to thereby form a plated film. The film is annealed in ambient conditions suitable to cause formation of a superconductor film. Doping with silver reduces the temperature at which the liquid phase appears during the annealing step, initiates a liquid phase throughout the entire volume of deposited material, and influences the nucleation and growth of the deposited material.

Process for preparing superconducting film having substantially uniform phase development

DOEpatents

Bharacharya, R.; Parilla, P.A.; Blaugher, R.D.

1995-12-19

A process is disclosed for preparing a superconducting film, such as a thallium-barium-calcium-copper oxide superconducting film, having substantially uniform phase development. The process comprises providing an electrodeposition bath having one or more soluble salts of one or more respective potentially superconducting metals in respective amounts adequate to yield a superconducting film upon subsequent appropriate treatment. Should all of the metals required for producing a superconducting film not be made available in the bath, such metals can be a part of the ambient during a subsequent annealing process. A soluble silver salt in an amount between about 0.1% and about 4.0% by weight of the provided other salts is also provided to the bath, and the bath is electrically energized to thereby form a plated film. The film is annealed in ambient conditions suitable to cause formation of a superconductor film. Doping with silver reduces the temperature at which the liquid phase appears during the annealing step, initiates a liquid phase throughout the entire volume of deposited material, and influences the nucleation and growth of the deposited material. 3 figs.

New Literacy's Cut and Paste and How Educators Can Assist Creativity

ERIC Educational Resources Information Center

Hall, Stephen J.

2010-01-01

There is little point in teachers and writers arguing for the good old days of copper plate writing and the perceived decay of the English language through on-line modes. We have little choice but to embrace change, Facebook reality and consider the role of new media, so as to avoid being caught in a widening digital awareness gap. Language…

A spaceworthy ADR - Recent developments. [Adiabatic Demagnetization Refrigerator for X ray spectrometer

NASA Technical Reports Server (NTRS)

Serlemitsos, Aristides T.; Warner, Brent A.; Sansebastian, Marcelino; Kunes, Evan

1990-01-01

Recent developments concerning the performance and reliability of a spaceworthy adiabatic demagnetization refrigerator (ADR) for the AXAF X-ray spectrometer are considered. They include a procedure for growing the salt pill around a harness made up of 6080 gold-plated copper wires, a totally modular gas gap heat switch, and a suspension system utilizing Kevlar fibers.

High Pressure Particulate Physics Facility

DTIC Science & Technology

2011-03-26

controlled loading conditions, nanosecond time resolution diagnostics are required. Therefore, state of the art diagnostic tools such as Velocity...front end plate. The Data Acquisition System (DAS) is based on the state of the art National Instruments PXI system. The architecture provides...obtained by copper wire. In the future x-ray cinematography , line VISAR and time indexed spectroscopy are planned. SECTION III SUMMARY We are

Nick Sagan Reflects on Voyager 1 and the Golden Record

NASA Astrophysics Data System (ADS)

Showstack, Randy

2013-10-01

When scientists confirmed on 12 September that NASA's Voyager 1 spacecraft had entered interstellar space (Eos, 94(39), 339, doi:10.1002/2013EO390003), the probe was acknowledged as the first human-made object to travel into that realm. The probe and its twin, Voyager 2, each carry a 12-inch gold-plated copper disk, known as the Golden Record.

A Microsample Tensile Test Application: Local Strength of Impact Welds Between Sheet Metals

NASA Astrophysics Data System (ADS)

Benzing, J. T.; He, M.; Vivek, A.; Taber, G. A.; Mills, M. J.; Daehn, G. S.

2017-03-01

Microsample tensile testing was conducted to evaluate the quality of impact welds created by vaporizing foil actuator welding. Tensile test samples with a gauge length of 0.6 mm were electro-discharge machined out of welds created between 1-mm-thick aluminum alloy type 6061 (AA6061) sheets and 6-mm-thick copper (Cu110) plates. Aluminum sheets were used as flyers, while copper plates acted as targets. Flyer sheets in T6 as well as T4 temper conditions were utilized to create welds. Some of the welds made with T4 temper flyers were heat treated to a T6 temper. It was found that the welds made with T4 temper flyers were slightly stronger (max. of 270 MPa) than those produced with T6 temper flyers. Generally, failure propagated in a brittle manner across the weld interface; however, elemental mapping reveals material transfer on either member of the welded system. This work proves the feasibility to apply microsample tensile testing to assess impact welding, even when conducted with flyer sheets of 1 mm or less, and provides insight that is complementary to other test methods.

Dielectric characterization of hot-mix asphalt at the smart road using GPR

NASA Astrophysics Data System (ADS)

Al-Qadi, Imad L.; Loulizi, A.; Lahouar, S.

2000-04-01

To better interpret collected ground penetrating radar (GPR) data, a project is currently underway at the Virginia Smart Road. Twelve different flexible pavement sections and a continuously reinforced concrete rigid pavement section are incorporated in the road design. Thirty-five copper plates were placed at different layer interfaces throughout the pavement sections. The copper plates serve as a reflecting material and thus allow the determination of layers' dielectric constant over the GPR frequency range. An initial development of a method to calculate the complex dielectric constant of hot-mix asphalt over the frequency range of 750 to 1750 MHz using an air-coupled GPR system is presented. Utilizing GPR data, this method will be used to predict changes of the dielectric properties of the different SuperPaveTM mixes used at the Smart Road over time. The method is based on equating the overall reflection coefficient as obtained from the radar measurements with the calculated reflection coefficient using electromagnetic theory. The measured overall reflection coefficient is obtained by dividing the reflected frequency spectrum over the incident one. The theoretical overall reflection coefficient is obtained using the multiple reflection model. A Gauss-Newton method is then used to solve for the complex dielectric constant.

The effect of target materials on the propagation of atmospheric-pressure plasma jets

NASA Astrophysics Data System (ADS)

Ji, Longfei; Yan, Wen; Xia, Yang; Liu, Dongping

2018-05-01

The current study is focused on the effect of target materials (quartz plate, copper sheet, and quartz plate with a grounded copper sheet on the back) on the propagation of atmospheric-pressure helium plasma jets. The dynamics of ionization waves (IWs) and the relative amount of reactive oxygen species (OH and O) in the IW front were compared by using spatial and temporal images and relative optical emission spectroscopy. Our measurements show that the targets can significantly affect the propagation and intensity of the IWs. In addition, strong OH emission lines were detected when the IWs impinged upon the damp surface. Numerical simulations have been carried out to explain the experimental observation. The propagation velocity of IWs predicted by the simulation was in good agreement with the experimental results. Simulation results suggest that the density and velocity of IWs mainly depend on the electric field between the high voltage electrode tip and the target. Analysis indicates that the targets could change the electric field distribution between the high voltage electrode and targets and thus affect the dynamics and the density of the IWs, the generation of reactive oxygen species, and the corresponding sterilization efficiency.

Determination analaysis of the power losses of transformers with continuously transpored conductors (CTC) based fuzzy logic

NASA Astrophysics Data System (ADS)

Kaloko, Bambang Sri; Atsari, Erinna Dyah

2017-03-01

Electric motive force which flows into the iron core continuously on a plate - plate iron isolated may cause heat posed by current eddy (eddy current). No water loss occurs due to detainees on the circuit at the the flow of current load because this loss happened on the entanglement of the transformer is made of copper. Continuously Transposed Conductors (CTC) consist of a number of enameled rectangular wires (5-84 strands) made into an assembly. Each strand is transposed in turn to each position in the cable and is then covered with layers of insulation paper. Continuously Transposed Conductors are used in winding wires for medium and ultra high power transformers. CTC is manufactured by OFHC copper and indeed, is able to supply polyester roped. CTC which has been designed to reduce production cost, oil pocket and improve cooling efficiency. Hardened type CTC (CPR1, CPR2, and CPR3: BS1432) and Self-bonding CTC which can be used to improve mechanical and electrical strength are also available. This analysis is performed using the methods of fuzzy logic in taking account of the resources.

Complex electronic waste treatment - An effective process to selectively recover copper with solutions containing different ammonium salts.

PubMed

Sun, Z H I; Xiao, Y; Sietsma, J; Agterhuis, H; Yang, Y

2016-11-01

Recovery of valuable metals from electronic waste has been highlighted by the EU directives. The difficulties for recycling are induced by the high complexity of such waste. In this research, copper could be selectively recovered using an ammonia-based process, from industrially processed information and communication technology (ICT) waste with high complexity. A detailed understanding on the role of ammonium salt was focused during both stages of leaching copper into a solution and the subsequent step for copper recovery from the solution. By comparing the reactivity of the leaching solution with different ammonium salts, their physiochemical behaviour as well as the leaching efficiency could be identified. The copper recovery rate could reach 95% with ammonium carbonate as the leaching salt. In the stage of copper recovery from the solution, electrodeposition was introduced without an additional solvent extraction step and the electrochemical behaviour of the solution was figured out. With a careful control of the electrodeposition conditions, the current efficiency could be improved to be 80-90% depending on the ammonia salts and high purity copper (99.9wt.%). This research provides basis for improving the recyclability and efficiency of copper recovery from such electronic waste and the whole process design for copper recycling. Copyright © 2016 Elsevier Ltd. All rights reserved.

The Copper Sulfide Coating on Polyacrylonitrile with Chelating Agents by an Electroless Deposition Method and its EMI Shielding Effectiveness

DOE Office of Scientific and Technical Information (OSTI.GOV)

Roan, M.-L.; Chen, Y.-H.; Huang, C.-Y.

2008-08-28

In this study, a variety of concentrations of chelating agents were added to obtain the anchoring effect and chelating effect in the electroless plating bath. The mechanism of the Cu{sub x(x=1,2)}S growth and the electromagnetic interference shielding effectiveness (EMI SE) of the composite were studied. It was found that the vinyl acetate residued in PAN substrate would be purged due to the swelling effect by chelating agents solution. And then, the anchoring effect occurred due to the hydrogen bonding between the pits of PAN substrate and the chelating agent. Consequently, the copper sulfide layer deposited by the electroless plating reactionmore » with EDTA and TEA. The swelling degree (S{sub d}) was proposed and evaluated from the FT-IR spectra. The relationship between swelling degree of the PAN films and EDTA (C) is expressed as: S{sub d} = 0.13+0.90xe and (-15.15C). And TEA series is expressed as: S{sub d} = 0.07+1.00xe and (-15.15C). On the other hand, the FESEM micrograph showed that the average thickness of copper sulfide increased from 76 nm to 383 nm when the concentration of EDTA increased from 0.00M to 0.20M. Consequently, the EMI SE of the composites increased from 10{approx}12 dB to 25{approx}27 dB. The GIA-XRD analyze indicated that the deposited layer consisted of CuS and Cu{sub 2}S.« less

Generation of ramp waves using variable areal density flyers

NASA Astrophysics Data System (ADS)

Winter, R. E.; Cotton, M.; Harris, E. J.; Chapman, D. J.; Eakins, D.

2016-07-01

Ramp loading using graded density impactors as flyers in gas-gun-driven plate impact experiments can yield new and useful information about the equation of state and the strength properties of the loaded material. Selective Laser Melting, an additive manufacturing technique, was used to manufacture a graded density flyer, termed the "bed-of-nails" (BON). A 2.5-mm-thick × 99.4-mm-diameter solid disc of stainless steel formed a base for an array of tapered spikes of length 5.5 mm and spaced 1 mm apart. The two experiments to test the concept were performed at impact velocities of 900 and 1100 m/s using the 100-mm gas gun at the Institute of Shock Physics at Imperial College London. In each experiment, a BON flyer was impacted onto a copper buffer plate which helped to smooth out perturbations in the wave profile. The ramp delivered to the copper buffer was in turn transmitted to three tantalum targets of thicknesses 3, 5 and 7 mm, which were mounted in contact with the back face of the copper. Heterodyne velocimetry (Het-V) was used to measure the velocity-time history, at the back faces of the tantalum discs. The wave profiles display a smooth increase in velocity over a period of ˜ 2.5 μs, with no indication of a shock jump. The measured profiles have been analysed to generate a stress vs. volume curve for tantalum. The results have been compared with the predictions of the Sandia National Laboratories hydrocode, CTH.

Material flows generated by pyromet copper smelting

USGS Publications Warehouse

Goonan, T.G.

2005-01-01

Copper production through smelting generates large volumes of material flows. As copper contained in ore becomes copper contained in concentrate to be fed into the smelting process, it leaves behind an altered landscape, sometimes mine waste, and always mill tailings. Copper concentrate, fluxing materials, fuels, oxygen, recyclables, scrap and water are inputs to the process. Dust (recycled), gases - containing carbon dioxide (CO2) (dissipated) and sulfur dioxide (SO2) (mostly collected, transformed and sold) and slag (discarded or sold) - are among the significant process outputs. This article reports estimates of the flows of these input/output materials for a particular set of smelters studied in some countries.

Precursors for formation of copper selenide, indium selenide, copper indium diselenide, and/or copper indium gallium diselenide films

DOEpatents

Curtis, Calvin J; Miedaner, Alexander; Van Hest, Maikel; Ginley, David S

2014-11-04

Liquid-based precursors for formation of Copper Selenide, Indium Selenide, Copper Indium Diselenide, and/or copper Indium Galium Diselenide include copper-organoselenides, particulate copper selenide suspensions, copper selenide ethylene diamine in liquid solvent, nanoparticulate indium selenide suspensions, and indium selenide ethylene diamine coordination compounds in solvent. These liquid-based precursors can be deposited in liquid form onto substrates and treated by rapid thermal processing to form crystalline copper selenide and indium selenide films.

Investigation the electroplating behavior of self formed CuMn barrier.

PubMed

Wu, Chia-Yang; Lee, Wen-Hsi; Chang, Shih-Chieh; Wang, Ying-Lang

2013-08-01

The electrical and material properties of Copper (Cu) mixed with [0-10 atomic% manganese (Mn)] and pure Cu films deposited on silicon oxide (SiO2)/silicon (Si) are explored. Cu electroplating on self formed CuMn barrier was investigated with different Mn content. The electrochemical deposition of the Cu thin film onto the electrode using CuMn barrier was investigated. Scanning electron microscopic (SEM) micrographs of copper electroplating on CuMn films were examined, and the copper nucleation behaviors changed with the Mn content. Since the electrochemical impedance spectroscopy (EIS) is widely recognized as a powerful tool for the investigation of electrochemical behaviors, the tool was also used to verify the phenomena during plating. It was found that the charge-trasfer impedance decrease with the rise in the Mn content below 5%, but increase with the rise in the Mn content higher than 5%. The result was corresponded to the surface energy, the surface morphology, the corrosion and the oxidation of the substrate.

A Novel Fabrication Method of Bi₂Te₃-Based Thermoelectric Modules by Indium Electroplating and Thermocompression Bonding.

PubMed

Yoon, Jongchan; Bae, Sung Hwa; Sohn, Ho-Sang; Son, Injoon; Kim, Kyung Tae; Ju, Young-Wan

2018-09-01

In this study, we devised a method to bond thermoelectric elements directly to copper electrodes by plating indium with a relatively low melting point. A coating of indium, ~30 μm in thickness, was fabricated by electroplating the surface of a Bi2Te3-based thermoelectric element with a nickel diffusion barrier layer. They were then subjected to direct thermocompression bonding at 453 K on a hotplate for 10 min at a pressure of 1.1 kPa. Scanning electron microscopy images confirmed that a uniform bond was formed at the copper electrode/thermoelectric element interface, and the melted/solidified indium layer was defect free. Thus, the proposed novel method of fabricating a thermoelectric module by electroplating indium on the surface of the thermoelectric element and directly bonding with the copper electrode can be used to obtain a uniformly bonded interface even at a relatively low temperature without the use of solder pastes.

Cyanide and Copper Recovery from Barren Solution of the Merrill Crowe Process

NASA Astrophysics Data System (ADS)

Parga, José R.; Valenzuela, Jesús L.; Díaz, J. A.

This paper is a brief overview of the role of inducing the nucleated precipitation of copper and cyanide in a flashtube serpentine reactor, using sodium sulfide as the precipitate and sulfuric acid as pH control. The results showed that pH had a great effect on copper cyanide removal efficiency and the optimum pH was about 3 to 3.5. At this pH value copper cyanide removal efficiency could be achieved above 97 and 99 %, when influent copper concentration ions were 650 and 900 ppm respectively. In this process the cyanide associated with the copper, zinc, iron cyanide complexes are released as HCN gas under strong acidic conditions, allowing it to be recycled back to the cyanidation process as free cyanide.

The Evolution of Plate and Extruded Products with High Strength and Fracture Toughness

NASA Astrophysics Data System (ADS)

Denzer, D. K.; Rioja, R. J.; Bray, G. H.; Venema, G. B.; Colvin, E. L.

From the first use of 2017-T74 on the Junkers F13, improvements have been made to plate and extruded products for applications requiring the highest attainable strength and adequate fracture toughness. One such application is the upper wing of large aircraft. The progression of these product improvements achieved through the development of alloys that include 7075-(T6 & T76), 7150-(T6 & T77) and 7055-(T77 & T79) and most recently 7255-(T77 & T79) is reviewed. The most current advancements include aluminum-copper-lithium, alloy 2055 plate and extruded products that can attain strength equivalent to that of 7055-T77 with higher modulus, similar fracture toughness and improved fatigue, fatigue crack growth and corrosion performance. The achievement of these properties is explained in terms of the several alloy design principles. The highly desired and balanced characteristics make these products ideal for upper wing applications.

Plate impact experiments on the TATB based explosive PBX 9502 at pressures near the Chapman-Jouguet state

NASA Astrophysics Data System (ADS)

Gustavsen, R. L.; Aslam, T. D.; Bartram, B. D.; Hollowell, B. C.

2014-05-01

A series of two-stage gus-gun driven plate impact experiments on PBX 9502 (95 wt.% tri-amino-trinitro-benzene, 5 wt.% Kel-F800 plastic binder) was completed in the 28-34 GPa pressure range. This is just above the Chapman-Jouguet state of ≈ 28 GPa. The experiments consisted of a thick oxygen free high conductivity copper (OFHC Cu) flyer plate impacting a PBX 9502 sample backed by a Lithium Fluoride (LiF) window. Photonic Doppler Velocimetry (PDV) was used to measure velocity histories (wave profiles) at the PBX 9502/LiF interface. Shock transit times and sample thicknesses were converted to shock velocities, Us. Particle velocities, up, were calculated by way of impedance matching. Lastly, the measured wave profiles were compared with numerical simulations of the experiments using the Wescott-Stewart-Davis reactive-burn model.

Preparation and characterization of Ni-P/Ni3.1B composite alloy coatings

NASA Astrophysics Data System (ADS)

Wang, Yurong; He, Jiawei; Wang, Wenchang; Shi, Jianhua; Mitsuzaki, Naotoshi; Chen, Zhidong

2014-02-01

The preparation of Ni-P/Ni3.1B composite alloy coating on the surface of copper was achieved by co-deposition of Ni3.1B nanoparticles with Ni-P coating during electroless plating. Ni-P-B alloy coating was obtained by heat-treating the as-plated Ni-P/Ni3.1B composite coating. The effect of the concentration of sodium alginate, borax, thiourea, Ni3.1B, temperature, and pH value on the deposition rate and B content were investigated and determined to be: 30 g L-1, 10 g L-1, 2 mg L-1, 20 mg L-1, 70 °C and 9.0 , respectively. Sodium alginate and thiourea were played as surfactant for coating Ni3.1B nanoparticles and stabilizer for the plating bath, respectively. Ni-P/Ni3.1B composite coating had good performance such as corrosion resistance and solderability.

Process Of Bonding Copper And Tungsten

DOEpatents

Slattery, Kevin T.; Driemeyer, Daniel E.

1999-11-23

Process for bonding a copper substrate to a tungsten substrate by providing a thin metallic adhesion promoting film bonded to a tungsten substrate and a functionally graded material (FGM) interlayer bonding the thin metallic adhesion promoting film to the copper substrate. The FGM interlayer is formed by thermal plasma spraying mixtures of copper powder and tungsten powder in a varied blending ratio such that the blending ratio of the copper powder and the tungsten powder that is fed to a plasma torch is intermittently adjusted to provide progressively higher copper content/tungsten content, by volume, ratio values in the interlayer in a lineal direction extending from the tungsten substrate towards the copper substrate. The resulting copper to tungsten joint well accommodates the difference in the coefficient of thermal expansion of the materials.

Mineralogical Characterization of Copper Slag from Tongling Nonferrous Metals Group China

NASA Astrophysics Data System (ADS)

Chun, Tiejun; Ning, Chao; Long, Hongming; Li, Jiaxin; Yang, Jialong

2016-09-01

In this paper, the mineralogical characterization of typical copper slag supplied by the Tongling Nonferrous Metals Group China was performed based on x-ray fluorescence, x-ray diffraction, and scanning electron microscopy with energy dispersive spectroscopy. The results show that the dominant phases of the slag are fayalite, glassy substance and magnetite. The minor accessory phases consist of copper matte, metallic copper and other complex lead and zinc minerals. The contents of iron, copper, lead and zinc in copper slag are 40.21%, 0.79%, 0.24%, and 2.80%, respectively. The mineralogy of copper slag indicates that these valuable elements are difficult to recover by beneficiation processes due to the complicated occurrences. Instead, the pyro-metallurgical processes appear promising in recovering the valuable metals from copper slag.

Selective leaching process for the recovery of copper and zinc oxide from copper-containing dust.

PubMed

Wu, Jun-Yi; Chang, Fang-Chih; Wang, H Paul; Tsai, Ming-Jer; Ko, Chun-Han; Chen, Chih-Cheng

2015-01-01

The purpose of this study was to develop a resource recovery procedure for recovering copper and zinc from dust produced by copper smelting furnaces during the manufacturing of copper-alloy wires. The concentrations of copper in copper-containing dust do not meet the regulation standards defined by the Taiwan Environmental Protection Administration; therefore, such waste is classified as hazardous. In this study, the percentages of zinc and copper in the dust samples were approximately 38.4% and 2.6%, respectively. To reduce environmental damage and recover metal resources for industrial reuse, acid leaching was used to recover metals from these inorganic wastes. In the first stage, 2 N of sulphuric acid was used to leach the dust, with pH values controlled at 2.0-3.0, and a solid-to-liquid ratio of 1:10. The results indicated that zinc extraction efficiency was higher than 95%. A selective acid leaching process was then used to recover the copper content of the residue after filtration. In the second stage, an additional 1 N of sulphuric acid was added to the suspension in the selective leaching process, and the pH value was controlled at 1.5-2.0. The reagent sodium hydroxide (2 N) was used as leachate at a pH greater than 7. A zinc hydroxide compound formed during the process and was recovered after drying. The yields for zinc and copper were 86.9-93.5% and 97.0-98.9%, respectively.

Antibacterial, antibiofilm and antioxidant screening of copper(II)-complexes with some S-alkyl derivatives of thiosalicylic acid. Crystal structure of the binuclear copper(II)-complex with S-propyl derivative of thiosalicylic acid

NASA Astrophysics Data System (ADS)

Bukonjić, Andriana M.; Tomović, Dušan Lj.; Nikolić, Miloš V.; Mijajlović, Marina Ž.; Jevtić, Verica V.; Ratković, Zoran R.; Novaković, Slađana B.; Bogdanović, Goran A.; Radojević, Ivana D.; Maksimović, Jovana Z.; Vasić, Sava M.; Čomić, Ljiljana R.; Trifunović, Srećko R.; Radić, Gordana P.

2017-01-01

The spectroscopically predicted structure of the obtained copper(II)-complex with S-propyl derivative of thiosalicylic acid was confirmed by X-ray structural study. The binuclear copper(II)-complex with S-propyl derivative of thiosalicylic acid crystallized in two polymorphic forms with main structural difference in the orientation of phenyl rings relative to corresponding carboxylate groups. The antibacterial activity was tested determining the minimum inhibitory concentration (MIC) and the minimum bactericidal concentration (MBC) by using microdilution method. The influence on bacterial biofilm formation was determined by tissue culture plate method. In general, the copper(II)-complexes manifested a selective and moderate activity. The most sensitive bacteria to the effects of Cu(II)-complexes was a clinical isolate of Pseudomonas aeruginosa. For this bacteria MIC and biofilm inhibitory concentration (BIC) values for all tested complexes were in the range or better than the positive control, doxycycline. Also, for the established biofilm of clinical isolate Staphylococcus aureus, BIC values for the copper(II)-complex with S-ethyl derivative of thiosalicylic acid,[Cu2(S-et-thiosal)4(H2O)2] (C3) and copper(II)-complex with S-butyl derivative of thiosalicylic acid, [Cu2(S-bu-thiosal)4(H2O)2] (C5) were in range or better than the positive control. All the complexes acted better against Gram-positive bacteria (Staphylococcus aureus and Staphylococcus aureus ATCC 25923) than Gram-negative bacteria (Proteus mirabilis ATCC 12453, Pseudomonas aeruginosa, and P. aeruginosa ATCC 27855). The complexes showed weak antioxidative properties tested by two methods (1,1-diphenyl-2-picrylhydrazyl (DPPH) and reducing power assay).

Design a sensitive optical thin film sensor based on incorporation of isonicotinohydrazide derivative in sol-gel matrix for determination of trace amounts of copper (II) in fruit juice: Effect of sonication time on immobilization approach.

PubMed

Shahamirifard, Seyed Alireza; Ghaedi, Mehrorang; Montazerozohori, Morteza

2018-04-01

A new selective and sensitive optical sensor based on the incorporation of new synthesized N'-(2-hydroxy-5-iodobenzylidene) isonicotinohydrazide (HIBIN) as an effective reagent into the nanoporous of a transparent glass like material through the sol-gel process was developed which was suitable for the determination of copper (II) ions in aqueous solutions. The thin film sensors were constructed by spin-coating of prepared sol onto glass plate and their surface morphology were studied by field emission scanning electron microscopy (FE-SEM) and atomic force microscope (AFM) technique. Influence of sonication time on immobilization of HIBIN into silica matrix was investigated through calculation of leaching percentage. The Results shown that sonication time of 35 min is suitable to give more stable thin films without fluctuation in sensitivity and response time of presented sensor for a long period of time. The proposed optical sensor can be used for determination of copper (II) ions in the range of 9.1 × 10 -8 -1.12 × 10 -5  mol L -1 with a detection limit of 1.8 × 10 -8  mol L -1 . It also showed relative standard deviation 3.4 and 0.72% for reproducibility and repeatability respectively, along with a fast response time about of 2 min. The constructed optode is stable in wet conditions and could be stored for at least 6 weeks without observing any change in its sensitivity. The developed sensor was successfully applied to the determination of copper (II) in fruit juice and water samples which results were confirmed by atomic absorption spectrometry method. Copyright © 2017 Elsevier B.V. All rights reserved.

Removal of copper from ferrous scrap

DOEpatents

Blander, M.; Sinha, S.N.

1987-07-30

A process for removing copper from ferrous or other metal scrap in which the scrap is contacted with a polyvalent metal sulfide slag in the presence of an excess of copper-sulfide forming additive to convert the copper to copper sulfide which is extracted into the slag to provide a ratio of copper in the slag to copper in the metal scrap of at least about 10.

Removal of copper from ferrous scrap

DOEpatents

Blander, M.; Sinha, S.N.

1990-05-15

A process for removing copper from ferrous or other metal scrap in which the scrap is contacted with a polyvalent metal sulfide slag in the presence of an excess of copper-sulfide forming additive to convert the copper to copper sulfide which is extracted into the slag to provide a ratio of copper in the slag to copper in the metal scrap of at least about 10.

Removal of copper from ferrous scrap

DOEpatents

Blander, Milton; Sinha, Shome N.

1990-01-01

A process for removing copper from ferrous or other metal scrap in which the scrap is contacted with a polyvalent metal sulfide slag in the presence of an excess of copper-sulfide forming additive to convert the copper to copper sulfide which is extracted into the slag to provide a ratio of copper in the slag to copper in the metal scrap of at least about 10.

40 CFR 421.265 - Pretreatment standards for existing sources.

Code of Federal Regulations, 2013 CFR

2013-07-01

... smelted Copper 5.760 2.745 Cyanide (total) 0.900 0.360 Zinc 4.590 1.890 Combined metals 1.350 Ammonia (as... Combined metals 0.192 Ammonia (as N) 85.310 37.500 (c) Spent plating solutions. PSES for the Secondary... 0.080 Zinc 1.020 0.420 Combined metals 0.300 Ammonia (as N) 133.300 58.600 (d) Spent Cyanide...

40 CFR 421.265 - Pretreatment standards for existing sources.

Code of Federal Regulations, 2014 CFR

2014-07-01

... smelted Copper 5.760 2.745 Cyanide (total) 0.900 0.360 Zinc 4.590 1.890 Combined metals 1.350 Ammonia (as... Combined metals 0.192 Ammonia (as N) 85.310 37.500 (c) Spent plating solutions. PSES for the Secondary... 0.080 Zinc 1.020 0.420 Combined metals 0.300 Ammonia (as N) 133.300 58.600 (d) Spent Cyanide...

40 CFR 421.265 - Pretreatment standards for existing sources.

Code of Federal Regulations, 2011 CFR

2011-07-01

... smelted Copper 5.760 2.745 Cyanide (total) 0.900 0.360 Zinc 4.590 1.890 Combined metals 1.350 Ammonia (as... Combined metals 0.192 Ammonia (as N) 85.310 37.500 (c) Spent plating solutions. PSES for the Secondary... 0.080 Zinc 1.020 0.420 Combined metals 0.300 Ammonia (as N) 133.300 58.600 (d) Spent Cyanide...

40 CFR 421.265 - Pretreatment standards for existing sources.

Code of Federal Regulations, 2012 CFR

2012-07-01

... smelted Copper 5.760 2.745 Cyanide (total) 0.900 0.360 Zinc 4.590 1.890 Combined metals 1.350 Ammonia (as... Combined metals 0.192 Ammonia (as N) 85.310 37.500 (c) Spent plating solutions. PSES for the Secondary... 0.080 Zinc 1.020 0.420 Combined metals 0.300 Ammonia (as N) 133.300 58.600 (d) Spent Cyanide...

High average power magnetic modulator for metal vapor lasers

DOEpatents

Ball, Don G.; Birx, Daniel L.; Cook, Edward G.; Miller, John L.

1994-01-01

A three-stage magnetic modulator utilizing magnetic pulse compression designed to provide a 60 kV pulse to a copper vapor laser at a 4.5 kHz repetition rate is disclosed. This modulator operates at 34 kW input power. The circuit includes a step up auto transformer and utilizes a rod and plate stack construction technique to achieve a high packing factor.

Copper phthalocyanine films deposited by liquid-liquid interface recrystallization technique (LLIRCT).

PubMed

Patil, K R; Sathaye, S D; Hawaldar, R; Sathe, B R; Mandale, A B; Mitra, A

2007-11-15

The simple recrystallization process is innovatively used to obtain the nanoparticles of copper phthalocyanine by a simple method. Liquid-liquid interface recrystallization technique (LLIRCT) has been employed successfully to produce small sized copper phthalocyanine nanoparticles with diameter between 3-5 nm. The TEM-SAED studies revealed the formation of 3-5 nm sized with beta-phase dominated mixture of alpha and beta copper phthalocyanine nanoparticles. The XRD, SEM, and the UV-vis studies were further carried out to confirm the formation of copper phthalocyanine thin films. The cyclic voltametry (CV) studies conclude that redox reaction is totally reversible one electron transfer process. The process is attributed to Cu(II)/Cu(I) redox reaction.

An investigation of the antibacterial ability and cytotoxicity of a novel cu-bearing 317L stainless steel

NASA Astrophysics Data System (ADS)

Sun, Da; Xu, Dake; Yang, Chunguang; Shahzad, M. Babar; Sun, Ziqing; Xia, Jin; Zhao, Jinlong; Gu, Tingyue; Yang, Ke; Wang, Guixue

2016-07-01

In order to solve the challenging problem of microbial infections caused by microorganisms on medical implants, it is imperative to develop novel antimicrobial biomaterials. This work demonstrated that 317L-Cu stainless steel (SS), created by adding copper through a solution and aging heat treatment process, exhibited good antibacterial properties against staphylococcus aureus, achieving 2 log reduction of planktonic cells after 5 days of incubation. In this study, the antibacterial test was performed using the plate count method, the fluorescence cell staining method and the quantitative polymerase chain reaction (qPCR) method. It is well known that a high concentration of copper ion can lead to cytotoxicity. This work explored the cytotoxicity of 317L-Cu SS through real-time cell analysis (RTCA). Experimental results demonstrated that the 317L-Cu SS possessed a satisfactory antibacterial ability against S. aureus, and the antibacterial rate based on the reduction of sessile cell count reached 98.3% after 24-hour treatment. The bacterial adhesion and the biofilm thickness were considerably reduced by the 317L-Cu SS. The results of RTCA suggested that 317L-Cu SS did not introduce cytotoxicity to mouse cells, indicating its suitability as a medical implant material.

Design of handwriting drawing board based on common copper clad laminate

NASA Astrophysics Data System (ADS)

Wang, Hongyuan; Gao, Wenzhi; Wang, Yuan

2015-02-01

Handwriting drawing board is not only a subject which can be used to write and draw, but also a method to measure and process weak signals. This design adopts 8051 single chip microprocessor as the main controller. It applies a constant-current source[1][2] to copper plate and collects the voltage value according to the resistance divider effect. Then it amplifies the signal with low-noise and high-precision amplifier[3] AD620 which is placed in the low impedance and anti-interference pen. It converts analog signal to digital signal by an 11-channel, 12-bit A/D converter TLC2543. Adoption of average filtering algorithm can effectively improve the measuring accuracy, reduce the error and make the collected voltage signal more stable. The accurate position can be detected by scanning the horizontal and vertical ordinates with the analog switch via the internal bridge of module L298 which can change the direction of X-Y axis signal scan. DM12864 is used as man-machine interface and this hominization design is convenient for man-machine communication. This collecting system has high accuracy, high stability and strong anti-interference capability. It's easy to control and has very large development space in the future.

Low-Temperature Oxidation-Free Selective Laser Sintering of Cu Nanoparticle Paste on a Polymer Substrate for the Flexible Touch Panel Applications.

PubMed

Kwon, Jinhyeong; Cho, Hyunmin; Eom, Hyeonjin; Lee, Habeom; Suh, Young Duk; Moon, Hyunjin; Shin, Jaeho; Hong, Sukjoon; Ko, Seung Hwan

2016-05-11

Copper nanomaterials suffer from severe oxidation problem despite the huge cost effectiveness. The effect of two different processes for conventional tube furnace heating and selective laser sintering on copper nanoparticle paste is compared in the aspects of chemical, electrical and surface morphology. The thermal behavior of the copper thin films by furnace and laser is compared by SEM, XRD, FT-IR, and XPS analysis. The selective laser sintering process ensures low annealing temperature, fast processing speed with remarkable oxidation suppression even in air environment while conventional tube furnace heating experiences moderate oxidation even in Ar environment. Moreover, the laser-sintered copper nanoparticle thin film shows good electrical property and reduced oxidation than conventional thermal heating process. Consequently, the proposed selective laser sintering process can be compatible with plastic substrate for copper based flexible electronics applications.

Evaluation of measurement errors of temperature and relative humidity from HOBO data logger under different conditions of exposure to solar radiation.

PubMed

da Cunha, Antonio Ribeiro

2015-05-01

This study aimed to assess measurements of temperature and relative humidity obtained with HOBO a data logger, under various conditions of exposure to solar radiation, comparing them with those obtained through the use of a temperature/relative humidity probe and a copper-constantan thermocouple psychrometer, which are considered the standards for obtaining such measurements. Data were collected over a 6-day period (from 25 March to 1 April, 2010), during which the equipment was monitored continuously and simultaneously. We employed the following combinations of equipment and conditions: a HOBO data logger in full sunlight; a HOBO data logger shielded within a white plastic cup with windows for air circulation; a HOBO data logger shielded within a gill-type shelter (multi-plate prototype plastic); a copper-constantan thermocouple psychrometer exposed to natural ventilation and protected from sunlight; and a temperature/relative humidity probe under a commercial, multi-plate radiation shield. Comparisons between the measurements obtained with the various devices were made on the basis of statistical indicators: linear regression, with coefficient of determination; index of agreement; maximum absolute error; and mean absolute error. The prototype multi-plate shelter (gill-type) used in order to protect the HOBO data logger was found to provide the best protection against the effects of solar radiation on measurements of temperature and relative humidity. The precision and accuracy of a device that measures temperature and relative humidity depend on an efficient shelter that minimizes the interference caused by solar radiation, thereby avoiding erroneous analysis of the data obtained.

Bulk Nanocrystalline Metals: Review of the Current State of the Art and Future Opportunities for Copper and Copper Alloys

DTIC Science & Technology

2014-05-13

nanocrystalline materials using mechanical alloying, the alloy development and synthesis process for stabilizing these materials at elevated temperatures, and...the physical and mechanical properties of nanocrystalline materials with a focus throughout on nanocrystalline copper and a nanocrystalline Cu-Ta...approaches as well as experimental results for grain growth, grain boundary processes, and deformation mechanisms in nanocrystalline copper are

Removal of copper from aqueous solution using perlite

NASA Astrophysics Data System (ADS)

Tanaydin, Mehmet Kayra; Tanaydin, Zümra Bakici; Ince, Muharrem; Demırkiran, Nizamettin

2017-04-01

The wastewaters containing organic and inorganic pollutants after many industrial processes such as metal plating, mining, textile, alloy, battery and industrial chemicals, are often discharged to environment. Heavy metals among these pollutants have highly stable, toxic, non-degradable and carcinogenic characters. They affect not only ecological system, but also human health and many life forms. Therefore, these contaminants should be eliminated or reduced to allowable levels before releasing to environment. Most of heavy metals have toxic character even at low concentrations of about 0.1-0.3 ppm. Treatment technologies such as filtration, ion exchange, precipitation, electrodeposition, reverse osmosis, sedimentation, and adsorption have been applied for removal of heavy metals from aqueous solutions. Adsorption is one of the most common and widely applied methods to eliminate the metal ions from waste solutions because of its simplicity and cost effectiveness. Activated carbon, clay minerals, ion exchange resins and various agricultural residues can be used as adsorbent materials in this process [1-3].

Recovery of copper and water from copper-electroplating wastewater by the combination process of electrolysis and electrodialysis.

PubMed

Peng, Changsheng; Liu, Yanyan; Bi, Jingjing; Xu, Huizhen; Ahmed, Abou-Shady

2011-05-30

In this paper, a laboratory-scale process which combined electrolysis (EL) and electrodialysis (ED) was developed to treat copper-containing wastewater. The feasibility of such process for copper recovery as well as water reuse was determined. Effects of three operating parameters, voltage, initial Cu(2+) concentration and water flux on the recovery of copper and water were investigated and optimized. The results showed that about 82% of copper could be recovered from high concentration wastewater (HCW, >400mg/L) by EL, at the optimal conditions of voltage 2.5 V/cm and water flux 4 L/h; while 50% of diluted water could be recycled from low concentration wastewater (LCW, <200mg/L) by ED, at the optimal conditions of voltage 40 V and water flux 4 L/h. However, because of the limitation of energy consumption (EC), LCW for EL and HCW for ED could not be treated effectively, and the effluent water of EL and concentrated water of ED should be further treated before discharged. Therefore, the combination process of EL and ED was developed to realize the recovery of copper and water simultaneously from both HCW and LCW. The results of the EL-ED process showed that almost 99.5% of copper and 100% of water could be recovered, with the energy consumption of EL ≈ 3 kW h/kg and ED ≈ 2 kW h/m(3). According to SEM and EDX analysis, the purity of recovered copper was as high as 97.9%. Copyright © 2011 Elsevier B.V. All rights reserved.

40 CFR 421.326 - Pretreatment standards for new sources.

Code of Federal Regulations, 2011 CFR

2011-07-01

... uranium processed in the refinery Chromium (total) 27.14 11.00 Copper 93.88 44.74 Nickel 40.34 27.14... uranium processed in the refinery Chromium (total) 1.689 0.685 Copper 5.844 2.785 Nickel 2.511 1.689... per million pounds) of uranium processed in the refinery Chromium (total) 2.357 0.955 Copper 8.152 3...

40 CFR 421.326 - Pretreatment standards for new sources.

Code of Federal Regulations, 2010 CFR

2010-07-01

... uranium processed in the refinery Chromium (total) 27.14 11.00 Copper 93.88 44.74 Nickel 40.34 27.14... uranium processed in the refinery Chromium (total) 1.689 0.685 Copper 5.844 2.785 Nickel 2.511 1.689... per million pounds) of uranium processed in the refinery Chromium (total) 2.357 0.955 Copper 8.152 3...

40 CFR 440.100 - Applicability; description of the copper, lead, zinc, gold, silver, and molybdenum ores subcategory.

Code of Federal Regulations, 2013 CFR

2013-07-01

... process alone or in conjunction with other processes, for the beneficiation of copper, lead, zinc, gold, silver, or molybdenum ores, or any combination of these ores; (3) Mines and mills that use dump, heap, in-situ leach, or vat-leach processes to extract copper from ores or ore waste materials; and (4) Mills...

40 CFR 440.100 - Applicability; description of the copper, lead, zinc, gold, silver, and molybdenum ores subcategory.

Code of Federal Regulations, 2012 CFR

2012-07-01

... process alone or in conjunction with other processes, for the beneficiation of copper, lead, zinc, gold, silver, or molybdenum ores, or any combination of these ores; (3) Mines and mills that use dump, heap, in-situ leach, or vat-leach processes to extract copper from ores or ore waste materials; and (4) Mills...

40 CFR 440.100 - Applicability; description of the copper, lead, zinc, gold, silver, and molybdenum ores subcategory.

Code of Federal Regulations, 2014 CFR

2014-07-01

... process alone or in conjunction with other processes, for the beneficiation of copper, lead, zinc, gold, silver, or molybdenum ores, or any combination of these ores; (3) Mines and mills that use dump, heap, in-situ leach, or vat-leach processes to extract copper from ores or ore waste materials; and (4) Mills...

Corrosion Characterization in Nickel Plated 110 ksi Low Alloy Steel and Incoloy 925: An Experimental Case Study

NASA Astrophysics Data System (ADS)

Thomas, Kiran; Vincent, S.; Barbadikar, Dipika; Kumar, Shresh; Anwar, Rebin; Fernandes, Nevil

2018-04-01

Incoloy 925 is an age hardenable Nickel-Iron-Chromium alloy with the addition of Molybdenum, Copper, Titanium and Aluminium used in many applications in oil and gas industry. Nickel alloys are preferred mostly in corrosive environments where there is high concentration of H2S, CO2, chlorides and free Sulphur as sufficient nickel content provides protection against chloride-ion stress-corrosion cracking. But unfortunately, Nickel alloys are very expensive. Plating an alloy steel part with nickel would cost much lesser than a part make of nickel alloy for large quantities. A brief study will be carried out to compare the performance of nickel plated alloy steel with that of an Incoloy 925 part by conducting corrosion tests. Tests will be carried out using different coating thicknesses of Nickel on low alloy steel in 0.1 M NaCl solution and results will be verified. From the test results we can confirm that Nickel plated low alloy steel is found to exhibit fairly good corrosion in comparison with Incoloy 925 and thus can be an excellent candidate to replace Incoloy materials.

Smelting reduction and kinetics analysis of magnetic iron in copper slag using waste cooking oil.

PubMed

Li, Bo; Wang, Xubin; Wang, Hua; Wei, Yonggang; Hu, Jianhang

2017-05-25

To improve the recovery of copper, the viscosity of copper molten slag is decreased by the reduction of magnetic iron, which, in turn, accelerates the settling and separation of copper droplets from the slag. A new technology is proposed in which waste cooking oil is used as a reductant to reduce magnetic iron in the copper smelting slag and consequently reduce carbon emissions in the copper smelting process. A kinetic model of the reduction of magnetic iron in copper slag by waste cooking oil was built using experimental data, and the accuracy of the model was verified. The results indicated that the magnetic iron content in the copper slag decreased with increasing reduction time and an increase in temperature more efficiently reduced magnetic iron in the copper slag. The magnetic iron in the copper slag gradually transformed to fayalite, and the viscosity of the copper molten slag decreased as the magnetic iron content decreased during the reduction process. The reduction of magnetic iron in the copper molten slag using waste cooking oil was a first-order reaction, and the rate-limiting step was the mass transfer of Fe 3 O 4 through the liquid boundary layer.

Effects of Conformal Coat on Tin Whisker Growth

NASA Technical Reports Server (NTRS)

Kadesch, Jong S.; Leidecker, Henning; Day, John H. (Technical Monitor)

2000-01-01

A whisker from a tin plated part was blamed for the loss of a commercial spacecraft in 1998. Although pure tin finishes are prohibited by NASA, tin plated parts, such as hybrids, relays and commercial off the shelf (COTS) parts, are something discovered to have been installed in NASA spacecraft. Invariably, the assumption is that a conformal coat will prevent the growth of, or short circuits caused by, tin whiskers. This study measures the effect a Uralane coating has on the initiation and growth of tin whiskers, on the ability of this coating to prevent a tin whisker from emerging from the coating, and on the ability to prevent shorting. A sample of fourteen brass substrates (1 inch by 4 inches by 1/16 inch) were plated by two separate processes: half of the specimens were 'bright' tin plated directly over the brass substrate and half received a copper flash over the brass substrate prior to 'bright' tin plating. Each specimen was coated on one half of the substrate with three bi-directional sprays of Uralane 5750 to a nominal thickness of 25 to 75 micrometers (1 to 3 mils). Several specimens of both types, Cu and non-Cu flashed, were placed in an oven maintained at 50 C as others' work suggests that this is the optimal temperature for whisker formation. The remaining specimens were maintained at room ambient conditions. The surfaces of each specimen have been regularly inspected using both optical (15 to 400x power) and Scanning Electronic Microscopy (SEM). Many types of growths, including needle-like whiskers, first appeared approximately three months after plating on the non-conformally coated sides of all specimens. At four months, 4 to 5 times more growth sites were observed on the coated side; however, the density of growth sites on the non-conformally coated side has since increased rapidly, and now, at one year, is about the same for both sides. The density of growth sites is estimated at 90/sq mm with 30 percent of the sites growing whiskers (needle-like forms) with the potential to cause short circuit bridging. The average growth rate of the needle-like whiskers on the non-conformally coated areas is about 130 micrometers per year with some outliers reaching 800 micrometers after one year. It is more difficult to make growth measurements under the conformal coat. As yet no whiskers have been observed to penetrate through the coating surface, however, a number of tin nodules appear on the verge of breaking through the thinner regions of the coating surface. These domes are developing sharper and sharper tips, as if a growing whisker is about to push its way through a tough skin. Our observations are that the specimens with copper flash show a much lower density of nucleation sites and significantly slower whisker growth compared to the specimens that have only bright tin plating over brass. The specimens kept at room temperature have a higher whisker density than those stored at 50 C. This is an unexpected result and does not agree with the published findings of others. All of the whiskers originate from small surface defects (thin, tiny scratches) that appear over the entire surface of each specimen.

Effects of processing conditions and ambient environment on the microstructure and fracture strength of copper/niobium/copper interlayer joints for alumina

DOE Office of Scientific and Technical Information (OSTI.GOV)

Marks, Robert Alan

1999-12-01

Partial transient liquid phase (PTLP) bonding is a technique which can be used to join ceramics with metals and is used to form niobium-based joints for alumina. The principal advantage to PTLP bonding is that it enables refractory joints to be fabricated at temperatures below those typically required by solid state diffusion bonding. A thorough review of the important parameters (chemical compatibility, thermal expansion match, sufficient wettability of the liquid phase on the solid phases) in choosing a joining material for ceramics by the PTLP method is provided. As in conventional PTLP joining, the current study uses thin (=3 μm)more » copper layers sandwiched between the alumina (bulk) and niobium (127 μm). However, unlike the case of copper/nickel/copper obium is limited. Consequently, the copper is not entirely dissolved in the process, resulting in a two phase (copper-rich and niobium-rich phases) microstructure. Different processing conditions (temperature and applied load) result in different morphologies of the copper-rich and niobium-rich phases at the interface. These different microstructures exhibit distinct strength characteristics. Extended annealing of as-processed joints can influence the strengths differently depending on the ambient partial oxygen pressure at the annealing temperature. The focus of this work is to correlate processing conditions, microstructure, and resulting joint strength. Under optimum processing conditions (1400°C, 2.2 MPa), joints with strengths in excess of 200 MPa at 1200°C are fabricated.« less

Turning tumor-promoting copper into an anti-cancer weapon via high-throughput chemistry.

PubMed

Wang, F; Jiao, P; Qi, M; Frezza, M; Dou, Q P; Yan, B

2010-01-01

Copper is an essential element for multiple biological processes. Its concentration is elevated to a very high level in cancer tissues for promoting cancer development through processes such as angiogenesis. Organic chelators of copper can passively reduce cellular copper and serve the role as inhibitors of angiogenesis. However, they can also actively attack cellular targets such as proteasome, which plays a critical role in cancer development and survival. The discovery of such molecules initially relied on a step by step synthesis followed by biological assays. Today high-throughput chemistry and high-throughput screening have significantly expedited the copper-binding molecules discovery to turn "cancer-promoting" copper into anti-cancer agents.

Welding of Al6061and Al6082-Cu composite by friction stir processing

NASA Astrophysics Data System (ADS)

Iyer, R. B.; Dhabale, R. B.; Jatti, V. S.

2016-09-01

Present study aims at investigating the influence of process parameters on the microstructure and mechanical properties such as tensile strength and hardness of the dissimilar metal without and with copper powder. Before conducting the copper powder experiments, optimum process parameters were obtained by conducting experiments without copper powder. Taguchi's experimental L9 orthogonal design layout was used to carry out the experiments without copper powder. Threaded pin tool geometry was used for conducting the experiments. Based on the experimental results and Taguchi's analysis it was found that maximum tensile strength of 66.06 MPa was obtained at 1400 rpm spindle speed and weld speed of 20 mm/min. Maximum micro hardness (92 HV) was obtained at 1400 rpm spindle speed and weld speed of 16 mm/min. At these optimal setting of process parameters aluminium alloys were welded with the copper powder. Experimental results demonstrated that the tensile strength (96.54 MPa) and micro hardness (105 HV) of FSW was notably affected by the addition of copper powder when compared with FSW joint without copper powder. Tensile failure specimen was analysed using Scanning Electron Microscopy in order to study the failure mechanism.

Investigation of electroforming techniques. [fabrication of regeneratively cooled thrust chambers

NASA Technical Reports Server (NTRS)

Malone, G. A.

1975-01-01

Copper and nickel electroforming was examined for the purpose of establishing the necessary processes and procedures for repeatable, successful fabrication of the outer structures of regeneratively cooled thrust chambers. The selection of electrolytes for copper and nickel deposition is described. The development studies performed to refine and complete the processes necessary for successful chamber shell fabrication and the testing employed to verify the applicability of the processes and procedures to small scale hardware are described. Specifications were developed to afford a guideline for the electroforming of high quality outer shells on regeneratively cooled thrust chamber liners. Test results indicated repeatable mechanical properties could be produced in copper deposits from the copper sulfate electrolyte with periodic current reversal and in nickel deposits from the sulfamate solution. Use of inert, removable channel fillers and the conductivizing of such is described. Techniques (verified by test) which produce high integrity bonds to copper and copper alloy liners are discussed.

Low-cost optical fabrication of flexible copper electrode via laser-induced reductive sintering and adhesive transfer

NASA Astrophysics Data System (ADS)

Back, Seunghyun; Kang, Bongchul

2018-02-01

Fabricating copper electrodes on heat-sensitive polymer films in air is highly challenging owing to the need of expensive copper nanoparticles, rapid oxidation of precursor during sintering, and limitation of sintering temperature to prevent the thermal damage of the polymer film. A laser-induced hybrid process of reductive sintering and adhesive transfer is demonstrated to cost-effectively fabricate copper electrode on a polyethylene film with a thermal resistance below 100 °C. A laser-induced reductive sintering process directly fabricates a high-conductive copper electrode onto a glass donor from copper oxide nanoparticle solution via photo-thermochemical reduction and agglomeration of copper oxide nanoparticles. The sintered copper patterns were transferred in parallel to a heat-sensitive polyethylene film through self-selective surface adhesion of the film, which was generated by the selective laser absorption of the copper pattern. The method reported here could become one of the most important manufacturing technologies for fabricating low-cost wearable and disposable electronics.

[Biohydrometallurgical technology of a complex copper concentrate process].

PubMed

Murav'ev, M I; Fomchenko, N V; Kondrat'eva, T F

2011-01-01

Leaching of sulfide-oxidized copper concentrate of the Udokan deposit ore with a copper content of 37.4% was studied. In the course of treatment in a sulfuric acid solution with pH 1.2, a copper leaching rate was 6.9 g/kg h for 22 h, which allowed extraction of 40.6% of copper. As a result of subsequent chemical leaching at 80 degrees C during 7 h with a solution of sulphate ferric iron obtained after bio-oxidation by an association of microorganisms, the rate of copper recovery was 52.7 g/kg h. The total copper recovery was 94.5% (over 29 h). Regeneration of the Fe3+ ions was carried out by an association of moderately thermophilic microorganisms, including bacteria of genus Sulfobacillus and archaea of genus Ferroplasma acidiphilum, at 1.0 g/l h at 40 degrees C in the presence of 3% solids obtained by chemical leaching of copper concentrate. A technological scheme of a complex copper concentrate process with the use of bacterial-chemical leaching is proposed.

Al2O3 and TiO2 atomic layer deposition on copper for water corrosion resistance.

PubMed

Abdulagatov, A I; Yan, Y; Cooper, J R; Zhang, Y; Gibbs, Z M; Cavanagh, A S; Yang, R G; Lee, Y C; George, S M

2011-12-01

Al(2)O(3) and TiO(2) atomic layer deposition (ALD) were employed to develop an ultrathin barrier film on copper to prevent water corrosion. The strategy was to utilize Al(2)O(3) ALD as a pinhole-free barrier and to protect the Al(2)O(3) ALD using TiO(2) ALD. An initial set of experiments was performed at 177 °C to establish that Al(2)O(3) ALD could nucleate on copper and produce a high-quality Al(2)O(3) film. In situ quartz crystal microbalance (QCM) measurements verified that Al(2)O(3) ALD nucleated and grew efficiently on copper-plated quartz crystals at 177 °C using trimethylaluminum (TMA) and water as the reactants. An electroplating technique also established that the Al(2)O(3) ALD films had a low defect density. A second set of experiments was performed for ALD at 120 °C to study the ability of ALD films to prevent copper corrosion. These experiments revealed that an Al(2)O(3) ALD film alone was insufficient to prevent copper corrosion because of the dissolution of the Al(2)O(3) film in water. Subsequently, TiO(2) ALD was explored on copper at 120 °C using TiCl(4) and water as the reactants. The resulting TiO(2) films also did not prevent the water corrosion of copper. Fortunately, Al(2)O(3) films with a TiO(2) capping layer were much more resilient to dissolution in water and prevented the water corrosion of copper. Optical microscopy images revealed that TiO(2) capping layers as thin as 200 Å on Al(2)O(3) adhesion layers could prevent copper corrosion in water at 90 °C for ~80 days. In contrast, the copper corroded almost immediately in water at 90 °C for Al(2)O(3) and ZnO films by themselves on copper. Ellipsometer measurements revealed that Al(2)O(3) films with a thickness of ~200 Å and ZnO films with a thickness of ~250 Å dissolved in water at 90 °C in ~10 days. In contrast, the ellipsometer measurements confirmed that the TiO(2) capping layers with thicknesses of ~200 Å on the Al(2)O(3) adhesion layers protected the copper for ~80 days in water at 90 °C. The TiO(2) ALD coatings were also hydrophilic and facilitated H(2)O wetting to copper wire mesh substrates. © 2011 American Chemical Society

Effect of deposition rate on melting point of copper film catalyst substrate at atomic scale

NASA Astrophysics Data System (ADS)

Marimpul, Rinaldo; Syuhada, Ibnu; Rosikhin, Ahmad; Winata, Toto

2018-03-01

Annealing process of copper film catalyst substrate was studied by molcular dynamics simulation. This copper film catalyst substrate was produced using thermal evaporation method. The annealing process was limited in nanosecond order to observe the mechanism at atomic scale. We found that deposition rate parameter affected the melting point of catalyst substrate. The change of crystalline structure of copper atoms was observed before it had been already at melting point. The optimum annealing temperature was obtained to get the highest percentage of fcc structure on copper film catalyst substrate.

Characteristics and antimicrobial activity of copper-based materials

NASA Astrophysics Data System (ADS)

Li, Bowen

In this study, copper vermiculite was synthesized, and the characteristics, antimicrobial effects, and chemical stability of copper vermiculite were investigated. Two types of copper vermiculite materials, micron-sized copper vermiculite (MCV) and exfoliated copper vermiculite (MECV), are selected for this research. Since most of the functional fillers used in industry products, such as plastics, paints, rubbers, papers, and textiles prefer micron-scaled particles, micron-sized copper vermiculite was prepared by jet-milling vermiculite. Meanwhile, since the exfoliated vermiculite has very unique properties, such as high porosity, specific surface area, high aspect ratio of laminates, and low density, and has been extensively utilized as a functional additives, exfoliated copper vermiculite also was synthesized and investigated. The antibacterial efficiency of copper vermiculite was qualitatively evaluated by the diffusion methods (both liquid diffusion and solid diffusion) against the most common pathogenic species: Escherichia coli (E. coli), Staphylococcus aureus (S. aureus), and Klebsiella pneumoniae (K. pneumoniae). The result showed that the release velocity of copper from copper vermiculite is very slow. However, copper vermiculite clearly has excellent antibacterial efficiency to S. aureus, K. pneumoniae and E. coli. The strongest antibacterial ability of copper vermiculite is its action on S. aureus. The antibacterial efficiency of copper vermiculite was also quantitatively evaluated by determining the reduction rate (death rate) of E. coli versus various levels of copper vermiculite. 10 ppm of copper vermiculite in solution is sufficient to reduce the cell population of E. coli, while the untreated vermiculite had no antibacterial activity. The slow release of copper revealed that the antimicrobial effect of copper vermiculite was due to the strong interactions between copper ions and bacteria cells. Exfoliated copper vermiculite has even stronger antibacterial activity than copper vermiculite against E. coli. With 200 ppm exfoliated copper vermiculite in bacteria suspension (4.68 ppm of metal copper), the reduction of viable bacteria are 99.8% at 1 hour, and >99.9% at 2 hours. With 10 ppm exfoliated copper vermiculite in bacteria dilution (0.234 ppm of copper atoms), the reduction of viable E. coli reached 98.7% at 1 hour, and >95.6% at 2 hours. Molds have the potential to cause health problems, such as allergic reactions, irritations, and mycotoxins, and damage to buildings, historic relics, properties, etc. Since copper has better antifungal property, an initial antifungal activity of copper vermiculite was evaluated in this study. Fat-free milk was used to develop molds in the test samples by saturated samples. Incubated at 36°C for 48 hours, all of the surfaces of untreated control samples, including micron-sized vermiculite, exfoliated vermiculite, bentonite, and kaolin, have been covered by thick mold layers. However, there were no mold showed on copper vermiculite and exfoliated copper vermiculite. Even after the incubation was lasted for 10 days, copper vermiculite and exfoliated copper vermiculite did not show any mold on the surface. These results exhibited copper vermiculite has excellent antifungal activities against mold. Stability of copper ions in copper vermiculite was measured by aqueous leaching process. Copper vermiculite and exfoliated copper vermiculite were put into distilled water in a ratio of 2.0g/100ml, and then implemented leaching processes by continuously shaking (leaching) and statically storing (soaking) for desired periods of time, respectively. According to the analytic result by inductively coupled plasma spectroscopy (ICP), the major metals released were copper, magnesium, iron, silicon, and aluminum. The release rate of copper depends on the environmental conditions. Under the dynamic leaching condition, all the major elements had shown linear leaching rates, and slowly increases along with the leaching time. Copper concentration in 1 hour leached solutions had sufficient concentration to inhibit E. coli in aqueous solution. Lasting for 1 month, 1 gram of copper vermiculite only released 185mug of copper. At this velocity, 11.5 years are required to completely exhaust the copper atoms from copper vermiculite. A soaking process provided a lower release rate than leaching process. Comparably, exfoliated copper vermiculite had lower copper concentration, stronger antimicrobial effect, but faster release rate than copper vermiculite, due to their different structure characteristics. (Abstract shortened by UMI.)

Enhanced thermal diffusivity of copperbased composites using copper-RGO sheets

NASA Astrophysics Data System (ADS)

Kim, Sangwoo; Kwon, Hyouk-Chon; Lee, Dohyung; Lee, Hyo-Soo

2017-11-01

The synthesis of copper-reduced graphene oxide (RGO) sheets was investigated in order to control the agglutination of interfaces and develop a manufacturing process for copper-based composite materials based on spark plasma sintering. To this end, copper-GO (graphene oxide) composites were synthesized using a hydrothermal method, while the copper-reduced graphene oxide composites were made by hydrogen reduction. Graphene oxide-copper oxide was hydrothermally synthesized at 80 °C for 5 h, and then annealed at 800 °C for 5 h in argon and hydrazine rate 9:1 to obtain copper-RGO flakes. The morphology and structure of these copper-RGO sheets were characterized using scanning electron microscopy, transmission electron microscopy, X-ray diffraction, X-ray photoelectron spectroscopy and Raman spectroscopy. After vibratory mixing of the synthesized copper-RGO composites (0-2 wt%) with copper powder, they were sintered at 600 °C for 5 min under100 MPa of pressure by spark plasma sintering process. The thermal diffusivity of the resulting sintered composite was characterized by the laser flash method at 150 °C.

Feasibility assessment of electrocoagulation towards a new sustainable wastewater treatment.

PubMed

Rodriguez, Jackson; Stopić, Srećko; Krause, Gregor; Friedrich, Bernd

2007-11-01

Electrocoagulation (EC) may be a potential answer to environmental problems dealing with water reuse and rational waste management. The aim of this research was to assess the feasibility of EC-process for industrial contaminated effluents from copper production, taking into consideration technical and economical factors. EC-technology claims to offer efficient removal rates for most types of wastewater impurities at low power consumption and without adding any precipitating agents. Real wastewater from Saraka stream with high concentrations of heavy metals was provided by RTB-BOR, a Serbian copper mining and smelting complex. Runs were performed on a 10 l EC-reactor using aluminum plates as sacrificial electrodes and powered by a 40 A supply unit. Results concerning key factors like pH, conductivity and power consumption were measured in real time. Analysis of dissolved metal concentrations before and after treatment were carried out via ICP-OES and confirmed by an independent test via AAS. Several aspects were taken into account, including current density, conductivity, interfacial resistivity and reactor settings throughout the runs, in order to analyze all possible factors playing a role in neutralization and metal removal in real industrial wastewater. Electrode configurations and their effects on energy demand were discussed and exemplified based on fundamentals of colloidal and physical chemistry. Based on experimental data and since no precipitating agents were applied, the EC-process proved to be not only feasible and environmentally-friendly, but also a cost-effective technology The EC-technology provides strategic guidelines for further research and development of sustainable water management processes. However, additional test series concerning continuous operation must be still performed in order to get this concept ready for future large-scale applications.

Terahertz polarizing beam splitter based on copper grating on polyimide substrate

NASA Astrophysics Data System (ADS)

Zhang, Mengen; Li, Xiangjun; Wang, Wentao; Liu, Jianjun; Hong, Zhi

2012-12-01

A terahertz polarizing beam splitter, based on a copper grating on polyimide (PI) substrate, was fabricated by the way of laser induced and non-electrolytic plating. The good polarization characteristics of the splitter in the range of 0°-180°polarization are verified experimentally using backward wave oscillator at fixed frequency of 300GHz, and the insertion losses of 0.13dB and 0.32dB are measured for the transmitted and reflected beams, respectively. The broadband transmission of TM wave of the splitter was also measured by terahertz time-domain spectroscopy, and the extinction ratio larger than 22dB is obtained in the frequency range of 0.2-1.5THz. The experiment results are in good agreement with finite element simulation results.

UV laser-assisted wire stripping and micro-machining

NASA Astrophysics Data System (ADS)

Martyniuk, Jerry

1994-02-01

Results are reported for the use of a 266 nm frequency quadrupled Nd:YAG ultraviolet laser in the areas of wire stripping of small coaxial type transmission lines and for micro-machining of various materials including copper, glass, polyimide and DuPont TEFLONTM. This new laser is typically run with a 2 KHz repetition rate, 40 ns FWHM pulse and a fluence of about 50 joules/cm2 which makes it possible to micro-machine metals, polymers, glasses and ceramics. The high fluence of this laser allows shielding structures such as Al-MylarTM, Al-KaptonTM or the plated copper used in small coaxial cables to be precisely cut. Cut rates are reported for the above materials as well as results and photos of wire stripping and micro- machining.

Theoretical and Experimental Study of Thermoacoustic Engines

DTIC Science & Technology

1991-12-31

possible. In particulbr, we have considered use of extruded ceramic monolithic catalyst supports (for example, the ceramic used in some automobile...approximation. Heat exchangers retaken r be of negligible thickness and thus not to affect near-standing wave phasing. The TAB (or snack ) of length d is assumed...Heat exchangers were parallel plates of copper and the TAE is a monolithic catalyst support extruded ceramic. 13 15 The two-microphone-technique

Installation Restoration Program. Phase I. Records Search, Vance Air Force Base, Oklahoma.

DTIC Science & Technology

1984-07-01

cadmium , and descaling solutions. The general trend in waste disposal over the years since VAFB first began operation has been from 3 largely unsegregated...generated at the jet engine shop and metal plating shops and consists of phosphoric acid, chromic acid, potassium permanganate, cadmium , and descaling...benzene, MIBK, carbon tetrachloride, MEK, methylene chloride, and acetone. The metal analytes should include cadmium , chromium, copper, iron, lead

Influence of FSW pin tool geometry on plastic flow of AA7075 T651

NASA Astrophysics Data System (ADS)

Lertora, Enrico; Mandolfino, Chiara; Gambaro, Carla

2016-10-01

In this paper the behaviour of the plastic flow during Friction Stir Welding of AA7075 T651 plates, realized with different shaped tools, has been investigated. In particular, the influence of the shape of three tools was studied using copper strips placed along the welds. After welding, radiography and metallurgical analysis were used in order to investigate the marker movement and its fragmentation.

Experimental study of Cu-water nanofluid forced convective flow inside a louvered channel

NASA Astrophysics Data System (ADS)

Khoshvaght-Aliabadi, M.; Hormozi, F.; Zamzamian, A.

2015-03-01

Heat transfer enhancement plays a very important role for energy saving in plate-fin heat exchangers. In the present study, the influences of simultaneous utilization of a louvered plate-fin channel and copper-base deionized water nanofluid on performance of these exchangers are experimentally explored. The effects of flow rate (2-5 l/min) and nanoparticles weight fraction (0-0.4 %) on heat transfer and pressure drop characteristics are determined. Experimental results indicate that the use of louvered channel instead of the plain one can improve the heat transfer performance. Likewise, addition of small amounts of copper nanoparticles to the base fluid augments the convective heat transfer coefficient remarkably. The maximum rise of 21.7 % in the convective heat transfer coefficient is observed for the 0.4 % wt nanofluid compared to the base fluid. Also, pumping power for the base fluid and nanofluids are calculated based on the measured pressure drop in the louvered channel. The average increase in pumping power is 11.8 % for the nanofluid with 0.4 % wt compared to the base fluid. Applied performance criterion shows a maximum performance index of 1.167 for the nanofluid with 0.1 % wt Finally, two correlations are proposed for Nusselt number and friction factor which fit the experimental data with in ±10 %.

Manufacturing of a REBCO racetrack coil using thermoplastic resin aiming at Maglev application

NASA Astrophysics Data System (ADS)

Mizuno, Katsutoshi; Ogata, Masafumi; Hasegawa, Hitoshi

2015-11-01

The REBCO coated conductor is a promising technology for the Maglev application in terms of its high critical temperature. The operating temperature of the on-board magnets can be around 40-50 K with the coated conductor. The REBCO coils are cooled by cryocoolers directly, and hence the thermal design of the REBCO coils significantly changes from that of LTS coils. We have developed a novel REBCO coil structure using thermoplastic resin. The coil is not impregnated and the thermoplastic resin is used to bond the coil winding and the heat transfer members, e.g. copper and aluminum plates. The viscosity of the thermoplastic resin is high enough for the thermoplastic resin not to permeate between the turns in the coil. Therefore, the thermal stress does not occur and the risk of degradation is removed. This paper contains the following three topics. First, the thermal resistance of the thermoplastic resin was measured at cryogenic temperature. Then, a small round REBCO coil was experimentally produced. It has been confirmed that the thermoplastic resin does not cause the degradation and, the adhesion between the coil winding and copper plates withstands the thermal stress. Finally, we successfully produced a full-scale racetrack REBCO coil applying the coil structure with the thermoplastic resin.

Dismantling and chemical characterization of spent Peltier thermoelectric devices for antimony, bismuth and tellurium recovery.

PubMed

Balva, Maxime; Legeai, Sophie; Garoux, Laetitia; Leclerc, Nathalie; Meux, Eric

2017-04-01

Major uses of thermoelectricity concern refrigeration purposes, using Peltier devices, mainly composed of antimony, bismuth and tellurium. Antimony was identified as a critical raw material by EU and resources of bismuth and tellurium are not inexhaustible, so it is necessary to imagine the recycling of thermoelectric devices. That for, a complete characterization is needed, which is the aim of this work. Peltier devices were manually dismantled in three parts: the thermoelectric legs, the alumina plates on which remain the electrical contacts and the silicone paste used to connect the plates. The characterization was performed using five Peltier devices. It includes mass balances of the components, X-ray diffraction analysis of the thermoelectric legs and elemental analysis of each part of the device. It appears that alumina represents 45% of a Peltier device in weight. The electrical contacts are mainly composed of copper and tin, and the thermoelectric legs of bismuth, tellurium and antimony. Thermoelectric legs appear to be Se-doped Bi 2 Te 3 and (Bi 0,5 Sb 1,5 )Te 3 for n type and p type semiconductors, respectively. This work shows that Peltier devices can be considered as a copper ore and that thermoelectric legs contain high amounts of bismuth, tellurium and antimony compared to their traditional resources.

Preparation and Characterization of Cu and Ni on Alumina Supports and Their Use in the Synthesis of Low-Temperature Metal-Phthalocyanine Using a Parallel-Plate Reactor.

PubMed

Sánchez-De la Torre, Fernando; De la Rosa, Javier Rivera; Kharisov, Boris I; Lucio-Ortiz, Carlos J

2013-09-30

Ni- and Cu/alumina powders were prepared and characterized by X-ray diffraction (XRD), scanning electronic microscope (SEM), and N₂ physisorption isotherms were also determined. The Ni/Al₂O₃ sample reveled agglomerated (1 μm) of nanoparticles of Ni (30-80 nm) however, NiO particles were also identified, probably for the low temperature during the H 2 reduction treatment (350 °C), the Cu/Al₂O₃ sample presented agglomerates (1-1.5 μm) of nanoparticles (70-150 nm), but only of pure copper. Both surface morphologies were different, but resulted in mesoporous material, with a higher specificity for the Ni sample. The surfaces were used in a new proposal for producing copper and nickel phthalocyanines using a parallel-plate reactor. Phthalonitrile was used and metallic particles were deposited on alumina in ethanol solution with CH₃ONa at low temperatures; ≤60 °C. The mass-transfer was evaluated in reaction testing with a recent three-resistance model. The kinetics were studied with a Langmuir-Hinshelwood model. The activation energy and Thiele modulus revealed a slow surface reaction. The nickel sample was the most active, influenced by the NiO morphology and phthalonitrile adsorption.

Multiphase separation of copper nanowires

DOE Office of Scientific and Technical Information (OSTI.GOV)

Qian, Fang; Lan, Pui Ching; Olson, Tammy

Here, this communication reports a new method to purify copper nanowires with nearly 100% yield from undesired copper nanoparticle side-products formed during batch processes of copper nanowire synthesis. Also, this simple separation method can yield large quantities of long, uniform, high-purity copper nanowires to meet the requirements of nanoelectronics applications as well as provide an avenue for purifying copper nanowires in the industrial scale synthesis of copper nanowires, a key step for commercialization and application of nanowires.

Multiphase separation of copper nanowires

DOE PAGES

Qian, Fang; Lan, Pui Ching; Olson, Tammy; ...

2016-09-01

Here, this communication reports a new method to purify copper nanowires with nearly 100% yield from undesired copper nanoparticle side-products formed during batch processes of copper nanowire synthesis. Also, this simple separation method can yield large quantities of long, uniform, high-purity copper nanowires to meet the requirements of nanoelectronics applications as well as provide an avenue for purifying copper nanowires in the industrial scale synthesis of copper nanowires, a key step for commercialization and application of nanowires.

Immobilization of copper flotation waste using red mud and clinoptilolite.

PubMed

Coruh, Semra

2008-10-01

The flash smelting process has been used in the copper industry for a number of years and has replaced most of the reverberatory applications, known as conventional copper smelting processes. Copper smelters produce large amounts of copper slag or copper flotation waste and the dumping of these quantities of copper slag causes economic, environmental and space problems. The aim of this study was to perform a laboratory investigation to assess the feasibility of immobilizing the heavy metals contained in copper flotation waste. For this purpose, samples of copper flotation waste were immobilized with relatively small proportions of red mud and large proportions of clinoptilolite. The results of laboratory leaching demonstrate that addition of red mud and clinoptilolite to the copper flotation waste drastically reduced the heavy metal content in the effluent and the red mud performed better than clinoptilolite. This study also compared the leaching behaviour of metals in copper flotation waste by short-time extraction tests such as the toxicity characteristic leaching procedure (TCLP), deionized water (DI) and field leach test (FLT). The results of leach tests showed that the results of the FLT and DI methods were close and generally lower than those of the TCLP methods.

Wear and Friction Behavior of Metal Impregnated Microporous Carbon Composites

NASA Technical Reports Server (NTRS)

Goller, Gultekin; Koty, D. P.; Tewari, S. N.; Singh, M.; Tekin, A.

1996-01-01

Metal-matrix composites have been prepared by pressure-infiltration casting of copper-base alloy melts into microporous carbon preforms. The carbon preforms contained varying proportions of amorphous carbon and graphite. Load dependence of the wear and friction behavior of the composite pins has been examined under ambient conditions against cast-iron plates, using a pin-on-plate reciprocating wear tester. The wear resistance of the composite is significantly improved, as compared with the base alloy. Contrary to the normally expected behavior, the addition of graphite to the amorphous carbon does not reduce the friction coefficient, especially at high loads. The wear and friction behavior of the composites is very sensitive to the size and distribution of the microstructural constituents.

Pb-free electronics: from nanotechnology to combinatorial materials science

NASA Astrophysics Data System (ADS)

Diaz Gonzalez, Alfredo J.

The elimination of lead (Pb) from the electronics industry due to a government directive caused problems on the manufacturing and use of electronic components. The current alloys used to attach components have a significant higher processing temperature (~30-40°C) that those containing Pb. The higher processing temperatures cause damage to the electronic components; printed circuit boards (PCB) and represents an increase in energetic costs for the manufacurer. Tin whiskers are out-of-plane structures that grow from tin (Sn) plated surfaces and cause short circuits and metal vapor arc. The electrical connection of components to the PCB relies on leads that are close to each other and are manufactured from tin-plated copper. Materials have shown a tendency to modify their bulk properties depending on powder particle size. Nanoparticle's coalescence temperature tends to decrease as particle size decreases. Exploiting this behavior, a nanoparticle based solder paste has been developed for attaching electronic components at a lower processing temperature to avoid thermally induced damage and reduce energy consumption. Tin nanoparticles were successfully synthesized via a wet chemistry route using tin (II) chloride dihydrated (metal precursor), 1,10-Phenanthroline (surfactant), and sodium borohydride (reducing agent). A flux system was developed based on Ethylene Glycol. Results showed acceptable coalescence of the non-capped nanoparticles at temperatures as low as 200°C with a processing time of 20 minutes. Synthesized nanoparticles with capping agent required higher flux content thus resulting in a poor metallic load paste. A reduction in processing temperature of approximately 40°C have been found when comparing the developed solder paste with typical SAC lead-free solders (~240°C). The electrical behavior was found to be an order of magnitude below that of bulk tin. Compositional libraries have been developed in an attempt to screen, via a high through-put method, alloys that are prone to tin whiskers growth. These libraries are samples containing a range of sub-samples with varying compositions within it than can be processed simultaneously. Using sputtering, a physical vapor deposition technique, a gradient composed of Ag-Cu was deposited over a Sn-plated Cu substrate. After reflow, the growth mechanism of the whiskers was accelerated using the IEC60068-82-2 standard. SEM and EDS analysis was used to charac-terize the growth of the tin whiskers at different elemental compositions. The gradients found across the samples are in accordance with the theoretical geometrical spacing. Tin whiskers were found on control samples, whereas almost all elemental compositions showed mitigation or elimination of the whiskers. This combinatorial material science methodology proved to be an efficient and fast screening method for the plating materials selection process in Pb-free electronics.

Eco-friendly copper recovery process from waste printed circuit boards using Fe³⁺/Fe²⁺ redox system.

PubMed

Fogarasi, Szabolcs; Imre-Lucaci, Florica; Egedy, Attila; Imre-Lucaci, Árpád; Ilea, Petru

2015-06-01

The present study aimed at developing an original and environmentally friendly process for the recovery of copper from waste printed circuit boards (WPCBs) by chemical dissolution with Fe(3+) combined with the simultaneous electrowinning of copper and oxidant regeneration. The recovery of copper was achieved in an original set-up consisting of a three chamber electrochemical reactor (ER) connected in series with a chemical reactor (CR) equipped with a perforated rotating drum. Several experiments were performed in order to identify the optimal flow rate for the dissolution of copper in the CR and to ensure the lowest energy consumption for copper electrodeposition in the ER. The optimal hydrodynamic conditions were provided at 400 mL/min, leading to the 75% dissolution of metals and to a low specific energy consumption of 1.59 kW h/kg Cu for the electrodeposition process. In most experiments, the copper content of the obtained cathodic deposits was over 99.9%. Copyright © 2015 Elsevier Ltd. All rights reserved.

Modeling MIC copper release from drinking water pipes.

PubMed

Pizarro, Gonzalo E; Vargas, Ignacio T; Pastén, Pablo A; Calle, Gustavo R

2014-06-01

Copper is used for household drinking water distribution systems given its physical and chemical properties that make it resistant to corrosion. However, there is evidence that, under certain conditions, it can corrode and release unsafe concentrations of copper to the water. Research on drinking water copper pipes has developed conceptual models that include several physical-chemical mechanisms. Nevertheless, there is still a necessity for the development of mathematical models of this phenomenon, which consider the interaction among physical-chemical processes at different spatial scales. We developed a conceptual and a mathematical model that reproduces the main processes in copper release from copper pipes subject to stagnation and flow cycles, and corrosion is associated with biofilm growth on the surface of the pipes. We discuss the influence of the reactive surface and the copper release curves observed. The modeling and experimental observations indicated that after 10h stagnation, the main concentration of copper is located close to the surface of the pipe. This copper is associated with the reactive surface, which acts as a reservoir of labile copper. Thus, for pipes with the presence of biofilm the complexation of copper with the biomass and the hydrodynamics are the main mechanisms for copper release. Copyright © 2013 Elsevier B.V. All rights reserved.

40 CFR 421.56 - Pretreatment standards for new sources.

Code of Federal Regulations, 2011 CFR

2011-07-01

... GUIDELINES AND STANDARDS NONFERROUS METALS MANUFACTURING POINT SOURCE CATEGORY Primary Electrolytic Copper.... The mass of wastewater pollutants in primary electrolytic copper refining process wastewater... pounds) of copper cast Arsenic .692 .309 Copper .638 .304 Nickel .274 .184 (b) Subpart E—Anode and...

40 CFR 415.361 - Specialized definitions.

Code of Federal Regulations, 2011 CFR

2011-07-01

... AND STANDARDS INORGANIC CHEMICALS MANUFACTURING POINT SOURCE CATEGORY Copper Salts Production... shall apply to this subpart. (b) The term product shall mean copper salts. (c) The term copper shall mean the total copper present in the process wastewater stream exiting the wastewater treatment system...

40 CFR 421.56 - Pretreatment standards for new sources.

Code of Federal Regulations, 2010 CFR

2010-07-01

... GUIDELINES AND STANDARDS NONFERROUS METALS MANUFACTURING POINT SOURCE CATEGORY Primary Electrolytic Copper.... The mass of wastewater pollutants in primary electrolytic copper refining process wastewater... pounds) of copper cast Arsenic .692 .309 Copper .638 .304 Nickel .274 .184 (b) Subpart E—Anode and...

40 CFR 415.361 - Specialized definitions.

Code of Federal Regulations, 2010 CFR

2010-07-01

... AND STANDARDS INORGANIC CHEMICALS MANUFACTURING POINT SOURCE CATEGORY Copper Salts Production... shall apply to this subpart. (b) The term product shall mean copper salts. (c) The term copper shall mean the total copper present in the process wastewater stream exiting the wastewater treatment system...

Integration of chemical and toxicological tools to assess the bioavailability of copper derived from different copper-based fungicides in soil.

PubMed

Wang, Quan-Ying; Sun, Jing-Yue; Xu, Xing-Jian; Yu, Hong-Wen

2018-06-20

Because the extensive use of Cu-based fungicides, the accumulation of Cu in agricultural soil has been widely reported. However, little information is known about the bioavailability of Cu deriving from different fungicides in soil. This paper investigated both the distribution behaviors of Cu from two commonly used fungicides (Bordeaux mixture and copper oxychloride) during the aging process and the toxicological effects of Cu on earthworms. Copper nitrate was selected as a comparison during the aging process. The distribution process of exogenous Cu into different soil fractions involved an initial rapid retention (the first 8 weeks) and a following slow continuous retention. Moreover, Cu mainly moved from exchangeable and carbonate fractions to Fe-Mn oxides-combined fraction during the aging process. The Elovich model fit well with the available Cu aging process, and the transformation rate was in the order of Cu(NO 3 ) 2 > Bordeaux mixture > copper oxychloride. On the other hand, the biological responses of earthworms showed that catalase activities and malondialdehyde contents of the copper oxychloride treated earthworms were significantly higher than those of Bordeaux mixture treated earthworms. Also, body Cu loads of earthworms from different Cu compounds spiked soils were in the following order: copper oxychloride > Bordeaux mixture. Thus, the bioavailability of Cu from copper oxychloride in soil was significantly higher than that of Bordeaux mixture, and different Cu compounds should be taken into consideration when studying the bioavailability of Cu-based fungicides in the soil. Copyright © 2018 Elsevier Inc. All rights reserved.

Development and manufacture of reactive-transfer-printed CIGS photovoltaic modules

NASA Astrophysics Data System (ADS)

Eldada, Louay; Sang, Baosheng; Lu, Dingyuan; Stanbery, Billy J.

2010-09-01

In recent years, thin-film photovoltaic (PV) companies started realizing their low manufacturing cost potential, and grabbing an increasingly larger market share from multicrystalline silicon companies. Copper Indium Gallium Selenide (CIGS) is the most promising thin-film PV material, having demonstrated the highest energy conversion efficiency in both cells and modules. However, most CIGS manufacturers still face the challenge of delivering a reliable and rapid manufacturing process that can scale effectively and deliver on the promise of this material system. HelioVolt has developed a reactive transfer process for CIGS absorber formation that has the benefits of good compositional control, high-quality CIGS grains, and a fast reaction. The reactive transfer process is a two stage CIGS fabrication method. Precursor films are deposited onto substrates and reusable print plates in the first stage, while in the second stage, the CIGS layer is formed by rapid heating with Se confinement. High quality CIGS films with large grains were produced on a full-scale manufacturing line, and resulted in high-efficiency large-form-factor modules. With 14% cell efficiency and 12% module efficiency, HelioVolt started to commercialize the process on its first production line with 20 MW nameplate capacity.

The molecular dynamic simulation on impact and friction characters of nanofluids with many nanoparticles system

PubMed Central

2011-01-01

Impact and friction model of nanofluid for molecular dynamics simulation was built which consists of two Cu plates and Cu-Ar nanofluid. The Cu-Ar nanofluid model consisted of eight spherical copper nanoparticles with each particle diameter of 4 nm and argon atoms as base liquid. The Lennard-Jones potential function was adopted to deal with the interactions between atoms. Thus motion states and interaction of nanoparticles at different time through impact and friction process could be obtained and friction mechanism of nanofluids could be analyzed. In the friction process, nanoparticles showed motions of rotation and translation, but effected by the interactions of nanoparticles, the rotation of nanoparticles was trapped during the compression process. In this process, agglomeration of nanoparticles was very apparent, with the pressure increasing, the phenomenon became more prominent. The reunited nanoparticles would provide supporting efforts for the whole channel, and in the meantime reduced the contact between two friction surfaces, therefore, strengthened lubrication and decreased friction. In the condition of overlarge positive pressure, the nanoparticles would be crashed and formed particles on atomic level and strayed in base liquid. PMID:21711753

Integrated copper-containing wastewater treatment using xanthate process.

PubMed

Chang, Yi-Kuo; Chang, Juu-En; Lin, Tzong-Tzeng; Hsu, Yu-Ming

2002-09-02

Although, the xanthate process has been shown to be an effective method for heavy metal removal from contaminated water, a heavy metal contaminated residual sludge is produced by the treatment process and the metal-xanthate sludge must be handled in accordance with the Taiwan EPA's waste disposal requirements. This work employed potassium ethyl xanthate (KEX) to remove copper ions from wastewater. The toxicity characteristic leaching procedure (TCLP) and semi-dynamic leaching test (SDLT) were used to determine the leaching potential and stability characteristics of the residual copper xanthate (Cu-EX) complexes. Results from metal removal experiments showed that KEX was suitable for the treatment of copper-containing wastewater over a wide copper concentration range (50, 100, 500, and 1000 mg/l) to the level that meets the Taiwan EPA's effluent regulations (3mg/l). The TCLP results of the residual Cu-EX complexes could meet the current regulations and thus the Cu-EX complexes could be treated as a non-hazardous material. Besides, the results of SDLT indicated that the complexes exhibited an excellent performance for stabilizing metals under acidic conditions, even slight chemical changes of the complexes occurred during extraction. The xanthate process, mixing KEX with copper-bearing solution to form Cu-EX precipitates, offered a comprehensive strategy for solving both copper-containing wastewater problems and subsequent sludge disposal requirements.

Polychlorinated dibenzo-p-dioxin and dibenzofuran and polychlorinated biphenyl emissions from different smelting stages in secondary copper metallurgy.

PubMed

Hu, Jicheng; Zheng, Minghui; Nie, Zhiqiang; Liu, Wenbin; Liu, Guorui; Zhang, Bing; Xiao, Ke

2013-01-01

Secondary copper production has received much attention for its high emissions of polychlorinated dibenzo-p-dioxin and dibenzofuran (PCDD/F) reported in previous studies. These studies focused on the estimation of total PCDD/F and polychlorinated biphenyl (PCB) emissions from secondary copper smelters. However, large variations in PCDD/F and PCB emissions reported in these studies were not analyzed and discussed further. In this study, stack gas samples at different smelting stages (feeding-fusion, oxidation and deoxidization) were collected from four plants to investigate variations in PCDD/F and PCB emissions and characteristics during the secondary copper smelting process. The results indicate that PCDD/F emissions occur mainly at the feeding-fusion stage and these emissions contribute to 54-88% of the total emissions from the secondary copper smelting process. The variation in feed material and operating conditions at different smelting stages leads to the variation in PCDD/F emissions during the secondary copper smelting process. The total PCDD/F and PCB discharge (stack gas emission+fly ash discharge) is consistent with the copper scrap content in the raw material in the secondary copper smelters investigated. On a production basis of 1 ton copper, the total PCDD/F and dl-PCB discharge was 102, 24.8 and 5.88 μg TEQ t(-1) for the three plants that contained 100%, 30% and 0% copper scrap in their raw material feed, respectively. Copyright © 2012 Elsevier Ltd. All rights reserved.

Self-assembled large scale metal alloy grid patterns as flexible transparent conductive layers

NASA Astrophysics Data System (ADS)

Mohl, Melinda; Dombovari, Aron; Vajtai, Robert; Ajayan, Pulickel M.; Kordas, Krisztian

2015-09-01

The development of scalable synthesis techniques for optically transparent, electrically conductive coatings is in great demand due to the constantly increasing market price and limited resources of indium for indium tin oxide (ITO) materials currently applied in most of the optoelectronic devices. This work pioneers the scalable synthesis of transparent conductive films (TCFs) by exploiting the coffee-ring effect deposition coupled with reactive inkjet printing and subsequent chemical copper plating. Here we report two different promising alternatives to replace ITO, palladium-copper (PdCu) grid patterns and silver-copper (AgCu) fish scale like structures printed on flexible poly(ethylene terephthalate) (PET) substrates, achieving sheet resistance values as low as 8.1 and 4.9 Ω/sq, with corresponding optical transmittance of 79% and 65% at 500 nm, respectively. Both films show excellent adhesion and also preserve their structural integrity and good contact with the substrate for severe bending showing less than 4% decrease of conductivity even after 105 cycles. Transparent conductive films for capacitive touch screens and pixels of microscopic resistive electrodes are demonstrated.

Self-assembled large scale metal alloy grid patterns as flexible transparent conductive layers

PubMed Central

Mohl, Melinda; Dombovari, Aron; Vajtai, Robert; Ajayan, Pulickel M.; Kordas, Krisztian

2015-01-01

The development of scalable synthesis techniques for optically transparent, electrically conductive coatings is in great demand due to the constantly increasing market price and limited resources of indium for indium tin oxide (ITO) materials currently applied in most of the optoelectronic devices. This work pioneers the scalable synthesis of transparent conductive films (TCFs) by exploiting the coffee-ring effect deposition coupled with reactive inkjet printing and subsequent chemical copper plating. Here we report two different promising alternatives to replace ITO, palladium-copper (PdCu) grid patterns and silver-copper (AgCu) fish scale like structures printed on flexible poly(ethylene terephthalate) (PET) substrates, achieving sheet resistance values as low as 8.1 and 4.9 Ω/sq, with corresponding optical transmittance of 79% and 65% at 500 nm, respectively. Both films show excellent adhesion and also preserve their structural integrity and good contact with the substrate for severe bending showing less than 4% decrease of conductivity even after 105 cycles. Transparent conductive films for capacitive touch screens and pixels of microscopic resistive electrodes are demonstrated. PMID:26333520

Earth observation taken by the Expedition 11 crew

NASA Image and Video Library

2005-06-25

ISS011-E-09620 (26 June 2005) --- Grasberg Mine, Indonesia is featured in this image photographed by an Expedition 11 crewmember on the International Space Station. Located in the Sudirman Mountains of the Irian Jaya province of Indonesia, the Grasberg complex (also known as the Freeport Mine) is one of the largest gold and copper mining operations in the world. The Sudirman Mountains form the western portion of the Maoke Range that extend across Irian Jaya from west to the east-southeast. According to scientists, these ranges were formed by ongoing collision of the northward-moving Australian and westward-moving Pacific tectonic plates. Intrusion of hot magma into sedimentary rock layers during uplift of the mountains resulted in the formation of copper- and gold-bearing ore bodies. Rich copper ore bodies were discovered in the area in 1936, and the Grasberg gold-bearing ore bodies were discovered in 1988. This image illustrates the approximately 4 kilometers-wide open-pit portion of the mine complex; there are also extensive underground mine workings. Access roads for trucks hauling ore and waste rock are visible along the sides of the pit.

Microstructure, Mechanical and Wear Behaviors of Hot-Pressed Copper-Nickel-Based Materials for Diamond Cutting Tools

NASA Astrophysics Data System (ADS)

Miranda, G.; Ferreira, P.; Buciumeanu, M.; Cabral, A.; Fredel, M.; Silva, F. S.; Henriques, B.

2017-08-01

The current trend to replace cobalt in diamond cutting tools (DCT) for stone cutting has motivated the study of alternative materials for this end. The present study characterizes several copper-nickel-based materials (Cu-Ni; Cu-Ni-10Sn, Cu-Ni-15Sn, Cu-Ni-Sn-2WC and Cu-Ni-Sn-10WC) for using as matrix material for diamond cutting tools for stone. Copper-nickel-based materials were produced by hot pressing, at a temperature of 850 °C during 15 min and under an applied pressure of 50 MPa. The mechanical properties were evaluated though the shear strength and hardness values. The microstructures and fracture surfaces were analyzed by SEM. The wear behavior of all specimens was assessed using a reciprocating ball-on-plate tribometer. The hot pressing produced compacts with good densification. Sn and WC promoted enhanced mechanical properties and wear performance to Cu-Ni alloys. Cu-Ni-10Sn and Cu-Ni-10Sn-2WC displayed the best compromise between mechanical and wear performance.

Colonization of Bacteria on the Surfaces of Cold-Sprayed Copper Coatings Alters Their Electrochemical Behaviors

NASA Astrophysics Data System (ADS)

Suo, Xinkun; Abdoli, Leila; Liu, Yi; Xia, Peng; Yang, Guanjun; Li, Hua

2017-04-01

Copper coatings were fabricated on stainless steel plates by cold spraying. Attachment and colonization of Bacillus sp. on their surfaces in artificial seawater were characterized, and their effects on anticorrosion performances of the coatings were examined. Attached bacteria were observed using field emission scanning electron microscopy. Electrochemical behaviors including potentiodynamic polarization and electrochemical impedance spectroscopy with/without bacterial attachment were evaluated using commercial electrochemical analysis station Modulab. Results show that Bacillus sp. opt to settle on low-lying spots of the coating surfaces in early stage, followed by recruitment and attachment of extracellular polymeric substances (EPS) secreted through metabolism of Bacillus sp. The bacteria survive with the protection of EPS. An attachment model is proposed to illustrate the bacterial behaviors on the surfaces of the coatings. Electrochemical data show that current density under Bacillus sp. environment decreases compared to that without the bacteria. Charge-transfer resistance increases markedly in bacteria-containing seawater, suggesting that corrosion resistance increases and corrosion rate decreases. The influencing mechanism of bacteria settlement on corrosion resistance of the cold-sprayed copper coatings was discussed and elucidated.

Irradiation effects in tungsten-copper laminate composite

DOE PAGES

Garrison, L. M.; Katoh, Yutai; Snead, Lance L.; ...

2016-09-19

Tungsten-copper laminate composite has shown promise as a structural plasma-facing component as compared to tungsten rod or plate. The present study evaluated the tungsten-copper composite after irradiation in the High Flux Isotope Reactor (HFIR) at temperatures of 410–780 °C and fast neutron fluences of 0.02–9.0 × 10 25 n/m 2, E > 0.1 MeV, 0.0039–1.76 displacements per atom (dpa) in tungsten. Tensile tests were performed on the composites, and the fracture surfaces were analyzed with scanning electron microscopy. Before irradiation, the tungsten layers had brittle cleavage failure, but the overall composite had 15.5% elongation at 22 °C. After only 0.0039more » dpa this was reduced to 7.7% elongation, and no ductility was observed after 0.2 dpa at all irradiation temperatures when tensile tested at 22 °C. In conclusion, tor elevated temperature tensile tests after irradiation, the composite only had ductile failure at temperatures where the tungsten was delaminating or ductile.« less

Experimental and numerical investigation of laser shock synchronous welding and forming of Copper/Aluminum

NASA Astrophysics Data System (ADS)

Wang, Xiao; Zhang, Hongfeng; Shen, Zongbao; Li, Jianwen; Qian, Qing; Liu, Huixia

2016-11-01

A novel laser shock synchronous welding and forming method is introduced, which utilizes laser-induced shock waves to accelerate the flyer plate towards the base plate to achieve the joining of dissimilar metals and forming in a specific shape of mold. The samples were obtained with different laser energies and standoff distances. The surface morphology and roughness of the samples were greatly affected by the laser energy and standoff distances. Fittability was investigated to examine the forming accuracy. The results showed that the samples replicate the mold features well. Straight and wavy interfaces with un-bonded regions in the center were observed through metallographic analysis. Moreover, Energy Disperse Spectroscopy analysis was conducted on the welding interface, and the results indicated that a short-distance elemental diffusion emerged in the welding interface. The nanoindentation hardness of the welding regions was measured to evaluate the welding interface. In addition, the Smoothed Particle Hydrodynamics method was employed to simulate the welding and forming process. It was shown that different standoff distances significantly affected the size of the welding regions and interface waveform characteristics. The numerical analysis results indicated that the opposite shear stress direction and effective plastic strain above a certain threshold are essential to successfully obtain welding and forming workpiece.

Assembling, cleaning, and testing a unique prototype open-ended cylindrical penning trap

NASA Astrophysics Data System (ADS)

Marble, Kassie; Shidling, Praveen; Melconian, Dan

2016-09-01

A new experimental beamline containing a prototype cylindrical penning trap has recently been constructed at the Cyclotron Laboratory at Texas A&M University. The new beamline will enable precision experiments that enhance our understanding of the limits on non-SM processes in the weak interaction through the measurement of the β- ν correlation parameter for T = 2 ,0+ ->0+ supper allowed β-delayed proton emitters. The prototype TAMU TRAP consists of an open-ended cylindrical penning trap of diameter of 90 mm with gold-plated electrodes of oxygen free high conductivity copper to prevent oxidation. The trap's electric quadrupole field is provided by a SHIP TRAPS RF electronic circuit to the four segmented electrodes at the center of the trap while the trap's 7 Tesla radial magnetic field is provided by an Agilent 210 ASR magnet. A discussion of the assembly of the prototype TAMU TRAP, construction of the RF electronic circuit, the experimental set up and alignment of the beamline will be presented. The method used to test the prototype penning trap using an ion source, Faraday cups, and Micro Chanel Plate (MCP) detectors will also be discussed. Work supported by the U.S. Department of Energy under Grant No. DE-FG02-11ER41747 and the National Science Foundation.

Strategic Industry Attack.

DTIC Science & Technology

1980-01-15

Code B364078464 V99QAXNH30303 H2590D. IS KEY WORDS fCo.. e.1 Odn Od It -C.eWV WHO Idnlif b 61-k n 0ber) Strategic Targeting Copper Industry INDATAK 20...develop, debug and test an industrial simulation model (INDATAK) using the LOGATAK model as a point of departure. The copper processing industry is...significant processes in the copper industry, including the transportation network connecting the processing elements, have been formatted for use in

Study on the mechanism of copper-ammonia complex decomposition in struvite formation process and enhanced ammonia and copper removal.

PubMed

Peng, Cong; Chai, Liyuan; Tang, Chongjian; Min, Xiaobo; Song, Yuxia; Duan, Chengshan; Yu, Cheng

2017-01-01

Heavy metals and ammonia are difficult to remove from wastewater, as they easily combine into refractory complexes. The struvite formation method (SFM) was applied for the complex decomposition and simultaneous removal of heavy metal and ammonia. The results indicated that ammonia deprivation by SFM was the key factor leading to the decomposition of the copper-ammonia complex ion. Ammonia was separated from solution as crystalline struvite, and the copper mainly co-precipitated as copper hydroxide together with struvite. Hydrogen bonding and electrostatic attraction were considered to be the main surface interactions between struvite and copper hydroxide. Hydrogen bonding was concluded to be the key factor leading to the co-precipitation. In addition, incorporation of copper ions into the struvite crystal also occurred during the treatment process. Copyright © 2016. Published by Elsevier B.V.

Inhibition of human copper trafficking by a small molecule significantly attenuates cancer cell proliferation.

PubMed

Wang, Jing; Luo, Cheng; Shan, Changliang; You, Qiancheng; Lu, Junyan; Elf, Shannon; Zhou, Yu; Wen, Yi; Vinkenborg, Jan L; Fan, Jun; Kang, Heebum; Lin, Ruiting; Han, Dali; Xie, Yuxin; Karpus, Jason; Chen, Shijie; Ouyang, Shisheng; Luan, Chihao; Zhang, Naixia; Ding, Hong; Merkx, Maarten; Liu, Hong; Chen, Jing; Jiang, Hualiang; He, Chuan

2015-12-01

Copper is a transition metal that plays critical roles in many life processes. Controlling the cellular concentration and trafficking of copper offers a route to disrupt these processes. Here we report small molecules that inhibit the human copper-trafficking proteins Atox1 and CCS, and so provide a selective approach to disrupt cellular copper transport. The knockdown of Atox1 and CCS or their inhibition leads to a significantly reduced proliferation of cancer cells, but not of normal cells, as well as to attenuated tumour growth in mouse models. We show that blocking copper trafficking induces cellular oxidative stress and reduces levels of cellular ATP. The reduced level of ATP results in activation of the AMP-activated protein kinase that leads to reduced lipogenesis. Both effects contribute to the inhibition of cancer cell proliferation. Our results establish copper chaperones as new targets for future developments in anticancer therapies.

Inhibition of human copper trafficking by a small molecule significantly attenuates cancer cell proliferation

PubMed Central

Wang, Jing; Luo, Cheng; Shan, Changliang; You, Qiancheng; Lu, Junyan; Elf, Shannon; Zhou, Yu; Wen, Yi; Vinkenborg, Jan L.; Fan, Jun; Kang, Heebum; Lin, Ruiting; Han, Dali; Xie, Yuxin; Karpus, Jason; Chen, Shijie; Ouyang, Shisheng; Luan, Chihao; Zhang, Naixia; Ding, Hong; Merkx, Maarten; Liu, Hong; Chen, Jing; Jiang, Hualiang; He, Chuan

2016-01-01

Copper is a transition metal that plays critical roles in many life processes. Controlling the cellular concentration and trafficking of copper offers a route to disrupt these processes. Here we report small molecules that inhibit the human copper-trafficking proteins Atox1 and CCS, and so provide a selective approach to disrupt cellular copper transport. The knockdown of Atox1 and CCS or their inhibition leads to a significantly reduced proliferation of cancer cells, but not of normal cells, as well as to attenuated tumour growth in mouse models. We show that blocking copper trafficking induces cellular oxidative stress and reduces levels of cellular ATP. The reduced level of ATP results in activation of the AMP-activated protein kinase that leads to reduced lipogenesis. Both effects contribute to the inhibition of cancer cell proliferation. Our results establish copper chaperones as new targets for future developments in anticancer therapies. PMID:26587712

Inhibition of human copper trafficking by a small molecule significantly attenuates cancer cell proliferation

NASA Astrophysics Data System (ADS)

Wang, Jing; Luo, Cheng; Shan, Changliang; You, Qiancheng; Lu, Junyan; Elf, Shannon; Zhou, Yu; Wen, Yi; Vinkenborg, Jan L.; Fan, Jun; Kang, Heebum; Lin, Ruiting; Han, Dali; Xie, Yuxin; Karpus, Jason; Chen, Shijie; Ouyang, Shisheng; Luan, Chihao; Zhang, Naixia; Ding, Hong; Merkx, Maarten; Liu, Hong; Chen, Jing; Jiang, Hualiang; He, Chuan

2015-12-01

Copper is a transition metal that plays critical roles in many life processes. Controlling the cellular concentration and trafficking of copper offers a route to disrupt these processes. Here we report small molecules that inhibit the human copper-trafficking proteins Atox1 and CCS, and so provide a selective approach to disrupt cellular copper transport. The knockdown of Atox1 and CCS or their inhibition leads to a significantly reduced proliferation of cancer cells, but not of normal cells, as well as to attenuated tumour growth in mouse models. We show that blocking copper trafficking induces cellular oxidative stress and reduces levels of cellular ATP. The reduced level of ATP results in activation of the AMP-activated protein kinase that leads to reduced lipogenesis. Both effects contribute to the inhibition of cancer cell proliferation. Our results establish copper chaperones as new targets for future developments in anticancer therapies.

Study of the spatial resolution of low-material GEM tracking detectors

NASA Astrophysics Data System (ADS)

Kudryavtsev, V. N.; Maltsev, T. V.; Shekhtman, L. I.

2018-02-01

The spatial resolution of GEM based tracking detectors has been simulated and measured. The simulation includes the GEANT4 based transport of high energy electrons with careful accounting for atomic relaxation processes including emission of fluorescent photons and Auger electrons and custom post-processing, including accounting for diffusion, gas amplification fluctuations, the distribution of signals on readout electrodes, electronics noise and a particular algorithm of the final coordinate calculation (center of gravity). The simulation demonstrates that a minimum of the spatial resolution of about 10 μm can be achieved with strip pitches from 250 μm to 300 μm. For larger pitches the resolution is quickly degrading reaching 80-100 μm at a pitch of 500 μm. The spatial resolution of low-material triple-GEM detectors for the DEUTRON facility at the VEPP-3 storage ring is measured at the extracted beam facility of the VEPP-4M collider. The amount of material in these detectors is reduced by etching the copper of the GEMs electrodes and using a readout structure on a thin kapton foil rather than on a glass fibre plate. The exact amount of material in one DEUTRON detector is measured by studying multiple scattering of 100 MeV electrons in it. The result of these measurements is X/X0 = 2.4×10-3 corresponding to a thickness of the copper layers of the GEM foils of 3 μm. The spatial resolution of one DEUTRON detector is measured with 500 MeV electrons and the measured value is equal to 35 ± 1 μm for orthogonal tracks.

Criteria for approximating certain microgravity flow boiling characteristics in Earth gravity.

PubMed

Merte, Herman; Park, Jaeseok; Shultz, William W; Keller, Robert B

2002-10-01

The forces governing flow boiling, aside from system pressure, are buoyancy, liquid momentum, interfacial surface tensions, and liquid viscosity. Guidance for approximating certain aspects of the flow boiling process in microgravity can be obtained in Earth gravity research by the imposition of a liquid velocity parallel to a flat heater surface in the inverted position, horizontal, or nearly horizontal, by having buoyancy hold the heated liquid and vapor formed close to the heater surface. Bounds on the velocities of interest are obtained from several dimensionless numbers: a two-phase Richardson number, a two-phase Weber number, and a Bond number. For the fluid used in the experimental work here, liquid velocities in the range U = 5-10cm/sec are judged to be critical for changes in behavior of the flow boiling process. Experimental results are presented for flow boiling heat transfer, concentrating on orientations that provide the largest reductions in buoyancy parallel to the heater surface, varying +/-5 degrees from facing horizontal downward. Results are presented for velocity, orientation, and subcooling effects on nucleation, dryout, and heat transfer. Two different heater surfaces were used: a thin gold film on a polished quartz substrate, acting as a heater and resistance thermometer, and a gold-plated copper heater. Both transient and steady measurements of surface heat flux and superheat were made with the quartz heater; only steady measurements were possible with the copper heater. R-113 was the fluid used; the velocity varied over the interval 4-16cm/sec; bulk liquid subcooling varied over 2-20 degrees C; heat flux varied over 4-8W/cm(2).

A Focus on Cryogenic Engineering for the Primordial Inflation Polarization Explorer (PIPER) Mission

NASA Technical Reports Server (NTRS)

Rosas, Rogelio; Weston, Amy

2011-01-01

Cryogenic engineering involves design and modification of equipment that is used under boiling point of nitrogen which is 77 K. The focus of this paper will be on the design of hardware for cryogenic use and a retrofit that was done to the main laboratory cryostat used to test flight components for the Primordial Inflation Polarization Explorer balloon-borne mission. Data from prior tests showed that there was a superfluid helium leak and a total disassemble of the cryostat was conducted in order to localize and fix the leak. To improve efficiency new fill tubes and clamps with modifications were added to the helium tank. Upon removal of the tank, corrosion was found on the flange face that connects to the helium cold plate and therefore had to be fully replaced and copper plated to prevent future corrosion. Indium seals were also replaced for the four fill tubes, a helium level sensor, and the nitrogen and helium tanks. Four additional shielded twisted pairs of cryogenic wire and a wire harness for the Superconducting Quantum Interference Devices (SQUIDs) were added. Finally, there was also design work done for multiple pieces that went inside the cryostat and a separate probe used to test the SQUIDs. Upon successful completion of the cryostat upgrade, tests were run to check the effectiveness and stability of the upgrades. The post-retrofit tests showed minor leaks were still present and due to this, superfluidity has still not been attained. As such there could still be a possibility of a superfluid leak appearing in the future. Regardless, the copper plating on the helium tank has elongated the need to service it by three to five years.

Arsenic exposure levels in relation to different working departments in a copper mining and smelting plant

NASA Astrophysics Data System (ADS)

Sun, Qingshan; Song, Yingli; Liu, Shengnan; Wang, Fei; Zhang, Lin; Xi, Shuhua; Sun, Guifan

2015-10-01

The investigation was carried out to evaluate arsenic exposure and the urine metabolite profiles of workers with different working departments, including administration (Group1), copper ore mining (Group2), copper ore grinding (Group3), electrolytic procession (Group4) and copper smelting (Group5) in a Copper mining and processing plant in China. Information about characteristics of each subject was obtained by questionnaire and inorganic arsenic (iAs), monomethylarsonic acid (MMA), dimethylarsinic acid (DMA) in urine were determined. The highest urinary levels of iAs, MMA and DMA all were found in the Group 5. Group 4 workers had a higher iAs% and a lower PMI compared to Group 3. The urinary total As (TAs) levels of 54.7% subjects exceeded 50 μg/g Cr, and the highest percentage (93.3%) was found in Group 5, smelters. The results of the present study indicate that workers in copper production plant indeed exposed to As, especially for smelters and workers of electrolytic process.

Urinary Copper Elevation in a Mouse Model of Wilson's Disease Is a Regulated Process to Specifically Decrease the Hepatic Copper Load

PubMed Central

Gray, Lawrence W.; Peng, Fangyu; Molloy, Shannon A.; Pendyala, Venkata S.; Muchenditsi, Abigael; Muzik, Otto; Lee, Jaekwon; Kaplan, Jack H.; Lutsenko, Svetlana

2012-01-01

Body copper homeostasis is regulated by the liver, which removes excess copper via bile. In Wilson's disease (WD), this function is disrupted due to inactivation of the copper transporter ATP7B resulting in hepatic copper overload. High urinary copper is a diagnostic feature of WD linked to liver malfunction; the mechanism behind urinary copper elevation is not fully understood. Using Positron Emission Tomography-Computed Tomography (PET-CT) imaging of live Atp7b−/− mice at different stages of disease, a longitudinal metal analysis, and characterization of copper-binding molecules, we show that urinary copper elevation is a specific regulatory process mediated by distinct molecules. PET-CT and atomic absorption spectroscopy directly demonstrate an age-dependent decrease in the capacity of Atp7b−/− livers to accumulate copper, concomitant with an increase in urinary copper. This reciprocal relationship is specific for copper, indicating that cell necrosis is not the primary cause for the initial phase of metal elevation in the urine. Instead, the urinary copper increase is associated with the down-regulation of the copper-transporter Ctr1 in the liver and appearance of a 2 kDa Small Copper Carrier, SCC, in the urine. SCC is also elevated in the urine of the liver-specific Ctr1 −/− knockouts, which have normal ATP7B function, suggesting that SCC is a normal metabolite carrying copper in the serum. In agreement with this hypothesis, partially purified SCC-Cu competes with free copper for uptake by Ctr1. Thus, hepatic down-regulation of Ctr1 allows switching to an SCC-mediated removal of copper via kidney when liver function is impaired. These results demonstrate that the body regulates copper export through more than one mechanism; better understanding of urinary copper excretion may contribute to an improved diagnosis and monitoring of WD. PMID:22802922

Laser cladding of stainless steel with a copper-silver alloy to generate surfaces of high antimicrobial activity

NASA Astrophysics Data System (ADS)

Hans, Michael; Támara, Juan Carlos; Mathews, Salima; Bax, Benjamin; Hegetschweiler, Andreas; Kautenburger, Ralf; Solioz, Marc; Mücklich, Frank

2014-11-01

Copper and silver are used as antimicrobial agents in the healthcare sector in an effort to curb infections caused by bacteria resistant to multiple antibiotics. While the bactericidal potential of copper and silver alone are well documented, not much is known about the antimicrobial properties of copper-silver alloys. This study focuses on the antibacterial activity and material aspects of a copper-silver model alloy with 10 wt% Ag. The alloy was generated as a coating with controlled intermixing of copper and silver on stainless steel by a laser cladding process. The microstructure of the clad was found to be two-phased and in thermal equilibrium with minor Cu2O inclusions. Ion release and killing of Escherichia coli under wet conditions were assessed with the alloy, pure silver, pure copper and stainless steel. It was found that the copper-silver alloy, compared to the pure elements, exhibited enhanced killing of E. coli, which correlated with an up to 28-fold increased release of copper ions. The results show that laser cladding with copper and silver allows the generation of surfaces with enhanced antimicrobial properties. The process is particularly attractive since it can be applied to existing surfaces.

Binding of copper to lysozyme: Spectroscopic, isothermal titration calorimetry and molecular docking studies

NASA Astrophysics Data System (ADS)

Jing, Mingyang; Song, Wei; Liu, Rutao

2016-07-01

Although copper is essential to all living organisms, its potential toxicity to human health have aroused wide concerns. Previous studies have reported copper could alter physical properties of lysozyme. The direct binding of copper with lysozyme might induce the conformational and functional changes of lysozyme and then influence the body's resistance to bacterial attack. To better understand the potential toxicity and toxic mechanisms of copper, the interaction of copper with lysozyme was investigated by biophysical methods including multi-spectroscopic measurements, isothermal titration calorimetry (ITC), molecular docking study and enzyme activity assay. Multi-spectroscopic measurements proved that copper quenched the intrinsic fluorescence of lysozyme in a static process accompanied by complex formation and conformational changes. The ITC results indicated that the binding interaction was a spontaneous process with approximately three thermodynamical binding sites at 298 K and the hydrophobic force is the predominant driven force. The enzyme activity was obviously inhibited by the addition of copper with catalytic residues Glu 35 and Asp 52 locating at the binding sites. This study helps to elucidate the molecular mechanism of the interaction between copper and lysozyme and provides reference for toxicological studies of copper.

Absorption of metals in mulloway (Argyrosomus japonicus) after ingesting nickel-plated carbon-steel hooks.

PubMed

McGrath, Shane P; Reichelt-Brushett, Amanda J; Butcher, Paul A; Cairns, Stuart C

2014-08-01

Previous research has alluded to the potential of metals being absorbed by fish after ingesting fishing hooks, which may have adverse effects on fish health and the organisms that consume them. Subsequently, this study aimed to quantify the potential of mulloway (Argyrosomus japonicus) to absorb metals during the decay of ingested nickel-plated carbon-steel hooks. Twenty-five treatment fish were allowed to ingest nickel-plated carbon-steel hooks during angling and then monitored with 25 controls (untreated fish) for up to 42 days for hook ejection and mortality. Blood, liver and muscle samples were collected from treatment, control and 14 wild-caught individuals to determine the concentrations of chromium, cobalt, copper, iron, manganese and nickel. The results showed that increased oxidation influenced hook ejection, and that hook-ingested fish had significantly elevated concentrations of nickel in their liver and blood, but not muscle. This research has shown that there is an avenue for metal absorption from ingested hooks. Copyright © 2014 Elsevier Ltd. All rights reserved.

Self-organization Effects on Tribosystems when Lubricated with a Metal-plating Additive „Valena”

NASA Astrophysics Data System (ADS)

Kandeva, M.; Karastoyanov, D.; Grozdanova, T.; Kalichin, Zh.; Balabanov, V.; Chikurtev, D.

2018-01-01

The external appearance of self-organization is very low friction and wear, and in some cases there is lack of wear, so a friction effect without wear is observed. In the present study are examined tribosystems of different materials - steel, spheroidal graphite cast iron micro alloyed with 0.051% of tin, bronze and other materials under conditions of border lubrication with grease “Litol 24” with a metal-plated additive “Valena”. A unique multifunctional tribotester has been developed that allows varying load and slide speed across wide ranges and research different types of contact - point, ring, plane. Studies have been carried out on different friction modes and results have been obtained for friction coefficient and the parameters of wear of the specimens and the counter body depend of the friction times. Conditions have been established to produce a No-wear effect due to the formation of a metal-plated copper film on the surfaces of the body and the counter body.