Design of an interactive digital nutritional education package for elderly people.

PubMed

Ali, Nazlena Mohamad; Shahar, Suzana; Kee, You Lee; Norizan, Azir Rezha; Noah, Shahrul Azman Mohd

2012-12-01

Designing a system for the elderly is crucial, as aging is associated with physiological changes that may impair perception, cognition and other social aspects; therefore, many aspects need consideration, especially in interface design. This study was conducted to develop a digital nutritional education package (WE Sihat) by following appropriate guidelines for elderly people to achieve better design interface and interaction. Touch-screen technology was used as a platform for user interaction. The nutritional content was based on previous nutrition studies and a lifestyle education package on healthy aging, which contains four modules. The questionnaires were distributed to 31 Malay subjects aged 60-76 years old, containing an evaluation about the overall content, graphics, design layout, colour, font size, audio/video, user-perceived satisfaction and acceptance levels. The findings showed positive feedback and acceptance. Most subjects agreed that the digital nutritional education package can increase their nutritional knowledge for a healthy lifestyle and is easy to use. The touch-screen technology was also well accepted by elderly people and can be used as a kiosk for disseminating nutrition education for healthy aging.

Industrial packaging and assembly infrastructure for MOEMS

NASA Astrophysics Data System (ADS)

van Heeren, Henne

2004-01-01

In a mature industry all elements of the supply chain are available and are more or less in balance. Mainstream technologies are defined and well supported by a chain of specialist companies. Those specialist companies, offering services ranging from consultancy to manufacturing subcontracting, are an essential element in the industrialization. There specialization and dedication to one or a few elements in the technology increases professionalism and efficiency. The MOEMS industry however, is still in its infancy. After the birth and growth of many companies aiming at development of products, the appearance of companies aiming at the production of components and systems, we see know the first companies concentrating on the delivering of services to this industry. We can divide them in the like : * Design and Engineering companies * Foundries * Assembly and Packaging providers * Design and simulation software providers For manufacturing suppliers and customers the lack of industry standards and mainstream technologies is a serious drawback. Insight in availability and trends in technology is important to make the right choices in the field of industrialization and production. This awareness was the reason to perform a detailed study to the companies supplying commercial services in this field. This article focuses on one important part of this study: packaging and assembly. This tends to remain a bottleneck at the end of the design cycle, often delaying and sometimes preventing industrialization and commercialization. For nearly all MEMS/MST products literally everything comes together in the packaging and assembly. This is the area of full integration: electrical, mechanical, optical fluidic, magnetic etc. functionalities come together. The problems associated with the concentration of functionalities forms a big headache for the designer. Conflicting demands, of which functionality versus economics is only one, and technical hurdles have to overcome. Besides that, packaging and assembly is from nature application specific and solutions found are not always transferable from one product to another. But designers can often benefit from experience from other and general available technologies. A number of companies offer packaging and assembly services for MEMS/MST and this report give typical examples of those commercial services. The companies range from small start-ups, offering very specialized services, to large semiconductor packaging companies, having production lines for microsystem based products. Selecting the proper packaging method may tip the scales towards a product success or towards a product failure, while it nearly always present s a substantial part of the cost of the product. This is therefore is not a marginal concern, but a crucial part of the product design. The presentation will also address mayor trends and technologies. Finally, the article provides sufficient levels of classification and categorisation for various aspects for the technologies, in specific, and the industry, in general, to provide particularly useful insights into the activities and the developments in this market. With over 50 companies studied and assessed, it provides an up to date account of the state of this business and its future potential.

Body of Knowledge (BOK) for Leadless Quad Flat No-Lead/bottom Termination Components (QFN/BTC) Package Trends and Reliability

NASA Technical Reports Server (NTRS)

Ghaffarian, Reza

2014-01-01

Bottom terminated components and quad flat no-lead (BTC/QFN) packages have been extensively used by commercial industry for more than a decade. Cost and performance advantages and the closeness of the packages to the boards make them especially unique for radio frequency (RF) applications. A number of high-reliability parts are now available in this style of package configuration. This report presents a summary of literature surveyed and provides a body of knowledge (BOK) gathered on the status of BTC/QFN and their advanced versions of multi-row QFN (MRQFN) packaging technologies. The report provides a comprehensive review of packaging trends and specifications on design, assembly, and reliability. Emphasis is placed on assembly reliability and associated key design and process parameters because they show lower life than standard leaded package assembly under thermal cycling exposures. Inspection of hidden solder joints for assuring quality is challenging and is similar to ball grid arrays (BGAs). Understanding the key BTC/QFN technology trends, applications, processing parameters, workmanship defects, and reliability behavior is important when judicially selecting and narrowing the follow-on packages for evaluation and testing, as well as for the low risk insertion in high-reliability applications.

Body of Knowledge (BOK) for Leadless Quad Flat No-Lead/Bottom Termination Components (QFN/BTC) Package Trends and Reliability

NASA Technical Reports Server (NTRS)

Ghaffarian, Reza

2014-01-01

Bottom terminated components and quad flat no-lead (BTC/QFN) packages have been extensively used by commercial industry for more than a decade. Cost and performance advantages and the closeness of the packages to the boards make them especially unique for radio frequency (RF) applications. A number of high-reliability parts are now available in this style of package configuration. This report presents a summary of literature surveyed and provides a body of knowledge (BOK) gathered on the status of BTC/QFN and their advanced versions of multi-row QFN (MRQFN) packaging technologies. The report provides a comprehensive review of packaging trends and specifications on design, assembly, and reliability. Emphasis is placed on assembly reliability and associated key design and process parameters because they show lower life than standard leaded package assembly under thermal cycling exposures. Inspection of hidden solder joints for assuring quality is challenging and is similar to ball grid arrays (BGAs). Understanding the key BTC/QFN technology trends, applications, processing parameters, workmanship defects, and reliability behavior is important when judicially selecting and narrowing the follow-on packages for evaluation and testing, as well as for the low risk insertion in high-reliability applications.

Transmitter experiment package for the communications technology satellite

NASA Technical Reports Server (NTRS)

Farber, B.; Goldin, D. S.; Marcus, B.; Mock, P.

1977-01-01

The operating requirements, system design characteristics, high voltage packaging considerations, nonstandard components development, and test results for the transmitter experiment package (TEP) are described. The TEP is used for broadcasting power transmission from the Communications Technology Satellite. The TEP consists of a 12 GHz, 200-watt output stage tube (OST), a high voltage processing system that converts the unregulated spacecraft solar array power to the regulated voltages required for OST operation, and a variable conductance heat pipe system that is used to cool the OST body.

Technology Instructional Package Mediated Instruction and Senior Secondary School Students' Academic Performance in Biology Concepts

ERIC Educational Resources Information Center

Yaki, Akawo Angwal; Babagana, Mohammed

2016-01-01

The paper examined the effects of a Technological Instructional Package (TIP) on secondary school students' performance in biology. The study adopted a pre-test, post-test experimental control group design. The sample size of the study was 80 students from Minna metropolis, Niger state, Nigeria; the samples were randomly assigned into treatment…

(abstract) Electronic Packaging for Microspacecraft Applications

NASA Technical Reports Server (NTRS)

Wasler, David

1993-01-01

The intent of this presentation is to give a brief look into the future of electronic packaging for microspacecraft applications. Advancements in electronic packaging technology areas have developed to the point where a system engineer's visions, concepts, and requirements for a microspacecraft can now be a reality. These new developments are ideal candidates for microspacecraft applications. These technologies are capable of bringing about major changes in how we design future spacecraft while taking advantage of the benefits due to size, weight, power, performance, reliability , and cost. This presentation will also cover some advantages and limitations of surface mount technology (SMT), multichip modules (MCM), and wafer scale integration (WSI), and what is needed to implement these technologies into microspacecraft.

Modular avionics packaging standardization

NASA Astrophysics Data System (ADS)

Austin, M.; McNichols, J. K.

The Modular Avionics Packaging (MAP) Program for packaging future military avionics systems with the objective of improving reliability, maintainability, and supportability, and reducing equipment life cycle costs is addressed. The basic MAP packaging concepts called the Standard Avionics Module, the Standard Enclosure, and the Integrated Rack are summarized, and the benefits of modular avionics packaging, including low risk design, technology independence with common functions, improved maintainability and life cycle costs are discussed. Progress made in MAP is briefly reviewed.

Wafer-level vacuum/hermetic packaging technologies for MEMS

NASA Astrophysics Data System (ADS)

Lee, Sang-Hyun; Mitchell, Jay; Welch, Warren; Lee, Sangwoo; Najafi, Khalil

2010-02-01

An overview of wafer-level packaging technologies developed at the University of Michigan is presented. Two sets of packaging technologies are discussed: (i) a low temperature wafer-level packaging processes for vacuum/hermeticity sealing, and (ii) an environmentally resistant packaging (ERP) technology for thermal and mechanical control as well as vacuum packaging. The low temperature wafer-level encapsulation processes are implemented using solder bond rings which are first patterned on a cap wafer and then mated with a device wafer in order to encircle and encapsulate the device at temperatures ranging from 200 to 390 °C. Vacuum levels below 10 mTorr were achieved with yields in an optimized process of better than 90%. Pressures were monitored for more than 4 years yielding important information on reliability and process control. The ERP adopts an environment isolation platform in the packaging substrate. The isolation platform is designed to provide low power oven-control, vibration isolation and shock protection. It involves batch flip-chip assembly of a MEMS device onto the isolation platform wafer. The MEMS device and isolation structure are encapsulated at the wafer-level by another substrate with vertical feedthroughs for vacuum/hermetic sealing and electrical signal connections. This technology was developed for high performance gyroscopes, but can be applied to any type of MEMS device.

Recent trends and future of pharmaceutical packaging technology

PubMed Central

Zadbuke, Nityanand; Shahi, Sadhana; Gulecha, Bhushan; Padalkar, Abhay; Thube, Mahesh

2013-01-01

The pharmaceutical packaging market is constantly advancing and has experienced annual growth of at least five percent per annum in the past few years. The market is now reckoned to be worth over $20 billion a year. As with most other packaged goods, pharmaceuticals need reliable and speedy packaging solutions that deliver a combination of product protection, quality, tamper evidence, patient comfort and security needs. Constant innovations in the pharmaceuticals themselves such as, blow fill seal (BFS) vials, anti-counterfeit measures, plasma impulse chemical vapor deposition (PICVD) coating technology, snap off ampoules, unit dose vials, two-in-one prefilled vial design, prefilled syringes and child-resistant packs have a direct impact on the packaging. The review details several of the recent pharmaceutical packaging trends that are impacting packaging industry, and offers some predictions for the future. PMID:23833515

A TAPS Interactive Multimedia Package to Solve Engineering Dynamics Problem

ERIC Educational Resources Information Center

Sidhu, S. Manjit; Selvanathan, N.

2005-01-01

Purpose: To expose engineering students to using modern technologies, such as multimedia packages, to learn, visualize and solve engineering problems, such as in mechanics dynamics. Design/methodology/approach: A multimedia problem-solving prototype package is developed to help students solve an engineering problem in a step-by-step approach. A…

Packaging Technologies for 500 C SiC Electronics and Sensors: Challenges in Material Science and Technology

NASA Technical Reports Server (NTRS)

Chen, Liang-Yu; Neudeck, Philip G.; Behelm, Glenn M.; Spry, David J.; Meredith, Roger D.; Hunter, Gary W.

2015-01-01

This paper presents ceramic substrates and thick-film metallization based packaging technologies in development for 500C silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chip-level packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550C. The 96 alumina packaging system composed of chip-level packages and PCBs has been successfully tested with high temperature SiC discrete transistor devices at 500C for over 10,000 hours. In addition to tests in a laboratory environment, a SiC junction field-effect-transistor (JFET) with a packaging system composed of a 96 alumina chip-level package and an alumina printed circuit board was tested on low earth orbit for eighteen months via a NASA International Space Station experiment. In addition to packaging systems for electronics, a spark-plug type sensor package based on this high temperature interconnection system for high temperature SiC capacitive pressure sensors was also developed and tested. In order to further significantly improve the performance of packaging system for higher packaging density, higher operation frequency, power rating, and even higher temperatures, some fundamental material challenges must be addressed. This presentation will discuss previous development and some of the challenges in material science (technology) to improve high temperature dielectrics for packaging applications.

Development of multimedia resource and short courses for LRFD design.

DOT National Transportation Integrated Search

2011-03-01

Multimedia technology is an essential instrument in the development of graduate engineers. This : multimedia package provides an exclusive background and an in-depth understanding of the new : technological advances in the design of concrete, steel a...

Advanced Spacesuit Portable Life Support System Packaging Concept Mock-Up Design & Development

NASA Technical Reports Server (NTRS)

O''Connell, Mary K.; Slade, Howard G.; Stinson, Richard G.

1998-01-01

A concentrated development effort was begun at NASA Johnson Space Center to create an advanced Portable Life Support System (PLSS) packaging concept. Ease of maintenance, technological flexibility, low weight, and minimal volume are targeted in the design of future micro-gravity and planetary PLSS configurations. Three main design concepts emerged from conceptual design techniques and were carried forth into detailed design, then full scale mock-up creation. "Foam", "Motherboard", and "LEGOtm" packaging design concepts are described in detail. Results of the evaluation process targeted maintenance, robustness, mass properties, and flexibility as key aspects to a new PLSS packaging configuration. The various design tools used to evolve concepts into high fidelity mock ups revealed that no single tool was all encompassing, several combinations were complimentary, the devil is in the details, and, despite efforts, many lessons were learned only after working with hardware.

Development of high impedance measurement system for water leakage detection in implantable neuroprosthetic devices.

PubMed

Yousif, Aziz; Kelly, Shawn K

2016-08-01

There has been a push for a greater number of channels in implantable neuroprosthetic devices; but, that number has largely been limited by current hermetic packaging technology. Microfabricated packaging is becoming reality, but a standard testing system is needed to prepare these devices for clinical trials. Impedance measurements of electrodes built into the packaging layers may give an early warning of device failure and predict device lifetime. Because the impedance magnitudes of such devices can be on the order of gigaohms, a versatile system was designed to accommodate ultra-high impedances and allow future integrated circuit implementation in current neural prosthetic technologies. Here we present the circuitry, control software, and preliminary testing results of our designed system.

Literacity: A multimedia adult literacy package combining NASA technology, recursive ID theory, and authentic instruction theory

NASA Technical Reports Server (NTRS)

Willis, Jerry; Willis, Dee Anna; Walsh, Clare; Stephens, Elizabeth; Murphy, Timothy; Price, Jerry; Stevens, William; Jackson, Kevin; Villareal, James A.; Way, Bob

1994-01-01

An important part of NASA's mission involves the secondary application of its technologies in the public and private sectors. One current application under development is LiteraCity, a simulation-based instructional package for adults who do not have functional reading skills. Using fuzzy logic routines and other technologies developed by NASA's Information Systems Directorate and hypermedia sound, graphics, and animation technologies the project attempts to overcome the limited impact of adult literacy assessment and instruction by involving the adult in an interactive simulation of real-life literacy activities. The project uses a recursive instructional development model and authentic instruction theory. This paper describes one component of a project to design, develop, and produce a series of computer-based, multimedia instructional packages. The packages are being developed for use in adult literacy programs, particularly in correctional education centers. They use the concepts of authentic instruction and authentic assessment to guide development. All the packages to be developed are instructional simulations. The first is a simulation of 'finding a friend a job.'

Packaging Technologies for High Temperature Electronics and Sensors

NASA Technical Reports Server (NTRS)

Chen, Liang-Yu; Hunter, Gary W.; Neudeck, Philip G.; Beheim, Glenn M.; Spry, David J.; Meredith, Roger D.

2013-01-01

This paper reviews ceramic substrates and thick-film metallization based packaging technologies in development for 500 C silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chip-level packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550 C. A 96% alumina based edge connector for a PCB level subsystem interconnection has also been demonstrated recently. The 96% alumina packaging system composed of chip-level packages and PCBs has been tested with high temperature SiC devices at 500 C for over 10,000 hours. In addition to tests in a laboratory environment, a SiC JFET with a packaging system composed of a 96% alumina chip-level package and an alumina printed circuit board mounted on a data acquisition circuit board was launched as a part of the MISSE-7 suite to the International Space Station via a Shuttle mission. This packaged SiC transistor was successfully tested in orbit for eighteen months. A spark-plug type sensor package designed for high temperature SiC capacitive pressure sensors was developed. This sensor package combines the high temperature interconnection system with a commercial high temperature high pressure stainless steel seal gland (electrical feed-through). Test results of a packaged high temperature capacitive pressure sensor at 500 C are also discussed. In addition to the pressure sensor package, efforts for packaging high temperature SiC diode-based gas chemical sensors are in process.

Packaging Technologies for High Temperature Electronics and Sensors

NASA Technical Reports Server (NTRS)

Chen, Liangyu; Hunter, Gary W.; Neudeck, Philip G.; Beheim, Glenn M.; Spry, David J.; Meredith, Roger D.

2013-01-01

This paper reviews ceramic substrates and thick-film metallization based packaging technologies in development for 500degC silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chiplevel packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550degC. A 96% alumina based edge connector for a PCB level subsystem interconnection has also been demonstrated recently. The 96% alumina packaging system composed of chip-level packages and PCBs has been tested with high temperature SiC devices at 500degC for over 10,000 hours. In addition to tests in a laboratory environment, a SiC JFET with a packaging system composed of a 96% alumina chip-level package and an alumina printed circuit board mounted on a data acquisition circuit board was launched as a part of the MISSE-7 suite to the International Space Station via a Shuttle mission. This packaged SiC transistor was successfully tested in orbit for eighteen months. A spark-plug type sensor package designed for high temperature SiC capacitive pressure sensors was developed. This sensor package combines the high temperature interconnection system with a commercial high temperature high pressure stainless steel seal gland (electrical feed-through). Test results of a packaged high temperature capacitive pressure sensor at 500degC are also discussed. In addition to the pressure sensor package, efforts for packaging high temperature SiC diode-based gas chemical sensors are in process.

Packaging Technology Designed, Fabricated, and Assembled for High-Temperature SiC Microsystems

NASA Technical Reports Server (NTRS)

Chen, Liang-Yu

2003-01-01

A series of ceramic substrates and thick-film metalization-based prototype microsystem packages designed for silicon carbide (SiC) high-temperature microsystems have been developed for operation in 500 C harsh environments. These prototype packages were designed, fabricated, and assembled at the NASA Glenn Research Center. Both the electrical interconnection system and the die-attach scheme for this packaging system have been tested extensively at high temperatures. Printed circuit boards used to interconnect these chip-level packages and passive components also are being fabricated and tested. NASA space and aeronautical missions need harsh-environment, especially high-temperature, operable microsystems for probing the inner solar planets and for in situ monitoring and control of next-generation aeronautical engines. Various SiC high-temperature-operable microelectromechanical system (MEMS) sensors, actuators, and electronics have been demonstrated at temperatures as high as 600 C, but most of these devices were demonstrated only in the laboratory environment partially because systematic packaging technology for supporting these devices at temperatures of 500 C and beyond was not available. Thus, the development of a systematic high-temperature packaging technology is essential for both in situ testing and the commercialization of high-temperature SiC MEMS. Researchers at Glenn developed new prototype packages for high-temperature microsystems using ceramic substrates (aluminum nitride and 96- and 90-wt% aluminum oxides) and gold (Au) thick-film metalization. Packaging components, which include a thick-film metalization-based wirebond interconnection system and a low-electrical-resistance SiC die-attachment scheme, have been tested at temperatures up to 500 C. The interconnection system composed of Au thick-film printed wire and 1-mil Au wire bond was tested in 500 C oxidizing air with and without 50-mA direct current for over 5000 hr. The Au thick-film metalization-based wirebond electrical interconnection system was also tested in an extremely dynamic thermal environment to assess thermal reliability. The I-V curve1 of a SiC high-temperature diode was measured in oxidizing air at 500 C for 1000 hr to electrically test the Au thick-film material-based die-attach assembly.

Technology transfer package on seismic base isolation - Volume II

DOE Office of Scientific and Technical Information (OSTI.GOV)

NONE

1995-02-14

This Technology Transfer Package provides some detailed information for the U.S. Department of Energy (DOE) and its contractors about seismic base isolation. Intended users of this three-volume package are DOE Design and Safety Engineers as well as DOE Facility Managers who are responsible for reducing the effects of natural phenomena hazards (NPH), specifically earthquakes, on their facilities. The package was developed as part of DOE's efforts to study and implement techniques for protecting lives and property from the effects of natural phenomena and to support the International Decade for Natural Disaster Reduction. Volume II contains the proceedings for the Shortmore » Course on Seismic Base Isolation held in Berkeley, California, August 10-14, 1992.« less

Test program for transmitter experiment package and heat pipe system for the communications technology satellite

NASA Technical Reports Server (NTRS)

Depauw, J. F.; Reader, K. E.; Staskus, J. V.

1976-01-01

The test program is described for the 200 watt transmitter experiment package and the variable conductance heat pipe system which are components of the high-power transponder aboard the Communications Technology Satellite. The program includes qualification tests to demonstrate design adequacy, acceptance tests to expose latent defects in flight hardware, and development tests to integrate the components into the transponder system and to demonstrate compatibility.

From Amorphous to Defined: Balancing the Risks of Spiral Development

DTIC Science & Technology

2007-04-30

630 675 720 765 810 855 900 Time (Week) Work started and active PhIt [Requirements,Iter1] : JavelinCalibration work packages1 1 1 Work started and...active PhIt [Technology,Iter1] : JavelinCalibration work packages2 2 2 Work started and active PhIt [Design,Iter1] : JavelinCalibration work packages3 3 3 3...Work started and active PhIt [Manufacturing,Iter1] : JavelinCalibration work packages4 4 Work started and active PhIt [Use,Iter1] : JavelinCalibration

Original Courseware for Introductory Psychology: Implementation and Evaluation.

ERIC Educational Resources Information Center

Slotnick, Robert S.

1988-01-01

Describes the implementation and field testing of PsychWare, a courseware package for introductory psychology developed and field tested at New York Institute of Technology. Highlights include the courseware package (10 software programs, a faculty manual, and a student workbook), and instructional design features (simulations, real-time…

Low-cost CWDM transmitter package

NASA Astrophysics Data System (ADS)

Bhandarkar, Navin; Castillega, Jaime

2005-03-01

A low-cost coarse-wavelength-division multiplexer (CWDM) transmitter that combines four channels (wavelengths) in the infrared spectrum (~1310 nm) in a small form-factor un-cooled package is demonstrated. The package utilizes precision molded optics to multiplex beams from four grating-outcoupled surface-emitting (GSE) lasers into a single beam suitable for coupling into multimode fiber. This paper summarizes the optical and opto-mechanical design, fabrication and assembly of prototypes, and optical, thermal and electrical measurement results of the prototypes. This unique design enables multiplexing of wavelengths without the use of filters, waveguides, couplers and fiber splicing. Commercial fabrication and alignment technology is used to manufacture the package, resulting in a more robust, reliable and low-cost transmitter. The transmitter package is enabled by the unique characteristics of the long-wavelength GSE laser.

Packaging Technology Developed for High-Temperature Silicon Carbide Microsystems

NASA Technical Reports Server (NTRS)

Chen, Liang-Yu; Hunter, Gary W.; Neudeck, Philip G.

2001-01-01

High-temperature electronics and sensors are necessary for harsh-environment space and aeronautical applications, such as sensors and electronics for space missions to the inner solar system, sensors for in situ combustion and emission monitoring, and electronics for combustion control for aeronautical and automotive engines. However, these devices cannot be used until they can be packaged in appropriate forms for specific applications. Suitable packaging technology for operation temperatures up to 500 C and beyond is not commercially available. Thus, the development of a systematic high-temperature packaging technology for SiC-based microsystems is essential for both in situ testing and commercializing high-temperature SiC sensors and electronics. In response to these needs, researchers at Glenn innovatively designed, fabricated, and assembled a new prototype electronic package for high-temperature electronic microsystems using ceramic substrates (aluminum nitride and aluminum oxide) and gold (Au) thick-film metallization. Packaging components include a ceramic packaging frame, thick-film metallization-based interconnection system, and a low electrical resistance SiC die-attachment scheme. Both the materials and fabrication process of the basic packaging components have been tested with an in-house-fabricated SiC semiconductor test chip in an oxidizing environment at temperatures from room temperature to 500 C for more than 1000 hr. These test results set lifetime records for both high-temperature electronic packaging and high-temperature electronic device testing. As required, the thick-film-based interconnection system demonstrated low (2.5 times of the room-temperature resistance of the Au conductor) and stable (decreased 3 percent in 1500 hr of continuous testing) electrical resistance at 500 C in an oxidizing environment. Also as required, the electrical isolation impedance between printed wires that were not electrically joined by a wire bond remained high (greater than 0.4 GW) at 500 C in air. The attached SiC diode demonstrated low (less than 3.8 W/mm2) and relatively consistent dynamic resistance from room temperature to 500 C. These results indicate that the prototype package and the compatible die-attach scheme meet the initial design standards for high-temperature, low-power, and long-term operation. This technology will be further developed and evaluated, especially with more mechanical tests of each packaging element for operation at higher temperatures and longer lifetimes.

Technology and design of an active-matrix OLED on crystalline silicon direct-view display for a wristwatch computer

NASA Astrophysics Data System (ADS)

Sanford, James L.; Schlig, Eugene S.; Prache, Olivier; Dove, Derek B.; Ali, Tariq A.; Howard, Webster E.

2002-02-01

The IBM Research Division and eMagin Corp. jointly have developed a low-power VGA direct view active matrix OLED display, fabricated on a crystalline silicon CMOS chip. The display is incorporated in IBM prototype wristwatch computers running the Linus operating system. IBM designed the silicon chip and eMagin developed the organic stack and performed the back-end-of line processing and packaging. Each pixel is driven by a constant current source controlled by a CMOS RAM cell, and the display receives its data from the processor memory bus. This paper describes the OLED technology and packaging, and outlines the design of the pixel and display electronics and the processor interface. Experimental results are presented.

Hybrid Propulsion Technology Program, phase 1. Volume 1: Executive summary

NASA Technical Reports Server (NTRS)

1989-01-01

The study program was contracted to evaluate concepts of hybrid propulsion, select the most optimum, and prepare a conceptual design package. Further, this study required preparation of a technology definition package to identify hybrid propulsion enabling technologies and planning to acquire that technology in Phase 2 and demonstrate that technology in Phase 3. Researchers evaluated two design philosophies for Hybrid Rocket Booster (HRB) selection. The first is an ASRM modified hybrid wherein as many components/designs as possible were used from the present Advanced Solid Rocket Motor (ASRM) design. The second was an entirely new hybrid optimized booster using ASRM criteria as a point of departure, i.e., diameter, thrust time curve, launch facilities, and external tank attach points. Researchers selected the new design based on the logic of optimizing a hybrid booster to provide NASA with a next generation vehicle in lieu of an interim advancement over the ASRM. The enabling technologies for hybrid propulsion are applicable to either and vehicle design may be selected at a downstream point (Phase 3) at NASA's discretion. The completion of these studies resulted in ranking the various concepts of boosters from the RSRM to a turbopump fed (TF) hybrid. The scoring resulting from the Figure of Merit (FOM) scoring system clearly shows a natural growth path where the turbopump fed solid liquid staged combustion hybrid provides maximized payload and the highest safety, reliability, and low life cycle costing.

1998 IEEE Aerospace Conference. Proceedings.

NASA Astrophysics Data System (ADS)

The following topics were covered: science frontiers and aerospace; flight systems technologies; spacecraft attitude determination and control; space power systems; smart structures and dynamics; military avionics; electronic packaging; MEMS; hyperspectral remote sensing for GVP; space laser technology; pointing, control, tracking and stabilization technologies; payload support technologies; protection technologies; 21st century space mission management and design; aircraft flight testing; aerospace test and evaluation; small satellites and enabling technologies; systems design optimisation; advanced launch vehicles; GPS applications and technologies; antennas and radar; software and systems engineering; scalable systems; communications; target tracking applications; remote sensing; advanced sensors; and optoelectronics.

Satellite Power Systems (SPS) concept definition study (Exhibit D). Volume 5: Systems engineering/integration research and technology

NASA Technical Reports Server (NTRS)

Hanley, G. M.

1981-01-01

Guidelines and ground rules followed in the development of requirements for the SPS are presented. Development planning objectives are specified in each of these areas, and evolutionary SPS program scenarios are described for the various concepts studied during the past one year contract. Program descriptions are presented as planning packages of technical tasks, and schedule phasing. Each package identifies the ground based technology effort that will facilitate SPS definitions, designs, development, and operations.

Too Little Too Soon? Modeling the Risks of Spiral Development

DTIC Science & Technology

2007-04-30

270 315 360 405 450 495 540 585 630 675 720 765 810 855 900 Time (Week) Work started and active PhIt [Requirements,Iter1] : JavelinCalibration work...packages1 1 1 Work started and active PhIt [Technology,Iter1] : JavelinCalibration work packages2 2 2 Work started and active PhIt [Design,Iter1...JavelinCalibration work packages3 3 3 3 Work started and active PhIt [Manufacturing,Iter1] : JavelinCalibration work packages4 4 Work started and active PhIt

Facilitating hydrological data analysis workflows in R: the RHydro package

NASA Astrophysics Data System (ADS)

Buytaert, Wouter; Moulds, Simon; Skoien, Jon; Pebesma, Edzer; Reusser, Dominik

2015-04-01

The advent of new technologies such as web-services and big data analytics holds great promise for hydrological data analysis and simulation. Driven by the need for better water management tools, it allows for the construction of much more complex workflows, that integrate more and potentially more heterogeneous data sources with longer tool chains of algorithms and models. With the scientific challenge of designing the most adequate processing workflow comes the technical challenge of implementing the workflow with a minimal risk for errors. A wide variety of new workbench technologies and other data handling systems are being developed. At the same time, the functionality of available data processing languages such as R and Python is increasing at an accelerating pace. Because of the large diversity of scientific questions and simulation needs in hydrology, it is unlikely that one single optimal method for constructing hydrological data analysis workflows will emerge. Nevertheless, languages such as R and Python are quickly gaining popularity because they combine a wide array of functionality with high flexibility and versatility. The object-oriented nature of high-level data processing languages makes them particularly suited for the handling of complex and potentially large datasets. In this paper, we explore how handling and processing of hydrological data in R can be facilitated further by designing and implementing a set of relevant classes and methods in the experimental R package RHydro. We build upon existing efforts such as the sp and raster packages for spatial data and the spacetime package for spatiotemporal data to define classes for hydrological data (HydroST). In order to handle simulation data from hydrological models conveniently, a HM class is defined. Relevant methods are implemented to allow for an optimal integration of the HM class with existing model fitting and simulation functionality in R. Lastly, we discuss some of the design challenges of the RHydro package, including integration with big data technologies, web technologies, and emerging data models in hydrology.

The results of pre-design studies on the development of a new design of gas turbine compressor package of GPA-C-16 type

NASA Astrophysics Data System (ADS)

Smirnov, A. V.; Chobenko, V. M.; Shcherbakov, O. M.; Ushakov, S. M.; Parafiynyk, V. P.; Sereda, R. M.

2017-08-01

The article summarizes the results of analysis of data concerning the operation of turbocompressor packages at compressor stations for the natural gas transmission system of Ukraine. The basic requirements for gas turbine compressor packages used for modernization and reconstruction of compressor stations are considered. Using a 16 MW gas turbine package GPA-C-16S/76-1,44M1 as an example, the results of pre-design studies and some technical solutions that improve the energy efficiency of gas turbine compressor packages and their reliability, as well as its environmental performance are given. In particular, the article deals with the matching of performance characteristics of a centrifugal compressor (hereinafter compressor) and gas turbine drive to reduce fuel gas consumption; as well as application of energy efficient technologies, in particular, exhaust gas heat recovery units and gas-oil heat exchangers in turbocompressor packages oil system; as well as reducing emissions of carbon monoxide into the atmosphere using a catalytic exhaust system. Described technical solutions can be used for development of other types of gas turbine compressor packages.

Design automation for complex CMOS/SOS LSI hybrid substrates

NASA Technical Reports Server (NTRS)

Ramondetta, P. W.; Smiley, J. W.

1976-01-01

A design automated approach used to develop thick-film hybrid packages is described. The hybrid packages produced combine thick-film and silicon on sapphire (SOS) laser surface interaction technologies to bring the on-chip performance level of SOS to the subsystem level. Packing densities are improved by a factor of eight over ceramic dual in-line packing; interchip wiring capacitance is low. Due to significant time savings, the design automated approach presented can be expected to yield a 3:1 reduction in cost over the use of manual methods for the initial design of a hybrid.

PICSiP: new system-in-package technology using a high bandwidth photonic interconnection layer for converged microsystems

NASA Astrophysics Data System (ADS)

Tekin, Tolga; Töpper, Michael; Reichl, Herbert

2009-05-01

Technological frontiers between semiconductor technology, packaging, and system design are disappearing. Scaling down geometries [1] alone does not provide improvement of performance, less power, smaller size, and lower cost. It will require "More than Moore" [2] through the tighter integration of system level components at the package level. System-in-Package (SiP) will deliver the efficient use of three dimensions (3D) through innovation in packaging and interconnect technology. A key bottleneck to the implementation of high-performance microelectronic systems, including SiP, is the lack of lowlatency, high-bandwidth, and high density off-chip interconnects. Some of the challenges in achieving high-bandwidth chip-to-chip communication using electrical interconnects include the high losses in the substrate dielectric, reflections and impedance discontinuities, and susceptibility to crosstalk [3]. Obviously, the incentive for the use of photonics to overcome the challenges and leverage low-latency and highbandwidth communication will enable the vision of optical computing within next generation architectures. Supercomputers of today offer sustained performance of more than petaflops, which can be increased by utilizing optical interconnects. Next generation computing architectures are needed with ultra low power consumption; ultra high performance with novel interconnection technologies. In this paper we will discuss a CMOS compatible underlying technology to enable next generation optical computing architectures. By introducing a new optical layer within the 3D SiP, the development of converged microsystems, deployment for next generation optical computing architecture will be leveraged.

Identification of New Potential Scientific and Technology Areas for DoD Application. Summary of Activities

DTIC Science & Technology

1986-07-31

designer will be able to more rapid- ly assemble a total software package from perfected modules that can be easily de - bugged or replaced with more...antinuclear interactions e. gravitational effects of antimatter 2. possible machine parameters and lattice design 3. electron and stochastic cooling needs 4...implementation, reliability requirements; development of design environments and of experimental methodology; technology transfer methods from

Joint Services Electronics Program.

DTIC Science & Technology

1993-03-05

Mary- land, June 1992. Interconnection Network Design Based on Packaging Considerations Professor Abhiram Ranade with M. T. Raghunath A central...characterized by our abstract models of packaging technology. JSEP Publications [1] M.T. Raghunath and Abhiram Ranade, "Customizing Interconnection...94720, January 1993. [21 M.T. Raghunath and Abhiram Ranade, "Fault-Tolerant Routing in Partitioned Butterfly Networks," submitted to the 1993

Overview of NASA Langley's Piezoelectric Ceramic Packaging Technology and Applications

NASA Technical Reports Server (NTRS)

Bryant, Robert G.

2007-01-01

Over the past decade, NASA Langley Research Center (LaRC) has developed several actuator packaging concepts designed to enhance the performance of commercial electroactive ceramics. NASA LaRC focused on properly designed actuator and sensor packaging for the following reasons, increased durability, protect the working material from the environment, allow for proper mechanical and electrical contact, afford "ready to use" mechanisms that are scalable, and develop fabrication methodology applicable to any active material of the same physical class. It is more cost effective to enhance or tailor the performance of existing systems, through innovative packaging, than to develop, test and manufacture new materials. This approach led to the development of several solid state actuators that include THUNDER, the Macrofiber Composite or (MFC) and the Radial Field Diaphragm or (RFD). All these actuators are fabricated using standard materials and processes derived from earlier concepts. NASA s fabrication and packaging technology as yielded, piezoelectric actuators and sensors that are easy to implement, reliable, consistent in properties, and of lower cost to manufacture in quantity, than their predecessors (as evidenced by their continued commercial availability.) These piezoelectric actuators have helped foster new research and development in areas involving computational modeling, actuator specific refinements, and engineering system redesign which led to new applications for piezo-based devices that replace traditional systems currently in use.

A multimedia adult literacy program: Combining NASA technology, instructional design theory, and authentic literacy concepts

NASA Technical Reports Server (NTRS)

Willis, Jerry W.

1993-01-01

For a number of years, the Software Technology Branch of the Information Systems Directorate has been involved in the application of cutting edge hardware and software technologies to instructional tasks related to NASA projects. The branch has developed intelligent computer aided training shells, instructional applications of virtual reality and multimedia, and computer-based instructional packages that use fuzzy logic for both instructional and diagnostic decision making. One outcome of the work on space-related technology-supported instruction has been the creation of a significant pool of human talent in the branch with current expertise on the cutting edges of instructional technologies. When the human talent is combined with advanced technologies for graphics, sound, video, CD-ROM, and high speed computing, the result is a powerful research and development group that both contributes to the applied foundations of instructional technology and creates effective instructional packages that take advantage of a range of advanced technologies. Several branch projects are currently underway that combine NASA-developed expertise to significant instructional problems in public education. The branch, for example, has developed intelligent computer aided software to help high school students learn physics and staff are currently working on a project to produce educational software for young children with language deficits. This report deals with another project, the adult literacy tutor. Unfortunately, while there are a number of computer-based instructional packages available for adult literacy instruction, most of them are based on the same instructional models that failed these students when they were in school. The teacher-centered, discrete skill and drill-oriented, instructional strategies, even when they are supported by color computer graphics and animation, that form the foundation for most of the computer-based literacy packages currently on the market may not be the most effective or most desirable way to use computer technology in literacy programs. This project is developing a series of instructional packages that are based on a different instructional model - authentic instruction. The instructional development model used to create these packages is also different. Instead of using the traditional five stage linear, sequential model based on behavioral learning theory, the project uses the recursive, reflective design and development model (R2D2) that is based on cognitive learning theory, particularly the social constructivism of Vygotsky, and an epistemology based on critical theory. Using alternative instructional and instructional development theories, the result of the summer faculty fellowship is LiteraCity, a multimedia adult literacy instructional package that is a simulation of finding and applying for a job. The program, which is about 120 megabytes, is distributed on CD-ROM.

Non-Volatile Memory Technology Symposium 2000: Proceedings

NASA Technical Reports Server (NTRS)

Aranki, Nazeeh (Editor)

2000-01-01

This publication contains the proceedings for the Non-Volatile Memory Technology Symposium 2000 that was held on November 15-16, 2000 in Arlington, Virginia. The proceedings contains a wide range of papers that cover the presentations of myriad advances in the nonvolatile memory technology during the recent past including memory cell design, simulations, radiation environment, and emerging memory technologies. The papers presented in the proceedings address the design challenges and applications and deals with newer, emerging memory technologies as well as related issues of radiation environment and die packaging.

Merging parallel optics packaging and surface mount technologies

NASA Astrophysics Data System (ADS)

Kopp, Christophe; Volpert, Marion; Routin, Julien; Bernabé, Stéphane; Rossat, Cyrille; Tournaire, Myriam; Hamelin, Régis

2008-02-01

Optical links are well known to present significant advantages over electrical links for very high-speed data rate at 10Gpbs and above per channel. However, the transition towards optical interconnects solutions for short and very short reach applications requires the development of innovative packaging solutions that would deal with very high volume production capability and very low cost per unit. Moreover, the optoelectronic transceiver components must be able to move from the edge to anywhere on the printed circuit board, for instance close to integrated circuits with high speed IO. In this paper, we present an original packaging design to manufacture parallel optic transceivers that are surface mount devices. The package combines highly integrated Multi-Chip-Module on glass and usual IC ceramics packaging. The use of ceramic and the development of sealing technologies achieve hermetic requirements. Moreover, thanks to a chip scale package approach the final device exhibits a much minimized footprint. One of the main advantages of the package is its flexibility to be soldered or plugged anywhere on the printed circuit board as any other electronic device. As a demonstrator we present a 2 by 4 10Gbps transceiver operating at 850nm.

Conceptual definition of a high voltage power supply test facility

NASA Technical Reports Server (NTRS)

Biess, John J.; Chu, Teh-Ming; Stevens, N. John

1989-01-01

NASA Lewis Research Center is presently developing a 60 GHz traveling wave tube for satellite cross-link communications. The operating voltage for this new tube is - 20 kV. There is concern about the high voltage insulation system and NASA is planning a space station high voltage experiment that will demonstrate both the 60 GHz communications and high voltage electronics technology. The experiment interfaces, requirements, conceptual design, technology issues and safety issues are determined. A block diagram of the high voltage power supply test facility was generated. It includes the high voltage power supply, the 60 GHz traveling wave tube, the communications package, the antenna package, a high voltage diagnostics package and a command and data processor system. The interfaces with the space station and the attached payload accommodations equipment were determined. A brief description of the different subsystems and a discussion of the technology development needs are presented.

Computer Applications in the Design Process.

ERIC Educational Resources Information Center

Winchip, Susan

Computer Assisted Design (CAD) and Computer Assisted Manufacturing (CAM) are emerging technologies now being used in home economics and interior design applications. A microcomputer in a computer network system is capable of executing computer graphic functions such as three-dimensional modeling, as well as utilizing office automation packages to…

The Development of a Framework for and a Model Teaching-Learning System in Electronics Technology for the Elementary School.

ERIC Educational Resources Information Center

Inaba, Lawrence Akio

Developing a rationale and a structure of knowledge as the basis for an instructional system in electronics technology and designing and developing a packaged instructional system in electronics technology for the sixth grade is the two-fold purpose of this study. The study identifies electronics technology within the broad framework of industrial…

Educational Technology Project, Volume One. The Development of Materials for the Training of Science Education Personnel in Educational Technology. Final Report.

ERIC Educational Resources Information Center

Ziener, George H.; And Others

The planning, production, validation, and revision of learning materials designed for use in institutes for science supervisors is described in this first of five volumes. Four sets of packages, ("Role of the Science Supervisor,""Introduction to Educational Technology,""An Application of Educational Technology," and "Management Kits,") each using…

Webs Wires Waves: The Science & Technology of Communication. National Science and Technology Week, April 20-26, 1997.

ERIC Educational Resources Information Center

National Science Foundation, Arlington, VA.

This collection of activities revolves around the theme of National Science and Technology Week (NSTW). The six 8-page booklets that make up this package present activities that follow a pathway from natural, simple forms of communication toward increasingly complex and technological forms. They are designed to be undertaken in sequence, but can…

Context-Adaptive Learning Designs by Using Semantic Web Services

ERIC Educational Resources Information Center

Dietze, Stefan; Gugliotta, Alessio; Domingue, John

2007-01-01

IMS Learning Design (IMS-LD) is a promising technology aimed at supporting learning processes. IMS-LD packages contain the learning process metadata as well as the learning resources. However, the allocation of resources--whether data or services--within the learning design is done manually at design-time on the basis of the subjective appraisals…

A Survey of CAD/CAM Technology Applications in the U.S. Shipbuilding Industry

DTIC Science & Technology

1984-01-01

operation for drafting. Computer Aided Engineering (CAE) analysis is used primarily to determine the validity of design characteristics and produc- tion...include time standard generation, sea trial analysis , and group Systems integration While no systems surveyed Aided Design (CAD) is the technology... analysis . is the largest problem involving software packages. are truly integrated, many are interfaced. Computer most interfaced category with links

Critical review of controlled release packaging to improve food safety and quality.

PubMed

Chen, Xi; Chen, Mo; Xu, Chenyi; Yam, Kit L

2018-03-19

Controlled release packaging (CRP) is an innovative technology that uses the package to release active compounds in a controlled manner to improve safety and quality for a wide range of food products during storage. This paper provides a critical review of the uniqueness, design considerations, and research gaps of CRP, with a focus on the kinetics and mechanism of active compounds releasing from the package. Literature data and practical examples are presented to illustrate how CRP controls what active compounds to release, when and how to release, how much and how fast to release, in order to improve food safety and quality.

A fast new cadioptric design for fiber-fed spectrographs

NASA Astrophysics Data System (ADS)

Saunders, Will

2012-09-01

The next generation of massively multiplexed multi-object spectrographs (DESpec, SUMIRE, BigBOSS, 4MOST, HECTOR) demand fast, efficient and affordable spectrographs, with higher resolutions (R = 3000-5000) than current designs. Beam-size is a (relatively) free parameter in the design, but the properties of VPH gratings are such that, for fixed resolution and wavelength coverage, the effect on beam-size on overall VPH efficiency is very small. For alltransmissive cameras, this suggests modest beam-sizes (say 80-150mm) to minimize costs; while for cadioptric (Schmidt-type) cameras, much larger beam-sizes (say 250mm+) are preferred to improve image quality and to minimize obstruction losses. Schmidt designs have benefits in terms of image quality, camera speed and scattered light performance, and recent advances such as MRF technology mean that the required aspherics are no longer a prohibitive cost or risk. The main objections to traditional Schmidt designs are the inaccessibility of the detector package, and the loss in throughput caused by it being in the beam. With expected count rates and current read-noise technology, the gain in camera speed allowed by Schmidt optics largely compensates for the additional obstruction losses. However, future advances in readout technology may erase most of this compensation. A new Schmidt/Maksutov-derived design is presented, which differs from previous designs in having the detector package outside the camera, and adjacent to the spectrograph pupil. The telescope pupil already contains a hole at its center, because of the obstruction from the telescope top-end. With a 250mm beam, it is possible to largely hide a 6cm × 6cm detector package and its dewar within this hole. This means that the design achieves a very high efficiency, competitive with transmissive designs. The optics are excellent, as least as good as classic Schmidt designs, allowing F/1.25 or even faster cameras. The principal hardware has been costed at $300K per arm, making the design affordable.

ERTS-C (Landsat 3) cryogenic heat pipe experiment definition

NASA Technical Reports Server (NTRS)

Brennan, P. J.; Kroliczek, E. J.

1975-01-01

A flight experiment designed to demonstrate current cryogenic heat pipe technology was defined and evaluated. The experiment package developed is specifically configured for flight aboard an ERTS type spacecraft. Two types of heat pipes were included as part of the experiment package: a transporter heat pipe and a thermal diode heat pipe. Each was tested in various operating modes. Performance data obtained from the experiment are applicable to the design of cryogenic systems for detector cooling, including applications where periodic high cooler temperatures are experienced as a result of cyclic energy inputs.

Market packages.

DOT National Transportation Integrated Search

1997-09-11

Safety is a major goal of the National Intelligent Transportation System (ITS) Program. To promote safety, the Federal Highway Administration (FHWA) funded several field operational tests to evaluate technologies designed to decrease transportation r...

Packaging Technology for SiC High Temperature Circuits Operable up to 500 Degrees Centigrade

NASA Technical Reports Server (NTRS)

Chen, Lian-Yu

2002-01-01

New high temperature low power 8-pin packages have been fabricated using commercial fabrication service. These packages are made of aluminum nitride and 96 percent alumina with Au metallization. The new design of these packages provides the chips inside with EM shielding. Wirebond geometry control has been achieved for precise mechanical tests. Au wirebond samples with 45 degree heel-angle have been tested using wireloop test module. The geometry control improves the consistency of measurement of the wireloop breaking point.Also reported on is a parametric study of the thermomechanical reliability of a Au thick-film based SiC die-attach assembly using nonlinear finite element analysis (FEA) was conducted to optimize the die-attach thermo-mechanical performance for operation at temperatures from room temperature to 500 degrees Centigrade. This parametric study centered on material selection, structure design and process control.

Design and fabrication of a foldable 3D silicon based package for solid state lighting applications

NASA Astrophysics Data System (ADS)

Sokolovskij, R.; Liu, P.; van Zeijl, H. W.; Mimoun, B.; Zhang, G. Q.

2015-05-01

Miniaturization of solid state lighting (SSL) luminaires as well as reduction of packaging and assembly costs are of prime interest for the SSL lighting industry. A novel silicon based LED package for lighting applications is presented in this paper. The proposed design consists of 5 rigid Si tiles connected by flexible polyimide hinges with embedded interconnects (ICs). Electrical, optical and thermal characteristics were taken into consideration during design. The fabrication process involved polyimide (PI) application and patterning, aluminium interconnect integration in the flexible hinge, LED reflector cavity formation and metalization followed by through wafer DRIE etching for chip formation and release. A method to connect chip front to backside without TSVs was also integrated into the process. Post-fabrication wafer level assembly included LED mounting and wirebond, phosphor-based colour conversion and silicone encapsulation. The package formation was finalized by vacuum assisted wrapping around an assembly structure to form a 3D geometry, which is beneficial for omnidirectional lighting. Bending tests were performed on the flexible ICs and optical performance at different temperatures was evaluated. It is suggested that 3D packages can be expanded to platforms for miniaturized luminaire applications by combining monolithic silicon integration and system-in-package (SiP) technologies.

Recent Developments in Film and Gas Research in Modified Atmosphere Packaging of Fresh Foods.

PubMed

Zhang, Min; Meng, Xiangyong; Bhandari, Bhesh; Fang, Zhongxiang

2016-10-02

Due to the rise of consumer's awareness of fresh foods to health, in the past few years, the consumption of fresh and fresh-cut produces has increased sturdily. Modified atmosphere packaging (MAP) possesses a potential to become one of the most appropriate technologies for packaging fresh and fresh-cut produces. The MAP has advantages of extending the shelf-life, preserving or stabilizing the desired properties of fresh produces, and convenience in handing and distribution. The success of MAP-fresh foods depends on many factors including types of fresh foods, storage temperature and humidity, gas composition, and the characteristics of package materials. This paper reviews the recent developments highlighting the most critical factors of film and gas on the quality of MAP fresh foods. Although the innovations and development of food packaging technology will continue to promote the development of novel MAP, concentrated research and endeavors from scientists and engineers are still important to the development of MAP that focuses on consumers' requirements, enhancing product quality, environmental friendly design, and cost-effective application.

CSP Manufacturing Challenges and Assembly Reliability

NASA Technical Reports Server (NTRS)

Ghaffarian, Reza

2000-01-01

Although the expression of CSP is widely used by industry from suppliers to users, its implied definition had evolved as the technology has matured. There are "expert definition"- package that is up to 1.5 time die- or "interim definition". CSPs are miniature new packages that industry is starting to implement and there are many unresolved technical issues associated with their implementation. For example, in early 1997, packages with 1 mm pitch and lower were the dominant CSPs, whereas in early 1998 packages with 0.8 mm and lower became the norm for CSPs. Other changes included the use of flip chip die rather than wire bond in CSP. Nonetheless the emerging CSPs are competing with bare die assemblies and are becoming the package of choice for size reduction applications. These packages provide the benefits of small size and performance of the bare die or flip chip, with the advantage of standard die packages. The JPL-led MicrotypeBGA Consortium of enterprises representing government agencies and private companies have jointed together to pool in-kind resources for developing the quality and reliability of chip scale packages (CSPs) for a variety of projects. This talk will cover specifically the experience of our consortium on technology implementation challenges, including design and build of both standard and microvia boards, assembly of two types of test vehicles, and the most current environmental thermal cycling test results.

Antimicrobial activity of biodegradable polysaccharide and protein-based films containing active agents.

PubMed

Kuorwel, Kuorwel K; Cran, Marlene J; Sonneveld, Kees; Miltz, Joseph; Bigger, Stephen W

2011-04-01

Significant interest has emerged in the introduction of food packaging materials manufactured from biodegradable polymers that have the potential to reduce the environmental impacts associated with conventional packaging materials. Current technologies in active packaging enable effective antimicrobial (AM) packaging films to be prepared from biodegradable materials that have been modified and/or blended with different compatible materials and/or plasticisers. A wide range of AM films prepared from modified biodegradable materials have the potential to be used for packaging of various food products. This review examines biodegradable polymers derived from polysaccharides and protein-based materials for their potential use in packaging systems designed for the protection of food products from microbial contamination. A comprehensive table that systematically analyses and categorizes much of the current literature in this area is included in the review.

Fresh meat packaging: consumer acceptance of modified atmosphere packaging including carbon monoxide.

PubMed

Grebitus, Carola; Jensen, Helen H; Roosen, Jutta; Sebranek, Joseph G

2013-01-01

Consumers' perceptions and evaluations of meat quality attributes such as color and shelf life influence purchasing decisions, and these product attributes can be affected by the type of fresh meat packaging system. Modified atmosphere packaging (MAP) extends the shelf life of fresh meat and, with the inclusion of carbon monoxide (CO-MAP), achieves significant color stabilization. The objective of this study was to assess whether consumers would accept specific packaging technologies and what value consumers place on ground beef packaged under various atmospheres when their choices involved the attributes of color and shelf life. The study used nonhypothetical consumer choice experiments to determine the premiums that consumers are willing to pay for extended shelf life resulting from MAP and for the "cherry red" color in meat resulting from CO-MAP. The experimental design allowed determination of whether consumers would discount foods with MAP or CO-MAP when (i) they are given more detailed information about the technologies and (ii) they have different levels of individual knowledge and media exposure. The empirical analysis was conducted using multinomial logit models. Results indicate that consumers prefer an extension of shelf life as long as the applied technology is known and understood. Consumers had clear preferences for brighter (aerobic and CO) red color and were willing to pay $0.16/lb ($0.35/kg) for each level of change to the preferred color. More information on MAP for extending the shelf life and on CO-MAP for stabilizing color decreased consumers' willingness to pay. An increase in personal knowledge and media exposure influenced acceptance of CO-MAP negatively. The results provide quantitative measures of how packaging affects consumers' acceptance and willingness to pay for products. Such information can benefit food producers and retailers who make decisions about investing in new packaging methods.

Device and Container for Reheating and Sterilization

NASA Technical Reports Server (NTRS)

Sastry, Sudhir K.; Heskitt, Brian F.; Jun, Soojin; Marcy, Joseph E.; Mahna, Ritesh

2012-01-01

Long-duration space missions require the development of improved foods and novel packages that do not represent a significant disposal issue. In addition, it would also be desirable if rapid heating technologies could be used on Earth as well, to improve food quality during a sterilization process. For this purpose, a package equipped with electrodes was developed that will enable rapid reheating of contents via ohmic heating to serving temperature during space vehicle transit. Further, the package is designed with a resealing feature, which enables the package, once used, to contain and sterilize waste, including human waste for storage prior to jettison during a long-duration mission. Ohmic heating is a technology that has been investigated on and off for over a century. Literature indicates that foods processed by ohmic heating are of superior quality to their conventionally processed counterparts. This is due to the speed and uniformity of ohmic heating, which minimizes exposure of sensitive materials to high temperatures. In principle, the material may be heated rapidly to sterilization conditions, cooled rapidly, and stored. The ohmic heating device herein is incorporated within a package. While this by itself is not novel, a reusable feature also was developed with the intent that waste may be stored and re-sterilized within the packages. These would then serve a useful function after their use in food processing and storage. The enclosure should be designed to minimize mass (and for NASA's purposes, Equivalent System Mass, or ESM), while enabling the sterilization function. It should also be electrically insulating. For this reason, Ultem high-strength, machinable electrical insulator was used.

Thermally Stabilized Transmit/Receive Modules

NASA Technical Reports Server (NTRS)

Hoffman, James; DelCastillo, Linda; Miller, Jennifer; Birur, Gaj

2011-01-01

RF-hybrid technologies enable smaller packaging and mass reduction in radar instruments, especially for subsystems with dense electronics, such as electronically steered arrays. We are designing thermally stabilized RF-hybrid T/R modules using new materials for improved thermal performance of electronics. We are combining advanced substrate and housing materials with a thermal reservoir material, and develop new packaging techniques to significantly improve thermal-cycling reliability and performance stability over temperature.

NASA X-34 Technology in Motion

NASA Technical Reports Server (NTRS)

Beech, Geoffrey; Chandler, Kristie

1997-01-01

The X-34 technology development program is a joint industry/government project to develop, test, and operate a small, fully-reusable hypersonic flight vehicle. The objective is to demonstrate key technologies and operating concepts applicable to future reusable launch vehicles. Integrated in the vehicle are various systems to assure successful completion of mission objectives, including the Main Propulsion System (MPS). NASA-Marshall Space Flight Center (MSFC) is responsible for developing the X-34's MPS including the design and complete build package for the propulsion system components. The X-34 will be powered by the Fastrac Engine, which is currently in design and development at NASA-MSFC. Fastrac is a single-stage main engine, which burns a mixture of liquid oxygen (LOX) and kerosene(RP-1). The interface between the MPS and Fastrac engine are critical for proper system operation and technologies applicable to future reusable launch vehicles. Deneb's IGRIP software package with the Dynamic analysis option provided a key tool for conducting studies critical to this interface as well as a mechanism to drive the design of the LOX and RP-1 feedlines. Kinematic models were created for the Fastrac Engine and the feedlines for various design concepts. Based on the kinematic simulation within Envision, design and joint limits were verified and system interference controlled. It was also critical to the program to evaluate the effect of dynamic loads visually, providing a verification tool for dynamic analysis and in some cases uncovering areas that had not been considered. Deneb's software put the X-34 technology in motion and has been a key factor in facilitating the strenuous design schedule.

Array Technology for Terahertz Imaging

NASA Technical Reports Server (NTRS)

Reck, Theodore; Siles, Jose; Jung, Cecile; Gill, John; Lee, Choonsup; Chattopadhyay, Goutam; Mehdi, Imran; Cooper, Ken

2012-01-01

Heterodyne terahertz (0.3 - 3THz) imaging systems are currently limited to single or a low number of pixels. Drastic improvements in imaging sensitivity and speed can be achieved by replacing single pixel systems with an array of detectors. This paper presents an array topology that is being developed at the Jet Propulsion Laboratory based on the micromachining of silicon. This technique fabricates the array's package and waveguide components by plasma etching of silicon, resulting in devices with precision surpassing that of current metal machining techniques. Using silicon increases the versatility of the packaging, enabling a variety of orientations of circuitry within the device which increases circuit density and design options. The design of a two-pixel transceiver utilizing a stacked architecture is presented that achieves a pixel spacing of 10mm. By only allowing coupling from the top and bottom of the package the design can readily be arrayed in two dimensions with a spacing of 10mm x 18mm.

An ultra-compact processor module based on the R3000

NASA Astrophysics Data System (ADS)

Mullenhoff, D. J.; Kaschmitter, J. L.; Lyke, J. C.; Forman, G. A.

1992-08-01

Viable high density packaging is of critical importance for future military systems, particularly space borne systems which require minimum weight and size and high mechanical integrity. A leading, emerging technology for high density packaging is multi-chip modules (MCM). During the 1980's, a number of different MCM technologies have emerged. In support of Strategic Defense Initiative Organization (SDIO) programs, Lawrence Livermore National Laboratory (LLNL) has developed, utilized, and evaluated several different MCM technologies. Prior LLNL efforts include modules developed in 1986, using hybrid wafer scale packaging, which are still operational in an Air Force satellite mission. More recent efforts have included very high density cache memory modules, developed using laser pantography. As part of the demonstration effort, LLNL and Phillips Laboratory began collaborating in 1990 in the Phase 3 Multi-Chip Module (MCM) technology demonstration project. The goal of this program was to demonstrate the feasibility of General Electric's (GE) High Density Interconnect (HDI) MCM technology. The design chosen for this demonstration was the processor core for a MIPS R3000 based reduced instruction set computer (RISC), which has been described previously. It consists of the R3000 microprocessor, R3010 floating point coprocessor and 128 Kbytes of cache memory.

New SOFRADIR 10μm pixel pitch infrared products

NASA Astrophysics Data System (ADS)

Lefoul, X.; Pere-Laperne, N.; Augey, T.; Rubaldo, L.; Aufranc, Sébastien; Decaens, G.; Ricard, N.; Mazaleyrat, E.; Billon-Lanfrey, D.; Gravrand, Olivier; Bisotto, Sylvette

2014-10-01

Recent advances in miniaturization of IR imaging technology have led to a growing market for mini thermal-imaging sensors. In that respect, Sofradir development on smaller pixel pitch has made much more compact products available to the users. When this competitive advantage is mixed with smaller coolers, made possible by HOT technology, we achieved valuable reductions in the size, weight and power of the overall package. At the same time, we are moving towards a global offer based on digital interfaces that provides our customers simplifications at the IR system design process while freeing up more space. This paper discusses recent developments on hot and small pixel pitch technologies as well as efforts made on compact packaging solution developed by SOFRADIR in collaboration with CEA-LETI.

DOE Office of Scientific and Technical Information (OSTI.GOV)

P-Mart was designed specifically to allow cancer researchers to perform robust statistical processing of publicly available cancer proteomic datasets. To date an online statistical processing suite for proteomics does not exist. The P-Mart software is designed to allow statistical programmers to utilize these algorithms through packages in the R programming language as well as offering a web-based interface using the Azure cloud technology. The Azure cloud technology also allows the release of the software via Docker containers.

77 FR 39353 - Wassenaar Arrangement 2011 Plenary Agreements Implementation: Commerce Control List, Definitions...

Federal Register 2010, 2011, 2012, 2013, 2014

2012-07-02

... Controls for Conventional Arms and Dual-Use Goods and Technologies is a group of 41 like-minded states... specified and packaged as medical products, are not subject to control. ECCN 1C008 (Non-Fluorinated... technology and computer system design have made control of fault tolerance neither warranted nor feasible...

Technological Tools in the Introductory Statistics Classroom: Effects on Student Understanding of Inferential Statistics

ERIC Educational Resources Information Center

Meletiou-Mavrotheris, Maria

2004-01-01

While technology has become an integral part of introductory statistics courses, the programs typically employed are professional packages designed primarily for data analysis rather than for learning. Findings from several studies suggest that use of such software in the introductory statistics classroom may not be very effective in helping…

Simulation Packages Expand Aircraft Design Options

NASA Technical Reports Server (NTRS)

2013-01-01

In 2001, NASA released a new approach to computational fluid dynamics that allows users to perform automated analysis on complex vehicle designs. In 2010, Palo Alto, California-based Desktop Aeronautics acquired a license from Ames Research Center to sell the technology. Today, the product assists organizations in the design of subsonic aircraft, space planes, spacecraft, and high speed commercial jets.

Integrated Avionics System (IAS)

NASA Technical Reports Server (NTRS)

Hunter, D. J.

2001-01-01

As spacecraft designs converge toward miniaturization and with the volumetric and mass constraints placed on avionics, programs will continue to advance the 'state of the art' in spacecraft systems development with new challenges to reduce power, mass, and volume. Although new technologies have improved packaging densities, a total system packaging architecture is required that not only reduces spacecraft volume and mass budgets, but increase integration efficiencies, provide modularity and scalability to accommodate multiple missions. With these challenges in mind, a novel packaging approach incorporates solutions that provide broader environmental applications, more flexible system interconnectivity, scalability, and simplified assembly test and integration schemes. This paper will describe the fundamental elements of the Integrated Avionics System (IAS), Horizontally Mounted Cube (HMC) hardware design, system and environmental test results. Additional information is contained in the original extended abstract.

Qualification of Engineering Camera for Long-Duration Deep Space Missions

NASA Technical Reports Server (NTRS)

Ramesham, Rajeshuni; Maki, Justin N.; Pourangi, Ali M.; Lee, Steven W.

2012-01-01

Qualification and verification of advanced electronic packaging and interconnect technologies, and various other types of hardware elements for the Mars Exploration Rover s Spirit and Opportunity (MER)/Mars Science Laboratory (MSL) flight projects, has been performed to enhance the mission assurance. The qualification of hardware (engineering camera) under extreme cold temperatures has been performed with reference to various Mars-related project requirements. The flight-like packages, sensors, and subassemblies have been selected for the study to survive three times the total number of expected diurnal temperature cycles resulting from all environmental and operational exposures occurring over the life of the flight hardware, including all relevant manufacturing, ground operations, and mission phases. Qualification has been performed by subjecting above flight-like hardware to the environmental temperature extremes, and assessing any structural failures or degradation in electrical performance due to either overstress or thermal cycle fatigue. Engineering camera packaging designs, charge-coupled devices (CCDs), and temperature sensors were successfully qualified for MER and MSL per JPL design principles. Package failures were observed during qualification processes and the package redesigns were then made to enhance the reliability and subsequent mission assurance. These results show the technology certainly is promising for MSL, and especially for longterm extreme temperature missions to the extreme temperature conditions. The engineering camera has been completely qualified for the MSL project, with the proven ability to survive on Mars for 2010 sols, or 670 sols times three. Finally, the camera continued to be functional, even after 2010 thermal cycles.

Near-term hybrid vehicle program, phase 1. Appendix C: Preliminary design data package

NASA Technical Reports Server (NTRS)

1979-01-01

The design methodology, the design decision rationale, the vehicle preliminary design summary, and the advanced technology developments are presented. The detailed vehicle design, the vehicle ride and handling and front structural crashworthiness analysis, the microcomputer control of the propulsion system, the design study of the battery switching circuit, the field chopper, and the battery charger, and the recent program refinements and computer results are presented.

Reliability Technology to Achieve Insertion of Advanced Packaging (RELTECH) program

NASA Astrophysics Data System (ADS)

Fayette, Daniel F.; Speicher, Patricia; Stoklosa, Mark J.; Evans, Jillian V.; Evans, John W.; Gentile, Mike; Pagel, Chuck A.; Hakim, Edward

1993-08-01

A joint military-commercial effort to evaluate multichip module (MCM) structures is discussed. The program, Reliability Technology to Achieve Insertion of Advanced Packaging (RELTECH), has been designed to identify the failure mechanisms that are possible in MCM structures. The RELTECH test vehicles, technical assessment task, product evaluation plan, reliability modeling task, accelerated and environmental testing, and post-test physical analysis and failure analysis are described. The information obtained through RELTECH can be used to address standardization issues, through development of cost effective qualification and appropriate screening criteria, for inclusion into a commercial specification and the MIL-H-38534 general specification for hybrid microcircuits.

Reliability Technology to Achieve Insertion of Advanced Packaging (RELTECH) program

NASA Technical Reports Server (NTRS)

Fayette, Daniel F.; Speicher, Patricia; Stoklosa, Mark J.; Evans, Jillian V.; Evans, John W.; Gentile, Mike; Pagel, Chuck A.; Hakim, Edward

1993-01-01

A joint military-commercial effort to evaluate multichip module (MCM) structures is discussed. The program, Reliability Technology to Achieve Insertion of Advanced Packaging (RELTECH), has been designed to identify the failure mechanisms that are possible in MCM structures. The RELTECH test vehicles, technical assessment task, product evaluation plan, reliability modeling task, accelerated and environmental testing, and post-test physical analysis and failure analysis are described. The information obtained through RELTECH can be used to address standardization issues, through development of cost effective qualification and appropriate screening criteria, for inclusion into a commercial specification and the MIL-H-38534 general specification for hybrid microcircuits.

Enabling More than Moore: Accelerated Reliability Testing and Risk Analysis for Advanced Electronics Packaging

NASA Technical Reports Server (NTRS)

Ghaffarian, Reza; Evans, John W.

2014-01-01

For five decades, the semiconductor industry has distinguished itself by the rapid pace of improvement in miniaturization of electronics products-Moore's Law. Now, scaling hits a brick wall, a paradigm shift. The industry roadmaps recognized the scaling limitation and project that packaging technologies will meet further miniaturization needs or ak.a "More than Moore". This paper presents packaging technology trends and accelerated reliability testing methods currently being practiced. Then, it presents industry status on key advanced electronic packages, factors affecting accelerated solder joint reliability of area array packages, and IPC/JEDEC/Mil specifications for characterizations of assemblies under accelerated thermal and mechanical loading. Finally, it presents an examples demonstrating how Accelerated Testing and Analysis have been effectively employed in the development of complex spacecraft thereby reducing risk. Quantitative assessments necessarily involve the mathematics of probability and statistics. In addition, accelerated tests need to be designed which consider the desired risk posture and schedule for particular project. Such assessments relieve risks without imposing additional costs. and constraints that are not value added for a particular mission. Furthermore, in the course of development of complex systems, variances and defects will inevitably present themselves and require a decision concerning their disposition, necessitating quantitative assessments. In summary, this paper presents a comprehensive view point, from technology to systems, including the benefits and impact of accelerated testing in offsetting risk.

Crush Testing at Oak Ridge National Laboratory

DOE Office of Scientific and Technical Information (OSTI.GOV)

Feldman, Matthew R

2011-01-01

The dynamic crush test is required in the certification testing of some small Type B transportation packages. International Atomic Energy Agency regulations state that the test article must be 'subjected to a dynamic crush test by positioning the specimen on the target so as to suffer maximum damage.' Oak Ridge National Laboratory (ORNL) Transportation Technologies Group performs testing of Type B transportation packages, including the crush test, at the National Transportation Research Center in Knoxville, Tennessee (United States). This paper documents ORNL's experiences performing crush tests on several different Type B packages. ORNL has crush tested five different drum-type packagemore » designs, continuing its 60 year history of RAM package testing. A total of 26 crush tests have been performed in a wide variety of package orientations and crush plate CG alignments. In all cases, the deformation of the outer drum created by the crush test was significantly greater than the deformation damage caused by the 9 m drop test. The crush test is a highly effective means for testing structural soundness of smaller nondense Type B shipping package designs. Further regulatory guidance could alleviate the need to perform the crush test in a wide range of orientations and crush plate CG alignments.« less

Space vehicle onboard command encoder

NASA Technical Reports Server (NTRS)

1975-01-01

A flexible onboard encoder system was designed for the space shuttle. The following areas were covered: (1) implementation of the encoder design into hardware to demonstrate the various encoding algorithms/code formats, (2) modulation techniques in a single hardware package to maintain comparable reliability and link integrity of the existing link systems and to integrate the various techniques into a single design using current technology. The primary function of the command encoder is to accept input commands, generated either locally onboard the space shuttle or remotely from the ground, format and encode the commands in accordance with the payload input requirements and appropriately modulate a subcarrier for transmission by the baseband RF modulator. The following information was provided: command encoder system design, brassboard hardware design, test set hardware and system packaging, and software.

Packaging Of Control Circuits In A Robot Arm

NASA Technical Reports Server (NTRS)

Kast, William

1994-01-01

Packaging system houses and connects control circuitry mounted on circuit boards within shoulder, upper section, and lower section of seven-degree-of-freedom robot arm. Has modular design that incorporates surface-mount technology, multilayer circuit boards, large-scale integrated circuits, and multi-layer flat cables between sections for compactness. Three sections of robot arm contain circuit modules in form of stardardized circuit boards. Each module contains two printed-circuit cards, one of each face.

Spooled packaging of shape memory alloy actuators

NASA Astrophysics Data System (ADS)

Redmond, John A.

A vast cross-section of transportation, manufacturing, consumer product, and medical technologies rely heavily on actuation. Accordingly, progress in these industries is often strongly coupled to the advancement of actuation technologies. As the field of actuation continues to evolve, smart materials show significant promise for satisfying the growing needs of industry. In particular, shape memory alloy (SMA) wire actuators present an opportunity for low-cost, high performance actuation, but until now, they have been limited or restricted from use in many otherwise suitable applications by the difficulty in packaging the SMA wires within tight or unusually shaped form constraints. To address this packaging problem, SMA wires can be spool-packaged by wrapping around mandrels to make the actuator more compact or by redirecting around multiple mandrels to customize SMA wire pathways to unusual form factors. The goal of this dissertation is to develop the scientific knowledge base for spooled packaging of low-cost SMA wire actuators that enables high, predictable performance within compact, customizable form factors. In developing the scientific knowledge base, this dissertation defines a systematic general representation of single and multiple mandrel spool-packaged SMA actuators and provides tools for their analysis, understanding, and synthesis. A quasi-static analytical model distills the underlying mechanics down to the three effects of friction, bending, and binding, which enables prediction of the behavior of generic spool-packaged SMA actuators with specifiable geometric, loading, frictional, and SMA material parameters. An extensive experimental and simulation-based parameter study establishes the necessary understanding of how primary design tradeoffs between performance, packaging, and cost are governed by the underlying mechanics of spooled actuators. A design methodology outlines a systematic approach to synthesizing high performance SMA wire actuators with mitigated material, power, and packaging costs and compact, customizable form factors. By examining the multi-faceted connections between performance, packaging, and cost, this dissertation builds a knowledge base that goes beyond implementing SMA actuators for particular applications. Rather, it provides a well-developed strategy for realizing the advantages of SMA actuation for a broadened range of applications, thereby enabling opportunities for new functionality and capabilities in industry.

Research and Development of Fully Automatic Alien Smoke Stack and Packaging System

NASA Astrophysics Data System (ADS)

Yang, Xudong; Ge, Qingkuan; Peng, Tao; Zuo, Ping; Dong, Weifu

2017-12-01

The problem of low efficiency of manual sorting packaging for the current tobacco distribution center, which developed a set of safe efficient and automatic type of alien smoke stack and packaging system. The functions of fully automatic alien smoke stack and packaging system adopt PLC control technology, servo control technology, robot technology, image recognition technology and human-computer interaction technology. The characteristics, principles, control process and key technology of the system are discussed in detail. Through the installation and commissioning fully automatic alien smoke stack and packaging system has a good performance and has completed the requirements for shaped cigarette.

Packaging - Materials review

NASA Astrophysics Data System (ADS)

Herrmann, Matthias

2014-06-01

Nowadays, a large number of different electrochemical energy storage systems are known. In the last two decades the development was strongly driven by a continuously growing market of portable electronic devices (e.g. cellular phones, lap top computers, camcorders, cameras, tools). Current intensive efforts are under way to develop systems for automotive industry within the framework of electrically propelled mobility (e.g. hybrid electric vehicles, plug-in hybrid electric vehicles, full electric vehicles) and also for the energy storage market (e.g. electrical grid stability, renewable energies). Besides the different systems (cell chemistries), electrochemical cells and batteries were developed and are offered in many shapes, sizes and designs, in order to meet performance and design requirements of the widespread applications. Proper packaging is thereby one important technological step for designing optimum, reliable and safe batteries for operation. In this contribution, current packaging approaches of cells and batteries together with the corresponding materials are discussed. The focus is laid on rechargeable systems for industrial applications (i.e. alkaline systems, lithium-ion, lead-acid). In principle, four different cell types (shapes) can be identified - button, cylindrical, prismatic and pouch. Cell size can be either in accordance with international (e.g. International Electrotechnical Commission, IEC) or other standards or can meet application-specific dimensions. Since cell housing or container, terminals and, if necessary, safety installations as inactive (non-reactive) materials reduce energy density of the battery, the development of low-weight packages is a challenging task. In addition to that, other requirements have to be fulfilled: mechanical stability and durability, sealing (e.g. high permeation barrier against humidity for lithium-ion technology), high packing efficiency, possible installation of safety devices (current interrupt device, valve, etc.), chemical inertness, cost issues, and others. Finally, proper cell design has to be considered for effective thermal management (i.e. cooling and heating) of battery packs.

Real100G.RF: A Fully Packaged 240 GHz Transmitter with In-Antenna Power Combining in 0.13 μm SiGe Technology

NASA Astrophysics Data System (ADS)

Malz, Stefan; Goettel, Benjamin; Eisenbeis, Joerg; Boes, Florian; Grzyb, Janusz; Vazquez, Pedro Rodriguez; Zwick, Thomas; Pfeiffer, Ullrich R.

2017-09-01

This paper reports on the research activities during the first phase of the project Real100G.RF, which is part of the German Research Foundation (DFG) priority programm SPP1655. The project's main objective is to research silicon-based wireless communication above 200 GHz to enable data rates in excess of 100 gigabit per second (Gbps). To that end, this paper presents a fully packaged 240 GHz RF transmitter front-end with power combining antenna in 0.13 μm SiGe technology. The design of circuit building blocks, passives, antenna and high-speed packaging is discussed. Communication measurements show data rates of 8 Gbps with an EVM of 12.4% using 16-QAM, 24 Gbps with 26.5% EVM using QPSK and 30 Gbps with 27.9% EVM using 8-PSK.

Application of Au-Sn eutectic bonding in hermetic radio-frequency microelectromechanical system wafer level packaging

NASA Astrophysics Data System (ADS)

Wang, Qian; Choa, Sung-Hoon; Kim, Woonbae; Hwang, Junsik; Ham, Sukjin; Moon, Changyoul

2006-03-01

Development of packaging is one of the critical issues toward realizing commercialization of radio-frequency-microelectromechanical system (RF-MEMS) devices. The RF-MEMS package should be designed to have small size, hermetic protection, good RF performance, and high reliability. In addition, packaging should be conducted at sufficiently low temperature. In this paper, a low-temperature hermetic wafer level packaging scheme for the RF-MEMS devices is presented. For hermetic sealing, Au-Sn eutectic bonding technology at temperatures below 300°C is used. Au-Sn multilayer metallization with a square loop of 70 µm in width is performed. The electrical feed-through is achieved by the vertical through-hole via filling with electroplated Cu. The size of the MEMS package is 1 mm × 1 mm × 700 µm. The shear strength and hermeticity of the package satisfies the requirements of MIL-STD-883F. Any organic gases or contamination are not observed inside the package. The total insertion loss for the packaging is 0.075 dB at 2 GHz. Furthermore, the robustness of the package is demonstrated by observing no performance degradation and physical damage of the package after several reliability tests.

MEMS in Space Systems

NASA Technical Reports Server (NTRS)

Lyke, J. C.; Michalicek, M. A.; Singaraju, B. K.

1995-01-01

Micro-electro-mechanical systems (MEMS) provide an emerging technology that has the potential for revolutionizing the way space systems are designed, assembled, and tested. The high launch costs of current space systems are a major determining factor in the amount of functionality that can be integrated in a typical space system. MEMS devices have the ability to increase the functionality of selected satellite subsystems while simultaneously decreasing spacecraft weight. The Air Force Phillips Laboratory (PL) is supporting the development of a variety of MEMS related technologies as one of several methods to reduce the weight of space systems and increase their performance. MEMS research is a natural extension of PL research objectives in micro-electronics and advanced packaging. Examples of applications that are under research include on-chip micro-coolers, micro-gyroscopes, vibration sensors, and three-dimensional packaging technologies to integrate electronics with MEMS devices. The first on-orbit space flight demonstration of these and other technologies is scheduled for next year.

Performance Analysis and Electronics Packaging of the Optical Communications Demonstrator

NASA Technical Reports Server (NTRS)

Jeganathan, M.; Monacos, S.

1998-01-01

The Optical Communications Demonstrator (OCD), under development at the Jet Propulsion Laboratory (JPL), is a laboratory-based lasercomm terminal designed to validate several key technologies, primarily precision beam pointing, high bandwidth tracking, and beacon acquisition.

Passengers, Crew, Life Support, and Insurance Considerations

NASA Technical Reports Server (NTRS)

ONeil, Daniel A.; Young, Lawrence R.

1999-01-01

This section describes the key issues, barriers, opportunities, and potential trip packages related to the needs and expectations of initial space adventure travelers. A variety of ideas to overcome barriers is presented that address financial, psychological, and sociological problems expected to be encountered in establishing a general PST and tourism business. Tour package descriptions range from near-term surface training facilities to far-term lunar ones. Recommendations include requirements pertaining to human factors in design and needed technology.

Design and simulation of a novel high-efficiency cooling heat-sink structure using fluid-thermodynamics

NASA Astrophysics Data System (ADS)

Hongqi, Jing; Li, Zhong; Yuxi, Ni; Junjie, Zhang; Suping, Liu; Xiaoyu, Ma

2015-10-01

A novel high-efficiency cooling mini-channel heat-sink structure has been designed to meet the package technology demands of high power density laser diode array stacks. Thermal and water flowing characteristics have been simulated using the Ansys-Fluent software. Owing to the increased effective cooling area, this mini-channel heat-sink structure has a better cooling effect when compared with the traditional macro-channel heat-sinks. Owing to the lower flow velocity in this novel high efficient cooling structure, the chillers' water-pressure requirement is reduced. Meanwhile, the machining process of this high-efficiency cooling mini-channel heat-sink structure is simple and the cost is relatively low, it also has advantages in terms of high durability and long lifetime. This heat-sink is an ideal choice for the package of high power density laser diode array stacks. Project supported by the Defense Industrial Technology Development Program (No. B1320133033).

TechTuning: Stress Management For 3D Through-Silicon-Via Stacking Technologies

NASA Astrophysics Data System (ADS)

Radojcic, Riko; Nowak, Matt; Nakamoto, Mark

2011-09-01

The concerns with managing mechanical stress distributions and the consequent effects on device performance and material integrity, for advanced TSV based technologies 3D are outlined. A model and simulation based Design For Manufacturability (DFM) type of a flow for managing the mechanical stresses throughout Si die, stack and package design is proposed. The key attributes of the models and simulators required to fuel the proposed flow are summarized. Finally, some of the essential infrastructure and the Supply Chain support items are described.

International Conference on Aerospace Trends...2001 - From Aeroplane to Aerospace Plane, Thiruvananthapuram, India, June 27, 28, 1991, Proceedings

NASA Astrophysics Data System (ADS)

1991-08-01

Consideration is given to operational characteristics of future launch vehicles, trends in propulsion technology, technology challenges in the development of cryogenic propulsion systems for future reusable space-launch vehicles, estimation of the overall drag coefficient of an aerospace plane, and self-reliance in aerospace structures. Attention is also given to basic design concepts for smart actuators for aerospace plane control, a software package for the preliminary design of a helicopter, and multiconstraint wing optimization.

The Texas Remote Sensing Training Project

NASA Technical Reports Server (NTRS)

Wells, J. B.

1975-01-01

The project was designed to train federal, state and regional agency managers, scientists and engineers. A one-week seminar was designed and implemented to build vocabulary, introduce technical subject areas and give students enough training to allow them to relate remote sensing technology to operational agency projects. The seminar was designed to perform the dual function of conveying enough remote sensing information to be of value as a stand-alone and preparing students for detailed pattern recognition training. The LARSYS III portion of the training project was executed exactly as designed in the LARSYS training materials package; the LARSYS package did not contain a LANDSAT training module. Two LANDSAT training modules were developed using Texas LANDSAT data. One module contained central Texas data and the second module contained coastal zone data.

Technology needs of advanced Earth observation spacecraft

NASA Technical Reports Server (NTRS)

Herbert, J. J.; Postuchow, J. R.; Schartel, W. A.

1984-01-01

Remote sensing missions were synthesized which could contribute significantly to the understanding of global environmental parameters. Instruments capable of sensing important land and sea parameters are combined with a large antenna designed to passively quantify surface emitted radiation at several wavelengths. A conceptual design for this large deployable antenna was developed. All subsystems required to make the antenna an autonomous spacecraft were conceptually designed. The entire package, including necessary orbit transfer propulsion, is folded to package within the Space Transportation System (STS) cargo bay. After separation, the antenna, its integral feed mast, radiometer receivers, power system, and other instruments are automatically deployed and transferred to the operational orbit. The design resulted in an antenna with a major antenna dimension of 120 meters, weighing 7650 kilograms, and operating at an altitude of 700 kilometers.

Design of a Miniaturized RAD Hard Point-of-Load Converter

NASA Astrophysics Data System (ADS)

Lofgren, Henrik; Landstrom, Sven; Gunnarsson, Marcus; Hagstrom, Maria

2014-08-01

As an ARTES 5.2 activity, a miniaturized radiation hardened Point-Of-Load converter (uPOL) has been developed. Several different design options have been evaluated before the final system level design was selected. The selected topology is a buck regulator with synchronous rectification utilizing peak current mode control. The PWM logic is designed using discrete electronics. Inside the POL converter package, an independent latching current limiter and clamping over- voltage protection are included as protection devices. The converter has an input voltage range of 4.8-6.2V, output voltage range of 1.2-3.5V and an output current of 0-3.5A. The final converter will be a metal packaged hybrid built on LTCC technology with an operating case temperature range of -40 to +85 °C.

European consumer response to packaging technologies for improved beef safety.

PubMed

Van Wezemael, Lynn; Ueland, Øydis; Verbeke, Wim

2011-09-01

Beef packaging can influence consumer perceptions of beef. Although consumer perceptions and acceptance are considered to be among the most limiting factors in the application of new technologies, there is a lack of knowledge about the acceptability to consumers of beef packaging systems aimed at improved safety. This paper explores European consumers' acceptance levels of different beef packaging technologies. An online consumer survey was conducted in five European countries (n=2520). Acceptance levels among the sample ranged between 23% for packaging releasing preservative additives up to 73% for vacuum packaging. Factor analysis revealed that familiar packaging technologies were clearly preferred over non-familiar technologies. Four consumer segments were identified: the negative (31% of the sample), cautious (30%), conservative (17%) and enthusiast (22%) consumers, which were profiled based on their attitudes and beef consumption behaviour. Differences between consumer acceptance levels should be taken into account while optimising beef packaging and communicating its benefits. Copyright © 2011 Elsevier Ltd. All rights reserved.

WEB - A Wireless Experiment Box for the Dextre Pointing Package ELC Payload

NASA Technical Reports Server (NTRS)

Bleier, Leor Z.; Marrero-Fontanez, Victor J.; Sparacino, Pietro A.; Moreau, Michael C.; Mitchell, Jason William

2012-01-01

The Wireless Experiment Box (WEB) was proposed to work with the International Space Station (ISS) External Wireless Communication (EWC) system to support high-definition video from the Dextre Pointing Package (DPP). DPP/WEB was a NASA GSFC proposed ExPRESS Logistics Carrier (ELC) payload designed to flight test an integrated suite of Autonomous Rendezvous and Docking (AR&D) technologies to enable a wide spectrum of future missions across NASA and other US Government agencies. The ISS EWC uses COTS Wireless Access Points (WAPs) to provide high-rate bi-directional communications to ISS. In this paper, we discuss WEB s packaging, operation, antenna development, and performance testing.

Web: A Wireless Experiment Box for the Dextre Pointing Package ELC Payload

NASA Technical Reports Server (NTRS)

Bleier, Leor Z.; Marrero-Fontanez, Victor J.; Sparacino, Pietro A.; Moreau, Michael C.; Mitchell, Jason W.

2012-01-01

The Wireless Experiment Box (WEB) was proposed to work with the International Space Station (ISS) External Wireless Communication (EWC) system to support high-definition video from the Dextre Pointing Package (DPP). DPP/WEB was a NASA GSFC proposed ExPRESS Logistics Carrier (ELC) payload designed to flight test an integrated suite of Autonomous Rendezvous and Docking (AR&D) technologies to enable a wide spectrum of future missions across NASA and other US Government agencies. The ISS EWC uses COTS Wireless Access Points (WAPs) to provide high-rate bi-directional communications to ISS. In this paper, we discuss WEB s packaging, operation, antenna development, and performance testing.

Design of high precision temperature control system for TO packaged LD

NASA Astrophysics Data System (ADS)

Liang, Enji; Luo, Baoke; Zhuang, Bin; He, Zhengquan

2017-10-01

Temperature is an important factor affecting the performance of TO package LD. In order to ensure the safe and stable operation of LD, a temperature control circuit for LD based on PID technology is designed. The MAX1978 and an external PID circuit are used to form a control circuit that drives the thermoelectric cooler (TEC) to achieve control of temperature and the external load can be changed. The system circuit has low power consumption, high integration and high precision,and the circuit can achieve precise control of the LD temperature. Experiment results show that the circuit can achieve effective and stable control of the laser temperature.

Hybrid propulsion technology program. Volume 1: Conceptional design package

NASA Technical Reports Server (NTRS)

Jensen, Gordon E.; Holzman, Allen L.; Leisch, Steven O.; Keilbach, Joseph; Parsley, Randy; Humphrey, John

1989-01-01

A concept design study was performed to configure two sizes of hybrid boosters; one which duplicates the advanced shuttle rocket motor vacuum thrust time curve and a smaller, quarter thrust level booster. Two sizes of hybrid boosters were configured for either pump-fed or pressure-fed oxygen feed systems. Performance analyses show improved payload capability relative to a solid propellant booster. Size optimization and fuel safety considerations resulted in a 4.57 m (180 inch) diameter large booster with an inert hydrocarbon fuel. The preferred diameter for the quarter thrust level booster is 2.53 m (96 inches). As part of the design study critical technology issues were identified and a technology acquisition and demonstration plan was formulated.

VCSEL based, wearable, continuously monitoring pulse oximeter.

PubMed

Kollmann, Daniel; Hogan, William K; Steidl, Charles; Hibbs-Brenner, Mary K; Hedin, Daniel S; Lichter, Patrick A

2013-01-01

We present the development of a novel pulse oximeter based on low power, low cost, Vertical Cavity Surface Emitting Laser (VCSEL) technology. This new design will help address a need to perform regular measurements of pulse oximetry for patients with chronic obstructive pulmonary disease. VCSELs with wavelengths suitable for pulse oximetry were developed and packaged in a PLCC package for a low cost solution that is easy to integrate into a pulse oximeter design. The VCSELs were integrated into a prototype pulse oximeter that is unobtrusive and suitable for long term wearable use. The prototype achieved good performance compared the Nonin Onyx II pulse oximeter at less than one fifth the weight in a design that can be worn behind the ear like a hearing aid.

Fracture mechanics based design for radioactive material transport packagings -- Historical review

DOE Office of Scientific and Technical Information (OSTI.GOV)

Smith, J.A.; Salzbrenner, D.; Sorenson, K.

1998-04-01

The use of a fracture mechanics based design for the radioactive material transport (RAM) packagings has been the subject of extensive research for more than a decade. Sandia National Laboratories (SNL) has played an important role in the research and development of the application of this technology. Ductile iron has been internationally accepted as an exemplary material for the demonstration of a fracture mechanics based method of RAM packaging design and therefore is the subject of a large portion of the research discussed in this report. SNL`s extensive research and development program, funded primarily by the U. S. Department ofmore » Energy`s Office of Transportation, Energy Management and Analytical Services (EM-76) and in an auxiliary capacity, the office of Civilian Radioactive Waste Management, is summarized in this document along with a summary of the research conducted at other institutions throughout the world. In addition to the research and development work, code and standards development and regulatory positions are also discussed.« less

Standard semiconductor packaging for high-reliability low-cost MEMS applications

NASA Astrophysics Data System (ADS)

Harney, Kieran P.

2005-01-01

Microelectronic packaging technology has evolved over the years in response to the needs of IC technology. The fundamental purpose of the package is to provide protection for the silicon chip and to provide electrical connection to the circuit board. Major change has been witnessed in packaging and today wafer level packaging technology has further revolutionized the industry. MEMS (Micro Electro Mechanical Systems) technology has created new challenges for packaging that do not exist in standard ICs. However, the fundamental objective of MEMS packaging is the same as traditional ICs, the low cost and reliable presentation of the MEMS chip to the next level interconnect. Inertial MEMS is one of the best examples of the successful commercialization of MEMS technology. The adoption of MEMS accelerometers for automotive airbag applications has created a high volume market that demands the highest reliability at low cost. The suppliers to these markets have responded by exploiting standard semiconductor packaging infrastructures. However, there are special packaging needs for MEMS that cannot be ignored. New applications for inertial MEMS devices are emerging in the consumer space that adds the imperative of small size to the need for reliability and low cost. These trends are not unique to MEMS accelerometers. For any MEMS technology to be successful the packaging must provide the basic reliability and interconnection functions, adding the least possible cost to the product. This paper will discuss the evolution of MEMS packaging in the accelerometer industry and identify the main issues that needed to be addressed to enable the successful commercialization of the technology in the automotive and consumer markets.

Standard semiconductor packaging for high-reliability low-cost MEMS applications

NASA Astrophysics Data System (ADS)

Harney, Kieran P.

2004-12-01

Microelectronic packaging technology has evolved over the years in response to the needs of IC technology. The fundamental purpose of the package is to provide protection for the silicon chip and to provide electrical connection to the circuit board. Major change has been witnessed in packaging and today wafer level packaging technology has further revolutionized the industry. MEMS (Micro Electro Mechanical Systems) technology has created new challenges for packaging that do not exist in standard ICs. However, the fundamental objective of MEMS packaging is the same as traditional ICs, the low cost and reliable presentation of the MEMS chip to the next level interconnect. Inertial MEMS is one of the best examples of the successful commercialization of MEMS technology. The adoption of MEMS accelerometers for automotive airbag applications has created a high volume market that demands the highest reliability at low cost. The suppliers to these markets have responded by exploiting standard semiconductor packaging infrastructures. However, there are special packaging needs for MEMS that cannot be ignored. New applications for inertial MEMS devices are emerging in the consumer space that adds the imperative of small size to the need for reliability and low cost. These trends are not unique to MEMS accelerometers. For any MEMS technology to be successful the packaging must provide the basic reliability and interconnection functions, adding the least possible cost to the product. This paper will discuss the evolution of MEMS packaging in the accelerometer industry and identify the main issues that needed to be addressed to enable the successful commercialization of the technology in the automotive and consumer markets.

A Survey of Electronics Obsolescence and Reliability

DTIC Science & Technology

2010-07-01

properties but there are many minor and major variations (e.g. curing schedule) affecting their usage in packaging processes and in reworking. Curing...within them. Electronic obsolescence is increasingly associated with physical characteristics that reduce component and system reliability, both in usage ...semiconductor technologies and of electronic systems, both in usage and in storage. By design, electronics technologies include few reliability margins

Technological developments and the need for technical competencies in food services.

PubMed

Rodgers, Svetlana

2005-05-01

The growing scale of institutional and commercial food services poses a technological challenge of producing large quantities of high quality meals in terms of their safety, sensory and nutritional attributes. Developments in food service technology and systems (cook-freeze, cook-chill and others) allow the replacement of fast food with the service of cooked meals, which are often nutritionally superior. Reliance on equipment, packaging and technological 'know-how' makes food service operations more complex. Operators have to minimise the impact of the numerous steps in the production process, the fundamental weaknesses of cook-chill food safety design, coupled with the practical limitations of Hazard Analysis Critical Control Points management, the potential unevenness of temperature distribution and product deterioration during storage. The fundamental knowledge of food science and microbiology, engineering and packaging technologies is needed. At present, the 'high tech' options, which can improve a product's nutritional value, such as natural preservation hurdles or functional meals, are not used in practice.

Single-Crystal Sapphire Optical Fiber Sensor Instrumentation

DOE Office of Scientific and Technical Information (OSTI.GOV)

Pickrell, Gary; Scott, Brian; Wang, Anbo

2013-12-31

This report summarizes technical progress on the program “Single-Crystal Sapphire Optical Fiber Sensor Instrumentation,” funded by the National Energy Technology Laboratory of the U.S. Department of Energy, and performed by the Center for Photonics Technology of the Bradley Department of Electrical and Computer Engineering at Virginia Tech. This project was completed in three phases, each with a separate focus. Phase I of the program, from October 1999 to April 2002, was devoted to development of sensing schema for use in high temperature, harsh environments. Different sensing designs were proposed and tested in the laboratory. Phase II of the program, frommore » April 2002 to April 2009, focused on bringing the sensor technologies, which had already been successfully demonstrated in the laboratory, to a level where the sensors could be deployed in harsh industrial environments and eventually become commercially viable through a series of field tests. Also, a new sensing scheme was developed and tested with numerous advantages over all previous ones in Phase II. Phase III of the program, September 2009 to December 2013, focused on development of the new sensing scheme for field testing in conjunction with materials engineering of the improved sensor packaging lifetimes. In Phase I, three different sensing principles were studied: sapphire air-gap extrinsic Fabry-Perot sensors; intensity-based polarimetric sensors; and broadband polarimetric sensors. Black body radiation tests and corrosion tests were also performed in this phase. The outcome of the first phase of this program was the selection of broadband polarimetric differential interferometry (BPDI) for further prototype instrumentation development. This approach is based on the measurement of the optical path difference (OPD) between two orthogonally polarized light beams in a single-crystal sapphire disk. At the beginning of Phase II, in June 2004, the BPDI sensor was tested at the Wabash River coal gasifier facility in Terre Haute, Indiana. Due to business conditions at industrial partner and several logistical problems, this field test was not successful. An alternative high-temperature sensing system using sapphire wafer-based extrinsic Fabry-Perot interferometry was then developed as a significant improvement over the BPDI solution. From June 2006 to June 2008, three consecutive field tests were performed with the new sapphire wafer sensors at the TECO coal gasifier in Tampa, Florida. One of the sensors survived in the industrial coal gasifier for 7 months, over which time the existing thermocouples were replaced twice. The outcome of these TECO field tests suggests that the sapphire wafer sensor has very good potential to be commercialized. However packaging and sensor protection issues need additional development. During Phase III, several major improvements in the design and fabrication process of the sensor have been achieved through experiments and theoretical analysis. Studies on the property of the key components in the sensor head, including the sapphire fiber and sapphire wafer, were also conducted, for a better understanding of the sensor behavior. A final design based on all knowledge and experience has been developed, free of any issues encountered during the entire research. Sensors with this design performed well as expected in lab long-term tests, and were deployed in the sensing probe of the final coal-gasifier field test. Sensor packaging and protection was improved through materials engineering through testing of packaging designs in two blank probe packaging tests at Eastman Chemical in Kingsport, TN. Performance analysis of the blank probe packaging resulted in improve package designs culminating in a 3rd generation probe packaging utilized for the full field test of the sapphire optical sensor and materials designed sensor packaging.« less

Thermal Characterization for a Modular 3-D Multichip Module

NASA Technical Reports Server (NTRS)

Fan, Mark S.; Plante, Jeannette; Shaw, Harry

2000-01-01

NASA Goddard Space Flight Center has designed a high-density modular 3-D multichip module (MCM) for future spaceflight use. This MCM features a complete modular structure, i.e., each stack can be removed from the package without damaging the structure. The interconnection to the PCB is through the Column Grid Array (CGA) technology. Because of its high-density nature, large power dissipation from multiple layers of circuitry is anticipated and CVD diamond films are used in the assembly for heat conduction enhancement. Since each stacked layer dissipates certain amount of heat, designing effective heat conduction paths through each stack and balancing the heat dissipation within each stack for optimal thermal performance become a challenging task. To effectively remove the dissipated heat from the package, extensive thermal analysis has been performed with finite element methods. Through these analyses, we are able to improve the thermal design and increase the total wattage of the package for maximum electrical performance. This paper provides details on the design-oriented thermal analysis and performance enhancement. It also addresses issues relating to contact thermal resistance between the diamond film and the metallic heat conduction paths.

Understanding surgery: multimedia comes to theatre.

PubMed

Dakin, S; Garner, M; Plura, M

1997-01-01

Educational technology is well established within Schools of Nursing, however there are few computer based learning packages within the clinical environment. It was felt within the Operating Services Directorate, Royal Hallamshire Hospital, that the development of a multimedia package would enhance and complement existing teaching methods. This paper describes the theory behind the choice of a multimedia presentation and its development within the operating theatres. The package, concentrating on general surgery, has been developed by two experienced theatre nurses and a graphic designer. This has resulted in a structured but flexible, fun package which is relevant to all learners within the operating theatre environment and allied healthcare fields. The feedback obtained from users within the clinical area has reinforced the project team's original feeling that multimedia is a highly appropriate resource for clinical education.

Assisting in Radiology/Imaging. Instructor's Guide, Student's Manual, and Student Learning Activities.

ERIC Educational Resources Information Center

Fair, Helena J.

The instructor's guide, the first of three documents in this package, is designed for a course to help students who are investigating the activities within a radiology department or considering any of the imaging technologies as a career. The material is designed to relate training experience to information studied in the classroom. This…

Design and Implementation of a Thermal Load Reduction System in a Hyundai PHEV

DOE Office of Scientific and Technical Information (OSTI.GOV)

Kreutzer, Cory J; Rugh, John P

Increased market penetration of electric drive vehicles (EDVs) requires overcoming a number of hurdles including limited vehicle range and the elevated cost of EDVs as compared to conventional vehicles. Climate control loads have a significant impact on range, cutting it by over 50% in both cooling and heating conditions. In order to minimize the impact of climate control on EDV range, the National Renewable Energy Laboratory has partnered with Hyundai America and key industry partners to quantify the performance of thermal load reduction technologies on a Hyundai Sonata PHEV. Technologies that impact vehicle cabin heating in cold weather conditions andmore » cabin cooling in warm weather conditions were evaluated. Tests included thermal transient and steady-state periods for all technologies, including the development of a new test methodology to evaluate the performance of occupant thermal conditioning. Heated surfaces and increased insulation demonstrated significant reductions in energy use from steady-state heating, including a 29% - 59% reduction from heated surfaces. Solar control glass packages demonstrated significant reductions in energy use for both transient and steady-state cooling, with up to a 42% reduction in transient and 12.8% reduction in steady-state energy use for the packages evaluated. Technologies that demonstrated significant climate control load reduction were selected for incorporation into a complete thermal load reduction package. The complete package is set to be evaluated in the second phase of the ongoing project.« less

Single-mode glass waveguide technology for optical interchip communication on board level

NASA Astrophysics Data System (ADS)

Brusberg, Lars; Neitz, Marcel; Schröder, Henning

2012-01-01

The large bandwidth demand in long-distance telecom networks lead to single-mode fiber interconnects as result of low dispersion, low loss and dense wavelength multiplexing possibilities. In contrast, multi-mode interconnects are suitable for much shorter lengths up to 300 meters and are promising for optical links between racks and on board level. Active optical cables based on multi-mode fiber links are at the market and research in multi-mode waveguide integration on board level is still going on. Compared to multi-mode, a single-mode waveguide has much more integration potential because of core diameters of around 20% of a multi-mode waveguide by a much larger bandwidth. But light coupling in single-mode waveguides is much more challenging because of lower coupling tolerances. Together with the silicon photonics technology, a single-mode waveguide technology on board-level will be the straight forward development goal for chip-to-chip optical interconnects integration. Such a hybrid packaging platform providing 3D optical single-mode links bridges the gap between novel photonic integrated circuits and the glass fiber based long-distance telecom networks. Following we introduce our 3D photonic packaging approach based on thin glass substrates with planar integrated optical single-mode waveguides for fiber-to-chip and chip-to-chip interconnects. This novel packaging approach merges micro-system packaging and glass integrated optics. It consists of a thin glass substrate with planar integrated singlemode waveguide circuits, optical mirrors and lenses providing an integration platform for photonic IC assembly and optical fiber interconnect. Thin glass is commercially available in panel and wafer formats and characterizes excellent optical and high-frequency properties. That makes it perfect for microsystem packaging. The paper presents recent results in single-mode waveguide technology on wafer level and waveguide characterization. Furthermore the integration in a hybrid packaging process and design issues are discussed.

Life testing of reflowed and reworked advanced CCGA surface mount packages in harsh thermal environments

NASA Astrophysics Data System (ADS)

Ramesham, Rajeshuni

2013-03-01

Life testing/qualification of reflowed (1st reflow) and reworked (1st reflow, 1st removal, and then 1st rework) advanced ceramic column grid array (CCGA) surface mount interconnect electronic packaging technologies for future flight projects has been studied to enhance the mission assurance of JPL-NASA projects. The reliability of reworked/reflowed surface mount technology (SMT) packages is very important for short-duration and long-duration deep space harsh extreme thermal environmental missions. The life testing of CCGA electronic packages under extreme thermal environments (for example: -185°C to +125°C) has been performed with reference to various JPL/NASA project requirements which encompass the temperature range studied. The test boards of reflowed and reworked CCGA packages (717 Xilinx package, 624, 1152, and 1272 column Actel Packages) were selected for the study to survive three times the total number of expected temperature cycles resulting from all environmental and operational exposures occurring over the life of the flight hardware including all relevant manufacturing, ground operations, and mission phases or cycles to failure to assess the life of the hardware. Qualification/life testing was performed by subjecting test boards to the environmental harsh temperature extremes and assessing any structural failures, mechanical failures or degradation in electrical performance solder-joint failures due to either overstress or thermal cycle fatigue. The large, high density, high input/output (I/O) electronic interconnect SMT packages such as CCGA have increased usage in avionics hardware of NASA projects during the last two decades. The test boards built with CCGA packages are expensive and often require a rework to replace a reflowed, reprogrammed, failed, redesigned, etc., CCGA packages. Theoretically speaking, a good rework process should have similar temperature-time profile as that used for the original manufacturing process of solder reflow. A multiple rework processes may be implemented with CCGA packaging technology to understand the effect of number of reworks on the reliability of this technology for harsh thermal environments. In general, reliability of the assembled electronic packages reduces as a function of number of reworks and the extent is not known yet. A CCGA rework process has been tried and implemented to design a daisy-chain test board consists of 624 and 717 packages. Reworked CCGA interconnect electronic packages of printed wiring polyimide boards have been assembled and inspected using non-destructive x-ray imaging and optical microscope techniques. The assembled boards after 1st rework and 1st reflow were subjected to extreme temperature thermal atmospheric cycling to assess their reliability for future deep space JPL/NASA for moderate to harsh thermal mission environments. The resistance of daisy-chained interconnect sections were monitored continuously during thermal cycling to determine intermittent failures. This paper provides the experimental reliability test results to failure of assemblies for the first time of reflowed and reworked CCGA packages under extreme harsh thermal environments.

Advanced Dependent Pressure Vessel (DPV) nickel-hydrogen spacecraft cell and battery design

NASA Technical Reports Server (NTRS)

Coates, Dwaine; Wright, Doug; Repplinger, Ron

1995-01-01

The dependent pressure vessel (DPV) nickel-hydrogen (NiH2) battery is being developed as a potential spacecraft battery design for both military and commercial satellites. Individual pressure vessel (IPV) NiH2 batteries are currently flying on more than 70 Earth orbital satellites and have accumulated more than 140,000,000 cell-hours in actual spacecraft operation. The limitations of standard NiH2 IPV flight battery technology are primarily related to the internal cell design and the battery packaging issues associated with grouping multiple cylindrical cells. The DPV cell design offers higher specific energy and reduced cost, while retaining the established IPV NiH2 technology flight heritage and database. The advanced cell design offers a more efficient mechanical, electrical and thermal cell configuration and a reduced parts count. The internal electrode stack is a prismatic flat-plate arrangement. The flat individual cell pressure vessel provides a maximum direct thermal path for removing heat from the electrode stack. The cell geometry also minimizes multiple-cell battery packaging constraints by using an established end-plateltie-rod battery design. A major design advantage is that the battery support structure is efficiently required to restrain only the force applied to a portion of the end cell. As the cells are stacked in series to achieve the desired system voltage, this increment of the total battery weight becomes small. The geometry of the DPV cell promotes compact, minimum volume packaging and places all cell terminals along the length of the battery. The resulting ability to minimize intercell wiring offers additional design simplicity and significant weight savings. The DPV battery design offers significant cost and weight savings advantages while providing minimal design risks. Cell and battery level design issues will be addressed including mechanical, electrical and thermal design aspects. A design performance analysis will be presented at both the cell and battery level. The DPV is capable of delivering up to 76 Watt-hours per kilogram (Wh/kg) at the cell level and 70 Wh/kg at the full battery level. This represents a 40 percent increase in specific energy at the cell level and a 60 percent increase in specific energy at the battery level compared to current IPV NiH2 technology.

Advanced Technology Lifecycle Analysis System (ATLAS) Technology Tool Box (TTB)

NASA Technical Reports Server (NTRS)

Doyle, Monica; ONeil, Daniel A.; Christensen, Carissa B.

2005-01-01

The Advanced Technology Lifecycle Analysis System (ATLAS) is a decision support tool designed to aid program managers and strategic planners in determining how to invest technology research and development dollars. It is an Excel-based modeling package that allows a user to build complex space architectures and evaluate the impact of various technology choices. ATLAS contains system models, cost and operations models, a campaign timeline and a centralized technology database. Technology data for all system models is drawn from a common database, the ATLAS Technology Tool Box (TTB). The TTB provides a comprehensive, architecture-independent technology database that is keyed to current and future timeframes.

Data Analysis for the LISA Pathfinder Mission

NASA Technical Reports Server (NTRS)

Thorpe, James Ira

2009-01-01

The LTP (LISA Technology Package) is the core part of the Laser Interferometer Space Antenna (LISA) Pathfinder mission. The main goal of the mission is to study the sources of any disturbances that perturb the motion of the freely-falling test masses from their geodesic trajectories as well as 10 test various technologies needed for LISA. The LTP experiment is designed as a sequence of experimental runs in which the performance of the instrument is studied and characterized under different operating conditions. In order to best optimize subsequent experimental runs, each run must be promptly analysed to ensure that the following ones make best use of the available knowledge of the instrument ' In order to do this, all analyses must be designed and tested in advance of the mission and have sufficient built-in flexibility to account for unexpected results or behaviour. To support this activity, a robust and flexible data analysis software package is also required. This poster presents two of the main components that make up the data analysis effort: the data analysis software and the mock-data challenges used to validate analysis procedures and experiment designs.

Development of low-SWaP and low-noise InGaAs detectors

NASA Astrophysics Data System (ADS)

Fraenkel, R.; Berkowicz, E.; Bikov, L.; Elishkov, R.; Giladi, A.; Hirsh, I.; Ilan, E.; Jakobson, C.; Kondrashov, P.; Louzon, E.; Nevo, I.; Pivnik, I.; Tuito, A.; Vasserman, S.

2017-02-01

In recent years SCD has developed InGaAs/InP technology for Short-Wave Infrared (SWIR) imaging. The first product, Cardinal 640, has a 640×512 (VGA) format at 15μm pitch, and more than two thousand units have already been delivered to customers. Recently we have also introduced Cardinal 1280 which is an SXGA array with 10μm pitch aimed for long-range high end platforms [1]. One of the big challenges facing the SWIR technology is its proliferation to widespread low cost and low SWaP applications, specifically Low Light Level (LLL) and Image Intensifier (II) replacements. In order to achieve this goal we have invested and combined efforts in several design and development directions: 1. Optimization of the InGaAs pixel array, reducing the dark current below 2fA at 20° C in order to save TEC cooling power under harsh light and environmental conditions. 2. Design of a new "Low Noise" ROIC targeting 15e noise floor and improved active imaging capabilities 3. Design of compact, low SWaP and low cost packages. In this context we have developed 2 types of packages: a non-hermetic package with thermo-electric cooler (TEC) and a hermetic TEC-Less ceramic package. 4. Development of efficient TEC-Less algorithms for optimal imaging at both day-light and low light level conditions. The result of these combined efforts is a compact low SWaP detector that provides equivalent performance to Gen III image intensifier under starlight conditions. In this paper we will present results from lab and field experiments that will support this claim.

Automated Work Package: Initial Wireless Communication Platform Design, Development, and Evaluation

DOE Office of Scientific and Technical Information (OSTI.GOV)

Al Rashdan, Ahmad Yahya Mohammad; Agarwal, Vivek

The Department of Energy’s Light Water Reactor Sustainability Program is developing the scientific basis to ensure long-term reliability, productivity, safety, and security of the nuclear power industry in the United States. The Instrumentation, Information, and Control (II&C) pathway of the program aims to increase the role of advanced II&C technologies to achieve this objective. One of the pathway efforts at Idaho National Laboratory (INL) is to improve the work packages execution process by replacing the expensive, inefficient, bulky, complex, and error-prone paper-based work orders with automated work packages (AWPs). An AWP is an automated and dynamic presentation of the workmore » package designed to guide the user through the work process. It is loaded on a mobile device, such as a tablet, and is capable of communicating with plant equipment and systems to acquire plant and procedure states. The AWP replaces those functions where a computer is more efficient and reliable than a human. To enable the automatic acquisition of plant data, it is necessary to design and develop a prototype platform for data exchange between the field instruments and the AWP mobile devices. The development of the platform aims to reveal issues and solutions generalizable to large-scale implementation of a similar system. Topics such as bandwidth, robustness, response time, interference, and security are usually associated with wireless communication. These concerns, along with other requirements, are listed in an earlier INL report. Specifically, the targeted issues and performance aspects in this work are relevant to the communication infrastructure from the perspective of promptness, robustness, expandability, and interoperability with different technologies.« less

HDDTOOLS: an R package serving Hydrological Data Discovery Tools

NASA Astrophysics Data System (ADS)

Vitolo, C.; Buytaert, W.

2014-12-01

Many governmental bodies and institutions are currently committed to publish open data as the result of a trend of increasing transparency, based on which a wide variety of information produced at public expense is now becoming open and freely available to improve public involvement in the process of decision and policy making. Discovery, access and retrieval of information is, however, not always a simple task. Especially when programmatic access to data resources is not allowed, downloading metadata catalogue, select the information needed, request datasets, de-compression, conversion, manual filtering and parsing can become rather tedious. The R package "hddtools" is an open source project, designed to make all the above operations more efficient by means of re-usable functions. The package facilitate non programmatic access to various online data sources such as the Global Runoff Data Centre, NASA's TRMM mission, the Data60UK database amongst others. This package complements R's growing functionality in environmental web technologies to bridge the gap between data providers and data consumers and it is designed to be the starting building block of scientific workflows for linking data and models in a seamless fashion.

Progress in performance enhancement methods for capacitive silicon resonators

NASA Astrophysics Data System (ADS)

Van Toan, Nguyen; Ono, Takahito

2017-11-01

In this paper, we review the progress in recent studies on the performance enhancement methods for capacitive silicon resonators. We provide information on various fabrication technologies and design considerations that can be employed to improve the performance of capacitive silicon resonators, including low motional resistance, small insertion loss, and high quality factor (Q). This paper contains an overview of device structures and working principles, fabrication technologies consisting of hermetic packaging, deep reactive-ion etching and neutral beam etching, and design considerations including mechanically coupled, movable electrode structures and piezoresistive heat engines.

Seismology software: state of the practice

NASA Astrophysics Data System (ADS)

Smith, W. Spencer; Zeng, Zheng; Carette, Jacques

2018-05-01

We analyzed the state of practice for software development in the seismology domain by comparing 30 software packages on four aspects: product, implementation, design, and process. We found room for improvement in most seismology software packages. The principal areas of concern include a lack of adequate requirements and design specification documents, a lack of test data to assess reliability, a lack of examples to get new users started, and a lack of technological tools to assist with managing the development process. To assist going forward, we provide recommendations for a document-driven development process that includes a problem statement, development plan, requirement specification, verification and validation (V&V) plan, design specification, code, V&V report, and a user manual. We also provide advice on tool use, including issue tracking, version control, code documentation, and testing tools.

Seismology software: state of the practice

NASA Astrophysics Data System (ADS)

Smith, W. Spencer; Zeng, Zheng; Carette, Jacques

2018-02-01

We analyzed the state of practice for software development in the seismology domain by comparing 30 software packages on four aspects: product, implementation, design, and process. We found room for improvement in most seismology software packages. The principal areas of concern include a lack of adequate requirements and design specification documents, a lack of test data to assess reliability, a lack of examples to get new users started, and a lack of technological tools to assist with managing the development process. To assist going forward, we provide recommendations for a document-driven development process that includes a problem statement, development plan, requirement specification, verification and validation (V&V) plan, design specification, code, V&V report, and a user manual. We also provide advice on tool use, including issue tracking, version control, code documentation, and testing tools.

Spaceborne VHSIC multiprocessor system for AI applications

NASA Technical Reports Server (NTRS)

Lum, Henry, Jr.; Shrobe, Howard E.; Aspinall, John G.

1988-01-01

A multiprocessor system, under design for space-station applications, makes use of the latest generation symbolic processor and packaging technology. The result will be a compact, space-qualified system two to three orders of magnitude more powerful than present-day symbolic processing systems.

Analysis, annotation, and profiling of the oat seed transcriptome

USDA-ARS?s Scientific Manuscript database

Novel high-throughput next generation sequencing (NGS) technologies are providing opportunities to explore genomes and transcriptomes in a cost-effective manner. To construct a gene expression atlas of developing oat (Avena sativa) seeds, two software packages specifically designed for RNA-seq (Trin...

NASA Electronic Parts and Packaging Program

NASA Technical Reports Server (NTRS)

Kayali, Sammy

2000-01-01

NEPP program objectives are to: (1) Access the reliability of newly available electronic parts and packaging technologies for usage on NASA projects through validations, assessments, and characterizations, and the development of test methods/tools; (2)Expedite infusion paths for advanced (emerging) electronic parts and packaging technologies by evaluations of readiness for manufacturability and project usage consideration; (3) Provide NASA projects with technology selection, application, and validation guidelines for electronic parts and packaging hardware and processes; nd (4) Retain and disseminate electronic parts and packaging quality assurance, reliability validations, tools, and availability information to the NASA community.

Speech Output Technologies in Interventions for Individuals with Autism Spectrum Disorders: A Scoping Review.

PubMed

Schlosser, Ralf W; Koul, Rajinder K

2015-01-01

The purpose of this scoping review was to (a) map the research evidence on the effectiveness of augmentative and alternative communication (AAC) interventions using speech output technologies (e.g., speech-generating devices, mobile technologies with AAC-specific applications, talking word processors) for individuals with autism spectrum disorders, (b) identify gaps in the existing literature, and (c) posit directions for future research. Outcomes related to speech, language, and communication were considered. A total of 48 studies (47 single case experimental designs and 1 randomized control trial) involving 187 individuals were included. Results were reviewed in terms of three study groupings: (a) studies that evaluated the effectiveness of treatment packages involving speech output, (b) studies comparing one treatment package with speech output to other AAC modalities, and (c) studies comparing the presence with the absence of speech output. The state of the evidence base is discussed and several directions for future research are posited.

Getting small: new 10μm pixel pitch cooled infrared products

NASA Astrophysics Data System (ADS)

Reibel, Y.; Pere-Laperne, N.; Augey, T.; Rubaldo, L.; Decaens, G.; Bourqui, M.-L.; Manissadjian, A.; Billon-Lanfrey, D.; Bisotto, S.; Gravrand, O.; Destefanis, G.; Druart, G.; Guerineau, N.

2014-06-01

Recent advances in miniaturization of IR imaging technology have led to a burgeoning market for mini thermalimaging sensors. Seen in this context our development on smaller pixel pitch has opened the door to very compact products. When this competitive advantage is mixed with smaller coolers, thanks to HOT technology, we achieve valuable reductions in size, weight and power of the overall package. In the same time, we are moving towards a global offer based on digital interfaces that provides our customers lower power consumption and simplification on the IR system design process while freeing up more space. Additionally, we are also investigating new wafer level camera solution taking advantage of the progress in micro-optics. This paper discusses recent developments on hot and small pixel pitch technologies as well as efforts made on compact packaging solution developed by SOFRADIR in collaboration with CEA-LETI and ONERA.

Packaging of structural health monitoring components

NASA Astrophysics Data System (ADS)

Kessler, Seth S.; Spearing, S. Mark; Shi, Yong; Dunn, Christopher T.

2004-07-01

Structural Health Monitoring (SHM) technologies have the potential to realize economic benefits in a broad range of commercial and defense markets. Previous research conducted by Metis Design and MIT has demonstrated the ability of Lamb waves methods to provide reliable information regarding the presence, location and type of damage in composite specimens. The present NSF funded program was aimed to study manufacturing, packaging and interface concepts for critical SHM components. The intention is to be able to cheaply manufacture robust actuating/sensing devices, and isolate them from harsh operating environments including natural, mechanical, or electrical extremes. Currently the issues related to SHM system durability have remained undressed. During the course of this research several sets of test devices were fabricated and packaged to protect the piezoelectric component assemblies for robust operation. These assemblies were then tested in hot and wet conditions, as well as in electrically noisy environments. Future work will aim to package the other supporting components such as the battery and wireless chip, as well as integrating all of these components together for operation. SHM technology will enable the reduction or complete elimination of scheduled inspections, and will allow condition-based maintenance for increased reliability and reduced overall life-cycle costs.

Alternative technological development for RF hybridization

NASA Astrophysics Data System (ADS)

Antônio Finardi, Célio; da Fontoura Ponchet, André; Battesini Adamo, Cristina; Flacker, Alexander; Cotrin Teixeira, Ricardo; Panepucci, Roberto Ricardo

2017-03-01

The paper presents a technological solution for high frequency packaging platform evaluated up to 40 GHz. The main purpose of this development was to define an alternative hybrid technology that is more flexible and faster to prototype compared with thin film or multi chip module (MCM-D). The alternative technology also shows adequate performance for high bit rate solutions integrating optical and electronics blocks. This approach consists of a soft substrate (laminate material), plating processes (electroless Ni-P/Au, electrolytic Au) and lithography patterning. Ground coplanar waveguide was used for microwave structures with excellent ground planes connections due to easy via holes implementation. We present results of high frequency packaging of important RF blocks, such as integrated broadband bias-T, transimpedance amplifier ICs and silicon photonics optical modulators. The paper demonstrates a solution for high frequency hybridization that can be implemented with standard substrates, designed with any shape and with large numbers of metalized via holes and compatible with usual assembling techniques.

Long-Haul Truck Sleeper Heating Load Reduction Package for Rest Period Idling

DOE Office of Scientific and Technical Information (OSTI.GOV)

Lustbader, Jason Aaron; Kekelia, Bidzina; Tomerlin, Jeff

Annual fuel use for sleeper cab truck rest period idling is estimated at 667 million gallons in the United States, or 6.8% of long-haul truck fuel use. Truck idling during a rest period represents zero freight efficiency and is largely done to supply accessory power for climate conditioning of the cab. The National Renewable Energy Laboratory's CoolCab project aims to reduce heating, ventilating, and air conditioning (HVAC) loads and resulting fuel use from rest period idling by working closely with industry to design efficient long-haul truck thermal management systems while maintaining occupant comfort. Enhancing the thermal performance of cab/sleepers willmore » enable smaller, lighter, and more cost-effective idle reduction solutions. In addition, if the fuel savings provide a one- to three-year payback period, fleet owners will be economically motivated to incorporate them. For candidate idle reduction technologies to be implemented by original equipment manufacturers and fleets, their effectiveness must be quantified. To address this need, several promising candidate technologies were evaluated through experimentation and modeling to determine their effectiveness in reducing rest period HVAC loads. Load reduction strategies were grouped into the focus areas of solar envelope, occupant environment, conductive pathways, and efficient equipment. Technologies in each of these focus areas were investigated in collaboration with industry partners. The most promising of these technologies were then combined with the goal of exceeding a 30% reduction in HVAC loads. These technologies included 'ultra-white' paint, advanced insulation, and advanced curtain design. Previous testing showed more than a 35.7% reduction in air conditioning loads. This paper describes the overall heat transfer coefficient testing of this advanced load reduction technology package that showed more than a 43% reduction in heating load. Adding an additional layer of advanced insulation with a reflective barrier to the thermal load reduction package resulted in a 53.3% reduction in the overall heat transfer coefficient.« less

Long-Haul Truck Sleeper Heating Load Reduction Package for Rest Period Idling: Preprint

DOE Office of Scientific and Technical Information (OSTI.GOV)

Lustbader, Jason; Kekelia, Bidzina; Tomerlin, Jeff

Annual fuel use for sleeper cab truck rest period idling is estimated at 667 million gallons in the United States, or 6.8% of long-haul truck fuel use. Truck idling during a rest period represents zero freight efficiency and is largely done to supply accessory power for climate conditioning of the cab. The National Renewable Energy Laboratory's CoolCab project aims to reduce heating, ventilating, and air conditioning (HVAC) loads and resulting fuel use from rest period idling by working closely with industry to design efficient long-haul truck thermal management systems while maintaining occupant comfort. Enhancing the thermal performance of cab/sleepers willmore » enable smaller, lighter, and more cost-effective idle reduction solutions. In addition, if the fuel savings provide a one- to three-year payback period, fleet owners will be economically motivated to incorporate them. For candidate idle reduction technologies to be implemented by original equipment manufacturers and fleets, their effectiveness must be quantified. To address this need, several promising candidate technologies were evaluated through experimentation and modeling to determine their effectiveness in reducing rest period HVAC loads. Load reduction strategies were grouped into the focus areas of solar envelope, occupant environment, conductive pathways, and efficient equipment. Technologies in each of these focus areas were investigated in collaboration with industry partners. The most promising of these technologies were then combined with the goal of exceeding a 30% reduction in HVAC loads. These technologies included 'ultra-white' paint, advanced insulation, and advanced curtain design. Previous testing showed more than a 35.7% reduction in air conditioning loads. This paper describes the overall heat transfer coefficient testing of this advanced load reduction technology package that showed more than a 43% reduction in heating load. Adding an additional layer of advanced insulation with a reflective barrier to the thermal load reduction package resulted in a 53.3% reduction in the overall heat transfer coefficient.« less

Open source marketing: Camel cigarette brand marketing in the "Web 2.0" world.

PubMed

Freeman, B; Chapman, S

2009-06-01

The international trend towards comprehensive bans on tobacco advertising has seen the tobacco industry become increasingly innovative in its approach to marketing. Further fuelling this innovation is the rapid evolution and accessibility of web-based technology. The internet, as a relatively unregulated marketing environment, provides many opportunities for tobacco companies to pursue their promotional ambitions. In this paper, "open source marketing" is considered as a vehicle that has been appropriated by the tobacco industry, through a case study of efforts to design the packaging for the Camel Signature Blends range of cigarettes. Four sources are used to explore this case study including a marketing literature search, a web-based content search via the Google search engine, interviews with advertising trade informants and an analysis of the Camel brand website. RJ Reynolds (RJR) has proven to be particularly innovative in designing cigarette packaging. RJR engaged with thousands of consumers through their Camel brand website to design four new cigarette flavours and packages. While the Camel Signature Blends packaging designs were subsequently modified for the retail market due to problems arising with their cartoon-like imagery, important lessons arise on how the internet blurs the line between marketing and market research. Open source marketing has the potential to exploit advertising ban loopholes and stretch legal definitions in order to generate positive word of mouth about tobacco products. There are also lessons in the open source marketing movement for more effective tobacco control measures including interactive social marketing campaigns and requiring plain packaging of tobacco products.

A New Network Modeling Tool for the Ground-based Nuclear Explosion Monitoring Community

NASA Astrophysics Data System (ADS)

Merchant, B. J.; Chael, E. P.; Young, C. J.

2013-12-01

Network simulations have long been used to assess the performance of monitoring networks to detect events for such purposes as planning station deployments and network resilience to outages. The standard tool has been the SAIC-developed NetSim package. With correct parameters, NetSim can produce useful simulations; however, the package has several shortcomings: an older language (FORTRAN), an emphasis on seismic monitoring with limited support for other technologies, limited documentation, and a limited parameter set. Thus, we are developing NetMOD (Network Monitoring for Optimal Detection), a Java-based tool designed to assess the performance of ground-based networks. NetMOD's advantages include: coded in a modern language that is multi-platform, utilizes modern computing performance (e.g. multi-core processors), incorporates monitoring technologies other than seismic, and includes a well-validated default parameter set for the IMS stations. NetMOD is designed to be extendable through a plugin infrastructure, so new phenomenological models can be added. Development of the Seismic Detection Plugin is being pursued first. Seismic location and infrasound and hydroacoustic detection plugins will follow. By making NetMOD an open-release package, it can hopefully provide a common tool that the monitoring community can use to produce assessments of monitoring networks and to verify assessments made by others.

COST ESTIMATION MODELS FOR DRINKING WATER TREATMENT UNIT PROCESSES

EPA Science Inventory

Cost models for unit processes typically utilized in a conventional water treatment plant and in package treatment plant technology are compiled in this paper. The cost curves are represented as a function of specified design parameters and are categorized into four major catego...

Reliability and paste process optimization of eutectic and lead-free for mixed packaging

NASA Technical Reports Server (NTRS)

Ramkumar, S. M.; Ganeshan, V.; Thenalur, K.; Ghaffarian, R.

2002-01-01

This paper reports the results of an experiment that utilized the JPL's area array consortium test vehicle design, containing a myriad of mixed technology components with an OSP finish. The details of the reliability study are presented in this paper.

How to Design a Genetic Mating Scheme: A Basic Training Package for Drosophila Genetics

PubMed Central

Roote, John; Prokop, Andreas

2013-01-01

Drosophila melanogaster is a powerful model organism for biological research. The essential and common instrument of fly research is genetics, the art of applying Mendelian rules in the specific context of Drosophila with its unique classical genetic tools and the breadth of modern genetic tools and strategies brought in by molecular biology, transgenic technologies and the use of recombinases. Training newcomers to fly genetics is a complex and time-consuming task but too important to be left to chance. Surprisingly, suitable training resources for beginners currently are not available. Here we provide a training package for basic Drosophila genetics, designed to ensure that basic knowledge on all key areas is covered while reducing the time invested by trainers. First, a manual introduces to fly history, rationale for mating schemes, fly handling, Mendelian rules in fly, markers and balancers, mating scheme design, and transgenic technologies. Its self-study is followed by a practical training session on gender and marker selection, introducing real flies under the dissecting microscope. Next, through self-study of a PowerPoint presentation, trainees are guided step-by-step through a mating scheme. Finally, to consolidate knowledge, trainees are asked to design similar mating schemes reflecting routine tasks in a fly laboratory. This exercise requires individual feedback but also provides unique opportunities for trainers to spot weaknesses and strengths of each trainee and take remedial action. This training package is being successfully applied at the Manchester fly facility and may serve as a model for further training resources covering other aspects of fly research. PMID:23390611

Packaging - Materials review

DOE Office of Scientific and Technical Information (OSTI.GOV)

Herrmann, Matthias

2014-06-16

Nowadays, a large number of different electrochemical energy storage systems are known. In the last two decades the development was strongly driven by a continuously growing market of portable electronic devices (e.g. cellular phones, lap top computers, camcorders, cameras, tools). Current intensive efforts are under way to develop systems for automotive industry within the framework of electrically propelled mobility (e.g. hybrid electric vehicles, plug-in hybrid electric vehicles, full electric vehicles) and also for the energy storage market (e.g. electrical grid stability, renewable energies). Besides the different systems (cell chemistries), electrochemical cells and batteries were developed and are offered in manymore » shapes, sizes and designs, in order to meet performance and design requirements of the widespread applications. Proper packaging is thereby one important technological step for designing optimum, reliable and safe batteries for operation. In this contribution, current packaging approaches of cells and batteries together with the corresponding materials are discussed. The focus is laid on rechargeable systems for industrial applications (i.e. alkaline systems, lithium-ion, lead-acid). In principle, four different cell types (shapes) can be identified - button, cylindrical, prismatic and pouch. Cell size can be either in accordance with international (e.g. International Electrotechnical Commission, IEC) or other standards or can meet application-specific dimensions. Since cell housing or container, terminals and, if necessary, safety installations as inactive (non-reactive) materials reduce energy density of the battery, the development of low-weight packages is a challenging task. In addition to that, other requirements have to be fulfilled: mechanical stability and durability, sealing (e.g. high permeation barrier against humidity for lithium-ion technology), high packing efficiency, possible installation of safety devices (current interrupt device, valve, etc.), chemical inertness, cost issues, and others. Finally, proper cell design has to be considered for effective thermal management (i.e. cooling and heating) of battery packs.« less

Optical interconnection and packaging technologies for advanced avionics systems

NASA Astrophysics Data System (ADS)

Schroeder, J. E.; Christian, N. L.; Cotti, B.

1992-09-01

An optical backplane developed to demonstrate the advantages of high-performance optical interconnections and supporting technologies and designed to be compatible with standard avionics racks is described. The hardware demonstrates the three basic components of optical interconnects: optical sources, an optical signal distribution network, and optical receivers. Results from characterization and environmental tests, including a demonstration of the reliable transmission of serial data at a 1 Gb/s, are reported.

Coal-Burning Technologies Applicable to Air Force Central Heating Plants

DTIC Science & Technology

1989-12-01

8 3. DESCRIPTION OF REPLACEMENT OR EXPANSION TECHNOLOGIES ........ 9 3.1.1 Shell (Fire- Tube ) Boilers ........... 9...3.1.2 Water- Tube Boilers .*.*........***.... 10 3.1.3 Packaged vs Field-Erected Construction ...... 11 3.2 STOKER FIRING ...... .. 11 3.2.1 Description...FIGURES 4 Figure Pg 1 Schematic diagram of a typical scotch shell boiler: wet-back, three-pass design ..~............... 9 2 Commnon tube patterns for

Inflatable Antenna Microwave Radiometer for Soil Moisture Measurement

NASA Technical Reports Server (NTRS)

Bailey, M. C.; Kendall, Bruce M.; Schroeder, Lyle C.; Harrington, Richard F.

1993-01-01

Microwave measurements of soil moisture are not being obtained at the required spatial Earth resolution with current technology. Recently, new novel designs for lightweight reflector systems have been developed using deployable inflatable antenna structures which could enable lightweight real-aperture radiometers. In consideration of this, a study was conducted at the NASA Langley Research Center (LaRC) to determine the feasibility of developing a microwave radiometer system using inflatable reflector antenna technology to obtain high spatial resolution radiometric measurements of soil moisture from low Earth orbit and which could be used with a small and cost effective launch vehicle. The required high resolution with reasonable swath width coupled with the L-band measurement frequency for soil moisture dictated the use of a large (30 meter class) real aperture antenna in conjunction with a pushbroom antenna beam configuration and noise-injection type radiometer designs at 1.4 and 4.3 GHz to produce a 370 kilometer cross-track swath with a 10 kilometer resolution that could be packaged for launch with a Titan 2 class vehicle. This study includes design of the inflatable structure, control analysis, structural and thermal analysis, antenna and feed design, radiometer design, payload packaging, orbital analysis, and electromagnetic losses in the thin membrane inflatable materials.

A Boundary Scan Test Vehicle for Direct Chip Attach Testing

NASA Technical Reports Server (NTRS)

Parsons, Heather A.; DAgostino, Saverio; Arakaki, Genji

2000-01-01

To facilitate the new faster, better and cheaper spacecraft designs, smaller more mass efficient avionics and instruments are using higher density electronic packaging technologies such as direct chip attach (DCA). For space flight applications, these technologies need to have demonstrated reliability and reasonably well defined fabrication and assembly processes before they will be accepted as baseline designs in new missions. As electronics shrink in size, not only can repair be more difficult, but 49 probing" circuitry can be very risky and it becomes increasingly more difficult to identify the specific source of a problem. To test and monitor these new technologies, the Direct Chip Attach Task, under NASA's Electronic Parts and Packaging Program (NEPP), chose the test methodology of boundary scan testing. The boundary scan methodology was developed for interconnect integrity and functional testing at hard to access electrical nodes. With boundary scan testing, active devices are used and failures can be identified to the specific device and lead. This technology permits the incorporation of "built in test" into almost any circuit and thus gives detailed test access to the highly integrated electronic assemblies. This presentation will describe boundary scan, discuss the development of the boundary scan test vehicle for DCA and current plans for testing of direct chip attach configurations.

Attitude sensor package

NASA Technical Reports Server (NTRS)

Aceti, R.; Trischberger, M.; Underwood, P. J.; Pomilia, A.; Cosi, M.; Boldrini, F.

1993-01-01

This paper describes the design, construction, testing, and successful flight of the Attitude Sensor Package. The payload was assembled on a standard HITCHHIKER experiment mounting plate, and made extensive use of the carrier's power and data handling capabilities. The side mounted HITCHHIKER version was chosen, since this configuration provided the best viewing conditions for the instruments. The combustion was successfully flown on board Space Shuttle Columbia (STS-52), in October 1992. The payload was one of the 14 experiments of the In-Orbit Technology Demonstration Program (Phase 1) of the European Space Agency.

Photo-Curable Metal-Chelating Coatings Offer a Scalable Approach to Production of Antioxidant Active Packaging.

PubMed

Lin, Zhuangsheng; Goddard, Julie

2018-02-01

Synthetic metal chelators (for example, ethylenediaminetetraacetic acid, EDTA) are widely used as additives to control trace transition metal induced oxidation in consumer products. To enable removal of synthetic chelators in response to increasing consumer demand for clean label products, metal-chelating active food packaging technologies have been developed with demonstrated antioxidant efficacy in simulated food systems. However, prior work in fabrication of metal-chelating materials leveraged batch chemical reactions to tether metal-chelating ligands, a process with limited industrial translatability for large-scale fabrication. To improve the industrial translatability, we have designed a 2-step laminated photo-grafting process to introduce metal chelating functionality onto common polymeric packaging materials. Iminodiacetic acid (IDA) functionalized materials were fabricated by photo-grafting poly(acrylic acid) onto polypropylene (PP) films, followed by a second photo-grafting process to graft-polymerize an IDA functionalized vinyl monomer (GMA-IDA). The photo-grafting was conducted under atmospheric conditions and was completed in 2 min. The resulting IDA functionalized metal-chelating material was able to chelate iron and copper, and showed antioxidant efficacy against ascorbic acid degradation, supporting its potential to be used synergistically with natural antioxidants for preservation of food and beverage products. The 2-step photo-grafting process improves the throughput of active packaging coatings, enabling potential roll-to-roll fabrication of metal-chelating active packaging materials for antioxidant food packaging applications. To address consumer and retail demands for "clean label" foods and beverages without a corresponding loss in product quality and shelf life, producers are seeking next generation technologies such as active packaging. In this work, we will report the synthesis of metal-chelating active packaging films, which enable removal of the synthetic additive, ethylenediamine tetraacetic acid. The new synthesis technique improves the throughput of metal-chelating active packaging coatings, enabling potential roll-to-roll fabrication of the materials for antioxidant food packaging applications. © 2018 Institute of Food Technologists®.

Design of compact freeform lens for application specific Light-Emitting Diode packaging.

PubMed

Wang, Kai; Chen, Fei; Liu, Zongyuan; Luo, Xiaobing; Liu, Sheng

2010-01-18

Application specific LED packaging (ASLP) is an emerging technology for high performance LED lighting. We introduced a practical design method of compact freeform lens for extended sources used in ASLP. A new ASLP for road lighting was successfully obtained by integrating a polycarbonate compact freeform lens of small form factor with traditional LED packaging. Optical performance of the ASLP was investigated by both numerical simulation based on Monte Carlo ray tracing method and experiments. Results demonstrated that, comparing with traditional LED module integrated with secondary optics, the ASLP had advantages of much smaller size in volume (approximately 1/8), higher system lumen efficiency (approximately 8.1%), lower cost and more convenience for customers to design and assembly, enabling possible much wider applications of LED for general road lighting. Tolerance analyses were also conducted. Installation errors of horizontal and vertical deviations had more effects on the shape and uniformity of radiation pattern compared with rotational deviation. The tolerances of horizontal, vertical and rotational deviations of this lens were 0.11 mm, 0.14 mm and 2.4 degrees respectively, which were acceptable in engineering.

Implementation Status of a Ultra-Wideband Receiver Package for the next-generation Very Large Array

NASA Astrophysics Data System (ADS)

Lazio, T. Joseph W.; Velazco, Jose; Soriano, Melissa; Hoppe, Daniel; Russell, Damon; D'Addario, Larry; Long, Ezra; Bowen, James; Samoska, Lorene; Janzen, Andrew

2017-01-01

The next-generation Very Large Array (ngVLA) is a concept for a radio astronomical interferometric array operating in the frequency range 1.2 GHz to 116 GHz and designed to provide substantial improvements in sensitivity, angular resolution, and frequency coverage above the current Very Large Array (VLA). As notional design goals, it would have a continuous frequency coverage of 1.2 GHz to 48 GHz and be 10 times more sensitive than the VLA (and 25 times more sensitive than a 34 m diameter antenna of the Deep Space Network [DSN]). One of the key goals for the ngVLA is to reduce the operating costs without sacrificing performance. We are designing an ultra-wideband receiver package designed to operate across the 8 to 48 GHz frequency range, which can be contrasted to the current VLA, which covers this frequency range with five receiver packages. Reducing the number of receiving systems required to cover the full frequency range would reduce operating costs, and the objective of this work is to develop a prototype integrated feed-receiver package with a sensitivity performance comparable to current narrower band systems on radio telescopes and the DSN, but with a design that meets the requirement of low long-term operational costs. The ultra-wideband receiver package consists of a feed horn, low-noise amplifier (LNA), and down-converters to analog intermediate frequencies. Key features of this design are a quad-ridge feed horn with dielectric loading and a cryogenic receiver with a noise temperature of no more than 30 K at the low end of the band. We will report on the status of this receiver package development including the feed design and LNA implementation. We will present simulation studies of the feed horn including the insertion of dielectric components for improved illumination efficiencies across the band of interest. In addition, we will show experimental results of low-noise 35nm InP HEMT amplifier testing performed across the 8-50 GHz frequency range.Part of this research was carried out at the Jet Propulsion Laboratory, California Institute of Technology, under a contract with the National Aeronautics and Space Administration.

Fully Packaged Carbon Nanotube Supercapacitors by Direct Ink Writing on Flexible Substrates.

PubMed

Chen, Bolin; Jiang, Yizhou; Tang, Xiaohui; Pan, Yayue; Hu, Shan

2017-08-30

The ability to print fully packaged integrated energy storage components (e.g., supercapacitors) is of critical importance for practical applications of printed electronics. Due to the limited variety of printable materials, most studies on printed supercapacitors focus on printing the electrode materials but rarely the full-packaged cell. This work presents for the first time the printing of a fully packaged single-wall carbon nanotube-based supercapacitor with direct ink writing (DIW) technology. Enabled by the developed ink formula, DIW setup, and cell architecture, the whole printing process is mask free, transfer free, and alignment free with precise and repeatable control on the spatial distribution of all constituent materials. Studies on cell design show that a wider electrode pattern and narrower gap distance between electrodes lead to higher specific capacitance. The as-printed fully packaged supercapacitors have energy and power performances that are among the best in recently reported planar carbon-based supercapacitors that are only partially printed or nonprinted.

How to Quickly Import CAD Geometry into Thermal Desktop

NASA Technical Reports Server (NTRS)

Wright, Shonte; Beltran, Emilio

2002-01-01

There are several groups at JPL (Jet Propulsion Laboratory) that are committed to concurrent design efforts, two are featured here. Center for Space Mission Architecture and Design (CSMAD) enables the practical application of advanced process technologies in JPL's mission architecture process. Team I functions as an incubator for projects that are in the Discovery, and even pre-Discovery proposal stages. JPL's concurrent design environment is to a large extent centered on the CAD (Computer Aided Design) file. During concurrent design sessions CAD geometry is ported to other more specialized engineering design packages.

Boxing It Up-a Cross-curricular Approach.

ERIC Educational Resources Information Center

Till, Wesley

1996-01-01

Reports on a class project that examined the manufacture of boxes and packaging to teach about design and technology. The class discovered basic manufacturing techniques by examining and disassembling cereal boxes. Field trips to stores provided more examples. Appraises the children's final projects and discusses acquiring materials. (MJP)

An application specific integrated circuit based multi-anode microchannel array readout system

NASA Technical Reports Server (NTRS)

Smeins, Larry G.; Stechman, John M.; Cole, Edward H.

1991-01-01

Size reduction of two new multi-anode microchannel array (MAMA) readout systems is described. The systems are based on two analog and one digital application specific integrated circuits (ASICs). The new readout systems reduce volume over previous discrete designs by 80 percent while improving electrical performance on virtually every significant parameter. Emphasis is made on the packaging used to achieve the volume reduction. Surface mount technology (SMT) is combined with modular construction for the analog portion of the readout. SMT reliability concerns and the board area impact of MIL SPEC SMT components is addressed. Package selection for the analog ASIC is discussed. Future sytems will require even denser packaging and the volume reduction progression is shown.

Chip-on-Board Technology 1996 Year-end Report (Design, Manufacturing, and Reliability Study)

NASA Technical Reports Server (NTRS)

Le, Binh Q.; Nhan, Elbert; Maurer, Richard H.; Lew, Ark L.; Lander, Juan R.

1996-01-01

The major impetus for flight qualifying Chip-On-Board (COB) packaging technology is the shift in emphasis for space missions to smaller, better, and cheaper spacecraft and satellites resulting from the NASA New Millenium initiative and similar requirements in DoD-sponsored programs. The most important benefit that can potentially be derived from miniaturizing spacecraft and satellites is the significant cost saving realizable if a smaller launch vehicle may be employed. Besides the program cost saving, there are several other advantages to building COB-based space hardware. First, once a well-controlled process is established, COB can be low cost compared to standard Multi-Chip Module (MCM) technology. This cost competitiveness is regarded as a result of the generally greater availability and lower cost of Known Good Die (KGD). Coupled with the elimination of the first level of packaging (chip package), compact, high-density circuit boards can be realized with Printed Wiring Boards (PWB) that can now be made with ever-decreasing feature size in line width and via hole. Since the COB packaging technique in this study is based mainly on populating bare dice on a suitable multi-layer laminate substrate which is not hermetically sealed, die coating for protection from the environment is required. In recent years, significant improvements have been made in die coating materials which further enhance the appeal of COB. Hysol epoxies, silicone, parylene and silicon nitride are desirable because of their compatible Thermal Coefficient of Expansion (TCE) and good moisture resistant capability. These die coating materials have all been used in the space and other industries with varying degrees of success. COB technology, specifically siliconnitride coated hardware, has been flown by Lockheed on the Polar satellite. In addition, DARPA has invested a substantial amount of resources on MCM and COB-related activities recently. With COB on the verge of becoming a dominant player in DoD programs, DARPA is increasing its support of the availability of KGDs which will help decrease their cost. Aside from the various major developments and trends in the space and defense industries that are favorable to the acceptance and widespread use of'COB packaging technology, implementing COB can be appealing in other aspects. Since the interconnection interface is usually the weak link in a system, the overall circuit or system reliability may actually be improved because of the elimination of a level of interconnect/packaging at the chip. With COB, mixing packaging technologies is possible. Because some devices are only available in commercial plastic packages, populating a multi-layer laminate substrate with both bare dice and plastic-package parts is inevitable. Another attractive feature of COB is that re-workability is possible if die coating is applied only on the die top. This method allows local replacement of individual dice that were found to be defective instead of replacing an entire board. In terms of thermal management, unpackaged devices offer a shorter thermal resistance path than their packaged counterparts thereby improving thermal sinking and heat removal from the parts.

Power Extension Package (PEP) system definition extension, orbital service module systems analysis study. Volume 1: Executive summary

NASA Technical Reports Server (NTRS)

1979-01-01

An array deployment assembly, power regulation and control assembly, the necessary interface, and display and control equipment comprise the power extension package (PEP) which is designed to provide increased power and duration, as well as reduce fuel cell cryogen consumption during Spacelab missions. Compatible with all currently defined missions and payloads, PEP imposes minimal weight and volume penalties on sortie missions, and can be installed and removed as needed at the launch site within the normal Orbiter turnaround cycle. The technology on which it is based consists of a modified solar electric propulsion array, standard design regulator and control equipment, and a minimally modified Orbiter design. The requirements from which PEP was derived, and the system and its performance capabilities are described. Features of the recommended project are presented.

Progress of the Dust Accumulation and Removal Technology Experiment (DART) for the Mars 2001 Lander

NASA Technical Reports Server (NTRS)

Jenkins, Phillip; Landis, Geoffrey A.; Wilt, David; Krasowski, Michael; Greer, Lawrence; Baraona, Cosmo; Scheiman, David

2005-01-01

Dust deposition could be a significant problem for photovoltaic array operation for long duration missions on the surface of Mars. Measurements made by Pathfinder showed 0.3 percent loss of solar array performance per day due to dust obscuration. We have designed an experiment package, "DART", which is part of the Mars ISPP Precursor (MIP) package, to fly on the Mars-2001 Surveyor Lander. This mission, to launch in April 2001, will arrive on Mars in January 2002. The DART experiment is designed to quantify dust deposition from the Mars atmosphere, measure the properties of settled dust, measure the effect of dust deposition on array performance, and test several methods of clearing dust from solar cells.

Compact, Engineered, 2-Micron Coherent Doppler Wind Lidar Prototype for Field and Airborne Validation: Doppler Aerosol WiNd Lidar (DAWN). Interim Review #1 (6 months)

NASA Technical Reports Server (NTRS)

Kavaya, Michael J.; Singh, Upendra N.; Koch, Grady J.; Yu, Jirong; Amzajerdian, Farzin; Trieu, Bo C.; Petros, Mulugeta

2006-01-01

A new project, selected in 2005 by NASA's Science Mission Directorate (SMD), under the Instrument Incubator Program (IIP), will be described. The 3-year effort is intended to design, fabricate, and demonstrate a packaged, rugged, compact, space-qualifiable coherent Doppler wind lidar (DWL) transceiver capable of future validation in an aircraft and/or Unmanned Aerial Vehicle (UAV). The state-of-the-art 2-micron coherent DWL breadboard at NASA/LaRC will be engineered and compactly packaged consistent with future aircraft flights. The packaged transceiver will be integrated into a coherent DWL system test bed at LaRC. Atmospheric wind measurements will be made to validate the packaged technology. This will greatly advance the coherent part of the hybrid DWL solution to the need for global tropospheric wind measurements.

Design of Control System for Flexible Packaging Bags Palletizing Production Line Based on PLC

NASA Astrophysics Data System (ADS)

Zheng, Huiping; Chen, Lin; Zhao, Xiaoming; Liu, Zhanyang

Flexible packaging bags palletizing production line is to put the bags in the required area according to particular order and size, in order to finish handling, storage, loading and unloading, transportation and other logistics work of goods. Flexible packaging bags palletizing line is composed of turning bags mechanism, shaping mechanism, indexing mechanism, marshalling mechanism, pushing bags mechanism, pressing bags mechanism, laminating mechanism, elevator, tray warehouse, tray conveyor and loaded tray conveyor. Whether the whole production line can smoothly run depends on each of the above equipment and precision control among them. In this paper the technological process and the control logic of flexible packaging bags palletizing production line is introduced. Palletizing process of the production line realized automation by means of a control system based on programmable logic controller (PLC). It has the advantages of simple structure, reliable and easy maintenance etc.

poRe: an R package for the visualization and analysis of nanopore sequencing data.

PubMed

Watson, Mick; Thomson, Marian; Risse, Judith; Talbot, Richard; Santoyo-Lopez, Javier; Gharbi, Karim; Blaxter, Mark

2015-01-01

The Oxford Nanopore MinION device represents a unique sequencing technology. As a mobile sequencing device powered by the USB port of a laptop, the MinION has huge potential applications. To enable these applications, the bioinformatics community will need to design and build a suite of tools specifically for MinION data. Here we present poRe, a package for R that enables users to manipulate, organize, summarize and visualize MinION nanopore sequencing data. As a package for R, poRe has been tested on Windows, Linux and MacOSX. Crucially, the Windows version allows users to analyse MinION data on the Windows laptop attached to the device. poRe is released as a package for R at http://sourceforge.net/projects/rpore/. A tutorial and further information are available at https://sourceforge.net/p/rpore/wiki/Home/. © The Author 2014. Published by Oxford University Press.

Determining the feasibility of objective adherence measurement with blister packaging smart technology.

PubMed

van Onzenoort, Hein A; Neef, Cees; Verberk, Willem W; van Iperen, H Peter; de Leeuw, Peter W; van der Kuy, Paul-Hugo M

2012-05-15

The results of a feasibility study of blister-pack smart technology for monitoring medication adherence are reported. Research in the area of objective therapy compliance measurement has led to the development of microprocessor-driven systems that record the time a unit dose is removed from blister packaging. One device under development is the Smart Blister-a label imprinted with event-detection circuitry that can be affixed to standard commercial blister cards. In the first trial of the device in actual clinical practice, 115 community-dwelling Dutch patients receiving valsartan maintenance therapy (160 mg once daily) were given 14-day blister packages equipped with the Smart Blister. On the return of empty blister cards to the 20 participating community pharmacies, the stored information was scanned and downloaded for data analysis and patient counseling purposes. A total of 245 Smart Blister-equipped packages were used by valsartan recipients during the eight-month study. The device was largely effective in recording patient and blister-card identification data and other desired information. However, in 17% of cases, the Smart Blister system registered multiple tablet-removal events at the same time, presumably indicating unintentional breakage of nearby conductive circuits and the need for design refinements. The Smart Blister-equipped medication cards were generally well received by patients and pharmacies. An evaluation of the functionality and robustness of the Smart Blister in a real-world clinical practice situation yielded some promising results, but the findings also indicated a need for design refinements and additional performance testing of the device.

Electrical characterization of anodic alumina substrate with via-in-pad structure

NASA Astrophysics Data System (ADS)

Kim, Moonjung

2013-10-01

An anodic alumina substrate has been developed as a package substrate for dynamic random access memory devices. Unlike the conventional package substrates commonly made by laminating an epoxy-based core and cladding with copper, this substrate is fabricated using aluminum anodization technology. The anodization process produces a thick aluminum oxide layer on the aluminum substrate to be used as a dielectric layer. Placing copper patterns on the anodic aluminum oxide layer forms a new substrate structure that consists of a layered structure of aluminum, anodic aluminum oxide, and copper. Using selective anodization in the fabrication process, a via structure connecting the top copper layer and bottom aluminum layer is demonstrated. Additionally, by putting vias directly in the bond and ball pads in the substrate design, the via-in-pad structure is applied in this work. These two-layer metal structures and via-in-pad arrangements make routing easier and thus provide more design flexibility. Additionally, this new package substrate has improved the power distribution network impedance given the characteristics of these structures.

Out of This World Software. Teaching with Technology.

ERIC Educational Resources Information Center

Allen, Denise

1996-01-01

Explains that children have a better sense of environmental awareness and introduces the EarthCare Interactive software that is designed for preschoolers to fourth graders. Briefly describes how to navigate in EarthCare and describes four other software packages: "Job City Literature Connections,""Perfect Landing,""Classroom Occupation," and…

Molding compound trends in a denser packaging world: Qualification tests and reliability concerns

NASA Astrophysics Data System (ADS)

Nguyen, L. T.; Lo, R. H. Y.; Chen, A. S.; Belani, J. G.

1993-12-01

Molding compound development has traditionally been driven by the memory market, then subsequent applications filter down to other IC technologies such as logic, analog, and ASIC. However, this strategy has changed lately with the introduction of thin packages such as PQFP & TSOP. Rather than targeting a compound for a family of IC such as DRAM or SRAM, compound development efforts are now focused at specific classes of packages. The configurations of these thin packages impose new functional requirements that need to be revisited to provide the optimized combination of properties. The evolution of qualification tests mirrors the advances in epoxy and compounding technologies. From the first standard novolac-based epoxies of the 1970s to the latest 3(sup rd)-generation ultra-low stress materials, longer test times at increasingly harsher environments were achieved. This paper benchmarks the current reliability tests used by the electronic industry, examines those tests that affect and are affected by the molding compounds, discusses the relevance of accelerated testing, and addresses the major reliability issues facing current molding compound development efforts. Six compound-related reliability concerns were selected: moldability, package stresses, package cracking, halogen-induced intermetallic growth at bond pads, moisture-induced corrosion, and interfacial delamination. Causes of each failure type are surveyed and remedies are recommended. Accelerated tests are designed to apply to a limited quantity of devices, bias, or environmental conditions larger than usual ratings, to intensify failure mechanisms that would occur under normal operating conditions. The observed behavior is then extrapolated from the lot to the entire population. Emphasis is on compressing the time necessary to obtain reliability data. This approach has two main drawbacks. With increasingly complex devices, even accelerated tests are expensive. And with new technologies, it becomes difficult to ascertain that the applied stress 1) induces the failure phenomenon linked with usual field conditions, and 2) does not create any new ones. Technology evolution and reliability testing are interdependent. Devices get larger with increasingly smaller features and more complex geometries. Molding compounds have evolved considerably over the past decade to provide ultra-low stress levels and moldability for thin packages.

Packaging of wavelength stabilized 976nm 100W 105µm 0.15 NA fiber coupled diode lasers

NASA Astrophysics Data System (ADS)

Jiang, Xiaochen; Liu, Rui; Gao, Yanyan; Zhang, Tujia; He, Xiaoguang; Zhu, Jing; Zhang, Qiang; Yang, Thomas; Zhang, Cuipeng

2016-03-01

Fiber coupled diode lasers are widely used in many fields now especially as pumps in fiber laser systems. In many fiber laser applications, high brightness pumps are essential to achieve high brightness fiber lasers. Furthermore, 976nm wavelength absorption band is narrow with Yb3+ doped fiber lasers which is more challenging for controlling wavelength stabilized in diode laser modules. This study designed and implemented commercial available high brightness and narrow wavelength width lasers to be able to use in previous mentioned applications. Base on multiple single emitters using spatial and polarization beam combining as well as fiber coupling techniques, we report a wavelength stabilized, 105μm NA 0.15 fiber coupled diode laser package with 100W of optical output power at 976 nm, which are 14 emitters inside each multiple single emitter module. The emitting aperture of the combined lasers output are designed and optimized for coupling light into a 105μm core NA 0.15 fiber. Volume Bragg grating technology has been used to improve spectral characteristics of high-power diode lasers. Mechanical modular design and thermal simulation are carried out to optimize the package. The spectral width is roughly 0.5 nm (FWHM) and the wavelength shift per °C < 0.02nm. The output spectrum is narrowed and wavelength is stabilized using Volume Bragg gratings (VBGs). The high brightness package has an electrical to optical efficiency better than 45% and power enclosure more than 90% within NA 0.12. Qualification tests have been included on this kind of package. Mechanical shock, vibration and accelerated aging tests show that the package is reliability and the MTTF is calculated to be more than 100k hours at 25°C.

Natural biopolimers in organic food packaging

NASA Astrophysics Data System (ADS)

Wieczynska, Justyna; Cavoski, Ivana; Chami, Ziad Al; Mondelli, Donato; Di Donato, Paola; Di Terlizzi, Biagio

2014-05-01

Concerns on environmental and waste problems caused by use of non-biodegradable and non-renewable based plastic packaging have caused an increase interest in developing biodegradable packaging using renewable natural biopolymers. Recently, different types of biopolymers like starch, cellulose, chitosan, casein, whey protein, collagen, egg white, soybean protein, corn zein, gelatin and wheat gluten have attracted considerable attention as potential food packaging materials. Recyclable or biodegradable packaging material in organic processing standards is preferable where possible but specific principles of packaging are not precisely defined and standards have to be assessed. There is evidence that consumers of organic products have specific expectations not only with respect to quality characteristics of processed food but also in social and environmental aspects of food production. Growing consumer sophistication is leading to a proliferation in food eco-label like carbon footprint. Biopolymers based packaging for organic products can help to create a green industry. Moreover, biopolymers can be appropriate materials for the development of an active surfaces designed to deliver incorporated natural antimicrobials into environment surrounding packaged food. Active packaging is an innovative mode of packaging in which the product and the environment interact to prolong shelf life or enhance safety or sensory properties, while maintaining the quality of the product. The work will discuss the various techniques that have been used for development of an active antimicrobial biodegradable packaging materials focusing on a recent findings in research studies. With the current focus on exploring a new generation of biopolymer-based food packaging materials with possible applications in organic food packaging. Keywords: organic food, active packaging, biopolymers , green technology

Evaluating Penetration Ability of Plodia interpunctella (Hübner) (Lepidoptera: Pyralidae) Larvae into Multilayer Polypropylene Packages.

PubMed

Scheff, Deanna S; Sehgal, Blossom; Subramanyam, Bhadriraju

2018-04-18

The larvae of the Indian meal moth, Plodia interpunctella (Hübner), can invade or penetrate packaging materials and infest food products. Energy bars with three polypropylene packaging types were challenged with eggs (first instars), third instars, and fifth instars of P. interpunctella to determine package resistance at 28 °C and 65% r.h. The packing types were also challenged with two male and two female pupae of P. interpunctella under similar conditions in order to determine which package provided the greatest protection against larval penetration. Samples infested with eggs, third instars, and pupae were evaluated after 21 days and 42 days to count the number of larvae, pupae, and adults found inside the packages. Packages challenged with fifth instars were observed after 21 days to count the number of larvae, pupae, and adults inside each package. The number and diameter of the holes were determined in each package, followed by the amount of damage sustained to the energy bar. Third and fifth instars showed a higher tendency to penetrate all of the packaging types. First instars showed a reduction in package penetration ability compared with third and fifth instars. The increase in exposure time resulted in an increase in the damage sustained to the energy bars. Among packaging types, the thickest package (Test A) was most resilient to penetration by all of the larval stages. In conclusion, energy bar manufacturers need to invest more effort into improving packaging designs, creating thicker gauge films, or advancing odor barrier technology, in order to prevent penetration and infestation by P. interpunctella larvae.

Enhanced thermaly managed packaging for III-nitride light emitters

NASA Astrophysics Data System (ADS)

Kudsieh, Nicolas

In this Dissertation our work on `enhanced thermally managed packaging of high power semiconductor light sources for solid state lighting (SSL)' is presented. The motivation of this research and development is to design thermally high stable cost-efficient packaging of single and multi-chip arrays of III-nitrides wide bandgap semiconductor light sources through mathematical modeling and simulations. Major issues linked with this technology are device overheating which causes serious degradation in their illumination intensity and decrease in the lifetime. In the introduction the basics of III-nitrides WBG semiconductor light emitters are presented along with necessary thermal management of high power cingulated and multi-chip LEDs and laser diodes. This work starts at chip level followed by its extension to fully packaged lighting modules and devices. Different III-nitride structures of multi-quantum well InGaN/GaN and AlGaN/GaN based LEDs and LDs were analyzed using advanced modeling and simulation for different packaging designs and high thermal conductivity materials. Study started with basic surface mounted devices using conventional packaging strategies and was concluded with the latest thermal management of chip-on-plate (COP) method. Newly discovered high thermal conductivity materials have also been incorporated for this work. Our study also presents the new approach of 2D heat spreaders using such materials for SSL and micro LED array packaging. Most of the work has been presented in international conferences proceedings and peer review journals. Some of the latest work has also been submitted to well reputed international journals which are currently been reviewed for publication. .

Customer and mission influence on space station architecture

NASA Technical Reports Server (NTRS)

Runge, F. C.

1985-01-01

Overall Space Station architecture is presented in schematic outlines and plans. How the customer and mission needs influence this design is studied. The uses, occupants, activities, interfaces, utilities, locomotion, environments, and technological costs are all factors which influence the architecture. User and system functions are profiled, interfaces are characterized and functions are grouped. These lead to packaging of functions into modules and the design of system and user accommodations.

PACKAGE PLANTS FOR SMALL SYSTEMS: A FIELD STUDY

EPA Science Inventory

A joint field study was conducted by AWWA and the Drinking Water Research Division of USEPA to evaluate existing small community systems that use package plant technology. Forty-eight package plant systems representing a geographic and technological cross section were evaluated t...

Wafer-Level Vacuum Packaging of Smart Sensors.

PubMed

Hilton, Allan; Temple, Dorota S

2016-10-31

The reach and impact of the Internet of Things will depend on the availability of low-cost, smart sensors-"low cost" for ubiquitous presence, and "smart" for connectivity and autonomy. By using wafer-level processes not only for the smart sensor fabrication and integration, but also for packaging, we can further greatly reduce the cost of sensor components and systems as well as further decrease their size and weight. This paper reviews the state-of-the-art in the wafer-level vacuum packaging technology of smart sensors. We describe the processes needed to create the wafer-scale vacuum microchambers, focusing on approaches that involve metal seals and that are compatible with the thermal budget of complementary metal-oxide semiconductor (CMOS) integrated circuits. We review choices of seal materials and structures that are available to a device designer, and present techniques used for the fabrication of metal seals on device and window wafers. We also analyze the deposition and activation of thin film getters needed to maintain vacuum in the ultra-small chambers, and the wafer-to-wafer bonding processes that form the hermetic seal. We discuss inherent trade-offs and challenges of each seal material set and the corresponding bonding processes. Finally, we identify areas for further research that could help broaden implementations of the wafer-level vacuum packaging technology.

Wafer-Level Vacuum Packaging of Smart Sensors

PubMed Central

Hilton, Allan; Temple, Dorota S.

2016-01-01

The reach and impact of the Internet of Things will depend on the availability of low-cost, smart sensors—“low cost” for ubiquitous presence, and “smart” for connectivity and autonomy. By using wafer-level processes not only for the smart sensor fabrication and integration, but also for packaging, we can further greatly reduce the cost of sensor components and systems as well as further decrease their size and weight. This paper reviews the state-of-the-art in the wafer-level vacuum packaging technology of smart sensors. We describe the processes needed to create the wafer-scale vacuum microchambers, focusing on approaches that involve metal seals and that are compatible with the thermal budget of complementary metal-oxide semiconductor (CMOS) integrated circuits. We review choices of seal materials and structures that are available to a device designer, and present techniques used for the fabrication of metal seals on device and window wafers. We also analyze the deposition and activation of thin film getters needed to maintain vacuum in the ultra-small chambers, and the wafer-to-wafer bonding processes that form the hermetic seal. We discuss inherent trade-offs and challenges of each seal material set and the corresponding bonding processes. Finally, we identify areas for further research that could help broaden implementations of the wafer-level vacuum packaging technology. PMID:27809249

Participation in the Center for Advanced Processing and Packaging Studies

DTIC Science & Technology

2009-11-24

University, the University ofCalifomia, Davis, and North Carolina State University to assist in advancing food processing and packaging technology and...University, the University of California, Davis, and North Carolina State University to assist in advancing food processing and packaging technology and...amyloliquefaciens, spore inactivation, FT-IR spectroscopy, infrared 11 spectroscopy 12 13 14 15 16 17 Department of Food Science and Technology

Novel Ruggedized Packaging Technology for VCSELs

DTIC Science & Technology

2017-03-01

Novel Ruggedized Packaging Technology for VCSELs Charlie Kuznia ckuznia@ultracomm-inc.com Ultra Communications, Inc. Vista, CA, USA, 92081...n ac hieve l ow-power, E MI-immune links within hi gh-performance m ilitary computing an d sensor systems. Figure 1. Chip-scale-packaging of

HALT to qualify electronic packages: a proof of concept

NASA Astrophysics Data System (ADS)

Ramesham, Rajeshuni

2014-03-01

A proof of concept of the Highly Accelerated Life Testing (HALT) technique was explored to assess and optimize electronic packaging designs for long duration deep space missions in a wide temperature range (-150°C to +125°C). HALT is a custom hybrid package suite of testing techniques using environments such as extreme temperatures and dynamic shock step processing from 0g up to 50g of acceleration. HALT testing used in this study implemented repetitive shock on the test vehicle components at various temperatures to precipitate workmanship and/or manufacturing defects to show the weak links of the designs. The purpose is to reduce the product development cycle time for improvements to the packaging design qualification. A test article was built using advanced electronic package designs and surface mount technology processes, which are considered useful for a variety of JPL and NASA projects, i.e. (surface mount packages such as ball grid arrays (BGA), plastic ball grid arrays (PBGA), very thin chip array ball grid array (CVBGA), quad flat-pack (QFP), micro-lead-frame (MLF) packages, several passive components, etc.). These packages were daisy-chained and independently monitored during the HALT test. The HALT technique was then implemented to predict reliability and assess survivability of these advanced packaging techniques for long duration deep space missions in much shorter test durations. Test articles were built using advanced electronic package designs that are considered useful in various NASA projects. All the advanced electronic packages were daisychained independently to monitor the continuity of the individual electronic packages. Continuity of the daisy chain packages was monitored during the HALT testing using a data logging system. We were able to test the boards up to 40g to 50g shock levels at temperatures ranging from +125°C to -150°C. The HALT system can deliver 50g shock levels at room temperature. Several tests were performed by subjecting the test boards to various g levels ranging from 5g to 50g, test durations of 10 minutes to 60 minutes, hot temperatures of up to +125°C and cold temperatures down to -150°C. During the HALT test, electrical continuity measurements of the PBGA package showed an open-circuit, whereas the BGA, MLF, and QFPs showed signs of small variations of electrical continuity measurements. The electrical continuity anomaly of the PBGA occurred in the test board within 12 hours of commencing the accelerated test. Similar test boards were assembled, thermal cycled independently from -150°C to +125°C and monitored for electrical continuity through each package design. The PBGA package on the test board showed an anomalous electrical continuity behavior after 959 thermal cycles. Each thermal cycle took around 2.33 hours, so that a total test time to failure of the PBGA was 2,237 hours (or ~3.1 months) due to thermal cycling alone. The accelerated technique (thermal cycling + shock) required only 12 hours to cause a failure in the PBGA electronic package. Compared to the thermal cycle only test, this was an acceleration of ~186 times (more than 2 orders of magnitude). This acceleration process can save significant time and resources for predicting the life of a package component in a given environment, assuming the failure mechanisms are similar in both the tests. Further studies are in progress to make systematic evaluations of the HALT technique on various other advanced electronic packaging components on the test board. With this information one will be able to estimate the number of mission thermal cycles to failure with a much shorter test program. Further studies are in progress to make systematic study of various components, constant temperature range for both the tests. Therefore, one can estimate the number of hours to fail in a given thermal and shock levels for a given test board physical properties.

The Packaging Technology Study on Smart Composite Structure Based on The Embedded FBG Sensor

NASA Astrophysics Data System (ADS)

Zhang, Youhong; Chang, Xinlong; Zhang, Xiaojun; He, Xiangyong

2018-03-01

It is convenient to carry out the health monitoring of the solid rocket engine composite shell based on the embedded FBG sensor. In this paper, the packaging technology using one-way fiber layer of prepreg fiberglass/epoxy resin was proposed. The proposed packaging process is simple, and the packaged sensor structure size is flexible and convenient to use, at the mean time, the packaged structure has little effect on the pristine composite material structure.

A QR code identification technology in package auto-sorting system

NASA Astrophysics Data System (ADS)

di, Yi-Juan; Shi, Jian-Ping; Mao, Guo-Yong

2017-07-01

Traditional manual sorting operation is not suitable for the development of Chinese logistics. For better sorting packages, a QR code recognition technology is proposed to identify the QR code label on the packages in package auto-sorting system. The experimental results compared with other algorithms in literatures demonstrate that the proposed method is valid and its performance is superior to other algorithms.

Silicon production process evaluations

NASA Technical Reports Server (NTRS)

1982-01-01

Chemical engineering analyses involving the preliminary process design of a plant (1,000 metric tons/year capacity) to produce silicon via the technology under consideration were accomplished. Major activities in the chemical engineering analyses included base case conditions, reaction chemistry, process flowsheet, material balance, energy balance, property data, equipment design, major equipment list, production labor and forward for economic analysis. The process design package provided detailed data for raw materials, utilities, major process equipment and production labor requirements necessary for polysilicon production in each process.

Biodigester Feasibility and Design for Space & Earth

NASA Technical Reports Server (NTRS)

Shutts, Stacy; Ewert, Mike; Bacon, Jack

2016-01-01

Anaerobic digestion converts organic waste into methane gas and fertilizer effluent. The ICA-developed prototype system is designed for planetary surface operation. It uses passive hydrostatic control for reliability, and is modular and redundant. The serpentine configuration accommodates tight geometric constraints similar to the ISS ECLSS rack architectures. Its shallow, low-tilt design enables (variable) lower-g convection than standard Earth (1 g) digesters. This technology will reuse and recycle materials including human waste, excess food, as well as packaging (if biodegradable bags are used).

Ada (Trade Name) Foundation Technology. Volume 4. Software Requirements for WIS (WWMCCS (World Wide Military Command and Control System) Information System) Text Processing Prototypes

DTIC Science & Technology

1986-12-01

graphics : The package allows a character set which can be defined by users giving the picture for a character by designating its pixels. Such characters...type lonts and gsei-oriented "help" messages tailored to the operations being performed and user expertise In general, critical design issues...other volumes include command language, software design , description and analysis tools, database management system operating systems; planning and

The learning of aquaponics practice in university

NASA Astrophysics Data System (ADS)

Agustina, T. W.; Rustaman, N. Y.; Riandi; Purwianingsih, W.

2018-05-01

This study aims to obtain a description of the perfomance capabilities of aquaponic technology and the assessment of product and packaging of harvest kale. The aquaponic practice used a STREAM (Science Technology Religion Art Matematics) approach. The method was explanatory sequential mixed method. The research was conducted on one class of Biology Education students in 6th semester. The sample was chosen purposively with 49 students. The study instruments are student worksheet, observation sheet, rubric performance and product assessment, interview sheet and field notes. The indicator of performance rubrics on the manufacture of aquaponic technology consisted of the product rubric, cultivation criteria and packing method of kale. The interview rubric is in the form of student constraints on the manufacture of aquaponics. Based on the results, most students have performance in designing technology that is categorized as enough up to good. Almost all students produce a very good kale harvest. Most of the students produce kale packaging products that are categorized as enough. The implications of this research are the learning of aquaponic with the STREAM approach can equip student’s performance and product capabilities.

Technology-design-manufacturing co-optimization for advanced mobile SoCs

NASA Astrophysics Data System (ADS)

Yang, Da; Gan, Chock; Chidambaram, P. R.; Nallapadi, Giri; Zhu, John; Song, S. C.; Xu, Jeff; Yeap, Geoffrey

2014-03-01

How to maintain the Moore's Law scaling beyond the 193 immersion resolution limit is the key question semiconductor industry needs to answer in the near future. Process complexity will undoubtfully increase for 14nm node and beyond, which brings both challenges and opportunities for technology development. A vertically integrated design-technologymanufacturing co-optimization flow is desired to better address the complicated issues new process changes bring. In recent years smart mobile wireless devices have been the fastest growing consumer electronics market. Advanced mobile devices such as smartphones are complex systems with the overriding objective of providing the best userexperience value by harnessing all the technology innovations. Most critical system drivers are better system performance/power efficiency, cost effectiveness, and smaller form factors, which, in turns, drive the need of system design and solution with More-than-Moore innovations. Mobile system-on-chips (SoCs) has become the leading driver for semiconductor technology definition and manufacturing. Here we highlight how the co-optimization strategy influenced architecture, device/circuit, process technology and package, in the face of growing process cost/complexity and variability as well as design rule restrictions.

Fabrication and Qualification of Coated Chip-on-Board Technology for Miniaturized Space Systems

NASA Technical Reports Server (NTRS)

Maurer, R. H.; Le, B. Q.; Nhan, E.; Lew, A. L.; Darrin, M. Ann Garrison

1997-01-01

The results of a study carried out in order to manufacture and verify the quality of chip-on-board (COB) packaging technology are presented. The COB, designed for space applications, was tested under environmental stresses, temperature cycling, and temperature-humidity-bias. Both robustness in space applications and in environmental protection on the ground-complete reliability without hermeticity were searched for. The epoxy-parylene combinations proved to be superior to other materials tested.

Principles and application of high pressure-based technologies in the food industry.

PubMed

Balasubramaniam, V M Bala; Martínez-Monteagudo, Sergio I; Gupta, Rockendra

2015-01-01

High pressure processing (HPP) has emerged as a commercially viable food manufacturing tool that satisfies consumers' demand for mildly processed, convenient, fresh-tasting foods with minimal to no preservatives. Pressure treatment, with or without heat, inactivates pathogenic and spoilage bacteria, yeast, mold, viruses, and also spores and extends shelf life. Pressure treatment at ambient or chilled temperatures has minimal impact on product chemistry. The product quality and shelf life are often influenced more by storage conditions and packaging material barrier properties than the treatment itself. Application of pressure reduces the thermal exposure of the food during processing, thereby protecting a variety of bioactive compounds. This review discusses recent scientific advances of high pressure technology for food processing and preservation applications such as pasteurization, sterilization, blanching, freezing, and thawing. We highlight the importance of in situ engineering and thermodynamic properties of food and packaging materials in process design. Current and potential future promising applications of pressure technology are summarized.

Ultra Clean 1.1MW High Efficiency Natural Gas Engine Powered System

DOE Office of Scientific and Technical Information (OSTI.GOV)

Zurlo, James; Lueck, Steve

Dresser, Inc. (GE Energy, Waukesha gas engines) will develop, test, demonstrate, and commercialize a 1.1 Megawatt (MW) natural gas fueled combined heat and power reciprocating engine powered package. This package will feature a total efficiency > 75% and ultra low CARB permitting emissions. Our modular design will cover the 1 – 6 MW size range, and this scalable technology can be used in both smaller and larger engine powered CHP packages. To further advance one of the key advantages of reciprocating engines, the engine, generator and CHP package will be optimized for low initial and operating costs. Dresser, Inc. willmore » leverage the knowledge gained in the DOE - ARES program. Dresser, Inc. will work with commercial, regulatory, and government entities to help break down barriers to wider deployment of CHP. The outcome of this project will be a commercially successful 1.1 MW CHP package with high electrical and total efficiency that will significantly reduce emissions compared to the current central power plant paradigm. Principal objectives by phases for Budget Period 1 include: • Phase 1 – market study to determine optimum system performance, target first cost, lifecycle cost, and creation of a detailed product specification. • Phase 2 – Refinement of the Waukesha CHP system design concepts, identification of critical characteristics, initial evaluation of technical solutions, and risk mitigation plans. Background« less

Students developing resources for students.

PubMed

Pearce, Michael; Evans, Darrell

2012-06-01

The development of new technologies has provided medical education with the ability to enhance the student learning experience and meet the needs of changing curricula. Students quickly adapt to using multimedia learning resources, but these need to be well designed, learner-centred and interactive for students to become significantly engaged. One way to ensure that students become committed users and that resources become distinct elements of the learning cycle is to involve students in resource design and production. Such an approach enables resources to accommodate student needs and preferences, but also provides opportunities for them to develop their own teaching and training skills. The aim of the medical student research project was to design and produce an electronic resource that was focused on a particular anatomical region. The views of other medical students were used to decide what features were suitable for inclusion and the resulting package contained basic principles and clinical relevance, and used a variety of approaches such as images of cadaveric material, living anatomy movies and quizzes. The completed package was assessed using a survey matrix and found to compare well with commercially available products. Given the ever-diversifying arena of multimedia instruction and the ability of students to be fully conversant with technology, this project demonstrates that students are ideal participants and creators of multimedia resources. It is hoped that such an approach will help to further develop the skill base of students, but will also provide an avenue of developing packages that are student user friendly, and that are focused towards particular curricula requirements. © Blackwell Publishing Ltd 2012.

Design and implementation of interface units for high speed fiber optics local area networks and broadband integrated services digital networks

NASA Technical Reports Server (NTRS)

Tobagi, Fouad A.; Dalgic, Ismail; Pang, Joseph

1990-01-01

The design and implementation of interface units for high speed Fiber Optic Local Area Networks and Broadband Integrated Services Digital Networks are discussed. During the last years, a number of network adapters that are designed to support high speed communications have emerged. This approach to the design of a high speed network interface unit was to implement package processing functions in hardware, using VLSI technology. The VLSI hardware implementation of a buffer management unit, which is required in such architectures, is described.

Apparel Manufacture

NASA Technical Reports Server (NTRS)

1995-01-01

Marshall Space Flight Center teamed with the University of Alabama in Huntsville (UAH) in 1989 on a program involving development of advanced simulation software. Concurrently, the State of Alabama chartered UAH to conduct a technology advancement program in support of the state's apparel manufacturers. In 1992, under contract to Marshall, UAH developed an apparel-specific software package that allows manufacturers to design and analyze modules without making an actual investment -- it functions on ordinary PC equipment. By 1995, Marshall had responded to requests for the package from more than 400 companies in 36 states; some of which reported savings up to $2 million. The National Garment Company of Missouri, for example, uses the system to design and balance a modular line before committing to expensive hardware; for setting up sewing lines; and for determining the composition of a new team.

Videodisc Evaluation Report. "The Teddy Bears Disc."

ERIC Educational Resources Information Center

Laurillard, D. M.

This study evaluated the design and effectiveness of an interactive videodisc package which was developed at the Open University for a second level course in metallurgy and materials technology. Based on an existing 25-minute television program from the course, the disk put the problem in the form of a court case assessing the responsibility for…

Military Curricula for Vocational & Technical Education. Basic Baker, 9-4.

ERIC Educational Resources Information Center

Ohio State Univ., Columbus. National Center for Research in Vocational Education.

Both teacher and student materials are included for a bakery technology course designed to facilitate learning the fundamental duties required in a dining facility or centralized pastry shop. One of a number of military-developed curriculum packages selected for adaptation to vocational curriculum and instruction, the course consists of seventeen…

The Big Crush: An Introduction to Materials Testing

ERIC Educational Resources Information Center

Roman, Harry T.

2011-01-01

Lots of engineering thinking can be involved in crushing things. As an example, engineers spend a great deal of time designing crush-proof packaging for delicate equipment and packing materials for items that must be stored or shipped. This article presents an activity wherein students can begin to appreciate the technology behind the engineering.…

The Neutral Atoms Detector Technologies Developed for the SERENA Package for BepiColombo

NASA Astrophysics Data System (ADS)

di Lellis, A. M.; Orsini, S.; Livi, S.; Wurz, P.; Milillo, A.

2004-04-01

A comprehensive suite for the particle detection in the Mercury environment, the SERENA instrument, is going to be proposed for the ESA cornerstone BepiColombo mission. The SERENA package consists of the sensors STROFIO and ELENA, which identify the neutral particles and measure their energies in the range from fractions of eV to a few keVs, and the sensors PICAM and MIPA for measuring and analyzing ionized particles from some eV to tens of keV. The proposed neutral sensor STROFIO will observe and analyze the bulk of the thermal / supra-thermal (0-50 eV) exospheric gas along the ram direction, while ELENA will be devoted to detect the sputtering emission (E min < 100eV; E max > 1 keV) within 1-D (2 deg x 60 deg) nadir cross track slices from the planet surface. The paper describes the new design techniques approached for the neutral particles identification and the related miniaturized datahandling unit. Such design technologies could be fruitfully exported to different applications for planetary exploration.

ROBOSIM: An intelligent simulator for robotic systems

NASA Technical Reports Server (NTRS)

Fernandez, Kenneth R.; Cook, George E.; Biegl, Csaba; Springfield, James F.

1993-01-01

The purpose of this paper is to present an update of an intelligent robotics simulator package, ROBOSIM, first introduced at Technology 2000 in 1990. ROBOSIM is used for three-dimensional geometrical modeling of robot manipulators and various objects in their workspace, and for the simulation of action sequences performed by the manipulators. Geometric modeling of robot manipulators has an expanding area of interest because it can aid the design and usage of robots in a number of ways, including: design and testing of manipulators, robot action planning, on-line control of robot manipulators, telerobotic user interface, and training and education. NASA developed ROBOSIM between 1985-88 to facilitate the development of robotics, and used the package to develop robotics for welding, coating, and space operations. ROBOSIM has been further developed for academic use by its co-developer Vanderbilt University, and has been in both classroom and laboratory environments for teaching complex robotic concepts. Plans are being formulated to make ROBOSIM available to all U.S. engineering/engineering technology schools (over three hundred total with an estimated 10,000+ users per year).

MEMS packaging: state of the art and future trends

NASA Astrophysics Data System (ADS)

Bossche, Andre; Cotofana, Carmen V. B.; Mollinger, Jeff R.

1998-07-01

Now that the technology for Integrated sensor and MEMS devices has become sufficiently mature to allow mass production, it is expected that the prices of bare chips will drop dramatically. This means that the package prices will become a limiting factor in market penetration, unless low cost packaging solutions become available. This paper will discuss the developments in packaging technology. Both single-chip and multi-chip packaging solutions will be addressed. It first starts with a discussion on the different requirements that have to be met; both from a device point of view (open access paths to the environment, vacuum cavities, etc.) and from the application point of view (e.g. environmental hostility). Subsequently current technologies are judged on their applicability for MEMS and sensor packaging and a forecast is given for future trends. It is expected that the large majority of sensing devices will be applied in relative friendly environments for which plastic packages would suffice. Therefore, on the short term an important role is foreseen for recently developed plastic packaging techniques such as precision molding and precision dispensing. Just like in standard electronic packaging, complete wafer level packaging methods for sensing devices still have a long way to go before they can compete with the highly optimized and automated plastic packaging processes.

An evaluation of the effectiveness of FreshCase technology to extend the storage life of whole-muscle pork and ground pork sausage.

PubMed

Yang, X; Woerner, D R; McCullough, K R; Hasty, J D; Geornaras, I; Smith, G C; Sofos, J N; Belk, K E

2016-11-01

The objective of this study was to identify the maximum time of refrigerated storage before aerobic psychrotrophic bacteria grew to a level indicative of spoilage (7 log cfu/g) or other indicators of spoilage were observed for whole-muscle pork and ground pork sausage packaged using FreshCase technology. Pork chops and pork sausage were packaged using conventional vacuum packaging without nitrite in film (Control) or using FreshCase technology and were compared with respect to microbial counts, pH, instrumental color measurements, lipid oxidation level, and sensory properties. The storage life was 45 d for pork chops stored in FreshCase packages at 1°C and 19 d for ground pork sausage stored under the same condition. Results indicated that both pork chops and sausage stored in FreshCase packages retained redder color ( < 0.05) than those stored in Control packages. No differences ( > 0.05) existed between Control and FreshCase packaged samples for any off-odor detection for either pork chops or sausage. Moreover, levels of oxidative rancidity in all packages had low thiobarbituric acid reactive substances values. The results indicated that FreshCase technology can be used to extend storage life of pork products without having adverse effects on pork quality.

Book of Knowledge (BOK) for NASA Electronic Packaging Roadmap

NASA Technical Reports Server (NTRS)

Ghaffarian, Reza

2015-01-01

The objective of this document is to update the NASA roadmap on packaging technologies (initially released in 2007) and to present the current trends toward further reducing size and increasing functionality. Due to the breadth of work being performed in the area of microelectronics packaging, this report presents only a number of key packaging technologies detailed in three industry roadmaps for conventional microelectronics and a more recently introduced roadmap for organic and printed electronics applications. The topics for each category were down-selected by reviewing the 2012 reports of the International Technology Roadmap for Semiconductor (ITRS), the 2013 roadmap reports of the International Electronics Manufacturing Initiative (iNEMI), the 2013 roadmap of association connecting electronics industry (IPC), the Organic Printed Electronics Association (OE-A). The report also summarizes the results of numerous articles and websites specifically discussing the trends in microelectronics packaging technologies.

Electromechanical actuation for cryogenic valve control

NASA Technical Reports Server (NTRS)

Lister, M. J.; Reichmuth, D. M.

1993-01-01

The design and analysis of the electromechanical actuator (EMA) being developed for the NASA/Marshall Space Flight Center as part of the National Launch System (NLS) Propellant Control Effector Advanced Development Program (ADP) are addressed. The EMA design uses several proven technologies combined into a single modular package which includes single stage high ratio gear reduction, redundant electric motors mounted on a common drive shaft, redundant drive and control electronics, and digital technology for performing the closed loop position feedback, communication, and health monitoring functions. Results of tests aimed at evaluating both component characteristics and overall system performance demonstrated that the goal of low cost, reliable control in a cryogenic environment is feasible.

Liquid air cycle engines

NASA Technical Reports Server (NTRS)

Rosevear, Jerry

1992-01-01

Given here is a definition of Liquid Air Cycle Engines (LACE) and existing relevant technologies. Heat exchanger design and fabrication techniques, the handling of liquid hydrogen to achieve the greatest heat sink capabilities, and air decontamination to prevent heat exchanger fouling are discussed. It was concluded that technology needs to be extended in the areas of design and fabrication of heat exchangers to improve reliability along with weight and volume reductions. Catalysts need to be improved so that conversion can be achieved with lower quantities and lower volumes. Packaging studies need to be investigated both analytically and experimentally. Recycling with slush hydrogen needs further evaluation with experimental testing.

Design and construction of a VHGT-attached WDM-type triplex transceiver module using polymer PLC hybrid integration technology

NASA Astrophysics Data System (ADS)

Jerábek, Vitezslav; Hüttel, Ivan; Prajzler, Václav; Busek, K.; Seliger, P.

2008-11-01

We report about design and construction of the bidirectional transceiver TRx module for subscriber part of the passive optical network PON for a fiber to the home FTTH topology. The TRx module consists of a epoxy novolak resin polymer planar lightwave circuit (PLC) hybrid integration technology with volume holographic grating triplex filter VHGT, surface-illuminated photodetectors and spot-size converted Fabry-Pérot laser diode in SMD package. The hybrid PLC has composed from a two parts-polymer optical waveguide including VHGT filter section and a optoelectronic microwave section. The both parts are placed on the composite substrate.

Re-design of apple pia packaging using quality function deployment method

NASA Astrophysics Data System (ADS)

Pulungan, M. H.; Nadira, N.; Dewi, I. A.

2018-03-01

This study was aimed to identify the attributes for premium apple pia packaging, to determine the technical response to be carried out by Permata Agro Mandiri Small and Medium Enterprise (SME) and to design a new apple pie packaging acceptable by the SME. The Quality Function Deployment (QFD) method was employed to improve the apple pia packaging design, which consisted of seven stages in data analysis. The results indicated that whats attribute required by the costumers include graphic design, dimensions, capacity, shape, strength, and resistance of packaging. While, the technical responses to be conducted by the SMEs were as follows: attractive visual packaging designs, attractive colors, clear images and information, packaging size dimensions, a larger capacity packaging (more product content), ergonomic premium packaging, not easily torn, and impact resistant packaging materials. The findings further confirmed that the design of premium apple pia packaging accepted by the SMES was the one with the capacity of ten apple pia or 200 g weight, and with rectangular or beam shape form. The packaging material used was a duplex carton with 400 grammage (g/m2), the outer part of the packaging was coated with plastic and the inside was added with duplex carton. The acceptable packaging dimension was 30 cm x 5 cm x 3 cm (L x W x H) with a mix of black and yellow color in the graphical design.

Packaging of silicon photonic devices: from prototypes to production

NASA Astrophysics Data System (ADS)

Morrissey, Padraic E.; Gradkowski, Kamil; Carroll, Lee; O'Brien, Peter

2018-02-01

The challenges associated with the photonic packaging of silicon devices is often underestimated and remains technically challenging. In this paper, we review some key enabling technologies that will allow us to overcome the current bottleneck in silicon photonic packaging; while also describing the recent developments in standardisation, including the establishment of PIXAPP as the worlds first open-access PIC packaging and assembly Pilot Line. These developments will allow the community to move from low volume prototype photonic packaged devices to large scale volume manufacturing, where the full commercialisation of PIC technology can be realised.

The FLECS expandable module concept for future space missions and an overall description on the material validation

NASA Astrophysics Data System (ADS)

Mileti, Sandro; Guarrera, Giuseppe; Marchetti, Mario; Ferrari, Giorgio; Nebiolo, Marco; Augello, Gerlando; Bitetti, Grazia; Carnà, Emiliano; Marranzini, Andrea; Mazza, Fabio

2006-07-01

The future space exploration missions aim to reduce the costs associated with design, fabrication and launch for ISS, Moon and Mars modules, while simultaneously increasing the useful volume. Flexible and inflatable structures offer many advantages over conventional structures for space applications. Principal among the advantages is the ability to package these structures into small volumes for launch. Design maturation and the development of advanced materials and fabrication processes have made the concept of an inflatable module achievable in the near future. The Multipurpose Expandable Module (FLECS) Project sponsored by ASI (Italian Space Agency) whose prime contractor is Alcatel Alenia Space Italia, links the conventional and traditional technology of modules with the innovative solutions of inflatable technology. This project emphasizes on demonstrating the capability in using inflatable technology on space structures aiming to substitute the conventional modules in future manned missions. FLECS has been designed using advanced textiles and films in order to guarantee the structural reliability necessary for the deployment and packaging configurations. A non-linear structural analysis has been conducted using several numerical codes that simulate the deployed structural characteristics achieving also the damping resistance during the packaging. All the materials used for the flexible parts have been selected through a series of mechanical tests in order to validate the more appropriate ones for the mission. The multi-layer pneumatic retention bladder and the intermediate restraint layer are composed of polymer sheets, ortho-fabrics and elastomers like polyurethanes. The External protection shield is configured using several layers of impact absorption materials and also several layers of space environment (UV, IR, atomic oxygen) protection materials such as Kapton, Mylar and Nextel. The validation of the fabrics, the films and the final prototype assembly are tested in the Space Environment Simulator (SAS), located in the SASLab laboratory of the Aerospace Engineering Department of the “La Sapienza” University of Rome.

Impact of external influences on food packaging.

PubMed

Brody, A L

1977-09-01

Since the food supply is dependent upon an effective packaging system, threats to packaging represent implied threats to food processing and distribution. Enacted and potential legislation and regulation are retarding technological and commercial progress in food packaging and have already restricted some food packaging/processins systems. The results of these external influences is not simply the sum of the individual acts, but is a cascading self-imposed arresting of food packaging/processing advancement. The technological bases for the enacted and proposed legislation and regulation are presented in the enumeration of the external influences on food packaging. Economic and sociological arguments and facts surrounding the issues are also presented. Among the external influences on food packaging detailed are indirect additives, nutritional labeling, benefit:risk, solid waste and litter, environmental pollution, universal product code, and food industry productivity. The magnitude of the total impact of these external influences upon the food supply is so large that assertive action must be taken to channel these influences into more productive awareness. An objective and comprehensive public communications program supported by the technological community appears mandatory.

Use of optical technique for inspection of warpage of IC packages

NASA Astrophysics Data System (ADS)

Toh, Siew-Lok; Chau, Fook S.; Ong, Sim Heng

2001-06-01

The packaging of IC packages has changed over the years, form dual-in-line, wire-bond, and pin-through-hole in printed wiring board technologies in the 1970s to ball grid array, chip scale and surface mount technologies in the 1990s. Reliability has been a big problem for manufacturers for some moisture-sensitive packages. One of the potential problems in plastic IC packages is moisture-induced popcorn effect which can arise during the reflow process. Shearography is a non-destructive inspection technique that may be used to detect the delamination and warpage of IC packages. It is non-contacting and permits a full-field observation of surface displacement derivatives. Another advantage of this technique is that it is able to give the real-time formation of the fringes which indicate flaws in the IC package under real-time simulation condition of Surface Mount Technology (SMT) IR reflow profile. It is extremely fast and convenient to study the true behavior of the packaging deformation during the SMT process. It can be concluded that shearography has the potential for the real- time detection, in situ and non-destructive inspection of IC packages during the surface mount process.

Quality and safety aspects of meat products as affected by various physical manipulations of packaging materials.

PubMed

Lee, Keun Taik

2010-09-01

This article explores the effects of physically manipulated packaging materials on the quality and safety of meat products. Recently, innovative measures for improving quality and extending the shelf-life of packaged meat products have been developed, utilizing technologies including barrier film, active packaging, nanotechnology, microperforation, irradiation, plasma and far-infrared ray (FIR) treatments. Despite these developments, each technology has peculiar drawbacks which will need to be addressed by meat scientists in the future. To develop successful meat packaging systems, key product characteristics affecting stability, environmental conditions during storage until consumption, and consumers' packaging expectations must all be taken into consideration. Furthermore, the safety issues related to packaging materials must also be taken into account when processing, packaging and storing meat products.

"Cloud" functions and templates of engineering calculations for nuclear power plants

NASA Astrophysics Data System (ADS)

Ochkov, V. F.; Orlov, K. A.; Ko, Chzho Ko

2014-10-01

The article deals with an important problem of setting up computer-aided design calculations of various circuit configurations and power equipment carried out using the templates and standard computer programs available in the Internet. Information about the developed Internet-based technology for carrying out such calculations using the templates accessible in the Mathcad Prime software package is given. The technology is considered taking as an example the solution of two problems relating to the field of nuclear power engineering.

Miniature stick-packaging--an industrial technology for pre-storage and release of reagents in lab-on-a-chip systems.

PubMed

van Oordt, Thomas; Barb, Yannick; Smetana, Jan; Zengerle, Roland; von Stetten, Felix

2013-08-07

Stick-packaging of goods in tubular-shaped composite-foil pouches has become a popular technology for food and drug packaging. We miniaturized stick-packaging for use in lab-on-a-chip (LOAC) systems to pre-store and on-demand release the liquid and dry reagents in a volume range of 80-500 μl. An integrated frangible seal enables the pressure-controlled release of reagents and simplifies the layout of LOAC systems, thereby making the package a functional microfluidic release unit. The frangible seal is adjusted to defined burst pressures ranging from 20 to 140 kPa. The applied ultrasonic welding process allows the packaging of temperature sensitive reagents. Stick-packs have been successfully tested applying recovery tests (where 99% (STDV = 1%) of 250 μl pre-stored liquid is released), long-term storage tests (where there is loss of only <0.5% for simulated 2 years) and air transport simulation tests. The developed technology enables the storage of a combination of liquid and dry reagents. It is a scalable technology suitable for rapid prototyping and low-cost mass production.

Ultra-Reliable Digital Avionics (URDA) processor

NASA Astrophysics Data System (ADS)

Branstetter, Reagan; Ruszczyk, William; Miville, Frank

1994-10-01

Texas Instruments Incorporated (TI) developed the URDA processor design under contract with the U.S. Air Force Wright Laboratory and the U.S. Army Night Vision and Electro-Sensors Directorate. TI's approach couples advanced packaging solutions with advanced integrated circuit (IC) technology to provide a high-performance (200 MIPS/800 MFLOPS) modular avionics processor module for a wide range of avionics applications. TI's processor design integrates two Ada-programmable, URDA basic processor modules (BPM's) with a JIAWG-compatible PiBus and TMBus on a single F-22 common integrated processor-compatible form-factor SEM-E avionics card. A separate, high-speed (25-MWord/second 32-bit word) input/output bus is provided for sensor data. Each BPM provides a peak throughput of 100 MIPS scalar concurrent with 400-MFLOPS vector processing in a removable multichip module (MCM) mounted to a liquid-flowthrough (LFT) core and interfacing to a processor interface module printed wiring board (PWB). Commercial RISC technology coupled with TI's advanced bipolar complementary metal oxide semiconductor (BiCMOS) application specific integrated circuit (ASIC) and silicon-on-silicon packaging technologies are used to achieve the high performance in a miniaturized package. A Mips R4000-family reduced instruction set computer (RISC) processor and a TI 100-MHz BiCMOS vector coprocessor (VCP) ASIC provide, respectively, the 100 MIPS of a scalar processor throughput and 400 MFLOPS of vector processing throughput for each BPM. The TI Aladdim ASIC chipset was developed on the TI Aladdin Program under contract with the U.S. Army Communications and Electronics Command and was sponsored by the Advanced Research Projects Agency with technical direction from the U.S. Army Night Vision and Electro-Sensors Directorate.

Thick resist for MEMS processing

NASA Astrophysics Data System (ADS)

Brown, Joe; Hamel, Clifford

2001-11-01

The need for technical innovation is always present in today's economy. Microfabrication methods have evolved in support of the demand for smaller and faster integrated circuits with price performance improvements always in the scope of the manufacturing design engineer. The dispersion of processing technology spans well beyond IC fabrication today with batch fabrication and wafer scale processing lending advantages to MEMES applications from biotechnology to consumer electronics from oil exploration to aerospace. Today the demand for innovative processing techniques that enable technology is apparent where only a few years ago appeared too costly or not reliable. In high volume applications where yield and cost improvements are measured in fractions of a percent it is imperative to have process technologies that produce consistent results. Only a few years ago thick resist coatings were limited to thickness less than 20 microns. Factors such as uniformity, edge bead and multiple coatings made high volume production impossible. New developments in photoresist formulation combined with advanced coating equipment techniques that closely controls process parameters have enable thick photoresist coatings of 70 microns with acceptable uniformity and edge bead in one pass. Packaging of microelectronic and micromechanical devices is often a significant cost factor and a reliability issue for high volume low cost production. Technologies such as flip- chip assembly provide a solution for cost and reliability improvements over wire bond techniques. The processing for such technology demands dimensional control and presents a significant cost savings if it were compatible with mainstream technologies. Thick photoresist layers, with good sidewall control would allow wafer-bumping technologies to penetrate the barriers to yield and production where costs for technology are the overriding issue. Single pass processing is paramount to the manufacturability of packaging technology. Uniformity and edge bead control defined the success of process implementation. Today advanced packaging solutions are created with thick photoresist coatings. The techniques and results will be presented.

IFT Scientific Status Summary 2008: Innovative Food Packaging Solutions

USDA-ARS?s Scientific Manuscript database

Food and beverage packaging comprises 55-65% of the $110 billion value of packaging in the United States. This review provides a summary of innovative technology developments in food packaging. The expanded role of food and beverage packaging is reviewed. Active and intelligent food packaging, ba...

Nano-engineered Multiwall Carbon Nanotube-copper Composite Thermal Interface Material for Efficient Heat Conduction

NASA Technical Reports Server (NTRS)

Ngo, Quoc; Cruden, Brett A.; Cassell, Alan M.; Sims, Gerard; Li, Jun; Meyyappa, M.; Yang, Cary Y.

2005-01-01

Efforts in integrated circuit (IC) packaging technologies have recently been focused on management of increasing heat density associated with high frequency and high density circuit designs. While current flip-chip package designs can accommodate relatively high amounts of heat density, new materials need to be developed to manage thermal effects of next-generation integrated circuits. Multiwall carbon nanotubes (MWNT) have been shown to significantly enhance thermal conduction in the axial direction and thus can be considered to be a candidate for future thermal interface materials by facilitating efficient thermal transport. This work focuses on fabrication and characterization of a robust MWNT-copper composite material as an element in IC package designs. We show that using vertically aligned MWNT arrays reduces interfacial thermal resistance by increasing conduction surface area, and furthermore, the embedded copper acts as a lateral heat spreader to efficiently disperse heat, a necessary function for packaging materials. In addition, we demonstrate reusability of the material, and the absence of residue on the contacting material, both novel features of the MWNT-copper composite that are not found in most state-of-the-art thermal interface materials. Electrochemical methods such as metal deposition and etch are discussed for the creation of the MWNT-Cu composite, detailing issues and observations with using such methods. We show that precise engineering of the composite surface affects the ability of this material to act as an efficient thermal interface material. A thermal contact resistance measurement has been designed to obtain a value of thermal contact resistance for a variety of different thermal contact materials.

DOE-EM-45 PACKAGING OPERATIONS AND MAINTENANCE COURSE

DOE Office of Scientific and Technical Information (OSTI.GOV)

Watkins, R.; England, J.

2010-05-28

Savannah River National Laboratory - Savannah River Packaging Technology (SRNL-SRPT) delivered the inaugural offering of the Packaging Operations and Maintenance Course for DOE-EM-45's Packaging Certification Program (PCP) at the University of South Carolina Aiken on September 1 and 2, 2009. Twenty-nine students registered, attended, and completed this training. The DOE-EM-45 Packaging Certification Program (PCP) sponsored the presentation of a new training course, Packaging Maintenance and Operations, on September 1-2, 2009 at the University of South Carolina Aiken (USC-Aiken) campus in Aiken, SC. The premier offering of the course was developed and presented by the Savannah River National Laboratory, and attendedmore » by twenty-nine students across the DOE, NNSA and private industry. This training informed package users of the requirements associated with handling shipping containers at a facility (user) level and provided a basic overview of the requirements typically outlined in Safety Analysis Report for Packaging (SARP) Chapters 1, 7, and 8. The course taught packaging personnel about the regulatory nature of SARPs to help reduce associated and often costly packaging errors. Some of the topics covered were package contents, loading, unloading, storage, torque requirements, maintaining records, how to handle abnormal conditions, lessons learned, leakage testing (including demonstration), and replacement parts. The target audience for this course was facility operations personnel, facility maintenance personnel, and field quality assurance personnel who are directly involved in the handling of shipping containers. The training also aimed at writers of SARP Chapters 1, 7, and 8, package designers, and anyone else involved in radioactive material packaging and transportation safety. Student feedback and critiques of the training were very positive. SRNL will offer the course again at USC Aiken in September 2010.« less

JTEC Panel report on electronic manufacturing and packaging in Japan

NASA Technical Reports Server (NTRS)

Kelly, Michael J.; Boulton, William R. (Editor); Kukowski, John; Meieran, Gene; Pecht, Michael; Peeples, John; Tummala, Rao; Dehaemer, Michael J.; Holdridge, Geoff (Editor); Gamota, George

1995-01-01

This report summarizes the status of electronic manufacturing and packaging technology in Japan in comparison to that in the United States, and its impact on competition in electronic manufacturing in general. In addition to electronic manufacturing technologies, the report covers technology and manufacturing infrastructure, electronics manufacturing and assembly, quality assurance and reliability in the Japanese electronics industry, and successful product realization strategies. The panel found that Japan leads the United States in almost every electronics packaging technology. Japan clearly has achieved a strategic advantage in electronics production and process technologies. Panel members believe that Japanese competitors could be leading U.S. firms by as much as a decade in some electronics process technologies.

Space Station Freedom power supply commonality via modular design

NASA Technical Reports Server (NTRS)

Krauthamer, S.; Gangal, M. D.; Das, R.

1990-01-01

At mature operations, Space Station Freedom will need more than 2000 power supplies to feed housekeeping and user loads. Advanced technology power supplies from 20 to 250 W have been hybridized for terrestrial, aerospace, and industry applications in compact, efficient, reliable, lightweight packages compatible with electromagnetic interference requirements. The use of these hybridized packages as modules, either singly or in parallel, to satisfy the wide range of user power supply needs for all elements of the station is proposed. Proposed characteristics for the power supplies include common mechanical packaging, digital control, self-protection, high efficiency at full and partial loads, synchronization capability to reduce electromagnetic interference, redundancy, and soft-start capability. The inherent reliability is improved compared with conventional discrete component power supplies because the hybrid circuits use high-reliability components such as ceramic capacitors. Reliability is further improved over conventional supplies because the hybrid packages, which may be treated as a single part, reduce the parts count in the power supply.

Performance assessment of small-package-class nonintrusive inspection systems

NASA Astrophysics Data System (ADS)

Spradling, Michael L.; Hyatt, Roger

1997-02-01

The DoD Counterdrug Technology Development Program has addressed the development and demonstration of technology to enhance nonintrusive inspection of small packages such as passenger baggage, commercially delivered parcels, and breakbulk cargo items. Within the past year they have supported several small package-class nonintrusive inspection system performance assessment activities. All performance assessment programs involved the use of a red/blue team concept and were conducted in accordance with approved assessment protocols. This paper presents a discussion related to the systematic performance assessment of small package-class nonintrusive inspection technologies, including transmission, backscatter and computed tomography x-ray imaging, and protocol-related considerations for the assessment of these systems.

Lightweight IMM PV Flexible Blanket Assembly

NASA Technical Reports Server (NTRS)

Spence, Brian

2015-01-01

Deployable Space Systems (DSS) has developed an inverted metamorphic multijunction (IMM) photovoltaic (PV) integrated modular blanket assembly (IMBA) that can be rolled or z-folded. This IMM PV IMBA technology enables a revolutionary flexible PV blanket assembly that provides high specific power, exceptional stowed packaging efficiency, and high-voltage operation capability. DSS's technology also accommodates standard third-generation triple junction (ZTJ) PV device technologies to provide significantly improved performance over the current state of the art. This SBIR project demonstrated prototype, flight-like IMM PV IMBA panel assemblies specifically developed, designed, and optimized for NASA's high-voltage solar array missions.

Design and development of the mobile game based on the J2ME technology

NASA Astrophysics Data System (ADS)

He, Junhua

2011-12-01

With the continuous improvement of mobile performance, mobile entertainment applications market trend has been increasingly clear, mobile entertainment applications will be after the PC entertainment applications is another important business growth. Through the full analysis of the current mobile entertainment applications market demand and trends, the author has accumulated a lot of theoretical knowledge and practical experience. Rational, using of some new technology for a mobile entertainment games design, and described the development of key technologies required for mobile game an analysis and design of the game, and to achieve a complete game development. Light of the specific mobile game project - "Battle City", detailed the development of a mobile game based on the J2ME platform, the basic steps and the various key elements, focusing on how to use object-oriented thinking on the role of mobile phones in the abstract and Game Animation package, the source code with specific instructions.

Design and development of the mobile game based on the J2ME technology

NASA Astrophysics Data System (ADS)

He, JunHua

2012-01-01

With the continuous improvement of mobile performance, mobile entertainment applications market trend has been increasingly clear, mobile entertainment applications will be after the PC entertainment applications is another important business growth. Through the full analysis of the current mobile entertainment applications market demand and trends, the author has accumulated a lot of theoretical knowledge and practical experience. Rational, using of some new technology for a mobile entertainment games design, and described the development of key technologies required for mobile game an analysis and design of the game, and to achieve a complete game development. Light of the specific mobile game project - "Battle City", detailed the development of a mobile game based on the J2ME platform, the basic steps and the various key elements, focusing on how to use object-oriented thinking on the role of mobile phones in the abstract and Game Animation package, the source code with specific instructions.

Aerocapture Systems Analysis for a Neptune Mission

NASA Technical Reports Server (NTRS)

Lockwood, Mary Kae; Edquist, Karl T.; Starr, Brett R.; Hollis, Brian R.; Hrinda, Glenn A.; Bailey, Robert W.; Hall, Jeffery L.; Spilker, Thomas R.; Noca, Muriel A.; O'Kongo, N.

2006-01-01

A Systems Analysis was completed to determine the feasibility, benefit and risk of an aeroshell aerocapture system for Neptune and to identify technology gaps and technology performance goals. The systems analysis includes the following disciplines: science; mission design; aeroshell configuration; interplanetary navigation analyses; atmosphere modeling; computational fluid dynamics for aerodynamic performance and aeroheating environment; stability analyses; guidance development; atmospheric flight simulation; thermal protection system design; mass properties; structures; spacecraft design and packaging; and mass sensitivities. Results show that aerocapture is feasible and performance is adequate for the Neptune mission. Aerocapture can deliver 1.4 times more mass to Neptune orbit than an all-propulsive system for the same launch vehicle and results in a 3-4 year reduction in trip time compared to all-propulsive systems. Enabling technologies for this mission include TPS manufacturing; and aerothermodynamic methods for determining coupled 3-D convection, radiation and ablation aeroheating rates and loads.

MO-H-19A-03: Patient Specific Bolus with 3D Printing Technology for Electron Radiotherapy

DOE Office of Scientific and Technical Information (OSTI.GOV)

Zou, W; Swann, B; Siderits, R

2014-06-15

Purpose: Bolus is widely used in electron radiotherapy to achieve desired dose distribution. 3D printing technologies provide clinicians with easy access to fabricate patient specific bolus accommodating patient body surface irregularities and tissue inhomogeneity. This study presents the design and the clinical workflow of 3D printed bolus for patient electron therapy in our clinic. Methods: Patient simulation CT images free of bolus were exported from treatment planning system (TPS) to an in-house developed software package. Bolus with known material properties was designed in the software package and then exported back to the TPS as a structure. Dose calculation was carriedmore » out to examine the coverage of the target. After satisfying dose distribution was achieved, the bolus structure was transferred in Standard Tessellation Language (STL) file format for the 3D printer to generate the machine codes for printing. Upon receiving printed bolus, a quick quality assurance was performed with patient resimulated with bolus in place to verify the bolus dosimetric property before treatment started. Results: A patient specific bolus for electron radiotherapy was designed and fabricated in Form 1 3D printer with methacrylate photopolymer resin. Satisfying dose distribution was achieved in patient with bolus setup. Treatment was successfully finished for one patient with the 3D printed bolus. Conclusion: The electron bolus fabrication with 3D printing technology was successfully implemented in clinic practice.« less

Implications of intelligent, integrated microsystems for product design and development

DOE Office of Scientific and Technical Information (OSTI.GOV)

MYERS,DAVID R.; MCWHORTER,PAUL J.

2000-04-19

Intelligent, integrated microsystems combine some or all of the functions of sensing, processing information, actuation, and communication within a single integrated package, and preferably upon a single silicon chip. As the elements of these highly integrated solutions interact strongly with each other, the microsystem can be neither designed nor fabricated piecemeal, in contrast to the more familiar assembled products. Driven by technological imperatives, microsystems will best be developed by multi-disciplinary teams, most likely within the flatter, less hierarchical organizations. Standardization of design and process tools around a single, dominant technology will expedite economically viable operation under a common production infrastructure.more » The production base for intelligent, integrated microsystems has elements in common with the mathematical theory of chaos. Similar to chaos theory, the development of microsystems technology will be strongly dependent on, and optimized to, the initial product requirements that will drive standardization--thereby further rewarding early entrants to integrated microsystem technology.« less

NASA Technology Utilization House technical support package Summary of results and house description

NASA Technical Reports Server (NTRS)

1979-01-01

The Technology Utilization House (Tech House) was designed and constructed to demonstrate to the building industry and the public the benefits of aerospace technology and other new technology that are presently available or will be in very near future. Use of solar energy, conservation of energy and of water, safety, and security were incorporated in the design of the house. The terms to be incorporated into the house and to assist in the design of the house were evaluated. An architectural engineering team was employed to investigate energy conservation ideas, determine cost effectiveness of new materials and systems, and prepare specifications and drawings for the house. The Tech House was constructed during the spring of 1976. All the systems were monitored to insure proper operation, and data were collected during a one year occupancy. Results obtained during the family live-in period, comments on the acceptance of the various energy-saving systems by the family, and suggestions for improvement of the systems are presented.

Evaluation of a telehealth training package to remotely train staff to conduct a preference assessment.

PubMed

Higgins, William J; Luczynski, Kevin C; Carroll, Regina A; Fisher, Wayne W; Mudford, Oliver C

2017-04-01

Recent advancements in telecommunication technologies make it possible to conduct a variety of healthcare services remotely (e.g., behavioral-analytic intervention services), thereby bridging the gap between qualified providers and consumers in isolated locations. In this study, web-based telehealth technologies were used to remotely train direct-care staff to conduct a multiple-stimulus-without-replacement preference assessment. The training package included three components: (a) a multimedia presentation; (b) descriptive feedback from previously recorded baseline sessions; and (c) scripted role-play with immediate feedback. A nonconcurrent, multiple-baseline-across-participants design was used to demonstrate experimental control. Training resulted in robust and immediate improvements, and these effects maintained during 1- to 2-month follow-up observations. In addition, participants expressed high satisfaction with the web-based materials and the overall remote-training experience. © 2017 Society for the Experimental Analysis of Behavior.

How to successfully implement extended producer responsibility: considerations from an economic point of view.

PubMed

Wiesmeth, Hans; Häckl, Dennis

2011-09-01

This paper investigates the concept of extended producer responsibility (EPR) from an economic point of view. Particular importance will be placed on the concept of 'economic feasibility' of an EPR policy, which should guide decision-making in this context. Moreover, the importance of the core EPR principle of 'integrating signals throughout the product chain' into the incentive structure will be demonstrated with experiences from Germany. These examples refer to sales packaging consumption, refillable drinks packages and waste electrical and electronic equipment collection. As a general conclusion, the interaction between economic principles and technological development needs to be observed carefully when designing incentive-compatible EPR policies.

Programmatic Research to Design and Develop Improved Instructional Technology for Handicapped Children. Final Report.

ERIC Educational Resources Information Center

Schiefelbusch, Richard L.; Lent, James R.

Presented is the final report for Project MORE (Mediated Operational Research for Education), a program to create a full-scale operational system for developing product prototypes (methods and materials packages) for teaching personal appearance and hygiene skills to the trainable mentally retarded child. Reviewed in part I is the history of the…

ENVIRONMENTAL TECHNOLOGY VERIFICATION REPORT: EVALUATION OF THE XP-SWMM STORMWATER WASTEWATER MANAGEMENT MODEL, VERSION 8.2, 2000, FROM XP SOFTWARE, INC.

EPA Science Inventory

XP-SWMM is a commercial software package used throughout the United States and around the world for simulation of storm, sanitary and combined sewer systems. It was designed based on the EPA Storm Water Management Model (EPA SWMM), but has enhancements and additional algorithms f...

Economic Evaluation of New Technologies in Higher Education. N.I.E. Report Phase 1, Volumes 2 and 3 of 7.

ERIC Educational Resources Information Center

Heriot-Watt Univ., Edinburgh (Scotland). Esmee Fairbairn Economics Research Centre.

Designed as an accompaniment to college level microeconomics lectures, (see SO 011 936), the package contains materials for four approaches to the microeconomics course. The course covers topics of economic concepts, issues, and tools; demand; supply; price and output determination in markets; marginal equivalency conditions and economic…

Economic Evaluation of New Technologies in Higher Education. N.I.E. Report Phase 1, Volumes 4 and 5 of 7.

ERIC Educational Resources Information Center

Heriot-Watt Univ., Edinburgh (Scotland). Esmee Fairbairn Economics Research Centre.

Designed as an accompaniment to college level macroeconomic lectures (see SO 011 937), this package contains materials for three approaches to the macroeconomics course. The course covers topics of basic macroeconomic concepts, income and expenditure determination, aggregate demand, unemployment and inflation, policy making, investment and…

A Methodological Approach to Encourage the Service-Oriented Learning Systems Development

ERIC Educational Resources Information Center

Diez, David; Malizia, Alessio; Aedo, Ignacio; Diaz, Paloma; Fernandez, Camino; Dodero, Juan-Manuel

2009-01-01

The basic idea of service-oriented learning is that a learning environment should be conceived as a set of independent units of learning packaged as learning services. The design, development and deployment of a learning system based on integrating different learning services needs both a technological platform to support the system as well as a…

Echidna Mark II: one giant leap for 'tilting spine' fibre positioning technology

NASA Astrophysics Data System (ADS)

Gilbert, James; Dalton, Gavin

2016-07-01

The Australian Astronomical Observatory's 'tilting spine' fibre positioning technology has been redeveloped to provide superior performance in a smaller package. The new design offers demonstrated closed-loop positioning errors of <2.8 μm RMS in only five moves ( 10 s excluding metrology overheads) and an improved capacity for open-loop tracking during observations. Tilt-induced throughput losses have been halved by lengthening spines while maintaining excellent accuracy. New low-voltage multilayer piezo actuator technology has reduced a spine's peak drive amplitude from 150V to <10V, simplifying the control electronics design, reducing the system's overall size, and improving modularity. Every spine is now a truly independent unit with a dedicated drive circuit and no restrictions on the timing or direction of fibre motion.

The empowerment of sustainable design in food packaging as designer responsibilities

NASA Astrophysics Data System (ADS)

Setiadi, V.

2018-01-01

The purpose of this paper is emphasized on the empowerment of sustainable design in providing the dual function of a food packaging. Which can extend the life of paper, cardboard, plastic, aluminum foil so as to reduce the contribution of waste on earth. The methodology used in this research is using qualitative research. With the main approach taken on the layout of the packaging design, the approach that relies heavily on the data in the form of packaging design. For the process of observation, the authors should compare with the forms of food packaging designs that are contained in the diversity of food packaging types from products outside Indonesia. The purpose of this study is also intended as a recommendation through observation of data interviews and survey related products. Conclusion through material exploration, packaging structure exploration, efficient exploration of ink usage and packaging usage patterns.

10 CFR 60.135 - Criteria for the waste package and its components.

Code of Federal Regulations, 2011 CFR

2011-01-01

... IN GEOLOGIC REPOSITORIES Technical Criteria Design Criteria for the Waste Package § 60.135 Criteria for the waste package and its components. (a) High-level-waste package design in general. (1) Packages for HLW shall be designed so that the in situ chemical, physical, and nuclear properties of the waste...

10 CFR 60.135 - Criteria for the waste package and its components.

Code of Federal Regulations, 2013 CFR

2013-01-01

... IN GEOLOGIC REPOSITORIES Technical Criteria Design Criteria for the Waste Package § 60.135 Criteria for the waste package and its components. (a) High-level-waste package design in general. (1) Packages for HLW shall be designed so that the in situ chemical, physical, and nuclear properties of the waste...

10 CFR 60.135 - Criteria for the waste package and its components.

Code of Federal Regulations, 2014 CFR

2014-01-01

... IN GEOLOGIC REPOSITORIES Technical Criteria Design Criteria for the Waste Package § 60.135 Criteria for the waste package and its components. (a) High-level-waste package design in general. (1) Packages for HLW shall be designed so that the in situ chemical, physical, and nuclear properties of the waste...

10 CFR 60.135 - Criteria for the waste package and its components.

Code of Federal Regulations, 2012 CFR

2012-01-01

... IN GEOLOGIC REPOSITORIES Technical Criteria Design Criteria for the Waste Package § 60.135 Criteria for the waste package and its components. (a) High-level-waste package design in general. (1) Packages for HLW shall be designed so that the in situ chemical, physical, and nuclear properties of the waste...

Technology Assessment Software Package: Final Report.

ERIC Educational Resources Information Center

Hutinger, Patricia L.

This final report describes the Technology Assessment Software Package (TASP) Project, which produced developmentally appropriate technology assessment software for children from 18 months through 8 years of age who have moderate to severe disabilities that interfere with their interaction with people, objects, tasks, and events in their…

Technological challenges of addressing new and more complex migrating products from novel food packaging materials.

PubMed

Munro, Ian C; Haighton, Lois A; Lynch, Barry S; Tafazoli, Shahrzad

2009-12-01

The risk assessment of migration products resulting from packaging material has and continues to pose a difficult challenge. In most jurisdictions, there are regulatory requirements for the approval or notification of food contact substances that will be used in packaging. These processes generally require risk assessment to ensure safety concerns are addressed. The science of assessing food contact materials was instrumental in the development of the concept of Threshold of Regulation and the Threshold of Toxicological Concern procedures. While the risk assessment process is in place, the technology of food packaging continues to evolve to include new initiatives, such as the inclusion of antimicrobial substances or enzyme systems to prevent spoilage, use of plastic packaging intended to remain on foods as they are being cooked, to the introduction of more rigid, stable and reusable materials, and active packaging to extend the shelf-life of food. Each new technology brings with it the potential for exposure to new and possibly novel substances as a result of migration, interaction with other chemical packaging components, or, in the case of plastics now used in direct cooking of products, degradation products formed during heating. Furthermore, the presence of trace levels of certain chemicals from packaging that were once accepted as being of low risk based on traditional toxicology studies are being challenged on the basis of reports of adverse effects, particularly with respect to endocrine disruption, alleged to occur at very low doses. A recent example is the case of bisphenol A. The way forward to assess new packaging technologies and reports of very low dose effects in non-standard studies of food contact substances is likely to remain controversial. However, the risk assessment paradigm is sufficiently robust and flexible to be adapted to meet these challenges. The use of the Threshold of Regulation and the Threshold of Toxicological Concern concepts may play a critical role in the risk assessment of new food packaging technologies in the future.

Cigarette package design: opportunities for disease prevention.

PubMed

Difranza, J R; Clark, D M; Pollay, R W

2002-06-15

To learn how cigarette packages are designed and to determine to what extent cigarette packages are designed to target children. A computer search was made of all Internet websites that post tobacco industry documents using the search terms: packaging, package design, package study, box design, logo, trademark and design study. All documents were retrieved electronically and analyzed by the first author for recurrent themes. Cigarette manufacturers devote a great deal of attention and expense to package design because it is central to their efforts to create brand images. Colors, graphic elements, proportioning, texture, materials and typography are tested and used in various combinations to create the desired product and user images. Designs help to create the perceived product attributes and project a personality image of the user with the intent of fulfilling the psychological needs of the targeted type of smoker. The communication of these images and attributes is conducted through conscious and subliminal processes. Extensive testing is conducted using a variety of qualitative and quantitative research techniques. The promotion of tobacco products through appealing imagery cannot be stopped without regulating the package design. The same marketing research techniques used by the tobacco companies can be used to design generic packaging and more effective warning labels targeted at specific consumers.

Cigarette package design: opportunities for disease prevention

PubMed Central

DiFranza, JR; Clark, DM; Pollay, RW

2003-01-01

Objective To learn how cigarette packages are designed and to determine to what extent cigarette packages are designed to target children. Methods A computer search was made of all Internet websites that post tobacco industry documents using the search terms: packaging, package design, package study, box design, logo, trademark and design study. All documents were retrieved electronically and analyzed by the first author for recurrent themes. Data Synthesis Cigarette manufacturers devote a great deal of attention and expense to package design because it is central to their efforts to create brand images. Colors, graphic elements, proportioning, texture, materials and typography are tested and used in various combinations to create the desired product and user images. Designs help to create the perceived product attributes and project a personality image of the user with the intent of fulfilling the psychological needs of the targeted type of smoker. The communication of these images and attributes is conducted through conscious and subliminal processes. Extensive testing is conducted using a variety of qualitative and quantitative research techniques. Conclusion The promotion of tobacco products through appealing imagery cannot be stopped without regulating the package design. The same marketing research techniques used by the tobacco companies can be used to design generic packaging and more effective warning labels targeted at specific consumers. PMID:19570250

Cigarette package design: opportunities for disease prevention

PubMed Central

DiFranza, JR; Clark, DM; Pollay, RW

2003-01-01

Objective To learn how cigarette packages are designed and to determine to what extent cigarette packages are designed to target children. Methods A computer search was made of all Internet websites that post tobacco industry documents using the search terms: packaging, package design, package study, box design, logo, trademark and design study. All documents were retrieved electronically and analyzed by the first author for recurrent themes. Data Synthesis Cigarette manufacturers devote a great deal of attention and expense to package design because it is central to their efforts to create brand images. Colors, graphic elements, proportioning, texture, materials and typography are tested and used in various combinations to create the desired product and user images. Designs help to create the perceived product attributes and project a personality image of the user with the intent of fulfilling the psychological needs of the targeted type of smoker. The communication of these images and attributes is conducted through conscious and subliminal processes. Extensive testing is conducted using a variety of qualitative and quantitative research techniques. Conclusion The promotion of tobacco products through appealing imagery cannot be stopped without regulating the package design. The same marketing research techniques used by the tobacco companies can be used to design generic packaging and more effective warning labels targeted at specific consumers.

Experimental Design and Power Calculation for RNA-seq Experiments.

PubMed

Wu, Zhijin; Wu, Hao

2016-01-01

Power calculation is a critical component of RNA-seq experimental design. The flexibility of RNA-seq experiment and the wide dynamic range of transcription it measures make it an attractive technology for whole transcriptome analysis. These features, in addition to the high dimensionality of RNA-seq data, bring complexity in experimental design, making an analytical power calculation no longer realistic. In this chapter we review the major factors that influence the statistical power of detecting differential expression, and give examples of power assessment using the R package PROPER.

Mars Aerocapture Systems Study

NASA Technical Reports Server (NTRS)

Wright, Henry S.; Oh, David Y.; Westhelle, Carlos H.; Fisher, Jody L.; Dyke, R. Eric; Edquist, Karl T.; Brown, James L.; Justh, Hilary L.; Munk, Michelle M.

2006-01-01

Mars Aerocapture Systems Study (MASS) is a detailed study of the application of aerocapture to a large Mars robotic orbiter to assess and identify key technology gaps. This study addressed use of an Opposition class return segment for use in the Mars Sample Return architecture. Study addressed mission architecture issues as well as system design. Key trade studies focused on design of aerocapture aeroshell, spacecraft design and packaging, guidance, navigation and control with simulation, computational fluid dynamics, and thermal protection system sizing. Detailed master equipment lists are included as well as a cursory cost assessment.

New Developments in Nickel-Hydrogen Dependent Pressure Vessel (DPV) Cell and Battery Design

NASA Technical Reports Server (NTRS)

Caldwell, Dwight B.; Fox, Chris L.; Miller, Lee E.

1997-01-01

THe Dependent Pressure Vessel (DPV) Nickel-Hydrogen (NiH2) design is being developed as an advanced battery for military and commercial, aerospace and terrestrial applications. The DPV cell design offers high specific energy and energy density as well as reduced cost, while retaining the established Individual Pressure Vessel (IPV) technology flight heritage and database. This advanced DPV design also offers a more efficient mechanical, electrical and thermal cell and battery configuration and a reduced part count. The DPV battery design promotes compact, minimum volume packaging and weight efficiency, and delivers cost and weight savings with minimal design risk.

RCAS: an RNA centric annotation system for transcriptome-wide regions of interest.

PubMed

Uyar, Bora; Yusuf, Dilmurat; Wurmus, Ricardo; Rajewsky, Nikolaus; Ohler, Uwe; Akalin, Altuna

2017-06-02

In the field of RNA, the technologies for studying the transcriptome have created a tremendous potential for deciphering the puzzles of the RNA biology. Along with the excitement, the unprecedented volume of RNA related omics data is creating great challenges in bioinformatics analyses. Here, we present the RNA Centric Annotation System (RCAS), an R package, which is designed to ease the process of creating gene-centric annotations and analysis for the genomic regions of interest obtained from various RNA-based omics technologies. The design of RCAS is modular, which enables flexible usage and convenient integration with other bioinformatics workflows. RCAS is an R/Bioconductor package but we also created graphical user interfaces including a Galaxy wrapper and a stand-alone web service. The application of RCAS on published datasets shows that RCAS is not only able to reproduce published findings but also helps generate novel knowledge and hypotheses. The meta-gene profiles, gene-centric annotation, motif analysis and gene-set analysis provided by RCAS provide contextual knowledge which is necessary for understanding the functional aspects of different biological events that involve RNAs. In addition, the array of different interfaces and deployment options adds the convenience of use for different levels of users. RCAS is available at http://bioconductor.org/packages/release/bioc/html/RCAS.html and http://rcas.mdc-berlin.de. © The Author(s) 2017. Published by Oxford University Press on behalf of Nucleic Acids Research.

Training on women and renewable sources of energy.

PubMed

Duenas Loza, M

1997-01-01

The training package developed by the International Research and Training Institute for the Advancement of Women in 1989 focuses on women and energy. The Institute conducts training activities using collected, analyzed and disseminated information and documentation, as well as identification of critical research and training activities and promotion of integrated issues on women and energy policies, programs and projects. Previous training experiences identified the inefficient quality of training offered to community members, technical staff and technical agencies, with more emphasis on the technical skills instead on the managerial, socio-organizational and environmental aspects. The creation of a multimedia modular training material provides an association between the issues of women, New and Renewable Sources of Energy (NRSE) and environmental aspects necessary for the strengthening of national institutions, promotion of socioeconomical and technically feasible renewable technologies, and awareness building, information and communication enhancement. The package covers 1) overview of the UN activities on NRSE; 2) Women's Position in the Energy Sector; 3) NRSE Project and Program design and implementation; 4) relevant NRSE characteristics and technology systems; 5) education and training activities in NRSE projects. This training package is designed to contribute a new approach in the organization and management of NRSE through integration of women's needs and increase awareness and capabilities of planners, officials and experts. In addition, several training seminars were conducted during 1989-91, which focused on the relationship between women and renewable energy sources through the application of participatory and self-reliant techniques.

Advanced Manufacturing Systems in Food Processing and Packaging Industry

NASA Astrophysics Data System (ADS)

Shafie Sani, Mohd; Aziz, Faieza Abdul

2013-06-01

In this paper, several advanced manufacturing systems in food processing and packaging industry are reviewed, including: biodegradable smart packaging and Nano composites, advanced automation control system consists of fieldbus technology, distributed control system and food safety inspection features. The main purpose of current technology in food processing and packaging industry is discussed due to major concern on efficiency of the plant process, productivity, quality, as well as safety. These application were chosen because they are robust, flexible, reconfigurable, preserve the quality of the food, and efficient.

Development and Ground Testing of a Compactly Stowed Scalable Inflatably Deployed Solar Sail

NASA Technical Reports Server (NTRS)

Lichodziejewski, David; Derbes, Billy; Reinert, Rich; Belvin, Keith; Slade, Kara; Mann, Troy

2004-01-01

This paper discusses the solar sail design and outlines the interim accomplishments to advance the technology readiness level (TRL) of the subsystem from 3 toward a technology readiness level of 6 in 2005. Under Phase II of the program many component test articles have been fabricated and tested successfully. Most notably an unprecedented section of the conically deployed rigidizable sail support beam, the heart of the inflatable rigidizable structure, has been deployed and tested in the NASA Goddard thermal vacuum chamber with good results. The development testing validated the beam packaging and deployment. The inflatable conically deployed, Sub Tg rigidizable beam technology is now in the TRL 5-6 range. The fabricated masses and structural test results of our beam components have met predictions and no changes to the mass estimates or design assumptions have been identified adding great credibility to the design. Several quadrants of the Mylar sail have also been fabricated and successfully deployed validating our design, manufacturing, and deployment techniques.

EARLY ENTRANCE COPRODUCTION PLANT

DOE Office of Scientific and Technical Information (OSTI.GOV)

David Storm; Govanon Nongbri; Steve Decanio

2004-01-12

The overall objective of this project is the three phase development of an Early Entrance Coproduction Plant (EECP) which uses petroleum coke to produce at least one product from at least two of the following three categories: (1) electric power (or heat), (2) fuels, and (3) chemicals using ChevronTexaco's proprietary gasification technology. The objective of Phase I is to determine the feasibility and define the concept for the EECP located at a specific site; develop a Research, Development, and Testing (RD&T) Plan to mitigate technical risks and barriers; and prepare a Preliminary Project Financing Plan. The objective of Phase IImore » is to implement the work as outlined in the Phase I RD&T Plan to enhance the development and commercial acceptance of coproduction technology. The objective of Phase III is to develop an engineering design package and a financing and testing plan for an EECP located at a specific site. The project's intended result is to provide the necessary technical, economic, and environmental information needed by industry to move the EECP forward to detailed design, construction, and operation. The partners in this project are Texaco Energy Systems LLC or TES (a subsidiary of ChevronTexaco), General Electric (GE), Praxair, and Kellogg Brown & Root (KBR) in addition to the U.S. Department of Energy (DOE). TES is providing gasification technology and Fischer-Tropsch (F-T) technology developed by Rentech, Inc., GE is providing combustion turbine technology, Praxair is providing air separation technology, and KBR is providing engineering. During Phase I, a design basis for the Fischer-Tropsch Synthesis section was developed based on limited experience with the specified feed gas and operating conditions. The objective of this Task in Phase II RD&T work was to confirm the performance of the F-T reactor at the set design conditions. Although much of the research, development, and testing work were done by TES outside of this project, several important issues were addressed in this phase of the project. They included Rejuvenation/Regeneration of the Fischer-Tropsch Catalyst, online Catalyst Withdrawal and Addition from the synthesis reactor, and the Fischer-Tropsch Design Basis Confirmation. In Phase III the results from these RD&T work will be incorporated in developing the engineering design package. This Topical Report documents the Phase II RD&T work that was completed for this task.« less

European MEMS foundries

NASA Astrophysics Data System (ADS)

Salomon, Patric R.

2003-01-01

According to the latest release of the NEXUS market study, the market for MEMS or Microsystems Technology (MST) is predicted to grow to $68B by the year 2005, with systems containing these components generating even higher revenues and growth. The latest advances in MST/MEMS technology have enabled the design of a new generation of microsystems that are smaller, cheaper, more reliable, and consume less power. These integrated systems bring together numerous analog/mixed signal microelectronics blocks and MEMS functions on a single chip or on two or more chips assembled within an integrated package. In spite of all these advances in technology and manufacturing, a system manufacturer either faces a substantial up-front R&D investment to create his own infrastructure and expertise, or he can use design and foundry services to get the initial product into the marketplace fast and with an affordable investment. Once he has a viable product, he can still think about his own manufacturing efforts and investments to obtain an optimized high volume manufacturing for the specific product. One of the barriers to successful exploitation of MEMS/MST technology has been the lack of access to industrial foundries capable of producing certified microsystems devices in commercial quantities, including packaging and test. This paper discusses Multi-project wafer (MPW) runs, requirements for foundries and gives some examples of foundry business models. Furthermore, this paper will give an overview on MST/MEMS services that are available in Europe, including pure commercial activities, European project activities (e.g. Europractice), and some academic services.

Assessment of Quality Assurance Measures for Radioactive Material Transport Packages not Requiring Competent Authority Design Approval - 13282

DOE Office of Scientific and Technical Information (OSTI.GOV)

Komann, Steffen; Groeke, Carsten; Droste, Bernhard

The majority of transports of radioactive materials are carried out in packages which don't need a package design approval by a competent authority. Low-active radioactive materials are transported in such packages e.g. in the medical and pharmaceutical industry and in the nuclear industry as well. Decommissioning of NPP's leads to a strong demand for packages to transport low and middle active radioactive waste. According to IAEA regulations the 'non-competent authority approved package types' are the Excepted Packages and the Industrial Packages of Type IP-1, IP-2 and IP-3 and packages of Type A. For these types of packages an assessment bymore » the competent authority is required for the quality assurance measures for the design, manufacture, testing, documentation, use, maintenance and inspection (IAEA SSR 6, Chap. 306). In general a compliance audit of the manufacturer of the packaging is required during this assessment procedure. Their regulatory level in the IAEA regulations is not comparable with the 'regulatory density' for packages requiring competent authority package design approval. Practices in different countries lead to different approaches within the assessment of the quality assurance measures in the management system as well as in the quality assurance program of a special package design. To use the package or packaging in a safe manner and in compliance with the regulations a management system for each phase of the life of the package or packaging is necessary. The relevant IAEA-SSR6 chap. 801 requires documentary verification by the consignor concerning package compliance with the requirements. (authors)« less

Design consideration for a nuclear electric propulsion system

NASA Technical Reports Server (NTRS)

Phillips, W. M.; Pawlik, E. V.

1978-01-01

A study is currently underway to design a nuclear electric propulsion vehicle capable of performing detailed exploration of the outer-planets. Primary emphasis is on the power subsystem. Secondary emphasis includes integration into a spacecraft, and integration with the thrust subsystem and science package or payload. The results of several design iterations indicate an all-heat-pipe system offers greater reliability, elimination of many technology development areas and a specific weight of under 20 kg/kWe at the 400 kWe power level. The system is compatible with a single Shuttle launch and provides greater safety than could be obtained with designs using pumped liquid metal cooling. Two configurations, one with the reactor and power conversion forward on the spacecraft with the ion engines aft and the other with reactor, power conversion and ion engines aft were selected as dual baseline designs based on minimum weight, minimum required technology development and maximum growth potential and flexibility.

Recent developments in intelligent packaging for enhancing food quality and safety.

PubMed

Sohail, Muhammad; Sun, Da-Wen; Zhu, Zhiwei

2018-03-07

The role of packaging cannot be denied in the life cycle of any food product. Intelligent packaging is an emerging technology in the food packaging sector. Although it still needs its full emergence in the market, its importance has been proved for the maintenance of food quality and safety. The present review describes several aspects of intelligent packaging. It first highlights different tools used in intelligent packaging and elucidates the role of these packaging devices for maintaining the quality of different food items in terms of controlling microbial growth and gas concentration, and for providing convenience and easiness to its users in the form of time temperature indication. This review also discusses other intelligent packaging solutions in supply chain management of food products to control theft and counterfeiting conducts and broaden the image of the food companies in terms of branding and marketing. Overall, intelligent packaging can ensure food quality and safety in the food industry, however there are still some concerns over this emerging technology including high cost and legal aspects, and thus future work should be performed to overcome these problems for further promoting its applications in the food industry. Moreover, work should also be carried out to combine several single intelligent packaging devices into a single one, so that most of the benefits from this emerging technology can be achieved.

Swingbed Amine Carbon Dioxide Removal Flight Experiment - Feasibility Study and Concept Development for Cost-Effective Exploration Technology Maturation on The International Space Station

NASA Technical Reports Server (NTRS)

Hodgson, Edward; Papale, William; Nalette, Timothy; Graf, John; Sweterlitsch, Jeffery; Hayley, Elizabeth; Williams, Antony; Button, Amy

2011-01-01

The completion of International Space Station Assembly and transition to a full six person crew has created the opportunity to create and implement flight experiments that will drive down the ultimate risks and cost for human space exploration by maturing exploration technologies in realistic space environments that are impossible or incredibly costly to duplicate in terrestrial laboratories. An early opportunity for such a technology maturation experiment was recognized in the amine swingbed technology baselined for carbon dioxide and humidity control on the Orion spacecraft and Constellation Spacesuit System. An experiment concept using an existing high fidelity laboratory swing bed prototype has been evaluated in a feasibility and concept definition study leading to the conclusion that the envisioned flight experiment can be both feasible and of significant value for NASA s space exploration technology development efforts. Based on the results of that study NASA has proceeded with detailed design and implementation for the flight experiment. The study effort included the evaluation of technology risks, the extent to which ISS provided unique opportunities to understand them, and the implications of the resulting targeted risks for the experiment design and operational parameters. Based on those objectives and characteristics, ISS safety and integration requirements were examined, experiment concepts developed to address them and their feasibility assessed. This paper will describe the analysis effort and conclusions and present the resulting flight experiment concept. The flight experiment, implemented by NASA and launched in two packages in January and August 2011, integrates the swing bed with supporting elements including electrical power and controls, sensors, cooling, heating, fans, air- and water-conserving functionality, and mechanical packaging structure. It is now on board the ISS awaiting installation and activation.

Optical systems integrated modeling

NASA Technical Reports Server (NTRS)

Shannon, Robert R.; Laskin, Robert A.; Brewer, SI; Burrows, Chris; Epps, Harlan; Illingworth, Garth; Korsch, Dietrich; Levine, B. Martin; Mahajan, Vini; Rimmer, Chuck

1992-01-01

An integrated modeling capability that provides the tools by which entire optical systems and instruments can be simulated and optimized is a key technology development, applicable to all mission classes, especially astrophysics. Many of the future missions require optical systems that are physically much larger than anything flown before and yet must retain the characteristic sub-micron diffraction limited wavefront accuracy of their smaller precursors. It is no longer feasible to follow the path of 'cut and test' development; the sheer scale of these systems precludes many of the older techniques that rely upon ground evaluation of full size engineering units. The ability to accurately model (by computer) and optimize the entire flight system's integrated structural, thermal, and dynamic characteristics is essential. Two distinct integrated modeling capabilities are required. These are an initial design capability and a detailed design and optimization system. The content of an initial design package is shown. It would be a modular, workstation based code which allows preliminary integrated system analysis and trade studies to be carried out quickly by a single engineer or a small design team. A simple concept for a detailed design and optimization system is shown. This is a linkage of interface architecture that allows efficient interchange of information between existing large specialized optical, control, thermal, and structural design codes. The computing environment would be a network of large mainframe machines and its users would be project level design teams. More advanced concepts for detailed design systems would support interaction between modules and automated optimization of the entire system. Technology assessment and development plans for integrated package for initial design, interface development for detailed optimization, validation, and modeling research are presented.

Validating continuous digital light processing (cDLP) additive manufacturing accuracy and tissue engineering utility of a dye-initiator package.

PubMed

Wallace, Jonathan; Wang, Martha O; Thompson, Paul; Busso, Mallory; Belle, Vaijayantee; Mammoser, Nicole; Kim, Kyobum; Fisher, John P; Siblani, Ali; Xu, Yueshuo; Welter, Jean F; Lennon, Donald P; Sun, Jiayang; Caplan, Arnold I; Dean, David

2014-03-01

This study tested the accuracy of tissue engineering scaffold rendering via the continuous digital light processing (cDLP) light-based additive manufacturing technology. High accuracy (i.e., <50 µm) allows the designed performance of features relevant to three scale spaces: cell-scaffold, scaffold-tissue, and tissue-organ interactions. The biodegradable polymer poly (propylene fumarate) was used to render highly accurate scaffolds through the use of a dye-initiator package, TiO2 and bis (2,4,6-trimethylbenzoyl)phenylphosphine oxide. This dye-initiator package facilitates high accuracy in the Z dimension. Linear, round, and right-angle features were measured to gauge accuracy. Most features showed accuracies between 5.4-15% of the design. However, one feature, an 800 µm diameter circular pore, exhibited a 35.7% average reduction of patency. Light scattered in the x, y directions by the dye may have reduced this feature's accuracy. Our new fine-grained understanding of accuracy could be used to make further improvements by including corrections in the scaffold design software. Successful cell attachment occurred with both canine and human mesenchymal stem cells (MSCs). Highly accurate cDLP scaffold rendering is critical to the design of scaffolds that both guide bone regeneration and that fully resorb. Scaffold resorption must occur for regenerated bone to be remodeled and, thereby, achieve optimal strength.

Complete indium-free CW 200W passively cooled high power diode laser array using double-side cooling technology

NASA Astrophysics Data System (ADS)

Wang, Jingwei; Zhu, Pengfei; Liu, Hui; Liang, Xuejie; Wu, Dihai; Liu, Yalong; Yu, Dongshan; Zah, Chung-en; Liu, Xingsheng

2017-02-01

High power diode lasers have been widely used in many fields. To meet the requirements of high power and high reliability, passively cooled single bar CS-packaged diode lasers must be robust to withstand thermal fatigue and operate long lifetime. In this work, a novel complete indium-free double-side cooling technology has been applied to package passively cooled high power diode lasers. Thermal behavior of hard solder CS-package diode lasers with different packaging structures was simulated and analyzed. Based on these results, the device structure and packaging process of double-side cooled CS-packaged diode lasers were optimized. A series of CW 200W 940nm high power diode lasers were developed and fabricated using hard solder bonding technology. The performance of the CW 200W 940nm high power diode lasers, such as output power, spectrum, thermal resistance, near field, far field, smile, lifetime, etc., is characterized and analyzed.

Visible and shortwave infrared focal planes for remote sensing instruments

NASA Astrophysics Data System (ADS)

Tower, J. R.; McCarthy, B. M.; Pellon, L. E.; Strong, R. T.; Elabd, H.

1984-01-01

The development of solid-state sensor technology for multispectral linear array (MLA) instruments is described. A buttable four-spectral-band linear-format CCD and a buttable two-spectral band linear-format short-wave IR CCD have been designed, and first samples have been demonstrated. In addition, first-sample four-band interference filters have been fabricated, and hybrid packaging technology is being developed. Based on this development work, the design and construction of focal planes for a Shuttle sortie MLA instrument have begun. This work involves a visible and near-IR focal plane with 2048 pixels x 4 spectral bands and a short-wave IR focal plane with 1024 pixels x 2 spectral bands.

An airline study of advanced technology requirements for advanced high speed commercial engines. 3: Propulsion system requirements

NASA Technical Reports Server (NTRS)

Sallee, G. P.

1973-01-01

The advanced technology requirements for an advanced high speed commercial transport engine are presented. The results of the phase 3 effort cover the requirements and objectives for future aircraft propulsion systems. These requirements reflect the results of the Task 1 and 2 efforts and serve as a baseline for future evaluations, specification development efforts, contract/purchase agreements, and operational plans for future subsonic commercial engines. This report is divided into five major sections: (1) management objectives for commercial propulsion systems, (2) performance requirements for commercial transport propulsion systems, (3) design criteria for future transport engines, (4) design requirements for powerplant packages, and (5) testing.

Automated Work Package: Conceptual Design and Data Architecture

DOE Office of Scientific and Technical Information (OSTI.GOV)

Al Rashdan, Ahmad; Oxstrand, Johanna; Agarwal, Vivek

The automated work package (AWP) is one of the U.S. Department of Energy’s (DOE) Light Water Reactor Sustainability Program efforts to enhance the safety and economics of the nuclear power industry. An AWP is an adaptive and interactive work package that intelligently drives the work process according to the plant condition, resources status, and users progress. The AWP aims to automate several manual tasks of the work process to enhance human performance and reduce human errors. Electronic work packages (eWPs), studied by the Electric Power Research Institute (EPRI), are work packages that rely to various extent on electronic data processingmore » and presentation. AWPs are the future of eWPs. They are envisioned to incorporate the advanced technologies of the future, and thus address the unresolved deficiencies associated with the eWPs in a nuclear power plant. In order to define the AWP, it is necessary to develop an ideal envisioned scenario of the future work process without any current technology restriction. The approach followed to develop this scenario is specific to every stage of the work process execution. The scenario development resulted in fifty advanced functionalities that can be part of the AWP. To rank the importance of these functionalities, a survey was conducted involving several U.S. nuclear utilities. The survey aimed at determining the current need of the nuclear industry with respect to the current work process, i.e. what the industry is satisfied with, and where the industry envisions potential for improvement. The survey evaluated the most promising functionalities resulting from the scenario development. The results demonstrated a significant desire to adopt the majority of these functionalities. The results of the survey are expected to drive the Idaho National Laboratory (INL) AWP research and development (R&D). In order to facilitate this mission, a prototype AWP is needed. Since the vast majority of earlier efforts focused on the frontend aspects of the AWP, the backend data architecture was researched and developed in this effort. The backend design involved data architecture aspects. It was realized through this effort that the key aspects of this design are hierarchy, data configuration and live information, data templates and instances, the flow of work package execution, the introduction of properties, and the means to interface the backend to the frontend. After the backend design was developed, a data structure was built to reflect the developed data architecture. The data structure was developed to accommodate the fifty functionalities identified by the envisioned scenario development. The data structure was evaluated by incorporating an example work order from the nuclear power industry. The implementation resulted in several optimization iterations of the data structure. In addition, the rearrangement of the work order information to fit the data structure highlighted several possibilities for improvement in the current work order design, and significantly reduced the size of the work order.« less

Kilovolt dc solid state remote power controller development

NASA Technical Reports Server (NTRS)

Mitchell, J. T.

1982-01-01

The experience gained in developing and applying solid state power controller (SSPC) technology at high voltage dc (HVDC) potentials and power levels of up to 25 kilowatts is summarized. The HVDC switching devices, power switching concepts, drive circuits, and very fast acting overcurrent protection circuits were analyzed. A 25A bipolar breadboard with Darlington connected switching transistor was built. Fault testing at 900 volts was included. A bipolar transistor packaged breadboard design was developed. Power MOSFET remote power controller (RPC) was designed.

Fiber-Based, Trace-Gas, Laser Transmitter Technology Development for Space

NASA Technical Reports Server (NTRS)

Stephen, Mark; Yu, Anthony; Chen, Jeffrey; Nicholson, Jeffrey; Engin, Doruk; Mathason, Brian; Wu, Stewart; Allan, Graham; Hasselbrack, William; Gonzalez, Brayler;

Preparation of a YAG:Ce phosphor glass by screen-printing technology and its application in LED packaging.

PubMed

Yang, Liang; Chen, Mingxiang; Lv, Zhicheng; Wang, Simin; Liu, Xiaogang; Liu, Sheng

2013-07-01

A simple and practical method for preparing phosphor glass is proposed. Phosphor distribution and element analysis are investigated by optical microscope and field emission scanning electron microscope (FE-SEM). The phosphor particles dispersed in the matrix are vividly observed, and their distributions are uniform. Spectrum distribution and color coordinates dependent on the thickness of the screen-printed phosphor layer coupled with a blue light emitting diode (LED) chip are studied. The luminous efficacy of the 75 μm printed phosphor-layer phosphor glass packaged white LED is 81.24 lm/W at 350 mA. This study opens up many possibilities for applications using the phosphor glass on a selected chip in which emission is well absorbed by all phosphors. The screen-printing technique also offers possibilities for the design and engineering of complex phosphor layers on glass substrates. Phosphor screen-printing technology allows the realization of high stability and thermal conductivity for the phosphor layer. This phosphor glass method provides many possibilities for LED packing, including thin-film flip chip and remote phosphor technology.

Nanotechnology: current uses and future applications in the food industry.

PubMed

Thiruvengadam, Muthu; Rajakumar, Govindasamy; Chung, Ill-Min

2018-01-01

Recent advances in nanoscience and nanotechnology intend new and innovative applications in the food industry. Nanotechnology exposed to be an efficient method in many fields, particularly the food industry and the area of functional foods. Though as is the circumstance with the growth of any novel food processing technology, food packaging material, or food ingredient, additional studies are needed to demonstrate the potential benefits of nanotechnologies and engineered nanomaterials designed for use in foods without adverse health effects. Nanoemulsions display numerous advantages over conventional emulsions due to the small droplets size they contain: high optical clarity, excellent physical constancy against gravitational partition and droplet accumulation, and improved bioavailability of encapsulated materials, which make them suitable for food applications. Nano-encapsulation is the most significant favorable technologies having the possibility to ensnare bioactive chemicals. This review highlights the applications of current nanotechnology research in food technology and agriculture, including nanoemulsion, nanocomposites, nanosensors, nano-encapsulation, food packaging, and propose future developments in the developing field of agrifood nanotechnology. Also, an overview of nanostructured materials, and their current applications and future perspectives in food science are also presented.

Fiber-based, trace-gas, laser transmitter technology development for space

NASA Astrophysics Data System (ADS)

Stephen, Mark; Yu, Anthony; Chen, Jeffrey; Nicholson, Jeffrey; Engin, Doruk; Mathason, Brian; Wu, Stewart; Allan, Graham; Hasselbrack, William; Gonzales, Brayler; Han, Lawrence; Numata, Kenji; Storm, Mark; Abshire, James

2015-09-01

NASA's Goddard Space Flight Center (GSFC) is working on maturing the technology readiness of a laser transmitter designed for use in atmospheric CO2 remote-sensing. GSFC has been developing an airplane-based CO2 lidar instrument over several years to demonstrate the efficacy of the instrumentation and measurement technique and to link the science models to the instrument performance. The ultimate goal is to make space-based satellite measurements with global coverage. In order to accomplish this, we must demonstrate the technology readiness and performance of the components as well as demonstrate the required power-scaling to make the link with the required signal-to-noise-ratio (SNR). To date, all the instrument components have been shown to have the required performance with the exception of the laser transmitter. In this program we are working on a fiber-based master oscillator power amplifier (MOPA) laser transmitter architecture where we will develop a ruggedized package and perform the relevant environmental tests to demonstrate TRL-6. In this paper we will review our transmitter architecture and progress on the performance and packaging of the laser transmitter.

A laser communication experiment utilizing the ACT satellite and an airborne laser transceiver

NASA Technical Reports Server (NTRS)

Provencher, Charles E., Jr.; Spence, Rodney L.

1988-01-01

The launch of a laser communication transmitter package into geosynchronous Earth orbit onboard the Advanced Communications Technology Satellite (ACTS) will present an excellent opportunity for the experimental reception of laser communication signals transmitted from a space orbit. The ACTS laser package includes both a heterodyne transmitter (Lincoln Labs design) and a direct detection transmitter (Goddard Space Flight Center design) with both sharing some common optical components. NASA Lewis Research Center's Space Electronics Division is planning to perform a space communication experiment utilizing the GSFC direct detection laser transceiver. The laser receiver will be installed within an aircraft provided with a glass port for the reception of the signal. This paper describes the experiment and the approach to performing such an experiment. Described are the constraints placed on the NASA Lewis experiment by the performance parameters of the laser transmitter and by the ACTS spacecraft operations. The conceptual design of the receiving terminal is given; also included is the anticipated capability of the detector.

Design, fabrication, and packaging of an integrated, wirelessly-powered optrode array for optogenetics application

PubMed Central

Kwon, Ki Yong; Lee, Hyung-Min; Ghovanloo, Maysam; Weber, Arthur; Li, Wen

2015-01-01

The recent development of optogenetics has created an increased demand for advancing engineering tools for optical modulation of neural circuitry. This paper details the design, fabrication, integration, and packaging procedures of a wirelessly-powered, light emitting diode (LED) coupled optrode neural interface for optogenetic studies. The LED-coupled optrode array employs microscale LED (μLED) chips and polymer-based microwaveguides to deliver light into multi-level cortical networks, coupled with microelectrodes to record spontaneous changes in neural activity. An integrated, implantable, switched-capacitor based stimulator (SCS) system provides high instantaneous power to the μLEDs through an inductive link to emit sufficient light and evoke neural activities. The presented system is mechanically flexible, biocompatible, miniaturized, and lightweight, suitable for chronic implantation in small freely behaving animals. The design of this system is scalable and its manufacturing is cost effective through batch fabrication using microelectromechanical systems (MEMS) technology. It can be adopted by other groups and customized for specific needs of individual experiments. PMID:25999823

Linear Test Bed. Volume 2: Test Bed No. 2. [linear aerospike test bed for thrust vector control

NASA Technical Reports Server (NTRS)

1974-01-01

Test bed No. 2 consists of 10 combustors welded in banks of 5 to 2 symmetrical tubular nozzle assemblies, an upper stationary thrust frame, a lower thrust frame which can be hinged, a power package, a triaxial combustion wave ignition system, a pneumatic control system, pneumatically actuated propellant valves, a purge and drain system, and an electrical control system. The power package consists of the Mark 29-F fuel turbopump, the Mark 29-0 oxidizer turbopump, a gas generator assembly, and propellant ducting. The system, designated as a linear aerospike system, was designed to demonstrate the feasibility of the concept and to explore technology related to thrust vector control, thrust vector optimization, improved sequencing and control, and advanced ignition systems. The propellants are liquid oxygen/liquid hydrogen. The system was designed to operate at 1200-psia chamber pressure at an engine mixture ratio of 5.5. With 10 combustors, the sea level thrust is 95,000 pounds.

Design and Characterization of a Photometer-Colorimeter Standard

NASA Astrophysics Data System (ADS)

Eppeldauer, George P.; Rácz, Miklós

2004-05-01

A photometer and tristimulus colorimeter has been developed at the National Institute of Standards and Technology (NIST) to realize a color scale. A novel construction was developed to implement the spectral-responsivity-based scale with small uncertainty. The new device can be used as a reference illuminance and luminance meter as well. Temperature-controlled filter combinations, with 5-8 layers in one package, are used to match the responsivity of a silicon tunnel-trap detector to the CIE color-matching functions with small spectral mismatch values (f1'). Design considerations to extend the tunnel-trap detector with replaceable single and double apertures and changeable filter combinations are described. The design and fabrication of the filter packages and the dependence of the f1' values on the thickness of the filter layers are discussed. The colorimeter was characterized for angular, spatial, and spectral responsivity. An improved preamplifier can convert current to voltage in an 11-decade dynamic range with 0.01% uncertainty.

Design and characterization of a photometer-colorimeter standard.

PubMed

Eppeldauer, George P; Rácz, Miklós

2004-05-01

A photometer and tristimulus colorimeter has been developed at the National Institute of Standards and Technology (NIST) to realize a color scale. A novel construction was developed to implement the spectral-responsivity-based scale with small uncertainty. The new device can be used as a reference illuminance and luminance meter as well. Temperature-controlled filter combinations, with 5-8 layers in one package, are used to match the responsivity of a silicon tunnel-trap detector to the CIE color-matching functions with small spectral mismatch values (f1'). Design considerations to extend the tunnel-trap detector with replaceable single and double apertures and changeable filter combinations are described. The design and fabrication of the filter packages and the dependence of the f1' values on the thickness of the filter layers are discussed. The colorimeter was characterized for angular, spatial, and spectral responsivity. An improved preamplifier can convert current to voltage in an 11-decade dynamic range with 0.01% uncertainty.

Biomimetric sentinel reef structures for optical sensing and communications

NASA Astrophysics Data System (ADS)

Fries, David; Hutcheson, Tim; Josef, Noam; Millie, David; Tate, Connor

2017-05-01

Traditional artificial reef structures are designed with uniform cellular architectures and topologies and do not mimic natural reef forms. Strings and ropes are a proven, common fisheries and mariculture construction element throughout the world and using them as artificial reef scaffolding can enable a diversity of ocean sensing, communications systems including the goal of sentinel reefs. The architecture and packaging of electronics is key to enabling such structures and systems. The distributed sensor reef concept leads toward a demonstrable science-engineering-informed framework for 3D smart habitat designs critical to stock fish development and coastal monitoring and protection. These `nature-inspired' reef infrastructures, can enable novel instrumented `reef observatories' capable of collecting real-time ecosystem data. Embedding lighting and electronic elements into artificial reef systems are the first systems conceptualized. This approach of bringing spatial light to the underwater world for optical sensing, communication and even a new breed of underwater robotic vehicle is an interdisciplinary research activity which integrates principles of electronic packaging, and ocean technology with art/design.

Faster than Real-Time Dynamic Simulation for Large-Size Power System with Detailed Dynamic Models using High-Performance Computing Platform

DOE Office of Scientific and Technical Information (OSTI.GOV)

Huang, Renke; Jin, Shuangshuang; Chen, Yousu

This paper presents a faster-than-real-time dynamic simulation software package that is designed for large-size power system dynamic simulation. It was developed on the GridPACKTM high-performance computing (HPC) framework. The key features of the developed software package include (1) faster-than-real-time dynamic simulation for a WECC system (17,000 buses) with different types of detailed generator, controller, and relay dynamic models, (2) a decoupled parallel dynamic simulation algorithm with optimized computation architecture to better leverage HPC resources and technologies, (3) options for HPC-based linear and iterative solvers, (4) hidden HPC details, such as data communication and distribution, to enable development centered on mathematicalmore » models and algorithms rather than on computational details for power system researchers, and (5) easy integration of new dynamic models and related algorithms into the software package.« less

DOE Office of Scientific and Technical Information (OSTI.GOV)

Loftin, B.; Abramczyk, G.

Destructive testing of an ES-3100 Shipping Container was completed by the Packaging Technology and Pressurized Systems organization within the Savannah River National Laboratory in order to qualify the ES-3100 as a candidate storage and transport package for applications at various facilities at the Savannah River Site. The testing consisted of the detonation of three explosive charges at separate locations on a single ES-3100. The locations for the placement were chosen based the design of the ES-3100 as well as the most likely places for the package to incur damage as a result of the detonation. The testing was completed atmore » an offsite location, which raised challenges as well as allowed for development of new partnerships for this testing and for potential future testing. The results of the testing, the methods used to complete the testing, and similar, potential future work will be discussed.« less

Scientific Ballooning Technologies Workshop STO-2 Thermal Design and Analysis

NASA Technical Reports Server (NTRS)

Ferguson, Doug

2016-01-01

The heritage thermal model for the full STO-2 (Stratospheric Terahertz Observatory II), vehicle has been updated to model the CSBF (Columbia Scientific Balloon Facility) SIP-14 (Scientific Instrument Package) in detail. Analysis of this model has been performed for the Antarctica FY2017 launch season. Model temperature predictions are compared to previous results from STO-2 review documents.

Using Simulation Technology to Promote Social Competence of Handicapped Students. Final Report. Executive Summary.

ERIC Educational Resources Information Center

Appell, Louise S.; And Others

The purpose of this project was to design and develop simulation materials utilizing vocational situations) in mildly/moderately handicapped young adults. The final product, a set of materials titled "Social Skills on the Job," includes a videotape of 15 lessons, a computer software package, and a teacher's guide, and was marketed to a commercial…

Are Current SEE Test Procedures Adequate for Modern Devices and Electronics Technologies?

NASA Technical Reports Server (NTRS)

LaBel, Kenneth A.; Cohn, Lewis M.; Ladbury, Ray

2008-01-01

Believe it or not, this has been a simplistic look at starting a checklist for SEE testing. Given a memory that has 68 operating modes, when a SEU occurs that changes the mode, just how do you determine what's going on? Laser and microbeam tests can help, but not easily for modern packaged devices. Expanding this approach to other more complex devices such as ADCs or processors as well as analog devices should be considered. The recommendation is to use the existing text standards as the starting point. Just make your own checklist for the device/technology/issues being considered. At HEART 2007, we presented some of the burgeoning challenges associated with single event effect(SEE) testing of modern commercial memories: a) Package, device complexity, test fixture, and data analysis issues were discussed; b) "Complete" SEE Characterization would take 15 years; c) Qualification test costs have a greater than 4 times increase over the last decade. In this talk, we continue to explore the roles of technology with an emphasis on the existing SEE Test Procedures and some of the concerns related to modern devices. The primary objective of the briefing is to provide some overarching guidance concerning the many considerations involved in the formulation of a SEE test plan provided in a " Checklist" format.we note that there is no such thing as a complete check list and that the best approach is to develop a flexible test plan that takes into account the device type and functions, the device technology, circuit and package design, and, of course, test facility and beam characteristics.

High power vertical stacked diode laser development using macro-channel water cooling and hard solder bonding technology

NASA Astrophysics Data System (ADS)

Yu, Dongshan; Liang, Xuejie; Wang, Jingwei; Li, Xiaoning; Nie, Zhiqiang; Liu, Xingsheng

2017-02-01

A novel marco channel cooler (MaCC) has been developed for packaging high power diode vertical stacked (HPDL) lasers, which eliminates many of the issues in commercially-available copper micro-channel coolers (MCC). The MaCC coolers, which do not require deionized water as coolant, were carefully designed for compact size and superior thermal dissipation capability. Indium-free packaging technology was adopted throughout product design and fabrication process to minimize the risk of solder electromigration and thermal fatigue at high current density and long pulse width under QCW operation. Single MaCC unit with peak output power of up to 700W/bar at pulse width in microsecond range and 200W/bar at pulse width in millisecond range has been recorded. Characteristic comparison on thermal resistivity, spectrum, near filed and lifetime have been conducted between a MaCC product and its counterpart MCC product. QCW lifetime test (30ms 10Hz, 30% duty cycle) has also been conducted with distilled water as coolant. A vertical 40-MaCC stack product has been fabricated, total output power of 9 kilowatts has been recorded under QCW mode (3ms, 30Hz, 9% duty cycle).

Prototype pushing robot for emplacing vitrified waste canisters into horizontal disposal drifts

DOE Office of Scientific and Technical Information (OSTI.GOV)

Londe, L.; Seidler, W.K.; Bosgiraud, J.M.

2007-07-01

Within the French Underground Disposal concept, as described in ANDRA's (Agence Nationale pour la Gestion des Dechets Radioactifs) Dossier 2005, the Pushing Robot is an application envisaged for the emplacement (and the potential retrieval) of 'Vitrified waste packages', also called 'C type packages'. ANDRA has developed a Prototype Pushing Robot within the framework of the ESDRED Project (Engineering Studies and Demonstration of Repository Design) which is co-funded by the European Commission as part of the sixth EURATOM Research and Training Framework Programme (FP6) on nuclear energy (2002 - 2006). The Rationale of the Pushing Robot technology comes from various considerations,more » including the need for (1) a simple and robust system, capable of moving (and potentially retrieving) on up to 40 metres (m), a 2 tonne C type package (mounted on ceramic sliding runners) inside the carbon steel sleeve constituting the liner (and rock support) of a horizontal disposal cell, (2) small annular clearances between the package and the liner, (3) compactness of the device to be transferred from surface to underground, jointly with the package, inside a shielding cask, and (4) remote controlled operations for the sake of radioprotection. The initial design, based on gripping supports, has been replaced by a 'technical variant' based on inflatable toric jacks. It was then possible, using a test bench, to check that the Pushing Robot worked properly. Steps as high as 7 mm were successfully cleared by a dummy package pushed by the Prototype.. Based on the lessons learned by ANDRA's regarding the Prototype Pushing Robot, a new Scope of Work is being written for the Contract concerning an Industrial Scale Demonstrator. The Industrial Scale Demonstration should be completed by the end of the second Quarter of 2008. (authors)« less

Innovative on-chip packaging applied to uncooled IRFPA

NASA Astrophysics Data System (ADS)

Dumont, Geoffroy; Arnaud, Agnès; Impérinetti, Pierre; Vialle, Claire; Rabaud, Wilfried; Goudon, Valérie; Yon, Jean-Jacques

2008-04-01

The Laboratoire Infrarouge (LIR) of the Laboratoire d'Electronique et de Technologie de l'Information (LETI) has been involved in the development of microbolometers for over fifteen years. Two generations of technology have been transferred to ULIS and LETI is still working to improve performances of low cost detectors. Simultaneously, packaging still represents a significant part of detectors price. Reducing production costs would contribute to keep on extending applications of uncooled IRFPA to high volume markets like automotive. Therefore LETI is developing an on-chip packaging technology dedicated to microbolometers. This paper presents an original microcap structure that enables the use of IR window materials as sealing layers to maintain the expected vacuum level. The modelling and integration of an IR window suitable for this structure is also presented. This monolithic packaging technology is performed in a standard collective way, in continuation of bolometers' technology. The CEA-LETI, MINATEC presents status of these developments concerning this innovating technology including optical simulations results and SEM views of technical realizations.

MEMS-based thermoelectric infrared sensors: A review

NASA Astrophysics Data System (ADS)

Xu, Dehui; Wang, Yuelin; Xiong, Bin; Li, Tie

2017-12-01

In the past decade, micro-electromechanical systems (MEMS)-based thermoelectric infrared (IR) sensors have received considerable attention because of the advances in micromachining technology. This paper presents a review of MEMS-based thermoelectric IR sensors. The first part describes the physics of the device and discusses the figures of merit. The second part discusses the sensing materials, thermal isolation microstructures, absorber designs, and packaging methods for these sensors and provides examples. Moreover, the status of sensor implementation technology is examined from a historical perspective by presenting findings from the early years to the most recent findings.

Trends in Food Packaging.

ERIC Educational Resources Information Center

Ott, Dana B.

1988-01-01

This article discusses developments in food packaging, processing, and preservation techniques in terms of packaging materials, technologies, consumer benefits, and current and potential food product applications. Covers implications due to consumer life-style changes, cost-effectiveness of packaging materials, and the ecological impact of…

The Assurance Challenges of Advanced Packaging Technologies for Electronics

NASA Technical Reports Server (NTRS)

Sampson, Michael J.

2010-01-01

Advances in microelectronic parts performance are driving towards finer feature sizes, three-dimensional geometries and ever-increasing number of transistor equivalents that are resulting in increased die sizes and interconnection (I/O) counts. The resultant packaging necessary to provide assemble-ability, environmental protection, testability and interconnection to the circuit board for the active die creates major challenges, particularly for space applications, Traditionally, NASA has used hermetically packaged microcircuits whenever available but the new demands make hermetic packaging less and less practical at the same time as more and more expensive, Some part types of great interest to NASA designers are currently only available in non-hermetic packaging. It is a far more complex quality and reliability assurance challenge to gain confidence in the long-term survivability and effectiveness of nonhermetic packages than for hermetic ones. Although they may provide more rugged environmental protection than the familiar Plastic Encapsulated Microcircuits (PEMs), the non-hermetic Ceramic Column Grid Array (CCGA) packages that are the focus of this presentation present a unique combination of challenges to assessing their suitability for spaceflight use. The presentation will discuss the bases for these challenges, some examples of the techniques proposed to mitigate them and a proposed approach to a US MIL specification Class for non-hermetic microcircuits suitable for space application, Class Y, to be incorporated into M. IL-PRF-38535. It has recently emerged that some major packaging suppliers are offering hermetic area array packages that may offer alternatives to the nonhermetic CCGA styles but have also got their own inspectability and testability issues which will be briefly discussed in the presentation,

Reliability and quality EEE parts issues

NASA Technical Reports Server (NTRS)

Barney, Dan; Feigenbaum, Irwin

1990-01-01

NASA policy and procedures are established which govern the selection, testing, and application of electrical, electronic, and electromechanical (EEE) parts. Recent advances in the state-of-the-art of electronic parts and associated technologies can significantly impact the electronic designs and reliability of NASA space transportation avionics. Significant issues that result from these advances are examined, including: recent advances in microelectronics technology (as applied to or considered for use in NASA projects); electron packaging technology advances (concurrent with, and as a result of, the development of the advanced microelectronic devices); availability of parts used in space avionics; and standardization and integration of parts activities between projects, centers, and contractors.

SEMICONDUCTOR TECHNOLOGY: Wafer level hermetic packaging based on Cu-Sn isothermal solidification technology

NASA Astrophysics Data System (ADS)

Yuhan, Cao; Le, Luo

2009-08-01

A novel wafer level bonding method based on Cu-Sn isothermal solidification technology is established. A multi-layer sealing ring and the bonding processing are designed, and the amount of solder and the bonding parameters are optimized based on both theoretical and experimental results. Verification shows that oxidation of the solder layer, voids and the scalloped-edge appearance of the Cu6Sn5 phase are successfully avoided. An average shear strength of 19.5 MPa and an excellent leak rate of around 1.9 × 10-9 atm cc/s are possible, meeting the demands of MIL-STD-883E.

Waste Package Component Design Methodology Report

DOE Office of Scientific and Technical Information (OSTI.GOV)

D.C. Mecham

2004-07-12

This Executive Summary provides an overview of the methodology being used by the Yucca Mountain Project (YMP) to design waste packages and ancillary components. This summary information is intended for readers with general interest, but also provides technical readers a general framework surrounding a variety of technical details provided in the main body of the report. The purpose of this report is to document and ensure appropriate design methods are used in the design of waste packages and ancillary components (the drip shields and emplacement pallets). The methodology includes identification of necessary design inputs, justification of design assumptions, and usemore » of appropriate analysis methods, and computational tools. This design work is subject to ''Quality Assurance Requirements and Description''. The document is primarily intended for internal use and technical guidance for a variety of design activities. It is recognized that a wide audience including project management, the U.S. Department of Energy (DOE), the U.S. Nuclear Regulatory Commission, and others are interested to various levels of detail in the design methods and therefore covers a wide range of topics at varying levels of detail. Due to the preliminary nature of the design, readers can expect to encounter varied levels of detail in the body of the report. It is expected that technical information used as input to design documents will be verified and taken from the latest versions of reference sources given herein. This revision of the methodology report has evolved with changes in the waste package, drip shield, and emplacement pallet designs over many years and may be further revised as the design is finalized. Different components and analyses are at different stages of development. Some parts of the report are detailed, while other less detailed parts are likely to undergo further refinement. The design methodology is intended to provide designs that satisfy the safety and operational requirements of the YMP. Four waste package configurations have been selected to illustrate the application of the methodology during the licensing process. These four configurations are the 21-pressurized water reactor absorber plate waste package (21-PWRAP), the 44-boiling water reactor waste package (44-BWR), the 5 defense high-level radioactive waste (HLW) DOE spent nuclear fuel (SNF) codisposal short waste package (5-DHLWDOE SNF Short), and the naval canistered SNF long waste package (Naval SNF Long). Design work for the other six waste packages will be completed at a later date using the same design methodology. These include the 24-boiling water reactor waste package (24-BWR), the 21-pressurized water reactor control rod waste package (21-PWRCR), the 12-pressurized water reactor waste package (12-PWR), the 5 defense HLW DOE SNF codisposal long waste package (5-DHLWDOE SNF Long), the 2 defense HLW DOE SNF codisposal waste package (2-MC012-DHLW), and the naval canistered SNF short waste package (Naval SNF Short). This report is only part of the complete design description. Other reports related to the design include the design reports, the waste package system description documents, manufacturing specifications, and numerous documents for the many detailed calculations. The relationships between this report and other design documents are shown in Figure 1.« less

49 CFR 172.102 - Special provisions.

Code of Federal Regulations, 2012 CFR

2012-10-01

... design type that has passed a leakproofness test at the Packing Group II level. Small inner packagings... packaging or transport unit is closed. Each packaging must correspond to a design type that has passed a... transport unit is closed. Each packaging must correspond to a design type that has passed a leakproofness...

49 CFR 172.102 - Special provisions.

Code of Federal Regulations, 2014 CFR

2014-10-01

... packaging must correspond to a design type that has passed a leakproofness test at the Packing Group II... packaging must correspond to a design type that has passed a leakproofness test at the Packing Group II... packagings, each packaging must correspond to a design type that has passed a leakproofness test at the...

49 CFR 172.102 - Special provisions.

Code of Federal Regulations, 2013 CFR

2013-10-01

... packaging must correspond to a design type that has passed a leakproofness test at the Packing Group II... packaging must correspond to a design type that has passed a leakproofness test at the Packing Group II... packagings, each packaging must correspond to a design type that has passed a leakproofness test at the...

49 CFR 172.102 - Special provisions.

Code of Federal Regulations, 2011 CFR

2011-10-01

... design type that has passed a leakproofness test at the Packing Group II level. Small inner packagings... packaging or transport unit is closed. Each packaging must correspond to a design type that has passed a... transport unit is closed. Each packaging must correspond to a design type that has passed a leakproofness...

SMALL DRINKING WATER SYSTEMS HANDBOOK A GUIDE TO "PACKAGED" FILTRATION AND DISINFECTION TECHNOLOGIES WITH REMOTE MONITORING AND CONTROL TOOLS

EPA Science Inventory

The intent of this handbook is to highlight information appropriate to small systems with an emphasis on filtration and disinfection technologies and how they can be "packaged" with remote monitoring and control technologies to provide a healthy and affordable solution for small ...

Technical Review Report for the Model 9978-96 Package Safety Analysis Report for Packaging (S-SARP-G-00002, Revision 1, March 2009)

DOE Office of Scientific and Technical Information (OSTI.GOV)

West, M

2009-03-06

This Technical Review Report (TRR) documents the review, performed by Lawrence Livermore National Laboratory (LLNL) Staff, at the request of the Department of Energy (DOE), on the 'Safety Analysis Report for Packaging (SARP), Model 9978 B(M)F-96', Revision 1, March 2009 (S-SARP-G-00002). The Model 9978 Package complies with 10 CFR 71, and with 'Regulations for the Safe Transport of Radioactive Material-1996 Edition (As Amended, 2000)-Safety Requirements', International Atomic Energy Agency (IAEA) Safety Standards Series No. TS-R-1. The Model 9978 Packaging is designed, analyzed, fabricated, and tested in accordance with Section III of the American Society of Mechanical Engineers Boiler and Pressuremore » Vessel Code (ASME B&PVC). The review presented in this TRR was performed using the methods outlined in Revision 3 of the DOE's 'Packaging Review Guide (PRG) for Reviewing Safety Analysis Reports for Packages'. The format of the SARP follows that specified in Revision 2 of the Nuclear Regulatory Commission's Regulatory Guide 7.9, i.e., 'Standard Format and Content of Part 71 Applications for Approval of Packages for Radioactive Material'. Although the two documents are similar in their content, they are not identical. Formatting differences have been noted in this TRR, where appropriate. The Model 9978 Packaging is a single containment package, using a 5-inch containment vessel (5CV). It uses a nominal 35-gallon drum package design. In comparison, the Model 9977 Packaging uses a 6-inch containment vessel (6CV). The Model 9977 and Model 9978 Packagings were developed concurrently, and they were referred to as the General Purpose Fissile Material Package, Version 1 (GPFP). Both packagings use General Plastics FR-3716 polyurethane foam as insulation and as impact limiters. The 5CV is used as the Primary Containment Vessel (PCV) in the Model 9975-96 Packaging. The Model 9975-96 Packaging also has the 6CV as its Secondary Containment Vessel (SCV). In comparison, the Model 9975 Packagings use Celotex{trademark} for insulation and as impact limiters. To provide a historical perspective, it is noted that the Model 9975-96 Packaging is a 35-gallon drum package design that has evolved from a family of packages designed by DOE contractors at the Savannah River Site. Earlier package designs, i.e., the Model 9965, the Model 9966, the Model 9967, and the Model 9968 Packagings, were originally designed and certified in the early 1980s. In the 1990s, updated package designs that incorporated design features consistent with the then-newer safety requirements were proposed. The updated package designs at the time were the Model 9972, the Model 9973, the Model 9974, and the Model 9975 Packagings, respectively. The Model 9975 Package was certified by the Packaging Certification Program, under the Office of Safety Management and Operations. The Model 9978 Package has six Content Envelopes: C.1 ({sup 238}Pu Heat Sources), C.2 ( Pu/U Metals), C.3 (Pu/U Oxides, Reserved), C.4 (U Metal or Alloy), C.5 (U Compounds), and C.6 (Samples and Sources). Per 10 CFR 71.59 (Code of Federal Regulations), the value of N is 50 for the Model 9978 Package leading to a Criticality Safety Index (CSI) of 1.0. The Transport Index (TI), based on dose rate, is calculated to be a maximum of 4.1.« less

High Frequency Electronic Packaging Technology

NASA Technical Reports Server (NTRS)

Herman, M.; Lowry, L.; Lee, K.; Kolawa, E.; Tulintseff, A.; Shalkhauser, K.; Whitaker, J.; Piket-May, M.

1994-01-01

Commercial and government communication, radar, and information systems face the challenge of cost and mass reduction via the application of advanced packaging technology. A majority of both government and industry support has been focused on low frequency digital electronics.

A 5 meter range non-planar CMUT array for Automotive Collision Avoidance

NASA Astrophysics Data System (ADS)

Hernandez Aguirre, Jonathan

A discretized hyperbolic paraboloid geometry capacitive micromachined ultrasonic transducer (CMUT) array has been designed and fabricated for automotive collision avoidance. The array is designed to operate at 40 kHz, beamwidth of 40° with a maximum sidelobe intensity of -10dB. An SOI based fabrication technology has been used for the 5x5 array with 5 sensing surfaces along each x and y axis and 7 elevation levels. An assembly and packaging technique has been developed to realize the non-planar geometry in a PGA-68 package. A highly accurate mathematical method has been presented for analytical characterization of capacitive micromachined ultrasonic transducers (CMUTs) built with square diaphragms. The method uses a new two-dimensional polynomial function to more accurately predict the deflection curve of a multilayer square diaphragm subject to both mechanical and electrostatic pressure and a new capacitance model that takes into account the contribution of the fringing field capacitances.

Unlocking Potentials of Microwaves for Food Safety and Quality

PubMed Central

Tang, Juming

2015-01-01

Microwave is an effective means to deliver energy to food through polymeric package materials, offering potential for developing short-time in-package sterilization and pasteurization processes. The complex physics related to microwave propagation and microwave heating require special attention to the design of process systems and development of thermal processes in compliance with regulatory requirements for food safety. This article describes the basic microwave properties relevant to heating uniformity and system design, and provides a historical overview on the development of microwave-assisted thermal sterilization (MATS) and pasteurization systems in research laboratories and used in food plants. It presents recent activities on the development of 915 MHz single-mode MATS technology, the procedures leading to regulatory acceptance, and sensory results of the processed products. The article discusses needs for further efforts to bridge remaining knowledge gaps and facilitate transfer of academic research to industrial implementation. PMID:26242920

Unlocking Potentials of Microwaves for Food Safety and Quality.

PubMed

Tang, Juming

2015-08-01

Microwave is an effective means to deliver energy to food through polymeric package materials, offering potential for developing short-time in-package sterilization and pasteurization processes. The complex physics related to microwave propagation and microwave heating require special attention to the design of process systems and development of thermal processes in compliance with regulatory requirements for food safety. This article describes the basic microwave properties relevant to heating uniformity and system design, and provides a historical overview on the development of microwave-assisted thermal sterilization (MATS) and pasteurization systems in research laboratories and used in food plants. It presents recent activities on the development of 915 MHz single-mode MATS technology, the procedures leading to regulatory acceptance, and sensory results of the processed products. The article discusses needs for further efforts to bridge remaining knowledge gaps and facilitate transfer of academic research to industrial implementation. © 2015 Institute of Food Technologists®

78 FR 1101 - Hazardous Materials: Harmonization With the United Nations Recommendations on the Transport of...

Federal Register 2010, 2011, 2012, 2013, 2014

2013-01-07

... packaging maintains an equivalent level of performance to the originally tested packaging design must be... material, packing group assignments, special provisions, packaging authorizations, packaging sections, air... responsibilities related to packaging design variation, manufacturer notification, and recordkeeping requirements...

Modeling, design, packing and experimental analysis of liquid-phase shear-horizontal surface acoustic wave sensors

NASA Astrophysics Data System (ADS)

Pollard, Thomas B

Recent advances in microbiology, computational capabilities, and microelectromechanical-system fabrication techniques permit modeling, design, and fabrication of low-cost, miniature, sensitive and selective liquid-phase sensors and lab-on-a-chip systems. Such devices are expected to replace expensive, time-consuming, and bulky laboratory-based testing equipment. Potential applications for devices include: fluid characterization for material science and industry; chemical analysis in medicine and pharmacology; study of biological processes; food analysis; chemical kinetics analysis; and environmental monitoring. When combined with liquid-phase packaging, sensors based on surface-acoustic-wave (SAW) technology are considered strong candidates. For this reason such devices are focused on in this work; emphasis placed on device modeling and packaging for liquid-phase operation. Regarding modeling, topics considered include mode excitation efficiency of transducers; mode sensitivity based on guiding structure materials/geometries; and use of new piezoelectric materials. On packaging, topics considered include package interfacing with SAW devices, and minimization of packaging effects on device performance. In this work novel numerical models are theoretically developed and implemented to study propagation and transduction characteristics of sensor designs using wave/constitutive equations, Green's functions, and boundary/finite element methods. Using developed simulation tools that consider finite-thickness of all device electrodes, transduction efficiency for SAW transducers with neighboring uniform or periodic guiding electrodes is reported for the first time. Results indicate finite electrode thickness strongly affects efficiency. Using dense electrodes, efficiency is shown to approach 92% and 100% for uniform and periodic electrode guiding, respectively; yielding improved sensor detection limits. A numerical sensitivity analysis is presented targeting viscosity using uniform-electrode and shear-horizontal mode configurations on potassium-niobate, langasite, and quartz substrates. Optimum configurations are determined yielding maximum sensitivity. Results show mode propagation-loss and sensitivity to viscosity are correlated by a factor independent of substrate material. The analysis is useful for designing devices meeting sensitivity and signal level requirements. A novel, rapid and precise microfluidic chamber alignment/bonding method was developed for SAW platforms. The package is shown to have little effect on device performance and permits simple macrofluidic interfacing. Lastly, prototypes were designed, fabricated, and tested for viscosity and biosensor applications; results show ability to detect as low as 1% glycerol in water and surface-bound DNA crosslinking.

Manned Mars Mission program concepts

NASA Technical Reports Server (NTRS)

Hamilton, E. C.; Johnson, P.; Pearson, J.; Tucker, W.

1988-01-01

This paper describes the SRS Manned Mars Mission and Program Analysis study designed to support a manned expedition to Mars contemplated by NASA for the purposes of initiating human exploration and eventual habitation of this planet. The capabilities of the interactive software package being presently developed by the SRS for the mission/program analysis are described, and it is shown that the interactive package can be used to investigate the impact of various mission concepts on the sensitivity of mass required in LEO, schedules, relative costs, and risk. The results, to date, indicate the need for an earth-to-orbit transportation system much larger than the present STS, reliable long-life support systems, and either advanced propulsion or aerobraking technology.

The MHOST finite element program: 3-D inelastic analysis methods for hot section components. Volume 2: User's manual

NASA Technical Reports Server (NTRS)

Nakazawa, Shohei

1989-01-01

The user options available for running the MHOST finite element analysis package is described. MHOST is a solid and structural analysis program based on the mixed finite element technology, and is specifically designed for 3-D inelastic analysis. A family of 2- and 3-D continuum elements along with beam and shell structural elements can be utilized, many options are available in the constitutive equation library, the solution algorithms and the analysis capabilities. The outline of solution algorithms is discussed along with the data input and output, analysis options including the user subroutines and the definition of the finite elements implemented in the program package.

Nanotechnology in the development of novel functional foods or their package. An overview based in patent analysis.

PubMed

Pérez-Esteve, Edgar; Bernardos, Andrea; Martínez-Máñez, Ramón; Barat, José M

2013-04-01

In recent years nanotechnology has become a significant component in food industry. It is present in all food chain steps, from the design of new ingredients or additives, to the most modern systems of food quality methods or packaging, demonstrating the great potential of this new technology in a sector as traditional as food. However, while interest by industry in nanotechnology increases, the rejection by consumers, concerned about the potential risk, does too. The aim of this review is to evaluate the development of food nanotechnology by means of a patent analysis, highlighting current applications of nanotechnology along the whole food chain and contextualizing this evolution in the social scene.

Macroalgae for CO 2 Capture and Renewable Energy - A Pilot Project

DOE Office of Scientific and Technical Information (OSTI.GOV)

Wiley, Kristine

2011-01-31

The objective of this project was to demonstrate, at a pilot scale, the beneficial use of carbon dioxide (CO 2) through a technology designed to capture CO 2 from fossil-fuel fired power plant stack gas, generating macroalgae and converting the macroalgae at high efficiency to renewable methane that can be utilized in the power plant or introduced into a natural gas pipeline. The proposed pilot plant would demonstrate the cost-effectiveness and CO 2/ NO x flue-gas removal efficiency of an innovative algal scrubber technology where seaweeds are grown out of water on specially-designed supporting structures contained within greenhouses where themore » plants are constantly bathed by recycled nutrient sprays enriched by flue gas constituents. The work described in this document addresses Phase 1 of the project only. The scope of work for Phase 1 includes the completion of a preliminary design package; the collection of additional experimental data to support the preliminary and detailed design for a pilot scale utilization of CO 2 to cultivate macroalage and to process that algae to produce methane; and a technological and economic analysis to evaluate the potential of the system. Selection criteria for macroalgae that could survive the elevated temperatures and potential periodic desiccation of near desert project sites were identified. Samples of the selected macroalgae species were obtained and then subjected to anaerobic digestion to determine conversions and potential methane yields. A Process Design Package (PDP) was assembled that included process design, process flow diagram, material balance, instrumentation, and equipment list, sizes, and cost for the Phase 2 pilot plant. Preliminary economic assessments were performed under the various assumptions made, which are purposely conservative. Based on the results, additional development work should be conducted to delineate the areas for improving efficiency, reducing contingencies, and reducing overall costs.« less

Packaging and Embedded Electronics for the Next Generation

NASA Technical Reports Server (NTRS)

Sampson, Michael J.

2010-01-01

This viewgraph presentation describes examples of electronic packaging that protects an electronic element from handling, contamination, shock, vibration and light penetration. The use of Hermetic and non-hermetic packaging is also discussed. The topics include: 1) What is Electronic Packaging? 2) Why Package Electronic Parts? 3) Evolution of Packaging; 4) General Packaging Discussion; 5) Advanced non-hermetic packages; 6) Discussion of Hermeticity; 7) The Class Y Concept and Possible Extensions; 8) Embedded Technologies; and 9) NEPP Activities.

Platform technologies for hybrid optoelectronic integration and packaging

NASA Astrophysics Data System (ADS)

Datta, Madhumita

In order to bring fiber-optics closer to individual home and business services, the optical network components have to be inexpensive and reliable. Integration and packaging of optoelectronic devices holds the key to high-volume low-cost component manufacturing. The goal of this dissertation is to propose, study, and demonstrate various ways to integrate optoelectronic devices on a packaging platform to implement cost-effective, functional optical modules. Two types of hybrid integration techniques have been proposed: flip-chip solder bump bonding for high-density two-dimensional array packaging of surface-emitting devices, and solder preform bonding for fiber-coupled edge-emitting semiconductor devices. For flip-chip solder bump bonding, we developed a simple, inexpensive remetallization process called "electroless plating", which converts the aluminum bond pads of foundry-made complementary metal oxide semiconductor (CMOS) chips into solder-bondable and wire-bondable gold surfaces. We have applied for a patent on this remetallization technique. For fiber-pigtailed edge-emitting laser modules, we have studied the coupling characteristics of different types of lensed single-mode fibers including semispherically lensed fiber, cylindrically lensed fiber and conically lensed fiber. We have experimentally demonstrated 66% coupling efficiency with semispherically lensed fiber and 50% efficiency with conically lensed fibers. We have proposed and designed a packaging platform on which lensed fibers can be actively aligned to a laser and solder-attached reliably to the platform so that the alignment is retained. We have designed thin-film nichrome heaters on fused quartz platforms as local heat source to facilitate on-board solder alignment and attachment of fiber. The thermal performance of the heaters was simulated using finite element analysis tool ANSYS prior to fabrication. Using the heater's reworkability advantage, we have estimated the shift of the fiber due to solder shrinkage and introduced a pre-correction in the alignment process to restore optimum coupling efficiency close to 50% with conically lensed fibers. We have applied for a patent on this unique active alignment method through the University of Maryland's Technology Commercialization Office. Although we have mostly concentrated on active alignment platforms, we have proposed the idea of combining the passive alignment advantages of silicon optical benches to the on-board heater-assisted active alignment technique. This passive-active alignment process has the potential of cost-effective array packaging of edge-emitting devices.

Development of assembly and joint concepts for erectable space structures

NASA Technical Reports Server (NTRS)

Jacquemin, G. G.; Bluck, R. M.; Grotbeck, G. H.; Johnson, R. R.

1980-01-01

The technology associated with the on-orbit assembly of tetrahedral truss platforms erected of graphite epoxy tapered columns is examined. Associated with the assembly process is the design and fabrication of nine member node joints. Two such joints demonstrating somewhat different technology were designed and fabricated. Two methods of automatic assembly using the node designs were investigated, and the time of assembly of tetrahedral truss structures up to 1 square km in size was estimated. The effect of column and node joint packaging on the Space Shuttle cargo bay is examined. A brief discussion is included of operating cost considerations and the selection of energy sources. Consideration was given to the design assembly machines from 5 m to 20 m. The smaller machines, mounted on the Space Shuttle, are deployable and restowable. They provide a means of demonstrating the capabilities of the concept and of erecting small specialized platforms on relatively short notice.

CFD modeling to improve safe and efficient distribution of chlorine dioxide gas for packaging fresh produce

USDA-ARS?s Scientific Manuscript database

The efficiency of the packaging system in inactivating food borne pathogens and prolonging the shelf life of fresh-cut produce is influenced by the design of the package apart from material and atmospheric conditions. Three different designs were considered to determine a specific package design ens...

Development and evaluation of a helicopter-borne water-quality monitoring system

NASA Technical Reports Server (NTRS)

Wallace, J. W.; Jordan, R. A.; Flynn, J.; Thomas, R. W.

1978-01-01

A small, helicopter-borne water-quality monitoring package is being developed by the NASA/EPA using a combination of basic in situ water quality sensors and physical sample collector technology. The package is a lightweight system which can be carried and operated by one person as a passenger in a small helicopter typically available by rental at commercial airports. Real-time measurements are made by suspending the water quality monitoring package with a cable from the hovering helicopter. Designed primarily for use in rapidly assessing hazardous material spills in inland and coastal zone water bodies, the system can survey as many as 20 data stations up to 1.5 kilometers apart in 1 hour. The system provides several channels of sensor data and allows for the addition of future sensors. The system will also collect samples from selected sites with sample collection on command. An EPA Spill Response Team member can easily transport, deploy, and operate the water quality monitoring package to determine the distribution, movement, and concentration of the spilled material in the water body.

Three-axis accelerometer package for slimhole and microhole seismic monitoring and surveys

DOE Office of Scientific and Technical Information (OSTI.GOV)

Hunter, S.L.; Harben, P.E.

1997-01-07

The development of microdrilling technology, nominally defined as drilling technology for 1-in.-diameter boreholes, shows potential for reducing the cost of drilling monitoring wells. A major question that arises in drilling microholes is if downhole logging and monitoring in general--and downhole seismic surveying in particular--can be conducted in such small holes since the inner working diameter of such a seismic tool could be as small as 0.31 in. A downhole three-component accelerometer package that fits within a 031-in. inner diameter tube has been designed, built, and tested. The package consists of three orthogonally mounted Entran EGA-125-5g piezoresistive silicon micromachined accelerometers withmore » temperature compensation circuitry, downhole amplification, and line drivers mounted in a thin-walled aluminum tube. Accelerometers are commercially available in much smaller package sizes than conventional geophones, but the noise floor is significantly higher than that for the geophones. Cross-well tests using small explosives showed good signal-to-noise ratio in the recorded waveform at various receiver depths with a 1,50-ft source-receiver well separation. For some active downhole surveys, the accelerometer unit would clearly be adequate. It can be reasonably assumed, however, that for less energetic sources and for greater well separations, the high accelerometer noise floor is not acceptable. By expanding the inner working diameter of a microhole seismic tool to 0.5 in., other commercial accelerometers can be used with substantially lower noise floors.« less

Effective e-learning for health professionals and students--barriers and their solutions. A systematic review of the literature--findings from the HeXL project.

PubMed

Childs, Sue; Blenkinsopp, Elizabeth; Hall, Amanda; Walton, Graham

2005-12-01

In 2003/4 the Information Management Research Institute, Northumbria University, conducted a research project to identify the barriers to e-learning for health professionals and students. The project also established possible ways to overcome these barriers. The North of England Workforce Development Confederation funded the project. The project comprised a systematic review of the literature on barriers to and solutions/critical success factors for e-learning in the health field. Fifty-seven references were suitable for analysis. This review was supplemented by a questionnaire survey of learners and an interview study of learning providers to ensure that data identified from the literature were grounded in reality. The main barriers are: requirement for change; costs; poorly designed packages; inadequate technology; lack of skills; need for a component of face-to-face teaching; time intensive nature of e-learning; computer anxiety. A range of solutions can solve these barriers. The main solutions are: standardization; strategies; funding; integration of e-learning into the curriculum; blended teaching; user friendly packages; access to technology; skills training; support; employers paying e-learning costs; dedicated work time for e-learning. The authors argue that librarians can play an important role in e-learning: providing support and support materials; teaching information skills; managing and providing access to online information resources; producing their own e-learning packages; assisting in the development of other packages.

The NASA Electronic Parts and Packaging (NEPP) Program: Insertion of New Electronics Technologies

NASA Technical Reports Server (NTRS)

LaBel, Kenneth A.; Sampson, Michael J.

2007-01-01

This viewgraph presentation gives an overview of NASA Electronic Parts and Packaging (NEPP) Program's new electronics technology trends. The topics include: 1) The Changing World of Radiation Testing of Memories; 2) Even Application-Specific Tests are Costly!; 3) Hypothetical New Technology Part Qualification Cost; 4) Where we are; 5) Approaching FPGAs as a More Than a "Part" for Reliability; 6) FPGAs Beget Novel Radiation Test Setups; 7) Understanding the Complex Radiation Data; 8) Tracking Packaging Complexity and Reliability for FPGAs; 9) Devices Supporting the FPGA Need to be Considered; 10) Summary of the New Electronic Technologies and Insertion into Flight Programs Workshop; and 11) Highlights of Panel Notes and Comments

10 CFR 71.107 - Package design control.

Code of Federal Regulations, 2014 CFR

2014-01-01

... 10 Energy 2 2014-01-01 2014-01-01 false Package design control. 71.107 Section 71.107 Energy... Assurance § 71.107 Package design control. (a) The licensee, certificate holder, and applicant for a CoC... identification and control of design interfaces and for coordination among participating design organizations...

10 CFR 71.107 - Package design control.

Code of Federal Regulations, 2012 CFR

2012-01-01

... 10 Energy 2 2012-01-01 2012-01-01 false Package design control. 71.107 Section 71.107 Energy... Assurance § 71.107 Package design control. (a) The licensee, certificate holder, and applicant for a CoC... identification and control of design interfaces and for coordination among participating design organizations...

10 CFR 71.107 - Package design control.

Code of Federal Regulations, 2013 CFR

2013-01-01

... 10 Energy 2 2013-01-01 2013-01-01 false Package design control. 71.107 Section 71.107 Energy... Assurance § 71.107 Package design control. (a) The licensee, certificate holder, and applicant for a CoC... identification and control of design interfaces and for coordination among participating design organizations...

10 CFR 71.107 - Package design control.

Code of Federal Regulations, 2011 CFR

2011-01-01

... 10 Energy 2 2011-01-01 2011-01-01 false Package design control. 71.107 Section 71.107 Energy... Assurance § 71.107 Package design control. (a) The licensee, certificate holder, and applicant for a CoC... identification and control of design interfaces and for coordination among participating design organizations...

10 CFR 71.107 - Package design control.

Code of Federal Regulations, 2010 CFR

2010-01-01

... 10 Energy 2 2010-01-01 2010-01-01 false Package design control. 71.107 Section 71.107 Energy... Assurance § 71.107 Package design control. (a) The licensee, certificate holder, and applicant for a CoC... identification and control of design interfaces and for coordination among participating design organizations...

Adoption of Aquaculture Technology by Fish Farmers in Imo State of Nigeria

ERIC Educational Resources Information Center

Ike, Nwachukwu; Roseline, Onuegbu

2007-01-01

This paper evaluated the level of adoption of aquaculture technology extended to farmers in Imo State, Nigeria. To improve aquaculture practice in Nigeria, a technology package was developed and disseminated to farmers in the state. This package included ten practices that the farmers were supposed to adopt. Eighty-two respondents were randomly…

Low cost environmental sensors for Spaceflight : NMP Space Environmental Monitor (SEM) requirements

NASA Technical Reports Server (NTRS)

Garrett, Henry B.; Buelher, Martin G.; Brinza, D.; Patel, J. U.

2005-01-01

An outstanding problem in spaceflight is the lack of adequate sensors for monitoring the space environment and its effects on engineering systems. By adequate, we mean low cost in terms of mission impact (e.g., low price, low mass/size, low power, low data rate, and low design impact). The New Millennium Program (NMP) is investigating the development of such a low-cost Space Environmental Monitor (SEM) package for inclusion on its technology validation flights. This effort follows from the need by NMP to characterize the space environment during testing so that potential users can extrapolate the test results to end-use conditions. The immediate objective of this effort is to develop a small diagnostic sensor package that could be obtained from commercial sources. Environments being considered are: contamination, atomic oxygen, ionizing radiation, cosmic radiation, EMI, and temperature. This talk describes the requirements and rational for selecting these environments and reviews a preliminary design that includes a micro-controller data logger with data storage and interfaces to the sensors and spacecraft. If successful, such a sensor package could be the basis of a unique, long term program for monitoring the effects of the space environment on spacecraft systems.

Low Cost Environmental Sensors for Spaceflight: NMP Space Environmental Monitor (SEM) Requirements

NASA Technical Reports Server (NTRS)

Garrett, Henry B.; Buehler, Martin G.; Brinza, D.; Patel, J. U.

2005-01-01

An outstanding problem in spaceflight is the lack of adequate sensors for monitoring the space environment and its effects on engineering systems. By adequate, we mean low cost in terms of mission impact (e.g., low price, low mass/size, low power, low data rate, and low design impact). The New Millennium Program (NMP) is investigating the development of such a low-cost Space Environmental Monitor (SEM) package for inclusion on its technology validation flights. This effort follows from the need by NMP to characterize the space environment during testing so that potential users can extrapolate the test results to end-use conditions. The immediate objective of this effort is to develop a small diagnostic sensor package that could be obtained from commercial sources. Environments being considered are: contamination, atomic oxygen, ionizing radiation, cosmic radiation, EMI, and temperature. This talk describes the requirements and rational for selecting these environments and reviews a preliminary design that includes a micro-controller data logger with data storage and interfaces to the sensors and spacecraft. If successful, such a sensor package could be the basis of a unique, long term program for monitoring the effects of the space environment on spacecraft systems.

Novel Power Electronics Three-Dimensional Heat Exchanger: Preprint

DOE Office of Scientific and Technical Information (OSTI.GOV)

Bennion, K.; Cousineau, J.; Lustbader, J.

2014-08-01

Electric drive systems for vehicle propulsion enable technologies critical to meeting challenges for energy, environmental, and economic security. Enabling cost-effective electric drive systems requires reductions in inverter power semiconductor area. As critical components of the electric drive system are made smaller, heat removal becomes an increasing challenge. In this paper, we demonstrate an integrated approach to the design of thermal management systems for power semiconductors that matches the passive thermal resistance of the packaging with the active convective cooling performance of the heat exchanger. The heat exchanger concept builds on existing semiconductor thermal management improvements described in literature and patents,more » which include improved bonded interface materials, direct cooling of the semiconductor packages, and double-sided cooling. The key difference in the described concept is the achievement of high heat transfer performance with less aggressive cooling techniques by optimizing the passive and active heat transfer paths. An extruded aluminum design was selected because of its lower tooling cost, higher performance, and scalability in comparison to cast aluminum. Results demonstrated a heat flux improvement of a factor of two, and a package heat density improvement over 30%, which achieved the thermal performance targets.« less

White LED sources for vehicle forward lighting

NASA Astrophysics Data System (ADS)

Van Derlofske, John F.; McColgan, Michele W.

2002-11-01

Considerations for the use of white light emitting diode (LED) sources to produce illumination for automotive forward lighting is presented. Due to their reliability, small size, lower consumption, and lower heat generation LEDs are a natural choice for automotive lighting systems. Currently, LEDs are being sucessfully employed in most vehicle lighting applications. In these applications the light levels, distributions, and colors needed are achievable by present LED technologies. However, for vehicle white light illumination applications LEDs are now only being considered for low light level applications, such as back-up lamps. This is due to the relatively low lumen output that has been available up to now in white LEDs. With the advent of new higher lumen packages, and with the promise of even higher light output in the near future, the use of white LEDs sources for all vehicle forward lighting applications is beginning to be considered. Through computer modeling and photometric evaluation this paper examines the possibilities of using currently available white LED technology for vehicle headlamps. It is apparent that optimal LED sources for vehicle forward lighting applications will be constructed with hereto undeveloped technology and packaging configurations. However, the intent here in exploring currently available products is to begin the discussion on the design possibilities and significant issues surrounding LEDs in order to aid in the design and development of future LED sources and systems. Considerations such as total light output, physical size, optical control, power consumption, color appearance, and the effects of white LED spectra on glare and peripheral vision are explored. Finally, conclusions of the feasibility of current LED technology being used in these applications and recommendations of technology advancements that may need to occur are made.

Design and Performance of a Miniature Radar L-Band Transceiver

NASA Technical Reports Server (NTRS)

McWatters, D.; Price, D.; Edelstein, W.

2004-01-01

Radar electronics developed for past JPL space missions historically had been custom designed and as such, given budgetary, time, and risk constraints, had not been optimized for maximum flexibility or miniaturization. To help reduce cost and risk of future radar missions, a generic radar module was conceived. The module includes a 1.25-GHz (L-band) transceiver and incorporates miniature high-density packaging of integrated circuits in die/chip form. The technology challenges include overcoming the effect of miniaturization and high packaging density to achieve the performance, reliability, and environmental ruggedness required for space missions. The module was chosen to have representative (generic) functionality most likely required from an L-band radar. For very large aperture phased-array spaceborne radar missions, the large dimensions of the array suggest the benefit of distributing the radar electronics into the antenna array. For such applications, this technology is essential in order to bring down the cost, mass, and power of the radar electronics module replicated in each panel of the array. For smaller sized arrays, a single module can be combined with the central radar controller and still provide the bene.ts of configuration .exibility, low power, and low mass. We present the design approach for the radar electronics module and the test results for its radio frequency (RF) portion: a miniature, low-power, radiation-hard L-band transceiver.

Technological substitution: the potential of plastic as primary packaging material in the US brewing industry

DOE Office of Scientific and Technical Information (OSTI.GOV)

Roeleveld, J.J.

1985-01-01

This dissertation develops a general model of technological substitution that could be of help to planners and decision makers in industry who are faced with the problems created by continual technological change. The model as presented differs from existing models in the theoretical literature because of its emphasis on analyzing current and potential technologies in an attempt to understand the underlying factors contributing to technological substitution. The general model and the cost model that is part of it belong to that step in the interactive planning cycle called the formulation of the mess. The methodology underlying the cost model ismore » a combination of life-cycle analysis (i.e., from raw materials in nature, through all intermediate products, to waste returned to the environment) and resoumetrics, which is an engineering approach to measuring all physical inputs required to produce a certain level of output. The models are illustrated with a specific field of interest: substitution of primary packaging technologies in the US brewing industry. The physical costs of packaging beer in different containers are compared. Strategic considerations for a brewery deciding to adopt plastic packaging technology are discussed. Attention is given to another potential fruitful application of the model in the field of technology transfer to developing countries.« less

The Learning of Compost Practice in University

NASA Astrophysics Data System (ADS)

Agustina, T. W.; Rustaman, N. Y.; Riandi; Purwianingsih, W.

2017-09-01

The compost as one of the topics of the Urban Farming Movement in Bandung city, Indonesia. The preliminary study aims to obtain a description of the performance capabilities and compost products made by students with STREAM (Science-Technology-Religion-Art-Mathematics) approach. The method was explanatory sequential mixed method. The study was conducted on one class of Biology Education students at the one of the universities in Bandung, Indonesia. The sample was chosen purposively with the number of students as many as 44 people. The instruments were making Student Worksheets, Observation Sheets of Performance and Product Assessment, Rubric of Performance and Product, and Field Notes. The indicators of performance assessment rubrics include Stirring of Compost Materials and Composting Technology in accordance with the design. The product assessment rubric are a Good Composting Criteria and Compost Packaging. The result of can be stated most students have good performance. However, the ability to design of compost technology, compost products and the ability to pack compost are still lacking. The implication of study is students of Biology Education require habituation in the ability of designing technology.

TYPE A FISSILE PACKAGING FOR AIR TRANSPORT PROJECT OVERVIEW

DOE Office of Scientific and Technical Information (OSTI.GOV)

Eberl, K.; Blanton, P.

2013-10-11

This paper presents the project status of the Model 9980, a new Type A fissile packaging for use in air transport. The Savannah River National Laboratory (SRNL) developed this new packaging to be a light weight (<150-lb), drum-style package and prepared a Safety Analysis for Packaging (SARP) for submission to the DOE/EM. The package design incorporates unique features and engineered materials specifically designed to minimize packaging weight and to be in compliance with 10CFR71 requirements. Prototypes were fabricated and tested to evaluate the design when subjected to Normal Conditions of Transport (NCT) and Hypothetical Accident Conditions (HAC). An overview ofmore » the design details, results of the regulatory testing, and lessons learned from the prototype fabrication for the 9980 will be presented.« less

Interfacing with an EVA Suit

NASA Technical Reports Server (NTRS)

Ross, Amy

2011-01-01

A NASA spacesuit under the EVA Technology Domain consists of a suit system; a PLSS; and a Power, Avionics, and Software (PAS) system. Ross described the basic functions, components, and interfaces of the PLSS, which consists of oxygen, ventilation, and thermal control subsystems; electronics; and interfaces. Design challenges were reviewed from a packaging perspective. Ross also discussed the development of the PLSS over the last two decades.

Design of electrostatically levitated micromachined rotational gyroscope based on UV-LIGA technology

NASA Astrophysics Data System (ADS)

Cui, Feng; Chen, Wenyuan; Su, Yufeng; Zhang, Weiping; Zhao, Xiaolin

2004-12-01

The prevailing micromachined vibratory gyroscope typically has a proof mass connected to the substrate by a mechanical suspension system, which makes it face a tough challenge to achieve tactical or inertial grade performance levels. With a levitated rotor as the proof mass, a micromachined rotational gyroscope will potentially have higher performance than vibratory gyroscope. Besides working as a moment rebalance dual-axis gyroscope, the micromachined rotational gyroscope based on a levitated rotor can simultaneously work as a force balance tri-axis accelerometer. Micromachined rotational gyroscope based on an electrostatically levitated silicon micromachined rotor has been notably developed. In this paper, factors in designing a rotational gyro/accelerometer based on an electrostatically levitated disc-like rotor, including gyroscopic action of micro rotor, methods of stable levitation, micro displacement detection and control, rotation drive and speed control, vacuum packaging and microfabrication, are comprehensively considered. Hence a design of rotational gyro/accelerometer with an electroforming nickel rotor employing low cost UV-LIGA technology is presented. In this design, a wheel-like flat rotor is proposed and its basic dimensions, diameter and thickness, are estimated according to the required loading capability. Finally, its micromachining methods based on UV-LIGA technology and assembly technology are discussed.

Technology for low cost solid rocket boosters.

NASA Technical Reports Server (NTRS)

Ciepluch, C.

1971-01-01

A review of low cost large solid rocket motors developed at the Lewis Research Center is given. An estimate is made of the total cost reduction obtainable by incorporating this new technology package into the rocket motor design. The propellant, case material, insulation, nozzle ablatives, and thrust vector control are discussed. The effect of the new technology on motor cost is calculated for a typical expandable 260-in. booster application. Included in the cost analysis is the influence of motor performance variations due to specific impulse and weight changes. It is found for this application that motor costs may be reduced by up to 30% and that the economic attractiveness of future large solid rocket motors will be improved when the new technology is implemented.

LSST (Hoop/Column) Maypole Antenna Development Program, phase 1, part 1

NASA Technical Reports Server (NTRS)

Sullivan, M. R.

1982-01-01

The first of a two-phase program was performed to develop the technology necessary to evaluate, design, manufacture, package, transport and deploy the hoop/column deployable antenna reflector by means of a ground based program. The hoop/column concept consists of a cable stiffened large diameter hoop and central column structure that supports and contours a radio frequency reflective mesh surface. Mission scenarios for communications, radiometer and radio astronomy, were studied. The data to establish technology drivers that resulted in a specification of a point design was provided. The point design is a multiple beam quadaperture offset antenna system wich provides four separate offset areas of illumination on a 100 meter diameter symmetrical parent reflector. The periphery of the reflector is a hoop having 48 segments that articulate into a small stowed volume around a center extendable column. The hoop and column are structurally connected by graphite and quartz cables. The prominence of cables in the design resulted in the development of advanced cable technology. Design verification models were built of the hoop, column, and surface stowage subassemblies. Model designs were generated for a half scale sector of the surface and a 1/6 scale of the complete deployable reflector.

26 CFR 1.263(a)-4 - Amounts paid to acquire or create intangibles.

Code of Federal Regulations, 2010 CFR

2010-04-01

...). (v) Creation of package design. Amounts paid to develop a package design are treated as amounts that...). For purposes of this section, the term package design means the specific graphic arrangement or design... design of a container with respect to its shape or function. (4) Coordination with other provisions of...

The Space Technology-7 Disturbance Reduction System Precision Control Flight Validation Experiment Control System Design

NASA Technical Reports Server (NTRS)

O'Donnell, James R.; Hsu, Oscar C.; Maghami, Peirman G.; Markley, F. Landis

2006-01-01

As originally proposed, the Space Technology-7 Disturbance Reduction System (DRS) project, managed out of the Jet Propulsion Laboratory, was designed to validate technologies required for future missions such as the Laser Interferometer Space Antenna (LISA). The two technologies to be demonstrated by DRS were Gravitational Reference Sensors (GRSs) and Colloidal MicroNewton Thrusters (CMNTs). Control algorithms being designed by the Dynamic Control System (DCS) team at the Goddard Space Flight Center would control the spacecraft so that it flew about a freely-floating GRS test mass, keeping it centered within its housing. For programmatic reasons, the GRSs were descoped from DRS. The primary goals of the new mission are to validate the performance of the CMNTs and to demonstrate precise spacecraft position control. DRS will fly as a part of the European Space Agency (ESA) LISA Pathfinder (LPF) spacecraft along with a similar ESA experiment, the LISA Technology Package (LTP). With no GRS, the DCS attitude and drag-free control systems make use of the sensor being developed by ESA as a part of the LTP. The control system is designed to maintain the spacecraft s position with respect to the test mass, to within 10 nm/the square root of Hz over the DRS science frequency band of 1 to 30 mHz.

Development of an Open Source, Air-Deployable Weather Station

NASA Astrophysics Data System (ADS)

Krejci, A.; Lopez Alcala, J. M.; Nelke, M.; Wagner, J.; Udell, C.; Higgins, C. W.; Selker, J. S.

2017-12-01

We created a packaged weather station intended to be deployed in the air on tethered systems. The device incorporates lightweight sensors and parts and runs for up to 24 hours off of lithium polymer batteries, allowing the entire package to be supported by a thin fiber. As the fiber does not provide a stable platform, additional data (pitch and roll) from typical weather parameters (e.g. temperature, pressure, humidity, wind speed, and wind direction) are determined using an embedded inertial motion unit. All designs are open sourced including electronics, CAD drawings, and descriptions of assembly and can be found on the OPEnS lab website at http://www.open-sensing.org/lowcost-weather-station/. The Openly Published Environmental Sensing Lab (OPEnS: Open-Sensing.org) expands the possibilities of scientific observation of our Earth, transforming the technology, methods, and culture by combining open-source development and cutting-edge technology. New OPEnS labs are now being established in India, France, Switzerland, the Netherlands, and Ghana.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Ferraioli, Luigi; Hueller, Mauro; Vitale, Stefano

The scientific objectives of the LISA Technology Package experiment on board of the LISA Pathfinder mission demand accurate calibration and validation of the data analysis tools in advance of the mission launch. The level of confidence required in the mission outcomes can be reached only by intensively testing the tools on synthetically generated data. A flexible procedure allowing the generation of a cross-correlated stationary noise time series was set up. A multichannel time series with the desired cross-correlation behavior can be generated once a model for a multichannel cross-spectral matrix is provided. The core of the procedure comprises a noisemore » coloring, multichannel filter designed via a frequency-by-frequency eigendecomposition of the model cross-spectral matrix and a subsequent fit in the Z domain. The common problem of initial transients in a filtered time series is solved with a proper initialization of the filter recursion equations. The noise generator performance was tested in a two-dimensional case study of the closed-loop LISA Technology Package dynamics along the two principal degrees of freedom.« less

A CTE matched hard solder passively cooled laser diode package combined with nXLT facet passivation enables high power, high reliability operation

NASA Astrophysics Data System (ADS)

Hodges, Aaron; Wang, Jun; DeFranza, Mark; Liu, Xingsheng; Vivian, Bill; Johnson, Curt; Crump, Paul; Leisher, Paul; DeVito, Mark; Martinsen, Robert; Bell, Jacob

2007-04-01

A conductively cooled laser diode package design with hard AuSn solder and CTE matched sub mount is presented. We discuss how this platform eliminates the failure mechanisms associated with indium solder. We present the problem of catastrophic optical mirror damage (COMD) and show that nLight's nXLT TM facet passivation technology effectively eliminates facet defect initiated COMD as a failure mechanism for both single emitter and bar format laser diodes. By combining these technologies we have developed a product that has high reliability at high powers, even at increased operation temperatures. We present early results from on-going accelerated life testing of this configuration that suggests an 808nm, 30% fill factor device will have a MTTF of more than 21khrs at 60W CW, 25°C operating conditions and a MTTF of more than 6.4khrs when operated under hard pulsed (1 second on, 1 second off) conditions.

Ultramicrowave communications system, phase 2

NASA Technical Reports Server (NTRS)

1980-01-01

Communications system design was completed and reviewed. Minor changes were made in order to make it more cost effective and to increase design flexibility. System design activities identified the techniques and procedures to generate and monitor high data rate test signals. Differential bi-phase demodulation is the proposed method for this system. The mockup and packaging designs were performed, and component layout and interconnection constraints were determined, as well as design drawings for dummy parts of the system. The possibility of adding a low cost option to the transceiver system was studied. The communications program has the advantage that new technology signal processing devices can be readily interfaced with the existing radio frequency subsystem to produce a short range radar.

High power vertical stacked and horizontal arrayed diode laser bar development based on insulation micro-channel cooling (IMCC) and hard solder bonding technology

NASA Astrophysics Data System (ADS)

Wang, Boxue; Jia, Yangtao; Zhang, Haoyu; Jia, Shiyin; Liu, Jindou; Wang, Weifeng; Liu, Xingsheng

2018-02-01

An insulation micro-channel cooling (IMCC) has been developed for packaging high power bar-based vertical stack and horizontal array diode lasers, which eliminates many issues caused in its congener packaged by commercial copper formed micro-channel cooler(MCC), such as coefficient of thermal expansion (CTE) mismatch between cooler and diode laser bar, high coolant quality requirement (DI water) and channel corrosion and electro-corrosion induced by DI water if the DI-water quality is not well maintained The IMCC cooler separates water flow route and electrical route, which allows tap-water as coolant without electro-corrosion and therefore prolongs cooler lifetime dramatically and escalated the reliability of these diode lasers. The thickness of ceramic and copper in an IMCC cooler is well designed to minimize the CTE mismatch between laser bar and cooler, consequently, a very low "SMILE" of the laser bar can be achieved for small fast axis divergence after collimation. In additional, gold-tin hard solder bonding technology was also developed to minimize the risk of solder electromigration at high current density and thermal fatigue under hard-pulse operation mode. Testing results of IMCC packaged diode lasers are presented in this report.

Seismic waveform modeling over cloud

NASA Astrophysics Data System (ADS)

Luo, Cong; Friederich, Wolfgang

2016-04-01

With the fast growing computational technologies, numerical simulation of seismic wave propagation achieved huge successes. Obtaining the synthetic waveforms through numerical simulation receives an increasing amount of attention from seismologists. However, computational seismology is a data-intensive research field, and the numerical packages usually come with a steep learning curve. Users are expected to master considerable amount of computer knowledge and data processing skills. Training users to use the numerical packages, correctly access and utilize the computational resources is a troubled task. In addition to that, accessing to HPC is also a common difficulty for many users. To solve these problems, a cloud based solution dedicated on shallow seismic waveform modeling has been developed with the state-of-the-art web technologies. It is a web platform integrating both software and hardware with multilayer architecture: a well designed SQL database serves as the data layer, HPC and dedicated pipeline for it is the business layer. Through this platform, users will no longer need to compile and manipulate various packages on the local machine within local network to perform a simulation. By providing users professional access to the computational code through its interfaces and delivering our computational resources to the users over cloud, users can customize the simulation at expert-level, submit and run the job through it.

High-pressure processing and antimicrobial biodegradable packaging to control Listeria monocytogenes during storage of cooked ham.

PubMed

Marcos, Begonya; Aymerich, Teresa; Monfort, Josep M; Garriga, Margarita

2008-02-01

The efficiency of combining high-pressure processing (HPP) and active packaging technologies to control Listeria monocytogenes growth during the shelf life of artificially inoculated cooked ham was assessed. Three lots of cooked ham were prepared: control, packaging with alginate films, and packaging with antimicrobial alginate films containing enterocins. After packaging, half of the samples were pressurized. Sliced cooked ham stored at 6 degrees C experienced a quick growth of L. monocytogenes. Both antimicrobial packaging and pressurization delayed the growth of the pathogen. However, at 6 degrees C the combination of antimicrobial packaging and HPP was necessary to achieve a reduction of inoculated levels without recovery during 60 days of storage. Further storage at 6 degrees C of pressurized antimicrobial packed cooked ham resulted in L. monocytogenes levels below the detection limit (day 90). On the other hand, storage at 1 degrees C controlled the growth of the pathogen until day 39 in non-pressurized ham, while antimicrobial packaging and storage at 1 degrees C exerted a bacteriostatic effect for 60 days. All HPP lots stored at 1 degrees C led to counts <100CFU/g at day 60. Similar results were observed when combining both technologies. After a cold chain break no growth of L. monocytogenes was observed in pressurized ham packed with antimicrobial films, showing the efficiency of combining both technologies.

Computer Design Technology of the Small Thrust Rocket Engines Using CAE / CAD Systems

NASA Astrophysics Data System (ADS)

Ryzhkov, V.; Lapshin, E.

2018-01-01

The paper presents an algorithm for designing liquid small thrust rocket engine, the process of which consists of five aggregated stages with feedback. Three stages of the algorithm provide engineering support for design, and two stages - the actual engine design. A distinctive feature of the proposed approach is a deep study of the main technical solutions at the stage of engineering analysis and interaction with the created knowledge (data) base, which accelerates the process and provides enhanced design quality. The using multifunctional graphic package Siemens NX allows to obtain the final product -rocket engine and a set of design documentation in a fairly short time; the engine design does not require a long experimental development.

Introducing Current Technologies

NASA Technical Reports Server (NTRS)

Mitchell, Tiffany

1995-01-01

The objective of the study was a continuation of the 'technology push' activities that the Technology Transfer Team conducts at this time. It was my responsibility to research current technologies at Langley Research Center and find a commercial market for these technologies in the private industry. After locating a market for the technologies, a mailing package was put together which informed the companies of the benefits of NASA Langley's technologies. The mailing package included articles written about the technology, patent material, abstracts from technical papers, and one-pagers which were used at the Technology Opportunities Showcase (TOPS) exhibitions. The companies were encouraged to consult key team members for further information on the technologies.

Fecundity of Tribolium castaneum and Tribolium confusum adults after exposure to deltamethrin packaging

USDA-ARS?s Scientific Manuscript database

The red flour beetle, Tribolium castaneum (Herbst), and the confused flour beetle, Tribolium confusum Jacquelin du Val, are packaging invaders and will exploit any rip, tear, or defect in packaged food and infest the contents. Impregnating packaging materials with insecticides is a novel technologic...

Japan's electronic packaging technologies

NASA Technical Reports Server (NTRS)

Tummala, Rao R.; Pecht, Michael

1995-01-01

The JTEC panel found Japan to have significant leadership over the United States in the strategic area of electronic packaging. Many technologies and products once considered the 'heart and soul' of U.S. industry have been lost over the past decades to Japan and other Asian countries. The loss of consumer electronics technologies and products is the most notable of these losses, because electronics is the United States' largest employment sector and is critical for growth businesses in consumer products, computers, automobiles, aerospace, and telecommunications. In the past there was a distinction between consumer and industrial product technologies. While Japan concentrated on the consumer market, the United States dominated the industrial sector. No such distinction is anticipated in the future; the consumer-oriented technologies Japan has dominated are expected to characterize both domains. The future of U.S. competitiveness will, therefore, depend on the ability of the United States to rebuild its technological capabilities in the area of portable electronic packaging.

Space processing applications payload equipment study. Volume 2E: Commercial equipment utility

NASA Technical Reports Server (NTRS)

Smith, A. G. (Editor)

1974-01-01

Examination of commercial equipment technologies revealed that the functional performance requirements of space processing equipment could generally be met by state-of-the-art design practices. Thus, an apparatus could be evolved from a standard item or derived by custom design using present technologies. About 15 percent of the equipment needed has no analogous commercial base of derivation and requires special development. This equipment is involved primarily with contactless heating and position control. The derivation of payloads using commercial equipment sources provides a broad and potentially cost-effective base upon which to draw. The derivation of payload equipment from commercial technologies poses other issues beyond that of the identifiable functional performance, but preliminary results on testing of selected equipment testing appear quite favorable. During this phase of the SPA study, several aspects of commercial equipment utility were assessed and considered. These included safety, packaging and structural, power conditioning (electrical/electronic), thermal and materials of construction.

Engineering design: A powerful influence on the business success on manufacturing industry

NASA Astrophysics Data System (ADS)

Coplin, John F.

1990-08-01

Engineering design, one of the most powerful forces in producing a package which matches market need, is discussed. It is essentially a detailed planning process backed by analysis and demonstration. The need for innovation to achieve competitive edge and profitability is considered. Innovation contains risk which must be controlled before substantial investment is made. The high rate of change of technology gives rise to the need for good training and retraining. Benefits which offsets costs at the time of occurring that cost are reached.

Exploring new packaging and delivery options for the immunization supply chain.

PubMed

Zehrung, Darin; Jarrahian, Courtney; Giersing, Birgitte; Kristensen, Debra

2017-04-19

A variety of vaccine packaging and delivery technologies may benefit the immunization supply chain. These include alternative primary packaging, such as blow-fill-seal polymer containers, and novel delivery technologies, such intradermal delivery devices, microarray patches, and sublingual formulations of vaccines, and others in development. The potential timeline to availability of these technologies varies and depends on their stage of development and the type of data necessary to achieve licensure. Some new delivery devices are anticipated to be introduced in 2017, such as intradermal devices for delivery of inactivated poliovirus vaccine to stretch vaccine supplies due to a supply limitation. Other new technologies requiring vaccine reformulation, such as microarray patches and sublingual vaccines, may become available in the long term (2021 and beyond). Development of many new technologies requires partnership between vaccine and technology manufacturers and identification of the applicable regulatory pathway. Interaction with public-sector stakeholders early on (through engagement with forums such as the World Health Organization's Immunization Practices Advisory Committee Delivery Technologies Working Group) is important to ensure suitability for immunization program use. Key considerations for programmatic suitability of a new vaccine, packaging, and delivery device include cold chain volume, costs, and health impact. Copyright © 2017 The Authors. Published by Elsevier Ltd.. All rights reserved.

Robust optical sensors for safety critical automotive applications

NASA Astrophysics Data System (ADS)

De Locht, Cliff; De Knibber, Sven; Maddalena, Sam

2008-02-01

Optical sensors for the automotive industry need to be robust, high performing and low cost. This paper focuses on the impact of automotive requirements on optical sensor design and packaging. Main strategies to lower optical sensor entry barriers in the automotive market include: Perform sensor calibration and tuning by the sensor manufacturer, sensor test modes on chip to guarantee functional integrity at operation, and package technology is key. As a conclusion, optical sensor applications are growing in automotive. Optical sensor robustness matured to the level of safety critical applications like Electrical Power Assisted Steering (EPAS) and Drive-by-Wire by optical linear arrays based systems and Automated Cruise Control (ACC), Lane Change Assist and Driver Classification/Smart Airbag Deployment by camera imagers based systems.

Automated platform for determination of LEDs spatial radiation pattern

NASA Astrophysics Data System (ADS)

Vladescu, Marian; Vuza, Dan Tudor

2015-02-01

Nowadays technologies lead to remarkable properties of the light-emitting diodes (LEDs), making them attractive for more and more applications, such as: interior and exterior lighting, outdoor LED panels, traffic signals, automotive (tail and brake lights, backlighting in dashboard and switches), backlighting of display panels, LCD displays, symbols on switches, keyboards, graphic boards and measuring scales. Usually, LEDs are small light sources consisting of a chip placed into a package, which may bring additional optics to this encapsulated ensemble, resulting in a less or more complex spatial distribution of the light intensity, with particular radiation patterns. This paper presents an automated platform designed to allow a quick and accurate determination of the spatial radiation patterns of LEDs encapsulated in various packages. Keywords: LED, luminous

Packaging of electronic modules

NASA Technical Reports Server (NTRS)

Katzin, L.

1966-01-01

Study of design approaches that are taken toward optimizing the packaging of electronic modules with respect to size, shape, component orientation, interconnections, and structural support. The study does not present a solution to specific packaging problems, but rather the factors to be considered to achieve optimum packaging designs.

Automated space processing payloads study. Volume 3: Equipment development resource requirements. [instrument packages and the space shuttles

NASA Technical Reports Server (NTRS)

1975-01-01

Facilities are described on which detailed preliminary design was undertaken and which may be used on early space shuttle missions in the 1979-1982 time-frame. The major hardware components making up each facility are identified, and development schedules for the major hardware items and the payload buildup are included. Cost data for the facilities, and the assumptions and ground rules supporting these data are given along with a recommended listing of supporting research and technology needed to ensure confidence in the ability to achieve successful development of the equipment and technology.

Advanced flight computer. Special study

NASA Technical Reports Server (NTRS)

Coo, Dennis

1995-01-01

This report documents a special study to define a 32-bit radiation hardened, SEU tolerant flight computer architecture, and to investigate current or near-term technologies and development efforts that contribute to the Advanced Flight Computer (AFC) design and development. An AFC processing node architecture is defined. Each node may consist of a multi-chip processor as needed. The modular, building block approach uses VLSI technology and packaging methods that demonstrate a feasible AFC module in 1998 that meets that AFC goals. The defined architecture and approach demonstrate a clear low-risk, low-cost path to the 1998 production goal, with intermediate prototypes in 1996.

Additional security features for optically variable foils

NASA Astrophysics Data System (ADS)

Marshall, Allan C.; Russo, Frank

1998-04-01

For thousands of years, man has exploited the attraction and radiance of pure gold to adorn articles of great significance. Today, designers decorate packaging with metallic gold foils to maintain the prestige of luxury items such as perfumes, chocolates, wine and whisky, and to add visible appeal and value to wide range of products. However, today's products do not call for the hand beaten gold leaf of the Ancient Egyptians, instead a rapid production technology exists which makes use of accurately coated thin polymer films and vacuum deposited metallic layers. Stamping Foils Technology is highly versatile since several different layers may be combined into one product, each providing a different function. Not only can a foil bring visual appeal to an article, it can provide physical and chemical resistance properties and also protect an article from human forms of interference, such as counterfeiting, copying or tampering. Stamping foils have proved to be a highly effective vehicle for applying optical devices to items requiring this type of protection. Credit cards, bank notes, personal identification documents and more recently high value packaged items such as software and perfumes are protected by optically variable devices applied using stamping foil technology.

NASA's 3D Flight Computer for Space Applications

NASA Technical Reports Server (NTRS)

Alkalai, Leon

2000-01-01

The New Millennium Program (NMP) Integrated Product Development Team (IPDT) for Microelectronics Systems was planning to validate a newly developed 3D Flight Computer system on its first deep-space flight, DS1, launched in October 1998. This computer, developed in the 1995-97 time frame, contains many new computer technologies previously never used in deep-space systems. They include: advanced 3D packaging architecture for future low-mass and low-volume avionics systems; high-density 3D packaged chip-stacks for both volatile and non-volatile mass memory: 400 Mbytes of local DRAM memory, and 128 Mbytes of Flash memory; high-bandwidth Peripheral Component Interface (Per) local-bus with a bridge to VME; high-bandwidth (20 Mbps) fiber-optic serial bus; and other attributes, such as standard support for Design for Testability (DFT). Even though this computer system did not complete on time for delivery to the DS1 project, it was an important development along a technology roadmap towards highly integrated and highly miniaturized avionics systems for deep-space applications. This continued technology development is now being performed by NASA's Deep Space System Development Program (also known as X2000) and within JPL's Center for Integrated Space Microsystems (CISM).

Power Electronics Packaging Reliability | Transportation Research | NREL

Science.gov Websites

interface materials, are a key enabling technology for compact, lightweight, low-cost, and reliable power , reliability, and cost. High-temperature bonded interface materials are an important facilitating technology for compact, lightweight, low-cost, reliable power electronics packaging that fully utilizes the

Design Optimization Toolkit: Users' Manual

DOE Office of Scientific and Technical Information (OSTI.GOV)

Aguilo Valentin, Miguel Alejandro

The Design Optimization Toolkit (DOTk) is a stand-alone C++ software package intended to solve complex design optimization problems. DOTk software package provides a range of solution methods that are suited for gradient/nongradient-based optimization, large scale constrained optimization, and topology optimization. DOTk was design to have a flexible user interface to allow easy access to DOTk solution methods from external engineering software packages. This inherent flexibility makes DOTk barely intrusive to other engineering software packages. As part of this inherent flexibility, DOTk software package provides an easy-to-use MATLAB interface that enables users to call DOTk solution methods directly from the MATLABmore » command window.« less

Performance Stability of Silicone Oxide-Coated Plastic Parenteral Vials.

PubMed

Weikart, Christopher M; Pantano, Carlo G; Shallenberger, Jeff R

2017-01-01

A new packaging system was developed for parenteral pharmaceuticals that combines the best attributes of plastic and glass without their respective drawbacks. This technological advancement is based on the synergy between high-precision injection-molded plastics and plasma coating technology. The result is a shatter-resistant, optically clear, low-particulate, and chemically durable packaging system. The demand for this product is driven by the expanding market, regulatory constraints, and product recalls for injectable drugs and biologics packaged in traditional glass materials. It is shown that this new packaging system meets or exceeds the important performance characteristics of glass, especially in eliminating the glass delamination and breakage that has been observed in many products. The new packaging system is an engineered, multilayer, glass-coated plastic composite that provides a chemically stable contact surface and oxygen barrier performance that exceeds a 2 year shelf life requirement. Evaluation of the coating system characteristics and performance stability to chemical, temperature, and mechanical extremes are reported herein. LAY ABSTRACT: A new packaging system for parenteral pharmaceuticals was developed that combines the best attributes of plastic and glass without their respective drawbacks. This technological advancement is based on the synergy between high-precision injection-molded plastics and plasma coating technology. The result is a shatter-resistant, optically clear, low-particulate, and chemically durable packaging system. It is shown that this new packaging system meets or exceeds the important performance characteristics of glass, especially in eliminating the glass delamination and breakage that has been observed in many products. The new packaging system is an engineered, multilayer, glass-coated plastic composite that provides a chemically stable contact surface and oxygen barrier performance that exceeds a 2 year shelf life requirement. Evaluation of the coating system characteristics and performance stability to chemical, temperature, and mechanical extremes are reported herein. © PDA, Inc. 2017.

PhenStat | Informatics Technology for Cancer Research (ITCR)

Cancer.gov

PhenStat is a freely available R package that provides a variety of statistical methods for the identification of phenotypic associations from model organisms developed for the International Mouse Phenotyping Consortium (IMPC at www.mousephenotype.org ). The methods have been developed for high throughput phenotyping pipelines implemented across various experimental designs with an emphasis on managing temporal variation and is being adapted for analysis with PDX mouse strains.

Applying satellite technology to energy and mineral exploration

USGS Publications Warehouse

Carter, William D.; Rowan, Lawrence C.

1978-01-01

IGCP Project 143 ("Remote Sensing and Mineral Exploration"), is a worldwide research project designed to make satellite data an operational geological tool along with the geologic pick, hand lens, topographic map, aerial photo and geophysical instruments and data that comprise the exploration package. While remote sensing data will not replace field exploration and mapping, careful study of such data prior to field work should make the effort more efficient.

Potential and challenges of body area networks for cardiac monitoring.

PubMed

Gyselinckx, Bert; Penders, Julien; Vullers, Ruud

2007-01-01

This article gives an overview of results of the Human++ research program related to cardiac monitoring (http://www.imec-nl.nl/). This research aims to achieve highly miniaturized and nearly autonomous sensor systems that assist our health and comfort. It combines expertise in wireless ultra-low-power communications, packaging and 3D integration technologies, Micro Electro Mechanical Systems (MEMS) energy scavenging techniques, and low-power design techniques.

Development of beam leaded low power logic circuits

NASA Technical Reports Server (NTRS)

Smith, B. W.; Malone, F.

1972-01-01

The technologies of low power TTL and beam lead processing were merged into a single product family. This family offers the power and thermal advantages of low power(54L), while providing the additional reliability advantages of beam leads. The reduction in the power and heat levels also allows the system designer to take advantage, through beam lead, multichip assemblies, of increased package density to reduce system size and weight.

Thermal anomalies of the transmitter experiment package on the communications technology satellite

NASA Technical Reports Server (NTRS)

Alexovich, R. E.; Curren, A. N.

1979-01-01

The causes of four temporary thermal-control-system malfunctions that gave rise to unexpected temperature excursions in the 12-gigahertz, 200-watt transmitter experiment package (TEP) on the Communications Technology Satellite were investigated. The TEP consists of a nominal 200-watt output stage tube (OST), a supporting power-processing system (PPS), and a variable-conductance heat-pipe system (VCHPS). The VCHPS, which uses three heat pipes to conduct heat from the body of the OST to a radiator fin, was designed to maintain the TEP at safe operating temperatures at all operating conditions. On four occasions during 1977, all near the spring and fall equinoxes, the OST body temperature and related temperatures displayed sudden, rapid, and unexpected rises above normal levels while the TEP was operating at essentially constant, normal conditions. The temperature excursions were terminated without TEP damage by reducing the radio frequency (RF) output power of the OST. Between the anomalies and since the fourth, the thermal control system has apparently functioned as designed. The results indicate the most probable cause of the temperature anomalies is depriming of the arteries in the variable-conductance heat pipes. A mode was identified in which the TEP, as presently configured, may operate with stable temperatures and with minimum change in performance level.

Technology for Space Station Evolution. Executive summary and overview

NASA Technical Reports Server (NTRS)

1990-01-01

NASA's Office of Aeronautics and Space Technology (OAST) conducted a workshop on technology for space station evolution 16-19 Jan. 1990. The purpose of this workshop was to collect and clarify Space Station Freedom technology requirements for evolution and to describe technologies that can potentially fill those requirements. These proceedings are organized into an Executive Summary and Overview and five volumes containing the technology discipline presentations. The Executive Summary and Overview contains an executive summary for the workshop, the technology discipline summary packages, and the keynote address. The executive summary provides a synopsis of the events and results of the workshop and the technology discipline summary packages.

Advanced Packaging Materials and Techniques for High Power TR Module: Standard Flight vs. Advanced Packaging

NASA Technical Reports Server (NTRS)

Hoffman, James Patrick; Del Castillo, Linda; Miller, Jennifer; Jenabi, Masud; Hunter, Donald; Birur, Gajanana

2011-01-01

The higher output power densities required of modern radar architectures, such as the proposed DESDynI [Deformation, Ecosystem Structure, and Dynamics of Ice] SAR [Synthetic Aperture Radar] Instrument (or DSI) require increasingly dense high power electronics. To enable these higher power densities, while maintaining or even improving hardware reliability, requires advances in integrating advanced thermal packaging technologies into radar transmit/receive (TR) modules. New materials and techniques have been studied and compared to standard technologies.

7 CFR Exhibit D to Subpart B of... - Designated Counties for Housing Application Packaging Grants

Code of Federal Regulations, 2010 CFR

2010-01-01

... 7 Agriculture 13 2010-01-01 2009-01-01 true Designated Counties for Housing Application Packaging... Application Packaging Grants Pt. 1944, Subpt. B, Exh. D Exhibit D to Subpart B of Part 1944—Designated Counties for Housing Application Packaging Grants ER25my05.036 ER25my05.037 ER25my05.038 ER25my05.039 [70...

High-Payoff Space Transportation Design Approach with a Technology Integration Strategy

NASA Technical Reports Server (NTRS)

McCleskey, C. M.; Rhodes, R. E.; Chen, T.; Robinson, J.

2011-01-01

A general architectural design sequence is described to create a highly efficient, operable, and supportable design that achieves an affordable, repeatable, and sustainable transportation function. The paper covers the following aspects of this approach in more detail: (1) vehicle architectural concept considerations (including important strategies for greater reusability); (2) vehicle element propulsion system packaging considerations; (3) vehicle element functional definition; (4) external ground servicing and access considerations; and, (5) simplified guidance, navigation, flight control and avionics communications considerations. Additionally, a technology integration strategy is forwarded that includes: (a) ground and flight test prior to production commitments; (b) parallel stage propellant storage, such as concentric-nested tanks; (c) high thrust, LOX-rich, LOX-cooled first stage earth-to-orbit main engine; (d) non-toxic, day-of-launch-loaded propellants for upper stages and in-space propulsion; (e) electric propulsion and aero stage control.

Modeling and MBL: Software Tools for Science.

ERIC Educational Resources Information Center

Tinker, Robert F.

Recent technological advances and new software packages put unprecedented power for experimenting and theory-building in the hands of students at all levels. Microcomputer-based laboratory (MBL) and model-solving tools illustrate the educational potential of the technology. These tools include modeling software and three MBL packages (which are…

Predicting visual attention to nutrition information on food products: the influence of motivation and ability.

PubMed

Turner, Monique Mitchell; Skubisz, Christine; Pandya, Sejal Patel; Silverman, Meryl; Austin, Lucinda L

2014-09-01

Obesity is linked to numerous diseases including heart disease, diabetes, and cancer. To address this issue, food and beverage manufacturers as well as health organizations have developed nutrition symbols and logos to be placed on the front of food packages to guide consumers to more healthful food choices. In 2010, the U.S. Food and Drug Administration requested information on the extent to which consumers notice, use, and understand front-of-package nutrition symbols. In response, this study used eye-tracking technology to explore the degree to which people pay visual attention to the information contained in food nutrition labels and front-of-package nutrition symbols. Results indicate that people with motivation to shop for healthful foods spent significantly more time looking at all available nutrition information compared to people with motivation to shop for products on the basis of taste. Implications of these results for message design, food labeling, and public policy are discussed.

Component-based integration of chemistry and optimization software.

PubMed

Kenny, Joseph P; Benson, Steven J; Alexeev, Yuri; Sarich, Jason; Janssen, Curtis L; McInnes, Lois Curfman; Krishnan, Manojkumar; Nieplocha, Jarek; Jurrus, Elizabeth; Fahlstrom, Carl; Windus, Theresa L

2004-11-15

Typical scientific software designs make rigid assumptions regarding programming language and data structures, frustrating software interoperability and scientific collaboration. Component-based software engineering is an emerging approach to managing the increasing complexity of scientific software. Component technology facilitates code interoperability and reuse. Through the adoption of methodology and tools developed by the Common Component Architecture Forum, we have developed a component architecture for molecular structure optimization. Using the NWChem and Massively Parallel Quantum Chemistry packages, we have produced chemistry components that provide capacity for energy and energy derivative evaluation. We have constructed geometry optimization applications by integrating the Toolkit for Advanced Optimization, Portable Extensible Toolkit for Scientific Computation, and Global Arrays packages, which provide optimization and linear algebra capabilities. We present a brief overview of the component development process and a description of abstract interfaces for chemical optimizations. The components conforming to these abstract interfaces allow the construction of applications using different chemistry and mathematics packages interchangeably. Initial numerical results for the component software demonstrate good performance, and highlight potential research enabled by this platform.

Compact, Engineered, 2-Micron Coherent Doppler Wind Lidar Prototype: A New NASA Instrument Incubator Program Project

NASA Technical Reports Server (NTRS)

Kavaya, Michael J.; Koch, Grady J.; Yu, Jirong; Singh, Upendra N.; Amzajerdian, Farzin; Wang, Jinxue; Petros, Mulugeta

2005-01-01

A new project, selected in 2005 by NASA s Science Mission Directorate (SMD) under the Instrument Incubator Program (IIP), will be described. The 3-year effort is intended to design, fabricate, and demonstrate a packaged, rugged, compact, space-qualifiable coherent Doppler wind lidar (DWL) transceiver capable of future validation in an aircraft and/or Unmanned Aerial Vehicle (UAV). The packaged DWL will utilize the numerous advances in pulsed, solid-state, 2-micron laser technology at NASA s Langley Research Center (LaRC) in such areas as crystal composition, architecture, efficiency, cooling techniques, pulse energy, and beam quality. The extensive experience of Raytheon Space and Airborne Systems (RSAS) in coherent lidar systems, in spacebased sensors, and in packaging rugged lidar systems will be applied to this project. The packaged transceiver will be as close to an envisioned space-based DWL system as the resources and technology readiness allow. We will attempt to facilitate a future upgrade to a coherent lidar system capable of simultaneous wind and CO2 concentration profile measurements. Since aerosol and dust concentration is also available from the lidar signal, the potential for a triple measurement lidar system is attractive for both Earth and Mars remote sensing. A key follow on step after the IIP will be to add a telescope, scanner, and software for aircraft validation. This IIP should also put us in a position to begin a parallel formulation study in the 2006-2007 timeframe for a space-based DWL demonstration mission early next decade.

Argillite And Crystalline Disposal Research: Accomplishments And Path-Forward.

DOE Office of Scientific and Technical Information (OSTI.GOV)

McMahon, Kevin A.; Jove-Colon, Carlos F.; Wang, Yifeng

The intention of this document is to provide a path-forward for research and development (R&D) for two host rock media-specific (argillite and crystalline) disposal research work packages within the Used Fuel Disposition Campaign (UFDC). The two work packages, Argillite Disposal R&D and Crystalline Disposal R&D, support the achievement of the overarching mission and objectives of the Department of Energy Office of Nuclear Energy Fuel Cycle Technologies Program. These two work packages cover many of the fundamental technical issues that will have multiple implications to other disposal research work packages by bridging knowledge gaps to support the development of the safetymore » case. The path-forward begins with the assumption of target dates that are set out in the January 2013 DOE Strategy for the Management and Disposal of Used Nuclear Fuel and High-Level Radioactive Waste (http://energy.gov/downloads/strategy-management-and-disposal-used-nuclear-fuel-and-high-levelradioactive- waste). The path-forward will be maintained as a living document and will be updated as needed in response to available funding and the progress of multiple R&D tasks in the Used Fuel Disposition Campaign and the Fuel Cycle Technologies Program. This path forward is developed based on the report of “Used Fuel Disposition Campaign Disposal Research and Development Roadmap (FCR&D-USED- 2011-000065 REV0)” (DOE, 2011). This document delineates the goals and objectives of the UFDC R&D program, needs for generic disposal concept design, and summarizes the prioritization of R&D issues.« less

DOE Office of Scientific and Technical Information (OSTI.GOV)

Radojcic, Riko; Nowak, Matt; Nakamoto, Mark

The status of the development of a Design-for-Stress simulation flow that captures the stress effects in packaged 3D-stacked Si products like integrated circuits (ICs) using advanced via-middle Through Si Via technology is outlined. The next set of challenges required to proliferate the methodology and to deploy it for making and dispositioning real Si product decisions are described here. These include the adoption and support of a Process Design Kit (PDK) that includes the relevant material properties, the development of stress simulation methodologies that operate at higher levels of abstraction in a design flow, and the development and adoption of suitablemore » models required to make real product reliability decisions.« less

DESIGN ANALYSIS FOR THE NAVAL SNF WASTE PACKAGE

DOE Office of Scientific and Technical Information (OSTI.GOV)

T.L. Mitchell

2000-05-31

The purpose of this analysis is to demonstrate the design of the naval spent nuclear fuel (SNF) waste package (WP) using the Waste Package Department's (WPD) design methodologies and processes described in the ''Waste Package Design Methodology Report'' (CRWMS M&O [Civilian Radioactive Waste Management System Management and Operating Contractor] 2000b). The calculations that support the design of the naval SNF WP will be discussed; however, only a sub-set of such analyses will be presented and shall be limited to those identified in the ''Waste Package Design Sensitivity Report'' (CRWMS M&O 2000c). The objective of this analysis is to describe themore » naval SNF WP design method and to show that the design of the naval SNF WP complies with the ''Naval Spent Nuclear Fuel Disposal Container System Description Document'' (CRWMS M&O 1999a) and Interface Control Document (ICD) criteria for Site Recommendation. Additional criteria for the design of the naval SNF WP have been outlined in Section 6.2 of the ''Waste Package Design Sensitivity Report'' (CRWMS M&O 2000c). The scope of this analysis is restricted to the design of the naval long WP containing one naval long SNF canister. This WP is representative of the WPs that will contain both naval short SNF and naval long SNF canisters. The following items are included in the scope of this analysis: (1) Providing a general description of the applicable design criteria; (2) Describing the design methodology to be used; (3) Presenting the design of the naval SNF waste package; and (4) Showing compliance with all applicable design criteria. The intended use of this analysis is to support Site Recommendation reports and assist in the development of WPD drawings. Activities described in this analysis were conducted in accordance with the technical product development plan (TPDP) ''Design Analysis for the Naval SNF Waste Package (CRWMS M&O 2000a).« less

Modelling, simulation and computer-aided design (CAD) of gyrotrons for novel applications in the high-power terahertz science and technologies

NASA Astrophysics Data System (ADS)

Sabchevski, S.; Idehara, T.; Damyanova, M.; Zhelyazkov, I.; Balabanova, E.; Vasileva, E.

2018-03-01

Gyrotrons are the most powerful sources of CW coherent radiation in the sub-THz and THz frequency bands. In recent years, they have demonstrated a remarkable potential for bridging the so-called THz-gap in the electromagnetic spectrum and opened the road to many novel applications of the terahertz waves. Among them are various advanced spectroscopic techniques (e.g., ESR and DNP-NMR), plasma physics and fusion research, materials processing and characterization, imaging and inspection, new medical technologies and biological studies. In this paper, we review briefly the current status of the research in this broad field and present our problem-oriented software packages developed recently for numerical analysis, computer-aided design (CAD) and optimization of gyrotrons.

Terahertz MMICs and Antenna-in-Package Technology at 300 GHz for KIOSK Download System

NASA Astrophysics Data System (ADS)

Tajima, Takuro; Kosugi, Toshihiko; Song, Ho-Jin; Hamada, Hiroshi; El Moutaouakil, Amine; Sugiyama, Hiroki; Matsuzaki, Hideaki; Yaita, Makoto; Kagami, Osamu

2016-12-01

Toward the realization of ultra-fast wireless communications systems, the inherent broad bandwidth of the terahertz (THz) band is attracting attention, especially for short-range instant download applications. In this paper, we present our recent progress on InP-based THz MMICs and packaging techniques based on low-temperature co-fibered ceramic (LTCC) technology. The transmitter MMICs are based on 80-nm InP-based high electron mobility transistors (HEMTs). Using the transmitter packaged in an E-plane split-block waveguide and compact lens receiver packaged in LTCC multilayered substrates, we tested wireless data transmission up to 27 Gbps with the simple amplitude key shifting (ASK) modulation scheme. We also present several THz antenna-in-packaging solutions based on substrate integrated waveguide (SIW) technology. A vertical hollow (VH) SIW was applied to a compact medium-gain SIW antenna and low-loss interconnection integrated in LTCC multi-layer substrates. The size of the LTCC antennas with 15-dBi gain is less than 0.1 cm3. For feeding the antenna, we investigated an LTCC-integrated transition and polyimide transition to LTCC VH SIWs. These transitions exhibit around 1-dB estimated loss at 300 GHz and more than 35 GHz bandwidth with 10-dB return loss. The proposed package solutions make antennas and interconnections easy to integrate in a compact LTCC package with an MMIC chip for practical applications.

MOEMS industrial infrastructure

NASA Astrophysics Data System (ADS)

van Heeren, Henne; Paschalidou, Lia

2004-08-01

Forecasters and analysts predict the market size for microsystems and microtechnologies to be in the order of 68 billion by the year 2005 (NEXUS Market Study 2002). In essence, the market potential is likely to double in size from its 38 billion status in 2002. According to InStat/MDR the market for MOEMS (Micro Optical Electro Mechanical Systems) in optical communication will be over $1.8 billion in 2006 and WTC states that the market for non telecom MOEMS will be even larger. Underpinning this staggering growth will be an infrastructure of design houses, foundries, package/assembly providers and equipment suppliers to cater for the demand in design, prototyping, and (mass-) production. This infrastructure is needed to provide an efficient route to commercialisation. Foundries, which provide the infrastructure to prototype, fabricate and mass-produce the designs emanating from the design houses and other companies. The reason for the customers to rely on foundries can be diverse: ranging from pure economical reasons (investments, cost-price) to technical (availability of required technology). The desire to have a second source of supply can also be a reason for outsourcing. Foundries aim to achieve economies of scale by combining several customer orders into volume production. Volumes are necessary, not only to achieve the required competitive cost prices, but also to attain the necessary technical competence level. Some products that serve very large markets can reach such high production volumes that they are able to sustain dedicated factories. In such cases, captive supply is possible, although outsourcing is still an option, as can be seen in the magnetic head markets, where captive and non-captive suppliers operate alongside each other. The most striking examples are: inkjet heads (>435 million heads per year) and magnetic heads (>1.5 billion heads per year). Also pressure sensor and accelerometer producers can afford their own facilities to produce the numbers they want (several millions per year). The crossover point where building a dedicated facility becomes a realistic option, can differ very much depending on technology complexity, numbers and market value. Also history plays a role, companies with past experience in the production of a product and the necessary facilities and equipment will tend to achieve captive production. Companies not having a microtechnology history will tend to outsource, offering business opportunities for foundries. The number of foundries shows a steady growth over the years. The total availability of foundries, however, and their flexibility will, undoubtedly, rely on market potential and its size. Unlike design houses, foundries need to realise a substantial return on the "large" investments they make in terms of capital and infrastructure. These returns will be maximised through mass-produced products aimed at "killer" applications (accelerometers are only one example). The existence of professional suppliers of MOEMS packaging and assembly is an essential element in the supply chain and critical for the manufacturing and commercialisation of MOEMS products. In addition, the incorporation of packaging and assembly techniques at the front-end of the engineering cycle will pay back in terms of financial savings and shorter timescales to market. Packaging and assembly for MOEMS are, in general, more costly than their equivalents for standard integrated circuits. This is, primarily, due to the diversity of the interconnections (which are multi-functional and may incorporate: electrical, optical, fluidic etc). In addition, the high levels of accuracy and the potential sensitivity of the devices to mechanical and external influences play a major role in the cost aspects of the final MNT product. This article will give an overview of the package/assembly providers and foundry business models and analyse their contribution to the MOEMS supply chain illustrated with some typical examples. As we believe that commercial services are the main basis for the breakthrough of MOEMS technology, we only cover commercial package/assembly and foundry services and not the ones offered by universities and research labs.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Tsai, H. C.; Chen, K.; Liu, Y. Y.

The US Department of Energy (DOE) [Environmental Management (EM), Office of Packaging and Transportation (EM-45)] Packaging Certification Program (PCP) has developed a radiofrequency identification (RFID) tracking and monitoring system for the management of nuclear materials packages during storage and transportation. The system, developed by the PCP team at Argonne National Laboratory, involves hardware modification, application software development, secured database and web server development, and irradiation experiments. In April 2008, Argonne tested key features of the RFID tracking and monitoring system in a weeklong, 1700 mile (2736 km) demonstration employing 14 empty type B fissile material drums of three designs (modelsmore » 9975, 9977 and ES-3100) that have been certified for shipment by the DOE and the US Nuclear Regulatory Commission. The demonstration successfully integrated global positioning system (GPS) technology for vehicle tracking, satellite/cellular (general packet radio service, or GPRS) technologies for wireless communication, and active RFID tags with multiple sensors (seal integrity, shock, temperature, humidity and battery status) on drums. In addition, the demonstration integrated geographic information system (GIS) technology with automatic alarm notifications of incidents and generated buffer zone reports for emergency response and management of staged incidents. The demonstration was sponsored by EM and the US National Nuclear Security Administration, with the participation of Argonne, Savannah River and Oak Ridge National Laboratories. Over 50 authorised stakeholders across the country observed the demonstration via secured Internet access. The DOE PCP and national laboratories are working on several RFID system implementation projects at selected DOE sites, as well as continuing device and systems development and widening applications beyond DOE sites and possibly beyond nuclear materials to include other radioactive materials.« less

PLATSIM: An efficient linear simulation and analysis package for large-order flexible systems

NASA Technical Reports Server (NTRS)

Maghami, Periman; Kenny, Sean P.; Giesy, Daniel P.

1995-01-01

PLATSIM is a software package designed to provide efficient time and frequency domain analysis of large-order generic space platforms implemented with any linear time-invariant control system. Time domain analysis provides simulations of the overall spacecraft response levels due to either onboard or external disturbances. The time domain results can then be processed by the jitter analysis module to assess the spacecraft's pointing performance in a computationally efficient manner. The resulting jitter analysis algorithms have produced an increase in speed of several orders of magnitude over the brute force approach of sweeping minima and maxima. Frequency domain analysis produces frequency response functions for uncontrolled and controlled platform configurations. The latter represents an enabling technology for large-order flexible systems. PLATSIM uses a sparse matrix formulation for the spacecraft dynamics model which makes both the time and frequency domain operations quite efficient, particularly when a large number of modes are required to capture the true dynamics of the spacecraft. The package is written in MATLAB script language. A graphical user interface (GUI) is included in the PLATSIM software package. This GUI uses MATLAB's Handle graphics to provide a convenient way for setting simulation and analysis parameters.

Addressable microshutter array for a high-performance infrared miniature dispersive spectrometer

NASA Astrophysics Data System (ADS)

Ilias, S.; Picard, F.; Larouche, C.; Kruzelecky, R.; Jamroz, W.

2009-02-01

Programmable microshutter arrays were designed to improve the attainable signal to noise ratio (SNR) of a miniature dispersive spectrometer developed for space applications. Integration of a microshutter array to this instrument provides advantages such as the addition of a binary coded optical input operation mode for the miniature spectrometer which results in SNR benefits without spectral resolution loss. These arrays were successfully fabricated using surface micromachining technology. Each microshutter is basically an electrostatic zipping actuator having a curved shape. Applying critical voltage to one microshutter pulls the actuator down to the substrate and closes the associated slit. Opening of the microslits relies on the restoring force generated within the actuated zippers. High light transmission is obtained with the actuator in the open position and excellent light blocking is observed when the shutter is closed. The pull-in voltage to close the microslits was about 110 V and the response times to close and open the microslits were about 2 ms and 7 ms, respectively. Selected array dies were mounted in modified off-the-shelf ceramic packages and electrically connected to package pins. The packages were hermetically sealed with AR coated sapphire windows. This last packaging step was performed in a dry nitrogen controlled atmosphere.

Reliability of CGA/LGA/HDI Package Board/Assembly (Final Report)

NASA Technical Reports Server (NTRS)

Ghaffaroam. Reza

2014-01-01

Package manufacturers are now offering commercial-off-the-shelf column grid array (COTS CGA) packaging technologies in high-reliability versions. Understanding the process and quality assurance (QA) indicators for reliability are important for low-risk insertion of these advanced electronics packages. The previous reports, released in January of 2012 and January of 2013, presented package test data, assembly information, and reliability evaluation by thermal cycling for CGA packages with 1752, 1517, 1509, and 1272 inputs/outputs (I/Os) and 1-mm pitch. It presented the thermal cycling (-55C either 100C or 125C) test results for up to 200 cycles. This report presents up to 500 thermal cycles with quality assurance and failure analysis evaluation represented by optical photomicrographs, 2D real time X-ray images, dye-and-pry photomicrographs, and optical/scanning electron Microscopy (SEM) cross-sectional images. The report also presents assembly challenge using reflowing by either vapor phase or rework station of CGA and land grid array (LGA) versions of three high I/O packages both ceramic and plastic configuration. A new test vehicle was designed having high density interconnect (HDI) printed circuit board (PCB) with microvia-in-pad to accommodate both LGA packages as well as a large number of fine pitch ball grid arrays (BGAs). The LGAs either were assembled onto HDI PCB as an LGA or were solder paste print and reflow first to form solder dome on pads before assembly. Both plastic BGAs with 1156 I/O and ceramic LGAs were assembled. It also presented the X-ray inspection results as well as failures due to 200 thermal cycles. Lessons learned on assembly of ceramic LGAs are also presented.

Lockheed Martin microcryocoolers

NASA Astrophysics Data System (ADS)

Olson, Jeffrey R.; Roth, Eric W.; Sanders, Lincoln-Shaun; Will, Eric; Frank, David J.

2017-05-01

Lockheed Martin's Advanced Technology Center, part of Lockheed Martin Space Systems Company, has developed a series of long life microcryocoolers for avionics and space sensor applications. We report the development and testing of three varieties of single-stage, compact, coaxial, pulse tube microcryocoolers. These coolers support emerging large, high operating temperature (100-150K) infrared focal plane array sensors with nominal cooling loads of 200-2000 mW, and all share long life technology attributes used in space cryocoolers, which typically provide 10 years of continuous operation on orbit without degradation. These three models of microcryocooler are the 345 gram Micro1-1, designed to provide 1 W cooling at 150 K, the 450 gram Micro1-2, designed to provide 2 W cooling at 105 K, and the 320 gram Micro1-3, designed to provide 300 mW cooling at 125 K while providing the capability to cool the IR focal plane to 125 K in less than 3 minutes. The Micro1-3 was also designed with a highly compact package that reduced the coldhead length to 55 mm, a length reduction of more than a factor of two compared with the other coldheads. This paper also describes recent design studies of 2-stage microcryocoolers capable of providing cooling at 25-100K. LMSSC is an industry leader in multiple-stage coolers, having successfully built and tested eight 2-stage coolers (typically cooling to 35-55K), and four coolers with 3 or 4 stages (for cooling to 4-10K). The 2-stage microcryocooler offers a very low mass and compact package capable of cooling HgCdTe focal planes, while providing simultaneous optics cooling at a higher temperature.

49 CFR 173.411 - Industrial packages.

Code of Federal Regulations, 2014 CFR

2014-10-01

...) Each Type IP-1 package must meet the general design requirements prescribed in § 173.410. (2) Each Type IP-2 package must meet the general design requirements prescribed in § 173.410 and when subjected to...), “Requirements for the Design, Construction, Inspection and Testing of Portable Tanks and Multiple-Element Gas...

49 CFR 172.102 - Special provisions.

Code of Federal Regulations, 2010 CFR

2010-10-01

... bags, each packaging must correspond to a design type that has passed a leakproofness test at the... packaging must correspond to a design type that has passed a leakproofness test at the Packing Group II... packaging must correspond to a design type that has passed a leakproofness test at the Packing Group II...

Solar water heater design package

NASA Technical Reports Server (NTRS)

1981-01-01

Package describes commercial domestic-hot-water heater with roof or rack mounted solar collectors. System is adjustable to pre-existing gas or electric hot-water house units. Design package includes drawings, description of automatic control logic, evaluation measurements, possible design variations, list of materials and installation tools, and trouble-shooting guide and manual.

49 CFR 178.970 - Bottom lift test.

Code of Federal Regulations, 2010 CFR

2010-10-01

... Large Packagings design types designed to be lifted from the base, there may be no permanent deformation which renders the Large Packaging unsafe for transport and there must be no loss of contents. ... permissible gross mass, the load being evenly distributed. (c) Test method. All Large Packaging design types...

49 CFR 178.970 - Bottom lift test.

Code of Federal Regulations, 2011 CFR

2011-10-01

... Packagings design types designed to be lifted from the base, there may be no permanent deformation which renders the Large Packaging unsafe for transport and there must be no loss of contents. ... gross mass, the load being evenly distributed. (c) Test method. All Large Packaging design types must be...

49 CFR 178.970 - Bottom lift test.

Code of Federal Regulations, 2014 CFR

2014-10-01

... Packagings design types designed to be lifted from the base, there may be no permanent deformation which renders the Large Packaging unsafe for transport and there must be no loss of contents. ... gross mass, the load being evenly distributed. (c) Test method. All Large Packaging design types must be...

49 CFR 178.970 - Bottom lift test.

Code of Federal Regulations, 2012 CFR

2012-10-01

... Packagings design types designed to be lifted from the base, there may be no permanent deformation which renders the Large Packaging unsafe for transport and there must be no loss of contents. ... gross mass, the load being evenly distributed. (c) Test method. All Large Packaging design types must be...

49 CFR 178.970 - Bottom lift test.

Code of Federal Regulations, 2013 CFR

2013-10-01

... Packagings design types designed to be lifted from the base, there may be no permanent deformation which renders the Large Packaging unsafe for transport and there must be no loss of contents. ... gross mass, the load being evenly distributed. (c) Test method. All Large Packaging design types must be...

PsychoPy--Psychophysics software in Python.

PubMed

Peirce, Jonathan W

2007-05-15

The vast majority of studies into visual processing are conducted using computer display technology. The current paper describes a new free suite of software tools designed to make this task easier, using the latest advances in hardware and software. PsychoPy is a platform-independent experimental control system written in the Python interpreted language using entirely free libraries. PsychoPy scripts are designed to be extremely easy to read and write, while retaining complete power for the user to customize the stimuli and environment. Tools are provided within the package to allow everything from stimulus presentation and response collection (from a wide range of devices) to simple data analysis such as psychometric function fitting. Most importantly, PsychoPy is highly extensible and the whole system can evolve via user contributions. If a user wants to add support for a particular stimulus, analysis or hardware device they can look at the code for existing examples, modify them and submit the modifications back into the package so that the whole community benefits.

PsychoPy—Psychophysics software in Python

PubMed Central

Peirce, Jonathan W.

2007-01-01

The vast majority of studies into visual processing are conducted using computer display technology. The current paper describes a new free suite of software tools designed to make this task easier, using the latest advances in hardware and software. PsychoPy is a platform-independent experimental control system written in the Python interpreted language using entirely free libraries. PsychoPy scripts are designed to be extremely easy to read and write, while retaining complete power for the user to customize the stimuli and environment. Tools are provided within the package to allow everything from stimulus presentation and response collection (from a wide range of devices) to simple data analysis such as psychometric function fitting. Most importantly, PsychoPy is highly extensible and the whole system can evolve via user contributions. If a user wants to add support for a particular stimulus, analysis or hardware device they can look at the code for existing examples, modify them and submit the modifications back into the package so that the whole community benefits. PMID:17254636

CFD analyses for advanced pump design

NASA Technical Reports Server (NTRS)

Dejong, F. J.; Choi, S.-K.; Govindan, T. R.

1994-01-01

As one of the activities of the NASA/MSFC Pump Stage Technology Team, the present effort was focused on using CFD in the design and analysis of high performance rocket engine pumps. Under this effort, a three-dimensional Navier-Stokes code was used for various inducer and impeller flow field calculations. An existing algebraic grid generation procedure was-extended to allow for nonzero blade thickness, splitter blades, and hub/shroud cavities upstream or downstream of the (main) blades. This resulted in a fast, robust inducer/impeller geometry/grid generation package. Problems associated with running a compressible flow code to simulate an incompressible flow were resolved; related aspects of the numerical algorithm (viz., the matrix preconditioning, the artificial dissipation, and the treatment of low Mach number flows) were addressed. As shown by the calculations performed under the present effort, the resulting code, in conjunction with the grid generation package, is an effective tool for the rapid solution of three-dimensional viscous inducer and impeller flows.

Automated space processing payloads study. Volume 2, book 1: Technical report. [instrument packages and space shuttles

NASA Technical Reports Server (NTRS)

1975-01-01

The extent was investigated to which experiment hardware and operational requirements can be met by automatic control and material handling devices; payload and system concepts that make extensive use of automation technology are defined. Hardware requirements for each experiment were established and tabulated, and investigations of applicable existing hardware were documented. The capabilities and characteristics of industrial automation equipment, controls, and techniques are presented in the form of a summary of applicable equipment characteristics in three basic mutually-supporting formats. Facilities for performing groups of experiments are defined along with four levitation groups and three furnace groups; major hardware elements required to implement them were identified. A conceptual design definition of ten different automated processing facilities is presented along with the specific equipment to implement each facility and the design layouts of the different units. Constraints and packaging, weight, and power requirements for six payloads postulated for shuttle missions in the 1979 to 1982 time period were examined.

Combining an Analytic Hierarchy Process and TOPSIS for Selecting Postharvest Technology Method for Selayar Citrus in Indonesia

NASA Astrophysics Data System (ADS)

Dirpan, Andi

2018-05-01

This research was intended to select the best handling methods or postharvest technologies that can be used to maintain the quality of citrus fruit in Selayar, South Sulawesi, Indonesia among (1) modified atmosphere packaging (MAP (2) Controlled atmosphere storage (CAS) (3) coatings (4) hot water treatment (5) Hot Calcium Dip (HCD) by using combination between an analytic hierarchy process (AHP) and TOPSIS. Improving quality, applicability, increasing shelf life and reducing cost are used as the criteria to determine the best postharvest technologies. The results show that the most important criteria for selecting postharvest technology is improving quality followed by increasing shelf life, reducing cost and applicability. Furthermore, by using TOPSIS, it is clear that the postharvest technology that had the lowest rangking is modified atmosphere packaging (MAP), followed by controlled atmosphere storage (CAS), coatings, hot calcium dip (HCD) and hot water treatment (HWT). Therefore, it can be concluded that the best postharvest technology method for Selayar citrus is modified atmosphere packaging (MAP).

Effect of bending on the performance of spool-packaged shape memory alloy actuators

NASA Astrophysics Data System (ADS)

Redmond, John A.; Brei, Diann; Luntz, Jonathan; Browne, Alan L.; Johnson, Nancy L.

2009-03-01

Shape memory alloy (SMA) actuation is becoming an increasingly viable technology for industrial applications as many of the technical issues that have limited its use are being addressed (speed of actuation, mechanical connections, performance degradation, quality control, etc.) while increasing production capacities drive costs to practical levels. Shape memory alloys are often selected because of their high energy density which can lead to compact actuators; however, wire forms with small cross-sectional diameters tend to be long (10 to 50 times the length of required stroke). Spooling the wire can be used for compact packaging, but as the spool diameter decreases performance losses and fatigue increase due to bending strains and stresses. This paper presents a simple, design-level model for spooled SMA wire actuators with linear motion outputs that includes the effects of friction and wire bending and accounts for the actuator geometry, applied load, and material friction and constitutive properties. The model was validated experimentally with respect to the ratio of mandrel to SMA wire diameter and agrees well in both form and magnitude with experiments. The resulting model provides the framework for the analysis and synthesis of spooled SMA wire actuators to guide the selection of design parameters with respect to the tradeoffs between performance and packaging.

Custom electronic subsystems for the laboratory telerobotic manipulator

NASA Technical Reports Server (NTRS)

Glassell, R. L.; Butler, P. L.; Rowe, J. C.; Zimmermann, S. D.

1990-01-01

The National Aeronautics and Space Administration (NASA) Space Station Program presents new opportunities for the application of telerobotic and robotic systems. The Laboratory Telerobotic Manipulator (LTM) is a highly advanced 7 degrees-of-freedom (DOF) telerobotic/robotic manipulator. It was developed and built for the Automation Technology Branch at NASA's Langley Research Center (LaRC) for work in research and to demonstrate ground-based telerobotic manipulator system hardware and software systems for future NASA applications in the hazardous environment of space. The LTM manipulator uses an embedded wiring design with all electronics, motor power, and control and communication cables passing through the pitch-yaw differential joints. This design requires the number of cables passing through the pitch/yaw joint to be kept to a minimum. To eliminate the cables needed to carry each pitch-yaw joint's sensor data to the VME control computers, a custom-embedded electronics package for each manipulator joint was developed. The electronics package collects and sends the joint's sensor data to the VME control computers over a fiber optic cable. The electronics package consist of five individual subsystems: the VME Link Processor, the Joint Processor and the Joint Processor power supply in the joint module, the fiber optics communications system, and the electronics and motor power cabling.

High barrier multilayer packaging by the coextrusion method: The effect of nanocomposites and biodegradable polymers on flexible film properties

NASA Astrophysics Data System (ADS)

Thellen, Christopher T.

The objective of this research was to investigate the use of nanocomposite and multilayer co-extrusion technologies for the development of high gas barrier packaging that is more environmentally friendly than many current packaging system. Co-extruded bio-based and biodegradable polymers that could be composted in a municipal landfill were one direction that this research was aimed. Down-gauging of high performance barrier films using nanocomposite technology and co-extrusion was also investigated in order to reduce the amount of solid waste being generated by the packaging. Although the research is focused on military ration packaging, the technologies could easily be introduced into the commercial flexible packaging market. Multilayer packaging consisting of poly(m-xylylene adipamide) nanocomposite layers along with adhesive and tie layers was co-extruded using both laboratory and pilot-scale film extrusion equipment. Co-extrusion of biodegradable polyhydroxyalkanoates (PHA) along with polyvinyl alcohol (PVOH) and tie layers was also accomplished using similar co-extrusion technology. All multilayer films were characterized for gas barrier, mechanical, and thermal properties. The biodegradability of the PVOH and PHA materials in a marine environment was also investigated. The research has shown that co-extrusion of these materials is possible at a research and pilot level. The use of nanocomposite poly(m-xylylene adipamide) was effective in down-gauging the un-filled barrier film to thinner structures. Bio-based PHA/PVOH films required the use of a malefic anhydride grafted PHA tie layer to improve layer to layer adhesion in the structure to avoid delamination. The PHA polymer demonstrated a high rate of biodegradability/mineralization in the marine environment while the rate of biodegradation of the PVOH polymer was slower.

Magnetoresistive immunosensor for the detection of Escherichia coli O157:H7 including a microfluidic network.

PubMed

Mujika, M; Arana, S; Castaño, E; Tijero, M; Vilares, R; Ruano-López, J M; Cruz, A; Sainz, L; Berganza, J

2009-01-01

A hand held device has been designed for the immunomagnetic detection and quantification of the pathogen Escherichia coli O157:H7 in food and clinical samples. In this work, a technology to manufacture a Lab on a Chip that integrates a 3D microfluidic network with a microfabricated biosensor has been developed. With this aim, the sensing film optimization, the design of the microfluidic circuitry, the development of the biological protocols involved in the measurements and, finally, the packaging needed to carry out the assays in a safe and straightforward way have been completed. The biosensor is designed to be capable to detect and quantify small magnetic field variations caused by the presence of superparamagnetic beads bound to the antigens previously immobilized on the sensor surface via an antibody-antigen reaction. The giant magnetoresistive multilayer structure implemented as sensing film consists of 20[Cu(5.10nm)/Co(2.47 nm)] with a magnetoresistance of 3.20% at 235Oe and a sensitivity up to 0.06 Omega/Oe between 150Oe and 230Oe. Silicon nitride has been selected as optimum sensor surface coating due to its suitability for antibody immobilization. In order to guide the biological samples towards the sensing area, a microfluidic network made of SU-8 photoresist has been included. Finally, a novel packaging design has been fabricated employing 3D stereolithographic techniques. The microchannels are connected to the outside using standard tubing. Hence, this packaging allows an easy replacement of the used devices.

Use of Dual Electromagnetic Radiation Technology to Reduce Salmonella and Listeria monocytogenes Risk on Cooked and Packaged Meat Products

USDA-ARS?s Scientific Manuscript database

Pathogenic bacteria including Salmonella and Listeria can potentially contaminate ready-to-eat meats. These bacteria compromise the safety of our food supply. The objective of this research was to develop and test new low temperature pasteurization technology for packaged or thermally sensitive food...

Chip-package nano-structured copper and nickel interconnections with metallic and polymeric bonding interfaces

NASA Astrophysics Data System (ADS)

Aggarwal, Ankur

With the semiconductor industry racing toward a historic transition, nano chips with less than 45 nm features demand I/Os in excess of 20,000 that support computing speed in terabits per second, with multi-core processors aggregately providing highest bandwidth at lowest power. On the other hand, emerging mixed signal systems are driving the need for 3D packaging with embedded active components and ultra-short interconnections. Decreasing I/O pitch together with low cost, high electrical performance and high reliability are the key technological challenges identified by the 2005 International Technology Roadmap for Semiconductors (ITRS). Being able to provide several fold increase in the chip-to-package vertical interconnect density is essential for garnering the true benefits of nanotechnology that will utilize nano-scale devices. Electrical interconnections are multi-functional materials that must also be able to withstand complex, sustained and cyclic thermo-mechanical loads. In addition, the materials must be environmentally-friendly, corrosion resistant, thermally stable over a long time, and resistant to electro-migration. A major challenge is also to develop economic processes that can be integrated into back end of the wafer foundry, i.e. with wafer level packaging. Device-to-system board interconnections are typically accomplished today with either wire bonding or solders. Both of these are incremental and run into either electrical or mechanical barriers as they are extended to higher density of interconnections. Downscaling traditional solder bump interconnect will not satisfy the thermo-mechanical reliability requirements at very fine pitches of the order of 30 microns and less. Alternate interconnection approaches such as compliant interconnects typically require lengthy connections and are therefore limited in terms of electrical properties, although expected to meet the mechanical requirements. A novel chip-package interconnection technology is developed to address the IC packaging requirements beyond the ITRS projections and to introduce innovative design and fabrication concepts that will further advance the performance of the chip, the package, and the system board. The nano-structured interconnect technology simultaneously packages all the ICs intact in wafer form with quantum jump in the number of interconnections with the lowest electrical parasitics. The intrinsic properties of nano materials also enable several orders of magnitude higher interconnect densities with the best mechanical properties for the highest reliability and yet provide higher current and heat transfer densities. Nano-structured interconnects provides the ability to assemble the packaged parts on the system board without the use of underfill materials and to enable advanced analog/digital testing, reliability testing, and burn-in at wafer level. This thesis investigates the electrical and mechanical performance of nanostructured interconnections through modeling and test vehicle fabrication. The analytical models evaluate the performance improvements over solder and compliant interconnections. Test vehicles with nano-interconnections were fabricated using low cost electro-deposition techniques and assembled with various bonding interfaces. Interconnections were fabricated at 200 micron pitch to compare with the existing solder joints and at 50 micron pitch to demonstrate fabrication processes at fine pitches. Experimental and modeling results show that the proposed nano-interconnections could enhance the reliability and potentially meet all the system performance requirements for the emerging micro/nano-systems.

Advanced Packaging for VLSI/VHSIC (Very Large Scale Integrated Circuits/Very High Speed Integrated Circuits) Applications: Electrical, Thermal, and Mechanical Considerations - An IR&D Report.

DTIC Science & Technology

1987-11-01

developed that can be used by circuit engineers to extract the maximum performance from the devices on various board technologies including multilayer ceramic...Design guidelines have been developed that can be used by circuit engineers to extract the maxi- mum performance from the devices on various board...25 Attenuation and Dispersion Effects ......................................... 27 Skin Effect

EPA/Navy CERCLA Remedial Action Technology Guide

DTIC Science & Technology

1993-11-01

Pollution 18:25-36, 1988. Control Association, August 19-21, 1985. 11. Nirmalakhandan, N. N. and R. E. Speece. QSAR Model for Predicting Henry’s...Las Vegas , Nevada. May 1988.. 6. Bergstrom, Wayne R., Gray, Donald H. Fly Ash Utilization 12. Handbook - Remedial Action at Waste Disposal Sites in...of the soil piles should be are needed to confirm that the contaminants of concern can be designed as a package. There are computer models available

Physics-based process modeling, reliability prediction, and design guidelines for flip-chip devices

NASA Astrophysics Data System (ADS)

Michaelides, Stylianos

Flip Chip on Board (FCOB) and Chip-Scale Packages (CSPs) are relatively new technologies that are being increasingly used in the electronic packaging industry. Compared to the more widely used face-up wirebonding and TAB technologies, flip-chips and most CSPs provide the shortest possible leads, lower inductance, higher frequency, better noise control, higher density, greater input/output (I/O), smaller device footprint and lower profile. However, due to the short history and due to the introduction of several new electronic materials, designs, and processing conditions, very limited work has been done to understand the role of material, geometry, and processing parameters on the reliability of flip-chip devices. Also, with the ever-increasing complexity of semiconductor packages and with the continued reduction in time to market, it is too costly to wait until the later stages of design and testing to discover that the reliability is not satisfactory. The objective of the research is to develop integrated process-reliability models that will take into consideration the mechanics of assembly processes to be able to determine the reliability of face-down devices under thermal cycling and long-term temperature dwelling. The models incorporate the time and temperature-dependent constitutive behavior of various materials in the assembly to be able to predict failure modes such as die cracking and solder cracking. In addition, the models account for process-induced defects and macro-micro features of the assembly. Creep-fatigue and continuum-damage mechanics models for the solder interconnects and fracture-mechanics models for the die have been used to determine the reliability of the devices. The results predicted by the models have been successfully validated against experimental data. The validated models have been used to develop qualification and test procedures for implantable medical devices. In addition, the research has helped develop innovative face-down devices without the underfill, based on the thorough understanding of the failure modes. Also, practical design guidelines for material, geometry and process parameters for reliable flip-chip devices have been developed.

(Environmental investigation of ground water contamination at Wright-Patterson Air Force Base, Ohio)

DOE Office of Scientific and Technical Information (OSTI.GOV)

Not Available

1992-04-01

This Removal Action System Design has been prepared as a Phase I Volume for the implementation of the Phase II removal action at Wright-Patterson Air Force Base (WPAFB) near Dayton, Ohio. The objective of the removal action is to prevent, to the extent practicable, the migration of ground water contaminated with chlorinated volatile organic compounds (VOCS) across the southwest boundary of Area C. The Phase 1, Volume 9 Removal Action System Design compiles the design documents prepared for the Phase II Removal Action. These documents, which are presented in Appendices to Volume 9, include: Process Design, which presents the 30more » percent design for the ground water treatment system (GWTS); Design Packages 1 and 2 for Earthwork and Road Construction, and the Discharge Pipeline, respectively; no drawings are included in the appendix; Design Package 3 for installation of the Ground Water Extraction Well(s); Design Package 4 for installation of the Monitoring Well Instrumentation; and Design Package 5 for installation of the Ground Water Treatment System; this Design Package is incorporated by reference because of its size.« less

General specifications for the development of a USL NASA PC R and D statistical analysis support package

NASA Technical Reports Server (NTRS)

Dominick, Wayne D. (Editor); Bassari, Jinous; Triantafyllopoulos, Spiros

1984-01-01

The University of Southwestern Louisiana (USL) NASA PC R and D statistical analysis support package is designed to be a three-level package to allow statistical analysis for a variety of applications within the USL Data Base Management System (DBMS) contract work. The design addresses usage of the statistical facilities as a library package, as an interactive statistical analysis system, and as a batch processing package.

Space station power semiconductor package

NASA Technical Reports Server (NTRS)

Balodis, Vilnis; Berman, Albert; Devance, Darrell; Ludlow, Gerry; Wagner, Lee

1987-01-01

A package of high-power switching semiconductors for the space station have been designed and fabricated. The package includes a high-voltage (600 volts) high current (50 amps) NPN Fast Switching Power Transistor and a high-voltage (1200 volts), high-current (50 amps) Fast Recovery Diode. The package features an isolated collector for the transistors and an isolated anode for the diode. Beryllia is used as the isolation material resulting in a thermal resistance for both devices of .2 degrees per watt. Additional features include a hermetical seal for long life -- greater than 10 years in a space environment. Also, the package design resulted in a low electrical energy loss with the reduction of eddy currents, stray inductances, circuit inductance, and capacitance. The required package design and device parameters have been achieved. Test results for the transistor and diode utilizing the space station package is given.

Spacecraft computer technology at Southwest Research Institute

NASA Technical Reports Server (NTRS)

Shirley, D. J.

1993-01-01

Southwest Research Institute (SwRI) has developed and delivered spacecraft computers for a number of different near-Earth-orbit spacecraft including shuttle experiments and SDIO free-flyer experiments. We describe the evolution of the basic SwRI spacecraft computer design from those weighing in at 20 to 25 lb and using 20 to 30 W to newer models weighing less than 5 lb and using only about 5 W, yet delivering twice the processing throughput. Because of their reduced size, weight, and power, these newer designs are especially applicable to planetary instrument requirements. The basis of our design evolution has been the availability of more powerful processor chip sets and the development of higher density packaging technology, coupled with more aggressive design strategies in incorporating high-density FPGA technology and use of high-density memory chips. In addition to reductions in size, weight, and power, the newer designs also address the necessity of survival in the harsh radiation environment of space. Spurred by participation in such programs as MSTI, LACE, RME, Delta 181, Delta Star, and RADARSAT, our designs have evolved in response to program demands to be small, low-powered units, radiation tolerant enough to be suitable for both Earth-orbit microsats and for planetary instruments. Present designs already include MIL-STD-1750 and Multi-Chip Module (MCM) technology with near-term plans to include RISC processors and higher-density MCM's. Long term plans include development of whole-core processors on one or two MCM's.

Space Technology 5: Enabling Future Micro-Sat Constellation Science Missions

NASA Technical Reports Server (NTRS)

Carlisle, Candace C.; Webb, Evan H.

2004-01-01

The Space Technology 5 (ST-5) Project is part of NASA s New Millennium Program. ST-5 will consist of a constellation of three micro-satellites, each approximately 25 kg in mass. The mission goals are to demonstrate the research-quality science capability of the ST-5 spacecraft; to operate the three spacecraft as a constellation; and to design, develop and flight-validate three capable micro-satellites with new technologies. ST-5 is designed to measurably raise the utility of small satellites by providing high functionality in a low mass, low power, and low volume package. The whole of ST-5 is greater than the sum of its parts: the collection of components into the ST-5 spacecraft allows it to perform the functionality of a larger scientific spacecraft on a micro-satellite platform. The ST-5 mission was originally designed to be launched as a secondary payload into a Geosynchronous Transfer Orbit (GTO). Recently, the mission has been replanned for a Pegasus XL dedicated launch into an elliptical polar orbit. A three-month flight demonstration phase, beginning in March 2006, will validate the ability to perform science measurements, as well as the technologies and constellation operations. ST- 5 s technologies and concepts will then be transferred to future micro-sat science missions.

Space Technology 5: Enabling Future Micro-Sat Constellation Science Missions

NASA Technical Reports Server (NTRS)

Carlisle, Candace C.; Webb, Evan H.; Slavin, James A.

2004-01-01

The Space Technology 5 (ST-5) Project is part of NASA s New Millennium Program. ST-5 will consist of a constellation of three micro-satellites, each approximately 25 kg in mass. The mission goals are to demonstrate the research-quality science capability of the ST-5 spacecraft, to operate the three spacecraft as a constellation; and to design, develop and flight-validate three capable micro-satellites with new technologies. ST-5 is designed to measurably raise the utility of small satellites by providing high functionality in a low mass, low power, and low volume package. The whole of ST-5 is greater than the sum of its parts: the collection of components into the ST-5 spacecraft allows it to perform the functionality of a larger scientific spacecraft on a micro-satellite platform. The ST-5 mission was originally designed to be launched as a secondary payload into a Geosynchronous Transfer Orbit (GTO). Recently, the mission has been replanned for a Pegasus XL dedicated launch into an elliptical polar orbit. A three-month flight demonstration phase, beginning in March 2006, will validate the ability to perform science measurements, as well as the technologies and constellation operations. ST- 5 s technologies and concepts will then be transferred to future micro-sat science missions.

Lessons Learned in the Design and Use of IP1 / IP2 Flexible Packaging - 13621

DOE Office of Scientific and Technical Information (OSTI.GOV)

Sanchez, Mike; Reeves, Wendall; Smart, Bill

2013-07-01

For many years in the USA, Low Level Radioactive Waste (LLW), contaminated soils and construction debris, have been transported, interim stored, and disposed of, using IP1 / IP2 metal containers. The performance of these containers has been more than adequate, with few safety occurrences. The containers are used under the regulatory oversight of the US Department of Transportation (DOT), 49 Code of Federal Regulations (CFR). In the late 90's the introduction of flexible packaging for the transport, storage, and disposal of low level contaminated soils and construction debris was introduced. The development of flexible packaging came out of a needmore » for a more cost effective package, for the large volumes of waste generated by the decommissioning of many of the US Department of Energy (DOE) legacy sites across the US. Flexible packaging had to be designed to handle a wide array of waste streams, including soil, gravel, construction debris, and fine particulate dust migration. The design also had to meet all of the IP1 requirements under 49CFR 173.410, and be robust enough to pass the IP2 testing 49 CFR 173.465 required for many LLW shipments. Tens of thousands of flexible packages have been safely deployed and used across the US nuclear industry as well as for hazardous non-radioactive applications, with no recorded release of radioactive materials. To ensure that flexible packages are designed properly, the manufacturer must use lessons learned over the years, and the tests performed to provide evidence that these packages are suitable for transporting low level radioactive wastes. The design and testing of flexible packaging for LLW, VLLW and other hazardous waste streams must be as strict and stringent as the design and testing of metal containers. The design should take into consideration the materials being loaded into the package, and should incorporate the right materials, and manufacturing methods, to provide a quality, safe product. Flexible packaging can be shown to meet the criteria for safe and fit for purpose packaging, by meeting the US DOT regulations, and the IAEA Standards for IP-1 and IP-2 including leak tightness. (authors)« less

Cute as candy: a qualitative study of perceptions of snus branding and package design among youth in Norway

PubMed Central

Scheffels, Janne; Lund, Ingeborg

2017-01-01

Objectives Snus use has increased among youth in Norway in recent years and is now more prevalent than smoking. Concurrently, a range of new products and package designs have been introduced to the market. The aim of this study was to explore how youth perceive snus branding and package design, and the role, if any, of snus packaging on perceptions of appeal and harm of snus among youth. Participants Adolescent tobacco users and non-users (N=35) ages 15–17 years. Design We conducted interviews among 6 focus groups (each with 4–7 participants). Participants were shown snus packages with a variety of designs and with different product qualities (flavour additives, slim, regular, white and brown sachets) and group discussions focused on how they perceived packages and products. The focus group discussions were semistructured using a standard guide, and analysed thematically. Results The participants in the focus groups narrated distinct images of snus brands and associated user identities. Package design elements such as shapes, colours, images and fonts were described as guiding these perceptions. Packaging elements and flavour additives were associated with perceptions of product harm. The appeal of flavoured snus products and new types of snus sachets seemed to blend in with these processes, reinforcing positive attitudes and contributing to the creation of particular identities for products and their users. Conclusions The findings indicate that packaging is vital to consumer's identification with, and differentiation between, snus brands. In view of this, snus branding and packaging can be seen as fulfilling a similar promotional role as advertising messages: generating preferences and appeal. PMID:28373248

High-performance packaging for monolithic microwave and millimeter-wave integrated circuits

NASA Technical Reports Server (NTRS)

Shalkhauser, K. A.; Li, K.; Shih, Y. C.

1992-01-01

Packaging schemes were developed that provide low-loss, hermetic enclosure for advanced monolithic microwave and millimeter-wave integrated circuits (MMICs). The package designs are based on a fused quartz substrate material that offers improved radio frequency (RF) performance through 44 gigahertz (GHz). The small size and weight of the packages make them appropriate for a variety of applications, including phased array antenna systems. Packages were designed in two forms; one for housing a single MMIC chip, the second in the form of a multi-chip phased array module. The single chip array module was developed in three separate sizes, for chips of different geometry and frequency requirements. The phased array module was developed to address packaging directly for antenna applications, and includes transmission line and interconnect structures to support multi-element operation. All packages are fabricated using fused quartz substrate materials. As part of the packaging effort, a test fixture was developed to interface the single chip packages to conventional laboratory instrumentation for characterization of the packaged devices. The package and test fixture designs were both developed in a generic sense, optimizing performance for a wide range of possible applications and devices.

Packaging of ferroelectric liquid crystal-on-silicon spatial light modulators

NASA Astrophysics Data System (ADS)

Lin, W.; Morozova, Nina D.; Ju, TehHua; Zhang, Weidong; Lee, Yung-Cheng; McKnight, Douglas J.; Johnson, Kristina M.

1996-11-01

A self-pulling soldering technology has been demonstrated for assembling liquid crystal on silicon (LCOS) spatial light modulators (SLMs). One of the major challenges in manufacturing the LCOS modules is to reproducibly control the thickness of the gap between the very large scale integrated circuit (VLSI) chip and the cover glass. The liquid crystal material is sandwiched between the VLSI chop and the cover glass which is coated with a transparent conductor. Solder joints with different profiles and sizes have been designed to provide surface tension forces to control the gap accommodating the ferroelectric liquid crystal layer in the range of a micron level with sub- micron uniformity. The optimum solder joint design is defined as a joint that results in the maximum pulling force. This technology provides an automatic, batch assembly process for a LCOS SLM through one reflow process. Fluxless soldering technology is used to assemble the module. This approach avoids residues from chemical of flux and oxides, and eliminates potential contamination to the device. Two different LCOS SLM designs and the process optimization are described.

Design and implementation of a Windows NT network to support CNC activities

NASA Technical Reports Server (NTRS)

Shearrow, C. A.

1996-01-01

The Manufacturing, Materials, & Processes Technology Division is undergoing dramatic changes to bring it's manufacturing practices current with today's technological revolution. The Division is developing Computer Automated Design and Computer Automated Manufacturing (CAD/CAM) abilities. The development of resource tracking is underway in the form of an accounting software package called Infisy. These two efforts will bring the division into the 1980's in relationship to manufacturing processes. Computer Integrated Manufacturing (CIM) is the final phase of change to be implemented. This document is a qualitative study and application of a CIM application capable of finishing the changes necessary to bring the manufacturing practices into the 1990's. The documentation provided in this qualitative research effort includes discovery of the current status of manufacturing in the Manufacturing, Materials, & Processes Technology Division including the software, hardware, network and mode of operation. The proposed direction of research included a network design, computers to be used, software to be used, machine to computer connections, estimate a timeline for implementation, and a cost estimate. Recommendation for the division's improvement include action to be taken, software to utilize, and computer configurations.

KSC-97PC1277

NASA Image and Video Library

1997-08-22

In the Payload Hazardous Servicing Facility (PHSF), Dan Maynard, a Jet Propulsion Laboratory technician, inserts the Digital Video Disk (DVD) into a shallow cavity between two pieces of aluminum that will protect it from micrometeoroid impacts. The package will be mounted to the side of the two-story-tall spacecraft beneath a pallet carrying cameras and other space instruments that will be used to study the Saturnian system. A specially designed, multicolored patch of thermal blanket material will be installed over the disk package. Along with the spacecraft, the disk will reside in Saturn's orbit centuries after the primary mission is completed in July 2008. The Cassini mission is managed for NASA's Office of Space Science, Washington, D.C., by the Jet Propulsion Laboratory, a division of the California Institute of Technology

The Design and Implementation of NASA's Advanced Flight Computing Module

NASA Technical Reports Server (NTRS)

Alkakaj, Leon; Straedy, Richard; Jarvis, Bruce

1995-01-01

This paper describes a working flight computer Multichip Module developed jointly by JPL and TRW under their respective research programs in a collaborative fashion. The MCM is fabricated by nCHIP and is packaged within a 2 by 4 inch Al package from Coors. This flight computer module is one of three modules under development by NASA's Advanced Flight Computer (AFC) program. Further development of the Mass Memory and the programmable I/O MCM modules will follow. The three building block modules will then be stacked into a 3D MCM configuration. The mass and volume of the flight computer MCM achieved at 89 grams and 1.5 cubic inches respectively, represent a major enabling technology for future deep space as well as commercial remote sensing applications.

Packaging for Food Service

NASA Technical Reports Server (NTRS)

Stilwell, E. J.

1985-01-01

Most of the key areas of concern in packaging the three principle food forms for the space station were covered. It can be generally concluded that there are no significant voids in packaging materials availability or in current packaging technology. However, it must also be concluded that the process by which packaging decisions are made for the space station feeding program will be very synergistic. Packaging selection will depend heavily on the preparation mechanics, the preferred presentation and the achievable disposal systems. It will be important that packaging be considered as an integral part of each decision as these systems are developed.

Miniature biotelemeter gives multichannel wideband biomedical data

NASA Technical Reports Server (NTRS)

Carraway, J. B.

1972-01-01

A miniature biotelemeter was developed for sensing and transmitting multiple channels of biomedical data over a radio link. The design of this miniature, 10-channel, wideband (5 kHz/channel), pulse amplitude modulation/ frequency modulation biotelemeter takes advantage of modern device technology (e.g., integrated circuit operational amplifiers, complementary symmetry/metal oxide semiconductor logic, and solid state switches) and hybrid packaging techniques. The telemeter is being used to monitor 10 channels of neuron firings from specific regions of the brain in rats implanted with chronic electrodes. Design, fabrication, and testing of an engineering model biotelemeter are described.

System data communication structures for active-control transport aircraft, volume 1

NASA Technical Reports Server (NTRS)

Hopkins, A. L.; Martin, J. H.; Brock, L. D.; Jansson, D. G.; Serben, S.; Smith, T. B.; Hanley, L. D.

1981-01-01

Candidate data communication techniques are identified, including dedicated links, local buses, broadcast buses, multiplex buses, and mesh networks. The design methodology for mesh networks is then discussed, including network topology and node architecture. Several concepts of power distribution are reviewed, including current limiting and mesh networks for power. The technology issues of packaging, transmission media, and lightning are addressed, and, finally, the analysis tools developed to aid in the communication design process are described. There are special tools to analyze the reliability and connectivity of networks and more general reliability analysis tools for all types of systems.

Conduction-driven cooling of LED-based automotive LED lighting systems for abating local hot spots

NASA Astrophysics Data System (ADS)

Saati, Ferina; Arik, Mehmet

2018-02-01

Light-emitting diode (LED)-based automotive lighting systems pose unique challenges, such as dual-side packaging (front side for LEDs and back side for driver electronics circuit), size, harsh ambient, and cooling. Packaging for automotive lighting applications combining the advanced printed circuit board (PCB) technology with a multifunctional LED-based board is investigated with a focus on the effect of thermal conduction-based cooling for hot spot abatement. A baseline study with a flame retardant 4 technology, commonly known as FR4 PCB, is first compared with a metal-core PCB technology, both experimentally and computationally. The double-sided advanced PCB that houses both electronics and LEDs is then investigated computationally and experimentally compared with the baseline FR4 PCB. Computational models are first developed with a commercial computational fluid dynamics software and are followed by an advanced PCB technology based on embedded heat pipes, which is computationally and experimentally studied. Then, attention is turned to studying different heat pipe orientations and heat pipe placements on the board. Results show that conventional FR4-based light engines experience local hot spots (ΔT>50°C) while advanced PCB technology based on heat pipes and thermal spreaders eliminates these local hot spots (ΔT<10°C), leading to a higher lumen extraction with improved reliability. Finally, possible design options are presented with embedded heat pipe structures that further improve the PCB performance.

Application of Quality by Design (QbD) Principles to Extractables/Leachables Assessment. Establishing a Design Space for Terminally Sterilized Aqueous Drug Products Stored in a Plastic Packaging System.

PubMed

Jenke, Dennis

2010-01-01

The concept of quality by design (QbD) reflects the current global regulatory thinking related to pharmaceutical products. A cornerstone of the QbD paradigm is the concept of a design space, where the design space is a multidimensional combination of input variables and process parameters that have been demonstrated to provide the assurance of product quality. If a design space can be established for a pharmaceutical process or product, then operation within the design space confirms that the product or process output possesses the required quality attributes. This concept of design space can be applied to the safety (leachables) assessment of drug products manufactured and stored in packaging systems. Critical variables in such a design space would include those variables that affect the interaction of the drug product and its packaging, including (a) composition of the drug product, (b) composition of the packaging system, (c) configuration of the packaging system, and (d) the conditions of contact. This paper proposes and justifies such a leachables design space for aqueous drug products packaged in a specific plastic packaging system. Such a design space has the following boundaries:Aqueous drug products with a pH in the range of 2 to 8 and that contain no polarity-impacting agents such as organic solubilizers and stabilizers (addressing variable a). Packaging systems manufactured from materials that meet the system's existing material specifications (addressing variable b). Nominal fill volumes from 50 to 1000 mL (addressing variable c). Products subjected to terminal sterilization and then stored at room temperature for a period of up to 24 months (addressing variable d). The ramification of such a design space is that any drug product that falls within these boundaries is deemed to be compatible with the packaging system, from the perspective of safety, without the requirement of supporting drug product testing. When drug products are packaged in plastic container systems, substances may leach from the container and accumulate in the product. It is necessary that the drug product's vendor demonstrate that any such leaching does not occur to the extent that the leached substances adversely affect the product's safety and/or efficacy. One method for accomplishing this objective is via analysis of the drug product to identify and quantify the leached substances. When a particular packaging system is utilized for multiple drug products, one reaches the point, after testing numerous drug products, where the leaching properties of the packaging system are well known and readily predictable. In such a case, testing of additional products in the same packaging system produces no new information and thus becomes redundant and unnecessary. The quality by design (QbD) principle can be simply stated as follows: once a system has been tested to the extent that the test results are predictable, further testing can be replaced by establishing that the system was operating within a defined design space. The purpose of this paper is to demonstrate the application of QbD principles to a packaging system that has been utilized with over 12 parenteral drug products. The paper concludes that the leachables profile of all drug products that fit a certain description (the design space) is known and predicable.

Japan's technology and manufacturing infrastructure

NASA Astrophysics Data System (ADS)

Boulton, William R.; Meieran, Eugene S.; Tummala, Rao R.

1995-02-01

The JTEC panel found that, after four decades of development in electronics and manufacturing technologies, Japanese electronics companies are leaders in the development, support, and management of complex, low-cost packaging and assembly technologies used in the production of a broad range of consumer electronics products. The electronics industry's suppliers provide basic materials and equipment required for electronic packaging applications. Panelists concluded that some Japanese firms could be leading U.S. competitors by as much as a decade in these areas. Japan's technology and manufacturing infrastructure is an integral part of its microelectronics industry's success.

Japan's technology and manufacturing infrastructure

NASA Technical Reports Server (NTRS)

Boulton, William R.; Meieran, Eugene S.; Tummala, Rao R.

1995-01-01

The JTEC panel found that, after four decades of development in electronics and manufacturing technologies, Japanese electronics companies are leaders in the development, support, and management of complex, low-cost packaging and assembly technologies used in the production of a broad range of consumer electronics products. The electronics industry's suppliers provide basic materials and equipment required for electronic packaging applications. Panelists concluded that some Japanese firms could be leading U.S. competitors by as much as a decade in these areas. Japan's technology and manufacturing infrastructure is an integral part of its microelectronics industry's success.

Qualitative assessment of a Context of Consumption Framework to inform regulation of cigarette pack design in the U.S.

PubMed

Lee, Joseph G L; Averett, Paige E; Blanchflower, Tiffany; Gregory, Kyle R

2018-02-01

Researchers and regulators need to know how changes to cigarette packages can influence population health. We sought to advance research on the role of cigarette packaging by assessing a theory-informed framework from the fields of design and consumer research. The selected Context of Consumption Framework posits cognitive, affective, and behavioral responses to visual design. To assess the Framework's potential for guiding research on the visual design of cigarette packaging in the U.S., this study seeks to understand to what extent the Context of Consumption Framework converges with how adult smokers think and talk about cigarette pack designs. Data for this qualitative study came from six telephone-based focus groups conducted in March 2017. Two groups consisted of lesbian, gay, and bisexual participants; two groups of participants with less than four years college education; one group of LGB and straight identity; and one group the general population. All groups were selected for regional, gender, and racial/ethnic diversity. Participants (n=33) represented all nine U.S. Census divisions. We conducted a deductive qualitative analysis. Cigarette package designs captured the participants' attention, suggested the characteristics of the product, and reflected (or could be leveraged to convey) multiple dimensions of consumer identity. Particular to the affective responses to design, our participants shared that cigarette packaging conveyed how the pack could be used to particular ends, created an emotional response to the designs, complied with normative expectations of a cigarette, elicited interest when designs change, and prompted fascination when unique design characteristics are used. Use of the Context of Consumption Framework for cigarette product packaging design can inform regulatory research on tobacco product packaging. Researchers and regulators should consider multiple cognitive, affective, and behavioral responses to cigarette pack design.

The solid state detector technology for picosecond laser ranging

NASA Technical Reports Server (NTRS)

Prochazka, Ivan

1993-01-01

We developed an all solid state laser ranging detector technology, which makes the goal of millimeter accuracy achievable. Our design and construction philosophy is to combine the techniques of single photon ranging, ultrashort laser pulses, and fast fixed threshold discrimination while avoiding any analog signal processing within the laser ranging chain. The all solid state laser ranging detector package consists of the START detector and the STOP solid state photon counting module. Both the detectors are working in an optically triggered avalanche switching regime. The optical signal is triggering an avalanche current buildup which results in the generation of a uniform, fast risetime output pulse.

Comparison of TAPS Packages for Engineering

ERIC Educational Resources Information Center

Sidhu, S. Manjit

2008-01-01

Purpose: This paper aims to present the development of technology-assisted problem solving (TAPS) packages at University Tenaga Nasional (UNITEN). The project is the further work of the development of interactive multimedia based packages targeted for students having problems in understanding the subject of engineering mechanics dynamics.…

10 CFR 431.92 - Definitions concerning commercial air conditioners and heat pumps.

Code of Federal Regulations, 2014 CFR

2014-01-01

... measurement. Commercial package air-conditioning and heating equipment means air-cooled, water-cooled... Conditioner means a basic model of commercial package air-conditioning and heating equipment (packaged or split) that is: Used in computer rooms, data processing rooms, or other information technology cooling...

Using a Computerised Graphics Package to Achieve a Technology-Oriented Classroom

ERIC Educational Resources Information Center

Aladejana, Francisca; Idowu, Lanre

2009-01-01

The present situation in Nigeria involves students of fine arts, a practical-oriented subject, being exposed to poor methods of teaching with consequent poor performances. This study examined the extent to which the use of a computerised graphics package could make the classroom technology-oriented and affect the performance of learners. This is…

Screening technologies for detection of swallowed packages of narcotics

NASA Astrophysics Data System (ADS)

Burnett, Lowell J.; Magnuson, Erik E.; Sheldon, Alan G.; Kumar, Sankaran

1997-01-01

An increasingly popular method of transporting modest quantities of narcotics across international borders is to employ 'swallowers'. These are people who typically enter the country as international airline passengers after swallowing small, water-tight packages of heroin and/or cocaine. Rapid and accurate identification of swallowers in the airport environment poses difficult technical changes. Commonly used medical inspection technologies fall into one of two categories. Either they are unsuitable for widespread use, or they do not provide adequate information. An example of the former is x-ray scanning, while an example of the latter is ultrasonic imaging. Quantum Magnetics has developed a system to screen selected airline passengers for the presence of swallowed narcotics. The system utilizes magnetic resonance, which provides the physical basis for the magnetic resonance imaging systems widely used in the medical community as an alternative to x-rays. The system is currently operational, and laboratory performance testing is complete. Both the design of the system and its performance will be discussed. This work was sponsored in part by the Office of National Drug Control Policy and the US Customs Service.

Investigation of Slosh Dynamics on Flight and Ground Platforms

NASA Astrophysics Data System (ADS)

Vergalla, Michael; Zhou, Ran

The slosh dynamics in cryogenic fuel tanks under microgravity is a problem that severely affects the reliability of spacecraft launching. To investigate slosh dynamics and their effects on space vehicle dynamics three levels of testing are presently in progress. Platforms include a 3-DOF ground testing table, parabolic flights, sounding rockets and finally the International Space Station. Ground tests provide an economically viable platform for investigating rotational, translational, and coupled feed-back modes due to repeatable CNC motions. The parabolic flight campaign has conducted four successful flights aboard multiple aircraft using static and tethered slosh packages. Using the PANTHER II student designed rocket, a slosh package was launched as a payload. Finally with collaboration between Florida Institute of Technology and Massachusetts Institute of Technology SPHERES project, two test sessions investigating feedback using partially and fully filled propellant tanks have been completed aboard the In-ternational Space Station. Motion data from all tests will be input to in house Dynamic Mesh Model to further establish confidence in the versatility and accuracy of the method. The results show that it is necessary to construct additional hardware for slosh studies.

Automated Work Packages Prototype: Initial Design, Development, and Evaluation. Light Water Reactor Sustainability Program

DOE Office of Scientific and Technical Information (OSTI.GOV)

Oxstrand, Johanna Helene; Ahmad Al Rashdan; Le Blanc, Katya Lee

The goal of the Automated Work Packages (AWP) project is to demonstrate how to enhance work quality, cost management, and nuclear safety through the use of advanced technology. The work described in this report is part of the digital architecture for a highly automated plant project of the technical program plan for advanced instrumentation, information, and control (II&C) systems technologies. This report addresses the DOE Milestone M2LW-15IN0603112: Describe the outcomes of field evaluations/demonstrations of the AWP prototype system and plant surveillance and communication framework requirements at host utilities. A brief background to the need for AWP research is provided, thenmore » two human factors field evaluation studies are described. These studies focus on the user experience of conducting a task (in this case a preventive maintenance and a surveillance test) while using an AWP system. The remaining part of the report describes an II&C effort to provide real time status updates to the technician by wireless transfer of equipment indications and a dynamic user interface.« less

Advances in Structures for Large Space Systems

NASA Technical Reports Server (NTRS)

Belvin, W. Keith

2004-01-01

The development of structural systems for scientific remote sensing and space exploration has been underway for four decades. The seminal work from 1960 to 1980 provided the basis for many of the design principles of modern space systems. From 1980- 2000 advances in active materials and structures and the maturing of composites technology led to high precision active systems such those used in the Space Interferometry Mission. Recently, thin-film membrane or gossamer structures are being investigated for use in large area space systems because of their low mass and high packaging efficiency. Various classes of Large Space Systems (LSS) are defined in order to describe the goals and system challenges in structures and materials technologies. With an appreciation of both past and current technology developments, future technology challenges are used to develop a list of technology investments that can have significant impacts on LSS development.

26 CFR 1.263(a)-4 - Amounts paid to acquire or create intangibles.

Code of Federal Regulations, 2013 CFR

2013-04-01

... the meaning of this paragraph (b)(3). (v) Creation of package design. Amounts paid to develop a package design are treated as amounts that do not create a separate and distinct intangible asset within the meaning of this paragraph (b)(3). For purposes of this section, the term package design means the...

26 CFR 1.263(a)-4 - Amounts paid to acquire or create intangibles.

Code of Federal Regulations, 2014 CFR

2014-04-01

... the meaning of this paragraph (b)(3). (v) Creation of package design. Amounts paid to develop a package design are treated as amounts that do not create a separate and distinct intangible asset within the meaning of this paragraph (b)(3). For purposes of this section, the term package design means the...

26 CFR 1.263(a)-4 - Amounts paid to acquire or create intangibles.

Code of Federal Regulations, 2012 CFR

2012-04-01

... the meaning of this paragraph (b)(3). (v) Creation of package design. Amounts paid to develop a package design are treated as amounts that do not create a separate and distinct intangible asset within the meaning of this paragraph (b)(3). For purposes of this section, the term package design means the...

49 CFR 173.466 - Additional tests for Type A packagings designed for liquids and gases.

Code of Federal Regulations, 2010 CFR

2010-10-01

... for liquids and gases. 173.466 Section 173.466 Transportation Other Regulations Relating to...) Materials § 173.466 Additional tests for Type A packagings designed for liquids and gases. (a) In addition to the tests prescribed in § 173.465, Type A packagings designed for liquids and gases must be...

49 CFR 173.466 - Additional tests for Type A packagings designed for liquids and gases.

Code of Federal Regulations, 2011 CFR

2011-10-01

... for liquids and gases. 173.466 Section 173.466 Transportation Other Regulations Relating to...) Materials § 173.466 Additional tests for Type A packagings designed for liquids and gases. (a) In addition to the tests prescribed in § 173.465, Type A packagings designed for liquids and gases must be...

49 CFR 173.466 - Additional tests for Type A packagings designed for liquids and gases.

Code of Federal Regulations, 2012 CFR

2012-10-01

... for liquids and gases. 173.466 Section 173.466 Transportation Other Regulations Relating to...) Materials § 173.466 Additional tests for Type A packagings designed for liquids and gases. (a) In addition to the tests prescribed in § 173.465, Type A packagings designed for liquids and gases must be...

49 CFR 173.466 - Additional tests for Type A packagings designed for liquids and gases.

Code of Federal Regulations, 2013 CFR

2013-10-01

... for liquids and gases. 173.466 Section 173.466 Transportation Other Regulations Relating to...) Materials § 173.466 Additional tests for Type A packagings designed for liquids and gases. (a) In addition to the tests prescribed in § 173.465, Type A packagings designed for liquids and gases must be...

49 CFR 173.466 - Additional tests for Type A packagings designed for liquids and gases.

Code of Federal Regulations, 2014 CFR

2014-10-01

... for liquids and gases. 173.466 Section 173.466 Transportation Other Regulations Relating to...) Materials § 173.466 Additional tests for Type A packagings designed for liquids and gases. (a) In addition to the tests prescribed in § 173.465, Type A packagings designed for liquids and gases must be...

XAPiir: A recursive digital filtering package

DOE Office of Scientific and Technical Information (OSTI.GOV)

Harris, D.

1990-09-21

XAPiir is a basic recursive digital filtering package, containing both design and implementation subroutines. XAPiir was developed for the experimental array processor (XAP) software package, and is written in FORTRAN. However, it is intended to be incorporated into any general- or special-purpose signal analysis program. It replaces the older package RECFIL, offering several enhancements. RECFIL is used in several large analysis programs developed at LLNL, including the seismic analysis package SAC, several expert systems (NORSEA and NETSEA), and two general purpose signal analysis packages (SIG and VIEW). This report is divided into two sections: the first describes the use ofmore » the subroutine package, and the second, its internal organization. In the first section, the filter design problem is briefly reviewed, along with the definitions of the filter design parameters and their relationship to the subroutine input parameters. In the second section, the internal organization is documented to simplify maintenance and extensions to the package. 5 refs., 9 figs.« less

Naval Waste Package Design Sensitivity

DOE Office of Scientific and Technical Information (OSTI.GOV)

T. Schmitt

2006-12-13

The purpose of this calculation is to determine the sensitivity of the structural response of the Naval waste packages to varying inner cavity dimensions when subjected to a comer drop and tip-over from elevated surface. This calculation will also determine the sensitivity of the structural response of the Naval waste packages to the upper bound of the naval canister masses. The scope of this document is limited to reporting the calculation results in terms of through-wall stress intensities in the outer corrosion barrier. This calculation is intended for use in support of the preliminary design activities for the license applicationmore » design of the Naval waste package. It examines the effects of small changes between the naval canister and the inner vessel, and in these dimensions, the Naval Long waste package and Naval Short waste package are similar. Therefore, only the Naval Long waste package is used in this calculation and is based on the proposed potential designs presented by the drawings and sketches in References 2.1.10 to 2.1.17 and 2.1.20. All conclusions are valid for both the Naval Long and Naval Short waste packages.« less

Innovative on-chip packaging applied to uncooled IRFPA

NASA Astrophysics Data System (ADS)

Dumont, Geoffroy; Arnaud, Agnès; Imperinetti, Pierre; Mottin, Eric; Simoens, François; Vialle, Claire; Rabaud, Wilfried; Grand, Gilles; Baclet, Nathalie

2008-03-01

The Laboratoire Infrarouge (LIR) of the Laboratoire d'Electronique et de Technologie de l'Information (LETI) has been involved in the development of microbolometers for over fifteen years. Two generations of technology have been transferred to ULIS and LETI is still working to improve performances of low cost detectors. Simultaneously, packaging still represents a significant part of detectors price. Reducing production costs would contribute to keep on extending applications of uncooled IRFPA to high volume markets like automotive. Therefore LETI develops an onchip packaging technology dedicated to microbolometers. The efficiency of a micropackaging technology for microbolometers relies on two major technical specifications. First, it must include an optical window with a high transmittance for the IR band, so as to maximize the detector absorption. Secondly, in order to preserve the thermal insulation of the detector, the micropackaging must be hermetically closed to maintain a vacuum level lower than 10 -3mbar. This paper presents an original microcap structure that enables the use of IR window materials as sealing layers to maintain the expected vacuum level. The modelling and integration of an IR window suitable for this structure is also presented. This zero level packaging technology is performed in a standard collective way, in continuation of bolometers' technology. The CEA-LETI, MINATEC presents status of these developments concerning this innovating technology including optical simulations results and SEM views of technical realizations.

Canputer Science and Technology: Introduction to Software Packages

DTIC Science & Technology

1984-04-01

Table 5 Sources of Software Packages.20 Table 6 Reference Services Matrix . 33 Table 7 Reference Matrix.40 LIST OF FIGURES Figure 1 Document...consideration should be given to the acquisition of appropriate software packages to replace or upgrade existing services and to provide services not...Consequently, there are many companies that produce only software packages, and are committed to providing training, service , and support. These vendors

Short communication: Effect of active food packaging materials on fluid milk quality and shelf life.

PubMed

Wong, Dana E; Goddard, Julie M

2014-01-01

Active packaging, in which active agents are embedded into or on the surface of food packaging materials, can enhance the nutritive value, economics, and stability of food, as well as enable in-package processing. In one embodiment of active food packaging, lactase was covalently immobilized onto packaging films for in-package lactose hydrolysis. In prior work, lactase was covalently bound to low-density polyethylene using polyethyleneimine and glutaraldehyde cross-linkers to form the packaging film. Because of the potential contaminants of proteases, lipases, and spoilage organisms in typical enzyme preparations, the goal of the current work was to determine the effect of immobilized-lactase active packaging technology on unanticipated side effects, such as shortened shelf-life and reduced product quality. Results suggested no evidence of lipase or protease activity on the active packaging films, indicating that such active packaging films could enable in-package lactose hydrolysis without adversely affecting product quality in terms of dairy protein or lipid stability. Storage stability studies indicated that lactase did not migrate from the film over a 49-d period, and that dry storage resulted in 13.41% retained activity, whereas wet storage conditions enabled retention of 62.52% activity. Results of a standard plate count indicated that the film modification reagents introduced minor microbial contamination; however, the microbial population remained under the 20,000 cfu/mL limit through the manufacturer's suggested 14-d storage period for all film samples. This suggests that commercially produced immobilized lactase active packaging should use purified cross-linkers and enzymes. Characterization of unanticipated effects of active packaging on food quality reported here is important in demonstrating the commercial potential of such technologies. Copyright © 2014 American Dairy Science Association. Published by Elsevier Inc. All rights reserved.

[Environmental investigation of ground water contamination at Wright-Patterson Air Force Base, Ohio]. Volume 9, Removal action system design

DOE Office of Scientific and Technical Information (OSTI.GOV)

Not Available

1992-04-01

This Removal Action System Design has been prepared as a Phase I Volume for the implementation of the Phase II removal action at Wright-Patterson Air Force Base (WPAFB) near Dayton, Ohio. The objective of the removal action is to prevent, to the extent practicable, the migration of ground water contaminated with chlorinated volatile organic compounds (VOCS) across the southwest boundary of Area C. The Phase 1, Volume 9 Removal Action System Design compiles the design documents prepared for the Phase II Removal Action. These documents, which are presented in Appendices to Volume 9, include: Process Design, which presents the 30more » percent design for the ground water treatment system (GWTS); Design Packages 1 and 2 for Earthwork and Road Construction, and the Discharge Pipeline, respectively; no drawings are included in the appendix; Design Package 3 for installation of the Ground Water Extraction Well(s); Design Package 4 for installation of the Monitoring Well Instrumentation; and Design Package 5 for installation of the Ground Water Treatment System; this Design Package is incorporated by reference because of its size.« less

Design of coin sorter counter based on MCU

NASA Astrophysics Data System (ADS)

Yang, Yahan; Si, Xu

2018-04-01

With unmanned tickets, vending machines promotion, greatly increased the circulation of coins, especially bus companies, the financial sector need to classify a large number of coins every day, inventory, a huge workload. The design of the microcontroller as the control center, combined with the sensor technology and the corresponding mechanical structure to complete the separation of coins and finishing the packaging work and real-time monitoring and display of the type and number of coins function, this article details the system hardware and software design, and The test adjustment shows that the system can achieve the function of separating and sorting coins and monitoring the type and quantity of coins displayed on the coin.

An evaluation of the effectiveness of FreshCase technology to extend the storage life of whole muscle beef and ground beef.

PubMed

Yang, X; Woerner, D R; Hasty, J D; McCullough, K R; Geornaras, I; Sofos, J N; Belk, K E

2016-11-01

The objective of this study was to identify the maximum time of refrigerated storage before aerobic psychrotrophic bacteria (APB) grew to a level indicative of spoilage (7 log cfu/g) or other indicators of spoilage were observed for whole muscle beef and ground beef packaged using FreshCase technology. Storage life for beef steaks stored in FreshCase packages at 4°C was 36 d, with ground beef stored in FreshCase packages at 4°C lasting 10 d. Additionally, greater ( < 0.05) a* (redness) values were detected in FreshCase packaged samples of both beef steaks and ground beef over storage time. At the point of spoilage, off-odors were detected at very low levels in all samples along with low thiobarbituric acid values (< 2 mg malonaldehyde/kg). Therefore, use of FreshCase technology in whole muscle beef and ground beef is a viable option to extend storage life.

Packaging and testing of multi-wavelength DFB laser array using REC technology

NASA Astrophysics Data System (ADS)

Ni, Yi; Kong, Xuan; Gu, Xiaofeng; Chen, Xiangfei; Zheng, Guanghui; Luan, Jia

2014-02-01

Packaging of distributed feedback (DFB) laser array based on reconstruction-equivalent-chirp (REC) technology is a bridge from chip to system, and influences the practical process of REC chip. In this paper, DFB laser arrays of 4-channel @1310 nm and 8-channel @1550 nm are packaged. Our experimental results show that both these laser arrays have uniform wavelength spacing and larger than 35 dB average Side Mode Suppression Ratio (SMSR). When I=35 mA, we obtain the total output power of 1 mW for 4-channel @1310 nm, and 227 μw for 8-channel @1550 nm respectively. The high frequency characteristics of the packaged chips are also obtained, and the requirements for 4×10 G or even 8×10 G systems can be reached. Our results demonstrate the practical and low cost performance of REC technology and indicate its potential in the future fiber-to-the-home (FTTH) application.

Ten-channel InP-based large-scale photonic integrated transmitter fabricated by SAG technology

NASA Astrophysics Data System (ADS)

Zhang, Can; Zhu, Hongliang; Liang, Song; Cui, Xiao; Wang, Huitao; Zhao, Lingjuan; Wang, Wei

2014-12-01

A 10-channel InP-based large-scale photonic integrated transmitter was fabricated by selective area growth (SAG) technology combined with butt-joint regrowth (BJR) technology. The SAG technology was utilized to fabricate the electroabsorption modulated distributed feedback (DFB) laser (EML) arrays at the same time. The design of coplanar electrodes for electroabsorption modulator (EAM) was used for the flip-chip bonding package. The lasing wavelength of DFB laser could be tuned by the integrated micro-heater to match the ITU grids, which only needs one electrode pad. The average output power of each channel is 250 μW with an injection current of 200 mA. The static extinction ratios of the EAMs for 10 channels tested are ranged from 15 to 27 dB with a reverse bias of 6 V. The frequencies of 3 dB bandwidth of the chip for each channel are around 14 GHz. The novel design and simple fabrication process show its enormous potential in reducing the cost of large-scale photonic integrated circuit (LS-PIC) transmitter with high chip yields.

Nanotechnology: An Untapped Resource for Food Packaging.

PubMed

Sharma, Chetan; Dhiman, Romika; Rokana, Namita; Panwar, Harsh

2017-01-01

Food commodities are packaged and hygienically transported to protect and preserve them from any un-acceptable alteration in quality, before reaching the end-consumer. Food packaging continues to evolve along-with the innovations in material science and technology, as well as in light of consumer's demand. Presently, the modern consumers of competitive economies demands for food with natural quality, assured safety, minimal processing, extended shelf-life and ready-to-eat concept. Innovative packaging systems, not only ascertains transit preservation and effective distribution, but also facilitates communication at the consumer levels. The technological advances in the domain of food packaging in twenty-first century are mainly chaired by nanotechnology, the science of nano-materials. Nanotechnology manipulates and creates nanometer scale materials, of commercial and scientific relevance. Introduction of nanotechnology in food packaging sector has significantly addressed the food quality, safety and stability concerns. Besides, nanotechnology based packaging intimate's consumers about the real time quality of food product. Additionally, nanotechnology has been explored for controlled release of preservatives/antimicrobials, extending the product shelf life within the package. The promising reports for nanotechnology interventions in food packaging have established this as an independent priority research area. Nanoparticles based food packages offer improved barrier and mechanical properties, along with food preservation and have gained welcoming response from market and end users. In contrary, recent advances and up-liftment in this area have raised various ethical, environmental and safety concerns. Policies and regulation regarding nanoparticles incorporation in food packaging are being reviewed. This review presents the existing knowledge, recent advances, concerns and future applications of nanotechnology in food packaging sector.

Nanotechnology: An Untapped Resource for Food Packaging

PubMed Central

Sharma, Chetan; Dhiman, Romika; Rokana, Namita; Panwar, Harsh

2017-01-01

Food commodities are packaged and hygienically transported to protect and preserve them from any un-acceptable alteration in quality, before reaching the end-consumer. Food packaging continues to evolve along-with the innovations in material science and technology, as well as in light of consumer's demand. Presently, the modern consumers of competitive economies demands for food with natural quality, assured safety, minimal processing, extended shelf-life and ready-to-eat concept. Innovative packaging systems, not only ascertains transit preservation and effective distribution, but also facilitates communication at the consumer levels. The technological advances in the domain of food packaging in twenty-first century are mainly chaired by nanotechnology, the science of nano-materials. Nanotechnology manipulates and creates nanometer scale materials, of commercial and scientific relevance. Introduction of nanotechnology in food packaging sector has significantly addressed the food quality, safety and stability concerns. Besides, nanotechnology based packaging intimate's consumers about the real time quality of food product. Additionally, nanotechnology has been explored for controlled release of preservatives/antimicrobials, extending the product shelf life within the package. The promising reports for nanotechnology interventions in food packaging have established this as an independent priority research area. Nanoparticles based food packages offer improved barrier and mechanical properties, along with food preservation and have gained welcoming response from market and end users. In contrary, recent advances and up-liftment in this area have raised various ethical, environmental and safety concerns. Policies and regulation regarding nanoparticles incorporation in food packaging are being reviewed. This review presents the existing knowledge, recent advances, concerns and future applications of nanotechnology in food packaging sector. PMID:28955314

Single-Case Experimental Designs to Evaluate Novel Technology-Based Health Interventions

PubMed Central

Cassidy, Rachel N; Raiff, Bethany R

2013-01-01

Technology-based interventions to promote health are expanding rapidly. Assessing the preliminary efficacy of these interventions can be achieved by employing single-case experiments (sometimes referred to as n-of-1 studies). Although single-case experiments are often misunderstood, they offer excellent solutions to address the challenges associated with testing new technology-based interventions. This paper provides an introduction to single-case techniques and highlights advances in developing and evaluating single-case experiments, which help ensure that treatment outcomes are reliable, replicable, and generalizable. These advances include quality control standards, heuristics to guide visual analysis of time-series data, effect size calculations, and statistical analyses. They also include experimental designs to isolate the active elements in a treatment package and to assess the mechanisms of behavior change. The paper concludes with a discussion of issues related to the generality of findings derived from single-case research and how generality can be established through replication and through analysis of behavioral mechanisms. PMID:23399668

49 CFR 178.905 - Large Packaging identification codes.

Code of Federal Regulations, 2010 CFR

2010-10-01

... 49 Transportation 2 2010-10-01 2010-10-01 false Large Packaging identification codes. 178.905... FOR PACKAGINGS Large Packagings Standards § 178.905 Large Packaging identification codes. Large packaging code designations consist of: two numerals specified in paragraph (a) of this section; followed by...

Development and Industrialization of InGaN/GaN LEDs on Patterned Sapphire Substrates for Low Cost Emitter Architecture

DOE Office of Scientific and Technical Information (OSTI.GOV)

Flemish, Joseph; Soer, Wouter

2015-11-30

Patterned sapphire substrate (PSS) technology has proven to be an effective approach to improve efficacy and reduce cost of light-emitting diodes (LEDs). The volume emission from the transparent substrate leads to high package efficiency, while the simple and robust architecture of PSS-based LEDs enables low cost. PSS substrates have gained wide use in mid-power LEDs over the past years. In this project, Lumileds has developed and industrialized PSS and epitaxy technology for high- power flip-chip LEDs to bring these benefits to a broader range of applications and accelerate the adoption of energy-efficient solid-state lighting (SSL). PSS geometries were designed formore » highly efficient light extraction in a flip-chip architecture and high-volume manufacturability, and corresponding sapphire patterning and epitaxy manufacturing processes were integrally developed. Concurrently, device and package architectures were developed to take advantage of the PSS flip-chip die in different types of products that meet application needs. The developed PSS and epitaxy technology has been fully implemented in manufacturing at Lumileds’ San Jose, CA location, and incorporated in illumination-grade LED products that have been successfully introduced to the market, including LUXEON Q and LUXEON FlipChip White.« less

Drag-Free Performance of the ST7 Disturbance Reduction System Flight Experiment on the LISA Pathfinder

NASA Technical Reports Server (NTRS)

Maghami, Peiman; O'Donnell, James, Jr.; Hsu, Oscar; Ziemer, John; Dunn, Charles

2017-01-01

The Space Technology-7 Disturbance Reduction System (DRS) is an experiment package aboard the European Space Agency (ESA) LISA Pathfinder spacecraft. LISA Pathfinder launched from Kourou, French Guiana on December 3, 2015. The DRS is tasked to validate two specific technologies: colloidal micro-Newton thrusters (CMNT) to provide low-noise control capability of the spacecraft, and drag-free control flight. This validation is performed using highly sensitive drag-free sensors, which are provided by the LISA Technology Package of the European Space Agency. The Disturbance Reduction System is required to maintain the spacecrafts position with respect to a free-floating test mass to better than 10nmHz, along its sensitive axis (axis in optical metrology). It also has a goal of limiting the residual accelerations of any of the two test masses to below 30 (1 + [f3 mHz]) fmsHz, over the frequency range of 1 to 30 mHz.This paper briefly describes the design and the expected on-orbit performance of the control system for the two modes wherein the drag-free performance requirements are verified. The on-orbit performance of these modes are then compared to the requirements, as well as to the expected performance, and discussed.

Surface acoustic wave resonators

NASA Astrophysics Data System (ADS)

Avitabile, Gianfranco; Roselli, Luca; Atzeni, Carlo; Manes, Gianfranco

1991-10-01

The development of surface acoustic wave (SAW) resonators is reviewed with attention given to the design of a simulation package for CAD-assisted SAW resonator design. Basic design configurations and operation parameters are set forth for the SAW resonators including the phase of the reflection factor, evaluation of the stopband center frequency, stopband width, and the free propagation speed. The use of synchronous designs is shown to reduce device sensitivity to variations in the technological process but generate higher insertion losses. The existence of transverse modes and propagation losses is shown to affect the rejection of spurious modes and the achievement of low insertion losses. Several SAW resonators are designed and fabricated with the CAD process, and the resonators in the VHF-UHF bands perform in a manner predicted by simulated results.

NGST Yardstick Integrated Science Instrument Module (ISIM) Feasibility Study

NASA Astrophysics Data System (ADS)

Greenhouse, M. A.; Dipirro, M.; Federline, B.; Gardner, Jonathan P.; Guy, P.; Hagopian, J.; Hein, J.; Jurotich, M.; Lawrence, J.; Martineau, B.; Mather, J. C.; Mentzell, E.; Satyapal, S.; Stanley, D.; Teplitz, H. I.; Travis, J.; Bely, P.; Petro, L. D.; Stockman, P.; Burg, R.; Bitzel, R.

1998-12-01

We display portions of the baseline design concept for the NGST Integrated Science Instrument Module (ISIM). This ISIM design is under ongoing development for integration with the "Yardstick" and other NGST 8 m architectures that are intended for packaging in an EELV or Ariane 5 meter class fairing. The goals of this activity are to: [1] demonstrate mission science feasibility, [2] identify ISIM technology challenge areas, [3] assess ISIM engineering and cost feasibility, [5] identify ISIM/NGST interface constraints, and [6] enable smart customer procurement of the ISIM. In this poster, we display a snap shot of work in progress including: optical design, opto-mechanical layout, thermal modeling, focal plane array design, and electronics design. Ongoing progress can be monitored via ISIM team web site: http://ngst.gsfc.nasa.gov/

Requirements for Designing Life Support System Architectures for Crewed Exploration Missions Beyond Low-Earth Orbit

NASA Technical Reports Server (NTRS)

Howard, David; Perry,Jay; Sargusingh, Miriam; Toomarian, Nikzad

2016-01-01

NASA's technology development roadmaps provide guidance to focus technological development on areas that enable crewed exploration missions beyond low-Earth orbit. Specifically, the technology area roadmap on human health, life support and habitation systems describes the need for life support system (LSS) technologies that can improve reliability and in-situ maintainability within a minimally-sized package while enabling a high degree of mission autonomy. To address the needs outlined by the guiding technology area roadmap, NASA's Advanced Exploration Systems (AES) Program has commissioned the Life Support Systems (LSS) Project to lead technology development in the areas of water recovery and management, atmosphere revitalization, and environmental monitoring. A notional exploration LSS architecture derived from the International Space has been developed and serves as the developmental basis for these efforts. Functional requirements and key performance parameters that guide the exploration LSS technology development efforts are presented and discussed. Areas where LSS flight operations aboard the ISS afford lessons learned that are relevant to exploration missions are highlighted.

Biomass power for rural development. Technical progress report, January 1--March 31, 1998

DOE Office of Scientific and Technical Information (OSTI.GOV)

Neuhauser, E.

Brief progress reports are presented on the following tasks: design packages for retrofits at the Dunkirk Station; fuel supply and site development plans; major equipment guarantees and project risk sharing; power production commitment; power plant site plan, construction and environmental permits; and experimental strategies for system evaluation. The paper then discusses in more detail the following: feedstock development efforts; clone-site testing and genetic studies; and efforts at outreach, extension and technology transfer.

Global Combat Support System-Marine Corps Proof-of-Concept for Dashboard Analytics

DTIC Science & Technology

2014-12-01

The core is modern, commercial-off-the-shelf enterprise resource planning ( ERP ) software (Oracle 11i e-Business Suite). GCSS-MCs design is focused...factor in the decision to implement this new software . GCSS-MC is the technology centerpiece of the Logistics Modernization (LogMod) Program...GCSS-MC is based on the implementation of Oracle e-Business Suite 11i as the core software package. This is the same infrastructure that Oracle

Microwave power transmission system studies. Volume 3, section 8: Mechanical systems and flight operations

NASA Technical Reports Server (NTRS)

Maynard, O. E.; Brown, W. C.; Edwards, A.; Haley, J. T.; Meltz, G.; Howell, J. M.; Nathan, A.

1975-01-01

The efforts and recommendations associated with preliminary design and concept definition for mechanical systems and flight operations are presented. Technical discussion in the areas of mission analysis, antenna structural concept, configuration analysis, assembly and packaging with associated costs are presented. Technology issues for the control system, structural system, thermal system and assembly including cost and man's role in assembly and maintenance are identified. Background and desired outputs for future efforts are discussed.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Li, Meimei; Natesan, K.; Chen, Wei-Ying

This report provides an update on the understanding of the effect of sodium exposures on microstructure and tensile properties of Grade 91 (G91) steel in support of the design and operation of G91 components in sodium-cooled fast reactors (SFRs). The report is a Level 3 deliverable in FY17 (M3AT-17AN1602018), under the Work Package AT-17AN160201, “SFR Materials Testing” performed by the Argonne National Laboratory (ANL), as part of the Advanced Reactor Technologies Program.

Erectable/deployable concepts for large space system technology

NASA Technical Reports Server (NTRS)

Agan, W. E.

1980-01-01

Erectable/deployable space structure concepts particularly relating to the development of a science and applications space platform are presented. Design and operating features for an automatic coupler clevis joint, a side latching detent joint, and a module-to-module auto lock coupler are given. An analysis of the packaging characteristics of stacked subassembly, single fold, hybrid, and double fold concepts is given for various platform structure configurations. Payload carrier systems and assembly techniques are also discussed.

Design Package for Fuel Retrieval System Fuel Handling Tool Modification

DOE Office of Scientific and Technical Information (OSTI.GOV)

TEDESCHI, D.J.

This design package documents design, fabrication, and testing of new stinger tool design. Future revisions will document further development of the stinger tool and incorporate various developmental stages, and final test results.

Optical network of silicon micromachined sensors

NASA Astrophysics Data System (ADS)

Wilson, Mark L.; Burns, David W.; Zook, J. David

1996-03-01

The Honeywell Technology Center, in collaboration with the University of Wisconsin and the Mobil Corporation, and under funding from this ARPA sponsored program, are developing a new type of `hybrid' micromachined silicon/fiber optic sensor that utilizes the best attributes of each technology. Fiber optics provide a noise free method to read out the sensor without electrical power required at the measurement point. Micromachined silicon sensor techniques provide a method to design many different types of sensors such as temperature, pressure, acceleration, or magnetic field strength and report the sensor data using FDM methods. Our polysilicon resonant microbeam structures have a built in Fabry-Perot interferometer that offers significant advantages over other configurations described in the literature. Because the interferometer is an integral part of the structure, the placement of the fiber becomes non- critical, and packaging issues become considerably simpler. The interferometer spacing are determined by the thin-film fabrication processes and therefore can be extremely well controlled. The main advantage, however, is the integral vacuum cavity that ensures high Q values. Testing results have demonstrated relaxed alignment tolerances in packaging these devices, with an excellent Signal to Noise Ratio. Networks of 16 or more sensors are currently being developed. STORM (Strain Transduction by Optomechanical Resonant Microbeams) sensors can also provide functionality and self calibration information which can be used to improve the overall system reliability. Details of the sensor and network design, as well as test results, are presented.

Lightweight Inflatable Solar Array: Providing a Flexible, Efficient Solution to Space Power Systems for Small Spacecraft

NASA Technical Reports Server (NTRS)

Johnson, Les; Fabisinski, Leo; Justice, Stefanie

2014-01-01

Affordable and convenient access to electrical power is critical to consumers, spacecraft, military and other applications alike. In the aerospace industry, an increased emphasis on small satellite flights and a move toward CubeSat and NanoSat technologies, the need for systems that could package into a small stowage volume while still being able to power robust space missions has become more critical. As a result, the Marshall Space Flight Center's Advanced Concepts Office identified a need for more efficient, affordable, and smaller space power systems to trade in performing design and feasibility studies. The Lightweight Inflatable Solar Array (LISA), a concept designed, prototyped, and tested at the NASA Marshall Space Flight Center (MSFC) in Huntsville, Alabama provides an affordable, lightweight, scalable, and easily manufactured approach for power generation in space or on Earth. This flexible technology has many wide-ranging applications from serving small satellites to soldiers in the field. By using very thin, ultraflexible solar arrays adhered to an inflatable structure, a large area (and thus large amount of power) can be folded and packaged into a relatively small volume (shown in artist rendering in Figure 1 below). The proposed presentation will provide an overview of the progress to date on the LISA project as well as a look at its potential, with continued development, to revolutionize small spacecraft and portable terrestrial power systems.

Technology transfer initiatives

NASA Technical Reports Server (NTRS)

Mccain, Wayne; Schroer, Bernard J.; Ziemke, M. Carl

1994-01-01

This report summarizes the University of Alabama in Huntsville (UAH) technology transfer activities with the Marshall Space Flight Center (MSFC) for the period of April 1993 through December 1993. Early in 1993, the MSFC/TUO and UAH conceived of the concept of developing stand-alone, integrated data packages on MSFC technology that would serve industrial needs previously determined to be critical. Furthermore, after reviewing over 500 problem statements received by MSFC, it became obvious that many of these requests could be satisfied by a standard type of response. As a result, UAH has developed two critical area response (CAR) packages: CFC (chlorofluorocarbon) replacements and modular manufacturing and simulation. Publicity included news releases, seminars, articles and conference papers. The Huntsville Chamber of Commerce established the Technology Transfer Subcommittee with the charge to identify approaches for the Chamber to assist its members, as well as non-members, access to the technologies at the federal laboratories in North Alabama. The Birmingham Chamber of Commerce has expressed interest in establishing a similar technology transfer program. This report concludes with a section containing a tabulation of the problem statements, including CAR packages, submitted to MSFC from January 1992 through December 1993.

Sleeper Cab Climate Control Load Reduction for Long-Haul Truck Rest Period Idling

DOE Office of Scientific and Technical Information (OSTI.GOV)

Lustbader, J. A.; Kreutzer, C.; Adelman, S.

2015-04-29

Annual fuel use for long-haul truck rest period idling is estimated at 667 million gallons in the United States. The U.S. Department of Energy’s National Renewable Energy Laboratory’s CoolCab project aims to reduce heating, ventilating, and air conditioning (HVAC) loads and resulting fuel use from rest period idling by working closely with industry to design efficient long-haul truck climate control systems while maintaining occupant comfort. Enhancing the thermal performance of cab/sleepers will enable smaller, lighter, and more cost-effective idle reduction solutions. In order for candidate idle reduction technologies to be implemented at the original equipment manufacturer and fleet level, theirmore » effectiveness must be quantified. To address this need, a number of promising candidate technologies were evaluated through experimentation and modeling to determine their effectiveness in reducing rest period HVAC loads. For this study, load reduction strategies were grouped into the focus areas of solar envelope, occupant environment, and conductive pathways. The technologies selected for a complete-cab package of technologies were “ultra-white” paint, advanced insulation, and advanced curtains. To measure the impact of these technologies, a nationally-averaged solar-weighted reflectivity long-haul truck paint color was determined and applied to the baseline test vehicle. Using the complete-cab package of technologies, electrical energy consumption for long-haul truck daytime rest period air conditioning was reduced by at least 35% for summer weather conditions in Colorado. The National Renewable Energy Laboratory's CoolCalc model was then used to extrapolate the performance of the thermal load reduction technologies nationally for 161 major U.S. cities using typical weather conditions for each location over an entire year.« less

How do Brazilian consumers perceive a non-traditional and innovative fruit juice? An approach looking at the packaging.

PubMed

Romano, Karen R; Rosenthal, Amauri; Deliza, Rosires

2015-08-01

Consumer interest in nutritious and innovative foods encourages the development of products based on raw materials with nutraceutical potential. The health benefits provided by pomegranate have been recognized; therefore, the development of pomegranate juice may match consumer expectations regarding this goal. However, the concept has to first be accepted by the consumer. The aim of the study was to utilize a rating based conjoint analysis to investigate how Brazilian consumers perceive pomegranate juice by identifying the role of packaging attributes relevant to the consumer's intention to purchase. Five factors were considered in the study: technology used in the juice production (high hydrostatic pressure - HHP - a technology that preserves nutritional and sensory properties), antioxidants, price, preservatives, and colorant. Eight hypothetical pomegranate juice packages were created following an incomplete block design and evaluated by 150 fruit juice consumers. Three clusters were identified. The average results revealed that antioxidants were the attribute of greatest relative importance to cluster 1 (RI: 36%), followed by HHP (RI: 25%) and colorants (14%). Consumers in cluster 2 considered price as the most important attribute (RI: 41%), followed by antioxidants (RI: 21%) and HHP (RI: 18%). Cluster 3, as well as cluster 2, considered price the most important attribute (RI: 28%), followed by antioxidants (RI: 26%) and HHP (RI: 22%). The results showed that consumers valued information on the health benefits of antioxidants as well as on the technology, suggesting that both types of information may be relevant tools to increase the intention to purchase the product. The application of HHP for pomegranate juice processing was positively perceived by consumers, suggesting a potential commercial application in the Brazilian industry. Copyright © 2015 Elsevier Ltd. All rights reserved.

Cost-effective treatment solutions for rural areas: design and operation of a new package treatment plant for single households.

PubMed

Daude, D; Stephenson, T

2003-01-01

The design approach and operation of a newly developed package plant treating domestic sewage from single households were evaluated. Combining submerged aerated filter (SAF) technology with jet aeration and incorporating both into a compact and shallow tank resulted in a cost-effective treatment solution. A trial unit was permanently installed at a rural site, serving a single household. Jet aeration proved to be the best aeration method for the shallow bioreactor design. Further trials revealed a 50% reduction in suspended solids (SS) through the use of a static effluent filter and found that annual plant maintenance was vital to sustain stable operating conditions. Despite high variations in influent conditions, the trial unit produced good effluent quality during steady-state operation. Average effluent BOD5, COD and SS values were 19.6 mg l(-1), 98 mg l(-1) and 32 mg l(-1) achieving overall removal efficiencies of 94.2%, 85.9% and 87.6% respectively. However, effluent ammonia nitrogen (NH4-N) levels were found to be inconsistent varying from 9 mg l(-1) to over 60 mg l(-1).

NASA's Advanced Exploration Systems Mars Transit Habitat Refinement Point of Departure Design

NASA Technical Reports Server (NTRS)

Simon, Matthew; Latorella, Kara; Martin, John; Cerro, Jeff; Lepsch, Roger; Jefferies, Sharon; Goodliff, Kandyce; McCleskey, Carey; Smitherman, David; Stromgren, Chel

2017-01-01

This paper describes the recently developed point of departure design for a long duration, reusable Mars Transit Habitat, which was established during a 2016 NASA habitat design refinement activity supporting the definition of NASA's Evolvable Mars Campaign. As part of its development of sustainable human Mars mission concepts achievable in the 2030s, the Evolvable Mars Campaign has identified desired durations and mass/dimensional limits for long duration Mars habitat designs to enable the currently assumed solar electric and chemical transportation architectures. The Advanced Exploration Systems Mars Transit Habitat Refinement Activity brought together habitat subsystem design expertise from across NASA to develop an increased fidelity, consensus design for a transit habitat within these constraints. The resulting design and data (including a mass equipment list) contained in this paper are intended to help teams across the agency and potential commercial, academic, or international partners understand: 1) the current architecture/habitat guidelines and assumptions, 2) performance targets of such a habitat (particularly in mass, volume, and power), 3) the driving technology/capability developments and architectural solutions which are necessary for achieving these targets, and 4) mass reduction opportunities and research/design needs to inform the development of future research and proposals. Data presented includes: an overview of the habitat refinement activity including motivation and process when informative; full documentation of the baseline design guidelines and assumptions; detailed mass and volume breakdowns; a moderately detailed concept of operations; a preliminary interior layout design with rationale; a list of the required capabilities necessary to enable the desired mass; and identification of any worthwhile trades/analyses which could inform future habitat design efforts. As a whole, the data in the paper show that a transit habitat meeting the 43 metric tons launch mass/trans-Mars injection burn limits specified by the Evolvable Mars Campaign is achievable near the desired timeframe with moderate strategic investments including maintainable life support systems, repurposable structures and packaging, and lightweight exercise modalities. It also identifies operational and technological options to reduce this mass to less than 41 metric tons including staging of launch structure/packaging and alternate structural materials.

Cute as candy: a qualitative study of perceptions of snus branding and package design among youth in Norway.

PubMed

Scheffels, Janne; Lund, Ingeborg

2017-04-03

Snus use has increased among youth in Norway in recent years and is now more prevalent than smoking. Concurrently, a range of new products and package designs have been introduced to the market. The aim of this study was to explore how youth perceive snus branding and package design, and the role, if any, of snus packaging on perceptions of appeal and harm of snus among youth. Adolescent tobacco users and non-users (N=35) ages 15-17 years. We conducted interviews among 6 focus groups (each with 4-7 participants). Participants were shown snus packages with a variety of designs and with different product qualities (flavour additives, slim, regular, white and brown sachets) and group discussions focused on how they perceived packages and products. The focus group discussions were semistructured using a standard guide, and analysed thematically. The participants in the focus groups narrated distinct images of snus brands and associated user identities. Package design elements such as shapes, colours, images and fonts were described as guiding these perceptions. Packaging elements and flavour additives were associated with perceptions of product harm. The appeal of flavoured snus products and new types of snus sachets seemed to blend in with these processes, reinforcing positive attitudes and contributing to the creation of particular identities for products and their users. The findings indicate that packaging is vital to consumer's identification with, and differentiation between, snus brands. In view of this, snus branding and packaging can be seen as fulfilling a similar promotional role as advertising messages: generating preferences and appeal. Published by the BMJ Publishing Group Limited. For permission to use (where not already granted under a licence) please go to http://www.bmj.com/company/products-services/rights-and-licensing/.

Parametric Study of Variable Emissivity Radiator Surfaces

NASA Technical Reports Server (NTRS)

Grob, Lisa M.; Swanson, Theodore D.

2000-01-01

The goal of spacecraft thermal design is to accommodate a high function satellite in a low weight and real estate package. The extreme environments that the satellite is exposed during its orbit are handled using passive and active control techniques. Heritage passive heat rejection designs are sized for the hot conditions and augmented for the cold end with heaters. The active heat rejection designs to date are heavy, expensive and/or complex. Incorporating an active radiator into the design that is lighter, cheaper and more simplistic will allow designers to meet the previously stated goal of thermal spacecraft design Varying the radiator's surface properties without changing the radiating area (as with VCHP), or changing the radiators' views (traditional louvers) is the objective of the variable emissivity (vary-e) radiator technologies. A parametric evaluation of the thermal performance of three such technologies is documented in this paper. Comparisons of the Micro-Electromechanical Systems (MEMS), Electrochromics, and Electrophoretics radiators to conventional radiators, both passive and active are quantified herein. With some noted limitations, the vary-e radiator surfaces provide significant advantages over traditional radiators and a promising alternative design technique for future spacecraft thermal systems.

"Plain packaging" regulations for tobacco products: the impact of standardizing the color and design of cigarette packs.

PubMed

Hammond, David

2010-01-01

Tobacco packaging and labeling policies have emerged as prominent and cost-effective tobacco control measures. Although packaging policies have primarily focused on health warnings, there is growing recognition of the importance of packaging as a marketing tool for the tobacco industry. The current paper reviews evidence on the potential impact of standardizing the color and design of tobacco packages -so called "plain" packaging. The evidence indicates three primary benefits of plain packaging: increasing the effectiveness of health warnings, reducing false health beliefs about cigarettes, and reducing brand appeal especially among youth and young adults. Overall, the research to date suggests that "plain" packaging regulations would be an effective tobacco control measure, particularly in jurisdictions with comprehensive restrictions on other forms of marketing.

Selection of human consumables for future space missions

NASA Technical Reports Server (NTRS)

Bourland, C. T.; Smith, M. C.

1991-01-01

Consumables for human spaceflight include oxygen, water, food and food packaging, personal hygiene items, and clothing. This paper deals with the requirements for food and water, and their impact on waste product generation. Just as urbanization of society has been made possible by improved food processing and packaging, manned spaceflight has benefitted from this technology. The downside of this technology is increased food package waste product. Since consumables make up a major portion of the vehicle onboard stowage and generate most of the waste products, selection of consumables is a very critical process. Food and package waste comprise the majority of the trash generated on the current shuttle orbiter missions. Plans for future missions must include accurate assessment of the waste products to be generated, and the methods for processing and disposing of these wastes.

Effect of Packaging on Shelf-life and Lutein Content of Marigold (Tagetes erecta L.) Flowers.

PubMed

Pal, Sayani; Ghosh, Probir Kumar; Bhattacharjee, Paramita

2016-01-01

African marigold (Tagetes erecta L.) flowers are highly valued for their ornamental appeal as well as medicinal properties. However, their short shelf lives cause high post-harvest loss and limit their export potential. The review of patents and research articles revealed that different types of packaging designs/materials have been successfully employed for extension of shelf lives of cut flowers. The current work focuses on designing of different packaging configurations and selection of best configuration for preservation of marigold cut flowers. Ten packaging configurations, composed of four different packaging materials i.e., low density polyethylene (LDPE), polyethylene terephthalate, glassine paper and cellophane paper, were designed. Each pack, consisting of 20 ± 1 g of marigold flowers along with non-packaged control set were stored at 23 ± 2°C, 80% R.H., in an environmental chamber and the flowers were evaluated for their sensory attributes, phytochemical characteristics and physicochemical parameters of senescence to determine their shelf lives. Flowers packed in LDPE bag showed highest shelf life of 8 days with a lead of 4 days compared to control (shelf life - 4 days). This study also established for the first time the phenomenon of carotenogenesis in marigold cut flowers with significantly (P<0.01) higher production of lutein in LDPE packaged flowers. LDPE pack was the best design among the ten package designs, in preserving lutein content of marigold flowers and extending their shelf lives. This economically viable packaging can not only boost the export potential of this ornamental flower, but also allow utilization of nutraceutical potency of lutein.

Inflatable re-entry shield ready for test in space

NASA Astrophysics Data System (ADS)

2000-02-01

The Russian spacecraft Mars'96 for instance, which was launched in November 1996 but failed to reach its nominal orbit, carried two modules designed to land on that planet's surface. For the last part of the mission, an Inflatable Re-Entry and Descent Technology (IRDT) had been deployed. The main components of this system were an aerobraking and thermally protective shell, a densely packed inflating material and a pressurisation system. This technology is now considered applicable to other re-entry scenarios such as payload recovery from the International Space Station, planetary landers for science missions and atmospheric research. A demonstration mission on 9/10 February 2000 will evaluate the performance of this new technology before it is offered to potential users. A Russian Soyuz/Fregat launcher, lifting off from the Kazakh steppe near Baikonur, will provide a low-cost flight opportunity for the test vehicle, which is equipped with the inflatable heat shield and a sensor package developed by DaimlerChrysler Aerospace (DASA). After four orbits around the Earth, the test vehicle will be powered by the launcher's upper stage to re-enter the atmosphere for a landing the next day about 1800 km north-west of the launch site. During the mission, a number of technical parameters such as pressure, temperature and deceleration will be monitored and the inflation of the re-entry/descent structure observed. "From this novel technology, we are expecting a major breakthrough, to make re-entry of small payloads more and more reliable, simpler and less costly than traditional systems", explains Dieter Kassing, ESA's IRDT project manager. One of the main instruments on board the test vehicle is a sensor device developed by the University of Stuttgart for the determination of oxygen partial pressure in low Earth orbit and during re-entry. The scientific/technical investigations will be led by Dr. Ulrich Schoettle (Stuttgart University). Lionel Marraffa (ESA) will lead the evaluation of the IRDT's aerothermodynamic behaviour. DASA was responsible for integration of the sensor package and is ESA's co-investigator for evaluation of the application aspects of this new technology. In addition to the sensor package, the mission will accommodate a collection of special stones to study the physical and chemical modifications in sedimentary rocks, i.e. simulated meteorites, during atmospheric infall. Co-investors of this experiment are Dr. André Brack (CNRS, Orleans) and Dr. Gero Kurat (Vienna University). This experiment is being co-sponsored by ESA. The Russian/European Starsem launch company and NPO Lavochkin, the Russian company that developed the original IRDT technology, will be responsible for launch, orbit control, re-entry and recovery of the sensor package under contract with the International Science & Technology Centre (Moscow). ESA, the European Commission and DASA are co-funding this contract, contributing $600K each.

Construction of an automated fiber pigtailing machine

DOE Office of Scientific and Technical Information (OSTI.GOV)

Strand, O.T.

1996-01-01

At present, the high cost of optoelectronic (OE) devices is caused in part by the labor-intensive processes involved with packaging. Automating the packaging processes should result in a significant cost reduction. One of the most labor-intensive steps is aligning and attaching the fiber to the OE device, the so-called pigtailing process. Therefore, the goal of this 2-year ARPA-funded project is to design and build 3 low-cost machines to perform sub-micron alignments and attachments of single-mode fibers to different OE devices. These Automated Fiber Pigtailing Machines (AFPMS) are intended to be compatible with a manufacturing environment and have a modular designmore » for standardization of parts and machine vision for maximum flexibility. This work is a collaboration among Uniphase Telecommunications Products (formerly United Technologies Photonics, UTP), Ortel, Newport/Klinger, the Massachusetts Institute of Technology Manufacturing Institute (MIT), and Lawrence Livermore National Laboratory (LLNL). UTP and Ortel are the industrial partners for whom two of the AFPMs are being built. MIT and LLNL make up the design and assembly team of the project, while Newport/Klinger is a potential manufacturer of the AFPM and provides guidance to ensure that the design of the AFPM is marketable and compatible with a manufacturing environment. The AFPM for UTP will pigtail LiNbO{sub 3} waveguide devices and the AFPM for Ortel will pigtail photodiodes. Both of these machines will contain proprietary information, so the third AFPM, to reside at LLNL, will pigtail a non-proprietary waveguide device for demonstrations to US industry.« less

21 CFR 801.40 - Form of a unique device identifier.

Code of Federal Regulations, 2014 CFR

2014-04-01

...) Automatic identification and data capture (AIDC) technology. (b) The UDI must include a device identifier... evident upon visual examination of the label or device package, the label or device package must disclose... label and device packages is deemed to meet all requirements of subpart B of this part. The UPC will...

Packaging & Other Structures. Stuff That Works! A Technology Curriculum for the Elementary Grades.

ERIC Educational Resources Information Center

Benenson, Gary

This book explores all kinds of packaging materials including bags, boxes, etc. and how they are used to protect and display products. Contents are divided into six chapters: (1) "Appetizers" includes activities that can be done individually to become familiar with the topic of packaging and structures; (2) "Concepts" provides…

ICEG2D: An Integrated Software Package for Automated Prediction of Flow Fields for Single-Element Airfoils with Ice Accretion

NASA Technical Reports Server (NTRS)

Thompson, David S.; Soni, Bharat K.

2000-01-01

An integrated software package, ICEG2D, was developed to automate computational fluid dynamics (CFD) simulations for single-element airfoils with ice accretion. ICEG2D is designed to automatically perform three primary functions: (1) generating a grid-ready, surface definition based on the geometrical characteristics of the iced airfoil surface, (2) generating a high-quality grid using the generated surface point distribution, and (3) generating the input and restart files needed to run the general purpose CFD solver NPARC. ICEG2D can be executed in batch mode using a script file or in an interactive mode by entering directives from a command line. This report summarizes activities completed in the first year of a three-year research and development program to address issues related to CFD simulations for aircraft components with ice accretion. Specifically, this document describes the technology employed in the software, the installation procedure, and a description of the operation of the software package. Validation of the geometry and grid generation modules of ICEG2D is also discussed.

Sweet cherries from farm to table: A review.

PubMed

Habib, Muzammil; Bhat, Mudassir; Dar, B N; Wani, Ali Abas

2017-05-24

In order to enable long-distance transportation and ensure that the fruit presents the requisite quality on arrival at markets, the cherry industry for direct consumption needs to prolong post-harvest shelf life. Sweet cherries are highly perishable, non-climacteric fruits with shelf life of 7-14 days in cold storage. Their shelf life is shortened by loss of firmness, color and flavor, stem discoloration, desiccation and mould growth. Various factors such as harvest time, proper handling and cooling practices and above all packaging, greatly influence the shelf life of cherries. One of the areas of research that has shown promise, and had success, is modified atmosphere packaging (MAP). It is one of the fastest growing packaging technologies and has many advantages for different food products. Properly designed modified atmosphere packs can be exploited to lower respiration rates and thus ripening of fruits which results in least changes in physiochemical parameters of sweet cherries during postharvest storage. This paper intended to review a broad spectrum of studies dealt with the use of MAP for preservation of sweet cherries cultivars with an interest for future research work.

PINT, A Modern Software Package for Pulsar Timing

NASA Astrophysics Data System (ADS)

Luo, Jing; Ransom, Scott M.; Demorest, Paul; Ray, Paul S.; Stovall, Kevin; Jenet, Fredrick; Ellis, Justin; van Haasteren, Rutger; Bachetti, Matteo; NANOGrav PINT developer team

2018-01-01

Pulsar timing, first developed decades ago, has provided an extremely wide range of knowledge about our universe. It has been responsible for many important discoveries, such as the discovery of the first exoplanet and the orbital period decay of double neutron star systems. Currently pulsar timing is the leading technique for detecting low frequency (about 10^-9 Hertz) gravitational waves (GW) using an array of pulsars as the detectors. To achieve this goal, high precision pulsar timing data, at about nanoseconds level, is required. Most high precision pulsar timing data are analyzed using the widely adopted software TEMPO/TEMPO2. But for a robust and believable GW detection, it is important to have independent software that can cross-check the result. In this poster we present the new generation pulsar timing software PINT. This package will provide a robust system to cross check high-precision timing results, completely independent of TEMPO and TEMPO2. In addition, PINT is designed to be a package that is easy to extend and modify, through use of flexible code architecture and a modern programming language, Python, with modern technology and libraries.

A Wireless, Passive Sensor for Quantifying Packaged Food Quality

PubMed Central

Tan, Ee Lim; Ng, Wen Ni; Shao, Ranyuan; Pereles, Brandon D.; Ong, Keat Ghee

2007-01-01

This paper describes the fabrication of a wireless, passive sensor based on an inductive-capacitive resonant circuit, and its application for in situ monitoring of the quality of dry, packaged food such as cereals, and fried and baked snacks. The sensor is made of a planar inductor and capacitor printed on a paper substrate. To monitor food quality, the sensor is embedded inside the food package by adhering it to the package's inner wall; its response is remotely detected through a coil connected to a sensor reader. As food quality degrades due to increasing humidity inside the package, the paper substrate absorbs water vapor, changing the capacitor's capacitance and the sensor's resonant frequency. Therefore, the taste quality of the packaged food can be indirectly determined by measuring the change in the sensor's resonant frequency. The novelty of this sensor technology is its wireless and passive nature, which allows in situ determination of food quality. In addition, the simple fabrication process and inexpensive sensor material ensure a low sensor cost, thus making this technology economically viable. PMID:28903195

49 CFR 173.415 - Authorized Type A packages.

Code of Federal Regulations, 2014 CFR

2014-10-01

... tests and an engineering evaluation or comparative data showing that the construction methods, packaging design, and materials of construction comply with that specification. After January 1, 2017 each offeror... meets the pertinent design and performance requirements for a DOT 7A Type A specification package. (2...

27 CFR 45.43 - Notice for smokeless tobacco.

Code of Federal Regulations, 2010 CFR

2010-04-01

... for smokeless tobacco. (a) Product designation. Every package of chewing tobacco or snuff shall..., the designation “chewing tobacco” or “snuff.” As an alternative, packages of chewing tobacco may be... package of chewing tobacco or snuff shall, before removal under this part, have adequately imprinted...

1990 MTT-S International Microwave Symposium and Exhibition and Microwave and Millimeter-Wave Monolithic IC Symposium, Dallas, TX, May 7-10, 1990, Proceedings

NASA Astrophysics Data System (ADS)

McQuiddy, David N., Jr.; Sokolov, Vladimir

1990-12-01

The present conference discusses microwave filters, lightwave technology for microwave antennas, planar and quasi-planar guides, mixers and VCOs, cavity filters, discontinuity and coupling effects, control circuits, power dividers and phase shifters, microwave ICs, biological effects and medical applications, CAD and modeling for MMICs, directional couplers, MMIC design trends, microwave packaging and manufacturing, monolithic ICs, and solid-state devices and circuits. Also discussed are microwave and mm-wave superconducting technology, MICs for communication systems, the merging of optical and microwave technologies, microwave power transistors, ferrite devices, network measurements, advanced transmission-line structures, FET devices and circuits, field theory of IC discontinuities, active quasi-optical techniques, phased-array techniques and circuits, nonlinear CAD, sub-mm wave devices, and high power devices.

MathBrowser: Web-Enabled Mathematical Software with Application to the Chemistry Curriculum, v 1.0

NASA Astrophysics Data System (ADS)

Goldsmith, Jack G.

1997-10-01

MathSoft: Cambridge, MA, 1996; free via ftp from www.mathsoft.com. The movement to provide computer-based applications in chemistry has come to focus on three main areas: software aimed at specific applications (drawing, simulation, data analysis, etc.), multimedia applications designed to assist in the presentation of conceptual information, and packages to be used in conjunction with a particular textbook at a specific point in the chemistry curriculum. The result is a situation where no single software package devoted to problem solving can be used across a large segment of the curriculum. Adoption of World Wide Web (WWW) technology by a manufacturer of mathematical software, however, has produced software that provides an attractive means of providing a problem-solving resource to students in courses from freshman through senior level.

HZETRN: A heavy ion/nucleon transport code for space radiations

NASA Technical Reports Server (NTRS)

Wilson, John W.; Chun, Sang Y.; Badavi, Forooz F.; Townsend, Lawrence W.; Lamkin, Stanley L.

1991-01-01

The galactic heavy ion transport code (GCRTRN) and the nucleon transport code (BRYNTRN) are integrated into a code package (HZETRN). The code package is computer efficient and capable of operating in an engineering design environment for manned deep space mission studies. The nuclear data set used by the code is discussed including current limitations. Although the heavy ion nuclear cross sections are assumed constant, the nucleon-nuclear cross sections of BRYNTRN with full energy dependence are used. The relation of the final code to the Boltzmann equation is discussed in the context of simplifying assumptions. Error generation and propagation is discussed, and comparison is made with simplified analytic solutions to test numerical accuracy of the final results. A brief discussion of biological issues and their impact on fundamental developments in shielding technology is given.

Package analysis of 3D-printed piezoresistive strain gauge sensors

NASA Astrophysics Data System (ADS)

Das, Sumit Kumar; Baptist, Joshua R.; Sahasrabuddhe, Ritvij; Lee, Woo H.; Popa, Dan O.

2016-05-01

Poly(3,4-ethyle- nedioxythiophene)-poly(styrenesulfonate) or PEDOT:PSS is a flexible polymer which exhibits piezo-resistive properties when subjected to structural deformation. PEDOT:PSS has a high conductivity and thermal stability which makes it an ideal candidate for use as a pressure sensor. Applications of this technology includes whole body robot skin that can increase the safety and physical collaboration of robots in close proximity to humans. In this paper, we present a finite element model of strain gauge touch sensors which have been 3D-printed onto Kapton and silicone substrates using Electro-Hydro-Dynamic ink-jetting. Simulations of the piezoresistive and structural model for the entire packaged sensor was carried out using COMSOLR , and compared with experimental results for validation. The model will be useful in designing future robot skin with predictable performances.

Network design and quality checks in automatic orientation of close-range photogrammetric blocks.

PubMed

Dall'Asta, Elisa; Thoeni, Klaus; Santise, Marina; Forlani, Gianfranco; Giacomini, Anna; Roncella, Riccardo

2015-04-03

Due to the recent improvements of automatic measurement procedures in photogrammetry, multi-view 3D reconstruction technologies are becoming a favourite survey tool. Rapidly widening structure-from-motion (SfM) software packages offer significantly easier image processing workflows than traditional photogrammetry packages. However, while most orientation and surface reconstruction strategies will almost always succeed in any given task, estimating the quality of the result is, to some extent, still an open issue. An assessment of the precision and reliability of block orientation is necessary and should be included in every processing pipeline. Such a need was clearly felt from the results of close-range photogrammetric surveys of in situ full-scale and laboratory-scale experiments. In order to study the impact of the block control and the camera network design on the block orientation accuracy, a series of Monte Carlo simulations was performed. Two image block configurations were investigated: a single pseudo-normal strip and a circular highly-convergent block. The influence of surveying and data processing choices, such as the number and accuracy of the ground control points, autofocus and camera calibration was investigated. The research highlights the most significant aspects and processes to be taken into account for adequate in situ and laboratory surveys, when modern SfM software packages are used, and evaluates their effect on the quality of the results of the surface reconstruction.

NASA 60 GHz intersatellite communication link definition study. Baseline document

NASA Technical Reports Server (NTRS)

1986-01-01

The overall system and component concepts for a 60 GHz intersatellite communications link system (ICLS) are described. The ICLS was designed to augment the capabilities of the current Tracking and Data Relay Satellite System (TDRSS), providing a data rate capacity large enough to accommodate the expected rates for user satellites (USAT's) in the post-1995 timeframe. The use of 60 GHz for the anticipated successor to TDRSS, the Tracking and Data Acquisition System (TDAS), was selected because of current technology development that will enable multigigibit data rates. Additionally, the attenuation of the earth's atmosphere at 60 GHz means that there is virtually no possibility of terrestrially generated interference (intentional or accidental) or terrestrially based intercept. The ICLS includes the following functional areas: (1) the ICLS payload package on the GEO TDAS satellite that communicates simultaneously with up to five LEO USAT's; (2) the payload package on the USAT that communicates with the TDAS satellite; and (3) the crosslink payload package on the TDAS satellite that communicates with another TDAS satellite. Two methods of data relay on-board the TDAS spacecraft were addressed. One is a complete baseband system (demod and remod) with a bi-directional 2 Gbps data stream; the other is a channelized system wherein some of the channels are baseband and others are merely frequency translated before re-transmission. Descriptions of the TDAS antenna, transmitter, receiver, and mechanical designs are presented.

Transformation of food packaging from passive to innovative via nanotechnology: concepts and critiques.

PubMed

Mlalila, Nichrous; Kadam, Dattatreya M; Swai, Hulda; Hilonga, Askwar

2016-09-01

In recent decades, there is a global advancement in manufacturing industry due to increased applications of nanotechnology. Food industry also has been tremendously changing from passive packaging to innovative packaging, to cope with global trends, technological advancements, and consumer preferences. Active research is taking place in food industry and other scientific fields to develop innovative packages including smart, intelligent and active food packaging for more effective and efficient packaging materials with balanced environmental issues. However, in food industry the features behind smart packaging are narrowly defined to be distinguished from intelligent packaging as in other scientific fields, where smart materials are under critical investigations. This review presents some scientific concepts and features pertaining innovative food packaging. The review opens new research window in innovative food packaging to cover the existing disparities for further precise research and development of food packaging industry.

16 CFR 1700.3 - Establishment of standards for special packaging.

Code of Federal Regulations, 2011 CFR

2011-01-01

... standard; (2) Available scientific, medical, and engineering data concerning special packaging and... such standards, the Commission shall not prescribe specific packaging designs, product content, package... such substance in a package which the Commission determines is unnecessarily attractive to children. (e...