Sample records for copper wire bonding

  1. Body of Knowledge (BOK) for Copper Wire Bonds

    NASA Technical Reports Server (NTRS)

    Rutkowski, E.; Sampson, M. J.

    2015-01-01

    Copper wire bonds have replaced gold wire bonds in the majority of commercial semiconductor devices for the latest technology nodes. Although economics has been the driving mechanism to lower semiconductor packaging costs for a savings of about 20% by replacing gold wire bonds with copper, copper also has materials property advantages over gold. When compared to gold, copper has approximately: 25% lower electrical resistivity, 30% higher thermal conductivity, 75% higher tensile strength and 45% higher modulus of elasticity. Copper wire bonds on aluminum bond pads are also more mechanically robust over time and elevated temperature due to the slower intermetallic formation rate - approximately 1/100th that of the gold to aluminum intermetallic formation rate. However, there are significant tradeoffs with copper wire bonding - copper has twice the hardness of gold which results in a narrower bonding manufacturing process window and requires that the semiconductor companies design more mechanically rigid bonding pads to prevent cratering to both the bond pad and underlying chip structure. Furthermore, copper is significantly more prone to corrosion issues. The semiconductor packaging industry has responded to this corrosion concern by creating a palladium coated copper bonding wire, which is more corrosion resistant than pure copper bonding wire. Also, the selection of the device molding compound is critical because use of environmentally friendly green compounds can result in internal CTE (Coefficient of Thermal Expansion) mismatches with the copper wire bonds that can eventually lead to device failures during thermal cycling. Despite the difficult problems associated with the changeover to copper bonding wire, there are billions of copper wire bonded devices delivered annually to customers. It is noteworthy that Texas Instruments announced in October of 2014 that they are shipping microcircuits containing copper wire bonds for safety critical automotive applications. An evaluation of copper wire bond technology for applicability to spaceflight hardware may be warranted along with concurrently compiling a comprehensive understanding of the failure mechanisms involved with copper wire bonded semiconductor devices.

  2. Aluminum-Scandium: A Material for Semiconductor Packaging

    NASA Astrophysics Data System (ADS)

    Geissler, Ute; Thomas, Sven; Schneider-Ramelow, Martin; Mukhopadhyay, Biswajit; Lang, Klaus-Dieter

    2016-10-01

    A well-known aluminum-scandium (Al-Sc) alloy, already used in lightweight sports equipment, is about to be established for use in electronic packaging. One application for Al-Sc alloy is manufacture of bonding wires. The special feature of the alloy is its ability to harden by precipitation. The new bonding wires with electrical conductivity similar to pure Al wires can be processed on common wire bonders for aluminum wedge/wedge (w/w) bonding. The wires exhibit very fine-grained microstructure. Small Al3Sc particles are the main reason for its high strength and prevent recrystallization and grain growth at higher temperatures (>150°C). After the wire-bonding process, the interface is well closed. Reliability investigations by active power cycling demonstrated considerably improved lifetime compared with pure Al heavy wires. Furthermore, the Al-Sc alloy was sputter-deposited onto silicon wafer to test it as chip metallization in copper (Cu) ball/wedge bonding technology. After deposition, the layers exhibited fine-grained columnar structure and small coherent Al3Sc particles with dimensions of a few nanometers. These particles inhibit softening processes such as Al splashing in fine wire bonding processes and increase the thickness of remnant Al under the copper balls to 85% of the initial thickness.

  3. Attaching Copper Wires to Magnetic-Reed-Switch Leads

    NASA Technical Reports Server (NTRS)

    Kamila, Rudolf

    1987-01-01

    Bonding method reliably joins copper wires to short iron-alloy leads from glass-encased dry magnetic-reed switch without disturbing integrity of glass-to-metal seal. Joint resistant to high temperatures and has low electrical resistance.

  4. The role of oxide structure on copper wire to the rubber adhesion

    NASA Astrophysics Data System (ADS)

    Su, Yea-Yang; Shemenski, Robert M.

    2000-07-01

    Most metals have an oxide layer on the surface. However, the structure of the oxide varies with the matrix composition, and depends upon the environmental conditions. A bronze coating, nominal composition of 98.5% Cu and balance of Sn, is applied to steel wire for reinforcing pneumatic tire beads and to provide adhesion to rubber. This work studied the influence of copper oxides on the bronze coating on adhesion during vulcanization. To emphasize the oxide structures, electrolytic tough pitch (ETP) copper wire was used instead of the traditional bronze-coated tire bead wire. Experimental results confirmed the hypothesis that cuprous oxide (Cu 2O) could significantly improve bonding between copper wire and rubber, and demonstrated that the interaction between rubber and oxide layer on wire is an electrochemical reaction.

  5. Reliability Criteria for Thick Bonding Wire.

    PubMed

    Dagdelen, Turker; Abdel-Rahman, Eihab; Yavuz, Mustafa

    2018-04-17

    Bonding wire is one of the main interconnection techniques. Thick bonding wire is widely used in power modules and other high power applications. This study examined the case for extending the use of traditional thin wire reliability criteria, namely wire flexure and aspect ratio, to thick wires. Eleven aluminum (Al) and aluminum coated copper (CucorAl) wire samples with diameter 300 μm were tested experimentally. The wire response was measured using a novel non-contact method. High fidelity FEM models of the wire were developed and validated. We found that wire flexure is not correlated to its stress state or fatigue life. On the other hand, aspect ratio is a consistent criterion of thick wire fatigue life. Increasing the wire aspect ratio lowers its critical stress and increases its fatigue life. Moreover, we found that CucorAl wire has superior performance and longer fatigue life than Al wire.

  6. Reliability Criteria for Thick Bonding Wire

    PubMed Central

    Yavuz, Mustafa

    2018-01-01

    Bonding wire is one of the main interconnection techniques. Thick bonding wire is widely used in power modules and other high power applications. This study examined the case for extending the use of traditional thin wire reliability criteria, namely wire flexure and aspect ratio, to thick wires. Eleven aluminum (Al) and aluminum coated copper (CucorAl) wire samples with diameter 300 μm were tested experimentally. The wire response was measured using a novel non-contact method. High fidelity FEM models of the wire were developed and validated. We found that wire flexure is not correlated to its stress state or fatigue life. On the other hand, aspect ratio is a consistent criterion of thick wire fatigue life. Increasing the wire aspect ratio lowers its critical stress and increases its fatigue life. Moreover, we found that CucorAl wire has superior performance and longer fatigue life than Al wire. PMID:29673194

  7. Reliability of copper wire bonds on a novel over-pad metallization

    NASA Astrophysics Data System (ADS)

    Kawashiro, Fumiyoshi; Itoh, Satoshi; Maeda, Takehiko; Hirose, Tetsuya; Yajima, Akira; Etoh, Takaki; Nishikawa, Hiroshi

    2015-05-01

    Wire bonding technology is used in most semiconductor products. Recently, high gold prices have forced semiconductor manufacturers to replace Au wires with Cu wires. Because Cu wire bonds are vulnerable to high temperature and humidity, they remain unpopular in automotive and industrial applications with narrow-bond-pad pitches and small deformed ball diameters. To avoid forming the corrosive Cu-rich intermetallic compound Cu9Al4, the use of a Ni/Pd(/Au) over-pad metallization (OPM) structure produced by electroless plating on the Al metallization has been proposed. However, certain technical issues must be overcome, such as variations in the purity and thickness of the plating. To tackle these issues, a novel OPM structure produced by physical vapor deposition is proposed and evaluated in this study.

  8. Splicing Wires Permanently With Explosives

    NASA Technical Reports Server (NTRS)

    Bement, Laurence J.; Kushnick, Anne C.

    1990-01-01

    Explosive joining process developed to splice wires by enclosing and metallurgically bonding wires within copper sheets. Joints exhibit many desirable characteristics, 100-percent conductivity and strength, no heat-induced annealing, no susceptibility to corrosion in contacts between dissimilar metals, and stability at high temperature. Used to join wires to terminals, as well as to splice wires. Applicable to telecommunications industry, in which millions of small wires spliced annually.

  9. Improvisation of mechanical and electrical properties of Cu by reinforcing MWCNT using modified electro-co-deposition process

    NASA Astrophysics Data System (ADS)

    Belgamwar, Sachin U.; Sharma, N. N.

    2018-04-01

    Multi-walled Carbon nanotubes–copper (MWCNT/Cu) composite powders with variable MWCNT content were synthesized by modified electro-co-deposition method. The electro-co-deposited MWCNT/Cu powders were consolidated by conventional compaction and sintering process. The consolidated products were then hot rolled and cold drawn to fine wires. The MWCNT/Cu composite wire samples were characterized for electrical and mechanical properties. We have been able to achieve an increase of around 8% in electrical conductivity of the form wires repeatedly. It has been observed that there was gradual improvement in the properties with reinforcement of MWCNT in the copper matrix. The betterment of electrical property has been achieved with simultaneous improvement in mechanical properties of the wire. The yield strength of MWCNT/Cu composite wire was found to be four times and the tensile strength two times greater than that of pure copper. The improved properties are attributed to the proper distribution of MWCNTs in the copper matrix and excellent interfacial bonding between MWCNT and composite copper fabricated by the modified method.

  10. The fabrication of a double-layer atom chip with through silicon vias for an ultra-high-vacuum cell

    NASA Astrophysics Data System (ADS)

    Chuang, Ho-Chiao; Lin, Yun-Siang; Lin, Yu-Hsin; Huang, Chi-Sheng

    2014-04-01

    This study presents a double-layer atom chip that provides users with increased diversity in the design of the wire patterns and flexibility in the design of the magnetic field. It is more convenient for use in atomic physics experiments. A negative photoresist, SU-8, was used as the insulating layer between the upper and bottom copper wires. The electrical measurement results show that the upper and bottom wires with a width of 100 µm can sustain a 6 A current without burnout. Another focus of this study is the double-layer atom chips integrated with the through silicon via (TSV) technique, and anodically bonded to a Pyrex glass cell, which makes it a desired vacuum chamber for atomic physics experiments. Thus, the bonded glass cell not only significantly reduces the overall size of the ultra-high-vacuum (UHV) chamber but also conducts the high current from the backside to the front side of the atom chip via the TSV under UHV (9.5 × 10-10 Torr). The TSVs with a diameter of 70 µm were etched through by the inductively coupled plasma ion etching and filled by the bottom-up copper electroplating method. During the anodic bonding process, the electroplated copper wires and TSVs on atom chips also need to pass the examination of the required bonding temperature of 250 °C, under an applied voltage of 1000 V. Finally, the UHV test of the double-layer atom chips with TSVs at room temperature can be reached at 9.5 × 10-10 Torr, thus satisfying the requirements of atomic physics experiments under an UHV environment.

  11. Design of a Smart Ultrasonic Transducer for Interconnecting Machine Applications

    PubMed Central

    Yan, Tian-Hong; Wang, Wei; Chen, Xue-Dong; Li, Qing; Xu, Chang

    2009-01-01

    A high-frequency ultrasonic transducer for copper or gold wire bonding has been designed, analyzed, prototyped and tested. Modeling techniques were used in the design phase and a practical design procedure was established and used. The transducer was decomposed into its elementary components. For each component, an initial design was obtained with simulations using a finite elements model (FEM). Simulated ultrasonic modules were built and characterized experimentally through the Laser Doppler Vibrometer (LDV) and electrical resonance spectra. Compared with experimental data, the FEM could be iteratively adjusted and updated. Having achieved a remarkably highly-predictive FEM of the whole transducer, the design parameters could be tuned for the desired applications, then the transducer is fixed on the wire bonder with a complete holder clamping was calculated by the FEM. The approach to mount ultrasonic transducers on wire bonding machines also is of major importance for wire bonding in modern electronic packaging. The presented method can lead to obtaining a nearly complete decoupling clamper design of the transducer to the wire bonder. PMID:22408564

  12. Disulphide linkage: To get cleaved or not? Bulk and nano copper based SERS of cystine

    NASA Astrophysics Data System (ADS)

    P. J., Arathi; Seemesh, Bhaskar; Rajendra Kumar Reddy, G.; Suresh Kumar, P.; Ramanathan, V.

    2018-05-01

    Different nano-structures of noble metals have been the conventional substrates for carrying out Surface Enhanced Raman Spectroscopy (SERS). In this paper we examine electrodeposited copper (Cu) nano-structures on pencil graphite as novel substrate to carry out SERS measurements by considering L-cystine (Cys-Cys) (dimer of the amino acid cysteine) as the probe. The formation of monolayer of the probe molecule on the substrates was confirmed using cyclic voltammetric measurements. Mode of adsorption of Cys-Cys was observed to be different on bulk Cu (taken in the wire form) and nano-structured Cu on pencil graphite. Whereas in the former the disulphide bond of Cys-Cys remained intact, it got cleaved when Cys-Cys was adsorbed on electrodeposited copper indicating the activated nature of the nano-structure compared to bulk copper. Csbnd S stretching mode of vibration underwent blue shift in Cys-Cys adsorbed on Cu on pencil graphite vis-à-vis Cys-Cys adsorbed on Cu wire. Further evidence on the cleavage of the Csbnd S bond on an activated substrate was obtained by considering a bimetallic substrate comprising of silver on copper which was electrodeposited on pencil graphite. Our studies have demonstrated that nano-copper surface is an excellent substrate for SERS giving 200 μM as lower detection limit for Cys-Cys.

  13. Flexible Bond Wire Capacitive Strain Sensor for Vehicle Tyres.

    PubMed

    Cao, Siyang; Pyatt, Simon; Anthony, Carl J; Kubba, Ammar I; Kubba, Ali E; Olatunbosun, Oluremi

    2016-06-21

    The safety of the driving experience and manoeuvrability of a vehicle can be improved by detecting the strain in tyres. To measure strain accurately in rubber, the strain sensor needs to be flexible so that it does not deform the medium that it is measuring. In this work, a novel flexible bond wire capacitive strain sensor for measuring the strain in tyres is developed, fabricated and calibrated. An array of 25 micron diameter wire bonds in an approximately 8 mm × 8 mm area is built to create an interdigitated structure, which consists of 50 wire loops resulting in 49 capacitor pairs in parallel. Laser machining was used to pattern copper on a flexible printed circuit board PCB to make the bond pads for the wire attachment. The wire array was finally packaged and embedded in polydimethylsiloxane (PDMS), which acts as the structural material that is strained. The capacitance of the device is in a linear like relationship with respect to the strain, which can measure the strain up to at least ±60,000 micro-strain (±6%) with a resolution of ~132 micro-strain (0.013%). In-tyre testing under static loading has shown the ability of the sensor to measure large tyre strains. The technology used for sensor fabrication lends itself to mass production and so the design is considered to be consistent with low cost commercialisable strain sensing technology.

  14. Flexible Bond Wire Capacitive Strain Sensor for Vehicle Tyres

    PubMed Central

    Cao, Siyang; Pyatt, Simon; Anthony, Carl J.; Kubba, Ammar I.; Kubba, Ali E.; Olatunbosun, Oluremi

    2016-01-01

    The safety of the driving experience and manoeuvrability of a vehicle can be improved by detecting the strain in tyres. To measure strain accurately in rubber, the strain sensor needs to be flexible so that it does not deform the medium that it is measuring. In this work, a novel flexible bond wire capacitive strain sensor for measuring the strain in tyres is developed, fabricated and calibrated. An array of 25 micron diameter wire bonds in an approximately 8 mm × 8 mm area is built to create an interdigitated structure, which consists of 50 wire loops resulting in 49 capacitor pairs in parallel. Laser machining was used to pattern copper on a flexible printed circuit board PCB to make the bond pads for the wire attachment. The wire array was finally packaged and embedded in polydimethylsiloxane (PDMS), which acts as the structural material that is strained. The capacitance of the device is in a linear like relationship with respect to the strain, which can measure the strain up to at least ±60,000 micro-strain (±6%) with a resolution of ~132 micro-strain (0.013%). In-tyre testing under static loading has shown the ability of the sensor to measure large tyre strains. The technology used for sensor fabrication lends itself to mass production and so the design is considered to be consistent with low cost commercialisable strain sensing technology. PMID:27338402

  15. Nylon screws make inexpensive coil forms

    NASA Technical Reports Server (NTRS)

    Aucoin, G.; Rosenthal, C.

    1978-01-01

    Standard nylon screws act as coil form copper wire laid down in spiral thread. Completed coil may be bonded to printed-circuit board. However, it is impossible to tune coil by adjusting spacing between windings, technique sometimes used with air-core coils.

  16. Large scale generation of micro-droplet array by vapor condensation on mesh screen piece

    PubMed Central

    Xie, Jian; Xu, Jinliang; He, Xiaotian; Liu, Qi

    2017-01-01

    We developed a novel micro-droplet array system, which is based on the distinct three dimensional mesh screen structure and sintering and oxidation induced thermal-fluid performance. Mesh screen was sintered on a copper substrate by bonding the two components. Non-uniform residue stress is generated along weft wires, with larger stress on weft wire top location than elsewhere. Oxidation of the sintered package forms micro pits with few nanograsses on weft wire top location, due to the stress corrosion mechanism. Nanograsses grow elsewhere to show hydrophobic behavior. Thus, surface-energy-gradient weft wires are formed. Cooling the structure in a wet air environment nucleates water droplets on weft wire top location, which is more “hydrophilic” than elsewhere. Droplet size is well controlled by substrate temperature, air humidity and cooling time. Because warp wires do not contact copper substrate and there is a larger conductive thermal resistance between warp wire and weft wire, warp wires contribute less to condensation but function as supporting structure. The surface energy analysis of drops along weft wires explains why droplet array can be generated on the mesh screen piece. Because the commercial material is used, the droplet system is cost effective and can be used for large scale utilization. PMID:28054635

  17. Large scale generation of micro-droplet array by vapor condensation on mesh screen piece.

    PubMed

    Xie, Jian; Xu, Jinliang; He, Xiaotian; Liu, Qi

    2017-01-05

    We developed a novel micro-droplet array system, which is based on the distinct three dimensional mesh screen structure and sintering and oxidation induced thermal-fluid performance. Mesh screen was sintered on a copper substrate by bonding the two components. Non-uniform residue stress is generated along weft wires, with larger stress on weft wire top location than elsewhere. Oxidation of the sintered package forms micro pits with few nanograsses on weft wire top location, due to the stress corrosion mechanism. Nanograsses grow elsewhere to show hydrophobic behavior. Thus, surface-energy-gradient weft wires are formed. Cooling the structure in a wet air environment nucleates water droplets on weft wire top location, which is more "hydrophilic" than elsewhere. Droplet size is well controlled by substrate temperature, air humidity and cooling time. Because warp wires do not contact copper substrate and there is a larger conductive thermal resistance between warp wire and weft wire, warp wires contribute less to condensation but function as supporting structure. The surface energy analysis of drops along weft wires explains why droplet array can be generated on the mesh screen piece. Because the commercial material is used, the droplet system is cost effective and can be used for large scale utilization.

  18. Large scale generation of micro-droplet array by vapor condensation on mesh screen piece

    NASA Astrophysics Data System (ADS)

    Xie, Jian; Xu, Jinliang; He, Xiaotian; Liu, Qi

    2017-01-01

    We developed a novel micro-droplet array system, which is based on the distinct three dimensional mesh screen structure and sintering and oxidation induced thermal-fluid performance. Mesh screen was sintered on a copper substrate by bonding the two components. Non-uniform residue stress is generated along weft wires, with larger stress on weft wire top location than elsewhere. Oxidation of the sintered package forms micro pits with few nanograsses on weft wire top location, due to the stress corrosion mechanism. Nanograsses grow elsewhere to show hydrophobic behavior. Thus, surface-energy-gradient weft wires are formed. Cooling the structure in a wet air environment nucleates water droplets on weft wire top location, which is more “hydrophilic” than elsewhere. Droplet size is well controlled by substrate temperature, air humidity and cooling time. Because warp wires do not contact copper substrate and there is a larger conductive thermal resistance between warp wire and weft wire, warp wires contribute less to condensation but function as supporting structure. The surface energy analysis of drops along weft wires explains why droplet array can be generated on the mesh screen piece. Because the commercial material is used, the droplet system is cost effective and can be used for large scale utilization.

  19. Investigation of current transfer in built-up superconductors

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Miller, J.R.; Dresner, L.; Lue, J.W.

    1977-01-01

    Superconductors carrying 10 kA or more have been widely suggested for use in fusion research and reactor magnets. Built-up or cable conductors have been proposed in which superconductor is concentrated in part of the conductor or part of the strands while the stabilizer occupies the rest. This scheme leads to substantial saving in manufacturing cost and to reduction of ac losses. Simplified analysis indicates that the current transfer from superconducting wire to normal wire takes place over a characteristic length depending on the resistivity of the contact barrier, the resistivity of the stabilizer, and the geometry of the conductor. Furthermore,more » the cold-end recovery suffers a reduction. Two types of conductors were constructed for the experimental test. Triplex conductors consisting of either three superconducting wires or two superconducting plus one copper wire were used to simulate cables. Laminated superconductor and copper strips with different soldering bonds were used for build-ups. Normal zone propagation and recovery experiments have been performed and results are compared with the theory.« less

  20. Interconnect mechanisms in microelectronic packaging

    NASA Astrophysics Data System (ADS)

    Roma, Maria Penafrancia C.

    Global economic, environmental and market developments caused major impact in the microelectronics industry. Astronomical rise of gold metal prices over the last decade shifted the use of copper and silver alloys as bonding wires. Environmental legislation on the restriction of the use of Pb launched worldwide search for lead-free solders and platings. Finally, electrical and digital uses demanded smaller, faster and cheaper devices. Ultra-fine pitch bonding, decreasing bond wire sizes and hard to bond substrates have put the once-robust stitch bond in the center of reliability issues due to stitch bond lift or open wires .Unlike the ball bond, stitch bonding does not lead to intermetallic compound formation but adhesion is dependent on mechanical deformation, interdiffusion, solid solution formation, void formation and mechanical interlocking depending on the wire material, bond configuration, substrate type , thickness and surface condition. Using Au standoff stitch bonds on NiPdAu plated substrates eliminated stitch bond lift even when the Au and Pd layers are reduced. Using the Matano-Boltzmann analysis on a STEM (Scanning Transmission Analysis) concentration profile the interdiffusion coefficient is measured to be 10-16 cm 2/s. Wire pull strength data showed that the wire pull strength is 0.062N and increases upon stress testing. Meanwhile, coating the Cu wire with Pd, not only increases oxidation resistance but also improved adhesion due to the formation of a unique interfacial adhesion layers. Adhesion strength as measured by pull showed the Cu wire bonded to Ag plated Cu substrate (0.132N) to be stronger than the Au wire bonded on the same substrate (0.124N). Ag stitch bonded to Au is predicted to be strong but surface modification made the adhesion stronger. However, on the Ag ball bonded to Al showed multiple IMC formation with unique morphology exposed by ion milling and backscattered scanning electron microscopy. Adding alloying elements in the Ag wire alloy showed differences in adhesion strength and IMC formation. Bond strength by wire pull testing showed the 95Ag alloy with higher values while shear bond testing showed the 88Ag higher bond strength. Use of Cu pillars in flip chips and eutectic bonding in wafer level chip scale packages are direct consequences of diminishing interconnect dimension as a result of the drive for miniaturization. The combination of Cu-Sn interdiffusion, Kirkendall mechanism and heterogeneous vacancy precipitation are the main causes of IMC and void formation in Cu pillar - Sn solder - Cu lead frame sandwich structure. However, adding a Ni barrier agent showed less porous IMC layer as well as void formation as a result of the modified Cu and Sn movement well as the void formation. Direct die to die bonding using Al-Ge eutectic bonds is necessary when 3D integration is needed to reduce the footprint of a package. Hermeticity and adhesion strength are a function of the Al/Ge thickness ratio, bonding pressure, temperature and time. Scanning Electron Microscope (SEM) and Focused Ion Beam (FIB) allowed imaging of interfacial microstructures, porosity, grain morphology while Scanning Transmission Electron microscope (STEM) provided diffusion profile and confirmed interdiffusion. Ion polishing technique provided information on porosity and when imaged using backscattered mode, grain structure confirmed mechanical deformation of the bonds. Measurements of the interfacial bond strength are made by wire pull tests and ball shear tests based on existing industry standard tests. However, for the Al-Ge eutectic bonds, no standard strength is available so a test is developed using the stud pull test method using the Dage 4000 Plus to yield consistent results. Adhesion strengths of 30-40 MPa are found for eutectic bonded packages however, as low as 20MPa was measured in low temperature bonded areas.

  1. Self-generated Local Heating Induced Nanojoining for Room Temperature Pressureless Flexible Electronic Packaging

    PubMed Central

    Peng, Peng; Hu, Anming; Gerlich, Adrian P.; Liu, Yangai; Zhou, Y. Norman

    2015-01-01

    Metallic bonding at an interface is determined by the application of heat and/or pressure. The means by which these are applied are the most critical for joining nanoscale structures. The present study considers the feasibility of room-temperature pressureless joining of copper wires using water-based silver nanowire paste. A novel mechanism of self-generated local heating within the silver nanowire paste and copper substrate system promotes the joining of silver-to-silver and silver-to-copper without any external energy input. The localized heat energy was delivered in-situ to the interfaces to promote atomic diffusion and metallic bond formation with the bulk component temperature stays near room-temperature. This local heating effect has been detected experimentally and confirmed by calculation. The joints formed at room-temperature without pressure achieve a tensile strength of 5.7 MPa and exhibit ultra-low resistivity in the range of 101.3 nOhm·m. The good conductivity of the joint is attributed to the removal of organic compounds in the paste and metallic bonding of silver-to-copper and silver-to-silver. The water-based silver nanowire paste filler material is successfully applied to various flexible substrates for room temperature bonding. The use of chemically generated local heating may become a potential method for energy in-situ delivery at micro/nanoscale. PMID:25788019

  2. An Alternative Cu-Based Bond Layer for Electric Arc Coating Process

    NASA Astrophysics Data System (ADS)

    Fadragas, Carlos R.; Morales, E. V.; Muñoz, J. A.; Bott, I. S.; Lariot Sánchez, C. A.

    2011-12-01

    A Cu-Al alloy has been used as bond coat between a carbon steel substrate and a final coating deposit obtained by applying the twin wire electric arc spraying coating technique. The presence of a copper-based material in the composite system can change the overall temperature profile during deposition because copper exhibits a thermal conductivity several times higher than that of the normally recommended bond coat materials (such as nickel-aluminum alloys or nickel-chromium alloys). The microstructures of 420 and 304 stainless steels deposited by the electric arc spray process have been investigated, focusing attention on the deposit homogeneity, porosity, lamellar structure, and microhardness. The nature of the local temperature gradient during deposition can strongly influence the formation of the final coating deposit. This study presents a preliminary study, undertaken to investigate the changes in the temperature profile which occur when a Cu-Al alloy is used as bond coat, and the possible consequences of these changes on the microstructure and adhesion of the final coating deposit. The influence of the thickness of the bond layer on the top coating temperature has also been also evaluated.

  3. Characteristics of coated copper wire specimens using high frequency ultrasonic complex vibration welding equipments.

    PubMed

    Tsujino, J; Ihara, S; Harada, Y; Kasahara, K; Sakamaki, N

    2004-04-01

    Welding characteristic of thin coated copper wires were studied using 40, 60, 100 kHz ultrasonic complex vibration welding equipments with elliptical to circular vibration locus. The complex vibration systems consisted of a longitudinal-torsional vibration converter and a driving longitudinal vibration system. Polyurethane coated copper wires of 0.036 mm outer diameter and copper plates of 0.3 mm thickness and the other dimension wires were used as welding specimens. The copper wire part is completely welded on the copper substrate and the insulated coating material is driven from welded area to outsides of the wire specimens by high frequency complex vibration.

  4. Characterization of copper and nichrome wires for safety fuse

    NASA Astrophysics Data System (ADS)

    Murdani, E.

    2016-11-01

    Fuse is an important component of an electrical circuit to limiting the current through the electrical circuit for electrical equipment safety. Safety fuses are made of a conductor such as copper and nichrome wires. The aim of this research was to determine the maximum current that can flow in the conductor wires (copper and nichrome). In the experiment used copper and nichrome wires by varying the length of wires (0.2 cm to 20 cm) and diameter of wires (0.1, 0.2, 0.3, 0.4 and 0.5) mm until maximum current reached that marked by melted or broken wire. From this experiment, it will be obtained the dependences data of maximum current to the length and diameter of wires. All data are plotted and it's known as a standard curve. The standard curve will provide an alternative choice of replacing fuse wire according to the maximum current requirement, including the wire type (copper and nichrome wires) and wire dimensions (length and diameter of wire).

  5. Forming Refractory Insulation On Copper Wire

    NASA Technical Reports Server (NTRS)

    Setlock, J.; Roberts, G.

    1995-01-01

    Alternative insulating process forms flexible coat of uncured refractory insulating material on copper wire. Coated wire formed into coil or other complex shape. Wire-coating apparatus forms "green" coat on copper wire. After wire coiled, heating converts "green" coat to refractory electrical insulator. When cured to final brittle form, insulating material withstands temperatures above melting temperature of wire. Process used to make coils for motors, solenoids, and other electrical devices to be operated at high temperatures.

  6. Copper diffusion and mechanical toughness at Cu-silica interfaces glued with polyelectrolyte nanolayers

    NASA Astrophysics Data System (ADS)

    Gandhi, D. D.; Singh, A. P.; Lane, M.; Eizenberg, M.; Ramanath, G.

    2007-04-01

    We demonstrate the use of polyallylamine hydrochloride (PAH)-polystyrene sulfonate (PSS) nanolayers to block Cu transport into silica. Cu/PSS-PAH/SiO2 structures show fourfold enhancement in device failure times during bias thermal annealing at 200 °C at an applied electric field of 2 MV/cm, when compared with structures with pristine Cu-SiO2 interfaces. Although the bonding at both Cu-PSS and PAH-SiO2 interfaces are strong, the interfacial toughness measured by the four-point bend tests is ˜2 Jm-2. Spectroscopic analysis of fracture surfaces reveals that weak electrostatic bonding at the PSS-PAH interface is responsible for the low toughness. Similar behavior is observed for Cu-SiO2 interfaces modified with other polyelectrolyte bilayers that inhibit Cu diffusion. Thus, while strong bonding at Cu-barrier and barrier-dielectric interfaces may be sufficient for blocking copper transport across polyelectrolyte bilayers, strong interlayer molecular bonding is a necessary condition for interface toughening. These findings are of importance for harnessing MNLs for use in future device wiring applications.

  7. Bioinspired conical copper wire with gradient wettability for continuous and efficient fog collection.

    PubMed

    Ju, Jie; Xiao, Kai; Yao, Xi; Bai, Hao; Jiang, Lei

    2013-11-06

    Inspired by the efficient fog collection on cactus spines, conical copper wires with gradient wettability are fabricated through gradient electrochemical corrosion and subsequent gradient chemical modification. These dual-gradient copper wires' fog-collection ability is demonstrated to be higher than that of conical copper wires with pure hydrophobic surfaces or pure hydrophilic surfaces, and the underlying mechanism is also analyzed. © 2013 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

  8. 7 CFR 1755.701 - Scope.

    Code of Federal Regulations, 2014 CFR

    2014-01-01

    ...) The aerial service wires can be either copper coated steel reinforced or nonmetallic reinforced designs. (c) For the copper coated steel reinforced design, the reinforcing members are the conductors. (1) The conductors are solid copper-covered steel wires. (2) The wire structure is completed by insulating...

  9. 7 CFR 1755.701 - Scope.

    Code of Federal Regulations, 2012 CFR

    2012-01-01

    ...) The aerial service wires can be either copper coated steel reinforced or nonmetallic reinforced designs. (c) For the copper coated steel reinforced design, the reinforcing members are the conductors. (1) The conductors are solid copper-covered steel wires. (2) The wire structure is completed by insulating...

  10. 7 CFR 1755.701 - Scope.

    Code of Federal Regulations, 2013 CFR

    2013-01-01

    ...) The aerial service wires can be either copper coated steel reinforced or nonmetallic reinforced designs. (c) For the copper coated steel reinforced design, the reinforcing members are the conductors. (1) The conductors are solid copper-covered steel wires. (2) The wire structure is completed by insulating...

  11. Synthesis of Commercial Products from Copper Wire-Drawing Waste

    NASA Astrophysics Data System (ADS)

    Ayala, J.; Fernández, B.

    2014-06-01

    Copper powder and copper sulfate pentahydrate were obtained from copper wire-drawing scale. The hydrometallurgical recycling process proposed in this article yields a high-purity copper powder and analytical grade copper sulfate pentahydrate. In the first stage of this process, the copper is dissolved in sulfuric acid media via dismutation of the scale. In the second stage, copper sulfate pentahydrate is precipitated using ethanol. Effects such as pH, reaction times, stirring speed, initial copper concentration, and ethanol/solution volume ratio were studied during the precipitation from solution reaction. The proposed method is technically straightforward and provides efficient recovery of Cu from wire-drawing scale.

  12. Investigation of ball bond integrity for 0.8 mil (20 microns) diameter gold bonding wire on low k die in wire bonding technology

    NASA Astrophysics Data System (ADS)

    Kudtarkar, Santosh Anil

    Microelectronics technology has been undergoing continuous scaling to accommodate customer driven demand for smaller, faster and cheaper products. This demand has been satisfied by using novel materials, design techniques and processes. This results in challenges for the chip connection technology and also the package technology. The focus of this research endeavor was restricted to wire bond interconnect technology using gold bonding wires. Wire bond technology is often regarded as a simple first level interconnection technique. In reality, however, this is a complex process that requires a thorough understanding of the interactions between the design, material and process variables, and their impact on the reliability of the bond formed during this process. This research endeavor primarily focused on low diameter, 0.8 mil thick (20 mum) diameter gold bonding wire. Within the scope of this research, the integrity of the ball bond formed by 1.0 mil (25 mum) and 0.8 mil (20 mum) diameter wires was compared. This was followed by the evaluation of bonds formed on bond pads having doped SiO2 (low k) as underlying structures. In addition, the effect of varying the percentage of the wire dopant, palladium and bonding process parameters (bonding force, bond time, ultrasonic energy) for 0.8 mil (20 mum) bonding wire was also evaluated. Finally, a degradation empirical model was developed to understand the decrease in the wire strength. This research effort helped to develop a fundamental understanding of the various factors affecting the reliability of a ball bond from a design (low diameter bonding wire), material (low k and bonding wire dopants), and process (wire bonding process parameters) perspective for a first level interconnection technique, namely wire bonding. The significance of this research endeavor was the systematic investigation of the ball bonds formed using 0.8 mil (20 microm) gold bonding wire within the wire bonding arena. This research addressed low k structures on 90 nm silicon technology, bonding wires with different percentage of doping element (palladium), and different levels of bonding process parameters. An empirical model to understand the high temperature effects for bonds formed using the low diameter wire was also developed.

  13. Resistence seam welding thin copper foils

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Hollar, D.L. Jr.

    1991-02-01

    Use of flat flexible circuits in the electronics industry is expanding. The term flexible circuits'' is defined here as copper foil which has been bonded to an insulating film such as Kapton film. The foil is photo processed to produce individual circuit paths similar to printed circuit boards. Another insulating film is laminated over the conductors to complete the flexible circuit. Flexible circuits, like multiwire cables, are susceptible to electromagnetic radiation (EMR) interference. On multiwire cables the interference problem is mitigated by adding a woven wire braid shielding over the conductors. Shielding on flexible circuits is accomplished by enclosing themore » circuits in a copper foil envelope. However, the copper foil must be electrically sealed around the flexcircuit to be effective. Ultimately, a resistance seam welding process and appropriate equipment were developed which would provide the required electrical seal between two layers of 2-oz (0.0028-inch thick) copper foil on a 1.1-inch wide, 30-inch long, 0.040-inch thick flexible circuit. 4 refs., 19 figs.« less

  14. Comparison of galvanic corrosion potential of metal injection molded brackets to that of conventional metal brackets with nickel-titanium and copper nickel-titanium archwire combinations.

    PubMed

    Varma, D Praveen Kumar; Chidambaram, S; Reddy, K Baburam; Vijay, M; Ravindranath, D; Prasad, M Rajendra

    2013-05-01

    The aim of the study is to investigate the galvanic corrosion potential of metal injection molding (MIM) brackets to that of conventional brackets under similar in vitro conditions with nickel-titanium and copper nickel-titanium archwires. Twenty-five maxillary premolar MIM stainless steel brackets and 25 conventional stainless steel brackets and archwires, 0.16 inch, each 10 mm length, 25 nickeltitanium wires, 25 copper nickel-titanium wires were used. They were divided into four groups which had five samples each. Combination of MIM bracket with copper nickel-titanium wire, MIM bracket with nickel-titanium wire and conventional stainless steel brackets with copper nickel-titanium wire and conventional stainless steel brackets with nickel-titanium wires which later were suspended in 350 ml of 1 M lactic acid solution media. Galvanic corrosion potential of four groups were analyzed under similar in vitro conditions. Precorrosion and postcorrosion elemental composition of MIM and conventional stainless steel bracket by scanning electron microscope (SEM) with energy dispersive spectroscope (EDS) was done. MIM bracket showed decreased corrosion susceptibility than conventional bracket with copper nickeltitanium wire. Both MIM and conventional bracket showed similar corrosion resistance potential in association with nickel-titanium archwires. It seems that both brackets are more compatible with copper nickel-titanium archwires regarding the decrease in the consequences of galvanic reaction. The EDS analysis showed that the MIM brackets with copper nickel-titanium wires released less metal ions than conventional bracket with copper nickeltitanium wires. MIM brackets showed decreased corrosion susceptibility, copper nickel-titanium archwires are compatible with both the brackets than nickel-titanium archwires. Clinically MIM and conventional brackets behaved more or less similarly in terms of corrosion resistance. In order to decrease the corrosion potential of MIM brackets, more precise manufacturing technique should be improved to get a more smoother surface finish.

  15. What's in the Walls: Copper, Fiber, or Coaxial Wiring?

    ERIC Educational Resources Information Center

    Weiss, Andrew M.

    1995-01-01

    Presents planning guidelines for wiring specifications for K-12 schools by reviewing advantages and disadvantages of using copper, fiber-optic, and coaxial wire. Addresses the future of network wiring and educational technology, and makes recommendations. A sidebar describes the physical appearance of different types of wire and a table compares…

  16. TAB interconnects for space concentrator solar cell arrays

    NASA Technical Reports Server (NTRS)

    Avery, J.; Bauman, J. S.; Gallagher, P.; Yerkes, J. W.

    1993-01-01

    The Boeing Company has evaluated the use of Tape Automated Bonding (TAB) and Surface Mount Technology (SMT) for a highly reliable, low cost interconnect for concentrator solar cell arrays. TAB and SMT are currently used in the electronics industry for chip interconnects and printed circuit board assembly. TAB tape consists of sixty-four 3-mil/1-oz tin-plated copper leads on 8-mil centers. The leads are thermocompression gang bonded to GaAs concentrator solar cell with silver contacts. This bond, known as an Inner Lead Bond (ILB), allows for pretesting and sorting capability via nondestruct wire bond pull and flash testing. Destructive wire pull tests resulted in preferred mid-span failures. Improvements in fill factor were attributed to decreased contact resistance on TAB bonded cells. Preliminary thermal cycling and aging tests were shown excellent bond strength and metallurgical results. Auger scans of bond sites reveals an Ag-Cu-Tin composition. Improper bonds are identified through flash testing as a performance degradation. On going testing of cells are underway at Lewis Research Center. SMT techniques are utilized to excise and form TAB leads post ILB. The formed leads' shape isolates thermal mismatches between the cells and the flex circuit they are mounted on. TABed cells are picked and placed with a gantry x-y-z positioning system with pattern recognition. Adhesives are selected to avoid thermal expansion mismatch and promote thermal transfer to the flex circuit. TAB outer lead bonds are parallel gap welded (PGW) to the flex circuit to finish the concentrator solar cell subassembly.

  17. 7 CFR 1755.406 - Shield or armor ground resistance measurements.

    Code of Federal Regulations, 2012 CFR

    2012-01-01

    ... or armor ground resistance measurements shall be made on completed lengths of copper cable and wire... measurement shall be made between the copper cable and wire shield and ground and between the fiber optic... instructions. (d) Applicable results. (1) For all new copper cable and wire facilities and all new fiber optic...

  18. 7 CFR 1755.406 - Shield or armor ground resistance measurements.

    Code of Federal Regulations, 2013 CFR

    2013-01-01

    ... or armor ground resistance measurements shall be made on completed lengths of copper cable and wire... measurement shall be made between the copper cable and wire shield and ground and between the fiber optic... instructions. (d) Applicable results. (1) For all new copper cable and wire facilities and all new fiber optic...

  19. 7 CFR 1755.406 - Shield or armor ground resistance measurements.

    Code of Federal Regulations, 2014 CFR

    2014-01-01

    ... or armor ground resistance measurements shall be made on completed lengths of copper cable and wire... measurement shall be made between the copper cable and wire shield and ground and between the fiber optic... instructions. (d) Applicable results. (1) For all new copper cable and wire facilities and all new fiber optic...

  20. Alleviation of mandibular anterior crowding with copper-nickel-titanium vs nickel-titanium wires: a double-blind randomized control trial.

    PubMed

    Pandis, Nikolaos; Polychronopoulou, Argy; Eliades, Theodore

    2009-08-01

    The purpose of this study was to investigate the efficiency of copper-nickel-titanium (CuNiTi) vs nickel-titanium (NiTi) archwires in resolving crowding of the anterior mandibular dentition. Sixty patients were included in this single-center, single-operator, double-blind randomized trial. All patients were bonded with the In Ovation-R self-ligating bracket (GAC, Central Islip, NY) with a 0.022-in slot, and the amount of crowding of the mandibular anterior dentition was assessed by using the irregularity index. The patients were randomly allocated into 2 groups of 30 patients, each receiving a 0.016-in CuNiTi 35 degrees C (Ormco, Glendora, Calif) or a 0.016-in NiTi (ModernArch, Wyomissing, Pa) wire. The type of wire selected for each patient was not disclosed to the provider or the patient. The date that each patient received a wire was recorded, and all patients were followed monthly for a maximum of 6 months. Demographic and clinical characteristics between the 2 wire groups were compared with the t test or the chi-square test and the Fisher exact test. Time to resolve crowding was explored with statistical methods for survival analysis, and alignment rate ratios for wire type and crowding level were calculated with Cox proportional hazards multivariate modeling. The type of wire (CuNiTi vs NiTi) had no significant effect on crowding alleviation (129.4 vs 121.4 days; hazard ratio, 1.3; P >0.05). Severe crowding (>5 on the irregularity index) showed a significantly higher probability of crowding alleviation duration relative to dental arches with a score of <5 (138.5 vs 113.1 days; hazard ratio, 2.2; P=0.02). The difference of the loading pattern of wires in laboratory and clinical conditions might effectively eliminate the laboratory-derived advantage of CuNiTi wires.

  1. 7 CFR 1755.701 - Scope.

    Code of Federal Regulations, 2011 CFR

    2011-01-01

    ...) This section covers the requirements for aerial service wires intended for aerial subscriber drops. (b) The aerial service wires can be either copper coated steel reinforced or nonmetallic reinforced...) The conductors are solid copper-covered steel wires. (2) The wire structure is completed by insulating...

  2. 7 CFR 1755.701 - Scope.

    Code of Federal Regulations, 2010 CFR

    2010-01-01

    ...) This section covers the requirements for aerial service wires intended for aerial subscriber drops. (b) The aerial service wires can be either copper coated steel reinforced or nonmetallic reinforced...) The conductors are solid copper-covered steel wires. (2) The wire structure is completed by insulating...

  3. Combined effects of different heat treatments and Cu element on transformation behavior of NiTi orthodontic wires.

    PubMed

    Seyyed Aghamiri, S M; Ahmadabadi, M Nili; Raygan, Sh

    2011-04-01

    The shape memory nickel-titanium alloy has been applied in many fields due to its unique thermal and mechanical performance. One of the successful applications of NiTi wires is in orthodontics because of its good characteristics such as low stiffness, high spring back, high stored energy, biocompatibility, superelasticity and shape memory effect. The mechanical properties of wires are paid special attention which results in achieving continuous optimal forces and eventually causing rapid tooth movement without any damage. The behavior of the alloy can be controlled by chemical composition and thermo-mechanical treatment during the manufacturing process. In this study two kinds of commercial superelastic NiTi archwires of 0.41 mm diameter were investigated: Copper NiTi and Highland Metal. The chemical analysis of both wires was estimated by energy dispersive spectroscopy (EDS). It was showed that Copper NiTi wire contained copper and chromium. The two types of wires were exposed to different heat treatment conditions at 400 and 500 °C for 10 and 60 min to compare the behavior of the wires at aged and as-received conditions. Phase transformation temperatures clarified by differential scanning calorimetry (DSC) showed B2 <--> R <--> B19 transformation in Highland Metal wire and B2 <--> B19(') transformation in Copper NiTi wire. Three point bending (TPB) tests in the certain designed fixture were performed at 37 °C to evaluate the mechanical behavior of the wires. The experimental results revealed the superelastic behavior of the Highland Metal wire after 60 min ageing at 400 and 500 °C and the plastic deformation of the Copper NiTi wire after annealing due to the effect of copper in the alloy composition. Copyright © 2010 Elsevier Ltd. All rights reserved.

  4. Long-Term Effects of Soldering By-Products on Nickel-Coated Copper Wire

    NASA Technical Reports Server (NTRS)

    Rolin, T. D.; Hodge, R. E.

    2008-01-01

    An analysis of thirty-year-old, down graded flight cables was conducted to determine the makeup of a green material on the surface of the shielded wire near soldered areas and to ascertain if the green material had corroded the nickel-coated copper wire. Two likely candidates were possible due to the handling and environments to which these cables were exposed. The flux used to solder the cables is known to contain abietic acid, a carboxylic acid found in many pine rosins used for the soldering process. The resulting material copper abietate is green in color and is formed during the application of heat during soldering operations. Copper (II) chloride, which is also green in color is known to contaminate flight parts and is corrosive. Data is presented that shows the material is copper abietate, not copper (II) chloride, and more importantly that the abietate does not aggressively attack nickel-plated copper wire.

  5. Intralesional copper wire retention and pingyangmycin injection: an effective combinational therapy for complex venous malformation in soft tissue.

    PubMed

    Yuan, S-M; Hong, Z-J; Jiang, H-Q; Wang, J; Hu, X-B

    2014-04-01

    Complex venous malformations (VMs) may extensively involve the soft tissue. The treatment remains a challenge till now. Here we introduce a combinational therapy of copper wires and pingyangmycin (bleomycin A5,PYM). Copper wires were retained in VMs by repeated penetration with a straight needle. Subsequently, PYM solution was injected into the lesion. Eight to 10 days later, copper wires were removed. The dressing was changed every day until the puncture pores healed. Magnetic resonance imaging scanning was performed to observe the change of VMs. From January 2001 to December 2011, 56 patients were treated. During the follow-up period, most of the VMs shrunk obviously. The symptoms were relieved or disappeared. The complications included local pain, temporary paraesthesia and moderate fever, which disappeared quickly after the removal of copper wires. This combinational therapy is a safe and effective approach for the complex VMs in soft tissue.

  6. One hundred angstrom niobium wire

    NASA Technical Reports Server (NTRS)

    Cline, H. E.; Rose, R. M.; Wulff, J.

    1968-01-01

    Composite of fine niobium wires in copper is used to study the size and proximity effects of a superconductor in a normal matrix. The niobium rod was drawn to a 100 angstrom diameter wire on a copper tubing.

  7. 46 CFR 183.340 - Cable and wiring requirements.

    Code of Federal Regulations, 2014 CFR

    2014-10-01

    ... requirements. (a) If individual wires, rather than cable, are used in systems greater than 50 volts, the wire must be in conduit. (b) All cable and wire must: (1) Have stranded copper conductors with sufficient... constant representing the resistance of copper). I=Load current, in amperes. L=length of conductor from...

  8. 46 CFR 183.340 - Cable and wiring requirements.

    Code of Federal Regulations, 2013 CFR

    2013-10-01

    ... requirements. (a) If individual wires, rather than cable, are used in systems greater than 50 volts, the wire must be in conduit. (b) All cable and wire must: (1) Have stranded copper conductors with sufficient... constant representing the resistance of copper). I=Load current, in amperes. L=length of conductor from...

  9. 46 CFR 183.340 - Cable and wiring requirements.

    Code of Federal Regulations, 2012 CFR

    2012-10-01

    ... requirements. (a) If individual wires, rather than cable, are used in systems greater than 50 volts, the wire must be in conduit. (b) All cable and wire must: (1) Have stranded copper conductors with sufficient... constant representing the resistance of copper). I=Load current, in amperes. L=length of conductor from...

  10. 46 CFR 183.340 - Cable and wiring requirements.

    Code of Federal Regulations, 2011 CFR

    2011-10-01

    ... requirements. (a) If individual wires, rather than cable, are used in systems greater than 50 volts, the wire must be in conduit. (b) All cable and wire must: (1) Have stranded copper conductors with sufficient... constant representing the resistance of copper). I=Load current, in amperes. L=length of conductor from...

  11. Scavenging high-voltage copper wire, a hazardous petty larceny.

    PubMed

    Himel, H N; Ahn, L C; Jones, K C; Edlich, R F

    1992-01-01

    With the current emphasis on recycling and the establishment of markets for sale of used copper wire, scavenging of copper wire from old buildings and equipment has become common. Although scavenging without permission constitutes theft, a more significant risk to the perpetrator is the potential for electrical burn injury in attempting to remove "hot" wire. A severe high-voltage electrical burn injury sustained while attempting to scavenge wire from an old house is reported. The circumstances surrounding the injury, the clinical management of the case, and the long-term consequences to the patient are presented and discussed.

  12. Method of preparing composite superconducting wire

    DOEpatents

    Verhoeven, John D.; Gibson, Edwin D.; Finnemore, Douglas K.; Ostenson, Jerome E.; Schmidt, Frederick A.; Owen, Charles V.

    1985-08-06

    An improved method of preparing composite multifilament superconducting wire of Nb.sub.3 Sn in a copper matrix which eliminates the necessity of coating the drawn wire with tin. A generalized cylindrical billet of an alloy of copper containing at least 15 weight percent niobium, present in the copper as discrete, randomly distributed and oriented dendritic-shaped particles, is provided with at least one longitudinal opening which is filled with tin to form a composite drawing rod. The drawing rod is then drawn to form a ductile composite multifilament wire containing a filament of tin. The ductile wire containing the tin can then be wound into magnet coils or other devices before heating to diffuse the tin through the wire to react with the niobium forming Nb.sub.3 Sn. Also described is an improved method for making large billets of the copper-niobium alloy by consumable-arc casting.

  13. Improved method of preparing composite superconducting wire

    DOEpatents

    Verhoeven, J.D.; Gibson, E.D.; Finnemore, D.K.; Ostenson, J.E.; Schmidt, F.A.; Owen, C.V.

    1979-10-17

    An improved method of preparing composite multifilament superconducting wire of Nb/sub 3/Sn in a copper matrix eliminates the necessity of coating the drawn wire with tin. A generalized cylindrical billet of an alloy of copper containing at least 15 weight percent niobium, present in the copper as discrete, randomly distributed and oriented dendritic-shaped particles, is provided with at least one longitudinal opening which is filled with tin to form a composite drawing rod. The drawing rod is then drawn to form a ductile composite multifilament wire containing a filament of tin. The ductile wire containing the tin can then be wound into magnet coils or other devices before heating to diffuse the tin through the wire to react with the niobium forming Nb/sub 3/Sn. Also described is an improved method for making large billets of the copper-niobium alloy by consumable-arc casting.

  14. 1 mil gold bond wire study.

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Huff, Johnathon; McLean, Michael B.; Jenkins, Mark W.

    2013-05-01

    In microcircuit fabrication, the diameter and length of a bond wire have been shown to both affect the current versus fusing time ratio of a bond wire as well as the gap length of the fused wire. This study investigated the impact of current level on the time-to-open and gap length of 1 mil by 60 mil gold bond wires. During the experiments, constant current was provided for a control set of bond wires for 250ms, 410ms and until the wire fused; non-destructively pull-tested wires for 250ms; and notched wires. The key findings were that as the current increases, themore » gap length increases and 73% of the bond wires will fuse at 1.8A, and 100% of the wires fuse at 1.9A within 60ms. Due to the limited scope of experiments and limited data analyzed, further investigation is encouraged to confirm these observations.« less

  15. Advanced Process Possibilities in Friction Crush Welding of Aluminum, Steel, and Copper by Using an Additional Wire

    NASA Astrophysics Data System (ADS)

    Besler, Florian A.; Grant, Richard J.; Schindele, Paul; Stegmüller, Michael J. R.

    2017-12-01

    Joining sheet metal can be problematic using traditional friction welding techniques. Friction crush welding (FCW) offers a high speed process which requires a simple edge preparation and can be applied to out-of-plane geometries. In this work, an implementation of FCW was employed using an additional wire to weld sheets of EN AW5754 H22, DC01, and Cu-DHP. The joint is formed by bringing together two sheet metal parts, introducing a wire into the weld zone and employing a rotating disk which is subject to an external force. The requirements of the welding preparation and the fundamental process variables are shown. Thermal measurements were taken which give evidence about the maximum temperature in the welding center and the temperature in the periphery of the sheet metals being joined. The high welding speed along with a relatively low heat input results in a minimal distortion of the sheet metal and marginal metallurgical changes in the parent material. In the steel specimens, this FCW implementation produces a fine grain microstructure, enhancing mechanical properties in the region of the weld. Aluminum and copper produced mean bond strengths of 77 and 69 pct to that of the parent material, respectively, whilst the steel demonstrated a strength of 98 pct. Using a wire offers the opportunity to use a higher-alloyed additional material and to precisely adjust the additional material volume appropriate for a given material alignment and thickness.

  16. [Analysis the cupric ion release characteristics of different copper raw materials in intrauterine device in vitro using ICP method].

    PubMed

    Lu, Hua; Ding, Tingting; Yao, Tianping; Sun, Jiao

    2014-05-01

    To study the Cupric ion release characteristics of different copper raw materials in intrauterine device in vitro by ICP. Reveal the relationship between purity and shape of Cu-IUD copper and copper ion release. According to a certain proportion, the copper raw materials were 100 times diluted into the simulated uterine solution at 37 +/- 0.5 degrees C. Replaced medium at certain time points and collected soaking liquid. Using ICP analyzed the concentration of copper ion released. The largest daily release of copper ions was in the first 7 days. There was no statistically significant difference between the copper ion release amount of 99.99% and 99.95% purity copper wire (P > 0.05). The release of copper ion of the copper wire was far greater than that of the copper pipe in early stage (P < 0.01). The release amount decreased and stabilized at 56 day. Release characteristics of copper ion could effectively analysis by ICP. And in the same area, the release amount of copper ions of copper wire was greater than that of copper pipe.

  17. Anisotropic Thermal Response of Packed Copper Wire

    DOE PAGES

    Wereszczak, Andrew A.; Emily Cousineau, J.; Bennion, Kevin; ...

    2017-04-19

    The apparent thermal conductivity of packed copper wire test specimens was measured parallel and perpendicular to the axis of the wire using laser flash, transient plane source, and transmittance test methods. Approximately 50% wire packing efficiency was produced in the specimens using either 670- or 925-μm-diameter copper wires that both had an insulation coating thickness of 37 μm. The interstices were filled with a conventional varnish material and also contained some remnant porosity. The apparent thermal conductivity perpendicular to the wire axis was about 0.5–1 W/mK, whereas it was over 200 W/mK in the parallel direction. The Kanzaki model andmore » an finite element analysis (FEA) model were found to reasonably predict the apparent thermal conductivity perpendicular to the wires but thermal conductivity percolation from nonideal wire-packing may result in their underestimation of it.« less

  18. 49 CFR 234.271 - Insulated rail joints, bond wires, and track connections.

    Code of Federal Regulations, 2010 CFR

    2010-10-01

    ... 49 Transportation 4 2010-10-01 2010-10-01 false Insulated rail joints, bond wires, and track connections. 234.271 Section 234.271 Transportation Other Regulations Relating to Transportation (Continued... joints, bond wires, and track connections. Insulated rail joints, bond wires, and track connections shall...

  19. 49 CFR 234.271 - Insulated rail joints, bond wires, and track connections.

    Code of Federal Regulations, 2011 CFR

    2011-10-01

    ... 49 Transportation 4 2011-10-01 2011-10-01 false Insulated rail joints, bond wires, and track connections. 234.271 Section 234.271 Transportation Other Regulations Relating to Transportation (Continued... joints, bond wires, and track connections. Insulated rail joints, bond wires, and track connections shall...

  20. High-Temperature High-Power Packaging Techniques for HEV Traction Applications

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Elshabini, Aicha; Barlow, Fred D.

    A key issue associated with the wider adoption of hybrid-electric vehicles (HEV) and plug in hybrid-electric vehicles (PHEV) is the implementation of the power electronic systems that are required in these products. One of the primary industry goals is the reduction in the price of these vehicles relative to the cost of traditional gasoline powered vehicles. Today these systems, such as the Prius, utilize one coolant loop for the engine at approximately 100 C coolant temperatures, and a second coolant loop for the inverter at 65 C. One way in which significant cost reduction of these systems could be achievedmore » is through the use of a single coolant loop for both the power electronics as well as the internal combustion engine (ICE). This change in coolant temperature significantly increases the junction temperatures of the devices and creates a number of challenges for both device fabrication and the assembly of these devices into inverters and converters for HEV and PHEV applications. Traditional power modules and the state-of-the-art inverters in the current HEV products, are based on chip and wire assembly and direct bond copper (DBC) on ceramic substrates. While a shift to silicon carbide (SiC) devices from silicon (Si) devices would allow the higher operating temperatures required for a single coolant loop, it also creates a number of challenges for the assembly of these devices into power inverters. While this traditional packaging technology can be extended to higher temperatures, the key issues are the substrate material and conductor stability, die bonding material, wire bonds, and bond metallurgy reliability as well as encapsulation materials that are stable at high operating temperatures. The larger temperature differential during power cycling, which would be created by higher coolant temperatures, places tremendous stress on traditional aluminum wire bonds that are used to interconnect power devices. Selection of the bond metallurgy and wire bond geometry can play a key role in mitigating this stress. An alternative solution would be to eliminate the wire bonds completely through a fundamentally different method of forming a reliable top side interconnect. Similarly, the solders used in most power modules exhibit too low of a liquidus to be viable solutions for maximum junction temperatures of 200 C. Commonly used encapsulation materials, such as silicone gels, also suffer from an inability to operate at 200 C for extended periods of time. Possible solutions to these problems exist in most cases but require changes to the traditional manufacturing process used in these modules. In addition, a number of emerging technologies such as Si nitride, flip-chip assembly methods, and the elimination of base-plates would allow reliable module development for operation of HEV and PHEV inverters at elevated junction temperatures.« less

  1. 7 CFR 1755.508 - Customer access location protection.

    Code of Federal Regulations, 2011 CFR

    2011-01-01

    ... AWG copper and No. 18 AWG copper covered-steel reinforced aerial service wire conductors shall not be... served as close as practicable to the point at which the telecommunications service wire attaches to the... gauges (AWG) finer (numerically higher) conductivity than the aerial service wire shall be provided...

  2. 7 CFR 1755.508 - Customer access location protection.

    Code of Federal Regulations, 2010 CFR

    2010-01-01

    ... AWG copper and No. 18 AWG copper covered-steel reinforced aerial service wire conductors shall not be... served as close as practicable to the point at which the telecommunications service wire attaches to the... gauges (AWG) finer (numerically higher) conductivity than the aerial service wire shall be provided...

  3. Composite ceramic superconducting wires for electric motor applications

    NASA Astrophysics Data System (ADS)

    Halloran, John W.

    1988-12-01

    This is the Second Quarterly report on a project to develop HTSC wire for an HTSC motor. The raw material for fiber production is an improved YBa2Cu3O(7-x) powder. Continuous spools of green YBa2Cu3O(7-x) fiber are being produced. The major effort in fiber spinning is aimed at improving fiber quality and reducing fiber. Binder burnout and sintering has been intensively investigated. Fiber sintering fibers is done by the rapid zone sintering method. A continuous furnace received near the end of this Quarter will be used for continuous sintering. Continuous silver coated green fiber are produced. We have made progress toward continuous cladding using the mechanical cladding concept. The melt spinning process was successfully applied to YBa2Cu3O(7-x) powders at 50 vol percent solids loadings. The cladding work centered on mechanical cladding of silver treated filaments by solder bonding to copper strips. Aluminum deposits on YBa2Cu3O(7-x) filament surfaces were produced by MOCVD at ATM, but the superconductivity was degraded. Electrical characterization work focused on methods of making low resistance contacts on YBa2Cu3O(7-x) filaments. Emerson Motor Division has begun work on DC heteropolar and homopolar motor designs. The mechanical stresses on conventional copper wires during winding have been characterized to determine the mechanical parameters of motor building.

  4. Wire-bonder-assisted integration of non-bondable SMA wires into MEMS substrates

    NASA Astrophysics Data System (ADS)

    Fischer, A. C.; Gradin, H.; Schröder, S.; Braun, S.; Stemme, G.; van der Wijngaart, W.; Niklaus, F.

    2012-05-01

    This paper reports on a novel technique for the integration of NiTi shape memory alloy wires and other non-bondable wire materials into silicon-based microelectromechanical system structures using a standard wire-bonding tool. The efficient placement and alignment functions of the wire-bonding tool are used to mechanically attach the wire to deep-etched silicon anchoring and clamping structures. This approach enables a reliable and accurate integration of wire materials that cannot be wire bonded by traditional means.

  5. Ductile alloy and process for preparing composite superconducting wire

    DOEpatents

    Verhoeven, John D.; Finnemore, Douglas K.; Gibson, Edwin D.; Ostenson, Jerome E.

    1983-03-29

    An alloy for the commercial production of ductile superconducting wire is prepared by melting together copper and at least 15 weight percent niobium under non-oxygen-contaminating conditions, and rapidly cooling the melt to form a ductile composite consisting of discrete, randomly distributed and orientated dendritic-shaped particles of niobium in a copper matrix. As the wire is worked, the dendritric particles are realigned parallel to the longitudinal axis and when drawn form a plurality of very fine ductile superconductors in a ductile copper matrix. The drawn wire may be tin coated and wound into magnets or the like before diffusing the tin into the wire to react with the niobium. Impurities such as aluminum or gallium may be added to improve upper critical field characteristics.

  6. Ductile alloy and process for preparing composite superconducting wire

    DOEpatents

    Verhoeven, J.D.; Finnemore, D.K.; Gibson, E.D.; Ostenson, J.E.

    An alloy for the commercial production of ductile superconducting wire is prepared by melting together copper and at least 15 weight percent niobium under non-oxygen-contaminating conditions, and rapidly cooling the melt to form a ductile composite consisting of discrete, randomly distributed and oriented dendritic-shaped particles of niobium in a copper matrix. As the wire is worked, the dendritic particles are realigned parallel to the longitudinal axis and when drawn form a plurality of very fine ductile superconductors in a ductile copper matrix. The drawn wire may be tin coated and wound into magnets or the like before diffusing the tin into the wire to react with the niobium. Impurities such as aluminum or gallium may be added to improve upper critical field characteristics.

  7. Heat treatment effect on the mechanical properties of industrial drawn copper wires

    NASA Astrophysics Data System (ADS)

    Beribeche, Abdellatif; Boumerzoug, Zakaria; Ji, Vincent

    2013-12-01

    In this present investigation, the mechanical properties of industrial drawn copper wires have been studied by tensile tests. The effect of prior heat treatments at 500°C on the drawn wires behavior was the main goal of this investigation. We have found that the mechanical behavior of drawn wires depends strongly on those treatments. SEM observations of the wire cross section after tensile tests have shown that the mechanism of rupture was mainly controlled by the void formation.

  8. Copper wire theft and high voltage electrical burns

    PubMed Central

    Francis, Eamon C; Shelley, Odhran P

    2014-01-01

    High voltage electrical burns are uncommon. However in the midst of our economic recession we are noticing an increasing number of these injuries. Copper wire is a valuable commodity with physical properties as an excellent conductor of electricity making it both ubiquitous in society and prized on the black market. We present two consecutive cases referred to the National Burns Unit who sustained life threatening injuries from the alleged theft of high voltage copper wire and its omnipresence on an international scale. PMID:25356371

  9. Copper wire theft and high voltage electrical burns.

    PubMed

    Francis, Eamon C; Shelley, Odhran P

    2014-01-01

    High voltage electrical burns are uncommon. However in the midst of our economic recession we are noticing an increasing number of these injuries. Copper wire is a valuable commodity with physical properties as an excellent conductor of electricity making it both ubiquitous in society and prized on the black market. We present two consecutive cases referred to the National Burns Unit who sustained life threatening injuries from the alleged theft of high voltage copper wire and its omnipresence on an international scale.

  10. Interfacial Microstructure and Its Influence on Resistivity of Thin Layers Copper Cladding Steel Wires

    NASA Astrophysics Data System (ADS)

    Li, Hongjuan; Ding, Zhimin; Zhao, Ruirong

    2018-04-01

    The interfacial microstructure and resistivity of cold-drawn and annealed thin layers copper cladding steel (CCS) wires have been systematically investigated by the methods of scanning electron microscopy (SEM), transmission electron microscopy (TEM), energy dispersive spectroscopy (EDS), and resistivity testing. The results showed that the Cu and Fe atoms near interface diffused into each other matrixes. The Fe atoms diffused into Cu matrixes and formed a solid solution. The mechanism of solid solution is of substitution type. When the quantity of Fe atoms exceeds the maximum solubility, the supersaturated solid solution would form Fe clusters and decompose into base Cu and α-Fe precipitated phases under certain conditions. A few of α-Fe precipitates was observed in the copper near Cu/Fe interfaces of cold-drawn CCS wires, with 1-5 nm in size. A number of α-Fe precipitates of 1-20 nm in size can be detected in copper near Cu/Fe interfaces of CCS wires annealed at 850°C. When annealing temperature was less than 750°C, the resistivity of CCS wires annealed was lower than that of cold-drawn CCS wires. However, when annealing temperature was above 750°C, the resistivity of CCS wires was greater than that of cold-drawn CCS wires and increased with rising the annealing temperature. The relationship between nanoscale α-Fe precipitation and resistivity of CCS wires has been well discussed.

  11. Localized etching of an insulator film coated on a copper wire using an atmospheric-pressure microplasma jet.

    PubMed

    Yoshiki, Hiroyuki

    2007-04-01

    Atmospheric-pressure microplasma jets (APmicroPJs) of Ar and ArO(2) gases were generated from the tip of a stainless steel surgical needle having outer and inner diameters of 0.4 and 0.2 mm, respectively, with a rf excitation of 13.56 MHz. The steel needle functions both as a powered electrode and a gas nozzle. The operating power is 1.2-6 W and the corresponding peak-to-peak voltage Vp.p. is about 1.5 kV. The APmicroPJ was applied to the localized etching of a polyamide-imide insulator film (thickness of 10 microm) of a copper winding wire of 90 microm diameter. The insulator film around the copper wire was completely removed by the irradiated plasma from a certain direction without fusing the wire. The removal time under the Ar APmicroPJ irradiation was only 3 s at a rf power of 4 W. Fluorescence microscopy and scanning electron microscope images reveal that good selectivity of the insulator film to the copper wire was achieved. In the case of ArO(2) APmicroPJ irradiation with an O(2) concentration of 10% or more, the removed copper surface was converted to copper monoxide CuO.

  12. [Chalcosis bulbi recognized 22 years after trauma].

    PubMed

    Yagihashi, Tomoyuki; Wakabayashi, Yoshihiro; Fujita, Satoshi; Fujita, Yasushi; Usui, Masahiko

    2006-12-01

    To report a case of chalcosis bulbi diagnosed 22 years after accidental entry of a foreign object into the eye. A 57 year-old woman underwent surgery for vitreous opacity and cataract of unknown cause. During the operation, an intraocular foreign body was found in the vitreous at the pars plana, and was removed. The object was a coated copper wire, 3.5 mm in length and 0.2 mm in thickness. She recalled that such a wire had accidentally entered her eye 22 years previously. Copper particles were detected by copper staining of the anterior lens capsule. Fine, sharp metal fragments may penetrate the eye with little resistance. When the injury results in minimal subjective symptoms, the person may not seek examination by an ophthalmologist. In the present case, the foreign body was a fragment of coated copper wire. The exposed metal surface was limited and the copper probably dissolved very slowly. This may account for the lack of significant symptoms. In the Japanese literature, there are many reports of coated copper wire as foreign body in the eye, but few lead to characteristic chalcosis bulbi.

  13. China Report, Economic Affairs, No. 397

    DTIC Science & Technology

    1983-11-10

    porphyry copper have also been discovered, together with molybdenum, tungsten, gold, silver and iron. Tibet’s potential reserve of copper is...abroad aimed at using optical fibres instead of copper and aluminum wires for the relaying of information. According to statistics, the energy required...to produce this kind of fibre is only one-thousandth of the energy required to mine, smelt, and process the same length of copper wire. After the

  14. A creative therapy in treating cavernous hemangioma of penis with copper wire.

    PubMed

    Zhang, Dong; Zhang, Haiyang; Sun, Peng; Li, Peng; Xue, Aibing; Jin, Xunbo

    2014-10-01

    Cavernous hemangiomas of penis are rare benign lesions infrequently described in the literature. No completely satisfactory treatment has been found to correct the cosmetic deformities especially the extensive hemangiomas of corpus penis. In light of the promising application of copper wire/needle in vascular malformations, we began a clinical study to investigate the safety, feasibility, and cosmetic effect of copper wire therapy in treating cavernous hemangioma of penis. Seven patients ranging in age from 12 to 32 years with penile cavernous hemangiomas entered our study from 2005 to 2011. All patients received treatments with percutaneous copper wires. Perioperative data including mean operation time, estimated blood loss, length of copper wire retention, and length of hospital stay were analyzed. All possible complications were noted, and cosmetic result was evaluated. Patients were followed up after discharge from the hospital. All operations were successful, and no obvious complications were observed. The patients were satisfied with the aesthetic results. Follow-up time ranged from 1 to 5 years. Recurrence was discovered in a patient with the largest lesion of corpus penis 2 months after the treatment. Secondary procedure was carried out with the same technique, and no lesions were found later. The shortage of studies on this topic prevented us from defining a therapeutic reference standard. The results of our study confirmed that copper wire therapy was a simple, safe, and useful option for penile cavernous hemangioma. © 2013 International Society for Sexual Medicine.

  15. Effect of curettage and copper wire on rabbit endometrium: a novel rabbit model of endometrial mechanical injury.

    PubMed

    Li, Li; Shi, Jing; Zhang, Qiu-Fang; Yan, Jie; Yan, Li-Ying; Shen, Fei; Qiao, Jie; Feng, Huai-Liang

    2011-06-01

    It remains almost a helpless situation for the recurrent implantation failure and pregnancy loss caused by endometrial injury at present. The purpose of this study was to develop a rabbit model of endometrial mechanical injury that could provide a research platform for this difficult clinical predicament. Three experiments were conducted. Experiment 1: Curettages in both uterus horns and copper wire inserting after curettage (double-injury) in one horn. The histological changes were monitored at 0, 24, 48, 72 hours, as well as in 1 and 2 weeks after operation. Experiment 2: Direct copper wire inserting in one horn and double-injury in other horn. The wires in both horns were removed after 2 weeks. The histological changes were recorded at 0, 1 and 2 weeks after wire removal. Experiment 3: Double-injury procedure in one horn was performed and wire was removed after 2 weeks; another horn was remained normal to serve as control. Histological changes were recorded, tissue areas were measured, and proliferation indices (PIs, %) were calculated at 1, 2, 4 and 8 weeks after wire removal, respectively. The experiments revealed that the injured endometrium by simple curettage or copper wire could be fully repaired. While the endometrial regeneration was severely impaired by double-injury, both areas of endometrium and uterine cavity decreased (P < 0.05); both PIs of glandular epithelial and stromal cells increased and reached maximum at 4 weeks (P < 0.05), but returned by 8 weeks. This study demonstrated that a rabbit model of endometrial injury could be effectively established through a double-injury procedure of curettage and copper wire with comparable clinical index.

  16. Effect of gold wire bonding process on angular correlated color temperature uniformity of white light-emitting diode.

    PubMed

    Wu, Bulong; Luo, Xiaobing; Zheng, Huai; Liu, Sheng

    2011-11-21

    Gold wire bonding is an important packaging process of lighting emitting diode (LED). In this work, we studied the effect of gold wire bonding on the angular uniformity of correlated color temperature (CCT) in white LEDs whose phosphor layers were coated by freely dispersed coating process. Experimental study indicated that different gold wire bonding impacts the geometry of phosphor layer, and it results in different fluctuation trends of angular CCT at different spatial planes in one LED sample. It also results in various fluctuating amplitudes of angular CCT distributions at the same spatial plane for samples with different wire bonding angles. The gold wire bonding process has important impact on angular uniformity of CCT in LED package. © 2011 Optical Society of America

  17. Determination analaysis of the power losses of transformers with continuously transpored conductors (CTC) based fuzzy logic

    NASA Astrophysics Data System (ADS)

    Kaloko, Bambang Sri; Atsari, Erinna Dyah

    2017-03-01

    Electric motive force which flows into the iron core continuously on a plate - plate iron isolated may cause heat posed by current eddy (eddy current). No water loss occurs due to detainees on the circuit at the the flow of current load because this loss happened on the entanglement of the transformer is made of copper. Continuously Transposed Conductors (CTC) consist of a number of enameled rectangular wires (5-84 strands) made into an assembly. Each strand is transposed in turn to each position in the cable and is then covered with layers of insulation paper. Continuously Transposed Conductors are used in winding wires for medium and ultra high power transformers. CTC is manufactured by OFHC copper and indeed, is able to supply polyester roped. CTC which has been designed to reduce production cost, oil pocket and improve cooling efficiency. Hardened type CTC (CPR1, CPR2, and CPR3: BS1432) and Self-bonding CTC which can be used to improve mechanical and electrical strength are also available. This analysis is performed using the methods of fuzzy logic in taking account of the resources.

  18. 30 CFR 75.1323 - Blasting circuits.

    Code of Federal Regulations, 2013 CFR

    2013-07-01

    ...; (3) Have a resistance no greater than 20-gauge copper wire; and (4) Be not more than 30 feet long. (g..., copper wire of a diameter not smaller than 18-gauge; and (2) Long enough to permit the round to be fired... different manufacturers shall not be combined in the same blasting circuit. (c) Detonator leg wires shall be...

  19. 30 CFR 75.1323 - Blasting circuits.

    Code of Federal Regulations, 2012 CFR

    2012-07-01

    ...; (3) Have a resistance no greater than 20-gauge copper wire; and (4) Be not more than 30 feet long. (g..., copper wire of a diameter not smaller than 18-gauge; and (2) Long enough to permit the round to be fired... different manufacturers shall not be combined in the same blasting circuit. (c) Detonator leg wires shall be...

  20. 30 CFR 75.1323 - Blasting circuits.

    Code of Federal Regulations, 2014 CFR

    2014-07-01

    ...; (3) Have a resistance no greater than 20-gauge copper wire; and (4) Be not more than 30 feet long. (g..., copper wire of a diameter not smaller than 18-gauge; and (2) Long enough to permit the round to be fired... different manufacturers shall not be combined in the same blasting circuit. (c) Detonator leg wires shall be...

  1. Reliability improvement of 1 mil aluminum wire bonds for semiconductors, technical performance summary

    NASA Technical Reports Server (NTRS)

    1971-01-01

    The reliability of semiconductor devices as influenced by the reliability of wire bonds used in the assembly of the devices is investigated. The specific type of failure dealt with involves fracture of wire bonds as a result of repeated flexure of the wire at the heel of the bond when the devices are operated in an on-off mode. The mechanism of failure is one of induced fracture of the wire. To improve the reliability of a chosen transistor, one-mil diameter wires of aluminum with various alloy additions were studied using an accelerated fatigue testing machine. In addition, the electroprobe was used to study the metallurgy of the wires as to microstructure and kinetics of the growth of insoluble phases. Thermocompression and ultrasonic bonding techniques were also investigated.

  2. Transfer Efficiency and Cooling Cost by Thermal Loss based on Nitrogen Evaporation Method for Superconducting MAGLEV System

    NASA Astrophysics Data System (ADS)

    Chung, Y. D.; Kim, D. W.; Lee, C. Y.

    2017-07-01

    This paper presents the feasibility of technical fusion between wireless power transfer (WPT) and superconducting technology to improve the transfer efficiency and evaluate operating costs such as refrigerant consumption. Generally, in WPT technology, the various copper wires have been adopted. From this reason, the transfer efficiency is limited since the copper wires of Q value are intrinsically critical point. On the other hand, as superconducting wires keep larger current density and relatively higher Q value, the superconducting resonance coil can be expected as a reasonable option to deliver large transfer power as well as improve the transfer ratio since it exchanges energy at a much higher rate and keeps stronger magnetic fields out. However, since superconducting wires should be cooled indispensably, the cooling cost of consumed refrigerant for resonance HTS wires should be estimated. In this study, the transmission ratios using HTS resonance receiver (Rx) coil and various cooled and noncooled copper resonance Rx coils were presented under non cooled copper antenna within input power of 200 W of 370 kHz respectively. In addition, authors evaluated cooling cost of liquid nitrogen for HTS resonance coil and various cooled copper resonance coils based on nitrogen evaporation method.

  3. Decomposition of poly(amide-imide) film enameled on solid copper wire using atmospheric pressure non-equilibrium plasma.

    PubMed

    Sugiyama, Kazuo; Suzuki, Katsunori; Kuwasima, Shusuke; Aoki, Yosuke; Yajima, Tatsuhiko

    2009-01-01

    The decomposition of a poly(amide-imide) thin film coated on a solid copper wire was attempted using atmospheric pressure non-equilibrium plasma. The plasma was produced by applying microwave power to an electrically conductive material in a gas mixture of argon, oxygen, and hydrogen. The poly(amide-imide) thin film was easily decomposed by argon-oxygen mixed gas plasma and an oxidized copper surface was obtained. The reduction of the oxidized surface with argon-hydrogen mixed gas plasma rapidly yielded a metallic copper surface. A continuous plasma heat-treatment process using a combination of both the argon-oxygen plasma and argon-hydrogen plasma was found to be suitable for the decomposition of the poly(amide-imide) thin film coated on the solid copper wire.

  4. Preparation and characterization of copper-graphite composites by electrical explosion of wire in liquid.

    PubMed

    Bien, T N; Gul, W H; Bac, L H; Kim, J C

    2014-11-01

    Copper-graphite nanocomposites containing 5 vol.% graphite were prepared by a powder metallurgy route using an electrical wire explosion (EEW) in liquid method and spark plasma sintering (SPS) process. Graphite rods with a 0.3 mm diameter and copper wire with a 0.2 mm diameter were used as raw materials for EEWin liquid. To compare, a pure copper and copper-graphite mixture was also prepared. The fabricated graphite was in the form of a nanosheet, onto which copper particles were coated. Sintering was performed at 900 degrees C at a heating rate of 30 degrees C/min for 10 min and under a pressure of 70 MPa. The density of the sintered composite samples was measured by the Archimedes method. A wear test was performed by a ball-on-disc tribometer under dry conditions at room temperature in air. The presence of graphite effectively reduced the wear of composites. The copper-graphite nanocomposites prepared by EEW had lower wear rates than pure copper material and simple mixed copper-graphite.

  5. 75 FR 5103 - Notice of Intent to Repatriate Cultural Items: University of Nebraska State Museum, University of...

    Federal Register 2010, 2011, 2012, 2013, 2014

    2010-02-01

    ...-22-03-94); 1 group of copper alloy wire/cone earring fragments (A15419; 101-22-03-94); 1 copper alloy...; 101-22-03-94); 1 piece of lead wire (A15421; 101-22-03-65); 1 copper alloy brooch sewn onto a piece of... 6 copper loop/ ball earrings (identified as A04767; catalog number 101-22-03-94); 1 group of blue...

  6. Liquid Metal Machine Triggered Violin-Like Wire Oscillator.

    PubMed

    Yuan, Bin; Wang, Lei; Yang, Xiaohu; Ding, Yujie; Tan, Sicong; Yi, Liting; He, Zhizhu; Liu, Jing

    2016-10-01

    The first ever oscillation phenomenon of a copper wire embraced inside a self-powered liquid metal machine is discovered. When contacting a copper wire to liquid metal machine, it would be swallowed inside and then reciprocally moves back and forth, just like a violin bow. Such oscillation could be easily regulated by touching a steel needle on the liquid metal surface.

  7. Reliability improvement of wire bonds subjected to fatigue stresses.

    NASA Technical Reports Server (NTRS)

    Ravi, K. V.; Philofsky, E. M.

    1972-01-01

    The failure of wire bonds due to repeated flexure when semiconductor devices are operated in an on-off mode has been investigated. An accelerated fatigue testing apparatus was constructed and the major fatigue variables, aluminum alloy composition, and bonding mechanism, were tested. The data showed Al-1% Mg wires to exhibit superior fatigue characteristics compared to Al-1% Cu or Al-1% Si and ultrasonic bonding to be better than thermocompression bonding for fatigue resistance. Based on these results highly reliable devices were fabricated using Al-1% Mg wire with ultrasonic bonding which withstood 120,000 power cycles with no failures.

  8. Comparison of three different orthodontic wires for bonded lingual retainer fabrication

    PubMed Central

    Uysal, Tancan; Gul, Nisa; Alan, Melike Busra; Ramoglu, Sabri Ilhan

    2012-01-01

    Objective We evaluated the detachment force, amount of deformation, fracture mode, and pull-out force of 3 different wires used for bonded lingual retainer fabrication. Methods We tested 0.0215-inch five-stranded wire (PentaOne, Masel; group I), 0.016 × 0.022-inch dead-soft eight-braided wire (Bond-A-Braid, Reliance; group II), and 0.0195-inch dead-soft coaxial wire (Respond, Ormco; group III). To test detachment force, deformation, and fracture mode, we embedded 94 lower incisor teeth in acrylic blocks in pairs. Retainer wires were bonded to the teeth and vertically directed force was applied to the wire. To test pull-out force, wires were embedded in composite that was placed in a hole at the center of an acrylic block. Tensile force was applied along the long axis of the wire. Results Detachment force and mode of fracture were not different between groups. Deformation was significantly higher in groups II and III than in group I (p < 0.001). Mean pull-out force was significantly higher for group I compared to groups II and III (p < 0.001). Conclusions Detachment force and fracture mode were similar for all wires, but greater deformations were seen in dead-soft wires. Wire pull-out force was significantly higher for five-stranded coaxial wire than for the other wires tested. Five-stranded coaxial wires are suggested for use in bonded lingual retainers. PMID:23112930

  9. Electrical wire explosion process of copper/silver hybrid nano-particle ink and its sintering via flash white light to achieve high electrical conductivity.

    PubMed

    Chung, Wan-Ho; Hwang, Yeon-Taek; Lee, Seung-Hyun; Kim, Hak-Sung

    2016-05-20

    In this work, combined silver/copper nanoparticles were fabricated by the electrical explosion of a metal wire. In this method, a high electrical current passes through the metal wire with a high voltage. Consequently, the metal wire evaporates and metal nanoparticles are formed. The diameters of the silver and copper nanoparticles were controlled by changing the voltage conditions. The fabricated silver and copper nano-inks were printed on a flexible polyimide (PI) substrate and sintered at room temperature via a flash light process, using a xenon lamp and varying the light energy. The microstructures of the sintered silver and copper films were observed using a scanning electron microscope (SEM) and a transmission electron microscope (TEM). To investigate the crystal phases of the flash-light-sintered silver and copper films, x-ray diffraction (XRD) was performed. The absorption wavelengths of the silver and copper nano-inks were measured using ultraviolet-visible spectroscopy (UV-vis). Furthermore, the resistivity of the sintered silver and copper films was measured using the four-point probe method and an alpha step. As a result, the fabricated Cu/Ag film shows a high electrical conductivity (4.06 μΩcm), which is comparable to the resistivity of bulk copper (1.68 μΩcm). In addition, the fabricated Cu/Ag nanoparticle film shows superior oxidation stability compared to the Cu nanoparticle film.

  10. A cryogenic thermal source for detector array characterization

    NASA Astrophysics Data System (ADS)

    Chuss, David T.; Rostem, Karwan; Wollack, Edward J.; Berman, Leah; Colazo, Felipe; DeGeorge, Martin; Helson, Kyle; Sagliocca, Marco

    2017-10-01

    We describe the design, fabrication, and validation of a cryogenically compatible quasioptical thermal source for characterization of detector arrays. The source is constructed using a graphite-loaded epoxy mixture that is molded into a tiled pyramidal structure. The mold is fabricated using a hardened steel template produced via a wire electron discharge machining process. The absorptive mixture is bonded to a copper backplate enabling thermalization of the entire structure and measurement of the source temperature. Measurements indicate that the reflectance of the source is <0.001 across a spectral band extending from 75 to 330 GHz.

  11. A Cryogenic Thermal Source for Detector Array Characterization

    NASA Technical Reports Server (NTRS)

    Chuss, David T.; Rostem, Karwan; Wollack, Edward J.; Berman, Leah; Colazo, Felipe; DeGeorge, Martin; Helson, Kyle; Sagliocca, Marco

    2017-01-01

    We describe the design, fabrication, and validation of a cryogenically compatible quasioptical thermal source for characterization of detector arrays. The source is constructed using a graphite-loaded epoxy mixture that is molded into a tiled pyramidal structure. The mold is fabricated using a hardened steel template produced via a wire electron discharge machining process. The absorptive mixture is bonded to a copper backplate enabling thermalization of the entire structure and measurement of the source temperature. Measurements indicate that the reflectance of the source is less than 0.001 across a spectral band extending from 75 to 330 gigahertz.

  12. Single-step laser deposition of functionally graded coating by dual ‘wire powder’ or ‘powder powder’ feeding—A comparative study

    NASA Astrophysics Data System (ADS)

    Syed, Waheed Ul Haq; Pinkerton, Andrew J.; Liu, Zhu; Li, Lin

    2007-07-01

    The creation of iron-copper (Fe-Cu) alloys has practical application in improving the surface heat conduction and corrosion resistance of, for example, conformal cooling channels in steel moulds, but is difficult to achieve because the elements have got low inter-solubility and are prone to solidification cracking. Previous work by these authors has reported a method to produce a graded iron-nickel-copper coating in a single-step by direct diode laser deposition (DLD) of nickel wire and copper powder as a combined feedstock. This work investigates whether dual powder feeds can be used in that process to afford greater geometric flexibility and compares attributes of the 'nickel wire and copper powder' and 'nickel powder and copper powder' processes for deposition on a H13 tool steel substrate. In wire-powder deposition, a higher temperature developed in the melt pool causing a clad with a smooth gradient structure. The nickel powder in powder-powder deposition did not impart much heat into the melt pool so the melt pool solidified with sharp composition boundaries due to single metal melting in some parts. In wire-powder experiments, a graded structure was obtained by varying the flow rates of wire and powder. However, a graded structure was not realised in powder-powder experiments by varying either the feed or the directions. Reasons for the differences and flow patterns in the melt pools and their effect on final part properties of parts produced are discussed.

  13. Fine pitch thermosonic wire bonding: analysis of state-of-the-art manufacturing capability

    NASA Astrophysics Data System (ADS)

    Cavasin, Daniel

    1995-09-01

    A comprehensive process characterization was performed at the Motorola plastic package assembly site in Selangor, Malaysia, to document the current fine pitch wire bond process capability, using state-of-the-art equipment, in an actual manufacturing environment. Two machines, representing the latest technology from two separate manufacturers, were operated one shift per day for five days, bonding a 132 lead Plastic Quad Flat Pack. Using a test device specifically designed for fine pitch wire bonding, the bonding programs were alternated between 107 micrometers and 92 micrometers pad pitch, running each pitch for a total of 1600 units per machine. Wire, capillary type, and related materials were standardized and commercially available. A video metrology measurement system, with a demonstrated six sigma repeatability band width of 0.51 micrometers , was utilized to measure the bonded units for bond dimensions and placement. Standard Quality Assurance (QA) metrics were also performed. Results indicate that state-of-the-art thermosonic wire bonding can achieve acceptable assembly yields at these fine pad pitches.

  14. The importance of carbon nanotube wire density, structural uniformity, and purity for fabricating homogeneous carbon nanotube-copper wire composites by copper electrodeposition

    NASA Astrophysics Data System (ADS)

    Sundaram, Rajyashree; Yamada, Takeo; Hata, Kenji; Sekiguchi, Atsuko

    2018-04-01

    We present the influence of density, structural regularity, and purity of carbon nanotube wires (CNTWs) used as Cu electrodeposition templates on fabricating homogeneous high-electrical performance CNT-Cu wires lighter than Cu. We show that low-density CNTWs (<0.6 g/cm3 for multiwall nanotube wires) with regular macro- and microstructures and high CNT content (>90 wt %) are essential for making homogeneous CNT-Cu wires. These homogeneous CNT-Cu wires show a continuous Cu matrix with evenly mixed nanotubes of high volume fractions (˜45 vol %) throughout the wire-length. Consequently, the composite wires show densities ˜5.1 g/cm3 (33% lower than Cu) and electrical conductivities ˜6.1 × 104 S/cm (>100 × CNTW conductivity). However, composite wires from templates with higher densities or structural inconsistencies are non-uniform with discontinuous Cu matrices and poor CNT/Cu mixing. These non-uniform CNT-Cu wires show conductivities 2-6 times lower than the homogeneous composite wires.

  15. Diminishing detonator effectiveness through electromagnetic effects

    DOEpatents

    Schill, Jr, Robert A.

    2016-09-20

    An inductively coupled transmission line with distributed electromotive force source and an alternative coupling model based on empirical data and theory were developed to initiate bridge wire melt for a detonator with an open and a short circuit detonator load. In the latter technique, the model was developed to exploit incomplete knowledge of the open circuited detonator using tendencies common to all of the open circuit loads examined. Military, commercial, and improvised detonators were examined and modeled. Nichrome, copper, platinum, and tungsten are the detonator specific bridge wire materials studied. The improvised detonators were made typically made with tungsten wire and copper (.about.40 AWG wire strands) wire.

  16. Enamel Insulated Copper Wire in Electric Motors: Sliding Behavior and Possible Damage Mechanisms During Die Bending

    NASA Astrophysics Data System (ADS)

    Demiri, Albion

    This study investigates the sliding friction and the forming behaviour of enamel insulated copper wire during the die-forming process. It also aims to determine potential damage mechanisms to the wire during bending process for electric motor coils. In this investigation a wire-bending machine was designed and built in order to simulate the wire forming process in a laboratory scale. Bending angle of the wire and the bending radii were used to control the strain on the wire surface. The effect of speed on COF was investigated for different speeds of of 1, 5, 10, 15, and 20mm/s. A positive correlation was observed between the COF and the testing speed. Additionally, the effect of strain on COF was studied for 2% and 23% to determine its influence on the COF. A general trend was observed of decreased COF with increased strain in wires. Finally, the ability of the enamel coating to resist external damage and wire strain was investigated by tensile testing of pre-scratched magnet wire. The results showed that wire enamel can withstand significant surface damage prior to breach and failure. The insulating polymer coating failed under the scratch tests at 20N load using a Rockwell indenter and at 5N load using a 90° conical steel indenter. Additional tests, such as tensile testing, scratch testing and reciprocating friction testing, were used to characterize the mechanical and tribological properties of the enamel insulated copper wire.

  17. Phase transformation changes in thermocycled nickel-titanium orthodontic wires.

    PubMed

    Berzins, David W; Roberts, Howard W

    2010-07-01

    In the oral environment, orthodontic wires will be subject to thermal fluctuations. The purpose of this study was to investigate the effect of thermocycling on nickel-titanium (NiTi) wire phase transformations. Straight segments from single 27 and 35 degrees C copper NiTi (Ormco), Sentalloy (GAC), and Nitinol Heat Activated (3M Unitek) archwires were sectioned into 5mm segments (n=20). A control group consisted of five randomly selected non-thermocycled segments. The remaining segments were thermocycled between 5 and 55 degrees C with five randomly selected segments analyzed with differential scanning calorimetry (DSC; -100<-->150 degrees C at 10 degrees C/min) after 1000, 5000, and 10,000 cycles. Thermal peaks were evaluated with results analyzed via ANOVA (alpha=0.05). Nitinol HA and Sentalloy did not demonstrate qualitative or quantitative phase transformation behavior differences. Significant differences were observed in some of the copper NiTi transformation temperatures, as well as the heating enthalpy with the 27 degrees C copper NiTi wires (p<0.05). Qualitatively, with increased thermocycling the extent of R-phase in the heating peaks decreased in the 35 degrees C copper NiTi, and an austenite to martensite peak shoulder developed during cooling in the 27 degrees C copper NiTi. Repeated temperature fluctuations may contribute to qualitative and quantitative phase transformation changes in some NiTi wires. Copyright 2010 Academy of Dental Materials. All rights reserved.

  18. Comparative Reliability Studies and Analysis of Au, Pd-Coated Cu and Pd-Doped Cu Wire in Microelectronics Packaging

    PubMed Central

    Chong Leong, Gan; Uda, Hashim

    2013-01-01

    This paper compares and discusses the wearout reliability and analysis of Gold (Au), Palladium (Pd) coated Cu and Pd-doped Cu wires used in fineline Ball Grid Array (BGA) package. Intermetallic compound (IMC) thickness measurement has been carried out to estimate the coefficient of diffusion (Do) under various aging conditions of different bonding wires. Wire pull and ball bond shear strengths have been analyzed and we found smaller variation in Pd-doped Cu wire compared to Au and Pd-doped Cu wire. Au bonds were identified to have faster IMC formation, compared to slower IMC growth of Cu. The obtained weibull slope, β of three bonding wires are greater than 1.0 and belong to wearout reliability data point. Pd-doped Cu wire exhibits larger time-to-failure and cycles-to-failure in both wearout reliability tests in Highly Accelerated Temperature and Humidity (HAST) and Temperature Cycling (TC) tests. This proves Pd-doped Cu wire has a greater potential and higher reliability margin compared to Au and Pd-coated Cu wires. PMID:24244344

  19. CSSC Fish Barrier Simulated Rescuer Touch Point Results, Operating Guidance, and Recommendations for Rescuer Safety

    DTIC Science & Technology

    2011-09-01

    Testing Input electrodes consisting of 1/2” diameter, 6” long copper rods were wired to separate conductors of a shielded, commercially available...underwater-rated electrical cable (three-conductor, shielded, shipboard cable (TSS-2), 18 American Wire Gauge (AWG) stranded copper ). Electrode pairs...sandpaper prior to use to ensure the best electrical continuity between the water and electrode by removing any copper oxide. This electrode

  20. A comparison study of exploding a Cu wire in air, water, and solid powders

    NASA Astrophysics Data System (ADS)

    Han, Ruoyu; Wu, Jiawei; Ding, Weidong; Zhou, Haibin; Qiu, Aici; Wang, Yanan

    2017-11-01

    In this paper, an experimental study on exploding a copper wire in air, water, incombustible powders, and energetic materials is performed. We examined the effects of the surrounding media on the explosion process and its related phenomena. Experiments were first carried out with copper wire explosions driven by microsecond timescale pulsed currents in air, water, and the half-half case. Then, the copper wires were exploded in air, water, SiO2 powders, quartz sand, NaCl powders, and energetic-material cylinders, respectively. Our experimental results indicated that the explosion process was significantly influenced by the surrounding media, resulting in noticeable differences in energy deposition, optical emission, and shock waves. In particular, incombustible powders could throttle the current flow completely when a fine wire was adopted. We also found that an air or incombustible-powder layer could drastically attenuate the shock wave generated by a wire explosion. As for energetic-material loads, obvious discrepancies were found in voltage/current waveforms from vaporization when compared with a wire explosion in air/water, which meant the metal vapor/liquid drops play a significant role in the ignition process.

  1. Efficacy of copper oxide wire particles against gastrointestinal nematodes in sheep and goats

    USDA-ARS?s Scientific Manuscript database

    Economic sheep and goat production in the USA is severely limited by gastrointestinal nematode (GIN) parasitism, particularly by Haemonchus contortus, a highly pathogenic blood-feeder. Copper oxide wire particles (COWP) have anti-parasitic properties in the diet of small ruminants, but efficacy of ...

  2. Development and Status of Cu Ball/Wedge Bonding in 2012

    NASA Astrophysics Data System (ADS)

    Schneider-Ramelow, Martin; Geißler, Ute; Schmitz, Stefan; Grübl, Wolfgang; Schuch, Bernhard

    2013-03-01

    Starting in the 1980s and continuing right into the last decade, a great deal of research has been published on Cu ball/wedge (Cu B/W) wire bonding. Despite this, the technology has not been established in industrial manufacturing to any meaningful extent. Only spikes in the price of Au, improvements in equipment and techniques, and better understanding of the Cu wire-bonding process have seen Cu B/W bonding become more widespread—initially primarily for consumer goods manufacturing. Cu wire bonding is now expected to soon be used for at least 20% of all ball/wedge-bonded components, and its utilization in more sophisticated applications is around the corner. In light of this progress, the present paper comprehensively reviews the existing literature on this topic and discusses wire-bonding materials, equipment, and tools in the ongoing development of Cu B/W bonding technology. Key bonding techniques, such as flame-off, how to prevent damage to the chip (cratering), and bond formation on various common chip and substrate finishes are also described. Furthermore, apart from discussing quality assessment of Cu wire bonds in the initial state, the paper also provides an overview of Cu bonding reliability, in particular regarding Cu balls on Al metalization at high temperatures and in humidity (including under the influence of halide ions).

  3. Adhesive bonding of wood treated with ACQ and copper azole preservatives

    Treesearch

    Linda F. Lorenz; Charles Frihart

    2006-01-01

    Treated wood has generally been more difficult to bond than untreated wood for a variety of reasons. Alkaline copper quat (ACQ) and copper azole (CA-B), the most prominent substitutes for chromated copper arsenate (CCA), are difficult to bond consistently. Using a phenol-resorcinol- formaldehyde (PRF) adhesive formulated for bonding to CCA-treated wood, we examined the...

  4. Shear bond strength of different retainer wires and bonding adhesives in consideration of the pretreatment process.

    PubMed

    Reicheneder, Claudia; Hofrichter, Bernd; Faltermeier, Andreas; Proff, Peter; Lippold, Carsten; Kirschneck, Christian

    2014-11-28

    We aimed to compare the shear bond strength (SBS) of three different retainer wires and three different bonding adhesives in consideration of the pretreatment process of enamel surface sandblasting. 400 extracted bovine incisors were divided into 10 groups of 20 paired specimens each. 10 specimens of each group were pretreated by enamel sandblasting. The retainer wires Bond-A-Braid™, GAC-Wildcat®-Twistflex and everStick®ORTHO were bonded to the teeth with the adhesives Transbond™-LR, Tetric-EvoFlow™ and Stick®FLOW and then debonded measuring the SBS. While sandblasting generally increased SBS for all tested combinations, the retainer wires bonded with Transbond™-LR showed the highest SBS both with and without prior sandblasting. Significantly lower SBS were found for Tetric-EvoFlow™ that were comparable to those for everStick®ORTHO. Pretreatment of enamel surfaces by sandblasting increased the SBS of all retainer-wires. Transbond™-LR showed the best results compared to Tetric-EvoFlow™ and everStick®ORTHO, while all combinations used provided sufficient bonding strengths for clinical use.

  5. Method of making V.sub.3 Ga superconductors

    DOEpatents

    Dew-Hughes, David

    1980-01-01

    An improved method for producing a vanadium-gallium superconductor wire having aluminum as a component thereof is disclosed, said wire being encased in a gallium bearing copper sheath. The superconductors disclosed herein may be fabricated under normal atmospheres and room temperatures by forming a tubular shaped billet having a core composed of an alloy of vanadium and aluminum and an outer sheath composed of an alloy of copper, gallium and aluminum. Thereafter the entire billet is swage reduced to form a wire therefrom and heat treated to form a layer of V.sub.3 Ga in the interior of the wire.

  6. DOE Office of Scientific and Technical Information (OSTI.GOV)

    Wereszczak, Andrew A.; Emily Cousineau, J.; Bennion, Kevin

    The apparent thermal conductivity of packed copper wire test specimens was measured parallel and perpendicular to the axis of the wire using laser flash, transient plane source, and transmittance test methods. Approximately 50% wire packing efficiency was produced in the specimens using either 670- or 925-μm-diameter copper wires that both had an insulation coating thickness of 37 μm. The interstices were filled with a conventional varnish material and also contained some remnant porosity. The apparent thermal conductivity perpendicular to the wire axis was about 0.5–1 W/mK, whereas it was over 200 W/mK in the parallel direction. The Kanzaki model andmore » an finite element analysis (FEA) model were found to reasonably predict the apparent thermal conductivity perpendicular to the wires but thermal conductivity percolation from nonideal wire-packing may result in their underestimation of it.« less

  7. Blanch Resistant and Thermal Barrier NiAl Coating Systems for Advanced Copper Alloys

    NASA Technical Reports Server (NTRS)

    Raj, Sai V. (Inventor)

    2005-01-01

    A method of forming an environmental resistant thermal barrier coating on a copper alloy is disclosed. The steps include cleansing a surface of a copper alloy, depositing a bond coat on the cleansed surface of the copper alloy, depositing a NiAl top coat on the bond coat and consolidating the bond coat and the NiAl top coat to form the thermal barrier coating. The bond coat may be a nickel layer or a layer composed of at least one of copper and chromium-copper alloy and either the bond coat or the NiAl top coat or both may be deposited using a low pressure or vacuum plasma spray.

  8. Process Of Bonding Copper And Tungsten

    DOEpatents

    Slattery, Kevin T.; Driemeyer, Daniel E.; Davis, John W.

    2000-07-18

    Process for bonding a copper substrate to a tungsten substrate by providing a thin metallic adhesion promoting film bonded to a tungsten substrate and a functionally graded material (FGM) interlayer bonding the thin metallic adhesion promoting film to the copper substrate. The FGM interlayer is formed by sintering a stack of individual copper and tungsten powder blend layers having progressively higher copper content/tungsten content, by volume, ratio values in successive powder blend layers in a lineal direction extending from the tungsten substrate towards the copper substrate. The resulting copper to tungsten joint well accommodates the difference in the coefficient of thermal expansion of the materials.

  9. Thermal Measurements of Packed Copper Wire Enables Better Electric Motor

    Science.gov Websites

    transmittance characterization methods both parallel and perpendicular to the axis. A measurement of apparent from all three test methods indicated that the k_app of the packed copper wire was significantly higher methods for examining the thermal impact of new materials for winding structures relevant to motor

  10. Examination of commercially available copper oxide wire particles in combination with albendazole for control of gastrointestinal nematodes in lambs

    USDA-ARS?s Scientific Manuscript database

    Alternatives to synthetic anthelmintics remain critical due to the prevalence of anthelmintic resistance. The objective of the experiment was to determine the efficacy of copper oxide wire particles (COWP) from three commercial sources to control Haemonchus contortus in lambs. Naturally infected Ka...

  11. Spontaneous and Directional Bubble Transport on Porous Copper Wires with Complex Shapes in Aqueous Media.

    PubMed

    Li, Wenjing; Zhang, Jingjing; Xue, Zhongxin; Wang, Jingming; Jiang, Lei

    2018-01-24

    Manipulation of gas bubble behaviors is crucial for gas bubble-related applications. Generally, the manipulation of gas bubble behaviors generally takes advantage of their buoyancy force. It is very difficult to control the transportation of gas bubbles in a specific direction. Several approaches have been developed to collect and transport bubbles in aqueous media; however, most reliable and effective manipulation of gas bubbles in aqueous media occurs on the interfaces with simple shapes (i.e., cylinder and cone shapes). Reliable strategies for spontaneous and directional transport of gas bubbles on interfaces with complex shapes remain enormously challenging. Herein, a type of 3D gradient porous network was constructed on copper wire interfaces, with rectangle, wave, and helix shapes. The superhydrophobic copper wires were immersed in water, and continuous and stable gas films then formed on the interfaces. With the assistance of the Laplace pressure gradient between two bubbles, gas bubbles (including microscopic gas bubbles) in the aqueous media were subsequently transported, continuously and directionally, on the copper wires with complex shapes. The small gas bubbles always moved to the larger ones.

  12. 77 FR 5728 - Airworthiness Directives; Airbus Airplanes

    Federal Register 2010, 2011, 2012, 2013, 2014

    2012-02-06

    ... between bonding lead and the harness, due to over length of the bonding lead. As the affected wire is not... chafing of the wires, and corrective actions, if necessary. We are proposing this AD to detect and correct contact or chafing of wires and bonding leads which, if not detected could be a source of sparks in the...

  13. 46 CFR 129.340 - Cable and wiring.

    Code of Federal Regulations, 2011 CFR

    2011-10-01

    ... buildup of condensation. (b) Each cable and wire must— (1) Have stranded copper conductors with sufficient... Power Sources and Distribution Systems § 129.340 Cable and wiring. (a) If individual wires, rather than cables, are used in systems operating at a potential of greater than 50 volts, the wire and associated...

  14. 46 CFR 129.340 - Cable and wiring.

    Code of Federal Regulations, 2013 CFR

    2013-10-01

    ... buildup of condensation. (b) Each cable and wire must— (1) Have stranded copper conductors with sufficient... Power Sources and Distribution Systems § 129.340 Cable and wiring. (a) If individual wires, rather than cables, are used in systems operating at a potential of greater than 50 volts, the wire and associated...

  15. 46 CFR 129.340 - Cable and wiring.

    Code of Federal Regulations, 2014 CFR

    2014-10-01

    ... buildup of condensation. (b) Each cable and wire must— (1) Have stranded copper conductors with sufficient... Power Sources and Distribution Systems § 129.340 Cable and wiring. (a) If individual wires, rather than cables, are used in systems operating at a potential of greater than 50 volts, the wire and associated...

  16. 46 CFR 129.340 - Cable and wiring.

    Code of Federal Regulations, 2012 CFR

    2012-10-01

    ... buildup of condensation. (b) Each cable and wire must— (1) Have stranded copper conductors with sufficient... Power Sources and Distribution Systems § 129.340 Cable and wiring. (a) If individual wires, rather than cables, are used in systems operating at a potential of greater than 50 volts, the wire and associated...

  17. [XPS analysis of beads formed by fuse breaking of electric copper wire].

    PubMed

    Wu, Ying; Meng, Qing-Shan; Wang, Xin-Ming; Gao, Wei; Di, Man

    2010-05-01

    The in-depth composition of beads formed by fuse breaking of the electric copper wire in different circumstances was studied by XPS with Ar+ ion sputtering. In addition, the measured Auger spectra and the calculated Auger parameters were compared for differentiation of the substances of Cu and Cu2O. Corresponding to the sputtering depth, the molten product on a bead induced directly by fuse breaking of the copper wire without cover may be distinguished as three portions: surface layer with a drastic decrease in carbon content; intermediate layer with a gentle change in oxygen content and gradually diminished carbon peak, and consisting of Cu2O; transition layer without Cu2O and with a rapid decrease in oxygen content. While the molten product on a bead formed by fuse breaking of the copper wire after its insulating cover had been burned out may be distinguished as two portions: surface layer with carbon content decreasing quickly; subsurface layer without Cu2O and with carbon and oxygen content decreasing gradually. Thus, it can be seen that there was an obvious interface between the layered surface product and the substrate for the first type of bead, while as to the second type of bead there was no interface. As a result, the presence of Cu2O and the quantitative results can be used to identify the molten product on a bead induced directly by fuse breaking of the copper wire without cover and the molten product on a bead formed by fuse breaking of the cupper wire after its insulating cover had been burned out, as a complementary technique for the judgments of fire cause.

  18. CSSC Fish Barrier Simulated Rescuer Touch Point Results, Operating Guidance, and Recommendations for Rescuer Safety

    DTIC Science & Technology

    2011-03-01

    Mile per hour ms Millisecond NEDU Navy Experimental Diving Unit PFD Personal flotation device PIW Person in the water PVC Polyvinyl chloride RDC...electrically resistive, yet conductive, clay. We then encapsulated the clay around a 1/2” diameter, 6-inch long copper rod, and then tightly wrapped it with...short length of 12 American Wire Gauge (AWG) stranded copper wire to the copper rod within each electrode. For each electrode pair, we joined

  19. The Influence of Pd-Doped Au Wire Bonding on HAZ Microstructure and Looping Profile in Micro-Electromechanical Systems (MEMS) Packaging

    NASA Astrophysics Data System (ADS)

    Ismail, Roslina; Omar, Ghazali; Jalar, Azman; Majlis, Burhanuddin Yeop

    2015-07-01

    Wire bonding processes has been widely adopted in micro-electromechanical systems (MEMS) packaging especially in biomedical devices for the integration of components. In the first process sequence in wire bonding, the zone along the wire near the melted tips is called the heat-affected zone (HAZ). The HAZ plays an important factor that influenced the looping profiles of wire bonding process. This paper investigates the effect of dopants on microstructures in the HAZ. One precent palladium (Pd) was added to the as-drawn 4N gold wire and annealed at 600°C. The addition of Pd was able to moderate the grain growth in the HAZ by retarding the heat propagation to the wire. In the formation of the looping profile, the first bending point of the looping is highly associated with the length of the HAZ. The alloyed gold wire (2N gold) has a sharp angle at a distance of about 30 m from the neck of the wire with a measured bending radius of about 40 mm and bending angle of about 40° clockwise from vertical axis, while the 4N gold wire bends at a longer distance. It also shows that the HAZ for 4N gold is longer than 2N gold wire.

  20. Influence of aluminum oxide film on thermocompression bonding of gold wire to evaporated aluminum film

    NASA Technical Reports Server (NTRS)

    Iwata, S.; Ishizaka, A.; Yamamoto, H.

    1984-01-01

    The influence of Al surface condition on the thermocompression bonding of Au wires to Al electrodes for integrated electric circuits was studied. Au wires were connected to Al electrodes by nail-head bonding after various Al surface treatments. Bonding was evaluated by measuring the wire pull strength and fraction of the number of failures at Au-Al bonds to the total number of failures. Dependence of the fraction on applied load was derived theoretically with a parameter named critical load to take into consideration the differences in Al surface condition. The relation also held explicately for various surface treatments. Characterization of the Al surface was carried out by electron microscopy for chemical analysis.

  1. Prediction of Central Burst Defects in Copper Wire Drawing Process

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Vega, G.; NEXANS France, NMC Nexans Metallurgy Centre, Boulevard du Marais, BP39, F-62301 Lens; Haddi, A.

    2011-01-17

    In this study, the prediction of chevron cracks (central bursts) in copper wire drawing process is investigated using experimental and numerical approaches. The conditions of the chevron cracks creation along the wire axis depend on (i) the die angle, the friction coefficient between the die and the wire, (ii) the reduction in crosssectional area of the wire, (iii) the material properties and (iv) the drawing velocity or strain rate. Under various drawing conditions, a numerical simulation for the prediction of central burst defects is presented using an axisymmetric finite element model. This model is based on the application of themore » Cockcroft and Latham fracture criterion. This criterion was used as the damage value to estimate if and where defects will occur during the copper wire drawing. The critical damage value of the material is obtained from a uniaxial tensile test. The results show that the die angle and the reduction ratio have a significant effect on the stress distribution and the maximum damage value. The central bursts are expected to occur when the die angle and reduction ratio reach a critical value. Numerical predictions are compared with experimental observations.« less

  2. Process Of Bonding Copper And Tungsten

    DOEpatents

    Slattery, Kevin T.; Driemeyer, Daniel E.

    1999-11-23

    Process for bonding a copper substrate to a tungsten substrate by providing a thin metallic adhesion promoting film bonded to a tungsten substrate and a functionally graded material (FGM) interlayer bonding the thin metallic adhesion promoting film to the copper substrate. The FGM interlayer is formed by thermal plasma spraying mixtures of copper powder and tungsten powder in a varied blending ratio such that the blending ratio of the copper powder and the tungsten powder that is fed to a plasma torch is intermittently adjusted to provide progressively higher copper content/tungsten content, by volume, ratio values in the interlayer in a lineal direction extending from the tungsten substrate towards the copper substrate. The resulting copper to tungsten joint well accommodates the difference in the coefficient of thermal expansion of the materials.

  3. High reliability bond program using small diameter aluminum wire

    NASA Technical Reports Server (NTRS)

    Macha, M.; Thiel, R. A.

    1975-01-01

    The program was undertaken to characterize the performance of small diameter aluminum wire ultrasonically bonded to conductors commonly encountered in hybrid assemblies, and to recommend guidelines for improving this performance. Wire, 25.4, 38.1 and 50.8 um (1, 1.5 and 2 mil), was used with bonding metallization consisting of thick film gold, thin film gold and aluminum as well as conventional aluminum pads on semiconductor chips. The chief tool for evaluating the performance was the double bond pull test in conjunction with a 72 hour - 150 C heat soak and -65 C to +150 C thermal cycling. In practice the thermal cycling was found to have relatively little effect compared to the heat soak. Pull strength will decrease after heat soak as a result of annealing of the aluminum wire; when bonded to thick film gold, the pull strength decreased by about 50% (weakening of the bond interface was the major cause of the reduction). Bonds to thin film gold lost about 30 - 40% of their initial pull strenth; weakening of the wire itself at the bond heel was the predominant cause. Bonds to aluminum substrate metallization lost only about 22%. Bonds between thick and thin film gold substrate metallization and semiconductor chips substantiated the previous conclusions but also showed that in about 20 to 25% of the cases, bond interface failure occurred at the semiconductor chip.

  4. A Comparative Study of Bio Degradation of Various Orthodontic Arch Wires: An In Vitro Study

    PubMed Central

    Gopikrishnan, S; Melath, Anil; Ajith, V V; Mathews, N Binoy

    2015-01-01

    Background: Orthodontic wires are the corner stones of the science and art of orthodontics and they remain in the patient’s mouth for a prolonged period of 18-24 months. It is but natural to expect that they will undergo some biodegradation when in the oral environment during that period. This study aims to compare the biodegradation characteristics of four different orthodontic wires, stainless steel, nickel titanium (NiTi), titanium molybdenum alloy (TMA), and copper NiTi and to assess whether these biodegradation products, are within acceptable limits. Materials and Methods: This study involved the incubation of four different wires in artificial saliva and analyzing the amount of metal released from them at the end of a 28 days study period. The metals analyzed for where nickel, chromium, copper, cobalt, manganese, iron, molybdenum, and titanium. The artificial saliva was changed on days 7, 14, and 21 to prevent the saturation of metals in the artificial saliva. At the end of 28 days, these four samples of artificial saliva of each wire were mixed together and analyzed for the eight metals using an inductively coupled plasma spectroscope. Results: The results showed only the release of nickel, chromium, and iron from stainless steel wire, nickel from NiTi wire, nickel, and chromium from copper NiTi and none from TMA wire. Conclusion: The metals released from arch wires are of such minute quantities to be of any biologic hazard. The amount of metals released is well within acceptable biocompatible limits. Though this study has analyzed the biodegradation of various orthodontic wires, orthodontic wires are never used alone in mechanotherapy. Orthodontic wires along with multiband appliance system with which it is always used and in combination with accessories like face bows may release more metals. PMID:25709360

  5. Tensile test and interface retention forces between wires and composites in lingual fixed retainers.

    PubMed

    Paolone, Maria Giacinta; Kaitsas, Roberto; Obach, Patricia; Kaitsas, Vasilios; Benedicenti, Stefano; Sorrenti, Eugenio; Barberi, Fabrizio

    2015-06-01

    In daily orthodontic clinical practice retention is very important, and lingual retainers are part of this challenge. The failure of lingual retainers may be due to many factors. The aim of this study was to assess the retention forces and mechanical behavior of different types of wires matched with different kinds of composites in lingual retainers. A tensile test was performed on cylindrical composite test specimens bonded to orthodontic wires. The specimens were constructed using four different wires: a straight wire (Remanium .016×.022″ Dentaurum), two round twisted wires (Penta One .0215″ Masel, Gold Penta Twisted .0215″ Gold N'braces) and a rectangular braided wire (D-Rect .016×.022″ Ormco); and three composites: two micro-hybrids (Micro-Hybrid Enamel Plus HFO Micerium, and Micro-Hybrid SDR U Dentsply) and a micro-nano-filled composite (Micro-Nano-Filled Transbond LR 3M). The test was performed at a speed of 10mm/min on an Inström device. The wire was fixed with a clamp. The results showed that the bonding between wires and composites in lingual fixed retainers seemed to be lowest for rectangular smooth wires and increased in round twisted and rectangular twisted wires where the bonding was so strong that the maximum tension/bond strength was greater than the ultimate tensile strength of the wire. The highest values were in rectangular twisted wires. Concerning the composites, hybrid composites had the lowest interface bonding values and broke very quickly, while the nano- and micro-composites tolerated stronger forces and displayed higher bonding values. The best results were observed with the golden twisted wire and reached 21.46 MPa with the Transbond composite. With the rectangular braided wire the retention forces were so high that the Enamel Plus composite fractured when the load exceeded 154.6 N/MPa. When the same wire was combined with the Transbond LR either the wire or the composite broke when the force exceeded 240 N. The results of this study show that, when selecting a lingual retainer in daily clinical practice, not only must the patient's compliance and dependability be considered but also the mechanical properties and composition of different combinations of composites and wires. Copyright © 2015 CEO. Published by Elsevier Masson SAS. All rights reserved.

  6. Strategies to Reduce Tin and Other Metals in Electronic Cigarette Aerosol

    PubMed Central

    Williams, Monique; To, An; Bozhilov, Krassimir; Talbot, Prue

    2015-01-01

    Background Metals are present in electronic cigarette (EC) fluid and aerosol and may present health risks to users. Objective The objective of this study was to measure the amounts of tin, copper, zinc, silver, nickel and chromium in the aerosol from four brands of EC and to identify the sources of these metals by examining the elemental composition of the atomizer components. Methods Four brands of popular EC were dissected and the cartomizers were examined microscopically. Elemental composition of cartomizer components was determined using integrated energy dispersive X-ray microanalysis, and the concentrations of the tin, copper, zinc silver, nickel, and chromium in the aerosol were determined for each brand using inductively coupled plasma optical emission spectroscopy. Results All filaments were made of nickel and chromium. Thick wires were copper coated with either tin or silver. Wires were joined to each other by tin solder, brazing, or by brass clamps. High concentrations of tin were detected in the aerosol when tin solder joints were friable. Tin coating on copper wires also contributed to tin in the aerosol. Conclusions Tin concentrations in EC aerosols varied both within and between brands. Tin in aerosol was reduced by coating the thick wire with silver rather than tin, placing stable tin solder joints outside the atomizing chamber, joining wires with brass clamps or by brazing rather than soldering wires. These data demonstrate the feasibility of removing tin and other unwanted metals from EC aerosol by altering designs and using materials of suitable quality. PMID:26406602

  7. Evaluation of a 6-wire thermocouple psychrometer for determination of in-situ water potentials

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Loskot, C.L.; Rousseau, J.P.; Kurzmack, M.A.

    1994-12-31

    A 6-wire, Peltier-type thermocouple psychrometer was designed and evaluated by the U.S. Geological Survey for monitoring in-situ water potentials in dry-drilled boreholes in the unsaturated zone at Yucca Mountain, Nye County, Nevada. The psychrometer consists of a wet-bulb, chromel-constantan, sensing junction and a separate dry-bulb, copper-constantan, reference junction. Two additional reference junctions are formed where the chromel and constantan wires of the wet-bulb sensing junction are soldered to separate, paired, copper, lead wires. In contrast, in the standard 3-wire thermocouple psychrometer, both the wet bulb and dry bulb share a common wire. The new design has resulted in a psychrometermore » that has an expanded range and greater reliability, sensitivity, and accuracy compared to the standard model.« less

  8. Biofilm formation on stainless steel and gold wires for bonded retainers in vitro and in vivo and their susceptibility to oral antimicrobials.

    PubMed

    Jongsma, Marije A; Pelser, Floris D H; van der Mei, Henny C; Atema-Smit, Jelly; van de Belt-Gritter, Betsy; Busscher, Henk J; Ren, Yijin

    2013-05-01

    Bonded retainers are used in orthodontics to maintain treatment result. Retention wires are prone to biofilm formation and cause gingival recession, bleeding on probing and increased pocket depths near bonded retainers. In this study, we compare in vitro and in vivo biofilm formation on different wires used for bonded retainers and the susceptibility of in vitro biofilms to oral antimicrobials. Orthodontic wires were exposed to saliva, and in vitro biofilm formation was evaluated using plate counting and live/dead staining, together with effects of exposure to toothpaste slurry alone or followed by antimicrobial mouthrinse application. Wires were also placed intra-orally for 72 h in human volunteers and undisturbed biofilm formation was compared by plate counting and live/dead staining, as well as by denaturing gradient gel electrophoresis for compositional differences in biofilms. Single-strand wires attracted only slightly less biofilm in vitro than multi-strand wires. Biofilms on stainless steel single-strand wires however, were much more susceptible to antimicrobials from toothpaste slurries and mouthrinses than on single-strand gold wires and biofilms on multi-strand wires. Also, in vivo significantly less biofilm was found on single-strand than on multi-strand wires. Microbial composition of biofilms was more dependent on the volunteer involved than on wire type. Biofilms on single-strand stainless steel wires attract less biofilm in vitro and are more susceptible to antimicrobials than on multi-strand wires. Also in vivo, single-strand wires attract less biofilm than multi-strand ones. Use of single-strand wires is preferred over multi-strand wires, not because they attract less biofilm, but because biofilms on single-strand wires are not protected against antimicrobials as in crevices and niches as on multi-strand wires.

  9. Aluminum Lithium Alloy 2195 Fusion Welding Improvements with New Filler Wire

    NASA Technical Reports Server (NTRS)

    Russell, Carolyn; Bjorkman, Gerry; McCool, Carolyn (Technical Monitor)

    2000-01-01

    A viewgraph presentation outlines NASA Marshall Space Flight Center, Lockheed Martin Michoud Space Systems, and McCook Metals' development an aluminum-copper weld filler wire for fusion welding 2195 aluminum lithium. The aluminum-copper based weld filler wire has been identified as B218, which is the result of six years of weld filler wire development funded by NASA, Lockheed Martin, and McCook Metals. The Super Lightweight External Tank for the NASA Space Shuttle Program consists of 2195 welded with 4043 aluminum-silicon weld filler wire. The B218 filler wire chemistry was developed to produce enhanced 2195 weld and repair weld mechanical properties. An initial characterization of the B218 weld filler wire was performed consisting of initial weld and repair weld evaluation comparing B218 and 4043. The testing involved room temperature and cryogenic tensile testing along with fracture toughness testing. B218 weld filler wire proved to produce enhanced initial and repair weld tensile and fracture properties over 4043. B218 weld filler wire has proved to be a superior weld filler wire for welding 2195 and other aluminum lithium alloys over 4043.

  10. Experimental investigation on the energy deposition and morphology of the electrical explosion of copper wire in vacuum

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Shi, Zongqian; Shi, Yuanjie; Wang, Kun

    2016-03-15

    This paper presents the experimental results of the electrical explosion of copper wires in vacuum using negative nanosecond-pulsed current with magnitude of 1–2 kA. The 20 μm-diameter copper wires with different lengths are exploded with three different current rates. A laser probe is applied to construct the shadowgraphy and interferometry diagnostics to investigate the distribution and morphology of the exploding product. The interference phase shift is reconstructed from the interferogram, by which the atomic density distribution is calculated. Experimental results show that there exist two voltage breakdown modes depending on the amount of the specific energy deposition. For the strong-shunting mode, shuntingmore » breakdown occurs, leading to the short-circuit-like current waveform. For the weak-shunting mode with less specific energy deposition, the plasma generated during the voltage breakdown is not enough to form a conductive plasma channel, resulting in overdamped declining current waveform. The influence of the wire length and current rate on the characteristics of the exploding wires is also analyzed.« less

  11. Interlot variations of transition temperature range and force delivery in copper-nickel-titanium orthodontic wires.

    PubMed

    Pompei-Reynolds, Renée C; Kanavakis, Georgios

    2014-08-01

    The manufacturing process for copper-nickel-titanium archwires is technique sensitive. The primary aim of this investigation was to examine the interlot consistency of the mechanical properties of copper-nickel-titanium wires from 2 manufacturers. Wires of 2 sizes (0.016 and 0.016 × 0.022 in) and 3 advertised austenite finish temperatures (27°C, 35°C, and 40°C) from 2 manufacturers were tested for transition temperature ranges and force delivery using differential scanning calorimetry and the 3-point bend test, respectively. Variations of these properties were analyzed for statistical significance by calculating the F statistic for equality of variances for transition temperature and force delivery in each group of wires. All statistical analyses were performed at the 0.05 level of significance. Statistically significant interlot variations in austenite finish were found for the 0.016 in/27°C (P = 0.041) and 0.016 × 0.022 in/35°C (P = 0.048) wire categories, and in austenite start for the 0.016 × 0.022 in/35°C wire category (P = 0.01). In addition, significant variations in force delivery were found between the 2 manufacturers for the 0.016 in/27°C (P = 0.002), 0.016 in/35.0°C (P = 0.049), and 0.016 × 0.022 in/35°C (P = 0.031) wires. Orthodontic wires of the same material, dimension, and manufacturer but from different production lots do not always have similar mechanical properties. Clinicians should be aware that copper-nickel-titanium wires might not always deliver the expected force, even when they come from the same manufacturer, because of interlot variations in the performance of the material. Copyright © 2014 American Association of Orthodontists. Published by Mosby, Inc. All rights reserved.

  12. Finite Element Bond Modeling for Indented Wires in Pretensioned Concrete Crossties

    DOT National Transportation Integrated Search

    2016-04-12

    Indented wires have been increasingly employed by : concrete crosstie manufacturers to improve the bond between : prestressing steel reinforcements and concrete, as bond can : affect several critical performance measures, including transfer : length,...

  13. Parameters for good welding of copper to nickel

    NASA Technical Reports Server (NTRS)

    Hall, L. G.

    1969-01-01

    Quality in welding copper leads to nickel bus wires is obtained by the mass of nickel exceeding that of copper. Welding range 2ncreases proportionately with the increase in the nickel-to-copper mass ratio up to 4-to-1.

  14. 46 CFR 28.370 - Wiring methods and materials.

    Code of Federal Regulations, 2010 CFR

    2010-10-01

    ... wire must have insulated, stranded copper conductors of the appropriate size and voltage rating for the... that affects one cable does not affect the other. (d) Cable and wire for power and lighting circuits...

  15. Copper-promoted sulfenylation of sp2 C-H bonds.

    PubMed

    Tran, Ly Dieu; Popov, Ilya; Daugulis, Olafs

    2012-11-07

    An auxiliary-assisted, copper catalyzed or promoted sulfenylation of benzoic acid derivative β-C-H bonds and benzylamine derivative γ-C-H bonds has been developed. The method employs disulfide reagents, copper(II) acetate, and DMSO solvent at 90-130 °C. Application of this methodology to the direct trifluoromethylsulfenylation of C-H bonds was demonstrated.

  16. Radial density distribution of a warm dense plasma formed by underwater electrical explosion of a copper wire

    NASA Astrophysics Data System (ADS)

    Nitishinskiy, M.; Yanuka, D.; Virozub, A.; Krasik, Ya. E.

    2017-12-01

    Time- and space-resolved evolution of the density (down to 0.07 of solid state density) of a copper wire during its microsecond timescale electrical explosion in water was obtained by X-ray backlighting. In the present research, a flash X-ray source of 20 ns pulse-width and >60 keV photon energy was used. The conductivity of copper was evaluated for a temperature of 10 kK and found to be in good agreement with the data obtained in earlier experiments [DeSilva and Katsouros, Phys. Rev. E 57, 5945 (1998) and Sheftman and Krasik, Phys. Plasmas 18, 092704 (2011)] where only electrical and optical diagnostics were applied. Magneto-hydrodynamic simulation shows a good agreement between the simulated and experimental waveforms of the current and voltage and measured the radial expansion of the exploding wire. Also, the radial density distribution obtained by an inverse Abel transform analysis agrees with the results of these simulations. Thus, the validity of the equations of state for copper and the conductivity model used in the simulations was confirmed for the parameters of the exploding wire realized in the present research.

  17. Copper-zinc superoxide dismutase is activated through a sulfenic acid intermediate at a copper ion entry site.

    PubMed

    Fetherolf, Morgan M; Boyd, Stefanie D; Taylor, Alexander B; Kim, Hee Jong; Wohlschlegel, James A; Blackburn, Ninian J; Hart, P John; Winge, Dennis R; Winkler, Duane D

    2017-07-21

    Metallochaperones are a diverse family of trafficking molecules that provide metal ions to protein targets for use as cofactors. The copper chaperone for superoxide dismutase (Ccs1) activates immature copper-zinc superoxide dismutase (Sod1) by delivering copper and facilitating the oxidation of the Sod1 intramolecular disulfide bond. Here, we present structural, spectroscopic, and cell-based data supporting a novel copper-induced mechanism for Sod1 activation. Ccs1 binding exposes an electropositive cavity and proposed "entry site" for copper ion delivery on immature Sod1. Copper-mediated sulfenylation leads to a sulfenic acid intermediate that eventually resolves to form the Sod1 disulfide bond with concomitant release of copper into the Sod1 active site. Sod1 is the predominant disulfide bond-requiring enzyme in the cytoplasm, and this copper-induced mechanism of disulfide bond formation obviates the need for a thiol/disulfide oxidoreductase in that compartment. © 2017 by The American Society for Biochemistry and Molecular Biology, Inc.

  18. Effect of grit-blasting on substrate roughness and coating adhesion

    NASA Astrophysics Data System (ADS)

    Varacalle, Dominic J.; Guillen, Donna Post; Deason, Douglas M.; Rhodaberger, William; Sampson, Elliott

    2006-09-01

    Statistically designed experiments were performed to compare the surface roughness produced by grit blasting A36/1020 steel using different abrasives. Grit blast media, blast pressure, and working distance were varied using a Box-type statistical design of experiment (SDE) approach. The surface textures produced by four metal grits (HG16, HG18, HG25, and HG40) and three conventional grits (copper slag, coal slag, and chilled iron) were compared. Substrate roughness was measured using surface profilometry and correlated with operating parameters. The HG16 grit produced the highest surface roughness of all the grits tested. Aluminum and zinc-aluminum coatings were deposited on the grit-blasted substrates using the twin-wire electric are (TWEA) process. Bond strength of the coatings was measured with a portable adhesion tester in accordance with ASTM standard D 4541. The coatings on substrates roughened with steel grit exhibit superior bond strength to those prepared with conventional grit. For aluminum coatings sprayed onto surfaces prepared with the HG16 grit, the bond strength was most influenced by current, spray distance, and spray gun pressure (in that order). The highest bond strength for the zinc-aluminum coatings was attained on surfaces prepared using the metal grits.

  19. Copper Refinement from Anode to Cathode and then to Wire Rod: Effects of Impurities on Recrystallization Kinetics and Wire Ductility.

    PubMed

    Helbert, Anne-Laure; Moya, Alice; Jil, Tomas; Andrieux, Michel; Ignat, Michel; Brisset, François; Baudin, Thierry

    2015-10-01

    In this paper, the traceability of copper from the anode to the cathode and then the wire rod has been studied in terms of impurity content, microstructure, texture, recrystallization kinetics, and ductility. These characterizations were obtained based on secondary ion mass spectrometry, differential scanning calorimetry (DSC), X-ray diffraction, HV hardness, and electron backscattered diffraction. It is shown that the recrystallization was delayed by the total amount of impurities. From tensile tests performed on cold drawn and subsequently annealed wires for a given time, a simplified model has been developed to link tensile elongation to the chemical composition. This model allowed quantification of the contribution of some additional elements, present in small quantity, on the recrystallization kinetics. The proposed model adjusted for the cold-drawn wires was also validated on both the cathode and wire rod used for the study of traceability.

  20. Reliability Assessment and Activation Energy Study of Au and Pd-Coated Cu Wires Post High Temperature Aging in Nanoscale Semiconductor Packaging.

    PubMed

    Gan, C L; Hashim, U

    2013-06-01

    Wearout reliability and high temperature storage life (HTSL) activation energy of Au and Pd-coated Cu (PdCu) ball bonds are useful technical information for Cu wire deployment in nanoscale semiconductor device packaging. This paper discusses the influence of wire type on the wearout reliability performance of Au and PdCu wire used in fine pitch BGA package after HTSL stress at various aging temperatures. Failure analysis has been conducted to identify the failure mechanism after HTSL wearout conditions for Au and PdCu ball bonds. Apparent activation energies (Eaa) of both wire types are investigated after HTSL test at 150 °C, 175 °C and 200 °C aging temperatures. Arrhenius plot has been plotted for each ball bond types and the calculated Eaa of PdCu ball bond is 0.85 eV and 1.10 eV for Au ball bond in 110 nm semiconductor device. Obviously Au ball bond is identified with faster IMC formation rate with IMC Kirkendall voiding while PdCu wire exhibits equivalent wearout and or better wearout reliability margin compare to conventional Au wirebond. Lognormal plots have been established and its mean to failure (t 50 ) have been discussed in this paper.

  1. A copper ion-selective electrode with high selectivity prepared by sol-gel and coated wire techniques.

    PubMed

    Mazloum Ardakani, M; Salavati-Niasari, M; Khayat Kashani, M; Ghoreishi, S M

    2004-03-01

    A sol-gel electrode and a coated wire ion-selective poly(vinyl chloride) membrane, based on thiosemicarbazone as a neutral carrier, were successfully developed for the detection of Cu (II) in aqueous solutions. The sol-gel electrode and coated electrode exhibited linear response with Nernstian slopes of 29.2 and 28.1 mV per decade respectively, within the copper ion concentration ranges 1.0 x 10(-5) - 1.0 x 10(-1) M and 6.0 x 10(-6) - 1.0 x 10(-1) M for coated and sol-gel sensors. The coated and sol-gel electrodes show detection limits of 3.0 x 10(-6) and 6.0 x 10(-6) M respectively. The electrodes exhibited good selectivities for a number of alkali, alkaline earth, transition and heavy metal ions. The proposed electrodes have response times ranging from 10-50 s to achieve a 95% steady potential for Cu2+ concentration. The electrodes are suitable for use in aqueous solutions over a wide pH range (4-7.5). Applications of these electrodes for the determination of copper in real samples, and as an indicator electrode for potentiometric titration of Cu2+ ion using EDTA, are reported. The lifetimes of the electrodes were tested over a period of six months to investigate their stability. No significant change in the performance of the sol-gel electrode was observed over this period, but after two months the coated wire copper-selective electrode exhibited a gradual decrease in the slope. The selectivity of the sol-gel electrode was found to be better than that of the coated wire copper-selective electrode. Based on these results, a novel sol-gel copper-selective electrode is proposed for the determination of copper, and applied to real sample assays.

  2. Ultrasonic friction power during Al wire wedge-wedge bonding

    NASA Astrophysics Data System (ADS)

    Shah, A.; Gaul, H.; Schneider-Ramelow, M.; Reichl, H.; Mayer, M.; Zhou, Y.

    2009-07-01

    Al wire bonding, also called ultrasonic wedge-wedge bonding, is a microwelding process used extensively in the microelectronics industry for interconnections to integrated circuits. The bonding wire used is a 25μm diameter AlSi1 wire. A friction power model is used to derive the ultrasonic friction power during Al wire bonding. Auxiliary measurements include the current delivered to the ultrasonic transducer, the vibration amplitude of the bonding tool tip in free air, and the ultrasonic force acting on the bonding pad during the bond process. The ultrasonic force measurement is like a signature of the bond as it allows for a detailed insight into mechanisms during various phases of the process. It is measured using piezoresistive force microsensors integrated close to the Al bonding pad (Al-Al process) on a custom made test chip. A clear break-off in the force signal is observed, which is followed by a relatively constant force for a short duration. A large second harmonic content is observed, describing a nonsymmetric deviation of the signal wave form from the sinusoidal shape. This deviation might be due to the reduced geometrical symmetry of the wedge tool. For bonds made with typical process parameters, several characteristic values used in the friction power model are determined. The ultrasonic compliance of the bonding system is 2.66μm/N. A typical maximum value of the relative interfacial amplitude of ultrasonic friction is at least 222nm. The maximum interfacial friction power is at least 11.5mW, which is only about 4.8% of the total electrical power delivered to the ultrasonic generator.

  3. Superconducting magnet wire

    DOEpatents

    Schuller, Ivan K.; Ketterson, John B.; Banerjee, Indrajit

    1986-01-01

    A superconducting tape or wire with an improved critical field is formed of alternating layers of a niobium-containing superconductor such as Nb, NbTi, Nb.sub.3 Sn or Nb.sub.3 Ge with a thickness in the range of about 0.5-1.5 times its coherence length, supported and separated by layers of copper with each copper layer having a thickness in the range of about 170-600 .ANG..

  4. Polyimide-glass multilayer printed wiring boards

    NASA Astrophysics Data System (ADS)

    Lula, J. W.

    1984-07-01

    Multilayer printed wiring boards (PWBs) from a polyimide/glass reinforced copper clad laminate and prepreg were manufactured. A lamination cycle and innerlayer copper surface treatment that gave satisfactory delamination resistance at soldering temperatures were developed. When compared to similar epoxy/glass multilayer PWBs, the polyimide PWBs had higher thermal stability, greater resistance to raised lands, fewer plating voids, less outgassing, and adhesion that was equivalent to urethane foam encapsulants.

  5. B218 Weld Filler Wire Characterization for Al-Li Alloy 2195

    NASA Technical Reports Server (NTRS)

    Bjorkman, Gerry; Russell, Carolyn

    2000-01-01

    NASA Marshall Space Flight Center, Lockheed Martin Space Systems- Michoud Operations, and McCook Metals have developed an aluminum-copper weld filler wire for fusion welding aluminum lithium alloy 2195. The aluminum-copper based weld filler wire has been identified as B218, a McCook Metals designation. B218 is the result of six years of weld filler wire development funded by NASA, Lockheed Martin, and McCook Metals. The filler wire chemistry was developed to produce enhanced 2195 weld and repair weld mechanical properties over the 4043 aluminum-silicon weld filler wire, which is currently used to weld 2195 on the Super Lightweight External Tank for the NASA Space Shuttle Program. An initial characterization was performed consisting of a repair weld evaluation using B218 and 4043 weld filler wires. The testing involved room temperature and cryogenic repair weld tensile testing along with fracture toughness testing. From the testing, B218 weld filler wire produce enhanced repair weld tensile strength, ductility, and fracture properties over 4043. B218 weld filler wire has proved to be a superior weld filler wire for welding aluminum lithium alloy 2195 over 4043.

  6. 7 CFR 1755.702 - Copper coated steel reinforced (CCSR) aerial service wire.

    Code of Federal Regulations, 2011 CFR

    2011-01-01

    ... wire. 1755.702 Section 1755.702 Agriculture Regulations of the Department of Agriculture (Continued... service wire. (a) Conductors. (1) Each conductor shall comply with the requirements specified in the..., paragraphs 2.1 through 2.1.5. The ANSI/ICEA S-89-648-1993 Standard For Telecommunications Aerial Service Wire...

  7. 7 CFR 1755.702 - Copper coated steel reinforced (CCSR) aerial service wire.

    Code of Federal Regulations, 2010 CFR

    2010-01-01

    ... wire. 1755.702 Section 1755.702 Agriculture Regulations of the Department of Agriculture (Continued... service wire. (a) Conductors. (1) Each conductor shall comply with the requirements specified in the..., paragraphs 2.1 through 2.1.5. The ANSI/ICEA S-89-648-1993 Standard For Telecommunications Aerial Service Wire...

  8. Effect of confining pressure due to external jacket of steel plate or shape memory alloy wire on bond behavior between concrete and steel reinforcing bars.

    PubMed

    Choi, Eunsoo; Kim, Dongkyun; Park, Kyoungsoo

    2014-12-01

    For external jackets of reinforced concrete columns, shape memory alloy (SMA) wires are easy to install, and they provide active and passive confining pressure; steel plates, on the other hand, only provide passive confining pressure, and their installation on concrete is not convenient because of the requirement of a special device. To investigate how SMA wires distinctly impact bond behavior compared with steel plates, this study conducted push-out bond tests of steel reinforcing bars embedded in concrete confined by SMA wires or steel plates. For this purpose, concrete cylinders were prepared with dimensions of 100 mm x 200 mm, and D-22 reinforcing bars were embedded at the center of the concrete cylinders. External jackets of 1.0 mm and 1.5 mm thickness steel plates were used to wrap the concrete cylinders. Additionally, NiTiNb SMA wire with a diameter of 1.0 mm was wound around the concrete cylinders. Slip of the reinforcing bars due to pushing force was measured by using a displacement transducer, while the circumferential deformation of specimens was obtained by using an extensometer. The circumferential deformation was used to calculate the circumferential strains of the specimens. This study assessed the radial confining pressure due to the external jackets on the reinforcing bars at bond strength from bond stress-slip curves and bond stress-circumferential strain curves. Then, the effects of the radial confining pressure on the bond behavior of concrete are investigated, and an equation is suggested to estimate bond strength using the radial confining pressure. Finally, this study focused on how active confining pressure due to recovery stress of the SMA wires influences bond behavior.

  9. Porous coatings from wire mesh for bone implants

    DOEpatents

    Sump, Kenneth R.

    1986-01-01

    A method of coating areas of bone implant elements and the resulting implant having a porous coating are described. Preselected surface areas are covered by a preform made from continuous woven lengths of wire. The preform is compressed and heated to assure that diffusion bonding occurs between the wire surfaces and between the surface boundaries of the implant element and the wire surfaces in contact with it. Porosity is achieved by control of the resulting voids between the bonded wire portions.

  10. Nondestructive tests of regenerative chambers. [evaluating nondestructive methods of determining metal bond integrity

    NASA Technical Reports Server (NTRS)

    Malone, G. A.; Vecchies, L.; Wood, R.

    1974-01-01

    The capabilities and limitations of nondestructive evaluation methods were studied to detect and locate bond deficiencies in regeneratively cooled thrust chambers for rocket engines. Flat test panels and a cylinder were produced to simulate regeneratively cooled thrust chamber walls. Planned defects with various bond integrities were produced in the panels to evaluate the sensitivity, accuracy, and limitations of nondestructive methods to define and locate bond anomalies. Holography, acoustic emission, and ultrasonic scan were found to yield sufficient data to discern bond quality when used in combination and in selected sequences. Bonding techniques included electroforming and brazing. Materials of construction included electroformed nickel bonded to Nickel 200 and OFHC copper, electroformed copper bonded to OFHC copper, and 300 series stainless steel brazed to OFHC copper. Variations in outer wall strength, wall thickness, and defect size were evaluated for nondestructive test response.

  11. A-15 Superconducting composite wires and a method for making

    DOEpatents

    Suenaga, Masaki; Klamut, Carl J.; Luhman, Thomas S.

    1984-01-01

    A method for fabricating superconducting wires wherein a billet of copper containing filaments of niobium or vanadium is rolled to form a strip which is wrapped about a tin-alloy core to form a composite. The alloy is a tin-copper alloy for niobium filaments and a gallium-copper alloy for vanadium filaments. The composite is then drawn down to a desired wire size and heat treated. During the heat treatment process, the tin in the bronze reacts with the niobium to form the superconductor niobium tin. In the case where vanadium is used, the gallium in the gallium bronze reacts with the vanadium to form the superconductor vanadium gallium. This new process eliminates the costly annealing steps, external tin plating and drilling of bronze ingots required in a number of prior art processes.

  12. Wrapping process for fabrication of A-15 superconducting composite wires

    DOEpatents

    Suenaga, M.; Klamut, C.J.; Luhman, T.S.

    1980-08-15

    A method for fabricating superconducting wires wherein a billet of copper containing filaments of niobium or vanadium is rolled to form a strip which is wrapped about a tin-alloy core to form a composite. The alloy is a tin-copper alloy for niobium filaments and a gallium-copper alloy for vanadium filaments. The composite is then drawn down to a desired wire size and heat treated. During the heat treatment process, the tin in the bronze reacts with the niobium to form the superconductor niobium tin. In the case where vanadium is used, the gallium in the gallium bronze reacts with the vanadium to form the superconductor vanadium gallium. This new process eliminates the costly annealing steps, external tin plating and drilling of bronze ingots required in a number of prior art processes.

  13. Thermoelectric Mechanism and Interface Characteristics of Cyanide-Free Nanogold-Coated Silver Wire

    NASA Astrophysics Data System (ADS)

    Tseng, Yi-Wei; Hung, Fei-Yi; Lui, Truan-Sheng

    2016-01-01

    Traditional bath-plated gold contains a cyanide complex, which is an environmental hazard. In response, our study used a green plating process to produce cyanide-free gold-coated silver (cyanide-free ACA) bonding wire that has been proven to be a feasible alternative to gold bonding wire in semiconductor packaging. In this work, ACA wire annealed at 550°C was found to have stable microstructure and superior mechanical properties. Intermetallic compounds Ag2Al and AuAl2 grew from Ag-Au balls and Al pads after aging at 175°C for 500 h. After current testing, ACA wire was found to have improved electrical properties due to equiaxed grain growth. The gold nanolayer on the Ag surface increased the oxidation resistance. These results provide insights regarding the reliability of ACA wire in advanced bonding processes.

  14. Annealing effects in plated-wire memory elements. I - Interdiffusion of copper and Permalloy.

    NASA Technical Reports Server (NTRS)

    Knudson, C. I.; Kench, J. R.

    1971-01-01

    Results of investigations using X-ray diffraction and electron-beam microprobe techniques have shown that copper and Permalloy platings interdiffuse at low temperatures when plated-wire memory elements are annealed for times as short as 50 hr. Measurable interdiffusion between Permalloy platings and gold substrates does not occur in similar conditions. Both magnetic and compositional changes during aging are found to occur by a thermally activated process with activation energies around 38 kcal/mol. It is shown, however, that copper-diffusion and magnetic-dispersion changes during aging are merely concurrent processes, neither being the other's cause.

  15. Development of explosively bonded TZM wire reinforced Columbian sheet composites

    NASA Technical Reports Server (NTRS)

    Otto, H. E.; Carpenter, S. H.

    1972-01-01

    Methods of producing TZM molybdenum wire reinforced C129Y columbium alloy composites by explosive welding were studied. Layers of TZM molybdenum wire were wound on frames with alternate layers of C129Y columbium alloy foil between the wire layers. The frames held both the wire and foils in place for the explosive bonding process. A goal of 33 volume percent molybdenum wire was achieved for some of the composites. Variables included wire diameter, foil thickness, wire separation, standoff distance between foils and types and amounts of explosive. The program was divided into two phases: (1) development of basic welding parameters using 5 x 10-inch composites, and (2) scaleup to 10 x 20-inch composites.

  16. Fabrication of Copper-Rich Cu-Al Alloy Using the Wire-Arc Additive Manufacturing Process

    NASA Astrophysics Data System (ADS)

    Dong, Bosheng; Pan, Zengxi; Shen, Chen; Ma, Yan; Li, Huijun

    2017-12-01

    An innovative wire-arc additive manufacturing (WAAM) process is used to fabricate Cu-9 at. pct Al on pure copper plates in situ, through separate feeding of pure Cu and Al wires into a molten pool, which is generated by the gas tungsten arc welding (GTAW) process. After overcoming several processing problems, such as opening the deposition molten pool on the extremely high-thermal conductive copper plate and conducting the Al wire into the molten pool with low feed speed, the copper-rich Cu-Al alloy was successfully produced with constant predesigned Al content above the dilution-affected area. Also, in order to homogenize the as-fabricated material and improve the mechanical properties, two further homogenization heat treatments at 1073 K (800 °C) and 1173 K (900 °C) were applied. The material and mechanical properties of as-fabricated and heat-treated samples were compared and analyzed in detail. With increased annealing temperatures, the content of precipitate phases decreased and the samples showed gradual improvements in both strength and ductility with little variation in microstructures. The present research opened a gate for in-situ fabrication of Cu-Al alloy with target chemical composition and full density using the additive manufacturing process.

  17. One-step internal-tin Nb/sub 3/Sn superconductor fabrication. Final report, June 1983-August 1984

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Marancik, W.

    1985-03-01

    The object of this research is to demonstrate the feasibility of producing a Nb/sub 3/Sn superconductor in a single extrusion process with a large number of filaments with internal tin. The technique chosen uses .010'-diameter Nb and tin-plated Cu wires formed into a solenoid. The solenoid is covered with tin-plated copper foil and isostatically compacted to a pressure of 17,000 psi. The solenoid is slit along its length. This results in a ribbon about 40 inches long by about 5-inches wide, with the Nb wires running across the 5-inch-width. The ribbon is then rolled up (Jelly Roll) around a 0.5more » inch diameter Ta covered copper rod to produce a composite of about 1.5 inches in diameter by 5 inches long. The composite geometry is now a cylindrical bundle of 0.010-inch-diameter Nb wire separated from each other by tin-plated copper. Each Nb wire is aligned with the axis of cylinder. The cylinder is slid into a Ta-lined copper extrusion can which is evacuated and sealed. The can is extruded at a low temperature and drawn to final wire size without intermediate annealing. The advantage of the process is that it is an internal tin process with the tin uniformly distributed through the matrix. The Nb is in a relatively soft state having been fully annealed at 0.020-inch diameter. Only one extrusion is required since the bundling technique allows a large number of wires to be precisely aligned and spaced in the matrix.« less

  18. 46 CFR 169.672 - Wiring for power and lighting circuits.

    Code of Federal Regulations, 2013 CFR

    2013-10-01

    ... 46 Shipping 7 2013-10-01 2013-10-01 false Wiring for power and lighting circuits. 169.672 Section... Volts on Vessels of Less Than 100 Gross Tons § 169.672 Wiring for power and lighting circuits. (a) Wiring for power and lighting circuits must have copper conductors, of 14 AWG or larger, and— (1) Meet...

  19. 46 CFR 169.672 - Wiring for power and lighting circuits.

    Code of Federal Regulations, 2014 CFR

    2014-10-01

    ... 46 Shipping 7 2014-10-01 2014-10-01 false Wiring for power and lighting circuits. 169.672 Section... Volts on Vessels of Less Than 100 Gross Tons § 169.672 Wiring for power and lighting circuits. (a) Wiring for power and lighting circuits must have copper conductors, of 14 AWG or larger, and— (1) Meet...

  20. Computer simulation of metal wire explosion under high rate heating

    NASA Astrophysics Data System (ADS)

    Zolnikov, K. P.; Kryzhevich, D. S.; Korchuganov, A. V.

    2017-05-01

    Synchronous electric explosion of metal wires and synthesis of bicomponent nanoparticles were investigated on the base of molecular dynamics method. Copper and nickel nanosized crystallites of cylindrical shape were chosen as conductors for explosion. The embedded atom approximation was used for calculation of the interatomic interactions. The agglomeration process after explosion metal wires was the main mechanism for particle synthesis. The distribution of chemical elements was non-uniform over the cross section of the bicomponent particles. The copper concentration in the surface region was higher than in the bulk of the synthesized particle. By varying the loading parameters (heating temperature, the distance between the wires) one can control the size and internal structure of the synthesized bicomponent nanoparticles. The obtained results showed that the method of molecular dynamics can be effectively used to determine the optimal technological mode of nanoparticle synthesis on the base of electric explosion of metal wires.

  1. 46 CFR 114.600 - Incorporation by reference.

    Code of Federal Regulations, 2012 CFR

    2012-10-01

    ... Storage Tank Water Heaters 119.320 UL 486A-1992—Wire Connectors and Soldering Lugs For Use With Copper...-93, Standard Specification for Copper-Silicon Alloy Plate, Sheet, Strip, and Rolled Bar for General...) Apparatus 114.400 ASTM B 122/B 122M-95, Standard Specification for Copper-Nickel-Tin Alloy , Copper-Nickel...

  2. The insulation of copper wire by the electrostatic coating process

    NASA Astrophysics Data System (ADS)

    Wells, M. G. H.

    1983-06-01

    A review of the fluidized bed electrostatic coating process and materials available for application to flat copper conductor has been made. Lengths of wire were rolled and electrostatically coated with two epoxy insulations. Electrical tests were made in air on coated samples at room and elevated temperatures. Compatibility tests in the cooling/lubricating turbine oil at temperatures up to 220 deg. C were also made. Recommendations for additional work are provided.

  3. Evolution of Mechanical and Electrical Properties During Annealing of the Copper Wire Drawn

    NASA Astrophysics Data System (ADS)

    Zidani, M.; Messaoudi, S.; Baudin, T.; Derfouf, C.; Boulagroun, A.; Mathon, M. H.

    2011-12-01

    In this work, the evolution of mechanical and electrical properties and microstructure of industrial copper wire used for electrical cabling was characterized. This work is not limited to the interpretation of the microstructural characteristics of the wire-drawn state but also after different annealing treatments. For the lowest temperatures (160 °C and 200 °C), significant changes are not observed in the microstructure (grain size) in the weak deformed wire (28.5%). Instead, variations of some properties of the metal were observed (hardness and electrical resistivity). For strong deformation (61.4% and 84.59%), annealing, leads to recrystallization with a softening material. Let us note that the resistivity increases with deformation level and becomes higher after annealing at low temperature (200 °C).

  4. Deposition of thermal and hot-wire chemical vapor deposition copper thin films on patterned substrates.

    PubMed

    Papadimitropoulos, G; Davazoglou, D

    2011-09-01

    In this work we study the hot-wire chemical vapor deposition (HWCVD) of copper films on blanket and patterned substrates at high filament temperatures. A vertical chemical vapor deposition reactor was used in which the chemical reactions were assisted by a tungsten filament heated at 650 degrees C. Hexafluoroacetylacetonate Cu(I) trimethylvinylsilane (CupraSelect) vapors were used, directly injected into the reactor with the aid of a liquid injection system using N2 as carrier gas. Copper thin films grown also by thermal and hot-wire CVD. The substrates used were oxidized silicon wafers on which trenches with dimensions of the order of 500 nm were formed and subsequently covered with LPCVD W. HWCVD copper thin films grown at filament temperature of 650 degrees C showed higher growth rates compared to the thermally ones. They also exhibited higher resistivities than thermal and HWCVD films grown at lower filament temperatures. Thermally grown Cu films have very uniform deposition leading to full coverage of the patterned substrates while the HWCVD films exhibited a tendency to vertical growth, thereby creating gaps and incomplete step coverage.

  5. A comparison of torque expression between stainless steel, titanium molybdenum alloy, and copper nickel titanium wires in metallic self-ligating brackets.

    PubMed

    Archambault, Amy; Major, Thomas W; Carey, Jason P; Heo, Giseon; Badawi, Hisham; Major, Paul W

    2010-09-01

    The force moment providing rotation of the tooth around the x-axis (buccal-lingual) is referred to as torque expression in orthodontic literature. Many factors affect torque expression, including the wire material characteristics. This investigation aims to provide an experimental study into and comparison of the torque expression between wire types. With a worm-gear-driven torquing apparatus, wire was torqued while a bracket mounted on a six-axis load cell was engaged. Three 0.019 x 0.0195 inch wire (stainless steel, titanium molybdenum alloy [TMA], copper nickel titanium [CuNiTi]), and three 0.022 inch slot bracket combinations (Damon 3MX, In-Ovation-R, SPEED) were compared. At low twist angles (<12 degrees), the differences in torque expression between wires were not statistically significant. At twist angles over 24 degrees, stainless steel wire yielded 1.5 to 2 times the torque expression of TMA and 2.5 to 3 times that of nickel titanium (NiTi). At high angles of torsion (over 40 degrees) with a stiff wire material, loss of linear torque expression sometimes occurred. Stainless steel has the largest torque expression, followed by TMA and then NiTi.

  6. Bonding and structure of copper nitrenes.

    PubMed

    Cundari, Thomas R; Dinescu, Adriana; Kazi, Abul B

    2008-11-03

    Copper nitrenes are of interest as intermediates in the catalytic aziridination of olefins and the amination of C-H bonds. However, despite advances in the isolation and study of late-transition-metal multiply bonded complexes, a bona fide structurally characterized example of a terminal copper nitrene has, to our knowledge, not been reported. In anticipation of such a report, terminal copper nitrenes are studied from a computational perspective. The nitrene complexes studied here are of the form (beta-diketiminate)Cu(NPh). Density functional theory (DFT), complete active space self-consistent-field (CASSCF) electronic structure techniques, and hybrid quantum mechanical/molecular mechanical (QM/MM) methods are employed to study such species. While DFT methods indicate that a triplet (S = 1) is the ground state, CASSCF calculations indicate that a singlet (S = 0) is the ground state, with only a small energy gap between the singlet and triplet. Moreover, the ground-state (open-shell) singlet copper nitrene is found to be highly multiconfigurational (i.e., biradical) and to possess a bent geometry about the nitrene nitrogen, contrasting with the linear nitrene geometry of the triplet copper nitrenes. CASSCF calculations also reveal the existence of a closed-shell singlet state with some degree of multiple bonding character for the copper-nitrene bond.

  7. Improvement of modulation bandwidth in electroabsorption-modulated laser by utilizing the resonance property in bonding wire.

    PubMed

    Kwon, Oh Kee; Han, Young Tak; Baek, Yong Soon; Chung, Yun C

    2012-05-21

    We present and demonstrate a simple and cost-effective technique for improving the modulation bandwidth of electroabsorption-modulated laser (EML). This technique utilizes the RF resonance caused by the EML chip (i.e., junction capacitance) and bonding wire (i.e, wire inductance). We analyze the effects of the lengths of the bonding wires on the frequency responses of EML by using an equivalent circuit model. To verify this analysis, we package a lumped EML chip on the sub-mount and measure its frequency responses. The results show that, by using the proposed technique, we can increase the modulation bandwidth of EML from ~16 GHz to ~28 GHz.

  8. Novel materials for electronic device fabrication using ink-jet printing technology

    NASA Astrophysics Data System (ADS)

    Kumashiro, Yasushi; Nakako, Hideo; Inada, Maki; Yamamoto, Kazunori; Izumi, Akira; Ishihara, Masamichi

    2009-11-01

    Novel materials and a metallization technique for the printed electronics were studied. Insulator inks and conductive inks were investigated. For the conductive ink, the nano-sized copper particles were used as metallic sources. These particles were prepared from a copper complex by a laser irradiation process in the liquid phase. Nano-sized copper particles were consisted of a thin copper oxide layer and a metal copper core wrapped by the layer. The conductive ink showed good ink-jettability. In order to metallize the printed trace of the conductive ink on a substrate, the atomic hydrogen treatment was carried out. Atomic hydrogen was generated on a heated tungsten wire and carried on the substrate. The temperature of the substrate was up to 60 °C during the treatment. After the treatment, the conductivity of a copper trace was 3 μΩ cm. It was considered that printed wiring boards can be easily fabricated by employing the above materials.

  9. Metallurgical characterization, galvanic corrosion, and ionic release of orthodontic brackets coupled with Ni-Ti archwires.

    PubMed

    Darabara, Myrsini S; Bourithis, Lefteris I; Zinelis, Spiros; Papadimitriou, George D

    2007-04-01

    In orthodontics, a combination of metallic alloys is placed into the oral cavity during medical treatment and thus the corrosion resistance and ionic release of these appliances is of vital importance. The aim of this study is to investigate the elemental composition, microstructure, hardness, corrosion properties, and ionic release of commercially available orthodontic brackets and Copper Ni-Ti archwires. Following the assessment of the elemental composition of the orthodontic wire (Copper Ni-Ti) and the six different brackets (Micro Loc, Equilibrium, OptiMESH(XRT), Gemini, Orthos2, and Rematitan), cyclic polarization curves were obtained for each material to estimate the susceptibility of each alloy to pitting corrosion in 1M lactic acid. Galvanic corrosion between the orthodontic wire and each bracket took place in 1M lactic acid for 28 days at 37 degrees C and then the ionic concentration of Nickel and Chromium was studied. The orthodontic wire is made up from a Ni-Ti alloy with copper additions, while the orthodontic brackets are manufactured by different stainless steel grades or titanium alloys. All tested wires and brackets with the exception of Gemini are not susceptible to pitting corrosion. In galvanic corrosion, following exposure for 28 days, the lowest potential difference (approximately 250 mV) appears for the orthodontic wire Copper Ni-Ti and the bracket made up from pure titanium (Rematitan) or from the stainless steel AISI 316 grade (Micro Loc). Following completion of the galvanic corrosion experiments, measurable quantities of chromium and nickel ions were found in the residual lactic acid solution. (c) 2006 Wiley Periodicals, Inc.

  10. Pretinning Nickel-Plated Wire Shields

    NASA Technical Reports Server (NTRS)

    Igawa, J. A.

    1985-01-01

    Nickel-plated copper shielding for wires pretinned for subsequent soldering with help of activated rosin flux. Shield cut at point 0.25 to 0.375 in. (6 to 10 mm) from cut end of outer jacket. Loosened end of shield straightened and pulled toward cut end. Insulation of inner wires kept intact during pretinning.

  11. Critical current density in wire drawn and hydrostatically extruded Nb-Ti superconductors

    NASA Technical Reports Server (NTRS)

    Alterovitz, S. A.; Woollam, J. A.; Collings, E. W.

    1979-01-01

    Critical current studies have been made on copper-clad Nb-Ti composite wire prepared under area reductions of 100:1 and 10,000:1 by hydrostatic extrusion (HE), wire drawing and HE plus drawing. Comparative evaluation of the thermomechanical processing equivalent of HE was performed.

  12. Demonstrating Forces between Parallel Wires.

    ERIC Educational Resources Information Center

    Baker, Blane

    2000-01-01

    Describes a physics demonstration that dramatically illustrates the mutual repulsion (attraction) between parallel conductors using insulated copper wire, wooden dowels, a high direct current power supply, electrical tape, and an overhead projector. (WRM)

  13. Examination of rapid phase change in copper wires to improve material models and understanding of burst

    NASA Astrophysics Data System (ADS)

    Olles, Joseph; Garasi, Christopher; Ball, J. Patrick

    2017-11-01

    Electrically-pulsed wires undergo multiple phase changes including a postulated metastable phase resulting in explosive wire growth. Simulations using the MHD approximation attempt to account for the governing physics, but lack the material properties (equations-of-state and electrical conductivity) to accurately predict the phase evolution of the exploding (bursting) wire. To explore the dynamics of an exploding copper wire (in water), we employ a digital micro-Schlieren streak photography technique. This imaging quantifies wire expansion and shock waves emitted from the wire during phase changes. Using differential voltage probes, a Rogowski coil, and timing fiducials, the phase change of the wire is aligned with electrical power and energy deposition. Time-correlated electrical diagnostics and imaging allow for detailed validation of MHD simulations, comparing observed phases with phase change details found in the material property descriptions. In addition to streak imaging, a long exposure image is taken to capture axial striations along the length of the wire. These images are used to compare with results from 3D MHD simulations which propose that these perturbations impact the rate of wire expansion and temporal change in phases. If successful, the experimental data will identify areas for improvement in the material property models, and modeling results will provide insight into the details of phase change in the wire with correlation to variations in the electrical signals.

  14. Resistive coating for current conductors in cryogenic applications

    DOEpatents

    Hirayama, Chikara; Wagner, George R.

    1982-05-18

    This invention relates to a resistive or semiconducting coating for use on current conductors in cryogenic applications. This includes copper-clad superconductor wire, copper wire used for stabilizing superconductor magnets, and for hyperconductors. The coating is a film of cuprous sulfide (Cu.sub.2 S) that has been found not to degrade the properties of the conductors. It is very adherent to the respective conductors and satisfies the mechanical, thermal and electrical requirements of coatings for the conductors.

  15. Silane and Germane Molecular Electronics.

    PubMed

    Su, Timothy A; Li, Haixing; Klausen, Rebekka S; Kim, Nathaniel T; Neupane, Madhav; Leighton, James L; Steigerwald, Michael L; Venkataraman, Latha; Nuckolls, Colin

    2017-04-18

    This Account provides an overview of our recent efforts to uncover the fundamental charge transport properties of Si-Si and Ge-Ge single bonds and introduce useful functions into group 14 molecular wires. We utilize the tools of chemical synthesis and a scanning tunneling microscopy-based break-junction technique to study the mechanism of charge transport in these molecular systems. We evaluated the fundamental ability of silicon, germanium, and carbon molecular wires to transport charge by comparing conductances within families of well-defined structures, the members of which differ only in the number of Si (or Ge or C) atoms in the wire. For each family, this procedure yielded a length-dependent conductance decay parameter, β. Comparison of the different β values demonstrates that Si-Si and Ge-Ge σ bonds are more conductive than the analogous C-C σ bonds. These molecular trends mirror what is seen in the bulk. The conductance decay of Si and Ge-based wires is similar in magnitude to those from π-based molecular wires such as paraphenylenes However, the chemistry of the linkers that attach the molecular wires to the electrodes has a large influence on the resulting β value. For example, Si- and Ge-based wires of many different lengths connected with a methyl-thiomethyl linker give β values of 0.36-0.39 Å -1 , whereas Si- and Ge-based wires connected with aryl-thiomethyl groups give drastically different β values for short and long wires. This observation inspired us to study molecular wires that are composed of both π- and σ-orbitals. The sequence and composition of group 14 atoms in the σ chain modulates the electronic coupling between the π end-groups and dictates the molecular conductance. The conductance behavior originates from the coupling between the subunits, which can be understood by considering periodic trends such as bond length, polarizability, and bond polarity. We found that the same periodic trends determine the electric field-induced breakdown properties of individual Si-Si, Ge-Ge, Si-O, Si-C, and C-C bonds. Building from these studies, we have prepared a system that has two different, alternative conductance pathways. In this wire, we can intentionally break a labile, strained silicon-silicon bond and thereby shunt the current through the secondary conduction pathway. This type of in situ bond-rupture provides a new tool to study single molecule reactions that are induced by electric fields. Moreover, these studies provide guidance for designing dielectric materials as well as molecular devices that require stability under high voltage bias. The fundamental studies on the structure/function relationships of the molecular wires have guided the design of new functional systems based on the Si- and Ge-based wires. For example, we exploited the principle of strain-induced Lewis acidity from reaction chemistry to design a single molecule switch that can be controllably switched between two conductive states by varying the distance between the tip and substrate electrodes. We found that the strain intrinsic to the disilaacenaphthene scaffold also creates two state conductance switching. Finally, we demonstrate the first example of a stereoelectronic conductance switch, and we demonstrate that the switching relies crucially on the electronic delocalization in Si-Si and Ge-Ge wire backbones. These studies illustrate the untapped potential in using Si- and Ge-based wires to design and control charge transport at the nanoscale and to allow quantum mechanics to be used as a tool to design ultraminiaturized switches.

  16. Observation of >400-eV precursor plasmas from low-wire-number copper arrays at the 1-MA zebra facility.

    PubMed

    Coverdale, C A; Safronova, A S; Kantsyrev, V L; Ouart, N D; Esaulov, A A; Deeney, C; Williamson, K M; Osborne, G C; Shrestha, I; Ampleford, D J; Jones, B

    2009-04-17

    Experiments with cylindrical copper wire arrays at the 1-MA Zebra facility show that high temperatures exist in the precursor plasmas formed when ablated wire array material accretes on the axis prior to the stagnation of a z pinch. In these experiments, the precursor radiated approximately 20% of the >1000 eV x-ray output, and time-resolved spectra show substantial emission from Cu L-shell lines. Modeling of the spectra shows an increase in temperature as the precursor forms, up to approximately 450 eV, after which the temperature decreases to approximately 220-320 eV until the main implosion.

  17. A Model of Post-Traumatic Epilepsy After Penetrating Brain Injuries: Effect of Lesion Size and Metal Fragments

    PubMed Central

    Kendirli, M. Tansel; Rose, Dominique T.; Bertram, Edward H.

    2014-01-01

    Objective Penetrating brain injury (PBI) has the highest risk for inducing post-traumatic epilepsy and retained foreign materials such as bullet fragments carry the greatest risk. This study examines the potential contribution of copper, a major component of bullets, to the development of epilepsy following PBI. Methods Anesthetized adult male rats received a penetrating injury from the dorsal cortex to the ventral hippocampus from a high speed small bit drill. In one group of animals, copper wire was inserted into the lesion. Control animals had only the lesion or the lesion plus stainless steel wire (biologically inert foreign body). From 6 to up to 11 months following the injury the rats were monitored intermittently for the development of epilepsy with video-EEG. A separate set of animals was examined for possible acute seizures in the week following the injury. Results 22 of the 23 animals with copper wire developed chronic epilepsy compared to 3 of the 20 control rats (lesion and lesion with stainless steel). Copper was associated with more extensive injury. The control rats with epilepsy had larger lesions. In the acute injury group, there was no difference in the incidence of seizures (83% lesion plus stainless steel, 70% lesion plus copper). Conclusions Copper increases the risk for epilepsy and may increase damage over time, but there were no differences between the groups in the incidence of acute post-injury seizures. Lesion size may contribute to epilepsy development in lesion only animals. Copper maybe an independent risk factor for the development of epilepsy and possible secondary injury, but lesion size also contributes to the development of epilepsy. The consequences of prolonged exposure of the brain to copper observed in these animals may have clinical implications that require further evaluation. PMID:25470332

  18. Fully 3D-Integrated Pixel Detectors for X-Rays

    DOE PAGES

    Deptuch, Grzegorz W.; Gabriella, Carini; Enquist, Paul; ...

    2016-01-01

    The vertically integrated photon imaging chip (VIPIC1) pixel detector is a stack consisting of a 500-μm-thick silicon sensor, a two-tier 34-μm-thick integrated circuit, and a host printed circuit board (PCB). The integrated circuit tiers were bonded using the direct bonding technology with copper, and each tier features 1-μm-diameter through-silicon vias that were used for connections to the sensor on one side, and to the host PCB on the other side. The 80-μm-pixel-pitch sensor was the direct bonding technology with nickel bonded to the integrated circuit. The stack was mounted on the board using Sn–Pb balls placed on a 320-μm pitch,more » yielding an entirely wire-bond-less structure. The analog front-end features a pulse response peaking at below 250 ns, and the power consumption per pixel is 25 μW. We successful completed the 3-D integration and have reported here. Additionally, all pixels in the matrix of 64 × 64 pixels were responding on well-bonded devices. Correct operation of the sparsified readout, allowing a single 153-ns bunch timing resolution, was confirmed in the tests on a synchrotron beam of 10-keV X-rays. An equivalent noise charge of 36.2 e - rms and a conversion gain of 69.5 μV/e - with 2.6 e - rms and 2.7 μV/e - rms pixel-to-pixel variations, respectively, were measured.« less

  19. DOE Office of Scientific and Technical Information (OSTI.GOV)

    Deptuch, Grzegorz W.; Gabriella, Carini; Enquist, Paul

    The vertically integrated photon imaging chip (VIPIC1) pixel detector is a stack consisting of a 500-μm-thick silicon sensor, a two-tier 34-μm-thick integrated circuit, and a host printed circuit board (PCB). The integrated circuit tiers were bonded using the direct bonding technology with copper, and each tier features 1-μm-diameter through-silicon vias that were used for connections to the sensor on one side, and to the host PCB on the other side. The 80-μm-pixel-pitch sensor was the direct bonding technology with nickel bonded to the integrated circuit. The stack was mounted on the board using Sn–Pb balls placed on a 320-μm pitch,more » yielding an entirely wire-bond-less structure. The analog front-end features a pulse response peaking at below 250 ns, and the power consumption per pixel is 25 μW. We successful completed the 3-D integration and have reported here. Additionally, all pixels in the matrix of 64 × 64 pixels were responding on well-bonded devices. Correct operation of the sparsified readout, allowing a single 153-ns bunch timing resolution, was confirmed in the tests on a synchrotron beam of 10-keV X-rays. An equivalent noise charge of 36.2 e - rms and a conversion gain of 69.5 μV/e - with 2.6 e - rms and 2.7 μV/e - rms pixel-to-pixel variations, respectively, were measured.« less

  20. Ultrastrong Graphene-Copper Core-Shell Wires for High-Performance Electrical Cables.

    PubMed

    Kim, Sang Jin; Shin, Dong Heon; Choi, Yong Seok; Rho, Hokyun; Park, Min; Moon, Byung Joon; Kim, Youngsoo; Lee, Seuoung-Ki; Lee, Dong Su; Kim, Tae-Wook; Lee, Sang Hyun; Kim, Keun Soo; Hong, Byung Hee; Bae, Sukang

    2018-03-27

    Recent development in mobile electronic devices and electric vehicles requires electrical wires with reduced weight as well as enhanced stability. In addition, since electric energy is mostly generated from power plants located far from its consuming places, mechanically stronger and higher electric power transmission cables are strongly demanded. However, there has been no alternative materials that can practically replace copper materials. Here, we report a method to prepare ultrastrong graphene fibers (GFs)-Cu core-shell wires with significantly enhanced electrical and mechanical properties. The core GFs are synthesized by chemical vapor deposition, followed by electroplating of Cu shells, where the large surface area of GFs in contact with Cu maximizes the mechanical toughness of the core-shell wires. At the same time, the unique electrical and thermal characteristics of graphene allow a ∼10 times higher current density limit, providing more efficient and reliable delivery of electrical energies through the GFs-Cu wires. We believe that our results would be useful to overcome the current limit in electrical wires and cables for lightweight, energy-saving, and high-power applications.

  1. Effect of Minor Titanium Addition on Copper/Diamond Composites Prepared by Hot Forging

    NASA Astrophysics Data System (ADS)

    Yang, Fei; Sun, Wei; Singh, Ajit; Bolzoni, Leandro

    2018-03-01

    Copper/diamond composites have great potential to lead the next generation of advanced heat sink materials for use in high-power electronic devices and high-density integrated circuits because of their potential excellent properties of high thermal conductivity and close thermal expansion to the chip materials (e.g., Si, InP, GaAs). However, the poor wettability between copper and diamond presents a challenge for synthesizing copper/diamond composites with effective metallurgical bonding and satisfied thermal performance. In this article, copper/diamond composites were successfully prepared by hot forging of elemental copper and artificial diamond powders with small amounts (0 vol.%, 3 vol.% and 5 vol.%) of titanium additives. Microstructure observation and mechanical tests showed that adding minor titanium additions in the copper/diamond composite resulted in fewer cracks in the composites' microstructure and significantly improved the bonding between the copper and diamond. The strongest bonding strength was achieved for the copper/diamond composite with 3 vol.% titanium addition, and the possible reasons were discussed.

  2. Evaluation of mechanical properties in metal wire mesh supported selective catalytic reduction (SCR) catalyst structures

    NASA Astrophysics Data System (ADS)

    Rajath, S.; Siddaraju, C.; Nandakishora, Y.; Roy, Sukumar

    2018-04-01

    The objective of this research is to evaluate certain specific mechanical properties of certain stainless steel wire mesh supported Selective catalytic reduction catalysts structures wherein the physical properties of the metal wire mesh and also its surface treatments played vital role thereby influencing the mechanical properties. As the adhesion between the stainless steel wire mesh and the catalyst material determines the bond strength and the erosion resistance of catalyst structures, surface modifications of the metal- wire mesh structure in order to facilitate the interface bonding is therefore very important to realize enhanced level of mechanical properties. One way to enhance such adhesion properties, the stainless steel wire mesh is treated with the various acids, i.e., chromic acid, phosphoric acid including certain mineral acids and combination of all those in various molar ratios that could generate surface active groups on metal surface that promotes good interface structure between the metal- wire mesh and metal oxide-based catalyst material and then the stainless steel wire mesh is dipped in the glass powder slurry containing some amount of organic binder. As a result of which the said catalyst material adheres to the metal-wire mesh surface more effectively that improves the erosion profile of supported catalysts structure including bond strength.

  3. Twin-Axial Wire Antenna

    DTIC Science & Technology

    2015-08-06

    12 and 14 can be of differing gauges and can be either stranded or solid. In a prototype, both conductors were made from #22 solid copper wire ...08-2015 Publication Twin-Axial Wire Antenna David A. Tonn Naval Under Warfare Center Division, Newport 1176 Howell St., Code 00L, Bldg 102T...Approved for Public Release Distribution is unlimited Attorney Docket No. 300030 1 of 10 TWIN-AXIAL WIRE ANTENNA STATEMENT OF GOVERNMENT INTEREST

  4. Dianionic Carbon-Bridged Scandium-Copper/Silver Heterobimetallic Complexes: Synthesis, Bonding, and Reactivity.

    PubMed

    Wang, Chen; Xiang, Li; Yang, Yan; Fang, Jian; Maron, Laurent; Leng, Xuebing; Chen, Yaofeng

    2018-04-11

    Alkylidene-bridged scandium-copper/silver heterobimetallic complexes were synthesized and structurally characterized. The complexes contain different Sc-C and M-C (M=Cu I , Ag I ) bonds. The reactivity of the scandium-copper heterobimetallic complex was also studied, which reveals that the heterobimetallic complex is a reaction intermediate for the transmetalation of akylidene group from Sc III to Cu I . The scandium-copper heterobimetallic complex also undergoes an addition reaction with CO, resulting in the formation of a new C=C double bond. DFT calculations were used to study the bonding and the subsequent reactivity with CO of the scandium-copper heterobimetallic complex. It clearly demonstrates a cooperative effect between the two metal centers through the formation of a direct Sc⋅⋅⋅Cu interaction that drives the reactivity with CO. © 2018 Wiley-VCH Verlag GmbH & Co. KGaA, Weinheim.

  5. Structure, growth kinetics, and ledge flow during vapor-solid-solid growth of copper-catalyzed silicon nanowires.

    PubMed

    Wen, C-Y; Reuter, M C; Tersoff, J; Stach, E A; Ross, F M

    2010-02-10

    We use real-time observations of the growth of copper-catalyzed silicon nanowires to determine the nanowire growth mechanism directly and to quantify the growth kinetics of individual wires. Nanowires were grown in a transmission electron microscope using chemical vapor deposition on a copper-coated Si substrate. We show that the initial reaction is the formation of a silicide, eta'-Cu(3)Si, and that this solid silicide remains on the wire tips during growth so that growth is by the vapor-solid-solid mechanism. Individual wire directions and growth rates are related to the details of orientation relation and catalyst shape, leading to a rich morphology compared to vapor-liquid-solid grown nanowires. Furthermore, growth occurs by ledge propagation at the silicide/silicon interface, and the ledge propagation kinetics suggest that the solubility of precursor atoms in the catalyst is small, which is relevant to the fabrication of abrupt heterojunctions in nanowires.

  6. Wire-inhomogeneity detector

    DOEpatents

    Gibson, G.H.; Smits, R.G.; Eberhard, P.H.

    1982-08-31

    A device for uncovering imperfections in electrical conducting wire, particularly superconducting wire, by detecting variations in eddy currents. Eddy currents effect the magnetic field in a gap of an inductor, contained in a modified commercial ferrite core, through which the wire being tested is passed. A small increase or decrease in the amount of conductive material, such as copper, in a fixed cross section of wire will unbalance a bridge used to measure the impedance of the inductor, tripping a detector and sounding an alarm.

  7. Artificial Leaks in Container Closure Integrity Testing: Nonlinear Finite Element Simulation of Aperture Size Originated by a Copper Wire Sandwiched between the Stopper and the Glass Vial.

    PubMed

    Nieto, Alejandra; Roehl, Holger; Brown, Helen; Adler, Michael; Chalus, Pascal; Mahler, Hanns-Christian

    2016-01-01

    Container closure integrity (CCI) testing is required by different regulatory authorities in order to provide assurance of tightness of the container closure system against possible contamination, for example, by microorganisms. Microbial ingress CCI testing is performed by incubation of the container closure system with microorganisms under specified testing conditions. Physical CCI uses surrogate endpoints, such as coloration by dye solution ingress or gas flow (helium leakage testing). In order to correlate microbial CCI and physical CCI test methods and to evaluate the methods' capability to detect a given leak, artificial leaks are being introduced into the container closure system in a variety of different ways. In our study, artificial leaks were generated using inserted copper wires between the glass vial opening and rubber stopper. However, the insertion of copper wires introduces leaks of unknown size and shape. With nonlinear finite element simulations, the aperture size between the rubber stopper and the glass vial was calculated, depending on wire diameter and capping force. The dependency of the aperture size on the copper wire diameter was quadratic. With the data obtained, we were able to calculate the leak size and model leak shape. Our results suggest that the size as well as the shape of the artificial leaks should be taken into account when evaluating critical leak sizes, as flow rate does not, independently, correlate to hole size. Capping force also affected leak size. An increase in the capping force from 30 to 70 N resulted in a reduction of the aperture (leak size) by approximately 50% for all wire diameters. From 30 to 50 N, the reduction was approximately 33%. Container closure integrity (CCI) testing is required by different regulatory authorities in order to provide assurance of tightness of the container closure system against contamination, for example, by microorganisms. Microbial ingress CCI testing is performed by incubation of the container closure system with microorganisms under specified testing conditions. Physical CCI uses surrogate endpoints, such as coloration by dye solution ingress or gas flow. In order to correlate microbial ingress CCI and physical CCI test methods and to evaluate the methods' capability to detect a given leak, artificially created defects (artificial leaks) are being introduced into the container closure system in a variety of different ways. In our study, artificial leaks were generated using inserted copper wires between the glass vial opening and rubber stopper. Up to date, the insertion of copper wires introduced leaks of unknown size and shape. With nonlinear finite element simulations, the effective aperture size between the rubber stopper and the glass vial was calculated, depending on wire diameter and capping force, and the leak shape was modelled. Our results suggest that the size as well as the shape of the artificial leaks should be taken into account when evaluating critical leak sizes, as flow rate does not, independently, correlate to the hole size. © PDA, Inc. 2016.

  8. 46 CFR 169.672 - Wiring for power and lighting circuits.

    Code of Federal Regulations, 2011 CFR

    2011-10-01

    ...) Wiring for power and lighting circuits must have copper conductors, of 14 AWG or larger, and— (1) Meet... must have stranded conductors. (c) Conductors must be sized so that— (1) They are adequate for the...

  9. Finite element bond models for seven-wire prestressing strands in concrete crossties.

    DOT National Transportation Integrated Search

    2015-03-23

    Seven-wire strands are commonly used in pretensioned : concrete ties, but its bonding mechanism with concrete needs : further examination to provide a better understanding of some : concrete tie failure modes. As a key component in the finite : eleme...

  10. Report on accelerated corrosion studies.

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Mowry, Curtis Dale; Glass, Sarah Jill; Sorensen, Neil Robert

    2011-03-01

    Sandia National Laboratories (SNL) conducted accelerated atmospheric corrosion testing for the U.S. Consumer Product Safety Commission (CPSC) to help further the understanding of the development of corrosion products on conductor materials in household electrical components exposed to environmental conditions representative of homes constructed with problem drywall. The conditions of the accelerated testing were chosen to produce corrosion product growth that would be consistent with long-term exposure to environments containing humidity and parts per billion (ppb) levels of hydrogen sulfide (H{sub 2}S) that are thought to have been the source of corrosion in electrical components from affected homes. This report documentsmore » the test set-up, monitoring of electrical performance of powered electrical components during the exposure, and the materials characterization conducted on wires, screws, and contact plates from selected electrical components. No degradation in electrical performance (measured via voltage drop) was measured during the course of the 8-week exposure, which was approximately equivalent to 40 years of exposure in a light industrial environment. Analyses show that corrosion products consisting of various phases of copper sulfide, copper sulfate, and copper oxide are found on exposed surfaces of the conductor materials including wires, screws, and contact plates. The morphology and the thickness of the corrosion products showed a range of character. In some of the copper wires that were observed, corrosion product had flaked or spalled off the surface, exposing fresh metal to the reaction with the contaminant gasses; however, there was no significant change in the wire cross-sectional area.« less

  11. Sheath-flow electrochemical detection of amino acids with a copper wire electrode in capillary electrophoresis.

    PubMed

    Inoue, Junji; Kaneta, Takashi; Imasaka, Totaro

    2012-09-01

    Here, we report the detection of native amino acids using a sheath-flow electrochemical detector with a working electrode made of copper wire. A separation capillary that was inserted into a platinum tube in the detector acted as a grounded electrode for electrophoresis and as a flow channel for sheath liquid. Sheath liquid flowed outside the capillary to support the transport of the separated analytes to the working electrode for electrochemical detection. The copper wire electrode was aligned at the outlet of the capillary in a wall-jet configuration. Amino acids injected into the capillary were separated following elution from the end of the capillary and detection by the copper electrode. Three kinds of copper electrodes with different diameters-50, 125, and 300 μm-were examined to investigate the effect of the electrode diameter on sensitivity. The peak widths of the analytes were independent of the diameter of the working electrode, while the 300-μm electrode led to a decrease in the signal-to-noise ratio compared with the 50- and 125-μm electrodes, which showed no significant difference. The flow rate of the sheath liquid was also varied to optimize the detection conditions. The limits of detection for amino acids ranged from 4.4 to 27 μM under optimal conditions. © 2012 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

  12. Mechanical properties of NiTi and CuNiTi wires used in orthodontic treatment. Part 2: Microscopic surface appraisal and metallurgical characteristics

    PubMed Central

    Gravina, Marco Abdo; Canavarro, Cristiane; Elias, Carlos Nelson; Chaves, Maria das Graças Afonso Miranda; Brunharo, Ione Helena Vieira Portella; Quintão, Cátia Cardoso Abdo

    2014-01-01

    Objective This research aimed at comparing the qualitative chemical compositions and the surface morphology of fracture regions of eight types of Nickel (Ni) Titanium (Ti) conventional wires, superelastic and heat-activated (GAC, TP, Ormco, Masel, Morelli and Unitek), to the wires with addition of copper (CuNiTi 27ºC and 35ºC, Ormco) after traction test. Methods The analyses were performed in a scanning electronic microscope (JEOL, model JSM-5800 LV) with EDS system of microanalysis (energy dispersive spectroscopy). Results The results showed that NiTi wires presented Ni and Ti as the main elements of the alloy with minimum differences in their composition. The CuNiTi wires, however, presented Ni and Ti with a significant percentage of copper (Cu). As for surface morphology, the wires that presented the lowest wire-surface roughness were the superelastic ones by Masel and Morelli, while those that presented the greatest wire-surface roughness were the CuNiTi 27ºC and 35ºC ones by Ormco, due to presence of microcavity formed as a result of pulling out some particles, possibly of NiTi.4 The fracture surfaces presented characteristics of ductile fracture, with presence of microcavities. The superelastic wires by GAC and the CuNiTi 27ºC and the heat-activated ones by Unitek presented the smallest microcavities and the lowest wire-surface roughness with regard to fracture, while the CuNiTi 35ºC wires presented inadequate wire-surface roughness in the fracture region. Conclusion CuNiTi 35ºC wires did not present better morphologic characteristics in comparison to the other wires with regard to surfaces and fracture region. PMID:24713562

  13. Processing and Characterization of Liquid-Phase Sintered NiTi Woven Structures

    NASA Astrophysics Data System (ADS)

    Erdeniz, Dinc; Weidinger, Ryan P.; Sharp, Keith W.; Dunand, David C.

    2018-03-01

    Porous NiTi is of interest for bone implants because of its unique combination of biocompatibility (encouraging osseointegration), high strength (to prevent fracture), low stiffness (to reduce stress shielding), and shape memory or superelasticity (to deploy an implant). A promising method for creating NiTi structures with regular open channels is via 3D weaving of NiTi wires. This paper presents a processing method to bond woven NiTi wire structures at contact points between wires to achieve structural integrity: (i) a slurry consisting of a blend of NiTi and Nb powders is deposited on the surface of the NiTi wires after the weaving operation; (ii) the powders are melted to create a eutectic liquid phase which collects at contact points; and (iii) the liquid is solidified and binds the NiTi woven structures. The bonded NiTi wire structures exhibited lower transformation temperatures compared to the as-woven NiTi wires because of Nb diffusion into the NiTi wires. A bonded woven sample was deformed in bending and showed near-complete recovery up to 6% strain and recovered nearly half of the deformation up to 19% strain.

  14. Bond between smooth prestressing wires and concrete : finite element model and transfer length analysis for pretensioned concrete crossties.

    DOT National Transportation Integrated Search

    2014-04-03

    Pretensioned concrete ties are increasingly employed in railroad high speed : and heavy haul applications. The bond between prestressing wires or strands and : concrete plays an important role in determining the transfer length of pretensioned : conc...

  15. Carbon black dispersion pre-plating technology for printed wire board manufacturing. Final technology evaluation report

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Folsom, D.W.; Gavaskar, A.R.; Jones, J.A.

    1993-10-01

    The project compared chemical use, waste generation, cost, and product quality between electroless copper and carbon-black-based preplating technologies at the printed wire board (PWB) manufacturing facility of McCurdy Circuits in Orange, CA. The carbon-black based preplating technology evaluated is used as an alternative process for electroless copper (EC) plating of through-holes before electrolytic copper plating. The specific process used at McCurdy is the BlackHole (BH) technology process, which uses a dispersion of carbon black in an aqueous solution to provide a conductive surface for subsequent electrolytic copper plating. The carbon-black dispersion technology provided effective waste reduction and long-term cost savings.more » The economic analysis determined that the new process was cost efficient because chemical use was reduced and the process proved more efficient; the payback period was less than 4 yrs.« less

  16. C–H bond halogenation catalyzed or mediated by copper: an overview

    PubMed Central

    Hao, Wenyan

    2015-01-01

    Summary Carbon–halogen (C–X) bonds are amongst the most fundamental groups in organic synthesis, they are frequently and widely employed in the synthesis of numerous organic products. The generation of a C–X bond, therefore, constitutes an issue of universal interest. Herein, the research advances on the copper-catalyzed and mediated C–X (X = F, Cl, Br, I) bond formation via direct C–H bond transformation is reviewed. PMID:26664634

  17. Introduction to Shaped Charges

    DTIC Science & Technology

    2007-03-01

    Figure 144. Late time collapse of a hemispherical depleted uranium liner. COPPER 430MM(17") LEAD-TIN EUTECTIC Figure 145. Comparison between...46 Figure 91. Setup for diffusion bonding of copper- nickel assemblies, temperature is 982 °C, time is 1–3 hr, argon atmosphere...46 Figure 92. Diffusion-bonded alternately layered copper- nickel

  18. Crack width monitoring of concrete structures based on smart film

    NASA Astrophysics Data System (ADS)

    Zhang, Benniu; Wang, Shuliang; Li, Xingxing; Zhang, Xu; Yang, Guang; Qiu, Minfeng

    2014-04-01

    Due to its direct link to structural security, crack width is thought to be one of the most important parameters reflecting damage conditions of concrete structures. However, the width problem is difficult to solve with the existing structural health monitoring methods. In this paper, crack width monitoring by means of adhering enameled copper wires with different ultimate strains on the surface of structures is proposed, based on smart film crack monitoring put forward by the present authors. The basic idea of the proposed method is related to a proportional relationship between the crack width and ultimate strain of the broken wire. Namely, when a certain width of crack passes through the wire, some low ultimate strain wires will be broken and higher ultimate strain wires may stay non-broken until the crack extends to a larger scale. Detection of the copper wire condition as broken or non-broken may indicate the width of the structural crack. Thereafter, a multi-layered stress transfer model and specimen experiment are performed to quantify the relationship. A practical smart film is then redesigned with this idea and applied to Chongqing Jiangjin Yangtze River Bridge.

  19. DOE Office of Scientific and Technical Information (OSTI.GOV)

    Lula, J.W.

    Copper foil adhesion to polyimide/glass prepreg was evaluated. Typical peel strength obtained between prepreg and the smooth side of the copper foil was 1 to 3 lb./in. width. Peel strength between prepreg and the rough side of the copper foil ranged between 6 and 7 lb./in. width. An alternate test for evaluating the integrity of multilayer printed wiring boards is described.

  20. Joining of alumina via copper/niobium/copper interlayers

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Marks, Robert A.; Chapman, Daniel R.; Danielson, David T.

    2000-03-15

    Alumina has been joined at 1150 degrees C and 1400 degrees C using multilayer copper/niobium/copper interlayers. Four-point bend strengths are sensitive to processing temperature, bonding pressure, and furnace environment (ambient oxygen partial pressure). Under optimum conditions, joints with reproducibly high room temperature strengths (approximately equal 240 plus/minus 20 MPa) can be produced; most failures occur within the ceramic. Joints made with sapphire show that during bonding an initially continuous copper film undergoes a morphological instability, resulting in the formation of isolated copper-rich droplets/particles at the sapphire/interlayer interface, and extensive regions of direct bonding between sapphire and niobium. For optimized aluminamore » bonds, bend tests at 800 degrees C-1100 degrees C indicate significant strength is retained; even at the highest test temperature, ceramic failure is observed. Post-bonding anneals at 1000 degrees C in vacuum or in gettered argon were used to assess joint stability and to probe the effect of ambient oxygen partial pressure on joint characteristics. Annealing in vacuum for up to 200 h causes no significant decrease in room temperature bend strength or change in fracture path. With increasing anneal time in a lower oxygen partial pressure environment, the fracture strength decreases only slightly, but the fracture path shifts from the ceramic to the interface.« less

  1. High temperature autoclave vacuum seals

    NASA Technical Reports Server (NTRS)

    Hoffman, J. R.; Simpson, W. G.; Walker, H. M.

    1971-01-01

    Aluminum sheet forms effective sealing film at temperatures up to 728 K. Soft aluminum wire rings provide positive seal between foil and platen. For applications at temperatures above aluminum's service temperature, stainless steel is used as film material and copper wire as sealant.

  2. Fiber vs Rolling Texture: Stress State Dependence for Cold-Drawn Wire

    NASA Astrophysics Data System (ADS)

    Zorina, M. A.; Karabanalov, M. S.; Stepanov, S. I.; Demakov, S. L.; Loginov, Yu. N.; Lobanov, M. L.

    2018-02-01

    The texture of the cold-drawn copper wire was investigated along the radius using electron backscatter diffraction. The complex fiber texture of the central region of the wire was considered as the rolling texture consisting of a set of preferred orientations. The texture of the periphery region was revealed to be similar to the shear texture. The orientation-dependent properties of the wire were proven to be determined by the texture of the near-surface layers.

  3. Wire-packed heat exchangers for dilution refrigerators.

    PubMed

    Polturak, E; Rappaport, M; Rosenbaum, R

    1978-03-01

    Very simple wire-packed step heat exchangers for dilution refrigerators are described. No sintering is used in fabrication. Flow impedances and thermal resistance between the liquid and the copper wires are low. A refrigerator with five wire-packed heat exchangers in addition to a countercurrent heat exchanger attains a temperature of 11.4 mK with a single mixing chamber and 6.1 mK with two mixing chambers. High cooling power is achieved at modest (3)He circulation rates.

  4. Current shunting and formation of stationary shock waves during electric explosions of metal wires in air

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Ivanenkov, G. V.; Gus'kov, S. Yu.; Barishpol'tsev, D. V.

    2010-01-15

    Results of experiments on the generation of shock waves during electric explosions of fine copper and tungsten wires in air are analyzed. The generation mechanism of stationary shock wave by a plasma piston formed during the shunting breakdown of the electrode gap in the course of a wire explosion is investigated. The role of structural elements of such discharges, such as the core, corona, and wire environment, is analyzed.

  5. Impact tensile testing of wires

    NASA Technical Reports Server (NTRS)

    Dawson, T. H.

    1976-01-01

    The test consists of fixing one end of a wire specimen and allowing a threaded falling weight to strike the other. Assuming the dynamic stress in the wire to be a function only of its strain, energy considerations show for negligible wire inertia effects that the governing dynamic stress-strain law can be determined directly from impact energy vs. wire elongation data. Theoretical calculations are presented which show negligible wire inertia effects for ratios of wire mass to striking mass of the order of .01 or less. The test method is applied to soft copper wires and the dynamic stress-strain curve so determined is found to be about 30 percent higher than the corresponding static curve.

  6. Wire inhomogeneity detector having a core with opposing pole pieces and guide pieces adjacent the opposing pole pieces

    DOEpatents

    Gibson, George H.; Smits, Robert G.; Eberhard, Philippe H.

    1989-01-01

    A device for uncovering imperfections in electrical conducting wire, particularly superconducting wire, by detecting variations in eddy currents. Eddy currents effect the magnetic field in a gap of an inductor, contained in a modified commercial ferrite core, through which the wire being tested is passed. A small increase or decrease in the amount of conductive material, such as copper, in a fixed cross section of wire will unbalance a bridge used to measure the impedance of the inductor, tripping a detector and sounding an alarm.

  7. Comparative evaluation of microleakage of lingual retainer wires bonded with three different lingual retainer composites: an in vitro study.

    PubMed

    Nimbalkar-Patil, Smita; Vaz, Anna; Patil, Pravinkumar G

    2014-11-01

    To evaluate microleakage when two types of retainer wires were bonded with two light cured and a self cured lingual retainer composites. Total 120 freshly extracted human mandibular incisor teeth were collected and separated into six subgroups of 20 teeth each. Two different wires, a 0.036 inch hard round stainless steel (HRSS) wire sandblasted at the ends and 0.0175 inch multistranded wire bonded onto the lingual surfaces of the incisors with three different types of composite resins of 3M company; Concise Orthodontic (self-cure), Transbond XT (light-cure) and Transbond LR (light-cure). Specimens were further sealed with a nail varnish, stained with 0.5% basic fuchsine for 24 hours, sectioned and examined under a stereomicroscope, and scored for microleakage for the enamel-composite and wire-composite interfaces. Statistical analysis was performed by Kruskal-Wallis and Mann-Whitney U-tests. For HRSS wire, at the enamel-composite interface, the microleakage was least with Transbond LR followed by Concise Orthodontic and greatest for Transbond XT (p<0.05). At the wire composite interface too, the microleakage was in order of Transbond LR

  8. Electrothermal Action of the Pulse of the Current of a Short Artificial-Lightning Stroke on Test Specimens of Wires and Cables of Electric Power Objects

    NASA Astrophysics Data System (ADS)

    Baranov, M. I.; Rudakov, S. V.

    2018-03-01

    The authors have given results of investigations of the electrothermal action of aperiodic pulses of temporal shape 10/350 μs of the current of a short artificial-lightning stroke on test specimens of electric wires and cables with copper and aluminum cores and sheaths with polyvinylchloride and polyethylene insulations of power circuits of industrial electric power objects. It has been shown that the thermal stability of such wires and cables is determined by the action integral of the indicated current pulse. The authors have found the maximum permissible and critical densities of this pulse in copper and aluminum current-carrying parts of the wires and cables. High-current experiments conducted under high-voltage laboratory conditions on a unique generator of 10/350 μs pulses of an artificial-lightning current with amplitude-time parameters normalized according to the existing requirements of international and national standards and with tolerances on them have confirmed the reliability of the proposed calculated estimate for thermal lightning resistance of cabling and wiring products.

  9. Electrothermal Action of the Pulse of the Current of a Short Artificial-Lightning Stroke on Test Specimens of Wires and Cables of Electric Power Objects

    NASA Astrophysics Data System (ADS)

    Baranov, M. I.; Rudakov, S. V.

    2018-05-01

    The authors have given results of investigations of the electrothermal action of aperiodic pulses of temporal shape 10/350 μs of the current of a short artificial-lightning stroke on test specimens of electric wires and cables with copper and aluminum cores and sheaths with polyvinylchloride and polyethylene insulations of power circuits of industrial electric power objects. It has been shown that the thermal stability of such wires and cables is determined by the action integral of the indicated current pulse. The authors have found the maximum permissible and critical densities of this pulse in copper and aluminum current-carrying parts of the wires and cables. High-current experiments conducted under high-voltage laboratory conditions on a unique generator of 10/350 μs pulses of an artificial-lightning current with amplitude-time parameters normalized according to the existing requirements of international and national standards and with tolerances on them have confirmed the reliability of the proposed calculated estimate for thermal lightning resistance of cabling and wiring products.

  10. Multifilament Superconducting Wire Based on NbTi Alloy in a Combined Copper/Copper-Nickel Matrix

    NASA Astrophysics Data System (ADS)

    Vedernikov, G. P.; Shikov, A. K.; Potanina, L. V.; Gubkin, I. N.; Scherbakova, O. V.; Salunin, N. I.; Korpusov, V. U.; Novikov, S. I.; Novikov, M. S.

    2004-06-01

    Model fine filament superconducting 0.65 mm wire based on NbTi alloy, intended for operating in fields having sweep rate from 1 up to 4 T/s, has been developed and manufactured by Bochvar Institute (VNIINM). The wire was fabricated by a single stacking method. Each filament was surrounded by a matrix of commercial MN-5 alloy (Cu-5wt.%Ni). The effects of heat treatment regimes, and twist pitches within the range of 3.5 - 8 mm on Jc of the strand were investigated at fields of 2-8 T. The critical current density is more than 2700 A/mm2 at 5 T, 4.2 K. The magnetization of wire has been measured by a vibrating magnetometer at field amplitude up to ± 3 T. Hysteresis losses and effective diameter were calculated. Total and coupling losses have been determined by Fitz method on strand magnetization at fields, varying in trapezoidal mode. It was shown that the wire of this type is of potential application for the use in the magnets of the GSI-type accelerator to be constructed in Germany.

  11. In vivo biofilm formation on stainless steel bonded retainers during different oral health-care regimens.

    PubMed

    Jongsma, Marije A; van der Mei, Henny C; Atema-Smit, Jelly; Busscher, Henk J; Ren, Yijin

    2015-03-23

    Retention wires permanently bonded to the anterior teeth are used after orthodontic treatment to prevent the teeth from relapsing to pre-treatment positions. A disadvantage of bonded retainers is biofilm accumulation on the wires, which produces a higher incidence of gingival recession, increased pocket depth and bleeding on probing. This study compares in vivo biofilm formation on single-strand and multi-strand retention wires with different oral health-care regimens. Two-centimetre wires were placed in brackets that were bonded to the buccal side of the first molars and second premolars in the upper arches of 22 volunteers. Volunteers used a selected toothpaste with or without the additional use of a mouthrinse containing essential oils. Brushing was performed manually. Regimens were maintained for 1 week, after which the wires were removed and the oral biofilm was collected to quantify the number of organisms and their viability, determine the microbial composition and visualize the bacteria by electron microscopy. A 6-week washout period was employed between regimens. Biofilm formation was reduced on single-strand wires compared with multi-strand wires; bacteria were observed to adhere between the strands. The use of antibacterial toothpastes marginally reduced the amount of biofilm on both wire types, but significantly reduced the viability of the biofilm organisms. Additional use of the mouthrinse did not result in significant changes in biofilm amount or viability. However, major shifts in biofilm composition were induced by combining a stannous fluoride- or triclosan-containing toothpaste with the mouthrinse. These shifts can be tentatively attributed to small changes in bacterial cell surface hydrophobicity after the adsorption of the toothpaste components, which stimulate bacterial adhesion to the hydrophobic oil, as illustrated for a Streptococcus mutans strain.

  12. In vivo biofilm formation on stainless steel bonded retainers during different oral health-care regimens

    PubMed Central

    Jongsma, Marije A; van der Mei, Henny C; Atema-Smit, Jelly; Busscher, Henk J; Ren, Yijin

    2015-01-01

    Retention wires permanently bonded to the anterior teeth are used after orthodontic treatment to prevent the teeth from relapsing to pre-treatment positions. A disadvantage of bonded retainers is biofilm accumulation on the wires, which produces a higher incidence of gingival recession, increased pocket depth and bleeding on probing. This study compares in vivo biofilm formation on single-strand and multi-strand retention wires with different oral health-care regimens. Two-centimetre wires were placed in brackets that were bonded to the buccal side of the first molars and second premolars in the upper arches of 22 volunteers. Volunteers used a selected toothpaste with or without the additional use of a mouthrinse containing essential oils. Brushing was performed manually. Regimens were maintained for 1 week, after which the wires were removed and the oral biofilm was collected to quantify the number of organisms and their viability, determine the microbial composition and visualize the bacteria by electron microscopy. A 6-week washout period was employed between regimens. Biofilm formation was reduced on single-strand wires compared with multi-strand wires; bacteria were observed to adhere between the strands. The use of antibacterial toothpastes marginally reduced the amount of biofilm on both wire types, but significantly reduced the viability of the biofilm organisms. Additional use of the mouthrinse did not result in significant changes in biofilm amount or viability. However, major shifts in biofilm composition were induced by combining a stannous fluoride- or triclosan-containing toothpaste with the mouthrinse. These shifts can be tentatively attributed to small changes in bacterial cell surface hydrophobicity after the adsorption of the toothpaste components, which stimulate bacterial adhesion to the hydrophobic oil, as illustrated for a Streptococcus mutans strain. PMID:25572920

  13. Disproportionation for growing copper nanowires and their controlled self-assembly facilitated by ligand exchange.

    PubMed

    Ye, Enyi; Zhang, Shuang-Yuan; Liu, Shuhua; Han, Ming-Yong

    2011-03-07

    The coating makes the wire bundle: High-quality free-standing copper nanowires have been successfully produced by disproportionation of Cu(+) in oleylamine. This provides an effective way to prepare high-quality copper nanowires, but also enriches synthetic routes to other nanostructures. These copper nanowires can self-assemble by surface ligand exchange of oleylamine with trioctylphosphine. Copyright © 2011 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

  14. UV laser-assisted wire stripping and micro-machining

    NASA Astrophysics Data System (ADS)

    Martyniuk, Jerry

    1994-02-01

    Results are reported for the use of a 266 nm frequency quadrupled Nd:YAG ultraviolet laser in the areas of wire stripping of small coaxial type transmission lines and for micro-machining of various materials including copper, glass, polyimide and DuPont TEFLONTM. This new laser is typically run with a 2 KHz repetition rate, 40 ns FWHM pulse and a fluence of about 50 joules/cm2 which makes it possible to micro-machine metals, polymers, glasses and ceramics. The high fluence of this laser allows shielding structures such as Al-MylarTM, Al-KaptonTM or the plated copper used in small coaxial cables to be precisely cut. Cut rates are reported for the above materials as well as results and photos of wire stripping and micro- machining.

  15. Electronic scraps--recovering of valuable materials from parallel wire cables.

    PubMed

    de Araújo, Mishene Christie Pinheiro Bezerra; Chaves, Arthur Pinto; Espinosa, Denise Crocce Romano; Tenório, Jorge Alberto Soares

    2008-11-01

    Every year, the number of discarded electro-electronic products is increasing. For this reason recycling is needed, to avoid wasting non-renewable natural resources. The objective of this work is to study the recycling of materials from parallel wire cable through unit operations of mineral processing. Parallel wire cables are basically composed of polymer and copper. The following unit operations were tested: grinding, size classification, dense medium separation, electrostatic separation, scrubbing, panning, and elutriation. It was observed that the operations used obtained copper and PVC concentrates with a low degree of cross contamination. It was concluded that total liberation of the materials was accomplished after grinding to less than 3 mm, using a cage mill. Separation using panning and elutriation presented the best results in terms of recovery and cross contamination.

  16. Composite superconducting wires obtained by high-rate tinning in molten Bi-Pb-Sr-Ca-Cu-O system

    NASA Technical Reports Server (NTRS)

    Grozav, A. D.; Konopko, L. A.; Leporda, N. I.

    1990-01-01

    The preparation of high-T(sub c) superconducting long composite wires by short-time tinning of the metal wires in a molten Bi-Pb-Sr-Ca-Cu-O compound is discussed. The application of this method to the high-T(sub c) materials is tested, possibly for the first time. The initial materials used for this experiment were ceramic samples with nominal composition Bi(1.5)Pb(0.5)Sr2Ca2Cu3O(x) and T(sub c) = 80 K prepared by the ordinary solid-state reaction, and industrial copper wires from 100 to 400 microns in diameter and from 0.5 to 1 m long. The continuously moving wires were let through a small molten zone (approximately 100 cubic mm). The Bi-based high-T(sub c) ceramics in a molten state is a viscous liquid and it has a strongly pronounced ability to spread on metal wire surfaces. The maximum draw rate of the Cu-wire, at which a dense covering is still possible, corresponds to the time of direct contact of wire surfaces and liquid ceramics for less than 0.1 s. A high-rate draw of the wire permits a decrease in the reaction of the oxide melt and Cu-wire. This method of manufacture led to the fabrication of wire with a copper core in a dense covering with uniform thickness of about h approximately equal to 5 to 50 microns. Composite wires with h approximately equal to 10 microns (h/d approximately equal to 0.1) sustained bending on a 15 mm radius frame without cracking during flexing.

  17. A model of posttraumatic epilepsy after penetrating brain injuries: effect of lesion size and metal fragments.

    PubMed

    Kendirli, M Tansel; Rose, Dominique T; Bertram, Edward H

    2014-12-01

    Penetrating brain injury (PBI) has the highest risk for inducing posttraumatic epilepsy, and those PBIs with retained foreign materials such as bullet fragments carry the greatest risk. This study examines the potential contribution of copper, a major component of bullets, to the development of epilepsy following PBI. Anesthetized adult male rats received a penetrating injury from the dorsal cortex to the ventral hippocampus from a high speed small bit drill. In one group of animals, copper wire was inserted into the lesion. Control animals had only the lesion or the lesion plus stainless steel wire (biologically inert foreign body). From 6 to up to 11 months following the injury the rats were monitored intermittently for the development of epilepsy with video-electroencephalography (EEG). A separate set of animals was examined for possible acute seizures in the week following the injury. Twenty-two of the 23 animals with copper wire developed chronic epilepsy, compared to three of the 20 control rats (lesion and lesion with stainless steel). Copper was associated with more extensive injury. The control rats with epilepsy had larger lesions. In the acute injury group, there was no difference in the incidence of seizures (83% lesion plus stainless steel, 70% lesion plus copper). Copper increases the risk for epilepsy and may increase damage over time, but there were no differences between the groups in the incidence of acute postinjury seizures. Lesion size may contribute to epilepsy development in lesion-only animals. Copper may be an independent risk factor for the development of epilepsy and possible secondary injury, but lesion size also contributes to the development of epilepsy. The consequences of prolonged exposure of the brain to copper observed in these animals may have clinical implications that require further evaluation. Wiley Periodicals, Inc. © 2014 International League Against Epilepsy.

  18. Optimized design of a low-resistance electrical conductor for the multimegahertz range

    NASA Astrophysics Data System (ADS)

    Kurs, André; Kesler, Morris; Johnson, Steven G.

    2011-04-01

    We propose a design for a conductive wire composed of several mutually insulated coaxial conducting shells. With the help of numerical optimization, it is possible to obtain electrical resistances significantly lower than those of a heavy-gauge copper wire or litz wire in the 2-20 MHz range. Moreover, much of the reduction in resistance can be achieved for just a few shells; in contrast, litz wire would need to contain ˜104 strands to perform comparably in this frequency range.

  19. Filler wire for aluminum alloys and method of welding

    NASA Technical Reports Server (NTRS)

    Bjorkman, Jr., Gerald W. O. (Inventor); Cho, Alex (Inventor); Russell, Carolyn K. (Inventor)

    2003-01-01

    A weld filler wire chemistry has been developed for fusion welding 2195 aluminum-lithium. The weld filler wire chemistry is an aluminum-copper based alloy containing high additions of titanium and zirconium. The additions of titanium and zirconium reduce the crack susceptibility of aluminum alloy welds while producing good weld mechanical properties. The addition of silver further improves the weld properties of the weld filler wire. The reduced weld crack susceptibility enhances the repair weldability, including when planishing is required.

  20. Carbon nanotube wires and cables: Near-term applications and future perspectives

    NASA Astrophysics Data System (ADS)

    Jarosz, Paul; Schauerman, Christopher; Alvarenga, Jack; Moses, Brian; Mastrangelo, Thomas; Raffaelle, Ryne; Ridgley, Richard; Landi, Brian

    2011-11-01

    Wires and cables are essential to modern society, and opportunities exist to develop new materials with reduced resistance, mass, and/or susceptibility to fatigue. This article describes how carbon nanotubes (CNTs) offer opportunities for integration into wires and cables for both power and data transmission due to their unique physical and electronic properties. Macroscopic CNT wires and ribbons are presently shown as viable replacements for metallic conductors in lab-scale demonstrations of coaxial, USB, and Ethernet cables. In certain applications, such as the outer conductor of a coaxial cable, CNT materials may be positioned to displace metals to achieve substantial benefits (e.g. reduction in cable mass per unit length (mass/length) up to 50% in some cases). Bulk CNT materials possess several unique properties which may offer advantages over metallic conductors, such as flexure tolerance and environmental stability. Specifically, CNT wires were observed to withstand greater than 200,000 bending cycles without increasing resistivity. Additionally, CNT wires exhibit no increase in resistivity after 80 days in a corrosive environment (1 M HCl), and little change in resistivity with temperature (<1% from 170-330 K). This performance is superior to conventional metal wires and truly novel for a wiring material. However, for CNTs to serve as a full replacement for metals, the electrical conductivity of CNT materials must be improved. Recently, the conductivity of a CNT wire prepared through simultaneous densification and doping has exceeded 1.3 × 106 S/m. This level of conductivity brings CNTs closer to copper (5.8 × 107 S/m) and competitive with some metals (e.g. gold) on a mass-normalized basis. Developments in manipulation of CNT materials (e.g. type enrichment, doping, alignment, and densification) have shown progress towards this goal. In parallel with efforts to improve bulk conductivity, integration of CNT materials into cabling architectures will require development in electrical contacting. Several methods for contacting bulk CNT materials to metals are demonstrated, including mechanical crimping and ultrasonic bonding, along with a method for reducing contact resistance by tailoring the CNT-metal interface via electroless plating. Collectively, these results summarize recent progress in CNT wiring technologies and illustrate that nanoscale conductors may become a disruptive technology in cabling designs.

  1. Carbon nanotube wires and cables: near-term applications and future perspectives.

    PubMed

    Jarosz, Paul; Schauerman, Christopher; Alvarenga, Jack; Moses, Brian; Mastrangelo, Thomas; Raffaelle, Ryne; Ridgley, Richard; Landi, Brian

    2011-11-01

    Wires and cables are essential to modern society, and opportunities exist to develop new materials with reduced resistance, mass, and/or susceptibility to fatigue. This article describes how carbon nanotubes (CNTs) offer opportunities for integration into wires and cables for both power and data transmission due to their unique physical and electronic properties. Macroscopic CNT wires and ribbons are presently shown as viable replacements for metallic conductors in lab-scale demonstrations of coaxial, USB, and Ethernet cables. In certain applications, such as the outer conductor of a coaxial cable, CNT materials may be positioned to displace metals to achieve substantial benefits (e.g. reduction in cable mass per unit length (mass/length) up to 50% in some cases). Bulk CNT materials possess several unique properties which may offer advantages over metallic conductors, such as flexure tolerance and environmental stability. Specifically, CNT wires were observed to withstand greater than 200,000 bending cycles without increasing resistivity. Additionally, CNT wires exhibit no increase in resistivity after 80 days in a corrosive environment (1 M HCl), and little change in resistivity with temperature (<1% from 170-330 K). This performance is superior to conventional metal wires and truly novel for a wiring material. However, for CNTs to serve as a full replacement for metals, the electrical conductivity of CNT materials must be improved. Recently, the conductivity of a CNT wire prepared through simultaneous densification and doping has exceeded 1.3 × 10(6) S/m. This level of conductivity brings CNTs closer to copper (5.8 × 10(7) S/m) and competitive with some metals (e.g. gold) on a mass-normalized basis. Developments in manipulation of CNT materials (e.g. type enrichment, doping, alignment, and densification) have shown progress towards this goal. In parallel with efforts to improve bulk conductivity, integration of CNT materials into cabling architectures will require development in electrical contacting. Several methods for contacting bulk CNT materials to metals are demonstrated, including mechanical crimping and ultrasonic bonding, along with a method for reducing contact resistance by tailoring the CNT-metal interface via electroless plating. Collectively, these results summarize recent progress in CNT wiring technologies and illustrate that nanoscale conductors may become a disruptive technology in cabling designs.

  2. Welding Wires To Thin Thermocouple Films

    NASA Technical Reports Server (NTRS)

    Holanda, Raymond; Kim, Walter S.; Danzey, Gerald A.; Pencil, Eric; Wadel, Mary

    1993-01-01

    Parallel-gap resistance welding yields joints surviving temperatures of about 1,000 degrees C. Much faster than thermocompression bonding. Also exceeds conductive-paste bonding and sputtering thin films through porous flame-sprayed insulation on prewelded lead wires. Introduces no foreign material into thermocouple circuit and does not require careful control of thickness of flame-sprayed material.

  3. 49 CFR 177.837 - Class 3 materials.

    Code of Federal Regulations, 2014 CFR

    2014-10-01

    ... through an open filling hole, one end of a bond wire shall be connected to the stationary system piping or... interconnected.) This connection must be made before any filling hole is opened, and must remain in place until after the last filling hole has been closed. Additional bond wires are not needed around All-Metal...

  4. 49 CFR 177.837 - Class 3 materials.

    Code of Federal Regulations, 2012 CFR

    2012-10-01

    ... through an open filling hole, one end of a bond wire shall be connected to the stationary system piping or... interconnected.) This connection must be made before any filling hole is opened, and must remain in place until after the last filling hole has been closed. Additional bond wires are not needed around All-Metal...

  5. 49 CFR 177.837 - Class 3 materials.

    Code of Federal Regulations, 2013 CFR

    2013-10-01

    ... through an open filling hole, one end of a bond wire shall be connected to the stationary system piping or... interconnected.) This connection must be made before any filling hole is opened, and must remain in place until after the last filling hole has been closed. Additional bond wires are not needed around All-Metal...

  6. 49 CFR 177.837 - Class 3 materials.

    Code of Federal Regulations, 2011 CFR

    2011-10-01

    ... through an open filling hole, one end of a bond wire shall be connected to the stationary system piping or integrally connected steel framing, and the other end to the shell of the cargo tank to provide a continuous... after the last filling hole has been closed. Additional bond wires are not needed around All-Metal...

  7. 49 CFR 177.837 - Class 3 materials.

    Code of Federal Regulations, 2010 CFR

    2010-10-01

    ... through an open filling hole, one end of a bond wire shall be connected to the stationary system piping or integrally connected steel framing, and the other end to the shell of the cargo tank to provide a continuous... after the last filling hole has been closed. Additional bond wires are not needed around All-Metal...

  8. Switchable DNA wire: deposition-stripping of copper nanoclusters as an "ON-OFF" nanoswitch.

    PubMed

    Zhu, Xiaoli; Liu, Siyu; Cao, Jiepei; Mao, Xiaoxia; Li, Genxi

    2016-01-19

    Today, a consensus that DNA working as a molecular wire shows promise in nanoscale electronics is reached. Considering that the "ON-OFF" switch is the basis of a logic circuit, the switch of DNA-mediated charge transport (DNA CT) should be conquered. Here, on the basis of chemical or electrochemical deposition and stripping of DNA-templated copper nanoclusters (CuNCs), we develop an "ON-OFF" nanoswitch for DNA CT. While CuNCs are deposited, the DNA CT is blocked, which can be also recovered after stripping the CuNCs. A switch cycle can be completed in a few seconds and can be repeated for many times. Moreover, by regulating the amount of reagents, deposition/stripping time, applied potential, etc., the switch is adjustable to make the wire at either an "ON-OFF" state or an intermediate state. We believe that this concept and the successful implementation will promote the practical application of DNA wire one step further.

  9. Switchable DNA wire: deposition-stripping of copper nanoclusters as an “ON-OFF” nanoswitch

    PubMed Central

    Zhu, Xiaoli; Liu, Siyu; Cao, Jiepei; Mao, Xiaoxia; Li, Genxi

    2016-01-01

    Today, a consensus that DNA working as a molecular wire shows promise in nanoscale electronics is reached. Considering that the “ON-OFF” switch is the basis of a logic circuit, the switch of DNA-mediated charge transport (DNA CT) should be conquered. Here, on the basis of chemical or electrochemical deposition and stripping of DNA-templated copper nanoclusters (CuNCs), we develop an “ON-OFF” nanoswitch for DNA CT. While CuNCs are deposited, the DNA CT is blocked, which can be also recovered after stripping the CuNCs. A switch cycle can be completed in a few seconds and can be repeated for many times. Moreover, by regulating the amount of reagents, deposition/stripping time, applied potential, etc., the switch is adjustable to make the wire at either an “ON-OFF” state or an intermediate state. We believe that this concept and the successful implementation will promote the practical application of DNA wire one step further. PMID:26781761

  10. Fog collecting biomimetic surfaces: Influence of microstructure and wettability.

    PubMed

    Azad, M A K; Ellerbrok, D; Barthlott, W; Koch, K

    2015-01-19

    We analyzed the fog collection efficiency of three different sets of samples: replica (with and without microstructures), copper wire (smooth and microgrooved) and polyolefin mesh (hydrophilic, superhydrophilic and hydrophobic). The collection efficiency of the samples was compared in each set separately to investigate the influence of microstructures and/or the wettability of the surfaces on fog collection. Based on the controlled experimental conditions chosen here large differences in the efficiency were found. We found that microstructured plant replica samples collected 2-3 times higher amounts of water than that of unstructured (smooth) samples. Copper wire samples showed similar results. Moreover, microgrooved wires had a faster dripping of water droplets than that of smooth wires. The superhydrophilic mesh tested here was proved more efficient than any other mesh samples with different wettability. The amount of collected fog by superhydrophilic mesh was about 5 times higher than that of hydrophilic (untreated) mesh and was about 2 times higher than that of hydrophobic mesh.

  11. Red Plague Control Plan (RPCP)

    NASA Technical Reports Server (NTRS)

    Cooke, Robert W.

    2010-01-01

    SCOPE: Prescribes the minimum requirements for the control of cuprous / cupric oxide corrosion (a.k.a. Red Plague) of silver-coated copper wire, cable, and harness assemblies. PURPOSE: Targeted for applications where exposure to assembly processes, environmental conditions, and contamination may promote the development of cuprous / cupric oxide corrosion (a.k.a. Red Plague) in silver-coated copper wire, cable, and harness assemblies. Does not exclude any alternate or contractor-proprietary documents or processes that meet or exceed the baseline of requirements established by this document. Use of alternate or contractor-proprietary documents or processes shall require review and prior approval of the procuring NASA activity.

  12. Copper-catalyzed transformation of ketones to amides via C(CO)-C(alkyl) bond cleavage directed by picolinamide.

    PubMed

    Ma, Haojie; Zhou, Xiaoqiang; Zhan, Zhenzhen; Wei, Daidong; Shi, Chong; Liu, Xingxing; Huang, Guosheng

    2017-09-13

    Copper catalyzed chemoselective cleavage of the C(CO)-C(alkyl) bond leading to C-N bond formation with chelation assistance of N-containing directing groups is described. Inexpensive Cu(ii)-acetate serves as a convenient catalyst for this transformation. This method highlights the emerging strategy to transform unactivated alkyl ketones into amides in organic synthesis and provides a new strategy for C-C bond cleavage.

  13. Direct mapping of electrical noise sources in molecular wire-based devices

    PubMed Central

    Cho, Duckhyung; Lee, Hyungwoo; Shekhar, Shashank; Yang, Myungjae; Park, Jae Yeol; Hong, Seunghun

    2017-01-01

    We report a noise mapping strategy for the reliable identification and analysis of noise sources in molecular wire junctions. Here, different molecular wires were patterned on a gold substrate, and the current-noise map on the pattern was measured and analyzed, enabling the quantitative study of noise sources in the patterned molecular wires. The frequency spectra of the noise from the molecular wire junctions exhibited characteristic 1/f2 behavior, which was used to identify the electrical signals from molecular wires. This method was applied to analyze the molecular junctions comprising various thiol molecules on a gold substrate, revealing that the noise in the junctions mainly came from the fluctuation of the thiol bonds. Furthermore, we quantitatively compared the frequencies of such bond fluctuations in different molecular wire junctions and identified molecular wires with lower electrical noise, which can provide critical information for designing low-noise molecular electronic devices. Our method provides valuable insights regarding noise phenomena in molecular wires and can be a powerful tool for the development of molecular electronic devices. PMID:28233821

  14. Direct mapping of electrical noise sources in molecular wire-based devices

    NASA Astrophysics Data System (ADS)

    Cho, Duckhyung; Lee, Hyungwoo; Shekhar, Shashank; Yang, Myungjae; Park, Jae Yeol; Hong, Seunghun

    2017-02-01

    We report a noise mapping strategy for the reliable identification and analysis of noise sources in molecular wire junctions. Here, different molecular wires were patterned on a gold substrate, and the current-noise map on the pattern was measured and analyzed, enabling the quantitative study of noise sources in the patterned molecular wires. The frequency spectra of the noise from the molecular wire junctions exhibited characteristic 1/f2 behavior, which was used to identify the electrical signals from molecular wires. This method was applied to analyze the molecular junctions comprising various thiol molecules on a gold substrate, revealing that the noise in the junctions mainly came from the fluctuation of the thiol bonds. Furthermore, we quantitatively compared the frequencies of such bond fluctuations in different molecular wire junctions and identified molecular wires with lower electrical noise, which can provide critical information for designing low-noise molecular electronic devices. Our method provides valuable insights regarding noise phenomena in molecular wires and can be a powerful tool for the development of molecular electronic devices.

  15. Wireless electrochemical preparation of gradient nanoclusters consisting of copper(II), stearic acid and montmorillonite on a copper wire for headspace in-tube microextraction of chlorobenzenes.

    PubMed

    Enteshari Najafabadi, Marzieh; Bagheri, Habib

    2017-12-26

    This work introduces a new gradient fiber coating for microextraction of chlorobenzenes. Nanoclusters of organoclay-Cu(II) on a copper wire were fabricated by wireless electrofunctionalization. The resultant gradient coatings are more robust, and thermally and mechanically stable. Wireless electrofunctionalization was carried out in a bipolar cell under a constant deposition potential and using an ethanolic electrolyte solution containing stearic acid and montmorillonite. Stearic acid acts as an inexpensive and green coating while montmorillonite acts as a modifier to impart thermal stability. The gradient morphology of the nanoclusters was investigated by scanning electron microscopy, thermogravimetric analysis and energy dispersive X-ray spectroscopy. The coated wire was placed in a hollow needle and used for headspace in-tube microextraction (HS-ITME) of chlorobenzenes (CBs). Effects of various parameters affecting synthesis and extraction were optimized. Following extraction, the needles were directly inserted into the GC injector, and the CBs (chlorobenzene, 1,4-dichlorobenzene, 1,2-dichlorobenzene, 1,2,4-trichlorobenzene, 1,2,3,4-tetrachlorobenzene) were quantified by GC-MS. The limits of detection under optimized conditions range from 0.5 to 10 ng.L -1 . The intra- and inter-day relative standard deviations (RSDs) (for n = 10, 5 respectively) using a single fiber are 6-10 and 10-15%, respectively. The fiber-to-fiber RSDs (for n = 3) is between 17 and 24%. The method was successfully applied to the extraction of CBs from real water samples, and relative recoveries are between 91 and 110%. Graphical abstract A gradient coating of organoclay-Cu nanoclusters was fabricated on a copper wire by wireless electrofunctionalization. The oxidation of copper takes place at the anodic pole (red) while dissolved oxygen in ethanol solution is reduced at the cathodic pole (blue).

  16. Electromagnetic (EM) Wave Attachment to Laser Plasma Filaments

    DTIC Science & Technology

    2009-05-01

    this phenomenon over a laboratory scale distance and observed that the channel energy, diameter, and modulated spectrum all remained relatively ...are oriented parallel to one another and insulated from one another to maintain a calculated separation. The TEM waves also represent plane waves...orientation, the electric field will point along the direction of the wire axis. The wire is 0.8 mm copper wire, fixed at both ends and insulated at

  17. Design and testing of an annular array for very-high-frequency imaging

    NASA Astrophysics Data System (ADS)

    Ketterling, Jeffrey A.; Ramachandran, Sarayu; Lizzi, Frederic L.; Aristizábal, Orlando; Turnbull, Daniel H.

    2004-05-01

    Very-high-frequency ultrasound (VHFU) transducer technology is currently experiencing a great deal of interest. Traditionally, researchers have used single-element transducers which achieve exceptional lateral image resolution although at a very limited depth of field. A 5-ring focused annular array, a transducer geometry that permits an increased depth of field via electronic focusing, has been constructed. The transducer is fabricated with a PVDF membrane and a copper-clad Kapton film with an annular array pattern. The PVDF is bonded to the Kapton film and pressed into a spherically curved shape. The back side of the transducer is then filled with epoxy. One side of the PVDF is metallized with gold, forming the ground plane of the transducer. The array elements are accessed electrically via copper traces formed on the Kapton film. The annular array consists of 5 equal-area rings with an outer diameter of 1 cm and a radius of curvature of 9 mm. A wire reflector target was used to test the imaging capability of the transducer by acquiring B-scan data for each transmit/receive pair. A synthetic aperture approach was then used to reconstruct the image and demonstrate the enhanced depth of field capabilities of the transducer.

  18. Semiconductor measurement technology: Microelectronic ultrasonic bonding

    NASA Technical Reports Server (NTRS)

    Harman, G. G. (Editor)

    1974-01-01

    Information for making high quality ultrasonic wire bonds is presented as well as data to provide a basic understanding of the ultrasonic systems used. The work emphasizes problems and methods of solving them. The required measurement equipment is first introduced. This is followed by procedures and techniques used in setting up a bonding machine, and then various machine- or operator-induced reliability problems are discussed. The characterization of the ultrasonic system and its problems are followed by in-process bonding studies and work on the ultrasonic bonding (welding) mechanism. The report concludes with a discussion of various effects of bond geometry and wire metallurgical characteristics. Where appropriate, the latest, most accurate value of a particular measurement has been substituted for an earlier reported one.

  19. Inorganic spark chamber frame and method of making the same

    NASA Technical Reports Server (NTRS)

    Heslin, T. M. (Inventor)

    1982-01-01

    A spark chamber frame, manufactured using only inorganic materials is described. The spark chamber frame includes a plurality of beams formed from inorganic material, such as ceramic or glass, and are connected together at ends with inorganic bonding material having substantially the same thermal expansion as the beam material. A plurality of wires formed from an inorganic composition are positioned between opposed beams so that the wires are uniformly spaced and form a grid. A plurality of hold down straps are formed of inorganic material such as ceramic or glass having substantially the same chemical and thermal properties as the beam material. Hold down straps overlie wires extending over the beams and are bonded thereto with inorganic bonding material.

  20. Effect of ultrasonic capillary dynamics on the mechanics of thermosonic ball bonding.

    PubMed

    Huang, Yan; Shah, Aashish; Mayer, Michael; Zhou, Norman Y; Persic, John

    2010-01-01

    Microelectronic wire bonding is an essential step in today's microchip production. It is used to weld (bond) microwires to metallized pads of integrated circuits using ultrasound with hundreds of thousands of vibration cycles. Thermosonic ball bonding is the most popular variant of the wire bonding process and frequently investigated using finite element (FE) models that simplify the ultrasonic dynamics of the process with static or quasistatic boundary conditions. In this study, the ultrasonic dynamics of the bonding tool (capillary), made from Al(2)O(3), is included in a FE model. For more accuracy of the FE model, the main material parameters are measured. The density of the capillary was measured to be rho(cap) = 3552 +/- 100 kg/m(3). The elastic modulus of the capillary, E(cap) = 389 +/- 11 GPa, is found by comparing an auxiliary FE model of the free vibrating capillary with measured values. A capillary "nodding effect" is identified and found to be essential when describing the ultrasonic vibration shape. A main FE model builds on these results and adds bonded ball, pad, chip, and die attach components. There is excellent agreement between the main model and the ultrasonic force measured at the interface on a test chip with stress microsensors. Bonded ball and underpad stress results are reported. When adjusted to the same ultrasonic force, a simplified model without ultrasonic dynamics and with an infinitely stiff capillary tip is substantially off target by -40% for the maximum underpad stress. The compliance of the capillary causes a substantial inclination effect at the bonding interface between wire and pad. This oscillating inclination effect massively influences the stress fields under the pad and is studied in more detail. For more accurate results, it is therefore recommended to include ultrasonic dynamics of the bonding tool in mechanical FE models of wire bonding.

  1. Wiring design for the control of electromagnetic interference (EMI)

    NASA Technical Reports Server (NTRS)

    Kopasakis, George

    1995-01-01

    Wiring design is only one important aspect of EMI control. Other important areas for EMI are: circuit design, filtering, grounding, bonding, shielding, lighting, electrostatic discharge (ESD), transient suppression, and electromagnetic pulse (EMP). Topics covered include: wire magnetic field emissions at low frequencies; wire radiated magnetic field emissions at frequencies; wire design guidelines for EMI control; wire design guidelines for EMI control; high frequency emissions from cables; and pulse frequency spectra.

  2. Nickel Ion Release from Three Types of Nickel-titanium-based Orthodontic Archwires in the As-received State and After Oral Simulation

    PubMed Central

    Ramazanzadeh, Barat Ali; Ahrari, Farzaneh; Sabzevari, Berahman; Habibi, Samaneh

    2014-01-01

    Background and aims. This study aimed to investigate release of nickel ion from three types of nickel-titanium-based wires in the as-received state and after immersion in a simulated oral environment. Materials and methods. Forty specimens from each of the single-strand NiTi (Rematitan "Lite"), multi-strand NiTi (SPEED Supercable) and Copper NiTi (Damon Copper NiTi) were selected. Twenty specimens from each type were used in the as-received state and the others were kept in deflected state at 37ºC for 2 months followed by autoclave sterilization. The as-received and recycled wire specimens were immersed in glass bottles containing 1.8 mL of artificial saliva for 28 days and the amount of nickel ion released into the electrolyte was determined using atomic absorption spectrophotometry. Results. The single-strand NiTi released the highest quantity of nickel ion in the as-received state and the multi-strand NiTi showed the highest ion release after oral simulation. The quantity of nickelion released from Damon Copper NiTi was the lowest in both conditions. Oral simulation followed by sterilization did not have a significant influence on nickel ion release from multi-strand NiTi and Damon Copper NiTi wires, but single-strand NiTi released statistically lower quantities of nickel ion after oral simulation. Conclusion. The multi-strand nature of Supercable did not enhance the potential of corrosion after immersion in the simulated oral environment. In vitro use of nickel-titanium-based archwires followed by sterilization did not significantly increase the amount of nickel ion released from these wires. PMID:25093049

  3. Propagation velocities of laser-produced plasmas from copper wire targets and water droplets

    NASA Technical Reports Server (NTRS)

    Song, Kyo-Dong; Alexander, Dennis R.

    1994-01-01

    Experiments were performed to determine the plasma propagation velocities resulting from KrF laser irradiation of copper wire target (75 microns diameter) and water droplets (75 microns diameter) at irradiance levels ranging from 25 to 150 GW/sq cm. Plasma propagation velocities were measured using a streak camera system oriented orthogonally to the high-energy laser propagation axis. Plasma velocities were studied as a function of position in the focused beam. Results show that both the shape of the plasma formation and material removal from the copper wire are different and depend on whether the targets are focused or slightly defocused (approximately = 0.5 mm movement in the beam axis). Plasma formation and its position relative to the target is an important factor in determining the practical focal point during high-energy laser interaction with materials. At irradiance of 100 GW/sq cm, the air plasma has two weak-velocity components which propagate toward and away from the incident laser while a strong-velocity component propagates away from the laser beam as a detonation wave. Comparison of the measured breakdown velocities (in the range of 2.22-2.27 x 10(exp 5) m/s) for air and the value calculated by the nonlinear breakdown wave theory at irradiance of 100 GW/sq cm showed a quantitative agreement within approximately 50% while the linear theory and Gaussian pulse theory failed. The detonation wave velocities of plasma generated from water droplets and copper wire targets for different focused cases were measured and analyzed theoretically. The propagation velocities of laser-induced plasma liquid droplets obtained by previous research are compared with current work.

  4. Whole shaft visibility and mechanical performance for active MR catheters using copper-nitinol braided polymer tubes.

    PubMed

    Kocaturk, Ozgur; Saikus, Christina E; Guttman, Michael A; Faranesh, Anthony Z; Ratnayaka, Kanishka; Ozturk, Cengizhan; McVeigh, Elliot R; Lederman, Robert J

    2009-08-12

    Catheter visualization and tracking remains a challenge in interventional MR.Active guidewires can be made conspicuous in "profile" along their whole shaft exploiting metallic core wire and hypotube components that are intrinsic to their mechanical performance. Polymer-based catheters, on the other hand, offer no conductive medium to carry radio frequency waves. We developed a new "active" catheter design for interventional MR with mechanical performance resembling braided X-ray devices. Our 75 cm long hybrid catheter shaft incorporates a wire lattice in a polymer matrix, and contains three distal loop coils in a flexible and torquable 7Fr device. We explored the impact of braid material designs on radiofrequency and mechanical performance. The incorporation of copper wire into in a superelastic nitinol braided loopless antenna allowed good visualization of the whole shaft (70 cm) in vitro and in vivo in swine during real-time MR with 1.5 T scanner. Additional distal tip coils enhanced tip visibility. Increasing the copper:nitinol ratio in braiding configurations improved flexibility at the expense of torquability. We found a 16-wire braid of 1:1 copper:nitinol to have the optimum balance of mechanical (trackability, flexibility, torquability) and antenna (signal attenuation) properties. With this configuration, the temperature increase remained less than 2 degrees C during real-time MR within 10 cm horizontal from the isocenter. The design was conspicuous in vitro and in vivo. We have engineered a new loopless antenna configuration that imparts interventional MR catheters with satisfactory mechanical and imaging characteristics. This compact loopless antenna design can be generalized to visualize the whole shaft of any general-purpose polymer catheter to perform safe interventional procedures.

  5. Whole shaft visibility and mechanical performance for active MR catheters using copper-nitinol braided polymer tubes

    PubMed Central

    Kocaturk, Ozgur; Saikus, Christina E; Guttman, Michael A; Faranesh, Anthony Z; Ratnayaka, Kanishka; Ozturk, Cengizhan; McVeigh, Elliot R; Lederman, Robert J

    2009-01-01

    Background Catheter visualization and tracking remains a challenge in interventional MR. Active guidewires can be made conspicuous in "profile" along their whole shaft exploiting metallic core wire and hypotube components that are intrinsic to their mechanical performance. Polymer-based catheters, on the other hand, offer no conductive medium to carry radio frequency waves. We developed a new "active" catheter design for interventional MR with mechanical performance resembling braided X-ray devices. Our 75 cm long hybrid catheter shaft incorporates a wire lattice in a polymer matrix, and contains three distal loop coils in a flexible and torquable 7Fr device. We explored the impact of braid material designs on radiofrequency and mechanical performance. Results The incorporation of copper wire into in a superelastic nitinol braided loopless antenna allowed good visualization of the whole shaft (70 cm) in vitro and in vivo in swine during real-time MR with 1.5 T scanner. Additional distal tip coils enhanced tip visibility. Increasing the copper:nitinol ratio in braiding configurations improved flexibility at the expense of torquability. We found a 16-wire braid of 1:1 copper:nitinol to have the optimum balance of mechanical (trackability, flexibility, torquability) and antenna (signal attenuation) properties. With this configuration, the temperature increase remained less than 2°C during real-time MR within 10 cm horizontal from the isocenter. The design was conspicuous in vitro and in vivo. Conclusion We have engineered a new loopless antenna configuration that imparts interventional MR catheters with satisfactory mechanical and imaging characteristics. This compact loopless antenna design can be generalized to visualize the whole shaft of any general-purpose polymer catheter to perform safe interventional procedures. PMID:19674464

  6. DOING Physics--Physics Activities for Groups.

    ERIC Educational Resources Information Center

    Zwicker, Earl, Ed.

    1985-01-01

    Students are challenged to investigate a simple electric motor and to build their own model from a battery, wood block, clips, enameled copper wire, bare wire, and sandpaper. Through trial and error, several discoveries are made, including a substitute commutator and use of a radio to detect motor armature contact changes. (DH)

  7. Solid-phase materials for chelating metal ions and methods of making and using same

    DOEpatents

    Harrup, Mason K.; Wey, John E.; Peterson, Eric S.

    2003-06-10

    A solid material for recovering metal ions from aqueous streams, and methods of making and using the solid material, are disclosed. The solid material is made by covalently bonding a chelating agent to a silica-based solid, or in-situ condensing ceramic precursors along with the chelating agent to accomplish the covalent bonding. The chelating agent preferably comprises a oxime type chelating head, preferably a salicylaldoxime-type molecule, with an organic tail covalently bonded to the head. The hydrocarbon tail includes a carbon-carbon double bond, which is instrumental in the step of covalently bonding the tail to the silica-based solid or the in-situ condensation. The invented solid material may be contacted directly with aqueous streams containing metal ions, and is selective to ions such as copper (II) even in the presence of such ions as iron (III) and other materials that are present in earthen materials. The solid material with high selectivity to copper may be used to recover copper from mining and plating industry streams, to replace the costly and toxic solvent extraction steps of conventional copper processing.

  8. Destructive and non-destructive evaluation of cu/cu diffusion bonding with interlayer aluminum

    NASA Astrophysics Data System (ADS)

    Santosh Kumar, A.; Mohan, T.; Kumar, S. Suresh; Ravisankar, B.

    2018-03-01

    The current study is established an inspection procedure for assessing quality of diffusion bonded joints using destructive and non-destructive method. Diffusion bonding of commercially pure copper with aluminium interlayer was carried out uniaxial load at 15MPa for different temperatures under holding time 60 min in vacuum atmosphere. The bond qualities were determined by destructive and non-destructive testing method (ultrasonic C- scan). The bond interface and bonded samples were analysed using optical and scanning electron microscopy (SEM). The element composition of the fractured and bonded area is determined using the Energy Dispersive Spectrometry (EDS). The bond quality obtained by both testing methods and its parameters are correlated. The optimized bonding parameter for best bonding characteristics for copper diffusion bonding with aluminum interlayer is reported.

  9. Explosive bonding of metal-matrix composites

    NASA Technical Reports Server (NTRS)

    Reece, O. Y.

    1969-01-01

    Explosive bonding process produces sheet composites of aluminum alloy reinforced by high-strength stainless steel wires. The bonds are excellent metallurgically, no external heat is required, various metals can be bonded, and the process is inexpensive.

  10. High Speed Network Access to the Last-Mile Using Fixed Broadband Wireless

    DTIC Science & Technology

    2004-03-01

    could download the 3¼-hour movie Titanic in 7 minutes and 23 seconds while a 56K modem on the other hand would need almost 22 hours”. The MMDS band...9 a. Twisted Copper Pair (xDSL).....................................................9 b. Cable Modem ...of dial-up modems over twisted copper pair1. Copper wire provided the link in the local loop between the telephone subscriber and the local

  11. 46 CFR 28.835 - Fuel systems.

    Code of Federal Regulations, 2011 CFR

    2011-10-01

    ... this section, fuel piping shall be steel pipe, annealed seamless copper, brass, nickel copper, or... with wire braid; (4) Be fitted with suitable, corrosion resistant, compression fittings; and (5) Be... above 260° C (500 °F) must be of seamless steel. (l) Existing fuel oil piping may remain in service as...

  12. Copper, Aluminum and Nickel: A New Monocrystalline Orthodontic Alloy

    NASA Astrophysics Data System (ADS)

    Wierenga, Mark

    Introduction: This study was designed to evaluate, via tensile and bend testing, the mechanical properties of a newly-developed monocrystalline orthodontic archwire comprised of a blend of copper, aluminum, and nickel (CuAlNi). Methods: The sample was comprised of three shape memory alloys; CuAlNi, copper nickel titanium (CuNiTi), and nickel titanium (NiTi); from various orthodontic manufacturers in both 0.018" round and 0.019" x 0.025" rectangular dimensions. Additional data was gathered for similarly sized stainless steel and beta-titanium archwires as a point of reference for drawing conclusions about the relative properties of the archwires. Measurements of loading and unloading forces were recorded in both tension and deflection testing. Repeated-measure ANOVA (alpha= 0.05) was used to compare loading and unloading forces across wires and one-way ANOVA (alpha= 0.05) was used to compare elastic moduli and hysteresis. To identify significant differences, Tukey post-hoc comparisons were performed. Results: The modulus of elasticity, deflection forces, and hysteresis profiles of CuAlNi were significantly different than the other superelastic wires tested. In all tests, CuAlNi had a statistically significant lower modulus of elasticity compared to the CuNiTi and NiTi wires (P <0.0001). The CuAlNi wire exhibited significantly lower loading and unloading forces than any other wire tested. In round wire tensile tests, loading force at all deflections was significantly lower for CuAlNi than CuNiTi or NiTi (P <0.0001). In tensile testing, the CuAlNi alloy was able to recover from a 7 mm extension (10% elongation) without permanent deformation and with little to no loss in force output. In large-deflection bend tests at 4, 5, and 6 mm deflection, CuAlNi showed the significantly lowest loading forces across the three wire materials (P <0.0001). The NiTi wires showed up to 12 times the amount of energy loss due to hysteresis compared to CuAlNi. CuAlNi showed a hysteresis loss that was significantly less than any other wire tested in this study (P <0.0001). Conclusions: The relatively constant force delivered for a long period of time during the deactivation of this wire, the minimal hysteresis loss, the low force output in deflection, and the relatively low modulus of elasticity suggest that CuAlNi wires should be considered an important material addition to orthodontic metallurgy.

  13. Cyclic and low temperature effects on microcircuits

    NASA Technical Reports Server (NTRS)

    Weissflug, V. A.; Sisul, E. V.

    1977-01-01

    Cyclic temperature and low temperature operating life tests, and pre-/post-life device evaluations were used to determine the degrading effects of thermal environments on microcircuit reliability. Low power transistor-transistor-logic gates and linear devices were included in each test group. Device metallization systems included aluminum metallization/aluminum wire, aluminum metallization/gold wire, and gold metallization/gold wire. Fewer than 2% electrical failures were observed during the cyclic and low temperature life tests and the post-life evaluations revealed approximately 2% bond pull failures. Reconstruction of aluminum die metallization was observed in all devices and the severity of the reconstruction appeared to be directly related to the magnitude of the temperature excursion. All types of bonds except the gold/gold bonds were weakened by exposure to repeated cyclic temperature stress.

  14. A Novel Fabrication Method of Bi₂Te₃-Based Thermoelectric Modules by Indium Electroplating and Thermocompression Bonding.

    PubMed

    Yoon, Jongchan; Bae, Sung Hwa; Sohn, Ho-Sang; Son, Injoon; Kim, Kyung Tae; Ju, Young-Wan

    2018-09-01

    In this study, we devised a method to bond thermoelectric elements directly to copper electrodes by plating indium with a relatively low melting point. A coating of indium, ~30 μm in thickness, was fabricated by electroplating the surface of a Bi2Te3-based thermoelectric element with a nickel diffusion barrier layer. They were then subjected to direct thermocompression bonding at 453 K on a hotplate for 10 min at a pressure of 1.1 kPa. Scanning electron microscopy images confirmed that a uniform bond was formed at the copper electrode/thermoelectric element interface, and the melted/solidified indium layer was defect free. Thus, the proposed novel method of fabricating a thermoelectric module by electroplating indium on the surface of the thermoelectric element and directly bonding with the copper electrode can be used to obtain a uniformly bonded interface even at a relatively low temperature without the use of solder pastes.

  15. Mechanical properties and microstructure of copper alloys and copper alloy-stainless steel laminates for fusion reactor high heat flux applications

    NASA Astrophysics Data System (ADS)

    Leedy, Kevin Daniel

    A select group of copper alloys and bonded copper alloy-stainless steel panels are under consideration for heat sink applications in first wall and divertor structures of a planned thermonuclear fusion reactor. Because these materials must retain high strengths and withstand high heat fluxes, their material properties and microstructures must be well understood. Candidate copper alloys include precipitate strengthened CuNiBe and CuCrZr and dispersion strengthened Cu-Alsb2Osb3 (CuAl25). In this study, uniaxial mechanical fatigue tests were conducted on bulk copper alloy materials at temperatures up to 500sp°C in air and vacuum environments. Based on standardized mechanical properties measurement techniques, a series of tests were also implemented to characterize copper alloy-316L stainless steel joints produced by hot isostatic pressing or by explosive bonding. The correlation between mechanical properties and the microstructure of fatigued copper alloys and the interface of copper alloy-stainless steel laminates was examined. Commercial grades of these alloys were used to maintain a degree of standardization in the materials testing. The commercial alloys used were OMG Americas Glidcop CuAl25 and CuAl15; Brush Wellman Hycon 3HP and Trefimetaux CuNiBe; and Kabelmetal Elbrodur and Trefimetaux CuCrZr. CuAl25 and CuNiBe alloys possessed the best combination of fatigue resistance and microstructural stability. The CuAl25 alloy showed only minimal microstructural changes following fatigue while the CuNiBe alloy consistently exhibited the highest fatigue strength. Transmission electron microscopy observations revealed that small matrix grain sizes and high densities of submicron strengthening phases promoted homogeneous slip deformation in the copper alloys. Thus, highly organized fatigue dislocation structure formation, as commonly found in oxygen-free high conductivity Cu, was inhibited. A solid plate of CuAl25 alloy hot isostatically pressed to a 316L stainless steel plate showed the best overall mechanical properties of the studied bi-metallic bonded panels. Bond properties were nominally inferior to constituent bulk material properties and fracture toughness values, in particular, were quite low for all bonded laminates. Delamination near the copper alloy-stainless steel interface was the dominate failure mode in the bi-metallic panels. The joining processes caused microstructural alterations in the bond interfacial regions including: microporosity, new precipitate formation, existing precipitate morphology changes and interdiffusion of constituent elements.

  16. Temperature Diffusion Distribution of Electric Wire Deteriorated by Overcurrent

    NASA Astrophysics Data System (ADS)

    Choi, Chung-Seog; Kim, Hyang-Kon; Kim, Dong-Woo; Lee, Ki-Yeon

    This study presents thermal diffusion distribution of the electric wires when overcurrent is supplied to copper wires. And then, this study intends to provide a basis of knowledge for analyzing the causes of electric accidents through hybrid technology. In the thermal image distribution analysis of the electric wire to which fusing current was supplied, it was found that less heat was accumulated in the thin wires because of easier heat dispersion, while more heat was accumulated in the thicker wires. The 3-dimensional thermal image analysis showed that heat distribution was concentrated at the center of the wire and the inclination of heat distribution was steep in the thicker wires. When 81A was supplied to 1.6mm copper wire for 500 seconds, the surface temperature of wire was maximum 46.68°C and minimum 30.87°C. It revealed the initial characteristics of insulation deterioration that generates white smoke without external deformation. In the analysis with stereoscopic microscope, the surface turned dark brown and rough with the increase of fusing current. Also, it was known that exfoliation occurred when wire melted down with 2 times the fusing current. With the increase of current, we found the number of primary arms of the dendrite structure to be increased and those of the secondary and tertiary arms to be decreased. Also, when the overcurrent reached twice the fusing current, it was found that columnar composition, observed in the cross sectional structure of molten wire, appeared and formed regular directivity. As described above, we could present the burning pattern and change in characteristics of insulation and conductor quantitatively. And we could not only minimize the analysis error by combining the information but also present the scientific basis in the analysis of causes of electric accidents, mediation of disputes on product liability concerning the electric products.

  17. Thermal Stability of Nanocrystalline Copper for Potential Use in Printed Wiring Board Applications

    NASA Astrophysics Data System (ADS)

    Woo, Patrick Kai Fai

    Copper is a widely used conductor in the manufacture of printed wiring boards (PWB). The trends in miniaturization of electronic devices create increasing challenges to all electronic industries. In particular PWB manufacturers face great challenges because the increasing demands in greater performance and device miniaturization pose enormous difficulties in manufacturing and product reliability. Nanocrystalline and ultra-fine grain copper can potentially offer increased reliability and functionality of the PWB due to the increases in strength and achievable wiring density by reduction in grain size. The first part of this thesis is concerned with the synthesis and characterization of nanocrystalline and ultra-fine grain-sized copper for potential applications in the PWB industry. Nanocrystalline copper with different amounts of sulfur impurities (25-230ppm) and grain sizes (31-49nm) were produced and their hardness, electrical resistivity and etchability were determined. To study the thermal stability of nanocrystalline copper, differential scanning calorimetry and isothermal heat treatments combined with electron microscopy techniques for microstructural analysis were used. Differential scanning calorimetry was chosen to continuously monitor the grain growth process in the temperature range from 40?C to 400?C. During isothermal annealing experiments samples were annealed at 23?C, 100?C and 300?C to study various potential thermal issues for these materials in PWB applications such as the long-term room temperature thermal stability as well as for temperature excursions above the operation temperature and peak temperature exposure during the PWB manufacturing process. From all annealing experiments the various grain growth events and the overall stability of these materials were analyzed in terms of driving and dragging forces. Experimental evidence is presented which shows that the overall thermal stability, grain boundary character and texture evolution of copper is greatly related to changes in driving and dragging forces, which in turn, are strongly depended on parameters such as annealing temperature and time, total sulfur impurity content and the distribution of the impurities within the material. It was shown that a simple increase in the sulfur impurity level does not necessarily improve the thermal stability of nanocrystalline copper.

  18. Low cost, formable, high T(sub c) superconducting wire

    NASA Technical Reports Server (NTRS)

    Smialek, James L. (Inventor)

    1991-01-01

    A ceramic superconductivity part such as a wire is produced through the partial oxidation of a specially formulated copper alloy in the core. The alloys contain low level quantities of rare earth and alkaline earth dopant elements. Upon oxidation at high temperature, superconducting oxide phases are formed as a thin film.

  19. Copper-Catalyzed Domino Three-Component Approach for the Assembly of 2-Aminated Benzimidazoles and Quinazolines.

    PubMed

    Tran, Lam Quang; Li, Jihui; Neuville, Luc

    2015-06-19

    A copper-promoted three-component synthesis of 2-aminobenzimidazoles (1) or of 2-aminoquinazolines (2) involving cyanamides, arylboronic acids, and amines has been developed. The operationally simple oxidative process, performed in the presence of K2CO3, a catalytic amount of CuCl2·2H2O, 2,2'-bipyridine, and an O2 atmosphere (1 atm), allows the rapid assembly of either benzimidazoles or quinazolines starting from aryl- or benzyl-substituted cyanamides, respectively. In this process, the copper promotes the formation of three bonds, two C-N bonds, and an additional bond resulting from C-H functionalization event.

  20. High-frequency ultrasonic wire bonding systems

    PubMed

    Tsujino; Yoshihara; Sano; Ihara

    2000-03-01

    The vibration characteristics of longitudinal-complex transverse vibration systems with multiple resonance frequencies of 350-980 kHz for ultrasonic wire bonding of IC, LSI or electronic devices were studied. The complex vibration systems can be applied for direct welding of semiconductor tips (face-down bonding, flip-chip bonding) and packaging of electronic devices. A longitudinal-complex transverse vibration bonding system consists of a complex transverse vibration rod, two driving longitudinal transducers 7.0 mm in diameter and a transverse vibration welding tip. The vibration distributions along ceramic and stainless-steel welding tips were measured at up to 980 kHz. A high-frequency vibration system with a height of 20.7 mm and a weight of less than 15 g was obtained.

  1. En-masse retraction with a preformed nickel-titanium and stainless steel archwire assembly and temporary skeletal anchorage devices without posterior bonding

    PubMed Central

    Jee, Jeong-Hyun; Ahn, Hyo-Won; Seo, Kyung-Won; Kook, Yoon-Ah; Chung, Kyu-Rhim; Nelson, Gerald

    2014-01-01

    Objective To evaluate the therapeutic effects of a preformed assembly of nickel-titanium (NiTi) and stainless steel (SS) archwires (preformed C-wire) combined with temporary skeletal anchorage devices (TSADs) as the sole source of anchorage and to compare these effects with those of a SS version of C-wire (conventional C-wire) for en-masse retraction. Methods Thirty-one adult female patients with skeletal Class I or II dentoalveolar protrusion, mild-to-moderate anterior crowding (3.0-6.0 mm), and stable Class I posterior occlusion were divided into conventional (n = 15) and preformed (n = 16) C-wire groups. All subjects underwent first premolar extractions and en-masse retraction with pre-adjusted edgewise anterior brackets, the assigned C-wire, and maxillary C-tubes or C-implants; bonded mesh-tube appliances were used in the mandibular dentition. Differences in pretreatment and post-retraction measurements of skeletal, dental, and soft-tissue cephalometric variables were statistically analyzed. Results Both groups showed full retraction of the maxillary anterior teeth by controlled tipping and space closure without altered posterior occlusion. However, the preformed C-wire group had a shorter retraction period (by 3.2 months). Furthermore, the maxillary molars in this group showed no significant mesialization, mesial tipping, or extrusion; some mesialization and mesial tipping occurred in the conventional C-wire group. Conclusions Preformed C-wires combined with maxillary TSADs enable simultaneous leveling and space closure from the beginning of the treatment without maxillary posterior bonding. This allows for faster treatment of dentoalveolar protrusion without unwanted side effects, when compared with conventional C-wire, evidencing its clinical expediency. PMID:25309863

  2. Preparation and characterization of polyaniline-copper composites by electrical explosion of wire.

    PubMed

    Liu, Aijie; Bac, Luong Huu; Kim, Jin-Chun; Liu, Lizhu

    2012-07-01

    Polyaniline-copper composites with a polyacrylic acid (PAA) were synthesized by electrical explosion of wire. Polyaniline (PANI) and PAA were put into the explosion medium, deionized water (DIW) and ethanol, stirred for 24 hrs and sonicated for 2 hrs. These solutions were used as base liquids for explosion process to fabricate Cu nanoparticle. Optical absorption in the UV-visible region of PANI and PANI/PAA-Cu composites was measured in a range of 200-900 nm. X-ray diffraction was used to analyze the phase of the composites. XRD pattern showed the PANI was amorphous and copper was polycrystalline. Two phases of Cu and Cu2O were formed in aqueous solution while single Cu phase was obtained in ethanol solution. Field emission scanning electron microscope was used to observe the microstructure of the composites. The synthesized composites were extensively characterized by Fourier Transform Infrared (FTIR) spectroscopy and electrical measurements.

  3. Silicon Sheet Growth Development for the Large Area Sheet Task of the Low Cost Solar Array Project. Heat Exchanger Method - Ingot Casting Fixed Abrasive Method - Multi-Wire Slicing

    NASA Technical Reports Server (NTRS)

    Schmid, F.; Khattak, C. P.

    1978-01-01

    Solar cells fabricated from HEM cast silicon yielded up to 15% conversion efficiencies. This was achieved in spite of using unpurified graphite parts in the HEM furnace and without optimization of material or cell processing parameters. Molybdenum retainers prevented SiC formation and reduced carbon content by 50%. The oxygen content of vacuum cast HEM silicon is lower than typical Czochralski grown silicon. Impregnation of 45 micrometers diamonds into 7.5 micrometers copper sheath showed distortion of the copper layer. However, 12.5 micrometers and 15 micrometers copper sheath can be impregnated with 45 micrometers diamonds to a high concentration. Electroless nickel plating of wires impregnated only in the cutting edge showed nickel concentration around the diamonds. This has the possibility of reducing kerf. The high speed slicer fabricated can achieve higher speed and longer stroke with vibration isolation.

  4. Nickel-titanium alloys: stress-related temperature transitional range.

    PubMed

    Santoro, M; Beshers, D N

    2000-12-01

    The inducement of mechanical stress within nickel-titanium wires can influence the transitional temperature range of the alloy and therefore the expression of the superelastic properties. An analogous variation of the transitional temperature range may be expected during orthodontic therapy, when the archwires are engaged into the brackets. To investigate this possibility, samples of currently used orthodontic nickel-titanium wires (Sentalloy, GAC; Copper Ni-Ti superelastic at 27 degrees C, 35 degrees C, 40 degrees C, Ormco; Nitinol Heat-Activated, 3M-Unitek) were subjected to temperature cycles ranging between 4 degrees C and 60 degrees C. The wires were mounted in a plexiglass loading device designed to simulate clinical situations of minimum and severe dental crowding. Electrical resistivity was used to monitor the phase transformations. The data were analyzed with paired t tests. The results confirmed the presence of displacements of the transitional temperature ranges toward higher temperatures when stress was induced. Because nickel-titanium wires are most commonly used during the aligning stage in cases of severe dental crowding, particular attention was given to the performance of the orthodontic wires under maximum loading. An alloy with a stress-related transitional temperature range corresponding to the fluctuations of the oral temperature should express superelastic properties more consistently than others. According to our results, Copper Ni-Ti 27 degrees C and Nitinol Heat-Activated wires may be considered suitable alloys for the alignment stage.

  5. Heating in short-pulse laser-driven cone-capped wire targets

    NASA Astrophysics Data System (ADS)

    Mason, R. J.; Wei, M.; King, J.; Beg, F.; Stephens, R. B.

    2007-11-01

    The 2-D implicit hybrid simulation code e-PLAS has been used to study heating in cone-capped copper wire targets. The code e-PLAS tracks collisional particle-in-cell (PIC) electrons traversing background plasma of collisional Eulerian cold electron and ion fluids. It computes E- and B-fields by the Implicit Moment Method [1,2]. In recent experiments [3] at the Vulcan laser facility, sub- picosecond laser pulses at 1.06 μm, and 4.0 x 10^20 W/cm^2 intensity were focused into thin-walled (˜10 μm) cones attached to copper wires. The wire diameter was varied from 10-40 μm with a typical length of 1 mm. We characterize heating of the wires as a function of their diameters and length, and relate modifications of this heating to changes in the assumed laser-generated hot electron spectrum and directivity. As in recent nail experiments [4], the cones can serve as reservoirs for hot electrons, diverting them from passage down the wires. [1] R. J. Mason, and C. Cranfill, IEEE Trans. Plasma Sci. PS-14, 45 (1986). [2] R. J. Mason, J. Comp. Phys. 71, 429 (1987). [3] J. King et al., to be submitted to Phys. Rev. Lett.. [4] R. J. Mason, M. Wei, F. Beg, R. Stephens, and C. Snell, in Proc. of ICOPS07, Albuquerque, NM, June 17-22, 2007, Talk 7D4.

  6. [Use of copper oxide wire particles (Copinox) for the prevention of congenital copper deficiency in a herd of German Improved Fawn breed of goat].

    PubMed

    Winter, P; Hochsteiner, W; Chizzola, R

    2004-10-01

    In a herd of German Improved Fawn breed of goat in the year 2000 neonatal kid losses due to congenital copper deficiencies were observed. To clarify the problems and to prevent losses in the next breeding season serum copper levels of 10 dams and four control Boer goats were investigated at four time points during one year. Additionally ten kids of the following year were sampled and the serum copper levels were studied. Immediatly after parturition and 8 weeks later the dams showed low serum copper levels (10.4 +/- 11.1 micromol/l, 5.7 +/- 2.9 micromol/l resp.). At the end of the pasture season an increase of serum copper could be measured (19.3 +/- 16.0 micromol/l). To prevent enzootic ataxia due to congenital copper deficiency, the dams were treated with copper oxide wire particles in the next late gestation. At this time point serum copper concentrations started to decrease (18.5 +/- 8.4 micromol/l). The re-examination 3 month later demonstrated an increase of the serum mean copper concentrations up to 23.4 micromol/l in the dams and to 16.2 micromol/l in the kids. The serum copper levels were significantly higher compared to the levels the year before. Big variation of the serum copper levels in the control Boer goats occurred during the year, but no clinical symptoms of copper deficiency could be observed. The copper levels in the grass and soil samples were 6.8 mg/kg and 0.2 mg/kg dry substance, respectively. A secondary copper deficiency based on cadmium could be excluded through the low levels of soil samples. The contents of sulphur and molybdenum were not determined. The results indicate that the German Improved Fawn breed of goats suffered from a primary copper deficiency due to the inefficient mineral supplementation. The administration of Copinox in the last third of the gestation leads to a continious raising of the copper concentrations in the serum and is suited to prevent ataxia due to congential copper deficiency in neonatal kids.

  7. Sub-Kelvin resistance thermometer

    NASA Technical Reports Server (NTRS)

    Castles, Stephen H. (Inventor)

    1992-01-01

    A device capable of accurate temperature measurement down to 0.01 K of a particular object is discussed. The device is comprised of the following: a heat sink wafer; a first conducting pad bonded near one end of the heat sink wafer; a second conducting pad bonded near the other end of the heat sink wafer; and an oblong doped semiconductor crystal such as germanium. The oblong doped semiconductor crystal has a third conducting pad bonded on its bottom surface with the oblong doped semiconductor crystal bonded to the heat sink wafer by having the fourth conducting pad bonded to the first conducting pad. A wire is bonded between the second and third conducting pads. Current and voltage wires bonded to the first and second conducting pads measure the change in resistance of the oblong doped semiconductor crystal; this indicates the temperature of the object whose temperature is to be measured.

  8. Molecular structure, spectroscopic studies, and coppersbnd oxygen bond strength of α-methyl and α-ethyl derivatives of copper (II) acetylacetonate; Experimental and theoretical approach

    NASA Astrophysics Data System (ADS)

    Seyedkatouli, Seyedabdollah; Vakili, Mohammad; Tayyari, Sayyed Faramarz; Afzali, Raheleh

    2018-05-01

    This paper presents a combined experimental and theoretical study on the Cusbnd O bond strength of copper (II) α-methylacetylacetonate, Cu(3-Meacac)2, and copper (II) α-ethylacetylacetonate, Cu(3-Etacac)2, complexes in comparison to that in copper (II) acetylacetonate, Cu(acac)2. For this purpose, the molecular structure, UV spectra, and complete vibrational assignment of target molecules were investigated by DFT, Natural Bond Orbital (NBO) theory, and Atoms-in-Molecules (AIM) analysis at the B3LYP/6-311G* level of theory. The mentioned results are compared with those in Cu(acac)2. Fourier transform-Raman, IR, and UV spectra of these complexes have been also recorded. A complete assignment of the observed band frequencies has been done. All theoretical and experimental spectroscopic results are consisting with a stronger metal-oxygen bond in Cu(3-Meacac)2 and Cu(3-Etacac)2 complexes compared with Cu(acac)2. In addition, these results confirm that there is no significant difference between the Cusbnd O bond strength of the Cu(3-Meacac)2 and Cu(3-Etacac)2 complexes.

  9. SIMS depth profiling of rubber-tyre cord bonding layers prepared using 64Zn depleted ZnO

    NASA Astrophysics Data System (ADS)

    Fulton, W. S.; Sykes, D. E.; Smith, G. C.

    2006-07-01

    Zinc oxide and copper/zinc sulphide layers are formed during vulcanisation and moulding of rubber to brass-coated steel tyre reinforcing cords. Previous studies have described how zinc diffuses through the rubber-brass interface to form zinc sulphide, and combines with oxygen to create zinc oxide during dezincification. The zinc is usually assumed to originate in the brass of the tyre cord, however, zinc oxide is also present in the rubber formulation. We reveal how zinc from these sources is distributed within the interfacial bonding layers, before and after heat and humidity ageing. Zinc oxide produced using 64Zn-isotope depleted zinc was mixed in the rubber formulation in place of the natural ZnO and the zinc isotope ratios within the interfacial layers were followed by secondary ion mass spectroscopy (SIMS) depth profiling. Variations in the relative ratios of the zinc isotopes during depth profiling were measured for unaged, heat-aged and humidity-aged wire samples and in each case a relatively large proportion of the zinc incorporated into the interfacial layer as zinc sulphide was shown to have originated from ZnO in the rubber compound.

  10. Development of a metal-based composite actuator

    NASA Astrophysics Data System (ADS)

    Asanuma, Hiroshi; Haga, Osamu; Ishii, Toshio; Kurihara, Haruki; Ohira, Junichiro; Hakoda, Genji

    2000-06-01

    This paper describes a basic concept and elemental developments to realize a metal based composite actuator to be used for smart structures. In this study, CFRP prepreg was laminated on aluminum plate to develop an actuator and this laminate could perform unidirectional actuation. SiC continuous fiber/Al composite thin plate could also be used for form a modified type of actuator instead of using CFRP. As sensors to be embedded in this actuator, the following ones wee developed. (1) A pre-notched optical fiber filament could be embedded in aluminum matrix without fracture by the interphase forming/bonding method with copper insert and could be fractured in it at the notch, which enabled forming of an optical interference type strain sensor. (2) Nickel wire could be uniformly oxidized and embedded in aluminum matrix without fracture, which could successfully work as a temperature sensor and a strain sensor.

  11. Simple Potentiometric Determination of Reducing Sugars

    ERIC Educational Resources Information Center

    Moresco, Henry; Sanson, Pedro; Seoane, Gustavo

    2008-01-01

    In this article a potentiometric method for reducing sugar quantification is described. Copper(II) ion reacts with the reducing sugar (glucose, fructose, and others), and the excess is quantified using a copper wire indicator electrode. In order to accelerate the kinetics of the reaction, working conditions such as pH and temperature must be…

  12. Early-Stage Research & Development | Transportation Research | NREL

    Science.gov Websites

    thermal conductivity of packed copper wire used in electric-drive vehicle motor applications provides a research on thermal management in copper-wound electric motors is helping to improve the performance and reliability of electric-drive vehicles. Photo by Kevin Bennion, NREL. Anisotropic Thermal Measurement Study

  13. Tapered capillary optics

    DOEpatents

    Hirsch, Gregory

    1998-01-01

    A metal or glass wire is etched with great precision into a very narrowly tapering cone which has the shape of the desired final capillary-optics bore. By controlling the rate of removal of the wire from an etchant bath, a carefully controlled taper is produced. A sensor measures the diameter of the wire as it leaves the surface of the etchant. This signal is used for feedback control of the withdrawal speed. The etched wire undergoes a treatment to produce an extremely low surface-roughness. The etched and smoothed wire is coated with the material of choice for optimizing the reflectivity of the radiation being focused. This could be a vacuum evaporation, sputtering, CVD or aqueous chemical process. The coated wire is either electroplated, built up with electroless plating, or encapsulated in a polymer cylinder such as epoxy to increase the diameter of the wire for easier handling and greater robustness. During this process, the wire is vertically oriented and tensioned to assure that the wire is absolutely straight. The coated and electroformed wire is bonded to a flat, rigid substrate and is then periodically segmented by cutting or etching a series of narrow slits or grooves into the wire. The wire is vertically oriented and tensioned during the bonding process to assure that it is straight. The original wire material is then chemically etched away through the slits or otherwise withdrawn to leave the hollow internal bore of the final tapered-capillary optical element.

  14. The effects of silver coating on friction coefficient and shear bond strength of steel orthodontic brackets.

    PubMed

    Arash, Valiollah; Anoush, Keivan; Rabiee, Sayed Mahmood; Rahmatei, Manuchehr; Tavanafar, Saeid

    2015-01-01

    Aims of the present study was to measure frictional resistance between silver coated brackets and different types of arch wires, and shear bond strength of these brackets to the tooth. In an experimental clinical research 28 orthodontic brackets (standard, 22 slots) were coated with silver ions using electroplate method. Six brackets (coated: 3, uncoated: 3) were evaluated with Scanning Electron Microscopy and Atomic Force Microscopy. The amount of friction in 15 coated brackets was measured with three different kinds of arch wires (0.019 × 0.025-in stainless steel [SS], 0.018-in stainless steel [SS], 0.018-in Nickel-Titanium [Ni-Ti]) and compared with 15 uncoated steel brackets. In addition, shear bond strength values were compared between 10 brackets with silver coating and 10 regular brackets. Universal testing machine was used to measure shear bond strength and the amount of friction between the wires and brackets. SPSS 18 was used for data analysis with t-test. SEM and AFM results showed deposition of a uniform layer of silver, measuring 8-10 μm in thickness on bracket surfaces. Silver coating led to higher frictional forces in all the three types of arch wires, which was statistically significant in 0.019 × 0.025-in SS and 0.018-in Ni-Ti, but it did not change the shear bond strength significantly. Silver coating with electroplating method did not affect the bond strength of the bracket to enamel; in addition, it was not an effective method for decreasing friction in sliding mechanics. © Wiley Periodicals, Inc.

  15. Letter: Entrapment and interaction of an air bubble with an oscillating cavitation bubble

    NASA Astrophysics Data System (ADS)

    Kannan, Y. S.; Karri, Badarinath; Sahu, Kirti Chandra

    2018-04-01

    The mechanism of the formation of an air bubble due to an oscillating cavitation bubble in its vicinity is reported from an experimental study using high-speed imaging. The cavitation bubble is created close to the free surface of water using a low-voltage spark circuit comprising two copper electrodes in contact with each other. Before the bubble is created, a third copper wire is positioned in contact with the free surface of water close to the two crossing electrodes. Due to the surface tension at the triple point (wire-water-air) interface, a small dip is observed in the free surface at the point where the wire is immersed. When the cavitation bubble is created, the bubble pushes at the dip while expanding and pulls at it while collapsing. The collapse phase leads to the entrapment of an air bubble at the wire immersion point. During this phase, the air bubble undergoes a "catapult" effect, i.e., it expands to a maximum size and then collapses with a microjet at the free surface. To the best of our knowledge, this mechanism has not been reported so far. A parametric study is also conducted to understand the effects of wire orientation and bubble distance from the free surface.

  16. X-ray computed tomography comparison of individual and parallel assembled commercial lithium iron phosphate batteries at end of life after high rate cycling

    NASA Astrophysics Data System (ADS)

    Carter, Rachel; Huhman, Brett; Love, Corey T.; Zenyuk, Iryna V.

    2018-03-01

    X-ray computed tomography (X-ray CT) across multiple length scales is utilized for the first time to investigate the physical abuse of high C-rate pulsed discharge on cells wired individually and in parallel.. Manufactured lithium iron phosphate cells boasting high rate capability were pulse power tested in both wiring conditions with high discharge currents of 10C for a high number of cycles (up to 1200) until end of life (<80% of initial discharge capacity retained). The parallel assembly reached end of life more rapidly for reasons unknown prior to CT investigations. The investigation revealed evidence of overdischarge in the most degraded cell from the parallel assembly, compared to more traditional failure in the individual cell. The parallel-wired cell exhibited dissolution of copper from the anode current collector and subsequent deposition throughout the separator near the cathode of the cell. This overdischarge-induced copper deposition, notably impossible to confirm with other state of health (SOH) monitoring methods, is diagnosed using CT by rendering the interior current collector without harm or alteration to the active materials. Correlation of CT observations to the electrochemical pulse data from the parallel-wired cells reveals the risk of parallel wiring during high C-rate pulse discharge.

  17. Two chamber reaction furnace

    DOEpatents

    Blaugher, Richard D.

    1998-05-05

    A vertical two chamber reaction furnace. The furnace comprises a lower chamber having an independently operable first heating means for heating the lower chamber and a gas inlet means for admitting a gas to create an ambient atmosphere, and an upper chamber disposed above the lower chamber and having an independently operable second heating means for heating the upper chamber. Disposed between the lower chamber and the upper chamber is a vapor permeable diffusion partition. The upper chamber has a conveyor means for conveying a reactant there through. Of particular importance is the thallinating of long-length thallium-barium-calcium-copper oxide (TBCCO) or barium-calcium-copper oxide (BCCO) precursor tapes or wires conveyed through the upper chamber to thereby effectuate the deposition of vaporized thallium (being so vaporized as the first reactant in the lower chamber at a temperature between about 700.degree. and 800.degree. C.) on TBCCO or BCCO tape or wire (the second reactant) at its simultaneous annealing temperature in the upper chamber of about 800.degree. to 950.degree. C. to thereby replace thallium oxide lost from TBCCO tape or wire because of the high annealing temperature or to deposit thallium on BCCO tape or wire. Continuously moving the tape or wire provides a single-step process that effectuates production of long-length TBCCO superconducting product.

  18. Vertical two chamber reaction furnace

    DOEpatents

    Blaugher, Richard D.

    1999-03-16

    A vertical two chamber reaction furnace. The furnace comprises a lower chamber having an independently operable first heating means for heating the lower chamber and a gas inlet means for admitting a gas to create an ambient atmosphere, and an upper chamber disposed above the lower chamber and having an independently operable second heating means for heating the upper chamber. Disposed between the lower chamber and the upper chamber is a vapor permeable diffusion partition. The upper chamber has a conveyor means for conveying a reactant there through. Of particular importance is the thallinating of long-length thallium-barium-calcium-copper oxide (TBCCO) or barium-calcium-copper oxide (BCCO) precursor tapes or wires conveyed through the upper chamber to thereby effectuate the deposition of vaporized thallium (being so vaporized as the first reactant in the lower chamber at a temperature between about 700.degree. and 800.degree. C.) on TBCCO or BCCO tape or wire (the second reactant) at its simultaneous annealing temperature in the upper chamber of about 800.degree. to 950.degree. C. to thereby replace thallium oxide lost from TBCCO tape or wire because of the high annealing temperature or to deposit thallium on BCCO tape or wire. Continuously moving the tape or wire provides a single-step process that effectuates production of long-length TBCCO superconducting product.

  19. Two chamber reaction furnace

    DOEpatents

    Blaugher, R.D.

    1998-05-05

    A vertical two chamber reaction furnace is described. The furnace comprises a lower chamber having an independently operable first heating means for heating the lower chamber and a gas inlet means for admitting a gas to create an ambient atmosphere, and an upper chamber disposed above the lower chamber and having an independently operable second heating means for heating the upper chamber. Disposed between the lower chamber and the upper chamber is a vapor permeable diffusion partition. The upper chamber has a conveyor means for conveying a reactant there through. Of particular importance is the thallinating of long-length thallium-barium-calcium-copper oxide (TBCCO) or barium-calcium-copper oxide (BCCO) precursor tapes or wires conveyed through the upper chamber to thereby effectuate the deposition of vaporized thallium (being so vaporized as the first reactant in the lower chamber at a temperature between about 700 C and 800 C) on TBCCO or BCCO tape or wire (the second reactant) at its simultaneous annealing temperature in the upper chamber of about 800 to 950 C to thereby replace thallium oxide lost from TBCCO tape or wire because of the high annealing temperature or to deposit thallium on BCCO tape or wire. Continuously moving the tape or wire provides a single-step process that effectuates production of long-length TBCCO superconducting product. 2 figs.

  20. Vertical two chamber reaction furnace

    DOEpatents

    Blaugher, R.D.

    1999-03-16

    A vertical two chamber reaction furnace is disclosed. The furnace comprises a lower chamber having an independently operable first heating means for heating the lower chamber and a gas inlet means for admitting a gas to create an ambient atmosphere, and an upper chamber disposed above the lower chamber and having an independently operable second heating means for heating the upper chamber. Disposed between the lower chamber and the upper chamber is a vapor permeable diffusion partition. The upper chamber has a conveyor means for conveying a reactant there through. Of particular importance is the thallinating of long-length thallium-barium-calcium copper oxide (TBCCO) or barium-calcium-copper oxide (BCCO) precursor tapes or wires conveyed through the upper chamber to thereby effectuate the deposition of vaporized thallium (being so vaporized as the first reactant in the lower chamber at a temperature between about 700 and 800 C) on TBCCO or BCCO tape or wire (the second reactant) at its simultaneous annealing temperature in the upper chamber of about 800 to 950 C to thereby replace thallium oxide lost from TBCCO tape or wire because of the high annealing temperature or to deposit thallium on BCCO tape or wire. Continuously moving the tape or wire provides a single-step process that effectuates production of long-length TBCCO superconducting product. 2 figs.

  1. Composite Bus Structure for the SMEX/WIRE Satellite

    NASA Technical Reports Server (NTRS)

    Rosanova, Giulio G.

    1998-01-01

    In an effort to reduce the weight and optimize the structural design of the Small Explorer (SMEX) Wide-Field Infrared Explorer (WIRE) spacecraft, it has become desirable to change the material and construction from mechanically fastened aluminum structure to a fully bonded fiber-reinforced composite (FRC) structure. GSFC has developed the WIRE spacecraft structural bus design concept, including the instrument and launch vehicle requirements. The WIRE Satellite is the fifth of a series of SMEX satellites to be launched once per year. GSFC has chosen Composite Optics Inc. (COI) as the prime contractor for the development and procurement of the WIRE composite structure. The detailed design of the fully bonded FRC structure is based on COI's Short Notice Accelerated Production SATellite ("SNAPSAT") approach. SNAPSAT is a state of the art design and manufacturing technology for advanced composite materials which utilizes flat-stock detail parts bonded together to produce a final structural assembly. The structural design approach adopted for the WIRE structure provides a very viable alternative to both traditional aluminum construction as well as high tech. molded type composite structures. This approach to composite structure design is much less costly than molded or honeycomb sandwich type composite construction, but may cost slightly more than conventional aluminum construction on the subsystem level. However on the overall program level the weight saving achieved is very cost effective, since the primary objective is to allocate more mass for science payloads.

  2. Method of forming low cost, formable High T(subc) superconducting wire

    NASA Technical Reports Server (NTRS)

    Smialek, James L. (Inventor)

    1989-01-01

    A ceramic superconductivity part, such as a wire, is produced through the partial oxidation of a specially formulated copper alloy in a core. The alloys contains low level of quantities of rare earth and alkaline earth dopant elements. Upon oxidation at high temperatures, and superconducting oxide phases are formed as a thin film.

  3. Study on the mechanism of copper-ammonia complex decomposition in struvite formation process and enhanced ammonia and copper removal.

    PubMed

    Peng, Cong; Chai, Liyuan; Tang, Chongjian; Min, Xiaobo; Song, Yuxia; Duan, Chengshan; Yu, Cheng

    2017-01-01

    Heavy metals and ammonia are difficult to remove from wastewater, as they easily combine into refractory complexes. The struvite formation method (SFM) was applied for the complex decomposition and simultaneous removal of heavy metal and ammonia. The results indicated that ammonia deprivation by SFM was the key factor leading to the decomposition of the copper-ammonia complex ion. Ammonia was separated from solution as crystalline struvite, and the copper mainly co-precipitated as copper hydroxide together with struvite. Hydrogen bonding and electrostatic attraction were considered to be the main surface interactions between struvite and copper hydroxide. Hydrogen bonding was concluded to be the key factor leading to the co-precipitation. In addition, incorporation of copper ions into the struvite crystal also occurred during the treatment process. Copyright © 2016. Published by Elsevier B.V.

  4. Hydrostatic extrusion of Cu-Ag melt spun ribbon

    DOEpatents

    Hill, M.A.; Bingert, J.F.; Bingert, S.A.; Thoma, D.J.

    1998-09-08

    The present invention provides a method of producing high-strength and high-conductance copper and silver materials comprising the steps of combining a predetermined ratio of the copper with the silver to produce a composite material, and melt spinning the composite material to produce a ribbon of copper and silver. The ribbon of copper and silver is heated in a hydrogen atmosphere, and thereafter die pressed into a slug. The slug then is placed into a high-purity copper vessel and the vessel is sealed with an electron beam. The vessel and slug then are extruded into wire form using a cold hydrostatic extrusion process. 5 figs.

  5. Hydrostatic extrusion of Cu-Ag melt spun ribbon

    DOEpatents

    Hill, Mary Ann; Bingert, John F.; Bingert, Sherri A.; Thoma, Dan J.

    1998-01-01

    The present invention provides a method of producing high-strength and high-conductance copper and silver materials comprising the steps of combining a predetermined ratio of the copper with the silver to produce a composite material, and melt spinning the composite material to produce a ribbon of copper and silver. The ribbon of copper and silver is heated in a hydrogen atmosphere, and thereafter die pressed into a slug. The slug then is placed into a high-purity copper vessel and the vessel is sealed with an electron beam. The vessel and slug then are extruded into wire form using a cold hydrostatic extrusion process.

  6. Beating the Red Gold Rush: Copper Theft and Homeland Security

    DTIC Science & Technology

    2015-12-01

    with the bulk 52 of the copper wiring rendering each of the turbines inoperable.116 Electrical infrastructure is, of course, not the only kind of...resulted in significant speed restrictions and stop orders for the country’s premier TGV high- speed service.119 Aside from rail lines and wind turbines ... Wind Turbines ,” France 24, May 28, 2014, http://www.france24.com/en/20140528-france-metal-organised-thefts- wind - turbines -copper, accessed August 22

  7. Translations on Eastern Europe, Scientific Affairs, Number 543

    DTIC Science & Technology

    1977-04-29

    They are economically more effective than those now used, for one gram of glass can replace ten kilograms of copper wire. For several years such a...and 62 times for nonferrous ores, the greatest increase being recorded for copper bearing ores. 1. Iron Ores Overall, the iron ore deposits which...percent S. 30 Intensive research and design work is being conducted to exploit two deposits of poor copper ore (0.25-D.35 percent Cu), a deposit of

  8. Underwater electrical wire explosion: Shock wave from melting being overtaken by shock wave from vaporization

    NASA Astrophysics Data System (ADS)

    Li, Liuxia; Qian, Dun; Zou, Xiaobing; Wang, Xinxin

    2018-05-01

    The shock waves generated by an underwater electrical wire explosion were investigated. A microsecond time-scale pulsed current source was used to trigger the electrical explosion of copper wires with a length of 5 cm and a diameter of 200 μm. The energy-storage capacitor was charged to a relatively low energy so that the energy deposited onto the wire was not large enough to fully vaporize the whole wire. Two shock waves were recorded with a piezoelectric gauge that was located at a position of 100 mm from the exploding wire. The first and weak shock wave was confirmed to be the contribution from wire melting, while the second and stronger shock wave was the contribution from wire vaporization. The phenomenon whereby the first shock wave generated by melting being overtaken by the shock wave due to vaporization was observed.

  9. Recent advances in copper-catalyzed asymmetric coupling reactions

    PubMed Central

    2015-01-01

    Summary Copper-catalyzed (or -mediated) asymmetric coupling reactions have received significant attention over the past few years. Especially the coupling reactions of aryl or alkyl halides with nucleophiles became a very powerful tool for the formation of C–C, C–N, C–O and other carbon–heteroatom bonds as well as for the construction of heteroatom-containing ring systems. This review summarizes the recent progress in copper-catalyzed asymmetric coupling reactions for the formation of C–C and carbon–heteroatom bonds. PMID:26734106

  10. [Individual indirect bonding technique (IIBT) using set-up model].

    PubMed

    Kyung, H M

    1989-01-01

    There has been much progress in Edgewise Appliance since E.H. Angle. One of the most important procedures in edgewise appliance is correct bracket position. Not only conventional edgewise appliance but also straight wire appliance & lingual appliance cannot be used more effectively unless the bracket position is accurate. Improper bracket positioning may reveal much problems during treatment, especially in finishing state. It may require either rebonding after the removal of the malpositioned bracket or the greater number of arch wire and the more complex wire bending, causing much difficulty in performing effective treatments. This made me invent Individual Indirect Bonding Technique with the use of multi-purpose set-up model in order to determine a correct and objective bracket position according to individual patients. This technique is more accurate than former indirect bonding techniques in bracket positioning, because it decides the bracket position on a set-up model which has produced to have the occlusal relationship the clinician desired. This technique is especially effective in straight wire appliance and lingual appliance in which the correct bracket positioning is indispensible.

  11. Degradation reaction of Diazo reactive black 5 dye with copper (II) sulfate catalyst in thermolysis treatment.

    PubMed

    Lau, Yen-Yie; Wong, Yee-Shian; Ang, Tze-Zhang; Ong, Soon-An; Lutpi, Nabilah Aminah; Ho, Li-Ngee

    2018-03-01

    The theme of present research demonstrates performance of copper (II) sulfate (CuSO 4 ) as catalyst in thermolysis process to treat reactive black 5 (RB 5) dye. During thermolysis without presence of catalyst, heat was converted to thermal energy to break the enthalpy of chemical structure bonding and only 31.62% of color removal. With CuSO 4 support as auxiliary agent, the thermally cleaved molecular structure was further destabilized and reacted with CuSO 4 . Copper ions functioned to delocalize the coordination of π of the lone paired electron in azo bond, C=C bond of the sp 2 carbon to form C-C of the sp 3 amorphous carbon in benzene and naphthalene. Further, the radicals of unpaired electrons were stabilized and RB 5 was thermally decomposed to methyl group. Zeta potential measurement was carried out to analyze the mechanism of RB 5 degradation and measurement at 0 mV verified the critical chemical concentration (CCC) (0.7 g/L copper (II) sulfate), as the maximum 92.30% color removal. The presence of copper (II) sulfate catalyst has remarkably increase the RB 5 dye degradation as the degradation rate constant without catalyst, k 1 is 6.5224 whereas the degradation rate constant with catalyst, k 2 is 25.6810. This revealed the correlation of conversion of thermal energy from heat to break the chemical bond strength, subsequent fragmentation of RB 5 dye molecular mediated by copper (II) sulfate catalyst. The novel framework on thermolysis degradation of molecular structure of RB 5 with respect to the bond enthalpy and interfacial intermediates decomposition with catalyst reaction were determined.

  12. Easy route to superhydrophobic copper-based wire-guided droplet microfluidic systems.

    PubMed

    Mumm, Florian; van Helvoort, Antonius T J; Sikorski, Pawel

    2009-09-22

    Droplet-based microfluidic systems are an expansion of the lab on a chip concept toward flexible, reconfigurable setups based on the modification and analysis of individual droplets. Superhydrophobic surfaces are one suitable candidate for the realization of droplet-based microfluidic systems as the high mobility of aqueous liquids on such surfaces offers possibilities to use novel or more efficient approaches to droplet movement. Here, copper-based superhydrophobic surfaces were produced either by the etching of polycrystalline copper samples along the grain boundaries using etchants common in the microelectronics industry, by electrodeposition of copper films with subsequent nanowire decoration based on thermal oxidization, or by a combination of both. The surfaces could be easily hydrophobized with thiol-modified fluorocarbons, after which the produced surfaces showed a water contact angle as high as 171 degrees +/- 2 degrees . As copper was chosen as the base material, established patterning techniques adopted from printed circuit board fabrication could be used to fabricate macrostructures on the surfaces with the intention to confine the droplets and, thus, to reduce the system's sensitivity to tilting and vibrations. A simple droplet-based microfluidic chip with inlets, outlets, sample storage, and mixing areas was produced. Wire guidance, a relatively new actuation method applicable to aqueous liquids on superhydrophobic surfaces, was applied to move the droplets.

  13. Reliable porcine coronary model of chronic total occlusion using copper wire stents and bioabsorbable levo-polylactic acid polymer.

    PubMed

    Sim, Doo Sun; Jeong, Myung Ho; Cha, Kyoung Rae; Park, Suk Ho; Park, Jong Oh; Shin, Young Min; Shin, Heungsoo; Hong, Young Joon; Ahn, Youngkeun; Schwartz, Robert S; Kang, Jung Chaee

    2012-12-01

    Chronic total occlusion (CTO) remains a challenge in interventional cardiology. We investigated the feasibility and reliability of copper wire stents and levo-polylactic acid (l-PLA) as a means of CTO induction in a porcine model. In one group of 20 swine, copper stents were crimped on a 3.0mm angioplasty balloon and inserted into the mid-left anterior descending coronary artery (LAD). In the other group of 20 swine, l-PLA was wrapped on a guidewire and pushed into the distal LAD with a 3.0mm balloon catheter to induce embolization. Of 20 swine which underwent copper stent implantation, 13 died of stent thrombosis. In the remaining 7 swine, total or near total occlusion with collateral circulation was observed at 5 weeks. Of 20 swine which underwent l-PLA embolization, 4 died of ventricular fibrillation during or shortly after the procedure. Serial histopathologic studies showed complete absorption of the polymer with replacement by fibrotic tissue approximately 4 weeks following the polymer implantation. CTO could be reliably induced in porcine coronary arteries by copper stents and l-PLA. These models may support investigation of new percutaneous devices to facilitate CTO interventions. Copyright © 2012 Japanese College of Cardiology. Published by Elsevier Ltd. All rights reserved.

  14. 77 FR 61457 - Self-Regulatory Organizations; NYSE Arca, Inc.; Notice of Designation of Longer Period for...

    Federal Register 2010, 2011, 2012, 2013, 2014

    2012-10-09

    ... Physical Copper Trust Pursuant To NYSE Arca Equities Rule 8.201 October 2, 2012. On April 2, 2012, NYSE... Copper Trust (``Trust'') pursuant to NYSE Arca Equities Rule 8.201. The proposed rule change was..., Director of Purchasing, Encore Wire Corporation; Ron Beal, Executive Vice President, Tubes Division, Luvata...

  15. Enantioselective Cyanation of Benzylic C–H Bonds via Copper-Catalyzed Radical Relay

    PubMed Central

    Zhang, Wen; Wang, Fei; McCann, Scott D.; Wang, Dinghai; Chen, Pinhong; Stahl, Shannon; Liu, Guosheng

    2017-01-01

    Direct methods for stereoselective functionalization of C(sp3)–H bonds in complex organic molecules could facilitate much more efficient preparation of therapeutics and agrochemicals. Here, we report a copper-catalyzed radical relay pathway for enantioselective conversion of benzylic C–H bonds into benzylic nitriles. Hydrogen-atom abstraction affords an achiral benzylic radical that undergoes asymmetric C(sp3)–CN bond upon reaction with a chiral copper catalyst. The reactions proceed efficiently at room temperature with the benzylic substrate as limiting reagent, exhibit broad substrate scope with high enantioselectivity (typically 90-99% enantiomeric excess), and afford products that are key precursors to important bioactive molecules. Mechanistic studies provide evidence for diffusible organic radicals and highlight the difference between these reactions and C–H oxidations mediated by enzymes and other catalysts that operate via radical rebound pathways. PMID:27701109

  16. Dynamics of the evaporative dewetting of a volatile liquid film confined within a circular ring.

    PubMed

    Sun, Wei; Yang, Fuqian

    2015-04-07

    The dewetting dynamics of a toluene film confined within a copper ring on a deformable PMMA film is studied. The toluene film experiences evaporation and dewetting, which leads to the formation of a circular contact line around the center of the copper ring. The contact line recedes smoothly toward the copper ring at a constant velocity until reaching a dynamic "stick" state to form the first circular polymer ridge. The average receding velocity is found to be dependent on the dimensions of the copper ring (the copper ring diameter and the cross-sectional diameter of the copper wire) and the thickness of the PMMA films. A model is presented to qualitatively explain the evaporative dewetting phenomenon.

  17. 7 CFR 1755.702 - Copper coated steel reinforced (CCSR) aerial service wire.

    Code of Federal Regulations, 2012 CFR

    2012-01-01

    ... requirements—(1) Impact test. (i) All CCSR aerial service wires manufactured in accordance with this section shall comply with the unaged impact test specified in ANSI/ICEA S-89-648-1993, paragraph 8.1.2. (ii) All... impact test specified in ANSI/ICEA S-89-648-1993, paragraph 8.1.3. (2) Abrasion resistance test. All CCSR...

  18. 7 CFR 1755.702 - Copper coated steel reinforced (CCSR) aerial service wire.

    Code of Federal Regulations, 2013 CFR

    2013-01-01

    ... requirements—(1) Impact test. (i) All CCSR aerial service wires manufactured in accordance with this section shall comply with the unaged impact test specified in ANSI/ICEA S-89-648-1993, paragraph 8.1.2. (ii) All... impact test specified in ANSI/ICEA S-89-648-1993, paragraph 8.1.3. (2) Abrasion resistance test. All CCSR...

  19. 7 CFR 1755.702 - Copper coated steel reinforced (CCSR) aerial service wire.

    Code of Federal Regulations, 2014 CFR

    2014-01-01

    ... requirements—(1) Impact test. (i) All CCSR aerial service wires manufactured in accordance with this section shall comply with the unaged impact test specified in ANSI/ICEA S-89-648-1993, paragraph 8.1.2. (ii) All... impact test specified in ANSI/ICEA S-89-648-1993, paragraph 8.1.3. (2) Abrasion resistance test. All CCSR...

  20. Mechanical and electrical properties of laminates for high performance printed wiring boards

    NASA Astrophysics Data System (ADS)

    Guiles, Chester L.

    The physical and electrical properties of laminate boards intended for high-performance applications are reviewed with particular reference to the coefficient of thermal expansion, dielectric constant, and characteristic impedance. It is shown, in particular, that the electrical properties can be tailored to some extent by using various conbinations of basic board materials, such as copper foil, fiberglass fabric, glass fabric, epoxy resin, polyimide resin, aluminum sheet, Kevlar and quartz fabrics, copper-invar-copper, and alumina-ceramic.

  1. Composite superconducting wires obtained by high-rate tinning in molten Bi-Pb-Sr-Ca-Cu-O system

    NASA Technical Reports Server (NTRS)

    Grosav, A. D.; Konopko, L. A.; Leporda, N. I.

    1991-01-01

    Long lengths of metal superconductor composites were prepared by passing a copper wire through the bismuth based molten oxide system at a constant speed. The key to successful composite preparation is the high pulling speed involved, which permits minimization of the severe interaction between the unbuffered metal surface and the oxide melt. Depending on the temperature of the melt and the pulling speed, a coating with different thickness and microstructure appeared. The nonannealed thick coatings contained a Bi2(Sr,Ca)2Cu1O6 phase as a major component. After relatively short time annealing at 800 C, both resistivity and initial magnetization versus temperature measurements show superconducting transitions beginning in the 110 to 115 K region. The effects of annealing and composition on obtained results are discussed. This method of manufacture led to the fabrication of wire with a copper core in a dense covering with uniform thickness of about h approximately equal to 5 to 50 microns. Composite wires with h approximately equal to 10 microns (h/d approximately equal to 0.1) sustained bending on a 15 mm radius frame without cracking during flexing.

  2. Laser Indirect Shock Welding of Fine Wire to Metal Sheet.

    PubMed

    Wang, Xiao; Huang, Tao; Luo, Yapeng; Liu, Huixia

    2017-09-12

    The purpose of this paper is to present an advanced method for welding fine wire to metal sheet, namely laser indirect shock welding (LISW). This process uses silica gel as driver sheet to accelerate the metal sheet toward the wire to obtain metallurgical bonding. A series of experiments were implemented to validate the welding ability of Al sheet/Cu wire and Al sheet/Ag wire. It was found that the use of a driver sheet can maintain high surface quality of the metal sheet. With the increase of laser pulse energy, the bonding area of the sheet/wire increased and the welding interfaces were nearly flat. Energy dispersive spectroscopy (EDS) results show that the intermetallic phases were absent and a short element diffusion layer which would limit the formation of the intermetallic phases emerging at the welding interface. A tensile shear test was used to measure the mechanical strength of the welding joints. The influence of laser pulse energy on the tensile failure modes was investigated, and two failure modes, including interfacial failure and failure through the wire, were observed. The nanoindentation test results indicate that as the distance to the welding interface decreased, the microhardness increased due to the plastic deformation becoming more violent.

  3. Palladium- and Copper-Catalyzed Arylation of Carbon-Hydrogen Bonds

    PubMed Central

    Daugulis, Olafs; Do, Hien-Quang; Shabashov, Dmitry

    2010-01-01

    The transition-metal-catalyzed functionalization of C-H bonds is a powerful method for generating carbon-carbon bonds. Although significant advances to this field have been reported during the last decade, many challenges remain. First, most of the methods are substrate-specific and thus cannot be generalized. Second, conversions of unactivated (i.e. not benzylic or alpha to heteroatom) sp3 C–H bonds to C–C bonds are rare, with most examples limited to t-butyl groups—a conversion that is inherently simple because there are no β-hydrogens that can be eliminated. Finally, the palladium, rhodium, and ruthenium catalysts routinely used for the conversion of C–H bonds to C–C bonds are expensive. Catalytically active metals that are cheaper and less exotic (e.g. copper, iron, and manganese) are rarely used. This Account describes our attempts to provide solutions to these three problems. We have developed a general method for directing-group-containing arene arylation by aryl iodides. Using palladium acetate as the catalyst, we arylated anilides, benzamides, benzoic acids, benzylamines, and 2-substituted pyridine derivatives under nearly identical conditions. We have also developed a method for the palladium-catalyzed auxiliary-assisted arylation of unactivated sp3 C–H bonds. This procedure allows for the β-arylation of carboxylic acid derivatives and the γ-arylation of amine derivatives. Furthermore, copper catalysis can be used to mediate the arylation of acidic arene C–H bonds (i.e. those with pKa values <35 in DMSO). Using a copper iodide catalyst in combination with a base and a phenanthroline ligand, we successfully arylated electron-rich and electron-deficient heterocycles and electron-poor arenes possessing at least two electron-withdrawing groups. The reaction exhibits unusual regioselectivity: arylation occurs at the most hindered position. This copper-catalyzed method supplements the well-known C–H activation/borylation methodology, in which functionalization usually occurs at the least hindered position. We also describe preliminary investigations to determine the mechanisms of these transformations. We anticipate that other transition metals, including iron, nickel, cobalt, and silver, will also be able to facilitate deprotonation/arylation reaction sequences. PMID:19552413

  4. Palladium- and copper-catalyzed arylation of carbon-hydrogen bonds.

    PubMed

    Daugulis, Olafs; Do, Hien-Quang; Shabashov, Dmitry

    2009-08-18

    The transition-metal-catalyzed functionalization of C-H bonds is a powerful method for generating carbon-carbon bonds. Although significant advances to this field have been reported during the past decade, many challenges remain. First, most of the methods are substrate-specific and thus cannot be generalized. Second, conversions of unactivated (i.e., not benzylic or alpha to heteroatom) sp(3) C-H bonds to C-C bonds are rare, with most examples limited to t-butyl groups, a conversion that is inherently simple because there are no beta-hydrogens that can be eliminated. Finally, the palladium, rhodium, and ruthenium catalysts routinely used for the conversion of C-H bonds to C-C bonds are expensive. Catalytically active metals that are cheaper and less exotic (e.g., copper, iron, and manganese) are rarely used. This Account describes our attempts to provide solutions to these three problems. We have developed a general method for directing-group-containing arene arylation by aryl iodides. Using palladium acetate as the catalyst, we arylated anilides, benzamides, benzoic acids, benzylamines, and 2-substituted pyridine derivatives under nearly identical conditions. We have also developed a method for the palladium-catalyzed auxiliary-assisted arylation of unactivated sp(3) C-H bonds. This procedure allows for the beta-arylation of carboxylic acid derivatives and the gamma-arylation of amine derivatives. Furthermore, copper catalysis can be used to mediate the arylation of acidic arene C-H bonds (i.e., those with pK(a) values <35 in DMSO). Using a copper iodide catalyst in combination with a base and a phenanthroline ligand, we successfully arylated electron-rich and electron-deficient heterocycles and electron-poor arenes possessing at least two electron-withdrawing groups. The reaction exhibits unusual regioselectivity: arylation occurs at the most hindered position. This copper-catalyzed method supplements the well-known C-H activation/borylation methodology, in which functionalization usually occurs at the least hindered position. We also describe preliminary investigations to determine the mechanisms of these transformations. We anticipate that other transition metals, including iron, nickel, cobalt, and silver, will also be able to facilitate deprotonation/arylation reaction sequences.

  5. Steel bonded dense silicon nitride compositions and method for their fabrication

    DOEpatents

    Landingham, R.L.; Shell, T.E.

    1985-05-20

    A two-stage bonding technique for bonding high density silicon nitride and other ceramic materials to stainless steel and other hard metals, and multilayered ceramic-metal composites prepared by the technique are disclosed. The technique involves initially slurry coating a surface of the ceramic material at about 1500/sup 0/C in a vacuum with a refractory material and the stainless steel is then pressure bonded to the metallic coated surface by brazing it with nickel-copper-silver or nickel-copper-manganese alloys at a temperature in the range of about 850/sup 0/ to 950/sup 0/C in a vacuum. The two-stage bonding technique minimizes the temperature-expansion mismatch between the dissimilar materials.

  6. Steel bonded dense silicon nitride compositions and method for their fabrication

    DOEpatents

    Landingham, Richard L.; Shell, Thomas E.

    1987-01-01

    A two-stage bonding technique for bonding high density silicon nitride and other ceramic materials to stainless steel and other hard metals, and multilayered ceramic-metal composites prepared by the technique are disclosed. The technique involves initially slurry coating a surface of the ceramic material at about 1500.degree. C. in a vacuum with a refractory material and the stainless steel is then pressure bonded to the metallic coated surface by brazing it with nickel-copper-silver or nickel-copper-manganese alloys at a temperature in the range of about 850.degree. to 950.degree. C. in a vacuum. The two-stage bonding technique minimizes the temperature-expansion mismatch between the dissimilar materials.

  7. Microfiber Structures for Sensor Applications

    NASA Astrophysics Data System (ADS)

    Harun, S. W.; Lim, K. S.; Ahmad, H.

    Microfiber loop resonator (MLR) and microfiber knot resonator (MKR) are fabricated using melt-stretching method for applications in temperature and current sensor, respectively. The MLR is embedded into low refractive index polymer for robustness. Although the spacing of the transmission comb spectrum of the MLR is unchanged with temperature, the extinction ratio of the spectrum is observed to decrease linearly with temperature due to induced changes in the material's refractive index. The slope of the extinction ratio reduction against temperature is about 0.043dB/°C. With the assistance of a copper wire that is wrapped by the MKR, resonant wavelength can be tuned by varying the electric current delivered to the wire. The resonant wavelength change is based on the thermally induced optical phase shift in the MKR due to the heat produced by the flow of electric current over a short transit length. It is shown that the wavelength shift is linearly proportional to the square of current in the copper wire with a tuning slope of 46 pm/A2.

  8. Improved superconducting magnet wire

    DOEpatents

    Schuller, I.K.; Ketterson, J.B.

    1983-08-16

    This invention is directed to a superconducting tape or wire composed of alternating layers of copper and a niobium-containing superconductor such as niobium of NbTi, Nb/sub 3/Sn or Nb/sub 3/Ge. In general, each layer of the niobium-containing superconductor has a thickness in the range of about 0.05 to 1.5 times its coherence length (which for Nb/sub 3/Si is 41 A) with each copper layer having a thickness in the range of about 170 to 600 A. With the use of very thin layers of the niobium composition having a thickness within the desired range, the critical field (H/sub c/) may be increased by factors of 2 to 4. Also, the thin layers of the superconductor permit the resulting tape or wire to exhibit suitable ductility for winding on a magnet core. These compositions are also characterized by relatively high values of critical temperature and therefore will exhibit a combination of useful properties as superconductors.

  9. Chitosan-Copper (II) complex as antibacterial agent: synthesis, characterization and coordinating bond- activity correlation study

    NASA Astrophysics Data System (ADS)

    Mekahlia, S.; Bouzid, B.

    2009-11-01

    The antimicrobial activity of chitosan is unstable and sensitive to many factors such as molecular weight. Recent investigations showed that low molecular weight chitosan exhibited strong bactericidal activities compared to chitosan with high molecular weight. Since chitosan degradation can be caused by the coordinating bond, we attempt to synthesize and characterize the chitosan-Cu (II) complex, and thereafter study the coordinating bond effect on its antibacterial activity against Salmonella enteritidis. Seven chitosan-copper complexes with different copper contents were prepared and characterized by FT-IR, UV-vis, XRD and atomic absorption spectrophotometry (AAS). Results indicated that for chitosan-Cu (II) complexes with molar ratio close to 1:1, the inhibition rate reached 100%.

  10. Next Generation Wiring

    NASA Technical Reports Server (NTRS)

    Medelius, Petro; Jolley, Scott; Fitzpatrick, Lilliana; Vinje, Rubiela; Williams, Martha; Clayton, LaNetra; Roberson, Luke; Smith, Trent; Santiago-Maldonado, Edgardo

    2007-01-01

    Wiring is a major operational component on aerospace hardware that accounts for substantial weight and volumetric space. Over time wire insulation can age and fail, often leading to catastrophic events such as system failure or fire. The next generation of wiring must be reliable and sustainable over long periods of time. These features will be achieved by the development of a wire insulation capable of autonomous self-healing that mitigates failure before it reaches a catastrophic level. In order to develop a self-healing insulation material, three steps must occur. First, methods of bonding similar materials must be developed that are capable of being initiated autonomously. This process will lead to the development of a manual repair system for polyimide wire insulation. Second, ways to initiate these bonding methods that lead to materials that are similar to the primary insulation must be developed. Finally, steps one and two must be integrated to produce a material that has no residues from the process that degrades the insulating properties of the final repaired insulation. The self-healing technology, teamed with the ability to identify and locate damage, will greatly improve reliability and safety of electrical wiring of critical systems. This paper will address these topics, discuss the results of preliminary testing, and remaining development issues related to self-healing wire insulation.

  11. Making Superconducting Welds between Superconducting Wires

    NASA Technical Reports Server (NTRS)

    Penanen, Konstantin I.; Eom, Byeong Ho

    2008-01-01

    A technique for making superconducting joints between wires made of dissimilar superconducting metals has been devised. The technique is especially suitable for fabrication of superconducting circuits needed to support persistent electric currents in electromagnets in diverse cryogenic applications. Examples of such electromagnets include those in nuclear magnetic resonance (NMR) and magnetic resonance imaging (MRI) systems and in superconducting quantum interference devices (SQUIDs). Sometimes, it is desirable to fabricate different parts of a persistent-current-supporting superconducting loop from different metals. For example, a sensory coil in a SQUID might be made of Pb, a Pb/Sn alloy, or a Cu wire plated with Pb/Sn, while the connections to the sensory coil might be made via Nb or Nb/Ti wires. Conventional wire-bonding techniques, including resistance spot welding and pressed contact, are not workable because of large differences between the hardnesses and melting temperatures of the different metals. The present technique is not subject to this limitation. The present technique involves the use (1) of a cheap, miniature, easy-to-operate, capacitor-discharging welding apparatus that has an Nb or Nb/Ti tip and operates with a continuous local flow of gaseous helium and (2) preparation of a joint in a special spark-discharge welding geometry. In a typical application, a piece of Nb foil about 25 m thick is rolled to form a tube, into which is inserted a wire that one seeks to weld to the tube (see figure). The tube can be slightly crimped for mechanical stability. Then a spark weld is made by use of the aforementioned apparatus with energy and time settings chosen to melt a small section of the niobium foil. The energy setting corresponds to the setting of a voltage to which the capacitor is charged. In an experiment, the technique was used to weld an Nb foil to a copper wire coated with a Pb/Sn soft solder, which is superconducting. The joint was evaluated as part of a persistent-current circuit having an inductance of 1 mH. A current was induced in a loop, and no attenuation of the current after a time interval 1,000 s was discernible in a measurement having a fractional accuracy of 10(exp -4): This observation supports the conclusion that the weld had an electrical resistance <10(exp -10) omega.

  12. Copper oxide nanowires as better performance electrode material for supercapacitor application

    NASA Astrophysics Data System (ADS)

    Yar, A.; Dennis, J. O.; Mohamed, N. M.; Mian, M. U.; Irshad, M. I.; Mumtaz, A.

    2016-11-01

    Supercapacitors are highly attractive energy storage devices which are capable of delivering high power, with fast charging and long cycle life. Carbon based material rely on physical charging with less capacitance while metal oxide store charge by fast redox reaction with increased capacitance. Among metal oxide, copper oxide compounds are widely use in the form of nano and micro structures with no definite control over structure. In this work we utilized the well-controlled structure copper wires, originated from AAO template. Such well controlled structure offer better capacitance values due to easily excess of ions to the surface of wires. Performance of material was check in 3 M of potassium hydroxide (KOH). Specific capacitance (Cs) was calculated by using cyclic voltammetry (CV) and Charge discharge (CDC) test. The capacitance calculate on base on CV at 25 mV/s was 101.37 F/g while CDC showed the capacitance of 90 F/g at 2 A/g.

  13. Cyclic hot firing results of tungsten-wire-reinforced, copper-lined thrust chambers

    NASA Technical Reports Server (NTRS)

    Kazaroff, John M.; Jankovsky, Robert S.

    1990-01-01

    An advanced thrust liner material for potential long life reusable rocket engines is described. This liner material was produced with the intent of improving the reusable life of high pressure thrust chambers by strengthening the chamber in the hoop direction, thus avoiding the longitudinal cracking due to low cycle fatigue that is observed in conventional homogeneous copper chambers, but yet not reducing the high thermal conductivity that is essential when operating with high heat fluxes. The liner material produced was a tungsten wire reinforced copper composite. Incorporating this composite into two hydrogen-oxygen test rocket chambers was done so that its performance as a reusable liner material could be evaluated. Testing results showed that both chambers failed prematurely, but the crack sites were perpendicular to the normal direction of cracking indicating a degree of success in containing the tremendous thermal strain associated with high temperature rocket engines. The failures, in all cases, were associated with drilled instrumentation ports and no other damages or deformations were found elsewhere in the composite liners.

  14. Shear strength of metal - SiO2 contacts

    NASA Technical Reports Server (NTRS)

    Pepper, S. V.

    1978-01-01

    The strength of the bond between metals and SiO2 is studied by measuring the static coefficient of friction of metals contacting alpha-quartz in ultrahigh vacuum. It was found that copper with either chemisorbed oxygen, nitrogen or sulphur exhibited higher contact strength on stoichiometric SiO2 than did clean copper. Since the surface density of states induced by these species on copper is similar, it appears that the strength of the interfacial bond can be related to the density of states on the metal surface.

  15. Shear strength of metal - SiO2 contacts

    NASA Technical Reports Server (NTRS)

    Pepper, S. V.

    1978-01-01

    The strength of the bond between metals and SiO2 was studied by measuring the static coefficient of friction of metals contacting alpha-quartz in ultrahigh vacuum. It was found that copper with either chemisorbed oxygen, nitrogen, or sulphur exhibited higher contact strength on stoichiometric SiO2 than did clean copper. Since the surface density of states induced by these species on copper is similar, it appears that the strength of the interfacial bond can be related to the density of states on the metal surface.

  16. Nanopowder synthesis based on electric explosion technology

    NASA Astrophysics Data System (ADS)

    Kryzhevich, D. S.; Zolnikov, K. P.; Korchuganov, A. V.; Psakhie, S. G.

    2017-10-01

    A computer simulation of the bicomponent nanoparticle formation during the electric explosion of copper and nickel wires was carried out. The calculations were performed in the framework of the molecular dynamics method using many-body potentials of interatomic interaction. As a result of an electric explosion of dissimilar metal wires, bicomponent nanoparticles having different stoichiometry and a block structure can be formed. It is possible to control the process of destruction and the structure of the formed bicomponent nanoparticles by varying the distance between the wires and the loading parameters.

  17. Stainless hooks to bond lower lingual retainer.

    PubMed

    Durgekar, Sujala G; Nagaraj, K

    2011-01-01

    We introduced a simple and economical technique for precise placement of lower lingual retainers. Two stainless steel hooks made of 0.6mm wire are placed interdentally in the embrasure area between canine and lateral incisor bilaterally to lock the retainer wire in the correct position. Etch, rinse and dry the enamel surfaces with the retainer passively in place, then bond the retainer with light-cured adhesive. Hooks are simple to fabricate and eliminate the need for a transfer tray.

  18. Excimer laser produced plasmas in copper wire targets and water droplets

    NASA Technical Reports Server (NTRS)

    Song, Kyo-Dong; Alexander, D. R.

    1994-01-01

    Elastically scattered incident radiation (ESIR) from a copper wire target illuminated by a KrF laser pulse at lambda = 248 nm shows a dinstinct two-peak structure which is dependent on the incident energy. The time required to reach the critical electron density (n(sub c) approximately = 1.8 x 10(exp 22) electrons/cu cm) is estimated at 11 ns based on experimental results. Detailed ESIR characteristics for water have been reported previously by the authors. Initiation of the broadband emission for copper plasma begins at 6.5 +/- 1.45 ns after the arrival of the laser pulse. However, the broadband emission occurs at 11 +/- 0.36 ns for water. For a diatomic substance such as water, the electron energy rapidly dissipates due to dissociation of water molecules, which is absent in a monatomic species such as copper. When the energy falls below the excitation energy of the lowest electron state for water, it becomes a subexcitation electron. Lifetimes of the subexcited electrons to the vibrational states are estimated to be of the order of 10(exp -9) s. In addition, the ionization potential of copper (440-530 nm) is approximately 6 eV, which is about two times smaller than the 13 eV ionization potential reported for water. The higher ionization potential contributes to the longer observed delay time for plasma formation in water. After initiation, a longer time is required for copper plasma to reach its peak value. This time delay in reaching the maximum intensity is attributed to the energy loss during the interband transition in copper.

  19. The effect of prior sandblasting of the wire on the shear bond strength of two different types of lingual retainers.

    PubMed

    Kilinç, Delal Dara; Sayar, Gülşilay

    2018-04-07

    The aim of this study was to evaluate the effect of total surface sandblasting on the shear bond strength of two different retainer wires. The null hypothesis was that there is no difference in the bond strength of the two types of lingual retainer wires when they are sandblasted. One hundred and sixty human premolar teeth were equally divided into four groups (n=40). A pair of teeth was embedded in self-curing acrylic resin and polished. Retainer wires were applied on the etched and rinsed surfaces of the teeth. Four retainers were used: group 1: braided retainer (0.010×0.028″, Ortho Technology); group 2: sandblasted braided retainer (0.010×0.028″, Ortho Technology); group 3: coaxial retainer (0.0215″ Coaxial, 3M) and group 4: sandblasted coaxial retainer (0.0215″ Coaxial, 3M). The specimens were tested using a universal test machine in shear mode with a crosshead speed of one mm/min. One-way analysis of variance (Anova) was used to determine the significant differences among the groups. There was no significant difference (P=0.117) among the groups according to this test. The null hypothesis was accepted. There was no statistically significant difference among the shear bond strength values of the four groups. Copyright © 2018 CEO. Published by Elsevier Masson SAS. All rights reserved.

  20. Double copper sheath multiconductor instrumentation cable is durable and easily installed in high thermal or nuclear radiation area

    NASA Technical Reports Server (NTRS)

    Mc Crae, A. W., Jr.

    1967-01-01

    Multiconductor instrumentation cable in which the conducting wires are routed through two concentric copper tube sheaths, employing a compressed insulator between the conductors and between the inner and outer sheaths, is durable and easily installed in high thermal or nuclear radiation area. The double sheath is a barrier against moisture, abrasion, and vibration.

  1. Study of the effect of varying core diameter, shell thickness and strain velocity on the tensile properties of single crystals of Cu-Ag core-shell nanowire using molecular dynamics simulations

    NASA Astrophysics Data System (ADS)

    Sarkar, Jit; Das, D. K.

    2018-01-01

    Core-shell type nanostructures show exceptional properties due to their unique structure having a central solid core of one type and an outer thin shell of another type which draw immense attention among researchers. In this study, molecular dynamics simulations are carried out on single crystals of copper-silver core-shell nanowires having wire diameter ranging from 9 to 30 nm with varying core diameter, shell thickness, and strain velocity. The tensile properties like yield strength, ultimate tensile strength, and Young's modulus are studied and correlated by varying one parameter at a time and keeping the other two parameters constant. The results obtained for a fixed wire size and different strain velocities were extrapolated to calculate the tensile properties like yield strength and Young's modulus at standard strain rate of 1 mm/min. The results show ultra-high tensile properties of copper-silver core-shell nanowires, several times than that of bulk copper and silver. These copper-silver core-shell nanowires can be used as a reinforcing agent in bulk metal matrix for developing ultra-high strength nanocomposites.

  2. Temperature-modulated DSC provides new insight about nickel-titanium wire transformations.

    PubMed

    Brantley, William A; Iijima, Masahiro; Grentzer, Thomas H

    2003-10-01

    Differential scanning calorimetry (DSC) is a well-known method for investigating phase transformations in nickel-titanium orthodontic wires; the microstructural phases and phase transformations in these wires have central importance for their clinical performance. The purpose of this study was to use the more recently developed technique of temperature-modulated DSC (TMDSC) to gain insight into transformations in 3 nickel-titanium orthodontic wires: Neo Sentalloy (GAC International, Islandia, NY), 35 degrees C Copper Ni-Ti (Ormco, Glendora, Calif) and Nitinol SE (3M Unitek, Monrovia, Calif). In the oral environment, the first 2 superelastic wires have shape memory, and the third wire has superelastic behavior but not shape memory. All wires had cross-section dimensions of 0.016 x 0.022 in. Archwires in the as-received condition and after bending 135 degrees were cut into 5 or 6 segments for test specimens. TMDSC analyses (Model 2910 DSC, TA Instruments, Wilmington, Del) were conducted between -125 degrees C and 100 degrees C, using a linear heating and cooling rate of 2 degrees C per min, an oscillation amplitude of 0.318 degrees C with a period of 60 seconds, and helium as the purge gas. For all 3 wire alloys, strong low-temperature martensitic transformations, resolved on the nonreversing heat-flow curves, were not present on the reversing heat-flow curves, and bending appeared to increase the enthalpy change for these peaks in some cases. For Neo Sentalloy, TMDSC showed that transformation between martensitic and austenitic nickel-titanium, suggested as occurring directly in the forward and reverse directions by conventional DSC, was instead a 2-step process involving the R-phase. Two-step transformations in the forward and reverse directions were also found for 35 degrees C Copper Ni-Ti and Nitinol SE. The TMDSC results show that structural transformations in these wires are complex. Some possible clinical implications of these observations are discussed.

  3. The Copper-nicotinamide complex: sustainable applications in coupling and cycloaddition reactions

    EPA Science Inventory

    Crystalline copper (II)-nicotinamide complex, synthesized via simple mixing of copper chloride and nicotinamide solution at room temperature, catalyzes the C-S, C-N bond forming and cycloaddition reactions under a variety of sustainable reaction conditions.

  4. Raman Analysis of Dilute Aqueous Samples by Localized Evaporation of Submicroliter Droplets on the Tips of Superhydrophobic Copper Wires.

    PubMed

    Cheung, Melody; Lee, Wendy W Y; McCracken, John N; Larmour, Iain A; Brennan, Steven; Bell, Steven E J

    2016-04-19

    Raman analysis of dilute aqueous solutions is normally prevented by their low signal levels. A very general method to increase the concentration to detectable levels is to evaporate droplets of the sample to dryness, creating solid deposits which are then Raman probed. Here, superhydrophobic (SHP) wires with hydrophilic tips have been used as supports for drying droplets, which have the advantage that the residue is automatically deposited at the tip. The SHP wires were readily prepared in minutes using electroless galvanic deposition of Ag onto copper wires followed by modification with a polyfluorothiol (3,3,4,4,5,5,6,6,7,7,8,8,9,9,10,10,10-heptadecafluoro-1-decanethiol, HDFT). Cutting the coated wires with a scalpel revealed hydrophilic tips which could support droplets whose maximum size was determined by the wire diameter. Typically, 230 μm wires were used to support 0.6 μL droplets. Evaporation of dilute melamine droplets gave solid deposits which could be observed by scanning electron microscopy (SEM) and Raman spectroscopy. The limit of detection for melamine using a two stage evaporation procedure was 1 × 10(-6) mol dm(-3). The physical appearance of dried droplets of sucrose and glucose showed that the samples retained significant amounts of water, even under high vacuum. Nonetheless, the Raman detection limits of sucrose and glucose were 5 × 10(-4) and 2.5 × 10(-3) mol dm(-3), respectively, which is similar to the sensitivity reported for surface-enhanced Raman spectroscopy (SERS) detection of glucose. It was also possible to quantify the two sugars in mixtures at concentrations which were similar to those found in human blood through multivariate analysis.

  5. Degradation of orthodontic wires under simulated cariogenic and erosive conditions.

    PubMed

    Jaber, Laura Cavalcante Lima; Rodrigues, José Augusto; Amaral, Flávia Lucisano Botelho; França, Fabiana Mantovani Gomes; Basting, Roberta Tarkany; Turssi, Cecilia Pedroso

    2014-01-01

    This study examined the effect of cariogenic and erosive challenges (CCs and ECs, respectively) on the degradation of copper-nickel-titanium (CuNiTi) orthodontic wires. Sixty wire segments were divided into four treatment groups and exposed to CCs, ECs, artificial saliva, or dry storage (no-treatment control). CC and EC were simulated using a demineralizing solution (pH 4.3) and a citric acid solution (pH 2.3), respectively. Following treatment, the average surface roughness (Ra) of the wires was assessed, and friction between the wires and a passive self-ligating bracket was measured. CuNiTi wires subjected to ECs exhibited significantly higher Ra values than did those that were stored in artificial saliva. In contrast, surface roughness was not affected by CCs. Finally, friction between the treated wires and brackets was not affected by ECs or CCs. Our results indicate that CuNiTi orthodontic wires may suffer degradation within the oral cavity, as ECs increased the surface roughness of these wires. However, rougher surfaces did not increase friction between the wire and the passive self-ligating bracket.

  6. Universal behavior of surface-dangling bonds in hydrogen-terminated Si, Ge, and Si/Ge nanowires.

    NASA Astrophysics Data System (ADS)

    Nunes, Ricardo; Kagimura, Ricardo; Chacham, Hélio

    2007-03-01

    We report an ab initio study of the electronic properties of surface dangling bond (SDB) states in hydrogen-terminated Si, Ge, and Si/Ge nanowires with diameters between 1 and 2 nm. We find that the charge transition levels ɛ(+/-) of SDB states are deep in the bandgap for Si wires, and shallow (near the valence band edge) for Ge wires. In both Si and Ge wires, the SDB states are localized. We also find that the SDB ɛ(+/-) levels behave as a ``universal" energy reference level among Si, Ge, and Si/Ge wires within a precision of 0.1 eV. By computing the average bewteen the electron affinity and ionization energy in the atomi limit of several atoms from the III, IV and V columns, we conjecture that the universality is a periodic-table atomic property.

  7. Measured opening characteristics of an electromagnetically opened diaphragm for the Langley expansion tunnel

    NASA Technical Reports Server (NTRS)

    Moore, J. A.

    1976-01-01

    Results from an experimental study of the opening characteristics of an electromagnetically opened, 15.24 cm diameter diaphragm are presented. This diaphragm consists of a polyester film bonded to a preformed wire and is opened by passing a current pulse (capacitor discharge) through the wire. The diaphragm separates the acceleration section of the expansion tunnel from the nozzle so that the nozzle may be at a lower pressure than the acceleration section prior to a test. Opening times and cleanness of the opened area were examined for dependence on diaphragm thickness, on wire diameter, on technique of bonding the wire to the diaphragm, and on voltage and energy level of the energy source. Time histories of the pitot pressure measured at the expansion-tunnel nozzle entrance location are presented for (1) no diaphragm, (2) a flow-opened diaphragm, and (3) an electromagnetically opened diaphragm.

  8. Quantitative assessment of intermolecular interactions by atomic force microscopy imaging using copper oxide tips

    NASA Astrophysics Data System (ADS)

    Mönig, Harry; Amirjalayer, Saeed; Timmer, Alexander; Hu, Zhixin; Liu, Lacheng; Díaz Arado, Oscar; Cnudde, Marvin; Strassert, Cristian Alejandro; Ji, Wei; Rohlfing, Michael; Fuchs, Harald

    2018-05-01

    Atomic force microscopy is an impressive tool with which to directly resolve the bonding structure of organic compounds1-5. The methodology usually involves chemical passivation of the probe-tip termination by attaching single molecules or atoms such as CO or Xe (refs 1,6-9). However, these probe particles are only weakly connected to the metallic apex, which results in considerable dynamic deflection. This probe particle deflection leads to pronounced image distortions, systematic overestimation of bond lengths, and in some cases even spurious bond-like contrast features, thus inhibiting reliable data interpretation8-12. Recently, an alternative approach to tip passivation has been used in which slightly indenting a tip into oxidized copper substrates and subsequent contrast analysis allows for the verification of an oxygen-terminated Cu tip13-15. Here we show that, due to the covalently bound configuration of the terminal oxygen atom, this copper oxide tip (CuOx tip) has a high structural stability, allowing not only a quantitative determination of individual bond lengths and access to bond order effects, but also reliable intermolecular bond characterization. In particular, by removing the previous limitations of flexible probe particles, we are able to provide conclusive experimental evidence for an unusual intermolecular N-Au-N three-centre bond. Furthermore, we demonstrate that CuOx tips allow the characterization of the strength and configuration of individual hydrogen bonds within a molecular assembly.

  9. Susceptibility cancellation of a microcoil wound with a paramagnetic-liquid-filled copper capillary

    NASA Astrophysics Data System (ADS)

    Takeda, Kazuyuki; Takasaki, Tomoya; Takegoshi, K.

    2015-09-01

    Even though microcoils improve the sensitivity of NMR measurement of tiny samples, magnetic-field inhomogeneity due to the bulk susceptibility effect of the coil material can cause serious resonance-line broadening. Here, we propose to fabricate the microcoil using a thin, hollow copper capillary instead of a wire and fill paramagnetic liquid inside the capillary, so as to cancel the diamagnetic contribution of the copper. Susceptibility cancellation is demonstrated using aqueous solution of NiSO4. In addition, the paramagnetic liquid serves as coolant when it is circulated through the copper capillary, effectively transferring the heat generated by radiofrequency pulses.

  10. Copper-catalyzed, C-C coupling-based one-pot tandem reactions for the synthesis of benzofurans using o-iodophenols, acyl chlorides, and phosphorus ylides.

    PubMed

    Liu, Yunyun; Wang, Hang; Wan, Jie-Ping

    2014-11-07

    One-pot reactions involving acyl chlorides, phosphorus ylides, and o-iodophenols with copper catalysis have been established for the rapid synthesis of functionalized benzofurans. With all of these easily available and stable reactants, the construction of the target products has been accomplished via tandem transformations involving a key C-C coupling, leading to the formation of one C(sp(2))-C bond, one C(sp(2))-O bond, and one C ═ C bond.

  11. Copper-Catalyzed, Directing Group-Assisted Fluorination of Arene and Heteroarene C-H Bonds

    PubMed Central

    Truong, Thanh; Klimovica, Kristine; Daugulis, Olafs

    2013-01-01

    We have developed a method for direct, copper-catalyzed, auxiliary-assisted fluorination of β-sp2 C-H bonds of benzoic acid derivatives and γ-sp2 C-H bonds of α,α-disubstituted benzylamine derivatives. The reaction employs CuI catalyst, AgF fluoride source, and DMF, pyridine, or DMPU solvent at moderately elevated temperatures. Selective mono- or difluorination can be achieved by simply changing reaction conditions. The method shows excellent functional group tolerance and provides a straightforward way for the preparation of ortho-fluorinated benzoic acids. PMID:23758609

  12. An advanced arc track resistant airframe wire

    NASA Technical Reports Server (NTRS)

    Beatty, J.

    1995-01-01

    Tensolite, a custom cable manufacturer specializing in high temperature materials as the dielectric medium, develops an advance arc track resistant airframe wire called Tufflite 2000. Tufflite 2000 has the following advantages over the other traditional wires: lighter weight and smaller in diameter; excellent wet and dry arc track resistance; superior dynamic cut-through performance even at elevated temperatures; flight proven performance on Boeing 737 and 757 airplanes; and true 260 C performance by utilizing Nickel plated copper conductors. This paper reports the different tests performed on Tufflite 2000: accelerated aging, arc resistance (wet and dry), dynamic cut through, humidity resistance, wire-to-wire abrasion, flammability, smoke, weight, notch sensitivity, flexibility, and markability. It particularly focuses on the BSI (British Standards Institute) dry arc resistance test and BSI wet arc tracking.

  13. Modern techniques and technologies for unbundled access in the local loop

    NASA Astrophysics Data System (ADS)

    Bacis Vasile, Irina Bristena; Schiopu, Paul; Marghescu, Cristina

    2015-02-01

    The efficient and unbundled use of the existing telecommunications infrastructure represents a major goal for the development of the services offered by telecommunications providers. A major telecommunications operator can provide services to a subscriber using a copper wire pair or part of the frequency spectrum of a copper wire pair, together with other operators, through a process of unbundling access in the local loop. Since access to the vocal band is an already solved problem, concerns turn to the broadband access with xDSL service delivery on ungrouped subscriber loops; besides the legal and economic aspects involved this has become an engineering problem also. The local loop unbundling methods have a substantial technical impact. This impact should be taken into account right from the design stage and then in the standardization stage of broadband systems intended to operate on copper wire pairs in the local loop. These systems are known under the generic term of xDSL and began to be analyzed in the late 90s. xDSL became the dominant solution for providing Internet at a reasonable price for both residential and business subscribers. In this massive development scenario, certain problems will arise from the early stages of deployment, and another type of problems will occur later on when a large number of systems will be installed in a single beam.

  14. Laser Indirect Shock Welding of Fine Wire to Metal Sheet

    PubMed Central

    Wang, Xiao; Huang, Tao; Luo, Yapeng; Liu, Huixia

    2017-01-01

    The purpose of this paper is to present an advanced method for welding fine wire to metal sheet, namely laser indirect shock welding (LISW). This process uses silica gel as driver sheet to accelerate the metal sheet toward the wire to obtain metallurgical bonding. A series of experiments were implemented to validate the welding ability of Al sheet/Cu wire and Al sheet/Ag wire. It was found that the use of a driver sheet can maintain high surface quality of the metal sheet. With the increase of laser pulse energy, the bonding area of the sheet/wire increased and the welding interfaces were nearly flat. Energy dispersive spectroscopy (EDS) results show that the intermetallic phases were absent and a short element diffusion layer which would limit the formation of the intermetallic phases emerging at the welding interface. A tensile shear test was used to measure the mechanical strength of the welding joints. The influence of laser pulse energy on the tensile failure modes was investigated, and two failure modes, including interfacial failure and failure through the wire, were observed. The nanoindentation test results indicate that as the distance to the welding interface decreased, the microhardness increased due to the plastic deformation becoming more violent. PMID:28895900

  15. Recent advances in heterobimetallic palladium(II)/copper(II) catalyzed domino difunctionalization of carbon-carbon multiple bonds.

    PubMed

    Beccalli, Egle M; Broggini, Gianluigi; Gazzola, Silvia; Mazza, Alberto

    2014-09-21

    The double functionalization of carbon-carbon multiple bonds in one-pot processes has emerged in recent years as a fruitful tool for the rapid synthesis of complex molecular scaffolds. This review covers the advances in domino reactions promoted by the couple palladium(ii)/copper(ii), which was proven to be an excellent catalytic system for the functionalization of substrates.

  16. Enhancing the x-ray output of a single-wire explosion with a gas-puff based plasma opening switch

    NASA Astrophysics Data System (ADS)

    Engelbrecht, Joseph T.; Ouart, Nicholas D.; Qi, Niansheng; de Grouchy, Philip W.; Shelkovenko, Tatiana A.; Pikuz, Sergey A.; Banasek, Jacob T.; Potter, William M.; Rocco, Sophia V.; Hammer, David A.; Kusse, Bruce R.; Giuliani, John L.

    2018-02-01

    We present experiments performed on the 1 MA COBRA generator using a low density, annular, gas-puff z-pinch implosion as an opening switch to rapidly transfer a current pulse into a single metal wire on axis. This gas-puff on axial wire configuration was studied for its promise as an opening switch and as a means of enhancing the x-ray output of the wire. We demonstrate that current can be switched from the gas-puff plasma into the wire, and that the timing of the switch can be controlled by the gas-puff plenum backing pressure. X-ray detector measurements indicate that for low plenum pressure Kr or Xe shots with a copper wire, this configuration can offer a significant enhancement in the peak intensity and temporal distribution of radiation in the 1-10 keV range.

  17. Magnetization and magnetoresistance of common alloy wires used in cryogenic instrumentation.

    PubMed

    Abrecht, M; Adare, A; Ekin, J W

    2007-04-01

    We present magnetization and magnetoresistance data at liquid-helium and liquid-nitrogen temperatures for wire materials commonly used for instrumentation wiring of specimens, sensors, and heaters in cryogenic probes. The magnetic susceptibilities in Systeme International units at 4.2 K were found to be: Manganin 1.25x10(-2), Nichrome 5.6x10(-3), and phosphor bronze -3.3x10(-5), indicating that phosphor bronze is the most suitable for high-field applications. We also show the ferromagnetic hysteresis loop of Constantan wire at liquid-helium temperature. The magnetoresistance of these four wires was relatively small: the changes in resistance at 4 K due to a 10 T transverse magnetic field are -2.56% for Constantan, -2.83% for Manganin, +0.69% for Nichrome, and +4.5% for phosphor bronze, compared to about +188% for a typical copper wire under the same conditions.

  18. Magnetization and magnetoresistance of common alloy wires used in cryogenic instrumentation

    NASA Astrophysics Data System (ADS)

    Abrecht, M.; Adare, A.; Ekin, J. W.

    2007-04-01

    We present magnetization and magnetoresistance data at liquid-helium and liquid-nitrogen temperatures for wire materials commonly used for instrumentation wiring of specimens, sensors, and heaters in cryogenic probes. The magnetic susceptibilities in Systeme International units at 4.2 K were found to be: Manganin 1.25×10-2, Nichrome 5.6×10-3, and phosphor bronze -3.3×10-5, indicating that phosphor bronze is the most suitable for high-field applications. We also show the ferromagnetic hysteresis loop of Constantan wire at liquid-helium temperature. The magnetoresistance of these four wires was relatively small: the changes in resistance at 4 K due to a 10 T transverse magnetic field are -2.56% for Constantan, -2.83% for Manganin, +0.69% for Nichrome, and +4.5% for phosphor bronze, compared to about +188% for a typical copper wire under the same conditions.

  19. Bundled monocapillary optics

    DOEpatents

    Hirsch, Gregory

    2002-01-01

    A plurality of glass or metal wires are precisely etched to form the desired shape of the individual channels of the final polycapillary optic. This shape is created by carefully controlling the withdrawal speed of a group of wires from an etchant bath. The etched wires undergo a subsequent operation to create an extremely smooth surface. This surface is coated with a layer of material which is selected to maximize the reflectivity of the radiation being used. This reflective surface may be a single layer of material, or a multilayer coating for optimizing the reflectivity in a narrower wavelength interval. The collection of individual wires is assembled into a close-packed multi-wire bundle, and the wires are bonded together in a manner which preserves the close-pack configuration, irrespective of the local wire diameter. The initial wires are then removed by either a chemical etching procedure or mechanical force. In the case of chemical etching, the bundle is generally segmented by cutting a series of etching slots. Prior to removing the wire, the capillary array is typically bonded to a support substrate. The result of the process is a bundle of precisely oriented radiation-reflecting hollow channels. The capillary optic is used for efficiently collecting and redirecting the radiation from a source of radiation which could be the anode of an x-ray tube, a plasma source, the fluorescent radiation from an electron microprobe, a synchrotron radiation source, a reactor or spallation source of neutrons, or some other source.

  20. ZnO nanorod arrays and direct wire bonding on GaN surfaces for rapid fabrication of antireflective, high-temperature ultraviolet sensors

    NASA Astrophysics Data System (ADS)

    So, Hongyun; Senesky, Debbie G.

    2016-11-01

    Rapid, cost-effective, and simple fabrication/packaging of microscale gallium nitride (GaN) ultraviolet (UV) sensors are demonstrated using zinc oxide nanorod arrays (ZnO NRAs) as an antireflective layer and direct bonding of aluminum wires to the GaN surface. The presence of the ZnO NRAs on the GaN surface significantly reduced the reflectance to less than 1% in the UV and 4% in the visible light region. As a result, the devices fabricated with ZnO NRAs and mechanically stable aluminum bonding wires (pull strength of 3-5 gf) showed higher sensitivity (136.3% at room temperature and 148.2% increase at 250 °C) when compared with devices with bare (uncoated) GaN surfaces. In addition, the devices demonstrated reliable operation at high temperatures up to 300 °C, supporting the feasibility of simple and cost-effective UV sensors operating with higher sensitivity in high-temperature conditions, such as in combustion, downhole, and space exploration applications.

  1. Fast and reliable method to estimate losses of single-mode waveguides with an arbitrary 2D trajectory.

    PubMed

    Negredo, F; Blaicher, M; Nesic, A; Kraft, P; Ott, J; Dörfler, W; Koos, C; Rockstuhl, C

    2018-06-01

    Photonic wire bonds, i.e., freeform waveguides written by 3D direct laser writing, emerge as a technology to connect different optical chips in fully integrated photonic devices. With the long-term vision of scaling up this technology to a large-scale fabrication process, the in situ optimization of the trajectory of photonic wire bonds is at stake. A prerequisite for the real-time optimization is the availability of a fast loss estimator for single-mode waveguides of arbitrary trajectory. Losses occur because of the bending of the waveguides and at transitions among sections of the waveguide with different curvatures. Here, we present an approach that resides on the fundamental mode approximation, i.e., the assumption that the photonic wire bonds predominantly carry their energy in a single mode. It allows us to predict in a quick and reliable way the pertinent losses from pre-computed modal properties of the waveguide, enabling fast design of optimum paths.

  2. Effects of processing conditions and ambient environment on the microstructure and fracture strength of copper/niobium/copper interlayer joints for alumina

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Marks, Robert Alan

    1999-12-01

    Partial transient liquid phase (PTLP) bonding is a technique which can be used to join ceramics with metals and is used to form niobium-based joints for alumina. The principal advantage to PTLP bonding is that it enables refractory joints to be fabricated at temperatures below those typically required by solid state diffusion bonding. A thorough review of the important parameters (chemical compatibility, thermal expansion match, sufficient wettability of the liquid phase on the solid phases) in choosing a joining material for ceramics by the PTLP method is provided. As in conventional PTLP joining, the current study uses thin (=3 μm)more » copper layers sandwiched between the alumina (bulk) and niobium (127 μm). However, unlike the case of copper/nickel/copper obium is limited. Consequently, the copper is not entirely dissolved in the process, resulting in a two phase (copper-rich and niobium-rich phases) microstructure. Different processing conditions (temperature and applied load) result in different morphologies of the copper-rich and niobium-rich phases at the interface. These different microstructures exhibit distinct strength characteristics. Extended annealing of as-processed joints can influence the strengths differently depending on the ambient partial oxygen pressure at the annealing temperature. The focus of this work is to correlate processing conditions, microstructure, and resulting joint strength. Under optimum processing conditions (1400°C, 2.2 MPa), joints with strengths in excess of 200 MPa at 1200°C are fabricated.« less

  3. Symmetric miniaturized heating system for active microelectronic devices.

    PubMed

    McCracken, Michael; Mayer, Michael; Jourard, Isaac; Moon, Jeong-Tak; Persic, John

    2010-07-01

    To qualify interconnect technologies such as microelectronic fine wire bonds for mass production of integrated circuit (IC) packages, it is necessary to perform accelerated aging tests, e.g., to age a device at an elevated temperature or to subject the device to thermal cycling and measure the decrease of interconnect quality. There are downsides to using conventional ovens for this as they are relatively large and have relatively slow temperature change rates, and if electrical connections are required between monitoring equipment and the device being heated, they must be located inside the oven and may be aged by the high temperatures. Addressing these downsides, a miniaturized heating system (minioven) is presented, which can heat individual IC packages containing the interconnects to be tested. The core of this system is a piece of copper cut from a square shaped tube with high resistance heating wire looped around it. Ceramic dual in-line packages are clamped against either open end of the core. One package contains a Pt100 temperature sensor and the other package contains the device to be aged placed in symmetry to the temperature sensor. According to the temperature detected by the Pt100, a proportional-integral-derivative controller adjusts the power supplied to the heating wire. The system maintains a dynamic temperature balance with the core hot and the two symmetric sides with electrical connections to the device under test at a cooler temperature. Only the face of the package containing the device is heated, while the socket holding it remains below 75 degrees C when the oven operates at 200 degrees C. The minioven can heat packages from room temperature up to 200 degrees C in less than 5 min and maintain this temperature at 28 W power. During long term aging, a temperature of 200 degrees C was maintained for 1120 h with negligible resistance change of the heating wires after 900 h (heating wire resistance increased 0.2% over the final 220 h). The device is also subjected to 5700 thermal cycles between 55 and 195 degrees C, demonstrating reliability under thermal cycling.

  4. Electron Beam Irradiated Intercalated CNT Yarns For Aerospace Applications

    NASA Technical Reports Server (NTRS)

    Waters, Deborah L.; Gaier, James R.; Williams, Tiffany S.; Lopez Calero, Johnny E.; Ramirez, Christopher; Meador, Michael A.

    2015-01-01

    Multi-walled CNT yarns have been experimentally and commercially created to yield lightweight, high conductivity fibers with good tensile properties for application as electrical wiring and multifunctional tendons. Multifunctional tendons are needed as the cable structures in tensegrity robots for use in planetary exploration. These lightweight robust tendons can provide mechanical strength for movement of the robot in addition to power distribution and data transmission. In aerospace vehicles, such as Orion, electrical wiring and harnessing mass can approach half of the avionics mass. Use of CNT yarns as electrical power and data cables could reduce mass of the wiring by thirty to seventy percent. These fibers have been intercalated with mixed halogens to increase their specific electrical conductivity to that near copper. This conductivity, combined with the superior strength and fatigue resistance makes it an attractive alternative to copper for wiring and multifunctional tendon applications. Electron beam irradiation has been shown to increase mechanical strength in pristine CNT fibers through increased cross-linking. Both pristine and intercalated CNT yarns have been irradiated using a 5-megavolt electron beam for various durations and the conductivities and tensile properties will be discussed. Structural information obtained using a field emission scanning electron microscope, energy dispersive X-ray spectroscopy (EDS), and Raman spectroscopy will correlate microstructural details with bulk properties.

  5. Insights into the role of the unusual disulfide bond in copper-zinc superoxide dismutase.

    PubMed

    Sea, Kevin; Sohn, Se Hui; Durazo, Armando; Sheng, Yuewei; Shaw, Bryan F; Cao, Xiaohang; Taylor, Alexander B; Whitson, Lisa J; Holloway, Stephen P; Hart, P John; Cabelli, Diane E; Gralla, Edith Butler; Valentine, Joan Selverstone

    2015-01-23

    The functional and structural significance of the intrasubunit disulfide bond in copper-zinc superoxide dismutase (SOD1) was studied by characterizing mutant forms of human SOD1 (hSOD) and yeast SOD1 lacking the disulfide bond. We determined x-ray crystal structures of metal-bound and metal-deficient hC57S SOD1. C57S hSOD1 isolated from yeast contained four zinc ions per protein dimer and was structurally very similar to wild type. The addition of copper to this four-zinc protein gave properly reconstituted 2Cu,2Zn C57S hSOD, and its spectroscopic properties indicated that the coordination geometry of the copper was remarkably similar to that of holo wild type hSOD1. In contrast, the addition of copper and zinc ions to apo C57S human SOD1 failed to give proper reconstitution. Using pulse radiolysis, we determined SOD activities of yeast and human SOD1s lacking disulfide bonds and found that they were enzymatically active at ∼10% of the wild type rate. These results are contrary to earlier reports that the intrasubunit disulfide bonds in SOD1 are essential for SOD activity. Kinetic studies revealed further that the yeast mutant SOD1 had less ionic attraction for superoxide, possibly explaining the lower rates. Saccharomyces cerevisiae cells lacking the sod1 gene do not grow aerobically in the absence of lysine, but expression of C57S SOD1 increased growth to 30-50% of the growth of cells expressing wild type SOD1, supporting that C57S SOD1 retained a significant amount of activity. © 2015 by The American Society for Biochemistry and Molecular Biology, Inc.

  6. Insights into the Role of the Unusual Disulfide Bond in Copper-Zinc Superoxide Dismutase*

    PubMed Central

    Sea, Kevin; Sohn, Se Hui; Durazo, Armando; Sheng, Yuewei; Shaw, Bryan F.; Cao, Xiaohang; Taylor, Alexander B.; Whitson, Lisa J.; Holloway, Stephen P.; Hart, P. John; Cabelli, Diane E.; Gralla, Edith Butler; Valentine, Joan Selverstone

    2015-01-01

    The functional and structural significance of the intrasubunit disulfide bond in copper-zinc superoxide dismutase (SOD1) was studied by characterizing mutant forms of human SOD1 (hSOD) and yeast SOD1 lacking the disulfide bond. We determined x-ray crystal structures of metal-bound and metal-deficient hC57S SOD1. C57S hSOD1 isolated from yeast contained four zinc ions per protein dimer and was structurally very similar to wild type. The addition of copper to this four-zinc protein gave properly reconstituted 2Cu,2Zn C57S hSOD, and its spectroscopic properties indicated that the coordination geometry of the copper was remarkably similar to that of holo wild type hSOD1. In contrast, the addition of copper and zinc ions to apo C57S human SOD1 failed to give proper reconstitution. Using pulse radiolysis, we determined SOD activities of yeast and human SOD1s lacking disulfide bonds and found that they were enzymatically active at ∼10% of the wild type rate. These results are contrary to earlier reports that the intrasubunit disulfide bonds in SOD1 are essential for SOD activity. Kinetic studies revealed further that the yeast mutant SOD1 had less ionic attraction for superoxide, possibly explaining the lower rates. Saccharomyces cerevisiae cells lacking the sod1 gene do not grow aerobically in the absence of lysine, but expression of C57S SOD1 increased growth to 30–50% of the growth of cells expressing wild type SOD1, supporting that C57S SOD1 retained a significant amount of activity. PMID:25433341

  7. Why do nickel-titanium archwires fracture intraorally? Fractographic analysis and failure mechanism of in-vivo fractured wires.

    PubMed

    Zinelis, Spiros; Eliades, Theodore; Pandis, Nikolaos; Eliades, George; Bourauel, Christoph

    2007-07-01

    The aim of this study was to characterize intraorally fractured nickel-titanium (Ni-Ti) archwires, determine the type of fracture, assess changes in the alloy's hardness and structure, and propose a mechanism of failure. Eleven Ni-Ti SE 200 and 19 copper-Ni-Ti (both, Ormco, Glendora, Calif) intraorally fractured archwires were collected. The location of fracture (anterior or posterior), wire type, cross section, and period of service before fracture were recorded. The retrieved wires and brand-, type-, and size-matched specimens of unused wires were subjected to scanning electron microscopy to assess the fracture type and morphological variation of fracture site of retrieved specimens, and to Vickers hardness (HV200) testing to investigate the hardness of as-received and in-vivo fractured specimens. Fracture site distribution was statistically analyzed with the chi-square test (alpha = 0.05), whereas the results of the hardness testing were analyzed with 2-way ANOVA with state (control vs in-vivo fractured) and composition (Ni-Ti SE vs copper-Ni-Ti) serving as discriminating variables and the Student-Newman-Keuls test at the 95% confidence level. The fracture site distribution showed a preferential location at the midspan between the premolar and the molar, suggesting that masticatory forces and complex loading during engagement of the wire to the bracket slot and potential intraoral aging might account for fracture incidence. All retrieved wires had the distinct features of brittle fracture without plastic deformation or crack propagation, whereas no increase in hardness was observed for the retrieved specimens. Most fractures sites were in the posterior region of the arch, probably because of the high-magnitude masticatory forces. Brittle fracture without plastic deformation was observed in most Ni-Ti wires regardless of archwire composition. There was no increase in the hardness of the intraorally exposed specimens regardless of wire type. This contradicts previous in-vitro studies and rules out hydrogen embrittlement as the cause of fracture.

  8. The design and evaluation of superconducting connectors

    NASA Technical Reports Server (NTRS)

    Payne, J. E.

    1982-01-01

    The development of a superconducting connector for superconducting circuits on space flights is described. It is proposed that such connectors be used between the superconducting readout loop and the SQUID magnetometer in the Gravity Probe B experiment. Two types of connectors were developed. One type employs gold plated niobium wires making pressure connections to gold plated niobium pads. Lead-plated beryllium-copper spring contacts can replace the niobium wires. The other type is a rigid solder or weld connection between the niobium wires and the niobium pads. A description of the methods used to produce these connectors is given and their performance analyzed.

  9. Effects of temperature and holding time on bonding W and W-Cu composites with an amorphous W-Fe coated copper foil as the interlayer by hot-pressing

    NASA Astrophysics Data System (ADS)

    Zhao, Pei; Wang, Song; Guo, Shibin; Chen, Yixiang; Ling, Yunhan; Li, Jiangtao

    2013-07-01

    W and W-Cu composites were bonded with an amorphous W-Fe coated copper foil as the interlayer at different temperature and holding time by hot pressing method. Effects of the bonding temperature and holding time on the microstructure and thermal conductivity of the bonded specimens were investigated. The thermal conductivity of the bonded sample increased with the bonding temperature and reached the maximum at 1000 °C, but essentially unchanged with the holding time. Because at 1000 °C more W-Fe compounds would be formed at the interlayer, which were helpful for tight bonding of W and W-Cu composites, and the grain size was larger which could reduce thermal resistance. The W-Cu FGM bonded by this method showed good resistance to thermal load, and performed well when facing to short pulse plasma in experimental advanced superconducting tokamak (the first full superconductive fusion device in the world).

  10. Multiple-layer printed-wiring trace connector

    NASA Technical Reports Server (NTRS)

    Pizzeck, D. E.

    1977-01-01

    Nickel-plated spring-steel foil connector is hollow pin, with lengthwise slit, that is inserted into improperly plated-through holes. Edges of connector make positive contact with copper pads within hole.

  11. Flowable composites for bonding orthodontic retainers.

    PubMed

    Tabrizi, Sama; Salemis, Elio; Usumez, Serdar

    2010-01-01

    To test the null hypothesis that there are no statistically significant differences between flowables and an orthodontic adhesive tested in terms of shear bond strength (SBS) and pullout resistance. To test the SBS of Light Bond, FlowTain, Filtek Supreme, and Tetric Flow were applied to the enamel surfaces of 15 teeth. Using matrices for application, each composite material was cured for 40 seconds and subjected to SBS testing. To test pullout resistance, 15 samples were prepared for each composite in which a wire was embedded; then the composite was cured for 40 seconds. Later, the ends of the wire were drawn up and tensile stress was applied until the resin failed. Findings were analyzed using an ANOVA and a Tukey HSD test. The SBS values for Light Bond, FlowTain, Filtek Supreme, and Tetric Flow were 19.0 +/- 10.9, 14.7 +/- 9.3, 22.4 +/- 16.3, and 16.8 +/- 11.8 MPa, respectively, and mean pullout values were 42.2 +/- 13.0, 24.0 +/- 6.9, 26.3 +/- 9.4, and 33.8 +/- 18.0 N, respectively. No statistically significant differences were found among the groups in terms of SBS (P > .05). On the other hand, Light Bond yielded significantly higher pullout values compared with the flowables Filtek Supreme and Flow-Tain (P < .01). However, there were no significant differences among the pullout values of flowables, nor between Light Bond and Tetric Flow (P > .05). The hypothesis is rejected. Light Bond yielded significantly higher pullout values compared with the flowables Filtek Supreme and FlowTain. However, flowable composites provided satisfactory SBS and wire pullout values, comparable to a standard orthodontic resin, and therefore can be used as an alternative for direct bonding of lingual retainers.

  12. Why copper is preferred over iron for oxygen activation and reduction in haem-copper oxidases.

    PubMed

    Bhagi-Damodaran, Ambika; Michael, Matthew A; Zhu, Qianhong; Reed, Julian; Sandoval, Braddock A; Mirts, Evan N; Chakraborty, Saumen; Moënne-Loccoz, Pierre; Zhang, Yong; Lu, Yi

    2017-03-01

    Haem-copper oxidase (HCO) catalyses the natural reduction of oxygen to water using a haem-copper centre. Despite decades of research on HCOs, the role of non-haem metal and the reason for nature's choice of copper over other metals such as iron remains unclear. Here, we use a biosynthetic model of HCO in myoglobin that selectively binds different non-haem metals to demonstrate 30-fold and 11-fold enhancements in the oxidase activity of Cu- and Fe-bound HCO mimics, respectively, as compared with Zn-bound mimics. Detailed electrochemical, kinetic and vibrational spectroscopic studies, in tandem with theoretical density functional theory calculations, demonstrate that the non-haem metal not only donates electrons to oxygen but also activates it for efficient O-O bond cleavage. Furthermore, the higher redox potential of copper and the enhanced weakening of the O-O bond from the higher electron density in the d orbital of copper are central to its higher oxidase activity over iron. This work resolves a long-standing question in bioenergetics, and renders a chemical-biological basis for the design of future oxygen-reduction catalysts.

  13. Structural Properties of Single-Strand Orthodontic Wires from a Proposed Alternative Standard Flexure Test.

    DTIC Science & Technology

    1984-01-01

    structural system the orthodontic appliance consists intraorally of bands or bonded pads and the attached brackets , the arch wires, the ligatures, and any...RD-Ali5B 994 STRUCTURAL PROPERTIES OF SINGLE-STRAND ORTHODONTIC i/i WIRES FROM A PROPOSED__(U) AIR FORCE INST OF TECH WRIGHT-PATTERSON RFB OH M L... Orthodontic Wires From A Proposed Alternative - Standard Flexure Test 6. PERPOMING o1. REPORT NUMBER AUTNOR(e) I. CONTRACT O& GRANT NUMUER(a) Marion L

  14. An experimental setup for the simultaneous measurement of thermoelectric power of two samples from 77 K to 500 K.

    PubMed

    Tripathi, T S; Bala, M; Asokan, K

    2014-08-01

    We report on an experimental setup for the simultaneous measurement of the thermoelectric power (TEP) of two samples in the temperature range from 77 K to 500 K using optimum electronic instruments. The setup consists of two rectangular copper bars in a bridge arrangement for sample mounting, two surface mount (SM) chip resistors for creating alternate temperature gradient, and a type E thermocouple in differential geometry for gradient temperature (ΔT) measurement across the samples. In addition, a diode arrangement has been made for the alternate heating of SM resistors using only one DC current source. The measurement accuracy of ΔT increases with the differential thermocouple arrangement. For the calibration of the setup, measurements of TEP on a high purity (99.99%) platinum wire and type K thermocouple wires Chromel and Alumel have been performed from 77 K to 500 K with respect to copper lead wires. Additionally, this setup can be utilized to calibrate an unknown sample against a sample of known absolute TEP.

  15. An experimental setup for the simultaneous measurement of thermoelectric power of two samples from 77 K to 500 K

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Tripathi, T. S.; Bala, M.; Asokan, K.

    2014-08-01

    We report on an experimental setup for the simultaneous measurement of the thermoelectric power (TEP) of two samples in the temperature range from 77 K to 500 K using optimum electronic instruments. The setup consists of two rectangular copper bars in a bridge arrangement for sample mounting, two surface mount (SM) chip resistors for creating alternate temperature gradient, and a type E thermocouple in differential geometry for gradient temperature (ΔT) measurement across the samples. In addition, a diode arrangement has been made for the alternate heating of SM resistors using only one DC current source. The measurement accuracy of ΔTmore » increases with the differential thermocouple arrangement. For the calibration of the setup, measurements of TEP on a high purity (99.99%) platinum wire and type K thermocouple wires Chromel and Alumel have been performed from 77 K to 500 K with respect to copper lead wires. Additionally, this setup can be utilized to calibrate an unknown sample against a sample of known absolute TEP.« less

  16. Relationship between energy deposition and shock wave phenomenon in an underwater electrical wire explosion

    NASA Astrophysics Data System (ADS)

    Han, Ruoyu; Zhou, Haibin; Wu, Jiawei; Qiu, Aici; Ding, Weidong; Zhang, Yongmin

    2017-09-01

    An experimental study of pressure waves generated by an exploding copper wire in a water medium is performed. We examined the effects of energy deposited at different stages on the characteristics of the resulting shock waves. In the experiments, a microsecond time-scale pulsed current source was used to explode a 300-μm-diameter, 4-cm-long copper wire with initial stored energies ranging from 500 to 2700 J. Our experimental results indicated that the peak pressure (4.5-8.1 MPa) and energy (49-287 J) of the shock waves did not follow a simple relationship with any electrical parameters, such as peak voltage or deposited energy. Conversely, the impulse had a quasi-linear relationship with the parameter Π. We also found that the peak pressure was mainly influenced by the energy deposited before separation of the shock wave front and the discharge plasma channel (DPC). The decay time constant of the pressure waveform was affected by the energy injection after the separation. These phenomena clearly demonstrated that the deposited energy influenced the expansion of the DPC and affected the shock wave characteristics.

  17. Perforated plates for cryogenic regenerators and method of fabrication

    DOEpatents

    Hendricks, J.B.

    1994-03-29

    Perforated plates having very small holes with a uniform diameter throughout the plate thickness are prepared by a [open quotes]wire drawing[close quotes] process in which a billet of sacrificial metal is disposed in an extrusion can of the plate metal, and the can is extruded and restacked repeatedly, converting the billet to a wire of the desired hole diameter. At final size, the rod is then sliced into wafers, and the wires are removed by selective etching. This process is useful for plate metals of interest for high performance regenerator applications, in particular, copper, niobium, molybdenum, erbium, and other rare earth metals. Er[sub 3]Ni, which has uniquely favorable thermophysical properties for such applications, may be incorporated in regions of the plates by providing extrusion cans containing erbium and nickel metals in a stacked array with extrusion cans of the plate metal, which may be copper. The array is heated to convert the erbium and nickel metals to Er[sub 3]Ni. Perforated plates having two sizes of perforations, one of which is small enough for storage of helium, are also disclosed. 10 figures.

  18. Perforated plates for cryogenic regenerators and method of fabrication

    DOEpatents

    Hendricks, John B.

    1994-01-01

    Perforated plates (10) having very small holes (14) with a uniform diameter throughout the plate thickness are prepared by a "wire drawing" process in which a billet of sacrificial metal is disposed in an extrusion can of the plate metal, and the can is extruded and restacked repeatedly, converting the billet to a wire of the desired hole diameter. At final size, the rod is then sliced into wafers, and the wires are removed by selective etching. This process is useful for plate metals of interest for high performance regenerator applications, in particular, copper, niobium, molybdenum, erbium, and other rare earth metals. Er.sub.3 Ni, which has uniquely favorable thermophysical properties for such applications, may be incorporated in regions of the plates by providing extrusion cans (20) containing erbium and nickel metals in a stacked array (53) with extrusion cans of the plate metal, which may be copper. The array is heated to convert the erbium and nickel metals to Er.sub.3 Ni. Perforated plates having two sizes of perforations (38, 42), one of which is small enough for storage of helium, are also disclosed.

  19. Copper(I)-catalyzed aryl bromides to form intermolecular and intramolecular carbon-oxygen bonds.

    PubMed

    Niu, Jiajia; Guo, Pengran; Kang, Juntao; Li, Zhigang; Xu, Jingwei; Hu, Shaojing

    2009-07-17

    A highly efficient Cu-catalyzed C-O bond-forming reaction of alcohol and aryl bromides has been developed. This transformation was realized through the use of copper(I) iodide as a catalyst, 8-hydroxyquinoline as a ligand, and K(3)PO(4) as a base. A variety of functionalized substrates were found to react under these reaction conditions to provide products in good to excellent yields.

  20. X-ray absorption spectral studies of copper (II) mixed ligand complexes

    NASA Astrophysics Data System (ADS)

    Soni, B.; Dar, Davood Ah; Shrivastava, B. D.; Prasad, J.; Srivastava, K.

    2014-09-01

    X-ray absorption spectra at the K-edge of copper have been studied in two copper mixed ligand complexes, one having tetramethyethylenediamine (tmen) and the other having tetraethyethylenediamine (teen) as one of the ligands. The spectra have been recorded at BL-8 dispersive extended X-ray absorption fine structure (EXAFS) beamline at the 2.5 GeV INDUS- 2 synchrotron, RRCAT, Indore, India. The data obtained has been processed using the data analysis program Athena. The energy of the K-absorption edge, chemical shift, edge-width and shift of the principal absorption maximum in the complexes have been determined and discussed. The values of these parameters have been found to be approximately the same in both the complexes indicating that the two complexes possess similar chemical environment around the copper metal atom. The chemical shift has been utilized to estimate effective nuclear charge on the absorbing atom. The normalized EXAFS spectra have been Fourier transformed. The position of the first peak in the Fourier transform gives the value of first shell bond length, which is shorter than the actual bond length because of energy dependence of the phase factors in the sine function of the EXAFS equation. This distance is thus the phase- uncorrected bond length. Bond length has also been determined by Levy's, Lytle's and Lytle, Sayers and Stern's (LSS) methods. The results obtained from LSS and the Fourier transformation methods are comparable with each other, since both are phase uncorrected bond lengths.

  1. Effects of copper ions on the characteristics of egg white gel induced by strong alkali.

    PubMed

    Shao, Yaoyao; Zhao, Yan; Xu, Mingsheng; Chen, Zhangyi; Wang, Shuzhen; Tu, Yonggang

    2017-09-01

    This study investigated the effects of copper ions on egg white (EW) gel induced by strong alkali. Changes in gel characteristics were examined through texture profile analysis, scanning electron microscopy (SEM), and chemical methods. The value of gel strength reached its maximum when 0.1% copper ions was added. However, the lowest cohesiveness values were observed at 0.1%. The springiness of gel without copper ions was significantly greater than the gel with copper ions added. SEM results illustrated that the low concentration of copper ions contributes to a dense and uniform gel network, and an open matrix was formed at 0.4%. The free and total sulphhydryl group content in the egg white protein gel significantly decreased with the increased copper. The increase of copper ions left the contents of ionic and hydrogen bonds basically unchanged, hydrophobic interaction presented an increasing trend, and the disulfide bond exhibited a completely opposite change. The change of surface hydrophobicity proved that the main binding force of copper induced gel was hydrophobic interaction. However, copper ions had no effect on the protein component of the gels. Generally, a low level of copper ions facilitates protein-protein association, which is involved in the characteristics of gels. Instead, high ionic strength had a negative effect on gels induced by strong alkali. © 2017 Poultry Science Association Inc.

  2. The structures of the crystalline phase and columnar mesophase of rhodium (II) heptanoate and of its binary mixture with copper (II) heptanoate probed by EXAFS

    NASA Astrophysics Data System (ADS)

    Inb-Elhaj, M.; Guillon, D.; Skoulios, A.; Maldivi, P.; Giroud-Godquin, A. M.; Marchon, J.-C.

    1992-12-01

    EXAFS was used to investigate the local structure of the polar spines of rhodium (II) soaps in the columnar liquid crystalline state. It was also used to ascertain the degree of blending of the cores in binary mixtures of rhodium (II) and copper (II) soaps. For the pure rhodium soaps, the columns are shown to result from the stacking of binuclear metal-metal bonded dirhodium tetracarboxylate units bonded to one another by apical ligation of the metal atom of each complex with one of the oxygen atoms of the adjacent molecule. Mixtures of rhodium (II) and copper (II) soaps give a hexagonal columnar mesophase in which pure rhodium and pure copper columns are randomly distributed.

  3. High resolution structural characterisation of laser-induced defect clusters inside diamond

    NASA Astrophysics Data System (ADS)

    Salter, Patrick S.; Booth, Martin J.; Courvoisier, Arnaud; Moran, David A. J.; MacLaren, Donald A.

    2017-08-01

    Laser writing with ultrashort pulses provides a potential route for the manufacture of three-dimensional wires, waveguides, and defects within diamond. We present a transmission electron microscopy study of the intrinsic structure of the laser modifications and reveal a complex distribution of defects. Electron energy loss spectroscopy indicates that the majority of the irradiated region remains as sp3 bonded diamond. Electrically conductive paths are attributed to the formation of multiple nano-scale, sp2-bonded graphitic wires and a network of strain-relieving micro-cracks.

  4. Copper nanowire coated carbon fibers as efficient substrates for detecting designer drugs using SERS.

    PubMed

    Halouzka, Vladimir; Halouzkova, Barbora; Jirovsky, David; Hemzal, Dusan; Ondra, Peter; Siranidi, Eirini; Kontos, Athanassios G; Falaras, Polycarpos; Hrbac, Jan

    2017-04-01

    Miniature Surface Enhanced Raman Scattering (SERS) sensors were fabricated by coating the carbon fiber microelectrodes with copper nanowires. The coating procedure, based on anodizing the copper wire in ultrapure water followed by cathodic deposition of the anode-derived material onto carbon fiber electrodes, provides a "clean" copper nanowire network. The developed miniature (10µm in diameter and 2mm in length) and nanoscopically rough SERS substrates are applicable in drug sensing, as shown by the detection and resolving of a range of seized designer drugs in trace amounts (microliter volumes of 10 -10 -10 -12 M solutions). The copper nanowire modified carbon microfiber substrates could also find further applications in biomedical and environmental sensing. Copyright © 2016 Elsevier B.V. All rights reserved.

  5. Raman spectroscopy as a tool to investigate the structure and electronic properties of carbon-atom wires

    PubMed Central

    Milani, Alberto; Tommasini, Matteo; Russo, Valeria; Li Bassi, Andrea; Lucotti, Andrea; Cataldo, Franco

    2015-01-01

    Summary Graphene, nanotubes and other carbon nanostructures have shown potential as candidates for advanced technological applications due to the different coordination of carbon atoms and to the possibility of π-conjugation. In this context, atomic-scale wires comprised of sp-hybridized carbon atoms represent ideal 1D systems to potentially downscale devices to the atomic level. Carbon-atom wires (CAWs) can be arranged in two possible structures: a sequence of double bonds (cumulenes), resulting in a 1D metal, or an alternating sequence of single–triple bonds (polyynes), expected to show semiconducting properties. The electronic and optical properties of CAWs can be finely tuned by controlling the wire length (i.e., the number of carbon atoms) and the type of termination (e.g., atom, molecular group or nanostructure). Although linear, sp-hybridized carbon systems are still considered elusive and unstable materials, a number of nanostructures consisting of sp-carbon wires have been produced and characterized to date. In this short review, we present the main CAW synthesis techniques and stabilization strategies and we discuss the current status of the understanding of their structural, electronic and vibrational properties with particular attention to how these properties are related to one another. We focus on the use of vibrational spectroscopy to provide information on the structural and electronic properties of the system (e.g., determination of wire length). Moreover, by employing Raman spectroscopy and surface enhanced Raman scattering in combination with the support of first principles calculations, we show that a detailed understanding of the charge transfer between CAWs and metal nanoparticles may open the possibility to tune the electronic structure from alternating to equalized bonds. PMID:25821689

  6. Microstructural studies of 35 degrees C copper Ni-Ti orthodontic wire and TEM confirmation of low-temperature martensite transformation.

    PubMed

    Brantley, William A; Guo, Wenhua; Clark, William A T; Iijima, Masahiro

    2008-02-01

    Previous temperature-modulated differential scanning calorimetry (TMDSC) study of nickel-titanium orthodontic wires revealed a large exothermic low-temperature peak that was attributed to transformation within martensitic NiTi. The purpose of this study was to use transmission electron microscopy (TEM) to verify this phase transformation in a clinically popular nickel-titanium wire, identify its mechanism and confirm other phase transformations found by TMDSC, and to provide detailed information about the microstructure of this wire. The 35 degrees C Copper nickel-titanium wire (Ormco) with cross-section dimensions of 0.016 in. x 0.022 in. used in the earlier TMDSC investigation was selected. Foils were prepared for TEM analyses by mechanical grinding, polishing, dimpling, ion milling and plasma cleaning. Standard bright-field and dark-field TEM images were obtained, along with convergent-beam electron diffraction patterns. A cryo-stage with the electron microscope (Phillips CM 200) permitted the specimen to be observed at -187, -45, and 50 degrees C, as well as at room temperature. Microstructures were also observed with an optical microscope and a scanning electron microscope. Room temperature microstructures had randomly oriented, elongated grains that were twinned. Electron diffraction patterns confirmed that phase transformations took place over temperature ranges previously found by TMDSC. TEM observations revealed a high dislocation density and fine-scale oxide particles, and that twinning is the mechanism for the low-temperature transformation in martensitic NiTi. TEM confirmed the low-temperature peak and other phase transformations observed by TMDSC, and revealed that twinning in martensite is the mechanism for the low-temperature peak. The high dislocation density and fine-scale oxide particles in the microstructure are the result of the wire manufacturing process.

  7. Magnetism in Mn-nanowires and -clusters as δ-doped layers in group IV semiconductors (Si, Ge)

    NASA Astrophysics Data System (ADS)

    Simov, K. R.; Glans, P.-A.; Jenkins, C. A.; Liberati, M.; Reinke, P.

    2018-01-01

    Mn doping of group-IV semiconductors (Si/Ge) is achieved by embedding nanostructured Mn-layers in group-IV matrix. The Mn-nanostructures are monoatomic Mn-wires or Mn-clusters and capped with an amorphous Si or Ge layer. The precise fabrication of δ-doped Mn-layers is combined with element-specific detection of the magnetic signature with x-ray magnetic circular dichroism. The largest moment (2.5 μB/Mn) is measured for Mn-wires with ionic bonding character and a-Ge overlayer cap; a-Si capping reduces the moment due to variations of bonding in agreement with theoretical predictions. The moments in δ-doped layers dominated by clusters is quenched with an antiferromagnetic component from Mn-Mn bonding.

  8. Superconducting Multilayer High-Density Flexible Printed Circuit Board for Very High Thermal Resistance Interconnections

    NASA Astrophysics Data System (ADS)

    de la Broïse, Xavier; Le Coguie, Alain; Sauvageot, Jean-Luc; Pigot, Claude; Coppolani, Xavier; Moreau, Vincent; d'Hollosy, Samuel; Knarosovski, Timur; Engel, Andreas

    2018-05-01

    We have successively developed two superconducting flexible PCBs for cryogenic applications. The first one is monolayer, includes 552 tracks (10 µm wide, 20 µm spacing), and receives 24 wire-bonded integrated circuits. The second one is multilayer, with one track layer between two shielding layers interconnected by microvias, includes 37 tracks, and can be interconnected at both ends by wire bonding or by connectors. The first cold measurements have been performed and show good performances. The novelty of these products is, for the first one, the association of superconducting materials with very narrow pitch and bonded integrated circuits and, for the second one, the introduction of a superconducting multilayer structure interconnected by vias which is, to our knowledge, a world-first.

  9. Length-dependent structural stability of linear monatomic Cu wires

    NASA Astrophysics Data System (ADS)

    Singh, Gurvinder; Kumar, Krishan; Singh, Baljinder; Moudgil, R. K.

    2018-05-01

    We present first-principle calculations based on density functional theory for the finite-length monatomic Cu atom linear wires. The structure and its stability with increasing wire length in terms of number of atoms (N) is determined. Interestingly, the bond length is found to exhibit an oscillatory structure (the so-called magic length phenomenon), with a qualitative change in oscillatory behavior as one moves from even N wire to odd N wire. The even N wires follow simple even-odd oscillations whereas odd N wires show a phase change at the half length of the wires. The stability of the wire structure, determined in terms of the wire formation energy, also contains even-odd oscillation as a function of wire length. However, the oscillations in formation energy reverse its phase after the wire length is increased beyond N=12. Our findings are seen to be qualitatively consistent with recent simulations for a similar class finite-length metal atom wires.

  10. Dislocation density of pure copper processed by accumulative roll bonding and equal-channel angular pressing

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Miyajima, Yoji, E-mail: miyajima.y.ab@m.titech.ac.jp; Okubo, Satoshi; Abe, Hiroki

    The dislocation density of pure copper fabricated by two severe plastic deformation (SPD) processes, i.e., accumulative roll bonding and equal-channel angular pressing, was evaluated using scanning transmission electron microscopy/transmission electron microscopy observations. The dislocation density drastically increased from ~ 10{sup 13} m{sup −} {sup 2} to about 5 × 10{sup 14} m{sup −} {sup 2}, and then saturated, for both SPD processes.

  11. Copper(I)-Catalyzed Chemoselective Coupling of Cyclopropanols with Diazoesters: Ring-Opening C-C Bond Formations.

    PubMed

    Zhang, Hang; Wu, Guojiao; Yi, Heng; Sun, Tong; Wang, Bo; Zhang, Yan; Dong, Guangbin; Wang, Jianbo

    2017-03-27

    Reported herein is an exceptional chemoselective ring-opening/C(sp 3 )-C(sp 3 ) bond formation in the copper(I)-catalyzed reaction of cyclopropanols with diazo esters. The conventional O-H insertion product is essentially suppressed by judicious choice of reaction conditions. DFT calculations provide insights into the reaction mechanism and the rationale for this unusual chemoselectivity. © 2017 Wiley-VCH Verlag GmbH & Co. KGaA, Weinheim.

  12. Measuring Earth's Magnetic Field Simply.

    ERIC Educational Resources Information Center

    Stewart, Gay B.

    2000-01-01

    Describes a method for measuring the earth's magnetic field using an empty toilet paper tube, copper wire, clear tape, a battery, a linear variable resistor, a small compass, cardboard, a protractor, and an ammeter. (WRM)

  13. Super-giant magnetoresistance at room-temperature in copper nanowires due to magnetic field modulation of potential barrier heights at nanowire-contact interfaces

    NASA Astrophysics Data System (ADS)

    Hossain, Md I.; Maksud, M.; Palapati, N. K. R.; Subramanian, A.; Atulasimha, J.; Bandyopadhyay, S.

    2016-07-01

    We have observed a super-giant (∼10 000 000%) negative magnetoresistance at 39 mT field in Cu nanowires contacted with Au contact pads. In these nanowires, potential barriers form at the two Cu/Au interfaces because of Cu oxidation that results in an ultrathin copper oxide layer forming between Cu and Au. Current flows when electrons tunnel through, and/or thermionically emit over, these barriers. A magnetic field applied transverse to the direction of current flow along the wire deflects electrons toward one edge of the wire because of the Lorentz force, causing electron accumulation at that edge and depletion at the other. This lowers the potential barrier at the accumulated edge and raises it at the depleted edge, causing a super-giant magnetoresistance at room temperature.

  14. Super-giant magnetoresistance at room-temperature in copper nanowires due to magnetic field modulation of potential barrier heights at nanowire-contact interfaces.

    PubMed

    Hossain, Md I; Maksud, M; Palapati, N K R; Subramanian, A; Atulasimha, J; Bandyopadhyay, S

    2016-07-29

    We have observed a super-giant (∼10 000 000%) negative magnetoresistance at 39 mT field in Cu nanowires contacted with Au contact pads. In these nanowires, potential barriers form at the two Cu/Au interfaces because of Cu oxidation that results in an ultrathin copper oxide layer forming between Cu and Au. Current flows when electrons tunnel through, and/or thermionically emit over, these barriers. A magnetic field applied transverse to the direction of current flow along the wire deflects electrons toward one edge of the wire because of the Lorentz force, causing electron accumulation at that edge and depletion at the other. This lowers the potential barrier at the accumulated edge and raises it at the depleted edge, causing a super-giant magnetoresistance at room temperature.

  15. High-performance flexible supercapacitors based on electrochemically tailored three-dimensional reduced graphene oxide networks.

    PubMed

    Purkait, Taniya; Singh, Guneet; Kumar, Dinesh; Singh, Mandeep; Dey, Ramendra Sundar

    2018-01-12

    A simple approach for growing porous electrochemically reduced graphene oxide (pErGO) networks on copper wire, modified with galvanostatically deposited copper foam is demonstrated. The as-prepared pErGO networks on the copper wire are directly used to fabricate solid-state supercapacitor. The pErGO-based supercapacitor can deliver a specific capacitance (C sp ) as high as 81±3 F g -1 at 0.5 A g -1 with polyvinyl alcohol/H 3 PO 4 gel electrolyte. The C sp per unit length and area are calculated as 40.5 mF cm -1 and 283.5 mF cm -2 , respectively. The shape of the voltammogram retained up to high scan rate of 100 V s -1 . The pErGO-based supercapacitor device exhibits noticeably high charge-discharge cycling stability, with 94.5% C sp retained even after 5000 cycles at 5 A g -1 . Nominal change in the specific capacitance, as well as the shape of the voltammogram, is observed at different bending angles of the device even after 5000 cycles. The highest energy density of 11.25 W h kg -1 and the highest power density of 5 kW kg -1 are also achieved with this device. The wire-based supercapacitor is scalable and highly flexible, which can be assembled with/without a flexible substrate in different geometries and bending angles for illustrating promising use in smart textile and wearable device.

  16. The Design, Fabrication and Characterization of a Transparent Atom Chip

    PubMed Central

    Chuang, Ho-Chiao; Huang, Chia-Shiuan; Chen, Hung-Pin; Huang, Chi-Sheng; Lin, Yu-Hsin

    2014-01-01

    This study describes the design and fabrication of transparent atom chips for atomic physics experiments. A fabrication process was developed to define the wire patterns on a transparent glass substrate to create the desired magnetic field for atom trapping experiments. An area on the chip was reserved for the optical access, so that the laser light can penetrate directly through the glass substrate for the laser cooling process. Furthermore, since the thermal conductivity of the glass substrate is poorer than other common materials for atom chip substrate, for example silicon, silicon carbide, aluminum nitride. Thus, heat dissipation copper blocks are designed on the front and back of the glass substrate to improve the electrical current conduction. The testing results showed that a maximum burnout current of 2 A was measured from the wire pattern (with a width of 100 μm and a height of 20 μm) without any heat dissipation design and it can increase to 2.5 A with a heat dissipation design on the front side of the atom chips. Therefore, heat dissipation copper blocks were designed and fabricated on the back of the glass substrate just under the wire patterns which increases the maximum burnout current to 4.5 A. Moreover, a maximum burnout current of 6 A was achieved when the entire backside glass substrate was recessed and a thicker copper block was electroplated, which meets most requirements of atomic physics experiments. PMID:24922456

  17. Contact and Length Dependent Effects in Single-Molecule Electronics

    NASA Astrophysics Data System (ADS)

    Hines, Thomas

    Understanding charge transport in single molecules covalently bonded to electrodes is a fundamental goal in the field of molecular electronics. In the past decade, it has become possible to measure charge transport on the single-molecule level using the STM break junction method. Measurements on the single-molecule level shed light on charge transport phenomena which would otherwise be obfuscated by ensemble measurements of groups of molecules. This thesis will discuss three projects carried out using STM break junction. In the first project, the transition between two different charge transport mechanisms is reported in a set of molecular wires. The shortest wires show highly length dependent and temperature invariant conductance behavior, whereas the longer wires show weakly length dependent and temperature dependent behavior. This trend is consistent with a model whereby conduction occurs by coherent tunneling in the shortest wires and by incoherent hopping in the longer wires. Measurements are supported with calculations and the evolution of the molecular junction during the pulling process is investigated. The second project reports controlling the formation of single-molecule junctions by means of electrochemically reducing two axial-diazonium terminal groups on a molecule, thereby producing direct Au-C covalent bonds in-situ between the molecule and gold electrodes. Step length analysis shows that the molecular junction is significantly more stable, and can be pulled over a longer distance than a comparable junction created with amine anchoring bonds. The stability of the junction is explained by the calculated lower binding energy associated with the direct Au-C bond compared with the Au-N bond. Finally, the third project investigates the role that molecular conformation plays in the conductance of oligothiophene single-molecule junctions. Ethyl substituted oligothiophenes were measured and found to exhibit temperature dependent conductance and transition voltage for molecules with between two and six repeat units. While the molecule with only one repeat unit shows temperature invariant behavior. Density functional theory calculations show that at higher temperatures the oligomers with multiple repeat units assume a more planar conformation, which increases the conjugation length and decreases the effective energy barrier of the junction.

  18. Studies of EXAFSSpectra using Copper (II) Schiff Base complexes and Determination of Bond lengths Using Synchrotron Radiation

    NASA Astrophysics Data System (ADS)

    Mishra, A.; Vibhute, V.; Ninama, S.; Parsai, N.; Jha, S. N.; Sharma, P.

    2016-10-01

    X-ray absorption fine structure (XAFS) at the K-edge of copper has been studied in some copper (II) complexes with substituted anilines like (2Cl, 4Br, 2NO2, 4NO2 and pure aniline) with o-PDA (orthophenylenediamine) as ligand. The X-ray absorption measurements have been performed at the recently developed BL-8 dispersive EXAFS beam line at 2.5 GeV Indus-2 Synchrotron Source at RRCAT, Indore, India. The data obtained has been processed using EXAFS data analysis program Athena.The graphical method gives the useful information about bond length and also the environment of the absorbing atom. The theoretical bond lengths of the complexes were calculated by using interactive fitting of EXAFS using fast Fourier inverse transformation (IFEFFIT) method. This method is also called as Fourier transform method. The Lytle, Sayers and Stern method and Levy's method have been used for determination of bond lengths experimentally of the studied complexes. The results of both methods have been compared with theoretical IFEFFIT method.

  19. Hydrogen bonding in basic copper salts: a spectroscopic study of malachite, Cu2(OH)2CO3, and brochantite, Cu4(OH)6SO4

    NASA Astrophysics Data System (ADS)

    Schmidt, M.; Lutz, H. D.

    1993-05-01

    Infrared and Raman spectra of the basic copper salts malachite, Cu2(OH)2CO3, and brochantite, Cu4(OH)6SO4, as well as of deuterated and 13C substituted samples are presented and discussed in terms of group theory and the hydrogen bonds present. The main results are that (i) the hydrogen donor strengths of the OH- ions are strongly increased due to the very great synergetic effect of the copper ions, (ii) the acceptor strengths of the H-bond acceptor groups (SO4 2-, CO3 2-, and OH- ions) are significantly modified by the linkage and coordination of the acceptor atoms — this complicates true assignment of the OH bands observed to the two and six different OH- ions present in malachite and brochantite, respectively -, and (iii) the Cu — O stretching modes at 430 590 cm-1 and 420 520 cm-1 for malachite and brochantite, respectively, exhibit strong, partially covalent Cu — O bonding.

  20. Influencing the arc and the mechanical properties of the weld metal in GMA-welding processes by additive elements on the wire electrode surface

    NASA Astrophysics Data System (ADS)

    Wesling, V.; Schram, A.; Müller, T.; Treutler, K.

    2016-03-01

    Under the premise of an increasing scarcity of raw materials and increasing demands on construction materials, the mechanical properties of steels and its joints are gaining highly important. In particular high- and highest-strength steels are getting in the focus of the research and the manufacturing industry. To the same extent, the requirements for filler metals are increasing as well. At present, these low-alloy materials are protected by a copper coating (<1μm) against corrosion. In addition, the coating realizes a good ohmic contact and good sliding properties between the welding machine and the wire during the welding process. By exchanging the copper with other elements it should be possible to change the mechanical properties of the weld metal and the arc stability during gas metal arc welding processes and keep the basic functions of the coating nearly untouched. On a laboratory scale solid wire electrodes with coatings of various elements and compounds such as titanium oxide were made and processed with a Gas Metal Arc Welding process. During the processing a different process behavior between the wire electrodes, coated and original, could be observed. The influences ranges from greater/shorter arc-length over increasing/decreasing droplets to larger/smaller arc foot point. Furthermore, the weld metal of the coated electrodes has significantly different mechanical and technological characteristics as the weld metal from the copper coated ground wire. The yield strength and tensile strength can be increased by up to 50%. In addition, the chemical composition of the weld metal was influenced by the application of coatings with layer thicknesses to 15 microns in the lower percentage range (up to about 3%). Another effect of the coating is a modified penetration. The normally occurring “argon finger” can be suppressed or enhanced by the choice of the coating. With the help of the presented studies it will be shown that Gas Metal Arc Welding processes are significantly affected by thin film coatings on solid wire electrodes for Gas Metal Arc welding. The influences are regarding the stability of the arc, the properties of the weld metal in terms of geometric expression, chemical composition and mechanical properties, the composition of the arc-plasma and the dynamics of the molten metal.

  1. Lingual straight wire method.

    PubMed

    Takemoto, Kyoto; Scuzzo, Giuseppe; Lombardo, L U C A; Takemoto, Y U I

    2009-12-01

    The mushroom arch-wire is mainly used in lingual orthodontic treatment but the complicated wire bending it requires affects both the treatment results and the time spent at the chair. The author proposes a new lingual straight wire method (LSW) in order to facilitate arch coordination and simplify the mechanics. The attention paid to the set-up model and bracket positioning and bonding plus the use of the new LSW method will also improve patient comfort. Copyright 2009 Collège Européen d'Orthodontie. Published by Elsevier Masson SAS.. All rights reserved.

  2. Microstructural evolution and micromechanical properties of gamma-irradiated Au ball bonds

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Yusoff, Wan Yusmawati Wan, E-mail: yusmawati@upnm.edu.my; Ismail, Roslina, E-mail: roslina.ismail@ukm.my; Jalar, Azman, E-mail: azmn@ukm.my

    2014-07-01

    The effect of gamma radiation on the mechanical and structural properties of gold ball bonds was investigated. Gold wires from thermosonic wire bonding were exposed to gamma rays from a Cobalt-60 source at a low dose (5 Gy). The load–depth curve of nanoindentation for the irradiated gold wire bond has an apparent staircase shape during loading compared to the as-received sample. The hardness of the specimens calculated from the nanoindentation shows an increase in value from 0.91 to 1.09 GPa for specimens after exposure. The reduced elastic modulus for irradiated specimens significantly increased as well, with values from 75.18 tomore » 98.55 GPa. The change in intrinsic properties due to gamma radiation was investigated using dual-focused ion beam and high-resolution transmission electron microscope analysis. The dual-focused ion beam and high-resolution transmission electron microscope images confirmed the changes in grain structure and the presence of dislocations. The scanning electron microscope micrographs of focused ion beam cross sections showed that the grain structure of the gold became elongated and smaller after exposure to gamma rays. Meanwhile, high-resolution transmission electron microscopy provided evidence that gamma radiation induced dislocation of the atomic arrangement. - Highlights: • Nanoindentation technique provides a detailed characterisation of Au ball bond. • P–h curve of irradiated Au ball bond shows an apparent pop-in event. • Hardness and reduced modulus increased after exposure. • Elongated and smaller grain structure in irradiated specimens • Prevalent presence of dislocations in the atomic arrangement.« less

  3. Radiofrequency power deposition near metallic wires during MR imaging: feasibility study using T1-weighted thermal imaging.

    PubMed

    Oulmane, F; Detti, V; Grenier, D; Perrin, E; Saint-Jalmes, H

    2007-01-01

    The presence of metallic conductors (implants, wires or catheters) is prohibited in MR imaging for safety purpose with respect to radiofrequency (RF) power deposition caused by RF excitation B1 field. This work describes the use of T1-weigthed MR imaging for estimating a thermal map around a metallic (copper) wire located in the center of a MR imaging unit during an imaging sequence. The experimental set up and the methodology used for capturing the elevation of temperature created by radiofrequency power deposition around the wire is presented. A proof of its efficiency to followup temperature elevation about 0,5 degrees C in a milimetric region of interest (pixel size: 1 x 1 mm2, slice thickness 5 mm) located around the wire is given, leading to further developments of MR imaging in presence of metallic implants, coils or catheters.

  4. DOE Office of Scientific and Technical Information (OSTI.GOV)

    Rupich, Martin W.; Sathyamurthy, Srivatsan; Fleshler, Steven

    We demonstrate a twofold increase in the in-field critical current of AMSC's standard 2G coil wire by irradiation with 18-MeV Au ions. The optimum pinning enhancement is achieved with a dose of 6 × 10 11 Au ions/cm 2. Although the 77 K, self-field critical current is reduced by about 35%, the in-field critical current (H//c) shows a significant enhancement between 4 and 50 K in fields > 1 T. The process was used for the roll-to-roll irradiation of AMSC's standard 46-mm-wide production coated conductor strips, which were further processed into standard copper laminated coil wire. The long-length wires showmore » the same enhancement as attained with short static irradiated samples. The roll-to-roll irradiation process can be incorporated in the standard 2G wire manufacturing, with no modifications to the current process. In conclusion, the enhanced performance of the wire will benefit rotating machine and magnet applications.« less

  5. DOE Office of Scientific and Technical Information (OSTI.GOV)

    Rupich, Martin W.; Sathyamurthy, Srivatsan; Fleshler, Steven

    We demonstrate a twofold increase in the in-field critical current of AMSC's standard 2G coil wire by irradiation with 18-MeV Au ions. The optimum pinning enhancement is achieved with a dose of 6 x 10(11) Au ions/cm(2). Although the 77 K, self-field critical current is reduced by about 35%, the in-field critical current (H//c) shows a significant enhancement between 4 and 50 K in fields > 1 T. The process was used for the roll-to-roll irradiation of AMSC's standard 46-mm-wide production coated conductor strips, which were further processed into standard copper laminated coil wire. The long-length wires show the samemore » enhancement as attained with short static irradiated samples. The roll-to-roll irradiation process can be incorporated in the standard 2G wire manufacturing, with no modifications to the current process. The enhanced performance of the wire will benefit rotating machine and magnet applications.« less

  6. Effect of fluoride prophylactic agents on the surface topography of NiTi and CuNiTi wires.

    PubMed

    Mane, Pratap P; Pawar, Renuka; Ganiger, Chanamallappa; Phaphe, Sandesh

    2012-05-01

    The aim of this study was to see the effect of topical fluoride on surface texture on nickel-titanium and copper-nickel-titanium orthodontic archwires. Preformed rectangular NiTi and CuNiTi wires were immersed in in fluoride solution and artificial saliva (control) for 90 minutes at 37°C. after immersion optical microscope was used to see the fluoride effect on the wire topography. The acidulated fluoride agents appeared to cause greater corrosive effects as compared to the neutral fluoride agents. The result suggest that using topical fluoride agents leads to corrosion of surface topography indirectly affecting the mechanical properties of the wire that will lead to prolonged orthodontic treatment. The use of topical fluoride agents has to be limited in patients with prolonged orthodontic treatment as it causes the corrosion of the NiTi and CuNiTi wires.

  7. Atmospheric Corrosivity at Australian and Overseas Airbases and Airports

    DTIC Science & Technology

    2014-07-01

    climatic conditions, the correlation between the GCIA and weight loss data from aluminium alloy coupons exposed in the open at 38 sites in the US...corrosivity. The test consists of an aluminium wire wrapped around a copper bolt exposed in the atmosphere for three months; the weight loss of the wire...Abbreviations/Acronyms AAC Army Aviation Centre AB Air Base ADF Australian Defence Force AFB Air Force Base Al aluminium ANGB Air National Guard Base

  8. Understanding and Prevention of Transient Voltages and Dielectric Breakdown in High Voltage Battery Systems

    DTIC Science & Technology

    2017-07-31

    as it is one faced every day as power systems engineers try to integrate batteries, solar panels, and wind turbines onto the already existing...Amendment-OOO l.ashx. [Accessed 10 Dec 2013] (7) "Copper Wire Resistance and Inductance Calculator", Ampbooks.com, 20 I 7. [Online]. Available: https...ampbooks.com/home/amplifier-calcu lators/ wire -inductance/. [Accessed: 21- May- 2017). (8) "What is Transient Voltage? - E lectronic Products

  9. How to create ball lightning

    NASA Technical Reports Server (NTRS)

    Golka, Robert K., Jr.

    1991-01-01

    Procedures are given on how to produce ball lightning. Necessary equipment includes a transformer of 150,000 watts capable of providing approximately 10,000 amperes at 15 volts, 60 cycles; thick one inch cables of stranded wire leading into a 3 by 4 by 1 foot plastic tank; a quarter inch thick 4 by 6 inch aluminum plate to be used as one of the discharge electrodes; and another electrode of heavy copper wire with the insulation stripped back 6 inches.

  10. Scaling induced performance challenges/limitations of on-chip metal interconnects and comparisons with optical interconnects

    NASA Astrophysics Data System (ADS)

    Kapur, Pawan

    The miniaturization paradigm for silicon integrated circuits has resulted in a tremendous cost and performance advantage. Aggressive shrinking of devices provides faster transistors and a greater functionality for circuit design. However, scaling induced smaller wire cross-sections coupled with longer lengths owing to larger chip areas, result in a steady deterioration of interconnects. This degradation in interconnect trends threatens to slow down the rapid growth along Moore's law. This work predicts that the situation is worse than anticipated. It shows that in the light of technology and reliability constraints, scaling induced increase in electron surface scattering, fractional cross section area occupied by the highly resistive barrier, and realistic interconnect operation temperature will lead to a significant rise in effective resistivity of modern copper based interconnects. We start by discussing various technology factors affecting copper resistivity. We, next, develop simulation tools to model these effects. Using these tools, we quantify the increase in realistic copper resistivity as a function of future technology nodes, under various technology assumptions. Subsequently, we evaluate the impact of these technology effects on delay and power dissipation of global signaling interconnects. Modern long on-chip wires use repeaters, which dramatically improves their delay and bandwidth. We quantify the repeated wire delays and power dissipation using realistic resistance trends at future nodes. With the motivation of reducing power, we formalize a methodology, which trades power with delay very efficiently for repeated wires. Using this method, we find that although the repeater power comes down, the total power dissipation due to wires is still found to be very large at future nodes. Finally, we explore optical interconnects as a possible substitute, for specific interconnect applications. We model an optical receiver and waveguides. Using this we assess future optical system performance. Finally, we compare the delay and power of future metal interconnects with that of optical interconnects for global signaling application. We also compare the power dissipation of the two approaches for an upper level clock distribution application. We find that for long on-chip communication links, optical interconnects have lower latencies than future metal interconnects at comparable levels of power dissipation.

  11. Improved transformer-winding method

    NASA Technical Reports Server (NTRS)

    Mclyman, W. T.

    1978-01-01

    Proposed technique using special bobbin and fixture to wind copper wire directly on core eliminates need core cut prior to assembly. Application of technique could result in production of quieter core with increased permeability and no localized heating.

  12. 24 CFR 3280.611 - Vents and venting.

    Code of Federal Regulations, 2010 CFR

    2010-04-01

    ... be DWV grade nylon or acetal; (iii) Spring shall be stainless steel wire, type 302; (iv) Sealing disc...) Materials—(1) Pipe. Vent piping shall be standard weight steel, wrought iron, brass, copper tube DWV, listed...

  13. 24 CFR 3280.611 - Vents and venting.

    Code of Federal Regulations, 2011 CFR

    2011-04-01

    ... be DWV grade nylon or acetal; (iii) Spring shall be stainless steel wire, type 302; (iv) Sealing disc...) Materials—(1) Pipe. Vent piping shall be standard weight steel, wrought iron, brass, copper tube DWV, listed...

  14. Iridium Interfacial Stack - IrIS

    NASA Technical Reports Server (NTRS)

    Spry, David

    2012-01-01

    Iridium Interfacial Stack (IrIS) is the sputter deposition of high-purity tantalum silicide (TaSi2-400 nm)/platinum (Pt-200 nm)/iridium (Ir-200 nm)/platinum (Pt-200 nm) in an ultra-high vacuum system followed by a 600 C anneal in nitrogen for 30 minutes. IrIS simultaneously acts as both a bond metal and a diffusion barrier. This bondable metallization that also acts as a diffusion barrier can prevent oxygen from air and gold from the wire-bond from infiltrating silicon carbide (SiC) monolithically integrated circuits (ICs) operating above 500 C in air for over 1,000 hours. This TaSi2/Pt/Ir/Pt metallization is easily bonded for electrical connection to off-chip circuitry and does not require extra anneals or masking steps. There are two ways that IrIS can be used in SiC ICs for applications above 500 C: it can be put directly on a SiC ohmic contact metal, such as Ti, or be used as a bond metal residing on top of an interconnect metal. For simplicity, only the use as a bond metal is discussed. The layer thickness ratio of TaSi2 to the first Pt layer deposited thereon should be 2:1. This will allow Si from the TaSi2 to react with the Pt to form Pt2Si during the 600 C anneal carried out after all layers have been deposited. The Ir layer does not readily form a silicide at 600 C, and thereby prevents the Si from migrating into the top-most Pt layer during future anneals and high-temperature IC operation. The second (i.e., top-most) deposited Pt layer needs to be about 200 nm to enable easy wire bonding. The thickness of 200 nm for Ir was chosen for initial experiments; further optimization of the Ir layer thickness may be possible via further experimentation. Ir itself is not easily wire-bonded because of its hardness and much higher melting point than Pt. Below the iridium layer, the TaSi2 and Pt react and form desired Pt2Si during the post-deposition anneal while above the iridium layer remains pure Pt as desired to facilitate easy and strong wire-bonding to the SiC chip circuitry.

  15. Engineered pinning landscapes for enhanced 2G coil wire

    DOE PAGES

    Rupich, Martin W.; Sathyamurthy, Srivatsan; Fleshler, Steven; ...

    2016-04-01

    We demonstrate a twofold increase in the in-field critical current of AMSC's standard 2G coil wire by irradiation with 18-MeV Au ions. The optimum pinning enhancement is achieved with a dose of 6 × 10 11 Au ions/cm 2. Although the 77 K, self-field critical current is reduced by about 35%, the in-field critical current (H//c) shows a significant enhancement between 4 and 50 K in fields > 1 T. The process was used for the roll-to-roll irradiation of AMSC's standard 46-mm-wide production coated conductor strips, which were further processed into standard copper laminated coil wire. The long-length wires showmore » the same enhancement as attained with short static irradiated samples. The roll-to-roll irradiation process can be incorporated in the standard 2G wire manufacturing, with no modifications to the current process. In conclusion, the enhanced performance of the wire will benefit rotating machine and magnet applications.« less

  16. Fabrication and properties of multifilamentary MgB 2 wires by in-situ powder-in-tube process

    NASA Astrophysics Data System (ADS)

    Wang, Q. Y.; Jiao, G. F.; Liu, G. Q.; Xiong, X. M.; Yan, S. C.; Zhang, P. X.; Sulpice, A.; Mossang, E.; Feng, Y.; Yan, G.

    2010-11-01

    We have fabricated the long TiC-doped MgB2 wires with 6 filaments by in-situ powder-in-tube method using Nb as the barrier and copper as the stabilizer. To improve the strength of wires, the Nb-core was used as the central filament. The transport engineering critical current density (Jce) of the samples sintered at different temperature were measured, which reaches 2.5 × 104 A/cm2 at 4.2 K, 5 T. 100 m MgB2 wires with different diameter were wound into coils and the transport critical current (Ic) of the coil were measured at 30 K in self-field. The Jce value 100 m coil achieves 1.1 × 104 A/cm2 in 1.2 mm wire. The reasons leading to the enhancement of high field Jce were discussed. The results show a good potential to fabricate high performance MgB2 wires and tapes at ambient pressure on an industrial scale.

  17. Experimental verification of the vaporization's contribution to the shock waves generated by underwater electrical wire explosion under micro-second timescale pulsed discharge

    NASA Astrophysics Data System (ADS)

    Han, Ruoyu; Zhou, Haibin; Wu, Jiawei; Clayson, Thomas; Ren, Hang; Wu, Jian; Zhang, Yongmin; Qiu, Aici

    2017-06-01

    This paper studies pressure waves generated by exploding a copper wire in a water medium, demonstrating the significant contribution of the vaporization process to the formation of shock waves. A test platform including a pulsed current source, wire load, chamber, and diagnostic system was developed to study the shock wave and optical emission characteristics during the explosion process. In the experiment, a total of 500 J was discharged through a copper wire load 0.2 mm in diameter and 4 cm in length. A water gap was installed adjacent to the load so that the current was diverted away from the load after breakdown occurred across the water gap. This allows the electrical energy injection into the load to be interrupted at different times and at different stages of the wire explosion process. Experimental results indicate that when the load was bypassed before the beginning of the vaporization phase, the measured peak pressure was less than 2.5 MPa. By contrast, the peak pressure increased significantly to over 6.5 MPa when the water gap broke down after the beginning of the vaporization phase. It was also found that when bypassing the load after the voltage peak, similar shock waves were produced to those from a non-bypassed load. However, the total optical emission of these bypassed loads was at least an order of magnitude smaller. These results clearly demonstrate that the vaporization process is vital to the formation of shock waves and the energy deposited after the voltage collapse may only have a limited effect.

  18. Copper-catalyzed synthesis of phenanthridine derivatives under an oxygen atmosphere starting from biaryl-2-carbonitriles and Grignard reagents.

    PubMed

    Zhang, Line; Ang, Gim Yean; Chiba, Shunsuke

    2010-08-20

    A copper-catalyzed synthesis of phenanthridine derivatives was developed starting from biaryl-2-carbonitriles and Grignard reagents. The present transformation is carried out by a sequence of nucleophilic addition of Grignard reagents to biaryl-2-carbonitriles to form N-H imines and their Cu-catalyzed C-N bond formation on the aromatic C-H bond, where molecular oxygen is a prerequisite to achieve the catalytic process.

  19. Fabrication of gas turbine water-cooled composite nozzle and bucket hardware employing plasma spray process

    DOEpatents

    Schilke, Peter W.; Muth, Myron C.; Schilling, William F.; Rairden, III, John R.

    1983-01-01

    In the method for fabrication of water-cooled composite nozzle and bucket hardware for high temperature gas turbines, a high thermal conductivity copper alloy is applied, employing a high velocity/low pressure (HV/LP) plasma arc spraying process, to an assembly comprising a structural framework of copper alloy or a nickel-based super alloy, or combination of the two, and overlying cooling tubes. The copper alloy is plamsa sprayed to a coating thickness sufficient to completely cover the cooling tubes, and to allow for machining back of the copper alloy to create a smooth surface having a thickness of from 0.010 inch (0.254 mm) to 0.150 inch (3.18 mm) or more. The layer of copper applied by the plasma spraying has no continuous porosity, and advantageously may readily be employed to sustain a pressure differential during hot isostatic pressing (HIP) bonding of the overall structure to enhance bonding by solid state diffusion between the component parts of the structure.

  20. Low-temperature direct copper-to-copper bonding enabled by creep on (111) surfaces of nanotwinned Cu

    PubMed Central

    Liu, Chien-Min; Lin, Han-Wen; Huang, Yi-Sa; Chu, Yi-Cheng; Chen, Chih; Lyu, Dian-Rong; Chen, Kuan-Neng; Tu, King-Ning

    2015-01-01

    Direct Cu-to-Cu bonding was achieved at temperatures of 150–250 °C using a compressive stress of 100 psi (0.69 MPa) held for 10–60 min at 10−3 torr. The key controlling parameter for direct bonding is rapid surface diffusion on (111) surface of Cu. Instead of using (111) oriented single crystal of Cu, oriented (111) texture of extremely high degree, exceeding 90%, was fabricated using the oriented nano-twin Cu. The bonded interface between two (111) surfaces forms a twist-type grain boundary. If the grain boundary has a low angle, it has a hexagonal network of screw dislocations. Such network image was obtained by plan-view transmission electron microscopy. A simple kinetic model of surface creep is presented; and the calculated and measured time of bonding is in reasonable agreement. PMID:25962757

  1. In vitro release of cupric ion from intrauterine devices: influence of frame, shape, copper surface area and indomethacin.

    PubMed

    Zhang, Shuangshuang; Li, Ying; Yu, Panpan; Chen, Tong; Zhou, Weisai; Zhang, Wenli; Liu, Jianping

    2015-02-01

    The release of cupric ion from copper intrauterine device (Cu-IUD) in human uterus is essential for contraception. However, excessive cupric ion will cause cytotoxic effect. In this paper, we investigated the influence of device characteristics (frame, copper surface area, shape, copper type and indomethacin) on copper release for the efficacy and adverse effects vary with IUD types which may correlate to their different release behaviors. Nine types of Cu-IUDs were selected and incubated in simulated uterine fluid. They were paired for comparison based on the device properties and the release of cupric ion was determined by flame atomic absorption spectrometer for about 160 days. The result showed that there was a burst release during the first month and the release rate tends to slow down and become steady afterwards. In addition, the copper release was mainly influenced by frame, indomethacin and copper type (copper wire and copper sleeve) while the shape variation had little effect on copper release throughout the experiment. Moreover, the influence of copper surface area was only noticeable during the first month. These findings were seldom reported before and may provide some useful information for the design of Cu-IUDs.

  2. Joining Tubes With Adhesive

    NASA Technical Reports Server (NTRS)

    Bateman, W. A.

    1984-01-01

    Cylindrical tubes joined together, end to end, by method employing adhesive, tapered ends, and spacing wires. Tapered joint between tubular structural elements provides pressure between bonding surfaces during adhesive curing. Spacing wires prevent adhesive from being scraped away when one element inserted in other. Method developed for assembling structural elements made of composite materials.

  3. 46 CFR 35.35-5 - Electrical bonding-TB/ALL.

    Code of Federal Regulations, 2013 CFR

    2013-10-01

    ... 46 Shipping 1 2013-10-01 2013-10-01 false Electrical bonding-TB/ALL. 35.35-5 Section 35.35-5 Shipping COAST GUARD, DEPARTMENT OF HOMELAND SECURITY TANK VESSELS OPERATIONS Cargo Handling § 35.35-5 Electrical bonding—TB/ALL. The use of a vessel/shore bonding cable or wire is permissible only if...

  4. 46 CFR 35.35-5 - Electrical bonding-TB/ALL.

    Code of Federal Regulations, 2014 CFR

    2014-10-01

    ... 46 Shipping 1 2014-10-01 2014-10-01 false Electrical bonding-TB/ALL. 35.35-5 Section 35.35-5 Shipping COAST GUARD, DEPARTMENT OF HOMELAND SECURITY TANK VESSELS OPERATIONS Cargo Handling § 35.35-5 Electrical bonding—TB/ALL. The use of a vessel/shore bonding cable or wire is permissible only if...

  5. Wire ablation dynamics model and its application to imploding wire arrays of different geometries.

    PubMed

    Esaulov, A A; Kantsyrev, V L; Safronova, A S; Velikovich, A L; Shrestha, I K; Williamson, K M; Osborne, G C

    2012-10-01

    The paper presents an extended description of the amplified wire ablation dynamics model (WADM), which accounts in a single simulation for the processes of wire ablation and implosion of a wire array load of arbitrary geometry and wire material composition. To investigate the role of wire ablation effects, the implosions of cylindrical and planar wire array loads at the university based generators Cobra (Cornell University) and Zebra (University of Nevada, Reno) have been analyzed. The analysis of the experimental data shows that the wire mass ablation rate can be described as a function of the current through the wire and some coefficient defined by the wire material properties. The aluminum wires were found to ablate with the highest rate, while the copper ablation is the slowest one. The lower wire ablation rate results in a higher inward velocity of the ablated plasma, a higher rate of the energy coupling with the ablated plasma, and a more significant delay of implosion for a heavy load due to the ablation effects, which manifest the most in a cylindrical array configuration and almost vanish in a single-planar array configuration. The WADM is an efficient tool suited for wire array load design and optimization in wide parameter ranges, including the loads with specific properties needed for the inertial confinement fusion research and laboratory astrophysics experiments. The data output from the WADM simulation can be used to simplify the radiation magnetohydrodynamics modeling of the wire array plasma.

  6. One kilometer (1 km) electric solar wind sail tether produced automatically.

    PubMed

    Seppänen, Henri; Rauhala, Timo; Kiprich, Sergiy; Ukkonen, Jukka; Simonsson, Martin; Kurppa, Risto; Janhunen, Pekka; Hæggström, Edward

    2013-09-01

    We produced a 1 km continuous piece of multifilament electric solar wind sail tether of μm-diameter aluminum wires using a custom made automatic tether factory. The tether comprising 90,704 bonds between 25 and 50 μm diameter wires is reeled onto a metal reel. The total mass of 1 km tether is 10 g. We reached a production rate of 70 m/24 h and a quality level of 1‰ loose bonds and 2‰ rebonded ones. We thus demonstrated that production of long electric solar wind sail tethers is possible and practical.

  7. Thermoelectric performance of various benzo-difuran wires

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Péterfalvi, Csaba G.; Grace, Iain; Manrique, Dávid Zs.

    2014-05-07

    Using a first principles approach to electron transport, we calculate the electrical and thermoelectrical transport properties of a series of molecular wires containing benzo-difuran subunits. We demonstrate that the side groups introduce Fano resonances, the energy of which is changing with the electronegativity of selected atoms in it. We also study the relative effect of single, double, or triple bonds along the molecular backbone and find that single bonds yield the highest thermopower, approximately 22 μV/K at room temperature, which is comparable with the highest measured values for single-molecule thermopower reported to date.

  8. Trialkylphosphine-stabilized copper(I) gallium(III) phenylchalcogenolate complexes: crystal structures and generation of ternary semiconductors by thermolysis.

    PubMed

    Kluge, Oliver; Krautscheid, Harald

    2012-06-18

    A series of organometallic trialkylphosphine-stabilized copper gallium phenylchalcogenolate complexes [(R(3)P)(m)Cu(n)Me(2-x)Ga(EPh)(n+x+1)] (R = Me, Et, (i)Pr, (t)Bu; E = S, Se, Te; x = 0, 1) has been prepared and structurally characterized by X-ray diffraction. From their molecular structures three groups of compounds can be distinguished: ionic compounds, ring systems, and cage structures. All these complexes contain one gallium atom bound to one or two methyl groups, whereas the number of copper atoms, and therefore the nuclearity of the complexes, is variable and depends mainly on size and amount of phosphine ligand used in synthesis. The Ga-E bonds are relatively rigid, in contrast to flexible Cu-E bonds. The lengths of the latter are controlled by the coordination number and steric influences. The Ga-E bond lengths depend systematically on the number of methyl groups bound to the gallium atom, with somewhat shorter bonds in monomethyl compounds compared to dimethyl compounds. Quantum chemical computations reproduce this trend and show furthermore that the rotation of one phenyl group around the Ga-E bond is a low energy process with two distinct minima, corresponding to two different conformations found experimentally. Mixtures of different types of chalcogen atoms on molecular scale are possible, and then ligand exchange reactions in solution lead to mixed site occupation. In thermogravimetric studies the complexes were converted into the ternary semiconductors CuGaE(2). The thermolysis reaction is completed at temperatures between 250 and 400 °C, typically with lower temperatures for the heavier chalcogens. Because of significant release of Me(3)Ga during the thermolysis process, and especially in case of copper excess in the precursor complexes, binary copper chalcogenides are obtained as additional thermolysis products. Quaternary semiconductors can be obtained from mixed chalcogen precursors.

  9. Effect of wire size on maxillary arch force/couple systems for a simulated high canine malocclusion.

    PubMed

    Major, Paul W; Toogood, Roger W; Badawi, Hisham M; Carey, Jason P; Seru, Surbhi

    2014-12-01

    To better understand the effects of copper nickel titanium (CuNiTi) archwire size on bracket-archwire mechanics through the analysis of force/couple distributions along the maxillary arch. The hypothesis is that wire size is linearly related to the forces and moments produced along the arch. An Orthodontic Simulator was utilized to study a simplified high canine malocclusion. Force/couple distributions produced by passive and elastic ligation using two wire sizes (Damon 0.014 and 0.018 inch) measured with a sample size of 144. The distribution and variation in force/couple loading around the arch is a complicated function of wire size. The use of a thicker wire increases the force/couple magnitudes regardless of ligation method. Owing to the non-linear material behaviour of CuNiTi, this increase is less than would occur based on linear theory as would apply for stainless steel wires. The results demonstrate that an increase in wire size does not result in a proportional increase of applied force/moment. This discrepancy is explained in terms of the non-linear properties of CuNiTi wires. This non-proportional force response in relation to increased wire size warrants careful consideration when selecting wires in a clinical setting. © 2014 British Orthodontic Society.

  10. High-voltage electrical burns due to copper theft - Case series.

    PubMed

    Braga, M J; Oliveira, I; Egipto, P; Silva, A

    2016-03-31

    Electrical burns are among the most devastating trauma inflicted on the human body. These burns have a higher morbidity, length of stay and a much higher risk of amputation than any other type of burn. Electrical burns affect mostly young, working males because they are more frequently the result of a work accident. However, possibly due to the worldwide economic crisis, we are experiencing a new phenomenon: the theft of high-voltage copper wiring.

  11. Self-Junctioned Copper Nanofiber Transparent Flexible Conducting Film via Electrospinning and Electroplating.

    PubMed

    An, Seongpil; Jo, Hong Seok; Kim, Do-Yeon; Lee, Hyun Jun; Ju, Byeong-Kwon; Al-Deyab, Salem S; Ahn, Jong-Hyun; Qin, Yueling; Swihart, Mark T; Yarin, Alexander L; Yoon, Sam S

    2016-09-01

    Self-junctioned copper nanofiber transparent flexible films are produced using electrospinning and electroplating processes that provide high performances of T = 97% and Rs = 0.42 Ω sq(-1) by eliminating junction resistance at wire intersections. The film remains conductive after being stretched by up to 770% (films with T = 76%) and after 1000 cycles of bending to a 5 mm radius. © 2016 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

  12. Copper Oxide Precipitates in NBS Standard Reference Material 482

    PubMed Central

    Windsor, Eric S.; Carlton, Robert A.; Gillen, Greg; Wight, Scott A.; Bright, David S.

    2002-01-01

    Copper oxide has been detected in the copper containing alloys of NBS Standard Reference Material (SRM) 482. This occurrence is significant because it represents heterogeneity within a standard reference material that was certified to be homogeneous on a micrometer scale. Oxide occurs as elliptically to spherically shaped precipitates whose size differs with alloy composition. The largest precipitates occur in the Au20-Cu80 alloy and range in size from submicrometer up to 2 μm in diameter. Precipitates are observed using light microscopy, electron microscopy, and secondary ion mass spectrometry (SIMS). SIMS has demonstrated that the precipitates are present within all the SRM 482 wires that contain copper. Only the pure gold wire is precipitate free. Initial results from the analysis of the Au20-Cu80 alloy indicate that the percentage of precipitates is less than 1 % by area. Electron probe microanalysis (EPMA) of large (2 μm) precipitates in this same alloy indicates that precipitates are detectable by EPMA and that their composition differs significantly from the certified alloy composition. The small size and low percentage of these oxide precipitates minimizes the impact that they have upon the intended use of this standard for electron probe microanalysis. Heterogeneity caused by these oxide precipitates may however preclude the use of this standard for automated EPMA analyses and other microanalysis techniques. PMID:27446759

  13. Tin Can Radiation Detector.

    ERIC Educational Resources Information Center

    Crull, John L.

    1986-01-01

    Provides instructions for making tin can radiation detectors from empty aluminum cans, aluminum foil, clear plastic, copper wire, silica gel, and fine, unwaxed dental floss put together with tape or glue. Also provides suggestions for activities using the detectors. (JN)

  14. Composite vascular scaffold combining electrospun fibers and physically-crosslinked hydrogel with copper wire-induced grooves structure.

    PubMed

    Liu, Yuanyuan; Jiang, Chen; Li, Shuai; Hu, Qingxi

    2016-08-01

    While the field of tissue engineered vascular grafts has greatly advanced, many inadequacies still exist. Successfully developed scaffolds require mechanical and structural properties that match native vessels and optimal microenvironments that foster cell integration, adhesion and growth. We have developed a small diameter, three-layered composite vascular scaffold which consists of electrospun fibers and physically-crosslinked hydrogel with copper wire-induced grooves by combining the electrospinning and dip-coating methods. Scaffold morphology and mechanics were assessed, quantified and compared to native vessels. Scaffolds were seeded with Human Umbilical Vein Endothelial Cells (HUVECs), cultured in vitro for 3 days and were evaluated for cell viability and morphology. The results showed that composite scaffolds had adjustable mechanical strength and favorable biocompatibility, which is important in the future clinical application of Tissue-engineered vascular grafts (TEVGs). Copyright © 2016 Elsevier Ltd. All rights reserved.

  15. A new active solder for joining electronic components

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    SMITH,RONALD W.; VIANCO,PAUL T.; HERNANDEZ,CYNTHIA L.

    Electronic components and micro-sensors utilize ceramic substrates, copper and aluminum interconnect and silicon. The joining of these combinations require pre-metallization such that solders with fluxes can wet such combinations of metals and ceramics. The paper will present a new solder alloy that can bond metals, ceramics and composites. The alloy directly wets and bonds in air without the use flux or premetallized layers. The paper will present typical processing steps and joint microstructures in copper, aluminum, aluminum oxide, aluminum nitride, and silicon joints.

  16. Copper-Catalyzed Synthesis of Tetrasubstituted Enynylboronates via Chemo-, Regio-, and Stereoselective Borylalkynylation.

    PubMed

    Han, Jung Tae; Yun, Jaesook

    2018-04-06

    An efficient, catalytic method for accessing tetrasubstituted enynylboronates has been established via copper-catalyzed chemo-, regio-, and stereoselective borylalkynylation of internal alkynes. In this protocol, a range of symmetrical and unsymmetrical internal alkynes with aryl, heteroaryl, and alkyl substituents afforded fully substituted enynylboron compounds in good yields and with high levels of regio- and stereoselectivity, up to a ratio of >20:1. The enynylboron products could be further utilized in transforming the C-B bond into C-C bonds by coupling reactions.

  17. [Co(NH3)6]3[Cu4(OH)(CO3)8].2H2O--a new carbonato-copper(II) anion stabilized by extensive hydrogen bonding.

    PubMed

    Abrahams, Brendan F; Haywood, Marissa G; Robson, Richard

    2004-04-21

    Addition of Co(NH3)6(3+) to aqueous solutions of Cu(II) in excess carbonate promotes the assembly of a new highly charged carbonato-copper(II) anion, [Cu4(OH)(CO3)8](9-), which contains an unusual mu4 hydroxo-bridged square Cu4 arrangement, stabilised in the crystal by no less than forty hydrogen bonds (< 3 Angstrom) to hexammine cations.

  18. Metal and silicate particles including nanoparticles are present in electronic cigarette cartomizer fluid and aerosol.

    PubMed

    Williams, Monique; Villarreal, Amanda; Bozhilov, Krassimir; Lin, Sabrina; Talbot, Prue

    2013-01-01

    Electronic cigarettes (EC) deliver aerosol by heating fluid containing nicotine. Cartomizer EC combine the fluid chamber and heating element in a single unit. Because EC do not burn tobacco, they may be safer than conventional cigarettes. Their use is rapidly increasing worldwide with little prior testing of their aerosol. We tested the hypothesis that EC aerosol contains metals derived from various components in EC. Cartomizer contents and aerosols were analyzed using light and electron microscopy, cytotoxicity testing, x-ray microanalysis, particle counting, and inductively coupled plasma optical emission spectrometry. The filament, a nickel-chromium wire, was coupled to a thicker copper wire coated with silver. The silver coating was sometimes missing. Four tin solder joints attached the wires to each other and coupled the copper/silver wire to the air tube and mouthpiece. All cartomizers had evidence of use before packaging (burn spots on the fibers and electrophoretic movement of fluid in the fibers). Fibers in two cartomizers had green deposits that contained copper. Centrifugation of the fibers produced large pellets containing tin. Tin particles and tin whiskers were identified in cartridge fluid and outer fibers. Cartomizer fluid with tin particles was cytotoxic in assays using human pulmonary fibroblasts. The aerosol contained particles >1 µm comprised of tin, silver, iron, nickel, aluminum, and silicate and nanoparticles (<100 nm) of tin, chromium and nickel. The concentrations of nine of eleven elements in EC aerosol were higher than or equal to the corresponding concentrations in conventional cigarette smoke. Many of the elements identified in EC aerosol are known to cause respiratory distress and disease. The presence of metal and silicate particles in cartomizer aerosol demonstrates the need for improved quality control in EC design and manufacture and studies on how EC aerosol impacts the health of users and bystanders.

  19. Practical copper(I)-catalysed amidation of aldehydes.

    PubMed

    Chang, Joyce Wei Wei; Ton, Thi My Uyen; Tania, Stefani; Taylor, Paul C; Chan, Philip Wai Hong

    2010-02-14

    The direct synthesis of amides by insertion into the C-H bond of aldehydes is shown to be a practical procedure through application of cheap, readily available catalysts generated in situ from copper(i) halides and pyridine.

  20. ON THE RELATIVE STABILITY OF ALUMINUM, TITANIUM, VANADIUM, IRON, AND COPPER TARTRATE COMPLEXES IN ALKALI MEDIA (in Russian)

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Pyatnitskii, I.V.; Kostyshina, A.P.

    1959-06-01

    The stability of aluminum, copper, iron, titunium, and vanadium tartrate complexes was determined using bond magnitudes as criteria (the ratio between the concentrations of complexed and free ions at a certain standard acid condition). A method is suggested for determining the ratio of the bonds combining the complexes of two metals. The partition constaats of aluminum, copper, iron(III), and vanadium hydroxyquinolinates between the aqueous solution and chloroform were 2.6 x 10/sup -33/, 7.3 x 10/sup -23/, 1.5 x 10/sup -37/, and 4.2 x 10/sup -23/, respectively. The relative stability of copper and iron turtrate complexes in alkali solution (pH 13)more » and aluminum, iron(III), titunium, and vanadium(IV) tartrate complexes in ammonium solution (pH 9.5) was determined. (R.V.J.)« less

  1. Comparison of elastic properties of nickel-titanium orthodontic archwires.

    PubMed

    Sarul, Michał; Kowala, Beata; Antoszewska, Joanna

    2013-01-01

    Cognizance of the mechanical properties of nickel-titanium archwires is necessary for the management of orthodontic therapy with fixed appliances. Acting on the periodontium with forces that are too heavy may lead to such complications as: pain, tooth root resorption and destruction of the alveolar bone and may also lead to retardation in tooth movement. The aim of the study was to assess the activation and deactivation forces of nickel-titanium archwires: Titanol Superelastic, Copper NiTi 35oC and NeoSentalloy. The examined material was 90 samples of Titanol Superelastic, Copper NiTi 35oC and NeoSentalloy with diameters of 0.016 and 0.016 x 0.022. All tests were carried out on the Zwick mechanical tests machine at a temperature of 30o C. In the group of archwires with diameters 0.016, the levels of deactivation forces were, respectively, from highest to lowest: Titanol Supertelastic, NeoSentalloy, Copper NiTi 35oC. In the group of rectangular archwires 0.016 x 0.022, the highest deactivation forces were released in Titanol Superelastic. With the high levels of deflection, 0.016 x 0.022 NeoSentalloy archwires released statistically significantly higher levels of force than 0.016 x 0.022 Copper NiTi 35o C, but this force diminished rapidly with lower deflection and below 3 mm of deflection, the highest forces were released by Copper NiTi 35o C. Testing the mechanical properties of the nickel-titanium wires of various diameters, it was found that round section wires release forces which fall within the range of optimal forces.

  2. Reduction of the "burst release" of copper ions from copper-based intrauterine devices by organic inhibitors.

    PubMed

    Alvarez, Florencia; Schilardi, Patricia L; de Mele, Monica Fernández Lorenzo

    2012-01-01

    The copper intrauterine device is a contraceptive method that is based on the release of copper ions from a copper wire. Immediately after insertion, the dissolution of copper in the uterine fluid is markedly higher ("burst release") than that necessary for contraception action, leading to a variety of harmful effects. Pretreatments with organic compounds [thiourea (TU) and purine (PU), 10(-4)-10(-2) M concentration range, 1- and 3-h immersion times] were tested. The dissolution of copper with and without pretreatments in TU and PU solutions was analyzed by conventional electrochemical techniques and surface analysis. Pretreatments in PU solutions reduced the initial corrosion rate of copper in simulated uterine solutions, with inhibitory efficiencies that depend on the PU concentration and on the immersion time assayed. Inhibitory efficiency values higher than 98% for pretreatments with ≥10(-3) M PU were found. Conversely, after TU pretreatments, a high copper release was measured. It was concluded that 10(-3) M PU pretreatment is a promising strategy able to reduce the "burst release" of copper and to ensure contraceptive action. Copyright © 2012 Elsevier Inc. All rights reserved.

  3. Influence of Bond Coat on HVOF-Sprayed Gradient Cermet Coating on Copper Alloy

    NASA Astrophysics Data System (ADS)

    Ke, Peng; Cai, Fei; Chen, Wanglin; Wang, Shuoyu; Ni, Zhenhang; Hu, Xiaohong; Li, Mingxi; Zhu, Guanghong; Zhang, Shihong

    2017-06-01

    Coatings are required on mold copper plates to prolong their service life through enhanced hardness, wear resistance, and oxidation resistance. In the present study, NiCr-30 wt.%Cr3C2 ceramic-metallic (cermet) layers were deposited by high velocity oxy-fuel (HVOF) spraying on different designed bond layers, including electroplated Ni, HVOF-sprayed NiCr, and double-decker Ni-NiCr. Annealing was also conducted on the gradient coating (GC) with NiCr bond layer to improve the wear resistance and adhesion strength. Coating microstructure was investigated by scanning electron microscopy and x-ray diffraction analysis. Mechanical properties including microhardness, wear resistance, and adhesion strength of the different coatings were evaluated systematically. The results show that the types of metallic bond layer and annealing process had a significant impact on the mechanical properties of the GCs. The GCs with electroplated Ni bond layer exhibited the highest adhesion strength (about 70 MPa). However, the GC with HVOF-sprayed NiCr bond layer exhibited better wear resistance. The wear resistance and adhesion strength of the coating with NiCr metallic bond layer were enhanced after annealing.

  4. In situ electron backscatter diffraction investigation of recrystallization in a copper wire.

    PubMed

    Brisset, François; Helbert, Anne-Laure; Baudin, Thierry

    2013-08-01

    The microstructural evolution of a cold drawn copper wire (reduction area of 38%) during primary recrystallization and grain growth was observed in situ by electron backscatter diffraction. Two thermal treatments were performed, and successive scans were acquired on samples undergoing heating from ambient temperature to a steady state of 200°C or 215°C. During a third in situ annealing, the temperature was continuously increased up to 600°C. Nuclei were observed to grow at the expense of the deformed microstructure. This growth was enhanced by the high stored energy difference between the nuclei and their neighbors (driving energy in recrystallization) and by the presence of high-angle grain boundaries of high mobility. In the early stages of growth, the nuclei twin and the newly created orientations continue to grow to the detriment of the strained copper. At high temperatures, the disappearance of some twins was evidenced by the migration of the incoherent twin boundaries. Thermal grooving of grain boundaries is observed at these high temperatures and affects the high mobile boundaries but tends to preserve the twin boundaries of lower energy. Thus, grooving may contribute to the twin vanishing.

  5. Processing and characterization of device solder interconnection and module attachment for power electronics modules

    NASA Astrophysics Data System (ADS)

    Haque, Shatil

    This research is focused on the processing of an innovative three-dimensional packaging architecture for power electronics building blocks with soldered device interconnections and subsequent characterization of the module's critical interfaces. A low-cost approach termed metal posts interconnected parallel plate structure (MPIPPS) was developed for packaging high-performance modules of power electronics building blocks (PEBB). The new concept implemented direct bonding of copper posts, not wire bonding of fine aluminum wires, to interconnect power devices as well as joining the different circuit planes together. We have demonstrated the feasibility of this packaging approach by constructing PEBB modules (consisting of Insulated Gate Bipolar Transistors (IGBTs), diodes, and a few gate driver elements and passive components). In the 1st phase of module fabrication with IGBTs with Si3N 4 passivation, we had successfully fabricated packaged devices and modules using the MPIPPS technique. These modules were tested electrically and thermally, and they operated at pulse-switch and high power stages up to 6kW. However, in the 2nd phase of module fabrication with polyimide passivated devices, we experienced significant yield problems due to metallization difficulties of these devices. The under-bump metallurgy scheme for the development of a solderable interface involved sputtering of Ti-Ni-Cu and Cr-Cu, and an electroless deposition of Zn-Ni-Au metallization. The metallization process produced excellent yield in the case of Si3N4 passivated devices. However, under the same metallization schemes, devices with a polyimide passivation exhibited inconsistent electrical contact resistance. We found that organic contaminants such as hydrocarbons remain in the form of thin monolayers on the surface, even in the case of as-received devices from the manufacturer. Moreover, in the case of polyimide passivated devices, plasma cleaning introduced a few carbon constituents on the surface, which was not observed in the case of Si3N4 passivated devices. X-Ray Photoelectron Spectroscopy (XPS) Spectra showed evidence of possible carbon contaminants, such as carbide (˜282.9eV) and graphite (˜284.3eV) on the surface at binding energies below the binding energy of the hydrocarbon peak (C 1s at 285eV). Whereas above the hydrocarbon peak energy level, carbon-nitrogen compounds, single bond carbon compounds (˜285.9eV) and double bond carbon compounds (˜288.5eV) were evident. The majority of the carbon composition on the pad surface was associated with hydrocarbons, which were hydrophobic in nature, thus making the device contact pad less wettable. (Abstract shortened by UMI.)

  6. DOE Office of Scientific and Technical Information (OSTI.GOV)

    Rodenbeck, Christopher T; Girardi, Michael

    Internal nodes of a constituent integrated circuit (IC) package of a multichip module (MCM) are protected from excessive charge during plasma cleaning of the MCM. The protected nodes are coupled to an internal common node of the IC package by respectively associated discharge paths. The common node is connected to a bond pad of the IC package. During MCM assembly, and before plasma cleaning, this bond pad receives a wire bond to a ground bond pad on the MCM substrate.

  7. Remote C-H Activation of Quinolines through Copper-Catalyzed Radical Cross-Coupling.

    PubMed

    Xu, Jun; Shen, Chao; Zhu, Xiaolei; Zhang, Pengfei; Ajitha, Manjaly J; Huang, Kuo-Wei; An, Zhongfu; Liu, Xiaogang

    2016-03-18

    Achieving site selectivity in carbon-hydrogen (C-H) functionalization reactions is a formidable challenge in organic chemistry. Herein, we report a novel approach to activating remote C-H bonds at the C5 position of 8-aminoquinoline through copper-catalyzed sulfonylation under mild conditions. Our strategy shows high conversion efficiency, a broad substrate scope, and good toleration with different functional groups. Furthermore, our mechanistic investigations suggest that a single-electron-transfer process plays a vital role in generating sulfonyl radicals and subsequently initiating C-S cross-coupling. Importantly, our copper-catalyzed remote functionalization protocol can be expanded for the construction of a variety of chemical bonds, including C-O, C-Br, C-N, C-C, and C-I. These findings provide a fundamental insight into the activation of remote C-H bonds, while offering new possibilities for rational design of drug molecules and optoelectronic materials requiring specific modification of functional groups. © 2016 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

  8. Blast Off into Space Science with Fuses.

    ERIC Educational Resources Information Center

    Bombaugh, Ruth

    2000-01-01

    Introduces an activity in which students build a fuse with steel, wood, light bulbs, copper wire, clay, and batteries. Uses the cross-age instructional approach to teach about the value of instructional time. Contains directions for building a fuse. (YDS)

  9. Copper-Catalyzed Cyanation of Heterocycle Carbon-Hydrogen Bonds

    PubMed Central

    Hien-Quang, Do; Daugulis, Olafs

    2010-01-01

    A method for regioselective cyanation of heterocycles has been developed. A number of aromatic heterocycles as well as azulene can be cyanated in reasonable to good yields by using a copper cyanide catalyst and an iodine oxidant. PMID:20441204

  10. Maxillary molar derotation and distalization by using a nickel-titanium wire fabricated on a setup model

    PubMed Central

    Jung, Jong Moon; Wi, Young Joo; Koo, Hyun Mo; Kim, Min Ji

    2017-01-01

    The purpose of this article is to introduce a simple appliance that uses a setup model and a nickel-titanium (Ni-Ti) wire for correcting the mesial rotation and drift of the permanent maxillary first molar. The technique involves bonding a Ni-Ti wire to the proper position of the target tooth on a setup model, followed by the fabrication of the transfer cap for indirect bonding and its transfer to the patient's teeth. This appliance causes less discomfort and provides better oral hygiene for the patients than do conventional appliances such as the bracket, pendulum, and distal jet. The treatment time is also shorter with the new appliance than with full-fixed appliances. Moreover, the applicability of the new appliance can be expanded to many cases by using screws or splinting with adjacent teeth to improve anchorage. PMID:28670568

  11. Method for making an elastomeric member with end pieces

    DOEpatents

    Hoppie, L.O.; McNinch, J.H. Jr.; Nowell, G.C.

    1984-10-23

    A molding process is described for molding an elongated elastomeric member with wire mesh sleeves bonded to the ends. A molding preform of elastomeric material is positioned within a seamless mold cylinder, and the open ends of the wire mesh sleeves are mounted to end plug assemblies slidably received into the mold cylinder and positioned against the ends of the preform. A specialized profile is formed into surfaces of the respective end plug assemblies and by heating of the mold, the ends of the elastomeric preform are molded to the profile, as well as bonded to the reinforcing wire mesh sleeves. Vacuum is applied to the interior of the mold to draw outgassing vapors through relief spaces there through. The completed elastomeric member is removed from the mold cylinder by stretching, the consequent reduction in diameter enabling ready separation from the mold cylinder and removal thereof. 9 figs.

  12. Maxillary molar derotation and distalization by using a nickel-titanium wire fabricated on a setup model.

    PubMed

    Jung, Jong Moon; Wi, Young Joo; Koo, Hyun Mo; Kim, Min Ji; Chun, Youn Sic

    2017-07-01

    The purpose of this article is to introduce a simple appliance that uses a setup model and a nickel-titanium (Ni-Ti) wire for correcting the mesial rotation and drift of the permanent maxillary first molar. The technique involves bonding a Ni-Ti wire to the proper position of the target tooth on a setup model, followed by the fabrication of the transfer cap for indirect bonding and its transfer to the patient's teeth. This appliance causes less discomfort and provides better oral hygiene for the patients than do conventional appliances such as the bracket, pendulum, and distal jet. The treatment time is also shorter with the new appliance than with full-fixed appliances. Moreover, the applicability of the new appliance can be expanded to many cases by using screws or splinting with adjacent teeth to improve anchorage.

  13. Interfacial characterization of SLM parts in multi-material processing: Metallurgical diffusion between 316L stainless steel and C18400 copper alloy

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Liu, Z.H., E-mail: AZHLIU@ntu.edu.sg; Zhang, D.Q., E-mail: ZHANGDQ@ntu.edu.sg; Sing, S.L., E-mail: SING0011@e.ntu.edu.sg

    2014-08-15

    Multi-material processing in selective laser melting using a novel approach, by the separation of two different materials within a single dispensing coating system was investigated. 316L stainless steel and UNS C18400 Cu alloy multi-material samples were produced using selective laser melting and their interfacial characteristics were analyzed using focused ion beam, scanning electron microscopy, energy dispersive spectroscopy and electron back scattered diffraction techniques. A substantial amount of Fe and Cu element diffusion was observed at the bond interface suggesting good metallurgical bonding. Quantitative evidence of good bonding at the interface was also obtained from the tensile tests where the fracturemore » was initiated at the copper region. Nevertheless, the tensile strength of steel/Cu SLM parts was evaluated to be 310 ± 18 MPa and the variation in microhardness values was found to be gradual along the bonding interface from the steel region (256 ± 7 HV{sub 0.1}) to the copper region (72 ± 3 HV{sub 0.1}). - Highlights: • Multi-material processing was successfully implemented and demonstrated in SLM. • Bi-metallic laminates of steel/Cu were successfully produced with the SLM process. • A substantial amount of Fe and Cu diffusion was observed at the bond interface. • Good metallurgical bonding was obtained at the interface of the steel/Cu laminates. • Highly refined microstructure was obtained due to rapid solidification in SLM.« less

  14. Fabricating and strengthening the carbon nanotube/copper composite fibers with high strength and high electrical conductivity

    NASA Astrophysics Data System (ADS)

    Han, Baoshuai; Guo, Enyu; Xue, Xiang; Zhao, Zhiyong; Li, Tiejun; Xu, Yanjin; Luo, Liangshun; Hou, Hongliang

    2018-05-01

    Combining the excellent properties of carbon nanotube (CNT) and copper, CNT/Cu composite fibers were fabricated by physical vapor deposition (PVD) and rolling treatment. Dense and continuous copper film (∼2 μm) was coated on the surface of the CNT fibers by PVD, and rolling treatment was adopt to strengthen the CNT/Cu composite fibers. After the rolling treatment, the defects between the Cu grains and the CNT bundles were eliminated, and the structure of both the copper film and the core CNT fibers were optimized. The rolled CNT/Cu composite fibers possess high tensile effective strength (1.01 ± 0.13 GPa) and high electrical conductivity ((2.6 ± 0.3) × 107 S/m), and thus, this material may become a promising wire material.

  15. Low temperature wafer-level bonding for hermetic packaging of 3D microsystems

    NASA Astrophysics Data System (ADS)

    Tan, C. S.; Fan, J.; Lim, D. F.; Chong, G. Y.; Li, K. H.

    2011-07-01

    Metallic copper-copper (Cu-Cu) thermo-compression bonding, oxide-oxide (SiO2-SiO2) fusion bonding and silicon-silicon (Si-Si) direct bonding are investigated for potential application as hermetic seal in 3D microsystem packaging. Cavities are etched to a volume of 1.4 × 10-3 cm3 in accordance with the MIL-STD-883E standard prescribed for microelectronics packaging. In the case of metal bonding, a clean Cu layer with a thickness of 300 nm and a Ti barrier layer with an underlying thickness of 50 nm are used. The wafer pair is bonded at 300 °C under the application of a bonding force of 5500 N for 1 h. On the other hand, Si-Si bonding and SiO2-SiO2 bonding are initiated at room ambient after surface activation, followed by annealing in inert ambient at 300 °C for 1 h. The bonded cavities are stored in a helium bomb chamber and the leak rate is measured with a mass spectrometer. An excellent helium leak rate below 5 × 10-9 atm cm3 s-1 is detected for all cases and this is at least ten times better than the reject limit.

  16. Biocompatibility and bond degradation of poly-acrylic acid coated copper iodide-adhesives.

    PubMed

    ALGhanem, Adi; Fernandes, Gabriela; Visser, Michelle; Dziak, Rosemary; Renné, Walter G; Sabatini, Camila

    2017-09-01

    To investigate the effect of poly-acrylic acid (PAA) copper iodide (CuI) adhesives on bond degradation, tensile strength, and biocompatibility. PAA-CuI particles were incorporated into Optibond XTR, Optibond Solo and XP Bond in 0.1 and 0.5mg/ml. Clearfil SE Protect, an MDPB-containing adhesive, was used as control. The adhesives were applied to human dentin, polymerized and restored with composite in 2mm-increments. Resin-dentin beams (0.9±0.1mm 2 ) were evaluated for micro-tensile bond strength after 24h, 6 months and 1year. Hourglass specimens (10×2×1mm) were evaluated for ultimate tensile strength (UTS). Cell metabolic function of human gingival fibroblast cells exposed to adhesive discs (8×1mm) was assessed with MTT assay. Copper release from adhesive discs (5×1mm) was evaluated with UV-vis spectrophotometer after immersion in 0.9% NaCl for 1, 3, 5, 7, 10, 14, 21 and 30 days. SEM, EDX and XRF were conducted for microstructure characterization. XTR and Solo did not show degradation when modified with PAA-CuI regardless of the concentration. The UTS for adhesives containing PAA-CuI remained unaltered relative to the controls. The percent viable cells were reduced for Solo 0.5mg/ml and XP 0.1 or 0.5mg/ml PAA-CuI. XP demonstrated the highest ion release. For all groups, the highest release was observed at days 1 and 14. PAA-CuI particles prevented the bond degradation of XTR and Solo after 1year without an effect on the UTS for any adhesive. Cell viability was affected for some adhesives. A similar pattern of copper release was demonstrated for all adhesives. Copyright © 2017. Published by Elsevier Ltd.

  17. Di-μ-acetato-bis­[(acetato-κ2 O,O′)bis­(iso­nicotinamide-κN)copper(II)

    PubMed Central

    Perec, Mireille; Baggio, Ricardo

    2010-01-01

    The title centrosymmetric bimetallic complex, [Cu2(C2H3O2)4(C6H6N2O)4], is composed of two copper(II) cations, four acetate anions and four isonicotinamide (INA) ligands. The asymmetric unit contains one copper cation to which two acetate units bind asymmetrically; one of the Cu—O distances is rather long [2.740 (2) Å], almost at the limit of coordination. These Cu—O bonds define an equatorial plane to which the Cu—N bonds to the INA ligands are almost perpendicular, the Cu—N vectors subtending angles of 2.4 (1) and 2.3 (1)° to the normal to the plane. The metal coordination geometry can be described as a slightly distorted trigonal bipyramid if the extremely weak Cu—O bond is disregarded, or as a highly distorted square bipyramid if it is not. The double acetate bridge between the copper ions is not coplanar with the CuO4 equatorial planes, the dihedral angle between the (O—C—O)2 and O—Cu—O groups being 34.3 (1)°, resulting in a sofa-like conformation for the 8-member bridging loop. In the crystal, N—H⋯O hydrogen bonds occur, some of which generate a head-to tail-linkage between INA units, giving raise to chains along [101]; the remaining ones make inter-chain contacts, defining a three-dimensional network. There are in addition a number of C—H⋯O bonds involving aromatic H atoms. Probably due to steric hindrance, the aromatic rings are not involved in significant π⋯π inter­actions. PMID:21580223

  18. A novel monolithic piezoelectric actuated flexure-mechanism based wire clamp for microelectronic device packaging.

    PubMed

    Liang, Cunman; Wang, Fujun; Tian, Yanling; Zhao, Xingyu; Zhang, Hongjie; Cui, Liangyu; Zhang, Dawei; Ferreira, Placid

    2015-04-01

    A novel monolithic piezoelectric actuated wire clamp is presented in this paper to achieve fast, accurate, and robust microelectronic device packaging. The wire clamp has compact, flexure-based mechanical structure and light weight. To obtain large and robust jaw displacements and ensure parallel jaw grasping, a two-stage amplification composed of a homothetic bridge type mechanism and a parallelogram leverage mechanism was designed. Pseudo-rigid-body model and Lagrange approaches were employed to conduct the kinematic, static, and dynamic modeling of the wire clamp and optimization design was carried out. The displacement amplification ratio, maximum allowable stress, and natural frequency were calculated. Finite element analysis (FEA) was conducted to evaluate the characteristics of the wire clamp and wire electro discharge machining technique was utilized to fabricate the monolithic structure. Experimental tests were carried out to investigate the performance and the experimental results match well with the theoretical calculation and FEA. The amplification ratio of the clamp is 20.96 and the working mode frequency is 895 Hz. Step response test shows that the wire clamp has fast response and high accuracy and the motion resolution is 0.2 μm. High speed precision grasping operations of gold and copper wires were realized using the wire clamper.

  19. High-voltage electrical burns due to copper theft – Case series

    PubMed Central

    Braga, M.J.; Oliveira, I.; Egipto, P.; Silva, A.

    2016-01-01

    Summary Electrical burns are among the most devastating trauma inflicted on the human body. These burns have a higher morbidity, length of stay and a much higher risk of amputation than any other type of burn. Electrical burns affect mostly young, working males because they are more frequently the result of a work accident. However, possibly due to the worldwide economic crisis, we are experiencing a new phenomenon: the theft of high-voltage copper wiring. PMID:27857650

  20. Manufacturing Methods for Process Effects on Aluminum Casting Allowables

    DTIC Science & Technology

    1985-03-01

    silicon ingot (25% Si) 4 . Copper as copper shot 5. Manganese as aluminum manganese ingot (10% Mn) 6 . Titanium and boron as titanium -boron wire 7. Silver...in stock form 4 . Silver in granule form. 5. Manganese (10 percent) in button form 6 . 201 refining salt ( Titanium -Boron) Melt chemistry is adjusted to...FAFB, OH 45433 4 . PERFORIN41N ORGANIZATION REPORT NUMBER(S) 5. MONITORING ORGANIZATION REPORT NUMSER(S) NOR 85-119 AFWAL-TR-.84- 4 117 I 6 *. NAME OF

  1. Molecular and Electronic Structure of Thin Films of Protoporphyrin(IX)Fe(III)C1

    DTIC Science & Technology

    1991-11-10

    Union Carbide). Electrical contact to the back side of the HOPG sample was made with a copper wire and conductive epoxy (Epo-tek H20E, Epoxy Technology...analysis of the contrast in STM images of copper phthalocyanine [641 and by Zheng and Tsong in their analysis of resonant tunneling via tip-localized...Electroanal. Chem. 1980, 110, 369. 71. Makinen, M.W.; Churg A.K. Iron Porphyri ns-P art One; Lever, A.B.P.; Gray, H.B., Eds.; Physical Bioinorganic

  2. Methods of measurement for semiconductor materials, process control, and devices

    NASA Technical Reports Server (NTRS)

    Bullis, W. M. (Editor)

    1972-01-01

    Activities directed toward the development of methods of measurement for semiconductor materials, process control, and devices are described. Accomplishments include the determination of the reasons for differences in measurements of transistor delay time, identification of an energy level model for gold-doped silicon, and the finding of evidence that it does not appear to be necessary for an ultrasonic bonding tool to grip the wire and move it across the substrate metallization to make the bond. Work is continuing on measurement of resistivity of semiconductor crystals; study of gold-doped silicon; development of the infrared response technique; evaluation of wire bonds and die attachment; measurement of thermal properties of semiconductor devices, delay time, and related carrier transport properties in junction devices, and noise properties of microwave diodes; and characterization of silicon nuclear radiation detectors.

  3. Synthesis and characterization of conducting polyaniline-copper composites.

    PubMed

    Liu, Aijie; Bac, Luong Huu; Kim, Ji-Soon; Kim, Byoung-Kee; Kim, Jin-Chun

    2013-11-01

    Conducting polymer composites have many interesting physical properties and important application potentials. Suitable combinations of metal nanoparticles with conductive polymers can result in composite materials having unique physical and chemical properties that can have wide application potential in diverse areas. In this work, copper nanoparticles were fabricated by electrical explosion of wire (EEW) in solution of polyacrylic acid (PAA) and ethanol. Conductive polyaniline-copper (PANI-Cu) composites have been synthesized by in-situ polymerization of aniline in the fabricated copper suspension. Optical absorption in the UV-visible region of these suspensions was measured in the range of 200-900 nm. Morphology and structure of the composites were characterized by scanning electron microscopy (SEM), X-ray diffraction (XRD) and Fourier-transform infrared spectra (FTIR). Pure copper nanoparticles were uniformly dispersed into the polymer matrix. Thermal stability of the composites was characterized by thermogravimetric analysis (TGA). Electrical conductivity measurements indicated that the conductivity of the composites was higher than that of pure polyaniline and increased with increasing content of copper.

  4. Investigation of Electrostatic Charge in Hose Lines

    DTIC Science & Technology

    2006-10-01

    of the system. A INSULATORINSULATOR Ir1 Q Q dH vH A INSULATORINSULATOR Ir2 Q dm dl 2 vm LmLH S1 S2 S3EXTERNAL WIRE BRAID ON HOSE vl 2vm dm Lm dl...sizes of fuel hoses , including hoses with and without integrally bonded grounding wire braid ; (4) Different lengths of hose test sections; (5...Different earth grounding contact conditions along the hose test section, such as: (i) Complete insulation from the ground; (ii) Wire braid conductor along

  5. Bulk substrate porosity verification by applying Monte Carlo modeling and Castaing's formula using energy-dispersive x-rays

    NASA Astrophysics Data System (ADS)

    Yung, Lai Chin; Fei, Cheong Choke; Mandeep, Jit Singh; Amin, Nowshad; Lai, Khin Wee

    2015-11-01

    The leadframe fabrication process normally involves additional thin-metal layer plating on the bulk copper substrate surface for wire bonding purposes. Silver, tin, and copper flakes are commonly adopted as plating materials. It is critical to assess the density of the plated metal layer, and in particular to look for porosity or voids underneath the layer, which may reduce the reliability during high-temperature stress. A fast, reliable inspection technique is needed to assess the porosity or void weakness. To this end, the characteristics of x-rays generated from bulk samples were examined using an energy-dispersive x-ray (EDX) detector to examine the porosity percentage. Monte Carlo modeling was integrated with Castaing's formula to verify the integrity of the experimental data. Samples with different porosity percentages were considered to test the correlation between the intensity of the collected x-ray signal and the material density. To further verify the integrity of the model, conventional cross-sectional samples were also taken to observe the porosity percentage using Image J software measurement. A breakthrough in bulk substrate assessment was achieved by applying EDX for the first time to nonelemental analysis. The experimental data showed that the EDX features were not only useful for elemental analysis, but also applicable to thin-film metal layer thickness measurement and bulk material density determination. A detailed experiment was conducted using EDX to assess the plating metal layer and bulk material porosity.

  6. KommonBase - A precise direct bonding system for labial fixed appliances.

    PubMed

    Miyashita, Wataru; Komori, Akira; Takemoto, Kyoto

    2017-09-01

    "KommonBase" is a system designed to customize the bracket base by means of an extended resin base covering the tooth. This system enables precise bracket placement and accurate fit on teeth. Moreover, KommonBase can be easily fabricated in a laboratory and bonded on each tooth using simple clinical procedures. Straight-wire treatment without wire bending was achieved in the clinical cases presented in this article using the KommonBase system for a labial fixed appliance. The application of KommonBase to the vestibular side enables efficient orthodontic treatment using simple mechanics. Copyright © 2017 CEO. Published by Elsevier Masson SAS. All rights reserved.

  7. Integrated Inductors for RF Transmitters in CMOS/MEMS Smart Microsensor Systems

    PubMed Central

    Kim, Jong-Wan; Takao, Hidekuni; Sawada, Kazuaki; Ishida, Makoto

    2007-01-01

    This paper presents the integration of an inductor by complementary metal-oxide-semiconductor (CMOS) compatible processes for integrated smart microsensor systems that have been developed to monitor the motion and vital signs of humans in various environments. Integration of radio frequency transmitter (RF) technology with complementary metal-oxide-semiconductor/micro electro mechanical systems (CMOS/MEMS) microsensors is required to realize the wireless smart microsensors system. The essential RF components such as a voltage controlled RF-CMOS oscillator (VCO), spiral inductors for an LC resonator and an integrated antenna have been fabricated and evaluated experimentally. The fabricated RF transmitter and integrated antenna were packaged with subminiature series A (SMA) connectors, respectively. For the impedance (50 Ω) matching, a bonding wire type inductor was developed. In this paper, the design and fabrication of the bonding wire inductor for impedance matching is described. Integrated techniques for the RF transmitter by CMOS compatible processes have been successfully developed. After matching by inserting the bonding wire inductor between the on-chip integrated antenna and the VCO output, the measured emission power at distance of 5 m from RF transmitter was -37 dBm (0.2 μW).

  8. Ductile-Phase-Toughened Tungsten for Plasma-Facing Materials

    NASA Astrophysics Data System (ADS)

    Cunningham, Kevin Hawkins

    A variety of processing approaches were employed to fabricate ductile-phase-toughened (DPT) tungsten (W) composites. Mechanical testing and analytical modeling were used to guide composite development. This work provides a basis for further development of W composites to be used in structural divertor components of future fusion reactors. W wire was tested in tension, showing significant ductility and strength. Coatings of copper (Cu) or tungsten carbide (WC) were applied to the W wire via electrodeposition and carburization, respectively. Composites were fabricated using spark plasma sintering (SPS) to consolidate W powders together with each type of coated W wire. DPT behavior, e.g. crack arrest and crack bridging, was not observed in three-point bend testing of the sintered composites. A laminate was fabricated by hot pressing W and Cu foils together with W wires, and subsequently tested in tension. This laminate was bonded via hot pressing to thick W plate as a reinforcing layer, and the composite was tested in three-point bending. Crack arrest was observed along with some fiber pullout, but significant transverse cracking in the W plate confounded further fracture toughness analysis. The fracture toughness of thin W plate was measured in three-point bending. W plates were brazed with Cu foils to form a laminate. Crack arrest and crack bridging were observed in three-point bend tests of the laminate, and fracture resistance curves were successfully calculated for this DPT composite. An analytical model of crack bridging was developed using the basis described by Chao in previous work by the group. The model uses the specimen geometry, matrix properties, and the stress-displacement function of a ductile reinforcement ("bridging law") to calculate the fracture resistance curve (R-curve) and load-displacement curve (P-D curve) for any test specimen geometry. The code was also implemented to estimate the bridging law of an arbitrary composite using R-curve data. Finally, a parametric study was performed to quantitatively determine the necessary mechanical properties of useful toughening reinforcements for a DPT W composite. The analytical model has a broad applicability for any DPT material.

  9. 46 CFR 32.75-15 - Electric bonding and grounding for tanks-TB/ALL.

    Code of Federal Regulations, 2013 CFR

    2013-10-01

    ... EQUIPMENT, MACHINERY, AND HULL REQUIREMENTS Hull Requirements for Wood Hull Tank Vessels Constructed Prior... cargo tanks in wood hull tank vessels shall be electrically bonded together with stranded copper cable...

  10. 46 CFR 32.75-15 - Electric bonding and grounding for tanks-TB/ALL.

    Code of Federal Regulations, 2014 CFR

    2014-10-01

    ... EQUIPMENT, MACHINERY, AND HULL REQUIREMENTS Hull Requirements for Wood Hull Tank Vessels Constructed Prior... cargo tanks in wood hull tank vessels shall be electrically bonded together with stranded copper cable...

  11. 77 FR 12556 - Certain Steel Nails From the People's Republic of China: Final Results and Final Partial...

    Federal Register 2010, 2011, 2012, 2013, 2014

    2012-03-01

    ..., respectively. Case History On September 12, 2011, the Department published in the Federal Register the... Comment 6: Stanley's Surrogate Values A. Copper Plated Steel Welding Wire B. Sodium Sulfate C. Glass Balls...

  12. 49 CFR 192.177 - Additional provisions for bottle-type holders.

    Code of Federal Regulations, 2012 CFR

    2012-10-01

    ... performed on the holder after it has been heat treated or stress relieved, except that copper wires may be... produces a hoop stress at least equal to 85 percent of the SMYS. (5) The holder, connection pipe, and...

  13. 49 CFR 192.177 - Additional provisions for bottle-type holders.

    Code of Federal Regulations, 2014 CFR

    2014-10-01

    ... performed on the holder after it has been heat treated or stress relieved, except that copper wires may be... produces a hoop stress at least equal to 85 percent of the SMYS. (5) The holder, connection pipe, and...

  14. 49 CFR 192.177 - Additional provisions for bottle-type holders.

    Code of Federal Regulations, 2013 CFR

    2013-10-01

    ... performed on the holder after it has been heat treated or stress relieved, except that copper wires may be... produces a hoop stress at least equal to 85 percent of the SMYS. (5) The holder, connection pipe, and...

  15. Microstructure and thermal properties of copper–diamond composites with tungsten carbide coating on diamond particles

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Kang, Qiping; He, Xinbo, E-mail: xb_he@163.com; Ren, Shubin

    2015-07-15

    An effective method for preparing tungsten carbide coating on diamond surfaces was proposed to improve the interface bonding between diamond and copper. The WC coating was formed on the diamond surfaces with a reaction medium of WO{sub 3} in mixed molten NaCl–KCl salts and the copper–diamond composites were obtained by vacuum pressure infiltration of WC-coated diamond particles with pure copper. The microstructure of interface bonding between diamond and copper was discussed. Thermal conductivity and thermal expansion behavior of the obtained copper–diamond composites were investigated. Results indicated that the thermal conductivity of as-fabricated composite reached 658 W m{sup −} {sup 1}more » K{sup −} {sup 1}. Significant reduction in coefficient of thermal expansion of the composite compared with that of pure copper was obtained. - Highlights: • WC coating was successfully synthesized on diamond particles in molten salts. • WC coating obviously promoted the wettability of diamond and copper matrix. • WC coating greatly enhanced the thermal conductivity of Cu–diamond composite. • The composites are suitable candidates for heat sink applications.« less

  16. Photoinduced, Copper-Catalyzed Carbon-Carbon Bond Formation with Alkyl Electrophiles: Cyanation of Unactivated Secondary Alkyl Chlorides at Room Temperature.

    PubMed

    Ratani, Tanvi S; Bachman, Shoshana; Fu, Gregory C; Peters, Jonas C

    2015-11-04

    We have recently reported that, in the presence of light and a copper catalyst, nitrogen nucleophiles such as carbazoles and primary amides undergo C-N coupling with alkyl halides under mild conditions. In the present study, we establish that photoinduced, copper-catalyzed alkylation can also be applied to C-C bond formation, specifically, that the cyanation of unactivated secondary alkyl chlorides can be achieved at room temperature to afford nitriles, an important class of target molecules. Thus, in the presence of an inexpensive copper catalyst (CuI; no ligand coadditive) and a readily available light source (UVC compact fluorescent light bulb), a wide array of alkyl halides undergo cyanation in good yield. Our initial mechanistic studies are consistent with the hypothesis that an excited state of [Cu(CN)2](-) may play a role, via single electron transfer, in this process. This investigation provides a rare example of a transition metal-catalyzed cyanation of an alkyl halide, as well as the first illustrations of photoinduced, copper-catalyzed alkylation with either a carbon nucleophile or a secondary alkyl chloride.

  17. X-ray diffraction study of low-temperature phase transformations in nickel-titanium orthodontic wires.

    PubMed

    Iijima, M; Brantley, W A; Guo, W H; Clark, W A T; Yuasa, T; Mizoguchi, I

    2008-11-01

    Employ conventional X-ray diffraction (XRD) to analyze three clinically important nickel-titanium orthodontic wire alloys over a range of temperatures between 25 and -110 degrees C, for comparison with previous results from temperature-modulated differential scanning calorimetry (TMDSC) studies. The archwires selected were 35 degrees C Copper Ni-Ti (Ormco), Neo Sentalloy (GAC International), and Nitinol SE (3M Unitek). Neo Sentalloy, which exhibits superelastic behavior, is marketed as having shape memory in the oral environment, and Nitinol SE and 35 degrees C Copper Ni-Ti also exhibit superelastic behavior. All archwires had dimensions of 0.016in.x0.022in. (0.41 mm x 0.56 mm). Straight segments cut with a water-cooled diamond saw were placed side-by-side to yield a 1 cm x 1cm test sample of each wire product for XRD analysis (Rint-Ultima(+), Rigaku) over a 2theta range from 30 degrees to 130 degrees and at successive temperatures of 25, -110, -60, -20, 0 and 25 degrees C. The phases revealed by XRD at the different analysis temperatures were in good agreement with those found in previous TMDSC studies of transformations in these alloys, in particular verifying the presence of R-phase at 25 degrees C. Precise comparisons are not possible because of the approximate nature of the transformation temperatures determined by TMDSC and the preferred crystallographic orientation present in the wires. New XRD peaks appear to result from low-temperature transformation in martensite, which a recent transmission electron microscopy (TEM) study has shown to arise from twinning. While XRD is a useful technique to study phases in nickel-titanium orthodontic wires and their transformations as a function of temperature, optimum insight is obtained when XRD analyses are combined with complementary TMDSC and TEM study of the wires.

  18. Three-dimensional quantification of pretorqued nickel-titanium wires in edgewise and prescription brackets.

    PubMed

    Mittal, Nitika; Xia, Zeyang; Chen, Jie; Stewart, Kelton T; Liu, Sean Shih-Yao

    2013-05-01

    To quantify the three-dimensional moments and forces produced by pretorqued nickel-titanium (NiTi) rectangular archwires fully engaged in 0.018- and 0.022-inch slots of central incisor and molar edgewise and prescription brackets. Ten identical acrylic dental models with retroclined maxillary incisors were fabricated for bonding with various bracket-wire combinations. Edgewise, Roth, and MBT brackets with 0.018- and 0.022-inch slots were bonded in a simulated 2 × 4 clinical scenario. The left central incisor and molar were sectioned and attached to load cells. Correspondingly sized straight and pretorqued NiTi archwires were ligated to the brackets using 0.010-inch ligatures. Each load cell simultaneously measured three force (Fx, Fy, Fz) and three moment (Mx, My, Mz) components. The faciolingual, mesiodistal, and inciso-occluso/apical axes of the teeth corresponded to the x, y, and z axes of the load cells, respectively. Each wire was removed and retested seven times. Three-way analysis of variance (ANOVA) examined the effects of wire type, wire size, and bracket type on the measured orthodontic load systems. Interactions among the three effects were examined and pair-wise comparisons between significant combinations were performed. The force and moment components on each tooth were quantified according to their local coordinate axes. The three-way ANOVA interaction terms were significant for all force and moment measurements (P < .05), except for Fy (P > .05). The pretorqued wire generates a significantly larger incisor facial crown torquing moment in the MBT prescription compared to Roth, edgewise, and the straight NiTi wire.

  19. Prognostic monitoring of aircraft wiring using electrical capacitive tomography

    NASA Astrophysics Data System (ADS)

    McKenzie, G.; Record, P.

    2011-12-01

    Electrical capacitive tomography (ECT) has been used to monitor sections of aircraft wiring, as a tool for prognostic analysis. To apply the principles of ECT across a cross section of only 4 mm, modification of the basic circuit was required. Additionally, a more novel method of placing the necessary electrodes was needed, this being accomplished by etching them from flexible copper sheeting and wrapping them inside the perimeter of an enclosure. Results showed that at this small scale, it was possible to determine the position of a wire-under-test inside the 4 mm diameter enclosure to about 0.1 mm, and that by measuring capacitance between pairs, it was also possible to determine whether or not the insulation of wire passed between the electrodes was damaged. With more than one wire-under-test present, it was possible to determine whether or not damage was present, and if so, which wire was damaged. By detecting insulation damage in this way, ECT has proven to be a useful tool in prognostic monitoring, helping faults to be found before they become safety-critical onboard an aircraft.

  20. Prognostic monitoring of aircraft wiring using electrical capacitive tomography.

    PubMed

    McKenzie, G; Record, P

    2011-12-01

    Electrical capacitive tomography (ECT) has been used to monitor sections of aircraft wiring, as a tool for prognostic analysis. To apply the principles of ECT across a cross section of only 4 mm, modification of the basic circuit was required. Additionally, a more novel method of placing the necessary electrodes was needed, this being accomplished by etching them from flexible copper sheeting and wrapping them inside the perimeter of an enclosure. Results showed that at this small scale, it was possible to determine the position of a wire-under-test inside the 4 mm diameter enclosure to about 0.1 mm, and that by measuring capacitance between pairs, it was also possible to determine whether or not the insulation of wire passed between the electrodes was damaged. With more than one wire-under-test present, it was possible to determine whether or not damage was present, and if so, which wire was damaged. By detecting insulation damage in this way, ECT has proven to be a useful tool in prognostic monitoring, helping faults to be found before they become safety-critical onboard an aircraft.

  1. Variable-delay Polarization Modulators for the CLASS Telescope

    NASA Astrophysics Data System (ADS)

    Harrington, Kathleen; Ali, A.; Amiri, M.; Appel, J. W.; Araujo, D.; Bennett, C. L.; Boone, F.; Chan, M.; Cho, H.; Chuss, D. T.; Colazo, F.; Crowe, E.; Denis, K.; Dünner, R.; Eimer, J.; Essinger-Hileman, T.; Gothe, D.; Halpern, M.; Hilton, G.; Hinshaw, G. F.; Huang, C.; Irwin, K.; Jones, G.; Karakla, J.; Kogut, A. J.; Larson, D.; Limon, M.; Lowry, L.; Marriage, T.; Mehrle, N.; Miller, A. D.; Miller, N.; Mirel, P.; Moseley, S. H.; Novak, G.; Reintsema, C.; Rostem, K.; Stevenson, T.; Towner, D.; U-Yen, K.; Wagner, E.; Watts, D.; Wollack, E.; Xu, Z.; Zeng, L.

    2014-01-01

    The challenges of measuring faint polarized signals at microwave wavelengths have motivated the development of rapid polarization modulators. One scalable technique, called a Variable-delay Polarization Modulator (VPM), consists of a stationary wire array in front of a movable mirror. The mirror motion creates a changing phase difference between the polarization modes parallel and orthogonal to the wire array. The Cosmology Large Angular Scale Surveyor (CLASS) will use a VPM as the first optical element in a telescope array that will search for the signature of inflation through the “B-mode” pattern in the polarization of the cosmic microwave background. In the CLASS VPMs, parallel transport of the mirror is maintained by a voice-coil actuated flexure system which will translate the mirror in a repeatable manner while holding tight parallelism constraints with respect to the wire array. The wire array will use 51 μm diameter copper-plated tungsten wire with 160 μm pitch over a 60 cm clear aperture. We present the status of the construction and testing of the mirror transport mechanism and wire arrays for the CLASS VPMs.

  2. Transport of energy by ultraintense laser-generated electrons in nail-wire targets

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Ma, T.; Lawrence Livermore National Laboratory, Livermore, California 94550; Key, M. H.

    2009-11-15

    Nail-wire targets (20 {mu}m diameter copper wires with 80 {mu}m hemispherical head) were used to investigate energy transport by relativistic fast electrons generated in intense laser-plasma interactions. The targets were irradiated using the 300 J, 1 ps, and 2x10{sup 20} W{center_dot}cm{sup -2} Vulcan laser at the Rutherford Appleton Laboratory. A spherically bent crystal imager, a highly ordered pyrolytic graphite spectrometer, and single photon counting charge-coupled device gave absolute Cu K{alpha} measurements. Results show a concentration of energy deposition in the head and an approximately exponential fall-off along the wire with about 60 {mu}m 1/e decay length due to resistive inhibition.more » The coupling efficiency to the wire was 3.3{+-}1.7% with an average hot electron temperature of 620{+-}125 keV. Extreme ultraviolet images (68 and 256 eV) indicate additional heating of a thin surface layer of the wire. Modeling using the hybrid E-PLAS code has been compared with the experimental data, showing evidence of resistive heating, magnetic trapping, and surface transport.« less

  3. High Power Density Motors

    NASA Technical Reports Server (NTRS)

    Kascak, Daniel J.

    2004-01-01

    With the growing concerns of global warming, the need for pollution-free vehicles is ever increasing. Pollution-free flight is one of NASA's goals for the 21" Century. , One method of approaching that goal is hydrogen-fueled aircraft that use fuel cells or turbo- generators to develop electric power that can drive electric motors that turn the aircraft's propulsive fans or propellers. Hydrogen fuel would likely be carried as a liquid, stored in tanks at its boiling point of 20.5 K (-422.5 F). Conventional electric motors, however, are far too heavy (for a given horsepower) to use on aircraft. Fortunately the liquid hydrogen fuel can provide essentially free refrigeration that can be used to cool the windings of motors before the hydrogen is used for fuel. Either High Temperature Superconductors (HTS) or high purity metals such as copper or aluminum may be used in the motor windings. Superconductors have essentially zero electrical resistance to steady current. The electrical resistance of high purity aluminum or copper near liquid hydrogen temperature can be l/lOO* or less of the room temperature resistance. These conductors could provide higher motor efficiency than normal room-temperature motors achieve. But much more importantly, these conductors can carry ten to a hundred times more current than copper conductors do in normal motors operating at room temperature. This is a consequence of the low electrical resistance and of good heat transfer coefficients in boiling LH2. Thus the conductors can produce higher magnetic field strengths and consequently higher motor torque and power. Designs, analysis and actual cryogenic motor tests show that such cryogenic motors could produce three or more times as much power per unit weight as turbine engines can, whereas conventional motors produce only 1/5 as much power per weight as turbine engines. This summer work has been done with Litz wire to maximize the current density. The current is limited by the amount of heat it generates. By increasing the heat transfer out of the wire, the wires can carry a larger current and therefore produce more force. This was done by increasing the surface area of the wire to allow more coolant to flow over it. Litz wire was used because it can carry high frequency current. It also can be deformed into configurations that would increase the surface area. The best configuration was determined by heat transfer and force plots that were generated using Maxwell 2D. Future work will be done by testing and measuring the thrust force produced by the wires in a magnetic field.

  4. Energy-Conversion Properties of Vapor-Liquid-Solid-Grown Silicon Wire-Array Photocathodes

    NASA Astrophysics Data System (ADS)

    Boettcher, Shannon W.; Spurgeon, Joshua M.; Putnam, Morgan C.; Warren, Emily L.; Turner-Evans, Daniel B.; Kelzenberg, Michael D.; Maiolo, James R.; Atwater, Harry A.; Lewis, Nathan S.

    2010-01-01

    Silicon wire arrays, though attractive materials for use in photovoltaics and as photocathodes for hydrogen generation, have to date exhibited poor performance. Using a copper-catalyzed, vapor-liquid-solid-growth process, SiCl4 and BCl3 were used to grow ordered arrays of crystalline p-type silicon (p-Si) microwires on p+-Si(111) substrates. When these wire arrays were used as photocathodes in contact with an aqueous methyl viologen2+/+ electrolyte, energy-conversion efficiencies of up to 3% were observed for monochromatic 808-nanometer light at fluxes comparable to solar illumination, despite an external quantum yield at short circuit of only 0.2. Internal quantum yields were at least 0.7, demonstrating that the measured photocurrents were limited by light absorption in the wire arrays, which filled only 4% of the incident optical plane in our test devices. The inherent performance of these wires thus conceptually allows the development of efficient photovoltaic and photoelectrochemical energy-conversion devices based on a radial junction platform.

  5. Energy-conversion properties of vapor-liquid-solid-grown silicon wire-array photocathodes.

    PubMed

    Boettcher, Shannon W; Spurgeon, Joshua M; Putnam, Morgan C; Warren, Emily L; Turner-Evans, Daniel B; Kelzenberg, Michael D; Maiolo, James R; Atwater, Harry A; Lewis, Nathan S

    2010-01-08

    Silicon wire arrays, though attractive materials for use in photovoltaics and as photocathodes for hydrogen generation, have to date exhibited poor performance. Using a copper-catalyzed, vapor-liquid-solid-growth process, SiCl4 and BCl3 were used to grow ordered arrays of crystalline p-type silicon (p-Si) microwires on p+-Si(111) substrates. When these wire arrays were used as photocathodes in contact with an aqueous methyl viologen(2+/+) electrolyte, energy-conversion efficiencies of up to 3% were observed for monochromatic 808-nanometer light at fluxes comparable to solar illumination, despite an external quantum yield at short circuit of only 0.2. Internal quantum yields were at least 0.7, demonstrating that the measured photocurrents were limited by light absorption in the wire arrays, which filled only 4% of the incident optical plane in our test devices. The inherent performance of these wires thus conceptually allows the development of efficient photovoltaic and photoelectrochemical energy-conversion devices based on a radial junction platform.

  6. Design, development and calibration of HTS wire based LOX level sensor probe

    NASA Astrophysics Data System (ADS)

    Karunanithi, R.; Jacob, S.; Nadig, D. S.; Prasad, M. V. N.; Gour, A. S.; Gowthaman, M.; Deekshith, P.; Shrivastava, V.

    2014-01-01

    For space applications, the weight of the liquid level sensors are of major concern as they affect the payload fraction and hence the cost. An attempt is made to design and test a light weight High Temperature Superconductor (HTS) wire based liquid level sensor for Liquid Oxygen (LOX) tank used in the cryostage of the spacecraft. The total resistance value measured of the HTS wire is inversely proportional to the liquid level. A HTS wire (SF12100) of 12mm width and 2.76m length without copper stabilizer has been used in the level sensor. The developed HTS wire based LOX level sensor is calibrated against a discrete diode array type level sensor. Liquid Nitrogen (LN2) and LOX has been used as cryogenic fluid for the calibration purpose. The automatic data logging for the system has been done using LabVIEW11. The net weight of the developed sensor is less than 1 kg.

  7. A platform for exploding wires in different media

    NASA Astrophysics Data System (ADS)

    Han, Ruoyu; Wu, Jiawei; Qiu, Aici; Zhou, Haibin; Wang, Yanan; Yan, Jiaqi; Ding, Weidong

    2017-10-01

    A platform SWE-2 used for single wire explosion experiments has been designed, established, and commissioned. This paper describes the design and initial experiments of SWE-2. In summary, two pulsed current sources based on pulse capacitors and spark gaps are adopted to drive sub-microsecond and microsecond time scale wire explosions in a gaseous/liquid medium, respectively. In the initial experiments, a single copper wire was exploded in air, helium, and argon with a 0.1-0.3 MPa ambient pressure as well as tap water with a 283-323 K temperature, 184-11 000 μ S/cm conductivity, or 0.1-0.9 MPa hydrostatic pressure. In addition, the diagnostic system is introduced in detail. Energy deposition, optical emission, and shock wave characteristics are briefly discussed based on experimental results. The platform was demonstrated to operate successfully with a single wire load. These results provide the potential for further applications of this platform, such as plasma-matter interactions, shock wave effects, and reservoir simulations.

  8. Nucleation and growth of zinc oxide nanorods directly on metal wire by sonochemical method.

    PubMed

    Rayathulhan, Ruzaina; Sodipo, Bashiru Kayode; Aziz, Azlan Abdul

    2017-03-01

    ZnO nanorods were directly grown on four different wires (silver, nickel, copper, and tungsten) using sonochemical method. Zinc nitrate hexahydrate and hexamethylenetetramine (HMT) were used as precursors. Influence of growth parameters such as precursors' concentration and ultrasonic power on the grown nanorods were determined. The results demonstrated that the precursor concentration affected the growth structure and density of the nanorods. The morphology, distribution, and orientation of nanorods changed as the ultrasonic power changed. Nucleation of ZnO nanorods on the wire occurred at lower ultrasonic power and when the power increased, the formation and growth of ZnO nanorods on the wires were initiated. The best morphology, size, distribution, and orientation of the nanorods were observed on the Ag wire. The presence of single crystal nanorod with hexagonal shaped was obtained. This shape indicates that the ZnO nanorods corresponded to the hexagonal wurtzite structure with growth preferential towards the (002) direction. Copyright © 2016 Elsevier B.V. All rights reserved.

  9. Casting of superconducting composite materials (M-4)

    NASA Technical Reports Server (NTRS)

    Togano, Kazumasa

    1993-01-01

    An aluminum-lead-bismuth alloy is a flexible alloy and is promising for easily workable embedded-type, filament-dispersed superconducting wire material. It is difficult to produce homogeneous ingots of this material because it is easily separated into elements when melted on Earth due to the large specific gravity differences. In this experiment, a homogeneous alloy will first be produced in molten state in microgravity. It will then be returned to Earth and processed into a wire or tape form. It will then be dispersed as the second phase in micro texture form into the primary phase of aluminum. Superconducting wire material with high-critical-magnetic-field characteristics will be produced. The texture of the material will be observed, and its performance will be evaluated. In addition to the above alloy, a four-element alloy will be produced from silver, a rare Earth element, barium, and copper. The alloys will be oxidized and drawn into wire after being returned to Earth. The materials are expected to be forerunners in obtaining superconducting wire materials from oxide superconductors.

  10. Sagittal and vertical load-deflection and permanent deformation of transpalatal arches connected with palatal implants: an in-vitro study.

    PubMed

    Crismani, Adriano G; Celar, Ales G; Burstone, Charles J; Bernhart, Thomas G; Bantleon, Hans-Peter; Mittlboeck, Martina

    2007-06-01

    The purposes of this laboratory investigation were to (1) measure the sagittal and vertical deflection of loaded transpalatal arches (TPAs) connected to a palatal implant, (2) measure the extent of permanent deformation of the connecting TPA in the sagittal and vertical directions, (3) test various wire dimensions in terms of deflection behavior, and (4) evaluate soldering vs laser welding vs adhesive bonding of TPAs in terms of load deflection behavior. Stainless steel wires of 6 dimensions were tested: 0.8 x 0.8, 0.9, 1, 1.1, 1.2, and 1.2 x 1.2 mm. For each dimension, 10 specimens were soldered to the palatal implant abutment, 10 were laser welded, and 10 were adhesively bonded to the implant abutment (total, 180 specimens). The measuring device applied increments of force of 50 cN, from 0 to 500 cN. Then the specimens were unloaded. The values were statistically described and analyzed with ANOVA and Wilcoxon rank sum tests. Absolute orthodontic anchorage without deformation of TPAs was not observed with the wire dimensions tested. To prevent loss of anchorage greater than 370 mum (sagittal deflection of 1.2 x 1.2 mm adhesively bonded TPA at 500 cN force level), wires thicker than 1.2 x 1.2 mm or cast anchorage elements must be considered for clinical practice. However, larger cross sections might cause more patient discomfort, and laboratory procedures increase costs.

  11. 75 FR 82337 - Airworthiness Directives; The Boeing Company Model 777-200, -300, and -300ER Series Airplanes

    Federal Register 2010, 2011, 2012, 2013, 2014

    2010-12-30

    ... hardware; and making certain wiring changes. This proposed AD was prompted by results from fuel system... a new P302 panel on the right side of the airplane, and changing the wiring; and performing certain bonding resistance measurements and reworking the airplane installation to verify that [[Page 82339...

  12. Operation of Terahertz Quantum-cascade Lasers at 164 K in Pulsed Mode and at 117 K in Continuous-wave Mode

    NASA Technical Reports Server (NTRS)

    Williams, Benjamin S.; Kumar, Sushil; Hu, Qing; Reno, John L.

    2005-01-01

    We report the demonstration of a terahertz quantum-cascade laser that operates up to 164 K in pulsed mode and 117 K in continuous-wave mod e at approximately 3.0 THz. The active region was based on a resonant -phonon depopulation scheme and a metal-metal waveguide was used for modal confinement. Copper to copper thermocompression wafer bonding w as used to fabricate the waveguide, which displayed improved thermal properties compared to a previous indium-gold bonding method.

  13. Enantioselective Copper-Catalyzed Carboetherification of Unactivated Alkenes**

    PubMed Central

    Bovino, Michael T.; Liwosz, Timothy W.; Kendel, Nicole E.; Miller, Yan; Tyminska, Nina

    2014-01-01

    Chiral saturated oxygen heterocycles are important components of bioactive compounds. Cyclization of alcohols onto pendant alkenes is a direct route to their synthesis, but few catalytic enantioselective methods enabling cyclization onto unactivated alkenes exist. Herein is reported a highly efficient copper-catalyzed cyclization of γ-unsaturated pentenols that terminates in C-C bond formation, a net alkene carboetherification. Both intra- and intermolecular C-C bond formations are demonstrated, yielding functionalized chiral tetrahydrofurans as well as fused-ring and bridged-ring oxabicyclic products. Transition state calculations support a cis-oxycupration stereochemistry-determining step. PMID:24798697

  14. Molten thermoplastic dripping behavior induced by flame spread over wire insulation under overload currents.

    PubMed

    He, Hao; Zhang, Qixing; Tu, Ran; Zhao, Luyao; Liu, Jia; Zhang, Yongming

    2016-12-15

    The dripping behavior of the molten thermoplastic insulation of copper wire, induced by flame spread under overload currents, was investigated for a better understanding of energized electrical wire fires. Three types of sample wire, with the same polyethylene insulation thickness and different core diameters, were used in this study. First, overload current effects on the transient one-dimensional wire temperature profile were predicted using simplified theoretical analysis; the heating process and equilibrium temperature were obtained. Second, experiments on the melting characteristics were conducted in a laboratory environment, including drop formation and frequency, falling speed, and combustion on the steel base. Third, a relationship between molten mass loss and volume variation was proposed to evaluate the dripping time and frequency. A strong current was a prerequisite for the wire dripping behavior and the averaged dripping frequency was found to be proportional to the square of the current based on the theoretical and experimental results. Finally, the influence of dripping behavior on the flame propagation along the energized electrical wire was discussed. The flame width, bright flame height and flame spreading velocity presented different behaviors. Copyright © 2016 Elsevier B.V. All rights reserved.

  15. Update on High-Temperature Coils for Electromagnets

    NASA Technical Reports Server (NTRS)

    Kascak, Albert F.; Montague, Gerald T.; Palazzolo, Alan; Preuss, Jason; Carter, Bart; Tucker, Randall; Hunt, Andrew

    2005-01-01

    A report revisits the subject matter of "High-Temperature Coils for Electromagnets" (LEW-17164), NASA Tech Briefs, Vol. 26, No. 8, (August 2002) page 38. To recapitulate: Wires have been developed for use in electromagnets that operate at high temperatures. The starting material for a wire of this type can be either a nickel-clad, ceramic-insulated copper wire or a bare silver wire. The wire is covered by electrical-insulation material that is intended to withstand operating temperatures in the range from 800 to 1,300 F (.430 to .700 C): The starting wire is either primarily wrapped with S-glass as an insulating material or else covered with another insulating material wrapped in S-glass prior to the winding process. A ceramic binding agent is applied as a slurry during the winding process to provide further insulating capability. The turns are pre-bent during winding to prevent damage to the insulation. The coil is then heated to convert the binder into ceramic. The instant report mostly reiterates the prior information and presents some additional information on the application of the ceramic binding agent and the incorporation of high-temperature wire into the windings.

  16. Synthesis, spectral characterization and structural studies of a novel O, N, O donor semicarbazone and its binuclear copper complex with hydrogen bond stabilized lattice

    NASA Astrophysics Data System (ADS)

    Layana, S. R.; Saritha, S. R.; Anitha, L.; Sithambaresan, M.; Sudarsanakumar, M. R.; Suma, S.

    2018-04-01

    A novel O,N,O donor salicylaldehyde-N4-phenylsemicarbazone, (H2L) has been synthesized and physicochemically characterized. Detailed structural studies of H2L using single crystal X-ray diffraction technique reveals the existence of intra and inter molecular hydrogen bonding interactions, which provide extra stability to the molecule. We have successfully synthesized a binuclear copper(II) complex, [Cu2(HL)2(NO3)(H2O)2]NO3 with phenoxy bridging between the two copper centers. The complex was characterized by elemental analysis, magnetic susceptibility and conductivity measurements, FT-IR, UV-Visible, mass and EPR spectral methods. The grown crystals of the copper complex were employed for the single crystal X-ray diffraction studies. The complex possesses geometrically different metal centers, in which the ligand coordinates through ketoamide oxygen, azomethine nitrogen and deprotonated phenoxy oxygen. The extensive intermolecular hydrogen bonding interactions of the coordinated and the lattice nitrate groups interconnect the complex units to form a 2D supramolecular assembly. The ESI mass spectrum substantiates the existence of 1:1 complex. The g values obtained from the EPR spectrum in frozen DMF suggest dx2 -y2 ground state for the unpaired electron.

  17. Pyrrolidine and Piperidine Formation Via Copper(II) Carboxylate Promoted Intramolecular Carboamination of Unactivated Olefins: Diastereoselectivity and Mechanism

    PubMed Central

    Sherman, Eric S.; Fuller, Peter H.; Kasi, Dhanalakshmi; Chemler, Sherry R.

    2008-01-01

    An expanded substrate scope and in depth analysis of the reaction mechanism of the copper(II) carboxylate promoted intramolecular carboamination of unactivated alkenes is described. This method provides access to N-functionalized pyrrolidines and piperidines. Both aromatic and aliphatic γ- and δ-alkenyl N-arylsulfonamides undergo the oxidative cyclization reaction efficiently. N-Benzoyl-2-allylaniline also underwent the oxidative cyclization. The terminal olefin substrates examined were more reactive than those with internal olefins, and the latter terminated in elimination rather than carbon-carbon bond formation. The efficiency of the reaction was enhanced by the use of more organic soluble copper(II) carboxylate salts, copper(II) neodecanoate in particular. The reaction times were reduced by the use of microwave heating. High levels of diastereoselectivity were observed in the synthesis of 2,5-disubstituted pyrrolidines, wherein the cis substitution pattern predominates. The mechanism of the reaction is discussed in the context of the observed reactivity and in comparison to analogous reactions promoted by other reagents and conditions. Our evidence supports a mechanism wherein the N-C bond is formed via intramolecular syn aminocupration and the C-C bond is formed via intramolecular addition of a primary carbon radical to an aromatic ring. PMID:17428100

  18. Synthesis of one-dimensional metal-containing insulated molecular wire with versatile properties directed toward molecular electronics materials.

    PubMed

    Masai, Hiroshi; Terao, Jun; Seki, Shu; Nakashima, Shigeto; Kiguchi, Manabu; Okoshi, Kento; Fujihara, Tetsuaki; Tsuji, Yasushi

    2014-02-05

    We report, herein, the design, synthesis, and properties of new materials directed toward molecular electronics. A transition metal-containing insulated molecular wire was synthesized through the coordination polymerization of a Ru(II) porphyrin with an insulated bridging ligand of well-defined structure. The wire displayed not only high linearity and rigidity, but also high intramolecular charge mobility. Owing to the unique properties of the coordination bond, the interconversion between the monomer and polymer states was realized under a carbon monoxide atmosphere or UV irradiation. The results demonstrated a high potential of the metal-containing insulated molecular wire for applications in molecular electronics.

  19. Comparison of copper heptonate with copper oxide wire particles as copper supplements for sheep on pasture of high molybdenum content.

    PubMed

    Judson, G J; Babidge, P J

    2002-10-01

    To assess the effectiveness of intramuscular injection of copper heptonate (CuHep) and an oral dose of copper oxide wire particles (COWP) in preventing Cu inadequacy in adult and young sheep on pasture of high Mo content. Field experiments with flocks of mature Merino wethers and crossbred weaners. Adult wethers were given 25 or 37.5 mg Cu as CuHep, 2.5 g COWP or no Cu treatment. The weaners were given 12.5 or 25 mg Cu as CuHep, 1.25 g COWP or no Cu treatment. At intervals over the next 12 (adults) or 8 (weaners) months the sheep were weighed and samples of blood and liver were collected for trace element assay. Wool samples collected from the adults at the end of the experiment were assessed for physical characteristics. The higher dosage of CuHep raised liver Cu above control group values for at least 9 months in adults and 3 months in weaners. The lower dosage of CuHep was similarly effective for 3 months in adults but was without effect in weaners. In adults the response to COWP matched that to the higher dosage of CuHep; in weaners it was greater, lasting at least 5 months. No changes indicative of Cu deficiency, apart from a depressed body weight in adults, were seen. In sheep on pasture of high Mo content a single intramuscular injection of CuHep providing 37.5 mg Cu to adults or 25 mg Cu to weaners will raise liver Cu reserves for at least 9 and 3 months respectively and may be an acceptable alternative to COWP for preventing seasonal Cu deficiency in sheep in southern Australia.

  20. Copper link evaluations/solutions for fiber channel, SSA, SONET, ATM, and other services through 4 Gb/sec: basic information, test results, and evaluation

    NASA Astrophysics Data System (ADS)

    Leib, Michael J.

    1995-10-01

    Technitrol, the original designer of MIL-STD-1553 transformers, the original military 1Mb/s LAN, has advanced the state of the art one further notch, introducing a series of transceivers that allow high speed (through 1 Gb/s) data transmission over copper wire instead of fiber optic cable. One such device can be employed to implement the Fiber Channel Interface as defined by hte X3T11 ANSI Fibre Channel Committee using either mini coax, Type 1 shielded twisted pair, twinax or video cable. The technology now exists to upgrade data transmission rates on current physical media to speeds formerly only available with fiber optic cabling. Copper transceiver technology provides a cost effective alternative for dealing with demanding high speed applications such as high speed serial data transfer, high speed disk and tape storage transfer, imaging telemetry, radar, and other avionics applications. Eye diagrams will be presented to show that excellent data transmission at rates of 1 gigabit/sec with low jitter is capable over mini coax at distances to approximately 50 meters, shielded twisted pair and twinax cable to distances of 105 meters, and video cable to distances of 175 meters. Distances are further at lower data rates. As a member of the X3T11 ANSI Fiber Channel Committee, Technitrol has developed a Physical Media (copper wire) Dependant (PMD) transceiver not only compliant with the Fibre Channel Specifications but exceeding the specifications by a factor greater than four. Conceivably, this opens high speed interconnections for today's high data rate requirements to copper cabling systems. Fibre Optic problems need not be dealt with to obtain data transfers for high speed information transfers.

  1. Scale-up of 2G wire manufacturing at American Superconductor Corporation

    NASA Astrophysics Data System (ADS)

    Fleshler, S.; Buczek, D.; Carter, B.; Cedrone, P.; DeMoranville, K.; Gannon, J.; Inch, J.; Li, X.; Lynch, J.; Otto, A.; Podtburg, E.; Roy, D.; Rupich, M.; Sathyamurthy, S.; Schreiber, J.; Thieme, C.; Thompson, E.; Tucker, D.; Nagashima, K.; Ogata, M.

    2009-10-01

    American Superconductor Corporation (AMSC) has developed the base technology and a manufacturing line for initial volume production of low-cost second generation high temperature superconductor (2G HTS) wire for commercial and military applications. The manufacturing line is based on reel-to-reel processing of wide HTS strips using rolling assisted bi-axially textured substrate (RABiTS™) for the template and Metal Organic Deposition (MOD) for the HTS layer. AMSC’s wide strip process is a low cost manufacturing technology since multiple wires are produced in a single manufacturing pass by slitting the wide strip to narrower width in the last stage of the manufacturing process. Industry standard 4.4 mm wide wires are produced by laminating metallic foils, such as copper, stainless steel or any other material, to the HTS insert wire, and are chosen to tailor the electrical, thermal and mechanical properties of the wire for specific applications. The laminated, 4.4 mm wide wires are known as “344 superconductors.” In this paper, we summarize the status of AMSC’s manufacturing capability, the performance of the wire presently being produced, as well as the cost and technical advantages of AMSC’s manufacturing approach. In addition, future direction for research and development to improve electrical performance is presented.

  2. CARBON BLACK DISPERSION PRE-PLATING TECHNOLOGY FOR PRINTED WIRE BOARD MANUFACTURING

    EPA Science Inventory

    This evaluation addresses the product quality, waste reduction, and economic issues involved in replacing electroless copper with a carbon black dispersion technology. McCurdy Circuits of Orange County, California, currently has both processes in operation. McCurdy has found that...

  3. 29 CFR 1926.954 - Grounding for protection of employees.

    Code of Federal Regulations, 2012 CFR

    2012-07-01

    ... the new lines or equipment. (c) Communication conductors. Bare wire communication conductors on power... have a resistance to ground low enough to remove the danger of harm to personnel or permit prompt... shall have a minimum conductance of No. 2 AWG copper. ...

  4. 29 CFR 1926.954 - Grounding for protection of employees.

    Code of Federal Regulations, 2011 CFR

    2011-07-01

    ... the new lines or equipment. (c) Communication conductors. Bare wire communication conductors on power... have a resistance to ground low enough to remove the danger of harm to personnel or permit prompt... shall have a minimum conductance of No. 2 AWG copper. ...

  5. 29 CFR 1926.954 - Grounding for protection of employees.

    Code of Federal Regulations, 2013 CFR

    2013-07-01

    ... the new lines or equipment. (c) Communication conductors. Bare wire communication conductors on power... have a resistance to ground low enough to remove the danger of harm to personnel or permit prompt... shall have a minimum conductance of No. 2 AWG copper. ...

  6. 29 CFR 1926.954 - Grounding for protection of employees.

    Code of Federal Regulations, 2010 CFR

    2010-07-01

    ... the new lines or equipment. (c) Communication conductors. Bare wire communication conductors on power... have a resistance to ground low enough to remove the danger of harm to personnel or permit prompt... shall have a minimum conductance of No. 2 AWG copper. ...

  7. 29 CFR 1926.954 - Grounding for protection of employees.

    Code of Federal Regulations, 2014 CFR

    2014-07-01

    ... the new lines or equipment. (c) Communication conductors. Bare wire communication conductors on power... have a resistance to ground low enough to remove the danger of harm to personnel or permit prompt... shall have a minimum conductance of No. 2 AWG copper. ...

  8. Optimization of metals and plastics recovery from electric cable wastes using a plate-type electrostatic separator.

    PubMed

    Richard, Gontran; Touhami, Seddik; Zeghloul, Thami; Dascalescu, Lucien

    2017-02-01

    Plate-type electrostatic separators are commonly employed for the selective sorting of conductive and non-conductive granular materials. The aim of this work is to identify the optimal operating conditions of such equipment, when employed for separating copper and plastics from either flexible or rigid electric wire wastes. The experiments are performed according to the response surface methodology, on samples composed of either "calibrated" particles, obtained by manually cutting of electric wires at a predefined length (4mm), or actual machine-grinded scraps, characterized by a relatively-wide size distribution (1-4mm). The results point out the effect of particle size and shape on the effectiveness of the electrostatic separation. Different optimal operating conditions are found for flexible and rigid wires. A separate processing of the two classes of wire wastes is recommended. Copyright © 2016 Elsevier Ltd. All rights reserved.

  9. Elaboration of Copper-Oxygen Mediated C–H Activation Chemistry in Consideration of Future Fuel and Feedstock Generation

    PubMed Central

    Lee, Jung Yoon; Karlin, Kenneth D

    2015-01-01

    To contribute solutions for current energy concerns, improvements in the efficiency of C-H bond cleavage chemistry, e.g., selective oxidation of methane to methanol, could minimize losses in natural gas usage or produce feedstocks for fuels. Oxidative C-H activation is also a component of polysaccharide degradation, affording alternative biofuels from abundant biomass. Thus, an understanding of active-site chemistry in copper monooxygenases, those activating strong C-H bonds is briefly reviewed. Then, recent advances in the synthesis-generation and study of various copper-oxygen intermediates are highlighted. Of special interest are cupric-superoxide, Cu-hydroperoxo and Cu-oxy complexes. Such investigations can contribute to an enhanced future application of C-H oxidation or oxygenation processes using air, as concerning societal energy goals. PMID:25756327

  10. Nail-like targets for laser plasma interaction experiments

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Pasley, J; Wei, M; Shipton, E

    2007-12-18

    The interaction of ultra-high power picosecond laser pulses with solid targets is of interest both for benchmarking the results of hybrid particle in cell (PIC) codes and also for applications to re-entrant cone guided fast ignition. We describe the construction of novel targets in which copper/titanium wires are formed into 'nail-like' objects by a process of melting and micromachining, so that energy can be reliably coupled to a 24 {micro}m diameter wire. An extreme-ultraviolet image of the interaction of the Titan laser with such a target is shown.

  11. Space Shuttle Columbia Aging Wiring Failure Analysis

    NASA Technical Reports Server (NTRS)

    McDaniels, Steven J.

    2005-01-01

    A Space Shuttle Columbia main engine controller 14 AWG wire short circuited during the launch of STS-93. Post-flight examination divulged that the wire had electrically arced against the head of a nearby bolt. More extensive inspection revealed additional damage to the subject wire, and to other wires as well from the mid-body of Columbia. The shorted wire was to have been constructed from nickel-plated copper conductors surrounded by the polyimide insulation Kapton, top-coated with an aromatic polyimide resin. The wires were analyzed via scanning electron microscope (SEM), energy dispersive X-Ray spectroscopy (EDX), and electron spectroscopy for chemical analysis (ESCA); differential scanning calorimetry (DSC) and thermal gravimetric analysis (TGA) were performed on the polyimide. Exemplar testing under laboratory conditions was performed to replicate the mechanical damage characteristics evident on the failed wires. The exemplar testing included a step test, where, as the name implies, a person stepped on a simulated wire bundle that rested upon a bolt head. Likewise, a shear test that forced a bolt head and a torque tip against a wire was performed to attempt to damage the insulation and conductor. Additionally, a vibration test was performed to determine if a wire bundle would abrade when vibrated against the head of a bolt. Also, an abrasion test was undertaken to determine if the polyimide of the wire could be damaged by rubbing against convolex helical tubing. Finally, an impact test was performed to ascertain if the use of the tubing would protect the wire from the strike of a foreign object.

  12. Neutron Microtomography of MgB2 Superconducting Multifilament Wire

    NASA Astrophysics Data System (ADS)

    Trtik, Pavel; Scheuerlein, Christian; Alknes, Patrick; Meyer, Michael; Schmid, Florian; Lehmann, Eberhard

    Neutron imaging of sub-10-micrometres spatial resolution has been recently achieved in 2D mode within the framework of the Neutron Microscope project at the Paul Scherrer Institut. Here we report on the development of the PSI Neutron Microscope instrument and the results of the first microtomographic imaging experiment of multifilament superconducting MgB2 wire. The sample of MgB2 superconducting 37 multifilaments embedded in copper-nickel matrix was investigated -in microtomographic mode- with the scientific interest regarding the distribution of boron within the individual superconducting filaments (about 40 μm in diameter). The resulting tomographic dataset revealed the distribution of boron within the entire 0.8 mm thick multifilamental wire with the isotropic voxel size of 2.6 micrometres.

  13. Evaluation of copper slag blast media for railcar maintenance

    NASA Technical Reports Server (NTRS)

    Sagers, N. W.; Finlayson, Mack H.

    1989-01-01

    Copper slag was tested as a blasting substitute for zirconium silicate which is used to remove paint from railroad cars. The copper slag tested is less costly, strips paint faster, is produced near the point of need, provides a good bonding surface for paint, and permits the operator to work in a more comfortable position, i.e., standing nearly erect instead of having to crouch. Outdoor blasting with the tested Blackhawk (20 to 40 mesh) copper slag is also environmentally acceptable to the State of Utah. Results of tests for the surface erosion rate with copper slag blasting are included.

  14. A study of tape adhesive strength on endotracheal tubes.

    PubMed

    Fenje, N; Steward, D J

    1988-03-01

    A method of assessing the adhesive bond of tapes used to secure endotracheal (ET) tubes is described. Five kinds of tape and six different ET tubes including two silicone rubber, wire-reinforced tubes were tested. There are significant differences in the adhesive strength of different tapes, and in the adhesive bond formed by different ET tube materials. On the Portex clear ET tube, silk tape adhered best (p less than 0.001), followed by waterproof, cloth, dermiclear, and micropore tapes. Adhesive bonding by silk tape was significantly greater (p less than 0.001) for the three clear ET tubes (Portex clear, NCC clear, and Portex ivory) than for the Portex blue and the silicone rubber, wire-reinforced ET tubes. All tapes showed very poor or negligible adhesion to the Sheridan and Portex reinforced ET tubes. Adhesion to these tubes was greatly improved by wrapping them tightly with an "op site" dressing prior to applying tape.

  15. Decrease in cytotoxicity of copper-based intrauterine devices (IUD) pretreated with 6-mercaptopurine and pterin as biocompatible corrosion inhibitors.

    PubMed

    Alvarez, Florencia; Grillo, Claudiaa; Schilardi, Patricial; Rubert, Aldo; Benítez, Guillermo; Lorente, Carolina; de Mele, Mónica Fernández Lorenzo

    2013-01-23

    The copper intrauterine device (IUD) based its contraceptive action on the release of cupric ions from a copper wire. Immediately after the insertion, a burst release of copper ions occurs, which may be associated to a variety of side effects. 6-Mercaptopurine (6-MP) and pterin (PT) have been proposed as corrosion inhibitors to reduce this harmful release. Pretreatments with 1 × 10(-4) M 6-MP and 1 × 10(-4) M PT solutions with 1h and 3h immersion times were tested. Conventional electrochemical techniques, EDX and XPS analysis, and cytotoxicity assays with HeLa cell line were employed to investigate the corrosion behavior and biocompatibility of copper with and without treatments. Results showed that copper samples treated with PT and 6-MP solutions for 3 and 1 h, respectively, are more biocompatible than those without treatment. Besides, the treatment reduces the burst release effect of copper in simulated uterine solutions during the first week after the insertion. It was concluded that PT and 6-MP treatments are promising strategies able to reduce the side effects related to the "burst release" of copper-based IUD without altering the contraceptive action.

  16. Forensic discrimination of copper wire using trace element concentrations.

    PubMed

    Dettman, Joshua R; Cassabaum, Alyssa A; Saunders, Christopher P; Snyder, Deanna L; Buscaglia, JoAnn

    2014-08-19

    Copper may be recovered as evidence in high-profile cases such as thefts and improvised explosive device incidents; comparison of copper samples from the crime scene and those associated with the subject of an investigation can provide probative associative evidence and investigative support. A solution-based inductively coupled plasma mass spectrometry method for measuring trace element concentrations in high-purity copper was developed using standard reference materials. The method was evaluated for its ability to use trace element profiles to statistically discriminate between copper samples considering the precision of the measurement and manufacturing processes. The discriminating power was estimated by comparing samples chosen on the basis of the copper refining and production process to represent the within-source (samples expected to be similar) and between-source (samples expected to be different) variability using multivariate parametric- and empirical-based data simulation models with bootstrap resampling. If the false exclusion rate is set to 5%, >90% of the copper samples can be correctly determined to originate from different sources using a parametric-based model and >87% with an empirical-based approach. These results demonstrate the potential utility of the developed method for the comparison of copper samples encountered as forensic evidence.

  17. Matrix effects on copper(II)phthalocyanine complexes. A combined continuous wave and pulse EPR and DFT study.

    PubMed

    Finazzo, Cinzia; Calle, Carlos; Stoll, Stefan; Van Doorslaer, Sabine; Schweiger, Arthur

    2006-04-28

    The effect of the electron withdrawing or donating character of groups located at the periphery of the phthalocyanine ligand, as well as the influence of polar and nonpolar solvents are of importance for the redox chemistry of metal phthalocyanines. Continuous wave and pulse electron paramagnetic resonance and pulse electron nuclear double resonance spectroscopy at X- and Q-band are applied to investigate the electronic structure of the complexes Cu(II)phthalocyanine (CuPc), copper(II) 2,9,16,23-tetra-tert-butyl-29H,31H-phthalocyanine (CuPc(t)), and copper(II) 1,2,3,4,8,9,10,11,15,16,17,18,22,23,24,25-hexadecafluoro-29H,31H-phthalocyanine (CuPc(F)) in various matrices. Isotope substitutions are used to determine the g values, the copper hyperfine couplings and the hyperfine interactions with the 14N, 1H and 19F nuclei of the macrocycle and the surrounding matrix molecules. Simulations and interpretations of the spectra are shown and discussed, and a qualitative analysis of the data using previous theoretical models is given. Density functional computations facilitate the interpretation of the EPR parameters. The experimental g, copper and nitrogen hyperfine and nuclear quadrupole values are found to be sensitive to changes of the solvent and the structure of the macrocycle. To elucidate the electronic, structural and bonding properties the changes in the g principal values are related to data from UV/Vis spectroscopy and to density functional theory (DFT) computations. The analysis of the EPR data indicates that the in-plane metal-ligand sigma bonding is more covalent for CuPc(t) in toluene than in sulfuric acid. Furthermore, the out-of-plane pi bonding is found to be less covalent in the case of a polar sulfuric acid environment than with nonpolar toluene or H2Pc environment, whereby the covalency of this bonding is increased upon addition of tert-butyl groups. No contribution from in-plane pi bonding is found.

  18. Analysis of antioxidants in insulation cladding of copper wire: a comparison of different mass spectrometric techniques (ESI-IT, MALDI-RTOF and RTOF-SIMS).

    PubMed

    Schnöller, Johannes; Pittenauer, Ernst; Hutter, Herbert; Allmaier, Günter

    2009-12-01

    Commercial copper wire and its polymer insulation cladding was investigated for the presence of three synthetic antioxidants (ADK STAB AO412S, Irganox 1010 and Irganox MD 1024) by three different mass spectrometric techniques including electrospray ionization-ion trap-mass spectrometry (ESI-IT-MS), matrix-assisted laser desorption/ionization reflectron time-of-flight (TOF) mass spectrometry (MALDI-RTOF-MS) and reflectron TOF secondary ion mass spectrometry (RTOF-SIMS). The samples were analyzed either directly without any treatment (RTOF-SIMS) or after a simple liquid/liquid extraction step (ESI-IT-MS, MALDI-RTOF-MS and RTOF-SIMS). Direct analysis of the copper wire itself or of the insulation cladding by RTOF-SIMS allowed the detection of at least two of the three antioxidants but at rather low sensitivity as molecular radical cations and with fairly strong fragmentation (due to the highly energetic ion beam of the primary ion gun). ESI-IT- and MALDI-RTOF-MS-generated abundant protonated and/or cationized molecules (ammoniated or sodiated) from the liquid/liquid extract. Only ESI-IT-MS allowed simultaneous detection of all three analytes in the extract of insulation claddings. The latter two so-called 'soft' desorption/ionization techniques exhibited intense fragmentation only by applying low-energy collision-induced dissociation (CID) tandem MS on a multistage ion trap-instrument and high-energy CID on a tandem TOF-instrument (TOF/RTOF), respectively. Strong differences in the fragmentation behavior of the three analytes could be observed between the different CID spectra obtained from either the IT-instrument (collision energy in the very low eV range) or the TOF/RTOF-instrument (collision energy 20 keV), but both delivered important structural information. Copyright 2009 John Wiley & Sons, Ltd.

  19. Durability Evaluation of a Thin Film Sensor System With Enhanced Lead Wire Attachments on SiC/SiC Ceramic Matrix Composites

    NASA Technical Reports Server (NTRS)

    Lei, Jih-Fen; Kiser, J. Douglas; Singh, Mrityunjay; Cuy, Mike; Blaha, Charles A.; Androjna, Drago

    2000-01-01

    An advanced thin film sensor system instrumented on silicon carbide (SiC) fiber reinforced SiC matrix ceramic matrix composites (SiC/SiC CMCs), was evaluated in a Mach 0.3 burner rig in order to determine its durability to monitor material/component surface temperature in harsh environments. The sensor system included thermocouples in a thin film form (5 microns thick), fine lead wires (75 microns diameter), and the bonds between these wires and the thin films. Other critical components of the overall system were the heavy, swaged lead wire cable (500 microns diameter) that contained the fine lead wires and was connected to the temperature readout, and ceramic attachments which were bonded onto the CMCs for the purpose of securing the lead wire cables, The newly developed ceramic attachment features a combination of hoops made of monolithic SiC or SiC/SiC CMC (which are joined to the test article) and high temperature ceramic cement. Two instrumented CMC panels were tested in a burner rig for a total of 40 cycles to 1150 C (2100 F). A cycle consisted of rapid heating to 1150 C (2100 F), a 5 minute hold at 1150 C (2100 F), and then cooling down to room temperature in 2 minutes. The thin film sensor systems provided repeatable temperature measurements for a maximum of 25 thermal cycles. Two of the monolithic SiC hoops debonded during the sensor fabrication process and two of the SiC/SiC CMC hoops failed during testing. The hoops filled with ceramic cement, however, showed no sign of detachment after 40 thermal cycle test. The primary failure mechanism of this sensor system was the loss of the fine lead wire-to-thin film connection, which either due to detachment of the fine lead wires from the thin film thermocouples or breakage of the fine wire.

  20. Facile O-atom insertion into CC and CH bonds by a trinuclear copper complex designed to harness a singlet oxene

    PubMed Central

    Chen, Peter P.-Y.; Yang, Richard B.-G.; Lee, Jason C.-M.; Chan, Sunney I.

    2007-01-01

    Two trinuclear copper [CuICuICuI(L)]1+ complexes have been prepared with the multidentate ligands (L) 3,3′-(1,4-diazepane-1,4-diyl)bis(1-((2-(dimethylamino)ethyl)(methyl)amino)propan-2-ol) (7-Me) and (3,3′-(1,4-diazepane-1,4-diyl)bis(1-((2-(diethylamino) ethyl)(ethyl) amino)propan-2-ol) (7-Et) as models for the active site of the particulate methane monooxygenase (pMMO). The ligands were designed to form the proper spatial and electronic geometry to harness a “singlet oxene,” according to the mechanism previously suggested by our laboratory. Consistent with the design strategy, both [CuICuICuI(L)]1+ reacted with dioxygen to form a putative bis(μ3-oxo)CuIICuIICuIII species, capable of facile O-atom insertion across the central CC bond of benzil and 2,3-butanedione at ambient temperature and pressure. These complexes also catalyze facile O-atom transfer to the CH bond of CH3CN to form glycolonitrile. These results, together with our recent biochemical studies on pMMO, provide support for our hypothesis that the hydroxylation site of pMMO contains a trinuclear copper cluster that mediates CH bond activation by a singlet oxene mechanism. PMID:17804786

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